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Sample records for 3d integrated circuit

  1. 3D packaging for integrated circuit systems

    SciTech Connect

    Chu, D.; Palmer, D.W.

    1996-11-01

    A goal was set for high density, high performance microelectronics pursued through a dense 3D packing of integrated circuits. A {open_quotes}tool set{close_quotes} of assembly processes have been developed that enable 3D system designs: 3D thermal analysis, silicon electrical through vias, IC thinning, mounting wells in silicon, adhesives for silicon stacking, pretesting of IC chips before commitment to stacks, and bond pad bumping. Validation of these process developments occurred through both Sandia prototypes and subsequent commercial examples.

  2. Development of 3D integrated circuits for HEP

    SciTech Connect

    Yarema, R.; /Fermilab

    2006-09-01

    Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing effective circuit density. Recent advances in industry have made 3D integrated circuits an option for HEP. The 3D technology is discussed in this paper and several examples are shown. Design of a 3D demonstrator chip for the ILC is presented.

  3. Radiation Effects in 3D Integrated SOl SRAM Circuits

    DTIC Science & Technology

    2011-08-23

    Comparing Neutrons and Protons Data Monoenergetic neutrons and protons are used to characterize single event effects in electronics circuits, and are...for proton irradiation with energies between 4.8 and 500 MeV. Results are compared with 14-MeV neutron irradiation. Single event upset cross-section...fabricating circuits for space applications. singIe event effects, SOl, fully depleted, 3D integration, neutron , protons, upset cross-section U U U U SAR

  4. Tunable quantum interference in a 3D integrated circuit.

    PubMed

    Chaboyer, Zachary; Meany, Thomas; Helt, L G; Withford, Michael J; Steel, M J

    2015-04-27

    Integrated photonics promises solutions to questions of stability, complexity, and size in quantum optics. Advances in tunable and non-planar integrated platforms, such as laser-inscribed photonics, continue to bring the realisation of quantum advantages in computation and metrology ever closer, perhaps most easily seen in multi-path interferometry. Here we demonstrate control of two-photon interference in a chip-scale 3D multi-path interferometer, showing a reduced periodicity and enhanced visibility compared to single photon measurements. Observed non-classical visibilities are widely tunable, and explained well by theoretical predictions based on classical measurements. With these predictions we extract Fisher information approaching a theoretical maximum. Our results open a path to quantum enhanced phase measurements.

  5. Dielectric Spectroscopic Detection of Early Failures in 3-D Integrated Circuits

    PubMed Central

    Okoro, C. A.; Ahn, Jung-Joon; You, Lin; Kopanski, Joseph J.

    2015-01-01

    The commercial introduction of three dimensional integrated circuits (3D-ICs) has been hindered by reliability challenges, such as stress related failures, resistivity changes, and unexplained early failures. In this paper, we discuss a new RF-based metrology, based on dielectric spectroscopy, for detecting and characterizing electrically active defects in fully integrated 3D devices. These defects are traceable to the chemistry of the insolation dielectrics used in the through silicon via (TSV) construction. We show that these defects may be responsible for some of the unexplained early reliability failures observed in TSV enabled 3D devices. PMID:26664695

  6. A multiply-add engine with monolithically integrated 3D memristor crossbar/CMOS hybrid circuit.

    PubMed

    Chakrabarti, B; Lastras-Montaño, M A; Adam, G; Prezioso, M; Hoskins, B; Cheng, K-T; Strukov, D B

    2017-02-14

    Silicon (Si) based complementary metal-oxide semiconductor (CMOS) technology has been the driving force of the information-technology revolution. However, scaling of CMOS technology as per Moore's law has reached a serious bottleneck. Among the emerging technologies memristive devices can be promising for both memory as well as computing applications. Hybrid CMOS/memristor circuits with CMOL (CMOS + "Molecular") architecture have been proposed to combine the extremely high density of the memristive devices with the robustness of CMOS technology, leading to terabit-scale memory and extremely efficient computing paradigm. In this work, we demonstrate a hybrid 3D CMOL circuit with 2 layers of memristive crossbars monolithically integrated on a pre-fabricated CMOS substrate. The integrated crossbars can be fully operated through the underlying CMOS circuitry. The memristive devices in both layers exhibit analog switching behavior with controlled tunability and stable multi-level operation. We perform dot-product operations with the 2D and 3D memristive crossbars to demonstrate the applicability of such 3D CMOL hybrid circuits as a multiply-add engine. To the best of our knowledge this is the first demonstration of a functional 3D CMOL hybrid circuit.

  7. A multiply-add engine with monolithically integrated 3D memristor crossbar/CMOS hybrid circuit

    NASA Astrophysics Data System (ADS)

    Chakrabarti, B.; Lastras-Montaño, M. A.; Adam, G.; Prezioso, M.; Hoskins, B.; Cheng, K.-T.; Strukov, D. B.

    2017-02-01

    Silicon (Si) based complementary metal-oxide semiconductor (CMOS) technology has been the driving force of the information-technology revolution. However, scaling of CMOS technology as per Moore’s law has reached a serious bottleneck. Among the emerging technologies memristive devices can be promising for both memory as well as computing applications. Hybrid CMOS/memristor circuits with CMOL (CMOS + “Molecular”) architecture have been proposed to combine the extremely high density of the memristive devices with the robustness of CMOS technology, leading to terabit-scale memory and extremely efficient computing paradigm. In this work, we demonstrate a hybrid 3D CMOL circuit with 2 layers of memristive crossbars monolithically integrated on a pre-fabricated CMOS substrate. The integrated crossbars can be fully operated through the underlying CMOS circuitry. The memristive devices in both layers exhibit analog switching behavior with controlled tunability and stable multi-level operation. We perform dot-product operations with the 2D and 3D memristive crossbars to demonstrate the applicability of such 3D CMOL hybrid circuits as a multiply-add engine. To the best of our knowledge this is the first demonstration of a functional 3D CMOL hybrid circuit.

  8. A multiply-add engine with monolithically integrated 3D memristor crossbar/CMOS hybrid circuit

    PubMed Central

    Chakrabarti, B.; Lastras-Montaño, M. A.; Adam, G.; Prezioso, M.; Hoskins, B.; Cheng, K.-T.; Strukov, D. B.

    2017-01-01

    Silicon (Si) based complementary metal-oxide semiconductor (CMOS) technology has been the driving force of the information-technology revolution. However, scaling of CMOS technology as per Moore’s law has reached a serious bottleneck. Among the emerging technologies memristive devices can be promising for both memory as well as computing applications. Hybrid CMOS/memristor circuits with CMOL (CMOS + “Molecular”) architecture have been proposed to combine the extremely high density of the memristive devices with the robustness of CMOS technology, leading to terabit-scale memory and extremely efficient computing paradigm. In this work, we demonstrate a hybrid 3D CMOL circuit with 2 layers of memristive crossbars monolithically integrated on a pre-fabricated CMOS substrate. The integrated crossbars can be fully operated through the underlying CMOS circuitry. The memristive devices in both layers exhibit analog switching behavior with controlled tunability and stable multi-level operation. We perform dot-product operations with the 2D and 3D memristive crossbars to demonstrate the applicability of such 3D CMOL hybrid circuits as a multiply-add engine. To the best of our knowledge this is the first demonstration of a functional 3D CMOL hybrid circuit. PMID:28195239

  9. Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV).

    PubMed

    Shen, Wen-Wei; Chen, Kuan-Neng

    2017-12-01

    3D integration with through-silicon via (TSV) is a promising candidate to perform system-level integration with smaller package size, higher interconnection density, and better performance. TSV fabrication is the key technology to permit communications between various strata of the 3D integration system. TSV fabrication steps, such as etching, isolation, metallization processes, and related failure modes, as well as other characterizations are discussed in this invited review paper.

  10. Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

    NASA Astrophysics Data System (ADS)

    Shen, Wen-Wei; Chen, Kuan-Neng

    2017-01-01

    3D integration with through-silicon via (TSV) is a promising candidate to perform system-level integration with smaller package size, higher interconnection density, and better performance. TSV fabrication is the key technology to permit communications between various strata of the 3D integration system. TSV fabrication steps, such as etching, isolation, metallization processes, and related failure modes, as well as other characterizations are discussed in this invited review paper.

  11. Conception d'un circuit d'etouffement pour photodiodes a avalanche en mode geiger pour integration heterogene 3d

    NASA Astrophysics Data System (ADS)

    Boisvert, Alexandre

    Le Groupe de Recherche en Appareillage Medical de Sherbrooke (GRAMS) travaille actuellement sur un programme de recherche portant sur des photodiodes a avalanche mono-photoniques (PAMP) operees en mode Geiger en vue d'une application a la tomographie d'emission par positrons (TEP). Pour operer dans ce mode; la PAMP, ou SPAD selon l'acronyme anglais (Single Photon Avalanche Diode), requiert un circuit d'etouffement (CE) pour, d'une part, arreter l'avalanche pouvant causer sa destruction et, d'autre part. la reinitialiser en mode d'attente d'un nouveau photon. Le role de ce CE comprend egalement une electronique de communication vers les etages de traitement avance de signaux. La performance temporelle optimale du CE est realisee lorsqu'il est juxtapose a la PAMP. Cependant, cela entraine une reduction de la surface photosensible ; un element crucial en imagerie. L'integration 3D, a base d'interconnexions verticales, offre une solution elegante et performante a cette problematique par l'empilement de circuits integres possedant differentes fonctions (PAMP, CE et traitement avance de signaux). Dans l'approche proposee, des circuits d'etouffement de 50 pm x 50 pm realises sur une technologie CMOS 130 mn 3D Tezzaron, contenant chacun 112 transistors, sont matrices afin de correspondre a une matrice de PAMP localisee sur une couche electronique superieure. Chaque circuit d'etouffement possede une gigue temporelle de 7,47 ps RMS selon des simulations faites avec le logiciel Cadence. Le CE a la flexibilite d'ajuster les temps d'etouffement et de recharge pour la PAMP tout en presentant une faible consommation de puissance (~ 0,33 mW a 33 Mcps). La conception du PAMP necessite de supporter des tensions superieures aux 3,3 V de la technologie. Pour repondre a ce probleme, des transistors a drain etendu (DEMOS) ont ete realises. En raison de retards de production par Ies fabricants, les circuits n'ont pu etre testes physiquement par des mesures. Les resultats de ce memoire

  12. Writing of 3D optical integrated circuits with ultrashort laser pulses in the presence of strong spherical aberration

    NASA Astrophysics Data System (ADS)

    Bukharin, M. A.; Skryabin, N. N.; Khudyakov, D. V.; Vartapetov, S. K.

    2016-09-01

    A novel technique was proposed for 3D femtosecond writing of waveguides and optical integrated circuits in the presence of strong spherical aberration, caused by inscription at significantly different depth under the surface of optical glasses and crystals. Strong negative effect of spherical aberration and related asymmetry of created structures was reduced due to transition to the cumulative thermal regime of femtosecond interaction with the material. The differences in the influence of spherical aberration effect in a broad depth range (larger than 200 µm) was compensated by dynamic adjustment of laser pulse energy during the process of waveguides recording. The presented approach has been experimentally implemented in fused silica. Obtained results can be used in production of a broad class of femtosecond written three-dimensional integrated optical systems, inscripted at non-optimal (for focusing lens) optical depth or in significantly extended range of depths.

  13. The SVX3D integrated circuit for dead-timeless silicon strip readout

    NASA Astrophysics Data System (ADS)

    Garcia-Sciveres, M.; Milgrome, O.; Zimmerman, T.; Volobouev, I.; Ely, R. P.; Connolly, A.; Fish, D.; Affolder, T.; Sill, A.

    1999-10-01

    The revision D of the SVX3 readout IC has been fabricated in the Honeywell radiation-hard 0.8 μm bulk CMOS process, for instrumenting 712,704 silicon strips in the upgrade to the Collider Detector at Fermilab. This final revision incorporates new features and changes to the original architecture that were added to meet the goal of dead-timeless operation. This paper describes the features central to dead-timeless operation, and presents test data for un-irradiated and irradiated SVX3D chips.

  14. Free-space coherent optical communication with orbital angular, momentum multiplexing/demultiplexing using a hybrid 3D photonic integrated circuit.

    PubMed

    Guan, Binbin; Scott, Ryan P; Qin, Chuan; Fontaine, Nicolas K; Su, Tiehui; Ferrari, Carlo; Cappuzzo, Mark; Klemens, Fred; Keller, Bob; Earnshaw, Mark; Yoo, S J B

    2014-01-13

    We demonstrate free-space space-division-multiplexing (SDM) with 15 orbital angular momentum (OAM) states using a three-dimensional (3D) photonic integrated circuit (PIC). The hybrid device consists of a silica planar lightwave circuit (PLC) coupled to a 3D waveguide circuit to multiplex/demultiplex OAM states. The low excess loss hybrid device is used in individual and two simultaneous OAM states multiplexing and demultiplexing link experiments with a 20 Gb/s, 1.67 b/s/Hz quadrature phase shift keyed (QPSK) signal, which shows error-free performance for 379,960 tested bits for all OAM states.

  15. Characterization of the Effect of thermal Cycling on the Signal Integrity of Interconnect Structures used in 3D Integrated Circuits

    NASA Astrophysics Data System (ADS)

    Kandel, Binayak

    2012-03-01

    The performance and reliability of the microelectronic devices are significantly influenced by the condition of interconnects in Integrated Circuits (IC). These interconnects serve primarily as signal transmission pathways in IC. Good interconnects enable free flow of electrical signals with low impedance. However, microelectronic devices are continuously subjected to fluctuating temperature conditions during their lifetime, which affect the signal integrity of interconnects. Therefore, this project takes a look at the effect of repeated temperature cycling on the reliability and performance of interconnects. Two types of interconnects: Back-End-of-Line (BEOL) and Through-Si-Via (TSV) were studied. We simulate the real world conditions by applying repeated temperature cycling, and use an RF network analyzer to extract the reflection and transmission signal characteristics of the interconnects. The mean-time-to-failure is determined upon their breakdown which is followed by the failure analysis to determine the root cause of failure.

  16. 3D Scan Systems Integration

    DTIC Science & Technology

    2007-11-02

    AGENCY USE ONLY (Leave Blank) 2. REPORT DATE 5 Feb 98 4. TITLE AND SUBTITLE 3D Scan Systems Integration REPORT TYPE AND DATES COVERED...2-89) Prescribed by ANSI Std. Z39-1 298-102 [ EDO QUALITY W3PECTEDI DLA-ARN Final Report for US Defense Logistics Agency on DDFG-T2/P3: 3D...SCAN SYSTEMS INTEGRATION Contract Number SPO100-95-D-1014 Contractor Ohio University Delivery Order # 0001 Delivery Order Title 3D Scan Systems

  17. Thermionic integrated circuits

    SciTech Connect

    MacRoberts, M.; Brown, D.R.; Dooley, R.; Lemons, R.; Lynn, D.; McCormick, B.; Mombourquette, C.; Sinah, D.

    1986-01-01

    Thermionic integrated circuits combine vacuum-tube technology with integrated-circuit techniques to form integrated vacuum circuits. These circuits are capable of extended operation in both high-temperature and high-radiation environments.

  18. Vertically Integrated Circuits at Fermilab

    SciTech Connect

    Deptuch, Grzegorz; Demarteau, Marcel; Hoff, James; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom; /Fermilab

    2010-01-01

    The exploration of vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning, and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. For the first time, Fermilab has organized a 3D MPW run, to which more than 25 different designs have been submitted by the consortium.

  19. Self-Patterning of Silica/Epoxy Nanocomposite Underfill by Tailored Hydrophilic-Superhydrophobic Surfaces for 3D Integrated Circuit (IC) Stacking.

    PubMed

    Tuan, Chia-Chi; James, Nathan Pataki; Lin, Ziyin; Chen, Yun; Liu, Yan; Moon, Kyoung-Sik; Li, Zhuo; Wong, C P

    2017-03-15

    As microelectronics are trending toward smaller packages and integrated circuit (IC) stacks nowadays, underfill, the polymer composite filled in between the IC chip and the substrate, becomes increasingly important for interconnection reliability. However, traditional underfills cannot meet the requirements for low-profile and fine pitch in high density IC stacking packages. Post-applied underfills have difficulties in flowing into the small gaps between the chip and the substrate, while pre-applied underfills face filler entrapment at bond pads. In this report, we present a self-patterning underfilling technology that uses selective wetting of underfill on Cu bond pads and Si3N4 passivation via surface energy engineering. This novel process, fully compatible with the conventional underfilling process, eliminates the issue of filler entrapment in typical pre-applied underfilling process, enabling high density and fine pitch IC die bonding.

  20. Engineering-Aligned 3D Neural Circuit in Microfluidic Device.

    PubMed

    Bang, Seokyoung; Na, Sangcheol; Jang, Jae Myung; Kim, Jinhyun; Jeon, Noo Li

    2016-01-07

    The brain is one of the most important and complex organs in the human body. Although various neural network models have been proposed for in vitro 3D neuronal networks, it has been difficult to mimic functional and structural complexity of the in vitro neural circuit. Here, a microfluidic model of a simplified 3D neural circuit is reported. First, the microfluidic device is filled with Matrigel and continuous flow is delivered across the device during gelation. The fluidic flow aligns the extracellular matrix (ECM) components along the flow direction. Following the alignment of ECM fibers, neurites of primary rat cortical neurons are grown into the Matrigel at the average speed of 250 μm d(-1) and form axon bundles approximately 1500 μm in length at 6 days in vitro (DIV). Additionally, neural networks are developed from presynaptic to postsynaptic neurons at 14 DIV. The establishment of aligned 3D neural circuits is confirmed with the immunostaining of PSD-95 and synaptophysin and the observation of calcium signal transmission.

  1. Oblique incidence of semi-guided waves on step-like folds in planar dielectric slabs: Lossless vertical interconnects in 3D integrated photonic circuits

    NASA Astrophysics Data System (ADS)

    Hildebrandt, Andre; Alhaddad, Samer; Hammer, Manfred; Förstner, Jens

    2016-02-01

    Semi-guided light propagation across linear folds of slab waveguides is being considered. Radiation losses vanish beyond certain critical angles of incidence, as can be understood by arguments resembling Snell's law. One thus realizes lossless propagation through 90-degree corner configurations, where the remaining guided waves are still subject to pronounced reflection and polarization conversion. A step-like system of two of these sharp corners can then be viewed as a system akin to a Fabry-Perot interferometer, with two partial reflectors at a distance given by the vertical separation of the slab cores. The respective resonance effect enables full transmission of semiguided, laterally plane waves through the step structures. One obtains a configuration that optically connects guiding layers at different elevation levels in a 3-D integrated optical chip, without radiation losses, over large distances, and reasonably broadband. We show rigorous quasi-analytical results for typical high-contrast Si/SiO2 structures. Although the full-transmission effect requires a symmetric system, here realized by slab waveguides with a silicon core sandwiched between thick silica substrate and cover layers, simulations for configurations with air cover show that a certain asymmetry can well be afforded.

  2. 3D integral imaging with optical processing

    NASA Astrophysics Data System (ADS)

    Martínez-Corral, Manuel; Martínez-Cuenca, Raúl; Saavedra, Genaro; Javidi, Bahram

    2008-04-01

    Integral imaging (InI) systems are imaging devices that provide auto-stereoscopic images of 3D intensity objects. Since the birth of this new technology, InI systems have faced satisfactorily many of their initial drawbacks. Basically, two kind of procedures have been used: digital and optical procedures. The "3D Imaging and Display Group" at the University of Valencia, with the essential collaboration of Prof. Javidi, has centered its efforts in the 3D InI with optical processing. Among other achievements, our Group has proposed the annular amplitude modulation for enlargement of the depth of field, dynamic focusing for reduction of the facet-braiding effect, or the TRES and MATRES devices to enlarge the viewing angle.

  3. Self assembled structures for 3D integration

    NASA Astrophysics Data System (ADS)

    Rao, Madhav

    Three dimensional (3D) micro-scale structures attached to a silicon substrate have various applications in microelectronics. However, formation of 3D structures using conventional micro-fabrication techniques are not efficient and require precise control of processing parameters. Self assembly is a method for creating 3D structures that takes advantage of surface area minimization phenomena. Solder based self assembly (SBSA), the subject of this dissertation, uses solder as a facilitator in the formation of 3D structures from 2D patterns. Etching a sacrificial layer underneath a portion of the 2D pattern allows the solder reflow step to pull those areas out of the substrate plane resulting in a folded 3D structure. Initial studies using the SBSA method demonstrated low yields in the formation of five different polyhedra. The failures in folding were primarily attributed to nonuniform solder deposition on the underlying metal pads. The dip soldering method was analyzed and subsequently refined. A modified dip soldering process provided improved yield among the polyhedra. Solder bridging referred as joining of solder deposited on different metal patterns in an entity influenced the folding mechanism. In general, design parameters such as small gap-spacings and thick metal pads were found to favor solder bridging for all patterns studied. Two types of soldering: face and edge soldering were analyzed. Face soldering refers to the application of solder on the entire metal face. Edge soldering indicates application of solder only on the edges of the metal face. Mechanical grinding showed that face soldered SBSA structures were void free and robust in nature. In addition, the face soldered 3D structures provide a consistent heat resistant solder standoff height that serve as attachments in the integration of dissimilar electronic technologies. Face soldered 3D structures were developed on the underlying conducting channel to determine the thermo-electric reliability of

  4. Vertically Integrated Circuits at Fermilab

    SciTech Connect

    Deptuch, Grzegorz; Demarteau, Marcel; Hoff, James; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom; /Fermilab

    2009-01-01

    The exploration of the vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. The consortium has submitted over 25 different designs for the Fermilab organized MPW run organized for the first time.

  5. 3D Integration for Wireless Multimedia

    NASA Astrophysics Data System (ADS)

    Kimmich, Georg

    The convergence of mobile phone, internet, mapping, gaming and office automation tools with high quality video and still imaging capture capability is becoming a strong market trend for portable devices. High-density video encode and decode, 3D graphics for gaming, increased application-software complexity and ultra-high-bandwidth 4G modem technologies are driving the CPU performance and memory bandwidth requirements close to the PC segment. These portable multimedia devices are battery operated, which requires the deployment of new low-power-optimized silicon process technologies and ultra-low-power design techniques at system, architecture and device level. Mobile devices also need to comply with stringent silicon-area and package-volume constraints. As for all consumer devices, low production cost and fast time-to-volume production is key for success. This chapter shows how 3D architectures can bring a possible breakthrough to meet the conflicting power, performance and area constraints. Multiple 3D die-stacking partitioning strategies are described and analyzed on their potential to improve the overall system power, performance and cost for specific application scenarios. Requirements and maturity of the basic process-technology bricks including through-silicon via (TSV) and die-to-die attachment techniques are reviewed. Finally, we highlight new challenges which will arise with 3D stacking and an outlook on how they may be addressed: Higher power density will require thermal design considerations, new EDA tools will need to be developed to cope with the integration of heterogeneous technologies and to guarantee signal and power integrity across the die stack. The silicon/wafer test strategies have to be adapted to handle high-density IO arrays, ultra-thin wafers and provide built-in self-test of attached memories. New standards and business models have to be developed to allow cost-efficient assembly and testing of devices from different silicon and technology

  6. Integration of real-time 3D image acquisition and multiview 3D display

    NASA Astrophysics Data System (ADS)

    Zhang, Zhaoxing; Geng, Zheng; Li, Tuotuo; Li, Wei; Wang, Jingyi; Liu, Yongchun

    2014-03-01

    Seamless integration of 3D acquisition and 3D display systems offers enhanced experience in 3D visualization of the real world objects or scenes. The vivid representation of captured 3D objects displayed on a glasses-free 3D display screen could bring the realistic viewing experience to viewers as if they are viewing real-world scene. Although the technologies in 3D acquisition and 3D display have advanced rapidly in recent years, effort is lacking in studying the seamless integration of these two different aspects of 3D technologies. In this paper, we describe our recent progress on integrating a light-field 3D acquisition system and an autostereoscopic multiview 3D display for real-time light field capture and display. This paper focuses on both the architecture design and the implementation of the hardware and the software of this integrated 3D system. A prototype of the integrated 3D system is built to demonstrate the real-time 3D acquisition and 3D display capability of our proposed system.

  7. Linear integrated circuits

    NASA Astrophysics Data System (ADS)

    Young, T.

    This book is intended to be used as a textbook in a one-semester course at a variety of levels. Because of self-study features incorporated, it may also be used by practicing electronic engineers as a formal and thorough introduction to the subject. The distinction between linear and digital integrated circuits is discussed, taking into account digital and linear signal characteristics, linear and digital integrated circuit characteristics, the definitions for linear and digital circuits, applications of digital and linear integrated circuits, aspects of fabrication, packaging, and classification and numbering. Operational amplifiers are considered along with linear integrated circuit (LIC) power requirements and power supplies, voltage and current regulators, linear amplifiers, linear integrated circuit oscillators, wave-shaping circuits, active filters, DA and AD converters, demodulators, comparators, instrument amplifiers, current difference amplifiers, analog circuits and devices, and aspects of troubleshooting.

  8. High-performance, mechanically flexible, and vertically integrated 3D carbon nanotube and InGaZnO complementary circuits with a temperature sensor.

    PubMed

    Honda, Wataru; Harada, Shingo; Ishida, Shohei; Arie, Takayuki; Akita, Seiji; Takei, Kuniharu

    2015-08-26

    A vertically integrated inorganic-based flexible complementary metal-oxide-semiconductor (CMOS) inverter with a temperature sensor with a high inverter gain of ≈50 and a low power consumption of <7 nW mm(-1) is demonstrated using a layer-by-layer assembly process. In addition, the negligible influence of the mechanical flexibility on the performance of the CMOS inverter and the temperature dependence of the CMOS inverter characteristics are discussed.

  9. Lightning Modelling: From 3D to Circuit Approach

    NASA Astrophysics Data System (ADS)

    Moussa, H.; Abdi, M.; Issac, F.; Prost, D.

    2012-05-01

    The topic of this study is electromagnetic environment and electromagnetic interferences (EMI) effects, specifically the modelling of lightning indirect effects [1] on aircraft electrical systems present on deported and highly exposed equipments, such as nose landing gear (NLG) and nacelle, through a circuit approach. The main goal of the presented work, funded by a French national project: PREFACE, is to propose a simple equivalent electrical circuit to represent a geometrical structure, taking into account mutual, self inductances, and resistances, which play a fundamental role in the lightning current distribution. Then this model is intended to be coupled to a functional one, describing a power train chain composed of: a converter, a shielded power harness and a motor or a set of resistors used as a load for the converter. The novelty here, is to provide a pre-sizing qualitative approach allowing playing on integration in pre-design phases. This tool intends to offer a user-friendly way for replying rapidly to calls for tender, taking into account the lightning constraints. Two cases are analysed: first, a NLG that is composed of tubular pieces that can be easily approximated by equivalent cylindrical straight conductors. Therefore, passive R, L, M elements of the structure can be extracted through analytical engineer formulas such as those implemented in the partial element equivalent circuit (PEEC) [2] technique. Second, the same approach is intended to be applied on an electrical de-icing nacelle sub-system.

  10. Hardware Trust Implications of 3-D Integration

    DTIC Science & Technology

    2010-12-01

    enhancing a commod- ity processor with a variety of security functions. This paper examines the 3-D design approach and provides an analysis concluding...of key components. The question addressed by this paper is, “Can a 3-D control plane provide useful secure services when it is conjoined with an...untrust- worthy computation plane?” Design-level investigation of this question yields a definite yes. This paper explores 3- D applications and their

  11. 3D plasmonic nanoantennas integrated with MEA biosensors.

    PubMed

    Dipalo, Michele; Messina, Gabriele C; Amin, Hayder; La Rocca, Rosanna; Shalabaeva, Victoria; Simi, Alessandro; Maccione, Alessandro; Zilio, Pierfrancesco; Berdondini, Luca; De Angelis, Francesco

    2015-02-28

    Neuronal signaling in brain circuits occurs at multiple scales ranging from molecules and cells to large neuronal assemblies. However, current sensing neurotechnologies are not designed for parallel access of signals at multiple scales. With the aim of combining nanoscale molecular sensing with electrical neural activity recordings within large neuronal assemblies, in this work three-dimensional (3D) plasmonic nanoantennas are integrated with multielectrode arrays (MEA). Nanoantennas are fabricated by fast ion beam milling on optical resist; gold is deposited on the nanoantennas in order to connect them electrically to the MEA microelectrodes and to obtain plasmonic behavior. The optical properties of these 3D nanostructures are studied through finite elements method (FEM) simulations that show a high electromagnetic field enhancement. This plasmonic enhancement is confirmed by surface enhancement Raman spectroscopy of a dye performed in liquid, which presents an enhancement of almost 100 times the incident field amplitude at resonant excitation. Finally, the reported MEA devices are tested on cultured rat hippocampal neurons. Neurons develop by extending branches on the nanostructured electrodes and extracellular action potentials are recorded over multiple days in vitro. Raman spectra of living neurons cultured on the nanoantennas are also acquired. These results highlight that these nanostructures could be potential candidates for combining electrophysiological measures of large networks with simultaneous spectroscopic investigations at the molecular level.

  12. Monolithic microwave integrated circuits

    NASA Astrophysics Data System (ADS)

    Pucel, R. A.

    Monolithic microwave integrated circuits (MMICs), a new microwave technology which is expected to exert a profound influence on microwave circuit designs for future military systems as well as for the commercial and consumer markets, is discussed. The book contains an historical discussion followed by a comprehensive review presenting the current status in the field. The general topics of the volume are: design considerations, materials and processing considerations, monolithic circuit applications, and CAD, measurement, and packaging techniques. All phases of MMIC technology are covered, from design to testing.

  13. Three wafer stacking for 3D integration.

    SciTech Connect

    Greth, K. Douglas; Ford, Christine L.; Lantz, Jeffrey W.; Shinde, Subhash L.; Timon, Robert P.; Bauer, Todd M.; Hetherington, Dale Laird; Sanchez, Carlos Anthony

    2011-11-01

    Vertical wafer stacking will enable a wide variety of new system architectures by enabling the integration of dissimilar technologies in one small form factor package. With this LDRD, we explored the combination of processes and integration techniques required to achieve stacking of three or more layers. The specific topics that we investigated include design and layout of a reticle set for use as a process development vehicle, through silicon via formation, bonding media, wafer thinning, dielectric deposition for via isolation on the wafer backside, and pad formation.

  14. Photonic Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Merritt, Scott; Krainak, Michael

    2016-01-01

    Integrated photonics generally is the integration of multiple lithographically defined photonic and electronic components and devices (e.g. lasers, detectors, waveguides passive structures, modulators, electronic control and optical interconnects) on a single platform with nanometer-scale feature sizes. The development of photonic integrated circuits permits size, weight, power and cost reductions for spacecraft microprocessors, optical communication, processor buses, advanced data processing, and integrated optic science instrument optical systems, subsystems and components. This is particularly critical for small spacecraft platforms. We will give an overview of some NASA applications for integrated photonics.

  15. Integrated circuit reliability testing

    NASA Technical Reports Server (NTRS)

    Buehler, Martin G. (Inventor); Sayah, Hoshyar R. (Inventor)

    1990-01-01

    A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit.

  16. Integrated circuit reliability testing

    NASA Technical Reports Server (NTRS)

    Buehler, Martin G. (Inventor); Sayah, Hoshyar R. (Inventor)

    1988-01-01

    A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit.

  17. Bioluminescent bioreporter integrated circuit

    DOEpatents

    Simpson, Michael L.; Sayler, Gary S.; Paulus, Michael J.

    2000-01-01

    Disclosed are monolithic bioelectronic devices comprising a bioreporter and an OASIC. These bioluminescent bioreporter integrated circuit are useful in detecting substances such as pollutants, explosives, and heavy-metals residing in inhospitable areas such as groundwater, industrial process vessels, and battlefields. Also disclosed are methods and apparatus for environmental pollutant detection, oil exploration, drug discovery, industrial process control, and hazardous chemical monitoring.

  18. Wafer-Level 3D Integration for ULSI Interconnects

    NASA Astrophysics Data System (ADS)

    Gutmann, Ronald J.; Lu, Jian-Qiang

    Three-dimensional (3D) integration in a system-in-a-package (SiP) implementation (packaging-based 3D) is becoming increasingly used in consumer, computer, and communication applications where form factor is critical. In particular, the hand-held market for a growing myriad of voice, data, messaging, and imaging products is enabled by packaging-based 3D integration (i.e., stacking and connecting individual chips). The key drivers are for increased memory capacity and for heterogeneous integration of different IC technologies and functions.

  19. 3D plasmonic nanoantennas integrated with MEA biosensors

    NASA Astrophysics Data System (ADS)

    Dipalo, Michele; Messina, Gabriele C.; Amin, Hayder; La Rocca, Rosanna; Shalabaeva, Victoria; Simi, Alessandro; Maccione, Alessandro; Zilio, Pierfrancesco; Berdondini, Luca; de Angelis, Francesco

    2015-02-01

    Neuronal signaling in brain circuits occurs at multiple scales ranging from molecules and cells to large neuronal assemblies. However, current sensing neurotechnologies are not designed for parallel access of signals at multiple scales. With the aim of combining nanoscale molecular sensing with electrical neural activity recordings within large neuronal assemblies, in this work three-dimensional (3D) plasmonic nanoantennas are integrated with multielectrode arrays (MEA). Nanoantennas are fabricated by fast ion beam milling on optical resist; gold is deposited on the nanoantennas in order to connect them electrically to the MEA microelectrodes and to obtain plasmonic behavior. The optical properties of these 3D nanostructures are studied through finite elements method (FEM) simulations that show a high electromagnetic field enhancement. This plasmonic enhancement is confirmed by surface enhancement Raman spectroscopy of a dye performed in liquid, which presents an enhancement of almost 100 times the incident field amplitude at resonant excitation. Finally, the reported MEA devices are tested on cultured rat hippocampal neurons. Neurons develop by extending branches on the nanostructured electrodes and extracellular action potentials are recorded over multiple days in vitro. Raman spectra of living neurons cultured on the nanoantennas are also acquired. These results highlight that these nanostructures could be potential candidates for combining electrophysiological measures of large networks with simultaneous spectroscopic investigations at the molecular level.Neuronal signaling in brain circuits occurs at multiple scales ranging from molecules and cells to large neuronal assemblies. However, current sensing neurotechnologies are not designed for parallel access of signals at multiple scales. With the aim of combining nanoscale molecular sensing with electrical neural activity recordings within large neuronal assemblies, in this work three-dimensional (3D) plasmonic

  20. 3D augmented reality with integral imaging display

    NASA Astrophysics Data System (ADS)

    Shen, Xin; Hua, Hong; Javidi, Bahram

    2016-06-01

    In this paper, a three-dimensional (3D) integral imaging display for augmented reality is presented. By implementing the pseudoscopic-to-orthoscopic conversion method, elemental image arrays with different capturing parameters can be transferred into the identical format for 3D display. With the proposed merging algorithm, a new set of elemental images for augmented reality display is generated. The newly generated elemental images contain both the virtual objects and real world scene with desired depth information and transparency parameters. The experimental results indicate the feasibility of the proposed 3D augmented reality with integral imaging.

  1. Integrated Circuit Immunity

    NASA Technical Reports Server (NTRS)

    Sketoe, J. G.; Clark, Anthony

    2000-01-01

    This paper presents a DOD E3 program overview on integrated circuit immunity. The topics include: 1) EMI Immunity Testing; 2) Threshold Definition; 3) Bias Tee Function; 4) Bias Tee Calibration Set-Up; 5) EDM Test Figure; 6) EMI Immunity Levels; 7) NAND vs. and Gate Immunity; 8) TTL vs. LS Immunity Levels; 9) TP vs. OC Immunity Levels; 10) 7805 Volt Reg Immunity; and 11) Seventies Chip Set. This paper is presented in viewgraph form.

  2. Monolithic Optoelectronic Integrated Circuit

    NASA Technical Reports Server (NTRS)

    Bhasin, Kul B.; Walters, Wayne; Gustafsen, Jerry; Bendett, Mark

    1990-01-01

    Monolithic optoelectronic integrated circuit (OEIC) receives single digitally modulated input light signal via optical fiber and converts it into 16-channel electrical output signal. Potentially useful in any system in which digital data must be transmitted serially at high rates, then decoded into and used in parallel format at destination. Applications include transmission and decoding of control signals to phase shifters in phased-array antennas and also communication of data between computers and peripheral equipment in local-area networks.

  3. Polarimetric 3D integral imaging in photon-starved conditions.

    PubMed

    Carnicer, Artur; Javidi, Bahram

    2015-03-09

    We develop a method for obtaining 3D polarimetric integral images from elemental images recorded in low light illumination conditions. Since photon-counting images are very sparse, calculation of the Stokes parameters and the degree of polarization should be handled carefully. In our approach, polarimetric 3D integral images are generated using the Maximum Likelihood Estimation and subsequently reconstructed by means of a Total Variation Denoising filter. In this way, polarimetric results are comparable to those obtained in conventional illumination conditions. We also show that polarimetric information retrieved from photon starved images can be used in 3D object recognition problems. To the best of our knowledge, this is the first report on 3D polarimetric photon counting integral imaging.

  4. ELECTRONIC INTEGRATING CIRCUIT

    DOEpatents

    Englemann, R.H.

    1963-08-20

    An electronic integrating circuit using a transistor with a capacitor connected between the emitter and collector through which the capacitor discharges at a rate proportional to the input current at the base is described. Means are provided for biasing the base with an operating bias and for applying a voltage pulse to the capacitor for charging to an initial voltage. A current dividing diode is connected between the base and emitter of the transistor, and signal input terminal means are coupled to the juncture of the capacitor and emitter and to the base of the transistor. At the end of the integration period, the residual voltage on said capacitor is less by an amount proportional to the integral of the input signal. Either continuous or intermittent periods of integration are provided. (AEC)

  5. Digital integrated circuits

    NASA Astrophysics Data System (ADS)

    Polasek, P.; Halamik, J.

    1984-05-01

    The term semicustom designed integrated circuits denotes integrated circuits of an all purpose character in which the production of chips is completed by using one to three custom design stencil type exposure masks. This involves in most cases interconnecting masks that are used to devise the circuit function desired by the customer. Silicon plates with an all purpose gate matrix are produced up to the interconnection level and can be kept at this phase in storage, after which a customer's specific demands can be met very expediently. All purpose logic fields containing 200 logic gates on a chip and an all purpose chip to be expanded to 1,000 logic gates are discussed. The technology facilitates the devising of fast gates with a delay of approximately 5 ns and power dissipation of 1 mW. In assembly it will be possible to make use of the entire assortment of the currently used casings with 16, 18, 20, 24, 28 and 40 outlets. In addition to the development of the mentioned technology, a general methodology for design of the mentioned gate fields is currently under way.

  6. Progresses in 3D integral imaging with optical processing

    NASA Astrophysics Data System (ADS)

    Martínez-Corral, Manuel; Martínez-Cuenca, Raúl; Saavedra, Genaro; Navarro, Héctor; Pons, Amparo; Javidi, Bahram

    2008-11-01

    Integral imaging is a promising technique for the acquisition and auto-stereoscopic display of 3D scenes with full parallax and without the need of any additional devices like special glasses. First suggested by Lippmann in the beginning of the 20th century, integral imaging is based in the intersection of ray cones emitted by a collection of 2D elemental images which store the 3D information of the scene. This paper is devoted to the study, from the ray optics point of view, of the optical effects and interaction with the observer of integral imaging systems.

  7. Surviving sepsis--a 3D integrative educational simulator.

    PubMed

    Ježek, Filip; Tribula, Martin; Kulhánek, Tomáš; Mateják, Marek; Privitzer, Pavol; Šilar, Jan; Kofránek, Jiří; Lhotská, Lenka

    2015-08-01

    Computer technology offers greater educational possibilities, notably simulation and virtual reality. This paper presents a technology which serves to integrate multiple modalities, namely 3D virtual reality, node-based simulator, Physiomodel explorer and explanatory physiological simulators employing Modelica language and Unity3D platform. This emerging tool chain should allow the authors to concentrate more on educational content instead of application development. The technology is demonstrated through Surviving sepsis educational scenario, targeted on Microsoft Windows Store platform.

  8. Accommodation response measurements for integral 3D image

    NASA Astrophysics Data System (ADS)

    Hiura, H.; Mishina, T.; Arai, J.; Iwadate, Y.

    2014-03-01

    We measured accommodation responses under integral photography (IP), binocular stereoscopic, and real object display conditions, and viewing conditions of binocular and monocular viewing conditions. The equipment we used was an optometric device and a 3D display. We developed the 3D display for IP and binocular stereoscopic images that comprises a high-resolution liquid crystal display (LCD) and a high-density lens array. The LCD has a resolution of 468 dpi and a diagonal size of 4.8 inches. The high-density lens array comprises 106 x 69 micro lenses that have a focal length of 3 mm and diameter of 1 mm. The lenses are arranged in a honeycomb pattern. The 3D display was positioned 60 cm from an observer under IP and binocular stereoscopic display conditions. The target was presented at eight depth positions relative to the 3D display: 15, 10, and 5 cm in front of the 3D display, on the 3D display panel, and 5, 10, 15 and 30 cm behind the 3D display under the IP and binocular stereoscopic display conditions. Under the real object display condition, the target was displayed on the 3D display panel, and the 3D display was placed at the eight positions. The results suggest that the IP image induced more natural accommodation responses compared to the binocular stereoscopic image. The accommodation responses of the IP image were weaker than those of a real object; however, they showed a similar tendency with those of the real object under the two viewing conditions. Therefore, IP can induce accommodation to the depth positions of 3D images.

  9. Integrated circuit cell library

    NASA Technical Reports Server (NTRS)

    Whitaker, Sterling R. (Inventor); Miles, Lowell H. (Inventor)

    2005-01-01

    According to the invention, an ASIC cell library for use in creation of custom integrated circuits is disclosed. The ASIC cell library includes some first cells and some second cells. Each of the second cells includes two or more kernel cells. The ASIC cell library is at least 5% comprised of second cells. In various embodiments, the ASIC cell library could be 10% or more, 20% or more, 30% or more, 40% or more, 50% or more, 60% or more, 70% or more, 80% or more, 90% or more, or 95% or more comprised of second cells.

  10. An architecture for integrating planar and 3D cQED devices

    NASA Astrophysics Data System (ADS)

    Axline, C.; Reagor, M.; Heeres, R.; Reinhold, P.; Wang, C.; Shain, K.; Pfaff, W.; Chu, Y.; Frunzio, L.; Schoelkopf, R. J.

    2016-07-01

    Numerous loss mechanisms can limit coherence and scalability of planar and 3D-based circuit quantum electrodynamics (cQED) devices, particularly due to their packaging. The low loss and natural isolation of 3D enclosures make them good candidates for coherent scaling. We introduce a coaxial transmission line device architecture with coherence similar to traditional 3D cQED systems. Measurements demonstrate well-controlled external and on-chip couplings, a spectrum absent of cross-talk or spurious modes, and excellent resonator and qubit lifetimes. We integrate a resonator-qubit system in this architecture with a seamless 3D cavity, and separately pattern a qubit, readout resonator, Purcell filter, and high-Q stripline resonator on a single chip. Device coherence and its ease of integration make this a promising tool for complex experiments.

  11. Progress in 3D imaging and display by integral imaging

    NASA Astrophysics Data System (ADS)

    Martinez-Cuenca, R.; Saavedra, G.; Martinez-Corral, M.; Pons, A.; Javidi, B.

    2009-05-01

    Three-dimensionality is currently considered an important added value in imaging devices, and therefore the search for an optimum 3D imaging and display technique is a hot topic that is attracting important research efforts. As main value, 3D monitors should provide the observers with different perspectives of a 3D scene by simply varying the head position. Three-dimensional imaging techniques have the potential to establish a future mass-market in the fields of entertainment and communications. Integral imaging (InI), which can capture true 3D color images, has been seen as the right technology to 3D viewing to audiences of more than one person. Due to the advanced degree of development, InI technology could be ready for commercialization in the coming years. This development is the result of a strong research effort performed along the past few years by many groups. Since Integral Imaging is still an emerging technology, the first aim of the "3D Imaging and Display Laboratory" at the University of Valencia, has been the realization of a thorough study of the principles that govern its operation. Is remarkable that some of these principles have been recognized and characterized by our group. Other contributions of our research have been addressed to overcome some of the classical limitations of InI systems, like the limited depth of field (in pickup and in display), the poor axial and lateral resolution, the pseudoscopic-to-orthoscopic conversion, the production of 3D images with continuous relief, or the limited range of viewing angles of InI monitors.

  12. Output-sensitive 3D line integral convolution.

    PubMed

    Falk, Martin; Weiskopf, Daniel

    2008-01-01

    We propose an output-sensitive visualization method for 3D line integral convolution (LIC) whose rendering speed is largely independent of the data set size and mostly governed by the complexity of the output on the image plane. Our approach of view-dependent visualization tightly links the LIC generation with the volume rendering of the LIC result in order to avoid the computation of unnecessary LIC points: early-ray termination and empty-space leaping techniques are used to skip the computation of the LIC integral in a lazy-evaluation approach; both ray casting and texture slicing can be used as volume-rendering techniques. The input noise is modeled in object space to allow for temporal coherence under object and camera motion. Different noise models are discussed, covering dense representations based on filtered white noise all the way to sparse representations similar to oriented LIC. Aliasing artifacts are avoided by frequency control over the 3D noise and by employing a 3D variant of MIPmapping. A range of illumination models is applied to the LIC streamlines: different codimension-2 lighting models and a novel gradient-based illumination model that relies on precomputed gradients and does not require any direct calculation of gradients after the LIC integral is evaluated. We discuss the issue of proper sampling of the LIC and volume-rendering integrals by employing a frequency-space analysis of the noise model and the precomputed gradients. Finally, we demonstrate that our visualization approach lends itself to a fast graphics processing unit (GPU) implementation that supports both steady and unsteady flow. Therefore, this 3D LIC method allows users to interactively explore 3D flow by means of high-quality, view-dependent, and adaptive LIC volume visualization. Applications to flow visualization in combination with feature extraction and focus-and-context visualization are described, a comparison to previous methods is provided, and a detailed performance

  13. Integrated Circuit Computer Analysis.

    DTIC Science & Technology

    information on this topic. The most important findings were the method used to identify combinational circuits ( Quine - McCluskey algorithm) and a clearly...defined set of limits on the problem of identifying sequential circuits. Since the Quine - McCluskey algorithm works only for combinational circuits, an

  14. Vertically integrated circuit development at Fermilab for detectors

    NASA Astrophysics Data System (ADS)

    Yarema, R.; Deptuch, G.; Hoff, J.; Khalid, F.; Lipton, R.; Shenai, A.; Trimpl, M.; Zimmerman, T.

    2013-01-01

    Today vertically integrated circuits, (a.k.a. 3D integrated circuits) is a popular topic in many trade journals. The many advantages of these circuits have been described such as higher speed due to shorter trace lenghts, the ability to reduce cross talk by placing analog and digital circuits on different levels, higher circuit density without the going to smaller feature sizes, lower interconnect capacitance leading to lower power, reduced chip size, and different processing for the various layers to optimize performance. There are some added advantages specifically for MAPS (Monolithic Active Pixel Sensors) in High Energy Physics: four side buttable pixel arrays, 100% diode fill factor, the ability to move PMOS transistors out of the diode sensing layer, and a increase in channel density. Fermilab began investigating 3D circuits in 2006. Many different bonding processes have been described for fabricating 3D circuits [1]. Fermilab has used three different processes to fabricate several circuits for specific applications in High Energy Physics and X-ray imaging. This paper covers some of the early 3D work at Fermilab and then moves to more recent activities. The major processes we have used are discussed and some of the problems encountered are described. An overview of pertinent 3D circuit designs is presented along with test results thus far.

  15. Integrating Quality Management Into a 3d Geospatial Server

    NASA Astrophysics Data System (ADS)

    Coors, V.; Krämer, M.

    2011-08-01

    In recent years the technology and workflow for producing and management of large 3D urban models has been established and widely been used. Standards such as CityGML enable the modelling and exchange of semantically enriched multi-purpose 3D urban models for applications like urban planning, public participation, environmental simulation and navigation. However, data quality management is essential to control and enhance the quality of these models in order to be able to meet the needs of the aforementioned applications. Quality management should be performed throughout the whole lifecycle of geospatial datasets - from data acquisition to processing, analysis and visualisation. In this paper, we therefore focus on the integration of a quality management software module into a 3D geospatial data server. First results of a prototype system developed at HFT Stuttgart together with Fraunhofer IGD will be presented in this paper as a starting point for further research into the field of quality management of 3D city models.

  16. 3D-GNOME: an integrated web service for structural modeling of the 3D genome.

    PubMed

    Szalaj, Przemyslaw; Michalski, Paul J; Wróblewski, Przemysław; Tang, Zhonghui; Kadlof, Michal; Mazzocco, Giovanni; Ruan, Yijun; Plewczynski, Dariusz

    2016-07-08

    Recent advances in high-throughput chromosome conformation capture (3C) technology, such as Hi-C and ChIA-PET, have demonstrated the importance of 3D genome organization in development, cell differentiation and transcriptional regulation. There is now a widespread need for computational tools to generate and analyze 3D structural models from 3C data. Here we introduce our 3D GeNOme Modeling Engine (3D-GNOME), a web service which generates 3D structures from 3C data and provides tools to visually inspect and annotate the resulting structures, in addition to a variety of statistical plots and heatmaps which characterize the selected genomic region. Users submit a bedpe (paired-end BED format) file containing the locations and strengths of long range contact points, and 3D-GNOME simulates the structure and provides a convenient user interface for further analysis. Alternatively, a user may generate structures using published ChIA-PET data for the GM12878 cell line by simply specifying a genomic region of interest. 3D-GNOME is freely available at http://3dgnome.cent.uw.edu.pl/.

  17. 3D-GNOME: an integrated web service for structural modeling of the 3D genome

    PubMed Central

    Szalaj, Przemyslaw; Michalski, Paul J.; Wróblewski, Przemysław; Tang, Zhonghui; Kadlof, Michal; Mazzocco, Giovanni; Ruan, Yijun; Plewczynski, Dariusz

    2016-01-01

    Recent advances in high-throughput chromosome conformation capture (3C) technology, such as Hi-C and ChIA-PET, have demonstrated the importance of 3D genome organization in development, cell differentiation and transcriptional regulation. There is now a widespread need for computational tools to generate and analyze 3D structural models from 3C data. Here we introduce our 3D GeNOme Modeling Engine (3D-GNOME), a web service which generates 3D structures from 3C data and provides tools to visually inspect and annotate the resulting structures, in addition to a variety of statistical plots and heatmaps which characterize the selected genomic region. Users submit a bedpe (paired-end BED format) file containing the locations and strengths of long range contact points, and 3D-GNOME simulates the structure and provides a convenient user interface for further analysis. Alternatively, a user may generate structures using published ChIA-PET data for the GM12878 cell line by simply specifying a genomic region of interest. 3D-GNOME is freely available at http://3dgnome.cent.uw.edu.pl/. PMID:27185892

  18. 3D J-Integral Capability in Grizzly

    SciTech Connect

    Spencer, Benjamin; Backman, Marie; Chakraborty, Pritam; Hoffman, William

    2014-09-01

    This report summarizes work done to develop a capability to evaluate fracture contour J-Integrals in 3D in the Grizzly code. In the current fiscal year, a previously-developed 2D implementation of a J-Integral evaluation capability has been extended to work in 3D, and to include terms due both to mechanically-induced strains and due to gradients in thermal strains. This capability has been verified against a benchmark solution on a model of a curved crack front in 3D. The thermal term in this integral has been verified against a benchmark problem with a thermal gradient. These developments are part of a larger effort to develop Grizzly as a tool that can be used to predict the evolution of aging processes in nuclear power plant systems, structures, and components, and assess their capacity after being subjected to those aging processes. The capabilities described here have been developed to enable evaluations of Mode- stress intensity factors on axis-aligned flaws in reactor pressure vessels. These can be compared with the fracture toughness of the material to determine whether a pre-existing flaw would begin to propagate during a pos- tulated pressurized thermal shock accident. This report includes a demonstration calculation to show how Grizzly is used to perform a deterministic assessment of such a flaw propagation in a degraded reactor pressure vessel under pressurized thermal shock conditions. The stress intensity is calculated from J, and the toughness is computed using the fracture master curve and the degraded ductile to brittle transition temperature.

  19. Customisable 3D printed microfluidics for integrated analysis and optimisation.

    PubMed

    Monaghan, T; Harding, M J; Harris, R A; Friel, R J; Christie, S D R

    2016-08-16

    The formation of smart Lab-on-a-Chip (LOC) devices featuring integrated sensing optics is currently hindered by convoluted and expensive manufacturing procedures. In this work, a series of 3D-printed LOC devices were designed and manufactured via stereolithography (SL) in a matter of hours. The spectroscopic performance of a variety of optical fibre combinations were tested, and the optimum path length for performing Ultraviolet-visible (UV-vis) spectroscopy determined. The information gained in these trials was then used in a reaction optimisation for the formation of carvone semicarbazone. The production of high resolution surface channels (100-500 μm) means that these devices were capable of handling a wide range of concentrations (9 μM-38 mM), and are ideally suited to both analyte detection and process optimisation. This ability to tailor the chip design and its integrated features as a direct result of the reaction being assessed, at such a low time and cost penalty greatly increases the user's ability to optimise both their device and reaction. As a result of the information gained in this investigation, we are able to report the first instance of a 3D-printed LOC device with fully integrated, in-line monitoring capabilities via the use of embedded optical fibres capable of performing UV-vis spectroscopy directly inside micro channels.

  20. Variational integrators for electric circuits

    SciTech Connect

    Ober-Blöbaum, Sina; Tao, Molei; Cheng, Mulin; Owhadi, Houman; Marsden, Jerrold E.

    2013-06-01

    In this contribution, we develop a variational integrator for the simulation of (stochastic and multiscale) electric circuits. When considering the dynamics of an electric circuit, one is faced with three special situations: 1. The system involves external (control) forcing through external (controlled) voltage sources and resistors. 2. The system is constrained via the Kirchhoff current (KCL) and voltage laws (KVL). 3. The Lagrangian is degenerate. Based on a geometric setting, an appropriate variational formulation is presented to model the circuit from which the equations of motion are derived. A time-discrete variational formulation provides an iteration scheme for the simulation of the electric circuit. Dependent on the discretization, the intrinsic degeneracy of the system can be canceled for the discrete variational scheme. In this way, a variational integrator is constructed that gains several advantages compared to standard integration tools for circuits; in particular, a comparison to BDF methods (which are usually the method of choice for the simulation of electric circuits) shows that even for simple LCR circuits, a better energy behavior and frequency spectrum preservation can be observed using the developed variational integrator.

  1. Integral imaging based 3D display of holographic data.

    PubMed

    Yöntem, Ali Özgür; Onural, Levent

    2012-10-22

    We propose a method and present applications of this method that converts a diffraction pattern into an elemental image set in order to display them on an integral imaging based display setup. We generate elemental images based on diffraction calculations as an alternative to commonly used ray tracing methods. Ray tracing methods do not accommodate the interference and diffraction phenomena. Our proposed method enables us to obtain elemental images from a holographic recording of a 3D object/scene. The diffraction pattern can be either numerically generated data or digitally acquired optical data. The method shows the connection between a hologram (diffraction pattern) and an elemental image set of the same 3D object. We showed three examples, one of which is the digitally captured optical diffraction tomography data of an epithelium cell. We obtained optical reconstructions with our integral imaging display setup where we used a digital lenslet array. We also obtained numerical reconstructions, again by using the diffraction calculations, for comparison. The digital and optical reconstruction results are in good agreement.

  2. Autonomous microfluidic capillaric circuits replicated from 3D-printed molds.

    PubMed

    Olanrewaju, A O; Robillard, A; Dagher, M; Juncker, D

    2016-09-21

    We recently developed capillaric circuits (CCs) - advanced capillary microfluidic devices assembled from capillary fluidic elements in a modular manner similar to the design of electric circuits (Safavieh & Juncker, Lab Chip, 2013, 13, 4180-4189). CCs choreograph liquid delivery operations according to pre-programmed capillary pressure differences with minimal user intervention. CCs were thought to require high-precision micron-scale features manufactured by conventional photolithography, which is slow and expensive. Here we present CCs manufactured rapidly and inexpensively using 3D-printed molds. Molds for CCs were fabricated with a benchtop 3D-printer, poly(dimethylsiloxane) replicas were made, and fluidic functionality was verified with aqueous solutions. We established design rules for CCs by a combination of modelling and experimentation. The functionality and reliability of trigger valves - an essential fluidic element that stops one liquid until flow is triggered by a second liquid - was tested for different geometries and different solutions. Trigger valves with geometries up to 80-fold larger than cleanroom-fabricated ones were found to function reliably. We designed retention burst valves that encode sequential liquid delivery using capillary pressure differences encoded by systematically varied heights and widths. Using an electrical circuit analogue of the CC, we established design rules to ensure strictly sequential liquid delivery. CCs autonomously delivered eight liquids in a pre-determined sequence in <7 min. Taken together, our results demonstrate that 3D-printing lowers the bar for other researchers to access capillary microfluidic valves and CCs for autonomous liquid delivery with applications in diagnostics, research and education.

  3. Novel through-silicon vias for enhanced signal integrity in 3D integrated systems

    NASA Astrophysics Data System (ADS)

    Runiu, Fang; Xin, Sun; Min, Miao; Yufeng, Jin

    2016-10-01

    In this paper, a new type of through-silicon via (TSV) for via-first process namely bare TSV, is proposed and analyzed with the aim of mitigating noise coupling problems in 3D integrated systems for advanced technology nodes. The bare TSVs have no insulation layers, and are divided into two types: bare signal TSVs and bare ground TSVs. First, by solving Poisson's equation for cylindrical P-N junctions, the bare signal TSVs are shown to be equivalent to conventional signal TSVs according to the simulation results. Then the bare ground TSV is proved to have improved noise-absorption capability when compared with a conventional ground TSV. Also, the proposed bare TSVs offer more advantages to circuits than other noise isolation methods, because the original circuit design, routing and placement can be retained after the application of the bare TSVs. Project supported by the National Basic Research Program of China (No. 2015CB0572), and the Importation and Development of High-Caliber Talents Project of Beijing Municipal Institutions (No. CIT&TCD20150320), and the National Natural Science Foundation of China (No. 61176102).

  4. Analog MOS integrated circuits

    NASA Technical Reports Server (NTRS)

    Temes, Gabor C.

    1988-01-01

    The goal was to design single-chip lowpass filters with constant group delay in the pass band and 60 dB minimum attenuation in the stop band. The desired 3 dB frequencies are (in Hertz) 2.5, 5, 10, 20, 40, 80, 160, and 320. A filter class that satisfies the constant delay (linear phase) requirement while providing quite a narrow transition band is the Bessel-Chebyshev filters. It was found that the 7th order Bessel-Chebyshev response satisfied the requirement of the filter.

  5. The 3-D vision system integrated dexterous hand

    NASA Technical Reports Server (NTRS)

    Luo, Ren C.; Han, Youn-Sik

    1989-01-01

    Most multifingered hands use a tendon mechanism to minimize the size and weight of the hand. Such tendon mechanisms suffer from the problems of striction and friction of the tendons resulting in a reduction of control accuracy. A design for a 3-D vision system integrated dexterous hand with motor control is described which overcomes these problems. The proposed hand is composed of three three-jointed grasping fingers with tactile sensors on their tips, a two-jointed eye finger with a cross-shaped laser beam emitting diode in its distal part. The two non-grasping fingers allow 3-D vision capability and can rotate around the hand to see and measure the sides of grasped objects and the task environment. An algorithm that determines the range and local orientation of the contact surface using a cross-shaped laser beam is introduced along with some potential applications. An efficient method for finger force calculation is presented which uses the measured contact surface normals of an object.

  6. Digital 3D Borobudur - Integration of 3D surveying and modeling techniques

    NASA Astrophysics Data System (ADS)

    Suwardhi, D.; Menna, F.; Remondino, F.; Hanke, K.; Akmalia, R.

    2015-08-01

    The Borobudur temple (Indonesia) is one of the greatest Buddhist monuments in the world, now listed as an UNESCO World Heritage Site. The present state of the temple is the result of restorations after being exposed to natural disasters several times. Today there is still a growing rate of deterioration of the building stones whose causes need further researches. Monitoring programs, supported at institutional level, have been effectively executed to observe the problem. The paper presents the latest efforts to digitally document the Borobudur Temple and its surrounding area in 3D with photogrammetric techniques. UAV and terrestrial images were acquired to completely digitize the temple, produce DEM, orthoimages and maps at 1:100 and 1:1000 scale. The results of the project are now employed by the local government organizations to manage the heritage area and plan new policies for the conservation and preservation of the UNESCO site. In order to help data management and policy makers, a web-based information system of the heritage area was also built to visualize and easily access all the data and achieved 3D results.

  7. Photonic circuits integrated with CMOS compatible photodetectors

    NASA Astrophysics Data System (ADS)

    Cristea, Dana; Craciunoiu, F.; Modreanu, M.; Caldararu, M.; Cernica, I.

    2001-06-01

    This paper presents the integration of photodetectors and photonic circuits (waveguides and interferometers, coupling elements and chemo-optical transducing layer) on one silicon chip. Different materials: silicon, doped or undoped silica, SiO xN y, polymers, and different technologies: LPCVD, APCVD, sol-gel, spinning, micromachining have been used to realize the photonic and micromechanical components and the transducers. Also, MOS compatible processes have been used for optoelectronic circuits. The attention was focused on the matching of all the involved technologies, to allow the monolithic integration of all components, and also on the design and fabrication of special structures of photodetectors. Two types of high responsivity photodetectors, a photo-FET and a bipolar NPN phototransistor, with modified structures that allow the optical coupling to the waveguides have been designed and experimented. An original 3-D model was developed for the system: opto-FET-coupler-waveguide. A test circuit for sensor applications was experimented. All the components of the test circuits, photodetectors, waveguides, couplers, were obtained using CMOS-compatible processes. The aim of our research activity was to obtain microsensors with optical read-out.

