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Sample records for control circuit boards

  1. Sampling and Control Circuit Board for an Inertial Measurement Unit

    NASA Technical Reports Server (NTRS)

    Chelmins, David T (Inventor); Powis, Richard T., Jr. (Inventor); Sands, Obed (Inventor)

    2016-01-01

    A circuit board that serves as a control and sampling interface to an inertial measurement unit ("IMU") is provided. The circuit board is also configured to interface with a local oscillator and an external trigger pulse. The circuit board is further configured to receive the external trigger pulse from an external source that time aligns the local oscillator and initiates sampling of the inertial measurement device for data at precise time intervals based on pulses from the local oscillator. The sampled data may be synchronized by the circuit board with other sensors of a navigation system via the trigger pulse.

  2. Sampling and Control Circuit Board for an Inertial Measurement Unit

    NASA Technical Reports Server (NTRS)

    Chelmins, David; Powis, Rick

    2012-01-01

    Spacesuit navigation is one component of NASA s efforts to return humans to the Moon. Studies performed at the NASA Glenn Research Center (GRC) considered various navigation technologies and filtering approaches to enable navigation on the lunar surface. As part of this effort, microelectromechanical systems (MEMS) inertial measurement units (IMUs) were studied to determine if they could supplement a radiometric infrastructure. MEMS IMUs were included in the Lunar Extra-Vehicular Activity Crewmember Location Determination System (LECLDS) testbed during NASA s annual Desert Research and Technology Studies (D-RATS) event in 2009 and 2010. The testbed included one IMU in 2009 and three IMUs in 2010, along with a custom circuit board interfacing between the navigation processor and each IMU. The board was revised for the 2010 test, and this paper documents the design details of this latest revision of the interface circuit board and firmware.

  3. Printed circuit board industry.

    PubMed

    LaDou, Joseph

    2006-05-01

    The printed circuit board is the platform upon which microelectronic components such as semiconductor chips and capacitors are mounted. It provides the electrical interconnections between components and is found in virtually all electronics products. Once considered low technology, the printed circuit board is evolving into a high-technology product. Printed circuit board manufacturing is highly complicated, requiring large equipment investments and over 50 process steps. Many of the high-speed, miniaturized printed circuit boards are now manufactured in cleanrooms with the same health and safety problems posed by other microelectronics manufacturing. Asia produces three-fourths of the world's printed circuit boards. In Asian countries, glycol ethers are the major solvents used in the printed circuit board industry. Large quantities of hazardous chemicals such as formaldehyde, dimethylformamide, and lead are used by the printed circuit board industry. For decades, chemically intensive and often sloppy manufacturing processes exposed tens of thousands of workers to a large number of chemicals that are now known to be reproductive toxicants and carcinogens. The printed circuit board industry has exposed workers to high doses of toxic metals, solvents, acids, and photolithographic chemicals. Only recently has there been any serious effort to diminish the quantity of lead distributed worldwide by the printed circuit board industry. Billions of electronics products have been discarded in every region of the world. This paper summarizes recent regulatory and enforcement efforts. PMID:16580876

  4. Fluid Power Multi-actuator Circuit Board with Microcomputer Control Option.

    ERIC Educational Resources Information Center

    McKechnie, R. E.; Vickers, G. W.

    1981-01-01

    Describes a portable fluid power engineering laboratory and class demonstration apparatus designed to enable students to design, build, and test multi-actuator circuits. Features a variety of standard pneumatic values and actuators fitted with quick disconnect couplings. Discusses sequencing circuit boards, microcomputer control, cost, and…

  5. Machine vision system for the industrial quality control of printed circuit boards

    NASA Astrophysics Data System (ADS)

    Esteve-Taboada, José J.; Pastor, Begoña; Goñi, Ignacio; García, Ramón; Hervas, Juan; Molina-Jiménez, Teresa; Simón, Santiago; Pérez, Emilio

    2005-09-01

    In this paper we present an automatic system for the on-line quality control of printed circuit boards. A line-scan camera permits the acquisition of a 550 mm wide image with a resolution up to 70 microns/pixel. The system detects the following type of errors: cuts and short circuits in tracks, stains, ink excess or faults, pores, omissions, "bites" and track narrowing. The input for the system are just the Gerber data files corresponding to the circuit to be analyzed. All the tolerances and precision factors can be modified directly from the user-friendly interface. For each analyzed board, the type of error detected and its location inside the circuit are indicated in the interface. For each set of analyzed circuits the system provides information for statistical control of the results.

  6. Coating Circuit Boards With Silicone

    NASA Technical Reports Server (NTRS)

    Gaudiano, S.

    1986-01-01

    Techniques appropriate to boards containing CMOS circuits detailed. Document presents procedure for applying thin conformal coating to such electronic assemblies as printed-circuit boards and wire-wrapped boards. Coating is from 1 to 7 mils (25 to 178 micrometers) thick and composed of room-temperature-vulcanizing (RTV) silicone. Specifies materials, equipment, spraying method, and quality requirements. Takes into account special needs of circuits made with complementary metal-oxide/semiconductor (CMOS) devices on circuit boards. Special attention given to preventing damage by electrostatic discharge, to which CMOS circuits especially sensitive.

  7. Training Circuit Boards

    NASA Technical Reports Server (NTRS)

    1986-01-01

    Young Electronics Company's new product is a testboard developed by the Jet Propulsion Laboratory as a tool for training and qualifying personnel in board assembly and in the art of soldering components without damaging boards or components. The boards are used for pre- employment testing and employee requalification.

  8. Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control.

    PubMed

    Chiang, Hung-Lung; Lin, Kuo-Hsiung

    2014-01-15

    The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H2, CH4, CO2, and NOx, were 60-115, 0.4-4.0, 1.1-10, 30-95, and 0-0.7mg/g, corresponding to temperatures ranging from 200 to 500°C. When the pyrolysis temperature was lower than 300°C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400°C. When VOC exhaust was flowed through the bed of Fe-impregnated Al2O3, the emission of ozone precursor VOCs could be reduced by 70-80%. PMID:24239260

  9. Removing Bonded Integrated Circuits From Boards

    NASA Technical Reports Server (NTRS)

    Rice, John T.

    1989-01-01

    Small resistance heater makes it easier, faster, and cheaper to remove integrated circuit from hybrid-circuit board, package, or other substrate for rework. Heater, located directly in polymeric bond interface or on substrate under integrated-circuit chip, energized when necessary to remove chip. Heat generated softens adhesive or solder that bonds chip to substrate. Chip then lifted easily from substrate.

  10. Modular chassis simplifies packaging and interconnecting of circuit boards

    NASA Technical Reports Server (NTRS)

    Arens, W. E.; Boline, K. G.

    1964-01-01

    A system of modular chassis structures has simplified the design for mounting a number of printed circuit boards. This design is structurally adaptable to computer and industrial control system applications.

  11. The p53 circuit board

    PubMed Central

    Sullivan, Kelly D.; Gallant-Behm, Corrie L.; Henry, Ryan E.; Fraikin, Jean-Luc; Espinosa, Joaquín M.

    2012-01-01

    The p53 tumor suppressor is embedded in a large gene network controlling diverse cellular and organismal phenotypes. Multiple signaling pathways converge onto p53 activation, mostly by relieving the inhibitory effects of its repressors, MDM2 and MDM4. In turn, signals originating from increased p53 activity diverge into distinct effector pathways to deliver a specific cellular response to the activating stimuli. Much attention has been devoted to dissecting how the various input pathways trigger p53 activation and how the activity of the p53 protein itself can be modulated by a plethora of co-factors and post-translational modifications. In this review we will focus instead on the multiple configurations of the effector pathways. We will discuss how p53-generated signals are transmitted, amplified, resisted and eventually integrated by downstream gene circuits operating at the transcriptional, post-transcriptional and post-translational level. We will also discuss how context-dependent variations in these gene circuits define the cellular response to p53 activation and how they may impact the clinical efficacy of p53-based targeted therapies. PMID:22333261

  12. Ultrasonic evaluation of high voltage circuit boards

    NASA Technical Reports Server (NTRS)

    Klima, S. J.; Riley, T. J.

    1976-01-01

    Preliminary observations indicate that an ultrasonic scanning technique may be useful as a quick, low cost, nondestructive method for judging the quality of circuit board materials for high voltage applications. Corona inception voltage tests were conducted on fiberglass-epoxy and fiberglass-polyimide high pressure laminates from 20 to 140 C. The same materials were scanned ultrasonically by utilizing the single transducer, through-transmission technique with reflector plate, and recording variations in ultrasonic energy transmitted through the board thickness. A direct relationship was observed between ultrasonic transmission level and corona inception voltage. The ultrasonic technique was subsequently used to aid selection of high quality circuit boards for the Communications Technology Satellite.

  13. Printed circuit board layout by microcomputer

    NASA Astrophysics Data System (ADS)

    Krausman, E. W.

    1983-12-01

    Printed circuit board artwork is usually prepared manually because of the unavailability of computer-aided-design tools. This thesis presents the design of a microcomputer based printed circuit board layout system that is easy to use and cheap. Automatic routing and component placement routines will significantly speed up the process. The design satisfies the following requirements: Microcomputer implementation, portable, algorithm independent, interactive, and user friendly. When it is fully implemented a user will be able to select components and a board outline from an automated catalog, enter a schematic diagram, position the components on the board, and completely route the board from a single graphics terminal. Currently, the user interface and the outer level command processor have been implemented in Pascal. Future versions will be written in C for better portability.

  14. Laser drilling for improving circuit board manufacturing

    NASA Astrophysics Data System (ADS)

    Yu, Gang; Zhang, Jincheng; Gao, Chunlin; Wang, Honcai; Li, Ping; An, Yongqiang; Zhang, Guiqiu

    1998-08-01

    We reported here a novel technique for laser high speed drillings on Printed Circuit Boards (PCBs). A CNC solid laser based system is developed to drill through and blind vias as an alternative to mechanical drilling. The system employs an Acousto-Optic Q-switched Nd:YAG laser, a computer control system and an X-Y moving table which can handle up to 400 X 400 mm PCB. With a special designed cavity the laser system works in a pulsed operation in order to generate pulses with width down to 0.5 microseconds and maximum peak power over 10 kW at 10 k repetition rate. Delivered by an improved optical beam transforming system, the focused laser beam can drill holes including blind vias on PCBs with diameter in the range of 0.1 - 0.4 mm and at up to 300 - 500 vias per second (depending on the construction of PCBs). By means of a CNC X-Y moving system, laser pulses with pulse-to-pulse superior repeatability can be fired at desired location on a PCBs with high accuracy. This alternative technology for drilling through or blind vias on PCBs or PWBs (printed wiring boards) will obviously enhance the capability to printed boards manufacturing.

  15. Optical interconnections on printed circuit boards

    NASA Astrophysics Data System (ADS)

    Griese, Elmar

    2000-05-01

    In this paper an optical interconnection technology for high-speed printed circuit board application is presented. This technology is widely compatible with the existing design and manufacturing technologies of conventional multi- layer pc boards and it combines electrical and optical interconnects on pc board level. Using this interconnection technology on-board bandwidth of several Gbps can be realized. As conventional pc board technology provides sufficient performance characteristics for the majority of all on-board signals only a hybrid technology which is compatible to the existing printed circuit board design and manufacturing processes is able to lead to a practical solution at reasonable cost. This compatibility demand results in different technological, functional, and economic requirements which also consider potential application for high performance computing and telecommunication hardware. In this paper an overview is given on the requirements, on the basic technologies for manufacturing electrical-optical pc boards as well as on the extended design process with its modeling and simulation methodologies and strategies.

  16. Flexible composite film for printed circuit board

    NASA Technical Reports Server (NTRS)

    Yabe, K.; Asakura, M.; Tanaka, H.; Soda, A.

    1982-01-01

    A flexible printed circuit for a printed circuit board in which layers of reaction product composed of a combination of phenoxy resin - polyisocyanate - brominated epoxy resin, and in which the equivalent ratio of those functional groups is hydroxyl group: isocyanate group: epoxy group - 1 : 0.2 to 2 : 0.5 to 3 are laminated on at least one side of saturated polyester film is discussed.

  17. Sensing requirements for modern circuit board inspection

    NASA Astrophysics Data System (ADS)

    Harvey, D. M.; Zhang, G.-Ming; Braden, D. R.

    2007-07-01

    The rapid shrinking of feature size, complex 3D structures, and introduction of new materials challenges inspection, measurement and test platform technology for future packages. This paper outlines the sensing requirements for modern circuit board inspection. The limitations of current imaging techniques have been demonstrated. Solutions based on X-ray and acoustic imaging have been proposed to meet the challenges of future diagnostics.

  18. Automatic inspection system for printed circuit boards.

    PubMed

    Hara, Y; Akiyama, N; Karasaki, K

    1983-06-01

    The purpose of this correspondence is to present problems and methods in automating visual inspection of printed circuit boards (PCB's). Vertical and diagonal illumination are useful in detecting PCB patterns correctly. An algorithm comparing local features of the patterns to be inspected with those of the pattern to be referenced is proposed. An inspection system using developed technologies is also described. PMID:21869150

  19. Packaging Of Control Circuits In A Robot Arm

    NASA Technical Reports Server (NTRS)

    Kast, William

    1994-01-01

    Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

  20. Interface between a printed circuit board computer aided design tool (Tektronix 4051 based) and a numerical paper tape controlled drill press (Slo-Syn 530: 100 w/ Dumore Automatic Head Number 8391)

    SciTech Connect

    Heckman, B.K.; Chinn, V.K.

    1981-01-01

    The development and use of computer programs written to produce the paper tape needed for the automation, or numeric control, of drill presses employed to fabricate computed-designed printed circuit boards are described. (LCL)

  1. Dimensional stability of multilayer circuit boards

    NASA Astrophysics Data System (ADS)

    Shrotriya, Pranav

    The present work investigates the time and temperature dependent response of the woven composite substrate used in multilayer circuit board applications and its influence on the residual stress development during processing and post-processing of the circuit boards. The fabric architecture of one commonly used substrate (7628 fabric style) is characterized using optical microscopy. The creep compliance and stress relaxation of the composite substrate and the FR-4 matrix are determined through accelerated viscoelastic characterization. Both finite element analysis (FEA) and theoretical analysis models are developed for prediction of the substrate response from the measured matrix and fabric properties. Comparison of the micromechanical model predictions with the measured response reveals the influence of fabric architecture and boundary conditions on the composite viscoelastic properties. Moire interferometry is utilized to investigate deformation of the composite unit cell and verify the physical basis for kinematic assumptions of the micromechanical models. Numerical and experimental studies are performed to study residual deformation and warpage in a model multilayer circuit board construction of a common composite substrate (7628 fabric style). A numerical procedure based on classical lamination theory with non-isothermal viscoelastic constitutive relations is developed to predict the deformation and residual stress state due to relamination. Experimental values of the substrate stress relaxation modulus and coefficients of thermal expansion (CTE) are used as inputs in the numerical procedure to predict warpage of model circuit boards with a non-symmetric lay-up of 7628 style composite substrate. Boards with the exact same construction as used in the numerical analysis were fabricated according to the prescribed pressing cycle and the time dependent warpage measured using an ultrasonic contour scan technique. Comparison of the experimental warpage data with

  2. Physically separating printed circuit boards with a resilient, conductive contact

    NASA Technical Reports Server (NTRS)

    Baker, John D. (Inventor); Montalvo, Alberto (Inventor)

    1999-01-01

    A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

  3. Improving Heat Transfer Performance of Printed Circuit Boards

    NASA Technical Reports Server (NTRS)

    Schatzel, Donald V.

    2009-01-01

    This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

  4. Laser prototyping of printed circuit boards

    NASA Astrophysics Data System (ADS)

    Nowak, M. R.; Antończak, A. J.; Kozioł, P. E.; Abramski, K. M.

    2013-09-01

    This paper describes the application of laser micromachining to rapid prototyping of printed circuit boards (PCB) using nano-second lasers: the solid-state Nd:YAG (532/1064 nm) laser and the Yb:glass fiber laser (1060 nm). Our investigations included tests for various mask types (synthetic lacquer, light-sensitive emulsion and tin). The purpose of these tests was to determine some of the basic parameters such as the resolution of PCB prototyping, speed of processing and quality of PCB mapping with commonly available laser systems. Optimization of process parameters and the proposed conversion algorithm have allowed us to produce circuit boards with a resolution similar to that of the Laser Direct Imaging (LDI) technology.

  5. A Docking Casette For Printed Circuit Boards

    DOEpatents

    Barringer, Dennis R.; Seminaro, Edward J.; Toffler, Harold M.

    2003-08-19

    A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit board and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a linkage mechanism, wherein the linkage mechanism includes an engagement configuration and a disengagement configuration and wherein the linkage mechanism is disposed so as to be associated with the cassette housing and a housing bezel, wherein the housing bezel is disposed relative to the cassette housing so as to be associated with the cable opening.

  6. Printed Circuit Board Design with HDL Designer

    NASA Technical Reports Server (NTRS)

    Winkert, Thomas K.; LaFourcade, Teresa

    2004-01-01

    Staying up to date with the latest CAD tools both from a cost and time perspective is difficult. Within a given organization there may be experts in Printed Circuit Board Design tools and experts in FPGA/VHDL tools. Wouldn't it be great to have someone familiar with HDL Designer be able to design PCBs without having to learn another tool? This paper describes a limited experiment to do this.

  7. Document Template for Printed Circuit Board Layout

    SciTech Connect

    Anderson, J.T.; /Fermilab

    1998-01-01

    The purpose of this document is to list the information that may be required to properly specify a printed circuit board (PCB) design. You must provide sufficient information to the PCB layout vendor such that they can quote accurately and design the PCB that you need. Use the following information as a guide to write your specification. Include as much of it as is necessary to get the PCB design that you want.

  8. CAD-CAM printed circuit board design

    NASA Astrophysics Data System (ADS)

    Agy, W. E.

    A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.

  9. Hard and flexible optical printed circuit board

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, Hyun Sik; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.

    2007-02-01

    We report on the design and fabrication of hard and flexible optical printed circuit boards (O-PCBs). The objective is to realize generic and application-specific O-PCBs, either in hard form or flexible form, that are compact, light-weight, low-energy, high-speed, intelligent, and environmentally friendly, for low-cost and high-volume universal applications. The O-PCBs consist of 2-dimensional planar arrays of micro/nano-scale optical wires, circuits and devices that are interconnected and integrated to perform the functions of sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards. For fabrication, the polymer and organic optical wires and waveguides are first fabricated on a board and are used to interconnect and integrate micro/nano-scale photonic devices. The micro/nano-optical functional devices include lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices. For flexible boards, the optical waveguide arrays are fabricated on flexible poly-ethylen terephthalate (PET) substrates by UV embossing. Electrical layer carrying VCSEL and PD array is laminated with the optical layer carrying waveguide arrays. Both hard and flexible electrical lines are replaced with high speed optical interconnection between chips over four waveguide channels up to 10Gbps on each. We discuss uses of hard or flexible O-PCBs for telecommunication systems, computer systems, transportation systems, space/avionic systems, and bio-sensor systems.

  10. High density printed electrical circuit board card connection system

    DOEpatents

    Baumbaugh, Alan E.

    1997-01-01

    A zero insertion/extraction force printed circuit board card connection system comprises a cam-operated locking mechanism disposed along an edge portion of the printed circuit board. The extrusions along the circuit board mate with an extrusion fixed to the card cage having a plurality of electrical connectors. The card connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned. The card connection system provides a simple solution to the need for a greater number of electrical signal connections.

  11. High density printed electrical circuit board card connection system

    DOEpatents

    Baumbaugh, A.E.

    1997-05-06

    A zero insertion/extraction force printed circuit board card connection system comprises a cam-operated locking mechanism disposed along an edge portion of the printed circuit board. The extrusions along the circuit board mate with an extrusion fixed to the card cage having a plurality of electrical connectors. The card connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned. The card connection system provides a simple solution to the need for a greater number of electrical signal connections. 12 figs.

  12. Developing 300°C Ceramic Circuit Boards

    SciTech Connect

    Normann, Randy A

    2015-02-15

    This paper covers the development of a geothermal ceramic circuit board technology using 3D traces in a machinable ceramic. Test results showing the circuit board to be operational to at least 550°C. Discussion on producing this type of board is outlined along with areas needing improvement.

  13. DASLL. Printed Circuit Board Design Automation

    SciTech Connect

    Magnuson, W.G.Jr.; Willett, G.W.

    1983-06-03

    DASLL (Design Automation System at Lawrence Livermore) is a set of computer programs for printed circuit board (PCB) layout. The DASLL system can process a number of PCB trimlines, including: DEC 1, 2, 4, and 6 high configurations, CLI, Augat, Varian, and several rectangular geometries; others can be added. Over 800 components and generic package types are available in DASLLDB, the system reference library. Two-layer boards with non-gridded (structured) power and ground busses are supported, and PCB densities of approximately 1.2 square inches per equivalent IC (or less dense) are best accommodated by DASLL. The system has been used to make etch artwork and drill tapes (starting with a schematic drawing) for a six IC CLI board in less than two working days. Initial processing will produce reports and computer printer-plots which can be used to verify the input. Final output can include silkscreen photo-artwork, PCB etch photo-artwork, punched paper tapes for the SLO-SYN and Pratt-Whitney N/C drill machines, and computer listings of signal strings, parts lists, etc.

