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Sample records for mainstream silicon carbide

  1. Correlated Strontium and Barium Isotopic Compositions of Acid-cleaned Single Mainstream Silicon Carbides from Murchison

    NASA Astrophysics Data System (ADS)

    Liu, Nan; Savina, Michael R.; Gallino, Roberto; Davis, Andrew M.; Bisterzo, Sara; Gyngard, Frank; Käppeler, Franz; Cristallo, Sergio; Dauphas, Nicolas; Pellin, Michael J.; Dillmann, Iris

    2015-04-01

    We present strontium, barium, carbon, and silicon isotopic compositions of 61 acid-cleaned presolar SiC grains from Murchison. Comparison with previous data shows that acid washing is highly effective in removing both strontium and barium contamination. For the first time, by using correlated 88Sr/86Sr and 138Ba/136Ba ratios in mainstream SiC grains, we are able to resolve the effect of 13C concentration from that of 13C-pocket mass on s-process nucleosynthesis, which points toward the existence of large 13C pockets with low 13C concentrations in asymptotic giant branch stars. The presence of such large 13C pockets with a variety of relatively low 13C concentrations seems to require multiple mixing processes in parent asymptotic giant branch stars of mainstream SiC grains.

  2. Isotopic compositions of s-process elements in acid-cleaned mainstream presolar silicon carbide

    NASA Astrophysics Data System (ADS)

    Liu, Nan

    Pristine meteorites contain ancient stellar relicts that survived destructions in the early solar system. Isotopic studies of these presolar grains have proven to be a unique method to understand various known and unknown nucleosynthetic processes occurred in their parent stars. Previous studies of isotopic compositions of heavy elements in mainstream SiC grains from low-mass asymptotic giant branch (AGB) stars reported contamination from solar system materials with normal isotopic compositions on grain surfaces and prevented the authors from obtaining the pure nucleosynthetic isotopic signature from stars. In addition, in these previous studies uncertainties in the major neutron source 13C within the 13C-pocket were underestimated because only the 13C mass fraction was considered as a parameter with the 13C-pocket mass and the 13C profile fixed in model calculations. The oversimplified treatment of the 13C-pocket mainly resulted from the fact that it was unclear if there exists any tracer to distinguish different effects of the 13C concentration, the 13C-pocket mass, and the 13C profile within the 13C-pocket. To address these issues, we acid-cleaned all the presolar SiC grains used in this study after their separation from the bulk Murchison meteorite. In addition, we chose to measure strontium and barium isotopic compositions in these acid-cleaned SiC grains, because both elements sit at the first and second s-process peaks along the s-process path, and are sensitive to varying parameters for the s-process in model calculations. By comparing our new acid-cleaned grain data with single grain data from previous studies for barium isotopes, we conclude that the acid-cleaning procedure is quite effective in removing surface barium contamination. For the first time, we find that model predictions for 138Ba/ 136Ba are sensitive to all three variables of the 13C-pocket adopted in AGB model calculations. In order to match the low 138Ba/ 136Ba values in a minor group of

  3. Barium Isotopic Composition of Mainstream Silicon Carbides from Murchison: Constraints for s-process Nucleosynthesis in Asymptotic Giant Branch Stars

    NASA Astrophysics Data System (ADS)

    Liu, Nan; Savina, Michael R.; Davis, Andrew M.; Gallino, Roberto; Straniero, Oscar; Gyngard, Frank; Pellin, Michael J.; Willingham, David G.; Dauphas, Nicolas; Pignatari, Marco; Bisterzo, Sara; Cristallo, Sergio; Herwig, Falk

    2014-05-01

    We present barium, carbon, and silicon isotopic compositions of 38 acid-cleaned presolar SiC grains from Murchison. Comparison with previous data shows that acid washing is highly effective in removing barium contamination. Strong depletions in δ(138Ba/136Ba) values are found, down to -400‰, which can only be modeled with a flatter 13C profile within the 13C pocket than is normally used. The dependence of δ(138Ba/136Ba) predictions on the distribution of 13C within the pocket in asymptotic giant branch (AGB) models allows us to probe the 13C profile within the 13C pocket and the pocket mass in AGB stars. In addition, we provide constraints on the 22Ne(α, n)25Mg rate in the stellar temperature regime relevant to AGB stars, based on δ(134Ba/136Ba) values of mainstream grains. We found two nominally mainstream grains with strongly negative δ(134Ba/136Ba) values that cannot be explained by any of the current AGB model calculations. Instead, such negative values are consistent with the intermediate neutron capture process (i process), which is activated by the very late thermal pulse during the post-AGB phase and characterized by a neutron density much higher than the s process. These two grains may have condensed around post-AGB stars. Finally, we report abundances of two p-process isotopes, 130Ba and 132Ba, in single SiC grains. These isotopes are destroyed in the s process in AGB stars. By comparing their abundances with respect to that of 135Ba, we conclude that there is no measurable decay of 135Cs (t 1/2 = 2.3 Ma) to 135Ba in individual SiC grains, indicating condensation of barium, but not cesium into SiC grains before 135Cs decayed.

  4. Barium isotopic composition of mainstream silicon carbides from Murchison: Constraints for s-process nucleosynthesis in asymptotic giant branch stars

    SciTech Connect

    Liu, Nan; Davis, Andrew M.; Pellin, Michael J.; Dauphas, Nicolas; Savina, Michael R.; Gallino, Roberto; Bisterzo, Sara; Straniero, Oscar; Cristallo, Sergio; Gyngard, Frank; Willingham, David G.; Pignatari, Marco; Herwig, Falk

    2014-05-01

    We present barium, carbon, and silicon isotopic compositions of 38 acid-cleaned presolar SiC grains from Murchison. Comparison with previous data shows that acid washing is highly effective in removing barium contamination. Strong depletions in δ({sup 138}Ba/{sup 136}Ba) values are found, down to –400‰, which can only be modeled with a flatter {sup 13}C profile within the {sup 13}C pocket than is normally used. The dependence of δ({sup 138}Ba/{sup 136}Ba) predictions on the distribution of {sup 13}C within the pocket in asymptotic giant branch (AGB) models allows us to probe the {sup 13}C profile within the {sup 13}C pocket and the pocket mass in AGB stars. In addition, we provide constraints on the {sup 22}Ne(α, n){sup 25}Mg rate in the stellar temperature regime relevant to AGB stars, based on δ({sup 134}Ba/{sup 136}Ba) values of mainstream grains. We found two nominally mainstream grains with strongly negative δ({sup 134}Ba/{sup 136}Ba) values that cannot be explained by any of the current AGB model calculations. Instead, such negative values are consistent with the intermediate neutron capture process (i process), which is activated by the very late thermal pulse during the post-AGB phase and characterized by a neutron density much higher than the s process. These two grains may have condensed around post-AGB stars. Finally, we report abundances of two p-process isotopes, {sup 130}Ba and {sup 132}Ba, in single SiC grains. These isotopes are destroyed in the s process in AGB stars. By comparing their abundances with respect to that of {sup 135}Ba, we conclude that there is no measurable decay of {sup 135}Cs (t {sub 1/2} = 2.3 Ma) to {sup 135}Ba in individual SiC grains, indicating condensation of barium, but not cesium into SiC grains before {sup 135}Cs decayed.

  5. Silicon carbide ceramic production

    NASA Technical Reports Server (NTRS)

    Suzuki, K.; Shinohara, N.

    1984-01-01

    A method to produce sintered silicon carbide ceramics in which powdery carbonaceous components with a dispersant are mixed with silicon carbide powder, shaped as required with or without drying, and fired in nonoxidation atmosphere is described. Carbon black is used as the carbonaceous component.

  6. Improved toughness of silicon carbide

    NASA Technical Reports Server (NTRS)

    Palm, J. A.

    1976-01-01

    Impact energy absorbing layers (EALs) comprised of partially densified silicon carbide were formed in situ on fully sinterable silicon carbide substrates. After final sintering, duplex silicon carbide structures resulted which were comprised of a fully sintered, high density silicon carbide substrate or core, overlayed with an EAL of partially sintered silicon carbide integrally bonded to its core member. Thermal cycling tests proved such structures to be moderately resistant to oxidation and highly resistant to thermal shock stresses. The strength of the developed structures in some cases exceeded but essentially it remained the same as the fully sintered silicon carbide without the EAL. Ballistic impact tests indicated that substantial improvements in the toughness of sintered silicon carbide were achieved by the use of the partially densified silicon carbide EALs.

  7. Silicon carbide thyristor

    NASA Technical Reports Server (NTRS)

    Edmond, John A. (Inventor); Palmour, John W. (Inventor)

    1996-01-01

    The SiC thyristor has a substrate, an anode, a drift region, a gate, and a cathode. The substrate, the anode, the drift region, the gate, and the cathode are each preferably formed of silicon carbide. The substrate is formed of silicon carbide having one conductivity type and the anode or the cathode, depending on the embodiment, is formed adjacent the substrate and has the same conductivity type as the substrate. A drift region of silicon carbide is formed adjacent the anode or cathode and has an opposite conductivity type as the anode or cathode. A gate is formed adjacent the drift region or the cathode, also depending on the embodiment, and has an opposite conductivity type as the drift region or the cathode. An anode or cathode, again depending on the embodiment, is formed adjacent the gate or drift region and has an opposite conductivity type than the gate.

  8. Silicon nitride/silicon carbide composite powders

    DOEpatents

    Dunmead, Stephen D.; Weimer, Alan W.; Carroll, Daniel F.; Eisman, Glenn A.; Cochran, Gene A.; Susnitzky, David W.; Beaman, Donald R.; Nilsen, Kevin J.

    1996-06-11

    Prepare silicon nitride-silicon carbide composite powders by carbothermal reduction of crystalline silica powder, carbon powder and, optionally, crystalline silicon nitride powder. The crystalline silicon carbide portion of the composite powders has a mean number diameter less than about 700 nanometers and contains nitrogen. The composite powders may be used to prepare sintered ceramic bodies and self-reinforced silicon nitride ceramic bodies.

  9. Silicon carbide reinforced silicon carbide composite

    NASA Technical Reports Server (NTRS)

    Lau, Sai-Kwing (Inventor); Calandra, Salvatore J. (Inventor); Ohnsorg, Roger W. (Inventor)

    2001-01-01

    This invention relates to a process comprising the steps of: a) providing a fiber preform comprising a non-oxide ceramic fiber with at least one coating, the coating comprising a coating element selected from the group consisting of carbon, nitrogen, aluminum and titanium, and the fiber having a degradation temperature of between 1400.degree. C. and 1450.degree. C., b) impregnating the preform with a slurry comprising silicon carbide particles and between 0.1 wt % and 3 wt % added carbon c) providing a cover mix comprising: i) an alloy comprising a metallic infiltrant and the coating element, and ii) a resin, d) placing the cover mix on at least a portion of the surface of the porous silicon carbide body, e) heating the cover mix to a temperature between 1410.degree. C. and 1450.degree. C. to melt the alloy, and f) infiltrating the fiber preform with the melted alloy for a time period of between 15 minutes and 240 minutes, to produce a ceramic fiber reinforced ceramic composite.

  10. Composition Comprising Silicon Carbide

    NASA Technical Reports Server (NTRS)

    Mehregany, Mehran (Inventor); Zorman, Christian A. (Inventor); Fu, Xiao-An (Inventor); Dunning, Jeremy L. (Inventor)

    2012-01-01

    A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

  11. Improved toughness of silicon carbide

    NASA Technical Reports Server (NTRS)

    Palm, J. A.

    1975-01-01

    Several techniques were employed to apply or otherwise form porous layers of various materials on the surface of hot-pressed silicon carbide ceramic. From mechanical properties measurements and studies, it was concluded that although porous layers could be applied to the silicon carbide ceramic, sufficient damage was done to the silicon carbide surface by the processing required so as to drastically reduce its mechanical strength. It was further concluded that there was little promise of success in forming an effective energy absorbing layer on the surface of already densified silicon carbide ceramic that would have the mechanical strength of the untreated or unsurfaced material. Using a process for the pressureless sintering of silicon carbide powders it was discovered that porous layers of silicon carbide could be formed on a dense, strong silicon carbide substrate in a single consolidation process.

  12. Modified silicon carbide whiskers

    DOEpatents

    Tiegs, T.N.; Lindemer, T.B.

    1991-05-21

    Silicon carbide whisker-reinforced ceramic composites are fabricated in a highly reproducible manner by beneficating the surfaces of the silicon carbide whiskers prior to their usage in the ceramic composites. The silicon carbide whiskers which contain considerable concentrations of surface oxides and other impurities which interact with the ceramic composite material to form a chemical bond are significantly reduced so that only a relatively weak chemical bond is formed between the whisker and the ceramic material. Thus, when the whiskers interact with a crack propagating into the composite the crack is diverted or deflected along the whisker-matrix interface due to the weak chemical bonding so as to deter the crack propagation through the composite. The depletion of the oxygen-containing compounds and other impurities on the whisker surfaces and near surface region is effected by heat treating the whiskers in a suitable oxygen sparging atmosphere at elevated temperatures. Additionally, a sedimentation technique may be utilized to remove whiskers which suffer structural and physical anomalies which render them undesirable for use in the composite. Also, a layer of carbon may be provided on the surface of the whiskers to further inhibit chemical bonding of the whiskers to the ceramic composite material.

  13. Modified silicon carbide whiskers

    DOEpatents

    Tiegs, Terry N.; Lindemer, Terrence B.

    1991-01-01

    Silicon carbide whisker-reinforced ceramic composites are fabricated in a highly reproducible manner by beneficating the surfaces of the silicon carbide whiskers prior to their usage in the ceramic composites. The silicon carbide whiskers which contain considerable concentrations of surface oxides and other impurities which interact with the ceramic composite material to form a chemical bond are significantly reduced so that only a relatively weak chemical bond is formed between the whisker and the ceramic material. Thus, when the whiskers interact with a crack propagating into the composite the crack is diverted or deflected along the whisker-matrix interface due to the weak chemical bonding so as to deter the crack propagation through the composite. The depletion of the oxygen-containing compounds and other impurities on the whisker surfaces and near surface region is effected by heat treating the whiskers in a suitable oxygen sparaging atmosphere at elevated temperatures. Additionally, a sedimentation technique may be utilized to remove whiskers which suffer structural and physical anomalies which render them undesirable for use in the composite. Also, a layer of carbon may be provided on the surface of the whiskers to further inhibit chemical bonding of the whiskers to the ceramic composite material.

  14. Silicon carbide sewing thread

    NASA Technical Reports Server (NTRS)

    Sawko, Paul M. (Inventor)

    1995-01-01

    Composite flexible multilayer insulation systems (MLI) were evaluated for thermal performance and compared with currently used fibrous silica (baseline) insulation system. The systems described are multilayer insulations consisting of alternating layers of metal foil and scrim ceramic cloth or vacuum metallized polymeric films quilted together using ceramic thread. A silicon carbide thread for use in the quilting and the method of making it are also described. These systems provide lightweight thermal insulation for a variety of uses, particularly on the surface of aerospace vehicles subject to very high temperatures during flight.

  15. Silicon Carbide Electronic Devices

    NASA Technical Reports Server (NTRS)

    Neudeck, P. G.

    2001-01-01

    The status of emerging silicon carbide (SiC) widebandgap semiconductor electronics technology is briefly surveyed. SiC-based electronic devices and circuits are being developed for use in high-temperature, high-power, and/or high-radiation conditions under which conventional semiconductors cannot function. Projected performance benefits of SiC electronics are briefly illustrated for several applications. However, most of these operational benefits of SiC have yet to be realized in actual systems, primarily owing to the fact that the growth techniques of SiC crystals are relatively immature and device fabrication technologies are not yet sufficiently developed to the degree required for widespread, reliable commercial use. Key crystal growth and device fabrication issues that limit the performance and capability of high-temperature and/or high-power SiC electronics are identified. The electrical and material quality differences between emerging SiC and mature silicon electronics technology are highlighted.

  16. Hydrogen-silicon carbide interactions

    NASA Technical Reports Server (NTRS)

    Eckel, Andrew J.; Jacobson, Nathan S.; Misra, Ajay K.; Humphrey, Donald L.

    1989-01-01

    A study of the thermochemistry and kinetics of hydrogen environmental attack of silicon carbide was conducted for temperatures in the range from 1100 C to 1400 C. Thermodynamic maps based on the parameters of pressure and oxygen/moisture content were constructed. With increasing moisture levels, four distinct regions of attack were identified. Each region is defined by the thermodynamically stable solid phases. The theoretically stable solid phases of Region 1 are silicon carbide and silicon. Experimental evidence is provided to support this thermodynamic prediction. Silicon carbide is the single stable solid phase in Region 2. Active attack of the silicon carbide in this region occurs by the formation of gases of SiO, CO, CH4, SiH4, and SiH. Analysis of the kinetics of reaction for Region 2 at 1300 C show the attack of the silicon carbide to be controlled by gas phase diffusion of H2O to the sample. Silicon carbide and silica are the stable phases common to Regions 3 and 4. These two regions are characterized by the passive oxidation of silicon carbide and formation of a protective silica layer.

  17. Hydrogen-silicon carbide interactions

    NASA Technical Reports Server (NTRS)

    Eckel, Andrew J.; Misra, Ajay K.; Humphrey, Donald L.; Jacobson, Nathan S.

    1990-01-01

    A study of the thermochemistry and kinetics of hydrogen environmental attack of silicon carbide was conducted for temperatures in the range from 1100 C to 1400 C. Thermodynamics maps based on the parameters of pressure and oxygen/moisture content were constructed. With increasing moisture levels, four distinct regions of attack were identified. Each region is defined by the thermodynamically stable solid phases. The theoretically stable solid phases of region 1 are silicon carbide and silicon. Experimental evidence is provided to support this thermodynamic prediction. Silicone carbide is the single stable solid phase in region 2. Active attack of the silicon carbide in this region occurs by the formation of gases of SiO, CO, CH4, SiH4 and SiH. Analyses of the kinetics of reaction for region 2 at 1300 C show the attack of the silicon carbide to be controlled by gas phase diffusion of H2O to the sample. Silicon carbide and silica are the stable phases common to regions 3 and 4. These two regions are characterized by the passive oxidation of silicon carbide and formation of a protective silica layer.

  18. Silicon Carbide Growth

    NASA Technical Reports Server (NTRS)

    2005-01-01

    Andrew Trunek has focused on supporting the Sic team through the growth of Sic crystals, making observations and conducting research that meets the collective needs and requirements of the team while fulfilling program commitments. Cancellation of the Ultra Efficient Engine Technology (UEET) program has had a significant negative impact on resources and research goals. This report highlights advancements and achievements made with this cooperative agreement over the past year. NASA Glenn Research Center (GRC) continues to make advances in silicon carbide (SiC) research during the past year. Step free surfaces were used as substrates for the deposition of GaN epilayers that yielded very low dislocation densities. Defect free 3C- SiC was successfully nucleated on step free mesas and test diodes were fabricated. Web growth techniques were used to increase the usable surface area of dislocation free SiC by approximately equal to 40%. The greatest advancement has been attained on stepped surfaces of SiC. A metrology standard was developed using high temperature etching techniques titled "Nanometer Step Height Standard". This development culminated in being recognized for a 2004 R&D100 award and the process to produce the steps received a NASA Space Act award.

  19. Palladium interaction with silicon carbide

    NASA Astrophysics Data System (ADS)

    Gentile, M.; Xiao, P.; Abram, T.

    2015-07-01

    In this work the palladium interaction with silicon carbide is investigated by means of complementary analytical techniques such as thermogravimetry (TG), differential scanning calorimetry (DSC), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). Thermoscans were carried out on pellets of palladium, α-SiC and β-SiC high purity powders in the temperature range comprised between 293 K and 1773 K, in order to study the effect of temperature on the palladium-silicon carbide reaction. Thermoscans of α-SiC pellets containing 5 at.%Pd show that during differential calorimetry scans three exothermic peaks occurred at 773 K, 1144 K and 1615 K, while thermoscans of β-SiC pellets containing 3 at.%Pd and 5 at.%Pd do not show peaks. For the pellet α-SiC-5 at.%Pd XRD spectra reveal that the first peak is associated with the formation of Pd3Si and SiO2 phases, while the second peak and the third peak are correlated with the formation of Pd2Si phase and the active oxidation of silicon carbide respectively. Thermogravimetry scans show weight gain and weight loss peaks due to the SiO2 phase formation and the active oxidation. Additionally XPS fittings reveal the development of SiCxOy phase during the first exothermic peak up to the temperature of 873 K. The experimental data reveals that alpha silicon carbide is attacked by palladium at lower temperatures than beta silicon carbide and the reaction mechanism between silicon carbide and palladium is strongly affected by silicon carbide oxidation.

  20. Diamond-silicon carbide composite

    DOEpatents

    Qian, Jiang; Zhao, Yusheng

    2006-06-13

    Fully dense, diamond-silicon carbide composites are prepared from ball-milled microcrystalline diamond/amorphous silicon powder mixture. The ball-milled powder is sintered (P=5–8 GPa, T=1400K–2300K) to form composites having high fracture toughness. A composite made at 5 GPa/1673K had a measured fracture toughness of 12 MPa.dot.m1/2. By contrast, liquid infiltration of silicon into diamond powder at 5 GPa/1673K produces a composite with higher hardness but lower fracture toughness. X-ray diffraction patterns and Raman spectra indicate that amorphous silicon is partially transformed into nanocrystalline silicon at 5 GPa/873K, and nanocrystalline silicon carbide forms at higher temperatures.

  1. Porous silicon carbide (SIC) semiconductor device

    NASA Technical Reports Server (NTRS)

    Shor, Joseph S. (Inventor); Kurtz, Anthony D. (Inventor)

    1996-01-01

    Porous silicon carbide is fabricated according to techniques which result in a significant portion of nanocrystallites within the material in a sub 10 nanometer regime. There is described techniques for passivating porous silicon carbide which result in the fabrication of optoelectronic devices which exhibit brighter blue luminescence and exhibit improved qualities. Based on certain of the techniques described porous silicon carbide is used as a sacrificial layer for the patterning of silicon carbide. Porous silicon carbide is then removed from the bulk substrate by oxidation and other methods. The techniques described employ a two-step process which is used to pattern bulk silicon carbide where selected areas of the wafer are then made porous and then the porous layer is subsequently removed. The process to form porous silicon carbide exhibits dopant selectivity and a two-step etching procedure is implemented for silicon carbide multilayers.

  2. Anisotropic Tribological Properties of Silicon Carbide

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1980-01-01

    The anisotropic friction, deformation and fracture behavior of single crystal silicon carbide surfaces were investigated in two categories. The categories were called adhesive and abrasive wear processes, respectively. In the adhesive wear process, the adhesion, friction and wear of silicon carbide were markedly dependent on crystallographic orientation. The force to reestablish the shearing fracture of adhesive bond at the interface between silicon carbide and metal was the lowest in the preferred orientation of silicon carbide slip system. The fracturing of silicon carbide occurred near the adhesive bond to metal and it was due to primary cleavages of both prismatic (10(-1)0) and basal (0001) planes.

  3. Ultrasonic characterization of microwave joined silicon carbide/silicon carbide

    SciTech Connect

    House, M.B.; Day, P.S.

    1997-05-01

    High frequency (50--150 MHz), ultrasonic immersion testing has been used to characterize the surface and interfacial joint conditions of microwave bonded, monolithic silicon carbide (SiC) materials. The high resolution ultrasonic C-scan images point to damage accumulation after thermal cycling. Image processing was used to study the effects of the thermal cycling on waveform shape, amplitude and distribution. Such information is useful for concurrently engineering material fabrication processes and suitable nondestructive test procedures.

  4. Silicon carbide semiconductor technology for high temperature and radiation environments

    NASA Technical Reports Server (NTRS)

    Matus, Lawrence G.

    1993-01-01

    Viewgraphs on silicon carbide semiconductor technology and its potential for enabling electronic devices to function in high temperature and high radiation environments are presented. Topics covered include silicon carbide; sublimation growth of 6H-SiC boules; SiC chemical vapor deposition reaction system; 6H silicon carbide p-n junction diode; silicon carbide MOSFET; and silicon carbide JFET radiation response.

  5. Methods for producing silicon carbide fibers

    DOEpatents

    Garnier, John E.; Griffith, George W.

    2016-03-01

    Methods of producing silicon carbide fibers. The method comprises reacting a continuous carbon fiber material and a silicon-containing gas in a reaction chamber at a temperature ranging from approximately 1500.degree. C. to approximately 2000.degree. C. A partial pressure of oxygen in the reaction chamber is maintained at less than approximately 1.01.times.10.sup.2 Pascal to produce continuous alpha silicon carbide fibers. Continuous alpha silicon carbide fibers and articles formed from the continuous alpha silicon carbide fibers are also disclosed.

  6. Silicon carbide fibers and articles including same

    DOEpatents

    Garnier, John E; Griffith, George W

    2015-01-27

    Methods of producing silicon carbide fibers. The method comprises reacting a continuous carbon fiber material and a silicon-containing gas in a reaction chamber at a temperature ranging from approximately 1500.degree. C. to approximately 2000.degree. C. A partial pressure of oxygen in the reaction chamber is maintained at less than approximately 1.01.times.10.sup.2 Pascal to produce continuous alpha silicon carbide fibers. Continuous alpha silicon carbide fibers and articles formed from the continuous alpha silicon carbide fibers are also disclosed.

  7. Method for producing silicon nitride/silicon carbide composite

    DOEpatents

    Dunmead, Stephen D.; Weimer, Alan W.; Carroll, Daniel F.; Eisman, Glenn A.; Cochran, Gene A.; Susnitzky, David W.; Beaman, Donald R.; Nilsen, Kevin J.

    1996-07-23

    Silicon carbide/silicon nitride composites are prepared by carbothermal reduction of crystalline silica powder, carbon powder and optionally crsytalline silicon nitride powder. The crystalline silicon carbide portion of the composite has a mean number diameter less than about 700 nanometers and contains nitrogen.

  8. Polytype distribution in circumstellar silicon carbide.

    SciTech Connect

    Daulton, T. L.; Bernatowicz, T. J.; Lewis, R. S.; Messenger, S.; Stadermann, F. J.; Amari, S.; Materials Science Division; Naval Research Lab.; Washington Univ.; Univ. of Chicago

    2002-06-07

    The inferred crystallographic class of circumstellar silicon carbide based on astronomical infrared spectra is controversial. We have directly determined the polytype distribution of circumstellar SiC from transmission electron microscopy of presolar silicon carbide from the Murchison carbonaceous meteorite. Only two polytypes (of a possible several hundred) were observed: cubic 3C and hexagonal 2H silicon carbide and their intergrowths. We conclude that this structural simplicity is a direct consequence of the low pressures in circumstellar outflows and the corresponding low silicon carbide condensation temperatures.

  9. Polytype distribution in circumstellar silicon carbide.

    PubMed

    Daulton, T L; Bernatowicz, T J; Lewis, R S; Messenger, S; Stadermann, F J; Amari, S

    2002-06-01

    The inferred crystallographic class of circumstellar silicon carbide based on astronomical infrared spectra is controversial. We have directly determined the polytype distribution of circumstellar SiC from transmission electron microscopy of presolar silicon carbide from the Murchison carbonaceous meteorite. Only two polytypes (of a possible several hundred) were observed: cubic 3C and hexagonal 2H silicon carbide and their intergrowths. We conclude that this structural simplicity is a direct consequence of the low pressures in circumstellar outflows and the corresponding low silicon carbide condensation temperatures. PMID:12052956

  10. Silicon Carbide Nanotube Synthesized

    NASA Technical Reports Server (NTRS)

    Lienhard, Michael A.; Larkin, David J.

    2003-01-01

    Carbon nanotubes (CNTs) have generated a great deal of scientific and commercial interest because of the countless envisioned applications that stem from their extraordinary materials properties. Included among these properties are high mechanical strength (tensile and modulus), high thermal conductivity, and electrical properties that make different forms of single-walled CNTs either conducting or semiconducting, and therefore, suitable for making ultraminiature, high-performance CNT-based electronics, sensors, and actuators. Among the limitations for CNTs is their inability to survive in high-temperature, harsh-environment applications. Silicon carbon nanotubes (SiCNTs) are being developed for their superior material properties under such conditions. For example, SiC is stable in regards to oxidation in air to temperatures exceeding 1000 C, whereas carbon-based materials are limited to 600 C. The high-temperature stability of SiCNTs is envisioned to enable high-temperature, harsh-environment nanofiber- and nanotube-reinforced ceramics. In addition, single-crystal SiC-based semiconductors are being developed for hightemperature, high-power electronics, and by analogy to CNTs with silicon semiconductors, SiCNTs with single-crystal SiC-based semiconductors may allow high-temperature harsh-environment nanoelectronics, nanosensors, and nanoactuators to be realized. Another challenge in CNT development is the difficulty of chemically modifying the tube walls, which are composed of chemically stable graphene sheets. The chemical substitution of the CNTs walls will be necessary for nanotube self-assembly and biological- and chemical-sensing applications. SiCNTs are expected to have a different multiple-bilayer wall structure, allowing the surface Si atoms to be functionalized readily with molecules that will allow SiCNTs to undergo self-assembly and be compatible with a variety of materials (for biotechnology applications and high-performance fiber-reinforced ceramics).

