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Sample records for a-plane gan layers

  1. Improved emission efficiency of a-plane GaN light emitting diodes with silica nano-spheres integrated into a-plane GaN buffer layer

    NASA Astrophysics Data System (ADS)

    Park, S. H.; Park, J.; You, D.-J.; Joo, K.; Moon, D.; Jang, J.; Kim, D.-U.; Chang, H.; Moon, S.; Song, Y.-K.; Lee, G.-D.; Jeon, H.; Xu, J.; Nanishi, Y.; Yoon, E.

    2012-05-01

    A simple and inexpensive technique to improve the emission efficiency of nonpolar a-plane light emitting diodes (LEDs) is proposed. The 3-dimensional growth nature of a-plane GaN was utilized to form the regrowth template of a-plane GaN. Subsequently, the controlled integration of silica nano-spheres (CIS) into the regrowth template is performed to improve the crystal quality of a-plane GaN by epitaxial lateral overgrowth method. In addition, the CIS improves light extraction by the scattering process. The light output power from the CIS a-plane GaN LEDs showed 130%-150% increase compared to that of LED without silica nano-spheres.

  2. Effects of Nano- and Microscale SiO2 Masks on the Growth of a-Plane GaN Layers on r-Plane Sapphire

    NASA Astrophysics Data System (ADS)

    Son, Ji-Su; Miao, Cao; Honda, Yoshio; Yamaguchi, Masahito; Amano, Hiroshi; Seo, Yong Gon; Hwang, Sung-Min; Baik, Kwang Hyeon

    2013-08-01

    We report on the combined effects of a-plane GaN layers on a nanoscale patterned insulator on an r-plane sapphire substrate and epitaxial lateral overgrowth (ELOG) techniques. The fully coalescent a-plane GaN layer using nano- and microscale SiO2 masks showed the formation of nano- and microscale voids on the masks, respectively. Atomic force microscopy (AFM) measurements revealed a surface roughness of 0.63 nm and a submicron pit density of ˜7.8 ×107 cm-2. Photoluminescence (PL) intensity was enhanced by a factor of 9.0 in comparison with that of a planar sample. Omega full-width at half-maximum (FWHM) values of the (11bar 20) X-ray rocking curve along the c- and m-axes were 553 and 788 arcsec, respectively. A plan-view cathodoluminescence (CL) mapping image showed high luminescence intensity on the SiO2 masks.

  3. Direct Growth of a-Plane GaN on r-Plane Sapphire Substrate by Metalorganic Vapor Phase Epitaxy

    NASA Astrophysics Data System (ADS)

    Araki, Masahiro; Mochimizo, Noriaki; Hoshino, Katsuyuki; Tadatomo, Kazuyuki

    2007-02-01

    We have investigated the direct growth of nonpolar a-plane GaN layers on an r-plane sapphire substrate by metalorganic vapor-phase epitaxy (MOVPE). A high-density nucleation of GaN islands was obtained on the r-plane sapphire substrate at the initial stage of the high-temperature growth without a buffer layer, which resulted in a two-dimensional (2D) growth mode. We studied the effects of V/III ratio growth conditions on the surface morphology and growth features of an a-plane GaN layer. The results showed that a high density of pits with an inverse-pyramidal shape were formed at a high V/III ratio, whereas a relatively low density of pits were formed at a low V/III ratio due to the increase in the rate of lateral growth along the c-axis direction. We successfully grew a-plane GaN layers with a flat and pit-free surface using the “two-step growth method”. The method consisted of growing a first layer at a high V/III ratio and growing a second layer at a low V/III ratio. We found that the first layer plays an important role in GaN layer growth. The formation of a void-free GaN layer with sidewall facets in the first step leads to a flat and pit-free layer grown at a high rate of lateral growth along the c-axis direction in the second step.

  4. Direct Growth of a-Plane GaN on r-Plane Sapphire by Metal Organic Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Hsu, Hsiao-Chiu; Su, Yan-Kuin; Huang, Shyh-Jer; Wang, Yu-Jen; Wu, Chun-Ying; Chou, Ming-Chieh

    2010-04-01

    In this study, we had demonstrated the direct growth of nonpolar a-plane GaN on an r-plane sapphire by metal organic chemical vapor deposition (MOCVD) without any buffer layer. First, in this experiment, we had determined the optimum temperature for two-step growth, including obtaining three-dimensional (3D) GaN islands in the nucleation layer and coalescing with a further two-dimensional (2D) growth mode. The result shows that the nucleation layer grown under high temperature (1150 °C) leads to large islands with few grain boundaries. Under the same temperature, the effect of the V/III ratio on the growth of the overlaying GaN layer to obtain a flat and void free a-plane GaN layer is also studied. The result indicates one can directly grow a smooth epitaxial layer on an r-plane sapphire by changing the V/III ratio. The rms roughness decreases from 13.61 to 2.02 nm. The GaN crystal quality is verified using a mixed acid to etch the film surface. The etch pit density (EPD) is 3.16 ×107 cm-2.

  5. Unintentional doping of a-plane GaN by insertion of in situ SiN masks

    NASA Astrophysics Data System (ADS)

    Witte, H.; Wieneke, M.; Rohrbeck, A.; Guenther, K.-M.; Dadgar, A.; Krost, A.

    2011-03-01

    Undoped a-plane GaN layers grown by metal-organic vapour phase epitaxy on sapphire (1 0 - 1 2) substrates using low temperature (LT) GaN seed layers and in situ SiN masks were characterized by Hall-effect measurements, CV-characteristics and photovoltage spectroscopy. With increasing deposition time of the SiN masks the electron concentrations of the GaN layers are enhanced. The dominant activation energy between 14 and 22 meV determined by temperature-dependent Hall effect is very similar to the donor silicon on gallium site. Two other activation energies at 30 meV and between 50 and 70 meV were found corresponding well with OGa and VN defects, respectively. The depth profiles of the net donor densities show a strong increase towards the substrate/LT-GaN/high temperature(HT)-GaN interface indicating diffusion of silicon from the SiN mask towards the surface. Therefore, the Si doping is attributed to the dissolution of the SiN masks during the following HT GaN layer growth. The Si doping from the SiN masks also explains the deterioration of the band bending within the LT-GaN/HT-GaN junction found by photovoltage spectroscopy.

  6. Study on the relationships between Raman shifts and temperature range for a-plane GaN using temperature-dependent Raman scattering

    NASA Astrophysics Data System (ADS)

    Wang, Dang-Hui; Xu, Sheng-Rui; Hao, Yue; Zhang, Jin-Cheng; Xu, Tian-Han; Lin, Zhi-Yu; Zhou, Hao; Xue, Xiao-Yong

    2013-02-01

    In this paper, Raman shifts of a-plane GaN layers grown on r-plane sapphire substrates by low-pressure metal—organic chemical vapor deposition (LPMOCVD) are investigated. We compare the crystal qualities and study the relationships between Raman shift and temperature for conventional a-plane GaN epilayer and insertion AlN/AlGaN superlattice layers for a-plane GaN epilayer using temperature-dependent Raman scattering in a temperature range from 83 K to 503 K. The temperature-dependences of GaN phonon modes (A1 (TO), E2 (high), and E1 (TO)) and the linewidths of E2 (high) phonon peak are studied. The results indicate that there exist two mechanisms between phonon peaks in the whole temperature range, and the relationship can be fitted to the pseudo-Voigt function. From analytic results we find a critical temperature existing in the relationship, which can characterize the anharmonic effects of a-plane GaN in different temperature ranges. In the range of higher temperature, the relationship exhibits an approximately linear behavior, which is consistent with the analyzed results theoretically.

  7. A-plane GaN growth on (11-20) 4H-SiC substrate with an ultrathin interlayer

    NASA Astrophysics Data System (ADS)

    Sun, Zheng; Song, Peifeng; Nitta, Shugo; Honda, Yoshio; Amano, Hiroshi

    2017-06-01

    A-plane GaN was attempted to be grown on (11-20) 4H-SiC bulk substrate without using a traditional thick buffer layer. By inducing TMAl treatment before the GaN growth step and using both a low pressure and V/III ratio, the interlayer thickness of the a-plane GaN/SiC was reduced to 1.7+0.5 nm. The ultrathin interlayer was observed to be either AlN or AlGaN with a low Ga composition. This study is aimed to contribute to the understanding of GaN growth on the sidewalls of c-plane trench structure SiC. The ultrathin growth technique is also hoped to be applied to the fabrication of GaN-based vertical structure nonpolar optical or electrical devices.

  8. Structural anisotropic properties of a-plane GaN epilayers grown on r-plane sapphire by molecular beam epitaxy

    SciTech Connect

    Lotsari, A.; Kehagias, Th.; Katsikini, M.; Arvanitidis, J.; Ves, S.; Komninou, Ph.; Dimitrakopulos, G. P.; Tsiakatouras, G.; Tsagaraki, K.; Georgakilas, A.; Christofilos, D.

    2014-06-07

    Heteroepitaxial non-polar III-Nitride layers may exhibit extensive anisotropy in the surface morphology and the epilayer microstructure along distinct in-plane directions. The structural anisotropy, evidenced by the “M”-shape dependence of the (112{sup ¯}0) x-ray rocking curve widths on the beam azimuth angle, was studied by combining transmission electron microscopy observations, Raman spectroscopy, high resolution x-ray diffraction, and atomic force microscopy in a-plane GaN epilayers grown on r-plane sapphire substrates by plasma-assisted molecular beam epitaxy (PAMBE). The structural anisotropic behavior was attributed quantitatively to the high dislocation densities, particularly the Frank-Shockley partial dislocations that delimit the I{sub 1} intrinsic basal stacking faults, and to the concomitant plastic strain relaxation. On the other hand, isotropic samples exhibited lower dislocation densities and a biaxial residual stress state. For PAMBE growth, the anisotropy was correlated to N-rich (or Ga-poor) conditions on the surface during growth, that result in formation of asymmetric a-plane GaN grains elongated along the c-axis. Such conditions enhance the anisotropy of gallium diffusion on the surface and reduce the GaN nucleation rate.

  9. Defect reduction in (112_O) a-plane GaN by two-stage epitaxiallateral overgrowth

    SciTech Connect

    Ni, X.; Ozgur, U.; Fu, Y.; Biyikli, N.; Xie, J.; Baski, A.A.; Morkoc, H.; Liliental-Weber, Z.

    2006-10-20

    In the epitaxial lateral overgrowth (ELO) of (11{bar 2}0) a-plane GaN, the uneven growth rates of two opposing wings, Ga- and N-wings, makes the coalescence of two neighboring wings more difficult than that in c-plane GaN. We report a two-stage growth method to get uniformly coalesced epitaxial lateral overgrown a-plane GaN using metalorganic chemical vapor deposition (MOCVD) by employing relatively lower growth temperature in the first step followed by enhanced lateral growth in the second. Using this method, the height differences between Ga-polar and N-polar wings at the coalescence front could be reduced, thereby making the coalescence of two wings much easier. Transmission electron microscopy (TEM) showed that the threading dislocation density in the wing areas was 1.0x10{sup 8}cm{sup -2}, more than two orders of magnitude lower than that in the window areas (4.2x10{sup 10}cm{sup -2}). However, high density of basal stacking faults of 1.2x104 cm-1 was still observed in the wing areas as compared to c-plane GaN. Atomic force microscopy and photoluminescence measurements on the coalesced ELO a-GaN sample also indicated improved material quality.

  10. Current mapping of nonpolar a-plane and polar c-plane GaN films by conductive atomic force microscopy

    NASA Astrophysics Data System (ADS)

    Xu, Shengrui; Jiang, Teng; Lin, Zhiyu; Zhao, Ying; Yang, Linan; Zhang, Jincheng; Li, Peixian; Hao, Yue

    2016-10-01

    Nonpolar (11-20) a-plane GaN and polar (0001) c-plane GaN films have been grown by metal organic chemical vapor deposition on r-plane (1-102) and c-plane (0001) sapphire substrates, respectively. Conductive atomic force microscopy (C-AFM) has been used to investigate the local conductivity of the films. C-AFM shows enhanced current conduction within the etch pits of c-plane GaN and triangular pits of a-plane GaN. The results indicate that the off-axis planes are more electrically active than c-plane and a-plane. Surprisingly, the C-AFM values in triangular pit of the a-plane GaN are much smaller than that in etch pits of the c-plane GaN. The dislocations type related current leakage mechanism is revealed for polar c-plane and nonpolar a-plane GaN films.

  11. Polarization ratio enhancement of a-plane GaN light emitting diodes by asymmetric two-dimensional photonic crystals

    SciTech Connect

    Chou, Yen; Li, Hsiang-Wei; Yin, Yu-Feng; Wang, Yu-Ting; Lin, Yen-Chen; Wu, Yuh-Renn; Huang, Jian Jang; Lin, Da-Wei; Kuo, Hao-Chung

    2014-05-21

    Fabricating photonic crystals (PhCs) on GaN based non-polar light emitting diodes (LEDs) is an effective way to increase light extraction and meanwhile to preserve or improve polarization ratio. In this work, a-plane GaN LEDs with two-dimensional PhCs were demonstrated. With the E // m polarized modes (which mean the optical polarization with the electric field parallel to m-axis) as the target of diffraction, we matched E//m modes to the photonic bands and aligned E//c modes to fall within the photonic band gap. The results show stronger E//m but weaker E//c mode diffractions on both c- and m-axes. At the vertical direction, the polarization ratio is enhanced from 45.8% for the planar device to 52.3% for the LEDs with PhCs.

  12. Dispersal of motile bacteria from a plane layer.

    PubMed Central

    Cridland, J V; Thonemann, P C

    1984-01-01

    The dispersal of an initially well-defined concentration of the motile bacterium Escherichia coli was measured under nonchemotactic conditions. The distribution of bacteria along a glass observation cell was measured by recording the intensity of light scattered by the organisms. For comparison, the diffusion of fluorescein was also measured by determining the distribution of fluorescence throughout the observation cell. The dispersal of bacteria from a plane layer, under nonchemotactic conditions, can be adequately described by the Gaussian solution of the diffusion equation. PMID:6440604

  13. Simultaneous measurements and flow visualization in a plane mixing layer

    NASA Astrophysics Data System (ADS)

    Sherikar, S. V.; Chevray, R.

    Wind tunnel experiments performed to determine the flow characteristics of a plane mixing layer are described. Two parallel streams of air moving at different velocities were separated by a splitter plate prior to their mixing in the test section. Gaseous NH3 and gaseous HCI were introduced near the splitter plate to produce an ammonium chloride aerosol which made flow visualization possible. Flow visualization records (movies) and velocity measurements, using laser-doppler-velocimeters tracking silicone oil particles in the flow, were made simultaneously and synchronized using a chopped beam of a He-Ne laser which left a signature on the move film and provided a signal for flow rate data acquisition. Analysis of these synchronized data verified the existence of large, essentially two-dimensional coherent structures in the plane mixing layer.

  14. Separation of thick HVPE-GaN films from GaN templates using nanoporous GaN layers

    NASA Astrophysics Data System (ADS)

    Dong, Zengyin; Yang, Ruixia; Zhang, Song; Wang, Zaien; Chen, Jianli; Li, Xun

    2017-10-01

    In this work, we have succeeded in growing an approximate 2-inch self-separated thick GaN wafer by hydride vapor phase epitaxy with an introduction of a sacrificial layer of nanoporous GaN. Such nanoporous GaN layer is invented by using the HVPE growth of thin GaN layer on the spin-coating silica nanosphere layer followed by a hydrofluoric acid etching to the silica nanosphere layer. It has been found that the nanoporous GaN layer, enabling a reduction of stickiness between thick GaN films and the substrates, plays a significant role in the self-separation of thick GaN films during the cooling process. However, the thickness of the nanoporous GaN layer is another key issue to achieve good quality self-separated GaN thick films. In our study, we suggest that the nanoporous GaN layer with a thickness of approximately 150-240 nm can best serve as the sacrificial layer in self-separation process. Raman spectroscopy also indicates the self-separated thick GaN films by using the proposed approach are virtually strain-free.

  15. Growth of M- and A-plane GaN on LiGaO{sub 2} by plasma-assisted MBE

    SciTech Connect

    Schuber, R.; Schaadt, D. M.; Chou, M. M. C.; Vincze, P.; Schimmel, Th.

    2011-12-23

    We have performed non-polar M- and A-plane GaN growth on LiGaO{sub 2}(LGO) by plasma-assisted molecular beam expitaxy (MBE). We demonstrate that non-polar GaN growth on LGO yields high phase purity and flat surfaces. We find that annealing of the substrates prior to growth is a suitable method for avoiding a peeling off of the film from the substrate after growth.

  16. New buffer layers for GaN on sapphire by atomic layer and molecular stream epitaxy

    SciTech Connect

    Piner, E.L.; He, Y.W.; Boutros, K.S.; McIntosh, F.G.; Roberts, J.C.; Bedair, S.M.; El-Masry, N.A.

    1996-11-01

    The current approach of depositing a low temperature then annealed AlN or GaN buffer for the growth of GaN on sapphire results in a high dislocation density. These dislocations thread through the GaN layer to the surface. Reducing their density either by growing thicker films or using a strained layer superlattice is ineffective. Two new approaches for AlN/GaN buffer layer growth for GaN on sapphire have been employed: Atomic Layer Epitaxy (ALE) and molecular Stream Epitaxy (MSE). ALE is distinguished by organo-metallic/ammonia separation while MSE is distinguished by cyclic annealing of the growing film. Both ALE and MSE enhance two dimensional growth of single crystal GaN on sapphire. The structural quality of epitaxial GaN grown on these buffer layers was studied by transmission electron microscopy (TEM) and x-ray diffraction (XRD). The initial result for the ALE buffer shows an improved quality GaN film with lower defect densities. The MSE grown buffer layer closely resembles that of conventionally grown MOCVD buffer layers observed by others, with dislocations threading through the GaN epilayer. The effects of these buffer layers on the structural and optical properties of GaN grown on sapphire will be presented.

  17. Structural Defects in Laterally Overgrown GaN Layers Grown onNon-polar Substrates

    SciTech Connect

    Liliental-Weber, Z.; Ni, X.; Morkoc, H.

    2007-02-14

    Transmission electron microscopy was used to study defects in lateral epitaxial layers of GaN which were overgrown on a template of a-plane (11{und 2}0) GaN grown on (1{und 1}02) r-plane Al2O3. A high density of basal stacking faults is formed in these layers because the c-planes of wurtzite structure are arranged along the growth direction. Density of these faults is decreasing at least by two orders of magnitude lower in the wings compared to the seed areas. Prismatic stacking faults and threading dislocations are also observed, but their densities drastically decrease in the wings. The wings grow with opposite polarities and the Ga-wing width is at least 6 times larger than N-wing and coalescence is rather difficult. Some tilt and twist was detected using Large Angle Convergent Beam Electron Diffraction.

  18. Dislocation annihilation in regrown GaN on nanoporous GaN template with optimization of buffer layer growth

    NASA Astrophysics Data System (ADS)

    Soh, C. B.; Hartono, H.; Chow, S. Y.; Chua, S. J.; Fitzgerald, E. A.

    2007-01-01

    Nanoporous GaN template has been fabricated by electrochemical etching to give hexagonal pits with nanoscale pores of size 20-50nm in the underlying grains. The effect of GaN buffer layer grown at various temperatures from 650to1015°C on these as-fabricated nanopores templates is investigated by transmission electron microscopy. The buffer layer grown at the optimized temperature of 850°C partially fill up the pores and voids with annihilation of threading dislocations, serving as an excellent template for high-quality GaN growth. This phenomenon is, however, not observed for the samples grown with other temperature buffer layers. Micro-Raman measurements show significant strain relaxation and improvement in the crystal quality of the overgrown GaN layer on nanoporous GaN template as compared to overgrown on conventional GaN template.

  19. Spatially resolved and orientation dependent Raman mapping of epitaxial lateral overgrowth nonpolar a-plane GaN on r-plane sapphire

    PubMed Central

    Jiang, Teng; Xu, Sheng-rui; Zhang, Jin-cheng; Xie, Yong; Hao, Yue

    2016-01-01

    Uncoalesced a-plane GaN epitaxial lateral overgrowth (ELO) structures have been synthesized along two mask stripe orientations on a-plane GaN template by MOCVD. The morphology of two ELO GaN structures is performed by Scanning electronic microscopy. The anisotropy of crystalline quality and stress are investigated by micro-Raman spectroscopy. According to the Raman mapping spectra, the variations on the intensity, peak shift and the full width at half maximum (FWHM) of GaN E2 (high) peak indicate that the crystalline quality improvement occurs in the window region of the GaN stripes along [0001], which is caused by the dislocations bending towards the sidewalls. Conversely, the wing regions have better quality with less stress as the dislocations propagated upwards when the GaN stripes are along []. Spatial cathodoluminescence mapping results further support the explanation for the different dislocation growth mechanisms in the ELO processes with two different mask stripe orientations. PMID:26821824

  20. Defect reduction in (11-20) a-plane GaN by two step epitaxiallateral overgrowth

    SciTech Connect

    Ni, X.; Ozgur, U.; Fu, Y.; Biyikii, N.; Morkoc, H.; Liliental-Weber, Z.

    2006-11-25

    We report a two-step growth method to obtain uniformly coalesced epitaxial lateral overgrown a-plane GaN by metal-organic chemical vapor deposition (MOCVD). By obtaining a large wing height to width aspect ratio in the first step followed by enhanced lateral growth in the second step via controlling the growth temperature, we reduced the tilt angle between the advancing Ga-polar and N-polar wings for improved properties. Transmission electron microscopy (TEM) showed that the threading dislocation density in the wing area was 1.0 x 10{sup 8}cm{sup -2}, more than two orders of magnitude lower than that in the window area (4.2 x 10{sup 10} cm{sup -2}). However, a high density of basal stacking faults, 1.2 x 10{sup 4} cm{sup -1}, was still observed in the wing area. Near field scanning optical microscopy (NSOM) at room temperature revealed that the luminescence was mainly from the wing regions with very little contribution from the windows and meeting fronts. These observations suggest that due to significant reduction of threading dislocations radiative recombination is enhanced in the wings.

  1. Atomic force microscopy studies of homoepitaxial GaN layers grown on GaN template by laser MBE

    SciTech Connect

    Choudhary, B. S.; Singh, A.; Tyagi, P. K.; Tanwar, S.; Kumar, M. Senthil; Kushvaha, S. S.

    2016-04-13

    We have grown homoepitaxial GaN films on metal organic chemical vapor deposition (MOCVD) grown 3.5 µm thick GaN on sapphire (0001) substrate (GaN template) using an ultra-high vacuum (UHV) laser assisted molecular beam epitaxy (LMBE) system. The GaN films were grown by laser ablating a polycrystalline solid GaN target in the presence of active r.f. nitrogen plasma. The influence of laser repetition rates (10-30 Hz) on the surface morphology of homoepitaxial GaN layers have been studied using atomic force microscopy. It was found that GaN layer grown at 10 Hz shows a smooth surface with uniform grain size compared to the rough surface with irregular shape grains obtained at 30 Hz. The variation of surface roughness of the homoepitaxial GaN layer with and without wet chemical etching has been also studied and it was observed that the roughness of the film decreased after wet etching due to the curved structure/rough surface.

  2. Investigation of different mechanisms of GaN growth induced on AlN and GaN nucleation layers

    SciTech Connect

    Tasco, V.; Campa, A.; Tarantini, I.; Passaseo, A.; Gonzalez-Posada, F.; Munoz, E.; Redondo-Cubero, A.; Lorenz, K.; Franco, N.

    2009-03-15

    The evolution of GaN growth on AlN and GaN nucleation layers is compared through morphological and structural analyses, including ion beam analysis. By using AlN nucleation layer grown at high temperature, improved crystalline quality is exhibited by 300 nm thin GaN epilayers. GaN (002) x-ray rocking curve as narrow as 168 arc sec and atomic-step surface morphology characterize such a thin GaN film on AlN. Defects are strongly confined into the first 50 nm of growth, whereas a fast laterally coherent growth is observed when increasing thickness, as an effect of high temperature AlN surface morphology and Ga adatom dynamics over this template.

  3. Lattice distortion analysis of nonpolar a-plane $(11bar 20)$ GaN films by using a grazing-incidence X-ray diffraction technique

    NASA Astrophysics Data System (ADS)

    Seo, Yong Gon; Kim, Jihoon; Hwang, Sung-Min; Kim, Jihyun; Jang, Soohwan; Kim, Heesan; Baik, Kwang Hyeon

    2015-02-01

    This work examines the anisotropic microstructure and the lattice distortions of nonpolar a-plane GaN ( a-GaN) films by using the grazing-incidence X-ray diffraction technique. Faulted a-GaN films typically exhibit an in-plane anisotropy of the structural properties along the X-ray in-beam directions. For this reason, the anisotropic peak broadenings of the X-ray rocking curves (XRCs) were observed for various angle (phi) rotations for a-GaN films with and without SiN x interlayers. Analysis revealed the peak widths of the XRCs displayed an isotropic behavior for a nonpolar a-GaN bulk crystal. Thus, the in-plane anisotropy of the XRC peak widths for nonpolar a-GaN films apparently originates from the heteroepitaxial growth of the a-GaN layer on a foreign substrate. The lattice distortion analysis identified the presence of compressive strains in both the two in-plane directions (the c- and the m-axis), as well as a tensile strain along the normal growth direction. In addition, the observed frequency shifts in the Raman E2 (high) mode for the a-GaN films showed the existence of considerable in-plane compressive strain on both a-GaN films, as confirmed by the lattice distortion analysis performed using the grazing-incidence XRD method.

  4. Dynamics of coherent structures in a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Hussain, Fazle; Moser, R. D.; Colonius, T.; Moin, P.; Rogers, M. M.

    1988-01-01

    An incompressible, time developing 3-D mixing layer with idealized initial conditions was simulated numerically. Consistent with the suggestions from experimental measurements, the braid region between the dominant spanwise vortices or rolls develops longitudinal vortices or ribs, which are aligned upstream and downstream of a roll and produce spanwise distortion of the rolls. The process by which this distortion occurs is explained by studying a variety of quantities of dynamic importance (e.g., production of enstrophy, vortex stretching). Other quantities of interest (dissipation, helicity density) are also computed and discussed. The currently available simulation only allows the study of the early evolution (before pairing) of the mixing layer. New simulations in progress will relieve this restriction.

