Science.gov

Sample records for microwave plasma-enhanced chemical

  1. Fabrication of Carbon Nanotubes by Slot-Excited Microwave Plasma-Enhanced Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Shim, Gyu Il; Kojima, Yoshihiro; Kono, Satoshi; Ohno, Yutaka; Ishijima, Tatsuo

    2008-07-01

    Carbon nanotubes (CNTs) are fabricated by adopting plasma-enhanced chemical vapor deposition (PECVD) with a planar microwave plasma source. Plasma is produced by a slot antenna at 2.45-GHz microwave injection in CH4/H2 mixture. In this study, it is shown that avoiding the exposure of the substrate to the plasma drastically improves the CNT growth. Furthermore, it is found that the CNT quality can be controlled with the optimization of one of the steps in the catalyst treatment, such as the preheating procedure; the treated catalyst is considered to be unaffected by the heating in the high-density microwave plasma treatment during the CNT growth.

  2. Deposition of aligned bamboo-like carbon nanotubes via microwave plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Cui, H.; Zhou, O.; Stoner, B. R.

    2000-11-01

    Aligned multiwall carbon nanotubes have been grown on silicon substrates by microwave plasma enhanced chemical vapor deposition using methane/ammonia mixtures. Scanning electron microscopy shows that the nanotubes are well aligned with high aspect ratio and growth direction normal to the substrate. Transmission electron microscopy reveals that the majority phase has a bamboo-like structure. Data are also presented showing process variable effects on the size and microstructure of the aligned nanotubes, giving insight into possible nucleation and growth mechanisms for the process.

  3. Growth of cubic boron nitride on diamond particles by microwave plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Saitoh, H.; Yarbrough, W. A.

    1991-06-01

    The nucleation and growth of cubic boron nitride (c-BN) onto diamond powder using solid NaBH4 in low pressure gas mixtures of NH3 and H2 by microwave plasma enhanced chemical vapor deposition has been studied. Boron nitride was deposited on submicron diamond seed crystals scattered on (100) silicon single crystal wafers and evidence was found for the formation of the cubic phase. Diamond powder surfaces appear to preferentially nucleate c-BN. In addition, it was found that the ratio of c-BN to turbostratic structure boron nitride (t-BN) deposited increases with decreasing NH3 concentration in H2. It is suggested that this may be due to an increased etching rate for t-BN by atomic hydrogen whose partial pressure may vary with NH3 concentration.

  4. Carbon nanowalls grown by microwave plasma enhanced chemical vapor deposition during the carbonization of polyacrylonitrile fibers

    SciTech Connect

    Li Jiangling; Su Shi; Kundrat, Vojtech; Abbot, Andrew M.; Ye, Haitao; Zhou Lei; Mushtaq, Fajer; Ouyang Defang; James, David; Roberts, Darren

    2013-01-14

    We used microwave plasma enhanced chemical vapor deposition (MPECVD) to carbonize an electrospun polyacrylonitrile (PAN) precursor to form carbon fibers. Scanning electron microscopy, Raman spectroscopy, and Fourier transform infrared spectroscopy were used to characterize the fibers at different evolution stages. It was found that MPECVD-carbonized PAN fibers do not exhibit any significant change in the fiber diameter, whilst conventionally carbonized PAN fibers show a 33% reduction in the fiber diameter. An additional coating of carbon nanowalls (CNWs) was formed on the surface of the carbonized PAN fibers during the MPECVD process without the assistance of any metallic catalysts. The result presented here may have a potential to develop a novel, economical, and straightforward approach towards the mass production of carbon fibrous materials containing CNWs.

  5. Reaction Gas Ratio Effect on the Growth of a Diamond Film Using Microwave Plasma-Enhanced Chemical Vapor Deposition.

    PubMed

    Joung, Y H; Kang, F S; Lee, S; Kang, H; Choi, W S; Choi, Y K; Song, B S; Lee, J; Hong, B

    2016-05-01

    In this study, diamond films were prepared using the microwave plasma-enhanced chemical vapor deposition (PECVD) system, which included a DC bias system to enhance the nucleation of the films. The films were synthesized on Si wafers with different ratios of methane (CH4) and hydrogen (H2) gases. We have studied the effects of the CH4-to-H2 ratio on the structural and optical properties of diamond films. The thickness and surface profile of the films were characterized via field emission scanning electron microscopy (FE-SEM). Raman was used to investigate the structural properties of the diamond films. The refractive indexes as functions of the CH4-to-H2 ratio were measured using an ellipsometer. The FE-SEM analysis showed that the 3 and 5 sccm CH4 created diamond films. The Raman analysis indicated that a nanocrystalline diamond film was formed at 3 sccm; a general diamond film, at 5 sccm; and films similar to the a-C:H film, at 7 sccm. The ellipsometer measurement showed that the refractive index of the synthesized diamond film was around 2.42 at 3 sccm. This value decreased as the CH4 volume increased. PMID:27483918

  6. Microwave plasma enhanced chemical vapor deposition of nanocrystalline diamond films by bias-enhanced nucleation and bias-enhanced growth

    SciTech Connect

    Chu, Yueh-Chieh; Tzeng, Yonhua; Auciello, Orlando

    2014-01-14

    Effects of biasing voltage-current relationship on microwave plasma enhanced chemical vapor deposition of ultrananocrystalline diamond (UNCD) films on (100) silicon in hydrogen diluted methane by bias-enhanced nucleation and bias-enhanced growth processes are reported. Three biasing methods are applied to study their effects on nucleation, growth, and microstructures of deposited UNCD films. Method A employs 320 mA constant biasing current and a negative biasing voltage decreasing from −490 V to −375 V for silicon substrates pre-heated to 800 °C. Method B employs 400 mA constant biasing current and a decreasing negative biasing voltage from −375 V to −390 V for silicon pre-heated to 900 °C. Method C employs −350 V constant biasing voltage and an increasing biasing current up to 400 mA for silicon pre-heated to 800 °C. UNCD nanopillars, merged clusters, and dense films with smooth surface morphology are deposited by the biasing methods A, B, and C, respectively. Effects of ion energy and flux controlled by the biasing voltage and current, respectively, on nucleation, growth, microstructures, surface morphologies, and UNCD contents are confirmed by scanning electron microscopy, high-resolution transmission-electron-microscopy, and UV Raman scattering.

  7. Coating of diamond-like carbon nanofilm on alumina by microwave plasma enhanced chemical vapor deposition process.

    PubMed

    Rattanasatien, Chotiwan; Tonanon, Nattaporn; Bhanthumnavin, Worawan; Paosawatyanyong, Boonchoat

    2012-01-01

    Diamond-like carbon (DLC) nanofilms with thickness varied from under one hundred to a few hundred nanometers have been successfully deposited on alumina substrates by microwave plasma enhanced chemical vapor deposition (MW-PECVD) process. To obtain dense continuous DLC nanofilm coating over the entire sample surface, alumina substrates were pre-treated to enhance the nucleation density. Raman spectra of DLC films on samples showed distinct diamond peak at around 1332 cm(-1), and the broad band of amorphous carbon phase at around 1550 cm(-1). Full width at half maximum height (FWHM) values indicated good formation of diamond phase in all films. The result of nano-indentation test show that the hardness of alumina samples increase from 7.3 +/- 2.0 GPa in uncoated samples to 15.8 +/- 4.5-52.2 +/- 2.1 GPa in samples coated with DLC depending on the process conditions. It is observed that the hardness values are still in good range although the thickness of the films is less than a hundred nanometer. PMID:22524033

  8. Synthesis of thin films in boron-carbon-nitrogen ternary system by microwave plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Kukreja, Ratandeep Singh

    The Boron Carbon Nitorgen (B-C-N) ternary system includes materials with exceptional properties such as wide band gap, excellent thermal conductivity, high bulk modulus, extreme hardness and transparency in the optical and UV range that find application in most fields ranging from micro-electronics, bio-sensors, and cutting tools to materials for space age technology. Interesting materials that belong to the B-C-N ternary system include Carbon nano-tubes, Boron Carbide, Boron Carbon Nitride (B-CN), hexagonal Boron Nitride ( h-BN), cubic Boron Nitride (c-BN), Diamond and beta Carbon Nitride (beta-C3N4). Synthesis of these materials requires precisely controlled and energetically favorable conditions. Chemical vapor deposition is widely used technique for deposition of thin films of ceramics, metals and metal-organic compounds. Microwave plasma enhanced chemical vapor deposition (MPECVD) is especially interesting because of its ability to deposit materials that are meta-stable under the deposition conditions, for e.g. diamond. In the present study, attempt has been made to synthesize beta-carbon nitride (beta-C3N4) and cubic-Boron Nitride (c-BN) thin films by MPECVD. Also included is the investigation of dependence of residual stress and thermal conductivity of the diamond thin films, deposited by MPECVD, on substrate pre-treatment and deposition temperature. Si incorporated CNx thin films are synthesized and characterized while attempting to deposit beta-C3N4 thin films on Si substrates using Methane (CH4), Nitrogen (N2), and Hydrogen (H2). It is shown that the composition and morphology of Si incorporated CNx thin film can be tailored by controlling the sequence of introduction of the precursor gases in the plasma chamber. Greater than 100mum size hexagonal crystals of N-Si-C are deposited when Nitrogen precursor is introduced first while agglomerates of nano-meter range graphitic needles of C-Si-N are deposited when Carbon precursor is introduced first in the

  9. Study of the catalyst evolution during annealing preceding the growth of carbon nanotubes by microwave plasma-enhanced chemical vapour deposition

    NASA Astrophysics Data System (ADS)

    Malesevic, Alexander; Chen, Hong; Hauffman, Tom; Vanhulsel, Annick; Terryn, Herman; Van Haesendonck, Chris

    2007-11-01

    A two-step catalyst annealing process is developed in order to control the diameter of nickel catalyst particles for the growth of carbon nanotubes (CNTs) by microwave plasma-enhanced chemical vapour deposition (MW PECVD). Thermal annealing of a continuous nickel film in a hydrogen (H2) environment in a first step is found to be insufficient for the formation of nanometre-size, high-density catalyst particles. In a second step, a H2 MW plasma treatment decreases the catalyst diameter by a factor of two and increases the particle density by a factor of five. An x-ray photoelectron spectroscopy study of the catalyst after each step in the annealing process is presented. It is found that the catalyst particles interact with the substrate during thermal annealing, thereby forming a silicate, even if a buffer layer in between the catalyst and the substrate is intended to prevent silicate formation. The silicate formation and reduction is shown to be directly related to the CNT growth mechanism, determining whether the catalyst particles reside at the base or the tip of the growing CNTs. The catalyst particles are used for the growth of a high-density CNT coating by MW PECVD. CNTs are analysed with electron microscopy and Raman spectroscopy.

  10. Effect of Gas Sources on the Deposition of Nano-Crystalline Diamond Films Prepared by Microwave Plasma Enhanced Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Weng, Jun; Xiong, Liwei; Wang, Jianhua; Man, Weidong; Chen, Guanhu

    2010-12-01

    Nano-crystalline diamond (NCD) films were deposited on silicon substrates by a microwave plasma enhanced chemical vapor deposition (MPCVD) reactor in C2H5OH/H2 and CH4/H2/O2 systems, respectively, with a constant ratio of carbon/hydrogen/oxygen. By means of atomic force microscopy (AFM) and X-ray diffraction (XRD), it was shown that the NCD films deposited in the C2H5OH/H2 system possesses more uniform surface than that deposited in the CH4/H2/O2 system. Results from micro-Raman spectroscopy revealed that the quality of the NCD films was different even though the plasmas in the two systems contain exactly the same proportion of elements. In order to explain this phenomenon, the bond energy of forming OH groups, energy distraction in plasma and the deposition process of NCD films were studied. The experimental results and discussion indicate that for a same ratio of carbon/hydrogen/oxygen, the C2H5OH/H2 plasma was beneficial to deposit high quality NCD films with smaller average grain size and lower surface roughness.

  11. A solid-state nuclear magnetic resonance study of post-plasma reactions in organosilicone microwave plasma-enhanced chemical vapor deposition (PECVD) coatings.

    PubMed

    Hall, Colin J; Ponnusamy, Thirunavukkarasu; Murphy, Peter J; Lindberg, Mats; Antzutkin, Oleg N; Griesser, Hans J

    2014-06-11

    Plasma-polymerized organosilicone coatings can be used to impart abrasion resistance and barrier properties to plastic substrates such as polycarbonate. Coating rates suitable for industrial-scale deposition, up to 100 nm/s, can be achieved through the use of microwave plasma-enhanced chemical vapor deposition (PECVD), with optimal process vapors such as tetramethyldisiloxane (TMDSO) and oxygen. However, it has been found that under certain deposition conditions, such coatings are subject to post-plasma changes; crazing or cracking can occur anytime from days to months after deposition. To understand the cause of the crazing and its dependence on processing plasma parameters, the effects of post-plasma reactions on the chemical bonding structure of coatings deposited with varying TMDSO-to-O2 ratios was studied with (29)Si and (13)C solid-state magic angle spinning nuclear magnetic resonance (MAS NMR) using both single-pulse and cross-polarization techniques. The coatings showed complex chemical compositions significantly altered from the parent monomer. (29)Si MAS NMR spectra revealed four main groups of resonance lines, which correspond to four siloxane moieties (i.e., mono (M), di (D), tri (T), and quaternary (Q)) and how they are bound to oxygen. Quantitative measurements showed that the ratio of TMDSO to oxygen could shift the chemical structure of the coating from 39% to 55% in Q-type bonds and from 28% to 16% for D-type bonds. Post-plasma reactions were found to produce changes in relative intensities of (29)Si resonance lines. The NMR data were complemented by Fourier transform infrared (FTIR) spectroscopy. Together, these techniques have shown that the bonding environment of Si is drastically altered by varying the TMDSO-to-O2 ratio during PECVD, and that post-plasma reactions increase the cross-link density of the silicon-oxygen network. It appears that Si-H and Si-OH chemical groups are the most susceptible to post-plasma reactions. Coatings produced at a

  12. Carbon Nanotubes/Nanofibers by Plasma Enhanced Chemical Vapour Deposition

    NASA Technical Reports Server (NTRS)

    Teo, K. B. K.; Hash, D. B.; Bell, M. S.; Chhowalla, M.; Cruden, B. A.; Amaratunga, G. A. J.; Meyyappan, M.; Milne, W. I.

    2005-01-01

    Plasma enhanced chemical vapour deposition (PECVD) has been recently used for the production of vertically aligned carbon nanotubedfibers (CN) directly on substrates. These structures are potentially important technologically as electron field emitters (e.g. microguns, microwave amplifiers, displays), nanoelectrodes for sensors, filter media, superhydrophobic surfaces and thermal interface materials for microelectronics. A parametric study on the growth of CN grown by glow discharge dc-PECVD is presented. In this technique, a substrate containing thin film Ni catalyst is exposed to C2H2 and NH3 gases at 700 C. Without plasma, this process is essentially thermal CVD which produces curly spaghetti-like CN as seen in Fig. 1 (a). With the plasma generated by biasing the substrate at -6OOV, we observed that the CN align vertically during growth as shown in Fig. l(b), and that the magnitude of the applied substrate bias affects the degree of alignment. The thickness of the thin film Ni catalyst was found to determine the average diameter and inversely the length of the CN. The yield and density of the CN were controlled by the use of different diffusion barrier materials under the Ni catalyst. Patterned CN growth [Fig. l(c)], with la variation in CN diameter of 4.1% and 6.3% respectively, is achieved by lithographically defining the Ni thin film prior to growth. The shape of the structures could be varied from very straight nanotube-like to conical tip-like nanofibers by increasing the ratio of C2H2 in the gas flow. Due to the plasma decomposition of C2H2, amorphous carbon (a-C) is an undesirable byproduct which could coat the substrate during CN growth. Using a combination of depth profiled Auger electron spectroscopy to study the substrate and in-situ mass spectroscopy to examine gas phase neutrals and ions, the optimal conditions for a-C free growth of CN is determined.

  13. Properties of silicon dioxide films deposited at low temperatures by microwave plasma enhanced decomposition of tetraethylorthosilicate

    SciTech Connect

    Ray, S.K.; Maiti, C.K.; Lahiri, S.K.; Chakrabarti, N.B.

    1992-05-01

    Silicon dioxide films have been deposited at low temperatures (200-250{degrees}C) by microwave plasma enhanced decomposition of tetraethylorthosilicate (TEOS). The effects of the presence of oxygen in the discharge in film deposition rate, mechanism, and the physical properties of the films have been investigated. Structural characterization of the deposited films has been carried out by etch rate measurements, infrared transmission spectra, x-ray photoelectron spectroscopy, Auger, and secondary ion mass spectrometry analyses. Films deposited using TEOS and oxygen have confirmed a density comparable to standard silane-based low-pressure chemical vapor deposited and plasma enhanced chemical vapor deposited oxides, nearly perfect stoichiometry, extremely low sodium and carbon content, and the absence of many undesirable hydrogen related bonds. Various electrical properties, viz., resistivity, breakdown strength, fixed oxide charge density, interface state density, and trapping behavior have been evaluated by the characterization of metal-oxide-semiconductor capacitors fabricated using deposited oxides. Deposited films on thin native oxides grown by either in situ plasma oxidation or a low temperature thermal oxidation exhibited excellent electrical properties. 32 refs., 16 figs., 2 tabs.

  14. Plasma-enhanced chemical vapor deposition of multiwalled carbon nanofibers

    NASA Technical Reports Server (NTRS)

    Matthews, Kristopher; Cruden, Brett A.; Chen, Bin; Meyyappan, M.; Delzeit, Lance

    2002-01-01

    Plasma-enhanced chemical vapor deposition is used to grow vertically aligned multiwalled carbon nanofibers (MWNFs). The graphite basal planes in these nanofibers are not parallel as in nanotubes; instead they exhibit a small angle resembling a stacked cone arrangement. A parametric study with varying process parameters such as growth temperature, feedstock composition, and substrate power has been conducted, and these parameters are found to influence the growth rate, diameter, and morphology. The well-aligned MWNFs are suitable for fabricating electrode systems in sensor and device development.

  15. Quantum cascade laser investigations of CH{sub 4} and C{sub 2}H{sub 2} interconversion in hydrocarbon/H{sub 2} gas mixtures during microwave plasma enhanced chemical vapor deposition of diamond

    SciTech Connect

    Ma Jie; Cheesman, Andrew; Ashfold, Michael N. R.; Hay, Kenneth G.; Wright, Stephen; Langford, Nigel; Duxbury, Geoffrey; Mankelevich, Yuri A.

    2009-08-01

    CH{sub 4} and C{sub 2}H{sub 2} molecules (and their interconversion) in hydrocarbon/rare gas/H{sub 2} gas mixtures in a microwave reactor used for plasma enhanced diamond chemical vapor deposition (CVD) have been investigated by line-of-sight infrared absorption spectroscopy in the wavenumber range of 1276.5-1273.1 cm{sup -1} using a quantum cascade laser spectrometer. Parameters explored include process conditions [pressure, input power, source hydrocarbon, rare gas (Ar or Ne), input gas mixing ratio], height (z) above the substrate, and time (t) after addition of hydrocarbon to a pre-existing Ar/H{sub 2} plasma. The line integrated absorptions so obtained have been converted to species number densities by reference to the companion two-dimensional (r,z) modeling of the CVD reactor described in Mankelevich et al. [J. Appl. Phys. 104, 113304 (2008)]. The gas temperature distribution within the reactor ensures that the measured absorptions are dominated by CH{sub 4} and C{sub 2}H{sub 2} molecules in the cool periphery of the reactor. Nonetheless, the measurements prove to be of enormous value in testing, tensioning, and confirming the model predictions. Under standard process conditions, the study confirms that all hydrocarbon source gases investigated (methane, acetylene, ethane, propyne, propane, and butane) are converted into a mixture dominated by CH{sub 4} and C{sub 2}H{sub 2}. The interconversion between these two species is highly dependent on the local gas temperature and the H atom number density, and thus on position within the reactor. CH{sub 4}->C{sub 2}H{sub 2} conversion occurs most efficiently in an annular shell around the central plasma (characterized by 1400CH{sub 4} is favored in the more distant regions where T{sub gas}<1400 K. Analysis of the multistep interconversion mechanism reveals substantial net consumption of H atoms accompanying the CH{sub 4}->C{sub 2}H{sub 2

  16. Quantum cascade laser investigations of CH4 and C2H2 interconversion in hydrocarbon/H2 gas mixtures during microwave plasma enhanced chemical vapor deposition of diamond

    NASA Astrophysics Data System (ADS)

    Ma, Jie; Cheesman, Andrew; Ashfold, Michael N. R.; Hay, Kenneth G.; Wright, Stephen; Langford, Nigel; Duxbury, Geoffrey; Mankelevich, Yuri A.

    2009-08-01

    CH4 and C2H2 molecules (and their interconversion) in hydrocarbon/rare gas/H2 gas mixtures in a microwave reactor used for plasma enhanced diamond chemical vapor deposition (CVD) have been investigated by line-of-sight infrared absorption spectroscopy in the wavenumber range of 1276.5-1273.1 cm-1 using a quantum cascade laser spectrometer. Parameters explored include process conditions [pressure, input power, source hydrocarbon, rare gas (Ar or Ne), input gas mixing ratio], height (z) above the substrate, and time (t) after addition of hydrocarbon to a pre-existing Ar/H2 plasma. The line integrated absorptions so obtained have been converted to species number densities by reference to the companion two-dimensional (r ,z) modeling of the CVD reactor described in Mankelevich et al. [J. Appl. Phys. 104, 113304 (2008)]. The gas temperature distribution within the reactor ensures that the measured absorptions are dominated by CH4 and C2H2 molecules in the cool periphery of the reactor. Nonetheless, the measurements prove to be of enormous value in testing, tensioning, and confirming the model predictions. Under standard process conditions, the study confirms that all hydrocarbon source gases investigated (methane, acetylene, ethane, propyne, propane, and butane) are converted into a mixture dominated by CH4 and C2H2. The interconversion between these two species is highly dependent on the local gas temperature and the H atom number density, and thus on position within the reactor. CH4→C2H2 conversion occurs most efficiently in an annular shell around the central plasma (characterized by 1400

  17. Growth of graphene films by plasma enhanced chemical vapour deposition

    NASA Astrophysics Data System (ADS)

    Baraton, Laurent; Gangloff, Laurent; Xavier, Stéphane; Cojocaru, Costel S.; Huc, Vincent; Legagneux, Pierre; Lee, Young Hee; Pribat, Didier

    2009-08-01

    Since it was isolated in 2004, graphene, the first known 2D crystal, is the object of a growing interest, due to the range of its possible applications as well as its intrinsic properties. From large scale electronics and photovoltaics to spintronics and fundamental quantum phenomena, graphene films have attracted a large community of researchers. But bringing graphene to industrial applications will require a reliable, low cost and easily scalable synthesis process. In this paper we present a new growth process based on plasma enhanced chemical vapor deposition. Furthermore, we show that, when the substrate is an oxidized silicon wafer covered by a nickel thin film, graphene is formed not only on top of the nickel film, but also at the interface with the supporting SiO2 layer. The films grown using this method were characterized using classical methods (Raman spectroscopy, AFM, SEM) and their conductivity is found to be close to those reported by others.

  18. Modeling and Simulation of Plasma Enhanced Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Smith, Aaron; Bett, Dominic; Cunningham, Monisha; Sen, Sudip

    2015-04-01

    Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Recent study from the X-ray diffraction spectra of SnO2 films deposited as a function of RF power apparently indicates that RF power is playing a stabilizing role and hence in the better deposition. The results show that the RF power results in smoother morphology, improved crystallinity, and lower sheet resistance value in the PECVD process. The PECVD processing allows deposition at lower temperatures, which is often critical in the manufacture of semiconductors. In this talk we will address two aspects of the problem, first to develop a model to study the mechanism of how the PECVD is effected by the RF power, and second to actually simulate the effect of RF power on PECVD. As the PECVD is a very important component of the plasma processing technology with many applications in the semiconductor technology and surface science, the research proposed here has the prospect to revolutionize the plasma processing technology through the stabilizing role of the RF power.

  19. Analysis of mass transport in an atmospheric pressure remote plasma-enhanced chemical vapor deposition process

    SciTech Connect

    Cardoso, R. P.; Belmonte, T.; Henrion, G.; Gries, T.; Tixhon, E.

    2010-01-15

    In remote microwave plasma enhanced chemical vapor deposition processes operated at atmospheric pressure, high deposition rates are associated with the localization of precursors on the treated surface. We show that mass transport can be advantageously ensured by convection for the heavier precursor, the lighter being driven by turbulent diffusion toward the surface. Transport by laminar diffusion is negligible. The use of high flow rates is mandatory to have a good mixing of species. The use of an injection nozzle with micrometer-sized hole enables us to define accurately the reaction area between the reactive species. The localization of the flow leads to high deposition rates by confining the reactive species over a small area, the deposition yield being therefore very high. Increasing the temperature modifies nonlinearly the deposition rates and the coating properties.

  20. Diagnostic for Plasma Enhanced Chemical Vapor Deposition and Etch Systems

    NASA Technical Reports Server (NTRS)

    Cappelli, Mark A.

    1999-01-01

    In order to meet NASA's requirements for the rapid development and validation of future generation electronic devices as well as associated materials and processes, enabling technologies ion the processing of semiconductor materials arising from understanding etch chemistries are being developed through a research collaboration between Stanford University and NASA-Ames Research Center, Although a great deal of laboratory-scale research has been performed on many of materials processing plasmas, little is known about the gas-phase and surface chemical reactions that are critical in many etch and deposition processes, and how these reactions are influenced by the variation in operating conditions. In addition, many plasma-based processes suffer from stability and reliability problems leading to a compromise in performance and a potentially increased cost for the semiconductor manufacturing industry. Such a lack of understanding has hindered the development of process models that can aid in the scaling and improvement of plasma etch and deposition systems. The research described involves the study of plasmas used in semiconductor processes. An inductively coupled plasma (ICP) source in place of the standard upper electrode assembly of the Gaseous Electronics Conference (GEC) radio-frequency (RF) Reference Cell is used to investigate the discharge characteristics and chemistries. This ICP source generates plasmas with higher electron densities (approximately 10(exp 12)/cu cm) and lower operating pressures (approximately 7 mTorr) than obtainable with the original parallel-plate version of the GEC Cell. This expanded operating regime is more relevant to new generations of industrial plasma systems being used by the microelectronics industry. The motivation for this study is to develop an understanding of the physical phenomena involved in plasma processing and to measure much needed fundamental parameters, such as gas-phase and surface reaction rates. species

  1. Synthesis, characterization and cathodoluminescence of nanostructured SnO2 using microwave plasma enhanced CVD

    NASA Astrophysics Data System (ADS)

    Wang, Chih-Yuan; Chen, Tzu-Wang; Lin, Chun-Chun; Hsieh, Wei-Jen; Chang, Ku-Ling; Shih, Han C.

    2007-05-01

    Nanostructured tin oxides have been synthesized in the form of nano-pins using SnCl2 · 2H2O as precursors in a short period of 2.5 min by microwave plasma enhanced CVD. The resulting nano-pins have square cross sections of 50-60 nm at the pin head, 10-20 nm at the pin proper and less than 5 nm at the pin tail; the full length of the pin is about several micrometres. The optical properties measured by cathodoluminescence show strong indigo emission at 404 and 460 nm. The nucleation and growth are dominated by a self-catalytic vapour-liquid-solid mechanism, which has been studied in this work.

  2. Microwave remote plasma enhanced-atomic layer deposition system with multicusp confinement chamber

    SciTech Connect

    Dechana, A.; Thamboon, P.; Boonyawan, D.

    2014-10-15

    A microwave remote Plasma Enhanced-Atomic Layer Deposition system with multicusp confinement chamber is established at the Plasma and Beam Physics research facilities, Chiang Mai, Thailand. The system produces highly-reactive plasma species in order to enhance the deposition process of thin films. The addition of the multicusp magnetic fields further improves the plasma density and uniformity in the reaction chamber. Thus, the system is more favorable to temperature-sensitive substrates when heating becomes unwanted. Furthermore, the remote-plasma feature, which is generated via microwave power source, offers tunability of the plasma properties separately from the process. As a result, the system provides high flexibility in choice of materials and design experiments, particularly for low-temperature applications. Performance evaluations of the system were carried on coating experiments of Al{sub 2}O{sub 3} layers onto a silicon wafer. The plasma characteristics in the chamber will be described. The resulted Al{sub 2}O{sub 3} films—analyzed by Rutherford Backscattering Spectrometry in channeling mode and by X-ray Photoelectron Spectroscopy techniques—will be discussed.

  3. Microwave remote plasma enhanced-atomic layer deposition system with multicusp confinement chamber

    NASA Astrophysics Data System (ADS)

    Dechana, A.; Thamboon, P.; Boonyawan, D.

    2014-10-01

    A microwave remote Plasma Enhanced-Atomic Layer Deposition system with multicusp confinement chamber is established at the Plasma and Beam Physics research facilities, Chiang Mai, Thailand. The system produces highly-reactive plasma species in order to enhance the deposition process of thin films. The addition of the multicusp magnetic fields further improves the plasma density and uniformity in the reaction chamber. Thus, the system is more favorable to temperature-sensitive substrates when heating becomes unwanted. Furthermore, the remote-plasma feature, which is generated via microwave power source, offers tunability of the plasma properties separately from the process. As a result, the system provides high flexibility in choice of materials and design experiments, particularly for low-temperature applications. Performance evaluations of the system were carried on coating experiments of Al2O3 layers onto a silicon wafer. The plasma characteristics in the chamber will be described. The resulted Al2O3 films—analyzed by Rutherford Backscattering Spectrometry in channeling mode and by X-ray Photoelectron Spectroscopy techniques—will be discussed.

  4. Vertically aligned peptide nanostructures using plasma-enhanced chemical vapor deposition.

    PubMed

    Vasudev, Milana C; Koerner, Hilmar; Singh, Kristi M; Partlow, Benjamin P; Kaplan, David L; Gazit, Ehud; Bunning, Timothy J; Naik, Rajesh R

    2014-02-10

    In this study, we utilize plasma-enhanced chemical vapor deposition (PECVD) for the deposition of nanostructures composed of diphenylalanine. PECVD is a solvent-free approach and allows sublimation of the peptide to form dense, uniform arrays of peptide nanostructures on a variety of substrates. The PECVD deposited d-diphenylalanine nanostructures have a range of chemical and physical properties depending on the specific discharge parameters used during the deposition process. PMID:24400716

  5. The Role of Plasma in Plasma Enhanced Chemical Vapour Deposition of Nanostructure Growth

    NASA Technical Reports Server (NTRS)

    Hash, David B.; Meyyappan, M.; Teo, Kenneth B. K.; Lacerda, Rodrigo G.; Rupesinghe, Nalin L.

    2004-01-01

    Chemical vapour deposition (CVD) has become the preferred process for high yield growth of carbon nanotubes and nanofibres because of its ability to pattern growth through lithographic positioning of transition metal catalysts on substrates. Many potential applications of nanotubes such as field emitters [1] require not only patterned growth but also vertical alignment. Some degree of ali,ment in thermal CVD processes can be obtained when carbon nanotubes are grown closely together as a result of van der Waals interactions. The ali,onment however is marginal, and the van der Waals prerequisite makes growth of freestanding nanofibres with thermal CVD unrealizable. The application of electric fields as a means of ali,onment has been shown to overcome this limitation [2-5], and highly aligned nanostructures can be grown if electric fields on the order of 0.5 V/microns are employed. Plasma enhanced CVD in various configurations including dc, rf, microwave, inductive and electron cyclotron resonance has been pursued as a means of enabling alignment in the CVD process. However, the sheath fields for the non-dc sources are in general not sufficient for a high degree of ali,pment and an additional dc bias is usually applied to the growth substrate. This begs the question as to the actual role of the plasma. It is clear that the plasma itself is not required for aligned growth as references [3] and [4] employed fields through small applied voltages (3-20 V) across very small electrode spacings (10-100 microns) and thus avoided striking a discharge.

  6. Microstructure of boron nitride coated on nuclear fuels by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Durmazuçar, Hasan H.; Gündüz, Güngör; Toker, Canan

    1998-08-01

    Three nuclear fuels, pure urania, 5% and 10% gadolinia containing fuels were coated with boron nitride to improve nuclear and physical properties. Coating was done by plasma enhanced chemical vapor deposition technique by using boron trichloride and ammonia. The specimens were examined under a scanning electron microscope. Boron nitride formed a grainy structure on all fuels. Gadolinia decreased the grain size of boron nitride. The fractal dimensions of fragmentation and of area-perimeter relation were determined.

  7. Fabrication of Carbon Nanotube Field Effect Transistors Using Plasma-Enhanced Chemical Vapor Deposition Grown Nanotubes

    NASA Astrophysics Data System (ADS)

    Ohnaka, Hirofumi; Kojima, Yoshihiro; Kishimoto, Shigeru; Ohno, Yutaka; Mizutani, Takashi

    2006-06-01

    Single-walled carbon nanotubes are grown using grid-inserted plasma-enhanced chemical vapor deposition (PECVD). The field effect transistor operation was confirmed using the PECVD grown carbon nanotubes (CNTs). The preferential growth of the semiconducting nanotubes was confirmed in the grid-inserted PECVD by measuring current-voltage (I-V) characteristics of the devices. Based on the measurement of the electrical breakdown of the metallic CNTs, the probability of growing the semiconducting nanotubes has been estimated to be more than 90%.

  8. TOPICAL REVIEW: A review of plasma enhanced chemical vapour deposition of carbon nanotubes

    NASA Astrophysics Data System (ADS)

    Meyyappan, M.

    2009-11-01

    Plasma enhanced chemical vapour deposition (PECVD) has been widely discussed in the literature for the growth of carbon nanotubes (CNTs) and carbon nanofibres (CNFs) in recent years. Advantages claimed include lower growth temperatures relative to thermal CVD and the ability to grow individual, free-standing, vertical CNFs instead of tower-like structures or ensembles. This paper reviews the current status of the technology including equipment, plasma chemistry, diagnostics and modelling, and mechanisms. Recent accomplishments include PECVD of single-walled CNTs and growth at low temperatures for handling delicate substrates such as glass.

  9. Studies on non-oxide coating on carbon fibers using plasma enhanced chemical vapor deposition technique

    NASA Astrophysics Data System (ADS)

    Patel, R. H.; Sharma, S.; Prajapati, K. K.; Vyas, M. M.; Batra, N. M.

    2016-05-01

    A new way of improving the oxidative behavior of carbon fibers coated with SiC through Plasma Enhanced Chemical Vapor Deposition technique. The complete study includes coating of SiC on glass slab and Stainless steel specimen as a starting test subjects but the major focus was to increase the oxidation temperature of carbon fibers by PECVD technique. This method uses relatively lower substrate temperature and guarantees better stoichiometry than other coating methods and hence the substrate shows higher resistance towards mechanical and thermal stresses along with increase in oxidation temperature.

  10. Low-temperature in situ formation of Y-Ba-Cu-O high T sub c superconducting thin films by plasma-enhanced metalorganic chemical vapor deposition

    SciTech Connect

    Zhao, J.; Noh, D.W.; Chern, C.; Li, Y.Q.; Norris, P.; Gallois, B.; Kear, B. )

    1990-06-04

    Highly textured, highly dense, superconducting YBa{sub 2}Cu{sub 3}O{sub 7{minus}{ital x}} thin films with mirror-like surfaces have been prepared, {ital in} {ital situ}, at a reduced substrate temperature as low as 570 {degree}C by a remote microwave plasma-enhanced metalorganic chemical vapor deposition process (PE-MOCVD). Nitrous oxide was used as the oxidizer gas. The as-deposited films grown by PE-MOCVD show attainment of zero resistance at 72 K. PE-MOCVD was carried out in a commercial scale MOCVD reactor.

  11. Synthesis of carbon nanowall by plasma-enhanced chemical vapor deposition method.

    PubMed

    Liu, Rulin; Chi, Yaqing; Fang, Liang; Tang, Zhensen; Yi, Xun

    2014-02-01

    Plasma-enhanced chemical vapor deposition (PECVD) is widely used for the synthesis of carbon materials, such as diamond-like carbons (DLCs), carbon nanotubes (CNTs) and carbon nanowalls (CNWs). Advantages of PECVD are low synthesis temperature compared with thermal CVD and the ability to grow vertically, free-standing structures. Due to its self-supported property and high specific surface area, CNWs are a promising material for field emission devices and other chemical applications. This article reviews the recent process on the synthesis of CNW by the PECVD method. We briefly introduce the structure and properties of CNW with characterization techniques. Growth mechanism is also discussed to analyze the influence of plasma conditions, substrates, temperature, and other parameters to the final film, which will give a suggestion on parameter modulation for desired film. PMID:24749447

  12. MICROWAVE TECHNOLOGY CHEMICAL SYNTHESIS APPLICATIONS

    EPA Science Inventory

    Microwave-accelerated chemical syntheses in various solvents as well as under solvent-free conditions have witnessed an explosive growth. The technique has found widespread application predominantly exploiting the inexpensive unmodified household microwave (MW) ovens although th...