  14. GUIDES TO POLLUTION PREVENTION: THE PRINTED CIRCUIT BOARD MANUFACTURING INDUSTRY

    EPA Science Inventory

    This document reviews the operations of printed circuit board manufacturers, identifies techniques that allow these companies to reduce wastes, and provides a set of self-audit checklists to assist printed circuit board manufacturers in setting up a waste reduction program. his r...

  15. ELECTRONIC PHASE CONTROL CIRCUIT

    DOEpatents

    Salisbury, J.D.; Klein, W.W.; Hansen, C.F.

    1959-04-21

    An electronic circuit is described for controlling the phase of radio frequency energy applied to a multicavity linear accelerator. In one application of the circuit two cavities are excited from a single radio frequency source, with one cavity directly coupled to the source and the other cavity coupled through a delay line of special construction. A phase detector provides a bipolar d-c output signal proportional to the difference in phase between the voltage in the two cavities. This d-c signal controls a bias supply which provides a d-c output for varying the capacitnce of voltage sensitive capacitors in the delay line. The over-all operation of the circuit is completely electronic, overcoming the time response limitations of the electromechanical control systems, and the relative phase relationship of the radio frequency voltages in the two caviiies is continuously controlled to effect particle acceleration.

  16. Evaluating the Effects of Aging on Electronic Instrument and Control Circuit Boards and Components in Nuclear Power Plants

    SciTech Connect

    G. William Hannaman; C. Dan Wilkinson

    2005-05-15

    The report describes potentially useful techniques for monitoring the aging of I&C boards. The techniques have been grouped into: periodic testing, reliability modeling, resistance measures, signal comparison, eternal measures, and internal measures, each representing distinct theoretical approaches to detection and evaluation.

  17. Inrush Current Control Circuit

    NASA Technical Reports Server (NTRS)

    Cole, Steven W. (Inventor)

    2002-01-01

    An inrush current control circuit having an input terminal connected to a DC power supply and an output terminal connected to a load capacitor limits the inrush current that charges up the load capacitor during power up of a system. When the DC power supply applies a DC voltage to the input terminal, the inrush current control circuit produces a voltage ramp at the load capacitor instead of an abrupt DC voltage. The voltage ramp results in a constant low level current to charge up the load capacitor, greatly reducing the current drain on the DC power supply.

  18. Process produces accurate registry between circuit board prints

    NASA Technical Reports Server (NTRS)

    1966-01-01

    Tapes and quick-mount circles of contrasting colors aid in obtaining precise registry between the two circuits of two-sided printed circuit boards. The tapes and circles are mounted on opposite sides of transparent plastic film to define the conductive path and feed-through hole locations.

  19. Polymer fiber-image-guide-based embedded optical circuit board.

    PubMed

    Ai, J; Li, Y

    1999-01-10

    We propose a poly(methyl methacrylate) fiber-image-guide-based embedded optical circuit board for future optoelectronic array-interconnection applications. An experimental prototypical board that embeds perfect-shuffle and banyan interconnect patterns of 16 x 16 parallel links, each of which offers a fiber pixel density of >1000 pixels/mm(2), are demonstrated experimentally. PMID:18305618

  20. Laser structuring of ultra-fine circuit lines in printed circuit boards: Laser structuring, neodymium-doped yttrium aluminium garnet laser, fine circuit lines

    NASA Astrophysics Data System (ADS)

    Zhang, Bin

    Laser structuring technique emerged in recent years for the need of fabricating fine circuit lines and spaces in printed circuit board. Most of the previous work only introduced laser structuring as a new method in the fabrication of fine circuit lines and mentioned that the width of circuit line can be reduced under 50 pin or helox with this technique. Laser structuring technique will have a prosperous future only when the relationship between process parameters and fabrication results are deeply understood. This study focuses on the control, prediction and optimization of circuit geometry by studying relations between the process parameters and fabrication results in laser structuring technology. The effects of laser parameters (Frequency-tripled Nd:YAG laser) on the geometry of circuits were carried out by experiments and analyzed by mathematical method. The geometry of circuit space can efficiently be controlled by investigating the main factors that influence the characteristic parameters of circuit space with Taguchi methodology. ANN was firstly used in the study of laser structuring technique. With ANN models, the optimization of process parameters in laser writing step can be realized and the 2-D cross-sectional profile of circuit space can be calculated with the combination of ANN model and mathematical method. At last, the final circuit lines and circuit spaces fabricated were tested using the quality and reliability tests---electrical open/short test, peel test and surface insulation resistance test (SIR test). The minimum widths of circuit lines and circuit spaces with good quality and reliability fabricated by laser structuring were 25 mum and 45 mum respectively. The project is significant for both applied and academic fields. This study contributes to the understanding of the laser structuring technology and is of benefit in the fabrication of very fine line circuits in advanced printed circuit board industry.

  1. Laser technology in manufacture of printed-circuit boards

    NASA Astrophysics Data System (ADS)

    Machulka, G. A.; Stelmakh, M. F.; Uladinov, A. B.

    1985-09-01

    The complexity of the printed-circuit board manufacturing process, additionally encumbered by the intricacy of topology and layout, especially in multilayer boards, makes application of laser technology a very attractive possibility. Extensive studies have established the feasibility of using laser radiation in polygraphic dry offset printing, despite difficulties created by the high thermal conductivity of metallized surfaces, also in etching of patterns, drilling of holes, and soldering of joints. A gaseous (CO2) laser and a solid-state (garnet) laser have been found to be most suitable, each for specific operations. One of the most critical factors here is selection of oxidation-resistant materials for masks and insulation. The next step is incorporating the laser operations in the production line. The feasibility of this has been established in three versions. The first and simplest version, without computer, is proposed for experimental or pilot production of bilateral boards. The second version is proposed or commercial production, with an automatic work station and a control computer. In the third and most advanced version, for large-scale production, the automatic work station has been replaced by a computer-aided design system.

  2. International standardisation of optical circuit board measurement and fabrication procedures

    NASA Astrophysics Data System (ADS)

    Pitwon, Richard; Wang, Kai; Immonen, Marika; Wu, Jinhua; Zhu, Long Xiu; Yan, Hui Juan; Worrall, Alex

    2015-03-01

    Widespread adoption of optical circuit boards will herald substantial performance, environmental and cost benefits for the data communications industry. Though optical circuit board technology has advanced considerably over the past decade, commercial maturity will be gated by the availability of conformity standards to forge future quality assurance procedures. One important prerequisite to this is a reliable test and measurement definition system, which is agnostic to the type of waveguide system under test and therefore can be applied to different optical circuit board technologies as well as being adaptable to future variants. A serious and common problem with the measurement of optical waveguide systems has been lack of proper definition of the measurement conditions for a given test regime, and consequently strong inconsistencies ensue in the results of measurements by different parties on the same test sample. We report on the development of a new measurement identification standard to force testers to capture sufficient information about the measurement conditions for a given optical circuit board such as to ensure consistency of measurement results within an acceptable margin. Furthermore we demonstrate how the application of the measurement identification system can bring about a dramatic improvement in results consistency, by comparative evaluation of the results on multimode polymer waveguide based optical circuit test boards from a large selection of testing organisations.

  3. Compensated gain control circuit for buck regulator command charge circuit

    DOEpatents

    Barrett, David M.

    1996-01-01

    A buck regulator command charge circuit includes a compensated-gain control signal for compensating for changes in the component values in order to achieve optimal voltage regulation. The compensated-gain control circuit includes an automatic-gain control circuit for generating a variable-gain control signal. The automatic-gain control circuit is formed of a precision rectifier circuit, a filter network, an error amplifier, and an integrator circuit.

  4. Compensated gain control circuit for buck regulator command charge circuit

    DOEpatents

    Barrett, D.M.

    1996-11-05

    A buck regulator command charge circuit includes a compensated-gain control signal for compensating for changes in the component values in order to achieve optimal voltage regulation. The compensated-gain control circuit includes an automatic-gain control circuit for generating a variable-gain control signal. The automatic-gain control circuit is formed of a precision rectifier circuit, a filter network, an error amplifier, and an integrator circuit. 5 figs.

  5. Effective electromagnetic shielding in multilayer printed circuit boards

    NASA Astrophysics Data System (ADS)

    Wiles, K. G.; Moe, J. L.

    Multilayer printed circuit boards have proven to be recurrent abettors of electromagnetic coupling problems created by the incessantly faster response times in integrated circuit technologies. Coupling within multilayer boards has not only inhibited meeting certain EMI requirements but has also precipitated 'self-inflicted' malfunctions commonly experienced during development of avionic systems. A recent avionic system, interfacing two asynchronous processors through a fourteen-layer motherboard, permitted coupling through ground plane connector apertures of sufficient amplitude and duration as to cause unintentional intercommunication and system malfunctions. The coupling mechanism and ground plane modifications which reduced this coupling by 40 dB and eliminated the incompatibility are discussed in this paper

  6. Electronic control circuits: A compilation

    NASA Technical Reports Server (NTRS)

    1973-01-01

    A compilation of technical R and D information on circuits and modular subassemblies is presented as a part of a technology utilization program. Fundamental design principles and applications are given. Electronic control circuits discussed include: anti-noise circuit; ground protection device for bioinstrumentation; temperature compensation for operational amplifiers; hybrid gatling capacitor; automatic signal range control; integrated clock-switching control; and precision voltage tolerance detector.

  7. Printed circuit boards: a review on the perspective of sustainability.

    PubMed

    Canal Marques, André; Cabrera, José-María; Malfatti, Célia de Fraga

    2013-12-15

    Modern life increasingly requires newer equipments and more technology. In addition, the fact that society is highly consumerist makes the amount of discarded equipment as well as the amount of waste from the manufacture of new products increase at an alarming rate. Printed circuit boards, which form the basis of the electronics industry, are technological waste of difficult disposal whose recycling is complex and expensive due to the diversity of materials and components and their difficult separation. Currently, printed circuit boards have a fixing problem, which is migrating from traditional Pb-Sn alloys to lead-free alloys without definite choice. This replacement is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling and leads to other problems, such as temperature rise, delamination, flaws, risks of mechanical shocks and the formation of "whiskers". This article presents a literature review on printed circuit boards, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards. PMID:24189538

  8. Stripline/Microstrip Transition in Multilayer Circuit Board

    NASA Technical Reports Server (NTRS)

    Epp, Larry; Khan, Abdur

    2005-01-01

    A stripline-to-microstrip transition has been incorporated into a multilayer circuit board that supports a distributed solid-state microwave power amplifier, for the purpose of coupling the microwave signal from a buried-layer stripline to a top-layer microstrip. The design of the transition could be adapted to multilayer circuit boards in such products as cellular telephones (for connecting between circuit-board signal lines and antennas), transmitters for Earth/satellite communication systems, and computer mother boards (if processor speeds increase into the range of tens of gigahertz). The transition is designed to satisfy the following requirements in addition to the basic coupling requirement described above: (1) The transition must traverse multiple layers, including intermediate layers that contain DC circuitry. (2) The transition must work at a frequency of 32 GHz with low loss and low reflection. (3) The power delivered by the transition to top-layer microstrip must be split equally in opposite directions along the microstrip. Referring to the figure, this amounts to a requirement that when power is supplied to input port 1, equal amounts of power flow through output ports 2 and 3. (4) The signal-line via that is necessarily a part of such a transition must not be what is known in the art as a blind via; that is, it must span the entire thickness of the circuit board.

  9. Double sided circuit board and a method for its manufacture

    DOEpatents

    Lindenmeyer, C.W.

    1988-04-14

    Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths. 4 figs.

  10. Double sided circuit board and a method for its manufacture

    DOEpatents

    Lindenmeyer, Carl W.

    1989-01-01

    Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

  11. Double sided circuit board and a method for its manufacture

    DOEpatents

    Lindenmeyer, Carl W.

    1989-07-04

    Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

  12. FTIR analysis of printed-circuit board residue

    SciTech Connect

    Myers, S.A.; Cognata, T.D.; Gotts, H.

    1996-12-31

    Logic boards were failing at Enhanced Mac Minus One (EMMO) test or Integrated Circuit Test (ICT) after printed circuit board (PCB) rework. A resistor in the microcontroller circuit was identified on the flip side of the PCB. Several areas on the board, including the resistor R161, were seen to have a slight white haze/low gloss appearance on the surface of the PCB. To test if the residue was electrically conductive, five boards were selected whose sole failure was R161. The resistance of the individual resistors was measured with a digital multimeter (DMM). The resistor was then cleaned with isopropyl alcohol and a cotton swab. Each board was retested at ICT and the individual resistors measured again with a DMM. Cleaning the area surrounding the resistor with isopropyl alcohol, corrected the failure four of the times. Material was removed from the resistor and board surfaces by physically abrading the organic coating and transferring the abraded material to an infrared transparent substrate (single crystal silicon). FTIR spectra were collected in the transmittance mode using a Bio-Rad UMA 500 FTIR microscope using a circular aperture (40 micron diameter).

  13. Sequential computer algorithms for printed circuit board inspection

    NASA Astrophysics Data System (ADS)

    Hernandez, Moises E.; Villalobos, Jesus R.; Johnson, W. Carrol

    1993-08-01

    Surface mounted technology (SMT) in automated assembly facilities requires the use of automatic surface-mount-device (SMD) placement machines. One of the problems involved in the electronic printed circuit board (PCB) assembly process is the verification of the SMD placement operation within tight tolerances. The high throughput of modern manufacturing lines along with the required accuracy demand the use of automatic inspection systems to verify SMD placement. Image complexity of the board makes the use of machine vision for the inspection process a difficult task. This is complicated by the fact that misclassification errors should be kept to a minimum. Additionally, it is desirable that the inspection results provide enough information to be used for statistical process control (SPC). The strategy adopted to solve this problem was to simplify the complexity of the image by means of special illumination devices. The simplified image was then suitable for analysis by simple processing, segmentation, and detection algorithms that, sequentially applied to the image, met the required repeatability and accuracy specifications for the inspection system. The scope of this paper is to describe the techniques explored by the authors to solve the SMD inspection problem in order to develop a working industrial SMD inspection system.

  14. Optically controllable molecular logic circuits

    NASA Astrophysics Data System (ADS)

    Nishimura, Takahiro; Fujii, Ryo; Ogura, Yusuke; Tanida, Jun

    2015-07-01

    Molecular logic circuits represent a promising technology for observation and manipulation of biological systems at the molecular level. However, the implementation of molecular logic circuits for temporal and programmable operation remains challenging. In this paper, we demonstrate an optically controllable logic circuit that uses fluorescence resonance energy transfer (FRET) for signaling. The FRET-based signaling process is modulated by both molecular and optical inputs. Based on the distance dependence of FRET, the FRET pathways required to execute molecular logic operations are formed on a DNA nanostructure as a circuit based on its molecular inputs. In addition, the FRET pathways on the DNA nanostructure are controlled optically, using photoswitching fluorescent molecules to instruct the execution of the desired operation and the related timings. The behavior of the circuit can thus be controlled using external optical signals. As an example, a molecular logic circuit capable of executing two different logic operations was studied. The circuit contains functional DNAs and a DNA scaffold to construct two FRET routes for executing Input 1 AND Input 2 and Input 1 AND NOT Input 3 operations on molecular inputs. The circuit produced the correct outputs with all possible combinations of the inputs by following the light signals. Moreover, the operation execution timings were controlled based on light irradiation and the circuit responded to time-dependent inputs. The experimental results demonstrate that the circuit changes the output for the required operations following the input of temporal light signals.

  15. Optically controllable molecular logic circuits

    SciTech Connect

    Nishimura, Takahiro Fujii, Ryo; Ogura, Yusuke; Tanida, Jun

    2015-07-06

    Molecular logic circuits represent a promising technology for observation and manipulation of biological systems at the molecular level. However, the implementation of molecular logic circuits for temporal and programmable operation remains challenging. In this paper, we demonstrate an optically controllable logic circuit that uses fluorescence resonance energy transfer (FRET) for signaling. The FRET-based signaling process is modulated by both molecular and optical inputs. Based on the distance dependence of FRET, the FRET pathways required to execute molecular logic operations are formed on a DNA nanostructure as a circuit based on its molecular inputs. In addition, the FRET pathways on the DNA nanostructure are controlled optically, using photoswitching fluorescent molecules to instruct the execution of the desired operation and the related timings. The behavior of the circuit can thus be controlled using external optical signals. As an example, a molecular logic circuit capable of executing two different logic operations was studied. The circuit contains functional DNAs and a DNA scaffold to construct two FRET routes for executing Input 1 AND Input 2 and Input 1 AND NOT Input 3 operations on molecular inputs. The circuit produced the correct outputs with all possible combinations of the inputs by following the light signals. Moreover, the operation execution timings were controlled based on light irradiation and the circuit responded to time-dependent inputs. The experimental results demonstrate that the circuit changes the output for the required operations following the input of temporal light signals.

  16. Testing of printed circuit board solder joints by optical correlation

    NASA Technical Reports Server (NTRS)

    Espy, P. N.

    1975-01-01

    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  17. Thermal analysis and design of air cooled electronic circuit boards using a desktop computer

    NASA Astrophysics Data System (ADS)

    Foltz, R. A.

    1980-06-01

    A thermal design procedure for air cooled electronic circuit boards has been developed for the Hewlett-Packard Model 9845 desktop computer. The system of interactive programs, called THERMELEX, performs thermal analysis of printed circuit boards to predict either junction temperatures for given power dissipation levels or the maximum power levels for given junction temperature limits. The system includes the following features: totally interactive with all input in question and answer format; simple data verification and correction capabilities; ability to store and retrieve circuit board descriptive data totally under program control; and wide variety of output formats including tabular and graphical. By using internal selection of heat transfer correlations, the THERMELEX system depends only on input of physical parameters for thermal predictions.

  18. Investigation of Solder Cracking Problems on Printed Circuit Boards

    NASA Technical Reports Server (NTRS)

    Berkebile, M. J.

    1967-01-01

    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  19. Detection of Banned and Restricted Ozone-Depleting Chemicals in Printed Circuit Boards

    SciTech Connect

    Lee, Richard N.; Wright, Bob W.

    2008-12-01

    A study directed toward the detection of halogenated solvents in the matrix of circuit boards has recently been completed. This work was undertaken to demonstrate the potential for reliable detection of solvents used during the fabrication of printed circuit boards (PCB). Since many of these solvents are now, or soon will be, restricted under the terms of legislation enacted in response to the Montreal Protocol and other international agreements, the work described here, conducted over a period of more that 4 years, has provided guidance for the development of chromatographic system and analytical protocol to assure compliance with regulations introduced to control, or ban, industrial solvents associated with adverse environmental impact.

  20. AQUEOUS CLEANING OF PRINTED CIRCUIT BOARD STENCILS

    EPA Science Inventory

    The USEPA through NRMRL has partnered with the California Dept. of Toxic Substance Control under an ETV Pilot Project to verigy polllution prevention, recycling and waste treatment technologies. One of the projects selected for verification was the ultrasonic aqueous cleaning tec...

  1. DASLL: An automatic printed circuit board layout system

    NASA Astrophysics Data System (ADS)

    Magnuson, W. G., Jr.

    1980-07-01

    The design automation system at Lawrence Livermore (DASLL) is a system of computer programs to automatically lay out printed circuit boards. The focus was on two sided PCB fabrication aids; primarily drill tape, documentation, and artwork generation (including etch, silkscreen, and drill schedule artwork). Limited four layer PCBs are also possible with the program. The DASLL can be used in either batch interactive or batch made of operation by technicians, draftsmen, designers, or engineers. Flexibility in being able to accommodate a diversity of trimline geometries and component shapes and placements was a goal in the design of the software. The system is also very flexible in its capability to deal with physical design rules. A principal objective for the system was low volume, quick turnaround response for low and medium density custom printed circuit boards.

  2. Coaxial connector for use with printed circuit board edge connector

    DOEpatents

    Howard, Donald R.; MacGill, Robert A.

    1989-01-01

    A coaxial cable connector for interfacing with an edge connector for a printed circuit board whereby a coaxial cable can be interconnected with a printed circuit board through the edge connector. The coaxial connector includes a body having two leg portions extending from one side for receiving the edge connector therebetween, and a tubular portion extending from an opposing side for receiving a coaxial cable. A cavity within the body receives a lug of the edge connector and the center conductor of the coaxial cable. Adjacent lugs of the edge connector can be bend around the edge connector housing to function as spring-loaded contacts for receiving the coaxial connector. The lugs also function to facilitate shielding of the center conductor where fastened to the edge connector lug.

  3. Pulsed thyristor trigger control circuit

    NASA Technical Reports Server (NTRS)

    Nola, F. J. (Inventor)

    1984-01-01

    A trigger control circuit is provided for producing firing pulses for the thyristor of a thyristor control system such as a power factor controller. The control circuit overcomes thyristor triggering problems involved with the current lag associated with controlling inductive loads and utilizes a phase difference signal, already present in the power factor controller, in deriving a signal for inhibiting generation of a firing pulse until no load current is flowing from the preceding half cycle and thereby ensuring that the thyristor is triggered on during each half cycle.

  4. Pollution prevention assessment for a printed circuit board plant

    SciTech Connect

    Edwards, H.W.; Kostrzewa, M.F.; Looby, G.P.

