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Sample records for ag-cu alloy fillers

  1. Solubility and Dissolution Rate of Ni Base Alloy to Molten Ag-Cu-Pd Brazing Filler

    NASA Astrophysics Data System (ADS)

    Ikeshoji, Toshi-Taka; Watanabe, Yuki; Suzumura, Akio; Yamazaki, Takahisa

    During the brazing process of the rocket engine’s nozzle skirt assembly made from Fe-Ni based super alloy pipes with Pd based brazing filler, the erosion corrosion pits were sometimes engraved on those pipes’ surface. The corrosion is considered to be assisted by the dynamic flow of the molten brazing filler. In order to estimate the amount of erosion corrosion and to prevent it, the solubility and the dissolution rate of Ni to the molten Ag-Cu-Pd brazing filler are measured experimentally. The Ni crucible poured with the Ag-Cu-Pd brazing filler was heated up to 1320K and quenched after the various keeping time. The microstructure of the solidified brazing filler part’s cross sections was observed, and the amount of the dissolved Ni was estimated using the image processing technique. The solubility was about 5.53mass%and the initial dissolution rate was 6.28 × 10-3mass%/s. Using these data, more elaborate dynamic flow simulation will be able to conduct.

  2. Phase Evolution in the Pd-Ag-CuO Air Braze Filler Metal Alloy System

    SciTech Connect

    Darsell, Jens T.; Weil, K. Scott

    2006-08-01

    Palladium was added as a ternary component to a series of copper oxide-silver alloys in an effort to increase the use temperature of these materials for potential ceramic air brazing applications. Phase equilibria in the ternary Pd-Ag-CuO system were investigated via differential scanning calorimetry (DSC) and a series of quenching experiments. Presented here are the latest findings on this system and a construction of the corresponding ternary phase diagram for low-to-moderate additions of palladium. The analysis included samples with higher palladium additions than were studied in the past, as well as an analysis of the composition-temperature trends in the Ag-CuO miscibility gap with palladium addition. It was found that the addition of palladium increases the solidus and liquidus and caused three phase zones to appear as expected by the phase rule. Furthermore, the palladium additions cause the miscibility gap boundary extending from the former binary eutectic to shift to lower silver-to-copper ratios.

  3. Corrosion of Ti-STS dissimilar joints brazed by a Ag interlayer and Ag-Cu-(Pd) alloy fillers

    NASA Astrophysics Data System (ADS)

    Lee, M. K.; Park, J. J.; Lee, G. J.; Lee, J. G.; Kim, D. W.; Lim, C. H.; Rhee, C. K.; Lee, Y. B.; Lee, J. K.; Hong, S. J.

    2011-02-01

    Corrosion behavior of dissimilar brazed joints between titanium Gr. 2 (Ti) and S31254 stainless steel (STS) was investigated. For the study, a Ag interlayer and two Ag-base eutectic alloys, 72Ag-28Cu and 66.2Ag-25.8Cu-8Pd (wt.%), were introduced as a diffusion control layer and fillers, respectively, between the base materials. The joints commonly had a layered structure of Ti(base)/TiAg/Ag solid solution/STS(base), but the one brazed by the Ag-Cu-Pd filler was slightly alloyed with the noble Pd elements over the Ag-rich solid solution region. A series of corrosion test experiments in a sea water revealed that a corrosion of TiAg layer and a stress-induced cracking at the TiAg/Ag solid solution interface were dominant due to a galvanic attack, but notably the Ti-STS dissimilar joint's resistance to corrosion was significantly improved by alloying the Pd in the joint. The corrosion behavior of such dissimilar metal joints was discussed based on galvanic corrosion effect.

  4. Au-Ag-Cu nano-alloys: tailoring of permittivity

    NASA Astrophysics Data System (ADS)

    Hashimoto, Yoshikazu; Seniutinas, Gediminas; Balčytis, Armandas; Juodkazis, Saulius; Nishijima, Yoshiaki

    2016-04-01

    Precious metal alloys enables new possibilities to tailor materials for specific optical functions. Here we present a systematic study of the effects of a nanoscale alloying on the permittivity of Au-Ag-Cu metals at 38 different atomic mixing ratios. The permittivity was measured and analyzed numerically by applying the Drude model. X-ray diffraction (XRD) revealed the face centered cubic lattice of the alloys. Both, optical spectra and XRD results point towards an equivalent composition-dependent electron scattering behavior. Correlation between the fundamental structural parameters of alloys and the resulting optical properties is elucidated. Plasmonic properties of the Au-Ag-Cu alloy nanoparticles were investigated by numerical simulations. Guidelines for designing plasmonic response of nano- structures and their patterns are presented from the material science perspective.

  5. Au-Ag-Cu nano-alloys: tailoring of permittivity

    PubMed Central

    Hashimoto, Yoshikazu; Seniutinas, Gediminas; Balčytis, Armandas; Juodkazis, Saulius; Nishijima, Yoshiaki

    2016-01-01

    Precious metal alloys enables new possibilities to tailor materials for specific optical functions. Here we present a systematic study of the effects of a nanoscale alloying on the permittivity of Au-Ag-Cu metals at 38 different atomic mixing ratios. The permittivity was measured and analyzed numerically by applying the Drude model. X-ray diffraction (XRD) revealed the face centered cubic lattice of the alloys. Both, optical spectra and XRD results point towards an equivalent composition-dependent electron scattering behavior. Correlation between the fundamental structural parameters of alloys and the resulting optical properties is elucidated. Plasmonic properties of the Au-Ag-Cu alloy nanoparticles were investigated by numerical simulations. Guidelines for designing plasmonic response of nano- structures and their patterns are presented from the material science perspective. PMID:27118459

  6. Au-Ag-Cu nano-alloys: tailoring of permittivity.

    PubMed

    Hashimoto, Yoshikazu; Seniutinas, Gediminas; Balčytis, Armandas; Juodkazis, Saulius; Nishijima, Yoshiaki

    2016-01-01

    Precious metal alloys enables new possibilities to tailor materials for specific optical functions. Here we present a systematic study of the effects of a nanoscale alloying on the permittivity of Au-Ag-Cu metals at 38 different atomic mixing ratios. The permittivity was measured and analyzed numerically by applying the Drude model. X-ray diffraction (XRD) revealed the face centered cubic lattice of the alloys. Both, optical spectra and XRD results point towards an equivalent composition-dependent electron scattering behavior. Correlation between the fundamental structural parameters of alloys and the resulting optical properties is elucidated. Plasmonic properties of the Au-Ag-Cu alloy nanoparticles were investigated by numerical simulations. Guidelines for designing plasmonic response of nano- structures and their patterns are presented from the material science perspective. PMID:27118459

  7. Brazed joints of CBN grains and AISI 1045 steel with AgCuTi-TiC mixed powder as filler materials

    NASA Astrophysics Data System (ADS)

    Ding, Wen-Feng; Xu, Jiu-Hua; Chen, Zhen-Zhen; Su, Hong-Hua; Fu, Yu-Can

    2011-12-01

    The brazing process of cubic boron nitride (CBN) grains and AISI 1045 steel with AgCuTi-TiC mixed powder as a filler material was carried out. The joining strength and the interfacial microstructure were investigated. The experimental results indicate that the spreading of the molten filler material on AISI 1045 steel is decreased with the increase of TiC content. A good interface is formed between the TiC particulates and AgCuTi alloy through the wetting behavior. In the case of AgCuTi+16wt% TiC, the strength of the brazed steel-to-steel joints reached the highest value of 95 MPa dependent upon the reinforcement effect of TiC particles within the filler layer. Brazing resultants of TiB2, TiB, and TiN are produced at the interface of the CBN grains and the AgCuTi-TiC filler layer by virtue of the interdiffusion of B, N, and Ti atoms.

  8. Active Brazing of C/C Composite to Copper by AgCuTi Filler Metal

    NASA Astrophysics Data System (ADS)

    Zhang, Kexiang; Xia, Lihong; Zhang, Fuqin; He, Lianlong

    2016-05-01

    Brazing between the carbon-fiber-reinforced carbon composite (C/C composite) and copper has gained increasing interest because of its important application in thermal management systems in nuclear fusion reactors and in the aerospace industry. In order to examine the "interfacial shape effect" on the mechanical properties of the joint, straight and conical interfacial configurations were designed and machined on the surface of C/C composites before joining to copper using an Ag-68.8Cu-4.5Ti (wt pct) alloy. The microstructure and interfacial microchemistry of C/C composite/AgCuTi/Cu brazed joints were comprehensively investigated by using high-resolution transmission electron microscopy. The results indicate that the joint region of both straight and conical joints can be described as a bilayer. Reaction products of Cu3Ti3O and γ-TiO were formed near the copper side in a conical interface joint, while no reaction products were found in the straight case. The effect of Ag on the interfacial reaction was discussed, and the formation mechanism of the joints during brazing was proposed. On the basis of the detailed microstructure presented, the mechanical performance of the brazed joints was discussed in terms of reaction and morphology across the joint.

  9. Novel PdAgCu ternary alloy: Hydrogen permeation and surface properties

    NASA Astrophysics Data System (ADS)

    Tarditi, Ana M.; Braun, Fernando; Cornaglia, Laura M.

    2011-05-01

    Dense PdAgCu ternary alloy composite membranes were synthesized by the sequential electroless plating of Pd, Ag and Cu on top of both disk and tubular porous stainless steel substrates. X-ray diffraction and scanning electron microscopy were employed to study the structure and morphology of the tested samples. The hydrogen permeation performance of these membranes was investigated over a 350-450 °C temperature range and a trans-membrane pressure up to 100 kPa. After annealing at 500 °C in hydrogen stream followed by permeation experiments, the alloy layer presented a FCC crystalline phase with a bulk concentration of 68% Pd, 7% Ag and 25% Cu as revealed by EDS. The PdAgCu tubular membrane was found to be stable during more than 300 h on hydrogen stream. The permeabilities of the PdAgCu ternary alloy samples were higher than the permeabilities of the PdCu alloy membranes with a FCC phase. The co-segregation of silver and copper to the membrane surface was observed after hydrogen permeation experiments at high temperature as determined by XPS.

  10. Preparation and optical properties of silica@Ag Cu alloy core-shell composite colloids

    NASA Astrophysics Data System (ADS)

    Zhang, Jianhui; Liu, Huaiyong; Wang, Zhenlin; Ming, Naiben

    2007-04-01

    The silica@Ag-Cu alloy core-shell composite colloids have been successfully synthesized by an electroless plating approach to explore the possibility of modifying the plasmon resonance at the nanoshell surface by varying the metal nanoshell composition for the first time. The surface plasmon resonance of the composite colloids increases in intensity and shifts towards longer, then shorter wavelengths as the Cu/Ag ratio in the alloy shell is increased. The variations in intensity of the surface plasmon resonance with the Cu/Ag ratio obviously affect the Raman bands of the silica colloid core. The report here may supply a new technique to effectively modify the surface plasmon resonance.

  11. The Effects of Adding Elements of Zinc and Magnesium on Ag-Cu Eutectic Alloy for Warming Acupuncture

    PubMed Central

    Park, Il Song; Kim, Keun Sik; Lee, Min Ho

    2013-01-01

    The warming acupuncture for hyperthermia therapy is made of STS304. However, its needle point cannot be reached to a desirable temperature due to heat loss caused by low thermal conductivity, and the quantification of stimulation condition and the effective standard establishment of warming acupuncture are required as a heat source. Accordingly, in this study, after Ag-Cu alloys with different composition ratios were casted and then mixed with additives to improve their physical and mechanical properties, the thermal conductivity and biocompatibility of the alloy specimens were evaluated for selecting suitable material. Ag-Cu binary alloys and ternary alloys added 5 wt% Zn or 2 wt% Mg were casted and then cold drawn to manufacture needles for acupuncture, and their physical properties, thermal conductivity, and biocompatibility were evaluated for their potential use in warming acupuncture. The results of this study showed that the physical and mechanical properties of the Ag-Cu alloys were improved by additives and that the thermal conductivity, machinability, and biocompatibility of the Ag-Cu alloys were improved by Mg addition. PMID:24078827

  12. Synthesis and thermal behavior of tin-based alloy (Sn-Ag-Cu) nanoparticles.

    PubMed

    Roshanghias, Ali; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2015-03-19

    The prominent melting point depression of nanoparticles has been the subject of a considerable amount of research. For their promising applications in electronics, tin-based nano-alloys such as near-eutectic Sn-Ag-Cu (SAC) alloys have been synthesized via various techniques. However, due to issues such as particle aggregation and oxidation or introduced impurities, the application of these nano-size particles has been confined or aborted. For instance, thermal investigations by DTA/DSC in a large number of studies revealed exothermic peaks in the range of 240-500 °C, i.e. above the melting point of SAC nanoparticles, with different and quite controversial explanations for this unclear phenomenon. This represents a considerable drawback for the application of nanoparticles. Correspondingly, in the current study, the thermal stability of SAC nanoparticles has been investigated via electron microscopy, XRD, FTIR, and DSC/TG analysis. It was found that the nanoparticles consist mainly of a metallic β-Sn core and an amorphous tin hydroxide shell structure. The SnO crystalline phase formation from this amorphous shell has been associated with the exothermic peaks on the first heating cycle of the nanoparticles, followed by a disproportionation reaction into metallic Sn and SnO₂.The results also revealed that the surfactant and reducing agent cannot only affect the size and size distribution of the nanoparticles, they might also alter the ratio between the amorphous shell and the crystalline core in the structure of particles. PMID:25757694

  13. Synthesis and thermal behavior of tin-based alloy (Sn-Ag-Cu) nanoparticles

    NASA Astrophysics Data System (ADS)

    Roshanghias, Ali; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2015-03-01

    The prominent melting point depression of nanoparticles has been the subject of a considerable amount of research. For their promising applications in electronics, tin-based nano-alloys such as near-eutectic Sn-Ag-Cu (SAC) alloys have been synthesized via various techniques. However, due to issues such as particle aggregation and oxidation or introduced impurities, the application of these nano-size particles has been confined or aborted. For instance, thermal investigations by DTA/DSC in a large number of studies revealed exothermic peaks in the range of 240-500 °C, i.e. above the melting point of SAC nanoparticles, with different and quite controversial explanations for this unclear phenomenon. This represents a considerable drawback for the application of nanoparticles. Correspondingly, in the current study, the thermal stability of SAC nanoparticles has been investigated via electron microscopy, XRD, FTIR, and DSC/TG analysis. It was found that the nanoparticles consist mainly of a metallic β-Sn core and an amorphous tin hydroxide shell structure. The SnO crystalline phase formation from this amorphous shell has been associated with the exothermic peaks on the first heating cycle of the nanoparticles, followed by a disproportionation reaction into metallic Sn and SnO2.The results also revealed that the surfactant and reducing agent cannot only affect the size and size distribution of the nanoparticles, they might also alter the ratio between the amorphous shell and the crystalline core in the structure of particles.The prominent melting point depression of nanoparticles has been the subject of a considerable amount of research. For their promising applications in electronics, tin-based nano-alloys such as near-eutectic Sn-Ag-Cu (SAC) alloys have been synthesized via various techniques. However, due to issues such as particle aggregation and oxidation or introduced impurities, the application of these nano-size particles has been confined or aborted. For

  14. BRAZING OF POROUS ALUMINA TO MONOLITHIC ALUMINA WITH Ag-CuO and Ag-V2O5 ALLOYS

    SciTech Connect

    Lamb, M. C.; Camardello, Sam J.; Meier, Alan; Weil, K. Scott; Hardy, John S.

    2005-01-31

    The feasibility of joining porous alumina (Al{sub 2}O{sub 3}) bodies to monolithic Al{sub 2}O{sub 3} using Ag-CuO and Ag-V{sub 2}O{sub 5} alloys via reactive air brazing (RAB) was examined for a nanoporous filter application. Brazing for these systems is complicated by the conflicting requirements of satisfactory wetting to fill the braze gap, while minimizing the infiltration of the porous body. By varying the firing time, temperature, and initial powder size, porous bodies with a range of pore microstructures were fabricated. The wettability was evaluated via sessile drop testing on monolithic substrates and porous body infiltration. Porous Al{sub 2}O{sub 3}/monolithic Al{sub 2}O{sub 3} brazed samples were fabricated, and the microstructures were evaluated. Both systems exhibited satisfactory wetting for brazing, but two unique types of brazing behavior were observed. In the Ag-CuO system, the braze alloy infiltrated a short distance into the porous body. For these systems, the microstructures indicated satisfactory filling of the brazed gap and a sound joint regardless of the processing conditions. The Ag-V{sub 2}O{sub 5} alloys brazed joints exhibited a strong dependence on the amount of V{sub 2}O{sub 5} available. For Ag-V{sub 2}O{sub 5} alloys with large V{sub 2}O{sub 5} additions, the braze alloy aggressively infiltrated the porous body and significantly depleted the Ag from the braze region resulting in poor bonding and large gaps within the joint. With small additions of V{sub 2}O{sub 5}, the Ag infiltrated the porous body until the V{sub 2}O{sub 5} was exhausted and the Ag remaining at the braze interlayer bonded with the Al{sub 2}O{sub 3}. Based on these results, the Ag-CuO alloys have the best potential for brazing porous Al{sub 2}O{sub 3} to monolithic Al{sub 2}O{sub 3}.

  15. Setting and flexural properties of metal-resin composite using Ag-Cu particles as filler and chemical accelerator.

    PubMed

    Soma, Hiroko; Miyagawa, Yukio; Ogura, Hideo

    2003-12-01

    A metal-resin composite material was experimentally prepared by mixing a powder consisting of Ag-Cu particles and BPO with a paste consisting of UDMA-based monomer and 4-META in the absence of tertiary amine. The working time and setting time were mainly affected by the amounts of 4-META, BPO and metal particles, most of them fulfilling the requirements for working time and setting time specified in ISO 4049:2000 in the present experimental conditions. The flexural strength ranged from 49.6 MPa to 77.8 MPa, and the highest value was obtained when the 4-META concentration was high and metal particle content was low. The flexural modulus of elasticity, ranging from 6.7 GPa to 11.9 GPa, significantly increased as the 4-META concentration and metal particle content increased. Based on its mechanical properties, this metal-resin composite in which metal particles are involved in the polymerization initiation system has the potential to be used as a dental restorative material. PMID:15005231

  16. Characterization of the (Ag,Cu)(In,Ga)Se2 thin film alloy system for solar cells

    NASA Astrophysics Data System (ADS)

    Boyle, Jonathan

    Energy is the underlying factor to human economic activity, and more energy is projected to be needed in the near future and photovoltaics provide a means to supply that energy. Results presented in this dissertation detail material properties of the (Ag,Cu)(In,Ga)Se2 thin film alloy system for use as a solar cell material. Structural and optical properties were determined via X-ray diffraction and UV/Vis/NIR spectrophotometry, respectively. Structural data was analyzed using JADE 2010 software and optical data was analyzed via two different methods. Results of Ag substitution into Cu(In,Ga)Se2 alloy were reconciled with the Jaffe-Wei-Zunger (JWZ) theoretical model, which relates structural and chemical properties of Cu-based ternary chalcopyrite alloys to their optical properties. Dominant phase of the alloy system was identified as chalcopyrite I-42d, Space group 122, with minor secondary phases and order defect phases. No chalcopyrite-chalcopyrite miscibility gap was present in the alloy compositional space, counter to prior literature on bulk polycrystalline materials and thermodynamic calculations performed here, indicating that Ag was successfully substituted into the chalcopyrite lattice. Lattice constant results were consistent with JWZ model, where a O lattice constant closely follows Vegard's rule, cO lattice constant changes at different rates than aO does with composition, and anion displacement is affected by cation radii. Optical results showed bandgap widening with Ag and Ga substitution across the full compositional space, with bowing parameters shown overall to be invariant with cation substitution, counter to expectations. (Ag+Cu)/(In+Ga) ratio effect on bandgap for a limited set of samples is consistent with p-d hybridization effects from JWZ model.

  17. Structural and optical properties of (Ag,Cu)(In,Ga)Se{sub 2} polycrystalline thin film alloys

    SciTech Connect

    Boyle, J. H.; Shafarman, W. N.; Birkmire, R. W.; McCandless, B. E.

    2014-06-14

    The structural and optical properties of pentenary alloy (Ag,Cu)(In,Ga)Se{sub 2} polycrystalline thin films were characterized over the entire compositional range at a fixed (Cu + Ag)/(In + Ga) ratio. Films deposited at 550 °C on bare and molybdenum coated soda-lime glass by elemental co-evaporation in a single-stage process with constant incident fluxes exhibit single phase chalcopyrite structure, corresponding to 122 spacegroup (I-42d) over the entire compositional space. Unit cell refinement of the diffraction patterns show that increasing Ag substitution for Cu, the refined a{sub o} lattice constant, (Ag,Cu)-Se bond length, and anion displacement increase in accordance with the theoretical model proposed by Jaffe, Wei, and Zunger. However, the refined c{sub o} lattice constant and (In,Ga)-Se bond length deviated from theoretical expectations for films with mid-range Ag and Ga compositions and are attributed to influences from crystallographic bond chain ordering or cation electronegativity. The optical band gap, derived from transmission and reflection measurements, widened with increasing Ag and Ga content, due to influences from anion displacement and cation electronegativity, as expected from theoretical considerations for pseudo-binary chalcopyrite compounds.

  18. Bonding of Cf/SiC composite to Invar alloy using an active cement, Ag-Cu eutectic and Cu interlayer

    NASA Astrophysics Data System (ADS)

    Lei, Zhao; Xiaohong, Li; Jinbao, Hou; Qiang, Sun; Fuli, Zhang

    2012-10-01

    The interfacial microstructures and mechanical properties of the joints formed by active cement added brazing in vacuum of Cf/SiC composite to Invar alloy, using Ag-Cu eutectic alloy and pure copper foil as braze alloy and interlayer respectively, were investigated. CuTi, Cu4Ti3, Fe2Ti and the reaction layer of TiC and Si were the predominant components at the joint interface. The maximum shear strength of the joint was 77 MPa for brazing at 850 °C for 15 min. The results show that active cement added brazing in vacuum using Ag-Cu eutectic alloy and Cu interlayer can be used successfully for joining Cf/SiC composites to Invar alloy.

  19. Effect of Ag addition on the thermal characteristics and structural evolution of Ag-Cu-Ni ternary alloy nanoclusters: Atomistic simulation study

    NASA Astrophysics Data System (ADS)

    Subbaraman, Ram; Sankaranarayanan, Subramanian K. R. S.

    2011-08-01

    Atomic-scale compositional variation in Ag contents across Ag-Cu-Ni alloy upon being subjected to repeated annealing cycles is shown to result in significant differences in the structure and the thermal stability of ternary alloy nanoclusters. Molecular dynamics (MD) simulations employing quantum Sutton-Chen potentials were used to investigate the effect of Ag addition on the thermal characteristics of Ag-Cu-Ni ternary alloy nanoclusters of 4-nm diameter. The initial configurations were generated using Monte Carlo simulations and comprise surface-segregated structures with the lowest surface energy component, Ag, occupying low coordination sites such as corners, edges, and faces. A compositional oscillation between the Cu and Ni atoms was observed for layers beneath the surface which transitions into a bulk alloy composition at the core. We find that the Cu-Ni binary alloys on being subjected to annealing schedules demonstrated an increase in thermal stability, as indicated by the increase in melting points. The annealed configurations of the Ag-Cu-Ni ternary alloy, on the other hand, showed a nonmonotonic behavior. For Ag compositions less than 20%, we observe an initial increase in melting point followed by a decrease in the third cycle. For higher Ag compositions (>20%), we observe a decrease in melting point with annealing; the rate of decrease is strongly correlated to the Ag composition in the alloy. Cu-Ni nanoclusters having 50% Cu showed a transition from an initial icosahedral to a cuboctahedron-like structure whereas Ag-rich Ag-Cu-Ni ternary alloys showed a transition from icosahedral to an amorphous structure. Compositional analysis based on radial distribution functions and density profiles indicate that these transitions were dependent on the distribution of the alloying elements in the nanocluster. Calculated root-mean-square displacements and diffusion coefficients indicate that the rate of mixing of Ag increases with Ag content in the Ag-Cu

  20. Filler metal alloy for welding cast nickel aluminide alloys

    DOEpatents

    Santella, Michael L.; Sikka, Vinod K.

    1998-01-01

    A filler metal alloy used as a filler for welding east nickel aluminide alloys contains from about 15 to about 17 wt. % chromium, from about 4 to about 5 wt. % aluminum, equal to or less than about 1.5 wt. % molybdenum, from about 1 to about 4.5 wt. % zirconium, equal to or less than about 0.01 wt. % yttrium, equal to or less than about 0.01 wt. % boron and the balance nickel. The filler metal alloy is made by melting and casting techniques such as are melting the components of the filler metal alloy and east in copper chill molds.

  1. Filler metal alloy for welding cast nickel aluminide alloys

    DOEpatents

    Santella, M.L.; Sikka, V.K.

    1998-03-10

    A filler metal alloy used as a filler for welding cast nickel aluminide alloys contains from about 15 to about 17 wt. % chromium, from about 4 to about 5 wt. % aluminum, equal to or less than about 1.5 wt. % molybdenum, from about 1 to about 4.5 wt. % zirconium, equal to or less than about 0.01 wt. % yttrium, equal to or less than about 0.01 wt. % boron and the balance nickel. The filler metal alloy is made by melting and casting techniques such as are melting the components of the filler metal alloy and cast in copper chill molds. 3 figs.

  2. Localized surface plasmon behavior of Ag-Cu alloy nanoparticles stabilized by rice-starch and gelatin

    NASA Astrophysics Data System (ADS)

    Singh, Manish Kumar; Manda, Premkumar; Singh, A. K.; Mandal, R. K.

    2015-10-01

    The purpose of this communication was to understand localized surface plasmon behavior of a series of Ag-Cu alloy nanoparticles capped by rice-starch and gelatin. The structures of dried powders were investigated with the help of X-ray diffraction. The analysis revealed Ag-rich and Cu-rich phases with maximum solid solubility of Cu ˜9 atom per cent; 8 atom per cent and Ag ˜ 16 atom per cent; 14 atom per cent in rice-starch and gelatin capped samples respectively. Transmission electron microscope was used for knowing the particle size as well as to supplement FCC phase formations of Ag-rich and Cu-rich solid phases arrived at based on X-ray diffraction studies. The UV-Vis spectra of sols were examined for the formation and stability of alloy nanoparticles. The temporal evolution of LSPR curves gave us to assert that the sol is stable for more than two months. Small angle X-ray scattering in the sol state was extensively utilized to understand nature of suspensions in terms of fractals. Such a study is important for having a correlation between LSPR behaviors with those of nanoparticle dispersion in aqueous media. It is believed that this work will be a contribution to the emerging field of plasmonics that include applications in the area of photophysical processes and photochemical reactions.

  3. Novel PdAgCu ternary alloy as promising materials for hydrogen separation membranes: Synthesis and characterization

    NASA Astrophysics Data System (ADS)

    Tarditi, Ana M.; Cornaglia, Laura M.

    2011-01-01

    The use of the sequential electroless plating method allowed us to obtain the PdAgCu ternary alloy on top of dense stainless steel (SS) 316 L disks. The XRD analysis indicated that initially the nucleation of the two phases of the alloy (FCC and BCC) takes place, but the FCC/BCC ratio increases with the annealing time at 500 °C in H 2 stream. After 162 h, the film contained only the FCC phase, which presents promising properties to be applied in the synthesis of hydrogen selective membranes. SEM cross-section results showed that a dense, continuous, defect-free film was deposited on top of the SS support, and the EDS data indicated that no significant gradient was present on the thickness of the film. XPS and LEIS allowed us to determine that Cu and Ag surface segregation takes place after annealing up to 500 °C/5 days. In the top-most surface layer, Ag enrichment takes place as determined by ARXPS experiments which can be the result of the lower surface tension of Ag compared to that of Cu and Pd. Increasing the annealing temperature results in an increase of the Ag surface segregation while the Cu concentration in the top-most surface layer decreases.

  4. Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

    SciTech Connect

    Anderson, Iver E.; Boesenberg, Adam; Harringa, Joel; Riegner, David; Steinmetz, Andrew; Hillman, David

    2011-09-28

    Pb-free solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic have promise for widespread adoption across assembly conditions and operating environments, but enhanced microstructural control is needed. Micro-alloying with elements such as Zn was demonstrated for promoting a preferred solidification path and joint microstructure earlier in simple (Cu/Cu) solder joints studies for different cooling rates. This beneficial behavior now has been verified in reworked ball grid array (BGA) joints, using dissimilar SAC305 (Sn-3.0Ag-0.5Cu, wt.%) solder paste. After industrial assembly, BGA components joined with Sn-3.5Ag-0.74Cu-0.21Zn solder were tested in thermal cycling (-55 C/+125 C) along with baseline SAC305 BGA joints beyond 3000 cycles with continuous failure monitoring. Weibull analysis of the results demonstrated that BGA components joined with SAC + Zn/SAC305 have less joint integrity than SAC305 joints, but their lifetime is sufficient for severe applications in consumer, defense, and avionics electronic product field environments. Failure analysis of the BGA joints revealed that cracking did not deviate from the typical top area (BGA component side) of each joint, in spite of different Ag3Sn blade content. Thus, SAC + Zn solder has not shown any advantage over SAC305 solder in these thermal cycling trials, but other characteristics of SAC + Zn solder may make it more attractive for use across the full range of harsh conditions of avionics or defense applications.

  5. THE ELECTRONIC STRUCTURE OF AG/CU(100) SURFACE ALLOYS STUDIES BY AUGER-PHOTOELECTRON COINCIDENCE SPECTROSCOPY.

    SciTech Connect

    ARENA,D.A.; BARTYNSKI,R.A.; HULBERT,S.L.

    2001-10-08

    We have measured the Ag and Pd M{sub 5}VV Auger spectrum in coincidence with Ag and Pd 4d{sub 5/2} photoelectrons for the Ag/Cu(100) and Pd/Cu(100) systems, respectively, as a function of admetal coverage. These systems form surface alloys (i.e. random substitutional alloys in the first atomic layer) for impurity concentrations in the 0.1 monolayer range. For these systems, the centroid of the impurity 4d levels is expected to shift away from the Fermi level by {approx}1 eV [Ruban et al., Journal of Molecular Catalysis. A 115 (1997) 421], an effect that should be easily seen in coincidence core-valence-valence Auger spectra. We find that the impurity Auger spectra of both systems shift in a manner that is consistent with d-band moving away from EF. However, the shift for Pd is considerably smaller than expected, and a shift almost absent for Ag. The disagreement between theory and experiment is most likely caused by the neglect of lattice relaxations in the calculations.

