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Sample records for energy deposition sputtering

  1. Measuring the energy flux at the substrate position during magnetron sputter deposition processes

    SciTech Connect

    Cormier, P.-A.; Thomann, A.-L.; Dussart, R.; Semmar, N.; Mathias, J.; Balhamri, A.; Snyders, R.; Konstantinidis, S.

    2013-01-07

    In this work, the energetic conditions at the substrate were investigated in dc magnetron sputtering (DCMS), pulsed dc magnetron sputtering (pDCMS), and high power impulse magnetron sputtering (HiPIMS) discharges by means of an energy flux diagnostic based on a thermopile sensor, the probe being set at the substrate position. Measurements were performed in front of a titanium target for a highly unbalanced magnetic field configuration. The average power was always kept to 400 W and the probe was at the floating potential. Variation of the energy flux against the pulse peak power in HiPIMS was first investigated. It was demonstrated that the energy per deposited titanium atom is the highest for short pulses (5 {mu}s) high pulse peak power (39 kW), as in this case, the ion production is efficient and the deposition rate is reduced by self-sputtering. As the argon pressure is increased, the energy deposition is reduced as the probability of scattering in the gas phase is increased. In the case of the HiPIMS discharge run at moderate peak power density (10 kW), the energy per deposited atom was found to be lower than the one measured for DCMS and pDCMS discharges. In these conditions, the HiPIMS discharge could be characterized as soft and close to a pulsed DCMS discharge run at very low duty cycle. For the sake of comparison, measurements were also carried out in DCMS mode with a balanced magnetron cathode, in the same working conditions of pressure and power. The energy flux at the substrate is significantly increased as the discharge is generated in an unbalanced field.

  2. Ion beam sputter etching and deposition of fluoropolymers

    NASA Technical Reports Server (NTRS)

    Banks, B. A.; Sovey, J. S.; Miller, T. B.; Crandall, K. S.

    1978-01-01

    Fluoropolymer etching and deposition techniques including thermal evaporation, RF sputtering, plasma polymerization, and ion beam sputtering are reviewed. Etching and deposition mechanisms and material characteristics are discussed. Ion beam sputter etch rates for polytetrafluoroethylene (PTFE) were determined as a function of ion energy, current density and ion beam power density. Peel strengths were measured for epoxy bonds to various ion beam sputtered fluoropolymers. Coefficients of static and dynamic friction were measured for fluoropolymers deposited from ion bombarded PTFE.

  3. Ion beam sputter etching and deposition of fluoropolymers

    NASA Technical Reports Server (NTRS)

    Banks, B. A.; Sovey, J. S.; Miller, T. B.; Crandall, K. S.

    1978-01-01

    Fluoropolymer etching and deposition techniques including thermal evaporation, RF sputtering, plasma polymerization, and ion beam sputtering are reviewed. Etching and deposition mechanism and material characteristics are discussed. Ion beam sputter etch rates for polytetrafluoroethylene (PTFE) were determined as a function of ion energy, current density and ion beam power density. Peel strengths were measured for epoxy bonds to various ion beam sputtered fluoropolymers. Coefficients of static and dynamic friction were measured for fluoropolymers deposited from ion bombarded PTFE.

  4. Simultaneous ion sputter polishing and deposition

    NASA Technical Reports Server (NTRS)

    Rutledge, S.; Banks, B.; Brdar, M.

    1981-01-01

    Results of experiments to study ion beam sputter polishing in conjunction with simultaneous deposition as a mean of polishing copper surfaces are presented. Two types of simultaneous ion sputter polishing and deposition were used in these experiments. The first type utilized sputter polishing simultaneous with vapor deposition, and the second type utilized sputter polishing simultaneous with sputter deposition. The etch and deposition rates of both techniques were studied, as well as the surface morphology and surface roughness.

  5. Sputtering - A vacuum deposition method for coating material.

    NASA Technical Reports Server (NTRS)

    Spalvins, T.

    1972-01-01

    The sputtering method is discussed in terms of the unique features which sputter offers in depositing coatings. These features include versatility, momentum transfer, configuration of target, precise controls, and a relatively slow deposition rate. Sputtered films are evaluated in terms of adherence, coherence, and the internal stresses. The observed strong adherence is attributed to the high kinetic energies of the sputtered material, sputter etched surface, and the submicroscopic particle size. Film thickness can be controlled to a millionth of a centimeter. Very adherent films of sputtered PTFE (teflon) can be deposited in a single operation on any type of material and on any geometrical configuration.

  6. Sputtering. [as deposition technique in mechanical engineering

    NASA Technical Reports Server (NTRS)

    Spalvins, T.

    1976-01-01

    This paper primarily reviews the potential of using the sputtering process as a deposition technique; however, the manufacturing and sputter etching aspects are also discussed. Since sputtering is not regulated by classical thermodynamics, new multicomponent materials can be developed in any possible chemical composition. The basic mechanism for dc and rf sputtering is described. Sputter-deposition is described in terms of the unique advantageous features it offers such as versatility, momentum transfer, stoichiometry, sputter-etching, target geometry (coating complex surfaces), precise controls, flexibility, ecology, and sputtering rates. Sputtered film characteristics, such as strong adherence and coherence and film morphology, are briefly evaluated in terms of varying the sputtering parameters. Also described are some of the specific industrial areas which are turning to sputter-deposition techniques.

  7. Sputter Deposition of Metallic Sponges

    SciTech Connect

    Jankowski, A F; Hayes, J P

    2002-01-18

    Metallic films are grown with a sponge-like morphology in the as-deposited condition using planar magnetron sputtering. The morphology of the deposit is characterized by metallic continuity in three dimensions with continuous porosity on the sub-micron scale. The stabilization of the metallic sponge is directly correlated with a limited range for the sputter deposition parameters of working gas pressure and substrate temperature. This sponge-like morphology augments the features as generally understood in the classic zone models of growth for physical vapor deposits. Nickel coatings are deposited with working gas pressures up to 4 Pa and for substrate temperatures up to 1100 K. The morphology of the deposits is examined in plan and in cross-section with scanning electron microscopy. The parametric range of gas pressure and substrate temperature (relative to absolute melt point) for the deposition processing under which the metallic sponges are produced appear universal for many metals, as for example, including gold, silver, and aluminum.

  8. Ion beam sputter deposited diamond like films

    NASA Technical Reports Server (NTRS)

    Banks, B. A.; Rutledge, S. K.

    1982-01-01

    A single argon ion beam source was used to sputter deposit carbon films on fused silica, copper, and tantalum substrates under conditions of sputter deposition alone and sputter deposition combined with simultaneous argon ion bombardment. Simultaneously deposited and ion bombarded carbon films were prepared under conditions of carbon atom removal to arrival ratios of 0, 0.036, and 0.71. Deposition and etch rates were measured for films on fused silica substrates. Resulting characteristics of the deposited films are: electrical resistivity of densities of 2.1 gm/cu cm for sputter deposited films and 2.2 gm/cu cm for simultaneously sputter deposited and Ar ion bombarded films. For films approximately 1700 A thick deposited by either process and at 5550 A wavelength light the reflectance was 0.2, the absorptance was 0.7, the absorption coefficient was 67,000 cm to the -1 and the transmittance was 0.1.

  9. REACTIVE SPUTTER DEPOSITION OF CHROMIUM NITRIDE COATINGS

    EPA Science Inventory

    The effect of substrate temperature and sputtering gas compositon on the structure and properties of chromium-chromium nitride films deposited on C-1040 steel using r.f. magnetron sputter deposition was investigated. X-ray diffraction analysis was used to determine the structure ...

  10. Sputtering: A vacuum deposition method for coating material

    NASA Technical Reports Server (NTRS)

    Spalvins, T.

    1972-01-01

    The sputtering process is described in terms of its features: versatility, momentum transfer, configuration of target, precise controls and the relatively slow deposition rate. Sputtered films are evaluated in terms of adherence, coherence, and internal stresses. The strong adherence is attributed to the high kinetic energies of the sputtered material, sputter etched (cleaned) surface, and the submicroscopic particle size. An illustration is a sputtered solid film lubricant such as MoS2. Friction tests were conducted on a thin, 2000 A deg thick MoS2 film. These films are very dense and without observable pinholes, and the particle to particle cohesion is strong. Tolerances (film thickness) can be controlled to a millionth of a centimeter. Very adherent films of sputtered Teflon can be deposited in a single operation on any type of material (metal, glass, paper) and on any geometrical configuration with a dense adherent film.

  11. Effect of magnetic field strength on deposition rate and energy flux in a dc magnetron sputtering system

    SciTech Connect

    Ekpe, Samuel D.; Jimenez, Francisco J.; Field, David J.; Davis, Martin J.; Dew, Steven K.

    2009-11-15

    Variations in the magnetic field strongly affect the plasma parameters in a magnetron sputtering system. This in turn affects the throughput as well as the energy flux to the substrate. The variation in the magnetic field in this study, for a dc magnetron process, is achieved by shifting the magnet assembly slightly away from the target. Measurements of the plasma parameters show that while the electron density at the substrate increases with decrease in magnetic field, the electron temperature decreases. The cooling of the electron temperature is consistent with results reported elsewhere. The deposition rate per input magnetron power is found to increase slightly with the decrease in magnetic field for the process conditions considered in this study. Results suggest that the energy flux to the substrate tends to show a general decrease with the shift in the magnet assembly.

  12. The model of calculation the adhesion force and energy for coatings deposited by magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Tkachenko, E. A.; Postnikov, D. V.; Blesman, A. I.; Polonyankin, D. A.

    2016-02-01

    The paper justifies the usefulness of preliminary ion implantation before forming the protective coating by magnetron sputtering in order to improve its adhesion and hence the coating durability. The important characteristics of coatings include the adhesion force and energy. To select the optimal modes of coatings formation, materials and equipment it is proposed the theoretical method of the adhesion force calculation in binary metallic systems. The adhesion force and energy depend on the elemental distribution in the depth of the coating and on the single bond force as in the substrate and in the coating. In addition the adhesion force is also determined by the coefficient taking into account the reduction of the possible bond number and depending on the surface purity and the structural defects presence. The developed model includes all of the above factors. The elements distribution over the depth of the coating was estimated using a kinetic model of mass transfer by vacancy mechanism. The paper presents the results of the adhesion force calculation for the chromium coating on the surface of A21382 steel.

  13. Sputtering

    NASA Technical Reports Server (NTRS)

    Spalvins, T.

    1976-01-01

    The potential of using the sputtering process as a deposition technique is reviewed; however, the manufacturing and sputter etching aspects are also discussed. The basic mechanism for dc and rf sputtering is described. Sputter deposition is presented in terms of the unique advantageous features it offers such as versatility, momentum transfer, stoichiometry, sputter etching, target geometry (coating and complex surfaces), precise controls, flexibility, ecology, and sputtering rates. Sputtered film characteristics, such as strong adherence and coherence and film morphology, are briefly evaluated in terms of varying the sputtering parameters. Also discussed are some of the specific industrial areas which are turning to sputter deposition techniques.

  14. Reactive sputter deposition of metal oxide nanolaminates

    NASA Astrophysics Data System (ADS)

    Rubin Aita, Carolyn

    2008-07-01

    We discuss the reactive sputter deposition of metal oxide nanolaminates on unheated substrates using four archetypical examples: ZrO2 Al2O3, HfO2 Al2O3, ZrO2 Y2O3, and ZrO2 TiO2. The pseudobinary bulk phase diagrams corresponding to these nanolaminates represent three types of interfaces. I. Complete immiscibility (ZrO2 Al2O3 and HfO2 Al2O3). II. Complete miscibility (ZrO2 Y2O3). III. Limited miscibility without a common end-member lattice (ZrO2 TiO2). We found that, although reactive sputter deposition is a far-from-equilibrium process, thermodynamic considerations strongly influence both phase formation within layers and at interfaces. We show that pseudobinary phase diagrams can be used to predict interfacial cation mixing in the nanolaminates. However, size effects must be considered to predict specific structures. In the absence of pseudoepitaxy, size effects play a significant role in determining the nanocrystalline phases that form within a layer (e.g. tetragonal ZrO2, tetragonal HfO2, and orthorhombic HfO2) and at interfaces (e.g. monoclinic (Zr,Ti)O2). These phases are not bulk standard temperature and pressure phases. Their formation is understood in terms of self-assembly into the lowest energy structure in individual critical nuclei.

  15. Application of diamond films to electric propulsion: Low energy sputter yield measurement and MPD plasma assisted chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Blandino, John Joseph

    One application of chemically vapor deposited (CVD) diamond films under evaluation at the Jet Propulsion Laboratory is the coating of ion thruster electrodes subject to sputter erosion from xenon ions. Sputter yields were measured for polycrystalline diamond, single crystal diamond, a carbon-carbon composite, and molybdenum subject to xenon ion bombardment. The tests were performed using a 3 cm Kaufman ion source to produce incident ions with energy in the range of 150--750 eV and a profilometry-based technique to measure the amount of sputtered material. The yields increased monotonically with energy with values ranging from 0.16 atoms/ion at 150 eV to 0.80 at 750 eV for the molybdenum and 0.06 to 0.14 for the carbon-carbon. At 150 eV the yield for both diamond samples was 0.07 and at 7 50 eV, 0.19 and 0.17 for the CVD and single crystal diamond respectively. In terms of erosion rate, this translates into a factor of 7--12 lower erosion rate for diamond compared to molybdenum and at least a factor of 1.5 compared to carbon-carbon. In addition, an experimental investigation of an electromagnetic (magnetoplasmadynamic or MPD) plasma source for diamond CVD was undertaken using gas mixtures of methane, hydrogen and argon. Numerous trials were conducted using methane to hydrogen mixture ratios of 1.5--3.5 percent by volume, four different methane injector configurations, and substrate biasing at potentials of 25--75 V positive with respect to facility ground. These tests were performed at discharge currents of 700--950 A at approximately 18 V (12--17 kW). Crystalline films were produced with growth rates of 0.8 to 6.3 microns/hr. X-ray diffraction spectroscopy was used to identify at least one unambiguous diamond peak in each sample. The films all exhibited poor Raman spectra with no well defined peak at 1332 cm-1 and a broad background possibly due to high background levels of nitrogen, defects, and metal vapor contamination. Finally, the potential benefits of the MPD

  16. Ion beam sputter deposited zinc telluride films

    NASA Technical Reports Server (NTRS)

    Gulino, D. A.

    1986-01-01

    Zinc telluride is of interest as a potential electronic device material, particularly as one component in an amorphous superlattice, which is a new class of interesting and potentially useful materials. Some structural and electronic properties of ZnTe films deposited by argon ion beam sputter deposition are described. Films (up to 3000 angstroms thick) were deposited from a ZnTe target. A beam energy of 1000 eV and a current density of 4 mA/sq cm resulted in deposition rates of approximately 70 angstroms/min. The optical band gap was found to be approximately 1.1 eV, indicating an amorphous structure, as compared to a literature value of 2.26 eV for crystalline material. Intrinsic stress measurements showed a thickness dependence, varying from tensile for thicknesses below 850 angstroms to compressive for larger thicknesses. Room temperature conductivity measurement also showed a thickness dependence, with values ranging from 1.86 x 10 to the -6th/ohm cm for 300 angstrom film to 2.56 x 10 to the -1/ohm cm for a 2600 angstrom film. Measurement of the temperature dependence of the conductivity for these films showed complicated behavior which was thickness dependent. Thinner films showed at least two distinct temperature dependent conductivity mechanisms, as described by a Mott-type model. Thicker films showed only one principal conductivity mechanism, similar to what might be expected for a material with more crystalline character.

  17. Ion beam sputter deposited zinc telluride films

    NASA Technical Reports Server (NTRS)

    Gulino, D. A.

    1985-01-01

    Zinc telluride is of interest as a potential electronic device material, particularly as one component in an amorphous superlattice, which is a new class of interesting and potentially useful materials. Some structural and electronic properties of ZnTe films deposited by argon ion beam sputter depoairion are described. Films (up to 3000 angstroms thick) were deposited from a ZnTe target. A beam energy of 1000 eV and a current density of 4 mA/sq. cm. resulted in deposition rates of approximately 70 angstroms/min. The optical band gap was found to be approximately 1.1 eV, indicating an amorphous structure, as compared to a literature value of 2.26 eV for crystalline material. Intrinsic stress measurements showed a thickness dependence, varying from tensile for thicknesses below 850 angstroms to compressive for larger thicknesses. Room temperature conductivity measurement also showed a thickness dependence, with values ranging from 1.86 x to to the -6/ohm. cm. for 300 angstrom film to 2.56 x 10 to the -1/ohm. cm. for a 2600 angstrom film. Measurement of the temperature dependence of the conductivity for these films showed complicated behavior which was thickness dependent. Thinner films showed at least two distinct temperature dependent conductivity mechanisms, as described by a Mott-type model. Thicker films showed only one principal conductivity mechanism, similar to what might be expected for a material with more crystalline character.

  18. Magnetron Sputtering Deposits Corrosion-Resistant Alloy

    NASA Technical Reports Server (NTRS)

    Khanna, S. K.; Thakoor, A. P.; Williams, R. M.

    1986-01-01

    Dense, amorphous, metallic film resists corrosion attack by acid. Coatings thermally stable up to 800 degrees C and made corrosion resistant by proper choice of sputtering deposition conditions. Protective, corrosionresistant coatings applied to process equipment that comes in contact with aqueous, neutral, or acidic solutions in chemical, petroleum, and paper industries, in wastewater treatment, and in heat exchangers.

  19. Stress development and relaxation during sputter deposition film growth

    NASA Astrophysics Data System (ADS)

    Meng, Fanyu

    The stress development and relaxation of magnetron sputtered copper and amorphous-silicon (a-Si) films at room temperature are studied. Samples were prepared as a function of pressure and deposition power. In-situ stress measurements with the wafer curvature method were made using a helium neon gas laser system with a 10mm beam splitter. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) were used to perform post-growth microstructural and surface analysis. SEM cross-section analysis was used to determine the final film thickness. Phase compositions were studied by X-ray diffraction. The growth rates of copper films decreased with increasing pressure. Copper film stress development followed a non-monotonic compressive, tensile then tensile relaxation curve. In order to investigate further the nature of the stress relaxation, stress curves both after deposition was stopped and after it is restarted were also measured. Correlations between growth rate and pressure were also observed in a-Si sputter deposition. In some contrast to what was observed for Cu deposition, stress measurement during a-Si deposition showed a trend of tensile development and relaxation at all pressures studied. In a new approach to understanding stress relaxation during film growth, an acoustic emission (AE) system is introduced to measure the AE energy during sputter deposition. Evidence shows a certain relation between the strain energy of films calculated using the measured stresses and AE energy recorded during the deposition. AE energy occurs immediately after deposition starts and follows the trend of stress development (increasing hits and energies) and relaxation (decreasing hits and energies). No further signal was detected after deposition, matching the results of stress curve measurements showing that stress magnitude after deposition stays at the same level as before deposition stopped. Results also show a lower AE energy magnitude with increasing deposition

  20. Effect of substrate roughness on the apparent surface free energy of sputter deposited superhydrophobic polytetrafluoroethylene coatings: A comparison of experimental data with different theoretical models

    SciTech Connect

    Selvakumar, N.; Barshilia, Harish C.; Rajam, K. S.

    2010-07-15

    We have studied the effect of substrate roughness on the wettability and the apparent surface free energy (SFE) of sputter deposited polytetrafluoroethylene (PTFE) coatings deposited on untreated glass (average roughness, R{sub a}=2.0 nm), plasma etched glass (R{sub a}=7.4 nm), and sandblasted glass (R{sub a}=4500 nm) substrates. The wettability of the PTFE coatings deposited on substrates with varying roughnesses was evaluated by measuring the apparent contact angle (CA) using a series of probe liquids from nonpolar aprotic to polar protic. The wettability measurements indicate that an apparent water CA of 152 deg. with a sliding angle of 8 deg. was achieved for PTFE coatings deposited on a substrate with R{sub a}=4500 nm. The superhydrophobicity observed in these coatings is attributed to the presence of dual scale roughness, densely packed microstructure and the presence of CF{sub 3} groups. Unlike the bulk PTFE which is mainly dispersive, the sputter deposited PTFE coatings are expected to have some degree of polar component due to the plasma treatment. In order to calculate the dispersive SFE of PTFE coatings, we have used the Girifalco-Good-Fowkes (GGF) method and validated it with the Zisman model. Furthermore, the Owens-Wendt model has been used to calculate the dispersive and the polar components of the apparent SFE of the PTFE coatings. These results are further corroborated using the Fowkes method. Finally, an ''equation of state'' theory proposed by Neumann has been used to calculate the apparent SFE values of the PTFE coatings. The results indicate that the apparent SFE values of the PTFE coatings obtained from the Owens-Wendt and the Fowkes methods are comparable to those obtained from the Neumann's method. The analyses further demonstrate that the GGF and the Zisman methods underestimate the apparent SFE values of the sputter deposited PTFE coatings.

  1. Measurement of deposition rate and ion energy distribution in a pulsed dc magnetron sputtering system using a retarding field analyzer with embedded quartz crystal microbalance

    NASA Astrophysics Data System (ADS)

    Sharma, Shailesh; Gahan, David; Scullin, Paul; Doyle, James; Lennon, Jj; Vijayaraghavan, Rajani K.; Daniels, Stephen; Hopkins, M. B.

    2016-04-01

    A compact retarding field analyzer with embedded quartz crystal microbalance has been developed to measure deposition rate, ionized flux fraction, and ion energy distribution arriving at the substrate location. The sensor can be placed on grounded, electrically floating, or radio frequency (rf) biased electrodes. A calibration method is presented to compensate for temperature effects in the quartz crystal. The metal deposition rate, metal ionization fraction, and energy distribution of the ions arriving at the substrate location are investigated in an asymmetric bipolar pulsed dc magnetron sputtering reactor under grounded, floating, and rf biased conditions. The diagnostic presented in this research work does not suffer from complications caused by water cooling arrangements to maintain constant temperature and is an attractive technique for characterizing a thin film deposition system.

  2. Measurement of deposition rate and ion energy distribution in a pulsed dc magnetron sputtering system using a retarding field analyzer with embedded quartz crystal microbalance.

    PubMed

    Sharma, Shailesh; Gahan, David; Scullin, Paul; Doyle, James; Lennon, Jj; Vijayaraghavan, Rajani K; Daniels, Stephen; Hopkins, M B

    2016-04-01

    A compact retarding field analyzer with embedded quartz crystal microbalance has been developed to measure deposition rate, ionized flux fraction, and ion energy distribution arriving at the substrate location. The sensor can be placed on grounded, electrically floating, or radio frequency (rf) biased electrodes. A calibration method is presented to compensate for temperature effects in the quartz crystal. The metal deposition rate, metal ionization fraction, and energy distribution of the ions arriving at the substrate location are investigated in an asymmetric bipolar pulsed dc magnetron sputtering reactor under grounded, floating, and rf biased conditions. The diagnostic presented in this research work does not suffer from complications caused by water cooling arrangements to maintain constant temperature and is an attractive technique for characterizing a thin film deposition system. PMID:27131678

  3. Reactive sputter deposition of boron nitride

    SciTech Connect

    Jankowski, A.F.; Hayes, J.P.; McKernan, M.A.; Makowiecki, D.M.

    1995-10-01

    The preparation of fully dense, boron targets for use in planar magnetron sources has lead to the synthesis of Boron Nitride (BN) films by reactive rf sputtering. The deposition parameters of gas pressure, flow and composition are varied along with substrate temperature and applied bias. The films are characterized for composition using Auger electron spectroscopy, for chemical bonding using Raman spectroscopy and for crystalline structure using transmission electron microscopy. The deposition conditions are established which lead to the growth of crystalline BN phases. In particular, the growth of an adherent cubic BN coating requires 400--500 C substrate heating and an applied {minus}300 V dc bias.

  4. Low-Energy Sputtering Research

    NASA Technical Reports Server (NTRS)

    Ray, P. K.; Shutthanandan, V.

    1999-01-01

    An experimental study is described to measure low-energy (less than 600 eV) sputtering yields of molybdenum with xenon ions using Rutherford backscattering spectroscopy (RBS) and secondary neutral mass spectroscopy (SNMS). An ion gun was used to generate the ion beam. The ion current density at the target surface was approximately 30 (micro)A/sq cm. For RBS measurements, the sputtered material was collected on a thin aluminum strip which was mounted on a semi-circular collector plate. The target was bombarded with 200 and 500 eV xenon ions at normal incidence. The differential sputtering yields were measured using the RBS method with 1 MeV helium ions. The differential yields were fitted with a cosine fitting function and integrated with respect to the solid angle to provide the total sputtering yields. The sputtering yields obtained using the RBS method are in reasonable agreement with those measured by other researchers using different techniques. For the SNMS measurements, 150 to 600 eV xenon ions were used at 50deg angle of incidence. The SNMS spectra were converted to sputtering yields for perpendicular incidence by normalizing SNMS spectral data at 500 eV with the yield measured by Rutherford backscattering spectrometry. Sputtering yields as well as the shape of the yield-energy curve obtained in this manner are in reasonable agreement with those measured by other researchers using different techniques. Sputtering yields calculated by using two semi-spherical formulations agree reasonably well with measured data. The isotopic composition of secondary ions were measured by bombarding copper with xenon ions at energies ranging from 100 eV to 1.5 keV. The secondary ion flux was found to be enriched in heavy isotopes at low incident ion energies. The heavy isotope enrichment was observed to decrease with increasing impact energy. Beyond 700 eV, light isotopes were sputtered preferentially with the enrichment remaining nearly constant.

  5. Spatially resolved electron density and electron energy distribution function in Ar magnetron plasmas used for sputter-deposition of ZnO-based thin films

    SciTech Connect

    Maaloul, L.; Gangwar, R. K.; Morel, S.; Stafford, L.

    2015-11-15

    Langmuir probe and trace rare gases optical emission spectroscopy were used to analyze the spatial structure of the electron density and electron energy distribution function (EEDF) in a cylindrical Ar magnetron plasma reactor used for sputter-deposition of ZnO-based thin films. While a typical Bessel (zero order) diffusion profile was observed along the radial direction for the number density of charged particles at 21 cm from the ZnO target, a significant rise of these populations with respect to the Bessel function was seen in the center of the reactor at 4 cm from the magnetron surface. As for the EEDF, it was found to transform from a more or less Maxwellian far from the target to a two-temperature Maxwellian with a depletion of high-energy electrons where magnetic field confinement effects become important. No significant change in the behavior of the electron density and EEDF across a wide range of pressures (5–100 mTorr) and self-bias voltages (115–300 V) was observed during magnetron sputtering of Zn, ZnO, and In{sub 2}O{sub 3} targets. This indicates that sputtering of Zn, In, and O atoms do not play a very significant role on the electron particle balance and electron heating dynamics, at least over the range of experimental conditions investigated.

  6. Influence of reactive sputter deposition conditions on crystallization of zirconium oxide thin films

    SciTech Connect

    Sethi, Guneet; Sunal, Paul; Horn, Mark W.; Lanagan, Michael T.

    2009-05-15

    Zirconium oxide thin films were prepared through reactive magnetron sputtering with a zirconium target using pulsed-dc and radio frequency (rf) sources. The film crystallization was studied with respect to sputtering growth variables such as sputtering power, sputtering pressure, source frequency, oxygen pressure, substrate temperature, and substrate material. The crystallization was studied through x-ray diffraction (XRD) 2{theta} scans and was quantified with peak full width at half maximum and crystallite size. Crystallization of the films was found to occur over a broad range of sputter deposition parameters, while the amorphous phase was produced only at high sputtering pressure and low sputtering power. With a decrease in sputtering pressure or power, the crystallite size decreased. Energy dispersive x-ray spectroscopy, electron microscopy, and XRD analysis revealed that at very low pressures, these films are polyphase assemblages of cubic phases of oxygen deficient zirconium oxides such as ZrO and Zr{sub 2}O. When the sputtering oxygen content of these films is increased above 25%, monoclinic-ZrO{sub 2} phase is stabilized in the films and the deposition rate decreases. However, in the case of rf sputtering, an additional peak corresponding to tetragonal phase of ZrO{sub 2} is observed. The sputtering parameters were related to physical parameters such as sputtering mode, ion energy, and substrate temperature, which influence crystallinity.

  7. Sputtering deposition and characterization of ultrathin amorphous carbon films

    NASA Astrophysics Data System (ADS)

    Lu, Wei

    1999-11-01

    This dissertation focuses on experimental investigations of ultrathin, ultrasmooth amorphous carbon (a-C) films deposited on Si(100) substrates by radio frequency (RF) sputtering and characterization of the nanomechanical and nanotribological properties and thermal stability of the films. Ultrathin a-C films of thickness 5--100 nm and typical root-mean-square roughness of 0.15--1 nm were deposited on ultrasmooth Si(100) substrates using pure argon as the sputtering gas. A low-pressure RF argon discharge model was used to analyze the plasma parameters in the film growth environment. These plasma parameters correlate the deposition conditions with the film growth processes. Atomic force microscopy (AFM) and surface force microscopy (SFM) were used to characterize the nanomechanical and nanotribological properties of the a-C films. X-ray photoelectron spectroscopy (XPS) was used to investigate the compositions and microstructures of the films. Sputter-etching measurements of the a-C films by energetic argon ion bombardment were used to study the surface binding energy of carbon atoms in a-C films deposited under different conditions. The dependence of film properties on deposition conditions was studied, and relations between nanomechanical and nanotribological properties were discussed in terms of a modified deformation index. The deformation and nanotribology mechanisms of the a-C films were compared with those of other films, such as TiC and Cr films (both 100 nm thick), and bulk Si(100). Reactive RF sputtering of nitrogenated amorphous carbon (a-CNx) films was investigated by introducing nitrogen into the a-C films during film growth by using an argon-nitrogen gas mixture as the sputtering gas. The alloying effect of nitrogen on the film growth and properties, such as hardness and surface energy, was studied and interpreted in terms of the changes in the plasma environment induced due to differences in the composition of the sputtering gas mixture. The thermal

  8. TiN Deposition and Process Diagnostics using Remote Plasma Sputtering

    NASA Astrophysics Data System (ADS)

    Yang, Wonkyun; Kim, Gi-Taek; Lee, Seunghun; Kim, Do-Geun; Kim, Jong-Kuk

    2013-08-01

    The discharge voltage-current characteristics and the optical diagnostics of a remote plasma sputtering system called by high density plasma assisted sputtering source (HiPASS) were investigated. The remote plasma was generated by the hollow cathode discharge (HCD) gun and was transported to the target surface by external electromagnet coils. This showed a wide process window because the sputtering voltage and current could be individually controlled. The ion density and energy distribution could be also controlled unlike the conventional magnetron sputtering. Titanium nitride films were deposited under different sputtering voltage. The high voltage mode induced the high ionization ratio of the sputtered atoms and the high ion energy toward the substrate. That resulted in the enlarged grain size, and the preferred orientation toward (220). Eventually, this optimized condition of HiPASS obtained the best hardness of TiN films to be about 48 GPa at the sputtering voltage of -800 V.

  9. Sputter-deposited fuel cell membranes and electrodes

    NASA Technical Reports Server (NTRS)

    Narayanan, Sekharipuram R. (Inventor); Jeffries-Nakamura, Barbara (Inventor); Chun, William (Inventor); Ruiz, Ron P. (Inventor); Valdez, Thomas I. (Inventor)

    2001-01-01

    A method for preparing a membrane for use in a fuel cell membrane electrode assembly includes the steps of providing an electrolyte membrane, and sputter-depositing a catalyst onto the electrolyte membrane. The sputter-deposited catalyst may be applied to multiple sides of the electrolyte membrane. A method for forming an electrode for use in a fuel cell membrane electrode assembly includes the steps of obtaining a catalyst, obtaining a backing, and sputter-depositing the catalyst onto the backing. The membranes and electrodes are useful for assembling fuel cells that include an anode electrode, a cathode electrode, a fuel supply, and an electrolyte membrane, wherein the electrolyte membrane includes a sputter-deposited catalyst, and the sputter-deposited catalyst is effective for sustaining a voltage across a membrane electrode assembly in the fuel cell.

  10. Investigating the Mg-Si Binary System via Combinatorial Sputter Deposition As High Energy Density Anodes for Lithium-Ion Batteries.

    PubMed

    Schmuelling, Guido; Winter, Martin; Placke, Tobias

    2015-09-16

    Mg-Si thin films with various elemental compositions ranging from 0≤x≤1 in MgxSi(1-x) were obtained via combinatorial magnetron sputter deposition of Si and Mg in order to improve the electrochemical lithiation/delithiation process of pure Si by embedding Si in an active Mg-Si matrix. Scanning electron microscopy, energy-dispersive X-ray spectroscopy, X-ray diffraction, and Raman spectroscopy methods were used to investigate the morphology, stoichiometry, and structure of the different thin film samples. Constant current charge/discharge cycling revealed significant electrochemical changes depending on the Mg content in comparison to the pure Si active material improving the capacity retention to 96% over 400 cycles. PMID:26313948

  11. Sputter deposition of metallic thin film and directpatterning

    SciTech Connect

    Ji, L.; Chen, Y.; Jiang, X.; Ji, Q.; Leung, K.-N.

    2005-09-09

    A compact apparatus is developed for deposition of metal thin film. The system employs an RF discharge plasma source with a straight RF antenna, which is made of or covered with deposition material, serving as sputtering target at the same time. The average deposition rate of copper thin film is as high as 450nm/min. By properly allocating the metal materials on the sputtering antenna, mixture deposition of multiple metal species is achieved. Using an ion beam imprinting scheme also taking advantage of ion beam focusing technique, two different schemes of direct patterning deposition process are developed: direct depositing patterned metallic thin film and resistless ion beam sputter patterning. Preliminary experiments have demonstrated direct pattern transfer from a template with feature size of micro scale; patterns with more than 10x reduction are achieved by sputtering patterning method.

  12. Low-temperature crystallization of TiO2 films by sputter deposition

    NASA Astrophysics Data System (ADS)

    Taga, Yasunori; Yamada, Naoomi

    2010-04-01

    Crystalline TiO2 film was formed on PET(polyethlene terephthalate) film by radio frequency sputter deposition method using a sintered TiO2 target by adding H2O gas to Ar gas for sputtering. X-ray diffraction analysis revealed that the crystal structure of the film of 100 nm thick was confirmed to be anatase crystallites of TiO2. In order to elucidate the mechanism of low temperature crystallization thus observed, direct measurement of surface temperature of growing films during sputter deposition was carried out by two methods of an infrared thermometer from the outside of vacuum chamber and a thermocouple attached to the growing film surface. Upon the beginning of sputter deposition in Ar gas, film temperature increased rapidly and became constant at 120°C after 30 min. Addition of H2O gas to Ar gas for sputtering resulted in further increase in film temperature and reached to 230 °C depending on the deposition conditions. Furthermore, photocatalytic performance of decomposition of methylene blue was examined to be enhanced remarkably as a result of crystallization of the film. It was concluded that low temperature crystallization of TiO2 film by sputter deposition was explained in terms of local heating of thin shallow surface region of growing film by kinetic energy deposition of sputtered particles.

  13. RF Reactive Magnetron Sputter Deposition of Silicon Sub-Oxides

    NASA Astrophysics Data System (ADS)

    van Hattum, E. D.

    2007-01-01

    RF reactive magnetron plasma sputter deposition of silicon sub oxide E.D. van Hattum Department of Physics and Astronomy, Faculty of Sciences, Utrecht University The work described in the thesis has been inspired and stimulated by the use of SiOx layers in the direct inductive printing technology, where the SiOx layer is used as the charge retention layer on the drums for copying and printing devices. The thesis describes investigations of the plasma and of processes taking place on the sputter target and on the SiOx growth surface in the room temperature, RF reactive magnetron plasma sputter deposition technology. The sputtering target consists of silicon and the reactive atmosphere consists of an Ar/O2 mixture. The composition of the grown SiOx layers has been varied between x=0 and x=2 by variation of the O2 partial pressure. The characteristics of the growth process have been related to the nanostructural properties of the grown films. The deposition system enables the characterisation of the plasma (Langmuir probe, energy resolved mass spectrometer) and of the growing film (Elastic Recoil Detection (ERD), Fourier transform infrared absorption spectroscopy) and is connected to a beamline of a 6MV tandem van de Graaff accelerator. Also Rutherford Backscattering Spectrometry and X-ray Photoelectron Spectroscopy have been applied. It is shown how ERD can be used as a real-time in-situ technique. The thesis presents spatially resolved values of the ion density, electron temperature and the quasi-electrostatic potential, determined using a Langmuir probe. The plasma potential has a maximum about 2 cm from the cathode erosion area, and decreases (more than 200 V typically) towards the floating sputter cathode. The potential decreases slightly in the direction towards the grounded growth surface and the positive, mainly Ar+, ions created in the large volume of the plasma closest to the substrate are accelerated towards the growth surface. These ions obtain a few eV of

  14. Effect of sputtering power on the growth of Ru films deposited by magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Jhanwar, Prachi; Kumar, Arvind; Verma, Seema; Rangra, K. J.