    1995-09-01

    The US Environmental Protection Agency (EPA) has funded a pilot project to assist small and medium-size manufacturers who want to minimize their generation of waste but who lack the expertise to do so. In an effort to assist these manufacturers Waste Minimization Assessment Centers (WMACs) were established at selected universities and procedures were adapted from the EPA Waste Minimization Opportunity Assessment Manual. The WMAC team at Colorado State University performed an assessment at a plant that manufacturers printed circuit boards. Templates for the circuit design are generated from customer-supplied circuit information. Copper/epoxy laminates and copper foil are cut into blank boards and layers. Circuit patterns are generated through a series of photolithographic and plating processes. The team`s report, detailing findings and recommendations, indicated that the onsite ion-exchange treatment of metal-containing rinse water generates regenerant solutions that could be further treated by electrowinning to recover metals and to achieve significant cost savings. This Research Brief was developed by the principal investigators and EPA`s National Risk Management Research Laboratory, Cincinnati, OH, to announce key findings of an ongoing research project that is fully documented in a separate report of the same title available from University City Science Center.

  5. 49 CFR 236.731 - Controller, circuit.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... Controller, circuit. A device for opening and closing electric circuits. ... 49 Transportation 4 2014-10-01 2014-10-01 false Controller, circuit. 236.731 Section 236.731 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD...

  6. 49 CFR 236.731 - Controller, circuit.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... Controller, circuit. A device for opening and closing electric circuits. ... 49 Transportation 4 2013-10-01 2013-10-01 false Controller, circuit. 236.731 Section 236.731 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD...

  7. 49 CFR 236.731 - Controller, circuit.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... Controller, circuit. A device for opening and closing electric circuits. ... 49 Transportation 4 2010-10-01 2010-10-01 false Controller, circuit. 236.731 Section 236.731 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD...

  8. 49 CFR 236.731 - Controller, circuit.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... Controller, circuit. A device for opening and closing electric circuits. ... 49 Transportation 4 2011-10-01 2011-10-01 false Controller, circuit. 236.731 Section 236.731 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD...

  9. 49 CFR 236.731 - Controller, circuit.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... Controller, circuit. A device for opening and closing electric circuits. ... 49 Transportation 4 2012-10-01 2012-10-01 false Controller, circuit. 236.731 Section 236.731 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD...

  10. PHOTOSENSITIVE RELAY CONTROL CIRCUIT

    DOEpatents

    Martin, C.F.

    1958-01-14

    adapted for the measurement of the time required for an oscillating member to pass through a preselected number of oscillations, after being damped to a certain maximum amplitude of oscillation. A mirror is attached to the moving member and directs light successively to a photocell which is part of a trigger unit and to first and second photocells which are part of a starter unit, as the member swings to its maximum amplitude. The starter and trigger units comprise thyratrons and relays so interconnected that the trigger circuit, although generating a counter pulse, does not register a count in the counter when the light traverses both photocells of the starter unit. When the amplitude of oscillation of the member decreases to where the second photocell is not transversed, the triggei pulse is received by the counter. The counter taen operates to register the desired number of oscillations and initiates and terminates a timer for measuring the time irterval for the preselected number of oscillations.

  11. Packaging printed circuit boards: A production application of interactive graphics

    NASA Technical Reports Server (NTRS)

    Perrill, W. A.

    1975-01-01

    The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

  12. Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

    SciTech Connect

    Yamane, Luciana Harue; Tavares de Moraes, Viviane; Crocce Romano Espinosa, Denise; Soares Tenorio, Jorge Alberto

    2011-12-15

    Highlights: > This paper presents new and important data on characterization of wastes of electric and electronic equipments. > Copper concentration is increasing in mobile phones and remaining constant in personal computers. > Printed circuit boards from mobile phones and computers would not be mixed prior treatment. - Abstract: This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of

  13. Design principles and realization of electro-optical circuit boards

    NASA Astrophysics Data System (ADS)

    Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry

    2013-02-01

    The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.

  14. Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers.

    PubMed

    Yamane, Luciana Harue; de Moraes, Viviane Tavares; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

    2011-12-01

    This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers. PMID:21820883

  15. CONTROL AND FAULT DETECTOR CIRCUIT

    DOEpatents

    Winningstad, C.N.

    1958-04-01

    A power control and fault detectcr circuit for a radiofrequency system is described. The operation of the circuit controls the power output of a radio- frequency power supply to automatically start the flow of energizing power to the radio-frequency power supply and to gradually increase the power to a predetermined level which is below the point where destruction occurs upon the happening of a fault. If the radio-frequency power supply output fails to increase during such period, the control does not further increase the power. On the other hand, if the output of the radio-frequency power supply properly increases, then the control continues to increase the power to a maximum value. After the maximumn value of radio-frequency output has been achieved. the control is responsive to a ''fault,'' such as a short circuit in the radio-frequency system being driven, so that the flow of power is interrupted for an interval before the cycle is repeated.

  16. Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device

    DOEpatents

    Anderson, Gene R.; Armendariz, Marcelino G.; Bryan, Robert P.; Carson, Richard F.; Duckett, III, Edwin B.; McCormick, Frederick B.; Peterson, David W.; Peterson, Gary D.; Reysen, Bill H.

    2005-03-15

    This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.

  17. [Selective recovery of copper, zinc and nickel from printed circuit boards by ammonia leaching under pressure].

    PubMed

    Wang, Meng; Cao, Hong-Bin; Zhang, Yi

    2011-02-01

    The ammonia/ammonium leaching process using oxygen as oxidant in autoclave was studied to extract copper, zinc and nickel from printed circuit board. Parameters such as leaching time, concentration of leaching reagents, stirring speed, oxygen pressure and temperature were optimized. The best results were achieved when the leaching was carried out at 55 degrees C for 150 minutes, using 4 mol/L NH4OH and 1 mol/L (NH4)2CO3 as leaching solution, with 700 r/min stirring speed and 0.2 MPa oxygen. With this method, Zn, Cu and Ni could be effectively recovered from printed circuit boards by 100%, more than 99% and more than 64%, respectively. The kinetics of Cu leaching behavior was studied and it was found that the shrinking core model described it well. It was a diffusion control process and the apparent activation energy was 14.68 kJ/mol. PMID:21528589

  18. Ion chromatography in the manufacture of multilayer circuit boards

    SciTech Connect

    Smith, R.E.

    1990-09-01

    Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. The manufacturing process is described briefly and previously published IC methods are reviewed. Then, methods are described for determining chlorate and chlorite in a brown oxide solution; salicylic acid in an epoxy cure agent; formate, sulfate, and tartrate in an electroless copper bath; anionic detergents in a tin-lead brightener and in a cleaning solution; and aqueous photoresist and nonionic brightener in a tin-lead bath. Anion exchange, reverse phase HPLC on a poly(styrene/divinylbenzene), PS/DVB, column and two-dimensional liquid chromatography also are described. Chemically suppressed conductivity and photometric detection are used. 13 refs., 10 figs., 1 tab.

  19. Sliding contacts on printed circuit boards and wear behavior

    NASA Astrophysics Data System (ADS)

    Le Solleu, J.-P.

    2010-04-01

    Automotive suppliers use since decades printed circuit boards (PCB) gold plating pads, as direct contact interface for low current sliding contacts. Several gold plating processes are available on the market, providing various wear behaviour. Some specific galvanic hard gold (AuCo or AuNi). plating was developed on PCB's. This specific plating generates extra costs due to the material quantity and also the process complexity. In a cost driven industry, the challenge is to use a standard low cost PCB for systems requesting high reliability performances. After a brief overview of standard PCB manufacturing processes and especially gold plating processes, the global experimental results of wear behaviour of three different gold plating technologies will be exposed and an explanation of the correlation between surface key parameters and wear out will be provided.

  20. Ultrasonic decontamination in perfluorinated liquids of radioactive circuit boards

    SciTech Connect

    Yam, C.S.; Harling, O.K.; Kaiser, R.

    1994-12-31

    A laboratory-scale ultrasonic decontamination system has been developed to demonstrate the application of Entropic System`s enhanced particle removal process to the radioactive decontamination of electronic circuit boards. The process uses inert perfluorinated liquids as the working media; the liquids have zero ozone depletion potential, are nontoxic, non-flammable, and are generally recognized as nonhazardous materials. The parts to be cleaned are first sonicated with a dilute solution of a high-molecular-weight fluorocarbon surfactant in an inert perfluorinated liquid. The combination of ultrasonic agitation and liquid flow promotes the detachment of the particles from the surface of the part being cleaned, their transfer from the boundary layer into the bulk liquid, and their removal from the cleaning environment, thereby reducing the probability of particle redeposition. After the cleaning process, the parts are rinsed with the pure perfluorinated liquid to remove residual surfactant. The parts are recovered after the perfluorinated liquid is evaporated into air.

  1. Printed-circuit-board manufacturer maximizes recycling opportunities

    SciTech Connect

    Edelstein, P. )

    1993-02-01

    A major New England printed-circuit-board manufacturer has avoided land disposal of several metallic wastes for more than 15 years by recycling them offsite. For example, the company uses ammoniacal etchant to etch copper. Waste generated by this process is used by an offsite recycler to produce copper compounds for pressure-treated lumber and for use as a catalyst. Sodium persulfate and peroxide-sulfuric micro-etchants are used at the facility, generating a crude copper sulfate solution, and copper sulfate also is the basis for the company's electroplating process. Wastes from all of these processes are used by an offsite recycler to produce copper compounds that are sold for use in wood treatment and as mining reagents. Finally, metal hydroxide sludge generated by the company's wastewater treatment system contains substantial amounts of copper, which is sent for refining at a copper smelter.

  2. Printed circuit board metal powder filters for low electron temperatures

    NASA Astrophysics Data System (ADS)

    Mueller, Filipp; Schouten, Raymond N.; Brauns, Matthias; Gang, Tian; Lim, Wee Han; Lai, Nai Shyan; Dzurak, Andrew S.; van der Wiel, Wilfred G.; Zwanenburg, Floris A.

    2013-04-01

    We report the characterisation of printed circuit boards (PCB) metal powder filters and their influence on the effective electron temperature which is as low as 22 mK for a quantum dot in a silicon MOSFET structure in a dilution refrigerator. We investigate the attenuation behaviour (10 MHz-20 GHz) of filter made of four metal powders with a grain size below 50 μm. The room-temperature attenuation of a stainless steel powder filter is more than 80 dB at frequencies above 1.5 GHz. In all metal powder filters, the attenuation increases with temperature. Compared to classical powder filters, the design presented here is much less laborious to fabricate and specifically the copper powder PCB-filters deliver an equal or even better performance than their classical counterparts.

  3. Radiological characterization of printed circuit boards for future elimination.

    PubMed

    Zaffora, Biagio; Magistris, Matteo

    2016-07-01

    Electronic components like printed circuit boards (PCBs) are commonly used in CERN's accelerator complex. During their lifetime some of these PCBs are exposed to a radiation field of protons, neutrons and pions and are activated. In view of their disposal towards the appropriate final repository, a radiological characterization must be performed. The present work proposes a general characterization procedure based on the definition of a reference chemical composition, on the calculation of the corresponding radionuclide inventory and on the measurement of a tracer radionuclide. This method has been validated with real-life cases of electronic boards which were exposed to the typical radiation fields in CERN's accelerators. The activation studies demonstrate that silver is the key element with respect to the radiological characterization of electronic waste due to the production of Ag-110m and Ag-108m. A sensitivity analysis shows that the waiting time is the main parameter affecting the radionuclide inventory. Results also indicate that, as is the case of other families of radioactive waste, an accurate assessment of the radiological inventory of PCBs would require the precise knowledge of their chemical composition, as well as the radiation field to which they were exposed. PMID:27129133

  4. 49 CFR 234.203 - Control circuits.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 49 Transportation 4 2012-10-01 2012-10-01 false Control circuits. 234.203 Section 234.203... EMERGENCY NOTIFICATION SYSTEMS Maintenance, Inspection, and Testing Maintenance Standards § 234.203 Control circuits. All control circuits that affect the safe operation of a highway-rail grade crossing...

  5. 49 CFR 234.203 - Control circuits.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 49 Transportation 4 2013-10-01 2013-10-01 false Control circuits. 234.203 Section 234.203... EMERGENCY NOTIFICATION SYSTEMS Maintenance, Inspection, and Testing Maintenance Standards § 234.203 Control circuits. All control circuits that affect the safe operation of a highway-rail grade crossing...

  6. 49 CFR 234.203 - Control circuits.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 49 Transportation 4 2014-10-01 2014-10-01 false Control circuits. 234.203 Section 234.203... EMERGENCY NOTIFICATION SYSTEMS Maintenance, Inspection, and Testing Maintenance Standards § 234.203 Control circuits. All control circuits that affect the safe operation of a highway-rail grade crossing...

  7. 49 CFR 234.203 - Control circuits.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 4 2011-10-01 2011-10-01 false Control circuits. 234.203 Section 234.203 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION..., Inspection, and Testing Maintenance Standards § 234.203 Control circuits. All control circuits that...

  8. 49 CFR 236.721 - Circuit, control.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Circuit, control. 236.721 Section 236.721..., MAINTENANCE, AND REPAIR OF SIGNAL AND TRAIN CONTROL SYSTEMS, DEVICES, AND APPLIANCES Definitions § 236.721 Circuit, control. An electrical circuit between a source of electric energy and a device which it operates....

  9. 49 CFR 236.721 - Circuit, control.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 4 2011-10-01 2011-10-01 false Circuit, control. 236.721 Section 236.721..., MAINTENANCE, AND REPAIR OF SIGNAL AND TRAIN CONTROL SYSTEMS, DEVICES, AND APPLIANCES Definitions § 236.721 Circuit, control. An electrical circuit between a source of electric energy and a device which it operates....

  10. 49 CFR 234.203 - Control circuits.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Control circuits. 234.203 Section 234.203 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION..., Inspection, and Testing Maintenance Standards § 234.203 Control circuits. All control circuits that...

  11. 77 FR 61025 - Certain Prepregs, Laminates, and Finished Circuit Boards: Notice of Institution of Formal...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-10-05

    ..., Arizona (``Isola'') on October 6, 2008, and supplemented on October 28, 2008. 73 FR 66919 (November 12... COMMISSION Certain Prepregs, Laminates, and Finished Circuit Boards: Notice of Institution of Formal... States after importation of certain prepregs, laminates, and finished circuit boards that...

  12. Increasing the wiring density of multilayer printed circuit boards for airborne scientific instrumentation

    NASA Astrophysics Data System (ADS)

    Panfilova, G. T.; Sadykov, K. S.

    Design improvements are proposed for multilayer printed circuit boards manufactured by the method of open bonding pads which make it possible to reduce the volume of electronic blocks and the number of layers in the printed circuit board. The proposed improvements include the use of double wells for interlayer connection and overlap soldering of small radioelectronic elements.

  13. Aluminum heat sink enables power transistors to be mounted integrally with printed circuit board

    NASA Technical Reports Server (NTRS)

    Seaward, R. C.

    1967-01-01

    Power transistor is provided with an integral flat plate aluminum heat sink which mounts directly on a printed circuit board containing associated circuitry. Standoff spacers are used to attach the heat sink to the printed circuit board containing the remainder of the circuitry.

  14. Design and implementation of a multi-sensor robot system for printed circuit board insertion

    NASA Technical Reports Server (NTRS)

    Sood, Deepak; Repko, Michael C.; Kelley, Robert B.

    1989-01-01

    The design and implementation of a robot system equipped with multiple sensors are described. The robotic assembly system couples the task sequence of the robot with information from different sensors, enabling the system to handle uncertainties encountered during task execution. The target task involves the insertion of a printed circuit board into a card cage. The sensors used are an overhead three-dimensional vision system, a fingertip cross-fire sensor, and a 6-DOF force/torque sensor. The vision system is used to locate the printed circuit boards and the insertion slots. Information provided by the cross-fire sensor is used to complement the information from the vision system in order to obtain a proper grasping location on the printed circuit board. A fuzzy-logic-based system is used to interpret the forces and torques generated by the force/torque sensor during the insertion process. The repeated success of this assembly task over many experimental trials verifies the modeling and controller assumptions.

  15. 49 CFR 236.721 - Circuit, control.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... Circuit, control. An electrical circuit between a source of electric energy and a device which it operates. ... 49 Transportation 4 2012-10-01 2012-10-01 false Circuit, control. 236.721 Section 236.721 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD...

  16. 49 CFR 236.721 - Circuit, control.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... Circuit, control. An electrical circuit between a source of electric energy and a device which it operates. ... 49 Transportation 4 2014-10-01 2014-10-01 false Circuit, control. 236.721 Section 236.721 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD...

  17. 49 CFR 236.721 - Circuit, control.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... Circuit, control. An electrical circuit between a source of electric energy and a device which it operates. ... 49 Transportation 4 2013-10-01 2013-10-01 false Circuit, control. 236.721 Section 236.721 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD...

  18. A Circuit Board Using a Sheet of Thick Paper and Aluminium Tape

    ERIC Educational Resources Information Center

    Kamata, Masahiro; Honda, Motoshi

    2003-01-01

    We have developed a circuit board using materials that are inexpensive and familiar to elementary school students. Most of the responses from students who made this board were relatively positive and we observed them enjoy making the boards at a Science Festival in Japan and in elementary school. As an application, we also developed a tiny torch…

  19. Optical contacts to waveguides in printed circuit boards

    NASA Astrophysics Data System (ADS)

    Rupp, Torsten; Shkarban, Oleksandr; Menschig, Arnd

    2004-09-01

    The development of printed circuit boards (PCB) with integrated layers for optical data transfer was pushed during the last few years. Solutions with optical fibers or planar waveguides fabricated from plastics or glass will soon be available on the market. Nevertheless the low loss coupling of functional optical components as connectors, transmitters and receivers to these new generations of PCBs still is open. The packaging of otical transceivers or connectors actually is based mainly on single device solutions or active coupling concepts. On the other side the connectors of external optical data lines or of daughter cards to the main boards and the coupling of transmitter and receiver modules to optical PCBs do need linear array concepts. And the coupling efficiency should not decrease during reflow process. Actual concepts using mulit-mode connectors or a direct waveguide coupling of receivers suffer under high optical losses. However the use of micro-optical functional elements allows the realization of coupling concepts with teh lowest losses possible. The total losses for optical lines from the transmitter to the waveguide and back to the receiver can be reduced below 4 dB. For cost reduction even symmetric optical set-up can be used. The transmission rate can be as high as 40 Gb/s. With this concept error tolerant systems for the optical interconnection are possible. We report about the modeling, the design and the characterization of micro-optical interconnect modules for high efficient contacts to the optical layer in PCBs. For the assembly of the modules we use the new concept of a desk-top factory with miniaturized tools for handling, assembly, and inspection. This concept increases the flexibility and reduces the manufacturing costs.

  20. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  1. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  2. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  3. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  4. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  5. Hydrometallurgical Recovery of Metals from Large Printed Circuit Board Pieces

    PubMed Central

    Jadhav, U.; Hocheng, H.

    2015-01-01

    The recovery of precious metals from waste printed circuit boards (PCBs) is an effective recycling process. This paper presents a promising hydrometallurgical process to recover precious metals from waste PCBs. To simplify the metal leaching process, large pieces of PCBs were used instead of a pulverized sample. The chemical coating present on the PCBs was removed by sodium hydroxide (NaOH) treatment prior to the hydrometallurgical treatment. Among the leaching reagents examined, hydrochloric acid (HCl) showed great potential for the recovery of metals. The HCl-mediated leaching of waste PCBs was investigated over a range of conditions. Increasing the acid concentration decreased the time required for complete metal recovery. The shaking speed showed a pronounced positive effect on metal recovery, but the temperature showed an insignificant effect. The results showed that 1 M HCl recovered all of the metals from 4 cm × 4 cm PCBs at room temperature and 150 rpm shaking speed in 22 h. PMID:26415827

  6. International standards for optical circuit board fabrication, assembly and measurement

    NASA Astrophysics Data System (ADS)

    Pitwon, Richard; Immonen, Marika; Wang, Kai; Itoh, Hideo; Shioda, Tsuyoshi; Wu, Jinhua; Zhu, Long Xiu; Yan, Hui Juan; Worrall, Alex

    2016-03-01

    The commercial adoption of electro-optical printed circuit board (EOCB) technology will be accelerated by the development of industrial and conformity standards for high volume fabrication, connector assembly and waveguide measurement. In this paper, we introduce international standardisation activities surrounding EOCBs and report on industrial processes developed for the high volume fabrication of complex EOCBs with embedded multimode polymer waveguides including a first connector standard for polymer waveguide termination. We focus on solving a serious historic problem with the measurement of optical waveguide systems, namely the lack of harmonised measurement conditions for optical waveguides, which to this day gives rise to strong inconsistencies in the results of measurements by different parties on the same waveguide. We report on the development of a standard to ensure repeatable measurement of optical waveguides, whereby we demonstrate how the application of a measurement identification system and proposed reference measurement conditions can bring variation in measurement results to within 5%, thereby serving as the basis for a formal reliable optical waveguide measurement methodology.

  7. Using multiple sensors for printed circuit board insertion

    NASA Technical Reports Server (NTRS)

    Sood, Deepak; Repko, Michael C.; Kelley, Robert B.

    1989-01-01

    As more and more activities are performed in space, there will be a greater demand placed on the information handling capacity of people who are to direct and accomplish these tasks. A promising alternative to full-time human involvement is the use of semi-autonomous, intelligent robot systems. To automate tasks such as assembly, disassembly, repair and maintenance, the issues presented by environmental uncertainties need to be addressed. These uncertainties are introduced by variations in the computed position of the robot at different locations in its work envelope, variations in part positioning, and tolerances of part dimensions. As a result, the robot system may not be able to accomplish the desired task without the help of sensor feedback. Measurements on the environment allow real time corrections to be made to the process. A design and implementation of an intelligent robot system which inserts printed circuit boards into a card cage are presented. Intelligent behavior is accomplished by coupling the task execution sequence with information derived from three different sensors: an overhead three-dimensional vision system, a fingertip infrared sensor, and a six degree of freedom wrist-mounted force/torque sensor.

