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Sample records for 3d integrated circuits

  1. 3D packaging for integrated circuit systems

    SciTech Connect

    Chu, D.; Palmer, D.W.

    1996-11-01

    A goal was set for high density, high performance microelectronics pursued through a dense 3D packing of integrated circuits. A {open_quotes}tool set{close_quotes} of assembly processes have been developed that enable 3D system designs: 3D thermal analysis, silicon electrical through vias, IC thinning, mounting wells in silicon, adhesives for silicon stacking, pretesting of IC chips before commitment to stacks, and bond pad bumping. Validation of these process developments occurred through both Sandia prototypes and subsequent commercial examples.

  2. Development of 3D integrated circuits for HEP

    SciTech Connect

    Yarema, R.; /Fermilab

    2006-09-01

    Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing effective circuit density. Recent advances in industry have made 3D integrated circuits an option for HEP. The 3D technology is discussed in this paper and several examples are shown. Design of a 3D demonstrator chip for the ILC is presented.

  3. 3D circuit integration for Vertex and other detectors

    SciTech Connect

    Yarema, Ray; /Fermilab

    2007-09-01

    High Energy Physics continues to push the technical boundaries for electronics. There is no area where this is truer than for vertex detectors. Lower mass and power along with higher resolution and radiation tolerance are driving forces. New technologies such as SOI CMOS detectors and three dimensional (3D) integrated circuits offer new opportunities to meet these challenges. The fundamentals for SOI CMOS detectors and 3D integrated circuits are discussed. Examples of each approach for physics applications are presented. Cost issues and ways to reduce development costs are discussed.

  4. 2D and 3D heterogeneous photonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Yoo, S. J. Ben

    2014-03-01

    Exponential increases in the amount of data that need to be sensed, communicated, and processed are continuing to drive the complexity of our computing, networking, and sensing systems. High degrees of integration is essential in scalable, practical, and cost-effective microsystems. In electronics, high-density 2D integration has naturally evolved towards 3D integration by stacking of memory and processor chips with through-silicon-vias. In photonics, too, we anticipate highdegrees of 3D integration of photonic components to become a prevailing method in realizing future microsystems for information and communication technologies. However, compared to electronics, photonic 3D integration face a number of challenges. This paper will review two methods of 3D photonic integration --- fs laser inscription and layer stacking, and discuss applications and future prospects.

  5. Design and implementation of Gm-APD array readout integrated circuit for infrared 3D imaging

    NASA Astrophysics Data System (ADS)

    Zheng, Li-xia; Yang, Jun-hao; Liu, Zhao; Dong, Huai-peng; Wu, Jin; Sun, Wei-feng

    2013-09-01

    A single-photon detecting array of readout integrated circuit (ROIC) capable of infrared 3D imaging by photon detection and time-of-flight measurement is presented in this paper. The InGaAs avalanche photon diodes (APD) dynamic biased under Geiger operation mode by gate controlled active quenching circuit (AQC) are used here. The time-of-flight is accurately measured by a high accurate time-to-digital converter (TDC) integrated in the ROIC. For 3D imaging, frame rate controlling technique is utilized to the pixel's detection, so that the APD related to each pixel should be controlled by individual AQC to sense and quench the avalanche current, providing a digital CMOS-compatible voltage pulse. After each first sense, the detector is reset to wait for next frame operation. We employ counters of a two-segmental coarse-fine architecture, where the coarse conversion is achieved by a 10-bit pseudo-random linear feedback shift register (LFSR) in each pixel and a 3-bit fine conversion is realized by a ring delay line shared by all pixels. The reference clock driving the LFSR counter can be generated within the ring delay line Oscillator or provided by an external clock source. The circuit is designed and implemented by CSMC 0.5μm standard CMOS technology and the total chip area is around 2mm×2mm for 8×8 format ROIC with 150μm pixel pitch. The simulation results indicate that the relative time resolution of the proposed ROIC can achieve less than 1ns, and the preliminary test results show that the circuit function is correct.

  6. Conception d'un circuit d'etouffement pour photodiodes a avalanche en mode geiger pour integration heterogene 3d

    NASA Astrophysics Data System (ADS)

    Boisvert, Alexandre

    Le Groupe de Recherche en Appareillage Medical de Sherbrooke (GRAMS) travaille actuellement sur un programme de recherche portant sur des photodiodes a avalanche mono-photoniques (PAMP) operees en mode Geiger en vue d'une application a la tomographie d'emission par positrons (TEP). Pour operer dans ce mode; la PAMP, ou SPAD selon l'acronyme anglais (Single Photon Avalanche Diode), requiert un circuit d'etouffement (CE) pour, d'une part, arreter l'avalanche pouvant causer sa destruction et, d'autre part. la reinitialiser en mode d'attente d'un nouveau photon. Le role de ce CE comprend egalement une electronique de communication vers les etages de traitement avance de signaux. La performance temporelle optimale du CE est realisee lorsqu'il est juxtapose a la PAMP. Cependant, cela entraine une reduction de la surface photosensible ; un element crucial en imagerie. L'integration 3D, a base d'interconnexions verticales, offre une solution elegante et performante a cette problematique par l'empilement de circuits integres possedant differentes fonctions (PAMP, CE et traitement avance de signaux). Dans l'approche proposee, des circuits d'etouffement de 50 pm x 50 pm realises sur une technologie CMOS 130 mn 3D Tezzaron, contenant chacun 112 transistors, sont matrices afin de correspondre a une matrice de PAMP localisee sur une couche electronique superieure. Chaque circuit d'etouffement possede une gigue temporelle de 7,47 ps RMS selon des simulations faites avec le logiciel Cadence. Le CE a la flexibilite d'ajuster les temps d'etouffement et de recharge pour la PAMP tout en presentant une faible consommation de puissance (~ 0,33 mW a 33 Mcps). La conception du PAMP necessite de supporter des tensions superieures aux 3,3 V de la technologie. Pour repondre a ce probleme, des transistors a drain etendu (DEMOS) ont ete realises. En raison de retards de production par Ies fabricants, les circuits n'ont pu etre testes physiquement par des mesures. Les resultats de ce memoire

  7. Mechanical integrity of a carbon nanotube/copper-based through-silicon via for 3D integrated circuits: a multi-scale modeling approach.

    PubMed

    Awad, Ibrahim; Ladani, Leila

    2015-12-01

    Carbon nanotube (CNT)/copper (Cu) composite material is proposed to replace Cu-based through-silicon vias (TSVs) in micro-electronic packages. The proposed material is believed to offer extraordinary mechanical and electrical properties and the presence of CNTs in Cu is believed to overcome issues associated with miniaturization of Cu interconnects, such as electromigration. This study introduces a multi-scale modeling of the proposed TSV in order to evaluate its mechanical integrity under mechanical and thermo-mechanical loading conditions. Molecular dynamics (MD) simulation was used to determine CNT/Cu interface adhesion properties. A cohesive zone model (CZM) was found to be most appropriate to model the interface adhesion, and CZM parameters at the nanoscale were determined using MD simulation. CZM parameters were then used in the finite element analysis in order to understand the mechanical and thermo-mechanical behavior of composite TSV at micro-scale. From the results, CNT/Cu separation does not take place prior to plastic deformation of Cu in bending, and separation does not take place when standard thermal cycling is applied. Further investigation is recommended in order to alleviate the increased plastic deformation in Cu at the CNT/Cu interface in both loading conditions. PMID:26559788

  8. Mechanical integrity of a carbon nanotube/copper-based through-silicon via for 3D integrated circuits: a multi-scale modeling approach

    NASA Astrophysics Data System (ADS)

    Awad, Ibrahim; Ladani, Leila

    2015-12-01

    Carbon nanotube (CNT)/copper (Cu) composite material is proposed to replace Cu-based through-silicon vias (TSVs) in micro-electronic packages. The proposed material is believed to offer extraordinary mechanical and electrical properties and the presence of CNTs in Cu is believed to overcome issues associated with miniaturization of Cu interconnects, such as electromigration. This study introduces a multi-scale modeling of the proposed TSV in order to evaluate its mechanical integrity under mechanical and thermo-mechanical loading conditions. Molecular dynamics (MD) simulation was used to determine CNT/Cu interface adhesion properties. A cohesive zone model (CZM) was found to be most appropriate to model the interface adhesion, and CZM parameters at the nanoscale were determined using MD simulation. CZM parameters were then used in the finite element analysis in order to understand the mechanical and thermo-mechanical behavior of composite TSV at micro-scale. From the results, CNT/Cu separation does not take place prior to plastic deformation of Cu in bending, and separation does not take place when standard thermal cycling is applied. Further investigation is recommended in order to alleviate the increased plastic deformation in Cu at the CNT/Cu interface in both loading conditions.

  9. Engineering-Aligned 3D Neural Circuit in Microfluidic Device.

    PubMed

    Bang, Seokyoung; Na, Sangcheol; Jang, Jae Myung; Kim, Jinhyun; Jeon, Noo Li

    2016-01-01

    The brain is one of the most important and complex organs in the human body. Although various neural network models have been proposed for in vitro 3D neuronal networks, it has been difficult to mimic functional and structural complexity of the in vitro neural circuit. Here, a microfluidic model of a simplified 3D neural circuit is reported. First, the microfluidic device is filled with Matrigel and continuous flow is delivered across the device during gelation. The fluidic flow aligns the extracellular matrix (ECM) components along the flow direction. Following the alignment of ECM fibers, neurites of primary rat cortical neurons are grown into the Matrigel at the average speed of 250 μm d(-1) and form axon bundles approximately 1500 μm in length at 6 days in vitro (DIV). Additionally, neural networks are developed from presynaptic to postsynaptic neurons at 14 DIV. The establishment of aligned 3D neural circuits is confirmed with the immunostaining of PSD-95 and synaptophysin and the observation of calcium signal transmission. PMID:26332914

  10. Integral 3D display using multiple LCDs

    NASA Astrophysics Data System (ADS)

    Okaichi, Naoto; Miura, Masato; Arai, Jun; Mishina, Tomoyuki

    2015-03-01

    The quality of the integral 3D images created by a 3D imaging system was improved by combining multiple LCDs to utilize a greater number of pixels than that possible with one LCD. A prototype of the display device was constructed by using four HD LCDs. An integral photography (IP) image displayed by the prototype is four times larger than that reconstructed by a single display. The pixel pitch of the HD display used is 55.5 μm, and the number of elemental lenses is 212 horizontally and 119 vertically. The 3D image pixel count is 25,228, and the viewing angle is 28°. Since this method is extensible, it is possible to display an integral 3D image of higher quality by increasing the number of LCDs. Using this integral 3D display structure makes it possible to make the whole device thinner than a projector-based display system. It is therefore expected to be applied to the home television in the future.

  11. Vertically Integrated Circuits at Fermilab

    SciTech Connect

    Deptuch, Grzegorz; Demarteau, Marcel; Hoff, James; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom; /Fermilab

    2009-01-01

    The exploration of the vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. The consortium has submitted over 25 different designs for the Fermilab organized MPW run organized for the first time.

  12. 3D Integration for Wireless Multimedia

    NASA Astrophysics Data System (ADS)

    Kimmich, Georg

    The convergence of mobile phone, internet, mapping, gaming and office automation tools with high quality video and still imaging capture capability is becoming a strong market trend for portable devices. High-density video encode and decode, 3D graphics for gaming, increased application-software complexity and ultra-high-bandwidth 4G modem technologies are driving the CPU performance and memory bandwidth requirements close to the PC segment. These portable multimedia devices are battery operated, which requires the deployment of new low-power-optimized silicon process technologies and ultra-low-power design techniques at system, architecture and device level. Mobile devices also need to comply with stringent silicon-area and package-volume constraints. As for all consumer devices, low production cost and fast time-to-volume production is key for success. This chapter shows how 3D architectures can bring a possible breakthrough to meet the conflicting power, performance and area constraints. Multiple 3D die-stacking partitioning strategies are described and analyzed on their potential to improve the overall system power, performance and cost for specific application scenarios. Requirements and maturity of the basic process-technology bricks including through-silicon via (TSV) and die-to-die attachment techniques are reviewed. Finally, we highlight new challenges which will arise with 3D stacking and an outlook on how they may be addressed: Higher power density will require thermal design considerations, new EDA tools will need to be developed to cope with the integration of heterogeneous technologies and to guarantee signal and power integrity across the die stack. The silicon/wafer test strategies have to be adapted to handle high-density IO arrays, ultra-thin wafers and provide built-in self-test of attached memories. New standards and business models have to be developed to allow cost-efficient assembly and testing of devices from different silicon and technology

  13. Linear integrated circuits

    NASA Astrophysics Data System (ADS)

    Young, T.

    This book is intended to be used as a textbook in a one-semester course at a variety of levels. Because of self-study features incorporated, it may also be used by practicing electronic engineers as a formal and thorough introduction to the subject. The distinction between linear and digital integrated circuits is discussed, taking into account digital and linear signal characteristics, linear and digital integrated circuit characteristics, the definitions for linear and digital circuits, applications of digital and linear integrated circuits, aspects of fabrication, packaging, and classification and numbering. Operational amplifiers are considered along with linear integrated circuit (LIC) power requirements and power supplies, voltage and current regulators, linear amplifiers, linear integrated circuit oscillators, wave-shaping circuits, active filters, DA and AD converters, demodulators, comparators, instrument amplifiers, current difference amplifiers, analog circuits and devices, and aspects of troubleshooting.

  14. High resolution 3D nonlinear integrated inversion

    NASA Astrophysics Data System (ADS)

    Li, Yong; Wang, Xuben; Li, Zhirong; Li, Qiong; Li, Zhengwen

    2009-06-01

    The high resolution 3D nonlinear integrated inversion method is based on nonlinear theory. Under layer control, the log data from several wells (or all wells) in the study area and seismic trace data adjacent to the wells are input to a network with multiple inputs and outputs and are integratedly trained to obtain an adaptive weight function of the entire study area. Integrated nonlinear mapping relationships are built and updated by the lateral and vertical geologic variations of the reservoirs. Therefore, the inversion process and its inversion results can be constrained and controlled and a stable seismic inversion section with high resolution with velocity inversion, impedance inversion, and density inversion sections, can be gained. Good geologic effects have been obtained in model computation tests and real data processing, which verified that this method has high precision, good practicality, and can be used for quantitative reservoir analysis.

  15. 3D Integration for Superconducting Qubits

    NASA Astrophysics Data System (ADS)

    Rosenberg, Danna; Yost, Donna-Ruth; Das, Rabindra; Hover, David; Racz, Livia; Weber, Steven; Yoder, Jonilyn; Kerman, Andrew; Oliver, William

    As the field of superconducting quantum computing advances from the few-qubit stage to large-scale fault-tolerant devices, scalability requirements will necessitate the use of standard 3D packaging and integration processes. While the field of 3D integration is well-developed, relatively little work has been performed to determine the compatibility of the associated processes with superconducting qubits. Qubit coherence time could potentially be affected by required process steps or by the proximity of an interposer that could introduce extra sources of charge or flux noise. As a first step towards a large-scale quantum information processor, we have used a flip-chip process to bond a chip with flux qubits to an interposer containing structures for qubit readout and control. We will present data on the effect of the presence of the interposer on qubit coherence time for various qubit-chip-interposer spacings and discuss the implications for integrated multi-qubit devices. This research was funded by the ODNI and IARPA under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as representing the official policies or endorsements, either expressed or implied, of ODNI, IARPA, or the US Government.

  16. High-performance, mechanically flexible, and vertically integrated 3D carbon nanotube and InGaZnO complementary circuits with a temperature sensor.

    PubMed

    Honda, Wataru; Harada, Shingo; Ishida, Shohei; Arie, Takayuki; Akita, Seiji; Takei, Kuniharu

    2015-08-26

    A vertically integrated inorganic-based flexible complementary metal-oxide-semiconductor (CMOS) inverter with a temperature sensor with a high inverter gain of ≈50 and a low power consumption of <7 nW mm(-1) is demonstrated using a layer-by-layer assembly process. In addition, the negligible influence of the mechanical flexibility on the performance of the CMOS inverter and the temperature dependence of the CMOS inverter characteristics are discussed. PMID:26177598

  17. Lightning Modelling: From 3D to Circuit Approach

    NASA Astrophysics Data System (ADS)

    Moussa, H.; Abdi, M.; Issac, F.; Prost, D.

    2012-05-01

    The topic of this study is electromagnetic environment and electromagnetic interferences (EMI) effects, specifically the modelling of lightning indirect effects [1] on aircraft electrical systems present on deported and highly exposed equipments, such as nose landing gear (NLG) and nacelle, through a circuit approach. The main goal of the presented work, funded by a French national project: PREFACE, is to propose a simple equivalent electrical circuit to represent a geometrical structure, taking into account mutual, self inductances, and resistances, which play a fundamental role in the lightning current distribution. Then this model is intended to be coupled to a functional one, describing a power train chain composed of: a converter, a shielded power harness and a motor or a set of resistors used as a load for the converter. The novelty here, is to provide a pre-sizing qualitative approach allowing playing on integration in pre-design phases. This tool intends to offer a user-friendly way for replying rapidly to calls for tender, taking into account the lightning constraints. Two cases are analysed: first, a NLG that is composed of tubular pieces that can be easily approximated by equivalent cylindrical straight conductors. Therefore, passive R, L, M elements of the structure can be extracted through analytical engineer formulas such as those implemented in the partial element equivalent circuit (PEEC) [2] technique. Second, the same approach is intended to be applied on an electrical de-icing nacelle sub-system.

  18. Biomaterials for integration with 3-D bioprinting.

    PubMed

    Skardal, Aleksander; Atala, Anthony

    2015-03-01

    Bioprinting has emerged in recent years as an attractive method for creating 3-D tissues and organs in the laboratory, and therefore is a promising technology in a number of regenerative medicine applications. It has the potential to (i) create fully functional replacements for damaged tissues in patients, and (ii) rapidly fabricate small-sized human-based tissue models, or organoids, for diagnostics, pathology modeling, and drug development. A number of bioprinting modalities have been explored, including cellular inkjet printing, extrusion-based technologies, soft lithography, and laser-induced forward transfer. Despite the innovation of each of these technologies, successful implementation of bioprinting relies heavily on integration with compatible biomaterials that are responsible for supporting the cellular components during and after biofabrication, and that are compatible with the bioprinting device requirements. In this review, we will evaluate a variety of biomaterials, such as curable synthetic polymers, synthetic gels, and naturally derived hydrogels. Specifically we will describe how they are integrated with the bioprinting technologies above to generate bioprinted constructs with practical application in medicine. PMID:25476164

  19. 3D integration of sub-surface photonics with CMOS

    NASA Astrophysics Data System (ADS)

    Jalali, Bahram; Indukuri, Tejaswi; Koonath, Prakash

    2006-02-01

    The integration of photonics and electronics on a single silicon substrate requires technologies that can add optical functionalities without significantly sacrificing valuable wafer area. To this end, we have developed an innovative fabrication process, called SIMOX 3-D Sculpting, that enables monolithic optoelectronic integration in a manner that does not compromise the economics of CMOS manufacturing. In this technique, photonic devices are realized in subsurface silicon layers that are separated from the surface silicon layer by an intervening SiO II layer. The surface silicon layer may then be utilized for electronic circuitry. SIMOX 3-D sculpting involves (1) the implantation of oxygen ions into a patterned silicon substrate followed by (2) high temperature anneal to create buried waveguide-based photonic devices. This process has produced subterranean microresonators with unloaded quality factors of 8000 and extinction ratios >20dB. On the surface silicon layers, MOS transistor structures have been fabricated. The small cross-sectional area of the waveguides lends itself to the realization of nonlinear optical devices. We have previously demonstrated spectral broadening and continuum generation in silicon waveguides utilizing Kerr optical nonlinearity. This may be combined with microresonator filters for on-chip supercontiuum generation and spectral carving. The monolithic integration of CMOS circuits and optical modulators with such multi-wavelength sources represent an exciting avenue for silicon photonics.

  20. Integrated Biogeomorphological Modeling Using Delft3D

    NASA Astrophysics Data System (ADS)

    Ye, Q.; Jagers, B.

    2011-12-01

    The skill of numerical morphological models has improved significantly from the early 2D uniform, total load sediment models (with steady state or infrequent wave updates) to recent 3D hydrodynamic models with multiple suspended and bed load sediment fractions and bed stratigraphy (online coupled with waves). Although there remain many open questions within this combined field of hydro- and morphodynamics, we observe an increasing need to include biological processes in the overall dynamics. In riverine and inter-tidal environments, there is often an important influence by riparian vegetation and macrobenthos. Over the past decade more and more researchers have started to extend the simulation environment with wrapper scripts and other quick code hacks to estimate their influence on morphological development in coastal, estuarine and riverine environments. Although one can in this way quickly analyze different approaches, these research tools have generally not been designed with reuse, performance and portability in mind. We have now implemented a reusable, flexible, and efficient two-way link between the Delft3D open source framework for hydrodynamics, waves and morphology, and the water quality and ecology modules. The same link will be used for 1D, 2D and 3D modeling on networks and both structured and unstructured grids. We will describe the concepts of the overall system, and illustrate it with some first results.

  1. Photonic Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Merritt, Scott; Krainak, Michael

    2016-01-01

    Integrated photonics generally is the integration of multiple lithographically defined photonic and electronic components and devices (e.g. lasers, detectors, waveguides passive structures, modulators, electronic control and optical interconnects) on a single platform with nanometer-scale feature sizes. The development of photonic integrated circuits permits size, weight, power and cost reductions for spacecraft microprocessors, optical communication, processor buses, advanced data processing, and integrated optic science instrument optical systems, subsystems and components. This is particularly critical for small spacecraft platforms. We will give an overview of some NASA applications for integrated photonics.

  2. Bioluminescent bioreporter integrated circuit

    DOEpatents

    Simpson, Michael L.; Sayler, Gary S.; Paulus, Michael J.

    2000-01-01

    Disclosed are monolithic bioelectronic devices comprising a bioreporter and an OASIC. These bioluminescent bioreporter integrated circuit are useful in detecting substances such as pollutants, explosives, and heavy-metals residing in inhospitable areas such as groundwater, industrial process vessels, and battlefields. Also disclosed are methods and apparatus for environmental pollutant detection, oil exploration, drug discovery, industrial process control, and hazardous chemical monitoring.

  3. Integrated circuit reliability testing

    NASA Technical Reports Server (NTRS)

    Buehler, Martin G. (Inventor); Sayah, Hoshyar R. (Inventor)

    1990-01-01

    A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit.

  4. Integrated circuit reliability testing

    NASA Technical Reports Server (NTRS)

    Buehler, Martin G. (Inventor); Sayah, Hoshyar R. (Inventor)

    1988-01-01

    A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit.

  5. Three wafer stacking for 3D integration.

    SciTech Connect

    Greth, K. Douglas; Ford, Christine L.; Lantz, Jeffrey W.; Shinde, Subhash L.; Timon, Robert P.; Bauer, Todd M.; Hetherington, Dale Laird; Sanchez, Carlos Anthony

    2011-11-01

    Vertical wafer stacking will enable a wide variety of new system architectures by enabling the integration of dissimilar technologies in one small form factor package. With this LDRD, we explored the combination of processes and integration techniques required to achieve stacking of three or more layers. The specific topics that we investigated include design and layout of a reticle set for use as a process development vehicle, through silicon via formation, bonding media, wafer thinning, dielectric deposition for via isolation on the wafer backside, and pad formation.

  6. Biophotonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Cohen, Daniel A.; Nolde, Jill A.; Wang, Chad S.; Skogen, Erik J.; Rivlin, A.; Coldren, Larry A.

    2004-12-01

    Biosensors rely on optical techniques to obtain high sensitivity and speed, but almost all biochips still require external light sources, optics, and detectors, which limits the widespread use of these devices. The optoelectronics technology base now allows monolithic integration of versatile optical sources, novel sensing geometries, filters, spectrometers, and detectors, enabling highly integrated chip-scale sensors. We discuss biophotonic integrated circuits built on both GaAs and InP substrates, incorporating widely tunable lasers, novel evanescent field sensing waveguides, heterodyne spectrometers, and waveguide photodetectors, suitable for high sensitivity transduction of affinity assays.

  7. 3D integrated hybrid silicon laser.

    PubMed

    Song, Bowen; Stagarescu, Cristian; Ristic, Sasa; Behfar, Alex; Klamkin, Jonathan

    2016-05-16

    Lasers were realized on silicon by flip-chip bonding of indium phosphide (InP) devices containing total internal reflection turning mirrors for surface emission. Light is coupled to the silicon waveguides through surface grating couplers. With this technique, InP lasers were integrated on silicon. Laser cavities were also formed by coupling InP reflective semiconductor optical amplifiers to microring resonator filters and distributed Bragg reflector mirrors. Single-mode continuous wave lasing was demonstrated with a side mode suppression ratio of 30 dB. Up to 2 mW of optical power was coupled to the silicon waveguide. Thermal simulations were also performed to evaluate the low thermal impedance afforded by this architecture and potential for high wall-plug efficiency. PMID:27409867

  8. Wafer-Level 3D Integration for ULSI Interconnects

    NASA Astrophysics Data System (ADS)

    Gutmann, Ronald J.; Lu, Jian-Qiang

    Three-dimensional (3D) integration in a system-in-a-package (SiP) implementation (packaging-based 3D) is becoming increasingly used in consumer, computer, and communication applications where form factor is critical. In particular, the hand-held market for a growing myriad of voice, data, messaging, and imaging products is enabled by packaging-based 3D integration (i.e., stacking and connecting individual chips). The key drivers are for increased memory capacity and for heterogeneous integration of different IC technologies and functions.

  9. Monolithic Optoelectronic Integrated Circuit

    NASA Technical Reports Server (NTRS)

    Bhasin, Kul B.; Walters, Wayne; Gustafsen, Jerry; Bendett, Mark

    1990-01-01

    Monolithic optoelectronic integrated circuit (OEIC) receives single digitally modulated input light signal via optical fiber and converts it into 16-channel electrical output signal. Potentially useful in any system in which digital data must be transmitted serially at high rates, then decoded into and used in parallel format at destination. Applications include transmission and decoding of control signals to phase shifters in phased-array antennas and also communication of data between computers and peripheral equipment in local-area networks.

  10. Integrated Circuit Immunity

    NASA Technical Reports Server (NTRS)

    Sketoe, J. G.; Clark, Anthony

    2000-01-01

    This paper presents a DOD E3 program overview on integrated circuit immunity. The topics include: 1) EMI Immunity Testing; 2) Threshold Definition; 3) Bias Tee Function; 4) Bias Tee Calibration Set-Up; 5) EDM Test Figure; 6) EMI Immunity Levels; 7) NAND vs. and Gate Immunity; 8) TTL vs. LS Immunity Levels; 9) TP vs. OC Immunity Levels; 10) 7805 Volt Reg Immunity; and 11) Seventies Chip Set. This paper is presented in viewgraph form.

  11. 3D plasmonic nanoantennas integrated with MEA biosensors

    NASA Astrophysics Data System (ADS)

    Dipalo, Michele; Messina, Gabriele C.; Amin, Hayder; La Rocca, Rosanna; Shalabaeva, Victoria; Simi, Alessandro; Maccione, Alessandro; Zilio, Pierfrancesco; Berdondini, Luca; de Angelis, Francesco

    2015-02-01

    Neuronal signaling in brain circuits occurs at multiple scales ranging from molecules and cells to large neuronal assemblies. However, current sensing neurotechnologies are not designed for parallel access of signals at multiple scales. With the aim of combining nanoscale molecular sensing with electrical neural activity recordings within large neuronal assemblies, in this work three-dimensional (3D) plasmonic nanoantennas are integrated with multielectrode arrays (MEA). Nanoantennas are fabricated by fast ion beam milling on optical resist; gold is deposited on the nanoantennas in order to connect them electrically to the MEA microelectrodes and to obtain plasmonic behavior. The optical properties of these 3D nanostructures are studied through finite elements method (FEM) simulations that show a high electromagnetic field enhancement. This plasmonic enhancement is confirmed by surface enhancement Raman spectroscopy of a dye performed in liquid, which presents an enhancement of almost 100 times the incident field amplitude at resonant excitation. Finally, the reported MEA devices are tested on cultured rat hippocampal neurons. Neurons develop by extending branches on the nanostructured electrodes and extracellular action potentials are recorded over multiple days in vitro. Raman spectra of living neurons cultured on the nanoantennas are also acquired. These results highlight that these nanostructures could be potential candidates for combining electrophysiological measures of large networks with simultaneous spectroscopic investigations at the molecular level.Neuronal signaling in brain circuits occurs at multiple scales ranging from molecules and cells to large neuronal assemblies. However, current sensing neurotechnologies are not designed for parallel access of signals at multiple scales. With the aim of combining nanoscale molecular sensing with electrical neural activity recordings within large neuronal assemblies, in this work three-dimensional (3D) plasmonic

  12. ELECTRONIC INTEGRATING CIRCUIT

    DOEpatents

    Englemann, R.H.

    1963-08-20

    An electronic integrating circuit using a transistor with a capacitor connected between the emitter and collector through which the capacitor discharges at a rate proportional to the input current at the base is described. Means are provided for biasing the base with an operating bias and for applying a voltage pulse to the capacitor for charging to an initial voltage. A current dividing diode is connected between the base and emitter of the transistor, and signal input terminal means are coupled to the juncture of the capacitor and emitter and to the base of the transistor. At the end of the integration period, the residual voltage on said capacitor is less by an amount proportional to the integral of the input signal. Either continuous or intermittent periods of integration are provided. (AEC)

  13. 3D augmented reality with integral imaging display

    NASA Astrophysics Data System (ADS)

    Shen, Xin; Hua, Hong; Javidi, Bahram

    2016-06-01

    In this paper, a three-dimensional (3D) integral imaging display for augmented reality is presented. By implementing the pseudoscopic-to-orthoscopic conversion method, elemental image arrays with different capturing parameters can be transferred into the identical format for 3D display. With the proposed merging algorithm, a new set of elemental images for augmented reality display is generated. The newly generated elemental images contain both the virtual objects and real world scene with desired depth information and transparency parameters. The experimental results indicate the feasibility of the proposed 3D augmented reality with integral imaging.

  14. Polarimetric 3D integral imaging in photon-starved conditions.

    PubMed

    Carnicer, Artur; Javidi, Bahram

    2015-03-01

    We develop a method for obtaining 3D polarimetric integral images from elemental images recorded in low light illumination conditions. Since photon-counting images are very sparse, calculation of the Stokes parameters and the degree of polarization should be handled carefully. In our approach, polarimetric 3D integral images are generated using the Maximum Likelihood Estimation and subsequently reconstructed by means of a Total Variation Denoising filter. In this way, polarimetric results are comparable to those obtained in conventional illumination conditions. We also show that polarimetric information retrieved from photon starved images can be used in 3D object recognition problems. To the best of our knowledge, this is the first report on 3D polarimetric photon counting integral imaging. PMID:25836861

  15. Integrated circuit cell library

    NASA Technical Reports Server (NTRS)

    Whitaker, Sterling R. (Inventor); Miles, Lowell H. (Inventor)

    2005-01-01

    According to the invention, an ASIC cell library for use in creation of custom integrated circuits is disclosed. The ASIC cell library includes some first cells and some second cells. Each of the second cells includes two or more kernel cells. The ASIC cell library is at least 5% comprised of second cells. In various embodiments, the ASIC cell library could be 10% or more, 20% or more, 30% or more, 40% or more, 50% or more, 60% or more, 70% or more, 80% or more, 90% or more, or 95% or more comprised of second cells.

  16. Distributed 3D Information Visualization - Towards Integration of the Dynamic 3D Graphics and Web Services

    NASA Astrophysics Data System (ADS)

    Vucinic, Dean; Deen, Danny; Oanta, Emil; Batarilo, Zvonimir; Lacor, Chris

    This paper focuses on visualization and manipulation of graphical content in distributed network environments. The developed graphical middleware and 3D desktop prototypes were specialized for situational awareness. This research was done in the LArge Scale COllaborative decision support Technology (LASCOT) project, which explored and combined software technologies to support human-centred decision support system for crisis management (earthquake, tsunami, flooding, airplane or oil-tanker incidents, chemical, radio-active or other pollutants spreading, etc.). The performed state-of-the-art review did not identify any publicly available large scale distributed application of this kind. Existing proprietary solutions rely on the conventional technologies and 2D representations. Our challenge was to apply the "latest" available technologies, such Java3D, X3D and SOAP, compatible with average computer graphics hardware. The selected technologies are integrated and we demonstrate: the flow of data, which originates from heterogeneous data sources; interoperability across different operating systems and 3D visual representations to enhance the end-users interactions.

  17. Compression of 3D integral images using wavelet decomposition

    NASA Astrophysics Data System (ADS)

    Mazri, Meriem; Aggoun, Amar

    2003-06-01

    This paper presents a wavelet-based lossy compression technique for unidirectional 3D integral images (UII). The method requires the extraction of different viewpoint images from the integral image. A single viewpoint image is constructed by extracting one pixel from each microlens, then each viewpoint image is decomposed using a Two Dimensional Discrete Wavelet Transform (2D-DWT). The resulting array of coefficients contains several frequency bands. The lower frequency bands of the viewpoint images are assembled and compressed using a 3 Dimensional Discrete Cosine Transform (3D-DCT) followed by Huffman coding. This will achieve decorrelation within and between 2D low frequency bands from the different viewpoint images. The remaining higher frequency bands are Arithmetic coded. After decoding and decompression of the viewpoint images using an inverse 3D-DCT and an inverse 2D-DWT, each pixel from every reconstructed viewpoint image is put back into its original position within the microlens to reconstruct the whole 3D integral image. Simulations were performed on a set of four different grey level 3D UII using a uniform scalar quantizer with deadzone. The results for the average of the four UII intensity distributions are presented and compared with previous use of 3D-DCT scheme. It was found that the algorithm achieves better rate-distortion performance, with respect to compression ratio and image quality at very low bit rates.

  18. Accommodation response measurements for integral 3D image

    NASA Astrophysics Data System (ADS)

    Hiura, H.; Mishina, T.; Arai, J.; Iwadate, Y.

    2014-03-01

    We measured accommodation responses under integral photography (IP), binocular stereoscopic, and real object display conditions, and viewing conditions of binocular and monocular viewing conditions. The equipment we used was an optometric device and a 3D display. We developed the 3D display for IP and binocular stereoscopic images that comprises a high-resolution liquid crystal display (LCD) and a high-density lens array. The LCD has a resolution of 468 dpi and a diagonal size of 4.8 inches. The high-density lens array comprises 106 x 69 micro lenses that have a focal length of 3 mm and diameter of 1 mm. The lenses are arranged in a honeycomb pattern. The 3D display was positioned 60 cm from an observer under IP and binocular stereoscopic display conditions. The target was presented at eight depth positions relative to the 3D display: 15, 10, and 5 cm in front of the 3D display, on the 3D display panel, and 5, 10, 15 and 30 cm behind the 3D display under the IP and binocular stereoscopic display conditions. Under the real object display condition, the target was displayed on the 3D display panel, and the 3D display was placed at the eight positions. The results suggest that the IP image induced more natural accommodation responses compared to the binocular stereoscopic image. The accommodation responses of the IP image were weaker than those of a real object; however, they showed a similar tendency with those of the real object under the two viewing conditions. Therefore, IP can induce accommodation to the depth positions of 3D images.

  19. An architecture for integrating planar and 3D cQED devices

    NASA Astrophysics Data System (ADS)

    Axline, C.; Reagor, M.; Heeres, R.; Reinhold, P.; Wang, C.; Shain, K.; Pfaff, W.; Chu, Y.; Frunzio, L.; Schoelkopf, R. J.

    2016-07-01

    Numerous loss mechanisms can limit coherence and scalability of planar and 3D-based circuit quantum electrodynamics (cQED) devices, particularly due to their packaging. The low loss and natural isolation of 3D enclosures make them good candidates for coherent scaling. We introduce a coaxial transmission line device architecture with coherence similar to traditional 3D cQED systems. Measurements demonstrate well-controlled external and on-chip couplings, a spectrum absent of cross-talk or spurious modes, and excellent resonator and qubit lifetimes. We integrate a resonator-qubit system in this architecture with a seamless 3D cavity, and separately pattern a qubit, readout resonator, Purcell filter, and high-Q stripline resonator on a single chip. Device coherence and its ease of integration make this a promising tool for complex experiments.

  20. Integrated coherent matter wave circuits

    NASA Astrophysics Data System (ADS)

    Ryu, C.; Boshier, M. G.

    2015-09-01

    An integrated coherent matter wave circuit is a single device, analogous to an integrated optical circuit, in which coherent de Broglie waves are created and then launched into waveguides where they can be switched, divided, recombined, and detected as they propagate. Applications of such circuits include guided atom interferometers, atomtronic circuits, and precisely controlled delivery of atoms. Here we report experiments demonstrating integrated circuits for guided coherent matter waves. The circuit elements are created with the painted potential technique, a form of time-averaged optical dipole potential in which a rapidly moving, tightly focused laser beam exerts forces on atoms through their electric polarizability. The source of coherent matter waves is a Bose-Einstein condensate (BEC). We launch BECs into painted waveguides that guide them around bends and form switches, phase coherent beamsplitters, and closed circuits. These are the basic elements that are needed to engineer arbitrarily complex matter wave circuitry.

  1. Progress in 3D imaging and display by integral imaging

    NASA Astrophysics Data System (ADS)

    Martinez-Cuenca, R.; Saavedra, G.; Martinez-Corral, M.; Pons, A.; Javidi, B.

    2009-05-01

    Three-dimensionality is currently considered an important added value in imaging devices, and therefore the search for an optimum 3D imaging and display technique is a hot topic that is attracting important research efforts. As main value, 3D monitors should provide the observers with different perspectives of a 3D scene by simply varying the head position. Three-dimensional imaging techniques have the potential to establish a future mass-market in the fields of entertainment and communications. Integral imaging (InI), which can capture true 3D color images, has been seen as the right technology to 3D viewing to audiences of more than one person. Due to the advanced degree of development, InI technology could be ready for commercialization in the coming years. This development is the result of a strong research effort performed along the past few years by many groups. Since Integral Imaging is still an emerging technology, the first aim of the "3D Imaging and Display Laboratory" at the University of Valencia, has been the realization of a thorough study of the principles that govern its operation. Is remarkable that some of these principles have been recognized and characterized by our group. Other contributions of our research have been addressed to overcome some of the classical limitations of InI systems, like the limited depth of field (in pickup and in display), the poor axial and lateral resolution, the pseudoscopic-to-orthoscopic conversion, the production of 3D images with continuous relief, or the limited range of viewing angles of InI monitors.

  2. [An integrated segmentation method for 3D ultrasound carotid artery].

    PubMed

    Yang, Xin; Wu, Huihui; Liu, Yang; Xu, Hongwei; Liang, Huageng; Cai, Wenjuan; Fang, Mengjie; Wang, Yujie

    2013-07-01

    An integrated segmentation method for 3D ultrasound carotid artery was proposed. 3D ultrasound image was sliced into transverse, coronal and sagittal 2D images on the carotid bifurcation point. Then, the three images were processed respectively, and the carotid artery contours and thickness were obtained finally. This paper tries to overcome the disadvantages of current computer aided diagnosis method, such as high computational complexity, easily introduced subjective errors et al. The proposed method could get the carotid artery overall information rapidly, accurately and completely. It could be transplanted into clinical usage for atherosclerosis diagnosis and prevention. PMID:24195385

  3. Postirradiation Effects In Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Shaw, David C.; Barnes, Charles E.

    1993-01-01

    Two reports discuss postirradiation effects in integrated circuits. Presents examples of postirradiation measurements of performances of integrated circuits of five different types: dual complementary metal oxide/semiconductor (CMOS) flip-flop; CMOS analog multiplier; two CMOS multiplying digital-to-analog converters; electrically erasable programmable read-only memory; and semiconductor/oxide/semiconductor octal buffer driver.

  4. Output-sensitive 3D line integral convolution.

    PubMed

    Falk, Martin; Weiskopf, Daniel

    2008-01-01

    We propose an output-sensitive visualization method for 3D line integral convolution (LIC) whose rendering speed is largely independent of the data set size and mostly governed by the complexity of the output on the image plane. Our approach of view-dependent visualization tightly links the LIC generation with the volume rendering of the LIC result in order to avoid the computation of unnecessary LIC points: early-ray termination and empty-space leaping techniques are used to skip the computation of the LIC integral in a lazy-evaluation approach; both ray casting and texture slicing can be used as volume-rendering techniques. The input noise is modeled in object space to allow for temporal coherence under object and camera motion. Different noise models are discussed, covering dense representations based on filtered white noise all the way to sparse representations similar to oriented LIC. Aliasing artifacts are avoided by frequency control over the 3D noise and by employing a 3D variant of MIPmapping. A range of illumination models is applied to the LIC streamlines: different codimension-2 lighting models and a novel gradient-based illumination model that relies on precomputed gradients and does not require any direct calculation of gradients after the LIC integral is evaluated. We discuss the issue of proper sampling of the LIC and volume-rendering integrals by employing a frequency-space analysis of the noise model and the precomputed gradients. Finally, we demonstrate that our visualization approach lends itself to a fast graphics processing unit (GPU) implementation that supports both steady and unsteady flow. Therefore, this 3D LIC method allows users to interactively explore 3D flow by means of high-quality, view-dependent, and adaptive LIC volume visualization. Applications to flow visualization in combination with feature extraction and focus-and-context visualization are described, a comparison to previous methods is provided, and a detailed performance

  5. Integrated optical 3D digital imaging based on DSP scheme

    NASA Astrophysics Data System (ADS)

    Wang, Xiaodong; Peng, Xiang; Gao, Bruce Z.

    2008-03-01

    We present a scheme of integrated optical 3-D digital imaging (IO3DI) based on digital signal processor (DSP), which can acquire range images independently without PC support. This scheme is based on a parallel hardware structure with aid of DSP and field programmable gate array (FPGA) to realize 3-D imaging. In this integrated scheme of 3-D imaging, the phase measurement profilometry is adopted. To realize the pipeline processing of the fringe projection, image acquisition and fringe pattern analysis, we present a multi-threads application program that is developed under the environment of DSP/BIOS RTOS (real-time operating system). Since RTOS provides a preemptive kernel and powerful configuration tool, with which we are able to achieve a real-time scheduling and synchronization. To accelerate automatic fringe analysis and phase unwrapping, we make use of the technique of software optimization. The proposed scheme can reach a performance of 39.5 f/s (frames per second), so it may well fit into real-time fringe-pattern analysis and can implement fast 3-D imaging. Experiment results are also presented to show the validity of proposed scheme.

  6. R3D: Reduction Package for Integral Field Spectroscopy

    NASA Astrophysics Data System (ADS)

    Sánchez, Sebastián. F.

    2011-06-01

    R3D was developed to reduce fiber-based integral field spectroscopy (IFS) data. The package comprises a set of command-line routines adapted for each of these steps, suitable for creating pipelines. The routines have been tested against simulations, and against real data from various integral field spectrographs (PMAS, PPAK, GMOS, VIMOS and INTEGRAL). Particular attention is paid to the treatment of cross-talk. R3D unifies the reduction techniques for the different IFS instruments to a single one, in order to allow the general public to reduce different instruments data in an homogeneus, consistent and simple way. Although still in its prototyping phase, it has been proved to be useful to reduce PMAS (both in the Larr and the PPAK modes), VIMOS and INTEGRAL data. The current version has been coded in Perl, using PDL, in order to speed-up the algorithm testing phase. Most of the time critical algorithms have been translated to C[float=][/float], and it is our intention to translate all of them. However, even in this phase R3D is fast enough to produce valuable science frames in reasonable time.

  7. Electronic design with integrated circuits

    NASA Astrophysics Data System (ADS)

    Comer, D. J.

    The book is concerned with the application of integrated circuits and presents the material actually needed by the system designer to do an effective job. The operational amplifier (op amp) is discussed, taking into account the electronic amplifier, the basic op amp, the practical op amp, analog applications, and digital applications. Digital components are considered along with combinational logic, digital subsystems, the microprocessor, special circuits, communications, and integrated circuit building blocks. Attention is given to logic gates, logic families, multivibrators, the digital computer, digital methods, communicating with a computer, computer organization, register and timing circuits for data transfer, arithmetic circuits, memories, the microprocessor chip, the control unit, communicating with the microprocessor, examples of microprocessor architecture, programming a microprocessor, the voltage-controlled oscillator, the phase-locked loop, analog-to-digital conversion, amplitude modulation, frequency modulation, pulse and digital transmission, the semiconductor diode, the bipolar transistor, and the field-effect transistor.

  8. Variational integrators for electric circuits

    SciTech Connect

    Ober-Blöbaum, Sina; Tao, Molei; Cheng, Mulin; Owhadi, Houman; Marsden, Jerrold E.

    2013-06-01

    In this contribution, we develop a variational integrator for the simulation of (stochastic and multiscale) electric circuits. When considering the dynamics of an electric circuit, one is faced with three special situations: 1. The system involves external (control) forcing through external (controlled) voltage sources and resistors. 2. The system is constrained via the Kirchhoff current (KCL) and voltage laws (KVL). 3. The Lagrangian is degenerate. Based on a geometric setting, an appropriate variational formulation is presented to model the circuit from which the equations of motion are derived. A time-discrete variational formulation provides an iteration scheme for the simulation of the electric circuit. Dependent on the discretization, the intrinsic degeneracy of the system can be canceled for the discrete variational scheme. In this way, a variational integrator is constructed that gains several advantages compared to standard integration tools for circuits; in particular, a comparison to BDF methods (which are usually the method of choice for the simulation of electric circuits) shows that even for simple LCR circuits, a better energy behavior and frequency spectrum preservation can be observed using the developed variational integrator.

  9. 3D-GNOME: an integrated web service for structural modeling of the 3D genome

    PubMed Central

    Szalaj, Przemyslaw; Michalski, Paul J.; Wróblewski, Przemysław; Tang, Zhonghui; Kadlof, Michal; Mazzocco, Giovanni; Ruan, Yijun; Plewczynski, Dariusz

    2016-01-01

    Recent advances in high-throughput chromosome conformation capture (3C) technology, such as Hi-C and ChIA-PET, have demonstrated the importance of 3D genome organization in development, cell differentiation and transcriptional regulation. There is now a widespread need for computational tools to generate and analyze 3D structural models from 3C data. Here we introduce our 3D GeNOme Modeling Engine (3D-GNOME), a web service which generates 3D structures from 3C data and provides tools to visually inspect and annotate the resulting structures, in addition to a variety of statistical plots and heatmaps which characterize the selected genomic region. Users submit a bedpe (paired-end BED format) file containing the locations and strengths of long range contact points, and 3D-GNOME simulates the structure and provides a convenient user interface for further analysis. Alternatively, a user may generate structures using published ChIA-PET data for the GM12878 cell line by simply specifying a genomic region of interest. 3D-GNOME is freely available at http://3dgnome.cent.uw.edu.pl/. PMID:27185892

  10. 3D-GNOME: an integrated web service for structural modeling of the 3D genome.

    PubMed

    Szalaj, Przemyslaw; Michalski, Paul J; Wróblewski, Przemysław; Tang, Zhonghui; Kadlof, Michal; Mazzocco, Giovanni; Ruan, Yijun; Plewczynski, Dariusz

    2016-07-01

    Recent advances in high-throughput chromosome conformation capture (3C) technology, such as Hi-C and ChIA-PET, have demonstrated the importance of 3D genome organization in development, cell differentiation and transcriptional regulation. There is now a widespread need for computational tools to generate and analyze 3D structural models from 3C data. Here we introduce our 3D GeNOme Modeling Engine (3D-GNOME), a web service which generates 3D structures from 3C data and provides tools to visually inspect and annotate the resulting structures, in addition to a variety of statistical plots and heatmaps which characterize the selected genomic region. Users submit a bedpe (paired-end BED format) file containing the locations and strengths of long range contact points, and 3D-GNOME simulates the structure and provides a convenient user interface for further analysis. Alternatively, a user may generate structures using published ChIA-PET data for the GM12878 cell line by simply specifying a genomic region of interest. 3D-GNOME is freely available at http://3dgnome.cent.uw.edu.pl/. PMID:27185892

  11. 3D J-Integral Capability in Grizzly

    SciTech Connect

    Benjamin Spencer; Marie Backman; Pritam Chakraborty; William Hoffman

    2014-09-01

    This report summarizes work done to develop a capability to evaluate fracture contour J-Integrals in 3D in the Grizzly code. In the current fiscal year, a previously-developed 2D implementation of a J-Integral evaluation capability has been extended to work in 3D, and to include terms due both to mechanically-induced strains and due to gradients in thermal strains. This capability has been verified against a benchmark solution on a model of a curved crack front in 3D. The thermal term in this integral has been verified against a benchmark problem with a thermal gradient. These developments are part of a larger effort to develop Grizzly as a tool that can be used to predict the evolution of aging processes in nuclear power plant systems, structures, and components, and assess their capacity after being subjected to those aging processes. The capabilities described here have been developed to enable evaluations of Mode- stress intensity factors on axis-aligned flaws in reactor pressure vessels. These can be compared with the fracture toughness of the material to determine whether a pre-existing flaw would begin to propagate during a pos- tulated pressurized thermal shock accident. This report includes a demonstration calculation to show how Grizzly is used to perform a deterministic assessment of such a flaw propagation in a degraded reactor pressure vessel under pressurized thermal shock conditions. The stress intensity is calculated from J, and the toughness is computed using the fracture master curve and the degraded ductile to brittle transition temperature.

  12. Customisable 3D printed microfluidics for integrated analysis and optimisation.

    PubMed

    Monaghan, T; Harding, M J; Harris, R A; Friel, R J; Christie, S D R

    2016-08-16

    The formation of smart Lab-on-a-Chip (LOC) devices featuring integrated sensing optics is currently hindered by convoluted and expensive manufacturing procedures. In this work, a series of 3D-printed LOC devices were designed and manufactured via stereolithography (SL) in a matter of hours. The spectroscopic performance of a variety of optical fibre combinations were tested, and the optimum path length for performing Ultraviolet-visible (UV-vis) spectroscopy determined. The information gained in these trials was then used in a reaction optimisation for the formation of carvone semicarbazone. The production of high resolution surface channels (100-500 μm) means that these devices were capable of handling a wide range of concentrations (9 μM-38 mM), and are ideally suited to both analyte detection and process optimisation. This ability to tailor the chip design and its integrated features as a direct result of the reaction being assessed, at such a low time and cost penalty greatly increases the user's ability to optimise both their device and reaction. As a result of the information gained in this investigation, we are able to report the first instance of a 3D-printed LOC device with fully integrated, in-line monitoring capabilities via the use of embedded optical fibres capable of performing UV-vis spectroscopy directly inside micro channels. PMID:27452498

  13. Analog MOS integrated circuits

    NASA Technical Reports Server (NTRS)

    Temes, Gabor C.

    1988-01-01

    The goal was to design single-chip lowpass filters with constant group delay in the pass band and 60 dB minimum attenuation in the stop band. The desired 3 dB frequencies are (in Hertz) 2.5, 5, 10, 20, 40, 80, 160, and 320. A filter class that satisfies the constant delay (linear phase) requirement while providing quite a narrow transition band is the Bessel-Chebyshev filters. It was found that the 7th order Bessel-Chebyshev response satisfied the requirement of the filter.

  14. 3D integration with coaxial through silicon vias

    NASA Astrophysics Data System (ADS)

    Adamshick, Stephen

    3D integration using through-silicon-vias (TSVs) is gaining considerable attention due to its superior packaging efficiency resulting in higher functionality, improved performance and a reduction in power consumption. In order to implement 3D chip designs with TSV technology, robust TSV electrical models are required. Specifically, due to the increase of signal speeds into the gigahertz (GHz) spectrum, a high frequency electrical characterization best describes TSV behavior. This thesis focuses on coaxial TSV technology due to its superior performance compared to the current existing TSV technology at high frequencies. By confining signal propagation within the coaxial TSV shield, power losses to the silicon substrate are eliminated and unintentional signal coupling is avoided. To the best of our knowledge, coaxial TSV technology has only been characterized using finite element modeling. The work presented by this thesis focuses on fabricating coaxial TSVs within the confines of standard poly gate CMOS processing. In addition, we perform a high frequency electrical characterization using s-parameters and a thermal stress characterization using micro-Raman Spectroscopy. Furthermore, we investigate applications in SPICE modeling and antenna on chip (AoC) applications utilizing coaxial TSV technology. Our results indicate the coaxial TSV reduces signal attenuation by 35% and time delay by 25% compared to the standard non-shielded TSV technology. Coaxial TSV is consistent with previous TSV results regarding induced silicon stress. Lastly, we propose a 60 GHz antenna design using the coaxial TSV that significantly improves antenna gain compared to previous literature examples.

  15. Design automation for integrated circuits

    NASA Astrophysics Data System (ADS)

    Newell, S. B.; de Geus, A. J.; Rohrer, R. A.

    1983-04-01

    Consideration is given to the development status of the use of computers in automated integrated circuit design methods, which promise the minimization of both design time and design error incidence. Integrated circuit design encompasses two major tasks: error specification, in which the goal is a logic diagram that accurately represents the desired electronic function, and physical specification, in which the goal is an exact description of the physical locations of all circuit elements and their interconnections on the chip. Design automation not only saves money by reducing design and fabrication time, but also helps the community of systems and logic designers to work more innovatively. Attention is given to established design automation methodologies, programmable logic arrays, and design shortcuts.

  16. MOS integrated circuit fault modeling

    NASA Technical Reports Server (NTRS)

    Sievers, M.

    1985-01-01

    Three digital simulation techniques for MOS integrated circuit faults were examined. These techniques embody a hierarchy of complexity bracketing the range of simulation levels. The digital approaches are: transistor-level, connector-switch-attenuator level, and gate level. The advantages and disadvantages are discussed. Failure characteristics are also described.

  17. Pipe3D, a pipeline to analyze Integral Field Spectroscopy Data: I. New fitting philosophy of FIT3D

    NASA Astrophysics Data System (ADS)

    Sánchez, S. F.; Pérez, E.; Sánchez-Blázquez, P.; González, J. J.; Rosález-Ortega, F. F.; Cano-Dí az, M.; López-Cobá, C.; Marino, R. A.; Gil de Paz, A.; Mollá, M.; López-Sánchez, A. R.; Ascasibar, Y.; Barrera-Ballesteros, J.

    2016-04-01

    We present an improved version of FIT3D, a fitting tool for the analysis of the spectroscopic properties of the stellar populations and the ionized gas derived from moderate resolution spectra of galaxies. This tool was developed to analyze integral field spectroscopy data and it is the basis of Pipe3D, a pipeline used in the analysis of CALIFA, MaNGA, and SAMI data. We describe the philosophy and each step of the fitting procedure. We present an extensive set of simulations in order to estimate the precision and accuracy of the derived parameters for the stellar populations and the ionized gas. We report on the results of those simulations. Finally, we compare the results of the analysis using FIT3D with those provided by other widely used packages, and we find that the parameters derived by FIT3D are fully compatible with those derived using these other tools.

  18. Digital 3D Borobudur - Integration of 3D surveying and modeling techniques

    NASA Astrophysics Data System (ADS)

    Suwardhi, D.; Menna, F.; Remondino, F.; Hanke, K.; Akmalia, R.

    2015-08-01

    The Borobudur temple (Indonesia) is one of the greatest Buddhist monuments in the world, now listed as an UNESCO World Heritage Site. The present state of the temple is the result of restorations after being exposed to natural disasters several times. Today there is still a growing rate of deterioration of the building stones whose causes need further researches. Monitoring programs, supported at institutional level, have been effectively executed to observe the problem. The paper presents the latest efforts to digitally document the Borobudur Temple and its surrounding area in 3D with photogrammetric techniques. UAV and terrestrial images were acquired to completely digitize the temple, produce DEM, orthoimages and maps at 1:100 and 1:1000 scale. The results of the project are now employed by the local government organizations to manage the heritage area and plan new policies for the conservation and preservation of the UNESCO site. In order to help data management and policy makers, a web-based information system of the heritage area was also built to visualize and easily access all the data and achieved 3D results.

  19. Perceptual integration for qualitatively different 3-D cues in the human brain.

    PubMed

    Dövencioğlu, Dicle; Ban, Hiroshi; Schofield, Andrew J; Welchman, Andrew E

    2013-09-01

    The visual system's flexibility in estimating depth is remarkable: We readily perceive 3-D structure under diverse conditions from the seemingly random dots of a "magic eye" stereogram to the aesthetically beautiful, but obviously flat, canvasses of the Old Masters. Yet, 3-D perception is often enhanced when different cues specify the same depth. This perceptual process is understood as Bayesian inference that improves sensory estimates. Despite considerable behavioral support for this theory, insights into the cortical circuits involved are limited. Moreover, extant work tested quantitatively similar cues, reducing some of the challenges associated with integrating computationally and qualitatively different signals. Here we address this challenge by measuring fMRI responses to depth structures defined by shading, binocular disparity, and their combination. We quantified information about depth configurations (convex "bumps" vs. concave "dimples") in different visual cortical areas using pattern classification analysis. We found that fMRI responses in dorsal visual area V3B/KO were more discriminable when disparity and shading concurrently signaled depth, in line with the predictions of cue integration. Importantly, by relating fMRI and psychophysical tests of integration, we observed a close association between depth judgments and activity in this area. Finally, using a cross-cue transfer test, we found that fMRI responses evoked by one cue afford classification of responses evoked by the other. This reveals a generalized depth representation in dorsal visual cortex that combines qualitatively different information in line with 3-D perception. PMID:23647559

  20. Demonstrating Multi-Qubit Operations in a Superconducting 3D circuit QED Architecture

    NASA Astrophysics Data System (ADS)

    Paik, Hanhee; Sandberg, M. O.; Mezzacapo, A.; McClure, D. T.; Abdo, B.; Dial, O. E.; Cross, A. W.; Corcoles, A. D.; Sheldon, S.; Magesan, E.; Srinivasan, S. J.; Gambetta, J. M.; Chow, J. M.; Bogorin, D.; Plourde, B. L. T.

    We present our recent results on multi-qubit operations in a superconducting 3D circuit QED (cQED) system using a resonator-induced phase (RIP) gate. In our system, four qubits are coupled by a single bus resonator. The RIP gate is implemented by applying a microwave pulse to the bus that performs entangling operations. We demonstrate controlled-phase gates using RIP on 2-qubit subsystems with gate fidelities between 95%-97% evaluated by randomized benchmarking. Via a multi-qubit echo scheme, we perform isolated two-qubit interactions in the full 4-qubit system to generate a GHZ state. We acknowledge support from IARPA under Contract W911NF-10-1-0324.

  1. Two-qubit parity meters in 3D and 2D circuit QED

    NASA Astrophysics Data System (ADS)

    Dicarlo, Leonardo

    2014-03-01

    Non-demolition measurements of multi-qubit observables and feedback control conditioned on their outcomes are essential for quantum error correction. We present two implementations of two-qubit parity meters in circuit QED. In 3D, we match the dispersive coupling of two qubits to a common cavity to encode parity in the transmission of an applied microwave pulse. In 2D, we first encode the parity of two data qubits in the computational state of an ancillary qubit using resonant interactions, and subsequently project the ancilla using a dedicated, dispersively-coupled resonator. A key advantage of this second scheme is the protection of data qubits from dephasing by measurement photons. First applications of these parity meters include probabilistic entanglement by measurement, and deterministic entanglement using digital feedback control. Current efforts target the implementation of measurement-based bit-flip error correction. Research funded by NWO, FOM, and the European projects SOLID and SCALEQIT.

  2. Integration of virtual and real scenes within an integral 3D imaging environment

    NASA Astrophysics Data System (ADS)

    Ren, Jinsong; Aggoun, Amar; McCormick, Malcolm

    2002-11-01

    The Imaging Technologies group at De Montfort University has developed an integral 3D imaging system, which is seen as the most likely vehicle for 3D television avoiding psychological effects. To create real fascinating three-dimensional television programs, a virtual studio that performs the task of generating, editing and integrating the 3D contents involving virtual and real scenes is required. The paper presents, for the first time, the procedures, factors and methods of integrating computer-generated virtual scenes with real objects captured using the 3D integral imaging camera system. The method of computer generation of 3D integral images, where the lens array is modelled instead of the physical camera is described. In the model each micro-lens that captures different elemental images of the virtual scene is treated as an extended pinhole camera. An integration process named integrated rendering is illustrated. Detailed discussion and deep investigation are focused on depth extraction from captured integral 3D images. The depth calculation method from the disparity and the multiple baseline method that is used to improve the precision of depth estimation are also presented. The concept of colour SSD and its further improvement in the precision is proposed and verified.

  3. Delay locked loop integrated circuit.

    SciTech Connect

    Brocato, Robert Wesley

    2007-10-01

    This report gives a description of the development of a Delay Locked Loop (DLL) integrated circuit (IC). The DLL was developed and tested as a stand-alone IC test chip to be integrated into a larger application specific integrated circuit (ASIC), the Quadrature Digital Waveform Synthesizer (QDWS). The purpose of the DLL is to provide a digitally programmable delay to enable synchronization between an internal system clock and external peripherals with unknown clock skew. The DLL was designed and fabricated in the IBM 8RF process, a 0.13 {micro}m CMOS process. It was designed to operate with a 300MHz clock and has been tested up to 500MHz.

  4. Relating functional connectivity in V1 neural circuits and 3D natural scenes using Boltzmann machines.

    PubMed

    Zhang, Yimeng; Li, Xiong; Samonds, Jason M; Lee, Tai Sing

    2016-03-01

    Bayesian theory has provided a compelling conceptualization for perceptual inference in the brain. Central to Bayesian inference is the notion of statistical priors. To understand the neural mechanisms of Bayesian inference, we need to understand the neural representation of statistical regularities in the natural environment. In this paper, we investigated empirically how statistical regularities in natural 3D scenes are represented in the functional connectivity of disparity-tuned neurons in the primary visual cortex of primates. We applied a Boltzmann machine model to learn from 3D natural scenes, and found that the units in the model exhibited cooperative and competitive interactions, forming a "disparity association field", analogous to the contour association field. The cooperative and competitive interactions in the disparity association field are consistent with constraints of computational models for stereo matching. In addition, we simulated neurophysiological experiments on the model, and found the results to be consistent with neurophysiological data in terms of the functional connectivity measurements between disparity-tuned neurons in the macaque primary visual cortex. These findings demonstrate that there is a relationship between the functional connectivity observed in the visual cortex and the statistics of natural scenes. They also suggest that the Boltzmann machine can be a viable model for conceptualizing computations in the visual cortex and, as such, can be used to predict neural circuits in the visual cortex from natural scene statistics. PMID:26712581

  5. Integrating visible light 3D scanning into the everyday world

    NASA Astrophysics Data System (ADS)

    Straub, Jeremy

    2015-05-01

    Visible light 3D scanning offers the potential to non-invasively and nearly non-perceptibly incorporate 3D imaging into the everyday world. This paper considers the various possible uses of visible light 3D scanning technology. It discusses multiple possible usage scenarios including in hospitals, security perimeter settings and retail environments. The paper presents a framework for assessing the efficacy of visible light 3D scanning for a given application (and compares this to other scanning approaches such as those using blue light or lasers). It also discusses ethical and legal considerations relevant to real-world use and concludes by presenting a decision making framework.

  6. Gold Nanoparticle Synthesis by 3D Integrated Micro-solution Plasma in a 3D Printed Artificial Porous Dielectric Material

    NASA Astrophysics Data System (ADS)

    Sotoda, Naoya; Tanaka, Kenji; Shirafuji, Tatsuru

    2015-09-01

    Plasma in contact with HAuCl4 aqueous solution can promote the synthesis of gold nanoparticles. To scale up this process, we have developed 3D integrated micro-solution plasma (3D IMSP). It can generate a large number of argon microplasmas in contact with the aqueous solution flowing in a porous dielectric material. The porous dielectric material in our prototype 3D IMSP reactor, however, consists of non-regularly arranged random-sized pores. These pore parameters may be the parameters for controlling the size and dispersion of synthesized gold nanoparticles. We have hence fabricated a 3D IMSP reactor with an artificial porous dielectric material that has regularly arranged same-sized pores by using a 3D printer. We have applied the reactor to the gold- nanoparticle synthesis. We have confirmed the synthesis of gold nanoparticles through the observation of a plasmon resonance absorption peak at 550 nm in the HAuCl4 aqueous solution treated with 3D IMSP. The size and distribution of the synthesized gold nanoparticles are under investigation. We expect that these characteristics of the gold nanoparticles can be manipulated by changing pore size and their distribution in the porous dielectric material.

  7. Bioluminescent bioreporter integrated circuits (BBICs)

    NASA Astrophysics Data System (ADS)

    Simpson, Michael L.; Sayler, Gary S.; Nivens, David; Ripp, Steve; Paulus, Michael J.; Jellison, Gerald E.

