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Sample records for ion-textured ofhc copper

  1. Secondary electron emission characteristics of molybdenum-masked, ion-textured OFHC copper

    NASA Technical Reports Server (NTRS)

    Curren, Arthur N.; Jensen, Kenneth A.; Roman, Robert F.

    1990-01-01

    A method for producing a uniform, highly textured surface on oxygen-free, high conductivity (OFHC) copper by ion bombardment using sputtered molybdenum as a texture-inducing masking film was developed and used to provide samples for study. The purpose was to develop a basically OFHC copper surface having very low secondary electron emission characteristics. Surfaces having low secondary electron emission are a requirement for the electrodes of very high efficiency multistage depressed collectors (MDC's). Such MDC's are used in microwave amplifier traveling wave tubes for space communications and other applications. OFHC copper is the material most commonly used for MDC electrodes because it has high thermal conductivity, it is easy to machine, and its fabrication and brazing procedures are well established. However, its untreated surface displays relatively very high levels of secondary electron emissions. Textured OFHC copper samples were tested for true secondary electron emission and relative reflected primary electron yield at primary electron beam energy levels from 200 to 2000 eV and at direct (0 deg) to oblique (60 deg) beam impingement angles. The test results for three of the samples, each of which was processed in a slightly different way, are compared with each other and with test results for a machined OFHC copper sample. Although the textured samples are not represented here as having been processed optimally, their measured secondary electron emission characteristics are significantly lower than those of the untreated OFHC copper sample over the range of conditions studied. Importantly, the relative reflected primary electron yield of one of the textured samples is conspicuously lower than that of the others. Clearly, with further development, the molybdenum-masked ion-textured OFHC copper surface will be a promising material for high-efficiency MDC electrodes.

  2. Observation of diamond turned OFHC copper using Scanning Tunneling Microscopy

    SciTech Connect

    Grigg, D.A.; Russell, P.E.; Dow, T.A.

    1988-12-01

    Diamond turned OFHC copper samples have been observed within the past few months using the Scanning Tunneling Microscope. Initial results have shown evidence of artifacts which may be used to better understand the diamond turning process. The STM`s high resolution capability and three dimensional data representation allows observation and study of surface features unobtainable with conventional profilometry systems. Also, the STM offers a better quantitative means by which to analyze surface structures than the SEM. This paper discusses findings on several diamond turned OFHC copper samples having different cutting conditions. Each sample has been cross referenced using STM and SEM.

  3. Secondary electron emission characteristics of ion-textured copper and high-purity isotropic graphite surfaces

    NASA Technical Reports Server (NTRS)

    Curren, A. N.; Jensen, K. A.

    1984-01-01

    Experimentally determined values of true secondary electron emission and relative values of reflected primary electron yield for untreated and ion textured oxygen free high conductivity copper and untreated and ion textured high purity isotropic graphite surfaces are presented for a range of primary electron beam energies and beam impingement angles. This investigation was conducted to provide information that would improve the efficiency of multistage depressed collectors (MDC's) for microwave amplifier traveling wave tubes in space communications and aircraft applications. For high efficiency, MDC electrode surfaces must have low secondary electron emission characteristics. Although copper is a commonly used material for MDC electrodes, it exhibits relatively high levels of secondary electron emission if its surface is not treated for emission control. Recent studies demonstrated that high purity isotropic graphite is a promising material for MDC electrodes, particularly with ion textured surfaces. The materials were tested at primary electron beam energies of 200 to 2000 eV and at direct (0 deg) to near grazing (85 deg) beam impingement angles. True secondary electron emission and relative reflected primary electron yield characteristics of the ion textured surfaces were compared with each other and with those of untreated surfaces of the same materials. Both the untreated and ion textured graphite surfaces and the ion treated copper surface exhibited sharply reduced secondary electron emission characteristics relative to those of untreated copper. The ion treated graphite surface yielded the lowest emission levels.

  4. Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures

    NASA Technical Reports Server (NTRS)

    Salerno, L. J.; Kittel, P.; Spivak, A. L.

    1983-01-01

    The thermal conductance of oxygen-free high conductivity (OFHC) copper sample pairs with surface finishes ranging from 0.1 to 1.6-micrometers rms roughness was investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.

  5. Electrical Conductivity, Thermal Stability, and Lattice Defect Evolution During Cyclic Channel Die Compression of OFHC Copper

    NASA Astrophysics Data System (ADS)

    Satheesh Kumar, S. S.; Raghu, T.

    2015-02-01

    Oxygen-free high-conductivity (OFHC) copper samples are severe plastically deformed by cyclic channel die compression (CCDC) technique at room temperature up to an effective plastic strain of 7.2. Effect of straining on variation in electrical conductivity, evolution of deformation stored energy, and recrystallization onset temperatures are studied. Deformation-induced lattice defects are quantified using three different methodologies including x-ray diffraction profile analysis employing Williamson-Hall technique, stored energy based method, and electrical resistivity-based techniques. Compared to other severe plastic deformation techniques, electrical conductivity degrades marginally from 100.6% to 96.6% IACS after three cycles of CCDC. Decrease in recrystallization onset and peak temperatures is noticed, whereas stored energy increases and saturates at around 0.95-1.1J/g after three cycles of CCDC. Although drop in recrystallization activation energy is observed with the increasing strain, superior thermal stability is revealed, which is attributed to CCDC process mechanics. Low activation energy observed in CCDC-processed OFHC copper is corroborated to synergistic influence of grain boundary characteristics and lattice defects distribution. Estimated defects concentration indicated continuous increase in dislocation density and vacancy with strain. Deformation-induced vacancy concentration is found to be significantly higher than equilibrium vacancy concentration ascribed to hydrostatic stress states experienced during CCDC.

  6. Surface interactions, corrosion processes and lubricating performance of protic and aprotic ionic liquids with OFHC copper

    NASA Astrophysics Data System (ADS)

    Espinosa, Tulia; Sanes, José; Jiménez, Ana-Eva; Bermúdez, María-Dolores

    2013-05-01

    In order to select possible candidates for use as lubricants or as precursors of surface coatings, the corrosion and surface interactions of oxygen-free high conductivity (OFHC) copper with two new protic (PIL) and four aprotic (APIL) room-temperature ionic liquids have been studied. The PILs, with no heteroatoms in their composition, are the triprotic di[(2-hydroxyethyl)ammonium] succinate (MSu) and the diprotic di[bis-(2-hydroxyethyl)ammonium] adipate (DAd). The four APILs contain imidazolium cations with short or long alkyl chain substituents and reactive anions: 1-ethyl-3-methylimidazolium phosphonate ([EMIM]EtPO3H); 1-ethyl-3-methylimidazolium octylsulfate ([EMIM]C8H17SO4); 1-hexyl-3-methylimidazolium tetrafluoroborate ([HMIM]BF4) and 1-hexyl-3-methylimidazolium hexafluorophosphate ([HMIM]PF6). Contact angles between the ionic liquids and OFHC copper surface were measured. Mass and roughness changes of OFHC copper after 168 h in contact with the ionic liquids have been determined. Copper surfaces were studied by XRD, SEM-EDX and XPS surface analysis. FTIR spectra of the liquid phases recovered after being in contact with the copper surface were compared with that of the neat ionic liquids. The lowest corrosion rate is observed for the diprotic ammonium adipate PIL (DAd), which gives low mass and surface roughness changes and forms adsorbed layers on copper, while the triprotic ammonium succinate salt (MSu) produces a severe corrosive attack by reaction with copper to form a blue crystalline solid, which has been characterized by FTIR and thermal analysis (TGA). All imidazolium APILs react with copper, with different results as a function of the anion. As expected, [EMIM]C8H17SO4 reacts with copper to form the corresponding copper sulphate salt. [EMIM]EtPO3H produces severe corrosion to form a phosphonate-copper soluble phase. [HMIM]BF4 gives rise to the highest roughness increase of the copper surface. [HMIM]PF6 shows the lowest mass and roughness changes of

  7. Modelling Deformation and Texture Evolution in OFHC Copper at Large Strain and High Strain Rate

    NASA Astrophysics Data System (ADS)

    Bonora, Nicola; Testa, Gabriel; Ruggiero, Andrew; Iannitti, Gianluca; Hörnqvist, Magnus; Mortazavi, Nooshin

    2015-06-01

    In this work, a two-scale approach to simulate high rate deformation and texture evolution in OFHC copper is presented. The modified Rusinek-Klepaczko material model was used to simulate the response of the material at continuum scale accounting for different deformation mechanisms occurring over an extensive range of strain rate and temperature. Material model parameters were determined from characterization test (mainly uniaxial tests) results. Successively, the model was validated simulating material deformation in Taylor anvil impact, symmetric Taylor impact (rod-on-rod) and dynamic tensile extrusion (DTE) tests. Texture evolution, under different deformation paths was simulated using the crystal plasticity package CPFEM and results were compared with those obtained by EBSD analysis. The possibility to incorporate the effect of grain size evolution and fragmentation at continuum scale is discussed.

  8. Modelling and Simulation of Dynamic Recrystallization (DRX) In OFHC Copper at Very High Strain Rates

    NASA Astrophysics Data System (ADS)

    Testa, Gabriel; Bonora, Nicola; Ruggiero, Andrew; Iannitti, Gianluca; Hörnqvist, Magnus; Mortazavi, Nooshin

    2015-06-01

    At high strain rates, the deformation process is essentially adiabatic and if the plastic work is large enough, dynamic recrystallization can occur. In this work, an examination on microstructure evolution in Dynamic Tensile Extrusion (DTE) test of OFHC copper, performed at 400 m/s, was carried out. EBSD investigations, along the center line of the fragment remaining in the extrusion die, showed a progressive elongation of the grains, and an accompanying development of a strong < 001 > + < 111 > dual fiber texture. Meta-dynamic discontinuous dynamic recrystallization (DRX) occurred at larger strains, and it was showed that nucleation occurred during straining. A criterion, based on the evolution of Zener-Hollomon parameter during the dynamic deformation process, was proposed. Finally, DTE test was simulated using the modified Rusinek-Klepaczko constitutive model incorporating restoring effects induced by recrystallization processes.

  9. Validating Material Modelling of OFHC Copper Using Dynamic Tensile Extrusion (DTE) Test at Different Impact Velocity

    NASA Astrophysics Data System (ADS)

    Bonora, Nicola; Testa, Gabriel; Ruggiero, Andrew; Iannitti, Gianluca; Hörnqvist, Magnus; Mortazavi, Nooshin

    2015-06-01

    In the Dynamic Tensile Extrusion (DTE) test, the material is subjected to very large strain, high strain rate and elevated temperature. Numerical simulation, validated comparing with measurements obtained on soft-recovered extruded fragments, can be used to probe material response under such extreme conditions and to assess constitutive models. In this work, the results of a parametric investigation on the simulation of DTE test of annealed OFHC copper - at impact velocity ranging from 350 up to 420 m/s - using phenomenological and physically based models (Johnson-Cook, Zerilli-Armstrong and Rusinek-Klepaczko), are presented. Preliminary simulation of microstructure evolution was performed using crystal plasticity package CPFEM, providing, as input, the strain history obtained with FEM at selected locations along the extruded fragments. Results were compared with EBSD investigation.

  10. Contact heat conductance at a diamond-OFHC copper interface with GaIn eutectic as a heat transfer medium

    SciTech Connect

    Assoufid, L.; Khounsary, A.

    1996-09-01

    The results of an experimental study of the contact heat conductance across a single diamond crystal interface with OFHC copper (Cu) are reported. Gallium-indium (GaIn) eutectic was used as an interstitial material. Contact conductance data are important in the design and the prediction of the performance of x-ray optics under high-heat-load conditions. Two sets of experiments were carried out. In one, the copper surface in contact with diamond was polished and then electroless plated with 1 {mu}m of nickel, while in the other, the copper contact surface was left as machined. The measured average interface heat conductances are 44.7{plus_minus}8 W/cm{sup 2}-K for nonplated copper and 23.0{plus_minus}8 W/cm{sup 2}-K for nickel-plated copper. For reference, the thermal contact conductances at a copper-copper interface (without diamond) were also measured, and the results are reported. A typical diamond monochromator, 0.2 mm thick, will absorb about 44 W under a standard undulator beam at the Advanced Photon Source. The measured conductance for nickel-plated copper suggests that the temperature drop across the interface of diamond and nickel-plated copper, with a 20 mm {sup 2}contact area, will be about 10{degree}C. Therefore temperature rises are rather modest, and the accuracy of the measured contact conductances presented here are sufficient for design purposes. {copyright} {ital 1996 American Institute of Physics.}

  11. Contact heat conductance at a diamond-OFHC copper interface with GaIn eutectic as a heat transfer medium

    NASA Astrophysics Data System (ADS)

    Assoufid, L.; Khounsary, A. M.

    1996-09-01

    The results of an experimental study of the contact heat conductance across a single diamond crystal interface with OFHC copper (Cu) are reported. Gallium-indium (GaIn) eutectic was used as an interstitial material. Contact conductance data are important in the design and the prediction of the performance of x-ray optics under high-heat-load conditions. Two sets of experiments were carried out. In one, the copper surface in contact with diamond was polished and then electroless plated with 1 μm of nickel, while in the other, the copper contact surface was left as machined. The measured average interface heat conductances are 44.7±8 W/cm2-K for nonplated copper and 23.0±8 W/cm2-K for nickel-plated copper. For reference, the thermal contact conductances at a copper-copper interface (without diamond) were also measured, and the results are reported. A typical diamond monochromator, 0.2 mm thick, will absorb about 44 W under a standard undulator beam at the Advanced Photon Source. The measured conductance for nickel-plated copper suggests that the temperature drop across the interface of diamond and nickel-plated copper, with a 20 mm 2 contact area, will be about 10°C. Therefore temperature rises are rather modest, and the accuracy of the measured contact conductances presented here are sufficient for design purposes.

  12. THE EFFECT OF POST-IRRADATION ANNEALING ON STACKING FAULT TETRAHEDRA IN NEUTRON-IRRADIATED OFHC COPPER

    SciTech Connect

    Edwards, Danny J.; Singh, Bachu N.; Eldrup, M.

    2003-09-03

    Two irradiation experiments have been completed wherein two sets of tensile specimens of OFHC copper were irradiated with fission neutrons, one set at 200 degrees C and the other at 250 degrees C. Post-irradiation annealing in vacuum was then used to evaluate the change in the defect microstructure, including vacancy-type SFT, voids, and dislocation loops. Individual samples within each set were given one annealing exposure at 300, 350, 400, 450, 500, or 550 degrees C for 2 hours. The fine-scale defect microstructure was characterized by transmission electron microscopy (TEM) to compare the defect size and spatial distribution at each annealing temperature and reference the results to that measured in the as-irradiated condition. Based on the change in the SFT size distributions, post-irradiation annealing led to a preferential removal of the smaller sized SFT, but did not lead to a general coarsening as might be expected from an Oswald ripening scenario. The issue of whether the SFT produced during irradiation are all structurally perfect is still being investigated at the time of this report, however, the images of the SFT appeared more perfect after annealing at 300 degrees C and higher. Further analysis is being performed to determine whether intermediate stages of SFT formation exist in the as-irradiated condition.

  13. Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures

    NASA Technical Reports Server (NTRS)

    Salerno, L. J.; Kittel, P.; Spivak, A. L.

    1985-01-01

    The thermal conductance of oxygen-free high conductivity (COFHC) copper sample pairs with surface finishes ranging from 0.1 to 1.6-micrometers rms roughness was investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.

  14. Cyclic fatigue analysis of rocket thrust chambers. Volume 1: OFHC copper chamber low cycle fatigue

    NASA Technical Reports Server (NTRS)

    Miller, R. W.

    1974-01-01

    A three-dimensional finite element elasto-plastic strain analysis was performed for the throat section of a regeneratively cooled rocket combustion chamber. The analysis employed the RETSCP finite element computer program. The analysis included thermal and pressure loads, and the effects of temperature dependent material properties, to determine the strain range corresponding to the chamber operating cycle. The analysis was performed for chamber configuration and operating conditions corresponding to a hydrogen-oxygen combustion chamber which was fatigue tested to failure. The computed strain range at typical chamber operating conditions was used in conjunction with oxygen-free, high-conductivity (OHFC) copper isothermal fatigue test data to predict chamber low-cycle fatigue life.

  15. Mechanical and chemical effects of ion-texturing biomedical polymers

    NASA Technical Reports Server (NTRS)

    Weigand, A. J.; Cenkus, M. A.

    1979-01-01

    To determine whether sputter etching may provide substantial polymer surface texturing with insignificant changes in chemical and mechanical properties, an 8 cm beam diameter, electron bombardment, argon ion source was used to sputter etch (ion-texture process) nine biomedical polymers. The materials included silicone rubber, 32% carbon impregnated polyolefin, polyoxymethylene, polytetrafluoroethylene, ultrahigh molecular weight (UHMW) polyethylene, UHMW polyethylene with carbon fibers (10%), and several polyurethanes (bioelectric, segmented, and cross linked). Ion textured microtensile specimens of each material except UHMW polyethylene and UHMW polyethylene with 10% carbon fibers were used to determine the effect of ion texturing on tensile properties. Scanning electron microscopy was used to determine surface morphology changes, and electron spectroscopy for chemical analysis was used to analyze the near surface chemical changes that result from ion texturing. Ion energies of 500 eV with beam current densities ranging from 0.08 to 0.19 mA/sq cm were used to ion texture the various materials. Standard microtensile specimens of seven polymers were exposed to a saline environment for 24 hours prior to and during the tensile testing. The surface chemical changes resulting from sputter etching are minimal in spite of the often significant changes in the surface morphology.

  16. Secondary electron emission characteristics of untreated and ion-textured titanium

    NASA Technical Reports Server (NTRS)

    Curren, Arthur N.; Jensen, Kenneth A.; Blackford, Gary A.

    1989-01-01

    Experimentally determined values of true secondary electron emission and relative values of reflected primary electron yield are presented for untreated (simply machined) and ion-textured, high-purity titanium over ranges of primary electron beam energies and beam impingement angles. The purpose of the investigation was to explore the feasibility of using titanium as electrode material in the multistage depressed collectors (MDC's) used in microwave amplifier traveling wave tubes (TWT's) for space communications and aircraft applications. Because of its relatively low density and thermal expansion characteristics and relatively high strength, thermal emissivity, and melting temperature, titanium presents itself as a possible candidate for the MDC electrode application. A detailed description of the method of ion texturing the titanium is included. Although the ion-treated surface considered in this study is not presented as being optimum from the standpoint of secondary electron emission suppression, it nevertheless serves to demonstrate that the surface can be modified by this procedure to significantly reduce these emission characteristics relative to those of the untreated surface. Further studies can reasonably be expected to produce surfaces with even lower secondary emission characteristics. The titanium surface were tested at primary electron beam energies of 200 to 2000 eV and at direct (0 deg) to near-grazing (85 deg) beam impingement angles. True secondary electron emission and relative reflected primary electron yield characteristics of the surfaces were compared with each other and with textured titanium surface exhibited secondary electron emission characteristics sharply lower than those exhibited by untreated titanium or copper. Clearly, then, in consideration of the secondary electron emission suppression of ion-textured titanium along with its other favorable physical properties, it must be included as a potential candidate for use as MDC electrode

  17. The characterization of copper alloys for the application of fusion reactors

    SciTech Connect

    Ishiyama, S.; Fukaya, K.; Eto, M.; Akiba, M.

    1995-12-31

    Three kinds of candidate copper alloys for divertor structural materials of fusion experimental reactors, that is, Oxygen Free High thermal conductivity Copper (OFHC), alumina disperse reinforced copper (DSC) and the composite of W and Cu (W/Cu), were prepared for strength and fatigue tests at temperatures ranging from R.T. to 500 C in a vacuum. High temperature strength of DSC and W/Cu with rapid fracture after peak loading at the temperatures is higher than that of OFHC by factor of 2, but fracture strains of DFC and W/Cu are smaller than that of OFHC. Fatigue life of DSC, which shows the same fatigue behavior of OFHC at room temperature, is longer than other materials at 400 C. Remarkable fatigue life reduction of OFHC found in this experiment is to be due to recrystallization of OFHC yielded above 400 C.

  18. High temperature, low-cycle fatigue of copper-base alloys in argon. Part 1: Preliminary results for 12 alloys at 1000 F (538 C)

    NASA Technical Reports Server (NTRS)

    Conway, J. B.; Stentz, R. H.; Berling, J. T.

    1973-01-01

    Short-term tensile evaluations at room temperature and 538 C and low-cycle fatigue evaluations at 538 C are presented for the following materials: Zirconium copper-annealed, Zirconium copper-1/4 hard, Zirconium copper-1/2 hard, Tellurium copper-1/2 hard, Chromium copper-SA and aged, OFHC copper-hard, OFHC copper-1/4 hard, OFHC copper-annealed, Silver-as drawn, Zr-Cr-Mg copper-SA, CW and aged, Electroformed copper-30-35 ksi, and Co-Be-Zr- copper-SA, aged. A total of 50 tensile tests and 76 low-cycle fatigue tests were performed using a strain rate of 0.2 percent per second.

  19. COPPER

    EPA Science Inventory

    The report is a review of current knowledge of the distribution of copper in the environment and living things. Metabolism and the effects of copper in the biosphere are also considered. Copper compounds are common and widely distributed in nature. They are also extensively mined...

  20. Behavior of CuP and OFHC Cu anodes under electrodeposition conditions

    SciTech Connect

    Frankel, G.S.; Schrott, A.G.; Horkans, J.; Andricacos, P.C. . Thomas J. Watson Research Center); Isaacs, H.S. )

    1992-01-01

    Films formed on CuP (with 0.05 wt % P) and OFHC Cu anodes in electroplating solutions were studied by X-ray Photoelectron Spectroscopy, X-ray Absorption Spectroscopy, electrochemical methods, and a newly developed gravimetric technique. The black film formed on CuP in Cl-containing solutions was found to resemble a porous sponge composed of CuCl but laden/with concentrated CuSO{sub 4} solution. The difference between the buoyancy-corrected measured mass change and the charge-equivalent mass change was found to have two components: a reversible part that comes and goes as the current is turned on and off, and an irreversible part that remains on the surface and increase in mass with time. The irreversible part results from the anodic film, which increases linearly with charge density but independent of current density. The reversible part of the mass change arises from the weight of the diffusion layer. In contrast to CuP, OFHC Cu releases much more Cu{sup +1} during anodic polarization and forms a poorly-adherent anodic film that is considerably heavier than the black film for a given charge density.

  1. Behavior of CuP and OFHC Cu anodes under electrodeposition conditions

    SciTech Connect

    Frankel, G.S.; Schrott, A.G.; Horkans, J.; Andricacos, P.C.; Isaacs, H.S.

    1992-08-01

    Films formed on CuP (with 0.05 wt % P) and OFHC Cu anodes in electroplating solutions were studied by X-ray Photoelectron Spectroscopy, X-ray Absorption Spectroscopy, electrochemical methods, and a newly developed gravimetric technique. The black film formed on CuP in Cl-containing solutions was found to resemble a porous sponge composed of CuCl but laden/with concentrated CuSO{sub 4} solution. The difference between the buoyancy-corrected measured mass change and the charge-equivalent mass change was found to have two components: a reversible part that comes and goes as the current is turned on and off, and an irreversible part that remains on the surface and increase in mass with time. The irreversible part results from the anodic film, which increases linearly with charge density but independent of current density. The reversible part of the mass change arises from the weight of the diffusion layer. In contrast to CuP, OFHC Cu releases much more Cu{sup +1} during anodic polarization and forms a poorly-adherent anodic film that is considerably heavier than the black film for a given charge density.

  2. An Effective Secondary Electron Emission Suppression Treatment For Copper MDC

    NASA Technical Reports Server (NTRS)

    Curren, Arthur N.; Long, Kenwyn J.; Jensen, Kenneth A.; Roman, Robert F.

    1993-01-01

    Untreated oxygen-free, high-conductivity (OFHC) copper, commonly used for MDC electrodes, exhibits relatively high secondary electron emission characteristics. This paper describes a specialized ion-bombardment procedure for texturing copper surfaces which sharply reduces the emission properties relative to untreated copper. The resulting surface is a particle-free, robust, uniformly highly-textured all-metal structure. The use of this process requires no modifications to copper machining, brazing, or other MDC normal fabrication procedures. The flight TWT for a planned NASA deep space probe, the Cassini Mission, will incorporate copper MDC electrodes treated with the method described here.

  3. Copper

    Integrated Risk Information System (IRIS)

    Copper ; CASRN 7440 - 50 - 8 Human health assessment information on a chemical substance is included in the IRIS database only after a comprehensive review of toxicity data , as outlined in the IRIS assessment development process . Sections I ( Health Hazard Assessments for Noncarcinogenic Effects )

  4. Oblique ion texturing of yttria-stabilized zirconia: The {l_brace}211{r_brace}<111> structure

    SciTech Connect

    Berdahl, Paul; Reade, Ronald P.; Liu, Jinping; Russo, Richard E.; Fritzemeier, Les; Buczek, David; Schoop, Urs

    2002-07-01

    Amorphous (Zr,Y)O{sub x} films were synthesized by reactive magnetron sputtering and subsequently crystallized by oblique ion bombardment. Crystalline texture nucleated by the ion beam was replicated by solid-phase epitaxial growth throughout the formerly amorphous yttria-stabilized zirconia (YSZ) film. The resulting YSZ films have (211) orientation normal to the substrate with in-plane directions (111), parallel, and (110), transverse, to the azimuth of the ion beam. We hypothesize that the texture mechanism involves ion-induced film compression and shear. The results, taken together with prior work, show that oblique ion texturing of amorphous films is a general phenomenon that can be used to fabricate substrates with more than one type of crystallographic orientation.

