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Sample records for circuit board pcb

  1. Printed Circuit Board Design (PCB) with HDL Designer

    NASA Technical Reports Server (NTRS)

    Winkert, Thomas K.; LaFourcade, Teresa

    2004-01-01

    Contents include the following: PCB design with HDL designer, design process and schematic capture - symbols and diagrams: 1. Motivation: time savings, money savings, simplicity. 2. Approach: use single tool PCB for FPGA design, more FPGA designs than PCB designers. 3. Use HDL designer for schematic capture.

  2. Optical printed circuit board (O-PCB) for VLSI micro/nano-photonic application

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.; Kang, J. K.; Chin, I.; Kwon, Y. K.; Choi, Y. W.

    2005-01-01

    We present, in the form of review, the results of our study on the design, fabrication and assembly of optical printed circuit boards (O-PCBs) for VLSI micro/nano-photonic applications. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards, substrates or chips, in a manner similar to the electrical printed circuit boards (E-PCBs). We have assembled and constructed O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined their information handling performances. We also designed power beam splitters and waveguide filters using nano-scale photonic band-gap crystals. We discuss scientific and technological issues concerning the processes of miniaturization, interconnection and integration of polymer optical waveguide devices and arrays for O-PCB and VLSI micro/nano-photonics as applicable to board-to-board, chip-to-chip, and intra-chip integration for computers, telecommunications, and transportation systems.

  3. Micro/nano-scale fabrication of integrated polymer optical wire circuit arrays for optical printed circuit board (O-PCB) application

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, Seung G.; Park, Se G.; Kim, Kyong H.; Kang, Jin K.; Chin, In J.; Kwon, Y. K.; Choi, Young W.

    2005-02-01

    We report on the results of our study on the micro/nano-scale design, fabrication and integration of waveguide arrays for optical printed circuit boards (O-PCBs) and VLSI micro/nano-photonic applications. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We have assembled O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined information handling performances. We also designed power beam splitters and waveguide filters, using nano-scale photonic band-gap crystals, for VLSI photonic integration application. We discuss potential applications of polymer optical waveguide devices and arrays for O-PCB and VLSI micro/nano-photonics for computers, telecommunications, and transportation systems.

  4. Investigation of multilayer printed circuit board (PCB) film warpage using viscoelastic properties measured by a vibration test

    NASA Astrophysics Data System (ADS)

    Joo, Sung-Jun; Park, Buhm; Kim, Do-Hyoung; Kwak, Dong-Ok; Song, In-Sang; Park, Junhong; Kim, Hak-Sung

    2015-03-01

    Woven glass fabric/BT (bismaleimide triazine) composite laminate (BT core), copper (Cu), and photoimageable solder resist (PSR) are the most widely used materials for semiconductors in electronic devices. Among these materials, BT core and PSR contain polymeric materials that exhibit viscoelastic behavior. For this reason, these materials are considered to have time- and temperature-dependent moduli during warpage analysis. However, the thin geometry of multilayer printed circuit board (PCB) film makes it difficult to identify viscoelastic characteristics. In this work, a vibration test method was proposed for measuring the viscoelastic properties of a multilayer PCB film at different temperatures. The beam-shaped specimens, composed of a BT core, Cu laminated on a BT core, and PSR and Cu laminated on a BT core, were used in the vibration test. The frequency-dependent variation of the complex bending stiffness was determined using a transfer function method. The storage modulus (E‧) of the BT core, Cu, and PSR as a function of temperature and frequency were obtained, and their temperature-dependent variation was identified. The obtained properties were fitted using a viscoelastic model for the BT core and the PSR, and a linear elastic model for the Cu. Warpage of a line pattern specimen due to temperature variation was measured using a shadow Moiré analysis and compared to predictions using a finite element model. The results provide information on the mechanism of warpage, especially warpage due to temperature-dependent variation in viscoelastic properties.

  5. Nonlinear dynamic response of a 'flexible-and-heavy' printed circuit board (PCB) to an impact load applied to its support contour

    NASA Astrophysics Data System (ADS)

    Suhir, E.; Vujosevic, M.; Reinikainen, T.

    2009-02-01

    Based on the developed simple and physically meaningful analytical ('mathematical') stress model, we evaluate some major parameters (amplitude, frequency, maximum acceleration, stresses and strains) of the response of a 'flexible-and-heavy' square simply supported printed circuit board (PCB) to an impact drop load applied to its support contour. The analysis is restricted to the first mode of vibrations and is carried out in application to the PCB design employed in an advanced accelerated test setup (test vehicle). This setup is aimed at the assessment of the performance, in accelerated test conditions on the board level, of packaging materials (and, first of all, BGA solder joint interconnections) subjected to dynamic (drop or shock) loading. It is anticipated that heavy masses could be mounted on the PCB to accelerate its dynamic response to an impact load. These masses are expected to be small in size, so that while changing the total mass of the board and generating significant inertia forces, they do not affect the board's flexural rigidity or its stiffness with respect to the in-plane loading. The PCB's contour is considered non-deformable, which is indeed the case in many practical situations. This circumstance, if the drop height and/or the induced inertia forces are significant, leads to elevated in-plane ('membrane') stresses in the PCB and, as a result of that, to the nonlinear response of the board to the impact load: the relationship between the magnitude of the load (determined by the initial impact velocity) and the induced PCB deflections becomes geometrically nonlinear, with a rigid cubic characteristic of the restoring force. The carried out numerical example, although reflects the characteristics of the PCB and loading conditions in an actual experimental setup, is merely an illustration of the general concept and is intended to demonstrate the abilities of the suggested method. Predictions based on this method agree well with the finite element

  6. Document Template for Printed Circuit Board Layout

    SciTech Connect

    Anderson, J.T.; /Fermilab

    1998-01-01

    The purpose of this document is to list the information that may be required to properly specify a printed circuit board (PCB) design. You must provide sufficient information to the PCB layout vendor such that they can quote accurately and design the PCB that you need. Use the following information as a guide to write your specification. Include as much of it as is necessary to get the PCB design that you want.

  7. Bi-directional homogenization equivalent modeling for the prediction of thermo-mechanical properties of a multi-layered printed circuit board (PCB)

    NASA Astrophysics Data System (ADS)

    Joo, Sung-Jun; Park, Buhm; Kim, Do-Hyoung; Kwak, Dong-Ok; Park, Junhong; Kim, Hak-Sung

    2016-04-01

    Warpage of multi-layered printed circuit boards (PCB) during the reflow process is a serious problem which affects the reliability of solder ball connections between the PCB and the mounted semi-conductor packages in electronic devices. It is essential to predict the warpage of the PCB accurately; however, the complicated copper patterns in multi-layered PCBs render a full modeling analysis impossible due to the excessive computing time required. To overcome this problem, we have developed analytical equations of three Cu patterns (line, square, and grid) for the application of thermo-mechanical properties simply by equivalent modeling of Cu patterns. In the proposed equations, the effect of thermo-viscoelastic properties as well as the influence of surrounding layers such as woven glass fabric/BT (bismaleimide triazine), composite laminate (BT core), and photoimageable solder resist (PSR) were considered. To verify the developed equations, vibration tests based on the wave propagation approach were performed at various temperatures. Good agreement was observed between the equivalent model and the experimental results.

  8. Fabrication and integration of micro/nano-scale polymer optical waveguides and devices for optical printed circuit board (O-PCB) application

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, Seung Gol; O, Beom Hoan; Park, Se Geun; Kim, Kyong Heon; Kang, Jin Ku; Chin, I.; Kwon, Y. K.; Choi, Young Wan

    2005-04-01

    We report on the results of our study on the design, fabrication and integration of micro/nano-scale waveguide arrays and devices for applications for a modular system that we newly proposed and call "optical printed circuit board (O-PCB)," which we envision to use as a platform for VLSI micro/nano-photonic applications. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We have designed and assembled O-PCBs using polymer-based optical waveguide arrays and circuits. We describe the procedures for the synthesis of polymers, procedures of forming masters and stamps, and procedures of forming waveguides using embossing techniques. We also describe the procedures of design, fabrication and construction of O-PCBs and describe the procedures for light coupling between light sources, detectors, waveguides and other functional devices. We also describe design of power beam splitters and waveguide filters using photonic band-gap crystals for VLSI photonic integration application. We also discuss the characteristics of the assembled O-PCBs and discuss their potential applications.

  9. Automatic inspection system for printed circuit boards.

    PubMed

    Hara, Y; Akiyama, N; Karasaki, K

    1983-06-01

    The purpose of this correspondence is to present problems and methods in automating visual inspection of printed circuit boards (PCB's). Vertical and diagonal illumination are useful in detecting PCB patterns correctly. An algorithm comparing local features of the patterns to be inspected with those of the pattern to be referenced is proposed. An inspection system using developed technologies is also described. PMID:21869150

  10. Fabrication and integration of micro/nano-scale optical wire circuit arrays and devices for high-speed and compact optical printed circuit board (O-PCB) and VLSI photonic applications

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.; Kang, J. K.; Choi, Y. W.; Song, S. H.

    2005-09-01

    We report on the design, fabrication and integration of micro/nano-scale optical wire circuit arrays and devices for high-speed, compact, light-weight, low power optical printed circuit boards (O-PCBs) and VLSI photonic applications. The optical wires are formed in the form of waveguides by thermal embossing and ultraviolet (UV) radiated embossing of polymer materials. The photonic devices include vertically coupled surface emitting laser (VCSEL) microlasers, microlenses, 45-degree reflection couplers, directional couplers, arrayed waveguide grating structures, multimode interference (MMI) devices and photodetectors. These devices are optically interconnected and integrated for O-PCB assembly and VLSI micro/nano-photonics. The O-PCBs are to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We report on the result of the optical transmission performances of these assembled O-PCBs. For the design, fabrication, and VLSI integration of nano-scale photonic devices, we used photonic crystal structures and plasmonic metallic waveguide structures. We examined the bandwidth, power dissipation, thermal stability, weight, and the miniaturization and density of optical wires and the O-PCB module. Characteristics of these devices are also described.

  11. Printed circuit board industry.

    PubMed

    LaDou, Joseph

    2006-05-01

    The printed circuit board is the platform upon which microelectronic components such as semiconductor chips and capacitors are mounted. It provides the electrical interconnections between components and is found in virtually all electronics products. Once considered low technology, the printed circuit board is evolving into a high-technology product. Printed circuit board manufacturing is highly complicated, requiring large equipment investments and over 50 process steps. Many of the high-speed, miniaturized printed circuit boards are now manufactured in cleanrooms with the same health and safety problems posed by other microelectronics manufacturing. Asia produces three-fourths of the world's printed circuit boards. In Asian countries, glycol ethers are the major solvents used in the printed circuit board industry. Large quantities of hazardous chemicals such as formaldehyde, dimethylformamide, and lead are used by the printed circuit board industry. For decades, chemically intensive and often sloppy manufacturing processes exposed tens of thousands of workers to a large number of chemicals that are now known to be reproductive toxicants and carcinogens. The printed circuit board industry has exposed workers to high doses of toxic metals, solvents, acids, and photolithographic chemicals. Only recently has there been any serious effort to diminish the quantity of lead distributed worldwide by the printed circuit board industry. Billions of electronics products have been discarded in every region of the world. This paper summarizes recent regulatory and enforcement efforts. PMID:16580876

  12. Design, fabrication, and integration of micro/nano-scale optical waveguide arrays and devices for optical printed circuit board (O-PCB) and VLSI micro/nano-photonic application

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, S. G.; O, B. H.; Kim, K. H.; Kang, J. K.; Kwon, Y. K.; Chin, I.-J.; Choi, Y. W.; Song, S. H.

    2005-09-01

    We present a review of our work on the micro/nano-scale design, fabrication and integration of optical waveguide arrays and devices for applications in a newly-conceived optical module system that we call "optical printed circuit board" (O-PCBs) and VLSI micro/nano-photonic integrated circuit. The O-PCBs consist of planar circuits and arrays of waveguides and devices of various dimensions and characteristics to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards. The VLSI micro/nano-photonic integrated circuits perform similar functions on a chip scale. O-PCBs consist of planar circuits and arrays of waveguides and devices of various dimensions and characteristics to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards. Fundamentally it contrasts with the electrical printed circuit board (E-PCB), which is designed to perform transporting, processing and distributing electrical signals. We have assembled O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined information handling performances when they are interconnected with the micro-laser arrays, detector arrays and optoelectronic devices. For VLSI nano-scale photonic inte-gration and applications, we designed power splitters and waveguide filters using photonic band-gap crystals and plasmonic waveguide structures. We discuss scientific issues and technological issues concerning the minia-turization, interconnection, and integration of micro/nano-photonic devices and circuits and discuss potential utilities of O-PCBs and VLSI micro/nano-photonics for applications in computers, telecommunication systems, transportation systems, and bio-sensing microsystems.

  13. Laser prototyping of printed circuit boards

    NASA Astrophysics Data System (ADS)

    Nowak, M. R.; Antończak, A. J.; Kozioł, P. E.; Abramski, K. M.

    2013-09-01

    This paper describes the application of laser micromachining to rapid prototyping of printed circuit boards (PCB) using nano-second lasers: the solid-state Nd:YAG (532/1064 nm) laser and the Yb:glass fiber laser (1060 nm). Our investigations included tests for various mask types (synthetic lacquer, light-sensitive emulsion and tin). The purpose of these tests was to determine some of the basic parameters such as the resolution of PCB prototyping, speed of processing and quality of PCB mapping with commonly available laser systems. Optimization of process parameters and the proposed conversion algorithm have allowed us to produce circuit boards with a resolution similar to that of the Laser Direct Imaging (LDI) technology.

  14. Integration of polymer-based optical waveguide arrays and micro/nano-photonic devices for optical printed circuit board (O-PCB) application

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, Seung Gol; O, Beom Hoan; Park, Se-Geun; Kim, Kyong Heon; Kang, Jin Ku; Choi, Young Wan

    2005-03-01

    We report, in the form of review, on the results of our study on the fabrication and assembly of polymer-based optical waveguide arrays and micro/nano-photonic devices for optical printed circuit boards (O-PCBs) application. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards, substrates or chips. We have assembled and constructed O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined their information handling performances. We also designed power beam splitters and waveguide filters using nano-scale photonic band-gap crystals. We discuss scientific and technological issues concerning the processes of miniaturization, interconnection and integration of polymer optical waveguide devices and arrays for the O-PCBs as applicable to board-to-board, chip-to-chip, and intra-chip integration for computers, telecommunications, and transportation systems.

  15. DASLL. Printed Circuit Board Design Automation

    SciTech Connect

    Magnuson, W.G.Jr.; Willett, G.W.

    1983-06-03

    DASLL (Design Automation System at Lawrence Livermore) is a set of computer programs for printed circuit board (PCB) layout. The DASLL system can process a number of PCB trimlines, including: DEC 1, 2, 4, and 6 high configurations, CLI, Augat, Varian, and several rectangular geometries; others can be added. Over 800 components and generic package types are available in DASLLDB, the system reference library. Two-layer boards with non-gridded (structured) power and ground busses are supported, and PCB densities of approximately 1.2 square inches per equivalent IC (or less dense) are best accommodated by DASLL. The system has been used to make etch artwork and drill tapes (starting with a schematic drawing) for a six IC CLI board in less than two working days. Initial processing will produce reports and computer printer-plots which can be used to verify the input. Final output can include silkscreen photo-artwork, PCB etch photo-artwork, punched paper tapes for the SLO-SYN and Pratt-Whitney N/C drill machines, and computer listings of signal strings, parts lists, etc.

  16. Coating Circuit Boards With Silicone

    NASA Technical Reports Server (NTRS)

    Gaudiano, S.

    1986-01-01

    Techniques appropriate to boards containing CMOS circuits detailed. Document presents procedure for applying thin conformal coating to such electronic assemblies as printed-circuit boards and wire-wrapped boards. Coating is from 1 to 7 mils (25 to 178 micrometers) thick and composed of room-temperature-vulcanizing (RTV) silicone. Specifies materials, equipment, spraying method, and quality requirements. Takes into account special needs of circuits made with complementary metal-oxide/semiconductor (CMOS) devices on circuit boards. Special attention given to preventing damage by electrostatic discharge, to which CMOS circuits especially sensitive.

  17. Training Circuit Boards

    NASA Technical Reports Server (NTRS)

    1986-01-01

    Young Electronics Company's new product is a testboard developed by the Jet Propulsion Laboratory as a tool for training and qualifying personnel in board assembly and in the art of soldering components without damaging boards or components. The boards are used for pre- employment testing and employee requalification.

  18. FTIR analysis of printed-circuit board residue

    SciTech Connect

    Myers, S.A.; Cognata, T.D.; Gotts, H.

    1996-12-31

    Logic boards were failing at Enhanced Mac Minus One (EMMO) test or Integrated Circuit Test (ICT) after printed circuit board (PCB) rework. A resistor in the microcontroller circuit was identified on the flip side of the PCB. Several areas on the board, including the resistor R161, were seen to have a slight white haze/low gloss appearance on the surface of the PCB. To test if the residue was electrically conductive, five boards were selected whose sole failure was R161. The resistance of the individual resistors was measured with a digital multimeter (DMM). The resistor was then cleaned with isopropyl alcohol and a cotton swab. Each board was retested at ICT and the individual resistors measured again with a DMM. Cleaning the area surrounding the resistor with isopropyl alcohol, corrected the failure four of the times. Material was removed from the resistor and board surfaces by physically abrading the organic coating and transferring the abraded material to an infrared transparent substrate (single crystal silicon). FTIR spectra were collected in the transmittance mode using a Bio-Rad UMA 500 FTIR microscope using a circular aperture (40 micron diameter).

  19. Sliding contacts on printed circuit boards and wear behavior

    NASA Astrophysics Data System (ADS)

    Le Solleu, J.-P.

    2010-04-01

    Automotive suppliers use since decades printed circuit boards (PCB) gold plating pads, as direct contact interface for low current sliding contacts. Several gold plating processes are available on the market, providing various wear behaviour. Some specific galvanic hard gold (AuCo or AuNi). plating was developed on PCB's. This specific plating generates extra costs due to the material quantity and also the process complexity. In a cost driven industry, the challenge is to use a standard low cost PCB for systems requesting high reliability performances. After a brief overview of standard PCB manufacturing processes and especially gold plating processes, the global experimental results of wear behaviour of three different gold plating technologies will be exposed and an explanation of the correlation between surface key parameters and wear out will be provided.

  20. Materials for printed circuit boards: Past usage and future prospects

    SciTech Connect

    Lee Hong Ng; Field, F.R. III )

    1989-01-01

    This paper examines current materials utilization patterns in a major electronic materials market, printed circuit board (PCB) materials. As demands on PCB materials become more stringent, the use of high performance materials will increase. However, development of better materials is no guarantee of market success. New materials must offer an attractive price/performance combination to PCB users. A methodology to assess the competitive position of new PCB materials by combining manufacturing cost models with operations research techniques has been developed and applied to the PCB materials market. The methodology is illustrated using case studies drawn from the computers and communication industries. Results indicate that the computer industry favors high glass transition temperature materials, such as polymide and bismaleimide triazine, while the telecommunications market prefers epoxy glass for its low cost. Among the new materials targeted at high performance applications in the PCB market, cyanate ester (CE) and polytetrafluoroethylene (PTFE) have the greatest potential. PTFE is expected to fill a niche in the extremely high performance market due to its high cost and incompatibility with standard manufacturing requirements. The potential of cyanate ester, however, depends on its pricing policy and manufacturing requirements. Through the use of the PCB cost model and making some assumptions on the processing requirements of CE, it was found that almost all the price-yield combinations would make cyanate ester a viable competitor, especially in the high performance end of the market place.

  1. Laser drilling for improving circuit board manufacturing

    NASA Astrophysics Data System (ADS)

    Yu, Gang; Zhang, Jincheng; Gao, Chunlin; Wang, Honcai; Li, Ping; An, Yongqiang; Zhang, Guiqiu

    1998-08-01

    We reported here a novel technique for laser high speed drillings on Printed Circuit Boards (PCBs). A CNC solid laser based system is developed to drill through and blind vias as an alternative to mechanical drilling. The system employs an Acousto-Optic Q-switched Nd:YAG laser, a computer control system and an X-Y moving table which can handle up to 400 X 400 mm PCB. With a special designed cavity the laser system works in a pulsed operation in order to generate pulses with width down to 0.5 microseconds and maximum peak power over 10 kW at 10 k repetition rate. Delivered by an improved optical beam transforming system, the focused laser beam can drill holes including blind vias on PCBs with diameter in the range of 0.1 - 0.4 mm and at up to 300 - 500 vias per second (depending on the construction of PCBs). By means of a CNC X-Y moving system, laser pulses with pulse-to-pulse superior repeatability can be fired at desired location on a PCBs with high accuracy. This alternative technology for drilling through or blind vias on PCBs or PWBs (printed wiring boards) will obviously enhance the capability to printed boards manufacturing.

  2. Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

    SciTech Connect

    Yamane, Luciana Harue; Tavares de Moraes, Viviane; Crocce Romano Espinosa, Denise; Soares Tenorio, Jorge Alberto

    2011-12-15

    Highlights: > This paper presents new and important data on characterization of wastes of electric and electronic equipments. > Copper concentration is increasing in mobile phones and remaining constant in personal computers. > Printed circuit boards from mobile phones and computers would not be mixed prior treatment. - Abstract: This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of

  3. Packaging printed circuit boards: A production application of interactive graphics

    NASA Technical Reports Server (NTRS)

    Perrill, W. A.

    1975-01-01

    The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

  4. Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers.

    PubMed

    Yamane, Luciana Harue; de Moraes, Viviane Tavares; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

    2011-12-01

    This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers. PMID:21820883

  5. Design principles and realization of electro-optical circuit boards

    NASA Astrophysics Data System (ADS)

    Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry

    2013-02-01

    The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.

  6. Computer-aided interactive structural optimization of printed-circuit-board design

    NASA Astrophysics Data System (ADS)

    Duncan, L. B.; Holman, R. E.; Lagasse, B. K.; Sakamoto, L. W.; Sunada, W. H.

    Electronic equipment operating in severe vibration environments plays a critical role in military and aerospace hardware. A crucial element of most modularized electronic equipment is the printed circuit board (PCB). Structural failures of such boards are almost entirely the result of imposed mechanical vibration. It is desirable to incorporate structural guidelines and analysis techniques at an early stage in board development when deficiencies may easily be corrected. However, there are a number of problems connected with such an approach. A computer program has been developed to address the considered situation. The program is to reduce PCB structural analysis to a level readily understood by the average designer. Another objective of the program is to encourage use of structural analysis at an early stage of PCB design and development. Attention is given to board geometry, program organization, board response computation, and a sample problem.

  7. DASLL: An automatic printed circuit board layout system

    NASA Astrophysics Data System (ADS)

    Magnuson, W. G., Jr.

    1980-07-01

    The design automation system at Lawrence Livermore (DASLL) is a system of computer programs to automatically lay out printed circuit boards. The focus was on two sided PCB fabrication aids; primarily drill tape, documentation, and artwork generation (including etch, silkscreen, and drill schedule artwork). Limited four layer PCBs are also possible with the program. The DASLL can be used in either batch interactive or batch made of operation by technicians, draftsmen, designers, or engineers. Flexibility in being able to accommodate a diversity of trimline geometries and component shapes and placements was a goal in the design of the software. The system is also very flexible in its capability to deal with physical design rules. A principal objective for the system was low volume, quick turnaround response for low and medium density custom printed circuit boards.

  8. Printed circuit board metal powder filters for low electron temperatures

    NASA Astrophysics Data System (ADS)

    Mueller, Filipp; Schouten, Raymond N.; Brauns, Matthias; Gang, Tian; Lim, Wee Han; Lai, Nai Shyan; Dzurak, Andrew S.; van der Wiel, Wilfred G.; Zwanenburg, Floris A.

    2013-04-01

    We report the characterisation of printed circuit boards (PCB) metal powder filters and their influence on the effective electron temperature which is as low as 22 mK for a quantum dot in a silicon MOSFET structure in a dilution refrigerator. We investigate the attenuation behaviour (10 MHz-20 GHz) of filter made of four metal powders with a grain size below 50 μm. The room-temperature attenuation of a stainless steel powder filter is more than 80 dB at frequencies above 1.5 GHz. In all metal powder filters, the attenuation increases with temperature. Compared to classical powder filters, the design presented here is much less laborious to fabricate and specifically the copper powder PCB-filters deliver an equal or even better performance than their classical counterparts.

  9. Removing Bonded Integrated Circuits From Boards

    NASA Technical Reports Server (NTRS)

    Rice, John T.

    1989-01-01

    Small resistance heater makes it easier, faster, and cheaper to remove integrated circuit from hybrid-circuit board, package, or other substrate for rework. Heater, located directly in polymeric bond interface or on substrate under integrated-circuit chip, energized when necessary to remove chip. Heat generated softens adhesive or solder that bonds chip to substrate. Chip then lifted easily from substrate.

  10. High-reliability flexible optical printed circuit board for opto-electric interconnections

    NASA Astrophysics Data System (ADS)

    Rho, Byung Sup; Lee, Woo-Jin; Lim, Jung Woon; Kim, Gye Won; Cho, Che Hyun; Hwang, Sung Hwan

    2009-01-01

    A rigid flexible optical electrical printed circuit board (RFOE-PCB) with both electrical layers and an optical layer was fabricated using a conventional PCB manufacture process. The RFOE-PCB is applicable to fold-type mobile devices such as mobile phones and laptop computers. The RFOE-PCB was designed to be embedded with a flexible 45-deg-ended optical waveguide, which was made using a polymeric material. The precise lamination between an electrical layer and an optical layer was achieved by a passive alignment method. We carried out the repetitive folding test and an environment test for physical and optical reliability suitable for mobile devices. Data transmission of 2.5 Gb/s was demonstrated with a clear eye diagram using the fabricated RFOE-PCB.

  11. Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

    NASA Technical Reports Server (NTRS)

    Bradley, Arthur T.; Fowler, Jennifer; Yavoich, Brian J.; Jennings, Stephen A.

    2012-01-01

    This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

  12. Ultrasonic evaluation of high voltage circuit boards

    NASA Technical Reports Server (NTRS)

    Klima, S. J.; Riley, T. J.

    1976-01-01

    Preliminary observations indicate that an ultrasonic scanning technique may be useful as a quick, low cost, nondestructive method for judging the quality of circuit board materials for high voltage applications. Corona inception voltage tests were conducted on fiberglass-epoxy and fiberglass-polyimide high pressure laminates from 20 to 140 C. The same materials were scanned ultrasonically by utilizing the single transducer, through-transmission technique with reflector plate, and recording variations in ultrasonic energy transmitted through the board thickness. A direct relationship was observed between ultrasonic transmission level and corona inception voltage. The ultrasonic technique was subsequently used to aid selection of high quality circuit boards for the Communications Technology Satellite.

  13. Printed circuit board layout by microcomputer

    NASA Astrophysics Data System (ADS)

    Krausman, E. W.

    1983-12-01

    Printed circuit board artwork is usually prepared manually because of the unavailability of computer-aided-design tools. This thesis presents the design of a microcomputer based printed circuit board layout system that is easy to use and cheap. Automatic routing and component placement routines will significantly speed up the process. The design satisfies the following requirements: Microcomputer implementation, portable, algorithm independent, interactive, and user friendly. When it is fully implemented a user will be able to select components and a board outline from an automated catalog, enter a schematic diagram, position the components on the board, and completely route the board from a single graphics terminal. Currently, the user interface and the outer level command processor have been implemented in Pascal. Future versions will be written in C for better portability.

  14. Vibration suppression of printed circuit boards using an external particle damper

    NASA Astrophysics Data System (ADS)

    Veeramuthuvel, P.; Sairajan, K. K.; Shankar, K.

    2016-03-01

    Particle damping is an effective method of passive vibration control, of recent research interest. The novel use of particle damper capsule on a Printed Circuit Board (PCB) and the development of Radial Basis Function neural network to accurately predict the acceleration response is presented here. The prediction of particle damping using this neural network is studied in comparison with the Back Propagation Neural network. Extensive experiments are carried out on a PCB for different combinations of particle damper parameters such as particle size, particle density, packing ratio, and the input force during the primary modes of vibration and the obtained results are used for training and testing of neural networks. Based on the prediction from the better trained network, useful design guidelines for the particle damper suitable for PCB are arrived at. The effectiveness of particle dampers for vibration suppression of PCB under random vibration environment is demonstrated based on these design guidelines.

  15. An automatic placement tool for rapid prototyping of printed circuit boards

    NASA Astrophysics Data System (ADS)

    Granacki, John; Kazi, Tauseef

    1993-11-01

    This report describes a fully automatic placement tool for PCB's (printed circuit boards), nap (nonhierarchical automatic placement) that combines approaches from different placement heuristics developed both for PCB and VLSI chip placement. Although the problem of placement for a PCB can be abstractly cast into the same formalism as the problem of VLSI cell placement, a practical tool must incorporate many additional features. In this report we describe the impact of incorporating these PCB-specific features as well as other constraints imposed by the CAD environment (that is, the schematic capture system and the automatic routing tools) into an automatic placement tool. Next we discuss the selected heuristics and their associated data structures in detail. Following this discussion, we present the results of using the placement tool on two test cases along with an analysis of the tools performance. Finally, we identify the limitations of the current implementation and we propose some possible solutions and future work.

  16. Optical interconnections on printed circuit boards

    NASA Astrophysics Data System (ADS)

    Griese, Elmar

    2000-05-01

    In this paper an optical interconnection technology for high-speed printed circuit board application is presented. This technology is widely compatible with the existing design and manufacturing technologies of conventional multi- layer pc boards and it combines electrical and optical interconnects on pc board level. Using this interconnection technology on-board bandwidth of several Gbps can be realized. As conventional pc board technology provides sufficient performance characteristics for the majority of all on-board signals only a hybrid technology which is compatible to the existing printed circuit board design and manufacturing processes is able to lead to a practical solution at reasonable cost. This compatibility demand results in different technological, functional, and economic requirements which also consider potential application for high performance computing and telecommunication hardware. In this paper an overview is given on the requirements, on the basic technologies for manufacturing electrical-optical pc boards as well as on the extended design process with its modeling and simulation methodologies and strategies.

  17. Flexible composite film for printed circuit board

    NASA Technical Reports Server (NTRS)

    Yabe, K.; Asakura, M.; Tanaka, H.; Soda, A.

    1982-01-01

    A flexible printed circuit for a printed circuit board in which layers of reaction product composed of a combination of phenoxy resin - polyisocyanate - brominated epoxy resin, and in which the equivalent ratio of those functional groups is hydroxyl group: isocyanate group: epoxy group - 1 : 0.2 to 2 : 0.5 to 3 are laminated on at least one side of saturated polyester film is discussed.

  18. Converting non-metallic printed circuit boards waste into a value added product

    PubMed Central

    2013-01-01

    The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB) waste as filler in recycled HDPE (rHDPE) in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE) was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM) was used to study the dispersion of nonmetallic PCB and MAPE in the matrix. Nonmetallic PCB was blended with rHDPE from 0–30 wt% and prepared by counter-rotating twin screw extruder followed by molding into test samples via hot press for analysis. A good balance between stiffness, strength and toughness was achieved for the system containing 30 wt% PCB. Thus, this system was chosen in order to investigate the effect of the compatibilizer on the mechanical properties of the composites. The results indicate that MAPE as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic PCB and rHDPE. The addition of 6 phr MAPE increased the flexural strength, tensile strength and impact strength by 71%, 98% and 44% respectively compared to the uncompatibilized composites. PMID:24764542

  19. Converting non-metallic printed circuit boards waste into a value added product.

    PubMed

    Muniyandi, Shantha Kumari; Sohaili, Johan; Hassan, Azman; Mohamad, Siti Suhaila

    2013-01-01

    The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB) waste as filler in recycled HDPE (rHDPE) in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE) was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM) was used to study the dispersion of nonmetallic PCB and MAPE in the matrix. Nonmetallic PCB was blended with rHDPE from 0-30 wt% and prepared by counter-rotating twin screw extruder followed by molding into test samples via hot press for analysis. A good balance between stiffness, strength and toughness was achieved for the system containing 30 wt% PCB. Thus, this system was chosen in order to investigate the effect of the compatibilizer on the mechanical properties of the composites. The results indicate that MAPE as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic PCB and rHDPE. The addition of 6 phr MAPE increased the flexural strength, tensile strength and impact strength by 71%, 98% and 44% respectively compared to the uncompatibilized composites. PMID:24764542

  20. Detection of Banned and Restricted Ozone-Depleting Chemicals in Printed Circuit Boards

    SciTech Connect

    Lee, Richard N.; Wright, Bob W.

    2008-12-01

    A study directed toward the detection of halogenated solvents in the matrix of circuit boards has recently been completed. This work was undertaken to demonstrate the potential for reliable detection of solvents used during the fabrication of printed circuit boards (PCB). Since many of these solvents are now, or soon will be, restricted under the terms of legislation enacted in response to the Montreal Protocol and other international agreements, the work described here, conducted over a period of more that 4 years, has provided guidance for the development of chromatographic system and analytical protocol to assure compliance with regulations introduced to control, or ban, industrial solvents associated with adverse environmental impact.

  1. The p53 circuit board

    PubMed Central

    Sullivan, Kelly D.; Gallant-Behm, Corrie L.; Henry, Ryan E.; Fraikin, Jean-Luc; Espinosa, Joaquín M.

    2012-01-01

    The p53 tumor suppressor is embedded in a large gene network controlling diverse cellular and organismal phenotypes. Multiple signaling pathways converge onto p53 activation, mostly by relieving the inhibitory effects of its repressors, MDM2 and MDM4. In turn, signals originating from increased p53 activity diverge into distinct effector pathways to deliver a specific cellular response to the activating stimuli. Much attention has been devoted to dissecting how the various input pathways trigger p53 activation and how the activity of the p53 protein itself can be modulated by a plethora of co-factors and post-translational modifications. In this review we will focus instead on the multiple configurations of the effector pathways. We will discuss how p53-generated signals are transmitted, amplified, resisted and eventually integrated by downstream gene circuits operating at the transcriptional, post-transcriptional and post-translational level. We will also discuss how context-dependent variations in these gene circuits define the cellular response to p53 activation and how they may impact the clinical efficacy of p53-based targeted therapies. PMID:22333261

  2. Sensing requirements for modern circuit board inspection

    NASA Astrophysics Data System (ADS)

    Harvey, D. M.; Zhang, G.-Ming; Braden, D. R.

    2007-07-01

    The rapid shrinking of feature size, complex 3D structures, and introduction of new materials challenges inspection, measurement and test platform technology for future packages. This paper outlines the sensing requirements for modern circuit board inspection. The limitations of current imaging techniques have been demonstrated. Solutions based on X-ray and acoustic imaging have been proposed to meet the challenges of future diagnostics.

  3. Chemical inertness of UV-cured optical elastomers within the printed circuit board manufacturing process for embedded waveguide applications

    NASA Astrophysics Data System (ADS)

    Kruse, Kevin; Walczak, Karl; Thomas, Nicholas; Swatowski, Brandon; Demars, Casey; Middlebrook, Christopher

    2014-03-01

    Embedding polymer optical waveguides (WGs) into printed circuit boards (PCBs) for intra-board or board-to-board high speed data communications requires polymer materials that are compatible and inert when exposed to common PCB manufacturing processes. Ensuring both WG functionality after chemical exposure and maintaining PCB manufacturing integrities within the production process is crucial for successful implementation. The PCB manufacturing flow is analyzed to expose major requirements that would be required for the successful implementation of polymer materials for embedded WG development. Chemical testing and analysis were performed on Dow Corning ® OE-4140 UV-Cured Optical Elastomer Core and Dow Corning® OE-4141 UV-Cured Optical Elastomer Cladding which are designed for low loss embedded optical WGs. Contamination testing was conducted to demonstrate polymer compatibility in both cured and uncured form. Various PCB chemicals were treated with uncured polymer material and tested for effective contamination. Fully polymerized multimode WGs were fabricated and exposed to PCB chemicals at temperatures and durations comparable to PCB manufacturing conditions. Chemical analysis shows that the chosen polymer is compatible and inert with most common PCB manufacturing processes.

  4. Stability of planar PEMFC in Printed Circuit Board technology

    NASA Astrophysics Data System (ADS)

    Schmitz, A.; Wagner, S.; Hahn, R.; Uzun, H.; Hebling, C.

    The use of planar PEMFCs in printed circuit board (PCB) technology with a thickness of less than 3.5 mm are presented. This planar design consists of an open cathode side which allows a completely passive, self-breathing operation of the fuel cell. Power densities of 100 mW/cm 2 at 500 mV with hydrogen as a fuel were achieved. A steady operation with this type of fuel cell was demonstrated over a week without any cell flooding. Since the electrical conducting elements of PCBs usually are made of copper, corrosion in the wet environment of a PEMFC is expected. Thus, a significant degradation in performance of fuel cells made of plain copper PCBs was seen in long-term operation. In order to avoid corrosion, the copper layer has to be coated. Fuel cells in PCB design with diverse coatings were tested in long-term operations up to 1000 h under load. Moreover, corrosion currents have been determined by the use of potentiodynamic scans. Promising coatings are electroplated Cr and Ni and a combination of Ni/Au.

  5. Highly reliable optical interconnection network on printed circuit board for distributed computer systems

    NASA Astrophysics Data System (ADS)

    Yu, Zhihua; Luo, Fengguang; Di, Xu; Zhou, Weilin; Li, Bin; Wang, Guangjun; Chen, Jun

    2010-11-01

    A highly reliable interchip optical interconnection network on a printed circuit board (PCB) was designed and realized, and experiments confirmed that the data rate in each channel could reach above 3.125 Gbps and the bit error rate (BER) could be up to 1.27×10 -18, which would be a good solution to the problem of communication bottlenecks between high-speed VLSI chips.

  6. Dimensional stability of multilayer circuit boards

    NASA Astrophysics Data System (ADS)

    Shrotriya, Pranav

    The present work investigates the time and temperature dependent response of the woven composite substrate used in multilayer circuit board applications and its influence on the residual stress development during processing and post-processing of the circuit boards. The fabric architecture of one commonly used substrate (7628 fabric style) is characterized using optical microscopy. The creep compliance and stress relaxation of the composite substrate and the FR-4 matrix are determined through accelerated viscoelastic characterization. Both finite element analysis (FEA) and theoretical analysis models are developed for prediction of the substrate response from the measured matrix and fabric properties. Comparison of the micromechanical model predictions with the measured response reveals the influence of fabric architecture and boundary conditions on the composite viscoelastic properties. Moire interferometry is utilized to investigate deformation of the composite unit cell and verify the physical basis for kinematic assumptions of the micromechanical models. Numerical and experimental studies are performed to study residual deformation and warpage in a model multilayer circuit board construction of a common composite substrate (7628 fabric style). A numerical procedure based on classical lamination theory with non-isothermal viscoelastic constitutive relations is developed to predict the deformation and residual stress state due to relamination. Experimental values of the substrate stress relaxation modulus and coefficients of thermal expansion (CTE) are used as inputs in the numerical procedure to predict warpage of model circuit boards with a non-symmetric lay-up of 7628 style composite substrate. Boards with the exact same construction as used in the numerical analysis were fabricated according to the prescribed pressing cycle and the time dependent warpage measured using an ultrasonic contour scan technique. Comparison of the experimental warpage data with

  7. Physically separating printed circuit boards with a resilient, conductive contact

    NASA Technical Reports Server (NTRS)

    Baker, John D. (Inventor); Montalvo, Alberto (Inventor)

    1999-01-01

    A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

  8. Improving Heat Transfer Performance of Printed Circuit Boards

    NASA Technical Reports Server (NTRS)

    Schatzel, Donald V.

    2009-01-01

    This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

  9. A Docking Casette For Printed Circuit Boards

    DOEpatents

    Barringer, Dennis R.; Seminaro, Edward J.; Toffler, Harold M.

    2003-08-19

    A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit board and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a linkage mechanism, wherein the linkage mechanism includes an engagement configuration and a disengagement configuration and wherein the linkage mechanism is disposed so as to be associated with the cassette housing and a housing bezel, wherein the housing bezel is disposed relative to the cassette housing so as to be associated with the cable opening.

  10. Printed Circuit Board Design with HDL Designer

    NASA Technical Reports Server (NTRS)

    Winkert, Thomas K.; LaFourcade, Teresa

    2004-01-01

    Staying up to date with the latest CAD tools both from a cost and time perspective is difficult. Within a given organization there may be experts in Printed Circuit Board Design tools and experts in FPGA/VHDL tools. Wouldn't it be great to have someone familiar with HDL Designer be able to design PCBs without having to learn another tool? This paper describes a limited experiment to do this.

  11. CAD-CAM printed circuit board design

    NASA Astrophysics Data System (ADS)

    Agy, W. E.

    A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.

  12. Hard and flexible optical printed circuit board

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, Hyun Sik; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.

    2007-02-01

    We report on the design and fabrication of hard and flexible optical printed circuit boards (O-PCBs). The objective is to realize generic and application-specific O-PCBs, either in hard form or flexible form, that are compact, light-weight, low-energy, high-speed, intelligent, and environmentally friendly, for low-cost and high-volume universal applications. The O-PCBs consist of 2-dimensional planar arrays of micro/nano-scale optical wires, circuits and devices that are interconnected and integrated to perform the functions of sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards. For fabrication, the polymer and organic optical wires and waveguides are first fabricated on a board and are used to interconnect and integrate micro/nano-scale photonic devices. The micro/nano-optical functional devices include lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices. For flexible boards, the optical waveguide arrays are fabricated on flexible poly-ethylen terephthalate (PET) substrates by UV embossing. Electrical layer carrying VCSEL and PD array is laminated with the optical layer carrying waveguide arrays. Both hard and flexible electrical lines are replaced with high speed optical interconnection between chips over four waveguide channels up to 10Gbps on each. We discuss uses of hard or flexible O-PCBs for telecommunication systems, computer systems, transportation systems, space/avionic systems, and bio-sensor systems.

  13. High density printed electrical circuit board card connection system

    DOEpatents

    Baumbaugh, Alan E.

    1997-01-01

    A zero insertion/extraction force printed circuit board card connection system comprises a cam-operated locking mechanism disposed along an edge portion of the printed circuit board. The extrusions along the circuit board mate with an extrusion fixed to the card cage having a plurality of electrical connectors. The card connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned. The card connection system provides a simple solution to the need for a greater number of electrical signal connections.

  14. High density printed electrical circuit board card connection system

    DOEpatents

    Baumbaugh, A.E.

    1997-05-06

    A zero insertion/extraction force printed circuit board card connection system comprises a cam-operated locking mechanism disposed along an edge portion of the printed circuit board. The extrusions along the circuit board mate with an extrusion fixed to the card cage having a plurality of electrical connectors. The card connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned. The card connection system provides a simple solution to the need for a greater number of electrical signal connections. 12 figs.

  15. Sequential computer algorithms for printed circuit board inspection

    NASA Astrophysics Data System (ADS)

    Hernandez, Moises E.; Villalobos, Jesus R.; Johnson, W. Carrol

    1993-08-01

    Surface mounted technology (SMT) in automated assembly facilities requires the use of automatic surface-mount-device (SMD) placement machines. One of the problems involved in the electronic printed circuit board (PCB) assembly process is the verification of the SMD placement operation within tight tolerances. The high throughput of modern manufacturing lines along with the required accuracy demand the use of automatic inspection systems to verify SMD placement. Image complexity of the board makes the use of machine vision for the inspection process a difficult task. This is complicated by the fact that misclassification errors should be kept to a minimum. Additionally, it is desirable that the inspection results provide enough information to be used for statistical process control (SPC). The strategy adopted to solve this problem was to simplify the complexity of the image by means of special illumination devices. The simplified image was then suitable for analysis by simple processing, segmentation, and detection algorithms that, sequentially applied to the image, met the required repeatability and accuracy specifications for the inspection system. The scope of this paper is to describe the techniques explored by the authors to solve the SMD inspection problem in order to develop a working industrial SMD inspection system.

  16. Chemical and biological processes for multi-metal extraction from waste printed circuit boards of computers and mobile phones.

    PubMed

    Shah, Monal B; Tipre, Devayani R; Dave, Shailesh R

    2014-11-01

    E-waste printed circuit boards (PCB) of computers, mobile-phones, televisions, LX (LongXiang) PCB in LED lights and bulbs, and tube-lights were crushed to ≥250 µm particle size and 16 different metals were analysed. A comparative study has been carried out to evaluate the extraction of Cu-Zn-Ni from computer printed circuit boards (c-PCB) and mobile-phone printed circuit boards (m-PCB) by chemical and biological methods. Chemical process showed the extraction of Cu-Zn-Ni by ferric sulphate was best among the studied chemical lixiviants. Bioleaching experiments were carried out with the iron oxidising consortium, which showed that when E-waste and inoculum were added simultaneously in the medium (one-step process); 60.33% and 87.50% Cu, 75.67% and 85.67% Zn and 71.09% and 81.87% Ni were extracted from 10 g L(-1) of c-PCB and m-PCB, respectively, within 10-15 days of reaction time. Whereas, E-waste added after the complete oxidation of Fe(2+) to Fe(3+) iron containing medium (two-step process) showed 85.26% and 99.99% Cu, 96.75% and 99.49% Zn and 93.23% and 84.21% Ni extraction from c-PCB and m-PCB, respectively, only in 6-8 days. Influence of varying biogenerated Fe(3+) and c-PCB concentrations showed that 16.5 g L(-1) of Fe(3+) iron was optimum up to 100 g L(-1) of c-PCB. Changes in pH, acid consumed and redox potential during the process were also studied. The present study shows the ability of an eco-friendly process for the recovery of multi-metals from E-waste even at 100 g L(-1) printed circuit boards concentration. PMID:25278513

  17. Developing 300°C Ceramic Circuit Boards

    SciTech Connect

    Normann, Randy A

    2015-02-15

    This paper covers the development of a geothermal ceramic circuit board technology using 3D traces in a machinable ceramic. Test results showing the circuit board to be operational to at least 550°C. Discussion on producing this type of board is outlined along with areas needing improvement.

  18. Wideband characterization of printed circuit board materials up to 50 ghz

    NASA Astrophysics Data System (ADS)

    Rakov, Aleksei

    A traveling-wave technique developed a few years ago in the Missouri S&T EMC Laboratory has been employed until now for characterization of PCB materials over a broad frequency range up to 30 GHz. This technique includes measuring S-parameters of the specially designed PCB test vehicles. An extension of the frequency range of printed circuit board laminate dielectric and copper foil characterization is an important problem. In this work, a new PCB test vehicle design for operating up to 50 GHz has been proposed. As the frequency range of measurements increases, the analysis of errors and uncertainties in measuring dielectric properties becomes increasingly important. Formulas for quantification of two major groups of errors, repeatability (manufacturing variability) and reproducibility (systematic) errors, in extracting dielectric constant (DK) and dissipation factor (DK) have been derived, and computations for a number of cases are presented. Conductor (copper foil) surface roughness of PCB interconnects is an important factor, which affects accuracy of DK and DF measurements. This work describes a new algorithm for semi-automatic characterization of copper foil profiles on optical or scanning electron microscopy (SEM) pictures of signal traces. The collected statistics of numerous copper foil roughness profiles allows for introducing a new metric for roughness characterization of PCB interconnects. This is an important step to refining the measured DK and DF parameters from roughness contributions. The collected foil profile data and its analysis allow for developing "design curves", which could be used by SI engineers and electronics developers in their designs.

  19. Printed circuit boards as platform for disposable lab-on-a-chip applications

    NASA Astrophysics Data System (ADS)

    Leiterer, Christian; Urban, Matthias; Fritzsche, Wolfgang; Goldys, Ewa; Inglis, David

    2015-12-01

    An increasing demand in performance from electronic devices has resulted in continuous shrinking of electronic components. This shrinkage has demanded that the primary integration platform, the printed circuit board (PCB), follow this same trend. Today, PCB companies offer ~100 micron sized features (depth and width) which mean they are becoming suitable as physical platforms for Lab-on-a-Chip (LOC) and microfluidic applications. Compared to current lithographic based fluidic approaches; PCB technology offers several advantages that are useful for this technology. These include: Being easily designed and changed using free software, robust structures that can often be reused, chip layouts that can be ordered from commercial PCB suppliers at very low cost (1 AUD each in this work), and integration of electrodes at no additional cost. Here we present the application of PCB technology in connection with microfluidics for several biomedical applications. In case of commercialization the costs for each device can be even further decreased to approximately one tenth of its current cost.

  20. Sampling and Control Circuit Board for an Inertial Measurement Unit

    NASA Technical Reports Server (NTRS)

    Chelmins, David T (Inventor); Powis, Richard T., Jr. (Inventor); Sands, Obed (Inventor)

    2016-01-01

    A circuit board that serves as a control and sampling interface to an inertial measurement unit ("IMU") is provided. The circuit board is also configured to interface with a local oscillator and an external trigger pulse. The circuit board is further configured to receive the external trigger pulse from an external source that time aligns the local oscillator and initiates sampling of the inertial measurement device for data at precise time intervals based on pulses from the local oscillator. The sampled data may be synchronized by the circuit board with other sensors of a navigation system via the trigger pulse.

  1. Preparing printed circuit boards for rapid turn-around time on a plotter

    SciTech Connect

    Hawtree, J.

    1998-01-01

    This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab`s Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day`s time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter.

  2. Optical contacts to waveguides in printed circuit boards

    NASA Astrophysics Data System (ADS)

    Rupp, Torsten; Shkarban, Oleksandr; Menschig, Arnd

    2004-09-01

    The development of printed circuit boards (PCB) with integrated layers for optical data transfer was pushed during the last few years. Solutions with optical fibers or planar waveguides fabricated from plastics or glass will soon be available on the market. Nevertheless the low loss coupling of functional optical components as connectors, transmitters and receivers to these new generations of PCBs still is open. The packaging of otical transceivers or connectors actually is based mainly on single device solutions or active coupling concepts. On the other side the connectors of external optical data lines or of daughter cards to the main boards and the coupling of transmitter and receiver modules to optical PCBs do need linear array concepts. And the coupling efficiency should not decrease during reflow process. Actual concepts using mulit-mode connectors or a direct waveguide coupling of receivers suffer under high optical losses. However the use of micro-optical functional elements allows the realization of coupling concepts with teh lowest losses possible. The total losses for optical lines from the transmitter to the waveguide and back to the receiver can be reduced below 4 dB. For cost reduction even symmetric optical set-up can be used. The transmission rate can be as high as 40 Gb/s. With this concept error tolerant systems for the optical interconnection are possible. We report about the modeling, the design and the characterization of micro-optical interconnect modules for high efficient contacts to the optical layer in PCBs. For the assembly of the modules we use the new concept of a desk-top factory with miniaturized tools for handling, assembly, and inspection. This concept increases the flexibility and reduces the manufacturing costs.

  3. GUIDES TO POLLUTION PREVENTION: THE PRINTED CIRCUIT BOARD MANUFACTURING INDUSTRY

    EPA Science Inventory

    This document reviews the operations of printed circuit board manufacturers, identifies techniques that allow these companies to reduce wastes, and provides a set of self-audit checklists to assist printed circuit board manufacturers in setting up a waste reduction program. his r...

  4. Recovery of metals from waste printed circuit boards by a mechanical method using a water medium.

    PubMed

    Duan, Chenlong; Wen, Xuefeng; Shi, Changsheng; Zhao, Yuemin; Wen, Baofeng; He, Yaqun

    2009-07-15

    Research on the recycling of waste printed circuit boards (PCB) is at the forefront of environmental pollution prevention and resource recycling. To effectively crush waste PCB and to solve the problem of secondary pollution from fugitive odors and dust created during the crushing process, a wet impacting crusher was employed to achieve comminution liberation of the PCB in a water medium. The function of water in the crushing process was analyzed. When using slippery hammerheads, a rotation speed of 1470 rpm, a water flow of 6m(3)/h and a sieve plate aperture of 2.2mm, 95.87% of the crushed product was sized less than 1mm. 94.30% of the metal was in this grade of product. Using smashed material graded -1mm for further research, a Falcon concentrator was used to recover the metal from the waste PCB. Engineering considerations were the liberation degree, the distribution ratio of the metal and a way to simplify the technology. The separation mechanism for fine particles of different densities in a Falcon concentrator was analyzed in detail and the separation process in the segregation and separation zones was deduced. Also, the magnitude of centrifugal acceleration, the back flow water pressure and the feed slurry concentration, any of which might affect separation results, were studied. A recovery model was established using Design-Expert software. Separating waste PCB, crushed to -1mm, with the Falcon separator gave a concentrated product graded 92.36% metal with a recovery of 97.05%. To do this the reverse water pressure was 0.05 MPa, the speed transducer frequency was set at 30 Hz and the feed density was 20 g/l. A flow diagram illustrating the new technique of wet impact crushing followed by separation with a Falcon concentrator is provided. The technique will prevent environmental pollution from waste PCB and allow the effective recovery of resources. Water was used as the medium throughout the whole process. PMID:19121892

  5. Spectral imaging method for material classification and inspection of printed circuit boards

    NASA Astrophysics Data System (ADS)

    Ibrahim, Abdelhameed; Tominaga, Shoji; Horiuchi, Takahiko

    2010-05-01

    We propose a spectral imaging method for material classification and inspection of raw printed circuit boards (PCBs). The method is composed of two steps (1) estimation the PCB surface-spectral reflectances and (2) unsupervised classification of the reflectance data to make the inspection of PCB easy and efficient. First, we develop a spectral imaging system that captures high dynamic range images of a raw PCB with spatially and spectrally high resolutions in the region of visible wavelength. The surface-spectral reflectance is then estimated at every pixel point from multiple spectral images, based on the reflection characteristics of different materials. Second, the surface-spectral reflectance data are classified into several groups, according to the number of PCB materials. We develop an unsupervised classification algorithm incorporating both spectral information and spatial information, based on the Nyström approximation of the normalized cut method. The initial seeds for the Nyström procedure are effectively chosen using a guidance module based on the K-means algorithm. Low-dimensional spectral features are efficiently extracted from the original high-dimensional spectral reflectance data. The feasibility of the proposed method is examined in experiments using real PCBs in detail.