    1998-07-01

    As the workhorse of the integrated circuit (IC) industry, the capabilities of CMOS have been expanded well beyond the original applications. The full spectrum of analog circuits from switched-capacitor filters to microwave circuit blocks, and from general-purpose operational amplifiers to sub- nanosecond analog timing circuits for nuclear physics experiments have been implemented in CMOS. This technology has also made in-roads into the growing area of monolithic sensors with devices such as active-pixel sensors and other electro-optical detection devices. While many of the processes used for MEMS fabrication are not compatible with the CMOS IC process, depositing a sensor material onto a previously fabricated CMOS circuit can create a very useful category of sensors. In this work we report a chemical sensor composed of bioluminescent bioreporters (genetically engineered bacteria) deposited onto a micro-luminometer fabricated in a standard CMOS IC process. The bioreporter used for this work emitted 490-nm light when exposed to toluene. This luminescence was detected by the micro- luminometer giving an indication of the concentration of toluene. Other bioluminescent bioreporters sensitive to explosives, mercury, and other organic chemicals and heavy metals have been reported. These could be incorporated (individually or in combination) with the micro-luminometer reported here to form a variety of chemical sensors.

  8. Fully 3D-Integrated Pixel Detectors for X-Rays

    SciTech Connect

    Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul; Grybos, Pawel; Holm, Scott; Lipton, Ronald; Maj, Piotr; Patti, Robert; Siddons, David Peter; Szczygiel, Robert; Yarema, Raymond

    2016-01-01

    The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch, yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e- rms and a conversion gain of 69.5 μV/e- with 2.6 e- rms and 2.7 μV/e- rms pixel-to-pixel variations, respectively, were measured.

  9. A monolithic 3D integrated nanomagnetic co-processing unit

    NASA Astrophysics Data System (ADS)

    Becherer, M.; Breitkreutz-v. Gamm, S.; Eichwald, I.; Žiemys, G.; Kiermaier, J.; Csaba, G.; Schmitt-Landsiedel, D.

    2016-01-01

    As CMOS scaling becomes more and more challenging there is strong impetus for beyond CMOS device research to add new functionality to ICs. In this article, a promising technology with non-volatile ferromagnetic computing states - the so-called Perpendicular Nanomagnetic Logic (pNML) - is reviewed. After introducing the 2D planar implementation of NML with magnetization perpendicular to the surface, the path to monolithically 3D integrated systems is discussed. Instead of CMOS substitution, additional functionality is added by a co-processor architecture as a prospective back-end-of-line (BEOL) process, where the computing elements are clocked by a soft-magnetic on-chip inductor. The unconventional computation in the ferromagnetic domain can lead to highly dense computing structures without leakage currents, attojoule dissipation per bit operation and data-throughputs comparable to state-of-the-art high-performance CMOS CPUs. In appropriate applications and with specialized computing architectures they might even circumvent the bottleneck of time-consuming memory access, as computation is inherently performed with non-volatile computing states.

  10. Integrating 3D Visualization and GIS in Planning Education

    ERIC Educational Resources Information Center

    Yin, Li

    2010-01-01

    Most GIS-related planning practices and education are currently limited to two-dimensional mapping and analysis although 3D GIS is a powerful tool to study the complex urban environment in its full spatial extent. This paper reviews current GIS and 3D visualization uses and development in planning practice and education. Current literature…

  11. 3D Vectorial Time Domain Computational Integrated Photonics

    SciTech Connect

    Kallman, J S; Bond, T C; Koning, J M; Stowell, M L

    2007-02-16

    The design of integrated photonic structures poses considerable challenges. 3D-Time-Domain design tools are fundamental in enabling technologies such as all-optical logic, photonic bandgap sensors, THz imaging, and fast radiation diagnostics. Such technologies are essential to LLNL and WFO sponsors for a broad range of applications: encryption for communications and surveillance sensors (NSA, NAI and IDIV/PAT); high density optical interconnects for high-performance computing (ASCI); high-bandwidth instrumentation for NIF diagnostics; micro-sensor development for weapon miniaturization within the Stockpile Stewardship and DNT programs; and applications within HSO for CBNP detection devices. While there exist a number of photonics simulation tools on the market, they primarily model devices of interest to the communications industry. We saw the need to extend our previous software to match the Laboratory's unique emerging needs. These include modeling novel material effects (such as those of radiation induced carrier concentrations on refractive index) and device configurations (RadTracker bulk optics with radiation induced details, Optical Logic edge emitting lasers with lateral optical inputs). In addition we foresaw significant advantages to expanding our own internal simulation codes: parallel supercomputing could be incorporated from the start, and the simulation source code would be accessible for modification and extension. This work addressed Engineering's Simulation Technology Focus Area, specifically photonics. Problems addressed from the Engineering roadmap of the time included modeling the Auston switch (an important THz source/receiver), modeling Vertical Cavity Surface Emitting Lasers (VCSELs, which had been envisioned as part of fast radiation sensors), and multi-scale modeling of optical systems (for a variety of applications). We proposed to develop novel techniques to numerically solve the 3D multi-scale propagation problem for both the microchip

  12. 3D probe array integrated with a front-end 100-channel neural recording ASIC

    NASA Astrophysics Data System (ADS)

    Cheng, Ming-Yuan; Yao, Lei; Tan, Kwan Ling; Lim, Ruiqi; Li, Peng; Chen, Weiguo

    2014-12-01

    Brain-machine interface technology can improve the lives of spinal cord injury victims and amputees. A neural interface system, consisting of a 3D probe array and a custom low-power (1 mW) 100-channel (100-ch) neural recording application-specific integrated circuit (ASIC), was designed and implemented to monitor neural activity. In this study, a microassembly 3D probe array method using a novel lead transfer technique was proposed to overcome the bonding plane mismatch encountered during orthogonal assembly. The proposed lead transfer technique can be completed using standard micromachining and packaging processes. The ASIC can be stacking-integrated with the probe array, minimizing the form factor of the assembled module. To minimize trauma to brain cells, the profile of the integrated probe array was controlled within 730 μm. The average impedance of the assembled probe was approximately 0.55 MΩ at 1 kHz. To verify the functionality of the integrated neural probe array, bench-top signal acquisitions were performed and discussed.

  13. Integrated circuits, and design and manufacture thereof

    SciTech Connect

    Auracher, Stefan; Pribbernow, Claus; Hils, Andreas

    2006-04-18

    A representation of a macro for an integrated circuit layout. The representation may define sub-circuit cells of a module. The module may have a predefined functionality. The sub-circuit cells may include at least one reusable circuit cell. The reusable circuit cell may be configured such that when the predefined functionality of the module is not used, the reusable circuit cell is available for re-use.

  14. Removing Bonded Integrated Circuits From Boards

    NASA Technical Reports Server (NTRS)

    Rice, John T.

    1989-01-01

    Small resistance heater makes it easier, faster, and cheaper to remove integrated circuit from hybrid-circuit board, package, or other substrate for rework. Heater, located directly in polymeric bond interface or on substrate under integrated-circuit chip, energized when necessary to remove chip. Heat generated softens adhesive or solder that bonds chip to substrate. Chip then lifted easily from substrate.

  15. 3D-GEM: Geo-technical extension towards an integrated 3D information model for infrastructural development

    NASA Astrophysics Data System (ADS)

    Tegtmeier, W.; Zlatanova, S.; van Oosterom, P. J. M.; Hack, H. R. G. K.

    2014-03-01

    In infrastructural projects, communication as well as information exchange and (re-)use in and between involved parties is difficult. Mainly this is caused by a lack of information harmonisation. Various specialists are working together on the development of an infrastructural project and all use their own specific software and definitions for various information types. In addition, the lack of and/or differences in the use and definition of thematic semantic information regarding the various information types adds to the problem. Realistic 3D models describing and integrating parts of the earth already exist, but are generally neglecting the subsurface, and especially the aspects of geology and geo-technology. This paper summarises the research towards the extension of an existing integrated semantic information model to include surface as well as subsurface objects and in particular, subsurface geological and geotechnical objects. The major contributions of this research are the definition of geotechnical objects and the mechanism to link them with CityGML, GeoSciML and O&M standard models. The model is called 3D-GEM, short for 3D Geotechnical Extension Model.

  16. Development of superconducting bonding for multilayer microwave integrated quantum circuits

    NASA Astrophysics Data System (ADS)

    Brecht, Teresa; Axline, Christopher; Chu, Yiwen; Pfaff, Wolfgang; Frunzio, Luigi; Devoret, Michel; Schoelkopf, Robert

    Future quantum computers are likely to take the shape of multilayer microwave integrated quantum circuits. The proposed physical architecture retains the superb coherence of 3D structures while achieving superior scalability and compatibility with planar circuitry and integrated readout electronics. This hardware platform utilizes known techniques of bulk etching in silicon wafers and requires metallic bonding of superconducting materials. Superconducting wafer bonding is a crucial tool in need of development. Whether micromachined in wafers or traditionally machined in bulk metal, 3D cavities typically posses a seam where two parts meet. Ideally, this seam consists of a perfect superconducting bond. Pursuing this goal, we have developed a new understanding of seams as a loss mechanism that is applicable to 3D cavities in general. We present quality factor measurements of both 3D cavities and 2D stripline resonators to study the losses of superconducting bonds.

  17. Integration of real-time 3D capture, reconstruction, and light-field display

    NASA Astrophysics Data System (ADS)

    Zhang, Zhaoxing; Geng, Zheng; Li, Tuotuo; Pei, Renjing; Liu, Yongchun; Zhang, Xiao

    2015-03-01

    Effective integration of 3D acquisition, reconstruction (modeling) and display technologies into a seamless systems provides augmented experience of visualizing and analyzing real objects and scenes with realistic 3D sensation. Applications can be found in medical imaging, gaming, virtual or augmented reality and hybrid simulations. Although 3D acquisition, reconstruction, and display technologies have gained significant momentum in recent years, there seems a lack of attention on synergistically combining these components into a "end-to-end" 3D visualization system. We designed, built and tested an integrated 3D visualization system that is able to capture in real-time 3D light-field images, perform 3D reconstruction to build 3D model of the objects, and display the 3D model on a large autostereoscopic screen. In this article, we will present our system architecture and component designs, hardware/software implementations, and experimental results. We will elaborate on our recent progress on sparse camera array light-field 3D acquisition, real-time dense 3D reconstruction, and autostereoscopic multi-view 3D display. A prototype is finally presented with test results to illustrate the effectiveness of our proposed integrated 3D visualization system.

  18. Integration of 3D intraoperative ultrasound for enhanced neuronavigation

    NASA Astrophysics Data System (ADS)

    Paulsen, Keith D.; Ji, Songbai; Hartov, Alex; Fan, Xiaoyao; Roberts, David W.

    2012-03-01

    True three-dimensional (3D) volumetric ultrasound (US) acquisitions stand to benefit intraoperative neuronavigation on multiple fronts. While traditional two-dimensional (2D) US and its tracked, hand-swept version have been recognized for many years to advantage significantly image-guided neurosurgery, especially when coregistered with preoperative MR scans, its unregulated and incomplete sampling of the surgical volume of interest have limited certain intraoperative uses of the information that are overcome through direct volume acquisition (i.e., through 2D scan-head transducer arrays). In this paper, we illustrate several of these advantages, including image-based intraoperative registration (and reregistration) and automated, volumetric displacement mapping for intraoperative image updating. These applications of 3D US are enabled by algorithmic advances in US image calibration, and volume rasterization and interpolation for multi-acquisition synthesis that will also be highlighted. We expect to demonstrate that coregistered 3D US is well worth incorporating into the standard neurosurgical navigational environment relative to traditional tracked, hand-swept 2D US.

  19. Improvements of 3-D image quality in integral display by reducing distortion errors

    NASA Astrophysics Data System (ADS)

    Kawakita, Masahiro; Sasaki, Hisayuki; Arai, Jun; Okano, Fumio; Suehiro, Koya; Haino, Yasuyuki; Yoshimura, Makoto; Sato, Masahito

    2008-02-01

    An integral three-dimensional (3-D) system based on the principle of integral photography can display natural 3-D images. We studied ways of improving the resolution and viewing angle of 3-D images by using extremely highresolution (EHR) video in an integral 3-D video system. One of the problems with the EHR projection-type integral 3-D system is that positional errors appear between the elemental image and the elemental lens when there is geometric distortion in the projected image. We analyzed the relationships between the geometric distortion in the elemental images caused by the projection lens and the spatial distortion of the reconstructed 3-D image. As a result, we clarified that 3-D images reconstructed far from the lens array were greatly affected by the distortion of the elemental images, and that the 3-D images were significantly distorted in the depth direction at the corners of the displayed images. Moreover, we developed a video signal processor that electrically compensated the distortion in the elemental images for an EHR projection-type integral 3-D system. Therefore, the distortion in the displayed 3-D image was removed, and the viewing angle of the 3-D image was expanded to nearly double that obtained with the previous prototype system.

  20. Three-Dimensional Integration Technology for Advanced Focal Planes and Integrated Circuits

    SciTech Connect

    Keast, Craig

    2007-02-28

    Over the last five years MIT Lincoln Laboratory (MIT-LL) has developed a three-dimensional (3D) circuit integration technology that exploits the advantages of silicon-on-insulator (SOI) technology to enable wafer-level stacking and micrometer-scale electrical interconnection of fully fabricated circuit wafers. Advanced focal plane arrays have been the first applications to exploit the benefits of this 3D integration technology because the massively parallel information flow present in 2D imaging arrays maps very nicely into a 3D computational structure as information flows from circuit-tier to circuit-tier in the z-direction. To date, the MIT-LL 3D integration technology has been used to fabricate four different focal planes including: a 2-tier 64 x 64 imager with fully parallel per-pixel A/D conversion; a 3-tier 640 x 480 imager consisting of an imaging tier, an A/D conversion tier, and a digital signal processing tier; a 2-tier 1024 x 1024 pixel, 4-side-abutable imaging modules for tiling large mosaic focal planes, and a 3-tier Geiger-mode avalanche photodiode (APD) 3-D LIDAR array, using a 30 volt APD tier, a 3.3 volt CMOS tier, and a 1.5 volt CMOS tier. Recently, the 3D integration technology has been made available to the circuit design research community through DARPA-sponsored Multiproject fabrication runs. The first Multiproject Run (3DL1) completed fabrication in early 2006 and included over 30 different circuit designs from 21 different research groups. 3D circuit concepts explored in this run included stacked memories, field programmable gate arrays (FPGAs), and mixed-signal circuits. The second Multiproject Run (3DM2) is currently in fabrication and includes particle detector readouts designed by Fermilab. This talk will provide a brief overview of MIT-LL's 3D-integration process, discuss some of the focal plane applications where the technology is being applied, and provide a summary of some of the Multiproject Run circuit results.

  1. Integrated Circuit Electromagnetic Immunity Handbook

    NASA Astrophysics Data System (ADS)

    Sketoe, J. G.

    2000-08-01

    This handbook presents the results of the Boeing Company effort for NASA under contract NAS8-98217. Immunity level data for certain integrated circuit parts are discussed herein, along with analytical techniques for applying the data to electronics systems. This handbook is built heavily on the one produced in the seventies by McDonnell Douglas Astronautics Company (MDAC, MDC Report E1929 of 1 August 1978, entitled Integrated Circuit Electromagnetic Susceptibility Handbook, known commonly as the ICES Handbook, which has served countless systems designers for over 20 years). Sections 2 and 3 supplement the device susceptibility data presented in section 4 by presenting information on related material required to use the IC susceptibility information. Section 2 concerns itself with electromagnetic susceptibility analysis and serves as a guide in using the information contained in the rest of the handbook. A suggested system hardening requirements is presented in this chapter. Section 3 briefly discusses coupling and shielding considerations. For conservatism and simplicity, a worst case approach is advocated to determine the maximum amount of RF power picked up from a given field. This handbook expands the scope of the immunity data in this Handbook is to of 10 MHz to 10 GHz. However, the analytical techniques provided are applicable to much higher frequencies as well. It is expected however, that the upper frequency limit of concern is near 10 GHz. This is due to two factors; the pickup of microwave energy on system cables and wiring falls off as the square of the wavelength, and component response falls off at a rapid rate due to the effects of parasitic shunt paths for the RF energy. It should be noted also that the pickup on wires and cables does not approach infinity as the frequency decreases (as would be expected by extrapolating the square law dependence of the high frequency roll-off to lower frequencies) but levels off due to mismatch effects.

  2. A CNN-based approach to integrate the 3-D turbolent diffusion equation

    NASA Astrophysics Data System (ADS)

    Nunnari, G.

    2003-04-01

    The paper deals with the integration of the 3-D turbulent diffusion equation. This problem is relevant in several application fields including fluid dynamics, air/water pollution, volcanic ash emissions and industrial hazard assessment. As it is well known numerical solution of such a kind of equation is very time consuming even by using modern digital computers and this represents a short-coming for on-line applications. To overcome this drawback a Cellular Neural Network Approach is proposed in this paper. CNN's proposed by Chua and Yang in 1988 are massive parallel analog non-linear circuits with local interconnections between the computing elements that allow very fast distributed computations. Nowadays several producers of semiconductors such as SGS-Thomson are producing on chip CNN's so that their massive use for heavy computing applications is expected in the near future. In the paper the methodological background of the proposed approach will be outlined. Further some results both in terms of accuracy and computation time will be presented also in comparison with traditional three-dimensional computation schemes. Some results obtained to model 3-D pollution problems in the industrial area of Siracusa (Italy), characterised by a large concentration of petrol-chemical plants, will be presented.

  3. Multi Sensor Data Integration for AN Accurate 3d Model Generation

    NASA Astrophysics Data System (ADS)

    Chhatkuli, S.; Satoh, T.; Tachibana, K.

    2015-05-01

    The aim of this paper is to introduce a novel technique of data integration between two different data sets, i.e. laser scanned RGB point cloud and oblique imageries derived 3D model, to create a 3D model with more details and better accuracy. In general, aerial imageries are used to create a 3D city model. Aerial imageries produce an overall decent 3D city models and generally suit to generate 3D model of building roof and some non-complex terrain. However, the automatically generated 3D model, from aerial imageries, generally suffers from the lack of accuracy in deriving the 3D model of road under the bridges, details under tree canopy, isolated trees, etc. Moreover, the automatically generated 3D model from aerial imageries also suffers from undulated road surfaces, non-conforming building shapes, loss of minute details like street furniture, etc. in many cases. On the other hand, laser scanned data and images taken from mobile vehicle platform can produce more detailed 3D road model, street furniture model, 3D model of details under bridge, etc. However, laser scanned data and images from mobile vehicle are not suitable to acquire detailed 3D model of tall buildings, roof tops, and so forth. Our proposed approach to integrate multi sensor data compensated each other's weakness and helped to create a very detailed 3D model with better accuracy. Moreover, the additional details like isolated trees, street furniture, etc. which were missing in the original 3D model derived from aerial imageries could also be integrated in the final model automatically. During the process, the noise in the laser scanned data for example people, vehicles etc. on the road were also automatically removed. Hence, even though the two dataset were acquired in different time period the integrated data set or the final 3D model was generally noise free and without unnecessary details.

  4. Automatic generation of signal processing integrated circuits

    SciTech Connect

    Pope, S.P.

    1985-01-01

    A system for the automated design of signal processing integrated circuits is described in this thesis. The system is based on a library of circuit cells, and a software package that can configure the cells into complete integrated circuits. The architecture of the cell library is optimized for low and medium bandwidth digital signal processing applications. Circuits designed with the system use a multiprocessor architecture. Input to the system is a design file written in a specialized programming language. Software emulation from the design file is used to verify performance. A two-pass silicon compiler is used to translate the design file into a mask-level description of an integrated circuit. A major goal of the project is to make the system useable by those with little or no formal training in integrated circuits. A second goal is to reduce the time and cost associated with performing an integrated circuit design, while still producing designs which are reasonably efficient in their use of the technology. Development of the system was guided by basic research on appropriate architectures and circuit constructs for signal processors. As part of this research an integrated circuit was designed which performs speech analysis and synthesis. This vocoder circuit is intended for use in low-bit-rate digital speech transmission systems.

  5. Improvement of integral 3D image quality by compensating for lens position errors

    NASA Astrophysics Data System (ADS)

    Okui, Makoto; Arai, Jun; Kobayashi, Masaki; Okano, Fumio

    2004-05-01

    Integral photography (IP) or integral imaging is a way to create natural-looking three-dimensional (3-D) images with full parallax. Integral three-dimensional television (integral 3-D TV) uses a method that electronically presents 3-D images in real time based on this IP method. The key component is a lens array comprising many micro-lenses for shooting and displaying. We have developed a prototype device with about 18,000 lenses using a super-high-definition camera with 2,000 scanning lines. Positional errors of these high-precision lenses as well as the camera's lenses will cause distortions in the elemental image, which directly affect the quality of the 3-D image and the viewing area. We have devised a way to compensate for such geometrical position errors and used it for the integral 3-D TV prototype, resulting in an improvement in both viewing zone and picture quality.

  6. Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel

    NASA Technical Reports Server (NTRS)

    Hunter, Don J.; Halpert, Gerald

    1999-01-01

    As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

  7. An object-oriented 3D integral data model for digital city and digital mine

    NASA Astrophysics Data System (ADS)

    Wu, Lixin; Wang, Yanbing; Che, Defu; Xu, Lei; Chen, Xuexi; Jiang, Yun; Shi, Wenzhong

    2005-10-01

    With the rapid development of urban, city space extended from surface to subsurface. As the important data source for the representation of city spatial information, 3D city spatial data have the characteristics of multi-object, heterogeneity and multi-structure. It could be classified referring to the geo-surface into three kinds: above-surface data, surface data and subsurface data. The current research on 3D city spatial information system is divided naturally into two different branch, 3D City GIS (3D CGIS) and 3D Geological Modeling (3DGM). The former emphasizes on the 3D visualization of buildings and the terrain of city, while the latter emphasizes on the visualization of geological bodies and structures. Although, it is extremely important for city planning and construction to integrate all the city spatial information including above-surface, surface and subsurface objects to conduct integral analysis and spatial manipulation. However, either 3D CGIS or 3DGM is currently difficult to realize the information integration, integral analysis and spatial manipulation. Considering 3D spatial modeling theory and methodologies, an object-oriented 3D integral spatial data model (OO3D-ISDM) is presented and software realized. The model integrates geographical objects, surface buildings and geological objects together seamlessly with TIN being its coupling interface. This paper introduced the conceptual model of OO3D-ISDM, which is comprised of 4 spatial elements, i.e. point, line, face and body, and 4 geometric primitives, i.e. vertex, segment, triangle and generalized tri-prism (GTP). The spatial model represents the geometry of surface buildings and geographical objects with triangles, and geological objects with GTP. Any of the represented objects, no mater surface buildings, terrain or subsurface objects, could be described with the basic geometry element, i.e. triangle. So the 3D spatial objects, surface buildings, terrain and geological objects can be

  8. On the Implementation of 3D Galerkin Boundary Integral Equations

    SciTech Connect

    Nintcheu Fata, Sylvain; Gray, Leonard J

    2010-01-01

    In this article, a reverse contribution technique is proposed to accelerate the construction of the dense influence matrices associated with a Galerkin approximation of singular and hypersingular boundary integral equations of mixed-type in potential theory. In addition, a general-purpose sparse preconditioner for boundary element methods has also been developed to successfully deal with ill-conditioned linear systems arising from the discretization of mixed boundary-value problems on non-smooth surfaces. The proposed preconditioner, which originates from the precorrected-FFT method, is sparse, easy to generate and apply in a Krylov subspace iterative solution of discretized boundary integral equations. Moreover, an approximate inverse of the preconditioner is implicitly built by employing an incomplete LU factorization. Numerical experiments involving mixed boundary-value problems for the Laplace equation are included to illustrate the performance and validity of the proposed techniques.

  9. Multiview image integration system for glassless 3D display

    NASA Astrophysics Data System (ADS)

    Ando, Takahisa; Mashitani, Ken; Higashino, Masahiro; Kanayama, Hideyuki; Murata, Haruhiko; Funazou, Yasuo; Sakamoto, Naohisa; Hazama, Hiroshi; Ebara, Yasuo; Koyamada, Koji

    2005-03-01

    We have developed a multi-view image integration system, which combines seven parallax video images into a single video image so that it fits the parallax barrier. The apertures of this barrier are not stripes but tiny rectangles that are arranged in the shape of stairs. Commodity hardware is used to satisfy a specification which requires that the resolution of each parallax video image is SXGA(1645×800 pixel resolution), the resulting integrated image is QUXGA-W(3840×2400 pixel resolution), and the frame rate is fifteen frames per second. The point is that the system can provide with QUXGA-W video image, which corresponds to 27MB, at 15fps, that is about 2Gbps. Using the integration system and a Liquid Crystal Display with the parallax barrier, we can enjoy an immersive live video image which supports seven viewpoints without special glasses. In addition, since the system can superimpose the CG images of the relevant seven viewpoints into the live video images, it is possible to communicate with remote users by sharing a virtual object.

  10. Thermionic integrated circuit program: Final report

    SciTech Connect

    Wilde, D.K.; Lynn, D.K.; Hamilton, D.

    1988-05-01

    This report describes the development of an operational amplifier using radiation hardened Thermionic Integrated Circuits (TICs). The report is written as a tutorial to cover all aspects of the fabrication process and circuit development as well as the process and circuit modifications required to meet the integration requirements of the operational amplifier. Recent experimental results are discussed in which both devices and test circuit data are compared to theoretical computer code predictions. The development of compatible high-temperature thin-film resistors is also presented. Because the project is being terminated prior to the completion of the amplifier, suggestions are made for additional advance development.

  11. Display of travelling 3D scenes from single integral-imaging capture

    NASA Astrophysics Data System (ADS)

    Martinez-Corral, Manuel; Dorado, Adrian; Hong, Seok-Min; Sola-Pikabea, Jorge; Saavedra, Genaro

    2016-06-01

    Integral imaging (InI) is a 3D auto-stereoscopic technique that captures and displays 3D images. We present a method for easily projecting the information recorded with this technique by transforming the integral image into a plenoptic image, as well as choosing, at will, the field of view (FOV) and the focused plane of the displayed plenoptic image. Furthermore, with this method we can generate a sequence of images that simulates a camera travelling through the scene from a single integral image. The application of this method permits to improve the quality of 3D display images and videos.

  12. Analog VLSI neural network integrated circuits

    NASA Technical Reports Server (NTRS)

    Kub, F. J.; Moon, K. K.; Just, E. A.

    1991-01-01

    Two analog very large scale integration (VLSI) vector matrix multiplier integrated circuit chips were designed, fabricated, and partially tested. They can perform both vector-matrix and matrix-matrix multiplication operations at high speeds. The 32 by 32 vector-matrix multiplier chip and the 128 by 64 vector-matrix multiplier chip were designed to perform 300 million and 3 billion multiplications per second, respectively. An additional circuit that has been developed is a continuous-time adaptive learning circuit. The performance achieved thus far for this circuit is an adaptivity of 28 dB at 300 KHz and 11 dB at 15 MHz. This circuit has demonstrated greater than two orders of magnitude higher frequency of operation than any previous adaptive learning circuit.

  13. Reverse engineering of integrated circuits

    DOEpatents

    Chisholm, Gregory H.; Eckmann, Steven T.; Lain, Christopher M.; Veroff, Robert L.

    2003-01-01

    Software and a method therein to analyze circuits. The software comprises several tools, each of which perform particular functions in the Reverse Engineering process. The analyst, through a standard interface, directs each tool to the portion of the task to which it is most well suited, rendering previously intractable problems solvable. The tools are generally used iteratively to produce a successively more abstract picture of a circuit, about which incomplete a priori knowledge exists.

  14. Integrated-Circuit Pseudorandom-Number Generator

    NASA Technical Reports Server (NTRS)

    Steelman, James E.; Beasley, Jeff; Aragon, Michael; Ramirez, Francisco; Summers, Kenneth L.; Knoebel, Arthur

    1992-01-01

    Integrated circuit produces 8-bit pseudorandom numbers from specified probability distribution, at rate of 10 MHz. Use of Boolean logic, circuit implements pseudorandom-number-generating algorithm. Circuit includes eight 12-bit pseudorandom-number generators, outputs are uniformly distributed. 8-bit pseudorandom numbers satisfying specified nonuniform probability distribution are generated by processing uniformly distributed outputs of eight 12-bit pseudorandom-number generators through "pipeline" of D flip-flops, comparators, and memories implementing conditional probabilities on zeros and ones.

  15. Experiment for Integrating Dutch 3d Spatial Planning and Bim for Checking Building Permits

    NASA Astrophysics Data System (ADS)

    van Berlo, L.; Dijkmans, T.; Stoter, J.

    2013-09-01

    This paper presents a research project in The Netherlands in which several SMEs collaborated to create a 3D model of the National spatial planning information. This 2D information system described in the IMRO data standard holds implicit 3D information that can be used to generate an explicit 3D model. The project realized a proof of concept to generate a 3D spatial planning model. The team used the model to integrate it with several 3D Building Information Models (BIMs) described in the open data standard Industry Foundation Classes (IFC). Goal of the project was (1) to generate a 3D BIM model from spatial planning information to be used by the architect during the early design phase, and (2) allow 3D checking of building permits. The team used several technologies like CityGML, BIM clash detection and GeoBIM to explore the potential of this innovation. Within the project a showcase was created with a part of the spatial plan from the city of The Hague. Several BIM models were integrated in the 3D spatial plan of this area. A workflow has been described that demonstrates the benefits of collaboration between the spatial domain and the AEC industry in 3D. The research results in a showcase with conclusions and considerations for both national and international practice.

  16. Reusable vibration resistant integrated circuit mounting socket

    DOEpatents

    Evans, Craig N.

    1995-01-01

    This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and holds it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuit lead can be removed from the socket without damage either to the lead or to the socket components.

  17. Robust Control of a Two-Qubit Operation in 3D Circuit Quantum Electrodynamics

    NASA Astrophysics Data System (ADS)

    Allen, Joseph; Kosut, Robert; Joo, Jaewoo; Ginossar, Eran

    Superconducting qubits have shown great improvement in coherence times with the introduction of 3D cavities. In order to control the qubits in 3D a microwave drive is usually coupled to the common mode of the cavity, which makes individual addressability a challenge and causes additional unwanted single and two-qubit dynamics when performing two qubit operations. Quantum information processing requires precise control of the system dynamics in the presence of potential uncertainties in the estimated system parameters. We use optimal control theory to develop pulse shapes that are able to implement an all-microwave two-qubit gate, while mitigating extra unwanted interaction terms, with  = 0 . 9964 . In addition we develop pulses which are robust to errors in the two qubit transition frequencies. This is demonstrated with experimentally relevant parameters and includes realistic constraints in the possible pulse shapes, presenting pulses that can be implemented in experiment.

  18. Scalable Fluidic Injector Arrays for Viral Targeting of Intact 3-D Brain Circuits

    PubMed Central

    Chan, Stephanie; Bernstein, Jacob; Boyden, Edward

    2010-01-01

    Our understanding of neural circuits--how they mediate the computations that subserve sensation, thought, emotion, and action, and how they are corrupted in neurological and psychiatric disorders--would be greatly facilitated by a technology for rapidly targeting genes to complex 3-dimensional neural circuits, enabling fast creation of "circuit-level transgenics." We have recently developed methods in which viruses encoding for light-sensitive proteins can sensitize specific cell types to millisecond-timescale activation and silencing in the intact brain. We here present the design and implementation of an injector array capable of delivering viruses (or other fluids) to dozens of defined points within the 3-dimensional structure of the brain (Figure. 1A, 1B). The injector array comprises one or more displacement pumps that each drive a set of syringes, each of which feeds into a polyimide/fused-silica capillary via a high-pressure-tolerant connector. The capillaries are sized, and then inserted into, desired locations specified by custom-milling a stereotactic positioning board, thus allowing viruses or other reagents to be delivered to the desired set of brain regions. To use the device, the surgeon first fills the fluidic subsystem entirely with oil, backfills the capillaries with the virus, inserts the device into the brain, and infuses reagents slowly (<0.1 microliters/min). The parallel nature of the injector array facilitates rapid, accurate, and robust labeling of entire neural circuits with viral payloads such as optical sensitizers to enable light-activation and silencing of defined brain circuits. Along with other technologies, such as optical fiber arrays for light delivery to desired sets of brain regions, we hope to create a toolbox that enables the systematic probing of causal neural functions in the intact brain. This technology may not only open up such systematic approaches to circuit-focused neuroscience in mammals, and facilitate labeling of

  19. Hybrid Integration of Graphene Analog and Silicon Complementary Metal-Oxide-Semiconductor Digital Circuits.

    PubMed

    Hong, Seul Ki; Kim, Choong Sun; Hwang, Wan Sik; Cho, Byung Jin

    2016-07-26

    We demonstrate a hybrid integration of a graphene-based analog circuit and a silicon-based digital circuit in order to exploit the strengths of both graphene and silicon devices. This mixed signal circuit integration was achieved using a three-dimensional (3-D) integration technique where a graphene FET multimode phase shifter is fabricated on top of a silicon complementary metal-oxide-semiconductor field-effect transistor (CMOS FET) ring oscillator. The process integration scheme presented here is compatible with the conventional silicon CMOS process, and thus the graphene circuit can successfully be integrated on current semiconductor technology platforms for various applications. This 3-D integration technique allows us to take advantage of graphene's excellent inherent properties and the maturity of current silicon CMOS technology for future electronics. PMID:27403730

  20. Chain Of Test Contacts For Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Lieneweg, Udo

    1989-01-01

    Test structure forms chain of "cross" contacts fabricated together with large-scale integrated circuits. If necessary, number of such chains incorporated at suitable locations in integrated-circuit wafer for determination of fabrication yield of contacts. In new structure, resistances of individual contacts determined: In addition to making it possible to identify local defects, enables generation of statistical distributions of contact resistances for prediction of "parametric" contact yield of fabrication process.

  1. Integrated Circuit Stellar Magnitude Simulator

    ERIC Educational Resources Information Center

    Blackburn, James A.

    1978-01-01

    Describes an electronic circuit which can be used to demonstrate the stellar magnitude scale. Six rectangular light-emitting diodes with independently adjustable duty cycles represent stars of magnitudes 1 through 6. Experimentally verifies the logarithmic response of the eye. (Author/GA)

  2. Integration of Jeddah Historical BIM and 3D GIS for Documentation and Restoration of Historical Monument

    NASA Astrophysics Data System (ADS)

    Baik, A.; Yaagoubi, R.; Boehm, J.

    2015-08-01

    This work outlines a new approach for the integration of 3D Building Information Modelling and the 3D Geographic Information System (GIS) to provide semantically rich models, and to get the benefits from both systems to help document and analyse cultural heritage sites. Our proposed framework is based on the Jeddah Historical Building Information Modelling process (JHBIM). This JHBIM consists of a Hijazi Architectural Objects Library (HAOL) that supports higher level of details (LoD) while decreasing the time of modelling. The Hijazi Architectural Objects Library has been modelled based on the Islamic historical manuscripts and Hijazi architectural pattern books. Moreover, the HAOL is implemented using BIM software called Autodesk Revit. However, it is known that this BIM environment still has some limitations with the non-standard architectural objects. Hence, we propose to integrate the developed 3D JHBIM with 3D GIS for more advanced analysis. To do so, the JHBIM database is exported and semantically enriched with non-architectural information that is necessary for restoration and preservation of historical monuments. After that, this database is integrated with the 3D Model in the 3D GIS solution. At the end of this paper, we'll illustrate our proposed framework by applying it to a Historical Building called Nasif Historical House in Jeddah. First of all, this building is scanned by the use of a Terrestrial Laser Scanner (TLS) and Close Range Photogrammetry. Then, the 3D JHBIM based on the HOAL is designed on Revit Platform. Finally, this model is integrated to a 3D GIS solution through Autodesk InfraWorks. The shown analysis presented in this research highlights the importance of such integration especially for operational decisions and sharing the historical knowledge about Jeddah Historical City. Furthermore, one of the historical buildings in Old Jeddah, Nasif Historical House, was chosen as a test case for the project.

  3. A simple method for producing freestanding 3D microstructures by integrated photomask micromolding

    NASA Astrophysics Data System (ADS)

    Li, Hui

    2015-12-01

    Freestanding three-dimensional (3D) microstructures are widely used in micro-electro-mechanical system (MEMS) applications or can function as microdevices themselves. However, microfabrication methods for freestanding 3D microstructures have limitations in shape, size, cost, and mass production, etc. In this work, integrated photomask micromolding is demonstrated, which uses a portable UV light source and chrome glass micromolding to fabricate 3D microstructures without alignment. Specifically, a chrome layer on one side of the glass micromold shields the excess filling SU-8 photoresist from UV exposure and only the SU-8 photoresist in mold cavities is crosslinked. The 3D microstructures produced using this method have very high dimensional accuracy and the profile error is approximately 1.5%. This method can be used with features of virtually any size and shape and can be integrated into highly-parallel micromolding processes and has potential for MEMS applications.

  4. A 3-D RBF-FD elliptic solver for irregular boundaries: modeling the atmospheric global electric circuit with topography

    NASA Astrophysics Data System (ADS)

    Bayona, V.; Flyer, N.; Lucas, G. M.; Baumgaertner, A. J. G.

    2015-04-01

    A numerical model based on Radial Basis Function-generated Finite Differences (RBF-FD) is developed for simulating the Global Electric Circuit (GEC) within the Earth's atmosphere, represented by a 3-D variable coefficient linear elliptic PDE in a spherically-shaped volume with the lower boundary being the Earth's topography and the upper boundary a sphere at 60 km. To our knowledge, this is (1) the first numerical model of the GEC to combine the Earth's topography with directly approximating the differential operators in 3-D space, and related to this (2) the first RBF-FD method to use irregular 3-D stencils for discretization to handle the topography. It benefits from the mesh-free nature of RBF-FD, which is especially suitable for modeling high-dimensional problems with irregular boundaries. The RBF-FD elliptic solver proposed here makes no limiting assumptions on the spatial variability of the coefficients in the PDE (i.e. the conductivity profile), the right hand side forcing term of the PDE (i.e. distribution of current sources) or the geometry of the lower boundary.

  5. The analysis of a novel 3-D autonomous system and circuit implementation

    NASA Astrophysics Data System (ADS)

    Dong, Gaogao; Zheng, Song; Tian, Lixin; Du, Ruijin; Sun, Mei; Shi, Zhiyan

    2009-11-01

    This Letter presents a new three-dimensional autonomous system with four quadratic terms. The system with five equilibrium points has complex chaotic dynamics behaviors. It can generate many different single chaotic attractors and double coexisting chaotic attractors over a large range of parameters. We observe that these chaotic attractors were rarely reported in previous work. The complex dynamical behaviors of the system are further investigated by means of phase portraits, Lyapunov exponents spectrum, Lyapunov dimension, dissipativeness of system, bifurcation diagram and Poincaré map. The physical circuit experimental results of the chaotic attractors show agreement with numerical simulations. More importantly, the analysis of frequency spectrum shows that the novel system has a broad frequency bandwidth, which is very desirable for engineering applications such as secure communications.

  6. On the integrability of the motion of 3D-Swinging Atwood machine and related problems

    NASA Astrophysics Data System (ADS)

    Elmandouh, A. A.

    2016-03-01

    In the present article, we study the problem of the motion of 3D- Swinging Atwood machine. A new integrable case for this problem is announced. We point out a new integrable case describing the motion of a heavy particle on a titled cone.

  7. Progress in organic integrated circuit manufacture

    NASA Astrophysics Data System (ADS)

    Taylor, D. Martin

    2016-02-01

    This review article focuses on the development of processes for the manufacture of organic electronic circuits. Beginning with the first report of an organic transistor it highlights the key developments leading to the successful manufacture of microprocessors and other complex circuits incorporating organic transistors. Both batch processing (based on silicon integrated circuit technology) as well as mass-printing, roll-to-roll (R2R) approaches are discussed. Currently, the best circuit performances are achieved using batch processing. It is suggested that an emerging, large mass-market for electronic tags may dictate that R2R manufacture will likely be required to meet the high throughput rates needed. However, significant improvements in resolution and registration are necessary to achieve increased circuit operating speeds.

  8. Polysilicon photoconductor for integrated circuits

    DOEpatents

    Hammond, Robert B.; Bowman, Douglas R.

    1989-01-01

    A photoconductive element of polycrystalline silicon is provided with intrinsic response time which does not limit overall circuit response. An undoped polycrystalline silicon layer is deposited by LPCVD to a selected thickness on silicon dioxide. The deposited polycrystalline silicon is then annealed at a selected temperature and for a time effective to obtain crystal sizes effective to produce an enhanced current output. The annealed polycrystalline layer is subsequently exposed and damaged by ion implantation to a damage factor effective to obtain a fast photoconductive response.

  9. Polysilicon photoconductor for integrated circuits

    DOEpatents

    Hammond, Robert B.; Bowman, Douglas R.

    1990-01-01

    A photoconductive element of polycrystalline silicon is provided with intrinsic response time which does not limit overall circuit response. An undoped polycrystalline silicon layer is deposited by LPCVD to a selected thickness on silicon dioxide. The deposited polycrystalline silicon is then annealed at a selected temperature and for a time effective to obtain crystal sizes effective to produce an enhanced current output. The annealed polycrystalline layer is subsequently exposed and damaged by ion implantation to a damage factor effective to obtain a fast photoconductive response.

  10. Polysilicon photoconductor for integrated circuits

    DOEpatents

    Hammond, R.B.; Bowman, D.R.

    1989-04-11

    A photoconductive element of polycrystalline silicon is provided with intrinsic response time which does not limit overall circuit response. An undoped polycrystalline silicon layer is deposited by LPCVD to a selected thickness on silicon dioxide. The deposited polycrystalline silicon is then annealed at a selected temperature and for a time effective to obtain crystal sizes effective to produce an enhanced current output. The annealed polycrystalline layer is subsequently exposed and damaged by ion implantation to a damage factor effective to obtain a fast photoconductive response. 6 figs.

  11. Substrate optimization for integrated circuit antennas

    NASA Astrophysics Data System (ADS)

    Alexopoulos, N. G.; Katehi, P. B.; Rutledge, D. B.

    1983-07-01

    The reciprocity theorem and integral equation techniques are employed to determine the properties of integrated-circuit antennas. The effect of surface waves is considered for dipole and slot elements on substrates. The radiation and bandwidth of microstrip dipoles are optimized in terms of substrate thickness and permittivity.

  12. Electronic circuits and systems: A compilation. [including integrated circuits, logic circuits, varactor diode circuits, low pass filters, and optical equipment circuits

    NASA Technical Reports Server (NTRS)

    1975-01-01

    Technological information is presented electronic circuits and systems which have potential utility outside the aerospace community. Topics discussed include circuit components such as filters, converters, and integrators, circuits designed for use with specific equipment or systems, and circuits designed primarily for use with optical equipment or displays.

  13. Displacement Damage in Bipolar Linear Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Rax, B. G.; Johnston, A. H.; Miyahira, T.

    2000-01-01

    Although many different processes can be used to manufacture linear integrated circuits, the process that is used for most circuits is optimized for high voltage -- a total power supply voltage of about 40 V -- and low cost. This process, which has changed little during the last twenty years, uses lateral and substrate p-n-p transistors. These p-n-p transistors have very wide base regions, increasing their sensitivity to displacement damage from electrons and protons. Although displacement damage effects can be easily treated for individual transistors, the net effect on linear circuits can be far more complex because circuit operation often depends on the interaction of several internal transistors. Note also that some circuits are made with more advanced processes with much narrower base widths. Devices fabricated with these newer processes are not expected to be significantly affected by displacement damage for proton fluences below 1 x 10(exp 12) p/sq cm. This paper discusses displacement damage in linear integrated circuits with more complex failure modes than those exhibited by simpler devices, such as the LM111 comparator, where the dominant response mode is gain degradation of the input transistor. Some circuits fail catastrophically at much lower equivalent total dose levels compared to tests with gamma rays. The device works satisfactorily up to nearly 1 Mrad(Si) when it is irradiated with gamma rays, but fails catastrophically between 50 and 70 krad(Si) when it is irradiated with protons.

  14. Solution methods for very highly integrated circuits.

    SciTech Connect

    Nong, Ryan; Thornquist, Heidi K.; Chen, Yao; Mei, Ting; Santarelli, Keith R.; Tuminaro, Raymond Stephen

    2010-12-01

    While advances in manufacturing enable the fabrication of integrated circuits containing tens-to-hundreds of millions of devices, the time-sensitive modeling and simulation necessary to design these circuits poses a significant computational challenge. This is especially true for mixed-signal integrated circuits where detailed performance analyses are necessary for the individual analog/digital circuit components as well as the full system. When the integrated circuit has millions of devices, performing a full system simulation is practically infeasible using currently available Electrical Design Automation (EDA) tools. The principal reason for this is the time required for the nonlinear solver to compute the solutions of large linearized systems during the simulation of these circuits. The research presented in this report aims to address the computational difficulties introduced by these large linearized systems by using Model Order Reduction (MOR) to (i) generate specialized preconditioners that accelerate the computation of the linear system solution and (ii) reduce the overall dynamical system size. MOR techniques attempt to produce macromodels that capture the desired input-output behavior of larger dynamical systems and enable substantial speedups in simulation time. Several MOR techniques that have been developed under the LDRD on 'Solution Methods for Very Highly Integrated Circuits' will be presented in this report. Among those presented are techniques for linear time-invariant dynamical systems that either extend current approaches or improve the time-domain performance of the reduced model using novel error bounds and a new approach for linear time-varying dynamical systems that guarantees dimension reduction, which has not been proven before. Progress on preconditioning power grid systems using multi-grid techniques will be presented as well as a framework for delivering MOR techniques to the user community using Trilinos and the Xyce circuit simulator

  15. Design methodologies for silicon photonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Chrostowski, Lukas; Flueckiger, Jonas; Lin, Charlie; Hochberg, Michael; Pond, James; Klein, Jackson; Ferguson, John; Cone, Chris

    2014-03-01

    This paper describes design methodologies developed for silicon photonics integrated circuits. The approach presented is inspired by methods employed in the Electronics Design Automation (EDA) community. This is complemented by well established photonic component design tools, compact model synthesis, and optical circuit modelling. A generic silicon photonics design kit, as described here, is available for download at http://www.siepic.ubc.ca/GSiP.

  16. Learning from graphically integrated 2D and 3D representations improves retention of neuroanatomy

    NASA Astrophysics Data System (ADS)

    Naaz, Farah

    Visualizations in the form of computer-based learning environments are highly encouraged in science education, especially for teaching spatial material. Some spatial material, such as sectional neuroanatomy, is very challenging to learn. It involves learning the two dimensional (2D) representations that are sampled from the three dimensional (3D) object. In this study, a computer-based learning environment was used to explore the hypothesis that learning sectional neuroanatomy from a graphically integrated 2D and 3D representation will lead to better learning outcomes than learning from a sequential presentation. The integrated representation explicitly demonstrates the 2D-3D transformation and should lead to effective learning. This study was conducted using a computer graphical model of the human brain. There were two learning groups: Whole then Sections, and Integrated 2D3D. Both groups learned whole anatomy (3D neuroanatomy) before learning sectional anatomy (2D neuroanatomy). The Whole then Sections group then learned sectional anatomy using 2D representations only. The Integrated 2D3D group learned sectional anatomy from a graphically integrated 3D and 2D model. A set of tests for generalization of knowledge to interpreting biomedical images was conducted immediately after learning was completed. The order of presentation of the tests of generalization of knowledge was counterbalanced across participants to explore a secondary hypothesis of the study: preparation for future learning. If the computer-based instruction programs used in this study are effective tools for teaching anatomy, the participants should continue learning neuroanatomy with exposure to new representations. A test of long-term retention of sectional anatomy was conducted 4-8 weeks after learning was completed. The Integrated 2D3D group was better than the Whole then Sections

  17. Developement of 3D Vertically Integrated Pattern Recognition Associative Memory (VIPRAM)

    SciTech Connect

    Deputch, G.; Hoff, J.; Lipton, R.; Liu, T.; Olsen, J.; Ramberg, E.; Wu, Jin-Yuan; Yarema, R.; Shochet, M.; Tang, F.; Demarteau, M.; /Argonne /INFN, Padova

    2011-04-13

    for a track trigger, requiring about three orders of magnitude more associative memory patterns than what was used in the original CDF SVT. Significant improvement in the architecture of associative memory structures is needed to run fast pattern recognition algorithms of this scale. We are proposing the development of 3D integrated circuit technology as a way to implement new associative memory structures for fast pattern recognition applications. Adding a 'third' dimension to the signal processing chain, as compared to the two-dimensional nature of printed circuit boards, Field Programmable Gate Arrays (FPGAs), etc., opens up the possibility for new architectures that could dramatically enhance pattern recognition capability. We are currently performing preliminary design work to demonstrate the feasibility of this approach. In this proposal, we seek to develop the design and perform the ASIC engineering necessary to realize a prototype device. While our focus here is on the Energy Frontier (e.g. the LHC), the approach may have applications in experiments in the Intensity Frontier and the Cosmic Frontier as well as other scientific and medical projects. In fact, the technique that we are proposing is very generic and could have wide applications far beyond track trigger, both within and outside HEP.

  18. Comparative study on 3D-2D convertible integral imaging systems

    NASA Astrophysics Data System (ADS)

    Choi, Heejin; Kim, Joohwan; Kim, Yunhee; Lee, Byoungho

    2006-02-01

    In spite of significant improvements in three-dimensional (3D) display fields, the commercialization of a 3D-only display system is not achieved yet. The mainstream of display market is a high performance two-dimensional (2D) flat panel display (FPD) and the beginning of the high-definition (HD) broadcasting accelerates the opening of the golden age of HD FPDs. Therefore, a 3D display system needs to be able to display a 2D image with high quality. In this paper, two different 3D-2D convertible methods based on integral imaging are compared and categorized for its applications. One method uses a point light source array and a polymer-dispersed liquid crystal and one display panel. The other system adopts two display panels and a lens array. The former system is suitable for mobile applications while the latter is for home applications such as monitors and TVs.

  19. Initiator-integrated 3D printing enables the formation of complex metallic architectures.

    PubMed

    Wang, Xiaolong; Guo, Qiuquan; Cai, Xiaobing; Zhou, Shaolin; Kobe, Brad; Yang, Jun

    2014-02-26

    Three-dimensional printing was used to fabricate various metallic structures by directly integrating a Br-containing vinyl-terminated initiator into the 3D resin followed by surface-initiated atomic-transfer radical polymerization (ATRP) and subsequent electroless plating. Cu- and Ni-coated complex structures, such as microlattices, hollow balls, and even Eiffel towers, were prepared. Moreover, the method is also capable of fabricating ultralight cellular metals with desired structures by simply etching the polymer template away. By combining the merits of 3D printing in structure design with those of ATRP in surface modification and polymer-assisted ELP of metals, this universal, robust, and cost-effective approach has largely extended the capability of 3D printing and will make 3D printing technology more practical in areas of electronics, acoustic absorption, thermal insulation, catalyst supports, and others. PMID:24328276

  20. Strategies for Effectively Visualizing a 3D Flow Using Volume Line Integral Convolution

    NASA Technical Reports Server (NTRS)

    Interrante, Victoria; Grosch, Chester

    1997-01-01

    This paper discusses strategies for effectively portraying 3D flow using volume line integral convolution. Issues include defining an appropriate input texture, clarifying the distinct identities and relative depths of the advected texture elements, and selectively highlighting regions of interest in both the input and output volumes. Apart from offering insights into the greater potential of 3D LIC as a method for effectively representing flow in a volume, a principal contribution of this work is the suggestion of a technique for generating and rendering 3D visibility-impeding 'halos' that can help to intuitively indicate the presence of depth discontinuities between contiguous elements in a projection and thereby clarify the 3D spatial organization of elements in the flow. The proposed techniques are applied to the visualization of a hot, supersonic, laminar jet exiting into a colder, subsonic coflow.

  1. Package for integrated optic circuit and method

    DOEpatents

    Kravitz, S.H.; Hadley, G.R.; Warren, M.E.; Carson, R.F.; Armendariz, M.G.

    1998-08-04

    A structure and method are disclosed for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package. 6 figs.

  2. Package for integrated optic circuit and method

    DOEpatents

    Kravitz, Stanley H.; Hadley, G. Ronald; Warren, Mial E.; Carson, Richard F.; Armendariz, Marcelino G.

    1998-01-01

    A structure and method for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package.

  3. Laboratory experiments in integrated circuit fabrication

    NASA Astrophysics Data System (ADS)

    Jenkins, Thomas J.; Kolesar, Edward S.

    1993-06-01

    The objectives of the experiment are fourfold: to provide practical experience implementing the fundamental processes and technology associated with the science and art of integrated circuit (IC) fabrication; to afford the opportunity for the student to apply the theory associated with IC fabrication and semiconductor device operation; to motivate the student to exercise engineering decisions associated with fabricating integrated circuits; and to complement the theory of n-channel MOS and diffused devices that are presented in the classroom by actually fabricating and testing them. Therefore, a balance between theory and practice can be realized in the education of young engineers, whose education is often criticized as lacking sufficient design and practical content.

  4. Laboratory experiments in integrated circuit fabrication

    NASA Technical Reports Server (NTRS)

    Jenkins, Thomas J.; Kolesar, Edward S.

    1993-01-01

    The objectives of the experiment are fourfold: to provide practical experience implementing the fundamental processes and technology associated with the science and art of integrated circuit (IC) fabrication; to afford the opportunity for the student to apply the theory associated with IC fabrication and semiconductor device operation; to motivate the student to exercise engineering decisions associated with fabricating integrated circuits; and to complement the theory of n-channel MOS and diffused devices that are presented in the classroom by actually fabricating and testing them. Therefore, a balance between theory and practice can be realized in the education of young engineers, whose education is often criticized as lacking sufficient design and practical content.

  5. Test Structures For Bumpy Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Buehler, Martin G.; Sayah, Hoshyar R.

    1989-01-01

    Cross-bridge resistors added to comb and serpentine patterns. Improved combination of test structures built into integrated circuit used to evaluate design rules, fabrication processes, and quality of interconnections. Consist of meshing serpentines and combs, and cross bridge. Structures used to make electrical measurements revealing defects in design or fabrication. Combination of test structures includes three comb arrays, two serpentine arrays, and cross bridge. Made of aluminum or polycrystalline silicon, depending on material in integrated-circuit layers evaluated. Aluminum combs and serpentine arrays deposited over steps made by polycrystalline silicon and diffusion layers, while polycrystalline silicon versions of these structures used to cross over steps made by thick oxide layer.

  6. Millimeter And Submillimeter-Wave Integrated Circuits On Quartz

    NASA Technical Reports Server (NTRS)

    Mehdi, Imran; Mazed, Mohammad; Siegel, Peter; Smith, R. Peter

    1995-01-01

    Proposed Quartz substrate Upside-down Integrated Device (QUID) relies on UV-curable adhesive to bond semiconductor with quartz. Integrated circuits including planar GaAs Schottky diodes and passive circuit elements (such as bandpass filters) fabricated on quartz substrates. Circuits designed to operate as mixers in waveguide circuit at millimeter and submillimeter wavelengths. Integrated circuits mechanically more robust, larger, and easier to handle than planar Schottky diode chips. Quartz substrate more suitable for waveguide circuits than GaAs substrate.

  7. Microwave integrated circuits for space applications

    NASA Technical Reports Server (NTRS)

    Leonard, Regis F.; Romanofsky, Robert R.

    1991-01-01

    Monolithic microwave integrated circuits (MMIC), which incorporate all the elements of a microwave circuit on a single semiconductor substrate, offer the potential for drastic reductions in circuit weight and volume and increased reliability, all of which make many new concepts in electronic circuitry for space applications feasible, including phased array antennas. NASA has undertaken an extensive program aimed at development of MMICs for space applications. The first such circuits targeted for development were an extension of work in hybrid (discrete component) technology in support of the Advanced Communication Technology Satellite (ACTS). It focused on power amplifiers, receivers, and switches at ACTS frequencies. More recent work, however, focused on frequencies appropriate for other NASA programs and emphasizes advanced materials in an effort to enhance efficiency, power handling capability, and frequency of operation or noise figure to meet the requirements of space systems.

  8. 3D Printed Microfluidic Device with Integrated Biosensors for Online Analysis of Subcutaneous Human Microdialysate

    PubMed Central

    2015-01-01

    This work presents the design, fabrication, and characterization of a robust 3D printed microfluidic analysis system that integrates with FDA-approved clinical microdialysis probes for continuous monitoring of human tissue metabolite levels. The microfluidic device incorporates removable needle type integrated biosensors for glucose and lactate, which are optimized for high tissue concentrations, housed in novel 3D printed electrode holders. A soft compressible 3D printed elastomer at the base of the holder ensures a good seal with the microfluidic chip. Optimization of the channel size significantly improves the response time of the sensor. As a proof-of-concept study, our microfluidic device was coupled to lab-built wireless potentiostats and used to monitor real-time subcutaneous glucose and lactate levels in cyclists undergoing a training regime. PMID:26070023

  9. 3D Printed Microfluidic Device with Integrated Biosensors for Online Analysis of Subcutaneous Human Microdialysate.

    PubMed

    Gowers, Sally A N; Curto, Vincenzo F; Seneci, Carlo A; Wang, Chu; Anastasova, Salzitsa; Vadgama, Pankaj; Yang, Guang-Zhong; Boutelle, Martyn G

    2015-08-01

    This work presents the design, fabrication, and characterization of a robust 3D printed microfluidic analysis system that integrates with FDA-approved clinical microdialysis probes for continuous monitoring of human tissue metabolite levels. The microfluidic device incorporates removable needle type integrated biosensors for glucose and lactate, which are optimized for high tissue concentrations, housed in novel 3D printed electrode holders. A soft compressible 3D printed elastomer at the base of the holder ensures a good seal with the microfluidic chip. Optimization of the channel size significantly improves the response time of the sensor. As a proof-of-concept study, our microfluidic device was coupled to lab-built wireless potentiostats and used to monitor real-time subcutaneous glucose and lactate levels in cyclists undergoing a training regime. PMID:26070023

  10. Microwave integrated circuit for Josephson voltage standards

    NASA Technical Reports Server (NTRS)

    Holdeman, L. B.; Toots, J.; Chang, C. C. (Inventor)

    1980-01-01

    A microwave integrated circuit comprised of one or more Josephson junctions and short sections of microstrip or stripline transmission line is fabricated from thin layers of superconducting metal on a dielectric substrate. The short sections of transmission are combined to form the elements of the circuit and particularly, two microwave resonators. The Josephson junctions are located between the resonators and the impedance of the Josephson junctions forms part of the circuitry that couples the two resonators. The microwave integrated circuit has an application in Josephson voltage standards. In this application, the device is asymmetrically driven at a selected frequency (approximately equal to the resonance frequency of the resonators), and a d.c. bias is applied to the junction. By observing the current voltage characteristic of the junction, a precise voltage, proportional to the frequency of the microwave drive signal, is obtained.

  11. Flatbed-type 3D display systems using integral imaging method

    NASA Astrophysics Data System (ADS)

    Hirayama, Yuzo; Nagatani, Hiroyuki; Saishu, Tatsuo; Fukushima, Rieko; Taira, Kazuki

    2006-10-01

    We have developed prototypes of flatbed-type autostereoscopic display systems using one-dimensional integral imaging method. The integral imaging system reproduces light beams similar of those produced by a real object. Our display architecture is suitable for flatbed configurations because it has a large margin for viewing distance and angle and has continuous motion parallax. We have applied our technology to 15.4-inch displays. We realized horizontal resolution of 480 with 12 parallaxes due to adoption of mosaic pixel arrangement of the display panel. It allows viewers to see high quality autostereoscopic images. Viewing the display from angle allows the viewer to experience 3-D images that stand out several centimeters from the surface of the display. Mixed reality of virtual 3-D objects and real objects are also realized on a flatbed display. In seeking reproduction of natural 3-D images on the flatbed display, we developed proprietary software. The fast playback of the CG movie contents and real-time interaction are realized with the aid of a graphics card. Realization of the safety 3-D images to the human beings is very important. Therefore, we have measured the effects on the visual function and evaluated the biological effects. For example, the accommodation and convergence were measured at the same time. The various biological effects are also measured before and after the task of watching 3-D images. We have found that our displays show better results than those to a conventional stereoscopic display. The new technology opens up new areas of application for 3-D displays, including arcade games, e-learning, simulations of buildings and landscapes, and even 3-D menus in restaurants.

  12. Double depth-enhanced 3D integral imaging in projection-type system without diffuser

    NASA Astrophysics Data System (ADS)

    Zhang, Lei; Jiao, Xiao-xue; Sun, Yu; Xie, Yan; Liu, Shao-peng

    2015-05-01

    Integral imaging is a three dimensional (3D) display technology without any additional equipment. A new system is proposed in this paper which consists of the elemental images of real images in real mode (RIRM) and the ones of virtual images in real mode (VIRM). The real images in real mode are the same as the conventional integral images. The virtual images in real mode are obtained by changing the coordinates of the corresponding points in elemental images which can be reconstructed by the lens array in virtual space. In order to reduce the spot size of the reconstructed images, the diffuser in conventional integral imaging is given up in the proposed method. Then the spot size is nearly 1/20 of that in the conventional system. And an optical integral imaging system is constructed to confirm that our proposed method opens a new way for the application of the passive 3D display technology.

  13. Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits.

    PubMed

    Nam, SungWoo; Jiang, Xiaocheng; Xiong, Qihua; Ham, Donhee; Lieber, Charles M

    2009-12-15

    Three-dimensional (3D), multi-transistor-layer, integrated circuits represent an important technological pursuit promising advantages in integration density, operation speed, and power consumption compared with 2D circuits. We report fully functional, 3D integrated complementary metal-oxide-semiconductor (CMOS) circuits based on separate interconnected layers of high-mobility n-type indium arsenide (n-InAs) and p-type germanium/silicon core/shell (p-Ge/Si) nanowire (NW) field-effect transistors (FETs). The DC voltage output (V(out)) versus input (V(in)) response of vertically interconnected CMOS inverters showed sharp switching at close to the ideal value of one-half the supply voltage and, moreover, exhibited substantial DC gain of approximately 45. The gain and the rail-to-rail output switching are consistent with the large noise margin and minimal static power consumption of CMOS. Vertically interconnected, three-stage CMOS ring oscillators were also fabricated by using layer-1 InAs NW n-FETs and layer-2 Ge/Si NW p-FETs. Significantly, measurements of these circuits demonstrated stable, self-sustained oscillations with a maximum frequency of 108 MHz, which represents the highest-frequency integrated circuit based on chemically synthesized nanoscale materials. These results highlight the flexibility of bottom-up assembly of distinct nanoscale materials and suggest substantial promise for 3D integrated circuits. PMID:19940239

  14. Bioluminescent bioreporter integrated circuit detection methods

    DOEpatents

    Simpson, Michael L.; Paulus, Michael J.; Sayler, Gary S.; Applegate, Bruce M.; Ripp, Steven A.

    2005-06-14

    Disclosed are monolithic bioelectronic devices comprising a bioreporter and an OASIC. These bioluminescent bioreporter integrated circuit are useful in detecting substances such as pollutants, explosives, and heavy-metals residing in inhospitable areas such as groundwater, industrial process vessels, and battlefields. Also disclosed are methods and apparatus for detection of particular analytes, including ammonia and estrogen compounds.

  15. Designing Test Chips for Custom Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Buehler, M. G.; Griswold, T. W.; Pina, C. A.; Timoc, C. C.

    1985-01-01

    Collection of design and testing procedures partly automates development of built-in test chips for CMOS integrated circuits. Testchip methodology intended especially for users of custom integratedcircuit wafers. Test-Chip Designs and Testing Procedures (including datareduction procedures) generated automatically by computer from programed design and testing rules and from information supplied by user.

  16. Optoelectronic Integrated Circuits For Neural Networks

    NASA Technical Reports Server (NTRS)

    Psaltis, D.; Katz, J.; Kim, Jae-Hoon; Lin, S. H.; Nouhi, A.

    1990-01-01

    Many threshold devices placed on single substrate. Integrated circuits containing optoelectronic threshold elements developed for use as planar arrays of artificial neurons in research on neural-network computers. Mounted with volume holograms recorded in photorefractive crystals serving as dense arrays of variable interconnections between neurons.

  17. Integrated Circuits in the Introductory Electronics Laboratory

    ERIC Educational Resources Information Center

    English, Thomas C.; Lind, David A.

    1973-01-01

    Discusses the use of an integrated circuit operational amplifier in an introductory electronics laboratory course for undergraduate science majors. The advantages of this approach and the implications for scientific instrumentation are identified. Describes a number of experiments suitable for the undergraduate laboratory. (Author/DF)

  18. Optical coupling to monolithic integrated photonic circuits

    NASA Astrophysics Data System (ADS)

    Palen, Edward

    2007-02-01

    Methods of coupling optical fiber and light sources to monolithic integrated photonic circuits are needed to expand future photonics communications markets. Requirements are low cost, high coupling efficiencies, and scalability to high volume production rates. Key features of the different optical coupling options will be discussed along with implementation examples. Requirements for low cost optical coupling and high volume production scalability will be shared.

