The ATLAS experiment is preparing for the planned luminosity upgrade of the LHC (the super-luminous LHC or sLHC) with a programme of development for tracking able to withstand an order of greater magnitude radiation fluence and much greater hit occupancy rates than the current detector. This has led to the concept of an all-silicon tracker with an enhanced performance pixel-based inner region and ...

Future detector systems will face technical difficulties with the supply of electrical power to a multitude of sub-detectors. The Serial Powering (SP) scheme is an elegant solution which leads to a great reduction in cable mass, whilst increasing efficiency and reducing cost. In recent years, substantial developments in SP have been made by the ATLAS Tracker Upgrade Community. Initial demonstrator ...

The design, construction and operation of a 5 layer silicon microstrip detector is described. The detector consisted of silicon microstrip wafers bonded to the RAL Microplex MX2 readout chip. The readout chip provided amplification with double-correlated ...

.barrillon@imperial.ac.uk Abstract The APV25 is the 128 channel CMOS chip developed for readout of the silicon microstrip tracker of the APV25 chips and their excellent performance. I. Introduction The APV25 is the readout chip for the CMS]. A more detailed description of the ...

This paper reports the design and test of an improved direct-injection readout circuit for infrared focal plane arrays (IRFPA). In this circuit, two selectable capacitors are added in the pixel to accommodate the wide range of illumination conditions. The circuit also supports image transposition (invert/revert). A 128�128 pixels readout circuit ...

... of the readout architecture. ... OXIDE SEMICONDUCTORS, *READ OUT TECHNIQUES, CHIPS ... PHOTODETECTORS, REPRINTS, OPTICAL RADAR ...

We report on several irradiation studies performed on BTE-V preFPIX2 pixel readout chip prototypes exposed to a 200 MeV proton beam at the Indiana University Cyclotron Facility. The preFPIX2 pixel readout chip has been implemented in standard 0.25 micron ...

A radiation tolerant pixel readout chip, FPIX2, has been developed at Fermilab for use by BTeV. Some of the requirements of the BTeV pixel readout chip are reviewed and contrasted with requirements for similar devices in LHC experiments. A description of the FPIX2 is given, and results of initial tests of its ...

The paper summarizes the design, the fabrication and test of a chip for the silicon drift detector experiment, part of the A Large Ion Collider Experiment (ALICE) at CERN. The chip performs data reduction via bidimensional compression and packing for the readout chain of the experiment. The chip interfaces with ...

Work was begun in 1990 on the development of an advanced readout chip (ARC) for silicon strip detectors. Features of the proposed device include compatibility with close bunch spacing and double sided detectors, and on chip analog storage, digitization, and data sparsification. Chip have been designed to check all ...

gen� erations of Fermilab pixel readout chips, FPIX0 and FPIX1, (indium bump�bonded to ATLAS sensor chips The FPIX0 readout chips were in� dium bump bonded by Boeing North America Inc. to CiS sensors (one chips were in� dium bump bonded by Advanced In� terconnect ...

The SIS CCD gains have remained near ~1 e-/ADU, just as they were prior to ... Readout Noise (e- RMS) Linear Gain (e- per ADU) Camera Chip0 Chip1 Chip2 ...

In the late 1980's, several versions of a full custom chip called the SVX were built and tested. The chip was designed to be a second generation silicon strip readout chip incorporating new features such as data sparsification for silicon strip detectors....

This paper analyzes in detail some theoretical aspects in the modeling of a proposed readout architecture for pixel detectors. The readout architecture is designed for a chip containing about 3000 pixels of 50{micro}m x 400{micro}m. The main objective is to get the maximum pixel hit readout with the minimum ...

A charge integrating readout chip for silicon strip sensors is currently under development at Paul Sherrer Institut. The goal of the project is to provide a readout system that can sustain, through charge integration and automatic gain switching, the instantaneous many-photon deposition typical of the forthcoming XFEL machines. ...

The MASDA-X chip is designed specifically for reading out large amorphous silicon pixel arrays used in medical imaging research. Instrumenting these arrays requires a set of digital row address- ing chips to sequentially select the pixel rows for readout, and a set of column readout chips to ...

A color sensor based on the wavelength dependent response of reverse-biased photodiodes in silicon has been integrated with bipolar readout circuits. An integrated chroma amplifier has been realized to provide a color output signal determined by the ratio...

High energy and nuclear physics experiments need tracking devices with increasing spatial precision and readout speed in the face of ever-higher track densities and increased radiation environments. The new generation of hybrid pixel detectors (arrays of ...

The plan for the CMS pixel detector is to be upgraded in 2016 to a new one with a significantly reduced material budget. The new pixel system with more layers (4 for the barrel pixel) has to operate through the existing services at double the luminosity. Therefore a new readout scheme is implemented with a new pixel readout chip (ROC). ...

The CMS pixel detector consists of approximately 66 million silicon pixels whose analog signals are read out by 15,840 programmable Readout Chips. With the recent startup of the LHC, the detector is now collecting data used for precise vertexing and track-finding. In preparation for data taking, the detector's Readout ...

A new front-end for a pixel detector readout chip was designed. A non-standard topology was used to achieve low noise and fast return to zero of the preamplifier to be immune to pile-up of subsequent input signals. This front-end has been implemented on a pixel detector readout chip developed in a commercial ...

2 ,100 strips, pitch 80#22;m) and of the APV25 Ampli#12;er- Multiplexer Readout Chip (#24; 1*1cm 2 Silicon Microstrip and APV25 Chip Photomultipliers Incident Compton Beam #12; Silicon Microstrip Chip output connector 34 pin flat cable APV25 Chip Wires connecting the Silicon Microstrip to the ...

The most striking feature of BTeV, a dedicated b physics experiment which is expected to begin running in 2008 in the new CZero interaction region of the Fermilab Tevatron, is that the experiment will use data from a pixel vertex detector to reconstruct tracks and vertices for every beam crossing. The lowest level trigger will be an impact parameter trigger designed to identify events containing ...

In future experiments the readout electronics for pixel detectors is required to be resistant to a very high radiation level. In this paper we report on irradiation tests performed on several preFPIX2 prototype pixel readout chips for the BTeV experiment exposed to a 200 MeV proton beam. The prototype chips have ...