    2016-04-01

    Ruthenium is deposited by DC magnetron sputtering at different powers and is characterized. The effect of sputtering power on the electrical and structural properties of the film is investigated experimentally. High resolution X-ray diffraction is used to characterize the microstructure of Ru films deposited on SiO2 surface. The peak (002) is more sharp and intense with full width at half maximum (FWHM) of 0.37° at 250W. The grain size increases with increase in sputtering power improving the crystallinity of the film. The film deposited at high sputtering power also showed lower resistivity (12.40 µΩ-cm) and higher mobility (4.82 cm2/V.s) as compared to the film deposited at low power. The surface morphology of the film is studied by atomic force microscopy (AFM).

  15. Deposition of reactively ion beam sputtered silicon nitride coatings

    NASA Technical Reports Server (NTRS)

    Grill, A.

    1982-01-01

    An ion beam source was used to deposit silicon nitride films by reactively sputtering a silicon target with beams of Ar + N2 mixtures. The nitrogen fraction in the sputtering gas was 0.05 to 0.80 at a total pressure of 6 to 2 millionth torr. The ion beam current was 50 mA at 500 V. The composition of the deposited films was investigated by auger electron spectroscopy and the rate of deposition was determined by interferometry. A relatively low rate of deposition of about 2 nm. one-tenth min. was found. AES spectra of films obtained with nitrogen fractions higher than 0.50 were consistent with a silicon to nitrogen ratio corresponding to Si3N4. However the AES spectra also indicated that the sputtered silicon nitride films were contaminated with oxygen and carbon and contained significant amounts of iron, nickel, and chromium, most probably sputtered from the holder of the substrate and target.

  16. Magnetron sputtering system for coatings deposition with activation of working gas mixture by low-energy high-current electron beam

    NASA Astrophysics Data System (ADS)

    Gavrilov, N. V.; Kamenetskikh, A. S.; Men'shakov, A. I.; Bureyev, O. A.

    2015-11-01

    For the purposes of efficient decomposition and ionization of the gaseous mixtures in a system for coatings deposition using reactive magnetron sputtering, a low-energy (100-200 eV) high-current electron beam is generated by a grid-stabilized plasma electron source. The electron source utilizes both continuous (up to 20 A) and pulse-periodic mode of discharge with a self-heated hollow cathode (10-100 A; 0.2 ms; 10-1000 Hz). The conditions for initiation and stable burning of the high-current pulse discharge are studied along with the stable generation of a low-energy electron beam within the gas pressure range of 0.01 - 1 Pa. It is shown that the use of the electron beam with controllable parameters results in reduction of the threshold values both for the pressure of gaseous mixture and for the fluxes of molecular gases. Using such a beam also provides a wide range (0.1-10) of the flux density ratios of ions and sputtered atoms over the coating surface, enables an increase in the maximum pulse density of ion current from plasma up to 0.1 A, ensures an excellent adhesion, optimizes the coating structure, and imparts improved properties to the superhard nanocomposite coatings of (Ti,Al)N/a-Si3N4 and TiC/-a-C:H. Mass-spectrometric measurements of the beam-generated plasma composition proved to demonstrate a twofold increase in the average concentration of N+ ions in the Ar-N2 plasma generated by the high-current (100 A) pulsed electron beam, as compared to the dc electron beam.

  17. Development of latent fingerprints using preferential DC sputter deposition.

    PubMed

    Kent, K; Stoilovic, M

    1995-03-21

    It was shown that a DC metal sputtering process with thermalised atoms, preferentially deposits metal onto fingerprint ridges. This method can be successfully used for the development of latent fingerprints. Four target metals were tested--copper, zinc, platinum, and gold--with platinum showing superior results for latent fingerprint development on clear polythene substrates. A comparison of platinum sputtering and cyanoacrylate fuming followed by rhodamine-6G staining, was conducted for 1-year-old fingerprint deposits. Platinum sputtering showed significantly higher sensitivity, and produced better overall results. PMID:7705733

  18. Hydrogenated amorphous silicon deposited by ion-beam sputtering

    NASA Technical Reports Server (NTRS)

    Lowe, V. E.; Henin, N.; Tu, C.-W.; Tavakolian, H.; Sites, J. R.

    1981-01-01

    Hydrogenated amorphous silicon films 1/2 to 1 micron thick were deposited on metal and glass substrates using ion-beam sputtering techniques. The 800 eV, 2 mA/sq cm beam was a mixture of argon and hydrogen ions. The argon sputtered silicon from a pure (7.6 cm) single crystal wafer, while the hydrogen combined with the sputtered material during the deposition. Hydrogen to argon pressure ratios and substrate temperatures were varied to minimize the defect state density in the amorphous silicon. Characterization was done by electrical resistivity, index of refraction and optical absorption of the films.

  19. Deposition Rates of High Power Impulse Magnetron Sputtering: Physics and Economics

    SciTech Connect

    Anders, Andre

    2009-11-22

    Deposition by high power impulse magnetron sputtering (HIPIMS) is considered by some as the new paradigm of advanced sputtering technology, yet this is met with skepticism by others for the reported lower deposition rates, if compared to rates of more conventional sputtering of equal average power. In this contribution, the underlying physical reasons for the rate changes are discussed, including (i) ion return to the target and self-sputtering, (ii) the less-than-linear increase of the sputtering yield with increasing ion energy, (iii) yield changes due to the shift of species responsible for sputtering, (iv) changes to due to greater film density, limited sticking, and self-sputtering on the substrate, (v) noticeable power losses in the switch module, (vi) changes of the magnetic balance and particle confinement of the magnetron due to self-fields at high current, and (vii) superposition of sputtering and sublimation/evaporation for selected materials. The situation is even more complicated for reactive systems where the target surface chemistry is a function of the reactive gas partial pressure and discharge conditions. While most of these factors imply a reduction of the normalized deposition rate, increased rates have been reported for certain conditions using hot targets and less poisoned targets. Finally, some points of economics and HIPIMS benefits considered.

  20. Deposition rates of high power impulse magnetron sputtering: Physics and economics

    SciTech Connect

    Anders, Andre

    2010-07-15

    Deposition by high power impulse magnetron sputtering (HIPIMS) is considered by some as the new paradigm of advanced sputtering technology, yet this is met with skepticism by others for the reported lower deposition rates, if compared to rates of more conventional sputtering of equal average power. In this contribution, the underlying physical reasons for the rate changes are discussed, including (i) ion return to the target and self-sputtering, (ii) the less-than-linear increase in the sputtering yield with increasing ion energy, (iii) yield changes due to the shift of species responsible for sputtering, (iv) changes due to greater film density, limited sticking, and self-sputtering on the substrate, (v) noticeable power losses in the switch module, (vi) changes in the magnetic balance and particle confinement of the magnetron due to self-fields at high current, and (vii) superposition of sputtering and sublimation/evaporation for selected materials. The situation is even more complicated for reactive systems where the target surface chemistry is a function of the reactive gas partial pressure and discharge conditions. While most of these factors imply a reduction in the normalized deposition rate, increased rates have been reported for certain conditions using hot targets and less poisoned targets. Finally, some points of economics and HIPIMS benefits are considered.

  1. Energy spectrum of sputtered uranium

    NASA Technical Reports Server (NTRS)

    Weller, R. A.; Tombrello, T. A.

    1977-01-01

    The fission track technique for detecting uranium 235 was used in conjunction with a mechanical time-of-flight spectrometer to measure the energy spectrum in the region 1 eV to 1 keV of material sputtered from a 93% enriched U-235 foil by 80 keV Ar-40(+) ions. The spectrum was found to exhibit a peak in the region 2-4 eV and to decrease approximately as E to the -1.77 power for E is approximately greater than 100 eV. The design, construction and resolution of the mechanical spectrometer are discussed and comparisons are made between the data and the predictions of the ramdom collision cascade model of sputtering.

  2. Sputter deposition for multi-component thin films

    DOEpatents

    Krauss, Alan R.; Auciello, Orlando

    1990-01-01

    Ion beam sputter-induced deposition using a single ion beam and a multicomponent target is capable of reproducibly producing thin films of arbitrary composition, including those which are close to stoichiometry. Using a quartz crystal deposition monitor and a computer controlled, well-focused ion beam, this sputter-deposition approach is capable of producing metal oxide superconductors and semiconductors of the superlattice type such as GaAs-AlGaAs as well as layered metal/oxide/semiconductor/superconductor structures. By programming the dwell time for each target according to the known sputtering yield and desired layer thickness for each material, it is possible to deposit composite films from a well-controlled sub-monolayer up to thicknesses determined only by the available deposition time. In one embodiment, an ion beam is sequentially directed via a set of X-Y electrostatic deflection plates onto three or more different element or compound targets which are constituents of the desired film. In another embodiment, the ion beam is directed through an aperture in the deposition plate and is displaced under computer control to provide a high degree of control over the deposited layer. In yet another embodiment, a single fixed ion beam is directed onto a plurality of sputter targets in a sequential manner where the targets are each moved in alignment with the beam under computer control in forming a multilayer thin film. This controlled sputter-deposition approach may also be used with laser and electron beams.

  3. Sputter deposition for multi-component thin films

    DOEpatents

    Krauss, A.R.; Auciello, O.

    1990-05-08

    Ion beam sputter-induced deposition using a single ion beam and a multicomponent target is capable of reproducibly producing thin films of arbitrary composition, including those which are close to stoichiometry. Using a quartz crystal deposition monitor and a computer controlled, well-focused ion beam, this sputter-deposition approach is capable of producing metal oxide superconductors and semiconductors of the superlattice type such as GaAs-AlGaAs as well as layered metal/oxide/semiconductor/superconductor structures. By programming the dwell time for each target according to the known sputtering yield and desired layer thickness for each material, it is possible to deposit composite films from a well-controlled sub-monolayer up to thicknesses determined only by the available deposition time. In one embodiment, an ion beam is sequentially directed via a set of X-Y electrostatic deflection plates onto three or more different element or compound targets which are constituents of the desired film. In another embodiment, the ion beam is directed through an aperture in the deposition plate and is displaced under computer control to provide a high degree of control over the deposited layer. In yet another embodiment, a single fixed ion beam is directed onto a plurality of sputter targets in a sequential manner where the targets are each moved in alignment with the beam under computer control in forming a multilayer thin film. This controlled sputter-deposition approach may also be used with laser and electron beams. 10 figs.

  4. Sputter deposition of nanocrystalline beta-SiC films and molecular dynamics simulations of the sputter process.

    PubMed

    Ziebert, Carlos; Ye, Jian; Ulrich, Sven; Prskalo, Alen-Pilip; Schmauder, Siegfried

    2010-02-01

    Thin nanocrystalline films of silicon carbide (SiC) have been deposited on Si substrates by rf magnetron sputtering in pure Ar atmosphere. Simultaneously classical molecular dynamics (MD) simulations of sputtering of beta-SiC by Ar atoms were performed using IMD and Materials Explorer software with a combination of the Tersoff and the Ziegler-Biersack-Littmark (ZBL) potential in order to get more insight into the sputter process. In experiments the bias voltage (0 to -40 V) has been varied at constant substrate temperature of 900 degrees C to investigate the influence on the composition, the constitution and the mechanical properties of crystalline beta-SiC films. At second the substrate temperature has been varied between 900 degrees C and 100 degrees C to find the minimum substrate temperature that is needed to get nanocrystalline beta-SiC under the applied sputter conditions (ceramic SiC target, 300 W rf power, 18 cm target-substrate distance, 50 sccm Ar gas flow, 0.26 Pa total gas pressure). The films have been characterized by electron probe micro-analysis (EPMA), X-ray diffraction (XRD), Raman spectroscopy and atomic force microscopy (AFM). Hardness and residual stress have been investigated by nanoindentation and wafer bending. In the MD simulations the sputter yield was determined as a function of the energy of the incident Ar atoms (in the interesting range for sputter deposition, i.e., 50-1000 eV). To our knowledge this is the first time that the sputter yield of a SiC target was determined as a function of the energy of the incident Ar atoms in the low energy range by using MD simulations and compared with experimental results. PMID:20352766

  5. Effect of sputtering pressure on crystalline quality and residual stress of AlN films deposited at 823 K on nitrided sapphire substrates by pulsed DC reactive sputtering

    NASA Astrophysics Data System (ADS)

    Ohtsuka, Makoto; Takeuchi, Hiroto; Fukuyama, Hiroyuki

    2016-05-01

    Aluminum nitride (AlN) is a promising material for use in applications such as deep-ultraviolet light-emitting diodes (UV-LEDs) and surface acoustic wave (SAW) devices. In the present study, the effect of sputtering pressure on the surface morphology, crystalline quality, and residual stress of AlN films deposited at 823 K on nitrided a-plane sapphire substrates, which have high-crystalline-quality c-plane AlN thin layers, by pulsed DC reactive sputtering was investigated. The c-axis-oriented AlN films were homoepitaxially grown on nitrided sapphire substrates at sputtering pressures of 0.4–1.5 Pa. Surface damage of the AlN sputtered films increased with increasing sputtering pressure because of arcing (abnormal electrical discharge) during sputtering. The sputtering pressure affected the crystalline quality and residual stress of AlN sputtered films because of a change in the number and energy of Ar+ ions and Al sputtered atoms. The crystalline quality of AlN films was improved by deposition with lower sputtering pressure.

  6. Off-axis sputter deposition of thin films

    SciTech Connect

    Capuano, L.A.; Newman, N. )

    1990-01-01

    Currently there are several techniques for making high Tc thin films, e.g., sputter deposition, laser ablation, coevaporation (including MBE), chemical vapor deposition and solution coating/pyrolysis. Of these techniques, the authors have demonstrated that high-pressure in-situ off-axis rf-magnetron sputter deposition is a simple, relatively inexpensive process capable of reproducibly yielding YBCO superconducting thin films with excellent surface resistance properties. This article describes the off-axis technique, the basic equipment requirements and the performance characteristics of high Tc superconductor films produced using this technique.

  7. View factor modeling of sputter-deposition on micron-scale-architectured surfaces exposed to plasma

    NASA Astrophysics Data System (ADS)

    Huerta, C. E.; Matlock, T. S.; Wirz, R. E.

    2016-03-01

    The sputter-deposition on surfaces exposed to plasma plays an important role in the erosion behavior and overall performance of a wide range of plasma devices. Plasma models in the low density, low energy plasma regime typically neglect micron-scale surface feature effects on the net sputter yield and erosion rate. The model discussed in this paper captures such surface architecture effects via a computationally efficient view factor model. The model compares well with experimental measurements of argon ion sputter yield from a nickel surface with a triangle wave geometry with peak heights in the hundreds of microns range. Further analysis with the model shows that increasing the surface pitch angle beyond about 45° can lead to significant decreases in the normalized net sputter yield for all simulated ion incident energies (i.e., 75, 100, 200, and 400 eV) for both smooth and roughened surfaces. At higher incident energies, smooth triangular surfaces exhibit a nonmonotonic trend in the normalized net sputter yield with surface pitch angle with a maximum yield above unity over a range of intermediate angles. The resulting increased erosion rate occurs because increased sputter yield due to the local ion incidence angle outweighs increased deposition due to the sputterant angular distribution. The model also compares well with experimentally observed radial expansion of protuberances (measuring tens of microns) in a nano-rod field exposed to an argon beam. The model captures the coalescence of sputterants at the protuberance sites and accurately illustrates the structure's expansion due to deposition from surrounding sputtering surfaces; these capabilities will be used for future studies into more complex surface architectures.

  8. Sputtering Threshold Energies of Heavy Ions

    NASA Technical Reports Server (NTRS)

    Mantenieks, Maris A.

    1999-01-01

    Sputter erosion in ion thrusters has been measured in lifetests at discharge voltages as low as 25 V. Thruster operation at this discharge voltage results in component erosion rates sufficiently low to satisfy most mission requirements. It has been recognized that most of the internal sputtering in ion thrusters is done by doubly charged ions. Knowledge of the sputtering threshold voltage of a xenon molybdenum system would be beneficial in understanding the sputtering process as well as making more accurate calculations of the sputtering rates of ion thruster components. Sputtering threshold energies calculated from various formulations found in the literature results in values ranging from 28 to 200 eV. It is evident that some of these formulations cannot be relied upon to provide sputtering thresholds with any degree of accuracy. This paper re-examines the threshold energies measurements made in the early sixties by Askerov and Sena, and Stuart and Wehner. The threshold voltages as derived by Askerov and au have been reevaluated by using a different extrapolation method of sputter yields at low ion energies. The resulting threshold energies are in general similar to those measured by Stuart and Wehner. An empirical relationship is derived,for mercury and xenon ions for the ratio of the sputtering threshold energy to the sublimation energy as a function of the ratio of target to ion atomic mass.

  9. On the evolution of film roughness during magnetron sputtering deposition

    SciTech Connect

    Turkin, A. A.; Pei, Y. T.; Shaha, K. P.; Chen, C. Q.; Vainshtein, D. I.; De Hosson, J. Th. M.

    2010-11-15

    The effect of long-range screening on the surface morphology of thin films grown with pulsed-dc (p-dc) magnetron sputtering is studied. The surface evolution is described by a stochastic diffusion equation that includes the nonlocal shadowing effects in three spatial dimensions. The diffusional relaxation and the angular distribution of the incident particle flux strongly influence the transition to the shadowing growth regime. In the magnetron sputtering deposition the shadowing effect is essential because of the configuration of the magnetron system (finite size of sputtered targets, rotating sample holder, etc.). A realistic angular distribution of depositing particles is constructed by taking into account the cylindrical magnetron geometry. Simulation results are compared with the experimental data of surface roughness evolution during 100 and 350 kHz p-dc deposition, respectively.

  10. Integration of in situ RHEED with magnetron sputter deposition for atomic layer controlled growth

    NASA Astrophysics Data System (ADS)

    Podkaminer, Jacob P.

    Epitaxial thin films continue to be one of the most promising topics within electronic materials research. Sputter deposition is one process by which these films can be formed and is a widely used growth technique for a large range of technologically important material systems. Epitaxial films of carbides, nitrides, metals, oxides and more can all be formed during the sputter process which offers the ability to deposit smooth and uniform films from the research level up to an industrial scale. This tunable kinematic deposition process excels in easily adapting for a large range of environments and growth procedures. Despite the vast advantages associated with sputter deposition, there is a significant lack of in situ analysis options during sputtering. In particular, the area of real time atomic layer control is severely deficient. Atomic layer controlled growth of epitaxial thin films and artificially layered superlattices is critical for both understanding their emergent phenomena and engineering novel material systems and devices. Reflection high-energy electron diffraction (RHEED) is one of the most common in situ analysis techniques during thin film deposition that is rarely used during sputtering due to the strong permanent magnets in magnetron sputter sources and their effect on the RHEED electron beam. In this work we have solved this problem and designed a novel way to deter the effect of the magnets for a wide range of growth geometries and demonstrate the ability for the first time to have layer by layer control during sputter deposition by in situ RHEED. A novel growth chamber that can seamlessly change between pulsed laser deposition and sputtering with RHEED for the growth of complex heterostructures has been designed and implemented. Epitaxial thin films of LaAlO3, La1-xSrxMnO3, and SrRuO3 have all been deposited by sputtering and shown to exhibit clear and extended RHEED oscillations. To solve the magnet issue, a finite element model has been

  11. Plasma sputtering system for deposition of thin film combinatorial libraries

    NASA Astrophysics Data System (ADS)

    Cooper, James S.; Zhang, Guanghai; McGinn, Paul J.

    2005-06-01

    The design of a plasma sputtering system for the deposition of combinatorial libraries is described. A rotating carousel is used to position shadow masks between the targets and the substrate. Multilayer films are built up by depositing sequentially through various masks. Postdeposition annealing is used to promote interdiffusion of the layered structures. Either discrete or compositional gradient libraries can be deposited in this system. Samples appropriate for characterization with a scanning electrochemical microscope or a multichannel microelectrode array system can be produced. The properties of some deposited Pt-Ru films for fuel cell applications are described.

  12. Investigation of structural, optical and electrical properties of (Ti,Nb)Ox thin films deposited by high energy reactive magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Mazur, Michal; Kaczmarek, Danuta; Prociow, Eugeniusz; Domaradzki, Jaroslaw; Wojcieszak, Damian; Bocheński, Jakub

    2014-06-01

    In this work the results of investigations of the titanium-niobium oxides thin films have been reported. The thin films were manufactured with the aid of a modified reactive magnetron sputtering process. The aim of the research was the analysis of structural, optical and electrical properties of the deposited thin films. Additionally, the influence of post-process annealing on the properties of studied coatings has been presented. The as-deposited coatings were amorphous, while annealing at 873 K caused a structural change to the mixture of TiO2 anatase-rutile phases. The prepared thin films exhibited good transparency with transmission level of ca. 50 % and low resistivity varying from 2 Ωcm to 5×10-2 Ωcm, depending on the time and temperature of annealing. What is worth to emphasize, the sign of Seebeck coefficient changed after the annealing process from the electron to hole type electrical conduction.

  13. Sputter deposition of stress-controlled piezoelectric AlN and AlScN films for ultrasonic and energy harvesting applications.

    PubMed

    Barth, Stephan; Bartzsch, Hagen; Gloess, Daniel; Frach, Peter; Herzog, Thomas; Walter, Susan; Heuer, Henning

    2014-08-01

    This paper reports on the deposition and characterization of piezoelectric AlN and AlXSc1-XN layers. Characterization methods include XRD, SEM, active thermo probe, pulse echo, and piezometer measurements. A special focus is on the characterization of AlN regarding the mechanical stress in the films. The stress in the films changed between -2.2 GPa (compressive) and 0.2 GPa (tensile) and showed a significant dependence on film thickness. The cause of this behavior is presumed to be the different mean grain sizes at different film thicknesses, with bigger mean grain sizes at higher thicknesses. Other influences on film stress such as the sputter pressure or the pulse mode are presented. The deposition of gradient layers using those influences allowed the adjustment of film stress while retaining the piezoelectric properties. PMID:25073140

  14. Investigation of structural, optical and electrical properties of (Ti,Nb)Ox thin films deposited by high energy reactive magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Mazur, Michal; Kaczmarek, Danuta; Prociow, Eugeniusz; Domaradzki, Jaroslaw; Wojcieszak, Damian; Bocheński, Jakub

    2014-09-01

    In this work the results of investigations of the titanium-niobium oxides thin films have been reported. The thin films were manufactured with the aid of a modified reactive magnetron sputtering process. The aim of the research was the analysis of structural, optical and electrical properties of the deposited thin films. Additionally, the influence of post-process annealing on the properties of studied coatings has been presented. The as-deposited coatings were amorphous, while annealing at 873 K caused a structural change to the mixture of TiO2 anatase-rutile phases. The prepared thin films exhibited good transparency with transmission level of ca. 50 % and low resistivity varying from 2 Ωcm to 5×10-2 Ωcm, depending on the time and temperature of annealing. What is worth to emphasize, the sign of Seebeck coefficient changed after the annealing process from the electron to hole type electrical conduction.

  15. Low-temperature epitaxy of Ge films by sputter deposition.

    NASA Technical Reports Server (NTRS)

    Khan, I. H.

    1973-01-01

    It is shown experimentally that isoepitaxial growth of Ge films on Ge substrates can be obtained by dc sputtering at substrate temperatures as low as 100 C. The crystallographic structure and orientation of the films are strongly influenced by such deposition parameters as substrate temperature, growth rate, surface contamination, and sputtering-gas purity. The amorphous-polycrystalline transition occurs between 110 and 115 C, while the polycrystalline-single crystalline transition occurs at roughly 140 C. The crystallographic order increases with increasing substrate temperature.

  16. Au/p-diamond ohmic contacts deposited by RF sputtering

    NASA Astrophysics Data System (ADS)

    Zhen, C. M.; Wang, X. Q.; Wu, X. C.; Liu, C. X.; Hou, D. L.

    2008-12-01

    Ohmic contacts have been formed on diamond films using a monolayer Au. Au film was deposited by radio frequency sputtering. I- V measurements show the good ohmic behavior of the contacts in the as-deposited and annealed states and the specific contact resistivity obtained by circular transmission line model was 1.27 × 10 -3 and 5.43 × 10 -4 Ω cm 2, respectively. Radio frequency sputtering makes an obvious interdiffusion between Au and diamond in the as-deposited contacts. Annealing the contact enhances the interdiffusion. X-ray photoelectron spectroscopy analyses and cross-sectional scan electron microscopy reveal the presence of an intermediate layer at the interface due to the intermixing between Au and diamond. Surface native oxide of the diamond film was effectively removed by treating the substrate film in boiling aqua regia solution.

  17. An experimental investigation of fractionation by sputter deposition. [application to solar wind irradiation of lunar soil

    NASA Technical Reports Server (NTRS)

    Paruso, D. M.; Cassidy, W. A.; Hapke, B. W.

    1978-01-01

    Artificial glass targets composed of elements varying widely in atomic weight were irradiated at an angle of incidence of 45 deg by 2-keV hydrogen ions at a current density of .33 mA/sq cm, and sputtered atoms were caught on a molybdenum film. Analyses of the sputter-deposited films and unsputtered target glasses were carried out by electron microprobe. The backward-sputtered component was found to be enriched in elements of low atomic weight, while the forward-sputtered component was enriched in heavy atoms. These results indicate that at the lunar surface lighter elements and isotopes would tend to be ejected in backward directions, escaping directly through the openings which admit bombarding ions without first striking an adjacent grain surface; heavy elements and isotopes would be forward-sputtered deeper into the soil and be preferentially retained, contributing to the reported enrichments of heavy elements and isotopes. Additional results show that the binding energy of an element in its oxide form influences the sticking coefficient of a sputtered atom; elements of low binding energy are likely to desorb, while elements of high binding energy tend to stick to the first bounce surface.

  18. Composition and structure of sputter deposited erbium hydride thin films

    SciTech Connect

    ADAMS,DAVID P.; ROMERO,JUAN A.; RODRIGUEZ,MARK A.; FLORO,JERROLD A.; BANKS,JAMES C.

    2000-05-10

    Erbium hydride thin films are grown onto polished, a-axis {alpha} Al{sub 2}O{sub 3} (sapphire) substrates by reactive ion beam sputtering and analyzed to determine composition, phase and microstructure. Erbium is sputtered while maintaining a H{sub 2} partial pressure of 1.4 x 10{sup {minus}4} Torr. Growth is conducted at several substrate temperatures between 30 and 500 C. Rutherford backscattering spectrometry (RBS) and elastic recoil detection analyses after deposition show that the H/Er areal density ratio is approximately 3:1 for growth temperatures of 30, 150 and 275 C, while for growth above {approximately}430 C, the ratio of hydrogen to metal is closer to 2:1. However, x-ray diffraction shows that all films have a cubic metal sublattice structure corresponding to that of ErH{sub 2}. RBS and Auger electron that sputtered erbium hydride thin films are relatively free of impurities.

  19. Hardness of CNx films deposited by MCECR plasma sputtering

    NASA Astrophysics Data System (ADS)

    Cai, Changlong; Li, Junpeng; Mi, Qian; Ma, Weihong; Yan, Yixin; Liang, Haifeng

    2007-12-01

    The CNx (carbon nitride) films were deposited on silicon (100) with Mirror-Confinement-type Electron Cyclotron Resonance (MCECR) plasma sputtering method, which sputters pure carbon target with the Ar/N II plasma. The thickness of CNx films was about 80nm. In this paper, the hardness of CNx films was investigated, and it is measured by the nanoindenter. The technical parameters of MCECR plasma sputtering influencing the hardness of CNx films include the substrate bias, microwave power, target voltage, gas pressure, and the Ar/N II ratio. Results shown that, the hardness of CNx films is bigger, when the substrate bias is at +30V, the microwave power is 200W, the target voltage is +500V, the gas pressure is 2×10 -2Pa, and the Ar/N II ratio is 9/1.

  20. Photochromic silver nanoparticles fabricated by sputter deposition

    SciTech Connect

    Okumu, J.; Dahmen, C.; Sprafke, A.N.; Luysberg, M.; Plessen, G. von; Wuttig, M.

    2005-05-01

    In this study a simple route to preparing photochromic silver nanoparticles in a TiO{sub 2} matrix is presented, which is based upon sputtering and subsequent annealing. The formation of silver nanoparticles with sizes of some tens of nanometers is confirmed by x-ray diffraction and transmission electron microscopy. The inhomogeneously broadened particle-plasmon resonance of the nanoparticle ensemble leads to a broad optical-absorption band, whose spectral profile can be tuned by varying the silver load and the annealing temperature. Multicolor photochromic behavior of this Ag-TiO{sub 2} system upon irradiation with laser light is demonstrated and discussed in terms of a particle-plasmon-assisted electron transfer from the silver nanoparticles to TiO{sub 2} and subsequent trapping by adsorbed molecular oxygen. The electron depletion in the nanoparticles reduces the light absorption at the wavelength of irradiation. A gradual recovery of the absorption band is observed after irradiation, which is explained with a slow thermal release of electrons from the oxygen trapping centers and subsequent capture into the nanoparticles. The recovery can be accelerated by ultraviolet irradiation; the explanation for this observation is that electrons photoexcited in the TiO{sub 2} are captured into the nanoparticles and restore the absorption band.

  1. Method to control deposition rate instabilities—High power impulse magnetron sputtering deposition of TiO{sub 2}

    SciTech Connect

    Kossoy, Anna E-mail: anna.kossoy@gmail.com; Magnusson, Rögnvaldur L.; Tryggvason, Tryggvi K.; Leosson, Kristjan; Olafsson, Sveinn

    2015-03-15

    The authors describe how changes in shutter state (open/closed) affect sputter plasma conditions and stability of the deposition rate of Ti and TiO{sub 2} films. The films were grown by high power impulse magnetron sputtering in pure Ar and in Ar/O{sub 2} mixture from a metallic Ti target. The shutter state was found to have an effect on the pulse waveform for both pure Ar and reactive sputtering of Ti also affecting stability of TiO{sub 2} deposition rate. When the shutter opened, the shape of pulse current changed from rectangular to peak-plateau and pulse energy decreased. The authors attribute it to the change in plasma impedance and gas rarefaction originating in geometry change in front of the magnetron. TiO{sub 2} deposition rate was initially found to be high, 1.45 Å/s, and then dropped by ∼40% during the first 5 min, while for Ti the change was less obvious. Instability of deposition rate poses significant challenge for growing multilayer heterostructures. In this work, the authors suggest a way to overcome this by monitoring the integrated average energy involved in the deposition process. It is possible to calibrate and control the film thickness by monitoring the integrated pulse energy and end growth when desired integrated pulse energy level has been reached.

  2. Sputtering of oxygen ice by low energy ions

    NASA Astrophysics Data System (ADS)

    Muntean, E. A.; Lacerda, P.; Field, T. A.; Fitzsimmons, A.; Hunniford, C. A.; McCullough, R. W.

    2015-11-01

    Naturally occurring ices lie on both interstellar dust grains and on celestial objects, such as those in the outer Solar system. These ices are continuously subjected to irradiation by ions from the solar wind and/or cosmic rays, which modify their surfaces. As a result, new molecular species may form which can be sputtered off into space or planetary atmospheres. We determined the experimental values of sputtering yields for irradiation of oxygen ice at 10 K by singly (He+, C+, N+, O+ and Ar+) and doubly (C2 +, N2 + and O2 +) charged ions with 4 keV kinetic energy. In these laboratory experiments, oxygen ice was deposited and irradiated by ions in an ultra high vacuum chamber at low temperature to simulate the environment of space. The number of molecules removed by sputtering was observed by measurement of the ice thickness using laser interferometry. Preliminary mass spectra were taken of sputtered species and of molecules formed in the ice by temperature programmed desorption (TPD). We find that the experimental sputtering yields increase approximately linearly with the projectile ion mass (or momentum squared) for all ions studied. No difference was found between the sputtering yields for singly and doubly charged ions of the same atom within the experimental uncertainty, as expected for a process dominated by momentum transfer. The experimental sputter yields are in good agreement with values calculated using a theoretical model except in the case of oxygen ions. Preliminary studies have shown molecular oxygen as the dominant species sputtered and TPD measurements indicate ozone formation.

  3. MODELING AND THE SPUTTER DEPOSITION OF COATINGS ONTO SPHERICAL CAPSULES

    SciTech Connect

    Jankowski, A F; Hayes, J P

    2006-09-19

    The sputter deposition of coatings onto capsules of polymer and oxide shells as well as solid metal spheres is accomplished using a chambered substrate platform. Oxides and metal coatings are sputter deposited through a screen-aperture array onto a 0.3-1.2 mm diameter, solid spheres and hollow shells. Each shell is contained within its own individual chamber within a larger array. Ultrasonic vibration is the method used to produce a random bounce of each capsule within each chamber, in order to produce a coating with uniform thickness. Characterization of thin aluminum-oxide coated, platinum solid spheres and thicker copper-gold layer coated, hollow capsules (of both glass and polymer) show that uniform coatings can be produced using a screen-aperture chambered, substrate platform. Potential advantages of this approach compared to open-bounce pans include improved sample yield and reduced surface roughness from debris minimization. A process model for the coating growth on the capsules is developed to assess selection of the screen aperture based on the effects of sputter deposition parameters and the coating materials.

  4. Sputter deposited Terfenol-D thin films for multiferroic applications

    NASA Astrophysics Data System (ADS)

    Mohanchandra, K. P.; Prikhodko, S. V.; Wetzlar, K. P.; Sun, W. Y.; Nordeen, P.; Carman, G. P.

    2015-09-01

    In this paper, we study the sputter deposition and crystallization process to produce high quality Terfenol-D thin film (100 nm) with surface roughness below 1.5 nm. The Terfenol-D thin film was produced using DC magnetron sputtering technique with various sputtering parameters and two different crystallization methods, i.e. substrate heating and post-annealing. Several characterization techniques including WDS, XRD, TEM, AFM, SQUID and MOKE were used to determine the physical and magnetic properties of the Terfenol-D films. TEM studies reveal that the film deposited on the heated substrate has large grains grown along the film thickness producing undesirable surface roughness while the film crystallized by post-annealing method shows uniformly distributed small grains producing a smooth surface. The Terfenol-D film was also deposited onto (011) cut PMN-PT single crystal substrate. With the application of an electric field the film exhibited a 1553 Oe change in coercivity with an estimated saturation magnetostriction of λs = 910 x 10-6.

  5. Sputter deposited beryllium fuel capsules for NIF

    SciTech Connect

    Alford, C.S.

    1998-02-12

    The objective of our effort is to systematically study the properties of films produced under different conditions, with an emphasis on improving surface morphology and microstructure while studying permeability and capsule strength. We have made extensive use of atomic force and electron microscopy to determine the microstructure of the films, along with composition probes (mainly x-ray fluorescence) to quantify the chemical structure. Our studies can be roughly divided into three categories. First, there are those in which the effects of substrate biasing have been investigated. This includes varying the substrate voltage from 0 to 120 V and applying an intermittent bias. Next there are studies of Be combined with boron, a non-soluble dopant Because of it`s low Z this dopant is of particular interest for x-ray related applications. Finally, there are experiments in which pulses of nitrogen are admitted to the vacuum chamber during deposition. The layers of nitride formed tended to disrupt the growth of Be grains, leading to a more fine-grained microstructure. For all these studies, we have most often used hollow plastic spheres for our substrate material. However, there have been some samples deposited on glass spheres or silicon flats.