  5. Streamwise vortex meander in a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Leboeuf, Richard L.; Mehta, Rabindra D.

    1993-01-01

    The present experimental study was conducted in order to determine the existence of streamwise vortex meander in a mixing layer, and if present, its significance on the measured properties. The dependence of the velocity cross-correlation on the fixed probe location was shown to be a good indicator of the stationarity of the streamwise vortex location. The cross-correlation measurements obtained here indicate that spanwise meander is negligible, although transverse apparent meander (normal to the plane of the mixing layer) was indicated. The transverse meander, exemplified by the elliptical shape of the mean streamwise vorticity contours, was expected, since the streamwise vorticity in the braid region is essentially inclined, with respect to the streamwise direction. These conclusions were supported by results of estimated spanwise profiles of the transverse velocity component. The balance of evidence suggests that the measured mean streamwise vorticity decay is representative of the decay of the vorticity rather than an artifact of meander.

  6. General image method in a plane-layered elastostatic medium

    NASA Technical Reports Server (NTRS)

    Fares, N.; Li, V. C.

    1988-01-01

    The general-image method presently used to obtain the elastostatic fields in plane-layered media relies on the use of potentials in order to represent elastic fields. For the case of a single interface, this method yields the displacement field in closed form, and is applicable to antiplane, plane, and three-dimensional problems. In the case of multiplane interfaces, the image method generates the displacement fields in terms of infinite series whose convergences can be accelerated to improve method efficiency.

  7. Low-Angle-Incidence Microchannel Epitaxy of a-Plane GaN Grown by Ammonia-Based Metal-Organic Molecular Beam Epitaxy

    NASA Astrophysics Data System (ADS)

    Lin, Chia-Hung; Uchiyama, Shota; Maruyama, Takahiro; Naritsuka, Shigeya

    2012-04-01

    Low-angle-incidence microchannel epitaxy (LAIMCE) of a-plane GaN was performed using ammonia-based metal-organic molecular beam epitaxy to obtain wide and thin lateral overgrowth over a SiO2 mask. Trimethylgallium (TMG) was supplied perpendicular to the openings cut in the mask with a low incident angle of 5° relative to the substrate plane. The [NH3]/[TMG] ratio (R) dependence of GaN LAIMCE was optimized by varying R from 5 to 30. A wide lateral overgrowth of 3.7 µm with a dislocation density below the transmission electron microscope detection limit was obtained at R=15 for a thickness of 520 nm.

  8. Controlling of the electrical resistivity of GaN layer using AIN nucleation layer.

    PubMed

    Yi, Min-Su; Kim, Hyo Jung; Lee, Hyun Hwi

    2011-08-01

    The sheet resistance (Rs) of undoped GaN films on AIN/c-plane sapphire substrate was investigated. The Rs was strongly dependent on the AIN layer thickness and semi-insulating behavior was observed. To clarify the effect of crystalline property on Rs, the crystal structure of the GaN films has been studied using X-ray scattering and transmission electron microscopy. A compressive strain was introduced by the presence of AIN nucleation layer (NL) and was gradually relaxed as increasing AIN NL thickness. This relaxation produced more threading dislocations (TD) of edge-type. Moreover, the surface morphology of the GaN film was changed at thicker AIN layer condition, which was originated by the crossover from planar to island grains of AIN. Thus, rough surface might produce more dislocations. The edge and mixed dislocations propagating from the interface between the GaN film and the AIN buffer layer affected the electric resistance of GaN film.

  9. Optical and field emission properties of layer-structure GaN nanowires

    SciTech Connect

    Cui, Zhen; Li, Enling; Shi, Wei; Ma, Deming

    2014-08-15

    Highlights: • The layer-structure GaN nanowires with hexagonal-shaped cross-sections are produced via a process based on the CVD method. • The diameter of the layer-structure GaN nanowire gradually decreases from ∼500 nm to ∼200 nm along the wire axis. • The layer-structure GaN nanowire film possesses good field emission property. - Abstract: A layer-structure gallium nitride (GaN) nanowires, grown on Pt-coated n-type Si (1 1 1) substrate, have been synthesized using chemical vapor deposition (CVD). The results show: (1) SEM indicates that the geometry structure is layer-structure. HRTEM indicates that GaN nanowire’s preferential growth direction is along [0 0 1] direction. (2) The room temperature PL emission spectrum of the layer-structure GaN nanowires has a peak at 375 nm, which proves that GaN nanowires have potential application in light-emitting nano-devices. (3) Field-emission measurements show that the layer-structure GaN nanowires film has a low turn-on field of 4.39 V/μm (at room temperature), which is sufficient for electron emission devices, field emission displays and vacuum nano-electronic devices. The growth mechanism for GaN nanowires has also been discussed briefly.

  10. Atomic layer deposition of GaN at low temperatures

    SciTech Connect

    Ozgit, Cagla; Donmez, Inci; Alevli, Mustafa; Biyikli, Necmi

    2012-01-15

    The authors report on the self-limiting growth of GaN thin films at low temperatures. Films were deposited on Si substrates by plasma-enhanced atomic layer deposition using trimethylgallium (TMG) and ammonia (NH{sub 3}) as the group-III and -V precursors, respectively. GaN deposition rate saturated at 185 deg. C for NH{sub 3} doses starting from 90 s. Atomic layer deposition temperature window was observed from 185 to {approx}385 deg. C. Deposition rate, which is constant at {approx}0.51 A/cycle within the temperature range of 250 - 350 deg. C, increased slightly as the temperature decreased to 185 deg. C. In the bulk film, concentrations of Ga, N, and O were constant at {approx}36.6, {approx}43.9, and {approx}19.5 at. %, respectively. C was detected only at the surface and no C impurities were found in the bulk film. High oxygen concentration in films was attributed to the oxygen impurities present in group-V precursor. High-resolution transmission electron microscopy studies revealed a microstructure consisting of small crystallites dispersed in an amorphous matrix.

  11. A DFT study on NEA GaN photocathode with an ultrathin n-type Si-doped GaN cap layer

    NASA Astrophysics Data System (ADS)

    Xia, Sihao; Liu, Lei; Kong, Yike; Diao, Yu

    2016-10-01

    Due to the drawbacks of conventional negative electron affinity (NEA) GaN photocathodes activated by Cs or Cs/O, a new-type NEA GaN photocathodes with heterojunction surface dispense with Cs activation are proposed. This structure can be obtained through the coverage of an ultrathin n-type Si-doped GaN cap layer on the p-type Mg-doped GaN emission layer. The influences of the cap layer on the photocathode are calculated using DFT. This study indicates that the n-type cap layer can promote the photoemission characteristics of GaN photocathode and demonstrates the probability of the preparation of a NEA GaN photocathode with an n-type cap layer.

  12. Optical gain characteristics of a-plane GaN/AlGaN quantum well lasers grown on strain-engineered MgZnO layer

    NASA Astrophysics Data System (ADS)

    Park, Seoung-Hwan

    2017-09-01

    Optical gain characteristics of a-plane (11 2 bar 0) AlGaN/GaN quantum well (QW) lasers grown on a GaN buffer with strain anisotropy using a strain-engineered MgZnO layer were investigated using the multiband effective mass theory. The calculated transition energies for QW structures grown on MgZnO layer are in good agreement with experimental results. The optical gain of the QW structure grown on the MgZnO substrate is dominated by the z ‧ -polarization because the dominant states constituting the topmost valence subband for the QW structure changes from | Y ‧ > - to | Z ‧ > -like and carriers occupy higher states above k∥ = 0 at a higher carrier density. On the other hand, the optical gain of the QW structure grown on conventional GaN buffer is dominated by both y ‧ - and z ‧ -polarizations. Thus, the optical polarization characteristics of a-plane AlGaN/GaN QW lasers can be engineered by using MgZnO substrate.

  13. ODENDOR of Defects in GaN Epitaxial Layers

    NASA Astrophysics Data System (ADS)

    Glaser, E. R.; Kennedy, T. A.; Carlos, W. E.; Freitas, J. A., Jr.; Wickenden, A. E.; Koleske, D. D.

    1998-03-01

    Optically-detected electron-nuclear double resonance (ODENDOR) at 24 GHz has been performed on a set of GaN epitaxial layers (undoped and Si-doped) grown on Al_2O3 to identify and locate residual defects and dopants.(E.R. Glaser et al., submitted to Phys. Rev. B) The first observation was made by the Paderborn group.(F.K. Koschnick et al., Phys. Rev. B 54, R11042 (1996).) Strong ODENDOR with resolved quadrupole structure was observed between 6 and 14 MHz on the g = 1.951 effective-mass (EM) donor resonance found on the 2.2 eV emission bands from two high-resistivity films (n <= 1x10^16 cm-3). The lines are assigned to ^69,71Ga lattice nuclei coupled to the residual donors through a weak hyperfine interaction (<= 1 MHz). The quadrupole splitting of ~ 2.3 MHz found for ^69Ga varies between samples and in comparison to published values for strain-free GaN by 15-25 %. The symmetry of the electric field gradient provides evidence that the donors are located in the crystallites rather than near grain boundaries. ODENDOR was not found between 1.5 and 140 MHz on the g = 1.991 deep defect resonances. Possible reasons for the absence of signals will be discussed.

  14. Etching of GaN layers at electrolysis under UV-irradiation

    NASA Astrophysics Data System (ADS)

    Zubenko, T. K.; Puzyk, M. V.; Stozharov, V. M.; Ermakov, I. A.; Kovalev, D. S.; Ivanova, S. A.; Usikov, A. S.; Medvedev, O. S.; Papchenko, B. P.; Kurin, S. Yu; Antipov, A. A.; Chernyakov, A. E.

    2016-08-01

    Etching of the GaN layers in 1M KOH aqua solution under irradiation was studied by the electro-stimulated photolysis using N2-laser (337 nm, 60 W/m2) as a light source. It was observed that the size and the depth of the failure monotonically depend on the optical power and the irradiation time of the N2 laser and the GaN layer type of conductivity. The GaN layers etching rate was evaluated. A mechanism of the failure in the n-GaN layers is discussed.

  15. Measurements of the streamwise vortical structures in a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Bell, James H.; Mehta, Rabindra D.

    1992-01-01

    The 3D structure of a plane two-stream mixing layer of velocity ratio 0.6 and originating from laminar initial boundary layers was investigated through direct measurements made in a specially constructed mixing-layer wind tunnel. The main objective of the study was to establish quantitatively the presence and the role of the secondary streamwise vortex structure (of the kind that has been shown in past flow visualization investigations to ride among the primary spanwise vortices) in the development of a plane turbulent mixing layer at relatively high Reynolds numbers. Results indicate that the instability leading to the formation of streamwise vortices is initially amplified just downstream of the first spanwise roll-up. The streamwise vortices, which first appear in clusters containing vorticity of both signs, realign further downstream to form counterrotating pairs. Due to the amalgamation of like-sign vortices, the streamwise vortex spacing increases in a stepwise fashion.

  16. Growth of thick GaN layers on laser-processed sapphire substrate by hydride vapor phase epitaxy

    NASA Astrophysics Data System (ADS)

    Koyama, Koji; Aida, Hideo; Kim, Seong-Woo; Ikejiri, Kenjiro; Doi, Toshiro; Yamazaki, Tsutomu

    2014-10-01

    A 600 μm thick GaN layer was successfully grown by hydride vapor phase epitaxy by replacing the standard sapphire substrate with that processed by a focused laser beam within the substrate. The effects of the laser processing on the curvature and cracking of the GaN layer were investigated. Microscopic observations of the interior of the thick GaN layer revealed that the laser-processed substrate suppressed the generation of microcracks in the GaN layer. In addition, the laser processing was also found to reduce the change in the curvature during the GaN layer growth in comparison to that on the standard substrate. It is shown that the overlapping microcracks observed in the GaN layer on the standard sapphire substrate lead to serious cracking after thick GaN layer growth.

  17. InGaN light emitting diodes with a nanopipe layer formed from the GaN epitaxial layer.

    PubMed

    Hsu, Wei-Ju; Chen, Kuei-Ting; Huang, Wan-Chun; Wu, Chia-Jung; Dai, Jing-Jie; Chen, Sy-Hann; Lin, Chia-Feng

    2016-05-30

    A Si-heavy doped GaN:Si epitaxial layer is transformed into a directional nanopipe GaN layer through a laser-scribing process and a selectively electrochemical (EC) etching process. InGaN light-emitting diodes (LEDs) with an EC-treated nanopipe GaN layer have a high light extraction efficiency. The direction of the nanopipe structure was directed perpendicular to the laser scribing line and was guided by an external bias electric field. An InGaN LED structure with an embedded nanopipe GaN layer can enhance external quantum efficiency through a one-step epitaxial growth process and a selective EC etching process. A birefringence optical property and a low effective refractive index were observed in the directional-nanopipe GaN layer.

  18. The three-dimensional turbulent boundary layer near a plane of symmetry

    NASA Technical Reports Server (NTRS)

    Degani, A. T.; Smith, F. T.; Walker, J. D. A.

    1992-01-01

    The asymptotic structure of the three-dimensional turbulent boundary layer near a plane of symmetry is considered in the limit of large Reynolds number. A self-consistent two-layer structure is shown to exist wherein the streamwise velocity is brought to rest through an outer defect layer and an inner wall layer in a manner similar to that in two-dimensional boundary layers. The cross-stream velocity distribution is more complex and two terms in the asymptotic expansion are required to yield a complete profile which is shown to exhibit a logarithmic region. The flow in the inner wall layer is demonstrated to be collateral to leading order; pressure-gradient effects are formally of higher order but can cause the velocity profile to skew substantially near the wall at the large but finite Reynolds numbers encountered in practice. The governing set of ordinary differential equations describing a self-similar flow is derived. The calculated numerical solutions of these equations are matched asymptotically to an inner wall-layer solution and the results show trends that are consistent with experimental observations.

  19. Layered transition metal dichalcogenides: promising near-lattice-matched substrates for GaN growth

    PubMed Central

    Gupta, Priti; Rahman, A. A.; Subramanian, Shruti; Gupta, Shalini; Thamizhavel, Arumugam; Orlova, Tatyana; Rouvimov, Sergei; Vishwanath, Suresh; Protasenko, Vladimir; Laskar, Masihhur R.; Xing, Huili Grace; Jena, Debdeep; Bhattacharya, Arnab

    2016-01-01

    Most III-nitride semiconductors are grown on non-lattice-matched substrates like sapphire or silicon due to the extreme difficulty of obtaining a native GaN substrate. We show that several layered transition-metal dichalcogenides are closely lattice-matched to GaN and report the growth of GaN on a range of such layered materials. We report detailed studies of the growth of GaN on mechanically-exfoliated flakes WS2 and MoS2 by metalorganic vapour phase epitaxy. Structural and optical characterization show that strain-free, single-crystal islands of GaN are obtained on the underlying chalcogenide flakes. We obtain strong near-band-edge emission from these layers, and analyse their temperature-dependent photoluminescence properties. We also report a proof-of-concept demonstration of large-area growth of GaN on CVD MoS2. Our results show that the transition-metal dichalcogenides can serve as novel near-lattice-matched substrates for nitride growth. PMID:27025461

  20. Growth and characterization of GaN thin films on Si(111) substrates using SiC intermediate layer

    SciTech Connect

    Lim, K.Y.; Lee, K.J.; Park, C.I.; Kim, K.C.; Choi, S.C.; Lee, W.H.; Suh, E.K.; Yang, G.M.; Nahm, K.S.

    2000-07-01

    GaN films have been grown atop Si-terminated 3C-SiC intermediate layer on Si(111) substrates using low pressure metalorganic chemical vapor deposition (LP-MOCVD). The SiC intermediate layer was grown by chemical vapor deposition (CVD) using tetramethylsilane (TMS) as the single source precursor. The Si terminated SiC surface was obtained by immediately flow of SiH{sub 4} gas after growth of SiC film. LP-MOCVD growth of GaN on 3C-SiC/Si(111) was carried out with trimethylgallium (TMG) and NH{sub 3}. Single crystalline hexagonal GaN layers can be grown on Si terminated SiC intermediate layer using an AlN or GaN buffer layer. Compared with GaN layers grown using a GaN buffer layer, the crystal qualities of GaN films with AlN buffer layers are extremely improved. The GaN films were characterized by x-ray diffraction (XRD), photoluminescence (PL) and scanning electron microscopy (SEM). Full width at half maximum (FWHM) of double crystal x-ray diffraction (DCXD) rocking curve for GaN (0002) on 3C-SiC/Si(111) was 890 arcsec. PL near band edge emission peak position and FWHM at room temperature are 3.38 eV and 79.35 meV, respectively.

  1. Semipolar AlN and GaN on Si(100): HVPE technology and layer properties

    NASA Astrophysics Data System (ADS)

    Bessolov, V.; Kalmykov, A.; Konenkova, E.; Kukushkin, S.; Myasoedov, A.; Poletaev, N.; Rodin, S.

    2017-01-01

    Hydride vapor phase epitaxy (HVPE) growth of semipolar AlN and GaN layers on planar Si(100) substrates with SiC nanolayer is investigated. It is shown experimentally that the solid-phase epitaxial formation of a specially oriented SiC nucleation layer followed by epitaxy of AlN layer by HVPE at low rates enables growth of aluminum and gallium nitrides in the semipolar direction. For the best GaN(20-23) layers obtained, the full width at half maximum (FWHM) value for the x-ray diffraction rocking curve is 24 arcmin. The photoluminescence spectrum of the semipolar GaN measured at 4 K exhibits bands related to basal-plane and prismatic stacking faults (BSF and PSF).

  2. Study of GaP single crystal layers grown on GaN by MOCVD

    SciTech Connect

    Li, Shuti; Liu, Chao; Ye, Guoguang; Xiao, Guowei; Zhou, Yugang; Su, Jun; Fan, Guanghan; Zhang, Yong; Liang, Fubo; Zheng, Shuwen

    2011-11-15

    Highlights: {yields} We investigated the growth of GaP layers on GaN by MOCVD. {yields} A single crystal GaP layer could be grown on GaN. {yields} The V/III ratio played an important role to improve GaP layer quality. {yields} The GaP:Mg layer with hole concentration of 4.2 x 10{sup 18} cm{sup -3} was obtained. -- Abstract: The performance of GaN based devices could possibly be improved by utilizing the good p-type properties of GaP layer and it provides the possibility of the integration of InAlGaN and AlGaInP materials to produce new devices, if high quality GaP compounds can be grown on III-nitride compounds. In this paper, the growth of GaP layers on GaN by metalorganic chemical vapor deposition (MOCVD) has been investigated. The results show that the GaP low temperature buffer layer can provide a high density of nucleation sites for high temperature GaP growth. Using a 40 nm thick GaP buffer layer, a single crystal GaP layer, whose full-width at half-maximum of the (1 1 1) plane measured by double crystal X-ray diffraction is 580'', can be grown on GaN. The V/III ratio plays an important role in the GaP layer growth and an appropriate V/III ratio can improve the quality of GaP layer. The GaP:Mg layer with hole carrier concentration of 4.2 x 10{sup 18} cm{sup -3} has been obtained.

  3. Microstructure of GaN epitaxy on SiC using AlN buffer layers

    SciTech Connect

    Ponce, F.A.; Krusor, B.S.; Major, J.S. Jr.; Plano, W.E.; Welch, D.F.

    1995-07-17

    The crystalline structure of GaN epilayers on (0001) SiC substrates has been studied using x-ray diffraction and transmission microscopy. The films were grown by metalorganic chemical vapor deposition, using AlN buffer layers. X-ray diffraction measurements show negligible strain in the epilayer, and a long-range variation in orientation. Transmission electron lattice images show that the AlN buffer layer consists of small crystallites. The nature of the buffer layer and its interfaces with the substrate and the GaN film is discussed. The defect structure of the GaN film away from the substrate consists mostly of threading dislocations with a density of {similar_to}10{sup 9} cm{sup {minus}2}. {copyright} {ital 1995} {ital American} {ital Institute} {ital of} {ital Physics}.

  4. Lattice-matched HfN buffer layers for epitaxy of GaN on Si

    SciTech Connect

    Armitage, Robert; Yang, Qing; Feick, Henning; Gebauer, Joerg; Weber, Eicke R.; Shinkai, Satoko; Sasaki, Katsutaka

    2002-05-08

    Gallium nitride is grown by plasma-assisted molecular-beam epitaxy on (111) and (001) silicon substrates using sputter-deposited hafnium nitride buffer layers. Wurtzite GaN epitaxial layers are obtained on both the (111) and (001) HfN/Si surfaces, with crack-free thickness up to 1.2 (mu)m. Initial results for GaN grown on the (111) surface show a photoluminescence peak width of 17 meV at 11 K, and an asymmetric x-ray rocking curve width of 20 arcmin. Wurtzite GaN on HfN/Si(001) shows reduced structural quality and peculiar low-temperature luminescence features. However, growth on the (001) surface results in nearly stress-free films, suggesting that much thicker crack-free layers could be obtained.

  5. Improved crystalline quality of N-polar GaN epitaxial layers grown with reformed flow-rate-modulation technology

    NASA Astrophysics Data System (ADS)

    Zhang, Heng; Zhang, Xiong; Wang, Shuchang; Wang, Xiaolei; Zhao, Jianguo; Wu, Zili; Dai, Qian; Yang, Hongquan; Cui, Yiping

    2017-01-01

    A reformed flow-rate-modulation technology was developed for the metalorganic vapor phase epitaxy (MOVPE) growth of the N-polar GaN epitaxial layers. To improve the crystalline quality of the N-polar GaN epitaxial layers, a GaN nucleation layer was grown at relatively low temperature with carefully-controlled pulsed supply of Ga source and showed diverse morphology with atomic force microscope (AFM). Furthermore, the electrical and optical properties of the grown N-polar GaN epitaxial layers were investigated extensively by means of Hall effect, photoluminescence (PL), and X-ray rocking curve (XRC) measurements. The characterization results revealed that as compared with the N-polar GaN epitaxial layer grown over the conventional GaN nucleation layer which was deposited with continuous supply of both N and Ga sources, the electrical and optical properties of the N-polar GaN epitaxial layer grown with optimized supply of Ga source for the GaN nucleation layer were significantly improved.

  6. Uniform GaN thin films grown on (100) silicon by remote plasma atomic layer deposition

    NASA Astrophysics Data System (ADS)

    Shih, Huan-Yu; Lin, Ming-Chih; Chen, Liang-Yih; Chen, Miin-Jang

    2015-01-01

    The growth of uniform gallium nitride (GaN) thin films was reported on (100) Si substrate by remote plasma atomic layer deposition (RP-ALD) using triethylgallium (TEG) and NH3 as the precursors. The self-limiting growth of GaN was manifested by the saturation of the deposition rate with the doses of TEG and NH3. The increase in the growth temperature leads to the rise of nitrogen content and improved crystallinity of GaN thin films, from amorphous at a low deposition temperature of 200 °C to polycrystalline hexagonal structures at a high growth temperature of 500 °C. No melting-back etching was observed at the GaN/Si interface. The excellent uniformity and almost atomic flat surface of the GaN thin films also infer the surface control mode of the GaN thin films grown by the RP-ALD technique. The GaN thin films grown by RP-ALD will be further applied in the light-emitting diodes and high electron mobility transistors on (100) Si substrate.

  7. Comparing electrical performance of GaN trench-gate MOSFETs with a-plane (11\\bar{2}0) and m-plane (1\\bar{1}00) sidewall channels

    NASA Astrophysics Data System (ADS)

    Gupta, Chirag; Chan, Silvia H.; Lund, Cory; Agarwal, Anchal; Koksaldi, Onur S.; Liu, Junquian; Enatsu, Yuuki; Keller, Stacia; Mishra, Umesh K.

    2016-12-01

    GaN trench-gate MOSFETs with m- and a-plane-oriented sidewall channels were fabricated and characterized. The trench-gate MOSFET performance depended strongly on the sidewall-MOS-channel plane orientation. The m-plane-oriented MOS channel devices demonstrated higher channel mobility, higher current density, lower sub-threshold slope, and lower hysteresis with similar threshold voltage and on-off ratio compared to a-plane MOS channel devices. These results indicate that orienting trench-gate MOSFET toward the m-plane would allow for better on-state characteristics while maintaining similar off-state characteristics.

  8. Core instability of the spanwise vortices in a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Nygaard, Kris J.; Glezer, Ari

    1990-01-01

    A spanwise core instability of the primary vortices in a plane mixing layer has been identified as a viable mechanism for the generation of streamwise vortical structures far downstream of the flow partition. The core instability is excited by a time-harmonic wave train with spanwise phase variation, synthesized by a mosaic of individually controlled surface heaters flush mounted on the flow partition. The flow is visualized in planes of constant cross-stream elevation by means of a schlieren system. As a result of the forcing, the primary vortices undergo spanwise deformations that induce secondary vortical structures, the shape and strength of which depends on the magnitude of the prescribed spanwise phase variation. The appearance of small-scale structures within the large coherent vortices suggests that core instability is an important contributor to mixing.

  9. Enhancement in wafer bow of free-standing GaN substrates due to high-dose hydrogen implantation: implications for GaN layer transfer applications

    NASA Astrophysics Data System (ADS)

    Singh, R.; Radu, I.; Bruederl, G.; Eichler, C.; Haerle, V.; Gösele, U.; Christiansen, S. H.

    2007-04-01

    Two-inch free-standing GaN wafers were implanted by 100 keV H+2 ions with a dose of 1.3 × 1017 cm-2 at room temperature. The hydrogen implantation induced damage in GaN extends between 230 to 500 nm from the surface as measured by cross-sectional transmission electron microscopy (XTEM). The wafer bow of the free-standing GaN wafers was measured using a Tencor long range profilometer on a scan length of 48 mm before and after the hydrogen implantation. Before implantation the bow of two different free-standing GaN wafers (named A and B) with different thicknesses was 1.5 µm and 6 µm, respectively. Initially, both wafers were concave in shape. After implantation the bow changed to convex with a value of 36 µm for wafer A and a value of 32 µm for wafer B. High dose hydrogen implantation leads to an in-plane compressive stress in the top damaged layer of the GaN, which is responsible for the enhancement of wafer bow and change of bow direction. The high value of bow after implantation hinders the direct wafer bonding of the free-standing GaN wafers to sapphire or any other handle wafers. Tight bonding between hydrogen implanted GaN wafers and the handle wafers is a necessary requirement for the successful layer transfer of thin GaN layers onto other substrates based on wafer bonding and layer splitting (Smart-cut).