  8. Perceptual integration for qualitatively different 3-D cues in the human brain.

    PubMed

    Dövencioğlu, Dicle; Ban, Hiroshi; Schofield, Andrew J; Welchman, Andrew E

    2013-09-01

    The visual system's flexibility in estimating depth is remarkable: We readily perceive 3-D structure under diverse conditions from the seemingly random dots of a "magic eye" stereogram to the aesthetically beautiful, but obviously flat, canvasses of the Old Masters. Yet, 3-D perception is often enhanced when different cues specify the same depth. This perceptual process is understood as Bayesian inference that improves sensory estimates. Despite considerable behavioral support for this theory, insights into the cortical circuits involved are limited. Moreover, extant work tested quantitatively similar cues, reducing some of the challenges associated with integrating computationally and qualitatively different signals. Here we address this challenge by measuring fMRI responses to depth structures defined by shading, binocular disparity, and their combination. We quantified information about depth configurations (convex "bumps" vs. concave "dimples") in different visual cortical areas using pattern classification analysis. We found that fMRI responses in dorsal visual area V3B/KO were more discriminable when disparity and shading concurrently signaled depth, in line with the predictions of cue integration. Importantly, by relating fMRI and psychophysical tests of integration, we observed a close association between depth judgments and activity in this area. Finally, using a cross-cue transfer test, we found that fMRI responses evoked by one cue afford classification of responses evoked by the other. This reveals a generalized depth representation in dorsal visual cortex that combines qualitatively different information in line with 3-D perception.

  9. Integration of virtual and real scenes within an integral 3D imaging environment

    NASA Astrophysics Data System (ADS)

    Ren, Jinsong; Aggoun, Amar; McCormick, Malcolm

    2002-11-01

    The Imaging Technologies group at De Montfort University has developed an integral 3D imaging system, which is seen as the most likely vehicle for 3D television avoiding psychological effects. To create real fascinating three-dimensional television programs, a virtual studio that performs the task of generating, editing and integrating the 3D contents involving virtual and real scenes is required. The paper presents, for the first time, the procedures, factors and methods of integrating computer-generated virtual scenes with real objects captured using the 3D integral imaging camera system. The method of computer generation of 3D integral images, where the lens array is modelled instead of the physical camera is described. In the model each micro-lens that captures different elemental images of the virtual scene is treated as an extended pinhole camera. An integration process named integrated rendering is illustrated. Detailed discussion and deep investigation are focused on depth extraction from captured integral 3D images. The depth calculation method from the disparity and the multiple baseline method that is used to improve the precision of depth estimation are also presented. The concept of colour SSD and its further improvement in the precision is proposed and verified.

  10. Integrating visible light 3D scanning into the everyday world

    NASA Astrophysics Data System (ADS)

    Straub, Jeremy

    2015-05-01

    Visible light 3D scanning offers the potential to non-invasively and nearly non-perceptibly incorporate 3D imaging into the everyday world. This paper considers the various possible uses of visible light 3D scanning technology. It discusses multiple possible usage scenarios including in hospitals, security perimeter settings and retail environments. The paper presents a framework for assessing the efficacy of visible light 3D scanning for a given application (and compares this to other scanning approaches such as those using blue light or lasers). It also discusses ethical and legal considerations relevant to real-world use and concludes by presenting a decision making framework.

  11. MOS integrated circuit fault modeling

    NASA Technical Reports Server (NTRS)

    Sievers, M.

    1985-01-01

    Three digital simulation techniques for MOS integrated circuit faults were examined. These techniques embody a hierarchy of complexity bracketing the range of simulation levels. The digital approaches are: transistor-level, connector-switch-attenuator level, and gate level. The advantages and disadvantages are discussed. Failure characteristics are also described.

  12. Development of CMOS integrated circuits

    NASA Technical Reports Server (NTRS)

    Bertino, F.; Feller, A.; Greenhouse, J.; Lombardi, T.; Merriam, A.; Noto, R.; Ozga, S.; Pryor, R.; Ramondetta, P.; Smith, A.

    1979-01-01

    Report documents life cycles of two custom CMOS integrated circuits: (1) 4-bit multiplexed register with shift left and shift right capabilities, and (2) dual 4-bit registers. Cycles described include conception as logic diagrams through design, fabrication, testing, and delivery.

  13. Fully 3D-Integrated Pixel Detectors for X-Rays

    SciTech Connect

    Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul; Grybos, Pawel; Holm, Scott; Lipton, Ronald; Maj, Piotr; Patti, Robert; Siddons, David Peter; Szczygiel, Robert; Yarema, Raymond

    2016-01-01

    The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch, yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e- rms and a conversion gain of 69.5 μV/e- with 2.6 e- rms and 2.7 μV/e- rms pixel-to-pixel variations, respectively, were measured.

  14. Fully 3D-Integrated Pixel Detectors for X-Rays

    DOE PAGES

    Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul; ...

    2016-01-01

    The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch,more » yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e- rms and a conversion gain of 69.5 μV/e- with 2.6 e- rms and 2.7 μV/e- rms pixel-to-pixel variations, respectively, were measured.« less

  15. Relating functional connectivity in V1 neural circuits and 3D natural scenes using Boltzmann machines

    PubMed Central

    Zhang, Yimeng; Li, Xiong; Samonds, Jason M.

    2015-01-01

    Bayesian theory has provided a compelling conceptualization for perceptual inference in the brain. Central to Bayesian inference is the notion of statistical priors. To understand the neural mechanisms of Bayesian inference, we need to understand the neural representation of statistical regularities in the natural environment. In this paper, we investigated empirically how statistical regularities in natural 3D scenes are represented in the functional connectivity of disparity-tuned neurons in the primary visual cortex of primates. We applied a Boltzmann machine model to learn from 3D natural scenes, and found that the units in the model exhibited cooperative and competitive interactions, forming a “disparity association field”, analogous to the contour association field. The cooperative and competitive interactions in the disparity association field are consistent with constraints of computational models for stereo matching. In addition, we simulated neurophysiological experiments on the model, and found the results to be consistent with neurophysiological data in terms of the functional connectivity measurements between disparity-tuned neurons in the macaque primary visual cortex. These findings demonstrate that there is a relationship between the functional connectivity observed in the visual cortex and the statistics of natural scenes. They also suggest that the Boltzmann machine can be a viable model for conceptualizing computations in the visual cortex and, as such, can be used to predict neural circuits in the visual cortex from natural scene statistics. PMID:26712581

  16. Relating functional connectivity in V1 neural circuits and 3D natural scenes using Boltzmann machines.

    PubMed

    Zhang, Yimeng; Li, Xiong; Samonds, Jason M; Lee, Tai Sing

    2016-03-01

    Bayesian theory has provided a compelling conceptualization for perceptual inference in the brain. Central to Bayesian inference is the notion of statistical priors. To understand the neural mechanisms of Bayesian inference, we need to understand the neural representation of statistical regularities in the natural environment. In this paper, we investigated empirically how statistical regularities in natural 3D scenes are represented in the functional connectivity of disparity-tuned neurons in the primary visual cortex of primates. We applied a Boltzmann machine model to learn from 3D natural scenes, and found that the units in the model exhibited cooperative and competitive interactions, forming a "disparity association field", analogous to the contour association field. The cooperative and competitive interactions in the disparity association field are consistent with constraints of computational models for stereo matching. In addition, we simulated neurophysiological experiments on the model, and found the results to be consistent with neurophysiological data in terms of the functional connectivity measurements between disparity-tuned neurons in the macaque primary visual cortex. These findings demonstrate that there is a relationship between the functional connectivity observed in the visual cortex and the statistics of natural scenes. They also suggest that the Boltzmann machine can be a viable model for conceptualizing computations in the visual cortex and, as such, can be used to predict neural circuits in the visual cortex from natural scene statistics.

  17. A monolithic 3D integrated nanomagnetic co-processing unit

    NASA Astrophysics Data System (ADS)

    Becherer, M.; Breitkreutz-v. Gamm, S.; Eichwald, I.; Žiemys, G.; Kiermaier, J.; Csaba, G.; Schmitt-Landsiedel, D.

    2016-01-01

    As CMOS scaling becomes more and more challenging there is strong impetus for beyond CMOS device research to add new functionality to ICs. In this article, a promising technology with non-volatile ferromagnetic computing states - the so-called Perpendicular Nanomagnetic Logic (pNML) - is reviewed. After introducing the 2D planar implementation of NML with magnetization perpendicular to the surface, the path to monolithically 3D integrated systems is discussed. Instead of CMOS substitution, additional functionality is added by a co-processor architecture as a prospective back-end-of-line (BEOL) process, where the computing elements are clocked by a soft-magnetic on-chip inductor. The unconventional computation in the ferromagnetic domain can lead to highly dense computing structures without leakage currents, attojoule dissipation per bit operation and data-throughputs comparable to state-of-the-art high-performance CMOS CPUs. In appropriate applications and with specialized computing architectures they might even circumvent the bottleneck of time-consuming memory access, as computation is inherently performed with non-volatile computing states.

  18. Integrating 3D Visualization and GIS in Planning Education

    ERIC Educational Resources Information Center

    Yin, Li

    2010-01-01

    Most GIS-related planning practices and education are currently limited to two-dimensional mapping and analysis although 3D GIS is a powerful tool to study the complex urban environment in its full spatial extent. This paper reviews current GIS and 3D visualization uses and development in planning practice and education. Current literature…

  19. 3D Vectorial Time Domain Computational Integrated Photonics

    SciTech Connect

    Kallman, J S; Bond, T C; Koning, J M; Stowell, M L

    2007-02-16

    The design of integrated photonic structures poses considerable challenges. 3D-Time-Domain design tools are fundamental in enabling technologies such as all-optical logic, photonic bandgap sensors, THz imaging, and fast radiation diagnostics. Such technologies are essential to LLNL and WFO sponsors for a broad range of applications: encryption for communications and surveillance sensors (NSA, NAI and IDIV/PAT); high density optical interconnects for high-performance computing (ASCI); high-bandwidth instrumentation for NIF diagnostics; micro-sensor development for weapon miniaturization within the Stockpile Stewardship and DNT programs; and applications within HSO for CBNP detection devices. While there exist a number of photonics simulation tools on the market, they primarily model devices of interest to the communications industry. We saw the need to extend our previous software to match the Laboratory's unique emerging needs. These include modeling novel material effects (such as those of radiation induced carrier concentrations on refractive index) and device configurations (RadTracker bulk optics with radiation induced details, Optical Logic edge emitting lasers with lateral optical inputs). In addition we foresaw significant advantages to expanding our own internal simulation codes: parallel supercomputing could be incorporated from the start, and the simulation source code would be accessible for modification and extension. This work addressed Engineering's Simulation Technology Focus Area, specifically photonics. Problems addressed from the Engineering roadmap of the time included modeling the Auston switch (an important THz source/receiver), modeling Vertical Cavity Surface Emitting Lasers (VCSELs, which had been envisioned as part of fast radiation sensors), and multi-scale modeling of optical systems (for a variety of applications). We proposed to develop novel techniques to numerically solve the 3D multi-scale propagation problem for both the microchip

  20. Flow integration transform: detecting shapes in matrix-array 3D ultrasound data

    NASA Astrophysics Data System (ADS)

    Stetten, George D.; Caines, Michael; von Ramm, Olaf T.

    1995-03-01

    Matrix-array ultrasound produces real-time 3D images of the heart, by employing a square array of transducers to steer the ultrasound beam in three dimensions electronically with no moving parts. Other 3D modalities such as MR, MUGA, and CT require the use of gated studies, which combine many cardiac cycles to produce a single average cycle. Three- dimensional ultrasound eliminates this restriction, in theory permitting the continuous measurement of cardiac ventricular volume, which we call the volumetricardiogram. Towards implementing the volumetricardiogram, we have developed the flow integration transform (FIT), which operates on a 2D slice within the volumetric ultrasound data. The 3D ultrasound machine's scan converter produces a set of such slices in real time, at any desired location and orientation, to which the FIT may then be applied. Although lacking rotational or scale invariance, the FIT is designed to operate in dedicated hardware where an entire transform could be completed within a few microseconds with present integrated circuit technology. This speed would permit the application of a large battery of test shapes, or the evolution of the test shape to converge on that of the actual target.

  1. Microfluidic photonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Cho, Sung Hwan; Godin, Jessica; Chen, Chun Hao; Tsai, Frank S.; Lo, Yu-Hwa

    2008-11-01

    We report on the development of an inexpensive, portable lab-on-a-chip flow cytometer system in which microfluidics, photonics, and acoustics are integrated together to work synergistically. The system relies on fluid-filled twodimensional on-chip photonic components such as lenses, apertures, and slab waveguides to allow for illumination laser beam shaping, light scattering and fluorescence signal detection. Both scattered and fluorescent lights are detected by photodetectors after being collected and guided by the on-chip optics components (e.g. lenses and waveguides). The detected light signal is imported and amplified in real time and triggers the piezoelectric actuator so that the targeted samples are directed into desired reservoir for subsequent advanced analysis. The real-time, closed-loop control system is developed with field-programmable-gate-array (FPGA) implementation. The system enables high-throughput (1- 10kHz operation), high reliability and low-powered (<1mW) fluorescence activated cell sorting (FACS) on a chip. The microfabricated flow cytometer can potentially be used as a portable, inexpensive point-of-care device in resource poor environments.

  2. Delay locked loop integrated circuit.

    SciTech Connect

    Brocato, Robert Wesley

    2007-10-01

    This report gives a description of the development of a Delay Locked Loop (DLL) integrated circuit (IC). The DLL was developed and tested as a stand-alone IC test chip to be integrated into a larger application specific integrated circuit (ASIC), the Quadrature Digital Waveform Synthesizer (QDWS). The purpose of the DLL is to provide a digitally programmable delay to enable synchronization between an internal system clock and external peripherals with unknown clock skew. The DLL was designed and fabricated in the IBM 8RF process, a 0.13 {micro}m CMOS process. It was designed to operate with a 300MHz clock and has been tested up to 500MHz.

  3. Three-dimensional (3D) monolithically integrated photodetector and WDM receiver based on bulk silicon wafer.

    PubMed

    Song, Junfeng; Luo, Xianshu; Tu, Xiaoguang; Jia, Lianxi; Fang, Qing; Liow, Tsung-Yang; Yu, Mingbin; Lo, Guo-Qiang

    2014-08-11

    We propose a novel three-dimensional (3D) monolithic optoelectronic integration platform. Such platform integrates both electrical and photonic devices in a bulk silicon wafer, which eliminates the high-cost silicon-on-insulator (SOI) wafer and is more suitable for process requirements of electronic and photonic integrated circuits (ICs). For proof-of-concept, we demonstrate a three-dimensional photodetector and WDM receiver system. The Ge is grown on a 8-inch bulk silicon wafer while the optical waveguide is defined in a SiN layer which is deposited on top of it, with ~4 µm oxide sandwiched in between. The light is directed to the Ge photodetector from the SiN waveguide vertically by using grating coupler with a Aluminum mirror on top of it. The measured photodetector responsivity is ~0.2 A/W and the 3-dB bandwidth is ~2 GHz. Using such vertical-coupled photodetector, we demonstrated an 8-channel receiver by integrating a 1 × 8 arrayed waveguide grating (AWG). High-quality optical signal detection with up to 10 Gbit/s data rate is demonstrated, suggesting a 80 Gbit/s throughput. Such receiver can be applied to on-chip optical interconnect, DRAM interface, and telecommunication systems.

  4. 3D probe array integrated with a front-end 100-channel neural recording ASIC

    NASA Astrophysics Data System (ADS)

    Cheng, Ming-Yuan; Yao, Lei; Tan, Kwan Ling; Lim, Ruiqi; Li, Peng; Chen, Weiguo

    2014-12-01

    Brain-machine interface technology can improve the lives of spinal cord injury victims and amputees. A neural interface system, consisting of a 3D probe array and a custom low-power (1 mW) 100-channel (100-ch) neural recording application-specific integrated circuit (ASIC), was designed and implemented to monitor neural activity. In this study, a microassembly 3D probe array method using a novel lead transfer technique was proposed to overcome the bonding plane mismatch encountered during orthogonal assembly. The proposed lead transfer technique can be completed using standard micromachining and packaging processes. The ASIC can be stacking-integrated with the probe array, minimizing the form factor of the assembled module. To minimize trauma to brain cells, the profile of the integrated probe array was controlled within 730 μm. The average impedance of the assembled probe was approximately 0.55 MΩ at 1 kHz. To verify the functionality of the integrated neural probe array, bench-top signal acquisitions were performed and discussed.

  5. Integrated circuits, and design and manufacture thereof

    DOEpatents

    Auracher, Stefan; Pribbernow, Claus; Hils, Andreas

    2006-04-18

    A representation of a macro for an integrated circuit layout. The representation may define sub-circuit cells of a module. The module may have a predefined functionality. The sub-circuit cells may include at least one reusable circuit cell. The reusable circuit cell may be configured such that when the predefined functionality of the module is not used, the reusable circuit cell is available for re-use.

  6. Integrated acoustooptic circuits and applications.

    PubMed

    Tsai, C S

    1992-01-01

    The recent development of titanium-indiffusion proton-exchange (TIPE) microlenses and lens arrays has made possible the construction of a variety of single- and multichannel integrated acoustooptic (AO) and acoustooptic-electrooptic (EO) circuits in LiNbO(3) channel-planar waveguides 0.1x1.0x2.0 cm(3) in size. These hybrid AO and AO-EO circuits can be fabricated through compatible and well-established technologies. The most recent realization of ion-milled microlenses and lens arrays together with the recent development of gigahertz AO Bragg modulators and EO Bragg modulator arrays have also paved the way for construction of similar but monolithic AO and AO-EO GaAs/GaAlAs waveguides of comparable size. Both types of integrated AO and AO-EO circuits suggest versatile applications in communications signal processing, and computing. Efficient and simultaneous excitation of the channel waveguide array using an ion-milled planar microlens array has facilitated the demonstration of some of these applications.

  7. Integration of real-time 3D capture, reconstruction, and light-field display

    NASA Astrophysics Data System (ADS)

    Zhang, Zhaoxing; Geng, Zheng; Li, Tuotuo; Pei, Renjing; Liu, Yongchun; Zhang, Xiao

    2015-03-01

    Effective integration of 3D acquisition, reconstruction (modeling) and display technologies into a seamless systems provides augmented experience of visualizing and analyzing real objects and scenes with realistic 3D sensation. Applications can be found in medical imaging, gaming, virtual or augmented reality and hybrid simulations. Although 3D acquisition, reconstruction, and display technologies have gained significant momentum in recent years, there seems a lack of attention on synergistically combining these components into a "end-to-end" 3D visualization system. We designed, built and tested an integrated 3D visualization system that is able to capture in real-time 3D light-field images, perform 3D reconstruction to build 3D model of the objects, and display the 3D model on a large autostereoscopic screen. In this article, we will present our system architecture and component designs, hardware/software implementations, and experimental results. We will elaborate on our recent progress on sparse camera array light-field 3D acquisition, real-time dense 3D reconstruction, and autostereoscopic multi-view 3D display. A prototype is finally presented with test results to illustrate the effectiveness of our proposed integrated 3D visualization system.

  8. Parallelism in integrated fluidic circuits

    NASA Astrophysics Data System (ADS)

    Bousse, Luc J.; Kopf-Sill, Anne R.; Parce, J. W.

    1998-04-01

    Many research groups around the world are working on integrated microfluidics. The goal of these projects is to automate and integrate the handling of liquid samples and reagents for measurement and assay procedures in chemistry and biology. Ultimately, it is hoped that this will lead to a revolution in chemical and biological procedures similar to that caused in electronics by the invention of the integrated circuit. The optimal size scale of channels for liquid flow is determined by basic constraints to be somewhere between 10 and 100 micrometers . In larger channels, mixing by diffusion takes too long; in smaller channels, the number of molecules present is so low it makes detection difficult. At Caliper, we are making fluidic systems in glass chips with channels in this size range, based on electroosmotic flow, and fluorescence detection. One application of this technology is rapid assays for drug screening, such as enzyme assays and binding assays. A further challenge in this area is to perform multiple functions on a chip in parallel, without a large increase in the number of inputs and outputs. A first step in this direction is a fluidic serial-to-parallel converter. Fluidic circuits will be shown with the ability to distribute an incoming serial sample stream to multiple parallel channels.

  9. Removing Bonded Integrated Circuits From Boards

    NASA Technical Reports Server (NTRS)

    Rice, John T.

    1989-01-01

    Small resistance heater makes it easier, faster, and cheaper to remove integrated circuit from hybrid-circuit board, package, or other substrate for rework. Heater, located directly in polymeric bond interface or on substrate under integrated-circuit chip, energized when necessary to remove chip. Heat generated softens adhesive or solder that bonds chip to substrate. Chip then lifted easily from substrate.

  10. Galerkin Boundary Integral Analysis for the 3D Helmholtz Equation

    SciTech Connect

    Swager, Melissa; Gray, Leonard J; Nintcheu Fata, Sylvain

    2010-01-01

    A linear element Galerkin boundary integral analysis for the three-dimensional Helmholtz equation is presented. The emphasis is on solving acoustic scattering by an open (crack) surface, and to this end both a dual equation formulation and a symmetric hypersingular formulation have been developed. All singular integrals are defined and evaluated via a boundary limit process, facilitating the evaluation of the (finite) hypersingular Galerkin integral. This limit process is also the basis for the algorithm for post-processing of the surface gradient. The analytic integrations required by the limit process are carried out by employing a Taylor series expansion for the exponential factor in the Helmholtz fundamental solutions. For the open surface, the implementations are validated by comparing the numerical results obtained by using the two different methods.

  11. 3D integral imaging using diffractive Fresnel lens arrays.

    PubMed

    Hain, Mathias; von Spiegel, Wolff; Schmiedchen, Marc; Tschudi, Theo; Javidi, Bahram

    2005-01-10

    We present experimental results with binary amplitude Fresnel lens arrays and binary phase Fresnel lens arrays used to implement integral imaging systems. Their optical performance is compared with high quality refractive microlens arrays and pinhole arrays in terms of image quality, color distortion and contrast. Additionally, we show the first experimental results of lens arrays with different focal lengths in integral imaging, and discuss their ability to simultaneously increase both the depth of focus and the field of view.

  12. Graphene radio frequency receiver integrated circuit.

    PubMed

    Han, Shu-Jen; Garcia, Alberto Valdes; Oida, Satoshi; Jenkins, Keith A; Haensch, Wilfried

    2014-01-01

    Graphene has attracted much interest as a future channel material in radio frequency electronics because of its superior electrical properties. Fabrication of a graphene integrated circuit without significantly degrading transistor performance has proven to be challenging, posing one of the major bottlenecks to compete with existing technologies. Here we present a fabrication method fully preserving graphene transistor quality, demonstrated with the implementation of a high-performance three-stage graphene integrated circuit. The circuit operates as a radio frequency receiver performing signal amplification, filtering and downconversion mixing. All circuit components are integrated into 0.6 mm(2) area and fabricated on 200 mm silicon wafers, showing the unprecedented graphene circuit complexity and silicon complementary metal-oxide-semiconductor process compatibility. The demonstrated circuit performance allow us to use graphene integrated circuit to perform practical wireless communication functions, receiving and restoring digital text transmitted on a 4.3-GHz carrier signal.

  13. BioMEA: a versatile high-density 3D microelectrode array system using integrated electronics.

    PubMed

    Charvet, Guillaume; Rousseau, Lionel; Billoint, Olivier; Gharbi, Sadok; Rostaing, Jean-Pierre; Joucla, Sébastien; Trevisiol, Michel; Bourgerette, Alain; Chauvet, Philippe; Moulin, Céline; Goy, François; Mercier, Bruno; Colin, Mikael; Spirkovitch, Serge; Fanet, Hervé; Meyrand, Pierre; Guillemaud, Régis; Yvert, Blaise

    2010-04-15

    Microelectrode arrays (MEAs) offer a powerful tool to both record activity and deliver electrical microstimulations to neural networks either in vitro or in vivo. Microelectronics microfabrication technologies now allow building high-density MEAs containing several hundreds of microelectrodes. However, dense arrays of 3D micro-needle electrodes, providing closer contact with the neural tissue than planar electrodes, are not achievable using conventional isotropic etching processes. Moreover, increasing the number of electrodes using conventional electronics is difficult to achieve into compact devices addressing all channels independently for simultaneous recording and stimulation. Here, we present a full modular and versatile 256-channel MEA system based on integrated electronics. First, transparent high-density arrays of 3D-shaped microelectrodes were realized by deep reactive ion etching techniques of a silicon substrate reported on glass. This approach allowed achieving high electrode aspect ratios, and different shapes of tip electrodes. Next, we developed a dedicated analog 64-channel Application Specific Integrated Circuit (ASIC) including one amplification stage and one current generator per channel, and analog output multiplexing. A full modular system, called BIOMEA, has been designed, allowing connecting different types of MEAs (64, 128, or 256 electrodes) to different numbers of ASICs for simultaneous recording and/or stimulation on all channels. Finally, this system has been validated experimentally by recording and electrically eliciting low-amplitude spontaneous rhythmic activity (both LFPs and spikes) in the developing mouse CNS. The availability of high-density MEA systems with integrated electronics will offer new possibilities for both in vitro and in vivo studies of large neural networks.

  14. Three-Dimensional Integration Technology for Advanced Focal Planes and Integrated Circuits

    SciTech Connect

    Keast, Craig

    2007-02-28

    Over the last five years MIT Lincoln Laboratory (MIT-LL) has developed a three-dimensional (3D) circuit integration technology that exploits the advantages of silicon-on-insulator (SOI) technology to enable wafer-level stacking and micrometer-scale electrical interconnection of fully fabricated circuit wafers. Advanced focal plane arrays have been the first applications to exploit the benefits of this 3D integration technology because the massively parallel information flow present in 2D imaging arrays maps very nicely into a 3D computational structure as information flows from circuit-tier to circuit-tier in the z-direction. To date, the MIT-LL 3D integration technology has been used to fabricate four different focal planes including: a 2-tier 64 x 64 imager with fully parallel per-pixel A/D conversion; a 3-tier 640 x 480 imager consisting of an imaging tier, an A/D conversion tier, and a digital signal processing tier; a 2-tier 1024 x 1024 pixel, 4-side-abutable imaging modules for tiling large mosaic focal planes, and a 3-tier Geiger-mode avalanche photodiode (APD) 3-D LIDAR array, using a 30 volt APD tier, a 3.3 volt CMOS tier, and a 1.5 volt CMOS tier. Recently, the 3D integration technology has been made available to the circuit design research community through DARPA-sponsored Multiproject fabrication runs. The first Multiproject Run (3DL1) completed fabrication in early 2006 and included over 30 different circuit designs from 21 different research groups. 3D circuit concepts explored in this run included stacked memories, field programmable gate arrays (FPGAs), and mixed-signal circuits. The second Multiproject Run (3DM2) is currently in fabrication and includes particle detector readouts designed by Fermilab. This talk will provide a brief overview of MIT-LL's 3D-integration process, discuss some of the focal plane applications where the technology is being applied, and provide a summary of some of the Multiproject Run circuit results.

  15. Dual-view integral imaging 3D display using polarizer parallax barriers.

    PubMed

    Wu, Fei; Wang, Qiong-Hua; Luo, Cheng-Gao; Li, Da-Hai; Deng, Huan

    2014-04-01

    We propose a dual-view integral imaging (DVII) 3D display using polarizer parallax barriers (PPBs). The DVII 3D display consists of a display panel, a microlens array, and two PPBs. The elemental images (EIs) displayed on the left and right half of the display panel are captured from two different 3D scenes, respectively. The lights emitted from two kinds of EIs are modulated by the left and right half of the microlens array to present two different 3D images, respectively. A prototype of the DVII 3D display is developed, and the experimental results agree well with the theory.

  16. Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel

    NASA Technical Reports Server (NTRS)

    Hunter, Don J.; Halpert, Gerald

    1999-01-01

    As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

  17. Scaling of graphene integrated circuits

    NASA Astrophysics Data System (ADS)

    Bianchi, Massimiliano; Guerriero, Erica; Fiocco, Marco; Alberti, Ruggero; Polloni, Laura; Behnam, Ashkan; Carrion, Enrique A.; Pop, Eric; Sordan, Roman

    2015-04-01

    The influence of transistor size reduction (scaling) on the speed of realistic multi-stage integrated circuits (ICs) represents the main performance metric of a given transistor technology. Despite extensive interest in graphene electronics, scaling efforts have so far focused on individual transistors rather than multi-stage ICs. Here we study the scaling of graphene ICs based on transistors from 3.3 to 0.5 μm gate lengths and with different channel widths, access lengths, and lead thicknesses. The shortest gate delay of 31 ps per stage was obtained in sub-micron graphene ROs oscillating at 4.3 GHz, which is the highest oscillation frequency obtained in any strictly low-dimensional material to date. We also derived the fundamental Johnson limit, showing that scaled graphene ICs could be used at high frequencies in applications with small voltage swing.The influence of transistor size reduction (scaling) on the speed of realistic multi-stage integrated circuits (ICs) represents the main performance metric of a given transistor technology. Despite extensive interest in graphene electronics, scaling efforts have so far focused on individual transistors rather than multi-stage ICs. Here we study the scaling of graphene ICs based on transistors from 3.3 to 0.5 μm gate lengths and with different channel widths, access lengths, and lead thicknesses. The shortest gate delay of 31 ps per stage was obtained in sub-micron graphene ROs oscillating at 4.3 GHz, which is the highest oscillation frequency obtained in any strictly low-dimensional material to date. We also derived the fundamental Johnson limit, showing that scaled graphene ICs could be used at high frequencies in applications with small voltage swing. Electronic supplementary information (ESI) available: Discussions on the cutoff frequency fT, the maximum frequency of oscillation fmax, and the intrinsic gate delay CV/I. See DOI: 10.1039/c5nr01126d

  18. On the Implementation of 3D Galerkin Boundary Integral Equations

    SciTech Connect

    Nintcheu Fata, Sylvain; Gray, Leonard J

    2010-01-01

    In this article, a reverse contribution technique is proposed to accelerate the construction of the dense influence matrices associated with a Galerkin approximation of singular and hypersingular boundary integral equations of mixed-type in potential theory. In addition, a general-purpose sparse preconditioner for boundary element methods has also been developed to successfully deal with ill-conditioned linear systems arising from the discretization of mixed boundary-value problems on non-smooth surfaces. The proposed preconditioner, which originates from the precorrected-FFT method, is sparse, easy to generate and apply in a Krylov subspace iterative solution of discretized boundary integral equations. Moreover, an approximate inverse of the preconditioner is implicitly built by employing an incomplete LU factorization. Numerical experiments involving mixed boundary-value problems for the Laplace equation are included to illustrate the performance and validity of the proposed techniques.

  19. Display of travelling 3D scenes from single integral-imaging capture

    NASA Astrophysics Data System (ADS)

    Martinez-Corral, Manuel; Dorado, Adrian; Hong, Seok-Min; Sola-Pikabea, Jorge; Saavedra, Genaro

    2016-06-01

    Integral imaging (InI) is a 3D auto-stereoscopic technique that captures and displays 3D images. We present a method for easily projecting the information recorded with this technique by transforming the integral image into a plenoptic image, as well as choosing, at will, the field of view (FOV) and the focused plane of the displayed plenoptic image. Furthermore, with this method we can generate a sequence of images that simulates a camera travelling through the scene from a single integral image. The application of this method permits to improve the quality of 3D display images and videos.

  20. An approach for 3D geoscientific data integration in underground planning

    NASA Astrophysics Data System (ADS)

    Zhong, Zheng; Tor, Yam Khoon; Tan, Guoxian

    2008-12-01

    Due to finite space, there is an increasing need to plan and develop strategic underground facilities and infrastructures for various military and non-military applications in Singapore in recent years. The awareness of the underground option among planners, developers, and financiers should be increased so that subsurface planning issues can be better addressed. The lack of adequate and accurate 3D spatial data often makes the design and construction of such underground works difficult. It is necessary to integrate all of the spatial objects for underground planning. Over the past two decades, a number of commercial software systems have been developed for 3D geographic and geological modeling. For example, VGEGIS software allows users to create 3D surface geological maps. 3D GeoModeller, a 3D geological modeling and geophysical inversion package, allows project geologists to build realistic 3D geology models. This paper presents an approach to integrate the geographic and geological models for underground planning. A prototype of 3D Geographic Information System (3DGIS) called "3DRock" has been developed by authors to implement the data integration with 3D GeoModeler. The results so far showed that 3DRock is able to integrate the above-surface, surface, and subsurface information available from maps, sections, terrain models, topographic data, drillholes, etc. for the Banyan Basin in Jurong Island, Singapore, in a case study.

  1. Experiment for Integrating Dutch 3d Spatial Planning and Bim for Checking Building Permits

    NASA Astrophysics Data System (ADS)

    van Berlo, L.; Dijkmans, T.; Stoter, J.

    2013-09-01

    This paper presents a research project in The Netherlands in which several SMEs collaborated to create a 3D model of the National spatial planning information. This 2D information system described in the IMRO data standard holds implicit 3D information that can be used to generate an explicit 3D model. The project realized a proof of concept to generate a 3D spatial planning model. The team used the model to integrate it with several 3D Building Information Models (BIMs) described in the open data standard Industry Foundation Classes (IFC). Goal of the project was (1) to generate a 3D BIM model from spatial planning information to be used by the architect during the early design phase, and (2) allow 3D checking of building permits. The team used several technologies like CityGML, BIM clash detection and GeoBIM to explore the potential of this innovation. Within the project a showcase was created with a part of the spatial plan from the city of The Hague. Several BIM models were integrated in the 3D spatial plan of this area. A workflow has been described that demonstrates the benefits of collaboration between the spatial domain and the AEC industry in 3D. The research results in a showcase with conclusions and considerations for both national and international practice.

  2. Wafer-scale graphene integrated circuit.

    PubMed

    Lin, Yu-Ming; Valdes-Garcia, Alberto; Han, Shu-Jen; Farmer, Damon B; Meric, Inanc; Sun, Yanning; Wu, Yanqing; Dimitrakopoulos, Christos; Grill, Alfred; Avouris, Phaedon; Jenkins, Keith A

    2011-06-10

    A wafer-scale graphene circuit was demonstrated in which all circuit components, including graphene field-effect transistor and inductors, were monolithically integrated on a single silicon carbide wafer. The integrated circuit operates as a broadband radio-frequency mixer at frequencies up to 10 gigahertz. These graphene circuits exhibit outstanding thermal stability with little reduction in performance (less than 1 decibel) between 300 and 400 kelvin. These results open up possibilities of achieving practical graphene technology with more complex functionality and performance.

  3. Air-touch interaction system for integral imaging 3D display

    NASA Astrophysics Data System (ADS)

    Dong, Han Yuan; Xiang, Lee Ming; Lee, Byung Gook

    2016-07-01

    In this paper, we propose an air-touch interaction system for the tabletop type integral imaging 3D display. This system consists of the real 3D image generation system based on integral imaging technique and the interaction device using a real-time finger detection interface. In this system, we used multi-layer B-spline surface approximation to detect the fingertip and gesture easily in less than 10cm height from the screen via input the hand image. The proposed system can be used in effective human computer interaction method for the tabletop type 3D display.

  4. Acoustic backing in 3-D integration of CMUT with front-end electronics.

    PubMed

    Berg, Sigrid; Rønnekleiv, Arne

    2012-07-01

    Capacitive micromachined ultrasonic transducers (CMUTs) have shown promising qualities for medical imaging. However, there are still some problems to be investigated, and some challenges to overcome. Acoustic backing is necessary to prevent SAWs excited in the surface of the silicon substrate from affecting the transmit pattern from the array. In addition, echoes resulting from bulk waves in the substrate must be removed. There is growing interest in integrating electronic circuits to do some of the beamforming directly below the transducer array. This may be easier to achieve for CMUTs than for traditional piezoelectric transducers. We will present simulations showing that the thickness of the silicon substrate and thicknesses and acoustic properties of the bonding material must be considered, especially when designing highfrequency transducers. Through simulations, we compare the acoustic properties of 3-D stacks bonded with three different bonding techniques; solid-liquid interdiffusion (SLID) bonding, direct fusion bonding, and anisotropic conductive adhesives (ACA). We look at a CMUT array with a center frequency of 30 MHz and three silicon wafers underneath, having a total silicon thickness of 100 μm. We find that fusion bonding is most beneficial if we want to prevent surface waves from damaging the array response, but SLID and ACA are also promising if bonding layer thicknesses can be reduced.

  5. Analog VLSI neural network integrated circuits

    NASA Technical Reports Server (NTRS)

    Kub, F. J.; Moon, K. K.; Just, E. A.

    1991-01-01

    Two analog very large scale integration (VLSI) vector matrix multiplier integrated circuit chips were designed, fabricated, and partially tested. They can perform both vector-matrix and matrix-matrix multiplication operations at high speeds. The 32 by 32 vector-matrix multiplier chip and the 128 by 64 vector-matrix multiplier chip were designed to perform 300 million and 3 billion multiplications per second, respectively. An additional circuit that has been developed is a continuous-time adaptive learning circuit. The performance achieved thus far for this circuit is an adaptivity of 28 dB at 300 KHz and 11 dB at 15 MHz. This circuit has demonstrated greater than two orders of magnitude higher frequency of operation than any previous adaptive learning circuit.

  6. Integrated-Circuit Pseudorandom-Number Generator

    NASA Technical Reports Server (NTRS)

    Steelman, James E.; Beasley, Jeff; Aragon, Michael; Ramirez, Francisco; Summers, Kenneth L.; Knoebel, Arthur

    1992-01-01

    Integrated circuit produces 8-bit pseudorandom numbers from specified probability distribution, at rate of 10 MHz. Use of Boolean logic, circuit implements pseudorandom-number-generating algorithm. Circuit includes eight 12-bit pseudorandom-number generators, outputs are uniformly distributed. 8-bit pseudorandom numbers satisfying specified nonuniform probability distribution are generated by processing uniformly distributed outputs of eight 12-bit pseudorandom-number generators through "pipeline" of D flip-flops, comparators, and memories implementing conditional probabilities on zeros and ones.

  7. Scalable fluidic injector arrays for viral targeting of intact 3-D brain circuits.

    PubMed

    Chan, Stephanie; Bernstein, Jacob; Boyden, Edward

    2010-01-21

    Our understanding of neural circuits--how they mediate the computations that subserve sensation, thought, emotion, and action, and how they are corrupted in neurological and psychiatric disorders--would be greatly facilitated by a technology for rapidly targeting genes to complex 3-dimensional neural circuits, enabling fast creation of "circuit-level transgenics." We have recently developed methods in which viruses encoding for light-sensitive proteins can sensitize specific cell types to millisecond-timescale activation and silencing in the intact brain. We here present the design and implementation of an injector array capable of delivering viruses (or other fluids) to dozens of defined points within the 3-dimensional structure of the brain (Figure. 1A, 1B). The injector array comprises one or more displacement pumps that each drive a set of syringes, each of which feeds into a polyimide/fused-silica capillary via a high-pressure-tolerant connector. The capillaries are sized, and then inserted into, desired locations specified by custom-milling a stereotactic positioning board, thus allowing viruses or other reagents to be delivered to the desired set of brain regions. To use the device, the surgeon first fills the fluidic subsystem entirely with oil, backfills the capillaries with the virus, inserts the device into the brain, and infuses reagents slowly (<0.1 microliters/min). The parallel nature of the injector array facilitates rapid, accurate, and robust labeling of entire neural circuits with viral payloads such as optical sensitizers to enable light-activation and silencing of defined brain circuits. Along with other technologies, such as optical fiber arrays for light delivery to desired sets of brain regions, we hope to create a toolbox that enables the systematic probing of causal neural functions in the intact brain. This technology may not only open up such systematic approaches to circuit-focused neuroscience in mammals, and facilitate labeling of

  8. Estimation of the degree of polarization in low-light 3D integral imaging

    NASA Astrophysics Data System (ADS)

    Carnicer, Artur; Javidi, Bahram

    2016-06-01

    The calculation of the Stokes Parameters and the Degree of Polarization in 3D integral images requires a careful manipulation of the polarimetric elemental images. This fact is particularly important if the scenes are taken in low-light conditions. In this paper, we show that the Degree of Polarization can be effectively estimated even when elemental images are recorded with few photons. The original idea was communicated in [A. Carnicer and B. Javidi, "Polarimetric 3D integral imaging in photon-starved conditions," Opt. Express 23, 6408-6417 (2015)]. First, we use the Maximum Likelihood Estimation approach for generating the 3D integral image. Nevertheless, this method produces very noisy images and thus, the degree of polarization cannot be calculated. We suggest using a Total Variation Denoising filter as a way to improve the quality of the generated 3D images. As a result, noise is suppressed but high frequency information is preserved. Finally, the degree of polarization is obtained successfully.

  9. Reusable vibration resistant integrated circuit mounting socket

    DOEpatents

    Evans, Craig N.

    1995-01-01

    This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and holds it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuit lead can be removed from the socket without damage either to the lead or to the socket components.

  10. Reusable vibration resistant integrated circuit mounting socket

    SciTech Connect

    Evans, C.N.

    1993-12-31

    This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and hold it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuit lead can be removed from the socket without damage either to the lead or to the socket components.

  11. Reverse engineering of integrated circuits

    DOEpatents

    Chisholm, Gregory H.; Eckmann, Steven T.; Lain, Christopher M.; Veroff, Robert L.

    2003-01-01

    Software and a method therein to analyze circuits. The software comprises several tools, each of which perform particular functions in the Reverse Engineering process. The analyst, through a standard interface, directs each tool to the portion of the task to which it is most well suited, rendering previously intractable problems solvable. The tools are generally used iteratively to produce a successively more abstract picture of a circuit, about which incomplete a priori knowledge exists.

  12. Remote artificial eyes using micro-optical circuit for long-distance 3D imaging perception.

    PubMed

    Thammawongsa, Nopparat; Yupapin, Preecha P

    2016-01-01

    A small-scale optical device incorporated with an optical nano-antenna is designed to operate as the remote artificial eye using a tiny conjugate mirror. A basic device known as a conjugate mirror can be formed using the artificial eye device, the partially reflected light intensities from input source are interfered and the 3D whispering gallery modes formed within the ring centers, which can be modulated and propagated to the object. The image pixel is obtained at the center ring and linked with the optic nerve in the remote area via the nano-antenna, which is useful for blind people.

  13. Integration of 3D anatomical data obtained by CT imaging and 3D optical scanning for computer aided implant surgery

    PubMed Central

    2011-01-01

    Background A precise placement of dental implants is a crucial step to optimize both prosthetic aspects and functional constraints. In this context, the use of virtual guiding systems has been recognized as a fundamental tool to control the ideal implant position. In particular, complex periodontal surgeries can be performed using preoperative planning based on CT data. The critical point of the procedure relies on the lack of accuracy in transferring CT planning information to surgical field through custom-made stereo-lithographic surgical guides. Methods In this work, a novel methodology is proposed for monitoring loss of accuracy in transferring CT dental information into periodontal surgical field. The methodology is based on integrating 3D data of anatomical (impression and cast) and preoperative (radiographic template) models, obtained by both CT and optical scanning processes. Results A clinical case, relative to a fully edentulous jaw patient, has been used as test case to assess the accuracy of the various steps concurring in manufacturing surgical guides. In particular, a surgical guide has been designed to place implants in the bone structure of the patient. The analysis of the results has allowed the clinician to monitor all the errors, which have been occurring step by step manufacturing the physical templates. Conclusions The use of an optical scanner, which has a higher resolution and accuracy than CT scanning, has demonstrated to be a valid support to control the precision of the various physical models adopted and to point out possible error sources. A case study regarding a fully edentulous patient has confirmed the feasibility of the proposed methodology. PMID:21338504

  14. Integration of Jeddah Historical BIM and 3D GIS for Documentation and Restoration of Historical Monument

    NASA Astrophysics Data System (ADS)

    Baik, A.; Yaagoubi, R.; Boehm, J.

    2015-08-01

    This work outlines a new approach for the integration of 3D Building Information Modelling and the 3D Geographic Information System (GIS) to provide semantically rich models, and to get the benefits from both systems to help document and analyse cultural heritage sites. Our proposed framework is based on the Jeddah Historical Building Information Modelling process (JHBIM). This JHBIM consists of a Hijazi Architectural Objects Library (HAOL) that supports higher level of details (LoD) while decreasing the time of modelling. The Hijazi Architectural Objects Library has been modelled based on the Islamic historical manuscripts and Hijazi architectural pattern books. Moreover, the HAOL is implemented using BIM software called Autodesk Revit. However, it is known that this BIM environment still has some limitations with the non-standard architectural objects. Hence, we propose to integrate the developed 3D JHBIM with 3D GIS for more advanced analysis. To do so, the JHBIM database is exported and semantically enriched with non-architectural information that is necessary for restoration and preservation of historical monuments. After that, this database is integrated with the 3D Model in the 3D GIS solution. At the end of this paper, we'll illustrate our proposed framework by applying it to a Historical Building called Nasif Historical House in Jeddah. First of all, this building is scanned by the use of a Terrestrial Laser Scanner (TLS) and Close Range Photogrammetry. Then, the 3D JHBIM based on the HOAL is designed on Revit Platform. Finally, this model is integrated to a 3D GIS solution through Autodesk InfraWorks. The shown analysis presented in this research highlights the importance of such integration especially for operational decisions and sharing the historical knowledge about Jeddah Historical City. Furthermore, one of the historical buildings in Old Jeddah, Nasif Historical House, was chosen as a test case for the project.

  15. Research in computer simulation of integrated circuits

    NASA Astrophysics Data System (ADS)

    Newton, A. R.; Pdederson, D. O.

    1983-07-01

    The performance of the new LSI simulator CLASSIE is evaluated on several circuits with a few hundred to over one thousand semiconductor devices. A more accurate run time prediction formula has been found to be appropriate for circuit simulators. The design decisions for optimal performance under the constraints of the hardware (CRAY-1) are presented. Vector computers have an increased potential for fast, accurate simulation at the transistor level of Large-Scale-Integrated Circuits. Design considerations for a new circuit simulator are developed based on the specifics of the vector computer architecture and of LSI circuits. The simulation of Large-Scale-Integrated (LSI) circuits requires very long run time on conventional circuit analysis programs such as SPICE2 and super-mini computers. A new simulator for LSI circuits, CLASSIE, which takes advantage of circuit hierarchy and repetitiveness, and array processors capable of high-speed floating-point computation are a promising combination. While a large number of powerful design verfication tools have been developed for IC design at the transistor and logic gate levels, there are very few silicon-oriented tools for architectural design and evaluation.

  16. Chain Of Test Contacts For Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Lieneweg, Udo

    1989-01-01

    Test structure forms chain of "cross" contacts fabricated together with large-scale integrated circuits. If necessary, number of such chains incorporated at suitable locations in integrated-circuit wafer for determination of fabrication yield of contacts. In new structure, resistances of individual contacts determined: In addition to making it possible to identify local defects, enables generation of statistical distributions of contact resistances for prediction of "parametric" contact yield of fabrication process.

  17. Bi-sided integral imaging with 2D/3D convertibility using scattering polarizer.

    PubMed

    Yeom, Jiwoon; Hong, Keehoon; Park, Soon-gi; Hong, Jisoo; Min, Sung-Wook; Lee, Byoungho

    2013-12-16

    We propose a two-dimensional (2D) and three-dimensional (3D) convertible bi-sided integral imaging. The proposed system uses the polarization state of projected light for switching its operation mode between 2D and 3D modes. By using an optical module composed of two scattering polarizers and one linear polarizer, the proposed integral imaging system simultaneously provides 3D images with 2D background images for observers who are located in the front and the rear sides of the system. The occlusion effect between 2D images and 3D images is realized by using a compensation mask for 2D images and the elemental images. The principle of proposed system is experimentally verified.

  18. Free segmentation in rendered 3D images through synthetic impulse response in integral imaging

    NASA Astrophysics Data System (ADS)

    Martínez-Corral, M.; Llavador, A.; Sánchez-Ortiga, E.; Saavedra, G.; Javidi, B.

    2016-06-01

    Integral Imaging is a technique that has the capability of providing not only the spatial, but also the angular information of three-dimensional (3D) scenes. Some important applications are the 3D display and digital post-processing as for example, depth-reconstruction from integral images. In this contribution we propose a new reconstruction method that takes into account the integral image and a simplified version of the impulse response function (IRF) of the integral imaging (InI) system to perform a two-dimensional (2D) deconvolution. The IRF of an InI system has a periodic structure that depends directly on the axial position of the object. Considering different periods of the IRFs we recover by deconvolution the depth information of the 3D scene. An advantage of our method is that it is possible to obtain nonconventional reconstructions by considering alternative synthetic impulse responses. Our experiments show the feasibility of the proposed method.

  19. Optoelectronic Circuits Using 2D and 3D Self-Collimation Photonic Crystals

    DTIC Science & Technology

    2007-07-01

    and incompatibility with an integrated photonics platform amenable to mass fabrication, leave the scope for new ideas for their fabrication open. TM...insulator an attractive cavity. material system for very-large scale integrated photonics . Materials that incorporate periodic variations in constituent

  20. On the integrability of the motion of 3D-Swinging Atwood machine and related problems

    NASA Astrophysics Data System (ADS)

    Elmandouh, A. A.

    2016-03-01

    In the present article, we study the problem of the motion of 3D- Swinging Atwood machine. A new integrable case for this problem is announced. We point out a new integrable case describing the motion of a heavy particle on a titled cone.

  1. Integrated Circuit Stellar Magnitude Simulator

    ERIC Educational Resources Information Center

    Blackburn, James A.

    1978-01-01

    Describes an electronic circuit which can be used to demonstrate the stellar magnitude scale. Six rectangular light-emitting diodes with independently adjustable duty cycles represent stars of magnitudes 1 through 6. Experimentally verifies the logarithmic response of the eye. (Author/GA)

  2. Learning from graphically integrated 2D and 3D representations improves retention of neuroanatomy

    NASA Astrophysics Data System (ADS)

    Naaz, Farah

    Visualizations in the form of computer-based learning environments are highly encouraged in science education, especially for teaching spatial material. Some spatial material, such as sectional neuroanatomy, is very challenging to learn. It involves learning the two dimensional (2D) representations that are sampled from the three dimensional (3D) object. In this study, a computer-based learning environment was used to explore the hypothesis that learning sectional neuroanatomy from a graphically integrated 2D and 3D representation will lead to better learning outcomes than learning from a sequential presentation. The integrated representation explicitly demonstrates the 2D-3D transformation and should lead to effective learning. This study was conducted using a computer graphical model of the human brain. There were two learning groups: Whole then Sections, and Integrated 2D3D. Both groups learned whole anatomy (3D neuroanatomy) before learning sectional anatomy (2D neuroanatomy). The Whole then Sections group then learned sectional anatomy using 2D representations only. The Integrated 2D3D group learned sectional anatomy from a graphically integrated 3D and 2D model. A set of tests for generalization of knowledge to interpreting biomedical images was conducted immediately after learning was completed. The order of presentation of the tests of generalization of knowledge was counterbalanced across participants to explore a secondary hypothesis of the study: preparation for future learning. If the computer-based instruction programs used in this study are effective tools for teaching anatomy, the participants should continue learning neuroanatomy with exposure to new representations. A test of long-term retention of sectional anatomy was conducted 4-8 weeks after learning was completed. The Integrated 2D3D group was better than the Whole then Sections

  3. Handbook of microwave integrated circuits

    NASA Astrophysics Data System (ADS)

    Hoffmann, Reinmut K.

    The design and operation of ICs for use in the 0.5-20-GHz range are described in an introductory and reference work for industrial engineers. Chapters are devoted to an overview of microwave IC (MIC) technology, general stripline characteristics, microwave transmission line (MTL) parameters for microstrips with isotropic dielectric substrates, higher-order modes on a microstrip, the effects of metallic enclosure on MTL transmission parameters, losses in microstrips, the measurement of MTL parameters, and MTLs on anisotropic dielectric substrates. Consideration is given to coupled microstrips on dielectric substrates, microstrip discontinuities, radiation from microstrip circuits, MTL variations, coplanar MTLs, slotlines, and spurious modes in MTL circuits. Diagrams, drawings, graphs, and a glossary of symbols are provided.

  4. Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications.

    PubMed

    Chen, K N; Tsang, C K; Wu, W W; Lee, S H; Lu, J Q

    2011-04-01

    A method to fabricate nano-scale Cu bond pads for improving bonding quality in 3D integration applications is reported. The effect of Cu bonding quality on inter-level via structural reliability for 3D integration applications is investigated. We developed a Cu nano-scale-height bond pad structure and fabrication process for improved bonding quality by recessing oxides using a combination of SiO2 CMP process and dilute HF wet etching. In addition, in order to achieve improved wafer-level bonding, we introduced a seal design concept that prevents corrosion and provides extra mechanical support. Demonstrations of these concepts and processes provide the feasibility of reliable nano-scale 3D integration applications.

  5. Developement of 3D Vertically Integrated Pattern Recognition Associative Memory (VIPRAM)

    SciTech Connect

    Deputch, G.; Hoff, J.; Lipton, R.; Liu, T.; Olsen, J.; Ramberg, E.; Wu, Jin-Yuan; Yarema, R.; Shochet, M.; Tang, F.; Demarteau, M.; /Argonne /INFN, Padova

    2011-04-13

    for a track trigger, requiring about three orders of magnitude more associative memory patterns than what was used in the original CDF SVT. Significant improvement in the architecture of associative memory structures is needed to run fast pattern recognition algorithms of this scale. We are proposing the development of 3D integrated circuit technology as a way to implement new associative memory structures for fast pattern recognition applications. Adding a 'third' dimension to the signal processing chain, as compared to the two-dimensional nature of printed circuit boards, Field Programmable Gate Arrays (FPGAs), etc., opens up the possibility for new architectures that could dramatically enhance pattern recognition capability. We are currently performing preliminary design work to demonstrate the feasibility of this approach. In this proposal, we seek to develop the design and perform the ASIC engineering necessary to realize a prototype device. While our focus here is on the Energy Frontier (e.g. the LHC), the approach may have applications in experiments in the Intensity Frontier and the Cosmic Frontier as well as other scientific and medical projects. In fact, the technique that we are proposing is very generic and could have wide applications far beyond track trigger, both within and outside HEP.

  6. Dual-view integral imaging 3D display by using orthogonal polarizer array and polarization switcher.

    PubMed

    Wang, Qiong-Hua; Ji, Chao-Chao; Li, Lei; Deng, Huan

    2016-01-11

    In this paper, a dual-view integral imaging three-dimensional (3D) display consisting of a display panel, two orthogonal polarizer arrays, a polarization switcher, and a micro-lens array is proposed. Two elemental image arrays for two different 3D images are presented by the display panel alternately, and the polarization switcher controls the polarization direction of the light rays synchronously. The two elemental image arrays are modulated by their corresponding and neighboring micro-lenses of the micro-lens array, and reconstruct two different 3D images in viewing zones 1 and 2, respectively. A prototype of the dual-view II 3D display is developed, and it has good performances.

  7. Strategies for Effectively Visualizing a 3D Flow Using Volume Line Integral Convolution

    NASA Technical Reports Server (NTRS)

    Interrante, Victoria; Grosch, Chester

    1997-01-01

    This paper discusses strategies for effectively portraying 3D flow using volume line integral convolution. Issues include defining an appropriate input texture, clarifying the distinct identities and relative depths of the advected texture elements, and selectively highlighting regions of interest in both the input and output volumes. Apart from offering insights into the greater potential of 3D LIC as a method for effectively representing flow in a volume, a principal contribution of this work is the suggestion of a technique for generating and rendering 3D visibility-impeding 'halos' that can help to intuitively indicate the presence of depth discontinuities between contiguous elements in a projection and thereby clarify the 3D spatial organization of elements in the flow. The proposed techniques are applied to the visualization of a hot, supersonic, laminar jet exiting into a colder, subsonic coflow.

  8. Progress in organic integrated circuit manufacture

    NASA Astrophysics Data System (ADS)

    Taylor, D. Martin

    2016-02-01

    This review article focuses on the development of processes for the manufacture of organic electronic circuits. Beginning with the first report of an organic transistor it highlights the key developments leading to the successful manufacture of microprocessors and other complex circuits incorporating organic transistors. Both batch processing (based on silicon integrated circuit technology) as well as mass-printing, roll-to-roll (R2R) approaches are discussed. Currently, the best circuit performances are achieved using batch processing. It is suggested that an emerging, large mass-market for electronic tags may dictate that R2R manufacture will likely be required to meet the high throughput rates needed. However, significant improvements in resolution and registration are necessary to achieve increased circuit operating speeds.

  9. Electronic circuits and systems: A compilation. [including integrated circuits, logic circuits, varactor diode circuits, low pass filters, and optical equipment circuits

    NASA Technical Reports Server (NTRS)

    1975-01-01

    Technological information is presented electronic circuits and systems which have potential utility outside the aerospace community. Topics discussed include circuit components such as filters, converters, and integrators, circuits designed for use with specific equipment or systems, and circuits designed primarily for use with optical equipment or displays.

  10. Polysilicon photoconductor for integrated circuits

    DOEpatents

    Hammond, Robert B.; Bowman, Douglas R.

    1990-01-01

    A photoconductive element of polycrystalline silicon is provided with intrinsic response time which does not limit overall circuit response. An undoped polycrystalline silicon layer is deposited by LPCVD to a selected thickness on silicon dioxide. The deposited polycrystalline silicon is then annealed at a selected temperature and for a time effective to obtain crystal sizes effective to produce an enhanced current output. The annealed polycrystalline layer is subsequently exposed and damaged by ion implantation to a damage factor effective to obtain a fast photoconductive response.

  11. Polysilicon photoconductor for integrated circuits

    DOEpatents

    Hammond, R.B.; Bowman, D.R.

    1989-04-11

    A photoconductive element of polycrystalline silicon is provided with intrinsic response time which does not limit overall circuit response. An undoped polycrystalline silicon layer is deposited by LPCVD to a selected thickness on silicon dioxide. The deposited polycrystalline silicon is then annealed at a selected temperature and for a time effective to obtain crystal sizes effective to produce an enhanced current output. The annealed polycrystalline layer is subsequently exposed and damaged by ion implantation to a damage factor effective to obtain a fast photoconductive response. 6 figs.

  12. Polysilicon photoconductor for integrated circuits

    DOEpatents

    Hammond, Robert B.; Bowman, Douglas R.

    1989-01-01

    A photoconductive element of polycrystalline silicon is provided with intrinsic response time which does not limit overall circuit response. An undoped polycrystalline silicon layer is deposited by LPCVD to a selected thickness on silicon dioxide. The deposited polycrystalline silicon is then annealed at a selected temperature and for a time effective to obtain crystal sizes effective to produce an enhanced current output. The annealed polycrystalline layer is subsequently exposed and damaged by ion implantation to a damage factor effective to obtain a fast photoconductive response.

  13. Displacement Damage in Bipolar Linear Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Rax, B. G.; Johnston, A. H.; Miyahira, T.

    2000-01-01

    Although many different processes can be used to manufacture linear integrated circuits, the process that is used for most circuits is optimized for high voltage -- a total power supply voltage of about 40 V -- and low cost. This process, which has changed little during the last twenty years, uses lateral and substrate p-n-p transistors. These p-n-p transistors have very wide base regions, increasing their sensitivity to displacement damage from electrons and protons. Although displacement damage effects can be easily treated for individual transistors, the net effect on linear circuits can be far more complex because circuit operation often depends on the interaction of several internal transistors. Note also that some circuits are made with more advanced processes with much narrower base widths. Devices fabricated with these newer processes are not expected to be significantly affected by displacement damage for proton fluences below 1 x 10(exp 12) p/sq cm. This paper discusses displacement damage in linear integrated circuits with more complex failure modes than those exhibited by simpler devices, such as the LM111 comparator, where the dominant response mode is gain degradation of the input transistor. Some circuits fail catastrophically at much lower equivalent total dose levels compared to tests with gamma rays. The device works satisfactorily up to nearly 1 Mrad(Si) when it is irradiated with gamma rays, but fails catastrophically between 50 and 70 krad(Si) when it is irradiated with protons.

  14. Maximum Temperature Detection System for Integrated Circuits

    NASA Astrophysics Data System (ADS)

    Frankiewicz, Maciej; Kos, Andrzej

    2015-03-01

    The paper describes structure and measurement results of the system detecting present maximum temperature on the surface of an integrated circuit. The system consists of the set of proportional to absolute temperature sensors, temperature processing path and a digital part designed in VHDL. Analogue parts of the circuit where designed with full-custom technique. The system is a part of temperature-controlled oscillator circuit - a power management system based on dynamic frequency scaling method. The oscillator cooperates with microprocessor dedicated for thermal experiments. The whole system is implemented in UMC CMOS 0.18 μm (1.8 V) technology.

  15. Solution methods for very highly integrated circuits.

    SciTech Connect

    Nong, Ryan; Thornquist, Heidi K.; Chen, Yao; Mei, Ting; Santarelli, Keith R.; Tuminaro, Raymond Stephen

    2010-12-01

    While advances in manufacturing enable the fabrication of integrated circuits containing tens-to-hundreds of millions of devices, the time-sensitive modeling and simulation necessary to design these circuits poses a significant computational challenge. This is especially true for mixed-signal integrated circuits where detailed performance analyses are necessary for the individual analog/digital circuit components as well as the full system. When the integrated circuit has millions of devices, performing a full system simulation is practically infeasible using currently available Electrical Design Automation (EDA) tools. The principal reason for this is the time required for the nonlinear solver to compute the solutions of large linearized systems during the simulation of these circuits. The research presented in this report aims to address the computational difficulties introduced by these large linearized systems by using Model Order Reduction (MOR) to (i) generate specialized preconditioners that accelerate the computation of the linear system solution and (ii) reduce the overall dynamical system size. MOR techniques attempt to produce macromodels that capture the desired input-output behavior of larger dynamical systems and enable substantial speedups in simulation time. Several MOR techniques that have been developed under the LDRD on 'Solution Methods for Very Highly Integrated Circuits' will be presented in this report. Among those presented are techniques for linear time-invariant dynamical systems that either extend current approaches or improve the time-domain performance of the reduced model using novel error bounds and a new approach for linear time-varying dynamical systems that guarantees dimension reduction, which has not been proven before. Progress on preconditioning power grid systems using multi-grid techniques will be presented as well as a framework for delivering MOR techniques to the user community using Trilinos and the Xyce circuit simulator

  16. Layout techniques for integrated circuits

    SciTech Connect

    Tsay, C.Y.