  6. Direct-referencing Two-dimensional-array Digital Microfluidics Using Multi-layer Printed Circuit Board

    PubMed Central

    Gong, Jian; Kim, Chang-Jin “CJ”

    2008-01-01

    Digital (i.e. droplet-based) microfluidics, by the electrowetting-on-dielectric (EWOD) mechanism, has shown great potential for a wide range of applications, such as lab-on-a-chip. While most reported EWOD chips use a series of electrode pads essentially in one-dimensional line pattern designed for specific tasks, the desired universal chips allowing user-reconfigurable paths would require the electrode pads in two-dimensional pattern. However, to electrically access the electrode pads independently, conductive lines need to be fabricated underneath the pads in multiple layers, raising a cost issue especially for disposable chip applications. In this article, we report the building of digital microfluidic plates based on a printed-circuit-board (PCB), in which multilayer electrical access lines were created inexpensively using mature PCB technology. However, due to its surface topography and roughness and resulting high resistance against droplet movement, as-fabricated PCB surfaces require unacceptably high (~500 V) voltages unless coated with or immersed in oil. Our goal is EWOD operations of aqueous droplets not only on oil-covered but also on dry surfaces. To meet varying levels of performances, three types of gradually complex post-PCB microfabrication processes are developed and evaluated. By introducing land-grid-array (LGA) sockets in the packaging, a scalable digital microfluidics system with reconfigurable and low-cost chip is also demonstrated. PMID:19234613

  7. New reconstruction method for x-ray testing of multilayer printed circuit board

    NASA Astrophysics Data System (ADS)

    Yang, Min; Wang, Gao; Liu, Yongzhan

    2010-05-01

    For multilayer printed circuit board (PCB) and large-scale integrated circuit (LIC) chips, nondestructive testing of the inner structure and welding defects is very important for circuit diagram reverse design and manufacturing quality control. The traditional nondestructive testing of this kind of plate-like object is digital radiography (DR), which can provide only images with overlapped information, so it is difficult to get a full and accurate circuit image of every layer and the position of the defects using the DR method. At the same time, traditional computed tomography scanning methods are also unable to resolve this problem. A new reconstruction method is proposed for the nondestructive testing of plate-like objects. With this method, x rays irradiate the surface of the reconstructed object at an oblique angle, and a series of projection images are obtained while the object is rotating. Then, through a relevant preprocessing method on the projections and a special reconstructing algorithm, cross sections of the scanning region are finally obtained slice by slice. The experimental results prove that this method satisfactorily addresses the challenges of nondestructive testing of plate-like objects such as PCB or LIC.

  8. Theoretic model and computer simulation of separating mixture metal particles from waste printed circuit board by electrostatic separator.

    PubMed

    Li, Jia; Xu, Zhenming; Zhou, Yaohe

    2008-05-30

    Traditionally, the mixture metals from waste printed circuit board (PCB) were sent to the smelt factory to refine pure copper. Some valuable metals (aluminum, zinc and tin) with low content in PCB were lost during smelt. A new method which used roll-type electrostatic separator (RES) to recovery low content metals in waste PCB was presented in this study. The theoretic model which was established from computing electric field and the analysis of forces on the particles was used to write a program by MATLAB language. The program was design to simulate the process of separating mixture metal particles. Electrical, material and mechanical factors were analyzed to optimize the operating parameters of separator. The experiment results of separating copper and aluminum particles by RES had a good agreement with computer simulation results. The model could be used to simulate separating other metal (tin, zinc, etc.) particles during the process of recycling waste PCBs by RES. PMID:17981393

  9. Modular chassis simplifies packaging and interconnecting of circuit boards

    NASA Technical Reports Server (NTRS)

    Arens, W. E.; Boline, K. G.

    1964-01-01

    A system of modular chassis structures has simplified the design for mounting a number of printed circuit boards. This design is structurally adaptable to computer and industrial control system applications.

  10. Field analysis and enhancement of multi-pole magnetic components fabricated on printed circuit board

    NASA Astrophysics Data System (ADS)

    Chiu, Kuo-Chi; Chen, Chin-Sen

    2007-09-01

    A multi-pole magnetic component magnetized with a fine magnetic pole pitch of less than 1 mm is very difficult to achieve by using traditional methods. Moreover, it requires a precise mechanical process and a complicated magnetization system. Different fine magnetic pole pitches of 300, 350 and 400 μm have been accomplished on 9-pole magnetic components through the printed circuit board (PCB) manufacturing technology. Additionally, another fine magnetic pole pitch of 500 μm was also fabricated on a dual-layered (DL) wire circuit structure to investigate the field enhancement. After measurements, a gain factor of 1.37 was obtained in the field strength. The field variations among different magnetic pole pitches were analyzed in this paper.

  11. Process produces accurate registry between circuit board prints

    NASA Technical Reports Server (NTRS)

    1966-01-01

    Tapes and quick-mount circles of contrasting colors aid in obtaining precise registry between the two circuits of two-sided printed circuit boards. The tapes and circles are mounted on opposite sides of transparent plastic film to define the conductive path and feed-through hole locations.

  12. Polymer fiber-image-guide-based embedded optical circuit board.

    PubMed

    Ai, J; Li, Y

    1999-01-10

    We propose a poly(methyl methacrylate) fiber-image-guide-based embedded optical circuit board for future optoelectronic array-interconnection applications. An experimental prototypical board that embeds perfect-shuffle and banyan interconnect patterns of 16 x 16 parallel links, each of which offers a fiber pixel density of >1000 pixels/mm(2), are demonstrated experimentally. PMID:18305618

  13. Manufacturing methods and technology for digital fault isolation of printed circuit boards

    NASA Astrophysics Data System (ADS)

    1980-11-01

    This report presents the final recommendations and conclusions, with supporting data, resulting from the contract option phase of contract DAAK40-78-C-0290. It describes the manufacturing technology and test system that will enable detection, identification, and location of digital faults in the advanced missile electronic systems that will be used in the 1980's. Emphasis is placed on the fault diagnosis of large printed circuit boards containing complex hybrid digital microelectronic circuits. The basic effort included an industry survey for digital printed circuit board test requirements and available test system capabilities, the D/PCB testability investigation and resulting design guide, the development of digital fault isolation methodology and the comprehensive selection of the optimum ATE that recommended the DTS-70 system. The contract option phase of this project involved the purchase and installation of the DTS-70 system, the selection of the PN-1635972 and the PN-1646178 D/PCBs for testing, the development of generalized test software and the development of the specific hardware and software needed to test these worst-case boards.

  14. Electrostatic separation for recovering metals and nonmetals from waste printed circuit board: problems and improvements.

    PubMed

    Wu, Jiang; Li, Jia; Xu, Zhenming

    2008-07-15

    Electrostatic separation is an effective and environmentally friendly method for recycling comminuted waste printed circuit boards (PCB). As a classical separator, the roll-type corona-electrostatic separator (RTS) has some advantages in this field. However, there are still some notable problems, such as the middling products and their further treatment, impurity of nonconductive products because of the aggregation of fine particles, and stability of the separation process and balance between the production capacity and the separation quality. To overcome these problems, a conception of two-step separation is presented, and a new two-roll type corona-electrostatic separator (T-RTS) was built As compared to RTS, the conductive products increase by 8.9%, the middling products decrease by 45%, and the production capacity increases by 50% in treating comminuted PCB wastes by T-RTS. In addition, the separation process in T-RTS is more stable. Therefore, T-RTS is a promising separator for recycling comminuted PCB. PMID:18754380

  15. New architecture of optical interconnection using 45-deg.-ended connection rods in waveguide-embedded printed circuit boards

    NASA Astrophysics Data System (ADS)

    Rho, Byung S.; Cho, Han S.; Eo, Ji-Young; Kang, Saekyoung; Park, Hyo-Hoon; Kim, Young W.; Joe, Young S.; Yang, Dok J.

    2003-06-01

    We demonstrated a new architecture of the optical interconnection system which can be applied in the waveguide-embedded optical printed circuit board (PCB). We used 45° ended optical connection rods as a medium to guide light paths perpendicularly between surface-emitting lasers (or photodiode) and waveguides. A polymer film of multimode waveguides with cores of 100μm x 65μm was sandwiched between conventional PCBs. We made through-holes with a diameter of ~140μm on the PCB, passing through the waveguide cores, using Ti-sapphire laser drill. The optical rods were made of the segment of multimode silica fiber ribbon. One end of the fiber segment was cut with 45° and the other end with 90° by using the high power laser cutting technique. These fiber rods were inserted into the through-holes formed in the PCB, adjusting the insertion depth to locate the 45°-end of rods near the waveguide core. From this interconnection system, we achieved 12channels optical transmission link through a waveguide with a channel pitch of 250μm in the optical PCB. This new interconnection structure using the optical connection rods is well compatible with the fabrication processes of conventional electronic PCB which is employing the through-hole formation by laser drill and the lamination of plastic films by compression.

  16. Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

    SciTech Connect

    Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

    2014-07-15

    Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins

  17. Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

    PubMed

    Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

    2010-02-21

    Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings. PMID:20126694

  18. International standardisation of optical circuit board measurement and fabrication procedures

    NASA Astrophysics Data System (ADS)

    Pitwon, Richard; Wang, Kai; Immonen, Marika; Wu, Jinhua; Zhu, Long Xiu; Yan, Hui Juan; Worrall, Alex

    2015-03-01

    Widespread adoption of optical circuit boards will herald substantial performance, environmental and cost benefits for the data communications industry. Though optical circuit board technology has advanced considerably over the past decade, commercial maturity will be gated by the availability of conformity standards to forge future quality assurance procedures. One important prerequisite to this is a reliable test and measurement definition system, which is agnostic to the type of waveguide system under test and therefore can be applied to different optical circuit board technologies as well as being adaptable to future variants. A serious and common problem with the measurement of optical waveguide systems has been lack of proper definition of the measurement conditions for a given test regime, and consequently strong inconsistencies ensue in the results of measurements by different parties on the same test sample. We report on the development of a new measurement identification standard to force testers to capture sufficient information about the measurement conditions for a given optical circuit board such as to ensure consistency of measurement results within an acceptable margin. Furthermore we demonstrate how the application of the measurement identification system can bring about a dramatic improvement in results consistency, by comparative evaluation of the results on multimode polymer waveguide based optical circuit test boards from a large selection of testing organisations.

  19. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

    SciTech Connect

    Rodrigues, Michael L.M.; Leão, Versiane A.; Gomes, Otavio; Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan

    2015-07-15

    Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets.

  20. Evaluation of a recycling process for printed circuit board by physical separation and heat treatment.

    PubMed

    Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

    2014-07-01

    Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873-1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1T and then at 0.8 T. In the +0.5mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins by heat treatment at 723-773 K in air atmosphere and screening of 0.5mm. Silica was removed and 70% of tantalum grade was obtained after more than 823K heating and separation. Next, the evaluation of Cu recycling in PCB is estimated. Energy consumption of new process increased and the treatment cost becomes 3 times higher comparing the conventional process, while the environmental burden of new process decreased comparing conventional process. The nickel recovery process in fine ground particles increased energy and energy cost comparing those of the conventional process. However, the environmental burden decreased than the conventional

  1. Effective electromagnetic shielding in multilayer printed circuit boards

    NASA Astrophysics Data System (ADS)

    Wiles, K. G.; Moe, J. L.

    Multilayer printed circuit boards have proven to be recurrent abettors of electromagnetic coupling problems created by the incessantly faster response times in integrated circuit technologies. Coupling within multilayer boards has not only inhibited meeting certain EMI requirements but has also precipitated 'self-inflicted' malfunctions commonly experienced during development of avionic systems. A recent avionic system, interfacing two asynchronous processors through a fourteen-layer motherboard, permitted coupling through ground plane connector apertures of sufficient amplitude and duration as to cause unintentional intercommunication and system malfunctions. The coupling mechanism and ground plane modifications which reduced this coupling by 40 dB and eliminated the incompatibility are discussed in this paper

  2. Printed circuit boards: a review on the perspective of sustainability.

    PubMed

    Canal Marques, André; Cabrera, José-María; Malfatti, Célia de Fraga

    2013-12-15

    Modern life increasingly requires newer equipments and more technology. In addition, the fact that society is highly consumerist makes the amount of discarded equipment as well as the amount of waste from the manufacture of new products increase at an alarming rate. Printed circuit boards, which form the basis of the electronics industry, are technological waste of difficult disposal whose recycling is complex and expensive due to the diversity of materials and components and their difficult separation. Currently, printed circuit boards have a fixing problem, which is migrating from traditional Pb-Sn alloys to lead-free alloys without definite choice. This replacement is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling and leads to other problems, such as temperature rise, delamination, flaws, risks of mechanical shocks and the formation of "whiskers". This article presents a literature review on printed circuit boards, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards. PMID:24189538

  3. Stripline/Microstrip Transition in Multilayer Circuit Board

    NASA Technical Reports Server (NTRS)

    Epp, Larry; Khan, Abdur

    2005-01-01

    A stripline-to-microstrip transition has been incorporated into a multilayer circuit board that supports a distributed solid-state microwave power amplifier, for the purpose of coupling the microwave signal from a buried-layer stripline to a top-layer microstrip. The design of the transition could be adapted to multilayer circuit boards in such products as cellular telephones (for connecting between circuit-board signal lines and antennas), transmitters for Earth/satellite communication systems, and computer mother boards (if processor speeds increase into the range of tens of gigahertz). The transition is designed to satisfy the following requirements in addition to the basic coupling requirement described above: (1) The transition must traverse multiple layers, including intermediate layers that contain DC circuitry. (2) The transition must work at a frequency of 32 GHz with low loss and low reflection. (3) The power delivered by the transition to top-layer microstrip must be split equally in opposite directions along the microstrip. Referring to the figure, this amounts to a requirement that when power is supplied to input port 1, equal amounts of power flow through output ports 2 and 3. (4) The signal-line via that is necessarily a part of such a transition must not be what is known in the art as a blind via; that is, it must span the entire thickness of the circuit board.

  4. Double sided circuit board and a method for its manufacture

    DOEpatents

    Lindenmeyer, C.W.

    1988-04-14

    Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths. 4 figs.

  5. Double sided circuit board and a method for its manufacture

    DOEpatents

    Lindenmeyer, Carl W.

    1989-01-01

    Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

  6. Double sided circuit board and a method for its manufacture

    DOEpatents

    Lindenmeyer, Carl W.

    1989-07-04

    Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

  7. The Dynamic Characteristic of Printed Circuit Board with the Use of the Concept of Simplified Representative Volume Elements

    NASA Astrophysics Data System (ADS)

    Oh, Taek Yul; Seo, Hyun Suk; Kwon, Young-Ha; Kim, Yoon Hyuk

    PCB (Printed Circuit Board)s are designed in various sizes and shapes, use variety of processes and materials, and perform a variety of electrical, structural, and some times thermal functions. The major elements of PCBs are the fabric, the resin, and the metal foil (usually copper). The auxiliary elements are the adhesion promoters or treatments that are applied to the fabric and to the copper to assure maximum adhesion of the resin to the fabric and to the copper. Each copper layer has complicated and different pattern to correctly operate for its mission. In that case, the stiffness of PCBs are affected by the copper layers. By reasoning of this complicated copper layer pattern, it is difficult to determine the PCB stiffness. SAR (Solar Array Regulator) for Korea Leo Earth Observation & Science Satellites Program uses two PCBs of different types and sizes. These PCBs are composed of the resin system and copper layers, and not used the fabric. For this study, arm converter board applied to the SAR components is considered. In this study, the methodology of calculation of the PCB stiffness for SAR component is suggested considering the concept of simplified representative volume element and this property will be correlated with the vibration test results.

  8. Environmental friendly automatic line for recovering metal from waste printed circuit boards.

    PubMed

    Li, Jia; Xu, Zhenming

    2010-02-15

    The technology industrialization was the final goal of the research. A set of automatic line without negative impact to environment for recycling waste printed circuit boards (PCB) in industry-scale was investigated in this study. The independent technologies were integrated and many problems in the process of technology industrialization were solved. The whole technology contained four parts: multiple scarping, material screening, multiple-roll corona electrostatic separator, and dust precipitation. The output of this automatic line reached 600 kg/h and the recovery rate of copper reached 95%. After separation, the metal and nonmetal products were totally reused. Compared with other production lines (traditional fluid bed production line and processing from developed countries), the automatic line has lower energy consumption and better technology rationality. The cost of this line was in acceptable level for local processors. PMID:20092305

  9. Note: Design and construction of a simple and reliable printed circuit board-substrate Bradbury-Nielsen gate for ion mobility spectrometry

    NASA Astrophysics Data System (ADS)

    Du, Yongzhai; Cang, Huaiwen; Wang, Weiguo; Han, Fenglei; Chen, Chuang; Li, Lin; Hou, Keyong; Li, Haiyang

    2011-08-01

    A less laborious, structure-simple, and performance-reliable printed circuit board (PCB) based Bradbury-Nielsen gate for high-resolution ion mobility spectrometry was introduced and investigated. The gate substrate was manufactured using a PCB etching process with small holes (Φ 0.1 mm) drilled along the gold-plated copper lines. Two interdigitated sets of rigid stainless steel spring wire (Φ 0.1 mm) that stands high temperature and guarantees performance stability were threaded through the holes. Our homebuilt ion mobility spectrometer mounted with the gate gave results of about 40 for resolution while keeping a signal intensity of over 0.5 nano-amperes.

  10. Testing of printed circuit board solder joints by optical correlation

    NASA Technical Reports Server (NTRS)

    Espy, P. N.

    1975-01-01

    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  11. New printed circuit boards magnetic coils in the vacuum vessel of J-TEXT tokamak for position measurement

    SciTech Connect

    Qiu, S. S.; Zhuang, G.; Zhang, M.; Xia, D. H.; Rao, B.; Zhang, X. Q.; Pan, Y.; Gentle, K.

    2010-10-15

    Four sets of magnetic diagnostic coils, which are printed on machinable ceramic printed circuit boards (PCB), are designed, fabricated, installed, and tested in the Joint Texas Experimental Tokamak (J-TEXT) vacuum vessel for detecting the plasma radial and vertical displacements relative to the geometric center of the vacuum vessel in Ohmic discharges. Each coordinate is determined by a pair of variable cross-section Rogowski and saddle coils, which measure the tangential and normal magnetic fields (relative to the coil surface). These coils are suitable for mass production and offer advantages in vacuum compatibility and temperature tolerance that are important for J-TEXT. Position measurements using PCB coils are compared with those from soft x-ray image system and match the position well.

  12. Electrostatic separation for recycling waste printed circuit board: a study on external factor and a robust design for optimization.

    PubMed

    Hou, Shibing; Wu, Jiang; Qin, Yufei; Xu, Zhenming

    2010-07-01

    Electrostatic separation is an effective and environmentally friendly method for recycling waste printed circuit board (PCB) by several kinds of electrostatic separators. However, some notable problems have been detected in its applications and cannot be efficiently resolved by optimizing the separation process. Instead of the separator itself, these problems are mainly caused by some external factors such as the nonconductive powder (NP) and the superficial moisture of feeding granule mixture. These problems finally lead to an inefficient separation. In the present research, the impacts of these external factors were investigated and a robust design was built to optimize the process and to weaken the adverse impact. A most robust parameter setting (25 kv, 80 rpm) was concluded from the experimental design. In addition, some theoretical methods, including cyclone separation, were presented to eliminate these problems substantially. This will contribute to efficient electrostatic separation of waste PCB and make remarkable progress for industrial applications. PMID:20518505

  13. New printed circuit boards magnetic coils in the vacuum vessel of J-TEXT tokamak for position measurementa)

    NASA Astrophysics Data System (ADS)

    Qiu, S. S.; Zhuang, G.; Zhang, M.; Xia, D. H.; Rao, B.; Zhang, X. Q.; Pan, Y.; Gentle, K.

    2010-10-01

    Four sets of magnetic diagnostic coils, which are printed on machinable ceramic printed circuit boards (PCB), are designed, fabricated, installed, and tested in the Joint Texas Experimental Tokamak (J-TEXT) vacuum vessel for detecting the plasma radial and vertical displacements relative to the geometric center of the vacuum vessel in Ohmic discharges. Each coordinate is determined by a pair of variable cross-section Rogowski and saddle coils, which measure the tangential and normal magnetic fields (relative to the coil surface). These coils are suitable for mass production and offer advantages in vacuum compatibility and temperature tolerance that are important for J-TEXT. Position measurements using PCB coils are compared with those from soft x-ray image system and match the position well.

  14. Sampling and Control Circuit Board for an Inertial Measurement Unit

    NASA Technical Reports Server (NTRS)

    Chelmins, David; Powis, Rick

    2012-01-01

    Spacesuit navigation is one component of NASA s efforts to return humans to the Moon. Studies performed at the NASA Glenn Research Center (GRC) considered various navigation technologies and filtering approaches to enable navigation on the lunar surface. As part of this effort, microelectromechanical systems (MEMS) inertial measurement units (IMUs) were studied to determine if they could supplement a radiometric infrastructure. MEMS IMUs were included in the Lunar Extra-Vehicular Activity Crewmember Location Determination System (LECLDS) testbed during NASA s annual Desert Research and Technology Studies (D-RATS) event in 2009 and 2010. The testbed included one IMU in 2009 and three IMUs in 2010, along with a custom circuit board interfacing between the navigation processor and each IMU. The board was revised for the 2010 test, and this paper documents the design details of this latest revision of the interface circuit board and firmware.

  15. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor.

    PubMed

    Rodrigues, Michael L M; Leão, Versiane A; Gomes, Otavio; Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan

    2015-07-01

    The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (-208μm+147μm), ferrous iron concentration (1.25-10.0g/L) and pH (1.5-2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20mm-long) working with increased solids concentration (up to 25.0g/L). Because there was as the faster leaching kinetics at 50°C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8days and microscopic observations by SEM-EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20mm-size sheets. PMID:25899037

  16. Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

    NASA Astrophysics Data System (ADS)

    Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

    2016-08-01

    Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

  17. Effect of High-Humidity Testing on Material Parameters of Flexible Printed Circuit Board Materials

    NASA Astrophysics Data System (ADS)

    Lahokallio, Sanna; Saarinen, Kirsi; Frisk, Laura

    2013-09-01

    The tendency of polymers to absorb moisture impairs especially their electrical and mechanical properties. These are important characteristics for printed circuit board (PCB) materials, which should provide mechanical support as well as electrical insulation in many different environments in order to guarantee safe operation for electrical devices. Moreover, the effects of moisture are accelerated at increased temperatures. In this study, three flexible PCB dielectric materials, namely polyimide (PI), fluorinated ethylene-propylene (FEP), and polyethylene terephthalate (PET), were aged over different periods of time in a high-humidity test, in which the temperature was 85°C and relative humidity 85%. After aging, the changes in the structure of the polymers were studied by determining different material parameters such as modulus of elasticity, glass-transition temperature, melting point, coefficient of thermal expansion, water absorption, and crystallinity, and changes in the chemical structure with several techniques including thermomechanical analysis, differential scanning calorimetry, Fourier-transform infrared spectroscopy, moisture analysis, and a precision scale. The results showed that PI was extremely stable under the aging conditions and therefore an excellent choice for electrical applications under harsh conditions. Similarly, FEP proved to be relatively stable under the applied aging conditions. However, its crystallinity increased markedly during aging, and after 6000 h of aging the results indicated oxidation. PET suffered from hydrolysis during the test, leading to its embrittlement after 2000 h of aging.

  18. Ion track enabled multiple wire microvia interconnects in printed circuit boards

    NASA Astrophysics Data System (ADS)

    Yousef, H.; Lindeberg, M.; Hjort, K.

    2008-04-01

    As the call for higher wiring density in packaging and vertical microvia interconnections (microvias) rapidly evolves, the need for smaller lateral dimensions in printed circuit boards (PCB) microvias must be met. The ion track lithography described in this paper allows for high throughput micromachining of small, deep, vertical microvias in flexible PCB and all-polymer laminates. Ion track lithography makes use of swift heavy ion irradiation to enhance the selectivity and directionality of chemical etching. Within the areas exposed to the ion irradiation, small sub-micron pores (capillaries) are created, one for every ion. If etching is prolonged, the pores become merged. Electrodeposition from a metallic seed layer is used to fill these structures with metal. The lithography masks define either the areas where the ion tracks are developed or where the tracks are metallized. The smallest achievable size of the microvias is only limited by the resolution of the mask; microvias below 10 μm in diameter can also be achieved also in thick polyimide foils. Since each impinging ion forms one track, the foil's porosity can be controlled by adjusting the irradiation dose, as well as by etching the pores to a suitable size. Depending on the porosity and material, the resultant metallized microvia consists of either individual or interlaced wires (like strands in a bundle wire), or is a solid. As an individual sub-micron wire may have an aspect ratio of several hundreds, this allows for the fabrication of truly vertical microvia structures, allowing ultra-high density microvia batch production. Demonstrator microstructures with highly vertical microvias have been fabricated in foils up to 125 μm thickness. Several components integrated in flexible PCB have been presented by us, e.g. magnetoresistive sensors, thermopile IR-sensors and microwave components like inductor elements.

  19. Investigation of Solder Cracking Problems on Printed Circuit Boards

    NASA Technical Reports Server (NTRS)

    Berkebile, M. J.

    1967-01-01

    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  20. Evaluation of gold and silver leaching from printed circuit board of cellphones

    SciTech Connect

    Petter, P.M.H. Veit, H.M.; Bernardes, A.M.

    2014-02-15

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

  1. Coaxial connector for use with printed circuit board edge connector

    DOEpatents

    Howard, Donald R.; MacGill, Robert A.

    1989-01-01

    A coaxial cable connector for interfacing with an edge connector for a printed circuit board whereby a coaxial cable can be interconnected with a printed circuit board through the edge connector. The coaxial connector includes a body having two leg portions extending from one side for receiving the edge connector therebetween, and a tubular portion extending from an opposing side for receiving a coaxial cable. A cavity within the body receives a lug of the edge connector and the center conductor of the coaxial cable. Adjacent lugs of the edge connector can be bend around the edge connector housing to function as spring-loaded contacts for receiving the coaxial connector. The lugs also function to facilitate shielding of the center conductor where fastened to the edge connector lug.

  2. Pollution prevention assessment for a printed circuit board plant

    SciTech Connect

    Edwards, H.W.; Kostrzewa, M.F.; Looby, G.P.

    1995-09-01

    The US Environmental Protection Agency (EPA) has funded a pilot project to assist small and medium-size manufacturers who want to minimize their generation of waste but who lack the expertise to do so. In an effort to assist these manufacturers Waste Minimization Assessment Centers (WMACs) were established at selected universities and procedures were adapted from the EPA Waste Minimization Opportunity Assessment Manual. The WMAC team at Colorado State University performed an assessment at a plant that manufacturers printed circuit boards. Templates for the circuit design are generated from customer-supplied circuit information. Copper/epoxy laminates and copper foil are cut into blank boards and layers. Circuit patterns are generated through a series of photolithographic and plating processes. The team`s report, detailing findings and recommendations, indicated that the onsite ion-exchange treatment of metal-containing rinse water generates regenerant solutions that could be further treated by electrowinning to recover metals and to achieve significant cost savings. This Research Brief was developed by the principal investigators and EPA`s National Risk Management Research Laboratory, Cincinnati, OH, to announce key findings of an ongoing research project that is fully documented in a separate report of the same title available from University City Science Center.

  3. An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate

    NASA Astrophysics Data System (ADS)

    Chang, Jing-Yao; Chaung, Tung-Han; Chang, Tao-Chih

    2015-10-01

    Flip-chip technology has been widely accepted as a solution for electronic packaging of high-pin-count devices. Due to the demand for smaller and thinner package dimensions, coreless build-up substrates will be used in industry to carry the die by solder bumps due to the advantages of shorter transmission route and lower inductance and thermal resistance. However, coefficient of thermal expansion (CTE) mismatch between the Cu trace and the laminate often causes the coreless substrate to warp, which leads to failures such as nonwetted solder bumps and interfacial cracking during assembly and reliability tests. In a previous study, assembly of a six-layer polyimide-based coreless flip-chip package was achieved by a 17 mm × 17 mm die with 4355 Sn-37Pb solder bumps, an amide-based underfill, and 1521 Sn-3.0Ag-0.5Cu solder balls. For determination of its board-level reliability characteristics, the component was mounted on a printed circuit board (PCB) using a conventional surface mount technology, and 10 test vehicles were assembled for assessment of their reliability under a temperature cycling environment. The experimental results show that the characteristic life of the PCB assembly exceeded 1500 cycles and that failure resulted from fracture of the outermost solder balls on the substrate side. This was different from the failure mode of die cracking when the package experienced hundreds of temperature cycles at the component level because the rigid PCB, through solder balls, moderated the deformation of the coreless flip-chip package. Hence, the concentrated bending stress at the die edge region was lowered. Finally, the local CTE mismatch between the stiffener and the PCB dominated the fatigue fracture of the outermost solder balls to become the main failure mode.

  4. Thermal research of infrared sight signal processing circuit board under temperature shock environment

    NASA Astrophysics Data System (ADS)

    Gao, Youtang; Ding, Huang; Qiao, Jianliang; Xu, Yuan; Niu, Jun

    2015-10-01

    Thermal stability technology of signal processing circuit infrared sight is studied under temperature shock. Model parameters and geometry is configured for FPGA devices (EP1C20F400C8), solder material and PCB. Signal circuit boards of full array BGA distribution are simulated and analyzed by thermal shock and waveform through engineering finite element analysis software. Because solders of the whole model have strong stress along Y direction, initial stress constraints along Y direction are primarily considered when the partial model of single solder is imposed by thermal load. When absolute thermal loads stresses of diagonal nodes with maximum strains are separated from the whole model, interpolation is processed according to thermal loads circulation. Plastic strains and thermal stresses of nodes in both sides of partial model are obtained. The analysis results indicate that with thermal load circulation, maximum forces of each circulation along Y direction are increasingly enlarged and with the accumulation of plastic strains of danger point, the composition will become invalid in the end.

  5. High-resolution Mapping of In Vivo Gastrointestinal Slow Wave Activity Using Flexible Printed Circuit Board Electrodes: Methodology and Validation

    PubMed Central

    DU, PENG; O'GRADY, G.; EGBUJI, J. U.; LAMMERS, W. J.; BUDGETT, D.; NIELSEN, P.; WINDSOR, J. A.; PULLAN, A. J.; CHENG, L. K.

    2014-01-01

    High-resolution, multi-electrode mapping is providing valuable new insights into the origin, propagation, and abnormalities of gastrointestinal (GI) slow wave activity. Construction of high-resolution mapping arrays has previously been a costly and time-consuming endeavor, and existing arrays are not well suited for human research as they cannot be reliably and repeatedly sterilized. The design and fabrication of a new flexible printed circuit board (PCB) multi-electrode array that is suitable for GI mapping is presented, together with its in vivo validation in a porcine model. A modified methodology for characterizing slow waves and forming spatiotemporal activation maps showing slow waves propagation is also demonstrated. The validation study found that flexible PCB electrode arrays are able to reliably record gastric slow wave activity with signal quality near that achieved by traditional epoxy resin-embedded silver electrode arrays. Flexible PCB electrode arrays provide a clinically viable alternative to previously published devices for the high-resolution mapping of GI slow wave activity. PCBs may be mass-produced at low cost, and are easily sterilized and potentially disposable, making them ideally suited to intra-operative human use. PMID:19224368

  6. Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control.

    PubMed

    Chiang, Hung-Lung; Lin, Kuo-Hsiung

    2014-01-15

    The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H2, CH4, CO2, and NOx, were 60-115, 0.4-4.0, 1.1-10, 30-95, and 0-0.7mg/g, corresponding to temperatures ranging from 200 to 500°C. When the pyrolysis temperature was lower than 300°C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400°C. When VOC exhaust was flowed through the bed of Fe-impregnated Al2O3, the emission of ozone precursor VOCs could be reduced by 70-80%. PMID:24239260

  7. Use of large pieces of printed circuit boards for bioleaching to avoid 'precipitate contamination problem' and to simplify overall metal recovery.

    PubMed

    Adhapure, N N; Dhakephalkar, P K; Dhakephalkar, A P; Tembhurkar, V R; Rajgure, A V; Deshmukh, A M

    2014-01-01

    Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple. PMID:26150951

  8. Use of large pieces of printed circuit boards for bioleaching to avoid ‘precipitate contamination problem’ and to simplify overall metal recovery

    PubMed Central

    Adhapure, N.N.; Dhakephalkar, P.K.; Dhakephalkar, A.P.; Tembhurkar, V.R.; Rajgure, A.V.; Deshmukh, A.M.

    2014-01-01

    Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple. PMID:26150951

  9. Development of two-step process for enhanced biorecovery of Cu-Zn-Ni from computer printed circuit boards.

    PubMed

    Shah, Monal B; Tipre, Devayani R; Purohit, Mamta S; Dave, Shailesh R

    2015-08-01

    Metal pollution due to the huge electronic waste (E-waste) accumulation is widespread across the globe. Extraction of copper, zinc and nickel from computer printed circuit boards (c-PCB) with a two-step bleaching process using ferric sulphate generated by Leptospirillum ferriphilum dominated consortium and the factors influencing the process were investigated in the present study. The studied factors with 10 g/L pulp density showed that pH 2.0 was optimum which resulted in 87.50-97.80% Cu-Zn-Ni extraction. Pre-treatment of PCB powder with acidified distilled water and NaCl solution showed 3.80-7.98% increase in metal extraction corresponding to 94.08% Cu, 99.80% Zn and 97.99% Ni extraction. Particle size of 75 μm for Cu and Zn while 1680 μm for Ni showed 2-folds increase in metal extraction, giving 97.35-99.80% Cu-Zn-Ni extraction in 2-6 days of reaction time. Whereas; 2.76-3.12 folds increase in Cu and Zn extraction was observed with the addition of 0.1% chelating agents. When the studies were carried out with high pulp density, ferric iron concentration of 16.57 g/L was found to be optimum for metal extraction from 75 g/L c-PCB and c-PCB addition in multiple installments resulted in 8.81-26.35% increase in metal extraction compared to single addition. The studied factors can be implemented for the scale-up aimed at faster recovery of multimetals from E-waste and thereby providing a secondary source of metal in an eco-friendly manner. PMID:25636979

  10. Laser technology in manufacture of printed-circuit boards

    NASA Astrophysics Data System (ADS)

    Machulka, G. A.; Stelmakh, M. F.; Uladinov, A. B.

    1985-09-01

    The complexity of the printed-circuit board manufacturing process, additionally encumbered by the intricacy of topology and layout, especially in multilayer boards, makes application of laser technology a very attractive possibility. Extensive studies have established the feasibility of using laser radiation in polygraphic dry offset printing, despite difficulties created by the high thermal conductivity of metallized surfaces, also in etching of patterns, drilling of holes, and soldering of joints. A gaseous (CO2) laser and a solid-state (garnet) laser have been found to be most suitable, each for specific operations. One of the most critical factors here is selection of oxidation-resistant materials for masks and insulation. The next step is incorporating the laser operations in the production line. The feasibility of this has been established in three versions. The first and simplest version, without computer, is proposed for experimental or pilot production of bilateral boards. The second version is proposed or commercial production, with an automatic work station and a control computer. In the third and most advanced version, for large-scale production, the automatic work station has been replaced by a computer-aided design system.

  11. Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device

    DOEpatents

    Anderson, Gene R.; Armendariz, Marcelino G.; Bryan, Robert P.; Carson, Richard F.; Duckett, III, Edwin B.; McCormick, Frederick B.; Peterson, David W.; Peterson, Gary D.; Reysen, Bill H.

    2005-03-15

    This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.

  12. Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

    PubMed

    Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

    2015-11-01

    Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. PMID:26022338

  13. Liberation characteristics after cryogenic modification and air table separation of discarded printed circuit boards.

    PubMed

    Zhou, Cuihong; Pan, Yongtai; Lu, Maxi; Yang, Changshun

    2016-07-01

    Liberating useful materials from printed circuit boards (PCBs) is challenging because PCBs are flexible and complex in terms of materials and components. In this study, the crushing of PCBs at low-temperature was investigated. The results indicated that when the temperature was decreased to approximately -20 °C, the strength of PCBs decreased and their brittleness increased, making them easier to crush. A double roll crusher was selected to crush the PCBs. The particle size distribution and power consumption were studied under different working conditions. The results showed that the particle size of most of the lumps was in the range 15×20-25×20 mm, and that power consumption was minimal when the frequency of the crusher was 40-50 Hz. A small shredder was used for cryogenic grinding, and it was found that its power consumption strongly depended on the cooling temperature. An orthogonal experiment was conducted, which revealed that a smaller cutter gap and higher rotational speed could achieve higher yield. Furthermore, the results indicated that the air table developed to liberate PCB materials could effectively separate 2.8-0.5mm grade materials. Overall, the results of this study provide an experimental foundation for more effectively recycling discarded PCBs. PMID:26985873

  14. Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board

    NASA Astrophysics Data System (ADS)

    Van Steenberge, Geert; Hendrickx, Nina; Geerinck, Peter; Bosman, Erwin; Van Put, Steven; Van Erps, Jurgen; Thienpont, Hugo; Van Daele, Peter

    2006-02-01

    We present a fabrication technology for integrating polymer waveguides and 45° micromirror couplers into standard electrical printed circuit boards (PCBs). The most critical point that is being addressed is the low-cost manufacturing and the compatibility with current PCB production. The latter refers to the processes as well as material compatibility. Multimode waveguides are patterned by KrF excimer laser ablation in acrylate polymers with 0.13 dB/cm propagation loss at 850 nm. Single mode waveguides using inorganic-organic hybrid polymers show an attenuation loss of 0.62 +/- 0.08 dB/cm at 1.3 μm. A process for embedding metal coated 45° micromirrors in optical waveguiding layers is developed. Mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation. Initial single mode coupling loss measurements at 1.3 μm show an excess mirror loss of 1.55 dB. Multimode coupling loss measurements will improve this excess loss, because of the lower surface roughness of the mirrors using the acrylate polymers for multimode waveguides.

  15. Ion chromatography in the manufacture of multilayer circuit boards

    SciTech Connect

    Smith, R.E.

    1990-09-01

    Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. The manufacturing process is described briefly and previously published IC methods are reviewed. Then, methods are described for determining chlorate and chlorite in a brown oxide solution; salicylic acid in an epoxy cure agent; formate, sulfate, and tartrate in an electroless copper bath; anionic detergents in a tin-lead brightener and in a cleaning solution; and aqueous photoresist and nonionic brightener in a tin-lead bath. Anion exchange, reverse phase HPLC on a poly(styrene/divinylbenzene), PS/DVB, column and two-dimensional liquid chromatography also are described. Chemically suppressed conductivity and photometric detection are used. 13 refs., 10 figs., 1 tab.

  16. Ultrasonic decontamination in perfluorinated liquids of radioactive circuit boards

    SciTech Connect

    Yam, C.S.; Harling, O.K.; Kaiser, R.

    1994-12-31

    A laboratory-scale ultrasonic decontamination system has been developed to demonstrate the application of Entropic System`s enhanced particle removal process to the radioactive decontamination of electronic circuit boards. The process uses inert perfluorinated liquids as the working media; the liquids have zero ozone depletion potential, are nontoxic, non-flammable, and are generally recognized as nonhazardous materials. The parts to be cleaned are first sonicated with a dilute solution of a high-molecular-weight fluorocarbon surfactant in an inert perfluorinated liquid. The combination of ultrasonic agitation and liquid flow promotes the detachment of the particles from the surface of the part being cleaned, their transfer from the boundary layer into the bulk liquid, and their removal from the cleaning environment, thereby reducing the probability of particle redeposition. After the cleaning process, the parts are rinsed with the pure perfluorinated liquid to remove residual surfactant. The parts are recovered after the perfluorinated liquid is evaporated into air.

  17. Printed-circuit-board manufacturer maximizes recycling opportunities

    SciTech Connect

    Edelstein, P. )

    1993-02-01

    A major New England printed-circuit-board manufacturer has avoided land disposal of several metallic wastes for more than 15 years by recycling them offsite. For example, the company uses ammoniacal etchant to etch copper. Waste generated by this process is used by an offsite recycler to produce copper compounds for pressure-treated lumber and for use as a catalyst. Sodium persulfate and peroxide-sulfuric micro-etchants are used at the facility, generating a crude copper sulfate solution, and copper sulfate also is the basis for the company's electroplating process. Wastes from all of these processes are used by an offsite recycler to produce copper compounds that are sold for use in wood treatment and as mining reagents. Finally, metal hydroxide sludge generated by the company's wastewater treatment system contains substantial amounts of copper, which is sent for refining at a copper smelter.

  18. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    SciTech Connect

    Troeger, K. Darka, R. Khanpour Neumeyer, T. Altstaedt, V.

    2014-05-15

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

  19. Radiological characterization of printed circuit boards for future elimination.

    PubMed

    Zaffora, Biagio; Magistris, Matteo

    2016-07-01

    Electronic components like printed circuit boards (PCBs) are commonly used in CERN's accelerator complex. During their lifetime some of these PCBs are exposed to a radiation field of protons, neutrons and pions and are activated. In view of their disposal towards the appropriate final repository, a radiological characterization must be performed. The present work proposes a general characterization procedure based on the definition of a reference chemical composition, on the calculation of the corresponding radionuclide inventory and on the measurement of a tracer radionuclide. This method has been validated with real-life cases of electronic boards which were exposed to the typical radiation fields in CERN's accelerators. The activation studies demonstrate that silver is the key element with respect to the radiological characterization of electronic waste due to the production of Ag-110m and Ag-108m. A sensitivity analysis shows that the waiting time is the main parameter affecting the radionuclide inventory. Results also indicate that, as is the case of other families of radioactive waste, an accurate assessment of the radiological inventory of PCBs would require the precise knowledge of their chemical composition, as well as the radiation field to which they were exposed. PMID:27129133

  20. Bare PCB test method based on AI

    NASA Astrophysics Data System (ADS)

    Li, Aihua; Zhou, Huiyang; Wan, Nianhong; Qu, Liangsheng

    1995-08-01

    The shortcomings of conventional methods used for developing test sets on current automated printed circuit board (PCB) test machines consist of overlooking the information from CAD, historical test data, and the experts' knowledge. Thus, the generated test sets and proposed test sequence may be sub-optimal and inefficient. This paper presents a weighting bare PCB test method based on analysis and utilization of the CAD information. AI technique is applied for faults statistics and faults identification. Also, the generation of test sets and the planning of test procedure are discussed. A faster and more efficient test system is achieved.

  1. Aluminum heat sink enables power transistors to be mounted integrally with printed circuit board

    NASA Technical Reports Server (NTRS)

    Seaward, R. C.

    1967-01-01

    Power transistor is provided with an integral flat plate aluminum heat sink which mounts directly on a printed circuit board containing associated circuitry. Standoff spacers are used to attach the heat sink to the printed circuit board containing the remainder of the circuitry.

  2. 77 FR 61025 - Certain Prepregs, Laminates, and Finished Circuit Boards: Notice of Institution of Formal...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-10-05

    ..., Arizona (``Isola'') on October 6, 2008, and supplemented on October 28, 2008. 73 FR 66919 (November 12... COMMISSION Certain Prepregs, Laminates, and Finished Circuit Boards: Notice of Institution of Formal... States after importation of certain prepregs, laminates, and finished circuit boards that...

  3. Increasing the wiring density of multilayer printed circuit boards for airborne scientific instrumentation

    NASA Astrophysics Data System (ADS)

    Panfilova, G. T.; Sadykov, K. S.

    Design improvements are proposed for multilayer printed circuit boards manufactured by the method of open bonding pads which make it possible to reduce the volume of electronic blocks and the number of layers in the printed circuit board. The proposed improvements include the use of double wells for interlayer connection and overlap soldering of small radioelectronic elements.

  4. Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards

    NASA Astrophysics Data System (ADS)

    Kim, Do-Hyoung; Joo, Sung-Jun; Kwak, Dong-Ok; Kim, Hak-Sung

    2015-10-01

    In this study, the warpage simulation of a multi-layer printed circuit board (PCB) was performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) composite patterns and their anisotropic viscoelastic properties. The thermo-mechanical properties of Cu/PSR patterns were obtained from finite element analysis (virtual test) and homogenized with anisotropic composite shell models that considered the viscoelastic properties. The multi-layer PCB model was simplified based on the unit Cu/PSR patterns and the warpage simulation during the reflow process was performed by using ABAQUS combined with a user-defined subroutine. From these results, it was demonstrated that the proposed anisotropic viscoelastic composite shell simulation technique can be successfully used to predict warpage of multi-layer PCBs during the reflow process.

  5. Ultra-sensitive electrical immunoassay biosensors using nanotextured zinc oxide thin films on printed circuit board platforms.

    PubMed

    Jacobs, Michael; Muthukumar, Sriram; Panneer Selvam, Anjan; Engel Craven, Jon; Prasad, Shalini

    2014-05-15

    This study demonstrates the development of nanotextured zinc oxide (ZnO) thin films sputter deposited on printed circuit boards (PCB) to enhance the capability in detecting low concentrations of the protein troponin-T. The presence of this particular biomarker in the bloodstream is a direct indicator of current and/or future risk of various forms of cardiovascular diseases. Electrical transduction through impedance spectroscopy was used to detect troponin-T functionalized immunoassays on nanotextured ZnO surfaces. Calibration of the immunoassay was performed by measuring the impedance changes resulting from the binding of increasing concentrations of troponin-T to the immobilized antibodies on the ZnO surface in (i) phosphate buffered saline (PBS) and (ii) human serum. The limit of detection achieved using this platform was 10 fg/mL and 100 fg/mL in PBS and human serum, respectively. Enhanced detection of troponin-T was found to correlate to the oxygen vacancies in the ZnO thin film. PCB was chosen as the substrate for ease of integration with microelectronic device manufacturing. PMID:24355459

  6. A Circuit Board Using a Sheet of Thick Paper and Aluminium Tape

    ERIC Educational Resources Information Center

    Kamata, Masahiro; Honda, Motoshi

    2003-01-01

    We have developed a circuit board using materials that are inexpensive and familiar to elementary school students. Most of the responses from students who made this board were relatively positive and we observed them enjoy making the boards at a Science Festival in Japan and in elementary school. As an application, we also developed a tiny torch…

  7. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  8. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  9. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  10. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  11. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  12. International standards for optical circuit board fabrication, assembly and measurement

    NASA Astrophysics Data System (ADS)

    Pitwon, Richard; Immonen, Marika; Wang, Kai; Itoh, Hideo; Shioda, Tsuyoshi; Wu, Jinhua; Zhu, Long Xiu; Yan, Hui Juan; Worrall, Alex

    2016-03-01

    The commercial adoption of electro-optical printed circuit board (EOCB) technology will be accelerated by the development of industrial and conformity standards for high volume fabrication, connector assembly and waveguide measurement. In this paper, we introduce international standardisation activities surrounding EOCBs and report on industrial processes developed for the high volume fabrication of complex EOCBs with embedded multimode polymer waveguides including a first connector standard for polymer waveguide termination. We focus on solving a serious historic problem with the measurement of optical waveguide systems, namely the lack of harmonised measurement conditions for optical waveguides, which to this day gives rise to strong inconsistencies in the results of measurements by different parties on the same waveguide. We report on the development of a standard to ensure repeatable measurement of optical waveguides, whereby we demonstrate how the application of a measurement identification system and proposed reference measurement conditions can bring variation in measurement results to within 5%, thereby serving as the basis for a formal reliable optical waveguide measurement methodology.

  13. Using multiple sensors for printed circuit board insertion

    NASA Technical Reports Server (NTRS)

    Sood, Deepak; Repko, Michael C.; Kelley, Robert B.

    1989-01-01

    As more and more activities are performed in space, there will be a greater demand placed on the information handling capacity of people who are to direct and accomplish these tasks. A promising alternative to full-time human involvement is the use of semi-autonomous, intelligent robot systems. To automate tasks such as assembly, disassembly, repair and maintenance, the issues presented by environmental uncertainties need to be addressed. These uncertainties are introduced by variations in the computed position of the robot at different locations in its work envelope, variations in part positioning, and tolerances of part dimensions. As a result, the robot system may not be able to accomplish the desired task without the help of sensor feedback. Measurements on the environment allow real time corrections to be made to the process. A design and implementation of an intelligent robot system which inserts printed circuit boards into a card cage are presented. Intelligent behavior is accomplished by coupling the task execution sequence with information derived from three different sensors: an overhead three-dimensional vision system, a fingertip infrared sensor, and a six degree of freedom wrist-mounted force/torque sensor.

  14. Hydrometallurgical Recovery of Metals from Large Printed Circuit Board Pieces

    PubMed Central

    Jadhav, U.; Hocheng, H.

    2015-01-01

    The recovery of precious metals from waste printed circuit boards (PCBs) is an effective recycling process. This paper presents a promising hydrometallurgical process to recover precious metals from waste PCBs. To simplify the metal leaching process, large pieces of PCBs were used instead of a pulverized sample. The chemical coating present on the PCBs was removed by sodium hydroxide (NaOH) treatment prior to the hydrometallurgical treatment. Among the leaching reagents examined, hydrochloric acid (HCl) showed great potential for the recovery of metals. The HCl-mediated leaching of waste PCBs was investigated over a range of conditions. Increasing the acid concentration decreased the time required for complete metal recovery. The shaking speed showed a pronounced positive effect on metal recovery, but the temperature showed an insignificant effect. The results showed that 1 M HCl recovered all of the metals from 4 cm × 4 cm PCBs at room temperature and 150 rpm shaking speed in 22 h. PMID:26415827

  15. Hydrometallurgical Recovery of Metals from Large Printed Circuit Board Pieces

    NASA Astrophysics Data System (ADS)

    Jadhav, U.; Hocheng, H.

    2015-09-01

    The recovery of precious metals from waste printed circuit boards (PCBs) is an effective recycling process. This paper presents a promising hydrometallurgical process to recover precious metals from waste PCBs. To simplify the metal leaching process, large pieces of PCBs were used instead of a pulverized sample. The chemical coating present on the PCBs was removed by sodium hydroxide (NaOH) treatment prior to the hydrometallurgical treatment. Among the leaching reagents examined, hydrochloric acid (HCl) showed great potential for the recovery of metals. The HCl-mediated leaching of waste PCBs was investigated over a range of conditions. Increasing the acid concentration decreased the time required for complete metal recovery. The shaking speed showed a pronounced positive effect on metal recovery, but the temperature showed an insignificant effect. The results showed that 1 M HCl recovered all of the metals from 4 cm × 4 cm PCBs at room temperature and 150 rpm shaking speed in 22 h.

  16. Elemental analysis of printed circuit boards considering the ROHS regulations.

    PubMed

    Wienold, Julia; Recknagel, Sebastian; Scharf, Holger; Hoppe, Marion; Michaelis, Matthias

    2011-03-01

    The EU RoHS Directive (2002/95/EC of the European Parliament and of the Council) bans the placing of new electrical and electronic equipment containing more than agreed levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants on the EU market. It necessitates methods for the evaluation of RoHS compliance of assembled electronic equipment. In this study mounted printed circuit boards from personal computers were analyzed on their content of the three elements Cd, Pb and Hg which were limited by the EU RoHS directive. Main focus of the investigations was the influence of sample pre-treatment on the precision and reproducibility of the results. The sample preparation steps used were based on the guidelines given in EN 62321. Five different types of dissolution procedures were tested on different subsequent steps of sample treatment like cutting and milling. Elemental analysis was carried out using ICP-OES, XRF and CV-AFS (Hg). The results obtained showed that for decision-making with respect to RoHS compliance a size reduction of the material to be analyzed to particles ≤ 1.5mm can already be sufficient. However, to ensure analytical results with relative standard deviations of less than 20%, as recommended by the EN 62321, a much larger effort for sample processing towards smaller particle sizes might be required which strongly depends on the mass fraction of the element under investigation. PMID:21050740

  17. Prioritizing material recovery for end-of-life printed circuit boards

    SciTech Connect

    Wang Xue; Gaustad, Gabrielle

    2012-10-15

    Highlights: Black-Right-Pointing-Pointer Material recovery driven by composition, choice of ranking, and weighting. Black-Right-Pointing-Pointer Economic potential for new recycling technologies quantified for several metrics. Black-Right-Pointing-Pointer Indicators developed for materials incurring high eco-toxicity costs. Black-Right-Pointing-Pointer Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

  18. Evaluation of gold and silver leaching from printed circuit board of cellphones.

    PubMed

    Petter, P M H; Veit, H M; Bernardes, A M

    2014-02-01

    Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added. PMID:24332399

  19. Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis.

    PubMed

    Lin, Kuo-Hsiung; Chiang, Hung-Lung

    2014-04-30

    Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200-500°C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)-MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25-28 mg/g, iron 1.3-1.7 mg/g, tin 0.8-1.0mg/g and magnesium 0.4-1.0mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68-73%, hydrogen was 10-14%, nitrogen was 4-5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500°C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust. PMID:24637450

  20. Laser structuring of ultra-fine circuit lines in printed circuit boards: Laser structuring, neodymium-doped yttrium aluminium garnet laser, fine circuit lines

    NASA Astrophysics Data System (ADS)

    Zhang, Bin

    Laser structuring technique emerged in recent years for the need of fabricating fine circuit lines and spaces in printed circuit board. Most of the previous work only introduced laser structuring as a new method in the fabrication of fine circuit lines and mentioned that the width of circuit line can be reduced under 50 pin or helox with this technique. Laser structuring technique will have a prosperous future only when the relationship between process parameters and fabrication results are deeply understood. This study focuses on the control, prediction and optimization of circuit geometry by studying relations between the process parameters and fabrication results in laser structuring technology. The effects of laser parameters (Frequency-tripled Nd:YAG laser) on the geometry of circuits were carried out by experiments and analyzed by mathematical method. The geometry of circuit space can efficiently be controlled by investigating the main factors that influence the characteristic parameters of circuit space with Taguchi methodology. ANN was firstly used in the study of laser structuring technique. With ANN models, the optimization of process parameters in laser writing step can be realized and the 2-D cross-sectional profile of circuit space can be calculated with the combination of ANN model and mathematical method. At last, the final circuit lines and circuit spaces fabricated were tested using the quality and reliability tests---electrical open/short test, peel test and surface insulation resistance test (SIR test). The minimum widths of circuit lines and circuit spaces with good quality and reliability fabricated by laser structuring were 25 mum and 45 mum respectively. The project is significant for both applied and academic fields. This study contributes to the understanding of the laser structuring technology and is of benefit in the fabrication of very fine line circuits in advanced printed circuit board industry.

  1. Optical waveguide circuit board with a surface-mounted optical receiver array

    NASA Astrophysics Data System (ADS)

    Thomson, J. E.; Levesque, Harold; Savov, Emil; Horwitz, Fred; Booth, Bruce L.; Marchegiano, Joseph E.

    1994-03-01

    A photonic circuit board is fabricated for potential application to interchip and interboard parallel optical links. The board comprises photolithographically patterned polymer optical waveguides on a conventional glass-epoxy electrical circuit board and a surface-mounted integrated circuit (IC) package that optically and electrically couples to an optoelectronic IC. The waveguide circuits include eight-channel arrays of straights, cross-throughs, curves, self- aligning interconnects to multi-fiber ribbon, and out-of-plane turning mirrors. A coherent, fused bundle of optical fibers couples light between 45-deg waveguide mirrors and a GaAs receiver array in the IC package. The fiber bundle is easily aligned to the mirrors and the receivers and is amenable to surface mounting and hermetic sealing. The waveguide-receiver- array board achieved error-free data rates up to 1.25 Gbits/s per channel, and modal noise was shown to be negligible.