  19. Guidelines for SEU-Resistant Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Nichols, D. K.

    1986-01-01

    Paper presents recent results of continuing program for increasing resistance of integrated circuits to single-event upset (SEU). Results based on study of test data for heavy-ion SEU in more than 180 different types of devices. (Some devices perform identical functions but made by different processes.) Program also examines developments in mathematical models for SEU.

  20. Healing Voids In Interconnections In Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Cuddihy, Edward F.; Lawton, Russell A.; Gavin, Thomas

    1989-01-01

    Unusual heat treatment heals voids in aluminum interconnections on integrated circuits (IC's). Treatment consists of heating IC to temperature between 200 degrees C and 400 degrees C, holding it at that temperature, and then plunging IC immediately into liquid nitrogen. Typical holding time at evaluated temperature is 30 minutes.

  1. Integrated Circuit Failure Analysis Hypertext Help System

    1995-02-23

    This software assists a failure analyst performing failure analysis on integrated circuits. The software can also be used to train inexperienced failure analysts. The software also provides a method for storing information and making it easily available to experienced failure analysts.

  2. Package Holds Five Monolithic Microwave Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Mysoor, Narayan R.; Decker, D. Richard; Olson, Hilding M.

    1996-01-01

    Packages protect and hold monolithic microwave integrated circuit (MMIC) chips while providing dc and radio-frequency (RF) electrical connections for chips undergoing development. Required to be compact, lightweight, and rugged. Designed to minimize undesired resonances, reflections, losses, and impedance mismatches.

  3. Modeling "Soft" Errors in Bipolar Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Zoutendyk, J.; Benumof, R.; Vonroos, O.

    1985-01-01

    Mathematical models represent single-event upset in bipolar memory chips. Physics of single-event upset in integrated circuits discussed in theoretical paper. Pair of companion reports present mathematical models to predict critical charges for producing single-event upset in bipolar randomaccess memory (RAM) chips.

  4. All-ion-implantation process for integrated circuits

    NASA Technical Reports Server (NTRS)

    Woo, D. S.

    1979-01-01

    Simpler than diffusion fabrication, ion bombardment produces complementary-metal-oxide-semiconductor / silicon-on-sapphire (CMOS/SOS) circuits that are one-third faster. Ion implantation simplifies the integrated circuit fabrication procedure and produces circuits with uniform characteristics.

  5. Micromorph silicon tandem solar cells with fully integrated 3D photonic crystal intermediate reflectors

    NASA Astrophysics Data System (ADS)

    Üpping, J.; Bielawny, A.; Fahr, S.; Rockstuhl, C.; Lederer, F.; Steidl, L.; Zentel, R.; Beckers, T.; Lambertz, A.; Carius, R.; Wehrspohn, R. B.

    2010-05-01

    A 3D photonic intermediate reflector for textured micromorph silicon tandem solar cells has been investigated. In thin-film silicon tandem solar cells consisting of amorphous and microcrystalline silicon with two junctions of a-Si/c-Si, efficiency enhancements can be achieved by increasing the current density in the a-Si top cell providing an optimized current matching at high current densities. For an ideal photon-management between top and bottom cell, a spectrally-selective intermediate reflective layer (IRL) is necessary. We present the first fully-integrated 3D photonic thin-film IRL device incorporated on a planar substrate. Using a ZnO inverted opal structure the external quantum efficiency of the top cell in the spectral region of interest could be enhanced. As an outlook we present the design and the preparation of a 3D self organized photonic crystal structure in a textured micromorph tandem solar cell.

  6. Three-Dimensional Integrated Characterization and Archiving System (3D-ICAS). Phase 1

    SciTech Connect

    1994-07-01

    3D-ICAS is being developed to support Decontamination and Decommissioning operations for DOE addressing Research Area 6 (characterization) of the Program Research and Development Announcement. 3D-ICAS provides in-situ 3-dimensional characterization of contaminated DOE facilities. Its multisensor probe contains a GC/MS (gas chromatography/mass spectrometry using noncontact infrared heating) sensor for organics, a molecular vibrational sensor for base material identification, and a radionuclide sensor for radioactive contaminants. It will provide real-time quantitative measurements of volatile organics and radionuclides on bare materials (concrete, asbestos, transite); it will provide 3-D display of the fusion of all measurements; and it will archive the measurements for regulatory documentation. It consists of two robotic mobile platforms that operate in hazardous environments linked to an integrated workstation in a safe environment.

  7. 3D Navigation and Integrated Hazard Display in Advanced Avionics: Workload, Performance, and Situation Awareness

    NASA Technical Reports Server (NTRS)

    Wickens, Christopher D.; Alexander, Amy L.

    2004-01-01

    We examined the ability for pilots to estimate traffic location in an Integrated Hazard Display, and how such estimations should be measured. Twelve pilots viewed static images of traffic scenarios and then estimated the outside world locations of queried traffic represented in one of three display types (2D coplanar, 3D exocentric, and split-screen) and in one of four conditions (display present/blank crossed with outside world present/blank). Overall, the 2D coplanar display best supported both vertical (compared to 3D) and lateral (compared to split-screen) traffic position estimation performance. Costs of the 3D display were associated with perceptual ambiguity. Costs of the split screen display were inferred to result from inappropriate attention allocation. Furthermore, although pilots were faster in estimating traffic locations when relying on memory, accuracy was greatest when the display was available.

  8. Integrated-Circuit Active Digital Filter

    NASA Technical Reports Server (NTRS)

    Nathan, R.

    1986-01-01

    Pipeline architecture with parallel multipliers and adders speeds calculation of weighted sums. Picture-element values and partial sums flow through delay-adder modules. After each cycle or time unit of calculation, each value in filter moves one position right. Digital integrated-circuit chips with pipeline architecture rapidly move 35 X 35 two-dimensional convolutions. Need for such circuits in image enhancement, data filtering, correlation, pattern extraction, and synthetic-aperture-radar image processing: all require repeated calculations of weighted sums of values from images or two-dimensional arrays of data.

  9. SEU In An Advanced Bipolar Integrated Circuit

    NASA Technical Reports Server (NTRS)

    Zoutendyk, John A.; Secrest, Elaine C.; Berndt, Dale F.

    1989-01-01

    Report summarizes investigation of single-event upsets (SEU) in bipolar integrated-circuit set of flip-flops (memory cells). Device tested made by advanced digital bipolar silicon process of Honeywell, Inc. Circuit chip contained 4 cells. Construction enabled study of effect of size on SEU behavior. Each cell externally biased so effect of bias current on SEU behavior. Results of study provides important information for optimal design of devices fabricated using buried-layer bipolar process operating in heavy-ion SEU environments. Designers use information to provide required levels of suppression of SEU in specific applications via combinations of size and/or cell-current scaling.

  10. 3-D electromagnetic modeling for very early time sounding of shallow targets using integral equations

    SciTech Connect

    Xiong, Z.; Tripp, A.C.

    1994-12-31

    This paper presents an integral equation algorithm for 3D EM modeling at high frequencies for applications in engineering an environmental studies. The integral equation method remains the same for low and high frequencies, but the dominant roles of the displacements currents complicate both numerical treatments and interpretations. With singularity extraction technique they successively extended the application of the Hankel filtering technique to the computation of Hankel integrals occurring in high frequency EM modeling. Time domain results are calculated from frequency domain results via Fourier transforms. While frequency domain data are not obvious for interpretations, time domain data show wave-like pictures that resemble seismograms. Both 1D and 3D numerical results show clearly the layer interfaces.

  11. 3D integration technology for sensor application using less than 5μm-pitch gold cone-bump connpdfection

    NASA Astrophysics Data System (ADS)

    Motoyoshi, M.; Miyoshi, T.; Ikebec, M.; Arai, Y.

    2015-03-01

    Three-dimensional (3D) integrated circuit (IC) technology is an effective solution to reduce the manufacturing costs of advanced two-dimensional (2D) large-scale integration (LSI) while ensuring equivalent device performance and functionalities. This technology allows a new device architecture using stacked detector/sensor devices with a small dead sensor area and high-speed operation that facilitates hyper-parallel data processing. In pixel detectors or focal-plane sensor devices, each pixel area must accommodate many transistors without increasing the pixel size. Consequently, many methods to realize 3D-LSI devices have been developed to meet this requirement by focusing on the unit processes of 3D-IC technology, such as through-silicon via formation and electrical and mechanical bonding between tiers of the stack. The bonding process consists of several unit processes such as bump or metal contact formation, chip/wafer alignment, chip/wafer bonding, and underfill formation; many process combinations have been reported. Our research focuses on a versatile bonding technology for silicon LSI, compound semiconductor, and microelectromechanical system devices at temperatures of less than 200oC for heterogeneous integration. A gold (Au) cone bump formed by nanoparticle deposition is one of the promising candidates for this purpose. This paper presents the experimental result of a fabricated prototype with 3-μm-diameter Au cone-bump connections with adhesive injection, and compares it with that of an indium microbump (μ-bump). The resistance of the 3-μm-diameter Au cone bump is approximately 6 Ω. We also investigated the influence of stress caused by the bump junction on the MOS characteristics.

  12. Integration of geostatistical techniques and intuitive geology in the 3-D modeling process

    SciTech Connect

    Heine, C.J.; Cooper, D.H.

    1995-08-01

    The development of 3-D geologic models for reservoir description and simulation has traditionally relied on the computer derived interpolation of well data in a geocelluar stratigraphic framework. The quality of the interpolation has been directly dependent on the nature of the interpolation method, and ability of the interpolation scheme to accurately predict the value of geologic attributes away from the well. Typically, interpolation methods employ deterministic or geostatistical algorithms which offer limited capacity for integrating data derived from secondary analyses. These secondary analyses, which might include the results from 3-D seismic inversion, borehole imagery studies, or deductive reasoning, introduce a subjective component into what would otherwise be restricted to a purely mathematical treatment of geologic data. At Saudi ARAMCO an increased emphasis is being placed on the role of the reservoir geologist in the development of 3-D geologic models. Quantitative results, based on numerical computations, are being enhanced with intuitive geology, derived from years of cumulative professional experience and expertise. Techniques such as template modeling and modified conditional simulation, are yielding 3-D geologic models, which not only more accurately reflect the geology of the reservoir, but also preserve geologic detail throughout the simulation process. This incorporation of secondary data sources and qualitative analysis has been successfully demonstrated in a clastic reservoir environment in Central Saudi Arabia, and serves as a prototype for future 3-D geologic model development.

  13. Integration of geostatistical techniques and intuitive geology in the 3-D modeling process

    SciTech Connect

    Heine, C.J.; Cooper, D.H. )

    1996-01-01

    The development of 3-D geologic models for reservoir description and simulation has traditionally relied on the computer derived interpolation of well data in a geocelluar stratigraphic framework. The quality of the interpolation has been directly dependent on the nature of the interpolation method, and ability of the Interpolation scheme to accurately predict the value of geologic attributes away from the well. Typically, interpolation methods employ deterministic or geostatistical algorithms which offer limited capacity for Integrating data derived from secondary analyses. These secondary analyses, which might include the results from 3-D seismic inversion, borehole imagery studies, or deductive reasoning, introduce a subjective component into what would otherwise be restricted to a purely mathematical treatment of geologic data. At Saudi ARAMCO an increased emphases is being placed on the role of the reservoir geologist in the development of 3-D geologic models. Quantitative results, based on numerical computations, are being enhanced with intuitive geology, derived from years of cumulative professional experience and expertise. Techniques such as template modeling and modified conditional simulation, are yielding 3-D geologic models, which not only more accurately reflect the geology of the reservoir, but also preserve geologic detail throughout the simulation process. This incorporation of secondary data sources and qualitative analysis has been successfully demonstrated in a clastic reservoir environment in Central Saudi Arabia, and serves as a prototype for future 3-D geologic model development.

  14. Integration of geostatistical techniques and intuitive geology in the 3-D modeling process

    SciTech Connect

    Heine, C.J.; Cooper, D.H.

    1996-12-31

    The development of 3-D geologic models for reservoir description and simulation has traditionally relied on the computer derived interpolation of well data in a geocelluar stratigraphic framework. The quality of the interpolation has been directly dependent on the nature of the interpolation method, and ability of the Interpolation scheme to accurately predict the value of geologic attributes away from the well. Typically, interpolation methods employ deterministic or geostatistical algorithms which offer limited capacity for Integrating data derived from secondary analyses. These secondary analyses, which might include the results from 3-D seismic inversion, borehole imagery studies, or deductive reasoning, introduce a subjective component into what would otherwise be restricted to a purely mathematical treatment of geologic data. At Saudi ARAMCO an increased emphases is being placed on the role of the reservoir geologist in the development of 3-D geologic models. Quantitative results, based on numerical computations, are being enhanced with intuitive geology, derived from years of cumulative professional experience and expertise. Techniques such as template modeling and modified conditional simulation, are yielding 3-D geologic models, which not only more accurately reflect the geology of the reservoir, but also preserve geologic detail throughout the simulation process. This incorporation of secondary data sources and qualitative analysis has been successfully demonstrated in a clastic reservoir environment in Central Saudi Arabia, and serves as a prototype for future 3-D geologic model development.

  15. 3D shape shearography with integrated structured light projection for strain inspection of curved objects

    NASA Astrophysics Data System (ADS)

    Anisimov, Andrei G.; Groves, Roger M.

    2015-05-01

    Shearography (speckle pattern shearing interferometry) is a non-destructive testing technique that provides full-field surface strain characterization. Although real-life objects especially in aerospace, transport or cultural heritage are not flat (e.g. aircraft leading edges or sculptures), their inspection with shearography is of interest for both hidden defect detection and material characterization. Accurate strain measuring of a highly curved or free form surface needs to be performed by combining inline object shape measuring and processing of shearography data in 3D. Previous research has not provided a general solution. This research is devoted to the practical questions of 3D shape shearography system development for surface strain characterization of curved objects. The complete procedure of calibration and data processing of a 3D shape shearography system with integrated structured light projector is presented. This includes an estimation of the actual shear distance and a sensitivity matrix correction within the system field of view. For the experimental part a 3D shape shearography system prototype was developed. It employs three spatially-distributed shearing cameras, with Michelson interferometers acting as the shearing devices, one illumination laser source and a structured light projector. The developed system performance was evaluated with a previously reported cylinder specimen (length 400 mm, external diameter 190 mmm) loaded by internal pressure. Further steps for the 3D shape shearography prototype and the technique development are also proposed.

  16. Femtosecond laser 3D nanofabrication in glass: enabling direct write of integrated micro/nanofluidic chips

    NASA Astrophysics Data System (ADS)

    Cheng, Ya; Liao, Yang; Sugioka, Koji

    2014-03-01

    The creation of complex three-dimensional (3D) fluidic systems composed of hollow micro- and nanostructures embedded in transparent substrates has attracted significant attention from both scientific and applied research communities. However, it is by now still a formidable challenge to build 3D micro- and nanofluidic structures with arbitrary configurations using conventional planar lithographic fabrication methods. As a direct and maskless fabrication technique, femtosecond laser micromachining provides a straightforward approach for high-precision spatial-selective modification inside transparent materials through nonlinear optical absorption. Here, we demonstrate rapid fabrication of high-aspect-ratio micro- and/or nanofluidic structures with various 3D configurations in glass substrates by femtosecond laser direct writing. Based on this approach, we demonstrate several functional micro- and nanofluidic devices including a 3D passive microfluidic mixer, a capillary electrophoresis (CE) analysis chip, and an integrated micro-nanofluidic system for single DNA analysis. This technology offers new opportunities to develop novel 3D micro-nanofluidic systems for a variety of lab-on-a-chip applications.

  17. Low cost 3D-printing used in an undergraduate project: an integrating sphere for measurement of photoluminescence quantum yield

    NASA Astrophysics Data System (ADS)

    Tomes, John J.; Finlayson, Chris E.

    2016-09-01

    We report upon the exploitation of the latest 3D printing technologies to provide low-cost instrumentation solutions, for use in an undergraduate level final-year project. The project addresses prescient research issues in optoelectronics, which would otherwise be inaccessible to such undergraduate student projects. The experimental use of an integrating sphere in conjunction with a desktop spectrometer presents opportunities to use easily handled, low cost materials as a means to illustrate many areas of physics such as spectroscopy, lasers, optics, simple circuits, black body radiation and data gathering. Presented here is a 3rd year undergraduate physics project which developed a low cost (£25) method to manufacture an experimentally accurate integrating sphere by 3D printing. Details are given of both a homemade internal reflectance coating formulated from readily available materials, and a robust instrument calibration method using a tungsten bulb. The instrument is demonstrated to give accurate and reproducible experimental measurements of luminescence quantum yield of various semiconducting fluorophores, in excellent agreement with literature values.

  18. InP-based three-dimensional photonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Tsou, Diana; Zaytsev, Sergey; Pauchard, Alexandre; Hummel, Steve; Lo, Yu-Hwa

    2001-10-01

    Fast-growing internet traffic volumes require high data communication bandwidth over longer distances than short wavelength (850 nm) multi-mode fiber systems can provide. Access network bottlenecks put pressure on short-range (SR) telecommunication systems. To effectively address these datacom and telecom market needs, low cost, high-speed laser modules at 1310 and 1550 nm wavelengths are required. The great success of GaAs 850 nm VCSELs for Gb/s Ethernet has motivated efforts to extend VCSEL technology to longer wavelengths in the 1310 and 1550 nm regimes. However, the technological challenges associated with available intrinsic materials for long wavelength VCSELs are tremendous. Even with recent advances in this area, it is believed that significant additional development is necessary before long wavelength VCSELs that meet commercial specifications will be widely available. In addition, the more stringent OC192 and OC768 specifications for single-mode fiber (SMF) datacom may require more than just a long wavelength laser diode, VCSEL or not, to address numerous cost and performance issues. We believe that photonic integrated circuits, which compactly integrate surface-emitting lasers with additional active and passive optical components with extended functionality, will provide the best solutions to today's problems. Photonic integrated circuits (PICs) have been investigated for more than a decade. However, they have produced limited commercial impact to date primarily because the highly complicated fabrication processes produce significant yield and device performance issues. In this presentation, we will discuss a new technology platform for fabricating InP-based photonic integrated circuits compatible with surface-emitting laser technology. Employing InP transparency at 1310 and 1550 nm wavelengths, we have created 3-D photonic integrated circuits (PICs) by utilizing light beams in both surface normal and in-plane directions within the InP-based structure

  19. A Prototype PZT Matrix Transducer With Low-Power Integrated Receive ASIC for 3-D Transesophageal Echocardiography.

    PubMed

    Chen, Chao; Raghunathan, Shreyas B; Yu, Zili; Shabanimotlagh, Maysam; Chen, Zhao; Chang, Zu-yao; Blaak, Sandra; Prins, Christian; Ponte, Jacco; Noothout, Emile; Vos, Hendrik J; Bosch, Johan G; Verweij, Martin D; de Jong, Nico; Pertijs, Michiel A P

    2016-01-01

    This paper presents the design, fabrication, and experimental evaluation of a prototype lead zirconium titanate (PZT) matrix transducer with an integrated receive ASIC, as a proof of concept for a miniature three-dimensional (3-D) transesophageal echocardiography (TEE) probe. It consists of an array of 9 ×12 piezoelectric elements mounted on the ASIC via an integration scheme that involves direct electrical connections between a bond-pad array on the ASIC and the transducer elements. The ASIC addresses the critical challenge of reducing cable count, and includes front-end amplifiers with adjustable gains and micro-beamformer circuits that locally process and combine echo signals received by the elements of each 3 ×3 subarray. Thus, an order-of-magnitude reduction in the number of receive channels is achieved. Dedicated circuit techniques are employed to meet the strict space and power constraints of TEE probes. The ASIC has been fabricated in a standard 0.18-μm CMOS process and consumes only 0.44 mW/channel. The prototype has been acoustically characterized in a water tank. The ASIC allows the array to be presteered across ±37° while achieving an overall dynamic range of 77 dB. Both the measured characteristics of the individual transducer elements and the performance of the ASIC are in good agreement with expectations, demonstrating the effectiveness of the proposed techniques. PMID:26540683

  20. Applying analog integrated circuits for HERO protection

    NASA Technical Reports Server (NTRS)

    Willis, Kenneth E.; Blachowski, Thomas J.

    1994-01-01

    One of the most efficient methods for protecting electro-explosive devices (EED's) from HERO and ESD is to shield the EED in a conducting shell (Faraday cage). Electrical energy is transferred to the bridge by means of a magnetic coupling which passes through a portion of the conducting shell that is made from a magnetically permeable but electrically conducting material. This technique was perfected by ML Aviation, a U.K. company, in the early 80's, and was called a Radio Frequency Attenuation Connector (RFAC). It is now in wide use in the U.K. Previously, the disadvantage of RFAC over more conventional methods was its relatively high cost, largely driven by a thick film hybrid circuit used to switch the primary of the transformer. Recently, through a licensing agreement, this technology has been transferred to the U.S. and significant cost reductions and performance improvements have been achieved by the introduction of analog integrated circuits. An integrated circuit performs the following functions: (1) Chops the DC input to a signal suitable for driving the primary of the transformer; (2) Verifies the input voltage is above a threshold; (3) Verifies the input voltage is valid for a pre set time before enabling the device; (4) Provides thermal protection of the circuit; and (5) Provides an external input for independent logic level enabling of the power transfer mechanism. This paper describes the new RFAC product and its applications.

  1. Integration of 3D photogrammetric outcrop models in the reservoir modelling workflow

    NASA Astrophysics Data System (ADS)

    Deschamps, Remy; Joseph, Philippe; Lerat, Olivier; Schmitz, Julien; Doligez, Brigitte; Jardin, Anne

    2014-05-01

    3D technologies are now widely used in geosciences to reconstruct outcrops in 3D. The technology used for the 3D reconstruction is usually based on Lidar, which provides very precise models. Such datasets offer the possibility to build well-constrained outcrop analogue models for reservoir study purposes. The photogrammetry is an alternate methodology which principles are based in determining the geometric properties of an object from photographic pictures taken from different angles. Outcrop data acquisition is easy, and this methodology allows constructing 3D outcrop models with many advantages such as: - light and fast acquisition, - moderate processing time (depending on the size of the area of interest), - integration of field data and 3D outcrops into the reservoir modelling tools. Whatever the method, the advantages of digital outcrop model are numerous as already highlighted by Hodgetts (2013), McCaffrey et al. (2005) and Pringle et al. (2006): collection of data from otherwise inaccessible areas, access to different angles of view, increase of the possible measurements, attributes analysis, fast rate of data collection, and of course training and communication. This paper proposes a workflow where 3D geocellular models are built by integrating all sources of information from outcrops (surface picking, sedimentological sections, structural and sedimentary dips…). The 3D geomodels that are reconstructed can be used at the reservoir scale, in order to compare the outcrop information with subsurface models: the detailed facies models of the outcrops are transferred into petrophysical and acoustic models, which are used to test different scenarios of seismic and fluid flow modelling. The detailed 3D models are also used to test new techniques of static reservoir modelling, based either on geostatistical approaches or on deterministic (process-based) simulation techniques. A modelling workflow has been designed to model reservoir geometries and properties from

  2. Modeling a Printed Circuit Heat Exchanger with RELAP5-3D for the Next Generation Nuclear Plant

    SciTech Connect

    Not Available

    2010-12-01

    The main purpose of this report is to design a printed circuit heat exchanger (PCHE) for the Next Generation Nuclear Plant and carry out Loss of Coolant Accident (LOCA) simulation using RELAP5-3D. Helium was chosen as the coolant in the primary and secondary sides of the heat exchanger. The design of PCHE is critical for the LOCA simulations. For purposes of simplicity, a straight channel configuration was assumed. A parallel intermediate heat exchanger configuration was assumed for the RELAP5 model design. The RELAP5 modeling also required the semicircular channels in the heat exchanger to be mapped to rectangular channels. The initial RELAP5 run outputs steady state conditions which were then compared to the heat exchanger performance theory to ensure accurate design is being simulated. An exponential loss of pressure transient was simulated. This LOCA describes a loss of coolant pressure in the primary side over a 20 second time period. The results for the simulation indicate that heat is initially transferred from the primary loop to the secondary loop, but after the loss of pressure occurs, heat transfers from the secondary loop to the primary loop.

  3. Proposal for the development of 3D Vertically Integrated Pattern Recognition Associative Memory (VIPRAM)

    SciTech Connect

    Deptuch, Gregory; Hoff, Jim; Kwan, Simon; Lipton, Ron; Liu, Ted; Ramberg, Erik; Todri, Aida; Yarema, Ray; Demarteua, Marcel,; Drake, Gary; Weerts, Harry; /Argonne /Chicago U. /Padua U. /INFN, Padua

    2010-10-01

    Future particle physics experiments looking for rare processes will have no choice but to address the demanding challenges of fast pattern recognition in triggering as detector hit density becomes significantly higher due to the high luminosity required to produce the rare process. The authors propose to develop a 3D Vertically Integrated Pattern Recognition Associative Memory (VIPRAM) chip for HEP applications, to advance the state-of-the-art for pattern recognition and track reconstruction for fast triggering.

  4. Tunable resonant structures for photonic integrated circuits

    NASA Astrophysics Data System (ADS)

    Ptasinski, Joanna Nina

    Photonics is an evolving field allowing for optical devices to be made cost effectively using standard semiconductor fabrication techniques, which in turn enables integration with microelectronic chips. Chip scale photonics will play an increasing role in the future of communications as the demand for bandwidth and reduced power consumption per bit continues to grow. Tunable optical circuit components are one of the essential technologies in the development of photonic analogues for classical electronic devices, where tunable photonic resonant structures allow for altering of their electromagnetic spectrum and find applications in optical switching, filtering, buffering, lasers and biosensors. The scope of this work is focused on tunable resonant structures for photonic integrated circuits. Specifically, this work demonstrates active tuning of silicon photonic resonant structures using the properties of dye doped nematic liquid crystals, temperature stabilization of silicon photonics using the passive properties of liquid crystals, and the effects of low density plasma enhanced chemical vapor deposition (PECVD) claddings on ring resonator device performance.

  5. Development of beam lead RF integrated circuits

    NASA Technical Reports Server (NTRS)

    Kline, A. J.; Kermode, A. W.

    1975-01-01

    This paper describes the design and development of a set of multifunction VHF/UHF integrated circuits aimed at providing a major improvement in spacecraft radio reliability through low stress operation and the processing of these circuits in beam-lead form. The methods evolved for the high frequency characterization of the devices are discussed together with the design of suitable test fixtures. Typical test results and the distribution of test parameters are presented. A unique carrier for beam-lead devices is described, and the need for such a device is discussed. The application of the carrier to device screening, burn-in and drift measurements is discussed together with the incentives for providing these capabilities. An overview of the integration of the devices into the spacecraft radio is given and candidate assembly processes are discussed. The technology impact of this approach upon future spacecraft radio systems is qualitatively examined.

  6. Packaging concept for LSI beam lead integrated circuits

    NASA Technical Reports Server (NTRS)

    Kennedy, B. W.

    1972-01-01

    Development of packaging system for mounting beam lead integrated chip circuit on lead frame is discussed. Process for fabricating large scale integration circuits is described. Diagrams illustrating method of construction are included.

  7. Viewing Integrated-Circuit Interconnections By SEM

    NASA Technical Reports Server (NTRS)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  8. A Pipeline for 3D Multimodality Image Integration and Computer-assisted Planning in Epilepsy Surgery.

    PubMed

    Nowell, Mark; Rodionov, Roman; Zombori, Gergely; Sparks, Rachel; Rizzi, Michele; Ourselin, Sebastien; Miserocchi, Anna; McEvoy, Andrew; Duncan, John

    2016-01-01

    Epilepsy surgery is challenging and the use of 3D multimodality image integration (3DMMI) to aid presurgical planning is well-established. Multimodality image integration can be technically demanding, and is underutilised in clinical practice. We have developed a single software platform for image integration, 3D visualization and surgical planning. Here, our pipeline is described in step-by-step fashion, starting with image acquisition, proceeding through image co-registration, manual segmentation, brain and vessel extraction, 3D visualization and manual planning of stereoEEG (SEEG) implantations. With dissemination of the software this pipeline can be reproduced in other centres, allowing other groups to benefit from 3DMMI. We also describe the use of an automated, multi-trajectory planner to generate stereoEEG implantation plans. Preliminary studies suggest this is a rapid, safe and efficacious adjunct for planning SEEG implantations. Finally, a simple solution for the export of plans and models to commercial neuronavigation systems for implementation of plans in the operating theater is described. This software is a valuable tool that can support clinical decision making throughout the epilepsy surgery pathway. PMID:27286266

  9. A Pipeline for 3D Multimodality Image Integration and Computer-assisted Planning in Epilepsy Surgery

    PubMed Central

    Nowell, Mark; Rodionov, Roman; Zombori, Gergely; Sparks, Rachel; Rizzi, Michele; Ourselin, Sebastien; Miserocchi, Anna; McEvoy, Andrew; Duncan, John

    2016-01-01

    Epilepsy surgery is challenging and the use of 3D multimodality image integration (3DMMI) to aid presurgical planning is well-established. Multimodality image integration can be technically demanding, and is underutilised in clinical practice. We have developed a single software platform for image integration, 3D visualization and surgical planning. Here, our pipeline is described in step-by-step fashion, starting with image acquisition, proceeding through image co-registration, manual segmentation, brain and vessel extraction, 3D visualization and manual planning of stereoEEG (SEEG) implantations. With dissemination of the software this pipeline can be reproduced in other centres, allowing other groups to benefit from 3DMMI. We also describe the use of an automated, multi-trajectory planner to generate stereoEEG implantation plans. Preliminary studies suggest this is a rapid, safe and efficacious adjunct for planning SEEG implantations. Finally, a simple solution for the export of plans and models to commercial neuronavigation systems for implementation of plans in the operating theater is described. This software is a valuable tool that can support clinical decision making throughout the epilepsy surgery pathway. PMID:27286266

  10. Five levels of PACS modularity: integrating 3D and other advanced visualization tools.

    PubMed

    Wang, Kenneth C; Filice, Ross W; Philbin, James F; Siegel, Eliot L; Nagy, Paul G

    2011-12-01

    The current array of PACS products and 3D visualization tools presents a wide range of options for applying advanced visualization methods in clinical radiology. The emergence of server-based rendering techniques creates new opportunities for raising the level of clinical image review. However, best-of-breed implementations of core PACS technology, volumetric image navigation, and application-specific 3D packages will, in general, be supplied by different vendors. Integration issues should be carefully considered before deploying such systems. This work presents a classification scheme describing five tiers of PACS modularity and integration with advanced visualization tools, with the goals of characterizing current options for such integration, providing an approach for evaluating such systems, and discussing possible future architectures. These five levels of increasing PACS modularity begin with what was until recently the dominant model for integrating advanced visualization into the clinical radiologist's workflow, consisting of a dedicated stand-alone post-processing workstation in the reading room. Introduction of context-sharing, thin clients using server-based rendering, archive integration, and user-level application hosting at successive levels of the hierarchy lead to a modularized imaging architecture, which promotes user interface integration, resource efficiency, system performance, supportability, and flexibility. These technical factors and system metrics are discussed in the context of the proposed five-level classification scheme. PMID:21301923

  11. Progress in radiation immune thermionic integrated circuits

    SciTech Connect

    Lynn, D.K.; McCormick, J.B.

    1985-08-01

    This report describes the results of a program directed at evaluating the thermionic integrated circuit (TIC) technology for applicability to military systems. Previous programs under the sponsorship of the Department of Energy, Office of Basic Energy Sciences, have developed an initial TIC technology base and demonstrated operation in high-temperature and high-radiation environments. The program described in this report has two parts: (1) a technical portion in which experiments and analyses were conducted to refine perceptions of near-term as well as ultimate performance levels of the TIC technology and (2) an applications portion in which the technical conclusions were to be evaluated against potential military applications. This report draws several conclusions that strongly suggest that (1) useful radiation-hard/high-temperature operable integrated circuits can be developed using the TIC technology; (2) because of their ability to survive and operate in hostile environments, a variety of potential military applications have been projected for this technology; and (3) based on the above two conclusions, an aggressive TIC development program should be initiated to provide the designers of future systems with integrated circuits and devices with the unique features of the TICs.

  12. Power system with an integrated lubrication circuit

    SciTech Connect

    Hoff, Brian D.; Akasam, Sivaprasad; Algrain, Marcelo C.; Johnson, Kris W.; Lane, William H.

    2009-11-10

    A power system includes an engine having a first lubrication circuit and at least one auxiliary power unit having a second lubrication circuit. The first lubrication circuit is in fluid communication with the second lubrication circuit.

  13. Integrating Data Clustering and Visualization for the Analysis of 3D Gene Expression Data

    SciTech Connect

    Data Analysis and Visualization and the Department of Computer Science, University of California, Davis, One Shields Avenue, Davis CA 95616, USA,; nternational Research Training Group ``Visualization of Large and Unstructured Data Sets,'' University of Kaiserslautern, Germany; Computational Research Division, Lawrence Berkeley National Laboratory, One Cyclotron Road, Berkeley, CA 94720, USA; Genomics Division, Lawrence Berkeley National Laboratory, One Cyclotron Road, Berkeley CA 94720, USA; Life Sciences Division, Lawrence Berkeley National Laboratory, One Cyclotron Road, Berkeley CA 94720, USA,; Computer Science Division,University of California, Berkeley, CA, USA,; Computer Science Department, University of California, Irvine, CA, USA,; All authors are with the Berkeley Drosophila Transcription Network Project, Lawrence Berkeley National Laboratory,; Rubel, Oliver; Weber, Gunther H.; Huang, Min-Yu; Bethel, E. Wes; Biggin, Mark D.; Fowlkes, Charless C.; Hendriks, Cris L. Luengo; Keranen, Soile V. E.; Eisen, Michael B.; Knowles, David W.; Malik, Jitendra; Hagen, Hans; Hamann, Bernd

    2008-05-12

    The recent development of methods for extracting precise measurements of spatial gene expression patterns from three-dimensional (3D) image data opens the way for new analyses of the complex gene regulatory networks controlling animal development. We present an integrated visualization and analysis framework that supports user-guided data clustering to aid exploration of these new complex datasets. The interplay of data visualization and clustering-based data classification leads to improved visualization and enables a more detailed analysis than previously possible. We discuss (i) integration of data clustering and visualization into one framework; (ii) application of data clustering to 3D gene expression data; (iii) evaluation of the number of clusters k in the context of 3D gene expression clustering; and (iv) improvement of overall analysis quality via dedicated post-processing of clustering results based on visualization. We discuss the use of this framework to objectively define spatial pattern boundaries and temporal profiles of genes and to analyze how mRNA patterns are controlled by their regulatory transcription factors.

  14. Coarse integral holography approach for real 3D color video displays.

    PubMed

    Chen, J S; Smithwick, Q Y J; Chu, D P

    2016-03-21

    A colour holographic display is considered the ultimate apparatus to provide the most natural 3D viewing experience. It encodes a 3D scene as holographic patterns that then are used to reproduce the optical wavefront. The main challenge at present is for the existing technologies to cope with the full information bandwidth required for the computation and display of holographic video. We have developed a dynamic coarse integral holography approach using opto-mechanical scanning, coarse integral optics and a low space-bandwidth-product high-bandwidth spatial light modulator to display dynamic holograms with a large space-bandwidth-product at video rates, combined with an efficient rendering algorithm to reduce the information content. This makes it possible to realise a full-parallax, colour holographic video display with a bandwidth of 10 billion pixels per second, and an adequate image size and viewing angle, as well as all relevant 3D cues. Our approach is scalable and the prototype can achieve even better performance with continuing advances in hardware components. PMID:27136858

  15. Polymer optical fibers integrated directly into 3D orthogonal woven composites for sensing

    NASA Astrophysics Data System (ADS)

    Hamouda, Tamer; Seyam, Abdel-Fattah M.; Peters, Kara

    2015-02-01

    This study demonstrates that standard polymer optical fibers (POF) can be directly integrated into composites from 3D orthogonal woven preforms during the weaving process and then serve as in-situ sensors to detect damage due to bending or impact loads. Different composite samples with embedded POF were fabricated of 3D orthogonal woven composites with different parameters namely number of y-/x-layers and x-yarn density. The signal of POF was not affected significantly by the preform structure. During application of resin using VARTM technique, significant drop in backscattering level was observed due to pressure caused by vacuum on the embedded POF. Measurements of POF signal while in the final composites after resin cure indicated that the backscattering level almost returned to the original level of un-embedded POF. The POF responded to application of bending and impact loads to the composite with a reduction in the backscattering level. The backscattering level almost returned back to its original level after removing the bending load until damage was present in the composite. Similar behavior occurred due to impact events. As the POF itself is used as the sensor and can be integrated throughout the composite, large sections of future 3D woven composite structures could be monitored without the need for specialized sensors or complex instrumentation.

  16. Integration of a 3D perspective view in the navigation display: featuring pilot's mental model

    NASA Astrophysics Data System (ADS)

    Ebrecht, L.; Schmerwitz, S.

    2015-05-01

    Synthetic vision systems (SVS) appear as spreading technology in the avionic domain. Several studies prove enhanced situational awareness when using synthetic vision. Since the introduction of synthetic vision a steady change and evolution started concerning the primary flight display (PFD) and the navigation display (ND). The main improvements of the ND comprise the representation of colored ground proximity warning systems (EGPWS), weather radar, and TCAS information. Synthetic vision seems to offer high potential to further enhance cockpit display systems. Especially, concerning the current trend having a 3D perspective view in a SVS-PFD while leaving the navigational content as well as methods of interaction unchanged the question arouses if and how the gap between both displays might evolve to a serious problem. This issue becomes important in relation to the transition and combination of strategic and tactical flight guidance. Hence, pros and cons of 2D and 3D views generally as well as the gap between the egocentric perspective 3D view of the PFD and the exocentric 2D top and side view of the ND will be discussed. Further a concept for the integration of a 3D perspective view, i.e., bird's eye view, in synthetic vision ND will be presented. The combination of 2D and 3D views in the ND enables a better correlation of the ND and the PFD. Additionally, this supports the building of pilot's mental model. The authors believe it will improve the situational and spatial awareness. It might prove to further raise the safety margin when operating in mountainous areas.

  17. Norg underground gas storage - an integrated 3-D geological and geophysical reservoir modeling study

    SciTech Connect

    Cohen, J.; Smith, S. ); Huis, R.; Copper, J.; Whyte, S. )

    1993-09-01

    The Netherlands have an extensive gas distribution infrastructure supplying 80 x 10[sup 9] m[sup 3] per annum to the domestic and European market. The capacity requirement exceeds 600 x 10[sup 6] sm[sup 3]/d, of which 430 x 10[sup 6] sm[sup 3]/d is provided by the giant Groningen gas field. The Groningen field will soon reach a pressure at which this capacity can no longer be met without considerable investments. It will also become difficult to maintain the market gas quality, because of the increasing supply from small fields with widely varying gas qualities. Underground Gas Storage (UGS) will satisfy both capacity and gas-quality requirements. This UGS must eventually store 4.5 x 10[sup 9] m[sup 3] with injection/production capacities of 36/80-100 x 10[sup 6] sm[sup 3]/d, making it one of the largest UGS projects in the world. These extremely high-capacity requirements demand both high-matrix permeability and good understanding of vertical and lateral reservoir continuity. Matrix permeability is predictable due to the close relationship with the lithofacies defined within the primary Rotliegende depositional model. Minor faults, identified on three-dimensional (3-D) seismic attribute maps, represent potential transmissibility impairment zones, compartmentalizing the reservoir. This was initially suggested by core fracture studies and confirmed by a subsequent field shut-in and pressure buildup test. Lithofacies and seismic structural data are integrated within a computerized reservoir geological modeling system known as [open quotes]Monarch[close quotes] to provide a highly detailed 3-D permeability model that is then tranformed into a model for dynamic reservoir simulation. The results confirm the required working volume for the UGS operation and provide a basis for the initial field development planning.

  18. The 3-D CFD modeling of gas turbine combustor-integral bleed flow interaction

    NASA Technical Reports Server (NTRS)

    Chen, D. Y.; Reynolds, R. S.

    1993-01-01

    An advanced 3-D Computational Fluid Dynamics (CFD) model was developed to analyze the flow interaction between a gas turbine combustor and an integral bleed plenum. In this model, the elliptic governing equations of continuity, momentum and the k-e turbulence model were solved on a boundary-fitted, curvilinear, orthogonal grid system. The model was first validated against test data from public literature and then applied to a gas turbine combustor with integral bleed. The model predictions agreed well with data from combustor rig testing. The model predictions also indicated strong flow interaction between the combustor and the integral bleed. Integral bleed flow distribution was found to have a great effect on the pressure distribution around the gas turbine combustor.

  19. A new 3-D integral code for computation of accelerator magnets

    SciTech Connect

    Turner, L.R.; Kettunen, L.

    1991-01-01

    For computing accelerator magnets, integral codes have several advantages over finite element codes; far-field boundaries are treated automatically, and computed field in the bore region satisfy Maxwell's equations exactly. A new integral code employing edge elements rather than nodal elements has overcome the difficulties associated with earlier integral codes. By the use of field integrals (potential differences) as solution variables, the number of unknowns is reduced to one less than the number of nodes. Two examples, a hollow iron sphere and the dipole magnet of Advanced Photon Source injector synchrotron, show the capability of the code. The CPU time requirements are comparable to those of three-dimensional (3-D) finite-element codes. Experiments show that in practice it can realize much of the potential CPU time saving that parallel processing makes possible. 8 refs., 4 figs., 1 tab.

  20. Uniform integration of gold nanoparticles in PDMS microfluidics with 3D micromixing

    NASA Astrophysics Data System (ADS)

    SadAbadi, H.; Packirisamy, M.; Wuthrich, R.

    2015-09-01

    The integration of gold nanoparticles (AuNPs) on the surface of polydimethylsiloxane (PDMS) microfluidics for biosensing applications is a challenging task. In this paper we address this issue by integration of pre-synthesized AuNPs (in a microreactor) into a microfluidic system. This method explored the affinity of AuNPs toward the PDMS surface so that the pre-synthesized particles will be adsorbed onto the channel walls. AuNPs were synthesized inside a microreactor before integration. In order to improve the size uniformity of the synthesized AuNPs and also to provide full mixing of reactants, a 3D-micromixer was designed, fabricated and then integrated with the microreactor in a single platform. SEM and UV/Vis spectroscopy were used to characterize the AuNPs on the PDMS surface.

  1. Integration of multiple view plus depth data for free viewpoint 3D display

    NASA Astrophysics Data System (ADS)

    Suzuki, Kazuyoshi; Yoshida, Yuko; Kawamoto, Tetsuya; Fujii, Toshiaki; Mase, Kenji

    2014-03-01

    This paper proposes a method for constructing a reasonable scale of end-to-end free-viewpoint video system that captures multiple view and depth data, reconstructs three-dimensional polygon models of objects, and display them on virtual 3D CG spaces. This system consists of a desktop PC and four Kinect sensors. First, multiple view plus depth data at four viewpoints are captured by Kinect sensors simultaneously. Then, the captured data are integrated to point cloud data by using camera parameters. The obtained point cloud data are sampled to volume data that consists of voxels. Since volume data that are generated from point cloud data are sparse, those data are made dense by using global optimization algorithm. Final step is to reconstruct surfaces on dense volume data by discrete marching cubes method. Since accuracy of depth maps affects to the quality of 3D polygon model, a simple inpainting method for improving depth maps is also presented.

  2. Sequential circuit design for radiation hardened multiple voltage integrated circuits

    DOEpatents

    Clark, Lawrence T.; McIver, III, John K.

    2009-11-24

    The present invention includes a radiation hardened sequential circuit, such as a bistable circuit, flip-flop or other suitable design that presents substantial immunity to ionizing radiation while simultaneously maintaining a low operating voltage. In one embodiment, the circuit includes a plurality of logic elements that operate on relatively low voltage, and a master and slave latches each having storage elements that operate on a relatively high voltage.

  3. 3D Porosity Estimation of the Nankai Trough Sediments from Core-log-seismic Integration

    NASA Astrophysics Data System (ADS)

    Park, J. O.

    2015-12-01

    The Nankai Trough off southwest Japan is one of the best subduction-zone to study megathrust earthquake fault. Historic, great megathrust earthquakes with a recurrence interval of 100-200 yr have generated strong motion and large tsunamis along the Nankai Trough subduction zone. At the Nankai Trough margin, the Philippine Sea Plate (PSP) is being subducted beneath the Eurasian Plate to the northwest at a convergence rate ~4 cm/yr. The Shikoku Basin, the northern part of the PSP, is estimated to have opened between 25 and 15 Ma by backarc spreading of the Izu-Bonin arc. The >100-km-wide Nankai accretionary wedge, which has developed landward of the trench since the Miocene, mainly consists of offscraped and underplated materials from the trough-fill turbidites and the Shikoku Basin hemipelagic sediments. Particularly, physical properties of the incoming hemipelagic sediments may be critical for seismogenic behavior of the megathrust fault. We have carried out core-log-seismic integration (CLSI) to estimate 3D acoustic impedance and porosity for the incoming sediments in the Nankai Trough. For the CLSI, we used 3D seismic reflection data, P-wave velocity and density data obtained during IODP (Integrated Ocean Drilling Program) Expeditions 322 and 333. We computed acoustic impedance depth profiles for the IODP drilling sites from P-wave velocity and density data. We constructed seismic convolution models with the acoustic impedance profiles and a source wavelet which is extracted from the seismic data, adjusting the seismic models to observed seismic traces with inversion method. As a result, we obtained 3D acoustic impedance volume and then converted it to 3D porosity volume. In general, the 3D porosities show decrease with depth. We found a porosity anomaly zone with alteration of high and low porosities seaward of the trough axis. In this talk, we will show detailed 3D porosity of the incoming sediments, and present implications of the porosity anomaly zone for the

  4. Monolithic 3D CMOS Using Layered Semiconductors.

    PubMed

    Sachid, Angada B; Tosun, Mahmut; Desai, Sujay B; Hsu, Ching-Yi; Lien, Der-Hsien; Madhvapathy, Surabhi R; Chen, Yu-Ze; Hettick, Mark; Kang, Jeong Seuk; Zeng, Yuping; He, Jr-Hau; Chang, Edward Yi; Chueh, Yu-Lun; Javey, Ali; Hu, Chenming

    2016-04-01

    Monolithic 3D integrated circuits using transition metal dichalcogenide materials and low-temperature processing are reported. A variety of digital and analog circuits are implemented on two sequentially integrated layers of devices. Inverter circuit operation at an ultralow supply voltage of 150 mV is achieved, paving the way to high-density, ultralow-voltage, and ultralow-power applications. PMID:26833783

  5. Vacuum die attach for integrated circuits

    DOEpatents

    Schmitt, Edward H.; Tuckerman, David B.

    1991-01-01

    A thin film eutectic bond for attaching an integrated circuit die to a circuit substrate is formed by coating at least one bonding surface on the die and substrate with an alloying metal, assembling the die and substrate under compression loading, and heating the assembly to an alloying temperature in a vacuum. A very thin bond, 10 microns or less, which is substantially void free, is produced. These bonds have high reliability, good heat and electrical conduction, and high temperature tolerance. The bonds are formed in a vacuum chamber, using a positioning and loading fixture to compression load the die, and an IR lamp or other heat source. For bonding a silicon die to a silicon substrate, a gold silicon alloy bond is used. Multiple dies can be bonded simultaneously. No scrubbing is required.

  6. Vacuum die attach for integrated circuits

    DOEpatents

    Schmitt, E.H.; Tuckerman, D.B.

    1991-09-10

    A thin film eutectic bond for attaching an integrated circuit die to a circuit substrate is formed by coating at least one bonding surface on the die and substrate with an alloying metal, assembling the die and substrate under compression loading, and heating the assembly to an alloying temperature in a vacuum. A very thin bond, 10 microns or less, which is substantially void free, is produced. These bonds have high reliability, good heat and electrical conduction, and high temperature tolerance. The bonds are formed in a vacuum chamber, using a positioning and loading fixture to compression load the die, and an IR lamp or other heat source. For bonding a silicon die to a silicon substrate, a gold silicon alloy bond is used. Multiple dies can be bonded simultaneously. No scrubbing is required. 1 figure.

  7. Intracranial Catheter for Integrated 3D Ultrasound Imaging & Hyperthermia: Feasibility Study

    NASA Astrophysics Data System (ADS)

    Herickhoff, Carl D.; Light, Edward D.; Bing, Kristin Frinkley; Mukundan, Srinivasan; Grant, Gerald A.; Wolf, Patrick D.; Dixon-Tulloch, Ellen; Shih, Timothy; Hsu, Stephen J.; Smith, Stephen W.

    2009-04-01

    In this study, we investigated the feasibility of an intracranial catheter transducer capable of real-time 3D (RT3D) imaging and ultrasound hyperthermia, for application in the visualization and treatment of tumors in the brain. We designed and constructed a 12 Fr, integrated matrix and linear array catheter transducer prototype for combined RT3D imaging and heating capability. This dual-mode catheter incorporated 153 matrix array elements and 11 linear array elements, on a 0.2 mm pitch, with a total aperture size of 8.4 mm×2.3 mm. This array achieved a 3.5° C in vitro temperature rise at a 2 cm focal distance in tissue-mimicking material. The dual-mode catheter prototype was compared with a Siemens 10 Fr AcuNav™ catheter as a gold standard in experiments assessing image quality and therapeutic potential, and both probes were used in a canine brain model to image anatomical structures and color Doppler blood flow and to attempt in vivo heating.

  8. Application of CART3D to Complex Propulsion-Airframe Integration with Vehicle Sketch Pad

    NASA Technical Reports Server (NTRS)

    Hahn, Andrew S.

    2012-01-01

    Vehicle Sketch Pad (VSP) is an easy-to-use modeler used to generate aircraft geometries for use in conceptual design and analysis. It has been used in the past to generate metageometries for aerodynamic analyses ranging from handbook methods to Navier-Stokes computational fluid dynamics (CFD). As desirable as it is to bring high order analyses, such as CFD, into the conceptual design process, this has been difficult and time consuming in practice due to the manual nature of both surface and volume grid generation. Over the last couple of years, VSP has had a major upgrade of its surface triangulation and export capability. This has enhanced its ability to work with Cart3D, an inviscid, three dimensional fluid flow toolset. The combination of VSP and Cart3D allows performing inviscid CFD on complex geometries with relatively high productivity. This paper will illustrate the use of VSP with Cart3D through an example case of a complex propulsion-airframe integration (PAI) of an over-wing nacelle (OWN) airliner configuration.

  9. Integration of 3D Structure from Disparity into Biological Motion Perception Independent of Depth Awareness

    PubMed Central

    Wang, Ying; Jiang, Yi

    2014-01-01

    Images projected onto the retinas of our two eyes come from slightly different directions in the real world, constituting binocular disparity that serves as an important source for depth perception - the ability to see the world in three dimensions. It remains unclear whether the integration of disparity cues into visual perception depends on the conscious representation of stereoscopic depth. Here we report evidence that, even without inducing discernible perceptual representations, the disparity-defined depth information could still modulate the visual processing of 3D objects in depth-irrelevant aspects. Specifically, observers who could not discriminate disparity-defined in-depth facing orientations of biological motions (i.e., approaching vs. receding) due to an excessive perceptual bias nevertheless exhibited a robust perceptual asymmetry in response to the indistinguishable facing orientations, similar to those who could consciously discriminate such 3D information. These results clearly demonstrate that the visual processing of biological motion engages the disparity cues independent of observers’ depth awareness. The extraction and utilization of binocular depth signals thus can be dissociable from the conscious representation of 3D structure in high-level visual perception. PMID:24586622

  10. 3D modeling of a dolerite intrusion from the photogrammetric and geophysical data integration.

    NASA Astrophysics Data System (ADS)

    Duarte, João; Machadinho, Ana; Figueiredo, Fernando; Mira, Maria

    2015-04-01

    The aims of this study is create a methodology based on the integration of data obtained from various available technologies, which allow a credible and complete evaluation of rock masses. In this particular case of a dolerite intrusion, which deployed an exploration of aggregates and belongs to the Jobasaltos - Extracção e Britagem. S.A.. Dolerite intrusion is situated in the volcanic complex of Serra de Todo-o-Mundo, Casais Gaiola, intruded in Jurassic sandstones. The integration of the surface and subsurface mapping, obtained by technology UAVs (Drone) and geophysical surveys (Electromagnetic Method - TEM 48 FAST), allows the construction of 2D and 3D models of the study local. The combination of the 3D point clouds produced from two distinct processes, modeling of photogrammetric and geophysical data, will be the basis for the construction of a single model of set. The rock masses in an integral perspective being visible their development above the surface and subsurface. The presentation of 2D and 3D models will give a perspective of structures, fracturation, lithology and their spatial correlations contributing to a better local knowledge, as well as its potential for the intended purpose. From these local models it will be possible to characterize and quantify the geological structures. These models will have its importance as a tool to assist in the analysis and drafting of regional models. The qualitative improvement in geological/structural modeling, seeks to reduce the value of characterization/cost ratio, in phase of prospecting, improving the investment/benefit ratio. This methodology helps to assess more accurately the economic viability of the projects.

  11. Fully analytical integration over the 3D volume bounded by the β sphere in topological atoms.

    PubMed

    Popelier, Paul L A

    2011-11-17

    Atomic properties of a topological atom are obtained by 3D integration over the volume of its atomic basin. Algorithms that compute atomic properties typically integrate over two subspaces: the volume bounded by the so-called β sphere, which is centered at the nucleus and completely contained within the atomic basin, and the volume of the remaining part of the basin. Here we show how the usual quadrature over the β sphere volume can be replaced by a fully analytical 3D integration leading to the atomic charge (monopole moment) for s, p, and d functions. Spherical tensor multipole moments have also been implemented and tested up to hexadecupole for s functions only, and up to quadrupole for s and p functions. The new algorithm is illustrated by operating on capped glycine (HF/6-31G, 35 molecular orbitals (MOs), 322 Gaussian primitives, 19 nuclei), the protein crambin (HF/3-21G, 1260 MOs, 5922 primitives and 642 nuclei), and tin (Z = 50) in Sn(2)(CH(3))(2) (B3LYP/cc-pVTZ and LANL2DZ, 59 MOs, 1352 primitives). PMID:21978204

  12. An integrated circuit floating point accumulator

    NASA Technical Reports Server (NTRS)

    Goldsmith, T. C.

    1977-01-01

    Goddard Space Flight Center has developed a large scale integrated circuit (type 623) which can perform pulse counting, storage, floating point compression, and serial transmission, using a single monolithic device. Counts of 27 or 19 bits can be converted to transmitted values of 12 or 8 bits respectively. Use of the 623 has resulted in substantial savaings in weight, volume, and dollar resources on at least 11 scientific instruments to be flown on 4 NASA spacecraft. The design, construction, and application of the 623 are described.

  13. Automatic Parametric Testing Of Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Jennings, Glenn A.; Pina, Cesar A.

    1989-01-01

    Computer program for parametric testing saves time and effort in research and development of integrated circuits. Software system automatically assembles various types of test structures and lays them out on silicon chip, generates sequency of test instructions, and interprets test data. Employs self-programming software; needs minimum of human intervention. Adapted to needs of different laboratories and readily accommodates new test structures. Program codes designed to be adaptable to most computers and test equipment now in use. Written in high-level languages to enhance transportability.

  14. Laser applications in integrated circuit packaging

    NASA Astrophysics Data System (ADS)

    Lu, Yongfeng; Song, Wen D.; Ren, ZhongMin; An, Chengwu; Ye, Kaidong D.; Liu, DaMing; Wang, Weijie; Hong, Ming Hui; Chong, Tow Chong

    2002-06-01

    Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash form heat sinks and lead wires of IC packages, laser singulation of BGA and CSP, laser reflow of solder ball on GBA, laser marking on packages and on SI wafers. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to b taken into account. Monitoring of laser-induced plasma and laser induced acoustic wave has been used to understand and to control the processes involved in these applications.

  15. Tool For Tinning Integrated-Circuit Leads

    NASA Technical Reports Server (NTRS)

    Prosser, Gregory N.

    1988-01-01

    As many as eight flatpacks held. Tool made of fiberglass boards. Clamps row of flatpacks by their leads so leads on opposite side of packages dipped. After dipping, nuts on boards loosened, flatpacks turned around, nuts retightened, and untinned leads dipped. Strips of magnetic material grip leads of flatpacks (made of Kovar, magnetic iron/nickel/cobalt alloy) while boards repositioned. Micrometerlike screw used to adjust exposed width of magnetic strip to suit dimensions of flatpacks. Holds flatpack integrated circuits so leads tinned. Accommodates several flatpacks for simultaneous dipping of leads in molten solder. Adjusts to accept flatpacks in range of sizes.

  16. Integrated-Circuit Broadband Infrared Sources

    NASA Technical Reports Server (NTRS)

    Lamb, G.; Jhabvala, M.; Burgess, A.

    1989-01-01

    Microscopic devices consume less power, run hotter, and are more reliable. Simple, compact, lightweight, rapidly-responding reference sources of broadband infrared radiation made available by integrated-circuit technology. Intended primarily for use in calibration of remote-sensing infrared instruments, devices eventually replace conventional infrared sources. New devices also replace present generation of miniature infrared sources. Self-passivating nature of poly-crystalline silicon adds to reliability of devices. Maximum operating temperature is 1,000 K, and power dissipation is only one-fourth that of prior devices.

  17. Accelerating functional verification of an integrated circuit

    SciTech Connect

    Deindl, Michael; Ruedinger, Jeffrey Joseph; Zoellin, Christian G.

    2015-10-27

    Illustrative embodiments include a method, system, and computer program product for accelerating functional verification in simulation testing of an integrated circuit (IC). Using a processor and a memory, a serial operation is replaced with a direct register access operation, wherein the serial operation is configured to perform bit shifting operation using a register in a simulation of the IC. The serial operation is blocked from manipulating the register in the simulation of the IC. Using the register in the simulation of the IC, the direct register access operation is performed in place of the serial operation.

  18. Scipion: A software framework toward integration, reproducibility and validation in 3D electron microscopy.

    PubMed

    de la Rosa-Trevín, J M; Quintana, A; Del Cano, L; Zaldívar, A; Foche, I; Gutiérrez, J; Gómez-Blanco, J; Burguet-Castell, J; Cuenca-Alba, J; Abrishami, V; Vargas, J; Otón, J; Sharov, G; Vilas, J L; Navas, J; Conesa, P; Kazemi, M; Marabini, R; Sorzano, C O S; Carazo, J M

    2016-07-01

    In the past few years, 3D electron microscopy (3DEM) has undergone a revolution in instrumentation and methodology. One of the central players in this wide-reaching change is the continuous development of image processing software. Here we present Scipion, a software framework for integrating several 3DEM software packages through a workflow-based approach. Scipion allows the execution of reusable, standardized, traceable and reproducible image-processing protocols. These protocols incorporate tools from different programs while providing full interoperability among them. Scipion is an open-source project that can be downloaded from http://scipion.cnb.csic.es. PMID:27108186

  19. Electro-optical Probing Of Terahertz Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Bhasin, K. B.; Romanofsky, R.; Whitaker, J. F.; Valdmanis, J. A.; Mourou, G.; Jackson, T. A.

    1990-01-01

    Electro-optical probe developed to perform noncontact, nondestructive, and relatively noninvasive measurements of electric fields over broad spectrum at millimeter and shorter wavelengths in integrated circuits. Manipulated with conventional intregrated-circuit-wafer-probing equipment and operated without any special preparation of integrated circuits. Tip of probe small electro-optical crystal serving as proximity electric-field sensor.

  20. Spread Of Charge From Ion Tracks In Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Zoutendyk, John A.; Schwartz, Harvey R.; Watson, R. Kevin; Nevill, Leland R.

    1989-01-01

    Single-event upsets (SEU's) propagate to adjacent cells in integrated memory circuits. Findings of experiments in lateral transport of electrical-charge carriers from ion tracks in 256K dynamic randon-access memories (DRAM's). As dimensions of integrated circuits decrease, vulnerability to SEU's increases. Understanding gained enables design of less vulnerable circuits.

  1. The OpenEarth Framework (OEF) for the 3D Visualization of Integrated Earth Science Data

    NASA Astrophysics Data System (ADS)

    Nadeau, David; Moreland, John; Baru, Chaitan; Crosby, Chris

    2010-05-01

    Data integration is increasingly important as we strive to combine data from disparate sources and assemble better models of the complex processes operating at the Earth's surface and within its interior. These data are often large, multi-dimensional, and subject to differing conventions for data structures, file formats, coordinate spaces, and units of measure. When visualized, these data require differing, and sometimes conflicting, conventions for visual representations, dimensionality, symbology, and interaction. All of this makes the visualization of integrated Earth science data particularly difficult. The OpenEarth Framework (OEF) is an open-source data integration and visualization suite of applications and libraries being developed by the GEON project at the University of California, San Diego, USA. Funded by the NSF, the project is leveraging virtual globe technology from NASA's WorldWind to create interactive 3D visualization tools that combine and layer data from a wide variety of sources to create a holistic view of features at, above, and beneath the Earth's surface. The OEF architecture is open, cross-platform, modular, and based upon Java. The OEF's modular approach to software architecture yields an array of mix-and-match software components for assembling custom applications. Available modules support file format handling, web service communications, data management, user interaction, and 3D visualization. File parsers handle a variety of formal and de facto standard file formats used in the field. Each one imports data into a general-purpose common data model supporting multidimensional regular and irregular grids, topography, feature geometry, and more. Data within these data models may be manipulated, combined, reprojected, and visualized. The OEF's visualization features support a variety of conventional and new visualization techniques for looking at topography, tomography, point clouds, imagery, maps, and feature geometry. 3D data such as

  2. Technologies for highly parallel optoelectronic integrated circuits

    SciTech Connect

    Lear, K.L.

    1994-10-01

    While summarily reviewing the range of optoelectronic integrated circuits (OEICs), this paper emphasizes technology for highly parallel optical interconnections. Market volume and integration suitability considerations highlight board-to-board interconnects within systems as an initial insertion point for large OEIC production. The large channel count of these intrasystem interconnects necessitates two-dimensional laser transmitter and photoreceiver arrays. Surface normal optoelectronic components are promoted as a basis for OEICs in this application. An example system is discussed that uses vertical cavity surface emitting lasers for optical buses between layers of stacked multichip modules. Another potentially important application for highly parallel OEICs is optical routing or packet switching, and examples of such systems based on smart pixels are presented.

  3. Integrating 3D seismic curvature and curvature gradient attributes for fracture characterization: Methodologies and interpretational implications

    SciTech Connect

    Gao, Dengliang

    2013-03-01

    In 3D seismic interpretation, curvature is a popular attribute that depicts the geometry of seismic reflectors and has been widely used to detect faults in the subsurface; however, it provides only part of the solutions to subsurface structure analysis. This study extends the curvature algorithm to a new curvature gradient algorithm, and integrates both algorithms for fracture detection using a 3D seismic test data set over Teapot Dome (Wyoming). In fractured reservoirs at Teapot Dome known to be formed by tectonic folding and faulting, curvature helps define the crestal portion of the reservoirs that is associated with strong seismic amplitude and high oil productivity. In contrast, curvature gradient helps better define the regional northwest-trending and the cross-regional northeast-trending lineaments that are associated with weak seismic amplitude and low oil productivity. In concert with previous reports from image logs, cores, and outcrops, the current study based on an integrated seismic curvature and curvature gradient analysis suggests that curvature might help define areas of enhanced potential to form tensile fractures, whereas curvature gradient might help define zones of enhanced potential to develop shear fractures. In certain fractured reservoirs such as at Teapot Dome where faulting and fault-related folding contribute dominantly to the formation and evolution of fractures, curvature and curvature gradient attributes can be potentially applied to differentiate fracture mode, to predict fracture intensity and orientation, to detect fracture volume and connectivity, and to model fracture networks.

  4. 3D simulation of integrated multi-coil ICP source with azimuthal modes

    NASA Astrophysics Data System (ADS)

    Brcka, Jozef

    2015-09-01

    Integrated multi-coil (IMC) planar ICP source with azimuthal motion is presented. Scaling ICP sources to larger substrate size is always complicated due to many technical issues and is challenged by the plasma chemistry. The source described in this work has capability of azimuthally moving plasma and has potential for large area and high density plasma applications. Hence, this system does not have an ideal axial symmetry, the 3D model approach has to be used to assess its transient performance. Moreover, reactor walls are imposing stronger boundary conditions on distribution of the radicals in ``off-axis reactive plasma.'' Intrinsic asymmetry of source and plasma were investigated by 3D fluid model developed under Plasma Module framework and supported by COMSOL Multiphysics solvers. Operation modes have potential to control plasma distribution, reaction chemistry and increase/modulate radicals' production. Simulation confirmed assumption that plasma distribution may essentially change in different gas. Under specific conditions integrated multi-coil ICP source is producing pulsed plasma. Temporal, spatial and population plasma characteristics were investigated in an inert carrier gas (Ar) and reactive plasma consisting of several gases (Ar, H2, CO and CH4).