  10. Morphological and microstructural evolution in the two-step growth of nonpolar a-plane GaN on r-plane sapphire

    NASA Astrophysics Data System (ADS)

    Sun, Qian; Kong, Bo Hyun; Yerino, Christopher D.; Ko, Tsung-Shine; Leung, Benjamin; Cho, Hyung Koun; Han, Jung

    2009-12-01

    In this paper, we report a detailed study on the evolution of surface morphology and microstructure of nonpolar a-plane GaN (a-GaN) through controlled growth interruptions. Microscopy imaging shows that the two-step a-GaN growth went through a roughening-recovery process. The first-step growth (under high V/III and high pressure) produced a rough surface with tall mesas separated by voids. The second-step growth (under low V/III and low pressure) promoted the lateral growth and filled up the voids. Striations that formed during the island coalescence persisted throughout the second-step growth, but could be relieved by an additional third-step growth. The morphological evolution was explained according to the kinetic Wulff plots. The microstructure of the a-GaN films was investigated by transmission electron microscopy (TEM) and x-ray rocking curve analysis. Most of the extended defects observed in the plan-view TEM images were I1 type basal-plane stacking faults (BSFs) and their associated partial dislocations (PDs). It is found that the bending of PDs (at the inclined/vertical growth fronts) within the basal plane toward the m-axes was responsible for the substantial reduction in threading PDs and the increase in BSF dimension. Based on a careful correlation between the morphological evolution and the microstructure development, we proposed a model explaining the possible mechanisms for the great reduction in defect density during the two-step growth process.

  11. Features of molecular beam epitaxy of the GaN (0001) and GaN (0001-bar) layers with the use of different methods of activation of nitrogen

    SciTech Connect

    Mizerov, A. M. Jmerik, V. N.; Kaibyshev, V. K.; Komissarova, T. A.; Masalov, S. A.; Ivanov, S. V.

    2009-08-15

    The results of comparative studies of the growth kinetics of the GaN layers of different polarity during ammonia molecular beam epitaxy and plasma-assisted molecular beam epitaxy (PA MBE) of nitrogen with the use of sapphire substrates and GaN(0001-bar)/c-Al{sub 2}O{sub 3} templates grown by gas-phase epitaxy from metalorganic compounds are presented. The possibility is shown of obtaining the GaN layers with an atomically smooth surface during molecular beam epitaxy with plasma activation of nitrogen. For this purpose, it is suggested to carry out the growth in conditions enriched with metal near the mode of formation of the Ga drops at a temperature close to the decomposition temperature of GaN (TS {approx} 760 deg. C). The conclusion is made that an increase in the growth temperature positively affects the structural, optical, and electrical properties of the GaN (0001-bar) layers. A high quality of the GaN (0001) films grown by the PA MBE method at a low temperature of {approx}700 deg. C on the GaN/c-Al{sub 2}O{sub 3} templates is shown.

  12. Nanostructural engineering of nitride nucleation layers for GaN substrate dislocation reduction.

    SciTech Connect

    Koleske, Daniel David; Lee, Stephen Roger; Lemp, Thomas Kerr; Coltrin, Michael Elliott; Cross, Karen Charlene; Thaler, Gerald

    2009-07-01

    With no lattice matched substrate available, sapphire continues as the substrate of choice for GaN growth, because of its reasonable cost and the extensive prior experience using it as a substrate for GaN. Surprisingly, the high dislocation density does not appear to limit UV and blue LED light intensity. However, dislocations may limit green LED light intensity and LED lifetime, especially as LEDs are pushed to higher current density for high end solid state lighting sources. To improve the performance for these higher current density LEDs, simple growth-enabled reductions in dislocation density would be highly prized. GaN nucleation layers (NLs) are not commonly thought of as an application of nano-structural engineering; yet, these layers evolve during the growth process to produce self-assembled, nanometer-scale structures. Continued growth on these nuclei ultimately leads to a fully coalesced film, and we show in this research program that their initial density is correlated to the GaN dislocation density. In this 18 month program, we developed MOCVD growth methods to reduce GaN dislocation densities on sapphire from 5 x 10{sup 8} cm{sup -2} using our standard delay recovery growth technique to 1 x 10{sup 8} cm{sup -2} using an ultra-low nucleation density technique. For this research, we firmly established a correlation between the GaN nucleation thickness, the resulting nucleation density after annealing, and dislocation density of full GaN films grown on these nucleation layers. We developed methods to reduce the nuclei density while still maintaining the ability to fully coalesce the GaN films. Ways were sought to improve the GaN nuclei orientation by improving the sapphire surface smoothness by annealing prior to the NL growth. Methods to eliminate the formation of additional nuclei once the majority of GaN nuclei were developed using a silicon nitride treatment prior to the deposition of the nucleation layer. Nucleation layer thickness was determined

  13. Hafnium nitride buffer layers for growth of GaN on silicon

    DOEpatents

    Armitage, Robert D.; Weber, Eicke R.

    2005-08-16

    Gallium nitride is grown by plasma-assisted molecular-beam epitaxy on (111) and (001) silicon substrates using hafnium nitride buffer layers. Wurtzite GaN epitaxial layers are obtained on both the (111) and (001) HfN/Si surfaces, with crack-free thickness up to 1.2 {character pullout}m. However, growth on the (001) surface results in nearly stress-free films, suggesting that much thicker crack-free layers could be obtained.

  14. Infrared Reflectance Analysis of Epitaxial n-Type Doped GaN Layers Grown on Sapphire

    NASA Astrophysics Data System (ADS)

    Tsykaniuk, Bogdan I.; Nikolenko, Andrii S.; Strelchuk, Viktor V.; Naseka, Viktor M.; Mazur, Yuriy I.; Ware, Morgan E.; DeCuir, Eric A.; Sadovyi, Bogdan; Weyher, Jan L.; Jakiela, Rafal; Salamo, Gregory J.; Belyaev, Alexander E.

    2017-06-01

    Infrared (IR) reflectance spectroscopy is applied to study Si-doped multilayer n+/n0/n+-GaN structure grown on GaN buffer with GaN-template/sapphire substrate. Analysis of the investigated structure by photo-etching, SEM, and SIMS methods showed the existence of the additional layer with the drastic difference in Si and O doping levels and located between the epitaxial GaN buffer and template. Simulation of the experimental reflectivity spectra was performed in a wide frequency range. It is shown that the modeling of IR reflectance spectrum using 2 × 2 transfer matrix method and including into analysis the additional layer make it possible to obtain the best fitting of the experimental spectrum, which follows in the evaluation of GaN layer thicknesses which are in good agreement with the SEM and SIMS data. Spectral dependence of plasmon-LO-phonon coupled modes for each GaN layer is obtained from the spectral dependence of dielectric of Si doping impurity, which is attributed to compensation effects by the acceptor states.

  15. Reflection of a plane wave from a two-layered seafloor with non-parallel interface between the layers.

    PubMed

    Papadakis, Panagiotis I; Piperakis, George S; Kalogerakis, Michael A

    2015-02-01

    This work studies the reflection coefficient of a plane wave incident on a seafloor consisting of two layers (sediment and substrate), whose interface is linear but not parallel to the water-sediment interface. This is an extension of the well-established and studied reflection coefficient concept for seafloors with parallel layers. Moreover this study introduces the concept of the Coherent Reflection Coefficient (CRC) that extends the usual Rayleigh reflection coefficient definition not only at the water-sediment interface but inside the water column as well. The mathematical formulation of the CRC is derived and its numerical implementation is explained. Based on this implementation a numerical code is developed and incorporated-among other codes-in a user-friendly graphics toolbox that was built to facilitate CRC calculations. Numerical examples for realistic seafloors are presented and the derived results are compared to similar ones for parallel layers, indicating that even for small inclination angles the reflection coefficient difference between parallel and slanted interface layers is substantial, hence cannot be ignored. An imminent application of the extended seafloor model and the CRC introduced in this work is the enhancement of geophysics inversion schemes for the estimation of the seafloor parameters.

  16. Ultralow threading dislocation density in GaN epilayer on near-strain-free GaN compliant buffer layer and its applications in hetero-epitaxial LEDs

    PubMed Central

    Shih, Huan-Yu; Shiojiri, Makoto; Chen, Ching-Hsiang; Yu, Sheng-Fu; Ko, Chung-Ting; Yang, Jer-Ren; Lin, Ray-Ming; Chen, Miin-Jang

    2015-01-01

    High threading dislocation (TD) density in GaN-based devices is a long unresolved problem because of the large lattice mismatch between GaN and the substrate, which causes a major obstacle for the further improvement of next-generation high-efficiency solid-state lighting and high-power electronics. Here, we report InGaN/GaN LEDs with ultralow TD density and improved efficiency on a sapphire substrate, on which a near strain-free GaN compliant buffer layer was grown by remote plasma atomic layer deposition. This “compliant” buffer layer is capable of relaxing strain due to the absorption of misfit dislocations in a region within ~10 nm from the interface, leading to a high-quality overlying GaN epilayer with an unusual TD density as low as 2.2 × 105 cm−2. In addition, this GaN compliant buffer layer exhibits excellent uniformity up to a 6” wafer, revealing a promising means to realize large-area GaN hetero-epitaxy for efficient LEDs and high-power transistors. PMID:26329829

  17. Ultralow threading dislocation density in GaN epilayer on near-strain-free GaN compliant buffer layer and its applications in hetero-epitaxial LEDs.

    PubMed

    Shih, Huan-Yu; Shiojiri, Makoto; Chen, Ching-Hsiang; Yu, Sheng-Fu; Ko, Chung-Ting; Yang, Jer-Ren; Lin, Ray-Ming; Chen, Miin-Jang

    2015-09-02

    High threading dislocation (TD) density in GaN-based devices is a long unresolved problem because of the large lattice mismatch between GaN and the substrate, which causes a major obstacle for the further improvement of next-generation high-efficiency solid-state lighting and high-power electronics. Here, we report InGaN/GaN LEDs with ultralow TD density and improved efficiency on a sapphire substrate, on which a near strain-free GaN compliant buffer layer was grown by remote plasma atomic layer deposition. This "compliant" buffer layer is capable of relaxing strain due to the absorption of misfit dislocations in a region within ~10 nm from the interface, leading to a high-quality overlying GaN epilayer with an unusual TD density as low as 2.2 × 10(5) cm(-2). In addition, this GaN compliant buffer layer exhibits excellent uniformity up to a 6" wafer, revealing a promising means to realize large-area GaN hetero-epitaxy for efficient LEDs and high-power transistors.

  18. A 340-nm-band ultraviolet laser diode composed of GaN well layers.

    PubMed

    Yamashita, Yoji; Kuwabara, Masakazu; Torii, Kousuke; Yoshida, Harumasa

    2013-02-11

    We have demonstrated the laser operation of a short-wavelength ultraviolet laser diode with multiple-quantum-wells composed of GaN well layers. The laser action has been achieved in 340-nm-band far from the wavelength corresponding to GaN band gap under the pulsed current mode at room temperature. The device has been realized on the Al(0.2)Ga(0.8)N underlying layer. The AlN mole fraction of the underlying layer is 0.1 lower than that of the underlying layer which was used for the previously reported 342 nm laser diode. These results provide a chance to the next step for a shorter-wavelength ultraviolet laser diode.

  19. Evolution of streamwise vortices and generation of small-scale motion in a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Nygaard, K. J.; Glezer, A.

    1991-01-01

    The present study investigates the evolution of streamwise vortices in a plane mixing layer and their role in the generation of small-scale 3D motion in a closed-return water facility. Spanwise-periodic streamwise vortices are excited by a time-harmonic wavetrain with spanwise-periodic amplitude variations synthesized by a mosaic of 32 surface film heaters flush-mounted on the low partition. The onset of streamwise vortices is accompanied by significant distortion in the transverse distribution of the streamwise velocity component. The presence of inflexion points, absent in corresponding velocity distributions of the unforced flow, suggests the formation of locally unstable regions of large shear in which broadband perturbations already present in the base flow undergo rapid amplification, followed by breakdown to small-scale motion. The cores of the primary vortices are significantly altered as a result of spanwise nonuniform excitation. The 3D features of the streamwise vortices and their interaction with the base flow are inferred from surfaces or rms velocity fluctuations and an approximation to cross-stream vorticity using 3D single component velocity data.

  20. Evolution of streamwise vortices and generation of small-scale motion in a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Nygaard, K. J.; Glezer, A.

    1991-01-01

    The present study investigates the evolution of streamwise vortices in a plane mixing layer and their role in the generation of small-scale 3D motion in a closed-return water facility. Spanwise-periodic streamwise vortices are excited by a time-harmonic wavetrain with spanwise-periodic amplitude variations synthesized by a mosaic of 32 surface film heaters flush-mounted on the low partition. The onset of streamwise vortices is accompanied by significant distortion in the transverse distribution of the streamwise velocity component. The presence of inflexion points, absent in corresponding velocity distributions of the unforced flow, suggests the formation of locally unstable regions of large shear in which broadband perturbations already present in the base flow undergo rapid amplification, followed by breakdown to small-scale motion. The cores of the primary vortices are significantly altered as a result of spanwise nonuniform excitation. The 3D features of the streamwise vortices and their interaction with the base flow are inferred from surfaces or rms velocity fluctuations and an approximation to cross-stream vorticity using 3D single component velocity data.

  1. X-ray diffuse scattering from threading dislocations in epitaxial GaN layers

    NASA Astrophysics Data System (ADS)

    Barchuk, M.; Holý, V.; Miljević, B.; Krause, B.; Baumbach, T.; Hertkorn, J.; Scholz, F.

    2010-08-01

    In this article, we combine diffuse x-ray scattering with a Monte Carlo simulation method for the determination of the dislocation density in thin heteroepitaxial layers. As a model, we consider GaN epitaxial layers containing threading dislocations perpendicular to the surface. The densities of particular types of threading dislocations following from the comparison of measured and simulated distributions of diffusely scattered x-ray intensity are compared with the dislocation densities determined by etching. A good agreement was found.

  2. Interface Electronic State Characterization of Plasma Enhanced Atomic Layer Deposited Dielectrics on GaN

    NASA Astrophysics Data System (ADS)

    Yang, Jialing

    In this dissertation, the interface chemistry and electronic structure of plasma-enhanced atomic layer deposited (PEALD) dielectrics on GaN are investigated with x-ray and ultraviolet photoemission spectroscopy (XPS and UPS). Three interrelated issues are discussed in this study: (1) PEALD dielectric growth process optimization, (2) interface electronic structure of comparative PEALD dielectrics on GaN, and (3) interface electronic structure of PEALD dielectrics on Ga- and N-face GaN. The first study involved an in-depth case study of PEALD Al2O3 growth using dimethylaluminum isopropoxide, with a special focus on oxygen plasma effects. Saturated and self-limiting growth of Al2O3 films were obtained with an enhanced growth rate within the PEALD temperature window (25--220 °C). The properties of Al2O3 deposited at various temperatures were characterized to better understand the relation between the growth parameters and film properties. In the second study, the interface electronic structures of PEALD dielectrics on Ga-face GaN films were measured. Five promising dielectrics (Al2O3, HfO2, SiO2, La2O 3, and ZnO) with a range of band gap energies were chosen. Prior to dielectric growth, a combined wet chemical and in-situ H 2/N2 plasma clean process was employed to remove the carbon contamination and prepare the surface for dielectric deposition. The surface band bending and band offsets were measured by XPS and UPS for dielectrics on GaN. The trends of the experimental band offsets on GaN were related to the dielectric band gap energies. In addition, the experimental band offsets were near the calculated values based on the charge neutrality level model. The third study focused on the effect of the polarization bound charge of the Ga- and N-face GaN on interface electronic structures. A surface pretreatment process consisting of a NH4OH wet chemical and an in-situ NH3 plasma treatment was applied to remove carbon contamination, retain monolayer oxygen coverage, and

  3. Microstructure of laterally overgrown GaN layers

    SciTech Connect

    Liliental-Weber, Zuzanna; Cherns, David

    2001-04-03

    Transmission electron microscopy study of plan-view and cross-section samples of epitaxial laterally overgrown (ELOG) GaN samples is described. Two types of dislocation with the same type of Burgers vector but different line direction have been observed. It is shown that threading edge dislocations bend to form dislocation segments in the c-plane as a result of shear stresses developed in the wing material along the stripe direction. It is shown that migration of these dislocations involves both glide and climb. Propagation of threading parts over the wing area is an indication of high density of point defects present in the wing areas on the ELOG samples. This finding might shed new light on the optical properties of such samples.

  4. Approximate analytical solution for waveguide excitation of a plane dielectric layer by a Gaussian beam at frustrated total internal reflection.

    PubMed

    Serdyuk, Vladimir; Rudnitsky, Anton

    2015-05-01

    We present an approximate 2D asymptotic analytic theory of light field excitation in a plane thin dielectric layer under conditions of frustrated total internal reflection, when an inclined Gaussian beam, falling from a triangular prism, excites a decaying field in air spacing between a prism and a plane dielectric. Ignoring the radiation scattering on the sharp edges of a prism, we have obtained the formulas that allow us to compute spatial structures of an electromagnetic field in every point of space and to estimate the integral efficiency of waveguide mode excitation in a plane dielectric layer and the total energy of a reflected beam. It is shown that the width of an initial Gaussian beam has an effect on waveguide mode intensity.

  5. Anisotropic strain relaxation and the resulting degree of polarization by one- and two-step growth in nonpolar a-plane GaN grown on r-sapphire substrate

    SciTech Connect

    Feng, Shih-Wei Chen, Yu-Yu; Lai, Chih-Ming; Tu, Li-Wei; Han, Jung

    2013-12-21

    Anisotropic strain relaxation and the resulting degree of polarization of the electronic transition in nonpolar a-plane GaN using one- and two-step growth are studied. By using two-step growth, a slower coalescence and a longer roughening-recovery process lead to larger anisotropic strain relaxation, a less striated surface, and lower densities of basal stacking fault (BSF) and prismatic stacking fault (PSF). It is suggested that anisotropic in-plane strains, surface striation, and BSF and PSF densities in nonpolar a-GaN are consequences of the rate of coalescence, the period of roughening-recovery process, and the degree of anisotropic strain relaxation. In addition, the two-step growth mode can enhance the degree of polarization of the electronic transition. The simulation results of the k⋅p perturbation approach show that the oscillator strength and degree of polarization of the electronic transition strongly depend on the in-plane strains upon anisotropic in-plane strain relaxation. The research results provide important information for optimized growth of nonpolar III-nitrides. By using two-step growth and by fabricating the devices on the high-quality nonpolar free-standing GaN substrates, high-efficiency nonpolar a-plane InGaN LEDs can be realized. Nonpolar a-plane InGaN/GaN LEDs can exhibit a strongly polarized light to improve the contrast, glare, eye discomfort and eye strain, and efficiency in display application.

  6. Selective-area growth of vertically oriented GaN nanostructures with a hafnium pre-orienting layer

    NASA Astrophysics Data System (ADS)

    Bae, S.-Y.; Lekhal, K.; Lee, H.-J.; Mitsunari, T.; Min, J.-W.; Lee, D.-S.; Kushimoto, M.; Honda, Y.; Amano, H.

    2017-06-01

    Severe melt-back etching has forced the epitaxy of GaN on Si to use an AlN buffer layer for growing high-quality two-dimensional layers, despite its high resistivity. Herein, we report a metal-based pre-orienting layer (POL) for growing GaN nanostructures (NSs) to replace the traditional AlN buffer layer. Two metals, titanium (Ti) and hafnium (Hf), were evaluated as POLs. We succeeded in fabricating arrays of GaN NSs with highly preferred orientation using selective-area growth. The crystallographic phase of the POLs critically affected the evolved orientation of the crystals. Photoluminescence measurements revealed that GaN NSs with Hf-based POLs were of reasonably high quality. We believe that this result will facilitate broader III-V semiconductor applications using alternative substrates moving beyond conventional Si-based optoelectronics.

  7. Half Layer By Half Layer Growth of a Blue Phosphorene Monolayer on a GaN(001) Substrate

    NASA Astrophysics Data System (ADS)

    Zeng, Jiang; Cui, Ping; Zhang, Zhenyu

    2017-01-01

    Black phosphorene (BlackP), consisting of a vertically corrugated yet single layer of phosphorus atoms, is a latest member of the expanding two-dimensional (2D) materials family with high carrier mobility and immense application potentials. Blue phosphorene (BlueP), an allotrope of BlackP with appealing properties of its own, consists of a more flatly arranged layer of phosphorus atoms. To date, direct growth of either BlackP or BlueP remains a daunting challenge. Using first-principles approaches, here we establish a novel kinetic pathway for fabricating BlueP via epitaxial growth. Our systematic energetic studies reveal that both BlackP and BlueP monolayers can be readily stabilized on Cu(111), Au(111), and GaN(001) substrates. The semiconducting GaN(001) is further shown to be superior for fabricating BlueP, through an intriguing half-layer-by-half-layer (HLBHL) growth mechanism. Within this scheme, the GaN(001) surface is first preferentially covered by a half layer of phosphorus adatoms, followed by the addition of the other half. Once formed, such a BlueP monolayer is thermodynamically stable, as tested using ab initio molecular dynamics simulations. The HLBHL growth mechanism discovered here may enable mass production of high-quality BlueP, and could also be instrumental in achieving epitaxial growth of BlackP and other 2D materials.

  8. Effect of ZnO seed layer on the morphology and optical properties of ZnO nanorods grown on GaN buffer layers

    SciTech Connect

    Nandi, R. Mohan, S. Major, S. S.; Srinivasa, R. S.

    2014-04-24

    ZnO nanorods were grown by chemical bath deposition on sputtered, polycrystalline GaN buffer layers with and without ZnO seed layer. Scanning electron microscopy and X-ray diffraction show that the ZnO nanorods on GaN buffer layers are not vertically well aligned. Photoluminescence spectrum of ZnO nanorods grown on GaN buffer layer, however exhibits a much stronger near-band-edge emission and negligible defect emission, compared to the nanorods grown on ZnO buffer layer. These features are attributed to gallium incorporation at the ZnO-GaN interface. The introduction of a thin (25 nm) ZnO seed layer on GaN buffer layer significantly improves the morphology and vertical alignment of ZnO-NRs without sacrificing the high optical quality of ZnO nanorods on GaN buffer layer. The presence of a thick (200 nm) ZnO seed layer completely masks the effect of the underlying GaN buffer layer on the morphology and optical properties of nanorods.

  9. Band alignment between GaN and ZrO{sub 2} formed by atomic layer deposition

    SciTech Connect

    Ye, Gang; Wang, Hong Arulkumaran, Subramaniam; Ng, Geok Ing; Li, Yang; Ang, Kian Siong; Liu, Zhi Hong

    2014-07-14

    The band alignment between Ga-face GaN and atomic-layer-deposited ZrO{sub 2} was investigated using X-ray photoelectron spectroscopy (XPS). The dependence of Ga 3d and Zr 3d core-level positions on the take-off angles indicated upward band bending at GaN surface and potential gradient in ZrO{sub 2} layer. Based on angle-resolved XPS measurements combined with numerical calculations, valence band discontinuity ΔE{sub V} of 1 ± 0.2 eV and conduction band discontinuity ΔE{sub C} of 1.2 ± 0.2 eV at ZrO{sub 2}/GaN interface were determined by taking GaN surface band bending and potential gradient in ZrO{sub 2} layer into account.

  10. Effect of substrate nitridation temperature on the persistent photoconductivity of unintentionally-doped GaN layer grown by PAMBE

    SciTech Connect

    Prakash, Nisha Barvat, Arun; Anand, Kritika; Choursia, B.; Kushvaha, S. S.; Singh, V. N.; Pal, Prabir; Khanna, Suraj P.

    2016-05-23

    The surface roughness and defect density of GaN epitaxial layers grown on c-plane sapphire substrate are investigated and found to be dependent on nitridation temperature. GaN epitaxial layers grown after nitridation of sapphire at 200°C have a higher defect density and higher surface roughness compared to the GaN layers grown at 646°C nitridation as confirmed by atomic force microscopy (AFM). The persistent photoconductivity (PPC) was observed in both samples and it was found to be decreasing with decreasing temperature in the range 150-300°C due to long carrier lifetime and high electron mobility at low temperature. The photoresponse of the GaN films grown in this study exhibit improved PPC due to their better surface morphology at 646°C nitrided sample. The point defects or extended microstructure defects limits the photocarrier lifetime and electron mobility at 200°C nitrided sample.

  11. GaN on Silicon Substrate with AlN Buffer Layer for UV Photodiode

    NASA Astrophysics Data System (ADS)

    Chuah, L. S.; Thahab, S. M.; Hassan, Z.

    Nitrogen plasma-assisted molecular beam epitaxy (PAMBE) deposited GaN thin films on (111) n-type silicon substrate with different thickness AlN buffer layers are investigated and distinguished by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and Raman scattering. The thickness of AlN buffer layer ranged from 200 nm to 300 nm. Besides that, the electrical characteristics of the GaN thin film for ultraviolet detecting utilizations are studied by calculating the photo current/dark current ratio on a metal-semiconductor-metal (MSM) photodiode with and without the illumination of Hg-lamp source. The devices have been tested over room temperature (RT). The photocurrent analysis, together with the study of Schottky barrier height (SBH) development, ascertain that the principal mechanism of photo transport is thermionic emission. The photocurrent value is rigorously dependent on Schottky barrier height. The GaN/AlN(200 nm)/n-Si MSM photodiode produces the highest photo/dark current ratio for the lowest strain that consists of the GaN film grown on the AlN (200 nm) buffer layer.

  12. Formation of manganese {delta}-doped atomic layer in wurtzite GaN

    SciTech Connect

    Shi Meng; Chinchore, Abhijit; Wang Kangkang; Mandru, Andrada-Oana; Liu Yinghao; Smith, Arthur R.