  11. Process for making silicon carbide reinforced silicon carbide composite

    NASA Technical Reports Server (NTRS)

    Lau, Sai-Kwing (Inventor); Calandra, Salavatore J. (Inventor); Ohnsorg, Roger W. (Inventor)

    1998-01-01

    A process comprising the steps of: a) providing a fiber preform comprising a non-oxide ceramic fiber with at least one coating, the coating comprising a coating element selected from the group consisting of carbon, nitrogen, aluminum and titanium, and the fiber having a degradation temperature of between 1400.degree. C. and 1450.degree. C., b) impregnating the preform with a slurry comprising silicon carbide particles and between 0.1 wt % and 3 wt % added carbon c) providing a cover mix comprising: i) an alloy comprising a metallic infiltrant and the coating element, and ii) a resin, d) placing the cover mix on at least a portion of the surface of the porous silicon carbide body, e) heating the cover mix to a temperature between 1410.degree. C. and 1450.degree. C. to melt the alloy, and f) infiltrating the fiber preform with the melted alloy for a time period of between 15 minutes and 240 minutes, to produce a ceramic fiber reinforced ceramic composite.

  12. Damage kinetics in silicon carbide

    NASA Astrophysics Data System (ADS)

    Pickup, I. M.; Barker, A. K.

    1998-07-01

    Three silicon carbides of similar density and grain size but manufactured via different routes (reaction bonded, pressureless sintered and pressure assisted densification) have been investigated. High speed photography in conjunction with Hopkinson pressure bar compression tests has revealed that not only does the manufacturing route confer a significant difference in failure kinetics but also modifies the phenomenology of failure. Plate impact experiments using lateral and longitudinal manganin stress gauges have been used to study shear strength behaviour of damaged material. Failure waves have been observed in all three materials and characteristically different damaged material shear strength relationships with pressure have been observed.

  13. Preparation of silicon carbide fibers

    DOEpatents

    Wei, G.C.

    1983-10-12

    Silicon carbide fibers suitable for use in the fabrication of dense, high-strength, high-toughness SiC composites or as thermal insulating materials in oxidizing environments are fabricated by a new, simplified method wherein a mixture of short-length rayon fibers and colloidal silica is homogenized in a water slurry. Water is removed from the mixture by drying in air at 120/sup 0/C and the fibers are carbonized by (pyrolysis) heating the mixture to 800 to 1000/sup 0/C in argon. The mixture is subsequently reacted at 1550 to 1900/sup 0/C in argon to yield pure ..beta..-SiC fibers.

  14. Nitride-bonded silicon carbide composite filter

    SciTech Connect

    Thomson, B.N.; DiPietro, S.G.

    1995-12-01

    The objective of this program is to develop and demonstrate an advanced hot gas filter, using ceramic component technology, with enhanced durability to provide increased resistance to thermal fatigue and crack propagation. The material is silicon carbide fiber reinforced nitride bonded silicon carbide.

  15. Material properties of silicon and silicon carbide foams

    NASA Astrophysics Data System (ADS)

    Jacoby, Marc T.; Goodman, William A.

    2005-08-01

    Silicon and silicon carbide foams provide the lightweighting element for Schafer Corporation's silicon and silicon carbide lightweight mirror systems (SLMSTM and SiC-SLMSTM). SLMSTM and SiC-SLMSTM provide the enabling technology for manufacturing lightweight, athermal optical sub-assemblies and instruments. Silicon and silicon carbide foam samples were manufactured and tested under a Schafer-funded Internal Research and Development program in various configurations to obtain mechanical and thermal property data. The results of the mechanical tests that are reported in this paper include Young's modulus, compression strength, tensile strength, Poisson's ratio and vibrational damping. The results of the thermal tests include thermal conductivity and coefficient of thermal expansion.

  16. Colloidal characterization of ultrafine silicon carbide and silicon nitride powders

    NASA Technical Reports Server (NTRS)

    Whitman, Pamela K.; Feke, Donald L.

    1986-01-01

    The effects of various powder treatment strategies on the colloid chemistry of aqueous dispersions of silicon carbide and silicon nitride are examined using a surface titration methodology. Pretreatments are used to differentiate between the true surface chemistry of the powders and artifacts resulting from exposure history. Silicon nitride powders require more extensive pretreatment to reveal consistent surface chemistry than do silicon carbide powders. As measured by titration, the degree of proton adsorption from the suspending fluid by pretreated silicon nitride and silicon carbide powders can both be made similar to that of silica.

  17. Anisotropic tribological properties of silicon carbide

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1981-01-01

    The effects of crystallographic orientation on the tribological properties of single-crystal silicon carbide surfaces in contact with various solids are investigated for adhesive and abrasive wear processes. In the adhesive wear process, the adhesion and wear of silicon carbide is found to be markedly dependent on crystallographic orientation. The force resisting shearing fracture of the adhesive bonds at the interface is lower in preferred crystallographic direction of slip. In the abrasive wear process, the 1 0 -1 0 direction on the basal plane of silicon carbide exhibits the lowest coefficient of friction and the greatest resistance to abrasion.

  18. Converted silicon carbide technology developments for optics

    NASA Astrophysics Data System (ADS)

    Duston, Christopher; Woestman, Ken; Vargas, Hugo; deBlonk, Brett

    2007-09-01

    Silicon carbide structures fabricated by converting near-net-shape graphite preforms via Chemical Vapor Conversion (CVC) phase reaction have long provided improved performance components for electronics processing. In recent years, this same technology has been applied to the fabrication of simple and lightweighted mirrors and is moving into optical bench applications. To support the expanded applications, Poco has further evaluated the material properties of SUPERSiC® silicon carbide, developed technologies to mount silicon carbide mirrors on benches of similar and dissimilar materials, and fabricated complex monolithic geometries using in situ conversion bonding of mating graphite components. Overviews of each of these areas will be presented.

  19. Manufacture of silicon carbide using solar energy

    DOEpatents

    Glatzmaier, Gregory C.

    1992-01-01

    A method is described for producing silicon carbide particles using solar energy. The method is efficient and avoids the need for use of electrical energy to heat the reactants. Finely divided silica and carbon are admixed and placed in a solar-heated reaction chamber for a time sufficient to cause a reaction between the ingredients to form silicon carbide of very small particle size. No grinding of silicon carbide is required to obtain small particles. The method may be carried out as a batch process or as a continuous process.

  20. Improved consolidation of silicon carbide

    NASA Technical Reports Server (NTRS)

    Freedman, M. R.; Millard, M. L.

    1986-01-01

    Alpha silicon carbide powder was consolidated by both dry and wet methods. Dry pressing in a double acting steel die yielded sintered test bars with an average flexural strength of 235.6 MPa with a critical flaw size of approximately 100 micro m. An aqueous slurry pressing technique produced sintered test bars with an average flexural strength of 440.8 MPa with a critical flaw size of approximately 25 micro m. Image analysis revealed a reduction in both pore area and pore size distribution in the slurry pressed sintered test bars. The improvements in the slurry pressed material properties are discussed in terms of reduced agglomeration and improved particle packing during consolidation.

  1. Silicon carbide material sintered bodies manufacturing

    NASA Technical Reports Server (NTRS)

    Suzuki, K.; Shinohara, N.

    1984-01-01

    A method is described for producing a high density silicon carbide sintering substance which contains aluminum oxide. The sintering is done in CO gas atmosphere, which is kept at 2 to 20 atmospheric pressures.

  2. Silicon Carbide Transistor For Detecting Hydrocarbon Gases

    NASA Technical Reports Server (NTRS)

    Shields, Virgil B.; Ryan, Margaret A.; Williams, Roger M.

    1996-01-01

    Proposed silicon carbide variable-potential insulated-gate field-effect transistor specially designed for use in measuring concentrations of hydrocarbon gases. Devices like this prove useful numerous automotive, industrial, aeronautical, and environmental monitoring applications.

  3. Whatever happened to silicon carbide. [semiconductor devices

    NASA Technical Reports Server (NTRS)

    Campbell, R. B.

    1981-01-01

    The progress made in silicon carbide semiconductor devices in the 1955 to 1975 time frame is examined and reasons are given for the present lack of interest in the material. Its physical and chemical properties and methods of preparation are discussed. Fabrication techniques and the characteristics of silicon carbide devices are reviewed. It is concluded that a combination of economic factors and the lack of progress in fabrication techniques leaves no viable market for SiC devices in the near future.

  4. Stabilization of boron carbide via silicon doping

    NASA Astrophysics Data System (ADS)

    Proctor, J. E.; Bhakhri, V.; Hao, R.; Prior, T. J.; Scheler, T.; Gregoryanz, E.; Chhowalla, M.; Giulani, F.

    2015-01-01

    Boron carbide is one of the lightest and hardest ceramics, but its applications are limited by its poor stability against a partial phase separation into separate boron and carbon. Phase separation is observed under high non-hydrostatic stress (both static and dynamic), resulting in amorphization. The phase separation is thought to occur in just one of the many naturally occurring polytypes in the material, and this raises the possibility of doping the boron carbide to eliminate this polytype. In this work, we have synthesized boron carbide doped with silicon. We have conducted a series of characterizations (transmission electron microscopy, scanning electron microscopy, Raman spectroscopy and x-ray diffraction) on pure and silicon-doped boron carbide following static compression to 50 GPa non-hydrostatic pressure. We find that the level of amorphization under static non-hydrostatic pressure is drastically reduced by the silicon doping.

  5. Silicon Carbide Solar Cells Investigated

    NASA Technical Reports Server (NTRS)

    Bailey, Sheila G.; Raffaelle, Ryne P.

    2001-01-01

    The semiconductor silicon carbide (SiC) has long been known for its outstanding resistance to harsh environments (e.g., thermal stability, radiation resistance, and dielectric strength). However, the ability to produce device-quality material is severely limited by the inherent crystalline defects associated with this material and their associated electronic effects. Much progress has been made recently in the understanding and control of these defects and in the improved processing of this material. Because of this work, it may be possible to produce SiC-based solar cells for environments with high temperatures, light intensities, and radiation, such as those experienced by solar probes. Electronics and sensors based on SiC can operate in hostile environments where conventional silicon-based electronics (limited to 350 C) cannot function. Development of this material will enable large performance enhancements and size reductions for a wide variety of systems--such as high-frequency devices, high-power devices, microwave switching devices, and high-temperature electronics. These applications would supply more energy-efficient public electric power distribution and electric vehicles, more powerful microwave electronics for radar and communications, and better sensors and controls for cleaner-burning, more fuel-efficient jet aircraft and automobile engines. The 6H-SiC polytype is a promising wide-bandgap (Eg = 3.0 eV) semiconductor for photovoltaic applications in harsh solar environments that involve high-temperature and high-radiation conditions. The advantages of this material for this application lie in its extremely large breakdown field strength, high thermal conductivity, good electron saturation drift velocity, and stable electrical performance at temperatures as high as 600 C. This behavior makes it an attractive photovoltaic solar cell material for devices that can operate within three solar radii of the Sun.

  6. Direct plasmadynamic synthesis of ultradisperse silicon carbide

    NASA Astrophysics Data System (ADS)

    Sivkov, A. A.; Nikitin, D. S.; Pak, A. Ya.; Rakhmatullin, I. A.

    2013-01-01

    Ultradisperse cubic silicon carbide (β-SiC) has been obtained by direct plasmadynamic synthesis in pulsed supersonic carbon-silicon plasma jet incident on a copper obstacle in argon atmosphere. The powdered product has a high content of β-SiC in the form of single crystals with average size of about 100 nm and nearly perfect crystallographic habit.

  7. Diamond-silicon carbide composite and method

    DOEpatents

    Zhao, Yusheng

    2011-06-14

    Uniformly dense, diamond-silicon carbide composites having high hardness, high fracture toughness, and high thermal stability are prepared by consolidating a powder mixture of diamond and amorphous silicon. A composite made at 5 GPa/1673K had a measured fracture toughness of 12 MPam.sup.1/2. By contrast, liquid infiltration of silicon into diamond powder at 5 GPa/1673K produces a composite with higher hardness but lower fracture toughness.

  8. Silicon carbide sintered body manufactured from silicon carbide powder containing boron, silicon and carbonaceous additive

    NASA Technical Reports Server (NTRS)

    Tanaka, Hidehiko

    1987-01-01

    A silicon carbide powder of a 5-micron grain size is mixed with 0.15 to 0.60 wt% mixture of a boron compound, i.e., boric acid, boron carbide (B4C), silicon boride (SiB4 or SiB6), aluminum boride, etc., and an aluminum compound, i.e., aluminum, aluminum oxide, aluminum hydroxide, aluminum carbide, etc., or aluminum boride (AlB2) alone, in such a proportion that the boron/aluminum atomic ratio in the sintered body becomes 0.05 to 0.25 wt% and 0.05 to 0.40 wt%, respectively, together with a carbonaceous additive to supply enough carbon to convert oxygen accompanying raw materials and additives into carbon monoxide.

  9. Method of fabricating porous silicon carbide (SiC)

    NASA Technical Reports Server (NTRS)

    Shor, Joseph S. (Inventor); Kurtz, Anthony D. (Inventor)

    1995-01-01

    Porous silicon carbide is fabricated according to techniques which result in a significant portion of nanocrystallites within the material in a sub 10 nanometer regime. There is described techniques for passivating porous silicon carbide which result in the fabrication of optoelectronic devices which exhibit brighter blue luminescence and exhibit improved qualities. Based on certain of the techniques described porous silicon carbide is used as a sacrificial layer for the patterning of silicon carbide. Porous silicon carbide is then removed from the bulk substrate by oxidation and other methods. The techniques described employ a two-step process which is used to pattern bulk silicon carbide where selected areas of the wafer are then made porous and then the porous layer is subsequently removed. The process to form porous silicon carbide exhibits dopant selectivity and a two-step etching procedure is implemented for silicon carbide multilayers.

  10. Joining of silicon carbide composites for fusion energy applications

    NASA Astrophysics Data System (ADS)

    Lewinsohn, C. A.; Singh, M.; Shibayama, T.; Hinoki, T.; Ando, M.; Katoh, Y.; Kohyama, A.

    2000-12-01

    Joining of silicon carbide based materials has been recognized as one of the enabling technologies for the successful utilization of ceramic components in fusion energy systems. Sintered silicon carbide (Hexoloy SA) and silicon carbide (Hi-Nicalon™) fiber reinforced silicon carbide matrix composites have been joined using reaction forming/bonding based joining technologies. The room- and high-temperature mechanical properties and fractography of ceramic joints have been reported.

  11. Deposition method for producing silicon carbide high-temperature semiconductors

    DOEpatents

    Hsu, George C.; Rohatgi, Naresh K.

    1987-01-01

    An improved deposition method for producing silicon carbide high-temperature semiconductor material comprising placing a semiconductor substrate composed of silicon carbide in a fluidized bed silicon carbide deposition reactor, fluidizing the bed particles by hydrogen gas in a mildly bubbling mode through a gas distributor and heating the substrate at temperatures around 1200.degree.-1500.degree. C. thereby depositing a layer of silicon carbide on the semiconductor substrate.

  12. Silicon carbide, an emerging high temperature semiconductor

    NASA Technical Reports Server (NTRS)

    Matus, Lawrence G.; Powell, J. Anthony

    1991-01-01

    In recent years, the aerospace propulsion and space power communities have expressed a growing need for electronic devices that are capable of sustained high temperature operation. Applications for high temperature electronic devices include development instrumentation within engines, engine control, and condition monitoring systems, and power conditioning and control systems for space platforms and satellites. Other earth-based applications include deep-well drilling instrumentation, nuclear reactor instrumentation and control, and automotive sensors. To meet the needs of these applications, the High Temperature Electronics Program at the Lewis Research Center is developing silicon carbide (SiC) as a high temperature semiconductor material. Research is focussed on developing the crystal growth, characterization, and device fabrication technologies necessary to produce a family of silicon carbide electronic devices and integrated sensors. The progress made in developing silicon carbide is presented, and the challenges that lie ahead are discussed.

  13. Joining of porous silicon carbide bodies

    DOEpatents

    Bates, Carl H.; Couhig, John T.; Pelletier, Paul J.

    1990-05-01

    A method of joining two porous bodies of silicon carbide is disclosed. It entails utilizing an aqueous slip of a similar silicon carbide as was used to form the porous bodies, including the sintering aids, and a binder to initially join the porous bodies together. Then the composite structure is subjected to cold isostatic pressing to form a joint having good handling strength. Then the composite structure is subjected to pressureless sintering to form the final strong bond. Optionally, after the sintering the structure is subjected to hot isostatic pressing to further improve the joint and densify the structure. The result is a composite structure in which the joint is almost indistinguishable from the silicon carbide pieces which it joins.

  14. Varying potential silicon carbide gas sensor

    NASA Technical Reports Server (NTRS)

    Shields, Virgil B. (Inventor); Ryan, Margaret A. (Inventor); Williams, Roger M. (Inventor)

    1997-01-01

    A hydrocarbon gas detection device operates by dissociating or electro-chemically oxidizing hydrocarbons adsorbed to a silicon carbide detection layer. Dissociation or oxidation are driven by a varying potential applied to the detection layer. Different hydrocarbon species undergo reaction at different applied potentials so that the device is able to discriminate among various hydrocarbon species. The device can operate at temperatures between 100.degree. C. and at least 650.degree. C., allowing hydrocarbon detection in hot exhaust gases. The dissociation reaction is detected either as a change in a capacitor or, preferably, as a change of current flow through an FET which incorporates the silicon carbide detection layers. The silicon carbide detection layer can be augmented with a pad of catalytic material which provides a signal without an applied potential. Comparisons between the catalytically produced signal and the varying potential produced signal may further help identify the hydrocarbon present.

  15. Silicon carbide, an emerging high temperature semiconductor

    NASA Astrophysics Data System (ADS)

    Matus, Lawrence G.; Powell, J. Anthony

    In recent years, the aerospace propulsion and space power communities have expressed a growing need for electronic devices that are capable of sustained high temperature operation. Applications for high temperature electronic devices include development instrumentation within engines, engine control, and condition monitoring systems, and power conditioning and control systems for space platforms and satellites. Other earth-based applications include deep-well drilling instrumentation, nuclear reactor instrumentation and control, and automotive sensors. To meet the needs of these applications, the High Temperature Electronics Program at the Lewis Research Center is developing silicon carbide (SiC) as a high temperature semiconductor material. Research is focussed on developing the crystal growth, characterization, and device fabrication technologies necessary to produce a family of silicon carbide electronic devices and integrated sensors. The progress made in developing silicon carbide is presented, and the challenges that lie ahead are discussed.

  16. Liquid phase sintering of silicon carbide

    DOEpatents

    Cutler, R.A.; Virkar, A.V.; Hurford, A.C.

    1989-05-09

    Liquid phase sintering is used to densify silicon carbide based ceramics using a compound comprising a rare earth oxide and aluminum oxide to form liquids at temperatures in excess of 1,600 C. The resulting sintered ceramic body has a density greater than 95% of its theoretical density and hardness in excess of 23 GPa. Boron and carbon are not needed to promote densification and silicon carbide powder with an average particle size of greater than one micron can be densified via the liquid phase process. The sintered ceramic bodies made by the present invention are fine grained and have secondary phases resulting from the liquid phase. 4 figs.

  17. On the sintering of silicon carbide

    NASA Technical Reports Server (NTRS)

    Gugel, E.

    1986-01-01

    This document deals with the sintering of silicon carbide using pressureless sintering. This technique makes it possible to sinter a primarily covalent material to usable densities up to over 98% thD without having to use a high amount of sinter additives as is the case with other non-oxide ceramic materials. The process takes place rapidly, and it is also possible to produce relatively thick-walled structural parts without major problems. This sheds more light on the true characteristics of silicon carbide in one structural part, since there is no second or nearly no second phase. Heat pressing has improved stability.

  18. Liquid phase sintering of silicon carbide

    DOEpatents

    Cutler, Raymond A.; Virkar, Anil V.; Hurford, Andrew C.

    1989-01-01

    Liquid phase sintering is used to densify silicon carbide based ceramics using a compound comprising a rare earth oxide and aluminum oxide to form liquids at temperatures in excess of 1600.degree. C. The resulting sintered ceramic body has a density greater than 95% of its theoretical density and hardness in excess of 23 GPa. Boron and carbon are not needed to promote densification and silicon carbide powder with an average particle size of greater than one micron can be densified via the liquid phase process. The sintered ceramic bodies made by the present invention are fine grained and have secondary phases resulting from the liquid phase.

  19. Tough silicon nitride matrix composites using Textron silicon carbide monofilaments

    SciTech Connect

    Foulds, W.; Lecostaouec, J.F.; Landry, C.; Dipietro, S.; Vasilos, T.

    1989-10-01

    The use of Textron SCS silicon carbide monofilament fibers as a reinforcement for silicon nitride is described. Samples were processed by both chemical vapor infiltration and hot pressing. Mechanical tests were performed in flexure, tension, and in shear. A ballistic test demonstrated high velocity impact toughness. 5 refs.

  20. Design considerations and experimental analysis for silicon carbide power rectifiers

    NASA Astrophysics Data System (ADS)

    Khemka, V.; Patel, R.; Chow, T. P.; Gutmann, R. J.

    1999-10-01

    In this paper we present the investigation of properties of silicon carbide power rectifiers, in particular Schottky, PiN and advanced hybrid power rectifiers such as the trench MOS barrier Schottky rectifier. Analysis of the forward, reverse and switching experimental characteristics are presented and these silicon carbide rectifiers are compared to silicon devices. Silicon carbide Schottky rectifiers are attractive for applications requiring blocking voltage in excess of 100 V as the use of Si is precluded by its large specific on-resistance. Analysis of power dissipation indicates that silicon carbide Schottky rectifiers offer significant improvement over silicon counterparts. Silicon carbide junction rectifiers, on the other hand, are superior to silicon counterparts only for blocking voltage greater than 2000 V. Performance of acceptor (boron) and donor (phosphorus) implanted experimental silicon carbide junction rectifiers are presented and compared. Some of the recent developments in silicon carbide rectifiers have been described and compared with theory and our experimental results. The well established silicon rectifiers theory are often inadequate to describe the characteristics of the experimental silicon carbide junction rectifiers and appropriate generalization of these theories are presented. Experimental trench MOS barrier Schottky rectifiers (TMBS) have demonstrated significant improvement in leakage current compared to planar Schottky devices. Performance of current state-of-the-art silicon carbide rectifiers are far from theoretical predictions. Availability of high-quality silicon carbide crystals is crucial to successful realization of these performance projections.

  1. Tribological properties of sintered polycrystalline and single crystal silicon carbide

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.; Srinivasan, M.

    1982-01-01

    Tribological studies and X-ray photoelectron spectroscopy analyses were conducted with sintered polycrystalline and single crystal silicon carbide surfaces in sliding contact with iron at various temperatures to 1500 C in a vacuum of 30 nPa. The results indicate that there is a significant temperature influence on both the friction properties and the surface chemistry of silicon carbide. The main contaminants on the as received sintered polycrystalline silicon carbide surfaces are adsorbed carbon, oxygen, graphite, and silicon dioxide. The surface revealed a low coefficient of friction. This is due to the presence of the graphite on the surface. At temperatures of 400 to 600 C graphite and copious amount of silicon dioxide were observed on the polycrystalline silicon carbide surface in addition to silicon carbide. At 800 C, the amount of the silicon dioxide decreased rapidly and the silicon carbide type silicon and carbon peaks were at a maximum intensity in the XPS spectra. The coefficients of friction were high in the temperature range 400 to 800 C. Small amounts of carbon and oxygen contaminants were observed on the as received single crystal silicon carbide surface below 250 C. Silicon carbide type silicon and carbon peaks were seen on the silicon carbide in addition to very small amount of graphite and silicon dioxide at temperatures of 450 to 800 C.

  2. Ceramic Fabric Coated With Silicon Carbide

    NASA Technical Reports Server (NTRS)

    Riccitiello, S. R.; Smith, M.; Goldstein, H.; Zimmerman, N.

    1988-01-01

    Material used as high-temperature shell. Ceramic fabric coated with silicon carbide (SiC) serves as tough, heat-resistant covering for other refractory materials. Developed to protect reusable insulating tiles on advanced space transportation systems. New covering makes protective glaze unnecessary. Used on furnace bricks or on insulation for engines.

  3. PWR cores with silicon carbide cladding

    SciTech Connect

    Dobisesky, J. P.; Carpenter, D.; Pilat, E.; Kazimi, M. S.

    2012-07-01

    The feasibility of using silicon carbide rather than Zircaloy cladding, to reach higher power levels and higher discharge burnups in PWRs has been evaluated. A preliminary fuel design using fuel rods with the same dimensions as in the Westinghouse Robust Fuel Assembly but with fuel pellets having 10 vol% central void has been adopted to mitigate the higher fuel temperatures that occur due to the lower thermal conductivity of the silicon carbide and to the persistence of the open clad-pellet gap over most of the fuel life. With this modified fuel design, it is possible to achieve 18 month cycles that meet present-day operating constraints on peaking factor, boron concentration, reactivity coefficients and shutdown margin, while allowing batch average discharge burnups up to 80 MWD/kgU and peak rod burnups up to 100 MWD/kgU. Power uprates of 10% and possibly 20% also appear feasible. For non-uprated cores, the silicon carbide-clad fuel has a clear advantage that increases with increasing discharge burnup. Even for comparable discharge burnups, there is a savings in enriched uranium. Control rod configuration modifications may be required to meet the shutdown margin criterion for the 20% up-rate. Silicon carbide's ability to sustain higher burnups than Zircaloy also allows the design of a licensable two year cycle with only 96 fresh assemblies, avoiding the enriched uranium penalty incurred with use of larger batch sizes due to their excessive leakage. (authors)

  4. High Q silicon carbide microdisk resonator

    SciTech Connect

    Lu, Xiyuan; Lee, Jonathan Y.; Feng, Philip X.-L.; Lin, Qiang

    2014-05-05

    We demonstrate a silicon carbide (SiC) microdisk resonator with optical Q up to 5.12 × 10{sup 4}. The high optical quality, together with the diversity of whispering-gallery modes and the tunability of external coupling, renders SiC microdisk a promising platform for integrated quantum photonics applications.

  5. Reliable Breakdown Obtained in Silicon Carbide Rectifiers

    NASA Technical Reports Server (NTRS)

    Neudeck, Philip G.

    1997-01-01

    The High Temperature Integrated Electronics and Sensor (HTIES) Program at the NASA Lewis Research Center is currently developing silicon carbide (SiC) for use in harsh conditions where silicon, the semiconductor used in nearly all of today's electronics, cannot function. Silicon carbide's demonstrated ability to function under extreme high-temperature, high-power, and/or high-radiation conditions will enable significant improvements to a far-ranging variety of applications and systems. These range from improved high-voltage switching for energy savings in public electric power distribution and electric vehicles, to more powerful microwave electronics for radar and cellular communications, to sensor and controls for cleaner-burning, more fuel-efficient jet aircraft and automobile engines.

  6. Mechanical Properties of Nanoceramic Silicon Carbide

    NASA Astrophysics Data System (ADS)

    Ojo, Ipidapo; Abunaemeh, Malek; Smith, Cydale; Muntele, Claudiu; Ila, Daryush

    2009-03-01

    Generation IV nuclear reactors will use the TRISO fuels, a type of micro fuel particle. It consists of a fuel kernel coated with four layers of isotropic material. One of the materials considered for these layers is silicon carbide ceramic. This lightweight material can maintain chemical and dimensional stability in adverse environments at very high temperatures up to 3000 C, and it is chemically inert. It is widely used as a semiconductor material in electronics because of its high thermo conductivity, high electric field break down strength, and high maximum current density, which makes it more desirable than silicon. Silicon carbide has a very low coefficient of thermal expansion and has no phase transition that would discontinue its thermal expansion. At the Center for Irradiation of Materials (C.I.M.) we are developing a new fabrication process for nanopowdered silicon carbide for TRISO fuel coating purposes. We also study the mechanical properties of the material produced. Among the different test being performed are particle induced X-ray emission (PIXE) an Rutherford backscattering spectroscopy (RBS). The mechanical properties of interest are hardness (measured by Vickers Hardness machine), toughness (measured by the Anstis equation, KIC= 1.6 x 10-2(E/H)^1/2(P/C0^3/2, where P=load, C0=crack length, E=Young's modulus and H=Vickers Hardness), tensile strength and flexural strength (measured by a three point bend test). Results will be presented during the meeting.

  7. Making a Silicon-Nitride/Silicon-Carbide Composite

    NASA Technical Reports Server (NTRS)

    Bhatt, R. T.

    1987-01-01

    Hot pressing and nitriding produce strong fiber/matrix material. Fabrication method developed for processing strong and tough silicon-based ceramic composite material, SiC/RBSN, which consists of reaction-bonded Si3N4 (RBSN) reinforced by continuous-length, high-modulus, high strength silicon carbide (SiC) fibers prepared by chemical-vapor deposition method. Increased toughness and ultimate strength of SiC/RBSN composite makes it potential structural material for advanced heat engines.