  5. Plasticity and stress relaxation in fracture mechanics test of copper and cupronickel

    SciTech Connect

    James, L.A.

    1986-03-01

    Load relaxation tests were performed using precracked fracture mechanics specimens of annealed OFHC copper and as-received 90-10 cupronickel alloy. Test temperatures were 100/sup 0/, 150/sup 0/, and 250/sup 0/C with, in some cases, exposure times out to 2439 hours. Significant load relaxation was noted in some cases, and the applicability of using these specimens in such cases is discussed.

  6. Metallurgical examination of recovered copper jet particles

    SciTech Connect

    Lassila, D.H.; Nikkel, D.J. Jr.; Kershaw, R.P.; Walters, W.P.

    1995-11-30

    A shaped charge (81 mm, 42{degrees}, OFHC copper cone) was fired into a ``soft` recovery bunker to allow metallurgical examination of recovered jet particles and the slug. The initial weight of the copper liner was 245 gm, of which 184 gm was recovered. The number of jet particles recovered was 37 (approximately 63% of the particles formed by the charge). Extensive metallurgical analyses were performed on the recovered slug and jet particles. The microstructural features associated with voids, e.g. dendritic grain growth, clearly indicate that the regions in the vicinity of the centerline of the slug and jet particles were melted. In this work we present calculations of jet temperature as a function of constitutive behavior. In order to predict melt in the center region of the jet we find it necessary to scale flow stress with a pressure dependent shear modulus.

  7. Attenuation of shock waves in copper and stainless steel

    SciTech Connect

    Harvey, W.B.

    1986-06-01

    By using shock pins, data were gathered on the trajectories of shock waves in stainless steel (SS-304L) and oxygen-free-high-conductivity copper (OFHC-Cu). Shock pressures were generated in these materials by impacting the appropriate target with thin (approx.1.5 mm) flying plates. The flying plates in these experiments were accelerated to high velocities (approx.4 km/s) by high explosives. Six experiments were conducted, three using SS-304L as the target material and three experiments using OFHC-Cu as the target material. Peak shock pressures generated in the steel experiments were approximately 109, 130, and 147 GPa and in the copper experiments, the peak shock pressures were approximately 111, 132, and 143 GPa. In each experiment, an attenuation of the shock wave by a following release wave was clearly observed. An extensive effort using two characteristic codes (described in this work) to theoretically calculate the attenuation of the shock waves was made. The efficacy of several different constitutive equations to successfully model the experiments was studied by comparing the calculated shock trajectories to the experimental data. Based on such comparisons, the conclusion can be drawn that OFHC-Cu enters a melt phase at about 130 GPa on the principal Hugoniot. There was no sign of phase changes in the stainless-steel experiments. In order to match the observed attenuation of the shock waves in the SS-304L experiments, it was necessary to include strength effects in the calculations. It was found that the values for the parameters in the strength equations were dependent on the equation of state used in the modeling of the experiments. 66 refs., 194 figs., 77 tabs.

  8. Low-cycle fatigue analysis of a cooled copper combustion chamber

    NASA Technical Reports Server (NTRS)

    Miller, R. W.

    1974-01-01

    A three-dimensional finite element elastoplastic strain analysis was performed for the throat section of regeneratively cooled rocket engine combustion chamber. The analysis included thermal and pressure loads, and the effects of temperature dependent material properties, to determine the strain range corresponding to the engine operating cycle. The strain range was used in conjunction with OFHC copper isothermal fatigue test data to predict engine low-cycle fatigue life. The analysis was performed for chamber configuration and operating conditions corresponding to a hydrogen-oxygen chamber which was fatigue tested to failure at the NASA Lewis Research Center.

  9. A copper 3.9 GHz TM110 cavity for emittance exchange

    SciTech Connect

    Koeth, T.W.; Fliller, R.P., III; Bellantoni, L.; Edwards, D.A.; Edwards, H.T.; /Fermilab

    2007-06-01

    An experiment is being developed at the FNAL Photoinjector Lab to demonstrate the exchange of longitudinal emittance with a transverse horizontal emittance. The longitudinal electric field of a TM{sub 110} cavity vanishes on axis and increases linearly with transverse displacement. This 'shearing' electric field is pivotal to the exchange. The design of this TM{sub 110} cavity is a variant of the Fermilab 3.9 GHz superconducting deflecting mode cavity; however, the cavity was constructed of OFHC copper. The authors report on the construction, field flatness, polarization and high power testing of a TM{sub 110} cavity.

  10. Fatigue behavior of copper and selected copper alloys for high heat flux applications

    SciTech Connect

    Leedy, K.D.; Stubbins, J.F.; Singh, B.N.; Garner, F.A.

    1996-04-01

    The room temperature fatigue behavior of standard and subsize specimens was examined for five copper alloys: OFHC Cu, two CuNiBe alloys, a CuCrZr alloy, and a Cu-Al{sub 2}O{sub 3} alloy. Fatigue tests were run in strain control to failure. In addition to establishing failure lives, the stress amplitudes were monitored as a function of numbers of accrued cycles. The results indicate that the alloys with high initial yield strengths provide the best fatigue response over the range of failure lives examined in the present study: N{sub f} = 10{sup 3} to 10{sup 6}. In fact, the fatigue performance of the best alloys is dominated by the elastic portion of the strain range, as would be expected from the correlation of performance with yield properties. The alumina strengthened alloy and the two CuNiBe alloys show the best overall performance of the group examined here.

  11. Qualification of electron-beam welded joints between copper and stainless steel for cryogenic application

    NASA Astrophysics Data System (ADS)

    Lusch, C.; Borsch, M.; Heidt, C.; Magginetti, N.; Sas, J.; Weiss, K.-P.; Grohmann, S.

    2015-12-01

    Joints between copper and stainless steel are commonly applied in cryogenic systems. A relatively new and increasingly important method to combine these materials is electron-beam (EB) welding. Typically, welds in cryogenic applications need to withstand a temperature range from 300K down to 4K, and pressures of several MPa. However, few data are available for classifying EB welds between OFHC copper and 316L stainless steel. A broad test program was conducted in order to qualify this kind of weld. The experiments started with the measurement of the hardness in the weld area. To verify the leak-tightness of the joints, integral helium leak tests at operating pressures of 16 MPa were carried out at room- and at liquid nitrogen temperature. The tests were followed by destructive tensile tests at room temperature, at liquid nitrogen and at liquid helium temperatures, yielding information on the yield strength and the ultimate tensile strength of the welds at these temperatures. Moreover, nondestructive tensile tests up to the yield strength, i.e. the range in which the weld can be stressed during operation, were performed. Also, the behavior of the weld upon temperature fluctuations between room- and liquid nitrogen temperature was tested. The results of the qualification indicate that EB welded joints between OFHC copper and 316L stainless steel are reliable and present an interesting alternative to other technologies such as vacuum brazing or friction welding.

  12. Effects on LDEF exposed copper film and bulk

    NASA Technical Reports Server (NTRS)

    Peters, Palmer N.; Gregory, John C.; Christl, Ligia C.; Raikar, Ganesh N.

    1991-01-01

    Two forms of copper were exposed to the Long Duration Exposure Facility (LDEF) Mission 1 environment: a copper film, initially 74.2 plus or minus 1.1 nm thick sputter coated on a fused silica flat and a bulk piece of oxygen-free, high conductivity (OFHC) copper. The optical density of the copper film changed from 1.33 to 0.70 where exposed, and the film thickness increased to 106.7 plus or minus 0.5 nm where exposed. The exposed area appears purple by reflection and green by transmission for the thin film and maroon color for the bulk copper piece. The exposed areas increased in thickness, but only increase in the thickness of the thin film sample could be readily measured. The increase in film thickness is consistent with the density changes occurring during conversion of copper to an oxide. However, we have not been able to confirm appreciable conversion to an oxide by x-ray diffraction studies. We have not yet subjected the sample to e-beams or more abusive investigations out of concern that the film might be modified.

  13. Deposition rate and substrate temperature effects on the structure and properties of bulk-sputtered OFHC Cu and Cu-0.15Zr. [Oxygen-Free High-Conductivity

    NASA Technical Reports Server (NTRS)

    Hecht, R. J.; Mullaly, J. R.

    1975-01-01

    Bulk-sputtered OFHC Cu and Cu-0.15 Zr used as inner walls of advanced regeneratively cooled thrust chambers are evaluated as to microstructure, surface topography, and fractography. It is found that under conditions of low substrate temperature, crystallite size and openness of the structure increase with increasing deposition rate for both materials. At elevated temperatures, an equiaxed ductile structure of OFHC Cu is produced only at low deposition rates; at higher deposition rate, open structures are observed with recrystallized equiaxed grains within large poorly bonded crystallites. The Cu-0.15 Zr alloy sputtered from the hollow cathode using a diode discharge shows open-type structures for all conditions evaluated. The use of a triode discharge in generating a dense non-voided structure of Cu-0.15 Zr is discussed.

  14. The interaction of atomic oxygen with copper: An XPS, AES, XRD, optical transmission, and stylus profilometry study

    NASA Technical Reports Server (NTRS)

    Raikar, Ganesh N.; Gregory, John C.; Christl, Ligia C.; Peters, Palmer N.

    1993-01-01

    The University of Alabama in Huntsville (UAH) experiment A-0114 was designed to study the reaction of material surfaces with low earth orbits (LEO) atmospheric oxygen. The experiment contained 128 one-inch circular samples; metals, polymers, carbons, and semiconductors. Half of these samples were exposed on the front of the Long Duration Exposure Facility (LDEF) and remaining on the rear. Among metal samples, copper has shown some interesting new results. There were two forms of copper samples: a thin film sputter-coated on fused silica and a solid piece of OFHC copper. They were characterized by x-ray and Auger electron spectroscopies, x-ray diffraction, and high resolution profilometry. Cu 2p core level spectra were used to demonstrate the presence of Cu2O and CuO and to determine the oxidation states.

  15. TWT efficiency enhancement with textured carbon surfaces on copper MDC electrodes. [multistage depressed collectors

    NASA Technical Reports Server (NTRS)

    Curren, A. N.; Ramins, P.

    1985-01-01

    A method of improving the efficiency of multistage depressed collectors (MDC's) for traveling-wave tubes (TWT's) has been demonstrated at the NASA Lewis Research Center. A significant increase in MDC efficiency was brought about by the application of a thin layer of highly-textured carbon to the surfaces of oxygen-free, high-conductivity (OFHC) copper collector electrodes in an experimental TWT. The textured carbon layer was applied by means of a NASA developed sputtering procedure. In an experimental investigation recently completed, this electrode surface modification resulted in an increase in MDC efficiency by as much as 8.6 percentage points relative to that of the same MDC with untreated copper electrode surfaces. This increase in MDC efficiency was reflected by an increase in overall TWT efficiency by as much as 5.4 percentage points.

  16. TWT efficiency enhancement with textured carbon surfaces on copper MDC electrodes

    NASA Astrophysics Data System (ADS)

    Curren, A. N.; Ramins, P.

    1985-12-01

    A method of improving the efficiency of multistage depressed collectors (MDC's) for traveling-wave tubes (TWT's) has been demonstrated at the NASA Lewis Research Center. A significant increase in MDC efficiency was brought about by the application of a thin layer of highly-textured carbon to the surfaces of oxygen-free, high-conductivity (OFHC) copper collector electrodes in an experimental TWT. The textured carbon layer was applied by means of a NASA developed sputtering procedure. In an experimental investigation recently completed, this electrode surface modification resulted in an increase in MDC efficiency by as much as 8.6 percentage points relative to that of the same MDC with untreated copper electrode surfaces. This increase in MDC efficiency was reflected by an increase in overall TWT efficiency by as much as 5.4 percentage points.

  17. Steady Deflagration of PBX-9501 Within a Copper Cylinder

    SciTech Connect

    Pemberton, Steven J.; Herrera, Dennis H.; Herrera, Tommy J.; Arellano, Jesus C.; Sandoval, Thomas D.

    2012-06-26

    A copper cylinder cook-off experiment has been designed to cause steady deflagration in PBX-9501 explosive material. The design is documented and preliminary copper expansion results are presented for steady deflagration with a reaction speed of 1092 +/- 24 m/s. The expansion of reaction products from the detonation of an explosive is something that is well understood, and reasonably simulated using documented equations of state (EOS) for many explosives of interest. These EOS were historically measured using a 'standard' copper cylinder test design; this design comprised an annealed, oxygen-free high conductivity (OFHC) copper tube filled with explosive material and detonated from one end. Expansion of the copper wall was measured as a function of time using either a streak camera (for classic testing), or more recently using laser velocimetry techniques. Expansion data were then used to derive the EOS in various preferred forms - which are not discussed here for the sake of brevity. [Catanach, et. al., 1999] When an explosive deflagrates rather than detonating, simulation becomes more difficult. Reaction products are released on a slower time scale, and the reactions are much more affected by the geometry and local temperature within the reaction environment. It is assumed that the standard, documented EOS will no longer apply. In an effort to establish a first order approximation of deflagration product behavior, a cook-off test has been designed to cause steady deflagration in PBX-9501 explosive material, and to record the copper expansion profile as a function of time during this test. The purpose of the current paper is to document the initial test design and report some preliminary results. A proposal for modification of the design is also presented.

  18. Copper transport.

    PubMed

    Linder, M C; Wooten, L; Cerveza, P; Cotton, S; Shulze, R; Lomeli, N

    1998-05-01

    In adult humans, the net absorption of dietary copper is approximately 1 mg/d. Dietary copper joins some 4-5 mg of endogenous copper flowing into the gastrointestinal tract through various digestive juices. Most of this copper returns to the circulation and to the tissues (including liver) that formed them. Much lower amounts of copper flow into and out of other major parts of the body (including heart, skeletal muscle, and brain). Newly absorbed copper is transported to body tissues in two phases, borne primarily by plasma protein carriers (albumin, transcuprein, and ceruloplasmin). In the first phase, copper goes from the intestine to the liver and kidney; in the second phase, copper usually goes from the liver (and perhaps also the kidney) to other organs. Ceruloplasmin plays a role in this second phase. Alternatively, liver copper can also exit via the bile, and in a form that is less easily reabsorbed. Copper is also present in and transported by other body fluids, including those bathing the brain and central nervous system and surrounding the fetus in the amniotic sac. Ceruloplasmin is present in these fluids and may also be involved in copper transport there. The concentrations of copper and ceruloplasmin in milk vary with lactational stage. Parallel changes occur in ceruloplasmin messenger RNA expression in the mammary gland (as determined in pigs). Copper in milk ceruloplasmin appears to be particularly available for absorption, at least in rats. PMID:9587137

  19. Optical properties of ion beam textured metals. [using copper, silicon, aluminum, titanium and stainless steels

    NASA Technical Reports Server (NTRS)

    Hudson, W. R.; Weigand, A. J.; Mirtich, M. J.

    1977-01-01

    Copper, silicon, aluminum, titanium and 316 stainless steel were textured by 1000 eV xenon ions from an 8 cm diameter electron bombardment ion source. Simultaneously sputter-deposited tantalum was used to facilitate the development of the surface microstructure. Scanning electron microscopy of the ion textured surfaces revealed two types of microstructure. Copper, silicon, and aluminum developed a cone structure with an average peak-to-peak distance ranging from 1 micron for silicon to 6 microns for aluminum. Titanium and 316 stainless steel developed a serpentine ridge structure. The average peak-to-peak distance for both of these materials was 0.5 micron. Spectral reflectance was measured using an integrating sphere and a holraum reflectometer. Total reflectance for air mass 0 and 2, solar absorptance and total emittance normalized for a 425 K black body were calculated from the reflectance measurements.

  20. Graphite fiber textile preform/copper matrix composites

    NASA Technical Reports Server (NTRS)

    Gilatovs, G. J.; Lee, Bruce; Bass, Lowell

    1995-01-01

    Graphite fiber reinforced/copper matrix composites have sufficiently high thermal conduction to make them candidate materials for critical heat transmitting and rejection components. The term textile composites arises because the preform is braided from fiber tows, conferring three-dimensional reinforcement and near net shape. The principal issues investigated in the past two years have centered on developing methods to characterize the preform and fabricated composite and on braidability. It is necessary to have an analytic structural description for both processing and final property modeling. The structure of the true 3-D braids used is complex and has required considerable effort to model. A structural mapping has been developed as a foundation for analytic models for thermal conduction and mechanical properties. The conductivity has contributions both from the copper and the reinforcement. The latter is accomplished by graphitization of the fibers, the higher the amount of graphitization the greater the conduction. This is accompanied by an increase in the fiber modulus, which is desirable from a stiffness point of view but decreases the braidability; the highest conductivity fibers are simply too brittle to be braided. Considerable effort has been expended on determining the optimal braidability--conductivity region. While a number of preforms have been fabricated, one other complication intervenes; graphite and copper are immiscible, resulting in a poor mechanical bond and difficulties in infiltration by molten copper. The approach taken is to utilize a proprietary fiber coating process developed by TRA, of Salt Lake City, Utah, which forms an itermediary bond. A number of preforms have been fabricated from a variety of fiber types and two sets of these have been infiltrated with OFHC copper, one with the TRA coating and one without. Mechanical tests have been performed using a small-scale specimen method and show the coated specimens to have superior

  1. Damage Characterization in Copper Deformed Under Hydrostatic Stress - Experimental Analysis

    NASA Astrophysics Data System (ADS)

    Flater, Philip; de Angelis, Robert; House, Joel

    2005-07-01

    This paper presents an experimental investigation to characterize the effect of damage created by hydrostatic tensile loading on the properties of copper. Three metallurgical conditions were investigated: half-hard OFHC copper in the as worked, annealed 2hr at 400°C (˜40 micron grain diameter), and annealed 2hr at 800^ oC (˜80 micron grain diameter). Quasi-static testing of each condition included uniaxial tension and compression, round notched bar tension, and flat tapered bar tension. Dynamic properties under uniaxial tension and compression were tested using a split-Hopkinson pressure bar. Damaged structures were created employing Taylor impact tests and rod-on-rod impact experiments. The resulting damage was characterized employing optical and scanning electron microscopy. Quasi-static compression samples machined from recovered samples were tested to determine the influence of damage on deformation behavior and elastic modulus. The compression experimental results will be discussed in relationship to the starting microstructure and subsequent damaged material.

  2. HIGH-STRAIN RATE RESPONSE OF ULTRA-FINE GRAINED COPPER: EXPERIMENTS AND ANALYSIS

    SciTech Connect

    Mishra, Anuj; Kad, Bimal; Martin, Morgana; Thadhani, Naresh; Kenik, Edward A; Myers, Marc A.

    2008-07-01

    The high-strain rate response of ultra-fine grained (UFG) copper processed by Equal Channel Angular Pressing (ECAP) was characterized by reverse Taylor impact and Hopkinson-bar experiments. Two types of copper samples are tested using Hopkinson bar: (a) cylindrical samples to investigate the response at high strain-rates,(b) hat shaped samples to compare the shear band characteristics in UFG copper with the ones that have been studied in coarse grained samples. This can be attributed to the high strain-rate sensitivity of the fine grained FCC metals. Upon impact, the samples were found to undergo heat induced static recrystallization at a calculated temperature of 360K, indicating that the UFG copper is thermally unstable. Reverse Taylor tests were conducted on as-received OFHC Cu rod and ECAP specimens with sequential ECAP passes (2 and 8). The dynamic deformations of the samples are modeled using AUTODYN-2D and a modified Johnson-Cook constitutive equation was found to capture the dynamic response. Similar to the compression test results, the impacted front of the samples were found to recrystallize extensively and preferentially.

  3. Dispersion strengthened copper

    DOEpatents

    Sheinberg, Haskell; Meek, Thomas T.; Blake, Rodger D.

    1990-01-01

    A composition of matter comprised of copper and particles which are dispersed throughout the copper, where the particles are comprised of copper oxide and copper having a coating of copper oxide, and a method for making this composition of matter.

  4. Dispersion strengthened copper

    DOEpatents

    Sheinberg, Haskell; Meek, Thomas T.; Blake, Rodger D.

    1989-01-01

    A composition of matter comprised of copper and particles which are dispersed throughout the copper, where the particles are comprised of copper oxide and copper having a coating of copper oxide, and a method for making this composition of matter.

  5. Copper Metallochaperones

    PubMed Central

    Robinson, Nigel J.; Winge, Dennis R.

    2014-01-01

    The current state of knowledge on how copper metallochaperones support the maturation of cuproproteins is reviewed. Copper is needed within mitochondria to supply the CuA and intramembrane CuB sites of cytochrome oxidase, within the trans-Golgi network to supply secreted cuproproteins and within the cytosol to supply superoxide dismutase 1 (Sod1). Subpopulations of copper-zinc superoxide dismutase also localize to mitochondria, the secretory system, the nucleus and, in plants, the chloroplast, which also requires copper for plastocyanin. Prokaryotic cuproproteins are found in the cell membrane and in the periplasm of gram-negative bacteria. Cu(I) and Cu(II) form tight complexes with organic molecules and drive redox chemistry, which unrestrained would be destructive. Copper metallochaperones assist copper in reaching vital destinations without inflicting damage or becoming trapped in adventitious binding sites. Copper ions are specifically released from copper metallochaperones upon contact with their cognate cuproproteins and metal transfer is thought to proceed by ligand substitution. PMID:20205585

  6. Performance of a Cryogenic 21 Meter-Path Copper Herriott Cell Vacuum Coupled to a Bruker 125HR System

    NASA Astrophysics Data System (ADS)

    Mantz, Arlan W.; Sung, Keeyoon; Crawford, Timothy J.; Yu, Shanshan; Brown, Linda R.; Smith, Mary Ann H.; Devi, V. Malathy; Benner, D. Chris

    2013-06-01

    Accurate modeling of planetary atmospheres requires a detailed knowledge of the temperature and pressure dependence of spectroscopic line parameters of atmospheric molecules. With this requirement in mind, a new Herriott cell having a 21 meter folded absorption path was designed and fabricated with Oxygen-Free High Conductivity (OFHC) copper body and gold coated OFHC copper mirrors to operate for the first time with a broad-band Fourier transform spectrometer. The cell, enclosed in an isolated vacuum box, is cooled by a CTI Cryogenics, Inc. model 1050 closed-cycle helium refrigerator which also cryopumps the vacuum box. The temperature of the cell is monitored by a silicon temperature sensor and regulated by a Lakeshore model 331 temperature controller. The new cell system was integrated to the JPL Bruker model 125HR interferometer with transfer optics which are fully evacuated to 12 mTorr (the pressure inside the interferometer). The optics were through-put matched for entrance apertures smaller than 2 mm. The system has successfully operated for several months at gas sample temperatures between 75 and 250 K with extremely good stability to obtain spectra of methane, carbon dioxide, and oxygen bands between 0.76 and 3 μm. We present the characterization and performance of the Herriott cell system and preliminary analyses of newly recorded spectra. Research described in this paper was performed at Connecticut College, the Jet Propulsion Laboratory, California Institute of Technology, NASA Langley Research Center, and The College of William and Mary under contracts and cooperative agreements with the National Aeronautics and Space Administration.

  7. Modeling and evaluation of HE driven shock effects in copper with the MTS model

    SciTech Connect

    Murphy, M.J.; Lassila, D.F.

    1997-03-17

    Many experimental studies have investigated the effect of shock pressure on the post-shock mechanical properties of OFHC copper. These studies have shown that significant hardening occurs during shock loading due to dislocation processes and twinning. It has been demonstrated that when an appropriate initial value of the Mechanical Threshold Stress (MTS) is specified, the post-shock flow stress of OFE copper is well described by relationships derived independently for unshocked materials. In this study we consider the evolution of the MTS during HE driven shock loading processes and the effect on the subsequent flow stress of the copper. An increased post shock flow stress results in a higher material temperature due to an increase in the plastic work. An increase in temperature leads to thermal softening which reduces the flow stress. These coupled effects will determine if there is melting in a shaped charge jet or a necking instability in an EFP Ww. `Me critical factor is the evolution path followed combined with the `current` temperature, plastic strain, and strain rate. Preliminary studies indicate that in simulations of HE driven shock with very high resolution zoning, the MTS saturates because of the rate dependence in the evolution law. On going studies are addressing this and other issues with the goal of developing a version of the MT`S model that treats HE driven, shock loading, temperature, strain, and rate effects apriori.