    2012-09-01

    We describe the formation of a {delta}-doped manganese layer embedded within c-plane wurtzite gallium nitride using a special molecular beam epitaxy growth process. Manganese is first deposited on the gallium-poor GaN (0001) surface, forming a {radical}(3) Multiplication-Sign {radical}(3)-R30 Degree-Sign reconstructed phase. This well-defined surface reconstruction is then nitrided using plasma nitridation, and gallium nitride is overgrown. The manganese content of the {radical}(3) Multiplication-Sign {radical}(3)-R30 Degree-Sign phase, namely one Mn per each {radical}(3) Multiplication-Sign {radical}(3)-R30 Degree-Sign unit cell, implies that the MnGaN alloy layer has a Mn concentration of up to 33%. The structure and chemical content of the surface are monitored beginning from the initial growth stage up through the overgrowth of 20 additional monolayers (MLs) of GaN. An exponential-like drop-off of the Mn signal with increasing GaN monolayers, as measured by Auger electron spectroscopy, indicates that the highly concentrated Mn layer remains at the {delta}-doped interface. A model of the resultant {delta}-doped structure is formulated based on the experimental data, and implications for possible spintronic applications are discussed.

  13. Highly conductive Ge-doped GaN epitaxial layers prepared by pulsed sputtering

    NASA Astrophysics Data System (ADS)

    Ueno, Kohei; Arakawa, Yasuaki; Kobayashi, Atsushi; Ohta, Jitsuo; Fujioka, Hiroshi

    2017-10-01

    Highly conductive Ge-doped GaN epitaxial layers were grown by low-temperature pulsed sputtering, and their fundamental structural and electrical properties were investigated. The room-temperature (RT) electron concentration was increased to 5.1 × 1020 cm‑3 by the Ge doping, and the atomically flat stepped and terraced surface and the crystalline quality of the layers were maintained. Consequently, the RT resistivity was reduced to 0.20 mΩ·cm, which is comparable to that for typical transparent conductive oxides such as indium tin oxide. The contact resistance of Ge-doped GaN with a Ti/Al/Ti/Au metal stack prepared without annealing was as low as 0.087 Ω·mm. Furthermore, the selective formation of a Ge-doped region using an SiO2 mask was demonstrated. The results clearly indicate the strong potential of pulsed sputtering Ge-doped GaN growth for forming low-parasitic-resistance contact layers of various electrical and optical devices.

  14. Fabrication of well-aligned ZnO nanorods by hydrothermal process using GaN epitaxial layer

    NASA Astrophysics Data System (ADS)

    Jang, Jae-Min; Yi, Sung-Hak; Choi, Seung-Kyu; Kim, Jung-A.; Jung, Woo-Gwang

    2007-02-01

    One dimensional (1-D) ZnO nanorod structure of hexagonal shape was fabricated on epitaxial GaN layer by hydrothermal method. The growth of GaN epitaxial layer was carried out in a two-flow horizontal MOCVD reactor maintained at a pressure of 200 torr. Firstly, a 25 nm thick GaN buffer layer was grown at 520 °C. Then 2~3μm thick GaN epilayer was deposited at 1070 °C. Trimethylgallium (TMG) and NH 3 were used as Ga and N source, and H II gas was used as carrier gas. After the deposition of GaN epilayer thin-film, single crystalline ZnO nanorod was fabricated in aqueous solution. XRD and FE-SEM results showed ZnO nanorod arrays were oriented highly along the (002) plane. The ZnO nanorod was analyzed to have good quality crystallization by FE-TEM. The SAED pattern has shown that ZnO nanorod was grown in the direction along (002)-plane. Photoluminescence (PL) has shown that the GaN-ZnO hetero-structure has shown ultra-violet lasing action at room temperature. Narrow and strong ultra-violet peak was observed in comparison with PL result from epitaxial GaN layer. The analysis results have proved that aqueous solution growth method developed in the present work can be a good application for optical electronic device.

  15. Chemical Sputtering of GaN Crystal with a Chlorine-Adsorbed Layer

    NASA Astrophysics Data System (ADS)

    Harafuji, Kenji; Kawamura, Katsuyuki

    2010-08-01

    A molecular dynamics simulation has been carried out to investigate the chemical sputtering of wurtzite-type GaN(0001) surfaces with and without a Cl-adsorbed layer. Sputtering of crystalline atoms is examined with Ar impacts at energies less than 250 eV. Ga sputtering does not take place at all on the clean surface without Cl-adsorption. On the other hand, Ga sputtering yield has a large finite value for Ar impact on the Cl-adsorbed surface. Generally, Ga is sputtered in the form of Ga-Cl2, and sometimes in the form of Ga-Cl, Ga-N-Cl, Ga-N, and Ga-N-Ga-Cl2. Ga atoms are not singly sputtered. Atoms escape from the surface in the time range of 200-3000 fs after the impact of the incident Ar atom. The shorter and longer escape times correspond to physical and chemical sputtering, respectively.

  16. Strained layer relaxation effect on current crowding and efficiency improvement of GaN based LED

    NASA Astrophysics Data System (ADS)

    Aurongzeb, Deeder

    2012-02-01

    Efficiency droop effect of GaN based LED at high power and high temperature is addressed by several groups based on career delocalization and photon recycling effect(radiative recombination). We extend the previous droop models to optical loss parameters. We correlate stained layer relaxation at high temperature and high current density to carrier delocalization. We propose a third order model and show that Shockley-Hall-Read and Auger recombination effect is not enough to account for the efficiency loss. Several strained layer modification scheme is proposed based on the model.

  17. Stress engineering in GaN structures grown on Si(111) substrates by SiN masking layer application

    SciTech Connect

    Szymański, Tomasz Wośko, Mateusz; Paszkiewicz, Bogdan; Paszkiewicz, Regina

    2015-07-15

    GaN layers without and with an in-situ SiN mask were grown by using metal organic vapor phase epitaxy for three different approaches used in GaN on silicon(111) growth, and the physical and optical properties of the GaN layers were studied. For each approach applied, GaN layers of 1.4 μm total thickness were grown, using silan SiH{sub 4} as Si source in order to grow Si{sub x}N{sub x} masking layer. The optical micrographs, scanning electron microscope images, and atomic force microscope images of the grown samples revealed cracks for samples without SiN mask, and micropits, which were characteristic for the samples grown with SiN mask. In situ reflectance signal traces were studied showing a decrease of layer coalescence time and higher degree of 3D growth mode for samples with SiN masking layer. Stress measurements were conducted by two methods—by recording micro-Raman spectra and ex-situ curvature radius measurement—additionally PLs spectra were obtained revealing blueshift of PL peak positions with increasing stress. The authors have shown that a SiN mask significantly improves physical and optical properties of GaN multilayer systems reducing stress in comparison to samples grown applying the same approaches but without SiN masking layer.

  18. Interaction Between the Laminar Boundary Layer Over a Plane Surface and an Incident Oblique Shock Wave

    DTIC Science & Technology

    1949-01-24

    observed if an oblique shock of given atreagth- io ^made to strike a* plane surface closer.and closer te the leading edge. TM osthoda utilized in the...of the bouKdary leye ?. In the ] present paper it vill be. shown that this "feedback" phenomenon, vhich has no ""^ "j couhtörpart in subsonic- f...Because, of the approximations introduced ill the present stvdy, a . Mghly refined treatment of *, IO

  19. Structures and optical properties of \\text{H}_{2}^{+} -implanted GaN epi-layers

    NASA Astrophysics Data System (ADS)

    Li, B. S.; Wang, Z. G.

    2015-06-01

    The implantation damage build-up and optical properties of GaN epitaxial films under \\text{H}2+ ion implantation have been investigated by a combination of Rutherford backscattering in channeling geometry, Raman spectroscopy, UV-visible spectroscopy and transmission electron microscopy. GaN epitaxial films were implanted with 134 keV \\text{H}2+ ions to doses ranging from 3.75   ×   1016 to 1.75   ×   1017 \\text{H}2+  cm-2 at room temperature or the same dose of 1.5   ×   1017 \\text{H}2+  cm-2 at room temperature, 573 and 723 K. The dependence of lattice disorder induced by \\text{H}2+ -implantation on the ion dose can be divided into a three-step damage process. A strong influence of the H concentration on the defect accumulation is discussed. The decrease in relative Ga disorder induced by \\text{H}2+ -implantation is linear with increasing implantation temperature. The absorption coefficient of GaN epitaxial films increases with increasing ion dose, leading to the decrease in Raman scattering spectra of Ga-N vibration. With increasing implantation doses up to 5   ×   1016 \\text{H}2+  cm-2, nanoscale hydrogen bubbles are observed in the H deposition peak region. Interstitial-type dislocation loops are observed in the damaged layer located near the damage peak region, and the geometry of the dislocation loops produced by H implantation is analyzed. The surface layer is almost free of lattice disorder induced by \\text{H}2+ -implantation.

  20. Engineering of optical polarization based on electronic band structures of A-plane ZnO layers under biaxial strains

    SciTech Connect

    Matsui, Hiroaki Tabata, Hitoshi; Hasuike, Noriyuki; Harima, Hiroshi

    2014-09-21

    In-plane anisotropic strains in A-plane layers on the electronic band structure of ZnO were investigated from the viewpoint of optical polarization anisotropy. Investigations utilizing k·p perturbation theory revealed that energy transitions and associated oscillation strengths were dependent on in-plane strains. The theoretical correlation between optical polarizations and in-plane strains was experimentally demonstrated using A-plane ZnO layers with different in-plane strains. Finally, optical polarization anisotropy and its implications for in-plane optical properties are discussed in relation to the energy shift between two orthogonal directions. Higher polarization rotations were obtained in an A-plane ZnO layer with in-plane biaxially compressive strains as compared to strain-free ZnO. This study provides detailed information concerning the role played by in-plane strains in optically polarized applications based on nonpolar ZnO in the ultra-violet region.

  1. Nearly 4-Inch-Diameter Free-Standing GaN Wafer Fabricated by Hydride Vapor Phase Epitaxy with Pit-Inducing Buffer Layer

    NASA Astrophysics Data System (ADS)

    Sato, Tadashige; Okano, Shinya; Goto, Takenari; Yao, Takafumi; Seto, Ritsu; Sato, Akira; Goto, Hideki

    2013-08-01

    A free-standing GaN wafer was fabricated by depositing a GaN buffer that induced the formation of pits (hereafter, pit-inducing GaN buffer) on a low-temperature-grown GaN buffer on the sapphire substrate. A high-temperature-grown GaN layer was grown on the pit-inducing GaN buffer that induced the formation of pits on the high-temperature-grown GaN layer. The pit-inducing buffer suppresses crack formation in the thick GaN film thereby releasing growth stress. Thermal stress in GaN on a sapphire system is also discussed on the basis of calculations utilizing a bilayer model. We have succeeded in the fabrication of a nearly 4-in.-diameter free-standing GaN thick wafer with a pit-inducing GaN buffer by one-stop hydride vapor phase epitaxy, which will lead to a low-cost fabrication of free-standing GaN wafers.

  2. Probing temperature gradients within the GaN buffer layer of AlGaN/GaN high electron mobility transistors with Raman thermography

    SciTech Connect

    Hodges, C. Pomeroy, J.; Kuball, M.

    2014-02-14

    We demonstrate the ability of confocal Raman thermography using a spatial filter and azimuthal polarization to probe vertical temperature gradients within the GaN buffer layer of operating AlGaN/GaN high electron mobility transistors. Temperature gradients in the GaN layer are measured by using offset focal planes to minimize the contribution from different regions of the GaN buffer. The measured temperature gradient is in good agreement with a thermal simulation treating the GaN thermal conductivity as homogeneous throughout the layer and including a low thermal conductivity nucleation layer to model the heat flow between the buffer and substrate.

  3. Improved performance of GaN based light emitting diodes with ex-situ sputtered AlN nucleation layers

    SciTech Connect

    Chen, Shuo-Wei; Li, Heng; Lu, Tien-Chang

    2016-04-15

    The crystal quality, electrical and optical properties of GaN based light emitting diodes (LEDs) with ex-situ sputtered physical vapor deposition (PVD) aluminum nitride (AlN) nucleation layers were investigated. It was found that the crystal quality in terms of defect density and x-ray diffraction linewidth was greatly improved in comparison to LEDs with in-situ low temperature GaN nucleation layer. The light output power was 3.7% increased and the reverse bias voltage of leakage current was twice on LEDs with ex-situ PVD AlN nucleation layers. However, larger compressive strain was discovered in LEDs with ex-situ PVD AlN nucleation layers. The study shows the potential and constrain in applying ex-situ PVD AlN nucleation layers to fabricate high quality GaN crystals in various optoelectronics.

  4. Significant improvement of GaN crystal quality with ex-situ sputtered AlN nucleation layers

    NASA Astrophysics Data System (ADS)

    Chen, Shuo-Wei; Yang, Young; Wen, Wei-Chih; Li, Heng; Lu, Tien-Chang

    2016-03-01

    Ex-situ sputtered AlN nucleation layer has been demonstrated effective to significantly improve crystal quality and electrical properties of GaN epitaxy layers for GaN based Light-emitting diodes (LEDs). In this report, we have successfully reduced X-ray (102) FWHM from 240 to 110 arcsec, and (002) FWHM from 230 to 101 arcsec. In addition, reverse-bias voltage (Vr) increased around 20% with the sputtered AlN nucleation layer. Furthermore, output power of LEDs grown on sputtered AlN nucleation layer can be improved around 4.0% compared with LEDs which is with conventional GaN nucleation layer on pattern sapphire substrate (PSS).

  5. Improved performance of GaN based light emitting diodes with ex-situ sputtered AlN nucleation layers

    NASA Astrophysics Data System (ADS)

    Chen, Shuo-Wei; Li, Heng; Lu, Tien-Chang

    2016-04-01

    The crystal quality, electrical and optical properties of GaN based light emitting diodes (LEDs) with ex-situ sputtered physical vapor deposition (PVD) aluminum nitride (AlN) nucleation layers were investigated. It was found that the crystal quality in terms of defect density and x-ray diffraction linewidth was greatly improved in comparison to LEDs with in-situ low temperature GaN nucleation layer. The light output power was 3.7% increased and the reverse bias voltage of leakage current was twice on LEDs with ex-situ PVD AlN nucleation layers. However, larger compressive strain was discovered in LEDs with ex-situ PVD AlN nucleation layers. The study shows the potential and constrain in applying ex-situ PVD AlN nucleation layers to fabricate high quality GaN crystals in various optoelectronics.

  6. Leakage currents and Fermi-level shifts in GaN layers upon iron and carbon-doping

    NASA Astrophysics Data System (ADS)

    Fariza, A.; Lesnik, A.; Neugebauer, S.; Wieneke, M.; Hennig, J.; Bläsing, J.; Witte, H.; Dadgar, A.; Strittmatter, A.

    2017-07-01

    Semi-insulating GaN is a prerequisite for lateral high frequency and high power electronic devices to isolate the device region from parasitic conductive channels. The commonly used dopants for achieving semi-insulating GaN, Fe, and C cause distinct properties of GaN layers since the Fermi-level is located either above (Fe) or below (C) the midgap position. In this study, precursor-based doping of GaN in metalorganic vapor phase epitaxy is used at otherwise identical growth conditions to control the dopant concentrations in the layer. Using electric force microscopy, we have investigated the contact potentials of Fe- and C-doped samples with respect to a cobalt metal probe tip in dependence of on the dopant concentration. While in Fe-doped samples the sign of the contact potential is constant, a change from positive to negative contact potential values is observed at high carbon concentrations, indicating the shift of the Fermi-level below the midgap position. In vertical transport measurements, C-doped GaN layers with a dopant concentration of 4.6 × 1018 cm-3 exhibit up to 5 orders of magnitude lower dark current at room temperature and significantly lower temperature dependence than Fe-doped samples with a similar dopant concentration. Therefore, precursor-based carbon doping is the superior doping technique to achieve semi-insulating GaN.

  7. Dry etching of MgCaO gate dielectric and passivation layers on GaN

    NASA Astrophysics Data System (ADS)

    Hlad, M.; Voss, L.; Gila, B. P.; Abernathy, C. R.; Pearton, S. J.; Ren, F.

    2006-09-01

    MgCaO films grown by rf plasma-assisted molecular beam epitaxy and capped with Sc 2O 3 are promising candidates as surface passivation layers and gate dielectrics on GaN-based high electron mobility transistors (HEMTs) and metal-oxide semiconductor HEMTs (MOS-HEMTs), respectively. Two different plasma chemistries were examined for etching these thin films on GaN. Inductively coupled plasmas of CH 4/H 2/Ar produced etch rates only in the range 20-70 Å/min, comparable to the Ar sputter rates under the same conditions. Similarly slow MgCaO etch rates (˜100 Å/min) were obtained with Cl 2/Ar discharges under the same conditions, but GaN showed rates almost an order of magnitude higher. The MgCaO removal rates are limited by the low volatilities of the respective etch products. The CH 4/H 2/Ar plasma chemistry produced a selectivity of around 2 for etching the MgCaO with respect to GaN.

  8. Low temperature thin film transistors with hollow cathode plasma-assisted atomic layer deposition based GaN channels

    SciTech Connect

    Bolat, S. E-mail: aokyay@ee.bilkent.edu.tr; Tekcan, B.; Ozgit-Akgun, C.; Biyikli, N.; Okyay, A. K. E-mail: aokyay@ee.bilkent.edu.tr

    2014-06-16

    We report GaN thin film transistors (TFT) with a thermal budget below 250 °C. GaN thin films are grown at 200 °C by hollow cathode plasma-assisted atomic layer deposition (HCPA-ALD). HCPA-ALD-based GaN thin films are found to have a polycrystalline wurtzite structure with an average crystallite size of 9.3 nm. TFTs with bottom gate configuration are fabricated with HCPA-ALD grown GaN channel layers. Fabricated TFTs exhibit n-type field effect characteristics. N-channel GaN TFTs demonstrated on-to-off ratios (I{sub ON}/I{sub OFF}) of 10{sup 3} and sub-threshold swing of 3.3 V/decade. The entire TFT device fabrication process temperature is below 250 °C, which is the lowest process temperature reported for GaN based transistors, so far.

  9. MOCVD of BN and GaN thin films on silicon: new attempt of GaN growth with BN buffer layer

    NASA Astrophysics Data System (ADS)

    Boo, Jin-Hyo; Rohr, Carsten; Ho, Wilson

    1998-06-01

    Highly oriented polycrystalline h-BN thin films were deposited on silicon substrates in the temperature range of 600-900°C from the single molecular precursor of borane-triethylamine complex, (C 2H 5) 3N : BH 3, by supersonic jet assisted chemical vapor deposition. Hydrogen was used as carrier gas, and additional nitrogen was supplied by either ammonia through a nozzle or nitrogen via a remote microwave plasma. Hexagonal GaN films were also grown on Si(1 0 0) with h-BN buffer layers at temperatures between 550 and 750°C with dual supersonic molecular beam sources. Triethylgallium, (C 2H 5) 3Ga, and ammonia, NH 3, were used as precursors. Hydrogen was used as seeding gas for the precursors, providing a wide range of possible kinetic energies for the supersonic beams. The h-BN buffer layers and the GaN films were characterized in situ by Auger electron spectroscopy (AES), and ex situ by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), and optical transmission. This is the first report of growing the h-BN films on silicon substrates from the single source precursor of borane-triethylamine complex and new attempts of GaN film growth on silicon with BN buffer layer.

  10. Hydride-vapor-phase epitaxial growth of highly pure GaN layers with smooth as-grown surfaces on freestanding GaN substrates

    NASA Astrophysics Data System (ADS)

    Fujikura, Hajime; Konno, Taichiro; Yoshida, Takehiro; Horikiri, Fumimasa

    2017-08-01

    Thick (20-30 µm) layers of highly pure GaN with device-quality smooth as-grown surfaces were prepared on freestanding GaN substrates by using our advanced hydride-vapor-phase epitaxy (HVPE) system. Removal of quartz parts from the HVPE system markedly reduced concentrations of residual impurities to below the limits of detection by secondary-ion mass spectrometry. Appropriate gas-flow management in the HVPE system realized device-quality, smooth, as-grown surfaces with an excellent uniformity of thickness. The undoped GaN layer showed insulating properties. By Si doping, the electron concentration could be controlled over a wide range, down to 2 × 1014 cm-3, with a maximum mobility of 1150 cm2·V-1·s-1. The concentration of residual deep levels in lightly Si-doped layers was in the 1014 cm-3 range or less throughout the entire 2-in. wafer surface. These achievements clearly demonstrate the potential of HVPE as a tool for epitaxial growth of power-device structures.

  11. Terahertz absorption in GaN epitaxial layers under lateral electric field

    NASA Astrophysics Data System (ADS)

    Balagula, R. M.; Vinnichenko, M. Ya; Melentev, G. A.; Moldavskaya, M. D.; Shalygin, V. A.; Vorobjev, L. E.; Firsov, D. A.; Danilov, S. N.; Suihkonen, S.

    2016-08-01

    Variation of absorption of terahertz radiation in lateral electric field was investigated in GaN epitaxial layers. Different behaviour of the absorption modulation in electric field was observed for radiation polarized along electric field and perpendicular to it. Joint analysis of optical and transport measurements let us obtain field dependencies of mobility, electron concentration and absorption cross-section. For terahertz radiation polarized perpendicular to the electric field, results are in accordance with Drude model of free electron absorption. Another polarization demonstrates significant deviation that is yet to be studied more thoroughly.

  12. Surface state of GaN after rapid-thermal-annealing using AlN cap-layer

    NASA Astrophysics Data System (ADS)

    El-Zammar, G.; Khalfaoui, W.; Oheix, T.; Yvon, A.; Collard, E.; Cayrel, F.; Alquier, D.

    2015-11-01

    Critical issues need to be overcome to produce high performance Schottky diodes on gallium nitride (GaN). To activate dopant, high temperature thermal treatments are required but damage GaN surface where hexagonal pits appear and prevent any device processing. In this paper, we investigated the efficiency of cap-layers on GaN during thermal treatments to avoid degradation. Aluminum nitride (AlN) and silicon oxide (SiOx) were grown on GaN by direct current reactive magnetron sputtering and plasma-enhanced chemical vapor deposition, respectively. AlN growth parameters were studied to understand their effect on the grown layers and their protection efficiency. Focused ion beam was used to measure AlN layer thickness. Crystalline quality and exact composition were verified using X-ray diffraction and energy dispersive X-ray spectroscopy. Two types of rapid thermal annealing at high temperatures were investigated. Surface roughness and pits density were evaluated using atomic force microscopy and scanning electron microscopy. Cap-layers wet etching was processed in H3PO4 at 120 °C for AlN and in HF (10%) for SiOx. This work reveals effective protection of GaN during thermal treatments at temperatures as high as 1150 °C. Low surface roughness was obtained. Furthermore, no hexagonal pit was observed on the surface.

  13. Silicon implantation in epitaxial GaN layers: Encapsulant annealing and electrical properties

    NASA Astrophysics Data System (ADS)

    Matsunaga, S.; Yoshida, S.; Kawaji, T.; Inada, T.

    2004-03-01

    Silicon ions have been implanted into GaN layers epitaxially grown on an AlN/(0001)-Al2O3 substrate to a dose of 1×1015/cm2. The Si-implanted GaN has been rapid thermal annealed at temperatures between 800 and 1250 °C. Thermal pits are formed in the surface during annealing at 1200 °C, resulting in deterioration of the morphology. The surface deterioration is effectively suppressed by using a 140-nm-thick Si3N4 film as an encapsulant during annealing up to 1250 °C. The electrical activation process for Si atoms has an activation energy of 3.1 eV in the range of 1000 to 1250 °C. Carrier concentration and mobility profiles for n-type layers formed by Si implantation have been examined by differential Hall-effect measurements. A very high electrical activity for implanted Si atoms of 86% can be achieved, and a highly doped n-type layer with a peak carrier concentration of 6×1019/cm3 is formed after annealing at 1250 °C. Electrons generated from Si atoms located near the end of range are trapped by defects remaining after annealing at 1250 °C.

  14. Output power enhancement of GaN light emitting diodes with p-type ZnO hole injection layer

    NASA Astrophysics Data System (ADS)

    Kim, B. J.; Ryu, Y. R.; Lee, T. S.; White, H. W.

    2009-03-01

    We report an enhancement of the optical output power of GaN light emitting diodes (LEDs) by addition of a p-type ZnO layer located in close proximity to the active layer (ZnO/GaN LEDs). Arsenic (As)-doped p-ZnO was used as a hole-injecting layer to overcome the drop in external quantum efficiency of GaN LEDs at high drive currents—the so-called "efficiency droop." The output power in ZnO/GaN LEDs was improved up to 40%. This result is useful for development of highly efficient GaN LEDs operating at high current densities that will play a critical role in replacement of incandescent lamps by high efficiency solid-state light bulbs.

  15. Improvement of luminescence properties of GaN buffer layer for fast nitride scintillator structures

    NASA Astrophysics Data System (ADS)

    Hubáček, T.; Hospodková, A.; Oswald, J.; Kuldová, K.; Pangrác, J.

    2017-04-01

    We have optimized technology of GaN buffer layer growth with respect to the application in fast scintillation structures. The deep defect luminescence so called yellow band (YB) with decay time up to tens of microseconds is undesired for these applications and should be suppressed or at least the ratio of intensities of excitonic to YB maximum has to be considerably increased. The required photoluminescence properties were achieved by optimization of growth parameters of nucleation and coalescence layer on sapphire substrate. We have shown that decrease of NH3 flow, decrease of coalescence temperature, increase of nucleation time and nucleation pressure lead to improvement of the structure and luminescence properties of the buffer layer. Results indicate a significant increased ratio of excitonic/YB luminescence intensity.

  16. A study of the optical and polarisation properties of InGaN/GaN multiple quantum wells grown on a-plane and m-plane GaN substrates

    PubMed Central

    Kundys, Dmytro; Sutherland, Danny; Davies, Matthew J.; Oehler, Fabrice; Griffiths, James; Dawson, Philip; Kappers, Menno J.; Humphreys, Colin J.; Schulz, Stefan; Tang, Fengzai; Oliver, Rachel A.

