The design and performance of prototype single-sided modules with ABCN-25 front-end chips and 10x10 cm2 Hamamatsu silicon strip sensors is presented. A low mass module assembly has been achieved by gluing a single-sided flex circuit, with read out chips, directly onto the sensor. The design exploits the embedded ...

Developments of Si sensors and associated front-end electronics for use with Hybrid Photon Detectors (HPD) are reviewed. Si pixel sensors, dc-coupled Si pad sensors and ac-coupled Si pad sensors using double-metal technology are employed. Low noise front-end electronics with shaping times in the range, in the range of 100ns to 2/?s is used for the readout. ...

... targets. The surfactants include a peptide nucleic acid (PNA) segment to provide highly specific binding to DNA targets. ...

We present a 16 channel front end prototype implemented in 90nm CMOS IBM process and optimized for 5pF input capacitance. The primary motivation for this project is to study the usefulness of the CMOS technologies below 130nm for front end amplifiers optimized for short strip silicon detectors in Super Large Hadron ...

Future detector systems will face technical difficulties with the supply of electrical power to a multitude of sub-detectors. The Serial Powering (SP) scheme is an elegant solution which leads to a great reduction in cable mass, whilst increasing efficiency and reducing cost. In recent years, substantial developments in SP have been made by the ATLAS Tracker Upgrade Community. Initial demonstrator ...

SS LSemiconductor System Lab Sunyoung Kim 1 Design and Implementation of Energy-Efficient Analog Front-End Circuit for a Sub-1V Digital Hearing Aid Chip Sunyoung Kim June 28, 2005 Semiconductor System Sunyoung Kim 2 Outline � Motivation � Proposed Analog Front-End Circuit � Building Blocks � Preamplifier

. Different type of sensors were indium bump bonded to two different versions of the front end readout chip developed 2 #12; at Fermilab (4). Two sensors of p�stop and p�spray types from CiS were bump bonded to FPIX0 chip, and two from Seiko were bump bonded to FPIX1 chip. Both ...

... front ends are needed to make next generation wireless devices possible ... with an initial coil design that produced maximum Q's of 40 ... Device Lett., vol ...

... for the RoC project is to demonstrate highly integrated mixed signal ICs ... 4 and 5, illustrates a single down conversion configuration operating from X ...

... reoeiving unit of many radar and telecommunication systems and especially in single-chip FMCW radar front-ends. ... a FMCW radar. Frequencies: ...

The goal of this project was to develop a means to separate target DNA oligomers from complex mixtures using a tag-and separate approach that involves the use of surfactants that bind specifically to short sequences of the DNA targets. The surfactants inc...

The FPHX chip is a silicon strip readout chip developed at Fermilab for use in the FVTX Detector of the PHENIX experiment at RHIC. Each front end consists of an integrator which is AC coupled to a shaper, followed by a discriminator and a 3-bit analog-to-digital converter. The backend is a novel architecture in two ...

A dual-band reconfigurable wireless receiver RF front-end is presented, which is based on the direct-conversion principle and consists of a low noise amplifier (LNA) and a down-converter. By utilizing a compact switchable on-chip symmetrical inductor, the RF front-end could be switched between two operation frequency bands without ...

are connected individually to 16 front�end (FE) chips using fine pitch ``bump bonding'' either done with Pb/Sn by IZM 1 or with Indium by AMS 2 . These chips are connected to a module�control chip (MCC) [4] mounted:1% of all 46,080 pixels showing the excellent hybridization yield of the fine pitch bump bonding. ...

We present a scheme to upgrade the CMS HCAL front-end electronics in 2015-16. The HCAL upgrade is required to handle a major luminosity increase of LHC which is expected for 2017. This paper focuses on the requirements for the new electronics and on the proposed solutions. The requirements include increased channel count, additional timing capabilities, and additional ...

A silicon microstrip vertex detector is under construction for the Collider Detector at Fermilab (CDF). The vertex detector, which contains close to 40000 individual strips, will be read out with a full custom VLSI circuit, the SVX chip, developed for this application. This paper describes the integration of this circuit into a full front ...

The recent popularity and convenience of Wireless communication and the need for integration demands the development of Software Defined Radio (SDR). First defined by Mitoal, the SDR processed the entire bandwidth using a high resolution and high speed ADC and remaining operations were done in DSP. The current trend in SDRs is to design highly reconfigurable analog front ...