  8. Copper cyanide

    Integrated Risk Information System (IRIS)

    Copper cyanide ; CASRN 544 - 92 - 3 Human health assessment information on a chemical substance is included in the IRIS database only after a comprehensive review of toxicity data , as outlined in the IRIS assessment development process . Sections I ( Health Hazard Assessments for Noncarcinogenic Ef

  9. Oxidation of Copper Alloy Candidates for Rocket Engine Applications

    NASA Technical Reports Server (NTRS)

    Ogbuji, Linus U. Thomas; Humphrey, Donald L.

    2002-01-01

    The gateway to affordable and reliable space transportation in the near future remains long-lived rocket-based propulsion systems; and because of their high conductivities, copper alloys remain the best materials for lining rocket engines and dissipating their enormous thermal loads. However, Cu and its alloys are prone to oxidative degradation -- especially via the ratcheting phenomenon of blanching, which occurs in situations where the local ambient can oscillate between oxidation and reduction, as it does in a H2/02- fuelled rocket engine. Accordingly, resistance to blanching degradation is one of the key requirements for the next generation of reusable launch vehicle (RLV) liner materials. Candidate copper alloys have been studied with a view to comparing their oxidation behavior, and hence resistance to blanching, in ambients corresponding to conditions expected in rocket engine service. These candidate materials include GRCop-84 and GRCop-42 (Cu - Cr-8 - Nb-4 and Cu - Cr-4 - Nb-2 respectively); NARloy-Z (Cu-3%Ag-0.5%Y), and GlidCop (Cu-O.l5%Al2O3 ODS alloy); they represent different approaches to improving the mechanical properties of Cu without incurring a large drop in thermal conductivity. Pure Cu (OFHC-Cu) was included in the study to provide a baseline for comparison. The samples were exposed for 10 hours in the TGA to oxygen partial pressures ranging from 322 ppm to 1.0 atmosphere and at temperatures of up to 700 C, and examined by SEM-EDS and other techniques of metallography. This paper will summarize the results obtained.

  10. Low-cycle fatigue behavior of oxygen-free high-conductivity copper at 300/sup 0/C in high vacuum

    SciTech Connect

    Liu, K.C.; Loring, C.M. Jr.

    1983-01-01

    In-vacuum fatigue tests were performed on commercially-pure OFHC copper and 35% Au-65% Cu brazing filler metal at 300/sup 0/C. Excessive recrystallization due to exposure in the 1025/sup 0/C brazing temperature cycle was detrimental to the fatigue life of the base metal; cold work was beneficial to the fatigue resistance. Triple-point cracking and grain boundary sliding were the prevailing modes of fatigue failure observed in the full-size specimens. However, a mixed morphology of ductile and cleavage-like fracture was observed on the fracture surface of the subsize specimen in which the grain structure appeared to have undergone a change because of the presence of surface cold work. The braze has superior fatigue resistance, but to exploit the maximum strength, the brazed joint must be devoid of defects such as cavities and cracks.

  11. Dispersion strengthened copper

    DOEpatents

    Sheinberg, H.; Meek, T.T.; Blake, R.D.

    1990-01-09

    A composition of matter is described which is comprised of copper and particles which are dispersed throughout the copper, where the particles are comprised of copper oxide and copper having a coating of copper oxide. A method for making this composition of matter is also described. This invention relates to the art of powder metallurgy and, more particularly, it relates to dispersion strengthened metals.

  12. COPPER AND BRAIN FUNCTION

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Increasing evidence shows that brain development and function are impaired when the brain is deprived of copper either through dietary copper deficiency or through genetic defects in copper transport. A number of copper-dependent enzymes whose activities are lowered by copper deprivation form the ba...

  13. Interaction of atomic oxygen with thin film and bulk copper: An XPS, AES, XRD, and profilometer study

    NASA Technical Reports Server (NTRS)

    Raikar, Genesh N.; Gregory, John C.; Christl, Ligia C.; Peters, Palmer N.

    1992-01-01

    The University of Alabama in Huntsville (UAH) experiment A-0114 was designed primarily to study degradation of material surfaces due to low earth orbital (LEO) atmospheric oxygen. The experiment contained 128 one inch circular samples: metals, polymers, carbons, and semiconductors. Among metal samples, copper has shown some interesting new results. Two types of copper samples, a film sputter coated on fused silica and a bulk piece of OFHC copper, were characterized employing a variety of techniques such as X-ray and Auger electron spectroscopies, X-ray diffraction, and high resolution profilometry. Cu 2p core level spectra were used to characterize the presence of Cu2O and CuO in addition to Cu Auger LMM lines. These results are supported by our recent X-ray diffraction studies which clearly establish the presence of Cu oxides which we were unable to prove in our earlier work. Profilometry showed an increase in thickness of the film sample where exposed to 106.7 +/- 0.5 nm from an initial thickness of 74.2 +/- 1.1 nm. Further studies with SEM and ellipsometry are underway.

  14. Copper and Copper Proteins in Parkinson's Disease

    PubMed Central

    Rivera-Mancia, Susana; Diaz-Ruiz, Araceli; Tristan-Lopez, Luis; Rios, Camilo

    2014-01-01

    Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson's disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson's disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson's disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson's disease and that a mutation in ATP7B could be associated with Parkinson's disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology. PMID:24672633

  15. X-ray photoelectron spectroscopy analysis of aluminum and copper cleaning procedures for the Advanced Photon Source

    SciTech Connect

    Rosenberg, R.A.; McDowell, M.W.; Noonan, J.R. )

    1994-07-01

    The Advanced Photon Source (APS), presently under construction, will produce x rays of unprecedented brightness. The storage ring where the x rays will be produced will be constructed from an extruded 6063 aluminum alloy, while transition pieces (flanges, etc.) will be made from a 2219 aluminum alloy. In addition, cooled photon absorbers will be placed in strategic locations throughout the ring to intercept the majority of the unused high power-density radiation. These will be made of either CDA-101 (OFHC) copper or glidcop (a dispersion strengthened copper alloy). Before any of these components can be assembled they must be cleaned to remove surface contaminants so that the ultrahigh vacuum ([lt]0.1 nTorr) necessary for successful operation can be achieved. Many recipes for cleaning aluminum and copper exist; however, most of them involve the use of chemicals that present safety and/or environmental concerns. We have undertaken an x-ray photoelectron spectroscopy study of the effects of a variety of commercially available cleaners on the surface cleanliness of aluminum and copper. Several important results have been identified in this study. A simple alkaline detergent in an ultrasonic bath cleans aluminum alloys as effectively as the more aggressive cleaning solutions. The detergent can be used at 65 [degree]C to clean the 6063 alloy and at 50 [degree]C to clean the 2219 alloy. A citric acid based cleaner was found to be effective at cleaning copper, although the surface oxidizes rapidly. To date, we have been unable to find a universal cleaning procedure, i.e., one that is optimal for cleaning both Al and Cu.

  16. [Copper transport and metabolism].

    PubMed

    Kurasaki, Masaaki; Saito, Takeshi

    2016-07-01

    In this review, copper metabolism and transport in mammalian tissues are introduced and discussed. Firstly, the copper required amounts and LD50 levels are shown to explain the difficult balances of copper in the cells between necessity and toxicity. Furthermore, on the basis of literatures published, relationship between copper-binding metallothioneins and mechanisms for the absorption and excretion of copper or hereditary copper metabolic disorders metabolism abnormality symptom are explained. Finally it has been indicated that apoptosis induced by heavy metals, especially copper was initiated by production of reactive oxygen species and oxidative stress in the cells. To understand precise mechanism for copper homeostasis in mammalian cells, further investigation will be needed to clarify the copper behaviors in normal and abnormal situations. PMID:27455798

  17. Explosive Welding of Aluminum, Titanium and Zirconium to Copper Sheet Metal

    NASA Technical Reports Server (NTRS)

    Hegazy, A. A.; Mote, J. D.

    1985-01-01

    The main material properties affecting the explosive weldability of a certain metal combination are the yield strength, the ductility, the density and the sonic velocity of the two metals. Successful welding of the metal combination depends mainly on the correct choice of the explosive welding parameters; i.e., the stand off distance, the weight of the explosive charge relative to the weight of the flyer plate and the detonation velocity of the explosive. Based on the measured and the handbook values of the properties of interest, the explosive welding parameters were calculated and the arrangements for the explosive welding of the Al alloy 6061-T6, titanium and zirconium to OFHC copper were determined. The relatively small sheet metal thickness (1/8") and the fact that the thickness of the explosive layer must exceed a certain minimum value were considered during the determination of the explosive welding conditions. The results of the metallographic investigations and the measurements of the shear strength at the interface demonstrate the usefulness of these calculations to minimize the number of experimental trials.

  18. Copper in diet

    MedlinePlus

    ... please enable JavaScript. Copper is an essential trace mineral present in all body tissues. Function Copper works ... nih.gov/pubmed/25057538 . Mason JB. Vitamins, trace minerals, and other micronutrients. In: Goldman L, Schafer AI, ...

  19. The analysis of beryllium-copper diffusion joint after HHF test

    SciTech Connect

    Guiniatouline, R.N.; Mazul, I.V.; Rubkin, S.Y.

    1995-09-01

    The development of beryllium-copper joints which can withstand to relevant ITER divertor conditions is one of the important tasks at present time. One of the main problem for beryllium-copperjoints, is the inter-metallic layers, the strength and life time of joints significantly depends from the width and contents of the intermetallic layers. The objective of this work is to study the diffusion joint of TGP-56 beryllium to OFHC copper after thermal response and thermocyclic tests with beryllium-copper mockup. The BEY test were performed at e-beam facility (EBTS, SNLA). The following methods were used for analyses: the roentgenographic analysis; X-ray spectrum analysis; the fracture graphic analysis. During the investigation the followed studies were done: the analysis of diffusion boundary Be-Cu, which was obtained at the crossection of one of the tiles, the analysis of the debonded surfaces of a few beryllium tiles and corresponding copper parts; the analysis of upper surface of one of the tiles after HHF tests. The results of this work have showed that: the joint roentgenographic and elements analyses indicated the following phases in the diffusion zone: Cu{sub 2}Be ({approximately}170 {mu}m), CuBe ({approximately}30{mu}m), CuBe{sub 2} ({approximately}1 {mu}m) and solid solution of copper in beryllium. The phases Cu{sub 2}Be, CuBe and solid solution of copper in beryllium were indicated using quantitative microanalysis and phases CuBe, CuBe{sub 2}, Cu, Be - by roentgenographic analysis; the source of fracture (initial crack) is located in the central part of the tiles, the crack caused by the influence of residual stresses during cooling of a mock-up after fabrication and developed under the conditions of slow elastic-plastic growing during the process of thermal fatigue testing. The analysis gives the important data about joint`s quality and also may be used for any type of joints and its comparison for ITER applications.

  20. Copper-tantalum alloy

    DOEpatents

    Schmidt, Frederick A.; Verhoeven, John D.; Gibson, Edwin D.

    1986-07-15

    A tantalum-copper alloy can be made by preparing a consumable electrode consisting of an elongated copper billet containing at least two spaced apart tantalum rods extending longitudinally the length of the billet. The electrode is placed in a dc arc furnace and melted under conditions which co-melt the copper and tantalum to form the alloy.

  1. Demystifying Controlling Copper Corrosion

    EPA Science Inventory

    The LCR systematically misses the highest health and corrosion risk sites for copper. Additionally, there are growing concerns for WWTP copper in sludges and discharge levels. There are many corrosion control differences between copper and lead. This talk explains the sometimes c...

  2. On copper peroxide

    NASA Technical Reports Server (NTRS)

    Moser, L.

    1988-01-01

    The action of hydrogen superoxide on copper salts in alcoholic solutions is studied. The action of hydrogen peroxide on copper hydroxide in alcoholic suspensions, and the action of ethereal hydrogen peroxide on copper hydroxide are discussed. It is concluded that using the procedure proposed excludes almost entirely the harmful effect of hydrolysis.

  3. High adherence copper plating process

    DOEpatents

    Nignardot, Henry

    1993-01-01

    A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.

  4. Tritium migration to the surfaces of Type 316 stainless steel; aluminum 6061; and oxygen-free, high-conductivity copper

    DOE PAGESBeta

    Sharpe, M.; Shmayda, W. T.; Schroder, W. U.

    2016-05-25

    The migration of tritium to the surfaces of aluminum 6061, oxygen-free, high-conductivity copper (OFHC), and stainless-steel 316 from the bulk metal was studied using low-pressure Tonks–Langmuir argon plasma. The plasma is shown to be effective at removing tritium from metal surfaces in a controlled manner. Tritium is removed in decreasing quantities with successive plasma exposures, which suggests a depletion of the surface and near-surface tritium inventories. A diffusion model was developed to predict tritium migration from the bulk and its accumulation in the water layers present on the metal surface. The model reproduces the rate of tritium re-growth on themore » surface for all three metals and can be used to calculate the triton solubility in the water layers present on metal surfaces. The ratio of surface-to-bulk solubilities at the water-layer/bulk-metal interface uniquely determines the concentration ratio between these two media. Removing the tritium-rich water layers induces tritium to migrate from the bulk to the surface. Furthermore, this process is driven by a concentration gradient that develops in the bulk because of the perturbation on the surface.« less

  5. Copper-containing zeolite catalysts

    DOEpatents

    Price, Geoffrey L.; Kanazirev, Vladislav

    1996-01-01

    A catalyst useful in the conversion of nitrogen oxides or in the synthesis of nitriles or imines from amines, formed by preparing an intimate mechanical mixture of a copper (II)-containing species, such as CuO or CuCl.sub.2, or elemental copper, with a zeolite having a pore mouth comprising 10 oxygen atoms, such as ZSM-5, converting the elemental copper or copper (II) to copper (I), and driving the copper (I) into the zeolite.

  6. Copper-containing zeolite catalysts

    DOEpatents

    Price, G.L.; Kanazirev, V.

    1996-12-10

    A catalyst useful in the conversion of nitrogen oxides or in the synthesis of nitriles or imines from amines, is formed by preparing an intimate mechanical mixture of a copper (II)-containing species, such as CuO or CuCl{sub 2}, or elemental copper, with a zeolite having a pore mouth comprising 10 oxygen atoms, such as ZSM-5, converting the elemental copper or copper (II) to copper (I), and driving the copper (I) into the zeolite.

  7. Improved Electroformed Structural Copper and Copper Alloys

    NASA Technical Reports Server (NTRS)

    Malone, G. A.; Hudson, W.; Babcock, B.; Edwards, R.

    1998-01-01

    Electroforming offers a superior means for fabricating internally cooled heat exchangers and structures subjected to thermal environments. Copper is deposited from many such applications because of the good thermal conductivity. It suffers from mediocre yield strength as a structural material and loses mechanical strength at intermediate temperatures. Mechanical properties similar to those of electroformed nickel are desired. Phase 1 examined innovative means to improve deposited copper structural performance. Yield strengths as high as 483 MPa (70 ksi) were obtained with useful ductility while retaining a high level of purity essential to good thermal conductivity. Phase 2 represents a program to explore new additive combinations in copper electrolytes to produce a more fine, equiaxed grain which can be thermally stabilized by other techniques such as alloying in modest degrees and dispersion strengthening. Evaluation of new technology - such as the codeposition of fullerness (diamond-like) particles were made to enhance thermal conductivity in low alloys. A test fire quality tube-bundle engine was fabricated using these copper property improvement concepts to show the superiority of the new coppers and fabrications methods over competitive technologies such as brazing and plasma deposition.

  8. A comparative TEM study of in-reactor and post-irradiation tensile tested copper

    NASA Astrophysics Data System (ADS)

    Pakarinen, J.; Tähtinen, S.; Singh, B. N.

    2013-11-01

    The deformation microstructures of oxygen-free high-conductivity (OFHC) copper were examined by transmission electron microscopy (TEM) following in-reactor and post-irradiation slow strain rate tensile tests. The TEM results suggest that the main modes of deformation differ between all examined cases. Plastic deformation appeared predominantly localized in the defect-free cleared channels following post-irradiation testing and hardly any dislocations were seen outside the channels. The microstructures following in-reactor tests were characterized by a small amount of cleared channels and a distinct dislocation density within the matrix. However, the dislocations observed following in-reactor testing did not seem to interact with each other, whereas that was the main mode of deformation in the non-irradiated reference sample. The possible mechanisms of plastic deformation are discussed based on the experimental results. Dislocation-dislocation interactions played the major role if irradiation or irradiation damage is not present. As a result of the interactions, the microstructure of non-irradiated reference copper was characterized by a well-defined cellularized dislocation microstructure. Dynamic dislocation-displacement cascade interactions dominated the deformation process at the in-reactor tensile tests. As a result, the formation of defect-free cleared channels was delayed, dislocations were found from the matrix between the channels, and a clear strain hardening was observed after the yield point. No clear difference between accumulated irradiation damage at in-reactor and post-irradiation samples was found, which may be due to localized nature of SFT evolution in displacement cascades at copper. In the post-irradiation experiments, dislocations were confined to slip planes and annihilate irradiation defects, while moving on the planes and creating defect-free cleared channels. The plastic deformation is localized into these channels, causing a decrease in

  9. Bioaccessibility and Solubility of Copper in Copper-Treated Lumber

    EPA Science Inventory

    Micronized copper (MC)-treated lumber is a recent replacement for Chromated Copper Arsenate (CCA) and Ammonium Copper (AC)-treated lumbers; though little is known about the potential risk of copper (Cu) exposure from incidental ingestion of MC-treated wood. The bioaccessibility o...

  10. COPPER CABLE RECYCLING TECHNOLOGY

    SciTech Connect

    Chelsea Hubbard

    2001-05-01

    The United States Department of Energy (DOE) continually seeks safer and more cost-effective technologies for use in deactivation and decommissioning (D&D) of nuclear facilities. The Deactivation and Decommissioning Focus Area (DDFA) of the DOE's Office of Science and Technology (OST) sponsors large-scale demonstration and deployment projects (LSDDPs). At these LSDDPs, developers and vendors of improved or innovative technologies showcase products that are potentially beneficial to the DOE's projects and to others in the D&D community. Benefits sought include decreased health and safety risks to personnel and the environment, increased productivity, and decreased costs of operation. The Idaho National Engineering and Environmental Laboratory (INEEL) generated a list of statements defining specific needs and problems where improved technology could be incorporated into ongoing D&D tasks. One such need is to reduce the volume of waste copper wire and cable generated by D&D. Deactivation and decommissioning activities of nuclear facilities generates hundreds of tons of contaminated copper cable, which are sent to radioactive waste disposal sites. The Copper Cable Recycling Technology separates the clean copper from contaminated insulation and dust materials in these cables. The recovered copper can then be reclaimed and, more importantly, landfill disposal volumes can be reduced. The existing baseline technology for disposing radioactively contaminated cables is to package the cables in wooden storage boxes and dispose of the cables in radioactive waste disposal sites. The Copper Cable Recycling Technology is applicable to facility decommissioning projects at many Department of Energy (DOE) nuclear facilities and commercial nuclear power plants undergoing decommissioning activities. The INEEL Copper Cable Recycling Technology Demonstration investigated the effectiveness and efficiency to recycle 13.5 tons of copper cable. To determine the effectiveness of separating

  11. Fabricating Copper Nanotubes by Electrodeposition

    NASA Technical Reports Server (NTRS)

    Yang, E. H.; Ramsey, Christopher; Bae, Youngsam; Choi, Daniel

    2009-01-01

    Copper tubes having diameters between about 100 and about 200 nm have been fabricated by electrodeposition of copper into the pores of alumina nanopore membranes. Copper nanotubes are under consideration as alternatives to copper nanorods and nanowires for applications involving thermal and/or electrical contacts, wherein the greater specific areas of nanotubes could afford lower effective thermal and/or electrical resistivities. Heretofore, copper nanorods and nanowires have been fabricated by a combination of electrodeposition and a conventional expensive lithographic process. The present electrodeposition-based process for fabricating copper nanotubes costs less and enables production of copper nanotubes at greater rate.

  12. Copper as a biocidal tool.

    PubMed

    Borkow, Gadi; Gabbay, Jeffrey

    2005-01-01

    Copper ions, either alone or in copper complexes, have been used to disinfect liquids, solids and human tissue for centuries. Today copper is used as a water purifier, algaecide, fungicide, nematocide, molluscicide as well as an anti-bacterial and anti-fouling agent. Copper also displays potent anti-viral activity. This article reviews (i) the biocidal properties of copper; (ii) the possible mechanisms by which copper is toxic to microorganisms; and (iii) the systems by which many microorganisms resist high concentrations of heavy metals, with an emphasis on copper. PMID:16101497

  13. Volatility of copper

    SciTech Connect

    Palmer, D.A.; Simonson, J.M.; Joyce, D.B.

    1996-08-01

    The relevant aqueous thermodynamics of copper and its oxides are evaluated and summarized with emphasis on solubility, hydrolysis, and complexation. The solubilities of metallic copper, solid cuprous and cupric oxides in steam measured by Pocock and Stewart in 1963 are discussed and the latter data are fitted in the form of established empirical equations and compared to other existing results. No other sources of data were found for the solubility of copper and cupric oxide in steam and even these data are very limited. Discussion of corresponding available solubility data on both oxide phases in liquid water is given. The possible effects of complexing agents are considered. A brief discussion is provided of the role of surface adsorption in determining the fate of dissolved copper in the boiler. 37 refs., 5 figs., 3 tabs.

  14. Bacterial Killing by Dry Metallic Copper Surfaces▿

    PubMed Central

    Santo, Christophe Espírito; Lam, Ee Wen; Elowsky, Christian G.; Quaranta, Davide; Domaille, Dylan W.; Chang, Christopher J.; Grass, Gregor

    2011-01-01

    Metallic copper surfaces rapidly and efficiently kill bacteria. Cells exposed to copper surfaces accumulated large amounts of copper ions, and this copper uptake was faster from dry copper than from moist copper. Cells suffered extensive membrane damage within minutes of exposure to dry copper. Further, cells removed from copper showed loss of cell integrity. Acute contact with metallic copper surfaces did not result in increased mutation rates or DNA lesions. These findings are important first steps for revealing the molecular sensitive targets in cells lethally challenged by exposure to copper surfaces and provide a scientific explanation for the use of copper surfaces as antimicrobial agents for supporting public hygiene. PMID:21148701

  15. Preparation of high purity copper fluoride by fluorinating copper hydroxyfluoride

    NASA Technical Reports Server (NTRS)

    King, R. B.; Lundquist, J. R.

    1969-01-01

    Copper fluoride containing no more than 50 ppm of any contaminating element was prepared by the fluorination of copper hydroxyfluoride. The impurity content was obtained by spark source mass spectrometry. High purity copper fluoride is needed as a cathode material for high energy density batteries.

  16. Copper and copper-nickel alloys as zebra mussel antifoulants

    SciTech Connect

    Dormon, J.M.; Cottrell, C.M.; Allen, D.G.; Ackerman, J.D.; Spelt, J.K.

    1996-04-01

    Copper has been used in the marine environment for decades as cladding on ships and pipes to prevent biofouling by marine mussels (Mytilus edulis L.). This motivated the present investigation into the possibility of using copper to prevent biofouling in freshwater by both zebra mussels and quagga mussels (Dreissena polymorpha and D. bugensis collectively referred to as zebra mussels). Copper and copper alloy sheet proved to be highly effective in preventing biofouling by zebra mussels over a three-year period. Further studies were conducted with copper and copper-nickel mesh (lattice of expanded metal) and screen (woven wire with a smaller hole size), which reduced the amount of copper used. Copper screen was also found to be strongly biofouling-resistant with respect to zebra mussels, while copper mesh reduced zebra mussel biofouling in comparison to controls, but did not prevent it entirely. Preliminary investigations into the mechanism of copper antifouling, using galvanic couples, indicated that the release of copper ions from the surface of the exposed metal into the surrounding water is directly or indirectly responsible for the biofouling resistance of copper.

  17. Ceruloplasmin, copper ions, and angiogenesis.

    PubMed

    Raju, K S; Alessandri, G; Ziche, M; Gullino, P M

    1982-11-01

    The ability to induce new formation of capillaries in the cornea was tested for ceruloplasmin, the copper carrier of serum, for fragments of the ceruloplasmin molecule with and without copper, for heparin, and for glycyl-L-histidyl-L-lysine, bound or not bound to copper ions. Male or female 2- to 3-kg New Zealand White rabbits were used. These experiments were prompted by the previous observation of copper accumulation in the cornea during angiogenesis and by the inability of copper-deficient rabbits to mount an angiogenic response. The results showed that the three different molecules were all able to induce angiogenesis provided that they were bound to copper. Fragments of the ceruloplasmin molecule also induced angiogenesis but only when copper was bound to the peptides. The data are interpreted to indicate that copper ions are involved in the sequence of events leading to angiogenesis and that the carrier molecules may be of quite a different nature. PMID:6182332

  18. Copper-phosphorus alloys offer advantages in brazing copper

    SciTech Connect

    Rupert, W.D.