    2016-01-01

    Abstract We report on a comparative study of the low temperature emission and polarisation properties of InGaN/GaN quantum wells grown on nonpolar (112¯0) a-plane and (101¯0) m-plane free-standing bulk GaN substrates where the In content varied from 0.14 to 0.28 in the m-plane series and 0.08 to 0.21 for the a-plane series. The low temperature photoluminescence spectra from both sets of samples are broad with full width at half maximum height increasing from 81 to 330 meV as the In fraction increases. Photoluminescence excitation spectroscopy indicates that the recombination mainly involves strongly localised carriers. At 10 K the degree of linear polarisation of the a-plane samples is much smaller than of the m-plane counterparts and also varies across the spectrum. From polarisation-resolved photoluminescence excitation spectroscopy we measured the energy splitting between the lowest valence sub-bands to lie in the range of 23–54 meV for the a- and m-plane samples in which we could observe distinct exciton features. Thus the thermal occupation of a higher valence sub-band cannot be responsible for the reduction of the degree of linear polarisation at 10 K. Time-resolved spectroscopy indicates that in a-plane samples there is an extra emission component which is at least partly responsible for the reduction in the degree of linear polarisation. PMID:27933113

  17. MOCVD of ZnO thin films for potential use as compliant layers for GaN on Si

    NASA Astrophysics Data System (ADS)

    Black, Kate; Jones, Anthony C.; Chalker, Paul R.; Gaskell, Jeffrey M.; Murray, Robert T.; Joyce, Tim B.; Rushworth, Simon A.

    2008-03-01

    This paper explores the use of nanostructured zinc oxide (ZnO) films as a compliant buffer layer for the growth of gallium nitride (GaN) on silicon substrates. Thin films of ZnO have been deposited on silicon (1 1 1) substrates by liquid injection metalorganic chemical vapour deposition (MOCVD) using dimethyl zinc-tetrahydrofuran adduct and oxygen. The use of the adduct complex avoids pre-reaction between the dialkyl zinc complex and oxygen which has been observed elsewhere. ZnO films deposited by this method were stoichiometric and of high purity, with no detectable carbon contamination. Films were deposited over a temperature range 350-550 °C, and exhibited a nanowire-like morphology. Subsequent deposition of GaN layers grown by molecular beam epitaxy (MBE) on the ZnO film resulted in the transformation of the nanowires to gallium oxide, accompanied by virtually complete removal of zinc from the layer. A heteroepitaxially oriented ( c-axis) GaN/gallium oxide/silicon structure was produced after the nitride deposition which consisted of characteristic columnar GaN with the GaN[0 0 0 1]||Si [1 1 1]. Selective area electron diffraction of the by-product oxide interlayer showed a polycrystalline-like behaviour that gave rise to a random azimuthal distribution of the GaN grains.

  18. Nanostructured graded-index antireflection layer formation on GaN for enhancing light extraction from light-emitting diodes

    NASA Astrophysics Data System (ADS)

    Dylewicz, R.; Khokhar, A. Z.; Wasielewski, R.; Mazur, P.; Rahman, F.

    2012-05-01

    We describe the fabrication and characterization of a randomly etched gallium nitride (GaN) surface for enhancing light extraction from light-emitting diodes. Our technique uses silica spheres as nano-targets in a sputter-etch process and produces a fine-grained surface with features around 35 nm. The textured surface layer acts as a graded refractive index layer with antireflection properties. Measurements show that photoluminescence intensity from such treated surfaces on a GaN LED wafer increases 2.2 times over that from pristine surfaces. These findings are also supported by computer modelling studies described here.

  19. Influence of an electric field on the ferromagnetic resonance in a plane-layered magnetic system

    NASA Astrophysics Data System (ADS)

    Karashtin, E. A.; Fraerman, A. A.

    2016-11-01

    The influence of an electric field on the ferromagnetic resonance (FMR) in a multilayer magnetic system consisting of two magnetic layers separated by a thin nonmagnetic interlayer has been investigated. It has been shown that, upon the excitation of magnetization oscillations by a microwave magnetic field, the eigenfrequencies of the ferromagnetic resonance depend on the stationary electric field applied in the plane of the layers. It has also been demonstrated that, in this system, high-frequency magnetization oscillations can be excited by an electric microwave field. The results of the investigation of the polarization properties of the excitation mechanism indicate that this effect can be observed experimentally.

  20. Numerical simulation of a plane turbulent mixing layer, with applications to isothermal, rapid reactions

    NASA Technical Reports Server (NTRS)

    Lin, P.; Pratt, D. T.

    1987-01-01

    A hybrid method has been developed for the numerical prediction of turbulent mixing in a spatially-developing, free shear layer. Most significantly, the computation incorporates the effects of large-scale structures, Schmidt number and Reynolds number on mixing, which have been overlooked in the past. In flow field prediction, large-eddy simulation was conducted by a modified 2-D vortex method with subgrid-scale modeling. The predicted mean velocities, shear layer growth rates, Reynolds stresses, and the RMS of longitudinal velocity fluctuations were found to be in good agreement with experiments, although the lateral velocity fluctuations were overpredicted. In scalar transport, the Monte Carlo method was extended to the simulation of the time-dependent pdf transport equation. For the first time, the mixing frequency in Curl's coalescence/dispersion model was estimated by using Broadwell and Breidenthal's theory of micromixing, which involves Schmidt number, Reynolds number and the local vorticity. Numerical tests were performed for a gaseous case and an aqueous case. Evidence that pure freestream fluids are entrained into the layer by large-scale motions was found in the predicted pdf. Mean concentration profiles were found to be insensitive to Schmidt number, while the unmixedness was higher for higher Schmidt number. Applications were made to mixing layers with isothermal, fast reactions. The predicted difference in product thickness of the two cases was in reasonable quantitative agreement with experimental measurements.

  1. Entrainment of a magnetic fluid by the moving boundary of a plane-parallel layer

    SciTech Connect

    Korovin, V.M.; Raikher, Yu.L.

    1987-07-01

    The authors construct a flow model depicting the entrainment and consequent loss of a magnetic liquid flowing in a magnetic field under film and laminar flow conditions at a moving boundary layer. Magnetohydrodynamic and other forces, such as surface tension, are incorporated in the model. It is tested against experimental data for a colloid of iron in kerosene under the postulated conditions.

  2. Molecular beam epitaxy of 2D-layered gallium selenide on GaN substrates

    NASA Astrophysics Data System (ADS)

    Lee, Choong Hee; Krishnamoorthy, Sriram; O'Hara, Dante J.; Brenner, Mark R.; Johnson, Jared M.; Jamison, John S.; Myers, Roberto C.; Kawakami, Roland K.; Hwang, Jinwoo; Rajan, Siddharth

    2017-03-01

    Large area epitaxy of two-dimensional (2D) layered materials with high material quality is a crucial step in realizing novel device applications based on 2D materials. In this work, we report high-quality, crystalline, large-area gallium selenide (GaSe) films grown on bulk substrates such as c-plane sapphire and gallium nitride (GaN) using a valved cracker source for Se. (002)-Oriented GaSe with random in-plane orientation of domains was grown on sapphire and GaN substrates at a substrate temperature of 350-450 °C with complete surface coverage. Higher growth temperature (575 °C) resulted in the formation of single-crystalline ɛ-GaSe triangular domains with six-fold symmetry confirmed by in-situ reflection high electron energy diffraction and off-axis x-ray diffraction. A two-step growth method involving high temperature nucleation of single crystalline domains and low temperature growth to enhance coalescence was adopted to obtain continuous (002)-oriented GaSe with an epitaxial relationship with the substrate. While six-fold symmetry was maintained in the two step growth, β-GaSe phase was observed in addition to the dominant ɛ-GaSe in cross-sectional scanning transmission electron microscopy images. This work demonstrates the potential of growing high quality 2D-layered materials using molecular beam epitaxy and can be extended to the growth of other transition metal chalcogenides.

  3. Weakly nonlinear models for turbulent mixing in a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Liou, William W.; Morris, Philip J.

    1992-01-01

    New closure models for turbulent free shear flows are presented in this paper. They are based on a weakly nonlinear theory with a description of the dominant large-scale structures as instability waves. Two models are presented that describe the evolution of the free shear flows in terms of the time-averaged mean flow and the dominant large-scale turbulent structure. The local characteristics of the large-scale motions are described using linear theory. Their amplitude is determined from an energy integral analysis. The models have been applied to the study of an incompressible mixing layer. For both models, predictions of the mean flow developed are made. In the second model, predictions of the time-dependent motion of the large-scale structures in the mixing layer are made. The predictions show good agreement with experimental observations.

  4. Weakly nonlinear models for turbulent mixing in a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Liou, William W.; Morris, Philip J.

    1992-01-01

    New closure models for turbulent free shear flows are presented in this paper. They are based on a weakly nonlinear theory with a description of the dominant large-scale structures as instability waves. Two models are presented that describe the evolution of the free shear flows in terms of the time-averaged mean flow and the dominant large-scale turbulent structure. The local characteristics of the large-scale motions are described using linear theory. Their amplitude is determined from an energy integral analysis. The models have been applied to the study of an incompressible mixing layer. For both models, predictions of the mean flow developed are made. In the second model, predictions of the time-dependent motion of the large-scale structures in the mixing layer are made. The predictions show good agreement with experimental observations.

  5. The three-dimensional evolution of a plane mixing layer - The Kelvin-Helmholtz rollup

    NASA Technical Reports Server (NTRS)

    Rogers, Michael M.; Moser, Robert D.

    1992-01-01

    The hydrodynamic evolution of an incompressible plane mixing layer is addressed to elucidate scalar mixing in free shear flows. A detailed description of the onset of three-dimensionality in a mixing layer before or in the absence of pairing is presented. Various simulations were performed to investigate the sensitivity of these results to variations in initial conditions. These variations included changes in amplitude, wavelength, functional form, and relative phasing of the initial low-wavenumber disturbances. Pierrehumber and Widnall's (1982) translative instability eigenfunctions are found to include rib vortices in the braid region and oppositely signed streamwise vorticity in the roller core. The translative instability is an instability of the late-time oversaturated flow. Three-dimensional perturbation growth similar to that of the translative instability can occur whenever spanwise vorticity is present in the braid region. The nonlinear effects that occur when the initial rib circulation is sufficiently high are discussed.

  6. Surface modification of a-plane sapphire substrates and its effect on crystal orientation of ZnTe layer

    NASA Astrophysics Data System (ADS)

    Nakasu, Taizo; Sun, Wei-Che; Kobayashi, Masakazu

    2017-01-01

    Domain structures of ZnTe layers grown on a-plane sapphire substrates were investigated by changing the crystallographic properties of the surface and interface. Pole figure images were obtained and we investigated the domain structure in the grown film and the orientation relationships between films and substrates. It was confirmed that two kinds of {111} domains were oriented by annealing the buffer layer at 350 °C, while the (100) domain was obtained by annealing the buffer layer at 300 °C. From the results of the rocking curve measurement, the introduction of a step-terrace surface through the high-temperature treatment of the substrate resulted in an improved crystallographic quality. However, it did not affect the domain structure in the layer. The introduction of an off-angle on the substrate surface resulted in the formation of a single (111) domain layer. These crystallographic features were mainly affected by the surface atom arrangement of the sapphire substrate and its chemical nature.

  7. Low dislocation GaN via defect-filtering, self-assembled SiO2-sphere layers.

    SciTech Connect

    Wang, George T.; Li, Qiming

    2009-09-01

    The III-nitride (AlGaInN) materials system forms the foundation for white solid-state lighting, the adoption of which could significantly reduce U.S. energy needs. While the growth of GaN-based devices relies on heteroepitaxy on foreign substrates, the heteroepitaxial layers possess a high density of dislocations due to poor lattice and thermal expansion match. These high dislocation densities have been correlated with reduced internal quantum efficiency and lifetimes for GaN-based LEDs. Here, we demonstrate an inexpensive method for dislocation reduction in GaN grown on sapphire and silicon substrates. This technique, which requires no lithographic patterning, GaN is selectively grown through self-assembled layers of silica microspheres which act to filter out dislocations. Using this method, the threading dislocation density for GaN on sapphire was reduced from 3.3 x 10{sup 9} cm{sup -2} to 4.0 x 10{sup 7} cm{sup -2}, and from the 10{sup 10} cm{sup -2} range to {approx}6.0 x 10{sup 7} cm{sup -2} for GaN on Si(111). This large reduction in dislocation density is attributed to a dislocation blocking and bending by the unique interface between GaN and silica microspheres.

  8. Vortex-scalar element calculations of a diffusion flame stabilized on a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Ghoniem, Ahmed F.; Givi, Peyman

    1987-01-01

    The vortex-scalar element method, a scheme which utilizes vortex elements to discretize the region of high vorticity and scalar elements to represent species or temperature fields, is utilized in the numerical simulations of a two-dimensional reacting mixing layer. Computations are performed for a diffusion flame at high Reynolds and Peclet numbers without resorting to turbulence models. In the nonreacting flow, the mean and fluctuation profiles of a conserved scalar show good agreement with experimental measurements. Results for the reacting flow indicate that for temperature independent kinetics, the chemical reaction begins immediately downstream of the splitter plate where mixing starts. Results for the reacting flow with Arrhenius kinetics show an ignition delay, which depends on reactant temperature, before significant chemical reaction occurs. Harmonic forcing changes the structure of the layer, and concomitantly the rates of mixing and reaction, in accordance with experimental results. Strong stretch within the braids in the nonequilibrium kinetics case causes local flame quenching due to the temperature drop associated with the large convective fluxes.

  9. Role of sapphire nitridation temperature on GaN growth by plasma assisted molecular beam epitaxy: Part II. Interplay between chemistry and structure of layers

    NASA Astrophysics Data System (ADS)

    Losurdo, Maria; Capezzuto, Pio; Bruno, Giovanni; Namkoong, Gon; Doolittle, W. Alan; Brown, April S.

    2002-02-01

    The effect of sapphire nitridation temperature on the chemistry and microstructure of the sapphire substrate/GaN interface, nucleation layer, and of the GaN epilayers grown by rf plasma assisted molecular beam epitaxy is investigated. It is found that a sapphire nitridation temperature as low as 200 °C improves the structural and optical quality of GaN epilayers. This result can be explained by the chemistry of the sapphire nitridation process, which is discussed in the framework of a model considering the competitive formation of AlN and oxynitride (NO). In particular, at 200 °C, NO desorbs from the sapphire surface, yielding an homogeneous 6 Å AlN layer upon N2 plasma nitridation. This low temperature AlN template favors the nucleation of hexagonal GaN nuclei which coalesce completely resulting in a hexagonal GaN buffer layer that homogeneously covers the sapphire substrate. This condition promotes the growth of a high quality GaN epilayer. In contrast, high nitridation temperatures result in a mixed AlN/NO nitrided sapphire surface which induce a perturbed and more defected interface with the occurrence of cubic crystallites in the GaN buffer. A sapphire surface with random GaN islands is found upon annealing of the GaN buffer and this condition results in a low-quality GaN epilayer.

  10. The three-dimensional evolution of a plane mixing layer - Pairing and transition to turbulence

    NASA Technical Reports Server (NTRS)

    Moser, Robert D.; Rogers, Michael M.

    1993-01-01

    The evolution of three-dimensional temporally evolving plane mixing layers through as many as three pairings has been simulated numerically. All simulations were begun from a few low-wavenumber disturbances, usually derived from linear stability theory, in addition to the mean velocity. Three-dimensional perturbations were used with amplitudes ranging from infinitesimal to large enough to trigger a rapid transition to turbulence. Pairing is found to inhibit the growth of infinitesimal three-dimensional disturbances, and to trigger the transition to turbulence in highly three-dimensional flows. The mechanisms responsible for the growth of three-dimensionality and onset of transition to turbulence are described. The transition to turbulence is accompanied by the formation of thin sheets of spanwise vorticity, which undergo secondary rollups. The post-transitional simulated flow fields exhibit many properties characteristic of turbulent flows.

  11. The effects of the laminar/turbulent boundary layer states on the development of a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Foss, J. F.

    1977-01-01

    The effect of the laminar/turbulent boundary layer state on the mean and rms velocities of a developing plane mixing layer was investigated. The use of commonly accepted nondimensional representations of the data confirm (at least) an approximately self-preserving condition. It is suggested that the effects of the laminar/turbulent initial condition persist in the self-preserving region.

  12. Defect formation and annealing behaviors of fluorine-implanted GaN layers revealed by positron annihilation spectroscopy

    NASA Astrophysics Data System (ADS)

    Wang, M. J.; Yuan, L.; Cheng, C. C.; Beling, C. D.; Chen, K. J.

    2009-02-01

    Defect formation and annealing behaviors of fluorine-implanted, unintentionally doped GaN layers were studied by positron annihilation spectroscopy (PAS). Single Ga vacancies (VGa) were identified as the main vacancy-type defects detected by PAS after fluorine implantation at 180 keV with a dose of 1×1015 cm-2. Implantation-induced VGa tend to aggregate and form vacancy clusters after postimplantation annealing in N2 ambient at 600 °C. Fluorine ions tend to form F-vacancy complexes quickly after thermal annealing, which is consistent with the proposed diffusion model that predicts the behaviors of fluorine in GaN.

  13. TEM studies of laterally overgrown GaN layers grown on non-polarsubstrates

    SciTech Connect

    Liliental-Weber, Z.; Ni, X.; Morkoc, H.

    2006-01-05

    Transmission electron microscopy (TEM) was used to study pendeo-epitaxial GaN layers grown on polar and non-polar 4H SiC substrates. The structural quality of the overgrown layers was evaluated using a number of TEM methods. Growth of pendeo-epitaxial layers on polar substrates leads to better structural quality of the overgrown areas, however edge-on dislocations are found at the meeting fronts of two wings. Some misorientation between the 'seed' area and wing area was detected by Convergent Beam Electron Diffraction. Growth of pendeo-epitaxial layers on non-polar substrates is more difficult. Two wings on the opposite site of the seed area grow in two different polar directions with different growth rates. Most dislocations in a wing grown with Ga polarity are 10 times wider than wings grown with N-polarity making coalescence of these layers difficult. Most dislocations in a wing grown with Ga polarity bend in a direction parallel to the substrate, but some of them also propagate to the sample surface. Stacking faults formed on the c-plane and prismatic plane occasionally were found. Some misorientation between the wings and seed was detected using Large Angle Convergent Beam Diffraction.

  14. Influence of growth temperature on laser molecular beam epitaxy and properties of GaN layers grown on c-plane sapphire

    NASA Astrophysics Data System (ADS)

    Dixit, Ripudaman; Tyagi, Prashant; Kushvaha, Sunil Singh; Chockalingam, Sreekumar; Yadav, Brajesh Singh; Sharma, Nita Dilawar; Kumar, M. Senthil

    2017-04-01

    We have investigated the influence of growth temperature on the in-plane strain, structural, optical and mechanical properties of heteroepitaxially grown GaN layers on sapphire (0001) substrate by laser molecular beam epitaxy (LMBE) technique in the temperature range 500-700 °C. The GaN epitaxial layers are found to have a large in-plane compressive stress of about 1 GPa for low growth temperatures but the strain drastically reduced in the layer grown at 700 °C. The nature of the in-plane strain has been analyzed using high resolution x-ray diffraction, atomic force microscopy (AFM), Raman spectroscopy and photoluminescence (PL) measurements. From AFM, a change in GaN growth mode from grain to island is observed at the high growth temperature above 600 °C. A blue shift of 20-30 meV in near band edge PL emission line has been noticed for the GaN layers containing the large in-plane strain. These observations indicate that the in-plane strain in the GaN layers is dominated by a biaxial strain. Using nanoindentation, it is found that the indentation hardness and Young's modulus of the GaN layers increases with increasing growth temperature. The results disclose the critical role of growth mode in determining the in-plane strain and mechanical properties of the GaN layers grown by LMBE technique.

  15. Growth modes of InN (000-1) on GaN buffer layers on sapphire

    NASA Astrophysics Data System (ADS)

    Liu, Bing; Kitajima, Takeshi; Chen, Dongxue; Leone, Stephen R.

    2005-03-01

    In this work, using atomic force microscopy and scanning tunneling microscopy, we study the surface morphologies of epitaxial InN films grown by plasma-assisted molecular beam epitaxy with intervening GaN buffer layers on sapphire substrates. On smooth GaN buffer layers, nucleation and evolution of three-dimensional InN islands at various coverages and growth temperatures are investigated. The shapes of the InN islands are observed to be predominantly mesalike with large flat (000-1) tops, which suggests a possible role of indium as a surfactant. Rough GaN buffer layers composed of dense small GaN islands are found to significantly improve uniform InN wetting of the substrates, on which atomically smooth InN films are obtained that show the characteristics of step-flow growth. Scanning tunneling microscopy imaging reveals the defect-mediated surface morphology of smooth InN films, including surface terminations of screw dislocations and a high density of shallow surface pits with depths less than 0.3 nm. The mechanisms of the three-dimensional island size and shape evolution and formation of defects on smooth surfaces are considered.

  16. Epitaxial growth and characterization of non-polar a-plane AlGaN films with MgN/AlGaN insertion layers

    NASA Astrophysics Data System (ADS)

    Wang, Nan; Zhang, Xiong; Zhao, Jianguo; Zhang, Heng; Wu, Zili; Dai, Qian; Wang, Shuchang; Hu, Guohua; Cui, Yiping

    2017-06-01

    The MgN/AlGaN insertion layers were applied for the first time in the growth of non-polar a-plane AlGaN epi-layers by metal organic chemical vapor deposition technology. The full-width-at-half-maximum value of X-ray rocking curve for the a-plane AlGaN epi-layer was decreased by approximately 50.6% and the root-mean-square value of the surface was reduced by 74% by inserting the MgN/AlGaN insertion layers with optimized number of insertion pairs, which revealed that the compressive strain within the a-plane AlGaN epi-layers was effectively reduced, leading to significant improvements in crystalline quality and surface morphology, which is very helpful to fabricate high quality AlGaN-based ultraviolet light-emitting-diodes.

  17. Persistent photoconductivity and optical quenching of photocurrent in GaN layers under dual excitation

    NASA Astrophysics Data System (ADS)

    Ursaki, V. V.; Tiginyanu, I. M.; Ricci, P. C.; Anedda, A.; Hubbard, S.; Pavlidis, D.

    2003-09-01

    Persistent photoconductivity (PPC) and optical quenching (OQ) of photoconductivity (PC) were investigated in a variety of n-GaN layers characterized by different carrier concentrations, luminescence characteristics, and strains. The relation between PPC and OQ of PC was studied by exciting the samples with two beams of monochromatic radiation of various wavelengths and intensities. The PPC was found to be excited by the first beam with a threshold at 2.0 eV, while the second beam induces OQ of PC in a wide range of photon energies with a threshold at 1.0 eV. The obtained results are explained on the basis of a model combining two previously put forward schemes with electron traps playing the main role in PPC and hole traps inducing OQ of PC. The possible nature of the defects responsible for optical metastability of GaN is discussed.

  18. Analysis of Modified Williamson-Hall Plots on GaN Layers

    NASA Astrophysics Data System (ADS)

    Liu, Jian-Qi; Qiu, Yong-Xin; Wang, Jian-Feng; Xu, Ke; Yang, Hui

    2011-01-01

    Williamson—Hall (W-H) analysis is often used to separate the lateral coherence length (LCL) broadening and dislocation broadening on the ω-scan with a Lorentzian distribution. However, besides the LCL broadening and dislocation broadening, curvature also can broaden the ω-scan peak. Usually, the ω-scan can be described by a Pseudo-Voigt (P-V) function more precisely than a Lorentzian function. Based on the P-V fit peak profile, we modify the W-H plots. Both LCL broadening and curvature broadening can be eliminated from (001) ω-scans plots simultaneously, and a reliable tilt can be obtained. This method is a good complementary for the existing method, but is more convenient. Although we focuse on GaN layers, the results are applicable to a wide range of other materials having mosaic structures.

  19. Insulating gallium oxide layer produced by thermal oxidation of gallium-polar GaN: Insulating gallium oxide layer produced by thermal oxidation of gallium-polar GaN

    SciTech Connect

    Hossain, T.; Wei, D.; Nepal, N.; Garces, N. Y.; Hite, J. K.; Meyer, H. M.; Eddy, C. R.; Baker, Troy; Mayo, Ashley; Schmitt, Jason; Edgar, J. H.

    2014-02-24

    We report the benefits of dry oxidation of n -GaN for the fabrication of metal-oxide-semiconductor structures. GaN thin films grown on sapphire by MOCVD were thermally oxidized for 30, 45 and 60 minutes in a pure oxygen atmosphere at 850 °C to produce thin, smooth GaOx layers. Moreover, the GaN sample oxidized for 30 minutes had the best properties. Its surface roughness (0.595 nm) as measured by atomic force microscopy (AFM) was the lowest. Capacitance-voltage measurements showed it had the best saturation in accumulation region and the sharpest transition from accumulation to depletion regions. Under gate voltage sweep, capacitance-voltage hysteresis was completely absent. The interface trap density was minimum (Dit = 2.75×1010 cm–2eV–1) for sample oxidized for 30 mins. These results demonstrate a high quality GaOx layer is beneficial for GaN MOSFETs.

  20. Anisotropic structural and optical properties of semi-polar (11–22) GaN grown on m-plane sapphire using double AlN buffer layers

    PubMed Central

    Zhao, Guijuan; Wang, Lianshan; Yang, Shaoyan; Li, Huijie; Wei, Hongyuan; Han, Dongyue; Wang, Zhanguo

    2016-01-01

    We report the anisotropic structural and optical properties of semi-polar (11–22) GaN grown on m-plane sapphire using a three-step growth method which consisted of a low temperature AlN buffer layer, followed by a high temperature AlN buffer layer and GaN growth. By introducing double AlN buffer layers, we substantially improve the crystal and optical qualities of semi-polar (11–22) GaN, and significantly reduce the density of stacking faults and dislocations. The high resolution x-ray diffraction measurement revealed that the in-plane anisotropic structural characteristics of GaN layer are azimuthal dependent. Transmission electron microscopy analysis showed that the majority of dislocations in the GaN epitaxial layer grown on m-sapphire are the mixed-type and the orientation of GaN layer was rotated 58.4° against the substrate. The room temperature photoluminescence (PL) spectra showed the PL intensity and wavelength have polarization dependence along parallel and perpendicular to the [1–100] axis (polarization degrees ~ 0.63). The realization of a high polarization semi-polar GaN would be useful to achieve III-nitride based lighting emission device for displays and backlighting. PMID:26861595

  1. The effects of the laminar/turbulent boundary layer states on the development of a plane mixing layer

    NASA Technical Reports Server (NTRS)

    Foss, J. F.