  6. Liner conformality in ionized magnetron sputter metal deposition processes

    SciTech Connect

    Hamaguchi, S.; Rossnagel, S.M.

    1996-07-01

    The conformality of thin metal films (liners) formed on high-aspect-ratio trench structures in ionized magnetron sputter deposition processes is studied numerically and experimentally. The numerical simulator (SHADE) used to predict the surface topography is based on the shock-tracking method for surface evolution. The simulation results are in good agreement with experimentally observed thin-film topography. It is shown that combination of direct deposition and trench-bottom resputtering results in good conformality of step coverages and the amount of the resputtering needed for the good conformality is almost independent of trench aspect ratios. {copyright} {ital 1996 American Vacuum Society}

  7. Sputter deposition system for controlled fabrication of multilayers

    SciTech Connect

    Di Nardo, R.P.; Takacs, P.Z.; Majkrzak, C.F.; Stefan, P.M.

    1985-06-01

    A detailed description of a sputter deposition system constructed specifically for the fabrication of x-ray and neutron multilayer monochromators and supermirrors is given. One of the principal design criteria is to maintain precise control of film thickness and uniformity over large substrate areas. Regulation of critical system parameters is fully automated so that response to feedback control information is rapid and complicated layer thickness sequences can be deposited accurately and efficiently. The use of either dc or rf magnetron sources makes it possible to satisfy the diverse material requirements of both x-ray and neutron optics.

  8. Electrostatic particle trap for ion beam sputter deposition

    DOEpatents

    Vernon, Stephen P.; Burkhart, Scott C.

    2002-01-01

    A method and apparatus for the interception and trapping of or reflection of charged particulate matter generated in ion beam sputter deposition. The apparatus involves an electrostatic particle trap which generates electrostatic fields in the vicinity of the substrate on which target material is being deposited. The electrostatic particle trap consists of an array of electrode surfaces, each maintained at an electrostatic potential, and with their surfaces parallel or perpendicular to the surface of the substrate. The method involves interception and trapping of or reflection of charged particles achieved by generating electrostatic fields in the vicinity of the substrate, and configuring the fields to force the charged particulate material away from the substrate. The electrostatic charged particle trap enables prevention of charged particles from being deposited on the substrate thereby enabling the deposition of extremely low defect density films, such as required for reflective masks of an extreme ultraviolet lithography (EUVL) system.

  9. Morphology dependent electrochemical performance of sputter deposited Sn thin films

    SciTech Connect

    Nimisha, C.S.; Venkatesh, G.; Rao, K. Yellareswara; Rao, G. Mohan; Munichandraiah, N.

    2012-08-15

    Graphical abstract: Smooth homogenous anode surface results in better electrochemical performance in terms of capacity and cycle life. Highlights: ► Controlling rate of deposition of Sn thin films for different surface morphology. ► Higher deposition rate results in poor capacity retention. ► Lower deposition rate of 0.25 nm s{sup −1} helps in higher capacity retention. ► Electrochemical performance correlated homogeneity and interparticle contact area. -- Abstract: This study deals with tailoring of the surface morphology, microstructure, and electrochemical properties of Sn thin films deposited by magnetron sputtering with different deposition rates. Scanning electron microscopy and atomic force microscopy are used to characterize the film surface morphology. Electrochemical properties of Sn thin film are measured and compared by cyclic voltammetry and charge–discharge cycle data at a constant current density. Sn thin film fabricated with a higher deposition rate exhibited an initial discharge capacity of 798 mAh g{sup −1} but reduced to 94 mAh g{sup −1} at 30th cycle. Film deposited with lower deposition rate delivered 770 mAh g{sup −1} during 1st cycle with improved capacity retention of 521 mAh g{sup −1} on 30th cycle. Comparison of electrochemical performances of these films has revealed important distinctions, which are associated with the surface morphology and hence on rate of deposition.

  10. Gravity-Related Transport Process in Off-Axis Sputtering Deposition

    NASA Technical Reports Server (NTRS)

    Zhu, Shen; Su, Ching-Hua; Lehozeku, S. L.

    2000-01-01

    In the synthesis of epitaxial oxide films, reactive off-axis sputtering deposition techniques have demonstrated the advantages of fabricating high quality epitaxial films. Due to the collisions between the sputtered species and the residue gases, the kinetic energy of species was reduced and the transport of depositing species changed from a ballistic movement to a diffusive drift in which the transport species were almost thermalized. A gravity effect could appear in the transport process. Three transport regimes were observed when the growth pressures vary from 5 mTorr to 150 mTorr. Film growth rate, depositing orientations, crystal structure, surface morphology, and compositions were characterized. A gravity related phenomenon was revealed in film growth at the relative low growth pressures.

  11. Sputter deposition of semiconductor superlattices for thermoelectric applications

    SciTech Connect

    Wagner, A.V.; Foreman, R.J.; Farmer, J.C.; Barbee, T.W.

    1996-11-01

    Theoretical dramatic improvement of the thermoelectric properties of materials by using quantum confinement in novel semiconductor nanostructures has lead to considerable interest in the thermoelectric community. Therefore, we are exploring the critical materials issues for fabrication of quantum confined structures by magnetron sputtering in the lead telluride and bismuth telluride families of materials. We have synthesized modulated structures from thermoelectric materials with bilayer periods of as little as 3.2 nm and shown that they are stable at deposition temperatures high enough to grow quality films. Issues critical to high quality film growth have been investigated such as nucleation and growth conditions and their effect on crystal orientation and growth morphology. These investigations show that nucleating the film at a temperature below the growth temperature of optimum electronic properties produces high quality films. Our work with sputter deposition, which is inherently a high rate deposition process, builds the technological base necessary to develop economical production of these advanced materials. High deposition rate is critical since, even if efficiencies comparable with CFC based refrigeration systems can be achieved, large quantities of quantum confined materials will be necessary for cost-competitive uses.

  12. Damage mechanisms in thin film solar cells during sputtering deposition of transparent conductive coatings

    SciTech Connect

    Fan Qihua; Liao Xianbo; Deng, Michael; Deng Xunming

    2009-02-01

    Amorphous silicon (a-Si) based thin film solar cell grown on flexible stainless steel substrate is one of the most promising energy conversion devices in the future. This type of solar cell uses a transparent conductive oxide (TCO) film as top electrode. It has been a widely accepted opinion that the radio frequency sputtering deposition of the TCO film produces a higher yield than direct current sputtering, and the reason is not clear. Here we show that the damage to the solar cell during the sputtering process is caused by a reverse bias applied to the n-i-p junction. This reverse bias is related to the characteristics of plasma discharge. The mechanism we reveal may significantly affect the solar cell process.

  13. Sputter-induced cross-contamination in analytical AES and XPS instrumentation: utilization of the effect for the in situ deposition of ultrathin functional layers.

    PubMed

    Scheithauer, Uwe

    2013-09-01

    Cross-contamination is observed on sample surfaces by Auger electron spectroscopy and X-ray photoelectron spectroscopy if multiple samples are mounted on one sample holder and a neighbouring sample was sputter depth profiling. During sputter depth profiling, sputtered material is deposited on inner surfaces of the instrument. In a secondary sputter process, which is due to species leaving the primary sputter target with higher kinetic energy, the previously deposited material is transported from the inner surfaces to the other samples mounted on the sample holder. This reflective sputtering is utilized to deposit ultrathin layers on sample surfaces for X-ray photoelectron spectroscopy binding energy referencing purposes and to build up ultrathin conductive layers to make possible Auger electron spectroscopy measurements on insulating samples. PMID:23462980

  14. Modeling the reactive sputter deposition of Ti-doped VOx thin films

    NASA Astrophysics Data System (ADS)

    Wang, Tao; Yu, He; Gu, De-En; Guo, Rui; Dong, Xiang; Jiang, Ya-Dong; Wu, Rui-Lin

    2015-06-01

    In this paper an original numerical model, based on the standard Berg model, is used to simulate the growth mechanism of Ti-doped VOx deposited with changing oxygen flow during reactive sputtering deposition. Ti-doped VOx thin films are deposited using a V target with Ti inserts. The effects of titanium inserts on the discharge voltage, deposition rate, and the ratio of V/Ti are investigated. By doping titanium in the vanadium target, the average sputtering yield decreases. In this case, the sputter erosion reduces, which is accompanied by a reduction in the deposition rate. The ratio between V content and Ti content in the film is measured using energy-dispersive x-ray spectroscopy (EDX). A decrease in the vanadium concentration with the increasing of the oxygen flow rate is detected using EDX. Results show a reasonable agreement between numerical and experimental data. Project partially supported by the National Natural Science Foundation of China (Grant Nos. 61405027, 61421002, and 61235006) and the Postdoctoral Science Foundation of China (Grant No. 2014M562296).

  15. Ion beam sputter deposition of TiNi shape memory alloy thin films

    NASA Astrophysics Data System (ADS)

    Davies, Sam T.; Tsuchiya, Kazuyoshi

    1999-08-01

    The development of functional or smart materials for integration into microsystem is of increasing interest. An example is the shape memory effect exhibited by certain metal alloys which, in principle, can be exploited in the fabrication of micro-scale manipulators or actuators, thereby providing on-chip micromechanical functionality. We have investigated an ion beam sputter deposition process for the growth of TiNi shape memory alloy thin films and demonstrated the required control to produce equiatomic composition, uniform coverage and atomic layer-by-layer growth rates on engineering surfaces. The process uses argon ions at intermediate energy produced by a Kaufman-type ion source to sputter non-alloyed targets of high purity titanium and nickel. Precise measurements of deposition rates allows compositional control during thin film growth. As the sputtering targets and substrates are remote from the discharge plasma, deposition occurs under good vacuum of approximately 10-6 mtorr thus promoting high quality films. Furthermore, the ion beam energetics allow deposition at relatively low substrate temperatures of < 150 degrees C with as-deposited films exhibiting shape memory properties without post-process high temperature annealing. Thermal imagin is used to monitor changes which are characteristic of the shape memory effect and is indicative of changes in specific heat capacity and thermal conductivity as the TiNi shape memory alloy undergoes martensitic to austenitic phase transformations.

  16. Industry-relevant magnetron sputtering and cathodic arc ultra-high vacuum deposition system for in situ x-ray diffraction studies of thin film growth using high energy synchrotron radiation.

    PubMed

    Schroeder, J L; Thomson, W; Howard, B; Schell, N; Näslund, L-Å; Rogström, L; Johansson-Jõesaar, M P; Ghafoor, N; Odén, M; Nothnagel, E; Shepard, A; Greer, J; Birch, J

    2015-09-01

    We present an industry-relevant, large-scale, ultra-high vacuum (UHV) magnetron sputtering and cathodic arc deposition system purposefully designed for time-resolved in situ thin film deposition/annealing studies using high-energy (>50 keV), high photon flux (>10(12) ph/s) synchrotron radiation. The high photon flux, combined with a fast-acquisition-time (<1 s) two-dimensional (2D) detector, permits time-resolved in situ structural analysis of thin film formation processes. The high-energy synchrotron-radiation based x-rays result in small scattering angles (<11°), allowing large areas of reciprocal space to be imaged with a 2D detector. The system has been designed for use on the 1-tonne, ultra-high load, high-resolution hexapod at the P07 High Energy Materials Science beamline at PETRA III at the Deutsches Elektronen-Synchrotron in Hamburg, Germany. The deposition system includes standard features of a typical UHV deposition system plus a range of special features suited for synchrotron radiation studies and industry-relevant processes. We openly encourage the materials research community to contact us for collaborative opportunities using this unique and versatile scientific instrument. PMID:26429486

  17. Molecular dynamics simulation of gold cluster growth during sputter deposition

    NASA Astrophysics Data System (ADS)

    Abraham, J. W.; Strunskus, T.; Faupel, F.; Bonitz, M.

    2016-05-01

    We present a molecular dynamics simulation scheme that we apply to study the time evolution of the self-organized growth process of metal cluster assemblies formed by sputter-deposited gold atoms on a planar surface. The simulation model incorporates the characteristics of the plasma-assisted deposition process and allows for an investigation over a wide range of deposition parameters. It is used to obtain data for the cluster properties which can directly be compared with recently published experimental data for gold on polystyrene [M. Schwartzkopf et al., ACS Appl. Mater. Interfaces 7, 13547 (2015)]. While good agreement is found between the two, the simulations additionally provide valuable time-dependent real-space data of the surface morphology, some of whose details are hidden in the reciprocal-space scattering images that were used for the experimental analysis.

  18. Rhodium coated mirrors deposited by magnetron sputtering for fusion applications.

    PubMed

    Marot, L; De Temmerman, G; Oelhafen, P; Covarel, G; Litnovsky, A

    2007-10-01

    Metallic mirrors will be essential components of all optical spectroscopy and imaging systems for ITER plasma diagnostics. Any change in the mirror performance, in particular, its reflectivity, due to erosion of the surface by charge exchange neutrals or deposition of impurities will influence the quality and reliability of the detected signals. Due to its high reflectivity in the visible wavelength range and its low sputtering yield, rhodium appears as an attractive material for first mirrors in ITER. However, the very high price of the raw material calls for using it in the form of a film deposited onto metallic substrates. The development of a reliable technique for the preparation of high reflectivity rhodium films is therefore of the highest importance. Rhodium layers with thicknesses of up to 2 microm were produced on different substrates of interest (Mo, stainless steel, Cu) by magnetron sputtering. Produced films exhibit a low roughness and crystallite size of about 10 nm with a dense columnar structure. No impurities were detected on the surface after deposition. Scratch tests demonstrate that adhesion properties increase with substrate hardness. Detailed optical characterizations of Rh-coated mirrors as well as results of erosion tests performed both under laboratory conditions and in the TEXTOR tokamak are presented in this paper. PMID:17979419

  19. Rhodium coated mirrors deposited by magnetron sputtering for fusion applications

    SciTech Connect

    Marot, L.; De Temmerman, G.; Oelhafen, P.; Covarel, G.; Litnovsky, A.

    2007-10-15

    Metallic mirrors will be essential components of all optical spectroscopy and imaging systems for ITER plasma diagnostics. Any change in the mirror performance, in particular, its reflectivity, due to erosion of the surface by charge exchange neutrals or deposition of impurities will influence the quality and reliability of the detected signals. Due to its high reflectivity in the visible wavelength range and its low sputtering yield, rhodium appears as an attractive material for first mirrors in ITER. However, the very high price of the raw material calls for using it in the form of a film deposited onto metallic substrates. The development of a reliable technique for the preparation of high reflectivity rhodium films is therefore of the highest importance. Rhodium layers with thicknesses of up to 2 {mu}m were produced on different substrates of interest (Mo, stainless steel, Cu) by magnetron sputtering. Produced films exhibit a low roughness and crystallite size of about 10 nm with a dense columnar structure. No impurities were detected on the surface after deposition. Scratch tests demonstrate that adhesion properties increase with substrate hardness. Detailed optical characterizations of Rh-coated mirrors as well as results of erosion tests performed both under laboratory conditions and in the TEXTOR tokamak are presented in this paper.

  20. Orientation Effects in ZnO Films Using Off-Axis Sputtering Deposition

    NASA Technical Reports Server (NTRS)

    Zhu, Shen; Su, Ching-Hua; Lehoczky, S.; George, M. A.

    1999-01-01

    ZnO is a wide-band-gap oxide material and has been used in numerous applications. It is also a good substrate for fabricating GaN-based (a blue laser candidate) devices. Off-axis sputtering technique is one of the best techniques in synthesizing oxide materials because negative ion bombardment and particle kinetic energy is greatly reduced when adatoms condense on substrates. Since the sputtered material from the target arrive on the substrate surface at a 90 deg. configuration, which differs from the normal sputtering geometry, it is expected that the film uniformity and composition distributions will be affected. However, the details of these properties and mechanisms have not been well studied. ZnO films are synthesized on (0001) sapphire and quartz substrates by off-axis sputtering deposition in various oxygen/argon mixture ratios and pressures at different temperatures. Substrates and sputtering sources are placed at three different orientations that are orthogonal to each other. The normal direction of a substrate is parallel to the gravity vector and the other is perpendicular to it. Film thickness profiles at different growth orientations are determined using a profimeter. All films grown at high temperatures have highly textured structures on quartz substrates and epitaxially grow on sapphire substrates. Because of this process, the film surface is very smooth. X-ray diffraction, scanning probe microscopy, and Fourier transfer infrared spectroscopy, and electrical measurements will be used to characterize these films. Detailed results will be discussed in the presentation.

  1. Characterization of Niobium Oxide Films Deposited by High Target Utilization Sputter Sources

    SciTech Connect

    Chow, R; Ellis, A D; Loomis, G E; Rana, S I

    2007-01-29

    High quality, refractory metal, oxide coatings are required in a variety of applications such as laser optics, micro-electronic insulating layers, nano-device structures, electro-optic multilayers, sensors and corrosion barriers. A common oxide deposition technique is reactive sputtering because the kinetic mechanism vaporizes almost any solid material in vacuum. Also, the sputtered molecules have higher energies than those generated from thermal evaporation, and so the condensates are smoother and denser than those from thermally-evaporated films. In the typical sputtering system, target erosion is a factor that drives machine availability. In some situations such as nano-layered capacitors, where the device's performance characteristics depends on thick layers, target life becomes a limiting factor on the maximizing device functionality. The keen interest to increase target utilization in sputtering has been addressed in a variety of ways such as target geometry, rotating magnets, and/or shaped magnet arrays. Also, a recent sputtering system has been developed that generates a high density plasma, directs the plasma beam towards the target in a uniform fashion, and erodes the target in a uniform fashion. The purpose of this paper is to characterize and compare niobia films deposited by two types of high target utilization sputtering sources, a rotating magnetron and a high density plasma source. The oxide of interest in this study is niobia because of its high refractive index. The quality of the niobia films were characterized spectroscopically in optical transmission, ellipsometrically, and chemical stoichiometry with X-ray photo-electron spectroscopy. The refractive index, extinction coefficients, Cauchy constants were derived from the ellipsometric modeling. The mechanical properties of coating density and stress are also determined.

  2. Electrochromic lithium nickel oxide by pulsed laser deposition and sputtering

    SciTech Connect

    Rubin, M.; Wen, S.J.; Richardson, T.; Kerr, J.; Rottkay, K. von; Slack, J.

    1996-09-01

    Thin films of lithium nickel oxide were deposited by sputtering and pulsed laser deposition (PLD) from targets of pressed LiNiO{sub 2} powder. The composition and structure of these films were analyzed using a variety of techniques, such as nuclear-reaction analysis, Rutherford backscattering spectrometry (RBS), x-ray diffraction, infrared spectroscopy, and atomic force microscopy. Crystalline structure, surface morphology and chemical composition of Li{sub x}Ni{sub 1{minus}x}O thin films depend strongly on deposition oxygen pressure, temperature as well as substrate-target distance. The films produced at temperatures lower than 600 C spontaneously absorb CO{sub 2} and H{sub 2}O at their surface once they are exposed to the air. The films deposited at 600 C proved to be stable in air over a long period. Even at room temperature the PLD films are denser and more stable than sputtered films. RBS determined the composition of the best films to be Li{sub 0.5}Ni{sub 0.5}O deposited by PLD at 60 mTorr O{sub 2} pressure. Electrochemical tests show that the films exhibit excellent reversibility in the range 1.0 V to 3.4 V versus lithium. Electrochemical formatting which is used to develop electrochromism in other films is not needed for the stoichiometric films. The optical transmission range is almost 70% at 550 nm for 150-nm thick films. Devices made from these films were analyzed using novel reference electrodes and by disassembly after cycling.

  3. Ion beam sputter deposition of V 2O 5 thin films

    NASA Astrophysics Data System (ADS)

    Gallasch, T.; Stockhoff, T.; Baither, D.; Schmitz, G.

    V 2O 5 thin films were deposited by means of dc-ion beam sputtering. To determine the influence of various deposition parameters, samples were characterized by X-ray diffractometry and transmission electron microscopy. Using electron energy loss spectroscopy, the oxidation state of vanadium was quantified based on the chemical shift of absorption edges. Measurement of in-plane direct current showed that the electronic conductivity varies over several orders of magnitude depending on the preparation conditions. The desired structure suitable for battery applications is achieved by sputtering under partial pressure of oxygen and suitable post-annealing under ambient atmosphere. Reversible intercalation of Li into the produced thin films was demonstrated.

  4. Tungsten coatings deposited on CFC tiles by the combined magnetron sputtering and ion implantation technique

    NASA Astrophysics Data System (ADS)

    Ruset, C.; Grigore, E.; Maier, H.; Neu, R.; Li, X.; Dong, H.; Mitteau, R.; Courtois, X.

    2007-03-01

    Combined magnetron sputtering and ion implantation (CMSII) is a deposition technique involving simultaneous magnetron sputtering and high energy ion bombardment of the coating during its growth. A high voltage pulse discharge (U=40 kV, τ=20 μs, f=25 Hz) is superposed over the magnetron deposition and in this way, positive ions are accelerated to the components to be coated, bombarding initially the substrate and then the coating itself. In the framework of the ITER-like wall project this method was applied to produce nanostructured W coatings on the carbon fibre composite (CFC) substrate. These coatings have been characterized in terms of adhesion, thickness, structure and resistance to high thermal loads (up to 23.5 MW m-2). Based on the results of these tests, which are presented in this paper, CMSII technology was selected for coating about 1100 tiles with a 10 μm tungsten layer for the JET first wall and divertor.

  5. Low Energy Sputtering Experiments for Ion Engine Lifetime Assessment

    NASA Technical Reports Server (NTRS)

    Duchemin Olivier B.; Polk, James E.

    1999-01-01

    The sputtering yield of molybdenum under xenon ion bombardment was measured using a Quartz Crystal Microbalance. The measurements were made for ion kinetic energies in the range 100-1keV on molybdenum films deposited by magnetron sputtering in conditions optimized to reproduce or approach bulk-like properties. SEM micrographs for different anode bias voltages during the deposition are compared, and four different methods were implemented to estimate the density of the molybdenum films. A careful discussion of the Quartz Crystal Microbalance is proposed and it is shown that this method can be used to measure mass changes that are distributed unevenly on the crystal electrode surface, if an analytical expression is known for the differential mass-sensitivity of the crystal and the erosion profile. Finally, results are presented that are in good agreement with previously published data, and it is concluded that this method holds the promise of enabling sputtering yield measurements at energies closer to the threshold energy in the very short term.

  6. Solid-solution CrCoCuFeNi high-entropy alloy thin films synthesized by sputter deposition

    DOE PAGESBeta

    An, Zhinan; Jia, Haoling; Wu, Yueying; Rack, Philip D.; Patchen, Allan D.; Liu, Yuzi; Ren, Yang; Li, Nan; Liaw, Peter K.

    2015-05-04

    The concept of high configurational entropy requires that the high-entropy alloys (HEAs) yield single-phase solid solutions. However, phase separations are quite common in bulk HEAs. A five-element alloy, CrCoCuFeNi, was deposited via radio frequency magnetron sputtering and confirmed to be a single-phase solid solution through the high-energy synchrotron X-ray diffraction, energy-dispersive spectroscopy, wavelength-dispersive spectroscopy, and transmission electron microscopy. The formation of the solid-solution phase is presumed to be due to the high cooling rate of the sputter-deposition process.

  7. Effect of process conditions on the microstructural formation of dc reactively sputter deposited AlN

    SciTech Connect

    Ekpe, Samuel D.; Jimenez, Francisco J.; Dew, Steven K.

    2010-09-15

    Thin film aluminum nitride (AlN), because of its attractive properties, is a material with many applications. Its microstructure and hence properties are greatly influenced by the deposition process conditions. In this work, AlN was reactively deposited in a dc magnetron sputtering system at different proportions of nitrogen in the process gas mixture and at different process conditions. The microstructure and composition of the films were analyzed using x-ray diffraction data, energy dispersive spectroscopy, and scanning electron microscopy. Results show that for a process gas pressure of 0.67 Pa, a magnetron power of 100 W, and a substrate-target distance of 10 cm, a near stoichiometeric AlN can be prepared at nitrogen proportions as low as 20%. At these process conditions, (002) was the preferred crystal orientation. Dense fibrous structures were obtained, especially at low deposition rates with high proportions of nitrogen. Increase in magnetron power and decrease in distance result in a more porous structure. High kinetic energies (average) of the sputtered Al particles and high deposition rates tend to favor AlN(101) formation, while low kinetic energies of the Al particles and low deposition rates generally favor more of the AlN(100) formation.

  8. Strontium-substituted hydroxyapatite coatings deposited via a co-deposition sputter technique.

    PubMed

    Boyd, A R; Rutledge, L; Randolph, L D; Meenan, B J

    2015-01-01

    The bioactivity of hydroxyapatite (HA) coatings can be modified by the addition of different ions, such as silicon (Si), lithium (Li), magnesium (Mg), zinc (Zn) or strontium (Sr) into the HA lattice. Of the ions listed here, strontium substituted hydroxyapatite (SrHA) coatings have received a lot of interest recently as Sr has been shown to promote osteoblast proliferation and differentiation, and reduce osteoclast activity. In this study, SrHA coatings were deposited onto titanium substrates using radio frequency (RF) magnetron co-sputtering (and compared to those surfaces deposited from HA alone). FTIR, XPS, XRD, and SEM techniques were used to analyse the different coatings produced, whereby different combinations of pure HA and 13% Sr-substituted HA targets were investigated. The results highlight that Sr could be successfully incorporated into the HA lattice to form SrHA coatings. It was observed that as the number of SrHA sputtering targets in the study were increased (increasing Sr content), the deposition rate decreased. It was also shown that as the Sr content of the coatings increased, so did the degree of preferred 002 orientation of the coating (along with obvious changes in the surface morphology). This study has shown that RF magnetron sputtering (specifically co-sputtering), offers an appropriate methodology to control the surface properties of Sr-substituted HA, such as the crystallinity, stoichiometry, phase purity and surface morphology. PMID:25491990

  9. Physics of arcing, and implications to sputter deposition

    SciTech Connect

    Anders, Andre

    2003-12-15

    Arcing is a well-known, unwanted discharge regime observed on the surface of sputtering targets. The discharge voltage breaks down to less than 50 V while the current jumps to elevated levels. Arcing is unwanted because it prevents uniform deposition and creates particulates. The issue of arcing has been dealt with by target surface conditioning and by using modern power supplies that have arc suppression incorporated. With increasing quality requirements in terms of uniformity of coatings, and absence of particulates, especially for electrochromic and other advanced coatings applications, the issue of arcing warrants a closer examination with the goal to find other, physics-based, and hopefully better approaches of arcing prevention. From a physics point of view, the onset of arcing is nothing else than the transition of the discharge to a cathodic arc mode, which is characterized by the ignition of non-stationary arc spots. Arc spots operate by a sequence of microexplosions, enabling explosive electron emission, as opposed to secondary electron emission. Arc spots and their fragments have a size distribution in the micrometer and sub-micrometer range, and a characteristic time distribution that has components shorter than microseconds. Understanding the ignition conditions of arc spots are of central physical interest. Spot ignition is associated with electric field enhancement, which can be of geometric nature (roughness,particles), or chemical nature (e.g. oxide formation) and related local accumulation of surface charge. Therefore, it is clear that these issues are of particular concern when operating with high-density plasmas, such as in high-power pulsed sputtering, and when using reactive sputter gases.

  10. Low-damage high-throughput grazing-angle sputter deposition on graphene

    SciTech Connect

    Chen, C.-T.; Gajek, M.; Raoux, S.; Casu, E. A.

    2013-07-15

    Despite the prevalence of sputter deposition in the microelectronics industry, it has seen very limited applications for graphene electronics. In this letter, we report systematic investigation of the sputtering induced damages in graphene and identify the energetic sputtering gas neutrals as the primary cause of graphene disorder. We further demonstrate a grazing-incidence sputtering configuration that strongly suppresses fast neutral bombardment and retains graphene structure integrity, creating considerably lower damage than electron-beam evaporation. Such sputtering technique yields fully covered, smooth thin dielectric films, highlighting its potential for contact metals, gate oxides, and tunnel barriers fabrication in graphene device applications.

  11. Sputter-deposited Be ablators for NIF target capsules

    SciTech Connect

    McEachern, R.; Clford, C.; Cook, R.; Makowiecki, E.; Wallace, R.

    1997-03-26

    We have performed a series of preliminary experiments to determine whether sputter deposition of doped Be is a practical route to producing NIF target capsules with Be ablators. Films ranging in thickness from 7 to {approximately} 120 {micro}m have been deposited on spherical polymer mandrels using a bounce pan to ensure uniform coating. With no voltage bias applied to the pan, relatively porous coatings were formed that were highly permeable to hydrogen. The surface finish of these films ranged from {approximately}250 nm rms for 13-{micro}m-thick films to a minimum of {approximately}75 nm rms for an 80-{micro}m-thick film. Application of a voltage bias was found to significantly modify the film morphology. At a bias of 120 V, 7-{micro}m-thick films with a dense, fine-grained microstructure were produced. These capsules had a reflective surface with a 50 nm rms roughness. Finally, to demonstrate the ability to produce a graded dopant profile, a coating was produced in which the concentration of added Cu was varied from 2.5 atom % at the beginning to zero after 40 {micro}m of deposition.

  12. Effects of nitrogen pulsing on sputter-deposited beryllium films

    SciTech Connect

    Hsieh, E.J.; Price, C.W.; Pierce, E.L.; Wirtenson, G.R.

    1989-08-09

    Beryllium films have been used as a heat sink'' layer between the reflective coating of a mirror and its glass substrate to improve the mirror's radiation resistance to prompt deposition of x-rays. Under x-ray irradiation, the beryllium heat sink'' layer is subjected to tensile stresses caused by differences in thermal expansion coefficients. Test results indicated that the predominant failure mode was the film's crazing under tensile stress. The inherent columnar structure of the beryllium films deposited under normal conditions in detrimental to the tensile strength of the films and may be responsible for this type of failure. We successfully suppressed the inherent columnar growth in beryllium films by incorporating periodic N{sub 2} pulses during sputter deposition. Quantitative analyses were conducted for nitrogen and oxygen contamination in the beryllium films using standards prepared by ion implantation. Secondary ion mass spectroscopy (SIMS) depth profiles were obtained for oxygen and nitrogen using mass isotopes {sup 16}O and 23({sup 9}Be + {sup 14}N).

  13. Sputtering deposition of aluminium molybdenum alloy thin film anodes for thin film microbatteries

    NASA Astrophysics Data System (ADS)

    Thirumoolam, Mani Chandran; Sivaramakrishnan, Balaji; Devarajan, Mutharasu

    2015-05-01

    Al5Mo thin film anodes for Li-ion batteries were prepared using DC sputtering under different conditions, the latter being specified as deposition at room temperature (S0), deposition at 300°C (S1), and deposition at room temperature followed by thermal annealing at 300°C (S2). The thin films were deposited using an aluminum target tiled with molybdenum discs at a ratio calculated based on the theoretical sputtering yields. The structural and compositional analyses performed with x-ray diffraction (XRD) and energy-dispersive x-ray spectroscopy (EDX) confirmed the Al5Mo compound formation and the Al/Mo elemental ratio, respectively. The compound formation was observed to be evident only for the thin films subjected to heat treatment during or after deposition. Scanning electron micrographs reveal a higher porosity of approximately 23% for sample S0 and a lower porosity of around 18% for sample S1. The chronopotentiometry results show a higher volumetric specific capacity of approximately 197 mAh/cm3 for sample S1. Capacity increments have been observed for all samples upon charge-discharge cycles, whose values after 25 cycles for samples S0, S1, and S2 were 41.2%, 20.4%, and 21.1%, respectively. [Figure not available: see fulltext.

  14. Effects of nitrogen pulsing on sputter-deposited beryllium films

    SciTech Connect

    Hsieh, E.J.; Price, C.W.; Pierce, E.L.; Wirtenson, R.G. )

    1990-05-01

    Beryllium films have been used as a heat sink'' layer between the reflective coating of a mirror and its glass substrate to improve the mirror's radiation resistance to prompt deposition of x rays. Under x-ray irradiation, the beryllium heat sink layer is subjected to tensile stresses caused by differences in thermal expansion coefficients. Test results indicated that the predominant failure mode was the film's crazing under tensile stress. The inherent columnar structure of the beryllium films deposited under normal conditions is detrimental to the tensile strength of the films and may be responsible for this type of failure. We successfully suppressed the inherent columnar growth in beryllium films by incorporating periodic N{sub 2} pulses during sputter deposition. The traditional substrate biasing approach did not seem to be as effective in modifying the grain structure. The results showed that higher N{sub 2} pulse rates during deposition were more effective in suppressing the columnar growth. However, we noticed that films deposited with nitrogen pulsing show higher secondary-electron emission in SEM micrographs, which indicates a significant incorporation of contaminants into the beryllium films. Quantitative analyses were conducted for nitrogen and oxygen contamination in the beryllium films using standards prepared by ion implantation. Secondary ion mass spectroscopy (SIMS) depth profiles were obtained for oxygen and nitrogen using mass isotopes {sup 16}O and 23({sup 9}Be+{sup 14}N). More than 2% of contaminants was observed in beryllium films at the higher pulse rates that were used. Thus, a minimum pulsing frequency and duration should be selected that provides grain refinement with a minimum amount of contamination.

  15. Controlling ion fluxes during reactive sputter-deposition of SnO{sub 2}:F

    SciTech Connect

    Jäger, Timo Romanyuk, Yaroslav E.; Tiwari, Ayodhya N.; Anders, André

    2014-07-21

    Magnetron sputtering of fluorine-doped tin oxide (FTO) is a scalable deposition method for large-area transparent conducting films used in fenestration, photovoltaics, and other applications. The electrical conductivity of sputtered FTO is, however, lower than that of spray-pyrolized FTO because of the ion damage induced by high energy ions leading to a reduction of the crystal quality in sputtered FTO films. In this study, various ion species present during the reactive sputtering of a metallic tin target in a mixed Ar/O{sub 2}/CF{sub 4} atmosphere are systematically characterized by energy and mass spectrometry, and possible ways of controlling the ion fluxes are explored. Ion energy distribution functions (IEDFs) of the negative ions F{sup −} and O{sup −} exhibit large peaks at an energy corresponding to the full target voltage. Although the applied partial pressure of CF{sub 4} is about 1/30 than that of O{sub 2}, the obtained IEDFs of F{sup −} and O{sup −} have comparable peak height, which can be attributed to a higher electronegativity of F. The IEDFs of positively charged O{sup +}, O{sub 2}{sup +}, Ar{sup +}, and Sn{sup +} species have their peaks around 2–8 eV. To control ion fluxes a solenoid or permanent magnets were placed between the target and the mass spectrometer. The flux of positive ions could be varied by several orders of magnitude as a function of the applied current through the solenoid, whereas the high-energy (>100 eV) negative F{sup −} and O{sup −} ions were not notably deflected. By using permanent magnets with the B-field orthogonal to the ion trajectory, the flux of O{sup −} ions could be decreased by two orders and the exposure to the high-energy F{sup −} ions was completely suppressed.

  16. Thin-film CdTe photovoltaic cells by laser deposition and rf sputtering

    NASA Astrophysics Data System (ADS)

    Compaan, A.; Bohn, R. G.; Bhat, A.; Tabory, C.; Shao, M.; Li, Y.; Savage, M. E.; Tsien, L.

    1992-12-01

    Laser-driven physical vapor deposition (LDPVD) and radio-frequency (rf) sputtering have been used to fabricate thin-film solar cells on SnO2-coated glass substrates. The laser-ablation process readily permits the use of several target materials in the same vacuum chamber and complete solar cell structures have been fabricated on SnO2-coated glass using LDPVD for the CdS, CdTe, and CdCl2. To date the best devices (˜9% AM1.5) have been obtained after a post-deposition anneal at 400 °C. In addition, cells have been fabricated with the combination of LDPVD CdS, rf-sputtered CdTe, and LDPVD CdCl2. The performance of these cells indicates considerable promise for the potential of rf sputtering for CdTe photovoltaic devices. The physical mechanisms of LDPVD have been studied by transient optical spectroscopy on the laser ablation plume. These measurements have shown that, e.g., Cd is predominantly in the neutral atomic state in the plume but with a large fraction which is highly excited internally (≥6 eV) and that the typical neutral Cd translational kinetic energies perpendicular to the target are 20 eV and greater. Quality of as-grown and annealed films has been analyzed by optical absorption. Raman scattering, photoluminescence, electrical conductivity, Hall effect, x-ray diffraction, and SEM/EDS.