    1996-05-01

    Copper-phosphorus brazing alloys are used extensively for joining copper, especially refrigeration and air-conditioning copper tubing and electrical conductors. What is the effect of phosphorus when alloyed with copper? The following are some of the major effects: (1) It lowers the melt temperature of copper (a temperature depressant). (2) It increases the fluidity of the copper when in the liquid state. (3) It acts as a deoxidant or a fluxing agent with copper. (4) It lowers the ductility of copper (embrittles). There is a misconception that silver improves the ductility of the copper-phosphorus alloys. In reality, silver added to copper acts in a similar manner as phosphorus. The addition of silver to copper lowers the melt temperature (temperature depressant) and decreases the ductility. Fortunately, the rate and amount at which silver lowers copper ductility is significantly less than that of phosphorus. Therefore, taking advantage of the temperature depressant property of silver, a Ag-Cu-P alloy can be selected at approximately the same melt temperature as a Cu-P alloy, but at a lower phosphorus content. The lowering of the phosphorus content actually makes the alloy more ductile, not the silver addition. A major advantage of the copper-phosphorus alloys is the self-fluxing characteristic when joining copper to copper. They may also be used with the addition of a paste flux on brass, bronze, and specialized applications on silver, tungsten and molybdenum. Whether it is selection of the proper BCuP alloy or troubleshooting an existing problem, the suggested approach is a review of the desired phosphorus content in the liquid metal and how it is being altered during application. In torch brazing, a slight change in the oxygen-fuel ratio can affect the joint quality or leak tightness.

  19. High adherence copper plating process

    DOEpatents

    Nignardot, H.

    1993-09-21

    A process is described for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing the surface of an aluminum or steel substrate for the electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to either substrate.

  20. High adherence copper plating process

    SciTech Connect

    Mignardot, H.

    1992-12-31

    A process is described for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.

  1. SOURCES OF COPPER AIR EMISSIONS

    EPA Science Inventory

    The report gives results of a study to update estimates of atmospheric emissions of copper and copper compounds in the U.S. Source categories evaluated included: metallic minerals, primary copper smelters, iron and steel making, combustion, municipal incineration, secondary coppe...

  2. Lab Tracker and Copper Calculator

    MedlinePlus

    ... on the top of this page. Appendix: Recommended Target Result Ranges for Good Copper Control in Treated Wilson Disease Patients. 24 Hour Urine Copper On Chelators: 200 - 500µg (3 - 8µmoles)/day On Zinc: <75µg/day 24 Hour Urine Zinc >2.0mg/day Non-Ceruloplasmin in Bound (Free) Copper 5 - 15 µg/ ...

  3. Creative Copper Crests

    ERIC Educational Resources Information Center

    Knab, Thomas

    2011-01-01

    In this article, the author discusses how to create an art activity that would link the computer-created business cards of fourth-grade students with an upcoming school-wide medieval event. Creating family crests from copper foil would be a great connection, since they, like business cards, are an individual's way to identify themselves to others.…

  4. Copper leaching from chalcopyrite concentrates

    NASA Astrophysics Data System (ADS)

    Wang, Shijie

    2005-07-01

    Chalcopyrite (CuFeS2) is one of the most abundant copper-bearing minerals, which accounts for approximately 70 percent of the world’s known copper reserves. For more than 30 years, a significant number of processes have been developed to leach copper from chalcopyrite concentrates. These processes recover copper via hydrometallurgical leaching of the copper component of chalcopyrite concentrates, followed by solvent extraction and electrowinning. A number of demonstration plant operations have been conducted, but as of this writing none of the processes have become completely commercially operational.

  5. Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films

    SciTech Connect

    Curtis, Calvin J; Miedaner, Alexander; Van Hest, Maikel; Ginley, David S

    2014-11-04

    Liquid-based precursors for formation of Copper Selenide, Indium Selenide, Copper Indium Diselenide, and/or copper Indium Galium Diselenide include copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent. These liquid-based precursors can be deposited in liquid form onto substrates and treated by rapid thermal processing to form crystalline copper selenide and indium selenide films.

  6. Production of ultrahigh purity copper using waste copper nitrate solution.

    PubMed

    Choi, J Y; Kim, D S

    2003-04-25

    The production of ultrahigh purity copper (99.9999%) by electrolysis in the presence of a cementation barrier has been attempted employing a waste nitric copper etching solution as the electrolyte. The amount of copper deposited on the cathode increased almost linearly with electrolysis time and the purity of copper was observed to increase as the electrolyte concentration was increased. At some point, however, as the electrolyte concentration increased, the purity of copper decreased slightly. As the total surface area of cementation barrier increased, the purity of product increased. The electrolyte temperature should be maintained below 35 degrees C in the range of investigated electrolysis conditions to obtain the ultrahigh purity copper. Considering that several industrial waste solutions contain valuable metallic components the result of present study may support a claim that electrowinning is a very desirable process for their treatment and recovery. PMID:12719148

  7. Type Zero Copper Proteins

    PubMed Central

    Lancaster, Kyle M.; DeBeer George, Serena; Yokoyama, Keiko; Richards, John H.; Gray, Harry B.

    2009-01-01

    Copper proteins play key roles in biological processes such as electron transfer and dioxygen activation; the active site of each of these proteins is classified as either type 1, 2, or 3, depending on its optical and electron paramagnetic resonance properties. We have built a new type of site that we call “type zero copper” by incorporating leucine, isoleucine, or phenylalanine in place of methionine at position 121 in C112D Pseudomonas aeruginosa azurin. X-ray crystallographic analysis shows that these sites adopt distorted tetrahedral geometries, with an unusually short Cu-O(G45 carbonyl) bond (2.35–2.55 Å). Relatively weak absorption near 800 nm and narrow parallel hyperfine splittings in EPR spectra are the spectroscopic signatures of type zero copper. Copper K-edge x-ray absorption spectra suggest elevated Cu(II) 4p character in the d-electron ground state. Cyclic voltammetric experiments demonstrate that the electron transfer reactivities of type zero azurins are enhanced relative to that of the corresponding type 2 (C112D) protein. PMID:20305734

  8. [Determination of gold in copper matte and sintered copper material].

    PubMed

    Ge, Yu-wei; Xiao, Li-mei; Suo, Jin-ling; Wang, Cheng; Hu, Xiao-min; Zhao, Shu-yun

    2011-05-01

    Ore sample, pretreated at 650 degrees C, was decomposed with aqua regia. Gold in the sample solution was then pre-concentrated by adsorbing with polyurethane foam plastic, released with thiourea solution, and determined by inductively coupled plasma-atomic emission spectrometry and flame atomic absorption spectrometry. Based on the characteristic of the copper matte and sinter containing copper, the effects of sample dissolving condition, matrix effect and interference of coexisting elements were investigated. The accuracy, precision and detection limit were discussed. The results of test show that both of the two methods were suitable for determining the contents of gold in copper matte and sintered copper material. PMID:21800614

  9. "Myelodysplasia," myeloneuropathy, and copper deficiency.

    PubMed

    Kumar, Neeraj; Elliott, Michelle A; Hoyer, James D; Harper, Charles M; Ahlskog, J Eric; Phyliky, Robert L

    2005-07-01

    We describe a patient with a suspected myelodysplastic syndrome that developed in association with a neurologic disorder resembling subacute combined degeneration but without vitamin B12 deficiency. Ultimately, the hematologic manifestations and the neurologic syndrome were linked to severe copper deficiency. Prompt and complete reversal of the hematologic abnormalities occurred with copper replacement. Serum copper determination should be included in the work-up of patients with anemia and leukopenia of unclear etiology who have associated myeloneuropathy. The hematologic picture can resemble sideroblastic anemia or myelodysplastic syndrome. Hyperzincemia can be an accompanying abnormality even without exogenous zinc ingestion. The reason for the copper deficiency may not be evident. PMID:16007901

  10. Oxidation Mechanism of Copper Selenide

    NASA Astrophysics Data System (ADS)

    Taskinen, Pekka; Patana, Sonja; Kobylin, Petri; Latostenmaa, Petri

    2014-09-01

    The oxidation mechanism of copper selenide was investigated at deselenization temperatures of copper refining anode slimes. The isothermal roasting of synthetic, massive copper selenide in flowing oxygen and oxygen - 20% sulfur dioxide mixtures at 450-550 °C indicate that in both atmospheres the mass of Cu2Se increases as a function of time, due to formation of copper selenite as an intermediate product. Copper selenide oxidises to copper oxides without formation of thick copper selenite scales, and a significant fraction of selenium is vaporized as SeO2(g). The oxidation product scales on Cu2Se are porous which allows transport of atmospheric oxygen to the reaction zone and selenium dioxide vapor to the surrounding gas. Predominance area diagrams of the copper-selenium system, constructed for selenium roasting conditions, indicate that the stable phase of copper in a selenium roaster gas with SO2 is the sulfate CuSO4. The cuprous oxide formed in decomposition of Cu2Se is further sulfated to CuSO4.

  11. Removal of copper from ferrous scrap

    DOEpatents

    Blander, M.; Sinha, S.N.

    1990-05-15

    A process for removing copper from ferrous or other metal scrap in which the scrap is contacted with a polyvalent metal sulfide slag in the presence of an excess of copper-sulfide forming additive to convert the copper to copper sulfide which is extracted into the slag to provide a ratio of copper in the slag to copper in the metal scrap of at least about 10.

  12. Removal of copper from ferrous scrap

    DOEpatents

    Blander, Milton; Sinha, Shome N.

    1990-01-01

    A process for removing copper from ferrous or other metal scrap in which the scrap is contacted with a polyvalent metal sulfide slag in the presence of an excess of copper-sulfide forming additive to convert the copper to copper sulfide which is extracted into the slag to provide a ratio of copper in the slag to copper in the metal scrap of at least about 10.

  13. Removal of copper from ferrous scrap

    DOEpatents

    Blander, M.; Sinha, S.N.

    1987-07-30

    A process for removing copper from ferrous or other metal scrap in which the scrap is contacted with a polyvalent metal sulfide slag in the presence of an excess of copper-sulfide forming additive to convert the copper to copper sulfide which is extracted into the slag to provide a ratio of copper in the slag to copper in the metal scrap of at least about 10.

  14. Copper and zinc recycling from copper alloys` spent pickling solutions

    SciTech Connect

    Roman-Moguel, G.J.; Plascencia, G.; Perez, J.

    1995-12-31

    The precipitation of copper and zinc as cements from a copper alloys` spent pickling solution has been studied at laboratory and pilot scale, with the objective of designing an economic process to recover both metals and render a solution to be either recycled to the pickling process or treated in a standard fashion and produce a non-hazardous sludge. The sulfuric acid spent pickling solution already containing copper and zinc was used first to dissolve another solid residue originated in the copper alloys foundry to neutralize part of the acidity. The resulting enriched solution was treated separately with two reductants: sodium borohydride and iron powder varying pH and excess of reductant under constant agitation. Under the best conditions, precipitation of over 95 percent of zinc and copper was achieved together with the reduction of lead and cadmium contents respectively. A process for the combined residues treatment is proposed.

  15. Flow stress of copper

    SciTech Connect

    Pedersen, O.B.

    1987-10-01

    The reverse microflow associated with the Bauschinger effect in copper strained into stage II is characterized experimentally and analyzed in terms of the theory of obstacle-controlled flow and established composite theory. The results are discussed in the light of observations by electron microscopy, deformation calorimetry and X-ray diffraction. It is suggested that the overall flow resistance arises from an interplay of two modes of obstacle controlled glide, none of which dominate the flow stress. One mode occurs inside regions of high local dislocation density (inclusions) where individual forest dislocations oppose glide on the primary slip system. The second mode is bowing of dislocations between the inclusions.

  16. Copper mediated carbometalation reactions.

    PubMed

    Müller, D S; Marek, I

    2016-08-01

    Since the first discovery of carbocupration of alkynes in the 1970s a tremendous amount of research has been carried out in this field. The exceptionally high selectivities obtained attribute to the great synthetic value of carbocupration reactions. This tutorial review will present the most important features of carbocupration of alkynes and highlight the most relevant reviews. Then a comprehensive review of copper mediated carbometalation of cyclopropenes will follow. The latter method has received much attention over the last decade as it allows the highly selective construction of poly-substituted cyclopropanes which can be transformed into acyclic derivatives bearing one or multiple tertiary or quaternary carbon stereocenters. PMID:26808300

  17. Lead and Copper Control 101

    EPA Science Inventory

    This presentation is an overview of the most important water treatment strategies for the control of lead and copper release from drinking water corrosion. In addition to the sections specifically on lead and copper treatment, sections are included that cover sampling to find le...

  18. Diagnosis of Copper Transport Disorders

    PubMed Central

    Møller, Lisbeth B.; Hicks, Julia D.; Holmes, Courtney S.; Goldstein, David S.; Brendl, Cornelia; Huppke, Peter; Kaler, Stephen G.

    2011-01-01

    Techniques for the diagnosis of copper transport disorders are increasingly important due to recent recognition of previously unappreciated clinical phenotypes and emerging advances in the treatment of these conditions. Here, we collate the diagnostic approaches and techniques currently employed for biochemical and molecular assessment of at-risk individuals in whom abnormal copper metabolism is suspected. PMID:21735378

  19. Copper: from neurotransmission to neuroproteostasis

    PubMed Central

    Opazo, Carlos M.; Greenough, Mark A.; Bush, Ashley I.

    2014-01-01

    Copper is critical for the Central Nervous System (CNS) development and function. In particular, different studies have shown the effect of copper at brain synapses, where it inhibits Long Term Potentation (LTP) and receptor pharmacology. Paradoxically, according to recent studies copper is required for a normal LTP response. Copper is released at the synaptic cleft, where it blocks glutamate receptors, which explain its blocking effects on excitatory neurotransmission. Our results indicate that copper also enhances neurotransmission through the accumulation of PSD95 protein, which increase the levels of α-amino-3-hydroxy-5-methyl-4-isoxazolepropionic acid (AMPA) receptors located at the plasma membrane of the post-synaptic density. Thus, our findings represent a novel mechanism for the action of copper, which may have implications for the neurophysiology and neuropathology of the CNS. These data indicate that synaptic configuration is sensitive to transient changes in transition metal homeostasis. Our results suggest that copper increases GluA1 subunit levels of the AMPA receptor through the anchorage of AMPA receptors to the plasma membrane as a result of PSD-95 accumulation. Here, we will review the role of copper on neurotransmission of CNS neurons. In addition, we will discuss the potential mechanisms by which copper could modulate neuronal proteostasis (“neuroproteostasis”) in the CNS with focus in the Ubiquitin Proteasome System (UPS), which is particularly relevant to neurological disorders such as Alzheimer’s disease (AD) where copper and protein dyshomeostasis may contribute to neurodegeneration. An understanding of these mechanisms may ultimately lead to the development of novel therapeutic approaches to control metal and synaptic alterations observed in AD patients. PMID:25071552

  20. Regulation of extracellular copper-binding proteins in copper-resistant and copper-sensitive mutants of Vibrio alginolyticus.

    PubMed Central

    Harwood, V J; Gordon, A S

    1994-01-01

    Extracellular proteins of wild-type Vibrio alginolyticus were compared with those of copper-resistant and copper-sensitive mutants. One copper-resistant mutant (Cu40B3) constitutively produced an extracellular protein with the same apparent molecular mass (21 kDa) and chromatographic behavior as copper-binding protein (CuBP), a copper-induced supernatant protein which has been implicated in copper detoxification in wild-type V. alginolyticus. Copper-sensitive V. alginolyticus mutants displayed a range of alterations in supernatant protein profiles. CuBP was not detected in supernatants of one copper-sensitive mutant after cultures had been stressed with 50 microM copper. Increased resistance to copper was not induced by preincubation with subinhibitory levels of copper in the wild type or in the copper-resistant mutant Cu40B3. Copper-resistant mutants maintained the ability to grow on copper-amended agar after 10 or more subcultures on nonselective agar, demonstrating the stability of the phenotype. A derivative of Cu40B3 with wild-type sensitivity to copper which no longer constitutively expressed CuBP was isolated. The simultaneous loss of both constitutive CuBP production and copper resistance in Cu40B3 indicates that constitutive CuBP production is necessary for copper resistance in this mutant. These data support the hypothesis that the extracellular, ca. 20-kDa protein(s) of V. alginolyticus is an important factor in survival and growth of the organism at elevated copper concentrations. The range of phenotypes observed in copper-resistant and copper-sensitive V. alginolyticus indicate that altered sensitivity to copper was mediated by a variety of physiological changes. Images PMID:8031076

  1. 21 CFR 184.1260 - Copper gluconate.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 3 2013-04-01 2013-04-01 false Copper gluconate. 184.1260 Section 184.1260 Food... Specific Substances Affirmed as GRAS § 184.1260 Copper gluconate. (a) Copper gluconate (cupric gluconate... practice. Copper gluconate may be used in infant formula in accordance with section 412(g) of the...

  2. 49 CFR 192.279 - Copper pipe.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 49 Transportation 3 2012-10-01 2012-10-01 false Copper pipe. 192.279 Section 192.279 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS MATERIALS SAFETY... Copper pipe. Copper pipe may not be threaded except that copper pipe used for joining screw fittings...

  3. 49 CFR 192.279 - Copper pipe.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 3 2011-10-01 2011-10-01 false Copper pipe. 192.279 Section 192.279 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS MATERIALS SAFETY... Copper pipe. Copper pipe may not be threaded except that copper pipe used for joining screw fittings...

  4. 21 CFR 184.1260 - Copper gluconate.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 3 2012-04-01 2012-04-01 false Copper gluconate. 184.1260 Section 184.1260 Food... Specific Substances Affirmed as GRAS § 184.1260 Copper gluconate. (a) Copper gluconate (cupric gluconate... practice. Copper gluconate may be used in infant formula in accordance with section 412(g) of the...

  5. 21 CFR 184.1260 - Copper gluconate.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 3 2011-04-01 2011-04-01 false Copper gluconate. 184.1260 Section 184.1260 Food... Specific Substances Affirmed as GRAS § 184.1260 Copper gluconate. (a) Copper gluconate (cupric gluconate... practice. Copper gluconate may be used in infant formula in accordance with section 412(g) of the...

  6. 21 CFR 184.1260 - Copper gluconate.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 3 2010-04-01 2009-04-01 true Copper gluconate. 184.1260 Section 184.1260 Food... Specific Substances Affirmed as GRAS § 184.1260 Copper gluconate. (a) Copper gluconate (cupric gluconate... practice. Copper gluconate may be used in infant formula in accordance with section 412(g) of the...

  7. 49 CFR 192.279 - Copper pipe.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 49 Transportation 3 2014-10-01 2014-10-01 false Copper pipe. 192.279 Section 192.279 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS MATERIALS SAFETY... Copper pipe. Copper pipe may not be threaded except that copper pipe used for joining screw fittings...

  8. 49 CFR 192.279 - Copper pipe.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 49 Transportation 3 2013-10-01 2013-10-01 false Copper pipe. 192.279 Section 192.279 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS MATERIALS SAFETY... Copper pipe. Copper pipe may not be threaded except that copper pipe used for joining screw fittings...

  9. 21 CFR 184.1260 - Copper gluconate.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 3 2014-04-01 2014-04-01 false Copper gluconate. 184.1260 Section 184.1260 Food... GRAS § 184.1260 Copper gluconate. (a) Copper gluconate (cupric gluconate (CH2OH(CHOH)4COO)2Cu, CAS Reg... ingredient is used in food at levels not to exceed current good manufacturing practice. Copper gluconate...

  10. 49 CFR 192.279 - Copper pipe.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 3 2010-10-01 2010-10-01 false Copper pipe. 192.279 Section 192.279 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS MATERIALS SAFETY... Copper pipe. Copper pipe may not be threaded except that copper pipe used for joining screw fittings...

  11. 21 CFR 73.1647 - Copper powder.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Copper powder. 73.1647 Section 73.1647 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Drugs § 73.1647 Copper powder. (a) Identity. (1) The color additive copper powder is a very fine free-flowing metallic powder prepared from virgin electrolytic copper....

  12. 21 CFR 73.1647 - Copper powder.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 1 2011-04-01 2011-04-01 false Copper powder. 73.1647 Section 73.1647 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Drugs § 73.1647 Copper powder. (a) Identity. (1) The color additive copper powder is a very fine free-flowing metallic powder prepared from virgin electrolytic copper....

  13. NID Copper Sample Analysis

    SciTech Connect

    Kouzes, Richard T.; Zhu, Zihua

    2011-09-12

    The current focal point of the nuclear physics program at PNNL is the MAJORANA DEMONSTRATOR, and the follow-on Tonne-Scale experiment, a large array of ultra-low background high-purity germanium detectors, enriched in 76Ge, designed to search for zero-neutrino double-beta decay (0νββ). This experiment requires the use of germanium isotopically enriched in 76Ge. The MAJORANA DEMONSTRATOR is a DOE and NSF funded project with a major science impact. The DEMONSTRATOR will utilize 76Ge from Russia, but for the Tonne-Scale experiment it is hoped that an alternate technology, possibly one under development at Nonlinear Ion Dynamics (NID), will be a viable, US-based, lower-cost source of separated material. Samples of separated material from NID require analysis to determine the isotopic distribution and impurities. DOE is funding NID through an SBIR grant for development of their separation technology for application to the Tonne-Scale experiment. The Environmental Molecular Sciences facility (EMSL), a DOE user facility at PNNL, has the required mass spectroscopy instruments for making isotopic measurements that are essential to the quality assurance for the MAJORANA DEMONSTRATOR and for the development of the future separation technology required for the Tonne-Scale experiment. A sample of isotopically separated copper was provided by NID to PNNL in January 2011 for isotopic analysis as a test of the NID technology. The results of that analysis are reported here. A second sample of isotopically separated copper was provided by NID to PNNL in August 2011 for isotopic analysis as a test of the NID technology. The results of that analysis are also reported here.

  14. Interpulse kinetics in copper and copper halide lasers

    NASA Technical Reports Server (NTRS)

    Harstad, K. G.

    1983-01-01

    The various rate processes that govern the interpulse relaxation in metal vapor and metal halide vapor lasers are considered. Computer calculations indicate that the rapid metastable levels relaxation observed in copper and copper halide laser experiments requires the existence of a relatively small resonance in the cross section for metastable excitation or deexcitation near threshold. The accurate calculation of interpulse relaxation requires knowledge of rate constants presently not well known; this is especially so for metal halide lasers.

  15. Lab Tracker and Copper Calculator

    MedlinePlus

    ... Bound (Free) Copper 5 - 15 µg/dl Membership Fees Please Choose A Membership Plan Below Basic $40 ... the household to be WDA members No registration fees for Annual Conference Banquet, up to four registrants ...

  16. Majorana Electroformed Copper Mechanical Analysis

    SciTech Connect

    Overman, Nicole R.; Overman, Cory T.; Kafentzis, Tyler A.; Edwards, Danny J.; Hoppe, Eric W.

    2012-04-30

    The MAJORANA DEMONSTRATOR is a large array of ultra-low background high-purity germanium detectors, enriched in 76Ge, designed to search for zero-neutrino double-beta decay. The DEMONSTRATOR will utilize ultra high purity electroformed copper for a variety of detector components and shielding. A preliminary mechanical evaluation was performed on the Majorana prototype electroformed copper material. Several samples were removed from a variety of positions on the mandrel. Tensile testing, optical metallography, scanning electron microscopy, and hardness testing were conducted to evaluate mechanical response. Analyses carried out on the Majorana prototype copper to this point show consistent mechanical response from a variety of test locations. Evaluation shows the copper meets or exceeds the design specifications.

  17. Copper complexes as anticancer agents.

    PubMed

    Marzano, Cristina; Pellei, Maura; Tisato, Francesco; Santini, Carlo

    2009-02-01

    Metal-based antitumor drugs play a relevant role in antiblastic chemotherapy. Cisplatin is regarded as one of the most effective drugs, even if severe toxicities and drug resistance phenomena limit its clinical use. Therefore, in recent years there has been a rapid expansion in research and development of novel metal-based anticancer drugs to improve clinical effectiveness, to reduce general toxicity and to broaden the spectrum of activity. The variety of metal ion functions in biology has stimulated the development of new metallodrugs other than Pt drugs with the aim to obtain compounds acting via alternative mechanisms of action. Among non-Pt compounds, copper complexes are potentially attractive as anticancer agents. Actually, since many years a lot of researches have actively investigated copper compounds based on the assumption proposal that endogenous metals may be less toxic. It has been established that the properties of copper-coordinated compounds are largely determined by the nature of ligands and donor atoms bound to the metal ion. In this review, the most remarkable achievements in the design and development of copper(I, II) complexes as antitumor agents are discussed. Special emphasis has been focused on the identification of structure-activity relationships for the different classes of copper(I,II) complexes. This work was motivated by the observation that no comprehensive surveys of copper complexes as anticancer agents were available in the literature. Moreover, up to now, despite the enormous efforts in synthesizing different classes of copper complexes, very few data concerning the molecular basis of the mechanisms underlying their antitumor activity are available. This overview, collecting the most significant strategies adopted in the last ten years to design promising anticancer copper(I,II) compounds, would be a help to the researchers working in this field. PMID:19199864

  18. Formation of copper-indium-selenide and/or copper-indium-gallium-selenide films from indium selenide and copper selenide precursors

    DOEpatents

    Curtis, Calvin J.; Miedaner, Alexander; Van Hest, Maikel; Ginley, David S.; Nekuda, Jennifer A.