  13. A mathematical model and simulation results of plasma enhanced chemical vapor deposition of silicon nitride films

    NASA Astrophysics Data System (ADS)

    Konakov, S. A.; Krzhizhanovskaya, V. V.

    2015-01-01

    We developed a mathematical model of Plasma Enhanced Chemical Vapor Deposition (PECVD) of silicon nitride thin films from SiH4-NH3-N2-Ar mixture, an important application in modern materials science. Our multiphysics model describes gas dynamics, chemical physics, plasma physics and electrodynamics. The PECVD technology is inherently multiscale, from macroscale processes in the chemical reactor to atomic-scale surface chemistry. Our macroscale model is based on Navier-Stokes equations for a transient laminar flow of a compressible chemically reacting gas mixture, together with the mass transfer and energy balance equations, Poisson equation for electric potential, electrons and ions balance equations. The chemical kinetics model includes 24 species and 58 reactions: 37 in the gas phase and 21 on the surface. A deposition model consists of three stages: adsorption to the surface, diffusion along the surface and embedding of products into the substrate. A new model has been validated on experimental results obtained with the "Plasmalab System 100" reactor. We present the mathematical model and simulation results investigating the influence of flow rate and source gas proportion on silicon nitride film growth rate and chemical composition.

  14. High Current Emission from Patterned Aligned Carbon Nanotubes Fabricated by Plasma-Enhanced Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Cui, Linfan; Chen, Jiangtao; Yang, Bingjun; Jiao, Tifeng

    2015-12-01

    Vertically, carbon nanotube (CNT) arrays were successfully fabricated on hexagon patterned Si substrates through radio frequency plasma-enhanced chemical vapor deposition using gas mixtures of acetylene (C2H2) and hydrogen (H2) with Fe/Al2O3 catalysts. The CNTs were found to be graphitized with multi-walled structures. Different H2/C2H2 gas flow rate ratio was used to investigate the effect on CNT growth, and the field emission properties were optimized. The CNT emitters exhibited excellent field emission performance (the turn-on and threshold fields were 2.1 and 2.4 V/μm, respectively). The largest emission current could reach 70 mA/cm2. The emission current was stable, and no obvious deterioration was observed during the long-term stability test of 50 h. The results were relevant for practical applications based on CNTs.

  15. High Current Emission from Patterned Aligned Carbon Nanotubes Fabricated by Plasma-Enhanced Chemical Vapor Deposition.

    PubMed

    Cui, Linfan; Chen, Jiangtao; Yang, Bingjun; Jiao, Tifeng

    2015-12-01

    Vertically, carbon nanotube (CNT) arrays were successfully fabricated on hexagon patterned Si substrates through radio frequency plasma-enhanced chemical vapor deposition using gas mixtures of acetylene (C2H2) and hydrogen (H2) with Fe/Al2O3 catalysts. The CNTs were found to be graphitized with multi-walled structures. Different H2/C2H2 gas flow rate ratio was used to investigate the effect on CNT growth, and the field emission properties were optimized. The CNT emitters exhibited excellent field emission performance (the turn-on and threshold fields were 2.1 and 2.4 V/μm, respectively). The largest emission current could reach 70 mA/cm(2). The emission current was stable, and no obvious deterioration was observed during the long-term stability test of 50 h. The results were relevant for practical applications based on CNTs. PMID:26666912

  16. One-step synthesis of chlorinated graphene by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Fan, Liwei; Zhang, Hui; Zhang, Pingping; Sun, Xuhui

    2015-08-01

    We developed an approach to synthesize the chlorinated single layer graphene (Cl-G) by one-step plasma enhanced chemical vapor deposition. Copper foil was simply treated with hydrochloric acid and then CuCl2 formed on the surface was used as Cl source under the assistance of plasma treatment. Compared with other two-step methods by post plasma/photochemical treatment of CVD-grown single layer graphene (SLG), one-step Cl-G synthesis approach is quite straightforward and effective. X-ray photoelectron spectroscopy (XPS) revealed that ∼2.45 atom% Cl remained in SLG. Compared with the pristine SLG, the obvious blue shifts of G band and 2D band along with the appearance of D' band and D + G band in the Raman spectra indicate p-type doping of Cl-G.

  17. Stress hysteresis and mechanical properties of plasma-enhanced chemical vapor deposited dielectric films

    NASA Astrophysics Data System (ADS)

    Thurn, Jeremy; Cook, Robert F.; Kamarajugadda, Mallika; Bozeman, Steven P.; Stearns, Laura C.

    2004-02-01

    A comprehensive survey is described of the responses of three plasma-enhanced chemical vapor deposited dielectric film systems to thermal cycling and indentation contact. All three films—silicon oxide, silicon nitride, and silicon oxy-nitride—exhibited significant nonequilibrium permanent changes in film stress on thermal cycling or annealing. The linear relationship between stress and temperature changed after the films were annealed at 300 °C, representing a structural alteration in the film reflecting a change in coefficient of thermal expansion or biaxial modulus. A double-substrate method was used to deduce both thermoelastic properties before and after the anneal of selected films and the results were compared with the modulus deconvoluted from small-scale depth-sensing indentation experiments (nanoindentation). Rutherford backscattering spectrometry and hydrogen forward scattering were used to deduce the composition of the films and it was found that all the films contained significant amounts of hydrogen.

  18. Plasma-enhanced chemical vapor deposition of amorphous Si on graphene

    NASA Astrophysics Data System (ADS)

    Lupina, G.; Strobel, C.; Dabrowski, J.; Lippert, G.; Kitzmann, J.; Krause, H. M.; Wenger, Ch.; Lukosius, M.; Wolff, A.; Albert, M.; Bartha, J. W.

    2016-05-01

    Plasma-enhanced chemical vapor deposition of thin a-Si:H layers on transferred large area graphene is investigated. Radio frequency (RF, 13.56 MHz) and very high frequency (VHF, 140 MHz) plasma processes are compared. Both methods provide conformal coating of graphene with Si layers as thin as 20 nm without any additional seed layer. The RF plasma process results in amorphization of the graphene layer. In contrast, the VHF process keeps the high crystalline quality of the graphene layer almost intact. Correlation analysis of Raman 2D and G band positions indicates that Si deposition induces reduction of the initial doping in graphene and an increase of compressive strain. Upon rapid thermal annealing, the amorphous Si layer undergoes dehydrogenation and transformation into a polycrystalline film, whereby a high crystalline quality of graphene is preserved.

  19. Free-standing thin film Ge single crystals grown by plasma-enhanced chemical vapor deposition

    NASA Technical Reports Server (NTRS)

    Outlaw, R. A.; Hopson, P., Jr.

    1984-01-01

    The films, which are approximately 10 microns in thickness, are grown epitaxially on polished (100) NaCl substrates at 450 C by plasma enhanced chemical vapor deposition. Upon cooling, the films are separated from the substrate by differential shear stress, leaving free-standing films of Ge which can be handled. Growths are attained by nucleating at minimum plasma power for very brief intervals and then raising the power to 65 W to increase the growth rate to approximately 10 microns/h. It is found that substrate exposure to the plasma at too high a power for too long a time sputters and erodes the surface, thereby substantially degrading the nucleation process and the ultimate growths. It is noted that the free-standing films are visually specular and exhibit a high degree of crystalline order when examined by X-ray diffraction. Auger electron spectroscopy and energy dispersive analysis of X-rays reveal no detectable bulk contamination.

  20. Plasma-enhanced-chemical-vapor-deposited ultralow k for a postintegration porogen removal approach

    SciTech Connect

    Jousseaume, V.; Favennec, L.; Zenasni, A.; Passemard, G.

    2006-05-01

    Conventional Cu-ultra low K (ULK) integration schemes lead to a drastic increase of the effective dielectric constant due to porous material degradation during process steps. Although a postintegration porogen removal scheme allows overcoming these issues, only spin-on dielectrics were developed to validate this approach. In this letter, plasma-enhanced chemical-vapor deposition is used to deposit ULK dielectric (k<2.5). The precursor chemistry and the deposition conditions have been chosen to obtain a material with the required characteristics to use a postintegration porogen removal approach: porogen thermal stability up to 325 deg. C, good mechanical properties of the hybrid film, no metallic barrier diffusion in the film, and a minimal shrinkage after the porogen removal treatment.

  1. Nickel doping of boron carbide grown by plasma enhanced chemical vapor deposition

    SciTech Connect

    Hwang, S.; Remmes, N.B.; Dowben, P.A.; McIlroy, D.N.

    1996-07-01

    We have nickel doped boron carbide grown by plasma enhanced chemical vapor deposition. The source gas closo-1,2-dicarbadodecaborane (ortho-carborane) was used to grow the boron carbide, while nickelocene [Ni(C{sub 5}H{sub 5}){sub 2}] was used to introduce nickel into the growing film. The doping of nickel transformed a {ital p}-type, B{sub 5}C material, relative to lightly doped {ital n}-type silicon, to an {ital n}-type material. Both {ital n}-{ital n} heterojunction diodes and {ital n}-{ital p} heterojunction diodes were constructed, using as substrates {ital n}- and {ital p}-type Si(111), respectively. With sufficient partial pressures of nickelocene in the plasma reactor, diodes with characteristic tunnel diode behavior can be successfully fabricated. {copyright} {ital 1996 American Vacuum Society}

  2. Plasma-enhanced chemical vapor deposition method to coat micropipettes with diamond-like carbon

    SciTech Connect

    Kakuta, Naoto; Watanabe, Mayu; Yamada, Yukio; Okuyama, Naoki; Mabuchi, Kunihiko

    2005-07-15

    This article provides a simple method for coating glass micropipettes with diamond-like carbon (DLC) through plasma-enhanced chemical vapor deposition. The apparatus uses a cathode that is a thin-metal-coated micropipette itself and an anode that is a meshed cylinder with its cylinder axis along the micropipette length. To produce a uniform plasma and prevent a temperature increase at the tip due to ion collision concentration, we investigated the effect of the height and diameter of the meshed cylindrical anode on the plasma. Intermittent deposition is also effective for inhibiting the temperature rise and producing high quality DLC films. Measured Raman spectra and electric resistivity indicate that a DLC film suitable for use as an insulating film can be produced on the micropipette. This coating method should also be useful for other extremely small probes.

  3. Fabrication of nanocrystalline silicon layers by plasma enhanced chemical vapor deposition from silicon tetrafluoride

    SciTech Connect

    Sennikov, P. G. Golubev, S. V.; Shashkin, V. I.; Pryakhin, D. A.; Drozdov, M. N.; Andreev, B. A.; Drozdov, Yu. N.; Kuznetsov, A. S.; Pohl, H.-J.

    2009-07-15

    The data on fabrication of silicon layers on various substrates by plasma enhanced chemical vapor deposition from the (silicon tetrafluoride)-hydrogen system are reported. The emission spectra of the plasma in the system are recorded. The samples were studied by the X-ray diffraction and secondary ion mass spectrometry techniques. The morphologic properties of the surface are examined, and the Raman spectra, the transmittance spectra in the infrared region, and photoluminescence spectra are recorded. The phase composition of the layers corresponds to nanocrystalline silicon, in which the dimensions of coherent-scattering grains vary with the conditions of the preparation process in the range from 3 to 9 nm. The layers exhibit intense photoluminescence at room temperature.

  4. Metal-free plasma-enhanced chemical vapor deposition of large area nanocrystalline graphene

    NASA Astrophysics Data System (ADS)

    Schmidt, Marek E.; Xu, Cigang; Cooke, Mike; Mizuta, Hiroshi; Chong, Harold M. H.

    2014-04-01

    This paper reports on large area, metal-free deposition of nanocrystalline graphene (NCG) directly onto wet thermally oxidized 150 mm silicon substrates using parallel-plate plasma-enhanced chemical vapor deposition. Thickness non-uniformities as low as 13% are achieved over the whole substrate. The cluster size {{L}_{\\text{a}}} of the as-obtained films is determined from Raman spectra and lies between 1.74 and 2.67 nm. The film uniformity was further confirmed by Raman mapping. The sheet resistance {{R}_{\\text{sq}}} of 3.73 \\text{k}\\Omega and charge carrier mobility μ of 2.49\\;\\text{c}{{\\text{m}}^{2}}\\;{{\\text{V}}^{-1}}\\;{{\\text{s}}^{-1}} are measured. We show that the NCG films can be readily patterned by reactive ion etching. NCG is also successfully deposited onto quartz and sapphire substrates and showed >85% optical transparency in the visible light spectrum.

  5. Enhanced stability of Cu-BTC MOF via perfluorohexane plasma-enhanced chemical vapor deposition.

    PubMed

    Decoste, Jared B; Peterson, Gregory W; Smith, Martin W; Stone, Corinne A; Willis, Colin R

    2012-01-25

    Metal organic frameworks (MOFs) are a leading class of porous materials for a wide variety of applications, but many of them have been shown to be unstable toward water. Cu-BTC (1,3,5 benzenetricarboxylic acid, BTC) was treated with a plasma-enhanced chemical vapor deposition (PECVD) of perfluorohexane creating a hydrophobic form of Cu-BTC. It was found that the treated Cu-BTC could withstand high humidity and even submersion in water much better than unperturbed Cu-BTC. Through Monte Carlo simulations it was found that perfluorohexane sites itself in such a way within Cu-BTC as to prevent the formation of water clusters, hence preventing the decomposition of Cu-BTC by water. This PECVD of perfluorohexane could be exploited to widen the scope of practical applications of Cu-BTC and other MOFs. PMID:22239201

  6. Low temperature plasma enhanced chemical vapor deposition of thin films combining mechanical stiffness, electrical insulation, and homogeneity in microcavities

    SciTech Connect

    Peter, S.; Guenther, M.; Hauschild, D.; Richter, F.

    2010-08-15

    The deposition of hydrogenated amorphous carbon (a-C:H) as well as hydrogenated amorphous silicon carbonitride (SiCN:H) films was investigated in view of a simultaneous realization of a minimum Young's modulus (>70 GPa), a high electrical insulation ({>=}1 MV/cm), a low permittivity and the uniform coverage of microcavities with submillimeter dimensions. For the a-C:H deposition the precursors methane (CH{sub 4}) and acetylene (C{sub 2}H{sub 2}) were used, while SiCN:H films were deposited from mixtures of trimethylsilane [SiH(CH{sub 3}){sub 3}] with nitrogen and argon. To realize the deposition of micrometer thick films with the aforementioned complex requirements at substrate temperatures {<=}200 deg. C, several plasma enhanced chemical vapor deposition methods were investigated: the capacitively coupled rf discharge and the microwave electron cyclotron resonance (ECR) plasma, combined with two types of pulsed substrate bias. SiCN:H films deposited at about 1 Pa from ECR plasmas with pulsed high-voltage bias best met the requirements. Pulsed biasing with pulse periods of about 1 {mu}s and amplitudes of about -2 kV was found to be most advantageous for the conformal low temperature coating of the microtrenches, thereby ensuring the required mechanical and insulating film properties.

  7. Surface modification of silicon-containing fluorocarbon films prepared by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Jin, Yoonyoung; Desta, Yohannes; Goettert, Jost; Lee, G. S.; Ajmera, P. K.

    2005-07-01

    Surface modification of silicon-containing fluorocarbon (SiCF) films achieved by wet chemical treatments and through x-ray irradiation is examined. The SiCF films were prepared by plasma-enhanced chemical vapor deposition, using gas precursors of tetrafluoromethane and disilane. As-deposited SiCF film composition was analyzed by x-ray photoelectron spectroscopy. Surface modification of SiCF films utilizing n-lithiodiaminoethane wet chemical treatment is discussed. Sessile water-drop contact angle changed from 95°+/-2° before treatment to 32°+/-2° after treatment, indicating a change in the film surface characteristics from hydrophobic to hydrophilic. For x-ray irradiation on the SiCF film with a dose of 27.4 kJ/cm3, the contact angle of the sessile water drop changed from 95°+/-2° before radiation to 39°+/-3° after x-ray exposure. The effect of x-ray exposure on chemical bond structure of SiCF films is studied using Fourier transform infrared measurements. Electroless Cu deposition was performed to test the applicability of the surface modified films. The x-ray irradiation method offers a unique advantage in making possible surface modification in a localized area of high-aspect-ratio microstructures. Fabrication of a Ti-membrane x-ray mask is introduced here for selective surface modification using x-ray irradiation.

  8. Ultralow-k silicon containing fluorocarbon films prepared by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Jin, Yoonyoung; Ajmera, P. K.; Lee, G. S.; Singh, Varshni

    2005-09-01

    Low dielectric constant materials as interlayer dielectrics (ILDs) offer a way to reduce the RC time delay in high-performance ultra-large-scale integration (ULSI) circuits. Fluorocarbon films containing silicon have been developed for interlayer applications below 50-nm linewidth technology. The preparation of the films was carried out by plasma-enhanced chemical vapor deposition (PECVD) using gas precursors of tetrafluorocarbon as the source of active species and disilane (5 vol.% in helium) as a reducing agent to control the ratio of F/C in the films. The basic properties of the low dielectric constant (low-k) interlayer dielectric films are studied as a function of the fabrication process parameters. The electrical, mechanical, chemical, and thermal properties were evaluated including dielectric constant, surface planarity, hardness, residual stress, chemical bond structure, and shrinkage upon heat treatments. The deposition process conditions were optimized for film thermal stability while maintaining a relative dielectric value as low as 2.0. The average breakdown field strength was 4.74 MV/cm. The optical energy gap was in the range 2.2 2.4 eV. The hardness and residual stress in the optimized processed SiCF films were, respectively, measured to be in the range 1.4 1.78 GPa and in the range 11.6 23.2 MPa of compressive stress.

  9. Fluorinated carboxylic membranes deposited by plasma enhanced chemical vapour deposition for fuel cell applications

    NASA Astrophysics Data System (ADS)

    Thery, J.; Martin, S.; Faucheux, V.; Le Van Jodin, L.; Truffier-Boutry, D.; Martinent, A.; Laurent, J.-Y.

    Among the fuel cell technologies, the polymer electrolyte membrane fuel cells (PEMFCs) are particularly promising because they are energy-efficient, clean, and fuel-flexible (i.e., can use hydrogen or methanol). The great majority of PEM fuel cells rely on a polymer electrolyte from the family of perfluorosulfonic acid membranes, nevertheless alternative materials are currently being developed, mainly to offer the alternative workout techniques which are required for the portable energy sources. Plasma polymerization represents a good solution, as it offers the possibility to deposit thin layer with an accurate and homogeneous thickness, even on 3D surfaces. In this paper, we present the results for the growth of proton conductive fluoro carboxylic membranes elaborated by plasma enhanced chemical vapour deposition. These membranes present conductivity values of the same order than the one of Nafion ®. The properties of the membrane, such as the chemical composition, the ionic conductivity, the swelling behaviour and the permeability were correlated to the plasma process parameters. The membranes were integrated in fuel cells on porous substrates and we present here the results regarding the barrier effect and the power output. Barrier effect similar to those of 40 μm Nafion ® layers was reached for 10 μm thick carboxylic membranes. Power outputs around 3 mW cm -2 were measured. We discuss the results regarding the gas barrier effect and the power outputs.

  10. Control of interface nanoscale structure created by plasma-enhanced chemical vapor deposition.

    PubMed

    Peri, Someswara R; Akgun, Bulent; Satija, Sushil K; Jiang, Hao; Enlow, Jesse; Bunning, Timothy J; Foster, Mark D

    2011-09-01

    Tailoring the structure of films deposited by plasma-enhanced chemical vapor deposition (PECVD) to specific applications requires a depth-resolved understanding of how the interface structures in such films are impacted by variations in deposition parameters such as feed position and plasma power. Analysis of complementary X-ray and neutron reflectivity (XR, NR) data provide a rich picture of changes in structure with feed position and plasma power, with those changes resolved on the nanoscale. For plasma-polymerized octafluorocyclobutane (PP-OFCB) films, a region of distinct chemical composition and lower cross-link density is found at the substrate interface for the range of processing conditions studied and a surface layer of lower cross-link density also appears when plasma power exceeds 40 W. Varying the distance of the feed from the plasma impacts the degree of cross-linking in the film center, thickness of the surface layer, and thickness of the transition region at the substrate. Deposition at the highest power, 65 W, both enhances cross-linking and creates loose fragments with fluorine content higher than the average. The thickness of the low cross-link density region at the air interface plays an important role in determining the width of the interface built with a layer subsequently deposited atop the first. PMID:21875044

  11. The evolution of carbon nanotubes during their growth by plasma enhanced chemical vapor deposition.

    PubMed

    Wang, Hengzhi; Ren, Z F

    2011-10-01

    During the growth of carbon nanotubes (CNTs) by plasma enhanced chemical vapor deposition (PECVD), plasma etching is the crucial factor that determines the growth mode and alignment of the CNTs. Focusing on a thin catalyst coating (Ni = 5 nm), this study finds that the CNT growth by PECVD goes through three stages from randomly entangled (I-CNTs) to partially aligned (II-CNTs) to fully aligned (III-CNTs). The I-CNTs and II-CNTs are mostly etched away by the plasma as time goes by ending up with III-CNTs as the only product when growth time is long enough. However, with a thickness of the catalyst coating of 10 nm or more, neither I-CNTs nor II-CNTs are produced, but III-CNTs are the only type of CNTs grown during the whole growth process. During the growth of III-CNTs, the catalyst particles (Ni) stay on the tips of each of the aligned CNTs and act as a 'safety helmet' to protect the CNTs from plasma ion bombardment. On the other hand, it is also the plasma that limits the growth of III-CNTs, since the plasma eventually etches all the catalytic particles out and stops the growth. PMID:21911923

  12. The evolution of carbon nanotubes during their growth by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Wang, Hengzhi; Ren, Z. F.

    2011-10-01

    During the growth of carbon nanotubes (CNTs) by plasma enhanced chemical vapor deposition (PECVD), plasma etching is the crucial factor that determines the growth mode and alignment of the CNTs. Focusing on a thin catalyst coating (Ni = 5 nm), this study finds that the CNT growth by PECVD goes through three stages from randomly entangled (I-CNTs) to partially aligned (II-CNTs) to fully aligned (III-CNTs). The I-CNTs and II-CNTs are mostly etched away by the plasma as time goes by ending up with III-CNTs as the only product when growth time is long enough. However, with a thickness of the catalyst coating of 10 nm or more, neither I-CNTs nor II-CNTs are produced, but III-CNTs are the only type of CNTs grown during the whole growth process. During the growth of III-CNTs, the catalyst particles (Ni) stay on the tips of each of the aligned CNTs and act as a 'safety helmet' to protect the CNTs from plasma ion bombardment. On the other hand, it is also the plasma that limits the growth of III-CNTs, since the plasma eventually etches all the catalytic particles out and stops the growth.

  13. Plasma-enhanced chemical vapor deposition synthesis of vertically oriented graphene nanosheets.

    PubMed

    Bo, Zheng; Yang, Yong; Chen, Junhong; Yu, Kehan; Yan, Jianhua; Cen, Kefa

    2013-06-21

    Vertically oriented graphene (VG) nanosheets have attracted growing interest for a wide range of applications, from energy storage, catalysis and field emission to gas sensing, due to their unique orientation, exposed sharp edges, non-stacking morphology, and huge surface-to-volume ratio. Plasma-enhanced chemical vapor deposition (PECVD) has emerged as a key method for VG synthesis; however, controllable growth of VG with desirable characteristics for specific applications remains a challenge. This paper attempts to summarize the state-of-the-art research on PECVD growth of VG nanosheets to provide guidelines on the design of plasma sources and operation parameters, and to offer a perspective on outstanding challenges that need to be overcome to enable commercial applications of VG. The review starts with an overview of various types of existing PECVD processes for VG growth, and then moves on to research on the influences of feedstock gas, temperature, and pressure on VG growth, substrate pretreatment, the growth of VG patterns on planar substrates, and VG growth on cylindrical and carbon nanotube (CNT) substrates. The review ends with a discussion on challenges and future directions for PECVD growth of VG. PMID:23670071

  14. Conformal encapsulation of three-dimensional, bioresorbable polymeric scaffolds using plasma-enhanced chemical vapor deposition.

    PubMed

    Hawker, Morgan J; Pegalajar-Jurado, Adoracion; Fisher, Ellen R

    2014-10-21

    Bioresorbable polymers such as poly(ε-caprolactone) (PCL) have a multitude of potential biomaterial applications such as controlled-release drug delivery and regenerative tissue engineering. For such biological applications, the fabrication of porous three-dimensional bioresorbable materials with tunable surface chemistry is critical to maximize their surface-to-volume ratio, mimic the extracellular matrix, and increase drug-loading capacity. Here, two different fluorocarbon (FC) precursors (octofluoropropane (C3F8) and hexafluoropropylene oxide (HFPO)) were used to deposit FC films on PCL scaffolds using plasma-enhanced chemical vapor deposition (PECVD). These two coating systems were chosen with the intent of modifying the scaffold surfaces to be bio-nonreactive while maintaining desirable bulk properties of the scaffold. X-ray photoelectron spectroscopy showed high-CF2 content films were deposited on both the exterior and interior of PCL scaffolds and that deposition behavior is PECVD system specific. Scanning electron microscopy data confirmed that FC film deposition yielded conformal rather than blanket coatings as the porous scaffold structure was maintained after plasma treatment. Treated scaffolds seeded with human dermal fibroblasts (HDF) demonstrate that the cells do not attach after 72 h and that the scaffolds are noncytotoxic to HDF. This work demonstrates conformal FC coatings can be deposited on 3D polymeric scaffolds using PECVD to fabricate 3D bio-nonreactive materials. PMID:25247481

  15. Chain Assemblies from Nanoparticles Synthesized by Atmospheric Pressure Plasma Enhanced Chemical Vapor Deposition: The Computational View.

    PubMed

    Mishin, Maxim V; Zamotin, Kirill Y; Protopopova, Vera S; Alexandrov, Sergey E

    2015-12-01

    This article refers to the computational study of nanoparticle self-organization on the solid-state substrate surface with consideration of the experimental results, when nanoparticles were synthesised during atmospheric pressure plasma enhanced chemical vapor deposition (AP-PECVD). The experimental study of silicon dioxide nanoparticle synthesis by AP-PECVD demonstrated that all deposit volume consists of tangled chains of nanoparticles. In certain cases, micron-sized fractals are formed from tangled chains due to deposit rearrangement. This work is focused on the study of tangled chain formation only. In order to reveal their formation mechanism, a physico-mathematical model was developed. The suggested model was based on the motion equation solution for charged and neutral nanoparticles in the potential fields with the use of the empirical interaction potentials. In addition, the computational simulation was carried out based on the suggested model. As a result, the influence of such experimental parameters as deposition duration, particle charge, gas flow velocity, and angle of gas flow was found. It was demonstrated that electrical charges carried by nanoparticles from the discharge area are not responsible for the formation of tangled chains from nanoparticles, whereas nanoparticle kinetic energy plays a crucial role in deposit morphology and density. The computational results were consistent with experimental results. PMID:26682441

  16. Stress control of silicon nitride films deposited by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Li, Dong-ling; Feng, Xiao-fei; Wen, Zhi-yu; Shang, Zheng-guo; She, Yin

    2016-07-01

    Stress controllable silicon nitride (SiNx) films deposited by plasma enhanced chemical vapor deposition (PECVD) are reported. Low stress SiNx films were deposited in both high frequency (HF) mode and dual frequency (HF/LF) mode. By optimizing process parameters, stress free (-0.27 MPa) SiNx films were obtained with the deposition rate of 45.5 nm/min and the refractive index of 2.06. Furthermore, at HF/LF mode, the stress is significantly influenced by LF ratio and LF power, and can be controlled to be 10 MPa with the LF ratio of 17% and LF power of 150 W. However, LF power has a little effect on the deposition rate due to the interaction between HF power and LF power. The deposited SiNx films have good mechanical and optical properties, low deposition temperature and controllable stress, and can be widely used in integrated circuit (IC), micro-electro-mechanical systems (MEMS) and bio-MEMS.

  17. Growth of ultrananocrystalline diamond film by DC Arcjet plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Chen, G. C.; Li, B.; Yan, Z. Q.; Liu, J.; Lu, F. X.; Ye, H.

    2012-06-01

    Self-standing diamond films were grown by DC Arcjet plasma enhanced chemical vapor deposition (CVD). The feed gasses were Ar/H2/CH4, in which the flow ratio of CH4 to H2 (F/F) was varied from 5% to 20%. Two distinct morphologies were observed by scanning electron microscope (SEM), i.e. the "pineapple-like" morphology and the "cauliflower-like" morphology. It was found that the morphologies of the as-grown films are strongly dependent on the flow ratio of CH4 to H2 in the feed gasses. High resolution transmission electron microscope (HRTEM) survey results revealed that there were nanocrystalline grains within the "pineapple-like" films whilst there were ultrananocrystalline grains within "cauliflower-like" films. X-ray diffraction (XRD) results suggested that (110) crystalline plane was the dominant surface in the "cauliflower-like" films whilst (100) crystalline plane was the dominant surface in the "pineapple-like" films. Raman spectroscopy revealed that nanostructured carbon features could be observed in both types of films. Plasma diagnosis was carried out in order to understand the morphology dependent growth mechanism. It could be concluded that the film morphology was strongly influenced by the density of gas phases. The gradient of C2 radical was found to be different along the growth direction under the different growth conditions.

  18. The augmented saddle field discharge characteristics and its applications for plasma enhanced chemical vapour deposition

    SciTech Connect

    Wong, Johnson; Yeghikyan, Davit; Kherani, Nazir P.

    2013-04-07

    A high ion flux parallel electrode plasma is proposed and studied in its DC configuration. By cascading a diode source region which supplies electrons and a saddle field region where these seed electrons are energized and amplified, the energy of ion bombardment on the substrate can be decoupled from the plasma density. The sufficiently large density of electrons and holes in the vicinity of the substrate raises the possibility to perform plasma enhanced chemical vapour deposition on insulating materials, at low sheath voltages (around 40 V in the configuration studied), at low temperatures in which the surface mobility of film growth species may be provided by the bombardment of moderate energy ions. As a benchmarking exercise, experiments are carried out on silane discharge characteristics and deposition of hydrogenated amorphous silicon (a-Si:H) on both silicon wafer and glass. The films grown at low anode voltages have excellent microstructures with predominantly monohydride bonds, sharp band tails, but relatively high integrated defect density in the mid 10{sup 16}/cm{sup 3} range for the particular substrate temperature of 180 Degree-Sign C, indicating that further optimizations are necessary if the electrode configuration is to be used to create a-Si:H devices.

  19. Microbridge testing of plasma-enhanced chemical-vapor deposited silicon oxide films on silicon wafers

    NASA Astrophysics Data System (ADS)

    Cao, Zhiqiang; Zhang, Tong-Yi; Zhang, Xin

    2005-05-01

    Plasma-enhanced chemical-vapor deposited (PECVD) silane-based oxides (SiOx) have been widely used in both microelectronics and microelectromechanical systems (MEMS) to form electrical and/or mechanical components. In this paper, a nanoindentation-based microbridge testing method is developed to measure both the residual stresses and Young's modulus of PECVD SiOx films on silicon wafers. Theoretically, we considered both the substrate deformation and residual stress in the thin film and derived a closed formula of deflection versus load. The formula fitted the experimental curves almost perfectly, from which the residual stresses and Young's modulus of the film were determined. Experimentally, freestanding microbridges made of PECVD SiOx films were fabricated using the silicon undercut bulk micromachining technique. Some microbridges were subjected to rapid thermal annealing (RTA) at a temperature of 400 °C, 600 °C, or 800 °C to simulate the thermal process in the device fabrication. The results showed that the as-deposited PECVD SiOx films had a residual stress of -155±17MPa and a Young's modulus of 74.8±3.3GPa. After the RTA, Young's modulus remained relatively unchanged at around 75 GPa, however, significant residual stress hysteresis was found in all the films. A microstructure-based mechanism was then applied to explain the experimental results of the residual stress changes in the PECVD SiOx films after the thermal annealing.

  20. Controlled surface diffusion in plasma-enhanced chemical vapor deposition of GaN nanowires.

    PubMed

    Hou, Wen Chi; Hong, Franklin Chau-Nan

    2009-02-01

    This study investigates the growth of GaN nanowires by controlling the surface diffusion of Ga species on sapphire in a plasma-enhanced chemical vapor deposition (CVD) system. Under nitrogen-rich growth conditions, Ga has a tendency to adsorb on the substrate surface diffusing to nanowires to contribute to their growth. The significance of surface diffusion on the growth of nanowires is dependent on the environment of the nanowire on the substrate surface as well as the gas phase species and compositions. Under nitrogen-rich growth conditions, the growth rate is strongly dependent on the surface diffusion of gallium, but the addition of 5% hydrogen in nitrogen plasma instantly diminishes the surface diffusion effect. Gallium desorbs easily from the surface by reaction with hydrogen. On the other hand, under gallium-rich growth conditions, nanowire growth is shown to be dominated by the gas phase deposition, with negligible contribution from surface diffusion. This is the first study reporting the inhibition of surface diffusion effects by hydrogen addition, which can be useful in tailoring the growth and characteristics of nanowires. Without any evidence of direct deposition on the nanowire surface, gallium and nitrogen are shown to dissolve into the catalyst for growing the nanowires at 900 degrees C. PMID:19417353

  1. Characterization of diamond-like nanocomposite thin films grown by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Santra, T. S.; Liu, C. H.; Bhattacharyya, T. K.; Patel, P.; Barik, T. K.

    2010-06-01

    Diamond-like nanocomposite (DLN) thin films, comprising the networks of a-C:H and a-Si:O were deposited on pyrex glass or silicon substrate using gas precursors (e.g., hexamethyldisilane, hexamethyldisiloxane, hexamethyldisilazane, or their different combinations) mixed with argon gas, by plasma enhanced chemical vapor deposition technique. Surface morphology of DLN films was analyzed by atomic force microscopy. High-resolution transmission electron microscopic result shows that the films contain nanoparticles within the amorphous structure. Fourier transform infrared spectroscopy (FTIR), Raman spectroscopy, and x-ray photoelectron spectroscopy (XPS) were used to determine the structural change within the DLN films. The hardness and friction coefficient of the films were measured by nanoindentation and scratch test techniques, respectively. FTIR and XPS studies show the presence of CC, CH, SiC, and SiH bonds in the a-C:H and a-Si:O networks. Using Raman spectroscopy, we also found that the hardness of the DLN films varies with the intensity ratio ID/IG. Finally, we observed that the DLN films has a better performance compared to DLC, when it comes to properties like high hardness, high modulus of elasticity, low surface roughness and low friction coefficient. These characteristics are the critical components in microelectromechanical systems (MEMS) and emerging nanoelectromechanical systems (NEMS).

  2. Passivation of aluminum nanoparticles by plasma-enhanced chemical vapor deposition for energetic nanomaterials.

    PubMed

    Shahravan, Anaram; Desai, Tapan; Matsoukas, Themis

    2014-05-28

    We have produced passivating coatings on 80-nm aluminum particles by plasma-enhanced chemical vapor deposition (PECVD). Three organic precursors--isopropyl alcohol, toluene, and perfluorodecalin--were used to fabricate thin films with thicknesses ranging from 5 nm to 30 nm. The coated samples and one untreated sample were exposed to 85% humidity at 25 °C for two months, and the active Al content was determined by thermogravimetric analysis (TGA) in the presence of oxygen. The results were compared with an uncoated sample stored in a glovebox under argon for the same period. We find that all three coatings provide protection against humidity, compared to the control, and their efficacy ranks in the following order: isopropyl alcohol < toluene < perfluorodecalin. This order also correlates with increasing water contact angle of the three solid coatings. The amount of heat released in the oxidation, measured by differential scanning calorimetry (DSC), was found to increase in the same order. Perfluorodecalin resulted in providing the best protection, and it produced the maximum enthalpy of combustion, ΔH = 4.65 kJ/g. This value is higher than that of uncoated aluminum stored in the glovebox, indicating that the coatings promote more complete oxidation of the core. Overall, we conclude that the plasma polymer coatings of this study are suitable passivating thin film for aluminum nanoparticles by providing protection against oxidation while facilitating the complete oxidation of the metallic core at elevated temperature. PMID:24787245

  3. Plasma enhanced chemical vapor deposition of silicon oxide films with divinyldimethylsilane and tetravinylsilane

    SciTech Connect

    Park, Sung-Gyu; Rhee, Shi-Woo

    2006-03-15

    Carbon-doped silicon oxide (SiCOH) low-k films were deposited with plasma enhanced chemical vapor deposition (PECVD) using divinyldimethylsilane (DVDMS) with two vinyl groups and tetravinylsilane (TVS) with four vinyl groups compared with vinyltrimethylsilane (VTMS) with one vinyl group. With more vinyl groups in the precursor, due to the crosslinking of the vinyl groups, the film contains more of an organic phase and organic phase became less volatile. It was confirmed that the deposition rate, refractive index, and k value increase with more vinyl groups in the precursor molecule. After annealing, the SiCOH films deposited with DVDMS and TVS showed a low dielectric constant of 2.2 and 2.4 at optimum conditions, respectively. In both cases, the annealed film had low leakage current density (J=6.7x10{sup -7} A/cm{sup 2} for SiCOH film of DVDMS and J=1.18x10{sup -8} A/cm{sup 2} for SiCOH film of TVS at 1 MV/cm) and relatively high breakdown field strength (E>4.0 MV/cm at 1 mA/cm{sup 2}), which is comparable to those of PECVD SiO{sub 2}.