A new silicon strip readout chip called the SVX3 has been designed for the 720,000 channel CDF silicon upgrade at Fermilab. SVX3 incorporates an integrator, analog delay pipeline, ADC, and data sparsification for each of 128 identical channels. Many of the operating parameters are programmable via a serial bit stream, which allows the ...

Results are presented of tests performed on the first pixel detector readout ASIC designed at Fermilab (FPIX0).

Anomaly most likely caused by deficiency of Indium bump interface. Between the detector and readout chip. " Electrical tests have supported this conclusion ...

... Many discussions of confined-atom interferometers proposed a readout by merging the two separated atomic clouds, but it was also shown that the ...

signals received on PIN arrays and data transmitter chips to drive VCSEL arrays. The components Control Chip (MCC). The low voltage differential signal (LVDS) from the MCC is converted by the VCSEL a VCSEL. The optical signal from the VCSEL is transmitted to the Readout Device (ROD) via a fiber. The 40

The BTeV hybrid pixel detector is constructed of readout chips and sensor arrays which are developed separately. The detector is assembled by flip-chip mating of the two parts. This method requires the availability of highly reliable, reasonably low cost ...

The basic unit of the BTeV pixel detector is a multi-chip module which is comprised of a silicon sensor module bump-bonded to a number of readout chips. The pixel module will then be glued to a high intensity interconnect (HDI) cable using electrically co...

We report on several irradiation studies performed on BTeV preFPIX2 pixel readout chip prototypes exposed to a 200 MeV proton beam at the Indiana University Cyclotron Facility. The preFPIX2 pixel readout chip has been implemented in standard 0.25 micron CMOS technology following radiation tolerant design rules. The ...

The FPHX chip is a silicon strip readout chip developed at Fermilab for use in the FVTX Detector of the PHENIX experiment at RHIC. Each front end consists of an integrator which is AC coupled to a shaper, followed by a discriminator and a 3-bit analog-to-digital converter. The backend is a novel architecture in two stages that permits ...

EIGER is an advanced family of single photon counting hybrid pixel detectors, primarily aimed at diffraction experiments at synchrotrons. Optimization of maximal functionality and minimal pixel size (using a 0.25?m process and conserving the radiation tolerant design) has resulted in 75�75?m2 pixels. Every pixel comprises a preamplifier, shaper, discriminator (with a 6 bit DAC for threshold ...

The MIPP TPC is the largest contributor to the MIPP event size by far. Its readout system and electronics were designed in the 1990's and limit it to a readout rate of 60 Hz in simple events and {approx} 20 Hz in complicated events. With the readout chips designed for the ALICE collaboration at the LHC, we ...

. Different type of sensors were indium bump bonded to two different versions of the front end readout chip developed 2 #12; at Fermilab (4). Two sensors of p�stop and p�spray types from CiS were bump bonded to FPIX0 chip, and two from Seiko were bump bonded to FPIX1 chip. Both chips ...

Pixelated amorphous silicon arrays used for detecting X-rays have a number of special requirements for the readout electronics. Because the pixel detector is a high density array, custom integrated circuits are very desirable for reading out the column signals and addressing the rows of pixels to be read out. In practice, separate chips are used for ...

A new CMOS readout circuit for VO2-based uncooled FPAs is presented in this paper. The on-chip readout circuit consists of three major parts: An input circuit of BCDI structure, a column-shared integration circuit of CTIA structure, and a common CDS output circuit. The simple configuration of the input circuit makes it possible to ...

table named APV contains all the parameters of the APV readout chips. A device can be part of a higher has in its final design about 80,000 APV readout chips of which each has about 20 parameters arrive at the order of GBytes. The Tracker is organized in modules. Each module has 2 to 6 APVs, 1 PLL 4

CMS silicon microstrip detectors of different types equipped with the APV readout chips have been exposed to a high intensity 350 MeV/c pion beam. We study the performance of irradiated and non-irradiated silicon sensors as well as the readout chip behavior. Maximum signal to noise for the irradiated oxygenated ...

- Final Results from the APV25 Production Wafer Testing M.Raymonda , R.Bainbridgea , M.Frenchb , G, UK Abstract The APV25 is the front end readout chip for the CMS silicon microstrip tracker. INTRODUCTION The APV25 is a 128 channel chip designed for the CMS silicon microstrip tracker readout. It has

The performance of an SVX silicon microstrip detector and its compatible integrated readout chip have been evaluated in response to Rh K(alpha) x-rays (average energy 20.5 keV). The energy and spatial discrimination capabilities, efficient data management...

wafers after the deposition of under�bump metalization and indium bumps. A number of sensors were for transport and bump bonding. All sensors were bump bonded to PSI30/AC30 readout chips [12] which allow analog substantially after bump�bonding to the readout chips. Although the cause of the increased current is ...

The performance of a readout system for the Synchrotron Radiation Detector (SRD) is studied. The detector is proposed as part of the Alpha Magnetic Spectrometer experiment, an experiment to fly on the International Space Station (ISS) beginning of 2005. The SRD is designed to detect the synchrotron radiation from electrons and positrons (TeV energy range) produced in the ...

First results for the AMS silicon tracker readout performance are presented. Small 20.0�20.0�0.300mm3 silicon microstrip detectors were installed in a 50GeV electron beam at CERN. The detector readout consisted of prototypes of the tracker data reduction card equipped with a 12-bit ADC and the tracker frontend hybrid with VA_hdr ...

This work presents an FPGA-based readout system for double-sided silicon strip sensors based on the APV25 front-end chip. The system consists of an ADC-card and a digital readout board containing an FPGA. Data extraction algorithms implemented in the FPGA allow baseline and pedestal correction, hit detection and event-building. These ...

Two layers of GEMs and the ATLAS Pixel Chip, FEI3, have been combined and tested as a prototype for Time Projection Chamber (TPC) readout at the International Linear Collider (ILC). The double-layer GEM system amplifies charge with gain sufficient to detect all track ionization. The suitability of three gas mixtures for this application was investigated, ...