    2011-11-15

    Liquid-based indium selenide and copper selenide precursors, including copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent, are used to form crystalline copper-indium-selenide, and/or copper indium gallium selenide films (66) on substrates (52).

  19. Analysis on dynamic tensile extrusion behavior of UFG OFHC Cu

    NASA Astrophysics Data System (ADS)

    Park, Kyung-Tae; Park, Leeju; Kim, Hak Jun; Kim, Seok Bong; Lee, Chong Soo

    2014-08-01

    Dynamic tensile extrusion (DTE) tests with the strain rate order of ~105 s-1 were conducted on coarse grained (CG) Cu and ultrafine grained (UFG) Cu. ECAP of 16 passes with route Bc was employed to fabricate UFG Cu. DTE tests were carried out by launching the sphere samples to the conical extrusion die at a speed of ~475 m/sec in a vacuumed gas gun system. UFG Cu was fragmented into 3 pieces and showed a DTE elongation of ~340%. CG Cu exhibited a larger DTE elongation of ~490% with fragmentation of 4 pieces. During DTE tests, dynamic recrystallization occurred in UFG Cu, but not in CG Cu. In order to examine the DTE behavior of CG Cu and UFG Cu under very high strain rates, a numerical analysis was undertaken by using a commercial finite element code (LS-DYNA 2D axis-symmetric model) with the Johnson - Cook model. The numerical analysis correctly predicted fragmentation and DTE elongation of CG Cu. But, the experimental DTE elongation of UFG Cu was much smaller than that predicted by the numerical analysis. This difference is discussed in terms of microstructural evolution of UFG Cu during DTE tests.

  20. Porins increase copper susceptibility of Mycobacterium tuberculosis.

    PubMed

    Speer, Alexander; Rowland, Jennifer L; Haeili, Mehri; Niederweis, Michael; Wolschendorf, Frank

    2013-11-01

    Copper resistance mechanisms are crucial for many pathogenic bacteria, including Mycobacterium tuberculosis, during infection because the innate immune system utilizes copper ions to kill bacterial intruders. Despite several studies detailing responses of mycobacteria to copper, the pathways by which copper ions cross the mycobacterial cell envelope are unknown. Deletion of porin genes in Mycobacterium smegmatis leads to a severe growth defect on trace copper medium but simultaneously increases tolerance for copper at elevated concentrations, indicating that porins mediate copper uptake across the outer membrane. Heterologous expression of the mycobacterial porin gene mspA reduced growth of M. tuberculosis in the presence of 2.5 μM copper by 40% and completely suppressed growth at 15 μM copper, while wild-type M. tuberculosis reached its normal cell density at that copper concentration. Moreover, the polyamine spermine, a known inhibitor of porin activity in Gram-negative bacteria, enhanced tolerance of M. tuberculosis for copper, suggesting that copper ions utilize endogenous outer membrane channel proteins of M. tuberculosis to gain access to interior cellular compartments. In summary, these findings highlight the outer membrane as the first barrier against copper ions and the role of porins in mediating copper uptake in M. smegmatis and M. tuberculosis. PMID:24013632

  1. NID Copper Sample Analysis

    SciTech Connect

    Kouzes, Richard T.; Zhu, Zihua

    2011-02-01

    The current focal point of the nuclear physics program at PNNL is the MAJORANA DEMONSTRATOR, and the follow-on Tonne-Scale experiment, a large array of ultra-low background high-purity germanium detectors, enriched in 76Ge, designed to search for zero-neutrino double-beta decay (0νββ). This experiment requires the use of germanium isotopically enriched in 76Ge. The DEMONSTRATOR will utilize 76Ge from Russia, but for the Tonne-Scale experiment it is hoped that an alternate technology under development at Nonlinear Ion Dynamics (NID) will be a viable, US-based, lower-cost source of separated material. Samples of separated material from NID require analysis to determine the isotopic distribution and impurities. The MAJORANA DEMONSTRATOR is a DOE and NSF funded project with a major science impact. DOE is funding NID through an SBIR grant for development of their separation technology for application to the Tonne-Scale experiment. The Environmental Molecular Sciences facility (EMSL), a DOE user facility at PNNL, has the required mass spectroscopy instruments for making these isotopic measurements that are essential to the quality assurance for the MAJORANA DEMONSTRATOR and for the development of the future separation technology required for the Tonne-Scale experiment. A sample of isotopically separated copper was provided by NID to PNNL for isotopic analysis as a test of the NID technology. The results of that analysis are reported here.

  2. BTA copper complexes.

    PubMed

    Friedrich, Manfred; Gálvez-Ruiz, Juan Carlos; Klapötke, Thomas M; Mayer, Peter; Weber, Birgit; Weigand, Jan J

    2005-10-31

    Cupric oxide is one of the most important additives used (a) to catalyze decomposition reactions in gas generators to obtain cooler reaction gases, (b) as burning enhancer for ammonium perchlorate-based composite propellants, and (c) as coloring agent in pyrotechnics. In this context, the reaction of Cu(2+) ions in aqueous ammonia solution with bis(tetrazolyl)amine (H(2)bta) was investigated. Depending on the reaction conditions three complexes were obtained: Cu(bta)(NH(3))(2) (1), Cu(bta)(NH(3))(2).H(2)O (2), and (NH(4))(2)Cu(bta)(2).2.5H(2)O (3). The crystal structures of 1 and 2 are discussed with respect to the coordination mode of the dianion of N,N-bis(1(2)H-tetrazol-5-yl)-amine (bta), which mediates in the case of 1 and 2 weak superexchange interactions between the adjacent magnetic transition-metal Cu(II) cations. These antiferromagnetic interactions result from 1D copper chains over an hidden azide end-to-end bridge. Interestingly, the structural arrangement of 1 completely changes in the presence of crystal-bound water. Moreover, some physicochemical properties (e.g., heat of formation, friction, and impact sensitivity, DSC) of these complexes with respect to high-energetic materials are discussed. PMID:16241154

  3. Hohenheim consensus workshop: copper.

    PubMed

    Schümann, K; Classen, H G; Dieter, H H; König, J; Multhaup, G; Rükgauer, M; Summer, K H; Bernhardt, J; Biesalski, H K

    2002-06-01

    Copper (Cu) is an essential trace element with many physiological functions. Homeostatic mechanisms exist to allow Cu to act as a cofactor in enzymatic processes and to prevent accumulation of Cu to toxic levels. The aim of this commentary is to better understand the role of dietary Cu supply in deficiency and under physiological and pathological conditions. The essentiality of Cu can be attributed to its role as a cofactor in a number of enzymes that are involved in the defence against oxidative stress. Cu, however, has a second face, that of a toxic compound as it is observed with accumulating evidence in hepatic, neurodegenerative and cardiovascular diseases. The destructive potential of Cu can be attributed to inherent physico-chemical properties. The main property is its ability to take part in Fenton-like reactions in which the highly reactive and extremely deleterious hydroxyl radical is formed. Diseases caused by dietary Cu overload could be based on a genetic predisposition. Thus, an assessment of risk-groups, such as infants with impaired mechanisms of Cu homeostasis regarding detoxification, is of special interest, as their Cu intake with resuspended formula milk may be very high. This implies the need for reliable diagnostic markers to determine the Cu status. These topics were introduced at the workshop by the participants followed by extensive group discussion. The consensus statements were agreed on by all members. One of the conclusions is that a re-assessment of published data is necessary and future research is required. PMID:12032645

  4. Process Of Bonding Copper And Tungsten

    DOEpatents

    Slattery, Kevin T.; Driemeyer, Daniel E.; Davis, John W.

    2000-07-18

    Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

  5. Biliary copper excretion by hepatocyte lysosomes in the rat. Major excretory pathway in experimental copper overload

    SciTech Connect

    Gross, J.B. Jr.; Myers, B.M.; Kost, L.J.; Kuntz, S.M.; LaRusso, N.F.

    1989-01-01

    We investigated the hypothesis that lysosomes are the main source of biliary copper in conditions of hepatic copper overload. We used a rat model of oral copper loading and studied the relationship between the biliary output of copper and lysosomal hydrolases. Male Sprague-Dawley rats were given tap water with or without 0.125% copper acetate for up to 36 wk. Copper loading produced a 23-fold increase in the hepatic copper concentration and a 30-65% increase in hepatic lysosomal enzyme activity. Acid phosphatase histochemistry showed that copper-loaded livers contained an increased number of hepatocyte lysosomes; increased copper concentration of these organelles was confirmed directly by both x ray microanalysis and tissue fractionation. The copper-loaded rats showed a 16-fold increase in biliary copper output and a 50-300% increase in biliary lysosomal enzyme output. In the basal state, excretory profiles over time were similar for biliary outputs of lysosomal enzymes and copper in the copper-loaded animals but not in controls. After pharmacologic stimulation of lysosomal exocytosis, biliary outputs of copper and lysosomal hydrolases in the copper-loaded animals remained coupled: injection of colchicine or vinblastine produced an acute rise in the biliary output of both lysosomal enzymes and copper to 150-250% of baseline rates. After these same drugs, control animals showed only the expected increase in lysosomal enzyme output without a corresponding increase in copper output. We conclude that the hepatocyte responds to an increased copper load by sequestering excess copper in an increased number of lysosomes that then empty their contents directly into bile. The results provide direct evidence that exocytosis of lysosomal contents into biliary canaliculi is the major mechanism for biliary copper excretion in hepatic copper overload.

  6. Leaching of Copper Ore by Thiobacillus Ferrooxidans.

    ERIC Educational Resources Information Center

    Lennox, John; Biaha, Thomas

    1991-01-01

    A quantitative laboratory exercise based upon the procedures copper manufacturers employ to increase copper production is described. The role of chemoautotrophic microorganisms in biogeologic process is emphasized. Safety considerations when working with bacteria are included. (KR)

  7. Copper tolerance and virulence in bacteria

    PubMed Central

    Ladomersky, Erik; Petris, Michael J.

    2015-01-01

    Copper (Cu) is an essential trace element for all aerobic organisms. It functions as a cofactor in enzymes that catalyze a wide variety of redox reactions due to its ability to cycle between two oxidation states, Cu(I) and Cu(II). This same redox property of copper has the potential to cause toxicity if copper homeostasis is not maintained. Studies suggest that the toxic properties of copper are harnessed by the innate immune system of the host to kill bacteria. To counter such defenses, bacteria rely on copper tolerance genes for virulence within the host. These discoveries suggest bacterial copper intoxication is a component of host nutritional immunity, thus expanding our knowledge of the roles of copper in biology. This review summarizes our current understanding of copper tolerance in bacteria, and the extent to which these pathways contribute to bacterial virulence within the host. PMID:25652326

  8. Placental copper transport in the brindled mouse

    SciTech Connect

    Garnica, A.; Bates, J.

    1986-03-01

    Pregnant brindled (brin) mice were injected at 16 or 19 days gestation with 2 doses of CuCl/sub 2/ 6 mcg/g/dose, separated by 12 h, and sacrificed 6 h after the second. The copper conc. in placenta (P) and kidneys (K) of uninjected (UI) brin mice were higher than in UI controls, while conc. in liver (L) and fetal carcass (F) were lower. After injection (I), placental copper conc. increased while the carcass conc. remained unchanged. Brin mouse is a model for the human inborn error of copper metabolism, Menkes syndrome, which is characterized by signs of copper deficiency. These data indicate that metabolism of copper in brin fetus is abnormal, but depressed fetal copper levels cannot be corrected by acute copper dosing because of the sequestration of copper in placenta.

  9. Plasma dynamic synthesis of ultradispersed copper oxides

    NASA Astrophysics Data System (ADS)

    Shanenkova, Yu; Sivkov, A.; Saygash, A.; Shanenkov, I.

    2015-10-01

    Copper oxide is necessary material for production of superconductors. The issue of obtaining high purity and nanosides CuO is actual. This article shows the results on the obtaining of nanodispersed copper oxide by plasma dynamic method in system based on coaxial magneto plasma accelerator with copper electrodes. Such analyses of ultradispersed synthesized products as X-Ray diffractometry, IR-spectroscopy and thermal analysis were carried out. According to XRD such phases as copper Cu, copper oxide (I) Cu2O, copper oxide (II) CuO, and copper hydroxide hydrate Cu(OH)2·H2O were identified in the product. It was found that with the gradual heating of the initial product up to 800 °C the phase content changed dramatically in terms of enhancing copper oxide phase (up to 97%).

  10. Thermotransport in liquid aluminum-copper alloys

    NASA Technical Reports Server (NTRS)

    Bhat, B. N.

    1973-01-01

    A thermotransport study was made on a series of liquid aluminum-copper alloys which contained from trace amounts to 33 weight percent copper. The samples in the form of narrow capillaries were held in known temperature gradient of thermotransport apparatus until the stationary state was reached. The samples were analyzed for the concentration of copper along the length. Copper was observed to migrate to the colder regions in all the samples. The heat of transport, Q*, was determined for each composition from a plot of concentration of copper versus reciprocal absolute temperature. The value of Q* is the highest at trace amounts of copper (4850 cal/gm-atom), but decreases with increasing concentration of copper and levels off to 2550 cal/gm-atom at about 25 weight percent copper. The results are explained on the basis of electron-solute interaction and a gas model of diffusion.

  11. Molecular Mediators Governing Iron-Copper Interactions

    PubMed Central

    Gulec, Sukru; Collins, James F.

    2015-01-01

    Given their similar physiochemical properties, it is a logical postulate that iron and copper metabolism are intertwined. Indeed, iron-copper interactions were first documented over a century ago, but the homeostatic effects of one on the other has not been elucidated at a molecular level to date. Recent experimental work has, however, begun to provide mechanistic insight into how copper influences iron metabolism. During iron deficiency, elevated copper levels are observed in the intestinal mucosa, liver, and blood. Copper accumulation and/or redistribution within enterocytes may influence iron transport, and high hepatic copper may enhance biosynthesis of a circulating ferroxidase, which potentiates iron release from stores. Moreover, emerging evidence has documented direct effects of copper on the expression and activity of the iron-regulatory hormone hepcidin. This review summarizes current experimental work in this field, with a focus on molecular aspects of iron-copper interplay and how these interactions relate to various disease states. PMID:24995690

  12. Laser sintering of copper nanoparticles

    NASA Astrophysics Data System (ADS)

    Zenou, Michael; Ermak, Oleg; Saar, Amir; Kotler, Zvi

    2014-01-01

    Copper nanoparticle (NP) inks serve as an attractive potential replacement to silver NP inks in functional printing applications. However their tendency to rapidly oxidize has so far limited their wider use. In this work we have studied the conditions for laser sintering of Cu-NP inks in ambient conditions while avoiding oxidation. We have determined the regime for stable, low-resistivity copper (< ×3 bulk resistivity value) generation in terms of laser irradiance and exposure duration and have indicated the limits on fast processing. The role of pre-drying conditions on sintering outcome has also been studied. A method, based on spectral reflectivity measurements, was used for non-contact monitoring of the sintering process evolution. It also indicates preferred spectral regions for sintering. Finally, we illustrated how selective laser sintering can generate high-quality, fine line (<5 µm wide) and dense copper circuits.

  13. 21 CFR 73.1125 - Potassium sodium copper chloropyhllin (chlorophyllin-copper complex).

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Potassium sodium copper chloropyhllin....1125 Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). (a) Identity. (1) The color additive potassium sodium copper chlorophyllin is a green to black powder obtained from chlorophyll...

  14. 21 CFR 73.1125 - Potassium sodium copper chloropyhllin (chlorophyllin-copper complex).

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 1 2012-04-01 2012-04-01 false Potassium sodium copper chloropyhllin....1125 Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). (a) Identity. (1) The color additive potassium sodium copper chlorophyllin is a green to black powder obtained from chlorophyll...

  15. 21 CFR 73.1125 - Potassium sodium copper chloropyhllin (chlorophyllin-copper complex).

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 1 2014-04-01 2014-04-01 false Potassium sodium copper chloropyhllin....1125 Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). (a) Identity. (1) The color additive potassium sodium copper chlorophyllin is a green to black powder obtained from chlorophyll...

  16. 21 CFR 73.2125 - Potassium sodium copper chlorophyllin (chlorophyllin-copper complex).

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 1 2014-04-01 2014-04-01 false Potassium sodium copper chlorophyllin... § 73.2125 Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). (a) Identity and specifications. The color additive potassium sodium copper chlorophyllin shall conform in identity...

  17. 21 CFR 73.2125 - Potassium sodium copper chlorophyllin (chlorophyllin-copper complex).

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Potassium sodium copper chlorophyllin... § 73.2125 Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). (a) Identity and specifications. The color additive potassium sodium copper chlorophyllin shall conform in identity...

  18. 21 CFR 73.2125 - Potassium sodium copper chlorophyllin (chlorophyllin-copper complex).

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 1 2012-04-01 2012-04-01 false Potassium sodium copper chlorophyllin... § 73.2125 Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). (a) Identity and specifications. The color additive potassium sodium copper chlorophyllin shall conform in identity...

  19. 21 CFR 73.1125 - Potassium sodium copper chloropyhllin (chlorophyllin-copper complex).

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 1 2011-04-01 2011-04-01 false Potassium sodium copper chloropyhllin....1125 Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). (a) Identity. (1) The color additive potassium sodium copper chlorophyllin is a green to black powder obtained from chlorophyll...

  20. 21 CFR 73.2125 - Potassium sodium copper chlorophyllin (chlorophyllin-copper complex).

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 1 2011-04-01 2011-04-01 false Potassium sodium copper chlorophyllin... § 73.2125 Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). (a) Identity and specifications. The color additive potassium sodium copper chlorophyllin shall conform in identity...

  1. 21 CFR 73.1125 - Potassium sodium copper chloropyhllin (chlorophyllin-copper complex).

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 1 2013-04-01 2013-04-01 false Potassium sodium copper chloropyhllin....1125 Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). (a) Identity. (1) The color additive potassium sodium copper chlorophyllin is a green to black powder obtained from chlorophyll...

  2. 21 CFR 73.2125 - Potassium sodium copper chlorophyllin (chlorophyllin-copper complex).

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 1 2013-04-01 2013-04-01 false Potassium sodium copper chlorophyllin... § 73.2125 Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). (a) Identity and specifications. The color additive potassium sodium copper chlorophyllin shall conform in identity...

  3. Textured carbon surfaces on copper by sputtering

    NASA Technical Reports Server (NTRS)

    Curren, A. N. (Inventor); Jensen, K. A. (Inventor); Roman, R. F. (Inventor)

    1986-01-01

    A very thin layer of highly textured carbon is applied to a copper surface by a triode sputtering process. A carbon target and a copper substrate are simultaneously exposed to an argon plasma in a vacuum chamber. The resulting carbon surface is characterized by a dense, random array of needle like spires or peaks which extend perpendicularly from the copper surface. The coated copper is especially useful for electrode plates in multistage depressed collectors.

  4. 21 CFR 184.1261 - Copper sulfate.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 3 2010-04-01 2009-04-01 true Copper sulfate. 184.1261 Section 184.1261 Food and... Substances Affirmed as GRAS § 184.1261 Copper sulfate. (a) Copper sulfate (cupric sulfate, CuSO4·5H2O, CAS... the reaction of sulfuric acid with cupric oxide or with copper metal. (b) The ingredient must be of...

  5. 21 CFR 184.1261 - Copper sulfate.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 3 2011-04-01 2011-04-01 false Copper sulfate. 184.1261 Section 184.1261 Food and... Substances Affirmed as GRAS § 184.1261 Copper sulfate. (a) Copper sulfate (cupric sulfate, CuSO4·5H2O, CAS... the reaction of sulfuric acid with cupric oxide or with copper metal. (b) The ingredient must be of...

  6. 21 CFR 184.1261 - Copper sulfate.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 3 2013-04-01 2013-04-01 false Copper sulfate. 184.1261 Section 184.1261 Food and... Substances Affirmed as GRAS § 184.1261 Copper sulfate. (a) Copper sulfate (cupric sulfate, CuSO4·5 H2O, CAS... the reaction of sulfuric acid with cupric oxide or with copper metal. (b) The ingredient must be of...

  7. 21 CFR 184.1261 - Copper sulfate.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 3 2012-04-01 2012-04-01 false Copper sulfate. 184.1261 Section 184.1261 Food and... Substances Affirmed as GRAS § 184.1261 Copper sulfate. (a) Copper sulfate (cupric sulfate, CuSO4·5 H2O, CAS... the reaction of sulfuric acid with cupric oxide or with copper metal. (b) The ingredient must be of...

  8. 21 CFR 184.1261 - Copper sulfate.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 3 2014-04-01 2014-04-01 false Copper sulfate. 184.1261 Section 184.1261 Food and....1261 Copper sulfate. (a) Copper sulfate (cupric sulfate, CuSO4·5 H2O, CAS Reg. No. 7758-99-8) usually... sulfuric acid with cupric oxide or with copper metal. (b) The ingredient must be of a purity suitable...

  9. Novel methods of copper vapor laser excitation

    SciTech Connect

    McColl, W.B.; Ching, H.; Bosch, R.; Brake, M.; Gilgenbach, R.

    1990-12-31

    Microwave and intense electron beam excitation of copper vapor are being investigated to be used in copper vapor lasers for isotope separation. Both methods use copper chloride vapor by heating copper chloride. Helium was used as the buffer gas at 2 to 100 torr. In the microwave system, intense copperlines at 510 nm and 578 nm were observed. Initial electron beam results indicate that light emission follows the beam current.

  10. Tunable synthesis of copper nanotubes

    NASA Astrophysics Data System (ADS)

    Kaniukov, E.; Kozlovsky, A.; Shlimas, D.; Yakimchuk, D.; Zdorovets, M.; Kadyrzhanov, K.

    2016-02-01

    Simple method of tunable synthesis of copper nanotubes based on template synthesis was developed. A comprehensive study of the structural, morphological and electrical characteristics of the obtained nanostructures was carried out. Characterization of structural features was made by methods of scanning electron microscopy, energy dispersive spectroscopy and X-ray diffractometry analysis. Evaluation of wall thickness is made by methods of gas permeability. Electrical conductivity of nanotubes was define in the study of their current-voltage characteristics. The possibility to control of copper nanotubes physical properties by variation of the deposition parameters was shown.

  11. Contribution of Copper Ion Resistance to Survival of Escherichia coli on Metallic Copper Surfaces▿

    PubMed Central

    Santo, Christophe Espírito; Taudte, Nadine; Nies, Dietrich H.; Grass, Gregor

    2008-01-01

    Bacterial contamination of touch surfaces poses a serious threat for public health. The use of bactericidal surface materials, such as copper and its alloys, might constitute a way to aid the use of antibiotics and disinfectants, thus minimizing the risk of emergence and spread of multiresistant germs. The survival of Escherichia coli on metallic copper surfaces has been studied previously; however, the mechanisms underlying bacterial inactivation on copper surfaces have not been elucidated. Data presented in this study suggest that bacteria are killed rapidly on dry copper surfaces. Several factors, such as copper ion toxicity, copper chelators, cold, osmotic stress, and reactive oxygen species, but not anaerobiosis, influenced killing rates. Strains deleted in copper detoxification systems were slightly more sensitive than was the wild type. Preadaptation to copper enhanced survival rates upon copper surface exposure. This study constitutes a first step toward understanding the reasons for metallic copper surface-mediated killing of bacteria. PMID:18156321

  12. Copper vs. Copper at the Relativistic Heavy Ion Collider (2005)

    SciTech Connect

    Brookhaven Lab - Fulvia Pilat

    2009-06-09

    To investigate a new form of matter not seen since the Big Bang, scientists are using a new experimental probe: collisions between two beams of copper ions. The use of intermediate size nuclei is expected to result in intermediate energy density - not as

  13. Copper vs. Copper at the Relativistic Heavy Ion Collider (2005)

    ScienceCinema

    Brookhaven Lab - Fulvia Pilat

    2010-01-08

    To investigate a new form of matter not seen since the Big Bang, scientists are using a new experimental probe: collisions between two beams of copper ions. The use of intermediate size nuclei is expected to result in intermediate energy density - not as

  14. Joining of alumina via copper/niobium/copper interlayers

    SciTech Connect

    Marks, Robert A.; Chapman, Daniel R.; Danielson, David T.; Glaeser, Andreas M.

    2000-03-15

    Alumina has been joined at 1150 degrees C and 1400 degrees C using multilayer copper/niobium/copper interlayers. Four-point bend strengths are sensitive to processing temperature, bonding pressure, and furnace environment (ambient oxygen partial pressure). Under optimum conditions, joints with reproducibly high room temperature strengths (approximately equal 240 plus/minus 20 MPa) can be produced; most failures occur within the ceramic. Joints made with sapphire show that during bonding an initially continuous copper film undergoes a morphological instability, resulting in the formation of isolated copper-rich droplets/particles at the sapphire/interlayer interface, and extensive regions of direct bonding between sapphire and niobium. For optimized alumina bonds, bend tests at 800 degrees C-1100 degrees C indicate significant strength is retained; even at the highest test temperature, ceramic failure is observed. Post-bonding anneals at 1000 degrees C in vacuum or in gettered argon were used to assess joint stability and to probe the effect of ambient oxygen partial pressure on joint characteristics. Annealing in vacuum for up to 200 h causes no significant decrease in room temperature bend strength or change in fracture path. With increasing anneal time in a lower oxygen partial pressure environment, the fracture strength decreases only slightly, but the fracture path shifts from the ceramic to the interface.