  8. Producing Silicon Carbide for Semiconductor Devices

    NASA Technical Reports Server (NTRS)

    Hsu, G. C.; Rohatgi, N. K.

    1986-01-01

    Processes proposed for production of SiC crystals for use in semiconductors operating at temperatures as high as 900 degrees C. Combination of new processes produce silicon carbide chips containing epitaxial layers. Chips of SiC first grown on porous carbon matrices, then placed in fluidized bed, where additional layer of SiC grows. Processes combined to yield complete process. Liquid crystallization process used to make SiC particles or chips for fluidized-bed process.

  9. Acoustic microscopy of silicon carbide materials

    NASA Technical Reports Server (NTRS)

    Khandelwal, P. K.; Heitman, P. W.; Yuhas, D.; Vorres, C. L.

    1982-01-01

    It is shown that scanning laser acoustic microscopy (SLAM) is able to detect such fracture-controlling flaws in dense silicon carbide materials as surface voids, whose diameter-by-depth size is a minimum of 75 by 17 microns in reaction-bonded SiC and 68 by 25 microns in alpha-SiC. Surface conditions such as pitting, which have been found to limit the discernibility of drilled holes, become important when pit and drilled hole sizes become comparable.

  10. Low blow Charpy impact of silicon carbides

    NASA Technical Reports Server (NTRS)

    Abe, H.; Chandan, H. C.; Bradt, R. C.

    1978-01-01

    The room-temperature impact resistance of several commercial silicon carbides was examined using an instrumented pendulum-type machine and Charpy-type specimens. Energy balance compliance methods and fracture toughness approaches, both applicable to other ceramics, were used for analysis. The results illustrate the importance of separating the machine and the specimen energy contributions and confirm the equivalence of KIc and KId. The material's impact energy was simply the specimen's stored elastic strain energy at fracture.

  11. Mechanical properties of Silicon Carbide Nanowires

    NASA Astrophysics Data System (ADS)

    Alkhateeb, Abdullah; Zhang, Daqing; McIlroy, David; Aston, David Eric

    2004-05-01

    Silicon carbide nanowires could be potentially useful for high strength materials which lead to the interest in understanding their mechanical properties. In this report we use the digital pulse force microscopy to analyze the mechanical properties of SiC nanowires .Stiffness and adhesion images of SiC nanowires on silicon grating were obtained and calibrated force-distance curves were plotted along the wire which spans on a 1.5 micron trench. Moreover, spring constant and Young's modules have been calculated from the linear part of the force-distance curves.

  12. Microwave joining of silicon carbide using several different approaches

    SciTech Connect

    Ahmad, I.; Silberglitt, R. ); Black, W.M.; Sa'adaldin, H.S. . Dept. of Electrical and Computer Engineering); Katz, J.D. )

    1992-01-01

    Microwave joining of sintered silicon carbide, both to itself and reaction bonded silicon carbide, has been accomplished in a single-mode rectangular resonant cavity. Several approaches using different interlayer materials were employed to join sintered silicon carbide. Effective joining of reaction bonded silicon carbide to itself and sintered silicon carbide was accomplished without the use of any interlayer material in the single-mode resonant cavity as well as in a multi-mode oven. Specimens cut from 3/8'' diameter-rods were joined in the single-mode cavity, whereas a variety of arbitrary shapes and larger specimens (of reaction bonded silicon carbide) were joined in the multi-mode oven.

  13. Microwave joining of silicon carbide using several different approaches

    SciTech Connect

    Ahmad, I.; Silberglitt, R.; Black, W.M.; Sa`adaldin, H.S.; Katz, J.D.

    1992-07-01

    Microwave joining of sintered silicon carbide, both to itself and reaction bonded silicon carbide, has been accomplished in a single-mode rectangular resonant cavity. Several approaches using different interlayer materials were employed to join sintered silicon carbide. Effective joining of reaction bonded silicon carbide to itself and sintered silicon carbide was accomplished without the use of any interlayer material in the single-mode resonant cavity as well as in a multi-mode oven. Specimens cut from 3/8`` diameter-rods were joined in the single-mode cavity, whereas a variety of arbitrary shapes and larger specimens (of reaction bonded silicon carbide) were joined in the multi-mode oven.

  14. Friction and deformation behavior of single-crystal silicon carbide

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1977-01-01

    Friction and deformation studies were conducted with single-crystal silicon carbide in sliding contact with diamond. When the radius of curvature of the spherical diamond rider was large (0.3), deformation of silicon carbide was primarily elastic. Under these conditions the friction coefficient was low and did not show a dependence on the silicon carbide orientation. Further, there was no detectable cracking of the silicon carbide surfaces. When smaller radii of curvature of the spherical diamond riders (0.15 and 0.02 mm) or a conical diamond rider was used, plastic grooving occured and the silicon carbide exhibited anisotropic friction and deformation behavior. Under these conditions the friction coefficient depended on load. Anisotropic friction and deformation of the basal plane of silicon carbide was controlled by the slip system. 10101120and cleavage of1010.

  15. Silicon carbide-silicon composite having improved oxidation resistance and method of making

    NASA Technical Reports Server (NTRS)

    Luthra, Krishan Lal (Inventor); Wang, Hongyu (Inventor)

    1999-01-01

    A Silicon carbide-silicon matrix composite having improved oxidation resistance at high temperatures in dry or water-containing environments is provided. A method is given for sealing matrix cracks in situ in melt infiltrated silicon carbide-silicon matrix composites. The composite cracks are sealed by the addition of various additives, such as boron compounds, into the melt infiltrated silicon carbide-silicon matrix.

  16. Method of making silicon carbide-silicon composite having improved oxidation resistance

    NASA Technical Reports Server (NTRS)

    Luthra, Krishan Lal (Inventor); Wang, Hongyu (Inventor)

    2002-01-01

    A Silicon carbide-silicon matrix composite having improved oxidation resistance at high temperatures in dry or water-containing environments is provided. A method is given for sealing matrix cracks in situ in melt infiltrated silicon carbide-silicon matrix composites. The composite cracks are sealed by the addition of various additives, such as boron compounds, into the melt infiltrated silicon carbide-silicon matrix.

  17. Optical waveguide formed by cubic silicon carbide on sapphire substrates

    NASA Technical Reports Server (NTRS)

    Tang, Xiao; Wongchotigul, Kobchat; Spencer, Michael G.

    1991-01-01

    Optical confinement in beta silicon carbide (beta-SiC) thin films on sapphire substrate is demonstrated. Measurements are performed on waveguides formed by the mechanical transfer of thin beta-SiC films to sapphire. Recent results of epitaxial films of SiC on sapphire substrates attest to the technological viability of optoelectronic devices made from silicon carbide. Far-field mode patterns are shown. It is believed that this is the first step in validating a silicon carbide optoelectronic technology.

  18. Colloidal characterization of silicon nitride and silicon carbide

    NASA Technical Reports Server (NTRS)

    Feke, Donald L.

    1986-01-01

    The colloidal behavior of aqueous ceramic slips strongly affects the forming and sintering behavior and the ultimate mechanical strength of the final ceramic product. The colloidal behavior of these materials, which is dominated by electrical interactions between the particles, is complex due to the strong interaction of the solids with the processing fluids. A surface titration methodology, modified to account for this interaction, was developed and used to provide fundamental insights into the interfacial chemistry of these systems. Various powder pretreatment strategies were explored to differentiate between true surface chemistry and artifacts due to exposure history. The colloidal behavior of both silicon nitride and carbide is dominated by silanol groups on the powder surfaces. However, the colloid chemistry of silicon nitride is apparently influenced by an additional amine group. With the proper powder treatments, silicon nitride and carbide powder can be made to appear colloidally equivalent. The impact of these results on processing control will be discussed.

  19. Silicon nitride/silicon carbide composite densified materials prepared using composite powders

    DOEpatents

    Dunmead, S.D.; Weimer, A.W.; Carroll, D.F.; Eisman, G.A.; Cochran, G.A.; Susnitzky, D.W.; Beaman, D.R.; Nilsen, K.J.

    1997-07-01

    Prepare silicon nitride-silicon carbide composite powders by carbothermal reduction of crystalline silica powder, carbon powder and, optionally, crystalline silicon nitride powder. The crystalline silicon carbide portion of the composite powders has a mean number diameter less than about 700 nanometers and contains nitrogen. The composite powders may be used to prepare sintered ceramic bodies and self-reinforced silicon nitride ceramic bodies.

  20. Silicon carbide/SRBSN composites

    SciTech Connect

    Razzell, A.G.; Lewis, M.H.

    1991-08-01

    Ceramic matrix composites have been produced using unidirectionally aligned Textron SCS-6 fibers in a sintered reaction bonded silicon nitride (SRBSN) matrix. A tape casting technique was used to produce a prepreg sheet that could be cut and stacked to form a layup. Sintering aids were MgO, Al2O3, and Y2O3 either singly or in combination, final sintering being carried out under pressure at temperatures up to 1750 C. The three-point bend strength of the material varied between 448 and 513 MPa and showed no variation with oxidation time at 1000 C up to 25 hours. Interfacial shear strength measured by indentation was 4 MPa; some samples had a reaction layer at the interface and a shear strength of greater than MPa. Within sections 6 mm from exposed fiber ends, the interfacial carbon layers were partially removed, and the interfacial shear strength was reduced with increasing oxidation time. 4 refs.

  1. Ultrafine alumina coated silicon carbide particles for alumina-silicon carbide nanocomposites

    SciTech Connect

    Warrier, K.G.K.; Hareesh, U.S.; Damodaran, A.D.

    1996-12-31

    Aluminum oxide, toughened by fine and uniform dispersion of silicon carbide particles has been found to possess interesting high temperature properties of high toughness and strength. Recent reports suggest that the finer the silicon carbide size, the better would be the fracture toughness. By addition of as few as 5 vol% submicron SiC particles strengthened Al{sub 2}O{sub 3} from 350 MPa to 1 GPa, with toughness as high as 4.7 Mpa m{sup {1/2}}. The mechanism of such high extent of fracture toughness has been investigated to be due to crack deflection and microcracking introduced by thermal expansion mismatch between particles and matrix grains, although the real contributions from the silicon carbide nanoparticles are still under investigation. In all these cases the primary requirement for most effective composite is the fine, uniform size of the particles and their homogeneous dispersion in the alumina matrix. Usual methods adopted for the preparation of composites such as physical mixing of alumina and silicon carbide particles often result in localized agglomerations and inhomogeneity making the composite inferior in properties.

  2. Excess carbon in silicon carbide

    SciTech Connect

    Shen, X; Oxley, Mark P.; Puzyrev, Y; Tuttle, B R; Duscher, Gerd; Pantelides, Sokrates T.

    2010-01-01

    The application of SiC in electronic devices is currently hindered by low carrier mobility at the SiC/SiO{sub 2} interfaces. Recently, it was reported that 4H-SiC/SiO{sub 2} interfaces might have a transition layer on the SiC substrate side with C/Si ratio as high as 1.2, suggesting that carbon is injected into the SiC substrate during oxidation or other processing steps. We report finite-temperature quantum molecular dynamics simulations that explore the behavior of excess carbon in SiC. For SiC with 20% excess carbon, we find that, over short time ({approx} 24 ps), carbon atoms bond to each other and form various complexes, while the silicon lattice is largely unperturbed. These results, however, suggest that at macroscopic times scale, C segregation is likely to occur; therefore a transition layer with 20% extra carbon would not be stable. For a dilute distribution of excess carbon, we explore the pairing of carbon interstitials and show that the formation of dicarbon interstitial cluster is kinetically very favorable, which suggests that isolated carbon clusters may exist inside SiC substrate.

  3. Improved silicon carbide for advanced heat engines

    NASA Technical Reports Server (NTRS)

    Whalen, T. J.; Winterbottom, W. L.

    1986-01-01

    Work performed to develop silicon carbide materials of high strength and to form components of complex shape and high reliability is described. A beta-SiC powder and binder system was adapted to the injection molding process and procedures and process parameters developed capable of providing a sintered silicon carbide material with improved properties. The initial effort has been to characterize the baseline precursor materials (beta silicon carbide powder and boron and carbon sintering aids), develop mixing and injection molding procedures for fabricating test bars, and characterize the properties of the sintered materials. Parallel studies of various mixing, dewaxing, and sintering procedures have been carried out in order to distinguish process routes for improving material properties. A total of 276 MOR bars of the baseline material have been molded, and 122 bars have been fully processed to a sinter density of approximately 95 percent. The material has a mean MOR room temperature strength of 43.31 ksi (299 MPa), a Weibull characteristic strength of 45.8 ksi (315 MPa), and a Weibull modulus of 8.0. Mean values of the MOR strengths at 1000, 1200, and 14000 C are 41.4, 43.2, and 47.2 ksi, respectively. Strength controlling flaws in this material were found to consist of regions of high porosity and were attributed to agglomerates originating in the initial mixing procedures. The mean stress rupture lift at 1400 C of five samples tested at 172 MPa (25 ksi) stress was 62 hours and at 207 MPa (30 ksi) stress was 14 hours. New fluid mixing techniques have been developed which significantly reduce flaw size and improve the strength of the material. Initial MOR tests indicate the strength of the fluid-mixed material exceeds the baseline property by more than 33 percent.

  4. Process for forming silicon carbide films and microcomponents

    DOEpatents

    Hamza, A.V.; Balooch, M.; Moalem, M.

    1999-01-19

    Silicon carbide films and microcomponents are grown on silicon substrates at surface temperatures between 900 K and 1700 K via C{sub 60} precursors in a hydrogen-free environment. Selective crystalline silicon carbide growth can be achieved on patterned silicon-silicon oxide samples. Patterned SiC films are produced by making use of the high reaction probability of C{sub 60} with silicon at surface temperatures greater than 900 K and the negligible reaction probability for C{sub 60} on silicon dioxide at surface temperatures less than 1250 K. 5 figs.

  5. Process for forming silicon carbide films and microcomponents

    DOEpatents

    Hamza, Alex V.; Balooch, Mehdi; Moalem, Mehran

    1999-01-01

    Silicon carbide films and microcomponents are grown on silicon substrates at surface temperatures between 900 K and 1700 K via C.sub.60 precursors in a hydrogen-free environment. Selective crystalline silicon carbide growth can be achieved on patterned silicon-silicon oxide samples. Patterned SiC films are produced by making use of the high reaction probability of C.sub.60 with silicon at surface temperatures greater than 900 K and the negligible reaction probability for C.sub.60 on silicon dioxide at surface temperatures less than 1250 K.

  6. Structural relaxation of amorphous silicon carbide.

    PubMed

    Ishimaru, Manabu; Bae, In-Tae; Hirotsu, Yoshihiko; Matsumura, Syo; Sickafus, Kurt E

    2002-07-29

    We have examined amorphous structures of silicon carbide (SiC) using both transmission electron microscopy and a molecular-dynamics approach. Radial distribution functions revealed that amorphous SiC contains not only heteronuclear (Si-C) bonds but also homonuclear (Si-Si and C-C) bonds. The ratio of heteronuclear to homonuclear bonds was found to change upon annealing, suggesting that structural relaxation of the amorphous SiC occurred. Good agreement was obtained between the simulated and experimentally measured radial distribution functions. PMID:12144449

  7. Molybdenum disilicide composites reinforced with zirconia and silicon carbide

    SciTech Connect

    Petrovic, J.J.

    1992-12-31

    This patent pertains to compositions consisting essentially of molybdenum disilicide, silicon carbide, and a zirconium oxide component. The silicon carbide used in the compositions is in whisker or powder form. The zirconium oxide component is pure zirconia or partially stabilized zirconia or fully stabilized zirconia. Fabrication, fracture toughness, and bend strength are covered.

  8. Critically coupled surface phonon-polariton excitation in silicon carbide.

    PubMed

    Neuner, Burton; Korobkin, Dmitriy; Fietz, Chris; Carole, Davy; Ferro, Gabriel; Shvets, Gennady

    2009-09-01

    We observe critical coupling to surface phonon-polaritons in silicon carbide by attenuated total reflection of mid-IR radiation. Reflectance measurements demonstrate critical coupling by a double scan of wavelength and incidence angle. Critical coupling occurs when prism coupling loss is equal to losses in silicon carbide and the substrate, resulting in maximal electric field enhancement. PMID:19724526

  9. Molybdenum disilicide composites reinforced with zirconia and silicon carbide

    DOEpatents

    Petrovic, J.J.

    1995-01-17

    Compositions are disclosed consisting essentially of molybdenum disilicide, silicon carbide, and a zirconium oxide component. The silicon carbide used in the compositions is in whisker or powder form. The zirconium oxide component is pure zirconia or partially stabilized zirconia or fully stabilized zirconia.

  10. Molybdenum disilicide composites reinforced with zirconia and silicon carbide

    DOEpatents

    Petrovic, John J.

    1995-01-01

    Compositions consisting essentially of molybdenum disilicide, silicon carbide, and a zirconium oxide component. The silicon carbide used in the compositions is in whisker or powder form. The zirconium oxide component is pure zirconia or partially stabilized zirconia or fully stabilized zirconia.

  11. An investigation on gamma attenuation behaviour of titanium diboride reinforced boron carbide-silicon carbide composites

    NASA Astrophysics Data System (ADS)

    Buyuk, Bulent; Beril Tugrul, A.

    2014-04-01

    In this study, titanium diboride (TiB2) reinforced boron carbide-silicon carbide composites were investigated against Cs-137 and Co-60 gamma radioisotope sources. The composite materials include 70% boron carbide (B4C) and 30% silicon carbide (SiC) by volume. Titanium diboride was reinforced to boron carbide-silicon carbide composites as additive 2% and 4% by volume. Average particle sizes were 3.851 µm and 170 nm for titanium diboride which were reinforced to the boron carbide silicon carbide composites. In the experiments the gamma transmission technique was used to investigate the gamma attenuation properties of the composite materials. Linear and mass attenuation coefficients of the samples were determined. Theoretical mass attenuation coefficients were calculated from XCOM computer code. The experimental results and theoretical results were compared and evaluated with each other. It could be said that increasing the titanium diboride ratio causes higher linear attenuation values against Cs-137 and Co-60 gamma radioisotope sources. In addition decreasing the titanium diboride particle size also increases the linear and mass attenuation properties of the titanium diboride reinforced boron carbide-silicon carbide composites.

  12. Infrared Kerr measurements on ferromagnetic silicon and silicon carbide

    NASA Astrophysics Data System (ADS)

    Seo, Jungryeol; Mukherjee, Alok; Arik, Mumtaz Murat; Cerne, John; Liu, Yu; Zhou, Shengqiang; Böttger, Roman; Song, Bo; Wang, Gang

    We measure the infrared (100-1000 meV) Kerr angle in ferromagnetic silicon and silicon carbide. The samples were either neutron irradiated or aluminum doped to induce ferromagnetic behavior. The samples are studied in the 10-300K temperature range at magnetic fields up to 7T. We also explore the dependence of the magneto-optical signal on samples with different irradiation exposure levels. This study provides new information on the optical, magnetic, and electronic properties of these materials. Work supported by NSF-DMR1410599 and the Helmholtz Postdoctoral Program PD-146.

  13. The growth of cubic silicon carbide on a compliant substrate

    NASA Technical Reports Server (NTRS)

    Mitchell, Sharanda; Soward, Ida

    1995-01-01

    Research has shown that silicon carbide grown on silicon and 6H silicon carbide has problems associated with these substrates. This is because silicon and silicon carbide has a 20% lattice mismatch and cubic silicon carbide has not been successfully achieved on 6H silicon carbide. We are investigating the growth of silicon carbide on a compliant substrate in order to grow defect free silicon carbide. This compliant substrate consists of silicon/silicon dioxide with 1200 A of single crystal silicon on the top layer. We are using this compliant substrate because there is a possibility that the silicon dioxide layer and the carbonized layer will allow the silicon lattice to shrink or expand to match the lattice of the silicon carbide. This would improve the electrical properties of the film for the use of device fabrication. When trying to grow silicon carbide, we observed amorphous film. To investigate, we examined the process step by step using RHEED. RHEED data showed that each step was amorphous. We found that just by heating the substrate in the presence of hydrogen it changed the crystal structure. When heated to 1000 C for 2 minutes, RHEED showed that there was an amorphous layer on the surface. We also heated the substrate to 900 C for 2 minutes and RHEED data showed that there was a deterioration of the single crystalline structure. We assumed that the presence of oxygen was coming from the sides of the silicon dioxide layer. Therefore, we evaporated 2500 A of silicon to all four edges of the wafer to try to enclose the oxygen. When heating the evaporated wafer to 900 C the RHEED data showed single crystalline structure however at 1000 C the RHEED data showed deterioration of the single crystalline structure. We conclude that the substrate itself is temperature dependent and that the oxygen was coming from the sides of the silicon dioxide layer. We propose to evaporate more silicon on the edges of the wafer to eliminate the escape of oxygen. this will allow

  14. Reaction bonded silicon carbide gimbaled pointing mirror

    NASA Astrophysics Data System (ADS)

    Robichaud, J.; Akerstrom, A.; Frey, S.; Crompton, D.; Cucchiaro, P.; Deveau, G.; Peters, M.; Mason, S.; Ullathorne, C.

    2007-09-01

    A Silicon Carbide (SiC) based wide field of view Pointing Mirror Assembly (PMA) has been developed to provide two axis line-of-sight control for a fixed, space based imaging sensor. Thermal modeling has been completed in order to project the excellent thermal stability anticipated from the SiC PMA, and closed loop servo testing of the hardware has been conducted in order to quantify the bandwidth associated with line-of-sight control. In addition to the system level testing the SiC mirror substrate itself has been tested for thermal stability. We also report on results obtained with a novel polishing technique which has been applied in order to allow optical finishing of the two-phased Reaction Bonded (RB) SiC mirror substrate without the need for Silicon or SiC claddings.

  15. Silicon carbide - Progress in crystal growth

    NASA Technical Reports Server (NTRS)

    Powell, J. Anthony

    1987-01-01

    Recent progress in the development of two processes for producing large-area high-quality single crystals of SiC is described: (1) a modified Lely process for the growth of the alpha polytypes (e.g., 6H SiC) initially developed by Tairov and Tsvetkov (1978, 1981) and Ziegler et al. (1983), and (2) a process for the epitaxial growth of the beta polytype on single-crystal silicon or other substrates. Growth of large-area cubic SiC on Si is described together with growth of defect-free beta-SiC films on alpha-6H SiC crystals and TiC lattice. Semiconducting qualities of silicon carbide crystals grown by various techniques are discussed.

  16. Silicon Carbide Nanotube Oxidation at High Temperatures

    NASA Technical Reports Server (NTRS)

    Ahlborg, Nadia; Zhu, Dongming

    2012-01-01

    Silicon Carbide Nanotubes (SiCNTs) have high mechanical strength and also have many potential functional applications. In this study, SiCNTs were investigated for use in strengthening high temperature silicate and oxide materials for high performance ceramic nanocomposites and environmental barrier coating bond coats. The high · temperature oxidation behavior of the nanotubes was of particular interest. The SiCNTs were synthesized by a direct reactive conversion process of multiwall carbon nanotubes and silicon at high temperature. Thermogravimetric analysis (TGA) was used to study the oxidation kinetics of SiCNTs at temperatures ranging from 800degC to1300degC. The specific oxidation mechanisms were also investigated.

  17. An overview of silicon carbide device technology

    NASA Technical Reports Server (NTRS)

    Neudeck, Philip G.; Matus, Lawrence G.

    1992-01-01

    Recent progress in the development of silicon carbide (SiC) as a semiconductor is briefly reviewed. This material shows great promise towards providing electronic devices that can operate under the high-temperature, high-radiation, and/or high-power conditions where current semiconductor technologies fail. High quality single crystal wafers have become available, and techniques for growing high quality epilayers have been refined to the point where experimental SiC devices and circuits can be developed. The prototype diodes and transistors that have been produced to date show encouraging characteristics, but by the same token they also exhibit some device-related problems that are not unlike those faced in the early days of silicon technology development. Although these problems will not prevent the implementation of some useful circuits, the performance and operating regime of SiC electronics will be limited until these device-related issues are solved.

  18. Converting a carbon preform object to a silicon carbide object

    NASA Technical Reports Server (NTRS)

    Levin, Harry (Inventor)

    1990-01-01

    A process for converting in depth a carbon or graphite preform object to a silicon carbide object, silicon carbide/silicon object, silicon carbide/carbon-core object, or a silicon carbide/silicon/carbon-core object, by contacting it with silicon liquid and vapor over various lengths of contact time in a reaction chamber. In the process, a stream comprised of a silicon-containing precursor material in gaseous phase below the decomposition temperature of said gas and a coreactant, carrier or diluent gas such as hydrogen is passed through a hole within a high emissivity, thin, insulating septum into the reaction chamber above the melting point of silicon. The thin septum has one face below the decomposition temperature of the gas and an opposite face exposed to the reaction chamber. Thus, the precursor gas is decomposed directly to silicon in the reaction chamber. Any stream of decomposition gas and any unreacted precursor gas from the reaction chamber is removed. A carbon or graphite preform object placed in the reaction chamber is contacted with the silicon. The carbon or graphite preform object is recovered from the reactor chamber after it has been converted to a desired silicon carbide, silicon and carbon composition.

  19. Silicon Carbide: The Problem with Laboratory Spectra

    NASA Astrophysics Data System (ADS)

    Speck, A. K.; Hofmeister, A. M.; Barlow, M. J.

    2000-03-01

    The interpretation of astronomical observations of infrared (IR) silicon carbide (SiC) features in the spectra of carbon stars have revealed discrepancies between the work of astronomers and that of meteoriticists. The silicon carbide observed around carbon stars has been attributed to one type of SiC (α) while meteoritic samples believed to have formed around such stars are of another type of SiC (β). The key to solving this problem has been to understand the sources of laboratory data used by astronomers in order to interpret the IR spectra. Through comparison of thin film IR absorption spectra and spectra taken using finely ground samples dispersed in potassium bromide (KBr) pellets we show that the previously invoked ``KBr matrix-correction'' is unnecessary for powder dispersions obtained from very fine grain sizes of SiC. Comparison of our data and previous measurements show that dust around carbon stars is β-SiC, consistent with laboratory studies of presolar grains in meteorites. The implications of these findings affect twenty years of work. The IR spectroscopic laboratory data used by astronomers to identify dust species in space must be carefully scrutinized to ensure that the KBr correction is not responsible for further misattributions of minerals in astronomical dust features.

  20. Improved silicon carbide for advanced heat engines

    NASA Technical Reports Server (NTRS)

    Whalen, Thomas J.

    1988-01-01

    This is the third annual technical report for the program entitled, Improved Silicon Carbide for Advanced Heat Engines, for the period February 16, 1987 to February 15, 1988. The objective of the original program was the development of high strength, high reliability silicon carbide parts with complex shapes suitable for use in advanced heat engines. Injection molding is the forming method selected for the program because it is capable of forming complex parts adaptable for mass production on an economically sound basis. The goals of the revised program are to reach a Weibull characteristic strength of 550 MPa (80 ksi) and a Weibull modulus of 16 for bars tested in 4-point loading. Two tasks are discussed: Task 1 which involves materials and process improvements, and Task 2 which is a MOR bar matrix to improve strength and reliability. Many statistically designed experiments were completed under task 1 which improved the composition of the batches, the mixing of the powders, the sinter and anneal cycles. The best results were obtained by an attritor mixing process which yielded strengths in excess of 550 MPa (80 ksi) and an individual Weibull modulus of 16.8 for a 9-sample group. Strengths measured at 1200 and 1400 C were equal to the room temperature strength. Annealing of machined test bars significantly improved the strength. Molding yields were measured and flaw distributions were observed to follow a Poisson process. The second iteration of the Task 2 matrix experiment is described.

  1. Improved silicon carbide for advanced heat engines

    NASA Technical Reports Server (NTRS)

    Whalen, Thomas J.

    1987-01-01

    This is the second annual technical report entitled, Improved Silicon Carbide for Advanced Heat Engines, and includes work performed during the period February 16, 1986 to February 15, 1987. The program is conducted for NASA under contract NAS3-24384. The objective is the development of high strength, high reliability silicon carbide parts with complex shapes suitable for use in advanced heat engines. The fabrication methods used are to be adaptable for mass production of such parts on an economically sound basis. Injection molding is the forming method selected. This objective is to be accomplished in a two-phase program: (1) to achieve a 20 percent improvement in strength and a 100 percent increase in Weibull modulus of the baseline material; and (2) to produce a complex shaped part, a gas turbine rotor, for example, with the improved mechanical properties attained in the first phase. Eight tasks are included in the first phase covering the characterization of the properties of a baseline material, the improvement of those properties and the fabrication of complex shaped parts. Activities during the first contract year concentrated on two of these areas: fabrication and characterization of the baseline material (Task 1) and improvement of material and processes (Task 7). Activities during the second contract year included an MOR bar matrix study to improve mechanical properties (Task 2), materials and process improvements (Task 7), and a Ford-funded task to mold a turbocharger rotor with an improved material (Task 8).

  2. Improved silicon carbide for advanced heat engines

    NASA Technical Reports Server (NTRS)

    Whalen, Thomas J.; Mangels, J. A.