    1977-01-01

    The effect, of the laminar/turbulent boundary layer state on the mean and rms velocities of a developing plane mixing layer, has been investigated. The maximum Ux/nu allowed by the facility was 6.7 x 100.000; the maximum x station surveyed corresponds to approximately 2000 and 700 initial momentum thicknesses for the laminar and turbulent cases respectively. The use of commonly accepted non-dimensional representations of the data confirm (at least) an approximately self-preserving condition. They also suggest that the effects of the laminar/turbulent initial condition persist in the self-preserving region. A direct comparison of the data reveals that the persistence so observed is illusory. An interpretation of the reason for this misunderstanding is advanced.

  2. AlGaN/GaN field effect transistors for power electronics—Effect of finite GaN layer thickness on thermal characteristics

    SciTech Connect

    Hodges, C. Anaya Calvo, J.; Kuball, M.; Stoffels, S.; Marcon, D.

    2013-11-11

    AlGaN/GaN heterostructure field effect transistors with a 150 nm thick GaN channel within stacked Al{sub x}Ga{sub 1−x}N layers were investigated using Raman thermography. By fitting a thermal simulation to the measured temperatures, the thermal conductivity of the GaN channel was determined to be 60 W m{sup −1} K{sup −1}, over 50% less than typical GaN epilayers, causing an increased peak channel temperature. This agrees with a nanoscale model. A low thermal conductivity AlGaN buffer means the GaN spreads heat; its properties are important for device thermal characteristics. When designing power devices with thin GaN layers, as well as electrical considerations, the reduced channel thermal conductivity must be considered.

  3. GaN nanowire functionalized with atomic layer deposition techniques for enhanced immobilization of biomolecules.

    PubMed

    Guo, D J; Abdulagatov, A I; Rourke, D M; Bertness, K A; George, S M; Lee, Y C; Tan, W

    2010-12-07

    We report the use of atomic layer deposition (ALD) coating as a nanobiosensor functionalization strategy for enhanced surface immobilization that may enable higher detection sensitivity. Three kinds of ALD coating films, Al(2)O(3), TiO(2), and SiO(2), were grown on the gallium nitride nanowire (GaN NW) surfaces and characterized with high-resolution transmission electron microscopy (HRTEM) and vacuum Fourier transform infrared spectroscopy (FTIR). Results from HRTEM showed that the thicknesses of ALD-Al(2)O(3), ALD-TiO(2) and ALD-SiO(2) coatings were 4-5 nm, 5-6 nm, and 12-14 nm, respectively. Results from FTIR showed that the OH contents of these coatings were, respectively, ∼6.9, ∼7.4, and ∼9.3 times that of piranha-treated GaN NW. Furthermore, to compare protein attachments on the different surfaces, poly(ethylene glycol) (PEG)-biotin was grafted on the OH-functionalized GaN NW surfaces through active Si-Cl functional groups. Streptavidin protein molecules were then attached to the biotin ends via specific binding. The immobilized streptavidin molecules were examined with scanning electron microscopy, HRTEM, and fluorescent imaging. Results from HRTEM and energy-dispersive X-ray revealed that the nitrogen concentrations on the three ALD coatings were significantly higher than that on the piranha-treated surface. Results from fluorescent imaging further showed that the protein attachments on the Al(2)O(3), TiO(2), and SiO(2) ALD coatings were, respectively, 6.4, 7.8, and 9.8 times that of piranha-treated surface. This study demonstrates that ALD coating can be used as a functionalization strategy for nanobiosensors because it is capable of creating functional groups with much higher density compared to widely used acid modifications, and among the three ALD coatings, ALD-SiO(2) yielded the most promising results in OH content and protein attachment.

  4. Facet growth of self-separated GaN layers through HVPE on large square-patterned template

    NASA Astrophysics Data System (ADS)

    Sui, Yanping; Wang, Bin; Zhao, Zhide; Xu, Wei; Li, Xiaoliang; Wang, Xinzhong; Yu, Guanghui

    2014-05-01

    A self-separated GaN layer was prepared by hydride vapor phase epitaxy (HVPE) on a square-patterned template with large periodicity. Self-separation was completed by breakage of the fragile layer because of the thermal stresses generated during the cooling process after HVPE growth. The GaN layer exhibited graphical surface comprising the terrace and the concave, the shapes of which were corresponding with the mask pattern. The terrace came from the growth on window openings, and had Ga-polarity by wet etching and micro-Raman measurement. The concave over the mask was composed of large inclined facets, and was demonstrated to have N-polarity. The growth on large square-patterned template was considered to be facet growth. The polarity inversion was related to dislocation accumulation. The strain distribution regularly varied, which was interpreted based on the facet growth mode.

  5. Microstructures of GaN Buffer Layers Grown on Si(111) Using Rapic Thermal Process Low-Pressure Metalorganic Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Peng, Chen; Bo, Shen; Jian-Min, Zhu; Zhi-Zhong, Chen; Yu-Gang, Zhou; Shi-Yong, Xie; Rong, Zhang; Ping, Han; Shu-Lin, Gu; You-Dou, Zheng; Shu-Sheng, Jiang; Duan, Feng; Z, Huang C.

    2000-03-01

    Microstructures of GaN buffer layers grown on Si (111) substrates using rapid thermal process low-pressure metalorganic chemical vapor deposition are investigated by an atomic force microscope (AFM) and a high-resolution transmission electron microscope (HRTEM). AFM images show that the islands appear in the GaN buffer layer after annealing at high temperature. Cross-sectional HRTEM micrographs of the buffer region of these samples indicate that there are bunched steps on the surface of the Si substrate and a lot of domains in GaN misorienting each other with small angles. The boundaries of those domains locate near the bunched steps, and the regions of the film on a terrace between steps have the same crystal orientation. An amorphous-like layer, about 3 nm thick, can also be observed between the GaN buffer layer and the Si substrate.

  6. Influence of a low-temperature GaN cap layer on the electron concentration in AlGaN/GaN heterostructure

    NASA Astrophysics Data System (ADS)

    Andreev, A. A.; Vavilova, E. A.; Ezubchenko, I. S.; Zanaveskin, M. L.; Maiboroda, I. O.

    2017-08-01

    The influence of low-temperature passivating GaN cap layers on the electrophysical parameters of a 2D electron gas (2DEG) in heterostructure high-electron mobility transistors has been studied. It has been found that thin GaN layers deposited in situ at 550°C do not exhibit polar properties and do not change the carrier concentration in the 2DEG. However, GaN layers deposited at 830°C decrease the carrier concentration in the 2DEG, which is in agreement with theoretical calculations. Using the reflected high-energy electron diffraction technique, it has been established that this effect may be associated with different structures and morphologies of GaN layers deposited at different temperatures.

  7. Effect of the Ammonia Flow on the Formation of Microstructure Defects in GaN Layers Grown by High-Temperature Vapor Phase Epitaxy

    NASA Astrophysics Data System (ADS)

    Barchuk, M.; Lukin, G.; Zimmermann, F.; Röder, C.; Motylenko, M.; Pätzold, O.; Heitmann, J.; Kortus, J.; Rafaja, D.

    2016-12-01

    High-temperature vapor phase epitaxy (HTVPE) is a physical vapor transport technology for a deposition of gallium nitride (GaN) layers. However, little is known about the influence of the deposition parameters on the microstructure of the layers. In order to fill this gap, the influence of the ammonia (NH3) flow applied during the HTVPE growth on the microstructure of the deposited GaN layers is investigated in this work. Although the HTVPE technology is intended to grow GaN layers on foreign substrates, the GaN layers under study were grown on GaN templates produced by metal organic vapor phase epitaxy in order to be able to separate the growth defects from the defects induced by the lattice misfit between the foreign substrate and the GaN layer. The microstructure of the layers is characterized by means of high-resolution x-ray diffraction (XRD), transmission electron microscopy and photoluminescence. In samples deposited at low ammonia flow, planar defects were detected, along which the nitrogen atoms are found to be substituted by impurity atoms. The interplay between these planar defects and the threading dislocations is discussed. A combination of XRD and micro-Raman spectroscopy reveals the presence of compressive residual stress in the samples.

  8. Effect of the Ammonia Flow on the Formation of Microstructure Defects in GaN Layers Grown by High-Temperature Vapor Phase Epitaxy

    NASA Astrophysics Data System (ADS)

    Barchuk, M.; Lukin, G.; Zimmermann, F.; Röder, C.; Motylenko, M.; Pätzold, O.; Heitmann, J.; Kortus, J.; Rafaja, D.

    2017-03-01

    High-temperature vapor phase epitaxy (HTVPE) is a physical vapor transport technology for a deposition of gallium nitride (GaN) layers. However, little is known about the influence of the deposition parameters on the microstructure of the layers. In order to fill this gap, the influence of the ammonia (NH3) flow applied during the HTVPE growth on the microstructure of the deposited GaN layers is investigated in this work. Although the HTVPE technology is intended to grow GaN layers on foreign substrates, the GaN layers under study were grown on GaN templates produced by metal organic vapor phase epitaxy in order to be able to separate the growth defects from the defects induced by the lattice misfit between the foreign substrate and the GaN layer. The microstructure of the layers is characterized by means of high-resolution x-ray diffraction (XRD), transmission electron microscopy and photoluminescence. In samples deposited at low ammonia flow, planar defects were detected, along which the nitrogen atoms are found to be substituted by impurity atoms. The interplay between these planar defects and the threading dislocations is discussed. A combination of XRD and micro-Raman spectroscopy reveals the presence of compressive residual stress in the samples.

  9. Defects reduction in a-plane AlGaN epi-layers grown on r-plane sapphire substrates by metal organic chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Zhao, Jianguo; Zhang, Xiong; Dai, Qian; Wang, Nan; Wu, Zili; Wang, Shuchang; Cui, Yiping

    2017-01-01

    Nonpolar a-plane AlGaN epi-layers were grown on a semi-polar r-plane sapphire substrate with an innovative two-way pulsed-flows metal organic chemical vapor deposition growth technology. A root-mean-square value of 1.79 nm was achieved, and the relative light transmittance of the a-plane AlGaN epi-layer was enhanced by 36.9%. These results reveal that the innovative growth method is able to improve the surface morphology and reduce the defect density in nonpolar a-plane Al x Ga1- x N epi-layers, particularly those with an Al composition greater than 0.5, which are key materials for the fabrication of nonpolar AlGaN-based high light emission efficiency deep-ultraviolet light-emitting diodes.

  10. Preparation and characterization of one-dimensional GaN nanorods with Tb intermediate layer

    SciTech Connect

    Shi, Feng; Xue, Chengshan

    2012-12-15

    Graphical abstract: Display Omitted Highlights: ► GaN nanorods have been prepared on Si substrates by magnetron sputtering. ► GaN nanorods are single crystal with hexagonal wurtzite structure. ► GaN nanorods are high-quality crystalline after ammoniating at 950 °C for 15 min. ► Ammoniating temperatures and times affect the growth of GaN nanorods significantly. -- Abstract: GaN nanorods have been successfully prepared on Si(1 1 1) substrates by magnetron sputtering through ammoniating Ga{sub 2}O{sub 3}/Tb thin films. X-ray diffraction (XRD), X-ray photoelectron spectroscope (XPS), FT-IR spectrophotometer, scanning electron microscope (SEM), high-resolution transmission electron microscope (HRTEM), and photoluminescence (PL) spectroscopy were used to characterize the microstructures, morphologies compositions and optical properties of the GaN samples. The results demonstrate that the nanorods are single crystal GaN with hexagonal wurtzite structure and high-quality crystalline after ammoniating at 950 °C for 15 min, which have the size of 100–150 nm in diameter. Ammoniating temperatures and times affect the growth of GaN nanorods significantly. The growth procedure mainly follows the Tb catalyst-assisted VLS mechanism.

  11. White light emission from GaN stack layers doped by different rare-earth metals

    NASA Astrophysics Data System (ADS)

    Zhang, Lei; Liu, Chang

    2015-02-01

    Experimental progress of electroluminescence devices (ELDs) employing GaN doped with rare-earth metals had been significantly made targeting RGB displays. However, reports on the theoretical models to design the devices and the applications were limited. Our previous paper proposed a device model using the quantum collision theory and Judd-Ofelt approximation to design the ELDs for white light illumination. In the present study, the model is modified by considering the light extraction efficiency and optical loss during propagating in the films. To improve the luminous efficiency, an ELD with three stack layers of GaN:Tm/GaN:Er/GaN:Eu is proposed and designed. The model predicts that the color of the integrated light can be controlled by applied voltage, thickness of each doping layer and doping concentrations of the rare earth metals. The luminous efficacy of white light emission at a bias of -100 V is calculated to be 274 lm/W, which is much higher than that of fluorescent lumps. The proposed ELD will open a door to efficient solid-state lighting.

  12. Computation of three-dimensional turbulent boundary layers with heat transfer in a plane of symmetry using embedded wall-layer functions

    NASA Technical Reports Server (NTRS)

    Degani, A. T.; Walker, J. D. A.

    1990-01-01

    In the calculation of turbulent boundary layers, a large number of mesh points are required to adequately resolve the intense variation in the velocity and enthalpy in the near-wall region. A substantial reduction in computational effort may be realized by representing the velocity and enthalpy profiles in the wall layer by analytical embedded functions. The effectively inviscid flow in the outer part of the boundary layer may then be resolved by employing a relatively coarser mesh. To obtain complete profiles, the outer numerical solution is matched asymptotically to the inner wall-layer analytical solution. To date, this approach has been restricted to two-dimensional flows; in the present study, a method which may be utilized for turbulent boundary layers with heat transfer in a plane of symmetry is developed as a first step in the application of the embedded-function method to full three-dimensional flows. The present method uses only about half as many mesh points as that required in a conventional procedure, which calculates the flow all the way to the wall, but there is no degradation in accuracy of the computed results.

  13. High-performance GaN metal-insulator-semiconductor ultraviolet photodetectors using gallium oxide as gate layer.

    PubMed

    Lee, Ming-Lun; Mue, T S; Huang, F W; Yang, J H; Sheu, J K

    2011-06-20

    In this study, gallium nitride (GaN)-based metal-insulator-semiconductor (MIS) ultraviolet (UV) photodetectors (PDs) with a gallium oxide (GaO(x)) gate layer formed by alternating current bias-assisted photoelectrochemical oxidation of n-GaN are presented. By introducing the GaO(x) gate layer to the GaN MIS UV PDs, the leakage current is reduced and a much larger UV-to-visible rejection ratio (R(UV/vis)) of spectral responsivity is achieved. In addition, a bias-dependent spectral response results in marked increase of the R(UV/vis) with bias voltage up to ~10(5). The bias-dependent responsivity suggests the possible existence of internal gain in of the GaN MIS PDs.

  14. The interplay of blocking properties with charge and potential redistribution in thin carbon-doped GaN on n-doped GaN layers

    NASA Astrophysics Data System (ADS)

    Koller, Christian; Pobegen, Gregor; Ostermaier, Clemens; Huber, Martin; Pogany, Dionyz

    2017-07-01

    In carbon-doped GaN (GaN:C) buffers used in a GaN-on-Si technology, the buffer is embedded in between transition and channel layers. This makes the analysis of buffer properties difficult due to e.g., carrier injection from or potential drop at these adjacent layers. Here, we analyze capacitance- and current-voltage characteristics of 200-300 nm thick GaN:C ([C] = 1019 cm-3) layers which are embedded between a top metal electrode and bottom n-doped GaN (n-GaN). Such structures allow a better potential control in GaN:C and thus determination of the band diagram quantitatively. The accumulation of negative charge (concentration up to 6 × 1017 cm-3) with bias is observed in GaN:C at both polarities. For biases Vappl < +1.7 V at the top electrode, negative charges accumulate in GaN:C near to its interface with n-GaN so that GaN:C exhibits no potential drop and blocks leakage current. For Vappl > +1.7 V, accumulated negative charges in GaN:C raise an energy barrier of ˜1.1 eV for electron injection from n-GaN to GaN:C. This causes a potential drop in GaN:C leading to a significant leakage current increase. The Fermi level pinning in GaN:C at a commonly referred acceptor at EV + 0.7(±0.2) eV is extracted only from electrostatic considerations. The occupancy change of carbon acceptors is attributed to trapping processes where the dislocation-related conductive paths are supposed to be involved in carrier transport from the top metal electrode to the carbon defect.

  15. Heteroepitaxial growth of GaN on atomically flat LiTaO 3 (0 0 0 1) using low-temperature AIN buffer layers

    NASA Astrophysics Data System (ADS)

    Tsuchiya, Y.; Kobayashi, A.; Ohta, J.; Fujioka, H.; Oshima, M.

    2006-07-01

    We have grown GaN films on atomically-flat LiTaO 3 substrates by using pulsed laser deposition (PLD), and we then investigated the effect of the use of low-temperature AlN (LT-AlN) buffer layers on the structural properties of GaN. The full-width at half-maximum (FWHM) values for the crystal orientation distribution of the GaN films in the tilt directions were reduced from 0.48° to 0.17°, and those in the twist directions were reduced from 0.40° to 0.17° by the incorporation of AlN buffer layers grown at 580 °C. The surface morphology of GaN has also been improved by the insertion of LT-AlN buffer layers. X-ray reflectivity measurements have revealed that the interfacial layer thickness between LT-AlN and LiTaO 3 is as thin as 1.7 nm, and that the increase in the interfacial layer thickness caused by annealing at up to 700 °C is quite small. These results indicate that the PLD growth of GaN on atomically flat substrates using LT-AlN buffer layers is quite promising for achieving GaN on LiTaO 3.

  16. Selective area growth of high-density GaN nanowire arrays on Si(111) using thin AlN seeding layers

    NASA Astrophysics Data System (ADS)

    Wu, C. H.; Lee, P. Y.; Chen, K. Y.; Tseng, Y. T.; Wang, Y. L.; Cheng, K. Y.

    2016-11-01

    Selective area growth (SAG) of high-density (2.5×109 cm-2) GaN nanowires (NWs) on Si(111) substrate by plasma-assisted molecular beam epitaxy is presented. The effects of morphology and thickness of the AlN seeding layer on the quality of SAG GaN NWs are investigated. A thin AlN seeding layer of 30 nm thick with a surface roughness of less than 0.5 nm is suitable for high quality SAG GaN NWs growth. High-density AlN nanopedestal arrays used as seeds for SAG GaN NWs are fabricated from thin AlN seeding layers using soft nanoimprint lithography. By adjusting the growth temperature and Ga/N flux ratio, hexagonal shaped SAG GaN NWs are realized. The quality of SAG GaN NWs is evaluated by low temperature photoluminescence (PL) measurements. Three major groups of PL peaks at 3.47, 3.45, and 3.41 eV are identified. The peak at 3.471 eV is related to the neutral donor-bound exciton emission, and the 3.41 eV broadband emission is attributed to stacking faults or structural defects. The 3.45 eV peak is identified as the emission due to exciton recombination at polar inversion domain boundaries of NWs.

  17. The modulation of multi-domain and harmonic wave in a GaN planar Gunn diode by recess layer

    NASA Astrophysics Data System (ADS)

    Wang, Ying; Yang, Lin'an; Wang, Zhizhe; Ao, Jinping; Hao, Yue

    2016-02-01

    In this paper, a novel structure of a gallium nitride (GaN) planar Gunn diode with isosceles trapezoidal recess layers in the aluminum gallium nitride (AlGaN) barrier layer is proposed to enhance the harmonic components of Gunn oscillation waveforms. Numerical simulations demonstrate that the oscillation frequency rises from 99.1 GHz up to 300.4 GHz with the recess number increasing from one to four, at which the maximum radio frequency (RF) output power and conversion efficiency are obtained. The output performance of the diode enhances at high harmonic frequencies and is mainly due to the multiple recess layer structure that can trigger the formation of multiple Gunn domains in the two-dimensional electron gas channel of the GaN planar Gunn diode. This indicates that the long channel GaN Gunn diode has the ability to output the available RF power associated with the device operating in a submillimeter-wave and terahertz (THz) regime.

  18. Electrochemical removal of hydrogen atoms in Mg-doped GaN epitaxial layers

    SciTech Connect

    Lee, June Key E-mail: hskim7@jbnu.ac.kr; Hyeon, Gil Yong; Tawfik, Wael Z.; Choi, Hee Seok; Ryu, Sang-Wan; Jeong, Tak; Jung, Eunjin; Kim, Hyunsoo E-mail: hskim7@jbnu.ac.kr

    2015-05-14

    Hydrogen atoms inside of an Mg-doped GaN epitaxial layer were effectively removed by the electrochemical potentiostatic activation (EPA) method. The role of hydrogen was investigated in terms of the device performance of light-emitting diodes (LEDs). The effect of the main process parameters for EPA such as solution type, voltage, and time was studied and optimized for application to LED fabrication. In optimized conditions, the light output of 385-nm LEDs was improved by about 26% at 30 mA, which was caused by the reduction of the hydrogen concentration by ∼35%. Further removal of hydrogen seems to be involved in the breaking of Ga-H bonds that passivate the nitrogen vacancies. An EPA process with high voltage breaks not only Mg-H bonds that generate hole carriers but also Ga-H bonds that generate electron carriers, thus causing compensation that impedes the practical increase of hole concentration, regardless of the drastic removal of hydrogen atoms. A decrease in hydrogen concentration affects the current-voltage characteristics, reducing the reverse current by about one order and altering the forward current behavior in the low voltage region.

  19. A novel symmetric GaN MESFET by dual extra layers of Si3N4

    NASA Astrophysics Data System (ADS)

    Ramezani, Zeinab; Orouji, Ali A.; Aminbeidokhti, Amirhossein

    2015-06-01

    In this paper, a novel GaN MESFET structure with Double Extra Layers of Si3N4 (DEL-MESFET) under gate edges has been introduced in order to modify the carrier concentration and the electric field in the channel. The results show that the breakdown voltage (VBR) increases to 200 V in the proposed structure from 119.2 V in a conventional MESFET structure (C-MESFET). Furthermore, the maximum output power density (Pmax) of the proposed structure is 74% higher than that of the conventional one. By modifying the carrier's concentration, the gate-source and gate-drain capacitances decrease that lead to the improvement of the RF characteristics including ft and fmax from 27.5 and 99 GHz of the C-SOI MESFET to 30 and 105 GHz of the DEL-MESFET, respectively. Therefore, the results show that the proposed structure provides the excellent performance compared with the C-MESFET structure and can be taken into consideration for the future of the VLSI applications.

  20. MOVPE growth of GaN on 6-inch SOI-substrates: effect of substrate parameters on layer quality and strain

    NASA Astrophysics Data System (ADS)

    Lemettinen, J.; Kauppinen, C.; Rudzinski, M.; Haapalinna, A.; Tuomi, T. O.; Suihkonen, S.

    2017-04-01

    We demonstrate that higher crystalline quality, lower strain and improved electrical characteristics can be achieved in gallium nitride (GaN) epitaxy by using a silicon-on-insulator (SOI) substrate compared to a bulk silicon (Si) substrate. GaN layers were grown by metal–organic vapor phase epitaxy on 6-inch bulk Si and SOI wafers using the standard step graded AlGaN and AlN approach. The GaN layers grown on SOI exhibited lower strain according to x-ray diffraction analysis. Defect selective etching measurements suggested that the use of SOI substrate for GaN epitaxy reduces the dislocation density approximately by a factor of two. Furthermore, growth on SOI substrate allows one to use a significantly thinner AlGaN buffer compared to bulk Si. Synchrotron radiation x-ray topography analysis confirmed that the stress relief mechanism in GaN on SOI epitaxy is the formation of a dislocation network to the SOI device Si layer. In addition, the buried oxide layer significantly improves the vertical leakage characteristics as the onset of the breakdown is delayed by approximately 400 V. These results show that the GaN on the SOI platform is promising for power electronics applications.

  1. Atomic layer etching of GaN and AlGaN using directional plasma-enhanced approach

    NASA Astrophysics Data System (ADS)

    Ohba, Tomihito; Yang, Wenbing; Tan, Samantha; Kanarik, Keren J.; Nojiri, Kazuo

    2017-06-01

    The directional atomic layer etching (ALE) of GaN and AlGaN has been developed. The GaN ALE process consists of cyclic Cl2 plasma chemisorption and Ar ion removal. The etch per cycle (EPC) was 0.4 nm within the self-limiting regime, which is 50 to 100 V. The root-mean-square surface roughness R RMS was 0.6 nm, which was improved from an initial roughness of 0.8 nm. For AlGaN ALE, BCl3 was added to the chlorine step to obtain a smooth surface with R RMS of 0.3 nm and stoichiometry similar to the initial sample. The ultra smooth surface obtained by etching is promising for use in next-generation power devices.

  2. Carbon nanotube assisted Lift off of GaN layers on sapphire

    NASA Astrophysics Data System (ADS)

    Long, Hao; Feng, Xiaohui; Wei, Yang; Yu, Tongjun; Fan, Shoushan; Ying, Leiying; Zhang, Baoping

    2017-02-01

    Laser lift off (LLO) was one of the most essential processes in fabrication of vertical GaN-based LEDs. However, traditional laser lift off of GaN on sapphire substrates needed high laser energy threshold, which deteriorated the GaN crystal. In this paper, it was found that inserting carbon nanotube between GaN and sapphire could effectively reduce the laser energy threshold in GaN LLO, from 1.5 J /cm2 of conventional GaN/sapphire to 1.3 J /cm2 of CNT inserted GaN/sapphire. The temperature distributions at the GaN/sapphire interfaces with and without CNTs were simulated by the finite elements calculation under laser irradiation. It was found that, due to the higher laser absorption coefficient of CNT, the CNT played as a powerful heating wire, sending out the thermal outside to elevate the GaN's temperature, and thus reduce the laser threshold for LLO. Raman and photoluminescence measurements indicated that residual stress of GaN membranes was as small as 0.3 GPa by the carbon nanotube assisted LLO. This work not only opens new application of CNTs, but also demonstrates the potential of high performance blue and green LEDs.