  17. Synthesis of sputtered thin films in low energy ion beams

    NASA Astrophysics Data System (ADS)

    Howson, R. P.

    1997-01-01

    Magnetron sputtering is a process which gives a highly energetic depositing species. The growing film can be further bombarded with ions of the heavy gas used for sputtering by directing a plasma of it onto the surface. This can be done quite simply by using an unbalanced magnetron. The immersion of an insulating or isolated substrate-film combination in this plasma leads to a self-bias of around 30 V appearing on it's surface and a bombardment of low energy ions of the sputtering gas of several milli-amps per square centimetre. If the residual gas contains a reactive component, to form a compound film, then the gas is made much more reactive and less is needed to form the stoichiometric film. This can take place in a continuously operating system made stable using partial pressure control of the reactive gas with plasma emission monitoring or something similar. It can also be operated when the process of deposition is separated in time from the process of reaction and is repeated to build the film. We have called this process successive-plasma-anodisation (SPA) and it can be achieved by mechanically transferring the substrate between two magnetrons, one to deposit the metal film and one, which is unbalanced, to provide an oxygen plasma. It can also be operated by pulsing the reactive gas under carefully controlled conditions. Examples are given of the synthesis of compound films using low energy ion bombardment with these techniques and it is demonstrated that excellent films of a large range of oxides and nitrides can be made.

  18. Thermochromic VO2 thin films deposited by magnetron sputtering for smart window applications

    NASA Astrophysics Data System (ADS)

    Fortier, Jean-Philippe

    "Smart" windows are a perfect innovative example of technology that reduces our energy dependence and our impact on the environment while saving on the economical point of view. With the use of vanadium dioxide (VO2), a thermochromic compound, and this, as a thin coating, it would in fact be possible to control the sun's transmission of infrared light (heat) as a function of the surrounding environment temperature. In other words, its optical behavior would allow a more effective management of heat exchanges between a living venue and the outdoor environment. However, this type of window is still in a developmental stage. First, the oxide's deposition is not simple in nature. Based on a conventional deposition technique called magnetron sputtering mainly used in the fenestration industry, several factors such as the oxygen concentration and the substrate temperature during deposition can affect the coating's thermochromic behavior, and this, by changing its composition and crystallinity. Other control parameters such as the deposition rate, the pressure in the sputtering chamber and the choice of substrate may also modify the film microstructure, thereby varying its optical and electrical properties. In addition, several issues still persist as to its commercial application. For starters, the material's structural transition, related to the change of its optical properties, only occurs around 68°C. In addition, its low transparency and natural greenish colour are not visually appealing. Then, to this day, the deposition temperature required to crystallize and form the thermochromic oxide remains an obstacle for a possible large-scale application. Ultimately, although the material's change in temperature has been shown to be advantageous in situations of varying climate, the existing corrective solutions to these issues generate a deterioration of the thermochromic behavior. With no practical expertise on the material, this project was undertaken with certain

  19. Magnetic thin film deposition with pulsed magnetron sputtering: deposition rate and film thickness distribution

    NASA Astrophysics Data System (ADS)

    Ozimek, M.; Wilczyński, W.; Szubzda, B.

    2016-02-01

    The goal of conducted study was an experimental determining the relations between technological parameters of magnetron sputtering process on deposition rate (R) and thickness uniformity of magnetic thin films. Planar Ni79Fei6Mo5 target with a diameter of 100 mm was sputtered in argon (Ar) atmosphere. Deposition rate was measured in a function of gas pressure, target power and target-substrate distance. The highest value of R≈280 nmmin-1. The obtained results in deposition rate of magnetic film were compared to deposition rate of cooper (Cu), aluminum (Al), titanium (Ti) and titanium oxide (TiOx) and the deposition rate of Ni-Fe alloy were higher that Al and Ti. The film thickness distribution was measured for radial distance from the target centre ranging up to 60 mm and target-substrate distance ranging form 70 to 115 mm. Among others it was stated that for the larger value of target-substrate distance the larger uniform of film thickness are obtained.

  20. Low target power wafer sputtering regime identified during magnetron tantalum barrier physical vapor deposition

    SciTech Connect

    Stout, Phillip J.; Denning, Dean J.; Michaelson, Lynne M.; Bagchi, Sandeep; Zhang Da; Ventzek, Peter L. G.

    2005-07-15

    A wafer sputtering regime has been identified during tantalum barrier deposition using a magnetron physical vapor deposition (MPVD) tool. The MPVD tools are designed to operate at high target powers (tens of kW) where the highly directed energetic metal (athermal metal) is the dominant metal species incident on the wafer. Although athermal metal gives better coverage than neutral metal (thermal) due to the narrower range of incident strike angles to the wafer, shadowing by the feature geometries is still a concern. Having available a wafer sputter regime or 'resputter' regime in a PVD tool allows for redistribution of metal from horizontal surfaces in the feature exposed to the plasma to vertical surfaces in the feature. The key in obtaining a wafer sputter regime is the operation of the plasma source in a range that the wafer bias power is effective at generating a sufficient self-bias for sputtering to occur. Discussed are modeling results which predict the wafer sputtering regime and the experimental confirmation that the low target power wafer sputter regime exists. The identified sputter regime in MPVD is such that there is a net deposition of metal at the field. Metal thickness reduction does occur at the trench and via bottoms where much of the unionized metal is being shadowed yielding a lower deposition to sputtering ratio compared to the field.

  1. Thermochromic VO2 thin films deposited by magnetron sputtering for smart window applications

    NASA Astrophysics Data System (ADS)

    Fortier, Jean-Philippe

    "Smart" windows are a perfect innovative example of technology that reduces our energy dependence and our impact on the environment while saving on the economical point of view. With the use of vanadium dioxide (VO2), a thermochromic compound, and this, as a thin coating, it would in fact be possible to control the sun's transmission of infrared light (heat) as a function of the surrounding environment temperature. In other words, its optical behavior would allow a more effective management of heat exchanges between a living venue and the outdoor environment. However, this type of window is still in a developmental stage. First, the oxide's deposition is not simple in nature. Based on a conventional deposition technique called magnetron sputtering mainly used in the fenestration industry, several factors such as the oxygen concentration and the substrate temperature during deposition can affect the coating's thermochromic behavior, and this, by changing its composition and crystallinity. Other control parameters such as the deposition rate, the pressure in the sputtering chamber and the choice of substrate may also modify the film microstructure, thereby varying its optical and electrical properties. In addition, several issues still persist as to its commercial application. For starters, the material's structural transition, related to the change of its optical properties, only occurs around 68°C. In addition, its low transparency and natural greenish colour are not visually appealing. Then, to this day, the deposition temperature required to crystallize and form the thermochromic oxide remains an obstacle for a possible large-scale application. Ultimately, although the material's change in temperature has been shown to be advantageous in situations of varying climate, the existing corrective solutions to these issues generate a deterioration of the thermochromic behavior. With no practical expertise on the material, this project was undertaken with certain

  2. A Magnetron Sputter Deposition System for the Development of Multilayer X-Ray Optics

    NASA Technical Reports Server (NTRS)

    Broadway, David; Ramsey, Brian; Gubarev, Mikhail

    2014-01-01

    The proposal objective is to establish the capability to deposit multilayer structures for x-ray, neutron, and EUV optic applications through the development of a magnetron sputtering deposition system. A specific goal of this endeavor is to combine multilayer deposition technology with the replication process in order to enhance the MSFC's position as a world leader in the design of innovative X-ray instrumentation through the development of full shell replicated multilayer optics. The development of multilayer structures is absolutely necessary in order to advance the field of X-ray astronomy by pushing the limit for observing the universe to ever increasing photon energies (i. e. up to 200 keV or higher); well beyond Chandra (approx. 10 keV) and NuStar's (approx. 75 keV) capability. The addition of multilayer technology would significantly enhance the X-ray optics capability at MSFC and allow NASA to maintain its world leadership position in the development, fabrication and design of innovative X-ray instrumentation which would be the first of its kind by combining multilayer technology with the mirror replication process. This marriage of these technologies would allow astronomers to see the universe in a new light by pushing to higher energies that are out of reach with today's instruments.To this aim, a magnetron vacum sputter deposition system for the deposition of novel multilayer thin film X-ray optics is proposed. A significant secondary use of the vacuum deposition system includes the capability to fabricate multilayers for applications in the field of EUV optics for solar physics, neutron optics, and X-ray optics for a broad range of applications including medical imaging.

  3. Reactive sputter deposition of alumina films on magnesium alloy by double cathode glow-discharge plasma technique

    SciTech Connect

    Zhou Chenghou; Xu Jiang; Jiang Shuyun

    2010-02-15

    In order to overcome the problem of the corrosion resistance of AZ31 magnesium alloy, the nanocrystalline Al{sub 2}O{sub 3} film was deposited on AZ31 magnesium alloy by double cathode glow-discharge plasma technique. The microstructure, chemical composition and elemental chemical state of the sputter-deposited nanocrystalline Al{sub 2}O{sub 3} film were analyzed by means of scanning electron microscopy equipped with an energy dispersive spectroscope, X-ray diffraction), transmission electron microscope and X-ray photoelectron spectroscopy. The results indicated that the sputter-deposited nanocrystalline Al{sub 2}O{sub 3} film consisted of single {theta}-Al{sub 2}O{sub 3} phase with average grain size about 60 nm. The hardness and the elastic modulus of the as-deposited nanocrystalline Al{sub 2}O{sub 3} film were about 17.21 GPa and 217 GPa measured by nanoindentation instrument, respectively. The corrosion behavior of the sputter-deposited nanocrystalline Al{sub 2}O{sub 3} film in 3.5%NaCl solution was investigated by potentiodynamic polarization and electrochemical impedance spectroscopy. The amount of porosity for the sputter-deposited nanocrystalline Al{sub 2}O{sub 3} film calculated by two electrochemical methods was equal to 0.0086% and 0.168%, respectively. The sputter-deposited nanocrystalline Al{sub 2}O{sub 3} film exhibited excellent corrosion resistance, which was attributed to its dense enough structure to prevent magnesium alloy from corrosion in aggressive solutions.

  4. Influence of the magnetron on the growth of aluminum nitride thin films deposited by reactive sputtering

    SciTech Connect

    Iriarte, G. F.

    2010-03-15

    Aluminum nitride (AlN) thin films deposited on high-vacuum systems without substrate heating generally exhibit a poor degree of c-axis orientation. This is due to the nonequilibrium conditions existing between the energy of the sputtered particles and the energy at the substrate surface. The application of substrate bias or substrate temperature is known to improve the adatom mobility by delivering energy to the substrate; both are hence well-established crystal growth promoting factors. It is well known that low sputtering pressures can be used as a parameter improving the growth of highly c-axis oriented aluminum nitride films at room temperature even without applying bias voltage to the substrate. Generally, the use of high pressures implies thermalization of particles within the gas phase and is considered to increase the energy gap between these and the substrate surface. However, in later experiments we have learned that the use of high processing pressures does not necessarily implies a detriment of crystallographic orientation in the films. By measuring (for the first time to the author's knowledge) the full width at half maximum value of the rocking curve of the 0002-AlN peak at several positions along the 100 mm diameter (100)-silicon wafers on which aluminum nitride thin films were deposited by reactive sputtering, a new effect was observed. Under certain processing conditions, the growth of the AlN thin films is influenced by the target magnetron. More precisely, their degree of c-axis orientation varies at wafer areas locally coincident under the target magnetron. This effect should be considered, especially where large area substrates are employed such as in silicon wafer foundry manufacturing processes.

  5. Properties of sputtered TiO2 thin films as a function of deposition and annealing parameters

    NASA Astrophysics Data System (ADS)

    Pjević, Dejan; Obradović, Marko; Marinković, Tijana; Grce, Ana; Milosavljević, Momir; Grieseler, Rolf; Kups, Thomas; Wilke, Marcus; Schaaf, Peter

    2015-04-01

    The influence of sputtering parameters and annealing on the structure and optical properties of TiO2 thin films deposited by RF magnetron sputtering is reported. A pure TiO2 target was used to deposit the films on Si(100) and glass substrates, and Ar/O2 gas mixture was used for sputtering. It was found that both the structure and the optical properties of the films depend on deposition parameters and annealing. In all cases the as-deposited films were oxygen deficient, which could be compensated by post-deposition annealing. Changes in the Ar/O2 mass flow rate affected the films from an amorphous-like structure for samples deposited without oxygen to a structure where nano-crystalline rutile phase is detected in those deposited with O2. Annealing of the samples yielded growth of both, rutile and anatase phases, the ratio depending on the added oxygen content. Increasing mass flow rate of O2 and annealing are responsible for lowering of the energy band gap values and the increase in refractive index of the films. The results can be interesting towards the development of TiO2 thin films with defined structure and properties.

  6. Supported plasma sputtering apparatus for high deposition rate over large area

    DOEpatents

    Moss, Ronald W.; McClanahan, Jr., Edwin D.; Laegreid, Nils

    1977-01-01

    A supported plasma sputtering apparatus is described having shaped electrical fields in the electron discharge region between the cathode and anode and the sputter region between the target and substrate while such regions are free of any externally applied magnetic field to provide a high deposition rate which is substantially uniform over a wide area. Plasma shaping electrodes separate from the anode and target shape the electrical fields in the electron discharge region and the sputter region to provide a high density plasma. The anode surrounds the target to cause substantially uniform sputtering over a large target area. In one embodiment the anode is in the form of an annular ring surrounding a flat target surface, such anode being provided with a ribbed upper surface which shields portions of the anode from exposure to sputtered material to maintain the electron discharge for a long stable operation. Several other embodiments accomplish the same result by using different anodes which either shield the anode from sputtered material, remove the sputtered coating on the anode by heating, or simultaneously mix sputtered metal from the auxiliary target with sputtered insulator from the main target so the resultant coating is conductive. A radio frequency potential alone or together with a D.C. potential, may be applied to the target for a greater sputtering rate.

  7. Accelerated life test of sputtering and anode deposit spalling in a small mercury ion thruster

    NASA Technical Reports Server (NTRS)

    Power, J. L.

    1975-01-01

    Tantalum and molybdenum sputtered from discharge chamber components during operation of a 5 centimeter diameter mercury ion thruster adhered much more strongly to coarsely grit blasted anode surfaces than to standard surfaces. Spalling of the sputtered coating did occur from a coarse screen anode surface but only in flakes less than a mesh unit long. The results were obtained in a 200 hour accelerated life test conducted at an elevated discharge potential of 64.6 volts. The test approximately reproduced the major sputter erosion and deposition effects that occur under normal operation but at approximately 75 times the normal rate. No discharge chamber component suffered sufficient erosion in the test to threaten its structural integrity or further serviceability. The test indicated that the use of tantalum-surfaced discharge chamber components in conjunction with a fine wire screen anode surface should cure the problems of sputter erosion and sputtered deposits spalling in long term operation of small mercury ion thrusters.

  8. Electrostatic quadrupole plasma mass spectrometer measurements during thin film depositions using simultaneous matrix assisted pulsed laser evaporation and magnetron sputtering

    SciTech Connect

    Hunter, C. N.; Check, M. H.; Muratore, C.; Voevodin, A. A.

    2010-05-15

    A hybrid plasma deposition process, combining matrix assisted pulsed laser evaporation (MAPLE) of carbon nanopearls (CNPs) with magnetron sputtering of gold was investigated for growth of composite films, where 100 nm sized CNPs were encapsulated into a gold matrix. Composition and morphology of such composite films was characterized with x-ray photoelectron spectroscopy, scanning electron microscopy, and transmission electron microscopy (TEM) analysis. Carbon deposits on a gold magnetron sputter target and carbon impurities in the gold matrices of deposited films were observed while codepositing from gold and frozen toluene-CNP MAPLE targets in pure argon. Electrostatic quadrupole plasma analysis was used to determine that a likely mechanism for generation of carbon impurities was a reaction between toluene vapor generated from the MAPLE target and the argon plasma originating from the magnetron sputtering process. Carbon impurities of codeposited films were significantly reduced by introducing argon-oxygen mixtures into the deposition chamber; reactive oxygen species such as O and O+ effectively removed carbon contamination of gold matrix during the codeposition processes. Increasing the oxygen to argon ratio decreased the magnetron target sputter rate, and hence hybrid process optimization to prevent gold matrix contamination and maintain a high sputter yield is needed. High resolution TEM with energy dispersive spectrometry elemental mapping was used to study carbon distribution throughout the gold matrix as well as embedded CNP clusters. This research has demonstrated that a hybrid MAPLE and magnetron sputtering codeposition process is a viable means for synthesis of composite thin films from premanufactured nanoscale constituents, and that cross-process contaminations can be overcome with understanding of hybrid plasma process interaction mechanisms.

  9. Low energy sputtering of cobalt by cesium ions

    NASA Technical Reports Server (NTRS)

    Handoo, A.; Ray, Pradosh K.

    1989-01-01

    An experimental facility to investigate low energy (less than 500 eV) sputtering of metal surfaces with ions produced by an ion gun is described. Results are reported on the sputtering yield of cobalt by cesium ions in the 100 to 500 eV energy range at a pressure of 1 times 10(exp -6) Torr. The target was electroplated on a copper substrate. The sputtered atoms were collected on a cobalt foil surrounding the target. Co-57 was used as a tracer to determine the sputtering yield.

  10. Size-dependent electrical conductivity of indium zinc oxide deposited by RF magnetron sputtering.

    PubMed

    Heo, Young-Woo; Pearton, S J; Norton, D P

    2012-04-01

    We investigated the size-dependent electrical conductivities of indium zinc oxide stripes with different widths from 50 nm to 4 microm and with the same thickness of 50 nm deposited by RF magnetron sputtering. The size of the indium zinc oxide stripes was controlled by e-beam lithography. The distance of the two Ti/Au Ohmic electrodes along the indium zinc oxide stripes was kept constant at 25 microm. The electrical conductivity decreased as the size of the indium zinc oxide stripes decreased below a critical width (80 nm). The activation energy, derived from the electric conductivity versus temperature measurement, was dependent on the dimensions of indium zinc oxide stripes. These results can be understood as stemming from surface charge trapping from the absorption of oxygen and/or water vapor, which leads to an increase in the energy difference between the conduction energy band and the Fermi energy. PMID:22849102

  11. Enhanced sputter yields of ion irradiated Au nano particles: energy and size dependence.

    PubMed

    Holland-Moritz, Henry; Scheeler, Sebastian; Stanglmair, Christoph; Pacholski, Claudia; Ronning, Carsten

    2015-08-14

    Hexagonally arranged Au nanoparticles exhibiting a broad Gaussian-shaped size distribution ranging from 30 nm to 80 nm were deposited on Si substrates and irradiated with Ar(+) and Ga(+) ions with various energies from 20 to 350 keV and 1 to 30 keV, respectively. The size and energy dependence of the sputter yield were measured using high-resolution scanning electron microscopy image analysis. These results were compared to simulation results obtained by iradina, a Monte Carlo code, which takes the specifics of the nano geometry into account. The experimental sputter yields are significantly higher than simulated sputter yields for both bulk and the nano geometry. The difference can be clearly attributed to thermally driven effects, which significantly increase the measured sputter yields. PMID:26201281

  12. Deposition of Tungsten Thin Films on Flexible Polymer Substrates by Direct-Current Magnetron Sputtering

    NASA Astrophysics Data System (ADS)

    Zhang, Rui; Huo, Zhenxuan; Jiao, Xiangquan; Zhong, Hui; Shi, Yu

    2015-11-01

    We have investigated thin tungsten films deposited on polymer substrates by direct-current magnetron sputtering under different conditions. Unlike tungsten films deposited on rigid substrates, films on polymer substrates grew at appropriate sputtering power, low sputtering pressure, and low substrate temperature. High sputtering power results in tungsten films with good crystal orientation, compact microstructure, and low electrical resistivity. However, high-power sputtering damages the polymer substrates. Enhancing sputtering pressure substantially degrades tungsten orientation and increases electrical resistivity. Furthermore, a slight increase in substrate temperature results in tungsten films with good crystal orientation, a dense microstructure, and low electrical resistivity. Nonetheless, a high substrate temperature results in soft and deformed polymer substrates; this degrades tungsten crystal orientation and substantially roughens tungsten films. On the basis of this study, compact and flat tungsten films with low electrical resistivity can be obtained at a sputtering power of 69 W, a sputtering pressure of 1 Pa, a substrate temperature of 100°C, and a distance between target and substrate of 60 mm.

  13. Hydroxyapatite thin films grown by pulsed laser deposition and radio-frequency magnetron sputtering: comparative study

    NASA Astrophysics Data System (ADS)

    Nelea, V.; Morosanu, C.; Iliescu, M.; Mihailescu, I. N.

    2004-04-01

    Hydroxyapatite (HA) thin films for applications in the biomedical field were grown by pulsed laser deposition (PLD) and radio-frequency magnetron sputtering (RF-MS) techniques. The depositions were performed from pure hydroxyapatite targets on Ti-5Al-2.5Fe (TiAlFe) alloys substrates. In order to prevent the HA film penetration by Ti atoms or ions diffused from the Ti-based alloy during and after deposition, the substrates were pre-coated with a thin buffer layer of TiN. In both cases, TiN was introduced by reactive PLD from TiN targets in low-pressure N 2. The PLD films were grown in vacuum onto room temperature substrates. The RF-MS films were deposited in low-pressure argon on substrates heated at 550 °C. The initially amorphous PLD thin films were annealed at 550 °C for 1 h in ambient air in order to restore the initial crystalline structure of HA target. The thickness of the PLD and RF-MS films were ˜1 μm and ˜350 nm, respectively. All films were structurally studied by scanning electron microscopy (SEM), grazing incidence X-ray diffraction (GIXRD), energy dispersive X-ray spectrometry (EDS) and white light confocal microscopy (WLCM). The mechanical properties of the films were tested by Berkovich nano-indentation. Both PLD and RF-MS films mostly contain HA phase and exhibit good mechanical characteristics. Peaks of CaO were noticed as secondary phase in the GIXRD patterns only for RF-MS films. By its turn, the sputtered films were smoother as compared to the ones deposited by PLD (50 nm versus 250 nm average roughness). The RF-MS films were harder, more mechanically resistant and have a higher Young modulus.

  14. Influence of deposition rate on the formation of growth twins in sputter-deposited 330 austenitic stainless steel films

    NASA Astrophysics Data System (ADS)

    Zhang, X.; Anderoglu, O.; Misra, A.; Wang, H.

    2007-04-01

    The authors have studied the influence of deposition rate on the formation of growth twins in sputter-deposited 330 austenitic stainless steel thin films. Transmission electron microscopy shows that the volume fraction of twinned grains increases with increasing deposition rate, whereas the average columnar grain size and twin spacing stay approximately unchanged. These experimental results agree qualitatively with their analytical model that predicts deposition rate dependent formation of growth twins. The film hardness increases monotonically with increasing volume fraction of twinned grains.

  15. Influence of deposition rate on the formation of growth twins in sputter-deposited 330 austenitic stainless steel films

    SciTech Connect

    Zhang, X.; Anderoglu, O.; Misra, A.; Wang, H.

    2007-04-09

    The authors have studied the influence of deposition rate on the formation of growth twins in sputter-deposited 330 austenitic stainless steel thin films. Transmission electron microscopy shows that the volume fraction of twinned grains increases with increasing deposition rate, whereas the average columnar grain size and twin spacing stay approximately unchanged. These experimental results agree qualitatively with their analytical model that predicts deposition rate dependent formation of growth twins. The film hardness increases monotonically with increasing volume fraction of twinned grains.

  16. Compositional analysis of diamond like carbon and carbon nitride films deposited by magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Kayani, Asghar; Ingram, David

    2003-03-01

    The growing influence of the amorphous carbon not only as mechanical protective coating , but also of its possible use as electronic semiconducting material have made this material an important one. Incorporation of Nitrogen in a-C:H is believed to improve the semiconducting properties[1]. Moreover Carbon-Nitrogen films are a possible candidate for dielectric, insulating and passivating layers in a variety gallium nitride based device applications. Thin films amorphous carbon, non-hydrogenated, hydrogenated and nitrogenated were deposited on glassy carbon, silicon and quartz using magnetron sputtering of graphite target. Argon and Nitrogen were used as a sputtering gases. For Elemental concentration, films deposited on glassy carbon were used. 2.2 Mev of He++ beam is extracted from accelerator and in directed to the target films. Back and Forward scattered He++ particles were detected by solid-state detectors. The number and the energy of the particles striking the detector is stored electronically. The areal density in atoms per cm2, on the substrate surface was obtained from the shift in the substrate edge and area of carbon and other elements signals in Rutherford Backscattering Spectrum (RBS). Total Hydrogen content of the films were measured with Elastic Recoil Spectroscopy (ERS). Spectrum were simulated using Rutherford Universal Manipulation Program (RUMP).

  17. Effects of sputtering power on properties of copper oxides thin films deposited on glass substrates

    SciTech Connect

    Ooi, P. K.; Ng, S. S.; Abdullah, M. J.

    2015-04-24

    Copper oxides are deposited by radio frequency sputtering using copper target in the mixture of argon and oxygen gasses. The structural and optical properties of the copper oxides deposited at different sputtering powers have been investigated. All the films are single phase polycrystalline. At low RF power (100 W), the film is monoclinic structure of cupric oxide (CuO). Meanwhile, the films are cubic structure of cuprous oxide (Cu2O) at higher RF power. Field emission scanning electron microscopy images show the films have different morphologies with small grain size and consist of a lot of voids. The analysis of energy dispersive X-ray spectroscopy shows that the ratio of Cu to O is increased as the RF power increased. From the ultraviolet–visible spectroscopy, the films have a broad absorption edge in the range of 300–500 nm. The band gap of the films grown at RF power of 100 W, and 120 W and above, were 1.18 eV and 2.16 eV, respectively.

  18. Helium-Charged La-Ni-Al Thin Films Deposited by Magnetron Sputtering

    SciTech Connect

    Shi Liqun; Chen Deming; Xu Shilin; Liu Chaozhu; Hao Wanli; Zhou Zhuyin

    2005-07-15

    An advanced implantation of low energy helium-4 atoms during the La-Ni-Al film growth by adopting magnetron sputtering with Ar/He mixture gases is discussed. Both proton backscattering spectroscopy (PBS) and elastic recoil detection (ERD) analyses were adopted to measure helium concentration of the films and distribution in the near-surface region. Helium atoms with a high concentration incorporate evenly in deposited film. The introduction of the helium with no extra irradiation damage is expected by choosing suitable deposition conditions. It was found that amorphous and crystalline LaNi{sub 5}-type structures can be achieved when sputtered with pure Ar and Ar/He mixture gases at room temperature, respectively. Thermal desorption experiments proposes that a part of hydrogen atoms are bound to trapped helium at crystal and releases together with helium. Only a small fraction of helium is released from the helium-vacancy clusters in lower temperature range and most of helium is released from small size helium bubbles in the high temperature range.

  19. Deposition of adherent Ag-Ti duplex films on ceramics in a multiple-cathode sputter deposition system

    NASA Technical Reports Server (NTRS)

    Honecy, Frank S.

    1992-01-01

    The adhesion of Ag films deposited on oxide ceramics can be increased by first depositing intermediate films of active metals such as Ti. Such duplex coatings can be fabricated in a widely used three target sputter deposition system. It is shown here that the beneficial effect of the intermediate Ti film can be defeated by commonly used in situ target and substrate sputter cleaning procedures which result in Ag under the Ti. Auger electron spectroscopy and wear testing of the coatings are used to develop a cleaning strategy resulting in an adherent film system.

  20. Solutions for discharge chamber sputtering and anode deposit spalling in small mercury ion thrusters

    NASA Technical Reports Server (NTRS)

    Power, J. L.; Hiznay, D. J.

    1975-01-01

    Proposed solutions to the problems of sputter erosion and sputtered material spalling in the discharge chamber of small mercury ion thrusters are presented. The accelerated life test evaluated three such proposed solutions: (1) the use of tantalum as a single low sputter yield material for the exposed surfaces of the discharge chamber components subject to sputtering, (2) the use of a severely roughened anode surface to improve the adhesion of the sputter-deposited coating, and (3) the use of a wire cloth anode surface in order to limit the size of any coating flakes which might spall from it. Because of the promising results obtained in the accelerated life test with anode surfaces roughened by grit-blasting, experiments were carried out to optimize the grit-blasting procedure. The experimental results and an optimal grit-blasting procedure are presented.

  1. Nanoscale compositional analysis of NiTi shape memory alloy films deposited by DC magnetron sputtering

    SciTech Connect

    Sharma, S. K.; Mohan, S.; Bysakh, S.; Kumar, A.; Kamat, S. V.

    2013-11-15

    The formation of surface oxide layer as well as compositional changes along the thickness for NiTi shape memory alloy thin films deposited by direct current magnetron sputtering at substrate temperature of 300 °C in the as-deposited condition as well as in the postannealed (at 600 °C) condition have been thoroughly studied by using secondary ion mass spectroscopy, x-ray photoelectron spectroscopy, and scanning transmission electron microscopy-energy dispersive x-ray spectroscopy techniques. Formation of titanium oxide (predominantly titanium dioxide) layer was observed in both as-deposited and postannealed NiTi films, although the oxide layer was much thinner (8 nm) in as-deposited condition. The depletion of Ti and enrichment of Ni below the oxide layer in postannealed films also resulted in the formation of a graded microstructure consisting of titanium oxide, Ni{sub 3}Ti, and B2 NiTi. A uniform composition of B2 NiTi was obtained in the postannealed film only below a depth of 200–250 nm from the surface. Postannealed film also exhibited formation of a ternary silicide (Ni{sub x}Ti{sub y}Si) at the film–substrate interface, whereas no silicide was seen in the as-deposited film. The formation of silicide also caused a depletion of Ni in the film in a region ∼250–300 nm just above the film substrate interface.

  2. Visible-light active thin-film WO{sub 3} photocatalyst with controlled high-rate deposition by low-damage reactive-gas-flow sputtering

    SciTech Connect

    Oka, Nobuto Murata, Akiyo; Nakamura, Shin-ichi; Jia, Junjun; Shigesato, Yuzo; Iwabuchi, Yoshinori; Kotsubo, Hidefumi

    2015-10-01

    A process based on reactive gas flow sputtering (GFS) for depositing visible-light active photocatalytic WO{sub 3} films at high deposition rates and with high film quality was successfully demonstrated. The deposition rate for this process was over 10 times higher than that achieved by the conventional sputtering process and the process was highly stable. Furthermore, Pt nanoparticle-loaded WO{sub 3} films deposited by the GFS process exhibited much higher photocatalytic activity than those deposited by conventional sputtering, where the photocatalytic activity was evaluated by the extent of decomposition of CH{sub 3}CHO under visible light irradiation. The decomposition time for 60 ppm of CH{sub 3}CHO was 7.5 times more rapid on the films deposited by the GFS process than on the films deposited by the conventional process. During GFS deposition, there are no high-energy particles bombarding the growing film surface, whereas the bombardment of the surface with high-energy particles is a key feature of conventional sputtering. Hence, the WO{sub 3} films deposited by GFS should be of higher quality, with fewer structural defects, which would lead to a decrease in the number of centers for electron-hole recombination and to the efficient use of photogenerated holes for the decomposition of CH{sub 3}CHO.

  3. Visible-light active thin-film WO3 photocatalyst with controlled high-rate deposition by low-damage reactive-gas-flow sputtering

    NASA Astrophysics Data System (ADS)

    Oka, Nobuto; Murata, Akiyo; Nakamura, Shin-ichi; Jia, Junjun; Iwabuchi, Yoshinori; Kotsubo, Hidefumi; Shigesato, Yuzo

    2015-10-01

    A process based on reactive gas flow sputtering (GFS) for depositing visible-light active photocatalytic WO3 films at high deposition rates and with high film quality was successfully demonstrated. The deposition rate for this process was over 10 times higher than that achieved by the conventional sputtering process and the process was highly stable. Furthermore, Pt nanoparticle-loaded WO3 films deposited by the GFS process exhibited much higher photocatalytic activity than those deposited by conventional sputtering, where the photocatalytic activity was evaluated by the extent of decomposition of CH3CHO under visible light irradiation. The decomposition time for 60 ppm of CH3CHO was 7.5 times more rapid on the films deposited by the GFS process than on the films deposited by the conventional process. During GFS deposition, there are no high-energy particles bombarding the growing film surface, whereas the bombardment of the surface with high-energy particles is a key feature of conventional sputtering. Hence, the WO3 films deposited by GFS should be of higher quality, with fewer structural defects, which would lead to a decrease in the number of centers for electron-hole recombination and to the efficient use of photogenerated holes for the decomposition of CH3CHO.

  4. Impact of sputter deposition parameters on molybdenum nitride thin film properties

    NASA Astrophysics Data System (ADS)

    Stöber, L.; Konrath, J. P.; Krivec, S.; Patocka, F.; Schwarz, S.; Bittner, A.; Schneider, M.; Schmid, U.

    2015-07-01

    Molybdenum and molybdenum nitride thin films are presented, which are deposited by reactive dc magnetron sputtering. The influence of deposition parameters, especially the amount of nitrogen during film synthesization, to mechanical and electrical properties is investigated. The crystallographic phase and lattice constants are determined by x-ray diffraction analyses. Further information on the microstructure as well as on the biaxial film stress are gained from techniques such as transmission electron microscopy, scanning electron microscopy and the wafer bow. Furthermore, the film resistivity and the temperature coefficient of resistance are measured by the van der Pauw technique starting from room temperature up to 300 °C. Independent of the investigated physical quantity, a dominant dependence on the sputtering gas nitrogen content is observed compared to other deposition parameters such as the plasma power or the sputtering gas pressure in the deposition chamber.

  5. The effects of changing deposition conditions on the similarity of sputter-deposited fluorocarbon thin films to bulk PTFE

    NASA Astrophysics Data System (ADS)

    Zandona, Philip

    Solid lubrication of space-borne mechanical components is essential to their survival and the continued human exploration of space. Recent discoveries have shown that PTFE when blended with alumina nanofillers exhibits greatly improved physical performance properties, with wear rates being reduced by several orders of magnitude. The bulk processes used to produce the PTFE-alumina blends are limiting. Co-sputter deposition of PTFE and a filler material overcomes several of these limitations by enabling the reduction of particle size to the atomic level and also by allowing for the even coating of the solid lubricant on relatively large areas and components. The goal of this study was to establish a baseline performance of the sputtered PTFE films as compared to the bulk material, and to establish deposition conditions that would result in the most bulk-like film possible. In order to coax change in the structure of the sputtered films, sputtering power and deposition temperature were increased independently. Further, post-deposition annealing was applied to half of the deposited film in an attempt to affect change in the film structure. Complications in the characterization process due to increasing film thickness were also examined. Bulk-like metrics for characterization processes the included Fourier transform infrared spectroscopy (FTIR), X-ray spectroscopy (XPS), nanoindentation via atomic force microscopy, and contact angle of water on surface measurements were established. The results of the study revealed that increasing sputtering power and deposition temperature resulted in an increase in the similarity between the fluorocarbon films and the bulk PTFE, at a cost of affecting the potential of the film thicknesses, either by affecting the deposition process directly, or by decreasing the longevity of the sputtering targets.

  6. A new highly automated sputter equipment for in situ investigation of deposition processes with synchrotron radiation.