    1986-01-01

    The development of silicon carbide materials of high strength was initiated and components of complex shape and high reliability were formed. The approach was to adapt a beta-SiC powder and binder system to the injection molding process and to develop procedures and process parameters capable of providing a sintered silicon carbide material with improved properties. The initial effort was to characterize the baseline precursor materials, develop mixing and injection molding procedures for fabricating test bars, and characterize the properties of the sintered materials. Parallel studies of various mixing, dewaxing, and sintering procedures were performed in order to distinguish process routes for improving material properties. A total of 276 modulus-of-rupture (MOR) bars of the baseline material was molded, and 122 bars were fully processed to a sinter density of approximately 95 percent. Fluid mixing techniques were developed which significantly reduced flaw size and improved the strength of the material. Initial MOR tests indicated that strength of the fluid-mixed material exceeds the baseline property by more than 33 percent. the baseline property by more than 33 percent.

  3. Dispersion aspects of silicon carbide gelcasting

    SciTech Connect

    Bleier, A.

    1991-09-01

    The principal objective of this research was to increase the solid loading of silicon carbide (SiC) powder, in an appropriate liquid medium, to a level that is useful for gelcasting technology. A number of factors that determine the maximum concentration of silicon carbide that can be incorporated into a pourable ceramic suspension have been identified. The pH of the system is the most critical processing parameter. Its proper adjustment (pH 11 to 13) allows SiC concentrations exceeding 50%, based on volume, to be routinely achieved without the use of additional dispersing agents. The particle size of SiC was also found to affect the maximum, attainable concentration. The surface area of the powder and the presence of free carbon in the powder, though not significantly influencing the suspension properties, determine the concentration of initiator required to induce polymerization and gelation. SiC specimens have been gelcast for powders in the size range of 0.8 to 8.5 {mu}m; the powders employed contain either {approximately} 0 or 19% carbon by weight. Finally, the generation of bubbles, typically encountered by the use of ammonia to adjust pH has been circumvented by the use of tetramethylammonium hydroxide.

  4. Development of silicon carbide composites for fusion

    SciTech Connect

    Snead, L.L. )

    1993-08-01

    The use of silicon carbide composites for structural materials is of growing interest in the fusion community. However, radiation effects in these materials are virtually unexplored, and the general state of ceramic matrix composites for nonnuclear applications is still in its infancy. Research into the radiation response of the most popular silicon carbide composite, namely, the chemically vapor-deposited (CVD) SiC-carbon-Nicalon fiber system is discussed. Three areas of interest are the stability of the fiber and matrix materials, the stability of the fiber-matrix interface, and the true activation of these [open quotes]reduced activity[close quotes] materials. Two methods are presented that quantitatively measure the effect of radiation on fiber and matrix elastic modulus as well as the fiber-matrix interfacial strength. The results of these studies show that the factor limiting the radiation performance of the CVD SiC-carbon-Nicalon system is degradation of the Nicalon fiber, which leads to a weakened carbon interface. The activity of these composites is significantly higher than expected and is dominated by impurity isotopes. 52 refs., 12 figs., 3 tabs.

  5. Oxidation kinetics of coated silicon carbide fiber-reinforced silicon carbide (SiC/SiC)

    SciTech Connect

    Fox, D.S.

    1994-12-31

    Silicon carbide fiber-reinforced silicon carbide (SiC/SiC) was exposed for 100 hours to dry, flowing oxygen. Oxidation kinetics were determined via thermogravimetric analysis at 981{degrees}, 1204{degrees} and 1316{degrees}C (1800{degrees}, 2200{degrees} and 2400{degrees}F). The effectiveness of three external coating systems applied for oxidation protection is discussed. In all cases, weight gains were observed, and the pyrolytic carbon interface layer remained intact. A CVD SiC external coating is the most promising due to low oxidation kinetics resulting from solid silica formation. A borosilicate glass was observed on the surface of two of the materials that have boron-containing coatings.

  6. Production and characterization of nanostructured silicon carbide

    NASA Astrophysics Data System (ADS)

    Wallis, Kendra Lee

    Nanostructured materials continue to attract attention because of their new and interesting properties, which are very different from their macrostructured equivalents. Since the size of grain and surface differs, a better understanding of the microstructure, the mechanism of formation, and methods of controlling surface properties is necessary. In this study, nanostructured silicon carbide has been produced from the solid-solid reaction of a mixture of silicon nanopowder and carbon multiwalled nanotubes (MWNT) sintered by induction. A study of the reaction rate at different temperatures has yielded a value for the activation energy of 254 +/- 36 kJ/mol, and has led to the conclusion that the reaction is diffusion-controlled. A second method produced pure silicon carbide nanowires using a procedure which kept the solid reactants, silicon powder and MWNT, separated while sintering at a constant temperature of 1200°C. Silicon in the vapor-phase reacted at the surface of the MWNTs followed by diffusion of both precursors through the product phase boundary. The reaction time was varied, and a morphological study has been done describing changes in shape and size as a function of time. The initial reaction produced a layer of SiC providing the outer shell of coaxial structures with carbon nanotubes inside. As Si and C diffused through the product phase to react at the interface, the tube became filled with SiC to form solid SiC nanowires, and the outer diameter of the nanowires grew continuously as reaction time increased. After long sintering times, growth continued in two dimensions, fusing nanowires together into planar structures. In addition, the precursor form of carbon was varied, and nanowires produced by two different types of nanotubes have been studied. The produced SiC nanowires show cubic crystal structure. After a few hours of sintering, stacking faults began to occur inside the wires, and the frequency of occurrence of the stacking faults increased as

  7. Direct microwave joining of reaction bonded silicon carbide

    SciTech Connect

    Ahmad, I.; Black, W.M.; Silberglitt, R.

    1992-08-01

    A single-mode rectangular resonant cavity operating at 2.45 GHz was used to join, without any interlayer or applied pressure, specimens of reaction bonded silicon carbide. Specimens of 0.95 cm diameter and 0.5 cm height were joined at temperatures 1400-1450 C in 10 to 15 minutes. Specimens of arbitrary shapes and practical sizes were joined in a commercially available 900 watt multi-mode oven with hybrid heating. The joined specimens were sectioned and examined. The joint was not detectable even by scanning electron microscope observation. On heating silicon bleeds out of reaction bonded silicon carbide. The apparent density of the heated reaction bonded silicon carbide was 3.01 gm/cc as compared to 3.05 gm/cc for the as received material. However, the only difference in microstructure was some grain growth of the microwave heated reaction bonded silicon carbide, compared to the as received material. 10 refs.

  8. Predicting Two-Dimensional Silicon Carbide Monolayers.

    PubMed

    Shi, Zhiming; Zhang, Zhuhua; Kutana, Alex; Yakobson, Boris I

    2015-10-27

    Intrinsic semimetallicity of graphene and silicene largely limits their applications in functional devices. Mixing carbon and silicon atoms to form two-dimensional (2D) silicon carbide (SixC1-x) sheets is promising to overcome this issue. Using first-principles calculations combined with the cluster expansion method, we perform a comprehensive study on the thermodynamic stability and electronic properties of 2D SixC1-x monolayers with 0 ≤ x ≤ 1. Upon varying the silicon concentration, the 2D SixC1-x presents two distinct structural phases, a homogeneous phase with well dispersed Si (or C) atoms and an in-plane hybrid phase rich in SiC domains. While the in-plane hybrid structure shows uniform semiconducting properties with widely tunable band gap from 0 to 2.87 eV due to quantum confinement effect imposed by the SiC domains, the homogeneous structures can be semiconducting or remain semimetallic depending on a superlattice vector which dictates whether the sublattice symmetry is topologically broken. Moreover, we reveal a universal rule for describing the electronic properties of the homogeneous SixC1-x structures. These findings suggest that the 2D SixC1-x monolayers may present a new "family" of 2D materials, with a rich variety of properties for applications in electronics and optoelectronics. PMID:26394207

  9. Separation of Nuclear Fuel Surrogates from Silicon Carbide Inert Matrix

    SciTech Connect

    Dr. Ronald Baney

    2008-12-15

    The objective of this project has been to identify a process for separating transuranic species from silicon carbide (SiC). Silicon carbide has become one of the prime candidates for the matrix in inert matrix fuels, (IMF) being designed to reduce plutonium inventories and the long half-lives actinides through transmutation since complete reaction is not practical it become necessary to separate the non-transmuted materials from the silicon carbide matrix for ultimate reprocessing. This work reports a method for that required process.l

  10. Method of preparing silicon carbide particles dispersed in an electrolytic bath for composite electroplating of metals

    DOEpatents

    Peng, Yu-Min; Wang, Jih-Wen; Liue, Chun-Ying; Yeh, Shinn-Horng

    1994-01-01

    A method for preparing silicon carbide particles dispersed in an electrolytic bath for composite electroplating of metals includes the steps of washing the silicon carbide particles with an organic solvent; washing the silicon carbide particles with an inorganic acid; grinding the silicon carbide particles; and heating the silicon carbide particles in a nickel-containing solution at a boiling temperature for a predetermined period of time.

  11. Tunable plasticity in amorphous silicon carbide films.

    PubMed

    Matsuda, Yusuke; Kim, Namjun; King, Sean W; Bielefeld, Jeff; Stebbins, Jonathan F; Dauskardt, Reinhold H

    2013-08-28

    Plasticity plays a crucial role in the mechanical behavior of engineering materials. For instance, energy dissipation during plastic deformation is vital to the sufficient fracture resistance of engineering materials. Thus, the lack of plasticity in brittle hybrid organic-inorganic glasses (hybrid glasses) often results in a low fracture resistance and has been a significant challenge for their integration and applications. Here, we demonstrate that hydrogenated amorphous silicon carbide films, a class of hybrid glasses, can exhibit a plasticity that is even tunable by controlling their molecular structure and thereby leads to an increased and adjustable fracture resistance in the films. We decouple the plasticity contribution from the fracture resistance of the films by estimating the "work-of-fracture" using a mean-field approach, which provides some insight into a potential connection between the onset of plasticity in the films and the well-known rigidity percolation threshold. PMID:23876200

  12. Development of a silicon carbide sewing thread

    NASA Technical Reports Server (NTRS)

    Sawko, Paul M.; Vasudev, Anand

    1989-01-01

    A silicon carbide (SiC) sewing thread has been designed which consists of a two-ply yarn in a 122 turns-per-meter-twist construction. Two processing aids in thread construction were evaluated. Prototype blankets were sewn using an SiC thread prepared either with polytetrafluoroethylene sizing or with an overwrap of rayon/dacron service yarn. The rayon/dacron-wrapped SiC thread was stronger, as shown by higher break-strength retention and less damage to the outer-mold-line fabric. This thread enables thermal protection system articles to be sewn or joined, or have perimeter close-out of assembled parts when using SiC fabric for high-temperature applications.

  13. Silicon carbide mirrors for high power applications

    SciTech Connect

    Takacs, P. Z.

    1981-11-01

    The advent of synchrotron radiation (SR) sources and high energy lasers (HEL) in recent years has brought about the need for optical materials that can withstand the harsh operating conditions in such devices. SR mirrors must be ultra-high vacuum compatible, must withstand intense x-ray irradiation without surface damage, must maintain surface figure under thermal loading and must be capable of being polished to an extremely smooth surface finish. Chemical vapor deposited (CVD) silicon carbide in combination with sintered substrate material meets these requirements and offers additional benefits as well. It is an extremely hard material and offers the possibility of being cleaned and recoated many times without degradation of the surface finish, thereby prolonging the lifetime of expensive optical components. It is an extremely strong material and offers the possibility of weight reduction over conventional mirror materials.

  14. Neutron irradiation induced amorphization of silicon carbide

    SciTech Connect

    Snead, L.L.; Hay, J.C.

    1998-09-01

    This paper provides the first known observation of silicon carbide fully amorphized under neutron irradiation. Both high purity single crystal hcp and high purity, highly faulted (cubic) chemically vapor deposited (CVD) SiC were irradiated at approximately 60 C to a total fast neutron fluence of 2.6 {times} 10{sup 25} n/m{sup 2}. Amorphization was seen in both materials, as evidenced by TEM, electron diffraction, and x-ray diffraction techniques. Physical properties for the amorphized single crystal material are reported including large changes in density ({minus}10.8%), elastic modulus as measured using a nanoindentation technique ({minus}45%), hardness as measured by nanoindentation ({minus}45%), and standard Vickers hardness ({minus}24%). Similar property changes are observed for the critical temperature for amorphization at this neutron dose and flux, above which amorphization is not possible, is estimated to be greater than 130 C.

  15. Quantitative Ultrasound Characterization of Silicon Carbide Mirrors

    NASA Astrophysics Data System (ADS)

    Portune, A. R.; Haber, R. A.

    2010-02-01

    Silicon carbide mirrors were characterized using several qualitative and quantitative nondestructive ultrasound techniques in order to determine the most efficient method for rapid performance evaluations. Ultrasound testing was performed in immersion using both phased array and single transducer systems in pulse-echo configuration. C-scan images of top and bottom surface reflected signal peak amplitudes were used to qualitatively locate and identify homogeneity variations within the mirror materials. Quantitative analysis of normalized amplitude histograms revealed significant differences in homogeneity estimations between phased array and single transducer test methods. Acoustic spectroscopy over the 10-33 MHz regime identified bulk microstructural differences between high and low amplitude regions in the samples. While ultrasound phased array performed well at rapidly locating surface and subsurface heterogeneities, it could not match the resolution and clarity of single transducer C-scan images or the insight of acoustic spectroscopy analyses.

  16. Novel Silicon Carbide Detector for Active Inspections

    SciTech Connect

    F. H. Ruddy; J.G. Seidel; R.W. Flammang

    2007-03-01

    The need to address increasingly challenging inspection requirements (such as large volume objects, very fast inspection throughputs, potentially significant shielding, etc.) for such items as nuclear materials and explosives will require the use of active interrogation technologies. While these active technologies can successfully address these challenges by inducing unique, temporal signatures, the inspection environment will also induce overall “background signals” that can be orders of magnitude larger than the induced signatures. Detectors that can successfully operate in these types of customized, inspection environments (pulsed and continuous) and successfully extract induced signature data are clearly needed and will effectively define the limitations of any active inspection system. A novel silicon carbide detector is now being investigated to successfully address both neutron- and photon/bremsstrahlung-type inspection applications. While this paper describes this detector and highlights efforts related to neutron inspection, it will focus on its neutron and gamma-ray/photon detection performance in neutron- and bremssstrahlung-type inspection applications.

  17. Comparison Measurements of Silicon Carbide Temperature Monitors

    SciTech Connect

    J. L. Rempe; K. G. Condie; D. L. Knudson; L. L. Snead

    2010-06-01

    As part of the efforts initiated through the Advanced Test Reactor (ATR) National Scientific User Facility (NSUF) program to make Silicon Carbide (SiC) temperature monitors available, a capability was developed at the Idaho National Laboratory (INL) to complete post-irradiation evaluations of these monitors. INL selected the resistance measurement approach for detecting peak irradiation temperature from SiC temperature monitors. To demonstrate this new capability, comparison measurements were completed by INL and Oak Ridge National Laboratory (ORNL) on identical samples subjected to identical irradiation conditions. Results reported in this paper indicate that the resistance measurement approach can yield similar peak irradiation temperatures if appropriate equipment is used and appropriate procedures are followed.

  18. Nanoporous Silicon Carbide for Nanoelectromechanical Systems Applications

    NASA Technical Reports Server (NTRS)

    Hossain, T.; Khan, F.; Adesida, I.; Bohn, P.; Rittenhouse, T.; Lienhard, Michael (Technical Monitor)

    2003-01-01

    A major goal of this project is to produce porous silicon carbide (PSiC) via an electroless process for eventual utilization in nanoscale sensing platforms. Results in the literature have shown a variety of porous morphologies in SiC produced in anodic cells. Therefore, predictability and reproducibility of porous structures are initial concerns. This work has concentrated on producing morphologies of known porosity, with particular attention paid toward producing the extremely high surface areas required for a porous flow sensor. We have conducted a parametric study of electroless etching conditions and characteristics of the resulting physical nanostructure and also investigated the relationship between morphology and materials properties. Further, we have investigated bulk etching of SiC using both photo-electrochemical etching and inductively-coupled-plasma reactive ion etching techniques.

  19. Amorphization of Silicon Carbide by Carbon Displacement

    SciTech Connect

    Devanathan, Ram; Gao, Fei; Weber, William J.

    2004-05-10

    We have used molecular dynamics simulations to examine the possibility of amorphizing silicon carbide (SiC) by exclusively displacing C atoms. At a defect generation corresponding to 0.2 displacements per atom, the enthalpy surpasses the level of melt-quenched SiC, the density decreases by about 15%, and the radial distribution function shows a lack of long-range order. Prior to amorphization, the surviving defects are mainly C Frenkel pairs (67%), but Si Frenkel pairs (18%) and anti-site defects (15%) are also present. The results indicate that SiC can be amorphized by C sublattice displacements. Chemical short-range disorder, arising mainly from interstitial production, plays a significant role in the amorphization.

  20. Stored energy in irradiated silicon carbide

    SciTech Connect

    Snead, L.L.; Burchell, T.D.

    1997-04-01

    This report presents a short review of the phenomenon of Wigner stored energy release from irradiated graphite and discusses it in relation to neutron irradiation of silicon carbide. A single published work in the area of stored energy release in SiC is reviewed and the results are discussed. It appears from this previous work that because the combination of the comparatively high specific heat of SiC and distribution in activation energies for recombining defects, the stored energy release of SiC should only be a problem at temperatures lower than those considered for fusion devices. The conclusion of this preliminary review is that the stored energy release in SiC will not be sufficient to cause catastrophic heating in fusion reactor components, though further study would be desirable.

  1. Chemical Mechanical Polishing of Silicon Carbide

    NASA Technical Reports Server (NTRS)

    Powell, J. Anthony; Pirouz

    1999-01-01

    The High Temperature Integrated Electronics and Sensors (HTIES) team at the NASA Lewis Research Center is developing silicon carbide (SiC) as an enabling electronic technology for many aerospace applications. The Lewis team is focusing on the chemical vapor deposition of the thin, single-crystal SiC films from which devices are fabricated. These films, which are deposited (i.e., epitaxially "grown") on commercial wafers, must consist of a single crystal with very few structural defects so that the derived devices perform satisfactorily and reliably. Working in collaboration (NASA grant) with Professor Pirouz of Case Western Reserve University, we developed a chemical-mechanical polishing (CMP) technique for removing the subsurface polishing damage prior to epitaxial growth of the single-crystal SiC films.

  2. Temperature-dependent reflectivity of silicon carbide

    NASA Technical Reports Server (NTRS)

    Ng, Daniel

    1992-01-01

    The spectral reflectivity of a commercial silicon carbide (SiC) ceramic surface was measured at wavelengths from 2.5 to 14.5 microns and at temperatures ranging from 358 to 520 K using a NASA-developed multiwavelength pyrometer. The SiC surface reflectivity was low at the short wavelengths, decreasing to almost zero at 10 microns, then increasing rapidly to a maximum at approximately 12.5 microns, and decreasing gradually thereafter. The reflectivity maximum increased in magnitude with increasing surface temperature. The wavelength and temperature dependence can be explained in terms of the classical dispersion theory of crystals and the Lorentz electron theory. Electronic transitions between the donor state and the conduction band states were responsible for the dispersion. The concentration of the donor state in SiC was determined to be approximately 4 x 10 exp 18 and its ionization energy was determined to be approximately 71 meV.

  3. Method of producing silicon carbide articles

    DOEpatents

    Milewski, John V.

    1985-01-01

    A method of producing articles comprising reaction-bonded silicon carbide (SiC) and graphite (and/or carbon) is given. The process converts the graphite (and/or carbon) in situ to SiC, thus providing the capability of economically obtaining articles made up wholly or partially of SiC having any size and shape in which graphite (and/or carbon) can be found or made. When the produced articles are made of an inner graphite (and/or carbon) substrate to which SiC is reaction bonded, these articles distinguish SiC-coated graphite articles found in the prior art by the feature of a strong bond having a gradual (as opposed to a sharply defined) interface which extends over a distance of mils. A method for forming SiC whisker-reinforced ceramic matrices is also given. The whisker-reinforced articles comprise SiC whiskers which substantially retain their structural integrity.

  4. Comparison of silicon oxide and silicon carbide absorber materials in silicon thin-film solar cells

    NASA Astrophysics Data System (ADS)

    Walder, Cordula; Kellermann, Martin; Wendler, Elke; Rensberg, Jura; von Maydell, Karsten; Agert, Carsten

    2015-02-01

    Since solar energy conversion by photovoltaics is most efficient for photon energies at the bandgap of the absorbing material the idea of combining absorber layers with different bandgaps in a multijunction cell has become popular. In silicon thin-film photovoltaics a multijunction stack with more than two subcells requires a high bandgap amorphous silicon alloy top cell absorber to achieve an optimal bandgap combination. We address the question whether amorphous silicon carbide (a-SiC:H) or amorphous silicon oxide (a-SiO:H) is more suited for this type of top cell absorber. Our single cell results show a better performance of amorphous silicon carbide with respect to fill factor and especially open circuit voltage at equivalent Tauc bandgaps. The microstructure factor of single layers indicates less void structure in amorphous silicon carbide than in amorphous silicon oxide. Yet photoconductivity of silicon oxide films seems to be higher which could be explained by the material being not truly intrinsic. On the other hand better cell performance of amorphous silicon carbide absorber layers might be connected to better hole transport in the cell.

  5. Amorphous silicon carbide films prepared using vaporized silicon ink

    NASA Astrophysics Data System (ADS)

    Masuda, Takashi; Shen, Zhongrong; Takagishi, Hideyuki; Ohdaira, Keisuke; Shimoda, Tatsuya

    2014-03-01

    The deposition of wide-band-gap silicon films using nonvacuum processes rather than conventional vacuum processes is of substantial interest because it may reduce cost. Herein, we present the optical and electrical properties of p-type hydrogenated amorphous silicon carbide (a-SiC:H) films prepared using a nonvacuum process in a simple chamber with a vaporized silicon ink consisting of cyclopentasilane, cyclohexene, and decaborane. The incorporation of carbon into the silicon network induced by the addition of cyclohexene to the silicon ink resulted in an increase in the optical band gap (Eg) of films from 1.56 to 2.11 eV. The conductivity of films with Eg < 1.9 eV is comparable to that of conventional a-SiC:H films prepared using a vacuum process, while the films with Eg > 1.9 eV show lower conductivity than expected because of the incorporation of excess carbon without the formation of Si-C bonds.

  6. A review of oxide, silicon nitride, and silicon carbide brazing

    SciTech Connect

    Santella, M.L.; Moorhead, A.J.

    1987-01-01

    There is growing interest in using ceramics for structural applications, many of which require the fabrication of components with complicated shapes. Normal ceramic processing methods restrict the shapes into which these materials can be produced, but ceramic joining technology can be used to overcome many of these limitations, and also offers the possibility for improving the reliability of ceramic components. One method of joining ceramics is by brazing. The metallic alloys used for bonding must wet and adhere to the ceramic surfaces without excessive reaction. Alumina, partially stabilized zirconia, and silicon nitride have high ionic character to their chemical bonds and are difficult to wet. Alloys for brazing these materials must be formulated to overcome this problem. Silicon carbide, which has some metallic characteristics, reacts excessively with many alloys, and forms joints of low mechanical strength. The brazing characteristics of these three types of ceramics, and residual stresses in ceramic-to-metal joints are briefly discussed.

  7. Silicon carbide nanowires synthesized with phenolic resin and silicon powders

    NASA Astrophysics Data System (ADS)

    Zhao, Hongsheng; Shi, Limin; Li, Ziqiang; Tang, Chunhe

    2009-02-01

    Large-scale silicon carbide nanowires with the lengths up to several millimeters were synthesized by a coat-mix, moulding, carbonization, and high-temperature sintering process, using silicon powder and phenolic resin as the starting materials. Ordinary SiC nanowires, bamboo-like SiC nanowires, and spindle SiC nanochains are found in the fabricated samples. The ordinary SiC nanowire is a single-crystal SiC phase with a fringe spacing of 0.252 nm along the [1 1 1] growth direction. Both of the bamboo-like SiC nanowires and spindle SiC nanochains exhibit uniform periodic structures. The bamboo-like SiC nanowires consist of amorphous stem and single-crystal knots, while the spindle SiC nanochains consist of uniform spindles which grow uniformly on the entire nanowires.

  8. Silicon carbide materials for high duty seal applications

    SciTech Connect

    Berroth, K.E. )

    1990-12-01

    Properties, fabrication, and high-duty applications of silicon carbide grades are discussed. The two types of silicon carbide, i.e., reaction-bonded and sintered, are considered. The potential for adhesion and the lack of dry running abilities lead to a variety of microstructures. For reaction-bonded silicon carbide, the microstructure can be a tool for optimization of the tribological behavior. Besides the high corrosion resistance of the material, its thermal conductivity is excellent. Grain sizes of about 40-50 microns are used in high-duty applications. Reaction-bonded silicon carbide with residual content of carbon graphite has improved tribological/hydrodynamic characteristics and performs well in sealing hard faces.

  9. Conventional and Microwave Joining of Silicon Carbide Using Displacement Reactions

    NASA Technical Reports Server (NTRS)

    Kingsley, J.; Yiin, T.; Barmatz, M.

    1995-01-01

    Microwave heating was used to join Silicon Carbide rods using a thin TiC /Si tape interlayer . Microwaves quickly heated the rods and tape to temperatures where solid-state displacement reactions between TiC and Si occurred.

  10. Tribological properties of silicon carbide in metal removal process

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1980-01-01

    This paper reviews material properties of adhesion, friction and wear of single-crystal silicon carbide in contact with metals and alloys involved in a metal removal process such as grinding. The tribological properties in the metal removal processes are divided into properties which remove metal by adhesion between sliding surfaces, and metal removal by silicon carbide sliding against a metal, indenting it, and plowing a series of grooves or furrows. The paper also deals with fracture and deformation characteristics of the silicon carbide surface; the adhesion, friction and metal transfer to silicon carbide is related to the relative chemical activity of the metals. Atomic size and content of alloying elements play a dominant role in controlling adhesion and friction properties of alloys. The friction and abrasive wear decrease as the shear strength of the bulk metal increases.

  11. Silicon carbide for high-temperature heat exchangers

    NASA Astrophysics Data System (ADS)

    Penty, R. A.; Bjerklie, J. W.

    1982-02-01

    It is noted that ceramic heat exchangers are now being used industrially in low-pressure applications, such as recuperators and air preheaters, and that serious consideration is being given to using ceramic materials for high-pressure heat exchangers. The principal advantage of using ceramic heat exchangers in the candidate applications is the potential for higher temperature service or increased life over that obtainable with metallic exchangers. Silicon carbide-based materials are now in service in many areas. The use of low-pressure ceramic recuperators constructed of silicon carbide has demonstrated fuel savings exceeding 40% in high-temperature industrial furnaces. At a material temperature of 1375 C, the demonstrated lifetime of some silicon carbide tubes is 12 to 15 months. The availability of silicon carbide materials is discussed, together with properties required for designing reliable heat exchangers. Attention is also given to the usual failure mode encountered in the field.

  12. Process for preparing fine grain silicon carbide powder

    DOEpatents

    Wei, G.C.

    Method of producing fine-grain silicon carbide powder comprises combining methyltrimethoxysilane with a solution of phenolic resin, acetone and water or sugar and water, gelling the resulting mixture, and then drying and heating the obtained gel.

  13. Single-Event Effects in Silicon Carbide Power Devices

    NASA Technical Reports Server (NTRS)

    Lauenstein, Jean-Marie; Casey, Megan C.; LaBel, Kenneth A.; Ikpe, Stanley; Topper, Alyson D.; Wilcox, Edward P.; Kim, Hak; Phan, Anthony M.

    2015-01-01

    This report summarizes the NASA Electronic Parts and Packaging Program Silicon Carbide Power Device Subtask efforts in FY15. Benefits of SiC are described and example NASA Programs and Projects desiring this technology are given. The current status of the radiation tolerance of silicon carbide power devices is given and paths forward in the effort to develop heavy-ion single-event effect hardened devices indicated.

  14. High-Q silicon carbide photonic-crystal cavities

    NASA Astrophysics Data System (ADS)

    Lee, Jonathan Y.; Lu, Xiyuan; Lin, Qiang

    2015-01-01

    We demonstrate one-dimensional photonic-crystal nanobeam cavities in amorphous silicon carbide. The fundamental mode exhibits intrinsic optical quality factor as high as 7.69 × 104 with mode volume ˜ 0.60 ( λ / n ) 3 at wavelength 1.5 μm. A corresponding Purcell factor value of ˜104 is the highest reported to date in silicon carbide optical cavities. The device exhibits great potential for integrated nonlinear photonics and cavity nano-optomechanics.