    1986-01-01

    Several techniques are presented for solving circuit-layout problems. In particular, a channel-placement algorithm is first introduced to reduce the channel density (d) so that a channel router can complete the routing requirements in fewer tracks. A 4-layer channel-routing model is then formulated so that a general channel routing problem (CRP) with cyclic conflicts and long critical paths can be completed with d/2. Finally, the 4-layer, 2-dimensional switchbox routing problem needed to enhance the channel routing in general circuit layout is investigated from the graph-theoretical viewpoint. The channel-placement technique consists of two phases. Using the principle of decomposition, the initial placement phase effectively reduces the complexity of the problem and, therefore, improves the efficiency of the second phase, which is called the iterative improvement placement. The main feature of this phase is its hill-climbing ability to avoid being trapped at local minima. The combination of these two phases leads to an efficient technique for standard cell placement. To utilize multi-layer technology, a new 4-layer channel routing model is introduced to minimize the channel width of more-generalized CRP's. The 2-dimensional switchbox routing problem is transformed to an equivalent graph-theoretical problem.

  17. 3D Printed Microfluidic Device with Integrated Biosensors for Online Analysis of Subcutaneous Human Microdialysate

    PubMed Central

    2015-01-01

    This work presents the design, fabrication, and characterization of a robust 3D printed microfluidic analysis system that integrates with FDA-approved clinical microdialysis probes for continuous monitoring of human tissue metabolite levels. The microfluidic device incorporates removable needle type integrated biosensors for glucose and lactate, which are optimized for high tissue concentrations, housed in novel 3D printed electrode holders. A soft compressible 3D printed elastomer at the base of the holder ensures a good seal with the microfluidic chip. Optimization of the channel size significantly improves the response time of the sensor. As a proof-of-concept study, our microfluidic device was coupled to lab-built wireless potentiostats and used to monitor real-time subcutaneous glucose and lactate levels in cyclists undergoing a training regime. PMID:26070023

  18. Novel fully integrated computer system for custom footwear: from 3D digitization to manufacturing

    NASA Astrophysics Data System (ADS)

    Houle, Pascal-Simon; Beaulieu, Eric; Liu, Zhaoheng

    1998-03-01

    This paper presents a recently developed custom footwear system, which integrates 3D digitization technology, range image fusion techniques, a 3D graphical environment for corrective actions, parametric curved surface representation and computer numerical control (CNC) machining. In this system, a support designed with the help of biomechanics experts can stabilize the foot in a correct and neutral position. The foot surface is then captured by a 3D camera using active ranging techniques. A software using a library of documented foot pathologies suggests corrective actions on the orthosis. Three kinds of deformations can be achieved. The first method uses previously scanned pad surfaces by our 3D scanner, which can be easily mapped onto the foot surface to locally modify the surface shape. The second kind of deformation is construction of B-Spline surfaces by manipulating control points and modifying knot vectors in a 3D graphical environment to build desired deformation. The last one is a manual electronic 3D pen, which may be of different shapes and sizes, and has an adjustable 'pressure' information. All applied deformations should respect a G1 surface continuity, which ensure that the surface can accustom a foot. Once the surface modification process is completed, the resulting data is sent to manufacturing software for CNC machining.

  19. Package for integrated optic circuit and method

    DOEpatents

    Kravitz, S.H.; Hadley, G.R.; Warren, M.E.; Carson, R.F.; Armendariz, M.G.

    1998-08-04

    A structure and method are disclosed for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package. 6 figs.

  20. Package for integrated optic circuit and method

    DOEpatents

    Kravitz, Stanley H.; Hadley, G. Ronald; Warren, Mial E.; Carson, Richard F.; Armendariz, Marcelino G.

    1998-01-01

    A structure and method for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package.

  1. Dual-mode intracranial catheter integrating 3D ultrasound imaging and hyperthermia for neuro-oncology: feasibility study.

    PubMed

    Herickhoff, Carl D; Light, Edward D; Bing, Kristin F; Mukundan, Srinivasan; Grant, Gerald A; Wolf, Patrick D; Smith, Stephen W

    2009-04-01

    In this study, we investigated the feasibility of an intracranial catheter transducer with dual-mode capability of real-time 3D (RT3D) imaging and ultrasound hyperthermia, for application in the visualization and treatment of tumors in the brain. Feasibility is demonstrated in two ways: first by using a 50-element linear array transducer (17 mm x 3.1 mm aperture) operating at 4.4 MHz with our Volumetrics diagnostic scanner and custom, electrical impedance-matching circuits to achieve a temperature rise over 4 degrees C in excised pork muscle, and second, by designing and constructing a 12 Fr, integrated matrix and linear-array catheter transducer prototype for combined RT3D imaging and heating capability. This dual-mode catheter incorporated 153 matrix array elements and 11 linear array elements diced on a 0.2 mm pitch, with a total aperture size of 8.4 mm x 2.3 mm. This 3.64 MHz array achieved a 3.5 degrees C in vitro temperature rise at a 2 cm focal distance in tissue-mimicking material. The dual-mode catheter prototype was compared with a Siemens 10 Fr AcuNav catheter as a gold standard in experiments assessing image quality and therapeutic potential and both probes were used in an in vivo canine brain model to image anatomical structures and color Doppler blood flow and to attempt in vivo heating.

  2. Large scale 3-D modeling by integration of resistivity models and borehole data through inversion

    NASA Astrophysics Data System (ADS)

    Foged, N.; Marker, P. A.; Christansen, A. V.; Bauer-Gottwein, P.; Jørgensen, F.; Høyer, A.-S.; Auken, E.

    2014-02-01

    We present an automatic method for parameterization of a 3-D model of the subsurface, integrating lithological information from boreholes with resistivity models through an inverse optimization, with the objective of further detailing for geological models or as direct input to groundwater models. The parameter of interest is the clay fraction, expressed as the relative length of clay-units in a depth interval. The clay fraction is obtained from lithological logs and the clay fraction from the resistivity is obtained by establishing a simple petrophysical relationship, a translator function, between resistivity and the clay fraction. Through inversion we use the lithological data and the resistivity data to determine the optimum spatially distributed translator function. Applying the translator function we get a 3-D clay fraction model, which holds information from the resistivity dataset and the borehole dataset in one variable. Finally, we use k means clustering to generate a 3-D model of the subsurface structures. We apply the concept to the Norsminde survey in Denmark integrating approximately 700 boreholes and more than 100 000 resistivity models from an airborne survey in the parameterization of the 3-D model covering 156 km2. The final five-cluster 3-D model differentiates between clay materials and different high resistive materials from information held in resistivity model and borehole observations respectively.

  3. Large-scale 3-D modeling by integration of resistivity models and borehole data through inversion

    NASA Astrophysics Data System (ADS)

    Foged, N.; Marker, P. A.; Christansen, A. V.; Bauer-Gottwein, P.; Jørgensen, F.; Høyer, A.-S.; Auken, E.

    2014-11-01

    We present an automatic method for parameterization of a 3-D model of the subsurface, integrating lithological information from boreholes with resistivity models through an inverse optimization, with the objective of further detailing of geological models, or as direct input into groundwater models. The parameter of interest is the clay fraction, expressed as the relative length of clay units in a depth interval. The clay fraction is obtained from lithological logs and the clay fraction from the resistivity is obtained by establishing a simple petrophysical relationship, a translator function, between resistivity and the clay fraction. Through inversion we use the lithological data and the resistivity data to determine the optimum spatially distributed translator function. Applying the translator function we get a 3-D clay fraction model, which holds information from the resistivity data set and the borehole data set in one variable. Finally, we use k-means clustering to generate a 3-D model of the subsurface structures. We apply the procedure to the Norsminde survey in Denmark, integrating approximately 700 boreholes and more than 100 000 resistivity models from an airborne survey in the parameterization of the 3-D model covering 156 km2. The final five-cluster 3-D model differentiates between clay materials and different high-resistivity materials from information held in the resistivity model and borehole observations, respectively.

  4. Millimeter And Submillimeter-Wave Integrated Circuits On Quartz

    NASA Technical Reports Server (NTRS)

    Mehdi, Imran; Mazed, Mohammad; Siegel, Peter; Smith, R. Peter

    1995-01-01

    Proposed Quartz substrate Upside-down Integrated Device (QUID) relies on UV-curable adhesive to bond semiconductor with quartz. Integrated circuits including planar GaAs Schottky diodes and passive circuit elements (such as bandpass filters) fabricated on quartz substrates. Circuits designed to operate as mixers in waveguide circuit at millimeter and submillimeter wavelengths. Integrated circuits mechanically more robust, larger, and easier to handle than planar Schottky diode chips. Quartz substrate more suitable for waveguide circuits than GaAs substrate.

  5. Flexible fabrication of multi-scale integrated 3D periodic nanostructures with phase mask

    NASA Astrophysics Data System (ADS)

    Yuan, Liang Leon

    Top-down fabrication of artificial nanostructures, especially three-dimensional (3D) periodic nanostructures, that forms uniform and defect-free structures over large area with the advantages of high throughput and rapid processing and in a manner that can further monolithically integrate into multi-scale and multi-functional devices is long-desired but remains a considerable challenge. This thesis study advances diffractive optical element (DOE) based 3D laser holographic nanofabrication of 3D periodic nanostructures and develops new kinds of DOEs for advanced diffracted-beam control during the fabrication. Phase masks, as one particular kind of DOE, are a promising direction for simple and rapid fabrication of 3D periodic nanostructures by means of Fresnel diffraction interference lithography. When incident with a coherent beam of light, a suitable phase mask (e.g. with 2D nano-grating) can create multiple diffraction orders that are inherently phase-locked and overlap to form a 3D light interference pattern in the proximity of the DOE. This light pattern is typically recorded in photosensitive materials including photoresist to develop into 3D photonic crystal nanostructure templates. Two kinds of advanced phase masks were developed that enable delicate phase control of multiple diffraction beams. The first exploits femtosecond laser direct writing inside fused silica to assemble multiple (up to nine) orthogonally crossed (2D) grating layers, spaced on Talbot planes to overcome the inherent weak diffraction efficiency otherwise found in low-contrast volume gratings. A systematic offsetting of orthogonal grating layers to establish phase offsets over 0 to pi/2 range provided precise means for controlling the 3D photonic crystal structure symmetry between body centered tetragonal (BCT) and woodpile-like tetragonal (wTTR). The second phase mask consisted of two-layered nanogratings with small sub-wavelength grating periods and phase offset control. That was

  6. Laboratory experiments in integrated circuit fabrication

    NASA Technical Reports Server (NTRS)

    Jenkins, Thomas J.; Kolesar, Edward S.

    1993-01-01

    The objectives of the experiment are fourfold: to provide practical experience implementing the fundamental processes and technology associated with the science and art of integrated circuit (IC) fabrication; to afford the opportunity for the student to apply the theory associated with IC fabrication and semiconductor device operation; to motivate the student to exercise engineering decisions associated with fabricating integrated circuits; and to complement the theory of n-channel MOS and diffused devices that are presented in the classroom by actually fabricating and testing them. Therefore, a balance between theory and practice can be realized in the education of young engineers, whose education is often criticized as lacking sufficient design and practical content.

  7. Test Structures For Bumpy Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Buehler, Martin G.; Sayah, Hoshyar R.

    1989-01-01

    Cross-bridge resistors added to comb and serpentine patterns. Improved combination of test structures built into integrated circuit used to evaluate design rules, fabrication processes, and quality of interconnections. Consist of meshing serpentines and combs, and cross bridge. Structures used to make electrical measurements revealing defects in design or fabrication. Combination of test structures includes three comb arrays, two serpentine arrays, and cross bridge. Made of aluminum or polycrystalline silicon, depending on material in integrated-circuit layers evaluated. Aluminum combs and serpentine arrays deposited over steps made by polycrystalline silicon and diffusion layers, while polycrystalline silicon versions of these structures used to cross over steps made by thick oxide layer.

  8. Trends in integrated circuit design for particle physics experiments

    NASA Astrophysics Data System (ADS)

    Atkin, E. V.

    2017-01-01

    Integrated circuits are one of the key complex units available to designers of multichannel detector setups. A whole number of factors makes Application Specific Integrated Circuits (ASICs) valuable for Particle Physics and Astrophysics experiments. Among them the most important ones are: integration scale, low power dissipation, radiation tolerance. In order to make possible future experiments in the intensity, cosmic, and energy frontiers today ASICs should provide new level of functionality at a new set of constraints and trade-offs, like low-noise high-dynamic range amplification and pulse shaping, high-speed waveform sampling, low power digitization, fast digital data processing, serialization and data transmission. All integrated circuits, necessary for physical instrumentation, should be radiation tolerant at an earlier not reached level (hundreds of Mrad) of total ionizing dose and allow minute almost 3D assemblies. The paper is based on literary source analysis and presents an overview of the state of the art and trends in nowadays chip design, using partially own ASIC lab experience. That shows a next stage of ising micro- and nanoelectronics in physical instrumentation.

  9. Microwave integrated circuits for space applications

    NASA Technical Reports Server (NTRS)

    Leonard, Regis F.; Romanofsky, Robert R.

    1991-01-01

    Monolithic microwave integrated circuits (MMIC), which incorporate all the elements of a microwave circuit on a single semiconductor substrate, offer the potential for drastic reductions in circuit weight and volume and increased reliability, all of which make many new concepts in electronic circuitry for space applications feasible, including phased array antennas. NASA has undertaken an extensive program aimed at development of MMICs for space applications. The first such circuits targeted for development were an extension of work in hybrid (discrete component) technology in support of the Advanced Communication Technology Satellite (ACTS). It focused on power amplifiers, receivers, and switches at ACTS frequencies. More recent work, however, focused on frequencies appropriate for other NASA programs and emphasizes advanced materials in an effort to enhance efficiency, power handling capability, and frequency of operation or noise figure to meet the requirements of space systems.

  10. Three-Dimensional Integrated Characterization and Archiving System (3D-ICAS). Phase 1

    SciTech Connect

    1994-07-01

    3D-ICAS is being developed to support Decontamination and Decommissioning operations for DOE addressing Research Area 6 (characterization) of the Program Research and Development Announcement. 3D-ICAS provides in-situ 3-dimensional characterization of contaminated DOE facilities. Its multisensor probe contains a GC/MS (gas chromatography/mass spectrometry using noncontact infrared heating) sensor for organics, a molecular vibrational sensor for base material identification, and a radionuclide sensor for radioactive contaminants. It will provide real-time quantitative measurements of volatile organics and radionuclides on bare materials (concrete, asbestos, transite); it will provide 3-D display of the fusion of all measurements; and it will archive the measurements for regulatory documentation. It consists of two robotic mobile platforms that operate in hazardous environments linked to an integrated workstation in a safe environment.

  11. 3D Navigation and Integrated Hazard Display in Advanced Avionics: Workload, Performance, and Situation Awareness

    NASA Technical Reports Server (NTRS)

    Wickens, Christopher D.; Alexander, Amy L.

    2004-01-01

    We examined the ability for pilots to estimate traffic location in an Integrated Hazard Display, and how such estimations should be measured. Twelve pilots viewed static images of traffic scenarios and then estimated the outside world locations of queried traffic represented in one of three display types (2D coplanar, 3D exocentric, and split-screen) and in one of four conditions (display present/blank crossed with outside world present/blank). Overall, the 2D coplanar display best supported both vertical (compared to 3D) and lateral (compared to split-screen) traffic position estimation performance. Costs of the 3D display were associated with perceptual ambiguity. Costs of the split screen display were inferred to result from inappropriate attention allocation. Furthermore, although pilots were faster in estimating traffic locations when relying on memory, accuracy was greatest when the display was available.

  12. Microwave integrated circuit for Josephson voltage standards

    NASA Technical Reports Server (NTRS)

    Holdeman, L. B.; Toots, J.; Chang, C. C. (Inventor)

    1980-01-01

    A microwave integrated circuit comprised of one or more Josephson junctions and short sections of microstrip or stripline transmission line is fabricated from thin layers of superconducting metal on a dielectric substrate. The short sections of transmission are combined to form the elements of the circuit and particularly, two microwave resonators. The Josephson junctions are located between the resonators and the impedance of the Josephson junctions forms part of the circuitry that couples the two resonators. The microwave integrated circuit has an application in Josephson voltage standards. In this application, the device is asymmetrically driven at a selected frequency (approximately equal to the resonance frequency of the resonators), and a d.c. bias is applied to the junction. By observing the current voltage characteristic of the junction, a precise voltage, proportional to the frequency of the microwave drive signal, is obtained.

  13. Femtosecond laser 3D nanofabrication in glass: enabling direct write of integrated micro/nanofluidic chips

    NASA Astrophysics Data System (ADS)

    Cheng, Ya; Liao, Yang; Sugioka, Koji

    2014-03-01

    The creation of complex three-dimensional (3D) fluidic systems composed of hollow micro- and nanostructures embedded in transparent substrates has attracted significant attention from both scientific and applied research communities. However, it is by now still a formidable challenge to build 3D micro- and nanofluidic structures with arbitrary configurations using conventional planar lithographic fabrication methods. As a direct and maskless fabrication technique, femtosecond laser micromachining provides a straightforward approach for high-precision spatial-selective modification inside transparent materials through nonlinear optical absorption. Here, we demonstrate rapid fabrication of high-aspect-ratio micro- and/or nanofluidic structures with various 3D configurations in glass substrates by femtosecond laser direct writing. Based on this approach, we demonstrate several functional micro- and nanofluidic devices including a 3D passive microfluidic mixer, a capillary electrophoresis (CE) analysis chip, and an integrated micro-nanofluidic system for single DNA analysis. This technology offers new opportunities to develop novel 3D micro-nanofluidic systems for a variety of lab-on-a-chip applications.

  14. The benefits of enhanced integration capabilities in 3-D reservoir modelling and simulation

    SciTech Connect

    O`Rourke, S.T.; Ikwumonu, A.

    1996-12-31

    The use of proprietary, closely linked 3-D geological and reservoir simulation software has greatly enhanced the reservoir modelling process by enabling complete integration of geological and engineering data in a 3-D manner. The software were used to model and simulate a deltaic sandstone reservoir in the Nigerian Forcados Yokri field in order to describe the reservoir sweep pattern. A simple simulation of the reservoir was first carried out to identify the main controls on the reservoir performance, which in this case were the intra-reservoir shales. As they are the only baffles or barriers to flow, proper modelling of them was critical to achieving a history match. Well logs, 3-D seismic, limited core data and sequence stratigraphic concepts were used to define a three dimensional depositional model which was then used to guide the 3-D reservoir architecture modelling. The reservoir model was evaluated in the 3-D simulator and, when the initial model did not yield a proper match with the historical production data, alternative models were easily generated and simulated until an acceptable match was achieved. The result was a 10% increase in predicted ultimate recovery, a better understanding of the reservoir and an optimized reservoir depletion plan.

  15. 3D shape shearography with integrated structured light projection for strain inspection of curved objects

    NASA Astrophysics Data System (ADS)

    Anisimov, Andrei G.; Groves, Roger M.

    2015-05-01

    Shearography (speckle pattern shearing interferometry) is a non-destructive testing technique that provides full-field surface strain characterization. Although real-life objects especially in aerospace, transport or cultural heritage are not flat (e.g. aircraft leading edges or sculptures), their inspection with shearography is of interest for both hidden defect detection and material characterization. Accurate strain measuring of a highly curved or free form surface needs to be performed by combining inline object shape measuring and processing of shearography data in 3D. Previous research has not provided a general solution. This research is devoted to the practical questions of 3D shape shearography system development for surface strain characterization of curved objects. The complete procedure of calibration and data processing of a 3D shape shearography system with integrated structured light projector is presented. This includes an estimation of the actual shear distance and a sensitivity matrix correction within the system field of view. For the experimental part a 3D shape shearography system prototype was developed. It employs three spatially-distributed shearing cameras, with Michelson interferometers acting as the shearing devices, one illumination laser source and a structured light projector. The developed system performance was evaluated with a previously reported cylinder specimen (length 400 mm, external diameter 190 mmm) loaded by internal pressure. Further steps for the 3D shape shearography prototype and the technique development are also proposed.

  16. Enhancements to - and Submillimetre - Integrated Circuit Receivers.

    NASA Astrophysics Data System (ADS)

    Veidt, Bruce George

    1995-01-01

    An important area of radio astronomy instrumentation is the development of sensitive receivers at millimetre - and submillimetre-wavelengths. Over the last decade, there has been steady progress in advancing the technology from using receivers based on mechanically machined waveguides and horn antennas to transmission lines and antennas fabricated using integrated circuit techniques. The motivation has been to simplify the fabrication of the receivers through the use of photolithography and etching. It is hoped that this will eventually lead to the development of focal plane arrays, which have many elements placed side-by-side forming a radio camera. The first part of this thesis addresses one of the problems with the integrated circuit technology, namely the fixed nature of the circuits, by examining one type of electrically-adjustable tuning. In those experiments, the bias voltage was modulated across the active device so as to change its tuning. Unfortunately the tuning effect was severely limited by the electrical nonlinearity of the device. Another part of this thesis builds upon the integrated nature of modern receivers by adding what, up until now, has been an external component: the Josephson effect suppression electromagnet. This technique will allow the receiving elements to be much simpler and smaller than would otherwise be the case. Finally, the last part of this thesis examines another method of constructing antennas and transmission lines using integrated circuit techniques. This work shows the feasibility of integrating a waveguide fabricated with integrated circuit technology with a diagonal horn antenna. This technique will provide another option for receiver designers.

  17. Low cost 3D-printing used in an undergraduate project: an integrating sphere for measurement of photoluminescence quantum yield

    NASA Astrophysics Data System (ADS)

    Tomes, John J.; Finlayson, Chris E.

    2016-09-01

    We report upon the exploitation of the latest 3D printing technologies to provide low-cost instrumentation solutions, for use in an undergraduate level final-year project. The project addresses prescient research issues in optoelectronics, which would otherwise be inaccessible to such undergraduate student projects. The experimental use of an integrating sphere in conjunction with a desktop spectrometer presents opportunities to use easily handled, low cost materials as a means to illustrate many areas of physics such as spectroscopy, lasers, optics, simple circuits, black body radiation and data gathering. Presented here is a 3rd year undergraduate physics project which developed a low cost (£25) method to manufacture an experimentally accurate integrating sphere by 3D printing. Details are given of both a homemade internal reflectance coating formulated from readily available materials, and a robust instrument calibration method using a tungsten bulb. The instrument is demonstrated to give accurate and reproducible experimental measurements of luminescence quantum yield of various semiconducting fluorophores, in excellent agreement with literature values.

  18. Package Holds Five Monolithic Microwave Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Mysoor, Narayan R.; Decker, D. Richard; Olson, Hilding M.

    1996-01-01

    Packages protect and hold monolithic microwave integrated circuit (MMIC) chips while providing dc and radio-frequency (RF) electrical connections for chips undergoing development. Required to be compact, lightweight, and rugged. Designed to minimize undesired resonances, reflections, losses, and impedance mismatches.

  19. Integrated Circuits in the Introductory Electronics Laboratory

    ERIC Educational Resources Information Center

    English, Thomas C.; Lind, David A.

    1973-01-01

    Discusses the use of an integrated circuit operational amplifier in an introductory electronics laboratory course for undergraduate science majors. The advantages of this approach and the implications for scientific instrumentation are identified. Describes a number of experiments suitable for the undergraduate laboratory. (Author/DF)

  20. Designing Test Chips for Custom Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Buehler, M. G.; Griswold, T. W.; Pina, C. A.; Timoc, C. C.

    1985-01-01

    Collection of design and testing procedures partly automates development of built-in test chips for CMOS integrated circuits. Testchip methodology intended especially for users of custom integratedcircuit wafers. Test-Chip Designs and Testing Procedures (including datareduction procedures) generated automatically by computer from programed design and testing rules and from information supplied by user.

  1. Integrated Circuit Failure Analysis Hypertext Help System

    SciTech Connect

    Henderson, Christopher L.; Barton, Daniel L.; Campbell, Ann N.; Cole, Edward I; Mikawa, Russell E.; Peterson, Kenneth A.; Rife, James L.; Soden, Jerry M.

    1995-02-23

    This software assists a failure analyst performing failure analysis on integrated circuits. The software can also be used to train inexperienced failure analysts. The software also provides a method for storing information and making it easily available to experienced failure analysts.

  2. Heat-Transfer Microstructures for Integrated Circuits

    DTIC Science & Technology

    2007-11-02

    fatigue failure curves for silicon mounted on molybdenum or copper (from Lang et a[ [75]). Microcapillary thermal interface concept. a) Tunnels...Coolant Figure of Merit Complementary Metal-Oxide-Semiconductor Emitter- Coupled Logic Integrated Circuit Metal-Oxide-Semiconductor Median Time to...nominally independent devices; for example, electromagnetic coupling (crosstalk) between adjacent long, parallel wires on an IC, especially when a ground

  3. Bioluminescent bioreporter integrated circuit detection methods

    SciTech Connect

    Simpson, Michael L.; Paulus, Michael J.; Sayler, Gary S.; Applegate, Bruce M.; Ripp, Steven A.

    2005-06-14

    Disclosed are monolithic bioelectronic devices comprising a bioreporter and an OASIC. These bioluminescent bioreporter integrated circuit are useful in detecting substances such as pollutants, explosives, and heavy-metals residing in inhospitable areas such as groundwater, industrial process vessels, and battlefields. Also disclosed are methods and apparatus for detection of particular analytes, including ammonia and estrogen compounds.

  4. Optoelectronic Integrated Circuits For Neural Networks

    NASA Technical Reports Server (NTRS)

    Psaltis, D.; Katz, J.; Kim, Jae-Hoon; Lin, S. H.; Nouhi, A.

    1990-01-01

    Many threshold devices placed on single substrate. Integrated circuits containing optoelectronic threshold elements developed for use as planar arrays of artificial neurons in research on neural-network computers. Mounted with volume holograms recorded in photorefractive crystals serving as dense arrays of variable interconnections between neurons.

  5. All-ion-implantation process for integrated circuits

    NASA Technical Reports Server (NTRS)

    Woo, D. S.

    1979-01-01

    Simpler than diffusion fabrication, ion bombardment produces complementary-metal-oxide-semiconductor / silicon-on-sapphire (CMOS/SOS) circuits that are one-third faster. Ion implantation simplifies the integrated circuit fabrication procedure and produces circuits with uniform characteristics.

  6. Integrating Online and Offline 3D Deep Learning for Automated Polyp Detection in Colonoscopy Videos.

    PubMed

    Yu, Lequan; Chen, Hao; Dou, Qi; Qin, Jing; Heng, Pheng Ann

    2016-12-07

    Automated polyp detection in colonoscopy videos has been demonstrated to be a promising way for colorectal cancer (CRC) prevention and diagnosis. Traditional manual screening is time-consuming, operator-dependent and error-prone; hence, automated detection approach is highly demanded in clinical practice. However, automated polyp detection is very challenging due to high intra-class variations in polyp size, color, shape and texture and low inter-class variations between polyps and hard mimics. In this paper, we propose a novel offline and online 3D deep learning integration framework by leveraging the 3D fully convolutional network (3D-FCN) to tackle this challenging problem. Compared with previous methods employing hand-crafted features or 2D-CNNs, the 3D-FCN is capable of learning more representative spatio-temporal features from colonoscopy videos, and hence has more powerful discrimination capability. More importantly, we propose a novel online learning scheme to deal with the problem of limited training data by harnessing the specific information of an input video in the learning process. We integrate offline and online learning to effectively reduce the number of false positives generated by the offline network and further improve the detection performance. Extensive experiments on the dataset of MICCAI 2015 Challenge on Polyp Detection demonstrated the better performance of our method when compared with other competitors.

  7. Integration of 3D photogrammetric outcrop models in the reservoir modelling workflow

    NASA Astrophysics Data System (ADS)

    Deschamps, Remy; Joseph, Philippe; Lerat, Olivier; Schmitz, Julien; Doligez, Brigitte; Jardin, Anne

    2014-05-01

    3D technologies are now widely used in geosciences to reconstruct outcrops in 3D. The technology used for the 3D reconstruction is usually based on Lidar, which provides very precise models. Such datasets offer the possibility to build well-constrained outcrop analogue models for reservoir study purposes. The photogrammetry is an alternate methodology which principles are based in determining the geometric properties of an object from photographic pictures taken from different angles. Outcrop data acquisition is easy, and this methodology allows constructing 3D outcrop models with many advantages such as: - light and fast acquisition, - moderate processing time (depending on the size of the area of interest), - integration of field data and 3D outcrops into the reservoir modelling tools. Whatever the method, the advantages of digital outcrop model are numerous as already highlighted by Hodgetts (2013), McCaffrey et al. (2005) and Pringle et al. (2006): collection of data from otherwise inaccessible areas, access to different angles of view, increase of the possible measurements, attributes analysis, fast rate of data collection, and of course training and communication. This paper proposes a workflow where 3D geocellular models are built by integrating all sources of information from outcrops (surface picking, sedimentological sections, structural and sedimentary dips…). The 3D geomodels that are reconstructed can be used at the reservoir scale, in order to compare the outcrop information with subsurface models: the detailed facies models of the outcrops are transferred into petrophysical and acoustic models, which are used to test different scenarios of seismic and fluid flow modelling. The detailed 3D models are also used to test new techniques of static reservoir modelling, based either on geostatistical approaches or on deterministic (process-based) simulation techniques. A modelling workflow has been designed to model reservoir geometries and properties from

  8. Transport analysis in toroidal helical plasmas using the integrated code: TASK3D

    NASA Astrophysics Data System (ADS)

    Wakasa, A.; Fukuyama, A.; Murakami, S.; Beidler, C. D.; Maassberg, H.; Yokoyama, M.; Sato, M.

    2009-11-01

    The integrated simulation code in helical plasmas, TASK3D, is being developed on the basis of an integrated modeling code for tokamak plasma, TASK. In helical systems, the neoclassical transport is one of the important issues in addition to the anomalous transport, because of strong temperature dependence of heat conductivity and an important role in determining the radial electric field. We have already constructed the neoclassical transport database in LHD, DGN/LHD. The mono-energetic diffusion coefficients are evaluated based on the Monte Carlo method by DCOM code and the mono-energetic diffusion coefficients database is constructed using a neural network technique. Also we apply GSRAKE code, which solves the ripple-averaged drift kinetic equation, to obtain transport coefficients in highly collisionless regime. We have newly incorporated the DGN/LHD module into TASK3D. We will present several results of transport simulation in typical LHD plasmas.

  9. SEU In An Advanced Bipolar Integrated Circuit

    NASA Technical Reports Server (NTRS)

    Zoutendyk, John A.; Secrest, Elaine C.; Berndt, Dale F.

    1989-01-01

    Report summarizes investigation of single-event upsets (SEU) in bipolar integrated-circuit set of flip-flops (memory cells). Device tested made by advanced digital bipolar silicon process of Honeywell, Inc. Circuit chip contained 4 cells. Construction enabled study of effect of size on SEU behavior. Each cell externally biased so effect of bias current on SEU behavior. Results of study provides important information for optimal design of devices fabricated using buried-layer bipolar process operating in heavy-ion SEU environments. Designers use information to provide required levels of suppression of SEU in specific applications via combinations of size and/or cell-current scaling.

  10. Integrated-Circuit Active Digital Filter

    NASA Technical Reports Server (NTRS)

    Nathan, R.

    1986-01-01

    Pipeline architecture with parallel multipliers and adders speeds calculation of weighted sums. Picture-element values and partial sums flow through delay-adder modules. After each cycle or time unit of calculation, each value in filter moves one position right. Digital integrated-circuit chips with pipeline architecture rapidly move 35 X 35 two-dimensional convolutions. Need for such circuits in image enhancement, data filtering, correlation, pattern extraction, and synthetic-aperture-radar image processing: all require repeated calculations of weighted sums of values from images or two-dimensional arrays of data.

  11. Integrated Navigation, Guidance, and Control of Missile Systems: 3-D Dynamic Model

    DTIC Science & Technology

    2013-02-01

    UNCLASSIFIED DSTO-TR-2805 Figure B.1: Aerodynamic variables for a missile and is the lift coefficient . LC  , represent respectively the...UNCLASSIFIED Integrated Navigation, Guidance, and Control of Missile Systems: 3-D Dynamic Model Farhan A. Faruqi Weapons...engagement kinematics is derived suitable for developing, implementing and testing modern missile guidance systems. The model developed here is

  12. Proposal for the development of 3D Vertically Integrated Pattern Recognition Associative Memory (VIPRAM)

    SciTech Connect

    Deptuch, Gregory; Hoff, Jim; Kwan, Simon; Lipton, Ron; Liu, Ted; Ramberg, Erik; Todri, Aida; Yarema, Ray; Demarteua, Marcel,; Drake, Gary; Weerts, Harry; /Argonne /Chicago U. /Padua U. /INFN, Padua

    2010-10-01

    Future particle physics experiments looking for rare processes will have no choice but to address the demanding challenges of fast pattern recognition in triggering as detector hit density becomes significantly higher due to the high luminosity required to produce the rare process. The authors propose to develop a 3D Vertically Integrated Pattern Recognition Associative Memory (VIPRAM) chip for HEP applications, to advance the state-of-the-art for pattern recognition and track reconstruction for fast triggering.

  13. 3D-printed concentrators for tracking-integrated CPV modules

    NASA Astrophysics Data System (ADS)

    Apostoleris, Harry; Leland, Julian; Chiesa, Matteo; Stefancich, Marco

    2016-09-01

    We demonstrate 3D-printed nonimaging concentrators and propose a tracking integration scheme to reduce the external tracking requirements of CPV modules. In the proposed system, internal sun tracking is achieved by rotation of the mini-concentrators inside the module by small motors. We discuss the design principles employed in the development of the system, experimentally evaluate the performance of the concentrator prototypes, and propose practical modifications that may be made to improve on-site performance of the devices.

  14. 3-D Extensions for Trustworthy Systems

    DTIC Science & Technology

    2011-01-01

    3- D Extensions for Trustworthy Systems (Invited Paper) Ted Huffmire∗, Timothy Levin∗, Cynthia Irvine∗, Ryan Kastner† and Timothy Sherwood...address these problems, we propose an approach to trustworthy system development based on 3- D integration, an emerging chip fabrication technique in...which two or more integrated circuit dies are fabricated individually and then combined into a single stack using vertical conductive posts. With 3- D

  15. InP-based three-dimensional photonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Tsou, Diana; Zaytsev, Sergey; Pauchard, Alexandre; Hummel, Steve; Lo, Yu-Hwa

    2001-10-01

    Fast-growing internet traffic volumes require high data communication bandwidth over longer distances than short wavelength (850 nm) multi-mode fiber systems can provide. Access network bottlenecks put pressure on short-range (SR) telecommunication systems. To effectively address these datacom and telecom market needs, low cost, high-speed laser modules at 1310 and 1550 nm wavelengths are required. The great success of GaAs 850 nm VCSELs for Gb/s Ethernet has motivated efforts to extend VCSEL technology to longer wavelengths in the 1310 and 1550 nm regimes. However, the technological challenges associated with available intrinsic materials for long wavelength VCSELs are tremendous. Even with recent advances in this area, it is believed that significant additional development is necessary before long wavelength VCSELs that meet commercial specifications will be widely available. In addition, the more stringent OC192 and OC768 specifications for single-mode fiber (SMF) datacom may require more than just a long wavelength laser diode, VCSEL or not, to address numerous cost and performance issues. We believe that photonic integrated circuits, which compactly integrate surface-emitting lasers with additional active and passive optical components with extended functionality, will provide the best solutions to today's problems. Photonic integrated circuits (PICs) have been investigated for more than a decade. However, they have produced limited commercial impact to date primarily because the highly complicated fabrication processes produce significant yield and device performance issues. In this presentation, we will discuss a new technology platform for fabricating InP-based photonic integrated circuits compatible with surface-emitting laser technology. Employing InP transparency at 1310 and 1550 nm wavelengths, we have created 3-D photonic integrated circuits (PICs) by utilizing light beams in both surface normal and in-plane directions within the InP-based structure

  16. Modeling a Printed Circuit Heat Exchanger with RELAP5-3D for the Next Generation Nuclear Plant

    SciTech Connect

    Not Available

    2010-12-01

    The main purpose of this report is to design a printed circuit heat exchanger (PCHE) for the Next Generation Nuclear Plant and carry out Loss of Coolant Accident (LOCA) simulation using RELAP5-3D. Helium was chosen as the coolant in the primary and secondary sides of the heat exchanger. The design of PCHE is critical for the LOCA simulations. For purposes of simplicity, a straight channel configuration was assumed. A parallel intermediate heat exchanger configuration was assumed for the RELAP5 model design. The RELAP5 modeling also required the semicircular channels in the heat exchanger to be mapped to rectangular channels. The initial RELAP5 run outputs steady state conditions which were then compared to the heat exchanger performance theory to ensure accurate design is being simulated. An exponential loss of pressure transient was simulated. This LOCA describes a loss of coolant pressure in the primary side over a 20 second time period. The results for the simulation indicate that heat is initially transferred from the primary loop to the secondary loop, but after the loss of pressure occurs, heat transfers from the secondary loop to the primary loop.

  17. Multispectral photon counting integral imaging system for color visualization of photon limited 3D scenes

    NASA Astrophysics Data System (ADS)

    Moon, Inkyu

    2014-06-01

    This paper provides an overview of a colorful photon-counting integral imaging system using Bayer elemental images for 3D visualization of photon limited scenes. The color image sensor with a format of Bayer color filter array, i.e., a red, a green, or a blue filter in a repeating pattern, captures elemental image set of a photon limited three-dimensional (3D) scene. It is assumed that the observed photon count in each channel (red, green or blue) follows Poisson statistics. The reconstruction of 3D scene with a format of Bayer is obtained by applying computational geometrical ray back propagation algorithm and parametric maximum likelihood estimator to the photon-limited Bayer elemental images. Finally, several standard demosaicing algorithms are applied in order to convert the 3D reconstruction with a Bayer format into a RGB per pixel format. Experimental results demonstrate that the gradient corrected linear interpolation technique achieves better performance in regard with acceptable PSNR and less computational complexity.

  18. 3D integral imaging display by smart pseudoscopic-to-orthoscopic conversion (SPOC).

    PubMed

    Navarro, H; Martínez-Cuenca, R; Saavedra, G; Martínez-Corral, M; Javidi, B

    2010-12-06

    Previously, we reported a digital technique for formation of real, non-distorted, orthoscopic integral images by direct pickup. However the technique was constrained to the case of symmetric image capture and display systems. Here, we report a more general algorithm which allows the pseudoscopic to orthoscopic transformation with full control over the display parameters so that one can generate a set of synthetic elemental images that suits the characteristics of the Integral-Imaging monitor and permits control over the depth and size of the reconstructed 3D scene.

  19. Applying analog integrated circuits for HERO protection

    NASA Technical Reports Server (NTRS)

    Willis, Kenneth E.; Blachowski, Thomas J.

    1994-01-01

    One of the most efficient methods for protecting electro-explosive devices (EED's) from HERO and ESD is to shield the EED in a conducting shell (Faraday cage). Electrical energy is transferred to the bridge by means of a magnetic coupling which passes through a portion of the conducting shell that is made from a magnetically permeable but electrically conducting material. This technique was perfected by ML Aviation, a U.K. company, in the early 80's, and was called a Radio Frequency Attenuation Connector (RFAC). It is now in wide use in the U.K. Previously, the disadvantage of RFAC over more conventional methods was its relatively high cost, largely driven by a thick film hybrid circuit used to switch the primary of the transformer. Recently, through a licensing agreement, this technology has been transferred to the U.S. and significant cost reductions and performance improvements have been achieved by the introduction of analog integrated circuits. An integrated circuit performs the following functions: (1) Chops the DC input to a signal suitable for driving the primary of the transformer; (2) Verifies the input voltage is above a threshold; (3) Verifies the input voltage is valid for a pre set time before enabling the device; (4) Provides thermal protection of the circuit; and (5) Provides an external input for independent logic level enabling of the power transfer mechanism. This paper describes the new RFAC product and its applications.

  20. Proof of Concept of Integrated Load Measurement in 3D Printed Structures

    PubMed Central

    Hinderdael, Michaël; Jardon, Zoé; Lison, Margot; De Baere, Dieter; Devesse, Wim; Strantza, Maria; Guillaume, Patrick

    2017-01-01

    Currently, research on structural health monitoring systems is focused on direct integration of the system into a component or structure. The latter results in a so-called smart structure. One example of a smart structure is a component with integrated strain sensing for continuous load monitoring. Additive manufacturing, or 3D printing, now also enables such integration of functions inside components. As a proof-of-concept, the Fused Deposition Modeling (FDM) technique was used to integrate a strain sensing element inside polymer (ABS) tensile test samples. The strain sensing element consisted of a closed capillary filled with a fluid and connected to an externally mounted pressure sensor. The volumetric deformation of the integrated capillary resulted in pressure changes in the fluid. The obtained pressure measurements during tensile testing are reported in this paper and compared to state-of-the-art extensometer measurements. The sensitivity of the 3D printed pressure-based strain sensor is primarily a function of the compressibility of the capillary fluid. Air- and watertightness are of critical importance for the proper functioning of the 3D printed pressure-based strain sensor. Therefore, the best after-treatment procedure was selected on basis of a comparative analysis. The obtained pressure measurements are linear with respect to the extensometer readings, and the uncertainty on the strain measurement of a capillary filled with water (incompressible fluid) is ±3.1 µstrain, which is approximately three times less sensitive than conventional strain gauges (±1 µstrain), but 32 times more sensitive than the same sensor based on air (compressible fluid) (±101 µstrain). PMID:28208779

  1. Proof of Concept of Integrated Load Measurement in 3D Printed Structures.

    PubMed

    Hinderdael, Michaël; Jardon, Zoé; Lison, Margot; De Baere, Dieter; Devesse, Wim; Strantza, Maria; Guillaume, Patrick

    2017-02-09

    Currently, research on structural health monitoring systems is focused on direct integration of the system into a component or structure. The latter results in a so-called smart structure. One example of a smart structure is a component with integrated strain sensing for continuous load monitoring. Additive manufacturing, or 3D printing, now also enables such integration of functions inside components. As a proof-of-concept, the Fused Deposition Modeling (FDM) technique was used to integrate a strain sensing element inside polymer (ABS) tensile test samples. The strain sensing element consisted of a closed capillary filled with a fluid and connected to an externally mounted pressure sensor. The volumetric deformation of the integrated capillary resulted in pressure changes in the fluid. The obtained pressure measurements during tensile testing are reported in this paper and compared to state-of-the-art extensometer measurements. The sensitivity of the 3D printed pressure-based strain sensor is primarily a function of the compressibility of the capillary fluid. Air- and watertightness are of critical importance for the proper functioning of the 3D printed pressure-based strain sensor. Therefore, the best after-treatment procedure was selected on basis of a comparative analysis. The obtained pressure measurements are linear with respect to the extensometer readings, and the uncertainty on the strain measurement of a capillary filled with water (incompressible fluid) is ±3.1 µstrain, which is approximately three times less sensitive than conventional strain gauges (±1 µstrain), but 32 times more sensitive than the same sensor based on air (compressible fluid) (±101 µstrain).

  2. Polymer optical fibers integrated directly into 3D orthogonal woven composites for sensing

    NASA Astrophysics Data System (ADS)

    Hamouda, Tamer; Seyam, Abdel-Fattah M.; Peters, Kara

    2015-02-01

    This study demonstrates that standard polymer optical fibers (POF) can be directly integrated into composites from 3D orthogonal woven preforms during the weaving process and then serve as in-situ sensors to detect damage due to bending or impact loads. Different composite samples with embedded POF were fabricated of 3D orthogonal woven composites with different parameters namely number of y-/x-layers and x-yarn density. The signal of POF was not affected significantly by the preform structure. During application of resin using VARTM technique, significant drop in backscattering level was observed due to pressure caused by vacuum on the embedded POF. Measurements of POF signal while in the final composites after resin cure indicated that the backscattering level almost returned to the original level of un-embedded POF. The POF responded to application of bending and impact loads to the composite with a reduction in the backscattering level. The backscattering level almost returned back to its original level after removing the bending load until damage was present in the composite. Similar behavior occurred due to impact events. As the POF itself is used as the sensor and can be integrated throughout the composite, large sections of future 3D woven composite structures could be monitored without the need for specialized sensors or complex instrumentation.

  3. Integrating Data Clustering and Visualization for the Analysis of 3D Gene Expression Data

    SciTech Connect

    Data Analysis and Visualization and the Department of Computer Science, University of California, Davis, One Shields Avenue, Davis CA 95616, USA,; nternational Research Training Group ``Visualization of Large and Unstructured Data Sets,'' University of Kaiserslautern, Germany; Computational Research Division, Lawrence Berkeley National Laboratory, One Cyclotron Road, Berkeley, CA 94720, USA; Genomics Division, Lawrence Berkeley National Laboratory, One Cyclotron Road, Berkeley CA 94720, USA; Life Sciences Division, Lawrence Berkeley National Laboratory, One Cyclotron Road, Berkeley CA 94720, USA,; Computer Science Division,University of California, Berkeley, CA, USA,; Computer Science Department, University of California, Irvine, CA, USA,; All authors are with the Berkeley Drosophila Transcription Network Project, Lawrence Berkeley National Laboratory,; Rubel, Oliver; Weber, Gunther H.; Huang, Min-Yu; Bethel, E. Wes; Biggin, Mark D.; Fowlkes, Charless C.; Hendriks, Cris L. Luengo; Keranen, Soile V. E.; Eisen, Michael B.; Knowles, David W.; Malik, Jitendra; Hagen, Hans; Hamann, Bernd

    2008-05-12

    The recent development of methods for extracting precise measurements of spatial gene expression patterns from three-dimensional (3D) image data opens the way for new analyses of the complex gene regulatory networks controlling animal development. We present an integrated visualization and analysis framework that supports user-guided data clustering to aid exploration of these new complex datasets. The interplay of data visualization and clustering-based data classification leads to improved visualization and enables a more detailed analysis than previously possible. We discuss (i) integration of data clustering and visualization into one framework; (ii) application of data clustering to 3D gene expression data; (iii) evaluation of the number of clusters k in the context of 3D gene expression clustering; and (iv) improvement of overall analysis quality via dedicated post-processing of clustering results based on visualization. We discuss the use of this framework to objectively define spatial pattern boundaries and temporal profiles of genes and to analyze how mRNA patterns are controlled by their regulatory transcription factors.

  4. Autostereoscopic 3D Display with Long Visualization Depth Using Referential Viewing Area-Based Integral Photography.

    PubMed

    Hongen Liao; Dohi, Takeyoshi; Nomura, Keisuke

    2011-11-01

    We developed an autostereoscopic display for distant viewing of 3D computer graphics (CG) images without using special viewing glasses or tracking devices. The images are created by employing referential viewing area-based CG image generation and pixel distribution algorithm for integral photography (IP) and integral videography (IV) imaging. CG image rendering is used to generate IP/IV elemental images. The images can be viewed from each viewpoint within a referential viewing area and the elemental images are reconstructed from rendered CG images by pixel redistribution and compensation method. The elemental images are projected onto a screen that is placed at the same referential viewing distance from the lens array as in the image rendering. Photographic film is used to record the elemental images through each lens. The method enables 3D images with a long visualization depth to be viewed from relatively long distances without any apparent influence from deviated or distorted lenses in the array. We succeeded in creating an actual autostereoscopic images with an image depth of several meters in front of and behind the display that appear to have 3D even when viewed from a distance.

  5. Integration of a 3D perspective view in the navigation display: featuring pilot's mental model

    NASA Astrophysics Data System (ADS)

    Ebrecht, L.; Schmerwitz, S.

    2015-05-01

    Synthetic vision systems (SVS) appear as spreading technology in the avionic domain. Several studies prove enhanced situational awareness when using synthetic vision. Since the introduction of synthetic vision a steady change and evolution started concerning the primary flight display (PFD) and the navigation display (ND). The main improvements of the ND comprise the representation of colored ground proximity warning systems (EGPWS), weather radar, and TCAS information. Synthetic vision seems to offer high potential to further enhance cockpit display systems. Especially, concerning the current trend having a 3D perspective view in a SVS-PFD while leaving the navigational content as well as methods of interaction unchanged the question arouses if and how the gap between both displays might evolve to a serious problem. This issue becomes important in relation to the transition and combination of strategic and tactical flight guidance. Hence, pros and cons of 2D and 3D views generally as well as the gap between the egocentric perspective 3D view of the PFD and the exocentric 2D top and side view of the ND will be discussed. Further a concept for the integration of a 3D perspective view, i.e., bird's eye view, in synthetic vision ND will be presented. The combination of 2D and 3D views in the ND enables a better correlation of the ND and the PFD. Additionally, this supports the building of pilot's mental model. The authors believe it will improve the situational and spatial awareness. It might prove to further raise the safety margin when operating in mountainous areas.

  6. Integrated Circuit Radar And Radiometric Sensors

    NASA Astrophysics Data System (ADS)

    Seashore, C. R.

    1985-10-01

    The use of integrated circuit techniques for millimeter wave transducers has now moved from a research curiosity to an engineering discipline. Microstrip is the preferred transmission media to demonstrate a wide variety of RF component functions. For applications involving precision weapon systems, a soft substrate is preferred since it provides lower cost, improved survivability, and functional versatility when compared with the traditional hard candidates such as quartz. The MESFET is rapidly emerging as a key building block for monolithic supercomponents up to a frequency of approximately 40 GHz. Both planar and conformal antennas are being developed again based on a soft substrate with photolithographic processing. The marriage of planar integrated circuit transceivers with thin, planar antennas is providing a new generation of low cost, producible and miniature millimeter wave transducers for demanding systems requirements.

  7. Development of beam lead RF integrated circuits

    NASA Technical Reports Server (NTRS)

    Kline, A. J.; Kermode, A. W.

    1975-01-01

    This paper describes the design and development of a set of multifunction VHF/UHF integrated circuits aimed at providing a major improvement in spacecraft radio reliability through low stress operation and the processing of these circuits in beam-lead form. The methods evolved for the high frequency characterization of the devices are discussed together with the design of suitable test fixtures. Typical test results and the distribution of test parameters are presented. A unique carrier for beam-lead devices is described, and the need for such a device is discussed. The application of the carrier to device screening, burn-in and drift measurements is discussed together with the incentives for providing these capabilities. An overview of the integration of the devices into the spacecraft radio is given and candidate assembly processes are discussed. The technology impact of this approach upon future spacecraft radio systems is qualitatively examined.

  8. Uniform integration of gold nanoparticles in PDMS microfluidics with 3D micromixing

    NASA Astrophysics Data System (ADS)

    SadAbadi, H.; Packirisamy, M.; Wuthrich, R.

    2015-09-01

    The integration of gold nanoparticles (AuNPs) on the surface of polydimethylsiloxane (PDMS) microfluidics for biosensing applications is a challenging task. In this paper we address this issue by integration of pre-synthesized AuNPs (in a microreactor) into a microfluidic system. This method explored the affinity of AuNPs toward the PDMS surface so that the pre-synthesized particles will be adsorbed onto the channel walls. AuNPs were synthesized inside a microreactor before integration. In order to improve the size uniformity of the synthesized AuNPs and also to provide full mixing of reactants, a 3D-micromixer was designed, fabricated and then integrated with the microreactor in a single platform. SEM and UV/Vis spectroscopy were used to characterize the AuNPs on the PDMS surface.

  9. Viewing Integrated-Circuit Interconnections By SEM

    NASA Technical Reports Server (NTRS)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  10. 3D Porosity Estimation of the Nankai Trough Sediments from Core-log-seismic Integration

    NASA Astrophysics Data System (ADS)

    Park, J. O.

    2015-12-01

    The Nankai Trough off southwest Japan is one of the best subduction-zone to study megathrust earthquake fault. Historic, great megathrust earthquakes with a recurrence interval of 100-200 yr have generated strong motion and large tsunamis along the Nankai Trough subduction zone. At the Nankai Trough margin, the Philippine Sea Plate (PSP) is being subducted beneath the Eurasian Plate to the northwest at a convergence rate ~4 cm/yr. The Shikoku Basin, the northern part of the PSP, is estimated to have opened between 25 and 15 Ma by backarc spreading of the Izu-Bonin arc. The >100-km-wide Nankai accretionary wedge, which has developed landward of the trench since the Miocene, mainly consists of offscraped and underplated materials from the trough-fill turbidites and the Shikoku Basin hemipelagic sediments. Particularly, physical properties of the incoming hemipelagic sediments may be critical for seismogenic behavior of the megathrust fault. We have carried out core-log-seismic integration (CLSI) to estimate 3D acoustic impedance and porosity for the incoming sediments in the Nankai Trough. For the CLSI, we used 3D seismic reflection data, P-wave velocity and density data obtained during IODP (Integrated Ocean Drilling Program) Expeditions 322 and 333. We computed acoustic impedance depth profiles for the IODP drilling sites from P-wave velocity and density data. We constructed seismic convolution models with the acoustic impedance profiles and a source wavelet which is extracted from the seismic data, adjusting the seismic models to observed seismic traces with inversion method. As a result, we obtained 3D acoustic impedance volume and then converted it to 3D porosity volume. In general, the 3D porosities show decrease with depth. We found a porosity anomaly zone with alteration of high and low porosities seaward of the trough axis. In this talk, we will show detailed 3D porosity of the incoming sediments, and present implications of the porosity anomaly zone for the

  11. 3D modelling and construction of a standard cross section of the Euganean Hydrothermal circuit - NE Italy

    NASA Astrophysics Data System (ADS)

    Pola, Marco; Zampieri, Dario; Fabbri, Paolo

    2010-05-01

    software uses 2D model sections, therefore the standard cross section will be useful as starting point for the hydrothermal model and to test its parameters sensitivity. The analysis of some available unpublished seismic lines, located few kilometres to the southeast of the EGF, has permitted to construct a 3D model of the subsurface, performed by gOcad. In the north-western part, including the EGF, the main constraint is given by the stratigraphies of deep wells penetrating the bedrock for few kilometres. Therefore, this work confirms the idea that the outflow of the thermal waters, in the area near the Euganei Hills, is caused by the local extensional regime related to the strike-slip kinematics of the Schio - Vicenza fault system.

  12. Progress in radiation immune thermionic integrated circuits

    SciTech Connect

    Lynn, D.K.; McCormick, J.B.

    1985-08-01

    This report describes the results of a program directed at evaluating the thermionic integrated circuit (TIC) technology for applicability to military systems. Previous programs under the sponsorship of the Department of Energy, Office of Basic Energy Sciences, have developed an initial TIC technology base and demonstrated operation in high-temperature and high-radiation environments. The program described in this report has two parts: (1) a technical portion in which experiments and analyses were conducted to refine perceptions of near-term as well as ultimate performance levels of the TIC technology and (2) an applications portion in which the technical conclusions were to be evaluated against potential military applications. This report draws several conclusions that strongly suggest that (1) useful radiation-hard/high-temperature operable integrated circuits can be developed using the TIC technology; (2) because of their ability to survive and operate in hostile environments, a variety of potential military applications have been projected for this technology; and (3) based on the above two conclusions, an aggressive TIC development program should be initiated to provide the designers of future systems with integrated circuits and devices with the unique features of the TICs.

  13. Distributed Amplifier Monolithic Microwave Integrated Circuit (MMIC) Design

    DTIC Science & Technology

    2012-10-01

    Distributed Amplifier Monolithic Microwave Integrated Circuit (MMIC) Design by John E. Penn ARL-TR-6237 October 2012...Distributed Amplifier Monolithic Microwave Integrated Circuit (MMIC) Design John E. Penn Sensors and Electron Devices Directorate, ARL...TITLE AND SUBTITLE Distributed Amplifier Monolithic Microwave Integrated Circuit (MMIC) Design 5a. CONTRACT NUMBER 5b. GRANT NUMBER 5c

  14. Power system with an integrated lubrication circuit

    SciTech Connect

    Hoff, Brian D.; Akasam, Sivaprasad; Algrain, Marcelo C.; Johnson, Kris W.; Lane, William H.

    2009-11-10

    A power system includes an engine having a first lubrication circuit and at least one auxiliary power unit having a second lubrication circuit. The first lubrication circuit is in fluid communication with the second lubrication circuit.

  15. Silicon photonic devices for optoelectronic integrated circuits

    NASA Astrophysics Data System (ADS)

    Tien, Ming-Chun

    Electronic and photonic integrated circuits use optics to overcome bottlenecks of microelectronics in bandwidth and power consumption. Silicon photonic devices such as optical modulators, filters, switches, and photodetectors have being developed for integration with electronics based on existing complementary metal-oxide-semiconductor (CMOS) circuits. An important building block of photonic devices is the optical microresonator. On-chip whispering-gallery-mode optical resonators such as microdisks, microtoroids, and microrings have very small footprint, and thus are suitable for large scale integration. Micro-electro-mechanical system (MEMS) technology enables dynamic control and tuning of optical functions. In this dissertation, microring resonators with tunable power coupling ratio using MEMS electrostatic actuators are demonstrated. The fabrication is compatible with CMOS. By changing the physical gap spacing between the waveguide coupler and the microring, the quality factor of the microring can be tuned from 16,300 to 88,400. Moreover, we have demonstrated optical switches and tunable optical add-drop filters with an optical bandwidth of 10 GHz and an extinction ratio of 20 dB. Potentially, electronic control circuits can also be integrated. To realize photonic integrated circuits on silicon, electrically-pumped silicon lasers are desirable. However, because of the indirect bandgap, silicon is a poor material for light emission compared with direct-bandgap III-V compound semiconductors. Heterogeneous integration of III-V semiconductor lasers on silicon is an alternative to provide on-chip light sources. Using a room-temperature, post-CMOS optofluidic assembly technique, we have experimentally demonstrated an InGaAsP microdisk laser integrated with silicon waveguides. Pre-fabricated InGaAsP microdisk lasers were fluidically assembled and aligned to the silicon waveguides on silicon-on-insulator (SOI) with lithographic alignment accuracy. The assembled

  16. 3D modeling of a dolerite intrusion from the photogrammetric and geophysical data integration.

    NASA Astrophysics Data System (ADS)

    Duarte, João; Machadinho, Ana; Figueiredo, Fernando; Mira, Maria

    2015-04-01

    The aims of this study is create a methodology based on the integration of data obtained from various available technologies, which allow a credible and complete evaluation of rock masses. In this particular case of a dolerite intrusion, which deployed an exploration of aggregates and belongs to the Jobasaltos - Extracção e Britagem. S.A.. Dolerite intrusion is situated in the volcanic complex of Serra de Todo-o-Mundo, Casais Gaiola, intruded in Jurassic sandstones. The integration of the surface and subsurface mapping, obtained by technology UAVs (Drone) and geophysical surveys (Electromagnetic Method - TEM 48 FAST), allows the construction of 2D and 3D models of the study local. The combination of the 3D point clouds produced from two distinct processes, modeling of photogrammetric and geophysical data, will be the basis for the construction of a single model of set. The rock masses in an integral perspective being visible their development above the surface and subsurface. The presentation of 2D and 3D models will give a perspective of structures, fracturation, lithology and their spatial correlations contributing to a better local knowledge, as well as its potential for the intended purpose. From these local models it will be possible to characterize and quantify the geological structures. These models will have its importance as a tool to assist in the analysis and drafting of regional models. The qualitative improvement in geological/structural modeling, seeks to reduce the value of characterization/cost ratio, in phase of prospecting, improving the investment/benefit ratio. This methodology helps to assess more accurately the economic viability of the projects.

  17. Intracranial Catheter for Integrated 3D Ultrasound Imaging & Hyperthermia: Feasibility Study

    NASA Astrophysics Data System (ADS)

    Herickhoff, Carl D.; Light, Edward D.; Bing, Kristin Frinkley; Mukundan, Srinivasan; Grant, Gerald A.; Wolf, Patrick D.; Dixon-Tulloch, Ellen; Shih, Timothy; Hsu, Stephen J.; Smith, Stephen W.

    2009-04-01

    In this study, we investigated the feasibility of an intracranial catheter transducer capable of real-time 3D (RT3D) imaging and ultrasound hyperthermia, for application in the visualization and treatment of tumors in the brain. We designed and constructed a 12 Fr, integrated matrix and linear array catheter transducer prototype for combined RT3D imaging and heating capability. This dual-mode catheter incorporated 153 matrix array elements and 11 linear array elements, on a 0.2 mm pitch, with a total aperture size of 8.4 mm×2.3 mm. This array achieved a 3.5° C in vitro temperature rise at a 2 cm focal distance in tissue-mimicking material. The dual-mode catheter prototype was compared with a Siemens 10 Fr AcuNav™ catheter as a gold standard in experiments assessing image quality and therapeutic potential, and both probes were used in a canine brain model to image anatomical structures and color Doppler blood flow and to attempt in vivo heating.

  18. Application of CART3D to Complex Propulsion-Airframe Integration with Vehicle Sketch Pad

    NASA Technical Reports Server (NTRS)

    Hahn, Andrew S.

    2012-01-01

    Vehicle Sketch Pad (VSP) is an easy-to-use modeler used to generate aircraft geometries for use in conceptual design and analysis. It has been used in the past to generate metageometries for aerodynamic analyses ranging from handbook methods to Navier-Stokes computational fluid dynamics (CFD). As desirable as it is to bring high order analyses, such as CFD, into the conceptual design process, this has been difficult and time consuming in practice due to the manual nature of both surface and volume grid generation. Over the last couple of years, VSP has had a major upgrade of its surface triangulation and export capability. This has enhanced its ability to work with Cart3D, an inviscid, three dimensional fluid flow toolset. The combination of VSP and Cart3D allows performing inviscid CFD on complex geometries with relatively high productivity. This paper will illustrate the use of VSP with Cart3D through an example case of a complex propulsion-airframe integration (PAI) of an over-wing nacelle (OWN) airliner configuration.

  19. Integration of 3D structure from disparity into biological motion perception independent of depth awareness.

    PubMed

    Wang, Ying; Jiang, Yi

    2014-01-01

    Images projected onto the retinas of our two eyes come from slightly different directions in the real world, constituting binocular disparity that serves as an important source for depth perception - the ability to see the world in three dimensions. It remains unclear whether the integration of disparity cues into visual perception depends on the conscious representation of stereoscopic depth. Here we report evidence that, even without inducing discernible perceptual representations, the disparity-defined depth information could still modulate the visual processing of 3D objects in depth-irrelevant aspects. Specifically, observers who could not discriminate disparity-defined in-depth facing orientations of biological motions (i.e., approaching vs. receding) due to an excessive perceptual bias nevertheless exhibited a robust perceptual asymmetry in response to the indistinguishable facing orientations, similar to those who could consciously discriminate such 3D information. These results clearly demonstrate that the visual processing of biological motion engages the disparity cues independent of observers' depth awareness. The extraction and utilization of binocular depth signals thus can be dissociable from the conscious representation of 3D structure in high-level visual perception.