  4. Preparation and structure of porous dielectrics by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Gates, S. M.; Neumayer, D. A.; Sherwood, M. H.; Grill, A.; Wang, X.; Sankarapandian, M.

    2007-05-01

    The preparation of ultralow dielectric constant porous silicon, carbon, oxygen, hydrogen alloy dielectrics, called "pSiCOH," using a production 200mm plasma enhanced chemical vapor deposition tool and a thermal treatment is reported here. The effect of deposition temperature on the pSiCOH film is examined using Fourier transform infrared (FTIR) spectroscopy, dielectric constant (k), and film shrinkage measurements. For all deposition temperatures, carbon in the final porous film is shown to be predominantly Si -CH3 species, and lower k is shown to correlate with increased concentration of Si -CH3. NMR and FTIR spectroscopies clearly detect the loss of a removable, unstable, hydrocarbon (CHx) phase during the thermal treatment. Also detected are increased cross-linking of the Si-O skeleton, and concentration changes for three distinct structures of carbon. In the as deposited films, deposition temperature also affects the hydrocarbon (CHx) content and the presence of C O and C C functional groups.

  5. Plasma-enhanced chemical vapor deposition synthesis of vertically oriented graphene nanosheets

    NASA Astrophysics Data System (ADS)

    Bo, Zheng; Yang, Yong; Chen, Junhong; Yu, Kehan; Yan, Jianhua; Cen, Kefa

    2013-05-01

    Vertically oriented graphene (VG) nanosheets have attracted growing interest for a wide range of applications, from energy storage, catalysis and field emission to gas sensing, due to their unique orientation, exposed sharp edges, non-stacking morphology, and huge surface-to-volume ratio. Plasma-enhanced chemical vapor deposition (PECVD) has emerged as a key method for VG synthesis; however, controllable growth of VG with desirable characteristics for specific applications remains a challenge. This paper attempts to summarize the state-of-the-art research on PECVD growth of VG nanosheets to provide guidelines on the design of plasma sources and operation parameters, and to offer a perspective on outstanding challenges that need to be overcome to enable commercial applications of VG. The review starts with an overview of various types of existing PECVD processes for VG growth, and then moves on to research on the influences of feedstock gas, temperature, and pressure on VG growth, substrate pretreatment, the growth of VG patterns on planar substrates, and VG growth on cylindrical and carbon nanotube (CNT) substrates. The review ends with a discussion on challenges and future directions for PECVD growth of VG.

  6. Thermal Conductivity of Nanocrystalline Silicon Prepared by Plasma-Enhanced Chemical-Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Jugdersuren, Battogtokh; Liu, Xiao; Kearney, Brian; Queen, Daniel; Metcalf, Thomas; Culbertson, James; Chervin, Christopher; Katz, Michael; Stroud, Rhonda

    Nanocrystallization by ball milling has been used successfully to reduce the thermal conductivity of silicon-germanium alloys (SiGe) and turn them into useful thermoelectric materials at a temperature of a few hundred degrees C. Currently the smallest grain sizes in nanocrystalline SiGe are in the 10 nm range. Germanium is added to scatter short wavelength phonons by impurity scattering. In this work, we report a record low thermal conductivity in nanocrystalline silicon prepared by plasma-enhanced chemical-vapor deposition. By varying hydrogen to silane ratio, we can vary the average grain sizes from greater than 10 nm down to 3 nm, as determined by both the high resolution transmission electron microscopy and X-ray diffraction. The values of thermal conductivity, as measured by the 3 ω technique, can be correspondingly modulated from that of ball-milled nanocrystalline SiGe to a record low level of 0.3 W/mK at room temperature. This low thermal conductivity is only about 1/3 of the minimum thermal conductivity limit of silicon. Possible causes of such a large reduction are discussed. Work supported by the Office of Naval Research.

  7. Characterization of diamond-like nanocomposite thin films grown by plasma enhanced chemical vapor deposition

    SciTech Connect

    Santra, T. S.; Liu, C. H.; Bhattacharyya, T. K.; Patel, P.; Barik, T. K.

    2010-06-15

    Diamond-like nanocomposite (DLN) thin films, comprising the networks of a-C:H and a-Si:O were deposited on pyrex glass or silicon substrate using gas precursors (e.g., hexamethyldisilane, hexamethyldisiloxane, hexamethyldisilazane, or their different combinations) mixed with argon gas, by plasma enhanced chemical vapor deposition technique. Surface morphology of DLN films was analyzed by atomic force microscopy. High-resolution transmission electron microscopic result shows that the films contain nanoparticles within the amorphous structure. Fourier transform infrared spectroscopy (FTIR), Raman spectroscopy, and x-ray photoelectron spectroscopy (XPS) were used to determine the structural change within the DLN films. The hardness and friction coefficient of the films were measured by nanoindentation and scratch test techniques, respectively. FTIR and XPS studies show the presence of C-C, C-H, Si-C, and Si-H bonds in the a-C:H and a-Si:O networks. Using Raman spectroscopy, we also found that the hardness of the DLN films varies with the intensity ratio I{sub D}/I{sub G}. Finally, we observed that the DLN films has a better performance compared to DLC, when it comes to properties like high hardness, high modulus of elasticity, low surface roughness and low friction coefficient. These characteristics are the critical components in microelectromechanical systems (MEMS) and emerging nanoelectromechanical systems (NEMS).

  8. Plasma effects in aligned carbon nanoflake growth by plasma-enhanced hot filament chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Wang, B. B.; Zheng, K.; Cheng, Q. J.; Ostrikov, K.

    2015-01-01

    Carbon nanofilms are directly grown on silicon substrates by plasma-enhanced hot filament chemical vapor deposition in methane environment. It is shown that the nanofilms are composed of aligned carbon nanoflakes by extensive investigation of experimental results of field emission scanning electron microscopy, micro-Raman spectroscopy and transmission electron microscopy. In comparison with the graphene-like films grown without plasmas, the carbon nanoflakes grow in an alignment mode and the growth rate of the films is increased. The effects of the plasma on the growth of the carbon nanofilms are studied. The plasma plays three main effects of (1) promoting the separation of the carbon nanoflakes from the silicon substrate, (2) accelerating the motion of hydrocarbon radicals, and (3) enhancing the deposition of hydrocarbon ions onto the substrate surface. Due to these plasma-specific effects, the carbon nanofilms can be formed from the aligned carbon nanoflakes with a high rate. These results advance our knowledge on the synthesis, properties and applications of graphene-based materials.

  9. Modeling of Sheath Ion-Molecule Reactions in Plasma Enhanced Chemical Vapor Deposition of Carbon Nanotubes

    NASA Technical Reports Server (NTRS)

    Hash, David B.; Govindan, T. R.; Meyyappan, M.

    2004-01-01

    In many plasma simulations, ion-molecule reactions are modeled using ion energy independent reaction rate coefficients that are taken from low temperature selected-ion flow tube experiments. Only exothermic or nearly thermoneutral reactions are considered. This is appropriate for plasma applications such as high-density plasma sources in which sheaths are collisionless and ion temperatures 111 the bulk p!asma do not deviate significantly from the gas temperature. However, for applications at high pressure and large sheath voltages, this assumption does not hold as the sheaths are collisional and ions gain significant energy in the sheaths from Joule heating. Ion temperatures and thus reaction rates vary significantly across the discharge, and endothermic reactions become important in the sheaths. One such application is plasma enhanced chemical vapor deposition of carbon nanotubes in which dc discharges are struck at pressures between 1-20 Torr with applied voltages in the range of 500-700 V. The present work investigates The importance of the inclusion of ion energy dependent ion-molecule reaction rates and the role of collision induced dissociation in generating radicals from the feedstock used in carbon nanotube growth.

  10. Plasma-enhanced chemical vapor deposited silicon carbide as an implantable dielectric coating.

    PubMed

    Cogan, Stuart F; Edell, David J; Guzelian, Andrew A; Ping Liu, Ying; Edell, Robyn

    2003-12-01

    Amorphous silicon carbide (a-SiC) films, deposited by plasma-enhanced chemical vapor deposition (PECVD), have been evaluated as insulating coatings for implantable microelectrodes. The a-SiC was deposited on platinum or iridium wire for measurement of electrical leakage through the coating in phosphate-buffered saline (PBS, pH 7.4). Low leakage currents of <10(-11) A were observed over a +/-5-V bias. The electronic resistivity of a-SiC was 3 x 10(13) Omega-cm. Dissolution rates of a-SiC in PBS at 37 and 90 degrees C were determined from changes in infrared absorption band intensities and compared with those of silicon nitride formed by low-pressure chemical vapor deposition (LPCVD). Dissolution rates of LPCVD silicon nitride were 2 nm/h and 0.4 nm/day at 90 and 37 degrees C, respectively, while a-SiC had a dissolution rate of 0.1 nm/h at 90 degrees C and no measurable dissolution at 37 degrees C. Biocompatibility was assessed by implanting a-SiC-coated quartz discs in the subcutaneous space of the New Zealand White rabbit. Histological evaluation showed no chronic inflammatory response and capsule thickness was comparable to silicone or uncoated quartz controls. Amorphous SiC-coated microelectrodes were implanted in the parietal cortex for periods up to 150 days and the cortical response evaluated by histological evaluation of neuronal viability at the implant site. The a-SiC was more stable in physiological saline than LPCVD Si(3)N(4) and well tolerated in the cortex. PMID:14613234

  11. CHEMICAL SYNTHESIS & TRANSFORMATIONS USING MICROWAVES

    EPA Science Inventory

    A historical account of the utility of microwaves in a variety of chemical synthesis applications will be presented, including a solvent-free strategy that involves microwave (MW) exposure of neat reactants (undiluted) catalyzed by the surfaces of recyclable mineral supports such...

  12. Practical silicon deposition rules derived from silane monitoring during plasma-enhanced chemical vapor depositiona)

    NASA Astrophysics Data System (ADS)

    Bartlome, Richard; De Wolf, Stefaan; Demaurex, Bénédicte; Ballif, Christophe; Amanatides, Eleftherios; Mataras, Dimitrios

    2015-05-01

    We clarify the difference between the SiH4 consumption efficiency η and the SiH4 depletion fraction D, as measured in the pumping line and the actual reactor of an industrial plasma-enhanced chemical vapor deposition system. In the absence of significant polysilane and powder formation, η is proportional to the film growth rate. Above a certain powder formation threshold, any additional amount of SiH4 consumed translates into increased powder formation rather than into a faster growing Si film. In order to discuss a zero-dimensional analytical model and a two-dimensional numerical model, we measure η as a function of the radio frequency (RF) power density coupled into the plasma, the total gas flow rate, the input SiH4 concentration, and the reactor pressure. The adjunction of a small trimethylboron flow rate increases η and reduces the formation of powder, while the adjunction of a small disilane flow rate decreases η and favors the formation of powder. Unlike η, D is a location-dependent quantity. It is related to the SiH4 concentration in the plasma cp, and to the phase of the growing Si film, whether the substrate is glass or a c-Si wafer. In order to investigate transient effects due to the RF matching, the precoating of reactor walls, or the introduction of a purifier in the gas line, we measure the gas residence time and acquire time-resolved SiH4 density measurements throughout the ignition and the termination of a plasma.

  13. Practical silicon deposition rules derived from silane monitoring during plasma-enhanced chemical vapor deposition

    SciTech Connect

    Bartlome, Richard De Wolf, Stefaan; Demaurex, Bénédicte; Ballif, Christophe; Amanatides, Eleftherios; Mataras, Dimitrios

    2015-05-28

    We clarify the difference between the SiH{sub 4} consumption efficiency η and the SiH{sub 4} depletion fraction D, as measured in the pumping line and the actual reactor of an industrial plasma-enhanced chemical vapor deposition system. In the absence of significant polysilane and powder formation, η is proportional to the film growth rate. Above a certain powder formation threshold, any additional amount of SiH{sub 4} consumed translates into increased powder formation rather than into a faster growing Si film. In order to discuss a zero-dimensional analytical model and a two-dimensional numerical model, we measure η as a function of the radio frequency (RF) power density coupled into the plasma, the total gas flow rate, the input SiH{sub 4} concentration, and the reactor pressure. The adjunction of a small trimethylboron flow rate increases η and reduces the formation of powder, while the adjunction of a small disilane flow rate decreases η and favors the formation of powder. Unlike η, D is a location-dependent quantity. It is related to the SiH{sub 4} concentration in the plasma c{sub p}, and to the phase of the growing Si film, whether the substrate is glass or a c-Si wafer. In order to investigate transient effects due to the RF matching, the precoating of reactor walls, or the introduction of a purifier in the gas line, we measure the gas residence time and acquire time-resolved SiH{sub 4} density measurements throughout the ignition and the termination of a plasma.

  14. Latest innovations in large area web coating technology via plasma enhanced chemical vapor deposition source technology

    SciTech Connect

    George, M. A.; Chandra, H.; Morse, P.; Madocks, J.

    2009-07-15

    In this article, the authors discuss the latest results of our development of large area plasma enhanced chemical vapor deposition (PECVD) source technologies for flexible substrates. A significant challenge is the economical application of thin films for use as vapor barriers, transparent conductive oxides, and optical interference thin films. Here at General Plasma the authors have developed two innovative PECVD source technologies that provide an economical alternative to low temperature sputtering technologies and enable some thin film materials not accessible by sputtering. The Penning Discharge Plasma (PDP trade mark sign ) source is designed for high rate direct PECVD deposition on insulating, temperature sensitive web [J. Modocks, Proceedings of the Society of Vacuum Coaters, 2003 (unpublished), p. 187]. This technology has been utilized to deposit SiO{sub 2} and SiC:H for barrier applications [V. Shamamian et al. Proceedings of the Flexible Displays and Manufacturing Conferrence, 2006 (unpublished)]. The Plasma Beam Source (PBS trade mark sign ) is a remote plasma source that is more versatile for deposition on not only insulating flexible substrates but also conductive or rigid substrates for deposition of thin films that are sensitive to the high ion bombardment flux inherent to the PDP trade mark sign technology. The authors have developed PBS thin film processes in our laboratory for deposition of SiO{sub 2}, SiC:O, SiN:C, SiN:H, ZnO, FeO{sub x}, and Al{sub 2}O{sub 3}. [M. A. George, Conference Proceedings of the Association of Industrial Metallizers, Coaters, and Laminators (AIMCAL), 2007 (unpublished)]. The authors discuss the design of the patented sources, plasma physics, and chemistry of the deposited thin films.

  15. Analysis of photoluminescence background of Raman spectra of carbon nanotips grown by plasma-enhanced chemical vapor deposition

    SciTech Connect

    Wang, B. B.; Ostrikov, K.; Tsakadze, Z. L.; Xu, S.

    2009-07-01

    Carbon nanotips with different structures were synthesized by plasma-enhanced hot filament chemical vapor deposition and plasma-enhanced chemical vapor deposition using different deposition conditions, and they were investigated by scanning electron microscopy and Raman spectroscopy. The results indicate that the photoluminescence background of the Raman spectra is different for different carbon nanotips. Additionally, the Raman spectra of the carbon nanotips synthesized using nitrogen-containing gas precursors show a peak located at about 2120 cm{sup -1} besides the common D and G peaks. The observed difference in the photoluminescence background is related to the growth mechanisms, structural properties, and surface morphology of a-C:H and a-C:H:N nanotips, in particular, the sizes of the emissive tips.

  16. Superconducting YBa sub 2 Cu sub 3 O sub 7 minus x thin films on silver substrates by in situ plasma-enhanced metalorganic chemical vapor deposition

    SciTech Connect

    Zhao, J.; Li, Y.Q.; Chern, C.S.; Norris, P.; Gallois, B.; Kear, B.; Wessels, B.W. )

    1991-01-07

    An {ital in} {ital situ} microwave plasma-enhanced metalorganic chemical vapor deposition process was used to fabricate highly {ital c}-axis oriented YBa{sub 2}Cu{sub 3}O{sub 7{minus}{ital x}} superconducting thin films on metallic Ag substrates. The films were deposited at a reduced substrate temperature of 740 {degree}C in about 270 Pa of N{sub 2}O ambient. Magnetic susceptibilities versus temperature of the as-deposited films show attainment of zero resistance of 85 K and composition of single (high {ital T}{sub {ital c}}) phase. X-ray diffraction measurements reveal that the films deposited at 740 {degree}C have highly preferential orientation of the crystallite {ital c} axes perpendicular to the substrate surface.

  17. In situ nitrogen-doped graphene grown from polydimethylsiloxane by plasma enhanced chemical vapor deposition.

    PubMed

    Wang, Chundong; Zhou, Yungang; He, Lifang; Ng, Tsz-Wai; Hong, Guo; Wu, Qi-Hui; Gao, Fei; Lee, Chun-Sing; Zhang, Wenjun

    2013-01-21

    Due to its unique electronic properties and wide spectrum of promising applications, graphene has attracted much attention from scientists in various fields. Control and engineering of graphene's semiconducting properties is considered to be key to its applications in electronic devices. Here, we report a novel method to prepare in situ nitrogen-doped graphene by microwave plasma assisted chemical vapor deposition (CVD) using PDMS (polydimethylsiloxane) as a solid carbon source. Based on this approach, the concentration of nitrogen-doping can be easily controlled via the flow rate of nitrogen during the CVD process. X-ray photoelectron spectroscopy results indicated that the nitrogen atoms doped into the graphene lattice were mainly in the forms of pyridinic and pyrrolic structures. Moreover, first-principles calculations show that the incorporated nitrogen atoms can lead to p-type doping of graphene. This in situ approach provides a promising strategy to prepare graphene with controlled electronic properties. PMID:23203220

  18. In situ nitrogen-doped graphene grown from polydimethylsiloxane by plasma enhanced chemical vapor deposition

    SciTech Connect

    Wang, Chundong; Zhou, Yungang; He, Lifang; Ng, Tsz-Wai; Hong, Guo; Wu, Qi-Hui; Gao, Fei; Lee, Chun-Sing; Zhang, Wenjun

    2013-01-21

    Due to its unique electronic properties and wide spectrum of promising applications, graphene has attracted much attention from scientists in various fields. Control and engineering of graphene’s semiconducting properties is considered to be the key of its applications in electronic devices. Here, we report a novel method to prepare in situ nitrogen-doped graphene by microwave plasma assisted chemical vapor deposition (CVD) using PDMS (Polydimethylsiloxane) as a solid carbon source. Based on this approach, the concentration of nitrogen-doping can be easily controlled via the flow rate of nitrogen during the CVD process. X-ray photoelectron spectroscopy results indicated that the nitrogen atoms doped into graphene lattice were mainly in the forms of pyridinic and pyrrolic structures. Moreover, first-principles calculations show that the incorporated nitrogen atoms can lead to p-type doping of graphene. This in situ approach provides a promising strategy to prepare graphene with controlled electronic properties.

  19. Room temperature synthesis of porous SiO2 thin films by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Barranco, A.; Cotrino, J.; Yubero, F.; Espinós, J. P.; González-Elipe, A. R.

    2004-07-01

    Silicon dioxide thin films with variable and controlled porosity have been prepared at room temperature by plasma enhanced chemical vapor deposition in an electron cyclotron resonance microwave reactor with a downstream configuration. The procedure consists of the deposition of successive cycles consisting of a sacrificial organic-polymeric layer and, afterward, a silicon dioxide layer. Toluene and oxygen are used as precursors of the organic layers and Si(CH3)3Cl and oxygen for the SiO2. During deposition of the latter, the organic layer is simultaneously burned off. In these conditions, the release of gases produced by oxidation of the organic-polymeric layer take place while the oxide layer is being deposited. Thus, modification of the nucleation and growing mechanism of the silicon oxide thin film take place. The porosity of the final porous SiO2 thin films increases with the thickness of the sacrificial organic layer. The porous SiO2 films prepared with the aforementioned method are free of carbon and chlorine contamination as confirmed by Fourier-transform infrared spectroscopy, x-ray photoelectron spectroscopy, and Rutherford backscattering spectroscopy. Depending on their porosity, the SiO2 thin films are either transparent or scattered visible light. The former have refractive index lower than that of thermal silicon dioxide and the latter show membranelike behavior in gas diffusion experiments. All the samples have good adhesion to the substrates used for the deposition, either polished Si wafer, glass plates, or standard porous supports. They have columnar microstructure, as determined by scanning electron microscopy. A preliminary ultraviolet-visible characterization of the optically transparent thin films reveals that transmission of light through glass increases by 7%-8% when the porous silica is deposited on this substrate. These films prove to be very efficient as antireflective coatings and are of interest for photovoltaic and similar applications

  20. Electrochromic Devices Deposited on Low-Temperature Plastics by Plasma-Enhanced Chemical Vapor Deposition

    SciTech Connect

    Robbins, Joshua; Seman, Michael

    2005-09-20

    Electrochromic windows have been identified by the Basic energy Sciences Advisory committee as an important technology for the reduction of energy spent on heating and cooling in residential and commercial buildings. Electrochromic devices have the ability to reversibly alter their optical properties in response to a small electric field. By blocking ultraviolet and infrared radiation, while modulating the incoming visible radiation, electrochromics could reduce energy consumption by several Quads per year. This amounts to several percent of the total annual national energy expenditures. The purpose of this project was to demonstrate proof of concept for using plasma-enhanced chemical vapor deposition (PECVD) for depositing all five layers necessary for full electrochromic devices, as an alternative to sputtering techniques. The overall goal is to produce electrochromic devices on flexible polymer substrates using PECVD to significantly reduce the cost of the final product. We have successfully deposited all of the films necessary for a complete electrochromic devices using PECVD. The electrochromic layer, WO3, displayed excellent change in visible transmission with good switching times. The storage layer, V2O5, exhibited a high storage capacity and good clear state transmission. The electrolyte, Ta2O5, was shown to functional with good electrical resistivity to go along with the ability to transfer Li ions. There were issues with leakage over larger areas, which can be address with further process development. We developed a process to deposit ZnO:Ga with a sheet resistance of < 50 W/sq. with > 90% transmission. Although we were not able to deposit on polymers due to the temperatures required in combination with the inverted position of our substrates. Two types of full devices were produced. Devices with Ta2O5 were shown to be functional using small aluminum dots as the top contact. The polymer electrolyte devices were shown to have a clear state transmission of

  1. On the low-temperature growth mechanism of single walled carbon nanotubes in plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Shariat, M.; Shokri, B.; Neyts, E. C.

    2013-12-01

    Despite significant progress in single walled carbon nanotube (SWCNT) production by plasma enhanced chemical vapor deposition (PECVD), the growth mechanism in this method is not clearly understood. We employ reactive molecular dynamics simulations to investigate how plasma-based deposition allows growth at low temperature. We first investigate the SWCNT growth mechanism at low and high temperatures under conditions similar to thermal CVD and PECVD. We then show how ion bombardment during the nucleation stage increases the carbon solubility in the catalyst at low temperature. Finally, we demonstrate how moderate energy ions sputter amorphous carbon allowing for SWCNT growth at 500 K.

  2. Low-Temperature Growth of Carbon Nanotubes by Grid-Inserted Plasma-Enhanced Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Kojima, Yoshihiro; Kishimoto, Shigeru; Mizutani, Takashi

    2007-12-01

    Carbon nanotubes (CNTs) have been successfully grown at a temperature as low as 400 °C by grid-inserted plasma-enhanced chemical vapor deposition (PECVD). The grid and a thin double-layer catalyst of Fe (1 nm)/Ti (1 nm) were effective in growing the CNTs. The growth rates were 10 nm/min at 400 °C and 10 μm/min at 600 °C. The intensity ratios between G-peak and D-peak (G/D ratio) of the Raman scattering spectroscopy were almost the same for the CNTs grown at temperatures between 400 and 600 °C.

  3. Green light emission from terbium doped silicon rich silicon oxide films obtained by plasma enhanced chemical vapor deposition.

    PubMed

    Podhorodecki, A; Zatryb, G; Misiewicz, J; Wojcik, J; Wilson, P R J; Mascher, P

    2012-11-30

    The effect of silicon concentration and annealing temperature on terbium luminescence was investigated for thin silicon rich silicon oxide films. The structures were deposited by means of plasma enhanced chemical vapor deposition. The structural properties of these films were investigated by Rutherford backscattering spectrometry, transmission electron microscopy and Raman scattering. The optical properties were investigated by means of photoluminescence and photoluminescence decay spectroscopy. It was found that both the silicon concentration in the film and the annealing temperature have a strong impact on the terbium emission intensity. In this paper, we present a detailed discussion of these issues and determine the optimal silicon concentration and annealing temperature. PMID:23110801

  4. Green light emission from terbium doped silicon rich silicon oxide films obtained by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Podhorodecki, A.; Zatryb, G.; Misiewicz, J.; Wojcik, J.; Wilson, P. R. J.; Mascher, P.

    2012-11-01

    The effect of silicon concentration and annealing temperature on terbium luminescence was investigated for thin silicon rich silicon oxide films. The structures were deposited by means of plasma enhanced chemical vapor deposition. The structural properties of these films were investigated by Rutherford backscattering spectrometry, transmission electron microscopy and Raman scattering. The optical properties were investigated by means of photoluminescence and photoluminescence decay spectroscopy. It was found that both the silicon concentration in the film and the annealing temperature have a strong impact on the terbium emission intensity. In this paper, we present a detailed discussion of these issues and determine the optimal silicon concentration and annealing temperature.

  5. Spectroscopic ellipsometry study of hydrogenated amorphous silicon carbon alloy films deposited by plasma enhanced chemical vapor deposition

    SciTech Connect

    Basa, D. K.; Abbate, G.; Ambrosone, G.; Marino, A.; Coscia, U.

    2010-01-15

    The optical properties of the hydrogenated amorphous silicon carbon alloy films, prepared by plasma enhanced chemical vapor deposition technique from silane and methane gas mixture diluted in helium, have been investigated using variable angle spectroscopic ellipsometry in the photon energy range from 0.73 to 4.59 eV. Tauc-Lorentz model has been employed for the analysis of the optical spectra and it has been demonstrated that the model parameters are correlated with the carbon content as well as to the structural properties of the studied films.

  6. Synthesis of carbon nanotubes on diamond-like carbon by the hot filament plasma-enhanced chemical vapor deposition method.

    PubMed

    Choi, Eun Chang; Park, Yong Seob; Hong, Byungyou

    2009-01-01

    Carbon nanotubes (CNTs) have attracted considerable attention as possible routes to device miniaturization due to their excellent mechanical, thermal, and electronic properties. These properties show great potential for devices such as field emission displays, transistors, and sensors. The growth of CNTs can be explained by interaction between small carbon patches and the metal catalyst. The metals such as nickel, cobalt, gold, iron, platinum, and palladium are used as the catalysts for the CNT growth. In this study, diamond-like carbon (DLC) was used for CNT growth as a nonmetallic catalyst layer. DLC films were deposited by a radio frequency (RF) plasma-enhanced chemical vapor deposition (RF-PECVD) method with a mixture of methane and hydrogen gases. CNTs were synthesized by a hot filament plasma-enhanced chemical vapor deposition (HF-PECVD) method with ammonia (NH3) as a pretreatment gas and acetylene (C2H2) as a carbon source gas. The grown CNTs and the pretreated DLC films were observed using field emission scanning electron microscopy (FE-SEM) measurement, and the structure of the grown CNTs was analyzed by high resolution transmission scanning electron microscopy (HR-TEM). Also, using energy dispersive spectroscopy (EDS) measurement, we confirmed that only the carbon component remained on the substrate. PMID:19318258

  7. Plasma-enhanced chemical vapor deposition of graphene on copper substrates

    SciTech Connect

    Woehrl, Nicolas Schulz, Stephan; Ochedowski, Oliver; Gottlieb, Steven; Shibasaki, Kosuke

    2014-04-15

    A plasma enhanced vapor deposition process is used to synthesize graphene from a hydrogen/methane gas mixture on copper samples. The graphene samples were transferred onto SiO{sub 2} substrates and characterized by Raman spectroscopic mapping and atomic force microscope topographical mapping. Analysis of the Raman bands shows that the deposited graphene is clearly SLG and that the sheets are deposited on large areas of several mm{sup 2}. The defect density in the graphene sheets is calculated using Raman measurements and the influence of the process pressure on the defect density is measured. Furthermore the origin of these defects is discussed with respect to the process parameters and hence the plasma environment.

  8. Optical emission study of a doped diamond deposition process by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Rayar, M.; Supiot, P.; Veis, P.; Gicquel, A.

    2008-08-01

    Standard H2/CH4/B2H6 plasmas (99% of H2 and 1% of CH4, with 0-100ppm of B2H6 added) used for doped diamond film growth are studied by optical emission spectroscopy in order to gain a better understanding of the influence of boron species on the gas phase chemistry. Only two boron species are detected under our experimental conditions (9/15/23Wcm-3 average microwave power density values), and the emission spectra used for studies reported here are B(S1/22-P1/2,3/202) and BH [AΠ1-XΣ+1(0,0)]. Variations of their respective emission intensities as a function of the ratio B /C, the boron to carbon ratio in the gas mixture, are reported. We confirmed that the plasma parameters (Tg, Te, and ne) are not affected by the introduction of diborane, and the number densities of B atoms and BH radical species were estimated from experimental measurements. The results are compared to those obtained from a zero-dimensional chemical kinetic model where two groups of reactions are considered: (1) BHx+H ↔BHx -1+H2 (x=1-3) by analogy with the well-known equilibrium CHx+H set of reactions, which occurs, in particular, in diamond deposition reactors; and (2) from conventional organic chemistry, the set of reactions involving boron species: BHx+C2H2 (x =0-1). The results clearly show that the model based on hydrogen and boron hydrides reactions alone is not consistent with the experimental results, while it is so when taking into account both sets of reactions. Once an upper limit for the boron species number densities has been estimated, axial profiles are calculated on the basis of the plasma model results obtained previously in Laboratoire d'Ingénierie des Matériaux et des Hautes Pressions, and significant differences in trends for different boron species are found. At the plasma-to-substrate boundary, [BH] and [B] drop off in contrast to [BH2], which shows little decrease, and [BH3], which shows little increase, in this region.

  9. Resolving the nanostructure of plasma-enhanced chemical vapor deposited nanocrystalline SiOx layers for application in solar cells

    NASA Astrophysics Data System (ADS)

    Klingsporn, M.; Kirner, S.; Villringer, C.; Abou-Ras, D.; Costina, I.; Lehmann, M.; Stannowski, B.

    2016-06-01

    Nanocrystalline silicon suboxides (nc-SiOx) have attracted attention during the past years for the use in thin-film silicon solar cells. We investigated the relationships between the nanostructure as well as the chemical, electrical, and optical properties of phosphorous, doped, nc-SiO0.8:H fabricated by plasma-enhanced chemical vapor deposition. The nanostructure was varied through the sample series by changing the deposition pressure from 533 to 1067 Pa. The samples were then characterized by X-ray photoelectron spectroscopy, spectroscopic ellipsometry, Raman spectroscopy, aberration-corrected high-resolution transmission electron microscopy, selected-area electron diffraction, and a specialized plasmon imaging method. We found that the material changed with increasing pressure from predominantly amorphous silicon monoxide to silicon dioxide containing nanocrystalline silicon. The nanostructure changed from amorphous silicon filaments to nanocrystalline silicon filaments, which were found to cause anisotropic electron transport.

  10. Plasma enhanced chemical vapor deposition (PECVD) method of forming vanadium oxide films and vanadium oxide thin-films prepared thereby

    DOEpatents

    Zhang, Ji-Guang; Tracy, C. Edwin; Benson, David K.; Turner, John A.; Liu, Ping

    2000-01-01

    A method is disclosed of forming a vanadium oxide film on a substrate utilizing plasma enhanced chemical vapor deposition. The method includes positioning a substrate within a plasma reaction chamber and then forming a precursor gas comprised of a vanadium-containing chloride gas in an inert carrier gas. This precursor gas is then mixed with selected amounts of hydrogen and oxygen and directed into the reaction chamber. The amounts of precursor gas, oxygen and hydrogen are selected to optimize the final properties of the vanadium oxide film An rf plasma is generated within the reaction chamber to chemically react the precursor gas with the hydrogen and the oxygen to cause deposition of a vanadium oxide film on the substrate while the chamber deposition pressure is maintained at about one torr or less. Finally, the byproduct gases are removed from the plasma reaction chamber.

  11. Cell proliferation on modified DLC thin films prepared by plasma enhanced chemical vapor deposition.

    PubMed

    Stoica, Adrian; Manakhov, Anton; Polčák, Josef; Ondračka, Pavel; Buršíková, Vilma; Zajíčková, Renata; Medalová, Jiřina; Zajíčková, Lenka

    2015-01-01

    Recently, diamondlike carbon (DLC) thin films have gained interest for biological applications, such as hip and dental prostheses or heart valves and coronary stents, thanks to their high strength and stability. However, the biocompatibility of the DLC is still questionable due to its low wettability and possible mechanical failure (delamination). In this work, DLC:N:O and DLC: SiOx thin films were comparatively investigated with respect to cell proliferation. Thin DLC films with an addition of N, O, and Si were prepared by plasma enhanced CVD from mixtures of methane, hydrogen, and hexamethyldisiloxane. The films were optically characterized by infrared spectroscopy and ellipsometry in UV-visible spectrum. The thickness and the optical properties were obtained from the ellipsometric measurements. Atomic composition of the films was determined by Rutherford backscattering spectroscopy combined with elastic recoil detection analysis and by x-ray photoelectron spectroscopy. The mechanical properties of the films were studied by depth sensing indentation technique. The number of cells that proliferate on the surface of the prepared DLC films and on control culture dishes were compared and correlated with the properties of as-deposited and aged films. The authors found that the level of cell proliferation on the coated dishes was high, comparable to the untreated (control) samples. The prepared DLC films were stable and no decrease of the biocompatibility was observed for the samples aged at ambient conditions. PMID:25967153

  12. Growth kinetics of low temperature single-wall and few walled carbon nanotubes grown by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Gohier, A.; Minea, T. M.; Djouadi, M. A.; Jiménez, J.; Granier, A.

    2007-03-01

    Single-wall, double walled or few walled nanotubes (FWNT) are grown by electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD) at temperature as low as 600 °C. Most of these structures are isolated and self-oriented perpendicular to the substrate. The growth mechanism observed for single-wall and few walled (less than seven walls) nanotubes is the “base-growth” mode. Their grow kinetics is investigated regarding two parameters namely the growth time and the synthesis temperature. It is shown that nucleation and growth rate is correlated with the number of walls into FWNT. It also provides an evidence of a critical temperature for FWNT synthesis.

  13. Synthesis and growth mechanism of Fe-catalyzed carbon nanotubes by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Jiang, Jun; Feng, Tao; Cheng, Xinhong; Dai, Lijuan; Cao, Gongbai; Jiang, Bingyao; Wang, Xi; Liu, Xianghuai; Zou, Shichang

    2006-03-01

    Plasma-enhanced chemical vapor deposition (PECVD) was used to grow Fe-catalyzed carbon nanotubes (CNTs). The nanotubes had a uniform diameter in the range of about 10-20 nm. A base growth mode was responsible for the CNTs growth using a mixture of H 2 (60 sccm) and C 2H 2 (15 sccm). For a mixture of H 2 (100 sccm) and C 2H 2 (25 sccm), a complicated growth mechanism took place involving both the base growth and the tip growth. X-ray photoelectron spectroscopy measurements revealed that the grown CNTs contained C-H covalent bonds and Fe-C bonds located at the interface between them and the substrates. The factors determining the growth mechanism of CNTs are discussed and their growth mechanisms with the different gas ratios are suggested.

  14. In situ growth rate measurements during plasma-enhanced chemical vapour deposition of vertically aligned multiwall carbon nanotube films

    NASA Astrophysics Data System (ADS)

    Jönsson, M.; Nerushev, O. A.; Campbell, E. E. B.

    2007-08-01

    In situ laser reflectivity measurements are used to monitor the growth of multiwalled carbon nanotube (MWCNT) films grown by DC plasma-enhanced chemical vapour deposition (PECVD) from an iron catalyst film deposited on a silicon wafer. In contrast to thermal CVD growth, there is no initial increase in the growth rate; instead, the initial growth rate is high (as much as 10 µm min-1) and then drops off rapidly to reach a steady level (2 µm min-1) for times beyond 1 min. We show that a limiting factor for growing thick films of multiwalled nanotubes (MWNTs) using PECVD can be the formation of an amorphous carbon layer at the top of the growing nanotubes. In situ reflectivity measurements provide a convenient technique for detecting the onset of the growth of this layer.