- Final Results from the APV25 Production Wafer Testing M.Raymonda , R.Bainbridgea , M.Frenchb , G, UK Abstract The APV25 is the front end readout chip for the CMS silicon microstrip tracker. INTRODUCTION The APV25 is a 128 channel chip designed for the CMS silicon microstrip tracker readout. It has

An integrated fully differential ultra-wideband CMOS RF front-end for 6�9 GHz is presented. A resistive feedback low noise amplifier and a gain controllable IQ merged folded quadrature mixer are integrated as the RF front-end. The ESD protected chip is fabricated in a TSMC 0.13 ?m RF CMOS process and achieves a maximum voltage gain ...

The increasing demands for improving magnetic resonance imaging (MRI) quality, especially reducing the imaging time have been driving the channel number of parallel magnetic resonance imaging (Parallel MRI) to increase. When the channel number increases to 64 or even 128, the traditional method of stacking the same number of radio-frequency (RF) receivers with very low level of integration becomes ...

A bipolar chip has been developed to provide the frontend functions of the binary readout architecture used for the silicon strip detectors in the ATLAS Semiconductor Tracker (SCT). This chip consists of 128 channels of low noise amplification and discrimination and provides an interface to a suitable CMOS data processing chip. The ...

Reducing material in silicon trackers is of major importance for a good detector performance overall, and poses a big challenge in the development of the detectors. To match the low material desirable for trackers in High Energy Physics experiments at upgraded luminosities, special techniques have to be developed to address the main sources of material, i.e. mechanical structure and services, and ...

The silicon strip detectors in the ATLAS experiment at LHC will be exposed to very high hadron fluences. In order to study the radiation damage effects ATLAS prototype detectors and small test detectors were irradiated to a fluence of 3�101424GeVprotons/cm2. After irradiation, the detectors were annealed at /25�C to simulate the damage foreseen after 10 years of ATLAS operation. The detectors ...

A continuously tunable gain and bandwidth analog front-end for ambulatory biopotential measurement systems is presented. The front-end circuit is capable of amplifying and conditioning different biosignals. To optimize the power consumption and simplify the system architecture, the front-end only adopts two-stage amplifiers. In addition, careful design eliminates the need for ...

... Accession Number : ADD876922. Title : ENVIRONMENTAL IMPACTS ON THE "FRONT END" OF THE NUCLEAR ENERGY CYCLE. ...

State-of-the-art endoscopy systems require electronics allowing for real-time, bidirectional data transfer. Proposed are 2.4-GHz low-power transceiver analog front-end circuits for bidirectional high data rate wireless telemetry in medical endoscopy applications. The prototype integrates a low-IF receiver analog front-end [low noise amplifier (LNA), double ...

throughout. The APV25 front end chip [2] instruments the AC coupled silicon sensors and the output data from two APV25 chips (figure 2) are combined onto one optical fibre, by the APVMUX chip, at 40 Ms/s. Opto and common-mode subtraction, followed by zero suppression, are performed. APV25 inner ...

The progress of industrial microelectronic technologies has already overtaken the 130 nm CMOS generation that is currently the focus of IC designers for new front-end chips in LHC upgrades and other detector applications. In a broader time span, sub-100 nm CMOS processes may become appealing for the design of very compact front-end ...

This document describes the design of the 2nd iteration of the Analog Front End Board (AFEII), which has the function of receiving charge signals from the Central Fiber Tracker (CFT) and providing digital hit pattern and charge amplitude information from those charge signals. This second iteration is intended to address limitations of the current AFE ...

In this work, we describe the front end ASIC to readout the Photo-Multiplier-Tube of the KM3NeT detector, in detail. Stringent power budgeting, area constraints and lowering cost motivate us to design a custom front-end ASIC for reading the PMT. The ASIC amplifies the PMT signal and discriminates it against a threshold level and ...

A 10 Gb/s OEIC (optoelectronic integrated circuit) optical receiver front-end has been studied and fabricated based on the ?-76 mm GaAs PHEMT process; this is the first time that a limiting amplifier (LA) has been designed and realized using depletion mode PHEMT. An OEIC optical receiver front-end mode composed of an MSM photodiode and a current mode ...

A VLSI circuit has been designed and fabricated for the RADC platinum silicide infrared camera with the objective being to reduce the size of future cameras by implementing a significant amount of the 'front end' electronics on a single integrated circuit...