We have developed a prototype of a fast-scanning CCD readout system to record a 1024 {times} 256 pixel image and transport the image to a recording station within 1 ms of the experimental event. The system is designed to have a dynamic range of greater than 1000 with adequate sensitivity to read single-electron excitations of a CRT phosphor when amplified by a microchannel ...

The Omega-3 readout chip is presented in detail elsewhere in the same proceedings. We here describe the integration of the chip into present and future experiments describing both hardware and software aspects. We cover preliminary tests in the laboratory and on the beam. The WA97 experiment has already used a pixel telescope in the ...

Medipix3 is a 256�256 channel hybrid pixel detector readout chip working in a single photon counting mode with a new inter-pixel architecture, which aims to improve the energy resolution in pixelated detectors by mitigating the effects of charge sharing between channels. Charges are summed in all 2�2 pixel clusters on the chip and ...

A high performance, 128�128 pixel, snapshot Readout Integrated Circuit (ROIC) for IRFPA has been fabricated with 0.5?m Double Poly Double Metal (DPDM) n-well CMOS process. The pixel cell circuit uses an improved direct injection structure with only four transistors to maintain large enough integration capacitror. One pixel cell occupies an area of 50�50?m2. Each row's ...

A new readout system for CsI-coated MWPCs, used in the COMPASS RICH detector, has been proposed and tested in nominal high-rate conditions. It is based on the APV25-S1 analog sampling chip, and will replace the Gassiplex chip readout used up to now. The APV chip, originally designed for silicon ...

A chip has been developed for reading out the silicon strip detectors in the new BTeV colliding beam experiment at Fermilab. The chip has been designed in a 0.25 {micro}m CMOS technology for high radiation tolerance. Numerous programmable features have been added to the chip, such as setup for operation at different beam crossing ...

The Medipix3 ASIC is one of the most advanced chip that is presently available to build photon counting area detectors. The capabilities of the chip include adjacent pixels charge summing circuitry to sort out the distortion due to charge sharing, simultaneous counting and read-out that enables frames to be acquired without dead time, ...

The Medipix3 ASIC is one of the most advanced chip that is presently available to build photon counting area detectors. The capabilities of the chip include adjacent pixels charge summing circuitry to sort out the distortion due to charge sharing, simultaneous counting and read-out that enables frames to be acquired without dead time, ...

The CALET (CALorimetric Electron telescope) experiment on the International Space Station (ISS) is designed to observe cosmic-ray electrons, ? -rays, and heavy nuclei. The CALET detector will comprise an imaging calorimeter (IMC) and a total absorption calorimeter (TASC). The IMC part will be assembled with several ten thousand scintillating fibers (SciFi). In order to read the SciFi's, we have ...

High energy and nuclear physics experiments need tracking devices with increasing spatial precision and readout speed in the face of ever-higher track densities and increased radiation environments. The new generation of hybrid pixel detectors (arrays of silicon diodes bump bonded to arrays of front-end electronic cells) is the state of the art technology able to meet these ...

pitch (MVD-ZEUS ) �Readout: 8 APV chips CalorimeterCalorimeter Fiber Calibration systemFiber Calibration estimation) Successful installation and test with APV chips internal calibrate signals (Imperial College Pitch Adapter APV chip (44 m)�(80 m)� (80 m->44 m)� � Si strip #12;Successful installation in ...

at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data signal (LVDS) from the MCC chip is converted by the VCSEL Driver Chip (VDC) into a single�ended signal appropriate to drive a VCSEL. The optical signal from the VCSEL is transmitted to the Readout Device (ROD) via

A system for reading out silicon strip detectors has been fabricated on a CMOS integrated circuit. The chip consists of an array of 128 amplifiers with a single multiplexed output. These chips have been bonded to a 256 channel silicon strip detector. Results are reported on the electrical parameters of the chips and on data taken ...

-ray telescope. The chip is intended for indium bump bonding to a pixel detector having pitch near 0.5 mm Explorer mission, we are developing a new readout chip intended for indium bump bonding to a CdZnTe pixel above we proceeded with the design of a second prototype chip intended for indium bump bonding to a Cd

This instrumentation proposal is for flip-chip bonding equipment that is essential for bonding the large-format arrays that have been proposed to Si readout integrated circuits (ROICs). At present, no flip-chip bonding equipment is currently available at ...

A chip has been developed for reading out the silicon strip detectors in the new BTeV colliding beam experiment at Fermilab. The chip has been designed in a 0.25 (micro)m CMOS technology for high radiation tolerance. Numerous programmable features have be...

We report on the development of the vertex detector pixel readout chips based on multi-tier vertically integrated electronics for the International Linear Collider. Some testing results of the VIP2a prototype are presented. The chip is the second iteration of the silicon implementation of the prototype, data-pushed concept of the ...

A shift register of N bit length can be configured (for most N) with a single exclusive-OR gate to generate periodically 2^N - 1 different states. As each state is directly related to the number of clock pulses received, such a circuit can be used as a counter. The sequential readout of the bit pattern requires nearly no additional logic and many 'shift counters' can easily be ...

The PHENIX experiment at RHIC at Brookhaven National Laboratory has been providing high quality physics data for over 10 years. The current PHENIX physics program will be significantly enhanced by addition of the Forward Silicon Vertex upgrade detector (FVTX) in the acceptance of existing muon arm detectors. The proposed tracker is planned to be put into operation in 2012. Each arm of the FVTX ...

A system to read-out images from four photon-counting Medipix chips at one Gigabit per second has been constructed in a bilateral collaboration between Nikhef and PANalytical. The system consists of two printed circuit boards. One board supports the four Medipix readout ASICs, flip-chipped to a single pixellized ...

This paper shows the design of a new mixed-mode chip built up of a bidimensional matrix of Monolithic Active Pixel Sensor (MAPS), and of an off-pixel digital readout sparsification circuit. The mixed-mode approach extends the performance of the chip as both the matrix and the readout logic have been developed ...