  5. Integrated Avionics System (IAS), integrating 3-D technology on a spacecraft panel

    NASA Technical Reports Server (NTRS)

    Hunter, D. J.

    2002-01-01

    A novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes.

  6. Algorithm development with the integrated vision system to get the 3D location data

    NASA Astrophysics Data System (ADS)

    Lee, Ji-hyeon; Kim, Moo-hyun; Kim, Yeong-kyeong; Park, Mu-hun

    2011-10-01

    This paper introduces an Integrated Vision System that enables us to detect the image of slabs and coils and get the complete three dimensional location data without any other obstacles in the field of unmanned-crane automation system. Existing laser scanner research tends to be easily influenced by the environment of the work place and therefore cannot give the exact location information. Also, CCD cameras have some problems recognizing the pattern because of the illumination intensity caused in an industrial setting. To overcome these two weaknesses, this thesis suggests laser scanners should be combined with a CCD camera named Integrated Vision System. This system can draw clearer pictures and take advanced 3D location information. The suggested system is expected to help improve the unmanned-crane automation system.

  7. Distributed network of integrated 3D sensors for transportation security applications

    NASA Astrophysics Data System (ADS)

    Hejmadi, Vic; Garcia, Fred

    2009-05-01

    The US Port Security Agency has strongly emphasized the needs for tighter control at transportation hubs. Distributed arrays of miniature CMOS cameras are providing some solutions today. However, due to the high bandwidth required and the low valued content of such cameras (simple video feed), large computing power and analysis algorithms as well as control software are needed, which makes such an architecture cumbersome, heavy, slow and expensive. We present a novel technique by integrating cheap and mass replicable stealth 3D sensing micro-devices in a distributed network. These micro-sensors are based on conventional structures illumination via successive fringe patterns on the object to be sensed. The communication bandwidth between each sensor remains very small, but is of very high valued content. Key technologies to integrate such a sensor are digital optics and structured laser illumination.

  8. CISUS: an integrated 3D ultrasound system for IGT using a modular tracking API

    NASA Astrophysics Data System (ADS)

    Boctor, Emad M.; Viswanathan, Anand; Pieper, Steve; Choti, Michael A.; Taylor, Russell H.; Kikinis, Ron; Fichtinger, Gabor

    2004-05-01

    Ultrasound has become popular in clinical/surgical applications, both as the primary image guidance modality and also in conjunction with other modalities like CT or MRI. Three dimensional ultrasound (3DUS) systems have also demonstrated usefulness in image-guided therapy (IGT). At the same time, however, current lack of open-source and open-architecture multi-modal medical visualization systems prevents 3DUS from fulfilling its potential. Several stand-alone 3DUS systems, like Stradx or In-Vivo exist today. Although these systems have been found to be useful in real clinical setting, it is difficult to augment their functionality and integrate them in versatile IGT systems. To address these limitations, a robotic/freehand 3DUS open environment (CISUS) is being integrated into the 3D Slicer, an open-source research tool developed for medical image analysis and surgical planning. In addition, the system capitalizes on generic application programming interfaces (APIs) for tracking devices and robotic control. The resulting platform-independent open-source system may serve as a valuable tool to the image guided surgery community. Other researchers could straightforwardly integrate the generic CISUS system along with other functionalities (i.e. dual view visualization, registration, real-time tracking, segmentation, etc) to rapidly create their medical/surgical applications. Our current driving clinical application is robotically assisted and freehand 3DUS-guided liver ablation, which is fully being integrated under the CISUS-3D Slicer. Initial functionality and pre-clinical feasibility are demonstrated on phantom and ex-vivo animal models.

  9. 77 FR 4982 - Solicitation of Input From Stakeholders Regarding the Smith-Lever 3(d) Extension Integrated Pest...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-02-01

    ...-Lever 3(d) Extension Integrated Pest Management Competitive Grants Program AGENCY: National Institute of...(d) of the Smith-Lever Act (7 U.S.C. 343(d)) to provide the ] opportunity for 1862 and 1890 Land... agency, CSREES, on October 6, 2008 and March 26, 2009 about the restructuring of the Smith-Lever 3(d)...

  10. Scientific Subsurface data for EPOS - integration of 3D and 4D data services

    NASA Astrophysics Data System (ADS)

    Kerschke, Dorit; Hammitzsch, Martin; Wächter, Joachim

    2016-04-01

    The provision of efficient and easy access to scientific subsurface data sets obtained from field studies and scientific observatories or by geological 3D/4D-modeling is an important contribution to modern research infrastructures as they can facilitate the integrated analysis and evaluation as well as the exchange of scientific data. Within the project EPOS - European Plate Observing System, access to 3D and 4D data sets will be provided by 'WP15 - Geological information and modeling' and include structural geology models as well as numerical models, e.g., temperature, aquifers, and velocity. This also includes validated raw data, e.g., seismic profiles, from which the models where derived. All these datasets are of high quality and of unique scientific value as the process of modeling is time and cost intensive. However, these models are currently not easily accessible for the wider scientific community, much less to the public. For the provision of these data sets a data management platform based on common and standardized data models, protocols, and encodings as well as on a predominant use of Free and Open Source Software (FOSS) has been devised. The interoperability for disciplinary and domain applications thus highly depends on the adoption of generally agreed technologies and standards (OGC, ISO…) originating from Spatial Data Infrastructure related efforts (e.g., INSPIRE). However, since not many standards for 3D and 4D geological data exists, this work also includes new approaches for project data management, interfaces for tools used by the researchers, and interfaces for the sharing and reusing of data.

  11. Illustrating Surface Shape in Volume Data via Principal Direction-Driven 3D Line Integral Convolution

    NASA Technical Reports Server (NTRS)

    Interrante, Victoria

    1997-01-01

    The three-dimensional shape and relative depth of a smoothly curving layered transparent surface may be communicated particularly effectively when the surface is artistically enhanced with sparsely distributed opaque detail. This paper describes how the set of principal directions and principal curvatures specified by local geometric operators can be understood to define a natural 'flow' over the surface of an object, and can be used to guide the placement of the lines of a stroke texture that seeks to represent 3D shape information in a perceptually intuitive way. The driving application for this work is the visualization of layered isovalue surfaces in volume data, where the particular identity of an individual surface is not generally known a priori and observers will typically wish to view a variety of different level surfaces from the same distribution, superimposed over underlying opaque structures. By advecting an evenly distributed set of tiny opaque particles, and the empty space between them, via 3D line integral convolution through the vector field defined by the principal directions and principal curvatures of the level surfaces passing through each gridpoint of a 3D volume, it is possible to generate a single scan-converted solid stroke texture that may intuitively represent the essential shape information of any level surface in the volume. To generate longer strokes over more highly curved areas, where the directional information is both most stable and most relevant, and to simultaneously downplay the visual impact of directional information in the flatter regions, one may dynamically redefine the length of the filter kernel according to the magnitude of the maximum principal curvature of the level surface at the point around which it is applied.

  12. The Avignon Bridge: a 3d Reconstruction Project Integrating Archaeological, Historical and Gemorphological Issues

    NASA Astrophysics Data System (ADS)

    Berthelot, M.; Nony, N.; Gugi, L.; Bishop, A.; De Luca, L.

    2015-02-01

    The history and identity of the Avignon's bridge is inseparable from that of the Rhône river. Therefore, in order to share the history and memory of the Rhône, it is essential to get to know this bridge and especially to identify and make visible the traces of its past, its construction, its interaction with the river dynamics, which greatly influenced his life. These are the objectives of the PAVAGE project that focuses on digitally surveying, modelling and re-visiting a heritage site of primary importance with the aim of virtually restoring the link between the two sides which, after the disappearance of the Roman bridge of Arles, constituted for a long time the only connection between Lyon or Vienna and the sea. Therefore, this project has an important geo-historical dimension for which geo-morphological and paleoenvironmental studies were implemented in connection with the latest digital simulation methods exploiting geographic information systems. By integrating knowledge and reflections of archaeologists, historians, geomorphologists, environmentalists, architects, engineers and computer scientists, the result of this project (which involved 5 laboratories during 4 years) is a 3D digital model covering an extension of 50 km2 achieved by integrating satellite imagery, UAV-based acquisitions, terrestrial laser scanning and photogrammetry, etc. Beyond the actions of scientific valorisation concerning the historical and geomorphological dimensions of the project, the results of this work of this interdisciplinary investigation and interpretation of this site are today integrated within a location-based augmented reality application allowing tourists to exploring the virtual reconstruction of the bridge and its environment through tablets inside the portion of territory covered by this project (between Avignon and Villeneuve-lez-Avignon). This paper presents the main aspects of the 3D virtual reconstruction approach.

  13. 3D printed electromagnetic transmission and electronic structures fabricated on a single platform using advanced process integration techniques

    NASA Astrophysics Data System (ADS)

    Deffenbaugh, Paul Issac

    3D printing has garnered immense attention from many fields including in-office rapid prototyping of mechanical parts, outer-space satellite replication, garage functional firearm manufacture, and NASA rocket engine component fabrication. 3D printing allows increased design flexibility in the fabrication of electronics, microwave circuits and wireless antennas and has reached a level of maturity which allows functional parts to be printed. Much more work is necessary in order to perfect the processes of 3D printed electronics especially in the area of automation. Chapter 1 shows several finished prototypes of 3D printed electronics as well as newly developed techniques in fabrication. Little is known about the RF and microwave properties and applications of the standard materials which have been developed for 3D printing. Measurement of a wide variety of materials over a broad spectrum of frequencies up to 10 GHz using a variety of well-established measurement methods is performed throughout chapter 2. Several types of high frequency RF transmission lines are fabricated and valuable model-matched data is gathered and provided in chapter 3 for future designers' use. Of particular note is a fully 3D printed stripline which was automatically fabricated in one process on one machine. Some core advantages of 3D printing RF/microwave components include rapid manufacturing of complex, dimensionally sensitive circuits (such as antennas and filters which are often iteratively tuned) and the ability to create new devices that cannot be made using standard fabrication techniques. Chapter 4 describes an exemplary fully 3D printed curved inverted-F antenna.

  14. First Steps Towards AN Integrated Citygml-Based 3d Model of Vienna

    NASA Astrophysics Data System (ADS)

    Agugiaro, G.

    2016-06-01

    This paper presents and discusses the results regarding the initial steps (selection, analysis, preparation and eventual integration of a number of datasets) for the creation of an integrated, semantic, three-dimensional, and CityGML-based virtual model of the city of Vienna. CityGML is an international standard conceived specifically as information and data model for semantic city models at urban and territorial scale. It is being adopted by more and more cities all over the world. The work described in this paper is embedded within the European Marie-Curie ITN project "Ci-nergy, Smart cities with sustainable energy systems", which aims, among the rest, at developing urban decision making and operational optimisation software tools to minimise non-renewable energy use in cities. Given the scope and scale of the project, it is therefore vital to set up a common, unique and spatio-semantically coherent urban model to be used as information hub for all applications being developed. This paper reports about the experiences done so far, it describes the test area and the available data sources, it shows and exemplifies the data integration issues, the strategies developed to solve them in order to obtain the integrated 3D city model. The first results as well as some comments about their quality and limitations are presented, together with the discussion regarding the next steps and some planned improvements.

  15. THREE DIMENSIONAL INTEGRATED CHARACTERIZATION AND ARCHIVING SYSTEM (3D-ICAS)

    SciTech Connect

    George Jarvis

    2001-06-18

    The overall objective of this project is to develop an integrated system that remotely characterizes, maps, and archives measurement data of hazardous decontamination and decommissioning (D&D) areas. The system will generate a detailed 3-dimensional topography of the area as well as real-time quantitative measurements of volatile organics and radionuclides. The system will analyze substrate materials consisting of concrete, asbestos, and transite. The system will permanently archive the data measurements for regulatory and data integrity documentation. Exposure limits, rest breaks, and donning and removal of protective garments generate waste in the form of contaminated protective garments and equipment. Survey times are increased and handling and transporting potentially hazardous materials incur additional costs. Off-site laboratory analysis is expensive and time-consuming, often necessitating delay of further activities until results are received. The Three Dimensional Integrated Characterization and Archiving System (3D-ICAS) has been developed to alleviate some of these problems. 3D-ICAS provides a flexible system for physical, chemical and nuclear measurements reduces costs and improves data quality. Operationally, 3D-ICAS performs real-time determinations of hazardous and toxic contamination. A prototype demonstration unit is available for use in early 2000. The tasks in this Phase included: (1) Mobility Platforms: Integrate hardware onto mobility platforms, upgrade surface sensors, develop unit operations and protocol. (2) System Developments: Evaluate metals detection capability using x-ray fluorescence technology. (3) IWOS Upgrades: Upgrade the IWOS software and hardware for compatibility with mobility platform. The system was modified, tested and debugged during 1999 and 2000. The 3D-ICAS was shipped on 11 May 2001 to FIU-HCET for demonstration and validation of the design modifications. These modifications included simplifying the design from a two

  16. Integrated Interventional Devices For Real Time 3D Ultrasound Imaging and Therapy

    NASA Astrophysics Data System (ADS)

    Smith, Stephen W.; Lee, Warren; Gentry, Kenneth L.; Pua, Eric C.; Light, Edward D.

    2006-05-01

    Two recent advances have expanded the potential of medical ultrasound: the introduction of real-time 3-D ultrasound imaging with catheter, transesophageal and laparoscopic probes and the development of interventional ultrasound therapeutic systems for focused ultrasound surgery, ablation and ultrasound enhanced drug delivery. This work describes devices combining both technologies. A series of transducer probes have been designed, fabricated and tested including: 1) a 12 French side scanning catheter incorporating a 64 element matrix array for imaging at 5MHz and a piston ablation transducer operating at 10 MHz. 2) a 14 Fr forward-scanning catheter integrating a 112 element 2-D array for imaging at 5 MHz encircled by an ablation annulus operating at 10 MHz. Finite element modeling was then used to simulate catheter annular and linear phased array transducers for ablation. 3) Linear phased array transducers were built to confirm the finite element analysis at 4 and 8 MHz including a mechanically focused 86 element 9 MHz array which transmits an ISPTA of 29.3 W/cm2 and creates a lesion in 2 minutes. 4) 2-D arrays of 504 channels operating at 5 MHz have been developed for transesophageal and laparascopic 3D imaging as well as therapeutic heating. All the devices image the heart anatomy including atria, valves, septa and en face views of the pulmonary veins.

  17. The cross-correlation between 3D cosmic shear and the integrated Sachs-Wolfe effect

    NASA Astrophysics Data System (ADS)

    Zieser, Britta; Merkel, Philipp M.

    2016-06-01

    We present the first calculation of the cross-correlation between 3D cosmic shear and the integrated Sachs-Wolfe (iSW) effect. Both signals are combined in a single formalism, which permits the computation of the full covariance matrix. In order to avoid the uncertainties presented by the non-linear evolution of the matter power spectrum and intrinsic alignments of galaxies, our analysis is restricted to large scales, i.e. multipoles below ℓ = 1000. We demonstrate in a Fisher analysis that this reduction compared to other studies of 3D weak lensing extending to smaller scales is compensated by the information that is gained if the additional iSW signal and in particular its cross-correlation with lensing data are considered. Given the observational standards of upcoming weak-lensing surveys like Euclid, marginal errors on cosmological parameters decrease by 10 per cent compared to a cosmic shear experiment if both types of information are combined without a cosmic wave background (CMB) prior. Once the constraining power of CMB data is added, the improvement becomes marginal.

  18. Thin-dielectric-layer engineering for 3D nanostructure integration using an innovative planarization approach

    NASA Astrophysics Data System (ADS)

    Guerfi, Y.; Doucet, J. B.; Larrieu, G.

    2015-10-01

    Three-dimensional (3D) nanostructures are emerging as promising building blocks for a large spectrum of applications. One critical issue in integration regards mastering the thin, flat, and chemically stable insulating layer that must be implemented on the nanostructure network in order to build striking nano-architectures. In this letter, we report an innovative method for nanoscale planarization on 3D nanostructures by using hydrogen silesquioxane as a spin-on-glass (SOG) dielectric material. To decouple the thickness of the final layer from the height of the nanostructure, we propose to embed the nanowire network in the insulator layer by exploiting the planarizing properties of the SOG approach. To achieve the desired dielectric thickness, the structure is chemically etched back with a highly diluted solution to control the etch rate precisely. The roughness of the top surface was less than 2 nm. There were no surface defects and the planarity was excellent, even in the vicinity of the nanowires. This newly developed process was used to realize a multilevel stack architecture with sub-deca-nanometer-range layer thickness.

  19. Multiple-mode Lamb wave scattering simulations using 3D elastodynamic finite integration technique.

    PubMed

    Leckey, Cara A C; Rogge, Matthew D; Miller, Corey A; Hinders, Mark K

    2012-02-01

    We have implemented three-dimensional (3D) elastodynamic finite integration technique (EFIT) simulations to model Lamb wave scattering for two flaw-types in an aircraft-grade aluminum plate, a rounded rectangle flat-bottom hole and a disbond of the same shape. The plate thickness and flaws explored in this work include frequency-thickness regions where several Lamb wave modes exist and sometimes overlap in phase and/or group velocity. For the case of the flat-bottom hole the depth was incrementally increased to explore progressive changes in multiple-mode Lamb wave scattering due to the damage. The flat-bottom hole simulation results have been compared to experimental data and are shown to provide key insight for this well-defined experimental case by explaining unexpected results in experimental waveforms. For the rounded rectangle disbond flaw, which would be difficult to implement experimentally, we found that Lamb wave behavior differed significantly from the flat-bottom hole flaw. Most of the literature in this field is restricted to low frequency-thickness regions due to difficulties in interpreting data when multiple modes exist. We found that benchmarked 3D EFIT simulations can yield an understanding of scattering behavior for these higher frequency-thickness regions and in cases that would be difficult to set up experimentally. Additionally, our results show that 2D simulations would not have been sufficient for modeling the complicated scattering that occurred. PMID:21908011

  20. Subminiature deflection circuit operates integrated sweep circuits in TV camera

    NASA Technical Reports Server (NTRS)

    Schaff, F. L.

    1967-01-01

    Small magnetic sweep deflection circuits operate a hand-held lunar television camera. They convert timing signals from the synchronizer into waveforms that provide a raster on the vidicon target. Raster size remains constant and linear during wide voltage and temperature fluctuations.

  1. Integrated optical circuits for numerical computation

    NASA Technical Reports Server (NTRS)

    Verber, C. M.; Kenan, R. P.

    1983-01-01

    The development of integrated optical circuits (IOC) for numerical-computation applications is reviewed, with a focus on the use of systolic architectures. The basic architecture criteria for optical processors are shown to be the same as those proposed by Kung (1982) for VLSI design, and the advantages of IOCs over bulk techniques are indicated. The operation and fabrication of electrooptic grating structures are outlined, and the application of IOCs of this type to an existing 32-bit, 32-Mbit/sec digital correlator, a proposed matrix multiplier, and a proposed pipeline processor for polynomial evaluation is discussed. The problems arising from the inherent nonlinearity of electrooptic gratings are considered. Diagrams and drawings of the application concepts are provided.

  2. Post irradiation effects (PIE) in integrated circuits

    NASA Technical Reports Server (NTRS)

    Shaw, D. C.; Lowry, L.; Barnes, C.; Zakharia, M.; Agarwal, S.; Rax, B.

    1991-01-01

    Post-irradiation effects (PIE) ranging from normal recovery to catastrophic failure have been observed in integrated circuits during the PIE period. Data presented show failure due to rebound after a 10 krad(Si) dose. In particular, five device types are investigated with varying PIE response. Special attention has been given to the HI1-507A analog multiplexer because its PIE response is extreme. X-ray diffraction has been uniquely employed to measure physical stress in the HI1-507A metallization. An attempt has been made to show a relationship between stress relaxation and radiation effects. All data presented support the current MIL-STD Method 1019.4 but demonstrate the importance of performing PIE measurements, even when mission doses are as low as 10 krad(Si).

  3. Radiation effects on power integrated circuits

    SciTech Connect

    Darwish, M.N.; Dolly, M.C.; Goodwin, C.A.; Titus, J.L

    1988-12-01

    A study was initiated to investigate the effects of gamma (total ionizing dose), prompt gamma (gamma dot), and neutron radiation on commercially available power integrated circuits (PIC's). A Dielectric Isolated (DI) Bipolar-CMOS-DMOS (BCDMOS) technology developed at AT and T Bell Laboratories was selected for this characterization. Total ionizing dose testing resulted in device failure at 30 krads (Si). Gamma dot testing (30 ns pulsewidth) resulted in device failure due to transient upset of the CMOS logic at 1.0 E+09 rads(Si)/s. Neutron testing resulted in severe degradation in performance, but devices remained functional after receiving a fluence of 2.0 E+14 n/cm/sup 2/. Also, an attempt was made to harden the BCDMOS technology to gamma radiation. Devices from eight processing splits were characterized to determine if specific process changes would improve their performance.

  4. Monolithic microwave integrated circuit water vapor radiometer

    NASA Technical Reports Server (NTRS)

    Sukamto, L. M.; Cooley, T. W.; Janssen, M. A.; Parks, G. S.

    1991-01-01

    A proof of concept Monolithic Microwave Integrated Circuit (MMIC) Water Vapor Radiometer (WVR) is under development at the Jet Propulsion Laboratory (JPL). WVR's are used to remotely sense water vapor and cloud liquid water in the atmosphere and are valuable for meteorological applications as well as for determination of signal path delays due to water vapor in the atmosphere. The high cost and large size of existing WVR instruments motivate the development of miniature MMIC WVR's, which have great potential for low cost mass production. The miniaturization of WVR components allows large scale deployment of WVR's for Earth environment and meteorological applications. Small WVR's can also result in improved thermal stability, resulting in improved calibration stability. Described here is the design and fabrication of a 31.4 GHz MMIC radiometer as one channel of a thermally stable WVR as a means of assessing MMIC technology feasibility.

  5. Extra high speed modified Lundell alternator parameters and open/short-circuit characteristics from global 3D-FE magnetic field solutions

    NASA Technical Reports Server (NTRS)

    Wang, R.; Demerdash, N. A.

    1992-01-01

    The combined magnetic vector potential - magnetic scalar potential method of computation of 3D magnetic fields by finite elements, introduced in a companion paper, is used for global 3D field analysis and machine performance computations under open-circuit and short-circuit conditions for an example 14.3 kVA modified Lundell alternator, whose magnetic field is of intrinsic 3D nature. The computed voltages and currents under these machine test conditions were verified and found to be in very good agreement with corresponding test data. Results of use of this modelling and computation method in the study of a design alteration example, in which the stator stack length of the example alternator is stretched in order to increase voltage and volt-ampere rating, are given here. These results demonstrate the inadequacy of conventional 2D-based design concepts and the imperative of use of this type of 3D magnetic field modelling in the design and investigation of such machines.

  6. Real-time computer-generated integral imaging and 3D image calibration for augmented reality surgical navigation.

    PubMed

    Wang, Junchen; Suenaga, Hideyuki; Liao, Hongen; Hoshi, Kazuto; Yang, Liangjing; Kobayashi, Etsuko; Sakuma, Ichiro

    2015-03-01

    Autostereoscopic 3D image overlay for augmented reality (AR) based surgical navigation has been studied and reported many times. For the purpose of surgical overlay, the 3D image is expected to have the same geometric shape as the original organ, and can be transformed to a specified location for image overlay. However, how to generate a 3D image with high geometric fidelity and quantitative evaluation of 3D image's geometric accuracy have not been addressed. This paper proposes a graphics processing unit (GPU) based computer-generated integral imaging pipeline for real-time autostereoscopic 3D display, and an automatic closed-loop 3D image calibration paradigm for displaying undistorted 3D images. Based on the proposed methods, a novel AR device for 3D image surgical overlay is presented, which mainly consists of a 3D display, an AR window, a stereo camera for 3D measurement, and a workstation for information processing. The evaluation on the 3D image rendering performance with 2560×1600 elemental image resolution shows the rendering speeds of 50-60 frames per second (fps) for surface models, and 5-8 fps for large medical volumes. The evaluation of the undistorted 3D image after the calibration yields sub-millimeter geometric accuracy. A phantom experiment simulating oral and maxillofacial surgery was also performed to evaluate the proposed AR overlay device in terms of the image registration accuracy, 3D image overlay accuracy, and the visual effects of the overlay. The experimental results show satisfactory image registration and image overlay accuracy, and confirm the system usability. PMID:25465067

  7. W88 integrated circuit shelf life program

    SciTech Connect

    Soden, J.M.; Anderson, R.E.

    1998-01-01

    The W88 Integrated Circuit Shelf Life Program was created to monitor the long term performance, reliability characteristics, and technological status of representative WR ICs manufactured by the Allied Signal Albuquerque Microelectronics Operation (AMO) and by Harris Semiconductor Custom Integrated Circuits Division. Six types of ICs were used. A total of 272 ICs entered two storage temperature environments. Electrical testing and destructive physical analysis were completed in 1995. During each year of the program, the ICs were electrically tested and samples were selected for destructive physical analysis (DPA). ICs that failed electrical tests or DPA criteria were analyzed. Fifteen electrical failures occurred, with two dominant failure modes: electrical overstress (EOS) damage involving the production test programs and electrostatic discharge (ESD) damage during analysis. Because of the extensive handling required during multi-year programs like this, it is not unusual for EOS and ESD failures to occur even though handling and testing precautions are taken. The clustering of the electrical test failures in a small subset of the test operations supports the conclusion that the test operation itself was responsible for many of the failures and is suspected to be responsible for the others. Analysis of the electrical data for the good ICs found no significant degradation trends caused by the storage environments. Forty-six ICs were selected for DPA with findings primarily in two areas: wire bonding and die processing. The wire bonding and die processing findings are not surprising since these technology conditions had been documented during manufacturing and were determined to present acceptable risk. The current reliability assessment of the W88 stockpile assemblies employing these and related ICs is reinforced by the results of this shelf life program. Data from this program will aid future investigation of 4/3 micron or MNOS IC technology failure modes.

  8. FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration

    NASA Astrophysics Data System (ADS)

    Fenouillet-Beranger, C.; Previtali, B.; Batude, P.; Nemouchi, F.; Cassé, M.; Garros, X.; Tosti, L.; Rambal, N.; Lafond, D.; Dansas, H.; Pasini, L.; Brunet, L.; Deprat, F.; Grégoire, M.; Mellier, M.; Vinet, M.

    2015-11-01

    To set up specification for 3D monolithic integration, for the first time, the thermal stability of state-of-the-art FDSOI (Fully Depleted SOI) transistors electrical performance is quantified. Post fabrication annealings are performed on FDSOI transistors to mimic the thermal budget associated to top layer processing. Degradation of the silicide for thermal treatments beyond 400 °C is identified as the main responsible for performance degradation for PMOS devices. For the NMOS transistors, arsenic (As) and phosphorus (P) dopants deactivation adds up to this effect. By optimizing both the n-type extension implantations and the bottom silicide process, thermal stability of FDSOI can be extended to allow relaxing upwards the thermal budget authorized for top transistors processing.

  9. 3D-NTT: a versatile integral field spectro-imager for the NTT

    NASA Astrophysics Data System (ADS)

    Marcelin, M.; Amram, P.; Balard, P.; Balkowski, C.; Boissin, O.; Boulesteix, J.; Carignan, C.; Daigle, O.; de Denus Baillargeon, M.-M.; Epinat, B.; Gach, J.-L.; Hernandez, O.; Rigaud, F.; Vallée, P.

    2008-07-01

    The 3D-NTT is a visible integral field spectro-imager offering two modes. A low resolution mode (R ~ 300 to 6 000) with a large field of view Tunable Filter (17'x17') and a high resolution mode (R ~ 10 000 to 40 000) with a scanning Fabry-Perot (7'x7'). It will be operated as a visitor instrument on the NTT from 2009. Two large programmes will be led: "Characterizing the interstellar medium of nearby galaxies with 2D maps of extinction and abundances" (PI M. Marcelin) and "Gas accretion and radiative feedback in the early universe" (PI J. Bland Hawthorn). Both will be mainly based on the Tunable Filter mode. This instrument is being built as a collaborative effort between LAM (Marseille), GEPI (Paris) and LAE (Montreal). The website adress of the instrument is : http://www.astro.umontreal.ca/3DNTT

  10. Integration of the virtual 3D model of a control system with the virtual controller

    NASA Astrophysics Data System (ADS)

    Herbuś, K.; Ociepka, P.

    2015-11-01

    Nowadays the design process includes simulation analysis of different components of a constructed object. It involves the need for integration of different virtual object to simulate the whole investigated technical system. The paper presents the issues related to the integration of a virtual 3D model of a chosen control system of with a virtual controller. The goal of integration is to verify the operation of an adopted object of in accordance with the established control program. The object of the simulation work is the drive system of a tunneling machine for trenchless work. In the first stage of work was created an interactive visualization of functioning of the 3D virtual model of a tunneling machine. For this purpose, the software of the VR (Virtual Reality) class was applied. In the elaborated interactive application were created adequate procedures allowing controlling the drive system of a translatory motion, a rotary motion and the drive system of a manipulator. Additionally was created the procedure of turning on and off the output crushing head, mounted on the last element of the manipulator. In the elaborated interactive application have been established procedures for receiving input data from external software, on the basis of the dynamic data exchange (DDE), which allow controlling actuators of particular control systems of the considered machine. In the next stage of work, the program on a virtual driver, in the ladder diagram (LD) language, was created. The control program was developed on the basis of the adopted work cycle of the tunneling machine. The element integrating the virtual model of the tunneling machine for trenchless work with the virtual controller is the application written in a high level language (Visual Basic). In the developed application was created procedures responsible for collecting data from the running, in a simulation mode, virtual controller and transferring them to the interactive application, in which is verified the

  11. Integrated photo-responsive metal oxide semiconductor circuit

    NASA Technical Reports Server (NTRS)

    Jhabvala, Murzban D. (Inventor); Dargo, David R. (Inventor); Lyons, John C. (Inventor)

    1987-01-01

    An infrared photoresponsive element (RD) is monolithically integrated into a source follower circuit of a metal oxide semiconductor device by depositing a layer of a lead chalcogenide as a photoresistive element forming an ohmic bridge between two metallization strips serving as electrodes of the circuit. Voltage from the circuit varies in response to illumination of the layer by infrared radiation.

  12. Integrated gravity and gravity gradient 3D inversion using the non-linear conjugate gradient

    NASA Astrophysics Data System (ADS)

    Qin, Pengbo; Huang, Danian; Yuan, Yuan; Geng, Meixia; Liu, Jie

    2016-03-01

    Gravity data, which are critical in mineral, oil, and gas exploration, are obtained from the vertical component of the gravity field, while gravity gradient data are measured from changes in the gravity field in three directions. However, few studies have sought to improve exploration techniques by integrating gravity and gravity gradient data using inversion methods. In this study, we developed a new method to integrate gravity and gravity gradient data in a 3D density inversion using the non-linear conjugate gradient (NLCG) method and the minimum gradient support (MGS) functional to regularize the 3D inverse problem and to obtain a clear and accurate image of the anomalous body. The NLCG algorithm, which is suitable for solving large-scale nonlinear optimization problems and requires no memory storage, was compared to the Broyden-Fletcher-Goldfarb-Shanno (BFGS) quasi-Newton algorithm and the results indicated that the convergence rate of NLCG is slower, but that the storage requirement and computation time is lower. To counteract the decay in kernel function, we introduced a depth weighting function for anomalous bodies at the same depth, with information about anomalous body depth obtained from well log and seismic exploration data. For anomalous bodies at different depths, we introduced a spatial gradient weighting function to incorporate additional information obtained in the inversion. We concluded that the spatial gradient weighting function enhanced the spatial resolution of the recovered model. Furthermore, our results showed that including multiple components for inversion increased the resolution of the recovered model. We validated our model by applying our inversion method to survey data from Vinton salt dome, Louisiana, USA. The results showed good agreement with known geologic information; thus confirming the accuracy of this approach.

  13. Time And Temperature Dependent Micromechanical Properties Of Solder Joints For 3D-Package Integration

    NASA Astrophysics Data System (ADS)

    Roellig, Mike; Meier, Karsten; Metasch, Rene

    2010-11-01

    The recent development of 3D-integrated electronic packages is characterized by the need to increase the diversity of functions and to miniaturize. Currently many 3D-integration concepts are being developed and all of them demand new materials, new designs and new processing technologies. The combination of simulation and experimental investigation becomes increasingly accepted since simulations help to shorten the R&D cycle time and reduce costs. Numerical calculations like the Finite-Element-Method are strong tools to calculate stress conditions in electronic packages resulting from thermal strains due to the manufacturing process and environmental loads. It is essential for the application of numerical calculations that the material data is accurate and describes sufficiently the physical behaviour. The developed machine allows the measurement of time and temperature dependent micromechanical properties of solder joints. Solder joints, which are used to mechanically and electrically connect different packages, are physically measured as they leave the process. This allows accounting for process influences, which may change material properties. Additionally, joint sizes and metallurgical interactions between solder and under bump metallization can be respected by this particular measurement. The measurement allows the determination of material properties within a temperature range of 20° C-200° C. Further, the time dependent creep deformation can be measured within a strain-rate range of 10-31/s-10-81/s. Solder alloys based on Sn-Ag/Sn-Ag-Cu with additionally impurities and joint sizes down to O/ 200 μm were investigated. To finish the material characterization process the material model coefficient were extracted by FEM-Simulation to increase the accuracy of data.

  14. Plug-in integrated/hybrid circuit

    NASA Technical Reports Server (NTRS)

    Stringer, E. J.

    1974-01-01

    Hybrid circuitry can be installed into standard round bayonet connectors, to eliminate wiring from connector to circuit. Circuits can be connected directly into either section of connector pair, eliminating need for hard wiring to that section.

  15. Direct laser-writing of ferroelectric single-crystal waveguide architectures in glass for 3D integrated optics.

    PubMed

    Stone, Adam; Jain, Himanshu; Dierolf, Volkmar; Sakakura, Masaaki; Shimotsuma, Yasuhiko; Miura, Kiyotaka; Hirao, Kazuyuki; Lapointe, Jerome; Kashyap, Raman

    2015-01-01

    Direct three-dimensional laser writing of amorphous waveguides inside glass has been studied intensely as an attractive route for fabricating photonic integrated circuits. However, achieving essential nonlinear-optic functionality in such devices will also require the ability to create high-quality single-crystal waveguides. Femtosecond laser irradiation is capable of crystallizing glass in 3D, but producing optical-quality single-crystal structures suitable for waveguiding poses unique challenges that are unprecedented in the field of crystal growth. In this work, we use a high angular-resolution electron diffraction method to obtain the first conclusive confirmation that uniform single crystals can be grown inside glass by femtosecond laser writing under optimized conditions. We confirm waveguiding capability and present the first quantitative measurement of power transmission through a laser-written crystal-in-glass waveguide, yielding loss of 2.64 dB/cm at 1530 nm. We demonstrate uniformity of the crystal cross-section down the length of the waveguide and quantify its birefringence. Finally, as a proof-of-concept for patterning more complex device geometries, we demonstrate the use of dynamic phase modulation to grow symmetric crystal junctions with single-pass writing. PMID:25988599

  16. Direct laser-writing of ferroelectric single-crystal waveguide architectures in glass for 3D integrated optics

    PubMed Central

    Stone, Adam; Jain, Himanshu; Dierolf, Volkmar; Sakakura, Masaaki; Shimotsuma, Yasuhiko; Miura, Kiyotaka; Hirao, Kazuyuki; Lapointe, Jerome; Kashyap, Raman

    2015-01-01

    Direct three-dimensional laser writing of amorphous waveguides inside glass has been studied intensely as an attractive route for fabricating photonic integrated circuits. However, achieving essential nonlinear-optic functionality in such devices will also require the ability to create high-quality single-crystal waveguides. Femtosecond laser irradiation is capable of crystallizing glass in 3D, but producing optical-quality single-crystal structures suitable for waveguiding poses unique challenges that are unprecedented in the field of crystal growth. In this work, we use a high angular-resolution electron diffraction method to obtain the first conclusive confirmation that uniform single crystals can be grown inside glass by femtosecond laser writing under optimized conditions. We confirm waveguiding capability and present the first quantitative measurement of power transmission through a laser-written crystal-in-glass waveguide, yielding loss of 2.64 dB/cm at 1530 nm. We demonstrate uniformity of the crystal cross-section down the length of the waveguide and quantify its birefringence. Finally, as a proof-of-concept for patterning more complex device geometries, we demonstrate the use of dynamic phase modulation to grow symmetric crystal junctions with single-pass writing. PMID:25988599

  17. A 3D bioprinting system to produce human-scale tissue constructs with structural integrity.

    PubMed

    Kang, Hyun-Wook; Lee, Sang Jin; Ko, In Kap; Kengla, Carlos; Yoo, James J; Atala, Anthony

    2016-03-01

    A challenge for tissue engineering is producing three-dimensional (3D), vascularized cellular constructs of clinically relevant size, shape and structural integrity. We present an integrated tissue-organ printer (ITOP) that can fabricate stable, human-scale tissue constructs of any shape. Mechanical stability is achieved by printing cell-laden hydrogels together with biodegradable polymers in integrated patterns and anchored on sacrificial hydrogels. The correct shape of the tissue construct is achieved by representing clinical imaging data as a computer model of the anatomical defect and translating the model into a program that controls the motions of the printer nozzles, which dispense cells to discrete locations. The incorporation of microchannels into the tissue constructs facilitates diffusion of nutrients to printed cells, thereby overcoming the diffusion limit of 100-200 μm for cell survival in engineered tissues. We demonstrate capabilities of the ITOP by fabricating mandible and calvarial bone, cartilage and skeletal muscle. Future development of the ITOP is being directed to the production of tissues for human applications and to the building of more complex tissues and solid organs. PMID:26878319

  18. Method for analyzing radiation sensitivity of integrated circuits

    NASA Technical Reports Server (NTRS)

    Gauthier, M. K.; Stanley, A. G. (Inventor)

    1979-01-01

    A method for analyzing the radiation sensitivity of an integrated circuit is described to determine the components. The application of a narrow radiation beam to portions of the circuit is considered. The circuit is operated under normal bias conditions during the application of radiation in a dosage that is likely to cause malfunction of at least some transistors, while the circuit is monitored for failure of the irradiated transistor. When a radiation sensitive transistor is found, then the radiation beam is further narrowed and, using a fresh integrated circuit, a very narrow beam is applied to different parts of the transistor, such as its junctions, to locate the points of greatest sensitivity.

  19. Energy-efficient neuron, synapse and STDP integrated circuits.

    PubMed

    Cruz-Albrecht, Jose M; Yung, Michael W; Srinivasa, Narayan

    2012-06-01

    Ultra-low energy biologically-inspired neuron and synapse integrated circuits are presented. The synapse includes a spike timing dependent plasticity (STDP) learning rule circuit. These circuits have been designed, fabricated and tested using a 90 nm CMOS process. Experimental measurements demonstrate proper operation. The neuron and the synapse with STDP circuits have an energy consumption of around 0.4 pJ per spike and synaptic operation respectively. PMID:23853146

  20. Ge/Si Integrated Circuit For Infrared Imaging

    NASA Technical Reports Server (NTRS)

    Fathauer, Robert W.

    1990-01-01

    Proposed integrated circuit consists of focal-plane array of metal/germanium Schottky-barrier photodetectors on same chip with silicon-based circuits that processes signals from photodetectors. Made compatible with underlying silicon-based circuitry by growing germanium epitaxially on silicon circuit wafers. Metal deposited in ultrahigh vacuum immediately after growth of germanium. Combination of described techniques results in high-resolution infrared-imaging circuits of superior performance.

  1. Shielded silicon gate complementary MOS integrated circuit.

    NASA Technical Reports Server (NTRS)

    Lin, H. C.; Halsor, J. L.; Hayes, P. J.

    1972-01-01

    An electrostatic shield for complementary MOS integrated circuits was developed to minimize the adverse effects of stray electric fields created by the potentials in the metal interconnections. The process is compatible with silicon gate technology. N-doped polycrystalline silicon was used for all the gates and the shield. The effectiveness of the shield was demonstrated by constructing a special field plate over certain transistors. The threshold voltages obtained on an oriented silicon substrate ranged from 1.5 to 3 V for either channel. Integrated inverters performed satisfactorily from 3 to 15 V, limited at the low end by the threshold voltages and at the high end by the drain breakdown voltage of the n-channel transistors. The stability of the new structure with an n-doped silicon gate as measured by the shift in C-V curve under 200 C plus or minus 20 V temperature-bias conditions was better than conventional aluminum gate or p-doped silicon gate devices, presumably due to the doping of gate oxide with phosphorous.

  2. Stereopsis and 3D surface perception by spiking neurons in laminar cortical circuits: a method for converting neural rate models into spiking models.

    PubMed

    Cao, Yongqiang; Grossberg, Stephen

    2012-02-01

    A laminar cortical model of stereopsis and 3D surface perception is developed and simulated. The model shows how spiking neurons that interact in hierarchically organized laminar circuits of the visual cortex can generate analog properties of 3D visual percepts. The model describes how monocular and binocular oriented filtering interact with later stages of 3D boundary formation and surface filling-in in the LGN and cortical areas V1, V2, and V4. It proposes how interactions between layers 4, 3B, and 2/3 in V1 and V2 contribute to stereopsis, and how binocular and monocular information combine to form 3D boundary and surface representations. The model suggests how surface-to-boundary feedback from V2 thin stripes to pale stripes helps to explain how computationally complementary boundary and surface formation properties lead to a single consistent percept, eliminate redundant 3D boundaries, and trigger figure-ground perception. The model also shows how false binocular boundary matches may be eliminated by Gestalt grouping properties. In particular, the disparity filter, which helps to solve the correspondence problem by eliminating false matches, is realized using inhibitory interneurons as part of the perceptual grouping process by horizontal connections in layer 2/3 of cortical area V2. The 3D sLAMINART model simulates 3D surface percepts that are consciously seen in 18 psychophysical experiments. These percepts include contrast variations of dichoptic masking and the correspondence problem, the effect of interocular contrast differences on stereoacuity, Panum's limiting case, the Venetian blind illusion, stereopsis with polarity-reversed stereograms, da Vinci stereopsis, and perceptual closure. The model hereby illustrates a general method of unlumping rate-based models that use the membrane equations of neurophysiology into models that use spiking neurons, and which may be embodied in VLSI chips that use spiking neurons to minimize heat production. PMID

  3. Earth Science Research Discovery, Integration, 3D Visualization and Analysis using NASA World Wind

    NASA Astrophysics Data System (ADS)

    Alameh, N.; Hogan, P.

    2008-12-01

    more possible to include virtual globe capability in support of any Earth science objective. 3- With the source code being fully accessible, anyone can advance this technology (including in a commercial or other proprietary manner). Such features enable World Wind to provide easy discovery, access and 3D integration/visualization/analysis of Earth observation data in a flexible, customizable open source tool. This positions World Wind to become a key part of an Advanced Information Systems infrastructure supporting a collaborative decision-making environment for a variety of applications.

  4. 3D printed microfluidic devices with integrated versatile and reusable electrodes.

    PubMed

    Erkal, Jayda L; Selimovic, Asmira; Gross, Bethany C; Lockwood, Sarah Y; Walton, Eric L; McNamara, Stephen; Martin, R Scott; Spence, Dana M

    2014-06-21

    We report two 3D printed devices that can be used for electrochemical detection. In both cases, the electrode is housed in commercially available, polymer-based fittings so that the various electrode materials (platinum, platinum black, carbon, gold, silver) can be easily added to a threaded receiving port printed on the device; this enables a module-like approach to the experimental design, where the electrodes are removable and can be easily repolished for reuse after exposure to biological samples. The first printed device represents a microfluidic platform with a 500 × 500 μm channel and a threaded receiving port to allow integration of either polyetheretherketone (PEEK) nut-encased glassy carbon or platinum black (Pt-black) electrodes for dopamine and nitric oxide (NO) detection, respectively. The embedded 1 mm glassy carbon electrode had a limit of detection (LOD) of 500 nM for dopamine and a linear response (R(2) = 0.99) for concentrations between 25-500 μM. When the glassy carbon electrode was coated with 0.05% Nafion, significant exclusion of nitrite was observed when compared to signal obtained from equimolar injections of dopamine. When using flow injection analysis with a Pt/Pt-black electrode and standards derived from NO gas, a linear correlation (R(2) = 0.99) over a wide range of concentrations (7.6-190 μM) was obtained, with the LOD for NO being 1 μM. The second application showcases a 3D printed fluidic device that allows collection of the biologically relevant analyte adenosine triphosphate (ATP) while simultaneously measuring the release stimulus (reduced oxygen concentration). The hypoxic sample (4.8 ± 0.5 ppm oxygen) released 2.4 ± 0.4 times more ATP than the normoxic sample (8.4 ± 0.6 ppm oxygen). Importantly, the results reported here verify the reproducible and transferable nature of using 3D printing as a fabrication technique, as devices and electrodes were moved between labs multiple times during completion of the study. PMID

  5. 3D Printed Microfluidic Devices with Integrated Versatile and Reusable Electrodes

    PubMed Central

    Erkal, Jayda L.; Selimovic, Asmira; Gross, Bethany C.; Lockwood, Sarah Y.; Walton, Eric L.; McNamara, Stephen; Martin, R. Scott; Spence, Dana M.

    2014-01-01

    We report two 3D printed devices that can be used for electrochemical detection. In both cases, the electrode is housed in commercially available, polymer-based fittings so that the various electrode materials (platinum, platinum black, carbon, gold, silver) can be easily added to a threaded receiving port printed on the device; this enables a module-like approach to the experimental design, where the electrodes are removable and can be easily repolished for reuse after exposure to biological samples. The first printed device represents a microfluidic platform with a 500 × 500 μm channel and a threaded receiving port to allow integration of either polyetheretherketone (PEEK) nut-encased glassy carbon or platinum black (Pt-black) electrodes for dopamine and nitric oxide (NO) detection, respectively. The embedded 1 mm glassy carbon electrode had a limit of detection (LOD) of 500 nM for dopamine and a linear response (R2= 0.99) for concentrations between 25-500 μM. When the glassy carbon electrode was coated with 0.05% Nafion, significant exclusion of nitrite was observed when compared to signal obtained from equimolar injections of dopamine. When using flow injection analysis with a Pt/Pt-black electrode and standards derived from NO gas, a linear correlation (R2 = 0.99) over a wide range of concentrations (7.6 - 190 μM) was obtained, with the LOD for NO being 1 μM. The second application showcases a 3D printed fluidic device that allows collection of the biologically relevant analyte adenosine triphosphate (ATP) while simultaneously measuring the release stimulus (reduced oxygen concentration). The hypoxic sample (4.76 ± 0.53 ppm oxygen) released 2.37 ± 0.37 times more ATP than the normoxic sample (8.22 ± 0.60 ppm oxygen). Importantly, the results reported here verify the reproducible and transferable nature of using 3D printing as a fabrication technique, as devices and electrodes were moved between labs multiple times during completion of the study. PMID

  6. Integrative multicellular biological modeling: a case study of 3D epidermal development using GPU algorithms

    PubMed Central

    2010-01-01

    Background Simulation of sophisticated biological models requires considerable computational power. These models typically integrate together numerous biological phenomena such as spatially-explicit heterogeneous cells, cell-cell interactions, cell-environment interactions and intracellular gene networks. The recent advent of programming for graphical processing units (GPU) opens up the possibility of developing more integrative, detailed and predictive biological models while at the same time decreasing the computational cost to simulate those models. Results We construct a 3D model of epidermal development and provide a set of GPU algorithms that executes significantly faster than sequential central processing unit (CPU) code. We provide a parallel implementation of the subcellular element method for individual cells residing in a lattice-free spatial environment. Each cell in our epidermal model includes an internal gene network, which integrates cellular interaction of Notch signaling together with environmental interaction of basement membrane adhesion, to specify cellular state and behaviors such as growth and division. We take a pedagogical approach to describing how modeling methods are efficiently implemented on the GPU including memory layout of data structures and functional decomposition. We discuss various programmatic issues and provide a set of design guidelines for GPU programming that are instructive to avoid common pitfalls as well as to extract performance from the GPU architecture. Conclusions We demonstrate that GPU algorithms represent a significant technological advance for the simulation of complex biological models. We further demonstrate with our epidermal model that the integration of multiple complex modeling methods for heterogeneous multicellular biological processes is both feasible and computationally tractable using this new technology. We hope that the provided algorithms and source code will be a starting point for modelers to

  7. Enhancement of electrochemical performances for LiFePO4/C with 3D-grape-bunch structure and selection of suitable equivalent circuit for fitting EIS results

    NASA Astrophysics Data System (ADS)

    Li, Xiangfeng; Luo, Dongmei; Zhang, Xin; Zhang, Zhao

    2015-09-01

    The LiFePO4/C composite with 3D-grape-bunch structure is successfully synthesized through a novel hydrothermal method. Sucrose is used as in-situ coating carbon source, and the hydroxylated MWCNTs are used as connecting carbon wires which can be embedded into the carbon coating via self-assembling of the hydrophilic groups to form 3D-grape-bunch structure. The influences of the 3D-grape-bunch structure on the morphology, structure and electrochemical performance of the LiFePO4/C composites are investigated by XRD, SEM, TEM, BET, galvanostatic charge/discharge tests, electrochemical impedance spectroscopy (EIS) and cyclic voltammetry (CV) tests. Especially, four kinds of the equivalent circuit models usually employed to analysis the EISs of LiFePO4 as cathode material for Li-ion battery are discussed, and the suitable equivalent circuit for fitting EIS of LiFePO4/C composite with 3D-grape-bunch structure is selected. The optimal LiFePO4/C composite with 3D-grape-bunch structure owing to its good conductive network and high graphitic degree (low ID/IG value) of residual carbon exhibits a stable and high reversible capacity of 160.5 mAh g-1 at 0.1C and 108.4 mAh g-1 even at 10.0C, and the cycling capacity retention rate reaches 99.9% over 60 cycles. Moreover, it also exhibits high conductivity, good reversibility and excellent stability in EIS and CV tests.

  8. Fully integrated system-on-chip for pixel-based 3D depth and scene mapping

    NASA Astrophysics Data System (ADS)

    Popp, Martin; De Coi, Beat; Thalmann, Markus; Gancarz, Radoslav; Ferrat, Pascal; Dürmüller, Martin; Britt, Florian; Annese, Marco; Ledergerber, Markus; Catregn, Gion-Pol

    2012-03-01

    We present for the first time a fully integrated system-on-chip (SoC) for pixel-based 3D range detection suited for commercial applications. It is based on the time-of-flight (ToF) principle, i.e. measuring the phase difference of a reflected pulse train. The product epc600 is fabricated using a dedicated process flow, called Espros Photonic CMOS. This integration makes it possible to achieve a Quantum Efficiency (QE) of >80% in the full wavelength band from 520nm up to 900nm as well as very high timing precision in the sub-ns range which is needed for exact detection of the phase delay. The SoC features 8x8 pixels and includes all necessary sub-components such as ToF pixel array, voltage generation and regulation, non-volatile memory for configuration, LED driver for active illumination, digital SPI interface for easy communication, column based 12bit ADC converters, PLL and digital data processing with temporary data storage. The system can be operated at up to 100 frames per second.

  9. GaAs Optoelectronic Integrated-Circuit Neurons

    NASA Technical Reports Server (NTRS)

    Lin, Steven H.; Kim, Jae H.; Psaltis, Demetri

    1992-01-01

    Monolithic GaAs optoelectronic integrated circuits developed for use as artificial neurons. Neural-network computer contains planar arrays of optoelectronic neurons, and variable synaptic connections between neurons effected by diffraction of light from volume hologram in photorefractive material. Basic principles of neural-network computers explained more fully in "Optoelectronic Integrated Circuits For Neural Networks" (NPO-17652). In present circuits, devices replaced by metal/semiconductor field effect transistors (MESFET's), which consume less power.

  10. Automatic visual inspection of integrated circuits using an SEM

    SciTech Connect

    Kayaalp, A.E.

    1988-01-01

    The author investigates the complex problem of designing an integrated-circuit inspection system that will be used in controlling an automated semiconductor manufacturing facility. To satisfy the accuracy requirements, he proposes a system that integrates information supplied by multiple intelligent (virtual) sensors. Most of his work concentrated on the design of two scanning-electron-microscope (SEM)-based, intelligent sensors. One of them extracts 3D IC surface-topography information using computer stereo-vision techniques, and the other identifies shape defects in IC patterns using the IC design file as the reference. Both of these problems are viewed as constrained contour-matching problems. In stereo matching, feature contours extracted from the left and right stereo images are matched, where in pattern-shape inspection, pattern boundary contours extracted from the image and the IC design file are matched. An optimization technique is presented for solving the matching problem that results in both cases. This general approach simplifies the task of transforming the specifications of a physical problem into a computational form and results in a modular system.

  11. The Integration of 3-D Cell-Printing and Mesoscopic Fluorescence Molecular Tomography of Vascular Constructs within Thick Hydrogel Scaffolds

    PubMed Central

    Zhao, Lingling; Lee, Vivian K.; Yoo, Seung-Schik; Dai, Guohao; Intes, Xavier

    2012-01-01

    Developing methods that provide adequate vascular perfusion is an important step toward engineering large functional tissues. Meanwhile, an imaging modality to assess the three-dimensional (3-D) structures and functions of the vascular channels is lacking for thick matrices (>2~3mm). Herein, we report on an original approach to construct and image 3-D dynamically perfused vascular structures in thick hydrogel scaffolds. In this work, we integrated a robotic 3-D cell-printing technology with a mesoscopic fluorescence molecular tomography imaging system, and demonstrated the capability of the platform to construct perfused collagen scaffolds with endothelial lining and to image both the fluid flow and fluorescent-labeled living endothelial cells at high-frame rates, with high sensitivity and accuracy. These results establish the potential of integrating both 3-D cell-printing and fluorescence mesoscopic imaging for functional and molecular studies in complex tissue engineered tissues. PMID:22531221

  12. NFkB disrupts tissue polarity in 3D by preventing integration of microenvironmental signals.

    PubMed

    Becker-Weimann, Sabine; Xiong, Gaofeng; Furuta, Saori; Han, Ju; Kuhn, Irene; Akavia, Uri-David; Pe'er, Dana; Bissell, Mina J; Xu, Ren

    2013-11-01

    The microenvironment of cells controls their phenotype, and thereby the architecture of the emerging multicellular structure or tissue. We have reported more than a dozen microenvironmental factors whose signaling must be integrated in order to effect an organized, functional tissue morphology. However, the factors that prevent integration of signaling pathways that merge form and function are still largely unknown. We have identified nuclear factor kappa B (NFkB) as a transcriptional regulator that disrupts important microenvironmental cues necessary for tissue organization. We compared the gene expression of organized and disorganized epithelial cells of the HMT-3522 breast cancer progression series: the non-malignant S1 cells that form polarized spheres ('acini'), the malignant T4-2 cells that form large tumor-like clusters, and the 'phenotypically reverted' T4-2 cells that polarize as a result of correction of the microenvironmental signaling. We identified 180 genes that display an increased expression in disorganized compared to polarized structures. Network, GSEA and transcription factor binding site analyses suggested that NFkB is a common activator for the 180 genes. NFkB was found to be activated in disorganized breast cancer cells, and inhibition of microenvironmental signaling via EGFR, beta1 integrin, MMPs, or their downstream signals suppressed its activation. The postulated role of NFkB was experimentally verified: Blocking the NFkB pathway with a specific chemical inhibitor or shRNA induced polarization and inhibited invasion of breast cancer cells in 3D cultures. These results may explain why NFkB holds promise as a target for therapeutic intervention: Its inhibition can reverse the oncogenic signaling involved in breast cancer progression and integrate the essential microenvironmental control of tissue architecture. PMID:24243820

  13. Integrating 3D geological information with a national physically-based hydrological modelling system

    NASA Astrophysics Data System (ADS)

    Lewis, Elizabeth; Parkin, Geoff; Kessler, Holger; Whiteman, Mark

    2016-04-01

    Robust numerical models are an essential tool for informing flood and water management and policy around the world. Physically-based hydrological models have traditionally not been used for such applications due to prohibitively large data, time and computational resource requirements. Given recent advances in computing power and data availability, a robust, physically-based hydrological modelling system for Great Britain using the SHETRAN model and national datasets has been created. Such a model has several advantages over less complex systems. Firstly, compared with conceptual models, a national physically-based model is more readily applicable to ungauged catchments, in which hydrological predictions are also required. Secondly, the results of a physically-based system may be more robust under changing conditions such as climate and land cover, as physical processes and relationships are explicitly accounted for. Finally, a fully integrated surface and subsurface model such as SHETRAN offers a wider range of applications compared with simpler schemes, such as assessments of groundwater resources, sediment and nutrient transport and flooding from multiple sources. As such, SHETRAN provides a robust means of simulating numerous terrestrial system processes which will add physical realism when coupled to the JULES land surface model. 306 catchments spanning Great Britain have been modelled using this system. The standard configuration of this system performs satisfactorily (NSE > 0.5) for 72% of catchments and well (NSE > 0.7) for 48%. Many of the remaining 28% of catchments that performed relatively poorly (NSE < 0.5) are located in the chalk in the south east of England. As such, the British Geological Survey 3D geology model for Great Britain (GB3D) has been incorporated, for the first time in any hydrological model, to pave the way for improvements to be made to simulations of catchments with important groundwater regimes. This coupling has involved

  14. 1-D, 2-D and 3-D Negative-Refraction Metamaterials at Optical Frequencies: Optical Nano-Transmission-Line and Circuit Theory

    NASA Astrophysics Data System (ADS)

    Engheta, Nader; Alu, Andrea

    2006-03-01

    In recent years metamaterials have offered new possibilities for overcoming some of the intrinsic limitations in wave propagation. Their realization at microwave frequencies has followed two different paths; one consisting of embedding resonant inclusions in a host dielectric, and the other following a transmission-line approach, i.e., building 1-D, 2-D, or 3-D cascades of circuit elements, respectively, as linear, planar or bulk right- or left-handed metamaterials. The latter is known to provide larger bandwidth and better robustness to ohmic losses. Extending these concepts to optical frequencies is a challenging task, due to changes in material response to electromagnetic waves at these frequencies. However, recently we have studied theoretically how it may be possible to have circuit nano-elements at these frequencies by properly exploiting plasmonic resonances. Here we present our theoretical work on translating the circuit concepts of right- and left-handed metamaterials into optical frequencies by applying the analogy between nanoparticles and nanocircuit elements in transmission lines. We discuss how it is possible to synthesize optical negative-refraction metamaterials by properly cascading plasmonic and non-plasmonic elements in 1-D, 2-D and 3-D geometries.

  15. Development of 3-D Mechanical Models of Electric Circuits and Their Effect on Students' Understanding of Electric Potential Difference

    ERIC Educational Resources Information Center

    Balta, Nuri

    2015-01-01

    Visualizing physical concepts through models is an essential method in many sciences. While students are mostly proficient in handling mathematical aspects of problems, they frequently lack the ability to visualize and interpret abstract physical concepts in a meaningful way. In this paper, initially the electric circuits and related concepts were…

  16. Securing health sensing using integrated circuit metric.

    PubMed

    Tahir, Ruhma; Tahir, Hasan; McDonald-Maier, Klaus

    2015-01-01

    Convergence of technologies from several domains of computing and healthcare have aided in the creation of devices that can help health professionals in monitoring their patients remotely. An increase in networked healthcare devices has resulted in incidents related to data theft, medical identity theft and insurance fraud. In this paper, we discuss the design and implementation of a secure lightweight wearable health sensing system. The proposed system is based on an emerging security technology called Integrated Circuit Metric (ICMetric) that extracts the inherent features of a device to generate a unique device identification. In this paper, we provide details of how the physical characteristics of a health sensor can be used for the generation of hardware "fingerprints". The obtained fingerprints are used to deliver security services like authentication, confidentiality, secure admission and symmetric key generation. The generated symmetric key is used to securely communicate the health records and data of the patient. Based on experimental results and the security analysis of the proposed scheme, it is apparent that the proposed system enables high levels of security for health monitoring in resource optimized manner. PMID:26492250

  17. Securing Health Sensing Using Integrated Circuit Metric

    PubMed Central

    Tahir, Ruhma; Tahir, Hasan; McDonald-Maier, Klaus

    2015-01-01

    Convergence of technologies from several domains of computing and healthcare have aided in the creation of devices that can help health professionals in monitoring their patients remotely. An increase in networked healthcare devices has resulted in incidents related to data theft, medical identity theft and insurance fraud. In this paper, we discuss the design and implementation of a secure lightweight wearable health sensing system. The proposed system is based on an emerging security technology called Integrated Circuit Metric (ICMetric) that extracts the inherent features of a device to generate a unique device identification. In this paper, we provide details of how the physical characteristics of a health sensor can be used for the generation of hardware “fingerprints”. The obtained fingerprints are used to deliver security services like authentication, confidentiality, secure admission and symmetric key generation. The generated symmetric key is used to securely communicate the health records and data of the patient. Based on experimental results and the security analysis of the proposed scheme, it is apparent that the proposed system enables high levels of security for health monitoring in resource optimized manner. PMID:26492250

  18. Laser Scanning Holographic Lithography for Flexible 3D Fabrication of Multi-Scale Integrated Nano-structures and Optical Biosensors

    PubMed Central

    Yuan, Liang (Leon); Herman, Peter R.

    2016-01-01

    Three-dimensional (3D) periodic nanostructures underpin a promising research direction on the frontiers of nanoscience and technology to generate advanced materials for exploiting novel photonic crystal (PC) and nanofluidic functionalities. However, formation of uniform and defect-free 3D periodic structures over large areas that can further integrate into multifunctional devices has remained a major challenge. Here, we introduce a laser scanning holographic method for 3D exposure in thick photoresist that combines the unique advantages of large area 3D holographic interference lithography (HIL) with the flexible patterning of laser direct writing to form both micro- and nano-structures in a single exposure step. Phase mask interference patterns accumulated over multiple overlapping scans are shown to stitch seamlessly and form uniform 3D nanostructure with beam size scaled to small 200 μm diameter. In this way, laser scanning is presented as a facile means to embed 3D PC structure within microfluidic channels for integration into an optofluidic lab-on-chip, demonstrating a new laser HIL writing approach for creating multi-scale integrated microsystems. PMID:26922872

  19. Laser Scanning Holographic Lithography for Flexible 3D Fabrication of Multi-Scale Integrated Nano-structures and Optical Biosensors.

    PubMed

    Yuan, Liang Leon; Herman, Peter R

    2016-01-01

    Three-dimensional (3D) periodic nanostructures underpin a promising research direction on the frontiers of nanoscience and technology to generate advanced materials for exploiting novel photonic crystal (PC) and nanofluidic functionalities. However, formation of uniform and defect-free 3D periodic structures over large areas that can further integrate into multifunctional devices has remained a major challenge. Here, we introduce a laser scanning holographic method for 3D exposure in thick photoresist that combines the unique advantages of large area 3D holographic interference lithography (HIL) with the flexible patterning of laser direct writing to form both micro- and nano-structures in a single exposure step. Phase mask interference patterns accumulated over multiple overlapping scans are shown to stitch seamlessly and form uniform 3D nanostructure with beam size scaled to small 200 μm diameter. In this way, laser scanning is presented as a facile means to embed 3D PC structure within microfluidic channels for integration into an optofluidic lab-on-chip, demonstrating a new laser HIL writing approach for creating multi-scale integrated microsystems. PMID:26922872

  20. Laser Scanning Holographic Lithography for Flexible 3D Fabrication of Multi-Scale Integrated Nano-structures and Optical Biosensors

    NASA Astrophysics Data System (ADS)

    Yuan, Liang (Leon); Herman, Peter R.

    2016-02-01

    Three-dimensional (3D) periodic nanostructures underpin a promising research direction on the frontiers of nanoscience and technology to generate advanced materials for exploiting novel photonic crystal (PC) and nanofluidic functionalities. However, formation of uniform and defect-free 3D periodic structures over large areas that can further integrate into multifunctional devices has remained a major challenge. Here, we introduce a laser scanning holographic method for 3D exposure in thick photoresist that combines the unique advantages of large area 3D holographic interference lithography (HIL) with the flexible patterning of laser direct writing to form both micro- and nano-structures in a single exposure step. Phase mask interference patterns accumulated over multiple overlapping scans are shown to stitch seamlessly and form uniform 3D nanostructure with beam size scaled to small 200 μm diameter. In this way, laser scanning is presented as a facile means to embed 3D PC structure within microfluidic channels for integration into an optofluidic lab-on-chip, demonstrating a new laser HIL writing approach for creating multi-scale integrated microsystems.