    PubMed

    Döhrmann, Ralph; Botta, Stephan; Buffet, Adeline; Santoro, Gonzalo; Schlage, Kai; Schwartzkopf, Matthias; Bommel, Sebastian; Risch, Johannes F H; Mannweiler, Roman; Brunner, Simon; Metwalli, Ezzeldin; Müller-Buschbaum, Peter; Roth, Stephan V

    2013-04-01

    HASE (Highly Automated Sputter Equipment) is a new mobile setup developed to investigate deposition processes with synchrotron radiation. HASE is based on an ultra-high vacuum sputter deposition chamber equipped with an in-vacuum sample pick-and-place robot. This enables a fast and reliable sample change without breaking the vacuum conditions and helps to save valuable measurement time, which is required for experiments at synchrotron sources like PETRA III at DESY. An advantageous arrangement of several sputter guns, mounted on a rotative flange, gives the possibility to sputter under different deposition angles or to sputter different materials on the same substrate. The chamber is also equipped with a modular sample stage, which allows for the integration of different sample environments, such as a sample heating and cooling device. The design of HASE is unique in the flexibility. The combination of several different sputtering methods like standard deposition, glancing angle deposition, and high pressure sputter deposition combined with heating and cooling possibilities of the sample, the large exit windows, and the degree of automation facilitate many different grazing incidence X-ray scattering experiments, such as grazing incidence small and wide angle X-ray scattering, in one setup. In this paper we describe in detail the design and the performance of the new equipment and present the installation of the HASE apparatus at the Micro and Nano focus X-ray Scattering beamline (MiNaXS) at PETRA III. Furthermore, we describe the measurement options and present some selected results. The HASE setup has been successfully commissioned and is now available for users. PMID:23635203

  7. A new highly automated sputter equipment for in situ investigation of deposition processes with synchrotron radiation

    SciTech Connect

    Doehrmann, Ralph; Botta, Stephan; Buffet, Adeline; Santoro, Gonzalo; Schlage, Kai; Schwartzkopf, Matthias; Risch, Johannes F. H.; Mannweiler, Roman; Roth, Stephan V.; Bommel, Sebastian; Brunner, Simon; Metwalli, Ezzeldin; Mueller-Buschbaum, Peter

    2013-04-15

    HASE (Highly Automated Sputter Equipment) is a new mobile setup developed to investigate deposition processes with synchrotron radiation. HASE is based on an ultra-high vacuum sputter deposition chamber equipped with an in-vacuum sample pick-and-place robot. This enables a fast and reliable sample change without breaking the vacuum conditions and helps to save valuable measurement time, which is required for experiments at synchrotron sources like PETRA III at DESY. An advantageous arrangement of several sputter guns, mounted on a rotative flange, gives the possibility to sputter under different deposition angles or to sputter different materials on the same substrate. The chamber is also equipped with a modular sample stage, which allows for the integration of different sample environments, such as a sample heating and cooling device. The design of HASE is unique in the flexibility. The combination of several different sputtering methods like standard deposition, glancing angle deposition, and high pressure sputter deposition combined with heating and cooling possibil-ities of the sample, the large exit windows, and the degree of automation facilitate many different grazing incidence X-ray scattering experiments, such as grazing incidence small and wide angle X-ray scattering, in one setup. In this paper we describe in detail the design and the performance of the new equipment and present the installation of the HASE apparatus at the Micro and Nano focus X-ray Scattering beamline (MiNaXS) at PETRA III. Furthermore, we describe the measurement options and present some selected results. The HASE setup has been successfully commissioned and is now available for users.

  8. Order-Disorder Transition in Sputter-Deposited Silver-Zinc Alloy Films

    NASA Astrophysics Data System (ADS)

    Maeda, Yoshihito; Minemura, Tetsuroh; Andoh, Hisashi

    1991-06-01

    An order-disorder transition between β' and β phases was observed to take place reversibly at 510 K in sputter-deposited AgZn alloy films of 30 nm thickness. The β' phase was found to exist in the as-deposited alloy film and the transition could be described by the order parameter of Bragg-Williams theory.

  9. Investigation of the optical property and structure of WO3 thin films with different sputtering depositions

    NASA Astrophysics Data System (ADS)

    Chen, Hsi-Chao; Jan, Der-Jun; Chen, Chien-Han; Huang, Kuo-Ting; Lo, Yen-Ming; Chen, Sheng-Hui

    2011-09-01

    The purpose of this research was to compare the optical properties and structure of tungsten oxide (WO3) thin films that was deposited by different sputtering depositions. WO3 thin films deposited by two different depositions of direct current (DC) magnetron sputtering and pulsed DC sputtering. A 99.95% WO3 target was used as the starting material for these depositions. These WO3 thin films were deposited on the ITO glass, PET and silicon substrate by different ratios of oxygen and argon. A shadow moiré interferometer would be introduced to measure the residual stress for PET substrate. RF magnetron sputtering had the large residual stress than the other's depositions. A Raman spectrum could exhibit the phase of oxidation of WO3 thin film by different depositions. At the ratio of oxygen and argon was about 1:1, and the WO3 thin films had the best oxidation. However, it was important at the change of the transmittance (ΔT = Tbleached - Tcolored) between the coloring and bleaching for the smart window. Therefore, we also found the WO3 thin films had the large variation of transmittance between the coloring and bleaching at the gas ratios of oxygen and argon of 1:1.

  10. Physics of arcing, and implications to sputter deposition

    SciTech Connect

    Anders, Andre

    2005-03-15

    Arc and glow discharges are defined based on their cathode processes. Arcs are characterized by collective electron emission, which can be stationary with hot cathodes (thermionic arcs), or non-stationary with cold cathodes (cathodic arcs). A brief review on cathodic arc properties serves as the starting point to better understand arcing phenomena in sputtering. Although arcing occurs in both metal and reactive sputtering, it is more of an issue in the reactive case. Arcing occurs if sufficiently high field strength leads to thermal runaway of an electron emission site. The role of insulating layers and surface potential adjustment through current leakage is highlighted. In the situation of magnetron sputtering with ''racetrack'', the need for a model with two spatial dimensions is shown. In many cases, arcing is initiated by breakdown of dielectric layers and inclusions. It is most efficiently prevented if formation and excessive charge-up of dielectric layers and inclusions can be avoided.

  11. Additive manufactured Ti6Al4V scaffolds with the RF- magnetron sputter deposited hydroxyapatite coating

    NASA Astrophysics Data System (ADS)

    Chudinova, E.; Surmeneva, M.; Koptioug, A.; Scoglund, P.; Surmenev, R.

    2016-01-01

    Present paper reports on the results of surface modification of the additively manufactured porous Ti6Al4V scaffolds. Radio frequency (RF) magnetron sputtering was used to modify the surface of the alloy via deposition of the biocompatible hydroxyapatite (HA) coating. The surface morphology, chemical and phase composition of the HA-coated alloy were studied. It was revealed that RF magnetron sputtering allows preparing a homogeneous HA coating onto the entire surface of scaffolds.

  12. A review of basic phenomena and techniques for sputter-deposition of high temperature superconducting films

    SciTech Connect

    Auciello, O. North Carolina State Univ., Raleigh, NC . Dept. of Materials Science and Engineering); Ameen, M.S.; Kingon, A.I.; Lichtenwalner, D.J. . Dept. of Materials Science and Engineering); Krauss, A.R. )

    1990-01-01

    The processes involved in plasma and ion beam sputter-deposition of high temperature superconducting thin films are critically reviewed. Recent advances in the development of these techniques are discussed in relation to basic physical phenomena, specific to each technique, which must be understood before high quality films can be produced. Control of film composition is a major issue in sputter-deposition of multicomponent materials. Low temperature processing of films is a common goal for each technique, particularly in relation to integrating high temperature superconducting films with the current microelectronics technology. It has been understood for some time that for Y{sub 1}Ba{sub 2}Cu{sub 3}O{sub 7} deposition, the most intensely studied high-{Tc} compound, incorporation of sufficient oxygen into the film during deposition is necessary to produce as-deposited superconducting films at relatively substrate temperatures. Recent results have shown that with the use of suitable buffer layers, high quality Y{sub 1}Ba{sub 2}Cu{sub 3}O{sub 7} sputtered films can be obtained on Si substrates without the need for post-deposition anneal processing. This review is mainly focussed on issues related to sputter-deposition of Y{sub 1}Ba{sub 2}Cu{sub 3}O{sub 7} thin films, although representative results concerning the bismuth and thallium based compounds are included. 143 refs., 11 figs.

  13. Limits of carrier mobility in Sb-doped SnO{sub 2} conducting films deposited by reactive sputtering

    SciTech Connect

    Bissig, B. Jäger, T.; Tiwari, A. N.; Romanyuk, Y. E.; Ding, L.

    2015-06-01

    Electron transport in Sb-doped SnO{sub 2} (ATO) films is studied to unveil the limited carrier mobility observed in sputtered films as compared to other deposition methods. Transparent and conductive ATO layers are deposited from metallic tin targets alloyed with antimony in oxygen atmosphere optimized for reactive sputtering. The carrier mobility decreases from 24 cm{sup 2} V{sup −1} s{sup −1} to 6 cm{sup 2} V{sup −1} s{sup −1} when increasing the doping level from 0 to 7 at. %, and the lowest resistivity of 1.8 × 10{sup −3} Ω cm corresponding to the mobility of 12 cm{sup 2} V{sup −1} s{sup −1} which is obtained for the 3 at. % Sb-doped ATO. Temperature-dependent Hall effect measurements and near-infrared reflectance measurements reveal that the carrier mobility in sputtered ATO is limited by ingrain scattering. In contrast, the mobility of unintentionally doped SnO{sub 2} films is determined mostly by the grain boundary scattering. Both limitations should arise from the sputtering process itself, which suffers from the high-energy-ion bombardment and yields polycrystalline films with small grain size.

  14. Experiment and simulation of the compositional evolution of Ti-B thin films deposited by sputtering of a compound target

    SciTech Connect

    Neidhardt, Joerg; Mitterer, Christian; Mraz, Stanislav; Schneider, Jochen M.; Strub, Erik; Bohne, Wolfgang; Liedke, Bartosz; Moeller, Wolfhard

    2008-09-15

    The evolution of the coating stoichiometry with pressure, target-substrate distance, and angle was analyzed for dc sputtering of Ti{sub x}B (x=0.5, 1, 1.6) compound targets by elastic recoil detection analysis. For an investigation of the underlying fundamental processes primarily Ar was used as sputter gas. Additionally, the effect of a reactive gas (N{sub 2}) as well as bias voltage (floating up to -200 V) was briefly cross-checked. For deposition along the target normal (90 deg.) a pronounced Ti-deficiency of up to 20% is detected. Increasing the pressure or distance from 0.5 to 2 Pa and from 5 to 20 cm, respectively, leads to an almost equivalent linear increase in Ti/B ratio surpassing even the target composition. Off-axis depositions at lower angles (30 deg. and 60 deg.) on the other hand result in a higher Ti/B ratio. This is consistent with results obtained from Monte Carlo simulations combining the respective emission characteristics from the sputter process as well as the gas-phase transport. Hence, the pressure, distance, and sample position induced changes in chemical film composition can be understood by considering gas scattering and the angular distribution of the sputtered flux. The theoretically determined transition from a directional flux to thermal diffusion was experimentally verified by mass-energy analysis of the film-forming atoms.

  15. Spatial distribution of electrical properties for Al-doped ZnO films deposited by dc magnetron sputtering using various inert gases

    SciTech Connect

    Sato, Yasushi; Ishihara, Keita; Oka, Nobuto; Shigesato, Yuzo

    2010-07-15

    Spatial distribution of electrical properties of Al-doped ZnO (AZO) films deposited by magnetron sputtering was investigated. To adjust the intensity of bombardment by high-energy particles, the AZO films were deposited using Ar, Kr, or Xe gas with varying plasma impedance. The spatial distribution of the electrical properties clearly depends on the sputtering gas. In the case of using Kr or Xe, the resistivity of the films in front of the target center and erosion areas was significantly enhanced, in contrast with Ar. This was attributed to an enhancement in bombardment damage due to the increased sputtering voltages required for Kr or Xe discharges. The increase in plasma impedance was due to the smaller coefficients for secondary-electron emission of the target surface by Kr or Xe impingements, which leads to the larger sputtering voltage.

  16. Large-area few-layer MoS2 deposited by sputtering

    NASA Astrophysics Data System (ADS)

    Huang, Jyun-Hong; Chen, Hsing-Hung; Liu, Pang-Shiuan; Lu, Li-Syuan; Wu, Chien-Ting; Chou, Cheng-Tung; Lee, Yao-Jen; Li, Lain-Jong; Chang, Wen-Hao; Hou, Tuo-Hung

    2016-06-01

    Direct magnetron sputtering of transition metal dichalcogenide targets is proposed as a new approach for depositing large-area two-dimensional layered materials. Bilayer to few-layer MoS2 deposited by magnetron sputtering followed by post-deposition annealing shows superior area scalability over 20 cm2 and layer-by-layer controllability. High crystallinity of layered MoS2 was confirmed by Raman, photo-luminescence, and transmission electron microscopy analysis. The sputtering temperature and annealing ambience were found to play an important role in the film quality. The top-gate field-effect transistor by using the layered MoS2 channel shows typical n-type characteristics with a current on/off ratio of approximately 104. The relatively low mobility is attributed to the small grain size of 0.1–1 μm with a trap charge density in grain boundaries of the order of 1013 cm–2.

  17. Effects of nitrogen ion implantation time on tungsten films deposited by DC magnetron sputtering on AISI 410 martensitic stainless steel

    NASA Astrophysics Data System (ADS)

    Malau, Viktor; Ilman, Mochammad Noer; Iswanto, Priyo Tri; Jatisukamto, Gaguk

    2016-03-01

    Nitrogen ion implantation time on tungsten thin film deposited on surface of AISI 410 steel has been performed. Tungsten thin film produced by dc magnetron sputtering method was deposited on AISI 410 martensitic stainless steel substrates, and then the nitrogen ions were implanted on tungsten thin film. The objective of this research is to investigate the effects of implantation deposition time on surface roughness, microhardness, specific wear and corrosion rate of nitrogen implanted on tungsten film. Magnetron sputtering process was performed by using plasma gas of argon (Ar) to bombardier tungsten target (W) in a vacuum chamber with a pressure of 7.6 x 10-2 torr, a voltage of 300 V, a sputter current of 80 mA for sputtered time of 10 minutes. Nitrogen implantation on tungsten film was done with an initial pressure of 3x10-6 mbar, a fluence of 2 x 1017 ions/cm2, an energy of 100 keV and implantation deposition times of 0, 20, 30 and 40 minutes. The surface roughness, microhardness, specific wear and corrosion rate of the films were evaluated by surfcorder test, Vickers microhardness test, wear test and potentiostat (galvanostat) test respectively. The results show that the nitrogen ions implanted deposition time on tungsten film can modify the surface roughness, microhardness, specific wear and corrosion rate. The minimum surface roughness, specific wear and corrosion rate can be obtained for implantation time of 20 minutes and the maximum microhardness of the film is 329 VHN (Vickers Hardness Number) for implantation time of 30 minutes. The specific wear and corrosion rate of the film depend directly on the surface roughness.

  18. RF-sputter-deposited magnesium oxide films as high-quality adjustable tunnel barriers

    SciTech Connect

    Villegier, J.C.; Radparvar, M.; Yu, L.S.; Faris, S.M.

    1989-03-01

    High quality RF-sputtered MgO films are used as tunnel barriers to fabricate small area, niobium nitride Josephson tunnel junctions. A magnesium oxide barrier deposited as a single layer, or as a multilayer film, results in devices with similar characteristics. Annealing trilayers at temperatures in excess of 250/sup 0/C for several hours decrease junction current density and improve device quality presumably by increasing barrier heights through reducing resonant tunneling states. A self-aligned process utilizing only two mask levels is used to produce junctions as small as 0.5 ..mu..m/sup 2/ with excellent critical current uniformity. These junctions exhibit energy gaps of 5.1 mV and low subgap currents at current densities in excess of 1000 A/cm/sup 2/ which make them suitable for a variety of applications such as SIS mixers and logic circuits.

  19. Thermally stimulated currents in amorphous barium titanate thin films deposited by rf magnetron sputtering

    NASA Astrophysics Data System (ADS)

    El Kamel, F.; Gonon, P.; Jomni, F.; Yangui, B.

    2006-09-01

    Thermally stimulated currents (TSCs) are measured in amorphous barium titanate thin films deposited by the rf sputtering technique. The TSC global curve is composed of three overlapping peaks in the 0-200°C temperature range. At 50°C, a first TSC peak is observed that can be related to a shallow-trap level. A second peak due to a dipolar polarization process is observed at 95°C. Finally, a third peak appears at 140°C that is ascribed to the oxygen vacancy motion and their accumulation at electrodes. The different peaks constituting the global TSC spectrum are separately studied by the fractional polarization technique in order to analyze their fine structures and to determine their activation energies.

  20. Electrochromism in sputter deposited W1-y MoyO3 thin films

    NASA Astrophysics Data System (ADS)

    Arvizu, M. A.; Granqvist, C. G.; Niklasson, G. A.

    2016-02-01

    Electrochromic (EC) properties of tungsten-molybdenum oxide (W1-y MoyO3) thin films were investigated. The films were deposited on indium tin oxide covered glass by reactive DC sputtering from tungsten and molybdenum targets. Elemental compositions of the W1-y MoyO3 films were determined by Rutherford back scattering. Voltammetric cycling was performed in an electrolyte of 1 M LiClO4 in propylene carbonate. An increase in molybdenum content in the EC films caused both a shift towards higher energies and a lowering of the maximum of the optical absorption band, as compared with WO3 EC films. Durability under electrochemical cycling was diminished for W1-y MoyO3 EC films.

  1. Deposition Of Transparent Conducting Indium - Tin Oxide Films By Dc Sputtering

    NASA Astrophysics Data System (ADS)

    Bawa, S. S.; Sharma, S. S.; Agnihotry, S. A.; Biradar, A. M.; Chandra, Subhas

    1983-12-01

    Unique d.c. reactive sputtering process using a very thin layer of In/Sn alloy(10 wt% Sn) target, at high power levels hasAbeen used to prepare transparent conducting films of ITO with low resistivity (1.17 x 10 ' ohm.m), high optical transmission (" ¬Âº 95%) and of high infra-red reflectivity (e,J90%) for applications as transparent windows in electro-optical devices and solar energy systems. No post-deposition annealing is required. Substrate heating is accomplished entirely by the ion-bombardment intrinsic to DC sputtering, rather than by using an auxilliary resistance heater. Optical, electrical and structural proper-ties of the films have been studied. The characteristic features of the ITO films are very low resistivity, high carrier density, high mobility, low temperature coefficient of resistivity and smaller grain size in comparison with pure indium oxide films. It was concluded from the thermal stability test that the contribution to the carrier density by tin is only a few percent to that created by oxygen.

  2. Control of silicon oxynitrides refractive index by reactive-assisted ion beam sputter deposition

    NASA Astrophysics Data System (ADS)

    Ida, Michel; Chaton, Patrick; Rafin, B.

    1994-11-01

    This paper presents the properties of silicon oxynitrides obtained by reactive ion beam sputter deposition: Dual Ion Beam System. Control of refractive index was achieved by adjusting the process parameters as ion beam current, ion beam energy and reactive gas partial pressure of oxygen and nitrogen. The main difficulty was to achieve stoichiometric nitride, it has been shown that energetic ionized nitrogen was needed to obtain silicon nitride. The major parameter, to obtain variable compositions between silica and silicon nitride, was the oxygen partial pressure with a fixed nitrogen partial pressure. Optical constants in the visible range, refractive index and extinction coefficient, have been measured by spectrophotometry and spectroscopic ellipsometry. Stoichiometry, contamination and packing density have been measured by Rutherford Backscattering and Nuclear Reaction Analysis. The correlation between the film composition and optical constants is shown. Various test results indicate that silicon oxynitrides obtained by reactive assisted ion beam sputtering are high quality optical materials. These films are homogeneous isotropic, with a high packing density. The extinction coefficient is in the order of 10-4 after 300 degree(s)C annealing. All values of refractive index between 1.49 and 2.1 can be chosen.

  3. Structural analysis of ferromagnetic Ni-Mn-Sn thin films fabricated by co-sputter deposition

    NASA Astrophysics Data System (ADS)

    Guvenc, Sema; Yumak, Mehmet; Nedelcos, A. Quintana; Llamazares, J. L. Sanchez; Garcia, Carlos Garcia

    2015-03-01

    Ferromagnetic Ni-Mn-X (Sn, In) alloys are predicted as potential candidates for energy efficient Magnetocaloric Effect (MCE) technologies. The MCE is the basis of magnetic refrigeration and it leads to a groundbreaking progress on conventional refrigeration methods. In our research, Ni-Mn-Sn thin films were fabricated by co-sputter deposition method. The Mn losses due to the high Mn vapor pressure produce a deviation from the desired Ni50Mn37Sn13 composition, which are partially compensated by increasing power of the Mn target gun. A systematic study of thin film co-sputter fabrication was divided into three stages; i) a Ni-Mn-Sn target was evaporated at different temperatures in order to study the grain size temperature dependence, ii) the nominal chemical composition (Ni50Mn37Sn13) was reached by controlling the power value applied to the Mn target, iii) the dependence of the phase transformation temperature with the grain size of the thin film alloys was studied. Grain size can be controlled by modifying the substrate temperature (Ts) .

  4. STEM-EELS analysis reveals stable high-density He in nanopores of amorphous silicon coatings deposited by magnetron sputtering.

    PubMed

    Schierholz, Roland; Lacroix, Bertrand; Godinho, Vanda; Caballero-Hernández, Jaime; Duchamp, Martial; Fernández, Asunción

    2015-02-20

    A broad interest has been showed recently on the study of nanostructuring of thin films and surfaces obtained by low-energy He plasma treatments and He incorporation via magnetron sputtering. In this paper spatially resolved electron energy-loss spectroscopy in a scanning transmission electron microscope is used to locate and characterize the He state in nanoporous amorphous silicon coatings deposited by magnetron sputtering. A dedicated MATLAB program was developed to quantify the helium density inside individual pores based on the energy position shift or peak intensity of the He K-edge. A good agreement was observed between the high density (∼35-60 at nm(-3)) and pressure (0.3-1.0 GPa) values obtained in nanoscale analysis and the values derived from macroscopic measurements (the composition obtained by proton backscattering spectroscopy coupled to the macroscopic porosity estimated from ellipsometry). This work provides new insights into these novel porous coatings, providing evidence of high-density He located inside the pores and validating the methodology applied here to characterize the formation of pores filled with the helium process gas during deposition. A similar stabilization of condensed He bubbles has been previously demonstrated by high-energy He ion implantation in metals and is newly demonstrated here using a widely employed methodology, magnetron sputtering, for achieving coatings with a high density of homogeneously distributed pores and He storage capacities as high as 21 at%. PMID:25627862

  5. Formation of cubic boron-nitride by the reactive sputter deposition of boron

    SciTech Connect

    Jankowski, A.F.; Hayes, J.P.; Makowiecki, D.W.; McKeman, M.A.

    1997-03-01

    Boron-nitride films are synthesized by RF magnetron sputtering boron targets where the deposition parameters of gas pressure, flow and composition are varied along with substrate temperature and applied bias. The films are analyzed using Auger electron spectroscopy, transmission electron microscopy, nanoindentation, Raman spectroscopy and x-ray absorption spectroscopy. These techniques provide characterization of film composition, crystalline structure, hardness and chemical bonding, respectively. Reactive, rf-sputtering process parameters are established which lead to the growth of crystalline BN phases. The deposition of stable and adherent boron nitride coatings consisting of the cubic phase requires 400 `C substrate heating and the application of a 300 V negative bias.

  6. Sputter deposition of Al-doped ZnO films with various incident angles

    SciTech Connect

    Sato, Yasushi; Yanagisawa, Kei; Oka, Nobuto; Nakamura, Shin-ichi; Shigesato, Yuzo

    2009-09-15

    Al-doped ZnO (AZO) films were sputter deposited on glass substrates heated at 200 degree sign C under incident angles of sputtered particles at 0 degree sign (incidence normal to substrate), 20 deg., 40 deg., 60 deg., and 80 deg. In the case of normal incidence, x-ray diffraction pole figures show a strong [001] preferred orientation normal to the film surface. In contrast, in the case wherein the incident angles were higher than 60 degree sign , the [001] orientation inclined by 25 deg. - 35 deg. toward the direction of sputtered particles. Transmission electron microscopy revealed that the tilt angle of the [001] orientation increased with increasing angle of the incident sputtered particles, whereas the columnar structure did not show any sign of inclination with respect to the substrate plane.

  7. Closed-cell foams produced from sputter-deposited aluminum. [experiments on earth and in space environment

    NASA Technical Reports Server (NTRS)

    Patten, J. W.; Greenwell, E. N.

    1977-01-01

    Sputter deposited aluminum containing argon was melted to produce foam, both in the earth's gravitational field and in a zero-gravity space environment. Experiments leading to trapping of up to 270 ppm argon sputtering gas in pure aluminum during high-rate dc triode sputter deposition are discussed. Conduct of the melting experiments and design of the furnace used are described. Metallography; an analysis of bubble size, distribution, and morphology; and a preliminary description of the kinetics are also presented.

  8. ZrN coatings deposited by high power impulse magnetron sputtering and cathodic arc techniques

    SciTech Connect

    Purandare, Yashodhan Ehiasarian, Arutiun; Hovsepian, Papken; Santana, Antonio

    2014-05-15

    Zirconium nitride (ZrN) coatings were deposited on 1 μm finish high speed steel and 316L stainless steel test coupons. Cathodic Arc (CA) and High Power Impulse Magnetron Sputtering (HIPIMS) + Unbalanced Magnetron Sputtering (UBM) techniques were utilized to deposit coatings. CA plasmas are known to be rich in metal and gas ions of the depositing species as well as macroparticles (droplets) emitted from the arc sports. Combining HIPIMS technique with UBM in the same deposition process facilitated increased ion bombardment on the depositing species during coating growth maintaining high deposition rate. Prior to coating deposition, substrates were pretreated with Zr{sup +} rich plasma, for both arc deposited and HIPIMS deposited coatings, which led to a very high scratch adhesion value (L{sub C2}) of 100 N. Characterization results revealed the overall thickness of the coatings in the range of 2.5 μm with hardness in the range of 30–40 GPa depending on the deposition technique. Cross-sectional transmission electron microscopy and tribological experiments such as dry sliding wear tests and corrosion studies have been utilized to study the effects of ion bombardment on the structure and properties of these coatings. In all the cases, HIPIMS assisted UBM deposited coating fared equal or better than the arc deposited coatings, the reasons being discussed in this paper. Thus H+U coatings provide a good alternative to arc deposited where smooth, dense coatings are required and macrodroplets cannot be tolerated.

  9. Resputtering of zinc oxide films prepared by radical assisted sputtering

    SciTech Connect

    Song Qiuming; Jiang Yousong; Song Yizhou

    2009-02-15

    Sputtering losses of zinc oxide films prepared by radical assisted sputtering were studied. It was found that the sputtering loss can be very severe in oxygenous sputtering processes of zinc oxide films. In general, resputtering caused by negative oxygen ions dominates the sputtering loss, while diffuse deposition plays a minor role. Resputtering is strongly correlated with the sputtering threshold energy of the deposited films and the concentration of O{sup -} in the sputtering zone. The balance between the oxygen concentration in the sputtering zone and the oxidation degree of the growing films depends on the sputtering rate. Our research suggests that a lower oxygen concentration in the sputtering zone and a higher oxidation degree of the growing films are favorable for reducing the resputtering losses. The sputtering loss mechanisms discussed in this work are also helpful for understanding the deposition processes of other magnetron sputtering systems.

  10. Chemical sputtering by H2+ and H3+ ions during silicon deposition

    NASA Astrophysics Data System (ADS)

    Landheer, K.; Goedheer, W. J.; Poulios, I.; Schropp, R. E. I.; Rath, J. K.

    2016-08-01

    We investigated chemical sputtering of silicon films by Hy+ ions (with y being 2 and 3) in an asymmetric VHF Plasma Enhanced Chemical Vapor Deposition (PECVD) discharge in detail. In experiments with discharges created with pure H2 inlet flows, we observed that more Si was etched from the powered than from the grounded electrode, and this resulted in a net deposition on the grounded electrode. With experimental input data from a power density series of discharges with pure H2 inlet flows, we were able to model this process with a chemical sputtering mechanism. The obtained chemical sputtering yields were (0.3-0.4) ± 0.1 Si atom per bombarding Hy+ ion at the grounded electrode and at the powered electrode the yield ranged from (0.4 to 0.65) ± 0.1. Subsequently, we investigated the role of chemical sputtering during PECVD deposition with a series of silane fractions SF (SF(%) = [SiH4]/[H2]*100) ranging from SF = 0% to 20%. We experimentally observed that the SiHy+ flux is not proportional to SF but decreasing from SF = 3.4% to 20%. This counterintuitive SiHy+ flux trend was partly explained by an increasing chemical sputtering rate with decreasing SF and partly by the reaction between H3+ and SiH4 that forms SiH3+.

  11. Measurements and Modelling of Sputtering Rates with Low Energy Ions

    NASA Astrophysics Data System (ADS)

    Ruzic, David N.; Smith, Preston C.; Turkot, Robert B., Jr.

    1996-10-01

    The angular-resolved sputtering yield of Be by D+, and Al by Ar+ was predicted and then measured. A 50 to 1000 eV ion beam from a Colutron was focused on to commercial grade and magnetron target grade samples. The S-65 C grade beryllium samples were supplied by Brush Wellman and the Al samples from TOSOH SMD. In our vacuum chamber the samples can be exposed to a dc D or Ar plasma to remove oxide, load the surface and more-nearly simulate steady state operating conditions in the plasma device. The angular distribution of the sputtered atoms was measured by collection on a single crystal graphite witness plate. The areal density of Be or Al (and BeO2 or Al2O3, after exposure to air) was then measured using a Scanning Auger Spectrometer. Total yield was also measured by deposition onto a quartz crystal oscillator simultaneously to deposition onto the witness plate. A three dimensional version of vectorized fractal TRIM (VFTRIM3D), a Monte-Carlo computer code which includes surface roughness characterized by fractal geometry, was used to predict the angular distribution of the sputtered particles and a global sputtering coefficient. Over a million trajectories were simulated for each incident angle to determine the azimuthal and polar angle distributions of the sputtered atoms. The experimental results match closely with the simulations for total yield, while the measured angular distributions depart somewhat from the predicted cosine curve.

  12. Determination of titanium atom and ion densities in sputter deposition plasmas by optical emission spectroscopy

    NASA Astrophysics Data System (ADS)

    Vašina, P.; Fekete, M.; Hnilica, J.; Klein, P.; Dosoudilová, L.; Dvořák, P.; Navrátil, Z.

    2015-12-01

    The thorough characterizations of deposition plasma lead to important achievements in the fundamental understanding of the deposition process, with a clear impact on the development of technology. Measurement of the spatial and, in the case of pulse excited plasma, also temporal evolution, of the concentrations of sputtered atoms and ions is a primary task in the diagnostics of any sputter deposition plasma. However, it is difficult to estimate absolute number densities of the sputtered species (atoms and ions) in ground states directly from optical emission spectroscopy, because the species in the ground levels do not produce any optical signal. A method using effective branching fractions enables us to determine the density of non-radiating species from the intensities of self-absorbed spectral lines. The branching fractions method described in the first part of this paper was applied to determine the ground state densities of the sputtered titanium atoms and ions. The method is based on fitting the theoretically calculated branching fractions to experimentally measured ratios of the relative intensities of carefully selected resonant titanium atomic and ionic lines. The sputtered species density is determined in our experimental setup with a relative uncertainty of less than 5% for the dc driven magnetron and typically 15% for time-resolved measurements of high-power impulse magnetron sputtering (HiPIMS) discharge. In the second part of the paper, the method was applied to determine the evolution of titanium atom and ion densities in three typical cases ranging from the dc driven sputter process to HiPIMS.

  13. Molybdenum Oxides Deposited by Modulated Pulse Power Magnetron Sputtering: Stoichiometry as a Function of Process Parameters

    NASA Astrophysics Data System (ADS)

    Murphy, Neil R.; Sun, Lirong; Grant, John T.; Jones, John G.; Jakubiak, Rachel

    2015-10-01

    Molybdenum oxide films were deposited using modulated pulse power magnetron sputtering (MPPMS) from a molybdenum target in a reactive environment where the flow rate of oxygen was varied from 0 sccm to 2.00 sccm. By varying the amount of reactive oxygen available during deposition, the composition of the films ranged from metallic Mo to fully stoichiometric MoO3, when the molybdenum target became poisoned, due to the formation of a dielectric surface oxide coating. Film compositions were verified using high energy resolution x-ray photoelectron spectroscopy. Target poisoning occurred at an oxygen flow rate of 1.25 sccm and reversed when the flow rate decreased to about 1.00 sccm. MoO3 films deposited via MPPMS had densities of 3.8 g cm-3, 81% of the density of crystalline α-MoO3 as determined by x-ray reflectivity (XRR). In addition, XRR and atomic force microscopy data showed sub-nanometer surface roughness values. From spectroscopic ellipsometry, the measured refractive index of the MoO3 films at 589 nm was 1.97 with extinction coefficient values <0.02 at wavelengths above the measured absorption edge of 506 nm (2.45 eV).

  14. Sputter deposition onto ionic liquids: Simple and clean synthesis of highly dispersed ultrafine metal nanoparticles

    SciTech Connect

    Torimoto, Tsukasa; Okazaki, Ken-ichi; Kiyama, Tomonori; Hirahara, Kaori; Tanaka, Nobuo; Kuwabata, Susumu

    2006-12-11

    Sputter deposition of gold (Au) onto ionic liquids (ILs) resulted in the formation of highly dispersed Au nanoparticles without additional chemical species, such as reducing and/or stabilizing agents. The Au nanoparticles in 1-ethyl-3-methylimidazolium tetrafluoroborate had an average diameter (d{sub av}) of 5.5 nm with a standard deviation ({sigma}) of 0.86 nm, while sputter deposition onto N,N,N-trimethyl-N-propylammonium bis(trifluoromethanesulfonyl)imide resulted in the formation of much smaller Au nanoparticles with d{sub av} of 1.9 nm and {sigma} of 0.46 nm. Prolongation of sputtering time results in a higher concentration of Au nanoparticles in ILs, but did not cause a remarkable change in their size.

  15. High power impulse magnetron sputtering and related discharges: scalable plasma sources for plasma-based ion implantation and deposition

    SciTech Connect

    Anders, Andre

    2009-09-01

    High power impulse magnetron sputtering (HIPIMS) and related self-sputtering techniques are reviewed from a viewpoint of plasma-based ion implantation and deposition (PBII&D). HIPIMS combines the classical, scalable sputtering technology with pulsed power, which is an elegant way of ionizing the sputtered atoms. Related approaches, such as sustained self-sputtering, are also considered. The resulting intense flux of ions to the substrate consists of a mixture of metal and gas ions when using a process gas, or of metal ions only when using `gasless? or pure self-sputtering. In many respects, processing with HIPIMS plasmas is similar to processing with filtered cathodic arc plasmas, though the former is easier to scale to large areas. Both ion implantation and etching (high bias voltage, without deposition) and thin film deposition (low bias, or bias of low duty cycle) have been demonstrated.

  16. Effect of sputtering power on MgF2 thin films deposited by sputtering technique under fluorine trapping

    NASA Astrophysics Data System (ADS)

    De, Rajnarayan; Haque, S. Maidul; Tripathi, S.; Prathap, C.; Rao, K. Divakar; Sahoo, N. K.

    2016-05-01

    A non-conventional magnetron sputtering technique was explored to deposit magnesium fluoride thin films using the concept of fluorine gas trapping without the introduction of additional fluorine gas flow inside the chamber. The effect of magnetron power from 50 W to 250 W has been explored on structural, optical and physical properties of the samples. Polycrystalline nature with tetragonal crystallinity of the films has been confirmed by GIXRD measurements along with thickness dependency. Monotonic increase of attenuation coefficient (k) with RF power has been explained in terms of target compound dissociation probability. In conclusion, with fluorine trapping method, the samples deposited at lower RF powers (<100 W) are found to be more suitable for optical applications.

  17. Simulation and experimental study on compositional evolution of Li-Co in LiCoO2 thin films during sputter deposition

    NASA Astrophysics Data System (ADS)

    Nimisha, C. S.; Mohan Rao, G.