  6. Localized surface plasmon behavior of Ag-Cu alloy nanoparticles stabilized by rice-starch and gelatin

    SciTech Connect

    Singh, Manish Kumar; Mandal, R. K.; Manda, Premkumar; Singh, A. K.

    2015-10-15

    The purpose of this communication was to understand localized surface plasmon behavior of a series of Ag-Cu alloy nanoparticles capped by rice-starch and gelatin. The structures of dried powders were investigated with the help of X-ray diffraction. The analysis revealed Ag-rich and Cu-rich phases with maximum solid solubility of Cu ∼9 atom per cent; 8 atom per cent and Ag ∼ 16 atom per cent; 14 atom per cent in rice-starch and gelatin capped samples respectively. Transmission electron microscope was used for knowing the particle size as well as to supplement FCC phase formations of Ag-rich and Cu-rich solid phases arrived at based on X-ray diffraction studies. The UV-Vis spectra of sols were examined for the formation and stability of alloy nanoparticles. The temporal evolution of LSPR curves gave us to assert that the sol is stable for more than two months. Small angle X-ray scattering in the sol state was extensively utilized to understand nature of suspensions in terms of fractals. Such a study is important for having a correlation between LSPR behaviors with those of nanoparticle dispersion in aqueous media. It is believed that this work will be a contribution to the emerging field of plasmonics that include applications in the area of photophysical processes and photochemical reactions.

  7. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    SciTech Connect

    Boesenberg, Adam; Anderson, Iver; Harringa, Joel

    2012-03-10

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic (T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (<0.25 wt.%) to Sn-3.5Ag-0.95Cu (SAC3595) solders to promote more consistent solder joint microstructures and to avoid deleterious product phases, e.g., Ag3Sn “blades,” for BGA cooling rates, since such Al additions to SAC had already demonstrated excellent thermal aging stability. Consistent with past work, blade formation was suppressed for increased Al content (>0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2-μm to 5-μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  8. Ternary eutectic growth of Ag-Cu-Sb alloy within ultrasonic field

    NASA Astrophysics Data System (ADS)

    Zhai, Wei; Hong, Zhenyu; Wei, Bingbo

    2007-08-01

    The liquid to solid transformation of ternary Ag42.4Cu21.6Sb36 eutectic alloy was accomplished in an ultrasonic field with a frequency of 35 kHz, and the growth mechanism of this ternary eutectic was examined. Theoretical calculations predict that the sound intensity in the liquid phase at the solidification interface increases gradually as the interface moves up from the sample bottom to its top. The growth mode of ( ɛ + θ + Sb) ternary eutectic exhibits a transition of “divorced eutectic—mixture of anomalous and regular structures—regular eutectic” along the sample axis due to the inhomogeneity of sound field distribution. In the top zone with the highest sound intensity, the cavitation effect promotes the three eutectic phases to nucleate independently, while the acoustic streaming efficiently suppresses the coupled growth of eutectic phases. In the meantime, the ultrasonic field accelerates the solute transportation at the solid-liquid interface, which reduces the solute solubility of eutectic phases.

  9. Filler wire for aluminum alloys and method of welding

    NASA Technical Reports Server (NTRS)

    Bjorkman, Jr., Gerald W. O. (Inventor); Cho, Alex (Inventor); Russell, Carolyn K. (Inventor)

    2003-01-01

    A weld filler wire chemistry has been developed for fusion welding 2195 aluminum-lithium. The weld filler wire chemistry is an aluminum-copper based alloy containing high additions of titanium and zirconium. The additions of titanium and zirconium reduce the crack susceptibility of aluminum alloy welds while producing good weld mechanical properties. The addition of silver further improves the weld properties of the weld filler wire. The reduced weld crack susceptibility enhances the repair weldability, including when planishing is required.

  10. Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

    NASA Astrophysics Data System (ADS)

    Reeve, Kathlene N.; Anderson, Iver E.; Handwerker, Carol A.

    2015-03-01

    Lead-free solder alloys Sn-Cu (SC) and Sn-Ag-Cu (SAC) are widely used by the microelectronics industry, but enhanced control of the microstructure is needed to improve solder performance. For such control, nucleation and stability of Cu-Al intermetallic compound (IMC) solidification catalysts were investigated by variation of the Cu (0.7-3.0 wt.%) and Al (0.0-0.4 wt.%) content of SC + Al and SAC + Al alloys, and of SAC + Al ball-grid array (BGA) solder joints. All of the Al-modified alloys produced Cu-Al IMC particles with different morphologies and phases (occasionally non-equilibrium phases). A trend of increasing Cu-Al IMC volume fraction with increasing Al content was established. Because of solidification of non-equilibrium phases in wire alloy structures, differential scanning calorimetry (DSC) experiments revealed delayed, non-equilibrium melting at high temperatures related to quenched-in Cu-Al phases; a final liquidus of 960-1200°C was recorded. During cooling from 1200°C, the DSC samples had the solidification behavior expected from thermodynamic equilibrium calculations. Solidification of the ternary alloys commenced with formation of ternary β and Cu-Al δ phases at 450-550°C; this was followed by β-Sn, and, finally, Cu6Sn5 and Cu-Al γ1. Because of the presence of the retained, high-temperature phases in the alloys, particle size and volume fraction of the room temperature Cu-Al IMC phases were observed to increase when the alloy casting temperature was reduced from 1200°C to 800°C, even though both temperatures are above the calculated liquidus temperature of the alloys. Preliminary electron backscatter diffraction results seemed to show Sn grain refinement in the SAC + Al BGA alloy.

  11. Microstructure and mechanical properties of joints in sintered SiC fiber-bonded ceramics brazed with Ag Cu Ti alloy

    SciTech Connect

    Singh, Mrityunjay; Asthana, Rajiv; Ishikawa, Toshihiro; Matsunaga, Tadashi; Lin, Hua-Tay

    2012-01-01

    Active metal brazing of a new high thermal conductivity sintered SiC-polycrystalline fiber-bonded ceramic (SA-Tyrannohexs) has been carried out using a Ti-containing Ag Cu active braze alloy (Cusil-ABAs). The brazed composite joints were characterized using scanning electron microscopy coupled with energy-dispersive X-ray spectrometry (SEM EDS). The results show that this material can be successfully joined using judiciously selected off-the shelf active braze alloys to yield metallurgically sound joints possessing high integrity. Uniform and continuous joints were obtained irrespective of differences in the fiber orientation in the substrate material. Detailed interfacial microanalysis showed that the titanium reacts with C and Si to form TiC layer and a Ti Si compound, respectively. Furthermore, the evaluation of shear strength of the joints was also conducted at ambient and elevated temperatures in air using the single-lap offset (SLO) shear test. The perpendicular-type SA-Tyrannohex joints exhibited apparent shear strengths of about 42 MPa and 25 MPa at 650 1C and 750 1C, respectively. The fracture at the higher temperature occurred at the interface between the reactionformed TiC layer and braze. This might be caused by generation of stress intensity when a shear stress was applied, according to m-FEA simulation results.

  12. Microstructure and Mechanical Properties of Joints in Sintered SiC Fiber-Bonded Ceramics Brazed with Ag-Cu-Ti Alloy

    SciTech Connect

    Singh, Mrityunjay; Matsunaga, Tadashi; Lin, Hua-Tay; Asthana, Rajiv; Ishikawa, Toshihiro

    2012-01-01

    Active metal brazing of a new high thermal conductivity sintered SiC-polycrystalline fiber-bonded ceramic (SA-Tyrannohex{reg_sign}) has been carried out using a Ti-containing Ag-Cu active braze alloy (Cusil-ABA{reg_sign}). The brazed composite joints were characterized using scanning electron microscopy coupled with energy-dispersive X-ray spectrometry (SEM-EDS). The results show that this material can be successfully joined using judiciously selected off-the shelf active braze alloys to yield metallurgically sound joints possessing high integrity. Uniform and continuous joints were obtained irrespective of differences in the fiber orientation in the substrate material. Detailed interfacial microanalysis showed that the titanium reacts with C and Si to form TiC layer and a Ti-Si compound, respectively. Furthermore, the evaluation of shear strength of the joints was also conducted at ambient and elevated temperatures in air using the single-lap offset (SLO) shear test. The perpendicular-type SA-Tyrannohex joints exhibited apparent shear strengths of about 42 MPa and 25 MPa at 650 C and 750 C, respectively. The fracture at the higher temperature occurred at the interface between the reaction-formed TiC layer and braze. This might be caused by generation of stress intensity when a shear stress was applied, according to {mu}-FEA simulation results.

  13. Dose and Ion Current Density Dependence of the Topography Formed on the Surface of Ag/Cu Two-Phase Alloys Sputtered by 600 eV Ar

    NASA Astrophysics Data System (ADS)

    Pierson, K. W.; Hawes, C. D.; Krueger, T. D.; Stupak, J.

    1997-03-01

    The polished surface of a Ag/Cu (60/40 % atomic) alloy sample held at room temperature was bombarded by varying doses of normally incident 600 eV argon ions at 1.0 mA/cm^2. Fluences were varied from 7x10^16 to 7x10^19 ions/cm^2. The changes that occurred in the surface topography progressed through various stages. First, for fluences less than 10^18 ions/cm^2, selective sputtering of the higher yield Ag grains caused them to become recessed. Between 10^18 ions/cm^2 and 10^19 ions/cm^2 a transition occurs, conical features (seed cones) develop only on the surface of the Ag grains. The dense large aspect ratio cones decrease the sputtering yield of the Ag grains with the result that they now become raised above the Cu grains. At fluences greater than 10^19 ions/cm^2 the entire surface of the sample becomes densely covered with large aspect ration cones. The transition from selective sputtering to seed cone formation implies a threshold for surface coverage of "seed" atoms in order for cone formation to begin. Increasing the ion current density and holding the fluence constant greatly accelerated the transition to a densely cone covered surface.

  14. The Effect of Braze Interlayer Thickness on the Mechanical Strength of Alumina Brazed with Ag-CuO Braze Alloys

    SciTech Connect

    Erskine, Kevin M.; Meier, Alan; Joshi, Vineet V.; Pilgrim, Steven M.

    2014-12-01

    The effect of braze interlayer thickness on the strength of alumina brazed with silver-copper oxide reactive air braze (RAB) alloys was evaluated using a four point bend test configuration. The brazed samples had an average fracture strength of 180 MPa or approximately 60 percent of the average monolithic alumina strength. The joint strength values obtained exceeded the yield strength and ultimate tensile strength of the silver interlayer indicating strong ceramic to metal adhesion and the development of a triaxial stress state in the braze interlayer. The average fracture strength was relatively constant (190 ± 60 MPa) in the thickness range of 0.030 mm to 0.230 mm for all test conditions. The braze fracture strength then decreased down to 100 ± 30 MPa as the braze thickness increased from 0.230 mm to 0.430 mm indicating a loss of triaxial constraint with increasing interlayer thickness. In addition, four different fracture modes were observed.

  15. Reduced-Temperature Transient-Liquid-Phase Bonding of AluminaUsing a Ag-Cu-Based Brazing Alloy

    SciTech Connect

    Hong, Sung Moo; Glaeser, Andreas M.

    2005-12-19

    The mechanical properties and microstructural evolution ofmetal-ceramic bonds produced using a transient liquid phase (TLP) aredescribed. Alumina (Al2O3) was joined at 500 degrees C, 600 degrees C,and 700 degrees C using a multilayer In/Cusil-ABA (R) (commercialcopper-silver eutectic brazing alloy)/In interlayer. The introduction ofthin In cladding layers allows the system to bond at much lowertemperatures than those typically used for brazing with Cusil-ABA (R),thereby protecting temperature-sensitive components. After chemicalhomogenization, the interlayers retain an operating temperature rangesimilar to that of the brazed joints. TLP bonds made at 500 degrees C,600 degrees C, and 700 degrees C with holding times ranging from as lowas 1.5 h to 24 h had average fracture strengths above 220 MPa. Theeffects of bonding temperature and time on fracture strength aredescribed. Preliminary analysis of the interlayers shows that the Ag-Inor Cu-In intermetallic phases do not form. Considerations unique tosystems with two-phase core layers are discussed. Experiments usingsingle-crystal sapphire indicate rapid formation of a reaction layer at700 degrees C, suggesting the possibility of making strong bonds usinglower temperatures and/or shorter processing times.

  16. Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies

    NASA Astrophysics Data System (ADS)

    Tian, Ye; Liu, Xi; Chow, Justin; Wu, Yi Ping; Sitaraman, Suresh K.

    2013-08-01

    The intermetallic compound (IMC) evolution in Cu pad/Sn-Ag-Cu solder interface and Sn-Ag-Cu solder/Ni pad interface was investigated using thermal shock experiments with 100- μm-pitch flip-chip assemblies. The experiments show that low standoff height of solder joints and high thermomechanical stress play a great role in the interfacial IMC microstructure evolution under thermal shock, and strong cross-reaction of pad metallurgies is evident in the intermetallic growth. Furthermore, by comparing the IMC growth during thermal aging and thermal shock, it was found that thermal shock accelerates IMC growth and that kinetic models based on thermal aging experiments underpredict IMC growth in thermal shock experiments. Therefore, new diffusion kinetic parameters were determined for the growth of (Cu,Ni)6Sn5 using thermal shock experiments, and the Cu diffusion coefficient through the IMC layer was calculated to be 0.2028 μm2/h under thermal shock. Finite-element models also show that the solder stresses are higher under thermal shock, which could explain why the IMC growth is faster and greater under thermal shock cycling as opposed to thermal aging.

  17. Microstructural Development and Mechanical Properties for Reactive Air Brazing of ZTA to Ni Alloys using Ag-CuO Braze Alloys

    SciTech Connect

    Prevost, Erica; DeMarco, A.Joseph; MacMichael, Beth; Joshi, Vineet V.; Meier, Alan; Hoffman, John W.; Walker, William J.

    2014-12-01

    Reactive air brazing (RAB) is a potential joining technique to join metal alloys to ceramics for a variety of applications. In the current study, nickel (Ni) alloys were heat treated to form an oxide layer prior to RAB joining to zirconia toughened alumina (ZTA). The Ni alloys evaluated were Nicrofer 6025 HT, Inconel 600, Inconel 693, Haynes 214 and Inconel 601. The ZTA studied had compositions of 0 to 15 wt% zirconia and 0 to 14 wt% glass. Four point-bend tests were performed to evaluate the joint strength of ZTA/ZTA and ZTA/nickel alloys brazed with Ag-2wt% CuO braze alloys. It was determined that the joint strength is not a function of the ZTA composition, but that the strength is a strong function of the chemistry and microstructure of the oxide layer formed on the nickel alloy. It was determined that an increase in the aluminum content of the Ni alloy resulted in an increase of the thickness of alumina in the oxide layer and was directly proportional to the bond strength with the exception of Inconel 601 which exhibited relatively high joint strengths even though it had a relatively low aluminum content.

  18. The effect of weldability of alloy JBK-75 with various filler metal wire additions

    SciTech Connect

    Taylor, C.L.

    1991-04-01

    The purpose of this study was to investigate the compositional factors that affect the weldability of alloy JBK-75. This study was accomplished by using a variety of different commercial filler materials to systematically evaluate the weldability in the compositional range surrounding alloy JBK-75. The experimental design included varestraint testing, scanning electron microscopy, and phase diagram analysis. The varestraint testing demonstrated that the weldability of alloy JBK-75 could be improved with the use of other commercially available filler metals. The best improvement to weldability of alloy JBK-75 was with type 308L stainless steel and Hastelloy W filler metals. Adequate improvement to the weldability of alloy JBK-75 was obtained when utilizing types 309L and 310 stainless steel filler metals. Alloy 320LR, alloy 650 (NiCrFe-1), Incoloy 901, and Inconel 92 (NiCrFe-6) filler metals only marginally improved the weldability of alloy JBK-75. 59 refs., 27 figs., 24 tabs.

  19. Ductility dip cracking susceptibility of Inconel Filler Metal 52 and Inconel Alloy 690

    SciTech Connect

    Kikel, J.M.; Parker, D.M.

    1998-06-01

    Alloy 690 and Filler Metal 52 have become the materials of choice for commercial nuclear steam generator applications in recent years. Filler Metal 52 exhibits improved resistance to weld solidification and weld-metal liquation cracking as compared to other nickel-based filler metals. However, recently published work indicates that Filler Metal 52 is susceptible to ductility dip cracking (DDC) in highly restrained applications. Susceptibility to fusion zone DDC was evaluated using the transverse varestraint test method, while heat affected zone (HAZ) DDC susceptibility was evaluated using a newly developed spot-on-spot varestraint test method. Alloy 690 and Filler Metal 52 cracking susceptibility was compared to the DDC susceptibility of Alloy 600, Filler Metal 52, and Filler Metal 625. In addition, the effect of grain size and orientation on cracking susceptibility was also included in this study. Alloy 690, Filler Metal 82, Filler Metal 52, and Filler Metal 625 were found more susceptible to fusion zone DDC than Alloy 600. Filler Metal 52 and Alloy 690 were found more susceptible to HAZ DDC when compared to wrought Alloy 600, Filler Metal 82 and Filler Metal 625. Filler Metal 52 exhibited the greatest susceptibility to HAZ DDC of all the weld metals evaluated. The base materials were found much more resistant to HAZ DDC in the wrought condition than when autogenously welded. A smaller grain size was found to offer greater resistance to DDC. For weld metal where grain size is difficult to control, a change in grain orientation was found to improve resistance to DDC.

  20. Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging

    NASA Astrophysics Data System (ADS)

    Huang, M. L.; Wu, C. M. L.; Lai, J. K. L.; Chan, Y. C.

    2000-08-01

    In a previous study, a lead-free solder, Sn-6Bi-2Ag-0.5Cu, was developed by mechanical alloying. The alloy shows great potential as a lead-free solder system. In the present work, the microstructural evolution during thermal shock and aging was examined. In the as-soldered joints small bismuth (1 µm to 2 µm) and Ag3Sn (1 µm) particles were finely dispersed in a nearly pure tin matrix with a small amount of η-Cu6Sn5 phase in the bulk of solder. During thermal shock and aging microstructural evolution occurred with Cu-Sn intermetallic compound (IMC) layer growth at interface, bismuth phase coarsening and Ag3Sn phase coarsening. The microstructure of the solder appeared to be stable at high temperature. The shear strength of the present solder joint is higher than that of Sn-37Pb and Sn-3.5Ag solders. Shear failure occurred Cu-Sn IMC layer-solder interface and in the bulk of solder.

  1. Morphology and electrochemical behavior of Ag-Cu nanoparticle-doped amalgams.

    PubMed

    Chung, Kwok-Hung; Hsiao, Li-Yin; Lin, Yu-Sheng; Duh, Jenq-Gong

    2008-05-01

    The aim of this study was to introduce Ag-Cu phase nanopowder as an additive to improve the corrosion behavior of dental amalgams. A novel Ag-Cu nanopowder was synthesized by the precipitation method. An amalgam alloy powder (World-Cap) was added and mixed with 5 wt.% and 10 wt.% of Ag-Cu nanopowders, respectively, to form experimental amalgam alloy powders. The original alloy powder was used as a control. Alloy powders were examined using X-ray diffraction, transmission electron microscopy (TEM), scanning electron microscopy and electron probe microanalysis. Amalgam disk specimens of metallurgically prepared were tested in 0.9% NaCl solution using electrochemical methods. The changes in the corrosion potential and anodic polarization characteristics were determined. Corrosion potential data were analyzed statistically (n=3, analysis of variance, Tukey's test, p<0.05). The diameters of lamellar structure Ag-Cu nanoparticles were measured to be approximately 30 nm. The composition of the Ag-Cu nanoparticles determined by TEM-energy-dispersive spectroscopy was 56.28 at.% Ag-43.72 at.% Cu. A light-shaded phase was found mixing with dark Cu-Sn reaction particles in the reaction zones of Ag-Cu nanoparticle-doped amalgams. The Ag-Cu nanoparticle-doped amalgams exhibited zero current potentials more positive than the control (p<0.05) and no current peak was observed at -325mV that related to Ag-Hg phase and Cu6Sn5 phase in anodic polarization curves. The results indicated that the corrosion resistance of high-copper single-composition amalgam could be improved by Ag-Cu nanoparticle-doping. PMID:18321799

  2. Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

    NASA Astrophysics Data System (ADS)

    Maleki, Milad; Cugnoni, Joë; Botsis, John

    2014-04-01

    Due to the high homologous temperature and fast cooling rates, the microstructures of SnAgCu (SAC) solders are in a meta-stable state in most applications, which is the cause of significant microstructural evolution and continuous variation in the mechanical behavior of the joints during service. The link between microstructures evolution and deformation behavior of Sn-4.0Ag-0.5Cu solder during isothermal ageing is investigated. The evolution of the microstructures in SAC solders are visualized at different scales in 3D by using a combination of synchrotron x-ray and focused ion beam/scanning electron microscopy tomography techniques at different states of ageing. The results show that, although the grain structure, morphology of dendrites, and overall volume fraction of intermetallics remain almost constant during ageing, considerable coarsening occurs in the Ag3Sn and Cu6Sn5 phases to lower the interfacial energy. The change in the morphometrics of sub-micron intermetallics is quantified by 3D statistical analyses and the kinetic of coarsening is discussed. The mechanical behavior of SAC solders is experimentally measured and shows a continuous reduction in the yield resistance of solder during ageing. For comparison, the mechanical properties and grain structure of β-tin are evaluated at different annealing conditions. Finally, the strengthening effect due to the intermetallics at different ageing states is evaluated by comparing the deformation behaviors of SAC solder and β-tin with similar grain size and composition. The relationship between the morphology and the strengthening effect due to intermetallics particles is discussed and the causes for the strength degradation in SAC solder during ageing are identified.

  3. Microstructure and Performance of Kovar/Alumina Joints Made with Silver-Copper Base Active Metal Braze Alloys

    SciTech Connect

    STEPHENS, JOHN J.; VIANCO,PAUL T.; HLAVA,PAUL F.; WALKER,CHARLES A.

    1999-12-15

    Poor hermeticity performance was observed for Al{sub 2}O{sub 3}-Al{sub 2}O{sub 3} ceramic-ceramic joints having a Kovar{trademark} alloy interlayer. The active Ag-Cu-Ti filler metal was used to braze the substrates together. The Ti active element was scavenged from the filler metal by the formation of a (Fe, Ni, Co){sub x}Ti phase (x= 2-3) that prevented development of a continuous Ti{sub x}O{sub y} layer at the filler metal/Al{sub 2}O{sub 3} interface. Altering the process parameters did not circumvent the scavenging of Ti. Molybdenum barrier layers 1000, 2500, or 5000 {angstrom} thick on the Kovar{trademark} surfaces successfully allowed Ti{sub x}O{sub y} formation at the filler metal/Al{sub 2}O{sub 3} interface and hermetic joints. The problems with the Ag-Cu-Ti filler metal for Kovar{trademark}/Al{sub 2}O{sub 3} braze joints led to the evaluation of a Ag-Cu-Zr filler metal. The Zr (active element) in Ag-Cu-Zr filler metal was not susceptible to the scavenging problem.

  4. Several braze filler metals for joining an oxide-dispersion-strengthened nickel-chromium-aluminum alloy

    NASA Technical Reports Server (NTRS)

    Gyorgak, C. A.

    1975-01-01

    An evaluation was made of five braze filler metals for joining an aluminum-containing oxide dispersion-strengthened (ODS) alloy, TD-NiCrAl. All five braze filler metals evaluated are considered suitable for joining TD-NiCrAl in terms of wettability and flow. Also, the braze alloys appear to be tolerant of slight variations in brazing procedures since joints prepared by three sources using three of the braze filler metals exhibited similar brazing characteristics and essentially equivalent 1100 C stress-rupture properties in a brazed butt-joint configuration. Recommendations are provided for brazing the aluminum-containing ODS alloys.

  5. B218 Weld Filler Wire Characterization for Al-Li Alloy 2195

    NASA Technical Reports Server (NTRS)

    Bjorkman, Gerry; Russell, Carolyn

    2000-01-01

    NASA Marshall Space Flight Center, Lockheed Martin Space Systems- Michoud Operations, and McCook Metals have developed an aluminum-copper weld filler wire for fusion welding aluminum lithium alloy 2195. The aluminum-copper based weld filler wire has been identified as B218, a McCook Metals designation. B218 is the result of six years of weld filler wire development funded by NASA, Lockheed Martin, and McCook Metals. The filler wire chemistry was developed to produce enhanced 2195 weld and repair weld mechanical properties over the 4043 aluminum-silicon weld filler wire, which is currently used to weld 2195 on the Super Lightweight External Tank for the NASA Space Shuttle Program. An initial characterization was performed consisting of a repair weld evaluation using B218 and 4043 weld filler wires. The testing involved room temperature and cryogenic repair weld tensile testing along with fracture toughness testing. From the testing, B218 weld filler wire produce enhanced repair weld tensile strength, ductility, and fracture properties over 4043. B218 weld filler wire has proved to be a superior weld filler wire for welding aluminum lithium alloy 2195 over 4043.

  6. Improved TIG weld joint strength in aluminum alloy 2219-T87 by filler metal substitution

    NASA Technical Reports Server (NTRS)

    Poorman, R. M.; Lovoy, C. V.

    1972-01-01

    The results of an investigation on weld joint characteristics of aluminum alloy 2219-T87 are given. Five different alloys were utilized as filler material. The mechanical properties of the joints were determined at ambient and cryogenic temperatures for weldments in the as-welded condition and also, for weldments after elevated temperature exposures. Other evaluations included hardness surveys, stress corrosion susceptibility, and to a limited extent, the internal metallurgical weld structures. The overall results indicate that M-943 filler weldments are superior in strength to weldments containing either the standard 2319 filler or fillers 2014, 2020, and a dual wire feed consisting of three parts 2319 and one part 5652. In addition, no deficiencies were evident in M-934 filler weldments with regard to ductility, joint strength after elevated temperature exposure, weld hardness, metallographic structures, or stress corrosion susceptibility.

  7. Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals

    NASA Astrophysics Data System (ADS)

    Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H.

    2002-08-01

    Al-Si-Cu-based filler metals have been used successfully for brazing 6061 aluminum alloy as reported in the authors’ previous studies. For application in heat exchangers during manufacturing, the brazeability of 3003 aluminum alloy with these filler metals is herein further evaluated. Experimental results show that even at such a low temperature as 550 °C, the 3003 alloys can be brazed with the Al-Si-Cu fillers and display bonding strengths that are higher than 77 MPa as well. An optimized 3003 joint is attained in the brazements with the innovative Al-7Si-20Cu-2Sn-1Mg filler metal at 575 °C for 30 min, which reveals a bonding strength capping the 3003 Al matrix.

  8. Wetting and spreading behavior of molten brazing filler metallic alloys on metallic substrate

    NASA Astrophysics Data System (ADS)

    Kogi, Satoshi; Kajiura, Tetsurou; Hanada, Yukiakira; Miyazawa, Yasuyuki

    2014-08-01

    Wetting and spreading of molten brazing filler material are important factors that influence the brazing ability of a joint to be brazed. Several investigations into the wetting ability of a brazing filler alloy and its surface tension in molten state, in addition to effects of brazing time and temperature on the contact angle, have been carried out. In general, dissimilar-metals brazing technology and high-performance brazed joint are necessities for the manufacturing field in the near future. Therefore, to address this requirement, more such studies on wetting and spreading of filler material are required for a deeper understanding. Generally, surface roughness and surface conditions affect spreading of molten brazing filler material during brazing. Wetting by and interfacial reactions of the molten brazing filler material with the metallic substrate, especially, affect strongly the spreading of the filler material. In this study, the effects of surface roughness and surface conditions on the spreading of molten brazing filler metallic alloys were investigated. Ag-(40-x)Cu-xIn and Ag- (40-x)Cu-xSn (x=5, 10, 15, 20, 25) alloys were used as brazing filler materials. A mild-steel square plate (S45C (JIS); side: 30 mm; thickness: 3mm) was employed as the substrate. A few surfaces with varying roughness were prepared using emery paper. Brazing filler material and metallic base plate were first washed with acetone, and then a flux was applied to them. The filler, 50 mg, was placed on the center of the metallic base with the flux. A spreading test was performed under Ar gas using an electrically heated furnace, after which, the original spreading area, defined as the sessile drop area, and the apparent spreading area, produced by the capillary grooves, were both evaluated. It was observed that the spreading area decreased with increasing In and Sn content.

  9. Aluminum Lithium Alloy 2195 Fusion Welding Improvements with New Filler Wire

    NASA Technical Reports Server (NTRS)

    Russell, Carolyn; Bjorkman, Gerry; McCool, Carolyn (Technical Monitor)

    2000-01-01

    A viewgraph presentation outlines NASA Marshall Space Flight Center, Lockheed Martin Michoud Space Systems, and McCook Metals' development an aluminum-copper weld filler wire for fusion welding 2195 aluminum lithium. The aluminum-copper based weld filler wire has been identified as B218, which is the result of six years of weld filler wire development funded by NASA, Lockheed Martin, and McCook Metals. The Super Lightweight External Tank for the NASA Space Shuttle Program consists of 2195 welded with 4043 aluminum-silicon weld filler wire. The B218 filler wire chemistry was developed to produce enhanced 2195 weld and repair weld mechanical properties. An initial characterization of the B218 weld filler wire was performed consisting of initial weld and repair weld evaluation comparing B218 and 4043. The testing involved room temperature and cryogenic tensile testing along with fracture toughness testing. B218 weld filler wire proved to produce enhanced initial and repair weld tensile and fracture properties over 4043. B218 weld filler wire has proved to be a superior weld filler wire for welding 2195 and other aluminum lithium alloys over 4043.

  10. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    NASA Astrophysics Data System (ADS)

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2016-08-01

    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  11. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    NASA Astrophysics Data System (ADS)

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2016-05-01

    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  12. Basic principles of creating a new generation of high- temperature brazing filler alloys

    NASA Astrophysics Data System (ADS)

    Kalin, B. A.; Suchkov, A. N.