The authors have developed a SPICE model of silicon microstrip detector and its read-out electronics. The SPICE model of an AC-coupled single-sided polysilicon-biased silicon microstrip detector has been implemented by using a RC network containing up to 19 strips. The main parameters of this model have been determined by direct comparison with DC and AC measurements. The ...

specified in the 0.03-0.25 Hz range, corresponding to two-second ... to 0.25 Hz range. Thus, the readout chip is the dominant focal-plane noise source. ...

The PHENIX experiment at RHIC at Brookhaven National Laboratory has been providing high quality physics data for over 10 years. The current PHENIX physics program will be significantly enhanced by addition of the Forward Silicon Vertex upgrade detector (FVTX) in the acceptance of existing muon arm detectors. The proposed tracker is planned to be put into operation in 2012. Each arm of the FVTX ...

integrated circuit via an interconnection technique such as indium bump bonding or flip-chip solder bump which may allow for use of alternative interconnect technologies to indium bump bonding. Figure 6. a

The Collider Detector at Fermilab is approaching the completion of the Silicon Vertex Detector upgrade for Run II. The Port Card is a Beryllia multichip module developed to control, read out, and regulate power for the silicon strip readout chips. It has ...

Chip layout of a 256x256 infrared sensor readout and preprocessing electronics, implemented in Triquint GaAs MESFET QED/A process (9 mm x 10.5 mm, 12 mW).

The fabrication of GaAs diode arrays for X-ray imaging spectroscopy applications is described. Special attention is paid to the processing of wafers and devices to allow integration with different readout Application Specific Integrated Circuits (ASICs) using flip-chip bump bonding techniques.

At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment.The BTeV pixel detector is based on a design relying on a hybrid approach. With this approach, the readout chip and the sensor array are...

The first prototype (TOPIX) of pixel readout has been designed and tested in a first attempt to develop a custom solution for the pixel detector of the PANDA experiment. A small circuit composed of 32 single pixel readout cells was implemented in a 130 nm CMOS process. Each cell is equipped with a preamplifier and a comparator circuit to measure the Time ...

A silicon microstrip vertex detector is under construction for the Collider Detector at Fermilab (CDF). The vertex detector, which contains close to 40000 individual strips, will be read out with a full custom VLSI circuit, the SVX chip, developed for this application. This paper describes the integration of this circuit into a full front end readout ...

The readout chain of the GEM and the silicon detectors of the COMPASS experiment at CERN is based on the APV25 frontend chip. The system utilizes optical fibers for data transmission and is designed to stand high event rates. Using the Multi readout mode of the APV 25, giving three samples per event, a very good time resolution of the ...

The Medipix3 chip is a hybrid pixel detector readout chip working in Single Photon Counting Mode. It has been developed with a new front-end architecture aimed at eliminating the spectral distortion produced by charge diffusion in highly segmented semiconductor detectors. In the new architecture charge deposited in overlapping clusters ...

A fast charge-to-amplitude converter (QAC) chip has been developed for the readout electronics of the electromagnetic calorimeter (ECAL) of the COMPASS experiment at CERN SPS. It is fabricated using a new advanced complementary bipolar process from Harris Semiconductor with intrinsic radiation hardness. The new QAC chip performs the ...

A fast charge-to-amplitude converter (QAC) chip has been developed for the readout electronics of the electromagnetic calorimeter (ECAL) of the COMPASS experiment at CERN SPS. It is fabricated using a new advanced complementary bipolar process from Harris Semiconductor with intrinsic radiation hardness. The new QAC chip performs the ...

The Silicon Vertex detector (SVX II) for the CDF experiment at the Tevatron p{anti p} collider is a 3-barrel 5-layer device with double-sided, AC-coupled silicon strip detectors. The readout is based on a custom IC, the SVX3 chip, capable of simultaneous acquisition, digitization and readout operation (dead-timeless). In this paper we ...

The CMS pixel detector consists of 15840 readout chips, containing a total of almost 66 million pixels. In this paper, I describe the preparation for the first data-taking with LHC beams, in which the performance of the readout chips was optimized using a suite of calibrations. The detector thresholds have been ...

This work presents the first held at Liverpool University measurements of pixel sensors with n-type readout implant in the p-type bulk before and after irradiation of samples by 24 GeV protons to doses 7�1015 and 1.5�1016 protons/cm2. A comparison is given for two measurement techniques; one based on the FE-I3 readout chip designed ...

The insertable B-Layer upgrade of the ATLAS pixel detector forsees the installation of a fourth pixel layer close to the beam pipe inside the current ATLAS pixel detector. A new readout chip (FE-I4) has been developed to match the increased requirements in terms of radiation hardness and hit occupancy. A new USB-based test system for ATLAS hybrid pixel ...

Hybrid silicon photon-counting detectors are becoming standard equipment for many synchrotron applications. The latest in the Medipix family of read-out chips designed as part of the Medipix Collaboration at CERN is the Medipix3, which while maintaining the same pixel size as its predecessor, offers increased functionality and operating modes. The active ...

Adaptive Gain Integrating Pixel Detector (AGIPD) is currently under development for the European X-ray Free Electron Laser (XFEL). It is a hybrid pixel detector with a specifically developed readout chip bump bonded to a silicon sensor. The chip is being designed in IBM 0.13?m CMOS technology. This paper is focused on the ...

Nowadays, the Medipix2 detector is widely used in many different fields of applications and for some of them the size of the system becomes the critical issue. Therefore we manufactured the miniaturized version of currently used USB interface accommodating the Medipix2 chip on the same printed circuit board as the readout electronics. The dimensions of the ...

Particle pixel detectors in standard high-voltage CMOS technology are a new detector family that allows implementation of low-cost radiation-tolerant detectors with good time resolution. In order to test the concept we have implemented three detector variants. The first variant uses simple four-transistor pixel electronics that allows the rolling-shutter readout. The second ...

We propose a novel CMOS readout structure without sample and hold (SH) circuit for uncooled microbolometers. In this readout circuit, all the pixels in one row can be integrated simultaneously, and the readout integrated circuit (ROIC) area can be reduced by as much as 30%. Moreover, a single capacitor implementation of both capacitive ...