  15. Tribological properties of silicon carbide in metal removal process

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1980-01-01

    Material properties are considered as they relate to adhesion, friction, and wear of single crystal silicon carbide in contact with metals and alloys that are likely to be involved in a metal removal process such as grinding. Metal removal from adhesion between sliding surfaces in contact and metal removal as a result of the silicon carbide sliding against a metal, indenting into it, and plowing a series of grooves or furrows are discussed. Fracture and deformation characteristics of the silicon carbide surface are also covered. The adhesion, friction, and metal transfer to silicon carbide is related to the relative chemical activity of the metals. The more active the metal, the higher the adhesion and friction, and the greater the metal transfer to silicon carbide. Atomic size and content of alloying elements play a dominant role in controlling adhesion, friction, and abrasive wear properties of alloys. The friction and abrasive wear (metal removal) decrease linearly as the shear strength of the bulk metal increases. They decrease as the solute to solvent atomic radius ratio increases or decreases linearly from unity, and with an increase of solute content. The surface fracture of silicon carbide is due to cleavages of 0001, 10(-1)0, and/or 11(-2)0 planes.

  16. Thermal properties of wood-derived silicon carbide and copper-silicon carbide composites

    NASA Astrophysics Data System (ADS)

    Pappecena, Kristen E.

    Wood-derived ceramics and composites have been of interest in recent years due to their unique microstructures, which lead to tailorable properties. The porosity and pore size distribution of each wood type is different, which yields variations in properties in the resultant materials. The thermal properties of silicon carbide ceramics and copper-silicon carbide composites derived from wood were studied as a function of their pore structures. Wood was pyrolyzed at temperatures ranging from 300-2400°C to yield porous carbon. The progression toward long-range order was studied as a function of pyrolyzation temperature. Biomorphic silicon carbide (bioSiC) is a porous ceramic material resulting from silicon melt infiltration of these porous carbon materials. BioSiC has potential applicability in many high temperature environments, particularly those in which rapid temperature changes occur. To understand the behavior of bioSiC at elevated temperatures, the thermal and thermo-mechanical properties were studied. The thermal conductivity of bioSiC from five precursors was determined using flash diffusivity at temperatures up to 1100°C. Thermal conductivity results varied with porosity, temperature and orientation, and decreased from 42-13 W/mK for porosities of 43-69%, respectively, at room temperature. The results were compared with to object-oriented finite-element analysis (OOF). OOF was also used to model and understand the heat-flow paths through the complex bioSiC microstructures. The thermal shock resistance of bioSiC was also studied, and no bioSiC sample was found to fail catastrophically after up to five thermal shock cycles from 1400°C to room temperature oil. Copper-silicon carbide composites have potential uses in thermal management applications due to the high thermal conductivity of each phase. Cu-bioSiC composites were created by electrodeposition of copper into bioSiC pores. The detrimental Cu-SiC reaction was avoided by using this room temperature

  17. Friction and wear behavior of single-crystal silicon carbide in contact with titanium

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1977-01-01

    Sliding friction experiments were conducted with single crystal silicon carbide in sliding contact with titanium. Results indicate that the friction coefficient is greater in vacuum than in argon and that this is due to the greater adhesion or adhesive transfer in vacuum. Thin films of silicon carbide transferred to titanium also adhered to silicon carbide both in argon at atmospheric pressure and in high vacuum. Cohesive bonds fractured on both the silicon carbide and titanium surfaces. The wear debris of silicon carbide created by fracture plowed the silicon carbide surface in a plastic manner. The friction characteristics of titanium in contact with silicon carbide were sensitive to the surface roughness of silicon carbide, and the friction coefficients were higher for a rough surface of silicon carbide than for a smooth one. The difference in friction results was due to plastic deformation (plowing of titanium).

  18. Silicon nano-carbide in strengthening and ceramic technologies

    NASA Astrophysics Data System (ADS)

    Rudneva, V. V.; Galevsky, G. V.; Kozyrev, N. A.

    2015-09-01

    Technological advantages and conditions of new quality assurance of coatings and products, provided by silicon nano-carbide, have been ascertained in the course of composite electrodeposition of coatings, structural ceramics patterning, and surface hardening of steels via electro-explosive alloying. Silicon nano-carbide has been recommended to be used as a component of wear and corrosion resistant chromium carbide electrodeposited coatings, which can be operated at high temperatures and used for strengthening tools and equipment including those with a complex microrelief of functional surfaces. Silicon nano-carbide as a component of composite “silicon carbide - boron - carbon” can be applied to produce ceramic half products via solid phase sintering in argon under pressure of 0.1 MPa and temperature 2273 K. Application of silicon nano-carbide in technology of tool steel surface hardening via electroexplosive alloying ensures obtaining of a high micro-hard, wear and heat resistant shielding layer which is about 20 μm deep.

  19. Process for coating an object with silicon carbide

    NASA Technical Reports Server (NTRS)

    Levin, Harry (Inventor)

    1989-01-01

    A process for coating a carbon or graphite object with silicon carbide by contacting it with silicon liquid and vapor over various lengths of contact time. In the process, a stream of silicon-containing precursor material in gaseous phase below the decomposition temperature of said gas and a co-reactant, carrier or diluent gas such as hydrogen is passed through a hole within a high emissivity, thin, insulating septum into a reaction chamber above the melting point of silicon. The thin septum has one face below the decomposition temperature of the gas and an opposite face exposed to the reaction chamber. The precursor gas is decomposed directly to silicon in the reaction chamber. A stream of any decomposition gas and any unreacted precursor gas from said reaction chamber is removed. The object within the reaction chamber is then contacted with silicon, and recovered after it has been coated with silicon carbide.

  20. Aluminum-silicon eutectic alloy improves electrical and mechanical contact to silicon carbide

    NASA Technical Reports Server (NTRS)

    Shier, J. S.

    1970-01-01

    Alloy contact layer is made at relatively low temperature and has good wetting characteristics. Contacts adhere well to silicon carbide surface, penetrating about 300 to 500 angstroms into it. Contacts are ohmic on p-type silicon carbide and blocking on n-type.

  1. Bright Single Photon Emitter in Silicon Carbide

    NASA Astrophysics Data System (ADS)

    Lienhard, Benjamin; Schroeder, Tim; Mouradian, Sara; Dolde, Florian; Trong Tran, Toan; Aharonovich, Igor; Englund, Dirk

    Efficient, on-demand, and robust single photon emitters are of central importance to many areas of quantum information processing. Over the past 10 years, color centers in solids have emerged as excellent single photon emitters. Color centers in diamond are among the most intensively studied single photon emitters, but recently silicon carbide (SiC) has also been demonstrated to be an excellent host material. In contrast to diamond, SiC is a technologically important material that is widely used in optoelectronics, high power electronics, and microelectromechanical systems. It is commercially available in sizes up to 6 inches and processes for device engineering are well developed. We report on a visible-spectrum single photon emitter in 4H-SiC. The emitter is photostable at both room and low temperatures, and it enables 2 million photons/second from unpatterned bulk SiC. We observe two classes of orthogonally polarized emitters, each of which has parallel absorption and emission dipole orientations. Low temperature measurements reveal a narrow zero phonon line with linewidth < 0.1 nm that accounts for more than 30% of the total photoluminescence spectrum. To our knowledge, this SiC color emitter is the brightest stable room-temperature single photon emitter ever observed.

  2. Palladium Implanted Silicon Carbide for Hydrogen Sensing

    NASA Technical Reports Server (NTRS)

    Muntele, C. I.; Ila, D.; Zimmerman, R. L.; Muntele, L.; Poker, D. B.; Hensley, D. K.; Larkin, David (Technical Monitor)

    2001-01-01

    Silicon carbide is intended for use in fabrication of high-temperature, efficient hydrogen sensors. Traditionally, when a palladium coating is applied on the exposed surface of SiC, the chemical reaction between palladium and hydrogen produces a detectable change in the surface chemical potential. We have produced both a palladium coated SiC as well as a palladium, ion implanted SiC sensor. The palladium implantation was done at 500 C into the Si face of 6H, N-type SiC at various energies, and at various fluences. Then, we measured the hydrogen sensitivity response of each fabricated sensor by exposing them to hydrogen while monitoring the current flow across the p-n junction(s), with respect to time. The sensitivity of each sensor was measured at temperatures between 27 and 300 C. The response of the SiC sensors produced by Pd implantation has revealed a completely different behaviour than the SiC sensors produced by Pd deposition. In the Pd-deposited SiC sensors as well as in the ones reported in the literature, the current rises in the presence of hydrogen at room temperature as well as at elevated temperatures. In the case of Pd-implanted SiC sensors, the current decreases in the presence of hydrogen whenever the temperature is raised above 100 C. We will present the details and conclusions from the results obtained during this meeting.

  3. Improved silicon carbide for advanced heat engines

    NASA Technical Reports Server (NTRS)

    Whalen, Thomas J.

    1989-01-01

    The development of high strength, high reliability silicon carbide parts with complex shapes suitable for use in advanced heat engines is studied. Injection molding was the forming method selected for the program because it is capable of forming complex parts adaptable for mass production on an economically sound basis. The goals were to reach a Weibull characteristic strength of 550 MPa (80 ksi) and a Weibull modulus of 16 for bars tested in four-point loading. Statistically designed experiments were performed throughout the program and a fluid mixing process employing an attritor mixer was developed. Compositional improvements in the amounts and sources of boron and carbon used and a pressureless sintering cycle were developed which provided samples of about 99 percent of theoretical density. Strengths were found to improve significantly by annealing in air. Strengths in excess of 550 MPa (80 ksi) with Weibull modulus of about 9 were obtained. Further improvements in Weibull modulus to about 16 were realized by proof testing. This is an increase of 86 percent in strength and 100 percent in Weibull modulus over the baseline data generated at the beginning of the program. Molding yields were improved and flaw distributions were observed to follow a Poisson process. Magic angle spinning nuclear magnetic resonance spectra were found to be useful in characterizing the SiC powder and the sintered samples. Turbocharger rotors were molded and examined as an indication of the moldability of the mixes which were developed in this program.

  4. Material testing of silicon carbide mirrors

    NASA Astrophysics Data System (ADS)

    Witkin, David B.; Palusinski, Iwona A.

    2009-08-01

    The Aerospace Corporation is developing a space qualification method for silicon carbide optical systems that covers material verification through system development. One of the initial efforts has been to establish testing protocols for material properties. Three different tests have been performed to determine mechanical properties of SiC: modulus of rupture, equibiaxial flexural strength and fracture toughness. Testing materials and methods have been in accordance with the respective ASTM standards. Material from four vendors has been tested to date, as part of the MISSE flight program and other programs. Data analysis has focused on the types of issues that are important when building actual components- statistical modeling of test results, understanding batch-to-batch or other source material variations, and relating mechanical properties to microstructures. Mechanical properties are needed as inputs to design trade studies and development and analysis of proof tests, and to confirm or understand the results of non-destructive evaluations of the source materials. Measuring these properties using standardized tests on a statistically valid number of samples is intended to increase confidence for purchasers of SiC spacecraft components that materials and structures will perform as intended at the highest level of reliability.

  5. Casimir forces from conductive silicon carbide surfaces

    NASA Astrophysics Data System (ADS)

    Sedighi, M.; Svetovoy, V. B.; Broer, W. H.; Palasantzas, G.

    2014-05-01

    Samples of conductive silicon carbide (SiC), which is a promising material due to its excellent properties for devices operating in severe environments, were characterized with the atomic force microscope for roughness, and the optical properties were measured with ellipsometry in a wide range of frequencies. The samples show significant far-infrared absorption due to concentration of charge carriers and a sharp surface phonon-polariton peak. The Casimir interaction of SiC with different materials is calculated and discussed. As a result of the infrared structure and beyond to low frequencies, the Casimir force for SiC-SiC and SiC-Au approaches very slowly the limit of ideal metals, while it saturates significantly below this limit if interaction with insulators takes place (SiC-SiO2). At short separations (<10 nm) analysis of the van der Waals force yielded Hamaker constants for SiC-SiC interactions lower but comparable to those of metals, which is of significance to adhesion and surface assembly processes. Finally, bifurcation analysis of microelectromechanical system actuation indicated that SiC can enhance the regime of stable equilibria against stiction.

  6. Thermal equation of state of silicon carbide

    NASA Astrophysics Data System (ADS)

    Wang, Yuejian; Liu, Zhi T. Y.; Khare, Sanjay V.; Collins, Sean Andrew; Zhang, Jianzhong; Wang, Liping; Zhao, Yusheng

    2016-02-01

    A large volume press coupled with in-situ energy-dispersive synchrotron X-ray was used to probe the change of silicon carbide (SiC) under high pressure and temperature (P-T) up to 8.1 GPa and 1100 K. The obtained pressure-volume-temperature data were fitted to a modified high-T Birch-Murnaghan equation of state, yielding values of a series of thermo-elastic parameters, such as the ambient bulk modulus KTo = 237(2) GPa, temperature derivative of the bulk modulus at a constant pressure (∂K/∂T)P = -0.037(4) GPa K-1, volumetric thermal expansivity α(0, T) = a + bT with a = 5.77(1) × 10-6 K-1 and b = 1.36(2) × 10-8 K-2, and pressure derivative of the thermal expansion at a constant temperature (∂α/∂P)T = 6.53 ± 0.64 × 10-7 K-1 GPa-1. Furthermore, we found the temperature derivative of the bulk modulus at a constant volume, (∂KT/∂T)V, equal to -0.028(4) GPa K-1 by using a thermal pressure approach. In addition, the elastic properties of SiC were determined by density functional theory through the calculation of Helmholtz free energy. The computed results generally agree well with the experimentally determined values.

  7. Methods for producing silicon carbide architectural preforms

    NASA Technical Reports Server (NTRS)

    DiCarlo, James A. (Inventor); Yun, Hee (Inventor)

    2010-01-01

    Methods are disclosed for producing architectural preforms and high-temperature composite structures containing high-strength ceramic fibers with reduced preforming stresses within each fiber, with an in-situ grown coating on each fiber surface, with reduced boron within the bulk of each fiber, and with improved tensile creep and rupture resistance properties for each fiber. The methods include the steps of preparing an original sample of a preform formed from a pre-selected high-strength silicon carbide ceramic fiber type, placing the original sample in a processing furnace under a pre-selected preforming stress state and thermally treating the sample in the processing furnace at a pre-selected processing temperature and hold time in a processing gas having a pre-selected composition, pressure, and flow rate. For the high-temperature composite structures, the method includes additional steps of depositing a thin interphase coating on the surface of each fiber and forming a ceramic or carbon-based matrix within the sample.

  8. Irradiation creep of advanced silicon carbide fibers

    NASA Astrophysics Data System (ADS)

    Scholz, R.; Youngblood, G. E.

    2000-12-01

    The bend stress relaxation (BSR) method was applied to study irradiation enhanced creep (IEC) of small diameter silicon carbide (SiC) fibers after 10 MeV proton irradiation. A first series of tests was conducted on Sylramic™ fibers irradiated at 600°C with average bending stresses of 400 and 667 MPa and for irradiation doses smaller than 0.04 dpa. The BSR results are compared to previously obtained torsional creep test results for the Textron SCS-6™ type SiC fibers by calculating the tensile equivalents for both testing methods. For the Sylramic fibers, the creep constant κ=4.7×10-6 Mpa-1 dpa-1, was a factor of 6 smaller than the κ-value determined for SCS-6 fibers at 600°C. In contrast, for T<900°C the κ-value determined by R.J. Price [Nucl. Technol. 35 (1977) 320] for high purity monolithic β-Si after 7.7 dpa neutron irradiation was only 0.4×10-6 MPa-1 dpa-1.

  9. Silicon Carbide Technologies for Lightweighted Aerospace Mirrors

    NASA Astrophysics Data System (ADS)

    Matson, L.; Chen, M.; Deblonk, B.; Palusinski, I.

    The use of monolithic glass and beryllium to produce lightweighted aerospace mirror systems has reached its limits due to the long lead times, high processing costs, environmental effects and launch load/weight requirements. New material solutions and manufacturing processes are required to meet DoD's directed energy weapons, reconnaissance/surveillance, and secured communications needs. Over the past several years the Air Force, MDA, and NASA has focused their efforts on the fabrication, lightweighting, and scale-up of numerous silicon carbide (SiC) based materials. It is anticipated that SiC can be utilized for most applications from cryogenic to high temperatures. This talk will focus on describing the SOA for these (near term) SiC technology solutions for making mirror structural substrates, figuring and finishing technologies being investigated to reduce cost time and cost, and non-destructive evaluation methods being investigated to help eliminate risk. Mirror structural substrates made out of advanced engineered materials (far term solutions) such as composites, foams, and microsphere arrays for ultra lightweighting will also be briefly discussed.

  10. Casimir force measurements from silicon carbide surfaces

    NASA Astrophysics Data System (ADS)

    Sedighi, M.; Svetovoy, V. B.; Palasantzas, G.

    2016-02-01

    Using an atomic force microscope we performed measurements of the Casimir force between a gold- coated (Au) microsphere and doped silicon carbide (SiC) samples. The last of these is a promising material for devices operating under severe environments. The roughness of the interacting surfaces was measured to obtain information for the minimum separation distance upon contact. Ellipsometry data for both systems were used to extract optical properties needed for the calculation of the Casimir force via the Lifshitz theory and for comparison to the experiment. Special attention is devoted to the separation of the electrostatic contribution to the measured total force. Our measurements demonstrate large contact potential V0(≈0.67 V ) , and a relatively small density of charges trapped in SiC. Knowledge of both Casimir and electrostatic forces between interacting materials is not only important from the fundamental point of view, but also for device applications involving actuating components at separations of less than 200 nm where surface forces play dominant role.

  11. The diffusion bonding of silicon carbide and boron carbide using refractory metals

    SciTech Connect

    Cockeram, B.V.

    1999-10-01

    Joining is an enabling technology for the application of structural ceramics at high temperatures. Metal foil diffusion bonding is a simple process for joining silicon carbide or boron carbide by solid-state, diffusive conversion of the metal foil into carbide and silicide compounds that produce bonding. Metal diffusion bonding trials were performed using thin foils (5 {micro}m to 100 {micro}m) of refractory metals (niobium, titanium, tungsten, and molybdenum) with plates of silicon carbide (both {alpha}-SiC and {beta}-SiC) or boron carbide that were lapped flat prior to bonding. The influence of bonding temperature, bonding pressure, and foil thickness on bond quality was determined from metallographic inspection of the bonds. The microstructure and phases in the joint region of the diffusion bonds were evaluated using SEM, microprobe, and AES analysis. The use of molybdenum foil appeared to result in the highest quality bond of the metal foils evaluated for the diffusion bonding of silicon carbide and boron carbide. Bonding pressure appeared to have little influence on bond quality. The use of a thinner metal foil improved the bond quality. The microstructure of the bond region produced with either the {alpha}-SiC and {beta}-SiC polytypes were similar.

  12. Method for forming fibrous silicon carbide insulating material

    DOEpatents

    Wei, George C.

    1984-01-01

    A method whereby silicon carbide-bonded SiC fiber composites are prepared from carbon-bonded C fiber composites is disclosed. Carbon-bonded C fiber composite material is treated with gaseous silicon monoxide generated from the reaction of a mixture of colloidal silica and carbon black at an elevated temperature in an argon atmosphere. The carbon in the carbon bond and fiber is thus chemically converted to SiC resulting in a silicon carbide-bonded SiC fiber composite that can be used for fabricating dense, high-strength high-toughness SiC composites or as thermal insulating materials in oxidizing environments.

  13. Method for forming fibrous silicon carbide insulating material

    DOEpatents

    Wei, G.C.

    1983-10-12

    A method whereby silicon carbide-bonded SiC fiber composites are prepared from carbon-bonded C fiber composites is disclosed. Carbon-bonded C fiber composite material is treated with gaseous silicon monoxide generated from the reaction of a mixture of colloidal silica and carbon black at an elevated temperature in an argon atmosphere. The carbon in the carbon bond and fiber is thus chemically converted to SiC resulting in a silicon carbide-bonded SiC fiber composite that can be used for fabricating dense, high-strength high-toughness SiC composites or as thermal insulating materials in oxidizing environments.

  14. Surface Figure Measurement of Silicon Carbide Mirrors at Cryogenic Temperatures

    NASA Technical Reports Server (NTRS)

    Blake, Peter; Mink, Ronald G.; Chambers, John; Robinson, F. David; Content, David; Davila, Pamela

    2005-01-01

    The surface figure of a developmental silicon carbide mirror, cooled to 87 K and then 20 K within a cryostat, was measured with unusually high precision at the Goddard Space Flight Center (GSFC). The concave spherical mirror, with a radius of 600 mm and a clear aperture of 150 mm, was fabricated of sintered silicon carbide. The mirror was mounted to an interface plate representative of an optical bench, made of the material Cesic@, a composite of silicon, carbon, and silicon carbide. The change in optical surface figure as the mirror and interface plate cooled from room temperature to 20 K was 3.7 nm rms, with a standard uncertainty of 0.23 nm in the rms statistic. Both the cryo-change figure and the uncertainty are among the lowest such figures yet published. This report describes the facilities, experimental methods, and uncertainty analysis of the measurements.

  15. Pulsed energy synthesis and doping of silicon carbide

    DOEpatents

    Truher, J.B.; Kaschmitter, J.L.; Thompson, J.B.; Sigmon, T.W.

    1995-06-20

    A method for producing beta silicon carbide thin films by co-depositing thin films of amorphous silicon and carbon onto a substrate is disclosed, whereafter the films are irradiated by exposure to a pulsed energy source (e.g. excimer laser) to cause formation of the beta-SiC compound. Doped beta-SiC may be produced by introducing dopant gases during irradiation. Single layers up to a thickness of 0.5-1 micron have been produced, with thicker layers being produced by multiple processing steps. Since the electron transport properties of beta silicon carbide over a wide temperature range of 27--730 C is better than these properties of alpha silicon carbide, they have wide application, such as in high temperature semiconductors, including HETEROJUNCTION-junction bipolar transistors and power devices, as well as in high bandgap solar arrays, ultra-hard coatings, light emitting diodes, sensors, etc.

  16. Pulsed energy synthesis and doping of silicon carbide

    DOEpatents

    Truher, Joel B.; Kaschmitter, James L.; Thompson, Jesse B.; Sigmon, Thomas W.

    1995-01-01

    A method for producing beta silicon carbide thin films by co-depositing thin films of amorphous silicon and carbon onto a substrate, whereafter the films are irradiated by exposure to a pulsed energy source (e.g. excimer laser) to cause formation of the beta-SiC compound. Doped beta-SiC may be produced by introducing dopant gases during irradiation. Single layers up to a thickness of 0.5-1 micron have been produced, with thicker layers being produced by multiple processing steps. Since the electron transport properties of beta silicon carbide over a wide temperature range of 27.degree.-730.degree. C. is better than these properties of alpha silicon carbide, they have wide application, such as in high temperature semiconductors, including hetero-junction bipolar transistors and power devices, as well as in high bandgap solar arrays, ultra-hard coatings, light emitting diodes, sensors, etc.

  17. Occurrence of airborne silicon carbide fibers during industrial production of silicon carbide.

    PubMed

    Bye, E; Eduard, W; Gjønnes, J; Sørbrøden, E

    1985-04-01

    Airborne dust from the production of silicon carbide has been analyzed for particle morphology and composition. Fibers of alpha silicon carbide were identified by scanning electron microscopy (SEM) combined with energy dispersive X-ray spectrometry (EDS) and transmission electron microscopy (TEM) with selected area electron diffraction techniques (SAED). Micrographs taken at high magnification revealed several stacking periods along the fiber axis, and one or more of the polytypes 2H, 4H, or 6H could be distinguished. Preliminary investigations applying SEM showed that 80% of the fibers had diameters of less than 0.5 micron and a length greater than 5 micron. Fiber concentrations were examined by the counting of stationary and personal samples in an optical phase contrast microscope. The fiber levels in the three plants investigated were low and less than 1 fiber/cc of air (10(6) fibers/m3). Dust samples from the handling of raw material, including recycled material, contained up to 5 fibers/cc (5 X 10(6) fibers/m3). PMID:4001899

  18. Interface reactions between silicon carbide and interlayers in silicon carbide copper metal matrix composites

    NASA Astrophysics Data System (ADS)

    Köck, T.; Brendel, A.; Bolt, H.

    2007-05-01

    Novel copper matrix composites reinforced with silicon carbide fibres are considered as a new generation of heat sink materials for the divertor of future fusion reactors. The divertor is exposed to intense particle bombardment and heat loads of up to 15 MW m-2. This component consists of the plasma-facing material which is bonded to the actively cooled heat sink. Due to its high thermal conductivity of about 400 W m-1 K-1 copper is a promising material for the heat sink. To increase the mechanical properties of copper at working temperature (823 K), silicon carbide fibres with a diameter of 140 μm are used to reinforce the interface area between the plasma-facing material and the heat sink. Push-out tests show that the adhesion between SiC fibre and Cu matrix without any interlayer is very low. To increase the fibre-matrix bonding the fibres are coated with Cr and W with a thickness of 300-400 nm before Cu deposition by magnetron sputtering. Push-out tests on these modified fibres show a significant increase in adhesion compared to the fibres without interlayer. XRD investigations after a heat treatment at 923 K show a chromium carbide (Cr23C6, Cr3C2) formation and the absence of chromium silicides. In the case of a W interlayer a W2C formation is detected and also no tungsten silicides. Single-fibre tensile tests were performed to investigate the influence of the reaction zone on the ultimate tensile strength of the fibres. The ultimate tensile strength for fibres without interlayer remains constant at about 2200 MPa after annealing at 923 K. The fibres with chromium and tungsten interlayers, respectively, show a decrease of about 30% of the ultimate tensile strength after the heat treatment at 923 K.

  19. Diamond-Silicon Carbide Composite And Method For Preparation Thereof

    DOEpatents

    Qian, Jiang; Zhao, Yusheng

    2005-09-06

    Fully dense, diamond-silicon carbide composites are prepared from ball-milled microcrystalline diamond/amorphous silicon powder mixture. The ball-milled powder is sintered (P=5-8 GPa, T=1400K-2300K) to form composites having high fracture toughness. A composite made at 5 GPa/1673K had a measured fracture toughness of 12 MPa.multidot.m.sup.1/2. By contrast, liquid infiltration of silicon into diamond powder at 5 GPa/1673K produces a composite with higher hardness but lower fracture toughness. X-ray diffraction patterns and Raman spectra indicate that amorphous silicon is partially transformed into nanocrystalline silicon at 5 GPa/873K, and nanocrystalline silicon carbide forms at higher temperatures.

  20. Microwave versus conventional sintering of silicon carbide tiles

    SciTech Connect

    Kass, M.D.; Caughman, J.B.O.; Forrester, S.C.; Akerman, A.

    1997-05-07

    Silicon carbide is being evaluated as an armor material because of its lightweight, high-hardness, and excellent armor efficiency. However, one of the problems associated with silicon carbide is the high cost associated with achieving fully dense tiles. Full density requires either hot pressing and sintering or reaction bonding. Past efforts have shown that hot pressed tiles have a higher armor efficiency than those produced by reaction bonded sintering. An earlier stuy showed that the acoustic properties of fully-dense silicon carbide tiles were enhanced through the use of post-sintered microwave heat treatments. One of the least expensive forming techniques is to isostatically press-and-sinter. In this study, the authors have used microwave energy to densify silicon carbide green bodies. Microwave sintering has been demonstrated to be a very quick way to sinter ceramics such as alumina to exceptionally high densities. Previous work has shown that microwave post treatment of fully-dense reaction bonded silicon carbide tiles significantly improves the acoustic properties of the tiles. These properties include Poisson`s ratio, Young`s modulus, shear modulus, and bulk modulus.

  1. Silicon Carbide Diodes Performance Characterization and Comparison With Silicon Devices

    NASA Technical Reports Server (NTRS)

    Lebron-Velilla, Ramon C.; Schwarze, Gene E.; Trapp, Scott

    2003-01-01

    Commercially available silicon carbide (SiC) Schottky diodes from different manufacturers were electrically tested and characterized at room temperature. Performed electrical tests include steady state forward and reverse I-V curves, as well as switching transient tests performed with the diodes operating in a hard switch dc-to-dc buck converter. The same tests were performed in current state of the art silicon (Si) and gallium arsenide (GaAs) Schottky and pn junction devices for evaluation and comparison purposes. The SiC devices tested have a voltage rating of 200, 300, and 600 V. The comparison parameters are forward voltage drop at rated current, reverse current at rated voltage and peak reverse recovery currents in the dc to dc converter. Test results show that steady state characteristics of the tested SiC devices are not superior to the best available Si Schottky and ultra fast pn junction devices. Transient tests reveal that the tested SiC Schottky devices exhibit superior transient behavior. This is more evident at the 300 and 600 V rating where SiC Schottky devices showed drastically lower reverse recovery currents than Si ultra fast pn diodes of similar rating.

  2. Palladium-defect complexes in diamond and silicon carbide

    NASA Astrophysics Data System (ADS)

    Abiona, A. A.; Kemp, W.; Timmers, H.; Bharuth-Ram, K.