    2016-04-01

    The development of new materials is based on the formation of a structural-phase state providing the desired properties by selecting the base and the complex of alloying elements. The development of amorphous filler alloys for a high-temperature brazing has its own features that are due to the limited life cycle and the production method of brazing filler alloys. The work presents a cycle of analytical and experimental materials science investigations including justification of the composition of a new amorphous filler alloy for brazing the products from zirconium alloys at the temperature of no more than 800 °C and at the unbrazing temperature of permanent joints of more than 1200 °C. The experimental alloys have been used for manufacture of amorphous ribbons by rapid quenching, of which the certification has been made by X-ray investigations and a differential-thermal analysis. These ribbons were used to obtain permanent joints from the spacer grid cells (made from the alloy Zr-1% Nb) of fuel assemblies of the thermal nuclear reactor VVER-440. The brazed samples in the form of a pair of cells have been exposed to corrosion tests in autoclaves in superheated water at a temperature of 350 °C, a pressure of 160 MPa and duration of up to 6,000 h. They have been also exposed to destructive tests using a tensile machine. The experimental results obtained have made it possible to propose and patent a brazing filler alloy of the following composition: Zr-5.5Fe-(2.5-3.5)Be-1Nb-(5-8)Cu-2Sn-0.4Cr-(0.5-1.0)Ge. Its melting point is 780 °C and the recommended brazing temperature is 800°C.

  13. The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

    NASA Astrophysics Data System (ADS)

    Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi

    2014-11-01

    In this study, the performance of three microalloyed Sn-Ag-Cu solder interconnection compositions (Sn-3.1Ag-0.52Cu, Sn-3.0Ag-0.52Cu-0.24Bi, and Sn-1.1Ag-0.52Cu-0.1Ni) was compared under mechanical shock loading (JESD22-B111 standard) and cyclic thermal loading (40 ± 125°C, 42 min cycle) conditions. In the drop tests, the component boards with the low-silver nickel-containing composition (Sn-Ag-Cu-Ni) showed the highest average number of drops-to-failure, while those with the bismuth-containing alloy (Sn-Ag-Cu-Bi) showed the lowest. Results of the thermal cycling tests showed that boards with Sn-Ag-Cu-Bi interconnections performed the best, while those with Sn-Ag-Cu-Ni performed the worst. Sn-Ag-Cu was placed in the middle in both tests. In this paper, we demonstrate that solder strength is an essential reliability factor and that higher strength can be beneficial for thermal cycling reliability but detrimental to drop reliability. We discuss these findings from the perspective of the microstructures and mechanical properties of the three solder interconnection compositions and, based on a comprehensive literature review, investigate how the differences in the solder compositions influence the mechanical properties of the interconnections and discuss how the differences are reflected in the failure mechanisms under both loading conditions.

  14. Mechanical, structural and thermal properties of Ag-Cu and ZnO reinforced polylactide nanocomposite films.

    PubMed

    Ahmed, Jasim; Arfat, Yasir Ali; Castro-Aguirre, Edgar; Auras, Rafael

    2016-05-01

    Plasticized polylactic acid (PLA) based nanocomposite films were prepared by incorporating polyethylene glycol (PEG) and two selected nanoparticles (NPs) [silver-copper (Ag-Cu) alloy (<100 nm) and zinc oxide (ZnO) (<50 and <100 nm)] through solvent casting method. Incorporation of Ag-Cu alloy into the PLA/PEG matrix increased the glass transition temperature (Tg) significantly. The crystallinity of the nanocomposites (NCs) was significantly influenced by NP incorporation as evidenced from differential scanning calorimetry (DSC) and X-ray diffraction (XRD) analysis. The PLA nanocomposite reinforced with NPs exhibited much higher tensile strength than that of PLA/PEG blend. Melt rheology of NCs exhibited a shear-thinning behavior. The mechanical property drastically reduced with a loading of NPs, which is associated with degradation of PLA. SEM micrographs exhibited that both Ag-Cu alloy and ZnO NPs were dispersed well in the PLA film matrix. PMID:26893045

  15. High temperature silver-palladium-copper oxide air braze filler metal

    NASA Astrophysics Data System (ADS)

    Darsell, Jens Tommy

    The Ag-CuO system is currently being investigated as the basis for an air braze filler metal alloy to be used in SOFC components. The system is of interest because unlike most braze alloys, it is capable of wetting a variety of ceramic materials while being applied in an air. This thesis work examined modification of Ag-CuO filler metal system by alloying with palladium to increase the use temperature of the resulting air braze alloy. Thermal analysis was performed to track changes in the solidus and liquidus temperatures for these alloys and determine equilibrium phase present as a function of temperature and composition. Sessile drop experiments were performed to investigate the effect of palladium addition on braze wetability. The influence of copper-oxide and palladium contents on brazed joint strength was characterized by a combination of four-point bend testing and fractography. From combined thermal analysis and quenched data it was found that both the liquidus and solidus increase with increasing palladium content, and the silver-rich miscibility gap boundary could be shifted by the addition of palladium. This was employed as a tool to study the effects of two-liquid phase formation on wetting behavior. In addition, a mass loss likely attributable to silver volatilization is observed in the Pd-modified filler metals when heated over ˜1100°C. As volatilization should be avoided, the ternary alloys should be limited to 15mol% Pd. It was found by sessile drop wetting experiments that there is a definitive change in wetting behavior that corresponds directly to the miscibility gap boundary for the Pd-Ag-CuO system. The first order transition tracks with changes in the miscibility gap boundary that can be induced by increasing palladium content. This is the first experimental evidence of critical point wetting behavior reported for a metal-oxide system and further confirms that critical point wetting theory is universal. Four-point bend testing and

  16. Microstructural evolution during transient liquid phase bonding of Inconel 738LC using AMS 4777 filler alloy

    SciTech Connect

    Jalilvand, V.; Omidvar, H.; Shakeri, H.R.; Rahimipour, M.R.

    2013-01-15

    IN-738LC nickel-based superalloy was joined by transient liquid phase diffusion bonding using AMS 4777 filler alloy. The bonding process was carried out at 1050 Degree-Sign C under vacuum atmosphere for various hold times. Microstructures of the joints were studied by optical and scanning electron microscopy. Continuous centerline eutectic phases, characterized as nickel-rich boride, chromium-rich boride and nickel-rich silicide were observed at the bonds with incomplete isothermal solidification. In addition to the centerline eutectic products, precipitation of boron-rich particles was observed in the diffusion affected zone. The results showed that, as the bonding time was increased to 75 min, the width of the eutectic zone was completely removed and the joint was isothermally solidified. Homogenization of isothermally solidified joints at 1120 Degree-Sign C for 300 min resulted in the elimination of intermetallic phases formed at the diffusion affected zone and the formation of significant {gamma} Prime precipitates in the joint region. - Highlights: Black-Right-Pointing-Pointer TLP bonding of IN-738LC superalloy was performed using AMS 4777 filler alloy. Black-Right-Pointing-Pointer Insufficient diffusion time resulted in the formation of eutectic product. Black-Right-Pointing-Pointer Precipitation of B-rich particles was observed within the DAZ. Black-Right-Pointing-Pointer The extent of isothermal solidification increased with increasing holding time. Black-Right-Pointing-Pointer Homogenizing of joints resulted in the dissolution of DAZ intermetallics.

  17. Transverse-Weld Tensile Properties of a New Al-4Cu-2Si Alloy as Filler Metal

    NASA Astrophysics Data System (ADS)

    Sampath, K.

    2009-12-01

    AA2195, an Al-Cu-Li alloy in the T8P4 age-hardened condition, is a candidate aluminum armor for future combat vehicles, as this material offers higher static strength and ballistic protection than current aluminum armor alloys. However, certification of AA2195 alloy for armor applications requires initial qualification based on the ballistic performance of welded panels in the as-welded condition. Currently, combat vehicle manufacturers primarily use gas metal arc welding (GMAW) process to meet their fabrication needs. Unfortunately, a matching GMAW consumable electrode is currently not commercially available to allow effective joining of AA2195 alloy. This initial effort focused on an innovative, low-cost, low-risk approach to identify an alloy composition suitable for effective joining of AA2195 alloy, and evaluated transverse-weld tensile properties of groove butt joints produced using the identified alloy. Selected commercial off-the-shelf (COTS) aluminum alloy filler wires were twisted to form candidate twisted filler rods. Representative test weldments were produced using AA2195 alloy, candidate twisted filler rods and gas tungsten arc welding (GTAW) process. Selected GTA weldments produced using Al-4wt.%Cu-2wt.%Si alloy as filler metal consistently provided transverse-weld tensile properties in excess of 275 MPa (40 ksi) UTS and 8% El (over 25 mm gage length), thereby showing potential for acceptable ballistic performance of as-welded panels. Further developmental work is required to evaluate in detail GMAW consumable wire electrodes based on the Al-Cu-Si system containing 4.2-5.0 wt.% Cu and 1.6-2.0 wt.% Si.

  18. Effect of mechanical milling on Ni-TiH{sub 2} powder alloy filler metal for brazing TiAl intermetallic alloy: The microstructure and joint's properties

    SciTech Connect

    He Peng Liu Duo; Shang Erjing; Wang Ming

    2009-01-15

    A TiH{sub 2}-50 wt.% Ni powder alloy was mechanically milled in an argon gas atmosphere using milling times up to 480 min. A TiAl intermetallic alloy was joined by vacuum furnace brazing using the TiH{sub 2}-50 wt.% Ni powder alloy as the filler metal. The effect of mechanical milling on the microstructure and shear strength of the brazed joints was investigated. The results showed that the grains of TiH{sub 2}-50 wt.% Ni powder alloy were refined and the fusion temperature decreased after milling. A sound brazing seam was obtained when the sample was brazed at 1140 deg. C for 15 min using filler metal powder milled for 120 min. The interfacial zones of the specimens brazed with the milled filler powder were thinner and the shear strength of the joint was increased compared to specimens brazed with non-milled filler powder. A sample brazed at 1180 deg. C for 15 min using TiH{sub 2}-50 wt.% Ni powder alloy milled for 120 min exhibited the highest shear strength at both room and elevated temperatures.

  19. Study of austenitic stainless steel welded with low alloy steel filler metal. [tensile and impact strength tests

    NASA Technical Reports Server (NTRS)

    Burns, F. A.; Dyke, R. A., Jr.

    1979-01-01

    The tensile and impact strength properties of 316L stainless steel plate welded with low alloy steel filler metal were determined. Tests were conducted at room temperature and -100 F on standard test specimens machined from as-welded panels of various chemical compositions. No significant differences were found as the result of variations in percentage chemical composition on the impact and tensile test results. The weldments containing lower chromium and nickel as the result of dilution of parent metal from the use of the low alloy steel filler metal corroded more severely in a marine environment. The use of a protective finish, i.e., a nitrile-based paint containing aluminum powder, prevented the corrosive attack.

  20. EFFECT OF CHEMISTRY VARIATIONS IN PLATE AND WELD FILLER METAL ON THE CORROSION PERFORMANCE OF NI-CR-MO ALLOYS

    SciTech Connect

    D.V. Fix

    2006-02-07

    The ASTM standard B 575 provides the requirements for the chemical composition of Nickel-Chromium-Molybdenum (Ni-Cr-Mo) alloys such as Alloy 22 (N06022) and Alloy 686 (N06686). The compositions of each element are given in a range. For example, the content of Mo is specified from 12.5 to 14.5 weight percent for Alloy 22 and from 15.0 to 17.0 weight percent for Alloy 686. It was important to determine how the corrosion rate of welded plates of Alloy 22 using Alloy 686 weld filler metal would change if heats of these alloys were prepared using several variations in the composition of the elements even though still in the range specified in B 575. All the material used in this report were especially prepared at Allegheny Ludlum Co. Seven heats of plate were welded with seven heats of wire. Immersion corrosion tests were conducted in a boiling solution of sulfuric acid plus ferric sulfate (ASTM G 28 A) using both as-welded (ASW) coupons and solution heat-treated (SHT) coupons. Results show that the corrosion rate was not affected by the chemistry of the materials in the range of the standards.

  1. Heat-induced spinodal decomposition of Ag-Cu nanoparticles.

    PubMed

    Sopoušek, Jiří; Zobač, Ondřej; Buršík, Jiří; Roupcová, Pavla; Vykoukal, Vít; Brož, Pavel; Pinkas, Jiří; Vřešt'ál, Jan

    2015-11-14

    Solvothermal synthesis was used for Ag-Cu nanoparticle (NP) preparation from metallo-organic precursors. The detailed NP characterization was performed to obtain information about nanoparticle microstructure and both phase and chemical compositions. The resulting nanoparticles exhibited chemical composition inside a FCC_Ag + FCC_Cu two-phase region. The microstructure study was performed by various methods of electron microscopy including high-resolution transmission electron microscopy (HRTEM) at an atomic scale. The HRTEM and X-ray diffraction studies showed that the prepared nanoparticles form the face centred cubic (FCC) crystal lattice where the silver atoms are randomly mixed with copper. The CALPHAD approach was used for predicting the phase diagram of the Ag-Cu system in both macro- and nano-scales. The predicted spinodal decomposition of the metastable Ag-Cu nanoparticles was experimentally induced by heating on an X-ray powder diffractometer (HT XRD). The nucleation of the Cu-rich phase was detected and its growth was studied. Changes in the Ag-rich phase were observed in situ by X-ray diffraction under vacuum. The heat treatment was conducted at different maximum temperatures up to 450 °C and the resulting particle product was analysed. The experiments were complemented by differential scanning calorimetry (DSC) measurements up to liquidus temperature. The start temperatures of the spinodal phase transformation and particle aggregation were evaluated. PMID:25929324

  2. Aluminum Lithium Alloy 2195 Fusion Welding Improvements with New Filler Wire

    NASA Technical Reports Server (NTRS)

    Russell, C.

    2001-01-01

    The objective of this research was to assess the B218 weld filler wire for Super Lightweight External Tank production, which could improve current production welding and repair productivity. We took the following approaches: (1) Perform a repair weld quick look evaluation between 4043/B218 and B218/B218 weld filler wire combinations and evaluation tensile properties for planished and unplanished conditions; and (2) Perform repair weld evaluation on structural simulation panel using 4043-B218 and B218/B218 weld filler wire combinations and evaluation tensile and simulated service fracture properties for planished and unplanished conditions.

  3. Some possible filler alloys with low vapor pressures for refractory-metal brazing

    NASA Technical Reports Server (NTRS)

    Morris, J. F.

    1973-01-01

    A compilation of eutectics and melting-point minima for binary combinations of metals having vapor pressures below 10 to the minus 10th power torr at 1500 degrees K and .00005 torr at 2000 degree K is presented. These compositions and others near them on their phase diagrams are potential special brazing fillers for refractory metals. Some possible problems and advantages for fusion bonds of such mixtures are indicated. Evaluations of brazing fillers containing refractory metals are reported.

  4. Composite weld rod corrects individual filler weaknesses

    NASA Technical Reports Server (NTRS)

    Grimaldo, S.

    1967-01-01

    Composite filler wire welds together an assembly made from components of Rene 41 nickel base alloy. Using equal parts of Rene 41 and Hastelloy W weld wire in the filler reduces the cracking and weaknesses of the individual parent metals.

  5. Effect of Board Thickness on Sn-Ag-Cu Joint Interconnect Mechanical Shock Performance

    NASA Astrophysics Data System (ADS)

    Lee, Tae-Kyu; Xie, Weidong

    2014-12-01

    The mechanical stability of solder joints with Sn-Ag-Cu alloy joints on various board thicknesses was investigated with a high G level shock environment. A test vehicle with three different board thicknesses was used for board drop shock performance tests. These vehicles have three different strain and shock level condition couples per board, and are used to identify the joint stability and failure modes based on the board responses. The results revealed that joint stability is sensitive to board thickness. The board drop shock test showed that the first failure location shifts from the corner location near the standoff to the center with increased board thickness due to the shock wave response. From analysis of the thickness variation and failure cycle number, the strain rate during the pulse strain cycle is the dominant factor, which defines the life cycle number per board thickness, and not the maximum strain value. The failure location shift and the shock performance differentiation are discussed from the perspective of maximum principal strain, cycle frequency and strain rate per cycle.

  6. Increasing Ti-6Al-4V brazed joint strength equal to the base metal by Ti and Zr amorphous filler alloys

    SciTech Connect

    Ganjeh, E.; Sarkhosh, H.; Bajgholi, M.E.; Khorsand, H.; Ghaffari, M.

    2012-09-15

    Microstructural features developed along with mechanical properties in furnace brazing of Ti-6Al-4V alloy using STEMET 1228 (Ti-26.8Zr-13Ni-13.9Cu, wt.%) and STEMET 1406 (Zr-9.7Ti-12.4Ni-11.2Cu, wt.%) amorphous filler alloys. Brazing temperatures employed were 900-950 Degree-Sign C for the titanium-based filler and 900-990 Degree-Sign C for the zirconium-based filler alloys, respectively. The brazing time durations were 600, 1200 and 1800 s. The brazed joints were evaluated by ultrasonic test, and their microstructures and phase constitutions analyzed by metallography, scanning electron microscopy and X-ray diffraction analysis. Since microstructural evolution across the furnace brazed joints primarily depends on their alloying elements such as Cu, Ni and Zr along the joint. Accordingly, existence of Zr{sub 2}Cu, Ti{sub 2}Cu and (Ti,Zr){sub 2}Ni intermetallic compounds was identified in the brazed joints. The chemical composition of segregation region in the center of brazed joints was identical to virgin filler alloy content which greatly deteriorated the shear strength of the joints. Adequate brazing time (1800 s) and/or temperature (950 Degree-Sign C for Ti-based and 990 Degree-Sign C for Zr-based) resulted in an acicular Widmanstaetten microstructure throughout the entire joint section due to eutectoid reaction. This microstructure increased the shear strength of the brazed joints up to the Ti-6Al-4V tensile strength level. Consequently, Ti-6Al-4V can be furnace brazed by Ti and Zr base foils produced excellent joint strengths. - Highlights: Black-Right-Pointing-Pointer Temperature or time was the main factors of controlling braze joint strength. Black-Right-Pointing-Pointer Developing a Widmanstaetten microstructure generates equal strength to base metal. Black-Right-Pointing-Pointer Brittle intermetallic compounds like (Ti,Zr){sub 2}Ni/Cu deteriorate shear strength. Black-Right-Pointing-Pointer Ti and Zr base filler alloys were the best choice for brazing Ti

  7. Surface modification of oleylamine-capped Ag-Cu nanoparticles to fabricate low-temperature-sinterable Ag-Cu nanoink.

    PubMed

    Kim, Na Rae; Lee, Yung Jong; Lee, Changsoo; Koo, Jahyun; Lee, Hyuck Mo

    2016-08-26

    By treating oleylamine (OA)-capped Ag-Cu nanoparticles with tetramethylammonium hydroxide (TMAH), we obtained metal nanoparticles that are suspended in polar solvents and sinterable at low temperatures. The simple process with ultra sonication enables synthesis of monodispersed and high purity nanoparticles in an organic base, where the resulting nanoparticles are dispersible in polar solvents such as ethanol and isopropyl alcohol. To investigate the surface characteristics, we conducted Fourier-transform infrared and zeta-potential analyses. After thermal sintering at 200 °C, which is approximately 150 °C lower than the thermal decomposition temperature of OA, an electrically conductive thin film was obtained. Electrical resistivity measurements of the TMAH-treated ink demonstrate that surface modified nanoparticles have a low resistivity of 13.7 × 10(-6) Ω cm. These results confirm the prospects of using low-temperature sinterable nanoparticles as the electrode layer for flexible printed electronics without damaging other stacked polymer layers. PMID:27454465

  8. Rapidly solidified Ag-Cu eutectics: A comparative study using drop-tube and melt fluxing techniques

    NASA Astrophysics Data System (ADS)

    Yu, Y.; Mullis, A. M.; Cochrane, R. F.

    2016-03-01

    A comparative study of rapid solidification of Ag-Cu eutectic alloy processed via melt fluxing and drop-tube techniques is presented. A computational model is used to estimate the cooling rate and undercooling of the free fall droplets as this cannot be determined directly. SEM micrographs show that both materials consist of lamellar and anomalous eutectic structures. However, below the critical undercooling the morphologies of each are different in respect of the distribution and volume of anomalous eutectic. The anomalous eutectic in flux- undercooled samples preferentially forms at cell boundaries around the lamellar eutectic in the cell body. In drop-tube processed samples it tends to distribute randomly inside the droplets and at much smaller volume fractions. That the formation of the anomalous eutectic can, at least in part, be suppressed in the drop-tube is strongly suggestive that the formation of anomalous eutectic occurs via remelting process, which is suppressed by rapid cooling during solidification.

  9. Ag-Cu nanoalloyed film as a high-performance cathode electrocatalytic material for zinc-air battery

    NASA Astrophysics Data System (ADS)

    Lei, Yimin; Chen, Fuyi; Jin, Yachao; Liu, Zongwen

    2015-04-01

    A novel Ag50Cu50 film electrocatalyst for oxygen reduction reaction (ORR) was prepared by pulsed laser deposition (PLD) method. The electrocatalyst actually is Ag-Cu alloyed nanoparticles embedded in amorphous Cu film, based on transmission electron microscopy (TEM) characterization. The rotating disk electrode (RDE) measurements provide evidence that the ORR proceed via a four-electron pathway on the electrocatalysts in alkaline solution. And it is much more efficient than pure Ag catalyst. The catalytic layer has maximum power density of 67 mW cm-2 and an acceptable cell voltage at 0.863 V when current densities increased up to 100 mA cm-2 in the Ag50Cu50-based primary zinc-air battery. The resulting rechargeable zinc-air battery exhibits low charge-discharge voltage polarization of 1.1 V at 20 mAcm-2 and high durability over 100 cycles in natural air.

  10. Phase constitution and interface structure of nano-sized Ag-Cu/AlN multilayers: Experiment and ab initio modeling

    SciTech Connect

    Pigozzi, Giancarlo; Janczak-Rusch, Jolanta; Passerone, Daniele; Antonio Pignedoli, Carlo; Patscheider, Joerg; Jeurgens, Lars P. H.; Antusek, Andrej; Parlinska-Wojtan, Magdalena; Bissig, Vinzenz

    2012-10-29

    Nano-sized Ag-Cu{sub 8nm}/AlN{sub 10nm} multilayers were deposited by reactive DC sputtering on {alpha}-Al{sub 2}O{sub 3}(0001) substrates. Investigation of the phase constitution and interface structure of the multilayers evidences a phase separation of the alloy sublayers into nanosized grains of Ag and Cu. The interfaces between the Ag grains and the quasi-single-crystalline AlN sublayers are semi-coherent, whereas the corresponding Cu/AlN interfaces are incoherent. The orientation relationship between Ag and AlN is constant throughout the entire multilayer stack. These observations are consistent with atomistic models of the interfaces as obtained by ab initio calculations.

  11. Interplay between structural symmetry and magnetism in Ag-Cu

    NASA Astrophysics Data System (ADS)

    Yen, Tsung-Wen; Lai, S. K.

    2016-01-01

    We present first-principles theoretical calculations of the magnetic properties of bimetallic clusters Ag-Cu. The calculations proceeded by combining a previously developed state-of-the-art optimization algorithm (P.J. Hsu, S.K. Lai, J. Chem. Phys. 124 (2006) 0447110) with an empirical potential and applied this numerical scheme to determine first the lowest energy structures of pure clusters Ag38 and Cu38, and also their different atomic compositions AgnCu38-n for n=1,2,…,37. Then, we carried out the Kohn-Sham spin unrestricted density functional theory calculations on the optimized atomic structures obtained in the preceding step. Given the minimized structures from the first step as input configurations, the results of these re-optimized structures by full density functional theory calculations yield more refined electronic and atomic structures. A thorough comparison of the structural differences between these two sets of atomic geometries, one from using an empirical potential in which the electronic degrees of freedom were included approximately and another from subsequent minimization using the spin unrestricted density functional theory, sheds light on how the electronic charges disperse near atoms in clusters AgnCu38-n, and hence the distributions of electronic spin and charge densities at re-optimized sites of the cluster. These data of the electronic dispersion and the ionic configuration give clue to the mystery of the unexpected net magnetic moments which were found in some of the clusters AgnCu38-n at n=1-4, 24 as well as the two pure clusters. Possible origins for this unanticipated magnetism were explained in the context of the point group theory in much the same idea as the Clemenger-Nilsson model applied to simple metal clusters except that we draw particular attention to the atomic topologies and stress the bearing that they have on valence electrons in inducing them to disperse and occupy different molecular orbital energy levels.

  12. Development of filler metals for welding of iron aluminide alloys. Final report

    SciTech Connect

    Goodwin, G.M.; Scott, J.L.

    1995-06-29

    Attempts were made to develop a coating formulation for shielded metal arc (SMA) welding electrodes for iron aluminide alloys. Core wires of various compositions were produced by aspiration casting at ORNL and coating formulation development was conducted by Devasco, Inc. It was found that, except for weld deposit compositions containing less than 10 weight % aluminum, all weld deposits exhibited extensive cold cracking and/or porosity. It was concluded that current coating formulation technology limits successful iron aluminide deposits to less than 10 weight % aluminum.

  13. Characterization and device performance of (AgCu)(InGa)Se2 absorber layers

    SciTech Connect

    Hanket, Gregory; Boyle, Jonathan H.; Shafarman, William N.

    2009-06-08

    The study of (AgCu)(InGa)Se2 absorber layers is of interest in that Ag-chalcopyrites exhibit both wider bandgaps and lower melting points than their Cu counterparts. (AgCu)(InGa)Se2 absorber layers were deposited over the composition range 0 < Ag/(Ag+Cu) < 1 and 0.3 < Ga/(In+Ga) < 1.0 using a variety of elemental co-evaporation processes. Films were found to be singlephase over the entire composition range, in contrast to prior studies. Devices with Ga content 0.3 < Ga/(In+Ga) <0.5 tolerated Ag incorporation up to Ag/(Ag+Cu) = 0.5 without appreciable performance loss. Ag-containing films with Ga/(In+Ga) = 0.8 showed improved device characteristics over Cu-only control samples, in particular a 30-40% increase in short-circuit current. An absorber layer with composition Ag/(Ag+Cu) = 0.75 and Ga/(In+Ga) = 0.8 yielded a device with VOC = 890 mV, JSC = 20.5mA/cm2, fill factor = 71.3%, and η = 13.0%.

  14. The Apparent Contact Angle and Wetted Area of Active Alloys on Silicon Carbide as a Function of the Temperature and the Surface Roughness: A Multivariate Approach

    NASA Astrophysics Data System (ADS)

    Tillmann, Wolfgang; Pfeiffer, Jan; Wojarski, Lukas

    2015-08-01

    Despite the broad field of applications for active filler alloys for brazing ceramics, as well as intense research work on the wetting and spreading behavior of these alloys on ceramic surfaces within the last decades, the manufactured joints still exhibit significant variations in their properties due to the high sensitivity of the alloys to changing brazing conditions. This increases the need for investigations of the wetting and spreading behavior of filler alloys with regard to the dominating influences combined with their interdependencies, instead of solely focusing on single parameter investigations. In this regard, measurements of the wetting angle and area were conducted at solidified AgCuTi and CuSnTi alloys on SiC substrates. Based on these measurements, a regression model was generated, illustrating the influence of the brazing temperature, the roughness of the faying surfaces, the furnace atmosphere, and their interdependencies on the wetting and spreading behavior of the filler alloys. It was revealed that the behavior of the melts was significantly influenced by the varied brazing parameters, as well as by their interdependencies. This result was also predicted by the developed model and showed a high accuracy.

  15. Laser Weldability of High-Strength Al-Zn Alloys and Its Improvement by the Use of an Appropriate Filler Material

    NASA Astrophysics Data System (ADS)

    Enz, Josephin; Riekehr, Stefan; Ventzke, Volker; Huber, Norbert; Kashaev, Nikolai

    2016-04-01

    Heat-treatable Al-Zn alloys are promising candidates for use as structural lightweight materials in automotive and aircraft applications. This is mainly due to their high strength-to-density ratio in comparison to conventionally employed Al alloys. Laser beam welding is an efficient method for producing joints with high weld quality and has been established in the industry for many years. However, it is well known that aluminum alloys with a high Zn content or, more precisely, with a high (Zn + Mg + Cu) content are difficult to fusion weld due to the formation of porosity and hot cracks. The present study concerns the laser weldability of these hard-to-weld Al-Zn alloys. In order to improve weldability, it was first necessary to understand the reasons for weldability problems and to identify crucial influencing factors. Based on this knowledge, it was finally possible to develop an appropriate approach. For this purpose, vanadium was selected as additional filler material. Vanadium exhibits favorable thermophysical properties and, thereby, can improve the weldability of Al-Zn alloys. The effectiveness of the approach was verified by its application to several Al-Zn alloys with differing amounts of (Zn + Mg + Cu).

  16. Laser Weldability of High-Strength Al-Zn Alloys and Its Improvement by the Use of an Appropriate Filler Material

    NASA Astrophysics Data System (ADS)

    Enz, Josephin; Riekehr, Stefan; Ventzke, Volker; Huber, Norbert; Kashaev, Nikolai

    2016-06-01

    Heat-treatable Al-Zn alloys are promising candidates for use as structural lightweight materials in automotive and aircraft applications. This is mainly due to their high strength-to-density ratio in comparison to conventionally employed Al alloys. Laser beam welding is an efficient method for producing joints with high weld quality and has been established in the industry for many years. However, it is well known that aluminum alloys with a high Zn content or, more precisely, with a high (Zn + Mg + Cu) content are difficult to fusion weld due to the formation of porosity and hot cracks. The present study concerns the laser weldability of these hard-to-weld Al-Zn alloys. In order to improve weldability, it was first necessary to understand the reasons for weldability problems and to identify crucial influencing factors. Based on this knowledge, it was finally possible to develop an appropriate approach. For this purpose, vanadium was selected as additional filler material. Vanadium exhibits favorable thermophysical properties and, thereby, can improve the weldability of Al-Zn alloys. The effectiveness of the approach was verified by its application to several Al-Zn alloys with differing amounts of (Zn + Mg + Cu).

  17. Wrinkle Fillers

    MedlinePlus

    ... appear weeks, months or years after injection. Allergy testing is required for particular types of filler materials, such as those taken from animals (e.g., cows, rooster combs). The following risks ...

  18. Atomic-scale investigation of interface-facilitated deformation twinning in severely deformed Ag-Cu nanolamellar composites

    SciTech Connect

    An, X. H. E-mail: xiaozhou.liao@sydenye.edu.au; Cao, Y.; Liao, X. Z. E-mail: xiaozhou.liao@sydenye.edu.au; Zhu, S. M.; Nie, J. F.; Kawasaki, M.; Ringer, S. P.; Langdon, T. G.; Zhu, Y. T.

    2015-07-06

    We report an atomic-scale investigation of interface-facilitated deformation twinning behaviour in Ag-Cu nanolamellar composites. Profuse twinning activities in Ag supply partial dislocations to directly transmit across the Ag-Cu lamellar interface that promotes deformation twinning in the neighbouring Cu lamellae although the interface is severely deformed. The trans-interface twin bands change the local structure at the interface. Our analysis suggests that the orientation relationship and interfacial structure between neighbouring Ag-Cu lamellae play a crucial role in such special interface-facilitated twinning behaviour.