  8. Elemental analysis of printed circuit boards considering the ROHS regulations.

    PubMed

    Wienold, Julia; Recknagel, Sebastian; Scharf, Holger; Hoppe, Marion; Michaelis, Matthias

    2011-03-01

    The EU RoHS Directive (2002/95/EC of the European Parliament and of the Council) bans the placing of new electrical and electronic equipment containing more than agreed levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants on the EU market. It necessitates methods for the evaluation of RoHS compliance of assembled electronic equipment. In this study mounted printed circuit boards from personal computers were analyzed on their content of the three elements Cd, Pb and Hg which were limited by the EU RoHS directive. Main focus of the investigations was the influence of sample pre-treatment on the precision and reproducibility of the results. The sample preparation steps used were based on the guidelines given in EN 62321. Five different types of dissolution procedures were tested on different subsequent steps of sample treatment like cutting and milling. Elemental analysis was carried out using ICP-OES, XRF and CV-AFS (Hg). The results obtained showed that for decision-making with respect to RoHS compliance a size reduction of the material to be analyzed to particles ≤ 1.5mm can already be sufficient. However, to ensure analytical results with relative standard deviations of less than 20%, as recommended by the EN 62321, a much larger effort for sample processing towards smaller particle sizes might be required which strongly depends on the mass fraction of the element under investigation. PMID:21050740

  9. Materials for printed circuit boards: Past usage and future prospects

    SciTech Connect

    Lee Hong Ng; Field, F.R. III )

    1989-01-01

    This paper examines current materials utilization patterns in a major electronic materials market, printed circuit board (PCB) materials. As demands on PCB materials become more stringent, the use of high performance materials will increase. However, development of better materials is no guarantee of market success. New materials must offer an attractive price/performance combination to PCB users. A methodology to assess the competitive position of new PCB materials by combining manufacturing cost models with operations research techniques has been developed and applied to the PCB materials market. The methodology is illustrated using case studies drawn from the computers and communication industries. Results indicate that the computer industry favors high glass transition temperature materials, such as polymide and bismaleimide triazine, while the telecommunications market prefers epoxy glass for its low cost. Among the new materials targeted at high performance applications in the PCB market, cyanate ester (CE) and polytetrafluoroethylene (PTFE) have the greatest potential. PTFE is expected to fill a niche in the extremely high performance market due to its high cost and incompatibility with standard manufacturing requirements. The potential of cyanate ester, however, depends on its pricing policy and manufacturing requirements. Through the use of the PCB cost model and making some assumptions on the processing requirements of CE, it was found that almost all the price-yield combinations would make cyanate ester a viable competitor, especially in the high performance end of the market place.

  10. Hydrometallurgical Recovery of Metals from Large Printed Circuit Board Pieces

    NASA Astrophysics Data System (ADS)

    Jadhav, U.; Hocheng, H.

    2015-09-01

    The recovery of precious metals from waste printed circuit boards (PCBs) is an effective recycling process. This paper presents a promising hydrometallurgical process to recover precious metals from waste PCBs. To simplify the metal leaching process, large pieces of PCBs were used instead of a pulverized sample. The chemical coating present on the PCBs was removed by sodium hydroxide (NaOH) treatment prior to the hydrometallurgical treatment. Among the leaching reagents examined, hydrochloric acid (HCl) showed great potential for the recovery of metals. The HCl-mediated leaching of waste PCBs was investigated over a range of conditions. Increasing the acid concentration decreased the time required for complete metal recovery. The shaking speed showed a pronounced positive effect on metal recovery, but the temperature showed an insignificant effect. The results showed that 1 M HCl recovered all of the metals from 4 cm × 4 cm PCBs at room temperature and 150 rpm shaking speed in 22 h.

  11. Stability of planar PEMFC in Printed Circuit Board technology

    NASA Astrophysics Data System (ADS)

    Schmitz, A.; Wagner, S.; Hahn, R.; Uzun, H.; Hebling, C.

    The use of planar PEMFCs in printed circuit board (PCB) technology with a thickness of less than 3.5 mm are presented. This planar design consists of an open cathode side which allows a completely passive, self-breathing operation of the fuel cell. Power densities of 100 mW/cm 2 at 500 mV with hydrogen as a fuel were achieved. A steady operation with this type of fuel cell was demonstrated over a week without any cell flooding. Since the electrical conducting elements of PCBs usually are made of copper, corrosion in the wet environment of a PEMFC is expected. Thus, a significant degradation in performance of fuel cells made of plain copper PCBs was seen in long-term operation. In order to avoid corrosion, the copper layer has to be coated. Fuel cells in PCB design with diverse coatings were tested in long-term operations up to 1000 h under load. Moreover, corrosion currents have been determined by the use of potentiodynamic scans. Promising coatings are electroplated Cr and Ni and a combination of Ni/Au.

  12. Circuit For Control Of Electromechanical Prosthetic Hand

    NASA Technical Reports Server (NTRS)

    Bozeman, Richard J., Jr.

    1995-01-01

    Proposed circuit for control of electromechanical prosthetic hand derives electrical control signals from shoulder movements. Updated, electronic version of prosthesis, that includes two hooklike fingers actuated via cables from shoulder harness. Circuit built around favored shoulder harness, provides more dexterous movement, without incurring complexity of computer-controlled "bionic" or hydraulically actuated devices. Additional harness and potentiometer connected to similar control circuit mounted on other shoulder. Used to control stepping motor rotating hand about prosthetic wrist to one of number of angles consistent with number of digital outputs. Finger-control signals developed by circuit connected to first shoulder harness transmitted to prosthetic hand via sliprings at prosthetic wrist joint.

  13. Overvoltage control circuit for a reserve battery

    SciTech Connect

    Eppley, W.J.; Pertuch, W.T.; Tierney, B.C.

    1989-09-26

    This patent describes a selectively activatable reserve battery overvoltage control circuit. It comprises: a current limiting resistor; a thermal-lag circuit interrupter connected in series with the resistor; and circuit means connecting the series connection of the resistor and the interrupter across the reserve battery.

  14. Optical waveguide circuit board with a surface-mounted optical receiver array

    NASA Astrophysics Data System (ADS)

    Thomson, J. E.; Levesque, Harold; Savov, Emil; Horwitz, Fred; Booth, Bruce L.; Marchegiano, Joseph E.

    1994-03-01

    A photonic circuit board is fabricated for potential application to interchip and interboard parallel optical links. The board comprises photolithographically patterned polymer optical waveguides on a conventional glass-epoxy electrical circuit board and a surface-mounted integrated circuit (IC) package that optically and electrically couples to an optoelectronic IC. The waveguide circuits include eight-channel arrays of straights, cross-throughs, curves, self- aligning interconnects to multi-fiber ribbon, and out-of-plane turning mirrors. A coherent, fused bundle of optical fibers couples light between 45-deg waveguide mirrors and a GaAs receiver array in the IC package. The fiber bundle is easily aligned to the mirrors and the receivers and is amenable to surface mounting and hermetic sealing. The waveguide-receiver- array board achieved error-free data rates up to 1.25 Gbits/s per channel, and modal noise was shown to be negligible.

  15. New reconstruction method for x-ray testing of multilayer printed circuit board

    NASA Astrophysics Data System (ADS)

    Yang, Min; Wang, Gao; Liu, Yongzhan

    2010-05-01

    For multilayer printed circuit board (PCB) and large-scale integrated circuit (LIC) chips, nondestructive testing of the inner structure and welding defects is very important for circuit diagram reverse design and manufacturing quality control. The traditional nondestructive testing of this kind of plate-like object is digital radiography (DR), which can provide only images with overlapped information, so it is difficult to get a full and accurate circuit image of every layer and the position of the defects using the DR method. At the same time, traditional computed tomography scanning methods are also unable to resolve this problem. A new reconstruction method is proposed for the nondestructive testing of plate-like objects. With this method, x rays irradiate the surface of the reconstructed object at an oblique angle, and a series of projection images are obtained while the object is rotating. Then, through a relevant preprocessing method on the projections and a special reconstructing algorithm, cross sections of the scanning region are finally obtained slice by slice. The experimental results prove that this method satisfactorily addresses the challenges of nondestructive testing of plate-like objects such as PCB or LIC.

  16. Waste-minimization assessment for a manufacturer of printed-circuit boards. Environmental research brief

    SciTech Connect

    Kirsch, F.W.; Looby, G.P.

    1991-07-01

    The U.S. Environmental Protection Agency (EPA) has funded a pilot project to assist small- and medium-size manufacturers who want to minimize their generation of hazardous waste but who lack the expertise to do so. Waste Minimization Assessment Centers (WMACs) were established at selected universities and procedures were adapted from the EPA Waste Minimization Opportunity Assessment Manual (EPA/625/7-88/003, July 1988). The WMAC team at Colorado State University inspected a plant producing printed circuit boards -- a plant that already had taken steps to control its hazardous wastes. Producing a circuit board involves many major processes and subprocesses: preparing the board; depositing copper on the board by electroless plating; applying dry film; electrolytically plating copper; electrolytically plating tin; etching and stripping; applying solder; and, perhaps, plating gold on connectors. Each of these steps produces hazardous wastes, e.g., electrolytic copper plating results in acid soap dumps, copper and tin drag-out, and sulfuric acid. The main sources of metallic contamination (copper (both dissolved and metallic), tin, lead, gold) are the rinses after scrubbing, plating, and etching. Although the greatest amount of waste can be reduced by reusing effluent from the MEMTEK (with some further treatment), the greatest dollar savings can be found by changing the dry film developer. The present brand adheres strongly to the unexposed film and requires an aggressive acid soap; a less aggressive, nonhazardous soap could be used with a less-adhering dry film developer. The Research Brief was developed by the principal investigators and EPA's Risk Reduction Engineering Laboratory, Cincinnati, OH, to announce key findings of an ongoing research project that is fully documented in a separate report of the same title available from the authors.

  17. Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

    NASA Technical Reports Server (NTRS)

    Bradley, Arthur T.; Fowler, Jennifer; Yavoich, Brian J.; Jennings, Stephen A.

    2012-01-01

    This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

  18. Printed circuit board impedance matching step for microwave (millimeter wave) devices

    DOEpatents

    Pao, Hsueh-Yuan; Aguirre, Jerardo; Sargis, Paul

    2013-10-01

    An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.

  19. Problem-Solving at a Circuit-Board Assembly Machine: A Microanalysis.

    ERIC Educational Resources Information Center

    Kleifgen, Jo Anne; Frenz-Belken, Patricia

    A study described machine operators' problem-solving actions at a computerized circuit-board assembly machine in a small manufacturing plant located on the West Coast. Participants were a machine operator and his supervisor, both from Vietnam, who were building large prototype boards for a major computer corporation. Over a 6.5 minute interval,…

  20. Recovery Act: High-Temperature Circuit Boards for use in Geothermal Well Monitoring Applications

    SciTech Connect

    Hooker, Matthew; Fabian, Paul

    2013-05-01

    The U.S. Department of Energy is leading the development of alternative energy sources that will ensure the long-term energy independence of our nation. One of the key renewable resources currently being advanced is geothermal energy. To tap into the large potential offered by generating power from the heat of the earth, and for geothermal energy to be more widely used, it will be necessary to drill deeper wells to reach the hot, dry rock located up to 10 km beneath the earth’s surface. In this instance, water will be introduced into the well to create a geothermal reservoir. A geothermal well produced in this manner is referred to as an enhanced geothermal system (EGS). EGS reservoirs are typically at depths of 3 to 10 km, and the temperatures at these depths have become a limiting factor in the application of existing downhole technologies. These high temperatures are especially problematic for electronic systems such as downhole data-logging tools, which are used to map and characterize the fractures and high-permeability regions in underground formations. Information provided by these tools is assessed so that underground formations capable of providing geothermal energy can be identified, and the subsequent drilling operations can be accurately directed to those locations. The mapping of geothermal resources involves the design and fabrication of sensor packages, including the electronic control modules, to quantify downhole conditions (300°C temperature, high pressure, seismic activity, etc.). Because of the extreme depths at which these measurements are performed, it is most desirable to perform the sensor signal processing downhole and then transmit the information to the surface. This approach necessitates the use of high-temperature electronics that can operate in the downhole environment. Downhole signal processing in EGS wells will require the development and demonstration of circuit boards that can withstand the elevated temperatures found at these

  1. 49 CFR 236.5 - Design of control circuits on closed circuit principle.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Design of control circuits on closed circuit..., AND APPLIANCES Rules and Instructions: All Systems General § 236.5 Design of control circuits on closed circuit principle. All control circuits the functioning of which affects safety of train...

  2. Electro-optical circuit board with single-mode glass waveguide optical interconnects

    NASA Astrophysics Data System (ADS)

    Brusberg, Lars; Neitz, Marcel; Pernthaler, Dominik; Weber, Daniel; Sirbu, Bogdan; Herbst, Christian; Frey, Christopher; Queisser, Marco; Wöhrmann, Markus; Manessis, Dionysios; Schild, Beatrice; Oppermann, Hermann; Eichhammer, Yann; Schröder, Henning; Hâkansson, Andreas; Tekin, Tolga

    2016-03-01

    A glass optical waveguide process has been developed for fabrication of electro-optical circuit boards (EOCB). Very thin glass panels with planar integrated single-mode waveguides can be embedded as a core layer in printed circuit boards for high-speed board-level chip-to-chip and board-to-board optical interconnects over an optical backplane. Such singlemode EOCBs will be needed in upcoming high performance computers and data storage network environments in case single-mode operating silicon photonic ICs generate high-bandwidth signals [1]. The paper will describe some project results of the ongoing PhoxTroT project, in which a development of glass based single-mode on-board and board-to-board interconnection platform is successfully in progress. The optical design comprises a 500 μm thin glass panel (Schott D263Teco) with purely optical layers for single-mode glass waveguides. The board size is accommodated to the mask size limitations of the fabrication (200 mm wafer level process, being later transferred also to larger panel size). Our concept consists of directly assembling of silicon photonic ICs on cut-out areas in glass-based optical waveguide panels. A part of the electrical wiring is patterned by thin film technology directly on the glass wafer surface. A coupling element will be assembled on bottom side of the glass-based waveguide panel for 3D coupling between board-level glass waveguides and chip-level silicon waveguides. The laminate has a defined window for direct glass access for assembling of the photonic integrated circuit chip and optical coupling element. The paper describes the design, fabrication and characterization of glass-based electro-optical circuit board with format of (228 x 305) mm2.

  3. Electronic switches and control circuits: A compilation

    NASA Technical Reports Server (NTRS)

    1971-01-01

    The innovations in this updated series of compilations dealing with electronic technology represents a carefully selected collection of items on electronic switches and control circuits. Most of the items are based on well-known circuit design concepts that have been simplified or refined to meet NASA's demanding requirement for reliability, simplicity, fail-safe characteristics, and the capability of withstanding environmental extremes.

  4. Compact fluid cooled power converter supporting multiple circuit boards

    DOEpatents

    Radosevich, Lawrence D.; Meyer, Andreas A.; Beihoff, Bruce C.; Kannenberg, Daniel G.

    2005-03-08

    A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

  5. A programmable heater control circuit for spacecraft

    NASA Technical Reports Server (NTRS)

    Nguyen, D. D.; Owen, J. W.; Smith, D. A.; Lewter, W. J.

    1994-01-01

    Spacecraft thermal control is accomplished for many components through use of multilayer insulation systems, electrical heaters, and radiator systems. The heaters are commanded to maintain component temperatures within design specifications. The programmable heater control circuit (PHCC) was designed to obtain an effective and efficient means of spacecraft thermal control. The hybrid circuit provides use of control instrumentation as temperature data, available to the spacecraft central data system, reprogramming capability of the local microprocessor during the spacecraft's mission, and the elimination of significant spacecraft wiring. The hybrid integrated circuit has a temperature sensing and conditioning circuit, a microprocessor, and a heater power and control circuit. The device is miniature and housed in a volume which allows physical integration with the component to be controlled. Applications might include alternate battery-powered logic-circuit configurations. A prototype unit with appropriate physical and functional interfaces was procured for testing. The physical functionality and the feasibility of fabrication of the hybrid integrated circuit were successfully verified. The remaining work to develop a flight-qualified device includes fabrication and testing of a Mil-certified part. An option for completing the PHCC flight qualification testing is to enter into a joint venture with industry.

  6. All-semiconductor metamaterial-based optical circuit board at the microscale

    SciTech Connect

    Min, Li; Huang, Lirong

    2015-07-07

    The newly introduced metamaterial-based optical circuit, an analogue of electronic circuit, is becoming a forefront topic in the fields of electronics, optics, plasmonics, and metamaterials. However, metals, as the commonly used plasmonic elements in an optical circuit, suffer from large losses at the visible and infrared wavelengths. We propose here a low-loss, all-semiconductor metamaterial-based optical circuit board at the microscale by using interleaved intrinsic GaAs and doped GaAs, and present the detailed design process for various lumped optical circuit elements, including lumped optical inductors, optical capacitors, optical conductors, and optical insulators. By properly combining these optical circuit elements and arranging anisotropic optical connectors, we obtain a subwavelength optical filter, which can always hold band-stop filtering function for various polarization states of the incident electromagnetic wave. All-semiconductor optical circuits may provide a new opportunity in developing low-power and ultrafast components and devices for optical information processing.

  7. Electrochemically controlled charging circuit for storage batteries

    DOEpatents

    Onstott, E.I.

    1980-06-24

    An electrochemically controlled charging circuit for charging storage batteries is disclosed. The embodiments disclosed utilize dc amplification of battery control current to minimize total energy expended for charging storage batteries to a preset voltage level. The circuits allow for selection of Zener diodes having a wide range of reference voltage levels. Also, the preset voltage level to which the storage batteries are charged can be varied over a wide range.

  8. Control Circuit For Reed-Solomon Encoder

    NASA Technical Reports Server (NTRS)

    Ross, Douglas

    1992-01-01

    Control circuit designed for use with commercially available AHA4610 Reed-Solomon encoder. Needed to select depth of interleaving and to synchronize input and output blocks of data and parity bits with suitable clock signals. Circuit provides synchronizing and control signals for Reed-Solomon encoder. Encoder can operate with asynchronous input and output data streams at rates up to 80 Mb/s. Interleaving depth selectable, and accommodation to input data rate automatic.

  9. Four-Channel PC/104 MIL-STD-1553 Circuit Board

    NASA Technical Reports Server (NTRS)

    Cox, Gary L.

    2004-01-01

    The mini bus interface card (miniBIC) is the first four-channel electronic circuit board that conforms to MIL-STD-1553 and to the electrical-footprint portion of PC/104. [MIL-STD-1553 is a military standard that encompasses a method of communication and electrical- interface requirements for digital electronic subsystems connected to a data bus. PC/104 is an industry standard for compact, stackable modules that are fully compatible (in architecture, hardware, and software) with personal-computer data- and power-bus circuitry.] Prior to the development of the miniBIC, only one- and two-channel PC/104 MIL-STD-1553 boards were available. To obtain four channels, it was necessary to include at least two boards in a PC/104 stack. In comparison with such a two-board stack, the miniBIC takes up less space, consumes less power, and is more reliable. In addition, the miniBIC includes 32 digital input/output channels. The miniBIC (see figure) contains four MIL-STD-1553B hybrid integrated circuits (ICs), four transformers, a field-programmable gate array (FPGA), and an Industry Standard Architecture (ISA) interface. Each hybrid IC includes a MILSTD-1553 dual transceiver, memory-management circuitry, processor interface logic circuitry, and 64Kx16 bits of shared static random access memory. The memory is used to configure message and data blocks. In addition, 23 16-bit registers are available for (1) configuring the hybrid IC for, and starting it in, various modes of operation; (2) reading the status of the functionality of the hybrid IC; and (3) resetting the hybrid IC to a known state. The miniBIC can operate as a remote terminal, bus controller, or bus monitor. The FPGA provides the chip-select and data-strobe signals needed for operation of the hybrid ICs. The FPGA also receives interruption signals and forwards them to the ISA bus. The ISA interface connects the address, data, and control interfaces of the hybrid ICs to the ISA backplane. Each channel is, in effect, a MIL

  10. Waste minimization study for a printed circuit board manufacturing facility in Taiwan

    SciTech Connect

    Chiu, Shen-yann; Huang, Hann S.; Peters, R.W.; Tsai, S.Y. ); Tsai, Wen-Tien; Shieh, Shih-Shien; Hsieh, Te-Yuan; Hwang, Li-Shyong ); Liu, Solo; Peng, Chien-Tang ); Wu, Min H. )

    1990-01-01

    This paper presents a demonstration of industrial waste minimization sponsored by the Environmental Protection Administration, Taiwan, Republic of China. Waste reduction opportunities are identified and evaluated for a printed circuit board manufacturing facility in Taiwan. Plant audits were conducted on various processes, such as deburring, alkaline etching, black oxidation, desmearing, electroless copper, and copper and tin/lead plating. Specific areas in which the wastes could be minimized, such as reducing the amount of dragout and rinse water requirements in the plating and etchant lines, and on-site treatment and reuse of spent bath solutions were identified, assessed, and implemented. Jar tests on the wastewater were performed, and the results were used to improve the efficiency of the wastewater treatment plant for removal of heavy metals and reduction of sludge generation. In addition, administrative controls of hazardous wastes designed to reduce associated health and environmental hazards were recommended. 4 figs., 9 tabs.