    2015-04-01

    Time Differential Perturbed Angular Correlations (TDPAC) studies, supported by Density Functional Theory (DFT) modelling, have shown that palladium atoms in silicon and germanium pair with vacancies. Building on these results, here we present DFT predictions and some tentative TDPAC results on palladium-defect complexes and site locations of palladium impurities in diamond and silicon carbide. For both diamond and silicon carbide, the DFT calculations predict that a split-vacancy V-PdBI-V complex is favoured, with the palladium atom on a bond-centred interstitial site having a nearest-neighbour semi-vacancy on either side. Consistent with experimental results, this configuration is also assigned to palladium complexes in silicon and germanium. For silicon carbide, the DFT modelling predicts furthermore that a palladium atom in replacing a carbon atom moves to a bond-centred interstitial site and pairs with a silicon vacancy to form a complex that is more stable than that of a palladium atom which replaces a silicon atom and then moves to a bond-centred interstitial site pairings with a carbon vacancy. These two competing alternatives differ by 8.94 eV. The favourable pairing with a silicon vacancy is also supported independently by TRIM Monte Carlo calculations, which predict that more silicon vacancies than carbon vacancies are created during heavy ion. implantation.

  3. Amorphous silicon carbide passivating layers for crystalline-silicon-based heterojunction solar cells

    NASA Astrophysics Data System (ADS)

    Boccard, Mathieu; Holman, Zachary C.

    2015-08-01

    Amorphous silicon enables the fabrication of very high-efficiency crystalline-silicon-based solar cells due to its combination of excellent passivation of the crystalline silicon surface and permeability to electrical charges. Yet, amongst other limitations, the passivation it provides degrades upon high-temperature processes, limiting possible post-deposition fabrication possibilities (e.g., forcing the use of low-temperature silver pastes). We investigate the potential use of intrinsic amorphous silicon carbide passivating layers to sidestep this issue. The passivation obtained using device-relevant stacks of intrinsic amorphous silicon carbide with various carbon contents and doped amorphous silicon are evaluated, and their stability upon annealing assessed, amorphous silicon carbide being shown to surpass amorphous silicon for temperatures above 300 °C. We demonstrate open-circuit voltage values over 700 mV for complete cells, and an improved temperature stability for the open-circuit voltage. Transport of electrons and holes across the hetero-interface is studied with complete cells having amorphous silicon carbide either on the hole-extracting side or on the electron-extracting side, and a better transport of holes than of electrons is shown. Also, due to slightly improved transparency, complete solar cells using an amorphous silicon carbide passivation layer on the hole-collecting side are demonstrated to show slightly better performances even prior to annealing than obtained with a standard amorphous silicon layer.

  4. Amorphous silicon carbide passivating layers for crystalline-silicon-based heterojunction solar cells

    DOE PAGESBeta

    Boccard, Mathieu; Holman, Zachary C.

    2015-08-14

    With this study, amorphous silicon enables the fabrication of very high-efficiency crystalline-silicon-based solar cells due to its combination of excellent passivation of the crystalline silicon surface and permeability to electrical charges. Yet, amongst other limitations, the passivation it provides degrades upon high-temperature processes, limiting possible post-deposition fabrication possibilities (e.g., forcing the use of low-temperature silver pastes). We investigate the potential use of intrinsic amorphous silicon carbide passivating layers to sidestep this issue. The passivation obtained using device-relevant stacks of intrinsic amorphous silicon carbide with various carbon contents and doped amorphous silicon are evaluated, and their stability upon annealing assessed, amorphousmore » silicon carbide being shown to surpass amorphous silicon for temperatures above 300°C. We demonstrate open-circuit voltage values over 700 mV for complete cells, and an improved temperature stability for the open-circuit voltage. Transport of electrons and holes across the hetero-interface is studied with complete cells having amorphous silicon carbide either on the hole-extracting side or on the electron-extracting side, and a better transport of holes than of electrons is shown. Also, due to slightly improved transparency, complete solar cells using an amorphous silicon carbide passivation layer on the hole-collecting side are demonstrated to show slightly better performances even prior to annealing than obtained with a standard amorphous silicon layer.« less

  5. Amorphous silicon carbide passivating layers for crystalline-silicon-based heterojunction solar cells

    SciTech Connect

    Boccard, Mathieu; Holman, Zachary C.

    2015-08-14

    With this study, amorphous silicon enables the fabrication of very high-efficiency crystalline-silicon-based solar cells due to its combination of excellent passivation of the crystalline silicon surface and permeability to electrical charges. Yet, amongst other limitations, the passivation it provides degrades upon high-temperature processes, limiting possible post-deposition fabrication possibilities (e.g., forcing the use of low-temperature silver pastes). We investigate the potential use of intrinsic amorphous silicon carbide passivating layers to sidestep this issue. The passivation obtained using device-relevant stacks of intrinsic amorphous silicon carbide with various carbon contents and doped amorphous silicon are evaluated, and their stability upon annealing assessed, amorphous silicon carbide being shown to surpass amorphous silicon for temperatures above 300°C. We demonstrate open-circuit voltage values over 700 mV for complete cells, and an improved temperature stability for the open-circuit voltage. Transport of electrons and holes across the hetero-interface is studied with complete cells having amorphous silicon carbide either on the hole-extracting side or on the electron-extracting side, and a better transport of holes than of electrons is shown. Also, due to slightly improved transparency, complete solar cells using an amorphous silicon carbide passivation layer on the hole-collecting side are demonstrated to show slightly better performances even prior to annealing than obtained with a standard amorphous silicon layer.

  6. Amorphous silicon carbide passivating layers for crystalline-silicon-based heterojunction solar cells

    SciTech Connect

    Boccard, Mathieu; Holman, Zachary C.

    2015-08-14

    Amorphous silicon enables the fabrication of very high-efficiency crystalline-silicon-based solar cells due to its combination of excellent passivation of the crystalline silicon surface and permeability to electrical charges. Yet, amongst other limitations, the passivation it provides degrades upon high-temperature processes, limiting possible post-deposition fabrication possibilities (e.g., forcing the use of low-temperature silver pastes). We investigate the potential use of intrinsic amorphous silicon carbide passivating layers to sidestep this issue. The passivation obtained using device-relevant stacks of intrinsic amorphous silicon carbide with various carbon contents and doped amorphous silicon are evaluated, and their stability upon annealing assessed, amorphous silicon carbide being shown to surpass amorphous silicon for temperatures above 300 °C. We demonstrate open-circuit voltage values over 700 mV for complete cells, and an improved temperature stability for the open-circuit voltage. Transport of electrons and holes across the hetero-interface is studied with complete cells having amorphous silicon carbide either on the hole-extracting side or on the electron-extracting side, and a better transport of holes than of electrons is shown. Also, due to slightly improved transparency, complete solar cells using an amorphous silicon carbide passivation layer on the hole-collecting side are demonstrated to show slightly better performances even prior to annealing than obtained with a standard amorphous silicon layer.

  7. A study of silicon carbide synthesis from waste serpentine.

    PubMed

    Cheng, T W; Hsu, C W

    2006-06-01

    There are 60000 tons of serpentine wastes produced in year 2004 in Taiwan. This is due to the well-developed joints in the serpentine ore body as well as the stringent requirements of the particle size and chemical composition of serpentine by iron making company. The waste also creates considerable environmental problems. The purpose of this study is reutilization of waste serpentine to produce a high value silica powder after acid leaching. These siliceous microstructure products obtained from serpentine would be responsible for high reactivity and characteristic molecular sieving effect. In this study, the amorphous silica powder was then synthesized to silicon carbide with the C/SiO(2) molar ratio of 3. The experiment results show that silicon carbide can be synthesized in 1550 degrees C. The formed silicon carbide was whisker beta type SiC which can be used as raw materials for industry. PMID:16405956

  8. Processing, texture and mechanical properties of sintered silicon carbide

    NASA Technical Reports Server (NTRS)

    Landfermann, H.; Hausner, H.

    1988-01-01

    With regard to its favorable properties, in particular those shown at high temperatures, silicon carbide is of great interest for applications related to the construction of engines and turbines. Thus, silicon carbide could replace heat-resisting alloys with the objective to achieve a further increase in operational temperature. The present investigation is concerned with approaches which can provide silicon carbide material with suitable properties for the intended applications, taking into account the relations between characteristics of the raw material, material composition, sinter conditions, and results of the sintering process. The effects of density and texture formation on the mechanical properties are studied. It is found that a dense material with a fine-grained microstructure provides optimal mechanical properties, while any deviation from this ideal condition can lead to a considerable deterioration with respect to the material properties.

  9. Solar silicon from directional solidification of MG silicon produced via the silicon carbide route

    NASA Technical Reports Server (NTRS)

    Rustioni, M.; Margadonna, D.; Pirazzi, R.; Pizzini, S.

    1986-01-01

    A process of metallurgical grade (MG) silicon production is presented which appears particularly suitable for photovoltaic (PV) applications. The MG silicon is prepared in a 240 KVA, three electrode submerged arc furnace, starting from high grade quartz and high purity silicon carbide. The silicon smelted from the arc furnace was shown to be sufficiently pure to be directionally solidified to 10 to 15 kg. After grinding and acid leaching, had a material yield larger than 90%. With a MG silicon feedstock containing 3 ppmw B, 290 ppmw Fe, 190 ppmw Ti, and 170 ppmw Al, blended with 50% of off grade electronic grade (EG) silicon to reconduct the boron content to a concentration acceptable for solar cell fabrication, the 99% of deep level impurities were concentrated in the last 5% of the ingot. Quite remarkably this material has OCV values higher tham 540 mV and no appreciable shorts due to SiC particles.

  10. Liquid-phase reaction-bonding of silicon carbide using alloyed silicon-molybdenum melts

    SciTech Connect

    Messner, R.P.; Chiang, Y.M. . Dept. of Materials Science and Engineering)

    1990-05-01

    The authors have investigated reaction-forming of silicon carbide by the infiltration of carbonaceous preforms using alloyed silicon melts, in order to synthesize composite materials free of the residual silicon phase that has previously limited mechanical properties and upper use temperatures. In this approach, rejection of the alloying component(s) from the primary silicon carbide phase into the remaining melt results in the formation of a secondary refractory phase, such as a silicide, in place of residual free silicon. Experiments conducted in the Si-Mo melt system show that relatively dense ({gt}90%) silicon carbide-molybdenum silicide materials free of residual silicon and residual carbon can be obtained. A model for reactive infiltration based on time-dependent permeabilities is proposed. Processing variables important for control of the reaction rate relative to the infiltration rate, and associated processing flaws, are discussed.

  11. The Active Oxidation of Silicon Carbide

    NASA Technical Reports Server (NTRS)

    Jacobson, Nathan S.; Myers, Dwight L.

    2009-01-01

    The high temperature oxidation of silicon carbide occurs in two very different modes. Passive oxidation forms a protective oxide film which limits further attack of the SiC: SiC(s) + 3/2 O2(g) = SiO2(s) + CO(g) Active oxidation forms a volatile oxide and may lead to extensive attack of the SiC: SiC(s) + O2(g) = SiO(g) + CO(g) Generally passive oxidation occurs at higher oxidant pressures and active oxidation occurs at lower oxidant pressures and elevated temperatures. Active oxidation is a concern for reentry, where the flight trajectory involves the latter conditions. Thus the transition points and rates of active oxidation are a major concern. Passive/active transitions have been studied by a number of investigators. An examination of the literature indicates many questions remain regarding the effect of impurity, the hysteresis of the transition (i.e. the difference between active-to-passive and passive-toactive), and the effect of total pressure. In this study we systematically investigate each of these effects. Experiments were done in both an alumina furnace tube and a quartz furnace tube. It is known that alumina tubes release impurities such as sodium and increase the kinetics in the passive region [1]. We have observed that the active-to-passive transition occurs at a lower oxygen pressure when the experiment is conducted in alumina tubes and the resultant passive silica scale contains sodium. Thus the tests in this study are conducted in quartz tubes. The hysteresis of the transition has been discussed in the detail in the original theoretical treatise of this problem for pure silicon by Wagner [2], yet there is little mention of it in subsequent literature. Essentially Wagner points out that the active-to-passive transition is governed by the criterion for a stable Si/SiO2 equilibria and the passive-to-active transition is governed by the decomposition of the SiO2 film. A series of experiments were conducted for active-to-passive and passive

  12. Role of silicon dangling bonds in the electronic properties of epitaxial graphene on silicon carbide.

    PubMed

    Ridene, Mohamed; Kha, Calvin S; Flipse, Cees F J

    2016-03-29

    In this paper, we study the electronic properties of epitaxial graphene (EG) on silicon carbide by means of ab initio calculations based on the local spin density approximation + U method taking into account the Coulomb interaction between Si localized electrons. We show that this interaction is not completely suppressed but is screened by carbon layers grown on-top of silicon carbide. This finding leads to a good qualitative understanding of the experimental results reported on EG on silicon carbide. Our results highlight the presence of the Si localized states and might explain the anomalous Hanle curve and the high values of spin relaxation time in EG. PMID:26891244

  13. Role of silicon dangling bonds in the electronic properties of epitaxial graphene on silicon carbide

    NASA Astrophysics Data System (ADS)

    Ridene, Mohamed; Kha, Calvin S.; Flipse, Cees F. J.

    2016-03-01

    In this paper, we study the electronic properties of epitaxial graphene (EG) on silicon carbide by means of ab initio calculations based on the local spin density approximation + U method taking into account the Coulomb interaction between Si localized electrons. We show that this interaction is not completely suppressed but is screened by carbon layers grown on-top of silicon carbide. This finding leads to a good qualitative understanding of the experimental results reported on EG on silicon carbide. Our results highlight the presence of the Si localized states and might explain the anomalous Hanle curve and the high values of spin relaxation time in EG.

  14. High-Q silicon carbide photonic-crystal cavities

    SciTech Connect

    Lee, Jonathan Y.; Lu, Xiyuan; Lin, Qiang

    2015-01-26

    We demonstrate one-dimensional photonic-crystal nanobeam cavities in amorphous silicon carbide. The fundamental mode exhibits intrinsic optical quality factor as high as 7.69 × 10{sup 4} with mode volume ∼0.60(λ/n){sup 3} at wavelength 1.5 μm. A corresponding Purcell factor value of ∼10{sup 4} is the highest reported to date in silicon carbide optical cavities. The device exhibits great potential for integrated nonlinear photonics and cavity nano-optomechanics.

  15. Electronic states in epitaxial graphene fabricated on silicon carbide

    SciTech Connect

    Davydov, S. Yu.

    2011-08-15

    An analytical expression for the density of states of a graphene monolayer interacting with a silicon carbide surface (epitaxial graphene) is derived. The density of states of silicon carbide is described within the Haldane-Anderson model. It is shown that the graphene-substrate interaction results in a narrow gap of {approx}0.01-0.06 eV in the density of states of graphene. The graphene atom charge is estimated; it is shown that the charge transfer from the substrate is {approx}10{sup -3}-10{sup -2}e per graphene atom.

  16. Flaw imaging and ultrasonic techniques for characterizing sintered silicon carbide

    NASA Technical Reports Server (NTRS)

    Baaklini, George Y.; Abel, Phillip B.

    1987-01-01

    The capabilities were investigated of projection microfocus x-radiography, ultrasonic velocity and attenuation, and reflection scanning acoustic microscopy for characterizing silicon carbide specimens. Silicon carbide batches covered a range of densities and different microstructural characteristics. Room temperature, four point flexural strength tests were conducted. Fractography was used to identify types, sizes, and locations of fracture origins. Fracture toughness values were calculated from fracture strength and flaw characterization data. Detection capabilities of radiography and acoustic microscopy for fracture-causing flaws were evaluated. Applicability of ultrasonics for verifying material strength and toughness was examined.

  17. Radiographic and ultrasonic characterization of sintered silicon carbide

    NASA Technical Reports Server (NTRS)

    Baaklini, G. Y.; Abel, P. B.

    1988-01-01

    The capabilities were investigated of projection microfocus X-radiography, ultrasonic velocity and attenuation, and reflection scanning acoustic microscopy for characterizing silicon carbide specimens. Silicon carbide batches covered a range of densities and different microstructural characteristics. Room temperature, four point flexural strength tests were conducted. Fractography was used to identify types, sizes, and locations of fracture origins. Fracture toughness values were calculated from fracture strength and flaw characterization data. Detection capabilities of radiography and acoustic microscopy for fracture-causing flaws were evaluated. Applicability of ultrasonics for verifying material strength and toughness was examined.

  18. Silicon carbide alloys: Research reports in materials science

    SciTech Connect

    Dobson, M.M.

    1986-01-01

    The book draws from work done on other silicon materials, silicon nitrides and sialons, to emphasize the importance of the SiC system. A comprehensive treatment of non-oxide silicon ceramics, this work is of special interest to researchers involved in ceramics, materials science, and high-temperature technology. This book covers the alloys of silicon carbide with aluminum nitride. Crystallography and experimental methods including sample preparation, furnace methods, X-ray and electron diffraction, optical and electron microscopy and chemical analysis are covered.

  19. Nuclear breeder reactor fuel element with silicon carbide getter

    DOEpatents

    Christiansen, David W.; Karnesky, Richard A.

    1987-01-01

    An improved cesium getter 28 is provided in a breeder reactor fuel element or pin in the form of an extended surface area, low density element formed in one embodiment as a helically wound foil 30 located with silicon carbide, and located at the upper end of the fertile material upper blanket 20.

  20. Silicon carbide and other films and method of deposition

    NASA Technical Reports Server (NTRS)

    Mehregany, Mehran (Inventor); Zorman, Christian A. (Inventor); Fu, Xiao-An (Inventor); Dunning, Jeremy L. (Inventor)

    2007-01-01

    A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

  1. Silicon carbide and other films and method of deposition

    NASA Technical Reports Server (NTRS)

    Mehregany, Mehran (Inventor); Zorman, Christian A. (Inventor); Fu, Xiao-An (Inventor); Dunning, Jeremy (Inventor)

    2011-01-01

    A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

  2. The development of silicon carbide-based power electronics devices

    NASA Astrophysics Data System (ADS)

    Hopkins, Richard H.; Perkins, John F.

    1995-01-01

    In 1989 Westinghouse created an internally funded initiative to develop silicon carbide materials and device technology for a variety of potential commercial and military applications. Westinghouse saw silicon carbide as having the potential for dual use. For space applications, size and weight reductions could be achieved, together with increased reliability. Terrestrially, uses in harsh-temperature environments would be enabled. Theoretically, the physical and electrical properties of silicon carbide were highly promising for high-power, high-temperature, radiation-hardened electronics. However, bulk material with the requisite electronic qualities was not available, and the methods needed to produce a silicon carbide wafer—to fabricate high-quality devices—and to transition these technologies into a commercial product were considered to be a high-risk investment. It was recognized that through a collaborative effort, the CCDS could provide scientific expertise in several areas, thus reducing this risk. These included modeling of structures, electrical contacts, dielectrics, and epitaxial growth. This collaboration has been very successful, with developed technologies being transferred to Westinghouse.

  3. Sintered silicon carbide molded body and method for its production

    NASA Technical Reports Server (NTRS)

    Omori, M.; Sendai, M.; Ohira, K.

    1984-01-01

    Sintered silicon carbide shapes are described. They are produced by using a composition containing an oxide of at least one element chosen from the group: Li, Be, Mg, Si, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Nb, Mo, Ba, Tc, Ta, W and Th as a supplement to known sintering aids.

  4. Improved epitaxial process for fabricating silicon carbide semiconductor devices

    NASA Technical Reports Server (NTRS)

    Will, H. A.; Powell, J. A.

    1974-01-01

    Process of growing expitaxial silicon carbide (SiC) layers on SiC substrates so that epitaxial growth is perpendicular to c-axis by chemical vapor deposition process at temperatures of 1590 to 1660 K minimizes variations in stacking sequence and problems associated with high temperatures.

  5. Mechanical properties of some silicon carbide reinforced aluminum composites

    SciTech Connect

    Tsangarakis, N.; Andrews, B.O.; Cavallaro, C.

    1987-05-01

    The mechanical properties of several particulate and continuous fiber silicon carbide-reinforced aluminum composites were examined. The tensile strength of a 47 percent silicon carbide fiber unidirectionally-reinforced aluminum composite was 1273 and 76 MPa parallel and normal to the fiber direction, respectively. The tensile strength of (0 deg/90 deg) 4s and (0/sub 2/90/0)s composites were 629 and 864 MPa, respectively. The tensile properties of a 30 percent silicon carbide particulate reinforced aluminum were found to depend on the chemistry of the metal matrix. The endurance limits of the fiber and the particulate reinforced aluminum were at the most 55 percent and 33 percent of the respective tensile strengths. The fracture toughness of the fiber reinforced composite varied with specimen width, while that of the particulate reinforced composite was 21-29 MPa sq rt m. The fatigue crack growth rate in the latter composite decreased with material thickness. There were indications that the fatigue crack growth rate in the silicon carbide particulate reinforced aluminum may be independent of variations in the chemistry of the metal matrix. 6 references.

  6. Analytical and experimental evaluation of joining silicon carbide to silicon carbide and silicon nitride to silicon nitride for advanced heat engine applications, phase 2

    NASA Astrophysics Data System (ADS)

    Sundberg, G. J.; Vartabedian, A. M.; Wade, J. A.; White, C. S.

    1994-10-01

    The purpose of joining, Phase 2 was to develop joining technologies for HIP'ed Si3N4 with 4wt% Y2O3 (NCX-5101) and for a siliconized SiC (NT230) for various geometries including: butt joins, curved joins and shaft to disk joins. In addition, more extensive mechanical characterization of silicon nitride joins to enhance the predictive capabilities of the analytical/numerical models for structural components in advanced heat engines was provided. Mechanical evaluation were performed by: flexure strength at 22 C and 1,370 C, stress rupture at 1,370 C, high temperature creep, 22 C tensile testing and spin tests. While the silicon nitride joins were produced with sufficient integrity for many applications, the lower join strength would limit its use in the more severe structural applications. Thus, the silicon carbide join quality was deemed unsatisfactory to advance to more complex, curved geometries. The silicon carbide joining methods covered within this contract, although not entirely successful, have emphasized the need to focus future efforts upon ways to obtain a homogeneous, well sintered parent/join interface prior to siliconization. In conclusion, the improved definition of the silicon carbide joining problem obtained by efforts during this contract have provided avenues for future work that could successfully obtain heat engine quality joins.

  7. Analytical and experimental evaluation of joining silicon carbide to silicon carbide and silicon nitride to silicon nitride for advanced heat engine applications Phase 2. Final report

    SciTech Connect

    Sundberg, G.J.; Vartabedian, A.M.; Wade, J.A.; White, C.S.

    1994-10-01

    The purpose of joining, Phase 2 was to develop joining technologies for HIP`ed Si{sub 3}N{sub 4} with 4wt% Y{sub 2}O{sub 3} (NCX-5101) and for a siliconized SiC (NT230) for various geometries including: butt joins, curved joins and shaft to disk joins. In addition, more extensive mechanical characterization of silicon nitride joins to enhance the predictive capabilities of the analytical/numerical models for structural components in advanced heat engines was provided. Mechanical evaluation were performed by: flexure strength at 22 C and 1,370 C, stress rupture at 1,370 C, high temperature creep, 22 C tensile testing and spin tests. While the silicon nitride joins were produced with sufficient integrity for many applications, the lower join strength would limit its use in the more severe structural applications. Thus, the silicon carbide join quality was deemed unsatisfactory to advance to more complex, curved geometries. The silicon carbide joining methods covered within this contract, although not entirely successful, have emphasized the need to focus future efforts upon ways to obtain a homogeneous, well sintered parent/join interface prior to siliconization. In conclusion, the improved definition of the silicon carbide joining problem obtained by efforts during this contract have provided avenues for future work that could successfully obtain heat engine quality joins.

  8. Fabrication and properties of silicon carbide nanowires

    NASA Astrophysics Data System (ADS)

    Shim, Hyun Woo

    2008-12-01

    Silicon carbide (SiC), with excellent electrical, thermal, and mechanical properties, is a promising material candidate for future devices such as high-temperature electronics and super-strong lightweight structures. Combined with superior intrinsic properties, the nanomaterials of SiC show further advantages thanks to nanoscale effects. This thesis reports the growth mechanism, the self-integration, and the friction of SiC nanowires. The study involves nanowires fabrication using thermal evaporation, structure characterization using electron microscopy, friction measurement, and theoretical modeling. The study on nanowire growth mechanism requires understanding of the surfaces and interfaces of nanowire crystal. The catalyzed growth of SiC nanowires involves interfaces between source vapor, catalytic liquid, and nanowire solid. Our experimental observation includes the periodical twinning in a faceted SiC nanowire and three stage structure transitions during the growth. The proposed theoretical model shows that such phenomenon is the result of surface energy minimization process during the catalytic growth. Surface interactions also exist between nanowires, leading to their self-integration. Our parametric growth study reveals novel self-integration of SiC-SiO 2 core-shell nanowires as a result of SiO2 joining. Attraction between nanowires through van der Waals force and enhanced SiO2 diffusion at high temperature transform individual nanowires to the integrated nanojunctions, nanocables, and finally nanowebs. We also show that such joining process becomes effective either during growth or by annealing. The solid friction is a result of the interaction between two solid surfaces, and it depends on the adhesion and the deformation of two contacting solids among other factors. Having strong adhesion as shown from gecko foot-hairs, nanostructured materials should also have strong friction; this study is the first to investigate friction of nanostructures under

  9. Silicon carbide high temperature thermoelectric flow sensor

    NASA Astrophysics Data System (ADS)

    Lei, Man I.

    Current high temperature flow measurement devices are bulky, expensive and have slow response time. Therefore, there has been increasing demand for developing a flow sensor that has high temperature capability yet is small in size, fast in response time, and low in cost through mass fabrication. In this thesis, a high temperature flow sensor utilizing micromachining and microfabrication technology has been designed, simulated, fabricated, packaged and tested. This micro flow sensor is developed based on heavily-nitrogen-doped polycrystalline silicon carbide (n-SiC) thin film, a high temperature semiconductor well known for its mechanical robustness and chemical inertness in high temperatures and harsh environments. The small thermal mass and wide operating temperature range provide an excellent platform for a flow sensor operating with the thermal sensing principle. The n-SiC thermoelectric flow sensor prototype developed here is based on the calorimetric sensing mechanism. The sensor has a n-SiC heater for thermal marker creation, an upstream and a downstream n-SiC/p-Si thermopile for flow sensing, and a n-SiC thermistor for ambient temperature monitoring. This device is packaged in a stainless steel enclosure with a bypass channel. The tested flow range is between 0 to 20,000 sccm. The flow sensor has demonstrated high temperature capability and mechanical robustness up to 450 °C on a hotplate at zero flow condition, and up to 300 °C in a heated flow stream. The device has a response time of 8 ms. Maximum power consumption is 96 mW when operated at 8 mA (12 V) and 45 mW when operated at 5 mA (9V), with a sensor warm-up time less than 1 minute. In addition, the thermoelectric properties of n-SiC have been thoroughly studied through the characterization of the electrical resistivity, the Seebeck coefficient and the thermal conductivity of n-SiC thin film. The 0.93 microm-thick, n-SiC thin film utilized in the thermoelectric flow sensor has an electrical

  10. Selective-area laser deposition (SALD) Joining of silicon carbide with silicon carbide filler

    NASA Astrophysics Data System (ADS)

    Harrison, Shay Llewellyn

    Selective Area Laser Deposition (SALD) is a gas-phase, solid freeform fabrication (SFF) process that utilizes a laser-driven, pyrolytic gas reaction to form a desired solid product. This solid product only forms in the heated zone of the laser beam and thus can be selectively deposited by control of the laser position. SALD Joining employs the SALD method to accomplish 'welding' of ceramic structures together. The solid reaction product serves as a filler material to bond the two parts. The challenges involved with ceramic joining center around the lack of a liquid phase, little plastic deformation and diffusivity and poor surface wetting for many ceramic materials. Due to these properties, traditional metal welding procedures cannot be applied to ceramics. Most alternative ceramic welding techniques use some form of a metal addition to overcome these material limitations. However, the metal possesses a lower ultimate use temperature than the ceramic substrate and therefore it decreases the temperature range over which the joined part can be safely used. SALD Joining enjoys several advantages over these ceramic welding procedures. The solid filler material chemistry can be tailored to match the type of ceramic substrate and therefore fabricate monolithic joints. The SALD filler material bonds directly to the substrate and the joined structure is made in a one step process, without any post-processing. The research documented in this dissertation focused on SALD Joining of silicon carbide structures with silicon carbide filler material. A historical progression of gas-phase SFF research and a literature review of the most prominent ceramic joining techniques are provided. A variety of SiC substrates were examined, as were various conditions of gas precursor pressures and mixtures, laser beam scan speed and joint configuration. The SALD material was characterized for composition and structure by x-ray diffraction, transmission electron microscopy and nuclear magnetic

  11. Method of fabricating silicon carbide coatings on graphite surfaces

    DOEpatents

    Varacalle, Jr., Dominic J.; Herman, Herbert; Burchell, Timothy D.

    1994-01-01

    The vacuum plasma spray process produces well-bonded, dense, stress-free coatings for a variety of materials on a wide range of substrates. The process is used in many industries to provide for the excellent wear, corrosion resistance, and high temperature behavior of the fabricated coatings. In this application, silicon metal is deposited on graphite. This invention discloses the optimum processing parameters for as-sprayed coating qualities. The method also discloses the effect of thermal cycling on silicon samples in an inert helium atmosphere at about 1600.degree.C. which transforms the coating to silicon carbide.