  2. Dielectric nanocomposites for high performance embedded capacitors in organic printed circuit boards

    NASA Astrophysics Data System (ADS)

    Xu, Jianwen

    Conventionally discrete passive components like capacitors, resistors, and inductors are surface-mounted on top of the printed circuit boards (PCBs). To match the ever increasing demands of miniaturization, cost reduction, and high performance in microelectronic industry, a promising approach is to integrate passive components into the board during PCB manufacture. Because they are embedded inside multilayer PCBs, such components are called embedded passives. This work focuses on the materials design, development and processing of polymer-based dielectric nanocomposites for embedded capacitor applications. The methodology of this approach is to combine the advantages of the polymer and the filler to satisfy the electric, dielectric, mechanical, fabrication, and reliability requirements for embedded capacitors. Restrained by poor adhesion and poor thermal stress reliability at high filler loadings, currently polymer-ceramic composites can only achieve a dielectric constant of less than 50. In order to increase the dielectric constant to above 50, effects of high-kappa polymer matrix, bimodal fillers, and dispersing agent are systematically investigated. Surface functionalization of nanofiller particles and modification of epoxy matrix with a secondary rubberized epoxy to form sea-island structure are proposed to enhance the dielectric constant, adhesion and high-temperature thermal stress reliability of high-kappa composites. To obtain photodefinable high-kappa composites, fundamental understanding of the photopolymerization of the novel epoxy-ceramic composite photoresist is addressed. While the properties of high-kappa composites largely depend on the polymer matrix, the fillers can also drastically affect the material properties. Carbon black- and carbon nanotubes-filled ultrahigh-kappa polymer composites are investigated as the candidate materials for embedded capacitors. Dielectric composites based on percolation typically show a high dielectric constant, and a

  3. Printed circuit board impedance matching step for microwave (millimeter wave) devices

    DOEpatents

    Pao, Hsueh-Yuan; Aguirre, Jerardo; Sargis, Paul

    2013-10-01

    An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.

  4. Fluid Power Multi-actuator Circuit Board with Microcomputer Control Option.

    ERIC Educational Resources Information Center

    McKechnie, R. E.; Vickers, G. W.

    1981-01-01

    Describes a portable fluid power engineering laboratory and class demonstration apparatus designed to enable students to design, build, and test multi-actuator circuits. Features a variety of standard pneumatic values and actuators fitted with quick disconnect couplings. Discusses sequencing circuit boards, microcomputer control, cost, and…

  5. Problem-Solving at a Circuit-Board Assembly Machine: A Microanalysis.

    ERIC Educational Resources Information Center

    Kleifgen, Jo Anne; Frenz-Belken, Patricia

    A study described machine operators' problem-solving actions at a computerized circuit-board assembly machine in a small manufacturing plant located on the West Coast. Participants were a machine operator and his supervisor, both from Vietnam, who were building large prototype boards for a major computer corporation. Over a 6.5 minute interval,…

  6. Novel waste printed circuit board recycling process with molten salt

    PubMed Central

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450–470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl–KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. • The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept. • This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L. • The treated PCBs can be removed via leg B while the process is on-going. PMID:26150977

  7. Waste printed circuit board recycling techniques and product utilization.

    PubMed

    Hadi, Pejman; Xu, Meng; Lin, Carol S K; Hui, Chi-Wai; McKay, Gordon

    2015-01-01

    E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly "recycling" has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined. PMID:25285997

  8. Novel waste printed circuit board recycling process with molten salt.

    PubMed

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450-470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl-KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. •The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept.•This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L.•The treated PCBs can be removed via leg B while the process is on-going. PMID:26150977

  9. New testing equipment for SMT PC boards

    NASA Astrophysics Data System (ADS)

    Balme, Louis; Mignotte, Anne; Monari, Jean-Yves; Pondaven, Patrick; Vaucher, Christophe

    1988-06-01

    The problems created by surface mounted technology (SMT) in the field of printed circuit board (PCB) testing are addressed. A device for testing the new surface mounting boards which allows for a resolution of 0.1 mm is presented. The device is able to detect and identify opens and shorts on both sides of the PCB, simultaneously, in a few seconds with 4,000 non-multiplexed test points per side. Details of the software and hardware involved in making the testing device are outlined. The device has CAD/CAM links, a PCB defect display and a high system integration (reliablility).

  10. Electro-optical circuit board with single-mode glass waveguide optical interconnects

    NASA Astrophysics Data System (ADS)

    Brusberg, Lars; Neitz, Marcel; Pernthaler, Dominik; Weber, Daniel; Sirbu, Bogdan; Herbst, Christian; Frey, Christopher; Queisser, Marco; Wöhrmann, Markus; Manessis, Dionysios; Schild, Beatrice; Oppermann, Hermann; Eichhammer, Yann; Schröder, Henning; Hâkansson, Andreas; Tekin, Tolga

    2016-03-01

    A glass optical waveguide process has been developed for fabrication of electro-optical circuit boards (EOCB). Very thin glass panels with planar integrated single-mode waveguides can be embedded as a core layer in printed circuit boards for high-speed board-level chip-to-chip and board-to-board optical interconnects over an optical backplane. Such singlemode EOCBs will be needed in upcoming high performance computers and data storage network environments in case single-mode operating silicon photonic ICs generate high-bandwidth signals [1]. The paper will describe some project results of the ongoing PhoxTroT project, in which a development of glass based single-mode on-board and board-to-board interconnection platform is successfully in progress. The optical design comprises a 500 μm thin glass panel (Schott D263Teco) with purely optical layers for single-mode glass waveguides. The board size is accommodated to the mask size limitations of the fabrication (200 mm wafer level process, being later transferred also to larger panel size). Our concept consists of directly assembling of silicon photonic ICs on cut-out areas in glass-based optical waveguide panels. A part of the electrical wiring is patterned by thin film technology directly on the glass wafer surface. A coupling element will be assembled on bottom side of the glass-based waveguide panel for 3D coupling between board-level glass waveguides and chip-level silicon waveguides. The laminate has a defined window for direct glass access for assembling of the photonic integrated circuit chip and optical coupling element. The paper describes the design, fabrication and characterization of glass-based electro-optical circuit board with format of (228 x 305) mm2.

  11. Compact fluid cooled power converter supporting multiple circuit boards

    DOEpatents

    Radosevich, Lawrence D.; Meyer, Andreas A.; Beihoff, Bruce C.; Kannenberg, Daniel G.

    2005-03-08

    A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

  12. Machine vision system for the industrial quality control of printed circuit boards

    NASA Astrophysics Data System (ADS)

    Esteve-Taboada, José J.; Pastor, Begoña; Goñi, Ignacio; García, Ramón; Hervas, Juan; Molina-Jiménez, Teresa; Simón, Santiago; Pérez, Emilio

    2005-09-01

    In this paper we present an automatic system for the on-line quality control of printed circuit boards. A line-scan camera permits the acquisition of a 550 mm wide image with a resolution up to 70 microns/pixel. The system detects the following type of errors: cuts and short circuits in tracks, stains, ink excess or faults, pores, omissions, "bites" and track narrowing. The input for the system are just the Gerber data files corresponding to the circuit to be analyzed. All the tolerances and precision factors can be modified directly from the user-friendly interface. For each analyzed board, the type of error detected and its location inside the circuit are indicated in the interface. For each set of analyzed circuits the system provides information for statistical control of the results.

  13. All-semiconductor metamaterial-based optical circuit board at the microscale

    SciTech Connect

    Min, Li; Huang, Lirong

    2015-07-07

    The newly introduced metamaterial-based optical circuit, an analogue of electronic circuit, is becoming a forefront topic in the fields of electronics, optics, plasmonics, and metamaterials. However, metals, as the commonly used plasmonic elements in an optical circuit, suffer from large losses at the visible and infrared wavelengths. We propose here a low-loss, all-semiconductor metamaterial-based optical circuit board at the microscale by using interleaved intrinsic GaAs and doped GaAs, and present the detailed design process for various lumped optical circuit elements, including lumped optical inductors, optical capacitors, optical conductors, and optical insulators. By properly combining these optical circuit elements and arranging anisotropic optical connectors, we obtain a subwavelength optical filter, which can always hold band-stop filtering function for various polarization states of the incident electromagnetic wave. All-semiconductor optical circuits may provide a new opportunity in developing low-power and ultrafast components and devices for optical information processing.

  14. Thermal analysis and design of air cooled electronic circuit boards using a desktop computer

    NASA Astrophysics Data System (ADS)

    Foltz, R. A.

    1980-06-01

    A thermal design procedure for air cooled electronic circuit boards has been developed for the Hewlett-Packard Model 9845 desktop computer. The system of interactive programs, called THERMELEX, performs thermal analysis of printed circuit boards to predict either junction temperatures for given power dissipation levels or the maximum power levels for given junction temperature limits. The system includes the following features: totally interactive with all input in question and answer format; simple data verification and correction capabilities; ability to store and retrieve circuit board descriptive data totally under program control; and wide variety of output formats including tabular and graphical. By using internal selection of heat transfer correlations, the THERMELEX system depends only on input of physical parameters for thermal predictions.

  15. Novel application of the nonmetallic fraction of the recycled printed circuit boards as a toxic heavy metal adsorbent.

    PubMed

    Hadi, Pejman; Gao, Ping; Barford, John P; McKay, Gordon

    2013-05-15

    Printed circuit boards (PCBs) constitute one of the major sources of toxicity in landfill areas throughout the world. Hence, PCB recycling and separation of its metallic and nonmetallic components has been considered a major ecological breakthrough. Many studies focus on the metallic fraction of the PCBs due to its economic benefits whereas the nonmetallic powder (NMP) has been left isolated. In this work, the feasibility of using NMP as an adsorbent to remove charged toxic heavy metal ions have been studied and its efficiency has been compared with two widely-used commercial adsorbents. The results indicated that the virgin NMP material has no adsorption capacity, while the application of an activation stage to modify the NMP process has a significant effect on its porosity and thus adsorption capacity. The Cu and Pb removal capacity of the activated sample (A-NMP) at a pH level of 4 was 3 mmol and 3.4 mmol per gram of the adsorbent, respectively, which was considerably higher than the commercial ones. PMID:23523907

  16. A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board.

    PubMed

    Jiang, Wu; Jia, Li; Zhen-Ming, Xu

    2009-01-15

    The electrostatic separation is an effective method for recycling waste electrical and electronic equipment (WEEE). The efficiency of electrostatic separation processes depends on the ability of the separator. As a classical one, the roll-type corona-electrostatic separator has some advantages in recycling metals and plastics from waste printed circuit board (PCB). However, its industry application still faces some problems, such as: the further disposal of the middling products of the separation process; the balance of the production capacity and the good separation efficiency; the separation of the fine granular mixture and the stability of the separation process. A new "two-roll-type corona-electrostatic separator" was built to overcome the limitation of the classical one. The experimental data were discussed and the results showed that the outcome of the separation process was improved by using the new separator. Compared with the classical machine, the mass of conductive products increases 8.9% (groups 2 and 3) and10.2% (group 4) while the mass of the middling products decreases 45% (groups 2 and 3) and 31.7% (group 4), respectively. The production capacity of the new machine increases, and the stability of the separation process is enhanced. PMID:18554788

  17. Critical rotational speed model of the rotating roll electrode in corona electrostatic separation for recycling waste printed circuit boards.

    PubMed

    Li, Jia; Lu, Hongzhou; Xu, Zhenming; Zhou, Yaohe

    2008-06-15

    Waste printed circuit board (PCB) is increasing worldwide. The corona electrostatic separation (CES) was an effective and environmental protection way to recycle resource from waste PCBs. The aim of this paper is to analyze the main factor (rotational speed) that affects the efficiency of CES from the point of view of electrostatics and mechanics. A quantitative method for analyzing the affection of rotational speed was studied and the model for separating flat nonmetal particles in waste PCBs was established. The conception of "charging critical rotational speed" and "detaching critical rotational speed" were presented. Experiments with the waste PCBs verified the theoretical model, and the experimental results were in good agreement with the theoretical model. The results indicated that the purity and recycle percentage of materials got a good level when the rotational speed was about 70 rpm and the critical rotational speed of small particles was higher than big particles. The model can guide the definition of operator parameter and the design of CES, which are needed for the development of any new application of the electrostatic separation method. PMID:18037234

  18. Identification and chemical characterization of particulate matter from wave soldering processes at a printed circuit board manufacturing company.

    PubMed

    Szoboszlai, Z; Kertész, Zs; Szikszai, Z; Angyal, A; Furu, E; Török, Zs; Daróczi, L; Kiss, A Z

    2012-02-15

    In this case study, the elemental composition and mass size distribution of indoor aerosol particles were determined in a working environment where soldering of printed circuit boards (PCB) took place. Single particle analysis using ion and electron microscopy was carried out to obtain more detailed and reliable data about the origin of these particles. As a result, outdoor and indoor aerosol sources such as wave soldering, fluxing processes, workers' activity, mineral dust, biomass burning, fertilizing and other anthropogenic sources could be separated. With the help of scanning electron microscopy, characteristic particle types were identified. On the basis of the mass size distribution data, a stochastic lung deposition model was used to calculate the total and regional deposition efficiencies of the different types of particles within the human respiratory system. The information presented in this study aims to give insights into the detailed characteristics and the health impact of aerosol particles in a working environment where different kinds of soldering activity take place. PMID:22226723

  19. Printed circuit board for a CCD camera head

    DOEpatents

    Conder, Alan D.

    2002-01-01

    A charge-coupled device (CCD) camera head which can replace film for digital imaging of visible light, ultraviolet radiation, and soft to penetrating x-rays, such as within a target chamber where laser produced plasmas are studied. The camera head is small, capable of operating both in and out of a vacuum environment, and is versatile. The CCD camera head uses PC boards with an internal heat sink connected to the chassis for heat dissipation, which allows for close (0.04" for example) stacking of the PC boards. Integration of this CCD camera head into existing instrumentation provides a substantial enhancement of diagnostic capabilities for studying high energy density plasmas, for a variety of military industrial, and medical imaging applications.

  20. Analytical modeling of multi-layered Printed Circuit Board dedicated to electronic component thermal characterization

    NASA Astrophysics Data System (ADS)

    Monier-Vinard, Eric; Laraqi, Najib; Dia, Cheikh-Tidiane; Nguyen, Minh-Nhat; Bissuel, Valentin

    2015-01-01

    Electronic components are continuously getting smaller and embedding more and more powered functions which exacerbate the temperature rise in component/board interconnect areas. For still air conditions, the heat spreading of the component power is mainly done through the surrounding metallic planes of its electronic board. Their design optimization is henceforth mandatory to control the temperature and to preserve component reliability. To allow the electronic designer to early analyze the limits of the power dissipation of miniaturized devices, an analytical model of a multi-layered electronic board was established with the purpose to assess the validity of conventional board modeling approach. For decades, numerous authors have been promoting a homogenous single layer model that summed up the layers of the board using effective orthotropic thermal properties. The derived compact model depends on thermal properties approximation which is commonly based on parallel conduction model given a linear rule of mixture. The work presents the thermal behavior comparison of a detailed multi-layer representation to its deducted compact model for an extensive set of variable parameters, such as heat transfer coefficients, effective thermal conductivities calculation models, number of trace layers, trace coverage or source size. The results highlight the fact that the conventional practices for PCB modeling can dramatically underestimate source temperatures when their size is getting very small.

  1. Designing High Speed Printed Circuit Boards Using DxDesigner and Expedition

    NASA Technical Reports Server (NTRS)

    Navarro, Robert

    2007-01-01

    Mentor's DxDesigner and Expedition schematic capture and printed circuit board tools were chosen to implement a custom high speed signal processing board containing many high pin count Field Programmable Gate Arrays and many high speed serial connections with data rates over 2 Gigasamples/sec. The methodology used to place the parts and route the board involved the interaction of both the DxDesigner and Expedition tools. The basic design philosophy was to specify as much as possible through design constraints at the schematic level. This paper will explore implementing that philosophy in both tools to facilitate part placement and trace routing.

  2. A filter circuit board for the Earthworm Seismic Data Acquisition System

    USGS Publications Warehouse

    Jensen, Edward Gray

    2000-01-01

    The Earthworm system is a seismic network data acquisition and processing system used by the Northern California Seismic Network as well as many other seismic networks. The input to the system is comprised of many realtime electronic waveforms fed to a multi-channel digitizer on a PC platform. The digitizer consists of one or more National Instruments Corp. AMUX–64T multiplexer boards attached to an A/D converter board located in the computer. Originally, passive filters were installed on the multiplexers to eliminate electronic noise picked up in cabling. It was later discovered that a small amount of crosstalk occurred between successive channels in the digitizing sequence. Though small, this crosstalk will cause what appear to be small earthquake arrivals at the wrong time on some channels. This can result in erroneous calculation of earthquake arrival times, particularly by automated algorithms. To deal with this problem, an Earthworm filter board was developed to provide the needed filtering while eliminating crosstalk. This report describes the tests performed to find a suitable solution, and the design of the circuit board. Also included are all the details needed to build and install this board in an Earthworm system or any other system using the AMUX–64T board. Available below is the report in PDF format as well as an archive file containing the circuit board manufacturing information.

  3. Laser ablated coupling structures for optical printed circuit boards

    NASA Astrophysics Data System (ADS)

    Van Steenberge, Geert; Geerinck, Peter; Riester, Markus; Pongratz, Siegfried; Van Daele, Peter

    2005-09-01

    We report on the cost effective fabrication of 45° micromirror couplers within single-mode polymer waveguides for achieving fully embedded board-level optoelectronic interconnections. Compatibility with existing board manufacturing technology is achieved by making use of polymers with high thermal stability. The sol-gel polymers behave as negative photo resist and waveguides are patterned by UV exposure. Micromirrors are fabricated using excimer laser ablation, a very flexible technology that is particularly well suited for structuring of polymers because of their excellent UV-absorption properties and highly non-thermal ablation behavior. A coupling structure based on total internal reflection (TIR) is enhanced by developing a process for embedding a metal coated 45° mirror in the optical layers. The mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation. Surface roughness of both the mirrors and the upper cladding surface above the mirrors is investigated using a non-contact optical profiler. Initial loss measurements at 1.3 μm show a propagation loss of 0.62 dB/cm and an excess mirror loss of 1.55 dB. During most recent experiments mirror roughness has been reduced from 160 nm to 20 nm, which will seriously reduce the mirror loss.

  4. An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

    ERIC Educational Resources Information Center

    Seth, Anupam

    2009-01-01

    Production planning and scheduling for printed circuit, board assembly has so far defied standard operations research approaches due to the size and complexity of the underlying problems, resulting in unexploited automation flexibility. In this thesis, the increasingly popular collect-and-place machine configuration is studied and the assembly…

  5. Compressed Air System Enhancement Increase Efficiency and Provides Energy Savings at a Circuit Board Manufacturer

    SciTech Connect

    2001-06-01

    This case study is one in a series on industrial firms who are implementing energy efficient technologies and system improvements into their manufacturing processes. This case study documents the activities, savings, and lessons learned on the circuit board manufacturer (Sanmina Plant) project.

  6. Circuit Board Analysis for Lead by Atomic Absorption Spectroscopy in a Course for Nonscience Majors

    ERIC Educational Resources Information Center

    Weidenhammer, Jeffrey D.

    2007-01-01

    A circuit board analysis of the atomic absorption spectroscopy, which is used to measure lead content in a course for nonscience majors, is being presented. The experiment can also be used to explain the potential environmental hazards of unsafe disposal of various used electronic equipments.

  7. Pollution prevention assessment for a printed circuit board plant. Environmental research brief

    SciTech Connect

    Edwards, H.W.; Kostrzewa, M.F.; Looby, G.P.

    1995-09-01

    The WMAC team at Colorado State University performed an assessment at a plant that manufactures printed circuit boards. The team`s report, detailing findings and recommendations, indicated that the onsite ion-exchange treatment of metal-containing rinse water generates regenerant solutions that could be further treated by electrowinning to recover metals and to achieve significant cost savings.

  8. Development of a semi-automated workcell for repair of printed circuit boards

    SciTech Connect

    Bennett, D.W.; Evans, M.S.

    1990-08-01

    Printed circuit boards that comprise US Army electronic systems are repaired at Army depots. An existing automated diagnostic system determines the area of failure; either by identifying failed components or failed board traces. Currently, repairs are performed manually by trained technicians. A system is being developed for repair of through-hole printed circuit boards. It is comprised of many automated and operator-assisted functions to perform the multiple operations related to replacement of failed components. When completed, this system will demonstrate economic payback by reducing skilled labor requirements and decreasing rework. The semi-automated system integrates human operators into the process while maintaining high productivity. After several fully automated systems were conceived and modelled, it was found that the configuration that provided the best return on investment was comprised of a mix of autonomous and operator-assisted functions. 1 ref., 1 fig.

  9. Circuit board accident--organizational dimension hidden by prescribed safety.

    PubMed

    de Almeida, Ildeberto Muniz; Buoso, Eduardo; do Amaral Dias, Maria Dionísia; Vilela, Rodolfo Andrade Gouveia

    2012-01-01

    This study analyzes an accident in which two maintenance workers suffered severe burns while replacing a circuit breaker panel in a steel mill, following model of analysis and prevention of accidents (MAPA) developed with the objective of enlarging the perimeter of interventions and contributing to deconstruction of blame attribution practices. The study was based on materials produced by a health service team in an in-depth analysis of the accident. The analysis shows that decisions related to system modernization were taken without considering their implications in maintenance scheduling and creating conflicts of priorities and of interests between production and safety; and also reveals that the lack of a systemic perspective in safety management was its principal failure. To explain the accident as merely non-fulfillment of idealized formal safety rules feeds practices of blame attribution supported by alibi norms and inhibits possible prevention. In contrast, accident analyses undertaken in worker health surveillance services show potential to reveal origins of these events incubated in the history of the system ignored in practices guided by the traditional paradigm. PMID:22317212

  10. Design and implementation of a high power rf oscillator on a printed circuit board for multipole ion guides

    NASA Astrophysics Data System (ADS)

    Mathur, Raman; O'Connor, Peter B.

    2006-11-01

    Radio frequency (rf) oscillators are commonly used to drive electrodes of ion guides. In this article a rf oscillator circuit design and its implementation is presented. The printed circuit board for the rf oscillator is designed and fabricated. The performance of the circuit was tested to transfer ions through a hexapole in a matrix-assisted laser desorption/ionization Fourier transform mass spectrometer. A comprehensive discussion of several aspects of printed circuit board design for high power and high frequency circuits is presented.

  11. PERSONAL COMPUTER MONITORS: A SCREENING EVALUATION OF VOLATILE ORGANIC EMISSIONS FROM EXISTING PRINTED CIRCUIT BOARD LAMINATES AND POTENTIAL POLLUTION PREVENTION ALTERNATIVES

    EPA Science Inventory

    The report gives results of a screening evaluation of volatile organic emissions from printed circuit board laminates and potential pollution prevention alternatives. In the evaluation, printed circuit board laminates, without circuitry, commonly found in personal computer (PC) m...

  12. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition.

    PubMed

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  13. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition

    NASA Astrophysics Data System (ADS)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  14. PCB Drill Path Optimization by Combinatorial Cuckoo Search Algorithm

    PubMed Central

    Lim, Wei Chen Esmonde; Kanagaraj, G.; Ponnambalam, S. G.

    2014-01-01

    Optimization of drill path can lead to significant reduction in machining time which directly improves productivity of manufacturing systems. In a batch production of a large number of items to be drilled such as printed circuit boards (PCB), the travel time of the drilling device is a significant portion of the overall manufacturing process. To increase PCB manufacturing productivity and to reduce production costs, a good option is to minimize the drill path route using an optimization algorithm. This paper reports a combinatorial cuckoo search algorithm for solving drill path optimization problem. The performance of the proposed algorithm is tested and verified with three case studies from the literature. The computational experience conducted in this research indicates that the proposed algorithm is capable of efficiently finding the optimal path for PCB holes drilling process. PMID:24707198

  15. PCB drill path optimization by combinatorial cuckoo search algorithm.

    PubMed

    Lim, Wei Chen Esmonde; Kanagaraj, G; Ponnambalam, S G

    2014-01-01

    Optimization of drill path can lead to significant reduction in machining time which directly improves productivity of manufacturing systems. In a batch production of a large number of items to be drilled such as printed circuit boards (PCB), the travel time of the drilling device is a significant portion of the overall manufacturing process. To increase PCB manufacturing productivity and to reduce production costs, a good option is to minimize the drill path route using an optimization algorithm. This paper reports a combinatorial cuckoo search algorithm for solving drill path optimization problem. The performance of the proposed algorithm is tested and verified with three case studies from the literature. The computational experience conducted in this research indicates that the proposed algorithm is capable of efficiently finding the optimal path for PCB holes drilling process. PMID:24707198

  16. PCB with fully integrated optical interconnects

    NASA Astrophysics Data System (ADS)

    Langer, Gregor; Satzinger, Valentin; Schmidt, Volker; Schmid, Gerhard; Leeb, Walter R.

    2011-01-01

    The increasing demand for miniaturization and design flexibility of polymer optical waveguides integrated into electrical printed circuit boards (PCB) calls for new coupling and integration concepts. We report on a method that allows the coupling of optical waveguides to electro-optical components as well as the integration of an entire optical link into the PCB. The electro-optical devices such as lasers and photodiodes are assembled on the PCB and then embedded in an optically transparent material. A focused femtosecond laser beam stimulates a polymerization reaction based on a two-photon absorption effect in the optical material and locally increases the refractive index of the material. In this way waveguide cores can be realized and the embedded components can be connected optically. This approach does not only allow a precise alignment of the waveguide end faces to the components but also offers a truly 3-dimensional routing capability of the waveguides. Using this technology we were able to realize butt-coupling and mirror-coupling interface solutions in several demonstrators. We were also manufacturing demonstrator boards with fully integrated driver and preamplifier chips, which show very low power consumption of down to 10 mW for about 2.5 Gbit/s. Furthermore, demonstrators with interconnects at two different optical layers were realized.

  17. An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

    PubMed

    Wang, Chen; Zhao, Wu; Wang, Jie; Chen, Ling; Luo, Chun-Jing

    2016-06-01

    The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling. PMID:27067430

  18. The application of a polypyrrole precoat for the metallization of printed circuit boards

    SciTech Connect

    Gottesfeld, S.; Uribe, F.A.; Armes, P. )

    1992-01-01

    This paper describes a printed circuit board metallization process starting with the formation of a percent of polypyrrole (PPY) on the board, followed by the direct electrodeposition of copper onto the polypyrrole-coated substrate. The polypyrrole film is applied to the insulating substrate by a single chemical polymerization step from an aqueous solution. The sheet resistance of the polypyrrole precoat is typically of the order of a few hundred {Omega}/{open square} which is a sufficiently low resistance to enable direct metal electrodeposition onto the PPY-coated substrate.

  19. Volatile organic compounds and metal leaching from composite products made from fiberglass-resin portion of printed circuit board waste.

    PubMed

    Guo, Jie; Jiang, Ying; Hu, Xiaofang; Xu, Zhenming

    2012-01-17

    This study focused on the volatile organic compounds (VOCs) and metal leaching from three kinds of composite products made from fiberglass-resin portion (FRP) of crushed printed circuit board (PCB) waste, including phenolic molding compound (PMC), wood plastic composite (WPC), and nonmetallic plate (NMP). Released VOCs from the composite products were quantified by air sampling on adsorbent followed by thermal desorption and GC-MS analysis. The results showed that VOCs emitted from composite products originated from the added organic components during manufacturing process. Phenol in PMC panels came primarily from phenolic resin, and the airborne concentration of phenol emitted from PMC product was 59.4 ± 6.1 μg/m(3), which was lower than odor threshold of 100% response for phenol (180 μg/m(3)). VOCs from WPC product mainly originated from wood flour, e.g., benzaldehyde, octanal, and d-limonene were emitted in relatively low concentrations. For VOCs emitted from NMP product, the airborne concentration of styrene was the highest (633 ± 67 μg/m(3)). Leaching characteristics of metal ions from composite products were tested using acetic acid buffer solution and sulphuric acid and nitric acid solution. Then the metal concentrations in the leachates were tested by ICP-AES. The results showed that only the concentration of Cu (average = 893 mg/L; limit = 100 mg/L) in the leachate solution of the FRP using acetic acid buffer solution exceeded the standard limit. However, concentrations of other metal ions (Pb, Cd, Cr, Ba, and Ni) were within the standard limit. All the results indicated that the FRP in composite products was not a major concern in terms of environmental assessment based upon VOCs tests and leaching characteristics. PMID:22142243

  20. A Formal Algorithm for Routing Traces on a Printed Circuit Board

    NASA Technical Reports Server (NTRS)

    Hedgley, David R., Jr.

    1996-01-01

    This paper addresses the classical problem of printed circuit board routing: that is, the problem of automatic routing by a computer other than by brute force that causes the execution time to grow exponentially as a function of the complexity. Most of the present solutions are either inexpensive but not efficient and fast, or efficient and fast but very costly. Many solutions are proprietary, so not much is written or known about the actual algorithms upon which these solutions are based. This paper presents a formal algorithm for routing traces on a print- ed circuit board. The solution presented is very fast and efficient and for the first time speaks to the question eloquently by way of symbolic statements.

  1. [Selective recovery of copper, zinc and nickel from printed circuit boards by ammonia leaching under pressure].

    PubMed

    Wang, Meng; Cao, Hong-Bin; Zhang, Yi

    2011-02-01

    The ammonia/ammonium leaching process using oxygen as oxidant in autoclave was studied to extract copper, zinc and nickel from printed circuit board. Parameters such as leaching time, concentration of leaching reagents, stirring speed, oxygen pressure and temperature were optimized. The best results were achieved when the leaching was carried out at 55 degrees C for 150 minutes, using 4 mol/L NH4OH and 1 mol/L (NH4)2CO3 as leaching solution, with 700 r/min stirring speed and 0.2 MPa oxygen. With this method, Zn, Cu and Ni could be effectively recovered from printed circuit boards by 100%, more than 99% and more than 64%, respectively. The kinetics of Cu leaching behavior was studied and it was found that the shrinking core model described it well. It was a diffusion control process and the apparent activation energy was 14.68 kJ/mol. PMID:21528589

  2. Differential microfluidic sensor on printed circuit board for biological cells analysis.

    PubMed

    Shi, Dongyuan; Guo, Jinhong; Chen, Liang; Xia, Chuncheng; Yu, Zhefeng; Ai, Ye; Li, Chang Ming; Kang, Yuejun; Wang, Zhiming

    2015-08-01

    Coulter principal based resistive pulse sensor has been demonstrated as an important platform in biological cell detection and enumeration since several decades ago. Recently, the miniaturized micro-Coulter counter has attracted much attention due to its advantages in point of care diagnostics for on chip detection and enumeration of rare cells, such as circulating tumor cells. In this paper, we present a microfluidic cytometer with differential amplifier based on Coulter principle on a SU-8 coated printed circuit board substrate. The electrical current changes induced by the blockage of the microparticles in the sensing aperture are calibrated by polystyrene particles of standard size. Finally, HeLa cells are used to evaluate the performance of the proposed device for enumeration of biological samples. The proposed cytometer is built upon the cheap and widely available printed circuit board substrate and shows its great potential as personalized healthcare monitor. PMID:25735615

  3. Thermal verification testing of commercial printed-circuit boards for spaceflight

    NASA Technical Reports Server (NTRS)

    Foster, William M., II

    1992-01-01

    A method developed to verify commercial printed-circuit boards for a Shuttle orbital flight is discussed. The test sequence is based on early fault detection, desire to test the final assembly, and integration with other verification testing. A component thermal screening test is performed first to force flaws in design, workmanship, parts, processes, and materials into observable failures. Temperature definition and vibration tests are performed next. Final assembly testing is performed to simulate the Shuttle flight. An abbreviated thermal screening test is performed as a check after the vibration test, and then a complete thermal operational test is performed. The final assembly test finishes up with a burn-in of 100 h of trouble-free operation. Verification is successful when all components and final assemblies have passed each test. This method was very successful in verifying that commercial printed-circuit boards will survive in the Shuttle environment.

  4. Design and implementation of a multi-sensor robot system for printed circuit board insertion

    NASA Technical Reports Server (NTRS)

    Sood, Deepak; Repko, Michael C.; Kelley, Robert B.

    1989-01-01

    The design and implementation of a robot system equipped with multiple sensors are described. The robotic assembly system couples the task sequence of the robot with information from different sensors, enabling the system to handle uncertainties encountered during task execution. The target task involves the insertion of a printed circuit board into a card cage. The sensors used are an overhead three-dimensional vision system, a fingertip cross-fire sensor, and a 6-DOF force/torque sensor. The vision system is used to locate the printed circuit boards and the insertion slots. Information provided by the cross-fire sensor is used to complement the information from the vision system in order to obtain a proper grasping location on the printed circuit board. A fuzzy-logic-based system is used to interpret the forces and torques generated by the force/torque sensor during the insertion process. The repeated success of this assembly task over many experimental trials verifies the modeling and controller assumptions.

  5. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

    SciTech Connect

    Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-chun Kim, Wonbaek

    2009-03-15

    Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to <10 mm were milled using a stamp mill to liberate the various metallic components, and then the milled printed circuit boards were classified into fractions of <0.6, 0.6-1.2, 1.2-2.5, 2.5-5.0, and >5.0 mm. The fractions of milled printed circuit boards of size <5.0 mm were separated into a light fraction of mostly non-metallic components and a heavy fraction of the metallic components by gravity separation using a zig-zag classifier. The >5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards.

  6. Surface and Electrical Characterization of Ag/AgCl Pseudo-Reference Electrodes Manufactured with Commercially Available PCB Technologies

    PubMed Central

    Moschou, Despina; Trantidou, Tatiana; Regoutz, Anna; Carta, Daniela; Morgan, Hywel; Prodromakis, Themistoklis

    2015-01-01

    Lab-on-Chip is a technology that could potentially revolutionize medical Point-of-Care diagnostics. Considerable research effort is focused towards innovating production technologies that will make commercial upscaling financially viable. Printed circuit board manufacturing techniques offer several prospects in this field. Here, we present a novel approach to manufacturing Printed Circuit Board (PCB)-based Ag/AgCl reference electrodes, an essential component of biosensors. Our prototypes were characterized both structurally and electrically. Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS) were employed to evaluate the electrode surface characteristics. Electrical characterization was performed to determine stability and pH dependency. Finally, we demonstrate utilization along with PCB pH sensors, as a step towards a fully integrated PCB platform, comparing performance with discrete commercial reference electrodes. PMID:26213940

  7. Comparison between conventional and laser method of imaging tracks on PCB

    NASA Astrophysics Data System (ADS)

    Barbucha, R.; Kocik, M.; Mizeraczyk, J.; Kozioł, G.; Borecki, J.

    2007-02-01

    The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges. LDI is a process of imaging electric circuits directly on PCB without the use of a phototool or mask. The exposure of the photo-sensitive resist is carried out using a laser beam that is scanned across photoresist surface and switched on and off by means of a computer control system according to the electrical circuit pattern. Usually the laser used in the LDI generates a UV line, which is suitable to the commonly available photoresists. Our laboratory system for Laser Direct Imaging is designed for tracks and spaces on PCB with minimum width distance of 50/50 μm. In comparison with conventional photolithography method, this technology is much better for 50/50 μm track and spaces. In our research we used photoresist with resolution 50 μm, but in case of using laser photoresists with better resolution (e.g. 25 μm) it will be possible to image tracks in super-fine-line technology (25/25 μm). The comparison between two technology of creating mosaic pattern tracks on PCB proved that laser imaging is promising technology in high density interconnects patterns, which are widely use in multilayered PCB and similar applications.

  8. Assembling surface mounted components on ink-jet printed double sided paper circuit board.

    PubMed

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. PMID:24521824

  9. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    NASA Astrophysics Data System (ADS)

    Andersson, Henrik A.; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  10. Initial Corrosion Behavior and Mechanism of PCB-HASL in Typical Outdoor Environments in China

    NASA Astrophysics Data System (ADS)

    Ding, Kangkang; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Yi, Pan; Li, Xiaogang

    2015-11-01

    A long-term (1, 3, and 6 months) outdoor exposure test was performed for lead-free hot air solder leveling printed circuit boards (PCB-HASL) in typical environments in China and the corrosion behavior and mechanism of outdoor PCB-HASL were investigated. In a dry environment PCB-HASL corroded slightly, because of the protective effect of surface oxide films. Corrosion spread from places where dust particles were deposited or mold spores were adsorbed. Under the combined effects of humidity and contamination, large amounts of granular corrosion products with a loose structure were generated, greatly reducing the protective effect of the Sn layer. Furthermore, protection of the edges of the plates was poor, and corrosion products from these regions migrated rapidly on the FR-4 board. When a 12 V electrical bias was applied, Sn and Cu migrated simultaneously. In the electrochemical migration process the effect of humidity was much more critical than that of contamination.

  11. Polymer multimode waveguide optical and electronic PCB manufacturing

    NASA Astrophysics Data System (ADS)

    Selviah, David R.

    2009-02-01

    The paper describes the research in the Â#1.3 million IeMRC Integrated Optical and Electronic Interconnect PCB Manufacturing (OPCB) Flagship Project in which 8 companies and 3 universities carry out collaborative research and which was formed and is technically led by the author. The consortium's research is aimed at investigating a range of fabrication techniques, some established and some novel, for fabricating polymer multimode waveguides from several polymers, some formulations of which are being developed within the project. The challenge is to develop low cost waveguide manufacturing techniques compatible with commercial PCB manufacturing and to reduce their alignment cost. The project aims to take the first steps in making this hybrid optical waveguide and electrical copper track printed circuit board disruptive technology widely available by establishing and incorporating waveguide design rules into commercial PCB layout software and transferring the technology for fabricating such boards to a commercial PCB manufacturer. To focus the research the project is designing an optical waveguide backplane to tight realistic constraints, using commercial layout software with the new optical design rules, for a demonstrator into which 4 daughter cards are plugged, each carrying an aggregate of 80 Gb/s data so that each waveguide carries 10 Gb/s.

  12. Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures.

    PubMed

    Chiang, Hung-Lung; Lin, Kuo-Hsiung; Lai, Mei-Hsiu; Chen, Ting-Chien; Ma, Sen-Yi

    2007-10-01

    A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 degrees C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards

  13. Recovery of copper from printed circuit boards scraps by mechanical processing and electrometallurgy.

    PubMed

    Veit, Hugo Marcelo; Bernardes, Andréa Moura; Ferreira, Jane Zoppas; Tenório, Jorge Alberto Soares; de Fraga Malfatti, Célia

    2006-10-11

    The constant growth in generation of solid wastes stimulates studies of recycling processes. The electronic scrap is part of this universe of obsolete and/or defective materials that need to be disposed of more appropriately, or then recycled. In this work, printed circuit boards, that are part of electronic scrap and are found in almost all electro-electronic equipments, were studied. Printed circuit boards were collected in obsolete or defective personal computers that are the largest source of this kind of waste. Printed circuit boards are composed of different materials such as polymers, ceramics and metals, which makes the process more difficult. However, the presence of metals, such as copper and precious metals encourage recycling studies. Also the presence of heavy metals, as Pb and Cd turns this scrap into dangerous residues. This demonstrates the need to search for solutions of this kind of residue, in order to have it disposed in a proper way, without harming the environment. At the first stage of this work, mechanical processing was used, as comminution followed by size, magnetic and electrostatic separation. By this process it was possible to obtain a concentrated fraction in metals (mainly Cu, Pb and Sn) and another fraction containing polymers and ceramics. The copper content reached more than 50% in mass in most of the conductive fractions and significant content of Pb and Sn. At the second stage, the fraction concentrated in metals was dissolved with acids and treated in an electrochemical process in order to recover the metals separately, especially copper. The results demonstrate the technical viability of recovering copper using mechanical processing followed by an electrometallurgical technique. The copper content in solution decayed quickly in all the experiments and the copper obtained by electrowinning is above 98% in most of the tests. PMID:16757116

  14. Recovery Act: High-Temperature Circuit Boards for use in Geothermal Well Monitoring Applications

    SciTech Connect

    Hooker, Matthew; Fabian, Paul

    2013-05-01

    The U.S. Department of Energy is leading the development of alternative energy sources that will ensure the long-term energy independence of our nation. One of the key renewable resources currently being advanced is geothermal energy. To tap into the large potential offered by generating power from the heat of the earth, and for geothermal energy to be more widely used, it will be necessary to drill deeper wells to reach the hot, dry rock located up to 10 km beneath the earth’s surface. In this instance, water will be introduced into the well to create a geothermal reservoir. A geothermal well produced in this manner is referred to as an enhanced geothermal system (EGS). EGS reservoirs are typically at depths of 3 to 10 km, and the temperatures at these depths have become a limiting factor in the application of existing downhole technologies. These high temperatures are especially problematic for electronic systems such as downhole data-logging tools, which are used to map and characterize the fractures and high-permeability regions in underground formations. Information provided by these tools is assessed so that underground formations capable of providing geothermal energy can be identified, and the subsequent drilling operations can be accurately directed to those locations. The mapping of geothermal resources involves the design and fabrication of sensor packages, including the electronic control modules, to quantify downhole conditions (300°C temperature, high pressure, seismic activity, etc.). Because of the extreme depths at which these measurements are performed, it is most desirable to perform the sensor signal processing downhole and then transmit the information to the surface. This approach necessitates the use of high-temperature electronics that can operate in the downhole environment. Downhole signal processing in EGS wells will require the development and demonstration of circuit boards that can withstand the elevated temperatures found at these

  15. Estimation of Operating Condition of Appliances Using Circuit Current Data on Electric Distribution Boards

    NASA Astrophysics Data System (ADS)

    Iwafune, Yumiko; Ogimoto, Kazuhiko; Yagita, Yoshie

    The Energy management systems (EMS) on demand sides are expected as a method to enhance the capability of supply and demand balancing of a power system under the anticipated penetration of renewable energy generation such as Photovoltaics (PV). Elucidation of energy consumption structure in a building is one of important elements for realization of EMS and contributes to the extraction of potential energy saving. In this paper, we propose the estimation method of operating condition of household appliances using circuit current data on an electric distribution board. Circuit current data are broken down by their shape using a self-organization map method and aggregated by appliance based on customers' information of appliance possessed. Proposed method is verified using residential energy consumption measurement survey data.

  16. Recovery of gold from computer circuit board scrap using aqua regia.

    PubMed

    Sheng, Peter P; Etsell, Thomas H

    2007-08-01

    Computer circuit board scrap was first treated with one part concentrated nitric acid and two parts water at 70 degrees C for 1 h. This step dissolved the base metals, thereby liberating the chips from the boards. After solid-liquid separation, the chips, intermixed with some metallic flakes and tin oxide precipitate, were mechanically crushed to liberate the base and precious metals contained within the protective plastic or ceramic chip cases. The base metals in this crushed product were dissolved by leaching again with the same type of nitric acid-water solution. The remaining solid constituents, crushed chips and resin, plus solid particles of gold, were leached with aqua regia at various times and temperatures. Gold was precipitated from the leachate with ferrous sulphate. PMID:17874665

  17. Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology.

    PubMed

    Estrada-Ruiz, R H; Flores-Campos, R; Gámez-Altamirano, H A; Velarde-Sánchez, E J

    2016-07-01

    The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained. PMID:26963241

  18. Waste-minimization assessment for a manufacturer of printed-circuit boards. Environmental research brief

    SciTech Connect

    Kirsch, F.W.; Looby, G.P.

    1991-07-01

    The U.S. Environmental Protection Agency (EPA) has funded a pilot project to assist small- and medium-size manufacturers who want to minimize their generation of hazardous waste but who lack the expertise to do so. Waste Minimization Assessment Centers (WMACs) were established at selected universities and procedures were adapted from the EPA Waste Minimization Opportunity Assessment Manual (EPA/625/7-88/003, July 1988). The WMAC team at Colorado State University inspected a plant producing printed circuit boards -- a plant that already had taken steps to control its hazardous wastes. Producing a circuit board involves many major processes and subprocesses: preparing the board; depositing copper on the board by electroless plating; applying dry film; electrolytically plating copper; electrolytically plating tin; etching and stripping; applying solder; and, perhaps, plating gold on connectors. Each of these steps produces hazardous wastes, e.g., electrolytic copper plating results in acid soap dumps, copper and tin drag-out, and sulfuric acid. The main sources of metallic contamination (copper (both dissolved and metallic), tin, lead, gold) are the rinses after scrubbing, plating, and etching. Although the greatest amount of waste can be reduced by reusing effluent from the MEMTEK (with some further treatment), the greatest dollar savings can be found by changing the dry film developer. The present brand adheres strongly to the unexposed film and requires an aggressive acid soap; a less aggressive, nonhazardous soap could be used with a less-adhering dry film developer. The Research Brief was developed by the principal investigators and EPA's Risk Reduction Engineering Laboratory, Cincinnati, OH, to announce key findings of an ongoing research project that is fully documented in a separate report of the same title available from the authors.

  19. Nonlinear electromagnetic energy harvesters fabricated by rigid-flex printed circuit board technology

    NASA Astrophysics Data System (ADS)

    Chiu, Yi; Hong, Hao-Chiao; Hsu, Wei-Hung

    2015-12-01

    In this paper, a wideband electromagnetic energy harvester designed and fabricated by commercial rigid-flex PCB technology is demonstrated. The rigid FR-4 boards are used for mechanical frames and coil winding whereas the flexible polyimide film is used for mechanical springs and mass platforms. The total dimension of the device is 20 × 20 × 2 mm3. The internal coil resistance is 15 Ω. In vibration tests, nonlinearity can be observed even at 0.1 g vibration level due to the spring hardening effect. The peak frequency was increased as the vibration level increased. The effective bandwidth was increased from 6 Hz at 0.1 g to 21 Hz at 0.5 g and 27 Hz at 1 g, respectivel, due to the hysteresis effect. For a matched load and 1 g vibration at 240 Hz, the maximum output power is 24.5 nW, corresponding to a power density of 31 nW/cm3.

  20. Selective recovery of palladium from waste printed circuit boards by a novel non-acid process.

    PubMed

    Zhang, Zhiyuan; Zhang, Fu-Shen

    2014-08-30

    An environmental benign, non-acid process was successfully developed for selective recovery of palladium from waste printed circuit boards (PCBs). In the process, palladium was firstly enriched during copper recovery procedure and dissolved in a special solution made of CuSO4 and NaCl. The dissolved palladium was then extracted by diisoamyl sulfide (S201). It was found that 99.4% of Pd(II) could be extracted from the solution under the optimum conditions (10% S201, A/O ratio 5 and 2min extraction). In the whole extraction process, the influence of base metals was negligible due to the relatively weak nucleophilic substitution of S201 with base metal irons and the strong steric hindrance of S201 molecular. Around 99.5% of the extracted Pd(II) could be stripped from S201/dodecane with 0.1mol/L NH3 after a two-stage stripping at A/O ratio of 1. The total recovery percentage of palladium was 96.9% during the dissolution-extraction-stripping process. Therefore, this study established a benign and effective process for selective recovery of palladium from waste printed circuit boards. PMID:25037000

  1. Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards.

    PubMed

    Li, Qiao; Tao, Xiao Ming

    2014-11-01

    This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact. PMID:25383032

  2. Mineralogical analysis of dust collected from typical recycling line of waste printed circuit boards.

    PubMed

    Wang, Fangfang; Zhao, Yuemin; Zhang, Tao; Duan, Chenlong; Wang, Lizhang

    2015-09-01

    As dust is one of the byproducts originating in the mechanical recycling process of waste printed circuit boards such as crushing and separating, from the viewpoints of resource reuse and environmental protection, an effective recycling method to recover valuable materials from this kind of dust is in urgent need. In this paper, detailed mineralogical analysis on the dust collected from a typical recycling line of waste printed circuit boards is investigated by coupling several analytical techniques. The results demonstrate that there are 73.1wt.% organic matters, 4.65wt.% Al, 4.55wt.% Fe, 2.67wt.% Cu and 1.06wt.% Pb in the dust, which reveals the dust is worthy of reuse and harmful to environment. The concentration ratios of Fe, Mn and Zn can reach 12.35, 12.33 and 6.67 respectively by magnetic separation. The yield of dust in each size fraction is nonuniform, while the yield of -0.75mm size fraction is up to 51.15wt.%; as the particle size decreases, the content of liberated metals and magnetic materials increase, and metals are mainly in elemental forms. The F, Cl and Br elements combing to C in the dust would make thermal treatment dangerous to the environment. Based on these results, a flowsheet to recycle the dust is proposed. PMID:26117419

  3. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    NASA Astrophysics Data System (ADS)

    Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

    2010-06-01

    Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  4. Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards

    PubMed Central

    Li, Qiao; Tao, Xiao Ming

    2014-01-01

    This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact. PMID:25383032

  5. Immobilization of Acidithiobacillus ferrooxidans on Cotton Gauze for the Bioleaching of Waste Printed Circuit Boards.

    PubMed

    Nie, Hongyan; Zhu, Nengwu; Cao, Yanlan; Xu, Zhiguo; Wu, Pingxiao

    2015-10-01

    The bioleaching parameters of metal concentrates from waste printed circuit boards by Acidithiobacillus ferrooxidans immobilized on cotton gauze in a two-step reactor were investigated in this study. The results indicated that an average ferrous iron oxidation rate of 0.54 g/(L·h) and a ferrous iron oxidation ratio of 96.90 % were obtained after 12 h at aeration rate of 1 L/min in bio-oxidation reactor. After 96 h, the highest leaching efficiency of copper reached 91.68 % under the conditions of the content of the metal powder 12 g/L, the retention time 6 h, and the aeration rate 1 L/min. The bioleaching efficiency of copper could be above 91.12 % under repeated continuous batch operation. Meanwhile, 95.32 % of zinc, 90.32 % of magnesium, 86.31 % of aluminum, and 59.07 % of nickel were extracted after 96 h. All the findings suggested that the recovery of metal concentrates from waste printed circuit boards via immobilization of A. ferrooxidans on cotton gauze was feasible. PMID:26239442

  6. Thermal verification testing of commercial printed-circuit boards for spaceflight

    NASA Technical Reports Server (NTRS)

    Foster, William M., II

    1991-01-01

    A method is discussed developed to verify commercial printed-circuit boards for a shuttle orbital flight. The Space Acceleration Measurement System Project used this method first with great success. The test sequence is based on early fault detection, desire to test the final assembly, and integration with other verification testing. A component thermal screening test is performed first to force flaws in design, workmanship, parts, processes, and materials into observable failures. Then temperature definition tests are performed that consist of infrared scanning, thermal vacuum testing, and preliminary thermal operational testing. Only the engineering unit is used for temperature definition testing, but the preliminary thermal operational testing is performed on the flight unit after the temperature range has been defined. In the sequence of testing, vibration testing is performed next, but most vibration failures cannot be detected without subsequent temperature cycling. Finally, final assembly testing is performed to simulate the shuttle flight. An abbreviated thermal screening test is performed as a check after the vibration test, and then a complete thermal operational test is performed. The final assembly test finishes up with a burn-in of 100 hours of trouble-free operation. Verification is successful when all components and final assemblies have passed each test satisfactory. This method was very successful in verifying that commercial printed-circuit boards will survive in the shuttle environment.

  7. Advanced methods for electromagnetic investigation of PCB/PWB layouts

    NASA Astrophysics Data System (ADS)

    Codreanu, N. D.; Ionescu, C.; Svasta, P.; Golumbeanu, V.

    2007-05-01

    High Density Interconnect (HDI) technology is a way to condense electronic circuits for ruggedness, radiation hardening, and high performance. HDI minimizes the size and weight of electronic products while maximizing their performances. HDI circuits offer new solutions to signal integrity (SI) and electromagnetic compatibility (EMC) concerns, concerns which are expected to grow more and more as rise/fall times continue to drop. Because PCB manufacturers have developed new materials and technological solutions, indispensable at this moment is to perform a deep virtual characterization of structures directly related to HDI. This paper presents investigations and results focused on the main areas of SI and EMC, as noise at PCB level (reflections, and crosstalk), electromagnetic interference (EMI) and on-board interconnection delay. The authors have evaluated various HDI-PCB items and structures using the MoM full-wave electromagnetic simulation method. After modeling and simulation a link to classical circuit simulators was created by extracting RLCG elements and various parameters, which are directly related to the total current along the HDI structures. The paper offers a new way to find the solutions for keeping the integrity of signals and electromagnetic compliance.

  8. EMC in power electronics and PCB design

    NASA Astrophysics Data System (ADS)

    Zhu, Chentian

    This dissertation consists of two parts. Part I is about Electromagnetic Compatibility (EMC) in power electronics and part II is about the Maximum Radiated Electromagnetic Emissions Calculator (MREMC), which is a software tool for EMC in printed circuit board (PCB) design. Switched-mode power converters can be significant sources of electromagnetic fields that interfere with the proper operation of nearby circuits or distant radio receivers. Part I of this dissertation provides comprehensive and organized information on the latest EMC developments in power converters. It describes and evaluates different technologies to ensure that power converters meet electromagnetic compatibility requirements. Chapters 2 and 3 describe EMC noise sources and coupling mechanisms in power converters. Chapter 4 reviews the measurements used to characterize and troubleshoot EMC problems. Chapters 5 -- 8 cover passive filter solutions, active filter solutions, noise cancellation methods and reduced-noise driving schemes. Part II describes the methods used, calculations made, and implementation details of the MREMC, which is a software tool that allows the user to calculate the maximum possible radiated emissions that could occur due to specific source geometries on a PCB. Chapters 9 -- 13 covers the I/O coupling EMI algorithm, Common-mode EMI algorithm, Power Bus EMI algorithm and Differential-Mode EMI algorithm used in the MREMC.

  9. PCB-Based Break-Out Box

    NASA Technical Reports Server (NTRS)

    Lee, Jason H.

    2011-01-01

    Break-out boxes (BOBs) are necessary for all electrical integration/cable checkouts and troubleshooting. Because the price of a BOB is high, and no work can be done without one, often the procedure stops, simply waiting for a BOB. A less expensive BOB would take less time in the integration, testing, and troubleshooting process. The PCB-based BOB works and looks the same as a standard JPL BOB, called Gold Boxes. The only differences between the old BOB and the new PCB-based BOB is that the new one has 80 percent of its circuitry in a printed circuit board. This process reduces the time for fabrication, thus making the BOBs less expensive. Moreover, because of its unique design, the new BOBs can be easily assembled and fixed. About 80 percent of the new PCB-based BOB is in a $22 (at the time of this reporting) custom-designed, yet commercially available PCB. This device has been used successfully to verify that BOB cables were properly made. Also, upon completion, the BOB was beeped out via a multimeter to ensure that all sockets on the connectors were properly connected to the respective banana jack. When compared to the Gold Box BOBs, the new BOB has many advantages. It is much more cost efficient, it delivers equal usability at substantially lower cost of the BOB, and the Gold Box is much heavier when compared to the new BOB. The new BOB is also a bit longer and much more versatile in that connectors are easily changeable and if a banana jack is broken, it can be replaced instead of throwing away an entire BOB.