  15. Growth of carbon nanotubes (CNTs) on metallic underlayers by diffusion plasma-enhanced chemical vapour deposition (DPECVD)

    NASA Astrophysics Data System (ADS)

    Kim, S. M.; Gangloff, L.

    2009-10-01

    Here, we demonstrate the low-temperature (480-612 °C) synthesis of carbon nanotubes (CNTs) on different metallic underlayers (i.e., NiV, Ir, Ag, Pt, W, and Ta) using diffusion (dc) plasma-enhanced (~20 W, -600 V) chemical vapour deposition (DPECVD). The catalyst used is bi-layered Fe/Al and the feedstock used is a mixture of C 2H 2 and NH 3 (1:4). The crucial component is the diffusion of radical ions and hydrogen generated such as H 2/H +/H 2+/NH 3+/CH 2+/C 2H 2+ (which are confirmed by in-situ mass spectroscopy) from the nozzle, where it is inserted for most effective plasma diffusion between a substrate and a gas distributor.

  16. Highly efficient shrinkage of inverted-pyramid silicon nanopores by plasma-enhanced chemical vapor deposition technology.

    PubMed

    Wang, Yifan; Deng, Tao; Chen, Qi; Liang, Feng; Liu, Zewen

    2016-06-24

    Solid-state nanopore-based analysis systems are currently one of the most attractive and promising platforms in sensing fields. This work presents a highly efficient method to shrink inverted-pyramid silicon nanopores using plasma-enhanced chemical vapor deposition (PECVD) technology by the deposition of SiN x onto the surface of the nanopore. The contraction of the inverted-pyramid silicon nanopores when subjected to the PECVD process has been modeled and carefully analyzed, and the modeling data are in good agreement with the experimental results within a specific PECVD shrinkage period (∼0-600 s). Silicon nanopores within a 50-400 nm size range contract to sub-10 nm dimensions. Additionally, the inner structure of the nanopores after the PECVD process has been analyzed by focused ion beam cutting process. The results show an inner structure morphology change from inverted-pyramid to hourglass, which may enhance the spatial resolution of sensing devices. PMID:27181294

  17. Plasma-enhanced chemical vapor deposition and characterization of high-permittivity hafnium and zirconium silicate films

    NASA Astrophysics Data System (ADS)

    Kato, Hiromitsu; Nango, Tomohiro; Miyagawa, Takeshi; Katagiri, Takahiro; Seol, Kwang Soo; Ohki, Yoshimichi

    2002-07-01

    Deposition of hafnium silicate films with various hafnium contents was tried by plasma-enhanced chemical vapor deposition using tetraethoxysilane and a hafnium alkoxide. From x-ray photoelectron spectroscopy, the deposited films are confirmed to be silicate with Hf-O-Si bonds but without any Hf-Si bonds. The permittivity calculated from the capacitance of the accumulation layer increases monotonically with an increase in the hafnium content, whereas the optical band gap energy estimated from vacuum ultraviolet absorption spectra decreases. Similar results were obtained from zirconium silicate films deposited using tetraethoxysilane and a zirconium alkoxide. If we compare the films with the same hafnium or zirconium content, the hafnium silicate exhibits a higher permittivity and a larger band gap energy than the zirconium silicate.

  18. Formation of a Si Si3N4 nanocomposite from plasma enhanced chemical vapour deposition multilayer structures

    NASA Astrophysics Data System (ADS)

    Scardera, G.; Bellet-Amalric, E.; Bellet, D.; Puzzer, T.; Pink, E.; Conibeer, G.

    2008-07-01

    This work reports on the crystallization of α-Si3N4, β-Si3N4, and silicon in plasma enhanced chemical vapour deposition silicon nitride films grown with SiH4 and NH3 at 400C and annealed at 1150C. Nanometric multilayer structures, composed of alternating layers of silicon nitride and silicon-rich nitride, were used as the starting material. The final product is a thin-film Si-Si3N4 nanocomposite. The formation of this composite is verified using glancing incidence X-ray diffraction, transmission electron microscopy and Fourier transform infra-red spectroscopy. Annealing investigations indicate that the multilayer structure plays a key role in the formation of this composite and for the relatively low temperature formation of α- and β-Si3N4 nanocrystals.

  19. On the nature of carbon nitride nanocrystals formed by plasma enhanced chemical vapor deposition and rapid thermal annealing

    NASA Astrophysics Data System (ADS)

    Lim, S. F.; Wee, A. T. S.; Lin, J.; Chua, D. H. C.; Huan, C. H. A.

    1999-06-01

    Using high-resolution transmission electron microscopy (HRTEM) and atomic force microscopy, carbon nitride nanocrystals were observed in films deposited by RF plasma-enhanced chemical vapor deposition (RF-PECVD) followed by a rapid thermal annealing (RTA) to 1000°C. The (30±10) nm crystals are embedded in an amorphous matrix, and the interplanar lattice spacings suggest that the crystals are the hexagonal β-carbon nitride phase. Investigations using Fourier transform infra-red spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS) of the films show that RTA increases the sp 3 content of the films but decreases the CN (nitrile), N-H and C-H content.

  20. Highly efficient shrinkage of inverted-pyramid silicon nanopores by plasma-enhanced chemical vapor deposition technology

    NASA Astrophysics Data System (ADS)

    Wang, Yifan; Deng, Tao; Chen, Qi; Liang, Feng; Liu, Zewen

    2016-06-01

    Solid-state nanopore-based analysis systems are currently one of the most attractive and promising platforms in sensing fields. This work presents a highly efficient method to shrink inverted-pyramid silicon nanopores using plasma-enhanced chemical vapor deposition (PECVD) technology by the deposition of SiN x onto the surface of the nanopore. The contraction of the inverted-pyramid silicon nanopores when subjected to the PECVD process has been modeled and carefully analyzed, and the modeling data are in good agreement with the experimental results within a specific PECVD shrinkage period (∼0–600 s). Silicon nanopores within a 50–400 nm size range contract to sub-10 nm dimensions. Additionally, the inner structure of the nanopores after the PECVD process has been analyzed by focused ion beam cutting process. The results show an inner structure morphology change from inverted-pyramid to hourglass, which may enhance the spatial resolution of sensing devices.

  1. Preparation of glasses in the Ge-S-I system by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Mochalov, L. A.; Churbanov, M. F.; Velmuzhov, A. P.; Lobanov, A. S.; Kornev, R. A.; Sennikov, G. P.

    2015-08-01

    The glass samples of the Ge-S-I system were synthesized by plasma-enhanced chemical vapor deposition (PECVD) in a low-temperature non-equilibrium RF-plasma discharge. The vapors of S and GeI4 were the initial substances. The process was carried out in a flowing quartz reactor at the walls temperature of 300-500 °C and the total pressure range of 1.9-22.8 Torr. The phase and the elemental compositions of the deposited glassy batches were investigated. The glasses obtained by melting of the solid reaction products were homogenized in the evacuated quartz glass ampoule and they were studied by DSC, X-ray microanalysis, and atomic emission spectroscopy. The proposed method allows to prepare the glasses of the system Ge-S-I with Si content less than 3 ṡ 10-5 wt.%.

  2. Polymorphous silicon thin films obtained by plasma-enhanced chemical vapor deposition using dichlorosilane as silicon precursor.

    PubMed

    Remolina, A; Monroy, B M; García-Sánchez, M F; Ponce, A; Bizarro, M; Alonso, J C; Ortiz, A; Santana, G

    2009-06-17

    Polymorphous silicon thin films (pm-Si) have been deposited from mixtures of dichlorosilane and hydrogen, using argon as the diluting gas by plasma-enhanced chemical vapor deposition. The deposition conditions were chosen to simultaneously obtain both Si nanocrystallites and an amorphous silicon matrix in the as-grown samples. High resolution transmission electron microscopy studies show the crystallinity of Si domains whose dimensions are in the interval of 2-14 nm. The surface passivation state of the silicon nanocrystals was inferred from Fourier transform infrared spectroscopy analysis. Two optical absorption edges, corresponding to the amorphous matrix and the Si nanocrystals, were observed for all the pm-Si thin films. Intense visible photoluminescence was observed for the as-grown samples. The possibility of using these thin films for the down-conversion effect in silicon solar cells is discussed. PMID:19471076

  3. Plasma-enhanced chemical-vapor deposition of silicon nitride film for high resistance to potential-induced degradation

    NASA Astrophysics Data System (ADS)

    Mishina, Ken; Ogishi, Atsufumi; Ueno, Kiyoshi; Jonai, Sachiko; Ikeno, Norihiro; Saruwatari, Tetsuya; Hara, Kohjiro; Ogura, Atsushi; Yamazaki, Toshiharu; Doi, Takuya; Shinohara, Makoto; Masuda, Atsushi

    2015-08-01

    The antireflection coating (ARC) on crystalline silicon solar cells plays an important role in preventing potential-induced degradation (PID). In a previous work, we reported that the module, which has an ARC prepared by plasma-enhanced chemical-vapor deposition (PE-CVD) using a hollow cathode, indicated high resistance to PID with a constant conventional refractive index (RI). In this work, we report further investigation of the high-PID-resistant ARC. The results indicate that the high-PID resistant ARC had high conductivity, high Si-H bond density, and low N-H bond density. Furthermore, both higher PID resistance and higher conversion efficiency are achieved using an ARC of double or triple layers comprising stacked silicon nitride layers of different RI than those of a conventional single-layer ARC.

  4. Monitoring and analyses of substrate surface in first stages of graphene growth in plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Kawano, Masahiro; Yamada, Shunya; Hayashi, Yasuaki

    2016-06-01

    In situ ellipsometry was carried out as well as ex situ measurements by scanning electron microscopy and Raman spectroscopy for the analyses of substrate surface in the first stage of graphene growth in plasma-enhanced chemical vapor deposition. Evolutions of the ellipsometric parameters Ψ and Δ were precisely measured during the growth of graphene with the sensitivity far less than 1 nm in film thickness. By the fitting of the experimentally obtained trajectory of ellipsometric parameters on the Ψ–Δ coordinate plane to that of the calculated ones, we confirmed that the graphite volume fraction decreased with growth after a dense graphite material initially formed. This suggests that carbon nanowalls grew on a thin graphitic layer.

  5. Method of plasma enhanced chemical vapor deposition of diamond using methanol-based solutions

    NASA Technical Reports Server (NTRS)

    Tzeng, Yonhua (Inventor)

    2009-01-01

    Briefly described, methods of forming diamond are described. A representative method, among others, includes: providing a substrate in a reaction chamber in a non-magnetic-field microwave plasma system; introducing, in the absence of a gas stream, a liquid precursor substantially free of water and containing methanol and at least one carbon and oxygen containing compound having a carbon to oxygen ratio greater than one, into an inlet of the reaction chamber; vaporizing the liquid precursor; and subjecting the vaporized precursor, in the absence of a carrier gas and in the absence in a reactive gas, to a plasma under conditions effective to disassociate the vaporized precursor and promote diamond growth on the substrate in a pressure range from about 70 to 130 Torr.

  6. Direct fabrication of 3D graphene on nanoporous anodic alumina by plasma-enhanced chemical vapor deposition

    PubMed Central

    Zhan, Hualin; Garrett, David J.; Apollo, Nicholas V.; Ganesan, Kumaravelu; Lau, Desmond; Prawer, Steven; Cervenka, Jiri

    2016-01-01

    High surface area electrode materials are of interest for a wide range of potential applications such as super-capacitors and electrochemical cells. This paper describes a fabrication method of three-dimensional (3D) graphene conformally coated on nanoporous insulating substrate with uniform nanopore size. 3D graphene films were formed by controlled graphitization of diamond-like amorphous carbon precursor films, deposited by plasma-enhanced chemical vapour deposition (PECVD). Plasma-assisted graphitization was found to produce better quality graphene than a simple thermal graphitization process. The resulting 3D graphene/amorphous carbon/alumina structure has a very high surface area, good electrical conductivity and exhibits excellent chemically stability, providing a good material platform for electrochemical applications. Consequently very large electrochemical capacitance values, as high as 2.1 mF for a sample of 10 mm3, were achieved. The electrochemical capacitance of the material exhibits a dependence on bias voltage, a phenomenon observed by other groups when studying graphene quantum capacitance. The plasma-assisted graphitization, which dominates the graphitization process, is analyzed and discussed in detail. PMID:26805546

  7. Free standing carbon nanotubes growth on large-area by nanoimprint and plasma-enhanced chemical vapor deposition.

    NASA Astrophysics Data System (ADS)

    Chang, Won Seok; Choi, Dae-Geon; Chung, Jun-Ho; Huh, Kab-Soo

    2008-03-01

    Among various synthesis methods for carbon nanotube growth, chemical vapor deposition (CVD) method has been widely used for various advantages such as high quality, vertical alignment, controlled diameter and length of nanotubes and so on. Especially, vertically aligned multi-wall carbon nanotube could be grown using plasma-enhanced chemical vapor deposition (PECVD). In this paper, we presented growth of free standing carbon nanotubes by PECVD for the fabrication of nano-electrode. For the growth of nanotubes on the large area 50 mm x 50 mm, catalyst dots were formed by nanoimprint and lift-off process. The synthesis of carbon nanotube requires a metal catalyst layer, etchant gas, and a carbon source. Ammonia (NH3) and acetylene (C2H2) were used as the etchant gas and carbon source, respectively. And iron (Fe) of catalyst metal was deposited on silicon wafer substrates. To form Fe nano dots with diameter of 150 nm and thickness of 50 nm, nano holes patterned imprint resin was used for lift-off process. Carbon nanotubes were grown on pretreated substrates at approximately 30% C2H2:NH3 flow ratios for 40 min.

  8. Effects of feed gas composition and catalyst thickness on carbon nanotube and nanofiber synthesis by plasma enhanced chemical vapor deposition.

    PubMed

    Garg, R K; Kim, S S; Hash, D B; Gore, J P; Fisher, T S

    2008-06-01

    Many engineering applications require carbon nanotubes with specific characteristics such as wall structure, chirality and alignment. However, precise control of nanotube properties grown to application specifications remains a significant challenge. Plasma-enhanced chemical vapor deposition (PECVD) offers a variety of advantages in the synthesis of carbon nanotubes in that several important synthesis parameters can be controlled independently. This paper reports an experimental study of the effects of reacting gas composition (percentage methane in hydrogen) and catalyst film thickness on carbon nanotube (CNT) growth and a computational study of gas-phase composition for the inlet conditions of experimentally observed carbon nanotube growth using different chemical reaction mechanisms. The simulations seek to explain the observed effects of reacting gas composition and to identify the precursors for CNT formation. The experimental results indicate that gas-phase composition significantly affects the synthesized material, which is shown to be randomly aligned nanotube and nanofiber mats for relatively methane-rich inlet gas mixtures and non-tubular carbon for methane-lean incoming mixtures. The simulation results suggest that inlet methane-hydrogen mixture coverts to an acetylene-methane-hydrogen mixture with minor amounts of ethylene, hydrogen atom, and methyl radical. Acetylene appears to be the indicator species for solid carbon formation. The simulations also show that inlet methane-hydrogen mixture does not produce enough gas-phase precursors needed to form quality CNTs below 5% CH4 concentrations in the inlet stream. PMID:18681048

  9. Plasma-enhanced chemical vapor deposition of ortho-carborane: structural insights and interaction with Cu overlayers

    NASA Astrophysics Data System (ADS)

    James, Robinson; Pasquale, Frank L.; Kelber, Jeffry A.

    2013-09-01

    X-ray and ultraviolet photoelectron spectroscopy (XPS, UPS) are used to investigate the chemical and electronic structure of boron carbide films deposited from ortho-carborane precursors using plasma-enhanced chemical vapor deposition (PECVD), and the reactivity of PECVD films toward sputter-deposited Cu overlayers. The XPS data provide clear evidence of enhanced ortho-carborane reactivity with the substrate, and of extra-icosahedral boron and carbon species; these results differ from results for films formed by condensation and electron beam induced cross-linking of ortho-carborane (EBIC films). The UPS data show that the valence band maximum for PECVD films is ∼1.5 eV closer to the Fermi level than for EBIC films. The XPS data also indicate that PECVD films are resistant to thermally-stimulated diffusion of Cu at temperatures up to 1000 K in UHV, in direct contrast to recently reported results, but important for applications in neutron detection and in microelectronics.

  10. Plasma-enhanced chemical vapor deposition of ortho-carborane: structural insights and interaction with Cu overlayers.

    PubMed

    James, Robinson; Pasquale, Frank L; Kelber, Jeffry A

    2013-09-01

    X-ray and ultraviolet photoelectron spectroscopy (XPS, UPS) are used to investigate the chemical and electronic structure of boron carbide films deposited from ortho-carborane precursors using plasma-enhanced chemical vapor deposition (PECVD), and the reactivity of PECVD films toward sputter-deposited Cu overlayers. The XPS data provide clear evidence of enhanced ortho-carborane reactivity with the substrate, and of extra-icosahedral boron and carbon species; these results differ from results for films formed by condensation and electron beam induced cross-linking of ortho-carborane (EBIC films). The UPS data show that the valence band maximum for PECVD films is ∼1.5 eV closer to the Fermi level than for EBIC films. The XPS data also indicate that PECVD films are resistant to thermally-stimulated diffusion of Cu at temperatures up to 1000 K in UHV, in direct contrast to recently reported results, but important for applications in neutron detection and in microelectronics. PMID:23883590

  11. Deposition kinetics and characterization of stable ionomers from hexamethyldisiloxane and methacrylic acid by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Urstöger, Georg; Resel, Roland; Koller, Georg; Coclite, Anna Maria

    2016-04-01

    A novel ionomer of hexamethyldisiloxane and methacrylic acid was synthesized by plasma enhanced chemical vapor deposition (PECVD). The PECVD process, being solventless, allows mixing of monomers with very different solubilities, and for polymers formed at high deposition rates and with high structural stability (due to the high number of cross-links and covalent bonding to the substrate) to be obtained. A kinetic study over a large set of parameters was run with the aim of determining the optimal conditions for high stability and proton conductivity of the polymer layer. Copolymers with good stability over 6 months' time in air and water were obtained, as demonstrated by ellipsometry, X-Ray reflectivity, and FT-IR spectroscopy. Stable coatings showed also proton conductivity as high as 1.1 ± 0.1 mS cm-1. Chemical analysis showed that due to the high molecular weight of the chosen precursors, it was possible to keep the plasma energy-input-per-mass low. This allowed limited precursor fragmentation and the functional groups of both monomers to be retained during the plasma polymerization.

  12. Determination of photocatalytic activity in amorphous and crystalline titanium oxide films prepared using plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Wu, Cheng-Yang; Chiang, Bo-Sheng; Chang, Springfield; Liu, Day-Shan

    2011-01-01

    Hydro-oxygenated amorphous titanium oxide (a-TiO x:OH) films were prepared by plasma-enhanced chemical vapor deposition (PECVD) using precursors of titanium tetraisopropoxide (TTIP) and oxygen. The influences of chemical states and crystal quality on the photocatalytic activity were systematically investigated in the as-deposited and post-annealed films. The degree of the photocatalytic activity was deeply correlated with the porosity related to the hydroxyl (OH) groups in the as-deposited amorphous film. The crystallized anatase structures was observed from the 200 °C-deposited a-TiO x:OH film after a post-annealing treatment at 400 °C. The photocatalytic activity related to the film with anatase structure was markedly superior to that of an amorphous film with porous structures. The larger the crystal size of the anatase structure, the higher the photocatalytic activity obtained. At elevated annealed temperatures, the inferior anatase structure due to the crystalline transformation led to a low photocatalytic activity. It was concluded that the photocatalytic activity of an amorphous TiO x film prepared using PECVD was determined by the porosity originating from the functional OH groups in the film, whereas the crystalline quality of anatase phase in the annealed poly-TiO x film was crucial to the photocatalytic activity.

  13. Direct fabrication of 3D graphene on nanoporous anodic alumina by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Zhan, Hualin; Garrett, David J.; Apollo, Nicholas V.; Ganesan, Kumaravelu; Lau, Desmond; Prawer, Steven; Cervenka, Jiri

    2016-01-01

    High surface area electrode materials are of interest for a wide range of potential applications such as super-capacitors and electrochemical cells. This paper describes a fabrication method of three-dimensional (3D) graphene conformally coated on nanoporous insulating substrate with uniform nanopore size. 3D graphene films were formed by controlled graphitization of diamond-like amorphous carbon precursor films, deposited by plasma-enhanced chemical vapour deposition (PECVD). Plasma-assisted graphitization was found to produce better quality graphene than a simple thermal graphitization process. The resulting 3D graphene/amorphous carbon/alumina structure has a very high surface area, good electrical conductivity and exhibits excellent chemically stability, providing a good material platform for electrochemical applications. Consequently very large electrochemical capacitance values, as high as 2.1 mF for a sample of 10 mm3, were achieved. The electrochemical capacitance of the material exhibits a dependence on bias voltage, a phenomenon observed by other groups when studying graphene quantum capacitance. The plasma-assisted graphitization, which dominates the graphitization process, is analyzed and discussed in detail.

  14. Direct fabrication of 3D graphene on nanoporous anodic alumina by plasma-enhanced chemical vapor deposition.

    PubMed

    Zhan, Hualin; Garrett, David J; Apollo, Nicholas V; Ganesan, Kumaravelu; Lau, Desmond; Prawer, Steven; Cervenka, Jiri

    2016-01-01

    High surface area electrode materials are of interest for a wide range of potential applications such as super-capacitors and electrochemical cells. This paper describes a fabrication method of three-dimensional (3D) graphene conformally coated on nanoporous insulating substrate with uniform nanopore size. 3D graphene films were formed by controlled graphitization of diamond-like amorphous carbon precursor films, deposited by plasma-enhanced chemical vapour deposition (PECVD). Plasma-assisted graphitization was found to produce better quality graphene than a simple thermal graphitization process. The resulting 3D graphene/amorphous carbon/alumina structure has a very high surface area, good electrical conductivity and exhibits excellent chemically stability, providing a good material platform for electrochemical applications. Consequently very large electrochemical capacitance values, as high as 2.1 mF for a sample of 10 mm(3), were achieved. The electrochemical capacitance of the material exhibits a dependence on bias voltage, a phenomenon observed by other groups when studying graphene quantum capacitance. The plasma-assisted graphitization, which dominates the graphitization process, is analyzed and discussed in detail. PMID:26805546

  15. Fluid modeling for plasma-enhanced direct current chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Ismagilov, Rinat R.; Khamidullin, Ildar R.; Kleshch, Victor I.; Malykhin, Sergei A.; Alexeev, Andrey M.; Obraztsov, Alexander N.

    2016-01-01

    A self-consistent continuum (fluid) model for a direct current discharge used in a chemical vapor deposition system is developed. The model is built for a two-dimensional axisymmetric system and incorporates an electron energy balance for low-pressure Ar gas. The underlying physics of the fluid model is briefly discussed. The fluid and Poisson equations for plasma species are used as the model background. The plasma species considered in the model include electrons, Ar+ ions, and Ar atoms in ground and excited states. Nine reactions between these species are taken into account, including surface reactions. The densities of various plasma species as well as the relative contributions of generation and annihilation processes for electrons, ions, and atoms are calculated. The concentrations for electrons and Ar+ ions on the order of 1020 m-3 are obtained for the plasma in the computer simulations.

  16. Growth of aligned carbon nanotubes on carbon microfibers by dc plasma-enhanced chemical vapor deposition

    SciTech Connect

    Chen, L H.; AuBuchon, J F.; Chen, I C.; Daraio, C; Ye, X R.; Gapin, A; Jin, Sungho; Wang, Chong M.

    2006-01-16

    It is shown that unidirectionally aligned carbon nanotubes can be grown on electrically conductive network of carbon microfibers via control of buffer layer material and applied electric field during dc plasma chemical vapor deposition growth. Ni catalyst deposition on carbon microfiber produces relatively poorly aligned nanotubes with significantly varying diameters and lengths obtained. The insertion of Ti 5 nm thick underlayer between Ni catalyst layer and C microfiber substrate significantly alters the morphology of nanotubes, resulting in much better aligned, finer diameter, and longer array of nanotubes. This beneficial effect is attributed to the reduced reaction between Ni and carbon paper, as well as prevention of plasma etching of carbon paper by inserting a Ti buffer layer. Such a unidirectionally aligned nanotube structure on an open-pore conductive substrate structure may conveniently be utilized as a high-surface-area base electrodes for fuel cells, batteries, and other electrochemical and catalytic reactions.

  17. Parametric Study for Selective Growth of Single-Walled Carbon Nanotubes in Plasma Enhanced Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Nozaki, Tomohiro; Karatsu, Takuya; Yoshida, Shinpei; Okazaki, Ken

    2011-01-01

    Carbon nanotube (CNT) growth mechanism in plasma enhanced chemical vapor deposition (PECVD) is presented. Previously developed atmospheric pressure glow discharge reactor was modified and used for this purpose. First, pressure-dependent transition (20-100 kPa) of CNT morphology was investigated with fixed input power (60 W) and different catalyst loading (Fe/Al2Ox: 20 nm). High-purity, vertically-aligned single-walled CNTs (SWCNTs) were synthesized when capacitively coupled non-thermal plasma was generated at atmospheric pressure. On the other hand, fraction of double-walled and multi-walled CNTs increased as total pressure decreased. Although CNT growth rate was decelerated at reduced input power (5-20 W), SWCNTs were also synthesized in the root growth regime at 20 kPa. Plasma-generated reactive species are the important driving force of CNT growth; however, generation and transportation of those species must be properly suppressed for selective growth of single-, double-, and multi-walled CNTs.

  18. A study of preferential growth of carbon nanotubes with semiconducting behavior grown by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Mizutani, Takashi; Ohnaka, Hirofumi; Okigawa, Yuki; Kishimoto, Shigeru; Ohno, Yutaka

    2009-10-01

    The electrical properties of carbon nanotubes (CNTs) grown by plasma-enhanced chemical vapor deposition (PECVD) have been studied by measuring the I-V characteristics of many CNT-field effect transistors. The ratio of modulation current to total current was as high as 97%, with a small nondepletable OFF current component. This suggests that CNTs with semiconducting behavior were preferentially grown in the PECVD process. Raman scattering spectroscopy of the PECVD-grown CNTs, however, revealed several peaks of the radial breezing mode, which correspond to the presence of metallic CNTs. Scanning gate microscopy measurement of the CNT-FET with an ON/OFF ratio of 100 revealed the existence of a potential barrier in the metallic CNTs. These results suggest that observation of the preferential growth of CNTs with semiconducting behavior in the CNT-FETs fabricated via the present PECVD process results from the opening of the band gap due to defects caused by irradiation damage during the PECVD growth.

  19. Investigation on growth behavior of CNTs synthesized by atmospheric pressure plasma enhanced chemical vapor deposition system on Fe catalyzed substrate.

    PubMed

    Choi, Bum Ho; Kim, Won Jae; Kim, Young Baek; Lee, Jong Ho; Park, Jong Woon; Kim, Woo Sam; Shin, Dong Chan

    2008-10-01

    We have studied growth behavior of carbon nanotubes (CNTs) on iron (Fe) catalyzed substrate using newly developed atmospheric pressure plasma enhanced chemical vapor deposition (AP-PECVD) system. To investigate the improved growth performance with simple equipment and process on large scale, a new AP-PECVD system containing different concept on downstream gas was designed and manufactured. As a catalyst, either sputtered or evaporated Fe thin film on SiO2/Si substrate was used and acetylene gas was used as a carbon source. We observed growth behavior of CNTs such as height, rate and density were strongly affected by plasma power. The maximum height of 427 microm and 267 microm was synthesized under RF plasma power of 30 W for 30 min and 40 W for 3 min, respectively. The growth rate dramatically increased to 6.27 times as plasma power increased from 30 to 40 W which opens the possibility the mass production of CNTs. By SEM and TEM observation, it was verified the grown CNTs was consists of mixture of single-wall and multi-wall CNTs. The graphitization ratio was measured to be 0.93, indicating that the graphitized CNTs forest was formed and relatively high purity of CNTs was synthesized, being useful for nano-composite materials to reinforce the strength. From our experiments, we can observe that the height and growth rate of CNTs is strong function of plasma power. PMID:19198378

  20. Effects of plasma power on the growth of carbon nanotubes in the plasma enhanced chemical vapor deposition method

    NASA Astrophysics Data System (ADS)

    Abdi, Y.; Arzi, E.; Mohajerzadeh, S.

    2008-11-01

    Effects of plasma power on the growth of the multi-wall carbon nanotubes (CNTs) are reported. CNTs were grown on the silicon wafers by plasma enhanced chemical vapor deposition (PECVD) method using a mixture of acetylene and hydrogen at the temperature of 650°C. Plasma powers ranging from zero to 35W were applied on the samples and the effects of different magnitudes of the plasma power on the growth direction of the CNTs were investigated. Regular vertically aligned nanotubes were obtained at plasma power of 25W. In order to set on the plasma during the growth, electrical force was applied on the carbon ions. Nickel layer was used as a catalyst, and prior to the nanotubes growth step, it was treated by hydrogen plasma bombardment in order to obtain the Ni nano-islands. In this step, as the plasma power on the Ni layer was increased, the grain size of nickel nano-particles decreased, and hence, nanotubes of smaller diameter were obtained later on. At the last step some anomalous structures of agglomerated CNTs were obtained by controlling the plasma power. Samples were analyzed by scanning tunneling microscopy (STM) and scanning electron microscopy (SEM).

  1. Preparation of Hydrophobic Metal-Organic Frameworks via Plasma Enhanced Chemical Vapor Deposition of Perfluoroalkanes for the Removal of Ammonia

    PubMed Central

    DeCoste, Jared B.; Peterson, Gregory W.

    2013-01-01

    Plasma enhanced chemical vapor deposition (PECVD) of perfluoroalkanes has long been studied for tuning the wetting properties of surfaces. For high surface area microporous materials, such as metal-organic frameworks (MOFs), unique challenges present themselves for PECVD treatments. Herein the protocol for development of a MOF that was previously unstable to humid conditions is presented. The protocol describes the synthesis of Cu-BTC (also known as HKUST-1), the treatment of Cu-BTC with PECVD of perfluoroalkanes, the aging of materials under humid conditions, and the subsequent ammonia microbreakthrough experiments on milligram quantities of microporous materials. Cu-BTC has an extremely high surface area (~1,800 m2/g) when compared to most materials or surfaces that have been previously treated by PECVD methods. Parameters such as chamber pressure and treatment time are extremely important to ensure the perfluoroalkane plasma penetrates to and reacts with the inner MOF surfaces. Furthermore, the protocol for ammonia microbreakthrough experiments set forth here can be utilized for a variety of test gases and microporous materials. PMID:24145623

  2. Osteoconductive Potential of Barrier NanoSiO2 PLGA Membranes Functionalized by Plasma Enhanced Chemical Vapour Deposition

    PubMed Central

    Terriza, Antonia; Vilches-Pérez, Jose I.; de la Orden, Emilio; Yubero, Francisco; Gonzalez-Caballero, Juan L.; González-Elipe, Agustin R.; Vilches, José; Salido, Mercedes

    2014-01-01

    The possibility of tailoring membrane surfaces with osteoconductive potential, in particular in biodegradable devices, to create modified biomaterials that stimulate osteoblast response should make them more suitable for clinical use, hopefully enhancing bone regeneration. Bioactive inorganic materials, such as silica, have been suggested to improve the bioactivity of synthetic biopolymers. An in vitro study on HOB human osteoblasts was performed to assess biocompatibility and bioactivity of SiO2 functionalized poly(lactide-co-glycolide) (PLGA) membranes, prior to clinical use. A 15 nm SiO2 layer was deposited by plasma enhanced chemical vapour deposition (PECVD), onto a resorbable PLGA membrane. Samples were characterized by X-ray photoelectron spectroscopy, atomic force microscopy, scanning electron microscopy, and infrared spectroscopy (FT-IR). HOB cells were seeded on sterilized test surfaces where cell morphology, spreading, actin cytoskeletal organization, and focal adhesion expression were assessed. As proved by the FT-IR analysis of samples, the deposition by PECVD of the SiO2 onto the PLGA membrane did not alter the composition and other characteristics of the organic membrane. A temporal and spatial reorganization of cytoskeleton and focal adhesions and morphological changes in response to SiO2 nanolayer were identified in our model. The novedous SiO2 deposition method is compatible with the standard sterilization protocols and reveals as a valuable tool to increase bioactivity of resorbable PLGA membranes. PMID:24883304

  3. Influence of krypton atoms on the structure of hydrogenated amorphous carbon deposited by plasma enhanced chemical vapor deposition

    SciTech Connect

    Oliveira, M. H. Jr.; Viana, G. A.; Marques, F. C.; Lima, M. M. Jr. de; Cros, A.; Cantarero, A.

    2010-12-15

    Hydrogenated amorphous carbon (a-C:H) films were prepared by plasma enhanced chemical vapor deposition using methane (CH{sub 4}) plus krypton (Kr) mixed atmosphere. The depositions were performed as function of the bias voltage and krypton partial pressure. The goal of this work was to study the influence of krypton gas on the physical properties of a-C:H films deposited on the cathode electrode. Krypton concentration up to 1.6 at. %, determined by Rutherford Back-Scattering, was obtained at high Kr partial pressure and bias of -120 V. The structure of the films was analyzed by means of optical transmission spectroscopy, multi-wavelength Raman scattering and Fourier Transform Infrared spectroscopy. It was verified that the structure of the films remains unchanged up to a concentration of Kr of about 1.0 at. %. A slight graphitization of the films occurs for higher concentration. The observed variation in the film structure, optical band gap, stress, and hydrogen concentration were associated mainly with the subplantation process of hydrocarbons radicals, rather than the krypton ion energy.

  4. Antireflection coating formed by plasma-enhanced chemical-vapor deposition for terahertz-frequency germanium optics

    NASA Astrophysics Data System (ADS)

    Hosako, Iwao

    2003-07-01

    A method of manufacturing optical coatings for germanium optics used at terahertz frequencies has been developed. The various optical coatings used at terahertz frequencies are difficult to manufacture conventionally because these coatings must be as thick as several tens of micrometers, which is far thicker than those used in the optical region. One way to overcome this problem is to form a silicon oxide layer through plasma-enhanced chemical-vapor deposition, with silane (SiH4) as a source gas. Using this method, I formed 21-μm-thick silicon oxide films as antireflection (AR) layers for germanium optics and obtained low reflection at 1.7 THz (wavelength, λ = 175 μm). This method is easily applied to large-aperture optics and micro-optics as well as to optics with a complex surface form. The AR coatings can also be formed for photoconductive detectors made from germanium doped with gallium at a low temperature (160 °C) this low temperature ensures that the doped impurities in the germanium do not diffuse. Fabrication of optical coatings upon substrates that have refractive indices of 3.84-11.7 may also be possible by control of the refractive indices of the deposited layers.

  5. Synthesis of large scale graphene oxide using plasma enhanced chemical vapor deposition method and its application in humidity sensing

    NASA Astrophysics Data System (ADS)

    Liu, Yang; Chen, Yuming

    2016-03-01

    Large scale graphene oxide (GO) is directly synthesized on copper (Cu) foil by plasma enhanced chemical vapor deposition method under 500 °C and even lower temperature. Compared to the modified Hummer's method, the obtained GO sheet in this article is large, and it is scalable according to the Cu foil size. The oxygen-contained groups in the GO are introduced through the residual gas of methane (99.9% purity). To prevent the Cu surface from the bombardment of the ions in the plasma, we use low intensity discharge. Our experiment reveals that growth temperature has important influence on the carbon to oxygen ratio (C/O ratio) in the GO; and it also affects the amount of π-π* bonds between carbon atoms. Preliminary experiments on a 6 mm × 12 mm GO based humidity sensor prove that the synthesized GO reacts well to the humidity change. Our GO synthesis method may provide another channel for obtaining large scale GO in gas sensing or other applications.

  6. Creating Voids by Annealing a-SiC:O:H Films Prepared by Plasma-enhanced Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Gangopadhyay, S.; Lahlouh, B.; Rajagopalan, T.; Biswas, N.; Mehta, N.; Lubguban, J. A.

    2004-03-01

    Hydrogenated amorphous silicon carbide (a-SiC:H) films were prepared by plasma-enhanced chemical vapor deposition from diethylsilane (C4H12Si) diluted in methane (CH4). The deposition conditions resulted in a highly unstable a-SiC:H film, which reacted with oxygen when exposed to air, forming Si-OH and H-OH bonds and Si-O networks as well. The Rutherford Back Scattering analysis shows 15incorporation. The Fourier transfom infra-red (FT-IR) measurement suggests the presence of a-SiC:O:H component and a-C:H moieties throughout the film. The films were then thermally annealed in vacuum at 450C to removed unstable C-H bonds and Si-OH and H-OH groups creating voids in the film. The removal of C-H, Si-OH and H-OH is evident from the FT-IR spectra. During the annealing process, the film also cross-links and formed a stable a-SiC:O:H film. After annealing, the dielectric constant of the films decreased from 4.2 to 2.1 suggesting the presence of voids/pores in the films.