  12. Method of fabricating silicon carbide coatings on graphite surfaces

    DOEpatents

    Varacalle, D.J. Jr.; Herman, H.; Burchell, T.D.

    1994-07-26

    The vacuum plasma spray process produces well-bonded, dense, stress-free coatings for a variety of materials on a wide range of substrates. The process is used in many industries to provide for the excellent wear, corrosion resistance, and high temperature behavior of the fabricated coatings. In this application, silicon metal is deposited on graphite. This invention discloses the optimum processing parameters for as-sprayed coating qualities. The method also discloses the effect of thermal cycling on silicon samples in an inert helium atmosphere at about 1,600 C which transforms the coating to silicon carbide. 3 figs.

  13. Protective coating for alumina-silicon carbide whisker composites

    DOEpatents

    Tiegs, Terry N.

    1989-01-01

    Ceramic composites formed of an alumina matrix reinforced with silicon carbide whiskers homogenously dispersed therein are provided with a protective coating for preventing fracture strength degradation of the composite by oxidation during exposure to high temperatures in oxygen-containing atmospheres. The coating prevents oxidation of the silicon carbide whiskers within the matrix by sealing off the exterior of the matrix so as to prevent oxygen transport into the interior of the matrix. The coating is formed of mullite or mullite plus silicon oxide and alumina and is formed in place by heating the composite in air to a temperature greater than 1200.degree. C. This coating is less than about 100 microns thick and adequately protects the underlying composite from fracture strength degradation due to oxidation.

  14. Diffusion Bonding of Silicon Carbide Ceramics using Titanium Interlayers

    NASA Technical Reports Server (NTRS)

    Halbig, Michael C.; Singh, Mrityunjay; Shpargel, Tarah P.; Kiser, James D.

    2006-01-01

    Robust joining approaches for silicon carbide ceramics are critically needed to fabricate leak free joints with high temperature mechanical capability. In this study, titanium foils and physical vapor deposited (PVD) titanium coatings were used to form diffusion bonds between SiC ceramics using hot pressing. Silicon carbide substrate materials used for bonding include sintered SiC and two types of CVD SiC. Microscopy results show the formation of well adhered diffusion bonds. The bond strengths as determined from pull tests are on the order of several ksi, which is much higher than required for a proposed application. Microprobe results show the distribution of silicon, carbon, titanium, and other minor elements across the diffusion bond. Compositions of several phases formed in the joint region were identified. Potential issues of material compatibility and optimal bond formation will also be discussed.

  15. Catastrophic degradation of the interface of epitaxial silicon carbide on silicon at high temperatures

    NASA Astrophysics Data System (ADS)

    Pradeepkumar, Aiswarya; Mishra, Neeraj; Kermany, Atieh Ranjbar; Boeckl, John J.; Hellerstedt, Jack; Fuhrer, Michael S.; Iacopi, Francesca

    2016-07-01

    Epitaxial cubic silicon carbide on silicon is of high potential technological relevance for the integration of a wide range of applications and materials with silicon technologies, such as micro electro mechanical systems, wide-bandgap electronics, and graphene. The hetero-epitaxial system engenders mechanical stresses at least up to a GPa, pressures making it extremely challenging to maintain the integrity of the silicon carbide/silicon interface. In this work, we investigate the stability of said interface and we find that high temperature annealing leads to a loss of integrity. High-resolution transmission electron microscopy analysis shows a morphologically degraded SiC/Si interface, while mechanical stress measurements indicate considerable relaxation of the interfacial stress. From an electrical point of view, the diode behaviour of the initial p-Si/n-SiC junction is catastrophically lost due to considerable inter-diffusion of atoms and charges across the interface upon annealing. Temperature dependent transport measurements confirm a severe electrical shorting of the epitaxial silicon carbide to the underlying substrate, indicating vast predominance of the silicon carriers in lateral transport above 25 K. This finding has crucial consequences on the integration of epitaxial silicon carbide on silicon and its potential applications.

  16. SILICON CARBIDE CERAMICS FOR COMPACT HEAT EXCHANGERS

    SciTech Connect

    DR. DENNIS NAGLE; DR. DAJIE ZHANG

    2009-03-26

    Silicon carbide (SiC) materials are prime candidates for high temperature heat exchangers for next generation nuclear reactors due to their refractory nature and high thermal conductivity at elevated temperatures. This research has focused on demonstrating the potential of liquid silicon infiltration (LSI) for making SiC to achieve this goal. The major advantage of this method over other ceramic processing techniques is the enhanced capability of making high dense, high purity SiC materials in complex net shapes. For successful formation of net shape SiC using LSI techniques, the carbon preform reactivity and pore structure must be controlled to allow the complete infiltration of the porous carbon structure which allows complete conversion of the carbon to SiC. We have established a procedure for achieving desirable carbon properties by using carbon precursors consisting of two readily available high purity organic materials, crystalline cellulose and phenolic resin. Phenolic resin yields a glassy carbon with low chemical reactivity and porosity while the cellulose carbon is highly reactive and porous. By adjusting the ratio of these two materials in the precursor mixtures, the properties of the carbons produced can be controlled. We have identified the most favorable carbon precursor composition to be a cellulose resin mass ratio of 6:4 for LSI formation of SiC. The optimum reaction conditions are a temperature of 1800 C, a pressure of 0.5 Torr of argon, and a time of 120 minutes. The fully dense net shape SiC material produced has a density of 2.96 g cm{sup -3} (about 92% of pure SiC) and a SiC volume fraction of over 0.82. Kinetics of the LSI SiC formation process was studied by optical microscopy and quantitative digital image analysis. This study identified six reaction stages and provided important understanding of the process. Although the thermal conductivity of pure SiC at elevated temperatures is very high, thermal conductivities of most commercial Si

  17. Growth of silicon carbide crystals on a seed while pulling silicon crystals from a melt

    NASA Technical Reports Server (NTRS)

    Ciszek, T. F.; Schwuttke, G. H. (Inventor)

    1979-01-01

    A saturated solution of silicon and an element such as carbon having a segregation coefficient less than unity is formed by placing a solid piece of carbon in a body of molten silicon having a temperature differential decreasing toward the surface. A silicon carbide seed crystal is disposed on a holder beneath the surface of the molten silicon. As a rod or ribbon of silicon is slowly pulled from the melt, a supersaturated solution of carbon in silicon is formed in the vicinity of the seed crystal. Excess carbon is emitted from the solution in the form of silicon carbide which crystallizes on the seed crystal held in the cool region of the melt.

  18. STATUS OF HIGH FLUX ISOTOPE REACTOR IRRADIATION OF SILICON CARBIDE/SILICON CARBIDE JOINTS

    SciTech Connect

    Katoh, Yutai; Koyanagi, Takaaki; Kiggans, Jim; Cetiner, Nesrin; McDuffee, Joel

    2014-09-01

    Development of silicon carbide (SiC) joints that retain adequate structural and functional properties in the anticipated service conditions is a critical milestone toward establishment of advanced SiC composite technology for the accident-tolerant light water reactor (LWR) fuels and core structures. Neutron irradiation is among the most critical factors that define the harsh service condition of LWR fuel during the normal operation. The overarching goal of the present joining and irradiation studies is to establish technologies for joining SiC-based materials for use as the LWR fuel cladding. The purpose of this work is to fabricate SiC joint specimens, characterize those joints in an unirradiated condition, and prepare rabbit capsules for neutron irradiation study on the fabricated specimens in the High Flux Isotope Reactor (HFIR). Torsional shear test specimens of chemically vapor-deposited SiC were prepared by seven different joining methods either at Oak Ridge National Laboratory or by industrial partners. The joint test specimens were characterized for shear strength and microstructures in an unirradiated condition. Rabbit irradiation capsules were designed and fabricated for neutron irradiation of these joint specimens at an LWR-relevant temperature. These rabbit capsules, already started irradiation in HFIR, are scheduled to complete irradiation to an LWR-relevant dose level in early 2015.

  19. Analytical and Experimental Evaluation of Joining Silicon Carbide to Silicon Carbide and Silicon Nitride to Silicon Nitride for Advanced Heat Engine Applications Phase II

    SciTech Connect

    Sundberg, G.J.

    1994-01-01

    Techniques were developed to produce reliable silicon nitride to silicon nitride (NCX-5101) curved joins which were used to manufacture spin test specimens as a proof of concept to simulate parts such as a simple rotor. Specimens were machined from the curved joins to measure the following properties of the join interlayer: tensile strength, shear strength, 22 C flexure strength and 1370 C flexure strength. In parallel, extensive silicon nitride tensile creep evaluation of planar butt joins provided a sufficient data base to develop models with accurate predictive capability for different geometries. Analytical models applied satisfactorily to the silicon nitride joins were Norton's Law for creep strain, a modified Norton's Law internal variable model and the Monkman-Grant relationship for failure modeling. The Theta Projection method was less successful. Attempts were also made to develop planar butt joins of siliconized silicon carbide (NT230).

  20. Development of a continuous spinning process for producing silicon carbide - silicon nitride precursor fibers

    NASA Technical Reports Server (NTRS)

    1985-01-01

    An apparatus was designed for the continuous production of silicon carbide - silicon nitride precursor fibers. The precursor polymer can be fiberized, crosslined and pyrolyzed. The product is a metallic black fiber with the composition of the type C sub x Si sub y n sub z. Little, other than the tensile strength and modulus of elasticity, is known of the physical properties.

  1. Novel silicon carbide/polypyrrole composites; preparation and physicochemical properties

    SciTech Connect

    Omastova, Maria . E-mail: upolmaom@savba.sk; Boukerma, Kada; Chehimi, Mohamed M.; Trchova, Miroslava

    2005-05-18

    Novel silicon carbide/polypyrrole (SiC/PPy) conducting composites were prepared using silicon carbide as inorganic substrate. The surface modification of SiC was performed in aqueous solution by oxidative polymerization of pyrrole using ferric chloride as oxidant. Elemental analysis was used to determine the mass loading of polypyrrole in the SiC/PPy composites. Scanning electron microscopy showed the surface modification of SiC by PPy. PPy in composites was confirmed by the presence of PPy bands in the infrared spectra of SiC/PPy containing various amounts of conducting polymer. The conductivity of SiC/PPy composites depends on PPy content on the surface. The composite containing 35 wt.% PPy showed conductivity about 2 S cm{sup -1}, which is in the same range as the conductivity of pure polypyrrole powder prepared under the same conditions using the same oxidant. PPy in the composites was clearly detected by X-ray photoelectron spectroscopy (XPS) measurements by its N1s and Cl2p peaks. High resolution scans of the C1s regions distinguished between silicon carbide and polypyrrole carbons. The fraction of polypyrrole at the composite surface was estimated from the silicon and nitrogen levels. The combination of XPS and conductivity measurements suggests that the surface of the SiC/PPy composites is polypyrrole-rich for a conducting polymer mass loading of at least 12.6 wt.%.

  2. Chemical vapor deposition (CVD) of cubic silicon carbide. Patent Application

    SciTech Connect

    Addamiano, A.

    1985-07-02

    This invention relates to the growth of cubic silicon carbide crystals. More specifically, this invention relates to the growth of cubic silicon carbide by Chemical Vapor Deposition (CVD). One object of the present invention is to provide a novel method for the production of cubic SiC for high temperature electronic devices. Another object of the present invention is to provide a novel method for the production of highly pure, single crystal cubic SiC that is duplicable. Another object of the present invention is to provide a novel method for the production of large-area single-crystal wafers of cubic SiC. These and other objects of the present invention can be achieved by a method for chemical vapor deposition (CVD) of cubic Silicon Carbide (SiC) comprising the steps of etching silicon substrated having one mechanically polished face; depositing a thin buffer layer of cubic SiC formed by reaction between a heated Si substrate and a H2-C3H8 gas mixuture; and depositing SiC on the buffer layer at high temperature using H2+C3HY+SiH4 mixture.

  3. A model of silicon carbide chemical vapor deposition

    SciTech Connect

    Allendorf, M.D.; Kee, R.J. )

    1991-03-01

    This paper presents a model describing the interacting gas phase and surface chemistry present during the steady-state chemical vapor deposition (CVD) of silicon carbide (SiC). In this work, the authors treat the case of steady-state deposition of SiC from silane (SiH{sub 4}) and propane (C{sub 3}H{sub 8}) mixtures in hydrogen carrier gas at one atmosphere pressure. Epitaxial deposition is assumed to occur on a pre-existing epitaxial silicon carbide crystal. Pyrolysis of SiH{sub 4} and C{sub 3}H{sub 8} is modeled by 83 elementary gas-phase reactions. A set of 36 reactions of gas- phase species with the surface is used to simulate the deposition process. Rates for the gas/surface reactions were obtained from experimental measurements of sticking coefficients in the literature and theoretical estimates. The authors' results represent the first simulation of a silicon carbide deposition process that includes detailed description of both the gas phase and surface reactions. The chemical reaction mechanism is also combined with a model of a rotating disk reactor (RDR), which is a convenient way to study the interaction of chemical reactions with fluid mechanics. Transport of species from the gas to the surface is accounted for using multicomponent transport properties. Predictions of deposition rates as a function of susceptor temperature, disk rotation rate, and reactant partial pressure are presented. In addition, velocity, temperature, and concentration profiles normal to the heated disk for 41 gas-phase species are determined using reactor conditions typical of epitaxial silicon carbide deposition on silicon substrates.

  4. In situ-grown hexagonal silicon nanocrystals in silicon carbide-based films.

    PubMed

    Kim, Tae-Youb; Huh, Chul; Park, Nae-Man; Choi, Cheol-Jong; Suemitsu, Maki

    2012-01-01

    Silicon nanocrystals (Si-NCs) were grown in situ in carbide-based film using a plasma-enhanced chemical vapor deposition method. High-resolution transmission electron microscopy indicates that these nanocrystallites were embedded in an amorphous silicon carbide-based matrix. Electron diffraction pattern analyses revealed that the crystallites have a hexagonal-wurtzite silicon phase structure. The peak position of the photoluminescence can be controlled within a wavelength of 500 to 650 nm by adjusting the flow rate of the silane gas. We suggest that this phenomenon is attributed to the quantum confinement effect of hexagonal Si-NCs in silicon carbide-based film with a change in the sizes and emission states of the NCs. PMID:23171576

  5. In situ-grown hexagonal silicon nanocrystals in silicon carbide-based films

    PubMed Central

    2012-01-01

    Silicon nanocrystals (Si-NCs) were grown in situ in carbide-based film using a plasma-enhanced chemical vapor deposition method. High-resolution transmission electron microscopy indicates that these nanocrystallites were embedded in an amorphous silicon carbide-based matrix. Electron diffraction pattern analyses revealed that the crystallites have a hexagonal-wurtzite silicon phase structure. The peak position of the photoluminescence can be controlled within a wavelength of 500 to 650 nm by adjusting the flow rate of the silane gas. We suggest that this phenomenon is attributed to the quantum confinement effect of hexagonal Si-NCs in silicon carbide-based film with a change in the sizes and emission states of the NCs. PMID:23171576

  6. Fabrication and characterization of silicon quantum dots in Si-rich silicon carbide films.

    PubMed

    Chang, Geng-Rong; Ma, Fei; Ma, Dayan; Xu, Kewei

    2011-12-01

    Amorphous Si-rich silicon carbide films were prepared by magnetron co-sputtering and subsequently annealed at 900-1100 degrees C. After annealing at 1100 degrees C, this configuration of silicon quantum dots embedded in amorphous silicon carbide formed. X-ray photoelectron spectroscopy was used to study the chemical modulation of the films. The formation and orientation of silicon quantum dots were characterized by glancing angle X-ray diffraction, which shows that the ratio of silicon and carbon significantly influences the species of quantum dots. High-resolution transmission electron microscopy investigations directly demonstrated that the formation of silicon quantum dots is heavily dependent on the annealing temperatures and the ratio of silicon and carbide. Only the temperature of about 1100 degrees C is enough for the formation of high-density and small-size silicon quantum dots due to phase separation and thermal crystallization. Deconvolution of the first order Raman spectra shows the existence of a lower frequency peak in the range 500-505 cm(-1) corresponding to silicon quantum dots with different atom ratio of silicon and carbon. PMID:22409005

  7. Field testing of pressureless sintered silicon carbide for choke trim

    SciTech Connect

    Regitz, A.; Keene, K.

    1983-01-01

    Until recently, tungsten carbide has been the most erosion resistant material in use for choke stem tips and seats. An increase in the number of wells that produce sand has led to a need for an improved material that will maintain its integrity significantly longer, when exposed to high velocity sand. During the last two years, FMC Wellhead Equipment Division's R and D Engineering Department has been conducting field tests of pressureless sintered silicon carbide (herein called SiC) used as trim for chokes. The test results have been very encouraging. SiC appears to have wear resistance two to three times better than tungsten carbide. The main problems encountered have been the brittleness of the material and the difficulty in attaching a SiC tip to the steel choke stem.

  8. Continuous method of producing silicon carbide fibers

    NASA Technical Reports Server (NTRS)

    Barnard, Thomas Duncan (Inventor); Nguyen, Kimmai Thi (Inventor); Rabe, James Alan (Inventor)

    1999-01-01

    This invention pertains to a method for production of polycrystalline ceramic fibers from silicon oxycarbide (SiCO) ceramic fibers wherein the method comprises heating an amorphous ceramic fiber containing silicon and carbon in an inert environment comprising a boron oxide and carbon monoxide at a temperature sufficient to convert the amorphous ceramic fiber to a polycrystalline ceramic fiber. By having carbon monoxide present during the heating of the ceramic fiber, it is possible to achieve higher production rates on a continuous process.

  9. Revised activation estimates for silicon carbide

    SciTech Connect

    Heinisch, H.L.; Cheng, E.T.; Mann, F.M.

    1996-10-01

    Recent progress in nuclear data development for fusion energy systems includes a reevaluation of neutron activation cross sections for silicon and aluminum. Activation calculations using the newly compiled Fusion Evaluated Nuclear Data Library result in calculated levels of {sup 26}Al in irradiated silicon that are about an order of magnitude lower than the earlier calculated values. Thus, according to the latest internationally accepted nuclear data, SiC is much more attractive as a low activation material, even in first wall applications.

  10. Processing of reaction-bonded silicon carbide without residual silicon phase

    SciTech Connect

    Messner, R.P.; Chiang, Y.M.

    1988-08-01

    Reaction-bonded silicon carbide free of the residual silicon phase that has previously limited upper use temperatures and mechanical properties has been synthesized by the infiltration of carbonaceous preforms using alloyed silicon melts. In this approach, rejection of the alloying components from the primary reacted silicon carbide phase into the remaining liquid forms a secondary refractory silicide, in a potentially broad and controllable range of volume fractions. Dense SiC-MoSi/sub 2/ materials free of residual silicon and residual carbon have been synthesized. In addition to a fully-infiltrated monolith, surface coatings on a carbon body have been synthesized by control of processing parameters. In each, the absence of free silicon and incorporation of the secondary phase is expected to improve mechanical properties. 14 references.

  11. Comparison of the surface charge behavior of commercial silicon nitride and silicon carbide powders

    NASA Technical Reports Server (NTRS)

    Whitman, Pamela K.; Feke, Donald L.

    1988-01-01

    The adsorption and desorption of protons from aqueous solution onto the surfaces of a variety of commercial silicon carbide and silicon nitride powders has been examined using a surface titration methodology. This method provides information on some colloidal characteristics, such as the point of zero charge (pzc) and the variation of proton adsorption with dispersion pH, useful for the prediction of optimal ceramic-processing conditions. Qualitatively, the magnitude of the proton adsorption from solution reveals small differences among all of the materials studied. However, the results show that the pzc for the various silicon nitride powders is affected by the powder synthesis route. Complementary investigations have shown that milling can also act to shift the pzc exhibited by silicon nitride powder. Also, studies of the role of the electrolyte in the development of surface charge have indicated no evidence of specific adsorption of ammonium ion on either silicon nitride or silicon carbide powders.

  12. Novel fabrication of silicon carbide based ceramics for nuclear applications

    NASA Astrophysics Data System (ADS)

    Singh, Abhishek Kumar

    Advances in nuclear reactor technology and the use of gas-cooled fast reactors require the development of new materials that can operate at the higher temperatures expected in these systems. These materials include refractory alloys based on Nb, Zr, Ta, Mo, W, and Re; ceramics and composites such as SiC--SiCf; carbon--carbon composites; and advanced coatings. Besides the ability to handle higher expected temperatures, effective heat transfer between reactor components is necessary for improved efficiency. Improving thermal conductivity of the fuel can lower the center-line temperature and, thereby, enhance power production capabilities and reduce the risk of premature fuel pellet failure. Crystalline silicon carbide has superior characteristics as a structural material from the viewpoint of its thermal and mechanical properties, thermal shock resistance, chemical stability, and low radioactivation. Therefore, there have been many efforts to develop SiC based composites in various forms for use in advanced energy systems. In recent years, with the development of high yield preceramic precursors, the polymer infiltration and pyrolysis (PIP) method has aroused interest for the fabrication of ceramic based materials, for various applications ranging from disc brakes to nuclear reactor fuels. The pyrolysis of preceramic polymers allow new types of ceramic materials to be processed at relatively low temperatures. The raw materials are element-organic polymers whose composition and architecture can be tailored and varied. The primary focus of this study is to use a pyrolysis based process to fabricate a host of novel silicon carbide-metal carbide or oxide composites, and to synthesize new materials based on mixed-metal silicocarbides that cannot be processed using conventional techniques. Allylhydridopolycarbosilane (AHPCS), which is an organometal polymer, was used as the precursor for silicon carbide. Inert gas pyrolysis of AHPCS produces near-stoichiometric amorphous

  13. Diffusion Bonding of Silicon Carbide for MEMS-LDI Applications

    NASA Technical Reports Server (NTRS)

    Halbig, Michael C.; Singh, Mrityunjay; Shpargel, Tarah P.; Kiser, J. Douglas

    2007-01-01

    A robust joining approach is critically needed for a Micro-Electro-Mechanical Systems-Lean Direct Injector (MEMS-LDI) application which requires leak free joints with high temperature mechanical capability. Diffusion bonding is well suited for the MEMS-LDI application. Diffusion bonds were fabricated using titanium interlayers between silicon carbide substrates during hot pressing. The interlayers consisted of either alloyed titanium foil or physically vapor deposited (PVD) titanium coatings. Microscopy shows that well adhered, crack free diffusion bonds are formed under optimal conditions. Under less than optimal conditions, microcracks are present in the bond layer due to the formation of intermetallic phases. Electron microprobe analysis was used to identify the reaction formed phases in the diffusion bond. Various compatibility issues among the phases in the interlayer and substrate are discussed. Also, the effects of temperature, pressure, time, silicon carbide substrate type, and type of titanium interlayer and thickness on the microstructure and composition of joints are discussed.

  14. Amorphous silicon carbide coatings for extreme ultraviolet optics

    NASA Technical Reports Server (NTRS)

    Kortright, J. B.; Windt, David L.

    1988-01-01

    Amorphous silicon carbide films formed by sputtering techniques are shown to have high reflectance in the extreme ultraviolet spectral region. X-ray scattering verifies that the atomic arrangements in these films are amorphous, while Auger electron spectroscopy and Rutherford backscattering spectroscopy show that the films have composition close to stoichiometric SiC, although slightly C-rich, with low impurity levels. Reflectance vs incidence angle measurements from 24 to 1216 A were used to derive optical constants of this material, which are presented here. Additionally, the measured extreme ultraviolet efficiency of a diffraction grating overcoated with sputtered amorphous silicon carbide is presented, demonstrating the feasibility of using these films as coatings for EUV optics.

  15. Friction, deformation and fracture of single-crystal silicon carbide

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1977-01-01

    Friction experiments were conducted with hemispherical and conical diamond riders sliding on the basal plane of silicon carbide. The results indicate that, when deformation is primarily elastic, the friction does not depend on crystallographic orientation and there is no detectable fracture or cracking. When, however, plastic deformation occurs, silicon carbide exhibits anisotropic friction and deformation behavior. Surface fracture crack patterns surrounding wear tracks are observed to be of three types. The crack-geometries of two types are generally independent of orientation, the third crack, however, depends on the orientation. All surface cracks extend into subsurface. Anisotropic friction, deformation and fracture on the basal plane are primarily controlled by the slip system and cleavage.

  16. Microstructure and properties of IN SITU toughened silicon carbide

    SciTech Connect

    De Jonghe, Lutgard C.; Ritchie, Robert O.; Zhang, Xiao Feng

    2003-05-01

    A silicon carbide with a fracture toughness as high as 9.1 MPa.m1/2 has been developed by hot pressing b-SiC powder with aluminum, boron, and carbon additions (ABC-SiC). Central in this material development has been systematic transmission electron microscopy (TEM) and mechanical characterizations. In particular, atomic-resolution electron microscopy and nanoprobe composition quantification were combined in analyzing grain boundary structure and nanoscale structural features.

  17. Electron spin decoherence in silicon carbide nuclear spin bath

    NASA Astrophysics Data System (ADS)

    Yang, Li-Ping

    In this paper, we study the electron spin decoherence of single defects in silicon carbide (SiC) nuclear spin bath. We find that, although the natural abundance of 29Si (4.7 counter-intuitive result, is the suppression of heteronuclear-spin flip-flop process in finite magnetic field. Our results show that electron spin of defect centers in SiC are excellent candidates for solid state spin qubit in quantum information processing.

  18. Synthesis of multifilament silicon carbide fibers by chemical vapor deposition

    NASA Technical Reports Server (NTRS)

    Revankar, Vithal; Hlavacek, Vladimir

    1991-01-01

    A process for development of clean silicon carbide fiber with a small diameter and high reliability is presented. An experimental evaluation of operating conditions for SiC fibers of good mechanical properties and devising an efficient technique which will prevent welding together of individual filaments are discussed. The thermodynamic analysis of a different precursor system was analyzed vigorously. Thermodynamically optimum conditions for stoichiometric SiC deposit were obtained.

  19. Optical nonlinearities in high-confinement silicon carbide waveguides.

    PubMed

    Cardenas, Jaime; Yu, Mengjie; Okawachi, Yoshitomo; Poitras, Carl B; Lau, Ryan K W; Dutt, Avik; Gaeta, Alexander L; Lipson, Michal

    2015-09-01

    We demonstrate strong nonlinearities of n2=8.6±1.1×10(-15)  cm2 W(-1) in single-crystal silicon carbide (SiC) at a wavelength of 2360 nm. We use a high-confinement SiC waveguide fabricated based on a high-temperature smart-cut process. PMID:26368731

  20. Anodic etching of p-type cubic silicon carbide

    NASA Technical Reports Server (NTRS)

    Harris, G. L.; Fekade, K.; Wongchotigul, K.

    1992-01-01

    p-Type cubic silicon carbide was anodically etched using an electrolyte of HF:HCl:H2O. The etching depth was determined versus time with a fixed current density of 96.4 mA/sq cm. It was found that the etching was very smooth and very uniform. An etch rate of 22.7 nm/s was obtained in a 1:1:50 HF:HCl:H2O electrolyte.

  1. Assessment of exposure to quartz, cristobalite and silicon carbide fibres (whiskers) in a silicon carbide plant.

    PubMed

    Dion, Chantal; Dufresne, André; Jacob, Marcel; Perrault, Guy

    2005-06-01

    The main objective of the present paper is to report on the concentration of silicon carbide (SiC) fibres, crystalline silica and respirable dust in a Canadian SiC production plant and to compare the results with earlier investigations. The second objective is to tentatively explain the differences in concentration of the fibrogenic substances between different countries. The assessment of SiC fibres, dusts, respirable quartz and cristobalite was performed according to standard procedures. The highest 8 h time-weighted average concentrations of fibres were found among the crusher and backhoe attendants and the carboselectors with an arithmetic mean of 0.63 fibres ml(-1) for the former group and 0.51 fibres ml(-1) for the latter group. The results of respirable SiC fibres in the Canadian plant were lower than in the Norwegian and Italian industries. Most of the 8 h time-weighted average concentrations for quartz were less than or around the limit of detection of 0.01 mg m(-3). The maximum 8 h time-weighted average concentration for quartz was found among the carboselectors (0.157 mg m(-3)), followed by the labourers (0.032 mg m(-3)). Similarly, most of the 8 h time-weighted average cristobalite measurements were less than the limit of detection of 0.01 mg m(-3) except for the carboselectors where it was found to be 0.044 mg m(-3). The assessment of the Italian occupational settings exposure demonstrated elevated quartz concentrations, while cristobalite was absent. The authors have concluded that the investigations that were performed in the last two decades in this field by researchers from different countries seem to support that SiC fibres (whiskers) constitute a major airborne health hazard. PMID:15650014

  2. Process for preparing fine grain silicon carbide powder

    DOEpatents

    Wei, G.C.

    Finely divided silicon carbide powder is obtained by mixing colloidal silica and unreacted phenolic resin in either acetone or methanol, evaporating solvent from the obtained solution to form a gel, drying and calcining the gel to polymerize the phenolic resin therein, pyrolyzing the dried and calcined gel at a temperature in the range of 500 to 1000/sup 0/C, and reacting silicon and carbon in the pyrolyzed gel at a temperature in the range of 1550 to 1700/sup 0/C to form the powder.