    2011-06-01

    The compositional evolution in sputter deposited LiCoO2 thin films is influenced by process parameters involved during deposition. The electrochemical performance of these films strongly depends on their microstructure, preferential orientation and stoichiometry. The transport process of sputtered Li and Co atoms from the LiCoO2 target to the substrate, through Ar plasma in a planar magnetron configuration, was investigated based on the Monte Carlo technique. The effect of sputtering gas pressure and the substrate-target distance (dst) on Li/Co ratio, as well as, energy and angular distribution of sputtered atoms on the substrate were examined. Stable Li/Co ratios have been obtained at 5 Pa pressure and dst in the range 5-11 cm. The kinetic energy and incident angular distribution of Li and Co atoms reaching the substrate have been found to be dependent on sputtering pressure. Simulations were extended to predict compositional variations in films prepared at various process conditions. These results were compared with the composition of films determined experimentally using x-ray photoelectron spectroscopy (XPS). Li/Co ratio calculated using XPS was in moderate agreement with that of the simulated value. The measured film thickness followed the same trend as predicted by simulation. These studies are shown to be useful in understanding the complexities in multicomponent sputtering.

  18. Simulation and experimental study on compositional evolution of Li-Co in LiCoO{sub 2} thin films during sputter deposition

    SciTech Connect

    Nimisha, C. S.; Mohan Rao, G.

    2011-06-01

    The compositional evolution in sputter deposited LiCoO{sub 2} thin films is influenced by process parameters involved during deposition. The electrochemical performance of these films strongly depends on their microstructure, preferential orientation and stoichiometry. The transport process of sputtered Li and Co atoms from the LiCoO{sub 2} target to the substrate, through Ar plasma in a planar magnetron configuration, was investigated based on the Monte Carlo technique. The effect of sputtering gas pressure and the substrate-target distance (d{sub st}) on Li/Co ratio, as well as, energy and angular distribution of sputtered atoms on the substrate were examined. Stable Li/Co ratios have been obtained at 5 Pa pressure and d{sub st} in the range 5-11 cm. The kinetic energy and incident angular distribution of Li and Co atoms reaching the substrate have been found to be dependent on sputtering pressure. Simulations were extended to predict compositional variations in films prepared at various process conditions. These results were compared with the composition of films determined experimentally using x-ray photoelectron spectroscopy (XPS). Li/Co ratio calculated using XPS was in moderate agreement with that of the simulated value. The measured film thickness followed the same trend as predicted by simulation. These studies are shown to be useful in understanding the complexities in multicomponent sputtering.

  19. Interfacial electrical properties of ion-beam sputter deposited amorphous carbon on silicon

    NASA Technical Reports Server (NTRS)

    Khan, A. A.; Woollam, J. A.; Chung, Y.; Banks, B.

    1983-01-01

    Amorphous, 'diamond-like' carbon films have been deposited on Si substrates, using ion-beam sputtering. The interfacial properties are studied using capacitance and conductance measurements. Data are analyzed using existing theories for interfacial electrical properties. The density of electronic states at the interface, along with corresponding time constants are determined.

  20. Pressure Effect in ZnO Films Using Off-Axis Sputtering Deposition

    NASA Technical Reports Server (NTRS)

    Zhu, Shen; Su, C.-H.; Lehoczky, S. L.; Peters, P.; George, M. A.

    1999-01-01

    ZnO films are deposited on (0001) sapphire, (001) Si and quartz substrates using the off-axis reactive magnetron sputtering deposition. Based on film thickness measurements, three transport regions of sputtered particles are observed when films are deposited in the pressure regions of 5 mtorr - 150 mtorr. X-ray diffraction, scanning probes microscopy, and electrical measurements are also used to characterize these films. The full width at half maximum of theta rocking curves for epitaxial films is less than 0.5 deg. In textured films, it rises to several degrees. The epitaxial films deposited at high pressure reveal a flat surface with some hexagonal facets. The density of hexagonal facets decreases when the growth pressure is reduced. The resistivity of these epitaxial films also depends on the growth pressures. A relationship between the pressure effects and film properties are discussed.

  1. Deposition of highly textured AlN thin films by reactive high power impulse magnetron sputtering

    SciTech Connect

    Moreira, Milena A.; Törndahl, Tobias; Katardjiev, Ilia; Kubart, Tomas

    2015-03-15

    Aluminum nitride thin films were deposited by reactive high power impulse magnetron sputtering (HiPIMS) and pulsed direct-current on Si (100) and textured Mo substrates, where the same deposition conditions were used for both techniques. The films were characterized by x-ray diffraction and atomic force microscopy. The results show a pronounced improvement in the AlN crystalline texture for all films deposited by HiPIMS on Si. Already at room temperature, the HiPIMS films exhibited a strong preferred (002) orientation and at 400 °C, no contributions from other orientations were detected. Despite the low film thickness of only 200 nm, an ω-scan full width at half maximum value of 5.1° was achieved on Si. The results are attributed to the high ionization of sputtered material achieved in HiPIMS. On textured Mo, there was no significant difference between the deposition techniques.

  2. Morphology and Structure of ZnO Films Synthesized by Off-Axis Sputtering Deposition

    NASA Technical Reports Server (NTRS)

    Zhu, Shen; Su, C.-H.; Lehoczky, S. L.

    1999-01-01

    ZnO is a wide-band-gap oxide material that has many applications. A new potential application of ZnO material is for light emitting devices since its structure and electrical properties are similar to that of the GaN material (a blue laser candidate). It also is a good substrate for fabricating GaN-based devices. Off-axis sputtering technique has revealed great potential in synthesizing excellent oxide materials because the negative ion bombardment is greatly reduced when adatoms condense on substrates. The surface of films grown by off-axis sputtering will be much smoother than that produced in a regular sputtering configuration. A growth mechanism is studied by investigating the morphology and structure of ZnO films under different growth conditions and orientations. ZnO films are deposited on (0001) sapphire and quartz substrates by off- axis sputtering deposition at various oxygen/argon mixture ratios and pressures and at different temperatures. All films reveal highly textured structures on quartz substrates and epitaxial growth on sapphire substrates. Two off-axis configurations, vertical and horizontal orientations are conducted to study the process of film growth, surface morphology, and film structure. X-ray diffraction, scanning probe microscopy, and electrical measurements are used to characterize these films. Detailed results will be discussed in the presentation. Keywords: ZnO, Photonic material, Off-axis sputtering, Growth mechanism

  3. Fluoropolymer Films Deposited by RF Plasma Sputtering of Polytetrafluoroethylene Using Inert Gases

    NASA Technical Reports Server (NTRS)

    Golub, Morton A.; Wydeven, Theodore; Kliss, Mark (Technical Monitor)

    1998-01-01

    The FT-IR (Fourier Transform Infrared), UV (Ultraviolet) and XPS (X Ray Photoelectron Spectroscopy) spectra of fluoropolymer films (SPTFE) deposited by rf (radio frequency) plasma sputtering of polytetrafluoroethylene (PTFE), using Ne, Kr and Xe as sputtering gases, were obtained and compared with prior spectra for SPTFE formed using He and Ar. The F/C (fluorine / carbon) ratios for SPTFE films (1.44-1.55), obtained at a rf power of 10 W, were essentially the same for all five rare gases, there being no trend of decreasing fluorine content in the SPTFE product with increasing atomic weight of the sputtering gas - contrary to the momentum transfer notion advanced by M. E. Ryan, et al. Increasing rf power from 10 to 50 W resulted in successively lower F/C ratios for SPTFE (e.g., from 1.55 to 1.21 in the case of Xe plasma-sputtered PTFE), accompanied by sputtering of the glass reactor and deposition of fragments of sodium aluminum silicate occurring at 40 W and above. In order to achieve a "Teflon-like" SPTFE structure (i.e., products with as high a F/C ratio as possible) in a given plasma reactor, an optimum rf power must be found, which in the present case was approximately 10 W.

  4. Sputter deposition of SiC coating on silicon wafers

    NASA Technical Reports Server (NTRS)

    Robson, M. T.; Blue, C. A.; Warrier, S. G.; Lin, R. Y.

    1992-01-01

    A study is conducted of the effect of substrate temperature during coating on the properties of coated SiC films on Si wafers, using a scratch test technique. While specimen temperature during coating has little effect on deposition rate, it significantly affects the durability of the coating. Scratch test damage to both film coating and substrate decreased with increasing deposition temperature, perhaps due to the rapid diffusion of the deposited atoms.

  5. Interaction of deuterium plasma with sputter-deposited tungsten nitride films

    NASA Astrophysics Data System (ADS)

    Gao, L.; Jacob, W.; Meisl, G.; Schwarz-Selinger, T.; Höschen, T.; von Toussaint, U.; Dürbeck, T.

    2016-01-01

    Magnetron-sputtered tungsten nitride (WNx) films were used as a model system to study the behaviour of re-deposited WNx layers which could form in fusion devices with tungsten (W) wall during nitrogen seeding. The interaction of such WNx layers with deuterium (D) plasmas was investigated in dedicated laboratory experiments. D retention and N removal due to D plasma exposure (D flux: 9.9  ×  1019 D m-2 s-1, ion energy 215 eV) at different temperatures were measured with ion beam analysis (IBA). Low-energy argon sputtering followed by IBA was applied to resolve the D distribution in the top-most surface of WNx with significantly improved depth resolution compared with the standard D depth profiling method by nuclear reaction analysis. Experimentally determined thicknesses for the penetration of D in WNx were compared with the penetration depth for D calculated in SDTrimSP simulations. Results show that D is only retained within the ion penetration range for samples exposed at 300 K. In contrast to the 300 K case, D diffuses beyond the implantation depth in a sample exposed at 600 K. However, the D penetration depth is much lower than in pure W at comparable conditions. The total amount of retained D in WNx at 600 K is by 50% lower than for implantation at 300 K with the same D fluence. Nitrogen is removed only within the D ion range.

  6. Properties of RF sputtered cadmium telluride (CdTe) thin films: Influence of deposition pressure

    NASA Astrophysics Data System (ADS)

    Kulkarni, R. R.; Pawbake, A. S.; Waykar, R. G.; Rondiya, S. R.; Jadhavar, A. A.; Pandharkar, S. M.; Karpe, S. D.; Diwate, K. D.; Jadkar, S. R.

    2016-04-01

    Influence of deposition pressure on structural, morphology, electrical and optical properties of CdTe thin films deposited at low substrate temperature (100°C) by RF magnetron sputtering was investigated. The formation of CdTe was confirmed by low angle XRD and Raman spectroscopy. The low angle XRD analysis revealed that the CdTe films have zinc blende (cubic) structure with crystallites having preferred orientation in (111) direction. Raman spectra show the longitudinal optical (LO) phonon mode peak ˜ 165.4 cm-1 suggesting high quality CdTe film were obtained over the entire range of deposition pressure studied. Scanning electron microscopy analysis showed that films are smooth, homogenous, and crack-free with no evidence of voids. The EDAX data revealed that CdTe films deposited at low deposition pressure are high-quality stoichiometric. However, for all deposition pressures, films are rich in Cd relative to Te. The UV-Visible spectroscopy analysis show the blue shift in absorption edge with increasing the deposition pressure while the band gap show decreasing trend. The highest electrical conductivity was obtained for the film deposited at deposition pressure 1 Pa which indicates that the optimized deposition pressure for our sputtering unit is 1 Pa. Based on the experimental results, these CdTe films can be useful for the application in the flexible solar cells and other opto-electronic devices.

  7. Energetic deposition of metal ions: Observation of self-sputtering and limited sticking for off-normal angles of incidence

    SciTech Connect

    Wu, Hongchen; Anders, Andre

    2009-09-15

    The deposition of films under normal and off-normal angle of incidence has been investigated to show the relevance of non-sticking of and self-sputtering by energetic ions, leading to the formation of neutral atoms. The flow of energetic ions was obtained using a filtered cathodic arc system in high vacuum and therefore the ion flux had a broad energy distribution of typically 50-100 eV per ion. The range of materials included Cu, Ag, Au, Ti, and Ni. Consistent with molecular dynamics simulations published in the literature, the experiments show, for all materials, that the combined effects of non-sticking and self-sputtering are very significant, especially for large off-normal angles. Modest heating and intentional introduction of oxygen background affect the results.

  8. Silicon oxynitride films deposited by reactive high power impulse magnetron sputtering using nitrous oxide as a single-source precursor

    SciTech Connect

    Hänninen, Tuomas Schmidt, Susann; Jensen, Jens; Hultman, Lars; Högberg, Hans

    2015-09-15

    Silicon oxynitride thin films were synthesized by reactive high power impulse magnetron sputtering of silicon in argon/nitrous oxide plasmas. Nitrous oxide was employed as a single-source precursor supplying oxygen and nitrogen for the film growth. The films were characterized by elastic recoil detection analysis, x-ray photoelectron spectroscopy, x-ray diffraction, x-ray reflectivity, scanning electron microscopy, and spectroscopic ellipsometry. Results show that the films are silicon rich, amorphous, and exhibit a random chemical bonding structure. The optical properties with the refractive index and the extinction coefficient correlate with the film elemental composition, showing decreasing values with increasing film oxygen and nitrogen content. The total percentage of oxygen and nitrogen in the films is controlled by adjusting the gas flow ratio in the deposition processes. Furthermore, it is shown that the film oxygen-to-nitrogen ratio can be tailored by the high power impulse magnetron sputtering-specific parameters pulse frequency and energy per pulse.

  9. Anisotropic TixSn1-xO2 nanostructures prepared by magnetron sputter deposition.

    PubMed

    Chen, Shutian; Li, Zhengcao; Zhang, Zhengjun

    2011-01-01

    Regular arrays of TixSn1-xO2 nanoflakes were fabricated through glancing angle sputter deposition onto self-assembled close-packed arrays of 200-nm-diameter polystyrene spheres. The morphology of nanostructures could be controlled by simply adjusting the sputtering power of the Ti target. The reflectance measurements showed that the melon seed-shaped nanoflakes exhibited optimal properties of antireflection in the entire visible and ultraviolet region. In addition, we determined their anisotropic reflectance in the direction parallel to the surface of nanoflakes and perpendicular to it, arising from the anisotropic morphology. PMID:21711849

  10. Study on re-sputtering during CNx film deposition through spectroscopic diagnostics of plasma

    NASA Astrophysics Data System (ADS)

    Liang, Peipei; Yang, Xu; Li, Hui; Cai, Hua; Sun, Jian; Xu, Ning; Wu, Jiada

    2015-10-01

    A nitrogen-carbon plasma was generated during the deposition of carbon nitride (CNx) thin films by pulsed laser ablation of a graphite target in a discharge nitrogen plasma, and the optical emission of the generated nitrogen-carbon plasma was measured for the diagnostics of the plasma and the characterization of the process of CNx film deposition. The nitrogen-carbon plasma was recognized to contain various species including nitrogen molecules and molecular ions excited in the ambient N2 gas, carbon atoms and atomic ions ablated from the graphite target and CN radicals. The temporal evolution and spatial distribution of the CN emission and their dependence on the substrate bias voltage show two groups of CN radicals flying in opposite directions. One represents the CN radicals formed as the products of the reactions occurring in the nitrogen-carbon plasma, revealing the reactive deposition of CNx film due to the reactive expansion of the ablation carbon plasma in the discharge nitrogen plasma and the effective formation of gaseous CN radicals as precursors for CNx film growth. The other one represents the CN radicals re-sputtered from the growing CNx film by energetic plasma species, evidencing the re-sputtering of the growing film accompanying film growth. And, the re-sputtering presents ion-induced sputtering features.

  11. Niobium Thin Film Properties Affected by Deposition Energy during Vacuum Deposition

    SciTech Connect

    Genfa Wu; H. Phillips; Ronald Sundelin; Anne-Marie Valente

    2003-05-01

    In order to understand and improve the super-conducting performance of niobium thin films at cryogenic temperatures, an energetic vacuum deposition system has been developed to study deposition energy effects on the properties of niobium thin films on various substrates. Ultra high vacuum avoids the gaseous inclusions in thin films commonly seen in sputtering deposition. A retarding field energy analyzer is used to measure the kinetic energy of niobium ions at the substrate location. A biased substrate holder controls the deposition energy. Transition temperature and residual resistivity ratio (RRR) of the niobium thin films at several deposition energies are obtained together with crystal orientation measurements and atomic force microscope (AFM) inspection, and the results show that there exists a preferred deposition energy around 115eV (the average deposition energy 64 eV plus the 51 V bias voltage).

  12. The Effects of Sputtering Target Preparation and Deposition Temperature on ZnTe:Cu Film Properties

    SciTech Connect

    Faulkner, Brooke R.; Ohno, T. R.; Burst, James M.; Duenow, Joel N.; Perkins, Craig L.; To, Bobby; Gessert, Timothy A.

    2015-06-14

    A back contact containing a sputtered ZnTe:Cu interface layer can produce high-performing thin-film CdS/CdTe photovoltaic devices. We have found that varying the ZnTe:Cu sputtering target fabrication processes and deposition temperature can affect material properties of the ZnTe:Cu films and the resulting device performance. Two different target 'recipes' with various copper contents were used to study changes in the compositional, structural, optical, and electrical properties of ZnTe:Cu films. Substrate temperature during deposition was also varied to investigate the temperature dependence of the films. It was found that the target recipe, Cu concentration in the target, and deposition temperature affect the composition of the ZnTe:Cu films, which impacts their structural, optical, and electrical properties.

  13. Microstructural evaluation of NiTi-based films deposited by magnetron sputtering

    SciTech Connect

    Crăciunescu, Corneliu M. Mitelea, Ion Budău, Victor; Ercuţa, Aurel

    2014-11-24

    Shape memory alloy films belonging to the NiTi-based systems were deposited on heated and unheated substrates, by magnetron sputtering in a custom made system, and their structure and composition was analyzed using electron microscopy. Several substrates were used for the depositions: glass, Cu-Zn-Al, Cu-Al-Ni and Ti-NiCu shape memory alloy ribbons and kapton. The composition of the Ti-Ni-Cu films showed limited differences, compared to the one of the target and the microstructure for the DC magnetron sputtering revealed crystallized structure with features determined on peel off samples from a Si wafer. Both inter and transcrystalline fractures were observed and related to the interfacial stress developed on cooling from deposition temperature.

  14. Microstructural evaluation of NiTi-based films deposited by magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Crǎciunescu, Corneliu M.; Mitelea, Ion; Budǎu, Victor; ErcuÅ£a, Aurel

    2014-11-01

    Shape memory alloy films belonging to the NiTi-based systems were deposited on heated and unheated substrates, by magnetron sputtering in a custom made system, and their structure and composition was analyzed using electron microscopy. Several substrates were used for the depositions: glass, Cu-Zn-Al, Cu-Al-Ni and Ti-NiCu shape memory alloy ribbons and kapton. The composition of the Ti-Ni-Cu films showed limited differences, compared to the one of the target and the microstructure for the DC magnetron sputtering revealed crystallized structure with features determined on peel off samples from a Si wafer. Both inter and transcrystalline fractures were observed and related to the interfacial stress developed on cooling from deposition temperature.

  15. Zinc Oxide Thin Films Fabricated with Direct Current Magnetron Sputtering Deposition Technique

    SciTech Connect

    Hoon, Jian-Wei; Chan, Kah-Yoong; Krishnasamy, Jegenathan; Tou, Teck-Yong

    2011-03-30

    Zinc oxide (ZnO) is a very promising material for emerging large area electronic applications including thin-film sensors, transistors and solar cells. We fabricated ZnO thin films by employing direct current (DC) magnetron sputtering deposition technique. ZnO films with different thicknesses ranging from 100 nm to 1020 nm were deposited on silicon (Si) substrate. The deposition pressure was varied from 12 mTorr to 25 mTorr. The influences of the film thickness and the deposition pressure on structural properties of the ZnO films were investigated using Mahr surface profilometer and atomic force microscopy (AFM). The experimental results reveal that the film thickness and the deposition pressure play significant role in the structural formation of the deposited ZnO thin films. ZnO films deposited on Si substrates are promising for variety of thin-film sensor applications.

  16. Deposition and Properties of Reactively Sputtered Ruthenium Dioxide Thin Films as an Electrode for Ferroelectric Capacitors

    NASA Astrophysics Data System (ADS)

    Lee, Jeong-gun; Min, Suk-ki; Choh, Sung

    1994-12-01

    Ruthenium dioxide (RuO2) films are studied for use as a bottom electrode of the (Ba, Sr)TiO3 thin-film capacitor. RuO2 films have been deposited by reactive DC magnetron sputtering of ruthenium at a relatively low sputtering power. Stoichiometric RuO2 films are obtained at oxygen partial pressures as low as 0.6 mTorr. The properties of the films have been investigated using techniques such as Rutherford backscattering spectrometry, Auger electron spectrometry, X-ray diffraction, and scanning electron microscopy. The oxygen composition in as-deposited RuOx films increases from 2.0 to 2.4 with the increase of initial O2 partial pressure from 1.2 to 5.6 mTorr at a sputtering power of 200 W. The films deposited under low oxygen partial pressures followed by annealing show preferential crystal growth in the [110] direction, whereas those deposited in high oxygen partial pressures show growth in the [101] direction. A resistivity of 65 µΩ·cm is obtained after annealing at 800°C. Even after high-temperature deposition and subsequent annealing processes, clear interfaces between (Ba, Sr)TiO3 and RuO2 films are obtained.

  17. Bioactivity response of Ta1-xOx coatings deposited by reactive DC magnetron sputtering.

    PubMed

    Almeida Alves, C F; Cavaleiro, A; Carvalho, S

    2016-01-01

    The use of dental implants is sometimes accompanied by failure due to periimplantitis disease and subsequently poor esthetics when soft-hard tissue margin recedes. As a consequence, further research is needed for developing new bioactive surfaces able to enhance the osseous growth. Tantalum (Ta) is a promising material for dental implants since, comparing with titanium (Ti), it is bioactive and has an interesting chemistry which promotes the osseointegration. Another promising approach for implantology is the development of implants with oxidized surfaces since bone progenitor cells interact with the oxide layer forming a diffusion zone due to its ability to bind with calcium which promotes a stronger bond. In the present report Ta-based coatings were deposited by reactive DC magnetron sputtering onto Ti CP substrates in an Ar+O2 atmosphere. In order to assess the osteoconductive response of the studied materials, contact angle and in vitro tests of the samples immersed in Simulated Body Fluid (SBF) were performed. Structural results showed that oxide phases where achieved with larger amounts of oxygen (70 at.% O). More compact and smooth coatings were deposited by increasing the oxygen content. The as-deposited Ta coating presented the most hydrophobic character (100°); with increasing oxygen amount contact angles progressively diminished, down to the lowest measured value, 63°. The higher wettability is also accompanied by an increase on the surface energy. Bioactivity tests demonstrated that highest O-content coating, in good agreement with wettability and surface energy values, showed an increased affinity for apatite adhesion, with higher Ca/P ratio formation, when compared to the bare Ti substrates. PMID:26478293

  18. Metal-AlN cermet solar selective coatings deposited by direct current magnetron sputtering technology

    NASA Astrophysics Data System (ADS)

    Zhang, Qi-Chu

    1998-02-01

    A series of metal-aluminium nitride (M-AlN) cermet materials for solar selective coatings was deposited by a novel direct current (d.c.) magnetron sputtering technology. Aluminium nitride was used as the ceramic component in the cermets, and stainless steel (SS), nickel-based alloy 0022-3727/31/4/003/img1 (NiCr), molybdenum-based alloy 0022-3727/31/4/003/img2 (TZM) and tungsten were used as the metallic components. The aluminium nitride ceramic and metallic components of the cermets were deposited by simultaneously running both an aluminium target and another metallic target in a gas mixture of argon and nitrogen. The ceramic component was deposited by d.c. reactive sputtering and the metallic component by d.c. non-reactive sputtering. The total sputtering gas pressure was 0.8-1.0 Pa and the partial pressure of reactive nitrogen gas was set at 0.020-0.025 Pa which is sufficiently high to ensure that a nearly pure AlN ceramic sublayer was deposited by d.c. reactive sputtering. Because of the excellent nitriding resistance of stainless steel and the other alloys and metal, a nearly pure metallic sublayer was deposited by d.c. sputtering at this low nitrogen partial pressure. A multilayered system, consisting of alternating metallic and AlN ceramic sublayers, was deposited by substrate rotation. This multisublayer system can be considered as a macrohomogeneous cermet layer with metal volume fraction determined by controlling the thicknesses of metallic and ceramic sublayers. Following this procedure, M-AlN cermet solar selective coatings with a double cermet layer structure were deposited. The films of these selective surfaces have the following structure: a low metal volume fraction cermet layer is placed on a high metal volume fraction cermet layer which in turn is placed on an aluminium metal infrared reflection layer. The top surface layer consists of an aluminium nitride antireflection layer. A solar absorptance of 0.92-0.96 and a normal emittance of 0.03-0.05 at

  19. Deposition of ultrahard Ti-Si-N coatings by pulsed high-current reactive magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Oskomov, K. V.; Zakharov, A. N.; Rabotkin, S. V.; Solov'ev, A. A.

    2016-02-01

    We report on the results of investigation of properties of ultrahard Ti-Si-N coatings deposited by pulsed high-current magnetron reactive sputtering (discharge pulse voltage is 300-900 V, discharge pulse current is up to 200 A, pulse duration is 10-100 μs, and pulse repetition rate is 20-2000 Hz). It is shown that for a short sputtering pulse (25 μs) and a high discharge current (160 A), the films exhibit high hardness (66 GPa), wear resistance, better adhesion, and a lower sliding friction coefficient. The reason is an enhancement of ion bombardment of the growing coating due to higher plasma density in the substrate region (1013 cm-3) and a manifold increase in the degree of ionization of the plasma with increasing peak discharge current (mainly due to the material being sputtered).

  20. Formation of metal nanoparticles by short-distance sputter deposition in a reactive ion etching chamber

    SciTech Connect

    Nie Min; Meng, Dennis Desheng; Sun Kai

    2009-09-01

    A new method is reported to form metal nanoparticles by sputter deposition inside a reactive ion etching chamber with a very short target-substrate distance. The distribution and morphology of nanoparticles are found to be affected by the distance, the ion concentration, and the sputtering time. Densely distributed nanoparticles of various compositions were fabricated on the substrates that were kept at a distance of 130 mum or smaller from the target. When the distance was increased to 510 mum, island structures were formed, indicating the tendency to form continuous thin film with longer distance. The observed trend for nanoparticle formation is opposite to the previously reported mechanism for the formation of nanoparticles by sputtering. A new mechanism based on the seeding effect of the substrate is proposed to interpret the experimental results.

  1. Structural and optical properties of CdO thin films deposited by RF magnetron sputtering technique

    SciTech Connect

    Kumar, G. Anil Reddy, M. V. Ramana; Reddy, Katta Narasimha

    2014-04-24

    Cadmium oxide (CdO) thin films were deposited on glass substrate by r.f. magnetron sputtering technique using a high purity (99.99%) Cd target of 2-inch diameter and 3 mm thickness in an Argon and oxygen mixed atmosphere with sputtering power of 50W and sputtering pressure of 2×10{sup −2} mbar. The prepared films were characterized by X-ray diffraction (XRD), optical spectroscopy and scanning electron microscopy (SEM). The XRD analysis reveals that the films were polycrystalline with cubic structure. The visible range transmittance was found to be over 70%. The optical band gap increased from 2.7 eV to2.84 eV with decrease of film thickness.

  2. Study of hafnium oxide thin films deposited by RF magnetron sputtering under glancing angle deposition at varying target to substrate distance

    NASA Astrophysics Data System (ADS)

    Haque, S. Maidul; Rao, K. Divakar; Misal, J. S.; Tokas, R. B.; Shinde, D. D.; Ramana, J. V.; Rai, Sanjay; Sahoo, N. K.

    2015-10-01

    Glancing angle deposition of HfO2 thin films by RF magnetron sputtering technique has been explored with respect to two vital deposition parameters visualizing angle of deposition (at 82° and 86° glancing angles) and target to substrate distance, DTS in the range 70-125 mm. AFM and spectroscopic ellipsometry measurements show that at optimum DTS of 110 mm and glancing angle 82°, the films exhibit nanostructures with an estimated lowest refractive index ∼1.63 at 550 nm. For both the deposition angles, with decrease in DTS the round shaped grains of the film surface as obtained from AFM images are found to coalesce and produce films with elliptical shaped grains at shorter target to substrate distance. With increase in DTS the deposition rate first decreases up to DTS = 110 mm and subsequently increases. The phenomenon has been ascribed to the competition between reduced deposition flux density and increased sticking coefficient due to decrease in adatom kinetic energy with the increase in DTS. GIXRD measurement reveals that all the films exhibit monoclinic crystal structure. At lower DTS, the crystallinity has improved with increase in deposition angle whereas at higher DTS (>90 mm) the crystallinity becomes poorer with increase in deposition angle. The fact has been explained in light of variation of shadowing effect and deposition rate.

  3. Texture evolution in nanocrystalline iron films deposited using biased magnetron sputtering

    SciTech Connect

    Vetterick, G.; Taheri, M. L.; Baldwin, J. K.; Misra, A.

    2014-12-21

    Fe thin films were deposited on sodium chloride (NaCl) substrates using magnetron sputtering to investigate means of texture control in free standing metal films. The Fe thin films were studied using transmission electron microscopy equipped with automated crystallographic orientation microscopy. Using this technique, the microstructure of each film was characterized in order to elucidate the effects of altering deposition parameters. The natural tendency for Fe films grown on (100) NaCl is to form a randomly oriented nanocrystalline microstructure. By careful selection of substrate and deposition conditions, it is possible to drive the texture of the film toward a single (100) orientation while retaining the nanocrystalline microstructure.

  4. From atoms to layers: in situ gold cluster growth kinetics during sputter deposition

    NASA Astrophysics Data System (ADS)

    Schwartzkopf, Matthias; Buffet, Adeline; Körstgens, Volker; Metwalli, Ezzeldin; Schlage, Kai; Benecke, Gunthard; Perlich, Jan; Rawolle, Monika; Rothkirch, André; Heidmann, Berit; Herzog, Gerd; Müller-Buschbaum, Peter; Röhlsberger, Ralf; Gehrke, Rainer; Stribeck, Norbert; Roth, Stephan V.

    2013-05-01

    The adjustment of size-dependent catalytic, electrical and optical properties of gold cluster assemblies is a very significant issue in modern applied nanotechnology. We present a real-time investigation of the growth kinetics of gold nanostructures from small nuclei to a complete gold layer during magnetron sputter deposition with high time resolution by means of in situ microbeam grazing incidence small-angle X-ray scattering (μGISAXS). We specify the four-stage growth including their thresholds with sub-monolayer resolution and identify phase transitions monitored in Yoneda intensity as a material-specific characteristic. An innovative and flexible geometrical model enables the extraction of morphological real space parameters, such as cluster size and shape, correlation distance, layer porosity and surface coverage, directly from reciprocal space scattering data. This approach enables a large variety of future investigations of the influence of different process parameters on the thin metal film morphology. Furthermore, our study allows for deducing the wetting behavior of gold cluster films on solid substrates and provides a better understanding of the growth kinetics in general, which is essential for optimization of manufacturing parameters, saving energy and resources.The adjustment of size-dependent catalytic, electrical and optical properties of gold cluster assemblies is a very significant issue in modern applied nanotechnology. We present a real-time investigation of the growth kinetics of gold nanostructures from small nuclei to a complete gold layer during magnetron sputter deposition with high time resolution by means of in situ microbeam grazing incidence small-angle X-ray scattering (μGISAXS). We specify the four-stage growth including their thresholds with sub-monolayer resolution and identify phase transitions monitored in Yoneda intensity as a material-specific characteristic. An innovative and flexible geometrical model enables the extraction

  5. Systematic investigations of low energy Ar ion beam sputtering of Si and Ag

    NASA Astrophysics Data System (ADS)

    Feder, R.; Frost, F.; Neumann, H.; Bundesmann, C.; Rauschenbach, B.

    2013-12-01

    Ion beam sputter deposition (IBD) delivers some intrinsic features influencing the growing film properties, because ion properties and geometrical process conditions generate different energy and spatial distributions of the sputtered and scattered particles. Even though IBD has been used for decades, the full capabilities are not investigated systematically and specifically used yet. Therefore, a systematic and comprehensive analysis of the correlation between the properties of the ion beam, the generated secondary particles and backscattered ions and the deposited films needs to be done.A vacuum deposition chamber has been set up which allows ion beam sputtering of different targets under variation of geometrical parameters (ion incidence angle, position of substrates and analytics in respect to the target) and of ion beam parameters (ion species, ion energy) to perform a systematic and comprehensive analysis of the correlation between the properties of the ion beam, the properties of the sputtered and scattered particles, and the properties of the deposited films. A set of samples was prepared and characterized with respect to selected film properties, such as thickness and surface topography. The experiments indicate a systematic influence of the deposition parameters on the film properties as hypothesized before. Because of this influence, the energy distribution of secondary particles was measured using an energy-selective mass spectrometer. Among others, experiments revealed a high-energetic maximum for backscattered primary ions, which shifts with increasing emission angle to higher energies. Experimental data are compared with Monte Carlo simulations done with the well-known Transport and Range of Ions in Matter, Sputtering version (TRIM.SP) code [J.P. Biersack, W. Eckstein, Appl. Phys. A: Mater. Sci. Process. 34 (1984) 73]. The thicknesses of the films are in good agreement with those calculated from simulated particle fluxes. For the positions of the

  6. The impact of substrate properties on the electromigration resistance of sputter-deposited Cu thin films

    NASA Astrophysics Data System (ADS)

    Bittner, A.; Pagel, N.; Seidel, H.; Schmid, U.

    2011-06-01

    Copper (Cu) is commonly used as metallization for a wide range of microelectronic devices. Typically, organic circuit boards as well as ceramic and glass-ceramic substrates use galvanic deposited Cu films for this purpose. However, due to a thickness of several microns the lateral resolution in the μm-region being required e.g. for novel high frequency applications can not be guaranteed when applying this technology. Hence, sputter deposition is envisaged for the realization of Cu thin films on glass, LTCC (low temperature co-fired ceramics) and alumina substrates. The reliability of 300 nm thick Cu thin films is investigated under accelerated aging conditions, utilizing a test structure which consists of 20 parallel lines stressed with current densities up to 1•10+6 A•cm-2 at temperatures between T= 100°C and 200°C. To detect the degradation via the temporal characteristics of the current signal a constant voltage is applied according to the overall resistance of the test structure. Knowing the mean time to failure (MTF) and the activation energy at elevated temperatures conclusions on the migration mechanism can be drawn. Whereas on LTCC substrates the activation energy of Ea~ 0.75 eV is similar to other face centered cubic metals such as silver, the higher activation energies of about Ea~ 1 eV on glass and alumina indicate a suppression of back diffusion especially at enhanced temperature levels. Therefore, the overall electromigration resistance is lower compared to Ag. This effect is predominantly caused by a stable oxide layer being formed at high temperatures acting as passivation layer.

  7. Fabrication and physico-mechanical properties of thin magnetron sputter deposited silver-containing hydroxyapatite films

    NASA Astrophysics Data System (ADS)

    Ivanova, A. A.; Surmeneva, M. A.; Tyurin, A. I.; Pirozhkova, T. S.; Shuvarin, I. A.; Prymak, O.; Epple, M.; Chaikina, M. V.; Surmenev, R. A.

    2016-01-01

    As a measure of the prevention of implant associated infections, a number of strategies have been recently applied. Silver-containing materials possessing antibacterial activity as expected might have wide applications in orthopedics and dentistry. The present work focuses on the physico-chemical characterization of silver-containing hydroxyapatite (Ag-HA) coating obtained by radio frequency (RF) magnetron sputtering. Mechanochemically synthesized Ag-HA powder (Ca10-xAgx(PO4)6(OH)2-x, x = 1.5) was used as a precursor for sputtering target preparation. Morphology, composition, crystallinity, physico-mechanical features (Young's modulus and nanohardness) of the deposited Ag-HA coatings were investigated. The sputtering of the nanostructured multicomponent target at the applied process conditions allowed to deposit crystalline Ag-HA coating which was confirmed by XRD and FTIR data. The SEM results revealed the formation of the coating with the grain morphology and columnar cross-section structure. The EDX analysis confirmed that Ag-HA coating contained Ca, P, O and Ag with the Ca/P ratio of 1.6 ± 0.1. The evolution of the mechanical properties allowed to conclude that addition of silver to HA film caused increase of the coating nanohardness and elastic modulus compared with those of pure HA thin films deposited under the same deposition conditions.