  20. A 3D integral imaging optical see-through head-mounted display.

    PubMed

    Hua, Hong; Javidi, Bahram

    2014-06-02

    An optical see-through head-mounted display (OST-HMD), which enables optical superposition of digital information onto the direct view of the physical world and maintains see-through vision to the real world, is a vital component in an augmented reality (AR) system. A key limitation of the state-of-the-art OST-HMD technology is the well-known accommodation-convergence mismatch problem caused by the fact that the image source in most of the existing AR displays is a 2D flat surface located at a fixed distance from the eye. In this paper, we present an innovative approach to OST-HMD designs by combining the recent advancement of freeform optical technology and microscopic integral imaging (micro-InI) method. A micro-InI unit creates a 3D image source for HMD viewing optics, instead of a typical 2D display surface, by reconstructing a miniature 3D scene from a large number of perspective images of the scene. By taking advantage of the emerging freeform optical technology, our approach will result in compact, lightweight, goggle-style AR display that is potentially less vulnerable to the accommodation-convergence discrepancy problem and visual fatigue. A proof-of-concept prototype system is demonstrated, which offers a goggle-like compact form factor, non-obstructive see-through field of view, and true 3D virtual display.

  1. Integration of regional to outcrop digital data: 3D visualisation of multi-scale geological models

    NASA Astrophysics Data System (ADS)

    Jones, R. R.; McCaffrey, K. J. W.; Clegg, P.; Wilson, R. W.; Holliman, N. S.; Holdsworth, R. E.; Imber, J.; Waggott, S.

    2009-01-01

    Multi-scale geological models contain three-dimensional, spatially referenced data, typically spanning at least six orders of magnitude from outcrop to regional scale. A large number of different geological and geophysical data sources can be combined into a single model. Established 3D visualisation methods that are widely used in hydrocarbon exploration and production for sub-surface data have been adapted for onshore surface geology through a combination of methods for digital data acquisition, 3D visualisation, and geospatial analysis. The integration of georeferenced data across a wider than normal range in scale helps to address several of the existing limitations that are inherent in traditional methods of map production and publishing. The primary advantage of a multi-scale approach is that spatial precision and dimensionality (which are generally degraded when data are displayed in 2D at a single scale) can be preserved at all scales. Real-time, immersive, interactive software, based on a "3D geospatial" graphical user interface (GUI), allows complex geological architectures to be depicted, and is more inherently intuitive than software based on a standard "desktop" GUI metaphor. The continuing convergence of different kinds of geo-modelling, GIS, and visualisation software, as well as industry acceptance of standardised middleware, has helped to make multi-scale geological models a practical reality. This is illustrated with two case studies from NE England and NW Scotland.

  2. Fully analytical integration over the 3D volume bounded by the β sphere in topological atoms.

    PubMed

    Popelier, Paul L A

    2011-11-17

    Atomic properties of a topological atom are obtained by 3D integration over the volume of its atomic basin. Algorithms that compute atomic properties typically integrate over two subspaces: the volume bounded by the so-called β sphere, which is centered at the nucleus and completely contained within the atomic basin, and the volume of the remaining part of the basin. Here we show how the usual quadrature over the β sphere volume can be replaced by a fully analytical 3D integration leading to the atomic charge (monopole moment) for s, p, and d functions. Spherical tensor multipole moments have also been implemented and tested up to hexadecupole for s functions only, and up to quadrupole for s and p functions. The new algorithm is illustrated by operating on capped glycine (HF/6-31G, 35 molecular orbitals (MOs), 322 Gaussian primitives, 19 nuclei), the protein crambin (HF/3-21G, 1260 MOs, 5922 primitives and 642 nuclei), and tin (Z = 50) in Sn(2)(CH(3))(2) (B3LYP/cc-pVTZ and LANL2DZ, 59 MOs, 1352 primitives).

  3. Design, modeling and testing of integrated ring extractor for high resolution electrohydrodynamic (EHD) 3D printing

    NASA Astrophysics Data System (ADS)

    Han, Yiwei; Dong, Jingyan

    2017-03-01

    This paper presents an integrated ring extractor design in electrohydrodynamic (EHD) printing, which can overcome the standoff height limitation in the EHD printing process, and improve printing capability for 3D structures. Standoff height in the EHD printing will affect printing processes and limit the height of the printed structure when the ground electrode is placed under the substrate. In this work, we designed and integrated a ring electrode with the printing nozzle to achieve a self-working printer head, which can start and maintain the printing process without the involvement of the substrate. We applied a FEA method to model the electric field potential distribution and strength to direct the ring extractor design, which provides a similar printing capability with the system using substrate as the ground electrode. We verified the ring electrode design by experiments, and those results from the experiments demonstrated a good match with results from the FEA simulation. We have characterized the printing processes using the integrated ring extractor, and successfully applied this newly designed ring extractor to print polycaprolactone (PCL) 3D structures.

  4. Efficient data exchange: Integrating a vector GIS with an object-oriented, 3-D visualization system

    SciTech Connect

    Kuiper, J.; Ayers, A.; Johnson, R.; Tolbert-Smith, M.

    1996-03-01

    A common problem encountered in Geographic Information System (GIS) modeling is the exchange of data between different software packages to best utilize the unique features of each package. This paper describes a project to integrate two systems through efficient data exchange. The first is a widely used GIS based on a relational data model. This system has a broad set of data input, processing, and output capabilities, but lacks three-dimensional (3-D) visualization and certain modeling functions. The second system is a specialized object-oriented package designed for 3-D visualization and modeling. Although this second system is useful for subsurface modeling and hazardous waste site characterization, it does not provide many of the, capabilities of a complete GIS. The system-integration project resulted in an easy-to-use program to transfer information between the systems, making many of the more complex conversion issues transparent to the user. The strengths of both systems are accessible, allowing the scientist more time to focus on analysis. This paper details the capabilities of the two systems, explains the technical issues associated with data exchange and how they were solved, and outlines an example analysis project that used the integrated systems.

  5. New Dimensions in Microarchitecture Harnessing 3D Integration Technologies (BRIEFING CHARTS)

    DTIC Science & Technology

    2007-03-06

    New Dimensions in Microarchitecture Harnessing 3D Integration Technologies Kerry Bernstein IBM T.J. Watson Research Center Yorktown Heights, NY...e m o r y H i e r a r c h y L1 Size limited by Cycle time Components of Processor Performance From ISCA ’06 Keynote address by Phil Emma , IBM Delay...From ISCA ’06 Keynote address by Phil Emma , IBM 6 March, 2007 New Dimensions in Microarchitecture 8 What Is Bandwidth Used For? Miss Penalty

  6. 3D printed LED based on-capillary detector housing with integrated slit.

    PubMed

    Cecil, Farhan; Zhang, Min; Guijt, Rosanne M; Henderson, Alan; Nesterenko, Pavel N; Paull, Brett; Breadmore, Michael C; Macka, Mirek

    2017-05-01

    A 3D printed photometric detector body with integrated slit was fabricated to position a LED and photodiode either side of capillary tubing using a fused deposition modelling (FDM) printer. To make this approach suitable for capillaries down to 50 μm i.d. the dimension of the in-built slit is the critical element of the printed housing. The spatial orientation of the model for printing was found to significantly impact on the resolution of the structures and voids that can be printed. By designing a housing with a slit positioned in the XY plane in parallel with the print direction, the narrowest void (slit) that could be printed was 70 μm. The potential use of the 3D printed slit for photometric detection was characterised using tubing and capillary from 500 down to 50 μm i.d, demonstrating a linear response from 632 to 40 mAU. The effective pathlength and stray light varied from 383 to 22 μm and 3.8% - 50% for 500- 50 μm i.d tubing and capillary. The use of a V-shaped alignment feature allowed for easy and reliable positioning of the tubing inside the detector, as demonstrated by a RSD of 1.9% (n = 10) in peak height when repositioning the tubing between measurements using flow injection analysis (FIA). The performance of the 3D printed housing and 70 μm slit was benchmarked against a commercially available interface using the CE separation of Zn(2+) and Cu(2+) complexes with PAR. The limit of detection with the 3D printed slit was 6.8 and 4.5 μM and is 2.8 and 1.6 μM with the commercial interface.

  7. DYNA3D, INGRID, and TAURUS: an integrated, interactive software system for crashworthiness engineering

    SciTech Connect

    Benson, D.J.; Hallquist, J.O.; Stillman, D.W.

    1985-04-01

    Crashworthiness engineering has always been a high priority at Lawrence Livermore National Laboratory because of its role in the safe transport of radioactive material for the nuclear power industry and military. As a result, the authors have developed an integrated, interactive set of finite element programs for crashworthiness analysis. The heart of the system is DYNA3D, an explicit, fully vectorized, large deformation structural dynamics code. DYNA3D has the following four capabilities that are critical for the efficient and accurate analysis of crashes: (1) fully nonlinear solid, shell, and beam elements for representing a structure, (2) a broad range of constitutive models for representing the materials, (3) sophisticated contact algorithms for the impact interactions, and (4) a rigid body capability to represent the bodies away from the impact zones at a greatly reduced cost without sacrificing any accuracy in the momentum calculations. To generate the large and complex data files for DYNA3D, INGRID, a general purpose mesh generator, is used. It runs on everything from IBM PCs to CRAYS, and can generate 1000 nodes/minute on a PC. With its efficient hidden line algorithms and many options for specifying geometry, INGRID also doubles as a geometric modeller. TAURUS, an interactive post processor, is used to display DYNA3D output. In addition to the standard monochrome hidden line display, time history plotting, and contouring, TAURUS generates interactive color displays on 8 color video screens by plotting color bands superimposed on the mesh which indicate the value of the state variables. For higher quality color output, graphic output files may be sent to the DICOMED film recorders. We have found that color is every bit as important as hidden line removal in aiding the analyst in understanding his results. In this paper the basic methodologies of the programs are presented along with several crashworthiness calculations.

  8. Vacuum die attach for integrated circuits

    DOEpatents

    Schmitt, E.H.; Tuckerman, D.B.

    1991-09-10

    A thin film eutectic bond for attaching an integrated circuit die to a circuit substrate is formed by coating at least one bonding surface on the die and substrate with an alloying metal, assembling the die and substrate under compression loading, and heating the assembly to an alloying temperature in a vacuum. A very thin bond, 10 microns or less, which is substantially void free, is produced. These bonds have high reliability, good heat and electrical conduction, and high temperature tolerance. The bonds are formed in a vacuum chamber, using a positioning and loading fixture to compression load the die, and an IR lamp or other heat source. For bonding a silicon die to a silicon substrate, a gold silicon alloy bond is used. Multiple dies can be bonded simultaneously. No scrubbing is required. 1 figure.

  9. Vacuum die attach for integrated circuits

    DOEpatents

    Schmitt, Edward H.; Tuckerman, David B.

    1991-01-01

    A thin film eutectic bond for attaching an integrated circuit die to a circuit substrate is formed by coating at least one bonding surface on the die and substrate with an alloying metal, assembling the die and substrate under compression loading, and heating the assembly to an alloying temperature in a vacuum. A very thin bond, 10 microns or less, which is substantially void free, is produced. These bonds have high reliability, good heat and electrical conduction, and high temperature tolerance. The bonds are formed in a vacuum chamber, using a positioning and loading fixture to compression load the die, and an IR lamp or other heat source. For bonding a silicon die to a silicon substrate, a gold silicon alloy bond is used. Multiple dies can be bonded simultaneously. No scrubbing is required.

  10. Sequential circuit design for radiation hardened multiple voltage integrated circuits

    SciTech Connect

    Clark, Lawrence T.; McIver, III, John K.

    2009-11-24

    The present invention includes a radiation hardened sequential circuit, such as a bistable circuit, flip-flop or other suitable design that presents substantial immunity to ionizing radiation while simultaneously maintaining a low operating voltage. In one embodiment, the circuit includes a plurality of logic elements that operate on relatively low voltage, and a master and slave latches each having storage elements that operate on a relatively high voltage.

  11. An integrator circuit in cerebellar cortex.

    PubMed

    Maex, Reinoud; Steuber, Volker

    2013-09-01

    The brain builds dynamic models of the body and the outside world to predict the consequences of actions and stimuli. A well-known example is the oculomotor integrator, which anticipates the position-dependent elasticity forces acting on the eye ball by mathematically integrating over time oculomotor velocity commands. Many models of neural integration have been proposed, based on feedback excitation, lateral inhibition or intrinsic neuronal nonlinearities. We report here that a computational model of the cerebellar cortex, a structure thought to implement dynamic models, reveals a hitherto unrecognized integrator circuit. In this model, comprising Purkinje cells, molecular layer interneurons and parallel fibres, Purkinje cells were able to generate responses lasting more than 10 s, to which both neuronal and network mechanisms contributed. Activation of the somatic fast sodium current by subthreshold voltage fluctuations was able to maintain pulse-evoked graded persistent activity, whereas lateral inhibition among Purkinje cells via recurrent axon collaterals further prolonged the responses to step and sine wave stimulation. The responses of Purkinje cells decayed with a time-constant whose value depended on their baseline spike rate, with integration vanishing at low (< 1 per s) and high rates (> 30 per s). The model predicts that the apparently fast circuit of the cerebellar cortex may control the timing of slow processes without having to rely on sensory feedback. Thus, the cerebellar cortex may contain an adaptive temporal integrator, with the sensitivity of integration to the baseline spike rate offering a potential mechanism of plasticity of the response time-constant.

  12. The OpenEarth Framework (OEF) for the 3D Visualization of Integrated Earth Science Data

    NASA Astrophysics Data System (ADS)

    Nadeau, David; Moreland, John; Baru, Chaitan; Crosby, Chris

    2010-05-01

    Data integration is increasingly important as we strive to combine data from disparate sources and assemble better models of the complex processes operating at the Earth's surface and within its interior. These data are often large, multi-dimensional, and subject to differing conventions for data structures, file formats, coordinate spaces, and units of measure. When visualized, these data require differing, and sometimes conflicting, conventions for visual representations, dimensionality, symbology, and interaction. All of this makes the visualization of integrated Earth science data particularly difficult. The OpenEarth Framework (OEF) is an open-source data integration and visualization suite of applications and libraries being developed by the GEON project at the University of California, San Diego, USA. Funded by the NSF, the project is leveraging virtual globe technology from NASA's WorldWind to create interactive 3D visualization tools that combine and layer data from a wide variety of sources to create a holistic view of features at, above, and beneath the Earth's surface. The OEF architecture is open, cross-platform, modular, and based upon Java. The OEF's modular approach to software architecture yields an array of mix-and-match software components for assembling custom applications. Available modules support file format handling, web service communications, data management, user interaction, and 3D visualization. File parsers handle a variety of formal and de facto standard file formats used in the field. Each one imports data into a general-purpose common data model supporting multidimensional regular and irregular grids, topography, feature geometry, and more. Data within these data models may be manipulated, combined, reprojected, and visualized. The OEF's visualization features support a variety of conventional and new visualization techniques for looking at topography, tomography, point clouds, imagery, maps, and feature geometry. 3D data such as

  13. On Integral Invariants for Effective 3-D Motion Trajectory Matching and Recognition.

    PubMed

    Shao, Zhanpeng; Li, Youfu

    2016-02-01

    Motion trajectories tracked from the motions of human, robots, and moving objects can provide an important clue for motion analysis, classification, and recognition. This paper defines some new integral invariants for a 3-D motion trajectory. Based on two typical kernel functions, we design two integral invariants, the distance and area integral invariants. The area integral invariants are estimated based on the blurred segment of noisy discrete curve to avoid the computation of high-order derivatives. Such integral invariants for a motion trajectory enjoy some desirable properties, such as computational locality, uniqueness of representation, and noise insensitivity. Moreover, our formulation allows the analysis of motion trajectories at a range of scales by varying the scale of kernel function. The features of motion trajectories can thus be perceived at multiscale levels in a coarse-to-fine manner. Finally, we define a distance function to measure the trajectory similarity to find similar trajectories. Through the experiments, we examine the robustness and effectiveness of the proposed integral invariants and find that they can capture the motion cues in trajectory matching and sign recognition satisfactorily.

  14. Integrated Modeling of Time Evolving 3D Kinetic MHD Equilibria and NTV Torque

    NASA Astrophysics Data System (ADS)

    Logan, N. C.; Park, J.-K.; Grierson, B. A.; Haskey, S. R.; Nazikian, R.; Cui, L.; Smith, S. P.; Meneghini, O.

    2016-10-01

    New analysis tools and integrated modeling of plasma dynamics developed in the OMFIT framework are used to study kinetic MHD equilibria evolution on the transport time scale. The experimentally observed profile dynamics following the application of 3D error fields are described using a new OMFITprofiles workflow that directly addresses the need for rapid and comprehensive analysis of dynamic equilibria for next-step theory validation. The workflow treats all diagnostic data as fundamentally time dependent, provides physics-based manipulations such as ELM phase data selection, and is consistent across multiple machines - including DIII-D and NSTX-U. The seamless integration of tokamak data and simulation is demonstrated by using the self-consistent kinetic EFIT equilibria and profiles as input into 2D particle, momentum and energy transport calculations using TRANSP as well as 3D kinetic MHD equilibrium stability and neoclassical transport modeling using General Perturbed Equilibrium Code (GPEC). The result is a smooth kinetic stability and NTV torque evolution over transport time scales. Work supported by DE-AC02-09CH11466.

  15. Shear Behavior of 3D Woven Hollow Integrated Sandwich Composites: Experimental, Theoretical and Numerical Study

    NASA Astrophysics Data System (ADS)

    Zhou, Guangming; Liu, Chang; Cai, Deng'an; Li, Wenlong; Wang, Xiaopei

    2016-11-01

    An experimental, theoretical and numerical investigation on the shear behavior of 3D woven hollow integrated sandwich composites was presented in this paper. The microstructure of the composites was studied, then the shear modulus and load-deflection curves were obtained by double lap shear tests on the specimens in two principal directions of the sandwich panels, called warp and weft. The experimental results showed that the shear modulus of the warp was higher than that of the weft and the failure occurred in the roots of piles. A finite element model was established to predict the shear behavior of the composites. The simulated results agreed well with the experimental data. Simultaneously, a theoretical method was developed to predict the shear modulus. By comparing with the experimental data, the accuracy of the theoretical method was verified. The influence of structural parameters on shear modulus was also discussed. The higher yarn number, yarn density and dip angle of the piles could all improve the shear modulus of 3D woven hollow integrated sandwich composites at different levels, while the increasing height would decrease the shear modulus.

  16. Integrating 3D seismic curvature and curvature gradient attributes for fracture characterization: Methodologies and interpretational implications

    SciTech Connect

    Gao, Dengliang

    2013-03-01

    In 3D seismic interpretation, curvature is a popular attribute that depicts the geometry of seismic reflectors and has been widely used to detect faults in the subsurface; however, it provides only part of the solutions to subsurface structure analysis. This study extends the curvature algorithm to a new curvature gradient algorithm, and integrates both algorithms for fracture detection using a 3D seismic test data set over Teapot Dome (Wyoming). In fractured reservoirs at Teapot Dome known to be formed by tectonic folding and faulting, curvature helps define the crestal portion of the reservoirs that is associated with strong seismic amplitude and high oil productivity. In contrast, curvature gradient helps better define the regional northwest-trending and the cross-regional northeast-trending lineaments that are associated with weak seismic amplitude and low oil productivity. In concert with previous reports from image logs, cores, and outcrops, the current study based on an integrated seismic curvature and curvature gradient analysis suggests that curvature might help define areas of enhanced potential to form tensile fractures, whereas curvature gradient might help define zones of enhanced potential to develop shear fractures. In certain fractured reservoirs such as at Teapot Dome where faulting and fault-related folding contribute dominantly to the formation and evolution of fractures, curvature and curvature gradient attributes can be potentially applied to differentiate fracture mode, to predict fracture intensity and orientation, to detect fracture volume and connectivity, and to model fracture networks.

  17. CISUS: an integrated 3D ultrasound system for IGT using a modular tracking API

    NASA Astrophysics Data System (ADS)

    Boctor, Emad M.; Viswanathan, Anand; Pieper, Steve; Choti, Michael A.; Taylor, Russell H.; Kikinis, Ron; Fichtinger, Gabor

    2004-05-01

    Ultrasound has become popular in clinical/surgical applications, both as the primary image guidance modality and also in conjunction with other modalities like CT or MRI. Three dimensional ultrasound (3DUS) systems have also demonstrated usefulness in image-guided therapy (IGT). At the same time, however, current lack of open-source and open-architecture multi-modal medical visualization systems prevents 3DUS from fulfilling its potential. Several stand-alone 3DUS systems, like Stradx or In-Vivo exist today. Although these systems have been found to be useful in real clinical setting, it is difficult to augment their functionality and integrate them in versatile IGT systems. To address these limitations, a robotic/freehand 3DUS open environment (CISUS) is being integrated into the 3D Slicer, an open-source research tool developed for medical image analysis and surgical planning. In addition, the system capitalizes on generic application programming interfaces (APIs) for tracking devices and robotic control. The resulting platform-independent open-source system may serve as a valuable tool to the image guided surgery community. Other researchers could straightforwardly integrate the generic CISUS system along with other functionalities (i.e. dual view visualization, registration, real-time tracking, segmentation, etc) to rapidly create their medical/surgical applications. Our current driving clinical application is robotically assisted and freehand 3DUS-guided liver ablation, which is fully being integrated under the CISUS-3D Slicer. Initial functionality and pre-clinical feasibility are demonstrated on phantom and ex-vivo animal models.

  18. Integrated circuit tester using interferometric imaging

    SciTech Connect

    Donaldson, W.R.; Michaels, E.M.R.; Akowuah, K.

    1997-04-01

    An interferometric imaging technique can provide time-resolved diagnostics of semiconductor integrated circuits. The semiconductor device is placed in one arm of an interferometer and illuminated with a picosecond pulse from a sub-bandgap infrared laser. As the laser passes through the semiconductor, it samples local variations in the index of refraction. These variations are caused by a number of physical phenomena including dopants in the material such as those used to form device structures, heating due to the flow of electrical currents, and changes in carrier concentration due to injection. These variations have both static and dynamic components. The dynamic components are associated with the normal device operation and are the most interesting. To separate the components, the device is first imaged in a quiescent state, and then a second image is taken after the device enters a known voltage state. Differences between the two images determine where the local index of refraction has changed and by how much. A third image taken with the reference arm of the interferometer blocked, allows device structures to be associated with particular changes in the index of refraction. Activation of the voltage state is synchronized with the pulsed illumination source, and the time delay between the application of the voltage and the laser probe pulse allows us to take a series of images that map the time evolution of the interferogram. This technique offers an exciting new diagnostic for semiconductor integrated circuits. The technique is noninvasive and compatible with high-speed operation of integrated circuits. The picosecond resolution enables us to either characterize specific logic states or watch an individual device turn on. This imaging technique is sensitive to all of the index of refraction changes that can be associated with IC`s. These include heating due to current flowing through narrow wires and charge injection into the depletion region of a transistor.

  19. Electro-optical Probing Of Terahertz Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Bhasin, K. B.; Romanofsky, R.; Whitaker, J. F.; Valdmanis, J. A.; Mourou, G.; Jackson, T. A.

    1990-01-01

    Electro-optical probe developed to perform noncontact, nondestructive, and relatively noninvasive measurements of electric fields over broad spectrum at millimeter and shorter wavelengths in integrated circuits. Manipulated with conventional intregrated-circuit-wafer-probing equipment and operated without any special preparation of integrated circuits. Tip of probe small electro-optical crystal serving as proximity electric-field sensor.

  20. Accelerating functional verification of an integrated circuit

    SciTech Connect

    Deindl, Michael; Ruedinger, Jeffrey Joseph; Zoellin, Christian G.

    2015-10-27

    Illustrative embodiments include a method, system, and computer program product for accelerating functional verification in simulation testing of an integrated circuit (IC). Using a processor and a memory, a serial operation is replaced with a direct register access operation, wherein the serial operation is configured to perform bit shifting operation using a register in a simulation of the IC. The serial operation is blocked from manipulating the register in the simulation of the IC. Using the register in the simulation of the IC, the direct register access operation is performed in place of the serial operation.

  1. Tool For Tinning Integrated-Circuit Leads

    NASA Technical Reports Server (NTRS)

    Prosser, Gregory N.

    1988-01-01

    As many as eight flatpacks held. Tool made of fiberglass boards. Clamps row of flatpacks by their leads so leads on opposite side of packages dipped. After dipping, nuts on boards loosened, flatpacks turned around, nuts retightened, and untinned leads dipped. Strips of magnetic material grip leads of flatpacks (made of Kovar, magnetic iron/nickel/cobalt alloy) while boards repositioned. Micrometerlike screw used to adjust exposed width of magnetic strip to suit dimensions of flatpacks. Holds flatpack integrated circuits so leads tinned. Accommodates several flatpacks for simultaneous dipping of leads in molten solder. Adjusts to accept flatpacks in range of sizes.

  2. Integrated-Circuit Broadband Infrared Sources

    NASA Technical Reports Server (NTRS)

    Lamb, G.; Jhabvala, M.; Burgess, A.

    1989-01-01

    Microscopic devices consume less power, run hotter, and are more reliable. Simple, compact, lightweight, rapidly-responding reference sources of broadband infrared radiation made available by integrated-circuit technology. Intended primarily for use in calibration of remote-sensing infrared instruments, devices eventually replace conventional infrared sources. New devices also replace present generation of miniature infrared sources. Self-passivating nature of poly-crystalline silicon adds to reliability of devices. Maximum operating temperature is 1,000 K, and power dissipation is only one-fourth that of prior devices.

  3. An integrated circuit floating point accumulator

    NASA Technical Reports Server (NTRS)

    Goldsmith, T. C.

    1977-01-01

    Goddard Space Flight Center has developed a large scale integrated circuit (type 623) which can perform pulse counting, storage, floating point compression, and serial transmission, using a single monolithic device. Counts of 27 or 19 bits can be converted to transmitted values of 12 or 8 bits respectively. Use of the 623 has resulted in substantial savaings in weight, volume, and dollar resources on at least 11 scientific instruments to be flown on 4 NASA spacecraft. The design, construction, and application of the 623 are described.

  4. Testing Fixture For Microwave Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Romanofsky, Robert; Shalkhauser, Kurt

    1989-01-01

    Testing fixture facilitates radio-frequency characterization of microwave and millimeter-wave integrated circuits. Includes base onto which two cosine-tapered ridge waveguide-to-microstrip transitions fastened. Length and profile of taper determined analytically to provide maximum bandwidth and minimum insertion loss. Each cosine taper provides transformation from high impedance of waveguide to characteristic impedance of microstrip. Used in conjunction with automatic network analyzer to provide user with deembedded scattering parameters of device under test. Operates from 26.5 to 40.0 GHz, but operation extends to much higher frequencies.

  5. Automatic Parametric Testing Of Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Jennings, Glenn A.; Pina, Cesar A.

    1989-01-01

    Computer program for parametric testing saves time and effort in research and development of integrated circuits. Software system automatically assembles various types of test structures and lays them out on silicon chip, generates sequency of test instructions, and interprets test data. Employs self-programming software; needs minimum of human intervention. Adapted to needs of different laboratories and readily accommodates new test structures. Program codes designed to be adaptable to most computers and test equipment now in use. Written in high-level languages to enhance transportability.

  6. Computer Aided Engineering of Semiconductor Integrated Circuits

    DTIC Science & Technology

    1976-04-01

    transistor opera tion; (4) theoretical invest! jations of carrifr mobli *!;y *"« inversion layer of an MOSFET; (5) mathematical investigations for high...satisfactory greLnt «Lh experiment. In time, the rapid groWth of se.r- oonduotor integrated circuit (IC, technology created ^ ^ °n" £or which this theory was...and Technology of Semiconductor Devices, John Wiley and Sons, Inc., N.Y. (1967). [2] S. K. Ghandi, The Theory and Practice of

  7. Illustrating Surface Shape in Volume Data via Principal Direction-Driven 3D Line Integral Convolution

    NASA Technical Reports Server (NTRS)

    Interrante, Victoria

    1997-01-01

    The three-dimensional shape and relative depth of a smoothly curving layered transparent surface may be communicated particularly effectively when the surface is artistically enhanced with sparsely distributed opaque detail. This paper describes how the set of principal directions and principal curvatures specified by local geometric operators can be understood to define a natural 'flow' over the surface of an object, and can be used to guide the placement of the lines of a stroke texture that seeks to represent 3D shape information in a perceptually intuitive way. The driving application for this work is the visualization of layered isovalue surfaces in volume data, where the particular identity of an individual surface is not generally known a priori and observers will typically wish to view a variety of different level surfaces from the same distribution, superimposed over underlying opaque structures. By advecting an evenly distributed set of tiny opaque particles, and the empty space between them, via 3D line integral convolution through the vector field defined by the principal directions and principal curvatures of the level surfaces passing through each gridpoint of a 3D volume, it is possible to generate a single scan-converted solid stroke texture that may intuitively represent the essential shape information of any level surface in the volume. To generate longer strokes over more highly curved areas, where the directional information is both most stable and most relevant, and to simultaneously downplay the visual impact of directional information in the flatter regions, one may dynamically redefine the length of the filter kernel according to the magnitude of the maximum principal curvature of the level surface at the point around which it is applied.

  8. Scientific Subsurface data for EPOS - integration of 3D and 4D data services

    NASA Astrophysics Data System (ADS)

    Kerschke, Dorit; Hammitzsch, Martin; Wächter, Joachim

    2016-04-01

    The provision of efficient and easy access to scientific subsurface data sets obtained from field studies and scientific observatories or by geological 3D/4D-modeling is an important contribution to modern research infrastructures as they can facilitate the integrated analysis and evaluation as well as the exchange of scientific data. Within the project EPOS - European Plate Observing System, access to 3D and 4D data sets will be provided by 'WP15 - Geological information and modeling' and include structural geology models as well as numerical models, e.g., temperature, aquifers, and velocity. This also includes validated raw data, e.g., seismic profiles, from which the models where derived. All these datasets are of high quality and of unique scientific value as the process of modeling is time and cost intensive. However, these models are currently not easily accessible for the wider scientific community, much less to the public. For the provision of these data sets a data management platform based on common and standardized data models, protocols, and encodings as well as on a predominant use of Free and Open Source Software (FOSS) has been devised. The interoperability for disciplinary and domain applications thus highly depends on the adoption of generally agreed technologies and standards (OGC, ISO…) originating from Spatial Data Infrastructure related efforts (e.g., INSPIRE). However, since not many standards for 3D and 4D geological data exists, this work also includes new approaches for project data management, interfaces for tools used by the researchers, and interfaces for the sharing and reusing of data.

  9. 3D tract-specific local and global analysis of white matter integrity in Alzheimer's disease.

    PubMed

    Jin, Yan; Huang, Chao; Daianu, Madelaine; Zhan, Liang; Dennis, Emily L; Reid, Robert I; Jack, Clifford R; Zhu, Hongtu; Thompson, Paul M

    2017-03-01

    Alzheimer's disease (AD) is a chronic neurodegenerative disease characterized by progressive decline in memory and other aspects of cognitive function. Diffusion-weighted imaging (DWI) offers a non-invasive approach to delineate the effects of AD on white matter (WM) integrity. Previous studies calculated either some summary statistics over regions of interest (ROI analysis) or some statistics along mean skeleton lines (Tract Based Spatial Statistic [TBSS]), so they cannot quantify subtle local WM alterations along major tracts. Here, a comprehensive WM analysis framework to map disease effects on 3D tracts both locally and globally, based on a study of 200 subjects: 49 healthy elderly normal controls, 110 with mild cognitive impairment, and 41 AD patients has been presented. 18 major WM tracts were extracted with our automated clustering algorithm-autoMATE (automated Multi-Atlas Tract Extraction); we then extracted multiple DWI-derived parameters of WM integrity along the WM tracts across all subjects. A novel statistical functional analysis method-FADTTS (Functional Analysis for Diffusion Tensor Tract Statistics) was applied to quantify degenerative patterns along WM tracts across different stages of AD. Gradually increasing WM alterations were found in all tracts in successive stages of AD. Among all 18 WM tracts, the fornix was most adversely affected. Among all the parameters, mean diffusivity (MD) was the most sensitive to WM alterations in AD. This study provides a systematic workflow to examine WM integrity across automatically computed 3D tracts in AD and may be useful in studying other neurological and psychiatric disorders. Hum Brain Mapp 38:1191-1207, 2017. © 2016 Wiley Periodicals, Inc.

  10. 3D tract‐specific local and global analysis of white matter integrity in Alzheimer's disease

    PubMed Central

    Jin, Yan; Huang, Chao; Daianu, Madelaine; Zhan, Liang; Dennis, Emily L.; Reid, Robert I.; Jack, Clifford R.; Zhu, Hongtu

    2016-01-01

    Abstract Alzheimer's disease (AD) is a chronic neurodegenerative disease characterized by progressive decline in memory and other aspects of cognitive function. Diffusion‐weighted imaging (DWI) offers a non‐invasive approach to delineate the effects of AD on white matter (WM) integrity. Previous studies calculated either some summary statistics over regions of interest (ROI analysis) or some statistics along mean skeleton lines (Tract Based Spatial Statistic [TBSS]), so they cannot quantify subtle local WM alterations along major tracts. Here, a comprehensive WM analysis framework to map disease effects on 3D tracts both locally and globally, based on a study of 200 subjects: 49 healthy elderly normal controls, 110 with mild cognitive impairment, and 41 AD patients has been presented. 18 major WM tracts were extracted with our automated clustering algorithm—autoMATE (automated Multi‐Atlas Tract Extraction); we then extracted multiple DWI‐derived parameters of WM integrity along the WM tracts across all subjects. A novel statistical functional analysis method—FADTTS (Functional Analysis for Diffusion Tensor Tract Statistics) was applied to quantify degenerative patterns along WM tracts across different stages of AD. Gradually increasing WM alterations were found in all tracts in successive stages of AD. Among all 18 WM tracts, the fornix was most adversely affected. Among all the parameters, mean diffusivity (MD) was the most sensitive to WM alterations in AD. This study provides a systematic workflow to examine WM integrity across automatically computed 3D tracts in AD and may be useful in studying other neurological and psychiatric disorders. Hum Brain Mapp 38:1191–1207, 2017. © 2016 Wiley Periodicals, Inc. PMID:27883250

  11. The Avignon Bridge: a 3d Reconstruction Project Integrating Archaeological, Historical and Gemorphological Issues

    NASA Astrophysics Data System (ADS)

    Berthelot, M.; Nony, N.; Gugi, L.; Bishop, A.; De Luca, L.

    2015-02-01

    The history and identity of the Avignon's bridge is inseparable from that of the Rhône river. Therefore, in order to share the history and memory of the Rhône, it is essential to get to know this bridge and especially to identify and make visible the traces of its past, its construction, its interaction with the river dynamics, which greatly influenced his life. These are the objectives of the PAVAGE project that focuses on digitally surveying, modelling and re-visiting a heritage site of primary importance with the aim of virtually restoring the link between the two sides which, after the disappearance of the Roman bridge of Arles, constituted for a long time the only connection between Lyon or Vienna and the sea. Therefore, this project has an important geo-historical dimension for which geo-morphological and paleoenvironmental studies were implemented in connection with the latest digital simulation methods exploiting geographic information systems. By integrating knowledge and reflections of archaeologists, historians, geomorphologists, environmentalists, architects, engineers and computer scientists, the result of this project (which involved 5 laboratories during 4 years) is a 3D digital model covering an extension of 50 km2 achieved by integrating satellite imagery, UAV-based acquisitions, terrestrial laser scanning and photogrammetry, etc. Beyond the actions of scientific valorisation concerning the historical and geomorphological dimensions of the project, the results of this work of this interdisciplinary investigation and interpretation of this site are today integrated within a location-based augmented reality application allowing tourists to exploring the virtual reconstruction of the bridge and its environment through tablets inside the portion of territory covered by this project (between Avignon and Villeneuve-lez-Avignon). This paper presents the main aspects of the 3D virtual reconstruction approach.

  12. First Steps Towards AN Integrated Citygml-Based 3d Model of Vienna

    NASA Astrophysics Data System (ADS)

    Agugiaro, G.

    2016-06-01

    This paper presents and discusses the results regarding the initial steps (selection, analysis, preparation and eventual integration of a number of datasets) for the creation of an integrated, semantic, three-dimensional, and CityGML-based virtual model of the city of Vienna. CityGML is an international standard conceived specifically as information and data model for semantic city models at urban and territorial scale. It is being adopted by more and more cities all over the world. The work described in this paper is embedded within the European Marie-Curie ITN project "Ci-nergy, Smart cities with sustainable energy systems", which aims, among the rest, at developing urban decision making and operational optimisation software tools to minimise non-renewable energy use in cities. Given the scope and scale of the project, it is therefore vital to set up a common, unique and spatio-semantically coherent urban model to be used as information hub for all applications being developed. This paper reports about the experiences done so far, it describes the test area and the available data sources, it shows and exemplifies the data integration issues, the strategies developed to solve them in order to obtain the integrated 3D city model. The first results as well as some comments about their quality and limitations are presented, together with the discussion regarding the next steps and some planned improvements.

  13. THREE DIMENSIONAL INTEGRATED CHARACTERIZATION AND ARCHIVING SYSTEM (3D-ICAS)

    SciTech Connect

    George Jarvis

    2001-06-18

    The overall objective of this project is to develop an integrated system that remotely characterizes, maps, and archives measurement data of hazardous decontamination and decommissioning (D&D) areas. The system will generate a detailed 3-dimensional topography of the area as well as real-time quantitative measurements of volatile organics and radionuclides. The system will analyze substrate materials consisting of concrete, asbestos, and transite. The system will permanently archive the data measurements for regulatory and data integrity documentation. Exposure limits, rest breaks, and donning and removal of protective garments generate waste in the form of contaminated protective garments and equipment. Survey times are increased and handling and transporting potentially hazardous materials incur additional costs. Off-site laboratory analysis is expensive and time-consuming, often necessitating delay of further activities until results are received. The Three Dimensional Integrated Characterization and Archiving System (3D-ICAS) has been developed to alleviate some of these problems. 3D-ICAS provides a flexible system for physical, chemical and nuclear measurements reduces costs and improves data quality. Operationally, 3D-ICAS performs real-time determinations of hazardous and toxic contamination. A prototype demonstration unit is available for use in early 2000. The tasks in this Phase included: (1) Mobility Platforms: Integrate hardware onto mobility platforms, upgrade surface sensors, develop unit operations and protocol. (2) System Developments: Evaluate metals detection capability using x-ray fluorescence technology. (3) IWOS Upgrades: Upgrade the IWOS software and hardware for compatibility with mobility platform. The system was modified, tested and debugged during 1999 and 2000. The 3D-ICAS was shipped on 11 May 2001 to FIU-HCET for demonstration and validation of the design modifications. These modifications included simplifying the design from a two

  14. 3D printed electromagnetic transmission and electronic structures fabricated on a single platform using advanced process integration techniques

    NASA Astrophysics Data System (ADS)

    Deffenbaugh, Paul Issac

    3D printing has garnered immense attention from many fields including in-office rapid prototyping of mechanical parts, outer-space satellite replication, garage functional firearm manufacture, and NASA rocket engine component fabrication. 3D printing allows increased design flexibility in the fabrication of electronics, microwave circuits and wireless antennas and has reached a level of maturity which allows functional parts to be printed. Much more work is necessary in order to perfect the processes of 3D printed electronics especially in the area of automation. Chapter 1 shows several finished prototypes of 3D printed electronics as well as newly developed techniques in fabrication. Little is known about the RF and microwave properties and applications of the standard materials which have been developed for 3D printing. Measurement of a wide variety of materials over a broad spectrum of frequencies up to 10 GHz using a variety of well-established measurement methods is performed throughout chapter 2. Several types of high frequency RF transmission lines are fabricated and valuable model-matched data is gathered and provided in chapter 3 for future designers' use. Of particular note is a fully 3D printed stripline which was automatically fabricated in one process on one machine. Some core advantages of 3D printing RF/microwave components include rapid manufacturing of complex, dimensionally sensitive circuits (such as antennas and filters which are often iteratively tuned) and the ability to create new devices that cannot be made using standard fabrication techniques. Chapter 4 describes an exemplary fully 3D printed curved inverted-F antenna.

  15. Human Microtumors Generated in 3D: Novel Tools for Integrated In Situ Studies of Cancer Immunotherapies.

    PubMed

    Hambach, Lothar; Buser, Andreas; Vermeij, Marcel; Pouw, Nadine; van der Kwast, Theo; Goulmy, Els

    2016-01-01

    Cellular immunotherapy targeting human tumor antigens is a promising strategy to treat solid tumors. Yet clinical results of cellular immunotherapy are disappointing. Moreover, the currently available in vitro human tumor models are not designed to study the optimization of T-cell therapies of solid tumors. Here, we describe a novel assay for multiparametric in situ analysis of therapeutic effects on individual human three-dimensional (3D) tumors. In this assay, tumors of several millimeter diameter are generated from human cancer cell lines of different tumor entities in a collagen type I microenvironment. A newly developed approach for efficient morphological analysis reveals that these in vitro tumors resemble many characteristics of the corresponding clinical cancers such as histological features, immunohistochemical staining patterns, distinct tumor growth compartments and heterogeneous protein expression. To assess the response to therapy with tumor antigen specific T-cells, standardized protocols are described to determine T-cell infiltration and tumor destruction by monitoring soluble factors and tumor growth. Human tumors engineered in 3D collagen scaffolds are excellent in vitro surrogates for avascular tumor stages allowing integrated analyses of the antitumor efficacy of cancer specific immunotherapy in situ.

  16. Integrated Interventional Devices For Real Time 3D Ultrasound Imaging and Therapy

    NASA Astrophysics Data System (ADS)

    Smith, Stephen W.; Lee, Warren; Gentry, Kenneth L.; Pua, Eric C.; Light, Edward D.

    2006-05-01

    Two recent advances have expanded the potential of medical ultrasound: the introduction of real-time 3-D ultrasound imaging with catheter, transesophageal and laparoscopic probes and the development of interventional ultrasound therapeutic systems for focused ultrasound surgery, ablation and ultrasound enhanced drug delivery. This work describes devices combining both technologies. A series of transducer probes have been designed, fabricated and tested including: 1) a 12 French side scanning catheter incorporating a 64 element matrix array for imaging at 5MHz and a piston ablation transducer operating at 10 MHz. 2) a 14 Fr forward-scanning catheter integrating a 112 element 2-D array for imaging at 5 MHz encircled by an ablation annulus operating at 10 MHz. Finite element modeling was then used to simulate catheter annular and linear phased array transducers for ablation. 3) Linear phased array transducers were built to confirm the finite element analysis at 4 and 8 MHz including a mechanically focused 86 element 9 MHz array which transmits an ISPTA of 29.3 W/cm2 and creates a lesion in 2 minutes. 4) 2-D arrays of 504 channels operating at 5 MHz have been developed for transesophageal and laparascopic 3D imaging as well as therapeutic heating. All the devices image the heart anatomy including atria, valves, septa and en face views of the pulmonary veins.

  17. The cross-correlation between 3D cosmic shear and the integrated Sachs-Wolfe effect

    NASA Astrophysics Data System (ADS)

    Zieser, Britta; Merkel, Philipp M.

    2016-06-01

    We present the first calculation of the cross-correlation between 3D cosmic shear and the integrated Sachs-Wolfe (iSW) effect. Both signals are combined in a single formalism, which permits the computation of the full covariance matrix. In order to avoid the uncertainties presented by the non-linear evolution of the matter power spectrum and intrinsic alignments of galaxies, our analysis is restricted to large scales, i.e. multipoles below ℓ = 1000. We demonstrate in a Fisher analysis that this reduction compared to other studies of 3D weak lensing extending to smaller scales is compensated by the information that is gained if the additional iSW signal and in particular its cross-correlation with lensing data are considered. Given the observational standards of upcoming weak-lensing surveys like Euclid, marginal errors on cosmological parameters decrease by 10 per cent compared to a cosmic shear experiment if both types of information are combined without a cosmic wave background (CMB) prior. Once the constraining power of CMB data is added, the improvement becomes marginal.

  18. CATIA-V 3D Modeling for Design Integration of the Ignitor Machine Load Assembly^*

    NASA Astrophysics Data System (ADS)

    Bianchi, A.; Parodi, B.; Gardella, F.; Coppi, B.

    2007-11-01

    In the framework of the ANSALDO industrial contribution to the Ignitor engineering design, the detailed design of all components of the machine core (Load Assembly) has been completed. The machine Central Post, Central Solenoid, and Poloidal Field Coil systems, the Plasma Chamber and First Wall system, the surrounding mechanical structures, the Vacuum Cryostat and the polyethylene boron sheets attached to it for neutron shielding, have all been analyzed to confirm that they can withstand both normal and off-normal operating loads, as well as the Plasma Chamber and First Wall baking operations, with proper safety margins, for the maximum plasma parameters scenario at 13 T/11 MA, for the reduced scenarios at 9 T/7 MA (limiter) and at 9 T/6 MA (double nul). Both 3D and 2D drawings of each individual component have been produced using the Dassault Systems CATIA-V software. After they have been all integrated into a single 3D CATIA model of the Load Assembly, the electro-fluidic and fluidic lines which supply electrical currents and helium cooling gas to the coils have been added and mechanically incorporated with the components listed above. A global seismic analysis of the Load Assembly with SSE/OBE response spectra has also been performed to verify that it is able to withstand such external events. ^*Work supported in part by ENEA of italy and by the US D.O.E.

  19. Thin-dielectric-layer engineering for 3D nanostructure integration using an innovative planarization approach

    NASA Astrophysics Data System (ADS)

    Guerfi, Y.; Doucet, J. B.; Larrieu, G.

    2015-10-01

    Three-dimensional (3D) nanostructures are emerging as promising building blocks for a large spectrum of applications. One critical issue in integration regards mastering the thin, flat, and chemically stable insulating layer that must be implemented on the nanostructure network in order to build striking nano-architectures. In this letter, we report an innovative method for nanoscale planarization on 3D nanostructures by using hydrogen silesquioxane as a spin-on-glass (SOG) dielectric material. To decouple the thickness of the final layer from the height of the nanostructure, we propose to embed the nanowire network in the insulator layer by exploiting the planarizing properties of the SOG approach. To achieve the desired dielectric thickness, the structure is chemically etched back with a highly diluted solution to control the etch rate precisely. The roughness of the top surface was less than 2 nm. There were no surface defects and the planarity was excellent, even in the vicinity of the nanowires. This newly developed process was used to realize a multilevel stack architecture with sub-deca-nanometer-range layer thickness.

  20. 3Disease Browser: A Web server for integrating 3D genome and disease-associated chromosome rearrangement data

    PubMed Central

    Li, Ruifeng; Liu, Yifang; Li, Tingting; Li, Cheng

    2016-01-01

    Chromosomal rearrangement (CR) events have been implicated in many tumor and non-tumor human diseases. CR events lead to their associated diseases by disrupting gene and protein structures. Also, they can lead to diseases through changes in chromosomal 3D structure and gene expression. In this study, we search for CR-associated diseases potentially caused by chromosomal 3D structure alteration by integrating Hi-C and ChIP-seq data. Our algorithm rediscovers experimentally verified disease-associated CRs (polydactyly diseases) that alter gene expression by disrupting chromosome 3D structure. Interestingly, we find that intellectual disability may be a candidate disease caused by 3D chromosome structure alteration. We also develop a Web server (3Disease Browser, http://3dgb.cbi.pku.edu.cn/disease/) for integrating and visualizing disease-associated CR events and chromosomal 3D structure. PMID:27734896

  1. 3D integration of microcomponents in a single glass chip by femtosecond laser direct writing for biochemical analysis

    NASA Astrophysics Data System (ADS)

    Sugioka, Koji; Hanada, Yasutaka; Midorikawa, Katsumi

    2007-05-01

    3D integration of microcomponents in a single glass chip by femtosecond laser direct writing followed by post annealing and successive wet etching is described for application to biochemical analysis. Integration of microfluidics and microoptics realized some functional microdevices like a μ-fluidic dye laser and a biosensor. As one of practical applications, we demonstrate inspection of living microorganisms using the microchip with 3D microfluidic structures fabricated by the present technique.

  2. Real-time computer-generated integral imaging and 3D image calibration for augmented reality surgical navigation.

    PubMed

    Wang, Junchen; Suenaga, Hideyuki; Liao, Hongen; Hoshi, Kazuto; Yang, Liangjing; Kobayashi, Etsuko; Sakuma, Ichiro

    2015-03-01

    Autostereoscopic 3D image overlay for augmented reality (AR) based surgical navigation has been studied and reported many times. For the purpose of surgical overlay, the 3D image is expected to have the same geometric shape as the original organ, and can be transformed to a specified location for image overlay. However, how to generate a 3D image with high geometric fidelity and quantitative evaluation of 3D image's geometric accuracy have not been addressed. This paper proposes a graphics processing unit (GPU) based computer-generated integral imaging pipeline for real-time autostereoscopic 3D display, and an automatic closed-loop 3D image calibration paradigm for displaying undistorted 3D images. Based on the proposed methods, a novel AR device for 3D image surgical overlay is presented, which mainly consists of a 3D display, an AR window, a stereo camera for 3D measurement, and a workstation for information processing. The evaluation on the 3D image rendering performance with 2560×1600 elemental image resolution shows the rendering speeds of 50-60 frames per second (fps) for surface models, and 5-8 fps for large medical volumes. The evaluation of the undistorted 3D image after the calibration yields sub-millimeter geometric accuracy. A phantom experiment simulating oral and maxillofacial surgery was also performed to evaluate the proposed AR overlay device in terms of the image registration accuracy, 3D image overlay accuracy, and the visual effects of the overlay. The experimental results show satisfactory image registration and image overlay accuracy, and confirm the system usability.

  3. 3D Integration of MEMS and IC: Design, Technology and Simulations

    NASA Astrophysics Data System (ADS)

    Taklo, Maaike M. V.; Schjølberg-Henriksen, Kari; Lietaer, Nicolas; Prainsack, Josef; Elfving, Anders; Weber, Josef; Klein, Matthias; Schneider, Peter; Reitz, Sven

    A 3D integrated silicon stack consisting of two MEMS devices and two IC devices is presented. The MEMS devices are a pressure sensor and a bulk acoustic resonator (BAR). The stack was constructed for a tire pressure monitoring system (TPMS) which was one out of three demonstrators for an EU funded project called e-CUBES. Thermal simulations were performed to check the level of thermo-mechanical stresses induced on the pressure sensor membrane during extreme environmental conditions. Additional simulations were made to calculate the exact temperature on the BAR device during operation as this was important for the operational frequency. This paper presents and discusses the technology choices made for the stacking of the pressure sensor and the BAR. Results are given from simulations, initial short-loop experiments and for the final stacking.

  4. The RCSB protein data bank: integrative view of protein, gene and 3D structural information.

    PubMed

    Rose, Peter W; Prlić, Andreas; Altunkaya, Ali; Bi, Chunxiao; Bradley, Anthony R; Christie, Cole H; Costanzo, Luigi Di; Duarte, Jose M; Dutta, Shuchismita; Feng, Zukang; Green, Rachel Kramer; Goodsell, David S; Hudson, Brian; Kalro, Tara; Lowe, Robert; Peisach, Ezra; Randle, Christopher; Rose, Alexander S; Shao, Chenghua; Tao, Yi-Ping; Valasatava, Yana; Voigt, Maria; Westbrook, John D; Woo, Jesse; Yang, Huangwang; Young, Jasmine Y; Zardecki, Christine; Berman, Helen M; Burley, Stephen K

    2017-01-04

    The Research Collaboratory for Structural Bioinformatics Protein Data Bank (RCSB PDB, http://rcsb.org), the US data center for the global PDB archive, makes PDB data freely available to all users, from structural biologists to computational biologists and beyond. New tools and resources have been added to the RCSB PDB web portal in support of a 'Structural View of Biology.' Recent developments have improved the User experience, including the high-speed NGL Viewer that provides 3D molecular visualization in any web browser, improved support for data file download and enhanced organization of website pages for query, reporting and individual structure exploration. Structure validation information is now visible for all archival entries. PDB data have been integrated with external biological resources, including chromosomal position within the human genome; protein modifications; and metabolic pathways. PDB-101 educational materials have been reorganized into a searchable website and expanded to include new features such as the Geis Digital Archive.

  5. 3D-NTT: a versatile integral field spectro-imager for the NTT

    NASA Astrophysics Data System (ADS)

    Marcelin, M.; Amram, P.; Balard, P.; Balkowski, C.; Boissin, O.; Boulesteix, J.; Carignan, C.; Daigle, O.; de Denus Baillargeon, M.-M.; Epinat, B.; Gach, J.-L.; Hernandez, O.; Rigaud, F.; Vallée, P.

    2008-07-01

    The 3D-NTT is a visible integral field spectro-imager offering two modes. A low resolution mode (R ~ 300 to 6 000) with a large field of view Tunable Filter (17'x17') and a high resolution mode (R ~ 10 000 to 40 000) with a scanning Fabry-Perot (7'x7'). It will be operated as a visitor instrument on the NTT from 2009. Two large programmes will be led: "Characterizing the interstellar medium of nearby galaxies with 2D maps of extinction and abundances" (PI M. Marcelin) and "Gas accretion and radiative feedback in the early universe" (PI J. Bland Hawthorn). Both will be mainly based on the Tunable Filter mode. This instrument is being built as a collaborative effort between LAM (Marseille), GEPI (Paris) and LAE (Montreal). The website adress of the instrument is : http://www.astro.umontreal.ca/3DNTT

  6. Tensile Properties and Failure Mechanism of 3D Woven Hollow Integrated Sandwich Composites

    NASA Astrophysics Data System (ADS)

    Liu, Chang; Cai, Deng'an; Zhou, Guangming; Lu, Fangzhou

    2017-01-01

    Tensile properties and failure mechanism of 3D woven hollow integrated sandwich composites are investigated experimentally, theoretically and numerically in this paper. Firstly, the tensile properties are obtained by quasi-static tensile tests on the specimens in two principal directions of the sandwich panels, called warp and weft. The experimental results shows that the tensile performances of the warp are better than that of the weft. By observing the broken specimens, it is found that the touch parts between yarns are the main failure regions under tension. Then, a theoretical method is developed to predict the tensile properties. By comparing with the experimental data, the accuracy of the theoretical method is verified. Simultaneously, a finite element model is established to predict the tensile behavior of the composites. The numerical results agree well with the experimental data. Moreover, the simulated progressive damages show that the contact regions in the warp and weft tension are both the initial failure areas.

  7. Anisotropic heat transport in integrable and chaotic 3-D magnetic fields

    SciTech Connect

    Del-Castillo-Negrete, Diego B; Blazevski, D.; Chacon, Luis

    2012-01-01

    A study of anisotropic heat transport in 3-D chaotic magnetic fields is presented. The approach is based on the recently proposed Lagrangian-Green s function (LG) method in Ref. [1] that allows an efficient and accurate integration of the parallel transport equation applicable to general magnetic fields with local or non-local parallel flux closures. We focus on reversed shear magnetic field configurations known to exhibit separatrix reconnection and shearless transport barriers. The role of reconnection and magnetic field line chaos on temperature transport is studied. Numerical results are presented on the anomalous relaxation of radial temperature gradients in the presence of shearless Cantori partial barri- ers. Also, numerical evidence of non-local effective radial temperature transport in chaotic fields is presented. Going beyond purely parallel transport, the LG method is generalized to include finite perpendicular diffusivity, and the problem of temperature flattening inside a magnetic island is studied.

  8. Integration of the virtual 3D model of a control system with the virtual controller

    NASA Astrophysics Data System (ADS)

    Herbuś, K.; Ociepka, P.

    2015-11-01

    Nowadays the design process includes simulation analysis of different components of a constructed object. It involves the need for integration of different virtual object to simulate the whole investigated technical system. The paper presents the issues related to the integration of a virtual 3D model of a chosen control system of with a virtual controller. The goal of integration is to verify the operation of an adopted object of in accordance with the established control program. The object of the simulation work is the drive system of a tunneling machine for trenchless work. In the first stage of work was created an interactive visualization of functioning of the 3D virtual model of a tunneling machine. For this purpose, the software of the VR (Virtual Reality) class was applied. In the elaborated interactive application were created adequate procedures allowing controlling the drive system of a translatory motion, a rotary motion and the drive system of a manipulator. Additionally was created the procedure of turning on and off the output crushing head, mounted on the last element of the manipulator. In the elaborated interactive application have been established procedures for receiving input data from external software, on the basis of the dynamic data exchange (DDE), which allow controlling actuators of particular control systems of the considered machine. In the next stage of work, the program on a virtual driver, in the ladder diagram (LD) language, was created. The control program was developed on the basis of the adopted work cycle of the tunneling machine. The element integrating the virtual model of the tunneling machine for trenchless work with the virtual controller is the application written in a high level language (Visual Basic). In the developed application was created procedures responsible for collecting data from the running, in a simulation mode, virtual controller and transferring them to the interactive application, in which is verified the

  9. Integrated gravity and gravity gradient 3D inversion using the non-linear conjugate gradient

    NASA Astrophysics Data System (ADS)

    Qin, Pengbo; Huang, Danian; Yuan, Yuan; Geng, Meixia; Liu, Jie

    2016-03-01

    Gravity data, which are critical in mineral, oil, and gas exploration, are obtained from the vertical component of the gravity field, while gravity gradient data are measured from changes in the gravity field in three directions. However, few studies have sought to improve exploration techniques by integrating gravity and gravity gradient data using inversion methods. In this study, we developed a new method to integrate gravity and gravity gradient data in a 3D density inversion using the non-linear conjugate gradient (NLCG) method and the minimum gradient support (MGS) functional to regularize the 3D inverse problem and to obtain a clear and accurate image of the anomalous body. The NLCG algorithm, which is suitable for solving large-scale nonlinear optimization problems and requires no memory storage, was compared to the Broyden-Fletcher-Goldfarb-Shanno (BFGS) quasi-Newton algorithm and the results indicated that the convergence rate of NLCG is slower, but that the storage requirement and computation time is lower. To counteract the decay in kernel function, we introduced a depth weighting function for anomalous bodies at the same depth, with information about anomalous body depth obtained from well log and seismic exploration data. For anomalous bodies at different depths, we introduced a spatial gradient weighting function to incorporate additional information obtained in the inversion. We concluded that the spatial gradient weighting function enhanced the spatial resolution of the recovered model. Furthermore, our results showed that including multiple components for inversion increased the resolution of the recovered model. We validated our model by applying our inversion method to survey data from Vinton salt dome, Louisiana, USA. The results showed good agreement with known geologic information; thus confirming the accuracy of this approach.

  10. Time And Temperature Dependent Micromechanical Properties Of Solder Joints For 3D-Package Integration

    NASA Astrophysics Data System (ADS)

    Roellig, Mike; Meier, Karsten; Metasch, Rene

    2010-11-01

    The recent development of 3D-integrated electronic packages is characterized by the need to increase the diversity of functions and to miniaturize. Currently many 3D-integration concepts are being developed and all of them demand new materials, new designs and new processing technologies. The combination of simulation and experimental investigation becomes increasingly accepted since simulations help to shorten the R&D cycle time and reduce costs. Numerical calculations like the Finite-Element-Method are strong tools to calculate stress conditions in electronic packages resulting from thermal strains due to the manufacturing process and environmental loads. It is essential for the application of numerical calculations that the material data is accurate and describes sufficiently the physical behaviour. The developed machine allows the measurement of time and temperature dependent micromechanical properties of solder joints. Solder joints, which are used to mechanically and electrically connect different packages, are physically measured as they leave the process. This allows accounting for process influences, which may change material properties. Additionally, joint sizes and metallurgical interactions between solder and under bump metallization can be respected by this particular measurement. The measurement allows the determination of material properties within a temperature range of 20° C-200° C. Further, the time dependent creep deformation can be measured within a strain-rate range of 10-31/s-10-81/s. Solder alloys based on Sn-Ag/Sn-Ag-Cu with additionally impurities and joint sizes down to O/ 200 μm were investigated. To finish the material characterization process the material model coefficient were extracted by FEM-Simulation to increase the accuracy of data.

  11. Integrating genomic information with protein sequence and 3D atomic level structure at the RCSB protein data bank.

    PubMed

    Prlić, Andreas; Kalro, Tara; Bhattacharya, Roshni; Christie, Cole; Burley, Stephen K; Rose, Peter W

    2016-12-15

    The Protein Data Bank (PDB) now contains more than 120,000 three-dimensional (3D) structures of biological macromolecules. To allow an interpretation of how PDB data relates to other publicly available annotations, we developed a novel data integration platform that maps 3D structural information across various datasets. This integration bridges from the human genome across protein sequence to 3D structure space. We developed novel software solutions for data management and visualization, while incorporating new libraries for web-based visualization using SVG graphics.

  12. Direct laser-writing of ferroelectric single-crystal waveguide architectures in glass for 3D integrated optics

    PubMed Central

    Stone, Adam; Jain, Himanshu; Dierolf, Volkmar; Sakakura, Masaaki; Shimotsuma, Yasuhiko; Miura, Kiyotaka; Hirao, Kazuyuki; Lapointe, Jerome; Kashyap, Raman

    2015-01-01

    Direct three-dimensional laser writing of amorphous waveguides inside glass has been studied intensely as an attractive route for fabricating photonic integrated circuits. However, achieving essential nonlinear-optic functionality in such devices will also require the ability to create high-quality single-crystal waveguides. Femtosecond laser irradiation is capable of crystallizing glass in 3D, but producing optical-quality single-crystal structures suitable for waveguiding poses unique challenges that are unprecedented in the field of crystal growth. In this work, we use a high angular-resolution electron diffraction method to obtain the first conclusive confirmation that uniform single crystals can be grown inside glass by femtosecond laser writing under optimized conditions. We confirm waveguiding capability and present the first quantitative measurement of power transmission through a laser-written crystal-in-glass waveguide, yielding loss of 2.64 dB/cm at 1530 nm. We demonstrate uniformity of the crystal cross-section down the length of the waveguide and quantify its birefringence. Finally, as a proof-of-concept for patterning more complex device geometries, we demonstrate the use of dynamic phase modulation to grow symmetric crystal junctions with single-pass writing. PMID:25988599

  13. A 3D bioprinting system to produce human-scale tissue constructs with structural integrity.

    PubMed

    Kang, Hyun-Wook; Lee, Sang Jin; Ko, In Kap; Kengla, Carlos; Yoo, James J; Atala, Anthony

    2016-03-01

    A challenge for tissue engineering is producing three-dimensional (3D), vascularized cellular constructs of clinically relevant size, shape and structural integrity. We present an integrated tissue-organ printer (ITOP) that can fabricate stable, human-scale tissue constructs of any shape. Mechanical stability is achieved by printing cell-laden hydrogels together with biodegradable polymers in integrated patterns and anchored on sacrificial hydrogels. The correct shape of the tissue construct is achieved by representing clinical imaging data as a computer model of the anatomical defect and translating the model into a program that controls the motions of the printer nozzles, which dispense cells to discrete locations. The incorporation of microchannels into the tissue constructs facilitates diffusion of nutrients to printed cells, thereby overcoming the diffusion limit of 100-200 μm for cell survival in engineered tissues. We demonstrate capabilities of the ITOP by fabricating mandible and calvarial bone, cartilage and skeletal muscle. Future development of the ITOP is being directed to the production of tissues for human applications and to the building of more complex tissues and solid organs.