A readout integrated circuit (ROIC) for uncooled microcantilever infrared focal plane arrays (IRFPAs) based on capacitive readout is proposed. The ROIC is optimized according to noise modeling and analysis to reduce noise. An experimental chip of 16�16 FPAs readout circuit has been designed and fabricated using ...

The development of Hybrid CMOS Detectors (HCDs) for X-Ray telescope focal planes will place them in contention with CCDs on future satellite missions due to their faster frame rates, flexible readout scenarios, lower power consumption, and inherent radiation hardness. CCDs have been used with great success on the current generation of X-Ray telescopes (e.g. Chandra, XMM, ...

The development of Hybrid CMOS Detectors (HCDs) for X-Ray telescope focal planes will place them in con- tention with CCDs on future satellite missions due to their faster frame rates, flexible readout scenarios, lower power consumption, and inherent radiation hardness. CCDs have been used with great success on the current generation of X-Ray telescopes (e.g. Chandra, XMM, ...

The development of Hybrid CMOS Detectors (HCDs) for X-Ray telescope focal planes will place them in contention with CCDs on future satellite missions due to their faster frame rates, flexible readout scenarios, lower power consumption, and inherent radiation hardness. CCDs have been used with great success on the current generation of X-Ray telescopes (e.g. Chandra, XMM, ...

In September 2008 the SLIM5 collaboration submitted a low material budget silicon demonstrator to test with 12 GeV/c protons, at the PS-T9 test-beam at CERN. Two different detectors were placed as DUTs inside a high-resolution and fast-readout beam telescope. The first DUT was a high resistivity double sided silicon detector, with short strips (�striplets�) and with ...

We have created high-resolution x-ray imaging devices using polycrystalline mercuric iodide (HgI₂) films grown directly onto CMOS readout chips using a thermal vapor transport process. Images from prototype 400�400 pixel HgI₂-coated CMOS readout chips are presented, ...

Cooled, slow-scan CCD cameras are the systems of choice when there is a requirement for systems to work at the lowest light levels or with the most extreme dynamic range. Systems are available now with as much as 20-bit dynamic range and intelligent read-out (multiple sub- arrays, on chip binning, on board processing power). The principal draw-back in such ...

The grating digital readout is the key measurement feedback device of the numerical control system and base of the equipment manufacturing industry. With the development of the complex machining, the multi-axis linkage is a new direction of the numerical control system, which needs the multidimensional measurement. Based on all digital grating moir� fringe subdivision ...

The Compact Muon Solenoid (CMS) experiment is one of four large high energy physics experiments presently being constructed for operation at the Large Hadron Collider (LHC) facility at CERN, Geneva. The motivation for the LHC and its experiments is the large range of new physics expected at the TeV energy scale. The CMS Silicon Strip Tracker (SST) will play a major role in all physics searches, ...

In September 2008 the Slim5 [1] collaboration submitted a low material budget silicon demonstrator to test with 12 GeV/c protons, at the PS-T9 test-beam at CERN. Inside the reference telescope, two different detectors were placed as device under test (DUT). The first was a 4k-Pixel Matrix of Deep N Well MAPS, developed in a 130 nm CMOS Technology, providing digital sparsified ...

The performance of an SVX silicon microstrip detector and its compatible integrated readout chip have been evaluated in response to Rh K{alpha} x-rays (average energy 20.5 keV). The energy and spatial discrimination capabilities, efficient data management and fast readout rates make it an attractive alternative to the CCD and PDA ...

The industrial production of monolithic GridPix pixel chips for the digital readout of primary electrons in a TPC is under study at IZM-Fraunhofer, Berlin. With future low-cost chips, new applications are foreseen in TPCs for bi-phase Ar/Xe dark matter experiments, and for v-less double beta decay experiments.

Extensive tests of the D-Zero silicon vertex detectors and the final version of the SVX-II chip and readout electronics were performed at a test beam facility equipped with a 2 Tesla magnet at FNAL. Preliminary results are reported on the performance of the SVX-II chip, charge collection properties, signal to noise ratio, cluster pulse ...

The invention of Micromegas and GEMs has made possible the development of a new generation of gaseous proportional detectors. By using a pixel chip as active (anode) readout, Time Projection Chambers become available where all information of the ionization can be read out. With the MEMS technology, developed for the integration of Micromegas and the pixel ...

") consists of #12;ve readout chips bump bonded to a p-in-n sensor of 200 #22;m thickness. Each chip contains 8192 is shown in #12;gure 3. A higher multiplicity region was also investi- gated using a 158 A GeV/c Indium ion

Although the first Multi-pixel Hybrid Photodiode (M-HPD) was developed in the early 1990s by Delft Electronic Products, the main obstacle to its application has been the lack of availability of a compact read-out system. A fast, parallel readout system has been constructed for use with the earlier 25-pixel tube with High-energy Physics applications in ...

A radiation-hard pixel readout chip, FPIX2, is being developed at Fermilab for the recently approved BTeV experiment. Although designed for BTeV, this chip should also be appropriate for use by CDF and DZero. A short review of this development effort is presented. Particular attention is given to the circuit redesign which was made ...

The APV25 is a 128-channel analogue pipeline chip for the readout of silicon microstrip detectors in the CMS tracker at the LHC. Each channel comprises a low noise amplifier, a 192-cell analogue pipeline and a deconvolution readout circuit. Output data are transmitted on a single differential current output via an analogue multiplexer. ...

This paper reports the design trade off study of the design of an innovative CMOS active pixel sensor (CAPS) based on Silicon-on-Insulator (SOI) technology. The CAPS designs approach provides the flexibility and high-density features of hybrid pixel sensors with photon counting architecture. This sensor is the key component for optimized X-ray Tomosynthesis. A proof-ofprinciple test ...

A fast readout system for the upgrade of the COMPASS RICH detector has been developed and successfully used for data taking in 2006 and 2007. The new readout system for the multi-anode PMTs in the central part of the photon detector of the RICH is based on the high-sensitivity MAD4 preamplifier-discriminator and the dead-time free F1-TDC ...

A high-precision Time-to-Digital-Converter VLSI, TMC-PHX1, was developed for the PHENIX drift chamber. The chip contains 4 channels of TDC with two stages of data buffering and one level of trigger buffering required in very high rate experiments. In addition to a fixed data size readout, the chip also supports a zero-suppression mode ...