  8. Solar Ion Sputter Deposition in the Lunar Regolith: Experimental Simulation Using Focused-Ion Beam Techniques

    NASA Technical Reports Server (NTRS)

    Christoffersen, R.; Rahman, Z.; Keller, L. P.

    2012-01-01

    As regions of the lunar regolith undergo space weathering, their component grains develop compositionally and microstructurally complex outer coatings or "rims" ranging in thickness from a few 10 s to a few 100's of nm. Rims on grains in the finest size fractions (e.g., <20 m) of mature lunar regoliths contain optically-active concentrations of nm size metallic Fe spherules, or "nanophase Fe(sup o)" that redden and attenuate optical reflectance spectral features important in lunar remote sensing. Understanding the mechanisms for rim formation is therefore a key part of connecting the drivers of mineralogical and chemical changes in the lunar regolith with how lunar terrains are observed to become space weathered from a remotely-sensed point of view. As interpreted based on analytical transmission electron microscope (TEM) studies, rims are produced from varying relative contributions from: 1) direct solar ion irradiation effects that amorphize or otherwise modify the outer surface of the original host grain, and 2) nanoscale, layer-like, deposition of extrinsic material processed from the surrounding soil. This extrinsic/deposited material is the dominant physical host for nanophase Fe(sup o) in the rims. An important lingering uncertainty is whether this deposited material condensed from regolith components locally vaporized in micrometeorite or larger impacts, or whether it formed as solar wind ions sputtered exposed soil and re-deposited the sputtered ions on less exposed areas. Deciding which of these mechanisms is dominant, or possibility exclusive, has been hampered because there is an insufficient library of chemical and microstructural "fingerprints" to distinguish deposits produced by the two processes. Experimental sputter deposition / characterization studies relevant to rim formation have particularly lagged since the early post-Apollo experiments of Hapke and others, especially with regard to application of TEM-based characterization techniques. Here

  9. Research on titanium nitride thin films deposited by reactive magnetron sputtering for MEMS applications

    NASA Astrophysics Data System (ADS)

    Merie, Violeta; Pustan, Marius; Negrea, Gavril; Bîrleanu, Corina

    2015-12-01

    Titanium nitride can be used among other materials as diffusion barrier for MEMS (microelectromechanical systems) applications. The aim of this study is to elaborate and to characterize at nanoscale titanium nitride thin films. The thin films were deposited by reactive magnetron sputtering on silicon substrates using a 99.99% purity titanium target. Different deposition parameters were employed. The deposition temperature, deposition time, substrate bias voltage and the presence/absence of a titanium buffer layer are the parameters that were modified. The so-obtained films were then investigated by atomic force microscopy. A significant impact of the deposition parameters on the determined mechanical and tribological characteristics was highlighted. The results showed that the titanium nitride thin films deposited for 20 min at room temperature without the presence of a titanium buffer layer when a negative bias of -90 V was applied to the substrate is characterized by the best tribological and mechanical behavior.

  10. Resputtering effect during MgO buffer layer deposition by magnetron sputtering for superconducting coated conductors

    SciTech Connect

    Xiao, Shaozhu; Shi, Kai; Deng, Shutong; Han, Zhenghe; Feng, Feng Lu, Hongyuan; Qu, Timing; Zhu, Yuping; Huang, Rongxia

    2015-07-15

    In this study, MgO thin films were deposited by radio-frequency magnetron sputtering. The film thickness in the deposition area directly facing the target center obviously decreased compared with that in other areas. This reduction in thickness could be attributed to the resputtering effect resulting from bombardment by energetic particles mainly comprising oxygen atoms and negative oxygen ions. The influences of deposition position and sputtering pressure on the deposition rate were investigated. Resputtering altered the orientation of the MgO film from (111) to (001) when the film was deposited on a single crystal yttria-stabilized zirconia substrate. The density distribution of energetic particles was calculated on the basis of the measured thicknesses of the MgO films deposited at different positions. The divergence angle of the energetic particle flux was estimated to be approximately 15°. The energetic particle flux might be similar to the assisting ion flux in the ion beam assisted deposition process and could affect the orientation of the MgO film growth.

  11. Photovoltaic properties of ferroelectric BaTiO3 thin films RF sputter deposited on silicon

    NASA Technical Reports Server (NTRS)

    Dharmadhikari, V. S.; Grannemann, W. W.

    1982-01-01

    Ferroelectric thin films of BaTiO3 have been successfully deposited on n-type silicon substrates at temperatures above 500 C by RF sputtering in an O2/Ar atmosphere. Analysis by X-ray diffraction patterns show that films deposited at room temperature are amorphous. At temperatures above 500 C, crystalline BaTiO3 films with a tetragonal structure are obtained. The polarization-electric field (P-E) hysteresis loops and a broad peak in the dielectric constant versus temperature curve at Curie point indicate that the RF sputtered BaTiO3 films are ferroelectric. An anomalous photovoltaic effect is observed in these thin films which is related to the remanent polarization of the material. The results on open-circuit and short-circuit measurements provide an important basis for a better understanding of the role of photovoltaic field, photovoltaic current, and the pyroelectric properties in photoferroelectric domain switching.

  12. High performance all-sputter deposited Cu2S/CdS junctions

    NASA Astrophysics Data System (ADS)

    Thornton, J. A.; Anderson, W. W.

    1982-04-01

    Thin-film Cu2S/CdS solar cells are fabricated in a multisource chamber using magnetron reactive sputtering to deposit the Cu2S and CdS layers. An analysis of junction current voltage, log short-circuit current vs open-circuit voltage, and capacitance versus voltage measurements suggests that the junctions have very good quality, with diode ideality factors near unity and interface recombination velocities of about 2 x 10 to the 5th cm/s. The cells show that Cu2S/CdS junctions equivalent to those formed using the topotaxial ion exchange method can be formed by sequential all-vacuum deposition of CdS and Cu2S and that magnetron sputtering does not cause damage that compromises their electrical performance.

  13. Thermal Stability of Photosensitive Bragg Gratings in Sputter-Deposited Germanosilicate Glass

    SciTech Connect

    POTTER JR.,BARRETT G.; POTTER,KELLY SIMMONS; DUNBAR,TIMOTHY D.

    2000-07-24

    The thermal stability of photo-imprinted Bragg gratings formed in reactive-atmosphere, RF-magnetron sputtered germanosilicate thin films was evaluated in terms of point defect modifications observed during isochronal annealing. Optical and magnetic spectroscopes were utilized to evaluate structural relaxation in these sputtered glasses on both a local and medium-range size scale. Depending upon the substrate temperature used during deposition, significant structural rearrangement was found to occur with increasing post-deposition anneal temperature to 600 C. This resulted in changes in the photobleaching response of the material itself as the identity of optically active structural defects evolved. Based on a color center model for photosensitivity in these materials and measured changes in optical absorption with annealing, the thermal stability of a photo-imprinted Bragg grating was modeled. Good qualitative agreement with experiment was observed.

  14. Third-order nonlinear optical response of colloidal gold nanoparticles prepared by sputtering deposition

    NASA Astrophysics Data System (ADS)

    Castro, Hemerson P. S.; Wender, Heberton; Alencar, Márcio A. R. C.; Teixeira, Sergio R.; Dupont, Jairton; Hickmann, Jandir M.

    2013-11-01

    The nonlinear optical responses of gold nanoparticles dispersed in castor oil produced by sputtering deposition were investigated, using the thermally managed Z-scan technique. Particles with spherical shape and 2.6 nm of average diameter were obtained and characterized by transmission electron microscopy and small angle X-ray scattering. This colloid was highly stable, without the presence of chemical impurities, neither stabilizers. It was observed that this system presents a large refractive third-order nonlinear response and a negligible nonlinear absorption. Moreover, the evaluation of the all-optical switching figures of merit demonstrated that the colloidal nanoparticles prepared by sputtering deposition have a good potential for the development of ultrafast photonic devices.

  15. Sputtering deposition of Al-doped zinc oxide thin films using mixed powder targets

    NASA Astrophysics Data System (ADS)

    Ohshima, Tamiko; Maeda, Takashi; Tanaka, Yuki; Kawasaki, Hiroharu; Yagyu, Yoshihito; Ihara, Takeshi; Suda, Yoshiaki

    2016-01-01

    Sputtering deposition generally uses high-density bulk targets. Such a fabrication process has various problems including deterioration of the material during heating and difficulty in mixing a large number of materials in precise proportions. However, these problems can be solved by using a powder target. In this study, we prepared Al-doped ZnO (AZO) as transparent conductive thin films by radio-frequency magnetron sputtering with powder and bulk targets. Both the powder and bulk targets formed crystalline structures. The ZnO (002) peak was observed in the X-ray diffraction measurements. The mean transparency and resistivity of the films prepared with the powder target were 82% and 0.548 Ω · cm, respectively. The deposition rate with the powder target was lower than that with the bulk target.

  16. Third-order nonlinear optical response of colloidal gold nanoparticles prepared by sputtering deposition

    SciTech Connect

    Castro, Hemerson P. S.; Alencar, Márcio A. R. C.; Hickmann, Jandir M.; Wender, Heberton; Teixeira, Sergio R.; Dupont, Jairton

    2013-11-14

    The nonlinear optical responses of gold nanoparticles dispersed in castor oil produced by sputtering deposition were investigated, using the thermally managed Z-scan technique. Particles with spherical shape and 2.6 nm of average diameter were obtained and characterized by transmission electron microscopy and small angle X-ray scattering. This colloid was highly stable, without the presence of chemical impurities, neither stabilizers. It was observed that this system presents a large refractive third-order nonlinear response and a negligible nonlinear absorption. Moreover, the evaluation of the all-optical switching figures of merit demonstrated that the colloidal nanoparticles prepared by sputtering deposition have a good potential for the development of ultrafast photonic devices.

  17. Chemical bonding, optical constants, and electrical resistivity of sputter-deposited gallium oxide thin films

    SciTech Connect

    Ramana, C. V. Rubio, E. J.; Barraza, C. D.; Miranda Gallardo, A.; McPeak, Samantha; Kotru, Sushma; Grant, J. T.

    2014-01-28

    Gallium oxide (Ga{sub 2}O{sub 3}) thin films were made by sputter deposition employing a Ga{sub 2}O{sub 3} ceramic target for sputtering. The depositions were made over a wide range of substrate temperatures (T{sub s}), from 25 to 600 °C. The effect of T{sub s} on the chemical bonding, surface morphological characteristics, optical constants, and electrical properties of the grown films was evaluated using X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), spectroscopic ellipsometry (SE), and four-point probe measurements. XPS analyses indicate the binding energies (BE) of the Ga 2p doublet, i.e., the Ga 2p{sub 3/2} and Ga 2p{sub 1/2} peaks, are located at 1118.0 and 1145.0 eV, respectively, characterizing gallium in its highest chemical oxidation state (Ga{sup 3+}) in the grown films. The core level XPS spectra of O 1s indicate that the peak is centered at a BE ∼ 531 eV, which is also characteristic of Ga-O bonds in the Ga{sub 2}O{sub 3} phase. The granular morphology of the nanocrystalline Ga{sub 2}O{sub 3} films was evident from AFM measurements, which also indicate that the surface roughness of the films increases from 0.5 nm to 3.0 nm with increasing T{sub s}. The SE analyses indicate that the index of refraction (n) of Ga{sub 2}O{sub 3} films increases with increasing T{sub s} due to improved structural quality and packing density of the films. The n(λ) of all the Ga{sub 2}O{sub 3} films follows the Cauchy's dispersion relation. The room temperature electrical resistivity was high (∼200 Ω-cm) for amorphous Ga{sub 2}O{sub 3} films grown at T{sub s} = RT-300 °C and decreased to ∼1 Ω-cm for nanocrystalline Ga{sub 2}O{sub 3} films grown at T{sub s} ≥ 500–600 °C. A correlation between growth conditions, microstructure, optical constants, and electrical properties of Ga{sub 2}O{sub 3} films is derived.

  18. Surface modification of biomedical implants using ion-beam-assisted sputter deposition

    NASA Astrophysics Data System (ADS)

    Ektessabi, A. M.

    1997-05-01

    Hydroxy-apatite (Ca 10(PO 4) 6(OH) 2), owing to its good bioaffinity and enhancement of osseo-integration, is a potential material for coating on dental and orthopedic implants. At present, hydroxy-apatite is coated on metal implants by a plasma-spraying method or is used in its bulk form in reconstruction surgery. In this paper, experimental results are given for preparation of hydroxy-apatite thin films on various biomedical implant materials using ion-beam sputter deposition and ion-beam-assisted sputter deposition methods. By using the ion-beam-assisted sputter deposition method, the adhesion of hydroxy-apatite thin films to substrate has improved significantly and increased to a level comparable to Ti and Al oxide thin films. Relative atomic densities of Ca, P, O and H in hydroxy-apatite thin films were obtained using ion-beam analysis methods such as RBS, RE-RBS, ERDA, and PIXE. The relative concentrations of Ca, and P were affected by assisting-beam density, and stoichiometric films were obtained for certain assisting-beam current densities.

  19. HF treatment effect for carbon deposition on silicon (111) by DC sputtering technique

    SciTech Connect

    Aji, A. S. Darma, Y.

    2014-03-24

    Surface modifications of Si (111) substrate by HF solution for thin film carbon deposition have been systematically studied. Thin film carbon on Si (111) has been deposited using DC Unbalanced Magnetron Sputtering with carbon pellet doped by 5% Fe as the target. EDAX characterization confirmed that the carbon fraction on Si substrate much higher by dipping a clean Si substrate by HF solution before sputtering process in comparison with carbon fraction on Si substrate just after conventional RCA. Moreover, SEM and AFM images show the uniform thin film carbon on Si with HF treatment, in contrast to the Si without HF solution treatment. These experimental results suggest that HF treatment of Si surface provide Si-H bonds on top Si surface that useful to enhance the carbon deposition during sputtering process. Furthermore, we investigate the thermal stability of thin film carbon on Si by thermal annealing process up to 900 °C. Atomic arrangements during annealing process were characterized by Raman spectroscopy. Raman spectra indicate that thin film carbon on Si is remaining unchanged until 600 °C and carbon atoms start to diffuse toward Si substrate after annealing at 900 °C.

  20. Optimization of sputter deposition parameters for magnetostrictive Fe62Co19Ga19/Si(100) films

    NASA Astrophysics Data System (ADS)

    Jen, S. U.; Tsai, T. L.

    2012-04-01

    A good magnetostrictive material should have large saturation magnetostriction (λS) and low saturation (or anisotropy) field (HS), such that its magnetostriction susceptibility (SH) can be as large as possible. In this study, we have made Fe62Co19Ga19/Si(100) nano-crystalline films by using the dc magnetron sputtering technique under various deposition conditions: Ar working gas pressure (pAr) was varied from 1 to 15 mTorr; sputtering power (Pw) was from 10 to 120 W; deposition temperature (TS) was from room temperature (RT) to 300 °C, The film thickness (tf) was fixed at 175 nm. Each magnetic domain looked like a long leaf, with a long-axis of about 12-15 μm and a short-axis of about 1.5 μm. The optimal magnetic and electrical properties were found from the Fe62Co19Ga19 film made with the sputter deposition parameters of pAr = 5 mTorr, Pw = 80 W, and TS = RT. Those optimal properties include λS = 80 ppm, HS = 19.8 Oe, SH = 6.1 ppm/Oe, and electrical resistivity ρ = 57.0 μΩ cm. Note that SH for the conventional magnetostrictive Terfenol-D film is, in general, equal to 1.5 ppm/Oe only.

  1. High power pulsed magnetron sputtering: A method to increase deposition rate

    SciTech Connect

    Raman, Priya McLain, Jake; Ruzic, David N; Shchelkanov, Ivan A.

    2015-05-15

    High power pulsed magnetron sputtering (HPPMS) is a state-of-the-art physical vapor deposition technique with several industrial applications. One of the main disadvantages of this process is its low deposition rate. In this work, the authors report a new magnetic field configuration, which produces deposition rates twice that of conventional magnetron's dipole magnetic field configuration. Three different magnet pack configurations are discussed in this paper, and an optimized magnet pack configuration for HPPMS that leads to a higher deposition rate and nearly full-face target erosion is presented. The discussed magnetic field produced by a specially designed magnet assembly is of the same size as the conventional magnet assembly and requires no external fields. Comparison of deposition rates with different power supplies and the electron trapping efficiency in complex magnetic field arrangements are discussed.

  2. Structural and nanomechanical characterization of niobium films deposited by DC magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Li, X.; Cao, W. H.; Tao, X. F.; Ren, L. L.; Zhou, L. Q.; Xu, G. F.

    2016-05-01

    Nb thin films were deposited onto Si wafers by direct current (DC) magnetron sputtering at different deposition pressures. The microstructure and nanomechanical properties of Nb films were investigated by scanning electron microscope, X-ray diffractometer, transmission electron microscope, atomic force microscope and nanoindenter. The results revealed that the grain size, thickness, surface roughness, the reduced elastic modulus ( Er) and hardness ( H) values of Nb thin films increased at the pressure range of 0.61-0.68 Pa. Meanwhile, the porosity of Nb films decreased with the increase in deposition pressure. The lattice deformation of Nb thin films changed from negative to positive with the increase in deposition pressure. It is concluded that deposition pressure influences the microstructure and nanomechanical properties of Nb films.

  3. Ex situ and in situ catalyst deposition for CNT synthesis by RF-magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Scalese, S.; Scuderi, V.; Simone, F.; Pennisi, A.; Privitera, V.

    2008-05-01

    Radio frequency magnetron sputtering has been used for the synthesis of aligned carbon nanotubes (CNTs) on SiO 2/Si substrate. The results were obtained by depositing catalytic nano-particles in advance (ex situ) or simultaneously to the C deposition (in situ), which have been compared showing that the oxidation of the metal catalyst deposited in advance is detrimental for the good outcome of the CNTs growth. An in situ catalyst deposition allows to get rid of the contamination problem and to grow aligned CNTs on a substrate, as shown by scanning electron microscopy. Transmission electron microscopy shows that the so-achieved CNTs own a bamboo-like structure and the catalytic Ni nanoparticle is on the tip of the CNTs. Our method allows to perform catalyst deposition and growth of CNT on a SiO 2/Si substrate simultaneously and its use can be extended to a variety of catalytic elements and substrates, in principle without many efforts.

  4. Deuterium and helium release and microstructure of tungsten deposition layers formed by RF plasma sputtering

    SciTech Connect

    Katayama, K.; Imaoka, K.; Tokitani, M.; Miyamoto, M.; Nishikawa, M.; Fukada, S.; Yoshida, N.

    2008-07-15

    It is important to evaluate tritium behavior in tungsten deposition layers considering a long-term plasma operation. In this study, tungsten deposition layers were formed by deuterium or helium RF plasma sputtering. The release behavior of deuterium or helium from the layers were observed by a thermal desorption method. When a tungsten deposition layer does not contain oxygen, the retained deuterium is mainly released as D{sub 2}. When oxygen exists in the layer, the majority of deuterium is released as water vapor. Tungsten deposition layers have an amorphous structure and consist offline grain with size of 2-3 nm. Numerous bubbles are observed in the layers. A formation of tungsten deposition layer in a fusion reactor may make tritium control more difficult. (authors)

  5. Submicrometer Hollow Bioglass Cones Deposited by Radio Frequency Magnetron Sputtering: Formation Mechanism, Properties, and Prospective Biomedical Applications.

    PubMed

    Popa, A C; Stan, G E; Besleaga, C; Ion, L; Maraloiu, V A; Tulyaganov, D U; Ferreira, J M F

    2016-02-01

    This work reports on the unprecedented magnetron sputtering deposition of submicrometric hollow cones of bioactive glass at low temperature in the absence of any template or catalyst. The influence of sputtering conditions on the formation and development of bioglass cones was studied. It was shown that larger populations of well-developed cones could be achieved by increasing the argon sputtering pressure. A mechanism describing the growth of bioglass hollow cones is presented, offering the links for process control and reproducibility of the cone features. The composition, structure, and morphology of the as-synthesized hollow cones were investigated by energy dispersive spectroscopy (EDS), Fourier transform infrared spectroscopy (FTIR), grazing incidence geometry X-ray diffraction (GIXRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM)-selected area electron diffraction (SAED). The in vitro biological performance, assessed by degradation tests (ISO 10993-14) and cytocompatibility assays (ISO 10993-5) in endothelial cell cultures, was excellent. This allied with resorbability and the unique morphological features make the submicrometer hollow cones interesting candidate material devices for focal transitory permeabilization of the blood-brain barrier in the treatment of carcinoma and neurodegenerative disorders. PMID:26836256

  6. Biaxial texture development in aluminum nitride layers during off-axis sputter deposition

    SciTech Connect

    Deng Ruopeng; Muralt, Paul; Gall, Daniel

    2012-09-15

    Polycrystalline aluminum nitride (AlN) layers were deposited by pulsed-dc reactive magnetron sputtering from a variable deposition angle {alpha} = 0 Degree-Sign -84 Degree-Sign in 5 mTorr pure N{sub 2} at room temperature. X-ray diffraction pole figure analyses show that layers deposited from a normal angle ({alpha} = 0 Degree-Sign ) exhibit fiber texture, with a random in-plane grain orientation and the c-axis tilted by 42 Degree-Sign {+-} 2 Degree-Sign off the substrate normal, yielding wurtzite AlN grains with the {l_brace}1012{r_brace} plane approximately parallel ({+-}2 Degree-Sign ) to the substrate surface. However, as {alpha} is increased to 45 Degree-Sign , two preferred in-plane grain orientations emerge, with populations I and II having the c-axis tilted toward and away from the deposition flux, by 53 Degree-Sign {+-} 2 Degree-Sign and 47 Degree-Sign {+-} 1 Degree-Sign off the substrate normal, respectively. Increasing {alpha} further to 65 Degree-Sign and 84 Degree-Sign , results in the development of a single population II with a 43 Degree-Sign {+-} 1 Degree-Sign tilt. This developing biaxial texture is attributed to a competitive growth mode under conditions where the adatom mobility is sufficient to cause intergrain mass transport, but insufficient for the thermodynamically favored low energy {l_brace}0001{r_brace} planes to align parallel to the layer surface. Consequently, AlN nuclei are initially randomly oriented and form a kinetically determined crystal habit exposing {l_brace}0001{r_brace} and {l_brace}1120{r_brace} facets. The expected direction of its highest growth rate is 49 Degree-Sign {+-} 5 Degree-Sign tilted relative to the c-axis, in good agreement with the 42 Degree-Sign -53 Degree-Sign measured tilt. The in-plane preferred orientation for {alpha} > 0 Degree-Sign is well explained by the orientation dependence in the cross section of the asymmetric pyramidal nuclei to capture directional deposition flux. The observed tilt is ideal for

  7. Dielectric properties of fluorocarbon thin films deposited by radio frequency sputtering of polytetrafluoroethylene

    NASA Astrophysics Data System (ADS)

    Gonon, P.; Sylvestre, A.

    2002-10-01

    We investigate the dielectric properties of fluorocarbon thin films deposited by radio-frequency magnetron sputtering of polytetrafluroethylene. The dielectric constant and the loss factor are studied as a function of frequency (0.1 Hz-1 MHz, infrared frequencies) and temperature (room temperature to 100 °C). The value of the dielectric constant is 1.8 at optical frequencies, and around 2.3 in the 0.1 Hz-1 MHz range. The background loss factor is around 0.8% in these samples. Two different polarization mechanisms are identified (β and γ relaxations). The γ process dominates the dielectric constant from 0.1 to 1 MHz. In this frequency range the dielectric constant decreases with temperature (about -4% from room temperature to 100 °C). Temperature dependence of the dielectric constant is well described by a simple Debye model (linear variation of the dielectric constant with 1/T). The γ relaxation is tentatively ascribed to C-F bonds (Nμ2=4×10-32 C2 m-1). The β relaxation has a loss peak located at very low frequencies (<0.1 Hz). It leads to an increase of loss below 10 Hz when temperature is increased above 75 °C. The high-frequency part of the β loss peak decreases as ω-0.35. Study of its temperature dependence leads to an activation energy of 0.66 eV.

  8. Mechanical and Tribological Behavior of VN and HfN Films Deposited via Reactive Magnetron Sputtering

    NASA Astrophysics Data System (ADS)

    Escobar, C.; Villarreal, M.; Caicedo, J. C.; Esteve, J.; Prieto, P.

    2013-08-01

    HfN and VN thin films were deposited onto silicon and 4140 steel substrates with r.f. reactive magnetron sputtering by using Hf and V metallic targets with 4-inch diameter and 99.9% purity in argon/nitrogen atmosphere, applying a substrate temperature of 250°C and a pressure of 1.2 × 10-3 mbar. In order to evaluate the structural, chemical, morphological, mechanical and tribological properties, we used X-ray diffraction (XRD), transmission electron microscopy (TEM), energy dispersive X-ray analysis (EDX), atomic force microscopy (AFM), scanning electron microscopy (SEM), nanoindentation, pin-on-disc and scratch tests. Film structure determined by XRD showed that FCC (NaCl-type) films are formed in both the cases by δ-HfN and δ-VN phases. Hardness and elastic modulus values obtained for both the films were 21 and 224 GPa for the HfN film and 19 and 205 GPa for the VN film, respectively. Additionally, the films showed low friction coefficient of 0.44 for HfN and 0.62 for VN when these films were evaluated against 100 Cr6 steel, and finally the critical load was found at 41 N for the HfN film and 34 N for the VN film.

  9. Synthesis of ZnO:As Films Using Off-Axis Sputtering Deposition

    NASA Technical Reports Server (NTRS)

    Zhu, Shen; Su, Ching-Hua; Lehoczky, S. L.; Rose, M. Franklin (Technical Monitor)

    2001-01-01

    As a novel oxide semiconductor material, ZnO is interesting for use in many applications. For fabricating electronic devices, it is important to have n- and p- type ZnO materials. Arsenic has been proven to be one of the p-type dopants for ZnO materials. However, information in studying the ZnAsO ternary compound films has been scarce. In order to investigate the morphology, structure and electrical properties of ZnAsO ternary compounds, ZnO:As films have been synthesized using off-axis sputtering deposition on various substrates including (100) Si and (0001) sapphire crystals. Films are grown under various growth conditions. ZnO:As targets with the atomic weight ratios of arsenic to zinc from 0.01 to 0.10 are used for film synthesis. The growth temperatures and pressures range from 350 to 550C and 5 to 150 mTorr, respectively. Argon to oxygen gas ratio for film growth is varied to examine the film quality as well. Film surface morphology, crystal structure, and compositions, are characterized using atomic force microscopy, x-ray diffraction, and energy dispersive spectroscopy, respectively. The compositions of target material and ZnO:As films grown under various conditions are then assessed. The electrical properties were also measured. The detail of these measurements will be discussed in the presentation.

  10. Structural and compositional characterization of RF sputter-deposited Ni-Cr + Cr2O3 films

    NASA Technical Reports Server (NTRS)

    Bhushan, B.

    1980-01-01

    An RF-sputtered chrome oxide coating with metallic binders was developed. The chrome oxide coating has high-temperature capabilities and is wear resistant, and has some self-lubricating properties. A nichrome metallic binder was added in the coating to improve its ductility without significant loss in the hardness. The sputtering parameters were optimized to obtain a smooth coating with the maximum adherence. The coatings were applied using bias-sputter and sputter-deposit modes on the heat treated and annealed foil substrates. The coating applied on annealed foils using the sputter-deposit mode was smooth and had the best adherence. Metallurgical examinations showed that the coating was Ni-Cr + Cr2O3. The coating as applied was amorphous and it crystallized during substrate heat treatment.

  11. Sputtering effect of low-energy ions on biological target: The analysis of sputtering product of urea and capsaicin

    NASA Astrophysics Data System (ADS)

    Zhang, Lili; Xu, Xue; Wu, Yuejin

    2013-08-01

    Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. Recent years, ion implantation was successfully applied to biological research based on the fragments sputtering and form open paths in cell structure caused by ion sputtering. In this study, we focused on urea and chilli pepper pericarp samples implanted with N+ and Ar+ ions. To investigate the sputtering effect, we designed a collecting unit containing a disk sample and a glass pipe. The urea content and capsaicin content recovered from glass pipes were adopted to represent the sputtering product. The result of urea showed that the sputtering effect is positively correlated with the ion energy and dose, also affected by the ion type. The result of capsaicin was different from that of urea at 20 keV and possibly due to biological complex composition and structure. Therefore the sputtering yield depended on both the parameters of incident ions and the state of target materials. The sputtering yield of urea was also simulated by computational method achieved through the TRIM program. The trajectories of primary and recoiled atoms were calculated on the basis of the binary collision approximation using Monte Carlo method. The experimental results were much higher than the calculated results. The possible explanation is that in the physical model the target were assumed as a disordered lattice and independent atoms, which is much less complicated than that of the biological models.

  12. Titanium Aluminum Nitride Films Deposited by AC Reactive Magnetron Sputtering: Study of Positioning Effect in an Inverted Cylindrical Magnetron Sputtering System

    NASA Astrophysics Data System (ADS)

    Vandross, George Clinton, II

    TiAlN films were deposited on glass substrates by AC magnetron sputtering at 2 kW with constant Argon and Nitrogen gas flow rates to study the effects of positioning on the deposited films. The deposition system used was an ICM-10 IsoFlux cylindrical magnetron sputtering chamber. The samples were placed in different positions and tilts with respect to the location of the Titanium and Aluminum targets in the chamber. It was found that with change in position and application of tilts, deposited films acquired different physical and chemical properties. It is believed that the differences in these properties were caused by to the change in the incident angle of bombardment of the samples, and the change in surface areas of the samples presented to the targets at each location. As related to the physical traits of the samples, analysis using Scanning Electron Microscopy of the samples displayed variations in the topography, where differences in grain density could be noted as well as structure formations. The chemical properties were also noted to be affected by the variation of tilt and position applied to the sample. X-ray Diffraction Spectroscopy analysis of the samples showed the intensity of the TiAlN characteristic peak of the samples to differ from sample to sample. Results from the XRD analysis of this work showed a 157% and 176% increase in peak intensity of the 0° tilt sample of the Bottom Plate from the 45° tilt sample and 60° tilt sample respectively of the same plate. The results from the XRD analysis of this work also showed a 74% and 151% increase of the peak intensity for the 0° tilt sample of the Middle Plate when compared to the 45° tilt sample and 60° tilt sample respectively of the same plate. Whereas results for this work showed a 54% and 41% decrease in peak intensity of the 0° tilt sample of the Top Plate from the 45° tilt sample and 60° tilt sample respectively of the same plate. Energy Dispersive X-ray Spectroscopy was also performed

  13. Fabrication of nanobaskets by sputter deposition on porous substrates and uses thereof

    NASA Technical Reports Server (NTRS)

    Johnson, Paige Lea (Inventor); Teeters, Dale (Inventor)

    2010-01-01

    A method of producing a nanobasket and the applications or uses thereof. The method includes the steps of providing a substrate with at least one (1) pore having diameters of about one (1) nanometer to about ten (10) micrometers. Material is deposited by sputter-coating techniques along continuous edges of the pores to form a capped or partially capped nanotube or microtube structure, termed a nanobasket. Either a single material may be used to form nanobaskets over the pores or, alternately, a layered structure may be created wherein an initial material is deposited followed by one or more other materials to form nanobaskets over the pores.

  14. Adherence of ion beam sputter deposited metal films on H-13 steel

    NASA Technical Reports Server (NTRS)

    Mirtich, M. J.

    1980-01-01

    An electron bombardment argon ion source was used to sputter deposit 17 different metal and metal oxide films ranging in thickness from 1 to 8 micrometers on H-13 steel substrates. The film adherence to the substrate surface was measured using a tensile test apparatus. Comparisons in bond strength were made between ion beam, ion plating, and RF deposited films. A protective coating to prevent heat checking in H-13 steel dies used for aluminum die casting was studied. The results of exposing the coated substrates to temperatures up to 700 degrees are presented.

  15. On the phase formation of titanium oxide thin films deposited by reactive DC magnetron sputtering: influence of oxygen partial pressure and nitrogen doping

    NASA Astrophysics Data System (ADS)

    Pandian, Ramanathaswamy; Natarajan, Gomathi; Rajagopalan, S.; Kamruddin, M.; Tyagi, A. K.

    2014-09-01

    This work describes about the control on phase formation in titanium oxide thin films deposited by reactive dc magnetron sputtering. Various phases of titanium oxide thin films were deposited by controlling the oxygen partial pressure during the sputtering process. By adding nitrogen gas to sputter gas mixture of oxygen and argon, the oxygen partial pressure was decreased further below the usual critical value, below and above which the sputtering yields metallic and oxide films, respectively. Furthermore, nitrogen addition eliminated the typical hysteretic behaviour between the flow rate and oxygen partial pressure, and significantly influenced the sputter rate. On increasing the oxygen partial pressure, the ratio between anatase and rutile fraction and grain size increases. The fracture cross-sectional scanning electron microscopy together with the complementary information from X-ray diffraction and micro-Raman investigations revealed the evolution and spatial distribution of the anatase and rutile phases. Both the energy delivered to the growing film and oxygen vacancy concentrations are correlated with the formation of various phases upon varying the oxygen partial pressure.

  16. RF reactive sputter deposition and characterization of transparent CuAlO2 thin films

    NASA Astrophysics Data System (ADS)

    Lu, Y. M.; He, Y. B.; Yang, B.; Polity, A.; Volbers, N.; Neumann, C.; Hasselkamp, D.; Meyer, B. K.

    2006-09-01

    CuAlO2 thin films have been prepared on quartz glass and sapphire substrates by radio-frequency (RF) reactive sputtering using a CuAlO2 ceramic target. The deposition process was optimized by varying the sputter parameters, such as the substrate temperature and the oxygen flow. In addition a post-growth annealing has been carried out. X-ray diffraction (XRD) revealed that the as-sputtered films are amorphous, and crystallize in the delafossite-type CuAlO2 or in a phase mixture of CuAlO2 and CuAl2O4 after annealing in air at 1100°C. The surface morphology of the films was characterized by scanning electron microscopy (SEM). The as-grown films are nearly stoichiometric in terms of Cu to Al ratio and have good depth homogeneity as examined by Rutherford backscattering spectroscopy (RBS) and secondary ion mass spectroscopy (SIMS), respectively. The optical bandgap of the films was estimated by wavelength-dependent transmission measurements at room temperature, which revealed a direct bandgap of 3.38 and 3.80 eV for the as-sputtered and post-growth annealed CuAlO2 films, respectively.

  17. Electrochemical properties of sputter-deposited MoO{sub 3} films in lithium microbatteries

    SciTech Connect

    Ramana, C. V.; Atuchin, V. V.; Groult, H.; Julien, C. M.

    2012-07-15

    Molybdenum oxide (MoO{sub 3}) films were prepared by magnetron sputtering using an Mo target. The films were sputtered in the reactive atmosphere of an argon-oxygen gas mixture under various substrate temperatures, T{sub s}, and oxygen partial pressures, p(O{sub 2}). The effects of the growth conditions on the microstructure were examined using reflection high-energy electron diffraction and x-ray photoelectron spectroscopy. The analyses indicate that stoichiometric and polycrystalline MoO{sub 3} films were obtained at T{sub s} = 445 Degree-Sign C and p(O{sub 2}) = 61%. The applicability of the sputtered MoO{sub 3} films for lithium microbattery application has been demonstrated. The discharge-charge profiles, the kinetics of lithium intercalation process in the film, and the cycling behavior have been investigated in detail to understand the effect of microstructure on the electrochemical performance.

  18. Synthesis of gold nanoparticles in a biocompatible fluid from sputtering deposition onto castor oil.

    PubMed

    Wender, Heberton; de Oliveira, Luciane F; Feil, Adriano F; Lissner, Elíseo; Migowski, Pedro; Meneghetti, Mario R; Teixeira, Sérgio R; Dupont, Jairton

    2010-10-01

    The sputtering of Au targets onto castor oil generates stable spherical gold nanoparticles (AuNPs) of 2.4 to 3.8 nm. The AuNP size increases with the discharge voltage and the mechanism of nucleation and growth are related to the energy of the atoms/clusters ejected from the target. PMID:20737077

  19. Binding energy effects in cascade evolution and sputtering

    SciTech Connect

    Robinson, M.T.