  10. The high speed low noise multi-data processing signal process circuit research of remote sensing

    NASA Astrophysics Data System (ADS)

    Su, Lei; Jiang, Haibin; Dong, Wang

    2013-08-01

    The high speed, low noise and integration characteristic are the main technology and the main development directions on the signal process circuit of the image sensor, especially in high resolution remote sensing. With these developments, the high noise limiting circuits, high speed data transfer system and the integrated design of the signal process circuit become more and more important. Therefore the requirement of the circuit system simulation is more and more important during the system design and PCB board design process. A CCD signal process circuit system which has the high speed, low noise and several selectable operate modes function was designed and certificated in this paper, during the CCD signal process circuit system design, simulation was made which include the signal integrity and the power integrity. The important devices such as FPGA and the DDR2 device were simulated, using the power integrity simulation the sensitive power planes of the FPGA on the PCB was modified to make the circuit operate more stabilize on a higher frequency. The main clock path and the high speed data path of the PCB board were simulated with the signal integrity. All the simulation works make the signal process circuit system's image's SNR value get higher and make the circuit system could operate well on higher frequency. In the board testing process, the PCB time diagrams were listed on the testing chapter and the wave's parameter meets the request. The real time diagram and the simulated result of the PCB board was listed respectively. The CCD signal process circuit system's images' SNR (Signal Noise Ratio) value, the 14bit AFE slew rate and the data transfer frequency is listed in the paper respective.

  11. Effect of embedded printed circuit board (PCB) sensors on the mechanical behavior of glass fiber-reinforced polymer (GFRP) structures

    NASA Astrophysics Data System (ADS)

    Javdanitehran, M.; Hoffmann, R.; Groh, J.; Vossiek, M.; Ziegmann, G.

    2016-06-01

    The embedding of dielectric chipless sensors for cure monitoring into fiber-reinforced thermosets allows for monitoring and controlling the curing process and consequently higher quality in production. The embedded sensors remain after the processing in the structure. This affects the integrity of the composite structure locally. In order to investigate these effects on the mechanical behavior of the glass fiber-reinforced polymer (GFRP), sensors made on special low loss substrates are integrated into laminates with different lay-ups and thicknesses using vacuum assisted resin transfer molding (VARTM) method. In a parametric study the size of the sensor is varied to observe its influence on the strength and the stiffness of the laminates according to its lay-up and thickness. The size and orientation of the resin rich areas near sensors as well as the distortion in load bearing area as the consequences of the introduction of the sensors are investigated in conjunction with the strength of the structure. An empirical model is proposed by the authors which involves the previously mentioned factors and is used as a rapid tool for the prediction of the changes in bending and tensile strength of simple structures with embedded sensors. The methodology for model’s calibration as well as the validation of the model against the experimental data of different laminates with distinct lay-ups and thicknesses are presented in this work. Mechanical tests under tensile and bending loading indicate that the reduction of the structure’s strength due to sensor integration can be attributed to the size and the orientation of rich resin zones and depends over and above on the size of distorted load bearing area. Depending on the sensor’s elastic modulus the stiffness of the structure may vary through the introduction of a sensor.

  12. Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

    PubMed

    Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

    2008-05-01

    The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees . PMID:17900802

  13. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    SciTech Connect

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S.K.; McKay, Gordon

    2015-01-15

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

  14. Optical waveguides and structures for short haul optical communication channels within printed circuit boards

    NASA Astrophysics Data System (ADS)

    Riegel, Nicholas J.

    Optical waveguides have shown promising results for use within printed circuit boards. These optical waveguides have higher bandwidth than traditional copper transmission systems and are immune to electromagnetic interference. Design parameters for these optical waveguides are needed to ensure an optimal link budget. Modeling and simulation methods are used to determine the optimal design parameters needed in designing the waveguides. As a result, optical structures necessary for incorporating optical waveguides into printed circuit boards are designed and optimized. Embedded siloxane polymer waveguides are investigated for their use in optical printed circuit boards. This material was chosen because it has low absorption, high temperature stability, and can be deposited using common processing techniques. Two sizes of waveguides are investigated, 50 mum multimode and 4 - 9 mum single mode waveguides. A beam propagation method is developed for simulating the multimode and single mode waveguide parameters. The attenuation of simulated multimode waveguides are able to match the attenuation of fabricated waveguides with a root mean square error of 0.192 dB. Using the same process as the multimode waveguides, parameters needed to ensure a low link loss are found for single mode waveguides including maximum size, minimum cladding thickness, minimum waveguide separation, and minimum bend radius. To couple light out-of-plane to a transmitter or receiver, a structure such as a vertical interconnect assembly (VIA) is required. For multimode waveguides the optimal placement of a total internal reflection mirror can be found without prior knowledge of the waveguide length. The optimal placement is found to be either 60 microm or 150 microm away from the end of the waveguide depending on which metric a designer wants to optimize the average output power, the output power variance, or the maximum possible power loss. For single mode waveguides a volume grating coupler is

  15. Infrared Thermography as Applied to Thermal Testing of Power Systems Circuit Boards.

    NASA Astrophysics Data System (ADS)

    Miles, Jonathan James

    All operational electronic equipment dissipates some amount of energy in the form of infrared radiation. Faulty electronic components on a printed circuit board can be categorized as hard (functional) or soft (latent functional). Hard faults are those which are detected during a conventional manufacturing electronic test process. Soft failures, in contrast, are those which are undetectable through conventional testing, but which manifest themselves after a product has been placed into service. Such field defective modules ultimately result in operational failure and subsequently enter a manufacturer's costly repair process. While thermal imaging systems are being used increasingly in the electronic equipment industry as a product-testing tool, applications have primarily been limited to product design or repair processes, with minimal use in a volume manufacturing environment. Use of thermal imaging systems in such an environment has mostly been limited to low-volume products or random screening of high-volume products. Thermal measurements taken in a manufacturing environment are often taken manually, thus defeating their capability of rapid data acquisition and constraining their full potential in a high-volume manufacturing process. Integration of a thermal measurement system with automated testing equipment is essential for optimal use of expensive infrared measurement tools in a high-volume manufacturing environment. However, such a marriage presents problems with respect to both existing manufacturing test processes and infrared measurement techniques. Methods are presented in this dissertation to test automatically for latent faults, those which elude detection during conventional electronic testing, on printed circuit boards. These methods are intended for implementation in a volume manufacturing environment and involve the application of infrared imaging tools. Successful incorporation of infrared testing into existing test processes requires that: PASS

  16. Four-Channel PC/104 MIL-STD-1553 Circuit Board

    NASA Technical Reports Server (NTRS)

    Cox, Gary L.

    2004-01-01

    The mini bus interface card (miniBIC) is the first four-channel electronic circuit board that conforms to MIL-STD-1553 and to the electrical-footprint portion of PC/104. [MIL-STD-1553 is a military standard that encompasses a method of communication and electrical- interface requirements for digital electronic subsystems connected to a data bus. PC/104 is an industry standard for compact, stackable modules that are fully compatible (in architecture, hardware, and software) with personal-computer data- and power-bus circuitry.] Prior to the development of the miniBIC, only one- and two-channel PC/104 MIL-STD-1553 boards were available. To obtain four channels, it was necessary to include at least two boards in a PC/104 stack. In comparison with such a two-board stack, the miniBIC takes up less space, consumes less power, and is more reliable. In addition, the miniBIC includes 32 digital input/output channels. The miniBIC (see figure) contains four MIL-STD-1553B hybrid integrated circuits (ICs), four transformers, a field-programmable gate array (FPGA), and an Industry Standard Architecture (ISA) interface. Each hybrid IC includes a MILSTD-1553 dual transceiver, memory-management circuitry, processor interface logic circuitry, and 64Kx16 bits of shared static random access memory. The memory is used to configure message and data blocks. In addition, 23 16-bit registers are available for (1) configuring the hybrid IC for, and starting it in, various modes of operation; (2) reading the status of the functionality of the hybrid IC; and (3) resetting the hybrid IC to a known state. The miniBIC can operate as a remote terminal, bus controller, or bus monitor. The FPGA provides the chip-select and data-strobe signals needed for operation of the hybrid ICs. The FPGA also receives interruption signals and forwards them to the ISA bus. The ISA interface connects the address, data, and control interfaces of the hybrid ICs to the ISA backplane. Each channel is, in effect, a MIL

  17. Surface Flashover on Epoxy-Resin Printed Circuit Boards in Vacuum under Electron Irradiation

    NASA Astrophysics Data System (ADS)

    Fujii, Haruhisa; Hasegawa, Taketoshi; Osuga, Hiroyuki; Matsui, Katsuaki

    This paper deals with the surface flashover characteristics of dielectric material in vacuum during electron beam irradiation in order to design adequately the conductive patterns on printed circuit boards used inside a spacecraft. The dielectric material, glass-fiber reinforced epoxy resin, and the electrodes printed on it were irradiated with electrons of the energy of 3-10 keV. DC high voltage was applied between the two electrodes during electron irradiation. The voltage was increased stepwise until the surface flashover occurred on the dielectric material. We obtained the results that the surface flashover voltage increased with the insulation distance between the electrodes but electron irradiation made the flashover voltage lower. The flashover voltage characteristics were obtained as parameters of the electrode distance and the energy of the electron beam.

  18. Waste minimization study for a printed circuit board manufacturing facility in Taiwan

    SciTech Connect

    Chiu, Shen-yann; Huang, Hann S.; Peters, R.W.; Tsai, S.Y. ); Tsai, Wen-Tien; Shieh, Shih-Shien; Hsieh, Te-Yuan; Hwang, Li-Shyong ); Liu, Solo; Peng, Chien-Tang ); Wu, Min H. )

    1990-01-01

    This paper presents a demonstration of industrial waste minimization sponsored by the Environmental Protection Administration, Taiwan, Republic of China. Waste reduction opportunities are identified and evaluated for a printed circuit board manufacturing facility in Taiwan. Plant audits were conducted on various processes, such as deburring, alkaline etching, black oxidation, desmearing, electroless copper, and copper and tin/lead plating. Specific areas in which the wastes could be minimized, such as reducing the amount of dragout and rinse water requirements in the plating and etchant lines, and on-site treatment and reuse of spent bath solutions were identified, assessed, and implemented. Jar tests on the wastewater were performed, and the results were used to improve the efficiency of the wastewater treatment plant for removal of heavy metals and reduction of sludge generation. In addition, administrative controls of hazardous wastes designed to reduce associated health and environmental hazards were recommended. 4 figs., 9 tabs.

  19. Bioleaching waste printed circuit boards by Acidithiobacillus ferrooxidans and its kinetics aspect.

    PubMed

    Yang, Yuankun; Chen, Shu; Li, Shicheng; Chen, Mengjun; Chen, Haiyan; Liu, Bijun

    2014-03-10

    In this paper, H(+) consumption and metal recovery, during the process of bioleaching waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans (A. ferrooxidans), were discussed in detail. When the WPCBs concentration was 15g/L, Cu (96.8%), Zn (83.8%), and Al (75.4%) were recovered after 72h by A. ferrooxidans. Experimental results indicated that metal recovery rate was significantly influenced by acid. Based on experimental results, the kinetics of the H(+) consumption and metal recovery on bioleaching WPCBs were represented by reaction kinetic equations. The kinetic of H(+) consumption could be described by the second-order kinetic model. The metal recovery belongs to the second-order model with adding acid, which was changed to the shrinking core model with precipitate production. PMID:24445171

  20. Application of Printed Circuit Board Technology to FT-ICR MS Analyzer Cell Construction and Prototyping

    SciTech Connect

    Leach, Franklin E.; Norheim, Randolph V.; Anderson, Gordon A.; Pasa-Tolic, Ljiljana

    2014-12-01

    Although Fourier transform ion cyclotron resonance mass spectrometry (FT-ICRMS) remains themass spectrometry platform that provides the highest levels of performance for mass accuracy and resolving power, there is room for improvement in analyzer cell design as the ideal quadrupolar trapping potential has yet to be generated for a broadband MS experiment. To this end, analyzer cell designs have improved since the field’s inception, yet few research groups participate in this area because of the high cost of instrumentation efforts. As a step towards reducing this barrier to participation and allowing for more designs to be physically tested, we introduce a method of FT-ICR analyzer cell prototyping utilizing printed circuit boards at modest vacuum conditions. This method allows for inexpensive devices to be readily fabricated and tested over short intervals and should open the field to laboratories lacking or unable to access high performance machine shop facilities because of the required financial investment.

  1. Ductile electroless Ni-P coating onto flexible printed circuit board

    NASA Astrophysics Data System (ADS)

    Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

    2016-03-01

    In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

  2. Application of Printed Circuit Board Technology to FT-ICR MS Analyzer Cell Construction and Prototyping

    NASA Astrophysics Data System (ADS)

    Leach, Franklin E.; Norheim, Randolph; Anderson, Gordon; Pasa-Tolic, Ljiljana

    2014-12-01

    Although Fourier transform ion cyclotron resonance mass spectrometry (FT-ICR MS) remains the mass spectrometry platform that provides the highest levels of performance for mass accuracy and resolving power, there is room for improvement in analyzer cell design as the ideal quadrupolar trapping potential has yet to be generated for a broadband MS experiment. To this end, analyzer cell designs have improved since the field's inception, yet few research groups participate in this area because of the high cost of instrumentation efforts. As a step towards reducing this barrier to participation and allowing for more designs to be physically tested, we introduce a method of FT-ICR analyzer cell prototyping utilizing printed circuit boards at modest vacuum conditions. This method allows for inexpensive devices to be readily fabricated and tested over short intervals and should open the field to laboratories lacking or unable to access high performance machine shop facilities because of the required financial investment.

  3. Prototyping lead-free solders on hand-soldered, through-hole circuit boards

    SciTech Connect

    Vianco, P.T.; Mizik, P.M.

    1993-12-31

    The lead-free solders 96.5Sn-3.5Ag (wt %), 95.5Sn-4.0Cu-0.5Ag, 91. 84Sn-3.33Ag-4.83Bi were used in the assembly of a through-hole circuit board to determine the feasibility of their suitability in hand soldering processes. Prototypes assembled with 63Sn-37Pb solder were manufactured to serve as control units. Implementation of the lead-free alloys were performed with a rosin-based, mildly activated (RMA) flux and a 700{degree}F soldering tip. A procedure was developed to remove the tin-lead finish from the leaded components and replace it with a 100Sn hot dipped coating. Assembly feasibility was demonstrated for all three lead-free solders. Defect counts were greater than observed with the tin-lead control alloy; however, the number of defects diminished with experience gained by the operator. Visual examination of the solder joints indicated satisfactory wetting of both the device leads and circuit board land with no apparent damage to the underlying laminate nor to the device packages. Cross sections of the lead-free solder joints showed that the were more susceptible to void formation within the holes than was the case with the tin-lead solder. Some cracking was observed at the interface between the Sn-Ag-Bi solder and the copper lands; the relatively high strength of this solder and fast cooling rate of the hand assembly process was believed responsible for this defect.

  4. CO2 laser micromachining of optical waveguides for interconnection on circuit boards

    NASA Astrophysics Data System (ADS)

    Zakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Wang, Kai; Selviah, David R.

    2012-12-01

    The introduction of microvia and surface mount technologies into the manufacturing process for printed circuit boards (PCBs) has significantly improved the interconnection density. However, as the speed of signals for data communication on the board approaches and begins to exceed 10 Gb/s, the loss and crosstalk of copper interconnections increase. To resolve these problems, optical interconnections (OI) have been suggested as a viable solution. Literature reports have proved the photochemical nature of excimer laser ablation with its minimal thermal effect, and other ultra-violet lasers are also being investigated for the fabrication of polymer waveguides by laser ablation. In this paper, the authors demonstrate the fabrication of multimode optical polymer waveguides by using infra-red 10.6 μm CO2 laser micromachining to etch acrylate-based photopolymer (Truemode™). CO2 lasers offer a low cost and high speed fabrication route as CO2 lasers can be used to cut through various engineering materials including polymers and metals. The paper characterises the relationship between the laser ablation power, the fabrication speed and the resulting effect on the waveguide optical insertion loss for the first time.

  5. A Novel Transient Fault Current Sensor Based on the PCB Rogowski Coil for Overhead Transmission Lines.

    PubMed

    Liu, Yadong; Xie, Xiaolei; Hu, Yue; Qian, Yong; Sheng, Gehao; Jiang, Xiuchen

    2016-01-01

    The accurate detection of high-frequency transient fault currents in overhead transmission lines is the basis of malfunction detection and diagnosis. This paper proposes a novel differential winding printed circuit board (PCB) Rogowski coil for the detection of transient fault currents in overhead transmission lines. The interference mechanism of the sensor surrounding the overhead transmission line is analyzed and the guideline for the interference elimination is obtained, and then a differential winding printed circuit board (PCB) Rogowski coil is proposed, where the branch and return line of the PCB coil were designed to be strictly symmetrical by using a joining structure of two semi-rings and collinear twisted pair differential windings in each semi-ring. A serial test is conducted, including the frequency response, linearity, and anti-interference performance as well as a comparison with commercial sensors. Results show that a PCB Rogowski coil has good linearity and resistance to various external magnetic field interferences, thus enabling it to be widely applied in fault-current-collecting devices. PMID:27213402

  6. A Novel Transient Fault Current Sensor Based on the PCB Rogowski Coil for Overhead Transmission Lines

    PubMed Central

    Liu, Yadong; Xie, Xiaolei; Hu, Yue; Qian, Yong; Sheng, Gehao; Jiang, Xiuchen

    2016-01-01

    The accurate detection of high-frequency transient fault currents in overhead transmission lines is the basis of malfunction detection and diagnosis. This paper proposes a novel differential winding printed circuit board (PCB) Rogowski coil for the detection of transient fault currents in overhead transmission lines. The interference mechanism of the sensor surrounding the overhead transmission line is analyzed and the guideline for the interference elimination is obtained, and then a differential winding printed circuit board (PCB) Rogowski coil is proposed, where the branch and return line of the PCB coil were designed to be strictly symmetrical by using a joining structure of two semi-rings and collinear twisted pair differential windings in each semi-ring. A serial test is conducted, including the frequency response, linearity, and anti-interference performance as well as a comparison with commercial sensors. Results show that a PCB Rogowski coil has good linearity and resistance to various external magnetic field interferences, thus enabling it to be widely applied in fault-current-collecting devices. PMID:27213402

  7. Long-lasting FR-4 surface hydrophilisation towards commercial PCB passive microfluidics

    NASA Astrophysics Data System (ADS)

    Vasilakis, Nikolaos; Moschou, Despina; Carta, Daniela; Morgan, Hywel; Prodromakis, Themistoklis

    2016-04-01

    Printed circuit boards (PCB) technologies are an attractive system for simple sensing and microfluidic systems. Controlling the surface properties of PCB material is an important part of this technology and to date there has been no study on long-term hydrophilisation stability of these materials. In this work, the effect of different oxygen plasma input power and treatment duration times on the wetting properties of FR-4 surfaces was investigated by sessile droplet contact angle measurements. Super and weakly hydrophilic behaviour was achieved and the retention time of these properties was studied, with the hydrophilic nature being retained for at least 26 days. To demonstrate the applicability of this treatment method, a commercially manufactured microfluidic structure made from a multilayer PCB (3-layer FR-4 stack) was exposed to oxygen plasma at the optimum conditions. The structures could be filled with deionised (DI) water under capillary flow unlike the virgin devices.

  8. Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

    ERIC Educational Resources Information Center

    California State Univ., Sacramento. Dept. of Civil Engineering.

    One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

  9. Separation and recovery of fine particles from waste circuit boards using an inflatable tapered diameter separation bed.

    PubMed

    Duan, Chenlong; Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

    2014-01-01

    Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (-0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5-0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25-0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (-0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution. PMID:25379546

  10. Separation and Recovery of Fine Particles from Waste Circuit Boards Using an Inflatable Tapered Diameter Separation Bed

    PubMed Central

    Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

    2014-01-01

    Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (−0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5–0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25–0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (−0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution. PMID:25379546

  11. A 5 Giga Samples Per Second 8-Bit Analog to Digital Printed Circuit Board for Radio Astronomy

    NASA Astrophysics Data System (ADS)

    Jiang, Homin; Liu, Howard; Guzzino, Kim; Kubo, Derek; Li, Chao-Te; Chang, Ray; Chen, Ming-Tang

    2014-08-01

    We have designed, manufactured, and characterized an 8-bit 5 Giga samples per second (Gsps) ADC printed circuit board assembly (PCBA). An e2v EV8AQ160 ADC chip was used in the design and the board is plug compatible with the field programmable gate array (FPGA) board developed by the Collaboration for Astronomy Signal Processing and Electronics Research (CASPER) community. Astronomical interference fringes were demonstrated across a single baseline pair of antennas using two ADC boards on the Yuan Tseh Lee Array for Microwave Background Anisotropy (AMiBA) telescope. Several radio interferometers are using this board for bandwidth expansion, such as Submillimeter Array; also, several experimental telescopes are building new spectrometers using the same board. The ADC boards were attached directly to the Reconfigurable Open Architecture Computing Hardware (ROACH-2) FPGA board for processing of the digital output signals. This ADC board provides the capability of digitizing radio frequency signals from DC to 2 GHz (3 dB bandwidth), and to an extended bandwidth of 2.5 GHz (5 dB) with derated performance. The following worst-case performance parameters were obtained over 2 GHz: spur free dynamic range (SFDR) of 44 dB, signal-to-noise and distortion (SINAD) of 35 dB, and effective number of bits (ENOB) of 5.5.

  12. Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

    SciTech Connect

    Nair, Aswathi; Raghunandan, Karthik; Yaswant, Vaddi; Sambandan, Sanjiv E-mail: ssanjiv@isu.iisc.ernet.in; Pillai, Sreelal S.

    2015-03-23

    We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route having mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.

  13. Generation of copper rich metallic phases from waste printed circuit boards

    SciTech Connect

    Cayumil, R.; Khanna, R.; Ikram-Ul-Haq, M.; Rajarao, R.; Hill, A.; Sahajwalla, V.

    2014-10-15

    Highlights: • Recycling and material recovery from waste printed circuit boards is very complex. • Thermoset polymers, ceramics and metals are present simultaneously in waste PCBs. • Heat treatment of PCBs was carried out at 1150 °C under inert conditions. • Various metallic phases could be segregated out as copper based metallic droplets. • Carbon and ceramics residues can be further recycled in a range of applications. - Abstract: The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150 °C under argon gas flowing at 1 L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the

  14. Column bioleaching copper and its kinetics of waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans.

    PubMed

    Chen, Shu; Yang, Yuankun; Liu, Congqiang; Dong, Faqin; Liu, Bijun

    2015-12-01

    Application of bioleaching process for metal recovery from electronic waste has received an increasing attention in recent years. In this work, a column bioleaching of copper from waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans has been investigated. After column bioleaching for 28d, the copper recovery reached at 94.8% from the starting materials contained 24.8% copper. Additionally, the concentration of Fe(3+) concentration varied significantly during bioleaching, which inevitably will influence the Cu oxidation, thus bioleaching process. Thus the variation in Fe(3+) concentration should be taken into consideration in the conventional kinetic models of bioleaching process. Experimental results show that the rate of copper dissolution is controlled by external diffusion rather than internal one because of the iron hydrolysis and formation of jarosite precipitates at the surface of the material. The kinetics of column bioleaching WPCBs remains unchanged because the size and morphology of precipitates are unaffected by maintaining the pH of solution at 2.25 level. In bioleaching process, the formation of jarosite precipitate can be prevented by adding dilute sulfuric acid and maintaining an acidic condition of the leaching medium. In such way, the Fe(2)(+)-Fe(3+) cycle process can kept going and create a favorable condition for Cu bioleaching. Our experimental results show that column Cu bioleaching from WPCBs by A. ferrooxidans is promising. PMID:26196406

  15. Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound.

    PubMed

    Guo, Jie; Rao, Qunli; Xu, Zhenming

    2008-05-01

    The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m(2), heat deflection temperature of 175 degrees C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits. PMID:17949900

  16. A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

    PubMed Central

    Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

    2015-01-01

    For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

  17. Study on characteristics of printed circuit board liberation and its crushed products.

    PubMed

    Quan, Cui; Li, Aimin; Gao, Ningbo

    2012-11-01

    Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs. PMID:22956523

  18. A new technology for recycling materials from waste printed circuit boards.

    PubMed

    Zhou, Yihui; Qiu, Keqiang

    2010-03-15

    Waste printed circuit boards (WPCBs) contain lots of valuable resources together with plenty of hazardous materials, which are considered both an attractive secondary resource and an environmental contaminant. In this research, a new process of "centrifugal separation+vacuum pyrolysis" for the combined recovery of solder and organic materials from WPCBs was investigated. The results of centrifugal separation indicated that the separation of solder from WPCBs was complete when WPCBs were heated at 240 degrees C, and the rotating drum was rotated at 1400 rpm for 6 min intermittently. The results of vacuum pyrolysis showed that the type-A of WPCBs without solder pyrolysed to form an average of 69.5 wt% residue, 27.8 wt% oil, and 2.7 wt% gas; and pyrolysis of the type-B of WPCBs without solder led to an average mass balance of 75.7 wt% residue, 20.0 wt% oil, and 4.3 wt% gas. The pyrolysis residues contain various metals, glass fibers and other inorganic materials, which could be recycled for further processing. The pyrolysis oils can be used for fuel or chemical feedstock and the pyrolysis gases can be collected and combusted for the pyrolysis self-sustain. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent the environmental pollution of WPCBs effectively. PMID:19939558

  19. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    SciTech Connect

    ARTAKI,I.; RAY,U.; REJENT,JEROME A.; VIANCO,PAUL T.

    1999-09-01

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  20. An environmentally friendly technology of disassembling electronic components from waste printed circuit boards.

    PubMed

    Wang, Jianbo; Guo, Jie; Xu, Zhenming

    2016-07-01

    Electronic components (ECs) disassembling from waste printed circuit boards (WPCBs) is the first and essential step in WPCBs recycling chain. Over the past decades, primitive methods like simply heating WPCBs on a coal-heated plate to melt solders are dominated in practice, causing serious environmental pollution and also putting a real threat to the human health. In order to solve this problem, in this article, an automatic system in pilot-scale for ECs disassembling from WPCBs is designed, manufactured, and investigated. This system contains two parts: ECs automatic disassembly and off-gas purification. Meanwhile, WPCBs from television (i.e., TV-WPCBs) and personal computer (i.e., PC-WPCBs) are used for disassembling tests, respectively. When the disassembling temperature, rotating speed, and incubation time are 265±5°C, 10rpm, and 8min, respectively, the solder can be completely removed from both TV-WPCBs and PC-WPCBs. No pollutant is discharged from this system. Finally, the disassembling procedures for ECs from both TV-WPCBs and PC-WPCBs are suggested to promote WPCBs disassembling in an environment-friendly way, without threaten the environment and human health. PMID:27026495

  1. A novel dismantling process of waste printed circuit boards using water-soluble ionic liquid.

    PubMed

    Zeng, Xianlai; Li, Jinhui; Xie, Henghua; Liu, Lili

    2013-10-01

    Recycling processes for waste printed circuit boards (WPCBs) have been well established in terms of scientific research and field pilots. However, current dismantling procedures for WPCBs have restricted the recycling process, due to their low efficiency and negative impacts on environmental and human health. This work aimed to seek an environmental-friendly dismantling process through heating with water-soluble ionic liquid to separate electronic components and tin solder from two main types of WPCBs-cathode ray tubes and computer mainframes. The work systematically investigates the influence factors, heating mechanism, and optimal parameters for opening solder connections on WPCBs during the dismantling process, and addresses its environmental performance and economic assessment. The results obtained demonstrate that the optimal temperature, retention time, and turbulence resulting from impeller rotation during the dismantling process, were 250 °C, 12 min, and 45 rpm, respectively. Nearly 90% of the electronic components were separated from the WPCBs under the optimal experimental conditions. This novel process offers the possibility of large industrial-scale operations for separating electronic components and recovering tin solder, and for a more efficient and environmentally sound process for WPCBs recycling. PMID:23910241

  2. Dissolution of brominated epoxy resins by dimethyl sulfoxide to separate waste printed circuit boards.

    PubMed

    Zhu, Ping; Chen, Yan; Wang, Liangyou; Qian, Guangren; Zhang, Wei Jie; Zhou, Ming; Zhou, Jin

    2013-03-19

    Improved methods are required for the recycling of waste printed circuit boards (WPCBs). In this study, WPCBs (1-1.5 cm(2)) were separated into their components using dimethyl sulfoxide (DMSO) at 60 °C for 45 min and a metallographic microscope was used to verify their delamination. An increased incubation time of 210 min yielded a complete separation of WPCBs into their components, and copper foils and glass fibers were obtained. The separation time decreased with increasing temperature. When the WPCB size was increased to 2-3 cm(2), the temperature required for complete separation increased to 90 °C. When the temperature was increased to 135 °C, liquid photo solder resists could be removed from the copper foil surfaces. The DMSO was regenerated by rotary decompression evaporation, and residues were obtained. Fourier transform infrared spectroscopy (FT-IR), thermal analysis, nuclear magnetic resonance, scanning electron microscopy, and energy-dispersive X-ray spectroscopy were used to verify that these residues were brominated epoxy resins. From FT-IR analysis after the dissolution of brominated epoxy resins in DMSO it was deduced that hydrogen bonding may play an important role in the dissolution mechanism. This novel technology offers a method for separating valuable materials and preventing environmental pollution from WPCBs. PMID:23398278

  3. Treatment of waste printed circuit board by green solvent using ionic liquid.

    PubMed

    Zhu, P; Chen, Y; Wang, L Y; Zhou, M

    2012-10-01

    Recycling of waste printed circuit boards (WPCBs) is an important subject not only for the protection of environment but also for the recovery of valuable materials. A feasibility study was conducted to dissolve bromine epoxy resins of WPCBs using ionic liquid (IL) of 1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM(+)][BF(4)(-)] (nonaqueous green solvent) for recovering copper foils and glass fibers. Experimental results indicated that the initial delamination had seen from the cross-section of the WPCBs by mean of metallographic microscope and digital camera when WPCBs were heated in [EMIM(+)][BF(4)(-)] at 240°C for a duration of 30 min. When temperature was increased to 260°C for a duration of 10 min, the bromine epoxy resins of WPCBs were throughout dissolved into [EMIM(+)][BF(4)(-)] and the separations of copper foils and glass fibers from WPCBs were completed. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent the environmental pollution of WPCBs effectively. PMID:22683227

  4. Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

    PubMed

    Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

    2015-07-01

    Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs. PMID:25869844

  5. Thermal analysis of a part of circuit board card by the photothermal deflection technique

    NASA Astrophysics Data System (ADS)

    Dhouib, A.; Yacoubi, N.

    2014-09-01

    Photothermal deflection which is a non-destructive technique is widely used to study defects in materials. However, high spatial resolution and high sensitivity are required to detect them. To validate the theoretical model that we developed in the case, the sample is immersed in a paraffin oil-filled cell and heated with a laser beam of a diameter less than the dimensions of defects and of power 2 mW instead of several 100 mW power frequently used. Our model was tested on a part of a circuit board card having copper strips spaced periodically and embedded in the resin. The experimental curves of amplitude and phase variations according to displacement of the sample are in good agreement with the corresponding theoretical ones; and their coincidence permit us to deduce several parameters such as the width of the copper and resin strips, their thicknesses and their thermal properties. These comparisons allowed also to detect some anomalies in the structure such as inhomogeneity in the width, the shape and the thicknesses of copper and resins strips.

  6. Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal.

    PubMed

    Ortuño, Nuria; Conesa, Juan A; Moltó, Julia; Font, Rafael

    2014-11-15

    The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO2005-TEQ/kg sample, corresponding to the sample with and without metals, respectively. PMID:25173859

  7. A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards.

    PubMed

    Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

    2015-01-01

    For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au(+) and Cu(2+) respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

  8. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

    PubMed

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

    2014-05-30

    The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. PMID:24747374

  9. Diffractive/refractive hybrid f-theta lens for laser drilling of multilayer printed circuit boards

    NASA Astrophysics Data System (ADS)

    Fuse, Keiji; Okada, Takeshi; Ebata, Keiji

    2003-02-01

    A new type of f-theta lens has recently been developed for microvia laser drilling of multilayer printed circuit boards. It employs a diffractive/refractive hybrid lens which has a blazed surface-relief microstructure on an aspheric surface. By introducing that hybrid lens for CO2 laser system, and by stopping the use of germanium that is optically much sensitive to temperature, the f-theta lens that consists of all zinc selenide lenses is obtained with its optical performance stable on temperature. Achromatic properties against the wavelength fluctuations of actual lasers are also achieved. A prototype is fabricated through the development of single point diamond turning of hybrid surfaces. The performance of the lens is first examined by measuring wavefront error with a tunable infrared interferometer. The results show diffraction-limited performance at all conditions, including different temperatures (up to 50°C) and wavelengths. The temperature dependence of the focal length of the lens is also measured and found to be 5 times as insensitive to temperature as that of a conventional one. Laser drilling experiments are performed for a polymide film on copper foil. The result shows good uniformity of hole size and circularity all over the 50×50 mm2 scan field.

  10. Combustion and inorganic bromine emission of waste printed circuit boards in a high temperature furnace

    SciTech Connect

    Ni Mingjiang; Xiao Hanxi; Chi Yong; Yan Jianhua; Buekens, Alfons; Jin Yuqi; Lu Shengyong

    2012-03-15

    Highlights: Black-Right-Pointing-Pointer The combustion efficiency of waste printed circuit boards (PCBs) depends on temperature, excess air factor, and high temperature zone residence time. Temperature has the most significant impact. Under the proposed condition, combustion of waste PCBs alone is quite complete within the furnace. Black-Right-Pointing-Pointer High temperature prompts a more complete bromine release and conversion. When temperature is high enough, 99.9% organobrominated compounds, the potential precursors for brominated dixoins formation, are destroyed efficiently and convert to inorganic bromine in flue gas, as HBr and Br{sub 2}. Black-Right-Pointing-Pointer Temperature has crucial influence over the inhibition of HBr conversion to Br{sub 2}, while the oxygen partial pressure plays a reverse role in the conversion to a very small extent. Increasing temperature will decrease the volume percentage ratio of Br{sub 2}/HBr in flue gas greatly. Black-Right-Pointing-Pointer The thermodynamic equilibrium approach of bromine conversion was investigated. The two forms of inorganic bromine in flue gas substantially reach thermodynamic equilibrium within 0.25 s. Under the proposed operating condition, the reaction of Br transfer and conversion finish. - Abstract: High temperature combustion experiments of waste printed circuit boards (PCBs) were conducted using a lab-scale system featuring a continuously-fed drop tube furnace. Combustion efficiency and the occurrence of inorganic bromine (HBr and Br{sub 2}) were systematically studied by monitoring the main combustion products continuously. The influence of furnace temperature (T) was studied from 800 to 1400 Degree-Sign C, the excess air factor (EAF) was varied from 1.2 to 1.9 and the residence time in the high temperature zone (RT{sub HT}) was set at 0.25, 0.5, or 0.75 s. Combustion efficiency depends on temperature, EAF and RT{sub HT}; temperature has the most significant effect. Conversion of organic

  11. Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards.

    PubMed

    Long, Laishou; Sun, Shuiyu; Zhong, Sheng; Dai, Wencan; Liu, Jingyong; Song, Weifeng

    2010-05-15

    The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 degrees C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB. PMID:20060640

  12. Identification of estrogenic compounds emitted from the combustion of computer printed circuit boards in electronic waste.

    PubMed

    Owens, Clyde V; Lambright, Christy; Bobseine, Kathy; Ryan, Bryce; Gray, L Earl; Gullett, Brian K; Wilson, Vickie S

    2007-12-15

    Rapid changes in technology have brought about a surge in demand for electronic equipment. Many of these products contain brominated flame-retardants (BFRs) as additives to decrease the rate of combustion, raising concerns about their toxicological risk. In our study, emissions from the combustion of computer-printed circuit boards were evaluated in the T47D-KBluc estrogen-responsive cell line at a series of concentrations. There was significant activity from the emission extract when compared to the positive control, 0.1 nM estradiol. After HPLC fractionation, GC/MS identified ten chemicals which included bisphenol A; the brominated derivates mono-, di-, and tribisphenol, triphenyl phosphate, triphenyl phosphine oxide, 4'-bromo-[1,1'-biphenyl]-4-ol,3,5-dibromo-4-hydroxybiphenyl,3,5-dibromo-2-hydroxybiphenyl, and the oxygenated polyaromatic hydrocarbon benzanthrone. Commercially available samples of these ten compounds were tested. The compound 4'-bromo-[1,1'-biphenyl]-4-ol resulted in dose-dependent significant increases for luciferase activity at concentrations ranging from 0.1 to 10 microM in the T47D-KBluc assay. The chemical also demonstrated an affinity for binding to the estrogen receptor (ER) with an IC50 of 2 x 10(-7) M. To determine the uterotrophic activity, three doses (50, 100, and 200 mg/kg/day) of 4'-bromo-[1,1'-biphenyl]-4-ol were administered to adult ovariectomized Long-Evans rats for 3 days. Treatment of the animals with 200 mg/ kg/day showed an increase in uterine weight Hence one new chemical, released by burning of electrical wastes, was identified which displays estrogenic activity both in vitro and in vivo. However, it was about 1000-fold less potent than ethynyl estradiol. PMID:18200886

  13. Fluorescence detection test by black printed circuit board based microfluidic channel for polymerase chain reaction.

    PubMed

    Hwang, Ji-Soo; Kim, Yu-Seop; Song, Hye-Jeong; Kim, Jong-Dae; Park, Chan-Young

    2015-01-01

    This paper proposes the optimal structure of a PCB-based micro PCR chip constructed on a PCB substrate using commercial adhesive tapes and plastic covers. The solder mask of the PCB substrate was coated black, and the area where the reaction chamber is attached was legend printed with white silk to minimize the noise during fluorescence detection. The performance of the PCR and fluorescence detection was compared using 6 types of reaction chambers, each made with different double-sided tapes. Three of the chambers were unsuccessful in completing the PCR. The performance of the other three chambers that successfully amplified DNA was compared using Taqman probe for Chlamydia Trachomatis DNA. The amplified product was illuminated diagonally with a blue LED to excite the product just before imaging, and the LED was turned off when the image was captured to prevent quenching of the probe. The images were taken 10 seconds prior to the last extension step for each cycle using a DSLR camera. The experiments were run as a quartet for each three chambers made with different double-sided tape. The results showed that there were significant difference between the three tapes. PMID:26409548

  14. Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

    NASA Astrophysics Data System (ADS)

    Kim, Youngsoon; Lee, Seyong; Shin, Ji-won; Paik, Kyung-Wook

    2016-06-01

    While solder bumps have been used as the bump structure to form the interconnection during the last few decades, the continuing scaling down of devices has led to a change in the bump structure to Cu-pillar/Sn-Ag micro-bumps. Cu-pillar/Sn-Ag micro-bump interconnections differ from conventional solder bump interconnections in terms of their assembly processing and reliability. A thermo-compression bonding method with pre-applied b-stage non-conductive films has been adopted to form solder joints between Cu pillar/Sn-Ag micro bumps and printed circuit board vehicles, using various pad metal finishes. As a result, various interfacial inter-metallic compounds (IMCs) reactions and stress concentrations occur at the Cu pillar/Sn-Ag micro bumps joints. Therefore, it is necessary to investigate the influence of pad metal finishes on the structural reliability of fine pitch Cu pillar/Sn-Ag micro bumps flip chip packaging. In this study, four different pad surface finishes (Thin Ni ENEPIG, OSP, ENEPIG, ENIG) were evaluated in terms of their interconnection reliability by thermal cycle (T/C) test up to 2000 cycles at temperatures ranging from -55°C to 125°C and high-temperature storage test up to 1000 h at 150°C. The contact resistances of the Cu pillar/Sn-Ag micro bump showed significant differences after the T/C reliability test in the following order: thin Ni ENEPIG > OSP > ENEPIG where the thin Ni ENEPIG pad metal finish provided the best Cu pillar/Sn-Ag micro bump interconnection in terms of bump joint reliability. Various IMCs formed between the bump joint areas can account for the main failure mechanism.

  15. Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

    NASA Astrophysics Data System (ADS)

    Kim, Youngsoon; Lee, Seyong; Shin, Ji-won; Paik, Kyung-Wook

    2016-03-01

    While solder bumps have been used as the bump structure to form the interconnection during the last few decades, the continuing scaling down of devices has led to a change in the bump structure to Cu-pillar/Sn-Ag micro-bumps. Cu-pillar/Sn-Ag micro-bump interconnections differ from conventional solder bump interconnections in terms of their assembly processing and reliability. A thermo-compression bonding method with pre-applied b-stage non-conductive films has been adopted to form solder joints between Cu pillar/Sn-Ag micro bumps and printed circuit board vehicles, using various pad metal finishes. As a result, various interfacial inter-metallic compounds (IMCs) reactions and stress concentrations occur at the Cu pillar/Sn-Ag micro bumps joints. Therefore, it is necessary to investigate the influence of pad metal finishes on the structural reliability of fine pitch Cu pillar/Sn-Ag micro bumps flip chip packaging. In this study, four different pad surface finishes (Thin Ni ENEPIG, OSP, ENEPIG, ENIG) were evaluated in terms of their interconnection reliability by thermal cycle (T/C) test up to 2000 cycles at temperatures ranging from -55°C to 125°C and high-temperature storage test up to 1000 h at 150°C. The contact resistances of the Cu pillar/Sn-Ag micro bump showed significant differences after the T/C reliability test in the following order: thin Ni ENEPIG > OSP > ENEPIG where the thin Ni ENEPIG pad metal finish provided the best Cu pillar/Sn-Ag micro bump interconnection in terms of bump joint reliability. Various IMCs formed between the bump joint areas can account for the main failure mechanism.

  16. Generation of copper rich metallic phases from waste printed circuit boards.

    PubMed

    Cayumil, R; Khanna, R; Ikram-Ul-Haq, M; Rajarao, R; Hill, A; Sahajwalla, V

    2014-10-01

    The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150°C under argon gas flowing at 1L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the metallic phase. The heat treatment temperature was chosen to be above the melting point of copper; molten copper helped to concentrate metallic constituents and their separation from the carbonaceous residue and the slag. Inert atmosphere prevented the re-oxidation of metals and the loss of carbon in the gaseous fraction. Recycling e-waste is expected to lead to enhanced metal recovery, conserving natural resources and providing an environmentally

  17. [Copper recovery from artificial bioleaching lixivium of waste printed circuit boards].

    PubMed

    Cheng, Dan; Zhu, Neng-Wu; Wu, Ping-Xiao; Zou, Ding-Hui; Xing, Yi-Jia

    2014-04-01

    The key step to realize metal recovery from bioleaching solutions is the recovery of copper from bioleaching lixivium of waste printed circuit boards in high-grade form. The influences of cathode material, current density, initial pH and initial copper ion concentration on the efficiency and energy consumption of copper recovery from artificial bioleaching lixivium under condition of constant current were investigated using an electro-deposition approach. The results showed that the larger specific surface area of the cathode material (carbon felt) led to the higher copper recovery efficiency (the recovery efficiencies of the anode and the cathode chambers were 96.56% and 99.25%, respectively) and the smaller the total and unit mass product energy consumption (the total and unit mass product energy consumptions were 0.022 kW x h and 15.71 kW x h x kg(-1), respectively). The copper recovery efficiency and energy consumption increased with the increase of current density. When the current density was 155.56 mA x cm(-2), the highest copper recovery efficiencies in the anode and cathode chambers reached 98.51% and 99.37%, respectively. Accordingly, the highest total and unit mass product energy consumptions were 0.037 kW x h and 24.34 kW x h x kg(-1), respectively. The copper recovery efficiency was also significantly affected by the initial copper ion concentration. The increase of the initial copper ion concentration would lead to faster decrease of copper ion concentration, higher total energy consumption, and lower unit mass product consumption. However, the initial pH had no significant effect on the copper recovery efficiency. Under the optimal conditions (carbon felt for cathode materials, current density of 111.11 mA x cm(-2), initial pH of 2.0, and initial copper ion concentration of 10 g x L(-1)), the copper recovery efficiencies of the anode and cathode chambers were 96.75% and 99.35%, and the total and unit mass product energy consumptions were 0.021 kW x h

  18. Recycling of non-metallic fractions from waste printed circuit boards: a review.

    PubMed

    Guo, Jiuyong; Guo, Jie; Xu, Zhenming

    2009-09-15

    The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

  19. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

    SciTech Connect

    Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

    2014-11-15

    Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

  20. Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

    NASA Astrophysics Data System (ADS)

    Korneeva, Anna; Shaydurov, Vladimir

    2016-08-01

    In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

  1. Graded-index core polymer optical waveguide for high-bandwidth-density optical printed circuit boards: fabrication and characterization

    NASA Astrophysics Data System (ADS)

    Ishigure, Takaaki

    2014-03-01

    We demonstrate that graded-index (GI) core polymer optical waveguides are a promising component realizing highbandwidth- density on-board interconnects. As a method for fabricating GI-circular-core polymer optical waveguides, we introduce the Mosquito method utilizing a microdispenser. The Mosquito method is capable of accurately controlling the core diameter and the inter-core pitch. We also demonstrate that the GI-core polymer waveguides enable remarkably low loss waveguide circuits involving waveguide crossings in a mono layer. We show an alternative technique to realize the low-loss GI-core crossed waveguide: the photo-addressing method which was developed by Sumitomo Bakelite Co., Ltd.

  2. Assessment of gold and silver in assorted mobile phone printed circuit boards (PCBs): Original article.

    PubMed

    Vats, M C; Singh, S K

    2015-11-01

    Demand for gold and silver has been escalating with increasing usage of electronic equipment globally. Around 267.3 MT of gold and 7275 MT of silver are being consumed annually for manufacturing mobile phones, laptops and other electronic equipment. However, only 15% is recuperated from these equipment; the remainder lies in the storage yards or landfills. The waste comprise glass, plastics, wires, batteries, PCBs, metal casing, etc. The PCB is composed of precious metals, which creates immense purpose for recycling and recovery. This paper characterises and assesses the recoverable metallic fraction of gold and silver from PCBs of mobile phones. The methodology is based on dismantling of the mobile handset and subjecting the PCBs to roasting and acid digestion. The digested samples were analysed by atomic absorption spectroscopy and the content of gold and silver in the PCBs was to be found in the range of 0.009-0.017% and 0.25-0.79% by weight respectively. PMID:26112260

  3. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

    PubMed

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

    2015-01-01

    Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. PMID:25445263

  4. The PCB mark

    SciTech Connect

    1994-12-01

    Polychlorinated biphenyls (PCBs) are a class of organic chemicals that had become widely used in industrial applications due to their practical physical and chemical properties. Historical uses of PCBs include dielectric fluids (used in utility transformers, capacitors, etc.), hydraulic fluids, and other applications requiring stable, fire-retardant materials. Due to findings that PCBs may cause adverse health effects and due to their persistence and accumulation in the environment. The Toxic Substances Control Act (TSCA), enacted on October 11, 1976, banned the manufacture of PCBs after 1978 [Section 6(e)]. The first PCB regulations, promulgated at 40 CFR Part 761, were finalized on February 17, 1978. These PCB regulations include requirements specifying disposal methods and marking (labeling) procedures, and controlling PCB use. To assist the Department of Energy (DOE) in its efforts to comply with the TSCA statute and implementing regulations, the Office of Environmental Guidance has prepared the document ``Guidance on the Management of Polychlorinated Biphenyls (PCBs).`` That document explains the requirements specified in the statute and regulations for managing PCBs including PCB use, storage, transport, and disposal. The requirements outlined at 40 CFR 761.40 through 761.45 specify marking requirements for most PCB items (i.e., any PCB Article, PCB Container, PCB Article Container, or PCB Equipment that contains PCBs). Most PCB items require PCB marks, which are defined as a descriptive name, instructions, cautions, or other information applied to PCB Items or other objects subject to these regulations. The marking regulations include requirements for PCB marks on PCB Items, storage areas, and temporary storage areas. This Information Brief supplements the PCB guidance document by responding to common questions concerning marking requirements for PCBs. It is one of a series of Information Briefs pertinent to PCB management issues.

  5. Fabrication and functionalization of PCB gold electrodes suitable for DNA-based electrochemical sensing.

    PubMed

    Salvo, P; Henry, O Y F; Dhaenens, K; Acero Sanchez, J L; Gielen, A; Werne Solnestam, B; Lundeberg, J; O'Sullivan, C K; Vanfleteren, J

    2014-01-01

    The request of high specificity and selectivity sensors suitable for mass production is a constant demand in medical research. For applications in point-of-care diagnostics and therapy, there is a high demand for low cost and rapid sensing platforms. This paper describes the fabrication and functionalization of gold electrodes arrays for the detection of deoxyribonucleic acid (DNA) in printed circuit board (PCB) technology. The process can be implemented to produce efficiently a large number of biosensors. We report an electrolytic plating procedure to fabricate low-density gold microarrays on PCB suitable for electrochemical DNA detection in research fields such as cancer diagnostics or pharmacogenetics, where biosensors are usually targeted to detect a small number of genes. PCB technology allows producing high precision, fast and low cost microelectrodes. The surface of the microarray is functionalized with self-assembled monolayers of mercaptoundodecanoic acid or thiolated DNA. The PCB microarray is tested by cyclic voltammetry in presence of 5 mM of the redox probe K3Fe(CN6) in 0.1 M KCl. The voltammograms prove the correct immobilization of both the alkanethiol systems. The sensor is tested for detecting relevant markers for breast cancer. Results for 5 nM of the target TACSTD1 against the complementary TACSTD1 and non-complementary GRP, MYC, SCGB2A1, SCGB2A2, TOP2A probes show a remarkable detection limit of 0.05 nM and a high specificity. PMID:24948454

  6. Optimization of Cvd Diamond Coating Type on Micro Drills in Pcb Machining

    NASA Astrophysics Data System (ADS)

    Lei, X. L.; He, Y.; Sun, F. H.

    2016-12-01

    The demand for better tools for machining printed circuit boards (PCBs) is increasing due to the extensive usage of these boards in digital electronic products. This paper is aimed at optimizing coating type on micro drills in order to extend their lifetime in PCB machining. First, the tribotests involving micro crystalline diamond (MCD), nano crystalline diamond (NCD) and bare tungsten carbide (WC-Co) against PCBs show that NCD-PCB tribopair exhibits the lowest friction coefficient (0.35) due to the unique nano structure and low surface roughness of NCD films. Thereafter, the dry machining performance of the MCD- and NCD-coated micro drills on PCBs is systematically studied, using diamond-like coating (DLC) and TiAlN-coated micro drills as comparison. The experiments show that the working lives of these micro drills can be ranked as: NCD>TiAlN>DLC>MCD>bare WC-Co. The superior cutting performance of NCD-coated micro drills in terms of the lowest flank wear growth rate, no tool degradation (e.g. chipping, tool tipping) appearance, the best hole quality as well as the lowest feed force may come from the excellent wear resistance, lower friction coefficient against PCB as well as the high adhesive strength on the underneath substrate of NCD films.

  7. Impedance Discontinuity Reduction Between High-Speed Differential Connectors and PCB Interfaces

    NASA Technical Reports Server (NTRS)

    Navidi, Sal; Agdinaoay, Rodell; Walter, Keith

    2013-01-01

    High-speed serial communication (i.e., Gigabit Ethernet) requires differential transmission and controlled impedances. Impedance control is essential throughout cabling, connector, and circuit board construction. An impedance discontinuity arises at the interface of a high-speed quadrax and twinax connectors and the attached printed circuit board (PCB). This discontinuity usually is lower impedance since the relative dielectric constant of the board is higher (i.e., polyimide approx. = 4) than the connector (Teflon approx. = 2.25). The discontinuity can be observed in transmit or receive eye diagrams, and can reduce the effective link margin of serial data networks. High-speed serial data network transmission improvements can be made at the connector-to-board interfaces as well as improving differential via hole impedances. The impedance discontinuity was improved by 10 percent by drilling a 20-mil (approx. = 0.5-mm) hole in between the pin of a differential connector spaced 55 mils (approx. = 1.4 mm) apart as it is attached to the PCB. The effective dielectric constant of the board can be lowered by drilling holes into the board material between the differential lines in a quadrax or twinax connector attachment points. The differential impedance is inversely proportional to the square root of the relative dielectric constant. This increases the differential impedance and thus reduces the above described impedance discontinuity. The differential via hole impedance can also be increased in the same manner. This technique can be extended to multiple smaller drilled holes as well as tapered holes (i.e., big in the middle followed by smaller ones diagonally).

  8. New technology for separating resin powder and fiberglass powder from fiberglass-resin powder of waste printed circuit boards.

    PubMed

    Li, Jia; Gao, Bei; Xu, Zhenming

    2014-05-01

    New recycling technologies have been developed lately to enhance the value of the fiberglass powder-resin powder fraction (FRP) from waste printed circuit boards. The definite aim of the present paper is to present some novel methods that use the image forces for the separation of the resin powder and fiberglass powder generated from FRP during the corona electrostatic separating process. The particle shape charactization and particle trajectory simulation were performed on samples of mixed non-metallic particles. The simulation results pointed out that particles of resin powder and particles of fiberglass powder had different detach trajectories at the conditions of the same size and certain device parameters. An experiment carried out using a corona electrostatic separator validated the possibility of sorting these particles based on the differences in their shape characteristics. The differences in the physical properties of the different types of particles provided the technical basis for the development of electrostatic separation technologies for the recycling industry. PMID:24678800

  9. Enhanced peak power CO2 laser processing of PCB materials

    NASA Astrophysics Data System (ADS)

    Moorhouse, C. J.; Villarreal, F.; Wendland, J. J.; Baker, H. J.; Hall, D. R.; Hand, D. P.

    2005-06-01

    Laser drilling has become a common processing step in the fabrication of printed circuit boards (PCB's). For this work, a recently developed enhanced peak power CO2 laser (~2.5 kW peak power, 200W average) or ultra-super pulse (USP) laser is used to drill alumina and copper coated dielectric laminate materials. The higher peak power and faster response times (than conventional CO2 lasers) produced by the USP laser are used to produce high speed alumina laser scribing and copper coated laminate microvia drilling processes. Alumina is a common PCB material used for applications, where its resistance to mechanical and thermal stresses is required. Here we present a comprehensive study of the melt eject mechanisms and recast formation to optimise the speed and quality of alumina laser scribing. Scribe speeds of up to 320 mms-1 (1.8 times current scribe rate) have been achieved using novel temporal pulse shapes unique to the USP laser. Also presented is the microvia drilling process of copper dielectric laminates, where the multi-level configuration presents different optical and thermal properties complicating their simultaneous laser ablation. In our experiments the USP laser has been used to drill standard thickness copper films (up to 50 μm thick) in a single shot. This investigation concentrates on understanding the mechanisms that determine the dielectric undercut dimensions.

  10. Development of nondestructive testing techniques for plated-through holes in multilayer printed circuit boards

    NASA Technical Reports Server (NTRS)

    Anthony, P. L.; Mcmurtrey, J. E.