We have developed a prototype of a fast-scanning CCD readout system to record a 1024 {times} 256 pixel image and transport the image to a recording station within 1 ms of the experimental event. The system is designed to have a dynamic range of greater than 1000 with adequate sensitivity to read single-electron excitations of a CRT phosphor when amplified by a microchannel ...

Advances in the field of semiconductor technologies in the last years make possible to develop new types of ionizing radiation detectors. The Medipix2 readout ASIC is an example of such a device. It is the hybrid single photon counting imaging chip (sensor and readout chips are fabricated separately). With an ...

The ASIC is widely used in the field of high energy physics. Astroparticle experiments benefit from high integration, small size and low power consumption. In this paper an analog chip named ARCHGARD (Analog Readout Chip for High energy Gamma Ray Detector) for high energy physics experiment is introduced. ARCHGARD is a ...

throughout. The APV25 front end chip [2] instruments the AC coupled silicon sensors and the output data from two APV25 chips (figure 2) are combined onto one optical fibre, by the APVMUX chip, at 40 Ms/s. Opto and common-mode subtraction, followed by zero suppression, are performed. APV25 inner barrel sensor 12 96 CMS

Use of a pulsed CO/sub 2/ laser to heat the surface of hot-pressed LiF chips has been investigated. The thermoluminescent traps in the first 10 to 20 ..mu..m of depth may be read out with good efficiency, which will allow entrance dose and exit dose to be determined using a standard chip. These dose data can be used to calculate beta dose and gamma dose ...

Hybrid pixel-detectors for the detection of elementary particles without bump-interconnections will be presented. The signals, generated in the sensor chip, are transmitted using capacitive coupling to the readout chip. In order to ease the capacitive signal transmission, an active pixel sensor has been used. The sensor ...

Dense, massively parallel signal processing electronics are co-packaged behind associated sensor pixels. Microchips containing a linear or bilinear arrangement of photo-sensors, together with associated complex electronics, are integrated into a simple 3-D structure (a "mirror cube"). An array of photo-sensitive cells are disposed on a stacked CMOS chip's surface at a ...

Much of the cost of manufacturing pixel detectors is due to bumping and flip chip assembly of the readout chips onto sensor tiles, even if it is done on wafer level. To address this issue, Fraunhofer IZM investigated two new technological approaches, namely screen printing using dry film resist and chip-to-wafer ...

A new feedback readout circuit of microbolometers for sensing radiant power is proposed in this paper. Due to excellent thermal characteristics of microstructure on infrared application recently, the readout circuits of the microsensors would not concern the responsivity only, but should also take offset voltage cancellation, digitalization, and ...

A pixel readout chip for imaging applications has been designed and tested. It consists of an array of 12 � 63 pixels with an active pixel cell area of 50 ?m � 350 ?m. Every pixel contains a low-noise charge sensitive amplifier, a CMOS comparator including individually adjustable thresholds, and a 15 bit counter realized using a linear feedback shift ...

A 2D photon-counting X-ray detector system with 1.4 kHz frame rate and 55 ?m spatial resolution has been developed and commissionned on ESRF beamlines. The system called MAXIPIX (Multichip Area X-ray detector based on a photon-counting PIXel array) consists of a detector module implementing up to five MEDIPIX-2 or TIMEPIX photon-counting readout chips, a ...

A direct readout infrared detector array, a candidate for the Space Infrared Telescope Facility (SIRTF) Infrared Array Camera (IRAC), has been tested. The array has a detector surface of gallium doped silicon, bump bonded to a 58x62 pixel MOSFET multiplexer on a separate chip. Although this chip and system do not meet all the SIRTF ...

At the Juelich Cooler Synchrotron, COSY, the magnetic spectrometer ANKE (Apparatus for Studies of Nucleon and Kaon Ejectils) is installed. Reaction products emitted by an internal target in the forward direction are measured. About 11,000 channels are read out. This requirement justified the design of a VLSI based readout system. For this, an analog chip ...

Spectroscopic and timing response studies have been conducted on a detector module consisting of a silicon Pixel Array Detector bonded on two VATAGP7 read-out chips manufactured by Gamma-Medica Ideas using laboratory gamma sources and the internal calibration facilities (the calibration system of the read-out ...

AKPiX is a prototype front-end readout chip designed for the Silicon Detector Design Concept for the International Linear Collider (ILC). It is targeted at readout of the outer tracker and the silicon-tungsten calorimeter and is under consideration for the hadronic calorimeter and muon systems. This chip takes ...

At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit ...

The paper reviews the performance of the three ASICs : HARDROC2, SPIROC2 and SKIROC2 developed to readout the ILC calorimeter prototypes. The chips integrate 36 to 64 channels of front-end, digitization and backend electronics in SiGe 0.35 ?m technology. This second version was found mature enough to be produced in several hundreds to equip large scale ...

A prototype of the ME readout electronics onboard the Hard X-ray Modulate Telescope (HXMT) satellite is developed. Application Specific Integrated Chip (ASIC) is used to construct the front end electronics due to a large number of detectors. Field Programmable Gate Array (FPGA) is connected to the ASIC as a state machine controller and data FIFO in the DAQ ...

At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit ...

states and the different count rates for the two atomic states. The hyperfine life- time is limitedCavity-Based Single Atom Preparation and High-Fidelity Hyperfine State Readout Roger Gehr, Ju Rb atom coupled to a fiber-based high-finesse cavity on an atom chip. The atom is extracted from

A triple-GEM setup is successfully operated together with a digital readout chip with a pixel size of 55�55?m(MediPix2 ASIC). A pad structure surrounding the MediPix2 is used to trigger on 106Ru electrons crossing to the drift volume. The gases used are ArCO2 and HeCO2 (70/30). The detected cluster density is about 5.8cm. The evaluation of the tracks by ...

Dispersive readouts for superconducting qubits have the advantage of speed and minimal invasiveness. We have developed such an amplifier, the cavity bifurcation amplifier (CBA), and applied it to the readout of the quantronium qubit. It consists of a Josephson junction embedded in a microwave on-chip resonator. In contrast with the ...