This paper is distilled from a talk given at the 3rd International Meeting on Front End Electronics in Taos, N.M. on Nov. 7,1997. It is based on experience gained by designing and testing the SVX3 128 channel silicon strip detector readout chip. The SVX3 ...

The goals of the first six months of this project were to begin laying the foundations for both the SiC front-end optical chip fabrication techniques for high pressure gas species sensing as well as the design, assembly, and test of a portable high pressu...

This paper discusses the limits reached so far in the design of monolithic front-end systems and the perspectives opened-up by the research aiming at integrating detector and front-end electronics on the same chip. It considers, as an issue of the greatest importance, the radiation hardening of the front-end electronics, without which the design would be ...

A silicon strip vertex detector was designed, constructed and commissioned at the CDF experiment at the Tevatron collider at Fermilab. The mechanical design of the detector, its cooling and monitoring are presented. The front end electronics employing a custom VLSI chip, the readout electronics and various components of the SVX system ...

Transconductance-C Filter Technique for Very High Frequencies," IEEE Journal of Solid-State Circuits, Vol. SC-27 Gigahertz Band Front-End Filters Yuyu Chang, Jack Wills*, and John Choma, Jr. Department of Electrical-end filter. Simulation results employing 0.5�m CMOS technology have verified that the center frequency

There has been significant growth in the wireless market where new applications are accompanied with strict design goals such as low cost, low power dissipation and small form factor. Large capacity and range for new applications are the driving force for development of new standard such as third generation mobile system (3G). Recent research results show that the development that was not possible ...

, identical to that used for the input device to the APV3 [7], the APV5 [8] and a preamplifier-shaper test structure which was included on each Harris run. The APV3 and APV5 were prototypes of a complete front end with results obtained from the APV chip which does further signal processing after amplification. 2. Transfer

address: CMS CERN, CH-1211 GENEVA 23, Switzerland CMS Note 7th October 2004 Response of the APV readout Ionizing Particles are known to cause sizable dead-time in the front end APV [1] chip of the CMS Silicon response. Various APV settings and supply line resistor values were investigated. Results agree with test

AT BNL the monolithic front-end electronics development effort is an outgrowth of work in discrete and hybrid circuits over the past 30 years. BNL`s area of specialization centers on circuits for precision amplitude measurement, with signal-to-noise ratios of 100:1 and calibration to the same level of precision. Circuits are predominantly classical, continuous-time ...

The design of front end electronic systems for experiments at very high interaction rate colliding beams and fixed target accelerators is discussed. Consideration is given to the preamplifier and shaping amplifier design, and to the optimal choice of technology, with particular emphasis on detectors with source capacitance in the range of 1 - 30 pF and for ...

The FD-SOI technology is a fascinating LSI fabrication process as a possible radiation-tolerant device. In order to confirm benefits of the FD-SOI and expand application ranges in front-end electronics, we experimentally designed an analog front-end ASIC for X-ray CCD readout with the FD-SOI process. The circuit design was submitted to OKI Semiconductor Co., Ltd. via the ...

... AD FRONT END ANALYSIS OF ADVANCED COMBAT FEEDING CONCEPTS By DTIC ... Front End Analysis of Advanced Combat Feeding Concepts ...

The authors propose a processor which provides useful facilities for implementing text editing commands. The processor now being developed is a component of the general front-end editing system which parses the program text and processes the text. This processor attached to a conventional microcomputer system bus executes screen editing functions. Conventional text editing is ...

Medipix3 is a single photon-counting pixel readout chip whose new front-end architecture aims to eliminate the spectral distortion produced by charge diffusion in highly segmented semiconductor detectors. The chip requires area and power-efficient reconfigurable digital counters and shift registers that can be integrated with other ...

A tree harvester for harvesting felled trees includes a wheel mounted wood chipper which moves toward the butt ends of the tree stems to be processed. The harvester includes a plurality of rotating alignment discs in front of the chipper. These discs align the tree stems to be processed with the mouth of the chipper. A chipper infeed cylinder is rotatably mounted between the discs and the ...

A tree harvester for harvesting felled trees includes a wheel mounted wood chipper which moves toward the butt ends of the tree stems to be processed. The harvester includes a plurality of rotating alignment discs in front of the chipper. These discs align the tree stems to be processed with the mouth of the chipper. A chipper infeed cylinder is rotatably mounted between the discs and the ...