  14. Next-generation integrated microfluidic circuits.

    PubMed

    Mosadegh, Bobak; Bersano-Begey, Tommaso; Park, Joong Yull; Burns, Mark A; Takayama, Shuichi

    2011-09-07

    This mini-review provides a brief overview of recent devices that use networks of elastomeric valves to minimize or eliminate the need for interconnections between microfluidic chips and external instruction lines that send flow control signals. Conventional microfluidic control mechanisms convey instruction signals in a parallel manner such that the number of instruction lines must increase as the number of independently operated valves increases. The devices described here circumvent this "tyranny of microfluidic interconnects" by the serial encoding of information to enable instruction of an arbitrary number of independent valves with a set number of control lines, or by the microfluidic circuit-embedded encoding of instructions to eliminate control lines altogether. Because the parallel instruction chips are the most historical and straightforward to design, they are still the most commonly used approach today. As requirements for instruction complexity, chip-to-chip communication, and real-time on-chip feedback flow control arise, the next generation of integrated microfluidic circuits will need to incorporate these latest interconnect flow control approaches.

  15. Test Diagnostics of RF Effects in Integrated Circuits

    DTIC Science & Technology

    1990-02-01

    RADC-TR-89-355 Final Technical Report February 1990AD-A219 737 TEST DIAGNOSTICS OF RF EFFECTS IN INTEGRATED CIRCUITS Martin Marietta Space Systems...DIAGNOSTICS OF RF EFFECTS IN INTEGRATED CIRCUITS 12 PERSONAL AUTHOR(S) David D. Wilson, Stan Epshtein, Mark G. Rossi, Christine L. Proffitt 13a. TYPE...presents "he results of an effort to measure the RF upset susceptibilities of CMOS and low power Schottky integrated circuits and to demonstrate a

  16. Photonic integrated circuits: new challenges for lithography

    NASA Astrophysics Data System (ADS)

    Bolten, Jens; Wahlbrink, Thorsten; Prinzen, Andreas; Porschatis, Caroline; Lerch, Holger; Giesecke, Anna Lena

    2016-10-01

    In this work routes towards the fabrication of photonic integrated circuits (PICs) and the challenges their fabrication poses on lithography, such as large differences in feature dimension of adjacent device features, non-Manhattan-type features, high aspect ratios and significant topographic steps as well as tight lithographic requirements with respect to critical dimension control, line edge roughness and other key figures of merit not only for very small but also for relatively large features, are highlighted. Several ways those challenges are faced in today's low-volume fabrication of PICs, including the concept multi project wafer runs and mix and match approaches, are presented and possible paths towards a real market uptake of PICs are discussed.

  17. Monolithic microwave integrated circuit water vapor radiometer

    NASA Technical Reports Server (NTRS)

    Sukamto, L. M.; Cooley, T. W.; Janssen, M. A.; Parks, G. S.

    1991-01-01

    A proof of concept Monolithic Microwave Integrated Circuit (MMIC) Water Vapor Radiometer (WVR) is under development at the Jet Propulsion Laboratory (JPL). WVR's are used to remotely sense water vapor and cloud liquid water in the atmosphere and are valuable for meteorological applications as well as for determination of signal path delays due to water vapor in the atmosphere. The high cost and large size of existing WVR instruments motivate the development of miniature MMIC WVR's, which have great potential for low cost mass production. The miniaturization of WVR components allows large scale deployment of WVR's for Earth environment and meteorological applications. Small WVR's can also result in improved thermal stability, resulting in improved calibration stability. Described here is the design and fabrication of a 31.4 GHz MMIC radiometer as one channel of a thermally stable WVR as a means of assessing MMIC technology feasibility.

  18. Post irradiation effects (PIE) in integrated circuits

    NASA Technical Reports Server (NTRS)

    Shaw, D. C.; Lowry, L.; Barnes, C.; Zakharia, M.; Agarwal, S.; Rax, B.

    1991-01-01

    Post-irradiation effects (PIE) ranging from normal recovery to catastrophic failure have been observed in integrated circuits during the PIE period. Data presented show failure due to rebound after a 10 krad(Si) dose. In particular, five device types are investigated with varying PIE response. Special attention has been given to the HI1-507A analog multiplexer because its PIE response is extreme. X-ray diffraction has been uniquely employed to measure physical stress in the HI1-507A metallization. An attempt has been made to show a relationship between stress relaxation and radiation effects. All data presented support the current MIL-STD Method 1019.4 but demonstrate the importance of performing PIE measurements, even when mission doses are as low as 10 krad(Si).

  19. Monolithic Lumped Element Integrated Circuit (M2LEIC) Transistors.

    DTIC Science & Technology

    INTEGRATED CIRCUITS, *MONOLITHIC STRUCTURES(ELECTRONICS), *TRANSISTORS, CHIPS(ELECTRONICS), FABRICATION, EPITAXIAL GROWTH, ULTRAHIGH FREQUENCY, POLYSILICONS, PHOTOLITHOGRAPHY, RADIOFREQUENCY POWER, IMPEDANCE MATCHING .

  20. Integrative multicellular biological modeling: a case study of 3D epidermal development using GPU algorithms

    PubMed Central

    2010-01-01

    Background Simulation of sophisticated biological models requires considerable computational power. These models typically integrate together numerous biological phenomena such as spatially-explicit heterogeneous cells, cell-cell interactions, cell-environment interactions and intracellular gene networks. The recent advent of programming for graphical processing units (GPU) opens up the possibility of developing more integrative, detailed and predictive biological models while at the same time decreasing the computational cost to simulate those models. Results We construct a 3D model of epidermal development and provide a set of GPU algorithms that executes significantly faster than sequential central processing unit (CPU) code. We provide a parallel implementation of the subcellular element method for individual cells residing in a lattice-free spatial environment. Each cell in our epidermal model includes an internal gene network, which integrates cellular interaction of Notch signaling together with environmental interaction of basement membrane adhesion, to specify cellular state and behaviors such as growth and division. We take a pedagogical approach to describing how modeling methods are efficiently implemented on the GPU including memory layout of data structures and functional decomposition. We discuss various programmatic issues and provide a set of design guidelines for GPU programming that are instructive to avoid common pitfalls as well as to extract performance from the GPU architecture. Conclusions We demonstrate that GPU algorithms represent a significant technological advance for the simulation of complex biological models. We further demonstrate with our epidermal model that the integration of multiple complex modeling methods for heterogeneous multicellular biological processes is both feasible and computationally tractable using this new technology. We hope that the provided algorithms and source code will be a starting point for modelers to

  1. Integrated photo-responsive metal oxide semiconductor circuit

    NASA Technical Reports Server (NTRS)

    Jhabvala, Murzban D. (Inventor); Dargo, David R. (Inventor); Lyons, John C. (Inventor)

    1987-01-01

    An infrared photoresponsive element (RD) is monolithically integrated into a source follower circuit of a metal oxide semiconductor device by depositing a layer of a lead chalcogenide as a photoresistive element forming an ohmic bridge between two metallization strips serving as electrodes of the circuit. Voltage from the circuit varies in response to illumination of the layer by infrared radiation.

  2. W88 integrated circuit shelf life program

    SciTech Connect

    Soden, J.M.; Anderson, R.E.

    1998-01-01

    The W88 Integrated Circuit Shelf Life Program was created to monitor the long term performance, reliability characteristics, and technological status of representative WR ICs manufactured by the Allied Signal Albuquerque Microelectronics Operation (AMO) and by Harris Semiconductor Custom Integrated Circuits Division. Six types of ICs were used. A total of 272 ICs entered two storage temperature environments. Electrical testing and destructive physical analysis were completed in 1995. During each year of the program, the ICs were electrically tested and samples were selected for destructive physical analysis (DPA). ICs that failed electrical tests or DPA criteria were analyzed. Fifteen electrical failures occurred, with two dominant failure modes: electrical overstress (EOS) damage involving the production test programs and electrostatic discharge (ESD) damage during analysis. Because of the extensive handling required during multi-year programs like this, it is not unusual for EOS and ESD failures to occur even though handling and testing precautions are taken. The clustering of the electrical test failures in a small subset of the test operations supports the conclusion that the test operation itself was responsible for many of the failures and is suspected to be responsible for the others. Analysis of the electrical data for the good ICs found no significant degradation trends caused by the storage environments. Forty-six ICs were selected for DPA with findings primarily in two areas: wire bonding and die processing. The wire bonding and die processing findings are not surprising since these technology conditions had been documented during manufacturing and were determined to present acceptable risk. The current reliability assessment of the W88 stockpile assemblies employing these and related ICs is reinforced by the results of this shelf life program. Data from this program will aid future investigation of 4/3 micron or MNOS IC technology failure modes.

  3. Surgical Navigation Technology Based on Augmented Reality and Integrated 3D Intraoperative Imaging

    PubMed Central

    Elmi-Terander, Adrian; Skulason, Halldor; Söderman, Michael; Racadio, John; Homan, Robert; Babic, Drazenko; van der Vaart, Nijs; Nachabe, Rami

    2016-01-01

    Study Design. A cadaveric laboratory study. Objective. The aim of this study was to assess the feasibility and accuracy of thoracic pedicle screw placement using augmented reality surgical navigation (ARSN). Summary of Background Data. Recent advances in spinal navigation have shown improved accuracy in lumbosacral pedicle screw placement but limited benefits in the thoracic spine. 3D intraoperative imaging and instrument navigation may allow improved accuracy in pedicle screw placement, without the use of x-ray fluoroscopy, and thus opens the route to image-guided minimally invasive therapy in the thoracic spine. Methods. ARSN encompasses a surgical table, a motorized flat detector C-arm with intraoperative 2D/3D capabilities, integrated optical cameras for augmented reality navigation, and noninvasive patient motion tracking. Two neurosurgeons placed 94 pedicle screws in the thoracic spine of four cadavers using ARSN on one side of the spine (47 screws) and free-hand technique on the contralateral side. X-ray fluoroscopy was not used for either technique. Four independent reviewers assessed the postoperative scans, using the Gertzbein grading. Morphometric measurements of the pedicles axial and sagittal widths and angles, as well as the vertebrae axial and sagittal rotations were performed to identify risk factors for breaches. Results. ARSN was feasible and superior to free-hand technique with respect to overall accuracy (85% vs. 64%, P < 0.05), specifically significant increases of perfectly placed screws (51% vs. 30%, P < 0.05) and reductions in breaches beyond 4 mm (2% vs. 25%, P < 0.05). All morphometric dimensions, except for vertebral body axial rotation, were risk factors for larger breaches when performed with the free-hand method. Conclusion. ARSN without fluoroscopy was feasible and demonstrated higher accuracy than free-hand technique for thoracic pedicle screw placement. Level of Evidence: N/A PMID:27513166

  4. Superresolution of 3-D computational integral imaging based on moving least square method.

    PubMed

    Kim, Hyein; Lee, Sukho; Ryu, Taekyung; Yoon, Jungho

    2014-11-17

    In this paper, we propose an edge directive moving least square (ED-MLS) based superresolution method for computational integral imaging reconstruction(CIIR). Due to the low resolution of the elemental images and the alignment error of the microlenses, it is not easy to obtain an accurate registration result in integral imaging, which makes it difficult to apply superresolution to the CIIR application. To overcome this problem, we propose the edge directive moving least square (ED-MLS) based superresolution method which utilizes the properties of the moving least square. The proposed ED-MLS based superresolution takes the direction of the edge into account in the moving least square reconstruction to deal with the abrupt brightness changes in the edge regions, and is less sensitive to the registration error. Furthermore, we propose a framework which shows how the data have to be collected for the superresolution problem in the CIIR application. Experimental results verify that the resolution of the elemental images is enhanced, and that a high resolution reconstructed 3-D image can be obtained with the proposed method.

  5. Ge/Si Integrated Circuit For Infrared Imaging

    NASA Technical Reports Server (NTRS)

    Fathauer, Robert W.

    1990-01-01

    Proposed integrated circuit consists of focal-plane array of metal/germanium Schottky-barrier photodetectors on same chip with silicon-based circuits that processes signals from photodetectors. Made compatible with underlying silicon-based circuitry by growing germanium epitaxially on silicon circuit wafers. Metal deposited in ultrahigh vacuum immediately after growth of germanium. Combination of described techniques results in high-resolution infrared-imaging circuits of superior performance.

  6. NFkB disrupts tissue polarity in 3D by preventing integration of microenvironmental signals

    PubMed Central

    Xiong, Gaofeng; Furuta, Saori; Han, Ju; Kuhn, Irene; Akavia, Uri-David; Pe'er, Dana; Bissell, Mina J

    2013-01-01

    The microenvironment of cells controls their phenotype, and thereby the architecture of the emerging multicellular structure or tissue. We have reported more than a dozen microenvironmental factors whose signaling must be integrated in order to effect an organized, functional tissue morphology. However, the factors that prevent integration of signaling pathways that merge form and function are still largely unknown. We have identified nuclear factor kappa B (NFkB) as a transcriptional regulator that disrupts important microenvironmental cues necessary for tissue organization. We compared the gene expression of organized and disorganized epithelial cells of the HMT-3522 breast cancer progression series: the non-malignant S1 cells that form polarized spheres (‘acini’), the malignant T4-2 cells that form large tumor-like clusters, and the ‘phenotypically reverted’ T4-2 cells that polarize as a result of correction of the microenvironmental signaling. We identified 180 genes that display an increased expression in disorganized compared to polarized structures. Network, GSEA and transcription factor binding site analyses suggested that NFkB is a common activator for the 180 genes. NFkB was found to be activated in disorganized breast cancer cells, and inhibition of microenvironmental signaling via EGFR, beta1 integrin, MMPs, or their downstream signals suppressed its activation. The postulated role of NFkB was experimentally verified: Blocking the NFkB pathway with a specific chemical inhibitor or shRNA induced polarization and inhibited invasion of breast cancer cells in 3D cultures. These results may explain why NFkB holds promise as a target for therapeutic intervention: Its inhibition can reverse the oncogenic signaling involved in breast cancer progression and integrate the essential microenvironmental control of tissue architecture. PMID:24243820

  7. Integrating 3D geological information with a national physically-based hydrological modelling system

    NASA Astrophysics Data System (ADS)

    Lewis, Elizabeth; Parkin, Geoff; Kessler, Holger; Whiteman, Mark

    2016-04-01

    Robust numerical models are an essential tool for informing flood and water management and policy around the world. Physically-based hydrological models have traditionally not been used for such applications due to prohibitively large data, time and computational resource requirements. Given recent advances in computing power and data availability, a robust, physically-based hydrological modelling system for Great Britain using the SHETRAN model and national datasets has been created. Such a model has several advantages over less complex systems. Firstly, compared with conceptual models, a national physically-based model is more readily applicable to ungauged catchments, in which hydrological predictions are also required. Secondly, the results of a physically-based system may be more robust under changing conditions such as climate and land cover, as physical processes and relationships are explicitly accounted for. Finally, a fully integrated surface and subsurface model such as SHETRAN offers a wider range of applications compared with simpler schemes, such as assessments of groundwater resources, sediment and nutrient transport and flooding from multiple sources. As such, SHETRAN provides a robust means of simulating numerous terrestrial system processes which will add physical realism when coupled to the JULES land surface model. 306 catchments spanning Great Britain have been modelled using this system. The standard configuration of this system performs satisfactorily (NSE > 0.5) for 72% of catchments and well (NSE > 0.7) for 48%. Many of the remaining 28% of catchments that performed relatively poorly (NSE < 0.5) are located in the chalk in the south east of England. As such, the British Geological Survey 3D geology model for Great Britain (GB3D) has been incorporated, for the first time in any hydrological model, to pave the way for improvements to be made to simulations of catchments with important groundwater regimes. This coupling has involved

  8. The integration of 3-D cell printing and mesoscopic fluorescence molecular tomography of vascular constructs within thick hydrogel scaffolds.

    PubMed

    Zhao, Lingling; Lee, Vivian K; Yoo, Seung-Schik; Dai, Guohao; Intes, Xavier

    2012-07-01

    Developing methods that provide adequate vascular perfusion is an important step toward engineering large functional tissues. Meanwhile, an imaging modality to assess the three-dimensional (3-D) structures and functions of the vascular channels is lacking for thick matrices (>2 ≈ 3 mm). Herein, we report on an original approach to construct and image 3-D dynamically perfused vascular structures in thick hydrogel scaffolds. In this work, we integrated a robotic 3-D cell printing technology with a mesoscopic fluorescence molecular tomography imaging system, and demonstrated the capability of the platform to construct perfused collagen scaffolds with endothelial lining and to image both the fluid flow and fluorescent-labeled living endothelial cells at high-frame rates, with high sensitivity and accuracy. These results establish the potential of integrating both 3-D cell printing and fluorescence mesoscopic imaging for functional and molecular studies in complex tissue-engineered tissues.

  9. Shielded silicon gate complementary MOS integrated circuit.

    NASA Technical Reports Server (NTRS)

    Lin, H. C.; Halsor, J. L.; Hayes, P. J.

    1972-01-01

    An electrostatic shield for complementary MOS integrated circuits was developed to minimize the adverse effects of stray electric fields created by the potentials in the metal interconnections. The process is compatible with silicon gate technology. N-doped polycrystalline silicon was used for all the gates and the shield. The effectiveness of the shield was demonstrated by constructing a special field plate over certain transistors. The threshold voltages obtained on an oriented silicon substrate ranged from 1.5 to 3 V for either channel. Integrated inverters performed satisfactorily from 3 to 15 V, limited at the low end by the threshold voltages and at the high end by the drain breakdown voltage of the n-channel transistors. The stability of the new structure with an n-doped silicon gate as measured by the shift in C-V curve under 200 C plus or minus 20 V temperature-bias conditions was better than conventional aluminum gate or p-doped silicon gate devices, presumably due to the doping of gate oxide with phosphorous.

  10. Laser Scanning Holographic Lithography for Flexible 3D Fabrication of Multi-Scale Integrated Nano-structures and Optical Biosensors.

    PubMed

    Yuan, Liang Leon; Herman, Peter R

    2016-02-29

    Three-dimensional (3D) periodic nanostructures underpin a promising research direction on the frontiers of nanoscience and technology to generate advanced materials for exploiting novel photonic crystal (PC) and nanofluidic functionalities. However, formation of uniform and defect-free 3D periodic structures over large areas that can further integrate into multifunctional devices has remained a major challenge. Here, we introduce a laser scanning holographic method for 3D exposure in thick photoresist that combines the unique advantages of large area 3D holographic interference lithography (HIL) with the flexible patterning of laser direct writing to form both micro- and nano-structures in a single exposure step. Phase mask interference patterns accumulated over multiple overlapping scans are shown to stitch seamlessly and form uniform 3D nanostructure with beam size scaled to small 200 μm diameter. In this way, laser scanning is presented as a facile means to embed 3D PC structure within microfluidic channels for integration into an optofluidic lab-on-chip, demonstrating a new laser HIL writing approach for creating multi-scale integrated microsystems.

  11. Laser Scanning Holographic Lithography for Flexible 3D Fabrication of Multi-Scale Integrated Nano-structures and Optical Biosensors

    NASA Astrophysics Data System (ADS)

    Yuan, Liang (Leon); Herman, Peter R.

    2016-02-01

    Three-dimensional (3D) periodic nanostructures underpin a promising research direction on the frontiers of nanoscience and technology to generate advanced materials for exploiting novel photonic crystal (PC) and nanofluidic functionalities. However, formation of uniform and defect-free 3D periodic structures over large areas that can further integrate into multifunctional devices has remained a major challenge. Here, we introduce a laser scanning holographic method for 3D exposure in thick photoresist that combines the unique advantages of large area 3D holographic interference lithography (HIL) with the flexible patterning of laser direct writing to form both micro- and nano-structures in a single exposure step. Phase mask interference patterns accumulated over multiple overlapping scans are shown to stitch seamlessly and form uniform 3D nanostructure with beam size scaled to small 200 μm diameter. In this way, laser scanning is presented as a facile means to embed 3D PC structure within microfluidic channels for integration into an optofluidic lab-on-chip, demonstrating a new laser HIL writing approach for creating multi-scale integrated microsystems.

  12. Laser Scanning Holographic Lithography for Flexible 3D Fabrication of Multi-Scale Integrated Nano-structures and Optical Biosensors

    PubMed Central

    Yuan, Liang (Leon); Herman, Peter R.

    2016-01-01

    Three-dimensional (3D) periodic nanostructures underpin a promising research direction on the frontiers of nanoscience and technology to generate advanced materials for exploiting novel photonic crystal (PC) and nanofluidic functionalities. However, formation of uniform and defect-free 3D periodic structures over large areas that can further integrate into multifunctional devices has remained a major challenge. Here, we introduce a laser scanning holographic method for 3D exposure in thick photoresist that combines the unique advantages of large area 3D holographic interference lithography (HIL) with the flexible patterning of laser direct writing to form both micro- and nano-structures in a single exposure step. Phase mask interference patterns accumulated over multiple overlapping scans are shown to stitch seamlessly and form uniform 3D nanostructure with beam size scaled to small 200 μm diameter. In this way, laser scanning is presented as a facile means to embed 3D PC structure within microfluidic channels for integration into an optofluidic lab-on-chip, demonstrating a new laser HIL writing approach for creating multi-scale integrated microsystems. PMID:26922872

  13. 1-D, 2-D and 3-D Negative-Refraction Metamaterials at Optical Frequencies: Optical Nano-Transmission-Line and Circuit Theory

    NASA Astrophysics Data System (ADS)

    Engheta, Nader; Alu, Andrea

    2006-03-01

    In recent years metamaterials have offered new possibilities for overcoming some of the intrinsic limitations in wave propagation. Their realization at microwave frequencies has followed two different paths; one consisting of embedding resonant inclusions in a host dielectric, and the other following a transmission-line approach, i.e., building 1-D, 2-D, or 3-D cascades of circuit elements, respectively, as linear, planar or bulk right- or left-handed metamaterials. The latter is known to provide larger bandwidth and better robustness to ohmic losses. Extending these concepts to optical frequencies is a challenging task, due to changes in material response to electromagnetic waves at these frequencies. However, recently we have studied theoretically how it may be possible to have circuit nano-elements at these frequencies by properly exploiting plasmonic resonances. Here we present our theoretical work on translating the circuit concepts of right- and left-handed metamaterials into optical frequencies by applying the analogy between nanoparticles and nanocircuit elements in transmission lines. We discuss how it is possible to synthesize optical negative-refraction metamaterials by properly cascading plasmonic and non-plasmonic elements in 1-D, 2-D and 3-D geometries.

  14. Development of 3-D Mechanical Models of Electric Circuits and Their Effect on Students' Understanding of Electric Potential Difference

    ERIC Educational Resources Information Center

    Balta, Nuri

    2015-01-01

    Visualizing physical concepts through models is an essential method in many sciences. While students are mostly proficient in handling mathematical aspects of problems, they frequently lack the ability to visualize and interpret abstract physical concepts in a meaningful way. In this paper, initially the electric circuits and related concepts were…

  15. GaAs Optoelectronic Integrated-Circuit Neurons

    NASA Technical Reports Server (NTRS)

    Lin, Steven H.; Kim, Jae H.; Psaltis, Demetri

    1992-01-01

    Monolithic GaAs optoelectronic integrated circuits developed for use as artificial neurons. Neural-network computer contains planar arrays of optoelectronic neurons, and variable synaptic connections between neurons effected by diffraction of light from volume hologram in photorefractive material. Basic principles of neural-network computers explained more fully in "Optoelectronic Integrated Circuits For Neural Networks" (NPO-17652). In present circuits, devices replaced by metal/semiconductor field effect transistors (MESFET's), which consume less power.

  16. Swarm Intelligence Integrated Graph-Cut for Liver Segmentation from 3D-CT Volumes

    PubMed Central

    Eapen, Maya; Korah, Reeba; Geetha, G.

    2015-01-01

    The segmentation of organs in CT volumes is a prerequisite for diagnosis and treatment planning. In this paper, we focus on liver segmentation from contrast-enhanced abdominal CT volumes, a challenging task due to intensity overlapping, blurred edges, large variability in liver shape, and complex background with cluttered features. The algorithm integrates multidiscriminative cues (i.e., prior domain information, intensity model, and regional characteristics of liver in a graph-cut image segmentation framework). The paper proposes a swarm intelligence inspired edge-adaptive weight function for regulating the energy minimization of the traditional graph-cut model. The model is validated both qualitatively (by clinicians and radiologists) and quantitatively on publically available computed tomography (CT) datasets (MICCAI 2007 liver segmentation challenge, 3D-IRCAD). Quantitative evaluation of segmentation results is performed using liver volume calculations and a mean score of 80.8% and 82.5% on MICCAI and IRCAD dataset, respectively, is obtained. The experimental result illustrates the efficiency and effectiveness of the proposed method. PMID:26689833

  17. Mercury Lightcraft Project Update: 3-D Modeling, Systems Analysis and Integration

    NASA Astrophysics Data System (ADS)

    Buckton, Thomas W.; Myrabo, Leik N.

    2005-04-01

    This paper is a progress report on the laser-propelled Mercury Lightcraft Project at Rensselaer Polytechnic Institute. The laser-propelled, 1-person craft has a diameter of 252-cm, height of 217-cm, internal volume of 3 m3, `dry' mass of 700 kg, and gross liftoff mass of 1 metric ton. Expendable liquids including 70 kg of liquid hydrogen, and an equivalent mass (at least) of de-ionized water serves as open-cycle coolants for the 520 MWe laser/electric power conversion system. Its hyper-energetic airbreathing engine can easily accelerate the vehicle at 10 Gs or more. The tractor-beam lightcraft is intended as a prototype for use in a future global aerospace transportation system based on a constellation of satellite solar power stations in geostationary orbit, with laser relay stations in low Earth orbit. Using SolidWorks® 3-D modeling software, several important features were successfully integrated into the Mercury lightcraft model - principally: a rotating shroud (for spin stabilization) simple actuation system for a new variable-geometry air inlet; refined optical train for the laser-heated H2 plasma generators; pneumatically deployed, robotic quadra-pod landing gear; ejection seat/pod/hatch system; and a more detailed airframe structural concept. The CAD effort has brought the Mercury Lightcraft concept one significant step closer to reality.

  18. The RCSB protein data bank: integrative view of protein, gene and 3D structural information

    PubMed Central

    Rose, Peter W.; Prlić, Andreas; Altunkaya, Ali; Bi, Chunxiao; Bradley, Anthony R.; Christie, Cole H.; Costanzo, Luigi Di; Duarte, Jose M.; Dutta, Shuchismita; Feng, Zukang; Green, Rachel Kramer; Goodsell, David S.; Hudson, Brian; Kalro, Tara; Lowe, Robert; Peisach, Ezra; Randle, Christopher; Rose, Alexander S.; Shao, Chenghua; Tao, Yi-Ping; Valasatava, Yana; Voigt, Maria; Westbrook, John D.; Woo, Jesse; Yang, Huangwang; Young, Jasmine Y.; Zardecki, Christine; Berman, Helen M.; Burley, Stephen K.

    2017-01-01

    The Research Collaboratory for Structural Bioinformatics Protein Data Bank (RCSB PDB, http://rcsb.org), the US data center for the global PDB archive, makes PDB data freely available to all users, from structural biologists to computational biologists and beyond. New tools and resources have been added to the RCSB PDB web portal in support of a ‘Structural View of Biology.’ Recent developments have improved the User experience, including the high-speed NGL Viewer that provides 3D molecular visualization in any web browser, improved support for data file download and enhanced organization of website pages for query, reporting and individual structure exploration. Structure validation information is now visible for all archival entries. PDB data have been integrated with external biological resources, including chromosomal position within the human genome; protein modifications; and metabolic pathways. PDB-101 educational materials have been reorganized into a searchable website and expanded to include new features such as the Geis Digital Archive. PMID:27794042

  19. Liquid immersion thermal crosslinking of 3D polymer nanopatterns for direct carbonisation with high structural integrity

    PubMed Central

    Kang, Da-Young; Kim, Cheolho; Park, Gyurim; Moon, Jun Hyuk

    2015-01-01

    The direct pyrolytic carbonisation of polymer patterns has attracted interest for its use in obtaining carbon materials. In the case of carbonisation of nanopatterned polymers, the polymer flow and subsequent pattern change may occur in order to relieve their high surface energies. Here, we demonstrated that liquid immersion thermal crosslinking of polymer nanopatterns effectively enhanced the thermal resistance and maintained the structure integrity during the heat treatment. We employed the liquid immersion thermal crosslinking for 3D porous SU8 photoresist nanopatterns and successfully converted them to carbon nanopatterns while maintaining their porous features. The thermal crosslinking reaction and carbonisation of SU8 nanopatterns were characterised. The micro-crystallinity of the SU8-derived carbon nanopatterns was also characterised. The liquid immersion heat treatment can be extended to the carbonisation of various polymer or photoresist nanopatterns and also provide a facile way to control the surface energy of polymer nanopatterns for various purposes, for example, to block copolymer or surfactant self-assemblies. PMID:26677949

  20. From 3D Bioprinters to a fully integrated Organ Biofabrication Line

    NASA Astrophysics Data System (ADS)

    Passamai, V. E.; Dernowsek, J. A.; Nogueira, J.; Lara, V.; Vilalba, F.; Mironov, V. A.; Rezende, R. A.; da Silva, J. V.

    2016-04-01

    About 30 years ago, the 3D printing technique appeared. From that time on, engineers in medical science field started to look at 3D printing as a partner. Firstly, biocompatible and biodegradable 3D structures for cell seeding called “scaffolds” were fabricated for in vitro and in vivo animal trials. The advances proved to be of great importance, but, the use of scaffolds faces some limitations, such as low homogeneity and low density of cell aggregates. In the last decade, 3D bioprinting technology emerged as a promising approach to overcome these limitations and as one potential solution to the challenge of organ fabrication, to obtain very similar 3D human tissues, not only for transplantation, but also for drug discovery, disease research and to decrease the usage of animals in laboratory experimentation. 3D bioprinting allowed the fabrication of 3D alive structures with higher and controllable cell density and homogeneity. Other advantage of biofabrication is that the tissue constructs are solid scaffold-free. This paper presents the 3D bioprinting technology; equipment development, stages and components of a complex Organ Bioprinting Line (OBL) and the importance of developing a Virtual OBL.

  1. Automatic visual inspection of integrated circuits using an SEM

    SciTech Connect

    Kayaalp, A.E.

    1988-01-01

    The author investigates the complex problem of designing an integrated-circuit inspection system that will be used in controlling an automated semiconductor manufacturing facility. To satisfy the accuracy requirements, he proposes a system that integrates information supplied by multiple intelligent (virtual) sensors. Most of his work concentrated on the design of two scanning-electron-microscope (SEM)-based, intelligent sensors. One of them extracts 3D IC surface-topography information using computer stereo-vision techniques, and the other identifies shape defects in IC patterns using the IC design file as the reference. Both of these problems are viewed as constrained contour-matching problems. In stereo matching, feature contours extracted from the left and right stereo images are matched, where in pattern-shape inspection, pattern boundary contours extracted from the image and the IC design file are matched. An optimization technique is presented for solving the matching problem that results in both cases. This general approach simplifies the task of transforming the specifications of a physical problem into a computational form and results in a modular system.

  2. A polymer-based Fabry-Perot filter integrated with 3-D MEMS structures

    NASA Astrophysics Data System (ADS)

    Zhang, Ping (Cerina); Le, Kevin; Malalur-Nagaraja-Rao, Smitha; Hsu, Lun-Chen; Chiao, J.-C.

    2006-01-01

    Polymers have been considered as one of the most versatile materials in making optical devices for communication and sensor applications. They provide good optical transparency to form filters, lenses and many optical components with ease of fabrication. They are scalable and compatible in dimensions with requirements in optics and can be fabricated on inorganic substrates, such as silicon and quartz. Recent polymer synthesis also made great progresses on conductive and nonlinear polymers, opening opportunities for new applications. In this paper, we discussed hybrid-material integration of polymers on silicon-based microelectromechanical system (MEMS) devices. The motivation is to combine the advantages of demonstrated silicon-based MEMS actuators and excellent optical performance of polymers. We demonstrated the idea with a polymer-based out-of-plane Fabry-Perot filter that can be self-assembled by scratch drive actuators. We utilized a fabrication foundry service, MUMPS (Multi-User MEMS Process), to demonstrate the feasibility and flexibility of integration. The polysilicon, used as the structural material for construction of 3-D framework and actuators, has high absorption in the visible and near infrared ranges. Therefore, previous efforts using a polysilicon layer as optical interfaces suffer from high losses. We applied the organic compound materials on the silicon-based framework within the optical signal propagation path to form the optical interfaces. In this paper, we have shown low losses in the optical signal processing and feasibility of building a thin-film Fabry-Perot filter. We discussed the optical filter designs, mechanical design, actuation mechanism, fabrication issues, optical measurements, and results.

  3. Integrated Idl Tool For 3d Modeling And Imaging Data Analysis

    NASA Astrophysics Data System (ADS)

    Nita, Gelu M.; Fleishman, G. D.; Gary, D. E.; Kuznetsov, A. A.; Kontar, E. P.

    2012-05-01

    Addressing many key problems in solar physics requires detailed analysis of non-simultaneous imaging data obtained in various wavelength domains with different spatial resolution and their comparison with each other supplied by advanced 3D physical models. To facilitate achieving this goal, we have undertaken a major enhancement and improvements of IDL-based simulation tools developed earlier for modeling microwave and X-ray emission. The greatly enhanced object-based architecture provides interactive graphic user interface that allows the user i) to import photospheric magnetic field maps and perform magnetic field extrapolations to almost instantly generate 3D magnetic field models, ii) to investigate the magnetic topology of these models by interactively creating magnetic field lines and associated magnetic field tubes, iii) to populate them with user-defined nonuniform thermal plasma and anisotropic nonuniform nonthermal electron distributions; and iv) to calculate the spatial and spectral properties of radio and X-ray emission. The application integrates DLL and Shared Libraries containing fast gyrosynchrotron emission codes developed in FORTRAN and C++, soft and hard X-ray codes developed in IDL, and a potential field extrapolation DLL produced based on original FORTRAN code developed by V. Abramenko and V. Yurchishin. The interactive interface allows users to add any user-defined IDL or external callable radiation code, as well as user-defined magnetic field extrapolation routines. To illustrate the tool capabilities, we present a step-by-step live computation of microwave and X-ray images from realistic magnetic structures obtained from a magnetic field extrapolation preceding a real event, and compare them with the actual imaging data produced by NORH and RHESSI instruments. This work was supported in part by NSF grants AGS-0961867, AST-0908344, AGS-0969761, and NASA grants NNX10AF27G and NNX11AB49G to New Jersey Institute of Technology, by a UK STFC

  4. Securing health sensing using integrated circuit metric.

    PubMed

    Tahir, Ruhma; Tahir, Hasan; McDonald-Maier, Klaus

    2015-10-20

    Convergence of technologies from several domains of computing and healthcare have aided in the creation of devices that can help health professionals in monitoring their patients remotely. An increase in networked healthcare devices has resulted in incidents related to data theft, medical identity theft and insurance fraud. In this paper, we discuss the design and implementation of a secure lightweight wearable health sensing system. The proposed system is based on an emerging security technology called Integrated Circuit Metric (ICMetric) that extracts the inherent features of a device to generate a unique device identification. In this paper, we provide details of how the physical characteristics of a health sensor can be used for the generation of hardware "fingerprints". The obtained fingerprints are used to deliver security services like authentication, confidentiality, secure admission and symmetric key generation. The generated symmetric key is used to securely communicate the health records and data of the patient. Based on experimental results and the security analysis of the proposed scheme, it is apparent that the proposed system enables high levels of security for health monitoring in resource optimized manner.

  5. Optical Integrated Circuits Theory and Design

    NASA Astrophysics Data System (ADS)

    Li, Xiangshan

    1995-01-01

    The first part of this work describes the main theory required for the analysis and design of optical integrated circuits which have the purpose of processing light signals carried on fiber optic cables. For ease of fabrication it is advantageous to design the light processing channels in a planar geometry. The analysis of the resulting dielectric structures requires computations of both the propagation constants of the modes of the structures and the inherent energy losses resulting from the geometry of the light guiding channels. The latter losses have two primary sources, (1) radiation losses due to leakage out of the guiding channels into the supporting substrates, and (2) curvature losses due to the necessary bending of the guiding channels required to separate the light signals. The results of this work is a computer program for the design of a computer generated CAD lithographic mask that can be used to fabricate a multiple channel waveguiding structure capable of dividing an input light signal into a set number of output channels carrying designated fractions of the input energy. In the last part of this thesis we then apply the theory developed in first part to the design of a TE -TM polarization splitter. The resulting design represents an improvement over previous design suggested by other groups, and makes it possible to obtain a nearly 100% separation between the two orthogonal polarization states of the fields in a waveguide. All of the work of this thesis has potential applications in the construction of the superhighway.

  6. Securing Health Sensing Using Integrated Circuit Metric

    PubMed Central

    Tahir, Ruhma; Tahir, Hasan; McDonald-Maier, Klaus

    2015-01-01

    Convergence of technologies from several domains of computing and healthcare have aided in the creation of devices that can help health professionals in monitoring their patients remotely. An increase in networked healthcare devices has resulted in incidents related to data theft, medical identity theft and insurance fraud. In this paper, we discuss the design and implementation of a secure lightweight wearable health sensing system. The proposed system is based on an emerging security technology called Integrated Circuit Metric (ICMetric) that extracts the inherent features of a device to generate a unique device identification. In this paper, we provide details of how the physical characteristics of a health sensor can be used for the generation of hardware “fingerprints”. The obtained fingerprints are used to deliver security services like authentication, confidentiality, secure admission and symmetric key generation. The generated symmetric key is used to securely communicate the health records and data of the patient. Based on experimental results and the security analysis of the proposed scheme, it is apparent that the proposed system enables high levels of security for health monitoring in resource optimized manner. PMID:26492250

  7. Ultraviolet integrated photonic circuits (Conference Presentation)

    NASA Astrophysics Data System (ADS)

    Fanto, Michael L.; Steidle, Jeffrey A.; Lu, Tsung-Ju; Preble, Stefan F.; Englund, Dirk R.; Tison, Christopher C.; Smith, Amos M.; Howland, Gregory A.; Soderberg, Kathy-Anne; Alsing, Paul M.

    2016-10-01

    Quantum information processing relies on the fundamental property of quantum interference, where the quality of the interference directly correlates to the indistinguishability of the interacting particles. The creation of these indistinguishable particles, photons in this case, has conventionally been accomplished with nonlinear crystals and optical filters to remove spectral distinguishability, albeit sacrificing the number of photons. This research describes the use of an integrated aluminum nitride microring resonator circuit to selectively generate photon pairs at the narrow cavity transmissions, thereby producing spectrally indistinguishable photons. These spectrally indistinguishable photons can then be routed through optical waveguide circuitry, concatenated interferometers, to manipulate and entangle the photons into the desired quantum states. Photon sources and circuitry are only two of the three required pieces of the puzzle. The final piece which this research is aimed at interfacing with are trapped ion quantum memories, based on trapped Ytterbium ions. These ions serve as very long lived and stable quantum memories with storage times on the order of 10's of minutes, compared with photonic quantum memories which are limited to 10-6 to 10-3 seconds. The caveat with trapped ions is the interaction wavelength of the photons is 369.5nm and therefore the goal of this research is to develop entangled photon sources and circuitry in that wavelength regime to interact directly with the trapped ions and bypass the need for frequency conversion.

  8. Interferometry based multispectral photon-limited 2D and 3D integral image encryption employing the Hartley transform.

    PubMed

    Muniraj, Inbarasan; Guo, Changliang; Lee, Byung-Geun; Sheridan, John T

    2015-06-15

    We present a method of securing multispectral 3D photon-counted integral imaging (PCII) using classical Hartley Transform (HT) based encryption by employing optical interferometry. This method has the simultaneous advantages of minimizing complexity by eliminating the need for holography recording and addresses the phase sensitivity problem encountered when using digital cameras. These together with single-channel multispectral 3D data compactness, the inherent properties of the classical photon counting detection model, i.e. sparse sensing and the capability for nonlinear transformation, permits better authentication of the retrieved 3D scene at various depth cues. Furthermore, the proposed technique works for both spatially and temporally incoherent illumination. To validate the proposed technique simulations were carried out for both the 2D and 3D cases. Experimental data is processed and the results support the feasibility of the encryption method.

  9. Full parallax viewing-angle enhanced computer-generated holographic 3D display system using integral lens array.

    PubMed

    Choi, Kyongsik; Kim, Joohwan; Lim, Yongjun; Lee, Byoungho

    2005-12-26

    A novel full parallax and viewing-angle enhanced computer-generated holographic (CGH) three-dimensional (3D) display system is proposed and implemented by combining an integral lens array and colorized synthetic phase holograms displayed on a phase-type spatial light modulator. For analyzing the viewing-angle limitations of our CGH 3D display system, we provide some theoretical background and introduce a simple ray-tracing method for 3D image reconstruction. From our method we can get continuously varying full parallax 3D images with the viewing angle about +/-6 degrees . To design the colorized phase holograms, we used a modified iterative Fourier transform algorithm and we could obtain a high diffraction efficiency (~92.5%) and a large signal-to-noise ratio (~11dB) from our simulation results. Finally we show some experimental results that verify our concept and demonstrate the full parallax viewing-angle enhanced color CGH display system.

  10. Parallel robot for micro assembly with integrated innovative optical 3D-sensor

    NASA Astrophysics Data System (ADS)

    Hesselbach, Juergen; Ispas, Diana; Pokar, Gero; Soetebier, Sven; Tutsch, Rainer

    2002-10-01

    Recent advances in the fields of MEMS and MOEMS often require precise assembly of very small parts with an accuracy of a few microns. In order to meet this demand, a new approach using a robot based on parallel mechanisms in combination with a novel 3D-vision system has been chosen. The planar parallel robot structure with 2 DOF provides a high resolution in the XY-plane. It carries two additional serial axes for linear and rotational movement in/about z direction. In order to achieve high precision as well as good dynamic capabilities, the drive concept for the parallel (main) axes incorporates air bearings in combination with a linear electric servo motors. High accuracy position feedback is provided by optical encoders with a resolution of 0.1 μm. To allow for visualization and visual control of assembly processes, a camera module fits into the hollow tool head. It consists of a miniature CCD camera and a light source. In addition a modular gripper support is integrated into the tool head. To increase the accuracy a control loop based on an optoelectronic sensor will be implemented. As a result of an in-depth analysis of different approaches a photogrammetric system using one single camera and special beam-splitting optics was chosen. A pattern of elliptical marks is applied to the surfaces of workpiece and gripper. Using a model-based recognition algorithm the image processing software identifies the gripper and the workpiece and determines their relative position. A deviation vector is calculated and fed into the robot control to guide the gripper.

  11. Evaluation of AN Integrated Gis-Based Crime Analysis & 3d Modelling for Izmir-Konak Municipality

    NASA Astrophysics Data System (ADS)

    Tarhan, C.; Deniz, D.

    2011-08-01

    GIS integrated 3D modelling is crucial for the city planning and design processes because urban modelling is a tool used in virtual environments, and provides convenience to work. Although, the creation and display of 3D city models for large regions is difficult it is vital for planning and designing safer cities, as well as public places. Today, crime is a significant problem in Turkey. When it was compared by years of crime rates, population growth and urbanization rate, an increasing more than in parallel has been observed. This paper aims to discuss GIS integrated 3D modelling affects in urban planning and design, explaining Turkish planning processes with GIS and 3D modelling. To do that, it presents a case study for Izmir Konak Municipality about GIS integrated crime analysis and 3D models of the crime scenes. Izmir crime records has been obtained from Izmir Police Department belonging to 2003-2004 and 2005 (D. Deniz, 2007) are used for districts' crime map. In the light of these data, the highest rate crime district, Konak, is analyzed between 2001 and 2005 data.

  12. A Tandem Coupler for Terahertz Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Reck, Theodore J.; Deal, William; Chattopadhyay, Goutam

    2013-01-01

    A coplanar waveguide 3 dB quadrature coupler operating from 500 to 700 GHz is designed, fabricated and measured. On-wafer measurements demonstrate an amplitude balance of +/-2 dB and phase balance of +/-20 deg.

  13. An integrated system for 3D hip joint reconstruction from 2D X-rays: a preliminary validation study.

    PubMed

    Schumann, Steffen; Liu, Li; Tannast, Moritz; Bergmann, Mathias; Nolte, Lutz-P; Zheng, Guoyan

    2013-10-01

    The acquisition of conventional X-ray radiographs remains the standard imaging procedure for the diagnosis of hip-related problems. However, recent studies demonstrated the benefit of using three-dimensional (3D) surface models in the clinical routine. 3D surface models of the hip joint are useful for assessing the dynamic range of motion in order to identify possible pathologies such as femoroacetabular impingement. In this paper, we present an integrated system which consists of X-ray radiograph calibration and subsequent 2D/3D hip joint reconstruction for diagnosis and planning of hip-related problems. A mobile phantom with two different sizes of fiducials was developed for X-ray radiograph calibration, which can be robustly detected within the images. On the basis of the calibrated X-ray images, a 3D reconstruction method of the acetabulum was developed and applied together with existing techniques to reconstruct a 3D surface model of the hip joint. X-ray radiographs of dry cadaveric hip bones and one cadaveric specimen with soft tissue were used to prove the robustness of the developed fiducial detection algorithm. Computed tomography scans of the cadaveric bones were used to validate the accuracy of the integrated system. The fiducial detection sensitivity was in the same range for both sizes of fiducials. While the detection sensitivity was 97.96% for the large fiducials, it was 97.62% for the small fiducials. The acetabulum and the proximal femur were reconstructed with a mean surface distance error of 1.06 and 1.01 mm, respectively. The results for fiducial detection sensitivity and 3D surface reconstruction demonstrated the capability of the integrated system for 3D hip joint reconstruction from 2D calibrated X-ray radiographs.

  14. An integral equation approach to smooth 3D Navier-Stokes solution

    NASA Astrophysics Data System (ADS)

    Costin, O.; Luo, G.; Tanveer, S.

    2008-12-01

    We summarize a recently developed integral equation (IE) approach to tackling the long-time existence problem for smooth solution v(x, t) to the 3D Navier-Stokes (NS) equation in the context of a periodic box problem with smooth time independent forcing and initial condition v0. Using an inverse-Laplace transform of {\\skew5\\hat v} (k, t) - {\\skew5\\hat v}_0 in 1/t, we arrive at an IE for {\\skew5\\hat U} (k, p) , where p is inverse-Laplace dual to 1/t and k is the Fourier variable dual to x. The advantage of this formulation is that the solution {\\skew5\\hat U} to the IE is known to exist a priori for p \\in \\mathbb{R}^+ and the solution is integrable and exponentially bounded at ∞. Global existence of NS solution in this formulation is reduced to an asymptotics question. If \\parallel\\!{\\skew5\\hat U} (\\cdot, p)\\!\\parallel_{{l^{1} (\\mathbb{Z}^3)}} has subexponential bounds as p→∞, then global existence to NS follows. Moreover, if f=0, then the converse is also true in the following sense: if NS has global solution, then there exists n>=1 for which the inverse-Laplace transform of {\\skew5\\hat v} (k, t) - {\\skew5\\hat v}_0 in 1/tn necessarily decays as q→∞, where q is the inverse-Laplace dual to 1/tn. We also present refined estimates of the exponential growth when the solution {\\skew5\\hat U} is known on a finite interval [0, p0]. We also show that for analytic v[0] and f, with finitely many nonzero Fourier-coefficients, the series for {\\skew5\\hat U} (k, p) in powers of p has a radius of convergence independent of initial condition and forcing; indeed the radius gets bigger for smaller viscosity. We also show that the IE can be solved numerically with controlled errors. Preliminary numerical calculations for Kida (1985 J. Phys. Soc. Japan 54 2132) initial conditions, though far from being optimized, and performed on a modest interval in the accelerated variable q show decay in q.

  15. Highly integrated optical phased arrays: photonic integrated circuits for optical beam shaping and beam steering

    NASA Astrophysics Data System (ADS)

    Heck, Martijn J. R.

    2016-06-01

    Technologies for efficient generation and fast scanning of narrow free-space laser beams find major applications in three-dimensional (3D) imaging and mapping, like Lidar for remote sensing and navigation, and secure free-space optical communications. The ultimate goal for such a system is to reduce its size, weight, and power consumption, so that it can be mounted on, e.g. drones and autonomous cars. Moreover, beam scanning should ideally be done at video frame rates, something that is beyond the capabilities of current opto-mechanical systems. Photonic integrated circuit (PIC) technology holds the promise of achieving low-cost, compact, robust and energy-efficient complex optical systems. PICs integrate, for example, lasers, modulators, detectors, and filters on a single piece of semiconductor, typically silicon or indium phosphide, much like electronic integrated circuits. This technology is maturing fast, driven by high-bandwidth communications applications, and mature fabrication facilities. State-of-the-art commercial PICs integrate hundreds of elements, and the integration of thousands of elements has been shown in the laboratory. Over the last few years, there has been a considerable research effort to integrate beam steering systems on a PIC, and various beam steering demonstrators based on optical phased arrays have been realized. Arrays of up to thousands of coherent emitters, including their phase and amplitude control, have been integrated, and various applications have been explored. In this review paper, I will present an overview of the state of the art of this technology and its opportunities, illustrated by recent breakthroughs.

  16. Highly integrated optical phased arrays: photonic integrated circuits for optical beam shaping and beam steering

    NASA Astrophysics Data System (ADS)

    Heck, Martijn J. R.

    2017-01-01

    Technologies for efficient generation and fast scanning of narrow free-space laser beams find major applications in three-dimensional (3D) imaging and mapping, like Lidar for remote sensing and navigation, and secure free-space optical communications. The ultimate goal for such a system is to reduce its size, weight, and power consumption, so that it can be mounted on, e.g. drones and autonomous cars. Moreover, beam scanning should ideally be done at video frame rates, something that is beyond the capabilities of current opto-mechanical systems. Photonic integrated circuit (PIC) technology holds the promise of achieving low-cost, compact, robust and energy-efficient complex optical systems. PICs integrate, for example, lasers, modulators, detectors, and filters on a single piece of semiconductor, typically silicon or indium phosphide, much like electronic integrated circuits. This technology is maturing fast, driven by high-bandwidth communications applications, and mature fabrication facilities. State-of-the-art commercial PICs integrate hundreds of elements, and the integration of thousands of elements has been shown in the laboratory. Over the last few years, there has been a considerable research effort to integrate beam steering systems on a PIC, and various beam steering demonstrators based on optical phased arrays have been realized. Arrays of up to thousands of coherent emitters, including their phase and amplitude control, have been integrated, and various applications have been explored. In this review paper, I will present an overview of the state of the art of this technology and its opportunities, illustrated by recent breakthroughs.

  17. Integrating genomic information with protein sequence and 3D atomic level structure at the RCSB protein data bank

    PubMed Central

    Prlić, Andreas; Kalro, Tara; Bhattacharya, Roshni; Christie, Cole; Burley, Stephen K.; Rose, Peter W.

    2016-01-01

    Summary: The Protein Data Bank (PDB) now contains more than 120,000 three-dimensional (3D) structures of biological macromolecules. To allow an interpretation of how PDB data relates to other publicly available annotations, we developed a novel data integration platform that maps 3D structural information across various datasets. This integration bridges from the human genome across protein sequence to 3D structure space. We developed novel software solutions for data management and visualization, while incorporating new libraries for web-based visualization using SVG graphics. Availability and Implementation: The new views are available from http://www.rcsb.org and software is available from https://github.com/rcsb/. Contact: andreas.prlic@rcsb.org Supplementary information: Supplementary data are available at Bioinformatics online. PMID:27551105

  18. Estimation of uncertainties in geological 3D raster layer models as integral part of modelling procedures

    NASA Astrophysics Data System (ADS)

    Maljers, Denise; den Dulk, Maryke; ten Veen, Johan; Hummelman, Jan; Gunnink, Jan; van Gessel, Serge

    2016-04-01

    applied for DGM Deep proves to be an effective way to (graphically) represent the reliability of the DGM Deep model, although the relative contribution of the various error sources needs further attention. For the DGM Shallow model a cross-validation procedure in a moving window environment has been used to calculate mean deviations and standard errors on a sub-regional scale. Subsequently, these cross validation standard errors have been rescaled to account for local data configuration and clustering. This resulted in standard deviations expressing both regional and local uncertainties. Both workflows are state-of-the-art, form an integral part of the geological modelling and result in reproducible uncertainty values. They can be considered a good starting point for incorporating other errors that contribute to uncertainties of geological 3D raster layer models. For example, the mis-positioning of data used or the error underlying mis-ties at well locations. An additional, perhaps more easy-to-read, parameter that can be calculated to visualize these uncertainties would be the information entropy, as proposed by Wellmann & Regenauer-Lieb (2012). Where a value of 0 means there is no uncertainty, and a value of 1 means there is a high uncertainty. At the moment depth uncertainty information is disseminated through our webportals (www.dinoloket.nl and www.nlog.nl) in an on-line map viewer and as downloadable GIS products.

  19. Tunable hollow optical waveguides for photonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Koyama, Fumio

    2004-10-01

    We propose a tunable hollow optical waveguide with a variable air core toward a new class of photonic integrated circuits. We present various unique features in hollow waveguides and the combination with microelectro-mechanical system (MEMS) will gives us widely tunable waveguide devices. We presente the design and fabrication of a tunable hollow waveguide with a variable air core. We describe the full-vectorial modeling of 3D and slab hollow waveguides with a variable air core, which is also supported by experiments. We demonstrated low loss and polarization insensitive waveguiding in an air core with optimized multilayer coating. The result shows a possibility of a large change of ~3% in propagation constant with a variable air core. We will present a wide variety of device applications based on hollow waveguides, which include tunable grating demultiplexers, variable attenuators, optical switches, tunable Bragg reflectors, tunable dispersion compensators and tunable lasers. The device structure can be formed by fully planar fabrication processes based on lithography and etching. The proposed concept may open up a new class of various tunable optical devices, which give us unique features of wide tunability, compact size and temperature insensitivity.

  20. Multi-Scale Modeling of an Integrated 3D Braided Composite with Applications to Helicopter Arm

    NASA Astrophysics Data System (ADS)

    Zhang, Diantang; Chen, Li; Sun, Ying; Zhang, Yifan; Qian, Kun

    2017-01-01

    A study is conducted with the aim of developing multi-scale analytical method for designing the composite helicopter arm with three-dimensional (3D) five-directional braided structure. Based on the analysis of 3D braided microstructure, the multi-scale finite element modeling is developed. Finite element analysis on the load capacity of 3D five-directional braided composites helicopter arm is carried out using the software ABAQUS/Standard. The influences of the braiding angle and loading condition on the stress and strain distribution of the helicopter arm are simulated. The results show that the proposed multi-scale method is capable of accurately predicting the mechanical properties of 3D braided composites, validated by the comparison the stress-strain curves of meso-scale RVCs. Furthermore, it is found that the braiding angle is an important factor affecting the mechanical properties of 3D five-directional braided composite helicopter arm. Based on the optimized structure parameters, the nearly net-shaped composite helicopter arm is fabricated using a novel resin transfer mould (RTM) process.

  1. Comparing and visualizing titanium implant integration in rat bone using 2D and 3D techniques.

    PubMed

    Arvidsson, Anna; Sarve, Hamid; Johansson, Carina B

    2015-01-01

    The aim was to compare the osseointegration of grit-blasted implants with and without a hydrogen fluoride treatment in rat tibia and femur, and to visualize bone formation using state-of-the-art 3D visualization techniques. Grit-blasted implants were inserted in femur and tibia of 10 Sprague-Dawley rats (4 implants/rat). Four weeks after insertion, bone implant samples were retrieved. Selected samples were imaged in 3D using Synchrotron Radiation-based μCT (SRμCT). The 3D data was quantified and visualized using two novel visualization techniques, thread fly-through and 2D unfolding. All samples were processed to cut and ground sections and 2D histomorphometrical comparisons of bone implant contact (BIC), bone area (BA), and mirror image area (MI) were performed. BA values were statistically significantly higher for test implants than controls (p < 0.05), but BIC and MI data did not differ significantly. Thus, the results partly indicate improved bone formation at blasted and hydrogen fluoride treated implants, compared to blasted implants. The 3D analysis was a valuable complement to 2D analysis, facilitating improved visualization. However, further studies are required to evaluate aspects of 3D quantitative techniques, with relation to light microscopy that traditionally is used for osseointegration studies.

  2. An Alignment Method for the Integration of Underwater 3D Data Captured by a Stereovision System and an Acoustic Camera

    PubMed Central

    Lagudi, Antonio; Bianco, Gianfranco; Muzzupappa, Maurizio; Bruno, Fabio

    2016-01-01

    The integration of underwater 3D data captured by acoustic and optical systems is a promising technique in various applications such as mapping or vehicle navigation. It allows for compensating the drawbacks of the low resolution of acoustic sensors and the limitations of optical sensors in bad visibility conditions. Aligning these data is a challenging problem, as it is hard to make a point-to-point correspondence. This paper presents a multi-sensor registration for the automatic integration of 3D data acquired from a stereovision system and a 3D acoustic camera in close-range acquisition. An appropriate rig has been used in the laboratory tests to determine the relative position between the two sensor frames. The experimental results show that our alignment approach, based on the acquisition of a rig in several poses, can be adopted to estimate the rigid transformation between the two heterogeneous sensors. A first estimation of the unknown geometric transformation is obtained by a registration of the two 3D point clouds, but it ends up to be strongly affected by noise and data dispersion. A robust and optimal estimation is obtained by a statistical processing of the transformations computed for each pose. The effectiveness of the method has been demonstrated in this first experimentation of the proposed 3D opto-acoustic camera. PMID:27089344

  3. 77 FR 33486 - Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths and Products...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-06-06

    ... COMMISSION Certain Integrated Circuit Packages Provided With Multiple Heat- Conducting Paths and Products.... International Trade Commission has received a complaint entitled Certain Integrated Circuit Packages Provided... sale within the United States after importation of certain integrated circuit packages provided...

  4. 76 FR 76434 - Certain Integrated Circuits, Chipsets, and Products Containing Same Including Televisions...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-12-07

    ... COMMISSION Certain Integrated Circuits, Chipsets, and Products Containing Same Including Televisions, Receipt... Commission has received a complaint entitled In Re Certain Integrated Circuits, Chipsets, And Products... importation of certain integrated circuits, chipsets, and products containing same including televisions....

  5. 77 FR 35426 - Certain Radio Frequency Integrated Circuits and Devices Containing Same; Institution of...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-06-13

    ... COMMISSION Certain Radio Frequency Integrated Circuits and Devices Containing Same; Institution of... within the United States after importation of certain radio frequency integrated circuits and devices... after importation of certain radio frequency integrated circuits and devices containing same...

  6. 76 FR 41521 - In the Matter of Certain Integrated Circuits, Chipsets, and Products Containing Same Including...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-07-14

    ... COMMISSION In the Matter of Certain Integrated Circuits, Chipsets, and Products Containing Same Including... integrated circuits, chipsets, and products containing same including televisions by reason of infringement... integrated circuits, chipsets, and products containing same including televisions that infringe one or...

  7. A novel 3D integrated platform for the high-resolution study of cell migration plasticity.

    PubMed

    Schneider, Julian; Bachmann, Tobias; Franco, Davide; Richner, Patrizia; Galliker, Patrick; Tiwari, Manish K; Ferrari, Aldo; Poulikakos, Dimos

    2013-08-01

    Understanding the mechanisms of interstitial cancer migration is of great scientific and medical interest. Creating 3D platforms, conducive to optical microscopy and mimicking the physical parameters (in plane and out of plane) involved in interstitial migration, is a major step forward in this direction. Here, a novel approach is used to directly print free-form, 3D micropores on basal scaffolds containing microgratings optimized for contact guidance. The platforms so formed are validated by monitoring cancer cell migration and micropore penetration with high-resolution optical microscopy. The shapes, sizes and deformability of the micropores are controllable, paving the way to decipher their role in interstitial migration.

  8. The Effects of Space Radiation on Linear Integrated Circuit

    NASA Technical Reports Server (NTRS)

    Johnston, A.

    2000-01-01

    Permanent and transient effects are discussed that are induced in linear integrated circuits by space radiation. Recent developments include enhanced damage at low dose rate, increased damage from protons due to displacement effects, and transients in digital comparators that can cause circuit malfunctions.

  9. 35 GHz integrated circuit rectifying antenna with 33 percent efficiency

    NASA Technical Reports Server (NTRS)

    Yoo, T.-W.; Chang, K.

    1991-01-01

    A 35 GHz integrated circuit rectifying antenna (rectenna) has been developed using a microstrip dipole antenna and beam-lead mixer diode. Greater than 33 percent conversion efficiency has been achieved. The circuit should have applications in microwave/millimeter-wave power transmission and detection.

  10. A 3D profile function suitable for integration of neutron time-of-flight single crystal diffraction peaks

    NASA Astrophysics Data System (ADS)

    Gutmann, Matthias J.

    2017-03-01

    A 3D profile function is presented suitable to integrate reflections arising in time-of-flight (TOF) single crystal neutron diffraction experiments. In order to account for the large asymmetry of the peak shape in the TOF direction, a 3D Gaussian ellipsoid in the pixel (x, z) and time-of-flight coordinates is convoluted with a rising and falling exponential along the time-of-flight direction. An analytic expression is derived, making it suitable for least-squares fitting. The application of this function in detector space or reciprocal space is straightforward.

  11. An Integrated RELAP5-3D and Multiphase CFD Code System Utilizing a Semi Implicit Coupling Technique

    SciTech Connect

    D.L. Aumiller; E.T. Tomlinson; W.L. Weaver

    2001-06-21

    An integrated code system consisting of RELAP5-3D and a multiphase CFD program has been created through the use of a generic semi-implicit coupling algorithm. Unlike previous CFD coupling work, this coupling scheme is numerically stable provided the material Courant limit is not violated in RELAP5-3D or at the coupling locations. The basis for the coupling scheme and details regarding the unique features associated with the application of this technique to a four-field CFD program are presented. Finally, the results of a verification problem are presented. The coupled code system is shown to yield accurate and numerically stable results.