    1971-01-01

    The development of a nondestructive test with the capability to interrogate plated-through holes as small as 0.51 millimeters inside diameter is discussed. The system can detect defects such as holes, voids, cracks, and thin spots that reduce the current carrying capability of plates-through interconnects by 20 percent or more. Efforts were directed toward the design and fabrication of magnetic circuitry mutual coupling probes and to evaluate the effectiveness of these devices for detecting in multilayer board plated-through holes.

  11. Infant phantom head circuit board for EEG head phantom and pediatric brain simulation

    NASA Astrophysics Data System (ADS)

    Almohsen, Safa

    The infant's skull differs from an adult skull because of the characteristic features of the human skull during early development. The fontanels and the conductivity of the infant skull influence surface currents, generated by neurons, which underlie electroencephalography (EEG) signals. An electric circuit was built to power a set of simulated neural sources for an infant brain activity simulator. Also, in the simulator, three phantom tissues were created using saline solution plus Agarose gel to mimic the conductivity of each layer in the head [scalp, skull brain]. The conductivity measurement was accomplished by two different techniques: using the four points' measurement technique, and a conductivity meter. Test results showed that the optimized phantom tissues had appropriate conductivities to simulate each tissue layer to fabricate a physical head phantom. In this case, the best results should be achieved by testing the electrical neural circuit with the sample physical model to generate simulated EEG data and use that to solve both the forward and the inverse problems for the purpose of localizing the neural sources in the head phantom.

  12. Rapid prototyping of interfacing microcomponents for printed circuit board-level optical interconnects

    NASA Astrophysics Data System (ADS)

    Van Erps, Jürgen; Vervaeke, Michael; Thienpont, Hugo

    2012-01-01

    One of the important challenges for the deployment of the emerging breed of nanotechnology components is interfacing them with the external world, preferably accomplished with low-cost micro-optical devices. For the fabrication of this kind of micro-optical components, we make use of deep proton writing (DPW) as a generic rapid prototyping technology. DPW consists of bombarding polymer samples with swift protons, which results after chemical processing steps in high quality micro-optical components. The strength of the DPW micro-machining technology is the ability to fabricate monolithic building blocks that include micro-optical and mechanical functionalities which can be precisely integrated into more complex photonic systems. In this paper we give an overview of the process steps of the technology and we present several examples of micro-optical and micro-mechanical components, fabricated through DPW, targeting applications in printed circuit baordlevel optical interconnections. These include: high-precision 2-D fiber connectors, discrete out-of-plane coupling structures featuring high-quality 45° and curved micro-mirrors, arrays of high aspect ratio micro-pillars and backplane connectors. While DPW is clearly not a mass fabrication technique as such, one of its assets is that once the master component has been prototyped, a metal mould can be generated from the DPW master by applying electroplating. After removal of the plastic master, this metal mould can be used as a shim in a final microinjection moulding or hot embossing step. This way, the master component can be mass-produced at low cost in a wide variety of high-tech plastics.

  13. Performance of the heavy fraction of pyrolysis oil derived from waste printed circuit boards in modifying asphalt.

    PubMed

    Yang, Fan; Sun, Shuiyu; Zhong, Sheng; Li, Shenyong; Wang, Yi; Wu, Jiaqi

    2013-09-15

    The focus of this research was the development of efficient and affordable asphalt modifiers. Pyrolysis oil was produced as a byproduct from the pyrolysis of waste printed circuit boards (WPCBs). The high boiling point fraction was separated from the pyrolysis oil through distillation and is referred to as the heavy fraction of pyrolysis oil (HFPO). The HFPO was tested as an asphalt modifier. Three asphalt modifiers were tested: HFPO; styrene-butadiene rubber (SBR); and HFPO + SBR (1:1). The physical properties and road performance of the three modified asphalts were measured and evaluated. The results have shown that when the amount of modifier was less than 10%, the HFPO modified asphalt had the highest softening point of the three. The dynamic stability (DS) and water resistance of the asphalt mixture with the HFPO modified asphalt was 10,161 cycles/mm and 87.2%, respectively. The DS was much larger than for the HFPO + SBR and SBR modified asphalt mixtures. These results indicate that using HFPO as an asphalt modifier has significant benefits not only for road engineering but also for resource recycling. PMID:23644664

  14. An advanced study on the hydrometallurgical processing of waste computer printed circuit boards to extract their valuable content of metals.

    PubMed

    Birloaga, Ionela; Coman, Vasile; Kopacek, Bernd; Vegliò, Francesco

    2014-12-01

    This study refers to two chemical leaching systems for the base and precious metals extraction from waste printed circuit boards (WPCBs); sulfuric acid with hydrogen peroxide have been used for the first group of metals, meantime thiourea with the ferric ion in sulfuric acid medium were employed for the second one. The cementation process with zinc, copper and iron metal powders was attempted for solutions purification. The effects of hydrogen peroxide volume in rapport with sulfuric acid concentration and temperature were evaluated for oxidative leaching process. 2M H2SO4 (98% w/v), 5% H2O2, 25 °C, 1/10 S/L ratio and 200 rpm were founded as optimal conditions for Cu extraction. Thiourea acid leaching process, performed on the solid filtrate obtained after three oxidative leaching steps, was carried out with 20 g/L of CS(NH2)2, 6g/L of Fe(3+), 0.5M H2SO4, The cross-leaching method was applied by reusing of thiourea liquid suspension and immersing 5 g/L of this reagent for each other experiment material of leaching. This procedure has lead to the doubling and, respectively, tripling, of gold and silver concentrations into solution. These results reveal a very efficient, promising and environmental friendly method for WPCBs processing. PMID:25242605

  15. Occurrences and inventories of heavy metals and brominated flame retardants in wastes from printed circuit board production.

    PubMed

    Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

    2014-09-01

    Pollutants including heavy metals and brominated flame retardant were detected in 10 types of production wastes from a typical printed circuit board manufacturing plant, and their inventories were estimated. Rinsing water from etching process had the highest concentrations of copper (665.51 mg/L), lead (1.02 mg/L), nickel (3.60 mg/L), chromium (0.97 mg/L), and tin (1.79 mg/L). Powdered solid waste (SW) from the cut lamination process contained the highest tetrabromobisphenol-A (TBBPA) levels (49.86 mg/kg). Polybrominated diphenyl ethers (PBDEs) were absent in this plant, in agreement with the international regulations of PBDE phase out. The pollutant inventories in the wastes exhibited in the order of copper > > zinc > tin ≈ nickel > lead > chromium > > TBBPA. The potential environmental impact of pollutants in SW during production and disposal were further investigated. A high partitioning of pollutant concentration between the total suspended particle and SW (-0.10 < log K TS < 2.12) was observed for most pollutants, indicating the emission pathway from SW to the airborne atmosphere in the workshop. Although SW met the toxicity characteristic leaching procedure, drilling powder with the smallest particle diameter still showed high leachabilities of lead and tin which may lead to a negative environmental impact during disposal. PMID:24777328

  16. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    SciTech Connect

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  17. Leaching behavior of copper from waste printed circuit boards with Brønsted acidic ionic liquid.

    PubMed

    Huang, Jinxiu; Chen, Mengjun; Chen, Haiyan; Chen, Shu; Sun, Quan

    2014-02-01

    In this work, a Brønsted acidic ionic liquid, 1-butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO4), was used to leach copper from waste printed circuit boards (WPCBs, mounted with electronic components) for the first time, and the leaching behavior of copper was discussed in detail. The results showed that after the pre-treatment, the metal distributions were different with the particle size: Cu, Zn and Al increased with the increasing particle size; while Ni, Sn and Pb were in the contrary. And the particle size has significant influence on copper leaching rate. Copper leaching rate was higher than 99%, almost 100%, when 1g WPCBs powder was leached under the optimum conditions: particle size of 0.1-0.25 mm, 25 mL 80% (v/v) ionic liquid, 10 mL 30% hydrogen peroxide, solid/liquid ratio of 1/25, 70°C and 2h. Copper leaching by [bmim]HSO4 can be modeled with the shrinking core model, controlled by diffusion through a solid product layer, and the kinetic apparent activation energy has been calculated to be 25.36 kJ/mol. PMID:24246577

  18. A long-term static immersion experiment on the leaching behavior of heavy metals from waste printed circuit boards.

    PubMed

    Zhao, Guo-Hua; Luo, Xing-Zhang; Chen, Gui; Zhao, Yong-Jun

    2014-08-01

    Printed circuit boards (PCBs) are the main components of electrical and electronic equipment (EEE). Waste PCBs contain several kinds of heavy metals, including Cu, Pb and Zn. We characterize the leaching of heavy metals (Cu, Pb, Zn and Ni) from waste PCBs in a pH range of 3.0 to 5.6 using a novel approach based on batch pH-static leaching experiments in this work. The results indicate that the leaching behavior of Cu, Pb, Zn and Ni is strongly dependent on pH. Leaching behavior also varies with different pH values and leaching times. The maximum concentrations of Cu, Pb, Zn and Ni in leachate from waste PCBs were 335.00, 17.57, 2.40 and 2.33 mg L(-1), respectively. The highest Pb, Ni, and Cu concentrations leached significantly exceeded the European Union waste-acceptance limit values with respect to inert waste landfills. The leaching of metals follows the shrinking core model with surface reaction control. PMID:24934650

  19. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride).

    PubMed

    Xiu, Fu-Rong; Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang; Zhang, Fu-Shen

    2016-09-01

    In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu2O, CuO, and SnO2 were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu(0)→Cu(+)→Cu(2+)) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu(+) and Cu(2+). After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs. PMID:27179704

  20. Production and characterization of polypropylene composites filled with glass fibre recycled from pyrolysed waste printed circuit boards.

    PubMed

    Li, Shenyong; Sun, Shuiyu; Liang, Haifeng; Zhong, Sheng; Yang, Fan

    2014-01-01

    Waste printed circuit boards (WPCBs) are composed of nearly 70% non-metals, which are generally recycled as low-value filling materials or even directly dumped in landfills. In this study, polypropylene (PP) composites reinforced by recycled pure glass fibres (RGF) from pyrolysed WPCBs were successfully produced. The manufacturing process, mechanical properties and thermal behaviour of the composites were investigated. The results showed that the appropriate addition of RGF in the composites can significantly improve the mechanical properties and thermal behaviour. When the added content of RGF was 30%, the maximum increment of tensile strength, impact strength, flexural strength and flexural modulus of the glass fibre (GF)/PP composites are 25.93%, 41.38%, 31.16% and 68.42%, respectively, and the vicat softening temperature could rise by 4.6°C. Furthermore, leaching of the GF/PP composites was also investigated. The GF/PP composites exhibited high performance and non-toxicity, offering a promising method to recycle RGF from pyrolysed WPCBs with high-value applications. PMID:25176309

  1. Simultaneous recovery of Ni and Cu from computer-printed circuit boards using bioleaching: statistical evaluation and optimization.

    PubMed

    Arshadi, M; Mousavi, S M

    2014-12-01

    Computer printed circuit boards (CPCBs) have a rich metal content and are produced in high volume, making them an important component of electronic waste. The present study used a pure culture of Acidithiobacillus ferrooxidans to leach Cu and Ni from CPCBs waste. The adaptation phase began at 1g/l CPCBs powder with 10% inoculation and final pulp density was reached at 20g/l after about 80d. Four effective factors including initial pH, particle size, pulp density, and initial Fe(3+) concentration were optimized to achieve maximum simultaneous recovery of Cu and Ni. Their interactions were also identified using central composite design in response surface methodology. The suggested optimal conditions were initial pH 3, initial Fe(3+) 8.4g/l, pulp density 20g/l and particle size 95μm. Nearly 100% of Cu and Ni were simultaneously recovered under optimum conditions. Finally, bacterial growth characteristics versus time at optimum conditions were plotted. PMID:25463804

  2. Recycling of organic materials and solder from waste printed circuit boards by vacuum pyrolysis-centrifugation coupling technology.

    PubMed

    Zhou, Yihui; Wu, WenBiao; Qiu, Keqiang

    2011-12-01

    Here, we focused on the recycling of waste printed circuit boards (WPCBs) using vacuum pyrolysis-centrifugation coupling technology (VPCT) aiming to obtain valuable feedstock and resolve environmental pollution. The two types of WPCBs were pyrolysed at 600°C for 30 min under vacuum condition. During the pyrolysis process, the solder of WPCBs was separated and recovered when the temperature range was 400-600°C, and the rotating drum was rotated at 1000 rpm for 10 min. The type-A of WPCBs pyrolysed to form an average of 67.91 wt.% residue, 27.84 wt.% oil, and 4.25 wt.% gas; and pyrolysis of the type-B of WPCBs led to an average mass balance of 72.22 wt.% residue, 21.57 wt.% oil, and 6.21 wt.% gas. The GC-MS and FT-IR analyses showed that the two pyrolysis oils consisted mainly of phenols and substituted phenols. The pyrolysis oil can be used for fuel or chemical feedstock for further processing. The recovered solder can be recycled directly and it can also be a good resource of lead and tin for refining. The pyrolysis residues contained various metals, glass fibers and other inorganic materials, which could be recovered after further treatment. The pyrolysis gases consisted mainly of CO, CO(2), CH(4), and H(2), which could be collected and recycled. PMID:21840196

  3. Inhibition of polybrominated dibenzo-p-dioxin and dibenzofuran formation from the pyrolysis of printed circuit boards.

    PubMed

    Lai, Yi-Chieh; Lee, Wen-Jhy; Li, Hsing-Wang; Wang, Lin-Chi; Chang-Chien, Guo-Ping

    2007-02-01

    Waste printed circuit boards containing brominated flame retardants were pyrolyzed in a high-temperature melting system to observe the formation behaviors of polybrominated dibenzo-p-dioxins (PBDDs) and dibenzofurans (PBDFs). In this study, the results showed that the formation of PBDD/ Fs during pyrolysis can be destroyed under controlled primary combustion conditions. There were two significant factors that influenced the extent of PBDD/F formation. The first factor was temperature. The results showed that, both the total PBDD/F content in the bottom ash and the total PBDD/F emission factor from the flue gas decrease by approximately 50% with an increase of the pyrolysis temperature from 850 to 1200 degrees C. The second factor was the addition of CaO. The possible mechanism involves the reaction between CaO and HBr to form the solid-phase product CaBr2. Thus, the addition of CaO is effective in adsorbing HBr and results in the inhibition of PBDD/F synthesis by more than 90% and further prevents the acid gases (HCl and HBr) that corrode the equipment. In conclusion, due to the persistence and toxicity of PBDD/Fs, a combined regulation for controlling both PCDD/Fs and PBDD/Fs is of great importance for environmental protection issues. PMID:17328209

  4. Novel Application of Glass Fibers Recovered From Waste Printed Circuit Boards as Sound and Thermal Insulation Material

    NASA Astrophysics Data System (ADS)

    Sun, Zhixing; Shen, Zhigang; Ma, Shulin; Zhang, Xiaojing

    2013-10-01

    The aim of this study is to investigate the feasibility of using glass fibers, a recycled material from waste printed circuit boards (WPCB), as sound absorption and thermal insulation material. Glass fibers were obtained through a fluidized-bed recycling process. Acoustic properties of the recovered glass fibers (RGF) were measured and compared with some commercial sound absorbing materials, such as expanded perlite (EP), expanded vermiculite (EV), and commercial glass fiber. Results show that RGF have good sound absorption ability over the whole tested frequency range (100-6400 Hz). The average sound absorption coefficient of RGF is 0.86, which is prior to those of EP (0.81) and EV (0.73). Noise reduction coefficient analysis indicates that the absorption ability of RGF can meet the requirement of II rating for sound absorbing material according to national standard. The thermal insulation results show that RGF has a fair low thermal conductivity (0.046 W/m K), which is comparable to those of some insulation materials (i.e., EV, EP, and rock wool). Besides, an empirical dependence of thermal conductivity on material temperature was determined for RGF. All the results showed that the reuse of RGF for sound and thermal insulation material provided a promising way for recycling WPCB and obtaining high beneficial products.

  5. Direct extraction of palladium and silver from waste printed circuit boards powder by supercritical fluids oxidation-extraction process.

    PubMed

    Liu, Kang; Zhang, Zhiyuan; Zhang, Fu-Shen

    2016-11-15

    The current study was carried out to develop an environmental benign process for direct recovery of palladium (Pd) and silver (Ag) from waste printed circuit boards (PCBs) powder. The process ingeniously combined supercritical water oxidation (SCWO) and supercritical carbon dioxide (Sc-CO2) extraction techniques. SCWO treatment could effectively enrich Pd and Ag by degrading non-metallic component, and a precious metal concentrate (PMC) could be obtained, in which the enrichment factors of Pd and Ag reached 5.3 and 4.8, respectively. In the second stage, more than 93.7% Pd and 96.4% Ag could be extracted from PMC by Sc-CO2 modified with acetone and KI-I2 under optimum conditions. Mechanism study indicated that Pd and Ag extraction by Sc-CO2 was a complicated physiochemical process, involving oxidation, complexation, anion exchange, mass transfer and migration approaches. Accordingly, this study established a benign and effective process for selective recovery of dispersal precious metals from waste materials. PMID:27427888

  6. Electrokinetic recovery of Cd, Cr, As, Ni, Zn and Mn from waste printed circuit boards: effect of assisting agents.

    PubMed

    Xiu, Fu-Rong; Zhang, Fu-Shen

    2009-10-15

    The printed circuit boards (PCBs) contains large number of heavy metal such as Cd, Cr, As, Ni, Zn and Mn. In this study, the use of electrokinetic (EK) treatment with different assisting agents has been investigated to recover the heavy metals from waste PCBs, and the effectiveness of different assisting agents (HNO(3), HCl, citric acid) was evaluated. The PCBs were first pre-treated by supercritical water oxidation (SCWO) process, then subjected to EK process. The heavy metal speciation, migration and recovery efficiency in the presence of different assisting agents during EK process were discussed. The mass loss of Cd, Cr, As and Zn during the SCWO process was negligible, but approximately 52% of Ni and 56% of Mn were lost in such a process. Experimental results showed that different assisting agents have significant effect on the behavior and recovery efficiency of different heavy metals. HCl was highly efficient for the recovery of Cd in waste PCBs due to the low pH and the stable complexation of Cl(-). Citric acid was highly efficient for the recovery of Cr, Zn and Mn. HNO(3) was low efficient for recovery of most heavy metals except for Ni. PMID:19481346

  7. Determination of the potential gold electrowinning from an ammoniacal thiosulphate solution applied to recycling of printed circuit board scraps.

    PubMed

    Kasper, Angela C; Carrillo Abad, Jordi; García Gabaldón, Montserrat; Veit, Hugo M; Pérez Herranz, Valentín

    2016-01-01

    The use of electrochemical techniques in the selective recovery of gold from a solution containing thiosulphate, ammonia, and copper, obtained from the leaching of printed circuit boards from mobile phones using ammoniacal thiosulphate, are shown in this work. First, cyclic voltammetry tests were performed to determine the potential of electrodeposition of gold and copper, and then, electrowinning tests at different potentials for checking the rates of recovery of these metals were performed. The results of the cyclic voltammetry show that copper deposition occurs at potentials more negative than -600 mV (Ag/AgCl), whereas the gold deposition can be performed at potentials more positives than -600 mV (Ag/AgCl). The results of electrowinning show that 99% of the gold present in solutions containing thiosulphate and copper can be selectively recovered in a potential range between -400 mV (vs Ag/AgCl) and -500 mV (vs Ag/AgCl). Furthermore, 99% of copper can be recovered in potentials more negative than -700 mV (vs Ag/AgCl). PMID:26437680

  8. PCB storage requirements

    SciTech Connect

    1994-12-01

    Polychlorinated biphenyls (PCBs) are a class of organic chemicals that had become widely used in industrial applications due to their practical physical and chemical properties. Historical uses of PCBs include dielectric fluids (used in utility transformers, capacitors, etc.), hydraulic fluids, and other applications requiring stable, fire-retardant materials. Due to findings that PCBs may cause adverse health effects and due to their persistence and accumulation in the environment, the Toxic Substances Control Act (TSCA), enacted on october 11, 1976, banned the manufacture of PCBs after 1978 [Section 6(e)]. The first PCB regulations, promulgated at 40 CFR Part 761, were finalized on February 17, 1978. These PCB regulations include requirements specifying disposal methods and marking (labeling) procedures, and controlling PCB use. To assist the Department of Energy (DOE) in its efforts to comply with the TSCA statute and implementing regulations, the Office of Environmental Guidance has prepared the document ``Guidance on the Management of Polychlorinated Biphenyls (PCBs).`` That document explains the requirements specified in the statute and regulations for managing PCBs, including PCB use, storage, transport, and disposal. The requirements specified at 40 CFR Part 761.65 require most PCB wastes to be stored in a facility that meets the specifications of that section. Additionally, the regulations include rules concerning time limits for PCBs and PCB Items in storage, rules concerning leaking electrical equipment, and rules concerning types of containers used to store PCBs and PCB Items. This Information Brief supplements the PCB guidance document by responding to common questions concerning storage requirements for PCBs. It is one of a series of Information Briefs pertinent to PCB management issues.

  9. Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

    PubMed

    Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

    2015-11-01

    In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail. PMID:26143534

  10. Copper sludge from printed circuit board production/recycling for ceramic materials: a quantitative analysis of copper transformation and immobilization.

    PubMed

    Tang, Yuanyuan; Lee, Po-Heng; Shih, Kaimin

    2013-08-01

    The fast development of electronic industries and stringent requirement of recycling waste electronics have produced a large amount of metal-containing waste sludge. This study developed a waste-to-resource strategy to beneficially use such metal-containing sludge from the production and recycling processes of printed circuit board (PCBs). To observe the metal incorporation mechanisms and phase transformation processes, mixtures of copper industrial waste sludge and kaolinite-based materials (kaolinite and mullite) were fired between 650 and 1250 °C for 3 h. The different copper-hosting phases were identified by powder X-ray diffraction (XRD) in the sintered products, and CuAl2O4 was found to be the predominant hosting phase throughout the reactions, regardless of the strong reduction potential of copper expected at high temperatures. The experimental results indicated that CuAl2O4 was generated more easily and in larger quantities at low-temperature processing when using the kaolinite precursor. Maximum copper transformations reached 86% and 97% for kaolinite and mullite systems, respectively, when sintering at 1000 °C. To monitor the stabilization effect after thermal process, prolonged leaching tests were carried out using acetic acid with an initial pH value of 2.9 to leach the sintered products for 20 days. The results demonstrated the decrease of copper leachability with the formation of CuAl2O4, despite different sintering behavior in kaolinite and mullite systems. This study clearly indicates spinel formation as the most crucial metal stabilization mechanism when sintering copper sludge with aluminosilicate materials, and suggests a promising and reliable technique for reusing metal-containing sludge as ceramic materials. PMID:23796110

  11. Temporal and spectral analysis of laser induced plasma in the ablation process of flexible printed circuit board

    NASA Astrophysics Data System (ADS)

    Ryoo, Hoon C.; Kim, Seok; Hahn, Jae W.

    2008-02-01

    Flexible printed circuit board (FPCB), consisting of copper sheets laminated onto non conductive film substrates with multiple structures, are core elements in electronics with their flexibility and capability of high density 3 dimensional wiring characteristics. In laser applied FPCB processing, a better understanding of the ablation mechanism leads to precision control of the depth processing especially by monitoring of the material transition layer. For this purpose, here we investigate the temporal and spectral behavior of the plasma plum generated on the single sided structure of FPCB using the technique of laser induced breakdown spectroscopy (LIBS). Using KrF excimer laser, the characteristic spectral emission lines of C II swan band at the wavelength of 516.5 nm and neutral copper at the wavelength range from 510 nm to 522 nm are acquired under ambient pressure in the ablation process of polyimide film and copper coated layer respectively. From a time delay from 50 ns to 4.05 μs from the beginning of the laser pulse, the temporal profiles of the spectral intensity are obtained in steps of 200 ns, which have a tendency of exponential decrease on both C II and neutral copper. In particular, we concentrate our attention on the temporal intensity behavior of the Bremsstrahlung continuum emission that decides the proper set of detection time window, by which the monitoring sensitivity of LIBS is determined. Finally, using the information of the temporal analysis for each molecular, atomic, and continuum emission, the transition layer between polyimide and copper film is distinguished by their characteristic peak information.

  12. An assessment of alternatives for replacing Freon 113 in bench type electrical circuit board cleaning at Fermi National Accelerator Laboratory

    SciTech Connect

    Isakson, K.; Vessell, A.L.

    1994-07-01

    Fermilab is presently phasing out all solvents containing Freon-113 (CFC-113) as part of the continuing Waste Minimization Program. These solvents are used primarily in cleaning the flux off of electronic circuit boards after soldering, specifically in bench type work. Title VI of the Clean Air Act mandates a production phase-out for ozone depleting substances, like CFC-113, by the year 2000. Our study addresses this issue by evaluating and choosing alternative non-CFC solvents to replace the CFC-1 13 solvents at Fermilab. Several potential non-CFC cleaning solvents were tested. The evaluation took place in three parts: controlled experimental evaluation, chemical composition evaluation, and employee performed evaluation. First, we performed a controlled nine-step procedure with the potential solvents where each was evaluated in categories such as cleaning effectiveness, odor, residue, type of output and drying time. Next, we listed the chemical composition of each solvent. We noted which solvents contained hydrochlorofluorocarbons because they are targeted for phase-out in the future and will be recognized as interim solutions only. Finally, after preliminary testing, five solvents were chosen as the best options. These solvents were sent to be tested by Fermilab employees who use such materials. Their opinions are valuable not only because they are knowledgeable in this field, but also because they will be using the solvents chosen to replace the CFC-113 solvents. The results favored two ``best alternatives``: Safezone Solvent Flux Remover by Miller-Stephenson and E-Series CFC Free Flux-Off 2000 by Chemtech. Another possible solution also pursued is the no-clean solder option. In our study, we were not able to thoroughly investigate the many types of no-clean solders because of time and financial constraints. The testing that was done, however, showed that no-clean solder was a viable alternative in many cases.

  13. Leaching behavior of copper from waste printed circuit boards with Brønsted acidic ionic liquid

    SciTech Connect

    Huang, Jinxiu; Chen, Mengjun Chen, Haiyan; Chen, Shu; Sun, Quan

    2014-02-15

    Highlights: • A Brønsted acidic ILs was used to leach Cu from WPCBs for the first time. • The particle size of WPCBs has significant influence on Cu leaching rate. • Cu leaching rate was higher than 99% under the optimum leaching conditions. • The leaching process can be modeled with shrinking core model, and the E{sub a} was 25.36 kJ/mol. - Abstract: In this work, a Brønsted acidic ionic liquid, 1-butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO{sub 4}), was used to leach copper from waste printed circuit boards (WPCBs, mounted with electronic components) for the first time, and the leaching behavior of copper was discussed in detail. The results showed that after the pre-treatment, the metal distributions were different with the particle size: Cu, Zn and Al increased with the increasing particle size; while Ni, Sn and Pb were in the contrary. And the particle size has significant influence on copper leaching rate. Copper leaching rate was higher than 99%, almost 100%, when 1 g WPCBs powder was leached under the optimum conditions: particle size of 0.1–0.25 mm, 25 mL 80% (v/v) ionic liquid, 10 mL 30% hydrogen peroxide, solid/liquid ratio of 1/25, 70 °C and 2 h. Copper leaching by [bmim]HSO{sub 4} can be modeled with the shrinking core model, controlled by diffusion through a solid product layer, and the kinetic apparent activation energy has been calculated to be 25.36 kJ/mol.

  14. Using the Fuzzy DEMATEL to Determine Environmental Performance: A Case of Printed Circuit Board Industry in Taiwan

    PubMed Central

    Tsai, Sang-Bing; Chien, Min-Fang; Xue, Youzhi; Li, Lei; Jiang, Xiaodong; Chen, Quan; Zhou, Jie; Wang, Lei

    2015-01-01

    The method by which high-technology product manufacturers balance profits and environmental performance is of crucial concern for governments and enterprises. To examine the environmental performance of manufacturers, the present study applied Fuzzy-DEMATEL model to examine environmental performance of the PCB industry in Taiwan. Fuzzy theory was employed to examine the environmental performance criteria of manufacturers and analyse fuzzy linguistics. The fuzzy-DEMATEL model was then employed to assess the direction and level of interaction between environmental performance criteria. The core environmental performance criteria which were critical for enhancing environmental performance of the PCB industry in Taiwan were identified and presented. The present study revealed that green design (a1), green material procurement (a2), and energy consumption (b3) constitute crucial reason criteria, the core criteria influencing other criteria, and the driving factors for resolving problems. PMID:26052710

  15. Using the Fuzzy DEMATEL to Determine Environmental Performance: A Case of Printed Circuit Board Industry in Taiwan.

    PubMed

    Tsai, Sang-Bing; Chien, Min-Fang; Xue, Youzhi; Li, Lei; Jiang, Xiaodong; Chen, Quan; Zhou, Jie; Wang, Lei

    2015-01-01

    The method by which high-technology product manufacturers balance profits and environmental performance is of crucial concern for governments and enterprises. To examine the environmental performance of manufacturers, the present study applied Fuzzy-DEMATEL model to examine environmental performance of the PCB industry in Taiwan. Fuzzy theory was employed to examine the environmental performance criteria of manufacturers and analyse fuzzy linguistics. The fuzzy-DEMATEL model was then employed to assess the direction and level of interaction between environmental performance criteria. The core environmental performance criteria which were critical for enhancing environmental performance of the PCB industry in Taiwan were identified and presented. The present study revealed that green design (a1), green material procurement (a2), and energy consumption (b3) constitute crucial reason criteria, the core criteria influencing other criteria, and the driving factors for resolving problems. PMID:26052710

  16. Interface between a printed circuit board computer aided design tool (Tektronix 4051 based) and a numerical paper tape controlled drill press (Slo-Syn 530: 100 w/ Dumore Automatic Head Number 8391)

    SciTech Connect

    Heckman, B.K.; Chinn, V.K.

    1981-01-01

    The development and use of computer programs written to produce the paper tape needed for the automation, or numeric control, of drill presses employed to fabricate computed-designed printed circuit boards are described. (LCL)

  17. Coupling behaviour of tapered highly multimodal dielectric waveguides as part of PCB-level optical interconnects

    NASA Astrophysics Data System (ADS)

    Soenmez, Yasin; Mrozynski, Gerd; Schrage, Juergen

    2010-05-01

    Optical interconnects replace electrical links increasingly at shorter distances. At printed circuit board (PCB) level highly multimodal polymer channel waveguides are the chosen approach to meet bandwidth-length and bandwidth-density requirements. One important challenge of board integrated waveguides is the coupling problem. The manufacturing process of PCBs leads to relatively high placement tolerances which cause poor optical coupling efficiency due to mechanical misalignment between separate components, e.g.: 1) Coupling between a VCSEL and the board integrated waveguides; 2) Coupling between waveguides in two separate boards. This paper deals with the deployment of tapered dielectric multimode waveguides for increasing the optical coupling robustness towards mechanical misalignments in these two coupling applications. A coupled mode approach for calculation of the mode coupling and power loss in a taper with decreasing width has been presented before [5]. In [6], the two above mentioned coupling applications for tapered dielectric waveguides have been dealt with, but only the coupling efficiency in case of longitudinal misalignment has been calculated. In this paper, results of advanced analysis of the two applications are presented. The coupling efficiency in case of transverse misalignment is simulated by a ray-optical approach. Furthermore the results of measurements of the coupling behaviour of board integrated tapered waveguides are presented. The results show that tapered multimodal dielectric waveguides have the capability to increase the coupling efficiency significantly if some conditions are fulfilled.

  18. PCB recordkeeping and reporting

    SciTech Connect

    1994-12-01

    Polychlorinated biphenyls (PCBs) are a class of organic chemicals that had become widely used in industrial applications due to their practical physical and chemical properties. Historical uses of PCBs include dielectric fluids (used in utility transformers, capacitors, etc.), hydraulic fluids, and other applications requiring stable, fire-retardant materials. Due to findings that PCBs may cause adverse health effects and due to their persistence and accumulation in the environment, the Toxic Substances Control Act (TSCA), enacted on October 11, 1976, banned the manufacture of PCBs after 1978 [Section 6(e)]. The first PCB regulations, promulgated at 40 CFR Part 761, were finalized on February 17, 1978. These PCB regulations include requirements specifying disposal methods and marking (labeling) procedures, and controlling PCB use. To assist the Department of Energy (DOE) in its efforts to comply with the TSCA statute and implementing regulations, the Office of Environmental Guidance has prepared the document ``Guidance on the Management of Polychlorinated Biphenyls (PCBs).`` That document explains the requirements specified in the statute and regulations for managing PCBs including PCB use, storage, transport, and disposal. All generators, disposers, and storers of PCB waste must comply with the recordkeeping and reporting requirements found at 40 CFR 761.180. The regulations include directions for writing and maintaining annual records and annual document logs and for preparing annual reports, exception reports, manifest discrepancy reports, and unmanifested waste reports. This Information Brief supplements the PCB guidance document by responding to common questions concerning recordkeeping and reporting requirements for PCBs. It is one of a series of Information Briefs pertinent to PCB management issues.

  19. Anvil for Flaring PCB Guide Pins

    NASA Technical Reports Server (NTRS)

    Winn, E.; Turner, R.

    1985-01-01

    Spring-loaded anvil results in fewer fractured pins. New anvil for flaring guide pins in printed-circuit boards absorbs approximately 80 percent of press force. As result fewer pins damaged, and work output of flaring press greatly increased.

  20. PCB biohalogenation under anaerobic conditions

    SciTech Connect

    Gauger, W.K.; McCue, J.J.

    1990-01-01

    The Institute of Gas Technology (IGT) is conducting research on the biodehalogenation of polychlorinated biphenyls (PCB's) under anoxic conditions. Reductive dechlorination of PCB's has been observed in treatments inoculated with Hudson River sediments. Differences in gas chromatograms between time 0 and 4-month incubations indicate pattern shifts of the PCB homologs that constitute Aroclor 1242 from highly chlorinated to lesser chlorinated congeners. Changes in distribution patterns of PCB homologs were also evident. PCB homologs containing 4, 5, 6, and 7 chlorine atoms were shown to decrease over the incubation period, whereas PCB homologs containing 2 and 3 chlorines increased in concentration. 10 refs., 5 figs., 1 tab.

  1. Data Mining Approaches for Modeling Complex Electronic Circuit Design Activities

    SciTech Connect

    Kwon, Yongjin; Omitaomu, Olufemi A; Wang, Gi-Nam

    2008-01-01

    A printed circuit board (PCB) is an essential part of modern electronic circuits. It is made of a flat panel of insulating materials with patterned copper foils that act as electric pathways for various components such as ICs, diodes, capacitors, resistors, and coils. The size of PCBs has been shrinking over the years, while the number of components mounted on these boards has increased considerably. This trend makes the design and fabrication of PCBs ever more difficult. At the beginning of design cycles, it is important to estimate the time to complete the steps required accurately, based on many factors such as the required parts, approximate board size and shape, and a rough sketch of schematics. Current approach uses multiple linear regression (MLR) technique for time and cost estimations. However, the need for accurate predictive models continues to grow as the technology becomes more advanced. In this paper, we analyze a large volume of historical PCB design data, extract some important variables, and develop predictive models based on the extracted variables using a data mining approach. The data mining approach uses an adaptive support vector regression (ASVR) technique; the benchmark model used is the MLR technique currently being used in the industry. The strengths of SVR for this data include its ability to represent data in high-dimensional space through kernel functions. The computational results show that a data mining approach is a better prediction technique for this data. Our approach reduces computation time and enhances the practical applications of the SVR technique.

  2. Proceedings: 1981 PCB seminar

    SciTech Connect

    Addis, G.; Marks, J.

    1982-09-01

    The EPRI PCB seminar, held in Dallas, Texas, on December 1 to 3, 1981, was the first comprehensive seminar covering PCB problems and solutions of interest to the electric utilities. The purpose of the meeting, attended by 300 participants, was to present emerging technologies and ideas for PCB analysis and removal. The major areas covered were: background and history of the problem, analytic techniques, spill cleanup, destruction of askarels, treatment of capacitors, and decontamination of oil. Both EPRI-sponsored and independently developed projects are included. In addition to the ongoing research on new technologies, some presentations cover processes ready or almost ready for commercialization. Supplementing the proceedings, a videotape of author interviews was prepared and is available for purchase from EPRI (415/855-2286).

  3. Comparison of an Electromagnetic Energy Harvester Performance using Wound Coil Wire and PCB Coil

    NASA Astrophysics Data System (ADS)

    Resali, MSM; Salleh, H.

    2016-03-01

    This paper presents the performance of two types of electromagnetic energy harvester, one using manually wound coil wire (EH-EC) and the other one using printed circuit board (PCB) coil (EH-EP). The objective of the study is to measure the corresponding output voltage and power by varying the number of coils and the position of the magnet. The experiment was conducted at a fix 50 Hz of frequency and at 0.25g of acceleration. The EH-EP was found to be more effective than the 350 turns of the wound coil wire, with maximum power of 26 μW. Overall, the performance of the EH-EC showed better result with maximum power of 125 μW for 1050 turns when compared to the EH-EP.

  4. Flexible circuits with integrated switches for robotic shape sensing

    NASA Astrophysics Data System (ADS)

    Harnett, C. K.

    2016-05-01

    Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.

  5. Surface plasma preionization produced on a specially patterned PCB and its application in a pulsed CO2 laser

    NASA Astrophysics Data System (ADS)

    Ghorbanzadeh, Atamalek; Pakmanesh, Nahid; Rastegari, Ali; Abdolghader, Pedram; Feizollah, Peyman; Siadati, Neda

    2016-04-01

    The performance of an atmospheric pressure pulsed carbon dioxide laser employing surface plasma preionization, produced on a specially patterned printed circuit board (PCB), is reported. The surface plasma is formed due to many tiny plasma channels produced in millimeter sized open circular gaps, made by lithography on one side of PCB. The preionizing plasma is mostly consisted of corona or glow stage and transition to spark one hardly occurs. This type of preionization allows a maximum of 220 J/l energy deposition into the main plasma, while up scaling is yet possible by more optimization of PCB and the pattern. The laser output energy of 1.2 J per pulse with overall efficiency of 7% has been obtained with gas mixture of He:CO2:N2=3:1:1. This type of surface plasma preionization is specifically appropriate for very large volumes and high pressures, where the conventional UV emitting preionizations like spark arrays or corona are not effective.

  6. PCB breakdown by anaerobic microorganisms

    SciTech Connect

    Not Available

    1989-03-01

    Recently, altered PCB cogener distribution patterns observed in anaerobic sediment samples from the upper Hudson River are being attributed to biologically mediated reductive dechlorination. The authors report their successful demonstration of biologically mediated reductive dechlorination of an Aroclor mixture. In their investigation, they assessed the ability of microorganisms from PCB-contaminated Hudson River sediments (60-562 ppm PCBs) to dechlorinate Aroclor 1242 under anaerobic conditions by eluting microorganisms from the PCB- contaminated sediments and transferring them to a slurry of reduced anaerobic mineral medium and PCB-free sediments in tightly stoppered bottles. They observed dechlorination to be the most rapid at the highest PCB concentration tried by them.

  7. Recycling of lead solder dross, Generated from PCB manufacturing

    NASA Astrophysics Data System (ADS)

    Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter

    2011-08-01

    The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

  8. High-efficiency thin and compact concentrator photovoltaics using micro-solar cells with via-holes sandwiched between thin lens-array and circuit board

    NASA Astrophysics Data System (ADS)

    Itou, Akihiro; Asano, Tetsuya; Inoue, Daijiro; Arase, Hidekazu; Matsushita, Akio; Hayashi, Nobuhiko; Futakuchi, Ryutaro; Inoue, Kazuo; Yamamoto, Masaki; Fujii, Eiji; Nakagawa, Tohru; Anda, Yoshiharu; Ishida, Hidetoshi; Ueda, Tetsuzo; Fidaner, Onur; Wiemer, Michael; Ueda, Daisuke

    2014-01-01

    We have developed a compact concentrator photovoltaic (CPV) module that comprises micro-solar cells with an area of ≈0.6 × 0.6 mm2 sandwiched between a 20-mm-thick lens array and a 1-mm-thick circuit board with no air gap. To establish electrical connections between the circuit board and the micro-solar cells, we developed a micro-solar cell with positive and negative electrodes on the lower face of the cell. In this study, we demonstrated the photovoltaic performance of the micro-solar cell closely approaches that of the standard solar cell measuring ≈5 × 5 mm2 commonly used in conventional CPVs under concentrated illumination. Our study showed that the negative effect on PV performance of perimeter carrier recombination in the micro-solar cell was insignificant under concentrated illumination. Finally, we assembled our micro-solar cells into a CPV module and achieved the module energy conversion efficiency of 34.7% under outdoor solar illumination.

  9. [Optoelectronic PCB Wastewater Treatment by Partial Nitrification-ANAMMOX Integrative Reactor].

    PubMed

    Yuan, Yan; Li, Xiang; Zhou, Cheng; Chen, Zong-heng

    2015-07-01

    The feasibility and operating characteristics of treatment of printed circuit board (PCB) wastewater by using autotrophic nitrogen removal process in partial nitrification and ANAMMOX integrative reactor were investigated. The reactor had startup successfully and achieved the stable nitrogen removal efficiency. The results showed that, after 80d operation, the nitrogen removal rate increased and was up to 1. 29 kg . (m3 . d)-1, the effluent NH4+-N and NO2- -N were decreased and stabilized at 4. 0 mg . L -1, 9. 8 mg . L-1 respectively, when the influent concentration of NH4+-N maintained at 220 mg . L -1. At the same time, the concentration of total nitrogen was less than 50 mg . L-1 in effluent, which meet the quality emissions requirements. The NO2- -N production rate was up to 2. 05 kg . (m3 . d)-1 by nitrite bacteria in aerobic zone, and the highest nitrogen removal rate was 2. 91 kg . (m3 . d) -1 by ANAMMOX. bacteria in anaerobic zone, which illuminated functional bacteria were steadily grown in the corresponding region. The inorganic ammmonia in PCB wastewater could be removed by autotrophic nitrogen removal process in nitrification and ANAMMOX integrative reactor. PMID:26489329

  10. Multiplex PCB-based electrochemical detection of cancer biomarkers using MLPA-barcode approach.

    PubMed

    Sánchez, J L Acero; Henry, O Y F; Joda, H; Solnestam, B Werne; Kvastad, L; Johansson, E; Akan, P; Lundeberg, J; Lladach, N; Ramakrishnan, D; Riley, I; O'Sullivan, C K

    2016-08-15

    Asymmetric multiplex ligation-dependent probe amplification (MLPA) was developed for the amplification of seven breast cancer related mRNA markers and the MLPA products were electrochemically detected via hybridization. Seven breast cancer genetic markers were amplified by means of the MLPA reaction, which allows for multiplex amplification of multiple targets with a single primer pair. Novel synthetic MLPA probes were designed to include a unique barcode sequence in each amplified gene. Capture probes complementary to each of the barcode sequences were immobilized on each electrode of a low-cost electrode microarray manufactured on standard printed circuit board (PCB) substrates. The functionalised electrodes were exposed to the single-stranded MLPA products and following hybridization, a horseradish peroxidase (HRP)-labelled DNA secondary probe complementary to the amplified strand completed the genocomplex, which was electrochemically detected following substrate addition. The electrode arrays fabricated using PCB technology exhibited an excellent electrochemical performance, equivalent to planar photolithographically-fabricated gold electrodes, but at a vastly reduced cost (>50 times lower per array). The optimised system was demonstrated to be highly specific with negligible cross-reactivity allowing the simultaneous detection of the seven mRNA markers, with limits of detections as low as 25pM. This approach provides a novel strategy for the genetic profiling of tumour cells via integrated "amplification-to-detection". PMID:27085955

  11. PDMS-film coated on PCB for AC impedance sensing of biological cells.

    PubMed

    Guo, Jinhong; Li, Chang Ming; Kang, Yuejun

    2014-10-01

    Microfluidic impedance sensor has been introduced as a cost effective platform in biological cell sensing and counting since several decades ago. Conventional microfluidic impedance sensor usually requires the patterned gold electrodes directly in contact with the carrying buffer to measure the electrical current change due to the blockage of cells. However, patterning metal electrode probes on the silicon or glass substrate is a non-trivial task, which increases the fabrication cost of the impedance sensor. In this paper, we demonstrate an alternating current (AC) impedance based microfluidic cytometer built on a printed circuit board (PCB) coated with polydimethylsiloxane (PDMS) thin film. In addition, circulating tumor cells (Hela cells) are used to successfully demonstrate the feasibility of the microfluidic AC impedance sensor in tumor cell detection. The electrodes pre-deposited PCB costs less than US$2.00 and is widely available in the market. This device has a good potential for point-of-care diagnosis in resource-poor settings. PMID:24850232

  12. Sampling of BTX in Hat Yai city using cost effective laboratory-built PCB passive sampler.

    PubMed

    Subba, Jas Raj; Thammakhet, Chongdee; Thavarungkul, Panote; Kanatharana, Proespichaya

    2016-08-23

    A laboratory-built printed circuit board (PCB) passive sampler used for the monitoring of xylene and styrene in copy print shops was re-validated for detecting benzene, toluene and xylene (BTX) and applied for the sampling of ambient air from Hat Yai city, Songkhla, Thailand, in the month of November 2014. For monitoring, the PCB passive samplers were exposed to target analytes in 16 locations covering high to low exposure areas. After sampling, the samplers were thermally desorbed and the analytes were trapped by multi-walled carbon nanotubes packed into a micro-preconcentrator coupled to a gas chromatograph (GC) equipped with a flame ionization detector. At the optimum GC operating conditions, the linear dynamic ranges for BTX were 0.06-5.6 µg for benzene, 0.07-2.2 µg for toluene and 0.23-2.5 µg for xylene with R(2) > 0.99 with the limits of detection being 6.6, 6.8 and 19 ng for benzene, toluene and xylene, respectively. The concentrations of BTX in the 16 sampling sites were in the range of N.D.-1.3 ± 1.6, 4.50 ± 0.76-49.6 ± 3.7 and 1.00 ± 0.21-39.6 ± 3.1 µg m(-3), respectively. When compared to past studies, there had been an increase in the benzene concentration. PMID:27231039

  13. Evaluating the Effects of Aging on Electronic Instrument and Control Circuit Boards and Components in Nuclear Power Plants

    SciTech Connect

    G. William Hannaman; C. Dan Wilkinson

    2005-05-15

    The report describes potentially useful techniques for monitoring the aging of I&C boards. The techniques have been grouped into: periodic testing, reliability modeling, resistance measures, signal comparison, eternal measures, and internal measures, each representing distinct theoretical approaches to detection and evaluation.

  14. Effects of PCB Substrate Surface Finish, Flux, and Phosphorus Content on Ionic Contamination

    NASA Astrophysics Data System (ADS)

    Bacior, M.; Sobczak, N.; Siewiorek, A.; Kudyba, A.; Homa, M.; Nowak, R.; Dziula, M.; Masłoń, S.

    2015-02-01

    The ionic contamination on printed circuit boards (PCB) having different surface finishes was examined using ionograph. The study was performed at the RT on three types of PCBs covered with: (i) hot air solder leveling (HASL LF), (ii) electroless nickel immersion gold (ENIG), and (iii) organic surface protectant (OSP), all on Cu substrates, as well as two types of fluxes, namely EF2202 and RF800. In the group of boards without soldered components, the lowest average value of contamination was for the ENIG 18 µm surface (0.01 μg NaCl/cm2). Boards with soldered components were more contaminated (from 0.29 μg NaCl/cm2 for the HASL LF 18 µm surface). After spraying boards with fluxing agents, the values of contaminants were the highest. The influence of phosphorus content in Ni-P layer of ENIG finish on ionic contamination was examined. In the group of PCBs with Au coating, the smallest amount of surface contaminants (0.32 μg NaCl/cm2) was for Ni-2-5%P layer. PCBs with Ni-11%P layer were higher contaminated (0.47 μg NaCl/cm2), and another with Ni-8%P layer had 0.81 μg NaCl/cm2. PCBs without Au coating, had the lowest contamination (0.48 μg NaCl/cm2) at phosphorous content equal 11%P. Higher contamination (0.67 μg NaCl/cm2) was at 2-5%P, up to 1.98 μg NaCl/cm2 for 8% of P. Boards with Au finish have lower value of contamination than identical boards without Au layer thus contributing to better reliability of electronic assemblies, since its failures due to current leakage and corrosion can be caused by contaminants.

  15. The major components of particles emitted during recycling of waste printed circuit boards in a typical e-waste workshop of South China

    NASA Astrophysics Data System (ADS)

    Bi, Xinhui; Simoneit, Bernd R. T.; Wang, ZhenZhen; Wang, Xinming; Sheng, Guoying; Fu, Jiamo

    2010-11-01

    Electronic waste from across the world is dismantled and disposed of in China. The low-tech recycling methods have caused severe air pollution. Air particle samples from a typical workshop of South China engaged in recycling waste printed circuit boards have been analyzed with respect to chemical constituents. This is the first report on the chemical composition of particulate matter (PM) emitted in an e-waste recycling workshop of South China. The results show that the composition of PM from this recycling process was totally different from other emission sources. Organic matter comprised 46.7-51.6% of the PM. The major organic constituents were organophosphates consisting mainly of triphenyl phosphate (TPP) and its methyl substituted compounds, methyl esters of hexadecanoic and octadecanoic acids, levoglucosan and bisphenol A. TPP and bisphenol A were present at 1-5 orders of magnitude higher than in other indoor and outdoor environments throughout the world, which implies that they might be used as potential markers for e-waste recycling. The elemental carbon, inorganic elements and ions had a minor contribution to the PM (<5% each). The inorganic elements were dominated by phosphorus and followed by crustal elements and metal elements Pb, Zn, Sn, and lesser Cu, Sb, Mn, Ni, Ba and Cd. The recycling of printed circuit boards was demonstrated as an important contributor of heavy metal contamination, particularly Cd, Pb and Ni, to the local environment. These findings suggest that this recycling method represents a strong source of PM associated with pollutants to the ambient atmosphere of an e-waste recycling locale.

  16. Computer simulation of the pneumatic separator in the pneumatic-electrostatic separation system for recycling waste printed circuit boards with electronic components.

    PubMed

    Xue, Mianqiang; Xu, Zhenming

    2013-05-01

    Technologies could be integrated in different ways into automatic recycling lines for a certain kind of electronic waste according to practical requirements. In this study, a new kind of pneumatic separator with openings at the dust hooper was applied combing with electrostatic separation for recycling waste printed circuit boards. However, the flow pattern and the particles' movement behavior could not be obtained by experimental methods. To better control the separation quantity and the material size distribution, computational fluid dynamics was used to model the new pneumatic separator giving a detailed understanding of the mechanisms. Simulated results showed that the tangential velocity direction reversed with a relatively small value. Axial velocity exhibited two sharp decreases at the x axis. It is indicated that the bottom openings at the dust hopper resulted in an enormous change in the velocity profile. A new phenomenon that was named dusting was observed, which would mitigate the effect of particles with small diameter on the following electrostatic separation and avoid materials plugging caused by the waste printed circuit boards special properties effectively. The trapped materials were divided into seven grades. Experimental results showed that the mass fraction of grade 5, grade 6, and grade 7 materials were 27.54%, 15.23%, and 17.38%, respectively. Grade 1 particles' mass fraction was reduced by 80.30% compared with a traditional separator. Furthermore, the monocrystalline silicon content in silicon element in particles with a diameter of -0.091 mm was 18.9%, higher than that in the mixed materials. This study could serve as guidance for the future material flow control, automation control, waste recycling, and semiconductor storage medium destruction. PMID:23560940

  17. A 3-D image chamber for the liquid argon TPC based on multi-layer printed circuit board

    NASA Astrophysics Data System (ADS)

    Cennini, P.; Cittolin, S.; Revol, J. P.; Rubbia, C.; Tian, W. H.; Li, X.; Picchi, P.; Cavanna, F.; Piano Mortari, G.; Verdecchia, M.; Cline, D.; Liu, Y.; Muratori, G.; Otwinowski, S.; Wang, H.; Zhou, M.; Bettini, A.; Casagrande, F.; Centro, S.; De Vecchi, C.; Pepato, A.; Pietropaolo, F.; Rossi, P.; Ventura, S.; Benetti, P.; Calligarich, E.; Dolfini, R.; Gigli Berzolari, A.; Mauri, F.; Montanari, C.; Piazzoli, A.; Rappoldi, A.; Raselli, U. L.; Scannicchio, D.; Periale, L.; Suzuki, S.

    1994-08-01

    In our research and development programme for the ICARUS experiment we have developed a novel three-dimensional readout scheme for a liquefied noble gas TPC, where no charge multiplication process takes place. The design avoids completely wire grids and is based on the multilayer circuit technique. As a consequence it is intrinsically safe and suited to be used in large and modular structures as those foreseen for ICARUS. We describe here how the electrodes structure can be simplified leading to the new design principles and we present the results obtained with a small prototype chamber in a 100 GeV μ beam.

  18. Display glass for low-loss and high-density optical interconnects in electro-optical circuit boards with eight optical layers.

    PubMed

    Brusberg, Lars; Whalley, Simon; Herbst, Christian; Schröder, Henning

    2015-12-14

    Parallel optical interconnects on-board level requires low propagation loss in wavelength range between 850 and 1550 nm to be compatible with datacom and telecom optical engines. For highest integration density tight waveguide bends and a scalable number of optical layers should be manufacturable for 2D interfaces to optical fiber array connectors and photonic assembly I/O's. We developed a glass waveguide panel process for double-sided processing of commercial available display glass by applying a two-step thermal ion-exchange process for low-loss multi-mode graded-index waveguides. Multiple glass waveguide panels can be embedded between electrical layers. The generic concept enables fabrication of high-density integration (HDI) electro-optical circuit boards (EOCB) with high number of optical and electrical layers. Waveguides with high NA of 0.3 for low bend losses could be achieved in glass with propagation loss of 0.05 dB/cm for all key wavelengths. Four of those glass waveguide panels were embedded in an EOCB demonstrator with size of 280 x 233 mm² providing eight optical layers with 96 channels in an area of 2.8 x 1.5 mm². To the best of our knowledge it's the highest number of layers that has ever been demonstrated for an EOCB. PMID:26699042

  19. Analytical Solution for Two Parallel Traces on PCB in the Time Domain with Application to Hairpin Delay Lines

    NASA Astrophysics Data System (ADS)

    Xiao, Fengchao; Murano, Kimitoshi; Kami, Yoshio

    In this paper the time-domain analysis of two parallel traces is investigated. First, the telegrapher's equations for transmission line are applied to the parallel traces on printed circuit board (PCB), and are solved by using the mode decomposition technique. The time-domain solutions are then obtained by using the inverse Laplace transform. Although the Fourier-transform technique is also applicable for this problem, the solution is given numerically. Contrarily, the inverse Laplace transform successfully leads to an analytical expression for the transmission characteristics. The analytical expression is represented by series, which clearly explains the coupling mechanism. The analytical expression for the fundamental section of a meander delay line is investigated in detail. The analytical solution is validated by measurements, and the characteristics of the distortions in the output waveforms of meander delay lines due to the crosstalk are also investigated.