  19. The effect of palladium additions on the solidus/liquidus temperatures and wetting properties of Ag-CuO based air brazes

    SciTech Connect

    Darsell, Jens T.; Weil, K. Scott

    2007-01-01

    A new ceramic brazing technique referred to as reactive air brazing (RAB) has recently been developed for potential applications in high temperature devices such as gas concentrators, solid oxide fuel cells, gas turbines, and combustion engines. At present, the technique utilizing a silver-copper oxide system is of great interest. The maximum operating temperature of this system is limited by its eutectic temperature of ~945°C, although in practice the operating temperature will need to be lower. An obvious strategy that can be employed to increase the maximum operating temperature of the braze material is to add a higher melting noble alloying element. In this paper, we report the effects of palladium addition on the melting characteristics of the Ag-CuO system and on the wetting properties of the resulting braze with respect to alumina. It was found that the addition of Pd will cause an increase in the melting temperature of the Ag-CuO braze but possibly at a sacrifice of wetting properties depending on composition.

  20. Brazing ZrO{sub 2} ceramic to Ti–6Al–4V alloy using NiCrSiB amorphous filler foil: Interfacial microstructure and joint properties

    SciTech Connect

    Cao, J.; Song, X.G.; Li, C.; Zhao, L.Y.; Feng, J.C.

    2013-07-15

    Reliable brazing of ZrO{sub 2} ceramic and Ti–6Al–4V alloy was achieved using NiCrSiB amorphous filler foil. The interfacial microstructure of ZrO{sub 2}/Ti–6Al–4V joints was characterized by scanning electron microscope, energy dispersive spectrometer and micro-focused X-ray diffractometer. The effects of brazing temperature on the interfacial microstructure and joining properties of brazed joints were investigated in detail. Active Ti of Ti–6Al–4V alloy dissolved into molten filler metal and reacted with ZrO{sub 2} ceramic to form a continuous TiO reaction layer, which played an important role in brazing. Various reaction phases including Ti{sub 2}Ni, Ti{sub 5}Si{sub 3} and β-Ti were formed in brazed joints. With an increasing of brazing temperature, the TiO layer thickened gradually while the Ti{sub 2}Ni amount reduced. Shear test indicated that brazed joints tend to fracture at the interface between ZrO{sub 2} ceramic and brazing seam or Ti{sub 2}Ni intermetallic layer. The maximum average shear strength reached 284.6 MPa when brazed at 1025 °C for 10 min. - Graphical Abstract: Interfacial microstructure of ZrO{sub 2}/TC4 joint brazed using NiCrSiB amorphous filler foil was: ZrO{sub 2}/TiO/Ti{sub 2}Ni + β-Ti + Ti{sub 5}Si{sub 3}/β-Ti/Widmanstätten structure/TC4. - Highlights: • Brazing of ZrO{sub 2} ceramic and Ti-6Al-4V alloy was achieved. • Interfacial microstructure was TiO/Ti{sub 2}Ni + β + Ti{sub 5}Si{sub 3}/β/Widmanstätten structure. • The formation of TiO produced the darkening effect of ZrO{sub 2} ceramic. • The highest joining strength of 284.6MPa was obtained.

  1. Nanostructured YbAgCu4 for potentially cryogenic thermoelectric cooling.

    PubMed

    Koirala, Machhindra; Wang, Hui; Pokharel, Mani; Lan, Yucheng; Guo, Chuanfei; Opeil, Cyril; Ren, Zhifeng

    2014-09-10

    We have studied the thermoelectric properties of nanostructured YbAgCu4 materials. A high power factor of ∼131 μW cm(-1) K(-2) has been obtained at 22 K for nanostructured samples prepared by ball milling the arc melted ingot into nanopowder and hot pressing the nanopowder. The implementation of nanostructuring method decreased the thermal conductivity at 42 K by 30-50% through boundary scattering comparing with the previously reported value of polycrystalline YbAgCu4. A peak dimensionless thermoelectric figure-of-merit, ZT, of 0.11 has been achieved at 42 K, which may find potential applications for cryogenic cooling below 77 K. The nanostructuring approach can be extended to other heavy Fermion materials to achieve high power factor and low thermal conductivity and ultimately higher ZT. PMID:25079115

  2. Preparation of Ag/Cu Janus nanowires: Electrodeposition in track-etched polymer templates

    NASA Astrophysics Data System (ADS)

    Zhu, X. R.; Wang, C. M.; Fu, Q. B.; Jiao, Z.; Wang, W. D.; Qin, G. Y.; Xue, J. M.

    2015-08-01

    Bimetal (Janus) nanowire has been widely used as a promising nanoscale motor. In this paper we present a highly controllable method to fabricate Ag/Cu Janus nanowires using track-etched polymer templates. Ag/Cu Janus nanowires with uniform size and stabilized structure have been successfully fabricated by electrodepositing Ag nanowires, and subsequently Cu nanowires in track-etched polymer templates. The pore size of nanopores prepared by this template is uniform and continuously controlled, so aperture of achieved nanowires are uniform and can be regulated. This polymer template can dissolve inorganic solvents that do not react with the nanowires, making it is easy to release the nanowires into solution. The nanopore shape in the track-etched templates is adjustable (e.g. conical), nanowires with more special shapes could be fabricated. Thus, these features make this simple and inexpensive method very suitable for the preparation of Janus nanowire.

  3. Size Control and Characterization of Sn-Ag-Cu Lead-Free Nanosolders by a Chemical Reduction Process

    NASA Astrophysics Data System (ADS)

    Yung, K. C.; Law, C. M. T.; Lee, C. P.; Cheung, B.; Yue, T. M.

    2012-02-01

    Sn-3.0Ag-0.5Cu nanosolders were synthesized via a chemical reduction method. Polyvinyl pyrrolidone (PVP) and sodium borohydride (NaBH4) were employed as surfactant and reducing agent, respectively. Ultraviolet-visible (UV-visible) absorption and x-ray diffraction patterns revealed that alloying had successfully taken place during the reduction process. Different amounts of PVP and NaBH4 additions influenced the nanosolder particle size. Under varying reaction temperatures and pH values, various ranges of nanosolder size were obtained. Optimized nanosolders were studied by differential scanning calorimetry to investigate the depression of the melting temperature, and were analyzed by transmission electron microscopy to measure actual particle sizes. The dependence of the particle size on the melting temperature was observed. The melting point was depressed to 204.4°C when the average diameter of the nanosolders was 20 nm. Although SnO2 was formed on the nanosolders, it could be cleaned by citric acid. These low-melting-temperature Sn-Ag-Cu nanosolders are candidates for use in lead-free interconnect applications.

  4. Ag-Cu nanoalloyed film as a high-performance cathode electrocatalytic material for zinc-air battery.

    PubMed

    Lei, Yimin; Chen, Fuyi; Jin, Yachao; Liu, Zongwen

    2015-01-01

    A novel Ag50Cu50 film electrocatalyst for oxygen reduction reaction (ORR) was prepared by pulsed laser deposition (PLD) method. The electrocatalyst actually is Ag-Cu alloyed nanoparticles embedded in amorphous Cu film, based on transmission electron microscopy (TEM) characterization. The rotating disk electrode (RDE) measurements provide evidence that the ORR proceed via a four-electron pathway on the electrocatalysts in alkaline solution. And it is much more efficient than pure Ag catalyst. The catalytic layer has maximum power density of 67 mW cm(-2) and an acceptable cell voltage at 0.863 V when current densities increased up to 100 mA cm(-2) in the Ag50Cu50-based primary zinc-air battery. The resulting rechargeable zinc-air battery exhibits low charge-discharge voltage polarization of 1.1 V at 20 mAcm(-2) and high durability over 100 cycles in natural air. PMID:25977668

  5. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    NASA Astrophysics Data System (ADS)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  6. Effect of Synthesis Techniques on Crystallization and Optical Properties of Ag-Cu Bimetallic Nanoparticles

    NASA Astrophysics Data System (ADS)

    Xiong, Ziye; Qin, Fen; Huang, Po-Shun; Nettleship, Ian; Lee, Jung-Kun

    2016-04-01

    Silver (Ag)-copper (Cu) bimetallic nanoparticles (NPs) were synthesized by the reduction of silver nitrate and copper (II) acetate monohydrate using ethylene glycol in a microwave (MW) heating system with controlled reaction times ranging from 5 min to 30 min. The molar ratio Ag/Cu was varied from 1:1 to 1:3. The effect of reaction conditions on the bimetallic NPs structures and compositions were characterized by x-ray photoelectron spectroscopy, x-ray diffraction and transmission electron microscopy. The average particle size was approximately 150 nm. The surface plasmon resonance (SPR) of Ag-Cu bimetallic NPs was investigated by monitoring the SPR band peak behavior via UV/Vis spectrophotometry. The resonance peak positions and peak widths varied due to the different structures of the bimetallic NPs created under the synthesis conditions. In the MW heating method, the reduction of Cu was increased and Cu was inhomogeneously deposited over the Ag cores. As the composition of Cu becoming higher in the Ag-Cu bimetallic NPs, the absorption between 400 nm to 600 nm was greatly enhanced.

  7. Experimental determination of TRIP-parameter K for mild- and high-strength low-alloy steels and a super martensitic filler material.

    PubMed

    Neubert, Sebastian; Pittner, Andreas; Rethmeier, Michael

    2016-01-01

    A combined experimental numerical approach is applied to determine the transformation induced plasticity (TRIP)-parameter K for different strength low-alloy steels of grade S355J2+N and S960QL as well as the super martensitic filler CN13-4-IG containing 13 wt% chromium and 4 wt% nickel. The thermo-physical analyses were conducted using a Gleeble (®) 3500 facility. The thermal histories of the specimens to be tested were extracted from corresponding simulations of a real gas metal arc weldment. In contrast to common TRIP-experiments which are based on complex specimens a simple flat specimen was utilized together with an engineering evaluation method. The evaluation method was validated with literature values for the TRIP-parameter. It could be shown that the proposed approach enables a correct description of the TRIP behavior. PMID:27386237

  8. Structure and some magnetic properties of thin films prepared from Fe{sub 73.5}M{sub 1}Nb{sub 3}Si{sub 13.5}B{sub 9} (M:Ag,Cu,Pd,Pt) alloys

    SciTech Connect

    Goscianska, I.; Ratajczak, H.; Sovak, P.; Konc, M.; Matta, P.

    1994-03-01

    Thin films of Fe-(M-Nb)-Si-B alloys have been prepared by flash evaporation method. Thermal treatment has been used which should lead to generation of {alpha}-FeSi ultrafine phase. Structural observations showed that the process of film crystallization depends rather on the initial state of the as-deposited films than on the sort of the alloy (M). Either amorphous or crystalline structure was observed in the as-deposited samples which crystallized upon annealing in two different ways. A large amount of the ultrafine phase crystallized in the film which was amorphous when as-deposited and subsequently annealed to optimum conditions. However, a fully homogeneous {alpha}-FeSi ultrafine structure throughout the studied films has never been obtained. Magnetic saturation induction and extraordinary Hall coefficient have been determined by Hall effect measurement.

  9. On the correlation between phonon spectra and surface segregation features in Ag-Cu-Ni ternary nanoalloys

    NASA Astrophysics Data System (ADS)

    Subbaraman, Ram; Sankaranarayanan, Subramanian K. R. S.

    2011-08-01

    Atomic scale characterization of chemical ordering, compositional distribution and microstructure is of tremendous importance for applications such as catalysis which is primarily dominated by processes occurring at surface and is strongly influenced by the subsurface layers. Phonon spectra obtained from molecular dynamics simulations of single metals as well as their bimetallic and ternary alloy nanoclusters can be used to obtain new insights into the atomic scale distribution in the nanoclusters, their microstructure and dynamical properties. Monte-Carlo (MC) simulations are used to obtain the minimum energy configurations of various Ag-Cu-Ni ternary alloys in which the Ag content is systematically varied from 0 to 50%Ag while keeping the relative composition of Cu and Ni constant. Detailed compositional analyses of the final MC configurations are carried out. The generated microstructure comprised of surface segregated structures in which Ag atoms occupy low coordination sites such as corners, edges and faces. As the Ag content in the ternary alloy is increased, the surface sites get increasingly occupied with the lowest coordination sites being populated first. The Cu and Ni compositions in the interior of the cluster show compositional oscillation. The final alloy microstructure is dictated by the competition between the various entropic and energetic factors. Our analysis of the phonon density of states identifies various surface (low frequency) and bulk (high frequency) modes which is determined by their location in the nanocluster and the local environment. Systematic trends in the observed peak intensities and frequency shifts at the low and high frequency ends of the spectrum for the various alloy compositions are explained on the basis of bond-lengths, local coordination, extent of alloying, and neighboring elemental environment. We find that the characteristic microstructural features observed at the atomic scale are strongly correlated to the

  10. Microstructure and Mechanical Properties of Dissimilar Welded Ti3Al/Ni-Based Superalloy Joint Using a Ni-Cu Filler Alloy

    NASA Astrophysics Data System (ADS)

    Chen, Bing-Qing; Xiong, Hua-Ping; Guo, Shao-Qing; Sun, Bing-Bing; Chen, Bo; Tang, Si-Yi

    2015-02-01

    Dissimilar welding of a Ti3Al-based alloy and a Ni-based superalloy (Inconel 718) was successfully carried out using gas tungsten arc welding technology in this study. With a Ni-Cu alloy as filler material, sound joints have been obtained. The microstructure evolution along the cross section of the dissimilar joint has been revealed based on the results of scanning electron microscopy and X-ray energy dispersive spectroscopy as well as X-ray diffractometer. It is found that the weld/Ti3Al interface is composed of Ti2AlNb matrix dissolved with Ni and Cu, Al(Cu, Ni)2Ti, (Cu, Ni)2Ti, (Nb, Ti) solid solution, and so on. The weld and In718/weld interface mainly consist of (Cu, Ni) solid solutions. The weld exhibits higher microhardness than the two base materials. The average room-temperature tensile strength of the joints reaches 242 MPa and up to 73.6 pct of the value can be maintained at 873 K (600 °C). The brittle intermetallic phase of Ti2AlNb matrix dissolved with Ni and Cu at the weld/Ti3Al interface is the weak link of the joint.

  11. 46 CFR 56.75-5 - Filler metal.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 46 Shipping 2 2012-10-01 2012-10-01 false Filler metal. 56.75-5 Section 56.75-5 Shipping COAST... Brazing § 56.75-5 Filler metal. (a) The filler metal used in brazing must be a nonferrous metal or alloy having a melting point above 1,000 °F. and below that of the metal being joined. The filler metal...

  12. 46 CFR 56.75-5 - Filler metal.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 46 Shipping 2 2013-10-01 2013-10-01 false Filler metal. 56.75-5 Section 56.75-5 Shipping COAST... Brazing § 56.75-5 Filler metal. (a) The filler metal used in brazing must be a nonferrous metal or alloy having a melting point above 1,000 °F. and below that of the metal being joined. The filler metal...

  13. 46 CFR 56.75-5 - Filler metal.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 46 Shipping 2 2014-10-01 2014-10-01 false Filler metal. 56.75-5 Section 56.75-5 Shipping COAST... Brazing § 56.75-5 Filler metal. (a) The filler metal used in brazing must be a nonferrous metal or alloy having a melting point above 1,000 °F. and below that of the metal being joined. The filler metal...

  14. 46 CFR 56.75-5 - Filler metal.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 46 Shipping 2 2011-10-01 2011-10-01 false Filler metal. 56.75-5 Section 56.75-5 Shipping COAST... Brazing § 56.75-5 Filler metal. (a) The filler metal used in brazing must be a nonferrous metal or alloy having a melting point above 1,000 °F. and below that of the metal being joined. The filler metal...

  15. 46 CFR 56.75-5 - Filler metal.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Filler metal. 56.75-5 Section 56.75-5 Shipping COAST... Brazing § 56.75-5 Filler metal. (a) The filler metal used in brazing must be a nonferrous metal or alloy having a melting point above 1,000 °F. and below that of the metal being joined. The filler metal...

  16. Chemical elements diffusion in the stainless steel components brazed with Cu-Ag alloy

    NASA Astrophysics Data System (ADS)

    Voiculescu, I.; Geanta, V.; Vasile, I. M.; Binchiciu, E. F.; Winestoock, R.

    2016-06-01

    The paper presents the study of diffusion of chemical elements through a brazing joint, between two thin components (0.5mm) made of stainless steel 304. An experimental brazing filler material has been used for brazing stainless steel component and then the diffusion phenomenon has been studied, in terms of chemical element displacement from the brazed separation interface. The filler material is in the form of a metal rod coated with ceramic slurry mixture of minerals, containing precursors and metallic powders, which can contribute to the formation of deposit brazed. In determining the distance of diffusion of chemical elements, on both sides of the fusion line, were performed measurements of the chemical composition using electron microscopy SEM and EDX spectrometry. Metallographic analysis of cross sections was performed with the aim of highlight the microstructural characteristics of brazed joints, for estimate the wetting capacity, adherence of filler metal and highlight any imperfections. Analyzes performed showed the penetration of alloying elements from the solder (Ag, Cu, Zn and Sn) towards the base material (stainless steel), over distances up to 60 microns.

  17. The Effect of TiO2 on the Wetting Behavior of Silver-copper Oxide Braze Filler Metals

    SciTech Connect

    Weil, K. Scott; Kim, Jin Yong Y.; Hardy, John S.; Darsell, Jens T.

    2006-03-01

    A series of silver-copper oxide ceramic brazing alloys was compositionally modified by doping with small amounts of titania. Subsequent contact angle measurements indicate that concentrations as low as 0.5 mol% TiO2 can significantly enhance wettability over a wide range of binary Ag-CuOx compositions.

  18. Efficient enhancement of hydrogen production by Ag/Cu2O/ZnO tandem triple-junction photoelectrochemical cell

    NASA Astrophysics Data System (ADS)

    Liu, Ying; Ren, Feng; Shen, Shaohua; Fu, Yanming; Chen, Chao; Liu, Chang; Xing, Zhuo; Liu, Dan; Xiao, Xiangheng; Wu, Wei; Zheng, Xudong; Liu, Yichao; Jiang, Changzhong

    2015-03-01

    Highly efficient semiconductor photoelectrodes for solar hydrogen production through photocatalytic water splitting are a promising and challenge solution to solve the energy problems. In this work, Ag/Cu2O/ZnO tandem triple-junction photoelectrode was designed and prepared. An increase of 11 times of photocurrent is achieved in the Ag/Cu2O/ZnO photoelectrode comparing to that of the Cu2O film. The high performance of the Ag/Cu2O/ZnO film is due to the optimized design of the tandem triple-junction structure, where the localized surface Plasmon resonance of Ag and the hetero-junctions efficiently absorb solar energy, produce, and separate electron-hole pairs in the photocathode.

  19. AgCuVO4 : A quasi-one-dimensional S=(1)/(2) chain compound

    NASA Astrophysics Data System (ADS)

    Möller, A.; Schmitt, M.; Schnelle, W.; Förster, T.; Rosner, H.

    2009-09-01

    We present a joint experimental and computational study of the recently synthesized spin 1/2 system silver-copper-orthovanadate AgCuVO4 [A. Möller and J. Jainski, Z. Anorg. Allg. Chem. 634, 1669 (2008)] exhibiting chains of trans corner-sharing [CuO4] plaquettes. The static magnetic susceptibility and specific heat measurements of AgCuVO4 can be described to a good approximation by the Bonner-Fisher spin-chain model with Jintra≈330K . Evidence for a Néel-type of order at ˜2.5K is obtained from the specific heat and corroborated by ESR studies. To independently obtain a microscopically based magnetic model, density functional electronic structure calculations were performed. In good agreement with the experimental data, we find pronounced one-dimensional magnetic exchange along the corner-sharing chains with small interchain couplings. The difference between the experimentally observed and the calculated ordering temperature can be assigned to a sizable interchain frustration derived from the calculations.

  20. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    NASA Astrophysics Data System (ADS)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  1. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    NASA Astrophysics Data System (ADS)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-04-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  2. Characterization of Binary Ag-Cu Ion Mixtures in Zeolites: Their Reduction Products and Stability to Air Oxidation

    SciTech Connect

    Fiddy, Steven; Petranovskii, Vitalii; Ogden, Steve; Iznaga, Inocente Rodriguez

    2007-02-02

    A series of Ag+-Cu2+ binary mixtures with different Ag/Cu ratios were supported on mordenite with different Si/Al ratios and were subsequently reduced under hydrogen in the temperature range 323K - 473K. Ag and Cu K-edge X-ray Absorption Spectroscopy (XAS) was conducted on these systems in-situ to monitor the reduction species formed and the kinetics of their reduction. In-situ XANES clearly demonstrates that the formation of silver particles is severely impeded by the addition of copper and that the copper is converted from Cu(II) to Cu(I) during reduction and completely reverts back to Cu(II) during cooling. There are no indications at any stage of the formation of bimetallic Ag-Cu clusters. Interestingly, the Ag/Cu ratio appears to have no influence of the reduction kinetics and reduction products formed with only the highest Si/Al ratio (MR = 128) investigated during this study having an influence on the reduction and stability to air oxidation.

  3. Kinetic trapping through coalescence and the formation of patterned Ag-Cu nanoparticles

    NASA Astrophysics Data System (ADS)

    Grammatikopoulos, Panagiotis; Kioseoglou, Joseph; Galea, Antony; Vernieres, Jerome; Benelmekki, Maria; Diaz, Rosa E.; Sowwan, Mukhles

    2016-05-01

    In recent years, due to its inherent flexibility, magnetron-sputtering has been widely used to synthesise bi-metallic nanoparticles (NPs) via subsequent inert-gas cooling and gas-phase condensation of the sputtered atomic vapour. Utilising two separate sputter targets allows for good control over composition. Simultaneously, it involves fast kinetics and non-equilibrium processes, which can trap the nascent NPs into metastable configurations. In this study, we observed such configurations in immiscible, bi-metallic Ag-Cu NPs by scanning transmission electron microscopy (S/TEM) and electron energy-loss spectroscopy (EELS), and noticed a marked difference in the shape of NPs belonging to Ag- and Cu-rich samples. We explained the formation of Janus or Ag@Cu core/shell metastable structures on the grounds of in-flight mixed NP coalescence. We utilised molecular dynamics (MD) and Monte Carlo (MC) computer simulations to demonstrate that such configurations cannot occur as a result of nanoalloy segregation. Instead, sintering at relatively low temperatures can give rise to metastable structures, which eventually can be stabilised by subsequent quenching. Furthermore, we compared the heteroepitaxial diffusivities along various surfaces of both Ag and Cu NPs, and emphasised the differences between the sintering mechanisms of Ag- and Cu-rich NP compositions: small Cu NPs deform as coherent objects on large Ag NPs, whereas small Ag NPs dissolve into large Cu NPs, with their atoms diffusing along specific directions. Taking advantage of this observation, we propose controlled NP coalescence as a method to engineer mixed NPs of a unique, patterned core@partial-shell structure, which we refer to as a ``glass-float'' (ukidama) structure.In recent years, due to its inherent flexibility, magnetron-sputtering has been widely used to synthesise bi-metallic nanoparticles (NPs) via subsequent inert-gas cooling and gas-phase condensation of the sputtered atomic vapour. Utilising two

  4. Atomic Mobilities in the Ag-Cu-Sn Face-Centered Cubic Lattice

    NASA Astrophysics Data System (ADS)

    Gierlotka, W.; Chen, Y. H.; Haque, M. A.; Rahman, M. A.

    2012-12-01

    Knowledge of atomic mobilities is necessary to predict the evolution of microstructure. The theoretical description of atomic mobilities is connected to the chemical potentials of the components in a given phase. A new thermodynamic description of the quaternary Ag-Cu-In-Sn system was recently published, and it is clear that a new description of the mobilities is also necessary. Based on the available literature and using Dictra software, optimization of the mobility parameters of silver, copper, and tin in the face-centered cubic phase was carried out. The results were compared with relevant data from literature as well as with our own experimental results. Good agreement between calculations and experiment was obtained.

  5. Kinetic trapping through coalescence and the formation of patterned Ag-Cu nanoparticles.

    PubMed

    Grammatikopoulos, Panagiotis; Kioseoglou, Joseph; Galea, Antony; Vernieres, Jerome; Benelmekki, Maria; Diaz, Rosa E; Sowwan, Mukhles

    2016-05-14

    In recent years, due to its inherent flexibility, magnetron-sputtering has been widely used to synthesise bi-metallic nanoparticles (NPs) via subsequent inert-gas cooling and gas-phase condensation of the sputtered atomic vapour. Utilising two separate sputter targets allows for good control over composition. Simultaneously, it involves fast kinetics and non-equilibrium processes, which can trap the nascent NPs into metastable configurations. In this study, we observed such configurations in immiscible, bi-metallic Ag-Cu NPs by scanning transmission electron microscopy (S/TEM) and electron energy-loss spectroscopy (EELS), and noticed a marked difference in the shape of NPs belonging to Ag- and Cu-rich samples. We explained the formation of Janus or Ag@Cu core/shell metastable structures on the grounds of in-flight mixed NP coalescence. We utilised molecular dynamics (MD) and Monte Carlo (MC) computer simulations to demonstrate that such configurations cannot occur as a result of nanoalloy segregation. Instead, sintering at relatively low temperatures can give rise to metastable structures, which eventually can be stabilised by subsequent quenching. Furthermore, we compared the heteroepitaxial diffusivities along various surfaces of both Ag and Cu NPs, and emphasised the differences between the sintering mechanisms of Ag- and Cu-rich NP compositions: small Cu NPs deform as coherent objects on large Ag NPs, whereas small Ag NPs dissolve into large Cu NPs, with their atoms diffusing along specific directions. Taking advantage of this observation, we propose controlled NP coalescence as a method to engineer mixed NPs of a unique, patterned core@partial-shell structure, which we refer to as a "glass-float" (ukidama) structure. PMID:27119383

  6. Interfacial Analysis of (La0.6Sr0.4)(Co0.2Fe0.8)O3-δ Substrates Wetted by Ag-CuO

    SciTech Connect

    Weil, K. Scott; Kim, Jin Yong Y.; Hardy, John S.

    2005-05-01

    Recently a new method of brazing has been developed to hermetically seal high-temperature, solid-state electrochemical devices, such as as oxygen and hydrogen separators, fuel gas reformers, solid oxide fuel cells, and chemical sensors. Based on a two-phase liquid composed of silver and copper oxide, brazing is conducted directly in air without the need of an inert cover gas or the use of surface reactive fluxes. A key issue in the development of this joining technique is understanding the effect of braze composition on wetting behavior. In the present paper we consider the wetting behaviors of two candidate braze filler materials, Ag-CuO and Ag-CuO-TiO2, on a protoypical mixed ionic/electronic conducting oxide substrate, lanthanum strontium cobalt ferrite [(La0.6Sr0.4)(Co0.2Fe0.8)O3-δ]. It was found that additions of CuO to silver exhibit a tremendous effect on both the wettability and joint strength characteristics of the subsequent braze relative to polycrystalline alumina substrates. The effect is particularly significant at low CuO content, with substantial improvements in wetting observed in the 1 – 8 mol% range. The corresponding strength of the brazed polycrystalline alumina joints appears to be maximized at a copper oxide content of 8 mol%, with a maximum room temperature flexural strength approaching that of monolithic alumina. While further increases in oxide content lead to improved wetting on polycrystalline alumina, the effect on joint strength is deleterious. It appears that the formation of a continuous brittle copper-based oxide layer along the interface between the braze and alumina faying surface is responsible for the poor mechanical behavior observed in joints fabricated with higher CuO content brazes.

  7. Synthesis and characterization of Ag@Cu nano/microstructure ordered arrays as SERS-active substrates

    NASA Astrophysics Data System (ADS)

    Zhang, Pinhua; Cui, Guangliang; Xiao, Chuanhai; Zhang, Mingzhe; Chen, Li; Shi, Changmin

    2016-06-01

    We fabricated an Ag decorated Cu (Ag@Cu) nano/microstructure ordered array by facile template-free 2D electrodeposition combined with a galvanic reduction method for SERS applications. The Cu nano/microstructure ordered arrays were first synthesized by a 2D electrodeposition method, then Ag nanocubes were decorated on the arrays by galvanic reduction without any capping agent. The pollution-free surface and edge-to-face heterostructure of Ag nanocubes and Cu nano/microstructure arrays provide the powerful field-enhancements for SERS performance. The results verified that the Ag@Cu nano/microstructure ordered arrays have excellent activity for 4-Mercaptopyridine, and the sensitivity limit is as low as 10‑8 M. Therefore, this facile route provides a useful platform for the fabrication of a SERS substrate based on nano/microstructure ordered arrays.

  8. Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn- xAg/Cu Joints

    NASA Astrophysics Data System (ADS)

    Huang, M. L.; Huang, Y. Z.; Ma, H. T.; Zhao, J.

    2011-03-01

    The effect of Ag content on the wetting behavior of Sn-9Zn- xAg on aluminum and copper substrates during soldering, as well as the mechanical properties and electrochemical corrosion behavior of Al/Sn-9Zn- xAg/Cu solder joints, were investigated in the present work. Tiny Zn and coarsened dendritic AgZn3 regions were distributed in the Sn matrix in the bulk Sn-9Zn- xAg solders, and the amount of Zn decreased while that of AgZn3 increased with increasing Ag content. The wettability of Sn-9Zn-1.5Ag solder on Cu substrate was better than those of the other Sn-9Zn- xAg solders but worse than that of Sn-9Zn solder. The wettability of Sn-9Zn-1.5Ag on the Al substrate was also better than those of the other Sn-9Zn- xAg solders, and even better than that of Sn-9Zn solder. The Al/Sn-9Zn/Cu joint had the highest shear strength, and the shear strength of the Al/Sn-9Zn- xAg/Cu ( x = 0 wt.% to 3 wt.%) joints gradually decreased with increasing Ag content. The corrosion resistance of the Sn-9Zn- xAg solders in Al/Sn-9Zn- xAg/Cu joints in 5% NaCl solution was improved compared with that of Sn-9Zn. The corrosion potential of Sn-9Zn- xAg solders continuously increased with increasing Ag content from 0 wt.% to 2 wt.% but then decreased for Sn-9Zn-3Ag. The addition of Ag resulted in the formation of the AgZn3 phase and in a reduction of the amount of the eutectic Zn phase in the solder matrix; therefore, the corrosion resistance of the Al/Sn-9Zn- xAg/Cu joints was improved.