  12. Integrated Data Capturing Requirements for 3d Semantic Modelling of Cultural Heritage: the Inception Protocol

    NASA Astrophysics Data System (ADS)

    Di Giulio, R.; Maietti, F.; Piaia, E.; Medici, M.; Ferrari, F.; Turillazzi, B.

    2017-02-01

    The generation of high quality 3D models can be still very time-consuming and expensive, and the outcome of digital reconstructions is frequently provided in formats that are not interoperable, and therefore cannot be easily accessed. This challenge is even more crucial for complex architectures and large heritage sites, which involve a large amount of data to be acquired, managed and enriched by metadata. In this framework, the ongoing EU funded project INCEPTION - Inclusive Cultural Heritage in Europe through 3D semantic modelling proposes a workflow aimed at the achievements of efficient 3D digitization methods, post-processing tools for an enriched semantic modelling, web-based solutions and applications to ensure a wide access to experts and non-experts. In order to face these challenges and to start solving the issue of the large amount of captured data and time-consuming processes in the production of 3D digital models, an Optimized Data Acquisition Protocol (DAP) has been set up. The purpose is to guide the processes of digitization of cultural heritage, respecting needs, requirements and specificities of cultural assets.

  13. Integrated 3D-printed reactionware for chemical synthesis and analysis

    NASA Astrophysics Data System (ADS)

    Symes, Mark D.; Kitson, Philip J.; Yan, Jun; Richmond, Craig J.; Cooper, Geoffrey J. T.; Bowman, Richard W.; Vilbrandt, Turlif; Cronin, Leroy

    2012-05-01

    Three-dimensional (3D) printing has the potential to transform science and technology by creating bespoke, low-cost appliances that previously required dedicated facilities to make. An attractive, but unexplored, application is to use a 3D printer to initiate chemical reactions by printing the reagents directly into a 3D reactionware matrix, and so put reactionware design, construction and operation under digital control. Here, using a low-cost 3D printer and open-source design software we produced reactionware for organic and inorganic synthesis, which included printed-in catalysts and other architectures with printed-in components for electrochemical and spectroscopic analysis. This enabled reactions to be monitored in situ so that different reactionware architectures could be screened for their efficacy for a given process, with a digital feedback mechanism for device optimization. Furthermore, solely by modifying reactionware architecture, reaction outcomes can be altered. Taken together, this approach constitutes a relatively cheap, automated and reconfigurable chemical discovery platform that makes techniques from chemical engineering accessible to typical synthetic laboratories.

  14. Ship-in-a-bottle integration by hybrid femtosecond laser technology for fabrication of true 3D biochips

    NASA Astrophysics Data System (ADS)

    Sima, Felix; Wu, Dong; Xu, Jian; Midorikawa, Katsumi; Sugioka, Koji

    2015-03-01

    We propose herein the "ship-in-a-bottle" integration of three-dimensional (3D) polymeric sinusoidal ridges inside photosensitive glass microfluidic channel by a hybrid subtractive - additive femtosecond laser processing method. It consists of Femtosecond Laser Assisted Wet Etching (FLAE) of a photosensitive Foturan glass followed by Two-Photon Polymerization (TPP) of a SU-8 negative epoxy-resin. Both subtractive and additive processes are carried out using the same set-up with the change of laser focusing objective only. A 522 nm wavelength of the second harmonic generation from an amplified femtosecond Yb-fiber laser (FCPA µJewel D-400, IMRA America, 1045 nm; pulse width 360 fs, repetition rate 200 kHz) was employed for irradiation. The new method allows lowering the size limit of 3D objects created inside channels to smaller details down to the dimensions of a cell, and improve the structure stability. Sinusoidal periodic patterns and ridges are of great use as base scaffolds for building up new structures on their top or for modulating cell migration, guidance and orientation while created interspaces can be exploited for microfluidic applications. The glass microchannel offers robustness and appropriate dynamic flow conditions for cellular studies while the integrated patterns are reducing the size of structure to the level of cells responsiveness. Taking advantage of the ability to directly fabricate 3D complex shapes, both glass channels and polymeric integrated patterns enable us to 3D spatially design biochips for specific applications.

  15. LEC GaAs for integrated circuit applications

    NASA Technical Reports Server (NTRS)

    Kirkpatrick, C. G.; Chen, R. T.; Homes, D. E.; Asbeck, P. M.; Elliott, K. R.; Fairman, R. D.; Oliver, J. D.

    1984-01-01

    Recent developments in liquid encapsulated Czochralski techniques for the growth of semiinsulating GaAs for integrated circuit applications have resulted in significant improvements in the quality and quantity of GaAs material suitable for device processing. The emergence of high performance GaAs integrated circuit technologies has accelerated the demand for high quality, large diameter semiinsulating GaAs substrates. The new device technologies, including digital integrated circuits, monolithic microwave integrated circuits and charge coupled devices have largely adopted direct ion implantation for the formation of doped layers. Ion implantation lends itself to good uniformity and reproducibility, high yield and low cost; however, this technique also places stringent demands on the quality of the semiinsulating GaAs substrates. Although significant progress was made in developing a viable planar ion implantation technology, the variability and poor quality of GaAs substrates have hindered progress in process development.

  16. Chemical etching for automatic processing of integrated circuits

    NASA Technical Reports Server (NTRS)

    Kennedy, B. W.

    1981-01-01

    Chemical etching for automatic processing of integrated circuits is discussed. The wafer carrier and loading from a receiving air track into automatic furnaces and unloading onto a sending air track are included.

  17. 75 FR 51843 - In the Matter of Certain Large Scale Integrated Circuit Semiconductor Chips and Products...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-08-23

    ... Matter of Certain Large Scale Integrated Circuit Semiconductor Chips and Products Containing the Same... certain large scale integrated circuit semiconductor chips and products containing same by reason...

  18. Radiation-hardened transistor and integrated circuit

    DOEpatents

    Ma, Kwok K.

    2007-11-20

    A composite transistor is disclosed for use in radiation hardening a CMOS IC formed on an SOI or bulk semiconductor substrate. The composite transistor has a circuit transistor and a blocking transistor connected in series with a common gate connection. A body terminal of the blocking transistor is connected only to a source terminal thereof, and to no other connection point. The blocking transistor acts to prevent a single-event transient (SET) occurring in the circuit transistor from being coupled outside the composite transistor. Similarly, when a SET occurs in the blocking transistor, the circuit transistor prevents the SET from being coupled outside the composite transistor. N-type and P-type composite transistors can be used for each and every transistor in the CMOS IC to radiation harden the IC, and can be used to form inverters and transmission gates which are the building blocks of CMOS ICs.

  19. Addressable-Matrix Integrated-Circuit Test Structure

    NASA Technical Reports Server (NTRS)

    Sayah, Hoshyar R.; Buehler, Martin G.

    1991-01-01

    Method of quality control based on use of row- and column-addressable test structure speeds collection of data on widths of resistor lines and coverage of steps in integrated circuits. By use of straightforward mathematical model, line widths and step coverages deduced from measurements of electrical resistances in each of various combinations of lines, steps, and bridges addressable in test structure. Intended for use in evaluating processes and equipment used in manufacture of application-specific integrated circuits.

  20. Isolation of Battery Chargers Integrated Into Printed Circuit Boards

    SciTech Connect

    Sullivan, James S.

    2013-11-21

    Present test procedures developed by the Federal Government (10 CFR Part 430 “Energy Conservation Program for Consumer Products”) to measure the energy consumption of battery chargers provide no method for the isolation of input power for battery chargers that have been integrated into printed circuit boards internal to electronic equipment. This prevents the measurement of Standby and Off Mode energy consumption. As a result, the energy consumption of battery chargers integrated into the printed circuit board cannot be measured.

  1. Control of exciton fluxes in an excitonic integrated circuit.

    PubMed

    High, Alex A; Novitskaya, Ekaterina E; Butov, Leonid V; Hanson, Micah; Gossard, Arthur C

    2008-07-11

    Efficient signal communication uses photons. Signal processing, however, uses an optically inactive medium, electrons. Therefore, an interconnection between electronic signal processing and optical communication is required at the integrated circuit level. We demonstrated control of exciton fluxes in an excitonic integrated circuit. The circuit consists of three exciton optoelectronic transistors and performs operations with exciton fluxes, such as directional switching and merging. Photons transform into excitons at the circuit input, and the excitons transform into photons at the circuit output. The exciton flux from the input to the output is controlled by a pattern of the electrode voltages. The direct coupling of photons, used in communication, to excitons, used as the device-operation medium, may lead to the development of efficient exciton-based optoelectronic devices.

  2. Analog integrated circuits design for processing physiological signals.

    PubMed

    Li, Yan; Poon, Carmen C Y; Zhang, Yuan-Ting

    2010-01-01

    Analog integrated circuits (ICs) designed for processing physiological signals are important building blocks of wearable and implantable medical devices used for health monitoring or restoring lost body functions. Due to the nature of physiological signals and the corresponding application scenarios, the ICs designed for these applications should have low power consumption, low cutoff frequency, and low input-referred noise. In this paper, techniques for designing the analog front-end circuits with these three characteristics will be reviewed, including subthreshold circuits, bulk-driven MOSFETs, floating gate MOSFETs, and log-domain circuits to reduce power consumption; methods for designing fully integrated low cutoff frequency circuits; as well as chopper stabilization (CHS) and other techniques that can be used to achieve a high signal-to-noise performance. Novel applications using these techniques will also be discussed.

  3. Automated and integrated mask generation from a CAD constructed 3D model.

    SciTech Connect

    Schiek, Richard Louis; Schmidt, Rodney Cannon

    2005-03-01

    We have developed and implemented a method which given a three-dimensional object can infer from topology the two-dimensional masks needed to produce that object with surface micromachining. This design tool calculates the two-dimensional mask set required to produce a given three-dimensional model by investigating the vertical topology to the model. The 3D model is first separated into bodies that are non-intersecting, made from different materials or only linked through a ground plane. Next, for each body unique horizontal cross sections are located and arranged into a tree based on their topological relationship. A branch-wise search of the tree uncovers locations where deposition boundaries must lie and identifies candidate masks creating a generic mask set for the 3D model. Finally, in the last step specific process requirements are considered that may constrain the generic mask set.

  4. Integrating biologically inspired nanomaterials and table-top stereolithography for 3D printed biomimetic osteochondral scaffolds

    NASA Astrophysics Data System (ADS)

    Castro, Nathan J.; O'Brien, Joseph; Zhang, Lijie Grace

    2015-08-01

    The osteochondral interface of an arthritic joint is notoriously difficult to regenerate due to its extremely poor regenerative capacity and complex stratified architecture. Native osteochondral tissue extracellular matrix is composed of numerous nanoscale organic and inorganic constituents. Although various tissue engineering strategies exist in addressing osteochondral defects, limitations persist with regards to tissue scaffolding which exhibit biomimetic cues at the nano to micro scale. In an effort to address this, the current work focused on 3D printing biomimetic nanocomposite scaffolds for improved osteochondral tissue regeneration. For this purpose, two biologically-inspired nanomaterials have been synthesized consisting of (1) osteoconductive nanocrystalline hydroxyapatite (nHA) (primary inorganic component of bone) and (2) core-shell poly(lactic-co-glycolic) acid (PLGA) nanospheres encapsulated with chondrogenic transforming growth-factor β1 (TGF-β1) for sustained delivery. Then, a novel table-top stereolithography 3D printer and the nano-ink (i.e., nHA + nanosphere + hydrogel) were employed to fabricate a porous and highly interconnected osteochondral scaffold with hierarchical nano-to-micro structure and spatiotemporal bioactive factor gradients. Our results showed that human bone marrow-derived mesenchymal stem cell adhesion, proliferation, and osteochondral differentiation were greatly improved in the biomimetic graded 3D printed osteochondral construct in vitro. The current work served to illustrate the efficacy of the nano-ink and current 3D printing technology for efficient fabrication of a novel nanocomposite hydrogel scaffold. In addition, tissue-specific growth factors illustrated a synergistic effect leading to increased cell adhesion and directed stem cell differentiation.

  5. Secondary Side CMOS Feedback Control Integrated Circuit

    DTIC Science & Technology

    1990-06-01

    Temperature ( Celc ~us) Figure 5.1: Experimental Temperature Dependence cf Untrimmed Bandgap Circuit 104 1. I I ’ - ’ 0 0.9 . -0-0 Ouput Voit -ge ---.o M...Schlecht and L.F. Casey, "Comparison of the Square-Wave and Quasi- Resonant Topologies," IEEE PESC Record, 1987, pp. 124-134. 132

  6. Processing of Image Data by Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Armstrong, R. W.

    1985-01-01

    Sensors combined with logic and memory circuitry. Cross-correlation of two inputs accomplished by transversal filter. Position of image taken to point where image and template data yield maximum value correlation function. Circuit used for controlling robots, medical-image analysis, automatic vehicle guidance, and precise pointing of scientific cameras.

  7. Laser rapid prototyping of photonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Eldada, Louay A.; Levy, Miguel; Scarmozzino, Robert; Osgood, Richard M., Jr.

    1994-07-01

    In this paper, we will describe our work at Columbia in developing a laser prototyping system, in conjunction with computer simulation, to design, fabricate, and test novel waveguide circuits. The system is also useful for manufacturing small-run circuit designs. The fundamental technique uses a laser-induced photoelectrochemical process for etching GaAs and other III-V compounds. The technique is maskless and discretionary. The computer-controlled apparatus can be programmed with any desired circuit pattern, and prototype waveguide circuits can be produced within a day. The waveguides and passive components produced with this technique include linear waveguides, tapered waveguides, abrupt and smoothly curved bends, Y-branches, asymmetric splitters, directional couplers, and optical delay lines. The passive devices are single-mode and low-loss. The technique also has the ability to vary the effective index of refraction along the device by grading the etch depth. In addition to passive devices, we have recently shown that active switching components can be prototyped by combining passive structures with laser-patterned metal electrodes. These electrodes are produced masklessly using standard metal deposition techniques coupled with laser- patterning of photoresist. In addition, metal can be deposited directly using laser-induced selective metallorgainic CVD.

  8. Integrated WiFi/PDR/Smartphone Using an Unscented Kalman Filter Algorithm for 3D Indoor Localization.

    PubMed

    Chen, Guoliang; Meng, Xiaolin; Wang, Yunjia; Zhang, Yanzhe; Tian, Peng; Yang, Huachao

    2015-09-23

    Because of the high calculation cost and poor performance of a traditional planar map when dealing with complicated indoor geographic information, a WiFi fingerprint indoor positioning system cannot be widely employed on a smartphone platform. By making full use of the hardware sensors embedded in the smartphone, this study proposes an integrated approach to a three-dimensional (3D) indoor positioning system. First, an improved K-means clustering method is adopted to reduce the fingerprint database retrieval time and enhance positioning efficiency. Next, with the mobile phone's acceleration sensor, a new step counting method based on auto-correlation analysis is proposed to achieve cell phone inertial navigation positioning. Furthermore, the integration of WiFi positioning with Pedestrian Dead Reckoning (PDR) obtains higher positional accuracy with the help of the Unscented Kalman Filter algorithm. Finally, a hybrid 3D positioning system based on Unity 3D, which can carry out real-time positioning for targets in 3D scenes, is designed for the fluent operation of mobile terminals.

  9. Integrated WiFi/PDR/Smartphone Using an Unscented Kalman Filter Algorithm for 3D Indoor Localization

    PubMed Central

    Chen, Guoliang; Meng, Xiaolin; Wang, Yunjia; Zhang, Yanzhe; Tian, Peng; Yang, Huachao

    2015-01-01

    Because of the high calculation cost and poor performance of a traditional planar map when dealing with complicated indoor geographic information, a WiFi fingerprint indoor positioning system cannot be widely employed on a smartphone platform. By making full use of the hardware sensors embedded in the smartphone, this study proposes an integrated approach to a three-dimensional (3D) indoor positioning system. First, an improved K-means clustering method is adopted to reduce the fingerprint database retrieval time and enhance positioning efficiency. Next, with the mobile phone’s acceleration sensor, a new step counting method based on auto-correlation analysis is proposed to achieve cell phone inertial navigation positioning. Furthermore, the integration of WiFi positioning with Pedestrian Dead Reckoning (PDR) obtains higher positional accuracy with the help of the Unscented Kalman Filter algorithm. Finally, a hybrid 3D positioning system based on Unity 3D, which can carry out real-time positioning for targets in 3D scenes, is designed for the fluent operation of mobile terminals. PMID:26404314

  10. 3D integration of microfluidics and microoptics inside photosensitive glass by femtosecond laser direct writing for photonic biosensing

    NASA Astrophysics Data System (ADS)

    Sugioka, Koji; Wang, Zhongke; Midorikawa, Katsumi

    2008-02-01

    Optical waveguides with a propagation loss of around 0.5 dB/cm are written inside photosensitive Foturan glass by internal modification of refractive index using femtosecond (fs) laser. Integration of the optical wafveguides with a micromirror enables us to bend the guided laser beam at an angle of 90° with a bending loss of less than 0.3 dB. In the meanwhile, a plano-convex microlens is completely embedded inside the Foturan glass chip via formation of a three-dimensional (3D) hollow microstructure using fs laser direct writing followed by heat treatment and successive wet etching. This technique can also be used to fabricate microfluidic devices and therefore realizes 3D integration of microoptical and microfluidic components by one continuous procedure. Subsequently, microoptical waveguides are further integrated into the single glass chip. Demonstration of optical measurements using the integrated microchip reveals that photonic biosensing can be performed with an efficiency increased by a factor of 8 for fluorescence detection and by a factor of 3 for absorption detection.

  11. New 3D parallel GILD electromagnetic modeling and nonlinear inversion using global magnetic integral and local differential equation

    SciTech Connect

    Xie, G.; Li, J.; Majer, E.; Zuo, D.

    1998-07-01

    This paper describes a new 3D parallel GILD electromagnetic (EM) modeling and nonlinear inversion algorithm. The algorithm consists of: (a) a new magnetic integral equation instead of the electric integral equation to solve the electromagnetic forward modeling and inverse problem; (b) a collocation finite element method for solving the magnetic integral and a Galerkin finite element method for the magnetic differential equations; (c) a nonlinear regularizing optimization method to make the inversion stable and of high resolution; and (d) a new parallel 3D modeling and inversion using a global integral and local differential domain decomposition technique (GILD). The new 3D nonlinear electromagnetic inversion has been tested with synthetic data and field data. The authors obtained very good imaging for the synthetic data and reasonable subsurface EM imaging for the field data. The parallel algorithm has high parallel efficiency over 90% and can be a parallel solver for elliptic, parabolic, and hyperbolic modeling and inversion. The parallel GILD algorithm can be extended to develop a high resolution and large scale seismic and hydrology modeling and inversion in the massively parallel computer.

  12. Hybrid and monolithic integration of planar lightwave circuits (PLCs)

    NASA Astrophysics Data System (ADS)

    Chen, Ray T.

    2008-02-01

    In this paper, we review the status of monolithic and hybrid integration of planar lightwave circuits (PLCs). Building blocks needed for system integration based on polymeric materials, III-V semiconductor materials, LiNbO 3 and SOI on Silicon are summarized with pros and cons. Due to the maturity of silicon CMOS technology, silicon becomes the platform of choice for optical application specific integrated circuits (OASICs). However, the indirect bandgap of silicon makes the formation of electrically pumped silicon laser a remote plausibility which requires hybrid integration of laser sources made out of III-V compound semicouductor.

  13. Europeana and 3D

    NASA Astrophysics Data System (ADS)

    Pletinckx, D.

    2011-09-01

    The current 3D hype creates a lot of interest in 3D. People go to 3D movies, but are we ready to use 3D in our homes, in our offices, in our communication? Are we ready to deliver real 3D to a general public and use interactive 3D in a meaningful way to enjoy, learn, communicate? The CARARE project is realising this for the moment in the domain of monuments and archaeology, so that real 3D of archaeological sites and European monuments will be available to the general public by 2012. There are several aspects to this endeavour. First of all is the technical aspect of flawlessly delivering 3D content over all platforms and operating systems, without installing software. We have currently a working solution in PDF, but HTML5 will probably be the future. Secondly, there is still little knowledge on how to create 3D learning objects, 3D tourist information or 3D scholarly communication. We are still in a prototype phase when it comes to integrate 3D objects in physical or virtual museums. Nevertheless, Europeana has a tremendous potential as a multi-facetted virtual museum. Finally, 3D has a large potential to act as a hub of information, linking to related 2D imagery, texts, video, sound. We describe how to create such rich, explorable 3D objects that can be used intuitively by the generic Europeana user and what metadata is needed to support the semantic linking.

  14. Microwave GaAs Integrated Circuits On Quartz Substrates

    NASA Technical Reports Server (NTRS)

    Siegel, Peter H.; Mehdi, Imran; Wilson, Barbara

    1994-01-01

    Integrated circuits for use in detecting electromagnetic radiation at millimeter and submillimeter wavelengths constructed by bonding GaAs-based integrated circuits onto quartz-substrate-based stripline circuits. Approach offers combined advantages of high-speed semiconductor active devices made only on epitaxially deposited GaAs substrates with low-dielectric-loss, mechanically rugged quartz substrates. Other potential applications include integration of antenna elements with active devices, using carrier substrates other than quartz to meet particular requirements using lifted-off GaAs layer in membrane configuration with quartz substrate supporting edges only, and using lift-off technique to fabricate ultrathin discrete devices diced separately and inserted into predefined larger circuits. In different device concept, quartz substrate utilized as transparent support for GaAs devices excited from back side by optical radiation.

  15. Integrated Circuit For Simulation Of Neural Network

    NASA Technical Reports Server (NTRS)

    Thakoor, Anilkumar P.; Moopenn, Alexander W.; Khanna, Satish K.

    1988-01-01

    Ballast resistors deposited on top of circuit structure. Cascadable, programmable binary connection matrix fabricated in VLSI form as basic building block for assembly of like units into content-addressable electronic memory matrices operating somewhat like networks of neurons. Connections formed during storage of data, and data recalled from memory by prompting matrix with approximate or partly erroneous signals. Redundancy in pattern of connections causes matrix to respond with correct stored data.

  16. Research in Computer Simulation of Integrated Circuits.

    DTIC Science & Technology

    1983-07-31

    bwadeid a -’. ate dew’.d or "mom 1640e 4 4 4 4.5 he ham ala ker 27601 519 6145 2549 "and 3.2 1.5 2.2 34 4230 TAME 4 A,4er Stsmao m CLAS From the show...from SPICEV it is expected that the speedup is Larger for t.(As) 4 4 4 4 6 the adder circuits compared to the filters. A first observe- iter 352 27601

  17. Integration Of 3D Geographic Information System (GIS) For Effective Waste Management Practice

    SciTech Connect

    Rood, G.J.; Hecox, G.R.

    2006-07-01

    Soil remediation in response to the presence of residual radioactivity resulting from past MED/AEC activities is currently in progress under the Formerly Utilized Sites Remedial Action Program near the St. Louis, MO airport. During GY05, approximately 92,000 cubic meters (120,000 cubic yards) of radioactive soil was excavated, packaged and transported via rail for disposal at U.S. Ecology or Envirocare of Utah, LLC. To facilitate the management of excavation/transportation/disposal activities, a 3D GIS was developed for the site that was used to estimate the in-situ radionuclide activities, activities in excavation block areas, and shipping activities using a sum-of ratio (SOR) method for combining various radionuclide compounds into applicable transportation and disposal SOR values. The 3D GIS was developed starting with the SOR values for the approximately 900 samples from 90 borings. These values were processed into a three-dimensional (3D) point grid using kriging with nominal grid spacing of 1.5 by 1.5 meter horizontal by 0.3 meter vertical. The final grid, clipped to the area and soil interval above the planned base of excavation, consisted of 210,000 individual points. Standard GIS volumetric and spatial join procedures were used to calculate the volume of soil represented by each grid point, the base of excavation, depth below ground surface, elevation, surface elevation and SOR values for each point in the final grid. To create the maps needed for management, the point grid results were spatially joined to each excavation area in 0.9 meter (3 foot) depth intervals and the average SOR and total volumes were calculations. The final maps were color-coded for easy identification of areas above the specific transportation or disposal criteria. (authors)

  18. Fabrication and characterization of gels with integrated channels using 3D printing with microfluidic nozzle for tissue engineering applications.

    PubMed

    Attalla, R; Ling, C; Selvaganapathy, P

    2016-02-01

    The lack of a simple and effective method to integrate vascular network with engineered scaffolds and tissue constructs remains one of the biggest challenges in true 3D tissue engineering. Here, we detail the use of a commercially available, low-cost, open-source 3D printer modified with a microfluidic print-head in order to develop a method for the generation of instantly perfusable vascular network integrated with gel scaffolds seeded with cells. The print-head features an integrated coaxial nozzle that allows the fabrication of hollow, calcium-polymerized alginate tubes that can be easily patterned using 3D printing techniques. The diameter of the hollow channel can be precisely controlled and varied between 500 μm - 2 mm by changing applied flow rates or print-head speed. These channels are integrated into gel layers with a thickness of 800 μm - 2.5 mm. The structural rigidity of these constructs allows the fabrication of multi-layered structures without causing the collapse of hollow channels in lower layers. The 3D printing method was fully characterized at a range of operating speeds (0-40 m/min) and corresponding flow rates (1-30 mL/min) were identified to produce precise definition. This microfluidic design also allows the incorporation of a wide range of scaffold materials as well as biological constituents such as cells, growth factors, and ECM material. Media perfusion of the channels causes a significant viability increase in the bulk of cell-laden structures over the long-term. With this setup, gel constructs with embedded arrays of hollow channels can be created and used as a potential substitute for blood vessel networks.

  19. Integration of 3D and 2D imaging data for assured navigation in unknown environments: initial steps

    NASA Astrophysics Data System (ADS)

    Dill, Evan; Uijt de Haag, Maarten

    2009-05-01

    This paper discusses the initial steps of the development of a novel navigation method that integrates three-dimensional (3D) point cloud data, two-dimensional (2D) gray-level (intensity), and data from an Inertial Measurement Unit (IMU). A time-of-flight camera such as MESA's Swissranger will output both the 3D and 2D data. The target application is position and attitude determination of unmanned aerial vehicles (UAV) and autonomous ground vehicles (AGV) in urban or indoor environments. In urban and indoor environments a GPS position capability may not only be unavailable due to shadowing, significant signal attenuation or multipath, but also due to intentional denial or deception. The proposed algorithm extracts key features such as planar surfaces, lines and corner-points from both the 3D (point-cloud) and 2D (intensity) imagery. Consecutive observations of corresponding features in the 3D and 2D image frames are then used to compute estimates of position and orientation changes. Since the use of 3D image features for positioning suffers from limited feature observability resulting in deteriorated position accuracies, and the 2D imagery suffers from an unknown depth when estimating the pose from consecutive image frames, it is expected that the integration of both data sets will alleviate the problems with the individual methods resulting in an position and attitude determination method with a high level of assurance. An Inertial Measurement Unit (IMU) is used to set up the tracking gates necessary to perform data association of the features in consecutive frames. Finally, the position and orientation change estimates can be used to correct for the IMU drift errors.

  20. A line integration method for the treatment of 3D domain integrals and accelerated by the fast multipole method in the BEM

    NASA Astrophysics Data System (ADS)

    Wang, Qiao; Zhou, Wei; Cheng, Yonggang; Ma, Gang; Chang, Xiaolin

    2017-04-01

    A line integration method (LIM) is proposed to calculate the domain integrals for 3D problems. In the proposed method, the domain integrals are transformed into boundary integrals and only line integrals on straight lines are needed to be computed. A background cell structure is applied to further simplify the line integrals and improve the accuracy. The method creates elements only on the boundary, and the integral lines are created from the boundary elements. The procedure is quite suitable for the boundary element method, and we have applied it to 3D situations. Directly applying the method is time-consuming since the complexity of the computational time is O( NM), where N and M are the numbers of nodes and lines, respectively. To overcome this problem, the fast multipole method is used with the LIM for large-scale computation. The numerical results show that the proposed method is efficient and accurate.

  1. Digital Reconstruction of AN Archaeological Site Based on the Integration of 3d Data and Historical Sources

    NASA Astrophysics Data System (ADS)

    Guidi, G.; Russo, M.; Angheleddu, D.

    2013-02-01

    The methodology proposed in this paper in based on an integrated approach for creating a 3D digital reconstruction of an archaeological site, using extensively the 3D documentation of the site in its current state, followed by an iterative interaction between archaeologists and digital modelers, leading to a progressive refinement of the reconstructive hypotheses. The starting point of the method is the reality-based model, which, together with ancient drawings and documents, is used for generating the first reconstructive step. Such rough approximation of a possible architectural structure can be annotated through archaeological considerations that has to be confronted with geometrical constraints, producing a reduction of the reconstructive hypotheses to a limited set, each one to be archaeologically evaluated. This refinement loop on the reconstructive choices is iterated until the result become convincing by both points of view, integrating in the best way all the available sources. The proposed method has been verified on the ruins of five temples in the My Son site, a wide archaeological area located in central Vietnam. The integration of 3D surveyed data and historical documentation has allowed to support a digital reconstruction of not existing architectures, developing their three-dimensional digital models step by step, from rough shapes to highly sophisticate virtual prototypes.

  2. Formulation and implementation of a high-order 3-D domain integral method for the extraction of energy release rates

    NASA Astrophysics Data System (ADS)

    Ozer, H.; Duarte, C. A.; Al-Qadi, I. L.

    2012-04-01

    This article presents a three dimensional (3-D) formulation and implementation of a high-order domain integral method for the computation of energy release rate. The method is derived using surface and domain formulations of the J-integral and the weighted residual method. The J-integral along 3-D crack fronts is approximated by high-order Legendre polynomials. The proposed implementation is tailored for the Generalized/eXtended Finite Element Method and can handle discontinuities arbitrarily located within a finite element mesh. The domain integral calculations are based on the same integration elements used for the computation of the stiffness matrix. Discontinuities of the integrands across crack surfaces and across computational element boundaries are fully accounted for. The proposed method is able to deliver smooth approximations and to capture the boundary layer behavior of the J-integral using tetrahedral meshes. Numerical simulations of mode-I and mixed mode benchmark fracture mechanics examples verify expected convergence rates for the computed energy release rates. The results are also in good agreement with other numerical solutions available in the literature.

  3. Research on Joint Parameter Inversion for an Integrated Underground Displacement 3D Measuring Sensor

    PubMed Central

    Shentu, Nanying; Qiu, Guohua; Li, Qing; Tong, Renyuan; Shentu, Nankai; Wang, Yanjie

    2015-01-01

    Underground displacement monitoring is a key means to monitor and evaluate geological disasters and geotechnical projects. There exist few practical instruments able to monitor subsurface horizontal and vertical displacements simultaneously due to monitoring invisibility and complexity. A novel underground displacement 3D measuring sensor had been proposed in our previous studies, and great efforts have been taken in the basic theoretical research of underground displacement sensing and measuring characteristics by virtue of modeling, simulation and experiments. This paper presents an innovative underground displacement joint inversion method by mixing a specific forward modeling approach with an approximate optimization inversion procedure. It can realize a joint inversion of underground horizontal displacement and vertical displacement for the proposed 3D sensor. Comparative studies have been conducted between the measured and inversed parameters of underground horizontal and vertical displacements under a variety of experimental and inverse conditions. The results showed that when experimentally measured horizontal displacements and vertical displacements are both varied within 0 ~ 30 mm, horizontal displacement and vertical displacement inversion discrepancies are generally less than 3 mm and 1 mm, respectively, under three kinds of simulated underground displacement monitoring circumstances. This implies that our proposed underground displacement joint inversion method is robust and efficient to predict the measuring values of underground horizontal and vertical displacements for the proposed sensor. PMID:25871714

  4. Multi-channel detector readout method and integrated circuit

    DOEpatents

    Moses, William W.; Beuville, Eric; Pedrali-Noy, Marzio

    2004-05-18

    An integrated circuit which provides multi-channel detector readout from a detector array. The circuit receives multiple signals from the elements of a detector array and compares the sampled amplitudes of these signals against a noise-floor threshold and against one another. A digital signal is generated which corresponds to the location of the highest of these signal amplitudes which exceeds the noise floor threshold. The digital signal is received by a multiplexing circuit which outputs an analog signal corresponding the highest of the input signal amplitudes. In addition a digital control section provides for programmatic control of the multiplexer circuit, amplifier gain, amplifier reset, masking selection, and test circuit functionality on each input thereof.

  5. Multi-channel detector readout method and integrated circuit

    SciTech Connect

    Moses, William W.; Beuville, Eric; Pedrali-Noy, Marzio

    2006-12-12

    An integrated circuit which provides multi-channel detector readout from a detector array. The circuit receives multiple signals from the elements of a detector array and compares the sampled amplitudes of these signals against a noise-floor threshold and against one another. A digital signal is generated which corresponds to the location of the highest of these signal amplitudes which exceeds the noise floor threshold. The digital signal is received by a multiplexing circuit which outputs an analog signal corresponding the highest of the input signal amplitudes. In addition a digital control section provides for programmatic control of the multiplexer circuit, amplifier gain, amplifier reset, masking selection, and test circuit functionality on each input thereof.

  6. New optical four-quadrant phase detector integrated into a photogate array for small and precise 3D cameras

    NASA Astrophysics Data System (ADS)

    Schwarte, Rudolf; Xu, Zhanping; Heinol, Horst-Guenther; Olk, Joachim; Buxbaum, Bernd

    1997-03-01

    The photonic mixer device (PMD) is a new electro-optical mixing semiconductor device. Integrated into a line or an array it may contribute a significant improvement in developing an extremely fast, flexible, robust and low cost 3D-solid-state camera. Three dimensional (3D)-cameras are of dramatically increasing interest in industrial automation, especially for production integrated quality control, in- house navigation, etc. The type of 3D-camera here under consideration is based on the principle of time-of-flight respectively phase delay of surface reflected echoes of rf- modulated light. In contrast to 3D-laser radars there is no scanner required since the whole 3D-scene is illuminated simultaneously using intensity-modulated incoherent light, e.g. in the 10 to 1000 MHz range. The rf-modulated light reflected from the 3D-scene represents the total depth information within the local delay of the back scattered phase front. If this incoming wave front is again rf- modulated by a 2D-mixer within the whole receiving aperture we get a quasi-stationary rf-inference pattern respectively rf-interferogram which may be captured by means of a conventional CCD-camera. This procedure is called rf- modulation interferometry (RFMI). Corresponding to first simulative results the new PMD-array will be appropriate to the RFMI-procedure. Though looking like a modified CCD-array or CMOS-photodetector array it will be able to perform both, the pixelwise mixing process for phase delay respectively depth evaluation and the pixelwise light intensity acquisition for gray level or color evaluation. Further advantageous properties are achieved by means of a four- quadrant (4Q)-PMD array which operates as a balanced inphase/quadrature phase (I/Q)-mixer and will be able to capture the total 3D-scene information of several 100,000 voxels within the microsecond(s) - to ms-range.

  7. Tightly coupled low cost 3D RISS/GPS integration using a mixture particle filter for vehicular navigation.

    PubMed

    Georgy, Jacques; Noureldin, Aboelmagd

    2011-01-01

    Satellite navigation systems such as the global positioning system (GPS) are currently the most common technique used for land vehicle positioning. However, in GPS-denied environments, there is an interruption in the positioning information. Low-cost micro-electro mechanical system (MEMS)-based inertial sensors can be integrated with GPS and enhance the performance in denied GPS environments. The traditional technique for this integration problem is Kalman filtering (KF). Due to the inherent errors of low-cost MEMS inertial sensors and their large stochastic drifts, KF, with its linearized models, has limited capabilities in providing accurate positioning. Particle filtering (PF) was recently suggested as a nonlinear filtering technique to accommodate for arbitrary inertial sensor characteristics, motion dynamics and noise distributions. An enhanced version of PF called the Mixture PF is utilized in this study to perform tightly coupled integration of a three dimensional (3D) reduced inertial sensors system (RISS) with GPS. In this work, the RISS consists of one single-axis gyroscope and a two-axis accelerometer used together with the vehicle's odometer to obtain 3D navigation states. These sensors are then integrated with GPS in a tightly coupled scheme. In loosely-coupled integration, at least four satellites are needed to provide acceptable GPS position and velocity updates for the integration filter. The advantage of the tightly-coupled integration is that it can provide GPS measurement update(s) even when the number of visible satellites is three or lower, thereby improving the operation of the navigation system in environments with partial blockages by providing continuous aiding to the inertial sensors even during limited GPS satellite availability. To effectively exploit the capabilities of PF, advanced modeling for the stochastic drift of the vertically aligned gyroscope is used. In order to benefit from measurement updates for such drift, which are

  8. Tightly Coupled Low Cost 3D RISS/GPS Integration Using a Mixture Particle Filter for Vehicular Navigation

    PubMed Central

    Georgy, Jacques; Noureldin, Aboelmagd

    2011-01-01

    Satellite navigation systems such as the global positioning system (GPS) are currently the most common technique used for land vehicle positioning. However, in GPS-denied environments, there is an interruption in the positioning information. Low-cost micro-electro mechanical system (MEMS)-based inertial sensors can be integrated with GPS and enhance the performance in denied GPS environments. The traditional technique for this integration problem is Kalman filtering (KF). Due to the inherent errors of low-cost MEMS inertial sensors and their large stochastic drifts, KF, with its linearized models, has limited capabilities in providing accurate positioning. Particle filtering (PF) was recently suggested as a nonlinear filtering technique to accommodate for arbitrary inertial sensor characteristics, motion dynamics and noise distributions. An enhanced version of PF called the Mixture PF is utilized in this study to perform tightly coupled integration of a three dimensional (3D) reduced inertial sensors system (RISS) with GPS. In this work, the RISS consists of one single-axis gyroscope and a two-axis accelerometer used together with the vehicle’s odometer to obtain 3D navigation states. These sensors are then integrated with GPS in a tightly coupled scheme. In loosely-coupled integration, at least four satellites are needed to provide acceptable GPS position and velocity updates for the integration filter. The advantage of the tightly-coupled integration is that it can provide GPS measurement update(s) even when the number of visible satellites is three or lower, thereby improving the operation of the navigation system in environments with partial blockages by providing continuous aiding to the inertial sensors even during limited GPS satellite availability. To effectively exploit the capabilities of PF, advanced modeling for the stochastic drift of the vertically aligned gyroscope is used. In order to benefit from measurement updates for such drift, which are

  9. Integration of Petrophysical Methods and 3D Printing Technology to Replicate Reservoir Pore Systems

    NASA Astrophysics Data System (ADS)

    Ishutov, S.; Hasiuk, F.; Gray, J.; Harding, C.

    2014-12-01

    Pore-scale imaging and modeling are becoming routine geoscience techniques of reservoir analysis and simulation in oil and gas industry. Three-dimensional printing may facilitate the transformation of pore-space imagery into rock models, which can be compared to traditional laboratory methods and literature data. Although current methodologies for rapid rock modeling and printing obscure many details of grain geometry, computed tomography data is one route to refine pore networks and experimentally test hypotheses related to rock properties, such as porosity and permeability. This study uses three-dimensional printing as a novel way of interacting with x-ray computed tomography data from reservoir core plugs based on digital modeling of pore systems in coarse-grained sandstones and limestones. The advantages of using artificial rocks as a proxy are to better understand the contributions of pore system characteristics at various scales to petrophysical properties in oil and gas reservoirs. Pore radii of reservoir sandstones used in this study range from 1 to 100s of microns, whereas the pore radii for limestones vary from 0.01 to 10s of microns. The resolution of computed tomography imaging is ~10 microns; the resolution of 3D digital printing used in the study varies from 2.5 to 300 microns. For this technology to be useful, loss of pore network information must be minimized in the course of data acquisition, modeling, and production as well as verified against core-scale measurements. The ultimate goal of this study is to develop a reservoir rock "photocopier" that couples 3D scanning and modeling with 3D printing to reproduce a) petrophyscially accurate copies of reservoir pore systems and b) digitally modified pore systems for testing hypotheses about reservoir flow. By allowing us to build porous media with known properties (porosity, permeability, surface area), technology will also advance our understanding of the tools used to measure these quantities (e

  10. 3D Integrated geophysical-petrological modelling of the Iranian lithosphere

    NASA Astrophysics Data System (ADS)

    Mousavi, Naeim; Ardestani, Vahid E.; Ebbing, Jörg; Fullea, Javier

    2016-04-01

    The present-day Iranian Plateau is the result of complex tectonic processes associated with the Arabia-Eurasia Plate convergence at a lithospheric scale. In spite of previous mostly 2D geophysical studies, fundamental questions regarding the deep lithospheric and sub-lithospheric structure beneath Iran remain open. A robust 3D model of the thermochemical lithospheric structure in Iran is an important step toward a better understanding of the geological history and tectonic events in the area. Here, we apply a combined geophysical-petrological methodology (LitMod3D) to investigate the present-day thermal and compositional structure in the crust and upper mantle beneath the Arabia-Eurasia collision zone using a comprehensive variety of constraining data: elevation, surface heat flow, gravity potential fields, satellite gravity gradients, xenoliths and seismic tomography. Different mantle compositions were tested in our model based on local xenolith samples and global data base averages for different tectonothermal ages. A uniform mantle composition fails to explain the observed gravity field, gravity gradients and surface topography. A tectonically regionalized lithospheric mantle compositional model is able to explain all data sets including seismic tomography models. Our preliminary thermochemical lithospheric study constrains the depth to Moho discontinuity and intra crustal geometries including depth to sediments. We also determine the depth to Curie isotherm which is known as the base of magnetized crustal/uppermost mantle bodies. Discrepancies with respect to previous studies include mantle composition and the geometry of Moho and Lithosphere-Asthenosphere Boundary (LAB). Synthetic seismic Vs and Vp velocities match existing seismic tomography models in the area. In this study, depleted mantle compositions are modelled beneath cold and thick lithosphere in Arabian and Turan platforms. A more fertile mantle composition is found in collision zones. Based on our 3

  11. Monolithic microwave integrated circuits: Technology and design

    NASA Astrophysics Data System (ADS)

    Goyal, Ravender

    Theoretical and practical aspects of MMIC design are examined in a textbook intended for a senior or graduate engineering laboratory course. The individual chapters are contributed by specialists and cover fundamental MMIC characteristics and applications, the theory of microwave transmission, MMIC material and manufacturing technology, device modeling, amplifier design, nonlinear and control circuits, the TV-receive-only chip as a typical MMIC-based subsystem, design automation tools, on-wafer testing, MMIC packaging, and MMIC reliability. Extensive diagrams, drawings, graphs, photographs, and tables of numerical data are provided.

  12. Hybrid CMOS/Nanodevice Integrated Circuits Design and Fabrication

    DTIC Science & Technology

    2008-08-25

    This approach combines a semiconductor transistor system with a nanowire crossbar, with simple two-terminal nanodevices self-assembled at each...hybrid CMOS/nanodevice integrated circuits [10-12]. Such circuit combines a semiconductor transistors system with a nanowire crossbar, with simple two...both with and without embedded metallic clusters), self-assembled molecular monolayers, and thin chalcogenide and crystalline perovskite layers [20

  13. Development of integrated thermionic circuits for high-temperature applications

    NASA Technical Reports Server (NTRS)

    Mccormick, J. B.; Wilde, D.; Depp, S.; Hamilton, D. J.; Kerwin, W.; Derouin, C.; Roybal, L.; Wooley, R.

    1981-01-01

    Integrated thermionic circuits (ITC) capable of extended operation in ambient temperatures up to 500 C are studied. A set of practical design and performance equations is demonstrated. Experimental results are discussed in which both devices and simple circuits were successfully operated in 5000 C environments for extended periods. It is suggested that ITC's may become an important technology for high temperature instrumentation and control systems in geothermal and other high temperature environments.

  14. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    NASA Technical Reports Server (NTRS)

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

    1984-01-01

    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  15. One-Step Fabrication of a Microfluidic Device with an Integrated Membrane and Embedded Reagents by Multimaterial 3D Printing.

    PubMed

    Li, Feng; Smejkal, Petr; Macdonald, Niall P; Guijt, Rosanne M; Breadmore, Michael C

    2017-04-05

    One of the largest impediments in the development of microfluidic-based smart sensing systems is the manufacturability of integrated, complex devices. Here we propose multimaterial 3D printing for the fabrication of such devices in a single step. A microfluidic device containing an integrated porous membrane and embedded liquid reagents was made by 3D printing and applied for the analysis of nitrate in soil. The manufacture of the integrated, sealed device was realized as a single print within 30 min. The body of the device was printed in transparent acrylonitrile butadiene styrene (ABS) and contained a 400 μm wide structure printed from a commercially available composite filament. The composite filament can be turned into a porous material through dissolution of a water-soluble material. Liquid reagents were integrated by briefly pausing the printing before resuming for sealing the device. The devices were evaluated by the determination of nitrate in a soil slurry containing zinc particles for the reduction of nitrate to nitrite using the Griess reagent. Using a consumer digital camera, the linear range of the detector response ranged from 0 to 60 ppm, covering the normal range of nitrate in soil. To ensure that the sealing of the reagent chamber is maintained, aqueous reagents should be avoided. When using the nonaqueous reagent, the multimaterial device containing the Griess reagent could be stored for over 4 days but increased the detection range to 100-500 ppm. Multimaterial 3D printing is a potentially new approach for the manufacture of microfluidic devices with multiple integrated functional components.

  16. Localization and visualization of excess chemical potential in statistical mechanical integral equation theory 3D-HNC-RISM.

    PubMed

    Du, Qi-Shi; Liu, Peng-Jun; Huang, Ri-Bo

    2008-02-01

    In this study the excess chemical potential of the integral equation theory, 3D-RISM-HNC [Q. Du, Q. Wei, J. Phys. Chem. B 107 (2003) 13463-13470], is visualized in three-dimensional form and localized at interaction sites of solute molecule. Taking the advantage of reference interaction site model (RISM), the calculation equations of chemical excess potential are reformulized according to the solute interaction sites s in molecular space. Consequently the solvation free energy is localized at every interaction site of solute molecule. For visualization of the 3D-RISM-HNC calculation results, the excess chemical potentials are described using radial and three-dimensional diagrams. It is found that the radial diagrams of the excess chemical potentials are more sensitive to the bridge functions than the radial diagrams of solvent site density distributions. The diagrams of average excess chemical potential provide useful information of solute-solvent electrostatic and van der Waals interactions. The local description of solvation free energy at active sites of solute in 3D-RISM-HNC may broaden the application scope of statistical mechanical integral equation theory in solution chemistry and life science.

  17. Three-dimensional integrated circuits for lab-on-chip dielectrophoresis of nanometer scale particles

    NASA Astrophysics Data System (ADS)

    Dickerson, Samuel J.; Noyola, Arnaldo J.; Levitan, Steven P.; Chiarulli, Donald M.

    2007-01-01

    In this paper, we present a mixed-technology micro-system for electronically manipulating and optically detecting virusscale particles in fluids that is designed using 3D integrated circuit technology. During the 3D fabrication process, the top-most chip tier is assembled upside down and the substrate material is removed. This places the polysilicon layer, which is used to create geometries with the process' minimum feature size, in close proximity to a fluid channel etched into the top of the stack. By taking advantage of these processing features inherent to "3D chip-stacking" technology, we create electrode arrays that have a gap spacing of 270 nm. Using 3D CMOS technology also provides the ability to densely integrate analog and digital control circuitry for the electrodes by using the additional levels of the chip stack. We show simulations of the system with a physical model of a Kaposi's sarcoma-associated herpes virus, which has a radius of approximately 125 nm, being dielectrophoretically arranged into striped patterns. We also discuss how these striped patterns of trapped nanometer scale particles create an effective diffraction grating which can then be sensed with macro-scale optical techniques.

  18. Single Event Transients in Linear Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Buchner, Stephen; McMorrow, Dale

    2005-01-01

    On November 5, 2001, a processor reset occurred on board the Microwave Anisotropy Probe (MAP), a NASA mission to measure the anisotropy of the microwave radiation left over from the Big Bang. The reset caused the spacecraft to enter a safehold mode from which it took several days to recover. Were that to happen regularly, the entire mission would be compromised, so it was important to find the cause of the reset and, if possible, to mitigate it. NASA assembled a team of engineers that included experts in radiation effects to tackle the problem. The first clue was the observation that the processor reset occurred during a solar event characterized by large increases in the proton and heavy ion fluxes emitted by the sun. To the radiation effects engineers on the team, this strongly suggested that particle radiation might be the culprit, particularly when it was discovered that the reset circuit contained three voltage comparators (LM139). Previous testing revealed that large voltage transients, or glitches appeared at the output of the LM139 when it was exposed to a beam of heavy ions [NI96]. The function of the reset circuit was to monitor the supply voltage and to issue a reset command to the processor should the voltage fall below a reference of 2.5 V [PO02]. Eventually, the team of engineers concluded that ionizing particle radiation from the solar event produced a negative voltage transient on the output of one of the LM139s sufficiently large to reset the processor on MAP. Fortunately, as of the end of 2004, only two such resets have occurred. The reset on MAP was not the first malfunction on a spacecraft attributed to a transient. That occurred shortly after the launch of NASA s TOPEX/Poseidon satellite in 1992. It was suspected, and later confirmed, that an anomaly in the Earth Sensor was caused by a transient in an operational amplifier (OP-15) [KO93]. Over the next few years, problems on TDRS, CASSINI, [PR02] SOHO [HA99,HA01] and TERRA were also attributed

  19. A 3-D skeleton model & SEMG approach for integrated neck and low back pain analysis test batteries.

    PubMed

    D'amico, M; D'amico, G; Frascarello, M; Paniccia, M; Roncoletta, P; Vallasciani, M

    2008-01-01

    Since several years our group is working on a project to merge into a full 3D reliable and detailed human skeleton representation various segmental biomechanical models presented in literature. The obtained 3D skeleton model is fully parametric and can be fitted to each subject anthropometric characteristics. A non-ionising approach based on 3D opto-electronic measurements of body landmarks labelled by passive markers has been chosen to build the 3D parametric biomechanical skeleton model. A special focus has been devoted to identify and model the spine with a correct degree of accuracy and reliability. In spine pain related pathologies is of major importance the evaluation of functional limitations associated. This requires to integrate morphological characteristics with information deriving from other measurements devices as force platform data, surface EMG, foot pressure maps. The aim of this study is to present a multi-factorial approach which integrates rachis morphological characteristics with full skeleton kinematic, dynamic and SEMG measurements to quantify spine function and mobility in particular for neck and low back pain. A set of clinical-biomechanical tests have been implemented. Static posture characteristics are first evaluated. After that, patient is asked to perform specific motion test batteries in order to fully measure the whole ROMs (spine angles ranges and spine shape modifications) for Axial rotations, forward-backward flexion-extension, lateral bendings per each spine functional units (Skull and neck, thoracic and lumbar districts). During forward bending also a digital Schober test is performed. Such data are correlated to simultaneous SEMG muscle activities recording to investigate motor co-ordination/dysfunction as well as the presence absence of flexion-relaxation phenomena associated to pain.

  20. Integrated circuit for SAW and MEMS sensors

    NASA Astrophysics Data System (ADS)

    Fischer, Wolf-Joachim; Koenig, Peter; Ploetner, Matthias; Hermann, Rudiger; Stab, Helmut

    2001-11-01

    The sensor processor circuit has been developed for hand-held devices used in industrial and environmental applications, such as on-line process monitoring. Thereby devices with SAW sensors or MEMS resonators will benefit from this processor especially. Up to 8 sensors can be connected to the circuit as multisensors or sensor arrays. Two sensor processors SP1 and SP2 for different applications are presented in this paper. The SP-1 chip has a PCMCIA interface which can be used for the program and data transfer. SAW sensors which are working in the frequency range from 80 MHz to 160 MHz can be connected to the processor directly. It is possible to use the new SP-2 chip fabricated in a 0.5(mu) CMOS process for SAW devices with a maximum frequency of 600 MHz. An on-chip analog-digital-converter (ADC) and 6 PWM modules support the development of high-miniaturized intelligent sensor systems We have developed a multi-SAW sensor system with this ASIC that manages the requirements on control as well as signal generation and storage and provides an interface to the PC and electronic devices on the board. Its low power consumption and its PCMCIA plug fulfil the requirements of small size and mobility. For this application sensors have been developed to detect hazardous gases in ambient air. Sensors with differently modified copper-phthalocyanine films are capable of detecting NO2 and O3, whereas those with a hyperbranched polyester film respond to NH3.

  1. Silica Integrated Optical Circuits Based on Glass Photosensitivity

    NASA Technical Reports Server (NTRS)

    Abushagur, Mustafa A. G.

    1999-01-01

    Integrated optical circuits play a major rule in the new photonics technology both in communication and sensing due to their small size and compatibility with integrated circuits. Currently integrated optical circuits (IOCs) are fabricated using similar manufacturing to those used in the semiconductor industry. In this study we are considering a new technique to fabricate IOCs which does not require layers of photolithography, depositing and etching. This method is based on the photosensitivity of germanosilicate glasses. Waveguides and other IOC devises can be patterned in these glasses by exposing them using UV lasers. This exposure by UV light changes the index of refraction of the germanosilicate glass. This technique enjoys both the simplicity and flexibility of design and fabrication with also the potential of being fast and low cost.

  2. Self-integration of nanowires into circuits via guided growth.

    PubMed

    Schvartzman, Mark; Tsivion, David; Mahalu, Diana; Raslin, Olga; Joselevich, Ernesto

    2013-09-17

    The ability to assemble discrete nanowires (NWs) with nanoscale precision on a substrate is the key to their integration into circuits and other functional systems. We demonstrate a bottom-up approach for massively parallel deterministic assembly of discrete NWs based on surface-guided horizontal growth from nanopatterned catalyst. The guided growth and the catalyst nanopattern define the direction and length, and the position of each NW, respectively, both with unprecedented precision and yield, without the need for postgrowth assembly. We used these highly ordered NW arrays for the parallel production of hundreds of independently addressable single-NW field-effect transistors, showing up to 85% yield of working devices. Furthermore, we applied this approach for the integration of 14 discrete NWs into an electronic circuit operating as a three-bit address decoder. These results demonstrate the feasibility of massively parallel "self-integration" of NWs into electronic circuits and functional systems based on guided growth.

  3. Circulators for microwave and millimeter-wave integrated circuits

    NASA Astrophysics Data System (ADS)

    Schloemann, Ernst F.

    1988-02-01

    The requirements for circulators for use in combination with microwave and millimeter-wave integrated circuits are reviewed, with special emphasis on modules for phased-array antennas. Recent advances in broadbanding and in miniaturization are summarized. Novel types of circulators that are fabricated by attaching a ferrite disc and a suitable coupling structure to the surface of a dielectric or semiconductor substrate ('quasi-monolithic' integration) are described. Methods for achieving complete monolithic integration are also discussed.

  4. Photonic integrated circuits based on silica and polymer PLC

    NASA Astrophysics Data System (ADS)

    Izuhara, T.; Fujita, J.; Gerhardt, R.; Sui, B.; Lin, W.; Grek, B.

    2013-03-01

    Various methods of hybrid integration of photonic circuits are discussed focusing on merits and challenges. Material platforms discussed in this report are mainly polymer and silica. We categorize the hybridization methods using silica and polymer waveguides into two types, chip-to-chip and on-chip integration. General reviews of these hybridization technologies from the past works are reviewed. An example for each method is discussed in details. We also discuss current status of our silica PLC hybrid integration technology.

  5. 3D design activities at Fermilab: Opportunities for physics

    SciTech Connect

    Yarema, Raymond; Deptuch, Grezgorz; Hoff, Jim; Shenai, Alpana; Trimpl, Marcel; Zimmerman, Tom; Demarteau, Marcel; Liptona, Ron; Christian, Dave; /Fermilab

    2009-01-01

    Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006. These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds. Since then, the interest within the High Energy Physics community has grown considerably. This paper will present an overview of the activities at Fermilab over the last 3 years which have helped spark this interest.

  6. Integration of camera and range sensors for 3D pose estimation in robot visual servoing

    NASA Astrophysics Data System (ADS)

    Hulls, Carol C. W.; Wilson, William J.

    1998-10-01

    Range-vision sensor systems can incorporate range images or single point measurements. Research incorporating point range measurements has focused on the area of map generation for mobile robots. These systems can utilize the fact that the objects sensed tend to be large and planar. The approach presented in this paper fuses information obtained from a point range measurement with visual information to produce estimates of the relative 3D position and orientation of a small, non-planar object with respect to a robot end- effector. The paper describes a real-time sensor fusion system for performing dynamic visual servoing using a camera and a point laser range sensor. The system is based upon the object model reference approach. This approach, which can be used to develop multi-sensor fusion systems that fuse dynamic sensor data from diverse sensors in real-time, uses a description of the object to be sensed in order to develop a combined observation-dependency sensor model. The range- vision sensor system is evaluated in terms of accuracy and robustness. The results show that the use of a range sensor significantly improves the system performance when there is poor or insufficient camera information. The system developed is suitable for visual servoing applications, particularly robot assembly operations.

  7. Integration of Libration Point Orbit Dynamics into a Universal 3-D Autonomous Formation Flying Algorithm

    NASA Technical Reports Server (NTRS)

    Folta, David; Bauer, Frank H. (Technical Monitor)

    2001-01-01

    The autonomous formation flying control algorithm developed by the Goddard Space Flight Center (GSFC) for the New Millennium Program (NMP) Earth Observing-1 (EO-1) mission is investigated for applicability to libration point orbit formations. In the EO-1 formation-flying algorithm, control is accomplished via linearization about a reference transfer orbit with a state transition matrix (STM) computed from state inputs. The effect of libration point orbit dynamics on this algorithm architecture is explored via computation of STMs using the flight proven code, a monodromy matrix developed from a N-body model of a libration orbit, and a standard STM developed from the gravitational and coriolis effects as measured at the libration point. A comparison of formation flying Delta-Vs calculated from these methods is made to a standard linear quadratic regulator (LQR) method. The universal 3-D approach is optimal in the sense that it can be accommodated as an open-loop or closed-loop control using only state information.

  8. Thermally-induced voltage alteration for integrated circuit analysis

    DOEpatents

    Cole, Jr., Edward I.

    2000-01-01

    A thermally-induced voltage alteration (TIVA) apparatus and method are disclosed for analyzing an integrated circuit (IC) either from a device side of the IC or through the IC substrate to locate any open-circuit or short-circuit defects therein. The TIVA apparatus uses constant-current biasing of the IC while scanning a focused laser beam over electrical conductors (i.e. a patterned metallization) in the IC to produce localized heating of the conductors. This localized heating produces a thermoelectric potential due to the Seebeck effect in any conductors with open-circuit defects and a resistance change in any conductors with short-circuit defects, both of which alter the power demand by the IC and thereby change the voltage of a source or power supply providing the constant-current biasing. By measuring the change in the supply voltage and the position of the focused and scanned laser beam over time, any open-circuit or short-circuit defects in the IC can be located and imaged. The TIVA apparatus can be formed in part from a scanning optical microscope, and has applications for qualification testing or failure analysis of ICs.

  9. Integrating eye tracking and motion sensor on mobile phone for interactive 3D display

    NASA Astrophysics Data System (ADS)

    Sun, Yu-Wei; Chiang, Chen-Kuo; Lai, Shang-Hong

    2013-09-01

    In this paper, we propose an eye tracking and gaze estimation system for mobile phone. We integrate an eye detector, cornereye center and iso-center to improve pupil detection. The optical flow information is used for eye tracking. We develop a robust eye tracking system that integrates eye detection and optical-flow based image tracking. In addition, we further incorporate the orientation sensor information from the mobile phone to improve the eye tracking for accurate gaze estimation. We demonstrate the accuracy of the proposed eye tracking and gaze estimation system through experiments on some public video sequences as well as videos acquired directly from mobile phone.

  10. Practical applications of digital integrated circuits. Part 3: Practical sequential theory and synchronous circuits

    NASA Technical Reports Server (NTRS)

    1973-01-01

    Here, the 7400 line of transistor to transistor logic (TTL) devices is emphasized almost exclusively where hardware is concerned. However, it should be noted that the logic theory contained herein applies to all hardware. Discussed here are synchronous binary UP counters, synchronous DOWN and UP/DOWN counters, integrated circuit counters, shift registers, sequential techniques, and designing sequential counting machines.

  11. The Integration of GPR, GIS, and GPS for 3D Soil Morphologic Models

    NASA Astrophysics Data System (ADS)

    Tischler, M.; Collins, M. E.

    2005-05-01

    Ground-Penetrating Radar (GPR) has become a useful and efficient instrument for gathering information about subsurface diagnostic horizons in Florida soils. Geographic Information Systems (GIS) are a popular and valuable tool for spatial data analysis of real world features in a digital environment. Ground-Penetrating Radar can be linked to GIS by using Global Positioning Systems (GPS). By combining GPR, GPS, and GIS technologies, a more detailed geophysical survey can be completed for an area of interest by integratinghydrologic, pedologic, and geologic data. Thus, the objectives of this research were to identify subsurface soil layers using GPR and their geographic position with a highly accurate GPS; to develop a procedure to import GPR data into a popular software package, such as ArcGIS, and; to create 3D subsurface models based on the imported GPR data. The site for this study was the Plant Science Research and Education Center in Marion County, Florida. The soils are characterized by Recent-Pleistocene-age sand over the clayey, marine deposited Plio-Miocene-age Hawthorn Formation which drapes the Eocene-age Ocala Limestone. Consequently, soils in the research area vary from deep quartz sands (Typic Quartzipsamments) to shallow outcrops of the Hawthorn Formation (Arenic Hapludalfs). A GPR survey was performed on a 160 m x 320 m grid to gather data for processing. Four subsurface models estimating the depth to argillic horizon were created using a variety of specialized GPR data filters and geostatistical data analyses. The models were compared with ground-truth points that measured the depth to argillic horizon to validate each model and calculate error metrics. These models may assist research station personnel to determine best management practices (including experimental plot placement, irrigation management, fertilizer treatment, and pesticide applications). In addition, the developed methodology exploits the potential of combining GPR and GIS.