  20. Development of high-precision high-frequency phase-shifting circuit

    NASA Astrophysics Data System (ADS)

    Ye, Shuliang; Song, Jiaying; Zhang, Baowu; Qiu, Jian

    2010-08-01

    Phase-locked frequency multiplying technology is utilized to amplify 10MHz signal to 640MHz. Pulse inhibition method is then exploited to make high-frequency signal have a phase shift of 2π. 20MHz signal with 2π / 32 phase shift is output after 5 times flip frequency division. In order to optimize electromagnetic compatibility, signal integrity and power integrity of a high-speed circuit, system simulation is performed using HyperLynx, a specially EDA simulation software. A whole printed circuit board (PCB) was made under the guide of optimized simulation results. Phase-shift experiments show that the output of high-frequency phase-shifting circuit system is two-way signals with a frequency of 20.0001 MHz with 1.8ns time difference, i.e. two signals with 12.96°phase difference are obtained.

  1. Circuit Connectors

    NASA Technical Reports Server (NTRS)

    1979-01-01

    The U-shaped wire devices in the upper photo are Digi-Klipsm; aids to compact packaging of electrical and electronic devices. They serve as connectors linking the circuitry of one circuit board with another in multi-board systems. Digi-Klips were originally developed for Goddard Space Flight Center to meet a need for lightweight, reliable connectors to replace hand-wired connections formerly used in spacecraft. They are made of beryllium copper wire, noted for its excellent conductivity and its spring-like properties, which assure solid electrical contact over a long period of time.

  2. Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution.

    PubMed

    Stuhlpfarrer, Philipp; Luidold, Stefan; Antrekowitsch, Helmut

    2016-04-15

    The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400°C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200°C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones. PMID:26775099

  3. Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

    SciTech Connect

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

    2015-06-15

    Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

  4. A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid.

    PubMed

    Zhu, P; Chen, Y; Wang, L Y; Qian, G Y; Zhou, M; Zhou, J

    2012-11-15

    Recovery of valuable materials from waste printed circuit boards (WPCBs) is quite difficult because WPCBs is a heterogeneous mixture of polymer materials, glass fibers, and metals. In this study, WPCBs was treated using ionic liquid (1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM+][BF4-]). Experimental results showed that the separation of the solders went to completion, and electronic components (ECs) were removed in WPCBs when [EMIM+][BF4-] solution containing WPCBs was heated to 240 °C. Meanwhile, metallographic observations verified that the WPCBs had an initial delamination. When the temperature increased to 260 °C, the separation of the WPCBs went to completion, and coppers and glass fibers were obtained. The used [EMIM+][BF4-] was treated by water to generate a solid-liquid suspension, which was separated completely to obtain solid residues by filtration. Thermal analyses combined with infrared ray spectra (IR) observed that the solid residues were bromine epoxy resins. NMR (nuclear magnetic resonance) showed that hydrogen bond played an important role for [EMIM+][BF4-] dissolving bromine epoxy resins. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent environmental pollution from WPCBs effectively. PMID:22985818

  5. Co-recycling of acrylonitrile-butadiene-styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites.

    PubMed

    Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

    2015-01-01

    This study investigated the feasibility of using acrylonitrile-butadiene-styrene (ABS) waste plastic and nonmetal particles from waste printed circuit boards (WPCB) to manufacture reproduction composites (RC), with the aim of co-recycling these two waste resources. The composites were prepared in a twin-crew extruder and investigated by means of mechanical testing, in situ flexural observation, thermogravimatric analysis, and dimensional stability evaluation. The results showed that the presence of nonmetal particles significantly improved the mechanical properties and the physical performance of the RC. A loading of 30 wt% nonmetal particles could achieve a flexural strength of 72.6 MPa, a flexural modulus of 3.57 GPa, and an impact strength of 15.5 kJ/m2. Moreover, it was found that the application of maleic anhydride-grafted ABS as compatilizer could effectively promote the interfacial adhesion between the ABS plastic and the nonmetal particles. This research provides a novel method to reuse waste ABS and WPCB nonmetals for manufacturing high value-added product, which represents a promising way for waste recycling and resolving the environmental problem. PMID:25413110

  6. Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

    PubMed

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

    2015-06-01

    The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%. PMID:25816768

  7. CADAT Printed-Wiring-Board Designer

    NASA Technical Reports Server (NTRS)

    Brinkerhoff, C. D.

    1982-01-01

    CADAT printed-wiring-board system (PWB) designs printed-circuit and hybrid-circuit boards. It is comprised of four programs: preprocessor, placement program, organizer program, and the router. Component placement and interconnection paths are optimized.

  8. Evaluation of Cleanliness Test Methods for Spacecraft PCB Assemblies

    NASA Astrophysics Data System (ADS)

    Tegehall, P.-E.; Dunn, B. D.

    2006-10-01

    Ionic contamination on printed-circuit-board assemblies may cause current leakage and short-circuits. The present cleanliness requirement in ECSS-Q-70-08, "The manual soldering of high-reliability electrical connections", is that the ionic contamination shall be less than 1.56 fl-glcm2 NaCI equivalents. The relevance of the method used for measurement of the ionic contamination level, resistivity of solvent extract, has been questioned. Alternative methods are ion chromatography and measurement of surface insulation resistance, but these methods also have their drawbacks. These methods are first described and their advantages and drawbacks are discussed. This is followed by an experimental evaluation of the three methods. This was done by soldering test vehicles at four manufacturers of space electronics using their ordinary processes for soldering and cleaning printed board assemblies. The experimental evaluation showed that the ionic contamination added by the four assemblers was very small and well below the acceptance criterion in ECSS-Q-70-80. Ion-chromatography analysis showed that most of the ionic contamination on the cleaned assembled boards originated from the hot-oil fusing of the printed circuit boards. Also, the surface insulation resistance was higher on the assembled boards compared to the bare printed circuit boards. Since strongly activated fluxes are normally used when printed circuit boards are hot-oil fused, it is essential that they are thoroughly cleaned in order to achieve low contamination levels on the final printed-board assemblies.

  9. PCB cycling in marine plankton

    SciTech Connect

    Ashizawa, D.; Brownawell, B.; Fisher, N.

    1995-12-31

    Ecosystem-scale models of contaminant bioaccumulation and toxicity are often sensitive to quantification of uptake and trophic transfer at the base of aquatic food chains. Significant uncertainty remains in assessing the rates and routes of transfer of hydrophobic contaminants by phytoplankton and zooplankton. Using radio-labeled 2,2{prime},4,4{prime}-tetrachlorobiphenyl (PCB), the authors have conducted experiments to measure the transfer of PCB from seawater to phytoplankton to copepods. Uptake, equilibration, and release of PCB onto/from algal cells were found to be rapid and not appreciably affected by the algal growth phase. Initial experiments indicate that when PCB-contaminated diatoms were fed to calanoid copepods, the assimilation efficiencies in the grazers ranged from 30--50%. Ongoing experiments are investigating this process further and quantitatively comparing copepod uptake of PCB from food and from the dissolved phase. These parameters of uptake and release are essential in the development and application of contaminant bioaccumulation models for marine and aquatic food chains.

  10. Time domain spectral method and its application on antenna array and PCB trace with periodic roughness

    NASA Astrophysics Data System (ADS)

    Wang, Minshen

    The primary interest of the electromagnetic behavior of a periodic structure is in its near field and far field. However, it is still numerically difficult to analyze either one in the time domain. The primary goal of this dissertation is to develop corresponding time domain technique to analyze two topics. The first one is to evaluate the far field of a realistic, large antenna array using an efficient method. The second one is to evaluate the propagation characteristic of a commercially available printed circuit board (PCB) with intentional roughness. Both of which are hot topics in the antenna and signal integrity (SI) society respectively; however, none of them have ever been solved in the time domain. To efficiently evaluate the far field pattern of a realistically large antenna array, the spectral domain method and the reciprocity theorem are implemented in the finite difference time domain (FDTD) technique to avoid the simulation of the near field. By taking advantage of the periodic boundary condition (PBC), the proposed method demonstrates its capability to speed up far field evaluation from hours to minutes. Good agreement of the results is provided for various cases: circular antenna array, arbitrary feeding array, and highly directional leaky wave antenna, etc. Periodic structure modeling with finite sized feedings is developed by the array scanning method (ASM) implemented in the FDTD technique. The minimally coupled electric and magnetic co-mingled antenna array is evaluated by the method. Moreover, a commercially available PCB with very small roughness is modeled by the ASM-FDTD and the propagation characteristic is evaluated. Both are evaluated by time domain method for the first time. Efficiency in terms of memory and computing time is shown for this method and parallelization in the future is proposed.

  11. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment.

    PubMed

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2015-07-01

    Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine-iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine-iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO+HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420°C and 60min for Au and Pd, and 410°C and 30min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO+HL)-treated PCBs with iodine-iodide system were leaching time of 120min (90min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10g/mL (1:8g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine-iodide leaching process. PMID:25802060

  12. Modeling and characteristic of the SMT Board Plug connector in high speed optical communication system

    NASA Astrophysics Data System (ADS)

    Wu, Haoran; Dong, Zhenzhen; Wang, Tanglin; Zhao, Heng; Feng, Junbo; Cui, Naidi; Teng, Jie; Guo, Jin

    2015-04-01

    Modeling and characteristic of the SMT Board Plug connector, which is used to connect micro optical transceiver to the main board, are proposed and analyzed in this paper. When the high speed signal transfers from the PCB of transceiver to main board through SMT Board Plug connector, the structure and material discontinuity of the connector causes insertion losses and impedance mismatches. This makes the performance of high speed digital system exacerbated. So it is essential to analyze the signal transfer characteristics of the connector and find out what factors affected the signal quality at the design stage of the digital system. To solve this problem, Ansoft's High Frequency Structure Simulator (HFSS), based on the finite element method, was employed to build accurate 3D models, analyze the effects of various structure parameters, and obtain the full-wave characteristics of the SMT Board Plug connectors in this paper. Then an equivalent circuit model was developed. The circuit parameters were extracted precisely in the frequency range of interests by using the curve fitting method in ADS software, and the result was in good agreement with HFSS simulations up to 8GHz with different structure parameters. At last, the measurement results of S-parameter and eye diagram were given and the S-parameters showed good coincidence between the measurement and HFSS simulation up to 4GHz.

  13. Burial, incineration solve Alaskan PCB contamination

    SciTech Connect

    Ives, J.A. ); Young, D.T. )

    1989-10-01

    Polychlorinated biphenyl (PCB) remediation at Alaska's Swanson River has excavated more than 80,000 tons of PCB-contaminated soil and isolated it in bermed and lined stock-piles. In addition, incineration of other PCB-contaminated materials has been carried out safely. This article on the site reviews its history and part of its remediation approaches.

  14. Design and characterization of a mixed-signal PCB for digital-to-analog conversion in a modular and scalable infrared scene projector

    NASA Astrophysics Data System (ADS)

    Benedict, Jacob

    Infra-red (IR) sensors have proven instrumental in a wide variety of fields from military to industrial applications. The proliferation of IR sensors has spawned an intense push for technologies that can test and calibrate the multitudes of IR sensors. One such technology, IR scene projection (IRSP), provides an inexpensive and safe method for the testing of IR sensor devices. Previous efforts have been conducted to develop IRSPs based on super-lattice light emitting diodes (SLEDS). A single-color 512x512 SLEDs system has been developed, produced, and tested as documented in Corey Lange's Master's thesis, and a GOMAC paper by Rodney McGee [1][2]. Current efforts are being undergone to develop a two-color 512x512 SLEDs system designated (TCSA). The following thesis discusses the design and implementation of a custom printed circuit board (PCB), known as the FMC 4DAC, that contains both analog and digital signals. Utilizing two 16-bit digital-to-analog converters (DAC) the purpose of the board is to provide four analog current output channels for driving the TCSA system to a maximum frame rate of 1 kHz. In addition, the board supports a scalable TCSA system architecture. Several copies of the board can be run in parallel to achieve a range of analog channels between 4 and 32.

  15. Packaging Of Control Circuits In A Robot Arm

    NASA Technical Reports Server (NTRS)

    Kast, William

    1994-01-01

    Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

  16. Printed wiring board system programmer's manual

    NASA Technical Reports Server (NTRS)

    Brinkerhoff, C. D.

    1973-01-01

    The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.

  17. Advantages and Challenges of 10-Gbps Transmission on High-Density Interconnect Boards

    NASA Astrophysics Data System (ADS)

    Yee, Chang Fei; Jambek, Asral Bahari; Al-Hadi, Azremi Abdullah

    2016-06-01

    This paper provides a brief introduction to high-density interconnect (HDI) technology and its implementation on printed circuit boards (PCBs). The advantages and challenges of implementing 10-Gbps signal transmission on high-density interconnect boards are discussed in detail. The advantages (e.g., smaller via dimension and via stub removal) and challenges (e.g., crosstalk due to smaller interpair separation) of HDI are studied by analyzing the S-parameter, time-domain reflectometry (TDR), and transmission-line eye diagrams obtained by three-dimensional electromagnetic modeling (3DEM) and two-dimensional electromagnetic modeling (2DEM) using Mentor Graphics HyperLynx and Keysight Advanced Design System (ADS) electronic computer-aided design (ECAD) software. HDI outperforms conventional PCB technology in terms of signal integrity, but proper routing topology should be applied to overcome the challenge posed by crosstalk due to the tight spacing between traces.

  18. Advantages and Challenges of 10-Gbps Transmission on High-Density Interconnect Boards

    NASA Astrophysics Data System (ADS)

    Yee, Chang Fei; Jambek, Asral Bahari; Al-Hadi, Azremi Abdullah

    2016-03-01

    This paper provides a brief introduction to high-density interconnect (HDI) technology and its implementation on printed circuit boards (PCBs). The advantages and challenges of implementing 10-Gbps signal transmission on high-density interconnect boards are discussed in detail. The advantages (e.g., smaller via dimension and via stub removal) and challenges (e.g., crosstalk due to smaller interpair separation) of HDI are studied by analyzing the S-parameter, time-domain reflectometry (TDR), and transmission-line eye diagrams obtained by three-dimensional electromagnetic modeling (3DEM) and two-dimensional electromagnetic modeling (2DEM) using Mentor Graphics HyperLynx and Keysight Advanced Design System (ADS) electronic computer-aided design (ECAD) software. HDI outperforms conventional PCB technology in terms of signal integrity, but proper routing topology should be applied to overcome the challenge posed by crosstalk due to the tight spacing between traces.

  19. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

    SciTech Connect

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2015-07-15

    Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process.

  20. A compact picosecond pulsed laser source using a fully integrated CMOS driver circuit

    NASA Astrophysics Data System (ADS)

    He, Yuting; Li, Yuhua; Yadid-Pecht, Orly

    2016-03-01

    Picosecond pulsed laser source have applications in areas such as optical communications, biomedical imaging and supercontinuum generation. Direct modulation of a laser diode with ultrashort current pulses offers a compact and efficient approach to generate picosecond laser pulses. A fully integrated complementary metaloxide- semiconductor (CMOS) driver circuit is designed and applied to operate a 4 GHz distributed feedback laser (DFB). The CMOS driver circuit combines sub-circuits including a voltage-controlled ring oscillator, a voltagecontrolled delay line, an exclusive-or (XOR) circuit and a current source circuit. Ultrashort current pulses are generated by the XOR circuit when the delayed square wave is XOR'ed with the original square wave from the on-chip oscillator. Circuit post-layout simulation shows that output current pulses injected into an equivalent circuit load of the laser have a pulse full width at half maximum (FWHM) of 200 ps, a peak current of 80 mA and a repetition rate of 5.8 MHz. This driver circuit is designed in a 0.13 μm CMOS process and taped out on a 0.3 mm2 chip area. This CMOS chip is packaged and interconnected with the laser diode on a printed circuit board (PCB). The optical output waveform from the laser source is captured by a 5 GHz bandwidth photodiode and an 8 GHz bandwidth oscilloscope. Measured results show that the proposed laser source can output light pulses with a pulse FWHM of 151 ps, a peak power of 6.4 mW (55 mA laser peak forward current) and a repetition rate of 5.3 MHz.

  1. Environmental risk assessment of CRT and PCB workshops in a mobile e-waste recycling plant.

    PubMed

    Song, Qingbin; Zeng, Xianlai; Li, Jinhui; Duan, Huabo; Yuan, Wenyi

    2015-08-01

    The mobile e-waste recycling equipment was chosen as the object of this study, including manual dismantling, mechanical separation of cathode ray tubes (CRTs), and printed circuit boards (PCBs) in the two independent workshops. To determine the potential environmental contamination, the noise, the heavy metals (Cu, Cd, Pb), and the environmental impacts of the e-waste recycling processes in the two workshops of the mobile plant have been evaluated in this paper. This study determined that when control measures are employed, the noise within the two workshops (<80 dB) will meet the national standards. In the CRT workshop, Pb was the most polluting metal, with 2.3 μg/m(3) and 10.53 mg/g in the air and floor dust, respectively. The result of a health risk assessment shows that noncancerous effects are possible for Pb (hazard index (HI) = 3.54 in the CRT workshop and HI = 1.27 in the PCB workshop). The carcinogenic risks to workers for Cd are relatively light in both the workshops. From the results of life cycle assessment (LCA), it can be seen that there was an environmental benefit from the e-waste recycling process as a whole. PMID:25903170

  2. Maskless fabrication of a microfluidic device with interdigitated electrodes on PCB using laser ablation

    NASA Astrophysics Data System (ADS)

    Contreras-Saenz, Michael; Hassard, Christian; Vargas-Chacon, Rafael; Gordillo, Jose Luis; Camacho-Leon, Sergio

    2016-03-01

    This paper reports the maskless fabrication of a microfluidic device with interdigitated electrodes (IDE) based on the technology of MicroElectroMechanical Systems on Printed Circuit Board (PCB-MEMS) and laser ablation. The device has flame retardant (FR)-4 resin as substrate, cooper (Cu) as active material and SU-8 polymer as structural material. By adjusting the laser parameters, Cu IDEs and SU-8 microchannels were successfully patterned onto the FR-4 substrate. The respective width, gap and overlap of the IDEs were 50 μm, 25 μm and 500 μm. The respective width, depth and length of the microchannels were 210 μm, 24.6 μm and 6.3 mm. The resolution and repeatability achieved in this approach, along with the low cost of the involved materials and techniques, enable an affordable micromachining platform with rapid fabrication-test cycle to develop active multiphysic microdevices with several applications in the fields of biosensing, cell culture, drug delivery, transport and sorting of molecules, among others.

  3. Study and Evaluation of a PCB-MEMS Liquid Microflow Sensor

    PubMed Central

    Petropoulos, Anastasios; Kaltsas, Grigoris

    2010-01-01

    This paper presents the evaluation of a miniature liquid microflow sensor, directly integrated on a PCB. The sensor operation is based on the convective heat transfer principle. The heating and sensing elements are thin Pt resistors which are in direct electrical contact with the external copper tracks of the printed circuit board. Due to the low thermal conductivity of the substrate material, a high degree of thermal isolation is obtained which improves the operating characteristics of the device. The sensor is able to operate under both the hot-wire and the calorimetric principle. In order to fully exploit the temperature distribution in the flowing liquid, multiple sensing elements are positioned in various distances from the heater. A special housing was developed which allowed implementation of the sensor into tubes of various cross sectional areas. The sensor sensitivity and measurement range as a function of the sensing element distance were quantified. A minimum resolution of 3 μL/min and a measurement flow range up to 500 μL/min were achieved. PMID:22163392

  4. Evaluation and interconversion of various indicator PCB schemes for ∑PCB and dioxin-like PCB toxic equivalent levels in fish.

    PubMed

    Gandhi, Nilima; Bhavsar, Satyendra P; Reiner, Eric J; Chen, Tony; Morse, Dave; Arhonditsis, George B; Drouillard, Ken G

    2015-01-01

    Polychlorinated biphenyls (PCBs) remain chemicals of concern more than three decades after the ban on their production. Technical mixture-based total PCB measurements are unreliable due to weathering and degradation, while detailed full congener specific measurements can be time-consuming and costly for large studies. Measurements using a subset of indicator PCBs (iPCBs) have been considered appropriate; however, inclusion of different PCB congeners in various iPCB schemes makes it challenging to readily compare data. Here, using an extensive data set, we examine the performance of existing iPCB3 (PCB 138, 153, and 180), iPCB6 (iPCB3 plus 28, 52, and 101) and iPCB7 (iPCB6 plus 118) schemes, and new iPCB schemes in estimating total of PCB congeners (∑PCB) and dioxin-like PCB toxic equivalent (dlPCB-TEQ) concentrations in sport fish fillets and the whole body of juvenile fish. The coefficients of determination (R(2)) for regressions conducted using logarithmically transformed data suggest that inclusion of an increased number of PCBs in an iPCB improves relationship with ∑PCB but not dlPCB-TEQs. Overall, novel iPCB3 (PCB 95, 118, and 153), iPCB4 (iPCB3 plus 138) and iPCB5 (iPCB4 plus 110) presented in this study and existing iPCB6 and iPCB7 are the most optimal indicators, while the current iPCB3 should be avoided. Measurement of ∑PCB based on a more detailed analysis (50+ congeners) is also overall a good approach for assessing PCB contamination and to track PCB origin in fish. Relationships among the existing and new iPCB schemes have been presented to facilitate their interconversion. The iPCB6 equiv levels for the 6.5 and 10 pg/g benchmarks of dlPCB-TEQ05 are about 50 and 120 ng/g ww, respectively, which are lower than the corresponding iPCB6 limits of 125 and 300 ng/g ww set by the European Union. PMID:25488397

  5. Swimming against the PCB tide

    SciTech Connect

    Stone, R.

    1992-02-14

    Although no PCBs have been manufactured in the US and other industrialized countries for years, the chemicals are still very much with us; they are extremely long-lived. And only about 1% of the total PCBs produced have reached the oceans so far. PCBs and related organohalogens that have entered the oceans are making their way through the food chain into marine animals. As a result the animals are becoming more prone to a variety of ailments, including reproductive abnormalities and immune suppression that makes them more susceptible to disease. Unless something is done to prevent further contamination by organohalogens such as PCB, many species of ocean mammals might become extinct and some species of fish inedible. Several scientists officially launched a campaign to solicit funds for a 3-year research project aimed at determining just how serious PCB and other organohalogen problems are in the oceans.

  6. PCB metabolism by ectomycorrhizal fungi

    SciTech Connect

    Donnelly, P.K.; Fletcher, J.S.

    1995-04-01

    Since 1976 the use of polychlorinated biphenyls (PCBs) has been banned in the U.S. Prior to this, commercial mixtures (Aroclors) had been used extensively as an industrial lubricant because of their nonflammable, nonreactive properties. These same properties are responsible for their persistent in the environment where they bind to soil particles and resist biodegradation. Decontamination of PCB-laden soil is expensive with excavation followed by either storage or incineration as the primary means of remediation. The use of microorganisms for PCB bioremediation has been gaining popularity in the past few years. Bacteria and/or fungi isolated from environmental samples have been used to degrade PCBs under laboratory conditions, but in field trials they have not been as effective. The most common explanation for the poor performance of PCB-degrading organisms introduced at contaminated sites is that they do not compete well with the existing populations. Plant-ectomycorrhizal systems may overcome this problem. Introduction and cultivation of a known host plant at a contaminated site has the potential of providing a survival advantage for ectomycorrhizal fungi that normally colonize the roots of the introduced plant. Ectomycorrhizal fungi exist naturally in the soil and normally grow in association with the roots of a host plant in a mutualistic symbiotic relationship. Preliminary in vitro examination of this group of fungi for their ability to enzymatically degrade xenobiotics is very promising. In vivo studies have shown that some of these fungi have the ability to degrade chlorinated, aromatic compounds, such as 2,4-D and atrazine. The aspect of ectomycorrhizal metabolism was investigated further in the current study by determining the ability of 21 different fungi to metabolize 19 different PCB congeners with varying chlorine content and substitution patterns. 13 refs., 1 fig., 2 tabs.

  7. Multiple mechanisms of PCB neurotoxicity

    SciTech Connect

    Carpenter, D.O.; Stoner, C.T.; Lawrence, D.A.

    1996-12-31

    Polychlorinated biphenyls (PCBs) have been implicated in cancer, but many of the symptoms in humans exposed to PCBs are related to the nervous system and behavior. We demonstrated three different direct mechanisms whereby PCBs are neurotoxic in rats. By using flow cytometry, we demonstrated that the orthosubstituted PCB congener 2,4,4{prime}, but neither TCDD nor the coplanar PCB congener 3,4,5,3{prime},4{prime}, causes rapid death of cerebellar granule cells. The ortho-substituted congener 2,4,4{prime} reduced long-term potentiation, an indicator of cognitive potential, in hippocampal brain slices, but a similar effect was observed for the coplanar congener 3,4,3{prime},4{prime}, indicating that this effect may be caused by both ortho- and coplanar congeners by mechanisms presumably not mediated via the Ah receptor. It was previously shown that some ortho-substituted PCB congeners cause a reduction in levels of the neurotransmitter dopamine, and we present in vitro and in vivo evidence that this is due to reduction of synthesis of dopamine via inhibition of the enzyme tyrosine hydroxylase. Thus, PCBs have a variety of mechanisms of primary neurotoxicity, and neurotoxicity is a characteristic of ortho-substituted, non-dioxin-like congeners as well as some coplanar congeners. The relative contribution of each of these mechanisms to the loss of cognitive function in humans exposed to PCBs remains to be determined. 42 refs., 3 figs., 1 tab.

  8. PCB (Polychlorinated Biphenyls) retrofill: Fact or fiction

    SciTech Connect

    Seifert, G.D.

    1990-01-01

    PCB transformers changes form the fire safety engineers friend to the environmental engineers worst nightmare, when it became apparent that PCB filled devices are a source of highly toxic chemicals when they are burned improperly. This concern, combined with new regulations, is prompting engineers worldwide to actively plan and design PCB replacements. The two most commonly used PCB mitigation methods are retrofill and retrofit. This report will address retrofill only and is directed toward environmental concerns, facility interfaces, outage requirements, and application questions. This information is offered to help engineers make informed decisions regarding the best way to replace PCB transformers. This overview also addresses whether PCB retrofill is a viable fact'' or is it fiction'' without merit. 3 figs.

  9. PCB Analysis Plan for Tank Archive Samples

    SciTech Connect

    NGUYEN, D.M.

    2001-03-22

    This analysis plan specifies laboratory analysis, quality assurance/quality control (QA/QC), and data reporting requirements for analyzing polychlorinated biphenyls (PCB) concentrations in archive samples. Tank waste archive samples that are planned for PCB analysis are identified in Nguyen 2001. The tanks and samples are summarized in Table 1-1. The analytical data will be used to establish a PCB baseline inventory in Hanford tanks.

  10. Different effects of PCB101, PCB118, PCB138 and PCB153 alone or mixed in MCF-7 breast cancer cells.

    PubMed

    Radice, Sonia; Chiesara, Enzo; Fucile, Serena; Marabini, Laura

    2008-07-01

    Polychlorinated biphenyls (PCBs) are ubiquitous, persistent environmental contaminants that can be a potential health hazard. In the present study we analyzed the potential estrogenic effect in MCF-7 cells of four biologically relevant PCB congeners, alone or in mixtures, present in dairy products, vegetable oil and fish: PCB101, PCB118, PCB138 and PCB153. The mixture of four PCB was tested at seven different concentrations. We investigated the ability of these PCBs, alone or mixed, to induce cell proliferation, and the level of estrogen-regulated protein pS2, in human MCF-7 breast cancer cells. PCB153 (35 microM) stimulated cell proliferation from 48 h up to day 6, PCB118 (40 microM) only at 48 h, but PCB101 (45 microM) and PCB138 (15 microM) applied to the cells for 6 days had no effect. In contrast, the various concentrations of mixtures significantly reduced cell proliferation at different times. No change in pS2 levels was seen after treatment with the PCBs alone or mixed. In exploring the mechanism of these events, we found that PCB153 induced mitogen-activated protein kinase (MAPK) ERK1/2 at 4, 8 and 12 h, while the antiproliferative effect seemed to be related to an apoptotic action beginning at 12 h and ending at 48 h. These findings indicate that these PCBs alone or mixed have no estrogenic effect in MCF-7 cells, although PCB153 induce an ERK1/2-mediated mitogenic effect. On the contrary the mixture of PCBs induces an antiproliferative effect, ascribable to an apoptotic action. PMID:18508174

  11. Increasing PCB Radiolysis Rates in Transformer Oil

    SciTech Connect

    Mincher, Bruce Jay

    2002-11-01

    The kinetics of Aroclor 1242 radiolysis in transformer oil, using high-energy electrons, was found to be analogous to that previously measured for individual polychlorinated biphenyl (PCB) congeners irradiated with ó-rays. The plot of the pseudo-first-order rate constant for PCB decomposition versus initial PCB concentration is a power function, with high rate constants for low concentrations. The addition of alkaline isopropanol to transformer oil was found to increase the pseudo-first-order rate constant for PCB decomposition. The rate constant under these conditions is independent of concentration. This may be explained by the establishment of chain reaction dechlorination in the oil.

  12. Increasing PCB radiolysis rates in transformer oil

    NASA Astrophysics Data System (ADS)

    Mincher, Bruce J.; Brey, Richard R.; Rodriguez, René G.; Pristupa, Scott; Ruhter, Aaron

    2002-11-01

    The kinetics of Aroclor 1242 radiolysis in transformer oil, using high-energy electrons, was found to be analogous to that previously measured for individual polychlorinated biphenyl (PCB) congeners irradiated with γ-rays. The plot of the pseudo-first-order rate constant for PCB decomposition versus initial PCB concentration is a power function, with high rate constants for low concentrations. The addition of alkaline isopropanol to transformer oil was found to increase the pseudo-first-order rate constant for PCB decomposition. The rate constant under these conditions is independent of concentration. This may be explained by the establishment of chain reaction dechlorination in the oil.

  13. ENVIROGARD™ PCB TEST KIT, MILLIPORE, INC. - INNOVATIVE TECHNOLOGY EVALUATION REPORT

    EPA Science Inventory

    The Envirogard™ polychlorinated biphenyl (PCB) immunoassay test kit rapidly analyzes for PCB concentrations in soils. Soils samples are extracted using methanol; extracts and calibration solutions are added to test tubes coated with antibodies that bind PCB molecules. The soil ex...

  14. Management of PCB laboratory wastes

    SciTech Connect

    1995-11-01

    Regulations promulgated by the US Environmental Protection Agency (EPA) under the Toxic Substances Control Act (TSCA) govern the management of polychlorinated biphenyls (PCBs), including use, storage, and disposal. Under TSCA, PCBs can only be used if the use is authorized under the TSCA regulations in 40 CFR 761; otherwise, the use of PCBs is prohibited and the PCBs must be disposed as PCB waste. 40 CFR 761.30(j) authorizes the use of PCBs in ``small quantities for research and development.`` Research and development activities are defined to include activities associated with laboratory analysis.

  15. DYNAMIC MASS BALANCE OF PCB (POLYCHLORINATED BIPHENYLS)

    EPA Science Inventory

    In Saginaw Bay, Lake Huron, about 3.7 metric tons of PCB remain in the active sediment and inputs from the Saginaw River and atmospheric deposition contribute about 1.4 kg PCB per day. In 1977 the U.S. E.P.A. initiated a research effort on Saginaw Bay which was chosen because of ...

  16. PCB tester selection for future systems. Volume 1. Final report, August 1989-June 1991

    SciTech Connect

    Schmitt, W.

    1992-06-01

    This report describes a computer program (to run on an IBM compatible PC) designed to aid in the selection of a PCB tester, given the characteristics of the PC board to be tested. The program contains a limited data base of PCB testers, and others may be added easily. This report also provides a specification for a limited family of PCB testers to fill the gap between what the U.S. Air Force is expected to need and what is expected to be available within the next four to six years. The parameters used in the computer program and the specification are based on a survey of military and commercial PCBs - both those now available and those expected to come on line within the next four to six years. The results of the survey are covered in volume 2 - available from DTIC. Automatic Test Equipment, Technology Forecast, Air Force Avionics.

  17. PCB tester selection for future systems. Volume 2. Final report, August 1989-June 1991

    SciTech Connect

    Schmitt, W.

    1992-06-01

    This report describes a computer program (to run on an IBM compatible PC) designed to aid in the selection of a PCB tester, given the characteristics of the PC board to be tested. The program contains a limited data base of PCB testers, and others may be added easily. This report also provides a specification for a limited family of PCB testers to fill the gap between what the U.S. Air Force is expected to need and what is expected to be available within the next four to six years. The parameters used in the computer program and the specification are based on a survey of military and commercial PCBs - both those now available and those expected to come on line within the next four to six years. The results of the survey are covered in volume 2 - available from DTIC. Automatic Test Equipment, Technology Forecast, Air Force Avionics.

  18. PCB dechlorination in anaerobic soil slurry reactors

    SciTech Connect

    Klasson, K.T.; Evans, B.S.

    1993-11-29

    Many industrial locations, including the US Department of Energy`s, have identified needs for treatment of polychlorinated biphenyl (PCB) wastes and remediation of PCB-contaminated sites. Biodegradation of PCBs is a potentially effective technology for the treatment of PCB-contaminated soils and sludges, including mixed wastes; however, a practical remediation technology has not yet been demonstrated. In laboratory experiments, soil slurry bioreactors inoculated with microorganisms extracted from PCB-contaminated sediments from the Hudson River have been used to obtain anaerobic dechlorination of PCBS. The onset of dechlorination activity can be accelerated by addition of nutritional amendments and inducers. After 15 weeks of incubation with PCB-contaminated soil and nutrient solution, dechlorination has been observed under several working conditions. The best results show that the average chlorine content steadily dropped from 4.3 to 3.5 chlorines per biphenyl over a 15-week period.

  19. Low consumption single-use microvalve for microfluidic PCB-based platforms

    NASA Astrophysics Data System (ADS)

    Flores, G.; Aracil, C.; Perdigones, F.; Quero, J. M.

    2014-06-01

    In this paper, a single-use and unidirectional microvalve with low consumption of energy for PCB-based microfluidic platforms is reported. Its activation is easy because it works as a fuse. The fabrication process of the device is based on PCB technology and a typical SU-8 process, using the PCB as a substrate and SU-8 for the microfluidic channels and chambers. The microvalve is intended to be used to impulse small volumes of fluids and it has been designed to be highly integrable in PCB-based microfluidic platforms. The proposed device has been fabricated, integrated and tested in a general purpose microfluidic circuit, resulting in a low activation time, of about 100 μs, and a low consumption of energy, with a maximum of 27 mJ. These results show a significant improvement because the energy consumption is about 84% lower and the time response is about four orders of magnitude shorter if compared with similar microvalves for impulsion of fluids on PCB-based platforms.

  20. PCB126 Inhibits Adipogenesis of Human Preadipocytes

    PubMed Central

    Gadupudi, Gopi; Gourronc, Francoise A.; Ludewig, Gabriele; Robertson, Larry W.; Klingelhutz, Aloysius J.

    2014-01-01

    Emerging evidence indicates that persistent organic pollutants (POPs), including polychlorinated biphenyls (PCBs), are involved in the development of diabetes. Dysfunctional adipocytes play a significant role in initiating insulin resistance. Preadipocytes make up a large portion of adipose tissue and are necessary for the generation of functional mature adipocytes through adipogenesis. PCB126 is a dioxin-like PCB and a potent aryl hydrocarbon receptor (AhR) agonist. We hypothesized that PCB126 may be involved in the development of diabetes through disruption of adipogenesis. Using a newly developed human preadipocyte cell line called NPAD (Normal PreADipocytes), we found that exposure of preadipocytes to PCB126 resulted in significant reduction in their subsequent ability to fully differentiate into adipocytes, more so than when the cells were exposed to PCB126 during differentiation. Reduction in differentiation by PCB126 was associated with downregulation of transcript levels of a key adipocyte transcription factor, PPARγ, and late adipocyte differentiation genes. An AhR antagonist, CH223191, blocked this effect. These studies indicate that preadipocytes are particularly sensitive to the effects of PCB126 and suggest that AhR activation inhibits PPARγ transcription and subsequent adipogenesis. Our results validate the NPAD cell line as a useful model for studying the effects of POPs on adipogenesis. PMID:25304490

  1. Optimizing the Design of Avionics Lightning Suppression Circuits

    NASA Astrophysics Data System (ADS)

    McCreary, Clay Allen

    This dissertation documents research into optimizing the design of lightning suppression circuits for electronic equipment used on aircraft (avionics). Aircraft manufacturers are increasingly using carbon composite material for the fabrication of the airframe instead of aluminum, and avionics have become more integrated. This has resulted in avionics with higher signal density at the interface being exposed to transients with wider pulse widths and increased levels from the indirect effects of lightning. This dissertation details the development of techniques to select the smallest components and minimum printed circuit board trace dimensions that can tolerate given lightning transient levels. Also, there is a desire to upgrade existing avionics to tolerate the more severe indirect effects of lightning requirements for composite aircraft. This requires evaluation of the immunity of existing designs to new transient levels and different waveforms than those to which they are certified. This evaluation determines if additional protection is needed. The evaluation technique is described, and methods for providing additional protection are given within this document. Lastly, graphical user interfaces (GUI) are created to perform all of the calculations for component selection, minimum PCB trace width, and the first step in evaluating existing designs against new requirements.

  2. BEHAVIORAL ASSESSMENTS OF ADULTS RATS EXPOSED PERINATALLY TO PCB153.

    EPA Science Inventory

    Ortho-substituted polychlorinated biphenyl (PCB) congeners are more neurotoxic in vitro than are non-ortho-substituted PCB congeners. We selected PCB153, a common ortho-substituted PCB congener, to evaluate the neurobehavioral toxicity of this class of PCBs in vivo. Pregnant fema...

  3. No-warp potted circuits

    NASA Technical Reports Server (NTRS)

    Robinson, W. W.

    1979-01-01

    Sponge inserts compensate for potting-compound expansion and relieve thermal stresses on circuit boards. Technique quality of production runs on PC boards intended for applications in environments less severe than those for aerospace equipment. Pads reduce weight of modules because they weigh far less than potting compound they displace.

  4. DEMONSTRATION BULLETIN: CLOR-N-SOIL PCB TEST KIT L2000 PCB/CHLORIDE ANALYZER - DEXSIL CORP.

    EPA Science Inventory

    DEXSIL CORP(Environmental Test Kits)The Dexsil Corporation (Dexsil) produces two test kits that detect polychlorinated biphenyls (PCB) in soil: the Dexsil Clor-N-Soil PCB Screening Kit, and the Dexsil L2000 PCB/Chloride Analyzer. The Dexsil Clor-N-Soil PCB Screening Kit extr...

  5. Embedded polymer optical data highways for board and back-plane applications

    NASA Astrophysics Data System (ADS)

    Li, Yao; Popelek, Jan

    2000-11-01

    Bandwidth incompatibility between a central processing unit (CPU) and printed circuit board (PCB) within a computer system has been a long noted problem. Physics and material sciences suggest that the problem could become worse before getting solved. This is fundamentally due to nature of propagation of electric signals in very large scale integration of conductive wires. The market has witnessed a rapid increase in chip level clock frequency (for a mainstream PC) from 100 MHz few years ago to 800 MHz nowadays. The PC bus bandwidth, however, for the same time span, grew only from 33 MHz to 100 MHz. Although the widely anticipated adoption of 133 MHz is on its way, any serious technical challenges remain. Such a large magnitude of bandwidth discrepancy between the chip and board levels has prompted Intel Corp. to aggressively invest into various technologies to increase speed at board level so that the performance of its future generation of faster and more powerful CPU chips can be effectively utilized. Rambus, Inc. with a strong backing from Intel has come up with a faster memory bus technology that can increase the bus speed several times. Competitions from sampling a data bus at both clock signal edges using the so-called double data rate (DDR) technology are also making their strides. However, high-speed electric signals in densely packed conductive wiring structures inevitably generate the so-called electromagnetic interference among each others. Tougher challenges lie ahead for future generations of large bandwidth interconnect technology at the board level.

  6. Measuring circuit

    DOEpatents

    Sun, Shan C.; Chaprnka, Anthony G.

    1977-01-11

    An automatic gain control circuit functions to adjust the magnitude of an input signal supplied to a measuring circuit to a level within the dynamic range of the measuring circuit while a log-ratio circuit adjusts the magnitude of the output signal from the measuring circuit to the level of the input signal and optimizes the signal-to-noise ratio performance of the measuring circuit.

  7. Atmospheric PCB congeners across Chicago

    PubMed Central

    HU, DINGFEI; LEHMLER, HANS-JOACHIM; MARTINEZ, ANDRES; WANG, KAI; HORNBUCKLE, KERI C.

    2010-01-01

    We have measured PCBs in 184 air samples collected at 37 sites in the city of Chicago using an innovative system of high-volume air samplers mounted on two health clinic vans. Here we describe results of sampling conducted from November 2006 to November 2007. The samples were analyzed for all 209 PCB congeners using a gas chromatograph with tandem mass spectrometry (GC-MS/MS). The ΣPCBs (sum of 169 peaks) in Chicago ranged from 75 pg m−3 to 5500 pg m−3 and primarily varied as a function of temperature. The congener patterns are surprisingly similar throughout the city even though the temperature-corrected concentrations vary by more than an order of magnitude. The average profile resembles a mixture of Aroclor 1242 and Aroclor 1254, and includes many congeners that have been identified as being aryl hydrocarbon receptor (AhR) agonists (dioxin-like) and/or neurotoxins. The toxic equivalence (TEQ) and neurotoxic equivalence (NEQ) in air were calculated and investigated for their spatial distribution throughout the urban-industrial complex of Chicago. The NEQ concentrations are linearly correlated with ΣPCBs while the TEQ concentrations are not predictable. The findings of this study suggest that airborne PCBs in Chicago are widely present and elevated in residential communities; there are multiple sources rather than one or a few locations of very high emissions; the emission includes congeners associated with dioxin-like and neurotoxic effects and congeners associated with unidentified sources. PMID:21918637

  8. Congenital PCB poisoning: a reevaluation

    SciTech Connect

    Miller, R.W.

    1985-05-01

    A review of the literature reveals a need to clarify the pathologic physiology of congenital polychlorinated biphenyl (PCB) poisoning, which is characterized by intrauterine growth retardation, brown staining of the skin and mucous membranes as in Addison's disease, natal teeth, widely open fontanelles and sagittal suture and apparent overgrowth of the gingiva. The skull abnormalities may represent irregular calcification, with natal teeth appearing because the bone of the mandible is penetrated more easily than usual. Some fetuses were poisoned at the time the mothers ingested the oil; others were affected in the subsequent years from residual contamination in the mothers' bodies. The misadventure in Japan was repeated in Taiwan in 1979. The seven congenital cases in Taiwan reported thus far seem to differ from those in Japan. In Taiwan the noses were somewhat black, two of the infants did not have low birth weight and the osseous abnormalities of the skull and gingival hyperplasia were not observed. Systematic followup studies should be made in Taiwan of the children born within 2 years of maternal poisoning with PCBs. Special attention should be given to age at first dentition and skull-X-rays for spotty calcification, among other measures of physical, neurologic and intellectual development.

  9. Visualization of circuit card electromagnetic fields

    NASA Astrophysics Data System (ADS)

    Zwillinger, Daniel

    1995-01-01

    Circuit boards are used in nearly every electrical appliance. Most board failures cause differing currents in the circuit board traces and components. This causes the circuit board to radiate a differing electromagnetic field. Imaging this radiated field, which is equivalent to measuring the field, could be used for error detection. Using estimates of the fields radiated by a low power digital circuit board, properties of known materials, and available equipment, we determined how well the following technologies could be used to visualize circuit board electromagnetic fields (prioritized by promise): electrooptical techniques, magnetooptical techniques, piezoelectric techniques, thermal techniques, and electrodynamic force technique. We have determined that sensors using the electrooptical effect (Pockels effect) appear to be sufficiently sensitive for use in a circuit board imaging system. Sensors utilizing the magnetooptical effect may also be adequate for this purpose, when using research materials. These sensors appear to be capable of achieving direct broadband measurements. We also reviewed existing electromagnetic field sensors. Only one of the sensors (recently patented) was specifically designed for circuit board measurements.

  10. [Toxicity of polychlorinated biphenyls (PCB)--indoor air pollution by PCB-containing durable elastic sealants].

    PubMed

    Ludewig, S; Kruse, H; Wassermann, O

    1993-01-01

    The widespread use of the persistent and lipophilic polychlorinated biphenyls (PCB) e.g. in electrical engineering, hydraulics and chemistry of the polymers, caused their ubiquitous distribution and accumulation in food chains. Chronic toxicity in humans is known from several incidents of PCB contaminated food. Dose-response experiences, however, remain uncertain due to the technical grade of PCB as a complex mixture of about 150 congeners and many impurities, like polychlorinated dibenzodurans. Some information on the toxicity of a few PCB congeners is available from animal experiments. Large differences in enzyme-inductive efficacy between the PCB congeners rendered the use of toxicity equivalent factors (related to 2,3,7,8-TCDD, "Seveso-Dioxin") necessary. For risk assessment, the use of "sum of PCB", calculated from questionable determinations of 6 minor toxic congeners, is insufficient. Serious problems arise from evaporation of PCB e.g. in technical rooms of telephone companies (in Germany: Telekom) and generally, from sealing materials in buildings. The German Federal Health Administration, BGA, recommends 300 ng total PCB/m3 indoor air as "precautionary value". Since neither the extreme differences in toxicity of the congeners nor bioaccumulation are taken into account, this recommendation of BGA can not be justified any longer. PMID:8219584

  11. PCB trial burn in a modular, movable incinerator

    SciTech Connect

    Acharya, P. ); Reiter, B.A. )

    1987-01-01

    The authors discuss a trial burn conducted from March 11-13, 1986, in El Dorado, Arkanasas, of an MWP-2000 Modular Incinerations system to destroy PCB liquids, PCB items and PCB-contaminated solids in conformance with TSCA requirements. MWP-2000 has 4 main process modules--Rotary kiln, capable of destroying liquid PCBs and PCB-contaminated dirt; secondary combustor, capable of destroying high-level PCB liquids; heat recovery system, generating steam to drive the system's prime mover; and pollution control system that removes acid gases and fine particulates from the gas stream. The trial burn consisted of 5 separate tests. The first 3 tests were replicate tests. In these tests PCB-contaminated soils, having a PCB content of 1.8%, and PCB-contaminated fuel, having a content of 60%, were burned simultaneously in the secondary combustor. In the fourth test, PCB liquids, having a PCB content of 61%, were burned in the secondary combustor while the kiln was not operated. In the fifth test, pre-shredded capacitors having a PCB content of 18% were fed to the kiln and PCB liquids having a PCB concentration of 64% were fed to the secondary combustor. Trial burn results clearly demonstrate that a DREs of 99.999999% were achieved. HCl removal efficiencies of 99.9% were achieved. Total particulate emissions of 0.01-0.02 gr/DSCF were achieved. PCB contamination in the kiln ash and effluent residuals of <2 ppm were achieved.

  12. High Surface-Enhanced Raman Scattering (SERS) Amplification Factor Obtained with Silver Printed Circuit Boards and the Influence of Phenolic Resins for the Characterization of the Pesticide Thiram.

    PubMed

    Silva de Almeida, Francylaine; Bussler, Larissa; Marcio Lima, Sandro; Fiorucci, Antonio Rogério; da Cunha Andrade, Luis Humberto

    2016-07-01

    In this work, low-cost substrates with rough silver surfaces were prepared from commercial copper foil-covered phenolic board (CPB) and an aqueous solution of AgNO3, and were used for surface-enhanced Raman scattering (SERS) and surface-enhanced resonance Raman scattering (SERRS) measurements. A maximum SERS amplification factor of 1.2 × 10(7) was obtained for Rhodamine 6G (R6G), and use of the CPB resulted in a detection limit for Thiram pesticide of 0.5 µmol L(-1) The minimum detection level was limited by residual traces of phenolic groups that originated from the substrate resin, which became solubilized in the aqueous Ag(+) solution. It was found that the bands corresponding to the impurities had less influence in the Thiram analysis, which could be explained by the high affinity of sulfur for Ag surfaces. The influence of impurities in the SERS analyses therefore depended on the linkage between the rough silver surface and the analyte. The findings demonstrated the ease and effectiveness of using CPB to prepare a nanostructured surface for SERS. PMID:27279502

  13. Polychlorinated biphenyls PCB 52, PCB 180, and PCB 138 impair the glutamate-nitric oxide-cGMP pathway in cerebellar neurons in culture by different mechanisms.

    PubMed

    Llansola, Marta; Montoliu, Carmina; Boix, Jordi; Felipo, Vicente

    2010-04-19

    Polychlorinated biphenyls (PCBs) are persistent organic pollutants that accumulate in the food chain and are present in human blood and milk. Children born to mothers exposed to PCBs show cognitive deficits, which are reproduced in rats perinatally exposed to PCBs. It has been proposed that PCB-induced cognitive impairment is due to impairment of the glutamate-nitric oxide (NO)-cGMP pathway. The aim of the present work was to assess whether chronic exposure to the nondioxin-like PCB52, PCB138, or PCB180 alters the function of this pathway in primary cultures of rat cerebellar neurons and to assess whether different PCBs have similar or different mechanisms of action. PCB180 and PCB138 impair the function of the glutamate-NO-cGMP pathway at nanomolar concentrations, and PCB52 impairs the function of the glutamate-NO-cGMP pathway at micromolar concentrations. The mechanisms by which different PCBs impair the function of the glutamate-NO-cGMP pathway are different. Each PCB affects the pathway at more than one step but with different potency and, for some steps, in opposite ways. Exposure to the PCBs alters the basal concentrations of intracellular calcium, NO, and cGMP. The three PCBs increase NO; however, PCB52 and PCB138 increase basal cGMP, while PCB180 decreases it. PCB52 and PCB138 decrease the activation of soluble guanylate cyclase by NO, and PCB180 increases it. Long-term exposure to PCB52, PCB180, or PCB138 reduces the activation of NO synthase and the whole glutamate-NO-cGMP pathway in response to activation of N-methyl-d-aspartate receptors. The EC(50) was 300 nM for PCB52 and 2 nM for PCB138 or PCB180. These results show that chronic exposure to nondioxin like PCBs impairs the function of the glutamate-NO-cGMP pathway in cerebellar neurons by different mechanisms and with different potencies. Impaired function of this pathway would contribute to the cognitive alterations induced by perinatal exposure to PCBs in humans. PMID:20297801

  14. Design and test of a robust multi-channel programmable sensor interface circuit for use in extreme environments

    SciTech Connect

    Van Cutsem, K.; De Cock, W.; Tavernier, S.

    2011-07-01

    This article describes the design of a sensor interface circuit for the amplification of voltages and currents. The created PCB was tested at high temperatures and under gamma irradiation. Two different operational amplifiers were compared. (authors)

  15. Bayesian Monte Carlo updating of Hudson River PCB model using water column PCB measurements

    SciTech Connect

    Zhang, S.; Toll, J.; Cothern, K.

    1995-12-31

    The authors have developed prior probability distributions for model parameters and terms describing physico-chemical processes in sediment and water column models of PCB fate in a segment of the lower Hudson River, and performed importance analyses to identify the key uncertainties affecting the models` predictive power. In this work, the authors employ field measurements of the mean total water column PCB concentration from nearby river segments to refine the prior probability distributions for the important parameters and terms in the water column PCB model, using Bayesian Monte Carlo analysis. The principal objectives of the current work are (1) to implement Bayesian Monte Carlo analysis, to demonstrate the technique and evaluate its potential benefits, and (2) to improve the parameterization of the water column PCB model on the basis of site-specific PCB concentration data. The Bayesian updating procedure resulted in improved estimates of PCB mass loading and re-suspension velocity terms, but posteriors for three other key parameters -- settling velocity and particulate PCB fractions in the water column and surface sediments -- were unaffected by the information extracted from the new field data. In addition, the authors found that some of the high posterior probability parameter vectors, though mathematically plausible, were physically implausible, as a consequence of the unrealistic (but common) Monte Carlo assumption that the model`s parameters are independently distributed. The implications of this and other findings are discussed.

  16. Board Saver for Use with Developmental FPGAs

    NASA Technical Reports Server (NTRS)

    Berkun, Andrew

    2009-01-01

    A device denoted a board saver has been developed as a means of reducing wear and tear of a printed-circuit board onto which an antifuse field programmable gate array (FPGA) is to be eventually soldered permanently after a number of design iterations. The need for the board saver or a similar device arises because (1) antifuse-FPGA design iterations are common and (2) repeated soldering and unsoldering of FPGAs on the printed-circuit board to accommodate design iterations can wear out the printed-circuit board. The board saver is basically a solderable/unsolderable FPGA receptacle that is installed temporarily on the printed-circuit board. The board saver is, more specifically, a smaller, square-ring-shaped, printed-circuit board (see figure) that contains half via holes one for each contact pad along its periphery. As initially fabricated, the board saver is a wider ring containing full via holes, but then it is milled along its outer edges, cutting the via holes in half and laterally exposing their interiors. The board saver is positioned in registration with the designated FPGA footprint and each via hole is soldered to the outer portion of the corresponding FPGA contact pad on the first-mentioned printed-circuit board. The via-hole/contact joints can be inspected visually and can be easily unsoldered later. The square hole in the middle of the board saver is sized to accommodate the FPGA, and the thickness of the board saver is the same as that of the FPGA. Hence, when a non-final FPGA is placed in the square hole, the combination of the non-final FPGA and the board saver occupy no more area and thickness than would a final FPGA soldered directly into its designated position on the first-mentioned circuit board. The contact leads of a non-final FPGA are not bent and are soldered, at the top of the board saver, to the corresponding via holes. A non-final FPGA can readily be unsoldered from the board saver and replaced by another one. Once the final FPGA design

  17. PCB biodegradation: Laboratory studies transitioned into the field

    SciTech Connect

    Abramowicz, D.A.

    1993-12-31

    Two distinct bacterial systems are known to be involved in PCB biotransformations. Both aerobic PCB biodegradation (Oxidative attack) and anaerobic PCB dechlorination (reductive attack) have been demonstrated in the laboratory. These results have been successfully reproducted in recent experiments performed in aquatic sediments. In 1991, GE performed a large scale test of in situ aerobic PCB biodegradation in the Upper Hudson River. The experiments involved six sealed caissons (six feet in diameter) lowered into Aroclor 1242 contaminated sediments that had already undergone extensive anaerobic PCB dechlorination. Stimulation of indigenous PCB-degrading microorganisms resulted in >50% biodegradation over 10 weeks. A large scale stimulation of in situ anaerobic PCB dechlorination in Housatonic River sediments contaminated with untransformed Aroclor 1260 was initiated in 1992. The experiments similarly involve six sealed caissons (six feet in diameter) lowered into contaminated sediments to investigate new methods developed to accelerate PCB dechlorination in the field. Preliminary results from this ongoing field test will be discussed.