A four-channel linear optical link has been developed to enable analogue data transmission in LHC experiments for the analogue front-end chip SCT128A. Signals from a prototype ATLAS SCT module, consisting of 12cm long silicon strip detectors, connected to six 128 channel SCTA chips, have been transmitted at 40MHz using the Mitel 4D469 ...

. It provides a shaped signal proportional to the input charge. The chip houses 18 channels made of a low noise variable-gain charge preamplifier followed by a CRRC2 shaper with a variable shaping time. Each a long shaping time but the RMS noise remains less than 1 mV. 4.2. DAC linearity The linearity of the 18

The Tracker of the CMS silicon strip tracking detector covers a surface of 206 m2. 9648128 channels are available on 75376 APV front-end chips on 15232 modules, built of 24328 silicon sensors. The power supply of the detector modules is split up in 1944 power supplies with two low voltage for front end power and ...

Over a 10 year operating period, the CMS Hadron Calorimeter (HCAL) detector will be exposed to radiation fields of approximately 1 kRad of total ionizing dose (TID) and a neutron fluence of 4E11 n/cm{sup 2}. All front-end electronics must be qualified to survive this radiation environment with no degradation in performance. In addition, digital components in this environment ...

CMOS multichannel front-end electronics suitable for Silicon Photomultiplier detectors has been developed, mainly intended for medical imaging applications. The architecture of the analog channel, DC coupled to the detector, is based on a full current-mode approach, which allows to achieve a wide input dynamic range of about 70 pC while retaining very fast self-triggering ...

The Medipix3 chip is a hybrid pixel detector readout chip working in Single Photon Counting Mode. It has been developed with a new front-end architecture aimed at eliminating the spectral distortion produced by charge diffusion in highly segmented semiconductor detectors. In the new architecture charge deposited in overlapping clusters ...

... Title : Interactive Textiles Front End Analysis. ... Descriptors : *TEXTILES, *TELEMEDICINE, *SMART TECHNOLOGY, COMBAT EFFECTIVENESS. ...

... COST AS AN INDEPENDENT VARIABLE (CAIV): FRONT-END APPROACHES TO ACHIEVE REDUCTION IN TOTAL OWNERSHIP COST ...

The Advanced Orbiting System (AOS) Front End System is being designed at NASA's Goddard Space Flight

... Accession Number : ADD439377. Title : A Composite Automobile Front End Suspension,. Corporate Author : Personal Author ...

... A COMPARISON OF SIGNAL-PROCESSING FRONT ENDS FOR AUTOMATIC SPEECH RECOGNITION CR JANKOWSKI, JR. ...

The ATLAS experiment is preparing for the planned luminosity upgrade of the LHC (the super-luminous LHC or sLHC) with a programme of development for tracking able to withstand an order of greater magnitude radiation fluence and much greater hit occupancy rates than the current detector. This has led to the concept of an all-silicon tracker with an enhanced performance pixel-based inner region and ...

This paper is distilled from a talk given at the 3rd International Meeting on Front End Electronics in Taos, N.M. on Nov. 7,1997. It is based on experience gained by designing and testing the SVX3 128 channel silicon strip detector readout chip. The SVX3 chip organization is shown in Fig. 1. The ...

An ASIC wafer test system has been developed to provide comprehensive production screening of the ATLAS Semiconductor Tracker front-end chip (ABCD3T). The ABCD3T[1] features a 128-channel analog front-end, a digital pipeline, and communication circuitry, clocked at 40 MHz, which is the bunch crossing frequency at the LHC (Large Hadron ...

The APV25 is a 128-channel analogue pipeline chip for the readout of silicon microstrip detectors in the CMS tracker at the LHC. Each channel comprises a low noise amplifier, a 192-cell analogue pipeline and a deconvolution readout circuit. Output data are transmitted on a single differential current output via an analogue multiplexer. The chip is ...

The Channel Control ASIC (CCA) is used along with a custom Charge Integrator and Encoder (QIE) ASIC to digitize signals from the hybrid photo diodes (HPDs) and photomultiplier tubes (PMTs) in the CMS hadron calorimeter. The CCA sits between the QIE and the data acquisition system. All digital signals to and from the QIE pass through the CCA chip. One CCA ...

This paper reports the design trade off study of the design of an innovative CMOS active pixel sensor (CAPS) based on Silicon-on-Insulator (SOI) technology. The CAPS designs approach provides the flexibility and high-density features of hybrid pixel sensors with photon counting architecture. This sensor is the key component for optimized X-ray Tomosynthesis. A proof-ofprinciple test ...