  9. One-Step Solvothermal Method to Prepare Ag/Cu2O Composite With Enhanced Photocatalytic Properties

    NASA Astrophysics Data System (ADS)

    Deng, Xiaolong; Wang, Chenggang; Zhou, E.; Huang, Jinzhao; Shao, Minghui; Wei, Xianqi; Liu, Xiaojing; Ding, Meng; Xu, Xijin

    2016-01-01

    Ag/Cu2O microstructures with diverse morphologies have been successfully synthesized with different initial reagents of silver nitrate (AgNO3) by a facile one-step solvothermal method. Their structural and morphological characteristics were carefully investigated by means of X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM), and the experimental results showed that the morphologies transformed from microcubes for pure Cu2O to microspheres with rough surfaces for Ag/Cu2O. The photocatalytic activities were evaluated by measuring the degradation of methyl orange (MO) aqueous solution under visible light irradiation. The photocatalytic efficiencies of MO firstly increased to a maximum and then decreased with the increased amount of AgNO3. The experimental results revealed that the photocatalytic activities were significantly influenced by the amount of AgNO3 during the preparation process. The possible reasons for the enhanced photocatalytic activities of the as-prepared Ag/Cu2O composites were discussed.

  10. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

    NASA Astrophysics Data System (ADS)

    Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

    2011-09-01

    Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

  11. One-Step Solvothermal Method to Prepare Ag/Cu2O Composite With Enhanced Photocatalytic Properties.

    PubMed

    Deng, Xiaolong; Wang, Chenggang; Zhou, E; Huang, Jinzhao; Shao, Minghui; Wei, Xianqi; Liu, Xiaojing; Ding, Meng; Xu, Xijin

    2016-12-01

    Ag/Cu2O microstructures with diverse morphologies have been successfully synthesized with different initial reagents of silver nitrate (AgNO3) by a facile one-step solvothermal method. Their structural and morphological characteristics were carefully investigated by means of X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM), and the experimental results showed that the morphologies transformed from microcubes for pure Cu2O to microspheres with rough surfaces for Ag/Cu2O. The photocatalytic activities were evaluated by measuring the degradation of methyl orange (MO) aqueous solution under visible light irradiation. The photocatalytic efficiencies of MO firstly increased to a maximum and then decreased with the increased amount of AgNO3. The experimental results revealed that the photocatalytic activities were significantly influenced by the amount of AgNO3 during the preparation process. The possible reasons for the enhanced photocatalytic activities of the as-prepared Ag/Cu2O composites were discussed. PMID:26781287

  12. Influence of High- G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects

    NASA Astrophysics Data System (ADS)

    Lee, Tae-Kyu; Kim, Choong-Un; Bieler, Thomas R.

    2014-01-01

    The impact of isothermal aging and recrystallized grain structure distribution on mechanical shock and thermal cycling performance of solder joints with 1% and 3% silver content Sn-Ag-Cu interconnects were investigated. Localized recrystallized grain structure distributions were analyzed to identify correlations between the microstructure evolution and shock performance. The results reveal that the shock tolerance depends on the amount of shock energy that can be absorbed during each shock cycle, which depends on microstructural features. Based on the recrystallized grain distribution, additional isothermal aging in 1% silver Sn-Ag-Cu interconnects shows improved shock performance, whereas degraded shock performance was observed in 3% Sn-Ag-Cu interconnects. Using the same grain boundary distribution analysis on thermally cycled samples, relationships between the particle size distribution, localized recrystallized grain structure development, shock, and thermomechanical performance were identified: finer particle spacing is beneficial for thermal cycling as it resists grain boundary generation, while conversely, wider particle spacing facilitates recrystallization and grain boundary mobility that allows Sn to absorb shock energy.

  13. Electronic structure and conductivity of nanocomposite metal (Au,Ag,Cu,Mo)-containing amorphous carbon films

    SciTech Connect

    Endrino, Jose L.; Horwat, David; Gago, Raul; Andersson, Joakim; Liu, Y.S.; Guo, Jinghua; Anders, Andre

    2008-05-14

    In this work, we study the influence of the incorporation of different metals (Me = Au, Ag, Cu, Mo) on the electronic structure of amorphous carbon (a-C:Me) films. The films were produced at room temperature using a novel pulsed dual-cathode arc deposition technique. Compositional analysis was performed with secondary neutral mass spectroscopy whereas X-ray diffraction was used to identify the formation of metal nanoclusters in the carbon matrix. The metal content incorporated in the nanocomposite films induces a drastic increase in the conductivity, in parallel with a decrease in the band gap corrected from Urbach energy. The electronic structure as a function of the Me content has been monitored by x-ray absorption near edge structure (XANES) at the C K-edge. XANES showed that the C host matrix has a dominant graphitic character and that it is not affected significantly by the incorporation of metal impurities, except for the case of Mo, where the modifications in the lineshape spectra indicated the formation of a carbide phase. Subtle modifications of the spectral lineshape are discussed in terms of nanocomposite formation.

  14. Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints

    SciTech Connect

    Jung, Yong; Yu, Jin

    2014-02-28

    Effects of electric current flow on the Kirkendall void formation at solder joints were investigated using Sn-3.5Ag/Cu joints specially designed to have localized nucleation of Kirkendall voids at the Cu{sub 3}Sn/Cu interface. Under the current density of 1 × 10{sup 4} A/cm{sup 2}, kinetics of Kirkendall void growth and intermetallic compound thickening were affected by the electromigration (EM), and both showed the polarity effect. Cu{sub 6}Sn{sub 5} showed a strong susceptibility to the polarity effect, while Cu{sub 3}Sn did not. The electromigration force induced additional tensile (or compressive) stress at the cathode (or anode), which accelerated (or decelerated) the void growth. From the measurements of the fraction of void at the Cu{sub 3}Sn/Cu interface on SEM micrographs and analysis of the kinetics of void growth, the magnitude of the local stress induced by EM was estimated to be 9 MPa at the anode and −7 MPa at the cathode.

  15. Graphene-like Networks in the lattice of Ag, Cu and Al metals

    NASA Astrophysics Data System (ADS)

    Salamanca-Riba, Lourdes; Ge, Xiaoxiao; Isaacs, Romaine; Jaim, Hm Iftekar; Wuttig, Manfred; Rashkeev, Sergey; Kuklja, Maija; Hu, Lianbing; Covetics Team Team

    Graphene-like networks form in the lattice of metals such as silver, copper and aluminum via an electrocharging assisted process. In this process a high current of >80A is applied to the liquid metal containing particles of activated carbon. The resulting material is called M covetic (M =Al, Ag Cu). We have previously reported that this process gives rise to carbon nanostructures with sp2 bonding embedded in the lattice of the metal. The carbon bonds to the metal as evidenced by Raman scattering and first principles simulation of the phonon density of states. With this process we have observed that graphene nanoribbons form along preferential crystalline directions and form 3D epitaxial structures with Al and Ag hosts. Bulk Cu covetic was used to deposit films by e-beam deposition and PLD. The PLD films contain higher C content and show higher transmittance (~90%) and resistance to oxidation than pure copper films of the same thickness. We compare the electrical and mechanical properties of covetics containing C in the 0 to 10 wt % and the transmittance of Cu covetic films compared to pure Cu films of the same thickness. Supported by ONR Grant N000141410042

  16. Dermal fillers: an update.

    PubMed

    Ballin, Annelyse Cristine; Brandt, Fredric S; Cazzaniga, Alex

    2015-08-01

    Injection of dermal fillers is the second most frequent nonsurgical cosmetic procedure performed in the USA. Dermal fillers are an option in the treatment of volume deficiency, scars, and rhytides; facial sculpting; facial contouring; and augmentation of specific anatomical sites such as the lips. The number of injectable dermal fillers available on the market increases yearly. Dermatologists and cosmetic surgeons should regularly review treatment options to provide patients with safe and effective filler options. This paper extensively reviews the properties of the available fillers, such as their rheology, longevity, and adverse effects, and how these properties affect the choice of filler agent for a particular patient or a particular site. Also, trends in dermal filler injections are discussed. PMID:26081021

  17. An approximate formula for recalescence in binary eutectic alloys

    NASA Technical Reports Server (NTRS)

    Ohsaka, K.; Trinh, E. H.

    1993-01-01

    In alloys, solidification takes place along various paths which may be ascertained via phase diagrams; while there would be no single formula applicable to all alloys, an approximate formula for a specific solidification path would be useful in estimating the fraction of the solid formed during recalescence. A formulation is here presented of recalescence in binary eutectic alloys. This formula is applied to Ag-Cu alloys which are of interest in containerless solidification, due to their formation of supersaturated solutions.

  18. Quantitative analysis of tin alloy combined with artificial neural network prediction

    SciTech Connect

    Oh, Seong Y.; Yueh, Fang-Yu; Singh, Jagdish P.

    2010-05-01

    Laser-induced breakdown spectroscopy was applied to quantitative analysis of three impurities in Sn alloy. The impurities analysis was based on the internal standard method using the Sn I 333.062-nm line as the reference line to achieve the best reproducible results. Minor-element concentrations (Ag, Cu, Pb) in the alloy were comparatively evaluated by artificial neural networks (ANNs) and calibration curves. ANN was found to effectively predict elemental concentrations with a trend of nonlinear growth due to self-absorption. The limits of detection for Ag, Cu, and Pb in Sn alloy were determined to be 29, 197, and 213 ppm, respectively.

  19. Initial Investigation of Cryogenic Wind Tunnel Model Filler Materials

    NASA Technical Reports Server (NTRS)

    Firth, G. C.

    1985-01-01

    Filler materials are used for surface flaws, instrumentation grooves, and fastener holes in wind tunnel models. More stringent surface quality requirements and the more demanding test environment encountered by cryogenic wind tunnels eliminate filler materials such as polyester resins, plaster, and waxes used on conventional wind tunnel models. To provide a material data base for cryogenic models, various filler materials are investigated. Surface quality requirements and test temperature extremes require matching of coefficients of thermal expansion or interfacing materials. Microstrain versus temperature curves are generated for several candidate filler materials for comparison with cryogenically acceptable materials. Matches have been achieved for aluminum alloys and austenitic steels. Simulated model surfaces are filled with candidate filler materials to determine finishing characteristics, adhesion and stability when subjected to cryogenic cycling. Filler material systems are identified which meet requirements for usage with aluminum model components.

  20. High-temperature behaviour of average structure and vibrational density of states in the ternary superionic compound AgCuSe

    NASA Astrophysics Data System (ADS)

    Trots, D. M.; Skomorokhov, A. N.; Knapp, M.; Fuess, H.

    2006-06-01

    Results of simultaneous thermal analysis (STA), synchrotron powder diffraction (in the range 300-973 K) and inelastic neutron scattering (at 285 and 505 K) on non-superionic β- and superionic α-AgCuSe are reported. The sample is stable in argon on heating. The volume change at the superionic phase transition is about 5%. A model for the average structure of α-AgCuSe is proposed. No anomalies in the temperature dependence of the parameters of the average structure were revealed. Ionic conductivity in α-AgCuSe can originate from cation jumps in “skewed” <100 > directions between nearest-neighbour tetrahedral sites via the peripheries of the octahedral cavities. A correlation between the temperature dependence of the cation redistribution in α-AgCuSe and the temperature dependence of the ionic conductivity is supposed. Various contributions (anharmonic effects, time-average static disorder and phonon-phonon scattering) to the widths of individual phonons upon temperature increase lead to pronounced changes in the neutron-weighted densities of states of β- and α-AgCuSe and accompany the superionic phase transition as well.

  1. Polyurethane Filler for Electroplating

    NASA Technical Reports Server (NTRS)

    Beasley, J. L.

    1984-01-01

    Polyurethane foam proves suitable as filler for slots in parts electroplated with copper or nickel. Polyurethane causes less contamination of plating bath and of cleaning and filtering tanks than wax fillers used previously. Direct cost of maintenance and indirect cost of reduced operating time during tank cleaning also reduced.

  2. Efficient enhancement of hydrogen production by Ag/Cu{sub 2}O/ZnO tandem triple-junction photoelectrochemical cell

    SciTech Connect

    Liu, Ying; Ren, Feng Chen, Chao; Liu, Chang; Xing, Zhuo; Liu, Dan; Xiao, Xiangheng; Wu, Wei; Zheng, Xudong; Liu, Yichao; Jiang, Changzhong; Shen, Shaohua; Fu, Yanming

    2015-03-23

    Highly efficient semiconductor photoelectrodes for solar hydrogen production through photocatalytic water splitting are a promising and challenge solution to solve the energy problems. In this work, Ag/Cu{sub 2}O/ZnO tandem triple-junction photoelectrode was designed and prepared. An increase of 11 times of photocurrent is achieved in the Ag/Cu{sub 2}O/ZnO photoelectrode comparing to that of the Cu{sub 2}O film. The high performance of the Ag/Cu{sub 2}O/ZnO film is due to the optimized design of the tandem triple-junction structure, where the localized surface Plasmon resonance of Ag and the hetero-junctions efficiently absorb solar energy, produce, and separate electron-hole pairs in the photocathode.

  3. Investigation on NOx adsorption in [M‧]-MAPO-5 (M = Si, Ti; M‧ = Ag, Cu) by density functional theory calculation

    NASA Astrophysics Data System (ADS)

    Liu, Jiexiang; Zhang, Xiaoguang

    2013-01-01

    NO, N2O and NO2 adsorption in [M‧]-MAPO-5 (M = Si, Ti; M‧ = Ag, Cu) models of the modified aluminophosphate molecular sieves was investigated by density functional theory (DFT) method. The equilibrium structural parameters and adsorption energies were obtained and compared. The structural parameters of NO and NO2 in the adsorbed state had a distinct change than that of N2O compared to their free gas state. [M‧]-MAPO-5 was more effective for the activation of NOx molecule compared to [M‧]-AlMOR (M‧ = Ag, Cu) models of the modified mordenite in our previous studies. The adsorption energies data indicated that adsorption strength of NOx followed the decreasing order of NO2 > NO > N2O. And adsorption complexes in η1-N mode were much stabler than that in η1-O mode, which was similar to that in [M‧]-AlMOR. [Cu]-MAPO-5 had a much stronger adsorption for NOx than [Ag]-MAPO-5. And [M‧]-SiMOR had a little stronger adsorption for NOx than [M‧]-TiMOR. Furthermore, the resistance capabilities of [M‧]-MAPO-5 to SO2, H2O and O2 were studied and analyzed. The interaction mechanism of NOx adsorption in [M‧]-MAPO-5 was also discussed by natural bond orbital (NBO) analysis, which was in reasonable agreement with the adsorption interaction strengths.

  4. Nanocelluloses and their phosphorylated derivatives for selective adsorption of Ag(+), Cu(2+) and Fe(3+) from industrial effluents.

    PubMed

    Liu, Peng; Borrell, Pere Ferrer; Božič, Mojca; Kokol, Vanja; Oksman, Kristiina; Mathew, Aji P

    2015-08-30

    The potential of nanoscaled cellulose and enzymatically phosphorylated derivatives as bio-adsorbents to remove metal ions (Ag(+), Cu(2+) and Fe(3+)) from model water and industrial effluents is demonstrated. Introduction of phosphate groups onto nanocelluloses significantly improved the metal sorption velocity and sorption capacity. The removal efficiency was considered to be driven by the high surface area of these nanomaterials as well as the nature and density of functional groups on the nanocellulose surface. Generally, in the solutions containing only single types of metal ions, the metal ion selectivity was in the order Ag(+)>Cu(2+)>Fe(3+), while in the case of mixtures of ions, the order changed to Ag(+)>Fe(3+)>Cu(2+), irrespective of the surface functionality of the nanocellulose. In the case of industrial effluent from the mirror making industry, 99% removal of Cu(2+) and Fe(3+) by phosphorylated nanocellulose was observed. The study showed that phosphorylated nanocelluloses are highly efficient biomaterials for scavenging multiple metal ions, simultaneously, from industrial effluents. PMID:25867590

  5. Development of a new Pb-free solder: Sn-Ag-Cu

    SciTech Connect

    Miller, C.M.

    1995-02-10

    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  6. Optoelectronic characterization of wide-bandgap (AgCu)(InGa)Se 2 thin-film polycrystalline solar cells including the role of the intrinsic zinc oxide layer

    NASA Astrophysics Data System (ADS)

    Obahiagbon, Uwadiae

    Experiments and simulations were conducted to vary the thickness and the sheet resistance of the high resistance (HR) ZnO layer in polycrystalline thin film (AgCu)(GaIn)Se2 (ACIGS) solar cells. The effect of varying these parameters on the electric field distribution, depletion width and hence capacitance were studied by SCAPS simulation. Devices were then fabricated and characterized by a number of optoelectronic techniques. Thin film CIGS has received a lot of attention, for its use as an absorber layer for thin film solar cells. However, the addition of Silver (Ag) to the CIGS alloy system increases the band gap as indicated from optical transmission measurements and thus higher open circuit voltage (Voc) could be obtained. Furthermore, addition of Ag lowers the melting temperature of the alloy and it is expected that this lowers the defect densities in the absorber and thus leads to higher performance. Transient photocapacitance analysis on ACIGS devices shows sharper band edge indicating lower disorder than CIGS. Presently there is a lack of fundamental knowledge relating film characteristics to device properties and performance. This is due to the fact that some features in the present solar cell structure have been optimized empirically. The goal of this research effort was to develop a fundamental and detailed understanding of the device operation as well as the loss mechanism(s) limiting these devices. Recombination mechanisms in finished ACIGS solar cell devices was studied using advanced admittance techniques (AS, DLCP, CV) to identify electronically active defect state(s) and to study their impact on electronic properties and device performance. Analysis of various optoelectronic measurements of ACIGS solar cells provided useful feedback regarding the impact on device performance of the HR ZnO layer. It was found that thickness between 10-100 nm had negligible impact on performance but reducing the thickness to 0 nm resulted in huge variability in all

  7. TiO2-modified Ag-CuO Reactive Air Brazes for Improved Wettability on Mixed Ionic/Electronic Conductors

    SciTech Connect

    Hardy, John S.; Weil, K. Scott; Kim, Jin Yong Y.; Thomsen, Ed C.; Darsell, Jens T.

    2005-03-01

    Mixed ionic/electronic conducting perovskite oxides such as lanthanum strontium cobalt ferrite (LSCF) are strong candidates for potential use in a number of electrochemical devices, including gas separation membranes and solid oxide fuel cells (SOFC). Underlying the excitement over the these novel ceramics is the engineering challenge of effectively incorporating them into practical devices. Taking full advantage of the unique properties of advanced ceramics such as mixed conducting oxides depends in large part on being able to develop reliable joining techniques. Earlier studies have indicated that Ag-CuO reactive air braze (RAB) compositions are effective in joining to LSCF. Meanwhile, it has been found that small additions of as little as 0.5 mol% titanium oxide to Ag-CuO RAB compositions cause a dramatic increase in the wettability of RAB on many oxide ceramic surfaces. Therefore the wettabilty of Ag-CuO-TiO2 brazes on LSCF substrates will be examined and the flexural strength, microstructure, and conductivity of joints in LSCF made using Ag-CuO-TiO2 brazes will be discussed. Long-term aging effects on conductivity and microstructure will also be presented.

  8. A bamboo-inspired hierarchical nanoarchitecture of Ag/CuO/TiO2 nanotube array for highly photocatalytic degradation of 2,4-dinitrophenol.

    PubMed

    Zhang, Xuhong; Wang, Longlu; Liu, Chengbin; Ding, Yangbin; Zhang, Shuqu; Zeng, Yunxiong; Liu, Yutang; Luo, Shenglian

    2016-08-01

    The optimized geometrical configuration of muitiple active materials into hierarchical nanoarchitecture is essential for the creation of photocatalytic degradation system that can mimic natural photosynthesis. A bamboo-like architecture, CuO nanosheets and Ag nanoparticles co-decorated TiO2 nanotube arrays (Ag/CuO/TiO2), was fabricated by using simple solution-immersion and electrodeposition process. Under simulated solar light irradiation, the 2,4-dinitrophenol (2,4-DNP) photocatalytic degradation rate over Ag/CuO/TiO2 was about 2.0, 1.5 and 1.2 times that over TiO2 nanotubes, CuO/TiO2 and Ag/TiO2, respectively. The enhanced photocatalytic activity of ternary Ag/CuO/TiO2 photocatalyst was ascribed to improved light absorption, reduced carrier recombination and more exposed active sites. Moreover, the excellent stability and reliability of the Ag/CuO/TiO2 photocatalyst demonstrated a promising application for organic pollutant removal from water. PMID:27107324

  9. Mirroring the dynamic magnetic behavior of magnetostrictive Co/(Ag,Cu,Ta) multilayers grown onto rigid and flexible substrates

    NASA Astrophysics Data System (ADS)

    Agra, K.; Gomes, R. R.; Della Pace, R. D.; Dorneles, L. S.; Bohn, F.; Corrêa, M. A.

    2015-11-01

    We investigate the magnetoimpedance effect in a wide frequency range in magnetostrictive Co/(Ag,Cu,Ta) multilayers grown onto rigid and flexible substrates. We observe a direct correlation between structural and quasi-static magnetic properties and the magnetoimpedance effect, since they are directly dependent on the nature of the spacer material. Moreover, we verify that all these properties are insensitive to the kind of employed substrate. We compare the magnetoimpedance results measured for multilayers in rigid and flexible substrates and discuss them in terms of different mechanisms that govern the impedances changes, magnetic anisotropy, structural character, and of numerical calculation results found in the literature. The fact that magnetostrictive multilayers can be reproduced in distinct kinds of substrates corresponds to an important advance for their applicability. The results place multilayers grown onto flexible substrates as attractive candidates for application as probe element in the development of MI-based sensor devices.

  10. DEVELOPMENT OF A HIGH-TEMPERATURE CERAMIC BRAZE: ANALYSIS OF PHASE EQUILIBRIA IN THE Pd-Ag-CuOx SYSTEM

    SciTech Connect

    Weil, K. Scott; Darsell, Jens T.

    2006-01-18

    This paper describes the effects of small palladium additions on the phase equilibria in the Ag-CuOx system. Below a concentration of 5 mol%, palladium was found to increase the temperature of the eutectic reaction present in the pseudobinary system, but have little effect on a higher temperature monotectic reaction. However once enough palladium was added to increase the pseudoternary solidus temperature to that of the lower boundary for this three-phase field (~970°C), the lower boundary begins to increase in temperature as well. The addition of palladium also causes the original eutectic point to move to lower silver concentrations, which also causes a convergence of the two new three-phase fields, CuOx + L1 + L2 and CuOx + α + L1. This suggests that with higher palladium concentrations, a peritectic reaction, α + L1 + L2 → CuOx, may eventually be observed in the system.

  11. Autonomous Slat-Cove-Filler Device for Reduction of Aeroacoustic Noise Associated with Aircraft Systems

    NASA Technical Reports Server (NTRS)

    Turner, Travis L. (Inventor); Kidd, Reggie T. (Inventor); Lockard, David P (Inventor); Khorrami, Mehdi R. (Inventor); Streett, Craig L. (Inventor); Weber, Douglas Leo (Inventor)

    2016-01-01

    A slat cove filler is utilized to reduce airframe noise resulting from deployment of a leading edge slat of an aircraft wing. The slat cove filler is preferably made of a super elastic shape memory alloy, and the slat cove filler shifts between stowed and deployed shapes as the slat is deployed. The slat cove filler may be configured such that a separate powered actuator is not required to change the shape of the slat cove filler from its deployed shape to its stowed shape and vice-versa. The outer contour of the slat cove filler preferably follows a profile designed to maintain accelerating flow in the gap between the slat cove filler and wing leading edge to provide for noise reduction.

  12. Collagen and injectable fillers.

    PubMed

    Cheng, Jacqueline T; Perkins, Stephen W; Hamilton, Mark M

    2002-02-01

    Soft tissue augmentation of facial rhytids, scars, and deformities is a frequently performed office procedure. This article reviews the available biologic (collagen, Dermalogen, Autologen, Isolagen, autologous fat, Fibrel, hyaluronic acid derivatives, particulate fascia lata, micronized Alloderm) and alloplastic (silicone, Bioplastique, and Artecoll) soft tissue injectable fillers. PMID:11781208

  13. Toward a mechanistic understanding of the damage evolution of SnAgCu solder joints in accelerated thermal cycling test

    NASA Astrophysics Data System (ADS)

    Mahin Shirazi, Sam

    Accelerated thermal cycling (ATC) tests are the most commonly used tests for the thermo-mechanical performance assessment of microelectronics assemblies. Currently used reliability models have failed to incorporate the microstructural dependency of lead free solder joint behavior and its microstructure evolution during cycling. Thus, it is essential to have a mechanistic understanding of the effect of cycling parameters on damage evolution and failure of lead free solder joints in ATC. Recrystallization has been identified as the damage rate controlling mechanism in ATC. Usually it takes 1/3 of life for completion of recrystallization regardless of cycling parameters. Thus, the life of the solder joints can be predicted by estimating global recrystallization. The objective of the first part of the study was to examine whether the damage scenario applies in service is the same as the harsh thermal cycling tests (i.e. 0/100 °C and -40/125 °C) commonly used in industry. Microstructure analysis results on a variety of lead free solder SnAgCu assemblies subjected to the both harsh (0/100 °C) and mild (20/80 °C) ATC confirmed similar failure mechanism under the both testing conditions. Sn grain morphology (interlaced versus beach ball) has a significant effect on the thermo-mechanical performance (and thus the model) of the lead free solder joints. The longer thermal cycling lifetime observed in the interlaced solder joints subjected to the ATC compared to the beach ball structure was correlated to the different initial microstructure and the microstructure evolution during cycling. For the modeling proposes, the present study was focused on Sn-Ag-Cu solder joints with either a single Sn grain or beach ball structure. Microstructural analysis results of the simulated thermal cycling experiment revealed that, the life can be approximated as determined by the accumulation of a certain amount of work during the high temperature dwells. Finally the effect of precipitates

  14. Alleviating coking in ethanol steam reforming by co-loading binary oxides Ni-M (M=Ag, Cu, Mn) on peony-like ceria

    NASA Astrophysics Data System (ADS)

    Xian, C. N.; Li, J. G.; Li, H.; Chen, L. Q.; Sun, J.; Lee, J. S.

    2011-06-01

    Previously, hydrothermally prepared mesoporous peony-like ceria (PCO) material was shown to exhibit superior catalytic properties for CO oxidation and ethanol reforming. Ni supported PCO had been shown to have high activity for ethanol steam reforming at low temperature. In this work, Ag, Cu and Mn is co-loaded with Ni on PCO catalysts by impregnation method. The catalysts were studied by X-ray diffraction (XRD), scanning electron microscopy (SEM), and a combined thermogravimetry, differential scanning calorimetry, and mass spectrometry (TG-DSC-MS). It was found that all the catalysts gave 100% ethanol conversion above ca. 300°C and exhibited similar H2 yield. It is found that the severe coking problem for the Ni-loaded PCO catalyst was alleviated significantly if Ag, Cu or Mn is co-loaded. Among them, the addition of Mn is the most effective in reducing carbon formation.

  15. In vitro chemical and biological effects of Ag, Cu and Cu + Zn adjunction in 46S6 bioactive glasses

    NASA Astrophysics Data System (ADS)

    Bunetel, L.; Wers, E.; Novella, A.; Bodin, A.; Pellen-Mussi, P.; Oudadesse, H.

    2015-09-01

    Three bioactive glasses belonging to the system SiO2-CaO- Na2O-P2O5 elaborated by conventional melt-quenching techniques were doped with silver, copper and copper + zinc. They were characterized using the usual physical methods. Human osteoblast cells Saos-2 and human endothelial cells EAhy926 were used for viability assays and to assess the metallic ions, self toxicity. Human monocyte cells THP-1 were used to measure interleukins IL1β and IL6 release. Glass chemical structures did not vary much on introduction of metal ions. A layer of hydroxyapatite was observed on every glass after 30 days of SBF immersion. A proliferative action was seen on Saos-2 after 24 h of incubation, EAhy926 growth was not affected. For both cell lines, a moderate cytotoxicity was found after 72 h. Dose-dependent toxic effects of Ag, Cu and Zn ions were observed on Saos-2 and EAhy926 cells. Measured CD50 of silver against these two cell lines were 8 to 20 fold lower than copper and zinc’s. Except undoped control glass, all doped glasses tested showed anti-inflammatory properties by preventing IL1β and IL6 excretion by differentiated THP-1. In conclusion, strictly monitored adjunction of metal ions to bioglasses ensures good anti-inflammatory properties without altering their biocompatibility.

  16. High Temperature Long-Term Stability of an (Al-Ag-Cu) Three-in-One Multicell

    NASA Astrophysics Data System (ADS)

    Kim, Yong-Gyoo; Yang, Inseok; Joung, Wukchul

    2016-01-01

    In order to investigate the long-term stability of an (Al-Ag-Cu) three-in-one multicell, it was heat-treated at 1100° C, in which all metal samples were in molten state, for 1000 h. Its thermal behavior was tested using a Pt/Pd thermocouple by inducing freezes during the heat treatment. The amount by which the plateau temperature dropped after the 1000 h heat treatment were 1.62° C, 2.07° C, and 0.66° C for Al, Ag, and Cu, respectively. These degradations were suspected to be caused by self-contaminations, and to prove this, impurity concentrations in each sample of the multicell were examined. The amount of temperature dropped after the 1000 h heat treatment showed similar values to the prediction based on the impurity-induced temperature changes, and it was concluded that each cell was self-contaminated by the metallic elements from the other cells. Ag and Cu were found to be main species causing the observed degradations.

  17. Activity of calcined Ag,Cu,Au/TiO2 catalysts in the dehydrogenation/dehydration of ethanol

    NASA Astrophysics Data System (ADS)

    Mai, Do Tkhyui; Pylinina, A. I.; Mikhailenko, I. I.

    2015-07-01

    The catalytic activity of the anatase TiO2 and M z+/TiO2 with supported ions M z+ = Ag+, Cu2+, Au3+ in vapor phase conversions of ethanol is investigated at temperatures of 100-400°C. It is shown that the yields of acetaldehyde and ethylene decline for the most active catalyst Cu2+/TiO2 but increase for TiO2 and Ag/TiO2. The drop in the activation energy of the dehydrogenation reaction over calcined samples is linearly correlated with the one in the reduction potential of M z+ to Cu+, Au+, Ag0 and the ionic radius of M z+ in the crystal. The energies of activation for ethylene formation change in the series TiO2 > Au3+ > Cu2+ >Ag+ and TiO2 ≈ Cu2+ ≈ Ag+ > Au3+ for the calcined samples. The rate of pyridine adsorption, considered as an indicator of the activity of acid sites, is a linear function of ion charge + z = 1, 2, 3, and slows by two-thirds after calcination.