  1. A Tandem Coupler for Terahertz Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Reck, Theodore J.; Deal, William; Chattopadhyay, Goutam

    2013-01-01

    A coplanar waveguide 3 dB quadrature coupler operating from 500 to 700 GHz is designed, fabricated and measured. On-wafer measurements demonstrate an amplitude balance of +/-2 dB and phase balance of +/-20 deg.

  2. Liquid immersion thermal crosslinking of 3D polymer nanopatterns for direct carbonisation with high structural integrity.

    PubMed

    Kang, Da-Young; Kim, Cheolho; Park, Gyurim; Moon, Jun Hyuk

    2015-01-01

    The direct pyrolytic carbonisation of polymer patterns has attracted interest for its use in obtaining carbon materials. In the case of carbonisation of nanopatterned polymers, the polymer flow and subsequent pattern change may occur in order to relieve their high surface energies. Here, we demonstrated that liquid immersion thermal crosslinking of polymer nanopatterns effectively enhanced the thermal resistance and maintained the structure integrity during the heat treatment. We employed the liquid immersion thermal crosslinking for 3D porous SU8 photoresist nanopatterns and successfully converted them to carbon nanopatterns while maintaining their porous features. The thermal crosslinking reaction and carbonisation of SU8 nanopatterns were characterised. The micro-crystallinity of the SU8-derived carbon nanopatterns was also characterised. The liquid immersion heat treatment can be extended to the carbonisation of various polymer or photoresist nanopatterns and also provide a facile way to control the surface energy of polymer nanopatterns for various purposes, for example, to block copolymer or surfactant self-assemblies. PMID:26677949

  3. Efficient 3D/1D self-consistent integral-equation analysis of ICRH antennae

    NASA Astrophysics Data System (ADS)

    Maggiora, R.; Vecchi, G.; Lancellotti, V.; Kyrytsya, V.

    2004-08-01

    This work presents a comprehensive account of the theory and implementation of a method for the self-consistent numerical analysis of plasma-facing ion-cyclotron resonance heating (ICRH) antenna arrays. The method is based on the integral-equation formulation of the boundary-value problem, solved via a weighted-residual scheme. The antenna geometry (including Faraday shield bars and a recess box) is fairly general and three-dimensional (3D), and the plasma is in the one-dimensional (1D) 'slab' approximation; finite-Larmor radius effects, as well as plasma density and temperature gradients, are considered. Feeding via the voltages in the access coaxial lines is self-consistently accounted throughout and the impedance or scattering matrix of the antenna array obtained therefrom. The problem is formulated in both the dual space (physical) and spectral (wavenumber) domains, which allows the extraction and simple handling of the terms that slow the convergence in the spectral domain usually employed. This paper includes validation tests of the developed code against measured data, both in vacuo and in the presence of plasma. An example of application to a complex geometry is also given.

  4. Liquid immersion thermal crosslinking of 3D polymer nanopatterns for direct carbonisation with high structural integrity

    NASA Astrophysics Data System (ADS)

    Kang, Da-Young; Kim, Cheolho; Park, Gyurim; Moon, Jun Hyuk

    2015-12-01

    The direct pyrolytic carbonisation of polymer patterns has attracted interest for its use in obtaining carbon materials. In the case of carbonisation of nanopatterned polymers, the polymer flow and subsequent pattern change may occur in order to relieve their high surface energies. Here, we demonstrated that liquid immersion thermal crosslinking of polymer nanopatterns effectively enhanced the thermal resistance and maintained the structure integrity during the heat treatment. We employed the liquid immersion thermal crosslinking for 3D porous SU8 photoresist nanopatterns and successfully converted them to carbon nanopatterns while maintaining their porous features. The thermal crosslinking reaction and carbonisation of SU8 nanopatterns were characterised. The micro-crystallinity of the SU8-derived carbon nanopatterns was also characterised. The liquid immersion heat treatment can be extended to the carbonisation of various polymer or photoresist nanopatterns and also provide a facile way to control the surface energy of polymer nanopatterns for various purposes, for example, to block copolymer or surfactant self-assemblies.

  5. Mercury Lightcraft Project Update: 3-D Modeling, Systems Analysis and Integration

    NASA Astrophysics Data System (ADS)

    Buckton, Thomas W.; Myrabo, Leik N.

    2005-04-01

    This paper is a progress report on the laser-propelled Mercury Lightcraft Project at Rensselaer Polytechnic Institute. The laser-propelled, 1-person craft has a diameter of 252-cm, height of 217-cm, internal volume of 3 m3, `dry' mass of 700 kg, and gross liftoff mass of 1 metric ton. Expendable liquids including 70 kg of liquid hydrogen, and an equivalent mass (at least) of de-ionized water serves as open-cycle coolants for the 520 MWe laser/electric power conversion system. Its hyper-energetic airbreathing engine can easily accelerate the vehicle at 10 Gs or more. The tractor-beam lightcraft is intended as a prototype for use in a future global aerospace transportation system based on a constellation of satellite solar power stations in geostationary orbit, with laser relay stations in low Earth orbit. Using SolidWorks® 3-D modeling software, several important features were successfully integrated into the Mercury lightcraft model - principally: a rotating shroud (for spin stabilization) simple actuation system for a new variable-geometry air inlet; refined optical train for the laser-heated H2 plasma generators; pneumatically deployed, robotic quadra-pod landing gear; ejection seat/pod/hatch system; and a more detailed airframe structural concept. The CAD effort has brought the Mercury Lightcraft concept one significant step closer to reality.

  6. Liquid immersion thermal crosslinking of 3D polymer nanopatterns for direct carbonisation with high structural integrity

    PubMed Central

    Kang, Da-Young; Kim, Cheolho; Park, Gyurim; Moon, Jun Hyuk

    2015-01-01

    The direct pyrolytic carbonisation of polymer patterns has attracted interest for its use in obtaining carbon materials. In the case of carbonisation of nanopatterned polymers, the polymer flow and subsequent pattern change may occur in order to relieve their high surface energies. Here, we demonstrated that liquid immersion thermal crosslinking of polymer nanopatterns effectively enhanced the thermal resistance and maintained the structure integrity during the heat treatment. We employed the liquid immersion thermal crosslinking for 3D porous SU8 photoresist nanopatterns and successfully converted them to carbon nanopatterns while maintaining their porous features. The thermal crosslinking reaction and carbonisation of SU8 nanopatterns were characterised. The micro-crystallinity of the SU8-derived carbon nanopatterns was also characterised. The liquid immersion heat treatment can be extended to the carbonisation of various polymer or photoresist nanopatterns and also provide a facile way to control the surface energy of polymer nanopatterns for various purposes, for example, to block copolymer or surfactant self-assemblies. PMID:26677949

  7. Swarm Intelligence Integrated Graph-Cut for Liver Segmentation from 3D-CT Volumes

    PubMed Central

    Eapen, Maya; Korah, Reeba; Geetha, G.

    2015-01-01

    The segmentation of organs in CT volumes is a prerequisite for diagnosis and treatment planning. In this paper, we focus on liver segmentation from contrast-enhanced abdominal CT volumes, a challenging task due to intensity overlapping, blurred edges, large variability in liver shape, and complex background with cluttered features. The algorithm integrates multidiscriminative cues (i.e., prior domain information, intensity model, and regional characteristics of liver in a graph-cut image segmentation framework). The paper proposes a swarm intelligence inspired edge-adaptive weight function for regulating the energy minimization of the traditional graph-cut model. The model is validated both qualitatively (by clinicians and radiologists) and quantitatively on publically available computed tomography (CT) datasets (MICCAI 2007 liver segmentation challenge, 3D-IRCAD). Quantitative evaluation of segmentation results is performed using liver volume calculations and a mean score of 80.8% and 82.5% on MICCAI and IRCAD dataset, respectively, is obtained. The experimental result illustrates the efficiency and effectiveness of the proposed method. PMID:26689833

  8. From 3D Bioprinters to a fully integrated Organ Biofabrication Line

    NASA Astrophysics Data System (ADS)

    Passamai, V. E.; Dernowsek, J. A.; Nogueira, J.; Lara, V.; Vilalba, F.; Mironov, V. A.; Rezende, R. A.; da Silva, J. V.

    2016-04-01

    About 30 years ago, the 3D printing technique appeared. From that time on, engineers in medical science field started to look at 3D printing as a partner. Firstly, biocompatible and biodegradable 3D structures for cell seeding called “scaffolds” were fabricated for in vitro and in vivo animal trials. The advances proved to be of great importance, but, the use of scaffolds faces some limitations, such as low homogeneity and low density of cell aggregates. In the last decade, 3D bioprinting technology emerged as a promising approach to overcome these limitations and as one potential solution to the challenge of organ fabrication, to obtain very similar 3D human tissues, not only for transplantation, but also for drug discovery, disease research and to decrease the usage of animals in laboratory experimentation. 3D bioprinting allowed the fabrication of 3D alive structures with higher and controllable cell density and homogeneity. Other advantage of biofabrication is that the tissue constructs are solid scaffold-free. This paper presents the 3D bioprinting technology; equipment development, stages and components of a complex Organ Bioprinting Line (OBL) and the importance of developing a Virtual OBL.

  9. The numerical integration and 3-D finite element formulation of a viscoelastic model of glass

    SciTech Connect

    Chambers, R.S.

    1994-08-01

    The use of glasses is widespread in making hermetic, insulating seals for many electronic components. Flat panel displays and fiber optic connectors are other products utilizing glass as a structural element. When glass is cooled from sealing temperatures, residual stresses are generated due to mismatches in thermal shrinkage created by the dissimilar material properties of the adjoining materials. Because glass is such a brittle material at room temperature, tensile residual stresses must be kept small to ensure durability and avoid cracking. Although production designs and the required manufacturing process development can be deduced empirically, this is an expensive and time consuming process that does not necessarily lead to an optimal design. Agile manufacturing demands that analyses be used to reduce development costs and schedules by providing insight and guiding the design process through the development cycle. To make these gains, however, viscoelastic models of glass must be available along with the right tool to use them. A viscoelastic model of glass can be used to simulate the stress and volume relaxation that occurs at elevated temperatures as the molecular structure of the glass seeks to equilibrate to the state of the supercooled liquid. The substance of the numerical treatment needed to support the implementation of the model in a 3-D finite element program is presented herein. An accurate second-order, central difference integrator is proposed for the constitutive equations, and numerical solutions are compared to those obtained with other integrators. Inherent convergence problems are reviewed and fixes are described. The resulting algorithms are generally applicable to the broad class of viscoelastic material models. First-order error estimates are used as a basis for developing a scheme for automatic time step controls, and several demonstration problems are presented to illustrate the performance of the methodology.

  10. A polymer-based Fabry-Perot filter integrated with 3-D MEMS structures

    NASA Astrophysics Data System (ADS)

    Zhang, Ping (Cerina); Le, Kevin; Malalur-Nagaraja-Rao, Smitha; Hsu, Lun-Chen; Chiao, J.-C.

    2006-01-01

    Polymers have been considered as one of the most versatile materials in making optical devices for communication and sensor applications. They provide good optical transparency to form filters, lenses and many optical components with ease of fabrication. They are scalable and compatible in dimensions with requirements in optics and can be fabricated on inorganic substrates, such as silicon and quartz. Recent polymer synthesis also made great progresses on conductive and nonlinear polymers, opening opportunities for new applications. In this paper, we discussed hybrid-material integration of polymers on silicon-based microelectromechanical system (MEMS) devices. The motivation is to combine the advantages of demonstrated silicon-based MEMS actuators and excellent optical performance of polymers. We demonstrated the idea with a polymer-based out-of-plane Fabry-Perot filter that can be self-assembled by scratch drive actuators. We utilized a fabrication foundry service, MUMPS (Multi-User MEMS Process), to demonstrate the feasibility and flexibility of integration. The polysilicon, used as the structural material for construction of 3-D framework and actuators, has high absorption in the visible and near infrared ranges. Therefore, previous efforts using a polysilicon layer as optical interfaces suffer from high losses. We applied the organic compound materials on the silicon-based framework within the optical signal propagation path to form the optical interfaces. In this paper, we have shown low losses in the optical signal processing and feasibility of building a thin-film Fabry-Perot filter. We discussed the optical filter designs, mechanical design, actuation mechanism, fabrication issues, optical measurements, and results.

  11. Integrated Idl Tool For 3d Modeling And Imaging Data Analysis

    NASA Astrophysics Data System (ADS)

    Nita, Gelu M.; Fleishman, G. D.; Gary, D. E.; Kuznetsov, A. A.; Kontar, E. P.

    2012-05-01

    Addressing many key problems in solar physics requires detailed analysis of non-simultaneous imaging data obtained in various wavelength domains with different spatial resolution and their comparison with each other supplied by advanced 3D physical models. To facilitate achieving this goal, we have undertaken a major enhancement and improvements of IDL-based simulation tools developed earlier for modeling microwave and X-ray emission. The greatly enhanced object-based architecture provides interactive graphic user interface that allows the user i) to import photospheric magnetic field maps and perform magnetic field extrapolations to almost instantly generate 3D magnetic field models, ii) to investigate the magnetic topology of these models by interactively creating magnetic field lines and associated magnetic field tubes, iii) to populate them with user-defined nonuniform thermal plasma and anisotropic nonuniform nonthermal electron distributions; and iv) to calculate the spatial and spectral properties of radio and X-ray emission. The application integrates DLL and Shared Libraries containing fast gyrosynchrotron emission codes developed in FORTRAN and C++, soft and hard X-ray codes developed in IDL, and a potential field extrapolation DLL produced based on original FORTRAN code developed by V. Abramenko and V. Yurchishin. The interactive interface allows users to add any user-defined IDL or external callable radiation code, as well as user-defined magnetic field extrapolation routines. To illustrate the tool capabilities, we present a step-by-step live computation of microwave and X-ray images from realistic magnetic structures obtained from a magnetic field extrapolation preceding a real event, and compare them with the actual imaging data produced by NORH and RHESSI instruments. This work was supported in part by NSF grants AGS-0961867, AST-0908344, AGS-0969761, and NASA grants NNX10AF27G and NNX11AB49G to New Jersey Institute of Technology, by a UK STFC

  12. Nanophotonic integrated circuits from nanoresonators grown on silicon

    NASA Astrophysics Data System (ADS)

    Chen, Roger; Ng, Kar Wei; Ko, Wai Son; Parekh, Devang; Lu, Fanglu; Tran, Thai-Truong D.; Li, Kun; Chang-Hasnain, Connie

    2014-07-01

    Harnessing light with photonic circuits promises to catalyse powerful new technologies much like electronic circuits have in the past. Analogous to Moore’s law, complexity and functionality of photonic integrated circuits depend on device size and performance scale. Semiconductor nanostructures offer an attractive approach to miniaturize photonics. However, shrinking photonics has come at great cost to performance, and assembling such devices into functional photonic circuits has remained an unfulfilled feat. Here we demonstrate an on-chip optical link constructed from InGaAs nanoresonators grown directly on a silicon substrate. Using nanoresonators, we show a complete toolkit of circuit elements including light emitters, photodetectors and a photovoltaic power supply. Devices operate with gigahertz bandwidths while consuming subpicojoule energy per bit, vastly eclipsing performance of prior nanostructure-based optoelectronics. Additionally, electrically driven stimulated emission from an as-grown nanostructure is presented for the first time. These results reveal a roadmap towards future ultradense nanophotonic integrated circuits.

  13. Interferometry based multispectral photon-limited 2D and 3D integral image encryption employing the Hartley transform.

    PubMed

    Muniraj, Inbarasan; Guo, Changliang; Lee, Byung-Geun; Sheridan, John T

    2015-06-15

    We present a method of securing multispectral 3D photon-counted integral imaging (PCII) using classical Hartley Transform (HT) based encryption by employing optical interferometry. This method has the simultaneous advantages of minimizing complexity by eliminating the need for holography recording and addresses the phase sensitivity problem encountered when using digital cameras. These together with single-channel multispectral 3D data compactness, the inherent properties of the classical photon counting detection model, i.e. sparse sensing and the capability for nonlinear transformation, permits better authentication of the retrieved 3D scene at various depth cues. Furthermore, the proposed technique works for both spatially and temporally incoherent illumination. To validate the proposed technique simulations were carried out for both the 2D and 3D cases. Experimental data is processed and the results support the feasibility of the encryption method. PMID:26193568

  14. HSA: integrating multi-track Hi-C data for genome-scale reconstruction of 3D chromatin structure.

    PubMed

    Zou, Chenchen; Zhang, Yuping; Ouyang, Zhengqing

    2016-01-01

    Genome-wide 3C technologies (Hi-C) are being increasingly employed to study three-dimensional (3D) genome conformations. Existing computational approaches are unable to integrate accumulating data to facilitate studying 3D chromatin structure and function. We present HSA ( http://ouyanglab.jax.org/hsa/ ), a flexible tool that jointly analyzes multiple contact maps to infer 3D chromatin structure at the genome scale. HSA globally searches the latent structure underlying different cleavage footprints. Its robustness and accuracy outperform or rival existing tools on extensive simulations and orthogonal experiment validations. Applying HSA to recent in situ Hi-C data, we found the 3D chromatin structures are highly conserved across various human cell types. PMID:26936376

  15. Integrating airborne LiDAR dataset and photographic images towards the construction of 3D building model

    NASA Astrophysics Data System (ADS)

    Idris, R.; Latif, Z. A.; Hamid, J. R. A.; Jaafar, J.; Ahmad, M. Y.

    2014-02-01

    A 3D building model of man-made objects is an important tool for various applications such as urban planning, flood mapping and telecommunication. The reconstruction of 3D building models remains difficult. No universal algorithms exist that can extract all objects in an image successfully. At present, advances in remote sensing such as airborne LiDAR (Light Detection and Ranging) technology have changed the conventional method of topographic mapping and increased the interest of these valued datasets towards 3D building model construction. Airborne LiDAR has proven accordingly that it can provide three dimensional (3D) information of the Earth surface with high accuracy. In this study, with the availability of open source software such as Sketch Up, LiDAR datasets and photographic images could be integrated towards the construction of a 3D building model. In order to realize the work an area comprising residential areas situated at Putrajaya in the Klang Valley region, Malaysia, covering an area of two square kilometer was chosen. The accuracy of the derived 3D building model is assessed quantitatively. It is found that the difference between the vertical height (z) of the 3D building models derived from LiDAR dataset and ground survey is approximately ± 0.09 centimeter (cm). For the horizontal component (RMSExy), the accuracy estimates derived for the 3D building models were ± 0.31m. The result also shows that the qualitative assessment of the 3D building models constructed seems feasible for the depiction in the standard of LOD 3 (Level of details).

  16. A 3-D image chamber for the liquid argon TPC based on multi-layer printed circuit board

    NASA Astrophysics Data System (ADS)

    Cennini, P.; Cittolin, S.; Revol, J. P.; Rubbia, C.; Tian, W. H.; Li, X.; Picchi, P.; Cavanna, F.; Piano Mortari, G.; Verdecchia, M.; Cline, D.; Liu, Y.; Muratori, G.; Otwinowski, S.; Wang, H.; Zhou, M.; Bettini, A.; Casagrande, F.; Centro, S.; De Vecchi, C.; Pepato, A.; Pietropaolo, F.; Rossi, P.; Ventura, S.; Benetti, P.; Calligarich, E.; Dolfini, R.; Gigli Berzolari, A.; Mauri, F.; Montanari, C.; Piazzoli, A.; Rappoldi, A.; Raselli, U. L.; Scannicchio, D.; Periale, L.; Suzuki, S.

    1994-08-01

    In our research and development programme for the ICARUS experiment we have developed a novel three-dimensional readout scheme for a liquefied noble gas TPC, where no charge multiplication process takes place. The design avoids completely wire grids and is based on the multilayer circuit technique. As a consequence it is intrinsically safe and suited to be used in large and modular structures as those foreseen for ICARUS. We describe here how the electrodes structure can be simplified leading to the new design principles and we present the results obtained with a small prototype chamber in a 100 GeV μ beam.

  17. Model Simulations of the Diurnal and Seasonal Variations of the Global Electric Circuit Using a Consistent 3D Model Framework

    NASA Astrophysics Data System (ADS)

    Lucas, G.; Bayona, V.; Flyer, N.; Baumgaertner, A. J. G.; Thayer, J. P.

    2014-12-01

    We introduce a new numeric solver for the partial differential equations of the Global Electric Circuit (GEC). The model is applied to derive the ionospheric potential with respect to the Earth, as well as the current distribution and electric fields throughout the atmosphere. We will discuss its advantages to previously published approaches, and introduce the model's application within a larger model framework that consistently describes the thunderstorm/electrified cloud current source distribution and conductivity. The new source and conductivity distributions will be utilized in the new numeric GEC solver to demonstrate the effect that temporal and spatial variability of these inputs have on electric fields and currents throughout the domain.

  18. Server-based approach to web visualization of integrated 3-D medical image data.

    PubMed Central

    Poliakov, A. V.; Albright, E.; Corina, D.; Ojemann, G.; Martin, R. F.; Brinkley, J. F.

    2001-01-01

    Although computer processing power and network bandwidth are rapidly increasing, the average desktop is still not able to rapidly process large datasets such as 3-D medical image volumes. We have therefore developed a server side approach to this problem, in which a high performance graphics server accepts commands from web clients to load, process and render 3-D image volumes and models. The renderings are saved as 2-D snapshots on the server, where they are uploaded and displayed on the client. User interactions with the graphic interface on the client side are translated into additional commands to manipulate the 3-D scene, after which the server re-renders the scene and sends a new image to the client. Example forms-based and Java-based clients are described for a brain mapping application, but the techniques should be applicable to multiple domains where 3-D medical image visualization is of interest. PMID:11825248

  19. Evaluation of AN Integrated Gis-Based Crime Analysis & 3d Modelling for Izmir-Konak Municipality

    NASA Astrophysics Data System (ADS)

    Tarhan, C.; Deniz, D.

    2011-08-01

    GIS integrated 3D modelling is crucial for the city planning and design processes because urban modelling is a tool used in virtual environments, and provides convenience to work. Although, the creation and display of 3D city models for large regions is difficult it is vital for planning and designing safer cities, as well as public places. Today, crime is a significant problem in Turkey. When it was compared by years of crime rates, population growth and urbanization rate, an increasing more than in parallel has been observed. This paper aims to discuss GIS integrated 3D modelling affects in urban planning and design, explaining Turkish planning processes with GIS and 3D modelling. To do that, it presents a case study for Izmir Konak Municipality about GIS integrated crime analysis and 3D models of the crime scenes. Izmir crime records has been obtained from Izmir Police Department belonging to 2003-2004 and 2005 (D. Deniz, 2007) are used for districts' crime map. In the light of these data, the highest rate crime district, Konak, is analyzed between 2001 and 2005 data.

  20. Parallel robot for micro assembly with integrated innovative optical 3D-sensor

    NASA Astrophysics Data System (ADS)

    Hesselbach, Juergen; Ispas, Diana; Pokar, Gero; Soetebier, Sven; Tutsch, Rainer

    2002-10-01

    Recent advances in the fields of MEMS and MOEMS often require precise assembly of very small parts with an accuracy of a few microns. In order to meet this demand, a new approach using a robot based on parallel mechanisms in combination with a novel 3D-vision system has been chosen. The planar parallel robot structure with 2 DOF provides a high resolution in the XY-plane. It carries two additional serial axes for linear and rotational movement in/about z direction. In order to achieve high precision as well as good dynamic capabilities, the drive concept for the parallel (main) axes incorporates air bearings in combination with a linear electric servo motors. High accuracy position feedback is provided by optical encoders with a resolution of 0.1 μm. To allow for visualization and visual control of assembly processes, a camera module fits into the hollow tool head. It consists of a miniature CCD camera and a light source. In addition a modular gripper support is integrated into the tool head. To increase the accuracy a control loop based on an optoelectronic sensor will be implemented. As a result of an in-depth analysis of different approaches a photogrammetric system using one single camera and special beam-splitting optics was chosen. A pattern of elliptical marks is applied to the surfaces of workpiece and gripper. Using a model-based recognition algorithm the image processing software identifies the gripper and the workpiece and determines their relative position. A deviation vector is calculated and fed into the robot control to guide the gripper.

  1. 35 GHz integrated circuit rectifying antenna with 33 percent efficiency

    NASA Astrophysics Data System (ADS)

    Yoo, T.-W.; Chang, K.

    1991-11-01

    A 35 GHz integrated circuit rectifying antenna (rectenna) has been developed using a microstrip dipole antenna and beam-lead mixer diode. Greater than 33 percent conversion efficiency has been achieved. The circuit should have applications in microwave/millimeter-wave power transmission and detection.

  2. 35 GHz integrated circuit rectifying antenna with 33 percent efficiency

    NASA Technical Reports Server (NTRS)

    Yoo, T.-W.; Chang, K.

    1991-01-01

    A 35 GHz integrated circuit rectifying antenna (rectenna) has been developed using a microstrip dipole antenna and beam-lead mixer diode. Greater than 33 percent conversion efficiency has been achieved. The circuit should have applications in microwave/millimeter-wave power transmission and detection.

  3. The Effects of Space Radiation on Linear Integrated Circuit

    NASA Technical Reports Server (NTRS)

    Johnston, A.

    2000-01-01

    Permanent and transient effects are discussed that are induced in linear integrated circuits by space radiation. Recent developments include enhanced damage at low dose rate, increased damage from protons due to displacement effects, and transients in digital comparators that can cause circuit malfunctions.

  4. A 3-D RBF-FD solver for modeling the atmospheric global electric circuit with topography (GEC-RBFFD v1.0)

    NASA Astrophysics Data System (ADS)

    Bayona, V.; Flyer, N.; Lucas, G. M.; Baumgaertner, A. J. G.

    2015-10-01

    A numerical model based on radial basis function-generated finite differences (RBF-FD) is developed for simulating the global electric circuit (GEC) within the Earth's atmosphere, represented by a 3-D variable coefficient linear elliptic partial differential equation (PDE) in a spherically shaped volume with the lower boundary being the Earth's topography and the upper boundary a sphere at 60 km. To our knowledge, this is (1) the first numerical model of the GEC to combine the Earth's topography with directly approximating the differential operators in 3-D space and, related to this, (2) the first RBF-FD method to use irregular 3-D stencils for discretization to handle the topography. It benefits from the mesh-free nature of RBF-FD, which is especially suitable for modeling high-dimensional problems with irregular boundaries. The RBF-FD elliptic solver proposed here makes no limiting assumptions on the spatial variability of the coefficients in the PDE (i.e., the conductivity profile), the right hand side forcing term of the PDE (i.e., distribution of current sources) or the geometry of the lower boundary.

  5. Estimation of uncertainties in geological 3D raster layer models as integral part of modelling procedures

    NASA Astrophysics Data System (ADS)

    Maljers, Denise; den Dulk, Maryke; ten Veen, Johan; Hummelman, Jan; Gunnink, Jan; van Gessel, Serge

    2016-04-01

    applied for DGM Deep proves to be an effective way to (graphically) represent the reliability of the DGM Deep model, although the relative contribution of the various error sources needs further attention. For the DGM Shallow model a cross-validation procedure in a moving window environment has been used to calculate mean deviations and standard errors on a sub-regional scale. Subsequently, these cross validation standard errors have been rescaled to account for local data configuration and clustering. This resulted in standard deviations expressing both regional and local uncertainties. Both workflows are state-of-the-art, form an integral part of the geological modelling and result in reproducible uncertainty values. They can be considered a good starting point for incorporating other errors that contribute to uncertainties of geological 3D raster layer models. For example, the mis-positioning of data used or the error underlying mis-ties at well locations. An additional, perhaps more easy-to-read, parameter that can be calculated to visualize these uncertainties would be the information entropy, as proposed by Wellmann & Regenauer-Lieb (2012). Where a value of 0 means there is no uncertainty, and a value of 1 means there is a high uncertainty. At the moment depth uncertainty information is disseminated through our webportals (www.dinoloket.nl and www.nlog.nl) in an on-line map viewer and as downloadable GIS products.

  6. Augmenting 3d City Model Components by Geodata Joins to Facilitate Ad-Hoc Geometric-Topologically Sound Integration

    NASA Astrophysics Data System (ADS)

    Kaden, R.; Kolbe, T. H.

    2012-07-01

    Virtual 3D city models are integrated complex compositions of spatial data of different themes, origin, quality, scale, and dimensions. Within this paper, we address the problem of spatial compatibility of geodata aiming to provide support for ad-hoc integration of virtual 3D city models including geodata of different sources and themes like buildings, terrain, and city furniture. In contrast to related work which is dealing with the integration of redundant geodata structured according to different data models and ontologies, we focus on the integration of complex 3D models of the same representation (here: CityGML) but regarding to the geometric-topological consistent matching of non-homologous objects, e.g. a building is connected to a road, and their geometric homogenisation. Therefore, we present an approach including a data model for a Geodata Join and the general concept of an integration procedure using the join information. The Geodata Join aims to bridge the lack of information between fragmented geodata by describing the relationship between adjacent objects from different datasets. The join information includes the geometrical representation of those parts of an object, which have a specific/known topological or geometrical relationship to another object. This part is referred to as a Connector and is either described by points, lines, or surfaces of the existing object geometry or by additional join geometry. In addition, the join information includes the specification of the connected object in the other dataset and the description of the topological and geometrical relationship between both objects, which is used to aid the matching process. Furthermore, the Geodata Join contains object-related information like accuracy values and restrictions of movement and deformation which are used to optimize the integration process. Based on these parameters, a functional model including a matching algorithm, transformation methods, and conditioned adjustment

  7. Radiation-hardened transistor and integrated circuit

    DOEpatents

    Ma, Kwok K.

    2007-11-20

    A composite transistor is disclosed for use in radiation hardening a CMOS IC formed on an SOI or bulk semiconductor substrate. The composite transistor has a circuit transistor and a blocking transistor connected in series with a common gate connection. A body terminal of the blocking transistor is connected only to a source terminal thereof, and to no other connection point. The blocking transistor acts to prevent a single-event transient (SET) occurring in the circuit transistor from being coupled outside the composite transistor. Similarly, when a SET occurs in the blocking transistor, the circuit transistor prevents the SET from being coupled outside the composite transistor. N-type and P-type composite transistors can be used for each and every transistor in the CMOS IC to radiation harden the IC, and can be used to form inverters and transmission gates which are the building blocks of CMOS ICs.

  8. Comparing and visualizing titanium implant integration in rat bone using 2D and 3D techniques.

    PubMed

    Arvidsson, Anna; Sarve, Hamid; Johansson, Carina B

    2015-01-01

    The aim was to compare the osseointegration of grit-blasted implants with and without a hydrogen fluoride treatment in rat tibia and femur, and to visualize bone formation using state-of-the-art 3D visualization techniques. Grit-blasted implants were inserted in femur and tibia of 10 Sprague-Dawley rats (4 implants/rat). Four weeks after insertion, bone implant samples were retrieved. Selected samples were imaged in 3D using Synchrotron Radiation-based μCT (SRμCT). The 3D data was quantified and visualized using two novel visualization techniques, thread fly-through and 2D unfolding. All samples were processed to cut and ground sections and 2D histomorphometrical comparisons of bone implant contact (BIC), bone area (BA), and mirror image area (MI) were performed. BA values were statistically significantly higher for test implants than controls (p < 0.05), but BIC and MI data did not differ significantly. Thus, the results partly indicate improved bone formation at blasted and hydrogen fluoride treated implants, compared to blasted implants. The 3D analysis was a valuable complement to 2D analysis, facilitating improved visualization. However, further studies are required to evaluate aspects of 3D quantitative techniques, with relation to light microscopy that traditionally is used for osseointegration studies. PMID:24711247

  9. Chemical etching for automatic processing of integrated circuits

    NASA Technical Reports Server (NTRS)

    Kennedy, B. W.

    1981-01-01

    Chemical etching for automatic processing of integrated circuits is discussed. The wafer carrier and loading from a receiving air track into automatic furnaces and unloading onto a sending air track are included.

  10. The role of power integrated circuits in lightweight spacecraft

    NASA Technical Reports Server (NTRS)

    Klein, John W.; Theisinger, Peter C.

    1988-01-01

    This paper will present definitions for smart power and power integrated circuits and show how, for a typical planetary spacecraft power system, a 37 percent reduction in mass, 89 percent reduction in parts and a 50 percent reduction in volume can be attained. Also discussed are the technology needs for isolation, monolithic current sensing, and high efficiency switching necessary to enable monolithic power structures, as well as various applications of power integrated circuits. A specific example will verify the projected reductions expected when power integrated circuits are implemented in future spacecraft designs. In conclusion, power-integrated circuits can impact the overall design of the spacecraft in all subsystems, not just the power sybsystem.

  11. LEC GaAs for integrated circuit applications

    NASA Technical Reports Server (NTRS)

    Kirkpatrick, C. G.; Chen, R. T.; Homes, D. E.; Asbeck, P. M.; Elliott, K. R.; Fairman, R. D.; Oliver, J. D.

    1984-01-01

    Recent developments in liquid encapsulated Czochralski techniques for the growth of semiinsulating GaAs for integrated circuit applications have resulted in significant improvements in the quality and quantity of GaAs material suitable for device processing. The emergence of high performance GaAs integrated circuit technologies has accelerated the demand for high quality, large diameter semiinsulating GaAs substrates. The new device technologies, including digital integrated circuits, monolithic microwave integrated circuits and charge coupled devices have largely adopted direct ion implantation for the formation of doped layers. Ion implantation lends itself to good uniformity and reproducibility, high yield and low cost; however, this technique also places stringent demands on the quality of the semiinsulating GaAs substrates. Although significant progress was made in developing a viable planar ion implantation technology, the variability and poor quality of GaAs substrates have hindered progress in process development.

  12. An Alignment Method for the Integration of Underwater 3D Data Captured by a Stereovision System and an Acoustic Camera

    PubMed Central

    Lagudi, Antonio; Bianco, Gianfranco; Muzzupappa, Maurizio; Bruno, Fabio

    2016-01-01

    The integration of underwater 3D data captured by acoustic and optical systems is a promising technique in various applications such as mapping or vehicle navigation. It allows for compensating the drawbacks of the low resolution of acoustic sensors and the limitations of optical sensors in bad visibility conditions. Aligning these data is a challenging problem, as it is hard to make a point-to-point correspondence. This paper presents a multi-sensor registration for the automatic integration of 3D data acquired from a stereovision system and a 3D acoustic camera in close-range acquisition. An appropriate rig has been used in the laboratory tests to determine the relative position between the two sensor frames. The experimental results show that our alignment approach, based on the acquisition of a rig in several poses, can be adopted to estimate the rigid transformation between the two heterogeneous sensors. A first estimation of the unknown geometric transformation is obtained by a registration of the two 3D point clouds, but it ends up to be strongly affected by noise and data dispersion. A robust and optimal estimation is obtained by a statistical processing of the transformations computed for each pose. The effectiveness of the method has been demonstrated in this first experimentation of the proposed 3D opto-acoustic camera. PMID:27089344

  13. Large-scale 3D inversion of marine controlled source electromagnetic data using the integral equation method

    NASA Astrophysics Data System (ADS)

    Zhdanov, M. S.; Cuma, M.; Black, N.; Wilson, G. A.

    2009-12-01

    The marine controlled source electromagnetic (MCSEM) method has become widely used in offshore oil and gas exploration. Interpretation of MCSEM data is still a very challenging problem, especially if one would like to take into account the realistic 3D structure of the subsurface. The inversion of MCSEM data is complicated by the fact that the EM response of a hydrocarbon-bearing reservoir is very weak in comparison with the background EM fields generated by an electric dipole transmitter in complex geoelectrical structures formed by a conductive sea-water layer and the terranes beneath it. In this paper, we present a review of the recent developments in the area of large-scale 3D EM forward modeling and inversion. Our approach is based on using a new integral form of Maxwell’s equations allowing for an inhomogeneous background conductivity, which results in a numerically effective integral representation for 3D EM field. This representation provides an efficient tool for the solution of 3D EM inverse problems. To obtain a robust inverse model of the conductivity distribution, we apply regularization based on a focusing stabilizing functional which allows for the recovery of models with both smooth and sharp geoelectrical boundaries. The method is implemented in a fully parallel computer code, which makes it possible to run large-scale 3D inversions on grids with millions of inversion cells. This new technique can be effectively used for active EM detection and monitoring of the subsurface targets.

  14. An Alignment Method for the Integration of Underwater 3D Data Captured by a Stereovision System and an Acoustic Camera.

    PubMed

    Lagudi, Antonio; Bianco, Gianfranco; Muzzupappa, Maurizio; Bruno, Fabio

    2016-01-01

    The integration of underwater 3D data captured by acoustic and optical systems is a promising technique in various applications such as mapping or vehicle navigation. It allows for compensating the drawbacks of the low resolution of acoustic sensors and the limitations of optical sensors in bad visibility conditions. Aligning these data is a challenging problem, as it is hard to make a point-to-point correspondence. This paper presents a multi-sensor registration for the automatic integration of 3D data acquired from a stereovision system and a 3D acoustic camera in close-range acquisition. An appropriate rig has been used in the laboratory tests to determine the relative position between the two sensor frames. The experimental results show that our alignment approach, based on the acquisition of a rig in several poses, can be adopted to estimate the rigid transformation between the two heterogeneous sensors. A first estimation of the unknown geometric transformation is obtained by a registration of the two 3D point clouds, but it ends up to be strongly affected by noise and data dispersion. A robust and optimal estimation is obtained by a statistical processing of the transformations computed for each pose. The effectiveness of the method has been demonstrated in this first experimentation of the proposed 3D opto-acoustic camera. PMID:27089344

  15. Addressable-Matrix Integrated-Circuit Test Structure

    NASA Technical Reports Server (NTRS)

    Sayah, Hoshyar R.; Buehler, Martin G.

    1991-01-01

    Method of quality control based on use of row- and column-addressable test structure speeds collection of data on widths of resistor lines and coverage of steps in integrated circuits. By use of straightforward mathematical model, line widths and step coverages deduced from measurements of electrical resistances in each of various combinations of lines, steps, and bridges addressable in test structure. Intended for use in evaluating processes and equipment used in manufacture of application-specific integrated circuits.

  16. Integrated-circuit balanced parametric amplifier

    NASA Technical Reports Server (NTRS)

    Dickens, L. E.

    1975-01-01

    Amplifier, fabricated on single dielectric substrate, has pair of Schottky barrier varactor diodes mounted on single semiconductor chip. Circuit includes microstrip transmission line and slot line section to conduct signals. Main features of amplifier are reduced noise output and low production cost.

  17. Integrated Circuit Failure Analysis Expert System

    1995-10-03

    The software assists a failure analyst performing failure anaysis on intergrated circuits. The software can also be used to train inexperienced failure analysts. The software also provides a method for storing information and making it easily available to experienced failure analysts.

  18. Analysis and optimization of TSV-TSV coupling in three-dimensional integrated circuits

    NASA Astrophysics Data System (ADS)

    Yingbo, Zhao; Gang, Dong; Yintang, Yang

    2015-04-01

    Through silicon via (TSV)-TSV coupling is detrimental to the performance of three-dimensional (3D) integrated circuits (ICs) with the major negative effect of introducing coupling noise. In order to obtain an accurate estimation of the coupling level from TSV-TSV in the early design stage, this paper first proposes an impedance-level model of the coupling channel between TSVs based on a two-port network, and then derives the formula of the coupling coefficient to describe the TSV-TSV coupling effect. The accuracy of the formula is validated by comparing the results with 3D full-wave simulations. Furthermore, a design technique for optimizing the coupling between adjacent coupled signal TSVs is proposed. Through SPICE simulations, the proposed technique shows its feasibility to reduce the coupling noise for both a simple TSV-TSV circuit and a complicated circuit with more TSVs, and demonstrates its potential for designers in achieving the goal of improving the electrical performance of 3D ICs. Project supported by the National Natural Science Foundation of China (No. 61334003).

  19. The capture and dissemination of integrated 3D geospatial knowledge at the British Geological Survey using GSI3D software and methodology

    NASA Astrophysics Data System (ADS)

    Kessler, Holger; Mathers, Steve; Sobisch, Hans-Georg

    2009-06-01

    The Geological Surveying and Investigation in 3 Dimensions (GSI3D) software tool and methodology has been developed over the last 15 years. Since 2001 this has been in cooperation with the British Geological Survey (BGS). To-date over a hundred BGS geologists have learned to use the software that is now routinely deployed in building systematic and commercial 3D geological models. The success of the GSI3D methodology and software is based on its intuitive design and the fact that it utilises exactly the same data and methods, albeit in digital forms, that geologists have been using for two centuries in order to make geological maps and cross-sections. The geologist constructs models based on a career of observation of geological phenomena, thereby incorporating tacit knowledge into the model. This knowledge capture is a key element to the GSI3D approach. In BGS GSI3D is part of a much wider set of systems and work processes that together make up the cyberinfrastructure of a modern geological survey. The GSI3D software is not yet designed to cope with bedrock structures in which individual stratigraphic surfaces are repeated or inverted, but the software is currently being extended by BGS to encompass these more complex geological scenarios. A further challenge for BGS is to enable its 3D geological models to become part of the semantic Web using GML application schema like GeoSciML. The biggest benefits of widely available systematic geological models will be an enhanced public understanding of the sub-surface in 3D, and the teaching of geoscience students.

  20. Circuit-level input integration in bacterial gene regulation.

    PubMed

    Espinar, Lorena; Dies, Marta; Cagatay, Tolga; Süel, Gürol M; Garcia-Ojalvo, Jordi

    2013-04-23

    Gene regulatory circuits can receive multiple simultaneous inputs, which can enter the system through different locations. It is thus necessary to establish how these genetic circuits integrate multiple inputs as a function of their relative entry points. Here, we use the dynamic circuit regulating competence for DNA uptake in Bacillus subtilis as a model system to investigate this issue. Specifically, we map the response of single cells in vivo to a combination of (i) a chemical signal controlling the constitutive expression of key competence genes, and (ii) a genetic perturbation in the form of copy number variation of one of these genes, which mimics the level of stress signals sensed by the bacteria. Quantitative time-lapse fluorescence microscopy shows that a variety of dynamical behaviors can be reached by the combination of the two inputs. Additionally, the integration depends strongly on the relative locations where the two perturbations enter the circuit. Specifically, when the two inputs act upon different circuit elements, their integration generates novel dynamical behavior, whereas inputs affecting the same element do not. An in silico bidimensional bifurcation analysis of a mathematical model of the circuit offers good quantitative agreement with the experimental observations, and sheds light on the dynamical mechanisms leading to the different integrated responses exhibited by the gene regulatory circuit. PMID:23572583

  1. Ship-in-a-bottle integration by hybrid femtosecond laser technology for fabrication of true 3D biochips

    NASA Astrophysics Data System (ADS)

    Sima, Felix; Wu, Dong; Xu, Jian; Midorikawa, Katsumi; Sugioka, Koji

    2015-03-01

    We propose herein the "ship-in-a-bottle" integration of three-dimensional (3D) polymeric sinusoidal ridges inside photosensitive glass microfluidic channel by a hybrid subtractive - additive femtosecond laser processing method. It consists of Femtosecond Laser Assisted Wet Etching (FLAE) of a photosensitive Foturan glass followed by Two-Photon Polymerization (TPP) of a SU-8 negative epoxy-resin. Both subtractive and additive processes are carried out using the same set-up with the change of laser focusing objective only. A 522 nm wavelength of the second harmonic generation from an amplified femtosecond Yb-fiber laser (FCPA µJewel D-400, IMRA America, 1045 nm; pulse width 360 fs, repetition rate 200 kHz) was employed for irradiation. The new method allows lowering the size limit of 3D objects created inside channels to smaller details down to the dimensions of a cell, and improve the structure stability. Sinusoidal periodic patterns and ridges are of great use as base scaffolds for building up new structures on their top or for modulating cell migration, guidance and orientation while created interspaces can be exploited for microfluidic applications. The glass microchannel offers robustness and appropriate dynamic flow conditions for cellular studies while the integrated patterns are reducing the size of structure to the level of cells responsiveness. Taking advantage of the ability to directly fabricate 3D complex shapes, both glass channels and polymeric integrated patterns enable us to 3D spatially design biochips for specific applications.

  2. Integrated 3D-printed reactionware for chemical synthesis and analysis.

    PubMed

    Symes, Mark D; Kitson, Philip J; Yan, Jun; Richmond, Craig J; Cooper, Geoffrey J T; Bowman, Richard W; Vilbrandt, Turlif; Cronin, Leroy

    2012-05-01

    Three-dimensional (3D) printing has the potential to transform science and technology by creating bespoke, low-cost appliances that previously required dedicated facilities to make. An attractive, but unexplored, application is to use a 3D printer to initiate chemical reactions by printing the reagents directly into a 3D reactionware matrix, and so put reactionware design, construction and operation under digital control. Here, using a low-cost 3D printer and open-source design software we produced reactionware for organic and inorganic synthesis, which included printed-in catalysts and other architectures with printed-in components for electrochemical and spectroscopic analysis. This enabled reactions to be monitored in situ so that different reactionware architectures could be screened for their efficacy for a given process, with a digital feedback mechanism for device optimization. Furthermore, solely by modifying reactionware architecture, reaction outcomes can be altered. Taken together, this approach constitutes a relatively cheap, automated and reconfigurable chemical discovery platform that makes techniques from chemical engineering accessible to typical synthetic laboratories. PMID:22522253

  3. Integrated endoscope for real-time 3D ultrasound imaging and hyperthermia: feasibility study.

    PubMed

    Pua, Eric C; Qiu, Yupeng; Smith, S W

    2007-01-01

    The goal of this research is to determine the feasibility of using a single endoscopic probe for the combined purpose of real-time 3D (RT3D) ultrasound imaging of a target organ and the delivery of ultrasound therapy to facilitate the absorption of compounds for cancer treatment. Recent research in ultrasound therapy has shown that ultrasound-mediated drug delivery improves absorption of treatments for prostate, cervical and esophageal cancer. The ability to combine ultrasound hyperthermia and 3D imaging could improve visualization and targeting of cancerous tissues. In this study, numerical modeling and experimental measurements were developed to determine the feasibility of combined therapy and imaging with a 1 cm diameter endoscopic RT3D probe with 504 transmitters and 252 receive channels. This device operates at 5 MHz and has a 6.3 mm x 6.3 mm aperture to produce real time 3D pyramidal scans of 60-120 degrees incorporating 64 x 64 = 4096 image lines at 30 volumes/sec interleaved with a 3D steerable therapy beam. A finite-element mesh was constructed with over 128,000 elements in LS-DYNA to simulate the induced temperature rise from our transducer with a 3 cm deep focus in tissue. Quarter-symmetry of the transducer was used to reduce mesh size and computation time. Based on intensity values calculated in Field II using the transducer's array geometry, a minimum I(SPTA) of 3.6 W/cm2 is required from our endoscope probe in order to induce a temperature rise of 4 degrees C within five minutes. Experimental measurements of the array's power output capabilities were conducted using a PVDF hydrophone placed 3 cm away from the face of the transducer in a watertank. Using a PDA14 Signatec data acquisition board to capture full volumes of transmitted ultrasound data, it was determined that the probe can presently maintain intensity values up to 2.4 W/cm2 over indefinite times for therapeutic applications combined with intermittent 3D scanning to maintain targeting

  4. Microwave GaAs Integrated Circuits On Quartz Substrates

    NASA Technical Reports Server (NTRS)

    Siegel, Peter H.; Mehdi, Imran; Wilson, Barbara

    1994-01-01

    Integrated circuits for use in detecting electromagnetic radiation at millimeter and submillimeter wavelengths constructed by bonding GaAs-based integrated circuits onto quartz-substrate-based stripline circuits. Approach offers combined advantages of high-speed semiconductor active devices made only on epitaxially deposited GaAs substrates with low-dielectric-loss, mechanically rugged quartz substrates. Other potential applications include integration of antenna elements with active devices, using carrier substrates other than quartz to meet particular requirements using lifted-off GaAs layer in membrane configuration with quartz substrate supporting edges only, and using lift-off technique to fabricate ultrathin discrete devices diced separately and inserted into predefined larger circuits. In different device concept, quartz substrate utilized as transparent support for GaAs devices excited from back side by optical radiation.

  5. Metallization technology for tenth-micron range integrated circuits

    SciTech Connect

    Berry, L.A.; Harper, M.E.

    1996-11-27

    A critical step in the fabrication of integrated circuits is the deposition of metal layers which interconnect the various circuit elements that have been formed in earlier process steps. In particular, columns of copper several times higher than the characteristic dimension of the circuit elements was needed. Features with a diameter of a few tenths of a micron and a height of about one micron need to be filled at rates in the half to one micron per minute range. With the successful development of a copper deposition technology meeting these requirements, integrated circuits with simpler designs and higher performance could be economically manufactured. Several technologies for depositing copper were under development. No single approach had an optimum combination of performance (feature characteristics), cost (deposition rates), and manufacturability (integration with other processes and tool reliability). Chemical vapor deposition, plating, sputtering and ionized-physical vapor deposition (I-PVD) were all candidate technologies. Within this project, the focus was on I-PVD.

  6. Optical integrated circuits and networks on microscale/nanoscale

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.; Song, S. H.

    2007-02-01

    We present an overview of our work on the design and fabrication of micro/nano-scale photonic circuits and networks on what we call "optical printed circuit boards" (O-PCBs) and "VLSI photonic integrated circuit chips"(VLSI-PICs) of generic and application-specific nature. The O-PCBs and photonic chips consist of 2-dimensional planar arrays of optical wires, circuits, and networks of micro/nano-scale to perform the functions of sensing, storing, transporting, processing, switching, routing, and distributing optical signals on flat boards or chips. We describe and discuss scientific and technological issues concerning the miniaturization, interconnection and integration of micro/nano-scale photonic devices, circuits, and networks leading to small and very large scale integration in terms of photonic scaling rules and discuss their use for the design and fabrication of the photonic integrated circuits and networks. Design rules for the miniaturization and integration of the micro/nano-photonic systems are discussed in comparison with those of the micro/nano-electronic systems. Materials include polymer/organic materials and silicon materials. Structural bases include photonic crystals, ring resonators, and plasmonic structures. Compatibility issues between diverse materials and devices are discussed especially in regard to applications. Recent progresses and examples are presented.

  7. Integrated Circuit For Simulation Of Neural Network

    NASA Technical Reports Server (NTRS)

    Thakoor, Anilkumar P.; Moopenn, Alexander W.; Khanna, Satish K.

    1988-01-01

    Ballast resistors deposited on top of circuit structure. Cascadable, programmable binary connection matrix fabricated in VLSI form as basic building block for assembly of like units into content-addressable electronic memory matrices operating somewhat like networks of neurons. Connections formed during storage of data, and data recalled from memory by prompting matrix with approximate or partly erroneous signals. Redundancy in pattern of connections causes matrix to respond with correct stored data.

  8. Integrated 3-D Ground-Penetrating Radar, Outcrop, and Borehole Data Applied to Reservoir Characterization and Flow Simulation

    SciTech Connect

    George McMechan; Rucsandra Corbeanu; Craig Forster; Kristian Soegaard; Xiaoxian Zeng; Carlos Aiken; Robert Szerbiak; Janok Bhattacharya; Michael Wizevich; Xueming Xu; Stephen Snelgrove; Karen Roche; Siang Joo Lim; Djuro Navakovic; Christopher White; Laura Crossey; Deming Wang; John Thurmond; William Hammon III; Mamadou BAlde; Ari Menitove

    2001-08-31

    OAK-B135 (IPLD Cleared) Existing reservoir models are based on 2-D outcrop studies; 3-D aspects are inferred from correlation between wells, and so are inadequately constrained for reservoir simulations. To overcome these deficiencies, we initiated a multidimensional characterization of reservoir analogs in the Cretaceous Ferron Sandstone in Utah. The study was conducted at two sites (Corbula Gulch and Coyote Basin); results from both sites are contained in this report. Detailed sedimentary facies maps of cliff faces define the geometry and distribution of potential reservoir flow units, barriers and baffles at the outcrop. High resolution 2-D and 3-D ground-penetrating radar (GPR) images extend these reservoir characteristics into 3-D, to allow development of realistic 3-D reservoir models. Models use geometric information from the mapping and the GPR data, petrophysical data from surface and cliff-face outcrops, lab analyses of outcrop and core samples, and petrography. The measurements are all integrated into a single coordinate system using GPS and laser mapping of the main sedimentological features and boundaries.The final step is analysis of results of 3-D fluid flow modeling to demonstrate applicability of our reservoir analog studies to well siting and reservoir engineering for maximization of hydrocarbon production. The main goals of the project are achieved. These are the construction of a deterministic 3-D reservoir analog model from a variety of geophysical and geologic measurements at the field sites, integrating these into comprehensive petrophysical models, and flow simulations through these models. This unique approach represents a significant advance in characterization and use of reservoir analogs.

  9. Integrated optical circuits in fiber cladding by tightly focused femtosecond laser writing

    NASA Astrophysics Data System (ADS)

    Maselli, Valeria; Herman, Peter R.

    2010-02-01

    Femtosecond laser direct writing in glass materials represents a simple single-step approach to generate threedimensional (3D) optical circuits that cannot be constructed with traditional fabrication techniques. In this paper, we present an attractive extension of such femtosecond laser processing to the writing of optical circuits directly inside the cladding of single-mode optical fiber. To enable the formation of strongly guided and undistorted waveguide modes within the small cylindrical fused silica volume (125 μm diameter), frequency-doubled (λ = 522 nm) Ytterbium fiber-amplified femtosecond laser light at high repetition rate (500 kHz) was tightly focused with a high 1.25 numerical aperture (NA) oil immersion lens. In this way, low-loss waveguides could be arbitrarily located in various cladding positions without generating ablation damage. Basic components such as directional couplers were demonstrated that present a new means for dense integration of optical elements that couple with the nearby fiber core. Such 3D all-fiber optical circuits represent practical tools to bypass tedious assembly and packaging steps such as fiber pigtailing with planar lightwave components. This formation of optical circuits directly within the cladding of optical fiber opens new prospects for manufacturing compact and functional optical and optofluidic microsystems for Telecom, sensing and lab-on-a fiber applications.

  10. Automated and integrated mask generation from a CAD constructed 3D model.

    SciTech Connect

    Schiek, Richard Louis; Schmidt, Rodney Cannon

    2005-03-01

    We have developed and implemented a method which given a three-dimensional object can infer from topology the two-dimensional masks needed to produce that object with surface micromachining. This design tool calculates the two-dimensional mask set required to produce a given three-dimensional model by investigating the vertical topology to the model. The 3D model is first separated into bodies that are non-intersecting, made from different materials or only linked through a ground plane. Next, for each body unique horizontal cross sections are located and arranged into a tree based on their topological relationship. A branch-wise search of the tree uncovers locations where deposition boundaries must lie and identifies candidate masks creating a generic mask set for the 3D model. Finally, in the last step specific process requirements are considered that may constrain the generic mask set.

  11. Integrating biologically inspired nanomaterials and table-top stereolithography for 3D printed biomimetic osteochondral scaffolds.

    PubMed

    Castro, Nathan J; O'Brien, Joseph; Zhang, Lijie Grace

    2015-09-01

    The osteochondral interface of an arthritic joint is notoriously difficult to regenerate due to its extremely poor regenerative capacity and complex stratified architecture. Native osteochondral tissue extracellular matrix is composed of numerous nanoscale organic and inorganic constituents. Although various tissue engineering strategies exist in addressing osteochondral defects, limitations persist with regards to tissue scaffolding which exhibit biomimetic cues at the nano to micro scale. In an effort to address this, the current work focused on 3D printing biomimetic nanocomposite scaffolds for improved osteochondral tissue regeneration. For this purpose, two biologically-inspired nanomaterials have been synthesized consisting of (1) osteoconductive nanocrystalline hydroxyapatite (nHA) (primary inorganic component of bone) and (2) core-shell poly(lactic-co-glycolic) acid (PLGA) nanospheres encapsulated with chondrogenic transforming growth-factor β1 (TGF-β1) for sustained delivery. Then, a novel table-top stereolithography 3D printer and the nano-ink (i.e., nHA + nanosphere + hydrogel) were employed to fabricate a porous and highly interconnected osteochondral scaffold with hierarchical nano-to-micro structure and spatiotemporal bioactive factor gradients. Our results showed that human bone marrow-derived mesenchymal stem cell adhesion, proliferation, and osteochondral differentiation were greatly improved in the biomimetic graded 3D printed osteochondral construct in vitro. The current work served to illustrate the efficacy of the nano-ink and current 3D printing technology for efficient fabrication of a novel nanocomposite hydrogel scaffold. In addition, tissue-specific growth factors illustrated a synergistic effect leading to increased cell adhesion and directed stem cell differentiation. PMID:26234364

  12. Integrating biologically inspired nanomaterials and table-top stereolithography for 3D printed biomimetic osteochondral scaffolds

    NASA Astrophysics Data System (ADS)

    Castro, Nathan J.; O'Brien, Joseph; Zhang, Lijie Grace

    2015-08-01

    The osteochondral interface of an arthritic joint is notoriously difficult to regenerate due to its extremely poor regenerative capacity and complex stratified architecture. Native osteochondral tissue extracellular matrix is composed of numerous nanoscale organic and inorganic constituents. Although various tissue engineering strategies exist in addressing osteochondral defects, limitations persist with regards to tissue scaffolding which exhibit biomimetic cues at the nano to micro scale. In an effort to address this, the current work focused on 3D printing biomimetic nanocomposite scaffolds for improved osteochondral tissue regeneration. For this purpose, two biologically-inspired nanomaterials have been synthesized consisting of (1) osteoconductive nanocrystalline hydroxyapatite (nHA) (primary inorganic component of bone) and (2) core-shell poly(lactic-co-glycolic) acid (PLGA) nanospheres encapsulated with chondrogenic transforming growth-factor β1 (TGF-β1) for sustained delivery. Then, a novel table-top stereolithography 3D printer and the nano-ink (i.e., nHA + nanosphere + hydrogel) were employed to fabricate a porous and highly interconnected osteochondral scaffold with hierarchical nano-to-micro structure and spatiotemporal bioactive factor gradients. Our results showed that human bone marrow-derived mesenchymal stem cell adhesion, proliferation, and osteochondral differentiation were greatly improved in the biomimetic graded 3D printed osteochondral construct in vitro. The current work served to illustrate the efficacy of the nano-ink and current 3D printing technology for efficient fabrication of a novel nanocomposite hydrogel scaffold. In addition, tissue-specific growth factors illustrated a synergistic effect leading to increased cell adhesion and directed stem cell differentiation.

  13. Integrated WiFi/PDR/Smartphone Using an Unscented Kalman Filter Algorithm for 3D Indoor Localization

    PubMed Central

    Chen, Guoliang; Meng, Xiaolin; Wang, Yunjia; Zhang, Yanzhe; Tian, Peng; Yang, Huachao

    2015-01-01

    Because of the high calculation cost and poor performance of a traditional planar map when dealing with complicated indoor geographic information, a WiFi fingerprint indoor positioning system cannot be widely employed on a smartphone platform. By making full use of the hardware sensors embedded in the smartphone, this study proposes an integrated approach to a three-dimensional (3D) indoor positioning system. First, an improved K-means clustering method is adopted to reduce the fingerprint database retrieval time and enhance positioning efficiency. Next, with the mobile phone’s acceleration sensor, a new step counting method based on auto-correlation analysis is proposed to achieve cell phone inertial navigation positioning. Furthermore, the integration of WiFi positioning with Pedestrian Dead Reckoning (PDR) obtains higher positional accuracy with the help of the Unscented Kalman Filter algorithm. Finally, a hybrid 3D positioning system based on Unity 3D, which can carry out real-time positioning for targets in 3D scenes, is designed for the fluent operation of mobile terminals. PMID:26404314

  14. Integrated WiFi/PDR/Smartphone Using an Unscented Kalman Filter Algorithm for 3D Indoor Localization.

    PubMed

    Chen, Guoliang; Meng, Xiaolin; Wang, Yunjia; Zhang, Yanzhe; Tian, Peng; Yang, Huachao

    2015-01-01

    Because of the high calculation cost and poor performance of a traditional planar map when dealing with complicated indoor geographic information, a WiFi fingerprint indoor positioning system cannot be widely employed on a smartphone platform. By making full use of the hardware sensors embedded in the smartphone, this study proposes an integrated approach to a three-dimensional (3D) indoor positioning system. First, an improved K-means clustering method is adopted to reduce the fingerprint database retrieval time and enhance positioning efficiency. Next, with the mobile phone's acceleration sensor, a new step counting method based on auto-correlation analysis is proposed to achieve cell phone inertial navigation positioning. Furthermore, the integration of WiFi positioning with Pedestrian Dead Reckoning (PDR) obtains higher positional accuracy with the help of the Unscented Kalman Filter algorithm. Finally, a hybrid 3D positioning system based on Unity 3D, which can carry out real-time positioning for targets in 3D scenes, is designed for the fluent operation of mobile terminals. PMID:26404314

  15. Parameterization of training images for aquifer 3-D facies modeling integrating geological interpretations and statistical inference

    NASA Astrophysics Data System (ADS)

    Jha, Sanjeev Kumar; Comunian, Alessandro; Mariethoz, Gregoire; Kelly, Bryce F. J.

    2014-10-01

    We develop a stochastic approach to construct channelized 3-D geological models constrained to borehole measurements as well as geological interpretation. The methodology is based on simple 2-D geologist-provided sketches of fluvial depositional elements, which are extruded in the 3rd dimension. Multiple-point geostatistics (MPS) is used to impair horizontal variability to the structures by introducing geometrical transformation parameters. The sketches provided by the geologist are used as elementary training images, whose statistical information is expanded through randomized transformations. We demonstrate the applicability of the approach by applying it to modeling a fluvial valley filling sequence in the Maules Creek catchment, Australia. The facies models are constrained to borehole logs, spatial information borrowed from an analogue and local orientations derived from the present-day stream networks. The connectivity in the 3-D facies models is evaluated using statistical measures and transport simulations. Comparison with a statistically equivalent variogram-based model shows that our approach is more suited for building 3-D facies models that contain structures specific to the channelized environment and which have a significant influence on the transport processes.

  16. Integration of nano-scale components and supports in micromachined 3D silicon structures

    NASA Astrophysics Data System (ADS)

    Song, J.; Azimi, S.; Y Dang, Z.; Breese, M. B. H.

    2014-04-01

    We have developed a process for the three-dimensional (3D) machining of p-type silicon on a micro- and nano-scale using high-energy ion beam irradiation with one or more energies and fluences, followed by electrochemical anodization in hydrofluoric acid. We present a study of the dependence of our fabricated structures on irradiating ion energies, fluences, geometries and wafer resistivity. All these factors determine whether the micro- and nano-scale features are properly connected to the supports in the 3D silicon structures. If wrongly chosen, any of these factors may cause a breakage at the connection through localized over-etching. Under optimum irradiation and anodization conditions, free-standing patterned membranes can be fabricated with feature dimensions of 100 nm over areas of many square millimeters. This investigation is based on silicon structures but is relevant to any electro-assisted etching process for 3D fabrication, paving the way for achieving free-standing silicon photonics, mechanical resonators and micro-/nano-electromechanical systems.

  17. Multi-channel detector readout method and integrated circuit

    DOEpatents

    Moses, William W.; Beuville, Eric; Pedrali-Noy, Marzio

    2004-05-18

    An integrated circuit which provides multi-channel detector readout from a detector array. The circuit receives multiple signals from the elements of a detector array and compares the sampled amplitudes of these signals against a noise-floor threshold and against one another. A digital signal is generated which corresponds to the location of the highest of these signal amplitudes which exceeds the noise floor threshold. The digital signal is received by a multiplexing circuit which outputs an analog signal corresponding the highest of the input signal amplitudes. In addition a digital control section provides for programmatic control of the multiplexer circuit, amplifier gain, amplifier reset, masking selection, and test circuit functionality on each input thereof.

  18. Multi-channel detector readout method and integrated circuit

    DOEpatents

    Moses, William W.; Beuville, Eric; Pedrali-Noy, Marzio

    2006-12-12

    An integrated circuit which provides multi-channel detector readout from a detector array. The circuit receives multiple signals from the elements of a detector array and compares the sampled amplitudes of these signals against a noise-floor threshold and against one another. A digital signal is generated which corresponds to the location of the highest of these signal amplitudes which exceeds the noise floor threshold. The digital signal is received by a multiplexing circuit which outputs an analog signal corresponding the highest of the input signal amplitudes. In addition a digital control section provides for programmatic control of the multiplexer circuit, amplifier gain, amplifier reset, masking selection, and test circuit functionality on each input thereof.