  12. Integrated logic circuits using single-atom transistors.

    PubMed

    Mol, J A; Verduijn, J; Levine, R D; Remacle, F; Rogge, S

    2011-08-23

    Scaling down the size of computing circuits is about to reach the limitations imposed by the discrete atomic structure of matter. Reducing the power requirements and thereby dissipation of integrated circuits is also essential. New paradigms are needed to sustain the rate of progress that society has become used to. Single-atom transistors, SATs, cascaded in a circuit are proposed as a promising route that is compatible with existing technology. We demonstrate the use of quantum degrees of freedom to perform logic operations in a complementary-metal-oxide-semiconductor device. Each SAT performs multilevel logic by electrically addressing the electronic states of a dopant atom. A single electron transistor decodes the physical multivalued output into the conventional binary output. A robust scalable circuit of two concatenated full adders is reported, where by utilizing charge and quantum degrees of freedom, the functionality of the transistor is pushed far beyond that of a simple switch.

  13. A Integrated Service Platform for Remote Sensing Image 3D Interpretation and Draughting based on HTML5

    NASA Astrophysics Data System (ADS)

    LIU, Yiping; XU, Qing; ZhANG, Heng; LV, Liang; LU, Wanjie; WANG, Dandi

    2016-11-01

    The purpose of this paper is to solve the problems of the traditional single system for interpretation and draughting such as inconsistent standards, single function, dependence on plug-ins, closed system and low integration level. On the basis of the comprehensive analysis of the target elements composition, map representation and similar system features, a 3D interpretation and draughting integrated service platform for multi-source, multi-scale and multi-resolution geospatial objects is established based on HTML5 and WebGL, which not only integrates object recognition, access, retrieval, three-dimensional display and test evaluation but also achieves collection, transfer, storage, refreshing and maintenance of data about Geospatial Objects and shows value in certain prospects and potential for growth.

  14. Bright 3D display, native and integrated on-chip or system-level

    NASA Astrophysics Data System (ADS)

    Ellwood, Sutherland C., Jr.

    2011-06-01

    Photonica, Inc. has pioneered the use of magneto-optics and hybrid technologies in visual display systems to create arrays addressing hi-speed, solid-state modulators up to 1K times faster that DMD/DLP, yielding high frame-rate and extremely high net native resolution allowing for full-duplication of right eye and left eye modulators at 1080p, DCI 2K, 4K and other specified resolution requirements. The technology enables high-transmission (brightness) per frame. In one version, each integrated image-engine assembly processes binocular frames simultaneously, employing simultaneous right eye/left eye channels, either polarization-based or "Infitec" color-band based channels, as well as pixel-vector based systems. In another version, a multi-chip, massively parallel signal-processing architecture integrates pixel-signal channels to yield simultaneous binocular frames. This may be combined with on-chip integration. Channels are integrated either through optics elements on-chip or through fiber network or both.

  15. Encrypting 2D/3D image using improved lensless integral imaging in Fresnel domain

    NASA Astrophysics Data System (ADS)

    Li, Xiao-Wei; Wang, Qiong-Hua; Kim, Seok-Tae; Lee, In-Kwon

    2016-12-01

    We propose a new image encryption technique, for the first time to our knowledge, combined Fresnel transform with the improved lensless integral imaging technique. In this work, before image encryption, the input image is first recorded into an elemental image array (EIA) by using the improved lensless integral imaging technique. The recorded EIA is encrypted into random noise by use of two phase masks located in the Fresnel domain. The positions of phase masks and operation wavelength, as well as the integral imaging system parameters are used as encryption keys that can ensure security. Compared with previous works, the main novelty of this proposed method resides in the fact that the elemental images possess distributed memory characteristic, which greatly improved the robustness of the image encryption algorithm. Meanwhile, the proposed pixel averaging algorithm can effectively address the overlapping problem existing in the computational integral imaging reconstruction process. Numerical simulations are presented to demonstrate the feasibility and effectiveness of the proposed method. Results also indicate the high robustness against data loss attacks.

  16. Topological Properties of Some Integrated Circuits for Very Large Scale Integration Chip Designs

    NASA Astrophysics Data System (ADS)

    Swanson, S.; Lanzerotti, M.; Vernizzi, G.; Kujawski, J.; Weatherwax, A.

    2015-03-01

    This talk presents topological properties of integrated circuits for Very Large Scale Integration chip designs. These circuits can be implemented in very large scale integrated circuits, such as those in high performance microprocessors. Prior work considered basic combinational logic functions and produced a mathematical framework based on algebraic topology for integrated circuits composed of logic gates. Prior work also produced an historically-equivalent interpretation of Mr. E. F. Rent's work for today's complex circuitry in modern high performance microprocessors, where a heuristic linear relationship was observed between the number of connections and number of logic gates. This talk will examine topological properties and connectivity of more complex functionally-equivalent integrated circuits. The views expressed in this article are those of the author and do not reflect the official policy or position of the United States Air Force, Department of Defense or the U.S. Government.

  17. A medical application integrating remote 3D visualization tools to access picture archiving and communication system on mobile devices.

    PubMed

    He, Longjun; Ming, Xing; Liu, Qian

    2014-04-01

    With computing capability and display size growing, the mobile device has been used as a tool to help clinicians view patient information and medical images anywhere and anytime. However, for direct interactive 3D visualization, which plays an important role in radiological diagnosis, the mobile device cannot provide a satisfactory quality of experience for radiologists. This paper developed a medical system that can get medical images from the picture archiving and communication system on the mobile device over the wireless network. In the proposed application, the mobile device got patient information and medical images through a proxy server connecting to the PACS server. Meanwhile, the proxy server integrated a range of 3D visualization techniques, including maximum intensity projection, multi-planar reconstruction and direct volume rendering, to providing shape, brightness, depth and location information generated from the original sectional images for radiologists. Furthermore, an algorithm that changes remote render parameters automatically to adapt to the network status was employed to improve the quality of experience. Finally, performance issues regarding the remote 3D visualization of the medical images over the wireless network of the proposed application were also discussed. The results demonstrated that this proposed medical application could provide a smooth interactive experience in the WLAN and 3G networks.

  18. The integration of 3D carbon-electrode dielectrophoresis on a CD-like centrifugal microfluidic platform.

    PubMed

    Martinez-Duarte, Rodrigo; Gorkin, Robert A; Abi-Samra, Kameel; Madou, Marc J

    2010-04-21

    We introduce the integration of a novel dielectrophoresis (DEP)-assisted filter with a compact disk (CD)-based centrifugal platform. Carbon-electrode dielectrophoresis (carbon-DEP) refers to the use of carbon electrodes to induce DEP. In this work, 3D carbon electrodes are fabricated using the C-MEMS technique and are used to implement a DEP-enabled active filter to trap particles of interest. Compared to traditional planar metal electrodes, 3D carbon electrodes allow for superior filtering efficiency. The system includes mounting modular 3D carbon-DEP chips on an electrically interfaced rotating disk. This allows simple centrifugal pumping to replace the large footprint syringe pump approaches commonly used in DEP systems. The advantages of the CD setup include not only a reduced footprint, but also complexity and cost reduction by eliminating expensive precision pumps and fluidic interconnects. To demonstrate the viability of this system we quantified the filter efficiency in the DEP trapping of yeast cells from a mix of latex and yeast cells. Results demonstrate selective filtering at flow rates up to 35 microl min(-1). The impact of electrode height, DEP chip misalignment and particle sedimentation on filter efficiency and the advantages this system represents are analyzed. The ultimate goal is to obtain an automated platform for bioparticle sorting with application in different fields such as point-of-care diagnostics and cell-based therapies.

  19. Architectural integration of the components necessary for electrical energy storage on the nanoscale and in 3D.

    PubMed

    Rhodes, Christopher P; Long, Jeffrey W; Pettigrew, Katherine A; Stroud, Rhonda M; Rolison, Debra R

    2011-04-01

    We describe fabrication of three-dimensional (3D) multifunctional nanoarchitectures in which the three critical components of a battery--cathode, separator/electrolyte, and anode--are internally assembled as tricontinuous nanoscopic phases. The architecture is initiated using sol-gel chemistry and processing to erect a 3D self-wired nanoparticulate scaffold of manganese oxide (>200 m(2) g(-1)) with a continuous, open, and mesoporous void volume. The integrated 3D system is generated by exhaustive coverage of the oxide network by an ultrathin, conformal layer of insulating polymer that forms via self-limiting electrodeposition of poly(phenylene oxide). The remaining interconnected void volume is then wired with RuO(2) nanowebs using subambient thermal decomposition of RuO(4). Transmission electron microscopy demonstrates that the three nanoscopic charge-transfer functional components--manganese oxide, polymer separator/cation conductor, and RuO(2)--exhibit the stratified, tricontinuous design of the phase-by-phase construction. This architecture contains all three components required for a solid-state energy storage device within a void volume sized at tens of nanometres such that nanometre-thick distances are established between the opposing electrodes. We have now demonstrated the ability to assemble multifunctional energy-storage nanoarchitectures on the nanoscale and in three dimensions.

  20. Printed organic thin-film transistor-based integrated circuits

    NASA Astrophysics Data System (ADS)

    Mandal, Saumen; Noh, Yong-Young

    2015-06-01

    Organic electronics is moving ahead on its journey towards reality. However, this technology will only be possible when it is able to meet specific criteria including flexibility, transparency, disposability and low cost. Printing is one of the conventional techniques to deposit thin films from solution-based ink. It is used worldwide for visual modes of information, and it is now poised to enter into the manufacturing processes of various consumer electronics. The continuous progress made in the field of functional organic semiconductors has achieved high solubility in common solvents as well as high charge carrier mobility, which offers ample opportunity for organic-based printed integrated circuits. In this paper, we present a comprehensive review of all-printed organic thin-film transistor-based integrated circuits, mainly ring oscillators. First, the necessity of all-printed organic integrated circuits is discussed; we consider how the gap between printed electronics and real applications can be bridged. Next, various materials for printed organic integrated circuits are discussed. The features of these circuits and their suitability for electronics using different printing and coating techniques follow. Interconnection technology is equally important to make this product industrially viable; much attention in this review is placed here. For high-frequency operation, channel length should be sufficiently small; this could be achievable with a combination of surface treatment-assisted printing or laser writing. Registration is also an important issue related to printing; the printed gate should be perfectly aligned with the source and drain to minimize parasitic capacitances. All-printed organic inverters and ring oscillators are discussed here, along with their importance. Finally, future applications of all-printed organic integrated circuits are highlighted.

  1. Integrated 3D geophysical and geological modelling of the Hercynian Suture Zone in the Champtoceaux area (south Brittany, France)

    NASA Astrophysics Data System (ADS)

    Martelet, G.; Calcagno, P.; Gumiaux, C.; Truffert, C.; Bitri, A.; Gapais, D.; Brun, J. P.

    2004-04-01

    This paper combines geological knowledge and geophysical imagery at the crustal scale to model the 3D geometry of a segment of the Hercynian suture zone of western Europe in the Champtoceaux area (Brittany, France). The Champtoceaux complex consists of a stack of metamorphic nappes of gneisses and micaschists, with eclogite-bearing units. The exhumation of the complex, during early Carboniferous times, was accompanied by deformation during regional dextral strike-slip associated with a major Hercynian shear zone (the South Armorican Shear Zone, SASZ). Dextral shearing produced a km-scale antiformal structure with a steeply dipping axial plane and a steeply eastward plunging axis. Armor 2 deep seismic profile shows that the regional structure was cut by a set of faults with northward thrusting components. Based on the seismic constraint, direct 2D crustal-scale modelling was performed throughout the Champtoceaux fold on seven radial gravity profiles, also using geological data, and density measurements from field and drill-hole samples. The 3D integration of the cross-sections, the digitised geological map, and the structural information (foliation dips) insure the geometrical and topological consistency of all sources of data. The 2D information is interpolated to the whole 3D space using a geostatistical analysis. Finally, the 3D gravity contribution of the resulting model is computed taking into account densities for each modelled geological body and compared to the Bouguer anomaly. The final 3D model is thus compatible with the seismic and gravity data, as well as with geological data. Main geological results derived from the modelling are (i) the overall 3D geometry of the south dipping thrust system interpreted on the seismic profile emphasises northward thrusting and folding of the Champtoceaux complex which was coeval with strike-slip along the South Armorican Shear Zone; (ii) the gravity modelling suggests the presence of a relatively dense body below the

  2. 3D-integrated optics component for astronomical spectro-interferometry.

    PubMed

    Saviauk, Allar; Minardi, Stefano; Dreisow, Felix; Nolte, Stefan; Pertsch, Thomas

    2013-07-01

    We present the experimental characterization of a spectro-interferometry setup based on a laser-written three-dimensional integrated optics component. By exploiting the interferometric capability of a two-dimensional array of evanescently coupled waveguides, we measure the mutual coherence properties of three different polychromatic optical fields. Direct application of our discrete beam combiner (DBC) component is astronomical interferometry. The DBC can be scaled up to combine arbitrary large number of telescopes for the determination of coherence properties of astronomical targets. Besides applications to astronomy, the DBC can be also applied to optical integrated metrology system requiring nanometric position monitoring. The working principle, the experimental setup used, and the broadband performance of the DBC are presented.

  3. 5D Data Modelling: Full Integration of 2D/3D Space, Time and Scale Dimensions

    NASA Astrophysics Data System (ADS)

    van Oosterom, Peter; Stoter, Jantien

    This paper proposes an approach for data modelling in five dimensions. Apart from three dimensions for geometrical representation and a fourth dimension for time, we identify scale as fifth dimensional characteristic. Considering scale as an extra dimension of geographic information, fully integrated with the other dimensions, is new. Through a formal definition of geographic data in a conceptual 5D continuum, the data can be handled by one integrated approach assuring consistency across scale and time dimensions. Because the approach is new and challenging, we choose to step-wise studying several combinations of the five dimensions, ultimately resulting in the optimal 5D model. We also propose to apply mathematical theories on multidimensional modelling to well established principles of multidimensional modelling in the geo-information domain. The result is a conceptual full partition of the 3Dspace+time+scale space (i.e. no overlaps, no gaps) realised in a 5D data model implemented in a Database Management System.

  4. Rapid Low-Temperature 3D Integration of Silicon Nanowires on Flexible Substrates.

    PubMed

    Kim, Yoonkap; Kim, Han-Jung; Kim, Jae-Hyun; Choi, Dae-Geun; Choi, Jun-Hyuk; Jung, Joo-Yun; Jeon, Sohee; Lee, Eung-Sug; Jeong, Jun-Ho; Lee, Jihye

    2015-08-26

    The vertical integration of 1D nanostructures onto the 2D substrates has the potential to offer significant performance gains to flexible electronic devices due to high integration density, large surface area, and improved light absorption and trapping. A simple, rapid, and low temperature transfer bonding method has been developed for this purpose. Ultrasonic vibration is used to achieve a low temperature bonding within a few seconds, resulting in a polymer-matrix-free, electrically conducting vertical assembly of silicon nanowires (SiNWs) with a graphene/PET substrate. The microscopic structure, and mechanical and electrical characteristics of the interface between the transferred SiNW array and graphene layer are subsequently investigated, revealing that this creates a mechanically robust and electrically Ohmic contact. This newly developed ultrasonic transfer bonding technique is also found to be readily adaptable for diverse substrates of both metal and polymer. It is therefore considered as a valuable technique for integrating 1D vertical nanostructures onto the 2D flexible substrates for flexible photovoltaics, energy storage, and water splitting systems.

  5. Modular packaging technique for combining integrated circuits and discrete components

    NASA Technical Reports Server (NTRS)

    Lacchia, J. F.

    1969-01-01

    Technique for packaging electronic modules interconnects integrated circuits and discrete components by means of beryllium-copper strips in a molded diallyphthalate tray. Simple girder-like construction provides ease of assembly, high rigidity, excellent vibration resistance, and good heat dissipation characteristics.

  6. 1998 technology roadmap for integrated circuits used in critical applications

    SciTech Connect

    Dellin, T.A.

    1998-09-01

    Integrated Circuits (ICs) are being extensively used in commercial and government applications that have extreme consequences of failure. The rapid evolution of the commercial microelectronics industry presents serious technical and supplier challenges to this niche critical IC marketplace. This Roadmap was developed in conjunction with the Using ICs in Critical Applications Workshop which was held in Albuquerque, NM, November 11--12, 1997.

  7. FASTHELP. Integrated Circuit Failure Analysis Hypertext Help System

    SciTech Connect

    Henderson, C; Barton, D; Campbell, A; Cole, E; Mikawa, R E; Peterson, K A; Rife, J L; Soden, J M

    1994-09-30

    This software assists a failure analyst performing failure analysis on integrated circuits. The software can also be used to train inexperienced failure analysts. The software also provides a method for storing information and making it easily available to experienced failure analysts.

  8. Integrated circuit with dissipative layer for photogenerated carriers

    DOEpatents

    Myers, D.R.

    1989-09-12

    The sensitivity of an integrated circuit to single-event upsets is decreased by providing a dissi The U.S. Government has rights in this invention pursuant to Contract No. DE-ACO4-76DP00789 between the Department of Energy and AT&T Technologies, Inc.

  9. Integrated circuit with dissipative layer for photogenerated carriers

    DOEpatents

    Myers, David R.

    1989-01-01

    The sensitivity of an integrated circuit to single-event upsets is decreased by providing a dissi The U.S. Government has rights in this invention pursuant to Contract No. DE-ACO4-76DP00789 between the Department of Energy and AT&T Technologies, Inc.

  10. Bioluminescent bioreporter integrated circuit devices and methods for detecting ammonia

    DOEpatents

    Simpson, Michael L [Knoxville, TN; Paulus, Michael J [Knoxville, TN; Sayler, Gary S [Blaine, TN; Applegate, Bruce M [West Lafayette, IN; Ripp, Steven A [Knoxville, TN

    2007-04-24

    Monolithic bioelectronic devices for the detection of ammonia includes a microorganism that metabolizes ammonia and which harbors a lux gene fused with a heterologous promoter gene stably incorporated into the chromosome of the microorganism and an Optical Application Specific Integrated Circuit (OASIC). The microorganism is generally a bacterium.

  11. Integrated circuit with dissipative layer for photogenerated carriers

    DOEpatents

    Myers, D.R.

    1988-04-20

    The sensitivity of an integrated circuit to single-event upsets is decreased by providing a dissipative layer of silicon nitride between a silicon substrate and the active device. Free carriers generated in the substrate are dissipated by the layer before they can build up charge on the active device. 1 fig.

  12. Chemical vapor deposition for automatic processing of integrated circuits

    NASA Technical Reports Server (NTRS)

    Kennedy, B. W.

    1980-01-01

    Chemical vapor deposition for automatic processing of integrated circuits including the wafer carrier and loading from a receiving air track into automatic furnaces and unloading on to a sending air track is discussed. Passivation using electron beam deposited quartz is also considered.

  13. Evaluation performance of digital integrated circuits while exposed to radiation

    NASA Astrophysics Data System (ADS)

    Barbashov, V. M.; Trushkin, N. S.

    2016-10-01

    The methods of functional-logical simulation of digital integrated circuits (ICs) exposed to radiation are observed. It is shown that in a number of cases functional and electrical deterioration of ICs performances have both deterministic and non-deterministic nature. Methods for simulating IC failure exposed to radiation based on the model of fuzzy digital machine and Brauer probabilistic reliability machine are proposed.

  14. Integrating Sensors into a Marine Drone for Bathymetric 3D Surveys in Shallow Waters.

    PubMed

    Giordano, Francesco; Mattei, Gaia; Parente, Claudio; Peluso, Francesco; Santamaria, Raffaele

    2015-12-29

    This paper demonstrates that accurate data concerning bathymetry as well as environmental conditions in shallow waters can be acquired using sensors that are integrated into the same marine vehicle. An open prototype of an unmanned surface vessel (USV) named MicroVeGA is described. The focus is on the main instruments installed on-board: a differential Global Position System (GPS) system and single beam echo sounder; inertial platform for attitude control; ultrasound obstacle-detection system with temperature control system; emerged and submerged video acquisition system. The results of two cases study are presented, both concerning areas (Sorrento Marina Grande and Marechiaro Harbour, both in the Gulf of Naples) characterized by a coastal physiography that impedes the execution of a bathymetric survey with traditional boats. In addition, those areas are critical because of the presence of submerged archaeological remains that produce rapid changes in depth values. The experiments confirm that the integration of the sensors improves the instruments' performance and survey accuracy.

  15. Integration of GIS, Geostatistics, and 3-D Technology to Assess the Spatial Distribution of Soil Moisture

    NASA Technical Reports Server (NTRS)

    Betts, M.; Tsegaye, T.; Tadesse, W.; Coleman, T. L.; Fahsi, A.

    1998-01-01

    The spatial and temporal distribution of near surface soil moisture is of fundamental importance to many physical, biological, biogeochemical, and hydrological processes. However, knowledge of these space-time dynamics and the processes which control them remains unclear. The integration of geographic information systems (GIS) and geostatistics together promise a simple mechanism to evaluate and display the spatial and temporal distribution of this vital hydrologic and physical variable. Therefore, this research demonstrates the use of geostatistics and GIS to predict and display soil moisture distribution under vegetated and non-vegetated plots. The research was conducted at the Winfred Thomas Agricultural Experiment Station (WTAES), Hazel Green, Alabama. Soil moisture measurement were done on a 10 by 10 m grid from tall fescue grass (GR), alfalfa (AA), bare rough (BR), and bare smooth (BS) plots. Results indicated that variance associated with soil moisture was higher for vegetated plots than non-vegetated plots. The presence of vegetation in general contributed to the spatial variability of soil moisture. Integration of geostatistics and GIS can improve the productivity of farm lands and the precision of farming.

  16. Integrating Sensors into a Marine Drone for Bathymetric 3D Surveys in Shallow Waters

    PubMed Central

    Giordano, Francesco; Mattei, Gaia; Parente, Claudio; Peluso, Francesco; Santamaria, Raffaele

    2015-01-01

    This paper demonstrates that accurate data concerning bathymetry as well as environmental conditions in shallow waters can be acquired using sensors that are integrated into the same marine vehicle. An open prototype of an unmanned surface vessel (USV) named MicroVeGA is described. The focus is on the main instruments installed on-board: a differential Global Position System (GPS) system and single beam echo sounder; inertial platform for attitude control; ultrasound obstacle-detection system with temperature control system; emerged and submerged video acquisition system. The results of two cases study are presented, both concerning areas (Sorrento Marina Grande and Marechiaro Harbour, both in the Gulf of Naples) characterized by a coastal physiography that impedes the execution of a bathymetric survey with traditional boats. In addition, those areas are critical because of the presence of submerged archaeological remains that produce rapid changes in depth values. The experiments confirm that the integration of the sensors improves the instruments’ performance and survey accuracy. PMID:26729117

  17. Uncertainty preserving patch-based online modeling for 3D model acquisition and integration from passive motion imagery

    NASA Astrophysics Data System (ADS)

    Tang, Hao; Chang, Peng; Molina, Edgardo; Zhu, Zhigang

    2012-06-01

    In both military and civilian applications, abundant data from diverse sources captured on airborne platforms are often available for a region attracting interest. Since the data often includes motion imagery streams collected from multiple platforms flying at different altitudes, with sensors of different field of views (FOVs), resolutions, frame rates and spectral bands, it is imperative that a cohesive site model encompassing all the information can be quickly built and presented to the analysts. In this paper, we propose to develop an Uncertainty Preserving Patch-based Online Modeling System (UPPOMS) leading towards the automatic creation and updating of a cohesive, geo-registered, uncertaintypreserving, efficient 3D site terrain model from passive imagery with varying field-of-views and phenomenologies. The proposed UPPOMS has the following technical thrusts that differentiate our approach from others: (1) An uncertaintypreserved, patch-based 3D model is generated, which enables the integration of images captured with a mixture of NFOV and WFOV and/or visible and infrared motion imagery sensors. (2) Patch-based stereo matching and multi-view 3D integration are utilized, which are suitable for scenes with many low texture regions, particularly in mid-wave infrared images. (3) In contrast to the conventional volumetric algorithms, whose computational and storage costs grow exponentially with the amount of input data and the scale of the scene, the proposed UPPOMS system employs an online algorithmic pipeline, and scales well to large amount of input data. Experimental results and discussions of future work will be provided.

  18. Applications of carbon nanotubes on integrated circuits

    NASA Astrophysics Data System (ADS)

    Zhang, Min

    The microelectronics technology falls within the boundaries of that definition. Carbon nanotube (CNT) is a promising alternative material for the future nanoelectronics. Owing to the unique properties of CNTs and the maturity of CMOS IC technology, the integration of the two technologies will take advantages of both. In this work, we demonstrate a new local silicon-gate carbon nanotube field-effect transistor (CNFET) by combining the in situ CNT growth technology and the SOI technology. The proposed CNFET structure has realized individual device operation, batch fabrication, low parasitics and better compatibility to the CMOS process at the same time. The configuration proposes a feasible approach to integrate the CNTs to CMOS platform for the first time, which makes CNT a step closer to application. The CNFETs show advanced DC characteristics. The ambipolar conductance and the scaling effect of the CNFETs have been analyzed based on the SB modulated conductance mechanism. Investigation of radio-frequency (RF) characteristics of CNTs is essential for their application. RF transmission characteristics of the semiconducting and metallic CNTs are investigated to the frequency of 12 GHz using the full two-port S-parameter methodology for the first time. Without the effect of the parasitics, the signal transmission capability of the CNTs maintains at a constant level and shows no degeneration even at a high frequency of 12 GHz. An empirical RLC element model has been proposed to fit the RF response of the CNT array. Capacitive contact is reported between the CNTs and the metal electrodes. We also explore the high-frequency properties of the local silicon-gate CNFET as an active device by measuring its S parameters using a common-source configuration. In addition, we demonstrate the application of CNT as via/contact filler to solve the problems of copper vias used in ICs nowadays. We have optimized the fabrication process for the CNT via integration. The CNT vias with

  19. High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

    NASA Astrophysics Data System (ADS)

    Gueye, R.; Lee, S. W.; Akiyama, T.; Briand, D.; Roman, C.; Hierold, C.; de Rooij, N. F.

    2013-03-01

    A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS electronics using Through Silicon Vias (TSVs) on an SOI wafer. This SiP includes: A glass cap vacuum-sealed to the main wafer using an eutectic bonding process: a low leak rate of 2.7 10-9 mbar•l/s was obtained; Platinum-TSVs, compatible with the SWCNT growth and release process; The TSVs were developed in a "via first" process and characterized at high-temperature — up to 850 °C. An ohmic contact between the Pt-metallization and the SOI silicon device layer was obtained; The driving CMOS electronic device is assembled to the MEMS using an Au stud bump technology. Keywords: System-in-Package (SiP), vacuum packaging, eutectic bonding, "via-first" TSVs, high-temperature platinum interconnects, ohmic contacts, Au-stud bumps assembly, CMOS electronics.

  20. Classification of Informal Settlements Through the Integration of 2d and 3d Features Extracted from Uav Data

    NASA Astrophysics Data System (ADS)

    Gevaert, C. M.; Persello, C.; Sliuzas, R.; Vosselman, G.

    2016-06-01

    Unmanned Aerial Vehicles (UAVs) are capable of providing very high resolution and up-to-date information to support informal settlement upgrading projects. In order to provide accurate basemaps, urban scene understanding through the identification and classification of buildings and terrain is imperative. However, common characteristics of informal settlements such as small, irregular buildings with heterogeneous roof material and large presence of clutter challenge state-of-the-art algorithms. Especially the dense buildings and steeply sloped terrain cause difficulties in identifying elevated objects. This work investigates how 2D radiometric and textural features, 2.5D topographic features, and 3D geometric features obtained from UAV imagery can be integrated to obtain a high classification accuracy in challenging classification problems for the analysis of informal settlements. It compares the utility of pixel-based and segment-based features obtained from an orthomosaic and DSM with point-based and segment-based features extracted from the point cloud to classify an unplanned settlement in Kigali, Rwanda. Findings show that the integration of 2D and 3D features leads to higher classification accuracies.

  1. Fabrication of Large-Scale Microlens Arrays Based on Screen Printing for Integral Imaging 3D Display.

    PubMed

    Zhou, Xiongtu; Peng, Yuyan; Peng, Rong; Zeng, Xiangyao; Zhang, Yong-Ai; Guo, Tailiang

    2016-09-14

    The low-cost large-scale fabrication of microlens arrays (MLAs) with precise alignment, great uniformity of focusing, and good converging performance are of great importance for integral imaging 3D display. In this work, a simple and effective method for large-scale polymer microlens arrays using screen printing has been successfully presented. The results show that the MLAs possess high-quality surface morphology and excellent optical performances. Furthermore, the microlens' shape and size, i.e., the diameter, the height, and the distance between two adjacent microlenses of the MLAs can be easily controlled by modifying the reflowing time and the size of open apertures of the screen. MLAs with the neighboring microlenses almost tangent can be achieved under suitable size of open apertures of the screen and reflowing time, which can remarkably reduce the color moiré patterns caused by the stray light between the blank areas of the MLAs in the integral imaging 3D display system, exhibiting much better reconstruction performance.

  2. Guided wave-based J-integral estimation for dynamic stress intensity factors using 3D scanning laser Doppler vibrometry

    NASA Astrophysics Data System (ADS)

    Ayers, J.; Owens, C. T.; Liu, K. C.; Swenson, E.; Ghoshal, A.; Weiss, V.

    2013-01-01

    The application of guided waves to interrogate remote areas of structural components has been researched extensively in characterizing damage. However, there exists a sparsity of work in using piezoelectric transducer-generated guided waves as a method of assessing stress intensity factors (SIF). This quantitative information enables accurate estimation of the remaining life of metallic structures exhibiting cracks, such as military and commercial transport vehicles. The proposed full wavefield approach, based on 3D laser vibrometry and piezoelectric transducer-generated guided waves, provides a practical means for estimation of dynamic stress intensity factors (DSIF) through local strain energy mapping via the J-integral. Strain energies and traction vectors can be conveniently estimated from wavefield data recorded using 3D laser vibrometry, through interpolation and subsequent spatial differentiation of the response field. Upon estimation of the Jintegral, it is possible to obtain the corresponding DSIF terms. For this study, the experimental test matrix consists of aluminum plates with manufactured defects representing canonical elliptical crack geometries under uniaxial tension that are excited by surface mounted piezoelectric actuators. The defects' major to minor axes ratios vary from unity to approximately 133. Finite element simulations are compared to experimental results and the relative magnitudes of the J-integrals are examined.

  3. An integrated 3D constant offset GPR and resistivity survey on a sealed landfill — Ilhavo, NW Portugal

    NASA Astrophysics Data System (ADS)

    Hermozilha, H.; Grangeia, C.; Matias, M. Senos

    2010-01-01

    Owing to their nature landfills are challenging targets for high resolution Near Surface Geophysics. Herein it is described an integrated high resolution geophysical survey over the Ilhavo landfill sealed about a decade ago. The first aim of the survey is to investigate the time evolution of the contamination plume of the landfill since operations stopped and sealing took place. The second, and main objective, is the study of the landfill itself, that is, to carry out a high resolution 3D geophysical survey over it in order to investigate the thickness and effectiveness of the top cover, the thickness and sealing conditions of the landfill bottom and, finally, to investigate its internal structure. To fulfill these objectives an integrated 3D constant offset GPR and resistivity survey was designed. The interpretation of the geophysical data was carried out together with local borehole and hydrogeological information, so that, the ambiguity and uncertainty of the interpretation was reduced considerably and the usefulness of the methods were assessed.

  4. Integrated 3D macro-trapping and light-sheet imaging system

    NASA Astrophysics Data System (ADS)

    Yang, Zhengyi; Piksarv, Peeter; Ferrier, David E. K.; Gunn-Moore, Frank J.; Dholakia, Kishan

    2015-08-01

    Biological research requires high-speed and low-damage imaging techniques for live specimens in areas such as development study in embryos. Light sheet microscopy provides fast imaging speed whilst keeps the photo-damage and photo-blenching to minimum. Conventional sample embedding methods in light sheet imaging involves using agent such as agarose which potentially affects the behavior and the develop pattern of the specimens. Here we demonstrate integrating dual-beam trapping method into light sheet imaging system to confine and translate the specimen whilst light sheet images are taken. Tobacco plant cells as well as Spirobranchus lamarcki larva were trapped solely with optical force and sectional images were acquired. This now approach has the potential to extend the applications of light sheet imaging significantly.

  5. Novel flexible Parylene neural probe with 3D sheath structure for enhancing tissue integration.

    PubMed

    Kuo, Jonathan T W; Kim, Brian J; Hara, Seth A; Lee, Curtis D; Gutierrez, Christian A; Hoang, Tuan Q; Meng, Ellis

    2013-02-21

    A Parylene C neural probe with a three dimensional sheath structure was designed, fabricated, and characterized. Multiple platinum (Pt) electrodes for recording neural signals were fabricated on both inner and outer surfaces of the sheath structure. Thermoforming of Parylene was used to create the three dimensional sheath structures from flat surface micromachined microchannels using solid microwires as molds. Benchtop electrochemical characterization was performed on the thin film Pt electrodes using cyclic voltammetry and electrochemical impedance spectroscopy and showed that electrodes possessed low impedances suitable for neuronal recordings. A procedure for implantation of the neural probe was developed and successfully demonstrated in vitro into an agarose brain tissue model. The electrode-lined sheath will be decorated with eluting neurotrophic factors to promote in vivo neural tissue ingrowth post-implantation. These features will enhance tissue integration and improve recording quality towards realizing reliable chronic neural interfaces.

  6. 4D ICE: A 2D Array Transducer with Integrated ASIC in a 10 Fr Catheter for Real-Time 3D Intracardiac Echocardiography.

    PubMed

    Wildes, Douglas; Lee, Warren; Haider, Bruno; Cogan, Scott; Sundaresan, Krishnakumar; Mills, David; Yetter, Christopher; Hart, Patrick; Haun, Christopher; Concepcion, Mikael; Kirkhorn, Johan; Bitoun, Marc

    2016-10-12

    We developed a 2.5 x 6.6 mm 2D array transducer with integrated transmit/receive ASIC for 4D ICE (real-time 3D IntraCardiac Echocardiography) applications. The ASIC and transducer design were optimized so that the high voltage transmit, low-voltage TGC (time-gain control) and preamp, subaperture beamformer, and digital control circuits for each transducer element all fit within the 0.019 mm2 area of the element. The transducer assembly was deployed in a 10 Fr (3.3 mm diameter) catheter, integrated with a GE Vivid1 E9 ultrasound imaging system, and evaluated in three pre-clinical studies. 2D image quality and imaging modes were comparable to commercial 2D ICE catheters. The 4D field of view was at least 90° x 60° x 8 cm and could be imaged at 30 volumes/sec, sufficient to visualize cardiac anatomy and other diagnostic and therapy catheters. 4D ICE should significantly reduce X-ray fluoroscopy use and dose during electrophysiology (EP) ablation procedures. 4D ICE may be able to replace trans-esophageal echocardiography (TEE), and the associated risks and costs of general anesthesia, for guidance of some structural heart procedures.

  7. 3D Rheological Modeling of NW Intraplate Europe, Deciphering Spatial Integrated strength patterns, Mechanical Strong Layering and EET

    NASA Astrophysics Data System (ADS)

    Beekman, F.; Hardebol, N.; Cloetingh, S.; Tesauro, M.

    2006-12-01

    Better understanding of 3D rheological heterogeneity of the European Lithosphere provide the key to tie the recorded intraplate deformation pattern to stress fields transmitted into plate interior from plate boundary forces. The first order strain patterns result from stresses transmitted through the European lithosphere that is marked by a patchwork of high strength variability from inherited structural and compositional heterogeneities and upper mantle thermal perturbations. As the lithospheric rheology depends primarily on its spatial structure, composition and thermal estate, the 3D strength model for the European lithosphere relies on a 3D compositional model that yields the compositional heterogeneities and an iteratively calculated thermal cube using Fouriers law for heat conduction. The accurate appraisal of spatial strength variability results from proper mapping and integration of the geophysical compositional and thermal input parameters. Therefore, much attention has been paid to a proper description of first order structural and tectonic features that facilitate compilation of the compositional and thermal input models. As such, the 3D strength model reflects the thermo-mechanical structure inherited from the Europeans polyphase deformation history. Major 3D spatial mechanical strength variability has been revealed. The East-European and Fennoscandian Craton to the NE exhibit high strength (30-50 1012 N/m) from low mantle temperatures and surface heatflow of 35-60 mW/m2 while central and western Europe reflect a polyphase Phanerozoic thermo- tectonic history. Here, regions with high rigidity are formed primarily by patches of thermally stabilized Variscan Massifs (e.g. Rhenish, Armorican, Bohemian, and Iberian Massif) with low heatflow and lithospheric thickness values (50-65 mW/m2; 110-150 km) yielding strengths of ~15-25 1012 N/m. In contrast, major axis of weakened lithosphere coincides with Cenozoic Rift System (e.g. Upper and Lower Rhine Grabens

  8. Flexible circuits with integrated switches for robotic shape sensing

    NASA Astrophysics Data System (ADS)

    Harnett, C. K.

    2016-05-01

    Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.

  9. Functional morphology and integration of corvid skulls – a 3D geometric morphometric approach

    PubMed Central

    Kulemeyer, Christoph; Asbahr, Kolja; Gunz, Philipp; Frahnert, Sylke; Bairlein, Franz

    2009-01-01

    Background Sympatric corvid species have evolved differences in nesting, habitat choice, diet and foraging. Differences in the frequency with which corvid species use their repertoire of feeding techniques is expected to covary with bill-shape and with the frontal binocular field. Species that frequently probe are expected to have a relatively longer bill and more sidewise oriented orbits in contrast to species that frequently peck. We tested this prediction by analyzing computed tomography scans of skulls of six corvid species by means of three-dimensional geometric morphometrics. We (1) explored patterns of major variation using principal component analysis, (2) compared within and between species relationships of size and shape and (3) quantitatively compared patterns of morphological integration between bill and cranium by means of partial least squares (singular warp) analysis. Results Major shape variation occurs at the bill, in the orientation of orbits, in the position of the foramen magnum and in the angle between bill and cranium. The first principal component correlated positively with centroid-size, but within-species allometric relationships differed markedly. Major covariation between the bill and cranium lies in the difference in orbit orientation relative to bill-length and in the angle between bill and cranium. Conclusion Corvid species show pronounced differences in skull shape, which covary with foraging mode. Increasing bill-length, bill-curvature and sidewise orientation of the eyes is associated with an increase in the observed frequency in probing (vice versa in pecking). Hence, the frequency of probing, bill-length, bill-curvature and sidewise orientation of the eyes is progressively increased from jackdaw, to Eurasian jay, to black-billed magpie, to hooded crow, to rook and to common raven (when feeding on carcasses is considered as probing). Our results on the morphological integration suggest that most of the covariation between bill and

  10. RELAP5-3D Transient Modelling for NGNP Integrated Plant

    SciTech Connect

    Sabharwall, P.; Anderson, N. A.

    2014-06-01

    The High-Temperature Gas-cooled Reactor (HTGR) is designed with outlet temperatures ranging between 750°C and 800°C. These high outlet temperatures enhance the power production efficiency and facilitate a variety of industrial applications. The objective of this study is to understand the response of the primary system to potential transients in the secondary system. For this analysis, the transient condition originates in the Intermediate Heat Exchanger (IHX) or Steam Generator (SG) of the HTGR-integrated plant. The transients analysed are: a loss of pressure; loss of feedwater flow; inadvertent closure of main steam valve; decrease in returning gas temperature and heat load step change. The results show a large dependence on the negative reactivity added to the fuel as a function of increased temperature. The returning gas temperature decrease transient resulted in the highest fuel temperature (1361°C). Fuel temperature was shown to be less than the 1600°C fuel limit for each case analysed.

  11. IRIS Earthquake Browser with Integration to the GEON IDV for 3-D Visualization of Hypocenters.

    NASA Astrophysics Data System (ADS)

    Weertman, B. R.

    2007-12-01

    We present a new generation of web based earthquake query tool - the IRIS Earthquake Browser (IEB). The IEB combines the DMC's large set of earthquake catalogs (provided by USGS/NEIC, ISC and the ANF) with the popular Google Maps web interface. With the IEB you can quickly and easily find earthquakes in any region of the globe. Using Google's detailed satellite images, earthquakes can be easily co-located with natural geographic features such as volcanoes as well as man made features such as commercial mines. A set of controls allow earthquakes to be filtered by time, magnitude, and depth range as well as catalog name, contributor name and magnitude type. Displayed events can be easily exported in NetCDF format into the GEON Integrated Data Viewer (IDV) where hypocenters may be visualized in three dimensions. Looking "under the hood", the IEB is based on AJAX technology and utilizes REST style web services hosted at the IRIS DMC. The IEB is part of a broader effort at the DMC aimed at making our data holdings available via web services. The IEB is useful both educationally and as a research tool.

  12. Numerical Modeling of 3-D Dynamics of Ultrasound Contrast Agent Microbubbles Using the Boundary Integral Method

    NASA Astrophysics Data System (ADS)

    Calvisi, Michael; Manmi, Kawa; Wang, Qianxi

    2014-11-01

    Ultrasound contrast agents (UCAs) are microbubbles stabilized with a shell typically of lipid, polymer, or protein and are emerging as a unique tool for noninvasive therapies ranging from gene delivery to tumor ablation. The nonspherical dynamics of contrast agents are thought to play an important role in both diagnostic and therapeutic applications, for example, causing the emission of subharmonic frequency components and enhancing the uptake of therapeutic agents across cell membranes and tissue interfaces. A three-dimensional model for nonspherical contrast agent dynamics based on the boundary integral method is presented. The effects of the encapsulating shell are approximated by adapting Hoff's model for thin-shell, spherical contrast agents to the nonspherical case. A high-quality mesh of the bubble surface is maintained by implementing a hybrid approach of the Lagrangian method and elastic mesh technique. Numerical analyses for the dynamics of UCAs in an infinite liquid and near a rigid wall are performed in parameter regimes of clinical relevance. The results show that the presence of a coating significantly reduces the oscillation amplitude and period, increases the ultrasound pressure amplitude required to incite jetting, and reduces the jet width and velocity.

  13. Effect of Weaving Direction of Conductive Yarns on Electromagnetic Performance of 3D Integrated Microstrip Antenna

    NASA Astrophysics Data System (ADS)

    Xu, Fujun; Yao, Lan; Zhao, Da; Jiang, Muwen; Qiu, Yipping

    2013-10-01

    A three-dimensionally integrated microstrip antenna (3DIMA) is a microstrip antenna woven into the three-dimensional woven composite for load bearing while functioning as an antenna. In this study, the effect of weaving direction of conductive yarns on electromagnetic performance of 3DIMAs are investigated by designing, simulating and experimental testing of two microstrip antennas with different weaving directions of conductive yarns: one has the conductive yarns along the antenna feeding direction (3DIMA-Exp1) and the other has the conductive yarns perpendicular the antenna feeding direction (3DIMA-Exp2). The measured voltage standing wave ratio (VSWR) of 3DIMA-Exp1 was 1.4 at the resonant frequencies of 1.39 GHz; while that of 3DIMA-Exp2 was 1.2 at the resonant frequencies of 1.35 GHz. In addition, the measured radiation pattern of the 3DIMA-Exp1 has smaller back lobe and higher gain value than those of the 3DIMA-Exp2. This result indicates that the waving direction of conductive yarns may have a significant impact on electromagnetic performance of textile structural antennas.

  14. Quantum dot rolled-up microtube optoelectronic integrated circuit.

    PubMed

    Bhowmick, Sishir; Frost, Thomas; Bhattacharya, Pallab

    2013-05-15

    A rolled-up microtube optoelectronic integrated circuit operating as a phototransceiver is demonstrated. The microtube is made of a InGaAs/GaAs strained bilayer with InAs self-organized quantum dots inserted in the GaAs layer. The phototransceiver consists of an optically pumped microtube laser and a microtube photoconductive detector connected by an a-Si/SiO2 waveguide. The loss in the waveguide and responsivity of the entire phototransceiver circuit are 7.96 dB/cm and 34 mA/W, respectively.

  15. Modeling of single-event upset in bipolar integrated circuits

    NASA Technical Reports Server (NTRS)

    Zoutendyk, J. A.

    1983-01-01

    The results of work done on the quantitative characterization of single-event upset (SEU) in bipolar random-access memories (RAMs) have been obtained through computer simulation of SEU in RAM cells that contain circuit models for bipolar transistors. The models include current generators that emulate the charge collected from ion tracks. The computer simulation results are compared with test data obtained from a RAM in a bipolar microprocessor chip. This methodology is applicable to other bipolar integrated circuit constructions in addition to RAM cells.

  16. Transmission line for millimeter-wave integrated circuits

    NASA Astrophysics Data System (ADS)

    Komar, G. I.; Shestopalov, V. P.

    The advantages of the miniature wideband slotted mirror line (SML) for millimeter-wave integrated circuits is described. It is shown that the SML has the same order of losses in the mm-range as the stripline in the cm-range. In addition, the SML makes possible the planar design of a wide range of functional components and units, and provides for the complex miniaturization of closed antenna-feed systems in the mm-range, which makes it possible to avoid the use of several types of sections in a single circuit. Forms of cross sections of the SML are presented.

  17. How integrating 3D LiDAR data in the dike surveillance protocol: The French case

    NASA Astrophysics Data System (ADS)

    Bretar, F.; Mériaux, P.; Fauchard, C.

    2012-04-01

    carried out. A LiDAR system is able to acquire data on a dike structure of up to 80 km per day, which makes the use of this technique also valuable in case of emergency situations. It provides additional valuable products like precious information on dike slopes and crest or their near environment (river banks, etc.). Moreover, in case of vegetation, LiDAR data makes possible to study hidden structures or defaults from images like the erosion of riverbanks under forestry vegetation. The possibility of studying the vegetation is also of high importance: the development of woody vegetation near or onto the dike is a major risk factor. Surface singularities are often signs of disorder or suspected disorder in the dike itself: for example a subsidence or a sinkhole on a ridge may result from internal erosion collapse. Finally, high resolution topographic data contribute to build specific geomechanical model of the dike that, after incorporating data provided by geophysical and geotechnical surveys, are integrated in the calculations of the structure stability. Integrating the regular use of LiDAR data in the dike surveillance protocol is not yet operational in France. However, the high number of French stakeholders at the national level (on average, there is one stakeholder for only 8-9km of dike !) and the real added value of LiDAR data makes a spatial data infrastructure valuable (webservices for processing the data, consulting and filling the database on the field when performing the local diagnosis)

  18. Millimeter-wave and terahertz integrated circuit antennas

    NASA Technical Reports Server (NTRS)

    Rebeiz, Gabriel M.

    1992-01-01

    This paper presents a comprehensive review of integrated circuit antennas suitable for millimeter and terahertz applications. A great deal of research was done on integrated circuit antennas in the last decade and many of the problems associated with electrically thick dielectric substrates, such as substrate modes and poor radiation patterns, have been understood and solved. Several new antennas, such as the integrated horn antenna, the dielectric-filled parabola, the Fresnel plate antenna, the dual-slot antenna, and the log-periodic and spiral antennas on extended hemispherical lenses, have resulted in excellent performance at millimeter-wave frequencies, and are covered in detail in this paper. Also, a review of the efficiency definitions used with planar antennas is given in detail in the appendix.

  19. Progress on a New Integrated 3-D UCG Simulator and its Initial Application

    SciTech Connect

    Nitao, J J; Camp, D W; Buscheck, T A; White, J A; Burton, G C; Wagoner, J L; Chen, M

    2011-09-22

    A comprehensive simulator is being developed for underground coal gasification (UCG), with the capability to support site selection, design, hazard analyses, operations, and monitoring (Nitao et al., 2010). UCG is computationally challenging because it involves tightly-coupled multi-physical/chemical processes, with vastly different timescales. This new capability will predict cavity growth, product gas composition and rate, and the interaction with the host environment, accounting for site characteristics, injection gas composition and rate, and associated water-well extraction rates. Progress on the new simulator includes completion and system integration of a wall model, a rock spalling model, a cavity boundary tracking model, a one-dimensional cavity gas reactive transport model, a rudimentary rubble heat, mass, and reaction model, and coupling with a pre-existing hydrology simulator. An existing geomechanical simulator was enhanced to model cavity collapse and overburden subsidence. A commercial computational fluid dynamics (CFD) code is being evaluated to model cavity gas flow and combustion in two and three dimensions. Although the simulator is midway in its development, it was applied to modeling the Hoe Creek III field test (Stephens, 1981) conducted in the 1970s, in order to evaluate and demonstrate the simulator's basic capabilities, gain experience, and guide future development. Furthermore, it is consistent with our philosophy of incremental, spiral software development, which helps in identifying and resolving potential problems early in the process. The simulation accounts for two coal seams, two injection points, and air and oxygen phases. Approximate extent and shape of cavity growth showed reasonable agreement with interpreted field data. Product gas composition and carbon consumed could not be simultaneously matched for a given set of parameter values due to the rudimentary rubble model currently used, although they can be matched using separate

  20. Amplitude-modulated laser range-finder for 3D imaging with multi-sensor data integration capabilities

    NASA Astrophysics Data System (ADS)

    Bartolini, L.; Ferri de Collibus, M.; Fornetti, G.; Guarneri, M.; Paglia, E.; Poggi, C.; Ricci, R.

    2005-06-01

    A high performance Amplitude Modulated Laser Rangefinder (AM-LR) is presented, aimed at accurately reconstructing 3D digital models of real targets, either single objects or complex scenes. The scanning system enables to sweep the sounding beam either linearly across the object or circularly around it, by placing the object on a controlled rotating platform. Both phase shift and amplitude of the modulating wave of back-scattered light are collected and processed, resulting respectively in an accurate range image and a shade-free, high resolution, photographic-like intensity image. The best performances obtained in terms of range resolution are ~100 μm. Resolution itself can be made to depend mainly on the laser modulation frequency, provided that the power of the backscattered light reaching the detector is at least a few nW. 3D models are reconstructed from sampled points by using specifically developed software tools, optimized so as to take advantage of the system peculiarities. Special procedures have also been implemented to perform precise matching of data acquired independently with different sensors (LIF laser sensors, thermographic cameras, etc.) onto the 3D models generated using the AM-LR. The system has been used to scan different types of real surfaces (stone, wood, alloys, bones) and ca be applied in various fields, ranging from industrial machining to medical diagnostics, vision in hostile environments cultural heritage conservation and restoration. The relevance of this technology in cultural heritage applications is discussed in special detail, by providing results obtained in different campaigns with an emphasis on the system's multi-sensor data integration capabilities.

  1. Evaluation of a combined pre-processing and H.264-compression scheme for 3D integral images

    NASA Astrophysics Data System (ADS)

    Olsson, Roger; Sjöström, Mårten; Xu, Youzhi

    2007-01-01

    To provide sufficient 3D-depth fidelity, integral imaging (II) requires an increase in spatial resolution of several orders of magnitude from today's 2D images. We have recently proposed a pre-processing and compression scheme for still II-frames based on forming a pseudo video sequence (PVS) from sub images (SI), which is later coded using the H.264/MPEG-4 AVC video coding standard. The scheme has shown good performance on a set of reference images. In this paper we first investigate and present how five different ways to select the SIs when forming the PVS affect the schemes compression efficiency. We also study how the II-frame structure relates to the performance of a PVS coding scheme. Finally we examine the nature of the coding artifacts which are specific to the evaluated PVS-schemes. We can conclude that for all except the most complex reference image, all evaluated SI selection orders significantly outperforms JPEG 2000 where compression ratios of up to 342:1, while still keeping PSNR > 30 dB, is achieved. We can also confirm that when selecting PVS-scheme, the scheme which results in a higher PVS-picture resolution should be preferred to maximize compression efficiency. Our study of the coded II-frames also indicates that the SI-based PVS, contrary to other PVS schemes, tends to distribute its coding artifacts more homogenously over all 3D-scene depths.

  2. Integrating Dynamic Data and Sensors with Semantic 3D City Models in the Context of Smart Cities

    NASA Astrophysics Data System (ADS)

    Chaturvedi, K.; Kolbe, T. H.

    2016-10-01

    Smart cities provide effective integration of human, physical and digital systems operating in the built environment. The advancements in city and landscape models, sensor web technologies, and simulation methods play a significant role in city analyses and improving quality of life of citizens and governance of cities. Semantic 3D city models can provide substantial benefits and can become a central information backbone for smart city infrastructures. However, current generation semantic 3D city models are static in nature and do not support dynamic properties and sensor observations. In this paper, we propose a new concept called Dynamizer allowing to represent highly dynamic data and providing a method for injecting dynamic variations of city object properties into the static representation. The approach also provides direct capability to model complex patterns based on statistics and general rules and also, real-time sensor observations. The concept is implemented as an Application Domain Extension for the CityGML standard. However, it could also be applied to other GML-based application schemas including the European INSPIRE data themes and national standards for topography and cadasters like the British Ordnance Survey Mastermap or the German cadaster standard ALKIS.

  3. Towards a high performance vertex detector based on 3D integration of deep N-well MAPS

    NASA Astrophysics Data System (ADS)

    Re, V.

    2010-06-01

    The development of deep N-Well (DNW) CMOS active pixel sensors was driven by the ambitious goal of designing a monolithic device with similar functionalities as in hybrid pixel readout chips, such as pixel-level sparsification and time stamping. The implementation of the DNW MAPS concept in a 3D vertical integration process naturally leads the designer towards putting more intelligence in the chip and in the pixels themselves, achieving novel device structures based on the interconnection of two or more layers fabricated in the same technology. These devices are read out with a data-push scheme that makes it possible to use pixel data for the generation of a flexible level 1 track trigger, based on associative memories, with short latency and high efficiency. This paper gives an update of the present status of DNW MAPS design in both 2D and 3D versions, and presents a discussion of the architectures that are being devised for the Layer 0 of the SuperB Silicon Vertex Tracker.

  4. Laser-Controlled Rapid Prototyping of Photonic Integrated Circuits.

    NASA Astrophysics Data System (ADS)

    Eldada, Louay A.

    1994-01-01

    Photonic integrated circuits offer important cost and environmental advantages over circuits composed of discrete components. However, the design and fabrication of complex, large-area photonic integrated circuits (PICs) is severely limited by the lack of prototyping tools as well as the appropriate device structures. This thesis describes the use of a novel laser fabrication process for the rapid prototyping of integrated optical circuits in compound semiconductor substrates. The fabrication is based on a type of laser direct photoelectrochemical etching process that uses a focused laser beam which is scanned under computer control to form micrometer-scale grooves, thereby patterning rib-like optical waveguide structures. The computer-controlled apparatus can be programmed with any desired circuit pattern, and prototype waveguide circuits can be produced within a day. The technique does not require the use of a mask; thus, the etching can be done in a single step. In the first part of this thesis, the technique of micrometer-scale photoelectrochemical etching of GaAs is described. The use of this technique for the fabrication of several passive integrated optical devices in GaAs is then presented. These "building block" devices include linear waveguides, bends, Y-branches, and tapers. From these, we were able to form simple passive devices such as splitters and directional couplers. These devices have low optical loss, are single-mode, and can be accurately modeled using effective index calculations. The usefulness of this technique as a prototyping tool is then demonstrated by its use in the fabrication of the first sub-Angstrom integrated channel-dropping filter. After the presentation of the passive devices results, the use of this technique to fabricate several active devices is discussed. These electrooptic devices include a polarization modulator, an integrated amplitude modulator consisting of a polarization modulator and an on-chip polarizer, and an

  5. Attachment method for stacked integrated circuit (IC) chips

    DOEpatents

    Bernhardt, Anthony F.; Malba, Vincent

    1999-01-01

    An attachment method for stacked integrated circuit (IC) chips. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM.

  6. Attachment method for stacked integrated circuit (IC) chips

    DOEpatents

    Bernhardt, A.F.; Malba, V.

    1999-08-03

    An attachment method for stacked integrated circuit (IC) chips is disclosed. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM. 12 figs.

  7. Organic printed photonics: From microring lasers to integrated circuits.

    PubMed

    Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

    2015-09-01

    A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 10(5), which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.

  8. Organic printed photonics: From microring lasers to integrated circuits

    PubMed Central

    Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

    2015-01-01

    A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 105, which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices. PMID:26601256

  9. Investigation Of Integrating Three-Dimensional (3-D) Geometry Into The Visual Anatomical Injury Descriptor (Visual AID) Using WebGL

    DTIC Science & Technology

    2011-08-01

    into the Visual Anatomical Injury Descriptor (Visual AID) Using WebGL AUTUMN KULAGA MENTOR: PATRICK GILLICH WARFIGHTER SURVIVABILITY BRANCH...Investigation Of Integrating Three-Dimensional (3-D) Geometry Into The Visual Anatomical Injury Descriptor (Visual AID) Using WebGL 5a. CONTRACT...discusses the Web-based 3-D environment prototype being developed to understand the feasibility of integrating WebGL into Visual AID. Using WebGL will

  10. Acquiring multi-viewpoint image of 3D object for integral imaging using synthetic aperture phase-shifting digital holography

    NASA Astrophysics Data System (ADS)

    Jeong, Min-Ok; Kim, Nam; Park, Jae-Hyeung; Jeon, Seok-Hee; Gil, Sang-Keun

    2009-02-01

    We propose a method generating elemental images for the auto-stereoscopic three-dimensional display technique, integral imaging, using phase-shifting digital holography. Phase shifting digital holography is a way recording the digital hologram by changing phase of the reference beam and extracting the complex field of the object beam. Since all 3D information is captured by the phase-shifting digital holography, the elemental images for any specifications of the lens array can be generated from single phase-shifting digital holography. We expanded the viewing angle of the generated elemental image by using the synthetic aperture phase-shifting digital hologram. The principle of the proposed method is verified experimentally.

  11. Evaluating integration of inland bathymetry in the U.S. Geological Survey 3D Elevation Program, 2014

    USGS Publications Warehouse

    Miller-Corbett, Cynthia

    2016-09-01

    Inland bathymetry survey collections, survey data types, features, sources, availability, and the effort required to integrate inland bathymetric data into the U.S. Geological Survey 3D Elevation Program are assessed to help determine the feasibility of integrating three-dimensional water feature elevation data into The National Map. Available data from wading, acoustic, light detection and ranging, and combined technique surveys are provided by the U.S. Geological Survey, National Oceanic and Atmospheric Administration, U.S. Army Corps of Engineers, and other sources. Inland bathymetric data accessed through Web-hosted resources or contacts provide useful baseline parameters for evaluating survey types and techniques used for collection and processing, and serve as a basis for comparing survey methods and the quality of results. Historically, boat-mounted acoustic surveys have provided most inland bathymetry data. Light detection and ranging techniques that are beneficial in areas hard to reach by boat, that can collect dense data in shallow water to provide comprehensive coverage, and that can be cost effective for surveying large areas with good water clarity are becoming more common; however, optimal conditions and techniques for collecting and processing light detection and ranging inland bathymetry surveys are not yet well defined.Assessment of site condition parameters important for understanding inland bathymetry survey issues and results, and an evaluation of existing inland bathymetry survey coverage are proposed as steps to develop criteria for implementing a useful and successful inland bathymetry survey plan in the 3D Elevation Program. These survey parameters would also serve as input for an inland bathymetry survey data baseline. Integration and interpolation techniques are important factors to consider in developing a robust plan; however, available survey data are usually in a triangulated irregular network format or other format compatible with

  12. Integrated monolithic 3D MEMS scanner for switchable real time vertical/horizontal cross-sectional imaging.

    PubMed

    Li, Haijun; Duan, Xiyu; Qiu, Zhen; Zhou, Quan; Kurabayashi, Katsuo; Oldham, Kenn R; Wang, Thomas D

    2016-02-08

    We present an integrated monolithic, electrostatic 3D MEMS scanner with a compact chip size of 3.2 × 2.9 mm(2). Use of parametric excitation near resonance frequencies produced large optical deflection angles up to ± 27° and ± 28.5° in the X- and Y-axes and displacements up to 510 μm in the Z-axis with low drive voltages at atmospheric pressure. When packaged in a dual axes confocal endomicroscope, horizontal and vertical cross-sectional images can be collected seamlessly in tissue with a large field-of-view of >1 × 1 mm(2) and 1 × 0.41 mm(2), respectively, at 5 frames/sec.

  13. Extended depth-of-focus 3D micro integral imaging display using a bifocal liquid crystal lens.

    PubMed

    Shen, Xin; Wang, Yu-Jen; Chen, Hung-Shan; Xiao, Xiao; Lin, Yi-Hsin; Javidi, Bahram

    2015-02-15

    We present a three dimensional (3D) micro integral imaging display system with extended depth of focus by using a polarized bifocal liquid crystal lens. This lens and other optical components are combined as the relay optical element. The focal length of the relay optical element can be controlled to project an elemental image array in multiple positions with various lenslet image planes, by applying different voltages to the liquid crystal lens. The depth of focus of the proposed system can therefore be extended. The feasibility of our proposed system is experimentally demonstrated. In our experiments, the depth of focus of the display system is extended from 3.82 to 109.43 mm.

  14. 77 FR 19032 - Certain Semiconductor Integrated Circuit Devices and Products Containing Same Notice of Receipt...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-03-29

    ... Certain Semiconductor Integrated Circuit Devices and Products Containing Same, DN 2888; the Commission is... importation of certain semiconductor integrated circuit devices and products containing same. The complaint...] [FR Doc No: 2012-7567] INTERNATIONAL TRADE COMMISSION [DN 2888] Certain Semiconductor...

  15. 76 FR 34101 - In the Matter of Certain Integrated Circuits, Chipsets, and Products Containing Same Including...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-06-10

    ... From the Federal Register Online via the Government Publishing Office INTERNATIONAL TRADE COMMISSION In the Matter of Certain Integrated Circuits, Chipsets, and Products Containing Same Including... integrated circuits, chipsets, and products containing same including televisions, media players, and...

  16. 77 FR 74027 - Certain Integrated Circuit Packages Provided with Multiple Heat-Conducting Paths and Products...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-12-12

    ... From the Federal Register Online via the Government Publishing Office INTERNATIONAL TRADE COMMISSION Certain Integrated Circuit Packages Provided with Multiple Heat- Conducting Paths and Products... integrated circuit packages provided with multiple heat-conducting paths and products containing same...

  17. 75 FR 75694 - Certain Semiconductor Integration Circuits Using Tungsten Metallization and Products Containing...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-12-06

    ... From the Federal Register Online via the Government Publishing Office INTERNATIONAL TRADE COMMISSION Certain Semiconductor Integration Circuits Using Tungsten Metallization and Products Containing... United States after importation of certain semiconductor integrated circuits using tungsten...