  3. In Situ Oxidation of GaN Layer and Its Effect on Structural Properties of Ga2O3 Films Grown by Plasma-Assisted Molecular Beam Epitaxy

    NASA Astrophysics Data System (ADS)

    Ngo, Trong Si; Le, Duc Duy; Tran, Duy Khanh; Song, Jung-Hoon; Hong, Soon-Ku

    2017-06-01

    Plasma-assisted molecular beam epitaxy (PAMBE) was used to grow Ga2O3 films on oxidized GaN layers on nitrided sapphire substrates. The GaN layer was grown by PAMBE, and the in situ oxidation of the GaN layer was achieved through exposure to oxygen plasma, which resulted in the formation of monoclinic β-Ga2O3. Crystalline monoclinic β-Ga2O3 films were grown on the GaN layers, with and without oxidation. The orientation relationships were [11\\overline{2} 0] Al2O3//[1\\overline{1} 00] AlN//[1\\overline{1} 00] GaN//[102] β-Ga2O3 and [1\\overline{1} 00] Al2O3//[11\\overline{2} 0] AlN//[11\\overline{2} 0] GaN//[010] β-Ga2O3. The grown β-Ga2O3 films were not single-crystalline but showed rotational domains along the growth direction with three variations, which resulted in six-fold rotational symmetry instead of two-fold rotational symmetry. The surface roughness of the grown β-Ga2O3 film was closely reflected to that of as-grown GaN and oxidized GaN. By analyzing the x-ray omega rocking curves for the on-axis (\\overline{2} 01) and off-axis (002) reflections, it was concluded that rotational domains dominantly affected the crystal quality of the β-Ga2O3 films.

  4. In Situ Oxidation of GaN Layer and Its Effect on Structural Properties of Ga2O3 Films Grown by Plasma-Assisted Molecular Beam Epitaxy

    NASA Astrophysics Data System (ADS)

    Ngo, Trong Si; Le, Duc Duy; Tran, Duy Khanh; Song, Jung-Hoon; Hong, Soon-Ku

    2017-01-01

    Plasma-assisted molecular beam epitaxy (PAMBE) was used to grow Ga2O3 films on oxidized GaN layers on nitrided sapphire substrates. The GaN layer was grown by PAMBE, and the in situ oxidation of the GaN layer was achieved through exposure to oxygen plasma, which resulted in the formation of monoclinic β-Ga2O3. Crystalline monoclinic β-Ga2O3 films were grown on the GaN layers, with and without oxidation. The orientation relationships were [11overline{2} 0 ] Al2O3//[1overline{1} 00 ] AlN//[1overline{1} 00 ] GaN//[102] β-Ga2O3 and [1overline{1} 00 ] Al2O3//[11overline{2} 0 ] AlN//[11overline{2} 0 ] GaN//[010] β-Ga2O3. The grown β-Ga2O3 films were not single-crystalline but showed rotational domains along the growth direction with three variations, which resulted in six-fold rotational symmetry instead of two-fold rotational symmetry. The surface roughness of the grown β-Ga2O3 film was closely reflected to that of as-grown GaN and oxidized GaN. By analyzing the x-ray omega rocking curves for the on-axis (overline{2} 01 ) and off-axis (002) reflections, it was concluded that rotational domains dominantly affected the crystal quality of the β-Ga2O3 films.

  5. Characterization of Stress Relaxation, Dislocations and Crystallographic Tilt Via X-ray Microdiffraction in GaN (0001) Layers Grown by Maskless Pendeo-Epitaxy

    SciTech Connect

    Barabash, R.I.; Ice, G.E.; Liu, W.; Einfeldt, S.; Hommel, D.; Roskowski, A.M.; Davis, R.F.

    2010-06-25

    Intrinsic stresses due to lattice mismatch and high densities of threading dislocations and extrinsic stresses resulting from the mismatch in the coefficients of thermal expansion are present in almost all III-Nitride heterostructures. Stress relaxation in the GaN layers occurs in conventional and in pendeo-epitaxial films via the formation of additional misfit dislocations, domain boundaries, elastic strain and wing tilt. Polychromatic X-ray microdiffraction, high resolution monochromatic X-ray diffraction and finite element simulations have been used to determine the distribution of strain, dislocations, sub-boundaries and crystallographic wing tilt in uncoalesced and coalesced GaN layers grown by maskless pendeo-epitaxy. An important parameter was the width-to-height ratio of the etched columns of GaN from which the lateral growth of the wings occurred. The strain and tilt across the stripes increased with the width-to-height ratio. Tilt boundaries formed in the uncoalesced GaN layers at the column/wing interfaces for samples with a large ratio. Sharper tilt boundaries were observed at the interfaces formed by the coalescence of two laterally growing wings. The wings tilted upward during cooling to room temperature for both the uncoalesced and the coalesced GaN layers. It was determined that finite element simulations that account for extrinsic stress relaxation can explain the experimental results for uncoalesced GaN layers. Relaxation of both extrinsic and intrinsic stress components in the coalesced GaN layers contribute to the observed wing tilt and the formation of sub-boundaries.

  6. Characterization of Stress Relaxation, Dislocations and Crystallographic Tilt Via X-ray Microdiffraction in GaN (0001) Layers Grown by Maskless Pendeo-Epitaxy

    SciTech Connect

    Barabash, Rozaliya; Ice, Gene E; Liu, Wenjun; Einfeldt, S.; Hommel, D.; Roskowski, A. M.; Davis, R. F.

    2005-01-01

    Intrinsic stresses due to lattice mismatch and high densities of threading dislocations and extrinsic stresses resulting from the mismatch in the coefficients of thermal expansion are present in almost all III-Nitride heterostructures. Stress relaxation in the GaN layers occurs in conventional and in pendeo-epitaxial films via the formation of additional misfit dislocations, domain boundaries, elastic strain and wing tilt. Polychromatic X-ray microdiffraction, high resolution monochromatic X-ray diffraction and finite element simulations have been used to determine the distribution of strain, dislocations, sub-boundaries and crystallographic wing tilt in uncoalesced and coalesced GaN layers grown by maskless pendeo-epitaxy. An important parameter was the width-to-height ratio of the etched columns of GaN from which the lateral growth of the wings occurred. The strain and tilt across the stripes increased with the width-to-height ratio. Tilt boundaries formed in the uncoalesced GaN layers at the column/wing interfaces for samples with a large ratio. Sharper tilt boundaries were observed at the interfaces formed by the coalescence of two laterally growing wings. The wings tilted upward during cooling to room temperature for both the uncoalesced and the coalesced GaN layers. It was determined that finite element simulations that account for extrinsic stress relaxation can explain the experimental results for uncoalesced GaN layers. Relaxation of both extrinsic and intrinsic stress components in the coalesced GaN layers contribute to the observed wing tilt and the formation of sub-boundaries.

  7. Electronic and optical device applications of hollow cathode plasma assisted atomic layer deposition based GaN thin films

    SciTech Connect

    Bolat, Sami Tekcan, Burak; Ozgit-Akgun, Cagla; Biyikli, Necmi; Okyay, Ali Kemal

    2015-01-15

    Electronic and optoelectronic devices, namely, thin film transistors (TFTs) and metal–semiconductor–metal (MSM) photodetectors, based on GaN films grown by hollow cathode plasma-assisted atomic layer deposition (PA-ALD) are demonstrated. Resistivity of GaN thin films and metal-GaN contact resistance are investigated as a function of annealing temperature. Effect of the plasma gas and postmetallization annealing on the performances of the TFTs as well as the effect of the annealing on the performance of MSM photodetectors are studied. Dark current to voltage and responsivity behavior of MSM devices are investigated as well. TFTs with the N{sub 2}/H{sub 2} PA-ALD based GaN channels are observed to have improved stability and transfer characteristics with respect to NH{sub 3} PA-ALD based transistors. Dark current of the MSM photodetectors is suppressed strongly after high-temperature annealing in N{sub 2}:H{sub 2} ambient.

  8. Carrier and defect dynamics in photoexcited semi-insulating epitaxial GaN layers

    NASA Astrophysics Data System (ADS)

    Gaubas, E.; Juršėnas, S.; Miasojedovas, S.; Vaitkus, J.; Žukauskas, A.

    2004-10-01

    Transients of fast free-carrier recombination and of multitrapping processes, determined by different types of defects, have been traced by photoluminescence (PL) and contact photoconductivity (CPC) in semi-insulating GaN epitaxial layers. To eliminate effects caused by the electrodes, the CPC decays were supplemented with noninvasive microwave absorption transients. The lifetimes of fast recombination and initial free-carrier capture processes were evaluated using ultraviolet (UV) time-resolved photoluminescence transients. The UV PL band peaked at 3.42 eV with contributions from both stimulated and spontaneous emission was attributed to band-to-band recombination. At the highest excitations, the initial PL decay time exhibited a value of 880 ps due to nonradiative free-carrier recombination. The radiative centers were revealed in continuous-wave PL spectra, where the UV band was accompanied with the bands of blue (B) PL, peaked in the range of 2.82-3.10 eV, and yellow (Y) PL, peaked at 2.19 eV, ascribed to dislocations and bulk donor-acceptor recombination, respectively. The time scale of the relaxation rate exhibited a crossover from picoseconds for stimulated emission to hundreds of nanoseconds for multitrapping. In the asymptotic part, a stretched-exponent decay on the millisecond scale was observed with the disorder factor of α =0.7. The asymptotic decay is explained by competition of centers of nonradiative recombination within bulk of the material and trapping attributed to the dislocations. Behavior of the dislocation-attributed capture centers was simulated using a model of capture cross section, which depends on the excess carrier concentration via screening.

  9. Study of carrier recombination transient characteristics in MOCVD grown GaN dependent on layer thickness

    SciTech Connect

    Gaubas, E. Čeponis, T.; Jasiunas, A.; Jelmakas, E.; Juršėnas, S.; Kadys, A.; Malinauskas, T.; Tekorius, A.; Vitta, P.

    2013-11-15

    The MOCVD grown GaN epi-layers of different thickness have been examined in order to clarify a role of surface recombination, to separate an impact of radiative and non-radiative recombination and disorder factors. The microwave probed –photoconductivity (MW-PC) and spectrally resolved photo-luminescence (PL) transients were simultaneously recorded under ultraviolet (UV) light 354 nm pulsed 500 ps excitation. The MW-PC transients exhibited the carrier decay components associated with carrier decay within micro-crystals and the disordered structure on the periphery areas surrounding crystalline columns. Three PL bands were resolved within PL spectrum, namely, the exciton ascribed UV-PL band edge for hν>3.3 eV, blue B-PL band for 2.5 < hν < 3.0 eV and yellow Y-PL band with hν < 2.4 eV. It has been obtained that intensity of UV-PL band increases with excitation density, while intensity of B-PL band is nearly invariant. However, intensity of the Y-PL increases with reduction of the excitation density. The Y-PL can be associated with trapping centers. A reduction of UV excitation density leads to a decrease of the relative amplitude of the asymptotic component within the MW-PC transients and to an increase of the amplitude as well as duration of the yellow spectral band (Y-PL) asymptotic component. Fractional index α with values 0.5 < α < 0.8 was evaluated for the stretched-exponent component which fits the experimental transients determined by the disordered structure ascribed to the periphery areas surrounding the crystalline columns.

  10. The light wave flow effect in a plane-parallel layer with a quasi-zero refractive index under the action of bounded light beams

    SciTech Connect

    Gadomsky, O. N. Shchukarev, I. A.

    2016-08-15

    It is shown that external optical radiation in the 450–1200 nm range can be efficiently transformed under the action of bounded light beams to a surface wave that propagates along the external and internal boundaries of a plane-parallel layer with a quasi-zero refractive index. Reflection regimes with complex and real angles of refraction in the layer are considered. The layer with a quasi-zero refractive index in this boundary problem is located on a highly reflective metal substrate; it is shown that the uniform low reflection of light is achieved in the wavelength range under study.

  11. High Cubic-Phase Purity InN on MgO (001) Using Cubic-Phase GaN as a Buffer Layer

    SciTech Connect

    Sanorpim, S.; Kuntharin, S.; Parinyataramas, J.; Yaguchi, H.; Iwahashi, Y.; Orihara, M.; Hijikata, Y.; Yoshida, S.

    2011-12-23

    High cubic-phase purity InN films were grown on MgO (001) substrates by molecular beam epitaxy with a cubic-phase GaN buffer layer. The cubic phase purity of the InN grown layers has been analyzed by high resolution X-ray diffraction, {mu}-Raman scattering and transmission electron microscopy. It is evidenced that the hexagonal-phase content in the InN overlayer much depends on hexagonal-phase content in the cubic-phase GaN buffer layer and increases with increasing the hexagonal-phase GaN content. From Raman scattering measurements, in addition, the InN layer with lowest hexagonal component (6%), only Raman characteristics of cubic TO{sub InN} and LO{sub InN} modes were observed, indicating a formation of a small amount of stacking faults, which does not affect on vibrational property.

  12. Optical and structural characteristics of high indium content InGaN/GaN multi-quantum wells with varying GaN cap layer thickness

    SciTech Connect

    Yang, J.; Zhao, D. G. Jiang, D. S.; Chen, P.; Zhu, J. J.; Liu, Z. S.; Le, L. C.; Li, X. J.; He, X. G.; Liu, J. P.; Yang, H.; Zhang, Y. T.; Du, G. T.

    2015-02-07

    The optical and structural properties of InGaN/GaN multi-quantum wells (MQWs) with different thicknesses of low temperature grown GaN cap layers are investigated. It is found that the MQW emission energy red-shifts and the peak intensity decreases with increasing GaN cap layer thickness, which may be partly caused by increased floating indium atoms accumulated at quantum well (QW) surface. They will result in the increased interface roughness, higher defect density, and even lead to a thermal degradation of QW layers. An extra growth interruption introduced before the growth of GaN cap layer can help with evaporating the floating indium atoms, and therefore is an effective method to improve the optical properties of high indium content InGaN/GaN MQWs.

  13. MOCVD growth of N-polar GaN on on-axis sapphire substrate: Impact of AlN nucleation layer on GaN surface hillock density

    NASA Astrophysics Data System (ADS)

    Marini, Jonathan; Leathersich, Jeffrey; Mahaboob, Isra; Bulmer, John; Newman, Neil; (Shadi) Shahedipour-Sandvik, F.

    2016-05-01

    We report on the impact of growth conditions on surface hillock density of N-polar GaN grown on nominally on-axis (0001) sapphire substrate by metal organic chemical vapor deposition (MOCVD). Large reduction in hillock density was achieved by implementation of an optimized high temperature AlN nucleation layer and use of indium surfactant in GaN overgrowth. A reduction by more than a factor of five in hillock density from 1000 to 170 hillocks/cm-2 was achieved as a result. Crystal quality and surface morphology of the resultant GaN films were characterized by high resolution x-ray diffraction and atomic force microscopy and found to be relatively unaffected by the buffer conditions. It is also shown that the density of smaller surface features is unaffected by AlN buffer conditions.

  14. Triclinic deformation of InGaN layers grown on vicinal surface of GaN (00.1) substrates

    NASA Astrophysics Data System (ADS)

    Krysko, M.; Domagala, J. Z.; Czernecki, R.; Leszczynski, M.

    2013-09-01

    We report on a triclinic unit cell deformation of fully strained InGaN layers grown on vicinal GaN (00.1) substrates. The samples were examined using the high-resolution X-ray diffraction (HR XRD) using a set of asymmetrical reflections and one symmetrical reflection of 00.2. The substrate miscut induced triclinic deformation of the layer unit cells, breaking the hexagonal symmetry. The experimental results are compared with predictions of the theory of elasticity. We formulate equations for unit cell parameters of layers grown on substrates cut in any direction, based on the equations given by Romanov et al. [J. Appl. Phys. 100, 023522 (2006)]. Additionally, the paper provides a recipe of the XRD measurements necessary to establish unit cell parameters (useful for composition determination of ternary compounds) of the hexagonal mismatched layers grown on off-axis substrates.

  15. Patterned growth of aligned ZnO nanowire arrays on sapphire and GaN layers

    NASA Astrophysics Data System (ADS)

    Fan, H. J.; Fleischer, F.; Lee, W.; Nielsch, K.; Scholz, R.; Zacharias, M.; Gösele, U.; Dadgar, A.; Krost, A.

    2004-07-01

    Patterned growth of vertically aligned ZnO nanowire arrays on the micrometer and nanometer scale on sapphire and GaN epilayers is reported. In order to control the position and distribution density of the ZnO nanowires, Au seeding nanodots are defined, as regular arrays, with the assistance of deposition shadow masks. Electron micrographs reveal that the wires are single crystals having wire axes along the hexagonal c-axes. The epitaxial growth of ZnO nanowires on sapphire and GaN films on Si substrates was further verified by cross sectional electron microscopy investigations. Compared to the sapphire case, the perfect epitaxial growth on a GaN film on a Si substrate is believed to be more suitable for potential electronic device applications of ZnO nanowire arrays.

  16. Selectively Enhanced UV-A Photoresponsivity of a GaN MSM UV Photodetector with a Step-Graded AlxGa1−xN Buffer Layer

    PubMed Central

    Lee, Chang-Ju; Won, Chul-Ho; Lee, Jung-Hee; Hahm, Sung-Ho; Park, Hongsik

    2017-01-01

    The UV-to-visible rejection ratio is one of the important figure of merits of GaN-based UV photodetectors. For cost-effectiveness and large-scale fabrication of GaN devices, we tried to grow a GaN epitaxial layer on silicon substrate with complicated buffer layers for a stress-release. It is known that the structure of the buffer layers affects the performance of devices fabricated on the GaN epitaxial layers. In this study, we show that the design of a buffer layer structure can make effect on the UV-to-visible rejection ratio of GaN UV photodetectors. The GaN photodetector fabricated on GaN-on-silicon substrate with a step-graded AlxGa−xN buffer layer has a highly-selective photoresponse at 365-nm wavelength. The UV-to-visible rejection ratio of the GaN UV photodetector with the step-graded AlxGa1−xN buffer layer was an order-of-magnitude higher than that of a photodetector with a conventional GaN/AlN multi buffer layer. The maximum photoresponsivity was as high as 5 × 10−2 A/W. This result implies that the design of buffer layer is important for photoresponse characteristics of GaN UV photodetectors as well as the crystal quality of the GaN epitaxial layers. PMID:28753989

  17. Growth of ZnO(0001) on GaN(0001)/4H-SiC buffer layers by plasma-assisted hybrid molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Adolph, David; Tingberg, Tobias; Ive, Tommy

    2015-09-01

    Plasma-assisted molecular beam epitaxy was used to grow ZnO(0001) layers on GaN(0001)/4H-SiC buffer layers deposited in the same growth chamber equipped with both N- and O-plasma sources. The GaN buffer layers were grown immediately before initiating the growth of ZnO. Using a substrate temperature of 445 °C and an O2 flow rate of 2.5 standard cubic centimeters per minute, we obtained ZnO layers with statistically smooth surfaces having a root-mean-square roughness of 0.3 nm and a peak-to-valley distance of 3 nm as revealed by atomic force microscopy. The full-width-at-half-maximum for x-ray rocking curves obtained across the ZnO(0002) and ZnO(10 1 bar 5) reflections was 198 and 948 arcsec, respectively. These values indicated that the mosaicity of the ZnO layer was comparable to the corresponding values of the underlying GaN buffer layer. Reciprocal space maps showed that the in-plane relaxation of the GaN and ZnO layers was 82% and 73%, respectively, and that the relaxation occurred abruptly during the growth. Room-temperature Hall-effect measurements revealed that the layers were inherently n-type and had an electron concentration of 1×1019 cm-3 and a Hall mobility of 51 cm2/V s.

  18. Influence of High Nitrogen Flux on Crystal Quality of Plasma-Assisted MBE Grown GaN Layers Using Raman Spectroscopy: Part-II

    SciTech Connect

    Asghar, M.; Hussain, I.; Islah u din; Saleemi, F.

    2007-05-09

    We have investigated lattice properties of plasma assisted MBE grown hexagonal GaN layers at varying nitrogen and gallium fluxes using Raman spectroscopy. Room temperature Raman spectra of Ga-rich layers and stoichiometric GaN are similar showing excitation modes at 434 cm-1, 567 cm-1 and 729 cm-1 identified as residual laser line, E{sub 2}{sup H} and A1(LO) mode, respectively. Similarity of Ga-rich and stoichiometric GaN layers is interpreted as the indication of comparable crystal quality of both GaN layers. In contrast, Raman scattering associated with N-rich GaN samples mere exhibit a broad band of excitations in the range of 250-650cm-1 leaving out A1(LO) mode. This typical observation along with intensity distribution of the peaks, is correlated with rough surface, bad crystal quality and high concentration of defects. Based on atomic displacement scheme, the broad band is identified as Ga- vacancies.

  19. The effect of nucleation layer thickness on the structural evolution and crystal quality of bulk GaN grown by a two-step process on cone-patterned sapphire substrate

    NASA Astrophysics Data System (ADS)

    Shang, Lin; Zhai, Guangmei; Mei, Fuhong; Jia, Wei; Yu, Chunyan; Liu, Xuguang; Xu, Bingshe

    2016-05-01

    The role of nucleation layer thickness on the GaN crystal quality grown on cone-patterned sapphire substrate (PSS) was explored. The morphologies of epitaxial GaN at different growth stages were investigated by a series of growth interruption in detail. After 10- and 15-min three-dimensional growth, the nucleation sites are very important for the bulk GaN crystal quality. They have a close relationship with the nucleation layer thickness, as confirmed through the scanning electron microscope (SEM) analysis. Nucleation sites formed mainly on patterns are bad for bulk GaN crystal quality and nucleation sites formed mainly in the trenches of PSS mounds are good for bulk GaN crystal quality, as proved by X-ray diffraction analysis. Nucleation layer thickness can effectively control the nucleation sites and thus determine the crystal quality of bulk GaN.

  20. Carbon doped GaN buffer layer using propane for high electron mobility transistor applications: Growth and device results

    SciTech Connect

    Li, X.; Nilsson, D.; Danielsson, Ö.; Pedersen, H.; Janzén, E.; Forsberg, U.; Bergsten, J.; Rorsman, N.

    2015-12-28

    The creation of a semi insulating (SI) buffer layer in AlGaN/GaN High Electron Mobility Transistor (HEMT) devices is crucial for preventing a current path beneath the two-dimensional electron gas (2DEG). In this investigation, we evaluate the use of a gaseous carbon gas precursor, propane, for creating a SI GaN buffer layer in a HEMT structure. The carbon doped profile, using propane gas, is a two stepped profile with a high carbon doping (1.5 × 10{sup 18 }cm{sup −3}) epitaxial layer closest to the substrate and a lower doped layer (3 × 10{sup 16 }cm{sup −3}) closest to the 2DEG channel. Secondary Ion Mass Spectrometry measurement shows a uniform incorporation versus depth, and no memory effect from carbon doping can be seen. The high carbon doping (1.5 × 10{sup 18 }cm{sup −3}) does not influence the surface morphology, and a roughness root-mean-square value of 0.43 nm is obtained from Atomic Force Microscopy. High resolution X-ray diffraction measurements show very sharp peaks and no structural degradation can be seen related to the heavy carbon doped layer. HEMTs are fabricated and show an extremely low drain induced barrier lowering value of 0.1 mV/V, demonstrating an excellent buffer isolation. The carbon doped GaN buffer layer using propane gas is compared to samples using carbon from the trimethylgallium molecule, showing equally low leakage currents, demonstrating the capability of growing highly resistive buffer layers using a gaseous carbon source.

  1. Carbon doped GaN buffer layer using propane for high electron mobility transistor applications: Growth and device results

    NASA Astrophysics Data System (ADS)

    Li, X.; Bergsten, J.; Nilsson, D.; Danielsson, Ö.; Pedersen, H.; Rorsman, N.; Janzén, E.; Forsberg, U.

    2015-12-01

    The creation of a semi insulating (SI) buffer layer in AlGaN/GaN High Electron Mobility Transistor (HEMT) devices is crucial for preventing a current path beneath the two-dimensional electron gas (2DEG). In this investigation, we evaluate the use of a gaseous carbon gas precursor, propane, for creating a SI GaN buffer layer in a HEMT structure. The carbon doped profile, using propane gas, is a two stepped profile with a high carbon doping (1.5 × 1018 cm-3) epitaxial layer closest to the substrate and a lower doped layer (3 × 1016 cm-3) closest to the 2DEG channel. Secondary Ion Mass Spectrometry measurement shows a uniform incorporation versus depth, and no memory effect from carbon doping can be seen. The high carbon doping (1.5 × 1018 cm-3) does not influence the surface morphology, and a roughness root-mean-square value of 0.43 nm is obtained from Atomic Force Microscopy. High resolution X-ray diffraction measurements show very sharp peaks and no structural degradation can be seen related to the heavy carbon doped layer. HEMTs are fabricated and show an extremely low drain induced barrier lowering value of 0.1 mV/V, demonstrating an excellent buffer isolation. The carbon doped GaN buffer layer using propane gas is compared to samples using carbon from the trimethylgallium molecule, showing equally low leakage currents, demonstrating the capability of growing highly resistive buffer layers using a gaseous carbon source.

  2. Performance enhancement of GaN metal–semiconductor–metal ultraviolet photodetectors by insertion of ultrathin interfacial HfO{sub 2} layer

    SciTech Connect

    Kumar, Manoj E-mail: aokyay@ee.bilkent.edu.tr; Tekcan, Burak; Okyay, Ali Kemal E-mail: aokyay@ee.bilkent.edu.tr

    2015-03-15

    The authors demonstrate improved device performance of GaN metal–semiconductor–metal ultraviolet (UV) photodetectors (PDs) by ultrathin HfO{sub 2} (UT-HfO{sub 2}) layer on GaN. The UT-HfO{sub 2} interfacial layer is grown by atomic layer deposition. The dark current of the PDs with UT-HfO{sub 2} is significantly reduced by more than two orders of magnitude compared to those without HfO{sub 2} insertion. The photoresponsivity at 360 nm is as high as 1.42 A/W biased at 5 V. An excellent improvement in the performance of the devices is ascribed to allowed electron injection through UT-HfO{sub 2} on GaN interface under UV illumination, resulting in the photocurrent gain with fast response time.