  15. Copper Sequestration Using Local Waste Products

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Dairies utilize copper sulfate foot baths to control hoof infections. Typical solutions are 5 or 10% copper sulfate (pH ~6), equal to 12,500 or 25,000 parts per million copper, respectively. When spent, hoof bath solutions are usually disposed of in waste lagoons and subsequently utilized for irri...

  16. 21 CFR 524.463 - Copper naphthenate.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 6 2010-04-01 2010-04-01 false Copper naphthenate. 524.463 Section 524.463 Food... DRUGS, FEEDS, AND RELATED PRODUCTS OPHTHALMIC AND TOPICAL DOSAGE FORM NEW ANIMAL DRUGS § 524.463 Copper naphthenate. (a) Amount. The drug is a 37.5 percent solution of copper naphthenate. (b) Sponsors. See...

  17. 21 CFR 524.463 - Copper naphthenate.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 6 2014-04-01 2014-04-01 false Copper naphthenate. 524.463 Section 524.463 Food... DRUGS, FEEDS, AND RELATED PRODUCTS OPHTHALMIC AND TOPICAL DOSAGE FORM NEW ANIMAL DRUGS § 524.463 Copper naphthenate. (a) Amount. The drug is a 37.5 percent solution of copper naphthenate. (b) Sponsors. See...

  18. 21 CFR 524.463 - Copper naphthenate.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 6 2013-04-01 2013-04-01 false Copper naphthenate. 524.463 Section 524.463 Food... DRUGS, FEEDS, AND RELATED PRODUCTS OPHTHALMIC AND TOPICAL DOSAGE FORM NEW ANIMAL DRUGS § 524.463 Copper naphthenate. (a) Amount. The drug is a 37.5 percent solution of copper naphthenate. (b) Sponsors. See...

  19. 21 CFR 524.463 - Copper naphthenate.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 6 2012-04-01 2012-04-01 false Copper naphthenate. 524.463 Section 524.463 Food... DRUGS, FEEDS, AND RELATED PRODUCTS OPHTHALMIC AND TOPICAL DOSAGE FORM NEW ANIMAL DRUGS § 524.463 Copper naphthenate. (a) Amount. The drug is a 37.5 percent solution of copper naphthenate. (b) Sponsors. See...

  20. 21 CFR 524.463 - Copper naphthenate.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 6 2011-04-01 2011-04-01 false Copper naphthenate. 524.463 Section 524.463 Food... DRUGS, FEEDS, AND RELATED PRODUCTS OPHTHALMIC AND TOPICAL DOSAGE FORM NEW ANIMAL DRUGS § 524.463 Copper naphthenate. (a) Amount. The drug is a 37.5 percent solution of copper naphthenate. (b) Sponsors. See...

  1. Copper coating specification for the RHIC arcs

    SciTech Connect

    Blaskiewicz, M.

    2010-12-01

    Copper coating specifications for the RHIC arcs are given. Various upgrade scenarios are considered and calculations of resistive wall losses in the arcs are used to constrain the necessary quality and surface thickness of a copper coating. We find that 10 {mu}m of high purity copper will suffice.

  2. 21 CFR 73.1647 - Copper powder.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 1 2014-04-01 2014-04-01 false Copper powder. 73.1647 Section 73.1647 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES GENERAL LISTING OF COLOR ADDITIVES EXEMPT FROM CERTIFICATION Drugs § 73.1647 Copper powder. (a) Identity. (1) The color additive copper powder is a very fine...

  3. THE EVOLUTION OF SYNTHETICALLY PRECIPITATED COPPER SOLIDS

    EPA Science Inventory

    The objective of this study was to explore the effect of water quality, particularly chloride and sulfate, on copper mineral formation. Copper-sulfate and chloride compounds are often found on the surface of copper pipes in drinking water distribution systems. When attempting to ...

  4. Copper accumulation in the crayfish (Orconectes rusticus)

    SciTech Connect

    Evans, M.L.

    1980-06-01

    The purpose of this study was to determine whether or not the crayfish, O. rusticus could fulfill Nehring's (1976) criteria for a good biological monitor of heavy metal pollution. Since there is some evidence that the cupric ion is the most toxic form of aqueous copper, crayfish-accumulated copper was compared to both total and cupric copper in the culture water.

  5. Copper sequestration using local waste products

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Dairies utilize copper sulfate foot baths to control hoof infections. Typical solutions are 5 or 10% copper sulfate (pH ~6), equal to 12,500 or 25,000 parts per million copper, respectively. When spent, hoof bath solutions are usually disposed of in waste lagoons and subsequently utilized for irri...

  6. 21 CFR 73.2647 - Copper powder.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Copper powder. 73.2647 Section 73.2647 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Cosmetics § 73.2647 Copper powder. (a) Identity and specifications. The color additive copper powder shall conform in identity and specifications to the requirements of §...

  7. 21 CFR 73.2647 - Copper powder.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 1 2011-04-01 2011-04-01 false Copper powder. 73.2647 Section 73.2647 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Cosmetics § 73.2647 Copper powder. (a) Identity and specifications. The color additive copper powder shall conform in identity and specifications to the requirements of §...

  8. Molybdenum-copper and tungsten-copper alloys and method of making

    DOEpatents

    Schmidt, Frederick A.; Verhoeven, John D.; Gibson, Edwin D.

    1989-05-23

    Molybdenum-copper and tungsten-copper alloys are prepared by a consumable electrode method in which the electrode consists of a copper matrix with embedded strips of refractory molybdenum or tungsten. The electrode is progressively melted at its lower end with a superatmospheric inert gas pressure maintained around the liquifying electrode. The inert gas pressure is sufficiently above the vapor pressure of copper at the liquidus temperature of the alloy being formed to suppress boiling of liquid copper.

  9. Molybdenum-copper and tungsten-copper alloys and method of making

    DOEpatents

    Schmidt, F.A.; Verhoeven, J.D.; Gibson, E.D.

    1989-05-23

    Molybdenum-copper and tungsten-copper alloys are prepared by a consumable electrode method in which the electrode consists of a copper matrix with embedded strips of refractory molybdenum or tungsten. The electrode is progressively melted at its lower end with a superatmospheric inert gas pressure maintained around the liquefying electrode. The inert gas pressure is sufficiently above the vapor pressure of copper at the liquidus temperature of the alloy being formed to suppress boiling of liquid copper. 6 figs.

  10. Partitioning of copper among copper-binding proteins in the mussel Mytilus edulis exposed to soluble copper

    SciTech Connect

    Harrison, F.L.; Lam, J.R.

    1983-12-01

    Partitioning of copper among copper-binding proteins was evaluated in digestive glands of Mytilus edulis exposed to soluble copper. Groups of mussels were held in flow-through bioassay systems and exposed to either approx. 1 (control) or 25 ..mu..g Cu/L for as long as 21 weeks. At 3-week intervals, groups of 25 mussels were removed and the digestive glands were analyzed for copper-binding proteins by gel-permeation chromatography and atomic absorption spectrometry. Chronic exposure to copper resulted in increased amounts of copper in the low molecular-weight (LMW) protein fraction, which contains metallothionein-like proteins, and in the high molecular-weight (HMW) protein fraction, which contains metalloenzymes. Concentrations of copper in the LMW protein fraction increased and then appeared to plateau with long exposure times, whereas those in the HMW protein fraction continued to increase with exposure time.

  11. Copper sulfate: Liquid or crystals?

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Two separate experiments were conducted to evaluate copper toxicity to channel catfish and free-swimming Ichthyophthirius multifiliis or Ich (the stage of Ich that can be treated); the compounds we used were CuSO4 crystals and a non-chelated liquid CuSO4 product. In 96 hr tests conducted in aquaria...

  12. CopperCore Service Integration

    ERIC Educational Resources Information Center

    Vogten, Hubert; Martens, Harrie; Nadolski, Rob; Tattersall, Colin; van Rosmalen, Peter; Koper, Rob

    2007-01-01

    In an e-learning environment there is a need to integrate various e-learning services like assessment services, collaboration services, learning design services and communication services. In this article we present the design and implementation of a generic integrative service framework, called CopperCore Service Integration (CCSI). We will…

  13. Status of copper sulfate - 2008

    Technology Transfer Automated Retrieval System (TEKTRAN)

    This is brief overview of the Technical Sections completed and being worked on for the New Animal Drug Application (NADA) for copper sulfate. Initial Label Claim (Ich on catfish): 1) Human Food Safety - Complete for all fin fish – February 2004. This includes human intestinal microflora issues,...

  14. Crystallization of copper metaphosphate glass

    NASA Technical Reports Server (NTRS)

    Bae, Byeong-Soo; Weinberg, Michael C.

    1993-01-01

    The effect of the valence state of copper in copper metaphosphate glass on the crystallization behavior and glass transition temperature has been investigated. The crystallization of copper metaphosphate is initiated from the surface and its main crystalline phase is copper metaphosphate (Cu(PO)3),independent of the (Cu sup 2+)/(Cu(total)). However, the crystal morphology, the relative crystallization rates, and their temperature dependences are affected by the (Cu sup 2+)/(Cu (total)) ratio in the glass. On the other hand, the totally oxidized glass crystallizes from all over the surface. The relative crystallization rate of the reduced glass to the totally oxidized glass is large at low temperature, but small at high temperature. The glass transition temperature of the glass increases as the (Cu sup 2+)/(Cu(total)) ratio is raised. It is also found that the atmosphere used during heat treatment does not influence the crystallization of the reduced glass, except for the formation of a very thin CuO surface layer when heated in air.

  15. Tetraphenylphosphonium copper(I) dicyanamide.

    SciTech Connect

    Schlueter, J. A.; Geiser, U.; Materials Science Division

    2007-01-01

    In the title compound, {l_brace}(C{sub 24}H{sub 20}P)[Cu(C{sub 2}N{sub 3}){sub 2}]{r_brace}{sub n}, the copper(I) dicyanamide anion forms a distorted three-dimensional single diamondoid network. Templating tetraphenylphosphonium cations reside within the cavities of the polymeric anion.

  16. PLUTONIUM-CERIUM-COPPER ALLOYS

    DOEpatents

    Coffinberry, A.S.

    1959-05-12

    A low melting point plutonium alloy useful as fuel is a homogeneous liquid metal fueled nuclear reactor is described. Vessels of tungsten or tantalum are useful to contain the alloy which consists essentially of from 10 to 30 atomic per cent copper and the balance plutonium and cerium. with the plutontum not in excess of 50 atomic per cent.

  17. Building a Copper Pipe "Xylophone."

    ERIC Educational Resources Information Center

    Lapp, David R.

    2003-01-01

    Explains how to use the equation for frequency of vibration of a transversely oscillating bar or pipe with both ends free to vibrate to build a simple and inexpensive xylophone from a 3-meter section of copper pipe. The instrument produces a full major scale and can be used to investigate various musical intervals. (Author/NB)

  18. Spectroscopic studies of copper enzymes

    SciTech Connect

    Dooley, D.M.; Moog, R.; Zumft, W.; Koenig, S.H.; Scott, R.A.; Cote, C.E.; McGuirl, M.

    1986-05-01

    Several spectroscopic methods, including absorption, circular dichroism (CD), magnetic CD (MCD), X-ray absorption, resonance Raman, EPR, NMR, and quasi-elastic light-scattering spectroscopy, have been used to probe the structures of copper-containing amine oxidases, nitrite reductase, and nitrous oxide reductase. The basic goals are to determine the copper site structure, electronic properties, and to generate structure-reactivity correlations. Collectively, the results on the amine oxidases permit a detailed model for the Cu(II) sites in these enzymes to be constructed that, in turn, rationalizes the ligand-binding chemistry. Resonance Raman spectra of the phenylhydrazine and 2,4-dinitrophenyl-hydrazine derivatives of bovine plasma amine oxidase and models for its organic cofactor, e.g. pyridoxal, methoxatin, are most consistent with methoxatin being the intrinsic cofactor. The structure of the Cu(I) forms of the amine oxidases have been investigated by X-ray absorption spectroscopy (XAS); the copper coordination geometry is significantly different in the oxidized and reduced forms. Some anomalous properties of the amine oxidases in solution are explicable in terms of their reversible aggregation, which the authors have characterized via light scattering. Nitrite and nitrous oxide reductases display several novel spectral properties. The data suggest that new types of copper sites are present.

  19. Status of Copper Sulfate - 2010

    Technology Transfer Automated Retrieval System (TEKTRAN)

    This is brief overview of the Technical Sections completed and being worked on for the New Animal Drug Application (NADA) for copper sulfate. Initial Label Claim (Ich on catfish): 1) Human Food Safety - Complete for all fin fish - February 2004. This includes human intestinal microflora issues,...

  20. Advantages and challenges of increased antimicrobial copper use and copper mining.

    PubMed

    Elguindi, Jutta; Hao, Xiuli; Lin, Yanbing; Alwathnani, Hend A; Wei, Gehong; Rensing, Christopher

    2011-07-01

    Copper is a highly utilized metal for electrical, automotive, household objects, and more recently as an effective antimicrobial surface. Copper-containing solutions applied to fruits and vegetables can prevent bacterial and fungal infections. Bacteria, such as Salmonellae and Cronobacter sakazakii, often found in food contamination, are rapidly killed on contact with copper alloys. The antimicrobial effectiveness of copper alloys in the healthcare environment against bacteria causing hospital-acquired infections such as methicillin-resistant Staphylococcus aureus (MRSA), Escherichia coli O157:H7, and Clostridium difficile has been described recently. The use of copper and copper-containing materials will continue to expand and may lead to an increase in copper mining and production. However, the copper mining and manufacturing industry and the consumer do not necessarily enjoy a favorable relationship. Open pit mining, copper mine tailings, leaching products, and deposits of toxic metals in the environment often raises concerns and sometimes public outrage. In addition, consumers may fear that copper alloys utilized as antimicrobial surfaces in food production will lead to copper toxicity in humans. Therefore, there is a need to mitigate some of the negative effects of increased copper use and copper mining. More thermo-tolerant, copper ion-resistant microorganisms could improve copper leaching and lessen copper groundwater contamination. Copper ion-resistant bacteria associated with plants might be useful in biostabilization and phytoremediation of copper-contaminated environments. In this review, recent progress in microbiological and biotechnological aspects of microorganisms in contact with copper will be presented and discussed, exploring their role in the improvement for the industries involved as well as providing better environmental outcomes. PMID:21656137

  1. Grain Refinement of Deoxidized Copper

    NASA Astrophysics Data System (ADS)

    Balart, María José; Patel, Jayesh B.; Gao, Feng; Fan, Zhongyun

    2016-08-01

    This study reports the current status of grain refinement of copper accompanied in particular by a critical appraisal of grain refinement of phosphorus-deoxidized, high residual P (DHP) copper microalloyed with 150 ppm Ag. Some deviations exist in terms of the growth restriction factor (Q) framework, on the basis of empirical evidence reported in the literature for grain size measurements of copper with individual additions of 0.05, 0.1, and 0.5 wt pct of Mo, In, Sn, Bi, Sb, Pb, and Se, cast under a protective atmosphere of pure Ar and water quenching. The columnar-to-equiaxed transition (CET) has been observed in copper, with an individual addition of 0.4B and with combined additions of 0.4Zr-0.04P and 0.4Zr-0.04P-0.015Ag and, in a previous study, with combined additions of 0.1Ag-0.069P (in wt pct). CETs in these B- and Zr-treated casts have been ascribed to changes in the morphology and chemistry of particles, concurrently in association with free solute type and availability. No further grain-refining action was observed due to microalloying additions of B, Mg, Ca, Zr, Ti, Mn, In, Fe, and Zn (~0.1 wt pct) with respect to DHP-Cu microalloyed with Ag, and therefore are no longer relevant for the casting conditions studied. The critical microalloying element for grain size control in deoxidized copper and in particular DHP-Cu is Ag.

  2. Reactivity test between beryllium and copper

    SciTech Connect

    Kawamura, H.; Kato, M.

    1995-09-01

    Beryllium has been expected for using as plasma facing material on ITER. And, copper alloy has been proposed as heat sink material behind plasma facing components. Therefore, both materials must be joined. However, the elementary process of reaction between beryllium and copper alloy does not clear in detail. For example, other authors reported that beryllium reacted with copper at high temperature, but it was not obvious about the generation of reaction products and increasing of the reaction layer. In the present work, from this point, for clarifying the elementary process of reaction between beryllium and copper, the out-of-pile compatibility tests were conducted with diffusion couples of beryllium and copper which were inserted in the capsule filled with high purity helium gas (6N). Annealing temperatures were 300, 400, 500, 600 and 700{degrees}C, and annealing periods were 100, 300 and 1000h. Beryllium specimens were hot pressed beryllium, and copper specimens were OFC (Oxygen Free Copper).

  3. Process Of Bonding Copper And Tungsten

    DOEpatents

    Slattery, Kevin T.; Driemeyer, Daniel E.

    1999-11-23

    Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by thermal plasma spraying mixtures of copper powder and tungsten powder in a varied blending ratio such that the blending ratio of the copper powder and the tungsten powder that is fed to a plasma torch is intermittently adjusted to provide progressively higher copper content/tungsten content, by volume, ratio values in the interlayer in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

  4. Copper economy in Chlamydomonas: Prioritized allocation and reallocation of copper to respiration vs. photosynthesis

    PubMed Central

    Kropat, Janette; Gallaher, Sean D.; Urzica, Eugen I.; Nakamoto, Stacie S.; Strenkert, Daniela; Tottey, Stephen; Mason, Andrew Z.; Merchant, Sabeeha S.

    2015-01-01

    Inorganic elements, although required only in trace amounts, permit life and primary productivity because of their functions in catalysis. Every organism has a minimal requirement of each metal based on the intracellular abundance of proteins that use inorganic cofactors, but elemental sparing mechanisms can reduce this quota. A well-studied copper-sparing mechanism that operates in microalgae faced with copper deficiency is the replacement of the abundant copper protein plastocyanin with a heme-containing substitute, cytochrome (Cyt) c6. This switch, which is dependent on a copper-sensing transcription factor, copper response regulator 1 (CRR1), dramatically reduces the copper quota. We show here that in a situation of marginal copper availability, copper is preferentially allocated from plastocyanin, whose function is dispensable, to other more critical copper-dependent enzymes like Cyt oxidase and a ferroxidase. In the absence of an extracellular source, copper allocation to Cyt oxidase includes CRR1-dependent proteolysis of plastocyanin and quantitative recycling of the copper cofactor from plastocyanin to Cyt oxidase. Transcriptome profiling identifies a gene encoding a Zn-metalloprotease, as a candidate effecting copper recycling. One reason for the retention of genes encoding both plastocyanin and Cyt c6 in algal and cyanobacterial genomes might be because plastocyanin provides a competitive advantage in copper-depleted environments as a ready source of copper. PMID:25646490

  5. Copper-mediated dimerization of CopZ, a predicted copper chaperone from Bacillus subtilis.

    PubMed Central

    Kihlken, Margaret A; Leech, Andrew P; Le Brun, Nick E

    2002-01-01

    Understanding the metal-binding properties and solution states of metallo-chaperones is a key step in understanding how they function in metal ion transfer. Using spectroscopic, bioanalytical and biochemical methods, we have investigated the copper-binding properties and association states of the putative copper chaperone of Bacillus subtilis, CopZ, and a variant of the protein lacking the two cysteine residues of the MXCXXC copper-binding motif. We show that copper-free CopZ exists as a monomer, but that addition of copper(I) causes the protein to associate into homodimers. The nature of the copper(I)-CopZ complex is dependent on the level of copper loading, and we report the detection of three distinct forms, containing 0.5, 1.0 and 1.5 copper(I) ions per protein. The presence of excess dithiothreitol has a significant effect on copper(I) binding to CopZ, such that, in its presence, copper(I)-CopZ occurs mainly as a monomer species. Data for copper binding to the double-cysteine variant of CopZ are consistent with an essential role for these residues in tight copper binding in the wild-type protein. We conclude that the complex nature of copper(I) binding to CopZ may underpin mechanisms of protein-to-protein copper(I) transfer. PMID:12238948

  6. Identification of copper-copper and copper-hydrogen complexes in silicon

    SciTech Connect

    Yarykin, N. A.; Weber, J.

    2013-02-15

    The centers formed in silicon as a result of interaction between the substitutional copper impurity (Cu{sub s}) and interstitial copper (Cu{sub i}) or hydrogen (H) atoms, which are mobile at room temperature, are investigated in this study using the deep-level transient spectroscopy (DLTS) technique. It is shown that a well-known photoluminescence center, which includes four copper atoms, is formed from Cu{sub s} via the subsequent addition of Cu{sub i}. Both intermediate complexes (Cu{sub s}-Cu{sub i} and Cu{sub s}-2Cu{sub i}) are identified by their deep levels in the lower half of the band gap. It is found that Cu{sub s} atoms form complexes with one, two, and three hydrogen atoms, with Cu{sub s}-H and Cu{sub s}-2H being electrically active. It is noted that the addition of either hydrogen or copper has a similar effect on the deep-level structure of Cu{sub s}.

  7. Accumulation and hyperaccumulation of copper in plants

    NASA Astrophysics Data System (ADS)

    Adam, V.; Trnkova, L.; Huska, D.; Babula, P.; Kizek, R.

    2009-04-01

    Copper is natural component of our environment. Flow of copper(II) ions in the environment depends on solubility of compounds containing this metal. Mobile ion coming from soil and rocks due to volcanic activity, rains and others are then distributed to water. Bio-availability of copper is substantially lower than its concentration in the aquatic environment. Copper present in the water reacts with other compounds and creates a complex, not available for organisms. The availability of copper varies depending on the environment, but moving around within the range from 5 to 25 % of total copper. Thus copper is stored in the sediments and the rest is transported to the seas and oceans. It is common knowledge that copper is essential element for most living organisms. For this reason this element is actively accumulated in the tissues. The total quantity of copper in soil ranges from 2 to 250 mg / kg, the average concentration is 30 mg / kg. Certain activities related to agriculture (the use of fungicides), possibly with the metallurgical industry and mining, tend to increase the total quantity of copper in the soil. This amount of copper in the soil is a problem particularly for agricultural production of food. The lack of copper causes a decrease in revenue and reduction in quality of production. In Europe, shows the low level of copper in total 18 million hectares of farmland. To remedy this adverse situation is the increasing use of copper fertilizers in agricultural soils. It is known that copper compounds are used in plant protection against various illnesses and pests. Mining of minerals is for the development of human society a key economic activity. An important site where the copper is mined in the Slovakia is nearby Smolníka. Due to long time mining in his area (more than 700 years) there are places with extremely high concentrations of various metals including copper. Besides copper, there are also detected iron, zinc and arsenic. Various plant species

  8. A Plasmodium falciparum copper-binding membrane protein with copper transport motifs

    PubMed Central

    2012-01-01

    Background Copper is an essential catalytic co-factor for metabolically important cellular enzymes, such as cytochrome-c oxidase. Eukaryotic cells acquire copper through a copper transport protein and distribute intracellular copper using molecular chaperones. The copper chelator, neocuproine, inhibits Plasmodium falciparum ring-to-trophozoite transition in vitro, indicating a copper requirement for malaria parasite development. How the malaria parasite acquires or secretes copper still remains to be fully elucidated. Methods PlasmoDB was searched for sequences corresponding to candidate P. falciparum copper-requiring proteins. The amino terminal domain of a putative P. falciparum copper transport protein was cloned and expressed as a maltose binding fusion protein. The copper binding ability of this protein was examined. Copper transport protein-specific anti-peptide antibodies were generated in chickens and used to establish native protein localization in P. falciparum parasites by immunofluorescence microscopy. Results Six P. falciparum copper-requiring protein orthologs and a candidate P. falciparum copper transport protein (PF14_0369), containing characteristic copper transport protein features, were identified in PlasmoDB. The recombinant amino terminal domain of the transport protein bound reduced copper in vitro and within Escherichia coli cells during recombinant expression. Immunolocalization studies tracked the copper binding protein translocating from the erythrocyte plasma membrane in early ring stage to a parasite membrane as the parasites developed to schizonts. The protein appears to be a PEXEL-negative membrane protein. Conclusion Plasmodium falciparum parasites express a native protein with copper transporter characteristics that binds copper in vitro. Localization of the protein to the erythrocyte and parasite plasma membranes could provide a mechanism for the delivery of novel anti-malarial compounds. PMID:23190769

  9. Nanoscale Copper and Copper Compounds for Advanced Device Applications

    NASA Astrophysics Data System (ADS)

    Chen, Lih-Juann

    2016-04-01

    Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu2S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu3Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se2 nanotip arrays for high-efficiency solar cell, multilevel Cu2S resistive memory, superlattice Cu2S-Ag2S heterojunction diodes, and facet-dependent Cu2O diode.