  3. Reaction kinetics of nanostructured silicon carbide

    NASA Astrophysics Data System (ADS)

    Wallis, K. L.; Patyk, J. K.; Zerda, T. W.

    2008-08-01

    SiC nanowires were produced from carbon nanotubes and silicon by two different methods at high temperature. X-ray powder diffraction was used to determine SiC concentration. The reaction rate using the Avrami-Erofeev method was determined for samples sintered at temperatures ranging from 1313 to 1823 K. The activation energy was found to be (254 ± 36) kJ mol-1. The limiting factor in SiC formation is diffusion of silicon and carbon atoms through the produced layer of SiC.

  4. Visible-blind ultraviolet photodetectors on porous silicon carbide substrates

    SciTech Connect

    Naderi, N.; Hashim, M.R.

    2013-06-01

    Highlights: • Highly reliable UV detectors are fabricated on porous silicon carbide substrates. • The optical properties of samples are enhanced by increasing the current density. • The optimized sample exhibits enhanced sensitivity to the incident UV radiation. - Abstract: Highly reliable visible-blind ultraviolet (UV) photodetectors were successfully fabricated on porous silicon carbide (PSC) substrates. High responsivity and high photoconductive gain were observed in a metal–semiconductor–metal ultraviolet photodetector that was fabricated on an optimized PSC substrate. The PSC samples were prepared via the UV-assisted photo-electrochemical etching of an n-type hexagonal silicon carbide (6H-SiC) substrate using different etching current densities. The optical results showed that the current density is an outstanding etching parameter that controls the porosity and uniformity of PSC substrates. A highly porous substrate was synthesized using a suitable etching current density to enhance its light absorption, thereby improving the sensitivity of UV detector with this substrate. The electrical characteristics of fabricated devices on optimized PSC substrates exhibited enhanced sensitivity and responsivity to the incident radiation.

  5. Ceramic composites reinforced with modified silicon carbide whiskers

    DOEpatents

    Tiegs, Terry N.; Lindemer, Terrence B.

    1990-01-01

    Silicon carbide whisker-reinforced ceramic composites are fabricated in a highly reproducible manner by beneficating the surfaces of the silicon carbide whiskers prior to their usage in the ceramic composites. The silicon carbide whiskers which contain considerable concentrations of surface oxides and other impurities which interact with the ceramic composite material to form a chemical bond are significantly reduced so that only a relatively weak chemical bond is formed between the whisker and the ceramic material. Thus, when the whiskers interact with a crack propagating into the composite the crack is diverted or deflected along the whisker-matrix interface due to the weak chemical bonding so as to deter the crack propagation through the composite. The depletion of the oxygen-containing compounds and other impurities on the whisker surfaces and near surface region is effected by heat treating the whiskers in a suitable oxygen sparaging atmosphere at elevated temperatures. Additionally, a sedimentation technique may be utilized to remove whiskers which suffer structural and physical anomalies which render them undesirable for use in the composite. Also, a layer of carbon may be provided on the surface of the whiskers to further inhibit chemical bonding of the whiskers to the ceramic composite material.

  6. Barrier properties of nano silicon carbide designed chitosan nanocomposites.

    PubMed

    Pradhan, Gopal C; Dash, Satyabrata; Swain, Sarat K

    2015-12-10

    Nano silicon carbide (SiC) designed chitosan nanocomposites were prepared by solution technique. Fourier transform infrared spectroscopy (FTIR) and X-ray diffraction (XRD) were used for studying structural interaction of nano silicon carbide (SiC) with chitosan. The morphology of chitosan/SiC nanocomposites was investigated by field emission scanning electron microscope (FESEM), and high resolution transmission electron microscope (HRTEM). The thermal stability of chitosan was substantially increased due to incorporation of stable silicon carbide nanopowder. The oxygen permeability of chitosan/SiC nanocomposites was reduced by three folds as compared to the virgin chitosan. The chemical resistance properties of chitosan were enhanced due to the incorporation of nano SiC. The biodegradability was investigated using sludge water. The tensile strength of chitosan/SiC nanocomposites was increased with increasing percentage of SiC. The substantial reduction in oxygen barrier properties in combination with increased thermal stability, tensile strength and chemical resistance properties; the synthesized nanocomposite may be suitable for packaging applications. PMID:26428100

  7. CVD silicon carbide characterization. Final report, August 1992-October 1993

    SciTech Connect

    Graves, G.A.; Iden, D.

    1994-08-01

    Chemically vapor deposited (CVD) silicon carbide is a candidate material for high quality ground and space-based mirror substrates and high quality reflective optics. Statistically valid material property data has not been available, however, to make durability and lifetime predictions for such optics. The primary purpose of this study was to determine the Weibull and slow crack growth parameters for CVD silicon carbide. Specimens were cut from various locations in a 25 mm thick, 50 cm diameter piece of SiC to analyze bulk material property homogeneity. Flexural strength was measured using a four-point bend technique. In addition to mechanical testing for strength, hardness, and fracture toughness, the material crystallography and microstructure were studied. Thermal expansion, thermal diffusivity, specific heat, optical absorption, and infrared reflectivity measurements were also conducted. Raman spectroscopy was used to check for any residual stress. Test results show this CVD silicon carbide is a high-purity, homogeneous, fine-grained substrate material with very good mechanical, optical, and thermal properties.

  8. Silicon Carbide Mounts for Fabry-Perot Interferometers

    NASA Technical Reports Server (NTRS)

    Lindemann, Scott

    2011-01-01

    Etalon mounts for tunable Fabry- Perot interferometers can now be fabricated from reaction-bonded silicon carbide structural components. These mounts are rigid, lightweight, and thermally stable. The fabrication of these mounts involves the exploitation of post-casting capabilities that (1) enable creation of monolithic structures having reduced (in comparison with prior such structures) degrees of material inhomogeneity and (2) reduce the need for fastening hardware and accommodations. Such silicon carbide mounts could be used to make lightweight Fabry-Perot interferometers or could be modified for use as general lightweight optical mounts. Heretofore, tunable Fabry-Perot interferometer structures, including mounting hardware, have been made from the low-thermal-expansion material Invar (a nickel/iron alloy) in order to obtain the thermal stability required for spectroscopic applications for which such interferometers are typically designed. However, the high mass density of Invar structures is disadvantageous in applications in which there are requirements to minimize mass. Silicon carbide etalon mounts have been incorporated into a tunable Fabry-Perot interferometer of a prior design that originally called for Invar structural components. The strength, thermal stability, and survivability of the interferometer as thus modified are similar to those of the interferometer as originally designed, but the mass of the modified interferometer is significantly less than the mass of the original version.

  9. Bonding and Integration Technologies for Silicon Carbide Based Injector Components

    NASA Technical Reports Server (NTRS)

    Halbig, Michael C.; Singh, Mrityunjay

    2008-01-01

    Advanced ceramic bonding and integration technologies play a critical role in the fabrication and application of silicon carbide based components for a number of aerospace and ground based applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. Ceramic to ceramic diffusion bonding and ceramic to metal brazing technologies are being developed for this injector application. For the diffusion bonding, titanium interlayers (PVD and foils) were used to aid in the joining of silicon carbide (SiC) substrates. The influence of such variables as surface finish, interlayer thickness (10, 20, and 50 microns), processing time and temperature, and cooling rates were investigated. Microprobe analysis was used to identify the phases in the bonded region. For bonds that were not fully reacted an intermediate phase, Ti5Si3Cx, formed that is thermally incompatible in its thermal expansion and caused thermal stresses and cracking during the processing cool-down. Thinner titanium interlayers and/or longer processing times resulted in stable and compatible phases that did not contribute to microcracking and resulted in an optimized microstructure. Tensile tests on the joined materials resulted in strengths of 13-28 MPa depending on the SiC substrate material. Non-destructive evaluation using ultrasonic immersion showed well formed bonds. For the joining technology of brazing Kovar fuel tubes to silicon carbide, preliminary development of the joining approach has begun. Various technical issues and requirements for the injector application are addressed.

  10. The Development of Silicon Carbide Based Hydrogen and Hydrocarbon Sensors

    NASA Technical Reports Server (NTRS)

    Liu, Chung-Chiun

    1994-01-01

    Silicon carbide is a high temperature electronic material. Its potential for development of chemical sensors in a high temperature environment has not been explored. The objective of this study is to use silicon carbide as the substrate material for the construction of chemical sensors for high temperature applications. Sensors for the detection of hydrogen and hydrocarbon are developed in this program under the auspices of Lewis Research Center, NASA. Metal-semiconductor or metal-insulator-semiconductor structures are used in this development. Specifically, using palladium-silicon carbide Schottky diodes as gas sensors in the temperature range of 100 to 400 C are designed, fabricated and assessed. The effect of heat treatment on the Pd-SiC Schottky diode is examined. Operation of the sensors at 400 C demonstrate sensitivity of the sensor to hydrogen and hydrocarbons. Substantial progress has been made in this study and we believe that the Pd-SiC Schottky diode has potential as a hydrogen and hydrocarbon sensor over a wide range of temperatures. However, the long term stability and operational life of the sensor need to be assessed. This aspect is an important part of our future continuing investigation.

  11. Method for removing oxide contamination from silicon carbide powders

    DOEpatents

    Brynestad, J.; Bamberger, C.E.

    1984-08-01

    The described invention is directed to a method for removing oxide contamination in the form of oxygen-containing compounds such as SiO/sub 2/ and B/sub 2/O/sub 3/ from a charge of finely divided silicon carbide. The silicon carbide charge is contacted with a stream of hydrogen fluoride mixed with an inert gas carrier such as argon at a temperature in the range of about 200/sup 0/ to 650/sup 0/C. The oxides in the charge react with the heated hydrogen fluoride to form volatile gaseous fluorides such as SiF/sub 4/ and BF/sub 3/ which pass through the charge along with unreacted hydrogen fluoride and the carrier gas. Any residual gaseous reaction products and hydrogen fluoride remaining in the charge are removed by contacting the charge with the stream of inert gas which also cools the powder to room temperature. The removal of the oxygen contamination by practicing the present method provides silicon carbide powders with desirable pressing and sintering characteristics. 1 tab.

  12. Extreme-Environment Silicon-Carbide (SiC) Wireless Sensor Suite

    NASA Technical Reports Server (NTRS)

    Yang, Jie

    2015-01-01

    Phase II objectives: Develop an integrated silicon-carbide wireless sensor suite capable of in situ measurements of critical characteristics of NTP engine; Compose silicon-carbide wireless sensor suite of: Extreme-environment sensors center, Dedicated high-temperature (450 deg C) silicon-carbide electronics that provide power and signal conditioning capabilities as well as radio frequency modulation and wireless data transmission capabilities center, An onboard energy harvesting system as a power source.

  13. Graphitized silicon carbide microbeams: wafer-level, self-aligned graphene on silicon wafers

    NASA Astrophysics Data System (ADS)

    Cunning, Benjamin V.; Ahmed, Mohsin; Mishra, Neeraj; Ranjbar Kermany, Atieh; Wood, Barry; Iacopi, Francesca

    2014-08-01

    Currently proven methods that are used to obtain devices with high-quality graphene on silicon wafers involve the transfer of graphene flakes from a growth substrate, resulting in fundamental limitations for large-scale device fabrication. Moreover, the complex three-dimensional structures of interest for microelectromechanical and nanoelectromechanical systems are hardly compatible with such transfer processes. Here, we introduce a methodology for obtaining thousands of microbeams, made of graphitized silicon carbide on silicon, through a site-selective and wafer-scale approach. A Ni-Cu alloy catalyst mediates a self-aligned graphitization on prepatterned SiC microstructures at a temperature that is compatible with silicon technologies. The graphene nanocoating leads to a dramatically enhanced electrical conductivity, which elevates this approach to an ideal method for the replacement of conductive metal films in silicon carbide-based MEMS and NEMS devices.

  14. Graphitized silicon carbide microbeams: wafer-level, self-aligned graphene on silicon wafers.

    PubMed

    Cunning, Benjamin V; Ahmed, Mohsin; Mishra, Neeraj; Kermany, Atieh Ranjbar; Wood, Barry; Iacopi, Francesca

    2014-08-15

    Currently proven methods that are used to obtain devices with high-quality graphene on silicon wafers involve the transfer of graphene flakes from a growth substrate, resulting in fundamental limitations for large-scale device fabrication. Moreover, the complex three-dimensional structures of interest for microelectromechanical and nanoelectromechanical systems are hardly compatible with such transfer processes. Here, we introduce a methodology for obtaining thousands of microbeams, made of graphitized silicon carbide on silicon, through a site-selective and wafer-scale approach. A Ni-Cu alloy catalyst mediates a self-aligned graphitization on prepatterned SiC microstructures at a temperature that is compatible with silicon technologies. The graphene nanocoating leads to a dramatically enhanced electrical conductivity, which elevates this approach to an ideal method for the replacement of conductive metal films in silicon carbide-based MEMS and NEMS devices. PMID:25053702

  15. Affordable Fabrication and Properties of Silicon Carbide-Based Interpenetrating Phase Composites

    NASA Technical Reports Server (NTRS)

    Singh, Mrityunjay

    1998-01-01

    An affordable processing technique for the fabrication of silicon carbide-based interpenetrating phase composites (IPCs) is presented. This process consists of the production of microporous carbon preforms and subsequent infiltration with liquid silicon or silicon-refractory metal alloys. The microporous preforms are made by the pyrolysis of a polymerized resin mixture for which methods to control pore volume and pore size have been established. The process gives good control of microstructure and morphology of silicon carbide-based composite materials. Room and high temperature mechanical properties (flexural strength, compressive strength, and flexural creep) of low and high silicon-silicon carbide composites will be discussed.

  16. A study of the effect of grain size on the ballistic performance of silicon carbide

    SciTech Connect

    Cline, C.F.

    1995-03-01

    The depth of penetration method was used to ballistically evaluate the performance of silicon carbide as a function of grain size. The hot-pressed silicon carbide was backed by 4340 steel Rc = 35 and impacted by tungsten heavy metal projectiles of L/D = 4 at velocities of 1.6 and 1/75 km/s. The hot-pressed silicon carbide was also compared with reaction-sintered silicon carbide of identical thickness in the current study. Results are compared with data previously reported by others.

  17. Optical constants of silicon carbide deposited with emerging PVD techniques

    NASA Astrophysics Data System (ADS)

    Monaco, Gianni; Suman, M.; Pelizzo, M. G.; Nicolosi, P.

    2009-05-01

    Silicon carbide (SiC) is an attractive material for EUV and soft X-ray optics. CVD-deposited silicon carbide (deposited at 1400° C on Si substrate) is the best reflective material in the whole EUV interval (with about the 48% of reflectance at 121.6 nm). Despite of this, SiC thin films deposited with PVD techniques, such as magnetron sputtering, on silicon substrate, do not have the same performances and they undergo to a degradation with time, probably because of some stoichiometry reason (carbon rich). Depositing stable SiC with PVD techniques is crucial in building ML's, like Si/SiC and SiC/Mg for soft X-ray applications (such space telescope and photolithography). We deposited some preliminary samples using the Pulsed Laser Deposition (PLD) and the Pulsed Electron Deposition (PED) techniques achieving a good reflectance in the whole EUV range (27% at near normal incidence at 121.6 nn) on a silicon substrate. The higher energy involved in these deposition processes could lead to a film with a stoichiometry much closer to the target one. The reflectivity of the deposited films has been measured at the BEAR beamline of the ELETTRA synchrotron in Trieste (Italy; the optical constants retrieved at six wavelength from 121.6 nm down to 5 nm.

  18. Polymeric synthesis of silicon carbide with microwaves.

    PubMed

    Aguilar, Juan; Urueta, Luis; Valdez, Zarel

    2007-01-01

    The aim of this work is conducting polymeric synthesis with microwaves for producing beta-SiC. A polymeric precursor was prepared by means of hydrolysis and condensation reactions from pheniltrimethoxysilane, water, methanol, ammonium hydroxide and chloride acid. The precursor was placed into a quartz tube in vacuum; pyrolysis was carried out conventionally in a tube furnace, and by microwaves at 2.45 GHz in a multimode cavity. Conventional tests took place in a scheme where temperature was up to 1500 degrees C for 120 minutes. Microwave heating rate was not controlled and tests lasted 60 and 90 minutes, temperature was around 900 degrees C. Products of the pyrolysis were analyzed by means of x-ray diffraction; in the microwave case the diffraction patterns showed a strong background of either very fine particles or amorphous material, then infrared spectroscopy was also employed for confirming carbon bonds. In both processes beta-SiC was found as the only produced carbide. PMID:17645205

  19. Exposure to Fibres, Crystalline Silica, Silicon Carbide and Sulphur Dioxide in the Norwegian Silicon Carbide Industry

    PubMed Central

    Føreland, S.; Bye, E.; Bakke, B.; Eduard, W.

    2008-01-01

    Objectives: The aim of this study was to assess personal exposure to fibres, crystalline silica, silicon carbide (SiC) and sulphur dioxide in the Norwegian SiC industry. Methods: Approximately 720 fibre samples, 720 respirable dust samples and 1400 total dust samples were collected from randomly chosen workers from the furnace, processing and maintenance departments in all three Norwegian SiC plants. The respirable dust samples were analysed for quartz, cristobalite and non-fibrous SiC content. Approximately 240 sulphur dioxide samples were collected from workers in the furnace department. Results: The sorting operators from all plants, control room and cleaning operators in Plant A and charger, charger/mix and payloader operators in Plant C had a geometric mean (GM) of fibre exposure above the Norwegian occupational exposure limit (OEL) (0.1 fibre cm−3). The cleaner operators in Plant A had the highest GM exposure to respirable quartz (20 μg m−3). The charger/mix operators in Plant C had the highest GM exposure to respirable cristobalite (38 μg m−3) and the refinery crusher operators in Plant A had the highest GM exposure to non-fibrous SiC (0.65 mg m−3). Exposure to the crystalline silica and non-fibrous SiC was generally low and between 0.4 and 2.1% of the measurements exceeded the OELs. The cleaner operators in Plant A had the highest GM exposure to respirable dust (1.3 mg m−3) and total dust (21 mg m−3). GM exposures for respirable dust above the Norwegian SiC industry-specific OEL of 0.5 mg m−3 were also found for refinery crusher operators in all plants and mix, charger, charger/mix and sorting operators in Plant C. Only 4% of the total dust measurements exceeded the OEL for nuisance dust of (10 mg m−3). Exposure to sulphur dioxide was generally low. However, peaks in the range of 10–100 p.p.m. were observed for control room and crane operators in Plants A and B and for charger and charger/mix operators in Plant C. Conclusion: Workers in

  20. Gas-phase formation of silicon carbides, oxides, and sulphides from atomic silicon ions

    NASA Technical Reports Server (NTRS)

    Bohme, Diethard K.; Wlodek, Stanislaw; Fox, Arnold

    1989-01-01

    A systematic experimental study of the kinetics and mechanisms of the chemical reactions in the gas phase between ground-state Si(+)2p and a variety of astrophysical molecules. The aim of this study is to identify the reactions which trigger the formation of chemical bonds between silicon and carbon, oxygen and sulphur, and the chemical pathways which lead to further molecular growth. Such knowledge is valuable in the identification of new extraterrestrial silicon-bearing molecules and for an assessment of the gas-phase transition from atomic silicon to silicon carbide and silicate grain particles in carbon-rich and oxygen-rich astrophysical environments.

  1. Exciton Resonances in Novel Silicon Carbide Polymers

    NASA Astrophysics Data System (ADS)

    Burggraf, Larry; Duan, Xiaofeng

    2015-05-01

    A revolutionary technology transformation from electronics to excitionics for faster signal processing and computing will be advantaged by coherent exciton transfer at room temperature. The key feature required of exciton components for this technology is efficient and coherent transfer of long-lived excitons. We report theoretical investigations of optical properties of SiC materials having potential for high-temperature excitonics. Using Car-Parinello simulated annealing and DFT we identified low-energy SiC molecular structures. The closo-Si12C12 isomer, the most stable 12-12 isomer below 1100 C, has potential to make self-assembled chains and 2-D nanostructures to construct exciton components. Using TDDFT, we calculated the optical properties of the isomer as well as oligomers and 2-D crystal formed from the isomer as the monomer unit. This molecule has large optical oscillator strength in the visible. Its high-energy and low-energy transitions (1.15 eV and 2.56 eV) are nearly pure one-electron silicon-to-carbon transitions, while an intermediate energy transition (1.28 eV) is a nearly pure carbon-to-silicon one-electron charge transfer. These results are useful to describe resonant, coherent transfer of dark excitons in the nanostructures. Research supported by the Air Force Office of Scientific Research.

  2. Subsurface damage of single crystalline silicon carbide in nanoindentation tests.

    PubMed

    Yan, Jiwang; Gai, Xiaohui; Harada, Hirofumi

    2010-11-01

    The response of single crystalline silicon carbide (SiC) to a Berkovich nanoindenter was investigated by examining the indents using a transmission electron microscope and the selected area electron diffraction technique. It was found that the depth of indentation-induced subsurface damage was far larger than the indentation depth, and the damaging mechanism of SiC was distinctly different from that of single crystalline silicon. For silicon, a broad amorphous region is formed underneath the indenter after unloading; for SiC, however, no amorphous phase was detected. Instead, a polycrystalline structure with a grain size of ten nanometer level was identified directly under the indenter tip. Micro cracks, basal plane dislocations and possible cross slips were also found around the indent. These finding provide useful information for ultraprecision manufacturing of SiC wafers. PMID:21138038

  3. The magnetic and hyperfine properties of iron in silicon carbide

    NASA Astrophysics Data System (ADS)

    Elzain, M.; Al-Harthi, S. H.; Gismelseed, A.; Al-Rawas, A.; Yousif, A.; Widatallah, H.; Al-Barwani, M.

    2014-04-01

    The magnetic and hyperfine properties of iron impurities in 3C- and 6H- silicon-carbide are calculated using the abinitio method of full-potential linear-augmented-plane-waves. The iron atoms are introduced at substitutional carbon, Fe C , and silicon, Fe Si , sites as well as at the tetrahedral interstitial sites with four nearest neighbours carbon atoms, Fe I (C), and four nearest neighbours silicon atoms, Fe I (Si). The effect of introducing vacancies at the neighbours of these sites is also studied. Fe atoms with complete neighbors substituted at Si or C sites are found to be nonmagnetic, while Fe atoms at interstitial sites are magnetic. Introduction of a vacancy at a neighboring site reverse the picture.

  4. Liquid-Liquid Phase Transition in Nanoconfined Silicon Carbide.

    PubMed

    Wu, Weikang; Zhang, Leining; Liu, Sida; Ren, Hongru; Zhou, Xuyan; Li, Hui

    2016-03-01

    We report theoretical evidence of a liquid-liquid phase transition (LLPT) in liquid silicon carbide under nanoslit confinement. The LLPT is characterized by layering transitions induced by confinement and pressure, accompanying the rapid change in density. During the layering transition, the proportional distribution of tetracoordinated and pentacoordinated structures exhibits remarkable change. The tricoordinated structures lead to the microphase separation between silicon (with the dominant tricoordinated, tetracoordinated, and pentacoordinated structures) and carbon (with the dominant tricoordinated structures) in the layer close to the walls. A strong layer separation between silicon atoms and carbon atoms is induced by strong wall-liquid forces. Importantly, the pressure confinement phase diagram with negative slopes for LLPT lines indicates that, under high pressure, the LLPT is mainly confinement-induced, but under low pressure, it becomes dominantly pressure-induced. PMID:26859609

  5. Silicon Carbide Emitter Turn-Off Thyristor

    DOE PAGESBeta

    Wang, Jun; Wang, Gangyao; Li, Jun; Huang, Alex Q.; Melcher, Jerry; Atcitty, Stan

    2008-01-01

    A novel MOS-conmore » trolled SiC thyristor device, the SiC emitter turn-off thyristor (ETO) is a promising technology for future high-voltage switching applications because it integrates the excellent current conduction capability of a SiC thyristor with a simple MOS-control interface. Through unity-gain turn-off, the SiC ETO also achieves excellent Safe Operation Area (SOA) and faster switching speeds than silicon ETOs. The world's first 4.5-kV SiC ETO prototype shows a forward voltage drop of 4.26 V at 26.5  A / cm 2 current density at room and elevated temperatures. Tested in an inductive circuit with a 2.5 kV DC link voltage and a 9.56-A load current, the SiC ETO shows a fast turn-off time of 1.63 microseconds and a low 9.88 mJ turn-off energy. The low switching loss indicates that the SiC ETO could operate at about 4 kHz if 100  W / cm 2 conduction and the 100  W / cm 2 turn-off losses can be removed by the thermal management system. This frequency capability is about 4 times higher than 4.5-kV-class silicon power devices. The preliminary demonstration shows that the SiC ETO is a promising candidate for high-frequency, high-voltage power conversion applications, and additional developments to optimize the device for higher voltage (>5 kV) and higher frequency (10 kHz) are needed.« less

  6. Method for silicon carbide production by reacting silica with hydrocarbon gas

    DOEpatents

    Glatzmaier, G.C.

    1994-06-28

    A method is described for producing silicon carbide particles using a silicon source material and a hydrocarbon. The method is efficient and is characterized by high yield. Finely divided silicon source material is contacted with hydrocarbon at a temperature of 400 C to 1000 C where the hydrocarbon pyrolyzes and coats the particles with carbon. The particles are then heated to 1100 C to 1600 C to cause a reaction between the ingredients to form silicon carbide of very small particle size. No grinding of silicon carbide is required to obtain small particles. The method may be carried out as a batch process or as a continuous process. 5 figures.

  7. Method for silicon carbide production by reacting silica with hydrocarbon gas

    DOEpatents

    Glatzmaier, Gregory C.

    1994-01-01

    A method is described for producing silicon carbide particles using a silicon source material and a hydrocarbon. The method is efficient and is characterized by high yield. Finely divided silicon source material is contacted with hydrocarbon at a temperature of 400.degree. C. to 1000.degree. C. where the hydrocarbon pyrolyzes and coats the particles with carbon. The particles are then heated to 1100.degree. C. to 1600.degree. C. to cause a reaction between the ingredients to form silicon carbide of very small particle size. No grinding of silicon carbide is required to obtain small particles. The method may be carried out as a batch process or as a continuous process.

  8. Synthesis of silicon carbide at room temperature from colloidal suspensions of silicon dioxide and carbon nanotubes

    NASA Astrophysics Data System (ADS)

    Zhukalin, D. A.; Tuchin, A. V.; Kulikova, T. V.; Bityutskaya, L. A.

    2015-11-01

    Experimental and theoretical approaches were used for the investigation of mechanisms and conditions of self-organized nanostructures formation in the drying drop of the mixture of colloidal suspensions of nanoscale amorphous silicon dioxide and carbon nanotubes. The formation of rodlike structures with diameter 250-300nm and length ∼4pm was revealed. The diffraction analysis of the obtained nanostructures showed the formation of the silicon carbide phase at room temperature.

  9. Microstructural Evolution of Chloride-Cleaned Silicon Carbide Aluminum Composites

    NASA Astrophysics Data System (ADS)

    Adeosun, S. O.; Akpan, E. I.; Gbenebor, O. P.; Balogun, S. A.

    2016-02-01

    This study examines the synergy between reinforcement surface modifications on the evolution of microstructures of AA6011-silicon carbide particle (SiCp) composites in multidirectional solidification. Silicon carbide particles (SiCp) were cleaned with ammonium chloride, tin(II) chloride, sodium chloride, and palladium(II) chloride and used as reinforcement to cast AA6011-SiCp composites by applying the stir casting method. A scanning electron microscope and x-ray diffractometer were used to investigate the morphology and phases present, respectively, in the composite material. Results show that wetting agents were effective as they inhibited the formation of Al4C3 in all modified composites. The modified SiCp was found to have varying effects on the morphology, dendrite arm size and direction, size and configuration of AlFeSi, and the amount of eutectic silicon depending on the concentration of the reagent and cleaning time. The highest effect was shown by the use of 40 g/L of tin(II) chloride. The composites had short dendritic arms, good interfacial interaction, and only a few crystals of AlFeSi.

  10. Utility-Scale Silicon Carbide Semiconductor: Monolithic Silicon Carbide Anode Switched Thyristor for Medium Voltage Power Conversion

    SciTech Connect

    2010-09-01

    ADEPT Project: GeneSiC is developing an advanced silicon-carbide (SiC)-based semiconductor called an anode-switched thyristor. This low-cost, compact SiC semiconductor conducts higher levels of electrical energy with better precision than traditional silicon semiconductors. This efficiency will enable a dramatic reduction in the size, weight, and volume of the power converters and electronic devices it's used in.GeneSiC is developing its SiC-based semiconductor for utility-scale power converters. Traditional silicon semiconductors can't process the high voltages that utility-scale power distribution requires, and they must be stacked in complicated circuits that require bulky insulation and cooling hardware. GeneSiC's semiconductors are well suited for high-power applications like large-scale renewable wind and solar energy installations.