  18. Facial Filler Complications.

    PubMed

    Woodward, Julie; Khan, Tanya; Martin, John

    2015-11-01

    The use of facial fillers has greatly expanded over the past several years. Along with increased use comes a rise in documented complications, ranging from poor cosmetic result to nodules, granulomas, necrosis, and blindness. Awareness of the potential types of complications and options for management, in addition to the underlying facial anatomy, are imperative to delivering the best patient care. This article defines the complications and how to treat them and provides suggestions to avoid serious adverse outcomes. PMID:26505541

  19. What's new in fillers?

    PubMed

    Brown, Lance H; Frank, Paul J

    2003-06-01

    This article is an in-depth review of various materials and products that have been used for the augmentation of soft tissue in the past, and covers several new products, methods, and techniques that may provide new options for dermatologists who use fillers in their practice. Pros and cons of each are discussed, along with mechanisms of action, dosages, approved and off-label uses, as well as a look ahead at some prospective technology. PMID:12848108

  20. More About Brazing Or Welding NiAl Without Filler

    NASA Technical Reports Server (NTRS)

    Moore, Thomas J.; Kalinowski, Joseph M.

    1996-01-01

    Two reports present additional information about two processes for joining, brazing, or welding workpieces made of nickel aluminide alloys, without use of filler metal. Joining processes involve uniform heating in vacuum-controlled furnace. Eliminates internal thermal gradients in workpieces joined and greatly reduces tendency toward cracking.

  1. Synthetic Fillers for Facial Rejuvenation.

    PubMed

    Lee, Johnson C; Lorenc, Z Paul

    2016-07-01

    Soft tissue filler procedures have increased dramatically in popularity in the United States. Synthetic fillers such as calcium hydroxyapatite (CaHA), polymethyl methacrylate (PMMA), and poly-l-lactic acid (PLLA), and silicone provide initial volume replacement but have an additional biostimulatory effect to supplement facial volumization. Indications include human immunodeficiency virus lipoatrophy and nasolabial folds for CaHA and PLLA and atrophic acne scars for PMMA. Most clinical use of these synthetic fillers is in an off-label fashion. Beyond the proper choice of a synthetic filler, careful consideration of dilution, injection method, and postprocedural care allows for successful and consistent results. PMID:27363763

  2. Semipermanent and permanent injectable fillers.

    PubMed

    Jones, Derek H

    2009-10-01

    Today, an impressive array of injectable dermal fillers for facial soft-tissue augmentation is available in the United States. These agents, most of which were introduced in the last half decade, represent a variety of semipermanent and permanent fillers across several categories. Physicians can choose between semipermanent fillers, such as hyaluronic acid derivatives (HA), calcium hydroxylapatite (CaHA), and poly-L-lactic acid (PLA), and longer-lasting, so-called "permanent fillers," such as polymethyl methacrylate microspheres (PMMA), highly purified forms of liquid silicone, and hydrogel polymers. PMID:19850193

  3. Measurement of electron capture from e+-e- pair production by 0.956 GeV/u U92+ on Au, Ag, Cu, and Mylar targets

    NASA Astrophysics Data System (ADS)

    Belkacem, A.; Gould, Harvey; Feinberg, B.; Bossingham, R.; Meyerhof, W. E.

    1993-12-01

    We describe the first experimental observation of electron capture from electron-positron pair production in relativistic heavy ion collisions. We have used a novel new spectrometer to make the measurement of the cross section for a 0.956 GeV/u U92+ beam produced at the BEVALAC facility at LBL on Au, Ag, Cu, and Mylar targets. We also measured the energy and angular distribution of the positrons for the Au target. The total cross section for a Au target is measured to be 2.19 (0.25) barns for capture from pair production and 3.30 (0.65) barns for pair production without capture.

  4. Accelerated Bonding of Magnesium and Aluminum with a CuNi/Ag/CuNi Sandwich Interlayer by Plasma-Activated Sintering

    NASA Astrophysics Data System (ADS)

    Wang, Yiyu; Rao, Mei; Li, Leijun; Luo, Guoqiang; Shen, Qiang; Zhang, Lianmeng

    2016-02-01

    Plasma-activated sintering (PAS) has been applied, for the first time, to join magnesium and aluminum using a CuNi/Ag/CuNi sandwich structural interlayer. A cleaning effect and high efficient plasma heating mode in PAS have contributed to forming a strong interfacial diffusion bond under low temperature 673 K (400 °C) and short dwell time (0.6 ks). The designed interlayer provides a diffusion barrier effect and an enhanced physical contact between the interfaces. Strong bonding has been achieved without forming the brittle Mg-Al intermetallics.

  5. Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2011-01-01

    Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

  6. Reliability of Sn/Pb and lead-free (SnAgCu) solders of surface mounted miniaturized passive components for extreme temperature (-185°C to +125°C) space missions

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2011-02-01

    Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability for future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185°C to +125°C) covers military specifications (-55°C to +100°C), extreme cold Martian (-120°C to +115°C), asteroid Nereus (-180°C to +25°C) and JUNO (-150°C to +120°C) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185°C to +125°C) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

  7. Midface volumization with injectable fillers.

    PubMed

    Tan, Marietta; Kontis, Theda C

    2015-05-01

    The aging midface has long been overlooked in cosmetic surgery. Our understanding of facial aging in terms of 3 dimensions has placed increased importance on volume restoration. Although an "off-label" indication for most fillers in this facial region, volumization of the midface with injectable fillers is usually a safe and straightforward procedure technically. Injectors, nevertheless, need to have an excellent understanding of facial anatomy and the characteristics of the injected products should problems arise. PMID:25921573

  8. Atomic structure and thermophysical properties of molten silver-copper oxide air braze alloys

    NASA Astrophysics Data System (ADS)

    Hardy, John Steven

    The Ag-CuOx materials system is the basis for a family of filler alloys used in a recently developed ceramic-metal joining technique referred to as air brazing, which is a brazing process that can be carried out in ambient air rather than under the vacuum or inert to reducing gas conditions required for conventional brazing methods. This research was conducted to elucidate the atomic coordination and selected thermophysical properties of these materials as a function of temperature when they are in the salient liquid state in air, since this is when the critical steps of wetting and spreading occur in the joining process. A series of alloys was selected spanning the entire length of the phase diagram including the pure end members, Ag and CuOx; alloys that form the two constituent single phase liquids; and alloys for which the two liquid phases coexist in the miscibility gap of the phase diagram. The oxygen content of the liquid alloys in air was measured using thermogravimetry. The oxidative weight gain of 99.999% pure metallic precursors was measured while simultaneously accounting for the concurrent silver volatility using a method that was developed in the course of the study. The surface tension and mass density were measured using the maximum bubble pressure method. The number density was calculated based on the information gained from the oxygen content and mass density measurements. For compositions that were amenable to laser heating, containerless high energy x-ray scattering measurements of the liquid atomic coordination were performed using a synchrotron beamline, an aerodynamic levitator, and laser heating. For the remaining compositions x-ray scattering measurements were performed in a beamline-compatible furnace. The two liquid phases that form in this materials system have distinct atomic coordinations characterized by an average of nearly two-fold coordinated ionic metal-oxygen pairs in the CuOx-rich liquid and nearly eight-fold coordinated atomic

  9. Molecular-dynamics calculations of thermodynamic properties of metastable alloys

    SciTech Connect

    Mazzone, G.; Rosato, V.; Pintore, M.; Delogu, F.; Demontis, P.; Suffritti, G.B.

    1997-01-01

    In order to improve our current understanding of the microscopic structure of metastable alloys of immiscible elements such as Ag-Cu and Co-Cu, the Helmholtz free energy of several microstructures based on an fcc unit cell has been calculated and compared with that of a reference state. The microstructures considered for the free energy calculations at fixed volume are (1) a structure formed by alternating layers of fixed thickness of metal 1 and metal 2 separated by coherent interfaces; (2) an atomically disordered solid solution; (3) a structure comprising a random distribution of elemental cubic grains separated by coherent interfaces. Numerical results show that the Helmholtz free energy of structure (3) decreases with increasing grain size and that its value calculated for a sufficiently large grain size approaches the free energy of structure (1). Further molecular-dynamics simulations for the Ag-Cu system have allowed the calculation of the enthalpy at the equilibrium volume of several microstructures including some of those listed above. A comparison of the calculated values of the enthalpy with the heat release observed experimentally allows the advancement of an hypothesis concerning the reaction path and the structure of the equiatomic Ag-Cu alloy obtained by ball milling.

  10. Use of thermodynamic data to calculate surface tension and viscosity of Sn-based soldering alloy systems

    NASA Astrophysics Data System (ADS)

    Lee, Jong Ho; Lee, Dong Nyung

    2001-09-01

    A thermodynamic database for the Pb-free soldering alloy systems, which include Sn, Ag, Cu, Bi, and In, has been made using the CALPHAD method. The resulting thermodynamic properties of the Sn-based binary alloy systems were used to determine the surface tensions and viscosities. The surface tensions were calculated using Butler’s monolayer model and the viscosities by Hirai’s and Seetharaman’s models. Butler’s model was also used to determine the surface active element. The results for binary systems were extended to the Sn-based ternary systems (Sn-Ag-Cu, Sn-Ag-Bi). The surface tensions of commercial eutectic Sn-Pb and Sn-Pb-Ag solder alloys were measured by the sessile drop method. The measured values and other researchers’ results were compared with the calculated data.

  11. Monetary alloys in Iron Age Armorica (Finistère, France): The singular case of the Osismi tribe

    NASA Astrophysics Data System (ADS)

    Guerra, M. F.; Abollivier, Ph.

    2016-06-01

    The analysis by PIXE and PAA of 64 coins struck in Iron Age Armorica by the Osismi tribe revealed the use of a different system from the usual Celtic Gaul tri-metallic system. The gold-based alloy (Au-Ag-Cu) firstly issued is debased over time to become a silver-based alloy (Ag-Cu-Sn). Based on the analytical data, two chronological phases were defined and dates of issuing could be ascribed to the coin-types. The presence of Sn and Sb in the alloys and the low contents of Pb were used in the attribution of 9 specimens of unknown origin to the Osismi monetary system. Considerations on the mints supplies could also be provided.

  12. Development of a supramolecular ensemble of an AIEE active hexaphenylbenzene derivative and Ag@Cu2O core-shell NPs: an efficient photocatalytic system for C-H activation.

    PubMed

    Chopra, Radhika; Kumar, Manoj; Bhalla, Vandana

    2016-08-01

    A supramolecular ensemble having Ag@Cu2O core-shell nanoparticles stabilized by aggregates of a hexaphenylbenzene derivative has been developed which exhibits excellent photocatalytic efficiency in reactions involving preparation of imidazole and benzimidazole derivatives via C-H activation. PMID:27464360

  13. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions

    NASA Astrophysics Data System (ADS)

    Tan, Ai Ting; Tan, Ai Wen; Yusof, Farazila

    2015-06-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn-Ag-Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided.

  14. Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint

    NASA Astrophysics Data System (ADS)

    Kanda, Yoshihiko; Kariya, Yoshiharu; Oto, Yuji

    2012-03-01

    The fatigue ductility exponent in the Coffin-Manson law for a Sn-Ag-Cu micro-solder joint was investigated in terms of the cyclic strain-hardening property and the inelastic strain energy in fracture for isothermal fatigue. The fatigue ductility exponent was found to increase with temperature and holding time under strain at high temperature. This exponent is closely related to the cyclic strain-hardening exponent, which displays the opposite behavior in that it decreases with increasing temperature and with coarsening of intermetallic compound particles while holding under strain at high temperature. This result differs from the creep damage mechanism (grain boundary fracture), which is a primary reason for the significant reduction in fatigue life for all strain ranges for large-size specimens.

  15. Toxicity of Ag, CuO and ZnO nanoparticles to selected environmentally relevant test organisms and mammalian cells in vitro: a critical review.

    PubMed

    Bondarenko, Olesja; Juganson, Katre; Ivask, Angela; Kasemets, Kaja; Mortimer, Monika; Kahru, Anne

    2013-07-01

    Nanoparticles (NPs) of copper oxide (CuO), zinc oxide (ZnO) and especially nanosilver are intentionally used to fight the undesirable growth of bacteria, fungi and algae. Release of these NPs from consumer and household products into waste streams and further into the environment may, however, pose threat to the 'non-target' organisms, such as natural microbes and aquatic organisms. This review summarizes the recent research on (eco)toxicity of silver (Ag), CuO and ZnO NPs. Organism-wise it focuses on key test species used for the analysis of ecotoxicological hazard. For comparison, the toxic effects of studied NPs toward mammalian cells in vitro were addressed. Altogether 317 L(E)C50 or minimal inhibitory concentrations (MIC) values were obtained for algae, crustaceans, fish, bacteria, yeast, nematodes, protozoa and mammalian cell lines. As a rule, crustaceans, algae and fish proved most sensitive to the studied NPs. The median L(E)C50 values of Ag NPs, CuO NPs and ZnO NPs (mg/L) were 0.01, 2.1 and 2.3 for crustaceans; 0.36, 2.8 and 0.08 for algae; and 1.36, 100 and 3.0 for fish, respectively. Surprisingly, the NPs were less toxic to bacteria than to aquatic organisms: the median MIC values for bacteria were 7.1, 200 and 500 mg/L for Ag, CuO and ZnO NPs, respectively. In comparison, the respective median L(E)C50 values for mammalian cells were 11.3, 25 and 43 mg/L. Thus, the toxic range of all the three metal-containing NPs to target- and non-target organisms overlaps, indicating that the leaching of biocidal NPs from consumer products should be addressed. PMID:23728526

  16. Saturation phenomenon of Ce and Ti in the modification of Al-Zn-Si filler metal

    NASA Astrophysics Data System (ADS)

    Yang, Jin-long; Xue, Song-bai; Dai, Wei; Xue, Peng

    2015-02-01

    Cerium and titanium were added to an Al-42Zn-6.5Si brazing alloy, and the subsequent microstructures of the brazing alloy and the 6061 Al alloy brazing seam were investigated. The microstructures of filler metals and brazed joints were characterized by scanning electron microscopy and X-ray energy dispersion spectrometry. A new Ce-Ti phase formed around the silicon phase in the modified filler metal and this saturation phenomenon was analyzed. Interestingly, following brazing of the 6061 alloy, there is no evidence of the Ce-Ti phase in the brazing seam. Because of the mutual solubility of the brazing alloy and base metal, the quantity of the solvent increases, and the solute Ce and Ti atoms assume an undersaturated state.

  17. Microstructural behavior of iron and bismuth added Sn-1Ag-Cu solder under elevated temperature aging

    NASA Astrophysics Data System (ADS)

    Ali, Bakhtiar; Sabri, Mohd Faizul Mohd; Jauhari, Iswadi

    2016-07-01

    An extensive study was done to investigate the microstructural behavior of iron (Fe) and bismuth (Bi) added Sn-1Ag-0.5Cu (SAC105) under severe thermal aging conditions. The isothermal aging was done at 200 °C for 100 h, 200 h, and 300 h. Optical microscopy with cross-polarized light revealed that the grain size significantly reduces with Fe/Bi addition to the base alloy SAC105 and remains literally the same after thermal aging. The micrographs of field emission scanning electron microscopy (FESEM) with backscattered electron detector and their further analysis via imageJ software indicated that Fe/Bi added SAC105 showed a significant reduction in the IMCs size (Ag3Sn and Cu6Sn5), especially the Cu6Sn5 IMCs, as well as β-Sn matrix and a refinement in the microstructure, which is due to the presence of Bi in the alloys. Moreover, their microstructure remains much more stable under severe thermal aging conditions, which is because of the presence of both Fe and Bi in the alloy. The microstructural behavior suggests that Fe/Bi modified SAC105 would have much improved reliability under severe thermal environments. These modified alloys also have relatively low melting temperature and low cost.

  18. Use of Fillers in Rhinoplasty.

    PubMed

    Moon, Hyoung Jin

    2016-01-01

    Surgical rhinoplasty is the one of the most common cosmetic procedures in Asians. But there are limitations, such as down time, high cost, and a steep learning curve. Most complications are implant related. A safer and less invasive procedure is rhinoplasty using fillers. Good knowledge of the nasal anatomy is essential for rhinoplasty using fillers. Knowledge of nerves, blood supply, and injection plane allows avoiding complications. There are several planes in the nose. The deep fatty layer is recommended for injection, because it is wide and loose and there are less important neurovascular structures. Botulinum toxin also can be used for noninvasive rhinoplasty. PMID:26616716

  19. Fillers: Contraindications, Side Effects and Precautions

    PubMed Central

    Lafaille, Philippe; Benedetto, Anthony

    2010-01-01

    Fillers are generally considered safe. However side effects may happen and hence a practicing dermatologist need to be aware of such side effects, contraindicatons and precaution to be adopted while using fillers. PMID:20606987

  20. 7 CFR 58.914 - Fillers.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... evaporated milk fillers having brass parts may be approved if free from corroded surfaces and kept in good... Standards for Plastic, and Rubber and Rubber-Like Materials. Fillers shall be designed so that they in...

  1. Dry bin filler for apples

    Technology Transfer Automated Retrieval System (TEKTRAN)

    A unique dry bin filler for apples using a sequenced tray was developed to reduce bruising in packing operations. Research and commercial trials in West Virginia, Pennsylvania, and Washington State demonstrated the ability to fill bins evenly and with low damage. Cultivars with different bruising su...

  2. Silica Fillers for elastomer Reinforement

    SciTech Connect

    Kohls, D.J.; Schaefer, D.W.

    2009-08-26

    This article summarizes recent work on the structure of precipitated silica used in the reinforcement of elastomers. Silica has a unique morphology, consisting of multiple structural levels that can be controlled through processing. The ability to control and characterize the multiple structures of precipitated silica is an example of morphological engineering for reinforcement applications. In this summary of some recent research efforts using precipitated silica, small-angle scattering techniques are described and their usefulness for determining the morphology of silica in terms of primary particles, aggregates, and agglomerates are discussed. The structure of several different precipitated silica powders is shown as well as the mechanical properties of elastomers reinforced with these silica particles. The study of the mechanical properties of filled elastomer systems is a challenging and exciting topic for both fundamental science and industrial application. It is known that the addition of hard particulates to a soft elastomer matrix results in properties that do not follow a straightforward rule of mixtures. Research efforts in this area have shown that the properties of filled elastomers are influenced by the nature of both the filler and the matrix, as well as the interactions between them. Several articles have reviewed the influence of fillers like silica and carbon black on the reinforcement of elastomers. In general, the structure-property relationships developed for filled elastomers have evolved into the following major areas: Filler structure, hydrodynamic reinforcement, and interactions between fillers and elastomers.

  3. Silica Fillers for elastomer Reinforement

    SciTech Connect

    Kohls, D.J.; Schaefer, D.W.

    2012-09-10

    This article summarizes recent work on the structure of precipitated silica used in the reinforcement of elastomers. Silica has a unique morphology, consisting of multiple structural levels that can be controlled through processing. The ability to control and characterize the multiple structures of precipitated silica is an example of morphological engineering for reinforcement applications. In this summary of some recent research efforts using precipitated silica, small-angle scattering techniques are described and their usefulness for determining the morphology of silica in terms of primary particles, aggregates, and agglomerates are discussed. The structure of several different precipitated silica powders is shown as well as the mechanical properties of elastomers reinforced with these silica particles. The study of the mechanical properties of filled elastomer systems is a challenging and exciting topic for both fundamental science and industrial application. It is known that the addition of hard particulates to a soft elastomer matrix results in properties that do not follow a straightforward rule of mixtures. Research efforts in this area have shown that the properties of filled elastomers are influenced by the nature of both the filler and the matrix, as well as the interactions between them. Several articles have reviewed the influence of fillers like silica and carbon black on the reinforcement of elastomers. In general, the structure-property relationships developed for filled elastomers have evolved into the following major areas: Filler structure, hydrodynamic reinforcement, and interactions between fillers and elastomers.

  4. Aluminum alloy welding and stress-corrosion testing. Final report

    SciTech Connect

    Gates, W.G.; Jimenez, E.

    1981-04-01

    The weldability, strength, and corrosion resistance of four 5XXX aluminum alloys electron beam welded to 6061-T6 aluminum alloy without a filler metal were evaluated. Adding filler metal raises weld energy requirements and makes the process more difficult to control. In this study, instead of using a filler metal, a high-magnesium 5XXX alloy was welded to the 6061 alloy. The four 5XXX alloys used (5456-H321, 5052-H34, 5086-H323, and 5083-H32) were selected for their high magnesium content which reduces weld crack sensitivity.

  5. The histological aspects of fillers complications.

    PubMed

    Zimmermann, Ute S; Clerici, Thierry J

    2004-12-01

    The histological aspects of resorbable heterologous fillers (bovine collagen, acid hyaluronique), autologous fillers (lipofilling, dermis-fat graft), biodegradable fillers (New-Fill), and permanent fillers (silicone, Artecoll, Evolution, Aquamid, DermaLive, DermaDeep, Bioplastique, Paraffin) are described. This article relates the morphological aspect of these materials, the normal tissue reaction after injection, and its chronological evolution as the morphological aspects from the different side effects, more frequently observed for the permanent fillers. They mainly consist of granulomatous reactions which may appear long after injection. PMID:15745233

  6. Fillers in dermatology: from past to present.

    PubMed

    Chacon, Anna H

    2015-11-01

    Injectable fillers were introduced in dermatology as a method for reconstructing facial deformities and restoring the aging face. Although fillers have become a popular option among cosmetic patients, clinical experience has shown that fillers must be used with caution, as complications can occur. This article provides a brief review of the history of filler agents currently available for soft tissue augmentation. Although no single filler is ideal for all patients, indications, and situations, residents should be aware of the properties and characteristics that make each product unique. PMID:26682563

  7. Well-organized raspberry-like Ag@Cu bimetal nanoparticles for highly reliable and reproducible surface-enhanced Raman scattering

    NASA Astrophysics Data System (ADS)

    Lee, Jung-Pil; Chen, Dongchang; Li, Xiaxi; Yoo, Seungmin; Bottomley, Lawrence A.; El-Sayed, Mostafa A.; Park, Soojin; Liu, Meilin

    2013-11-01

    Surface-enhanced Raman scattering (SERS) is ideally suited for probing and mapping surface species and incipient phases on fuel cell electrodes because of its high sensitivity and surface-selectivity, potentially offering insights into the mechanisms of chemical and energy transformation processes. In particular, bimetal nanostructures of coinage metals (Au, Ag, and Cu) have attracted much attention as SERS-active agents due to their distinctive electromagnetic field enhancements originated from surface plasmon resonance. Here we report excellent SERS-active, raspberry-like nanostructures composed of a silver (Ag) nanoparticle core decorated with smaller copper (Cu) nanoparticles, which displayed enhanced and broadened UV-Vis absorption spectra. These unique Ag@Cu raspberry nanostructures enable us to use blue, green, and red light as the excitation laser source for surface-enhanced Raman spectroscopy (SERS) with a large enhancement factor (EF). A highly reliable SERS effect was demonstrated using Rhodamine 6G (R6G) molecules and a thin film of gadolinium doped ceria.Surface-enhanced Raman scattering (SERS) is ideally suited for probing and mapping surface species and incipient phases on fuel cell electrodes because of its high sensitivity and surface-selectivity, potentially offering insights into the mechanisms of chemical and energy transformation processes. In particular, bimetal nanostructures of coinage metals (Au, Ag, and Cu) have attracted much attention as SERS-active agents due to their distinctive electromagnetic field enhancements originated from surface plasmon resonance. Here we report excellent SERS-active, raspberry-like nanostructures composed of a silver (Ag) nanoparticle core decorated with smaller copper (Cu) nanoparticles, which displayed enhanced and broadened UV-Vis absorption spectra. These unique Ag@Cu raspberry nanostructures enable us to use blue, green, and red light as the excitation laser source for surface-enhanced Raman spectroscopy

  8. Improved Wetting of Mixed Ionic/Electronic Conductors Used in Electrochemical Devices with Ternary Reactive Air Braze Filler Metals

    SciTech Connect

    Hardy, John S; Kim, Jin Yong Y; Thomsen, Ed C; Weil, K Scott

    2007-01-19

    This paper reports on the wetting behavior, reactivity, and long-term electrical conductance of a series of ternary filler metals being considered for brazing lanthanum strontium cobalt ferrite (LSCF) based oxygen separation membranes. Mixed ionic/electronic conducting perovskite oxides such as LSCF and various doped barium cerates are currently being considered for use in high-temperature electrochemical devices such as oxygen and hydrogen concentrators and solid oxide fuel cells. However to take full advantage of the unique properties of these materials, reliable joining techniques need to be developed. Furthermore, if the proposed joining technique were to yield a hermetic ceramic-to-metal junction that was also electrically conductive, it would additionally benefit the device by allowing current to be drawn from or carried to the electrochemically active mixed conducting oxide component without requiring an separate current collector. A newly developed brazing technique known as air brazing is one such method of joining. In its present form, air brazing uses a silver-copper oxide based filler metal that can be melted directly in air to form a compliant joint that is electrically conductive. Recently, it has been shown that the addition of titania can enhance the wetting behavior of Ag-CuO filler metals on alumina. Here the effect of this wetting agent on the surface wettability, long-term electrical resistance at 750°C, and reactivity with La0.6Sr0.4Co0.2Fe0.8O3- (LSCF-6428 or LSCF) substrates is discussed.

  9. Preparation and Properties of a Novel Al-Si-Ge-Zn Filler Metal for Brazing Aluminum

    NASA Astrophysics Data System (ADS)

    Niu, Zhiwei; Huang, Jihua; Yang, Hao; Chen, Shuhai; Zhao, Xingke

    2015-06-01

    The study is concerned with developing a filler metal with low melting temperature and good processability for brazing aluminum and its alloys. For this purpose, a novel Al-Si-Ge-Zn alloy was prepared according to Al-Si-Ge and Al-Si-Zn ternary phase diagrams. The melting characteristics, microstructures, wettability, and processing property of the alloy were investigated. The results showed that the melting temperature range of the novel filler metal was 505.2-545.1 °C, and the temperature interval between the solidus and the liquidus was 39.9 °C. Compared with a common Al-Si-Ge alloy, it had smaller and better dispersed β-GeSi solid solution precipitates, and the Zn-rich phases distributed on the boundary of the β-GeSi precipitates. The novel filler metal has good processability and good wettability with Al. There was one obvious transition layer with a thin α-Al solid solution between the filler metal and base metal, which is favorable to improve the strength of brazing joint.

  10. Substrate Effects on the High Temperature Oxidation Behavior of a Gold-Based Braze Filler Metal

    SciTech Connect

    Weil, K. Scott; Rice, Joseph P.

    2005-06-01

    Oxidation testing was conducted on a commercial gold-based braze alloy, Gold ABA®, and on zirconia/stainless steel couples joined using this filler metal. Preliminary results reveal that both substrates play a significant role in determining the overall oxidation behavior of the brazed joint.

  11. Substrate Effects on the High Temperature Oxidation Behavior of a Gold-Based Braze Filler Metal

    SciTech Connect

    Weil, K. Scott; Rice, Joseph P.

    2005-06-30

    Oxidation testing was conducted on a commercial gold-based braze alloy, Gold ABA, and on zirconia and stainless steel joining couples prepared using this braze filler metal. Preliminary results reveal that both substrates play a significant role in determining the overall oxidation resistance of the brazed joint.

  12. Soy-based fillers for thermoset composites

    NASA Astrophysics Data System (ADS)

    Watt, Paula

    Considerable work has been done with bio-based fillers in thermoplastics. Wood dust has been used for decades in wood plastic composites in conjunction with recycled high HDPE and PET. In recent years rapidly renewable fillers derived from dried distillery grains and from wood have been introduced commercially for thermoset polymers. These fillers provide bio-content and weight reduction to thermoset molding compounds but issues with moisture absorption and polymerization inhibition have limited their commercial acceptance. The intent of this research was to develop a bio-based filler suitable for thermoset composites. This filler would provide a low density alternative to mined mineral filler, such as CaCO3 or clay. Composites made with these fillers would be lighter in weight, which is desirable for many markets, particularly transportation. Cost parity to the mineral fillers, on a volume basis, was desirable and the use of green chemistry principles was a key objective of the project. This work provides a basis from which further development of modified soy flours as fillers for thermoset composites will continue. Biomass has been evaluated as fillers for thermoset composites since the early 1980s but failed to gain commercial acceptance due to excessive water absorption and inhibition issues with free radical curing. Biomass, with a large percentage of carbohydrates, are very hydrophilic due to their abundance of hydroxyl groups, while biomass, high in lignin, resulted in inhibition of the free radical cure of the unsaturated styrenated polyester matrix systems. Generally protein use as a filler is not desirable due to its food value. Torrefaction has proved to be a good, cost effective, process to reduce hydrophilicity of high cellulose feedstock. Surprising, however, some levels of torrefaction were found to induce the inhibition effect of the filler. Scientific inquiry into this problem proved that aromatics form during the torrefaction process and can

  13. Nonlinear optical properties and surface-plasmon enhanced optical limiting in Ag-Cu nanoclusters co-doped in SiO{sub 2} Sol-Gel films

    SciTech Connect

    Kiran, P. Prem; Shivakiran Bhaktha, B.N.; Rao, D. Narayana; De, Goutam

    2004-12-01

    The nonlinear optical properties and the role of the surface-plasmon resonance (SPR) on optical limiting (OL) properties of Ag-Cu nanoclusters co-doped in SiO{sub 2} matrix prepared using the sol-gel technique with a Cu/Ag molar ratio of 1, 2 and 3, respectively, are presented. The studies were made using the second harmonic of high-power nanosecond and picosecond Nd:YAG lasers. These films show a self-defocusing nonlinearity with both nanosecond and picosecond pulses and a good nonlinear absorption behavior with the nanosecond pulse excitation. The nonlinear refractive index decreased with decreasing particle size, whereas the nonlinear absorption increased with an increase in Cu concentration. The observed nonlinear absorption is explained by taking into account the cumulative effect of both the intraband and interband mechanisms. The excitation near the SPR of Cu resulted in an enhanced OL behavior with increasing Cu concentration. No such concentration dependence is observed when the excitation is near the SPR of Ag, however, the limiting threshold is reduced approximately 10-17 times. Excitation at wavelengths far below the SPR of Ag and Cu has not shown any OL behavior. The major contribution toward OL is observed to be from the interband absorption and from a possible energy transfer within the higher unoccupied states of Cu and Ag. Although nonlinear scattering is observed at higher intensities, its contribution is found to be much less than that of the nonlinear absorption assisted by an energy transfer.