320x240 pixels GaAs Schottky barrier detector arrays were fabricated, hybridized to silicon readout circuits, and subsequently evaluated. The detector chip was based on semi-insulating LEC GaAs material. The square shaped pixel detector elements were of the Schottky barrier type and had a pitch of 38 mu m. The GaAs wafers were thinned down prior to the ...

A sampling hadronic calorimeter with gaps instrumented with thin MICROMEGAS chambers of small pad size and single bit readout is a candidate for an experiment at a future linear collider. Several MICROMEGAS chambers with 1 cm2 anode pads were fabricated using the Bulk technology. Some prototypes equipped with analog readout GASSIPLEX ...

A kilohertz frame rate readout system for Medipix2 chips is being developed at European Synchrotron Radiation Facility (ESRF). This work was initiated with the aim of meeting the growing demand for fast and noise-free X-ray bidimensional detection particularly on synchrotron beamlines. Medipix2 is a photon-counting readout ASIC of ...

We present in this paper the results of laboratory tests on the detector system for PYRAMIR, the infrared wavefront sensor for ALFA, the Adaptive Optics system at Calar Alto Observatory. PYRAMIR will use, at least in a first phase, a Hawaii-I detector, with 4 512x512 pixels2 quadrants which are read-out in parallel on 4 independent output channels. Since wavefront sensing in ...

This paper analyzes in detail some theoretical aspects in the modeling of a readout architecture for pixel detectors. In fact, these problems are common to the design of data acquisition systems and other processes containing buffers and where the input and output signals can be expressed by probability density functions. It is the purpose of this paper to point out that the ...

Micromachine accelerometers offer a way to enable critical functions only when a system encounters a particular acceleration environment. This paper describes the optical readout of a surface micromachine accelerometer containing a unique 24-bit code. The readout uses waveguide-based optics, which are implemented as a photonic integrated circuit (PIC). The ...

Photodetector readout for next generation high event rate particle identification and single-photon detection requires a digitizer capable of integrated recording of dense arrays of sensor elements with high analog bandwidth (precision timing) and large record depth, in a cost-effective, compact and low-power way. Simply stated, one cannot do better than having a high-fidelity ...

We report the first successful integration of magnetostrictive Metglas2605S2 (Fesb{78}Sisb9Bsb{13}) thin film sensor system on silicon with high resolution capacitive readout. A deposition process for Metglas thin film has been developed to allow easy control of thin film composition. An amorphous microstructure has been achieved over a wide temperature range, and in-situ ...

A crucial detector of the NA62 experiment is the beam spectrometer named Gigatracker. It consists of three stations of hybrid silicon pixels sensors with 150 ps (rms) of time resolution and 100 ?m (rms) of space resolution. In addition the system operates under a high radiation environment and a high density of particles (up to 1.5 MHz/mm2 in the centre and 0.8 - 1 GHz in total). To meet these ...

Permanent breast seed implant (PBSI) brachytherapy technique was recently introduced as an alternative to high dose rate (HDR) brachytherapy and involves the permanent implantation of radioactive 103Palladium seeds into the surgical cavity of the breast for cancer treatment. To enable accurate seed implantation, this research introduces a gamma camera based on a hybrid amorphous selenium detector ...

The ongoing program to develop a custom hybrid pixel detector for the innermost layers of the tracking system of the PANDA experiment foresees thinned epitaxial silicon sensors and pixel readout electronics based on 130 nm CMOS technology. The displacement damage test with neutron from the nuclear reactor has been performed on some test structures, characterized by high ...

A direct detection X-ray imager is presented. It uses polycrystalline cadmium telluride (CdTe) grown by close space sublimation technique for the X-ray photoconductor. A 15 mm�15 mm CdTe layer is connected to a 200�200 pixel readout CMOS by indium bumping. X-ray performance at 16 frames/s rate is measured. In particular a readout noise of 0.5 X-ray, an ...

A large monolithic particle pixel-detector implemented as system on a chip in a high-voltage 0.35?m CMOS technology will be presented. The detector uses high-voltage n-well/p-substrate diodes as pixel-sensors. The diodes can be reversely biased with more than 60 V. In this way, depleted zones of about 10?m thickness are formed, where the signal charges can be collected by ...

A single Photon Counting pixel detector readout Chip (PCC) has been derived from previous work in the CERN RD19 collaboration for particle physics tracking devices, recently developed for high energy physics experiments. The readout chip is a 64 x 64 matrix of identical 170 {micro}m x 170 {micro}m cells. It is to ...

A radiation-resistant readout integrated circuit for focal plane arrays was studied to improve the reliability of infrared image systems operating in a radioactive environment, such as in space or in the surroundings of a nuclear reactor. First, as radiation-hardened NMOSFET structure, which includes a layout modification technique, was proposed. The ...

Resistive Plate Chambers for Hadronic Particle-Flow calorimetry will have a large number of pixels. We present tests of a system for readout with parallel vertical shift registers, somewhat like that used in CCD imaging. In our case we discriminate on the signal immediately after amplification and shaping, and only shift single bits. We discuss the issues involved in a ...

Electrophysiology (i.e. patch clamping) remains the gold standard for pharmacological testing of putative ion channel active drugs (ICADs), but suffers from low throughput. A new ion channel screening technology based on microfabricated glass chip devices will be presented. The glass chips contain very fine apertures, which are used for whole-cell voltage ...

The Cosmic Hot Interstellar Plasma Spectrometer (CHIPS) utilizes a typical microchannel plate detector with a cross delay line event readout anode. A CHIPS delay line was predicted to approach a time delay of 80 ns. Therefore an added time delay of 100 ns was required for the stop channels. Implementation of such a delay using ...

A new full custom chip is being designed using the Orbit 2 micron ``BiCMOS`` process to provide a wide range fast digital readout of Photomultiplier Tubes. The goal is to obtain a digitized PMT signal with a 18--20 bit dynamic range and 8 bits of accuracy in a floating point number format every 16 ns. The chip is DC coupled to a PMT ...