  18. Cytochrome c adducts with PCB quinoid metabolites.

    PubMed

    Li, Miao; Teesch, Lynn M; Murry, Daryl J; Pope, R Marshal; Li, Yalan; Robertson, Larry W; Ludewig, Gabriele

    2016-02-01

    Polychlorinated biphenyls (PCBs) are a group of 209 individual congeners widely used as industrial chemicals. PCBs are found as by-products in dye and paint manufacture and are legacy, ubiquitous, and persistent as human and environmental contaminants. PCBs with fewer chlorine atoms may be metabolized to hydroxy- and dihydroxy-metabolites and further oxidized to quinoid metabolites both in vitro and in vivo. Specifically, quinoid metabolites may form adducts on nucleophilic sites within cells. We hypothesized that the PCB-quinones covalently bind to cytochrome c and, thereby, cause defects in the function of cytochrome c. In this study, synthetic PCB quinones, 2-(4'-chlorophenyl)-1,4-benzoquinone (PCB3-pQ), 4-4'-chlorophenyl)-1,2-benzoquinone (PCB3-oQ), 2-(3', 5'-dichlorophenyl)-1,4-benzoquinone, 2-(3',4', 5'-trichlorophenyl)-1,4-benzoquinone, and 2-(4'-chlorophenyl)-3,6-dichloro-1,4-benzoquinone, were incubated with cytochrome c, and adducts were detected by liquid chromatography-mass spectrometry (LC-MS) and matrix-assisted laser desorption/ionization time of flight mass spectrometry (MALDI TOF). Sodium dodecyl sulfate polyacrylamide gel electrophoresis (SDS-PAGE) was employed to separate the adducted proteins, while trypsin digestion and liquid chromatography-tandem mass spectrometry (LC-MS/MS) were applied to identify the amino acid binding sites on cytochrome c. Conformation change of cytochrome c after binding with PCB3-pQ was investigated by SYBYL-X simulation and cytochrome c function was examined. We found that more than one molecule of PCB-quinone may bind to one molecule of cytochrome c. Lysine and glutamic acid were identified as the predominant binding sites. Software simulation showed conformation changes of adducted cytochrome c. Additionally, cross-linking of cytochrome c was observed on the SDS-PAGE gel. Cytochrome c was found to lose its function as electron acceptor after incubation with PCB quinones. These data provide evidence that the covalent

  19. 46 CFR 148.435 - Electrical circuits in cargo holds.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... reference to this section, each electrical circuit terminating in a cargo hold containing the material must... disconnection must be marked to prevent the circuit from being reenergized while the material is on board....

  20. 46 CFR 148.435 - Electrical circuits in cargo holds.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... reference to this section, each electrical circuit terminating in a cargo hold containing the material must... disconnection must be marked to prevent the circuit from being reenergized while the material is on board....

  1. 46 CFR 148.435 - Electrical circuits in cargo holds.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... reference to this section, each electrical circuit terminating in a cargo hold containing the material must... disconnection must be marked to prevent the circuit from being reenergized while the material is on board....

  2. 46 CFR 148.435 - Electrical circuits in cargo holds.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... reference to this section, each electrical circuit terminating in a cargo hold containing the material must... disconnection must be marked to prevent the circuit from being reenergized while the material is on board....

  3. 40 CFR 761.274 - Reporting PCB concentrations in samples.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 32 2013-07-01 2013-07-01 false Reporting PCB concentrations in... COMMERCE, AND USE PROHIBITIONS Cleanup Site Characterization Sampling for PCB Remediation Waste in Accordance with § 761.61(a)(2) § 761.274 Reporting PCB concentrations in samples. (a) Report all...

  4. 40 CFR 761.274 - Reporting PCB concentrations in samples.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 31 2014-07-01 2014-07-01 false Reporting PCB concentrations in... COMMERCE, AND USE PROHIBITIONS Cleanup Site Characterization Sampling for PCB Remediation Waste in Accordance with § 761.61(a)(2) § 761.274 Reporting PCB concentrations in samples. (a) Report all...

  5. 40 CFR 761.274 - Reporting PCB concentrations in samples.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 32 2012-07-01 2012-07-01 false Reporting PCB concentrations in... COMMERCE, AND USE PROHIBITIONS Cleanup Site Characterization Sampling for PCB Remediation Waste in Accordance with § 761.61(a)(2) § 761.274 Reporting PCB concentrations in samples. (a) Report all...

  6. 40 CFR 761.125 - Requirements for PCB spill cleanup.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 32 2012-07-01 2012-07-01 false Requirements for PCB spill cleanup..., AND USE PROHIBITIONS PCB Spill Cleanup Policy § 761.125 Requirements for PCB spill cleanup. (a... minimize reporting burdens on governments as well as the regulated community. (i) Where a spill...

  7. 40 CFR 761.125 - Requirements for PCB spill cleanup.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 40 Protection of Environment 30 2010-07-01 2010-07-01 false Requirements for PCB spill cleanup..., AND USE PROHIBITIONS PCB Spill Cleanup Policy § 761.125 Requirements for PCB spill cleanup. (a... minimize reporting burdens on governments as well as the regulated community. (i) Where a spill...

  8. 40 CFR 761.125 - Requirements for PCB spill cleanup.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 32 2013-07-01 2013-07-01 false Requirements for PCB spill cleanup..., AND USE PROHIBITIONS PCB Spill Cleanup Policy § 761.125 Requirements for PCB spill cleanup. (a... minimize reporting burdens on governments as well as the regulated community. (i) Where a spill...

  9. 40 CFR 761.125 - Requirements for PCB spill cleanup.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 31 2014-07-01 2014-07-01 false Requirements for PCB spill cleanup..., AND USE PROHIBITIONS PCB Spill Cleanup Policy § 761.125 Requirements for PCB spill cleanup. (a... minimize reporting burdens on governments as well as the regulated community. (i) Where a spill...

  10. 40 CFR 761.125 - Requirements for PCB spill cleanup.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 40 Protection of Environment 31 2011-07-01 2011-07-01 false Requirements for PCB spill cleanup..., AND USE PROHIBITIONS PCB Spill Cleanup Policy § 761.125 Requirements for PCB spill cleanup. (a... minimize reporting burdens on governments as well as the regulated community. (i) Where a spill...

  11. DEMONSTRATION BULLETIN: ENVIROGARD™ PCB TEST KIT - MILLIPORE, INC.

    EPA Science Inventory

    The EnviroGard™ polychlorinated biphenyl (PCB) immunoassay test kit rapidly analyzes for PCB concentrations in soils. Soil sample extracts are added to test tubes coated with antibodies that bind PCB molecules. The excess soil extracts are washed out of the tubes after incubat...

  12. Electronics. Module 4: Circuit Construction Techniques. Instructor's Guide.

    ERIC Educational Resources Information Center

    Slack, Don

    This guide contains instructor's materials for a three-unit secondary school course on circuit construction techniques. The units are breadboarding circuits, solder/desolder circuits, and printed circuit board repair. The document begins with advice on its use and a cross-referenced table of instructional materials that show which materials in the…

  13. In utero exposure to environmentally relevant concentrations of PCB 153 and PCB 118 disrupts fetal testis development in sheep.

    PubMed

    Krogenæs, Anette K; Ropstad, Erik; Gutleb, Arno C; Hårdnes, Nina; Berg, Vidar; Dahl, Ellen; Fowler, Paul A

    2014-01-01

    Polychlorinated biphenyls (PCB) are environmental pollutants linked to adverse health effects including endocrine disruption and disturbance of reproductive development. This study aimed to determine whether exposure of pregnant sheep to three different mixtures of PCB 153 and PCB 118 affected fetal testis development. Ewes were treated by oral gavage from mating until euthanasia (d 134), producing three groups of fetuses with distinct adipose tissue PCB levels: high PCB 153/low PCB 118 (n = 13), high PCB 118/low PCB 153 (n = 14), and low PCB 153/low PCB 118 (n = 14). Fetal testes and blood samples were collected for investigation of testosterone, testis morphology, and testis proteome. The body weight of the offspring was lower in the high PCB compared to the low PCB group, but there were no significant differences in testis weight between groups when corrected for body weight. PCB exposure did not markedly affect circulating testosterone. There were no significant differences between groups in number of seminiferous tubules, Sertoli cell only tubules, and ratio between relative areas of seminiferous tubules and interstitium. Two-dimensional (2D) gel-based proteomics was used to screen for proteomic alterations in the high exposed groups relative to low PCB 153/low PCB 118 group. Twenty-six significantly altered spots were identified by liquid chromatography (LC)-mass spectroscopy (MS)/MS. Changes in protein regulation affected cellular processes as stress response, protein synthesis, and cytoskeleton regulation. The study demonstrates that in utero exposure to different environmental relevant PCB mixtures exerted subtle effects on developing fetal testis proteome but did not significantly disturb testis morphology and testosterone production. PMID:24754397

  14. PUZZLE - A program for computer-aided design of printed circuit artwork

    NASA Technical Reports Server (NTRS)

    Harrell, D. A. W.; Zane, R.

    1971-01-01

    Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

  15. REMEDIATION OF PCB IN CONTAMINATED SOIL

    EPA Science Inventory

    A pilot-scale study will be conducted to evaluate the bioremedial techniques of natural attenuation, sequenced anaerobic/aerobic treatment, and addition of a commercially available microbial amendment product for use in treating PCB contaminated soils at Air Force Base sites. Th...

  16. Hybrid stretchable circuits on silicone substrate

    SciTech Connect

    Robinson, A. Aziz, A.; Liu, Q.; Suo, Z.; Lacour, S. P.

    2014-04-14

    When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate—a silicone matrix carrying concentric rigid disks—ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.

  17. ADDER CIRCUIT

    DOEpatents

    Jacobsohn, D.H.; Merrill, L.C.

    1959-01-20

    An improved parallel addition unit is described which is especially adapted for use in electronic digital computers and characterized by propagation of the carry signal through each of a plurality of denominationally ordered stages within a minimum time interval. In its broadest aspects, the invention incorporates a fast multistage parallel digital adder including a plurality of adder circuits, carry-propagation circuit means in all but the most significant digit stage, means for conditioning each carry-propagation circuit during the time period in which information is placed into the adder circuits, and means coupling carry-generation portions of thc adder circuit to the carry propagating means.

  18. Environmental and health hazards from recycling PCB sources

    SciTech Connect

    Greichus, Y.A.; Dohman, B.A.

    1980-06-01

    Soil, corn plants, foliage, earthworms, and small rodents from areas surrounding two electrical salvage companies involved in reconditioning old transformers had unusually high levels of PCB's. Levels decreased as distance from the factories increased. PCB's were dispersed into the air through incineration of waste oils; water and soil contamination was caused by runoff from the factories. PCB's found to be present in the contaminated areas and in the waste oil closely resembled Aroclor 1260. Soil samples taken from depths of 2-4 in showed degradation of some PCB isomers. PCB concentrations in corn cobs and kernels were 0.05 ppm, whereas leaves contained PCB levels of up to 2.2 ppm. PCB levels in earthworms and small rodents collected near the factories were considerably higher than levels in the same types of animals collected from other areas. (10 references, 2 tables)

  19. Adhesive-backed terminal board eliminates mounting screws

    NASA Technical Reports Server (NTRS)

    1965-01-01

    Low-profile terminal board is used in dense electronic circuits where mounting and working space is limited. The board has a thin layer of pressure-sensitive adhesive backing which eliminates the need for mounting screws.

  20. View southwest of model board and operator's station #2; cabinet ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    View southwest of model board and operator's station #2; cabinet in foreground houses at supervisory board and control switches for circuit breakers - Thirtieth Street Station, Power Director Center, Thirtieth & Market Streets in Amtrak Railroad Station, Philadelphia, Philadelphia County, PA

  1. PCB concentrations of lake whitefish (Coregonus clupeaformis) vary by sex

    USGS Publications Warehouse

    Madenjian, Charles P.; Ebener, Mark P.; Sepulveda, Maria S.

    2015-01-01

    We determined whole-fish polychlorinated biphenyl (PCB) concentrations in 26 female lake whitefish (Coregonus clupeaformis) and 34 male lake whitefish from northern Lake Huron. In 5 of the 26 female lake whitefish, we also determined PCB concentrations in the somatic tissue and ovaries. In addition, bioenergetics modeling was used to determine the contribution of the growth dilution effect to the observed difference in PCB concentrations between the sexes. Whole-fish PCB concentrations for females and males averaged 60 ng/g and 80 ng/g, respectively; thus males were 34% higher in PCB concentration compared with females. Based on the PCB determinations in the somatic tissue and ovaries, we predicted that PCB concentration of females would increase by 2.5%, on average, immediately after spawning due to release of eggs. Thus, the change in PCB concentration due to release of eggs did not explain, to any degree, the higher PCB concentrations observed in males compared with females. Bioenergetics modeling results indicated that the growth dilution effect could account for males being only 0.7% higher in PCB concentration compared with females. Thus, the growth dilution effect contributed very little to the observed difference in PCB concentrations between the sexes. We conclude that males were higher than females in PCB concentration most likely due to a higher rate of energy expenditure, stemming from greater activity and a greater resting metabolic rate. A higher rate of energy expenditure leads to a higher rate of food consumption, which, in turn, leads to a higher PCB accumulation rate.

  2. Serum PCB levels and congener profiles among US construction workers

    PubMed Central

    Herrick, Robert F; Meeker, John D; Hauser, Russ; Altshul, Larisa; Weymouth, George A

    2007-01-01

    Background The presence of PCB in caulking (sealant) material found in masonry buildings has been well-documented in several countries. A recent investigation of 24 buildings in the greater Boston area found that 8 buildings had high PCB levels in caulking materials used around window frames and in joints between masonry blocks. Workers removing caulking material have been shown to have elevated serum PCB levels. Methods This project compared serum PCB levels among male workers who installed and/or removed PCB-containing caulking material from buildings in the greater Boston area with reference serum PCB levels from 358 men from the same area. Serum PCB levels were measured in the same laboratory by liquid-liquid extraction, column chromatography clean-up and dual capillary column GC/microECD analysis. Results When the congener profiles were compared between the reference population and the construction workers, the serum levels of the more volatile, lighter PCBs (di-, tri-and tetrachloro, sum of IUPAC# 6–74) were substantially higher among the construction workers. One of the youngest workers had the lowest total serum PCB levels (sum of 57 congeners) of all 6 workers, but the contribution of more volatile (less chlorinated) PCB congeners (#16, 26,28,33,74,66, and 60) was markedly higher than in other 5 workers and reference men. Only this worker was working on a job that involved removing PCB caulking at the time of the blood sampling. Conclusion While the results of this pilot study are based upon small numbers (6 construction workers who handled PCB caulking), the serum PCB levels among the construction workers exceed the referents. Comparison of the congener profiles suggests that there are substantial differences between the construction workers and the general population samples. These differences, and the similarities of profiles among the construction workers strongly suggest that occupational contact with caulking material can be a major source of PCB

  3. PCB levels in human fluids: Sheboygan cohort study, Sheboygan maternal/infant PCB study

    SciTech Connect

    Smith, B.J.

    1983-01-01

    The PCB problem in the United States today has been raised to national concern with the discovery of PCBs in human breast milk above the highest recommended level for any commercially sold flood. This study, done in Sheboygan, Wisconsin in 1980-81, was to determine if (1) there were high levels of PCBs in mother's serum and breast milk in the vicinity of a PCB spill, (2) if these levels could be linked to the women's consumption of local fish, and (3) if the infants born to these women in the study showed signals of impaired health, growth, and development. Seventy-three women participated in the study, 62 who were breast-feeding their children, and 11 who were bottle-feeding their children. The serum PCB levels for the study population ranged from 1.29 to 14.90 ppb with a mean of 5.76 ppb. The breast milk PCB levels for the women who were breast feeding was 0.29 to 4.04 ppm with a mean of 1.13 ppm. The infants showed signs of impaired health as a result of in utero exposure to PCBs. No negative effects from exposure to breast milk PCB could be discerned up to 4 months postpartum.

  4. AQUEOUS CLEANING OF PRINTED CIRCUIT BOARD STENCILS

    EPA Science Inventory

    The USEPA through NRMRL has partnered with the California Dept. of Toxic Substance Control under an ETV Pilot Project to verigy polllution prevention, recycling and waste treatment technologies. One of the projects selected for verification was the ultrasonic aqueous cleaning tec...

  5. Design, fabrication, and characterization of archaeal tetraether free-standing planar membranes in a PDMS- and PCB-based fluidic platform.

    PubMed

    Ren, Xiang; Liu, Kewei; Zhang, Qingwei; Noh, Hongseok Moses; Kumbur, E Caglan; Yuan, Wenqiao Wayne; Zhou, Jack G; Chong, Parkson Lee-Gau

    2014-08-13

    The polar lipid fraction E (PLFE) isolated from the thermoacidophilic archaeon Sulfolobus acidocaldarius contains exclusively bipolar tetraether lipids, which are able to form extraordinarily stable vesicular membranes against a number of chemical, physical, and mechanical stressors. PLFE liposomes have thus been considered appealing biomaterials holding great promise for biotechnology applications such as drug delivery and biosensing. Here we demonstrated that PLFE can also form free-standing "planar" membranes on micropores (∼100 μm) of polydimethylsiloxane (PDMS) thin films embedded in printed circuit board (PCB)-based fluidics. To build this device, two novel approaches were employed: (i) an S1813 sacrificial layer was used to facilitate the fabrication of the PDMS thin film, and (ii) oxygen plasma treatment was utilized to conveniently bond the PDMS thin film to the PCB board and the PDMS fluidic chamber. Using electrochemical impedance spectroscopy, we found that the dielectric properties of PLFE planar membranes suspended on the PDMS films are distinctly different from those obtained from diester lipid and triblock copolymer membranes. In addition to resistance (R) and capacitance (C) that were commonly seen in all the membranes examined, PLFE planar membranes showed an inductance (L) component. Furthermore, PLFE planar membranes displayed a relatively large membrane resistance, suggesting that, among the membranes examined, PLFE planar membrane would be a better matrix for studying channel proteins and transmembrane events. PLFE planar membranes also exhibited a sharp decrease in phase angle with the frequency of the input AC signal at ∼1 MHz, which could be utilized to develop sensors for monitoring PLFE membrane integrity in fluidics. Since the stability of free-standing planar lipid membranes increases with increasing membrane packing tightness and PLFE lipid membranes are more tightly packed than those made of diester lipids, PLFE free

  6. PCB's in Suburban Watershed, Reston, Va

    USGS Publications Warehouse

    Martell, J.M.; Rickert, D.A.; Siegel, F.R.

    1975-01-01

    Polychlorinated biphenyl concentrations in Lake Anne basin increased from water (<0.05-0.2 ppb), to bed sediment (<2.5-105 ppb), to fish (140-700 ppb) in an average ratio of 1:500:3000. The highest concentrations were observed in the lake, which is 10 years old, and receives no sewage or industrial waste discharges. Evidence indicates that the polvchlorinated biphenyls (PCB's) originate from diffuse sources associated with urban development and living.

  7. Decontamination and disposal of PCB wastes.

    PubMed Central

    Johnston, L E

    1985-01-01

    Decontamination and disposal processes for PCB wastes are reviewed. Processes are classed as incineration, chemical reaction or decontamination. Incineration technologies are not limited to the rigorous high temperature but include those where innovations in use of oxident, heat transfer and residue recycle are made. Chemical processes include the sodium processes, radiant energy processes and low temperature oxidations. Typical processing rates and associated costs are provided where possible. PMID:3928363

  8. PCB augments LH-induced progesterone synthesis

    SciTech Connect

    Fuller, G.B.; Knauf, V.; Mueller, W.; Hobson, W.C.

    1980-07-01

    A great deal of attention has been focused on various environmental contaminants and their toxic effects on mammalian systems. Important among the compounds studied are the organochlorine pesticides and the polychlorinated biphenyls (PCB). The accumulation and persistence of these contaminants in the biosphere has accentuated their public health significance and limited their widespread commercial utilization. Changes in reproductive function have proven to be one of the more detrimental effects of chronic exposure to PCB or hexachlorobenzene (HCB). Reports in the literature have implicated potential target tissues such as the ovary, steroid-hydroxylating enzymes in the liver, and hypothalamus. The present experiment was designed to study the effect of acute in-vivo exposure to PCB (Clophen A-30) and HCB on LH-induced progesterone synthesis in-vitro. In order to obtain large amounts of luterin tissue relatively uniform in nature, the PMS-HCG primed immature rat model was utilized. This priming procedure, as described by Parlow (1958), results in a pronounced capacity for progesterone synthesis by the excessive numbers of induced corpora.

  9. Development of toxic equivalency factors for PCB congeners and the assessment of TCDD and PCB mixtures in rainbow trout

    SciTech Connect

    Newsted, J.L.; Giesy, J.P.; Crawford, R.A.; Jones, P.D.; Ankley, G.T.; Tillitt, D.E.; Gooch, J.W.; Denison, M.S.

    1995-05-01

    This study was undertaken to evaluate the relationship between mammalian and piscine 2,3,7,8-tetrachlorodibenzo-p-dioxin (TCDD) toxic equivalency factors (TEFs) for PCBs, based on induction of CYP1A enzyme activity, catalytic protein, and mRNA. Rainbow trout administered a single i.p. injection of TCDD had an average ({+-}SD) ED50 of 0.91 {+-} 0.14 {mu}g TCDD/kg for induction of ethoxyresorufin O-deethylase (EROD) activity. Ortho-substituted PCB congeners 2,3,3{prime},4,4{prime}-pentachlorobiphenyl (PCB 105), 2,3{prime},4,4{prime},5-pentachlorobiphenyl (PCB 118), 2,3,3{prime},4,4{prime},5-hexachlorobiphenyl (PCB 156), and 2,2{prime}3,4,4{prime},5-hexachlorobiphenyl (PCB 138) did not induce CYP1A activity in rainbow trout. Only three non-ortho-substituted PCBs, i.e., 3,3{prime},4,4{prime}-tetrachlorobiphenyl (PCB 77), 3,3{prime},4,4{prime},5-pentachlorobiphenyl (PCB 126), and 3,3{prime},4,4{prime},5,5{prime}-hexachlorobiphenyl (PCB 169) induced CYP1A enzyme activity, protein, and mRNA. The ED50s for induction of EROD activity were calculated as 134, 5.82, and 93.7 {mu}g/kg for PCB 77, PCB 126, and PCB 169, respectively. The TCDD-TEFs based on EROD activity were 0.0006, 0.0014, and 0.0003 for PCB 77, PCB 126, and PCB 169, respectively. Binary mixtures of TCDD and three PCBs were also evaluated. Based on EROD activity and CYP1A protein, mixtures of TCDD and PCB 77 were slightly greater than additive. Mixtures of TCDD-PCB 156 and TCDD-PCB 126 were slightly less than additive. Results from these studies indicate that mammal-derived TEFs will underestimate the potency of planar chlorinated hydrocarbon mixtures to induce the CYP1A catalytic activity in rainbow trout. Also, while interactions among PCB congeners and TCDD were somewhat equivocal, they did not greatly differ from predicted additive responses.

  10. COVE, MARINA, and the Future of On-Board Processing (OBP) Platforms for CubeSat Science Missions

    NASA Astrophysics Data System (ADS)

    Pingree, P.; Bekker, D. L.; Bryk, M.; DeLucca, J.; Franklin, B.; Hancock, B.; Klesh, A. T.; Meehan, C.; Meshkaty, N.; Nichols, J.; Peay, C.; Rider, D. M.; Werne, T.; Wu, Y.

    2012-12-01

    The CubeSat On-board processing Validation Experiment (COVE), JPL's first CubeSat payload launched on October 28, 2011, features the Xilinx Virtex-5QV Single event Immune Reconfigurable FPGA (SIRF). The technology demonstration mission was to validate the SIRF device running an on-board processing (OBP) algorithm developed to reduce the data set by 2-orders of magnitude for the Multi-angle SpectroPolarimetric Imager (MSPI), an instrument under development at JPL (PI: D. Diner). COVE has a single data interface to the CubeSat flight computer that is used to transfer a static image taken from the CubeSat camera and store it to local memory where the FPGA then reads it to run the algorithm on it. In the next generation COVE design, called MARINA, developed for the GRIFEX CubeSat project, the OBP board is extended, using rigid-flex PCB technology, to provide an interface to a JPL-developed Read-Out Integrated Circuit (ROIC) hybridized to a detector developed by Raytheon. In this configuration the focal plane array (FPA) data can be streamed directly to the FPGA for data processing or for storage to local memory. The MARINA rigid-flex PCB design is integrated with a commercial camera lens to create a 1U instrument payload for integration with a CubeSat under development by the University of Michigan and planned for launch in 2014. In the GRIFEX technology demonstration, the limited on-board storage capacity is filled by high-rate FPA data in less than a second. The system is also limited by the CubeSat downlink data rate and several ground station passes are required to transmit this limited amount of data. While this system is sufficient to validate the ROIC technology on-orbit, the system cannot be operated in a way to perform continuous science observations due to the on-board storage and data downlink constraints. In order to advance the current platform to support sustained science observations, more on-board storage is needed. Radiation tolerant memory

  11. Variation in net trophic transfer efficiencies among 21 PCB congeners

    SciTech Connect

    Madenjian, C.P.; Schmidt, L.J.; Chernyak, S.M.; Elliott, R.F.; Desourcie, T.J.; Quintal, R.T.; Begnoche, L.J.; Hesselberg, R.J.

    1999-11-01

    The authors tested the hypothesis that the efficiency with which fish retain polychlorinated biphenyl (PCB) congeners from their food strongly depends on K{sub ow} and degree of chlorination of the congener. The authors used diet information, determinations of concentrations of individual PCB congeners in both coho salmon (Oncorhynchus kisutch) and their prey, and bioenergetics modeling to estimate the efficiencies with which Lake Michigan coho salmon retain various PCB congeners from their food. The retention efficiency for the tetrachloro congeners averaged 38%, whereas retention efficiencies for higher chlorinated congeners ranged from 43 to 56%. Not including tetrachloro congeners, the authors found neither decreasing nor increasing trends in the efficiencies with which the coho salmon retained the PCB congeners from their food with either increasing K{sub ow} or increasing degree of chlorination of the PCB congeners. The authors concluded that (a) for PCB congeners with 5--8 chlorine atoms/molecule, K{sub ow} and degree of chlorination had little influence on the efficiency with which coho salmon retained the various PCB congeners in their food, and (b) the efficiency with which coho salmon retained tetrachloro PCB congeners in their food appeared to be slightly lower than that for higher chlorinated PCB congeners.

  12. Gender difference in walleye PCB concentrations persists following remedial dredging

    USGS Publications Warehouse

    Madenjian, Charles P.; Jude, David J.; Rediske, Richard R.; O'Keefe, James P.; Noguchi, George E.

    2009-01-01

    Eleven male walleyes (Sander vitreus) and 10 female walleyes from the Saginaw Bay (Lake Huron) population were caught during the spawning run at Dow Dam (Midland, Michigan) in the Tittabawassee River during April 1996, and individual whole-fish polychlorinated biphenyl (PCB) determinations were made. Total PCB concentrations averaged 7.95 and 3.17??mg/kg for males and females, respectively. As part of the Natural Resource Damage Assessment remediation process, contaminated sediments from the Saginaw River, the main tributary to Saginaw Bay, were removed during 2000 and 2001. Total PCB concentrations of 10 male and 10 female walleyes caught at Dow Dam during April 2007 averaged 1.58 and 0.55??mg/kg, respectively. Thus, dredging of the Saginaw River appeared to be effective in reducing PCB concentrations of Saginaw Bay adult walleyes, as both males and females decreased in PCB concentration by more than 80% between 1996 and 2007. However, the ratio of male PCB concentration to female PCB concentration did not decline between 1996 and 2007. This persistent gender difference in PCB concentrations was apparently due to a gender difference in habitat utilization coupled with a persistent spatial gradient in prey fish PCB concentrations from the Saginaw River to Lake Huron.

  13. Variation in net trophic transfer efficiencies among 21 PCB congeners

    USGS Publications Warehouse

    Madenjian, C.P.; Schmidt, L.J.; Chernyak, S.M.; Elliott, R.F.; Desorcie, T.J.; Quintal, R.T.; Begnoche, L.J.; Hesselberg, R.J.

    1999-01-01

    We tested the hypothesis that the efficiency with which fish retain polychlorinated biphenyl (PCB) congeners from their food strongly depends on Kow and degree of chlorination of the congener. We used diet information, determinations of concentrations of individual PCB congeners in both coho salmon (Oncorhynchus kisutch) and their prey, and bioenergetics modeling to estimate the efficiencies with which Lake Michigan coho salmon retain various PCB congeners from their food. The retention efficiency for the tetrachloro congeners averaged 38%, whereas retention efficiencies for higher chlorinated congeners ranged from 43 to 56%. Not including tetrachloro congeners, we found neither decreasing nor increasing trends in the efficiencies with which the coho salmon retained the PCB congeners from their food with either increasing Kow or increasing degree of chlorination of the PCB congeners. We concluded that (a) for PCB congeners with 5−8 chlorine atoms/molecule, Kow and degree of chlorination had little influence on the efficiency with which coho salmon retained the various PCB congeners in their food, and (b) the efficiency with which coho salmon retained tetrachloro PCB congeners in their food appeared to be slightly lower than that for higher chlorinated PCB congeners.

  14. Estimating whole-body fish PCB concentrations from fillet data

    SciTech Connect

    Rigg, D.; Hohreiter, D.; Strause, K.; Brown, M.; Barnes, C.

    1995-12-31

    A study was designed to assess a potentially cost-effective method for generating both types of data from single fish specimens. The method is based on the testable hypothesis that whole-body PCE concentrations are predictable from fillet PCB concentrations and fillet and whole-body lipid concentrations. The study involved the collection of small-mouth bass (Micropterus dolomieui) and carp (Cyprinus carpio) from several locations in the Kalamazoo River (Michigan) watershed to represent a range in PCB exposure. PCB and lipid concentrations were determined in aliquots of homogenized fillets and remaining carcasses. Wet-weight total PCB concentrations in carp ranged from 0.06 to 17 mg/kg in fillets, and from 0.11 to 14 mg/kg for remaining carcass; small-mouth bass ranged from 0.08 to 5.8 mg/kg in fillets, and from 0.21 to 13.2 mg/kg for remaining carcass. Whole-body PCB concentrations predicted using fillet PCB concentrations and fillet and carcass lipid concentrations accounted for 94% and 88% of the variability in measured whole-body small-mouth and whole-body carp concentrations, respectively. Predicted and measured whole-body PCB concentrations had a correlation of 91% for small-mouth bass, and 84% for carp. These results demonstrate that value of the lipid-based model in predicting whole-body PCB concentrations from measured fillet PCB concentrations and lipid concentrations in fillet and remaining carcass.

  15. Low-cost electro-optical package for use with PCB-embedded waveguides

    NASA Astrophysics Data System (ADS)

    Weiss, Jonas; Berger, Christoph; Witzig, Martin; Morf, Thomas; Dangel, Roger; Horst, Folkert; Schmatz, Martin

    2007-09-01

    We present a novel approach for packaging high-speed opto-electronic 12x-array devices in a compact, low-cost package for waveguide-based intra-system links. In order to avoid optical signal loss and crosstalk, the mutual alignment between PCB-embedded multimode waveguides and the opto-electronic components needs to be in the order of 5-10 micrometer, which is an order of magnitude tighter than standard PCB manufacturing tolerances. Our packaging concept uses a combination of passive alignment steps, tolerance stackup reduction and a misalignment-tolerant coupling scheme in order to bridge this gap in a cost competitive way. Using flip-chip technology, the opto-electronic components are placed onto a very thin substrate with holes for the light path. The top side of the 25 μm liquid crystal polymer (LCP) substrate not only provides fast and low-loss electrical connections, but also serves as alignment reference plane for the entire module, avoiding alignment tolerance accumulation over different assembly steps. Openings for the laser beams, passive lens alignment features, centering holes for mechanical alignment pins between module and board and optional MT-guide receptacles are all laser-cut within one single process step, with a precision better than 5 μm. A similar approach is used for the PCB-side optics, and a lens-pair coupling scheme provides for a sufficiently large misalignment tolerance between the package and the PCB. Mechanical rigidity of the package and thermal protection are provided by an epoxy filled aluminum frame. We will present our design considerations, the basic package concept, the actual experimental implementation and characterization results of our first prototype package.

  16. MULTIPLIER CIRCUIT

    DOEpatents

    Thomas, R.E.

    1959-01-20

    An electronic circuit is presented for automatically computing the product of two selected variables by multiplying the voltage pulses proportional to the variables. The multiplier circuit has a plurality of parallel resistors of predetermined values connected through separate gate circults between a first input and the output terminal. One voltage pulse is applied to thc flrst input while the second voltage pulse is applied to control circuitry for the respective gate circuits. Thc magnitude of the second voltage pulse selects the resistors upon which the first voltage pulse is imprcssed, whereby the resultant output voltage is proportional to the product of the input voltage pulses

  17. GATING CIRCUITS

    DOEpatents

    Merrill, L.C.

    1958-10-14

    Control circuits for vacuum tubes are described, and a binary counter having an improved trigger circuit is reported. The salient feature of the binary counter is the application of the input signal to the cathode of each of two vacuum tubes through separate capacitors and the connection of each cathode to ground through separate diodes. The control of the binary counter is achieved in this manner without special pulse shaping of the input signal. A further advantage of the circuit is the simplicity and minimum nuruber of components required, making its use particularly desirable in computer machines.

  18. TRIPPING CIRCUIT

    DOEpatents

    Lees, G.W.; McCormick, E.D.

    1962-05-22

    A tripping circuit employing a magnetic amplifier for tripping a reactor in response to power level, period, or instrument failure is described. A reference winding and signal winding are wound in opposite directions on the core. Current from an ion chamber passes through both windings. If the current increases at too fast a rate, a shunt circuit bypasses one or the windings and the amplifier output reverses polarity. (AEC)

  19. Polychlorinated biphenyls PCB 153 and PCB 126 impair the glutamate-nitric oxide-cGMP pathway in cerebellar neurons in culture by different mechanisms.

    PubMed

    Llansola, Marta; Piedrafita, Blanca; Rodrigo, Regina; Montoliu, Carmina; Felipo, Vicente

    2009-08-01

    Polychlorinated biphenyls (PCBs) are persistent organic pollutants present in human blood and milk. Exposure to PCBs during pregnancy and lactation leads to cognitive impairment in children. Perinatal exposure to PCB 153 or PCB 126 impairs the glutamate-nitric oxide-cGMP pathway in cerebellum in vivo and learning ability in adult rats. The aims of this work were: (1) to assess whether long-term exposure of primary cultures of cerebellar neurons to PCB 153 or PCB 126 reproduces the impairment in the function of the glutamate-nitric oxide-cGMP pathway found in rat cerebellum in vivo; (2) to provide some insight on the steps of the pathway affected by these PCBs; (3) to assess whether the mechanisms of interference of the pathway are different for PCB 126 and PCB 153. Both PCB 153 and PCB 126 increase basal levels of cGMP by different mechanisms. PCB 126 increases the amount of soluble guanylate cyclase while PCB 153 does not. PCB 153 reduces the amount of calmodulin while PCB 126 does not. Also both PCBs impair the function of the glutamate-nitric oxide-cGMP pathway by different mechanisms, PCB 153 impairs nitric oxide-induced activation of soluble guanylate cyclase and increase in cGMP while PCB 126 does not. PCB 126 reduces NMDA-induced increase in calcium while PCB 153 does not. When PCB 153 and PCB 126 exhibit the same effect, PCB 126 was more potent than PCB 153, as occurs in vivo. PMID:19526286

  20. High reliability DC/DC converter module for electronic boards equipped with FPGAs

    NASA Astrophysics Data System (ADS)

    Viganò, W.; Boccardi, A.; Zamantzas, C.

    2015-01-01

    The Beam Instrumentation Group at CERN is designing a new general-purpose VME carrier module utilising several PTH04T230W DC/DC converters. These off-the-shelf converters are built with unshielded inductors and need to be mounted on the printed circuit board as stand-alone components. Thus, reducing the global manageability and increasing the total cost of the carrier module. The new design aims to develop a module with better power dissipation, efficiency and reliability. In the future, it should be also possible to be directly integrated on the mainboard. For this reason, a Buck DC/DC converter has been implemented with the following main characteristics: input range from 3.0 V to 5.5 V; output range from 0.6 V to 3.3 V, settable by means of an external resistor; output current protection at 6 A; maximum output ripple ± 50 mVpp; switching frequency of 300KHz; short circuit protection; On/Off function; EMI reduction with frequency spread spectrum; soft-start function and thermal shutdown, in a 16 × 19 mm compact size. The selected buck controller is the TPS40303 integrated circuit and drives the CSD16321 power MOSFET, both from Texas Instruments. All selected components have been used at a minimum derating of 50% to reduce component stress and increase the reliability of this module. The selected inductors, i.e. Bourns SRP1055, are the main contributor for the high efficiency (95%), due to their very low equivalent series resistance. On the 4-layer PCB comprising all the components of this module, a snubber circuit, for further reduction of the output ripple due to the MOSFET ringing, can be mounted optionally. It is left as an option due to its effect on the total efficiency. The board layout has been optimized for maximum heat transfer and it can be used without active cooling. The board can maintain the maximum temperature on its surface, while at maximum current output, below 55°C at 25°C ambient temperature. An example of the electrical performance

  1. 40 CFR 761.274 - Reporting PCB concentrations in samples.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 40 Protection of Environment 30 2010-07-01 2010-07-01 false Reporting PCB concentrations in... Accordance with § 761.61(a)(2) § 761.274 Reporting PCB concentrations in samples. (a) Report all sample concentrations for non-liquid PCBs on a dry weight basis as micrograms of PCBs per gram of sample (ppm by...

  2. 40 CFR 761.274 - Reporting PCB concentrations in samples.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 40 Protection of Environment 31 2011-07-01 2011-07-01 false Reporting PCB concentrations in... Accordance with § 761.61(a)(2) § 761.274 Reporting PCB concentrations in samples. (a) Report all sample concentrations for non-liquid PCBs on a dry weight basis as micrograms of PCBs per gram of sample (ppm by...

  3. PCB (polychlorinated biphenyls) concentrations in Wilson Reservoir catfish, 1985

    SciTech Connect

    Dycus, D.L.; Lowery, D.R.

    1986-09-01

    TVA conducted a study during autumn 1984 to determine concentrations of a variety of contaminants in biota from Wilson and upper Pickwick Reservoirs. Several contaminants were detected, with polychlorinated biphenyls (PCB) levels in catfish from Wilson Reservoir of greatest interest. PCB concentrations in twenty-two of 45 catfish from Wilson equaled or exceeded the Food and Drug Administration (FDA) tolerance of 2.0 ..mu..g/g and the average of all 45 was 2.6 ..mu..g/g. Contamination was widespread and did not show any geographical relationship to an embayment on Wilson Reservoir (Fleet Hollow) known to have PCBs in the sediments. As a result of these findings, the Northwest Alabama Regional Health Department issued an official notice to retail markets in June 1985 to discontinue selling catfish from Wilson Reservoir. TVA initiated studies to determine if there were other areas on Wilson with PCB contaminated sediments or PCB discharges, and an annual catfish collection was started in autumn 1985 to determine the year-to-year trend in PCB levels. As a follow-up to earlier studies, analyses of catfish collected during autumn 1985 indicated substantial reductions in PCB concentrations. Only 4 of 36 catfish had PCB concentrations which equaled or exceeded 2.0 ..mu..g/g and the overall average was 1.0 ..mu..g/g. Statistical analyses indicated PCB concentrations decreased with increased distance from Fleet Hollow. Further monitoring is recommended for 2 more years.

  4. 40 CFR 761.269 - Sampling liquid PCB remediation waste.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 40 Protection of Environment 30 2010-07-01 2010-07-01 false Sampling liquid PCB remediation waste... with § 761.61(a)(2) § 761.269 Sampling liquid PCB remediation waste. (a) If the liquid is single phase... liquid is multi-phasic, separate the phases, and collect and analyze a sample from each liquid...

  5. 40 CFR 761.269 - Sampling liquid PCB remediation waste.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 31 2014-07-01 2014-07-01 false Sampling liquid PCB remediation waste... with § 761.61(a)(2) § 761.269 Sampling liquid PCB remediation waste. (a) If the liquid is single phase... liquid is multi-phasic, separate the phases, and collect and analyze a sample from each liquid...

  6. 40 CFR 761.269 - Sampling liquid PCB remediation waste.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 40 Protection of Environment 31 2011-07-01 2011-07-01 false Sampling liquid PCB remediation waste... with § 761.61(a)(2) § 761.269 Sampling liquid PCB remediation waste. (a) If the liquid is single phase... liquid is multi-phasic, separate the phases, and collect and analyze a sample from each liquid...

  7. 40 CFR 761.269 - Sampling liquid PCB remediation waste.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 32 2013-07-01 2013-07-01 false Sampling liquid PCB remediation waste... with § 761.61(a)(2) § 761.269 Sampling liquid PCB remediation waste. (a) If the liquid is single phase... liquid is multi-phasic, separate the phases, and collect and analyze a sample from each liquid...

  8. 40 CFR 761.269 - Sampling liquid PCB remediation waste.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 32 2012-07-01 2012-07-01 false Sampling liquid PCB remediation waste... with § 761.61(a)(2) § 761.269 Sampling liquid PCB remediation waste. (a) If the liquid is single phase... liquid is multi-phasic, separate the phases, and collect and analyze a sample from each liquid...

  9. 40 CFR 761.2 - PCB concentration assumptions for use.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... assume that a capacitor manufactured prior to July 2, 1979, whose PCB concentration is not established contains ≥500 ppm PCBs. Any person may assume that a capacitor manufactured after July 2, 1979, is non-PCB (i.e., <50 ppm PCBs). If the date of manufacture is unknown, any person must assume the...

  10. 21 CFR 109.30 - Tolerances for polychlorinated biphenyls (PCB's).

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... FOOD-PACKAGING MATERIAL Tolerances for Unavoidable Poisonous or Deleterious Substances § 109.30...-contaminated animal feed. In addition, a significant percentage of paper food-packaging materials contain PCB's which may migrate to the packaged food. The source of PCB's in paper food-packaging materials...

  11. Developmental exposure to purity-controlled polychlorinated biphenyl congeners (PCB74 and PCB95) in rats: effects on brainstem auditory evoked potentials and catalepsy.

    PubMed

    Lilienthal, Hellmuth; Korkalainen, Merja; Andersson, Patrik L; Viluksela, Matti

    2015-01-01

    Whereas the effects of dioxin-like polychlorinated biphenyls (DL-PCBs) are well described, less is known about non-dioxin-like PCBs (NDL-PCBs), including influences on the nervous system and related behavioral effects after developmental exposure. Following the examination of the highly purified NDL congeners PCB52 and PCB180, we report here the results of experiments with PCB74 and PCB95. Rat dams were orally exposed to equimolar doses of either congener (40μmol/kg bw - 11.68mg PCB74/kg bw or 13.06mg PCB95/kg bw) from gestational day (GD) 10 to postnatal day (PND) 7. Control dams were given the vehicle. Adult offspring were tested for cataleptic behavior after induction with haloperidol, a classical neuroleptic drug, and brainstem auditory evoked potentials (BAEPs), using clicks and tone pips of different frequencies for stimulation. Results revealed slight effects on latencies to movement onset in female offspring exposed to PCB74, whereas PCB74 males and offspring exposed to PCB95 were not affected. Pronounced changes were observed in BAEPs at low frequencies in PCB74 offspring, with elevated thresholds in both sexes. PCB95 increased thresholds in males, but not females. Small effects were detected on latency of the late wave IV in both sexes after developmental exposure to PCB74 or PCB95. Compared with the other NDL-PCB congeners tested, PCB74 caused the most pronounced effects on BAEPs. PMID:25449634

  12. PCB remediation in schools: a review.

    PubMed

    Brown, Kathleen W; Minegishi, Taeko; Cummiskey, Cynthia Campisano; Fragala, Matt A; Hartman, Ross; MacIntosh, David L

    2016-02-01

    Growing awareness of polychlorinated biphenyls (PCBs) in legacy caulk and other construction materials of schools has created a need for information on best practices to control human exposures and comply with applicable regulations. A concise review of approaches and techniques for management of building-related PCBs is the focus of this paper. Engineering and administrative controls that block pathways of PCB transport, dilute concentrations of PCBs in indoor air or other exposure media, or establish uses of building space that mitigate exposure can be effective initial responses to identification of PCBs in a building. Mitigation measures also provide time for school officials to plan a longer-term remediation strategy and to secure the necessary resources. These longer-term strategies typically involve removal of caulk or other primary sources of PCBs as well as nearby masonry or other materials contaminated with PCBs by the primary sources. The costs of managing PCB-containing building materials from assessment through ultimate disposal can be substantial. Optimizing the efficacy and cost-effectiveness of remediation programs requires aligning a thorough understanding of sources and exposure pathways with the most appropriate mitigation and abatement methods. PMID:25994266

  13. Interim Basis for PCB Sampling and Analyses

    SciTech Connect

    BANNING, D.L.

    2001-01-18

    This document was developed as an interim basis for sampling and analysis of polychlorinated biphenyls (PCBs) and will be used until a formal data quality objective (DQO) document is prepared and approved. On August 31, 2000, the Framework Agreement for Management of Polychlorinated Biphenyls (PCBs) in Hanford Tank Waste was signed by the US. Department of Energy (DOE), the Environmental Protection Agency (EPA), and the Washington State Department of Ecology (Ecology) (Ecology et al. 2000). This agreement outlines the management of double shell tank (DST) waste as Toxic Substance Control Act (TSCA) PCB remediation waste based on a risk-based disposal approval option per Title 40 of the Code of Federal Regulations 761.61 (c). The agreement calls for ''Quantification of PCBs in DSTs, single shell tanks (SSTs), and incoming waste to ensure that the vitrification plant and other ancillary facilities PCB waste acceptance limits and the requirements of the anticipated risk-based disposal approval are met.'' Waste samples will be analyzed for PCBs to satisfy this requirement. This document describes the DQO process undertaken to assure appropriate data will be collected to support management of PCBs and is presented in a DQO format. The DQO process was implemented in accordance with the U.S. Environmental Protection Agency EPA QAlG4, Guidance for the Data Quality Objectives Process (EPA 1994) and the Data Quality Objectives for Sampling and Analyses, HNF-IP-0842, Rev. 1 A, Vol. IV, Section 4.16 (Banning 1999).

  14. Interim Basis for PCB Sampling and Analyses

    SciTech Connect

    BANNING, D.L.

    2001-03-20

    This document was developed as an interim basis for sampling and analysis of polychlorinated biphenyls (PCBs) and will be used until a formal data quality objective (DQO) document is prepared and approved. On August 31, 2000, the Framework Agreement for Management of Polychlorinated Biphenyls (PCBs) in Hanford Tank Waste was signed by the U.S. Department of Energy (DOE), the Environmental Protection Agency (EPA), and the Washington State Department of Ecology (Ecology) (Ecology et al. 2000). This agreement outlines the management of double shell tank (DST) waste as Toxic Substance Control Act (TSCA) PCB remediation waste based on a risk-based disposal approval option per Title 40 of the Code of Federal Regulations 761.61 (c). The agreement calls for ''Quantification of PCBs in DSTs, single shell tanks (SSTs), and incoming waste to ensure that the vitrification plant and other ancillary facilities PCB waste acceptance limits and the requirements of the anticipated risk-based disposal approval are met.'' Waste samples will be analyzed for PCBs to satisfy this requirement. This document describes the DQO process undertaken to assure appropriate data will be collected to support management of PCBs and is presented in a DQO format. The DQO process was implemented in accordance with the U.S. Environmental Protection Agency EPA QA/G4, Guidance for the Data Quality Objectives Process (EPA 1994) and the Data Quality Objectives for Sampling and Analyses, HNF-IP-0842, Rev. 1A, Vol. IV, Section 4.16 (Banning 1999).

  15. Predicting and controlling downwind concentrations of PCB from surface impoundments

    SciTech Connect

    Angiola, A.J.; Soden, J.M.

    1982-01-01

    Over 227,000 kv of PCB were discharged into the Hudson River from two capacitor manufacturing plants at Fort Edward and Hudson Falls, New York. Much of the discharged PCB was absorbed by the bottom sediments of the river and accumulated behind the Fort Edward Dam. A large amount of the contaminated sediments migrated dowstream when the dam was removed. An effort has been made to dredge PCB-contaminated sediments from the Upper Hudson River and to deposit those sediments in a secure containment site. Part of this project was an air quality impact analysis which addressed the effect of PCB volatilization from the proposed containment site on ambient 24-hour concentrations of PCB downwind of the site. An estimate of the volatilization rate was made and a dispersion modeling analysis was performed in order to calculate the potential impact on residences. 4 references, 1 table.

  16. Communication design for multi-boards based on VME bus

    NASA Astrophysics Data System (ADS)

    Liu, Yang; Song, Fazhi; Wei, Kai; Fu, Zhenxian

    2015-02-01

    As a widely used open-architecture computer bus ,VME bus is increasingly applied in military, aerospace, transportation and other large-scale control systems. Lithography, a very delicate and complicated integrated circuit manufacturing equipment, uses many circuit boards with VME interface in its control system, including one single-board computer, many movement control boards and one data acquisition board. This paper designs communication modules which include VME bus module and VME user-defined bus module for multi-boards in Lithography control system. VME bus module is designed for the communication between the single-board computer and movement control boards and VME user-defined bus is designed for the communication between movement control boards and data acquisition board. The experimental results demonstrate its effectiveness.

  17. Circuit-field coupled finite element analysis method for an electromagnetic acoustic transducer under pulsed voltage excitation

    NASA Astrophysics Data System (ADS)

    Hao, Kuan-Sheng; Huang, Song-Ling; Zhao, Wei; Wang, Shen

    2011-06-01

    This paper presents an analytical method for electromagnetic acoustic transducers (EMATs) under voltage excitation and considers the non-uniform distribution of the biased magnetic field. A complete model of EMATs including the non-uniform biased magnetic field, a pulsed eddy current field and the acoustic field is built up. The pulsed voltage excitation is transformed to the frequency domain by fast Fourier transformation (FFT). In terms of the time harmonic field equations of the EMAT system, the impedances of the coils under different frequencies are calculated according to the circuit-field coupling method and Poynting's theorem. Then the currents under different frequencies are calculated according to Ohm's law and the pulsed current excitation is obtained by inverse fast Fourier transformation (IFFT). Lastly, the sequentially coupled finite element method (FEM) is used to calculate the Lorentz force in the EMATs under the current excitation. An actual EMAT with a two-layer two-bundle printed circuit board (PCB) coil, a rectangular permanent magnet and an aluminium specimen is analysed. The coil impedances and the pulsed current are calculated and compared with the experimental results. Their agreement verified the validity of the proposed method. Furthermore, the influences of lift-off distances and the non-uniform static magnetic field on the Lorentz force under pulsed voltage excitation are studied.

  18. MULTIPLIER CIRCUIT

    DOEpatents

    Chase, R.L.

    1963-05-01

    An electronic fast multiplier circuit utilizing a transistor controlled voltage divider network is presented. The multiplier includes a stepped potentiometer in which solid state or transistor switches are substituted for mechanical wipers in order to obtain electronic switching that is extremely fast as compared to the usual servo-driven mechanical wipers. While this multiplier circuit operates as an approximation and in steps to obtain a voltage that is the product of two input voltages, any desired degree of accuracy can be obtained with the proper number of increments and adjustment of parameters. (AEC)

  19. Estrogenicity and androgenicity screening of PCB sulfate monoesters in human breast cancer MCF-7 cells.

    PubMed

    Flor, Susanne; He, Xianran; Lehmler, Hans-Joachim; Ludewig, Gabriele

    2016-02-01

    Recent studies identified polychlorinated biphenyl (PCB) sulfate esters as a major product of PCB metabolism. Since hydroxy-PCBs (HO-PCBs), the immediate precursors of PCB sulfates and important contributors to PCB toxicity, were shown to have estrogenic activity, we investigated the estrogenicity/androgenicty of a series of PCB sulfate metabolites. We synthesized the five possible structural sulfate monoester metabolites of PCB 3, a congener shown to be biotransformed to sulfates, a sulfate ester of the paint-specific congener PCB 11, and sulfate monoesters of two HO-PCBs reported to interact with sulfotransferases (PCB 39, no ortho chlorines, and PCB 53, 3 ortho chlorines). We tested these PCB sulfates and 4'-HO-PCB 3 as positive control for estrogenic, androgenic, anti-estrogenic, and anti-androgenic activity in the E- and A-screen with human breast cancer MCF7-derived cells at 100 μM-1 pM concentrations. Only 4'-HO-PCB 3 was highly cytotoxic at 100 μM. We observed structure-activity relationships: compounds with a sulfate group in the chlorine-containing ring of PCB 3 (2PCB 3 and 3PCB 3 sulfate) showed no interaction with the estrogen (ER) and androgen (AR) receptor. The 4'-HO-PCB 3 and its sulfate ester had the highest estrogenic effect, but at 100-fold different concentrations, i.e., 1 and 100 μM, respectively. Four of the PCB sulfates were estrogenic (2'PCB 3, 4'PCB 3, 4'PCB 39, and 4'PCB 53 sulfates; at 100 μM). These sulfates and 3'PCB 3 sulfate also exhibited anti-estrogenic activity, but at nM and pM concentrations. The 4'PCB 3 sulfate (para-para' substituted) had the strongest androgenic activity, followed by 3'PCB 3, 4'PCB 53, 4PCB11, and 4PCB 39 sulfates and the 4'HO-PCB 3. In contrast, anti-androgenicity was only observed with the two compounds that have the sulfate group in ortho- or meta- position in the second ring (2'PCB 3 and 3'PCB 3 sulfate). No dose-response was observed in any screen, but, with exception of estrogenic activity (only seen

  20. Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

    NASA Technical Reports Server (NTRS)

    Ghaffaroam. Reza

    2014-01-01

    Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

  1. Fetal adrenal development: comparing effects of combined exposures to PCB 118 and PCB 153 in a sheep model.

    PubMed

    Zimmer, Karin E; Kraugerud, Marianne; Aleksandersen, Mona; Gutleb, Arno C; Østby, Gunn C; Dahl, Ellen; Berg, Vidar; Skaare, Janneche U; Olsaker, Ingrid; Ropstad, Erik

    2013-03-01

    This study investigated the effects of exposure to the ubiquitous contaminants polychlorinated biphenyls (PCBs) on the fetal adrenal cortex and on plasma cortisol using the domestic sheep (Ovis aries) as a model. Pregnant ewes were intendedly subjected to oral treatment with PCB 153 (98 μg/kg bw/day), PCB 118 (49 μg/kg bw/day) or the vehicle corn oil from mating until euthanasia on gestation day 134 (±0.25 SE). However, because of accidental cross-contamination occurring twice causing a mixed exposure scenario in all three groups, the focus of this paper is to compare three distinct groups of fetuses with different adipose tissue PCB levels (PCB 153high, PCB 118high and low, combined groups) rather than comparing animals exposed to single PCB congeners to those of a control group. When comparing endocrine and anatomical parameters from fetuses in the PCB 153high (n = 13) or PCB 118high (n = 14) groups with the low, combined group (n = 14), there was a significant decrease in fetal body weight (P < 0.05), plasma cortisol concentration (P < 0.001) and adrenal cortex thickness (P < 0.001). Furthermore, adrenal weight was decreased and plasma ACTH was increased only in the PCB 118high group. Expression of several genes encoding enzymes and receptors related to steroid hormone synthesis was also affected and mostly down-regulated in fetuses with high PCB tissue levels. In conclusion, we suggest that mono-and di-ortho PCBs were able to interfere with growth, adrenal development and cortisol production in the fetal sheep model. © 2011 Wiley Periodicals, Inc. Environ Toxicol, 2013. PMID:21544918

  2. Circuit Training.

    ERIC Educational Resources Information Center

    Nelson, Jane B.