  7. Structure and characteristics of C3N4 thin films prepared by rf plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Dawei, Wu; Dejun, Fu; Huaixi, Guo; Zhihong, Zhang; Xianquan, Meng; Xiangjun, Fan

    1997-08-01

    C3N4 films were prepared on Si(111) by rf plasma-enhanced chemical vapor deposition using Si3N4/TiN and Si3N4/ZrN as transition layers. X-ray diffraction and transmission electron diffraction revealed that the films deposited have a polycrystalline structure. X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy confirmed the presence of sp3 and sp2 hybridized C atoms tetrahedrally and hexagonally bonded with N atoms, respectively. The nitrogen concentration was calculated from the XPS spectra. Graphite-free C3N4 films were obtained under optimal conditions. The Vickers hardness of the C3N4 films falls in the range of 2950-5100 kgf/mm2. The C3N4 films exhibit high resistance against acid and electrochemical etching. Thermal gravimetric and differential thermal analysis showed that the films are thermally stable at temperatures ranging from room temperature to 1200 °C.

  8. Density change and viscous flow during structural relaxation of plasma-enhanced chemical-vapor-deposited silicon oxide films

    NASA Astrophysics Data System (ADS)

    Cao, Zhiqiang; Zhang, Xin

    2004-10-01

    The structural relaxation of plasma-enhanced chemical-vapor-deposited (PECVD) silane-based silicon oxide films during thermal cycling and annealing has been studied using wafer curvature measurements. These measurements, which determine stress in the amorphous silicon oxide films, are sensitive to both plastic deformation and density changes. A quantitative case study of such changes has been done based upon the experimental results. A microstructure-based mechanism elucidates seams as a source of density change and voids as a source of plastic deformation, accompanied by a viscous flow. This theory was then used to explain a series of experimental results that are related to thermal cycling as well as annealing of PECVD silicon oxide films including stress hysteresis generation and reduction and coefficient of thermal-expansion changes. In particular, the thickness effect was examined; PECVD silicon oxide films with a thickness varying from 1to40μm were studied, as certain demanding applications in microelectromechanical systems require such thick films serving as heat/electrical insulation layers.

  9. Film Characteristics of Low-Temperature Plasma-Enhanced Chemical Vapor Deposition Silicon Dioxide Using Tetraisocyanatesilane and Oxygen

    NASA Astrophysics Data System (ADS)

    Idris, Irman; Sugiura, Osamu

    1998-12-01

    Silicon dioxide films were deposited in a parallel-plate electrode RF plasma-enhanced chemical vapor deposition (PECVD) system using hydrogen-free tetraisocyanatesilane (TICS) and oxygen. The deposition parameters were varied systematically, and the films were characterized by measuring infrared spectra, density, etch rate, refractive index, and current-voltage (I V) and capacitance-voltage (C V) characteristics, as well as by examining their annealing behavior. At 300°C and a TICS partial pressure ratio of 20%, a water-free and hydroxyl-group-free SiO2 film was obtained. The film density, BHF etch rate, refractive index, resistivity, and dielectric constant were 2.3 g/cm3, 330 nm/min, 1.46, 7×1015 Ω·cm, and 3.6, respectively. The film quality degraded and, simultaneously, the film absorbed moisture from the atmosphere with decreasing deposition temperature; however, the quality can be improved by reducing TICS partial pressure. SiO2 films could be deposited even at 15°C, and had a resistivity of about 1013Ω·cm. Infrared measurements showed that SiO2 films deposited from TICS/O2 contained less absorbed water than those deposited from hydrogen-containing source materials at the same deposition temperature.

  10. Single-chamber plasma enhanced chemical vapor deposition of transparent organic/inorganic multilayer barrier coating at low temperature

    SciTech Connect

    Park, S. M.; Kim, D. J.; Kim, S. I.; Lee, N.-E.

    2008-07-15

    Deposition of organic/inorganic multilayers is usually carried out by two different process steps by two different deposition methods. A single-chamber process for the deposition of multilayer stacks can make the process and deposition system simpler. In this work, SiOCH and plasma-polymerized methylcyclohexane (pp-MCH) films and their multilayer stacks for application to transparent diffusion barrier coatings were deposited in a single low-temperature plasma enhanced chemical vapor deposition reactor using hexamethyldisilazane/N{sub 2}O/O{sub 2}/Ar and methylcyclohexane/Ar mixtures for SiOCH and pp-MCH layers, respectively. The deposition rates of the SiOCH and pp-MCH layers were increased with increasing the N{sub 2}O:O{sub 2} gas flow ratio and rf plasma power, respectively. Oxygen concentration in the SiOCH films was decreased and carbon and hydrogen incorporation was increased when increasing the N{sub 2}O:O{sub 2} gas flow ratio from 0:1 to 3:1. In this work, the water vapor transmission rate of polyester sulfone substrate could be reduced from a level of 50 (bare substrate) to 0.8 g/m{sup 2} day after deposition of a pp-MCH/SiOCH/pp-MCH multilayer coating.

  11. Optimal design of antireflection coating and experimental verification by plasma enhanced chemical vapor deposition in small displays

    SciTech Connect

    Yang, S. M.; Hsieh, Y. C.; Jeng, C. A.

    2009-03-15

    Conventional antireflection coating by thin films of quarter-wavelength thickness is limited by material selections and these films' refractive indices. The optimal design by non-quarter-wavelength thickness is presented in this study. A multilayer thin-film model is developed by the admittance loci to show that the two-layer thin film of SiN{sub x}/SiO{sub y} at 124/87 nm and three layer of SiN{sub x}/SiN{sub y}/SiO{sub z} at 58/84/83 nm can achieve average transmittances of 94.4% and 94.9%, respectively, on polymer, glass, and silicon substrates. The optimal design is validated by plasma enhanced chemical vapor deposition of N{sub 2}O/SiH{sub 4} and NH{sub 3}/SiH{sub 4} to achieve the desired optical constants. Application of the antireflection coating to a 4 in. liquid crystal display demonstrates that the transmittance is over 94%, the mean luminance can be increased by 25%, and the total reflection angle increased from 41 deg. to 58 deg.

  12. Plasma enhanced chemical vapour deposition of silica onto Ti: Analysis of surface chemistry, morphology and functional hydroxyl groups

    PubMed Central

    Szili, Endre J.; Kumar, Sunil; Smart, Roger St. C.; Lowe, Rachel; Saiz, Eduardo; Voelcker, Nicolas H.

    2009-01-01

    Previously, we have developed and characterised a procedure for the deposition of thin silica films by a plasma enhanced chemical vapour deposition (PECVD) procedure using tetraethoxysilane (TEOS) as the main precursor. We have used the silica coatings for improving the corrosion resistance of metals and for enhancing the bioactivity of biomedical metallic implants. Recently, we have been fine-tuning the PECVD method for producing high quality and reproducible PECVD-silica (PECVD-Si) coatings on metals, primarily for biomaterial applications. In order to understand the interaction of the PECVD-Si coatings with biological species (such as proteins and cells), it is important to first analyse the properties of the silica films deposited using the optimised parameters. Therefore, this current investigation was carried out to analyse the characteristic features of PECVD-Si deposited on Ti substrates (PECVD-Si-Ti). We determined that the PECVD-Si coatings on Ti were conformal to the substrate surface, strongly adhered to the underlying substrate and were resistant to delamination. The PECVD-Si surface was composed of stoichiometric SiO2, showed a low carbon content (below 10 at.%) and was very hydrophilic (contact angle <10°). Finally, we also showed that the PECVD-Si coatings contain functional hydroxyl groups. PMID:19809536

  13. Growth of non-polar ZnO thin films with different working pressures by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Chao, Chung-Hua; Wei, Da-Hua

    2014-11-01

    Non-polar coexisting m-plane (10\\bar{1}0) and a-plane (11\\bar{2}0) zinc oxide (ZnO) thin films have been synthesized onto commercial silicon (100) substrates by using plasma enhanced chemical vapor deposition (PECVD) system at different working pressures. The effects of the working pressure on crystal orientation, microstructure, surface morphology, and optical properties of the ZnO thin films were investigated. From the X-ray diffraction patterns, the non-polar ZnO thin films were successfully synthesized at the working pressures of 6 and 9 Torr, respectively. The non-polar ZnO thin films showed stripes-like surface morphology and with smooth surface roughness (˜3.53 nm) was performed by field emission scanning electron microscope (FE-SEM) and atomic force microscope (AFM), respectively. All the ZnO films show a remarkable near-band-edge (NBE) emission peak located at ultraviolet (UV) band accompanying a negligible deep-level (DL) emission at visible region detected by photoluminescence (PL) spectra at room temperature. From the above systematic measurement analysis, indicating the better crystallinity and optical character of ZnO thin film was improved with reducing the working pressure. The wettability of non-polar ZnO thin films was also explored in this presented article.

  14. Growth of high-quality thin-film Ge single crystals by plasma-enhanced chemical vapor deposition

    NASA Technical Reports Server (NTRS)

    Outlaw, R. A.; Hopson, P., Jr.

    1986-01-01

    Thin-film Ge single crystals (approx. 10 microns) have been epitaxially grown on polished NaCl(100) substrates at 450C by using plasma-enhanced chemical vapor deposition. Films on approximately 1 sq cm and larger were separated from the NaCl by either melting the salt or by differential shear stress upon cooling to room temperature. The ordered growth of the Ge was found to be most sensitive to the initial plasma power and to the continuum flow dynamics within the carbon susceptor. The films were visually specular and exhibited a high degree of crysalline order when examined by X-ray diffraction. The films were found to be p-type with a carrier concentration of approximately 3 x 10 to the 16th power/cu cm, a resistivity of 0.11 ohm-cm, and a Hall hole mobility of 1820 sq cm/v/s at room temperature. Vacuum firing minimized the primary contaminant, Na, and corresponding lowered the carrier concentration to 4 x 10 to the 14th power/cu cm.

  15. Effects of ion bombardments on electronic properties of amorphous carbon films grown by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Sugiura, Hirotsugu; Jia, Lingyun; Kondo, Hiroki; Ishikawa, Kenji; Takeda, Keigo; Sekine, Makoto; Hori, Masaru

    2015-09-01

    Amorphous carbon (a-C) films show huge variety of optical and electronic properties, because of a mixture of sp2 and sp3 bonding carbon. Therefore, it's expected to apply a-C films to optical and electrical device applications, such as solar cells. However, there has been no report about a photovoltaic effect in a-C junction solar cells. Growth mechanism and relationship between plasma factors and film properties are not clarified yet. It is important to clear the effect of radicals and ions on their film properties. In this study, a-C films were synthesized by a radical-injection plasma-enhanced chemical vapor deposition at 550 degree C, in which 20 or 250 W VHF powers was applied to capacitively-coupled plasma (CCP). And, RF bias powers were applied to substrates to control the self-bias voltage (VDC) . VDC values were adjusted to 200, 275, and 400V, respectively. As the CCP power increased, optical emission intensity of C2 radicals increased, and G-band peaks became shaper which indicates development of graphitization. With increasing the VDC, optical band gap decreased and conductivity increased. From these results, it was found that formation of sp2 bonds and modification of energy bandgap can be realized by control of ion energy.

  16. Large-area SiC membrane produced by plasma enhanced chemical vapor deposition at relatively high temperature

    SciTech Connect

    Liu, Yu; Xie, Changqing

    2015-09-15

    Advances in the growth of silicon carbide (SiC) thin films with outstanding thermal and mechanical properties have received considerable attention. However, the fabrication of large-area free-standing SiC membrane still remains a challenge. Here, the authors report a plasma enhanced chemical vapor deposition process at a relatively high temperature to improve the free-standing SiC membrane area. A systematic study on the microstructural, mechanical, and optical properties of hydrogenated polycrystalline silicon carbide (poly-SiC{sub x}:H) thin films deposited at 600 °C with different annealing temperatures has been performed. In the as-deposited state, SiC{sub x}:H thin films show a polycrystalline structure. The crystallinity degree can be further improved with the increase of the postdeposition annealing temperature. The resulting process produced free-standing 2-μm-thick SiC membranes up to 70 mm in diameter with root mean square roughness of 3.384 nm and optical transparency of about 70% at 632.8 nm wavelength. The large-area SiC membranes made out of poly-SiC{sub x}:H thin films deposited at a relatively high temperature can be beneficial for a wide variety of applications, such as x-ray diffractive optical elements, optical and mechanical filtering, lithography mask, lightweight space telescopes, etc.

  17. Preparation of cubic boron nitride thin film by the helicon wave plasma enhanced chemical vapor deposition

    SciTech Connect

    Kim, S.; Kim, I.; Kim, K.

    1996-12-01

    Cubic boron nitride ({ital c}-BN) film was deposited on Si(100) substrate using the chemical vapor deposition process assisted by high density plasma of Helicon wave with Borazine (B{sub 3}N{sub 3}H{sub 6}) precursor. It was found that the bombardment of ions with high flux and energy onto the film was necessarily required for synthesizing a {ital c}-BN film. Increasing a negative rf bias on the substrate increased the formation fraction of {ital c}-BN in the film. A nearly pure {ital c}-BN phase was synthesized at the conditions of plasma density in the reactor and rf substrate bias, above 10{sup 11} cm{sup {minus}3} and {minus}350 V, respectively. The phase identification of BN film was carried out by the transmission electron microscopy as well as Fourier transformed infrared spectroscopy. The infrared spectra for {ital c}-BN film synthesized at the rf bias of {minus}350 V appeared at 1093 cm{sup {minus}1} with a strong single peak, which is close to a value for the characteristic vibration mode of bulk {ital c}-BN (1065 cm{sup {minus}1}). The {ital c}-BN in the film was also confirmed and found to be a fine poly-crystalline with the grain sizes ranging from 200 to 400 A. {copyright} {ital 1996 American Institute of Physics.}

  18. Microwave-assisted Chemical Transformations

    EPA Science Inventory

    In recent years, there has been a considerable interest in developing sustainable chemistries utilizing green chemistry principles. Since the first published report in 1986 by Gedye and Giguere on microwave assisted synthesis in household microwave ovens, the use of microwaves as...

  19. Compositional study of silicon oxynitride thin films deposited using electron cyclotron resonance plasma-enhanced chemical vapor deposition technique

    SciTech Connect

    Baumann, H.; Sah, R.E.

    2005-05-01

    We have used backscattering spectrometry and {sup 15}N({sup 1}H,{alpha},{gamma}){sup 12}C nuclear reaction analysis techniques to study in detail the variation in the composition of silicon oxynitride films with deposition parameters. The films were deposited using 2.45 GHz electron cyclotron resonance plasma-enhanced chemical vapor deposition (PECVD) technique from mixtures of precursors argon, nitrous oxide, and silane at deposition temperature 90 deg. C. The deposition pressure and nitrous oxide-to-silane gas flow rates ratio have been found to have a pronounced influence on the composition of the films. When the deposition pressure was varied for a given nitrous oxide-to-silane gas flow ratio, the amount of silicon and nitrogen increased with the deposition pressure, while the amount of oxygen decreased. For a given deposition pressure, the amount of incorporated nitrogen and hydrogen decreased while that of oxygen increased with increasing nitrous oxide-to-silane gas flow rates ratio. For nitrous oxide-to-silane gas flow ratio of 5, we obtained films which contained neither chemically bonded nor nonbonded nitrogen atoms as revealed by the results of infrared spectroscopy, backscattering spectrometry, and nuclear reaction analysis. Our results demonstrate the nitrogen-free nearly stoichiometric silicon dioxide films can be prepared from a mixture of precursors argon, nitrous oxide, and silane at low substrate temperature using high-density PECVD technique. This avoids the use of a hazardous and an often forbidden pair of silane and oxygen gases in a plasma reactor.

  20. Characteristics of ultra low-k nanoporous and fluorinated silica based films prepared by plasma enhanced chemical vapor deposition

    SciTech Connect

    Abbasi-Firouzjah, M.; Shokri, B.

    2013-12-07

    Low dielectric constant (low-k) silica based films were deposited on p-type silicon and polycarbonate substrates by radio frequency (RF) plasma enhanced chemical vapor deposition method at low temperature. A mixture of tetraethoxysilane vapor, oxygen, and tetrafluoromethane (CF{sub 4}) was used for the deposition of the films in forms of two structures called as SiO{sub x}C{sub y} and SiO{sub x}C{sub y}F{sub z}. Properties of the films were controlled by amount of porosity and fluorine content in the film matrix. The influence of RF power and CF{sub 4} flow on the elemental composition, deposition rate, surface roughness, leakage current, refractive index, and dielectric constant of the films were characterized. Moreover, optical emission spectroscopy was applied to monitor the plasma process at the different parameters. Electrical characteristics of SiO{sub x}C{sub y} and SiO{sub x}C{sub y}F{sub z} films with metal-oxide-semiconductor structure were investigated using current-voltage analysis to measure the leakage current and breakdown field, as well as capacitance-voltage analysis to obtain the film's dielectric constant. The results revealed that SiO{sub x}C{sub y} films, which are deposited at lower RF power produce more leakage current, meanwhile the dielectric constant and refractive index of these films decreased mainly due to the more porosity in the film structure. By adding CF{sub 4} in the deposition process, fluorine, the most electronegative and the least polarized atom, doped into the silica film and led to decrease in the refractive index and the dielectric constant. In addition, no breakdown field was observed in the electrical characteristics of SiO{sub x}C{sub y}F{sub z} films and the leakage current of these films reduced by increment of the CF{sub 4} flow.

  1. Characteristics of ultra low-k nanoporous and fluorinated silica based films prepared by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Abbasi-Firouzjah, M.; Shokri, B.

    2013-12-01

    Low dielectric constant (low-k) silica based films were deposited on p-type silicon and polycarbonate substrates by radio frequency (RF) plasma enhanced chemical vapor deposition method at low temperature. A mixture of tetraethoxysilane vapor, oxygen, and tetrafluoromethane (CF4) was used for the deposition of the films in forms of two structures called as SiOxCy and SiOxCyFz. Properties of the films were controlled by amount of porosity and fluorine content in the film matrix. The influence of RF power and CF4 flow on the elemental composition, deposition rate, surface roughness, leakage current, refractive index, and dielectric constant of the films were characterized. Moreover, optical emission spectroscopy was applied to monitor the plasma process at the different parameters. Electrical characteristics of SiOxCy and SiOxCyFz films with metal-oxide-semiconductor structure were investigated using current-voltage analysis to measure the leakage current and breakdown field, as well as capacitance-voltage analysis to obtain the film's dielectric constant. The results revealed that SiOxCy films, which are deposited at lower RF power produce more leakage current, meanwhile the dielectric constant and refractive index of these films decreased mainly due to the more porosity in the film structure. By adding CF4 in the deposition process, fluorine, the most electronegative and the least polarized atom, doped into the silica film and led to decrease in the refractive index and the dielectric constant. In addition, no breakdown field was observed in the electrical characteristics of SiOxCyFz films and the leakage current of these films reduced by increment of the CF4 flow.

  2. In situ growth of YBa sub 2 Cu sub 3 O sub 7 minus x high Tc superconducting thin films directly on sapphire by plasma-enhanced metalorganic chemical vapor deposition

    SciTech Connect

    Chern, C.S.; Zhao, J.; Li, Y.Q.; Norris, P.; Kear, B.; Gallois, B. )

    1990-08-13

    Highly {ital c}-axis oriented YBa{sub 2}Cu{sub 3}O{sub 7{minus}{ital x}} superconducting thin films have been, {ital in} {ital situ}, deposited directly on sapphire substrate by a remote microwave plasma-enhanced metalorganic chemical vapor deposition process (PE-MOCVD). The films were deposited at a substrate temperature of 730 {degree}C followed by a fast cooling. The as-deposited films show attainment of zero resistance at 82 K and have critical current density of 10{sup 4} A/cm{sup 2} at 70 K. ac susceptibility measurement indicated that the films contain a single superconducting phase. PE-MOCVD was carried out in a commercial-scale MOCVD reactor with capability of uniform deposition over 100 cm{sup 2} per growth run.

  3. Copper-induced dielectric breakdown in silicon oxide deposited by plasma-enhanced chemical vapor deposition using trimethoxysilane

    NASA Astrophysics Data System (ADS)

    Takeda, Ken-ichi; Ryuzaki, Daisuke; Mine, Toshiyuki; Hinode, Kenji; Yoneyama, Ryo

    2003-08-01

    The barrier mechanism against copper-ion diffusion in silicon-oxide films deposited by plasma-enhanced chemical vapor deposition (PECVD) using trimethoxysilane (TMS) and nitrous oxide (N2O) chemistry (PE-TMS oxide) was studied. It was found that the flow ratio of TMS gas to N2O gas during deposition strongly affects a time-dependent dielectric-breakdown lifetime of PE-TMS oxide with a copper electrode as well as other PE-TMS oxide film properties such as electrical properties (leakage current and dielectric constant), a physical property (atomic composition), and chemical properties (chemical bonding states and wet-etching rate). The dielectric-breakdown lifetime of PE-TMS oxide film with a copper anode is a maximum at a source-gas ratio ranging from 1.7% to 3.3%. On the other hand, leakage current density, wet-etch rate, and dielectric-breakdown lifetime of PE-TMS oxide film with an aluminum electrode are degraded by increasing the source-gas flow ratio (0.83% to 12%). These results suggest that two types of degradation mode exist in the dielectric breakdown of PE-TMS oxide with a copper electrode. Namely, at low flow ratio (<1.7%), copper-induced degradation is dominant, but at high flow ratio (>3.3%), the dielectric degradation is probably not caused by copper contamination but by low-quality dielectric material. The dielectric-breakdown lifetimes of a PE-TMS oxide film (flow ratio: 3.3%) with a copper anode show an Arrhenius-type temperature dependence. That is, the activation energy of the dielectric-breakdown lifetime depends on the applied electric field and decreases from 1.8 to 0.55 eV when the applied field is increased from 0 to 5 MV/cm. As a simple kinetic model of the copper injection reaction at the anode surface, a thermally activated reaction process between two energy states—copper atom state on the anode surface and copper ion state in the dielectric material—is proposed.

  4. Microwave assisted chemical vapor infiltration

    SciTech Connect

    Devlin, D.J.

    1993-12-31

    The purpose of this program is to develop a new process for the fabrication of ceramic matrix composites by chemical vapor infiltration. This period has been devoted in part to the exploration of material systems suitable for MACVI processing. A number of potential processing schemes are possible using combinations of absorbing and transparent material as composite components. This includes the use of an absorbing preform (nicalon fiber) combined with a transparent matrix (silicon nitride). Composites 5 cm in diameter by 1 cm. thick have been fabricated to densities of 65% theoretical. Processing times for these materials are under 20 hours. Higher densities will require additional microwave power now possible with the new reactor. The most effective MACVI scheme will involve the use of a transparent fiber with an absorbing matrix. The hot spot will be initiated by appropriate treatment of the central region of the preform. To this end alumna fibers with pretreatments to control thermal gradients has been explored. Nextel 610 fibers have been effectively pretreated carbon coating resulting in preferential heating in the interior of the preform. Possible matrix materials include siliconized silicon carbide, doped silicon carbide, alumna and zirconia. A patent for MACVI has been issued 10/19/93.

  5. Reduced chemical warfare agent sorption in polyurethane-painted surfaces via plasma-enhanced chemical vapor deposition of perfluoroalkanes.

    PubMed

    Gordon, Wesley O; Peterson, Gregory W; Durke, Erin M

    2015-04-01

    Perfluoralkalation via plasma chemical vapor deposition has been used to improve hydrophobicity of surfaces. We have investigated this technique to improve the resistance of commercial polyurethane coatings to chemicals, such as chemical warfare agents. The reported results indicate the surface treatment minimizes the spread of agent droplets and the sorption of agent into the coating. The improvement in resistance is likely due to reduction of the coating's surface free energy via fluorine incorporation, but may also have contributing effects from surface morphology changes. The data indicates that plasma-based surface modifications may have utility in improving chemical resistance of commercial coatings. PMID:25775244

  6. Low-temperature synthesis of diamond films by photoemission-assisted plasma-enhanced chemical vapor deposition

    SciTech Connect

    Kawata, Mayuri Ojiro, Yoshihiro; Ogawa, Shuichi; Takakuwa, Yuji; Masuzawa, Tomoaki; Okano, Ken

    2014-03-15

    Photoemission-assisted plasma-enhanced chemical vapor deposition (PA-PECVD), a process in which photoelectrons emitted from a substrate irradiated with ultraviolet light are utilized as a trigger for DC discharge, was investigated in this study; specifically, the DC discharge characteristics of PA-PECVD were examined for an Si substrate deposited in advance through hot-filament chemical vapor deposition with a nitrogen-doped diamond layer of thickness ∼1 μm. Using a commercially available Xe excimer lamp (hν = 7.2 eV) to illuminate the diamond surface with and without hydrogen termination, the photocurrents were found to be 3.17 × 10{sup 12} and 2.11 × 10{sup 11} electrons/cm{sup 2}/s, respectively. The 15-fold increase in photocurrent was ascribed to negative electron affinity (NEA) caused by hydrogen termination on the diamond surfaces. The DC discharge characteristics revealed that a transition bias voltage from a Townsend-to-glow discharge was considerably decreased because of NEA (from 490 to 373 V for H{sub 2} gas and from 330 to 200 V for Ar gas), enabling a reduction in electric power consumption needed to synthesize diamond films through PA-PECVD. In fact, the authors have succeeded in growing high-quality diamond films of area 2.0 cm{sup 2} at 540 °C with a discharge power of only 1.8 W, plasma voltage of 156.4 V, and discharge current of 11.7 mA under the glow discharge of CH{sub 4}/H{sub 2}/Ar mixed gases. In addition to having only negligible amounts of graphite and amorphous carbon, the diamond films exhibit a relatively high diamond growth rate of 0.5 μm/h at temperatures as low as 540 °C, which is attributed to Ar{sup +} ions impinging on the diamond surface, and causing the removal of hydrogen atoms from the surface through sputtering. This process leads to enhanced CH{sub x} radical adsorption, because the sample was applied with a negative potential to accelerate photoelectrons in PA-PECVD.

  7. Characteristic Study of Boron Doped Carbon Nanowalls Films Deposited by Microwave Plasma Enhanced Chemical Vapor Deposition.

    PubMed

    Lu, Chunyuan; Dong, Qi; Tulugan, Kelimu; Park, Yeong Min; More, Mahendra A; Kim, Jaeho; Kim, Tae Gyu

    2016-02-01

    In this research, catalyst-free vertically aligned boron doped carbon nanowalls films were fabricated on silicon (100) substrates by MPECVD using feeding gases CH4, H2 and B2H6 (diluted with H2 to 5% vol) as precursors. The substrates were pre-seeded with nanodiamond colloid. The fabricated CNWs films were characterized by Scanning Electron Microscopy (SEM) and Raman Spectroscopy. The data obtained from SEM confirms that the CNWs films have different density and wall thickness. From Raman spectrum, a G peak around 1588 cm(-1) and a D band peak at 1362 cm(-1) were observed, which indicates a successful fabrication of CNWs films. The EDX spectrum of boron doped CNWs film shows the existence of boron and carbon. Furthermore, field emission properties of boron doped carbon nanowalls films were measured and field enhancement factor was calculated using Fowler-Nordheim plot. The result indicates that boron doped CNWs films could be potential electron emitting materials. PMID:27433646

  8. EFFICIENT CHEMICAL SYNTHESIS USING MICROWAVES

    EPA Science Inventory

    Synthetic organic transformations performed under non-traditional conditions are becoming popular primarily to circumvent the growing environmental concerns. A solvent-free approach that involves microwave (MW) exposure of neat reactants catalyzed by the surfaces of less-expensiv...

  9. Ultralow k films by using a plasma-enhanced chemical vapor deposition porogen approach: Study of the precursor reaction mechanisms

    SciTech Connect

    Castex, A.; Jousseaume, V.; Deval, J.; Bruat, J.; Favennec, L.; Passemard, G.

    2008-09-15

    As interconnects are scaled down, much effort is made to achieve ultralow k material with a dielectric constant lower than 2.5. Thus, many new precursors are investigated in plasma-enhanced chemical vapor deposition. This is particularly true with the porogen approach where two molecules are used: an organosilicon to create the silicon matrix and an organic molecule 'porogen' that creates material porosity during a post-treatment such as annealing. In this article, the influence of the organosilicon molecular structure is investigated. Two 'matrix precursors' with different structures are therefore compared. The first one, referred to as D5, has a ring structure (decamethyl pentacyclosiloxane); the second one, referred to as DEOMS, has a star structure (diethoxymethyl silane). The porogen organic molecule, referred to as CHO, is cyclohexen oxide. The fragmentation paths of the precursor molecules in the plasma are investigated by quadrupole mass spectroscopy and the film structure is studied by Fourier transform infrared spectroscopy. The mass spectroscopy analysis shows that the fragmentation in plasma is highest for DEOMS, intermediate for CHO, and lowest for D5 in comparable process conditions. At the maximum plasma power setting, the loss rate, which yields molecule consumption, is 43%-81% for the D5-CHO mixture, respectively, and 73%-37% for the DEOMS-CHO mixture, respectively. This is related to higher bond-dissociation energy for the siloxane (Si-O-Si) link in D5 than silane (Si-H), silylethoxyde (Si-OC{sub 2}H{sub 5}) in DEOMS, or C-C and epoxy cycle in CHO. Indeed, a higher electron-energy relative threshold for dissociation under electron impact is measured for D5 (around 7 eV) than for DEOMS and CHO (around 4 eV). Moreover, the fragment structures differ from one precursor to another. Methyl groups are abstracted from D5 and a few polysiloxane chains are produced from pentacycle opening and fragmentation. In the case of DEOMS, many single silicon

  10. Modeling and experimental study on the growth of silicon germanium film by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Zhao, Lai

    Hydrogenated microcrystalline silicon germanium µc-SiGe:H deposited by plasma enhanced chemical vapor deposition (PECVD) is of great interest to photovoltaic (PV) applications due to its low process temperature and good uniformity over large area. The nature of high optical absorption and low optical bandgap makes it promising as the bottom cell absorbing layer for tandem junction solar cells. However, the addition of germane (GeH4) gas changes deposited film properties and makes it rather complicated for the established silane (SiH4) based discharge process with hydrogen (H2) dilution. Despite existing experimental studies for SiH 4/GeH4/H2 3-gas mixture discharge and comprehensive numerical simulations for SiH4/H2 or SiH4/Ar plasma, to the author's best knowledge, a numerical model for both SiH 4 and GeH4 in a high pressure regime is yet to be developed. The plasma discharge, the film growth and their effects on film properties and the solar device performance need deep understanding. In this dissertation, the growth of the µc-SiGe:H film by radio frequency (RF) PECVD is studied through modeling simulation as well as experiments. The first numerical model for the glow discharge of SiH4/GeH 4/H2 3-gas mixture in a high pressure regime is developed based on one dimensional fluid model. Transports of electrons, molecules, radicals and ions in the RF excitation are described by diffusion equations that are coupled with the Poisson's equation. The deposition is integrated as the boundary conditions for discharge equations through the sticking coefficient model. Neutral ionizations, radical dissociations and chemical reactions in the gas phase and surface kinetics such as the diffusive motion, chemical reactions and the hydrogen etching are included with interaction rate constants. Solved with an explicit central-difference discretization scheme, the model simulates mathematical features that reflect the plasma physics such as the plasma sheath and gas species

  11. GREENER CHEMICAL SYNTHESIS USING MICROWAVES

    EPA Science Inventory

    A solvent-free approach that involves microwave (MW) exposure of neat reactants (undiluted) catalyzed by the surfaces of recyclable mineral supports such as alumina, silica, clay, or "doped" surfaces is presented which is applicable to a wide range of cleavage, condensation, cyc...

  12. Mechanical and piezoresistive properties of thin silicon films deposited by plasma-enhanced chemical vapor deposition and hot-wire chemical vapor deposition at low substrate temperatures

    NASA Astrophysics Data System (ADS)

    Gaspar, J.; Gualdino, A.; Lemke, B.; Paul, O.; Chu, V.; Conde, J. P.

    2012-07-01

    This paper reports on the mechanical and piezoresistance characterization of hydrogenated amorphous and nanocrystalline silicon thin films deposited by hot-wire chemical vapor deposition (HWCVD) and radio-frequency plasma-enhanced chemical vapor deposition (PECVD) using substrate temperatures between 100 and 250 °C. The microtensile technique is used to determine film properties such as Young's modulus, fracture strength and Weibull parameters, and linear and quadratic piezoresistance coefficients obtained at large applied stresses. The 95%-confidence interval for the elastic constant of the films characterized, 85.9 ± 0.3 GPa, does not depend significantly on the deposition method or on film structure. In contrast, mean fracture strength values range between 256 ± 8 MPa and 600 ± 32 MPa: nanocrystalline layers are slightly stronger than their amorphous counterparts and a pronounced increase in strength is observed for films deposited using HWCVD when compared to those grown by PECVD. Extracted Weibull moduli are below 10. In terms of piezoresistance, n-doped radio-frequency nanocrystalline silicon films deposited at 250 °C present longitudinal piezoresistive coefficients as large as -(2.57 ± 0.03) × 10-10 Pa-1 with marginally nonlinear response. Such values approach those of crystalline silicon and of polysilicon layers deposited at much higher temperatures.

  13. Microwave-enhanced chemical processes

    DOEpatents

    Varma, Ravi

    1990-01-01

    A process for disposal of toxic wastes including chlorinated hydrocarbons, comprising, establishing a bed of non-metallic particulates having a high dielectric loss factor. Effecting intimate contact of the particulates and the toxic wastes at a temperature in excess of about 400.degree. C. in the presence of microwave radiation for a time sufficient to break the hydrocarbon chlorine bonds and provide detoxification values in excess of 80 and further detoxifying the bed followed by additional disposal of toxic wastes.

  14. Hydrogen-Free Plasma-Enhanced Chemical Vapor Deposition of Silicon Dioxide Using Tetra-isocyanate-silane (Si(NCO) 4)

    NASA Astrophysics Data System (ADS)

    Idris, Irman; Sugiura, Osamu

    1995-06-01

    Deposition of silicon dioxide by plasma-enhanced chemical vapor deposition (PECVD) technique using tetra-isocyanate-silane (Si(NCO)4 : TICS) and oxygen for interlayer dielectric film application is proposed. Film properties strongly depend on the gas composition. The film which was deposited under an oxygen-rich condition was water-free after deposition. The film density, refractive index, resistivity, and dielectric constant were 2.3 g/cm3, 1.46, 5×1014 Ω·cm, and 3.6, respectively. The etch rate by buffered HF was 330 nm/min.

  15. Development of open air silicon deposition technology by silane-free atmospheric pressure plasma enhanced chemical transport under local ambient gas control

    NASA Astrophysics Data System (ADS)

    Naito, Teruki; Konno, Nobuaki; Yoshida, Yukihisa

    2016-07-01

    Open air silicon deposition was performed by combining silane-free atmospheric pressure plasma-enhanced chemical transport and a newly developed local ambient gas control technology. The effect of air contamination on silicon deposition was investigated using a vacuum chamber, and the allowable air contamination level was confirmed to be 3 ppm. The capability of the local ambient gas control head was investigated numerically and experimentally. A safe and clean process environment with air contamination less than 1 ppm was achieved. Combining these technologies, a microcrystalline silicon film was deposited in open air, the properties of which were comparable to those of silicon films deposited in a vacuum chamber.

  16. Influence of density on N-H bond stretch vibration in plasma enhanced chemical vapor deposited SiN{sub x}:H

    SciTech Connect

    Dekkers, H. F. W.; Pourtois, G.; Srinivasan, Nagendra Babu

    2010-01-04

    The infrared absorption of hydrogenated silicon nitride (SiN{sub x}:H) films provides information about the average configuration of covalent bonds in the film. In plasma enhanced chemical vapor deposited SiN{sub x}:H, the absorption spectrum of the N-H bonds shows both a systematic shift and a tailing toward lower frequency with the increase in the film density. First-principles computations of N-H vibrations show an increased degree of anharmonicity when the H site is weakly interacting with a second neighboring N atom. This interaction becomes more pronounced in films with higher density, which consequently shifts the vibrational spectrum down.

  17. Microwave-enhanced chemical processes

    DOEpatents

    Varma, R.

    1990-06-19

    A process is disclosed for the disposal of toxic wastes including chlorinated hydrocarbons, comprising, establishing a bed of non-metallic particulates having a high dielectric loss factor. Intimate contact of the particulates and the toxic wastes at a temperature in excess of about 400 C in the presence of microwave radiation for a time sufficient breaks the hydrocarbon chlorine bonds. Detoxification values in excess of 80 are provided and further detoxification of the bed is followed by additional disposal of toxic wastes. 1 figure.

  18. CHEMICAL SYNTHESES IN AQUEOUS MEDIA USING MICROWAVES

    EPA Science Inventory

    The development of efficient, selective and eco-friendly synthetic methods has remained a major focus of our research group. Microwave (MW) irradiation as alternative energy source in conjunction with water as reaction media has proven to be a successful 'greener' chemical appro...