A new full custom chip is being designed using the Orbit 2 micron BiCMOS'' process to provide a wide range fast digital readout of Photomultiplier Tubes. The goal is to obtain a digitized PMT signal with a 18--20 bit dynamic range and 8 bits of accuracy in a floating point number format every 16 ns. The chip is DC ...

Pixellated radiation detectors with single photon processing can be used for spectral X-ray imaging. A problem using such detectors with small pixels is that the spectral information is distorted by charge sharing. In order to get images with good spectral resolution a number of silicon sensors with a pixel size of 220 ?m were fabricated and bonded to a MEDIPIX2 readout ...

The increasing use of micromechanical cantilevers in sensing applications causes a need for reliable readout techniques of micromechanical cantilever sensor (MCS) bending. Current optical beam deflection techniques suffer from drawbacks such as artifacts due to changes in the refraction index upon exchange of media. Here, an adaptation of the Fabry-Perot interferometer is ...

The increasing use of micromechanical cantilevers in sensing applications causes a need for reliable readout techniques of micromechanical cantilever sensor (MCS) bending. Current optical beam deflection techniques suffer from drawbacks such as artifacts due to changes in the refraction index upon exchange of media. Here, an adaptation of the Fabry-Perot interferometer is ...

This paper reports on the current status of the development of International Linear Collider vertex detector pixel readout chips based on multi-tier vertically integrated electronics. Initial testing results of the VIP2a prototype are presented. The chip is the second embodiment of the prototype data-pushed readout ...

An NMOS device has been developed which provides high speed analog signal storage and readout for time expansion of transient signals. This device takes advantage of HMOS-1 VLSI technology to implement an array of 256 storage cells. Sequential samples of an input waveform can be taken every 5 ns while providing an effective sampling aperture time of less than 1 ns. The design ...

A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50?m above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With ...

Increasing luminosity in high energy physics experiments leads to new challenges in the design of data acquisition systems for pixel detectors. With the upgrade of the LHCb experiment, the data processing will be changed; hit data from every collision will be transported off the pixel chip, without any trigger selection. A read-out architecture is proposed ...

A double-sided silicon microstrip detector read out by a CMOS low noise self-triggering 128-channel chip has successfully been tested with low energy ?- and X-rays and ?-emitting sources for imaging of simple patterns. The readout chip is described in detail, as well as the detector, the ancillary electronics and the data acquisition. ...

A bipolar chip has been developed to provide the frontend functions of the binary readout architecture used for the silicon strip detectors in the ATLAS Semiconductor Tracker (SCT). This chip consists of 128 channels of low noise amplification and discrimination and provides an interface to a suitable CMOS data processing ...

A test stand for the next generation of the Silicon Vertex Detector (SVX-II) of the Collider Detector Facility (CDF) at Fermilab has been developed. It is capable of performing cosmic ray, beam, and laser pulsing tests on silicon strip detectors using the new generation of SVX chips. The test stand is composed of a SGI workstation, a VME CPU, the Silicon Test Acquisition and ...

We describe the development of a stressed Ge:Ga array detector with a large pixel format but a compact mechanical structure. The detector will be deployed in IRIS, a Japanese satellite to be launched in 2004, which will conduct an all-sky, far-infrared survey as well as spectroscopic observations of specific objects. The array has a 5 � 15 pixel format. Three of the five rows are for the 100 - ...

With the development of the infrared focal plane detectors, the internal noises in the infrared focal plane arrays (IRFPAs) CMOS readout integrated circuit gradually became an important factor of the development of the IRFPAs. The internal noises in IRFPAs CMOS readout integrated circuit are researched in this work. Part of the motivation for this work is ...

An associative memory full-custom VLSI chip for pattern recognition has been designed and tested in the past years. It's the AMchip, that contains 128 patterns of 60 bits each. To expand the pattern capacity of an Associative Memory bank, the custom VLSI GLUEchip has been developed. The GLUEchip allows the interconnection of up to 16 AMchips or up to 16 GLUEchips: the ...

At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The BTeV pixel detector is based on a design relying on a hybrid approach. With this approach, the readout chip and the sensor array are developed separately and the detector is constructed by flip-chip mating the two ...

Medipix3 is a single photon-counting pixel readout chip whose new front-end architecture aims to eliminate the spectral distortion produced by charge diffusion in highly segmented semiconductor detectors. The chip requires area and power-efficient reconfigurable digital counters and shift registers that can be integrated with other ...

The SVX data acquisition system includes three components: a Fastbus Sequencer, an SVX Rabbit Crate Controller and a Digitizer. These modules are integrated into the CDF DAQ system and operate the readout chips. The results of the extensive functional tests of the SVX modules are reported. We discuss the stability of the Sequencers, systematic differences ...

An Integrated Circuit (IC) readout chip with four channels arranged so as to receive input charge from the corners of the chip was designed for use with 5- to 7-mm pixel detectors. This Application Specific IC (ASIC) can be used for cold neutron imaging, for study of structural order in materials using cold neutron scattering or for ...

. It provides a shaped signal proportional to the input charge. The chip houses 18 channels made of a low noise variable-gain charge preamplifier followed by a CRRC2 shaper with a variable shaping time. Each a long shaping time but the RMS noise remains less than 1 mV. 4.2. DAC linearity The linearity of the 18

The presented R&D activity is focused on the development of a new pixel module concept for the foreseen upgrades of the ATLAS detector towards the Super LHC employing thin n-in-p silicon sensors together with a novel vertical integration technology. A first set of pixel sensors with active thicknesses of 75 ?m and 150 ?m has been produced using a thinning technique developed at the ...

DNA analytics is a growing field based on the increasing knowledge about the genome with special implications for the understanding of molecular bases for diseases. Driven by the need for cost-effective and high-throughput methods for molecular detection, DNA chips are an interesting alternative to more traditional analytical methods in this field. The standard ...

Today, the main challenge of Positron Emission Tomography (PET) systems dedicated to small animal imaging is to obtain high detection efficiency and a highly accurate localization of radioisotopes. If we focus only on the PET characteristics such as the spatial resolution, its accuracy depends on the design of detector and on the electronics readout system as well. In this ...