    1998-01-01

    Describes a research-based activity for high school physics students in which they build an LC circuit and find its resonant frequency of oscillation using an oscilloscope. Includes a diagram of the apparatus and an explanation of the procedures. (DDR)

  3. Sexual difference in PCB concentrations of coho salmon (Oncorhynchus kisutch)

    USGS Publications Warehouse

    Madenjian, Charles P.; Schrank, Candy S.; Begnoche, Linda J.; Elliott, Robert F.; Quintal, Richard T.

    2010-01-01

    We determined polychlorinated biphenyl (PCB) concentrations in 35 female coho salmon (Oncorhynchus kisutch) and 60 male coho salmon caught in Lake Michigan (Michigan and Wisconsin, United States) during the fall of 1994 and 1995. In addition, we determined PCB concentrations in the skin-on fillets of 26 female and 19 male Lake Michigan coho salmon caught during the fall of 2004 and 2006. All coho salmon were age-2 fish. These fish were caught prior to spawning, and therefore release of eggs could not account for sexual differences in PCB concentrations because female coho salmon spawn only once during their lifetime. To investigate whether gross growth efficiency (GGE) differed between the sexes, we applied bioenergetics modeling. Results showed that, on average, males were 19% higher in PCB concentration than females, based on the 1994–1995 dataset. Similarly, males averaged a 20% higher PCB concentration in their skin-on fillets compared with females. According to the bioenergetics modeling results, GGE of adult females was less than 1% higher than adult male GGE. Thus, bioenergetics modeling could not explain the 20% higher PCB concentration exhibited by the males. Nonetheless, a sexual difference in GGE remained a plausible explanation for the sexual difference in PCB concentrations.

  4. Inhalation of Polychlorinated Biphenyls (PCB) Produces Hyperactivity in Rats.

    PubMed

    Lombardo, John P; Berger, David F; Hunt, Anne; Carpenter, David O

    2015-01-01

    Attention deficit hyperactivity disorder (ADHD) is a serious behavioral syndrome seen in children, and more common in males than females. There is increasing evidence that prenatal and/or early life exposure to persistent organic pollutants (POP) such as polychlorinated biphenyls (PCB) is associated with increased risk of ADHD occurrence. While PCB exposure is usually attributed to ingestion of contaminated food, recent reports of elevated PCB concentrations in indoor air, especially in schools, raised concern regarding inhalation as an important route of exposure to PCB with consequent effects on neurobehavior. The effects of exposure to air contaminated with Aroclor 1248 or contaminated sediment (SED) from the St. Lawrence River were examined on operant behavior of male and female Sprague-Dawley rats. Data showed that relative to controls, vapor-phase inhalation of PCB, whether from blowing air over Aroclor 1248 or from blowing air over sediment contaminated with PCB, resulted in hyperactivity and impatience in rats, more pronounced in males than females. These results are consistent with the hypothesis that inhalation of PCB may contribute to behavioral abnormalities in children. PMID:26398098

  5. Environmental and food contamination with PCB's in Japan.

    PubMed

    Fujiwara, K

    1975-09-01

    In Japan "yusho", i.e., poisoning caused by ingestion of rice oil contaminated with PCB's, broke out in October 1968, and produced more than 1200 officially certified cases. Nevertheless, it was only regarded as a kind of food poisoning and its connection with environmental and biological contamination was only imperfectly taken into consideration. Finally, in the autumn of 1970, two study groups, from the Ehime University and the Kyoto City Hygienic Institute, reported on the PCB contamination of salt water and fresh water fishes in Japan. Subsequently many reports about PCB's as an environmental contaminant have been published by several study groups throughout Japan, and nowadays the PCB polluted state of Japan has become rather clearly recognized. This report will present information on environmental, food and human contamination with PCB's in Japan especially also in some typically contaminated local areas, in addition to summarizing some overall aspects of the PCB problem in Japan (e.g., the production, shipment and use of PCB's). PMID:808853

  6. Spatial patterns in PCB concentrations of Lake Michigan lake trout

    USGS Publications Warehouse

    Madenjian, Charles P.; DeSorcie, Timothy J.; Stedman, Ralph M.; Brown, Edward H., Jr.; Eck, Gary W.; Schmidt, Larry J.; Hesselberg, Robert J.; Chernyak, Sergei M.; Passino-Reader, Dora R.

    1999-01-01

    Most of the PCB body burden in lake trout (Salvelinus namaycush) of the Great Lakes is from their food. PCB concentrations were determined in lake trout from three different locations in Lake Michigan during 1994–1995, and lake trout diets were analyzed at all three locations. The PCB concentrations were also determined in alewife (Alosa pseudoharengus), rainbow smelt (Osmerus mordax), bloater (Coregonus hoyi), slimy sculpin (Cottus cognatus), and deepwater sculpin (Myoxocephalus thompsoni), five species of prey fish eaten by lake trout in Lake Michigan, at three nearshore sites in the lake. Despite the lack of significant differences in the PCB concentrations of alewife, rainbow smelt, bloater, slimy sculpin, and deepwater sculpin from the southeastern nearshore site near Saugatuck (Michigan) compared with the corresponding PCB concentrations from the northwestern nearshore site near Sturgeon Bay (Wisconsin), PCB concentrations in lake trout at Saugatuck were significantly higher than those at Sturgeon Bay. The difference in the lake trout PCB concentrations between Saugatuck and Sturgeon Bay could be explained by diet differences. The diet of lake trout at Saugatuck was more concentrated in PCBs than the diet of Sturgeon Bay lake trout, and therefore lake trout at Saugatuck were more contaminated in PCBs than Sturgeon Bay lake trout. These findings were useful in interpreting the long-term monitoring series for contaminants in lake trout at both Saugatuck and the Wisconsin side of the lake.

  7. 40 CFR 761.358 - Determining the PCB concentration of samples of waste.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 31 2014-07-01 2014-07-01 false Determining the PCB concentration of..., DISTRIBUTION IN COMMERCE, AND USE PROHIBITIONS Sampling Non-Liquid, Non-Metal PCB Bulk Product Waste for Purposes of Characterization for PCB Disposal in Accordance With § 761.62, and Sampling PCB...

  8. 40 CFR 761.359 - Reporting the PCB concentrations in samples.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 32 2012-07-01 2012-07-01 false Reporting the PCB concentrations in... COMMERCE, AND USE PROHIBITIONS Sampling Non-Liquid, Non-Metal PCB Bulk Product Waste for Purposes of Characterization for PCB Disposal in Accordance With § 761.62, and Sampling PCB Remediation Waste Destined for...

  9. 40 CFR 761.358 - Determining the PCB concentration of samples of waste.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 32 2013-07-01 2013-07-01 false Determining the PCB concentration of..., DISTRIBUTION IN COMMERCE, AND USE PROHIBITIONS Sampling Non-Liquid, Non-Metal PCB Bulk Product Waste for Purposes of Characterization for PCB Disposal in Accordance With § 761.62, and Sampling PCB...

  10. 40 CFR 761.358 - Determining the PCB concentration of samples of waste.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 32 2012-07-01 2012-07-01 false Determining the PCB concentration of..., DISTRIBUTION IN COMMERCE, AND USE PROHIBITIONS Sampling Non-Liquid, Non-Metal PCB Bulk Product Waste for Purposes of Characterization for PCB Disposal in Accordance With § 761.62, and Sampling PCB...

  11. 40 CFR 761.359 - Reporting the PCB concentrations in samples.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 32 2013-07-01 2013-07-01 false Reporting the PCB concentrations in... COMMERCE, AND USE PROHIBITIONS Sampling Non-Liquid, Non-Metal PCB Bulk Product Waste for Purposes of Characterization for PCB Disposal in Accordance With § 761.62, and Sampling PCB Remediation Waste Destined for...

  12. 40 CFR 761.359 - Reporting the PCB concentrations in samples.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 31 2014-07-01 2014-07-01 false Reporting the PCB concentrations in... COMMERCE, AND USE PROHIBITIONS Sampling Non-Liquid, Non-Metal PCB Bulk Product Waste for Purposes of Characterization for PCB Disposal in Accordance With § 761.62, and Sampling PCB Remediation Waste Destined for...

  13. Laboratory study of PCB transport from primary sources to settled dust

    EPA Science Inventory

    Transport of house dust and Arizona Test Dust on polychlorinated biphenyl (PCB)-containing panels and PCB-free panels was investigated in a 30-m3 stainless steel chamber. The PCB-containing panels were aluminum sheets coated with a PCB-spiked, oil-based primer or two-part polysul...

  14. Pesticide and PCB levels in fish from Alberta (Canada)

    SciTech Connect

    Chovelon, A.; George, L.; Gulayets, C.; Hoyano, Y.; McGuinness, E.; Moore, J.; Ramamoorthy, S.; Ramamoorthy, S.; Singer, P.; Smiley, K.

    1984-01-01

    Pesticide and PCB analyses were completed on fat and muscle samples of 750 fish collected from 11 major lakes and rivers in Alberta. Although phenoxy and organophosphate residues were always below detectable limits, traces of chlorinated pesticides and their derivatives, particularly DDE, DDD and chlordane, were detected in most fat samples. PCB levels exceeded 25 mg/kg in the fat of several species from the North Saskatchewan River but were generally lower in the other systems. Analysis of 160 sediment samples from the North Saskatchewan River revealed no point source of PCB contamination.

  15. FIELD ANALYTICAL SCREENING PROGRAM PCB METHOD: INNOVATIVE TECHNOLOGY EVALUATION REPORT

    EPA Science Inventory

    This innovative technology evaluation report (ITER) presents information on the demonstration of the U.S. Environmental Protection Agency (EPA) Region 7 Superfund Field Analytical Screening Program (FASP) method for determining polychlorinated biphenyl (PCB) contamination in soil...

  16. PCB's in fish from selected waters of New York State.

    PubMed

    Spagnoli, J J; Skinner, L C

    1977-09-01

    PCB residues in fish from 41 stations throughout New York State were monitored in 1975. Nearly all fish contained PCB's in detectable amounts although the levels of contamination and specific Aroclor varied. The Hudson River contained the highest known PCB concentrations within the United States; levels often exceeded 100 ppm. Other waters and fish which were significantly contaminated include Lake Ontario salmonids and Cayuga Lake lake trout. Onondaga Lake, previously closed to fishing because of mercury contamination, also appears to have abnormally high levels of PCB's approaching in some instances the action level of the Food and Drug Administration, U.S. Department of Health, Education, and Welfare. Samples from marine waters generally have contaminant levels substantially below 5.0 ppm. PMID:414199

  17. ENANTIOMERIC RATIOS OF CHIRAL PCB ATROPISOMERS IN RADIODATED SEDIMENT CORES

    EPA Science Inventory

    Enantiomeric ratios (ERs)) of chiral polychlorinated biphenyl (PCB) atropisomers were quantified in radiodated sediment cores of Lake Hartwell SC, a reservoir heavily impacted by PCBS, to study spatial and temporal changes in chirality. A chiral analysis of cores showed accumulat...

  18. FIELD ANALYTICAL SCREENING PROGRAM: PCB METHOD - INNOVATIVE TECHNOLOGY REPORT

    EPA Science Inventory

    This innovative technology evaluation report (ITER) presents information on the demonstration of the U.S. Environmental Protection Agency (EPA) Region 7 Superfund Field Analytical Screening Program (FASP) method for determining polychlorinated biphenyl (PCB) contamination in soil...

  19. Electrical two and three dimensional modelling of high-speed board to board interconnections

    SciTech Connect

    Gailus, M.; Fusi, M.A.; Zanella, F.

    1995-12-31

    In today`s high speed electronic systems, board-to-board connectors can contribute to signal degradation, reflections, and crosstalk. Methods exist for using computer modeling to predict the electrical behavior of interconnections from a knowledge of their materials and construction. A typical modeling process utilizes a combination of 2 or 3 dimensional electromagnetic field solvers to derive an approximate circuit model of the connector. Predictions of connector electrical performance are then obtained by plugging this connector model into a model test circuit and simulating the combination with circuit simulation software such as SPICE.

  20. Effects of PCB exposure on neuropsychological function in children.

    PubMed Central

    Schantz, Susan L; Widholm, John J; Rice, Deborah C

    2003-01-01

    In the last decade advances in the analytic methods for quantification of polychlorinated biphenyls (PCBs) have resulted in widespread availability of congener-specific analysis procedures, and large amounts of data on PCB congener profiles in soil, air, water, sediments, foodstuffs, and human tissues have become available. These data have revealed that the PCB residues in environmental media and human tissues may not closely resemble any of the commercial PCB mixtures, depending on source of exposure, bioaccumulation through the food chain, and weathering of PCBs in the environment. At the same time, toxicological research has led to a growing awareness that different classes of PCB congeners have different profiles of toxicity. These advances in analytic techniques and toxicological knowledge are beginning to influence the risk assessment process. As the data from ongoing PCB studies assessing the mediators of neurobehavioral outcomes in children are published, the weight of evidence for PCB effects on neurodevelopment is growing. Studies in Taiwan, Michigan (USA), New York (USA), Holland, Germany, and the Faroe Islands have all reported negative associations between prenatal PCB exposure and measures of cognitive functioning in infancy or childhood. The German study also reported a negative association between postnatal PCB exposure and cognitive function in early childhood--a result that had not been found in previous studies. Only one published study in North Carolina (USA) has failed to find an association between PCB exposure and cognitive outcomes. Despite the fact that several more recent studies have used congener-specific analytic techniques, there have been only limited attempts to assess the role of specific PCB congeners or classes of congeners in mediating neurodevelopmental outcomes. From a statistical standpoint, attempts to determine the role of individual congeners in mediating outcomes are hampered by the fact that concentrations of most

  1. LONG-TERM RECOVERY OF PCB-CONTAMINATED SEDIMENTS AT THE LAKE HARTWELL SUPERFUND SITE: PCB DECHLORINATION. 2. RATES AND EXTENT

    EPA Science Inventory

    This paper reports on extensive polychlorinated biphenyl (PCB) dechlorination measured in Lake Hartwell (Pickens County, SC) sediments. Vertical sediment cores were collected from 18 locations in Lake Hartwell (Pickens County, SC) and analyzed in 5-cm increments for PCB congeners...

  2. PCB decomposition and formation in thermal treatment plant equipment.

    PubMed

    Ishikawa, Yukari; Noma, Yukio; Yamamoto, Takashi; Mori, Yoshihito; Sakai, Shin-ichi

    2007-04-01

    In this study we investigated both the decomposition and unintentional formation of polychlorinated biphenyl congeners during combustion experiments of refuse-derived fuel (RDF) and automobile shredder residue (ASR) at several stages in thermal treatment plant equipment composed of a primary combustion chamber, a secondary combustion chamber, and other equipments for flue gas treatment. In both experiments, the unintentional formation of PCB occurred in the primary combustion chamber at the same time as the decomposition of PCB in input samples. By combusting RDF, non-ortho-PCB predominantly formed, whereas ortho-PCB and symmetric chlorinated biphenyls (e.g., #52/69, #87/108, and #151) tended to be decomposed. ASR formed the higher chlorinated biphenyls more than RDF. These by-products from ASR had no structural relation with ortho-chlorine. Lower chlorinated biphenyls appeared as predominant homologues at the final exit site, while all congeners from lower to higher chlorinated PCB were unintentionally formed as by-products in the primary combustion chamber. This result showed that the flue gas treatment equipments effectively removed higher chlorinated PCB. Input marker congeners of RDF were #11, #39, and #68, while those for ASR were #11, #101, #110/120, and #118. Otherwise, combustion marker congeners of RDF were #13/12, #35, #77, and #126, while those for ASR were #170, #194, #206, and #209. While the concentration of PCB increased significantly in the primary combustion chamber, the value of toxicity equivalency quantity for dioxin-like PCB decreased in the secondary combustion chamber and the flue gas treatment equipments. PMID:17134732

  3. Comparative developmental toxicity of planar PCB congeners by egg injection

    SciTech Connect

    Hoffman, D.J.; Melancon, M.J.; Eisemann, J.D.; Klein, P.N.

    1995-12-31

    The utility of egg injection studies for predicting potential embryotoxicity of PCBs and TCDD compares favorably with feeding studies. The effects of PCB congeners 3,3{prime}4,4{prime}-tetraCB (PCB 77), 2,3,3{prime},4,4{prime}-pentaCB (PCB 105), 3,3{prime},4,4{prime},5-pentaCB (PCB 126) and 2,2{prime},4,4{prime},5,5{prime}-hexaCB (PCB 153) were examined on embryonic development in chickens (Gallus gallus), northern bobwhite (Colinus virginianus), American kestrels (Falco sparverius), and common terns (Sterna hirundo) through hatching following air cell injections on day 4. The estimated LD{sub 50}s for these congeners in chickens were approximately 0.4 ppb, 2.6 ppb, 3326 ppb, and greater than 14,000 ppb, respectively; low effect levels (10--20% embryonic mortality) were 0.2 ppb, 1.2 ppb, 900 ppb, and 14,000 ppb respectively. The estimated LD{sub 50} for PCB 126 was 48 ppb for bobwhite, 65 ppb for American kestrels, and 104 ppb for common terns. The estimated LD{sub 50} for PCB 77 was 688 ppb for American kestrels. one or more hepatic microsomal cytochrome P450-linked monooxygenases including ethoxyresorufin-O-deethylase was assayed for each species. For PCB 126, the order of responsiveness of cytochrome P450 induction was: chicken > common tern > American kestrel > bobwhite, with chicken being approximately 100 times more responsive than common tern. These values are compared to existing Toxic Equivalency Factors (TEFs) including bioassay-derived ones.

  4. Different carbon sources affect PCB accumulation by marine bivalves.

    PubMed

    Laitano, M V; Silva Barni, M F; Costa, P G; Cledón, M; Fillmann, G; Miglioranza, K S B; Panarello, H O

    2016-02-01

    Pampean creeks were evaluated in the present study as potential land-based sources of PCB marine contamination. Different carbon and nitrogen sources from such creeks were analysed as boosters of PCB bioaccumulation by the filter feeder bivalve Brachidontes rodriguezii and grazer limpet Siphonaria lessoni. Carbon of different source than marine and anthropogenic nitrogen assimilated by organisms were estimated through their C and N isotopic composition. PCB concentration in surface sediments and mollusc samples ranged from 2.68 to 6.46 ng g(-1) (wet weight) and from 1074 to 4583 ng g(-1) lipid, respectively, reflecting a punctual source of PCB contamination related to a landfill area. Thus, despite the low flow of creeks, they should not be underestimated as contamination vectors to the marine environment. On the other hand, mussels PCB bioaccumulation was related with the carbon source uptake which highlights the importance to consider this factor when studying PCB distribution in organisms of coastal systems. PMID:26606107

  5. Neurobehavioral and somatic effects of perinatal PCB exposure in rats

    SciTech Connect

    Overmann, S.R.; Kostas, J.; Wilson, L.R.; Shain, W.; Bush, B.

    1987-10-01

    Developing rats were exposed to TCBs via provision of diets containing 0.02 (no PCB added), 2.4, 26, or 269 ppm Aroclor 1254 to sperm-positive female rats from mating to weaning of their pups. Provision of the 269 ppm diet decreased the number of impregnated rats that delivered a litter and lowered pup birth weight, and most pups died within 7 days of birth. Preweaning pup growth was reduced in the 26 ppm condition and slightly reduced in the 2.5 ppm condition. The ontogeny of negative geotaxis, auditory startle, and air righting was delayed in pups from the 26 ppm condition. Pups in the 2.5 ppm condition had slightly delayed development of auditory startle. Maximal electroshock seizure tests on postweaning rats showed that perinatal PCB exposure decreased seizure severity of both the 2.5 and 26 ppm groups. PCB exposure increased pup liver weights at birth and dam and pup liver weights at weaning. Spleen and thymus weights were lower in PCB-exposed pups, while brain weights were unaffected. Analytical determination of PCB levels in brain showed greater maternal transfer of PCBs during lactation than during gestation. Elevated PCB levels were detectable in brains of perinatally exposed adult rats.

  6. A reassessment of the nomenclature of polychlorinated biphenyl (PCB) metabolites.

    PubMed Central

    Maervoet, Johan; Covaci, Adrian; Schepens, Paul; Sandau, Courtney D; Letcher, Robert J

    2004-01-01

    Polychlorinated biphenyls (PCBs) are a widespread class of persistent organic chemicals that accumulate in the environment and humans and are associated with a broad spectrum of health effects. PCB biotransformation has been shown to lead to two classes of PCB metabolites that are present as contaminant residues in the tissues of selected biota: hydroxylated (HO) and methyl sulfone (MeSO2) PCBs. Although these two types of metabolites are related structures, different rules for abbreviation of both classes have emerged. It is important that a standardized nomenclature for the notation of PCB metabolites be universally agreed upon. We suggest that the full chemical name of the PCB metabolite and a shorthand notation should be adopted using the International Union of Pure and Applied Chemistry's chemical name/original Ballschmiter and Zell number of the parent congener, followed by the assignment of the phenyl ring position number of the MeSO2- or HO-substituent. This nomenclature provides a clear, unequivocal set of rules in naming and abbreviating the PCB metabolite structure. Furthermore, this unified PCB metabolite nomenclature approach can be extended to the naming and abbreviation of potential metabolites of structurally analogous contaminants such as HO-polybrominated biphenyls and HO-polybrominated diphenyl ethers. PMID:14998742

  7. Cell death mechanisms in GT1-7 GnRH cells exposed to polychlorinated biphenyls PCB74, PCB118, and PCB153

    SciTech Connect

    Dickerson, Sarah M.; Guevara, Esperanza; Woller, Michael J.; Gore, Andrea C.

    2009-06-01

    Exposure to endocrine disrupting chemicals (EDCs) such as polychlorinated biphenyls (PCBs) causes functional deficits in neuroendocrine systems. We used an immortalized hypothalamic GT1-7 cell line, which synthesizes the neuroendocrine peptide gonadotropin-releasing hormone (GnRH), to examine the neurotoxic and endocrine disrupting effects of PCBs and their mechanisms of action. Cells were treated for 1, 4, 8, or 24 h with a range of doses of a representative PCB from each of three classes: coplanar (2,4,4',5-tetrachlorobiphenyl: PCB74), dioxin-like coplanar (2',3,4,4',5' pentachlorobiphenyl: PCB118), non-coplanar (2,2',4,4',5,5'-hexachlorobiphenyl: PCB153), or their combination. GnRH peptide concentrations, cell viability, apoptotic and necrotic cell death, and caspase activation were quantified. In general, GnRH peptide levels were suppressed by high doses and longer durations of PCBs, and elevated at low doses and shorter timepoints. The suppression of GnRH peptide levels was partially reversed in cultures co-treated with the estrogen receptor antagonist ICI 182,780. All PCBs reduced viability and increased both apoptotic and necrotic cell death. Although the effects for the three classes of PCBs were often similar, subtle differences in responses, together with evidence that the combination of PCBs acted slightly different from individual PCBs, suggest that the three tested PCB compounds may act via slightly different or more than one mechanism. These results provide evidence that PCB congeners have endocrine disrupting and/or neurotoxic effects on the hypothalamic GnRH cell line, a finding that has implications for environmental endocrine disruption in animals.

  8. Standards for compatibility of printed circuit and component lead materials

    NASA Technical Reports Server (NTRS)

    1968-01-01

    Study of packaging of microminiature electronic components reveals methods of improving compatibility of lead materials, joining techniques, transfer molding concepts, printed circuit board materials, and process and material specifications.

  9. Formation of toxic PCB congeners and PCB-solvent adducts in a sunlight irradiated cyclohexane solution of aroclor 1254

    SciTech Connect

    Lepine, F.; Milot, S.; Vincent, N. )

    1992-01-01

    Photodegradation by sunlight is an important decomposition mechanism of polychlorinated biphenyls in the environment. Photodegradation of PCBs proceeds through successive dechlorination of the biphenyl nucleus and thus modify the proportions of the various congeners in a PCB mixture. The objectives of this work is to study the effects of sunlight on a typical PCB mixture such as Aroclor 1254, in a congener specific approach in order to observe the variations in the levels of these toxic congeners in the irradiated mixture.

  10. High transmission 3D printed flex-PCB-based ion funnel.

    PubMed

    Tridas, Eric Miguel; Allemang, Christopher; Mast, Fabian; Anthony, J Mark; Schlaf, Rudiger

    2015-07-01

    In this study a novel fabrication method for a radio frequency (RF) ion funnel is presented. RF ion funnels are important devices for focusing ion clouds at low vacuum conditions for mass spectrometry or deposition-related applications. Typically, ion funnels are constructed of stainless steel plate ring electrodes with a decreasing diameter where RF and direct current potentials are applied to the electrodes to focus the ion cloud. The presented novel design is based on a flexible circuit board that serves both as the signal distribution circuit and as the electrodes of the ion funnel. The flexible circuit board is rolled into a 3D printed scaffold to create a funnel shape with ring electrodes formed by the copper electrodes of the flexible circuit board. The design is characterized in direct comparison with a conventional steel-plate electrode design. The discussed results show that the new funnel has similar performance to the conventionally designed funnel despite much lower manufacturing costs. PMID:26349649

  11. The greening of PCB analytical methods

    SciTech Connect

    Erickson, M.D.; Alvarado, J.S.; Aldstadt, J.H.

    1995-12-01

    Green chemistry incorporates waste minimization, pollution prevention and solvent substitution. The primary focus of green chemistry over the past decade has been within the chemical industry; adoption by routine environmental laboratories has been slow because regulatory standard methods must be followed. A related paradigm, microscale chemistry has gained acceptance in undergraduate teaching laboratories, but has not been broadly applied to routine environmental analytical chemistry. We are developing green and microscale techniques for routine polychlorinated biphenyl (PCB) analyses as an example of the overall potential within the environmental analytical community. Initial work has focused on adaptation of commonly used routine EPA methods for soils and oils. Results of our method development and validation demonstrate that: (1) Solvent substitution can achieve comparable results and eliminate environmentally less-desirable solvents, (2) Microscale extractions can cut the scale of the analysis by at least a factor of ten, (3) We can better match the amount of sample used with the amount needed for the GC determination step, (4) The volume of waste generated can be cut by at least a factor of ten, and (5) Costs are reduced significantly in apparatus, reagent consumption, and labor.

  12. Enhancing board effectiveness.

    PubMed

    Curran, Connie R; Totten, Mary K

    2010-01-01

    Like any other job, board work is associated with specific competencies. Competencies are the combination of knowledge, skills, personal characteristics, and behaviors needed to perform a job or task effectively. Boards are only as strong as their weakest member. Board education should focus on improving the knowledge and skills of the board and individual members and on overall board performance. Assessment of individual board member performance is designed to evaluate the trustee's knowledge of board roles and responsibilities and the expectations of board members. Board effectiveness is built through competency-based board member recruitment and selection; board member education and development; and evaluation of board, board member, and meeting performance. PMID:21291066

  13. LOGIC CIRCUIT

    DOEpatents

    Strong, G.H.; Faught, M.L.

    1963-12-24

    A device for safety rod counting in a nuclear reactor is described. A Wheatstone bridge circuit is adapted to prevent de-energizing the hopper coils of a ball backup system if safety rods, sufficient in total control effect, properly enter the reactor core to effect shut down. A plurality of resistances form one arm of the bridge, each resistance being associated with a particular safety rod and weighted in value according to the control effect of the particular safety rod. Switching means are used to switch each of the resistances in and out of the bridge circuit responsive to the presence of a particular safety rod in its effective position in the reactor core and responsive to the attainment of a predetermined velocity by a particular safety rod enroute to its effective position. The bridge is unbalanced in one direction during normal reactor operation prior to the generation of a scram signal and the switching means and resistances are adapted to unbalance the bridge in the opposite direction if the safety rods produce a predetermined amount of control effect in response to the scram signal. The bridge unbalance reversal is then utilized to prevent the actuation of the ball backup system, or, conversely, a failure of the safety rods to produce the predetermined effect produces no unbalance reversal and the ball backup system is actuated. (AEC)

  14. Tool For Tinning Integrated-Circuit Leads

    NASA Technical Reports Server (NTRS)

    Prosser, Gregory N.

    1988-01-01

    As many as eight flatpacks held. Tool made of fiberglass boards. Clamps row of flatpacks by their leads so leads on opposite side of packages dipped. After dipping, nuts on boards loosened, flatpacks turned around, nuts retightened, and untinned leads dipped. Strips of magnetic material grip leads of flatpacks (made of Kovar, magnetic iron/nickel/cobalt alloy) while boards repositioned. Micrometerlike screw used to adjust exposed width of magnetic strip to suit dimensions of flatpacks. Holds flatpack integrated circuits so leads tinned. Accommodates several flatpacks for simultaneous dipping of leads in molten solder. Adjusts to accept flatpacks in range of sizes.

  15. Reusable vibration resistant integrated circuit mounting socket

    DOEpatents

    Evans, Craig N.

    1995-01-01

    This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and holds it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuit lead can be removed from the socket without damage either to the lead or to the socket components.

  16. A current-excited triple-time-voltage oversampling method for bio-impedance model for cost-efficient circuit system.

    PubMed

    Yan Hong; Yong Wang; Wang Ling Goh; Yuan Gao; Lei Yao

    2015-08-01

    This paper presents a mathematic method and a cost-efficient circuit to measure the value of each component of the bio-impedance model at electrode-electrolyte interface. The proposed current excited triple-time-voltage oversampling (TTVO) method deduces the component values by solving triple simultaneous electric equation (TSEE) at different time nodes during a current excitation, which are the voltage functions of time. The proposed triple simultaneous electric equations (TSEEs) allows random selections of the time nodes, hence numerous solutions can be obtained during a single current excitation. Following that, the oversampling approach is engaged by averaging all solutions of multiple TSEEs acquired after a single current excitation, which increases the practical measurement accuracy through the improvement of the signal-to-noise ratio (SNR). In addition, a print circuit board (PCB) that consists a switched current exciter and an analog-to-digital converter (ADC) is designed for signal acquisition. This presents a great cost reduction when compared against other instrument-based measurement data reported [1]. Through testing, the measured values of this work is proven to be in superb agreements on the true component values of the electrode-electrolyte interface model. This work is most suited and also useful for biological and biomedical applications, to perform tasks such as stimulations, recordings, impedance characterizations, etc. PMID:26736442

  17. Comparison of the in vitro effects of TCDD, PCB 126 and PCB 153 on thyroid-restricted gene expression and thyroid hormone secretion by the chicken thyroid gland.

    PubMed

    Katarzyńska, Dorota; Hrabia, Anna; Kowalik, Kinga; Sechman, Andrzej

    2015-03-01

    The aim of this study was to compare the in vitro effects of 2,3,7,8-tetrachlorodibenzo-p-dioxin (TCDD), 3,3',4,4',5-pentachlorobiphenyl (PCB 126; a coplanar PCB congener) and 2,2'4,4',5,5'-hexachlorobiphenyl (PCB153; non-coplanar PCB) on mRNA expression of thyroid-restricted genes, i.e. sodium iodide symporter (NIS), thyroid peroxidase (TPO) and thyroglobulin (TG), and thyroid hormone secretion from the thyroid gland of the laying chicken. Relative expression levels of NIS, TG and TPO genes and thyroxine (T4) and triiodothyronine (T3) secretion from the thyroidal explants were quantified by the real-time qPCR and RIA methods, respectively. In comparison with the control group, TCDD and PCB 126 significantly increased mRNA expression of TPO and TG genes. TCDD did not affect NIS mRNA levels, but PCB 126 decreased its expression. No effect of PCB 153 on the expression of these genes was observed. TCDD and PCB 126 significantly decreased T4 and T3 secretion. There was no significant effect of PCB 153 on these hormone secretions. In conclusion, the results obtained show that in comparison with non-coplanar PCB 153, TCDD and coplanar PCB 126 can directly affect thyroid hormone synthesis and secretion, and in consequence, they may disrupt the endocrine function of the thyroid gland of the laying chicken. PMID:25682001

  18. Computer-Assisted Experiments with Oscillatory Circuits

    ERIC Educational Resources Information Center

    Fernandes, J. C.; Ferraz, A.; Rogalski, M. S.

    2010-01-01

    A basic setup for data acquisition and analysis from an oscillatory circuit is described, with focus on its application as either low-pass, high-pass, band-pass or band-reject frequency filter. A homemade board containing the "RLC" elements allows for the interchange of some of them, in particular, for the easy change of the "R" value, and this…

  19. Stable Polyurethane Coatings for Electronic Circuits

    NASA Technical Reports Server (NTRS)

    Morris, D. E.

    1983-01-01

    Alkane-based polyurethanes resist deterioration while maintaining good dielectric properties. Weight loss after prolonged immersion in hot water far less for alkane-based polyurethanes than for more common ether based polyurethanes, at any given oxygen content. Major uses of polyurethanes are as connector potting materials and conformal coatings for printed circuit boards.

  20. Developmental exposure to polychlorinated biphenyls PCB153 or PCB126 impairs learning ability in young but not in adult rats.

    PubMed

    Piedrafita, Blanca; Erceg, Slaven; Cauli, Omar; Monfort, Pilar; Felipo, Vicente

    2008-01-01

    Polychlorinated biphenyls (PCBs) are persistent organic pollutants present in the food chain and in human blood and milk. Exposure to PCBs during pregnancy and lactation leads to cognitive impairment in children. The underlying mechanisms remain unclear. Some PCBs are endocrine disrupters. The aim of this work was to assess whether exposure of rats to PCB126 (dioxin-like) or PCB153 (non-dioxin-like) during pregnancy and lactation affects the ability of the pups to learn a Y maze conditional discrimination task and/or the function of the glutamate-nitric oxide (NO)-cGMP pathway in brain in vivo when the rats are young (3 months) or adult (7-8 months). After finishing the learning experiments, the function of the pathway was analysed in the same rats by in vivo brain microdialysis. The results obtained show that perinatal exposure to PCB153 or PCB126: (1) impairs learning ability in young but not in adult rats, (2) impairs the glutamate-NO-cGMP pathway function in cerebellum in vivo in young but not in adult rats and (3) affect these parameters in males and females similarly. PCB126 is around 10 000-fold more potent than PCB153. In control rats the function of the glutamate-NO-cGMP pathway and learning ability are lower in adult than in young rats. These age-related differences are not present in rats exposed to PCBs. The impairment of the glutamate-NO-cGMP pathway function induced at young age by developmental exposure to the PCBs could be one of the mechanisms contributing to the cognitive impairment found in children whose mothers ingested PCB-contaminated food during pregnancy and lactation. PMID:18093177

  1. Determination of Atmospheric PCB Level Variations in Continuously Collected Samples.

    PubMed

    Sakin, Ahmet Egemen; Tasdemir, Yücel

    2016-08-01

    Polychlorinated biphenyls (PCBs) were measured in ambient air samples (n = 48) that were collected for a 2- to 3-day period in each season (winter, spring, summer, fall) of 2013. The samples were collected on the Campus of Uludag University, which is in a semirural region. The samples were collected using a high-volume air sampler. The gas and particle phase concentrations of 87 PCB congeners (Σ87PCB) were measured in these samples. The average gas and particle phase concentrations of the Σ87PCB were calculated to be 293 ± 257 and 52 ± 56 ng/m(3), respectively. However, the results of short-term measurements showed that the variation among the measurements in the gas phase was up to 39-fold and up to 84-fold in the particle phase. These results demonstrated that the ambient air PCB concentrations were not stable and changed dramatically on a daily basis. Therefore, it was clear that a small number of samples could not be representative of the entire region. Furthermore, the obtained concentrations showed differences that depended on the meteorological conditions and long distance transportation. The sampling indicated that PCB homologues with 3 or 4 chlorines were dominant. PMID:27290669

  2. Modeling trapping mechanism for PCB adsorption on activated carbon

    NASA Astrophysics Data System (ADS)

    Jensen, Bjørnar; Kvamme, Bjørn; Kuznetsova, Tatyana; Oterhals, A.˚ge

    2012-12-01

    The levels of polychlorinated dibenzo-p-dioxin, polychlorinated dibenzofuran (PCDD/F) and dioxin-like polychlorinated biphenyl (DL-PCB) in fishmeal and fish oil produced for use in feed for salmon is above present European legislation levels in some regions of the world and different decontamination approaches have been proposed [1]. One of these is adsorption on activated carbon. This approach appears to be efficient for adsorption of PCDD/F but less efficient for DL-PCB [2]. Activated carbon consists of slit pores with average sizes of 20 - 50 Ångstroms. One hypothesis [2] for the mechanism of trapping DL-PCB is reduced ability for intramolecular movements of the PCB molecules inside the slit pores. In order to investigate this hypothesis we have used quantum mechanics [3] to characterize two DL-PCB congeners, respectively congener 77 (3,3',4,4'-Tetrachlorobiphenyl) and congener 118 (2,3',4,4',5-Pentachlorobiphenyl) and Triolein (18:1) [4] as a major constituent of the solvent fish oil. A model for activated carbon was constructed using a crystal structure of graphite from the American Mineralogist Crystal Structure Database [5]. The crystal structure used was originally from Wyckoff [6]. A small program had to be written to generate the desired graphite structure as it contains no less than 31232 Carbon atoms. Partial atomic charges were estimated using QM with DFT/B3LYP/6-311+g** and SM6 [7].

  3. Remediation of PCB contaminated soils using iron nano-particles.

    PubMed

    Varanasi, Patanjali; Fullana, Andres; Sidhu, Sukh

    2007-01-01

    In this study, iron nano-particles were used to remediate PCB contaminated soil and an attempt was made to maximize PCB destruction in each treatment step. The results show that nano-particles do aid in the dechlorination process and high PCB destruction efficiencies can be achieved. The destruction efficiency during the preliminary treatment (mixing of soil and iron nano-particles in water) can be increased by increasing the water temperature. The maximum thermal destruction (pyrolysis/combustion of soil after preliminary treatment) of soil-bound PCBs occurs at 300 degrees C in air. A minimum total PCB destruction efficiency of 95% can be achieved by this process. The effect of changing treatment parameters such as type of mixing, time of mixing and mixing conditions and application of other catalysts like iron oxide and V(2)O(5)/TiO(2) was also investigated. It was found that at 300 degrees C in air, iron oxide and V(2)O(5)/TiO(2) are also good catalysts for remediating PCB contaminated soils. PMID:16962632

  4. Commutation circuit for an HVDC circuit breaker

    DOEpatents

    Premerlani, William J.

    1981-01-01

    A commutation circuit for a high voltage DC circuit breaker incorporates a resistor capacitor combination and a charging circuit connected to the main breaker, such that a commutating capacitor is discharged in opposition to the load current to force the current in an arc after breaker opening to zero to facilitate arc interruption. In a particular embodiment, a normally open commutating circuit is connected across the contacts of a main DC circuit breaker to absorb the inductive system energy trapped by breaker opening and to limit recovery voltages to a level tolerable by the commutating circuit components.

  5. Commutation circuit for an HVDC circuit breaker

    DOEpatents

    Premerlani, W.J.

    1981-11-10

    A commutation circuit for a high voltage DC circuit breaker incorporates a resistor capacitor combination and a charging circuit connected to the main breaker, such that a commutating capacitor is discharged in opposition to the load current to force the current in an arc after breaker opening to zero to facilitate arc interruption. In a particular embodiment, a normally open commutating circuit is connected across the contacts of a main DC circuit breaker to absorb the inductive system energy trapped by breaker opening and to limit recovery voltages to a level tolerable by the commutating circuit components. 13 figs.

  6. Lack of data drives uncertainty in PCB health risk assessments.

    PubMed

    Cogliano, Vincent James

    2016-02-01

    Health risk assessments generally involve many extrapolations: for example, from animals to humans or from high doses to lower doses. Health risk assessments for PCBs involve all the usual uncertainties, plus additional uncertainties due to the nature of PCBs as a dynamic, complex mixture. Environmental processes alter PCB mixtures after release into the environment, so that people are exposed to mixtures that might not resemble the mixtures where there are toxicity data. This paper discusses the evolution of understanding in assessments of the cancer and noncancer effects of PCBs. It identifies where a lack of data in the past contributed to significant uncertainty and where new data subsequently altered the prevailing understanding of the toxicity of PCB mixtures, either qualitatively or quantitatively. Finally, the paper identifies some uncertainties remaining for current PCB health assessments, particularly those that result from a lack of data on exposure through nursing or on effects from inhalation of PCBs. PMID:26347413

  7. Temporal trends toward stability of Hudson River PCB contamination

    SciTech Connect

    Sloan, R.J.; Simpson, K.W.; Schroeder, R.A.; Barnes, C.R.

    1983-10-01

    PCB was used in the manufacture of electrical equipment at two General Electric Company (GE) facilities located on the upper Hudson River about 1 km apart in Fort Edward and Hudson Falls (Washington Co.) New York. Discharges of PCB from these plants resulted in concentrations in bottom sediments of the Hudson River which now exceed those of other major rivers by about two orders of magnitude and those of small remote streams by more than three orders of magnitude. Intensive monitoring was initiated in 1977 by the New York State Department of Environmental Conservation (DEC) to ascertain the magnitude of and trends in contaminant conditions of biotic and physical strata. The paper summarizes PCB trends from 1977 to 1981 in three major monitoring components - water, multiplate residues and fish.

  8. Generating the Right PCB Data: Determination of Aroclors Versus PCB Congeners

    SciTech Connect

    Prignano, A.L.; Narquis, C.T.; Hyatt, J.E.

    2008-07-01

    Polychlorinated biphenyls (PCBs) are a major environmental concern due to their ubiquity and tendency to bio-accumulate, as well as their persistence and toxicity. As the cleanup of waste and contaminated soil progresses at U.S. Department of Energy (DOE) sites, the costs for accurate PCB data are increasing. PCBs are actually a broad name for a group of 209 individual compounds known as congeners. PCBs were originally produced in the United States as specific mixtures of congeners known as Aroclors. PCBs can be analyzed and quantified either as Aroclor mixtures or as individual congeners. Aroclor analysis, which is the more common analytical method applied to PCBs, has been in use for decades, and in general, most cleanup regulations are based on total PCB concentrations using Aroclor analyses. Congener analysis is relatively new to environmental cleanup and restoration due to both technical issues and associated cost. The benefits of congener analysis are that it allows a more direct analysis of the risk of the PCBs. The World Health Organization (WHO) has identified twelve specific congeners as dioxin-like with toxicity ranging from 0.00003 to 0.1 times the standard 2,3,7,8-Tetrachlorodibenzo-p-dioxin (2,3,7,8-TCDD) toxicity. This paper defines Aroclors and congeners and compares the current application and usefulness of the two analytical methods for environmental restoration and cleanup. A strategy for the best use of the two methods to optimize overall characterization cost is presented. As part of the strategy, a method using the data from Aroclor analyses to calculate 2,3,7,8-TCDD toxicity equivalent concentrations is also presented. (authors)

  9. GENERATING THE RIGHT PCB DATA DETERMINATION OF AROCLORS VERSUS PCB CONGENERS

    SciTech Connect

    NARQUIS CT; PRIGNANO AL

    2007-11-21

    Polychlorinated biphenyls (PCBs) are a major environmental concern due to their ubiquity and tendency to bio-accumulate. as well as their persistence and toxicity. As the cleanup of waste and contaminated soil progresses at U.S. Department of Energy (DOE) sites, the costs for accurate PCB data are increasing. PCBs are actually a broad name for a group of 209 individual compounds known as congeners. PCBs were originally produced in the United States as specific mixtures of congeners known as Aroclors'. PCBs can be analyzed and quantified either as Aroclor mixtures or as individual congeners. Aroclor analysis, which is the more common analytical method applied to PCBs. has been in use for decades, and in general, most cleanup regulations are based on total PCB concentrations using Aroclor analyses. Congener analysis is relatively new to environmental cleanup and restoration due to both technical issues and associated cost. The benefits of congener analysis are that it allows a more direct analysis of the risk of the PCBs. The World Health Organization (WHO) has identified twelve specific congeners as dioxin-like with toxicity ranging from 0.00003 to 0.1 times the standard 2,3,7.8-Tetrachlorodibenzo-p-dioxin (2.3.7.8-TCDD) toxicity. This paper defines Aroclors and congeners and compares the current application and usefulness of the two analytical methods for environmental restoration and cleanup. A strategy for the best use of the two methods to optimize overall characterization cost is presented. As part of the strategy. a method using the data from Aroclor analyses to calculate 2,3,7,8-TCDD toxicity equivalent concentrations is also presented.

  10. ENVIRONMENTAL TECHNOLOGY VERIFICATION REPORT: IMMUNOASSAY KIT, ENVIROLOGIX, INC., PCB IN SOIL TUBE ASSAY

    EPA Science Inventory

    In July 1997, the U.S. Environmental Protection Agency (EPA) conducted a demonstration of polychlorinated biphenyl (PCB) field analytical techniques. The purpose of this demonstration was to evaluate field analytical technologies capable of detecting and quantifying PCB's in soi...

  11. Study on the plasma treatment of waste oil containing PCB

    NASA Astrophysics Data System (ADS)

    Park, H. S.; Lukashov, V. P.; Vashchenko, S. P.; Morozov, S. V.

    2009-12-01

    The paper presents the results of treatment of transformer oil containing less than 2 ppm polychlorinated biphenyls (PCB) in a plant of high-temperature plasma melting of ash residues after the municipal waste incineration. The content of undecomposed PCBs, dioxins, and other hazardous waste in all secondary products of treatment (off gases; slag; secondary fly ash; process water used for slag granulation) was analyzed by different methods. Performed analytical investigations showed high ecological degree of PCB decomposition in the plant of plasma-thermal treatment of ashes after incinerators.

  12. Immunity of PCB transplacental Yu-Cheng children in Taiwan

    SciTech Connect

    Lan, Shou Jen; Yen, Yea Yin; Chen, Eng Rin; Ko, Ying Chin ); Lan, Joung Liang )

    1990-02-01

    Up to now, there has been no studies about the immune status of PCB transplacental Yu-Cheng babies. In an earlier study, Yu-Cheng babies were reported to have a high infant mortality rate. It was reported that these babies would easily catch cold, experience diarrhea and abdominal pains. Recently, it was found that the bronchitis rate of Yu-Cheng babies is higher than in control babies. Because of high risk of infection, it is presumed that these babies might suffer immunosuppression to a certain extent. According to these findings, investigations into the immune functions of PCB transplacental Yu-Cheng babies are needed.

  13. Environmental projects. Volume 1: Polychlorinated biphenyl (PCB) abatement program

    NASA Technical Reports Server (NTRS)

    Kushner, L.

    1987-01-01

    Six large parabolic dish antennas are located at the Goldstone Deep Space Communications Complex north of Barstow, California. Some of the ancillary electrical equipment of thes Deep Space Stations, particularly transformers and power capicitors, were filled with stable, fire-retardant, dielectric fluids containing substances called polychlorobiphenyls (PCBs). Because the Environmental Protection Agency has determined that PCBs are environmental pollutants toxic to humans, all NASA centers have been asked to participate in a PCB-abatement program. Under the supervision of JPL's Office of Telecommunications and Data Acquisition, a two-year long PCB-abatement program has eliminated PCBs from the Goldstone Complex.

  14. A simple tachometer circuit

    NASA Technical Reports Server (NTRS)

    Dimeff, J.

    1972-01-01

    Electric circuit to measure frequency of repetitive sinusoidal or rectangular wave is presented. Components of electric circuit and method of operation are explained. Application of circuit as tachometer for automobile is discussed.

  15. Photomultiplier blanking circuit

    NASA Technical Reports Server (NTRS)

    Mcclenahan, J. O.

    1972-01-01

    Circuit for protecting photomultiplier equipment from current surges which occur when exposed to brilliant illumination is discussed. Components of circuit and details of operation are provided. Circuit diagram to show action of blanking pulse on zener diode is included.

  16. Altered stress-induced cortisol levels in goats exposed to polychlorinated biphenyls (PCB 126 and PCB 153) during fetal and postnatal development.

    PubMed

    Zimmer, Karin E; Gutleb, Arno C; Lyche, Jan L; Dahl, Ellen; Oskam, Irma C; Krogenaes, Anette; Skaare, Janneche Utne; Ropstad, Erik

    2009-01-01

    Short-term stress exposure is associated with activation of the hypothalamic-pituitary-adrenal (HPA) axis and a consequent rise in blood glucocorticoids and catecholamines, from the adrenal cortex and medulla, respectively. The HPA axis is a potential target for some persistent organic pollutants, among which polychlorinated biphenyls (PCB) were found to be modulators of the mammalian endocrine system. PCB are distributed globally in the environment, in food chains, and are transferred to the fetuses of pregnant animals and via mother's milk to suckling offspring. In the present study it was postulated that intrauterine and lactational exposure to either of two single congeners of PCB (PCB 153 and PCB 126, respectively) might affect basal cortisol concentrations, and also the cortisol response to short-term stress in adulthood. Thus, pregnant goats were orally exposed to one of these PCB congeners from d 60 of gestation until delivery, and their offspring studied. Low-dose exposure to PCB 153 and PCB 126 resulted in significantly lower mean basal cortisol concentrations in goat offspring during certain periods of pubertal development and their first breeding season. Male goat kids exposed to either PCB congener showed a greater and more prolonged rise in plasma cortisol levels than controls when animals were subjected to mild stress at 9 mo of age using frequent blood sampling. Neither the basal maternal cortisol plasma level nor goat kid adrenal masses were affected by PCB exposure. PMID:19184731

  17. An overlooked environmental issue? A review of the inadvertent formation of PCB-11 and other PCB congeners and their occurrence in consumer products and in the environment.

    PubMed

    Vorkamp, Katrin

    2016-01-15

    Polychlorinated biphenyls (PCBs) are banned from production and use in most countries as they are persistent organic pollutants (POPs) of concern for environment and health. Recent research has pointed at a new environment issue resulting from the inadvertent formation of PCBs in certain processes, in particular the pigment production. PCB-11 is a major by-product in these processes, but PCB-28, PCB-52, PCB-77 as well as the nonachlorinated PCBs and PCB-209 have been found in pigments and consumer products as well. In addition to environmental emissions via point sources, in particular related to industrial and municipal wastewater, atmospheric transport seems to be important for the global distribution of PCB-11. Thus, PCB-11 has also been detected in the polar regions. Worldwide air concentrations appear relatively uniform, but maxima have been found in urban and industrialised areas. Data on the uptake and accumulation of PCB-11 in the food chain are still inconclusive: Although food web studies do not show biomagnification, PCB-11 has been detected in humans. The human exposure might originate from the direct contact to consumer products as well as from the omnipresence of PCB-11 in the environment. PMID:26490526

  18. Effects of PCB126 and PCB153 on telomerase activity and telomere length in undifferentiated and differentiated HL-60 cells.

    PubMed

    Xin, Xing; Senthilkumar, P K; Schnoor, Jerald L; Ludewig, Gabriele

    2016-02-01

    PCBs are persistent organic pollutants that are carcinogenic and immunotoxic and have developmental toxicity. This suggests that they may interfere with normal cell maturation. Cancer and stem/progenitor cells have telomerase activity to maintain and protect the chromosome ends, but lose this activity during differentiation. We hypothesized that PCBs interfere with telomerase activity and the telomere complex, thereby disturbing cell differentiation and stem/progenitor cell function. HL-60 cells are cancer cells that can differentiated into granulocytes and monocytes. We exposed HL-60 cells to PCB126 (dioxin-like) and PCB153 (nondioxin-like) 6 days before and during 3 days of differentiation. The differentiated cells showed G0/G1 phase arrest and very low telomerase activity. hTERT and hTR, two telomerase-related genes, were downregulated. The telomere shelterins TRF1, TRF2, and POT1 were upregulated in granulocytes, and TRF2 was upregulated and POT1 downregulated in monocytes. Both PCBs further reduced telomerase activity in differentiated cells, but had only small effects on the differentiation and telomere-related genes. Treatment of undifferentiated HL-60 cells for 30 days with PCB126 produced a downregulation of telomerase activity and a decrease of hTERT, hTR, TRF1, and POT1 gene expression. With PCB153, the effects were less pronounced and some shelterin genes were increased after 30 days of exposure. With each PCB, no differentiation of cells was observed and cells continued to proliferate despite reduced telomerase activity, resulting in shortened telomeres after 30 days of exposure. These results indicate cell-type and PCB congener-specific effects on telomere/telomerase-related genes. Although PCBs do not seem to strongly affect differentiation, they may influence stem or progenitor cells through telomere attrition with potential long-term consequences for health. PMID:26330309

  19. PCB glass-fibre laminates: Thermal conductivity measurements and their effect on simulation

    NASA Astrophysics Data System (ADS)

    Sarvar, F.; Poole, N. J.; Witting, P. A.

    1990-12-01

    Accurate values of thermal conductivity are required for the simulation of temperature phenomena in electronic circuits. This paper presents the results of measurements carried out to determine the thermal conductivity along and normal to the plane of fibre glass laminates used in the manufacture of printed circuit boards. It has been found that the reinforced fibre-glass substrates used in PCBs are strongly anisotropic with the conductivity normal to the boards being much smaller than tangential to it. The test samples were type FR4 epoxy/glass laminates. An experiment has been designed which determines the thermal conductivity in-the-plane of the laminates by matching the measured temperature distribution along a heated specimen with a finite difference solution. An electrically heated Lees’ disc apparatus is also used to measure the thermal conductivity of these boards in a direction normal to their plane. The samples tested yielded values of 0.343 W/mK and 1.059 W/mK for thermal conductivity through and along the plane of the boards, respectively.

  20. 40 CFR 761.62 - Disposal of PCB bulk product waste.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 32 2013-07-01 2013-07-01 false Disposal of PCB bulk product waste..., AND USE PROHIBITIONS Storage and Disposal § 761.62 Disposal of PCB bulk product waste. PCB bulk product waste shall be disposed of in accordance with paragraph (a), (b), or (c) of this section....