    1995-06-01

    The MARLOWE model was extended to include a binding energy dependent on the local crystalline order, so that atoms are bound less strongly to their lattice sites near surfaces or associated damage. Sputtering and cascade evolution were studied on the examples of self-ion irradiations of Cu and Au monocrystals. In cascades, the mean binding energy is reduced {approximately}8% in Cu with little dependence on the initial recoil energy; in Au, it is reduced {approximately}9% at 1 keV and {approximately}15% at 100 keV. In sputtering, the mean binding energy is reduced {approximately}8% in Cu and {approximately}15% in Au with little energy dependence; the yields are increased about half as much. Most sites from which sputtered atoms originate are isolated in both metals. Small clusters of such sites occur in Cu, but there are some large clusters in Au, especially in [111] targets. There are always more large clusters with damage-dependent binding than with a constant binding energy, but only a few clusters are compact enough to be regarded as pits.

  20. Energy distributions of sputtered copper neutrals and ions

    NASA Technical Reports Server (NTRS)

    Lundquist, T. R.

    1978-01-01

    Direct quantitative analysis of surfaces by secondary ion mass spectrometry will depend on an understanding of the yield ratio of ions to neutrals. This ratio as a function of the energy of the sputtered particles has been obtained for a clean polycrystalline copper surface sputtered by 1000-3000 eV Ar(+). The energy distributions of both neutral and ionized copper were measured with a retarding potential analyzer using potential modulation differentiation and signal averaging. The maximum for both distributions is identical and occurs near 2.5 eV. The energy distributions of neutrals is more sharply peaked than that of the ions, presumably as a consequence of more efficient nutralization of slow escaping ions by the mobile electrons of copper. The ion-neutral ratio is compared with results from various ionization models.

  1. Chemical and physical sputtering effects on the surface morphology of carbon films grown by plasma chemical vapor deposition

    SciTech Connect

    Vazquez, Luis

    2009-08-01

    We have studied the influence of chemical and physical sputtering on the surface morphology of hydrogenated carbon films deposited on silicon substrates by bias-enhanced electron cyclotron resonance chemical vapor deposition. Atomic force microscopy based power spectrum density (PSD) and roughness analysis have been used to investigate the film morphology. This study has been possible due to the appropriate choice of the experimental variables, in particular, gas mixture, resulting in either nitrogen-free (a-C:H) or nitrogenated carbon (a-CN:H) films, and substrate bias (V{sub b}). Under these conditions, chemical sputtering is present for a-CN:H deposition but it is negligible for a-C:H film growth, while physical sputtering processes appear for both systems for V{sub b}<=-85 V. When physical sputtering does not operate, the film growth with simultaneous chemical sputtering leads to a characteristic a-CN:H granular surface morphology. Furthermore, PSD analysis reveals that a spatial correlation of the a-CN:H film surface roughness, up to distances approx300 nm, becomes a fingerprint of the coexistence of growth and chemical erosion processes on the film morphology. However, once physical sputtering takes place, the influence of chemical sputtering by reactive nitrogen species on the final surface morphology becomes negligible and both a-CN:H and a-C:H film morphologies are ultrasmooth.

  2. Intrinsic anomalous surface roughening of TiN films deposited by reactive sputtering

    SciTech Connect

    Auger, M. A.; Vazquez, L.; Sanchez, O.; Cuerno, R.; Castro, M.; Jergel, M.

    2006-01-15

    We study surface kinetic roughening of TiN films grown on Si(100) substrates by dc reactive sputtering. The surface morphology of films deposited for different growth times under the same experimental conditions were analyzed by atomic force microscopy. The TiN films exhibit intrinsic anomalous scaling and multiscaling. The film kinetic roughening is characterized by a set of local exponent values {alpha}{sub loc}=1.0 and {beta}{sub loc}=0.39, and global exponent values {alpha}=1.7 and {beta}=0.67, with a coarsening exponent of 1/z=0.39. These properties are correlated to the local height-difference distribution function obeying power-law statistics. We associate this intrinsic anomalous scaling with the instability due to nonlocal shadowing effects that take place during thin-film growth by sputtering.

  3. Properties of AlN films deposited by reactive ion-plasma sputtering

    SciTech Connect

    Bert, N. A.; Bondarev, A. D.; Zolotarev, V. V.; Kirilenko, D. A.; Lubyanskiy, Ya. V.; Lyutetskiy, A. V.; Slipchenko, S. O.; Petrunov, A. N.; Pikhtin, N. A. Ayusheva, K. R.; Arsentyev, I. N.; Tarasov, I. S.

    2015-10-15

    The properties of SiO{sub 2}, Al{sub 2}O{sub 3}, and AlN dielectric coatings deposited by reactive ion-plasma sputtering are studied. The refractive indices of the dielectric coatings are determined by optical ellipsometry. It is shown that aluminum nitride is the optimal material for achieving maximum illumination of the output mirror of a semiconductor laser. A crystalline phase with a hexagonal atomic lattice and oxygen content of up to 10 at % is found by transmission electron microscopy in the aluminum-nitride films. It is found that a decrease in the concentration of residual oxygen in the chamber of the reactive ion-plasma sputtering installation makes it possible to eliminate the appearance of vertical pores in the bulk of the aluminum-nitride film.

  4. Hall mobility of cuprous oxide thin films deposited by reactive direct-current magnetron sputtering

    SciTech Connect

    Lee, Yun Seog; Winkler, Mark T.; Siah, Sin Cheng; Brandt, Riley; Buonassisi, Tonio

    2011-05-09

    Cuprous oxide (Cu{sub 2}O) is a promising earth-abundant semiconductor for photovoltaic applications. We report Hall mobilities of polycrystalline Cu{sub 2}O thin films deposited by reactive dc magnetron sputtering. High substrate growth temperature enhances film grain structure and Hall mobility. Temperature-dependent Hall mobilities measured on these films are comparable to monocrystalline Cu{sub 2}O at temperatures above 250 K, reaching 62 cm{sup 2}/V s at room temperature. At lower temperatures, the Hall mobility appears limited by carrier scattering from ionized centers. These observations indicate that sputtered Cu{sub 2}O films at high substrate growth temperature may be suitable for thin-film photovoltaic applications.

  5. Surface treatment effect on Si (111) substrate for carbon deposition using DC unbalanced magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Aji, A. S.; Sahdan, M. F.; Hendra, I. B.; Dinari, P.; Darma, Y.

    2015-04-01

    In this work, we studied the effect of HF treatment in silicon (111) substrate surface for depositing thin layer carbon. We performed the deposition of carbon by using DC Unbalanced Magnetron Sputtering with carbon pallet (5% Fe) as target. From SEM characterization results it can be concluded that the carbon layer on HF treated substrate is more uniform than on substrate without treated. Carbon deposition rate is higher as confirmed by AFM results if the silicon substrate is treated by HF solution. EDAX characterization results tell that silicon (111) substrate with HF treatment have more carbon fraction than substrate without treatment. These results confirmed that HF treatment on silicon Si (111) substrates could enhance the carbon deposition by using DC sputtering. Afterward, the carbon atomic arrangement on silicon (111) surface is studied by performing thermal annealing process to 900 °C. From Raman spectroscopy results, thin film carbon is not changing until 600 °C thermal budged. But, when temperature increase to 900 °C, thin film carbon is starting to diffuse to silicon (111) substrates.

  6. Phase, grain structure, stress, and resistivity of sputter-deposited tungsten films

    SciTech Connect

    Choi, Dooho; Wang, Bincheng; Chung, Suk; Liu Xuan; Darbal, Amith; Wise, Adam; Nuhfer, Noel T.; Barmak, Katayun; Warren, Andrew P.; Coffey, Kevin R.; Toney, Michael F.

    2011-09-15

    Sputter-deposited W films with nominal thicknesses between 5 and 180 nm were prepared by varying the base pressure prior to film deposition and by including or not including sputtered SiO{sub 2} encapsulation layers. X-ray and electron diffraction studies showed that single phase, polycrystalline {alpha}-W could be achieved in as-deposited films as thin as 5 nm. The stress state in the as-deposited films was found to be inhomogeneous. Annealing resulted in stress relaxation and reduction of resistivity for all films, except the thinnest, unencapsulated film, which agglomerated. In-plane film grain sizes measured for a subset of the annealed films with thicknesses between 5 and 180 nm surprisingly showed a near constant value (101-116 nm), independent of film thickness. Thick-film ({>=}120 nm) resistivity values as low as 8.6 {mu}{Omega} cm at 301 K were obtained after annealing at 850 deg. C for 2 h. Film resistivities were found to increase with decreasing film thicknesses below 120 nm, even for films which are fully A2 {alpha}-W with no metastable, A15 {beta}-W evident.

  7. Surface treatment effect on Si (111) substrate for carbon deposition using DC unbalanced magnetron sputtering

    SciTech Connect

    Aji, A. S. Sahdan, M. F.; Hendra, I. B.; Dinari, P.; Darma, Y.

    2015-04-16

    In this work, we studied the effect of HF treatment in silicon (111) substrate surface for depositing thin layer carbon. We performed the deposition of carbon by using DC Unbalanced Magnetron Sputtering with carbon pallet (5% Fe) as target. From SEM characterization results it can be concluded that the carbon layer on HF treated substrate is more uniform than on substrate without treated. Carbon deposition rate is higher as confirmed by AFM results if the silicon substrate is treated by HF solution. EDAX characterization results tell that silicon (111) substrate with HF treatment have more carbon fraction than substrate without treatment. These results confirmed that HF treatment on silicon Si (111) substrates could enhance the carbon deposition by using DC sputtering. Afterward, the carbon atomic arrangement on silicon (111) surface is studied by performing thermal annealing process to 900 °C. From Raman spectroscopy results, thin film carbon is not changing until 600 °C thermal budged. But, when temperature increase to 900 °C, thin film carbon is starting to diffuse to silicon (111) substrates.

  8. Microscopic structure and electrical transport property of sputter-deposited amorphous indium-gallium-zinc oxide semiconductor films

    NASA Astrophysics Data System (ADS)

    Yabuta, H.; Kaji, N.; Shimada, M.; Aiba, T.; Takada, K.; Omura, H.; Mukaide, T.; Hirosawa, I.; Koganezawa, T.; Kumomi, H.

    2014-06-01

    We report on microscopic structures and electrical and optical properties of sputter-deposited amorphous indium-gallium-zinc oxide (a-IGZO) films. From electron microscopy observations and an x-ray small angle scattering analysis, it has been confirmed that the sputtered a-IGZO films consist of a columnar structure. However, krypton gas adsorption measurement revealed that boundaries of the columnar grains are not open-pores. The conductivity of the sputter-deposited a-IGZO films shows a change as large as seven orders of magnitude depending on post-annealing atmosphere; it is increased by N2-annealing and decreased by O2-annealing reversibly, at a temperature as low as 300°C. This large variation in conductivity is attributed to thermionic emission of carrier electrons through potential barriers at the grain boundaries, because temperature dependences of the carrier density and the Hall mobility exhibit thermal activation behaviours. The optical band-gap energy of the a-IGZO films changes between before and after annealing, but is independent of the annealing atmosphere, in contrast to the noticeable dependence of conductivity described above. For exploring other possibilities of a-IGZO, we formed multilayer films with an artificial periodic lattice structure consisting of amorphous InO, GaO, and ZnO layers, as an imitation of the layer-structured InGaZnO4 homologous phase. The hall mobility of the multilayer films was almost constant for thicknesses of the constituent layer between 1 and 6 Å, suggesting rather small contribution of lateral two-dimensional conduction It increased with increasing the thickness in the range from 6 to 15 Å, perhaps owing to an enhancement of two-dimensional conduction in InO layers.

  9. Internal energies of ion-sputtered neutral tryptophan and thymine molecules determined by vacuum ultraviolet photoionization.

    PubMed

    Zhou, Jia; Takahashi, Lynelle K; Wilson, Kevin R; Leone, Stephen R; Ahmed, Musahid

    2010-05-01

    Vacuum ultraviolet photoionization coupled to secondary neutral mass spectrometry (VUV-SNMS) of deposited tryptophan and thymine films are performed at the Chemical Dynamics Beamline. The resulting mass spectra show that while the intensity of the VUV-SNMS signal is lower than the corresponding secondary ion mass spectroscopy (SIMS) signal, the mass spectra are significantly simplified in VUV-SNMS. A detailed examination of tryptophan and thymine neutral molecules sputtered by 25 keV Bi(3)(+) indicates that the ion-sputtered parent molecules have approximately 2.5 eV of internal energy. While this internal energy shifts the appearance energy of the photofragment ions for both tryptophan and thymine, it does not change the characteristic photoionizaton efficiency (PIE) curves of thymine versus photon energy. Further analysis of the mass spectral signals indicate that approximately 80 neutral thymine molecules and 400 tryptophan molecules are sputtered per incident Bi(3)(+) ion. The simplified mass spectra and significant characteristic ion contributions to the VUV-SNMS spectra indicate the potential power of the technique for organic molecule surface analysis. PMID:20353160

  10. Internal Energies of Ion-Sputtered Neutral Tryptophan and Thymine Molecules Determined by Vacuum Ultraviolet Photoionization

    SciTech Connect

    Zhou, Jia; Takahashi, Lynelle; Wilson, Kevin R.; Leone, Stephen R.; Ahmed, Musahid

    2010-03-11

    Vacuum ultraviolet photoionization coupled to secondary neutral mass spectrometry (VUV-SNMS) of deposited tryptophan and thymine films are performed at the Chemical Dynamics Beamline. The resulting mass spectra show that while the intensity of the VUV-SNMS signal is lower than the corresponding secondary ion mass spectroscopy (SIMS) signal, the mass spectra are significantly simplified in VUV-SNMS. A detailed examination of tryptophan and thymine neutral molecules sputtered by 25 keV Bi3 + indicates that the ion-sputtered parent molecules have ~;;2.5 eV of internal energy. While this internal energy shifts the appearance energy of the photofragment ions for both tryptophan and thymine, it does not change the characteristic photoionizaton efficiency (PIE) curves of thymine versus photon energy. Further analysis of the mass spectral signals indicate that approximately 80 neutral thymine molecules and 400 tryptophan molecules are sputtered per incident Bi3 + ion. The simplified mass spectra and significant characteristic ion contributions to the VUV-SNMS spectra indicate the potential power of the technique for organic molecule surface analysis.

  11. c-axis orientation and piezoelectric coefficients of AlN thin films sputter-deposited on titanium bottom electrodes

    NASA Astrophysics Data System (ADS)

    Ababneh, A.; Alsumady, M.; Seidel, H.; Manzaneque, T.; Hernando-García, J.; Sánchez-Rojas, J. L.; Bittner, A.; Schmid, U.

    2012-10-01

    Aluminum nitride (AlN) reactively sputter deposited from an aluminum target is an interesting compound material due to its CMOS compatible fabrication process and its piezoelectric properties. To obtain high piezoelectric coefficients it is a necessary pre-request to synthesize films with c-axis orientation. Besides the influence of sputter conditions on the microstructure of AlN thin films the condition of the substrate surface is another important factor of utmost importance. In this study, the influence of 350 nm thick titanium metallization DC sputter-deposited on SiO2/Si substrates at varying back pressure levels bp,Ti in the range of 2 × 10-3 to 14 × 10-3 mbar on the c-axis orientation and the piezoelectric coefficients of 600 nm thick AlN thin films is investigated. Besides the plasma power for Ti deposition (Pp,Ti = 100 W) the parameters for AlN synthetization are fixed to Pp = 1000 W and bp,AlN = 4 × 10-3 mbar in 100% N2 atmosphere. Basically, the surface roughness of the Ti bottom layer is the dominating factor resulting either in a high degree of c-axis orientation (i.e. at low bp,Ti values) or in an amorphous AlN microstructure (i.e. at high bp,Ti values). Under low pressure conditions, a smooth and dense surface characteristics is achieved due to a higher kinetic energy associated with the adatoms what is especially important at nominally unheated substrate conditions. The piezoelectric coefficient d33 decreases from 2.55 to 1.7 pm -1 when increasing the titanium sputter pressure from 2 × 10-3 to 14 × 10-3 mbar. When decreasing the Ti film thickness to 60 nm and hence, reducing the root mean square roughness by a factor of about 2, the intensity associated with the AlN (0 0 2) peak is increased by a factor of about 1.7 demonstrating the direct impact. Furthermore, the highest values for d33 and d31 (i.e. 3.15 pm V-1 and -1.28 pm V-1) are determined.

  12. Photocatalytic activity of bipolar pulsed magnetron sputter deposited TiO2/TiWOx thin films

    NASA Astrophysics Data System (ADS)

    Weng, Ko-Wei; Hu, Chung-Hsuan; Hua, Li-Yu; Lee, Chin-Tan; Zhao, Yu-Xiang; Chang, Julian; Yang, Shu-Yi; Han, Sheng

    2016-08-01

    Titanium oxide films were formed by sputtering and then TiWOx films were deposited by bipolar pulsed magnetron sputtering with pure titanium and tungsten metal targets. The sputtering of titanium oxide with tungsten enhanced the orientation of the TiO2 (1 0 1) plane of the specimen assemblies. The main varying parameter was the tungsten pulse power. Titanium oxide sputtered with tungsten using a pulsing power of 50 W exhibited a superior hydrophilic property, and a contact angle of 13.1°. This fabrication conditions maximized the photocatalytic decomposition of methylene blue solution. The mechanism by which the titanium oxide was sputtered with tungsten involves the photogeneration of holes and electron traps, inhibiting the hole-electron recombination, enhancing hydrophilicity and reducing the contact angle.

  13. Raman spectroscopy of copper oxide films deposited by reactive magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Levitskii, V. S.; Shapovalov, V. I.; Komlev, A. E.; Zav'yalov, A. V.; Vit'ko, V. V.; Komlev, A. A.; Shutova, E. S.

    2015-11-01

    Raman spectroscopy has been used to study the influence of partial oxygen pressure during deposition and isothermal treatment on the chemical composition of copper oxide films deposited by reactive dc magnetron sputtering of copper target in a reactive gaseous medium. Three series of films deposited at various partial oxygen pressures (from 0.06 to 0.16 mTorr) possessed different chemical compositions. The subsequent thermal treatment of all samples was performed for 30 min in air at a constant temperature in a 300?500°C interval. An increase in the annealing temperature led to chemical changes in the films. After isothermal treatment at 450°C, the films in all series acquired stoichiometric CuO composition.

  14. Microstructure and optoelectronic properties of galliumtitanium-zinc oxide thin films deposited by magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Chen, Shou-bu; Lu, Zhou; Zhong, Zhi-you; Long, Hao; Gu, Jin-hua; Long, Lu

    2016-07-01

    Gallium-titanium-zinc oxide (GTZO) transparent conducting oxide (TCO) thin films were deposited on glass substrates by radio frequency magnetron sputtering. The dependences of the microstructure and optoelectronic properties of GTZO thin films on Ar gas pressure were observed. The X-ray diffraction (XRD) and scanning electron microscopy (SEM) results show that all the deposited films are polycrystalline with a hexagonal structure and have a preferred orientation along the c-axis perpendicular to the substrate. With the increment of Ar gas pressure, the microstructure and optoelectronic properties of GTZO thin films will be changed. When Ar gas pressure is 0.4 Pa, the deposited films possess the best crystal quality and optoelectronic properties.

  15. Development of mid-frequency AC reactive magnetron sputtering for fast deposition of Y2O3 buffer layers

    NASA Astrophysics Data System (ADS)

    Xiong, Jie; Xia, Yudong; Xue, Yan; Zhang, Fei; Guo, Pei; Zhao, Xiaohui; Tao, Bowan

    2014-02-01

    A reel-to-reel magnetron sputtering system with mid-frequency alternating current (AC) power supply was used to deposit double-sided Y2O3 seed layer on biaxially textured Ni-5 at.%W tape for YBa2Cu3O7-δ coated conductors. A reactive sputtering process was carried out using two opposite symmetrical sputtering guns with metallic yttrium targets and water vapor for oxidizing the sputtered metallic atoms. The voltage control mode of the power supply was used and the influence of the cathode voltage and ArH2 pressure were systematically investigated. Subsequently yttrium-stabilized zirconia (YSZ) barrier and CeO2 cap layers were deposited on the Y2O3 buffered substrates in sequence, indicating high quality and uniform double-sided structure and surface morphology of such the architecture.

  16. Bimodal substrate biasing to control γ-Al{sub 2}O{sub 3} deposition during reactive magnetron sputtering

    SciTech Connect

    Prenzel, Marina; Kortmann, Annika; Stein, Adrian; Keudell, Achim von; Nahif, Farwah; Schneider, Jochen M.

    2013-09-21

    Al{sub 2}O{sub 3} thin films have been deposited at substrate temperatures between 500 °C and 600 °C by reactive magnetron sputtering using an additional arbitrary substrate bias to tailor the energy distribution of the incident ions. The films were characterized by X-ray diffraction and Fourier transform infrared spectroscopy. The film structure being amorphous, nanocrystalline, or crystalline was correlated with characteristic ion energy distributions. The evolving crystalline structure is connected with different levels of displacements per atom (dpa) in the growing film as being derived from TRIM simulations. The boundary between the formation of crystalline films and amorphous or nanocrystalline films was at 0.8 dpa for a substrate temperature of 500 °C. This threshold shifts to 0.6 dpa for films grown at 550 °C.

  17. ZnO/Ag sputtering deposition on a-Si solar cells

    SciTech Connect

    Hayashi, Katsuhiko; Kondo, Masataka; Ishikawa, Atsuo; Yamagishi, Hideo

    1994-12-31

    In order to produce large area amorphous silicon solar cell modules and to simplify the module production process, a continuous ZnO/Ag sputtering deposition process has been applied. The authors found that by means of a continuous ZnO/Ag sputtering deposition method an adhesive a-Si/electrode contact can be realized. They compared short circuit currents of Al,ZnO/Al and ZnO/Ag back side contact cells and confirmed short circuit current increase by application of ZnO/Ag back side contact. They found that the series resistance is severely dependent on the conditions during the first stage of ZnO deposition. They confirmed the reliability of ZnO/Ag structure as the back side contact through high temperature high humidity test. After 310 hours accelerated light induced degradation test which corresponds to one year light exposure the 100cm2 integrated a-Si tandem solar cell kept the efficiency higher than 8.5%.

  18. Enhanced deposition of ZnO films by Li doping using radio frequency reactive magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Chen, Liang-xian; Liu, Sheng; Li, Cheng-ming; Wang, Yi-chao; Liu, Jin-long; Wei, Jun-jun

    2015-10-01

    Radio frequency (RF) reactive magnetron sputtering was utilized to deposit Li-doped and undoped zinc oxide (ZnO) films on silicon wafers. Various Ar/O2 gas ratios by volume and sputtering powers were selected for each deposition process. The results demonstrate that the enhanced ZnO films are obtained via Li doping. The average deposition rate for doped ZnO films is twice more than that of the undoped films. Both atomic force microscopy and scanning electron microscopy studies indicate that Li doping significantly contributes to the higher degree of crystallinity of wurtzite-ZnO. X-ray diffraction analysis demonstrates that Li doping promotes the (002) preferential orientation in Li-doped ZnO films. However, an increase in the ZnO lattice constant, broadening of the (002) peak and a decrease in the peak integral area are observed in some Li-doped samples, especially as the form of Li2O. This implies that doping with Li expands the crystal structure and thus induces the additional strain in the crystal lattice. The oriented-growth Li-doped ZnO will make significant applications in future surface acoustic wave devices.

  19. Three-Dimensional, Fibrous Lithium Iron Phosphate Structures Deposited by Magnetron Sputtering.

    PubMed

    Bünting, Aiko; Uhlenbruck, Sven; Sebold, Doris; Buchkremer, H P; Vaßen, R

    2015-10-14

    Crystalline, three-dimensional (3D) structured lithium iron phosphate (LiFePO4) thin films with additional carbon are fabricated by a radio frequency (RF) magnetron-sputtering process in a single step. The 3D structured thin films are obtained at deposition temperatures of 600 °C and deposition times longer than 60 min by using a conventional sputtering setup. In contrast to glancing angle deposition (GLAD) techniques, no tilting of the substrate is required. Thin films are characterized by X-ray diffraction (XRD), Raman spectrospcopy, scanning electron microscopy (SEM), cyclic voltammetry (CV), and galvanostatic charging and discharging. The structured LiFePO4+C thin films consist of fibers that grow perpendicular to the substrate surface. The fibers have diameters up to 500 nm and crystallize in the desired olivine structure. The 3D structured thin films have superior electrochemical properties compared with dense two-dimensional (2D) LiFePO4 thin films and are, hence, very promising for application in 3D microbatteries. PMID:26381359

  20. Glancing angle sputter deposited nanostructures on rotating substrates: Experiments and simulations

    SciTech Connect

    Patzig, C.; Karabacak, T.; Fuhrmann, B.; Rauschenbach, B.

    2008-11-01

    Ordered arrays of Si nanorods and nanospirals have been produced by ion beam sputter glancing angle deposition of Si on rotating substrates. The substrates were prepatterned with honeycomb and hexagonal-closed-packed arranged Au dots obtained by nanosphere lithography. The effects of template type, substrate rotational speed, height of the artificial Au seeds, and deposition angle {theta} of the incident flux on the growth of the Si nanostructures is examined. Especially for the deposition of Si on honeycomb templates at different deposition angles, it is shown that the structure of the growing film changes drastically. A continuous film with honeycomblike arranged hillocks on top is deposited at normal incidence. With increased {theta}, the structure shifts to almost dense films with a mesh of hexagonally arranged pores ({theta}=70 deg.). Finally, separated rodlike structures with triangular cross section are obtained under glancing angle conditions ({theta}=85 deg.). In addition, the structural evolution of the glancing angle deposited Si films is compared with oblique angle deposition three-dimensional Monte Carlo simulations. Furthermore, the effects of surface diffusion on the growth of spiral Si nanostructures on nontemplated substrates in experiment and simulation are compared and discussed.

  1. Preliminary study of CdTe and CdTe:Cu thin films nanostructures deposited by using DC magnetron sputtering

    SciTech Connect

    Marwoto, Putut; Made, D. P. Ngurah; Sugianto; Wibowo, Edy; Astuti, Santi Yuli; Aryani, Nila Prasetya; Othaman, Zulkafli

    2013-09-03

    Growth and properties of CdTe and CdTe:Cu thin films nanostrucures deposited by using dc magnetron sputtering are reported. Scanning electron microscope (SEM) was used to observe the surface morphologies of the thin films. At growth conditions of 250 °C and 14 W, CdTe films did not yet evenly deposited. However, at growth temperature and plasma power of 325 °C and 43 W, both CdTe and CdTe:Cu(2%) have deposited on the substrates. In this condition, the morphology of the films indicate that the films have a grain-like nanostructures. Grain size diameter of about 200 nm begin to appear on top of the films. Energy Dispersive X-rays spectroscopy (EDX) was used to investigate chemical elements of the Cu doped CdTe film deposited. It was found that the film deposited consist of Cd, Te and Cu elements. XRD was used to investigate the full width at half maximum (FWHM) values of the thin films deposited. The results show that CdTe:Cu(2%) thin film has better crystallographic properties than CdTe thin film. The UV-Vis spectrometer was used to investigate the optical properties of thin films deposited. The transmittance spectra showed that transmittance of CdTe:Cu(2%) film is lower than CdTe film. It was found that the bandgap energy of CdTe and CdTe:Cu(2%) thin films of about 1.48 eV.

  2. Highly oriented polycrystalline Cu{sub 2}O film formation using RF magnetron sputtering deposition for solar cells

    SciTech Connect

    Noda, S.; Shima, H.; Akinaga, H.

    2014-02-20

    Room temperature sputtering deposition and re-crystallization of the deposited thin films by rapid thermal annealing have been evaluating in detail as a formation method of Cu{sub 2}O active layer for solar cells, which minimize thermal budget in fabrication processes. Single phase polycrystalline Cu{sub 2}O films were obtained by a magnetron rf sputtering deposition and its crystallinity and electrical characteristics were controlled by the annealing. Hall mobility was improved up to 17 cm{sup 2}V{sup −1}s{sup −1} by the annealing at 600°C for 30s. Since this value was smaller than 47 cm{sup 2}V{sup −1}s{sup −1} of the film deposited under thermal equilibrium state using pulsed laser deposition at 600°C, some contrivances were necessary to compensate the deficiency. It was understood that the sputter-deposited Cu{sub 2}O films on (111)-oriented Pt films were strongly oriented to (111) face also by the self-assembly and the crystallinity was improved by the annealing preserving its orientation. The sputter-deposited film quality was expected to become equivalent to the pulsed laser deposition film from the results of X-ray diffractometry and photoluminescence.

  3. RNRA and neutron threshold analyses of thick lithium coatings deposited by sputter evaporation

    NASA Astrophysics Data System (ADS)

    Rigaux, C.; Vigneron, R.; Bodart, F.; Jongen, Y.; Cambriani, A.; Lucas, S.

    2008-05-01

    Li coatings on various substrates have numerous applications: Boron neutron capture therapy, super conducting tokamak, etc. Unfortunately the main difficulty using Li is its reactivity in air and diffusion into metals. It is the only metal that reacts with nitrogen at room temperature and it tarnishes and oxidizes rapidly in air. In this work, we investigate how to profile thick Li layers (50 μm) deposited on SiO2 substrates by a method based on plasma sputtering, involving both DC sputtering and evaporation simultaneously. A thick Li layer (≈10 μm) was covered with a thin stainless steel layer to prevent oxidation during transfer of the sample from the sputtering chamber and the accelerator. Li coatings were investigated by RNRA and neutron threshold reaction to obtain interdiffusion profiles of the different components and their concentration. The depth profile using the 7Li(p,γ)8Be∗ resonance nuclear reaction occurring at 440 keV allows us to obtain Li concentration versus depth up to 50 μm. Preliminary results indicate that homogeneous Li layers can be obtained and protected against air, even though it diffuses into the encapsulated layers.

  4. Increase of the deposition rate in reactive sputtering of metal oxides using a ceramic nitride target

    SciTech Connect

    Severin, D.; Wuttig, M.; Kappertz, O.; Nyberg, T.; Berg, S.; Pflug, A.

    2009-05-01

    We present a method to eliminate hysteresis effects and to increase the deposition rate for the reactive sputtering of metal oxides. This is achieved by using a ceramic nitride target in an argon-oxygen atmosphere. Although the use of a ceramic nitride target leads to pronounced changes of the processing characteristics, incorporation of nitrogen into the growing film is very small. These observations can be theoretically predicted using an extension of Berg's model [S. Berg and T. Nyberg, Thin Solid Films 476, 215 (2005)] to two different reactive gases and a compound target.

  5. Shape-memory properties in Ni-Ti sputter-deposited film

    NASA Technical Reports Server (NTRS)

    Busch, J. D.; Johnson, A. D.; Lee, C. H.; Stevenson, D. A.

    1990-01-01

    A Ni-Ti alloy, generically called nitinol, was prepared from sputtering targets of two different compositions on glass substrates using a dc magnetron source. The as-deposited films were amorphous in structure and did not exhibit a shape memory. The amorphous films were crystallized with a suitable annealing process, and the transformation properties were measured using differential scanning calorimetry. The annealed films demonstrated a strong shape-memory effect. Stress/strain measurements and physical manipulation were used to evaluate the shape recovery. These tests demonstrated sustained tensile stresses of up to 480 MPa in the high-temperature phase, and a characteristic plastic deformation in the low-temperature phase.

  6. Mixed-sputter deposition of Ni-Ti-Cu shape memory films

    SciTech Connect

    Krulevitch, P.; Ramsey, P.B.; Makowiecki, D.M.; Lee, A.P.; Northrup, M.A.; Johnson, G.C.

    1994-05-01

    Ni-Ti-Cu shape memory films were mixed-sputter deposited from separate nickel, titanium, and copper targets, providing increased compositional flexibility. Shape memory characteristics, examined for films with 7 at. % Cu and 41--51 at. % Tl, were determined with temperature controlled substrate curvature measurements, and microstructure was studied with transmission electron microscopy. The Ni-Ti-Cu films were found to have shape memory properties comparable to bulk materials, with transformation temperatures between 20 and 62{degree}C, a 10--13{degree}C hysteresis, and up to 330 MPa recoverable stress.

  7. Influence of process parameter variation on the reflectivity of sputter-deposited W-C multilayer diffraction gratings

    NASA Technical Reports Server (NTRS)

    Sager, B.; Benson, P.; Jahoda, K.; Jacobs, J. R.; Bloch, J. J.

    1986-01-01

    Multilayer W-C diffraction gratings with nominal d spacings of 35 A have been fabricated by magnetron sputter deposition. The peak and integrated reflectivities of these films have been measured with Al K-alpha X-rays and compared to theoretical values. The rms surface roughness has been evaluated. The influence of several sputtering-system process parameters on the reflectivities has been investigated.

  8. Energy spectrum of sputtered uranium - A new technique

    NASA Technical Reports Server (NTRS)

    Weller, R. A.; Tombrello, T. A.

    1978-01-01

    The fission track technique for detecting U-235 has been used in conjunction with a mechanical time-of-flight spectrometer in order to measure the energy spectrum in the region 1 eV to 1 keV of material sputtered from a 93% enriched U-235 foil by 80 keV Ar-40(+) ions. The spectrum was found to exhibit a peak in the region 2-4 eV and to decrease approximately as E exp -1.77 for E not less than 100 eV. The design, construction and resolution of the mechanical spectrometer are discussed and comparisons are made between the data and the predictions of the random collision cascade model of sputtering.

  9. In situ analyses on negative ions in the sputtering process to deposit Al-doped ZnO films

    SciTech Connect

    Tsukamoto, Naoki; Watanabe, Daisuke; Saito, Motoaki; Sato, Yasushi; Oka, Nobuto; Shigesato, Yuzo

    2010-07-15

    The origin of high energy negative ions during deposition of aluminum doped zinc oxide (AZO) films by dc magnetron sputtering of an AZO (Al{sub 2}O{sub 3}: 2.0 wt %) target was investigated by in situ analyses using the quadrupole mass spectrometer combined with the electrostatic energy analyzer. High energy negative oxygen (O{sup -}) ions which possessed the kinetic energy corresponding to the cathode sheath voltage were detected. The maximum flux of the O{sup -} ions was clearly observed at the location opposite to the erosion track area on the target. The flux of the O{sup -} ions changed hardly with increasing O{sub 2} flow ratio [O{sub 2}/(Ar+O{sub 2})] from 0% to 5%. The kinetic energy of the O{sup -} ions decreased with decreasing cathode sheath voltage from 403 to 337 V due to the enhancement of the vertical maximum magnetic field strength at the cathode surface from 0.025 to 0.100 T. The AZO films deposited with the lower O{sup -} bombardment energy showed the higher crystallinity and improved the electrical conductivity.

  10. Oxygen partial pressure dependent optical properties of glancing angle deposited (GLAD) Ta2O5 films deposited by magnetron sputtering

    NASA Astrophysics Data System (ADS)

    Tripathi, S.; Haque, S. Maidul; Rao, K. Divakar; Misal, J. S.; Pratap, C.; Sahoo, N. K.

    2016-05-01

    Experiments were carried out on Ta2O5 oxide thin films by asymmetric bipolar pulsed DC magnetron sputtering using a new hybrid combination of conventional (normal incidence) deposition and glancing angle deposition (GLAD) geometries. The films were prepared with varying O2 partial pressure. The ellipsometry characterization reveals a systematic variation in refractive index, which decreased from 2.2 in the normal films to an average 1.78 in the GLAD films. The bandgap of these GLAD films is slightly higher as compared to normal films. Overall transmission of the GLAD films is increased is by ~ 15 % implying a reduction in the refractive index for potential optical filtering device applications. The results were further supported by X-ray reflectivity measurements which show an effective double layer structure in GLAD consisting of layers with different densities of the same Ta2O5 material.