  19. New 3D parallel GILD electromagnetic modeling and nonlinear inversion using global magnetic integral and local differential equation

    SciTech Connect

    Xie, G.; Li, J.; Majer, E.; Zuo, D.

    1998-07-01

    This paper describes a new 3D parallel GILD electromagnetic (EM) modeling and nonlinear inversion algorithm. The algorithm consists of: (a) a new magnetic integral equation instead of the electric integral equation to solve the electromagnetic forward modeling and inverse problem; (b) a collocation finite element method for solving the magnetic integral and a Galerkin finite element method for the magnetic differential equations; (c) a nonlinear regularizing optimization method to make the inversion stable and of high resolution; and (d) a new parallel 3D modeling and inversion using a global integral and local differential domain decomposition technique (GILD). The new 3D nonlinear electromagnetic inversion has been tested with synthetic data and field data. The authors obtained very good imaging for the synthetic data and reasonable subsurface EM imaging for the field data. The parallel algorithm has high parallel efficiency over 90% and can be a parallel solver for elliptic, parabolic, and hyperbolic modeling and inversion. The parallel GILD algorithm can be extended to develop a high resolution and large scale seismic and hydrology modeling and inversion in the massively parallel computer.

  20. Europeana and 3D

    NASA Astrophysics Data System (ADS)

    Pletinckx, D.

    2011-09-01

    The current 3D hype creates a lot of interest in 3D. People go to 3D movies, but are we ready to use 3D in our homes, in our offices, in our communication? Are we ready to deliver real 3D to a general public and use interactive 3D in a meaningful way to enjoy, learn, communicate? The CARARE project is realising this for the moment in the domain of monuments and archaeology, so that real 3D of archaeological sites and European monuments will be available to the general public by 2012. There are several aspects to this endeavour. First of all is the technical aspect of flawlessly delivering 3D content over all platforms and operating systems, without installing software. We have currently a working solution in PDF, but HTML5 will probably be the future. Secondly, there is still little knowledge on how to create 3D learning objects, 3D tourist information or 3D scholarly communication. We are still in a prototype phase when it comes to integrate 3D objects in physical or virtual museums. Nevertheless, Europeana has a tremendous potential as a multi-facetted virtual museum. Finally, 3D has a large potential to act as a hub of information, linking to related 2D imagery, texts, video, sound. We describe how to create such rich, explorable 3D objects that can be used intuitively by the generic Europeana user and what metadata is needed to support the semantic linking.

  1. An Integrated Multi-component Processing and Interpretation Framework for 3D Borehole Seismic Data

    SciTech Connect

    M. Karrenbach

    2004-04-01

    This report covers the October 2003 until March 2004 time period. Work has continued successfully on several tasks 1 through 7. Most of these tasks have been executed independently. Due to availability of manpower during that time period we progressed steadily and completed some of the tasks, while others are still on going. We achieved the goals that we had set up in the task schedule. Reviewing the results of this work period indicates that our plan is on schedule and we did not encounter any unforeseen problems. The work plan will continue as projected. Several independent tasks pursuant the statement of project objectives have been executed simultaneously and are still on-going. This report summarizes the selection, test processing and test flow generation of a relevant 3D borehole seismic high-resolution test dataset. This multi-component data set is suitable for future use in this project due to data quality and unique acquisition characteristics. This report shows initial processing results that supported the data selection scheduled for Task 1. Use of real data is augmented by the creating a 3D layered synthetic geologic model in which multi-component 3D borehole seismic data were generated using 3D ray tracing. A gridded surface representation of the reflection interfaces as well as fully populated velocity grids were generated and archived. The model consists of a moderately dipping geologic setting with horizon undulations. A realistic velocity variation is used in between the three layers. Acquisition was simulated from a set of equidistant source locations at the surface of the model, while a close to vertical VSP well was used to capture the wave field data. The source pattern was close to a staggered grid pattern. Multi-component particle displacements were recorded every 50 ft down with an array length of 4,000 ft. P-P as well as P-S reflections were specified in the resulting wave field. We ensured a large enough aperture with enough fine sampling

  2. Simulation of proton-induced energy deposition in integrated circuits

    NASA Technical Reports Server (NTRS)

    Fernald, Kenneth W.; Kerns, Sherra E.

    1988-01-01

    A time-efficient simulation technique was developed for modeling the energy deposition by incident protons in modern integrated circuits. To avoid the excessive computer time required by many proton-effects simulators, a stochastic method was chosen to model the various physical effects responsible for energy deposition by incident protons. Using probability density functions to describe the nuclear reactions responsible for most proton-induced memory upsets, the simulator determines the probability of a proton hit depositing the energy necessary for circuit destabilization. This factor is combined with various circuit parameters to determine the expected error-rate in a given proton environment. An analysis of transient or dose-rate effects is also performed. A comparison to experimental energy-disposition data proves the simulator to be quite accurate for predicting the expected number of events in certain integrated circuits.

  3. Development of thermionic integrated circuits for applications in hostile environments

    SciTech Connect

    McCormik, J.B.; Lynn, D.K.; Wilde, D.; Cowan, R.; Hamilton, D.J.; Kerwin, W.; Dooley, R.

    1984-04-10

    This report describes a class of devices known as thermionic integrated circuits (TICs) that are capable of extended operation in ambient temperatures up to 500/sup 0/C and in high radiation environments. The evolution of the TIC concept is discussed. A set of practical design and performance equations is demonstrated. Recent experimental results are discussed in which both devices and simple circuits have successfully operated in 500/sup 0/C environments for extended periods of time.

  4. Development of integrated thermionic circuits for high-temperature applications

    SciTech Connect

    McCormick, J.B.; Wilde, D.; Depp, S.; Hamilton, D.J.; Kerwin, W.

    1981-01-01

    This report describes a class of microminiature, thin film devices known as integrated thermionic circuits (ITC) capable of extended operation in ambient temperatures up to 500/sup 0/C. The evolution of the ITC concept is discussed. A set of practical design and performance equations is demonstrated. Recent experimental results are discussed in which both devices and simple circuits have successfully operated in 500/sup 0/C environments for extended periods of time (greater than 11,000 hours).

  5. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    NASA Technical Reports Server (NTRS)

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

    1984-01-01

    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  6. Fabrication and characterization of gels with integrated channels using 3D printing with microfluidic nozzle for tissue engineering applications.

    PubMed

    Attalla, R; Ling, C; Selvaganapathy, P

    2016-02-01

    The lack of a simple and effective method to integrate vascular network with engineered scaffolds and tissue constructs remains one of the biggest challenges in true 3D tissue engineering. Here, we detail the use of a commercially available, low-cost, open-source 3D printer modified with a microfluidic print-head in order to develop a method for the generation of instantly perfusable vascular network integrated with gel scaffolds seeded with cells. The print-head features an integrated coaxial nozzle that allows the fabrication of hollow, calcium-polymerized alginate tubes that can be easily patterned using 3D printing techniques. The diameter of the hollow channel can be precisely controlled and varied between 500 μm - 2 mm by changing applied flow rates or print-head speed. These channels are integrated into gel layers with a thickness of 800 μm - 2.5 mm. The structural rigidity of these constructs allows the fabrication of multi-layered structures without causing the collapse of hollow channels in lower layers. The 3D printing method was fully characterized at a range of operating speeds (0-40 m/min) and corresponding flow rates (1-30 mL/min) were identified to produce precise definition. This microfluidic design also allows the incorporation of a wide range of scaffold materials as well as biological constituents such as cells, growth factors, and ECM material. Media perfusion of the channels causes a significant viability increase in the bulk of cell-laden structures over the long-term. With this setup, gel constructs with embedded arrays of hollow channels can be created and used as a potential substitute for blood vessel networks. PMID:26842949

  7. Integration Of 3D Geographic Information System (GIS) For Effective Waste Management Practice

    SciTech Connect

    Rood, G.J.; Hecox, G.R.

    2006-07-01

    Soil remediation in response to the presence of residual radioactivity resulting from past MED/AEC activities is currently in progress under the Formerly Utilized Sites Remedial Action Program near the St. Louis, MO airport. During GY05, approximately 92,000 cubic meters (120,000 cubic yards) of radioactive soil was excavated, packaged and transported via rail for disposal at U.S. Ecology or Envirocare of Utah, LLC. To facilitate the management of excavation/transportation/disposal activities, a 3D GIS was developed for the site that was used to estimate the in-situ radionuclide activities, activities in excavation block areas, and shipping activities using a sum-of ratio (SOR) method for combining various radionuclide compounds into applicable transportation and disposal SOR values. The 3D GIS was developed starting with the SOR values for the approximately 900 samples from 90 borings. These values were processed into a three-dimensional (3D) point grid using kriging with nominal grid spacing of 1.5 by 1.5 meter horizontal by 0.3 meter vertical. The final grid, clipped to the area and soil interval above the planned base of excavation, consisted of 210,000 individual points. Standard GIS volumetric and spatial join procedures were used to calculate the volume of soil represented by each grid point, the base of excavation, depth below ground surface, elevation, surface elevation and SOR values for each point in the final grid. To create the maps needed for management, the point grid results were spatially joined to each excavation area in 0.9 meter (3 foot) depth intervals and the average SOR and total volumes were calculations. The final maps were color-coded for easy identification of areas above the specific transportation or disposal criteria. (authors)

  8. Single Event Transients in Linear Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Buchner, Stephen; McMorrow, Dale

    2005-01-01

    On November 5, 2001, a processor reset occurred on board the Microwave Anisotropy Probe (MAP), a NASA mission to measure the anisotropy of the microwave radiation left over from the Big Bang. The reset caused the spacecraft to enter a safehold mode from which it took several days to recover. Were that to happen regularly, the entire mission would be compromised, so it was important to find the cause of the reset and, if possible, to mitigate it. NASA assembled a team of engineers that included experts in radiation effects to tackle the problem. The first clue was the observation that the processor reset occurred during a solar event characterized by large increases in the proton and heavy ion fluxes emitted by the sun. To the radiation effects engineers on the team, this strongly suggested that particle radiation might be the culprit, particularly when it was discovered that the reset circuit contained three voltage comparators (LM139). Previous testing revealed that large voltage transients, or glitches appeared at the output of the LM139 when it was exposed to a beam of heavy ions [NI96]. The function of the reset circuit was to monitor the supply voltage and to issue a reset command to the processor should the voltage fall below a reference of 2.5 V [PO02]. Eventually, the team of engineers concluded that ionizing particle radiation from the solar event produced a negative voltage transient on the output of one of the LM139s sufficiently large to reset the processor on MAP. Fortunately, as of the end of 2004, only two such resets have occurred. The reset on MAP was not the first malfunction on a spacecraft attributed to a transient. That occurred shortly after the launch of NASA s TOPEX/Poseidon satellite in 1992. It was suspected, and later confirmed, that an anomaly in the Earth Sensor was caused by a transient in an operational amplifier (OP-15) [KO93]. Over the next few years, problems on TDRS, CASSINI, [PR02] SOHO [HA99,HA01] and TERRA were also attributed

  9. Three-dimensional integrated circuits for lab-on-chip dielectrophoresis of nanometer scale particles

    NASA Astrophysics Data System (ADS)

    Dickerson, Samuel J.; Noyola, Arnaldo J.; Levitan, Steven P.; Chiarulli, Donald M.

    2007-01-01

    In this paper, we present a mixed-technology micro-system for electronically manipulating and optically detecting virusscale particles in fluids that is designed using 3D integrated circuit technology. During the 3D fabrication process, the top-most chip tier is assembled upside down and the substrate material is removed. This places the polysilicon layer, which is used to create geometries with the process' minimum feature size, in close proximity to a fluid channel etched into the top of the stack. By taking advantage of these processing features inherent to "3D chip-stacking" technology, we create electrode arrays that have a gap spacing of 270 nm. Using 3D CMOS technology also provides the ability to densely integrate analog and digital control circuitry for the electrodes by using the additional levels of the chip stack. We show simulations of the system with a physical model of a Kaposi's sarcoma-associated herpes virus, which has a radius of approximately 125 nm, being dielectrophoretically arranged into striped patterns. We also discuss how these striped patterns of trapped nanometer scale particles create an effective diffraction grating which can then be sensed with macro-scale optical techniques.

  10. Integral testing of relays and circuit breakers

    SciTech Connect

    Bandyopadhyay, K.K.

    1993-12-31

    Among all equipment types considered for seismic qualification, relays have been most extensively studied through testing due to a wide variation of their designs and seismic capacities. A temporary electrical discontinuity or ``chatter`` is the common concern for relays. A chatter duration of 2 milliseconds is typically used as an acceptance criterion to determine the seismic capability of a relay. Many electrical devices, on the other hand, receiving input signals from relays can safely tolerate a chatter level much greater than 2 ms. In Phase I of a test program, Brookhaven National Laboratory performed testing of many relay models using the 2-ms chatter criterion. In Phase II of the program, the factors influencing the relay chatter criterion, and impacts of relay chatter on medium and low voltage circuit breakers and lockout relays were investigated. This paper briefly describes the Phase II tests and presents the important observations.

  11. Research on Joint Parameter Inversion for an Integrated Underground Displacement 3D Measuring Sensor

    PubMed Central

    Shentu, Nanying; Qiu, Guohua; Li, Qing; Tong, Renyuan; Shentu, Nankai; Wang, Yanjie

    2015-01-01

    Underground displacement monitoring is a key means to monitor and evaluate geological disasters and geotechnical projects. There exist few practical instruments able to monitor subsurface horizontal and vertical displacements simultaneously due to monitoring invisibility and complexity. A novel underground displacement 3D measuring sensor had been proposed in our previous studies, and great efforts have been taken in the basic theoretical research of underground displacement sensing and measuring characteristics by virtue of modeling, simulation and experiments. This paper presents an innovative underground displacement joint inversion method by mixing a specific forward modeling approach with an approximate optimization inversion procedure. It can realize a joint inversion of underground horizontal displacement and vertical displacement for the proposed 3D sensor. Comparative studies have been conducted between the measured and inversed parameters of underground horizontal and vertical displacements under a variety of experimental and inverse conditions. The results showed that when experimentally measured horizontal displacements and vertical displacements are both varied within 0 ~ 30 mm, horizontal displacement and vertical displacement inversion discrepancies are generally less than 3 mm and 1 mm, respectively, under three kinds of simulated underground displacement monitoring circumstances. This implies that our proposed underground displacement joint inversion method is robust and efficient to predict the measuring values of underground horizontal and vertical displacements for the proposed sensor. PMID:25871714

  12. A CMOS integrated timing discriminator circuit for fast scintillation counters

    SciTech Connect

    Jochmann, M.W.

    1998-06-01

    Based on a zero-crossing discriminator using a CR differentiation network for pulse shaping, a new CMOS integrated timing discriminator circuit is proposed for fast (t{sub r} {ge} 2 ns) scintillation counters at the cooler synchrotron COSY-Juelich. By eliminating the input signal`s amplitude information by means of an analog continuous-time divider, a normalized pulse shape at the zero-crossing point is gained over a wide dynamic input amplitude range. In combination with an arming comparator and a monostable multivibrator this yields in a highly precise timing discriminator circuit, that is expected to be useful in different time measurement applications. First measurement results of a CMOS integrated logarithmic amplifier, which is part of the analog continuous-time divider, agree well with the corresponding simulations. Moreover, SPICE simulations of the integrated discriminator circuit promise a time walk well below 200 ps (FWHM) over a 40 dB input amplitude dynamic range.

  13. Silica Integrated Optical Circuits Based on Glass Photosensitivity

    NASA Technical Reports Server (NTRS)

    Abushagur, Mustafa A. G.

    1999-01-01

    Integrated optical circuits play a major rule in the new photonics technology both in communication and sensing due to their small size and compatibility with integrated circuits. Currently integrated optical circuits (IOCs) are fabricated using similar manufacturing to those used in the semiconductor industry. In this study we are considering a new technique to fabricate IOCs which does not require layers of photolithography, depositing and etching. This method is based on the photosensitivity of germanosilicate glasses. Waveguides and other IOC devises can be patterned in these glasses by exposing them using UV lasers. This exposure by UV light changes the index of refraction of the germanosilicate glass. This technique enjoys both the simplicity and flexibility of design and fabrication with also the potential of being fast and low cost.

  14. Tightly Coupled Low Cost 3D RISS/GPS Integration Using a Mixture Particle Filter for Vehicular Navigation

    PubMed Central

    Georgy, Jacques; Noureldin, Aboelmagd

    2011-01-01

    Satellite navigation systems such as the global positioning system (GPS) are currently the most common technique used for land vehicle positioning. However, in GPS-denied environments, there is an interruption in the positioning information. Low-cost micro-electro mechanical system (MEMS)-based inertial sensors can be integrated with GPS and enhance the performance in denied GPS environments. The traditional technique for this integration problem is Kalman filtering (KF). Due to the inherent errors of low-cost MEMS inertial sensors and their large stochastic drifts, KF, with its linearized models, has limited capabilities in providing accurate positioning. Particle filtering (PF) was recently suggested as a nonlinear filtering technique to accommodate for arbitrary inertial sensor characteristics, motion dynamics and noise distributions. An enhanced version of PF called the Mixture PF is utilized in this study to perform tightly coupled integration of a three dimensional (3D) reduced inertial sensors system (RISS) with GPS. In this work, the RISS consists of one single-axis gyroscope and a two-axis accelerometer used together with the vehicle’s odometer to obtain 3D navigation states. These sensors are then integrated with GPS in a tightly coupled scheme. In loosely-coupled integration, at least four satellites are needed to provide acceptable GPS position and velocity updates for the integration filter. The advantage of the tightly-coupled integration is that it can provide GPS measurement update(s) even when the number of visible satellites is three or lower, thereby improving the operation of the navigation system in environments with partial blockages by providing continuous aiding to the inertial sensors even during limited GPS satellite availability. To effectively exploit the capabilities of PF, advanced modeling for the stochastic drift of the vertically aligned gyroscope is used. In order to benefit from measurement updates for such drift, which are

  15. Tightly coupled low cost 3D RISS/GPS integration using a mixture particle filter for vehicular navigation.

    PubMed

    Georgy, Jacques; Noureldin, Aboelmagd

    2011-01-01

    Satellite navigation systems such as the global positioning system (GPS) are currently the most common technique used for land vehicle positioning. However, in GPS-denied environments, there is an interruption in the positioning information. Low-cost micro-electro mechanical system (MEMS)-based inertial sensors can be integrated with GPS and enhance the performance in denied GPS environments. The traditional technique for this integration problem is Kalman filtering (KF). Due to the inherent errors of low-cost MEMS inertial sensors and their large stochastic drifts, KF, with its linearized models, has limited capabilities in providing accurate positioning. Particle filtering (PF) was recently suggested as a nonlinear filtering technique to accommodate for arbitrary inertial sensor characteristics, motion dynamics and noise distributions. An enhanced version of PF called the Mixture PF is utilized in this study to perform tightly coupled integration of a three dimensional (3D) reduced inertial sensors system (RISS) with GPS. In this work, the RISS consists of one single-axis gyroscope and a two-axis accelerometer used together with the vehicle's odometer to obtain 3D navigation states. These sensors are then integrated with GPS in a tightly coupled scheme. In loosely-coupled integration, at least four satellites are needed to provide acceptable GPS position and velocity updates for the integration filter. The advantage of the tightly-coupled integration is that it can provide GPS measurement update(s) even when the number of visible satellites is three or lower, thereby improving the operation of the navigation system in environments with partial blockages by providing continuous aiding to the inertial sensors even during limited GPS satellite availability. To effectively exploit the capabilities of PF, advanced modeling for the stochastic drift of the vertically aligned gyroscope is used. In order to benefit from measurement updates for such drift, which are

  16. Integration of Petrophysical Methods and 3D Printing Technology to Replicate Reservoir Pore Systems

    NASA Astrophysics Data System (ADS)

    Ishutov, S.; Hasiuk, F.; Gray, J.; Harding, C.

    2014-12-01

    Pore-scale imaging and modeling are becoming routine geoscience techniques of reservoir analysis and simulation in oil and gas industry. Three-dimensional printing may facilitate the transformation of pore-space imagery into rock models, which can be compared to traditional laboratory methods and literature data. Although current methodologies for rapid rock modeling and printing obscure many details of grain geometry, computed tomography data is one route to refine pore networks and experimentally test hypotheses related to rock properties, such as porosity and permeability. This study uses three-dimensional printing as a novel way of interacting with x-ray computed tomography data from reservoir core plugs based on digital modeling of pore systems in coarse-grained sandstones and limestones. The advantages of using artificial rocks as a proxy are to better understand the contributions of pore system characteristics at various scales to petrophysical properties in oil and gas reservoirs. Pore radii of reservoir sandstones used in this study range from 1 to 100s of microns, whereas the pore radii for limestones vary from 0.01 to 10s of microns. The resolution of computed tomography imaging is ~10 microns; the resolution of 3D digital printing used in the study varies from 2.5 to 300 microns. For this technology to be useful, loss of pore network information must be minimized in the course of data acquisition, modeling, and production as well as verified against core-scale measurements. The ultimate goal of this study is to develop a reservoir rock "photocopier" that couples 3D scanning and modeling with 3D printing to reproduce a) petrophyscially accurate copies of reservoir pore systems and b) digitally modified pore systems for testing hypotheses about reservoir flow. By allowing us to build porous media with known properties (porosity, permeability, surface area), technology will also advance our understanding of the tools used to measure these quantities (e

  17. 3D Integrated geophysical-petrological modelling of the Iranian lithosphere

    NASA Astrophysics Data System (ADS)

    Mousavi, Naeim; Ardestani, Vahid E.; Ebbing, Jörg; Fullea, Javier

    2016-04-01

    The present-day Iranian Plateau is the result of complex tectonic processes associated with the Arabia-Eurasia Plate convergence at a lithospheric scale. In spite of previous mostly 2D geophysical studies, fundamental questions regarding the deep lithospheric and sub-lithospheric structure beneath Iran remain open. A robust 3D model of the thermochemical lithospheric structure in Iran is an important step toward a better understanding of the geological history and tectonic events in the area. Here, we apply a combined geophysical-petrological methodology (LitMod3D) to investigate the present-day thermal and compositional structure in the crust and upper mantle beneath the Arabia-Eurasia collision zone using a comprehensive variety of constraining data: elevation, surface heat flow, gravity potential fields, satellite gravity gradients, xenoliths and seismic tomography. Different mantle compositions were tested in our model based on local xenolith samples and global data base averages for different tectonothermal ages. A uniform mantle composition fails to explain the observed gravity field, gravity gradients and surface topography. A tectonically regionalized lithospheric mantle compositional model is able to explain all data sets including seismic tomography models. Our preliminary thermochemical lithospheric study constrains the depth to Moho discontinuity and intra crustal geometries including depth to sediments. We also determine the depth to Curie isotherm which is known as the base of magnetized crustal/uppermost mantle bodies. Discrepancies with respect to previous studies include mantle composition and the geometry of Moho and Lithosphere-Asthenosphere Boundary (LAB). Synthetic seismic Vs and Vp velocities match existing seismic tomography models in the area. In this study, depleted mantle compositions are modelled beneath cold and thick lithosphere in Arabian and Turan platforms. A more fertile mantle composition is found in collision zones. Based on our 3

  18. Virus enabled 3d nano-array electrodes for integrated Lithium/Sodium-ion microbatteries

    NASA Astrophysics Data System (ADS)

    Liu, Yihang

    Multilayers of functional materials (carbon/electrode/nickel) were hierarchically architectured over tobacco mosaic virus (TMV) templates that were genetically modified to self-assemble in a vertical manner on current-collectors for battery applications. The spaces formed between individual rods effectively accommodated the volume expansion and contraction of electrodes during charge/discharge, while surface carbon coating engineered over these nanorods further enhance the electronic conductivity. The microbattery based on self aligned nanoforests with precise arrangement of various auxiliary material layers including a central nanometric metal core as direct electronic pathway to current collector, can deliver high energy density and stable cycling stability. C/LiFePO4/Ni/TMV nanoforest cathodes for Li-ion batteries and C/Sn/Ni/TMV nanoforest anodes for Na-ion batteries were assembled using physical sputtering deposition. Both 3D nanoforest electrodes show exceptional cycling stability and rate capability.

  19. An Integrated Multi-component Processing and Interpretation Framework for 3D Borehole Seismic Data

    SciTech Connect

    M. Karrenbach

    2004-10-15

    This report covers the April 2004-September 2004 time period. Work has been performed successfully on several tasks 1 through 16. Part of this work has been reported in 15418R03. Most of portions of these tasks have been executed independently. We progressed steadily and completed some of the sub-tasks, while others are still on going. We achieved the goals that we had set up in the task schedule. Reviewing the results of this work period indicates that our plan is solid and we did not encounter any unforeseen problems. The work plan will continue as scheduled. A midyear review will be presented in November or December 2004. Several independent tasks pursuant the statement of project objectives have been executed simultaneously and are still on-going. Use of real seismic test data is augmented by the creation a 3D ray tracing synthetic test data. We used the previously constructed 3D layered model and simulated data acquisition from a set of circular source locations at the surface of the model, while a close to vertical VSP well was used to capture the wave field data. The source pattern was optimized with respect to Fresnel zone width at the target depth. Multi-component particle displacements were recorded every 50 ft down with an array length of 4,000 ft. P-P as well as P-S reflections were specified in the resulting wave field. We ensured a large enough aperture with enough fine sampling to perform advanced processing, imaging and analysis tests in the future during this project. We constantly improved the interfacing of our software libraries with newly designed 3C display classes and mechanisms. We used the previously implemented 3C Work Bench tool as the primary prototyping tool. This work bench allows to load as well as manipulate and display data items in a flexible manner. We continued to demonstrate its basic functionality by loading source maps, horizons, seismic and velocity volumes, well logs into the tool, performing basic QC steps as is necessary

  20. 3D models mapping optimization through an integrated parameterization approach: cases studies from Ravenna

    NASA Astrophysics Data System (ADS)

    Cipriani, L.; Fantini, F.; Bertacchi, S.

    2014-06-01

    Image-based modelling tools based on SfM algorithms gained great popularity since several software houses provided applications able to achieve 3D textured models easily and automatically. The aim of this paper is to point out the importance of controlling models parameterization process, considering that automatic solutions included in these modelling tools can produce poor results in terms of texture utilization. In order to achieve a better quality of textured models from image-based modelling applications, this research presents a series of practical strategies aimed at providing a better balance between geometric resolution of models from passive sensors and their corresponding (u,v) map reference systems. This aspect is essential for the achievement of a high-quality 3D representation, since "apparent colour" is a fundamental aspect in the field of Cultural Heritage documentation. Complex meshes without native parameterization have to be "flatten" or "unwrapped" in the (u,v) parameter space, with the main objective to be mapped with a single image. This result can be obtained by using two different strategies: the former automatic and faster, while the latter manual and time-consuming. Reverse modelling applications provide automatic solutions based on splitting the models by means of different algorithms, that produce a sort of "atlas" of the original model in the parameter space, in many instances not adequate and negatively affecting the overall quality of representation. Using in synergy different solutions, ranging from semantic aware modelling techniques to quad-dominant meshes achieved using retopology tools, it is possible to obtain a complete control of the parameterization process.

  1. Thermally-induced voltage alteration for integrated circuit analysis

    DOEpatents

    Cole, Jr., Edward I.

    2000-01-01

    A thermally-induced voltage alteration (TIVA) apparatus and method are disclosed for analyzing an integrated circuit (IC) either from a device side of the IC or through the IC substrate to locate any open-circuit or short-circuit defects therein. The TIVA apparatus uses constant-current biasing of the IC while scanning a focused laser beam over electrical conductors (i.e. a patterned metallization) in the IC to produce localized heating of the conductors. This localized heating produces a thermoelectric potential due to the Seebeck effect in any conductors with open-circuit defects and a resistance change in any conductors with short-circuit defects, both of which alter the power demand by the IC and thereby change the voltage of a source or power supply providing the constant-current biasing. By measuring the change in the supply voltage and the position of the focused and scanned laser beam over time, any open-circuit or short-circuit defects in the IC can be located and imaged. The TIVA apparatus can be formed in part from a scanning optical microscope, and has applications for qualification testing or failure analysis of ICs.

  2. Practical applications of digital integrated circuits. Part 3: Practical sequential theory and synchronous circuits

    NASA Technical Reports Server (NTRS)

    1973-01-01

    Here, the 7400 line of transistor to transistor logic (TTL) devices is emphasized almost exclusively where hardware is concerned. However, it should be noted that the logic theory contained herein applies to all hardware. Discussed here are synchronous binary UP counters, synchronous DOWN and UP/DOWN counters, integrated circuit counters, shift registers, sequential techniques, and designing sequential counting machines.

  3. Integrated logic circuits using single-atom transistors

    PubMed Central

    Mol, J. A.; Verduijn, J.; Levine, R. D.; Remacle, F.

    2011-01-01

    Scaling down the size of computing circuits is about to reach the limitations imposed by the discrete atomic structure of matter. Reducing the power requirements and thereby dissipation of integrated circuits is also essential. New paradigms are needed to sustain the rate of progress that society has become used to. Single-atom transistors, SATs, cascaded in a circuit are proposed as a promising route that is compatible with existing technology. We demonstrate the use of quantum degrees of freedom to perform logic operations in a complementary-metal–oxide–semiconductor device. Each SAT performs multilevel logic by electrically addressing the electronic states of a dopant atom. A single electron transistor decodes the physical multivalued output into the conventional binary output. A robust scalable circuit of two concatenated full adders is reported, where by utilizing charge and quantum degrees of freedom, the functionality of the transistor is pushed far beyond that of a simple switch. PMID:21808050

  4. Integrated logic circuits using single-atom transistors.

    PubMed

    Mol, J A; Verduijn, J; Levine, R D; Remacle, F; Rogge, S

    2011-08-23

    Scaling down the size of computing circuits is about to reach the limitations imposed by the discrete atomic structure of matter. Reducing the power requirements and thereby dissipation of integrated circuits is also essential. New paradigms are needed to sustain the rate of progress that society has become used to. Single-atom transistors, SATs, cascaded in a circuit are proposed as a promising route that is compatible with existing technology. We demonstrate the use of quantum degrees of freedom to perform logic operations in a complementary-metal-oxide-semiconductor device. Each SAT performs multilevel logic by electrically addressing the electronic states of a dopant atom. A single electron transistor decodes the physical multivalued output into the conventional binary output. A robust scalable circuit of two concatenated full adders is reported, where by utilizing charge and quantum degrees of freedom, the functionality of the transistor is pushed far beyond that of a simple switch. PMID:21808050

  5. Printed organic thin-film transistor-based integrated circuits

    NASA Astrophysics Data System (ADS)

    Mandal, Saumen; Noh, Yong-Young

    2015-06-01

    Organic electronics is moving ahead on its journey towards reality. However, this technology will only be possible when it is able to meet specific criteria including flexibility, transparency, disposability and low cost. Printing is one of the conventional techniques to deposit thin films from solution-based ink. It is used worldwide for visual modes of information, and it is now poised to enter into the manufacturing processes of various consumer electronics. The continuous progress made in the field of functional organic semiconductors has achieved high solubility in common solvents as well as high charge carrier mobility, which offers ample opportunity for organic-based printed integrated circuits. In this paper, we present a comprehensive review of all-printed organic thin-film transistor-based integrated circuits, mainly ring oscillators. First, the necessity of all-printed organic integrated circuits is discussed; we consider how the gap between printed electronics and real applications can be bridged. Next, various materials for printed organic integrated circuits are discussed. The features of these circuits and their suitability for electronics using different printing and coating techniques follow. Interconnection technology is equally important to make this product industrially viable; much attention in this review is placed here. For high-frequency operation, channel length should be sufficiently small; this could be achievable with a combination of surface treatment-assisted printing or laser writing. Registration is also an important issue related to printing; the printed gate should be perfectly aligned with the source and drain to minimize parasitic capacitances. All-printed organic inverters and ring oscillators are discussed here, along with their importance. Finally, future applications of all-printed organic integrated circuits are highlighted.

  6. Effects of Secondary Circuit Modeling on Results of Pressurized Water Reactor Main Steam Line Break Benchmark Calculations with New Coupled Code TRAB-3D/SMABRE

    SciTech Connect

    Daavittila, Antti; Haemaelaeinen, Anitta; Kyrki-Rajamaeki, Riitta

    2003-05-15

    All of the three exercises of the Organization for Economic Cooperation and Development/Nuclear Regulatory Commission pressurized water reactor main steam line break (PWR MSLB) benchmark were calculated at VTT, the Technical Research Centre of Finland. For the first exercise, the plant simulation with point-kinetic neutronics, the thermal-hydraulics code SMABRE was used. The second exercise was calculated with the three-dimensional reactor dynamics code TRAB-3D, and the third exercise with the combination TRAB-3D/SMABRE. VTT has over ten years' experience of coupling neutronic and thermal-hydraulic codes, but this benchmark was the first time these two codes, both developed at VTT, were coupled together. The coupled code system is fast and efficient; the total computation time of the 100-s transient in the third exercise was 16 min on a modern UNIX workstation. The results of all the exercises are similar to those of the other participants. In order to demonstrate the effect of secondary circuit modeling on the results, three different cases were calculated. In case 1 there is no phase separation in the steam lines and no flow reversal in the aspirator. In case 2 the flow reversal in the aspirator is allowed, but there is no phase separation in the steam lines. Finally, in case 3 the drift-flux model is used for the phase separation in the steam lines, but the aspirator flow reversal is not allowed. With these two modeling variations, it is possible to cover a remarkably broad range of results. The maximum power level reached after the reactor trip varies from 534 to 904 MW, the range of the time of the power maximum being close to 30 s. Compared to the total calculated transient time of 100 s, the effect of the secondary side modeling is extremely important.

  7. Topological Properties of Some Integrated Circuits for Very Large Scale Integration Chip Designs

    NASA Astrophysics Data System (ADS)

    Swanson, S.; Lanzerotti, M.; Vernizzi, G.; Kujawski, J.; Weatherwax, A.

    2015-03-01

    This talk presents topological properties of integrated circuits for Very Large Scale Integration chip designs. These circuits can be implemented in very large scale integrated circuits, such as those in high performance microprocessors. Prior work considered basic combinational logic functions and produced a mathematical framework based on algebraic topology for integrated circuits composed of logic gates. Prior work also produced an historically-equivalent interpretation of Mr. E. F. Rent's work for today's complex circuitry in modern high performance microprocessors, where a heuristic linear relationship was observed between the number of connections and number of logic gates. This talk will examine topological properties and connectivity of more complex functionally-equivalent integrated circuits. The views expressed in this article are those of the author and do not reflect the official policy or position of the United States Air Force, Department of Defense or the U.S. Government.

  8. Shape determination and placement algorithms for hierarchical integrated circuit layout

    NASA Astrophysics Data System (ADS)

    Slutz, E. A.

    Algorithms for the automatic layout of integrated circuits are presented. The algorithms use a hierarchical decomposition of the circuit structure. Since this reduces the complexity of the design, it is an aid to the designer as well as the means of making possible the automated approach to layout. The layout method consists of two phases: a top-down phase during which the shapes of the components at each level are determined, followed by a bottomup phase where a final placement and routing for each level is computed. The data structure used to model the chip surface is central to the algorithms. This data structure is presented along with the alternative structures. Four basic operations of adding components, deleting components, sizing, and building the structure for a given placement are described. A file format for capturing integrated circuit design information is also described.

  9. Integration of Libration Point Orbit Dynamics into a Universal 3-D Autonomous Formation Flying Algorithm

    NASA Technical Reports Server (NTRS)

    Folta, David; Bauer, Frank H. (Technical Monitor)

    2001-01-01

    The autonomous formation flying control algorithm developed by the Goddard Space Flight Center (GSFC) for the New Millennium Program (NMP) Earth Observing-1 (EO-1) mission is investigated for applicability to libration point orbit formations. In the EO-1 formation-flying algorithm, control is accomplished via linearization about a reference transfer orbit with a state transition matrix (STM) computed from state inputs. The effect of libration point orbit dynamics on this algorithm architecture is explored via computation of STMs using the flight proven code, a monodromy matrix developed from a N-body model of a libration orbit, and a standard STM developed from the gravitational and coriolis effects as measured at the libration point. A comparison of formation flying Delta-Vs calculated from these methods is made to a standard linear quadratic regulator (LQR) method. The universal 3-D approach is optimal in the sense that it can be accommodated as an open-loop or closed-loop control using only state information.

  10. Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration

    NASA Astrophysics Data System (ADS)

    Huffman, Alan; Lannon, John; Lueck, Matthew; Gregory, Christopher; Temple, Dorota

    2009-03-01

    The use of collapsible (solder) bump interconnects in pixel detector hybridization has been shown to be very successful. However, as pixel sizes decrease, the use of non-collapsible metal-to-metal bump bonding methods is needed to push the interconnect dimensions smaller. Furthermore, these interconnects are compatible with 3D intgration technologies which are being considered to increase overall pixel and system performance. These metal-to-metal bonding structures provide robust mechanical and electrical connections and allow for a dramatic increase in pixel density. Of particular interest are Cu-Cu thermocompression bonding and Cu/Sn-Cu solid-liquid diffusion bonding processes. Working with Fermilab, RTI undertook a demonstration to show that these bump structures could be reliably used to interconnect devices designed with 20 micron I/O pitch. Cu and Cu/Sn bump fabrication processes were developed to provide a well-controlled surface topography necessary for the formation of low resistance, high yielding, and reliable interconnects. The electrical resistance and yield has been quantified based on electrical measurements of daisy chain test structures and the mechanical strength of the bonding has been quantified through die shear testing. The reliability has been characterized through studies of the impact of thermal exposure on the mechanical performance of the bonds. Cross-section SEM analysis, coupled with high resolution energy dispersive spectroscopy, has provided insight into the physical and chemical nature of the bonding interfaces and aided in the evaluation of the long-term stability of the bonds.

  11. Integrated circuit with dissipative layer for photogenerated carriers

    DOEpatents

    Myers, D.R.

    1988-04-20

    The sensitivity of an integrated circuit to single-event upsets is decreased by providing a dissipative layer of silicon nitride between a silicon substrate and the active device. Free carriers generated in the substrate are dissipated by the layer before they can build up charge on the active device. 1 fig.

  12. Performance of digital integrated circuit technologies at very high temperatures

    SciTech Connect

    Prince, J.L.; Draper, B.L.; Rapp, E.A.; Kromberg, J.N.; Fitch, L.T.

    1980-01-01

    Results of investigations of the performance and reliability of digital bipolar and CMOS integrated circuits over the 25 to 340/sup 0/C range are reported. Included in these results are both parametric variation information and analysis of the functional failure mechanisms. Although most of the work was done using commercially available circuits (TTL and CMOS) and test chips from commercially compatible processes, some results of experimental simulations of dielectrically isolated CMOS are also discussed. It was found that commercial Schottky clamped TTL, and dielectrically isolated, low power Schottky-clamped TTL, functioned to junction temperatures in excess of 325/sup 0/C. Standard gold doped TTL functioned only to 250/sup 0/C, while commercial, isolated I/sup 2/L functioned to the range 250/sup 0/C to 275/sup 0/C. Commercial junction isolated CMOS, buffered and unbuffered, functioned to the range 280/sup 0/C to 310/sup 0/C/sup +/, depending on the manufacturer. Experimental simulations of simple dielectrically isolated CMOS integrated circuits, fabricated with heavier doping levels than normal, functioned to temperatures in excess of 340/sup 0/C. High temperature life testing of experimental, silicone-encapsulated simple TTL and CMOS integrated circuits have shown no obvious life limiting problems to date. No barrier to reliable functionality of TTL bipolar or CMOS integrated ciruits at temperatures in excess of 300/sup 0/C has been found.

  13. Chemical vapor deposition for automatic processing of integrated circuits

    NASA Technical Reports Server (NTRS)

    Kennedy, B. W.

    1980-01-01

    Chemical vapor deposition for automatic processing of integrated circuits including the wafer carrier and loading from a receiving air track into automatic furnaces and unloading on to a sending air track is discussed. Passivation using electron beam deposited quartz is also considered.

  14. 1998 technology roadmap for integrated circuits used in critical applications

    SciTech Connect

    Dellin, T.A.

    1998-09-01

    Integrated Circuits (ICs) are being extensively used in commercial and government applications that have extreme consequences of failure. The rapid evolution of the commercial microelectronics industry presents serious technical and supplier challenges to this niche critical IC marketplace. This Roadmap was developed in conjunction with the Using ICs in Critical Applications Workshop which was held in Albuquerque, NM, November 11--12, 1997.

  15. FASTHELP. Integrated Circuit Failure Analysis Hypertext Help System

    SciTech Connect

    Henderson, C.; Barton, D.; Campbell, A.; Cole, E.; Mikawa, R.E.; Peterson, K.A.; Rife, J.L.; Soden, J.M.

    1994-09-30

    This software assists a failure analyst performing failure analysis on integrated circuits. The software can also be used to train inexperienced failure analysts. The software also provides a method for storing information and making it easily available to experienced failure analysts.

  16. Bioluminescent bioreporter integrated circuit devices and methods for detecting ammonia

    DOEpatents

    Simpson, Michael L [Knoxville, TN; Paulus, Michael J [Knoxville, TN; Sayler, Gary S [Blaine, TN; Applegate, Bruce M [West Lafayette, IN; Ripp, Steven A [Knoxville, TN

    2007-04-24

    Monolithic bioelectronic devices for the detection of ammonia includes a microorganism that metabolizes ammonia and which harbors a lux gene fused with a heterologous promoter gene stably incorporated into the chromosome of the microorganism and an Optical Application Specific Integrated Circuit (OASIC). The microorganism is generally a bacterium.

  17. Integrated circuit with dissipative layer for photogenerated carriers

    DOEpatents

    Myers, David R.

    1989-01-01

    The sensitivity of an integrated circuit to single-event upsets is decreased by providing a dissi The U.S. Government has rights in this invention pursuant to Contract No. DE-ACO4-76DP00789 between the Department of Energy and AT&T Technologies, Inc.

  18. Integrated circuit with dissipative layer for photogenerated carriers

    DOEpatents

    Myers, D.R.

    1989-09-12

    The sensitivity of an integrated circuit to single-event upsets is decreased by providing a dissi The U.S. Government has rights in this invention pursuant to Contract No. DE-ACO4-76DP00789 between the Department of Energy and AT&T Technologies, Inc.

  19. An integrated circuit/packet switched videoconferencing system

    SciTech Connect

    Kippenhan, H.A. Jr.; Lidinsky, W.P.; Roediger, G.A.; Watts, T.A.

    1995-11-01

    The HEP Network Resource Center (HEPNRC) at Fermilab and the Collider Detector Facility (CDF) collaboration have evolved a flexible, cost-effective, widely accessible videoconferencing system for use by high energy physics collaborations and others wishing to use videoconferencing. No current systems seemed to fully meet the needs of high energy physics collaborations. However, two classes of videoconferencing technology: circuit-switched and packet-switched, if integrated, might encompass most of HEP`s needs. It was also realized that, even with this integration, some additional functions were needed and some of the existing functions were not always wanted. HEPNRC with the help of members of the CDF collaboration set out to develop such an integrated system using as many existing subsystems and components as possible. This system is called VUPAC (Videoconferencing Using PAckets and Circuits). This paper begins with brief descriptions of the circuit-switched and packet-switched videoconferencing systems. Following this, issues and limitations of these systems are considered. Next the VUPAC system is described. Integration is accomplished primarily by a circuit/packet videoconferencing interface. Augmentation is centered in another subsystem called MSB (Multiport multisession Bridge). Finally, there is a discussion of the future work needed in the evolution of this system.

  20. Integration of genomic and medical data into a 3D atlas of human anatomy.

    PubMed

    Turinsky, Andrei L; Fanea, Elena; Trinh, Quang; Dong, Xiaoli; Stromer, Julie N; Shu, Xueling; Wat, Stephen; Hallgrímsson, Benedikt; Hill, Jonathan W; Edwards, Carol; Grosenick, Brenda; Yajima, Masumi; Sensen, Christoph W

    2008-01-01

    We have developed a framework for the visual integration and exploration of multi-scale biomedical data, which includes anatomical and molecular components. We have also created a Java-based software system that integrates molecular information, such as gene expression data, into a three-dimensional digital atlas of the male adult human anatomy. Our atlas is structured according to the Terminologia Anatomica. The underlying data-indexing mechanism uses open standards and semantic ontology-processing tools to establish the associations between heterogeneous data types. The software system makes an extensive use of virtual reality visualization. PMID:18391362

  1. Accurate and efficient Nyström volume integral equation method for the Maxwell equations for multiple 3-D scatterers

    NASA Astrophysics Data System (ADS)

    Chen, Duan; Cai, Wei; Zinser, Brian; Cho, Min Hyung

    2016-09-01

    In this paper, we develop an accurate and efficient Nyström volume integral equation (VIE) method for the Maxwell equations for a large number of 3-D scatterers. The Cauchy Principal Values that arise from the VIE are computed accurately using a finite size exclusion volume together with explicit correction integrals consisting of removable singularities. Also, the hyper-singular integrals are computed using interpolated quadrature formulae with tensor-product quadrature nodes for cubes, spheres and cylinders, that are frequently encountered in the design of meta-materials. The resulting Nyström VIE method is shown to have high accuracy with a small number of collocation points and demonstrates p-convergence for computing the electromagnetic scattering of these objects. Numerical calculations of multiple scatterers of cubic, spherical, and cylindrical shapes validate the efficiency and accuracy of the proposed method.

  2. The Integration of GPR, GIS, and GPS for 3D Soil Morphologic Models

    NASA Astrophysics Data System (ADS)

    Tischler, M.; Collins, M. E.

    2005-05-01

    Ground-Penetrating Radar (GPR) has become a useful and efficient instrument for gathering information about subsurface diagnostic horizons in Florida soils. Geographic Information Systems (GIS) are a popular and valuable tool for spatial data analysis of real world features in a digital environment. Ground-Penetrating Radar can be linked to GIS by using Global Positioning Systems (GPS). By combining GPR, GPS, and GIS technologies, a more detailed geophysical survey can be completed for an area of interest by integratinghydrologic, pedologic, and geologic data. Thus, the objectives of this research were to identify subsurface soil layers using GPR and their geographic position with a highly accurate GPS; to develop a procedure to import GPR data into a popular software package, such as ArcGIS, and; to create 3D subsurface models based on the imported GPR data. The site for this study was the Plant Science Research and Education Center in Marion County, Florida. The soils are characterized by Recent-Pleistocene-age sand over the clayey, marine deposited Plio-Miocene-age Hawthorn Formation which drapes the Eocene-age Ocala Limestone. Consequently, soils in the research area vary from deep quartz sands (Typic Quartzipsamments) to shallow outcrops of the Hawthorn Formation (Arenic Hapludalfs). A GPR survey was performed on a 160 m x 320 m grid to gather data for processing. Four subsurface models estimating the depth to argillic horizon were created using a variety of specialized GPR data filters and geostatistical data analyses. The models were compared with ground-truth points that measured the depth to argillic horizon to validate each model and calculate error metrics. These models may assist research station personnel to determine best management practices (including experimental plot placement, irrigation management, fertilizer treatment, and pesticide applications). In addition, the developed methodology exploits the potential of combining GPR and GIS.

  3. Architectural integration of the components necessary for electrical energy storage on the nanoscale and in 3D.

    PubMed

    Rhodes, Christopher P; Long, Jeffrey W; Pettigrew, Katherine A; Stroud, Rhonda M; Rolison, Debra R

    2011-04-01

    We describe fabrication of three-dimensional (3D) multifunctional nanoarchitectures in which the three critical components of a battery--cathode, separator/electrolyte, and anode--are internally assembled as tricontinuous nanoscopic phases. The architecture is initiated using sol-gel chemistry and processing to erect a 3D self-wired nanoparticulate scaffold of manganese oxide (>200 m(2) g(-1)) with a continuous, open, and mesoporous void volume. The integrated 3D system is generated by exhaustive coverage of the oxide network by an ultrathin, conformal layer of insulating polymer that forms via self-limiting electrodeposition of poly(phenylene oxide). The remaining interconnected void volume is then wired with RuO(2) nanowebs using subambient thermal decomposition of RuO(4). Transmission electron microscopy demonstrates that the three nanoscopic charge-transfer functional components--manganese oxide, polymer separator/cation conductor, and RuO(2)--exhibit the stratified, tricontinuous design of the phase-by-phase construction. This architecture contains all three components required for a solid-state energy storage device within a void volume sized at tens of nanometres such that nanometre-thick distances are established between the opposing electrodes. We have now demonstrated the ability to assemble multifunctional energy-storage nanoarchitectures on the nanoscale and in three dimensions. PMID:21327256

  4. Preliminary results of 3D inversion of the EarthScope Oregon MT data using the integral equation method

    NASA Astrophysics Data System (ADS)

    Green, A.; Gribenko, A.; Cuma, M.; Zhdanov, M. S.

    2008-12-01

    In this paper we apply 3D inversion to MT data collected in Oregon as a part of the EarthScope project. We use the integral equation method as a forward modeling engine. Quasi-analytical approximation with a variable background (QAVB) method of Frechet derivative calculation is applied. This technique allows us to simplify the inversion algorithm and to use just one forward modeling on every iteration step. The receiver footprint approach considerably reduces the computational resources needed to invert the large volumes of data covering vast areas. The data set, which was used in the inversion, was obtained through the Incorporated Research Institutions for Seismology (IRIS). The long-period MT data was collected in Eastern Oregon in 2006. The inverted electrical conductivity distribution agrees reasonably well with geological features of the region as well as with 3D MT inversion results obtained by other researchers. The geoelectrical model of the Oregon deep interior produced by 3D inversion indicates several lithospheres' electrical conductivity anomalies, including a linear zone marked by low-high conductivity transition along the Klamath Blue Mountain Lineament associated with a linear trend of gravity minima. High electrical conductivity values occur in the upper crust under the accreted terrains in the Blue Mountains region.

  5. Pipe3D, a pipeline to analyze Integral Field Spectroscopy Data: II. Analysis sequence and CALIFA dataproducts

    NASA Astrophysics Data System (ADS)

    Sánchez, S. F.; Pérez, E.; Sánchez-Blázquez, P.; García-Benito, R.; Ibarra-Mede, H. J.; González, J. J.; Rosales-Ortega, F. F.; Sánchez-Menguiano, L.; Ascasibar, Y.; Bitsakis, T.; Law, D.; Cano-Díaz, M.; López-Cobá, C.; Marino, R. A.; Gil de Paz, A.; López-Sánchez, A. R.; Barrera-Ballesteros, J.; Galbany, L.; Mast, D.; Abril-Melgarejo, V.; Roman-Lopes, A.

    2016-04-01

    We present Pipe3D, an analysis pipeline based on the FIT3D fitting tool, developed to explore the properties of the stellar populations and ionized gas of integral field spectroscopy (IFS) data. Pipe3D was created to provide coherent, simple to distribute, and comparable dataproducts, independently of the origin of the data, focused on the data of the most recent IFU surveys (e.g., CALIFA, MaNGA, and SAMI), and the last generation IFS instruments (e.g., MUSE). In this article we describe the different steps involved in the analysis of the data, illustrating them by showing the dataproducts derived for NGC 2916, observed by CALIFA and P-MaNGA. As a practical example of the pipeline we present the complete set of dataproducts derived for the 200 datacubes that comprises the V500 setup of the CALIFA Data Release 2 (DR2), making them freely available through the network. Finally, we explore the hypothesis that the properties of the stellar populations and ionized gas of galaxies at the effective radius are representative of the overall average ones, finding that this is indeed the case.

  6. Radiation damage in MOS integrated circuits, Part 1

    NASA Technical Reports Server (NTRS)

    Danchenko, V.

    1971-01-01

    Complementary and p-channel MOS integrated circuits made by four commercial manufacturers were investigated for sensitivity to radiation environment. The circuits were irradiated with 1.5 MeV electrons. The results are given for electrons and for the Co-60 gamma radiation equivalent. The data are presented in terms of shifts in the threshold potentials and changes in transconductances and leakages. Gate biases of -10V, +10V and zero volts were applied to individual MOS units during irradiation. It was found that, in most of circuits of complementary MOS technologies, noticable changes due to radiation appear first as increased leakage in n-channel MOSFETs somewhat before a total integrated dose 10 to the 12th power electrons/sg cm is reached. The inability of p-channel MOSFETs to turn on sets in at about 10 to the 13th power electrons/sq cm. Of the circuits tested, an RCA A-series circuit was the most radiation resistant sample.

  7. Flexible circuits with integrated switches for robotic shape sensing

    NASA Astrophysics Data System (ADS)

    Harnett, C. K.

    2016-05-01

    Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.

  8. Monolithically fabricated germanium-on-SOI photodetector and Si CMOS circuit for integrated photonic applications

    NASA Astrophysics Data System (ADS)

    Ang, Kah-Wee; Liow, Tsung-Yang; Yu, Ming-Bin; Fang, Qing; Song, Junfeng; Lo, Guo Q.; Kwong, Dim-Lee

    2010-05-01

    In this paper, we report our design and fabrication approach towards realizing a monolithic integration of Ge photodetector and Si CMOS circuits on common SOI platform for integrated photonic applications. The approach, based on the Ge-on-SOI technology, enables the realization of high sensitivity and low noise photodetector that is capable of performing efficient optical-to-electrical encoding in the near-infrared wavelengths regime. When operated at a bias of -1.0V, a vertical PIN detector achieved a lower Idark of ~0.57μA as compared to a lateral PIN detector, a value that is below the typical ~1μA upper limit acceptable for high speed receiver design. Very high responsivity of ~0.92A/W was obtained in both detector designs for a wavelength of 1550nm, which corresponds to a quantum efficiency of ~73%. Impulse response measurements showed that a vertical PIN photodetector gives rise to a smaller FWHM of ~24.4ps, which corresponds to a -3dB bandwidth of ~11.3GHz where RC time delay is known to be the dominant factor limiting the speed performance. Eye patterns (PRBS 27-1) measurement further confirms the achievement of high speed and low noise photodetection at a bit-rate of 8.5Gb/s. In addition, we evaluate the DC characteristics of the monolithically fabricated Si CMOS inverter circuit. Excellent transfer and output characteristics were achieved by the integrated CMOS inverter circuits in addition to the well behaved logic functions. We also assess the impact of the additional thermal budget introduced by the Ge epitaxy growth on the threshold voltage variation of the short channel CMOS transistors and discuss the issues and potential for the seamless integration of electronic and photonic integrated circuits.

  9. Rapid Low-Temperature 3D Integration of Silicon Nanowires on Flexible Substrates.

    PubMed

    Kim, Yoonkap; Kim, Han-Jung; Kim, Jae-Hyun; Choi, Dae-Geun; Choi, Jun-Hyuk; Jung, Joo-Yun; Jeon, Sohee; Lee, Eung-Sug; Jeong, Jun-Ho; Lee, Jihye

    2015-08-26

    The vertical integration of 1D nanostructures onto the 2D substrates has the potential to offer significant performance gains to flexible electronic devices due to high integration density, large surface area, and improved light absorption and trapping. A simple, rapid, and low temperature transfer bonding method has been developed for this purpose. Ultrasonic vibration is used to achieve a low temperature bonding within a few seconds, resulting in a polymer-matrix-free, electrically conducting vertical assembly of silicon nanowires (SiNWs) with a graphene/PET substrate. The microscopic structure, and mechanical and electrical characteristics of the interface between the transferred SiNW array and graphene layer are subsequently investigated, revealing that this creates a mechanically robust and electrically Ohmic contact. This newly developed ultrasonic transfer bonding technique is also found to be readily adaptable for diverse substrates of both metal and polymer. It is therefore considered as a valuable technique for integrating 1D vertical nanostructures onto the 2D flexible substrates for flexible photovoltaics, energy storage, and water splitting systems. PMID:25943430

  10. Flexible, High-Speed CdSe Nanocrystal Integrated Circuits.

    PubMed

    Stinner, F Scott; Lai, Yuming; Straus, Daniel B; Diroll, Benjamin T; Kim, David K; Murray, Christopher B; Kagan, Cherie R

    2015-10-14

    We report large-area, flexible, high-speed analog and digital colloidal CdSe nanocrystal integrated circuits operating at low voltages. Using photolithography and a newly developed process to fabricate vertical interconnect access holes, we scale down device dimensions, reducing parasitic capacitances and increasing the frequency of circuit operation, and scale up device fabrication over 4 in. flexible substrates. We demonstrate amplifiers with ∼7 kHz bandwidth, ring oscillators with <10 μs stage delays, and NAND and NOR logic gates. PMID:26407206

  11. Modeling of single-event upset in bipolar integrated circuits

    NASA Technical Reports Server (NTRS)

    Zoutendyk, J. A.

    1983-01-01

    The results of work done on the quantitative characterization of single-event upset (SEU) in bipolar random-access memories (RAMs) have been obtained through computer simulation of SEU in RAM cells that contain circuit models for bipolar transistors. The models include current generators that emulate the charge collected from ion tracks. The computer simulation results are compared with test data obtained from a RAM in a bipolar microprocessor chip. This methodology is applicable to other bipolar integrated circuit constructions in addition to RAM cells.

  12. Conductus makes high-T sub c integrated circuit

    SciTech Connect

    Not Available

    1991-01-01

    This paper reports that researchers at Conductus have successfully demonstrated what the company says is the world's first integrated circuit containing active devices made from high-temperature superconductors. The circuit is a SQUID magnetometer made from seven layers of material: three layers of yttrium-barium-copper oxide, two layers of insulating material, a seed layer to create grain boundaries for the Josephson junctions, and a layer of silver for making electrical contact to the device. The chip also contains vias, or pathways that make a superconducting contact between the superconducting layers otherwise separated by insulators. Conductus had previously announced the development of a SQUID magnetometer that featured a SQUID sensor and a flux transformer manufactured on separate chips. What makes this achievement important is that the company was able to put both components on the same chip, thus creating a simple integrated circuit on a single chip. This is still a long way from conventional semiconductor technology, with as many as a million components per chip, or even the sophisticated low-Tc superconducting chips made by the Japanese, but the SQUID magnetometer demonstrates all the elements and techniques necessary to build more complex high-temperature superconductor integrated circuits, making this an important first step.

  13. Millimeter-wave and terahertz integrated circuit antennas

    NASA Technical Reports Server (NTRS)

    Rebeiz, Gabriel M.

    1992-01-01

    This paper presents a comprehensive review of integrated circuit antennas suitable for millimeter and terahertz applications. A great deal of research was done on integrated circuit antennas in the last decade and many of the problems associated with electrically thick dielectric substrates, such as substrate modes and poor radiation patterns, have been understood and solved. Several new antennas, such as the integrated horn antenna, the dielectric-filled parabola, the Fresnel plate antenna, the dual-slot antenna, and the log-periodic and spiral antennas on extended hemispherical lenses, have resulted in excellent performance at millimeter-wave frequencies, and are covered in detail in this paper. Also, a review of the efficiency definitions used with planar antennas is given in detail in the appendix.

  14. Transient 3d contact problems—NTS method: mixed methods and conserving integration

    NASA Astrophysics Data System (ADS)

    Hesch, Christian; Betsch, Peter

    2011-10-01

    The present work deals with a new formulation for transient large deformation contact problems. It is well known, that one-step implicit time integration schemes for highly non-linear systems fail to conserve the total energy of the system. To deal with this drawback, a mixed method is newly proposed in conjunction with the concept of a discrete gradient. In particular, we reformulate the well known and widely-used node-to-segment methods and establish an energy-momentum scheme. The advocated approach ensures robustness and enhanced numerical stability, demonstrated in several three-dimensional applications of the proposed algorithm.

  15. Uncertainty preserving patch-based online modeling for 3D model acquisition and integration from passive motion imagery

    NASA Astrophysics Data System (ADS)

    Tang, Hao; Chang, Peng; Molina, Edgardo; Zhu, Zhigang

    2012-06-01

    In both military and civilian applications, abundant data from diverse sources captured on airborne platforms are often available for a region attracting interest. Since the data often includes motion imagery streams collected from multiple platforms flying at different altitudes, with sensors of different field of views (FOVs), resolutions, frame rates and spectral bands, it is imperative that a cohesive site model encompassing all the information can be quickly built and presented to the analysts. In this paper, we propose to develop an Uncertainty Preserving Patch-based Online Modeling System (UPPOMS) leading towards the automatic creation and updating of a cohesive, geo-registered, uncertaintypreserving, efficient 3D site terrain model from passive imagery with varying field-of-views and phenomenologies. The proposed UPPOMS has the following technical thrusts that differentiate our approach from others: (1) An uncertaintypreserved, patch-based 3D model is generated, which enables the integration of images captured with a mixture of NFOV and WFOV and/or visible and infrared motion imagery sensors. (2) Patch-based stereo matching and multi-view 3D integration are utilized, which are suitable for scenes with many low texture regions, particularly in mid-wave infrared images. (3) In contrast to the conventional volumetric algorithms, whose computational and storage costs grow exponentially with the amount of input data and the scale of the scene, the proposed UPPOMS system employs an online algorithmic pipeline, and scales well to large amount of input data. Experimental results and discussions of future work will be provided.

  16. Integrating Sensors into a Marine Drone for Bathymetric 3D Surveys in Shallow Waters.

    PubMed

    Giordano, Francesco; Mattei, Gaia; Parente, Claudio; Peluso, Francesco; Santamaria, Raffaele

    2015-01-01

    This paper demonstrates that accurate data concerning bathymetry as well as environmental conditions in shallow waters can be acquired using sensors that are integrated into the same marine vehicle. An open prototype of an unmanned surface vessel (USV) named MicroVeGA is described. The focus is on the main instruments installed on-board: a differential Global Position System (GPS) system and single beam echo sounder; inertial platform for attitude control; ultrasound obstacle-detection system with temperature control system; emerged and submerged video acquisition system. The results of two cases study are presented, both concerning areas (Sorrento Marina Grande and Marechiaro Harbour, both in the Gulf of Naples) characterized by a coastal physiography that impedes the execution of a bathymetric survey with traditional boats. In addition, those areas are critical because of the presence of submerged archaeological remains that produce rapid changes in depth values. The experiments confirm that the integration of the sensors improves the instruments' performance and survey accuracy. PMID:26729117

  17. Integration of GIS, Geostatistics, and 3-D Technology to Assess the Spatial Distribution of Soil Moisture

    NASA Technical Reports Server (NTRS)

    Betts, M.; Tsegaye, T.; Tadesse, W.; Coleman, T. L.; Fahsi, A.

    1998-01-01

    The spatial and temporal distribution of near surface soil moisture is of fundamental importance to many physical, biological, biogeochemical, and hydrological processes. However, knowledge of these space-time dynamics and the processes which control them remains unclear. The integration of geographic information systems (GIS) and geostatistics together promise a simple mechanism to evaluate and display the spatial and temporal distribution of this vital hydrologic and physical variable. Therefore, this research demonstrates the use of geostatistics and GIS to predict and display soil moisture distribution under vegetated and non-vegetated plots. The research was conducted at the Winfred Thomas Agricultural Experiment Station (WTAES), Hazel Green, Alabama. Soil moisture measurement were done on a 10 by 10 m grid from tall fescue grass (GR), alfalfa (AA), bare rough (BR), and bare smooth (BS) plots. Results indicated that variance associated with soil moisture was higher for vegetated plots than non-vegetated plots. The presence of vegetation in general contributed to the spatial variability of soil moisture. Integration of geostatistics and GIS can improve the productivity of farm lands and the precision of farming.

  18. Integrating Sensors into a Marine Drone for Bathymetric 3D Surveys in Shallow Waters

    PubMed Central

    Giordano, Francesco; Mattei, Gaia; Parente, Claudio; Peluso, Francesco; Santamaria, Raffaele

    2015-01-01

    This paper demonstrates that accurate data concerning bathymetry as well as environmental conditions in shallow waters can be acquired using sensors that are integrated into the same marine vehicle. An open prototype of an unmanned surface vessel (USV) named MicroVeGA is described. The focus is on the main instruments installed on-board: a differential Global Position System (GPS) system and single beam echo sounder; inertial platform for attitude control; ultrasound obstacle-detection system with temperature control system; emerged and submerged video acquisition system. The results of two cases study are presented, both concerning areas (Sorrento Marina Grande and Marechiaro Harbour, both in the Gulf of Naples) characterized by a coastal physiography that impedes the execution of a bathymetric survey with traditional boats. In addition, those areas are critical because of the presence of submerged archaeological remains that produce rapid changes in depth values. The experiments confirm that the integration of the sensors improves the instruments’ performance and survey accuracy. PMID:26729117

  19. Integrated circuit electrometer and sweep circuitry for an atmospheric probe

    NASA Technical Reports Server (NTRS)

    Zimmerman, L. E.