  11. Vibration suppression of printed circuit boards using an external particle damper

    NASA Astrophysics Data System (ADS)

    Veeramuthuvel, P.; Sairajan, K. K.; Shankar, K.

    2016-03-01

    Particle damping is an effective method of passive vibration control, of recent research interest. The novel use of particle damper capsule on a Printed Circuit Board (PCB) and the development of Radial Basis Function neural network to accurately predict the acceleration response is presented here. The prediction of particle damping using this neural network is studied in comparison with the Back Propagation Neural network. Extensive experiments are carried out on a PCB for different combinations of particle damper parameters such as particle size, particle density, packing ratio, and the input force during the primary modes of vibration and the obtained results are used for training and testing of neural networks. Based on the prediction from the better trained network, useful design guidelines for the particle damper suitable for PCB are arrived at. The effectiveness of particle dampers for vibration suppression of PCB under random vibration environment is demonstrated based on these design guidelines.

  12. Prototyping lead-free solders on hand-soldered, through-hole circuit boards

    SciTech Connect

    Vianco, P.T.; Mizik, P.M.

    1993-12-31

    The lead-free solders 96.5Sn-3.5Ag (wt %), 95.5Sn-4.0Cu-0.5Ag, 91. 84Sn-3.33Ag-4.83Bi were used in the assembly of a through-hole circuit board to determine the feasibility of their suitability in hand soldering processes. Prototypes assembled with 63Sn-37Pb solder were manufactured to serve as control units. Implementation of the lead-free alloys were performed with a rosin-based, mildly activated (RMA) flux and a 700{degree}F soldering tip. A procedure was developed to remove the tin-lead finish from the leaded components and replace it with a 100Sn hot dipped coating. Assembly feasibility was demonstrated for all three lead-free solders. Defect counts were greater than observed with the tin-lead control alloy; however, the number of defects diminished with experience gained by the operator. Visual examination of the solder joints indicated satisfactory wetting of both the device leads and circuit board land with no apparent damage to the underlying laminate nor to the device packages. Cross sections of the lead-free solder joints showed that the were more susceptible to void formation within the holes than was the case with the tin-lead solder. Some cracking was observed at the interface between the Sn-Ag-Bi solder and the copper lands; the relatively high strength of this solder and fast cooling rate of the hand assembly process was believed responsible for this defect.

  13. Infrared Thermography as Applied to Thermal Testing of Power Systems Circuit Boards.

    NASA Astrophysics Data System (ADS)

    Miles, Jonathan James

    /FAIL criteria be established; a procedure for dealing with variable radiation heat transfer properties across a printed circuit board be developed; and a thermally -controlled enclosure in which testing is performed be provided. These tasks are addressed and positive results are presented. Testing procedures and software developed to perform analyses are described. The feasibility of an infrared test process is demonstrated. A description of acquired experimental data, results, and analyses designed to verify measurement and fault analysis techniques are also presented. There are a number of phenomena which are known to contribute undesirably, and often unpredictably, to results. Methods for reducing random error in results and suggestions for establishing PASS/FAIL criteria and improving measurement techniques are addressed.

  14. Analog circuit for controlling acoustic transducer arrays

    DOEpatents

    Drumheller, Douglas S.

    1991-01-01

    A simplified ananlog circuit is presented for controlling electromechanical transducer pairs in an acoustic telemetry system. The analog circuit of this invention comprises a single electrical resistor which replaces all of the digital components in a known digital circuit. In accordance with this invention, a first transducer in a transducer pair of array is driven in series with the resistor. The voltage drop across this resistor is then amplified and used to drive the second transducer. The voltage drop across the resistor is proportional and in phase with the current to the transducer. This current is approximately 90 degrees out of phase with the driving voltage to the transducer. This phase shift replaces the digital delay required by the digital control circuit of the prior art.

  15. Printed circuit board for a CCD camera head

    DOEpatents

    Conder, Alan D.

    2002-01-01

    A charge-coupled device (CCD) camera head which can replace film for digital imaging of visible light, ultraviolet radiation, and soft to penetrating x-rays, such as within a target chamber where laser produced plasmas are studied. The camera head is small, capable of operating both in and out of a vacuum environment, and is versatile. The CCD camera head uses PC boards with an internal heat sink connected to the chassis for heat dissipation, which allows for close (0.04" for example) stacking of the PC boards. Integration of this CCD camera head into existing instrumentation provides a substantial enhancement of diagnostic capabilities for studying high energy density plasmas, for a variety of military industrial, and medical imaging applications.

  16. Preparing printed circuit boards for rapid turn-around time on a plotter

    SciTech Connect

    Hawtree, J.

    1998-01-01

    This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab`s Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day`s time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter.

  17. Designing High Speed Printed Circuit Boards Using DxDesigner and Expedition

    NASA Technical Reports Server (NTRS)

    Navarro, Robert

    2007-01-01

    Mentor's DxDesigner and Expedition schematic capture and printed circuit board tools were chosen to implement a custom high speed signal processing board containing many high pin count Field Programmable Gate Arrays and many high speed serial connections with data rates over 2 Gigasamples/sec. The methodology used to place the parts and route the board involved the interaction of both the DxDesigner and Expedition tools. The basic design philosophy was to specify as much as possible through design constraints at the schematic level. This paper will explore implementing that philosophy in both tools to facilitate part placement and trace routing.

  18. A filter circuit board for the Earthworm Seismic Data Acquisition System

    USGS Publications Warehouse

    Jensen, Edward Gray

    2000-01-01

    The Earthworm system is a seismic network data acquisition and processing system used by the Northern California Seismic Network as well as many other seismic networks. The input to the system is comprised of many realtime electronic waveforms fed to a multi-channel digitizer on a PC platform. The digitizer consists of one or more National Instruments Corp. AMUX–64T multiplexer boards attached to an A/D converter board located in the computer. Originally, passive filters were installed on the multiplexers to eliminate electronic noise picked up in cabling. It was later discovered that a small amount of crosstalk occurred between successive channels in the digitizing sequence. Though small, this crosstalk will cause what appear to be small earthquake arrivals at the wrong time on some channels. This can result in erroneous calculation of earthquake arrival times, particularly by automated algorithms. To deal with this problem, an Earthworm filter board was developed to provide the needed filtering while eliminating crosstalk. This report describes the tests performed to find a suitable solution, and the design of the circuit board. Also included are all the details needed to build and install this board in an Earthworm system or any other system using the AMUX–64T board. Available below is the report in PDF format as well as an archive file containing the circuit board manufacturing information.

  19. Computer-aided interactive structural optimization of printed-circuit-board design

    NASA Astrophysics Data System (ADS)

    Duncan, L. B.; Holman, R. E.; Lagasse, B. K.; Sakamoto, L. W.; Sunada, W. H.

    Electronic equipment operating in severe vibration environments plays a critical role in military and aerospace hardware. A crucial element of most modularized electronic equipment is the printed circuit board (PCB). Structural failures of such boards are almost entirely the result of imposed mechanical vibration. It is desirable to incorporate structural guidelines and analysis techniques at an early stage in board development when deficiencies may easily be corrected. However, there are a number of problems connected with such an approach. A computer program has been developed to address the considered situation. The program is to reduce PCB structural analysis to a level readily understood by the average designer. Another objective of the program is to encourage use of structural analysis at an early stage of PCB design and development. Attention is given to board geometry, program organization, board response computation, and a sample problem.

  20. Laser ablated coupling structures for optical printed circuit boards

    NASA Astrophysics Data System (ADS)

    Van Steenberge, Geert; Geerinck, Peter; Riester, Markus; Pongratz, Siegfried; Van Daele, Peter

    2005-09-01

    We report on the cost effective fabrication of 45° micromirror couplers within single-mode polymer waveguides for achieving fully embedded board-level optoelectronic interconnections. Compatibility with existing board manufacturing technology is achieved by making use of polymers with high thermal stability. The sol-gel polymers behave as negative photo resist and waveguides are patterned by UV exposure. Micromirrors are fabricated using excimer laser ablation, a very flexible technology that is particularly well suited for structuring of polymers because of their excellent UV-absorption properties and highly non-thermal ablation behavior. A coupling structure based on total internal reflection (TIR) is enhanced by developing a process for embedding a metal coated 45° mirror in the optical layers. The mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation. Surface roughness of both the mirrors and the upper cladding surface above the mirrors is investigated using a non-contact optical profiler. Initial loss measurements at 1.3 μm show a propagation loss of 0.62 dB/cm and an excess mirror loss of 1.55 dB. During most recent experiments mirror roughness has been reduced from 160 nm to 20 nm, which will seriously reduce the mirror loss.

  1. An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

    ERIC Educational Resources Information Center

    Seth, Anupam

    2009-01-01

    Production planning and scheduling for printed circuit, board assembly has so far defied standard operations research approaches due to the size and complexity of the underlying problems, resulting in unexploited automation flexibility. In this thesis, the increasingly popular collect-and-place machine configuration is studied and the assembly…

  2. Compressed Air System Enhancement Increase Efficiency and Provides Energy Savings at a Circuit Board Manufacturer

    SciTech Connect

    2001-06-01

    This case study is one in a series on industrial firms who are implementing energy efficient technologies and system improvements into their manufacturing processes. This case study documents the activities, savings, and lessons learned on the circuit board manufacturer (Sanmina Plant) project.

  3. Pollution prevention assessment for a printed circuit board plant. Environmental research brief

    SciTech Connect

    Edwards, H.W.; Kostrzewa, M.F.; Looby, G.P.

    1995-09-01

    The WMAC team at Colorado State University performed an assessment at a plant that manufactures printed circuit boards. The team`s report, detailing findings and recommendations, indicated that the onsite ion-exchange treatment of metal-containing rinse water generates regenerant solutions that could be further treated by electrowinning to recover metals and to achieve significant cost savings.

  4. Circuit Board Analysis for Lead by Atomic Absorption Spectroscopy in a Course for Nonscience Majors

    ERIC Educational Resources Information Center

    Weidenhammer, Jeffrey D.

    2007-01-01

    A circuit board analysis of the atomic absorption spectroscopy, which is used to measure lead content in a course for nonscience majors, is being presented. The experiment can also be used to explain the potential environmental hazards of unsafe disposal of various used electronic equipments.

  5. Optical printed circuit board (O-PCB) for VLSI micro/nano-photonic application

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.; Kang, J. K.; Chin, I.; Kwon, Y. K.; Choi, Y. W.

    2005-01-01

    We present, in the form of review, the results of our study on the design, fabrication and assembly of optical printed circuit boards (O-PCBs) for VLSI micro/nano-photonic applications. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards, substrates or chips, in a manner similar to the electrical printed circuit boards (E-PCBs). We have assembled and constructed O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined their information handling performances. We also designed power beam splitters and waveguide filters using nano-scale photonic band-gap crystals. We discuss scientific and technological issues concerning the processes of miniaturization, interconnection and integration of polymer optical waveguide devices and arrays for O-PCB and VLSI micro/nano-photonics as applicable to board-to-board, chip-to-chip, and intra-chip integration for computers, telecommunications, and transportation systems.

  6. TRIAC/SCR proportional control circuit

    DOEpatents

    Hughes, Wallace J.

    1999-01-01

    A power controller device which uses a voltage-to-frequency converter in conjunction with a zero crossing detector to linearly and proportionally control AC power being supplied to a load. The output of the voltage-to frequency converter controls the "reset" input of a R-S flip flop, while an "0" crossing detector controls the "set" input. The output of the flip flop triggers a monostable multivibrator controlling the SCR or TRIAC firing circuit connected to the load. Logic gates prevent the direct triggering of the multivibrator in the rare instance where the "reset" and "set" inputs of the flip flop are in coincidence. The control circuit can be supplemented with a control loop, providing compensation for line voltage variations.

  7. TRIAC/SCR proportional control circuit

    DOEpatents

    Hughes, W.J.

    1999-04-06

    A power controller device is disclosed which uses a voltage-to-frequency converter in conjunction with a zero crossing detector to linearly and proportionally control AC power being supplied to a load. The output of the voltage-to frequency converter controls the ``reset`` input of a R-S flip flop, while an ``0`` crossing detector controls the ``set`` input. The output of the flip flop triggers a monostable multivibrator controlling the SCR or TRIAC firing circuit connected to the load. Logic gates prevent the direct triggering of the multivibrator in the rare instance where the ``reset`` and ``set`` inputs of the flip flop are in coincidence. The control circuit can be supplemented with a control loop, providing compensation for line voltage variations. 9 figs.

  8. Development of a semi-automated workcell for repair of printed circuit boards

    SciTech Connect

    Bennett, D.W.; Evans, M.S.

    1990-08-01

    Printed circuit boards that comprise US Army electronic systems are repaired at Army depots. An existing automated diagnostic system determines the area of failure; either by identifying failed components or failed board traces. Currently, repairs are performed manually by trained technicians. A system is being developed for repair of through-hole printed circuit boards. It is comprised of many automated and operator-assisted functions to perform the multiple operations related to replacement of failed components. When completed, this system will demonstrate economic payback by reducing skilled labor requirements and decreasing rework. The semi-automated system integrates human operators into the process while maintaining high productivity. After several fully automated systems were conceived and modelled, it was found that the configuration that provided the best return on investment was comprised of a mix of autonomous and operator-assisted functions. 1 ref., 1 fig.

  9. Computer-controlled warmup circuit

    NASA Technical Reports Server (NTRS)

    Daeges, J. J.

    1980-01-01

    Filament of high-power radio transmitter is brought to operating temperature automatically. Pushbotton reduces operator's role to one-step command and is compatible with various forms of computer control. Filiament shutdown is initiated by "down" command from operator, failure of cooling systems, or power failure for more than few seconds.

  10. 49 CFR 236.205 - Signal control circuits; requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Signal control circuits; requirements. 236.205... Block Signal Systems Standards § 236.205 Signal control circuits; requirements. The circuits shall be so... fouling point derail equipped with switch circuit controller is not in derailing position, (d) When...

  11. Design and implementation of a high power rf oscillator on a printed circuit board for multipole ion guides

    NASA Astrophysics Data System (ADS)

    Mathur, Raman; O'Connor, Peter B.

    2006-11-01

    Radio frequency (rf) oscillators are commonly used to drive electrodes of ion guides. In this article a rf oscillator circuit design and its implementation is presented. The printed circuit board for the rf oscillator is designed and fabricated. The performance of the circuit was tested to transfer ions through a hexapole in a matrix-assisted laser desorption/ionization Fourier transform mass spectrometer. A comprehensive discussion of several aspects of printed circuit board design for high power and high frequency circuits is presented.

  12. Circuit board accident--organizational dimension hidden by prescribed safety.

    PubMed

    de Almeida, Ildeberto Muniz; Buoso, Eduardo; do Amaral Dias, Maria Dionísia; Vilela, Rodolfo Andrade Gouveia

    2012-01-01

    This study analyzes an accident in which two maintenance workers suffered severe burns while replacing a circuit breaker panel in a steel mill, following model of analysis and prevention of accidents (MAPA) developed with the objective of enlarging the perimeter of interventions and contributing to deconstruction of blame attribution practices. The study was based on materials produced by a health service team in an in-depth analysis of the accident. The analysis shows that decisions related to system modernization were taken without considering their implications in maintenance scheduling and creating conflicts of priorities and of interests between production and safety; and also reveals that the lack of a systemic perspective in safety management was its principal failure. To explain the accident as merely non-fulfillment of idealized formal safety rules feeds practices of blame attribution supported by alibi norms and inhibits possible prevention. In contrast, accident analyses undertaken in worker health surveillance services show potential to reveal origins of these events incubated in the history of the system ignored in practices guided by the traditional paradigm. PMID:22317212

  13. PERSONAL COMPUTER MONITORS: A SCREENING EVALUATION OF VOLATILE ORGANIC EMISSIONS FROM EXISTING PRINTED CIRCUIT BOARD LAMINATES AND POTENTIAL POLLUTION PREVENTION ALTERNATIVES

    EPA Science Inventory

    The report gives results of a screening evaluation of volatile organic emissions from printed circuit board laminates and potential pollution prevention alternatives. In the evaluation, printed circuit board laminates, without circuitry, commonly found in personal computer (PC) m...

  14. An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

    PubMed

    Wang, Chen; Zhao, Wu; Wang, Jie; Chen, Ling; Luo, Chun-Jing

    2016-06-01

    The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling. PMID:27067430

  15. The application of a polypyrrole precoat for the metallization of printed circuit boards

    SciTech Connect

    Gottesfeld, S.; Uribe, F.A.; Armes, P. )

    1992-01-01

    This paper describes a printed circuit board metallization process starting with the formation of a percent of polypyrrole (PPY) on the board, followed by the direct electrodeposition of copper onto the polypyrrole-coated substrate. The polypyrrole film is applied to the insulating substrate by a single chemical polymerization step from an aqueous solution. The sheet resistance of the polypyrrole precoat is typically of the order of a few hundred {Omega}/{open square} which is a sufficiently low resistance to enable direct metal electrodeposition onto the PPY-coated substrate.

  16. Control Circuit For Two Stepping Motors

    NASA Technical Reports Server (NTRS)

    Ratliff, Roger; Rehmann, Kenneth; Backus, Charles

    1990-01-01

    Control circuit operates two independent stepping motors, one at a time. Provides following operating features: After selected motor stepped to chosen position, power turned off to reduce dissipation; Includes two up/down counters that remember at which one of eight steps each motor set. For selected motor, step indicated by illumination of one of eight light-emitting diodes (LED's) in ring; Selected motor advanced one step at time or repeatedly at rate controlled; Motor current - 30 mA at 90 degree positions, 60 mA at 45 degree positions - indicated by high or low intensity of LED that serves as motor-current monitor; Power-on reset feature provides trouble-free starts; To maintain synchronism between control circuit and motors, stepping of counters inhibited when motor power turned off.

  17. A Formal Algorithm for Routing Traces on a Printed Circuit Board

    NASA Technical Reports Server (NTRS)

    Hedgley, David R., Jr.

    1996-01-01

    This paper addresses the classical problem of printed circuit board routing: that is, the problem of automatic routing by a computer other than by brute force that causes the execution time to grow exponentially as a function of the complexity. Most of the present solutions are either inexpensive but not efficient and fast, or efficient and fast but very costly. Many solutions are proprietary, so not much is written or known about the actual algorithms upon which these solutions are based. This paper presents a formal algorithm for routing traces on a print- ed circuit board. The solution presented is very fast and efficient and for the first time speaks to the question eloquently by way of symbolic statements.

  18. Thermal verification testing of commercial printed-circuit boards for spaceflight

    NASA Technical Reports Server (NTRS)

    Foster, William M., II

    1992-01-01

    A method developed to verify commercial printed-circuit boards for a Shuttle orbital flight is discussed. The test sequence is based on early fault detection, desire to test the final assembly, and integration with other verification testing. A component thermal screening test is performed first to force flaws in design, workmanship, parts, processes, and materials into observable failures. Temperature definition and vibration tests are performed next. Final assembly testing is performed to simulate the Shuttle flight. An abbreviated thermal screening test is performed as a check after the vibration test, and then a complete thermal operational test is performed. The final assembly test finishes up with a burn-in of 100 h of trouble-free operation. Verification is successful when all components and final assemblies have passed each test. This method was very successful in verifying that commercial printed-circuit boards will survive in the Shuttle environment.

  19. Differential microfluidic sensor on printed circuit board for biological cells analysis.

    PubMed

    Shi, Dongyuan; Guo, Jinhong; Chen, Liang; Xia, Chuncheng; Yu, Zhefeng; Ai, Ye; Li, Chang Ming; Kang, Yuejun; Wang, Zhiming

    2015-08-01

    Coulter principal based resistive pulse sensor has been demonstrated as an important platform in biological cell detection and enumeration since several decades ago. Recently, the miniaturized micro-Coulter counter has attracted much attention due to its advantages in point of care diagnostics for on chip detection and enumeration of rare cells, such as circulating tumor cells. In this paper, we present a microfluidic cytometer with differential amplifier based on Coulter principle on a SU-8 coated printed circuit board substrate. The electrical current changes induced by the blockage of the microparticles in the sensing aperture are calibrated by polystyrene particles of standard size. Finally, HeLa cells are used to evaluate the performance of the proposed device for enumeration of biological samples. The proposed cytometer is built upon the cheap and widely available printed circuit board substrate and shows its great potential as personalized healthcare monitor. PMID:25735615

  20. Graded-index core polymer optical waveguide for high-bandwidth-density optical printed circuit boards: fabrication and characterization

    NASA Astrophysics Data System (ADS)

    Ishigure, Takaaki

    2014-03-01

    We demonstrate that graded-index (GI) core polymer optical waveguides are a promising component realizing highbandwidth- density on-board interconnects. As a method for fabricating GI-circular-core polymer optical waveguides, we introduce the Mosquito method utilizing a microdispenser. The Mosquito method is capable of accurately controlling the core diameter and the inter-core pitch. We also demonstrate that the GI-core polymer waveguides enable remarkably low loss waveguide circuits involving waveguide crossings in a mono layer. We show an alternative technique to realize the low-loss GI-core crossed waveguide: the photo-addressing method which was developed by Sumitomo Bakelite Co., Ltd.

