Haertling, Gene H.; Lee, Burtrand; Hsi, Dennis; Modi, Vibhakar; Marone, Matt
An approach to the application of high Tc ceramic superconductors to practical circuit elements was developed and demonstrated. This method, known as the rigid-conductor process (RCP), involves the combination of a pre-formed, sintered, and tested superconductor material with an appropriate, rigid substrate via an epoxy adhesive which also serves to encapsulate the element from the ambient environment. Emphasis was on the practical means to achieve functional, reliable, and reproducible components. Although all of the work described in this report involved a YBa2Cu3Osub(7-x) high Tc superconductor material, the techniques developed and conclusions reached are equally applicable to other high Tc materials.