    1971-01-01

    The design of electrometer circuitry using an integrated circuit operational amplifier with a MOSFET input is described. Input protection against static voltages is provided by a dual ultra low leakage diode or a neon lamp. Factors affecting frequency response leakage resistance, and current stability are discussed, and methods are suggested for increasing response speed and for eliminating leakage resistance and current instabilities. Based on the above, two practical circuits, one having a linear response and the other a logarithmic response, were designed and evaluated experimentally. The design of a sweep circuit to implement mobility measurements using atmospheric probes is presented. A triangular voltage waveform is generated and shaped to contain a step in voltage from zero volts in both positive and negative directions.

  20. Highly efficient full-wave electromagnetic analysis of 3-D arbitrarily shaped waveguide microwave devices using an integral equation technique

    NASA Astrophysics Data System (ADS)

    Vidal, A.; San-Blas, A. A.; Quesada-Pereira, F. D.; Pérez-Soler, J.; Gil, J.; Vicente, C.; Gimeno, B.; Boria, V. E.

    2015-07-01

    A novel technique for the full-wave analysis of 3-D complex waveguide devices is presented. This new formulation, based on the Boundary Integral-Resonant Mode Expansion (BI-RME) method, allows the rigorous full-wave electromagnetic characterization of 3-D arbitrarily shaped metallic structures making use of extremely low CPU resources (both time and memory). The unknown electric current density on the surface of the metallic elements is represented by means of Rao-Wilton-Glisson basis functions, and an algebraic procedure based on a singular value decomposition is applied to transform such functions into the classical solenoidal and nonsolenoidal basis functions needed by the original BI-RME technique. The developed tool also provides an accurate computation of the electromagnetic fields at an arbitrary observation point of the considered device, so it can be used for predicting high-power breakdown phenomena. In order to validate the accuracy and efficiency of this novel approach, several new designs of band-pass waveguides filters are presented. The obtained results (S-parameters and electromagnetic fields) are successfully compared both to experimental data and to numerical simulations provided by a commercial software based on the finite element technique. The results obtained show that the new technique is specially suitable for the efficient full-wave analysis of complex waveguide devices considering an integrated coaxial excitation, where the coaxial probes may be in contact with the metallic insets of the component.

  1. High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

    NASA Astrophysics Data System (ADS)

    Gueye, R.; Lee, S. W.; Akiyama, T.; Briand, D.; Roman, C.; Hierold, C.; de Rooij, N. F.

    2013-03-01

    A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS electronics using Through Silicon Vias (TSVs) on an SOI wafer. This SiP includes: A glass cap vacuum-sealed to the main wafer using an eutectic bonding process: a low leak rate of 2.7 10-9 mbar•l/s was obtained; Platinum-TSVs, compatible with the SWCNT growth and release process; The TSVs were developed in a "via first" process and characterized at high-temperature — up to 850 °C. An ohmic contact between the Pt-metallization and the SOI silicon device layer was obtained; The driving CMOS electronic device is assembled to the MEMS using an Au stud bump technology. Keywords: System-in-Package (SiP), vacuum packaging, eutectic bonding, "via-first" TSVs, high-temperature platinum interconnects, ohmic contacts, Au-stud bumps assembly, CMOS electronics.

  2. An integrated 3D constant offset GPR and resistivity survey on a sealed landfill — Ilhavo, NW Portugal

    NASA Astrophysics Data System (ADS)

    Hermozilha, H.; Grangeia, C.; Matias, M. Senos

    2010-01-01

    Owing to their nature landfills are challenging targets for high resolution Near Surface Geophysics. Herein it is described an integrated high resolution geophysical survey over the Ilhavo landfill sealed about a decade ago. The first aim of the survey is to investigate the time evolution of the contamination plume of the landfill since operations stopped and sealing took place. The second, and main objective, is the study of the landfill itself, that is, to carry out a high resolution 3D geophysical survey over it in order to investigate the thickness and effectiveness of the top cover, the thickness and sealing conditions of the landfill bottom and, finally, to investigate its internal structure. To fulfill these objectives an integrated 3D constant offset GPR and resistivity survey was designed. The interpretation of the geophysical data was carried out together with local borehole and hydrogeological information, so that, the ambiguity and uncertainty of the interpretation was reduced considerably and the usefulness of the methods were assessed.

  3. Classification of Informal Settlements Through the Integration of 2d and 3d Features Extracted from Uav Data

    NASA Astrophysics Data System (ADS)

    Gevaert, C. M.; Persello, C.; Sliuzas, R.; Vosselman, G.

    2016-06-01

    Unmanned Aerial Vehicles (UAVs) are capable of providing very high resolution and up-to-date information to support informal settlement upgrading projects. In order to provide accurate basemaps, urban scene understanding through the identification and classification of buildings and terrain is imperative. However, common characteristics of informal settlements such as small, irregular buildings with heterogeneous roof material and large presence of clutter challenge state-of-the-art algorithms. Especially the dense buildings and steeply sloped terrain cause difficulties in identifying elevated objects. This work investigates how 2D radiometric and textural features, 2.5D topographic features, and 3D geometric features obtained from UAV imagery can be integrated to obtain a high classification accuracy in challenging classification problems for the analysis of informal settlements. It compares the utility of pixel-based and segment-based features obtained from an orthomosaic and DSM with point-based and segment-based features extracted from the point cloud to classify an unplanned settlement in Kigali, Rwanda. Findings show that the integration of 2D and 3D features leads to higher classification accuracies.

  4. Applied Mathematics in EM Studies with Special Emphasis on an Uncertainty Quantification and 3-D Integral Equation Modelling

    NASA Astrophysics Data System (ADS)

    Pankratov, Oleg; Kuvshinov, Alexey

    2016-01-01

    second part, we summarize modern trends in the development of efficient 3-D EM forward modelling schemes with special emphasis on recent advances in the integral equation approach.

  5. Watching chips work: picosecond hot electron light emission from integrated circuits

    NASA Astrophysics Data System (ADS)

    Kash, J. A.; Tsang, J. C.

    2000-03-01

    The picosecond pulses of hot carrier luminescence that are observed from individual submicron FETs in CMOS circuits can be used to describe the internal operation of integrated circuits. To effectively use the weak emission pulses, we have developed a method called picosecond integrated circuit analysis (PICA) which simultaneously images and time resolves the emission. PICA has been used to characterize the operation of integrated circuits from simple ring oscillators to a full microprocessors. Examples of circuit characterization and fault diagnosis are presented.

  6. Integrated 3D macro-trapping and light-sheet imaging system

    NASA Astrophysics Data System (ADS)

    Yang, Zhengyi; Piksarv, Peeter; Ferrier, David E. K.; Gunn-Moore, Frank J.; Dholakia, Kishan

    2015-08-01

    Biological research requires high-speed and low-damage imaging techniques for live specimens in areas such as development study in embryos. Light sheet microscopy provides fast imaging speed whilst keeps the photo-damage and photo-blenching to minimum. Conventional sample embedding methods in light sheet imaging involves using agent such as agarose which potentially affects the behavior and the develop pattern of the specimens. Here we demonstrate integrating dual-beam trapping method into light sheet imaging system to confine and translate the specimen whilst light sheet images are taken. Tobacco plant cells as well as Spirobranchus lamarcki larva were trapped solely with optical force and sectional images were acquired. This now approach has the potential to extend the applications of light sheet imaging significantly.

  7. Mobile glasses-free 3D using compact waveguide hologram

    NASA Astrophysics Data System (ADS)

    Pyun, K.; Choi, C.; Morozov, A.; Putilin, A.; Bovsunovskiy, I.; Kim, S.; Ahn, J.; Lee, H.-S.; Lee, S.

    2013-02-01

    The exploding mobile communication devices make 3D data available anywhere anytime. However, to record and reconstruct 3D, the huge number of optical components is often required, which makes overall device size bulky and image quality degraded due to the error-prone tuning. In addition, if additional glass is required, then user experience of 3D is exhausting and unpleasant. Holography is the ultimate 3D that users experience natural 3D in every direction. For mobile glasses-free 3D experience, it is critical to make holography device that can be as compact and integrated as possible. For reliable and economical mass production, integrated optics is needed as integrated circuits in semiconductor industry. Thus, we propose mobile glasses-free 3D using compact waveguide hologram in terms of overall device sizes, quantity of elements and combined functionality of each element. The main advantages of proposed solution are as follows: First, this solution utilizes various integral optical elements, where each of them is a united not adjustable optical element, replacing separate and adjustable optical elements with various forms and configurations. Second, geometrical form of integral elements provides small sizes of whole device. Third, geometrical form of integral elements allows creating flat device. And finally, absence of adjustable elements provide rigidly of whole device. The usage of integrated optical means based on waveguide holographic elements allows creating a new type of compact and high functional devices for mobile glasses-free 3D applications such as mobile medical 3D data visualization.

  8. Attachment method for stacked integrated circuit (IC) chips

    DOEpatents

    Bernhardt, Anthony F.; Malba, Vincent

    1999-01-01

    An attachment method for stacked integrated circuit (IC) chips. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM.

  9. Attachment method for stacked integrated circuit (IC) chips

    DOEpatents

    Bernhardt, A.F.; Malba, V.

    1999-08-03

    An attachment method for stacked integrated circuit (IC) chips is disclosed. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM. 12 figs.

  10. Organic printed photonics: From microring lasers to integrated circuits.

    PubMed

    Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

    2015-09-01

    A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 10(5), which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices. PMID:26601256

  11. Organic printed photonics: From microring lasers to integrated circuits

    PubMed Central

    Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

    2015-01-01

    A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 105, which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices. PMID:26601256

  12. Functional morphology and integration of corvid skulls – a 3D geometric morphometric approach

    PubMed Central

    Kulemeyer, Christoph; Asbahr, Kolja; Gunz, Philipp; Frahnert, Sylke; Bairlein, Franz

    2009-01-01

    Background Sympatric corvid species have evolved differences in nesting, habitat choice, diet and foraging. Differences in the frequency with which corvid species use their repertoire of feeding techniques is expected to covary with bill-shape and with the frontal binocular field. Species that frequently probe are expected to have a relatively longer bill and more sidewise oriented orbits in contrast to species that frequently peck. We tested this prediction by analyzing computed tomography scans of skulls of six corvid species by means of three-dimensional geometric morphometrics. We (1) explored patterns of major variation using principal component analysis, (2) compared within and between species relationships of size and shape and (3) quantitatively compared patterns of morphological integration between bill and cranium by means of partial least squares (singular warp) analysis. Results Major shape variation occurs at the bill, in the orientation of orbits, in the position of the foramen magnum and in the angle between bill and cranium. The first principal component correlated positively with centroid-size, but within-species allometric relationships differed markedly. Major covariation between the bill and cranium lies in the difference in orbit orientation relative to bill-length and in the angle between bill and cranium. Conclusion Corvid species show pronounced differences in skull shape, which covary with foraging mode. Increasing bill-length, bill-curvature and sidewise orientation of the eyes is associated with an increase in the observed frequency in probing (vice versa in pecking). Hence, the frequency of probing, bill-length, bill-curvature and sidewise orientation of the eyes is progressively increased from jackdaw, to Eurasian jay, to black-billed magpie, to hooded crow, to rook and to common raven (when feeding on carcasses is considered as probing). Our results on the morphological integration suggest that most of the covariation between bill and

  13. Low voltage pentacene OTFT integration for smart sensor control circuits

    NASA Astrophysics Data System (ADS)

    Kumar, Prashanth S.; Rai, Pratyush; Mathur, Gyanesh N.; Varadan, Vijay K.

    2010-04-01

    The past decade has witnessed remarkable progress in Organic electronics and Organic sensor technology on flexible substrates. Temperature and strain sensors for wireless active health monitoring systems have been tested and demonstrated. These sensors need control circuits to condition and transmit the measurand to the data acquisition system. The control circuits have to be incorporated on to the same substrate as the sensing element. So far, Pentacene based Organic Thin-Film Transistors (OTFTs) have been the most promising candidates for integrated circuit applications. To this end, optimization of the OTFT fabrication process is needed to obtain reliable and reproducible transistor performance in terms of mobility, threshold voltage, drive currents, minimal supply voltage and minimal leakage currents. The objective here is to minimize the leakage losses and the voltage required to drive this circuitry while maintaining process compatibility. The choice of dielectric material has been proven to be a key factor influencing all the desirable characteristics stated above. This paper investigates the feasibility of using a High K/Low K, Tantalum Pentoxide/Poly (4-vinyl phenol) (PVP) hybrid dielectric in Pentacene-based OTFTs to lower the operating voltages. Inverters and simple logic gates like 2-input NAND are simulated with these OTFTs. The results indicate that these OTFTs can indeed be used to build large scale integrated circuits with reproducibility.

  14. IRIS Earthquake Browser with Integration to the GEON IDV for 3-D Visualization of Hypocenters.

    NASA Astrophysics Data System (ADS)

    Weertman, B. R.

    2007-12-01

    We present a new generation of web based earthquake query tool - the IRIS Earthquake Browser (IEB). The IEB combines the DMC's large set of earthquake catalogs (provided by USGS/NEIC, ISC and the ANF) with the popular Google Maps web interface. With the IEB you can quickly and easily find earthquakes in any region of the globe. Using Google's detailed satellite images, earthquakes can be easily co-located with natural geographic features such as volcanoes as well as man made features such as commercial mines. A set of controls allow earthquakes to be filtered by time, magnitude, and depth range as well as catalog name, contributor name and magnitude type. Displayed events can be easily exported in NetCDF format into the GEON Integrated Data Viewer (IDV) where hypocenters may be visualized in three dimensions. Looking "under the hood", the IEB is based on AJAX technology and utilizes REST style web services hosted at the IRIS DMC. The IEB is part of a broader effort at the DMC aimed at making our data holdings available via web services. The IEB is useful both educationally and as a research tool.

  15. Numerical Modeling of 3-D Dynamics of Ultrasound Contrast Agent Microbubbles Using the Boundary Integral Method

    NASA Astrophysics Data System (ADS)

    Calvisi, Michael; Manmi, Kawa; Wang, Qianxi

    2014-11-01

    Ultrasound contrast agents (UCAs) are microbubbles stabilized with a shell typically of lipid, polymer, or protein and are emerging as a unique tool for noninvasive therapies ranging from gene delivery to tumor ablation. The nonspherical dynamics of contrast agents are thought to play an important role in both diagnostic and therapeutic applications, for example, causing the emission of subharmonic frequency components and enhancing the uptake of therapeutic agents across cell membranes and tissue interfaces. A three-dimensional model for nonspherical contrast agent dynamics based on the boundary integral method is presented. The effects of the encapsulating shell are approximated by adapting Hoff's model for thin-shell, spherical contrast agents to the nonspherical case. A high-quality mesh of the bubble surface is maintained by implementing a hybrid approach of the Lagrangian method and elastic mesh technique. Numerical analyses for the dynamics of UCAs in an infinite liquid and near a rigid wall are performed in parameter regimes of clinical relevance. The results show that the presence of a coating significantly reduces the oscillation amplitude and period, increases the ultrasound pressure amplitude required to incite jetting, and reduces the jet width and velocity.

  16. Effect of Weaving Direction of Conductive Yarns on Electromagnetic Performance of 3D Integrated Microstrip Antenna

    NASA Astrophysics Data System (ADS)

    Xu, Fujun; Yao, Lan; Zhao, Da; Jiang, Muwen; Qiu, Yipping

    2013-10-01

    A three-dimensionally integrated microstrip antenna (3DIMA) is a microstrip antenna woven into the three-dimensional woven composite for load bearing while functioning as an antenna. In this study, the effect of weaving direction of conductive yarns on electromagnetic performance of 3DIMAs are investigated by designing, simulating and experimental testing of two microstrip antennas with different weaving directions of conductive yarns: one has the conductive yarns along the antenna feeding direction (3DIMA-Exp1) and the other has the conductive yarns perpendicular the antenna feeding direction (3DIMA-Exp2). The measured voltage standing wave ratio (VSWR) of 3DIMA-Exp1 was 1.4 at the resonant frequencies of 1.39 GHz; while that of 3DIMA-Exp2 was 1.2 at the resonant frequencies of 1.35 GHz. In addition, the measured radiation pattern of the 3DIMA-Exp1 has smaller back lobe and higher gain value than those of the 3DIMA-Exp2. This result indicates that the waving direction of conductive yarns may have a significant impact on electromagnetic performance of textile structural antennas.

  17. 3D transient eddy current fields using the u-v integral-eigenvalue formulation

    NASA Astrophysics Data System (ADS)

    Davey, Kent R.; Han, Hsiu Chi; Turner, Larry

    1988-02-01

    The three-dimensional eddy current transient field problem is formulated using the u-v method. This method breaks the vector Helmholtz equation into two scalar Helmholtz equations. Null field integral equations and the appropriate boundary conditions are used to set up an identification matrix which is independent of null field point locations. Embedded in the identification matrix are the unknown eigenvalues of the problem representing its impulse response in time. These eigenvalues are found by equating the determinant of the identification matrix to zero. When the initial transient forcing function is Fourier decomposed into its spatial harmonics, each Fourier component can be associated with a unique eigenvalue by this technique. The true transient solution comes through a convolution of the impulse response, so obtained with the particular external field decay governing the problem at hand. The technique is applied to the FELIX (fusion electromagnetic induction experiments) medium cylinder experiment; computed results are compared with data. A pseudoanalytic confirmation of the eigenvalues so obtained is formulated to validate the procedure.

  18. 3D transient eddy current fields using the u-v integral-eigenvalue formulation

    SciTech Connect

    Davey, K.R.; Han, H.C.; Turner, L.

    1988-02-15

    The three-dimensional eddy current transient field problem is formulated using the u-v method. This method breaks the vector Helmholtz equation into two scalar Helmholtz equations. Null field integral equations and the appropriate boundary conditions are used to set up an identification matrix which is independent of null field point locations. Embedded in the identification matrix are the unknown eigenvalues of the problem representing its impulse response in time. These eigenvalues are found by equating the determinant of the identification matrix to zero. When the initial transient forcing function is Fourier decomposed into its spatial harmonics, each Fourier component can be associated with a unique eigenvalue by this technique. The true transient solution comes through a convolution of the impulse response, so obtained with the particular external field decay governing the problem at hand. The technique is applied to the FELIX (fusion electromagnetic induction experiments) medium cylinder experiment; computed results are compared with data. A pseudoanalytic confirmation of the eigenvalues so obtained is formulated to validate the procedure.

  19. RELAP5-3D Transient Modelling for NGNP Integrated Plant

    SciTech Connect

    Sabharwall, P.; Anderson, N. A.

    2014-06-01

    The High-Temperature Gas-cooled Reactor (HTGR) is designed with outlet temperatures ranging between 750°C and 800°C. These high outlet temperatures enhance the power production efficiency and facilitate a variety of industrial applications. The objective of this study is to understand the response of the primary system to potential transients in the secondary system. For this analysis, the transient condition originates in the Intermediate Heat Exchanger (IHX) or Steam Generator (SG) of the HTGR-integrated plant. The transients analysed are: a loss of pressure; loss of feedwater flow; inadvertent closure of main steam valve; decrease in returning gas temperature and heat load step change. The results show a large dependence on the negative reactivity added to the fuel as a function of increased temperature. The returning gas temperature decrease transient resulted in the highest fuel temperature (1361°C). Fuel temperature was shown to be less than the 1600°C fuel limit for each case analysed.

  20. How integrating 3D LiDAR data in the dike surveillance protocol: The French case

    NASA Astrophysics Data System (ADS)

    Bretar, F.; Mériaux, P.; Fauchard, C.

    2012-04-01

    carried out. A LiDAR system is able to acquire data on a dike structure of up to 80 km per day, which makes the use of this technique also valuable in case of emergency situations. It provides additional valuable products like precious information on dike slopes and crest or their near environment (river banks, etc.). Moreover, in case of vegetation, LiDAR data makes possible to study hidden structures or defaults from images like the erosion of riverbanks under forestry vegetation. The possibility of studying the vegetation is also of high importance: the development of woody vegetation near or onto the dike is a major risk factor. Surface singularities are often signs of disorder or suspected disorder in the dike itself: for example a subsidence or a sinkhole on a ridge may result from internal erosion collapse. Finally, high resolution topographic data contribute to build specific geomechanical model of the dike that, after incorporating data provided by geophysical and geotechnical surveys, are integrated in the calculations of the structure stability. Integrating the regular use of LiDAR data in the dike surveillance protocol is not yet operational in France. However, the high number of French stakeholders at the national level (on average, there is one stakeholder for only 8-9km of dike !) and the real added value of LiDAR data makes a spatial data infrastructure valuable (webservices for processing the data, consulting and filling the database on the field when performing the local diagnosis)

  1. Modeling and extraction of interconnect parameters in very-large-scale integrated circuits

    NASA Astrophysics Data System (ADS)

    Yuan, C. P.

    1983-08-01

    The increased complexity of the very large scale integrated circuits (VLSI) has greatly impacted the field of computer-aided design (CAD). One of the problems brought about is the interconnection problem. In this research, the goal is two fold. First of all, a more accurate numerical method to evaluate the interconnect capacitance, including the coupling capacitance between interconnects and the fringing field capacitance, was investigated, and the integral method was employed. Two FORTRAN programs "CAP2D' and "CAP3D' based on this method were developed. Second, a PASCAL extraction program emphasizing the extraction of interconnect parameters was developed. It employs the cylindrical approximation formula for the self-capacitance of a single interconnect and other simple formulas for the coupling capacitances derived by a least square method. The extractor assumes only Manhattan geometry and NMOS technology. Four-dimensional binary search trees are used as the basic data structure.

  2. Millimeter-wave and optoelectronic applications of heterostructure integrated circuits

    NASA Technical Reports Server (NTRS)

    Pavlidis, Dimitris

    1991-01-01

    The properties are reviewed of heterostructure devices for microwave-monolithic-integrated circuits (MMICs) and optoelectronic integrated circuits (OICs). Specific devices examined include lattice-matched and pseudomorphic InAlAs/InGaAs high-electron mobility transistors (HEMTs), mixer/multiplier diodes, and heterojunction bipolar transistors (HBTs) developed with a number of materials. MMICs are reviewed that can be employed for amplification, mixing, and signal generation, and receiver/transmitter applications are set forth for OICs based on GaAs and InP heterostructure designs. HEMTs, HBTs, and junction-FETs can be utilized in combination with PIN, MSM, and laser diodes to develop novel communication systems based on technologies that combine microwave and photonic capabilities.

  3. Gigahertz flexible graphene transistors for microwave integrated circuits.

    PubMed

    Yeh, Chao-Hui; Lain, Yi-Wei; Chiu, Yu-Chiao; Liao, Chen-Hung; Moyano, David Ricardo; Hsu, Shawn S H; Chiu, Po-Wen

    2014-08-26

    Flexible integrated circuits with complex functionalities are the missing link for the active development of wearable electronic devices. Here, we report a scalable approach to fabricate self-aligned graphene microwave transistors for the implementation of flexible low-noise amplifiers and frequency mixers, two fundamental building blocks of a wireless communication receiver. A devised AlOx T-gate structure is used to achieve an appreciable increase of device transconductance and a commensurate reduction of the associated parasitic resistance, thus yielding a remarkable extrinsic cutoff frequency of 32 GHz and a maximum oscillation frequency of 20 GHz; in both cases the operation frequency is an order of magnitude higher than previously reported. The two frequencies work at 22 and 13 GHz even when subjected to a strain of 2.5%. The gigahertz microwave integrated circuits demonstrated here pave the way for applications which require high flexibility and radio frequency operations. PMID:25062282

  4. Radiation Testing and Evaluation Issues for Modern Integrated Circuits

    NASA Technical Reports Server (NTRS)

    LaBel, Kenneth A.; Cohn, Lew M.

    2005-01-01

    Abstract. Changes in modern integrated circuit (IC) technologies have modified the way we approach and conduct radiation tolerance and testing of electronics. These changes include scaling of geometries, new materials, new packaging technologies, and overall speed and device complexity challenges. In this short course section, we will identify and discuss these issues as they impact radiation testing, modeling, and effects mitigation of modern integrated circuits. The focus will be on CMOS-based technologies, however, other high performance technologies will be discussed where appropriate. The effects of concern will be: Single-Event Effects (SEE) and steady state total ionizing dose (TID) IC response. However, due to the growing use of opto-electronics in space systems issues concerning displacement damage testing will also be considered. This short course section is not intended to provide detailed "how-to-test" information, but simply provide a snapshot of current challenges and some of the approaches being considered.

  5. Monolithic Microwave Integrated Circuit (MMIC) technology for space communications applications

    NASA Technical Reports Server (NTRS)

    Connolly, Denis J.; Bhasin, Kul B.; Romanofsky, Robert R.

    1987-01-01

    Future communications satellites are likely to use gallium arsenide (GaAs) monolithic microwave integrated-circuit (MMIC) technology in most, if not all, communications payload subsystems. Multiple-scanning-beam antenna systems are expected to use GaAs MMIC's to increase functional capability, to reduce volume, weight, and cost, and to greatly improve system reliability. RF and IF matrix switch technology based on GaAs MMIC's is also being developed for these reasons. MMIC technology, including gigabit-rate GaAs digital integrated circuits, offers substantial advantages in power consumption and weight over silicon technologies for high-throughput, on-board baseband processor systems. For the more distant future pseudomorphic indium gallium arsenide (InGaAs) and other advanced III-V materials offer the possibility of MMIC subsystems well up into the millimeter wavelength region. All of these technology elements are in NASA's MMIC program. Their status is reviewed.

  6. Monolithic Microwave Integrated Circuit (MMIC) technology for space communications applications

    NASA Technical Reports Server (NTRS)

    Connolly, Denis J.; Bhasin, Kul B.; Romanofsky, Robert R.

    1987-01-01

    Future communications satellites are likely to use gallium arsenide (GaAs) monolithic microwave integrated-circuit (MMIC) technology in most, if not all, communications payload subsystems. Multiple-scanning-beam antenna systems are expected to use GaAs MMICs to increase functional capability, to reduce volume, weight, and cost, and to greatly improve system reliability. RF and IF matrix switch technology based on GaAs MMICs is also being developed for these reasons. MMIC technology, including gigabit-rate GaAs digital integrated circuits, offers substantial advantages in power consumption and weight over silicon technologies for high-throughput, on-board baseband processor systems. For the more distant future pseudomorphic indium gallium arsenide (InGaAs) and other advanced III-V materials offer the possibility of MMIC subsystems well up into the millimeter wavelength region. All of these technology elements are in NASA's MMIC program. Their status is reviewed.

  7. Total Dose Effects on Bipolar Integrated Circuits at Low Temperature

    NASA Technical Reports Server (NTRS)

    Johnston, A. H.; Swimm, R. T.; Thorbourn, D. O.

    2012-01-01

    Total dose damage in bipolar integrated circuits is investigated at low temperature, along with the temperature dependence of the electrical parameters of internal transistors. Bandgap narrowing causes the gain of npn transistors to decrease far more at low temperature compared to pnp transistors, due to the large difference in emitter doping concentration. When irradiations are done at temperatures of -140 deg C, no damage occurs until devices are warmed to temperatures above -50 deg C. After warm-up, subsequent cooling shows that damage is then present at low temperature. This can be explained by the very strong temperature dependence of dispersive transport in the continuous-time-random-walk model for hole transport. For linear integrated circuits, low temperature operation is affected by the strong temperature dependence of npn transistors along with the higher sensitivity of lateral and substrate pnp transistors to radiation damage.

  8. Progress on a New Integrated 3-D UCG Simulator and its Initial Application

    SciTech Connect

    Nitao, J J; Camp, D W; Buscheck, T A; White, J A; Burton, G C; Wagoner, J L; Chen, M

    2011-09-22

    A comprehensive simulator is being developed for underground coal gasification (UCG), with the capability to support site selection, design, hazard analyses, operations, and monitoring (Nitao et al., 2010). UCG is computationally challenging because it involves tightly-coupled multi-physical/chemical processes, with vastly different timescales. This new capability will predict cavity growth, product gas composition and rate, and the interaction with the host environment, accounting for site characteristics, injection gas composition and rate, and associated water-well extraction rates. Progress on the new simulator includes completion and system integration of a wall model, a rock spalling model, a cavity boundary tracking model, a one-dimensional cavity gas reactive transport model, a rudimentary rubble heat, mass, and reaction model, and coupling with a pre-existing hydrology simulator. An existing geomechanical simulator was enhanced to model cavity collapse and overburden subsidence. A commercial computational fluid dynamics (CFD) code is being evaluated to model cavity gas flow and combustion in two and three dimensions. Although the simulator is midway in its development, it was applied to modeling the Hoe Creek III field test (Stephens, 1981) conducted in the 1970s, in order to evaluate and demonstrate the simulator's basic capabilities, gain experience, and guide future development. Furthermore, it is consistent with our philosophy of incremental, spiral software development, which helps in identifying and resolving potential problems early in the process. The simulation accounts for two coal seams, two injection points, and air and oxygen phases. Approximate extent and shape of cavity growth showed reasonable agreement with interpreted field data. Product gas composition and carbon consumed could not be simultaneously matched for a given set of parameter values due to the rudimentary rubble model currently used, although they can be matched using separate

  9. Impact of integrated 3D reservoir modeling/flow simulation on development of deepwater sands, Mars Field, Gulf of Mexico

    SciTech Connect

    Lerch, C.S.; Johnston, J.R.; Juedeman, M.E.

    1996-12-31

    Prospect Mars is a major Gulf of Mexico deep water oil discovery made under joint partnership between operator Shell Offshore Inc. and partner British Petroleum Inc. The discovery lies in 3000 feet of water, located 130 miles southeast of New Orleans, Louisiana. The field was discovered in 1989 and to date 14 significant reservoir intervals from 10,000 to 19000 feet below sea level have been penetrated. Estimated recoverable reserves for the first phase of field development are in excess of 500 MMBE and development plans include installation of a 24 slot tension leg platform and two subsea wells, with first production in mid-1996. Over a two year period a comprehensive effort was directed at creating a new set of reservoir models utilizing an integrated software package developed at Shell E&P Technology Co. This package is able to incorporate pertinent geological, geophysical, and petrophysical data into 3-D reservoir models which can be used to: (1) estimate reservoir quantity, quality, and continuity, (2) predict reservoir production performance, (3) select development well locations, and (4) facilitate reserve estimation. This software allows interpretations from 3-D seismic, well control, and analog outcrops to be effectively integrated and passed to the reservoir model for flow simulation. This integrated effort at modeling ensured a more realistic reservoir picture upon which to base field development. Almost all the development wells pre-drilled prior to platform installation have been affected or designed based on these reservoir models and well results have been used to keep the models updated and evergreen.

  10. Impact of integrated 3D reservoir modeling/flow simulation on development of deepwater sands, Mars Field, Gulf of Mexico

    SciTech Connect

    Lerch, C.S.; Johnston, J.R.; Juedeman, M.E. )

    1996-01-01

    Prospect Mars is a major Gulf of Mexico deep water oil discovery made under joint partnership between operator Shell Offshore Inc. and partner British Petroleum Inc. The discovery lies in 3000 feet of water, located 130 miles southeast of New Orleans, Louisiana. The field was discovered in 1989 and to date 14 significant reservoir intervals from 10,000 to 19000 feet below sea level have been penetrated. Estimated recoverable reserves for the first phase of field development are in excess of 500 MMBE and development plans include installation of a 24 slot tension leg platform and two subsea wells, with first production in mid-1996. Over a two year period a comprehensive effort was directed at creating a new set of reservoir models utilizing an integrated software package developed at Shell E P Technology Co. This package is able to incorporate pertinent geological, geophysical, and petrophysical data into 3-D reservoir models which can be used to: (1) estimate reservoir quantity, quality, and continuity, (2) predict reservoir production performance, (3) select development well locations, and (4) facilitate reserve estimation. This software allows interpretations from 3-D seismic, well control, and analog outcrops to be effectively integrated and passed to the reservoir model for flow simulation. This integrated effort at modeling ensured a more realistic reservoir picture upon which to base field development. Almost all the development wells pre-drilled prior to platform installation have been affected or designed based on these reservoir models and well results have been used to keep the models updated and evergreen.

  11. Extended life testing evaluation of complementary MOS integrated circuits

    NASA Technical Reports Server (NTRS)

    Brosnan, T. E.

    1972-01-01

    The purpose of the extended life testing evaluation of complementary MOS integrated circuits was twofold: (1) To ascertain the long life capability of complementary MOS devices. (2) To assess the objectivity and reliability of various accelerated life test methods as an indication or prediction tool. In addition, the determination of a suitable life test sequence for these devices was of importance. Conclusions reached based on the parts tested and the test results obtained was that the devices were not acceptable.

  12. Aperture efficiency of integrated-circuit horn antennas

    NASA Technical Reports Server (NTRS)

    Guo, Yong; Lee, Karen; Stimson, Philip; Potter, Kent; Rutledge, David

    1991-01-01

    The aperture efficiency of silicon integrated-circuit horn antennas has been improved by optimizing the length of the dipole probes and by coating the entire horn walls with gold. To make these measurements, a new thin-film power-density meter was developed for measuring power density with accuracies better than 5 percent. The measured aperture efficiency improved from 44 percent to 72 percent at 93 GHz. This is sufficient for use in many applications which now use machined waveguide horns.

  13. Monolithic microwave integrated circuit technology for advanced space communication

    NASA Technical Reports Server (NTRS)

    Ponchak, George E.; Romanofsky, Robert R.

    1988-01-01

    Future Space Communications subsystems will utilize GaAs Monolithic Microwave Integrated Circuits (MMIC's) to reduce volume, weight, and cost and to enhance system reliability. Recent advances in GaAs MMIC technology have led to high-performance devices which show promise for insertion into these next generation systems. The status and development of a number of these devices operating from Ku through Ka band will be discussed along with anticipated potential applications.

  14. Optical Packet & Circuit Integrated Network for Future Networks

    NASA Astrophysics Data System (ADS)

    Harai, Hiroaki

    This paper presents recent progress made in the development of an optical packet and circuit integrated network. From the viewpoint of end users, this is a single network that provides both high-speed, inexpensive services and deterministic-delay, low-data-loss services according to the users' usage scenario. From the viewpoint of network service providers, this network provides large switching capacity with low energy requirements, high flexibility, and efficient resource utilization with a simple control mechanism. The network we describe here will contribute to diversification of services, enhanced functional flexibility, and efficient energy consumption, which are included in the twelve design goals of Future Networks announced by ITU-T (International Telecommunication Union - Telecommunication Standardization Sector). We examine the waveband-based network architecture of the optical packet and circuit integrated network. Use of multi-wavelength optical packet increases the switch throughput while minimizing energy consumption. A rank accounting method provides a solution to the problem of inter-domain signaling for end-to-end lightpath establishment. Moving boundary control for packet and circuit services makes for efficient resource utilization. We also describe related advanced technologies such as waveband switching, elastic lightpaths, automatic locator numbering assignment, and biologically-inspired control of optical integrated network.

  15. Methodology for thermal budget reduction of SPER down to 450 °C for 3D sequential integration

    NASA Astrophysics Data System (ADS)

    Luce, F. P.; Pasini, L.; Sklénard, B.; Mathieu, B.; Licitra, C.; Batude, P.; Mazen, F.

    2016-03-01

    3D sequential integration enables the full use of the third dimension thanks to its unique contact density far above the possibilities of 3D packaging solutions. However, as the transistors are sequentially stacked over each other, the thermal budget allowed for the fabrication of the top transistor is limited by the maximal temperature accepted by the already made bottom one. It was previously described that a thermal budget of T > 500 °C is enough to degrade the bottom transistors performance. So the technological challenge is to develop low temperature routines for the fabrication of the top devices. For that, different processes have to be adapted, mainly the dopant activation step, where the T > 1000 °C spike annealing must be replaced. In this contribution, we present the feasibility to dope by solid phase epitaxial regrowth (SPER) at 450 °C thin Si films (22 nm) containing high dopant concentration of 5 × 1020 at/cm3. For n- and p-type dopants, the 450 °C SPER rendered low sheet resistance values, as low as the ones obtained with the high temperature activation method.

  16. Integration of a 3D hydrogel matrix within a hollow core photonic crystal fibre for DNA probe immobilization

    NASA Astrophysics Data System (ADS)

    Rutowska, Monika S.; Garcia Gunning, Fatima C.; Kivlehan, Francine; Moore, Eric; Brennan, Des; Galvin, Paul; Ellis, Andrew D.

    2010-09-01

    In this paper, we demonstrate the integration of a 3D hydrogel matrix within a hollow core photonic crystal fibre (HC-PCF). In addition, we also show the fluorescence of Cy5-labelled DNA molecules immobilized within the hydrogel formed in two different types of HC-PCF. The 3D hydrogel matrix is designed to bind with the amino groups of biomolecules using an appropriate cross-linker, providing higher sensitivity and selectivity than the standard 2D coverage, enabling a greater number of probe molecules to be available per unit area. The HC-PCFs, on the other hand, can be designed to maximize the capture of fluorescence to improve sensitivity and provide longer interaction lengths. This could enable the development of fibre-based point-of-care and remote systems, where the enhanced sensitivity would relax the constraints placed on sources and detectors. In this paper, we will discuss the formation of such polyethylene glycol diacrylate (PEGDA) hydrogels within a HC-PCF, including their optical properties such as light propagation and auto-fluorescence.

  17. An integrated statistical model for enhanced murine cardiomyocyte differentiation via optimized engagement of 3D extracellular matrices

    PubMed Central

    Jung, Jangwook P.; Hu, Dongjian; Domian, Ibrahim J.; Ogle, Brenda M.

    2015-01-01

    The extracellular matrix (ECM) impacts stem cell differentiation, but identifying formulations supportive of differentiation is challenging in 3D models. Prior efforts involving combinatorial ECM arrays seemed intuitively advantageous. We propose an alternative that suggests reducing sample size and technological burden can be beneficial and accessible when coupled to design of experiments approaches. We predict optimized ECM formulations could augment differentiation of cardiomyocytes derived in vitro. We employed native chemical ligation to polymerize 3D poly (ethylene glycol) hydrogels under mild conditions while entrapping various combinations of ECM and murine induced pluripotent stem cells. Systematic optimization for cardiomyocyte differentiation yielded a predicted solution of 61%, 24%, and 15% of collagen type I, laminin-111, and fibronectin, respectively. This solution was confirmed by increased numbers of cardiac troponin T, α-myosin heavy chain and α-sarcomeric actinin-expressing cells relative to suboptimum solutions. Cardiomyocytes of composites exhibited connexin43 expression, appropriate contractile kinetics and intracellular calcium handling. Further, adding a modulator of adhesion, thrombospondin-1, abrogated cardiomyocyte differentiation. Thus, the integrated biomaterial platform statistically identified an ECM formulation best supportive of cardiomyocyte differentiation. In future, this formulation could be coupled with biochemical stimulation to improve functional maturation of cardiomyocytes derived in vitro or transplanted in vivo. PMID:26687770

  18. An integrated statistical model for enhanced murine cardiomyocyte differentiation via optimized engagement of 3D extracellular matrices.

    PubMed

    Jung, Jangwook P; Hu, Dongjian; Domian, Ibrahim J; Ogle, Brenda M

    2015-01-01

    The extracellular matrix (ECM) impacts stem cell differentiation, but identifying formulations supportive of differentiation is challenging in 3D models. Prior efforts involving combinatorial ECM arrays seemed intuitively advantageous. We propose an alternative that suggests reducing sample size and technological burden can be beneficial and accessible when coupled to design of experiments approaches. We predict optimized ECM formulations could augment differentiation of cardiomyocytes derived in vitro. We employed native chemical ligation to polymerize 3D poly (ethylene glycol) hydrogels under mild conditions while entrapping various combinations of ECM and murine induced pluripotent stem cells. Systematic optimization for cardiomyocyte differentiation yielded a predicted solution of 61%, 24%, and 15% of collagen type I, laminin-111, and fibronectin, respectively. This solution was confirmed by increased numbers of cardiac troponin T, α-myosin heavy chain and α-sarcomeric actinin-expressing cells relative to suboptimum solutions. Cardiomyocytes of composites exhibited connexin43 expression, appropriate contractile kinetics and intracellular calcium handling. Further, adding a modulator of adhesion, thrombospondin-1, abrogated cardiomyocyte differentiation. Thus, the integrated biomaterial platform statistically identified an ECM formulation best supportive of cardiomyocyte differentiation. In future, this formulation could be coupled with biochemical stimulation to improve functional maturation of cardiomyocytes derived in vitro or transplanted in vivo. PMID:26687770

  19. A Integrated Circuit for a Biomedical Capacitive Pressure Transducer

    NASA Astrophysics Data System (ADS)

    Smith, Michael John Sebastian

    Medical research has an urgent need for a small, accurate, stable, low-power, biocompatible and inexpensive pressure sensor with a zero to full-scale range of 0-300 mmHg. An integrated circuit (IC) for use with a capacitive pressure transducer was designed, built and tested. The random pressure measurement error due to resolution and non-linearity is (+OR-)0.4 mmHg (at mid-range with a full -scale of 300 mmHg). The long-term systematic error due to falling battery voltage is (+OR-)0.6 mmHg. These figures were calculated from measurements of temperature, supply dependence and non-linearity on completed integrated circuits. The sensor IC allows measurement of temperature to (+OR-)0.1(DEGREES)C to allow for temperature compensation of the transducer. Novel micropower circuit design of the system components enabled these levels of accuracy to be reached. Capacitance is measured by a new ratiometric scheme employing an on -chip reference capacitor. This method greatly reduces the effects of voltage supply, temperature and manufacturing variations on the sensor circuit performance. The limits on performance of the bandgap reference circuit fabricated with a standard bipolar process using ion-implanted resistors were determined. Measurements confirm the limits of temperature stability as approximately (+OR-)300 ppm/(DEGREES)C. An exact analytical expression for the period of the Schmitt trigger oscillator, accounting for non-constant capacitor charging current, was formulated. Experiments to test agreement with theory showed that prediction of the oscillator period was very accurate. The interaction of fundamental and practical limits on the scaling of the transducer size was investigated including a correction to previous theoretical analysis of jitter in an RC oscillator. An areal reduction of 4 times should be achievable.

  20. Neuromorphic opto-electronic integrated circuits for optical signal processing

    NASA Astrophysics Data System (ADS)

    Romeira, B.; Javaloyes, J.; Balle, S.; Piro, O.; Avó, R.; Figueiredo, J. M. L.

    2014-08-01

    The ability to produce narrow optical pulses has been extensively investigated in laser systems with promising applications in photonics such as clock recovery, pulse reshaping, and recently in photonics artificial neural networks using spiking signal processing. Here, we investigate a neuromorphic opto-electronic integrated circuit (NOEIC) comprising a semiconductor laser driven by a resonant tunneling diode (RTD) photo-detector operating at telecommunication (1550 nm) wavelengths capable of excitable spiking signal generation in response to optical and electrical control signals. The RTD-NOEIC mimics biologically inspired neuronal phenomena and possesses high-speed response and potential for monolithic integration for optical signal processing applications.

  1. Diamond electro-optomechanical resonators integrated in nanophotonic circuits

    SciTech Connect

    Rath, P.; Ummethala, S.; Pernice, W. H. P.; Diewald, S.; Lewes-Malandrakis, G.; Brink, D.; Heidrich, N.; Nebel, C.

    2014-12-22

    Diamond integrated photonic devices are promising candidates for emerging applications in nanophotonics and quantum optics. Here, we demonstrate active modulation of diamond nanophotonic circuits by exploiting mechanical degrees of freedom in free-standing diamond electro-optomechanical resonators. We obtain high quality factors up to 9600, allowing us to read out the driven nanomechanical response with integrated optical interferometers with high sensitivity. We are able to excite higher order mechanical modes up to 115 MHz and observe the nanomechanical response also under ambient conditions.

  2. 3D microfluidic chips with integrated functional microelements fabricated by a femtosecond laser for studying the gliding mechanism of cyanobacteria.

    PubMed

    Hanada, Yasutaka; Sugioka, Koji; Shihira-Ishikawa, Ikuko; Kawano, Hiroyuki; Miyawaki, Atsushi; Midorikawa, Katsumi

    2011-06-21

    Phormidium, a genus of filamentous cyanobacteria, forms endosymbiotic associations with seedling roots that accelerate the growth of the vegetable seedlings. Understanding the gliding mechanism of Phormidium will facilitate improved formation of this association and increased vegetable production. To observe the gliding movements, we fabricated various microfluidic chips termed nanoaquariums using a femtosecond (fs) laser. Direct fs laser writing, followed by annealing and successive wet etching in dilute hydrofluoric acid solution, can easily produce three-dimensional (3D) microfluidics with different structures embedded in a photostructurable glass. Using the fs laser, optical waveguides and filters were integrated with the microfluidic structures in the microchips, allowing the gliding mechanism to be more easily clarified. Using this apparatus, we found that CO(2) secreted from the seedling root attracts Phormidium in the presence of light, and determined the light intensity and specific wavelength necessary for gliding. PMID:21562650

  3. Evaluating integration of inland bathymetry in the U.S. Geological Survey 3D Elevation Program, 2014

    USGS Publications Warehouse

    Miller-Corbett, Cynthia

    2016-01-01

    Inland bathymetry survey collections, survey data types, features, sources, availability, and the effort required to integrate inland bathymetric data into the U.S. Geological Survey 3D Elevation Program are assessed to help determine the feasibility of integrating three-dimensional water feature elevation data into The National Map. Available data from wading, acoustic, light detection and ranging, and combined technique surveys are provided by the U.S. Geological Survey, National Oceanic and Atmospheric Administration, U.S. Army Corps of Engineers, and other sources. Inland bathymetric data accessed through Web-hosted resources or contacts provide useful baseline parameters for evaluating survey types and techniques used for collection and processing, and serve as a basis for comparing survey methods and the quality of results. Historically, boat-mounted acoustic surveys have provided most inland bathymetry data. Light detection and ranging techniques that are beneficial in areas hard to reach by boat, that can collect dense data in shallow water to provide comprehensive coverage, and that can be cost effective for surveying large areas with good water clarity are becoming more common; however, optimal conditions and techniques for collecting and processing light detection and ranging inland bathymetry surveys are not yet well defined.Assessment of site condition parameters important for understanding inland bathymetry survey issues and results, and an evaluation of existing inland bathymetry survey coverage are proposed as steps to develop criteria for implementing a useful and successful inland bathymetry survey plan in the 3D Elevation Program. These survey parameters would also serve as input for an inland bathymetry survey data baseline. Integration and interpolation techniques are important factors to consider in developing a robust plan; however, available survey data are usually in a triangulated irregular network format or other format compatible with

  4. 77 FR 64826 - Certain Integrated Circuit Chips and Products Containing the Same; Institution of Investigation...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-10-23

    ... COMMISSION Certain Integrated Circuit Chips and Products Containing the Same; Institution of Investigation... integrated circuit chips and products containing the same by reason of infringement of certain claims of U.S... importation of certain integrated circuit chips and products containing the same that infringe one or more...

  5. 78 FR 10635 - Certain Integrated Circuit Devices and Products Containing the Same; Notice of Receipt of...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-02-14

    ... COMMISSION Certain Integrated Circuit Devices and Products Containing the Same; Notice of Receipt of... received a complaint entitled Certain Integrated Circuit Devices and Products Containing the Same, DN 2938..., and the sale within the United States after importation of certain integrated circuit devices...

  6. 77 FR 39735 - Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths and Products...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-07-05

    ... COMMISSION Certain Integrated Circuit Packages Provided With Multiple Heat- Conducting Paths and Products... the sale within the United States after importation of certain integrated circuit packages provided... integrated circuit packages provided with multiple heat-conducting paths and products containing same...

  7. 76 FR 58041 - Certain Digital Televisions Containing Integrated Circuit Devices and Components Thereof; Notice...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-09-19

    ... COMMISSION Certain Digital Televisions Containing Integrated Circuit Devices and Components Thereof; Notice... certain digital televisions containing integrated circuit devices and components thereof by reason of... integrated circuit devices and components thereof that infringe one or more of claims 9, 10, 12, 31, 32,...

  8. Pneumatic oscillator circuits for timing and control of integrated microfluidics.

    PubMed

    Duncan, Philip N; Nguyen, Transon V; Hui, Elliot E

    2013-11-01

    Frequency references are fundamental to most digital systems, providing the basis for process synchronization, timing of outputs, and waveform synthesis. Recently, there has been growing interest in digital logic systems that are constructed out of microfluidics rather than electronics, as a possible means toward fully integrated laboratory-on-a-chip systems that do not require any external control apparatus. However, the full realization of this goal has not been possible due to the lack of on-chip frequency references, thus requiring timing signals to be provided from off-chip. Although microfluidic oscillators have been demonstrated, there have been no reported efforts to characterize, model, or optimize timing accuracy, which is the fundamental metric of a clock. Here, we report pneumatic ring oscillator circuits built from microfluidic valves and channels. Further, we present a compressible-flow analysis that differs fundamentally from conventional circuit theory, and we show the utility of this physically based model for the optimization of oscillator stability. Finally, we leverage microfluidic clocks to demonstrate circuits for the generation of phase-shifted waveforms, self-driving peristaltic pumps, and frequency division. Thus, pneumatic oscillators can serve as on-chip frequency references for microfluidic digital logic circuits. On-chip clocks and pumps both constitute critical building blocks on the path toward achieving autonomous laboratory-on-a-chip devices. PMID:24145429

  9. Pneumatic oscillator circuits for timing and control of integrated microfluidics

    PubMed Central

    Duncan, Philip N.; Nguyen, Transon V.; Hui, Elliot E.

    2013-01-01

    Frequency references are fundamental to most digital systems, providing the basis for process synchronization, timing of outputs, and waveform synthesis. Recently, there has been growing interest in digital logic systems that are constructed out of microfluidics rather than electronics, as a possible means toward fully integrated laboratory-on-a-chip systems that do not require any external control apparatus. However, the full realization of this goal has not been possible due to the lack of on-chip frequency references, thus requiring timing signals to be provided from off-chip. Although microfluidic oscillators have been demonstrated, there have been no reported efforts to characterize, model, or optimize timing accuracy, which is the fundamental metric of a clock. Here, we report pneumatic ring oscillator circuits built from microfluidic valves and channels. Further, we present a compressible-flow analysis that differs fundamentally from conventional circuit theory, and we show the utility of this physically based model for the optimization of oscillator stability. Finally, we leverage microfluidic clocks to demonstrate circuits for the generation of phase-shifted waveforms, self-driving peristaltic pumps, and frequency division. Thus, pneumatic oscillators can serve as on-chip frequency references for microfluidic digital logic circuits. On-chip clocks and pumps both constitute critical building blocks on the path toward achieving autonomous laboratory-on-a-chip devices. PMID:24145429

  10. Universal discrete Fourier optics RF photonic integrated circuit architecture.

    PubMed

    Hall, Trevor J; Hasan, Mehedi

    2016-04-01

    This paper describes a coherent electro-optic circuit architecture that generates a frequency comb consisting of N spatially separated orders using a generalised Mach-Zenhder interferometer (MZI) with its N × 1 combiner replaced by an optical N × N Discrete Fourier Transform (DFT). Advantage may be taken of the tight optical path-length control, component and circuit symmetries and emerging trimming algorithms offered by photonic integration in any platform that offers linear electro-optic phase modulation such as LiNbO3, silicon, III-V or hybrid technology. The circuit architecture subsumes all MZI-based RF photonic circuit architectures in the prior art given an appropriate choice of output port(s) and dimension N although the principal application envisaged is phase correlated subcarrier generation for all optical orthogonal frequency division multiplexing. A transfer matrix approach is used to model the operation of the architecture. The predictions of the model are validated by simulations performed using an industry standard software tool. Implementation is found to be practical. PMID:27137048

  11. Design and status of the RF-digitizer integrated circuit

    NASA Technical Reports Server (NTRS)

    Rayhrer, B.; Lam, B.; Young, L. E.; Srinivasan, J. M.; Thomas, J. B.

    1991-01-01

    An integrated circuit currently under development samples a bandpass-limited signal at a radio frequency in quadrature and then performs a simple sum-and-dump operation in order to filter and lower the rate of the samples. Downconversion to baseband is carried out by the sampling step itself through the aliasing effect of an appropriately selected subharmonic sampling frequency. Two complete RF digitizer circuits with these functions will be implemented with analog and digital elements on one GaAs substrate. An input signal, with a carrier frequency as high as 8 GHz, can be sampled at a rate as high as 600 Msamples/sec for each quadrature component. The initial version of the chip will sign-sample (1-bit) the input RF signal. The chip will contain a synthesizer to generate a sample frequency that is a selectable integer multiple of an input reference frequency. In addition to the usual advantages of compactness and reliability associated with integrated circuits, the single chip will replace several steps required by standard analog downconversion. Furthermore, when a very high initial sample rate is selected, the presampling analog filters can be given very large bandwidths, thereby greatly reducing phase and delay instabilities typically introduced by such filters, as well as phase and delay variation due to Doppler changes.

  12. Design automation for integrated nonlinear logic circuits (Conference Presentation)

    NASA Astrophysics Data System (ADS)

    Van Vaerenbergh, Thomas; Pelc, Jason; Santori, Charles; Bose, Ranojoy; Kielpinski, Dave; Beausoleil, Raymond G.

    2016-05-01

    A key enabler of the IT revolution of the late 20th century was the development of electronic design automation (EDA) tools allowing engineers to manage the complexity of electronic circuits with transistor counts now reaching into the billions. Recently, we have been developing large-scale nonlinear photonic integrated logic circuits for next generation all-optical information processing. At this time a sufficiently powerful EDA-style software tool chain to design this type of complex circuits does not yet exist. Here we describe a hierarchical approach to automating the design and validation of photonic integrated circuits, which can scale to several orders of magnitude higher complexity than the state of the art. Most photonic integrated circuits developed today consist of a small number of components, and only limited hierarchy. For example, a simple photonic transceiver may contain on the order of 10 building-block components, consisting of grating couplers for photonic I/O, modulators, and signal splitters/combiners. Because this is relatively easy to lay out by hand (or simple script) existing photonic design tools have relatively little automation in comparison to electronics tools. But demonstrating all-optical logic will require significantly more complex photonic circuits containing up to 1,000 components, hence becoming infeasible to design manually. Our design framework is based off Python-based software from Luceda Photonics which provides an environment to describe components, simulate their behavior, and export design files (GDS) to foundries for fabrication. At a fundamental level, a photonic component is described as a parametric cell (PCell) similarly to electronics design. PCells are described by geometric characteristics of their layout. A critical part of the design framework is the implementation of PCells as Python objects. PCell objects can then use inheritance to simplify design, and hierarchical designs can be made by creating composite

  13. Integrated diode circuits for greater than 1 THz

    NASA Astrophysics Data System (ADS)

    Schoenthal, Gerhard Siegbert

    The terahertz frequency band, spanning from roughly 100 GHz to 10 THz, forms the transition from electronics to photonics. This band is often referred to as the "terahertz technology gap" because it lacks typical microwave and optical components. The deficit of terahertz devices makes it difficult to conduct important scientific measurements that are exclusive to this band in fields such as radio astronomy and chemical spectroscopy. In addition, a number of scientific, military and commercial applications will become more practical when a suitable terahertz technology is developed. UVa's Applied Electrophysics Laboratory has extended non-linear microwave diode technology into the terahertz region. Initial success was achieved with whisker-contacted diodes and then discrete planar Schottky diodes soldered onto quartz circuits. Work at UVa and the Jet Propulsion Laboratory succeeded in integrating this diode technology onto low dielectric substrates, thereby producing more practical components with greater yield and improved performance. However, the development of circuit integration technologies for greater than 1 THz and the development of broadly tunable sources of terahertz power remain as major research goals. Meeting these critical needs is the primary motivation for this research. To achieve this goal and demonstrate a useful prototype for one of our sponsors, this research project has focused on the development of a Sideband Generator at 1.6 THz. This component allows use of a fixed narrow band source as a tunable power source for terahertz spectroscopy and compact range radar. To prove the new fabrication and circuit technologies, initial devices were fabricated and tested at 200 and 600 GHz. These circuits included non-ohmic cathodes, air-bridged fingers, oxideless anode formation, and improved quartz integration processes. The excellent performance of these components validated these new concepts. The prototype process was then further optimized to

  14. 3D IC for Future HEP Detectors

    SciTech Connect

    Thom, J.; Lipton, R.; Heintz, U.; Johnson, M.; Narain, M.; Badman, R.; Spiegel, L.; Triphati, M.; Deptuch, G.; Kenney, C.; Parker, S.; Ye, Z.; Siddons, D.

    2014-11-07

    Three dimensional integrated circuit technologies offer the possibility of fabricating large area arrays of sensors integrated with complex electronics with minimal dead area, which makes them ideally suited for applications at the LHC upgraded detectors and other future detectors. Here we describe ongoing R&D efforts to demonstrate functionality of components of such detectors. This also includes the study of integrated 3D electronics with active edge sensors to produce "active tiles" which can be tested and assembled into arrays of arbitrary size with high yield.

  15. 3D IC for future HEP detectors

    NASA Astrophysics Data System (ADS)

    Thom, J.; Lipton, R.; Heintz, U.; Johnson, M.; Narain, M.; Badman, R.; Spiegel, L.; Triphati, M.; Deptuch, G.; Kenney, C.; Parker, S.; Ye, Z.; Siddons, D. P.

    2014-11-01

    Three dimensional integrated circuit technologies offer the possibility of fabricating large area arrays of sensors integrated with complex electronics with minimal dead area, which makes them ideally suited for applications at the LHC upgraded detectors and other future detectors. We describe ongoing R&D efforts to demonstrate functionality of components of such detectors. This includes the study of integrated 3D electronics with active edge sensors to produce "active tiles" which can be tested and assembled into arrays of arbitrary size with high yield.

  16. Synthetic circuits integrating logic and memory in living cells.

    PubMed

    Siuti, Piro; Yazbek, John; Lu, Timothy K

    2013-05-01

    Logic and memory are essential functions of circuits that generate complex, state-dependent responses. Here we describe a strategy for efficiently assembling synthetic genetic circuits that use recombinases to implement Boolean logic functions with stable DNA-encoded memory of events. Application of this strategy allowed us to create all 16 two-input Boolean logic functions in living Escherichia coli cells without requiring cascades comprising multiple logic gates. We demonstrate long-term maintenance of memory for at least 90 cell generations and the ability to interrogate the states of these synthetic devices with fluorescent reporters and PCR. Using this approach we created two-bit digital-to-analog converters, which should be useful in biotechnology applications for encoding multiple stable gene expression outputs using transient inputs of inducers. We envision that this integrated logic and memory system will enable the implementation of complex cellular state machines, behaviors and pathways for therapeutic, diagnostic and basic science applications. PMID:23396014

  17. Millimeter wave planar integrated circuit developments for communication applications

    NASA Astrophysics Data System (ADS)

    Chang, K.; Sun, C.

    Millimeter wave communication systems offer certain advantages over lower frequency systems. These advantages are related to wider bandwidth, larger data handling capacity, covert operation, and better immunity to jamming. Newer developments in the area of component technology for systems operating at millimeter wavelengths have utilized planar integrated circuits. Such circuits provide benefits of light weight, small size, and inherent low cost due to ease of high volume manufacturing. The present paper is concerned with a number of key IC components which have been developed. These components are ideally suited for direct application in advanced tactical, radar, and satellite communication systems. Attention is given to a rat-race microstrip balanced mixer, a crossbar stripline balanced mixer, and various subsystems developments.

  18. Models for total dose degradation of linear integrated circuits

    SciTech Connect

    Johnston, A.H.; Plaag, R.E.

    1987-12-01

    Mechanisms for total dose degradation of linear circuits are discussed, including bulk effects, oxide charge buildup and recombination at the Si-SiO/sub 2/ interface. The dependence of damage on bias, dose, particle type and energy is used in conjunction with two-dimensional modeling to identify the failure mechanism in a specific linear device type. The importance of surface recombination is demonstrated along with the absence of bias dependence. Bulk damage is shown to be important for high energy electron irradiation because of wide-base pnp transistors. This causes substantial differences in device failure between electron and cobalt-60 environments that need to be taken into account for test standards and data bases that include commercial bipolar integrated circuits. Valid test methodologies for linear device must consider the energy and particle type present in the actual environment.

  19. Development of Integrated Single Flux Quantum - Superconducting Qubit Circuits

    NASA Astrophysics Data System (ADS)

    Leonard, Edward, Jr.; Thorbeck, Ted; Zhu, Shaojiang; Howington, Caleb; Hutchings, Matthew; Nelson, Jj; Plourde, Britton; McDermott, Robert

    Significant theoretical and experimental progress has been made in recent years towards a scalable superconducting quantum circuit architecture. Here we present a first attempt to integrate classical control elements from the single flux quantum (SFQ) digital logic family with a superconducting transom qubit on a single chip. The SFQ driving circuit is fabricated in a six-layer high-Jc Nb/Al-AlOx/Nb junction process while the transmon qubit is subsequently formed using submicron Al-AlOx-Al junctions grown by double-angle evaporation. We investigate sources of decoherence associated with the more complex fabrication process and describe first attempts to perform coherent qubit manipulations using resonant trains of SFQ pulses.

  20. Mnemonic Functions for Nonlinear Dendritic Integration in Hippocampal Pyramidal Circuits.

    PubMed

    Kaifosh, Patrick; Losonczy, Attila

    2016-05-01

    We present a model for neural circuit mechanisms underlying hippocampal memory. Central to this model are nonlinear interactions between anatomically and functionally segregated inputs onto dendrites of pyramidal cells in hippocampal areas CA3 and CA1. We study the consequences of such interactions using model neurons in which somatic burst-firing and synaptic plasticity are controlled by conjunctive processing of these separately integrated input pathways. We find that nonlinear dendritic input processing enhances the model's capacity to store and retrieve large numbers of similar memories. During memory encoding, CA3 stores heavily decorrelated engrams to prevent interference between similar memories, while CA1 pairs these engrams with information-rich memory representations that will later provide meaningful output signals during memory recall. While maintaining mathematical tractability, this model brings theoretical study of memory operations closer to the hippocampal circuit's anatomical and physiological properties, thus providing a framework for future experimental and theoretical study of hippocampal function. PMID:27146266

  1. Lithography for enabling advances in integrated circuits and devices.

    PubMed

    Garner, C Michael

    2012-08-28

    Because the transistor was fabricated in volume, lithography has enabled the increase in density of devices and integrated circuits. With the invention of the integrated circuit, lithography enabled the integration of higher densities of field-effect transistors through evolutionary applications of optical lithography. In 1994, the semiconductor industry determined that continuing the increase in density transistors was increasingly difficult and required coordinated development of lithography and process capabilities. It established the US National Technology Roadmap for Semiconductors and this was expanded in 1999 to the International Technology Roadmap for Semiconductors to align multiple industries to provide the complex capabilities to continue increasing the density of integrated circuits to nanometre scales. Since the 1960s, lithography has become increasingly complex with the evolution from contact printers, to steppers, pattern reduction technology at i-line, 248 nm and 193 nm wavelengths, which required dramatic improvements of mask-making technology, photolithography printing and alignment capabilities and photoresist capabilities. At the same time, pattern transfer has evolved from wet etching of features, to plasma etch and more complex etching capabilities to fabricate features that are currently 32 nm in high-volume production. To continue increasing the density of devices and interconnects, new pattern transfer technologies will be needed with options for the future including extreme ultraviolet lithography, imprint technology and directed self-assembly. While complementary metal oxide semiconductors will continue to be extended for many years, these advanced pattern transfer technologies may enable development of novel memory and logic technologies based on different physical phenomena in the future to enhance and extend information processing. PMID:22802500

  2. Advances in integrated photonic circuits for packet-switched interconnection

    NASA Astrophysics Data System (ADS)

    Williams, Kevin A.; Stabile, Ripalta

    2014-03-01

    Sustained increases in capacity and connectivity are needed to overcome congestion in a range of broadband communication network nodes. Packet routing and switching in the electronic domain are leading to unsustainable energy- and bandwidth-densities, motivating research into hybrid solutions: optical switching engines are introduced for massive-bandwidth data transport while the electronic domain is clocked at more modest GHz rates to manage routing. Commercially-deployed optical switching engines using MEMS technologies are unwieldy and too slow to reconfigure for future packet-based networking. Optoelectronic packet-compliant switch technologies have been demonstrated as laboratory prototypes, but they have so far mostly used discretely pigtailed components, which are impractical for control plane development and product assembly. Integrated photonics has long held the promise of reduced hardware complexity and may be the critical step towards packet-compliant optical switching engines. Recently a number of laboratories world-wide have prototyped optical switching circuits using monolithic integration technology with up to several hundreds of integrated optical components per chip. Our own work has focused on multi-input to multi-output switching matrices. Recently we have demonstrated 8×8×8λ space and wavelength selective switches using gated cyclic routers and 16×16 broadband switching chips using monolithic multi-stage networks. We now operate these advanced circuits with custom control planes implemented with FPGAs to explore real time packet routing in multi-wavelength, multi-port test-beds. We review our contributions in the context of state of the art photonic integrated circuit technology and packet optical switching hardware demonstrations.