  1. 49 CFR 236.5 - Design of control circuits on closed circuit principle.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 4 2011-10-01 2011-10-01 false Design of control circuits on closed circuit principle. 236.5 Section 236.5 Transportation Other Regulations Relating to Transportation (Continued..., AND APPLIANCES Rules and Instructions: All Systems General § 236.5 Design of control circuits...

  2. Highly reliable optical interconnection network on printed circuit board for distributed computer systems

    NASA Astrophysics Data System (ADS)

    Yu, Zhihua; Luo, Fengguang; Di, Xu; Zhou, Weilin; Li, Bin; Wang, Guangjun; Chen, Jun

    2010-11-01

    A highly reliable interchip optical interconnection network on a printed circuit board (PCB) was designed and realized, and experiments confirmed that the data rate in each channel could reach above 3.125 Gbps and the bit error rate (BER) could be up to 1.27×10 -18, which would be a good solution to the problem of communication bottlenecks between high-speed VLSI chips.

  3. Manufacturing methods and technology for digital fault isolation of printed circuit boards

    NASA Astrophysics Data System (ADS)

    1980-11-01

    This report presents the final recommendations and conclusions, with supporting data, resulting from the contract option phase of contract DAAK40-78-C-0290. It describes the manufacturing technology and test system that will enable detection, identification, and location of digital faults in the advanced missile electronic systems that will be used in the 1980's. Emphasis is placed on the fault diagnosis of large printed circuit boards containing complex hybrid digital microelectronic circuits. The basic effort included an industry survey for digital printed circuit board test requirements and available test system capabilities, the D/PCB testability investigation and resulting design guide, the development of digital fault isolation methodology and the comprehensive selection of the optimum ATE that recommended the DTS-70 system. The contract option phase of this project involved the purchase and installation of the DTS-70 system, the selection of the PN-1635972 and the PN-1646178 D/PCBs for testing, the development of generalized test software and the development of the specific hardware and software needed to test these worst-case boards.

  4. Column bioleaching copper and its kinetics of waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans.

    PubMed

    Chen, Shu; Yang, Yuankun; Liu, Congqiang; Dong, Faqin; Liu, Bijun

    2015-12-01

    Application of bioleaching process for metal recovery from electronic waste has received an increasing attention in recent years. In this work, a column bioleaching of copper from waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans has been investigated. After column bioleaching for 28d, the copper recovery reached at 94.8% from the starting materials contained 24.8% copper. Additionally, the concentration of Fe(3+) concentration varied significantly during bioleaching, which inevitably will influence the Cu oxidation, thus bioleaching process. Thus the variation in Fe(3+) concentration should be taken into consideration in the conventional kinetic models of bioleaching process. Experimental results show that the rate of copper dissolution is controlled by external diffusion rather than internal one because of the iron hydrolysis and formation of jarosite precipitates at the surface of the material. The kinetics of column bioleaching WPCBs remains unchanged because the size and morphology of precipitates are unaffected by maintaining the pH of solution at 2.25 level. In bioleaching process, the formation of jarosite precipitate can be prevented by adding dilute sulfuric acid and maintaining an acidic condition of the leaching medium. In such way, the Fe(2)(+)-Fe(3+) cycle process can kept going and create a favorable condition for Cu bioleaching. Our experimental results show that column Cu bioleaching from WPCBs by A. ferrooxidans is promising. PMID:26196406

  5. Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

    PubMed

    Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

    2015-07-01

    Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs. PMID:25869844

  6. 49 CFR 236.342 - Switch circuit controller.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Switch circuit controller. 236.342 Section 236.342 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION... Instructions § 236.342 Switch circuit controller. Switch circuit controller connected at the point to...

  7. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

    SciTech Connect

    Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-chun Kim, Wonbaek

    2009-03-15

    Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to <10 mm were milled using a stamp mill to liberate the various metallic components, and then the milled printed circuit boards were classified into fractions of <0.6, 0.6-1.2, 1.2-2.5, 2.5-5.0, and >5.0 mm. The fractions of milled printed circuit boards of size <5.0 mm were separated into a light fraction of mostly non-metallic components and a heavy fraction of the metallic components by gravity separation using a zig-zag classifier. The >5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards.

  8. Assembling surface mounted components on ink-jet printed double sided paper circuit board.

    PubMed

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. PMID:24521824

  9. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    NASA Astrophysics Data System (ADS)

    Andersson, Henrik A.; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  10. The peptidergic control circuit for sighing.

    PubMed

    Li, Peng; Janczewski, Wiktor A; Yackle, Kevin; Kam, Kaiwen; Pagliardini, Silvia; Krasnow, Mark A; Feldman, Jack L

    2016-02-18

    Sighs are long, deep breaths expressing sadness, relief or exhaustion. Sighs also occur spontaneously every few minutes to reinflate alveoli, and sighing increases under hypoxia, stress, and certain psychiatric conditions. Here we use molecular, genetic, and pharmacologic approaches to identify a peptidergic sigh control circuit in murine brain. Small neural subpopulations in a key breathing control centre, the retrotrapezoid nucleus/parafacial respiratory group (RTN/pFRG), express bombesin-like neuropeptide genes neuromedin B (Nmb) or gastrin-releasing peptide (Grp). These project to the preBötzinger Complex (preBötC), the respiratory rhythm generator, which expresses NMB and GRP receptors in overlapping subsets of ~200 neurons. Introducing either neuropeptide into preBötC or onto preBötC slices, induced sighing or in vitro sigh activity, whereas elimination or inhibition of either receptor reduced basal sighing, and inhibition of both abolished it. Ablating receptor-expressing neurons eliminated basal and hypoxia-induced sighing, but left breathing otherwise intact initially. We propose that these overlapping peptidergic pathways comprise the core of a sigh control circuit that integrates physiological and perhaps emotional input to transform normal breaths into sighs. PMID:26855425

  11. The peptidergic control circuit for sighing

    PubMed Central

    Kam, Kaiwen; Pagliardini, Silvia; Krasnow, Mark A.; Feldman, Jack L.

    2016-01-01

    Sighs are long, deep breaths expressing sadness, relief, or exhaustion. Sighs also occur spontaneously every few minutes to reinflate alveoli, and sighing increases under hypoxia, stress, and certain psychiatric conditions. Here we use molecular, genetic, and pharmacologic approaches to identify a peptidergic sigh control circuit in murine brain. Small neural subpopulations in a key breathing control center (RTN/pFRG) express bombesin-like neuropeptide genes neuromedin B (Nmb) or gastrin releasing peptide (Grp). These project to the preBötzinger Complex (preBötC), the respiratory rhythm generator, which expresses NMB and GRP receptors in overlapping subsets of ~200 neurons. Introducing either neuropeptide into preBötC, or onto preBötC slices, induced sighing, whereas elimination or inhibition of either receptor reduced basal sighing and inhibition of both abolished it. Ablating receptor-expressing neurons eliminated basal and hypoxia-induced sighing, but left breathing otherwise intact initially. We propose these overlapping peptidergic pathways comprise the core of a sigh control circuit that integrates physiological and perhaps emotional input to transform normal breaths into sighs. PMID:26855425

  12. 49 CFR 236.732 - Controller, circuit; switch.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... § 236.732 Controller, circuit; switch. A device for opening and closing electric circuits, operated by a... 49 Transportation 4 2014-10-01 2014-10-01 false Controller, circuit; switch. 236.732 Section 236.732 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL...

  13. 49 CFR 236.732 - Controller, circuit; switch.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... § 236.732 Controller, circuit; switch. A device for opening and closing electric circuits, operated by a... 49 Transportation 4 2013-10-01 2013-10-01 false Controller, circuit; switch. 236.732 Section 236.732 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL...

  14. 49 CFR 236.732 - Controller, circuit; switch.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... § 236.732 Controller, circuit; switch. A device for opening and closing electric circuits, operated by a... 49 Transportation 4 2010-10-01 2010-10-01 false Controller, circuit; switch. 236.732 Section 236.732 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL...

  15. 49 CFR 236.732 - Controller, circuit; switch.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... § 236.732 Controller, circuit; switch. A device for opening and closing electric circuits, operated by a... 49 Transportation 4 2011-10-01 2011-10-01 false Controller, circuit; switch. 236.732 Section 236.732 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL...

  16. Timing control by redundant inhibitory neuronal circuits

    SciTech Connect

    Tristan, I. Rulkov, N. F.; Huerta, R.; Rabinovich, M.

    2014-03-15

    Rhythms and timing control of sequential activity in the brain is fundamental to cognition and behavior. Although experimental and theoretical studies support the understanding that neuronal circuits are intrinsically capable of generating different time intervals, the dynamical origin of the phenomenon of functionally dependent timing control is still unclear. Here, we consider a new mechanism that is related to the multi-neuronal cooperative dynamics in inhibitory brain motifs consisting of a few clusters. It is shown that redundancy and diversity of neurons within each cluster enhances the sensitivity of the timing control with the level of neuronal excitation of the whole network. The generality of the mechanism is shown to work on two different neuronal models: a conductance-based model and a map-based model.

  17. Timing control by redundant inhibitory neuronal circuits

    NASA Astrophysics Data System (ADS)

    Tristan, I.; Rulkov, N. F.; Huerta, R.; Rabinovich, M.

    2014-03-01

    Rhythms and timing control of sequential activity in the brain is fundamental to cognition and behavior. Although experimental and theoretical studies support the understanding that neuronal circuits are intrinsically capable of generating different time intervals, the dynamical origin of the phenomenon of functionally dependent timing control is still unclear. Here, we consider a new mechanism that is related to the multi-neuronal cooperative dynamics in inhibitory brain motifs consisting of a few clusters. It is shown that redundancy and diversity of neurons within each cluster enhances the sensitivity of the timing control with the level of neuronal excitation of the whole network. The generality of the mechanism is shown to work on two different neuronal models: a conductance-based model and a map-based model.

  18. Automatic gain control circuit handles wide input range

    NASA Technical Reports Server (NTRS)

    Black, S. H.

    1966-01-01

    Automatic gain control circuit for a radio receiver handles a wide range of input signal levels without overloading the output stage. The transistorized circuit maintains a relatively constant output by varying attenuation of the input signal.

  19. Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures.

    PubMed

    Chiang, Hung-Lung; Lin, Kuo-Hsiung; Lai, Mei-Hsiu; Chen, Ting-Chien; Ma, Sen-Yi

    2007-10-01

    A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 degrees C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards

  20. Recovery of copper from printed circuit boards scraps by mechanical processing and electrometallurgy.

    PubMed

    Veit, Hugo Marcelo; Bernardes, Andréa Moura; Ferreira, Jane Zoppas; Tenório, Jorge Alberto Soares; de Fraga Malfatti, Célia

    2006-10-11

    The constant growth in generation of solid wastes stimulates studies of recycling processes. The electronic scrap is part of this universe of obsolete and/or defective materials that need to be disposed of more appropriately, or then recycled. In this work, printed circuit boards, that are part of electronic scrap and are found in almost all electro-electronic equipments, were studied. Printed circuit boards were collected in obsolete or defective personal computers that are the largest source of this kind of waste. Printed circuit boards are composed of different materials such as polymers, ceramics and metals, which makes the process more difficult. However, the presence of metals, such as copper and precious metals encourage recycling studies. Also the presence of heavy metals, as Pb and Cd turns this scrap into dangerous residues. This demonstrates the need to search for solutions of this kind of residue, in order to have it disposed in a proper way, without harming the environment. At the first stage of this work, mechanical processing was used, as comminution followed by size, magnetic and electrostatic separation. By this process it was possible to obtain a concentrated fraction in metals (mainly Cu, Pb and Sn) and another fraction containing polymers and ceramics. The copper content reached more than 50% in mass in most of the conductive fractions and significant content of Pb and Sn. At the second stage, the fraction concentrated in metals was dissolved with acids and treated in an electrochemical process in order to recover the metals separately, especially copper. The results demonstrate the technical viability of recovering copper using mechanical processing followed by an electrometallurgical technique. The copper content in solution decayed quickly in all the experiments and the copper obtained by electrowinning is above 98% in most of the tests. PMID:16757116

  1. Identification of estrogenic compounds emitted from the combustion of computer printed circuit boards in electronic waste.

    PubMed

    Owens, Clyde V; Lambright, Christy; Bobseine, Kathy; Ryan, Bryce; Gray, L Earl; Gullett, Brian K; Wilson, Vickie S

    2007-12-15

    Rapid changes in technology have brought about a surge in demand for electronic equipment. Many of these products contain brominated flame-retardants (BFRs) as additives to decrease the rate of combustion, raising concerns about their toxicological risk. In our study, emissions from the combustion of computer-printed circuit boards were evaluated in the T47D-KBluc estrogen-responsive cell line at a series of concentrations. There was significant activity from the emission extract when compared to the positive control, 0.1 nM estradiol. After HPLC fractionation, GC/MS identified ten chemicals which included bisphenol A; the brominated derivates mono-, di-, and tribisphenol, triphenyl phosphate, triphenyl phosphine oxide, 4'-bromo-[1,1'-biphenyl]-4-ol,3,5-dibromo-4-hydroxybiphenyl,3,5-dibromo-2-hydroxybiphenyl, and the oxygenated polyaromatic hydrocarbon benzanthrone. Commercially available samples of these ten compounds were tested. The compound 4'-bromo-[1,1'-biphenyl]-4-ol resulted in dose-dependent significant increases for luciferase activity at concentrations ranging from 0.1 to 10 microM in the T47D-KBluc assay. The chemical also demonstrated an affinity for binding to the estrogen receptor (ER) with an IC50 of 2 x 10(-7) M. To determine the uterotrophic activity, three doses (50, 100, and 200 mg/kg/day) of 4'-bromo-[1,1'-biphenyl]-4-ol were administered to adult ovariectomized Long-Evans rats for 3 days. Treatment of the animals with 200 mg/ kg/day showed an increase in uterine weight Hence one new chemical, released by burning of electrical wastes, was identified which displays estrogenic activity both in vitro and in vivo. However, it was about 1000-fold less potent than ethynyl estradiol. PMID:18200886

  2. Ion track enabled multiple wire microvia interconnects in printed circuit boards

    NASA Astrophysics Data System (ADS)

    Yousef, H.; Lindeberg, M.; Hjort, K.

    2008-04-01

    As the call for higher wiring density in packaging and vertical microvia interconnections (microvias) rapidly evolves, the need for smaller lateral dimensions in printed circuit boards (PCB) microvias must be met. The ion track lithography described in this paper allows for high throughput micromachining of small, deep, vertical microvias in flexible PCB and all-polymer laminates. Ion track lithography makes use of swift heavy ion irradiation to enhance the selectivity and directionality of chemical etching. Within the areas exposed to the ion irradiation, small sub-micron pores (capillaries) are created, one for every ion. If etching is prolonged, the pores become merged. Electrodeposition from a metallic seed layer is used to fill these structures with metal. The lithography masks define either the areas where the ion tracks are developed or where the tracks are metallized. The smallest achievable size of the microvias is only limited by the resolution of the mask; microvias below 10 μm in diameter can also be achieved also in thick polyimide foils. Since each impinging ion forms one track, the foil's porosity can be controlled by adjusting the irradiation dose, as well as by etching the pores to a suitable size. Depending on the porosity and material, the resultant metallized microvia consists of either individual or interlaced wires (like strands in a bundle wire), or is a solid. As an individual sub-micron wire may have an aspect ratio of several hundreds, this allows for the fabrication of truly vertical microvia structures, allowing ultra-high density microvia batch production. Demonstrator microstructures with highly vertical microvias have been fabricated in foils up to 125 μm thickness. Several components integrated in flexible PCB have been presented by us, e.g. magnetoresistive sensors, thermopile IR-sensors and microwave components like inductor elements.

  3. Estimation of Operating Condition of Appliances Using Circuit Current Data on Electric Distribution Boards

    NASA Astrophysics Data System (ADS)

    Iwafune, Yumiko; Ogimoto, Kazuhiko; Yagita, Yoshie

    The Energy management systems (EMS) on demand sides are expected as a method to enhance the capability of supply and demand balancing of a power system under the anticipated penetration of renewable energy generation such as Photovoltaics (PV). Elucidation of energy consumption structure in a building is one of important elements for realization of EMS and contributes to the extraction of potential energy saving. In this paper, we propose the estimation method of operating condition of household appliances using circuit current data on an electric distribution board. Circuit current data are broken down by their shape using a self-organization map method and aggregated by appliance based on customers' information of appliance possessed. Proposed method is verified using residential energy consumption measurement survey data.

  4. Field analysis and enhancement of multi-pole magnetic components fabricated on printed circuit board

    NASA Astrophysics Data System (ADS)

    Chiu, Kuo-Chi; Chen, Chin-Sen

    2007-09-01

    A multi-pole magnetic component magnetized with a fine magnetic pole pitch of less than 1 mm is very difficult to achieve by using traditional methods. Moreover, it requires a precise mechanical process and a complicated magnetization system. Different fine magnetic pole pitches of 300, 350 and 400 μm have been accomplished on 9-pole magnetic components through the printed circuit board (PCB) manufacturing technology. Additionally, another fine magnetic pole pitch of 500 μm was also fabricated on a dual-layered (DL) wire circuit structure to investigate the field enhancement. After measurements, a gain factor of 1.37 was obtained in the field strength. The field variations among different magnetic pole pitches were analyzed in this paper.

  5. Recovery of gold from computer circuit board scrap using aqua regia.

    PubMed

    Sheng, Peter P; Etsell, Thomas H

    2007-08-01

    Computer circuit board scrap was first treated with one part concentrated nitric acid and two parts water at 70 degrees C for 1 h. This step dissolved the base metals, thereby liberating the chips from the boards. After solid-liquid separation, the chips, intermixed with some metallic flakes and tin oxide precipitate, were mechanically crushed to liberate the base and precious metals contained within the protective plastic or ceramic chip cases. The base metals in this crushed product were dissolved by leaching again with the same type of nitric acid-water solution. The remaining solid constituents, crushed chips and resin, plus solid particles of gold, were leached with aqua regia at various times and temperatures. Gold was precipitated from the leachate with ferrous sulphate. PMID:17874665

  6. Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology.

    PubMed

    Estrada-Ruiz, R H; Flores-Campos, R; Gámez-Altamirano, H A; Velarde-Sánchez, E J

    2016-07-01

    The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained. PMID:26963241

  7. Optogenetic Control of Cells and Circuits

    PubMed Central

    Miesenböck, Gero

    2013-01-01

    The absorption of light by bound or diffusible chromophores causes conformational rearrangements in natural and artificial photoreceptor proteins. These rearrangements are coupled to the opening or closing of ion transport pathways, the association or dissociation of binding partners, the enhancement or suppression of catalytic activity, or the transcription or repression of genetic information. Illumination of cells, tissues, or organisms engineered genetically to express photoreceptor proteins can thus be used to perturb biochemical and electrical signaling with exquisite cellular and molecular specificity. First demonstrated in 2002, this principle of optogenetic control has had a profound impact on neuroscience, where it provides a direct and stringent means of probing the organization of neural circuits and of identifying the neural substrates of behavior. The impact of optogenetic control is also beginning to be felt in other areas of cell and organismal biology. PMID:21819234

  8. Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards.

    PubMed

    Li, Qiao; Tao, Xiao Ming

    2014-11-01

    This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact. PMID:25383032

  9. Mineralogical analysis of dust collected from typical recycling line of waste printed circuit boards.

    PubMed

    Wang, Fangfang; Zhao, Yuemin; Zhang, Tao; Duan, Chenlong; Wang, Lizhang

    2015-09-01

    As dust is one of the byproducts originating in the mechanical recycling process of waste printed circuit boards such as crushing and separating, from the viewpoints of resource reuse and environmental protection, an effective recycling method to recover valuable materials from this kind of dust is in urgent need. In this paper, detailed mineralogical analysis on the dust collected from a typical recycling line of waste printed circuit boards is investigated by coupling several analytical techniques. The results demonstrate that there are 73.1wt.% organic matters, 4.65wt.% Al, 4.55wt.% Fe, 2.67wt.% Cu and 1.06wt.% Pb in the dust, which reveals the dust is worthy of reuse and harmful to environment. The concentration ratios of Fe, Mn and Zn can reach 12.35, 12.33 and 6.67 respectively by magnetic separation. The yield of dust in each size fraction is nonuniform, while the yield of -0.75mm size fraction is up to 51.15wt.%; as the particle size decreases, the content of liberated metals and magnetic materials increase, and metals are mainly in elemental forms. The F, Cl and Br elements combing to C in the dust would make thermal treatment dangerous to the environment. Based on these results, a flowsheet to recycle the dust is proposed. PMID:26117419

  10. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    NASA Astrophysics Data System (ADS)

    Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

    2010-06-01

    Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  11. Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards

    PubMed Central

    Li, Qiao; Tao, Xiao Ming

    2014-01-01

    This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact. PMID:25383032

  12. Immobilization of Acidithiobacillus ferrooxidans on Cotton Gauze for the Bioleaching of Waste Printed Circuit Boards.