  14. Pb-Bi-Ag-Cu-(Hg) chemistry of galena and some associated sulfosalts. A review and some new data from Colorado California and Pennsylvania

    USGS Publications Warehouse

    Foord, Eugene E.; Shawe, Daniel R.

    1989-01-01

    Galena, associated with Pb-Bi-Ag sulfosalts and simple sulfides, contains varied amounts of Ag and Bi in the Dandy vein system, Idarado mine, Ouray, Colorado; the Jackass mine, Darwin District, California; and the Leadville district, Colorado. Silver- and bismuth-bearing galena associated with minor amounts of pyrite, chalcopyrite and sphalerite occur at the Pequea mine, Lancaster County, Pennsylvania. Ag and Bi contents in the Dandy suite of galena range from about 1.4 to 3.4 and 2.5 to 6.5 wt.% respectively, and are comparable or lower in galena from the other localities. Exsolved matildite is present in galena from the Dandy, Jackass and Leadville localities. The presence in significant amounts of both Ag and Bi in a Pb-rich sulfide system is necessary for formation of PbSss (galena solid-solution). If Ag (especially) and Bi (to a lesser extent) are absent, the galena formed will be essentially pure PbS. Some minor Sb may substitute for Bi. Compositional data for all of the galena samples are in agreement with a previously proposed linear relationship between a and Ag-Bi(Sb) content. Matildite and seven additional Pb-Bi-Ag-Cu sulfosalts have been identified from the Dandy vein system, based on electron-microprobe analyses and some X-ray powder-diffraction data.

  15. Fillers: What's Here and What's Ahead.

    PubMed

    Solish, Nowell

    2016-06-01

    Soft tissue augmentation products (or fillers) are used for the correction of age-related changes in areas of the face. The most common filler material is hyaluronic acid, which is synthetically cross-linked. These materials are generally safe, but some side effects do occur. New fillers are expected to be approved in the United States in the near future. Semin Cutan Med Surg 35(supp6):S117-119. PMID:27537207

  16. Review of non-FDA-approved fillers.

    PubMed

    Ellis, David A F; Segall, Lorne

    2007-05-01

    The number of commercially available injectable soft tissue fillers has increased dramatically worldwide over the past decade. In the United States, a variety of temporary non-collagen-based fillers have been approved. However, no permanent soft tissue injectable fillers are currently approved by the US Food and Drug Administration. This article discusses some of the more popular soft tissue fillers, such as Restylane Fine Line, Restylane SQ, Perlane, Artecoll, Dermalive, Dermadeep, Bioalcamid, Bioplastique, Evolution, Outline, Argiform, and Aquamid, which are all available outside of the United States. PMID:17544940

  17. Current Concepts in Filler Injection.

    PubMed

    Moradi, Amir; Watson, Jeffrey

    2015-11-01

    When evaluating the face in thirds, the upper face, midface, and lower face, one may assume the lateral the temple, midface, and lateral mandible as the pillars of these subdivisions. Many of our facial aesthetic procedures address these regions, including the lateral brow lift, midface lift, and lateral face lift. As the use of facial fillers has advanced, more emphasis is placed on the correction of the temples, midlateral face, and lateral jaw line. This article is dedicated to these facial aesthetic pillars. PMID:26505545

  18. In situ heating transmission electron microscopy observation of nanoeutectic lamellar structure in Sn-Ag-Cu alloy on Au under-bump metallization.

    PubMed

    Seo, Jong-Hyun; Yoon, Sang-Won; Kim, Kyou-Hyun; Chang, Hye-Jung; Lee, Kon-Bae; Seong, Tae-Yeon; Fleury, Eric; Ahn, Jae-Pyoung

    2013-08-01

    We investigated the microstructural evolution of Sn(96.4)Ag(2.8)Cu(0.8) solder through in situ heating transmission electron microscopy observations. As-soldered bump consisted of seven layers, containing the nanoeutectic lamella structure of AuSn and Au₅Sn phases, and the polygonal grains of AuSn₂ and AuSn₄, on Au-plated Cu bond pads. Here, we found that there are two nanoeutectic lamellar layers with lamella spacing of 40 and 250 nm. By in situ heating above 140°C, the nanoeutectic lamella of AuSn and Au₅Sn was decomposed with structural degradation by sphering and coarsening processes of the lamellar interface. At the third layer neighboring to the lamella layer, on the other hand, Au₅Sn particles with a zig-zag shape in AuSn matrix became spherical and were finally dissipated in order to minimize the interface energy between two phases. In the other layers except both lamella layers, polycrystal grains of AuSn₂ and AuSn₄ grew by normal grain growth during in situ heating. The high interface energy of nanoeutectic lamella and polygonal nanograins, which are formed by rapid solidification, acted as a principal driving force on the microstructural change during the in situ heating. PMID:23920173

  19. Improved microstructure and mechanical properties in gas tungsten arc welded aluminum joints by using graphene nanosheets/aluminum composite filler wires.

    PubMed

    Fattahi, M; Gholami, A R; Eynalvandpour, A; Ahmadi, E; Fattahi, Y; Akhavan, S

    2014-09-01

    In the present study, different amounts of graphene nanosheets (GNSs) were added to the 4043 aluminum alloy powders by using the mechanical alloying method to produce the composite filler wires. With each of the produced composite filler wires, one all-weld metal coupon was welded using the gas tungsten arc (GTA) welding process. The microstructure, mechanical properties and fracture surface morphology of the weld metals have been evaluated and the results are compared. As the amount of GNSs in the composition of filler wire is increased, the microstructure of weld metal was changed from the dendritic structure to fine equiaxed grains. Furthermore, the tensile strength and microhardness of weld metal was improved, and is attributed to the augmented nucleation and retarded growth. From the results, it was seen that the GNSs/Al composite filler wire can be used to improve the microstructure and mechanical properties of GTA weld metals of aluminum and its alloys. PMID:24981209

  20. Development of brazing process for W-EUROFER joints using Cu-based fillers

    NASA Astrophysics Data System (ADS)

    de Prado, J.; Sánchez, M.; Ureña, A.

    2016-02-01

    A successful joint between W and EUROFER using high temperature brazing technique has been achieved for structural application in future fusion power plants. Cu-based powder alloy mixed with a polymeric binder has been used as filler. Microstructural analysis of the joints revealed that the joint consisted mainly of primary phases and acicular structures in a Cu matrix. Interaction between EUROFER and filler took place at the interface giving rise to several Cu-Ti-Fe rich layers. A loss of hardness at the EUROFER substrate close to the joint due to a diffusion phenomenon during brazing cycle was measured; however, the joints had an adequate shear strength value.

  1. Timing of porphyry (Cu-Mo) and base metal (Zn-Pb-Ag-Cu) mineralisation in a magmatic-hydrothermal system—Morococha district, Peru

    NASA Astrophysics Data System (ADS)

    Catchpole, Honza; Kouzmanov, Kalin; Bendezú, Aldo; Ovtcharova, Maria; Spikings, Richard; Stein, Holly; Fontboté, Lluís

    2015-12-01

    The Morococha district in central Peru is characterised by economically important Cordilleran polymetallic (Zn-Pb-Ag-Cu) vein and replacement bodies and the large Toromocho porphyry Cu-Mo deposit in its centre. U-Pb, Re-Os, and 40Ar/39Ar geochronology data for various porphyry-related hydrothermal mineralisation styles record a 3.5-Ma multi-stage history of magmatic-hydrothermal activity in the district. In the late Miocene, three individual magmatic-hydrothermal centres were active: the Codiciada, Toromocho, and Ticlio centres, each separated in time and space. The Codiciada centre is the oldest magmatic-hydrothermal system in the district and consists of a composite porphyry stock associated with anhydrous skarn and quartz-molybdenite veins. The hydrothermal events are recorded by a titanite U-Pb age at 9.3 ± 0.2 Ma and a molybdenite Re-Os age at 9.26 ± 0.03 Ma. These ages are indistinguishable from zircon U-Pb ages for porphyry intrusions of the composite stock and indicate a time span of 0.2 Ma for magmatic-hydrothermal activity. The small Ticlio magmatic-hydrothermal centre in the west of the district has a maximum duration of 0.3 Ma, ranging from porphyry emplacement to porphyry mineralisation at 8.04 ± 0.14 Ma (40Ar/39Ar muscovite cooling age). The Toromocho magmatic-hydrothermal centre has a minimum of five recorded porphyry intrusions that span a total of 1.3 Ma and is responsible for the formation of the giant Toromocho Cu-Mo deposit. At least two hydrothermal pulses are identified. Post-dating a first pulse of molybdenite mineralisation, wide-spread hydrous skarn covers an area of over 6 km2 and is recorded by five 40Ar/39Ar cooling ages at 7.2-6.8 Ma. These ages mark the end of the slowly cooling and long-lived Toromocho magmatic-hydrothermal centre soon after last magmatic activity at 7.26 ± 0.02 Ma. District-wide (50 km2) Cordilleran base metal vein and replacement bodies post-date the youngest recorded porphyry mineralisation event at Toromocho

  2. A comparative computational study on hydrogen adsorption on the Ag(+), Cu(+), Mg(2+), Cd(2+), and Zn(2+) cationic sites in zeolites.

    PubMed

    Kozyra, Paweł; Piskorz, Witold

    2016-05-14

    In this article the interaction between H2 and Ag(+), Cu(+), Mg(2+), Cd(2+), and Zn(2+) cations in cluster models of several sizes has been studied computationally. Depending on the changes imposed by the adsorption process on the H2 molecule the activation can vary in a wide range - from only slight weakening of the H-H bond to complete dissociation of the H2 molecule. The NOCV (Natural Orbitals for Chemical Valence) analysis allowed for decomposition of the electron density distortion into contributions easier for interpretation. Three essential factors have been identified (i-iii). In the case of bare cations the main contribution is a donation from σH2 to the cation (i). When a zeolite framework surrounding the cation is introduced, it hinders σ-donation and enhances π-backdonation from the cation to the antibonding orbital of the molecule (ii). For Cu(i) and Ag(i) sites π-backdonation becomes dominant, while for Mg(ii), Cd(ii), and Zn(ii) cations, the σ-donation, albeit diminished, still remains a dominant contribution. Calculations showed that the localization and coordination of Zn(ii) have crucial influence on its interaction with H2. We identified a Zn(2+) position at which the H2 molecule dissociates - here the interaction between H2 and oxygen framework (iii) plays a crucial role. Based on the calculations the mechanism of H2 transformation has been proposed. Upon heterolytic dissociation of H2 the Zn(0) moiety and two OH groups can be formed. Eventually, in two elementary steps, the H2 molecule can be restored. In this case, the ability of the site to activate/dissociate hydrogen is caused by the low coordination number of the zinc cation and the geometry of the site which allows positively charged H2 to interact with framework oxygen what enhances the formation of OH and Z-O-(ZnH)(+) groups. PMID:27092373

  3. Study of the effects of MeV Ag, Cu, Au, and Sn implantation on the optical properties of LiNbO3

    NASA Technical Reports Server (NTRS)

    Williams, E. K.; Ila, D.; Sarkisov, S.; Curley, M.; Poker, D. B.; Hensley, D. K.; Borel, C.

    1998-01-01

    The authors present the results of characterization of linear absorption and nonlinear refractive index of Au, Ag, Cu and Sn ion implantation into LiNbO3. Ag was implanted at 1.5 MeV to fluences of 2 to 17 x 17(exp 16)/sq cm at room temperature. Au and Cu were implanted to fluences of 5 to 20 x 10(exp 16)/sq cm at an energy of 2.0 MeV. Sn was implanted to a fluence of 1.6 x 10(exp 17)/sq cm at 160 kV. Optical absorption spectrometry indicated an absorption peak for the Au implanted samples after heat treatment at 1,000 C at approx. 620 nm. The Ag implanted samples absorption peaks shifted from approx. 450 nm before heat treatment to 550 nm after 500 C for 1h. Heat treatment at 800 C returned the Ag implanted crystals to a clear state. Cu nanocluster absorption peaks disappears at 500 C. No Sn clusters were observed by optical absorption or XRD. The size of the Ag and Au clusters as a function of heat treatment were determined from the absorption peaks. The Ag clusters did not change appreciably in size with heat treatment. The Au clusters increased from 3 to 9 nm diameter upon heat treatment at 1000 C. TEM analysis performed on a Au implanted crystal indicated the formation of Au nanocrystals with facets normal to the c-axis. Measurements of the nonlinear refractive indices were carried out using the Z-scan method with a tunable dye laser pumped by a frequency doubled mode-locked Nd:YAG laser. The dye laser had a 4.5 ps pulse duration time and 76 MHz pulse repetition rate (575 nm).

  4. 7 CFR 58.514 - Container fillers.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Container fillers. 58.514 Section 58.514 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards....514 Container fillers. Shall comply with the 3-A Sanitary Standards for Equipment for Packaging...

  5. Filler functionality in edible solid foams.

    PubMed

    van der Sman, R G M

    2016-05-01

    We review the functionality of particulate ingredients in edible brittle foams, such as expanded starchy snacks. In food science and industry there is not a complete awareness of the full functionality of these filler ingredients, which can be fibers, proteins, starch granules and whole grains. But, we show that much can be learned about that from the field of synthetic polymeric foams with (nano)fillers. For edible brittle foams the enhancement of mechanical strength by filler ingredients is less relevant compared to the additional functionalities such as 1) the promotion of bubble nucleation and 2) cell opening-which are much more relevant for the snack texture. The survey of particulate ingredients added to snack formulations shows that they cannot be viewed as inert fillers, because of their strong hygroscopic properties. Hence, these fillers will compete with starch for water, and that will modify the glass transition and boiling point, which are important factors for snack expansion. Filler properties can be modified via extrusion, but it is better if that processing step is decoupled from the subsequent processing steps as mixing and expansion. Several filler ingredients are also added because of their nutritional value, but can have adverse effect on snack expansion. These adverse effects can be reduced if the increase of nutritional value is decoupled from other filler functionality via compartmentalization using micropellets. PMID:27067462

  6. Wind-Resistant Filler for Tile Gaps

    NASA Technical Reports Server (NTRS)

    Bellavia, J.; Quigley, I. A.; Callahan, T. S.

    1982-01-01

    Filler developed for gaps between insulating tiles on Space Shuttle finds application in industries that use tiles for thermal or environmental protection. Filler consists of tight-fitting ceramic tubes and fibrous alumina. Combination resists high wind loads while providing requisite heat protection. Quartz-thread stitching holds envelope together.

  7. Dermal Fillers: Tips to Achieve Successful Outcomes

    PubMed Central

    Vedamurthy, Maya; Vedamurthy, Amar

    2008-01-01

    Fillers have become a common aesthetic treatment for several cosmetic problems. Several types of fillers are available from different sources and of different longevities. It is important that the treating physician be aware of the different techniques of administration and their possible side effects. This article reviews the available literature on the subject. PMID:20300346

  8. Adverse effects of fillers and their histopathology.

    PubMed

    Haneke, Eckart

    2014-12-01

    Injectable fillers nowadays represent a pillar in facial rejuvenation and make a significant contribution to the success of the treatment. Despite their obvious benefits, a wide range of possible complications such as immediate, late, delayed, temporary, or irreversible adverse effects have to be respected. Differentiating the various filler materials, these effects are assigned to histopathology findings and currently available treatment options. PMID:25536126

  9. Intumescent-ablator coatings using endothermic fillers

    NASA Technical Reports Server (NTRS)

    Sawko, P. M.; Riccitiello, S. R. (Inventor)

    1978-01-01

    An intumescent-ablator coating composition which contains the ammonium salt of 1,4-nitroaniline-2-sulfonic acid or 4,4 dinitrosul fanilide, a polymeric binder system and about 5 to 30% weight of an endothermic filler is reported. The filler has a decomposition temperature about or within the exothermic region of the intumescent agent.

  10. Emerging permanent filler technologies: focus on Aquamid.

    PubMed

    Yamauchi, Paul S

    2014-01-01

    A plethora of soft tissue fillers have been developed within the past decade to correct the cutaneous changes that occur with photoaging. Such fillers, whether nonpermanent, semipermanent, or permanent, are widely used to fill undesired facial rhytides. In addition, fillers are employed to correct atrophy of the face as well as other parts of the body such as the dorsum of the hands through volumization and contouring. The extensive long-term safety outcomes reported with fillers and the ease with which they are administered make them an ideal choice to correct rhytides and to contour the face. However, as with any cosmetic procedure, in order to ensure high patient satisfaction and a safe outcome, proper training in injection techniques, the choice of the proper candidate, and awareness of potential adverse events are essential. This review article focuses on the permanent filler, Aquamid, which is composed of polyacrylamide hydrogel. PMID:25336982

  11. Emerging permanent filler technologies: focus on Aquamid

    PubMed Central

    Yamauchi, Paul S

    2014-01-01

    A plethora of soft tissue fillers have been developed within the past decade to correct the cutaneous changes that occur with photoaging. Such fillers, whether nonpermanent, semipermanent, or permanent, are widely used to fill undesired facial rhytides. In addition, fillers are employed to correct atrophy of the face as well as other parts of the body such as the dorsum of the hands through volumization and contouring. The extensive long-term safety outcomes reported with fillers and the ease with which they are administered make them an ideal choice to correct rhytides and to contour the face. However, as with any cosmetic procedure, in order to ensure high patient satisfaction and a safe outcome, proper training in injection techniques, the choice of the proper candidate, and awareness of potential adverse events are essential. This review article focuses on the permanent filler, Aquamid, which is composed of polyacrylamide hydrogel. PMID:25336982

  12. Development of sputtered techniques for thrust chambers, task 1. [evaluation of filler materials for regeneratively cooled thrust chambers

    NASA Technical Reports Server (NTRS)

    Mullaly, J. R.; Schmid, T. E.; Hecht, R. J.

    1974-01-01

    Filler materials proposed for use in the sputter fabrication regeneratively cooled thrust chambers were evaluated. Low melting castable alloys, CERROBEND. CERROCAST, and CERROTRU, slurry applied SERMETEL 481 and flame-sprayed aluminum were investigated as filler materials. Sputter deposition from a cylindrical cathode inverted magnestron was used to apply an OFHC copper closeout layer to filled OFHC copper ribbed-wall cylindrical substrates. The sputtered closeout layer structure was evaluated with respect to filler material contamination, predeposition machining and finishing operations, and deposition parameters. The application of aluminum by flame-spraying resulted in excessiver filler porosity. Though the outgassing from this porosity was found to be detrimental to the closeout layer structure, bond strengths in excess of 10,500 psi were achieved. Removal of the aluminum from the grooves was readily accomplished by leaching in a 7.0 molar solution of sodium hydroxide at 353 K. Of the other filler materials evaluated, CERROTRU was found to be the most suitable material with respect to completely filling the ribbed-wall cylinders and vacuum system compatibility. However, bond contamination resulted in low closeout layer bond strength with the CERROTRU filler. CERROBEND, CERROCAST, and SERMETEL 481 were found to be unacceptable as filler materials.

  13. Bidirectional threshold switching in engineered multilayer (Cu{sub 2}O/Ag:Cu{sub 2}O/Cu{sub 2}O) stack for cross-point selector application

    SciTech Connect

    Song, Jeonghwan; Prakash, Amit; Lee, Daeseok; Woo, Jiyong; Cha, Euijun; Lee, Sangheon; Hwang, Hyunsang

    2015-09-14

    In this study, we achieved bidirectional threshold switching (TS) for selector applications in a Ag-Cu{sub 2}O-based programmable-metallization-cell device by engineering the stack wherein Ag was intentionally incorporated in the oxide (Cu{sub 2}O) layer by a simple approach comprising co-sputtering and subsequent optimized annealing. The distribution of the Ag was directly confirmed by transmission electron microscopy and energy dispersive spectroscopy line profiling. The observed TS occurred because of the spontaneous self-rupturing of the unstable Ag filament that formed in the oxide layer.

  14. An overview of permanent and semipermanent fillers.

    PubMed

    Broder, Kevin W; Cohen, Steven R

    2006-09-01

    The demand for safe, effective, long-lasting, biocompatible dermal filler materials is increasing. Many products that include synthetic polymers and autologous tissue have emerged that attempt to meet these criteria. An overview of injectable permanent fillers, including ArteFill, Aquamid, and silicone, and semipermanent fillers, including Radiesse, Sculptra, and autologous fat, is presented. A discussion of their composition, histologic characteristics, antigenicity, U.S. Food and Drug Administration approval status, indications for use, efficacy, injection technique, and adverse effects is provided. PMID:16936539

  15. Cosmetic Fillers: Perspectives on the Industry.

    PubMed

    Basta, Steven L

    2015-11-01

    The cosmetic filler industry has evolved substantially over the last 30 years. The market is characterized by multiple fillers and a competitive dynamic among major aesthetics companies. Marketing in the United States and Europe has been different owing to regulatory constraints. Differences have led to more rapid growth in the European market. The US market has evolved owing to growth of major companies with multiple product portfolios and leverage in consumer promotion and aesthetics office marketing owing to scale. The evolution of the filler market will include new materials, injection techniques, and facilitation devices, and new areas of injection. PMID:26505538

  16. Microstructural Evolution of the Interface Between Pure Titanium and Low Melting Point Zr-Ti-Ni(Cu) Filler Metals

    NASA Astrophysics Data System (ADS)

    Lee, Dongmyoung; Sun, Juhyun; Kang, Donghan; Shin, Seungyoung; Hong, Juhwa

    2014-12-01

    Low melting point Zr-based filler metals with melting point depressants (MPDs) such as Cu and Ni elements are used for titanium brazing. However, the phase transition of the filler metals in the titanium joint needs to be explained, since the main element of Zr in the filler metals differs from that of the parent titanium alloys. In addition, since the MPDs easily form brittle intermetallics, that deteriorate joint properties, the phase evolution they cause needs to be studied. Zr-based filler metals having Cu content from 0 to 12 at. pct and Ni content from 12 to 24 at. pct with a melting temperature range of 1062 K to 1082 K (789 °C to 809 °C) were wetting-tested on a titanium plate to investigate the phase transformation and evolution at the interface between the titanium plate and the filler metals. In the interface, the alloys system with Zr, Zr2Ni, and (Ti,Zr)2Ni phases was easily changed to a Ti-based alloy system with Ti, Ti2Ni, and (Ti,Zr)2Ni phases, by the local melting of parent titanium. The dissolution depths of the parent metal were increased with increasing Ni content in the filler metals because Ni has a faster diffusion rate than Cu. Instead, slow diffusion of Cu into titanium substrate leads to the accumulation of Cu at the molten zone of the interface, which could form undesirable Ti x Cu y intermetallics. This study confirmed that Zr-based filler metals are compatible with the parent titanium metal with the minimum content of MPDs.

  17. Nickel aluminide alloys with improved weldability

    DOEpatents

    Santella, M.L.; Goodwin, G.M.

    1995-05-09

    Weldable nickel aluminide alloys which are essentially free, if not entirely free, of weld hot cracking are provided by employing zirconium concentrations in these alloys of greater than 2.6 wt. % or sufficient to provide a substantial presence of Ni--Zr eutectic phase in the weld so as to prevent weld hot cracking. Weld filler metals formed from these so modified nickel aluminide alloys provide for crack-free welds in previously known nickel aluminide alloys. 5 figs.

  18. Nickel aluminide alloys with improved weldability

    DOEpatents

    Santella, Michael L.; Goodwin, Gene M.

    1995-05-09

    Weldable nickel aluminide alloys which are essentially free, if not entirely free, of weld hot cracking are provided by employing zirconium concentrations in these alloys of greater than 2.6 wt. % or sufficient to provide a substantial presence of Ni--Zr eutectic phase in the weld so as to prevent weld hot cracking. Weld filler metals formed from these so modified nickel aluminide alloys provide for crack-free welds in previously known nickel aluminide alloys.

  19. Epoxy coatings over latex block fillers

    SciTech Connect

    Vincent, L.D.

    1997-12-01

    Failures of polymerized epoxy coatings applied over latex/acrylic block fillers continue to plague owners of commercial buildings, particularly those with high architectural content such as condominiums, high rise offices, etc. Water treatment facilities in paper mills are especially prone to this problem. The types of failures include delamination of the topcoats, blisters in both the block fillers and the topcoats and disintegration of the block filler itself. While the problem is well known, the approach to a solution is not. A study of several coatings manufacturer`s Product Data Sheets shows a wide variance in the recommendations for what are purportedly generically equivalent block fillers. While one manufacturer might take an essentially architectural approach, another will take a heavy-duty industrial approach. To the specifying architect or engineer who has little training in the complexities of protective coating systems, this presents a dilemma. Who does he believe? What does he specify? To whom can he turn for independent advice?

  20. Mechanical properties of ethylene-octene copolymer (EOC) - lignocellulosic fillers biocomposites in dependence to filler content

    NASA Astrophysics Data System (ADS)

    Zykova, Anna; Pantyukhov, Petr; Popov, Anatoly

    2016-05-01

    The mechanical properties of biocomposites based on ethylene-octene copolymer were studied. The aim of present work was to investigate the mechanical properties of composites based on ethylene-octene copolymer (EOC) in dependence to type of the filler, filler content and trade mark of EOC. Addition of fillers (wood flour or seed flax straw) decreases elongation at break and decreases unsignificantly tensile strenght of examined copolymers. Particles of filler increase the toughness of polymer chain, which leads to decline of elongation at break. Biocomposites with wood flour had higher tensile strength and elongation at break than the composites with flax straw.

  1. The potpourri approach to hyaluronic acid filler injections.

    PubMed

    Lim, Adrian C

    2010-02-01

    There is an ever-expanding range of hyaluronic acid fillers with varying physical characteristics available to cosmetic dermatologists. These fillers are commercially packaged in syringes of approximately 1 mL (range 0.5-2 mL) volume. Filler injectors are currently qualitatively and quantitatively restricted to fillers packaged in ready-to-go syringes. Patients often present for pan-facial rejuvenation requiring varying amounts of fillers as well as more than one type/subtype of filler for optimum correction. The potpourri approach allows access to a range of prepared hyaluronic acid filler subtypes that can be used on the same patient in the one session. The potpourri method centres on the use of multiple 31-gauge insulin syringes prepared with a range of different hyaluronic acid filler products that are ready for use. This increases flexibility with filler selection and has the potential to provide better filler-to-tissue match for patients. PMID:20148852

  2. New Manufacturing Method for Paper filler and Fiber Material

    SciTech Connect

    Doelle, Klaus

    2011-11-22

    The study compares commercial available filler products with a new developed “Hybrid Fiber Filler Composite Material” and how main structural, optical and strength properties are affected by increasing the filler content of at least 5% over commercial values. The study consists of: (i) an overview of paper filler materials used in the paper production process, (ii) discusses the manufacturing technology of lime based filler materials for paper applications, (iii) gives an overview of new emerging paper filler technologies, (iv) discusses a filler evaluation of commercial available digital printing paper products, (v) reports from a detailed handsheet study and 12” pilot plant paper machine trial runs with the new Hybrid Fiber Filler Composite Material, and (vi) evaluates and compares commercial filler products and the new Hybrid Fiber Filler Composite Material with a life cycle analyses that explains manufacturing, economic and environmental benefits as they are applied to uncoated digital printing papers.

  3. Fillers for the improvement in acne scars

    PubMed Central

    Wollina, Uwe; Goldman, Alberto

    2015-01-01

    Acne is a common inflammatory disease. Scarring is an unwanted end point of acne. Both atrophic and hypertrophic scar types occur. Soft-tissue augmentation aims to improve atrophic scars. In this review, we will focus on the use of dermal fillers for acne scar improvement. Therefore, various filler types are characterized, and available data on their use in acne scar improvement are analyzed. PMID:26491364

  4. Initial investigation of cryogenic wind tunnel model filler materials

    NASA Technical Reports Server (NTRS)

    Rush, H. F.; Firth, G. C.

    1985-01-01

    Various filler materials are being investigated for applicability to cryogenic wind tunnel models. The filler materials will be used to fill surface grooves, holes and flaws. The severe test environment of cryogenic models precludes usage of filler materials used on conventional wind tunnel models. Coefficients of thermal expansion, finishing characteristics, adhesion and stability of several candidate filler materials were examined. Promising filler materials are identified.

  5. Comparative modular analysis of two complex sulfosalt structures: sterryite, Cu(Ag,Cu)3Pb19(Sb,As)22(As-As)S56, and parasterryite, Ag4Pb20(Sb,As)24S58.

    PubMed

    Moëlo, Yves; Guillot-Deudon, Catherine; Evain, Michel; Orlandi, Paolo; Biagioni, Cristian

    2012-10-01

    The crystal structures of two very close, but distinct complex minerals of the lead sulfosalt group have been solved: sterryite, Cu(Ag,Cu)(3)Pb(19)(Sb,As)(22)(As-As)S(56), and parasterryite, Ag(4)Pb(20)(Sb,As)(24)S(58). They are analyzed and compared according to modular analysis. The fundamental building block is a complex column centred on a Pb(6)S(12) triangular prismatic core, with two additional long and short arms. The main chemical and topological differences relate to the short arm, which induces a relative a/4 shift (~2 Å along the elongation parameter) of the constitutive rod layers, as illustrated by distinct cell settings within the same space group (P2(1)/n and P2(1)/c, respectively). Selection of the shortest (i.e. strongest) (Sb,As)-S bonds permitted to enhance the polymeric organization of (Sb,As) atoms with triangular pyramidal coordination. These two quasi-homeotypic structures are expanded derivatives of owyheeite, Ag(3)Pb(10)Sb(11)S(28). The hierarchy of organization levels from zero- to three-dimensional entities is subordinated to building operators, which appear as the driving force for the construction of such complex structures. Minor cations (Ag, Cu) or the As-As pair in sterryite secure the final locking, which favours the formation of one or the other compound. PMID:22992793

  6. Microstructure evolution of Al/Mg butt joints welded by gas tungsten arc with Zn filler metal

    SciTech Connect

    Liu Fei; Zhang Zhaodong; Liu Liming

    2012-07-15

    Based on the idea of alloying welding seam, Gas tungsten arc welding method with pure Zn filler metal was chosen to join Mg alloy and Al alloy. The microstructures, phases, element distribution and fracture morphology of welding seams were examined. The results indicate that there was a transitional zone in the width of 80-100 {mu}m between the Mg alloy substrate and fusion zone. The fusion zone was mainly composed of MgZn{sub 2}, Zn-based solid solution and Al-based solid solution. The welding seam presented distinct morphology in different location owning to the quite high cooling rate of the molten pool. The addition of Zn metal could prevent the formation of Mg-Al intermetallics and form the alloyed welding seam during welding. Therefore, the tensile strengths of joints have been significantly improved compared with those of gas tungsten arc welded joints without Zn metal added. Highlights: Black-Right-Pointing-Pointer Mg alloy AZ31B and Al alloy 6061 are welded successfully. Black-Right-Pointing-Pointer Zinc wire is employed as a filler metal to form the alloyed welding seam. Black-Right-Pointing-Pointer An alloyed welding seam is benefit for improving of the joint tensile strength.