  3. Compilation of an integrated 3D soil and agrogeological database for the hydrophysical characterization of the unsaturated zone

    NASA Astrophysics Data System (ADS)

    Bakacsi, Zsófia; Kuti, László; Pásztor, László; Vatai, József; Szabó, József; Müller, Tamás.

    2010-05-01

    Describing the water movement in the unsaturated zone, numerous soil hydraulic data as input parameter are required concerning the water retention curve and the hydraulic conductivity function as the main hydraulic properties. The direct measurements of the hydraulic parameters are quite difficult and time-consuming; the estimation of them can be an alternative especially for large areas. The most commonly used basis of the estimation is the particle-size distribution (PSD) data or texture class. The aim of our work was to compile an integrated and harmonized 3D pedo- and agrogeological database with the physical properties and stratification of the formations to the depth of the permanent groundwater level, which describes the unsaturated zone in a 690 km2 pilot area. Since the existing pedo- and agrogeological databases are not able to serve separately these 3D model requirements, their integration was necessary. Due to its appropriate spatial and thematic resolution and data processing status, the Digital Kreybig Soil Information System (DKSIS) was chosen as pedological data source of the 3D model. The DKSIS has been compiled in the Research Institute for Soil Science and Agricultural Chemistry of the Hungarian Academy of Sciences, based on the 1:25,000 scale, national soil mapping program in Hungary. The survey sheets indicate the location of the observation sites. Due to the lack of measured PSD data, the field estimation of the textural classes, and the so-called "capillary rise of water" were used for the definition of the texture classes. The measured water uptake is supposed to have good relation with the textural class of the sample. During the data processing the inconsistent fields vs. capillary data pairs were excluded. In the DKSIS 649 polygons cover the pilot area, 484 soil profiles are occurring and characteristically each profile has two or three horizons. The agrogeological dataset is maintained by the Hungarian Geological Institute and derives

  4. Microgravity Characterization of the Hontomín CO2 Storage Site (Spain). Integration with 3D Seismic Results

    NASA Astrophysics Data System (ADS)

    Ayarza, P.; Andres, J.; Alcalde, J.; Martí, D.; Marzán, I.; Martinez-Catalan, J. R.; Carbonell, R.; García Lobón, J. L.; Pérez Estaún, A.

    2014-12-01

    Hontomín hosts the first Spanish CO2storage Technology Development Plant. The area, located in the southern part of Mesozoic Basque-Cantabrian Basin, presents E-W and ESE-WNW faults formed during a Permian-Triassic extensional event. The latter were reactivated during the opening of the Bay of Biscay, while a new set of NNE-SSW faults developed. Fractures were reactivated again during the Alpine compression. The resulting configuration is a dome-like structure that includes the Mesozoic succession (Upper Triassic to Lower Cretaceous) and is crowned by Upper Cretaceous and Eocene rocks lying unconformably. The target injection pointis located at 1500 m depth, within a Jurassic carbonate saline formation. Several multidisciplinary studies have been carried out in Hontomín aiming to obtain a thorough geological characterization. Among these, a microgravity survey, acquired under the umbrella of the CIUDEN foundation, has provided us with a complete 3D image of the site. A 4x4 km2area, coincident with that surveyed by 3D seismic reflection, has been sampled using a dense grid with a station spacing of 100 m. The result is a high resolution Bouguer anomaly gravity map capable of offering insights into the subsurface geology down to the depth of the injection point. The application of mathematical procedures to the data has further enhanced its potential for interpretation. The calculated regional anomaly indicates that the dome structure strikes E-W to ENE-WSW, sub-parallel to a major fault: the South Fault, part of the Ubierna fault system. The resulting residual anomaly enhances a number of NW-SE features that have also been interpreted as faults and that can be observed after performing vertical and horizontal derivatives to the data. Calculation of the Euler solutions confirms the previous results and brings out a new NNW-SSE feature, namely the East Fault. Integration with 3D seismic data suggests that faults affect different levels of the sedimentary sequence

  5. Integration of 3D Printed and Micropatterned Polycaprolactone Scaffolds for Guidance of Oriented Collagenous Tissue Formation In Vivo.

    PubMed

    Pilipchuk, Sophia P; Monje, Alberto; Jiao, Yizu; Hao, Jie; Kruger, Laura; Flanagan, Colleen L; Hollister, Scott J; Giannobile, William V

    2016-03-01

    Scaffold design incorporating multiscale cues for clinically relevant, aligned tissue regeneration has potential to improve structural and functional integrity of multitissue interfaces. The objective of this preclinical study is to develop poly(ε-caprolactone) (PCL) scaffolds with mesoscale and microscale architectural cues specific to human ligament progenitor cells and assess their ability to form aligned bone-ligament-cementum complexes in vivo. PCL scaffolds are designed to integrate a 3D printed bone region with a micropatterned PCL thin film consisting of grooved pillars. The patterned film region is seeded with human ligament cells, fibroblasts transduced with bone morphogenetic protein-7 genes seeded within the bone region, and a tooth dentin segment positioned on the ligament region prior to subcutaneous implantation into a murine model. Results indicate increased tissue alignment in vivo using micropatterned PCL films, compared to random-porous PCL. At week 6, 30 μm groove depth significantly enhances oriented collagen fiber thickness, overall cell alignment, and nuclear elongation relative to 10 μm groove depth. This study demonstrates for the first time that scaffolds with combined hierarchical mesoscale and microscale features can align cells in vivo for oral tissue repair with potential for improving the regenerative response of other bone-ligament complexes. PMID:26820240

  6. Terrestrial and Aerial Laser Scanning Data Integration Using Wavelet Analysis for the Purpose of 3D Building Modeling

    PubMed Central

    Kedzierski, Michal; Fryskowska, Anna

    2014-01-01

    Visualization techniques have been greatly developed in the past few years. Three-dimensional models based on satellite and aerial imagery are now being enhanced by models generated using Aerial Laser Scanning (ALS) data. The most modern of such scanning systems have the ability to acquire over 50 points per square meter and to register a multiple echo, which allows the reconstruction of the terrain together with the terrain cover. However, ALS data accuracy is less than 10 cm and the data is often incomplete: there is no information about ground level (in most scanning systems), and often around the facade or structures which have been covered by other structures. However, Terrestrial Laser Scanning (TLS) not only acquires higher accuracy data (1–5 cm) but is also capable of registering those elements which are incomplete or not visible using ALS methods (facades, complicated structures, interiors, etc.). Therefore, to generate a complete 3D model of a building in high Level of Details, integration of TLS and ALS data is necessary. This paper presents the wavelet-based method of processing and integrating data from ALS and TLS. Methods of choosing tie points to combine point clouds in different datum will be analyzed. PMID:25004157

  7. An intelligent recovery progress evaluation system for ACL reconstructed subjects using integrated 3-D kinematics and EMG features.

    PubMed

    Malik, Owais A; Senanayake, S M N Arosha; Zaheer, Dansih

    2015-03-01

    An intelligent recovery evaluation system is presented for objective assessment and performance monitoring of anterior cruciate ligament reconstructed (ACL-R) subjects. The system acquires 3-D kinematics of tibiofemoral joint and electromyography (EMG) data from surrounding muscles during various ambulatory and balance testing activities through wireless body-mounted inertial and EMG sensors, respectively. An integrated feature set is generated based on different features extracted from data collected for each activity. The fuzzy clustering and adaptive neuro-fuzzy inference techniques are applied to these integrated feature sets in order to provide different recovery progress assessment indicators (e.g., current stage of recovery, percentage of recovery progress as compared to healthy group, etc.) for ACL-R subjects. The system was trained and tested on data collected from a group of healthy and ACL-R subjects. For recovery stage identification, the average testing accuracy of the system was found above 95% (95-99%) for ambulatory activities and above 80% (80-84%) for balance testing activities. The overall recovery evaluation performed by the proposed system was found consistent with the assessment made by the physiotherapists using standard subjective/objective scores. The validated system can potentially be used as a decision supporting tool by physiatrists, physiotherapists, and clinicians for quantitative rehabilitation analysis of ACL-R subjects in conjunction with the existing recovery monitoring systems. PMID:24801517

  8. GPR simulation based on complex frequency shifted recursive integration PML boundary of 3D high order FDTD

    NASA Astrophysics Data System (ADS)

    Li, Jing; Zeng, Zhaofa; Huang, Ling; Liu, Fengshan

    2012-12-01

    When applying the finite difference time domain (FDTD) method in Ground Penetrating Radar (GPR) simulation, the absorbing boundary conditions (ABC) are used to mitigate undesired reflection that can arise at the model's truncation boundaries. The classical PML boundary can make spurious reflection for the waves, such as reaching to the PML interface with near-grazing angles, low frequency waves or evanescent waves. The non-split complex frequency shifted PML which base on recursive integration (CFS-RIPML) has a good absorption effect for these interference waves. Meanwhile, the recursive integration, which does not need split field component, can overcome the shortcoming of CFS technique that needs more intermediate variable and large memory. In addition, the high-order FDTD can improve calculation accuracy and reduce the error caused by numerical dispersion effectively. In this paper, we derive the 3D high-order FDTD method with CFS-RIPML boundary and apply it in GPR simulation. The results show that the CFS-RIPML has significantly better absorption effect and lower reflections error than UPML and PML boundary. Compared with the two-order, the high-order FDTD can improve calculation accuracy effectively with the same grid size. Combination with CFS-RIPML boundary and high-order FDTD can improve the reliability and calculation accuracy of GPR and other geophysics numerical simulation.

  9. An application of carbon nanotubes for integrated circuit interconnects

    NASA Astrophysics Data System (ADS)

    Coiffic, J. C.; Foa Torres, L. E.; Le Poche, H.; Fayolle, M.; Roche, S.; Maitrejean, S.; Roualdes, S.; Ayral, A.

    2008-08-01

    Integrated circuits fabrication is soon reaching strong limitations. Help could come from using carbon nanotubes as conducting wires for interconnects. Although this solution was proposed six years ago, researchers still come up with many obstacles such as localization, low temperature growth on copper, contacting and reproducibility. The integration processes exposed here intend to meet the industrial requirements. Two approaches are then possibly followed. Either using densely packed single wall (SWCNT) (or very tiny multiwall) nanotubes, or filling up the whole interconnect diameter with a single large multiwall (MWCNT) nanotube. In this work, we focus on the integration of multiwall vertical interconnects. Densely packed MWCNTs are grown in via holes by CVD. Alternatively, we have developed a method to obtain a single large nanofibre grown by PECVD (MWCNF) in each via hole. Electrical measurements are performed on CVD and PECVD grown carbon nanotubes. The role of electron-phonon interaction in these devices is also briefly discussed.

  10. Highly integrated 10Gb/s optical sub-assembly and its circuit modeling

    NASA Astrophysics Data System (ADS)

    Shim, Jongin; Kim, Dongchurl

    2006-09-01

    A highly integrated 10 Gb/s transmitter optical sub-assembly was fabricated and characterized for XFP transceiver. As a light source, uncooled 1.3 μm high-speed distributed feedback laser diode (DFB-LD) was fabricated and assembled on AlN sub-mount with a monitoring PD, a matching-resistor, and a bias-Tee with spiral-inductor. A glass sealed metallic low-loss TO-stem with in-line leads was newly presented. We developed a small-signal equivalent circuit model based on measured S-parameters in order to verify RF characteristics of LD and passive components. The eye-diagram of 10 Gb/s NRZ patterns with a PRBS 2 31 -1 was opened clearly without mask violation. At 85°C, -3-dB bandwidth was measured as high as 11 GHz and 75-km transmission was successfully achieved with very low penalty.

  11. Implantable neurotechnologies: a review of integrated circuit neural amplifiers.

    PubMed

    Ng, Kian Ann; Greenwald, Elliot; Xu, Yong Ping; Thakor, Nitish V

    2016-01-01

    Neural signal recording is critical in modern day neuroscience research and emerging neural prosthesis programs. Neural recording requires the use of precise, low-noise amplifier systems to acquire and condition the weak neural signals that are transduced through electrode interfaces. Neural amplifiers and amplifier-based systems are available commercially or can be designed in-house and fabricated using integrated circuit (IC) technologies, resulting in very large-scale integration or application-specific integrated circuit solutions. IC-based neural amplifiers are now used to acquire untethered/portable neural recordings, as they meet the requirements of a miniaturized form factor, light weight and low power consumption. Furthermore, such miniaturized and low-power IC neural amplifiers are now being used in emerging implantable neural prosthesis technologies. This review focuses on neural amplifier-based devices and is presented in two interrelated parts. First, neural signal recording is reviewed, and practical challenges are highlighted. Current amplifier designs with increased functionality and performance and without penalties in chip size and power are featured. Second, applications of IC-based neural amplifiers in basic science experiments (e.g., cortical studies using animal models), neural prostheses (e.g., brain/nerve machine interfaces) and treatment of neuronal diseases (e.g., DBS for treatment of epilepsy) are highlighted. The review concludes with future outlooks of this technology and important challenges with regard to neural signal amplification. PMID:26798055

  12. Implantable neurotechnologies: a review of integrated circuit neural amplifiers

    PubMed Central

    Greenwald, Elliot; Xu, Yong Ping; Thakor, Nitish V.

    2016-01-01

    Neural signal recording is critical in modern day neuroscience research and emerging neural prosthesis programs. Neural recording requires the use of precise, low-noise amplifier systems to acquire and condition the weak neural signals that are transduced through electrode interfaces. Neural amplifiers and amplifier-based systems are available commercially or can be designed in-house and fabricated using integrated circuit (IC) technologies, resulting in very large-scale integration or application-specific integrated circuit solutions. IC-based neural amplifiers are now used to acquire untethered/portable neural recordings, as they meet the requirements of a miniaturized form factor, light weight and low power consumption. Furthermore, such miniaturized and low-power IC neural amplifiers are now being used in emerging implantable neural prosthesis technologies. This review focuses on neural amplifier-based devices and is presented in two interrelated parts. First, neural signal recording is reviewed, and practical challenges are highlighted. Current amplifier designs with increased functionality and performance and without penalties in chip size and power are featured. Second, applications of IC-based neural amplifiers in basic science experiments (e.g., cortical studies using animal models), neural prostheses (e.g., brain/nerve machine interfaces) and treatment of neuronal diseases (e.g., DBS for treatment of epilepsy) are highlighted. The review concludes with future outlooks of this technology and important challenges with regard to neural signal amplification. PMID:26798055

  13. Extended depth-of-field 3D endoscopy with synthetic aperture integral imaging using an electrically tunable focal-length liquid-crystal lens.

    PubMed

    Wang, Yu-Jen; Shen, Xin; Lin, Yi-Hsin; Javidi, Bahram

    2015-08-01

    Conventional synthetic-aperture integral imaging uses a lens array to sense the three-dimensional (3D) object or scene that can then be reconstructed digitally or optically. However, integral imaging generally suffers from a fixed and limited range of depth of field (DOF). In this Letter, we experimentally demonstrate a 3D integral-imaging endoscopy with tunable DOF by using a single large-aperture focal-length-tunable liquid crystal (LC) lens. The proposed system can provide high spatial resolution and an extended DOF in synthetic-aperture integral imaging 3D endoscope. In our experiments, the image plane in the integral imaging pickup process can be tuned from 18 to 38 mm continuously using a large-aperture LC lens, and the total DOF is extended from 12 to 51 mm. To the best of our knowledge, this is the first report on synthetic aperture integral imaging 3D endoscopy with a large-aperture LC lens that can provide high spatial resolution 3D imaging with an extend DOF. PMID:26258358

  14. Fabrication Of High-Tc Superconducting Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Bhasin, Kul B.; Warner, Joseph D.

    1992-01-01

    Microwave ring resonator fabricated to demonstrate process for fabrication of passive integrated circuits containing high-transition-temperature superconductors. Superconductors increase efficiencies of communication systems, particularly microwave communication systems, by reducing ohmic losses and dispersion of signals. Used to reduce sizes and masses and increase aiming accuracies and tracking speeds of millimeter-wavelength, electronically steerable antennas. High-Tc superconductors preferable for such applications because they operate at higher temperatures than low-Tc superconductors do, therefore, refrigeration systems needed to maintain superconductivity designed smaller and lighter and to consume less power.

  15. State-transfer simulation in integrated waveguide circuits

    NASA Astrophysics Data System (ADS)

    Latmiral, L.; Di Franco, C.; Mennea, P. L.; Kim, M. S.

    2015-08-01

    Spin-chain models have been widely studied in terms of quantum information processes, for instance for the faithful transmission of quantum states. Here, we investigate the limitations of mapping this process to an equivalent one through a bosonic chain. In particular, we keep in mind experimental implementations, which the progress in integrated waveguide circuits could make possible in the very near future. We consider the feasibility of exploiting the higher dimensionality of the Hilbert space of the chain elements for the transmission of a larger amount of information, and the effects of unwanted excitations during the process. Finally, we exploit the information-flux method to provide bounds to the transfer fidelity.

  16. Implementation of Large Scale Integrated (LSI) circuit design software

    NASA Technical Reports Server (NTRS)

    Kuehlthau, R. L.; Pitts, E. R.

    1976-01-01

    Portions of the Computer Aided Design and Test system, a collection of Large Scale Integrated (LSI) circuit design programs were modified and upgraded. Major modifications were made to the Mask Analysis Program in the form of additional operating commands and file processing options. Modifications were also made to the Artwork Interactive Design System to correct some deficiencies in the original program as well as to add several new command features related to improving the response of AIDS when dealing with large files. The remaining work was concerned with updating various programs within CADAT to incorporate the silicon on sapphire silicon gate technology.

  17. Light-induced voltage alteration for integrated circuit analysis

    DOEpatents

    Cole, Jr., Edward I.; Soden, Jerry M.

    1995-01-01

    An apparatus and method are described for analyzing an integrated circuit (IC), The invention uses a focused light beam that is scanned over a surface of the IC to generate a light-induced voltage alteration (LIVA) signal for analysis of the IC, The LIVA signal may be used to generate an image of the IC showing the location of any defects in the IC; and it may be further used to image and control the logic states of the IC. The invention has uses for IC failure analysis, for the development of ICs, for production-line inspection of ICs, and for qualification of ICs.

  18. Light-induced voltage alteration for integrated circuit analysis

    DOEpatents

    Cole, E.I. Jr.; Soden, J.M.

    1995-07-04

    An apparatus and method are described for analyzing an integrated circuit (IC). The invention uses a focused light beam that is scanned over a surface of the IC to generate a light-induced voltage alteration (LIVA) signal for analysis of the IC. The LIVA signal may be used to generate an image of the IC showing the location of any defects in the IC; and it may be further used to image and control the logic states of the IC. The invention has uses for IC failure analysis, for the development of ICs, for production-line inspection of ICs, and for qualification of ICs. 18 figs.

  19. Method for deposition of a conductor in integrated circuits

    DOEpatents

    Creighton, J.R.; Dominguez, F.; Johnson, A.W.; Omstead, T.R.

    1997-09-02

    A method is described for fabricating integrated semiconductor circuits and, more particularly, for the selective deposition of a conductor onto a substrate employing a chemical vapor deposition process. By way of example, tungsten can be selectively deposited onto a silicon substrate. At the onset of loss of selectivity of deposition of tungsten onto the silicon substrate, the deposition process is interrupted and unwanted tungsten which has deposited on a mask layer with the silicon substrate can be removed employing a halogen etchant. Thereafter, a plurality of deposition/etch back cycles can be carried out to achieve a predetermined thickness of tungsten. 2 figs.

  20. Method for deposition of a conductor in integrated circuits

    DOEpatents

    Creighton, J. Randall; Dominguez, Frank; Johnson, A. Wayne; Omstead, Thomas R.

    1997-01-01

    A method is described for fabricating integrated semiconductor circuits and, more particularly, for the selective deposition of a conductor onto a substrate employing a chemical vapor deposition process. By way of example, tungsten can be selectively deposited onto a silicon substrate. At the onset of loss of selectivity of deposition of tungsten onto the silicon substrate, the deposition process is interrupted and unwanted tungsten which has deposited on a mask layer with the silicon substrate can be removed employing a halogen etchant. Thereafter, a plurality of deposition/etch back cycles can be carried out to achieve a predetermined thickness of tungsten.

  1. SiGe/Si Monolithically Integrated Amplifier Circuits

    NASA Technical Reports Server (NTRS)

    Katehi, Linda P. B.; Bhattacharya, Pallab

    1998-01-01

    With recent advance in the epitaxial growth of silicon-germanium heterojunction, Si/SiGe HBTs with high f(sub max) and f(sub T) have received great attention in MMIC applications. In the past year, technologies for mesa-type Si/SiGe HBTs and other lumped passive components with high resonant frequencies have been developed and well characterized for circuit applications. By integrating the micromachined lumped passive elements into HBT fabrication, multi-stage amplifiers operating at 20 GHz have been designed and fabricated.

  2. The use of hybrid integrated circuit techniques in biotelemetry applications

    NASA Technical Reports Server (NTRS)

    Fryer, T. B.

    1977-01-01

    A review is presented of some features of hybrid integrated circuits that make their use advantageous in miniature biotelemetry applications. The various techniques for fabricating resistors, capacitors and interconnections by both thin film and thick film technology are discussed. The use of chip capacitors, resistors, and especially standard IC chips on substrates with fired-on interconnection patterns is emphasized. The review is designed primarily to acquaint biotelemetry users and designers with an overview of this fabrication technique so that they can better communicate their needs with an understanding of its limitations and advantages to facilities specializing in hybrid construction.

  3. Universal nondestructive mm-wave integrated circuit test fixture

    NASA Technical Reports Server (NTRS)

    Romanofsky, Robert R. (Inventor); Shalkhauser, Kurt A. (Inventor)

    1990-01-01

    Monolithic microwave integrated circuit (MMIC) test includes a bias module having spring-loaded contacts which electrically engage pads on a chip carrier disposed in a recess of a base member. RF energy is applied to and passed from the chip carrier by chamfered edges of ridges in the waveguide passages of housings which are removably attached to the base member. Thru, Delay, and Short calibration standards having dimensions identical to those of the chip carrier assure accuracy and reliability of the test. The MMIC chip fits in an opening in the chip carrier with the boundaries of the MMIC lying on movable reference planes thereby establishing accuracy and flexibility.

  4. Stainless Steel NaK Circuit Integration and Fill Submission

    NASA Technical Reports Server (NTRS)

    Garber, Anne E.

    2006-01-01

    The Early Flight Fission Test Facilities (EFF-TF) team has been tasked by the Marshall Space Flight Center Nuclear Systems Office to design, fabricate, and test an actively pumped alkali metal flow circuit. The system, which was originally designed to hold a eutectic mixture of sodium potassium (NaK), was redesigned to hold lithium; but due to a shift in focus, it is once again being prepared for use with NaK. Changes made to the actively pumped, high temperature loop include the replacement of the expansion reservoir, addition of remotely operated valves, and modification of the support table. Basic circuit components include: reactor segment, NaK to gas heat exchanger, electromagnetic (EM) liquid metal pump, load/drain reservoir, expansion reservoir, instrumentation, and a spill reservoir. A 37-pin partial-array core (pin and flow path dimensions are the same as those in a full design) was selected for fabrication and test. This document summarizes the integration and fill of the pumped liquid metal NaK flow circuit.

  5. Chemistry integrated circuit: chemical system on a complementary metal oxide semiconductor integrated circuit.

    PubMed

    Nakazato, Kazuo

    2014-03-28

    By integrating chemical reactions on a large-scale integration (LSI) chip, new types of device can be created. For biomedical applications, monolithically integrated sensor arrays for potentiometric, amperometric and impedimetric sensing of biomolecules have been developed. The potentiometric sensor array detects pH and redox reaction as a statistical distribution of fluctuations in time and space. For the amperometric sensor array, a microelectrode structure for measuring multiple currents at high speed has been proposed. The impedimetric sensor array is designed to measure impedance up to 10 MHz. The multimodal sensor array will enable synthetic analysis and make it possible to standardize biosensor chips. Another approach is to create new functional devices by integrating molecular systems with LSI chips, for example image sensors that incorporate biological materials with a sensor array. The quantum yield of the photoelectric conversion of photosynthesis is 100%, which is extremely difficult to achieve by artificial means. In a recently developed process, a molecular wire is plugged directly into a biological photosynthetic system to efficiently conduct electrons to a gold electrode. A single photon can be detected at room temperature using such a system combined with a molecular single-electron transistor. PMID:24567475

  6. ROIC for gated 3D imaging LADAR receiver

    NASA Astrophysics Data System (ADS)

    Chen, Guoqiang; Zhang, Junling; Wang, Pan; Zhou, Jie; Gao, Lei; Ding, Ruijun

    2013-09-01

    Time of flight laser range finding, deep space communications and scanning video imaging are three applications requiring very low noise optical receivers to achieve detection of fast and weak optical signal. HgCdTe electrons initiated avalanche photodiodes (e-APDs) in linear multiplication mode is the detector of choice thanks to its high quantum efficiency, high gain at low bias, high bandwidth and low noise factor. In this project, a readout integrated circuit of hybrid e-APD focal plane array (FPA) with 100um pitch for 3D-LADAR was designed for gated optical receiver. The ROIC works at 77K, including unit cell circuit, column-level circuit, timing control, bias circuit and output driver. The unit cell circuit is a key component, which consists of preamplifier, correlated double Sampling (CDS), bias circuit and timing control module. Specially, the preamplifier used the capacitor feedback transimpedance amplifier (CTIA) structure which has two capacitors to offer switchable capacitance for passive/active dual mode imaging. The main circuit of column-level circuit is a precision Multiply-by-Two circuit which is implemented by switched-capacitor circuit. Switched-capacitor circuit is quite suitable for the signal processing of readout integrated circuit (ROIC) due to the working characteristics. The output driver uses a simply unity-gain buffer. Because the signal is amplified in column-level circuit, the amplifier in unity-gain buffer uses a rail-rail amplifier. In active imaging mode, the integration time is 80ns. Integrating current from 200nA to 4uA, this circuit shows the nonlinearity is less than 1%. In passive imaging mode, the integration time is 150ns. Integrating current from 1nA to 20nA shows the nonlinearity less than 1%.

  7. Mixed signal custom integrated circuit development for physics instrumentation

    SciTech Connect

    Britton, C.L. Jr.; Bryan, W.L.; Emery, M.S.

    1998-10-01

    The Monolithic Systems Development Group at the Oak Ridge National Laboratory has been greatly involved in custom mixed-mode integrated circuit development for the PHENIX detector at the Relativistic Heavy Ion collider (RHIC) at Brookhaven National Laboratory and position-sensitive germanium spectrometer front-ends for the Naval Research Laboratory (NRL). This paper will outline the work done for both PHENIX and the Naval Research Laboratory in the area of full-custom, mixed-signal CMOS integrated electronics. This paper presents the architectures chosen for the various PHENIX detectors which include position-sensitive silicon, capacitive pixel, and phototube detectors, and performance results for the subsystems as well as a system description of the NRL germanium strip system and its performance. The performance of the custom preamplifiers, discriminators, analog memories, analog-digital converters, and control circuitry for all systems will be presented.

  8. High-κ Al2O3 material in low temperature wafer-level bonding for 3D integration application

    NASA Astrophysics Data System (ADS)

    Fan, J.; Tu, L. C.; Tan, C. S.

    2014-03-01

    This work systematically investigated a high-κ Al2O3 material for low temperature wafer-level bonding for potential applications in 3D microsystems. A clean Si wafer with an Al2O3 layer thickness of 50 nm was applied as our experimental approach. Bonding was initiated in a clean room ambient after surface activation, followed by annealing under inert ambient conditions at 300 °C for 3 h. The investigation consisted of three parts: a mechanical support study using the four-point bending method, hermeticity measurements using the helium bomb test, and thermal conductivity analysis for potential heterogeneous bonding. Compared with samples bonded using a conventional oxide bonding material (SiO2), a higher interfacial adhesion energy (˜11.93 J/m2) and a lower helium leak rate (˜6.84 × 10-10 atm.cm3/sec) were detected for samples bonded using Al2O3. More importantly, due to the excellent thermal conductivity performance of Al2O3, this technology can be used in heterogeneous direct bonding, which has potential applications for enhancing the performance of Si photonic integrated devices.

  9. Development of optical packet and circuit integrated ring network testbed.

    PubMed

    Furukawa, Hideaki; Harai, Hiroaki; Miyazawa, Takaya; Shinada, Satoshi; Kawasaki, Wataru; Wada, Naoya

    2011-12-12

    We developed novel integrated optical packet and circuit switch-node equipment. Compared with our previous equipment, a polarization-independent 4 × 4 semiconductor optical amplifier switch subsystem, gain-controlled optical amplifiers, and one 100 Gbps optical packet transponder and seven 10 Gbps optical path transponders with 10 Gigabit Ethernet (10GbE) client-interfaces were newly installed in the present system. The switch and amplifiers can provide more stable operation without equipment adjustments for the frequent polarization-rotations and dynamic packet-rate changes of optical packets. We constructed an optical packet and circuit integrated ring network testbed consisting of two switch nodes for accelerating network development, and we demonstrated 66 km fiber transmission and switching operation of multiplexed 14-wavelength 10 Gbps optical paths and 100 Gbps optical packets encapsulating 10GbE frames. Error-free (frame error rate < 1×10(-4)) operation was achieved with optical packets of various packet lengths and packet rates, and stable operation of the network testbed was confirmed. In addition, 4K uncompressed video streaming over OPS links was successfully demonstrated. PMID:22274025

  10. Electronic-photonic integrated circuits on the CMOS platform

    NASA Astrophysics Data System (ADS)

    Kimerling, L. C.; Ahn, D.; Apsel, A. B.; Beals, M.; Carothers, D.; Chen, Y.-K.; Conway, T.; Gill, D. M.; Grove, M.; Hong, C.-Y.; Lipson, M.; Liu, J.; Michel, J.; Pan, D.; Patel, S. S.; Pomerene, A. T.; Rasras, M.; Sparacin, D. K.; Tu, K.-Y.; White, A. E.; Wong, C. W.

    2006-02-01

    The optical components industry stands at the threshold of a major expansion that will restructure its business processes and sustain its profitability for the next three decades. This growth will establish a cost effective platform for the partitioning of electronic and photonic functionality to extend the processing power of integrated circuits. BAE Systems, Lucent Technologies, Massachusetts Institute of Technology, and Applied Wave Research are participating in a high payoff research and development program for the Microsystems Technology Office (MTO) of DARPA. The goal of the program is the development of technologies and design tools necessary to fabricate an application-specific, electronicphotonic integrated circuit (AS-EPIC). As part of the development of this demonstration platform we are exploring selected functions normally associated with the front end of mixed signal receivers such as modulation, detection, and filtering. The chip will be fabricated in the BAE Systems CMOS foundry and at MIT's Microphotonics Center. We will present the latest results on the performance of multi-layer deposited High Index Contrast Waveguides, CMOS compatible modulators and detectors, and optical filter slices. These advances will be discussed in the context of the Communications Technology Roadmap that was recently released by the MIT Microphotonics Center Industry Consortium.

  11. Integrated circuits based on bilayer MoS₂ transistors.

    PubMed

    Wang, Han; Yu, Lili; Lee, Yi-Hsien; Shi, Yumeng; Hsu, Allen; Chin, Matthew L; Li, Lain-Jong; Dubey, Madan; Kong, Jing; Palacios, Tomas

    2012-09-12

    Two-dimensional (2D) materials, such as molybdenum disulfide (MoS(2)), have been shown to exhibit excellent electrical and optical properties. The semiconducting nature of MoS(2) allows it to overcome the shortcomings of zero-bandgap graphene, while still sharing many of graphene's advantages for electronic and optoelectronic applications. Discrete electronic and optoelectronic components, such as field-effect transistors, sensors, and photodetectors made from few-layer MoS(2) show promising performance as potential substitute of Si in conventional electronics and of organic and amorphous Si semiconductors in ubiquitous systems and display applications. An important next step is the fabrication of fully integrated multistage circuits and logic building blocks on MoS(2) to demonstrate its capability for complex digital logic and high-frequency ac applications. This paper demonstrates an inverter, a NAND gate, a static random access memory, and a five-stage ring oscillator based on a direct-coupled transistor logic technology. The circuits comprise between 2 to 12 transistors seamlessly integrated side-by-side on a single sheet of bilayer MoS(2). Both enhancement-mode and depletion-mode transistors were fabricated thanks to the use of gate metals with different work functions. PMID:22862813

  12. Flexible high-performance carbon nanotube integrated circuits.

    PubMed

    Sun, Dong-ming; Timmermans, Marina Y; Tian, Ying; Nasibulin, Albert G; Kauppinen, Esko I; Kishimoto, Shigeru; Mizutani, Takashi; Ohno, Yutaka

    2011-03-01

    Carbon nanotube thin-film transistors are expected to enable the fabrication of high-performance, flexible and transparent devices using relatively simple techniques. However, as-grown nanotube networks usually contain both metallic and semiconducting nanotubes, which leads to a trade-off between charge-carrier mobility (which increases with greater metallic tube content) and on/off ratio (which decreases). Many approaches to separating metallic nanotubes from semiconducting nanotubes have been investigated, but most lead to contamination and shortening of the nanotubes, thus reducing performance. Here, we report the fabrication of high-performance thin-film transistors and integrated circuits on flexible and transparent substrates using floating-catalyst chemical vapour deposition followed by a simple gas-phase filtration and transfer process. The resulting nanotube network has a well-controlled density and a unique morphology, consisting of long (~10 µm) nanotubes connected by low-resistance Y-shaped junctions. The transistors simultaneously demonstrate a mobility of 35 cm(2) V(-1) s(-1) and an on/off ratio of 6 × 10(6). We also demonstrate flexible integrated circuits, including a 21-stage ring oscillator and master-slave delay flip-flops that are capable of sequential logic. Our fabrication procedure should prove to be scalable, for example, by using high-throughput printing techniques. PMID:21297625

  13. Graphene/Si CMOS Hybrid Hall Integrated Circuits

    PubMed Central

    Huang, Le; Xu, Huilong; Zhang, Zhiyong; Chen, Chengying; Jiang, Jianhua; Ma, Xiaomeng; Chen, Bingyan; Li, Zishen; Zhong, Hua; Peng, Lian-Mao

    2014-01-01

    Graphene/silicon CMOS hybrid integrated circuits (ICs) should provide powerful functions which combines the ultra-high carrier mobility of graphene and the sophisticated functions of silicon CMOS ICs. But it is difficult to integrate these two kinds of heterogeneous devices on a single chip. In this work a low temperature process is developed for integrating graphene devices onto silicon CMOS ICs for the first time, and a high performance graphene/CMOS hybrid Hall IC is demonstrated. Signal amplifying/process ICs are manufactured via commercial 0.18 um silicon CMOS technology, and graphene Hall elements (GHEs) are fabricated on top of the passivation layer of the CMOS chip via a low-temperature micro-fabrication process. The sensitivity of the GHE on CMOS chip is further improved by integrating the GHE with the CMOS amplifier on the Si chip. This work not only paves the way to fabricate graphene/Si CMOS Hall ICs with much higher performance than that of conventional Hall ICs, but also provides a general method for scalable integration of graphene devices with silicon CMOS ICs via a low-temperature process. PMID:24998222

  14. Integrated ray tracing simulation of annual variation of spectral bio-signatures from cloud free 3D optical Earth model

    NASA Astrophysics Data System (ADS)

    Ryu, Dongok; Kim, Sug-Whan; Kim, Dae Wook; Lee, Jae-Min; Lee, Hanshin; Park, Won Hyun; Seong, Sehyun; Ham, Sun-Jeong

    2010-09-01

    Understanding the Earth spectral bio-signatures provides an important reference datum for accurate de-convolution of collapsed spectral signals from potential earth-like planets of other star systems. This study presents a new ray tracing computation method including an improved 3D optical earth model constructed with the coastal line and vegetation distribution data from the Global Ecological Zone (GEZ) map. Using non-Lambertian bidirectional scattering distribution function (BSDF) models, the input earth surface model is characterized with three different scattering properties and their annual variations depending on monthly changes in vegetation distribution, sea ice coverage and illumination angle. The input atmosphere model consists of one layer with Rayleigh scattering model from the sea level to 100 km in altitude and its radiative transfer characteristics is computed for four seasons using the SMART codes. The ocean scattering model is a combination of sun-glint scattering and Lambertian scattering models. The land surface scattering is defined with the semi empirical parametric kernel method used for MODIS and POLDER missions. These three component models were integrated into the final Earth model that was then incorporated into the in-house built integrated ray tracing (IRT) model capable of computing both spectral imaging and radiative transfer performance of a hypothetical space instrument as it observes the Earth from its designated orbit. The IRT model simulation inputs include variation in earth orientation, illuminated phases, and seasonal sea ice and vegetation distribution. The trial simulation runs result in the annual variations in phase dependent disk averaged spectra (DAS) and its associated bio-signatures such as NDVI. The full computational details are presented together with the resulting annual variation in DAS and its associated bio-signatures.

  15. Control technology for integrated circuit fabrication at Micro-Circuit Engineering, Incorporated, West Palm Beach, Florida

    NASA Astrophysics Data System (ADS)

    Mihlan, G. I.; Mitchell, R. I.; Smith, R. K.

    1984-07-01

    A survey to assess control technology for integrated circuit fabrication was conducted. Engineering controls included local and general exhaust ventilation, shielding, and personal protective equipment. Devices or work stations that contained toxic materials that were potentially dangerous were controlled by local exhaust ventilation. Less hazardous areas were controlled by general exhaust ventilation. Process isolation was used in the plasma etching, low pressure chemical vapor deposition, and metallization operations. Shielding was used in ion implantation units to control X-ray emissions, in contact mask alignes to limit ultraviolet (UV) emissions, and in plasma etching units to control radiofrequency and UV emissions. Most operations were automated. Use of personal protective equipment varied by job function.

  16. 3D documentation and visualization of external injury findings by integration of simple photography in CT/MRI data sets (IprojeCT).

    PubMed

    Campana, Lorenzo; Breitbeck, Robert; Bauer-Kreuz, Regula; Buck, Ursula

    2016-05-01

    This study evaluated the feasibility of documenting patterned injury using three dimensions and true colour photography without complex 3D surface documentation methods. This method is based on a generated 3D surface model using radiologic slice images (CT) while the colour information is derived from photographs taken with commercially available cameras. The external patterned injuries were documented in 16 cases using digital photography as well as highly precise photogrammetry-supported 3D structured light scanning. The internal findings of these deceased were recorded using CT and MRI. For registration of the internal with the external data, two different types of radiographic markers were used and compared. The 3D surface model generated from CT slice images was linked with the photographs, and thereby digital true-colour 3D models of the patterned injuries could be created (Image projection onto CT/IprojeCT). In addition, these external models were merged with the models of the somatic interior. We demonstrated that 3D documentation and visualization of external injury findings by integration of digital photography in CT/MRI data sets is suitable for the 3D documentation of individual patterned injuries to a body. Nevertheless, this documentation method is not a substitution for photogrammetry and surface scanning, especially when the entire bodily surface is to be recorded in three dimensions including all external findings, and when precise data is required for comparing highly detailed injury features with the injury-inflicting tool. PMID:26496803

  17. 3D Numerical Optimization Modelling of Ivancich landslides (Assisi, Italy) via integration of remote sensing and in situ observations.

    NASA Astrophysics Data System (ADS)

    Castaldo, Raffaele; De Novellis, Vincenzo; Lollino, Piernicola; Manunta, Michele; Tizzani, Pietro

    2015-04-01

    The new challenge that the research in slopes instabilities phenomena is going to tackle is the effective integration and joint exploitation of remote sensing measurements with in situ data and observations to study and understand the sub-surface interactions, the triggering causes, and, in general, the long term behaviour of the investigated landslide phenomenon. In this context, a very promising approach is represented by Finite Element (FE) techniques, which allow us to consider the intrinsic complexity of the mass movement phenomena and to effectively benefit from multi source observations and data. In this context, we perform a three dimensional (3D) numerical model of the Ivancich (Assisi, Central Italy) instability phenomenon. In particular, we apply an inverse FE method based on a Genetic Algorithm optimization procedure, benefitting from advanced DInSAR measurements, retrieved through the full resolution Small Baseline Subset (SBAS) technique, and an inclinometric array distribution. To this purpose we consider the SAR images acquired from descending orbit by the COSMO-SkyMed (CSK) X-band radar constellation, from December 2009 to February 2012. Moreover the optimization input dataset is completed by an array of eleven inclinometer measurements, from 1999 to 2006, distributed along the unstable mass. The landslide body is formed of debris material sliding on a arenaceous marl substratum, with a thin shear band detected using borehole and inclinometric data, at depth ranging from 20 to 60 m. Specifically, we consider the active role of this shear band in the control of the landslide evolution process. A large field monitoring dataset of the landslide process, including at-depth piezometric and geological borehole observations, were available. The integration of these datasets allows us to develop a 3D structural geological model of the considered slope. To investigate the dynamic evolution of a landslide, various physical approaches can be considered

  18. Removal of Gross Air Embolization from Cardiopulmonary Bypass Circuits with Integrated Arterial Line Filters: A Comparison of Circuit Designs.

    PubMed

    Reagor, James A; Holt, David W

    2016-03-01

    Advances in technology, the desire to minimize blood product transfusions, and concerns relating to inflammatory mediators have lead many practitioners and manufacturers to minimize cardiopulmonary bypass (CBP) circuit designs. The oxygenator and arterial line filter (ALF) have been integrated into one device as a method of attaining a reduction in prime volume and surface area. The instructions for use of a currently available oxygenator with integrated ALF recommends incorporating a recirculation line distal to the oxygenator. However, according to an unscientific survey, 70% of respondents utilize CPB circuits incorporating integrated ALFs without a path of recirculation distal to the oxygenator outlet. Considering this circuit design, the ability to quickly remove a gross air bolus in the blood path distal to the oxygenator may be compromised. This in vitro study was designed to determine if the time required to remove a gross air bolus from a CPB circuit without a path of recirculation distal to the oxygenator will be significantly longer than that of a circuit with a path of recirculation distal to the oxygenator. A significant difference was found in the mean time required to remove a gross air bolus between the circuit designs (p = .0003). Additionally, There was found to be a statistically significant difference in the mean time required to remove a gross air bolus between Trial 1 and Trials 4 (p = .015) and 5 (p =.014) irrespective of the circuit design. Under the parameters of this study, a recirculation line distal to an oxygenator with an integrated ALF significantly decreases the time it takes to remove an air bolus from the CPB circuit and may be safer for clinical use than the same circuit without a recirculation line. PMID:27134304

  19. Long-wavelength photonic integrated circuits and avalanche photodetectors

    NASA Astrophysics Data System (ADS)

    Tsou, Yi-Jen D.; Zaytsev, Sergey; Pauchard, Alexandre; Hummel, Steve; Lo, Yu-Hwa

    2001-10-01

    Fast-growing internet traffic volume require high data communication bandwidth over longer distances. Access network bottlenecks put pressure on short-range (SR) telecommunication systems. To effectively address these datacom and telecom market needs, low-cost, high-speed laser modules at 1310 to 1550 nm wavelengths and avalanche photodetectors are required. The great success of GaAs 850nm VCSEls for Gb/s Ethernet has motivated efforts to extend VCSEL technology to longer wavelengths in the 1310 and 1550 nm regimes. However, the technological challenges associated with materials for long wavelength VCSELs are tremendous. Even with recent advances in this area, it is believed that significant additional development is necessary before long wavelength VCSELs that meet commercial specifications will be widely available. In addition, the more stringent OC192 and OC768 specifications for single-mode fiber (SMF) datacom may require more than just a long wavelength laser diode, VCSEL or not, to address numerous cost and performance issues. We believe that photonic integrated circuits (PICs), which compactly integrate surface-emitting lasers with additional active and passive optical components with extended functionality, will provide the best solutions to today's problems. Photonic integrated circuits have been investigated for more than a decade. However, they have produced limited commercial impact to date primarily because the highly complicated fabrication processes produce significant yield and device performance issues. In this presentation, we will discuss a new technology platform of InP-based PICs compatible with surface-emitting laser technology, as well as a high data rate externally modulated laser module. Avalanche photodetectors (APDs) are the key component in the receiver to achieve high data rate over long transmission distance because of their high sensitivity and large gain- bandwidth product. We have used wafer fusion technology to achieve In

  20. Controlling Shear Stress in 3D Bioprinting is a Key Factor to Balance Printing Resolution and Stem Cell Integrity.

    PubMed

    Blaeser, Andreas; Duarte Campos, Daniela Filipa; Puster, Uta; Richtering, Walter; Stevens, Molly M; Fischer, Horst

    2016-02-01

    A microvalve-based bioprinting system for the manufacturing of high-resolution, multimaterial 3D-structures is reported. Applying a straightforward fluid-dynamics model, the shear stress at the nozzle site can precisely be controlled. Using this system, a broad study on how cell viability and proliferation potential are affected by different levels of shear stress is conducted. Complex, multimaterial 3D structures are printed with high resolution. This work pioneers the investigation of shear stress-induced cell damage in 3D bioprinting and might help to comprehend and improve the outcome of cell-printing studies in the future. PMID:26626828

  1. Digital pixel readout integrated circuit architectures for LWIR

    NASA Astrophysics Data System (ADS)

    Shafique, Atia; Yazici, Melik; Kayahan, Huseyin; Ceylan, Omer; Gurbuz, Yasar

    2015-06-01

    This paper presents and discusses digital pixel readout integrated circuit architectures for long wavelength infrared (LWIR) in CMOS technology. Presented architectures are designed for scanning and staring arrays type detectors respectively. For scanning arrays, digital time delay integration (TDI) is implemented on 8 pixels with sampling rate up to 3 using CMOS 180nm technology. Input referred noise of ROIC is below 750 rms electron meanwhile power dissipation is appreciably under 30mW. ROIC design is optimized to perform at room as well as cryogenic temperatures. For staring type arrays, a digital pixel architecture relying on coarse quantization with pulse frequency modulation (PFM) and novel approach of extended integration is presented. It can achieve extreme charge handling capacity of 2.04Ge- with 20 bit output resolution and power dissipation below 350 nW in CMOS 90nm technology. Efficient mechanism of measuring the time to estimate the remaining charge on integration capacitor in order to achieve low SNR has employed.

  2. Investigation of failure mechanisms in integrated vacuum circuits

    NASA Technical Reports Server (NTRS)

    Rosengreen, A.

    1972-01-01

    The fabrication techniques of integrated vacuum circuits are described in detail. Data obtained from a specially designed test circuit are presented. The data show that the emission observed in reverse biased devices is due to cross-talk between the devices and can be eliminated by electrostatic shielding. The lifetime of the cathodes has been improved by proper activation techniques. None of the cathodes on life test has shown any sign of failure after more than 3500 hours. Life tests of triodes show a decline of anode current by a factor of two to three after a few days. The current recovers when the large positive anode voltage (100 V) has been removed for a few hours. It is suggested that this is due to trapped charges in the sapphire substrate. Evidence of the presence of such charges is given, and a model of the charge distribution is presented consistent with the measurements. Solution of the problem associated with the decay of triode current may require proper treatment of the sapphire surface and/or changes in the deposition technique of the thin metal films.

  3. Minimizing the area required for time constants in integrated circuits

    NASA Technical Reports Server (NTRS)

    Lyons, J. C.

    1972-01-01

    When a medium- or large-scale integrated circuit is designed, efforts are usually made to avoid the use of resistor-capacitor time constant generators. The capacitor needed for this circuit usually takes up more surface area on the chip than several resistors and transistors. When the use of this network is unavoidable, the designer usually makes an effort to see that the choice of resistor and capacitor combinations is such that a minimum amount of surface area is consumed. The optimum ratio of resistance to capacitance that will result in this minimum area is equal to the ratio of resistance to capacitance which may be obtained from a unit of surface area for the particular process being used. The minimum area required is a function of the square root of the reciprocal of the products of the resistance and capacitance per unit area. This minimum occurs when the area required by the resistor is equal to the area required by the capacitor.

  4. Single event soft error in advanced integrated circuit

    NASA Astrophysics Data System (ADS)

    Yuanfu, Zhao; Suge, Yue; Xinyuan, Zhao; Shijin, Lu; Qiang, Bian; Liang, Wang; Yongshu, Sun

    2015-11-01

    As technology feature size decreases, single event upset (SEU), and single event transient (SET) dominate the radiation response of microcircuits. Multiple bit upset (MBU) (or multi cell upset) effects, digital single event transient (DSET) and analogue single event transient (ASET) cause serious problems for advanced integrated circuits (ICs) applied in a radiation environment and have become a pressing issue. To face this challenge, a lot of work has been put into the single event soft error mechanism and mitigation schemes. This paper presents a review of SEU and SET, including: a brief historical overview, which summarizes the historical development of the SEU and SET since their first observation in the 1970's; effects prominent in advanced technology, which reviews the effects such as MBU, MSET as well as SET broadening and quenching with the influence of temperature, device structure etc.; the present understanding of single event soft error mechanisms, which review the basic mechanism of single event generation including various component of charge collection; and a discussion of various SEU and SET mitigation schemes divided as circuit hardening and layout hardening that could help the designer meet his goals.

  5. Advanced polymer systems for optoelectronic integrated circuit applications

    NASA Astrophysics Data System (ADS)

    Eldada, Louay A.; Stengel, Kelly M. T.; Shacklette, Lawrence W.; Norwood, Robert A.; Xu, Chengzeng; Wu, Chengjiu; Yardley, James T.

    1997-01-01

    An advanced versatile low-cost polymeric waveguide technology is proposed for optoelectronic integrated circuit applications. We have developed high-performance organic polymeric materials that can be readily made into both multimode and single-mode optical waveguide structures of controlled numerical aperture (NA) and geometry. These materials are formed from highly crosslinked acrylate monomers with specific linkages that determine properties such as flexibility, toughness, loss, and stability against yellowing and humidity. These monomers are intermiscible, providing for precise adjustment of the refractive index from 1.30 to 1.60. Waveguides are formed photolithographically, with the liquid monomer mixture polymerizing upon illumination in the UV via either mask exposure or laser direct-writing. A wide range of rigid and flexible substrates can be used, including glass, quartz, oxidized silicon, glass-filled epoxy printed circuit board substrate, and flexible polyimide film. We discuss the use of these materials on chips and on multi-chip modules (MCMs), specifically in transceivers where we adaptively produced waveguides on vertical-cavity surface-emitting lasers (VCSELs) embedded in transmitter MCMs and on high- speed photodetector chips in receiver MCMs. Light coupling from and to chips is achieved by cutting 45 degree mirrors using excimer laser ablation. The fabrication of our polymeric structures directly on the modules provides for stability, ruggedness, and hermeticity in packaging.

  6. Basic structures of integrated photonic circuits for smart biosensor applications

    NASA Astrophysics Data System (ADS)

    Germer, S.; Cherkouk, C.; Rebohle, L.; Helm, M.; Skorupa, W.

    2013-05-01

    The breadth of opportunities for applied technologies for optical sensors ranges from environmental and biochemical control, medical diagnostics to process regulation. Thus the specified usage of the optical sensor system requires a particular design and functionalization. Especially biochemical sensors incorporate electronic and photonic devices for the detection of harmful substances e.g. in drinking water. Here we present recent developments in the integration of a Si-based light emitting device (LED) [1-3, 8] into a photonic circuit for an optical waveguide-based biodetection system. This concept includes the design, fabrication and characterization of the dielectric high contrast waveguide as an important component, beside the LED, in the photonic system circuit. First approaches involve simulations of Si3N4/SiO2-waveguides with the finite element method (FEM) and their fabrication by plasma enhanced chemical vapour deposition (PECVD), optical lithography and reactive ion etching (RIE). In addition, we characterized the deposited layers via ellipsometry and the etched structures by scanning electron microscopy (SEM). The obtained results establish a basis for optimized Si-based LED waveguide butt-coupling with adequate coupling efficiency, low attenuation loss and a high optical power throughput.

  7. Gabor-domain optical coherence microscopy with integrated dual-axis MEMS scanner for fast 3D imaging and metrology

    NASA Astrophysics Data System (ADS)

    Canavesi, Cristina; Cogliati, Andrea; Hayes, Adam; Santhanam, Anand P.; Tankam, Patrice; Rolland, Jannick P.

    2015-10-01

    Fast, robust, nondestructive 3D imaging is needed for characterization of microscopic structures in industrial and clinical applications. A custom micro-electromechanical system (MEMS)-based 2D scanner system was developed to achieve 55 kHz A-scan acquisition in a Gabor-domain optical coherence microscopy (GD-OCM) instrument with a novel multilevel GPU architecture for high-speed imaging. GD-OCM yields high-definition volumetric imaging with dynamic depth of focusing through a bio-inspired liquid lens-based microscope design, which has no moving parts and is suitable for use in a manufacturing setting or in a medical environment. A dual-axis MEMS mirror was chosen to replace two single-axis galvanometer mirrors; as a result, the astigmatism caused by the mismatch between the optical pupil and the scanning location was eliminated and a 12x reduction in volume of the scanning system was achieved. Imaging at an invariant resolution of 2 μm was demonstrated throughout a volume of 1 × 1 × 0.6 mm3, acquired in less than 2 minutes. The MEMS-based scanner resulted in improved image quality, increased robustness and lighter weight of the system - all factors that are critical for on-field deployment. A custom integrated feedback system consisting of a laser diode and a position-sensing detector was developed to investigate the impact of the resonant frequency of the MEMS and the driving signal of the scanner on the movement of the mirror. Results on the metrology of manufactured materials and characterization of tissue samples with GD-OCM are presented.

  8. 3D Technology for intelligent trackers

    SciTech Connect

    Lipton, Ronald; /Fermilab

    2010-09-01

    At Super-LHC luminosity it is expected that the standard suite of level 1 triggers for CMS will saturate. Information from the tracker will be needed to reduce trigger rates to satisfy the level 1 bandwidth. Tracking trigger modules which correlate information from closely-spaced sensor layers to form an on-detector momentum filter are being developed by several groups. We report on a trigger module design which utilizes three dimensional integrated circuit technology incorporating chips which are connected both to the top and bottom sensor, providing the ability to filter information locally. A demonstration chip, the VICTR, has been submitted to the Chartered/Tezzaron two-tier 3D run coordinated by Fermilab. We report on the 3D design concept, the status of the VICTR chip and associated sensor integration utilizing oxide bonding.

  9. Integrated circuit for processing a low-frequency signal from a seismic detector

    SciTech Connect

    Malashevich, N. I.; Roslyakov, A. S.; Polomoshnov, S. A. Fedorov, R. A.

    2011-12-15

    Specific features for the detection and processing of a low-frequency signal from a seismic detector are considered in terms of an integrated circuit based on a large matrix crystal of the 5507 series. This integrated circuit is designed for the detection of human movements. The specific features of the information signal, obtained at the output of the seismic detector, and the main characteristics of the integrated circuit and its structure are reported.

  10. Wireless Neural Recording With Single Low-Power Integrated Circuit

    PubMed Central

    Harrison, Reid R.; Kier, Ryan J.; Chestek, Cynthia A.; Gilja, Vikash; Nuyujukian, Paul; Ryu, Stephen; Greger, Bradley; Solzbacher, Florian; Shenoy, Krishna V.

    2010-01-01

    We present benchtop and in vivo experimental results from an integrated circuit designed for wireless implantable neural recording applications. The chip, which was fabricated in a commercially available 0.6-μm 2P3M BiCMOS process, contains 100 amplifiers, a 10-bit analog-to-digital converter (ADC), 100 threshold-based spike detectors, and a 902–928 MHz frequency-shift-keying (FSK) transmitter. Neural signals from a selected amplifier are sampled by the ADC at 15.7 kSps and telemetered over the FSK wireless data link. Power, clock, and command signals are sent to the chip wirelessly over a 2.765-MHz inductive (coil-to-coil) link. The chip is capable of operating with only two off-chip components: a power/command receiving coil and a 100-nF capacitor. PMID:19497825

  11. Plasmonic nanopatch array for optical integrated circuit applications.

    PubMed

    Qu, Shi-Wei; Nie, Zai-Ping

    2013-01-01

    Future plasmonic integrated circuits with the capability of extremely high-speed data processing at optical frequencies will be dominated by the efficient optical emission (excitation) from (of) plasmonic waveguides. Towards this goal, plasmonic nanoantennas, currently a hot topic in the field of plasmonics, have potential to bridge the mismatch between the wave vector of free-space photonics and that of the guided plasmonics. To manipulate light at will, plasmonic nanoantenna arrays will definitely be more efficient than isolated nanoantennas. In this article, the concepts of microwave antenna arrays are applied to efficiently convert plasmonic waves in the plasmonic waveguides into free-space optical waves or vice versa. The proposed plasmonic nanoantenna array, with nanopatch antennas and a coupled wedge plasmon waveguide, can also act as an efficient spectrometer to project different wavelengths into different directions, or as a spatial filter to absorb a specific wavelength at a specified incident angle. PMID:24201454

  12. Uncertain behaviours of integrated circuits improve computational performance.

    PubMed

    Yoshimura, Chihiro; Yamaoka, Masanao; Hayashi, Masato; Okuyama, Takuya; Aoki, Hidetaka; Kawarabayashi, Ken-ichi; Mizuno, Hiroyuki

    2015-01-01

    Improvements to the performance of conventional computers have mainly been achieved through semiconductor scaling; however, scaling is reaching its limitations. Natural phenomena, such as quantum superposition and stochastic resonance, have been introduced into new computing paradigms to improve performance beyond these limitations. Here, we explain that the uncertain behaviours of devices due to semiconductor scaling can improve the performance of computers. We prototyped an integrated circuit by performing a ground-state search of the Ising model. The bit errors of memory cell devices holding the current state of search occur probabilistically by inserting fluctuations into dynamic device characteristics, which will be actualised in the future to the chip. As a result, we observed more improvements in solution accuracy than that without fluctuations. Although the uncertain behaviours of devices had been intended to be eliminated in conventional devices, we demonstrate that uncertain behaviours has become the key to improving computational performance. PMID:26586362

  13. Apparatus and method for defect testing of integrated circuits

    DOEpatents

    Cole, Jr., Edward I.; Soden, Jerry M.

    2000-01-01

    An apparatus and method for defect and failure-mechanism testing of integrated circuits (ICs) is disclosed. The apparatus provides an operating voltage, V.sub.DD, to an IC under test and measures a transient voltage component, V.sub.DDT, signal that is produced in response to switching transients that occur as test vectors are provided as inputs to the IC. The amplitude or time delay of the V.sub.DDT signal can be used to distinguish between defective and defect-free (i.e. known good) ICs. The V.sub.DDT signal is measured with a transient digitizer, a digital oscilloscope, or with an IC tester that is also used to input the test vectors to the IC. The present invention has applications for IC process development, for the testing of ICs during manufacture, and for qualifying ICs for reliability.

  14. Apparatus and method for defect testing of integrated circuits

    SciTech Connect

    Cole, E.I. Jr.; Soden, J.M.

    2000-02-29

    An apparatus and method for defect and failure-mechanism testing of integrated circuits (ICs) is disclosed. The apparatus provides an operating voltage, V(DD), to an IC under test and measures a transient voltage component, V(DDT), signal that is produced in response to switching transients that occur as test vectors are provided as inputs to the IC. The amplitude or time delay of the V(DDT) signal can be used to distinguish between defective and defect-free (i.e. known good) ICs. The V(DDT) signal is measured with a transient digitizer, a digital oscilloscope, or with an IC tester that is also used to input the test vectors to the IC. The present invention has applications for IC process development, for the testing of ICs during manufacture, and for qualifying ICs for reliability.

  15. Uncertain behaviours of integrated circuits improve computational performance

    PubMed Central

    Yoshimura, Chihiro; Yamaoka, Masanao; Hayashi, Masato; Okuyama, Takuya; Aoki, Hidetaka; Kawarabayashi, Ken-ichi; Mizuno, Hiroyuki

    2015-01-01

    Improvements to the performance of conventional computers have mainly been achieved through semiconductor scaling; however, scaling is reaching its limitations. Natural phenomena, such as quantum superposition and stochastic resonance, have been introduced into new computing paradigms to improve performance beyond these limitations. Here, we explain that the uncertain behaviours of devices due to semiconductor scaling can improve the performance of computers. We prototyped an integrated circuit by performing a ground-state search of the Ising model. The bit errors of memory cell devices holding the current state of search occur probabilistically by inserting fluctuations into dynamic device characteristics, which will be actualised in the future to the chip. As a result, we observed more improvements in solution accuracy than that without fluctuations. Although the uncertain behaviours of devices had been intended to be eliminated in conventional devices, we demonstrate that uncertain behaviours has become the key to improving computational performance. PMID:26586362

  16. Infrared transparent graphene heater for silicon photonic integrated circuits.

    PubMed

    Schall, Daniel; Mohsin, Muhammad; Sagade, Abhay A; Otto, Martin; Chmielak, Bartos; Suckow, Stephan; Giesecke, Anna Lena; Neumaier, Daniel; Kurz, Heinrich

    2016-04-18

    Thermo-optical tuning of the refractive index is one of the pivotal operations performed in integrated silicon photonic circuits for thermal stabilization, compensation of fabrication tolerances, and implementation of photonic operations. Currently, heaters based on metal wires provide the temperature control in the silicon waveguide. The strong interaction of metal and light, however, necessitates a certain gap between the heater and the photonic structure to avoid significant transmission loss. Here we present a graphene heater that overcomes this constraint and enables an energy efficient tuning of the refractive index. We achieve a tuning power as low as 22 mW per free spectral range and fast response time of 3 µs, outperforming metal based waveguide heaters. Simulations support the experimental results and suggest that for graphene heaters the spacing to the silicon can be further reduced yielding the best possible energy efficiency and operation speed. PMID:27137229

  17. Design and testing of integrated circuits for reactor protection channels

    SciTech Connect

    Battle, R.E.; Vandermolen, R.I.; Jagadish, U.; Swail, B.K.; Naser, J.; Rana, I.

    1995-06-01

    Custom and semicustom application-specific integrated circuit design and testing methods are investigated for use in research and commercial nuclear reactor safety systems. The Electric Power Research Institute and Oak Ridge National Laboratory are working together through a cooperative research and development agreement to apply modern technology to a nuclear reactor protection system. Purpose of this project is to demonstrate to the nuclear industry an alternative approach for new or upgrade reactor protection and safety system signal processing and voting logic. Motivation for this project stems from (1) the difficulty of proving that software-based protection systems are adequately reliable, (2) the obsolescence of the original equipment, and (3) the improved performance of digital processing.

  18. Plasmonic nanopatch array for optical integrated circuit applications

    PubMed Central

    Qu, Shi-Wei; Nie, Zai-Ping

    2013-01-01

    Future plasmonic integrated circuits with the capability of extremely high-speed data processing at optical frequencies will be dominated by the efficient optical emission (excitation) from (of) plasmonic waveguides. Towards this goal, plasmonic nanoantennas, currently a hot topic in the field of plasmonics, have potential to bridge the mismatch between the wave vector of free-space photonics and that of the guided plasmonics. To manipulate light at will, plasmonic nanoantenna arrays will definitely be more efficient than isolated nanoantennas. In this article, the concepts of microwave antenna arrays are applied to efficiently convert plasmonic waves in the plasmonic waveguides into free-space optical waves or vice versa. The proposed plasmonic nanoantenna array, with nanopatch antennas and a coupled wedge plasmon waveguide, can also act as an efficient spectrometer to project different wavelengths into different directions, or as a spatial filter to absorb a specific wavelength at a specified incident angle. PMID:24201454

  19. Monolithic microwave integrated circuit devices for active array antennas

    NASA Technical Reports Server (NTRS)

    Mittra, R.

    1984-01-01

    Two different aspects of active antenna array design were investigated. The transition between monolithic microwave integrated circuits and rectangular waveguides was studied along with crosstalk in multiconductor transmission lines. The boundary value problem associated with a discontinuity in a microstrip line is formulated. This entailed, as a first step, the derivation of the propagating as well as evanescent modes of a microstrip line. The solution is derived to a simple discontinuity problem: change in width of the center strip. As for the multiconductor transmission line problem. A computer algorithm was developed for computing the crosstalk noise from the signal to the sense lines. The computation is based on the assumption that these lines are terminated in passive loads.

  20. Development of a plan for automating integrated circuit processing

    NASA Technical Reports Server (NTRS)

    1971-01-01

    The operations analysis and equipment evaluations pertinent to the design of an automated production facility capable of manufacturing beam-lead CMOS integrated circuits are reported. The overall plan shows approximate cost of major equipment, production rate and performance capability, flexibility, and special maintenance requirements. Direct computer control is compared with supervisory-mode operations. The plan is limited to wafer processing operations from the starting wafer to the finished beam-lead die after separation etching. The work already accomplished in implementing various automation schemes, and the type of equipment which can be found for instant automation are described. The plan is general, so that small shops or large production units can perhaps benefit. Examples of major types of automated processing machines are shown to illustrate the general concepts of automated wafer processing.