A new front-end for a pixel detector readout chip was designed. A non-standard topology was used to achieve low noise and fast return to zero of the preamplifier to be immune to pile-up of subsequent input signals. This front-end has been implemented on a pixel detector readout chip developed in a commercial 0.25/?m CMOS technology for ...

The instrumentation cost of physics experiments has been reduced per channel, by the use of solid-state detectors, but these cost-effective techniques have not been translated to scintillation-based detectors. When considering photodetectors, the cost per channel is determined by the use of high-voltage, analog-to-digital converters, BNC cables, and any other ancillary devices. The overhead ...

A CMOS wideband front-end IC is demonstrated in this paper. It consists of a low noise transconductance amplifier (LNTA) and a direct RF sampling mixer (DSM) with embedded programmable discrete-time filtering. The LNTA has the features of 0.5-6 GHz wideband, wideband input matching and low noise. The embedded filter following the DSM operates in discrete-time charge domain, ...

Recording and extracting characteristic brain signals in freely moving animals is the basic and significant requirement in the study of brain-computer interface (BCI). To record animal's behaving and extract characteristic brain signals simultaneously could help understand the complex behavior of neural ensembles. Here, a system was established to record and analyse extracellular discharge in ...

445 m2 of wafer material will be used to cover the active tracking volume with 24,328 silicon sensors with a surface of 206 m2. 75,376 APV front-end chips with 9,648,128 electronic channels will be available on 11,920 modules (partially double sided). This unprecedented detector requires attention to logistics, industry involvement, quality assurance ...

The University of Pennsylvania group that was involved in SDC was responsible, jointly with the KEK Laboratory in Japan, for the design and production of the readout electronics for the SDC straw tube tracker (a $12 million electronics effort). Their responsibilities included major contributions to the overall conceptual design, oversight of all the contributions from North America and direct ...

This paper analyzes in detail some theoretical aspects in the modeling of a proposed readout architecture for pixel detectors. The readout architecture is designed for a chip containing about 3000 pixels of 50{micro}m x 400{micro}m. The main objective is to get the maximum pixel hit readout with the minimum probability of hit loss. The readout architecture is modeled as ...

This work presents an FPGA-based readout system for double-sided silicon strip sensors based on the APV25 front-end chip. The system consists of an ADC-card and a digital readout board containing an FPGA. Data extraction algorithms implemented in the FPGA allow baseline and pedestal correction, hit detection and event-building. These algorithms represent ...

The CMS detector at LHC is equipped with a high precision lead tungstate crystal electromagnetic calorimeter (ECAL). The front-end boards and the photodetectors are monitored using a network of DCU (Detector Control Unit) chips located on the detector electronics. The DCU data are accessible through token rings controlled by an XDAQ-based software component. Relevant ...

A prototype of the ME readout electronics onboard the Hard X-ray Modulate Telescope (HXMT) satellite is developed. Application Specific Integrated Chip (ASIC) is used to construct the front end electronics due to a large number of detectors. Field Programmable Gate Array (FPGA) is connected to the ASIC as a state machine controller and ...

We report on progress in our program for developing data acquisition systems for experiments at the SSCL. Using the MODSIM II object-oriented discrete-event simulation language, we are studying the behavior and interaction of various front-end circuits, data-collection chips, data-gathering networks, multilevel triggers, and buffer implementations. Results ...

Light produced in MINERvA scintillator strips is observed with multi-anode photomultipliers and digitized using custom front-end electronics boards designed around the Fermilab TRIP chip. I will describe the methods used to calibrate the electronics and the photomultiplier tubes and comment on the performance. I will also discuss the method that we use to ...

rows. The CiS sensors (one p�stop ST1 and one p�spray ST2) were indium bump bonded to FPIX0 readoutV spectrometer. Sensors bump�bonded to prototype front�end devices were tested in a high energy pion beam chips by Boeing North Amer� ica, Inc. The SII sensors (two p�stop ST1's and one p�spray ST2) were indium

The SPIROC chip is a dedicated very front-end electronics for an ILC (International Linear Collider) prototype of hadronic calorimeter using Silicon photomultiplier (SiPM) or Multi-Pixel Photon Counters (MPPC) readout. This ASIC is due to equip a 10,000-channel demonstrator in 2010. SPIROC is an evolution of FLC-SiPM used for the ILC Analogue HCAL physics ...