  7. Effect of Filler Metals on the Weldability and Mechanical Properties of Multi-pass PCGTA Weldments of AISI 316L

    NASA Astrophysics Data System (ADS)

    Devendranath Ramkumar, K.; Maruthi Mohan Reddy, P.; Raja Arjun, B.; Choudhary, Ayush; Srivastava, Anubhav; Arivazhagan, N.

    2015-04-01

    The influence of filler metals on the microstructure, mechanical properties, and corrosion behavior of AISI 316L welds was investigated. Pulsed current gas tungsten arc welding was employed to join the AISI 316L plates using two different fillers ER2553 and ERNiCr-3. Microstructures studies showed the presence of different forms of austenite on employing ER2553 filler and formation of migrated grain boundaries at the weld zone while using ERNiCr-3 filler. Tensile studies corroborated that the tensile strength was greater for the weldments employing ER2553 filler. Charpy V-notch studies ascertained that the impact toughness was greater for ER2553 weldments as compared to the parent metal. Potentiodynamic polarization curves clearly inferred that the weld zone of ER2553 exhibited better corrosion resistance among the various coupons tested. It was concluded from the study that ER2553 exhibited better mechanical and corrosion properties and could be adopted to achieve optimal properties compared to over-alloyed filler.

  8. Filler augmentation, safe or unsafe: A case series of severe complications of fillers

    PubMed Central

    Omranifard, Mahmood; Taheri, Soheila

    2011-01-01

    BACKGROUND: The growing interest in filler injection requires a more comprehensive knowledge about the complications of this procedure. METHODS: A total of 5 cases with debilitating chronic complications following filler injection referred to Al-Zahra hospital, Isfahan are presented in this report. RESULTS: The outcome of treatment for two of the cases was satisfactory. In one case the treatment led to failure. A case committed suicide, the remaining case had received vitamin E injection which caused severe necrosis and scaring. CONCLUSIONS: All fillers are considered foreign bodies and may provoke the immune system to varying degrees. Most complications are, however, caused by the technique of injection not the filler itself. Experience of physicians along with adequate knowledge about fillers and their complications can definitely guarantee a better outcome. PMID:22973374

  9. Wetting and Mechanical Performance of Zirconia Brazed with Silver/Copper Oxide and Silver/Vanadium Oxide Alloys

    SciTech Connect

    Sinnamon, Kathleen E.; Meier, Alan; Joshi, Vineet V.

    2014-12-01

    The wetting behavior and mechanical strength of silver/copper oxide and silver/vanadium oxide braze alloys were investigated for both magnesia-stabilized and yttria-stabilized (Mg-PSZ and Y-TZP) transformation toughened zirconia substrates. The temperatures investigated were 1000 to 1100°C, with oxide additions of 1 to 10 weight percent V2O5 or CuO, and hold times of 0.9 to 3.6 ks. Increasing either the isothermal hold temperature or time had a distinctly negative effect on the joint strength. The maximum strengths for both braze alloys were obtained for 5 wt. % oxide additions at 1050°C with a hold time of 0.9 ks. The Mg-PSZ/Ag-CuO system exhibited a average fracture strength of 255 MPa (45% of the reported monolithic strength), and the Y-TZP/Ag-CuO system had an average fracture strength of 540 MPa (30% of the reported monolithic strength). The fracture strengths were lower for the Ag-V2O5 braze alloys, with fracture strengths of approximately 180 MPa (30% of the monolithic strength) for Mg-PSZ versus approximately 160 MPa (10% of the monolithic strength) for Y-TZP. No interfacial products were observed in low magnification SEM analysis for the brazing alloys containing V2O5 additions, while there were interfacial products present for brazes prepared with CuO additions in the braze alloy.

  10. Dissimilar joint characteristics of SiC and WC-Co alloy by laser brazing

    NASA Astrophysics Data System (ADS)

    Nagatsuka, K.; Sechi, Y.; Nakata, K.

    2012-08-01

    SiC and WC-Co alloys were joined by laser brazing with an active braze metal. The braze metal based on eutectic Ag-Cu alloy with additional Ti as an active element ranging from 0 to 2.8 mass% was sandwiched by the SiC block and WC-Co alloy plate. The brazing was carried out by selective laser beam irradiation on the WC-Co alloy plate. The content of Ti in the braze metal was required to exceed 0.6 mass% in order to form a brazed joint with a measurable shear strength. The shear strength increased with increasing Ti content up to 2.3 mass%Ti and decreased with a higher content.

  11. Temporal fossa defects: techniques for injecting hyaluronic acid filler and complications after hyaluronic acid filler injection.

    PubMed

    Juhász, Margit Lai Wun; Marmur, Ellen S

    2015-09-01

    Facial changes with aging include thinning of the epidermis, loss of skin elasticity, atrophy of muscle, and subcutaneous fat and bony changes, all which result in a loss of volume. As temporal bones become more concave, and the temporalis atrophies and the temporal fat pad decreases, volume loss leads to an undesirable, gaunt appearance. By altering the temporal fossa and upper face with hyaluronic acid filler, those whose specialty is injecting filler can achieve a balanced and more youthful facial structure. Many techniques have been described to inject filler into the fossa including a "fanned" pattern of injections, highly diluted filler injection, and the method we describe using a three-injection approach. Complications of filler in the temporal fossa include bruising, tenderness, swelling, Tyndall effect, overcorrection, and chewing discomfort. Although rare, more serious complications include infection, foreign body granuloma, intravascular necrosis, and blindness due to embolization into the ophthalmic artery. Using reversible hyaluronic acid fillers, hyaluronidase can be used to relieve any discomfort felt by the patient. Injectors must be aware of the complications that may occur and provide treatment readily to avoid morbidities associated with filler injection into this sensitive area. PMID:26311237

  12. Size and alloying induced shift in core and valence bands of Pd-Ag and Pd-Cu nanoparticles

    SciTech Connect

    Sengar, Saurabh K.; Mehta, B. R.; Govind

    2014-03-28

    In this report, X-ray photoelectron spectroscopy studies have been carried out on Pd, Ag, Cu, Pd-Ag, and Pd-Cu nanoparticles having identical sizes corresponding to mobility equivalent diameters of 60, 40, and 20 nm. The nanoparticles were prepared by the gas phase synthesis method. The effect of size on valence and core levels in metal and alloy nanoparticles has been studied by comparing the values to those with the 60 nm nanoparticles. The effect of alloying has been investigated by comparing the valence and core level binding energies of Pd-Cu and Pd-Ag alloy nanoparticles with the corresponding values for Pd, Ag, and Cu nanoparticles of identical sizes. These effects have been explained in terms of size induced lattice contractions, alloying induced charge transfer, and hybridization effects. The observation of alloying and size induced binding energy shifts in bimetallic nanoparticles is important from the point of view of hydrogen reactivity.

  13. High-Temperature Insulating Gap Filler

    NASA Technical Reports Server (NTRS)

    Toombs, Gordon R.; Oyoung, Kevin K.; Stevens, Everett G.

    1991-01-01

    New inorganic, ceramic filler for gaps between refractory ceramic tiles offers high resistance to heat and erosion. Consists of ceramic-fiber fabric precoated with silica and further coated with silica containing small amount of silicon carbide powder to increase thermal emittance. Developed as replacement for organic filler used on thermal-protection system of Space Shuttle. Promises to serve for many missions and to reduce cost and delay of refurbishing aerospace craft. Used as sealing material in furnaces or as heat shield for sensitive components in automobiles, aircraft, and home appliances.

  14. Understanding, Avoiding, and Managing Severe Filler Complications.

    PubMed

    Rzany, Berthold; DeLorenzi, Claudio

    2015-11-01

    Any injectable filler may elicit moderate-to-severe adverse events, ranging from nodules to abscesses to vascular occlusion. Fortunately, severe adverse events are uncommon for the majority of fillers currently on the market. Because these are rare events, it is difficult to identify the relevant risk factors and to design the most efficacious treatment strategies. Poor aesthetic outcomes are far more common than severe adverse events. These in contrast should be easily avoidable by ensuring that colleagues receive proper training and follow best practices. PMID:26441099

  15. Thermal pretreatment of silica composite filler materials

    PubMed Central

    Wan, Quan; Ramsey, Christopher

    2010-01-01

    Three different silica filler materials were thermally treated in order to effect dehydration, dehydroxylation, and rehydroxylation. Samples were characterized by thermogravimetry (TG), pycnometry, elemental analysis, and scanning electron microscopy (SEM). For all fillers, our results indicate incremental removal of silanol groups at higher heating temperatures and irreversible dehydroxylation at over 673 K. To remove the organic content and maintain adequate silanol density for subsequent silanization on Stöber-type silica, we suggest heating at 673 K followed by overnight boiling in water. PMID:20445821

  16. Characterization of Continuous and Discontinuous Precipitation Phases in Pd-Rich Precious Metal Alloys

    NASA Astrophysics Data System (ADS)

    Susan, Donald F.; Ghanbari, Zahra; Kotula, Paul G.; Michael, Joseph R.; Rodriguez, Mark A.

    2014-08-01

    Aberration-corrected scanning transmission electron microscopy (AC-STEM), X-ray diffraction (XRD), electron backscatter diffraction, and electron probe microanalysis were applied to characterize continuous and discontinuous phase formation in precious metal alloys used in electrical contacts. The Pd-rich Paliney® (®Paliney is tradename of Deringer-Ney Inc., Bloomfield, CT) alloys contain Pd, Ag, Cu, Au, Pt (and Zn or Ni). With aging at 755 K (482 °C), nanometer-scale chemistry modulation was observed indicating spinodal decomposition. An ordered body-centered tetragonal (bct) structure was also observed with AC-STEM after the 755 K (482 °C) aging treatment and another phase, tentatively identified as β-Cu3Pd4Zn, was found by microscopy and XRD after prolonged holds at higher temperatures. During slow cooling or isothermal holds at high temperature [755 K to 973 K (482 °C to 700 °C)], a two-phase lamellar structure develops along grain boundaries by discontinuous precipitation. XRD and AC-STEM showed that the lamellar structure was comprised of Ag-rich and Cu-rich fcc phases ( α 1 and α 2). The phases are discussed in relation to a pseudo-ternary diagram based on Ag-Cu-Pd, which provides a simplified representation of the discontinuous phase compositions in the multi-component alloy system.

  17. Electrical properties of thin-film structures formed by pulsed laser deposition of Au, Ag, Cu, Pd, Pt, W, Zr metals on n-6H-SiC crystal

    SciTech Connect

    Romanov, R. I.; Zuev, V. V.; Fominskii, V. Yu. Demin, M. V.; Grigoriev, V. V.

    2010-09-15

    Diode structures with ideality factors of 1.28-2.14 and potential barriers from 0.58 to 0.62 eV on the semiconductor side were formed by pulsed laser deposition of Au, Ag, Cu, Pd, Pt, W, and Zr metal films on n-6H-SiC crystal without epitaxial layer preparation. A high density of surface acceptor and donor states was formed at the metal-semiconductor interface during deposition of the laser-induced atomic flux, which violated the correlation between the potential barrier height and metal work function. The barrier heights determined from characteristic currents and capacitance measurements were in quite good agreement. For the used low-resistance semiconductor and contact elements, the sizes of majority carrier (electron) depletion regions were determined as 26-60 nm.

  18. DFT study of Hg adsorption on M-substituted Pd(1 1 1) and PdM/γ-Al2O3(1 1 0) (M = Au, Ag, Cu) surfaces

    NASA Astrophysics Data System (ADS)

    Wang, Jiancheng; Yu, Huafeng; Geng, Lu; Liu, Jianwen; Han, Lina; Chang, Liping; Feng, Gang; Ling, Lixia

    2015-11-01

    The adsorption of Hgn (n = 1-3) on the Au-, Ag-, Cu-substituted Pd(1 1 1) surfaces as well as the PdM/γ-Al2O3(1 1 0) (M = Au, Ag, Cu) surfaces has been investigated using spin-polarized density functional theory calculations. It is found that M-substituted Pd(1 1 1) surfaces show as good Hg adsorption capacity as the perfect Pd(1 1 1) at low Hg coverage, while the Hg adsorption capacity is only slightly weakened at high Hg coverage. On the basis of stepwise adsorption energies analysis, it is concluded that M-substituted Pd(1 1 1) surfaces can contribute to the binding of Hg atom on the surfaces at high Hg coverage. The electronic properties of the second metal atoms are the main factor contributes to the Hg adsorption capacity. Gas phase Pd2 shows better Hg adsorption capacity than Pd2/γ-Al2O3, while PdM/γ-Al2O3 can adsorb Hg more efficiently than bare PdM clusters. It suggests that the γ-Al2O3 support can enhance the activity of PdM for Hg adsorption and reduces the activity of Pd2. It is also found that Pd is the main active composition responsible for the interaction of mercury with the surface for PdM/γ-Al2O3 sorbent. Taking Hg adsorption capacity and economic costs into account, Cu addition is a comparatively good candidate for Hg capture.

  19. Update on hyaluronic acid fillers for facial rejuvenation.

    PubMed

    Mansouri, Yasaman; Goldenberg, Gary

    2015-08-01

    Injectable soft tissue filler procedures are becoming increasingly important for rejuvenating the aging face. The variety of available dermal fillers is increasing, and an understanding of their individual characteristics allows optimal outcomes. We provide an overview of the dermal fillers that were approved by the US Food and Drug Administration over the last 5 years. PMID:26367746

  20. 46 CFR 57.02-5 - Filler metals.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 46 Shipping 2 2013-10-01 2013-10-01 false Filler metals. 57.02-5 Section 57.02-5 Shipping COAST... Requirements § 57.02-5 Filler metals. (a) Except as provided for in paragraph (b) of this section, when filler metal is used in a welded fabrication that is required to meet the requirements of this part the...

  1. 46 CFR 57.02-5 - Filler metals.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 46 Shipping 2 2011-10-01 2011-10-01 false Filler metals. 57.02-5 Section 57.02-5 Shipping COAST... Requirements § 57.02-5 Filler metals. (a) Except as provided for in paragraph (b) of this section, when filler metal is used in a welded fabrication that is required to meet the requirements of this part the...

  2. 46 CFR 57.02-5 - Filler metals.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 46 Shipping 2 2014-10-01 2014-10-01 false Filler metals. 57.02-5 Section 57.02-5 Shipping COAST... Requirements § 57.02-5 Filler metals. (a) Except as provided for in paragraph (b) of this section, when filler metal is used in a welded fabrication that is required to meet the requirements of this part the...

  3. 46 CFR 57.02-5 - Filler metals.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 46 Shipping 2 2012-10-01 2012-10-01 false Filler metals. 57.02-5 Section 57.02-5 Shipping COAST... Requirements § 57.02-5 Filler metals. (a) Except as provided for in paragraph (b) of this section, when filler metal is used in a welded fabrication that is required to meet the requirements of this part the...

  4. 14 CFR 23.973 - Fuel tank filler connection.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 14 Aeronautics and Space 1 2014-01-01 2014-01-01 false Fuel tank filler connection. 23.973 Section... AIRWORTHINESS STANDARDS: NORMAL, UTILITY, ACROBATIC, AND COMMUTER CATEGORY AIRPLANES Powerplant Fuel System § 23.973 Fuel tank filler connection. (a) Each fuel tank filler connection must be marked as prescribed...

  5. 14 CFR 27.973 - Fuel tank filler connection.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 14 Aeronautics and Space 1 2014-01-01 2014-01-01 false Fuel tank filler connection. 27.973 Section... AIRWORTHINESS STANDARDS: NORMAL CATEGORY ROTORCRAFT Powerplant Fuel System § 27.973 Fuel tank filler connection. (a) Each fuel tank filler connection must prevent the entrance of fuel into any part of...

  6. 14 CFR 25.973 - Fuel tank filler connection.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 14 Aeronautics and Space 1 2014-01-01 2014-01-01 false Fuel tank filler connection. 25.973 Section... AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY AIRPLANES Powerplant Fuel System § 25.973 Fuel tank filler connection. Each fuel tank filler connection must prevent the entrance of fuel into any part of the...

  7. 7 CFR 29.6129 - Farm Filler (Y Group).

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 7 Agriculture 2 2014-01-01 2014-01-01 false Farm Filler (Y Group). 29.6129 Section 29.6129... REGULATIONS TOBACCO INSPECTION Standards Grades § 29.6129 Farm Filler (Y Group). This group consists of... groups. U.S. grades Grade names, minimum specifications, and tolerances Y1 Fine Quality Farm Filler....

  8. 7 CFR 29.6129 - Farm Filler (Y Group).

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 2 2011-01-01 2011-01-01 false Farm Filler (Y Group). 29.6129 Section 29.6129... REGULATIONS TOBACCO INSPECTION Standards Grades § 29.6129 Farm Filler (Y Group). This group consists of... groups. U.S. grades Grade names, minimum specifications, and tolerances Y1 Fine Quality Farm Filler....

  9. 46 CFR 57.02-5 - Filler metals.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Filler metals. 57.02-5 Section 57.02-5 Shipping COAST... Requirements § 57.02-5 Filler metals. (a) Except as provided for in paragraph (b) of this section, when filler metal is used in a welded fabrication that is required to meet the requirements of this part the...

  10. 14 CFR 23.973 - Fuel tank filler connection.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 14 Aeronautics and Space 1 2011-01-01 2011-01-01 false Fuel tank filler connection. 23.973 Section... AIRWORTHINESS STANDARDS: NORMAL, UTILITY, ACROBATIC, AND COMMUTER CATEGORY AIRPLANES Powerplant Fuel System § 23.973 Fuel tank filler connection. (a) Each fuel tank filler connection must be marked as prescribed...

  11. Nickel-chromium-silicon brazing filler metal

    DOEpatents

    Martini, Angelo J.; Gourley, Bruce R.

    1976-01-01

    A brazing filler metal containing, by weight percent, 23-35% chromium, 9-12% silicon, a maximum of 0.15% carbon, and the remainder nickel. The maximum amount of elements other than those noted above is 1.00%.

  12. 7 CFR 58.914 - Fillers.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 7 Agriculture 3 2013-01-01 2013-01-01 false Fillers. 58.914 Section 58.914 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing Practices), DEPARTMENT OF AGRICULTURE (CONTINUED) REGULATIONS AND STANDARDS UNDER THE AGRICULTURAL MARKETING ACT OF 1946 AND THE...

  13. 7 CFR 58.710 - Fillers.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 7 Agriculture 3 2013-01-01 2013-01-01 false Fillers. 58.710 Section 58.710 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing Practices), DEPARTMENT OF AGRICULTURE (CONTINUED) REGULATIONS AND STANDARDS UNDER THE AGRICULTURAL MARKETING ACT OF 1946 AND THE...

  14. Biofilms: Their Role in Dermal Fillers

    PubMed Central

    Sadashivaiah, Anitha B; Mysore, Venkataram

    2010-01-01

    Fillers are commonly used in several aesthetic indications. Though considered safe, several side effects have been reported. The role of biofilms in the causation of some of these side effects has been elucidated only recently and this article presents a short review of the subject. PMID:20606988

  15. 7 CFR 58.914 - Fillers.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Fillers. 58.914 Section 58.914 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing Practices), DEPARTMENT OF AGRICULTURE (CONTINUED) REGULATIONS AND STANDARDS UNDER THE AGRICULTURAL MARKETING ACT OF 1946 AND THE...

  16. 7 CFR 58.710 - Fillers.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Fillers. 58.710 Section 58.710 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing Practices), DEPARTMENT OF AGRICULTURE (CONTINUED) REGULATIONS AND STANDARDS UNDER THE AGRICULTURAL MARKETING ACT OF 1946 AND THE...

  17. High Temperature Filler for Tile Gaps

    NASA Technical Reports Server (NTRS)

    Holt, J. W.; Wang, D. S.

    1983-01-01

    Gaps between ceramic tiles filled with ceramic-coated fabric that withstands temperatures as high as 2,000 degrees F (1,300 degrees C). Reusable high-temperature gap filler is made of fabric coated with ceramic slurry and bonded in place with room-temperature-vulcanized adhesive. Procedure used in kilns and furnaces.

  18. 7 CFR 30.14 - Cigar filler.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 7 Agriculture 2 2013-01-01 2013-01-01 false Cigar filler. 30.14 Section 30.14 Agriculture Regulations of the Department of Agriculture AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing Practices), DEPARTMENT OF AGRICULTURE COMMODITY STANDARDS AND STANDARD CONTAINER REGULATIONS TOBACCO STOCKS AND STANDARDS Classification of...

  19. 7 CFR 30.14 - Cigar filler.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 7 Agriculture 2 2012-01-01 2012-01-01 false Cigar filler. 30.14 Section 30.14 Agriculture Regulations of the Department of Agriculture AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing Practices), DEPARTMENT OF AGRICULTURE COMMODITY STANDARDS AND STANDARD CONTAINER REGULATIONS TOBACCO STOCKS AND STANDARDS Classification of...

  20. 7 CFR 30.14 - Cigar filler.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 2 2010-01-01 2010-01-01 false Cigar filler. 30.14 Section 30.14 Agriculture Regulations of the Department of Agriculture AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing Practices), DEPARTMENT OF AGRICULTURE COMMODITY STANDARDS AND STANDARD CONTAINER REGULATIONS TOBACCO STOCKS AND STANDARDS Classification of...

  1. Process for recovering filler from polymer

    DOEpatents

    Smith, Maurice L.; Smith, Robert M.

    1978-01-01

    This disclosure relates to a process for recovering filler material from a polymeric matrix by reacting the matrix at an elevated temperature in a gas atmosphere with a controlled oxidizing potential and thereafter separating and cleaning the residue from the reaction mixture.

  2. Welding of gamma titanium aluminide alloys

    NASA Technical Reports Server (NTRS)

    Smashey, Russell W. (Inventor); Kelly, Thomas J. (Inventor); Snyder, John H. (Inventor); Sheranko, Ronald L. (Inventor)

    1998-01-01

    An article made of a gamma titanium aluminide alloy is welded, as for example in the weld repair of surface cracks, by removing foreign matter from the area to be welded, first stress relieving the article, cooling the entire article to a welding temperature of from about 1000.degree. F. to about 1400.degree. F., welding a preselected region in an inert atmosphere at the welding temperature, and second stress relieving the article. Welding is preferably accomplished by striking an arc in the preselected region so as to locally melt the alloy in the preselected region, providing a filler metal having the same composition as the gamma titanium aluminide alloy of the article, and feeding the filler metal into the arc so that the filler metal is melted and fused with the article to form a weldment upon solidification.

  3. Thermally conductive polyamide 6/carbon filler composites based on a hybrid filler system

    NASA Astrophysics Data System (ADS)

    Ha, Sung Min; Kwon, O. Hwan; Gyeong Oh, Yu; Kim, Yong Seok; Lee, Sung-Goo; Won, Jong Chan; Cho, Kwang Soo; Gak Kim, Byoung; Yoo, Youngjae

    2015-12-01

    We explored the use of a hybrid filler consisting of graphite nanoplatelets (GNPs) and single walled carbon nanotubes (SWCNTs) in a polyamide 6 (PA 6) matrix. The composites containing PA 6, powdered GNP, and SWCNT were melt-processed and the effect of filler content in the single filler and hybrid filler systems on the thermal conductivity of the composites was examined. The thermal diffusivities of the composites were measured by the standard laser flash method. Composites containing the hybrid filler system showed enhanced thermal conductivity with values as high as 8.8 W (m · K)-1, which is a 35-fold increase compared to the thermal conductivity of pure PA 6. Thermographic images of heat conduction and heat release behaviors were consistent with the thermal conductivity results, and showed rapid temperature jumps and drops, respectively, for the composites. A composite model based on the Lewis-Nielsen theory was developed to treat GNP and SWCNT as two separate types of fillers. Two approaches, the additive and multiplicative approaches, give rather good quantitative agreement between the predicted values of thermal conductivity and those measured experimentally.

  4. A new technique for the strengthening of aluminum tungsten inert gas weld metals: using carbon nanotube/aluminum composite as a filler metal.

    PubMed

    Fattahi, M; Nabhani, N; Rashidkhani, E; Fattahi, Y; Akhavan, S; Arabian, N

    2013-01-01

    The effect of multi-walled carbon nanotube (MWCNT) on the mechanical properties of aluminum multipass weld metal prepared by the tungsten inert gas (TIG) welding process was investigated. High energy ball milling was used to disperse MWCNT in the aluminum powder. Carbon nanotube/aluminum composite filler metal was fabricated for the first time by hot extrusion of ball-milled powders. After welding, the tensile strength, microhardness and MWCNT distribution in the weld metal were investigated. The test results showed that the tensile strength and microhardness of weld metal was greatly increased when using the filler metal containing 1.5 wt.% MWCNT. Therefore, according to the results presented in this paper, it can be concluded that the filler metal containing MWCNT can serve as a super filler metal to improve the mechanical properties of TIG welds of Al and its alloys. PMID:23948441

  5. Weldability of High Alloys

    SciTech Connect

    Maroef, I

    2003-01-22

    The purpose of this study was to investigate the effect of silicon and iron on the weldability of HAYNES HR-160{reg_sign} alloy. HR-I60 alloy is a solid solution strengthened Ni-Co-Cr-Si alloy. The alloy is designed to resist corrosion in sulfidizing and other aggressive high temperature environments. Silicon is added ({approx}2.75%) to promote the formation of a protective oxide scale in environments with low oxygen activity. HR-160 alloy has found applications in waste incinerators, calciners, pulp and paper recovery boilers, coal gasification systems, and fluidized bed combustion systems. HR-160 alloy has been successfully used in a wide range of welded applications. However, the alloy can be susceptible to solidification cracking under conditions of severe restraint. A previous study by DuPont, et al. [1] showed that silicon promoted solidification cracking in the commercial alloy. In earlier work conducted at Haynes, and also from published work by DuPont et al., it was recognized that silicon segregates to the terminal liquid, creating low melting point liquid films on solidification grain boundaries. Solidification cracking has been encountered when using the alloy as a weld overlay on steel, and when joining HR-160 plate in a thickness greater than19 millimeters (0.75 inches) with matching filler metal. The effect of silicon on the weldability of HR-160 alloy has been well documented, but the effect of iron is not well understood. Prior experience at Haynes has indicated that iron may be detrimental to the solidification cracking resistance of the alloy. Iron does not segregate to the terminal solidification product in nickel-base alloys, as does silicon [2], but iron may have an indirect or interactive influence on weldability. A set of alloys covering a range of silicon and iron contents was prepared and characterized to better understand the welding metallurgy of HR-160 alloy.

  6. Imaging features of midface injectable fillers and associated complications.

    PubMed

    Ginat, D T; Schatz, C J

    2013-08-01

    Injectable fillers are increasingly used for midface augmentation, which can be performed for facial rejuvenation and treatment of HIV facial lipoatrophy. A variety of temporary and permanent filler agents has been developed, including calcium hydroxylapatite, collagen, liquid silicone, polytetrafluoroethylene, hyaluronic acid, poly-l-lactic acid, and polyacrylamide gel. Facial fillers are sometimes encountered on radiologic imaging incidentally and should not be mistaken for pathology. Alternatively, patients with facial fillers may undergo imaging specifically to evaluate associated complications, such as infection, overfilling, migration, foreign-body reaction, and scarring. Therefore, it is important to be familiar with the imaging appearances of the various filler materials and their complications. PMID:22837310

  7. Chemical interaction of polyethylene matrix with vegetable fillers in biocomposites

    NASA Astrophysics Data System (ADS)

    Pantyukhov, Petr; Monakhova, Tatiana; Popov, Anatoly; Zykova, Anna

    2016-05-01

    The paper studies the diffusion of low molecular weight components from vegetable fillers into polyethylene matrix during the preparation of biocomposites. In order to identify the diffusible substances a model experiment used where the hexadecane acted as a model of polyethylene. It was determined that polyphenolic compounds and chlorophyll penetrate from vegetable fillers to hexadecane to the maximum extent. There was found a correlation between the amount of polyphenolic compounds diffusible from the fillers to hexadecane and thermal oxidation kinetics of real biocomposites based on polyethylene and vegetable fillers. Thus, it has been assumed the diffusion of polyphenols and chlorophyll from vegetable fillers into polyethylene matrix during the preparation of biocomposites.

  8. Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects

    NASA Astrophysics Data System (ADS)

    Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un

    2016-01-01

    The mechanical stability and thermo-mechanical fatigue performance of solder joints with low silver content Sn-1.0Ag-0.5Cu (wt.%) (SAC105) alloy based on different cooling rates are investigated in high G level shock environment and thermal cycling conditions. The cooling rate-controlled samples ranging from 1°C/min to 75°C/min cooling rate, not only show differences in microstructure, where a fine poly-granular microstructure develops in the case of fast cooling versus normal cooling, but also show various shock performances based on the microstructure changes. The fast cooling rate improves the high G shock performance by over 90% compared to the normal cooled SAC105 alloy air-cooling environment commonly used after assembly reflow. The microstructure effect on thermal cycling performance is also discussed, which is analyzed based on the Sn grain orientation, interconnect stability, and solder joint bulk microstructure.

  9. Injectable fillers for facial soft tissue enhancement.

    PubMed

    Sclafani, A P; Romo, T

    2000-01-01

    Soft tissue augmentation materials have been advocated for correction of post-surgical or post-traumatic facial defects, as well as for age-related folds and wrinkles. While autogenous tissues may be the safest option, they require a second operative site. Animal-derived or synthetic materials have been advocated since the late 19th century, and have waxed and waned in popularity. In recent years, we have gained a better understanding of the physical events that occur when material is placed within or below the skin. With this knowledge, we stand at the threshold of a new era, where soft tissue fillers can be designed and customized to suit the individual patient. This article will review the major materials that have been or are now advocated for use as soft tissue fillers, and will detail their relative strengths and weaknesses in order to give the clinician a better perspective when considering a material for soft tissue augmentation. PMID:11802343

  10. Hyaluronic Acid Fillers: Science and Clinical Uses.

    PubMed

    Gutowski, Karol A

    2016-07-01

    Hyaluronic acid soft tissue fillers include a range of products (Juvederm Ultra, Juvederm Ultra Plus, Voluma, Restylane Silk, Restylane, Restylane Lyft, and Belotero Balance) that are used commonly for facial rejuvenation and enhancement of facial features. Although these products are similar in many ways, they are not interchangeable and have unique characteristics that need to be considered. Injection sites and techniques for facial rejuvenation are discussed. PMID:27363762