    PubMed

    Nie, Hongyan; Zhu, Nengwu; Cao, Yanlan; Xu, Zhiguo; Wu, Pingxiao

    2015-10-01

    The bioleaching parameters of metal concentrates from waste printed circuit boards by Acidithiobacillus ferrooxidans immobilized on cotton gauze in a two-step reactor were investigated in this study. The results indicated that an average ferrous iron oxidation rate of 0.54 g/(L·h) and a ferrous iron oxidation ratio of 96.90 % were obtained after 12 h at aeration rate of 1 L/min in bio-oxidation reactor. After 96 h, the highest leaching efficiency of copper reached 91.68 % under the conditions of the content of the metal powder 12 g/L, the retention time 6 h, and the aeration rate 1 L/min. The bioleaching efficiency of copper could be above 91.12 % under repeated continuous batch operation. Meanwhile, 95.32 % of zinc, 90.32 % of magnesium, 86.31 % of aluminum, and 59.07 % of nickel were extracted after 96 h. All the findings suggested that the recovery of metal concentrates from waste printed circuit boards via immobilization of A. ferrooxidans on cotton gauze was feasible. PMID:26239442

  13. Selective recovery of palladium from waste printed circuit boards by a novel non-acid process.

    PubMed

    Zhang, Zhiyuan; Zhang, Fu-Shen

    2014-08-30

    An environmental benign, non-acid process was successfully developed for selective recovery of palladium from waste printed circuit boards (PCBs). In the process, palladium was firstly enriched during copper recovery procedure and dissolved in a special solution made of CuSO4 and NaCl. The dissolved palladium was then extracted by diisoamyl sulfide (S201). It was found that 99.4% of Pd(II) could be extracted from the solution under the optimum conditions (10% S201, A/O ratio 5 and 2min extraction). In the whole extraction process, the influence of base metals was negligible due to the relatively weak nucleophilic substitution of S201 with base metal irons and the strong steric hindrance of S201 molecular. Around 99.5% of the extracted Pd(II) could be stripped from S201/dodecane with 0.1mol/L NH3 after a two-stage stripping at A/O ratio of 1. The total recovery percentage of palladium was 96.9% during the dissolution-extraction-stripping process. Therefore, this study established a benign and effective process for selective recovery of palladium from waste printed circuit boards. PMID:25037000

  14. Thermal verification testing of commercial printed-circuit boards for spaceflight

    NASA Technical Reports Server (NTRS)

    Foster, William M., II

    1991-01-01

    A method is discussed developed to verify commercial printed-circuit boards for a shuttle orbital flight. The Space Acceleration Measurement System Project used this method first with great success. The test sequence is based on early fault detection, desire to test the final assembly, and integration with other verification testing. A component thermal screening test is performed first to force flaws in design, workmanship, parts, processes, and materials into observable failures. Then temperature definition tests are performed that consist of infrared scanning, thermal vacuum testing, and preliminary thermal operational testing. Only the engineering unit is used for temperature definition testing, but the preliminary thermal operational testing is performed on the flight unit after the temperature range has been defined. In the sequence of testing, vibration testing is performed next, but most vibration failures cannot be detected without subsequent temperature cycling. Finally, final assembly testing is performed to simulate the shuttle flight. An abbreviated thermal screening test is performed as a check after the vibration test, and then a complete thermal operational test is performed. The final assembly test finishes up with a burn-in of 100 hours of trouble-free operation. Verification is successful when all components and final assemblies have passed each test satisfactory. This method was very successful in verifying that commercial printed-circuit boards will survive in the shuttle environment.

  15. Cholinergic Circuit Control of Postnatal Neurogenesis

    PubMed Central

    Asrican, Brent; Paez-Gonzalez, Patricia; Erb, Joshua; Kuo, Chay T.

    2016-01-01

    New neuron addition via continued neurogenesis in the postnatal/adult mammalian brain presents a distinct form of nervous system plasticity. During embryonic development, precise temporal and spatial patterns of neurogenesis are necessary to create the nervous system architecture. Similar between embryonic and postnatal stages, neurogenic proliferation is regulated by neural stem cell (NSC)-intrinsic mechanisms layered upon cues from their local microenvironmental niche. Following developmental assembly, it remains relatively unclear what may be the key driving forces that sustain continued production of neurons in the postnatal/adult brain. Recent experimental evidence suggests that patterned activity from specific neural circuits can also directly govern postnatal/adult neurogenesis. Here, we review experimental findings that revealed cholinergic modulation, and how patterns of neuronal activity and acetylcholine release may differentially or synergistically activate downstream signaling in NSCs. Higher-order excitatory and inhibitory inputs regulating cholinergic neuron firing, and their implications in neurogenesis control are also considered. PMID:27468423

  16. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    SciTech Connect

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S.K.; McKay, Gordon

    2015-01-15

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

  17. Test and inspection for process control of monolithic circuits

    NASA Technical Reports Server (NTRS)

    Spangenberg, E.

    1967-01-01

    Report details the test and inspection procedures for the mass production of high reliability integrated circuits. It covers configuration control, basic fundamentals of quality control, control charts, wafer process evaluation, general process evaluation, evaluation score system, and diffusion evaluation.

  18. Control of oscillations in a discharge circuit

    NASA Technical Reports Server (NTRS)

    Cheng, D. Y.

    1972-01-01

    Development of electric discharge circuit damping element which increases in resistance with current and time is described. Damping element is resistor made of tungsten wire which has large resistance-temperature coefficient. Specifications of tungsten resistor and incorporation into circuit are explained.

  19. Optical waveguides and structures for short haul optical communication channels within printed circuit boards

    NASA Astrophysics Data System (ADS)

    Riegel, Nicholas J.

    Optical waveguides have shown promising results for use within printed circuit boards. These optical waveguides have higher bandwidth than traditional copper transmission systems and are immune to electromagnetic interference. Design parameters for these optical waveguides are needed to ensure an optimal link budget. Modeling and simulation methods are used to determine the optimal design parameters needed in designing the waveguides. As a result, optical structures necessary for incorporating optical waveguides into printed circuit boards are designed and optimized. Embedded siloxane polymer waveguides are investigated for their use in optical printed circuit boards. This material was chosen because it has low absorption, high temperature stability, and can be deposited using common processing techniques. Two sizes of waveguides are investigated, 50 mum multimode and 4 - 9 mum single mode waveguides. A beam propagation method is developed for simulating the multimode and single mode waveguide parameters. The attenuation of simulated multimode waveguides are able to match the attenuation of fabricated waveguides with a root mean square error of 0.192 dB. Using the same process as the multimode waveguides, parameters needed to ensure a low link loss are found for single mode waveguides including maximum size, minimum cladding thickness, minimum waveguide separation, and minimum bend radius. To couple light out-of-plane to a transmitter or receiver, a structure such as a vertical interconnect assembly (VIA) is required. For multimode waveguides the optimal placement of a total internal reflection mirror can be found without prior knowledge of the waveguide length. The optimal placement is found to be either 60 microm or 150 microm away from the end of the waveguide depending on which metric a designer wants to optimize the average output power, the output power variance, or the maximum possible power loss. For single mode waveguides a volume grating coupler is

  20. Analytical modeling of multi-layered Printed Circuit Board dedicated to electronic component thermal characterization

    NASA Astrophysics Data System (ADS)

    Monier-Vinard, Eric; Laraqi, Najib; Dia, Cheikh-Tidiane; Nguyen, Minh-Nhat; Bissuel, Valentin

    2015-01-01

    Electronic components are continuously getting smaller and embedding more and more powered functions which exacerbate the temperature rise in component/board interconnect areas. For still air conditions, the heat spreading of the component power is mainly done through the surrounding metallic planes of its electronic board. Their design optimization is henceforth mandatory to control the temperature and to preserve component reliability. To allow the electronic designer to early analyze the limits of the power dissipation of miniaturized devices, an analytical model of a multi-layered electronic board was established with the purpose to assess the validity of conventional board modeling approach. For decades, numerous authors have been promoting a homogenous single layer model that summed up the layers of the board using effective orthotropic thermal properties. The derived compact model depends on thermal properties approximation which is commonly based on parallel conduction model given a linear rule of mixture. The work presents the thermal behavior comparison of a detailed multi-layer representation to its deducted compact model for an extensive set of variable parameters, such as heat transfer coefficients, effective thermal conductivities calculation models, number of trace layers, trace coverage or source size. The results highlight the fact that the conventional practices for PCB modeling can dramatically underestimate source temperatures when their size is getting very small.

  1. Ductile electroless Ni-P coating onto flexible printed circuit board

    NASA Astrophysics Data System (ADS)

    Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

    2016-03-01

    In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

  2. Bioleaching waste printed circuit boards by Acidithiobacillus ferrooxidans and its kinetics aspect.

    PubMed

    Yang, Yuankun; Chen, Shu; Li, Shicheng; Chen, Mengjun; Chen, Haiyan; Liu, Bijun

    2014-03-10

    In this paper, H(+) consumption and metal recovery, during the process of bioleaching waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans (A. ferrooxidans), were discussed in detail. When the WPCBs concentration was 15g/L, Cu (96.8%), Zn (83.8%), and Al (75.4%) were recovered after 72h by A. ferrooxidans. Experimental results indicated that metal recovery rate was significantly influenced by acid. Based on experimental results, the kinetics of the H(+) consumption and metal recovery on bioleaching WPCBs were represented by reaction kinetic equations. The kinetic of H(+) consumption could be described by the second-order kinetic model. The metal recovery belongs to the second-order model with adding acid, which was changed to the shrinking core model with precipitate production. PMID:24445171

  3. Application of Printed Circuit Board Technology to FT-ICR MS Analyzer Cell Construction and Prototyping

    NASA Astrophysics Data System (ADS)

    Leach, Franklin E.; Norheim, Randolph; Anderson, Gordon; Pasa-Tolic, Ljiljana

    2014-12-01

    Although Fourier transform ion cyclotron resonance mass spectrometry (FT-ICR MS) remains the mass spectrometry platform that provides the highest levels of performance for mass accuracy and resolving power, there is room for improvement in analyzer cell design as the ideal quadrupolar trapping potential has yet to be generated for a broadband MS experiment. To this end, analyzer cell designs have improved since the field's inception, yet few research groups participate in this area because of the high cost of instrumentation efforts. As a step towards reducing this barrier to participation and allowing for more designs to be physically tested, we introduce a method of FT-ICR analyzer cell prototyping utilizing printed circuit boards at modest vacuum conditions. This method allows for inexpensive devices to be readily fabricated and tested over short intervals and should open the field to laboratories lacking or unable to access high performance machine shop facilities because of the required financial investment.

  4. Environmental friendly automatic line for recovering metal from waste printed circuit boards.

    PubMed

    Li, Jia; Xu, Zhenming

    2010-02-15

    The technology industrialization was the final goal of the research. A set of automatic line without negative impact to environment for recycling waste printed circuit boards (PCB) in industry-scale was investigated in this study. The independent technologies were integrated and many problems in the process of technology industrialization were solved. The whole technology contained four parts: multiple scarping, material screening, multiple-roll corona electrostatic separator, and dust precipitation. The output of this automatic line reached 600 kg/h and the recovery rate of copper reached 95%. After separation, the metal and nonmetal products were totally reused. Compared with other production lines (traditional fluid bed production line and processing from developed countries), the automatic line has lower energy consumption and better technology rationality. The cost of this line was in acceptable level for local processors. PMID:20092305

  5. Surface Flashover on Epoxy-Resin Printed Circuit Boards in Vacuum under Electron Irradiation

    NASA Astrophysics Data System (ADS)

    Fujii, Haruhisa; Hasegawa, Taketoshi; Osuga, Hiroyuki; Matsui, Katsuaki

    This paper deals with the surface flashover characteristics of dielectric material in vacuum during electron beam irradiation in order to design adequately the conductive patterns on printed circuit boards used inside a spacecraft. The dielectric material, glass-fiber reinforced epoxy resin, and the electrodes printed on it were irradiated with electrons of the energy of 3-10 keV. DC high voltage was applied between the two electrodes during electron irradiation. The voltage was increased stepwise until the surface flashover occurred on the dielectric material. We obtained the results that the surface flashover voltage increased with the insulation distance between the electrodes but electron irradiation made the flashover voltage lower. The flashover voltage characteristics were obtained as parameters of the electrode distance and the energy of the electron beam.

  6. An automatic placement tool for rapid prototyping of printed circuit boards

    NASA Astrophysics Data System (ADS)

    Granacki, John; Kazi, Tauseef

    1993-11-01

    This report describes a fully automatic placement tool for PCB's (printed circuit boards), nap (nonhierarchical automatic placement) that combines approaches from different placement heuristics developed both for PCB and VLSI chip placement. Although the problem of placement for a PCB can be abstractly cast into the same formalism as the problem of VLSI cell placement, a practical tool must incorporate many additional features. In this report we describe the impact of incorporating these PCB-specific features as well as other constraints imposed by the CAD environment (that is, the schematic capture system and the automatic routing tools) into an automatic placement tool. Next we discuss the selected heuristics and their associated data structures in detail. Following this discussion, we present the results of using the placement tool on two test cases along with an analysis of the tools performance. Finally, we identify the limitations of the current implementation and we propose some possible solutions and future work.

  7. High-reliability flexible optical printed circuit board for opto-electric interconnections

    NASA Astrophysics Data System (ADS)

    Rho, Byung Sup; Lee, Woo-Jin; Lim, Jung Woon; Kim, Gye Won; Cho, Che Hyun; Hwang, Sung Hwan

    2009-01-01

    A rigid flexible optical electrical printed circuit board (RFOE-PCB) with both electrical layers and an optical layer was fabricated using a conventional PCB manufacture process. The RFOE-PCB is applicable to fold-type mobile devices such as mobile phones and laptop computers. The RFOE-PCB was designed to be embedded with a flexible 45-deg-ended optical waveguide, which was made using a polymeric material. The precise lamination between an electrical layer and an optical layer was achieved by a passive alignment method. We carried out the repetitive folding test and an environment test for physical and optical reliability suitable for mobile devices. Data transmission of 2.5 Gb/s was demonstrated with a clear eye diagram using the fabricated RFOE-PCB.

  8. Application of Printed Circuit Board Technology to FT-ICR MS Analyzer Cell Construction and Prototyping

    SciTech Connect

    Leach, Franklin E.; Norheim, Randolph V.; Anderson, Gordon A.; Pasa-Tolic, Ljiljana

    2014-12-01

    Although Fourier transform ion cyclotron resonance mass spectrometry (FT-ICRMS) remains themass spectrometry platform that provides the highest levels of performance for mass accuracy and resolving power, there is room for improvement in analyzer cell design as the ideal quadrupolar trapping potential has yet to be generated for a broadband MS experiment. To this end, analyzer cell designs have improved since the field’s inception, yet few research groups participate in this area because of the high cost of instrumentation efforts. As a step towards reducing this barrier to participation and allowing for more designs to be physically tested, we introduce a method of FT-ICR analyzer cell prototyping utilizing printed circuit boards at modest vacuum conditions. This method allows for inexpensive devices to be readily fabricated and tested over short intervals and should open the field to laboratories lacking or unable to access high performance machine shop facilities because of the required financial investment.

  9. Thermal research of infrared sight signal processing circuit board under temperature shock environment

    NASA Astrophysics Data System (ADS)

    Gao, Youtang; Ding, Huang; Qiao, Jianliang; Xu, Yuan; Niu, Jun

    2015-10-01

    Thermal stability technology of signal processing circuit infrared sight is studied under temperature shock. Model parameters and geometry is configured for FPGA devices (EP1C20F400C8), solder material and PCB. Signal circuit boards of full array BGA distribution are simulated and analyzed by thermal shock and waveform through engineering finite element analysis software. Because solders of the whole model have strong stress along Y direction, initial stress constraints along Y direction are primarily considered when the partial model of single solder is imposed by thermal load. When absolute thermal loads stresses of diagonal nodes with maximum strains are separated from the whole model, interpolation is processed according to thermal loads circulation. Plastic strains and thermal stresses of nodes in both sides of partial model are obtained. The analysis results indicate that with thermal load circulation, maximum forces of each circulation along Y direction are increasingly enlarged and with the accumulation of plastic strains of danger point, the composition will become invalid in the end.

  10. Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

    PubMed

    Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

    2010-02-21

    Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings. PMID:20126694

  11. CO2 laser micromachining of optical waveguides for interconnection on circuit boards

    NASA Astrophysics Data System (ADS)

    Zakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Wang, Kai; Selviah, David R.

    2012-12-01

    The introduction of microvia and surface mount technologies into the manufacturing process for printed circuit boards (PCBs) has significantly improved the interconnection density. However, as the speed of signals for data communication on the board approaches and begins to exceed 10 Gb/s, the loss and crosstalk of copper interconnections increase. To resolve these problems, optical interconnections (OI) have been suggested as a viable solution. Literature reports have proved the photochemical nature of excimer laser ablation with its minimal thermal effect, and other ultra-violet lasers are also being investigated for the fabrication of polymer waveguides by laser ablation. In this paper, the authors demonstrate the fabrication of multimode optical polymer waveguides by using infra-red 10.6 μm CO2 laser micromachining to etch acrylate-based photopolymer (Truemode™). CO2 lasers offer a low cost and high speed fabrication route as CO2 lasers can be used to cut through various engineering materials including polymers and metals. The paper characterises the relationship between the laser ablation power, the fabrication speed and the resulting effect on the waveguide optical insertion loss for the first time.

  12. Electronic circuit provides automatic level control for liquid nitrogen traps

    NASA Technical Reports Server (NTRS)

    Turvy, R. R.

    1968-01-01

    Electronic circuit, based on the principle of increased thermistor resistance corresponding to decreases in temperature provides an automatic level control for liquid nitrogen cold traps. The electronically controlled apparatus is practically service-free, requiring only occasional reliability checks.

  13. Control circuit maintains unity power factor of reactive load

    NASA Technical Reports Server (NTRS)

    Kramer, M.; Martinage, L. H.

    1966-01-01

    Circuit including feedback control elements automatically corrects the power factor of a reactive load. It maintains power supply efficiency where negative load reactance changes and varies by providing corrective error signals to the control windings of a power supply transformer.

  14. Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

    ERIC Educational Resources Information Center

    California State Univ., Sacramento. Dept. of Civil Engineering.

    One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

  15. Separation and recovery of fine particles from waste circuit boards using an inflatable tapered diameter separation bed.

    PubMed

    Duan, Chenlong; Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

    2014-01-01

    Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (-0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5-0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25-0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (-0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution. PMID:25379546

  16. Separation and Recovery of Fine Particles from Waste Circuit Boards Using an Inflatable Tapered Diameter Separation Bed

    PubMed Central

    Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

    2014-01-01

    Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (−0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5–0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25–0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (−0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution. PMID:25379546

  17. A 5 Giga Samples Per Second 8-Bit Analog to Digital Printed Circuit Board for Radio Astronomy

    NASA Astrophysics Data System (ADS)

    Jiang, Homin; Liu, Howard; Guzzino, Kim; Kubo, Derek; Li, Chao-Te; Chang, Ray; Chen, Ming-Tang

    2014-08-01

    We have designed, manufactured, and characterized an 8-bit 5 Giga samples per second (Gsps) ADC printed circuit board assembly (PCBA). An e2v EV8AQ160 ADC chip was used in the design and the board is plug compatible with the field programmable gate array (FPGA) board developed by the Collaboration for Astronomy Signal Processing and Electronics Research (CASPER) community. Astronomical interference fringes were demonstrated across a single baseline pair of antennas using two ADC boards on the Yuan Tseh Lee Array for Microwave Background Anisotropy (AMiBA) telescope. Several radio interferometers are using this board for bandwidth expansion, such as Submillimeter Array; also, several experimental telescopes are building new spectrometers using the same board. The ADC boards were attached directly to the Reconfigurable Open Architecture Computing Hardware (ROACH-2) FPGA board for processing of the digital output signals. This ADC board provides the capability of digitizing radio frequency signals from DC to 2 GHz (3 dB bandwidth), and to an extended bandwidth of 2.5 GHz (5 dB) with derated performance. The following worst-case performance parameters were obtained over 2 GHz: spur free dynamic range (SFDR) of 44 dB, signal-to-noise and distortion (SINAD) of 35 dB, and effective number of bits (ENOB) of 5.5.

  18. Micro/nano-scale fabrication of integrated polymer optical wire circuit arrays for optical printed circuit board (O-PCB) application

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, Seung G.; Park, Se G.; Kim, Kyong H.; Kang, Jin K.; Chin, In J.; Kwon, Y. K.; Choi, Young W.

    2005-02-01

    We report on the results of our study on the micro/nano-scale design, fabrication and integration of waveguide arrays for optical printed circuit boards (O-PCBs) and VLSI micro/nano-photonic applications. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We have assembled O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined information handling performances. We also designed power beam splitters and waveguide filters, using nano-scale photonic band-gap crystals, for VLSI photonic integration application. We discuss potential applications of polymer optical waveguide devices and arrays for O-PCB and VLSI micro/nano-photonics for computers, telecommunications, and transportation systems.

  19. Design of the Wind Tunnel Model Communication Controller Board. Degree awarded by Christopher Newport Univ. on Dec. 1998

    NASA Technical Reports Server (NTRS)

    Wilson, William C.

    1999-01-01

    The NASA Langley Research Center's Wind Tunnel Reinvestment project plans to shrink the existing data acquisition electronics to fit inside a wind tunnel model. Space limitations within a model necessitate a distributed system of Application Specific Integrated Circuits (ASICs) rather than a centralized system based on PC boards. This thesis will focus on the design of the prototype of the communication Controller board. A portion of the communication Controller board is to be used as the basis of an ASIC design. The communication Controller board will communicate between the internal model modules and the external data acquisition computer. This board is based around an Field Programmable Gate Array (FPGA), to allow for reconfigurability. In addition to the FPGA, this board contains buffer Random Access Memory (RAM), configuration memory (EEPROM), drivers for the communications ports, and passive components.