  19. ‘GREENER’ CHEMICAL SYNTHESES USING MICROWAVES

    EPA Science Inventory

    The diverse nature of chemical entities requires various green strategic pathways in our quest towards attaining sustainability. A solvent-free approach that involves microwave (MW) exposure of neat reactants (undiluted) catalyzed by the surfaces of less-expensive and recyclable ...

  20. Microwave Technology--Applications in Chemical Synthesis

    EPA Science Inventory

    Microwave heating, being specific and instantaneous, is unique and has found a place for expeditious chemical syntheses. Specifically, the solvent-free reactions are convenient to perform and have advantages over the conventional heating protocols as summarized in the previous se...

  1. Physical/chemical properties of tin oxide thin film transistors prepared using plasma-enhanced atomic layer deposition

    SciTech Connect

    Lee, Byung Kook; Jung, Eunae; Kim, Seok Hwan; Moon, Dae Chul; Lee, Sun Sook; Park, Bo Keun; Hwang, Jin Ha; Chung, Taek-Mo; Kim, Chang Gyoun; An, Ki-Seok

    2012-10-15

    Thin film transistors (TFTs) with tin oxide films as the channel layer were fabricated by means of plasma enhanced atomic layer deposition (PE-ALD). The as-deposited tin oxide films show n-type conductivity and a nano-crystalline structure of SnO{sub 2}. Notwithstanding the relatively low deposition temperatures of 70, 100, and 130 °C, the bottom gate tin oxide TFTs show an on/off drain current ratio of 10{sup 6} while the device mobility values were increased from 2.31 cm{sup 2}/V s to 6.24 cm{sup 2}/V s upon increasing the deposition temperature of the tin oxide films.

  2. Remote plasma enhanced chemical vapor deposition of fluorinated silicon oxide films using 1,2bis(methyldifluorosilyl)ethane and triethoxyfluorosilane

    NASA Astrophysics Data System (ADS)

    Jin, Zhongping

    2005-07-01

    The deposition characteristics of fluorinated silicon dioxide (SiO xFy) films using two fluorine-containing precursors, 1,2bis(methyldifluorosilyl)ethane (FASi-4) and triethoxyfluorosilane (FTES) were investigated in a custom-built remote microwave plasma enhanced chemical vapor deposition (PECVD) micro-reactor system. These studies were motivated by the finding that incorporation of fluorine in the oxide films reduces the dielectric permittivity of the films. Statistically-designed experiments were performed to identify significant independent parameters and their interactions, and to determine preferred operating windows; subsequent one factor at a time experiments were performed to better understand the effects of important single variables. Complementary film characterization methods including Rutherford Backscattering Spectroscopy (RBS), Fourier transform infrared transmission spectroscopy (FTIR), and scanning electron microscopy (SEM) were used to investigate and quantify film physical, chemical and electrical properties. Arrhenius-type plots for the dependence of the deposition rate on substrate inverse temperature show that the FASi-4 sourced process is mildly activated with an apparent activation energy of 0.17 eV at a pressure of 0.4 Torr and 0.05 eV at a pressure of 0.1 Torr. Single factor experiments indicate that the deposition rates exhibit maxima at 0.1 Torr and 0.31 Torr for FASi-4 and FTES, respectively. The deposition rate maxima occur at lower pressures than the corresponding maximum observed for PETEOS deposition (˜0.6 Torr). Deposition rate maxima were also observed as a function of oxygen to source gas flow ratio. The deposition rate maximizes at 108 A/min with an oxygen: FTES flow ratio of 12:1. The deposition rate with TEOS, on the other hand, maximizes at over 400 A/min at an oxygen: TEOS flow ratio of 3:1. RBS data indicate that decreasing O2:FASi-4 ratio from 15:1 to 8:1 increases the fluorine content in the deposited fluorinated silicon

  3. Effect of gas residence time on near-edge X-ray absorption fine structures of hydrogenated amorphous carbon films grown by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Jia, Lingyun; Sugiura, Hirotsugu; Kondo, Hiroki; Takeda, Keigo; Ishikawa, Kenji; Oda, Osamu; Sekine, Makoto; Hiramatsu, Mineo; Hori, Masaru

    2016-04-01

    In hydrogenated amorphous carbon films, deposited using a radical-injection plasma-enhanced chemical vapor deposition system, the chemical bonding structure was analyzed by near-edge X-ray absorption fine-structure spectroscopy. With a change in the residence times of source gases in a reactor, whereby total gas flow rates of H2/CH4 increased from 50 to 400 sccm, sp2-C fractions showed the minimum value at 150 sccm, while H concentration negligibly changed according to the results of secondary ion mass spectroscopy. On the other hand, widths of σ* C-C peaks increased with decreasing gas residence time, which indicates an increase in the fluctuation of bonding structures.

  4. Impact of the etching gas on vertically oriented single wall and few walled carbon nanotubes by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Gohier, A.; Minea, T. M.; Djouadi, M. A.; Granier, A.

    2007-03-01

    Vertically oriented single wall nanotubes (SWNTs) and few walled nanotubes (FWNTs) have been grown by electronic cyclotron resonance plasma enhanced chemical vapor deposition (PECVD) on silica flat substrates. The impact of the plasma parameters on SWNT and FWNT growth has been investigated using two different etching gas mixtures, namely, C2H2/NH3 and C2H2/H2 with various ratios and applied bias voltages. Kinetic studies are also proposed in order to describe the FWNT growth mechanism by plasma techniques. A key role played by the reactive gas (NH3 and H2) is observed in the PECVD process, contrary to multiwalled nanotube growth. It is demonstrated that the balance between FWNT growth versus FWNT etching can be widely modulated by varying the gas mixture and bias voltage. It is shown that the use of hydrogen for hydrocarbon gas dilution restricts the destruction of SWNT and FWNT by the plasma species (ions and radicals).

  5. Thin film transistors using preferentially grown semiconducting single-walled carbon nanotube networks by water-assisted plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Kim, Un Jeong; Lee, Eun Hong; Kim, Jong Min; Min, Yo-Sep; Kim, Eunseong; Park, Wanjun

    2009-07-01

    Nearly perfect semiconducting single-walled carbon nanotube random network thin film transistors were fabricated and their reproducible transport properties were investigated. The networked single-walled carbon nanotubes were directly grown by water-assisted plasma-enhanced chemical vapor deposition. Optical analysis confirmed that the nanotubes were mostly semiconductors without clear metallic resonances in both the Raman and the UV-vis-IR spectroscopy. The transistors made by the nanotube networks whose density was much larger than the percolation threshold also showed no metallic paths. Estimation based on the conductance change of semiconducting nanotubes in the SWNT network due to applied gate voltage difference (conductance difference for on and off state) indicated a preferential growth of semiconducting nanotubes with an advantage of water-assisted PECVD. The nanotube transistors showed 10-5 of on/off ratio and ~8 cm2 V-1 s-1 of field effect mobility.

  6. Thin film transistors using preferentially grown semiconducting single-walled carbon nanotube networks by water-assisted plasma-enhanced chemical vapor deposition.

    PubMed

    Kim, Un Jeong; Lee, Eun Hong; Kim, Jong Min; Min, Yo-Sep; Kim, Eunseong; Park, Wanjun

    2009-07-22

    Nearly perfect semiconducting single-walled carbon nanotube random network thin film transistors were fabricated and their reproducible transport properties were investigated. The networked single-walled carbon nanotubes were directly grown by water-assisted plasma-enhanced chemical vapor deposition. Optical analysis confirmed that the nanotubes were mostly semiconductors without clear metallic resonances in both the Raman and the UV-vis-IR spectroscopy. The transistors made by the nanotube networks whose density was much larger than the percolation threshold also showed no metallic paths. Estimation based on the conductance change of semiconducting nanotubes in the SWNT network due to applied gate voltage difference (conductance difference for on and off state) indicated a preferential growth of semiconducting nanotubes with an advantage of water-assisted PECVD. The nanotube transistors showed 10(-5) of on/off ratio and approximately 8 cm2 V(-1) s(-1) of field effect mobility. PMID:19567966

  7. Plasma enhanced chemical vapor deposition of wear resistant gradual a-Si1-x:Cx:H coatings on nickel-titanium for biomedical applications

    NASA Astrophysics Data System (ADS)

    Niermann, Benedikt; Böke, Marc; Schauer, Janine-Christina; Winter, Jörg

    2010-03-01

    Plasma enhanced chemical vapor deposition has been used to deposit thin films with gradual transitions from silicon to carbon on Cu, Ni, stainless steel, and NiTi. Thus show low stress, elasticity, and wear resistance with excellent adhesion on all metals under investigation. Already at low Si concentrations of 10 at. % the intrinsic stress is considerably reduced compared to pure diamondlike carbon (DLC) films. The deposition process is controlled by optical emission spectroscopy. This technique has been applied to monitor the growth precursors and to correlate them with the film composition. The compositions of the films were determined by Rutherford backscattering spectroscopy and XPS measurements. Due to the elastic properties of the gradual transition and the excellent biocompatibility of DLC, the described film systems present a useful coating for biomedical applications.

  8. Study on effects of substrate temperature on growth and structure of alignment carbon nanotubes in plasma-enhanced hot filament chemical vapor deposition system

    NASA Astrophysics Data System (ADS)

    Dang, Chun; Wang, Tingzhi

    2006-11-01

    Alignment carbon nanotubes (ACNTs) were synthesized on silicon substrate coated with Ni catalyst film and Ta buffer layer by plasma-enhanced hot filament chemical vapor deposition using CH 4, NH 3, and H 2 as the reaction gas, and they were investigated by scanning electron microscopy and transmission electron microscopy. It is found that the diameter of the bamboo-structured ACNTs is increased from 62 to 177 nm when the substrate temperature was changed from 626 to 756 °C. Their growth rate is enhanced by the substrate temperature in a range of 626-683 °C and it is reversely reduced with the substrate temperature after the substrate temperature is over 683 °C. Beginning with wetting phenomenon, the effects of the substrate temperature on the structure and growth rate of the ACNTs are analyzed.

  9. Ellipsometric and Rutherford Back scattering Spectrometry studies of SiO(X)N(Y) films elaborated by plasma-enhanced chemical vapour deposition technique.

    PubMed

    Mahamdi, R; Boulesbaa, M; Saci, L; Mansour, F; Molliet, C; Collet, M; Temple-Boyer, P

    2011-10-01

    Silicon oxynitride (SiO(X)N(Y)) thin films were deposited by plasma-enhanced chemical vapour deposition technique (PECVD) from silane (SiH4), nitrous oxide (N2O), ammonia (NH3) and nitrogen (N2) mixture. Spectroscopic ellipsometry (SE), in the range of wavelengths 450-900 nm, was used to define the film thickness and therefore the deposition rate, as well as the refractive index as a function of the N2O gaseous flow. While considering the (Si3N4, SiO2, H2 or void) heterogeneous mixture, Maxwell Garnett (MG) theory allows to fit the SE measurements and to define the volume fraction of the different phases. Finally, Rutherford Backscattering Spectrometry (RBS) results showed that x = O/Si ratio increases gradually with increasing the N2O flow, allowing the correlation of the SiO(X)N(Y) films main parameters. PMID:22400311

  10. Characterization of TiO x film prepared by plasma enhanced chemical vapor deposition using a multi-jet hollow cathode plasma source

    NASA Astrophysics Data System (ADS)

    Nakamura, Masatoshi; Korzec, Dariusz; Aoki, Toru; Engemann, Jurgen; Hatanaka, Yoshinori

    2001-05-01

    The high rate deposition of TiO x film at low temperature was achieved by plasma enhanced chemical vapor deposition (PECVD) using titanium tetraisopropoxide (TTIP) as a source material. The multi-jet hollow cathode plasma source was used to generate the high-density plasma, which was showered toward the substrate. The emission spectra suggest that oxygen radicals play an important role for dissociation of the source material and for yielding the precursors. The high deposition rate up to 50 nm/min was achieved by this process. The as-deposited films are completely amorphous. They consist of structures with complex bondings including both tetrahedral and octahedral components. Though they have such complex bondings, the hydrophilicity of the PECVD film is excellent comparing to that of the annealed crystalline anatase structure. It seems that the PECVD using the multi-jet plasma source is promising for fabrication of hydrophilic TiO x films in low-temperature process.

  11. Preparation of Aligned Ultra-long and Diameter-controlled Silicon Oxide Nanotubes by Plasma Enhanced Chemical Vapor Deposition Using Electrospun PVP Nanofiber Template

    NASA Astrophysics Data System (ADS)

    Zhou, Ming; Zhou, Jinyuan; Li, Ruishan; Xie, Erqing

    2010-02-01

    Well-aligned and suspended polyvinyl pyrrolidone (PVP) nanofibers with 8 mm in length were obtained by electrospinning. Using the aligned suspended PVP nanofibers array as template, aligned ultra-long silicon oxide (SiO x) nanotubes with very high aspect ratios have been prepared by plasma-enhanced chemical vapor deposition (PECVD) process. The inner diameter (20-200 nm) and wall thickness (12-90 nm) of tubes were controlled, respectively, by baking the electrospun nanofibers and by coating time without sacrificing the orientation degree and the length of arrays. The micro-PL spectrum of SiO x nanotubes shows a strong blue-green emission with a peak at about 514 nm accompanied by two shoulders around 415 and 624 nm. The blue-green emission is caused by the defects in the nanotubes.

  12. Copper-Assisted Direct Growth of Vertical Graphene Nanosheets on Glass Substrates by Low-Temperature Plasma-Enhanced Chemical Vapour Deposition Process

    NASA Astrophysics Data System (ADS)

    Ma, Yifei; Jang, Haegyu; Kim, Sun Jung; Pang, Changhyun; Chae, Heeyeop

    2015-08-01

    Vertical graphene (VG) nanosheets are directly grown below 500 °C on glass substrates by a one-step copper-assisted plasma-enhanced chemical vapour deposition (PECVD) process. A piece of copper foil is located around a glass substrate as a catalyst in the process. The effect of the copper catalyst on the vertical graphene is evaluated in terms of film morphology, growth rate, carbon density in the plasma and film resistance. The growth rate of the vertical graphene is enhanced by a factor of 5.6 with the copper catalyst with denser vertical graphene. The analysis of optical emission spectra suggests that the carbon radical density is increased with the copper catalyst. Highly conductive VG films having 800 Ω/□ are grown on glass substrates with Cu catalyst at a relatively low temperature.

  13. Synthesis and characterization of silicon carbonitride films by plasma enhanced chemical vapor deposition (PECVD) using bis(dimethylamino)dimethylsilane (BDMADMS), as membrane for a small molecule gas separation

    NASA Astrophysics Data System (ADS)

    Kafrouni, W.; Rouessac, V.; Julbe, A.; Durand, J.

    2010-12-01

    Silicon carbonitride thin films have been deposited by plasma enhanced chemical vapor deposition (PECVD) from bis(dimethylamino)dimethylsilane (BDMADMS) as a function of X = (BDMADMS/(BDMADMS + NH 3)) between 0.1 and 1, and plasma power P (W) between 100 and 400 W. The microstructure of obtained materials has been studied by SEM, FTIR, EDS, ellipsometrie, and contact angle of water measurements. The structure of the materials is strongly depended on plasma parameters; we can pass from a material rich in carbon to a material rich in nitrogen. Single gas permeation tests have been carried out and we have obtained a helium permeance of about 10 -7 mol m -2 s -1 Pa -1 and ideal selectivity of helium over nitrogen of about 20.

  14. Methane as an effective hydrogen source for single-layer graphene synthesis on Cu foil by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Kim, Yong Seung; Lee, Jae Hong; Kim, Young Duck; Jerng, Sahng-Kyoon; Joo, Kisu; Kim, Eunho; Jung, Jongwan; Yoon, Euijoon; Park, Yun Daniel; Seo, Sunae; Chun, Seung-Hyun

    2013-01-01

    A single-layer graphene is synthesized on Cu foil in the absence of H2 flow by plasma enhanced chemical vapor deposition (PECVD). In lieu of an explicit H2 flow, hydrogen species are produced during the methane decomposition process into their active species (CHx<4), assisted with the plasma. Notably, the early stage of growth depends strongly on the plasma power. The resulting grain size (the nucleation density) has a maximum (minimum) at 50 W and saturates when the plasma power is higher than 120 W because hydrogen partial pressures are effectively tuned by a simple control of the plasma power. Raman spectroscopy and transport measurements show that decomposed methane alone can provide a sufficient amount of hydrogen species for high-quality graphene synthesis by PECVD.A single-layer graphene is synthesized on Cu foil in the absence of H2 flow by plasma enhanced chemical vapor deposition (PECVD). In lieu of an explicit H2 flow, hydrogen species are produced during the methane decomposition process into their active species (CHx<4), assisted with the plasma. Notably, the early stage of growth depends strongly on the plasma power. The resulting grain size (the nucleation density) has a maximum (minimum) at 50 W and saturates when the plasma power is higher than 120 W because hydrogen partial pressures are effectively tuned by a simple control of the plasma power. Raman spectroscopy and transport measurements show that decomposed methane alone can provide a sufficient amount of hydrogen species for high-quality graphene synthesis by PECVD. Electronic supplementary information (ESI) available: Schematic diagram of the ICP-CVD system, substrate heating by plasma, differential-pumping technique for mass spectra measurement, and transport properties of a single-domain graphene device. See DOI. 10.1039/c2nr33034b

  15. Epitaxial thin films of YBa sub 2 Cu sub 3 O sub 7 minus x on LaAlO sub 3 substrates deposited by plasma-enhanced metalorganic chemical vapor deposition

    SciTech Connect

    Chern, C.S.; Zhao, J.; Li, Y.Q.; Norris, P.; Kear, B.; Gallois, B.; Kalman, Z. )

    1991-01-14

    High quality epitaxial YBa{sub 2}Cu{sub 3}O{sub 7{minus}{ital x}} (YBCO) superconducting thin films (0.3 {mu}m thick) were grown on the closely lattice and thermal expansion matched substrate, LaAlO{sub 3}, which has low dielectric loss. The YBCO layers were prepared, {ital in} {ital situ}, by a microwave plasma-enhanced metalorganic chemical vapor deposition process. The films, which had mirror-like smooth surfaces, were deposited at a substrate temperature of 730 {degree}C with a partial pressure of 2 Torr of N{sub 2}O. The electrical resistance and magnetic susceptibility versus temperature of the as-deposited films show metallic behavior in the normal state and sharp superconducting transitions with {ital T}{sub {ital c}} ({ital R}=0) of 88 K. Critical current densities measured on patterned bridges were 5{times}10{sup 5} A/cm{sup 2} at 78 K for the films deposited on LaAlO{sub 3}. X-ray diffraction measurements indicate that films grow epitaxially in the plane of the substrate with axis perpendicular to the substrate surface.

  16. Effects of Ammonia Plasma Treatment on the Electrical Properties of Plasma-Enhanced Chemical Vapor Deposition Amorphous Hydrogenated Silicon Carbide Films

    NASA Astrophysics Data System (ADS)

    Li, Yan-Way; Chen, Chia-Fu

    2002-09-01

    Amorphous hydrogenated silicon carbide (a-SiC:H) films were deposited from a mixture of silane and methane gases using the plasma-enhanced chemical vapor deposition (PECVD) process. The properties of the film, following ammonia plasma treatment, are reported. A lower silane flow rate reduces the refractive index, but increases the carbon content and the optical band gap. Increasing the carbon concentration of the a-SiC:H films reduces the dielectric constant. The films were treated with ammonia plasma for various treatment periods. The original film has a smooth surface with a roughness of 0.231 nm, but increasing the ammonia plasma treatment period gradually roughens the surface. The chemical bonding nature of the a-SiC:H films with higher silicon content was investigated by X-ray photoelectron spectroscopy. Various nitrogen ionization species reacted with Si to promote the formation of silicon nitride. As a result, although the dielectric constant of the a-SiC:H films increased slightly, the leakage current density declined as the ammonia plasma treatment time increased.

  17. In situ spectroscopic ellipsometry growth studies on the Al-doped ZnO films deposited by remote plasma-enhanced metalorganic chemical vapor deposition

    SciTech Connect

    Volintiru, I.; Creatore, M.; Sanden, M. C. M. van de

    2008-02-01

    In situ spectroscopic ellipsometry (SE) was applied to study the pyramidlike and pillarlike growth of Al doped ZnO (AZO) films deposited by means of remote plasma-enhanced metalorganic chemical vapor deposition for transparent conductive oxide applications. Real time SE studies in the visible region allowed discerning between the two growth modes by addressing the time evolution of the bulk and surface roughness layer thickness. While the pillarlike mode is characterized by a constant growth rate, a slower rate in the initial stage (up to 150-200 nm film thickness), compared to the bulk, is observed for the growth of pyramidlike AZO films. The two modes differ also in terms of surface roughness development: a saturation behavior is observed for film thickness above 150-200 nm in the case of the pyramidlike films, while a slow linear increase with film thickness characterizes the pillarlike mode. By extending the SE analysis of the AZO films to the near infrared region, valuable information about the in grain properties could be extracted: excellent in grain mobility values, i.e., larger than 100 and 50 cm{sup 2}/V s, are determined for the pyramidlike and pillarlike AZO layers, respectively. The comparison between the outcome of the in situ real time SE studies and the ex situ electrical and chemical characterization highlights the limitations in the electron transport occurring in both types of films and allows one to address routes toward further improvement in AZO conductivity.

  18. The Surface Interface Characteristics of Vertically Aligned Carbon Nanotube and Graphitic Carbon Fiber Arrays Grown by Thermal and Plasma Enhanced Chemical Vapor Deposition

    NASA Technical Reports Server (NTRS)

    Delzeit, Lance; Nguyen, Cattien; Li, Jun; Han, Jie; Meyyappan, M.

    2002-01-01

    The development of nano-arrays for sensors and devices requires the growth of arrays with the proper characteristics. One such application is the growth of vertically aligned carbon nanotubes (CNTs) and graphitic carbon fibers (GCFs) for the chemical attachment of probe molecules. The effectiveness of such an array is dependent not only upon the effectiveness of the probe and the interface between that probe and the array, but also the array and the underlaying substrate. If that array is a growth of vertically aligned CNTs or GCFs then the attachment of that array to the surface is of the utmost importance. This attachment provides the mechanical stability and durability of the array, as well as, the electrical properties of that array. If the detection is to be acquired through an electrical measurement, then the appropriate resistance between the array and the surface need to be fabricated into the device. I will present data on CNTs and GCFs grown from both thermal and plasma enhanced chemical vapor deposition. The focus will be on the characteristics of the metal film from which the CNTs and GCFs are grown and the changes that occur due to changes within the growth process.

  19. Low-temperature synthesis of microcrystalline 3C-SiC film by high-pressure hydrogen-plasma-enhanced chemical transport

    NASA Astrophysics Data System (ADS)

    Ohmi, Hiromasa; Hori, Takahiro; Mori, Tetsuya; Kakiuchi, Hiroaki; Yasutake, Kiyoshi

    2011-06-01

    The synthesis of microcrystalline 3C-SiC films on glass substrates at relatively low temperatures (<=600 °C) by the plasma-enhanced chemical transport method was carried out using a high-pressure pure hydrogen glow discharge. This method used the chemical erosion products of graphite and silicon in the hydrogen plasma as the deposition source. The temperature dependence of the etching rate of graphite and the generated volatile C-species were investigated by exposing sintered graphite to a pure hydrogen plasma at 100 Torr. Infrared absorption gas analysis indicated that the C-related film precursor generated from the graphite was mainly CH4. The etch rate of graphite reached a maximum at a sample temperature of 200 °C. The deposition rate of the SiC film prepared at a hydrogen pressure of 200 Torr increased monotonically from 14 to 29 nm min-1 with an increase in substrate temperature (Tsub) from 100 to 600 °C. The Si/C composition ratio in the films was independent of Tsub and all the film compositions were nearly stoichiometric. The prepared SiC films were microcrystalline 3C-SiC. Raman spectroscopy indicated that the film quality significantly depends on Tsub. The electrical conductivity of the films at room temperature was found to increase exponentially from 3 × 10-4 to 1.7 S cm-1 with Tsub.

  20. Simultaneous synthesis of nanodiamonds and graphene via plasma enhanced chemical vapor deposition (MW PE-CVD) on copper.

    PubMed

    Gottlieb, Steven; Wöhrl, Nicolas; Schulz, Stephan; Buck, Volker

    2016-01-01

    The simultaneous growth of both nanodiamonds and graphene on copper samples is described for the first time. A PE-CVD process is used to synthesize graphene layers and nanodiamond clusters from a hydrogen/methane gas mixture as it is typically done successfully in thermal CVD processes for graphene synthesis. However, the standard thermal CVD process is not without problems since the deposition of graphene is affected by the evaporation of a notable amount of copper caused by the slow temperature increase typical for thermal CVD resulting in a long process time. In sharp contrast, the synthesis of graphene by PE-CVD can circumvent this problem by substantially shortening the process time at holding out the prospect of a lower substrate temperature. The reduced thermal load and the possibility to industrially scale-up the PE-CVD process makes it a very attractive alternative to the thermal CVD process with respect to the graphene production in the future. Nanodiamonds are synthesized in PE-CVD reactors for a long time because these processes offer a high degree of control over the film's nanostructure and simultaneously providing a significant high deposition rate. To model the co-deposition process, the three relevant macroscopic parameters (pressure, gas mixture and microwave power) are correlated with three relevant process properties (plasma ball size, substrate temperature and C2/Hα-ratio) and the influence on the quality of the deposited carbon allotropes is investigated. For the evaluation of the graphene as well as the nanodiamond quality, Raman spectroscopy used whereas the plasma properties are measured by optical methods. It is found that the diamond nucleation can be influenced by the C2/Hα-ratio in the plasma, while the graphene quality remains mostly unchanged by this parameter. Moreover it is derived from the experimental data that the direct plasma contact with the copper surface is beneficial for the nucleation of the diamond while the growth and

  1. Effect of ion bombardment on the synthesis of vertically aligned single-walled carbon nanotubes by plasma-enhanced chemical vapor deposition.

    PubMed

    Luo, Zhiqiang; Lim, Sanhua; You, Yumeng; Miao, Jianmin; Gong, Hao; Zhang, Jixuan; Wang, Shanzhong; Lin, Jianyi; Shen, Zexiang

    2008-06-25

    The synthesis of vertically aligned single-walled carbon nanotubes (VA-SWNTs) by plasma-enhanced chemical vapor deposition (PECVD) was achieved at 500-600 °C, using ethylene as the carbon source and 1 nm Fe film as the catalyst. For growth of high-quality VA-SWNTs in a plasma sheath, it is crucial to alleviate the undesirable ion bombardment etching effects by the optimization of plasma input power and gas pressure. The resistibility of synthesized VA-SWNTs against ion bombardment etching was found to be closely related to the growth temperature. At relatively low temperature (500 °C), the VA-SWNTs were very susceptible to ion bombardments, which could induce structural defects, and even resulted in a structural transition to few-walled nanotubes. For capacitively coupled radio frequency (rf) PECVD operating at moderate gas pressure (0.3-10 Torr), the ion bombardment etching effect is mainly dependent on the ion flux, which is related to the plasma input power and gas pressure. PMID:21828659

  2. Impact of the etching gas on vertically oriented single wall and few walled carbon nanotubes by plasma enhanced chemical vapor deposition

    SciTech Connect

    Gohier, A.; Minea, T. M.; Djouadi, M. A.; Granier, A.

    2007-03-01

    Vertically oriented single wall nanotubes (SWNTs) and few walled nanotubes (FWNTs) have been grown by electronic cyclotron resonance plasma enhanced chemical vapor deposition (PECVD) on silica flat substrates. The impact of the plasma parameters on SWNT and FWNT growth has been investigated using two different etching gas mixtures, namely, C{sub 2}H{sub 2}/NH{sub 3} and C{sub 2}H{sub 2}/H{sub 2} with various ratios and applied bias voltages. Kinetic studies are also proposed in order to describe the FWNT growth mechanism by plasma techniques. A key role played by the reactive gas (NH{sub 3} and H{sub 2}) is observed in the PECVD process, contrary to multiwalled nanotube growth. It is demonstrated that the balance between FWNT growth versus FWNT etching can be widely modulated by varying the gas mixture and bias voltage. It is shown that the use of hydrogen for hydrocarbon gas dilution restricts the destruction of SWNT and FWNT by the plasma species (ions and radicals)

  3. Effects of total CH 4/Ar gas pressure on the structures and field electron emission properties of carbon nanomaterials grown by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Qi, J. L.; Wang, X.; Zheng, W. T.; Tian, H. W.; Liu, C.; Lu, Y. L.; Peng, Y. S.; Cheng, G.

    2009-12-01

    The effects of total CH 4/Ar gas pressure on the growth of carbon nanomaterials on Si (1 0 0) substrate covered with CoO nanoparticles, using plasma-enhanced chemical vapor deposition (PECVD), were investigated. The structures of obtained products were correlated with the total gas pressure and changed from pure carbon nanotubes (CNTs) through hybrid CNTs/graphene sheets (GSs), to pure GSs as the total gas pressure changed from 20 to 4 Torr. The total gas pressure influenced the density of hydrogen radicals and Ar ions in chamber, which in turn determined the degree of how CoO nanoparticles were deoxidized and ion bombardment energy that governed the final carbon nanomaterials. Moreover, the obtained hybrid CNTs/GSs exhibited a lower turn-on field (1.4 V/μm) emission, compared to either 2.7 V/μm for pure CNTs or 2.2 V/μm for pure GSs, at current density of 10 μA/cm 2.

  4. Effect of ion bombardment on the synthesis of vertically aligned single-walled carbon nanotubes by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Luo, Zhiqiang; Lim, Sanhua; You, Yumeng; Miao, Jianmin; Gong, Hao; Zhang, Jixuan; Wang, Shanzhong; Lin, Jianyi; Shen, Zexiang

    2008-06-01

    The synthesis of vertically aligned single-walled carbon nanotubes (VA-SWNTs) by plasma-enhanced chemical vapor deposition (PECVD) was achieved at 500-600 °C, using ethylene as the carbon source and 1 nm Fe film as the catalyst. For growth of high-quality VA-SWNTs in a plasma sheath, it is crucial to alleviate the undesirable ion bombardment etching effects by the optimization of plasma input power and gas pressure. The resistibility of synthesized VA-SWNTs against ion bombardment etching was found to be closely related to the growth temperature. At relatively low temperature (500 °C), the VA-SWNTs were very susceptible to ion bombardments, which could induce structural defects, and even resulted in a structural transition to few-walled nanotubes. For capacitively coupled radio frequency (rf) PECVD operating at moderate gas pressure (0.3-10 Torr), the ion bombardment etching effect is mainly dependent on the ion flux, which is related to the plasma input power and gas pressure.

  5. Structure, mechanical, and frictional properties of hydrogenated fullerene-like amorphous carbon film prepared by direct current plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Wang, Yongfu; Gao, Kaixiong; Zhang, Junyan

    2016-07-01

    In this study, fullerene like carbon (FL-C) is introduced in hydrogenated amorphous carbon (a-C:H) film by employing a direct current plasma enhanced chemical vapor deposition. The film has a low friction and wear, such as 0.011 and 2.3 × 10-9mm3/N m in the N2, and 0.014 and 8.4 × 10-8mm3/N m in the humid air, and high hardness and elasticity (25.8 GPa and 83.1%), to make further engineering applications in practice. It has several nanometers ordered domains consisting of less frequently cross-linked graphitic sheet stacks. We provide new evidences for understanding the reported Raman fit model involving four vibrational frequencies from five, six, and seven C-atom rings of FL-C structures, and discuss the structure evolution before or after friction according to the change in the 1200 cm-1 Raman band intensity caused by five- and seven-carbon rings. Friction inevitably facilitates the transformation of carbon into FL-C nanostructures, namely, the ultra low friction comes from both such structures within the carbon film and the sliding induced at friction interface.

  6. Fine-tuning of catalytic tin nanoparticles by the reverse micelle method for direct deposition of silicon nanowires by a plasma-enhanced chemical vapour technique.

    PubMed

    Poinern, Gérrard E J; Ng, Yan-Jing; Fawcett, Derek

    2010-12-15

    The reverse micelle method was used for the reduction of a tin (Sn) salt solution to produce metallic Sn nanoparticles ranging from 85 nm to 140 nm in diameter. The reverse micellar system used in this process was hexane-butanol-cetyl trimethylammonium bromide (CTAB). The diameters of the Sn nanoparticles were proportional to the concentration of the aqueous Sn salt solution. Thus, the size of the Sn nanoparticles can easily be controlled, enabling a simple, reproducible mechanism for the growth of silicon nanowires (SiNWs) using plasma-enhanced chemical vapour deposition (PECVD). Both the Sn nanoparticles and silicon nanowires were characterised using field-emission scanning electron microscopy (FE-SEM). Further characterisations of the SiNW's were made using transmission electron microscopy (TEM), atomic force microscopy (AFM) and Raman spectroscopy. In addition, dynamic light scattering (DLS) was used to investigate particle size distributions. This procedure demonstrates an economical route for manufacturing reproducible silicon nanowires using fine-tuned Sn nanoparticles for possible solar cell applications. PMID:20887996

  7. Electrical and Optical Properties of Si-Incorporated a-C:H Films via the Radio Frequency Plasma-Enhanced Chemical Vapor Deposition Method.

    PubMed

    Kim, In Jun; Choi, Won Seok; Hong, Byungyou

    2016-05-01

    The optical and electrical properties of silicon-incorporated hydrogenated amorphous carbon (a-C:H:Si) films deposited via the radio frequency (RF) plasma-enhanced chemical vapor deposition (PECVD) method using a mixture of CH4, H2, and SiH4 were observed. The silane gas whose ranged from 0 to 25 vol.% [SiH4/(SiH4 + CH4) was fed into the reactor while the other deposition parameters were kept constant. The basic properties of these films were investigated via Raman spectroscopy, UV-visible spectrometry, I-V measurement, and surface profiling. The experiment results showed that the film thickness increased from 300 nm to 800 nm for the same deposition time as the silane gas increased. The Raman spectrum obtained from the silicon-incorporated a-C:H films suggested that the film property changed from graphitic-like to more diamond-like. As the silane gas increased, the optical gap, E04, slightly increased from 1.98 eV to 2.62 eV. It was shown that the Si atoms incorporated into the a-C:H films reduced the size of the sp2 clusters. As for the I-V characteristics, the Si-incorporated a-C:H films had a lower leakage current than the a-C:H films without Si. PMID:27483937

  8. Si nanowires grown by Al-catalyzed plasma-enhanced chemical vapor deposition: synthesis conditions, electrical properties and application to lithium battery anodes

    NASA Astrophysics Data System (ADS)

    Toan, Le Duc; Moyen, Eric; Zamfir, Mihai Robert; Joe, Jemee; Kim, Young Woo; Pribat, Didier

    2016-01-01

    Silicon nanowires have been synhesized using Al as a catalyst. Silane (SiH4) diluted in H2 carrier gas was employed as Si precursor in a plasma enhanced chemical vapor deposition system operated at various temperatures (450 °C and 550 °C). Those growth temperatures, which are lower than the eutectic temperature in the Al-Si system (577 °C) suggests a vapor-solid-solid growth mechanism. Four point resistance measurements and back-gated current-voltage measurements indicated that silicon nanowires were heavily doped (p type), with a doping concentration of a few 1019 cm-3. We have measured hole mobility values of ˜16 cm2 V-1 s-1 at 450 °C and ˜30 cm2 V-1 s-1 at 550 °C. Transmission electron microscope analyses showed that the silicon nanowires were highly twinned even when they grow epitaxially on (111) Si substrates. We have also evaluated the use of those highly doped Si nanowires for lithium-ion battery anodes. We have observed a good cycling behavior during the first 65 charge-discharge cycles, followed by a slow capacity decay. After 150 cycles at a charge-discharge rate of 0.1 C, the electrode capacity was still 1400 mAh g-1. The ageing mechanism seems to be related to the delamination of the SiNWs from the stainless steel substrate on which they were grown.

  9. Effect of plasma parameters on characteristics of silicon nitride film deposited by single and dual frequency plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Sahu, B. B.; Yin, Yongyi; Han, Jeon G.

    2016-03-01

    This work investigates the deposition of hydrogenated amorphous silicon nitride films using various low-temperature plasmas. Utilizing radio-frequency (RF, 13.56 MHz) and ultra-high frequency (UHF, 320 MHz) powers, different plasma enhanced chemical vapor deposition processes are conducted in the mixture of reactive N2/NH3/SiH4 gases. The processes are extensively characterized using different plasma diagnostic tools to study their plasma and radical generation capabilities. A typical transition of the electron energy distribution function from single- to bi-Maxwellian type is achieved by combining RF and ultra-high powers. Data analysis revealed that the RF/UHF dual frequency power enhances the plasma surface heating and produces hot electron population with relatively low electron temperature and high plasma density. Using various film analysis methods, we have investigated the role of plasma parameters on the compositional, structural, and optical properties of the deposited films to optimize the process conditions. The presented results show that the dual frequency power is effective for enhancing dissociation and ionization of neutrals, which in turn helps in enabling high deposition rate and improving film properties.