  10. Metallic Copper as an Antimicrobial Surface▿

    PubMed Central

    Grass, Gregor; Rensing, Christopher; Solioz, Marc

    2011-01-01

    Bacteria, yeasts, and viruses are rapidly killed on metallic copper surfaces, and the term “contact killing” has been coined for this process. While the phenomenon was already known in ancient times, it is currently receiving renewed attention. This is due to the potential use of copper as an antibacterial material in health care settings. Contact killing was observed to take place at a rate of at least 7 to 8 logs per hour, and no live microorganisms were generally recovered from copper surfaces after prolonged incubation. The antimicrobial activity of copper and copper alloys is now well established, and copper has recently been registered at the U.S. Environmental Protection Agency as the first solid antimicrobial material. In several clinical studies, copper has been evaluated for use on touch surfaces, such as door handles, bathroom fixtures, or bed rails, in attempts to curb nosocomial infections. In connection to these new applications of copper, it is important to understand the mechanism of contact killing since it may bear on central issues, such as the possibility of the emergence and spread of resistant organisms, cleaning procedures, and questions of material and object engineering. Recent work has shed light on mechanistic aspects of contact killing. These findings will be reviewed here and juxtaposed with the toxicity mechanisms of ionic copper. The merit of copper as a hygienic material in hospitals and related settings will also be discussed. PMID:21193661

  11. Copper sensitivity in dorsal hippocampus slices.

    PubMed

    Leiva, J; Palestini, M; Tetas, M; López, J

    2000-04-01

    The action of copper on the pyramidal neurons in CA1 of the hippocampus is little understood. Our main aim was to study the possible interaction of copper on the synaptic network in CA1 pyramidal neurons. We used Wistar rats hippocampus slices in a recording chamber. The population response ("population of spikes") collected by an extracellular micropipette under baseline conditions served as control. Copper, GABA, bicuculline and picrotoxin were delivered in different experimental conditions to the slice. One, 10 and 100 microM of copper concentration decreased significantly the amplitude and duration of the population spikes in relation to the control response. This effect did not show concentration dependency. Copper in bicuculline medium decreased significantly the duration response in relation to the control response and in relation to copper effect in a free bicuculline medium. This phenomenon emphasizes the copper action on the GABA (B) and (C) receptors. Copper in a picrotoxin medium increased significantly the excitability of the response. This new effect suggests that copper acts on non-GABA receptors, an effect that could be detected when the GABA receptors were inactivated. As a result of these findings it appears that, under our experimental conditions, copper generated transient sensitivity changes in pyramidal neurons of CA1 dorsal hippocampus. PMID:10782257

  12. Deuterium permeation through copper with trapping impurities

    NASA Astrophysics Data System (ADS)

    Mitchell, D. J.; Harris, J. M.; Patrick, R. C.; Boespflug, E. P.; Beavis, L. C.

    1982-02-01

    The time dependence of the deuterium permeation rate through impurity-doped copper membranes was measured in the temperature range 300-700 °C. Copper membranes that were doped with Er, Zr, and Ti all exhibited permeabilities that were nearly equal to pure copper, but the apparent diffusivities were smaller than those for pure copper by factors of 10-100 over the experimental temperature range. The permeation characteristics of these alloys appear to be altered from those for pure copper due to trapping of deuterium at sites that are associated with the impurity atoms. It is shown that the deuterium permeation rate through the copper alloys can be expressed in an analytical form that is analogous to that for pure copper, except that the apparent diffusivity takes on a value which depends on the trap concentration and binding energy for deuterium. The binding energies that are calculated for the alloys are used to determine the lag time which is required for deuterium or hydrogen to permeate through initially evacuated membranes. The lag times for copper alloys containing about 1% Er, Zr, or Ti are many orders of magnitude longer than for pure copper at room temperature. Copper alloys containing Cr do not appear to exhibit deuterium trapping. Nuclear reaction and backscattering analyses were used to help determine the effect or surface oxides on the permeation measurements.

  13. Canine Models for Copper Homeostasis Disorders

    PubMed Central

    Wu, Xiaoyan; Leegwater, Peter A. J.; Fieten, Hille

    2016-01-01

    Copper is an essential trace nutrient metal involved in a multitude of cellular processes. Hereditary defects in copper metabolism result in disorders with a severe clinical course such as Wilson disease and Menkes disease. In Wilson disease, copper accumulation leads to liver cirrhosis and neurological impairments. A lack in genotype-phenotype correlation in Wilson disease points toward the influence of environmental factors or modifying genes. In a number of Non-Wilsonian forms of copper metabolism, the underlying genetic defects remain elusive. Several pure bred dog populations are affected with copper-associated hepatitis showing similarities to human copper metabolism disorders. Gene-mapping studies in these populations offer the opportunity to discover new genes involved in copper metabolism. Furthermore, due to the relatively large body size and long life-span of dogs they are excellent models for development of new treatment strategies. One example is the recent use of canine organoids for disease modeling and gene therapy of copper storage disease. This review addresses the opportunities offered by canine genetics for discovery of genes involved in copper metabolism disorders. Further, possibilities for the use of dogs in development of new treatment modalities for copper storage disorders, including gene repair in patient-derived hepatic organoids, are highlighted. PMID:26861285

  14. Copper sensitivity of Oregon coastal phytoplankton

    SciTech Connect

    Riedel, G.F.

    1983-01-01

    The copper sensitivity of natural populations of Oregon coastal phytoplankton was studied using both additions of ionic copper and Cu-TRIS free ion activity buffers in coastal seawater. Phytoplankton growth rate, taxonomic composition and copper content were examined in treatment additions. The growth rate results suggested that the deficiency of another trace metal increased the apparent toxicity of copper to phytoplankton, especially in TRIS-free ion activity buffered seawater. Laboratory experiments with isolated coastal phytoplankton species indicated that manganese deficiency exacerbated copper toxicity, and that manganese deficiency was induced in TRIS buffered seawater by a TRIS-catalyzed oxidation of Mn. When manganese additions to natural populations were employed inconjunction with ionic copper additions and TRIS-free ion regulated seawater, they showed that ambient manganese concentrations were low enough to shift the onset of copper toxicity to lower copper concentrations. The results suggest that while acute toxicity to phytoplankton by ambient concentrations of copper is unlikely, the interactions of copper and other metals, especially manganese, may influence natural coastal phytoplankton populations in more subtle ways, such as taxonomic composition.

  15. Copper-philic carbon nanotubes

    NASA Astrophysics Data System (ADS)

    Belgamwar, Sachin U.; Sharma, Niti Nipun

    2016-04-01

    Carbon nanotube is having poor wet-ability with copper metal. Wet-ability of carbon nanotube was improved by exposing and creating more active sites on the surface of carbon nanotube. Carbon nanotubes were subjected to the prolong ultrasonication treatment of 20×103 Hz and 500W, which helped in disentanglement of carbon nanotube agglomerates and in breaking the weak bonds like pentagonal or heptagonal structure on the surface and on the CNT cap. Disentanglement of the carbon nanotube, resulted in exposing the defective sites on the surface and breaking of weak bonds, which assisted in creating the new defects on the surface. This process results in generates more active sites on the surface and it helps in improving the wet-ability of the carbon nanotube in copper.

  16. Accumulation of copper and other metals by copper-resistant plant-pathogenic and saprophytic pseudomonads

    SciTech Connect

    Cooksey, D.A.; Azad, H.R. )

    1992-01-01

    Copper-resistant strains of Pseudomonas syringae carrying the cop operon produce periplasmic copper-binding proteins, and this sequestration outside the cytoplasm has been proposed as a resistance mechanism. In this study, strain PS61 of P. syringae carrying the cloned cop operon accumulated more total cellular copper than without the operon. Several other copper-resistant pseudomonads with homology to cop were isolated from plants, and these bacteria also accumulated copper. Two highly resistant species accumulated up to 115 to 120 mg of copper per g (dry weight) of cells. P. putida 08891 was more resistant to several metals than P. syringae pv. tomato PT23, but this increased resistance was not correlated with an increased accumulation of metals other than copper. Several metals were accumulated by both PT23 and P. putida, but when copper was added to induce the cop operon, there was generally no increase of accumulation of the other metals, suggesting that the cop operon does not contribute to accumulation of these other metals. The exceptions were aluminium for PT23 and iron for P. putida, which accumulated to higher levels when copper was added to the cultures. The results of this study support the role of copper sequestration in the copper resistance mechanism of P. syringae and suggest that this mechanism is common to several copper-resistant Pseudomonas species found on plants to which antimicrobial copper compounds are applied for plant disease control.

  17. Copper-induced production of copper-binding supernatant proteins by the marine bacterium Vibrio alginolyticus

    SciTech Connect

    Harwood-Sears, V.; Gordon, A.S. )

    1990-05-01

    Growth of the marine bacterium Vibrio alginolyticus is temporarily inhibited by micromolar levels of copper. During the copper-induced lag phase, supernatant compounds and detoxify copper are produced. In this study two copper-inducible supernatant proteins having molecular masses of ca. 21 and 19 kilodaltons (CuBP1 and CuPB2) were identified; these proteins were, respectively, 25 and 46 times amplified in supernatants of copper-challenged cultures compared with controls. Experiments in which chloramphenicol was added to cultures indicated that there was de novo synthesis of these proteins in response to copper. When supernatants were separated by gel permeation chromatography, CuBP1 and CuPB2 coeluted with a copper-induced peak in copper-binding activity. CuBP1 and CuBP2 from whole supernatants were concentrated and partially purified by using a copper-charged immobilized metal ion affinity chromatography column, confirming the affinity of these proteins for copper. A comparison of cell pellets and supernatants demonstrated that CuBP1 was more concentrated in supernatants than in cells. Our data are consistent with a model for a novel mechanism of copper detoxification in which excretion of copper-binding protein is induced by copper.

  18. Direct, rapid, facile photochemical method for preparing copper nanoparticles and copper patterns.

    PubMed

    Zhu, Xiaoqun; Wang, Bowen; Shi, Feng; Nie, Jun

    2012-10-01

    We develop a facile method for preparing copper nanoparticles and patterned surfaces with copper stripes by ultraviolet (UV) irradiation of a mixture solution containing a photoinitiator and a copper-amine coordination compound. The copper-amine compound is formed by adding diethanol amine to an ethanol solution of copper chloride. Under UV irradiation, free radicals are generated by photoinitiator decomposition. Meanwhile, the copper-amine coordination compound is rapidly reduced to copper particles because the formation of the copper-amine coordination compound prevents the production of insoluble cuprous chloride. Poly(vinylpyrrolidone) is used as a capping agent to prevent the aggregation of the as-prepared copper nanoparticles. The capping agent increases the dispersion of copper nanoparticles in the ethanol solution and affects their size and morphology. Increasing the concentration of the copper-amine coordination compound to 0.1 M directly forms a patterned surface with copper stripes on the transparent substrate. This patterned surface is formed through the combination of the heterogeneous nucleation of copper nanoparticles and photolithography. We also investigate the mechanism of photoreduction by UV-vis spectroscopy and gas chromatography-mass spectrometry. PMID:22974517

  19. Enhanced copper adsorption and morphological alterations of cells of copper-stressed Mucor rouxii

    SciTech Connect

    Gardea-Torresdey, J.L.; Cano-Aguilera, I.; Webb, R.; Gutierrez-Corona, F.

    1997-03-01

    Fungi are ubiquitous and can become dominant in metal-polluted habitats. Some fungal strains are tolerant to metal toxicity. The presence of a high copper concentration in the culture medium induced morphological changes in the copper-tolerant strain of Mucor rouxii. Copper binding by strains of M. rouxii cultured at a trace copper concentration was less effective than those cultured at a high copper concentration. These experiments were performed at an optimum time of 30 min and a pH of 5 for Cu{sup 2+} binding. The results suggest that a passive metal-binding mechanism makes the majority of total copper binding. These preliminary findings suggest that the presence of high levels of copper in the culture medium allow the development of chemical functional groups on the fungal surface, which led to an enhanced copper-binding ability and induced important morphological changes in M. rouxii.

  20. In situ Fabrication of Monolithic Copper Azide

    NASA Astrophysics Data System (ADS)

    Li, Bing; Li, Mingyu; Zeng, Qingxuan; Wu, Xingyu

    2016-04-01

    Fabrication and characterization of monolithic copper azide were performed. The monolithic nanoporous copper (NPC) with interconnected pores and nanoparticles was prepared by decomposition and sintering of the ultrafine copper oxalate. The preferable monolithic NPC can be obtained through decomposition and sintering at 400°C for 30 min. Then, the available monolithic NPC was in situ reacted with the gaseous HN3 for 24 h and the monolithic NPC was transformed into monolithic copper azide. Additionally, the copper particles prepared by electrodeposition were also reacted with the gaseous HN3 under uniform conditions as a comparison. The fabricated monolithic copper azide was characterized by Fourier transform infrared (FTIR), inductively coupled plasma-optical emission spectrometry (ICP-OES), and differential scanning calorimetry (DSC).

  1. Copper: a metal for the ages

    USGS Publications Warehouse

    Doebrich, Jeff

    2009-01-01

    Copper was one of the first metals ever extracted and used by humans, and it has made vital contributions to sustaining and improving society since the dawn of civilization. Copper was first used in coins and ornaments starting about 8000 B.C., and at about 5500 B.C., copper tools helped civilization emerge from the Stone Age. The discovery that copper alloyed with tin produces bronze marked the beginning of the Bronze Age at about 3000 B.C. Copper is easily stretched, molded, and shaped; is resistant to corrosion; and conducts heat and electricity efficiently. As a result, copper was important to early humans and continues to be a material of choice for a variety of domestic, industrial, and high-technology applications today.

  2. Acute copper toxicosis in the Canada goose.

    PubMed

    Henderson, B M; Winterfield, R W

    1975-01-01

    Acute copper toxicosis resulted in Canada geese, Branta canadensis, following ingestion of copper sulfate at about 600mg/kg from a small man-made pond on a game farm. The lesions were those associated with copper toxicosis in other avian species. The primary pathologic change was necrosis and sloughing of the proventriculus and gizzard. A greenish discoloration of the lungs also occurred. PMID:1156262

  3. Electrochemical synthesis of highly crystalline copper nanowires

    SciTech Connect

    Kaur, Amandeep; Gupta, Tanish; Kumar, Akshay; Kumar, Sanjeev; Singh, Karamjeet; Thakur, Anup

    2015-05-15

    Copper nanowires were fabricated within the pores of anodic alumina template (AAT) by template synthesis method at pH = 2.9. X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) were used to investigate the structure, morphology and composition of fabricated nanowires. These characterizations revealed that the deposited copper nanowires were highly crystalline in nature, dense and uniform. The crystalline copper nanowires are promising in application of future nanoelectronic devices and circuits.

  4. CNC Machining Of The Complex Copper Electrodes

    NASA Astrophysics Data System (ADS)

    Popan, Ioan Alexandru; Balc, Nicolae; Popan, Alina

    2015-07-01

    This paper presents the machining process of the complex copper electrodes. Machining of the complex shapes in copper is difficult because this material is soft and sticky. This research presents the main steps for processing those copper electrodes at a high dimensional accuracy and a good surface quality. Special tooling solutions are required for this machining process and optimal process parameters have been found for the accurate CNC equipment, using smart CAD/CAM software.

  5. Copper chloride cathode for a secondary battery

    NASA Technical Reports Server (NTRS)

    Bugga, Ratnakumar V. (Inventor); Distefano, Salvador (Inventor); Nagasubramanian, Ganesan (Inventor); Bankston, Clyde P. (Inventor)

    1990-01-01

    Higher energy and power densities are achieved in a secondary battery based on molten sodium and a solid, ceramic separator such as a beta alumina and a molten catholyte such as sodium tetrachloroaluminate and a copper chloride cathode. The higher cell voltage of copper chloride provides higher energy densities and the higher power density results from increased conductivity resulting from formation of copper as discharge proceeds.

  6. Pressure leaching las cruces copper ore

    NASA Astrophysics Data System (ADS)

    Berezowsky, R. M.; Xue, T.; Collins, M. J.; Makwana, M.; Barton-Jones, I.; Southgate, M.; Maclean, J. K.

    1999-12-01

    A hydrometallurgical process was developed for treating the Las Cruces massive sulfide-ore deposit located near Seville, Spain. A two-stage countercurrent leach process, consisting of an atmospheric leach and a pressure leach, was developed to effectively leach copper from the copper-bearing minerals and to generate a solution suitable for the subsequent solvent-extraction and copper-electrowinning operations. The results of batch and continuous miniplant tests are presented.

  7. Copper Nanoparticles in Click Chemistry.

    PubMed

    Alonso, Francisco; Moglie, Yanina; Radivoy, Gabriel

    2015-09-15

    The challenges of the 21st century demand scientific and technological achievements that must be developed under sustainable and environmentally benign practices. In this vein, click chemistry and green chemistry walk hand in hand on a pathway of rigorous principles that help to safeguard the health of our planet against negligent and uncontrolled production. Copper-catalyzed azide-alkyne cycloaddition (CuAAC), the paradigm of a click reaction, is one of the most reliable and widespread synthetic transformations in organic chemistry, with multidisciplinary applications. Nanocatalysis is a green chemistry tool that can increase the inherent effectiveness of CuAAC because of the enhanced catalytic activity of nanostructured metals and their plausible reutilization capability as heterogeneous catalysts. This Account describes our contribution to click chemistry using unsupported and supported copper nanoparticles (CuNPs) as catalysts prepared by chemical reduction. Cu(0)NPs (3.0 ± 1.5 nm) in tetrahydrofuran were found to catalyze the reaction of terminal alkynes and organic azides in the presence of triethylamine at rates comparable to those achieved under microwave heating (10-30 min in most cases). Unfortunately, the CuNPs underwent dissolution under the reaction conditions and consequently could not be recovered. Compelling experimental evidence on the in situ generation of highly reactive copper(I) chloride and the participation of copper(I) acetylides was provided. The supported CuNPs were found to be more robust and efficient catalyst than the unsupported counterpart in the following terms: (a) the multicomponent variant of CuAAC could be applied; (b) the metal loading could be substantially decreased; (c) reactions could be conducted in neat water; and (d) the catalyst could be recovered easily and reutilized. In particular, the catalyst composed of oxidized CuNPs (Cu2O/CuO, 6.0 ± 2.0 nm) supported on carbon (CuNPs/C) was shown to be highly versatile and very

  8. Material flows generated by pyromet copper smelting

    USGS Publications Warehouse

    Goonan, T.G.

    2005-01-01

    Copper production through smelting generates large volumes of material flows. As copper contained in ore becomes copper contained in concentrate to be fed into the smelting process, it leaves behind an altered landscape, sometimes mine waste, and always mill tailings. Copper concentrate, fluxing materials, fuels, oxygen, recyclables, scrap and water are inputs to the process. Dust (recycled), gases - containing carbon dioxide (CO2) (dissipated) and sulfur dioxide (SO2) (mostly collected, transformed and sold) and slag (discarded or sold) - are among the significant process outputs. This article reports estimates of the flows of these input/output materials for a particular set of smelters studied in some countries.

  9. Electroforming copper targets for RTNS-II

    SciTech Connect

    Kelley, W.K.; Dini, J.W.; Logan, C.M.

    1981-02-06

    Copper targets used in RTNS II, which is the world's most intense 14-MeV neutron source, contain water cooling channels for temperature control. There are two methods for fabricating these targets: (1) diffusion bonding a copper panel containing photoetched channels to another copper panel, and (2) an electroforming technique which involves filling the photoetched channels with wax, plating thick copper to seal over the channels and then removing the wax. Development of this latter process and results obtained with it are described.

  10. Radioactivity at the Copper Creek copper lode prospect, Eagle district, east-central Alaska

    USGS Publications Warehouse

    Wedow, Helmuth; Tolbert, Gene Edward

    1952-01-01

    Investigation of radioactivity anomalies at the Copper Creek copper lode prospect, Eagle district, east-central Alaska, during 1949 disclosed that the radioactivity is associated with copper mineralization in highly metamorphosed sedimentary rocks. These rocks are a roof pendant in the Mesozoic "Charley River" batholith. The radioactivity is probably all due to uranium associated with bornite and malachite.

  11. Release of Micronized Copper Particles from Pressure Treated Wood Products.

    EPA Science Inventory

    Micronized copper pressure treated lumber (PTL) has recently been introduced to the consumer market as a replacement for ionized copper PTL. The presence of particulate rather than aqueous copper raises concerns about possible human or environmental exposure. Two common pathways ...

  12. Neutron-activation analysis applied to copper ores and artifacts

    NASA Technical Reports Server (NTRS)

    Linder, N. F.

    1970-01-01

    Neutron activation analysis is used for quantitative identification of trace metals in copper. Establishing a unique fingerprint of impurities in Michigan copper would enable identification of artifacts made from this copper.

  13. SURVIVAL AND IMMUNE RESPONSE OF COHO SALMON EXPOSED TO COPPER

    EPA Science Inventory

    Vaccination with Vibrio anguillarum by oral administration during copper exposure and intraperitoneal injection prior to copper exposure was employed to investigate the effects of copper upon survival and the immune response of juvenile coho salmon (Oncorhynchus kisutch). Followi...

  14. 40 CFR 415.360 - Applicability; description of the copper salts production subcategory.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... copper salts production subcategory. 415.360 Section 415.360 Protection of Environment ENVIRONMENTAL... SOURCE CATEGORY Copper Salts Production Subcategory § 415.360 Applicability; description of the copper... copper salts, including (a) copper sulfate, copper chloride, copper iodide, and copper nitrate, and...

  15. 40 CFR 415.360 - Applicability; description of the copper salts production subcategory.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... copper salts production subcategory. 415.360 Section 415.360 Protection of Environment ENVIRONMENTAL... SOURCE CATEGORY Copper Salts Production Subcategory § 415.360 Applicability; description of the copper... copper salts, including (a) copper sulfate, copper chloride, copper iodide, and copper nitrate, and...

  16. 40 CFR 415.360 - Applicability; description of the copper salts production subcategory.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... copper salts production subcategory. 415.360 Section 415.360 Protection of Environment ENVIRONMENTAL... SOURCE CATEGORY Copper Salts Production Subcategory § 415.360 Applicability; description of the copper... copper salts, including (a) copper sulfate, copper chloride, copper iodide, and copper nitrate, and...

  17. 40 CFR 415.360 - Applicability; description of the copper salts production subcategory.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... copper salts production subcategory. 415.360 Section 415.360 Protection of Environment ENVIRONMENTAL... SOURCE CATEGORY Copper Salts Production Subcategory § 415.360 Applicability; description of the copper... copper salts, including (a) copper sulfate, copper chloride, copper iodide, and copper nitrate, and...

  18. 40 CFR 415.360 - Applicability; description of the copper salts production subcategory.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... copper salts production subcategory. 415.360 Section 415.360 Protection of Environment ENVIRONMENTAL... SOURCE CATEGORY Copper Salts Production Subcategory § 415.360 Applicability; description of the copper... copper salts, including (a) copper sulfate, copper chloride, copper iodide, and copper nitrate, and...

  19. Synthesis of Copper/Copper-Oxide Nanoparticles: Optical and Structural Characterizations

    SciTech Connect

    Swarnkar, R. K.; Singh, S. C.; Gopal, R.

    2009-06-29

    In the present study, we have synthesized copper/copper-oxide nanoparticles by laser ablation of copper metal in aqueous solution of sodium dodecyl sulfate. The focused output of 1064 nm wavelength of pulsed Nd:YAG laser is used for ablation. The synthesized nanoparticles are characterized by UV-visible absorption, X-ray diffraction, transmission electron microscopy and Raman spectroscopy techniques. The synthesis of copper/copper oxide nanoparticles are confirmed by XRD and Raman studies. The possible mechanism of nanoparticle formation is also discussed.

  20. Energy and materials flows in the copper industry

    SciTech Connect

    Gaines, L.L.

    1980-12-01

    The copper industry comprises both the primary copper industry, which produces 99.9%-pure copper from copper ore, and the secondary copper industry, which salvages and recycles copper-containing scrap metal to extract pure copper or copper alloys. The United States uses about 2 million tons of copper annually, 60% of it for electrical applications. Demand is expected to increase less than 4% annually for the next 20 years. The primary copper industry is concentrated in the Southwest; Arizona produced 66% of the 1979 total ore output. Primary production uses about 170 x 10/sup 12/ Btu total energy annually (about 100 x 10/sup 6/ Btu/ton pure copper produced from ore). Mining and milling use about 60% of the total consumption, because low-grade ore (0.6% copper) is now being mined. Most copper is extracted by smelting sulfide ores, with concomitant production of sulfur dioxide. Clean air regulations will require smelters to reduce sulfur emissions, necessitating smelting process modifications that could also save 20 x 10/sup 12/ Btu (10 x 10/sup 6/ Btu/ton of copper) in smelting energy. Energy use in secondary copper production averages 20 x 10/sup 6/ Btu/ton of copper. If all copper products were recycled, instead of the 30% now salvaged, the energy conservation potential would be about one-half the total energy consumption of the primary copper industry.

  1. Synthesis of Commercial Products from Copper Wire-Drawing Waste

    NASA Astrophysics Data System (ADS)

    Ayala, J.; Fernández, B.