  20. Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

    SciTech Connect

    Nair, Aswathi; Raghunandan, Karthik; Yaswant, Vaddi; Sambandan, Sanjiv E-mail: ssanjiv@isu.iisc.ernet.in; Pillai, Sreelal S.

    2015-03-23

    We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route having mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.

  1. Fluid logic control circuit operates nutator actuator motor

    NASA Technical Reports Server (NTRS)

    1966-01-01

    Fluid logic control circuit operates a pneumatic nutator actuator motor. It has no moving parts and consists of connected fluid interaction devices. The operation of this circuit demonstrates the ability of fluid interaction devices to operate in a complex combination of series and parallel logic sequence.

  2. Circuit Controls Turn-On Current

    NASA Technical Reports Server (NTRS)

    Holmes, K. G.

    1972-01-01

    Single choke used in primary circuit with diode arrangement, maintaining dc current flow through choke and setting up a unidirectional magnetic field, limits turn-on current of transformer-rectifier power supply. Technique reduces number and weight of components and minimizes effect of initial inrush surge current on source.

  3. Integrated-Circuit Controller For Brushless dc Motor

    NASA Technical Reports Server (NTRS)

    Le, Dong Tuan

    1994-01-01

    Generic circuit performs commutation-logic and power-switching functions for control of brushless dc motor. Controller includes commutation-logic and associated control circuitry, power supply, and inverters containing power transistors. Major advantages of controller are size, weight, and power consumption can be made less than other brushless-dc-motor controllers.

  4. Generation of copper rich metallic phases from waste printed circuit boards

    SciTech Connect

    Cayumil, R.; Khanna, R.; Ikram-Ul-Haq, M.; Rajarao, R.; Hill, A.; Sahajwalla, V.

    2014-10-15

    Highlights: • Recycling and material recovery from waste printed circuit boards is very complex. • Thermoset polymers, ceramics and metals are present simultaneously in waste PCBs. • Heat treatment of PCBs was carried out at 1150 °C under inert conditions. • Various metallic phases could be segregated out as copper based metallic droplets. • Carbon and ceramics residues can be further recycled in a range of applications. - Abstract: The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150 °C under argon gas flowing at 1 L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the

  5. Evaluation of gold and silver leaching from printed circuit board of cellphones

    SciTech Connect

    Petter, P.M.H. Veit, H.M.; Bernardes, A.M.

    2014-02-15

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

  6. 49 CFR 236.303 - Control circuits for signals, selection through circuit controller operated by switch points or...

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ...-point frogs and derails shall be selected through circuit controller operated directly by switch points... switch, movable-point frog, and derail in the routes governed by such signal. Circuits shall be arranged... when each switch, movable-point frog, and derail in the route is in proper position....

  7. 49 CFR 236.303 - Control circuits for signals, selection through circuit controller operated by switch points or...

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ...-point frogs and derails shall be selected through circuit controller operated directly by switch points... switch, movable-point frog, and derail in the routes governed by such signal. Circuits shall be arranged... when each switch, movable-point frog, and derail in the route is in proper position....

  8. 49 CFR 236.303 - Control circuits for signals, selection through circuit controller operated by switch points or...

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ...-point frogs and derails shall be selected through circuit controller operated directly by switch points... switch, movable-point frog, and derail in the routes governed by such signal. Circuits shall be arranged... when each switch, movable-point frog, and derail in the route is in proper position....

  9. 49 CFR 236.303 - Control circuits for signals, selection through circuit controller operated by switch points or...

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ...-point frogs and derails shall be selected through circuit controller operated directly by switch points... switch, movable-point frog, and derail in the routes governed by such signal. Circuits shall be arranged... when each switch, movable-point frog, and derail in the route is in proper position....

  10. 49 CFR 236.303 - Control circuits for signals, selection through circuit controller operated by switch points or...

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ...-point frogs and derails shall be selected through circuit controller operated directly by switch points... switch, movable-point frog, and derail in the routes governed by such signal. Circuits shall be arranged... when each switch, movable-point frog, and derail in the route is in proper position....

  11. Induction motor control system with voltage controlled oscillator circuit

    NASA Technical Reports Server (NTRS)

    Nola, F. J.; Currie, J. R.; Reid, H., Jr. (Inventor)

    1973-01-01

    A voltage controlled oscillator circuit is reported in which there are employed first and second differential amplifiers. The first differential amplifier, being employed as an integrator, develops equal and opposite slopes proportional to an input voltage, and the second differential amplifier functions as a comparator to detect equal amplitude positive and negative selected limits and provides switching signals which gate a transistor switch. The integrating differential amplifier is switched between charging and discharging modes to provide an output of the first differential amplifier which upon the application of wave shaping provides a substantially sinusoidal output signal. A two phased version with a second integrator provides a second 90 deg phase shifted output for induction motor control.

  12. A new technology for recycling materials from waste printed circuit boards.

    PubMed

    Zhou, Yihui; Qiu, Keqiang

    2010-03-15

    Waste printed circuit boards (WPCBs) contain lots of valuable resources together with plenty of hazardous materials, which are considered both an attractive secondary resource and an environmental contaminant. In this research, a new process of "centrifugal separation+vacuum pyrolysis" for the combined recovery of solder and organic materials from WPCBs was investigated. The results of centrifugal separation indicated that the separation of solder from WPCBs was complete when WPCBs were heated at 240 degrees C, and the rotating drum was rotated at 1400 rpm for 6 min intermittently. The results of vacuum pyrolysis showed that the type-A of WPCBs without solder pyrolysed to form an average of 69.5 wt% residue, 27.8 wt% oil, and 2.7 wt% gas; and pyrolysis of the type-B of WPCBs without solder led to an average mass balance of 75.7 wt% residue, 20.0 wt% oil, and 4.3 wt% gas. The pyrolysis residues contain various metals, glass fibers and other inorganic materials, which could be recycled for further processing. The pyrolysis oils can be used for fuel or chemical feedstock and the pyrolysis gases can be collected and combusted for the pyrolysis self-sustain. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent the environmental pollution of WPCBs effectively. PMID:19939558

  13. Direct-referencing Two-dimensional-array Digital Microfluidics Using Multi-layer Printed Circuit Board

    PubMed Central

    Gong, Jian; Kim, Chang-Jin “CJ”

    2008-01-01

    Digital (i.e. droplet-based) microfluidics, by the electrowetting-on-dielectric (EWOD) mechanism, has shown great potential for a wide range of applications, such as lab-on-a-chip. While most reported EWOD chips use a series of electrode pads essentially in one-dimensional line pattern designed for specific tasks, the desired universal chips allowing user-reconfigurable paths would require the electrode pads in two-dimensional pattern. However, to electrically access the electrode pads independently, conductive lines need to be fabricated underneath the pads in multiple layers, raising a cost issue especially for disposable chip applications. In this article, we report the building of digital microfluidic plates based on a printed-circuit-board (PCB), in which multilayer electrical access lines were created inexpensively using mature PCB technology. However, due to its surface topography and roughness and resulting high resistance against droplet movement, as-fabricated PCB surfaces require unacceptably high (~500 V) voltages unless coated with or immersed in oil. Our goal is EWOD operations of aqueous droplets not only on oil-covered but also on dry surfaces. To meet varying levels of performances, three types of gradually complex post-PCB microfabrication processes are developed and evaluated. By introducing land-grid-array (LGA) sockets in the packaging, a scalable digital microfluidics system with reconfigurable and low-cost chip is also demonstrated. PMID:19234613

  14. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    SciTech Connect

    ARTAKI,I.; RAY,U.; REJENT,JEROME A.; VIANCO,PAUL T.

    1999-09-01

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  15. An environmentally friendly technology of disassembling electronic components from waste printed circuit boards.

    PubMed

    Wang, Jianbo; Guo, Jie; Xu, Zhenming

    2016-07-01

    Electronic components (ECs) disassembling from waste printed circuit boards (WPCBs) is the first and essential step in WPCBs recycling chain. Over the past decades, primitive methods like simply heating WPCBs on a coal-heated plate to melt solders are dominated in practice, causing serious environmental pollution and also putting a real threat to the human health. In order to solve this problem, in this article, an automatic system in pilot-scale for ECs disassembling from WPCBs is designed, manufactured, and investigated. This system contains two parts: ECs automatic disassembly and off-gas purification. Meanwhile, WPCBs from television (i.e., TV-WPCBs) and personal computer (i.e., PC-WPCBs) are used for disassembling tests, respectively. When the disassembling temperature, rotating speed, and incubation time are 265±5°C, 10rpm, and 8min, respectively, the solder can be completely removed from both TV-WPCBs and PC-WPCBs. No pollutant is discharged from this system. Finally, the disassembling procedures for ECs from both TV-WPCBs and PC-WPCBs are suggested to promote WPCBs disassembling in an environment-friendly way, without threaten the environment and human health. PMID:27026495

  16. A novel dismantling process of waste printed circuit boards using water-soluble ionic liquid.

    PubMed

    Zeng, Xianlai; Li, Jinhui; Xie, Henghua; Liu, Lili

    2013-10-01

    Recycling processes for waste printed circuit boards (WPCBs) have been well established in terms of scientific research and field pilots. However, current dismantling procedures for WPCBs have restricted the recycling process, due to their low efficiency and negative impacts on environmental and human health. This work aimed to seek an environmental-friendly dismantling process through heating with water-soluble ionic liquid to separate electronic components and tin solder from two main types of WPCBs-cathode ray tubes and computer mainframes. The work systematically investigates the influence factors, heating mechanism, and optimal parameters for opening solder connections on WPCBs during the dismantling process, and addresses its environmental performance and economic assessment. The results obtained demonstrate that the optimal temperature, retention time, and turbulence resulting from impeller rotation during the dismantling process, were 250 °C, 12 min, and 45 rpm, respectively. Nearly 90% of the electronic components were separated from the WPCBs under the optimal experimental conditions. This novel process offers the possibility of large industrial-scale operations for separating electronic components and recovering tin solder, and for a more efficient and environmentally sound process for WPCBs recycling. PMID:23910241

  17. Converting non-metallic printed circuit boards waste into a value added product

    PubMed Central

    2013-01-01

    The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB) waste as filler in recycled HDPE (rHDPE) in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE) was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM) was used to study the dispersion of nonmetallic PCB and MAPE in the matrix. Nonmetallic PCB was blended with rHDPE from 0–30 wt% and prepared by counter-rotating twin screw extruder followed by molding into test samples via hot press for analysis. A good balance between stiffness, strength and toughness was achieved for the system containing 30 wt% PCB. Thus, this system was chosen in order to investigate the effect of the compatibilizer on the mechanical properties of the composites. The results indicate that MAPE as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic PCB and rHDPE. The addition of 6 phr MAPE increased the flexural strength, tensile strength and impact strength by 71%, 98% and 44% respectively compared to the uncompatibilized composites. PMID:24764542

  18. Dissolution of brominated epoxy resins by dimethyl sulfoxide to separate waste printed circuit boards.

    PubMed

    Zhu, Ping; Chen, Yan; Wang, Liangyou; Qian, Guangren; Zhang, Wei Jie; Zhou, Ming; Zhou, Jin

    2013-03-19

    Improved methods are required for the recycling of waste printed circuit boards (WPCBs). In this study, WPCBs (1-1.5 cm(2)) were separated into their components using dimethyl sulfoxide (DMSO) at 60 °C for 45 min and a metallographic microscope was used to verify their delamination. An increased incubation time of 210 min yielded a complete separation of WPCBs into their components, and copper foils and glass fibers were obtained. The separation time decreased with increasing temperature. When the WPCB size was increased to 2-3 cm(2), the temperature required for complete separation increased to 90 °C. When the temperature was increased to 135 °C, liquid photo solder resists could be removed from the copper foil surfaces. The DMSO was regenerated by rotary decompression evaporation, and residues were obtained. Fourier transform infrared spectroscopy (FT-IR), thermal analysis, nuclear magnetic resonance, scanning electron microscopy, and energy-dispersive X-ray spectroscopy were used to verify that these residues were brominated epoxy resins. From FT-IR analysis after the dissolution of brominated epoxy resins in DMSO it was deduced that hydrogen bonding may play an important role in the dissolution mechanism. This novel technology offers a method for separating valuable materials and preventing environmental pollution from WPCBs. PMID:23398278

  19. Converting non-metallic printed circuit boards waste into a value added product.

    PubMed

    Muniyandi, Shantha Kumari; Sohaili, Johan; Hassan, Azman; Mohamad, Siti Suhaila

    2013-01-01

    The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB) waste as filler in recycled HDPE (rHDPE) in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE) was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM) was used to study the dispersion of nonmetallic PCB and MAPE in the matrix. Nonmetallic PCB was blended with rHDPE from 0-30 wt% and prepared by counter-rotating twin screw extruder followed by molding into test samples via hot press for analysis. A good balance between stiffness, strength and toughness was achieved for the system containing 30 wt% PCB. Thus, this system was chosen in order to investigate the effect of the compatibilizer on the mechanical properties of the composites. The results indicate that MAPE as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic PCB and rHDPE. The addition of 6 phr MAPE increased the flexural strength, tensile strength and impact strength by 71%, 98% and 44% respectively compared to the uncompatibilized composites. PMID:24764542

  20. Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

    PubMed

    Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

    2015-11-01

    Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. PMID:26022338

  1. Liberation characteristics after cryogenic modification and air table separation of discarded printed circuit boards.

    PubMed

    Zhou, Cuihong; Pan, Yongtai; Lu, Maxi; Yang, Changshun

    2016-07-01

    Liberating useful materials from printed circuit boards (PCBs) is challenging because PCBs are flexible and complex in terms of materials and components. In this study, the crushing of PCBs at low-temperature was investigated. The results indicated that when the temperature was decreased to approximately -20 °C, the strength of PCBs decreased and their brittleness increased, making them easier to crush. A double roll crusher was selected to crush the PCBs. The particle size distribution and power consumption were studied under different working conditions. The results showed that the particle size of most of the lumps was in the range 15×20-25×20 mm, and that power consumption was minimal when the frequency of the crusher was 40-50 Hz. A small shredder was used for cryogenic grinding, and it was found that its power consumption strongly depended on the cooling temperature. An orthogonal experiment was conducted, which revealed that a smaller cutter gap and higher rotational speed could achieve higher yield. Furthermore, the results indicated that the air table developed to liberate PCB materials could effectively separate 2.8-0.5mm grade materials. Overall, the results of this study provide an experimental foundation for more effectively recycling discarded PCBs. PMID:26985873

  2. Spectral imaging method for material classification and inspection of printed circuit boards

    NASA Astrophysics Data System (ADS)

    Ibrahim, Abdelhameed; Tominaga, Shoji; Horiuchi, Takahiko

    2010-05-01

    We propose a spectral imaging method for material classification and inspection of raw printed circuit boards (PCBs). The method is composed of two steps (1) estimation the PCB surface-spectral reflectances and (2) unsupervised classification of the reflectance data to make the inspection of PCB easy and efficient. First, we develop a spectral imaging system that captures high dynamic range images of a raw PCB with spatially and spectrally high resolutions in the region of visible wavelength. The surface-spectral reflectance is then estimated at every pixel point from multiple spectral images, based on the reflection characteristics of different materials. Second, the surface-spectral reflectance data are classified into several groups, according to the number of PCB materials. We develop an unsupervised classification algorithm incorporating both spectral information and spatial information, based on the Nyström approximation of the normalized cut method. The initial seeds for the Nyström procedure are effectively chosen using a guidance module based on the K-means algorithm. Low-dimensional spectral features are efficiently extracted from the original high-dimensional spectral reflectance data. The feasibility of the proposed method is examined in experiments using real PCBs in detail.

  3. Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound.

    PubMed

    Guo, Jie; Rao, Qunli; Xu, Zhenming

    2008-05-01

    The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m(2), heat deflection temperature of 175 degrees C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits. PMID:17949900

  4. A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

    PubMed Central

    Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

    2015-01-01

    For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

  5. Study on characteristics of printed circuit board liberation and its crushed products.

    PubMed

    Quan, Cui; Li, Aimin; Gao, Ningbo

    2012-11-01

    Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs. PMID:22956523

  6. Wideband characterization of printed circuit board materials up to 50 ghz

    NASA Astrophysics Data System (ADS)

    Rakov, Aleksei

    A traveling-wave technique developed a few years ago in the Missouri S&T EMC Laboratory has been employed until now for characterization of PCB materials over a broad frequency range up to 30 GHz. This technique includes measuring S-parameters of the specially designed PCB test vehicles. An extension of the frequency range of printed circuit board laminate dielectric and copper foil characterization is an important problem. In this work, a new PCB test vehicle design for operating up to 50 GHz has been proposed. As the frequency range of measurements increases, the analysis of errors and uncertainties in measuring dielectric properties becomes increasingly important. Formulas for quantification of two major groups of errors, repeatability (manufacturing variability) and reproducibility (systematic) errors, in extracting dielectric constant (DK) and dissipation factor (DK) have been derived, and computations for a number of cases are presented. Conductor (copper foil) surface roughness of PCB interconnects is an important factor, which affects accuracy of DK and DF measurements. This work describes a new algorithm for semi-automatic characterization of copper foil profiles on optical or scanning electron microscopy (SEM) pictures of signal traces. The collected statistics of numerous copper foil roughness profiles allows for introducing a new metric for roughness characterization of PCB interconnects. This is an important step to refining the measured DK and DF parameters from roughness contributions. The collected foil profile data and its analysis allow for developing "design curves", which could be used by SI engineers and electronics developers in their designs.

  7. Effect of High-Humidity Testing on Material Parameters of Flexible Printed Circuit Board Materials

    NASA Astrophysics Data System (ADS)

    Lahokallio, Sanna; Saarinen, Kirsi; Frisk, Laura

    2013-09-01

    The tendency of polymers to absorb moisture impairs especially their electrical and mechanical properties. These are important characteristics for printed circuit board (PCB) materials, which should provide mechanical support as well as electrical insulation in many different environments in order to guarantee safe operation for electrical devices. Moreover, the effects of moisture are accelerated at increased temperatures. In this study, three flexible PCB dielectric materials, namely polyimide (PI), fluorinated ethylene-propylene (FEP), and polyethylene terephthalate (PET), were aged over different periods of time in a high-humidity test, in which the temperature was 85°C and relative humidity 85%. After aging, the changes in the structure of the polymers were studied by determining different material parameters such as modulus of elasticity, glass-transition temperature, melting point, coefficient of thermal expansion, water absorption, and crystallinity, and changes in the chemical structure with several techniques including thermomechanical analysis, differential scanning calorimetry, Fourier-transform infrared spectroscopy, moisture analysis, and a precision scale. The results showed that PI was extremely stable under the aging conditions and therefore an excellent choice for electrical applications under harsh conditions. Similarly, FEP proved to be relatively stable under the applied aging conditions. However, its crystallinity increased markedly during aging, and after 6000 h of aging the results indicated oxidation. PET suffered from hydrolysis during the test, leading to its embrittlement after 2000 h of aging.

  8. Printed circuit boards as platform for disposable lab-on-a-chip applications

    NASA Astrophysics Data System (ADS)

    Leiterer, Christian; Urban, Matthias; Fritzsche, Wolfgang; Goldys, Ewa; Inglis, David

    2015-12-01

    An increasing demand in performance from electronic devices has resulted in continuous shrinking of electronic components. This shrinkage has demanded that the primary integration platform, the printed circuit board (PCB), follow this same trend. Today, PCB companies offer ~100 micron sized features (depth and width) which mean they are becoming suitable as physical platforms for Lab-on-a-Chip (LOC) and microfluidic applications. Compared to current lithographic based fluidic approaches; PCB technology offers several advantages that are useful for this technology. These include: Being easily designed and changed using free software, robust structures that can often be reused, chip layouts that can be ordered from commercial PCB suppliers at very low cost (1 AUD each in this work), and integration of electrodes at no additional cost. Here we present the application of PCB technology in connection with microfluidics for several biomedical applications. In case of commercialization the costs for each device can be even further decreased to approximately one tenth of its current cost.

  9. Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board

    NASA Astrophysics Data System (ADS)

    Van Steenberge, Geert; Hendrickx, Nina; Geerinck, Peter; Bosman, Erwin; Van Put, Steven; Van Erps, Jurgen; Thienpont, Hugo; Van Daele, Peter

    2006-02-01

    We present a fabrication technology for integrating polymer waveguides and 45° micromirror couplers into standard electrical printed circuit boards (PCBs). The most critical point that is being addressed is the low-cost manufacturing and the compatibility with current PCB production. The latter refers to the processes as well as material compatibility. Multimode waveguides are patterned by KrF excimer laser ablation in acrylate polymers with 0.13 dB/cm propagation loss at 850 nm. Single mode waveguides using inorganic-organic hybrid polymers show an attenuation loss of 0.62 +/- 0.08 dB/cm at 1.3 μm. A process for embedding metal coated 45° micromirrors in optical waveguiding layers is developed. Mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation. Initial single mode coupling loss measurements at 1.3 μm show an excess mirror loss of 1.55 dB. Multimode coupling loss measurements will improve this excess loss, because of the lower surface roughness of the mirrors using the acrylate polymers for multimode waveguides.

  10. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

    PubMed

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

    2014-05-30

    The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. PMID:24747374