  10. Compositional effects on plasma-enhanced metalorganic chemical vapor deposition of YBa sub 2 Cu sub 3 O sub 7 minus x thin films

    SciTech Connect

    Zhao, J.; Chern, C.S.; Li, Y.Q.; Norris, P.; Gallois, B.; Kear, B.; Wu, X.D.; Muenchausen, R.E. )

    1991-06-17

    Epitaxial YBa{sub 2}Cu{sub 3}O{sub 7{minus}{ital x}} superconducting thin films with a zero resistance transition temperatures of about 90 K have been prepared, {ital in} {ital situ}, on LaAlO{sub 3} by a plasma-enhanced metalorganic chemical vapor deposition process at a substrate temperature of 670 {degree}C in 1 Torr partial pressure of N{sub 2}O. The composition of the films was varied systematically to investigate the effect of changes in the Ba/Y and Cu/Y ratio on the film properties. The results indicated that superconducting current densities exceeding 10{sup 6} A/cm{sup 2}, measured at 77 K by a transport method, could be obtained on films with an anomalously wide range of film compositions. Excess Cu (up to 60%) and deficiency in Ba (down to 30%) from their stoichiometric values did not significantly degrade the superconducting properties of the films. As the composition approached the Y-Ba-Cu ratio of 1-2-3, an improvement in surface morphology and a decrease in superconducting transition temperature were found.

  11. High-quality YBa sub 2 Cu sub 3 O sub 7 minus x thin films by plasma-enhanced metalorganic chemical vapor deposition at low temperature

    SciTech Connect

    Zhao, J.; Li, Y.Q.; Chern, C.S.; Lu, P.; Norris, P.; Gallois, B.; Kear, B.; Cosandey, F.; Wu, X.D.; Muenchausen, R.E.; Garrison, S.M. )

    1991-09-02

    Single-crystalline epitaxial YBa{sub 2}Cu{sub 3}O{sub 7-{ital x}} thin films with a sharp superconducting transition temperature of 90 K and a critical current density of 3.3{times}10{sup 6} A/cm{sup 2} at 77 K were prepared by a plasma-enhanced metalorganic chemical vapor deposition (PE-MOCVD) process. The films were formed {ital in} {ital situ} on (100) LaAlO{sub 3} substrates at a temperature of 670 {degree}C in 2 Torr partial pressure of N{sub 2}O. X-ray analysis indicated that films grew epitaxially with the {ital c}-axis perpendicular to the substrate and the {ital a} and {ital b} axes uniformly aligned along the LaAlO{sub 3} (100) directions. High-resolution transmission electron microscopy along with electron diffraction revealed that the films grew epitaxially with atomically abrupt film-substrate interfaces. The high degree of epitaxial crystallinity of the films was also confirmed by Rutherford backscattering spectroscopy which gave a minimum channeling yield of 9%.

  12. A simple method to deposit palladium doped SnO{sub 2} thin films using plasma enhanced chemical vapor deposition technique

    SciTech Connect

    Kim, Young Soon; Wahab, Rizwan; Shin, Hyung-Shik; Ansari, S. G.; Ansari, Z. A.

    2010-11-15

    This work presents a simple method to deposit palladium doped tin oxide (SnO{sub 2}) thin films using modified plasma enhanced chemical vapor deposition as a function of deposition temperature at a radio frequency plasma power of 150 W. Stannic chloride (SnCl{sub 4}) was used as precursor and oxygen (O{sub 2}, 100 SCCM) (SCCM denotes cubic centimeter per minute at STP) as reactant gas. Palladium hexafluroacetyleacetonate (Pd(C{sub 5}HF{sub 6}O{sub 2}){sub 2}) was used as a precursor for palladium. Fine granular morphology was observed with tetragonal rutile structure. A peak related to Pd{sub 2}Sn is observed, whose intensity increases slightly with deposition temperature. Electrical resistivity value decreased from 8.6 to 0.9 m{Omega} cm as a function of deposition temperature from 400 to 600 deg. C. Photoelectron peaks related to Sn 3d, Sn 3p3, Sn 4d, O 1s, and C 1s were detected with varying intensities as a function of deposition temperature.

  13. Effect of power on interface and electrical properties of SiO2 films produced by plasma-enhanced chemical-vapor deposition

    NASA Astrophysics Data System (ADS)

    Landheer, D.; Xu, D.-X.; Tao, Y.; Sproule, G. I.

    1995-02-01

    The effect of power on the electrical and interface properties of silicon dioxide films produced by direct plasma-enhanced chemical-vapor deposition, using nitrous oxide and silane with high helium dilution, has been investigated. Auger depth profiling measurements indicate that while the bulk of the films have no measurable impurities, the interface region contains about 1.6 x 10(exp 15) atoms/sq cm of nitrogen. In contrast to thermal oxides, there is no thick interface layer with a large intrinsic compressive stress. The interface-state densities of the films obtained from capacitance-voltage measurements on metal-oxide-semiconductor diodes increase with increasing plasma power, but these can be removed to some extent by high-temperature annealing at temperatures in the range 800-950 C. The flatband voltage is relatively insensitive to plasma power. Thermal oxide samples have been subjected to the plasma processes and these also show evidence of plasma damage. A thin layer produced at the interface by a separate plasma oxynitridation process is shown to be incapable of protecting the Si/SiO2 interface from the plasma damage produced by subsequent high-power plasma deposition processes. The nature of the interface states is discussed.

  14. Electrical characterization of rapid thermal nitrided and reoxidized plasma-enhanced chemical-vapor-deposited silicon dioxide metal-oxide-silicon structures

    NASA Astrophysics Data System (ADS)

    Ang, S. S.; Shi, Y. J.; Brown, W. D.

    1994-12-01

    The electrical characteristics of rapid thermal nitrided and reoxidized plasma-enhanced chemical-vapor-deposited (PECVD) silicon dioxide metal-oxide-silison (MOS) structures were investigated. Both nitridation temperature and time affect the properties of the MOS structures as revealed by capacitance-voltage (C-V) characteristics. Nitridation at 1000 C for 60 s followed by reoxidtion for 60 s at 1000 C in an oxygen/ nitrogen ambient was found to be superior to the same nitridation followed by reoxidation in pure oxygen. Typical vlaues of fixed charge and interface state densities for devices subjected to nitridation and reoxidation in a mixture of oxygen and nitrogen were 4 x 10(exp 10) cm(exp -2) and 7 x 10(exp 10) eV(exp -1) cm(exp -2), respectively. Avalanche electron injection using electric field of 3-5 MV/cm produced negative shifts in flatband voltage for low fluence levels and positive flatband voltage shifts for larger fluence levels. Furthermore, the magnitudes of both positive and negative shifts and the electron fluence level at which turnaround occurs increase with electric field. However, independent of the electric field, the flatband voltage saturates very close to its preinjection vlaue. These results strongly suggest that device quality MOS dielectrics can be realized by nitridation/reoxidation of PECVD oxide.

  15. Characterization of Pb(Zr, Ti)O3 thin films fabricated by plasma enhanced chemical vapor deposition on Ir-based electrodes

    NASA Astrophysics Data System (ADS)

    Lee, Hee-Chul; Lee, Won-Jong

    2002-11-01

    Structural and electrical characteristics of Pb(Zr, Ti)O3 (PZT) ferroelectric thin films deposited on various Ir-based electrodes (Ir, IrO2, and Pt/IrO2) using electron cyclotron resonance plasma enhanced chemical vapor deposition were investigated. On the Ir electrode, stoichiometric PZT films with pure perovskite phase could be obtained over a very wide range of processing conditions. However, PZT films prepared on the IrO2 electrode contain a large amount of PbOx phases and exhibited high Pb-excess composition. The deposition characteristics were dependent on the behavior of PbO molecules on the electrode surface. The PZT thin film capacitors prepared on the Ir bottom electrode showed different electrical properties depending on top electrode materials. The PZT capacitors with Ir, IrO2, and Pt top electrodes showed good leakage current characteristics, whereas those with the Ru top electrode showed a very high leakage current density. The PZT capacitor exhibited the best fatigue endurance with an IrO2 top electrode. An Ir top electrode provided better fatigue endurance than a Pt top electrode. The PZT capacitor with an Ir-based electrode is thought to be attractive for the application to ferroelectric random access memory devices because of its wide processing window for a high-quality ferroelectric film and good polarization, fatigue, and leakage current characteristics.

  16. Thermal expansion coefficient and thermomechanical properties of SiN(x) thin films prepared by plasma-enhanced chemical vapor deposition.

    PubMed

    Tien, Chuen-Lin; Lin, Tsai-Wei

    2012-10-20

    We present a new method based on fast Fourier transform (FFT) for evaluating the thermal expansion coefficient and thermomechanical properties of thin films. The silicon nitride thin films deposited on Corning glass and Si wafers were prepared by plasma-enhanced chemical vapor deposition in this study. The anisotropic residual stress and thermomechanical properties of silicon nitride thin films were studied. Residual stresses in thin films were measured by a modified Michelson interferometer associated with the FFT method under different heating temperatures. We found that the average residual-stress value increases when the temperature increases from room temperature to 100°C. Increased substrate temperature causes the residual stress in SiN(x) film deposited on Si wafers to be more compressive, but the residual stress in SiN(x) film on Corning glass becomes more tensile. The residual-stress versus substrate-temperature relation is a linear correlation after heating. A double substrate technique is used to determine the thermal expansion coefficients of the thin films. The experimental results show that the thermal expansion coefficient of the silicon nitride thin films is 3.27×10(-6)°C(-1). The biaxial modulus is 1125 GPa for SiN(x) film. PMID:23089776

  17. Single liquid source plasma-enhanced metalorganic chemical vapor deposition of high-quality YBa2Cu3O(7-x) thin films

    NASA Technical Reports Server (NTRS)

    Zhang, Jiming; Gardiner, Robin A.; Kirlin, Peter S.; Boerstler, Robert W.; Steinbeck, John

    1992-01-01

    High quality YBa2Cu3O(7-x) films were grown in-situ on LaAlO3 (100) by a novel single liquid source plasma-enhanced metalorganic chemical vapor deposition process. The metalorganic complexes M(thd) (sub n), (thd = 2,2,6,6-tetramethyl-3,5-heptanedionate; M = Y, Ba, Cu) were dissolved in an organic solution and injected into a vaporizer immediately upstream of the reactor inlet. The single liquid source technique dramatically simplifies current CVD processing and can significantly improve the process reproducibility. X-ray diffraction measurements indicated that single phase, highly c-axis oriented YBa2Cu3O(7-x) was formed in-situ at substrate temperature 680 C. The as-deposited films exhibited a mirror-like surface, had transition temperature T(sub cO) approximately equal to 89 K, Delta T(sub c) less than 1 K, and Jc (77 K) = 10(exp 6) A/sq cm.

  18. Polyethylene Oxide Films Polymerized by Radio Frequency Plasma-Enhanced Chemical Vapour Phase Deposition and Its Adsorption Behaviour of Platelet-Rich Plasma

    NASA Astrophysics Data System (ADS)

    Hu, Wen-Juan; Xie, Fen-Yan; Chen, Qiang; Weng, Jing

    2008-10-01

    We present polyethylene oxide (PEO) functional films polymerized by rf plasma-enhanced vapour chemical deposition (rf-PECVD) on p-Si (100) surface with precursor ethylene glycol dimethyl ether (EGDME) and diluted Ar in pulsed plasma mode. The influences of discharge parameters on the film properties and compounds are investigated. The film structure is analysed by Fourier transform infrared (FTIR) spectroscopy. The water contact angle measurement and atomic force microscope (AFM) are employed to examine the surface polarity and to detect surface morphology, respectively. It is concluded that the smaller duty cycle in pulsed plasma mode contributes to the rich C-O-C (EO) group on the surfaces. As an application, the adsorption behaviour of platelet-rich plasma on plasma polymerization films performed in-vitro is explored. The shapes of attached cells are studied in detail by an optic invert microscope, which clarifies that high-density C-O-C groups on surfaces are responsible for non-fouling adsorption behaviour of the PEO films.

  19. Structural and electrical properties and current–voltage characteristics of nitrogen-doped diamond-like carbon films on Si substrates by plasma-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Tsuchiya, Masato; Murakami, Kazuki; Magara, Kohei; Nakamura, Kazuki; Ohashi, Haruka; Tokuda, Kengo; Takami, Takahiro; Ogasawara, Haruka; Enta, Yoshiharu; Suzuki, Yushi; Ando, Satoshi; Nakazawa, Hideki

    2016-06-01

    We have deposited nitrogen-doped diamond-like carbon (N-DLC) films by plasma-enhanced chemical vapor deposition using CH4, N2, and Ar, and investigated the effects of N doping on the structure and the electrical, mechanical, and optical properties of the N-DLC films. We fabricated undoped DLC/p-type Si and N-DLC/p-type Si heterojunctions and examined the current–voltage characteristics of the heterojunctions. When the N2 flow ratio was increased from 0 to 3.64%, the resistivity markedly decreased from the order of 105 Ω·cm to that of 10‑2 Ω·cm and the internal stress also decreased. The resistivity gradually increased with increasing N2 flow ratio from 3.64 to 13.6%, and then it decreased at a N2 flow ratio of 13.6%. These behaviors can be explained in terms of the clustering of sp2 carbons and the formation of sp3C–N, sp2C=N, sp1C≡N, and C–H n bonds. The rectification ratio of the heterojunction using the N-DLC film prepared at 3.64% was 35.8 at ±0.5 V.

  20. Effect of oxygen plasma on field emission characteristics of single-wall carbon nanotubes grown by plasma enhanced chemical vapour deposition system

    SciTech Connect

    Kumar, Avshish; Parveen, Shama; Husain, Samina; Ali, Javid; Zulfequar, Mohammad; Harsh; Husain, Mushahid

    2014-02-28

    Field emission properties of single wall carbon nanotubes (SWCNTs) grown on iron catalyst film by plasma enhanced chemical vapour deposition system were studied in diode configuration. The results were analysed in the framework of Fowler-Nordheim theory. The grown SWCNTs were found to be excellent field emitters, having emission current density higher than 20 mA/cm{sup 2} at a turn-on field of 1.3 V/μm. The as grown SWCNTs were further treated with Oxygen (O{sub 2}) plasma for 5 min and again field emission characteristics were measured. The O{sub 2} plasma treated SWCNTs have shown dramatic improvement in their field emission properties with emission current density of 111 mA/cm{sup 2} at a much lower turn on field of 0.8 V/μm. The as grown as well as plasma treated SWCNTs were also characterized by various techniques, such as scanning electron microscopy, high resolution transmission electron microscopy, Raman spectroscopy, and Fourier transform infrared spectroscopy before and after O{sub 2} plasma treatment and the findings are being reported in this paper.

  1. Evolution of the electrical and structural properties during the growth of Al doped ZnO films by remote plasma-enhanced metalorganic chemical vapor deposition

    SciTech Connect

    Volintiru, I.; Creatore, M.; Kniknie, B. J.; Spee, C. I. M. A.; Sanden, M. C. M. van de

    2007-08-15

    Al-doped zinc oxide (AZO) films were deposited by means of remote plasma-enhanced metalorganic chemical vapor deposition from oxygen/diethylzinc/trimethylaluminum mixtures. The electrical, structural (crystallinity and morphology), and chemical properties of the deposited films were investigated using Hall, four point probe, x-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM), electron recoil detection (ERD), Rutherford backscattering (RBS), and time of flight secondary ion mass spectrometry (TOF-SIMS), respectively. We found that the working pressure plays an important role in controlling the sheet resistance R{sub s} and roughness development during film growth. At 1.5 mbar the AZO films are highly conductive (R{sub s}<6 {omega}/{open_square} for a film thickness above 1200 nm) and very rough (>4% of the film thickness), however, they are characterized by a large sheet resistance gradient with increasing film thickness. By decreasing the pressure from 1.5 to 0.38 mbar, the gradient is significantly reduced and the films become smoother, but the sheet resistance increases (R{sub s}{approx_equal}100 {omega}/{open_square} for a film thickness of 1000 nm). The sheet resistance gradient and the surface roughness development correlate with the grain size evolution, as determined from the AFM and SEM analyses, indicating the transition from pyramid-like at 1.5 mbar to pillar-like growth mode at 0.38 mbar. The change in plasma chemistry/growth precursors caused by the variation in pressure leads to different concentration and activation efficiency of Al dopant in the zinc oxide films. On the basis of the experimental evidence, a valid route for further improving the conductivity of the AZO film is found, i.e., increasing the grain size at the initial stage of film growth.

  2. Use of SiBN and SiBON films prepared by plasma enhanced chemical vapor deposition from borazine as interconnection dielectrics

    SciTech Connect

    Kane, W.F.; Cohen, S.A.; Hummel, J.P.; Luther, B.; Beach, D.B.

    1997-02-01

    Thin films of silicon boron nitride (SiBN) of typical composition Si{sub 0.09}B{sub 0.39}N{sub 0.51} and silicon boron oxynitride (SiBON) of typical composition Si{sub 0.16}B{sub 0.29}O{sub 0.41}N{sub 0.14} were prepared by plasma enhanced chemical vapor deposition and the properties of these films were evaluated with respect to their suitability as interconnection dielectrics in microelectronic fabrication. Films were deposited on 125 mm silicon substrates in a parallel-plate reactor at a substrate temperature of 400 C and a plasma power of 0.5 W/cm{sup 2}. Boron nitride, for comparison of electrical properties, was deposited from borazine (B{sub 3}N{sub 3}H{sub 6}); silicon boron nitride was deposited from borazine, disilane (Si{sub 2}H{sub 6}), and ammonia (NH{sub 3}); silicon boron oxynitride was deposited from borazine, disilane, ammonia, and nitrous oxide (N{sub 2}O). Metal-insulator-metal capacitors were fabricated and electrical measurements indicated that all three films had excellent dielectric properties with dielectric constants of 4.1, 4.7, and 3.9 for BN, SiBN, and SiBON, respectively. Tests of conformality indicated that deposition into trenches with an aspect ratio of 4:1 gave conformality greater than 70%. Silicon boron oxynitride was shown to be an excellent barrier to the diffusion of copper. A planar, single level metal-insulator structure was constructed using a SiBN/SiBON insulator with copper metallization.

  3. A comparative study of nitrogen plasma effect on field emission characteristics of single wall carbon nanotubes synthesized by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Kumar, Avshish; Parveen, Shama; Husain, Samina; Ali, Javid; Zulfequar, Mohammad; Harsh; Husain, Mushahid

    2014-12-01

    Vertically aligned single wall carbon nanotubes (SWCNTs) with large scale control of diameter, length and alignment have successfully been grown by plasma enhanced chemical vapor deposition (PECVD) system. The nickel (Ni) as catalyst deposited on silicon (Si) substrate was used to grow the SWCNTs. Field emission (FE) characteristics of the as grown SWCNTs were measured using indigenously designed setup in which a diode is configured in such a way that by applying negative voltage on the copper plate (cathode) with respect to stainless steel anode plate, current density can be recorded. To measure the FE characteristics, SWCNTs film pasted on the copper plate with silver epoxy was used as electron emitter source. The effective area of anode was ∼78.5 mm2 for field emission measurements. The emission measurements were carried out under high vacuum pressure of the order of 10-6 Torr to minimize the electron scattering and degradation of the emitters. The distance between anode and cathode was kept 500 μm (constant) during entire field emission studies. The grown SWCNTs are excellent field emitters, having emission current density higher than 25 mA/cm2 at turn-on field 1.3 V/μm. In order to enhance the field emission characteristics, the as grown SWCNTs have been treated under nitrogen (N2) plasma for 5 min and again field emission characteristics have been measured. The N2 plasma treated SWCNTs show a good enhancement in the field emission properties with emission current density 81.5 mA/cm2 at turn on field 1.2 V/μm. The as-grown and N2 plasma treated SWCNTs were also characterized by field emission scanning electron microscope (FESEM), high resolution transmission electron microscope (HRTEM), Raman spectrometer, Fourier transform infrared spectrometer (FTIR) and X-ray photoelectron spectroscopy (XPS).

  4. Synthesis and Characterization of High c-axis ZnO Thin Film by Plasma Enhanced Chemical Vapor Deposition System and its UV Photodetector Application.

    PubMed

    Chao, Chung-Hua; Wei, Da-Hua

    2015-01-01

    In this study, zinc oxide (ZnO) thin films with high c-axis (0002) preferential orientation have been successfully and effectively synthesized onto silicon (Si) substrates via different synthesized temperatures by using plasma enhanced chemical vapor deposition (PECVD) system. The effects of different synthesized temperatures on the crystal structure, surface morphologies and optical properties have been investigated. The X-ray diffraction (XRD) patterns indicated that the intensity of (0002) diffraction peak became stronger with increasing synthesized temperature until 400 (o)C. The diffraction intensity of (0002) peak gradually became weaker accompanying with appearance of (10-10) diffraction peak as the synthesized temperature up to excess of 400 (o)C. The RT photoluminescence (PL) spectra exhibited a strong near-band-edge (NBE) emission observed at around 375 nm and a negligible deep-level (DL) emission located at around 575 nm under high c-axis ZnO thin films. Field emission scanning electron microscopy (FE-SEM) images revealed the homogeneous surface and with small grain size distribution. The ZnO thin films have also been synthesized onto glass substrates under the same parameters for measuring the transmittance. For the purpose of ultraviolet (UV) photodetector application, the interdigitated platinum (Pt) thin film (thickness ~100 nm) fabricated via conventional optical lithography process and radio frequency (RF) magnetron sputtering. In order to reach Ohmic contact, the device was annealed in argon circumstances at 450 (o)C by rapid thermal annealing (RTA) system for 10 min. After the systematic measurements, the current-voltage (I-V) curve of photo and dark current and time-dependent photocurrent response results exhibited a good responsivity and reliability, indicating that the high c-axis ZnO thin film is a suitable sensing layer for UV photodetector application. PMID:26484561

  5. Microcrystalline silicon thin films deposited by matrix-distributed electron cyclotron resonance plasma enhanced chemical vapor deposition using an SiF4 /H2 chemistry

    NASA Astrophysics Data System (ADS)

    Wang, Junkang; Bulkin, Pavel; Florea, Ileana; Maurice, Jean-Luc; Johnson, Erik

    2016-07-01

    For the growth of hydrogenated microcrystalline silicon (μc-Si:H) thin films by low temperature plasma-enhanced chemical vapor deposition (PECVD), silicon tetrafluoride (SiF4) has recently attracted interest as a precursor due to the resilient optoelectronic performance of the resulting material and devices. In this work, μc-Si:H films are deposited at high rates (7 Å s‑1) from a SiF4 and hydrogen (H2) gas mixture by matrix-distributed electron cyclotron resonance PECVD (MDECR-PECVD). Increased substrate temperature and moderate ion bombardment energy (IBE) are demonstrated to be of vital importance to achieve high quality μc-Si:H films under such low process pressure and high plasma density conditions, presumably due to thermally-induced and ion-induced enhancement of surface species migration. Two well-defined IBE thresholds at 12 eV and 43 eV, corresponding respectively to SiF+ ion-induced surface and bulk atomic displacement, are found to be determinant to the final film properties, namely the surface roughness, feature size and crystalline content. Moreover, a study of the growth dynamics shows that the primary challenge to producing highly crystallized μc-Si:H films by MDECR-PECVD appears to be the nucleation step. By employing a two-step method to first prepare a highly crystallized seed layer, μc-Si:H films lacking any amorphous incubation layer have been obtained. A crystalline volume fraction of 68% is achieved with a substrate temperature as low as 120 °C, which is of great interest to broaden the process window for solar cell applications.

  6. High-temperature degradation in plasma-enhanced chemical vapor deposition Al{sub 2}O{sub 3} surface passivation layers on crystalline silicon

    SciTech Connect

    Kühnhold, Saskia; Saint-Cast, Pierre; Kafle, Bishal; Hofmann, Marc; Colonna, Francesco; Zacharias, Margit

    2014-08-07

    In this publication, the activation and degradation of the passivation quality of plasma-enhanced chemical vapor deposited aluminum oxide (Al{sub 2}O{sub 3}) layers with different thicknesses (10 nm, 20 nm, and 110 nm) on crystalline silicon (c-Si) during long and high temperature treatments are investigated. As indicated by Fourier Transform Infrared Spectroscopy, the concentration of tetrahedral and octahedral sites within the Al{sub 2}O{sub 3} layer changes during temperature treatments and correlates with the amount of negative fixed charges at the Si/Al{sub 2}O{sub 3} interface, which was detected by Corona Oxide Characterization of Semiconductors. Furthermore, during a temperature treatment at 820 °C for 30 min, the initial amorphous Al{sub 2}O{sub 3} layer crystallize into the γ-Al{sub 2}O{sub 3} structure and was enhanced by additional oxygen as was proven by x-ray diffraction measurements and underlined by Density Functional Theory simulations. The crystallization correlates with the increase of the optical density up to 20% while the final Al{sub 2}O{sub 3} layer thickness decreases at the same time up to 26%. All observations described above were detected to be Al{sub 2}O{sub 3} layer thickness dependent. These observations reveal novel aspects to explain the temperature induced passivation and degradation mechanisms of Al{sub 2}O{sub 3} layers at a molecular level like the origin of the negative fixe charges at the Si/SiO{sub x}/Al{sub 2}O{sub 3} interface or the phenomena of blistering. Moreover, the crystal phase of Al{sub 2}O{sub 3} does not deliver good surface passivation due to a high concentration of octahedral sites leading to a lower concentration of negative fixed charges at the interface.

  7. Characterization of low dielectric constant plasma polymer films deposited by plasma-enhanced chemical vapor deposition using decamethyl-cyclopentasiloxane and cyclohexane as the precursors

    SciTech Connect

    Yang, Jaeyoung; Lee, Sungwoo; Park, Hyoungsun; Jung, Donggeun; Chae, Heeyeop

    2006-01-15

    We investigated the properties of plasma polymer films deposited by plasma-enhanced chemical vapor deposition using a mixture of decamethyl-cyclopentasiloxane (C{sub 10}H{sub 30}O{sub 5}Si{sub 5}) and cyclohexane (C{sub 6}H{sub 12}) as the precursors, which we refer to as plasma polymerized decamethyl-cyclopentasiloxane: cyclohexane (PPDMCPSO:CHex) films. The relative dielectric constants, k, of the plasma polymer films were correlated with the Fourier transform infrared absorption peaks of the C-Hx, Si-CH{sub 3}, and Si-O related groups. As the amount of the CHx species in the as-deposited plasma polymer films increased, the k value and the leakage current density of the thin films decreased. The subsequent annealing of the PPDMCPSO:CHex film at 400 deg. C for 1 h further reduced the k value to as low as k=2.05. This annealed PPDMCPSO:CHex thin film showed a leakage current density of the order of 4x10{sup -7} A/cm{sup 2} at 1 MV/cm and a breakdown field of 6.5 MV/cm. Through the bias-temperature stress test, it was estimated that the PPDMCPSO:CHex film with a k value of 2.05 would retain its insulating properties for ten years at 167 deg. C under an electrical field of 1 MV/cm, when it is presented as a layer adjacent to Cu/TaN(10 nm)

  8. Deposition of Amorphous Silicon and Silicon-Based Dielectrics by Remote Plasma-Enhanced Chemical Vapor Deposition: Application to the Fabrication of Tft's and Mosfet's.

    NASA Astrophysics Data System (ADS)

    Kim, Sang Soo

    1990-01-01

    This thesis discusses the deposition of device quality silicon dioxide (SiO_2), silicon nitride (Si_3N_4 ), and hydrogenated amorphous silicon (a-Si:H) by the remote plasma enhanced chemical vapor deposition (Remote PECVD) technique at low substrate temperature (100 ^circC < T _{rm s} < 450^ circC). An ultra-high-vacuum (UHV) compatible, multi-chamber integrated processing system has been built and used for this study. This system provides: (1) in -situ substrate processing; (2) surface analysis by Auger electron spectroscopy (AES) and reflected high energy electron diffraction (RHEED); and (3) thin film deposition by Remote PECVD. Six issues are addressed: (1) in-situ semiconductor surface cleaning for Si, Ge, GaAs, and CdTe; (2) substrate surface characterization by using RHEED and AES; (3) process gas-substrate interactions (subcutaneous oxidation) occurring during the thin film deposition; (4) the thin film deposition process for silicon-based dielectrics and for doped and intrinsic amorphous silicon; (5) physical properties of the thin films deposited by Remote PECVD using in-situ AES, and ex-situ infrared (ir) spectroscopy and ellipsometry; and (6) electrical performance of thin films in device structures including metal-oxide/or insulator-semiconductor (MOS or MIS) capacitors formed on silicon, and hydrogenated -amorphous silicon thin film transistors (a-Si:H TFT's). Atomically clean semiconductor surfaces are obtained by a remote hydrogen plasma treatment prior to thin film deposition. In the remote PECVD process the process gases are selectively excited, the silane reactant, the source of silicon atoms in the films is never directly plasma excited, and the substrate is also remote from the plasma discharge region. These differences between the remote PECVD process and the conventional direct PECVD process, result in improved control of the insulator stoichiometry, and a reduction in level of chemical impurities such as hydrogen. We find that the

  9. Effect of Annealing Temperature on Dielectric Constant and Bonding Structure of Low-k SiCOH Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Lee, Sungwoo; Yang, Jaeyoung; Yeo, Sanghak; Lee, Jaewon; Jung, Donggeun; Boo, Jin-hyo; Kim, Hyoungsub; Chae, Heeyeop

    2007-02-01

    We investigated the effect of annealing temperature on the properties of SiCOH films deposited by plasma-enhanced chemical vapor deposition using or a mixture of Si-O containing and hydrocarbon precursors, decamethyl-cyclopentasiloxane (DMCPSO-C10H30O5Si5) and cyclohexane (CHex-C6H12). These SiCOH films were deposited at pressures of 0.6 and 1.5 Torr and the as-deposited SiCOH films were subjected to annealing temperatures from 25 to 500 °C in a furnace for 1 h in N2 ambient at a pressure of 1 atm. The relative dielectric constants, k, of the SiCOH films deposited at 0.6 and 1.5 Torr were 2.76 and 2.26, respectively, before the annealing process. The subsequent annealing of the SiCOH film at 500 °C further reduced the k values to as low as 2.31 and 1.85, respectively. Decreases in the refractive index, hardness, and modulus were observed as the annealing temperature increased to 450 °C. However, further increasing annealing temperature to 500 °C caused the refractive index, hardness, and modulus to increase again. Trends of decreases in both the hardness and modulus with increasing annealing temperature were found. The refractive index and the film thickness retention also decreased with increasing annealing temperature. The change in the k value as a function of the annealing temperature was correlated with the change in the Fourier transform infrared absorption peaks of C-Hx, Si-CH3, and Si-O related groups. As the annealing temperature increased, the intensity of both the CHx and Si-CH3 peaks decreased, respectively. In particular, the C-H2 (asymmetric and symmetric) peaks provide direct evidence of the presence of ethylene groups in the SiCOH films. Thus the decrease in intensity of the peaks corresponding to the CHx groups and Si-O cage structure in the SiCOH films was considered to be responsible for lowering they dielectric constant, refractive index, hardness and modulus of the films. The leakage current density of the SiCOH films at 1 MV/cm is obtained

  10. High-Quality Amorphous-Crystalline Silicon Heterostructures Using the Grid-Based Triode Radio-Frequency Plasma Enhanced Chemical Vapour Deposition Method

    NASA Astrophysics Data System (ADS)

    Mahtani, Pratish

    The amorphous-crystalline silicon heterojunction (SHJ) represents a new paradigm in crystalline silicon (c-Si) photovoltaics (PV). To achieve the 27% efficiency target for SHJ PV, defects in the silicon heterointerface must be minimized by growing high-quality hydrogenated amorphous silicon (a-Si:H) onto the c-Si surfaces without deposition-related damage. Typically, a-Si:H is deposited using radio-frequency (RF) plasma enhanced chemical vapour deposition (PECVD), which in its conventional configuration directly exposes the c-Si growth surface to the ignited plasma. In this thesis, silicon heterostructures prepared by the grid-based triode RF PECVD method is investigated for the first time. The triode method allows for high-quality a-Si:H growth with the c-Si surfaces shielded from any potential plasma damage. Using a custom-built configurable PECVD facility, a systematic study was conducted and it was demonstrated that the triode method affords the preparation of a-Si:H with excellent bulk film quality and state-of-the-art passivation for c-Si surfaces. Using the triode method, an effective minority carrier lifetime (taueff) of 8.1 ms and an Auger-corrected surface recombination velocity (S) of 2.4 cm/s at an excess carrier density of 1015 cm-3 have been achieved for 1-2 ohm-cm n-type c-Si passivated with intrinsic a-Si:H. Further, using the triode method to deposit thin-layers of intrinsic and doped a-Si:H, a conventional SHJ solar cell structure was prepared and was found to exhibit an excellent implied Voc of 710 mV. Under all conditions scanned, samples prepared in the triode configuration showed improved passivation compared with samples prepared in the conventional diode configuration with the best triode prepared sample showing a nearly threefold increase in taueff and a twofold decrease in S compared with the best diode prepared sample. Furthermore, a-Si:H deposited using the triode method showed significantly improved bulk properties compared to diode

  11. Microwave-assisted synthesis of chromenes: biological and chemical importance.

    PubMed

    Patil, Shivaputra A; Patil, Siddappa A; Patil, Renukadevi

    2015-01-01

    Chromenes constitute chemically important class of heterocyclic compounds having diverse biological and chemical importance. Development of environmentally benign, efficient and economical methods for the synthesis of chromenes remains a significant challenge in synthetic chemistry. The synthesis of chromenes, therefore, has attracted enormous attention from medicinal and organic chemists. Researchers have embraced the concepts of microwave (high speed) synthesis to produce biologically and chemically important chromenes in a time sensitive manner. This review will summarize the recent biological applications such as anticancer, antimicrobial, neurodegenerative and insecticidal activity of new chromenes prepared via microwave irradiation. The development of new methodologies for the synthesis of chromenes including green chemistry processes has also been discussed. PMID:26061107

  12. Metal-boride phase formation on tungsten carbide (WC-Co) during microwave plasma chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Johnston, Jamin M.; Catledge, Shane A.

    2016-02-01

    Strengthening of cemented tungsten carbide by boriding is used to improve the wear resistance and lifetime of carbide tools; however, many conventional boriding techniques render the bulk carbide too brittle for extreme conditions, such as hard rock drilling. This research explored the variation in metal-boride phase formation during the microwave plasma enhanced chemical vapor deposition process at surface temperatures from 700 to 1100 °C. We showed several well-adhered metal-boride surface layers consisting of WCoB, CoB and/or W2CoB2 with average hardness from 23 to 27 GPa and average elastic modulus of 600-730 GPa. The metal-boride interlayer was shown to be an effective diffusion barrier against elemental cobalt; migration of elemental cobalt to the surface of the interlayer was significantly reduced. A combination of glancing angle X-ray diffraction, electron dispersive spectroscopy, nanoindentation and scratch testing was used to evaluate the surface composition and material properties. An evaluation of the material properties shows that plasma enhanced chemical vapor deposited borides formed at substrate temperatures of 800 °C, 850 °C, 900 °C and 1000 °C strengthen the material by increasing the hardness and elastic modulus of cemented tungsten carbide. Additionally, these boride surface layers may offer potential for adhesion of ultra-hard carbon coatings.

  13. GREENER CHEMICAL SYNTHESES USING MICROWAVE IRRADIATION

    EPA Science Inventory

    Greener solvent-free protocols involve microwave (MW) exposure of neat reactants catalyzed by the surfaces of recyclable mineral supports such as alumina, silica and clay which are applicable to a wide range of cleavage, condensation, cyclization, oxidation and reduction reaction...

  14. 'GREENER' CHEMICAL SYNTHESIS USING MICROWAVE IRRADIATION

    EPA Science Inventory

    A solvent-free approach that involves microwave (MW) exposure of neat reactants (undiluted) catalyzed by the surfaces of recyclable mineral supports such as alumina, silica, clay, or 'doped' surfaces is presented which is applicable to a wide range of cleavage, condensation, cycl...

  15. EFFICIENT AND GREENER CHEMICAL SYNTHESES USING MICROWAVE IRRADIATION

    EPA Science Inventory

    The diverse nature of chemical entities requires various ‘green’ strategic pathways in our quest towards attaining sustainability. A solvent-free approach involving microwave (MW) exposure of neat reactants (undiluted) catalyzed by the surfaces of less-expensive and rec...

  16. ADVANCES IN GREEN CHEMISTRY: CHEMICAL SYNTHESES USING MICROWAVE IRRADIATION, ISBN 81-901238-5-8

    EPA Science Inventory

    16. Abstract Advances in Green Chemistry: Chemical Syntheses Using Microwave Irradiation
    Microwave-accelerated chemical syntheses in solvents as well as under solvent-free conditions have witnessed an explosive growth. The technique has found widespread application predomi...