  18. GPU-based, parallel-line, omni-directional integration of measured acceleration field to obtain the 3D pressure distribution

    NASA Astrophysics Data System (ADS)

    Wang, Jin; Zhang, Cao; Katz, Joseph

    2016-11-01

    A PIV based method to reconstruct the volumetric pressure field by direct integration of the 3D material acceleration directions has been developed. Extending the 2D virtual-boundary omni-directional method (Omni2D, Liu & Katz, 2013), the new 3D parallel-line omni-directional method (Omni3D) integrates the material acceleration along parallel lines aligned in multiple directions. Their angles are set by a spherical virtual grid. The integration is parallelized on a Tesla K40c GPU, which reduced the computing time from three hours to one minute for a single realization. To validate its performance, this method is utilized to calculate the 3D pressure fields in isotropic turbulence and channel flow using the JHU DNS Databases (http://turbulence.pha.jhu.edu). Both integration of the DNS acceleration as well as acceleration from synthetic 3D particles are tested. Results are compared to other method, e.g. solution to the Pressure Poisson Equation (e.g. PPE, Ghaemi et al., 2012) with Bernoulli based Dirichlet boundary conditions, and the Omni2D method. The error in Omni3D prediction is uniformly low, and its sensitivity to acceleration errors is local. It agrees with the PPE/Bernoulli prediction away from the Dirichlet boundary. The Omni3D method is also applied to experimental data obtained using tomographic PIV, and results are correlated with deformation of a compliant wall. ONR.

  19. A probabilistic approach to jointly integrate 3D/4D seismic, production data and geological information for building reservoir models

    NASA Astrophysics Data System (ADS)

    Castro, Scarlet A.

    Reservoir modeling aims at understanding static and dynamic components of the reservoir in order to make decisions about future surface operations. The practice of reservoir modeling calls for the integration of expertise from different disciplines, as well as the in tegration of a wide variety of data: geological data, (core data, well-logs, etc.), production data (fluid rates or volumes, pressure data, etc.), and geophysical data (3D seismic data). Although a single 3D seismic survey is the most common geophysical data available for most reservoirs, a suite of several 3D seismic surveys (4D seismic data) acquired for monitoring production can be available for mature reservoirs. The main contribution of this dissertation is to incorporate 4D seismic data within the reservoir modeling workflow while honoring all other available data. This dissertation proposes two general approaches to include 4D seismic data into the reservoir modeling workflow. The Probabilistic Data Integration approach (PDI), which consists of modeling the information content of 4D seismic through a spatial probability of facies occurrence; and the Forward Modeling (FM) approach, which consists of matching 4D seismic along with production data. The FM approach requires forward modeling the 4D seismic response, which requires to downscale the flow simulation response. This dissertation introduces a novel dynamic downscaling method that takes into account both static information (high-resolution per meability field) and dynamic information in the form of coarsened fluxes and saturations (flow simulation on the coarsened grid). The two proposed approaches (PDI and FM approaches) are applied to a prominent field in the North Sea, to model the channel facies of a fluvial reservoir. The PDI approach constrained the reservoir model to the spatial probability of facies occurrence (obtained from a calibration between well-log and 4D seismic data) as well as other static data while satisfactorily history

  20. Integration (Phase 3D),

    DTIC Science & Technology

    2007-11-02

    tension rods will be drilled prior to assembly. fixing AFA Point 10 gap 30 grillage 35 Detail at floor floor User cabinet ANS&A to consider providing...duplicate mount for AFA connector panels. ANS&A would remove AFA panel and mount in user cabinet. Termination panels AFA propose mounting points on...clearance holes in the boom divider for AFA . boom divider At the centre of the arm, the cable trays terminate against the drive box. Three cable support rails

  1. Monolithic Microwave Integrated Circuit (MMIC) technology for space communications applications

    NASA Technical Reports Server (NTRS)

    Connolly, Denis J.; Bhasin, Kul B.; Romanofsky, Robert R.

    1987-01-01

    Future communications satellites are likely to use gallium arsenide (GaAs) monolithic microwave integrated-circuit (MMIC) technology in most, if not all, communications payload subsystems. Multiple-scanning-beam antenna systems are expected to use GaAs MMIC's to increase functional capability, to reduce volume, weight, and cost, and to greatly improve system reliability. RF and IF matrix switch technology based on GaAs MMIC's is also being developed for these reasons. MMIC technology, including gigabit-rate GaAs digital integrated circuits, offers substantial advantages in power consumption and weight over silicon technologies for high-throughput, on-board baseband processor systems. For the more distant future pseudomorphic indium gallium arsenide (InGaAs) and other advanced III-V materials offer the possibility of MMIC subsystems well up into the millimeter wavelength region. All of these technology elements are in NASA's MMIC program. Their status is reviewed.

  2. Monolithic Microwave Integrated Circuit (MMIC) technology for space communications applications

    NASA Technical Reports Server (NTRS)

    Connolly, Denis J.; Bhasin, Kul B.; Romanofsky, Robert R.

    1987-01-01

    Future communications satellites are likely to use gallium arsenide (GaAs) monolithic microwave integrated-circuit (MMIC) technology in most, if not all, communications payload subsystems. Multiple-scanning-beam antenna systems are expected to use GaAs MMICs to increase functional capability, to reduce volume, weight, and cost, and to greatly improve system reliability. RF and IF matrix switch technology based on GaAs MMICs is also being developed for these reasons. MMIC technology, including gigabit-rate GaAs digital integrated circuits, offers substantial advantages in power consumption and weight over silicon technologies for high-throughput, on-board baseband processor systems. For the more distant future pseudomorphic indium gallium arsenide (InGaAs) and other advanced III-V materials offer the possibility of MMIC subsystems well up into the millimeter wavelength region. All of these technology elements are in NASA's MMIC program. Their status is reviewed.

  3. Total Dose Effects on Bipolar Integrated Circuits at Low Temperature

    NASA Technical Reports Server (NTRS)

    Johnston, A. H.; Swimm, R. T.; Thorbourn, D. O.

    2012-01-01

    Total dose damage in bipolar integrated circuits is investigated at low temperature, along with the temperature dependence of the electrical parameters of internal transistors. Bandgap narrowing causes the gain of npn transistors to decrease far more at low temperature compared to pnp transistors, due to the large difference in emitter doping concentration. When irradiations are done at temperatures of -140 deg C, no damage occurs until devices are warmed to temperatures above -50 deg C. After warm-up, subsequent cooling shows that damage is then present at low temperature. This can be explained by the very strong temperature dependence of dispersive transport in the continuous-time-random-walk model for hole transport. For linear integrated circuits, low temperature operation is affected by the strong temperature dependence of npn transistors along with the higher sensitivity of lateral and substrate pnp transistors to radiation damage.

  4. Integrated circuit generating 3- and 5-scroll attractors

    NASA Astrophysics Data System (ADS)

    Trejo-Guerra, R.; Tlelo-Cuautle, E.; Jiménez-Fuentes, J. M.; Sánchez-López, C.; Muñoz-Pacheco, J. M.; Espinosa-Flores-Verdad, G.; Rocha-Pérez, J. M.

    2012-11-01

    This paper introduces the experimental realization of the first integrated circuit of a multi-scroll continuous chaotic oscillator showing 3- and 5-scroll attractors. It is based on a variant of the Chua's system. The most relevant issue is the implementation of a saw-tooth-like nonlinear function, which is designed by using floating gate MOS (FGMOS) transistors. Therefore, the realization of a voltage-to-current nonlinear cell by a piecewise-linear approach allows us to have only two external control inputs instead of numerous external voltage references, as usually done in current circuit realizations. Experimental results of the proposed integrated multi-scroll oscillator along with its corner analysis are provided.

  5. Broadband opto-mechanical phase shifter for photonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Guo, Xiang; Zou, Chang-Ling; Ren, Xi-Feng; Sun, Fang-Wen; Guo, Guang-Can

    2012-08-01

    A broadband opto-mechanical phase shifter for photonic integrated circuits is proposed and numerically investigated. The structure consists of a mode-carrying waveguide and a deformable non-mode-carrying nanostring, which are parallel with each other. Since the nanostring can be deflected by the optical gradient force between the waveguide and the nanostring, the effective refractive indices of the waveguide will be changed and a phase shift will be generated. The phase shift under different geometry sizes, launched powers and boundary conditions are calculated and the dynamical properties as well as the thermal noise's effect are also discussed. It is demonstrated that a π phase shift can be realized with only about 0.64 mW launched power and 50 μm long nanostring. The proposed phase shifter may find potential usage in future investigation of photonic integrated circuits.

  6. Radiation Testing and Evaluation Issues for Modern Integrated Circuits

    NASA Technical Reports Server (NTRS)

    LaBel, Kenneth A.; Cohn, Lew M.

    2005-01-01

    Abstract. Changes in modern integrated circuit (IC) technologies have modified the way we approach and conduct radiation tolerance and testing of electronics. These changes include scaling of geometries, new materials, new packaging technologies, and overall speed and device complexity challenges. In this short course section, we will identify and discuss these issues as they impact radiation testing, modeling, and effects mitigation of modern integrated circuits. The focus will be on CMOS-based technologies, however, other high performance technologies will be discussed where appropriate. The effects of concern will be: Single-Event Effects (SEE) and steady state total ionizing dose (TID) IC response. However, due to the growing use of opto-electronics in space systems issues concerning displacement damage testing will also be considered. This short course section is not intended to provide detailed "how-to-test" information, but simply provide a snapshot of current challenges and some of the approaches being considered.

  7. Transplanted embryonic neurons integrate into adult neocortical circuits.

    PubMed

    Falkner, Susanne; Grade, Sofia; Dimou, Leda; Conzelmann, Karl-Klaus; Bonhoeffer, Tobias; Götz, Magdalena; Hübener, Mark

    2016-11-10

    The ability of the adult mammalian brain to compensate for neuronal loss caused by injury or disease is very limited. Transplantation aims to replace lost neurons, but the extent to which new neurons can integrate into existing circuits is unknown. Here, using chronic in vivo two-photon imaging, we show that embryonic neurons transplanted into the visual cortex of adult mice mature into bona fide pyramidal cells with selective pruning of basal dendrites, achieving adult-like densities of dendritic spines and axonal boutons within 4-8 weeks. Monosynaptic tracing experiments reveal that grafted neurons receive area-specific, afferent inputs matching those of pyramidal neurons in the normal visual cortex, including topographically organized geniculo-cortical connections. Furthermore, stimulus-selective responses refine over the course of many weeks and finally become indistinguishable from those of host neurons. Thus, grafted neurons can integrate with great specificity into neocortical circuits that normally never incorporate new neurons in the adult brain.

  8. Aperture efficiency of integrated-circuit horn antennas

    NASA Technical Reports Server (NTRS)

    Guo, Yong; Lee, Karen; Stimson, Philip; Potter, Kent; Rutledge, David

    1991-01-01

    The aperture efficiency of silicon integrated-circuit horn antennas has been improved by optimizing the length of the dipole probes and by coating the entire horn walls with gold. To make these measurements, a new thin-film power-density meter was developed for measuring power density with accuracies better than 5 percent. The measured aperture efficiency improved from 44 percent to 72 percent at 93 GHz. This is sufficient for use in many applications which now use machined waveguide horns.

  9. Monolithic microwave integrated circuit technology for advanced space communication

    NASA Technical Reports Server (NTRS)

    Ponchak, George E.; Romanofsky, Robert R.

    1988-01-01

    Future Space Communications subsystems will utilize GaAs Monolithic Microwave Integrated Circuits (MMIC's) to reduce volume, weight, and cost and to enhance system reliability. Recent advances in GaAs MMIC technology have led to high-performance devices which show promise for insertion into these next generation systems. The status and development of a number of these devices operating from Ku through Ka band will be discussed along with anticipated potential applications.

  10. Computer-Aided Engineering of Semiconductor Integrated Circuits

    DTIC Science & Technology

    1979-07-01

    growth and the resulting electrical properties are critical if reproducible device performance is to be achieved. Despite the fact that thermally grown... properties is the continuing decrease in active device This work represents a joint effort by the Stanford University Integrated Circuits Laboratory, Fairchild...goals will allow accurate prediction of oxide and surface properties and the influence of oxidation on other processes for an arbitrary device

  11. Extended life testing evaluation of complementary MOS integrated circuits

    NASA Technical Reports Server (NTRS)

    Brosnan, T. E.

    1972-01-01

    The purpose of the extended life testing evaluation of complementary MOS integrated circuits was twofold: (1) To ascertain the long life capability of complementary MOS devices. (2) To assess the objectivity and reliability of various accelerated life test methods as an indication or prediction tool. In addition, the determination of a suitable life test sequence for these devices was of importance. Conclusions reached based on the parts tested and the test results obtained was that the devices were not acceptable.

  12. Laser Integration on Silicon Photonic Circuits Through Transfer Printing

    DTIC Science & Technology

    2017-03-10

    AFRL-AFOSR-UK-TR-2017-0019 Laser integration on silicon photonic circuits through transfer printing Gunther Roelkens UNIVERSITEIT GENT VZW Final...Form ApprovedOMB No. 0704-0188 The public reporting burden for this collection of information is estimated to average 1 hour per response, including...collection of information . Send comments regarding this burden estimate or   any other aspect of this collection of information , including suggestions

  13. 3-D imaging using row-column-addressed arrays with integrated apodization - part i: apodization design and line element beamforming.

    PubMed

    Rasmussen, Morten Fischer; Christiansen, Thomas Lehrmann; Thomsen, Erik Vilain; Jensen, Jørgen Arendt

    2015-05-01

    This paper investigates the effect of transducerintegrated apodization in row-column-addressed arrays and presents a beamforming approach specific for such arrays. Row-column addressing 2-D arrays greatly reduces the number of active channels needed to acquire a 3-D volume. A disadvantage of row-column-addressed arrays is an apparent ghost effect in the point spread function caused by edge waves. This paper investigates the origin of the edge waves and the effect of introducing an integrated apodization to reduce the ghost echoes. The performance of a λ/2-pitch 5-MHz 128 + 128 row-column-addressed array with different apodizations is simulated. A Hann apodization is shown to decrease imaging performance away from the center axis of the array because of a decrease in main lobe amplitude. Instead, a static roll-off apodization region located at the ends of the line elements is proposed. In simulations, the peak ghost echo intensity of a scatterer at (x,y, z) = (8, 3, 30) mm was decreased by 43 dB by integrating roll-off apodization into the array. The main lobe was unaffected by the apodization. Simulations of a 3-mm-diameter anechoic blood vessel at 30 mm depth showed that applying the transducer-integrated apodization increased the apparent diameter of the vessel from 2.0 mm to 2.4 mm, corresponding to an increase from 67% to 80% of the true vessel diameter. The line element beamforming approach is shown to be essential for achieving correct time-of-flight calculations, and hence avoid geometrical distortions. In Part II of this work, experimental results from a capacitive micromachined ultrasonic transducer with integrated roll-off apodization are given to validate the effect of integrating apodization into the line elements.

  14. Reconfigurable SDM Switching Using Novel Silicon Photonic Integrated Circuit.

    PubMed

    Ding, Yunhong; Kamchevska, Valerija; Dalgaard, Kjeld; Ye, Feihong; Asif, Rameez; Gross, Simon; Withford, Michael J; Galili, Michael; Morioka, Toshio; Oxenløwe, Leif Katsuo

    2016-12-21

    Space division multiplexing using multicore fibers is becoming a more and more promising technology. In space-division multiplexing fiber network, the reconfigurable switch is one of the most critical components in network nodes. In this paper we for the first time demonstrate reconfigurable space-division multiplexing switching using silicon photonic integrated circuit, which is fabricated on a novel silicon-on-insulator platform with buried Al mirror. The silicon photonic integrated circuit is composed of a 7 × 7 switch and low loss grating coupler array based multicore fiber couplers. Thanks to the Al mirror, grating couplers with ultra-low coupling loss with optical multicore fibers is achieved. The lowest total insertion loss of the silicon integrated circuit is as low as 4.5 dB, with low crosstalk lower than -30 dB. Excellent performances in terms of low insertion loss and low crosstalk are obtained for the whole C-band. 1 Tb/s/core transmission over a 2-km 7-core fiber and space-division multiplexing switching is demonstrated successfully. Bit error rate performance below 10(-9) is obtained for all spatial channels with low power penalty. The proposed design can be easily upgraded to reconfigurable optical add/drop multiplexer capable of switching several multicore fibers.

  15. Reconfigurable SDM Switching Using Novel Silicon Photonic Integrated Circuit

    NASA Astrophysics Data System (ADS)

    Ding, Yunhong; Kamchevska, Valerija; Dalgaard, Kjeld; Ye, Feihong; Asif, Rameez; Gross, Simon; Withford, Michael J.; Galili, Michael; Morioka, Toshio; Oxenløwe, Leif Katsuo

    2016-12-01

    Space division multiplexing using multicore fibers is becoming a more and more promising technology. In space-division multiplexing fiber network, the reconfigurable switch is one of the most critical components in network nodes. In this paper we for the first time demonstrate reconfigurable space-division multiplexing switching using silicon photonic integrated circuit, which is fabricated on a novel silicon-on-insulator platform with buried Al mirror. The silicon photonic integrated circuit is composed of a 7 × 7 switch and low loss grating coupler array based multicore fiber couplers. Thanks to the Al mirror, grating couplers with ultra-low coupling loss with optical multicore fibers is achieved. The lowest total insertion loss of the silicon integrated circuit is as low as 4.5 dB, with low crosstalk lower than -30 dB. Excellent performances in terms of low insertion loss and low crosstalk are obtained for the whole C-band. 1 Tb/s/core transmission over a 2-km 7-core fiber and space-division multiplexing switching is demonstrated successfully. Bit error rate performance below 10-9 is obtained for all spatial channels with low power penalty. The proposed design can be easily upgraded to reconfigurable optical add/drop multiplexer capable of switching several multicore fibers.

  16. Reconfigurable SDM Switching Using Novel Silicon Photonic Integrated Circuit

    PubMed Central

    Ding, Yunhong; Kamchevska, Valerija; Dalgaard, Kjeld; Ye, Feihong; Asif, Rameez; Gross, Simon; Withford, Michael J.; Galili, Michael; Morioka, Toshio; Oxenløwe, Leif Katsuo

    2016-01-01

    Space division multiplexing using multicore fibers is becoming a more and more promising technology. In space-division multiplexing fiber network, the reconfigurable switch is one of the most critical components in network nodes. In this paper we for the first time demonstrate reconfigurable space-division multiplexing switching using silicon photonic integrated circuit, which is fabricated on a novel silicon-on-insulator platform with buried Al mirror. The silicon photonic integrated circuit is composed of a 7 × 7 switch and low loss grating coupler array based multicore fiber couplers. Thanks to the Al mirror, grating couplers with ultra-low coupling loss with optical multicore fibers is achieved. The lowest total insertion loss of the silicon integrated circuit is as low as 4.5 dB, with low crosstalk lower than −30 dB. Excellent performances in terms of low insertion loss and low crosstalk are obtained for the whole C-band. 1 Tb/s/core transmission over a 2-km 7-core fiber and space-division multiplexing switching is demonstrated successfully. Bit error rate performance below 10−9 is obtained for all spatial channels with low power penalty. The proposed design can be easily upgraded to reconfigurable optical add/drop multiplexer capable of switching several multicore fibers. PMID:28000735

  17. 3D IC for Future HEP Detectors

    SciTech Connect

    Thom, J.; Lipton, R.; Heintz, U.; Johnson, M.; Narain, M.; Badman, R.; Spiegel, L.; Triphati, M.; Deptuch, G.; Kenney, C.; Parker, S.; Ye, Z.; Siddons, D.

    2014-11-07

    Three dimensional integrated circuit technologies offer the possibility of fabricating large area arrays of sensors integrated with complex electronics with minimal dead area, which makes them ideally suited for applications at the LHC upgraded detectors and other future detectors. Here we describe ongoing R&D efforts to demonstrate functionality of components of such detectors. This also includes the study of integrated 3D electronics with active edge sensors to produce "active tiles" which can be tested and assembled into arrays of arbitrary size with high yield.

  18. 77 FR 25747 - Certain Semiconductor Integrated Circuit Devices and Products Containing Same; Institution of...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-05-01

    ... COMMISSION Certain Semiconductor Integrated Circuit Devices and Products Containing Same; Institution of... the sale within the United States after importation of certain semiconductor integrated circuit... semiconductor integrated circuit devices and products containing same that infringe one or more of claims 1,...

  19. 75 FR 43553 - In the Matter of Certain Encapsulated Integrated Circuit Devices and Products Containing Same...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-07-26

    ... COMMISSION In the Matter of Certain Encapsulated Integrated Circuit Devices and Products Containing Same..., and sale within the United States after importation of certain encapsulated integrated circuit devices... encapsulated integrated circuit devices and products contains same in connection with claims 1- 4, 7, 17,...

  20. 75 FR 5804 - In the Matter of: Certain Semiconductor Integrated Circuits and Products Containing Same; Notice...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-02-04

    ... COMMISSION In the Matter of: Certain Semiconductor Integrated Circuits and Products Containing Same; Notice... importation, and sale within the United States after importation of certain semiconductor integrated circuits... infringement certain LSI integrated circuits, as well as certain Seagate hard disk drives that contain...

  1. 77 FR 64826 - Certain Integrated Circuit Chips and Products Containing the Same; Institution of Investigation...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-10-23

    ... COMMISSION Certain Integrated Circuit Chips and Products Containing the Same; Institution of Investigation... integrated circuit chips and products containing the same by reason of infringement of certain claims of U.S... importation of certain integrated circuit chips and products containing the same that infringe one or more...

  2. 77 FR 1505 - Certain Integrated Circuits, Chipsets, and Products Containing Same Including Televisions; Notice...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-01-10

    ... COMMISSION Certain Integrated Circuits, Chipsets, and Products Containing Same Including Televisions; Notice... importation, and the sale within the United States after importation of certain integrated circuits, chipsets... importation, or the sale within the United States after importation of certain integrated circuits,...

  3. 78 FR 10635 - Certain Integrated Circuit Devices and Products Containing the Same; Notice of Receipt of...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-02-14

    ... COMMISSION Certain Integrated Circuit Devices and Products Containing the Same; Notice of Receipt of... received a complaint entitled Certain Integrated Circuit Devices and Products Containing the Same, DN 2938..., and the sale within the United States after importation of certain integrated circuit devices...

  4. 75 FR 24742 - In the Matter of Certain Large Scale Integrated Circuit Semiconductor Chips and Products...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-05-05

    ... COMMISSION In the Matter of Certain Large Scale Integrated Circuit Semiconductor Chips and Products... the sale within the United States after importation of certain large scale integrated circuit... certain large scale integrated circuit semiconductor chips or products containing the same that...

  5. Monolithic Microwave Integrated Circuit (MMIC) Frequency Doublers - 2nd Pass Correction

    DTIC Science & Technology

    2013-09-01

    Monolithic Microwave Integrated Circuit (MMIC) Frequency Doublers—2nd Pass Correction by John E. Penn ARL-TN-0580 September 2013...September 2013 Monolithic Microwave Integrated Circuit (MMIC) Frequency Doublers—2nd Pass Correction John E. Penn Sensors and Electron...COVERED (From - To) 4. TITLE AND SUBTITLE Monolithic Microwave Integrated Circuit (MMIC) Frequency Doublers–2nd Pass Correction 5a. CONTRACT NUMBER

  6. Photonic-integrated circuit for continuous-wave THz generation.

    PubMed

    Theurer, Michael; Göbel, Thorsten; Stanze, Dennis; Troppenz, Ute; Soares, Francisco; Grote, Norbert; Schell, Martin

    2013-10-01

    We demonstrate a photonic-integrated circuit for continuous-wave (cw) terahertz (THz) generation. By comprising two lasers and an optical phase modulator on a single chip, the full control of the THz signal is enabled via a unique bidirectional operation technique. Integrated heaters allow for continuous tuning of the THz frequency over 570 GHz. Applied to a coherent cw THz photomixing system operated at 1.5 μm optical wavelength, we reach a signal-to-noise ratio of 44 dB at 1.25 THz, which is identical to the performance of a standard system based on discrete components.

  7. Diamond electro-optomechanical resonators integrated in nanophotonic circuits

    SciTech Connect

    Rath, P.; Ummethala, S.; Pernice, W. H. P.; Diewald, S.; Lewes-Malandrakis, G.; Brink, D.; Heidrich, N.; Nebel, C.

    2014-12-22

    Diamond integrated photonic devices are promising candidates for emerging applications in nanophotonics and quantum optics. Here, we demonstrate active modulation of diamond nanophotonic circuits by exploiting mechanical degrees of freedom in free-standing diamond electro-optomechanical resonators. We obtain high quality factors up to 9600, allowing us to read out the driven nanomechanical response with integrated optical interferometers with high sensitivity. We are able to excite higher order mechanical modes up to 115 MHz and observe the nanomechanical response also under ambient conditions.

  8. Compilation of an integrated 3D soil and agrogeological database for the hydrophysical characterization of the unsaturated zone

    NASA Astrophysics Data System (ADS)

    Bakacsi, Zsófia; Kuti, László; Pásztor, László; Vatai, József; Szabó, József; Müller, Tamás.

    2010-05-01

    Describing the water movement in the unsaturated zone, numerous soil hydraulic data as input parameter are required concerning the water retention curve and the hydraulic conductivity function as the main hydraulic properties. The direct measurements of the hydraulic parameters are quite difficult and time-consuming; the estimation of them can be an alternative especially for large areas. The most commonly used basis of the estimation is the particle-size distribution (PSD) data or texture class. The aim of our work was to compile an integrated and harmonized 3D pedo- and agrogeological database with the physical properties and stratification of the formations to the depth of the permanent groundwater level, which describes the unsaturated zone in a 690 km2 pilot area. Since the existing pedo- and agrogeological databases are not able to serve separately these 3D model requirements, their integration was necessary. Due to its appropriate spatial and thematic resolution and data processing status, the Digital Kreybig Soil Information System (DKSIS) was chosen as pedological data source of the 3D model. The DKSIS has been compiled in the Research Institute for Soil Science and Agricultural Chemistry of the Hungarian Academy of Sciences, based on the 1:25,000 scale, national soil mapping program in Hungary. The survey sheets indicate the location of the observation sites. Due to the lack of measured PSD data, the field estimation of the textural classes, and the so-called "capillary rise of water" were used for the definition of the texture classes. The measured water uptake is supposed to have good relation with the textural class of the sample. During the data processing the inconsistent fields vs. capillary data pairs were excluded. In the DKSIS 649 polygons cover the pilot area, 484 soil profiles are occurring and characteristically each profile has two or three horizons. The agrogeological dataset is maintained by the Hungarian Geological Institute and derives

  9. Universal discrete Fourier optics RF photonic integrated circuit architecture.

    PubMed

    Hall, Trevor J; Hasan, Mehedi

    2016-04-04

    This paper describes a coherent electro-optic circuit architecture that generates a frequency comb consisting of N spatially separated orders using a generalised Mach-Zenhder interferometer (MZI) with its N × 1 combiner replaced by an optical N × N Discrete Fourier Transform (DFT). Advantage may be taken of the tight optical path-length control, component and circuit symmetries and emerging trimming algorithms offered by photonic integration in any platform that offers linear electro-optic phase modulation such as LiNbO3, silicon, III-V or hybrid technology. The circuit architecture subsumes all MZI-based RF photonic circuit architectures in the prior art given an appropriate choice of output port(s) and dimension N although the principal application envisaged is phase correlated subcarrier generation for all optical orthogonal frequency division multiplexing. A transfer matrix approach is used to model the operation of the architecture. The predictions of the model are validated by simulations performed using an industry standard software tool. Implementation is found to be practical.

  10. Pneumatic oscillator circuits for timing and control of integrated microfluidics.

    PubMed

    Duncan, Philip N; Nguyen, Transon V; Hui, Elliot E

    2013-11-05

    Frequency references are fundamental to most digital systems, providing the basis for process synchronization, timing of outputs, and waveform synthesis. Recently, there has been growing interest in digital logic systems that are constructed out of microfluidics rather than electronics, as a possible means toward fully integrated laboratory-on-a-chip systems that do not require any external control apparatus. However, the full realization of this goal has not been possible due to the lack of on-chip frequency references, thus requiring timing signals to be provided from off-chip. Although microfluidic oscillators have been demonstrated, there have been no reported efforts to characterize, model, or optimize timing accuracy, which is the fundamental metric of a clock. Here, we report pneumatic ring oscillator circuits built from microfluidic valves and channels. Further, we present a compressible-flow analysis that differs fundamentally from conventional circuit theory, and we show the utility of this physically based model for the optimization of oscillator stability. Finally, we leverage microfluidic clocks to demonstrate circuits for the generation of phase-shifted waveforms, self-driving peristaltic pumps, and frequency division. Thus, pneumatic oscillators can serve as on-chip frequency references for microfluidic digital logic circuits. On-chip clocks and pumps both constitute critical building blocks on the path toward achieving autonomous laboratory-on-a-chip devices.

  11. Rapid Reconstitution Packages (RRPs) implemented by integration of computational fluid dynamics (CFD) and 3D printed microfluidics.

    PubMed

    Chi, Albert; Curi, Sebastian; Clayton, Kevin; Luciano, David; Klauber, Kameron; Alexander-Katz, Alfredo; D'hers, Sebastian; Elman, Noel M

    2014-08-01

    Rapid Reconstitution Packages (RRPs) are portable platforms that integrate microfluidics for rapid reconstitution of lyophilized drugs. Rapid reconstitution of lyophilized drugs using standard vials and syringes is an error-prone process. RRPs were designed using computational fluid dynamics (CFD) techniques to optimize fluidic structures for rapid mixing and integrating physical properties of targeted drugs and diluents. Devices were manufactured using stereo lithography 3D printing for micrometer structural precision and rapid prototyping. Tissue plasminogen activator (tPA) was selected as the initial model drug to test the RRPs as it is unstable in solution. tPA is a thrombolytic drug, stored in lyophilized form, required in emergency settings for which rapid reconstitution is of critical importance. RRP performance and drug stability were evaluated by high-performance liquid chromatography (HPLC) to characterize release kinetics. In addition, enzyme-linked immunosorbent assays (ELISAs) were performed to test for drug activity after the RRPs were exposed to various controlled temperature conditions. Experimental results showed that RRPs provided effective reconstitution of tPA that strongly correlated with CFD results. Simulation and experimental results show that release kinetics can be adjusted by tuning the device structural dimensions and diluent drug physical parameters. The design of RRPs can be tailored for a number of applications by taking into account physical parameters of the active pharmaceutical ingredients (APIs), excipients, and diluents. RRPs are portable platforms that can be utilized for reconstitution of emergency drugs in time-critical therapies.

  12. Integration of 3D Printed and Micropatterned Polycaprolactone Scaffolds for Guidance of Oriented Collagenous Tissue Formation In vivo

    PubMed Central

    Pilipchuk, Sophia P; Monje, Alberto; Jiao, Yizu; Hao, Jie; Kruger, Laura; Flanagan, Colleen L; Hollister, Scott J

    2016-01-01

    Scaffold design incorporating multi-scale cues for clinically-relevant, aligned tissue regeneration has potential to improve structural and functional integrity of multi-tissue interfaces. The objective of this pre-clinical study was to develop poly(ε-caprolactone) (PCL) scaffolds with mesoscale and microscale architectural cues specific to human ligament progenitor cells and assess their ability to form aligned bone-ligament-cementum complexes in vivo. PCL scaffolds were designed to integrate a 3D printed bone region with a micropatterned PCL thin film consisting of grooved pillars. The patterned film region was seeded with human ligament cells, fibroblasts transduced with BMP-7 genes seeded within the bone region, and a tooth dentin segment positioned on the ligament region prior to subcutaneous implantation into a murine model. Results indicated increased tissue alignment in vivo using micropatterned PCL films, compared to random-porous PCL. At 6 weeks, 30um groove depth significantly enhanced oriented collagen fiber thickness, overall cell alignment, and nuclear elongation relative to 10um groove depth. This study demonstrates for the first time that scaffolds with combined hierarchical mesoscale and microscale features can align cells in vivo for oral tissue repair with potential for improving the regenerative response of other bone-ligament complexes. PMID:26820240

  13. An intelligent recovery progress evaluation system for ACL reconstructed subjects using integrated 3-D kinematics and EMG features.

    PubMed

    Malik, Owais A; Senanayake, S M N Arosha; Zaheer, Dansih

    2015-03-01

    An intelligent recovery evaluation system is presented for objective assessment and performance monitoring of anterior cruciate ligament reconstructed (ACL-R) subjects. The system acquires 3-D kinematics of tibiofemoral joint and electromyography (EMG) data from surrounding muscles during various ambulatory and balance testing activities through wireless body-mounted inertial and EMG sensors, respectively. An integrated feature set is generated based on different features extracted from data collected for each activity. The fuzzy clustering and adaptive neuro-fuzzy inference techniques are applied to these integrated feature sets in order to provide different recovery progress assessment indicators (e.g., current stage of recovery, percentage of recovery progress as compared to healthy group, etc.) for ACL-R subjects. The system was trained and tested on data collected from a group of healthy and ACL-R subjects. For recovery stage identification, the average testing accuracy of the system was found above 95% (95-99%) for ambulatory activities and above 80% (80-84%) for balance testing activities. The overall recovery evaluation performed by the proposed system was found consistent with the assessment made by the physiotherapists using standard subjective/objective scores. The validated system can potentially be used as a decision supporting tool by physiatrists, physiotherapists, and clinicians for quantitative rehabilitation analysis of ACL-R subjects in conjunction with the existing recovery monitoring systems.

  14. Terrestrial and Aerial Laser Scanning Data Integration Using Wavelet Analysis for the Purpose of 3D Building Modeling

    PubMed Central

    Kedzierski, Michal; Fryskowska, Anna

    2014-01-01

    Visualization techniques have been greatly developed in the past few years. Three-dimensional models based on satellite and aerial imagery are now being enhanced by models generated using Aerial Laser Scanning (ALS) data. The most modern of such scanning systems have the ability to acquire over 50 points per square meter and to register a multiple echo, which allows the reconstruction of the terrain together with the terrain cover. However, ALS data accuracy is less than 10 cm and the data is often incomplete: there is no information about ground level (in most scanning systems), and often around the facade or structures which have been covered by other structures. However, Terrestrial Laser Scanning (TLS) not only acquires higher accuracy data (1–5 cm) but is also capable of registering those elements which are incomplete or not visible using ALS methods (facades, complicated structures, interiors, etc.). Therefore, to generate a complete 3D model of a building in high Level of Details, integration of TLS and ALS data is necessary. This paper presents the wavelet-based method of processing and integrating data from ALS and TLS. Methods of choosing tie points to combine point clouds in different datum will be analyzed. PMID:25004157

  15. Terrestrial and aerial laser scanning data integration using wavelet analysis for the purpose of 3D building modeling.

    PubMed

    Kedzierski, Michal; Fryskowska, Anna

    2014-07-07

    Visualization techniques have been greatly developed in the past few years. Three-dimensional models based on satellite and aerial imagery are now being enhanced by models generated using Aerial Laser Scanning (ALS) data. The most modern of such scanning systems have the ability to acquire over 50 points per square meter and to register a multiple echo, which allows the reconstruction of the terrain together with the terrain cover. However, ALS data accuracy is less than 10 cm and the data is often incomplete: there is no information about ground level (in most scanning systems), and often around the facade or structures which have been covered by other structures. However, Terrestrial Laser Scanning (TLS) not only acquires higher accuracy data (1-5 cm) but is also capable of registering those elements which are incomplete or not visible using ALS methods (facades, complicated structures, interiors, etc.). Therefore, to generate a complete 3D model of a building in high Level of Details, integration of TLS and ALS data is necessary. This paper presents the wavelet-based method of processing and integrating data from ALS and TLS. Methods of choosing tie points to combine point clouds in different datum will be analyzed.

  16. Integration of 3D Printed and Micropatterned Polycaprolactone Scaffolds for Guidance of Oriented Collagenous Tissue Formation In Vivo.

    PubMed

    Pilipchuk, Sophia P; Monje, Alberto; Jiao, Yizu; Hao, Jie; Kruger, Laura; Flanagan, Colleen L; Hollister, Scott J; Giannobile, William V

    2016-03-01

    Scaffold design incorporating multiscale cues for clinically relevant, aligned tissue regeneration has potential to improve structural and functional integrity of multitissue interfaces. The objective of this preclinical study is to develop poly(ε-caprolactone) (PCL) scaffolds with mesoscale and microscale architectural cues specific to human ligament progenitor cells and assess their ability to form aligned bone-ligament-cementum complexes in vivo. PCL scaffolds are designed to integrate a 3D printed bone region with a micropatterned PCL thin film consisting of grooved pillars. The patterned film region is seeded with human ligament cells, fibroblasts transduced with bone morphogenetic protein-7 genes seeded within the bone region, and a tooth dentin segment positioned on the ligament region prior to subcutaneous implantation into a murine model. Results indicate increased tissue alignment in vivo using micropatterned PCL films, compared to random-porous PCL. At week 6, 30 μm groove depth significantly enhances oriented collagen fiber thickness, overall cell alignment, and nuclear elongation relative to 10 μm groove depth. This study demonstrates for the first time that scaffolds with combined hierarchical mesoscale and microscale features can align cells in vivo for oral tissue repair with potential for improving the regenerative response of other bone-ligament complexes.

  17. A General Method for Evaluation of 2D and 3D Domain Integrals Without Domain Discretization and its Application in BEM

    NASA Astrophysics Data System (ADS)

    Hematiyan, M. R.

    2007-03-01

    A robust method is presented to evaluate 2D and 3D domain integrals without domain discretization. Each domain integral is transformed into a double integral, a boundary integral and a 1D integral. Both integrals are evaluated by adaptive Simpson quadrature method. The method can be used to evaluate domain integrals over simply or multiply connected regions with any arbitrary form of integrands. As an application of the method, domain integrals produced in boundary element formulation of potential and elastostatic problems are analyzed. Several examples are provided to show the validity and accuracy of the method.

  18. Hybrid III-V/silicon SOA for photonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Kaspar, P.; Brenot, R.; Le Liepvre, A.; Accard, A.; Make, D.; Levaufre, G.; Girard, N.; Lelarge, F.; Duan, G.-H.; Olivier, S.; Jany, Christophe; Kopp, C.; Menezo, S.

    2014-11-01

    Silicon photonics has reached a considerable level of maturity, and the complexity of photonic integrated circuits (PIC) is steadily increasing. As the number of components in a PIC grows, loss management becomes more and more important. Integrated semiconductor optical amplifiers (SOA) will be crucial components in future photonic systems for loss compensation. In addition, there are specific applications, where SOAs can play a key role beyond mere loss compensation, such as modulated reflective SOAs in carrier distributed passive optical networks or optical gates in packet switching. It is, therefore, highly desirable to find a generic integration platform that includes the possibility of integrating SOAs on silicon. Various methods are currently being developed to integrate light emitters on silicon-on-insulator (SOI) waveguide circuits. Many of them use III-V materials for the hybrid integration on SOI. Various types of lasers have been demonstrated by several groups around the globe. In some of the integration approaches, SOAs can be implemented using essentially the same technology as for lasers. In this paper we will focus on SOA devices based on a hybrid integration approach where III-V material is bonded on SOI and a vertical optical mode transfer is used to couple light between SOI waveguides and guides formed in bonded III-V semiconductor layers. In contrast to evanescent coupling schemes, this mode transfer allows for a higher confinement factor in the gain material and thus for efficient light amplification over short propagation distances. We will outline the fabrication process of our hybrid components and present some of the most interesting results from a fabricated and packaged hybrid SOA.

  19. Design and status of the RF-digitizer integrated circuit

    NASA Technical Reports Server (NTRS)

    Rayhrer, B.; Lam, B.; Young, L. E.; Srinivasan, J. M.; Thomas, J. B.

    1991-01-01

    An integrated circuit currently under development samples a bandpass-limited signal at a radio frequency in quadrature and then performs a simple sum-and-dump operation in order to filter and lower the rate of the samples. Downconversion to baseband is carried out by the sampling step itself through the aliasing effect of an appropriately selected subharmonic sampling frequency. Two complete RF digitizer circuits with these functions will be implemented with analog and digital elements on one GaAs substrate. An input signal, with a carrier frequency as high as 8 GHz, can be sampled at a rate as high as 600 Msamples/sec for each quadrature component. The initial version of the chip will sign-sample (1-bit) the input RF signal. The chip will contain a synthesizer to generate a sample frequency that is a selectable integer multiple of an input reference frequency. In addition to the usual advantages of compactness and reliability associated with integrated circuits, the single chip will replace several steps required by standard analog downconversion. Furthermore, when a very high initial sample rate is selected, the presampling analog filters can be given very large bandwidths, thereby greatly reducing phase and delay instabilities typically introduced by such filters, as well as phase and delay variation due to Doppler changes.

  20. Design automation for integrated nonlinear logic circuits (Conference Presentation)

    NASA Astrophysics Data System (ADS)

    Van Vaerenbergh, Thomas; Pelc, Jason; Santori, Charles; Bose, Ranojoy; Kielpinski, Dave; Beausoleil, Raymond G.

    2016-05-01

    A key enabler of the IT revolution of the late 20th century was the development of electronic design automation (EDA) tools allowing engineers to manage the complexity of electronic circuits with transistor counts now reaching into the billions. Recently, we have been developing large-scale nonlinear photonic integrated logic circuits for next generation all-optical information processing. At this time a sufficiently powerful EDA-style software tool chain to design this type of complex circuits does not yet exist. Here we describe a hierarchical approach to automating the design and validation of photonic integrated circuits, which can scale to several orders of magnitude higher complexity than the state of the art. Most photonic integrated circuits developed today consist of a small number of components, and only limited hierarchy. For example, a simple photonic transceiver may contain on the order of 10 building-block components, consisting of grating couplers for photonic I/O, modulators, and signal splitters/combiners. Because this is relatively easy to lay out by hand (or simple script) existing photonic design tools have relatively little automation in comparison to electronics tools. But demonstrating all-optical logic will require significantly more complex photonic circuits containing up to 1,000 components, hence becoming infeasible to design manually. Our design framework is based off Python-based software from Luceda Photonics which provides an environment to describe components, simulate their behavior, and export design files (GDS) to foundries for fabrication. At a fundamental level, a photonic component is described as a parametric cell (PCell) similarly to electronics design. PCells are described by geometric characteristics of their layout. A critical part of the design framework is the implementation of PCells as Python objects. PCell objects can then use inheritance to simplify design, and hierarchical designs can be made by creating composite

  1. Extended depth-of-field 3D endoscopy with synthetic aperture integral imaging using an electrically tunable focal-length liquid-crystal lens.

    PubMed

    Wang, Yu-Jen; Shen, Xin; Lin, Yi-Hsin; Javidi, Bahram

    2015-08-01

    Conventional synthetic-aperture integral imaging uses a lens array to sense the three-dimensional (3D) object or scene that can then be reconstructed digitally or optically. However, integral imaging generally suffers from a fixed and limited range of depth of field (DOF). In this Letter, we experimentally demonstrate a 3D integral-imaging endoscopy with tunable DOF by using a single large-aperture focal-length-tunable liquid crystal (LC) lens. The proposed system can provide high spatial resolution and an extended DOF in synthetic-aperture integral imaging 3D endoscope. In our experiments, the image plane in the integral imaging pickup process can be tuned from 18 to 38 mm continuously using a large-aperture LC lens, and the total DOF is extended from 12 to 51 mm. To the best of our knowledge, this is the first report on synthetic aperture integral imaging 3D endoscopy with a large-aperture LC lens that can provide high spatial resolution 3D imaging with an extend DOF.

  2. Synthetic circuits integrating logic and memory in living cells.

    PubMed

    Siuti, Piro; Yazbek, John; Lu, Timothy K

    2013-05-01

    Logic and memory are essential functions of circuits that generate complex, state-dependent responses. Here we describe a strategy for efficiently assembling synthetic genetic circuits that use recombinases to implement Boolean logic functions with stable DNA-encoded memory of events. Application of this strategy allowed us to create all 16 two-input Boolean logic functions in living Escherichia coli cells without requiring cascades comprising multiple logic gates. We demonstrate long-term maintenance of memory for at least 90 cell generations and the ability to interrogate the states of these synthetic devices with fluorescent reporters and PCR. Using this approach we created two-bit digital-to-analog converters, which should be useful in biotechnology applications for encoding multiple stable gene expression outputs using transient inputs of inducers. We envision that this integrated logic and memory system will enable the implementation of complex cellular state machines, behaviors and pathways for therapeutic, diagnostic and basic science applications.

  3. Adaptive Voltage Management Enabling Energy Efficiency in Nanoscale Integrated Circuits

    NASA Astrophysics Data System (ADS)

    Shapiro, Alexander E.

    Battery powered devices emphasize energy efficiency in modern sub-22 nm CMOS microprocessors rendering classic power reduction solutions not sufficient. Classical solutions that reduce power consumption in high performance integrated circuits are superseded with novel and enhanced power reduction techniques to enable the greater energy efficiency desired in modern microprocessors and emerging mobile platforms. Dynamic power consumption is reduced by operating over a wide range of supply voltages. This region of operation is enabled by a high speed and power efficient level shifter which translates low voltage digital signals to higher voltages (and vice versa), a key component that enables communication among circuits operating at different voltage levels. Additionally, optimizing the wide supply voltage range of signals propagating across long interconnect enables greater energy savings. A closed-form delay model supporting wide voltage range is developed to enable this capability. The model supports an ultra-wide voltage range from nominal voltages to subthreshold voltages, and a wide range of repeater sizes. To mitigate the drawback of lower operating speed at reduced supply voltages, the high performance exhibited by MOS current mode logic technology is exploited. High performance and energy efficient circuits are enabled by combining this logic style with power efficient near threshold circuits. Many-core systems that operate at high frequencies and process highly parallel workloads benefit from this combination of MCML with NTC. Due to aggressive scaling, static power consumption can in some cases overshadow dynamic power. Techniques to lower leakage power have therefore become an important objective in modern microprocessors. To address this issue, an adaptive power gating technique is proposed. This technique utilizes high levels of granularity to save additional leakage power when a circuit is active as opposed to standard power gating that saves static

  4. Critical Analysis and Digital Reconstructions of Alberti's Architectures by the Use of 3d Morphometric Integrated Survey Database

    NASA Astrophysics Data System (ADS)

    Ferrari, F.; Medici, M.

    2017-02-01

    Since 2005, DIAPReM Centre of the Department of Architecture of the University of Ferrara, in collaboration with the "Centro Studi Leon Battista Alberti" Foundation and the Consorzio Futuro in Ricerca, is carrying out a research project for the creation of 3D databases that could allow the development of a critical interpretation of Alberti's architectural work. The project is primarily based on a common three-dimensional integrated survey methodology for the creation of a navigable multilayered database. The research allows the possibility of reiterative metrical analysis, thanks to the use of a coherent data in order to check and validate hypothesis by researchers, art historians and scholars on Alberti's architectural work. Coherently with this methodological framework, indeed, two case studies are explained in this paper: the church of San Sebastiano in Matua and The Church of the Santissima Annunziata in Florence. Furthermore, thanks to a brief introduction of further developments of the project, a short graphical analysis of preliminary results on Tempio Malatestiano in Rimini opens new perspectives of research.

  5. ePlant and the 3D Data Display Initiative: Integrative Systems Biology on the World Wide Web

    PubMed Central

    Fucile, Geoffrey; Di Biase, David; Nahal, Hardeep; La, Garon; Khodabandeh, Shokoufeh; Chen, Yani; Easley, Kante; Christendat, Dinesh; Kelley, Lawrence; Provart, Nicholas J.

    2011-01-01

    Visualization tools for biological data are often limited in their ability to interactively integrate data at multiple scales. These computational tools are also typically limited by two-dimensional displays and programmatic implementations that require separate configurations for each of the user's computing devices and recompilation for functional expansion. Towards overcoming these limitations we have developed “ePlant” (http://bar.utoronto.ca/eplant) – a suite of open-source world wide web-based tools for the visualization of large-scale data sets from the model organism Arabidopsis thaliana. These tools display data spanning multiple biological scales on interactive three-dimensional models. Currently, ePlant consists of the following modules: a sequence conservation explorer that includes homology relationships and single nucleotide polymorphism data, a protein structure model explorer, a molecular interaction network explorer, a gene product subcellular localization explorer, and a gene expression pattern explorer. The ePlant's protein structure explorer module represents experimentally determined and theoretical structures covering >70% of the Arabidopsis proteome. The ePlant framework is accessed entirely through a web browser, and is therefore platform-independent. It can be applied to any model organism. To facilitate the development of three-dimensional displays of biological data on the world wide web we have established the “3D Data Display Initiative” (http://3ddi.org). PMID:21249219

  6. ePlant and the 3D data display initiative: integrative systems biology on the world wide web.

    PubMed

    Fucile, Geoffrey; Di Biase, David; Nahal, Hardeep; La, Garon; Khodabandeh, Shokoufeh; Chen, Yani; Easley, Kante; Christendat, Dinesh; Kelley, Lawrence; Provart, Nicholas J

    2011-01-10

    Visualization tools for biological data are often limited in their ability to interactively integrate data at multiple scales. These computational tools are also typically limited by two-dimensional displays and programmatic implementations that require separate configurations for each of the user's computing devices and recompilation for functional expansion. Towards overcoming these limitations we have developed "ePlant" (http://bar.utoronto.ca/eplant) - a suite of open-source world wide web-based tools for the visualization of large-scale data sets from the model organism Arabidopsis thaliana. These tools display data spanning multiple biological scales on interactive three-dimensional models. Currently, ePlant consists of the following modules: a sequence conservation explorer that includes homology relationships and single nucleotide polymorphism data, a protein structure model explorer, a molecular interaction network explorer, a gene product subcellular localization explorer, and a gene expression pattern explorer. The ePlant's protein structure explorer module represents experimentally determined and theoretical structures covering >70% of the Arabidopsis proteome. The ePlant framework is accessed entirely through a web browser, and is therefore platform-independent. It can be applied to any model organism. To facilitate the development of three-dimensional displays of biological data on the world wide web we have established the "3D Data Display Initiative" (http://3ddi.org).

  7. High-κ Al2O3 material in low temperature wafer-level bonding for 3D integration application

    NASA Astrophysics Data System (ADS)

    Fan, J.; Tu, L. C.; Tan, C. S.

    2014-03-01

    This work systematically investigated a high-κ Al2O3 material for low temperature wafer-level bonding for potential applications in 3D microsystems. A clean Si wafer with an Al2O3 layer thickness of 50 nm was applied as our experimental approach. Bonding was initiated in a clean room ambient after surface activation, followed by annealing under inert ambient conditions at 300 °C for 3 h. The investigation consisted of three parts: a mechanical support study using the four-point bending method, hermeticity measurements using the helium bomb test, and thermal conductivity analysis for potential heterogeneous bonding. Compared with samples bonded using a conventional oxide bonding material (SiO2), a higher interfacial adhesion energy (˜11.93 J/m2) and a lower helium leak rate (˜6.84 × 10-10 atm.cm3/sec) were detected for samples bonded using Al2O3. More importantly, due to the excellent thermal conductivity performance of Al2O3, this technology can be used in heterogeneous direct bonding, which has potential applications for enhancing the performance of Si photonic integrated devices.

  8. Implantable neurotechnologies: a review of integrated circuit neural amplifiers.

    PubMed

    Ng, Kian Ann; Greenwald, Elliot; Xu, Yong Ping; Thakor, Nitish V

    2016-01-01

    Neural signal recording is critical in modern day neuroscience research and emerging neural prosthesis programs. Neural recording requires the use of precise, low-noise amplifier systems to acquire and condition the weak neural signals that are transduced through electrode interfaces. Neural amplifiers and amplifier-based systems are available commercially or can be designed in-house and fabricated using integrated circuit (IC) technologies, resulting in very large-scale integration or application-specific integrated circuit solutions. IC-based neural amplifiers are now used to acquire untethered/portable neural recordings, as they meet the requirements of a miniaturized form factor, light weight and low power consumption. Furthermore, such miniaturized and low-power IC neural amplifiers are now being used in emerging implantable neural prosthesis technologies. This review focuses on neural amplifier-based devices and is presented in two interrelated parts. First, neural signal recording is reviewed, and practical challenges are highlighted. Current amplifier designs with increased functionality and performance and without penalties in chip size and power are featured. Second, applications of IC-based neural amplifiers in basic science experiments (e.g., cortical studies using animal models), neural prostheses (e.g., brain/nerve machine interfaces) and treatment of neuronal diseases (e.g., DBS for treatment of epilepsy) are highlighted. The review concludes with future outlooks of this technology and important challenges with regard to neural signal amplification.

  9. Integrated circuits: Resistless processing simplifies production and cuts costs

    NASA Astrophysics Data System (ADS)

    Weiner, K.

    1993-03-01

    Reducing the complexity and cost of producing deep-submicrometer integrated circuits (IC's) will soon be possible using a revolutionary approach being developed at the Lawrence Livermore National Laboratory (LLNL). Resistless Projection Doping (RPD) will eliminate the need for photoresist processing during the impurity doping step. This single innovation will reduce the doping sequence from 13 steps to 1 and eliminate the need for five pieces of capital equipment costing more than $5 million. The overall cost of high-volume wafer fabrication will be reduced by more than 10 percent. In addition, the LLNL RPD machine is compact and modular, minimizing facilities costs when compared to today's industry-standard doping equipment. These physical characteristics of the machine also allow the RPD process to be easily incorporated into single-wafer, 'cluster' processing tools. When integrated with existing deposition, etching, and annealing steps and developing lithography techniques, the LLNL doping process completes the technology set required to produce a flexible fabrication facility of the future. At one-fifth the cost of current mega-fabrication facilities, the availability of these compact, low-volume, smart factories will give US manufacturers a substantial competitive advantage in the world-wide marketplace for high-value custom and semi-custom integrated circuits.

  10. Implantable neurotechnologies: a review of integrated circuit neural amplifiers

    PubMed Central

    Greenwald, Elliot; Xu, Yong Ping; Thakor, Nitish V.

    2016-01-01

    Neural signal recording is critical in modern day neuroscience research and emerging neural prosthesis programs. Neural recording requires the use of precise, low-noise amplifier systems to acquire and condition the weak neural signals that are transduced through electrode interfaces. Neural amplifiers and amplifier-based systems are available commercially or can be designed in-house and fabricated using integrated circuit (IC) technologies, resulting in very large-scale integration or application-specific integrated circuit solutions. IC-based neural amplifiers are now used to acquire untethered/portable neural recordings, as they meet the requirements of a miniaturized form factor, light weight and low power consumption. Furthermore, such miniaturized and low-power IC neural amplifiers are now being used in emerging implantable neural prosthesis technologies. This review focuses on neural amplifier-based devices and is presented in two interrelated parts. First, neural signal recording is reviewed, and practical challenges are highlighted. Current amplifier designs with increased functionality and performance and without penalties in chip size and power are featured. Second, applications of IC-based neural amplifiers in basic science experiments (e.g., cortical studies using animal models), neural prostheses (e.g., brain/nerve machine interfaces) and treatment of neuronal diseases (e.g., DBS for treatment of epilepsy) are highlighted. The review concludes with future outlooks of this technology and important challenges with regard to neural signal amplification. PMID:26798055

  11. Universal nondestructive mm-wave integrated circuit test fixture

    NASA Technical Reports Server (NTRS)

    Romanofsky, Robert R. (Inventor); Shalkhauser, Kurt A. (Inventor)

    1990-01-01

    Monolithic microwave integrated circuit (MMIC) test includes a bias module having spring-loaded contacts which electrically engage pads on a chip carrier disposed in a recess of a base member. RF energy is applied to and passed from the chip carrier by chamfered edges of ridges in the waveguide passages of housings which are removably attached to the base member. Thru, Delay, and Short calibration standards having dimensions identical to those of the chip carrier assure accuracy and reliability of the test. The MMIC chip fits in an opening in the chip carrier with the boundaries of the MMIC lying on movable reference planes thereby establishing accuracy and flexibility.

  12. Cycles of self-pulsations in a photonic integrated circuit.

    PubMed

    Karsaklian Dal Bosco, Andreas; Kanno, Kazutaka; Uchida, Atsushi; Sciamanna, Marc; Harayama, Takahisa; Yoshimura, Kazuyuki

    2015-12-01

    We report experimentally on the bifurcation cascade leading to the appearance of self-pulsation in a photonic integrated circuit in which a laser diode is subjected to delayed optical feedback. We study the evolution of the self-pulsing frequency with the increase of both the feedback strength and the injection current. Experimental observations show good qualitative accordance with numerical results carried out with the Lang-Kobayashi rate equation model. We explain the mechanism underlying the self-pulsations by a phenomenon of beating between successive pairs of external cavity modes and antimodes.

  13. Light-induced voltage alteration for integrated circuit analysis

    DOEpatents

    Cole, Jr., Edward I.; Soden, Jerry M.

    1995-01-01

    An apparatus and method are described for analyzing an integrated circuit (IC), The invention uses a focused light beam that is scanned over a surface of the IC to generate a light-induced voltage alteration (LIVA) signal for analysis of the IC, The LIVA signal may be used to generate an image of the IC showing the location of any defects in the IC; and it may be further used to image and control the logic states of the IC. The invention has uses for IC failure analysis, for the development of ICs, for production-line inspection of ICs, and for qualification of ICs.

  14. Light-induced voltage alteration for integrated circuit analysis

    DOEpatents

    Cole, E.I. Jr.; Soden, J.M.

    1995-07-04

    An apparatus and method are described for analyzing an integrated circuit (IC). The invention uses a focused light beam that is scanned over a surface of the IC to generate a light-induced voltage alteration (LIVA) signal for analysis of the IC. The LIVA signal may be used to generate an image of the IC showing the location of any defects in the IC; and it may be further used to image and control the logic states of the IC. The invention has uses for IC failure analysis, for the development of ICs, for production-line inspection of ICs, and for qualification of ICs. 18 figs.

  15. Method for deposition of a conductor in integrated circuits

    DOEpatents

    Creighton, J. Randall; Dominguez, Frank; Johnson, A. Wayne; Omstead, Thomas R.

    1997-01-01

    A method is described for fabricating integrated semiconductor circuits and, more particularly, for the selective deposition of a conductor onto a substrate employing a chemical vapor deposition process. By way of example, tungsten can be selectively deposited onto a silicon substrate. At the onset of loss of selectivity of deposition of tungsten onto the silicon substrate, the deposition process is interrupted and unwanted tungsten which has deposited on a mask layer with the silicon substrate can be removed employing a halogen etchant. Thereafter, a plurality of deposition/etch back cycles can be carried out to achieve a predetermined thickness of tungsten.

  16. Method for deposition of a conductor in integrated circuits

    DOEpatents

    Creighton, J.R.; Dominguez, F.; Johnson, A.W.; Omstead, T.R.

    1997-09-02

    A method is described for fabricating integrated semiconductor circuits and, more particularly, for the selective deposition of a conductor onto a substrate employing a chemical vapor deposition process. By way of example, tungsten can be selectively deposited onto a silicon substrate. At the onset of loss of selectivity of deposition of tungsten onto the silicon substrate, the deposition process is interrupted and unwanted tungsten which has deposited on a mask layer with the silicon substrate can be removed employing a halogen etchant. Thereafter, a plurality of deposition/etch back cycles can be carried out to achieve a predetermined thickness of tungsten. 2 figs.

  17. State-transfer simulation in integrated waveguide circuits

    NASA Astrophysics Data System (ADS)

    Latmiral, L.; Di Franco, C.; Mennea, P. L.; Kim, M. S.

    2015-08-01

    Spin-chain models have been widely studied in terms of quantum information processes, for instance for the faithful transmission of quantum states. Here, we investigate the limitations of mapping this process to an equivalent one through a bosonic chain. In particular, we keep in mind experimental implementations, which the progress in integrated waveguide circuits could make possible in the very near future. We consider the feasibility of exploiting the higher dimensionality of the Hilbert space of the chain elements for the transmission of a larger amount of information, and the effects of unwanted excitations during the process. Finally, we exploit the information-flux method to provide bounds to the transfer fidelity.

  18. SiGe/Si Monolithically Integrated Amplifier Circuits

    NASA Technical Reports Server (NTRS)

    Katehi, Linda P. B.; Bhattacharya, Pallab

    1998-01-01

    With recent advance in the epitaxial growth of silicon-germanium heterojunction, Si/SiGe HBTs with high f(sub max) and f(sub T) have received great attention in MMIC applications. In the past year, technologies for mesa-type Si/SiGe HBTs and other lumped passive components with high resonant frequencies have been developed and well characterized for circuit applications. By integrating the micromachined lumped passive elements into HBT fabrication, multi-stage amplifiers operating at 20 GHz have been designed and fabricated.

  19. Stainless Steel NaK Circuit Integration and Fill Submission

    NASA Technical Reports Server (NTRS)

    Garber, Anne E.

    2006-01-01

    The Early Flight Fission Test Facilities (EFF-TF) team has been tasked by the Marshall Space Flight Center Nuclear Systems Office to design, fabricate, and test an actively pumped alkali metal flow circuit. The system, which was originally designed to hold a eutectic mixture of sodium potassium (NaK), was redesigned to hold lithium; but due to a shift in focus, it is once again being prepared for use with NaK. Changes made to the actively pumped, high temperature loop include the replacement of the expansion reservoir, addition of remotely operated valves, and modification of the support table. Basic circuit components include: reactor segment, NaK to gas heat exchanger, electromagnetic (EM) liquid metal pump, load/drain reservoir, expansion reservoir, instrumentation, and a spill reservoir. A 37-pin partial-array core (pin and flow path dimensions are the same as those in a full design) was selected for fabrication and test. This document summarizes the integration and fill of the pumped liquid metal NaK flow circuit.

  20. Chemistry integrated circuit: chemical system on a complementary metal oxide semiconductor integrated circuit.

    PubMed

    Nakazato, Kazuo

    2014-03-28

    By integrating chemical reactions on a large-scale integration (LSI) chip, new types of device can be created. For biomedical applications, monolithically integrated sensor arrays for potentiometric, amperometric and impedimetric sensing of biomolecules have been developed. The potentiometric sensor array detects pH and redox reaction as a statistical distribution of fluctuations in time and space. For the amperometric sensor array, a microelectrode structure for measuring multiple currents at high speed has been proposed. The impedimetric sensor array is designed to measure impedance up to 10 MHz. The multimodal sensor array will enable synthetic analysis and make it possible to standardize biosensor chips. Another approach is to create new functional devices by integrating molecular systems with LSI chips, for example image sensors that incorporate biological materials with a sensor array. The quantum yield of the photoelectric conversion of photosynthesis is 100%, which is extremely difficult to achieve by artificial means. In a recently developed process, a molecular wire is plugged directly into a biological photosynthetic system to efficiently conduct electrons to a gold electrode. A single photon can be detected at room temperature using such a system combined with a molecular single-electron transistor.