    2014-06-01

    Copper powder and copper sulfate pentahydrate were obtained from copper wire-drawing scale. The hydrometallurgical recycling process proposed in this article yields a high-purity copper powder and analytical grade copper sulfate pentahydrate. In the first stage of this process, the copper is dissolved in sulfuric acid media via dismutation of the scale. In the second stage, copper sulfate pentahydrate is precipitated using ethanol. Effects such as pH, reaction times, stirring speed, initial copper concentration, and ethanol/solution volume ratio were studied during the precipitation from solution reaction. The proposed method is technically straightforward and provides efficient recovery of Cu from wire-drawing scale.

  2. Excitonic superconductivity in copper oxides

    SciTech Connect

    Tesanovic, Z.; Bishop, A.R.; Martin, R.L.; Harris, C.

    1988-01-01

    We discuss the possibility of excitonic superconductivity in high T/sub c/ copper oxides. The Hamiltonians describing CuO/sub 2/ planes supports both antiferromagnetism and low-lying Cu /longleftrightarrow/ O intra- and interband charge fluctuations. One crosses from one regime to another as the number of holes per unit cell increases. The high T/sub c/ superconductivity takes place at hole concentrations most favorable for intraband charge transfer excitations. The dynamic polarizability of the environment surrounding CuO/sub 2/ planes plays an important role in enhancing T/sub c/. 15 refs., 4 figs.

  3. Geomorphology of the lower Copper River, Alaska

    USGS Publications Warehouse

    Brabets, Timothy P.

    1997-01-01

    The Copper River, located in southcentral Alaska, drains an area of more than 24,000 square miles. About 30 miles above its mouth, this large river enters Miles Lake, a proglacial lake formed by the retreat of Miles Glacier. Downstream from the outlet of Miles Lake, the Copper River flows past the face of Childs Glacier before it enters a large, broad, alluvial flood plain. The Copper River Highway traverses this flood plain and in 1995, 11 bridges were located along this section of the highway. These bridges cross parts of the Copper River and in recent years, some of these bridges have sustained serious damage due to the changing course of the Copper River. Although the annual mean discharge of the lower Copper River is 57,400 cubic feet per second, most of the flow occurs during the summer months from snowmelt, rainfall, and glacial melt. Approximately every six years, an outburst flood from Van Cleve Lake, a glacier-dammed lake formed by Miles Glacier, releases approximately 1 million acre-feet of water into the Copper River. When the outflow rate from Van Cleve Lake reaches it peak, the flow of the Copper River will increase between 150,000 to 190,000 cubic feet per second. Data collected by bedload sampling and continuous seismic reflection indicated that Miles Lake traps virtually all the bedload being transported by the Copper River as it enters the lake from the north. The reservoir-like effect of Miles Lake results in the armoring of the channel of the Copper River downstream from Miles Lake, past Childs Glacier, until it reaches the alluvial flood plain. At this point, bedload transport begins again. The lower Copper River transports 69 million tons per year of suspended sediment, approximately the same quantity as the Yukon River, which drains an area of more than 300,000 square miles. By correlating concurrent flows from a long-term streamflow-gaging station on the Copper River with a short-term streamflow-gaging station at the outlet of Miles Lake

  4. Potentially novel copper resistance genes in copper-enriched activated sludge revealed by metagenomic analysis.

    PubMed

    Li, Li-Guan; Cai, Lin; Zhang, Xu-Xiang; Zhang, Tong

    2014-12-01

    In this study, we utilized the Illumina high-throughput metagenomic approach to investigate diversity and abundance of both microbial community and copper resistance genes (CuRGs) in activated sludge (AS) which was enriched under copper selective stress up to 800 mg/L. The raw datasets (~3.5 Gb for each sample, i.e., the copper-enriched AS and the control AS) were merged and normalized for the BLAST analyses against the SILVA SSU rRNA gene database and self-constructed copper resistance protein database (CuRD). Also, the raw metagenomic sequences were assembled into contigs and analyzed based on Open Reading Frames (ORFs) to identify potentially novel copper resistance genes. Among the different resistance systems for copper detoxification under the high copper stress condition, the Cus system was the most enriched system. The results also indicated that genes encoding multi-copper oxidase played a more important role than those encoding efflux proteins. More significantly, several potentially novel copper resistance ORFs were identified by Pfam search and phylogenic analysis. This study demonstrated a new understanding of microbial-mediated copper resistance under high copper stress using high-throughput shotgun sequencing technique. PMID:25081552

  5. Increased blood and urine copper after residential exposure to copper naphthenate

    SciTech Connect

    Bluhm, R.E.; Welch, L.; Branch, R.A. )

    1992-01-01

    Despite widespread industrial use of copper naphthenate, there are no reports of the relationship of copper naphthenate and copper absorption in humans or animals. We report a family of three individuals who lived in a home where copper naphthenate was sprayed on the inner foundation. Subsequently, these individuals developed non-specific complaints. In two of these individuals, serum copper levels were elevated when first measured months after copper naphthenate was sprayed in the home. A gradual decline over several years in urine and serum copper levels was observed in the individual who maintained follow-up. It is not known if symptoms reflected exposure to naphthenate, the solvent vehicle, volatilized copper, or the stress of exposure to a malodorous compound perceived as toxic. Exposure to copper naphthenate may be another cause of an elevated serum and urine copper level but the interpretation of these levels as normal' or toxic' requires additional study for clarification. This report suggests the need for further study of the absorption and relative toxicity of copper naphthenate.

  6. Mechanical Separation of Metallic Copper from Polymer-Insulated Copper Wire

    SciTech Connect

    Yokoyama, Seiji; Takeuchi, Sakae; Hisyamudin Bin Muhd Nor, Nik

    2011-01-17

    It is very important to recycling of polymer-insulated copper wire to remove copper from the wire without any contamination. A rolling machine and a blender were used to separate and recover the copper wires from a polymer coated cable. In the experiment using a rolling machine, the recovery of copper was improved by an increase in the number of rolling times and by lowering the cable temperature. All of the copper was recovered from a cable of 115 K in temperature. In the other experiment using a blender, the weight of the recovery of copper was increased by shortening the cable length and by increasing the rotary speed of the blender and the treating time. All the copper in a cut cable of 3mm long was recovered from a cable.

  7. Fetal polyol metabolism in copper deficiency

    SciTech Connect

    Fields, M.; Lewis, C.G.; Beal, T. )

    1989-02-09

    Since pregnant rats consuming fructose, copper deficient diets fail to give birth, the relationship between maternal copper deficiency, polyol metabolism and fetal mortality was investigated. Forty Sprague-Dawley rats were fed from conception one of the following diets: fructose, copper deficient; fructose, copper adequate; starch, copper deficient or starch, copper adequate. The deficient diets contained 0.6 ug Cu and the adequate 6.0 ug Cu/g diet. Pregnancy was terminated at day 19 of gestation. Glucose, sorbitol and fructose were measured in maternal blood, placenta and fetal liver. Fructose consumption during pregnancy resulted in higher levels of fructose and sorbitol in maternal blood when compared to starch. In the fructose dietary groups, the placenta and fetal liver contained extremely high levels of glucose, fructose and sorbitol compared to the corresponding metabolites from the starch dietary groups. Copper deficiency further elevated fructose and sorbitol concentrations in the placenta and fetal liver respectively. Since high tissue levels of glucose, fructose and sorbitol have been shown to have deleterious effects on cellular metabolism, these data suggest that when fructose was fed during pregnancy the combination of an aberration of carbohydrate metabolism with copper deficiency could be responsible for the pathology and mortality of the developing fetus.

  8. Lead and Copper Control 101-slides

    EPA Science Inventory

    This presentation is an overview of the most important water treatment strategies for the control of lead and copper release from drinking water corrosion. In addition to the sections specifically on lead and copper treatment, sections are included that cover sampling to find le...

  9. 21 CFR 582.5260 - Copper gluconate.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 6 2010-04-01 2010-04-01 false Copper gluconate. 582.5260 Section 582.5260 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) ANIMAL DRUGS, FEEDS, AND RELATED PRODUCTS SUBSTANCES GENERALLY RECOGNIZED AS SAFE Nutrients and/or Dietary Supplements 1 § 582.5260 Copper gluconate....

  10. Copper laser diagnostics and kinetics support

    SciTech Connect

    Not Available

    1981-12-01

    In the effort MSNW participated with the LINL copper-Vapor Laser Program by providing a useful plasma diagnostic for interpretation of Copper-vapor laser kinetics. MSNW developed and delivered a pulsed interferometric diagnostic package to LLNL. Moreover MSNW provided personal services at the request and direction of LLL in the implementation of the diagnostic and interpretation of the data.

  11. COPPER PITTING AND PINHOLE LEAK RESEARCH STUDY

    EPA Science Inventory

    Localized copper corrosion or pitting is a significant problem at many water utilities across the United States. Copper pinhole leak problems resulting from extensive pitting are widely under reported. Given the sensitive nature of the problem, extent of damage possible, costs o...

  12. Copper regulates cyclic-AMP-dependent lipolysis.

    PubMed

    Krishnamoorthy, Lakshmi; Cotruvo, Joseph A; Chan, Jefferson; Kaluarachchi, Harini; Muchenditsi, Abigael; Pendyala, Venkata S; Jia, Shang; Aron, Allegra T; Ackerman, Cheri M; Wal, Mark N Vander; Guan, Timothy; Smaga, Lukas P; Farhi, Samouil L; New, Elizabeth J; Lutsenko, Svetlana; Chang, Christopher J

    2016-08-01

    Cell signaling relies extensively on dynamic pools of redox-inactive metal ions such as sodium, potassium, calcium and zinc, but their redox-active transition metal counterparts such as copper and iron have been studied primarily as static enzyme cofactors. Here we report that copper is an endogenous regulator of lipolysis, the breakdown of fat, which is an essential process in maintaining body weight and energy stores. Using a mouse model of genetic copper misregulation, in combination with pharmacological alterations in copper status and imaging studies in a 3T3-L1 white adipocyte model, we found that copper regulates lipolysis at the level of the second messenger, cyclic AMP (cAMP), by altering the activity of the cAMP-degrading phosphodiesterase PDE3B. Biochemical studies of the copper-PDE3B interaction establish copper-dependent inhibition of enzyme activity and identify a key conserved cysteine residue in a PDE3-specific loop that is essential for the observed copper-dependent lipolytic phenotype. PMID:27272565

  13. Additive monitoring and interactions during copper electroprocessing

    NASA Astrophysics Data System (ADS)

    Collins, Dale Wade

    The electrochemical deposition of copper has been a major focus of research for decades. Renewed interest in copper electroplating is not limited to the copper producers but is also a major concern of semiconductor manufacturers. The focus on copper electrochemistry by the semiconductor manufacturers has increased since IBM's announcement in 1997 that copper will be used for metallization in high speed/power semiconductors [1--3]. The desire to use copper instead of aluminum is simply a reflection on copper's superior conductivity (lower RC time constants) and resistance to electromigration (generally proportional to the melting point). This dissertation is the compilation of the research into analytical techniques for monitoring surface-active additives in common sulfuric acid/copper sulfate plating baths. Chronopotentiometric, DC and AC voltammetry were the major analytical techniques used in this research. Several interactions between the additives will also be presented along with their apparent decline in activity. The decline in activity is well known in the industry and is also detected by these methods as presented in chapters 4 and 5. Finally, a systemic approach for monitoring the additive Galactosal, which is commonly used in electrowinning, will be outlined. The monitoring system proposed herein would have to be adjusted for each electrowinning facility because each has a unique chemistry and cell configuration.

  14. NON-UNIFORM COPPER CORROSION: RESEARCH UPDATE

    EPA Science Inventory

    Pinhole leaks due to copper pitting corrosion are a major cause of home plumbing failure. This study documents cases of copper pitting corrosion found in homes supplied by Butler County Environmental Services in Ohio. SEM. XRD, and optical microscopy were used to document pit s...

  15. 21 CFR 73.2647 - Copper powder.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... ADDITIVES EXEMPT FROM CERTIFICATION Cosmetics § 73.2647 Copper powder. (a) Identity and specifications. The....1647 (a)(1) and (b). (b) Uses and restrictions. Copper powder may be safely used in coloring cosmetics generally, including cosmetics intended for use in the area of the eye, in amounts consistent with...

  16. 21 CFR 73.2647 - Copper powder.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... ADDITIVES EXEMPT FROM CERTIFICATION Cosmetics § 73.2647 Copper powder. (a) Identity and specifications. The....1647 (a)(1) and (b). (b) Uses and restrictions. Copper powder may be safely used in coloring cosmetics generally, including cosmetics intended for use in the area of the eye, in amounts consistent with...

  17. 21 CFR 73.2647 - Copper powder.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... ADDITIVES EXEMPT FROM CERTIFICATION Cosmetics § 73.2647 Copper powder. (a) Identity and specifications. The....1647 (a)(1) and (b). (b) Uses and restrictions. Copper powder may be safely used in coloring cosmetics generally, including cosmetics intended for use in the area of the eye, in amounts consistent with...

  18. Common Sense Copper and RF Guns

    SciTech Connect

    Mulhollan, G.

    2005-01-18

    The purpose of this document is to gather together both fundamental information on copper and on the cleaning and operation of copper in RF gun structures. While incomplete, this is a living document and will be added to and updated as necessary.

  19. POLLUTION ABATEMENT IN A COPPER WIRE MILL

    EPA Science Inventory

    This Capsule Report shows how water consumption in copper wire mills can be reduced by 90%. The reduction was from 200,000 gallons per day to 20,000 gallons per day by chemical rinsing and water reuse. The sulfuric acid pickle was regenerated and high purity metallic copper recov...

  20. A Bright Future for copper electrowinning

    NASA Astrophysics Data System (ADS)

    Moats, Michael; Free, Michael

    2007-10-01

    Over the past 40 years, the copper mining industry has undergone a dramatic shift toward hydrometallurgical extraction of copper at the mine site. This has increased the importance of recovering high-purity copper by electrowinning. High-purity cathode production was achieved by implementing numerous technologies including superior lead-alloy anodes, improved cathode handling and/or stainless steel blanks, better electrolyte control, and advanced tankhouse automation. In the future, it is projected that tankhouses will produce high-quality copper at lower costs using technologies that could include dimensionally stable anodes, alternative anode reactions, innovative cell designs, novel electrolyte circulation systems, and more. This paper reviews existing commercial copper electrowinning technologies and discusses advances that need to be made to implement future technologies.

  1. Molecular Responses of Mouse Macrophages to Copper and Copper Oxide Nanoparticles Inferred from Proteomic Analyses*

    PubMed Central

    Triboulet, Sarah; Aude-Garcia, Catherine; Carrière, Marie; Diemer, Hélène; Proamer, Fabienne; Habert, Aurélie; Chevallet, Mireille; Collin-Faure, Véronique; Strub, Jean-Marc; Hanau, Daniel; Van Dorsselaer, Alain; Herlin-Boime, Nathalie; Rabilloud, Thierry

    2013-01-01

    The molecular responses of macrophages to copper-based nanoparticles have been investigated via a combination of proteomic and biochemical approaches, using the RAW264.7 cell line as a model. Both metallic copper and copper oxide nanoparticles have been tested, with copper ion and zirconium oxide nanoparticles used as controls. Proteomic analysis highlighted changes in proteins implicated in oxidative stress responses (superoxide dismutases and peroxiredoxins), glutathione biosynthesis, the actomyosin cytoskeleton, and mitochondrial proteins (especially oxidative phosphorylation complex subunits). Validation studies employing functional analyses showed that the increases in glutathione biosynthesis and in mitochondrial complexes observed in the proteomic screen were critical to cell survival upon stress with copper-based nanoparticles; pharmacological inhibition of these two pathways enhanced cell vulnerability to copper-based nanoparticles, but not to copper ions. Furthermore, functional analyses using primary macrophages derived from bone marrow showed a decrease in reduced glutathione levels, a decrease in the mitochondrial transmembrane potential, and inhibition of phagocytosis and of lipopolysaccharide-induced nitric oxide production. However, only a fraction of these effects could be obtained with copper ions. In conclusion, this study showed that macrophage functions are significantly altered by copper-based nanoparticles. Also highlighted are the cellular pathways modulated by cells for survival and the exemplified cross-toxicities that can occur between copper-based nanoparticles and pharmacological agents. PMID:23882024

  2. Evaluation of copper resistant bacteria from vineyard soils and mining waste for copper biosorption

    PubMed Central

    Andreazza, R.; Pieniz, S.; Okeke, B.C.; Camargo, F.A.O

    2011-01-01

    Vineyard soils are frequently polluted with high concentrations of copper due application of copper sulfate in order to control fungal diseases. Bioremediation is an efficient process for the treatment of contaminated sites. Efficient copper sorption bacteria can be used for bioremoval of copper from contaminated sites. In this study, a total of 106 copper resistant bacteria were examined for resistance to copper toxicity and biosorption of copper. Eighty isolates (45 from vineyard Mollisol, 35 from Inceptisol) were obtained from EMBRAPA (Empresa Brasileira de Pesquisa Agropecuária) experimental station, Bento Gonçalves, RS, Brazil (29°09′53.92″S and 51°31′39.40″W) and 26 were obtained from copper mining waste from Caçapava do Sul, RS, Brazil (30°29′43.48″S and 53′32′37.87W). Based on resistance to copper toxicity and biosorption, 15 isolates were identified by 16S rRNA gene sequencing. Maximal copper resistance and biosorption at high copper concentration were observed with isolate N2 which removed 80 mg L−1 in 24 h. Contrarily isolate N11 (Bacillus pumilus) displayed the highest specific copper biosorption (121.82 mg/L/OD unit in 24 h). GenBank MEGABLAST analysis revealed that isolate N2 is 99% similar to Staphylococcus pasteuri. Results indicate that several of our isolates have potential use for bioremediation treatment of vineyards soils and mining waste contaminated with high copper concentration. PMID:24031606

  3. Copper and organisms in the Fly River: Linking laboratory testing and field responses to copper

    SciTech Connect

    Smith, R.E.W.; Ahsanullah, M.

    1995-12-31

    The Ok Tedi copper mine has operated in the headwaters of the Fly River system in Papua New Guinea since 1984, and has discharged both tailings and waste rock into the river system. ANCOVA modelling of total catches of fish by standardized effort indicated that the suspended particulate copper concentration was negatively correlated with fish catches, but that the concentrations of suspended solids and dissolved copper were not significantly related to fish catches. Multivariate analyses of fish catch compositions have indicated that the effects caused by dissolved and particulate copper have differed, and that the observed changes in fish catch composition have trended in a direction similar to the particulate copper vectors. The types of catch composition changes do not match the natural assemblages found to be associated with high uncontaminated suspended solids concentrations. Laboratory toxicity testing of native fish, prawns, cladocerans, mayflies, algae and higher plants has demonstrated that the dissolved copper concentrations in the Fly River system ({approximately}up to 20 pg/L) have low bioavailability and would not be expected to cause acute toxicity. Provided the dissolved copper concentration is in this range, particulate copper, as derived from mine wastes, has low acute and chronic toxicity at concentrations up to 8.5 times observed levels. Hypotheses put forward to explain the apparent paradox include: total particulate copper is a better measure of the toxic fraction of dissolved copper than is the concentration of copper passing a 0.45 {micro}m filter; or that fish are able to avoid particulate copper when the associated dissolved copper concentrations are less than the detectable threshold. Behavioral toxicity testing is being used to test these hypotheses.

  4. Electron Percolation In Copper Infiltrated Carbon

    NASA Astrophysics Data System (ADS)

    Krcho, Stanislav

    2015-11-01

    The work describes the dependence of the electrical conductivity of carbon materials infiltrated with copper in a vacuum-pressure autoclave on copper concentration and on the effective pore radius of the carbon skeleton. In comparison with non-infiltrated material the electrical conductivity of copper infiltrated composite increased almost 500 times. If the composite contained less than 7.2 vol% of Cu, a linear dependence of the electrical conductivity upon cupper content was observed. If infiltrated carbon contained more than 7.2 vol% of Cu, the dependence was nonlinear - the curve could be described by a power formula (x - xc)t. This is a typical formula describing the electron percolation process in regions containing higher Cu fraction than the critical one. The maximum measured electrical conductivity was 396 × 104 Ω-1 m-1 for copper concentration 27.6 vol%. Experiments and analysis of the electrical conductivity showed that electron percolation occurred in carbon materials infiltrated by copper when the copper volume exceeded the critical concentration. The analysis also showed a sharp increase of electrical conductivity in composites with copper concentration higher than the threshold, where the effective radius of carbon skeleton pores decreased to 350 nanometres.

  5. Redox control of copper homeostasis in cyanobacteria

    PubMed Central

    López-Maury, Luis; Giner-Lamia, Joaquín; Florencio, Francisco J.

    2012-01-01

    Copper is essential for all living organisms but is toxic when present in excess. Therefore organisms have developed homeostatic mechanism to tightly regulate its cellular concentration. In a recent study we have shown that CopRS two-component system is essential for copper resistance in the cyanobacterium Synechocystis sp PCC 6803. This two-component regulates expression of a heavy-metal RND type copper efflux system (encoded by copBAC) as well as its own expression (in the copMRS operon) in response to an excess of copper in the media. We have also observed that both operons are induced under condition that reduces the photosynthetic electron flow and this induction depends on the presence of the copper-protein, plastocyanin. These findings, together with CopS localization to the thylakoid membrane and its periplasmic domain being able to bind copper directly, suggest that CopS could be involved in copper detection in both the periplasm and the thylakoid lumen. PMID:23073008

  6. Electrochromism in copper oxide thin films

    SciTech Connect

    Richardson, T.J.; Slack, J.L.; Rubin, M.D.

    2000-08-15

    Transparent thin films of copper(I) oxide prepared on conductive SnO2:F glass substrates by anodic oxidation of sputtered copper films or by direct electrodeposition of Cu2O transformed reversibly to opaque metallic copper films when reduced in alkaline electrolyte. In addition, the same Cu2O films transform reversibly to black copper(II) oxide when cycled at more anodic potentials. Copper oxide-to-copper switching covered a large dynamic range, from 85% and 10% photopic transmittance, with a coloration efficiency of about 32 cm2/C. Gradual deterioration of the switching range occurred over 20 to 100 cycles. This is tentatively ascribed to coarsening of the film and contact degradation caused by the 65% volume change on conversion of Cu to Cu2O. Switching between the two copper oxides (which have similar volumes) was more stable and more efficient (CE = 60 cm2/C), but covered a smaller transmittance range (60% to 44% T). Due to their large electrochemical storage capacity and tolerance for alkaline electrolytes, these cathodically coloring films may be useful as counter electrodes for anodically coloring electrode films such as nickel oxide or metal hydrides.

  7. A cooling water system copper corrosion study

    SciTech Connect

    Pulkrabek, J.W.

    1998-07-01

    The plant has four units that have been operating normally for 12--33 years. Two of the units are 70 MW sister units that have copper alloy once-through condensers. The other two units are 350 MW and 500 MW units with copper alloy condensers and cooling towers. No cooling water related tube leaks had been experienced. Until 1993, the only chemicals used were sulfuric acid for pH control of the cooling tower systems and chlorine for biological control. The units were chlorinated for one hour per day per condenser. In early July 1992, their copper grab sample at the plant discharge to the river exceeded the weekly environmental limit. In fact, it was so high that there was a slim chance of coming in under their monthly average copper limit unless something was done quickly. The result of this incident was an extensive study of their plant wastewater and cooling systems. The study revealed that the elevated copper problem had existed sporadically for several years. Initially, copper control was achieved by altering the wastewater treatment processes and cooling tower blowdown flow path. Two extended trials, one with tolyltriazole (TTA) and one with a chemically modified benzotriazole (BZT) were performed. Optimal control of copper corrosion was eventually achieved by the application of a TTA treatment program in which the feed rates are adjusted based on on-line corrosion monitoring measurements. This report documents experiences and results over the past six years.

  8. 49 CFR 192.125 - Design of copper pipe.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 3 2011-10-01 2011-10-01 false Design of copper pipe. 192.125 Section 192.125... BY PIPELINE: MINIMUM FEDERAL SAFETY STANDARDS Pipe Design § 192.125 Design of copper pipe. (a) Copper... hard drawn. (b) Copper pipe used in service lines must have wall thickness not less than that...

  9. 19 CFR 10.98 - Copper-bearing fluxing material.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 19 Customs Duties 1 2013-04-01 2013-04-01 false Copper-bearing fluxing material. 10.98 Section 10... Material § 10.98 Copper-bearing fluxing material. (a) For the purpose of this section, ores usable as a... copper. (b) (c) There shall be filed in connection with the entry of such copper-bearing ores, either...

  10. 49 CFR 192.125 - Design of copper pipe.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 49 Transportation 3 2013-10-01 2013-10-01 false Design of copper pipe. 192.125 Section 192.125... BY PIPELINE: MINIMUM FEDERAL SAFETY STANDARDS Pipe Design § 192.125 Design of copper pipe. (a) Copper... hard drawn. (b) Copper pipe used in service lines must have wall thickness not less than that...