  17. Chemical reactions during plasma-enhanced atomic layer deposition of SiO2 films employing aminosilane and O2/Ar plasma at 50 °C

    NASA Astrophysics Data System (ADS)

    Lu, Yi; Kobayashi, Akiko; Kondo, Hiroki; Ishikawa, Kenji; Sekine, Makoto; Hori, Masaru

    2014-01-01

    We report the temporal evolution of surface species observed in situ using attenuated total reflection Fourier transform infrared absorption spectroscopy (ATR-FTIR) during plasma-enhanced atomic layer deposition (PE-ALD) of SiO2 films employing aminosilane and an O2/Ar plasma at a temperature of 50 °C. Reversals in the appearance of IR absorbance features associated with SiO-H, C-Hx, and Si-H proved to coincide with the self-limiting reaction property in ALD. Our IR results indicate that an O2/Ar plasma can both removed CHx groups and transform SiH surface species to SiOH. In addition, SiO2 deposition was confirmed by a continuous increase in Si-O absorbance with each PE-ALD step, which becomes stable after several cycles. On the basis of our results, the mechanism of low temperature SiO2 PE-ALD was discussed.

  18. Plasma enhanced chemical vapor deposition of wear resistant gradual a-Si{sub 1-x}:C{sub x}:H coatings on nickel-titanium for biomedical applications

    SciTech Connect

    Niermann, Benedikt; Boeke, Marc; Schauer, Janine-Christina; Winter, Joerg

    2010-03-15

    Plasma enhanced chemical vapor deposition has been used to deposit thin films with gradual transitions from silicon to carbon on Cu, Ni, stainless steel, and NiTi. Thus show low stress, elasticity, and wear resistance with excellent adhesion on all metals under investigation. Already at low Si concentrations of 10 at. % the intrinsic stress is considerably reduced compared to pure diamondlike carbon (DLC) films. The deposition process is controlled by optical emission spectroscopy. This technique has been applied to monitor the growth precursors and to correlate them with the film composition. The compositions of the films were determined by Rutherford backscattering spectroscopy and XPS measurements. Due to the elastic properties of the gradual transition and the excellent biocompatibility of DLC, the described film systems present a useful coating for biomedical applications.

  19. The Performance Improvement of N2 Plasma Treatment on ZrO2 Gate Dielectric Thin-Film Transistors with Atmospheric Pressure Plasma-Enhanced Chemical Vapor Deposition IGZO Channel.

    PubMed

    Wu, Chien-Hung; Huang, Bo-Wen; Chang, Kow-Ming; Wang, Shui-Jinn; Lin, Jian-Hong; Hsu, Jui-Mei

    2016-06-01

    The aim of this paper is to illustrate the N2 plasma treatment for high-κ ZrO2 gate dielectric stack (30 nm) with indium-gallium-zinc-oxide (IGZO) thin-film transistors (TFTs). Experimental results reveal that a suitable incorporation of nitrogen atoms could enhance the device performance by eliminating the oxygen vacancies and provide an amorphous surface with better surface roughness. With N2 plasma treated ZrO2 gate, IGZO channel is fabricated by atmospheric pressure plasma-enhanced chemical vapor deposition (AP-PECVD) technique. The best performance of the AP-PECVD IGZO TFTs are obtained with 20 W-90 sec N2 plasma treatment with field-effect mobility (μ(FET)) of 22.5 cm2/V-s, subthreshold swing (SS) of 155 mV/dec, and on/off current ratio (I(on)/I(off)) of 1.49 x 10(7). PMID:27427669

  20. Excitation mechanism and thermal emission quenching of Tb ions in silicon rich silicon oxide thin films grown by plasma-enhanced chemical vapour deposition—Do we need silicon nanoclusters?

    SciTech Connect

    Podhorodecki, A. Golacki, L. W.; Zatryb, G.; Misiewicz, J.; Wang, J.; Jadwisienczak, W.; Fedus, K.

    2014-04-14

    In this work, we will discuss the excitation and emission properties of Tb ions in a Silicon Rich Silicon Oxide (SRSO) matrix obtained at different technological conditions. By means of electron cyclotron resonance plasma-enhanced chemical vapour deposition, undoped and doped SRSO films have been obtained with different Si content (33, 35, 39, 50 at. %) and were annealed at different temperatures (600, 900, 1100 °C). The samples were characterized optically and structurally using photoluminescence (PL), PL excitation, time resolved PL, absorption, cathodoluminescence, temperature dependent PL, Rutherford backscattering spectrometry, Fourier transform infrared spectroscopy and positron annihilation lifetime spectroscopy. Based on the obtained results, we discuss how the matrix modifications influence excitation and emission properties of Tb ions.

  1. Long-term stable water vapor permeation barrier properties of SiN/SiCN/SiN nanolaminated multilayers grown by plasma-enhanced chemical vapor deposition at extremely low pressures

    SciTech Connect

    Choi, Bum Ho Lee, Jong Ho

    2014-08-04

    We investigated the water vapor permeation barrier properties of 30-nm-thick SiN/SiCN/SiN nanolaminated multilayer structures grown by plasma enhanced chemical vapor deposition at 7 mTorr. The derived water vapor transmission rate was 1.12 × 10{sup −6} g/(m{sup 2} day) at 85 °C and 85% relative humidity, and this value was maintained up to 15 000 h of aging time. The X-ray diffraction patterns revealed that the nanolaminated film was composed of an amorphous phase. A mixed phase was observed upon performing high resolution transmission electron microscope analysis, which indicated that a thermodynamically stable structure was formed. It was revealed amorphous SiN/SiCN/SiN multilayer structures that are free from intermixed interface defects effectively block water vapor permeation into active layer.

  2. Microstructure and initial growth characteristics of nanocrystalline silicon films fabricated by very high frequency plasma enhanced chemical vapor deposition with highly H{sub 2} dilution of SiH{sub 4}

    SciTech Connect

    Wang Xiang; Huang Rui; Song Jie; Guo Yanqing; Ding Honglin

    2010-06-15

    Nanocrystalline silicon (nc-Si:H) film deposited on silicon oxide in a very high frequency plasma enhanced chemical vapor deposition with highly H{sub 2} dilution of SiH{sub 4} has been investigated by Raman spectroscopy and high resolution transmission electron microscopy. It is found that at early growth stage the initial amorphous incubation layer in nc-Si:H growth on silicon oxide can be almost eliminated and crystallites with diameter of about 6 to 10 nm are directly formed on the silicon oxide. Nearly parallel columnar structures with complex microstructure are found from cross-sectional transmission electron microscopy images of the film. It is considered that highly H{sub 2} dilution and higher excitation frequency are the main reason for eliminating the initial amorphous incubation layer in nc-Si:H growth on silicon oxide.

  3. Excitation mechanism and thermal emission quenching of Tb ions in silicon rich silicon oxide thin films grown by plasma-enhanced chemical vapour deposition—Do we need silicon nanoclusters?

    NASA Astrophysics Data System (ADS)

    Podhorodecki, A.; Golacki, L. W.; Zatryb, G.; Misiewicz, J.; Wang, J.; Jadwisienczak, W.; Fedus, K.; Wojcik, J.; Wilson, P. R. J.; Mascher, P.

    2014-04-01

    In this work, we will discuss the excitation and emission properties of Tb ions in a Silicon Rich Silicon Oxide (SRSO) matrix obtained at different technological conditions. By means of electron cyclotron resonance plasma-enhanced chemical vapour deposition, undoped and doped SRSO films have been obtained with different Si content (33, 35, 39, 50 at. %) and were annealed at different temperatures (600, 900, 1100 °C). The samples were characterized optically and structurally using photoluminescence (PL), PL excitation, time resolved PL, absorption, cathodoluminescence, temperature dependent PL, Rutherford backscattering spectrometry, Fourier transform infrared spectroscopy and positron annihilation lifetime spectroscopy. Based on the obtained results, we discuss how the matrix modifications influence excitation and emission properties of Tb ions.

  4. Chemical vapor deposition coating of fibers using microwave application

    NASA Technical Reports Server (NTRS)

    Barmatz, Martin B. (Inventor); Hoover, Gordon (Inventor); Jackson, Henry W. (Inventor)

    2000-01-01

    Chemical vapor deposition coating is carried out in a cylindrical cavity. The fibers are heated by a microwave source that is uses a TM0N0 mode, where O is an integer, and produces a field that depends substantially only on radius. The fibers are observed to determine their heating, and their position can be adjusted. Once the fibers are uniformly heated, a CVD reagent is added to process the fibers.

  5. Microwave detection of chemical agents: a review. Special publication, January 1982-July 1984

    SciTech Connect

    Christensen, S.D.

    1986-06-01

    This report represents an overview of microwave-detection techniques and an analysis of their possible application to chemical agent point and remote sensing. Microwave rotational spectroscopy and millimeter-wavelength radar are also discussed.

  6. Oxygen incorporation in highly c -axis oriented YBa sub 2 Cu sub 3 O sub 7 minus x thin films deposited by plasma-enhanced metalorgainic chemical vapor deposition

    SciTech Connect

    Li, Y.Q.; Zhao, J.; Chern, C.S.; Lemoine, E.E.; Gallois, B.; Norris, P.; Kear, B. )

    1991-05-20

    YBa{sub 2}Cu{sub 3}O{sub 7{minus}{ital x}} superconducting thin films prepared by chemical vapor deposition which exhibit high transition temperatures ({ital T}{sub {ital c}}{similar to}90 K) and high critical current densities ({ital J}{sub {ital c}}{gt}10{sup 6} A/cm{sup 2} at 77.7 K and 0 T) generally have copper-rich precipitates on the surface. We have studied both near-stoichiometric and nonstoichiometric highly {ital c}-axis oriented thin films formed by plasma-enhanced metalorganic chemical vapor deposition. We show that the reduction in transport properties ({ital T}{sub {ital c}} and {ital J}{sub {ital c}}) observed in stoichiometric films with smooth morphologies may result from a dramatic reduction of the oxygen diffusion rate in these thin films as compared to nonstoichiometric films. The significant enhancement of the transport properties of these films was achieved by further oxygen anneals at 480 {degree}C.

  7. Microwave separation of organic chemicals from mixed hazardous waste

    SciTech Connect

    Anderson, A.A.; Albano, R.K.

    1992-08-01

    The feasibility of utilizing the differential heating characteristics of microwave energy (MW) to aid in the chemical extraction and separation process of hazardous organic compounds from mixed hazardous waste, was studied at the INEL. The long-term objective of this work was to identify a practical method of separating or enhancing the separation process of organic hazardous waste components from mixed waste using microwave (MW) frequency radiation. Methods using MW energy for calcination, solidification, and drying of radioactive waste from nuclear facilities is becoming more attractive. In order to study the effectiveness of MW heating, samples of several organic chemicals simulating those which may be found at the Radioactive Waste Management Complex at the INEL were exposed to MW energy. Vapor collection and analysis was performed as a function of time, signal frequency, and MW power throughout the process. Signal frequencies ranging from 900 MHz t 8000 MHz were used. Although the signal frequency bandwidth of the selectivity was quite broad, for the material tested an indication of the frequency dependence in the selectivity of MW heating was given. Greater efficiency in terms of energy used and time required was observed. The relatively large electromagnetic field intensities generated at the resonant frequencies which were supported by the cavity sample holder demonstrated the use of cavity resonance to aid in the process of differential heating.

  8. Microwave separation of organic chemicals from mixed hazardous waste

    SciTech Connect

    Anderson, A.A.; Albano, R.K.

    1992-01-01

    The feasibility of utilizing the differential heating characteristics of microwave energy (MW) to aid in the chemical extraction and separation process of hazardous organic compounds from mixed hazardous waste, was studied at the INEL. The long-term objective of this work was to identify a practical method of separating or enhancing the separation process of organic hazardous waste components from mixed waste using microwave (MW) frequency radiation. Methods using MW energy for calcination, solidification, and drying of radioactive waste from nuclear facilities is becoming more attractive. In order to study the effectiveness of MW heating, samples of several organic chemicals simulating those which may be found at the Radioactive Waste Management Complex at the INEL were exposed to MW energy. Vapor collection and analysis was performed as a function of time, signal frequency, and MW power throughout the process. Signal frequencies ranging from 900 MHz t 8000 MHz were used. Although the signal frequency bandwidth of the selectivity was quite broad, for the material tested an indication of the frequency dependence in the selectivity of MW heating was given. Greater efficiency in terms of energy used and time required was observed. The relatively large electromagnetic field intensities generated at the resonant frequencies which were supported by the cavity sample holder demonstrated the use of cavity resonance to aid in the process of differential heating.

  9. A microwave and quantum chemical study of allyltrifluorosilane

    NASA Astrophysics Data System (ADS)

    Møllendal, H.; Guirgis, G. A.

    2003-04-01

    The structural and conformational properties of allytrifluorsilane, H 2CCH-CH 2-SiF 3, have been explored by microwave (MW) spectroscopy and high-level ab initio and density functional theory quantum chemical calculations. The microwave spectrum was investigated in the 18-62 GHz spectral regions. The a-type R-branch transitions of one conformer were assigned for the ground as well as for 10 vibrationally excited states. The CC-C-Si chain of atoms in this rotamer takes an anti-clinal ('skew') conformation, with a dihedral angle calculated to be 111.6° from the syn-periplanar (0°) conformation. The question whether a CC-C-Si syn-periplanar conformer exists as a high-energy form in the gas phase remains open. In most of the quantum chemical calculations this conformation is predicted to be a transition state. However, in the most advanced calculations (B3LYP/aug-cc-pVTZ level of theory) the syn-periplanar conformer is predicted to be a stable rotamer that is calculated to be 6.5 kJ/mol higher in energy than the anti-clinal form. Since there is no indication in the MW spectrum for the presence of high-energy form(s), it is concluded that the anti-clinal conformer is at least 4 kJ/mol more stable than any other hypothetical rotamer.

  10. Diamond growth on Fe-Cr-Al alloy by H2-plasma enhanced graphite etching

    NASA Astrophysics Data System (ADS)

    Li, Y. S.; Hirose, A.

    2007-04-01

    Without intermediate layer and surface pretreatment, adherent diamond films with high initial nucleation density have been deposited on Fe-15Cr-5Al (wt. %) alloy substrate. The deposition was performed using microwave hydrogen plasma enhanced graphite etching in a wide temperature range from 370to740°C. The high nucleation density and growth rate of diamond are primarily attributed to the unique precursors used (hydrogen plasma etched graphite) and the chemical nature of the substrate. The improvement in diamond adhesion to steel alloys is ascribed to the important role played by Al, mitigation of the catalytic function of iron by suppressing the preferential formation of loose graphite intermediate phase on steel surface.

  11. Control of carbon content in amorphous GeTe films deposited by plasma enhanced chemical vapor deposition (PE-MOCVD) for phase-change random access memory applications

    NASA Astrophysics Data System (ADS)

    Aoukar, M.; Szkutnik, P. D.; Jourde, D.; Pelissier, B.; Michallon, P.; Noé, P.; Vallée, C.

    2015-07-01

    Amorphous and smooth GeTe thin films are deposited on 200 mm silicon substrates by plasma enhanced—metal organic chemical vapor deposition (PE-MOCVD) using the commercial organometallic precursors TDMAGe and DIPTe as Ge and Te precursors, respectively. X-ray photoelectron spectroscopy (XPS) measurements show a stoichiometric composition of the deposited GeTe films but with high carbon contamination. Using information collected by Optical Emission Spectroscopy (OES) and XPS, the origin of carbon contamination is determined and the dissociation mechanisms of Ge and Te precursors in H2 + Ar plasma are proposed. As a result, carbon level is properly controlled by varying operating parameters such as plasma radio frequency power, pressure and H2 rate. Finally, GeTe films with carbon level as low as 5 at. % are obtained.

  12. Fundamental studies of defect generation in amorphous silicon alloys grown by remote plasma-enhanced chemical-vapor deposition. Final subcontract report, 1 July 1989--31 December 1992

    SciTech Connect

    Lucovsky, G.

    1993-08-01

    This report describes research to reduce the intrinsic bonding defects in amorphous and microcrystalline Si alloys by controlling the bonding chemistry and the microstructure via the deposition process reactions. The specific approach was to use remote plasma-enhanced, chemical-vapor deposition (PECVD) and reactive magnetron sputtering to limit the multiplicity of deposition inaction pathways, and thereby gain increased control over the thin-film chemistry and microstrucre. The research included (1) the deposition of amorphous and microcrystalline Si alloy materials by the PECVD process and by reactive magnetron sputtering, and (2) the evaluation of the material properties of these films for potential applications in PV devices. The focus of the research was on pining a fundamental understanding of the relationships between deposition reaction pathways, the bonding of dopant and alloy atoms, and the electrical provides of importance for PV applications. This involved studying the factors that contribute to defect generation and to defect removal and/or neutralization. In addition to the experimental studies, the research also included theoretical and modeling studies aimed at understanding the relationships between local atomic arrangements of Si and alloy atoms, and the electrical, optical, vibrational, and defect properties.

  13. Effect of Si and C concentration on the microstructure, and the mechanical, tribological and electrochemical properties of nanocomposite TiC/a-SiC:H/a-C:H coatings prepared by plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Li, Duanjie; Hassani, Salim; Poulin, Suzie; Szpunar, Jerzy A.; Martinu, Ludvik; Klemberg-Sapieha, Jolanta E.

    2012-02-01

    The nanocomposite TiC/a-SiC:H/a-C:H (presented as Ti-Si-C) coatings attract considerable interest due to their possible applications such as wear protective coatings, diffusion barriers, and materials for solar cells and electrical contacts. In order to explore new film properties and open new opportunities, in the present work, we prepare a series of C-rich Ti-Si-C coatings with different Si and C concentrations using plasma enhanced chemical vapor deposition, and we systematically investigate the effect of elemental composition on the microstructure, and on the mechanical, tribological and electrochemical properties. XRD and XPS analyses demonstrate that the Ti-Si-C coatings mainly consist of nanocrystalline (nc-) TiC embedded in amorphous (a-) SiC:H and a-C:H matrices. Ti-Si-C coatings with a high Si concentration possess enhanced mechanical properties (high hardness), while those with additional C exhibit superior tribological behaviors. The increase of Si and/or C concentrations leads to a grain size refinement of the TiC nanocrystals and to an expansion of the amorphous phase. This in turn substantially enhances their corrosion resistance. Ti-Si-C coatings with the highest Si or C contents exhibit the best corrosion performance among the tested samples by improving the corrosion resistance of the SS410 substrate by a factor of ˜400.

  14. Organo-Chlorinated Thin Films Deposited by Atmospheric Pressure Plasma-Enhanced Chemical Vapor Deposition for Adhesion Enhancement between Rubber and Zinc-Plated Steel Monofilaments.

    PubMed

    Vandenabeele, Cédric; Bulou, Simon; Maurau, Rémy; Siffer, Frederic; Belmonte, Thierry; Choquet, Patrick

    2015-07-01

    A continuous-flow plasma process working at atmospheric pressure is developed to enhance the adhesion between a rubber compound and a zinc-plated steel monofilament, with the long-term objective to find a potential alternative to the electrolytic brass plating process, which is currently used in tire industry. For this purpose, a highly efficient tubular dielectric barrier discharge reactor is built to allow the continuous treatment of "endless" cylindrical substrates. The best treatment conditions found regarding adhesion are Ar/O2 plasma pretreatment, followed by the deposition from dichloromethane of a 75 nm-thick organo-chlorinated plasma polymerized thin film. Ar/O2 pretreatment allows the removal of organic residues, coming from drawing lubricants, and induces external growth of zinc oxide. The plasma layer has to be preferably deposited at low power to conserve sufficient hydrocarbon moieties. Surface analyses reveal the complex chemical mechanism behind the establishment of strong adhesion levels, more than five times higher after the plasma treatment. During the vulcanization step, superficial ZnO reacts with the chlorinated species of the thin film and is converted into porous and granular bump-shaped ZnwOxHyClz nanostructures. Together, rubber additives diffuse through the plasma layer and lead to the formation of zinc sulfide on the substrate surface. Hence, two distinct interfaces, rubber/thin film and thin film/substrate, are established. On the basis of these observations, hypotheses explaining the high bonding strength results are formulated. PMID:26069994

  15. A nucleation and growth model of vertically-oriented carbon nanofibers or nanotubes by plasma-enhanced catalytic chemical vapor deposition.

    PubMed

    Cojocaru, C S; Senger, A; Le Normand, F

    2006-05-01

    Carbon nanofibers are grown by direct current and hot filaments-activated catalytic chemical vapor deposition while varying the power of the hot filaments. Observations of these carbon nanofibers vertically oriented on a SiO2 (8 nm thick)/Si(100) substrate covered with Co nanoparticles (10-15 nm particle size) by Scanning Electron and Transmission Electron Microscopies show the presence of a graphitic "nest" either on the surface of the substrate or at the end of the specific nanofiber that does not encapsulate the catalytic particle. Strictly in our conditions, the activation by hot filaments is required to grow nanofibers with a C2H2 - H2 gas mixture, as large amounts of amorphous carbon cover the surface of the substrate without using hot filaments. From these observations as well as data of the literature, it is proposed that the nucleation of carbon nanofibers occurs through a complex process involving several steps: carbon concentration gradient starting from the catalytic carbon decomposition and diffusion from the surface of the catalytic nanoparticles exposed to the activated gas and promoted by energetic ionic species of the gas phase; subsequent graphitic condensation of a "nest" at the interface of the Co particle and substrate. The large concentration of highly reactive hydrogen radicals mainly provided by activation with hot filaments precludes further spreading out of this interfacial carbon nest over the entire surface of the substrate and thus selectively orientates the growth towards the condensation of graphene over facets that are perpendicular to the surface. Carbon nanofibers can then be grown within the well-known Vapor-Liquid-Solid process. Thus the effect of energetic ions and highly reactive neutrals like atomic hydrogen in the preferential etching of carbon on the edge of graphene shells and on the broadening of the carbon nanofiber is underlined. PMID:16792361

  16. Microwave processing of epoxy resins and synthesis of carbon nanotubes by microwave plasma chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Zong, Liming

    Microwave processing of advanced materials has been studied as an attractive alternative to conventional thermal processing. In this dissertation, work was preformed in four sections. The first section is a review on research status of microwave processing of polymer materials. The second section is investigation of the microwave curing kinetics of epoxy resins. The curing of diglycidyl ether of bisphenol A (DGEBA) and 3, 3'-diaminodiphenyl sulfone (DDS) system under microwave radiation at 145 °C was governed by an autocatalyzed reaction mechanism. A kinetic model was used to describe the curing progress. The third section is a study on dielectric properties of four reacting epoxy resins over a temperature range at 2.45 GHz. The epoxy resin was DGEBA. The four curing agents were DDS, Jeffamine D-230, m-phenylenediamine, and diethyltoluenediamine. The mixtures of DGEBA and the four curing agents were stoichiometric. The four reacting systems were heated under microwave irradiation to certain cure temperatures. Measurements of temperature and dielectric properties were made during free convective cooling of the samples. The cooled samples were analyzed with a Differential Scanning Calorimeter to determine the extents of cure. The Davidson-Cole model can be used to describe the dielectric data. A simplified Davidson-Cole expression was proposed to calculate the parameters in the Davidson-Cole model and describe the dielectric properties of the DGEBA/DDS system and part of the dielectric data of the other three systems. A single relaxation model was used with the Arrhenius expression for temperature dependence to model the results. The evolution of all parameters in the models during cure was related to the decreasing number of the epoxy and amine groups in the reactants and the increasing viscosity of the reacting systems. The last section is synthesis of carbon nanotubes (CNTs) on silicon substrate by microwave plasma chemical vapor deposition of a gas mixture of

  17. Role of hydrogen on the deposition and properties of fluorinated silicon-nitride films prepared by inductively coupled plasma enhanced chemical vapor deposition using SiF{sub 4}/N{sub 2}/H{sub 2} mixtures

    SciTech Connect

    Fandino, J.; Santana, G.; Rodriguez-Fernandez, L.; Cheang-Wong, J.C.; Ortiz, A.; Alonso, J.C.

    2005-03-01

    Fluorinated silicon-nitride films have been prepared at low temperature (250 deg. C) by remote plasma enhanced chemical vapor deposition using mixtures of SiF{sub 4}, N{sub 2}, Ar, and various H{sub 2} flow rates. The deposited films were characterized by means of single wavelength ellipsometry, infrared transmission, resonant nuclear reactions, Rutherford backscattering analysis, and current-voltage measurements. It was found that films deposited without hydrogen grow with the highest deposition rate, however, they result with the highest fluorine content ({approx}27 at. %) and excess of silicon (Si/N ratio{approx_equal}1.75). These films also have the lowest refractive index and the highest etch rate, and exhibit very poor dielectric properties. As a consequence of the high fluorine content, these films hydrolize rapidly upon exposure to the ambient moisture, forming Si-H and N-H bonds, however, they do not oxidize completely. The addition of hydrogen to the deposition process reduces the deposition rate but improves systematically the stability and insulating properties of the films by reducing the amount of both silicon and fluorine incorporated during growth. All the fluorinated silicon-nitride films deposited at hydrogen flow rates higher than 3.5 sccm resulted free of Si-H bonds. In spite of the fact that films obtained at the highest hydrogen flow rate used in this work are still silicon rich (Si/N ratio{approx_equal}1.0) and contain a considerable amount of fluorine ({approx}16 at. %), they are chemically stable and show acceptable dielectric properties.

  18. Plasma-Enhanced Chemical Vapor Deposition (PE-CVD) yields better Hydrolytical Stability of Biocompatible SiOx Thin Films on Implant Alumina Ceramics compared to Rapid Thermal Evaporation Physical Vapor Deposition (PVD).

    PubMed

    Böke, Frederik; Giner, Ignacio; Keller, Adrian; Grundmeier, Guido; Fischer, Horst

    2016-07-20

    Densely sintered aluminum oxide (α-Al2O3) is chemically and biologically inert. To improve the interaction with biomolecules and cells, its surface has to be modified prior to use in biomedical applications. In this study, we compared two deposition techniques for adhesion promoting SiOx films to facilitate the coupling of stable organosilane monolayers on monolithic α-alumina; physical vapor deposition (PVD) by thermal evaporation and plasma enhanced chemical vapor deposition (PE-CVD). We also investigated the influence of etching on the formation of silanol surface groups using hydrogen peroxide and sulfuric acid solutions. The film characteristics, that is, surface morphology and surface chemistry, as well as the film stability and its adhesion properties under accelerated aging conditions were characterized by means of X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray spectroscopy (EDX), scanning electron microscopy (SEM), inductively coupled plasma-optical emission spectroscopy (ICP-OES), and tensile strength tests. Differences in surface functionalization were investigated via two model organosilanes as well as the cell-cytotoxicity and viability on murine fibroblasts and human mesenchymal stromal cells (hMSC). We found that both SiOx interfaces did not affect the cell viability of both cell types. No significant differences between both films with regard to their interfacial tensile strength were detected, although failure mode analyses revealed a higher interfacial stability of the PE-CVD films compared to the PVD films. Twenty-eight day exposure to simulated body fluid (SBF) at 37 °C revealed a partial delamination of the thermally deposited PVD films whereas the PE-CVD films stayed largely intact. SiOx layers deposited by both PVD and PE-CVD may thus serve as viable adhesion-promoters for subsequent organosilane coupling agent binding to α-alumina. However, PE-CVD appears to be favorable for long-term direct film exposure to aqueous

  19. pH-dependent immobilization of proteins on surfaces functionalized by plasma-enhanced chemical vapor deposition of poly(acrylic acid)- and poly(ethylene oxide)-like films.

    PubMed

    Belegrinou, Serena; Mannelli, Ilaria; Lisboa, Patricia; Bretagnol, Frederic; Valsesia, Andrea; Ceccone, Giacomo; Colpo, Pascal; Rauscher, Hubert; Rossi, François

    2008-07-15

    The interaction of the proteins bovine serum albumin (BSA), lysozyme (Lys), lactoferrin (Lf), and fibronectin (Fn) with surfaces of protein-resistant poly(ethylene oxide) (PEO) and protein-adsorbing poly(acrylic acid) (PAA) fabricated by plasma-enhanced chemical vapor deposition has been studied with quartz crystal microbalance with dissipation monitoring (QCM-D). We focus on several parameters which are crucial for protein adsorption, i.e., the isoelectric point (pI) of the proteins, the pH of the solution, and the charge density of the sorbent surfaces, with the zeta-potential as a measure for the latter. The measurements reveal adsorption stages characterized by different segments in the plots of the dissipation vs frequency change. PEO remains protein-repellent for BSA, Lys, and Lf at pH 4-8.5, while weak adsorption of Fn was observed. On PAA, different stages of protein adsorption processes could be distinguished under most experimental conditions. BSA, Lys, Lf, and Fn generally exhibit a rapid initial adsorption phase on PAA, often followed by slower processes. The evaluation of the adsorption kinetics also reveals different adsorption stages, whereas the number of these stages does not always correspond to the structurally different phases as revealed by the D- f plots. The results presented here, together with information obtained in previous studies by other groups on the properties of these proteins and their interaction with surfaces, allow us to develop an adsorption scenario for each of these proteins, which takes into account electrostatic protein-surface and protein-protein interaction, but also the pH-dependent properties of the proteins, such as shape and exposure of specific domains. PMID:18549295

  20. Microwave spectroscopy of chemical warfare agents: prospects for remote sensing

    NASA Astrophysics Data System (ADS)

    Samuels, Alan C.; Jensen, James O.; Suenram, Richard D.; Hight Walker, Angela R.; Woolard, Dwight L.

    1999-07-01

    The high level of interest in the sensor development community in millimeter wave technology development demonstrates the potential for several multipurpose applications of millimeter wave sensors. The potential for remote sensing of hazardous chemical materials based on their millimeter wave rotational signatures is yet another possible applications, offering certain distinct advantages over FTIR remote sensing. The high specificity of the rotational spectra to the molecular structures affords the capability of detecting chemical warfare (CW) agents and degradation products in complex mixtures including water vapor and smoke, an important consideration in military applications. Furthermore, the rotational modes are not complicated by electronic or vibrational transitions, reducing the potential for false alarms. We have conducted microwave spectroscopic measurements on two CW nerve agents (sarin and soman) and one blister agent (H-mustard). The assignment of the observed band furnishes us with an extremely accurate tool for predicting the rotational spectrum of these agents at any arbitrary frequency. By factoring in the effects of pressure (Lorentzian broadening and intensity reduction), we present the predicted spectral signatures of the CW agents in the 80 - 300 GHz region. This frequency regime is important for atmospheric monitoring as it exploits the wide bandwidth capability of millimeter wave sensors as well as the atmospheric windows that occur in this region.

  1. Ellipsometric investigation of nitrogen doped diamond thin films grown in microwave CH4/H2/N2 plasma enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Ficek, Mateusz; Sankaran, Kamatchi J.; Ryl, Jacek; Bogdanowicz, Robert; Lin, I.-Nan; Haenen, Ken; Darowicki, Kazimierz

    2016-06-01

    The influence of N2 concentration (1%-8%) in CH4/H2/N2 plasma on structure and optical properties of nitrogen doped diamond (NDD) films was investigated. Thickness, roughness, and optical properties of the NDD films in the VIS-NIR range were investigated on the silicon substrates using spectroscopic ellipsometry. The samples exhibited relatively high refractive index (2.6 ± 0.25 at 550 nm) and extinction coefficient (0.05 ± 0.02 at 550 nm) with a transmittance of 60%. The optical investigation was supported by the molecular and atomic data delivered by Raman studies, bright field transmission electron microscopy imaging, and X-ray photoelectron spectroscopy diagnostics. Those results revealed that while the films grown in CH4/H2 plasma contained micron-sized diamond grains, the films grown using CH4/H2/(4%)N2 plasma exhibited ultranano-sized diamond grains along with n-diamond and i-carbon clusters, which were surrounded by amorphous carbon grain boundaries.

  2. Parameters affecting the microwave-specific acceleration of a chemical reaction.

    PubMed

    Chen, Po-Kai; Rosana, Michael R; Dudley, Gregory B; Stiegman, A E

    2014-08-15

    Under appropriate conditions, significant microwave-specific enhancement of the reaction rate of an organic chemical reaction can be observed. Specifically, the unimolecular Claisen rearrangement of allyl p-nitrophenyl ether (ApNE) dissolved in naphthalene was studied under microwave heating and conventional convective (thermal) heating. Under constant microwave power, reaching a temperature of 185 °C, a 4-fold rate enhancement was observed in the microwave over that using convective heating; this means that the microwave reaction was proceeding at an effective temperature of 202 °C. Conversely, under constant temperature microwave conditions (200 °C), a negligible (∼1.5-fold) microwave-specific rate enhancement was observed. The largest microwave-specific rate enhancement was observed when a series of 300 W pulses, programmed for 145-175 °C and 85-155 °C cycles, where 2- and 9-fold rate enhancements, over what would be predicted by conventional thermal heating, was observed, respectively. The postulated origins of the microwave-specific effect are purely thermal and arise from selective heating of ApNE, a microwave-absorbing reactant in a nonabsorbing solvent. Under these conditions, excess heat is accumulated in the domains around the ApNE solute so that it experiences a higher effective temperature than the measured temperature of the bulk medium, resulting in an accelerated unimolecular rearrangement. PMID:25050921

  3. A chemical/microwave technique for the measurement of bulk minority carrier lifetime in silicon wafers

    NASA Technical Reports Server (NTRS)

    Luke, Keung L.; Cheng, Li-Jen

    1988-01-01

    A chemical/microwave technique for the measurement of bulk minority carrier lifetime in silicon wafers is described. This method consists of a wet chemical treatment (surface cleaning, oxidation in solution, and measurement in HF solution) to passivate the silicon surfaces, a laser diode array for carrier excitation, and a microwave bridge measuring system which is more sensitive than the microwave systems used previously for lifetime measurement. Representative experimental data are presented to demonstrate this technique. The result reveals that this method is useful for the determination of bulk lifetime of commercial silicon wafers.

  4. ‘GREENER’ CHEMICAL SYNTHESES USING MICROWAVE IRRADIATION (PRAGUE)

    EPA Science Inventory

    'Greener' solvent-free protocols involve microwave (MW) exposure of neat reactants catalyzed by the surfaces of recyclable mineral supports such as alumina, silica and clay which are applicable to a wide range of cleavage, condensation, cyclization, oxidation and reduction reacti...

  5. 'GREENER' SOLVENT-FREE CHEMICAL SYNTHESIS USING MICROWAVE IRRADIATION

    EPA Science Inventory

    Solvent-free approach that involves microwave (MW) irradiation of neat reactants (undiluted) catalyzed by the surfaces of less-expensive and recyclable mineral supports such as alumina, silica, clay, or 'doped' surfaces is presented which is applicable to a wide range of cleavage...

  6. Chemical activation by mechanochemical mixing, microwave, and ultrasonic irradiation

    EPA Science Inventory

    The use of emerging MW-assisted chemistry techniques in conjunction with benign reaction media is dramatically reducing chemical waste ad reaction times in several organic syntheses and chemical transformations. This editorial comments on the recent developments in mechanochemica...

  7. Organo- and nano-catalyst in greener reaction medium: Microwave-assisted expedient synthesis of fine chemicals

    EPA Science Inventory

    The use of emerging microwave (MW) -assisted chemistry techniques is dramatically reducing chemical waste and reaction times in several organic syntheses and chemical transformations. A brief account of our experiences in developing MW-assisted organic transformations, which invo...

  8. Simulated experiment for elimination of air contaminated with odorous chemical agents by microwave plasma burner

    SciTech Connect

    Hong, Yong Cheol; Shin, Dong Hun; Uhm, Han Sup

    2007-10-15

    An experimental study on elimination of odorous chemical agent was carried out by making use of a microwave plasma burner, which consists of a microwave plasma torch and a reaction chamber with a fuel injector. Injection of hydrocarbon fuels into a high-temperature microwave torch plasma generates a plasma flame. The plasma flame can eliminate the odorous chemical agent diluted in air or purify the interior air of a large volume in isolated spaces. The specially designed reaction chamber eliminated H{sub 2}S and NH{sub 3} diluted in airflow rate of 5000 lpm (liters per minute), showing {beta} values of 46.52 and 39.69 J/l, respectively.

  9. MICROWAVE-INDUCED RAPID CHEMICAL FUNCTIONALIZATION OF SINGLE-WALLED CARBON NANOTUBES (R830901)

    EPA Science Inventory


    Abstract

    The microwave-induced chemical functionalization of single-walled carbon nanotubes (SWNTs) is reported. The major advantage of this high-energy procedure is that it reduced the reaction time to the order of minutes and the number of steps in the reac...

  10. Microwave assisted total synthesis of a benzothiophene-based new chemical entity (NCE)

    EPA Science Inventory

    Pharmaceutical scientists are required to generate diverse arrays of complex targets in short span of time, which can now be achieved by microwave-assisted organic synthesis. New chemical entities (NCE) can be built in a fraction of the time using this technique. However, there a...