  3. GaN Haeckelite Single-Layered Nanostructures: Monolayer and Nanotubes.

    PubMed

    Camacho-Mojica, Dulce C; López-Urías, Florentino

    2015-12-10

    Nowadays, III-V semiconductors are interesting candidate materials for the tailoring of two dimensional (2D) graphene-like structures. These new 2D materials have attracted profound interest opening the possibility to find semiconductor materials with unexplored properties. First-principles density functional theory calculations are performed in order to investigate the electronic properties of GaN planar and nanotube morphologies based on Haeckelite structures (containing octagonal and square membered rings). Optimized geometries, band-structures, phonon dispersion, binding energies, transmission electron microscopy images simulations, x-ray diffraction patterns, charge densities, and electronic band gaps are calculated. We demonstrated that GaN Haeckelite structures are stable exhibiting a semiconducting behavior with an indirect band gap. Furthermore, it was found that GaN Haeckelite nanotubes are semiconductor with a band gap nature (direct or indirect) that depends of the nanotube's chirality and diameter. In addition, it was demonstrated that surface passivation and the interaction with hydrazine, water, ammonia, and carbon monoxide molecules can change the band-gap nature. Our results are compared with the corresponding GaN hexagonal honeycomb structures.

  4. GaN Haeckelite Single-Layered Nanostructures: Monolayer and Nanotubes

    PubMed Central

    Camacho-Mojica, Dulce C.; López-Urías, Florentino

    2015-01-01

    Nowadays, III-V semiconductors are interesting candidate materials for the tailoring of two dimensional (2D) graphene-like structures. These new 2D materials have attracted profound interest opening the possibility to find semiconductor materials with unexplored properties. First-principles density functional theory calculations are performed in order to investigate the electronic properties of GaN planar and nanotube morphologies based on Haeckelite structures (containing octagonal and square membered rings). Optimized geometries, band-structures, phonon dispersion, binding energies, transmission electron microscopy images simulations, x-ray diffraction patterns, charge densities, and electronic band gaps are calculated. We demonstrated that GaN Haeckelite structures are stable exhibiting a semiconducting behavior with an indirect band gap. Furthermore, it was found that GaN Haeckelite nanotubes are semiconductor with a band gap nature (direct or indirect) that depends of the nanotube´s chirality and diameter. In addition, it was demonstrated that surface passivation and the interaction with hydrazine, water, ammonia, and carbon monoxide molecules can change the band-gap nature. Our results are compared with the corresponding GaN hexagonal honeycomb structures. PMID:26658148

  5. Surface electronic structure of ZrB2 buffer layers for GaN growth on Si wafers

    NASA Astrophysics Data System (ADS)

    Yamada-Takamura, Yukiko; Bussolotti, Fabio; Fleurence, Antoine; Bera, Sambhunath; Friedlein, Rainer

    2010-08-01

    The electronic structure of epitaxial, predominantly single-crystalline thin films of zirconium diboride (ZrB2), a lattice-matching, conductive ceramic to GaN, grown on Si(111) was studied using angle-resolved ultraviolet photoelectron spectroscopy. The existence of Zr-derived surface states dispersing along the Γ¯-M¯ direction indicates a metallic character provided by a two-dimensional Zr-layer at the surface. Together with the measured work function, the results demonstrate that the surface electronic properties of such thin ZrB2(0001) buffer layers are comparable to those of the single crystals promising excellent conduction between nitride layers and the substrate in vertical light-emitting diodes on economic substrates.

  6. Interface roughness of double buffer layer of GaN film grown on Si(1 1 1) substrate using GIXR analysis

    NASA Astrophysics Data System (ADS)

    Yamamoto, Y.; Yamabe, N.; Ohachi, T.

    2011-03-01

    A double buffer layer (DBL), interface reaction epitaxy (IRE) AlN/β-Si3N4/Si, grown by an IRE of β-Si3N4 and AlN films on Si, was fabricated to improve the crystalline quality of successively grown 30 nm GaN on a 30 nm AlN buffer layer using plasma-assisted molecular beam epitaxy (PA-MBE). The DBL was first prepared by surface nitridation of Si and successively prepared by IRE between the deposited Al and N atoms in β-Si3N4. Both the AlN buffer layer on the DBL and GaN film on the AlN buffer layer were grown by activity-modulation migration enhanced epitaxy (AM-MEE). Hetero epitaxial grown films of GaN(30 nm)/AlN buffer(30 nm)/DBL/Si(1 1 1) were prepared for analysis using a three layer model of grazing incidence-angle X-ray reflectivity (GIXR), which consisted of three layers of GaN, AlN buffer and Si and of the three interfaces of the GaN surface, GaN/AlN buffer and AlN buffer/DBL/Si. The nitridation temperature dependence of the interface roughness of the DBL was measured to be 0.5 and 0.6 nm, for nitridation temperatures of 780 and 830 °C, respectively. The full width at half maximum (FWHM) of rocking curve GaN(0 0 0 2) measured by X-ray diffraction (XRD) for nitridation temperatures of 780 and 830 °C were 58.2 and 55.2 arcmin, respectively.

  7. m-plane GaN layers grown by rf-plasma assisted molecular beam epitaxy with varying Ga/N flux ratios on m-plane 4H-SiC substrates

    SciTech Connect

    Armitage, R.; Horita, M.; Suda, J.; Kimoto, T.

    2007-02-01

    A series of m-plane GaN layers with the Ga beam-equivalent pressure (BEP) as the only varied parameter was grown by rf-plasma assisted molecular beam epitaxy on m-plane 4H-SiC substrates using AlN buffer layers. The smoothest growth surfaces and most complete film coalescence were found for the highest Ga BEP corresponding to the Ga droplet accumulation regime. However, better structural quality as assessed by x-ray rocking curves was observed for growth at a lower Ga BEP value below the droplet limit. The variation of rocking curve widths for planes inclined with respect to the epilayer c axis followed a different trend with Ga BEP than those of reflections parallel to the c axis. The GaN layers were found to exhibit a large residual compressive strain along the a axis.

  8. Influence of post-deposition annealing on interfacial properties between GaN and ZrO{sub 2} grown by atomic layer deposition

    SciTech Connect

    Ye, Gang; Wang, Hong Arulkumaran, Subramaniam; Ng, Geok Ing; Li, Yang; Ang, Kian Siong; Geok Ng, Serene Lay; Ji, Rong; Liu, Zhi Hong

    2014-10-13

    Influence of post-deposition annealing on interfacial properties related to the formation/annihilation of interfacial GaO{sub x} layer of ZrO{sub 2} grown by atomic layer deposition (ALD) on GaN is studied. ZrO{sub 2} films were annealed in N{sub 2} atmospheres in temperature range of 300 °C to 700 °C and analyzed by X-ray photoelectron spectroscopy and high-resolution transmission electron microscopy. It has been found that Ga-O bond to Ga-N bond area ratio decreases in the samples annealed at temperatures lower than 500 °C, which could be attributed to the thinning of GaO{sub x} layer associated with low surface defect states due to “clean up” effect of ALD-ZrO{sub 2} on GaN. However, further increase in annealing temperature results in deterioration of interface quality, which is evidenced by increase in Ga-O bond to Ga-N bond area ratio and the reduction of Ga-N binding energy.

  9. Growth and structure of GaN layers on silicon carbide synthesized on a Si substrate by the substitution of atoms: A model of the formation of V-defects during the growth of GaN

    NASA Astrophysics Data System (ADS)

    Kukushkin, S. A.; Osipov, A. V.; Rozhavskaya, M. M.; Myasoedov, A. V.; Troshkov, S. I.; Lundin, V. V.; Sorokin, L. M.; Tsatsul'nikov, A. F.

    2015-09-01

    This paper presents the results of the electron microscopic study of GaN/AlGaN/AlN/SiC/Si(111) structures grown by the metal-organic vapor phase epitaxy. A SiC epitaxial buffer nanolayer has been grown by a new method of substitution of atoms on the Si(111) substrate. It has been found that there is a strong dependence of the density of dislocations and V-defects on the synthesis conditions of SiC and the thickness of the AlN layer. It has been proved experimentally that the creation of a low-temperature AlN insert with a simultaneous decrease in the thickness of the AlN layer to values of no more than 50 nm makes it possible to almost completely prevent the formation of V-defects in the GaN layer. The density of screw and mixed dislocations in the GaN layer of the studied samples lies in the range from 5 × 109 to 1 × 1010 cm-2. A theoretical model of the formation of V-defects during the growth of GaN has been developed.

  10. Strain states of AlN/GaN-stress mitigating layer and their effect on GaN buffer layer grown by ammonia molecular beam epitaxy on 100-mm Si(111)

    SciTech Connect

    Ravikiran, L.; Radhakrishnan, K.; Agrawal, M.; Dharmarasu, N.; Munawar Basha, S.

    2013-09-28

    The effect of strain states of AlN/GaN-stress mitigating layer (SML) on buried crack density and its subsequent influence on the residual stresses in GaN buffer layers grown using ammonia-molecular beam epitaxy on 100-mm Si(111) substrate has been investigated. Different stages involved in the formation of buried cracks, which are crack initialization, growth of relaxed AlN layer, and subsequent lateral over growth, are identified using in-situ curvature measurements. While the increase of GaN thickness in AlN/GaN-SML enhanced its compressive strain relaxation and resulted in reduced buried crack spacing, the variation of AlN thickness did not show any effect on the crack spacing. Moreover, the decrease in the crack spacing (or increase in the buried crack density) was found to reduce the residual compression in 1st and 2nd GaN layers of AlN/GaN-SML structure. The higher buried crack density relaxed the compressive strain in 1st GaN layer, which further reduced its ability to compensate the tensile stress generated during substrate cool down, and hence resulted in lower residual compressive stress in 2nd GaN layer.

  11. Strain states of AlN/GaN-stress mitigating layer and their effect on GaN buffer layer grown by ammonia molecular beam epitaxy on 100-mm Si(111)

    NASA Astrophysics Data System (ADS)

    Ravikiran, L.; Radhakrishnan, K.; Dharmarasu, N.; Agrawal, M.; Munawar Basha, S.

    2013-09-01

    The effect of strain states of AlN/GaN-stress mitigating layer (SML) on buried crack density and its subsequent influence on the residual stresses in GaN buffer layers grown using ammonia-molecular beam epitaxy on 100-mm Si(111) substrate has been investigated. Different stages involved in the formation of buried cracks, which are crack initialization, growth of relaxed AlN layer, and subsequent lateral over growth, are identified using in-situ curvature measurements. While the increase of GaN thickness in AlN/GaN-SML enhanced its compressive strain relaxation and resulted in reduced buried crack spacing, the variation of AlN thickness did not show any effect on the crack spacing. Moreover, the decrease in the crack spacing (or increase in the buried crack density) was found to reduce the residual compression in 1st and 2nd GaN layers of AlN/GaN-SML structure. The higher buried crack density relaxed the compressive strain in 1st GaN layer, which further reduced its ability to compensate the tensile stress generated during substrate cool down, and hence resulted in lower residual compressive stress in 2nd GaN layer.

  12. Correlation between the residual stress and the density of threading dislocations in GaN layers grown by hydride vapor phase epitaxy

    NASA Astrophysics Data System (ADS)

    Barchuk, M.; Röder, C.; Shashev, Y.; Lukin, G.; Motylenko, M.; Kortus, J.; Pätzold, O.; Rafaja, D.

    2014-01-01

    The correlation between the residual stress and the density of threading dislocations was investigated in polar GaN layers that were grown by using hydride vapor phase epitaxy (HVPE) on three different GaN templates. The first template type was GaN grown on sapphire by metal-organic vapor phase epitaxy. The second template type was a closed GaN nucleation layer grown on sapphire by HVPE. The third template type was a non-closed GaN nucleation layer grown by HVPE, which formed isolated pyramids on the sapphire surface. The residual stress was determined using the combination of micro-Raman spectroscopy and modified sin2 ψ method. The interplanar spacings needed for the sin2 ψ method were obtained from the reciprocal space maps that were measured using high-resolution X-ray diffraction. The density of threading dislocations was concluded from the broadening of the reciprocal lattice points that was measured using high-resolution X-ray diffraction as well. The fitting of the reciprocal space maps allowed the character of the threading dislocations to be described quantitatively in terms of the fractions of edge and screw dislocations. It was found that the threading dislocation density increases with increasing compressive residual stress. Furthermore, the dislocation density and the residual stress decrease with increasing thickness of the GaN layers. The edge component of the threading dislocations was dominant in all samples. Still, some differences in the character of the dislocations were observed for different templates.

  13. Study of the effects of GaN buffer layer quality on the dc characteristics of AlGaN/GaN high electron mobility transistors

    DOE PAGES

    Ahn, Shihyun; Zhu, Weidi; Dong, Chen; ...

    2015-04-21

    Here we studied the effect of buffer layer quality on dc characteristics of AlGaN/GaN high electron mobility (HEMTs). AlGaN/GaN HEMT structures with 2 and 5 μm GaN buffer layers on sapphire substrates from two different vendors with the same Al concentration of AlGaN were used. The defect densities of HEMT structures with 2 and 5 μm GaN buffer layer were 7 × 109 and 5 × 108 cm₋2, respectively, as measured by transmission electron microscopy. There was little difference in drain saturation current or in transfer characteristics in HEMTs on these two types of buffer. However, there was no dispersionmore » observed on the nonpassivated HEMTs with 5 μm GaN buffer layer for gate-lag pulsed measurement at 100 kHz, which was in sharp contrast to the 71% drain current reduction for the HEMT with 2 μm GaN buffer layer.« less

  14. Study of the effects of GaN buffer layer quality on the dc characteristics of AlGaN/GaN high electron mobility transistors

    SciTech Connect

    Ahn, Shihyun; Zhu, Weidi; Dong, Chen; Le, Lingcong; Hwang, Ya-Hsi; Kim, Byung-Jae; Ren, Fan; Pearton, Stephen J.; Lind, Aaron G.; Jones, Kevin S.; Kravchenko, I. I.; Zhang, Ming-Lan

    2015-04-21

    Here we studied the effect of buffer layer quality on dc characteristics of AlGaN/GaN high electron mobility (HEMTs). AlGaN/GaN HEMT structures with 2 and 5 μm GaN buffer layers on sapphire substrates from two different vendors with the same Al concentration of AlGaN were used. The defect densities of HEMT structures with 2 and 5 μm GaN buffer layer were 7 × 109 and 5 × 108 cm₋2, respectively, as measured by transmission electron microscopy. There was little difference in drain saturation current or in transfer characteristics in HEMTs on these two types of buffer. However, there was no dispersion observed on the nonpassivated HEMTs with 5 μm GaN buffer layer for gate-lag pulsed measurement at 100 kHz, which was in sharp contrast to the 71% drain current reduction for the HEMT with 2 μm GaN buffer layer.

  15. Zinc-blende (Cubic) GaN and AlGaN Layers, Structures and Bulk Crystals by Molecular Beam Epitaxy

    NASA Astrophysics Data System (ADS)

    Novikov, Sergei V.; Zainal, Norzaini; Akimov, Andrey V.; Staddon, Chris R.; Foxon, C. Thomas; Kent, Anthony J.

    2010-11-01

    We have studied the growth of zinc-blende GaN and AlGaN layers, structures and bulk crystals by molecular beam epitaxy (MBE). We have developed a process for growth by MBE of free-standing cubic GaN layers. Undoped thick cubic GaN films were grown on semi-insulating GaAs (001) substrates by a modified plasma-assisted molecular beam epitaxy (PA-MBE) method and were removed from the GaAs substrate after the growth. The resulting free-standing GaN wafers with thicknesses in the 30-100 μm range may be used as substrates for further epitaxy of cubic GaN-based structures and devices. We have developed procedures to cleave the wafers into 10×10 mm2 square substrates and to polish them to produce epi-ready surfaces. The first GaN/InGaN LEDs on our zinc-blende GaN substrates have been demonstrated by our collaborators at Sharp Laboratories of Europe.

  16. Growth parameter dependence of structural, electrical and magnetic properties in GaGdN layers grown on GaN(0001)

    NASA Astrophysics Data System (ADS)

    Sano, S.; Hasegawa, S.; Mitsuno, Y.; Higashi, K.; Ishimaru, M.; Sakurai, T.; Ohta, H.; Asahi, H.

    2013-09-01

    The growth parameter dependence of structural, electrical and magnetic properties in Gd-doped GaN layers grown by plasma-assisted molecular beam epitaxy has been investigated. The structural and magnetic properties of Gd-doped GaN films grown on GaN templates strongly depend on the MBE growth condition. While Gd-doped GaN grown under relatively high Ga fluxes consist of wurtzite GaGdN layers without Gd-related precipitates, Gd-incorporated GaN films grown under low Ga fluxes contain a lot of nanoparticles ranging from several nm to several tens nm in size. The samples with Gd-related nanoparticles exhibit hysteresis in the magnetization-magnetic field curves at 10 K. The separation between the field-cooled and zero-field-cooled magnetization-temperature curves is observed at around 30 K. This behavior is understood in terms of super-paramagnetism originating from the ferromagnetic nanoparticles observed in the cross-sectional transmission electron microscopy images.

  17. Analysis of reaction between c+a and -c+a dislocations in GaN layer grown on 4-inch Si(111) substrate with AlGaN/AlN strained layer superlattice by transmission electron microscopy

    SciTech Connect

    Sugawara, Yoshihiro; Ishikawa, Yukari; Watanabe, Arata; Miyoshi, Makoto; Egawa, Takashi

    2016-04-15

    The behavior of dislocations in a GaN layer grown on a 4-inch Si(111) substrate with an AlGaN/AlN strained layer superlattice using horizontal metal-organic chemical vapor deposition was observed by transmission electron microscopy. Cross-sectional observation indicated that a drastic decrease in the dislocation density occurred in the GaN layer. The reaction of a dislocation (b=1/3[-211-3]) and anothor dislocation (b =1/3[-2113]) to form one dislocation (b =2/3[-2110]) in the GaN layer was clarified by plan-view observation using weak-beam dark-field and large-angle convergent-beam diffraction methods.

  18. Multicolor light-emitting diodes based on semiconductor nanocrystals encapsulated in GaN charge injection layers.

    PubMed

    Mueller, Alexander H; Petruska, Melissa A; Achermann, Marc; Werder, Donald J; Akhadov, Elshan A; Koleske, Daniel D; Hoffbauer, Mark A; Klimov, Victor I

    2005-06-01

    Numerous technologies including solid-state lighting, displays, and traffic signals can benefit from efficient, color-selectable light sources that are driven electrically. Semiconductor nanocrystals are attractive types of chromophores that combine size-controlled emission colors and high emission efficiencies with excellent photostability and chemical flexibility. Applications of nanocrystals in light-emitting technologies, however, have been significantly hindered by difficulties in achieving direct electrical injection of carriers. Here we report the first successful demonstration of electroluminescence from an all-inorganic, nanocrystal-based architecture in which semiconductor nanocrystals are incorporated into a p-n junction formed from GaN injection layers. The critical step in the fabrication of these nanocrystal/GaN hybrid structures is the use of a novel deposition technique, energetic neutral atom beam lithography/epitaxy, that allows for the encapsulation of nanocrystals within a GaN matrix without adversely affecting either the nanocrystal integrity or its luminescence properties. We demonstrate electroluminescence (injection efficiencies of at least 1%) in both single- and two-color regimes using structures comprising either a single monolayer or a bilayer of nanocrystals.

  19. High performance of Ga-doped ZnO transparent conductive layers using MOCVD for GaN LED applications.

    PubMed

    Horng, Ray-Hua; Shen, Kun-Ching; Yin, Chen-Yang; Huang, Chiung-Yi; Wuu, Dong-Sing

    2013-06-17

    High performance of Ga-doped ZnO (GZO) prepared using metalorganic chemical vapor deposition (MOCVD) was employed in GaN blue light-emitting diodes (LEDs) as transparent conductive layers (TCL). By the post-annealing process, the annealed 800°C GZO films exhibited a high transparency above 97% at wavelength of 450 nm. The contact resistance of GZO decreased with the annealing temperature increasing. It was attributed to the improvement of the GZO crystal quality, leading to an increase in electron concentration. It was also found that some Zn atom caused from the decomposition process diffused into the p-GaN surface of LED, which generated a stronger tunneling effect at the GZO/p-GaN interface and promoted the formation of ohmic contact. Moreover, contrast to the ITO-LED, a high light extraction efficiency of 77% was achieved in the GZO-LED at injection current of 20 mA. At 350 mA injection current, the output power of 256.51 mW of GZO-LEDs, corresponding to a 21.5% enhancement as compared to ITO-LEDs was obtained; results are promising for the development of GZO using the MOCVD technique for GaN LED applications.

  20. Highly-stable and low-state-density Al2O3/GaN interfaces using epitaxial n-GaN layers grown on free-standing GaN substrates

    NASA Astrophysics Data System (ADS)

    Kaneki, Shota; Ohira, Joji; Toiya, Shota; Yatabe, Zenji; Asubar, Joel T.; Hashizume, Tamotsu

    2016-10-01

    Interface characterization was carried out on Al2O3/GaN structures using epitaxial n-GaN layers grown on free-standing GaN substrates with relatively low dislocation density (<3 × 106 cm-2). The Al2O3 layer was prepared by atomic layer deposition. The as-deposited metal-oxide-semiconductor (MOS) sample showed a significant frequency dispersion and a bump-like feature in capacitance-voltage (C-V) curves at reverse bias, showing high-density interface states in the range of 1012 cm-1 eV-1. On the other hand, excellent C-V characteristics with negligible frequency dispersion were observed from the MOS sample after annealing under a reverse bias at 300 °C in air for 3 h. The reverse-bias-annealed sample showed state densities less than 1 × 1011 cm-1 eV-1 and small shifts of flat-band voltage. In addition, the C-V curve measured at 200 °C remained essentially similar compared with the room-temperature C-V curves. These results indicate that the present process realizes a stable Al2O3/GaN interface with low interface state densities.

  1. Substrate impact on the low-temperature growth of GaN thin films by plasma-assisted atomic layer deposition

    SciTech Connect

    Kizir, Seda; Haider, Ali; Biyikli, Necmi

    2016-07-15

    Gallium nitride (GaN) thin films were grown on Si (100), Si (111), and c-plane sapphire substrates at 200 °C via hollow-cathode plasma-assisted atomic layer deposition (HCPA-ALD) using GaEt{sub 3} and N{sub 2}/H{sub 2} plasma as group-III and V precursors, respectively. The main aim of the study was to investigate the impact of substrate on the material properties of low-temperature ALD-grown GaN layers. Structural, chemical, and optical characterizations were carried out in order to evaluate and compare film quality of GaN on different substrates. X-ray reflectivity measurements showed film density values of 5.70, 5.74, and 5.54 g/cm{sup 3} for GaN grown on Si (100), Si (111), and sapphire, respectively. Grazing incidence x-ray diffraction measurements exhibited hexagonal wurtzite structure in all HCPA-ALD grown GaN samples. However, dominant diffraction peak for GaN films grown on Si and sapphire substrates were detected differently as (002) and (103), respectively. X-ray diffraction gonio scans measured from GaN grown on c-plane sapphire primarily showed (002) orientation. All samples exhibited similar refractive index values (∼2.17 at 632 nm) with 2–3 at. % of oxygen impurity existing within the bulk of the films. The grain size was calculated as ∼9–10 nm for GaN grown on Si (100) and Si (111) samples while it was ∼5 nm for GaN/sapphire sample. Root-mean-square surface roughness values found as 0.68, 0.76, and 1.83 nm for GaN deposited on Si (100), Si (111), and sapphire, respectively. Another significant difference observed between the samples was the film growth per cycle: GaN/sapphire sample showed a considerable higher thickness value when compared with GaN/Si samples, which might be attributed to a possibly more-efficient nitridation and faster nucleation of sapphire surface.

  2. GaN Nanowire Functionalized with Atomic Layer Deposition Techniques for Enhanced Immobilization of Biomolecules

    DTIC Science & Technology

    2010-01-01

    GaN NW chips were fabricated using the molecular beam epitaxy technique under the condition of a high substrate temperature (∼800 C) and a high N2...18382 DOI: 10.1021/la103337a Langmuir 2010, 26(23), 18382–18391Published on Web 11/01/2010 pubs.acs.org/Langmuir © 2010 American Chemical Society...detection sensitivity. Three kinds of ALD coating films, Al2O3, TiO2, and SiO2, were grown on the gallium nitride nanowire (GaNNW) surfaces and

  3. Improved crystalline properties of laser molecular beam epitaxy grown SrTiO{sub 3} by rutile TiO{sub 2} layer on hexagonal GaN

    SciTech Connect

    Luo, W. B.; Zhu, J.; Chen, H.; Wang, X. P.; Zhang, Y.; Li, Y. R.

    2009-11-15

    Epitaxial SrTiO{sub 3} films were fabricated by laser molecular beam epitaxy on bare and TiO{sub 2} buffered GaN(0002), respectively. The whole deposition processes were in situ monitored by reflection high energy electron diffraction (RHEED). X-ray diffraction (XRD) was carried out to study the growth orientation and crystalline quality of STO films. The interfacial characters and epitaxial relationships were also investigated by high revolution transition electron microscope and selected area electron diffraction (SAED). According to the RHEED observation, the lowest epitaxy temperature of STO on TiO{sub 2} buffered GaN was decreased compared with the direct deposited one. The epitaxial relationship was (111)[110]STO//(0002)[1120]GaN in both cases as confirmed by RHEED, XRD, and SAED. The full width at half maximum of omega-scan and PHI-scan of STO on TiO{sub 2} buffered GaN was reduced compared with that deposited on bare GaN, indicating that epitaxial quality of STO film is improved by inserting TiO{sub 2} layer. In summary, the lattice mismatch was reduced by inserting rutile TiO{sub 2}. As a result, the crystalline temperature was reduced and enhanced epitaxial quality of STO thin film was obtained.

  4. Orientation-controlled epitaxial lateral overgrowth of semipolar GaN on Si(001) with a directionally sputtered AlN buffer layer

    NASA Astrophysics Data System (ADS)

    Lee, Ho-Jun; Bae, Si-Young; Lekhal, Kaddour; Tamura, Akira; Suzuki, Takafumi; Kushimoto, Maki; Honda, Yoshio; Amano, Hiroshi

    2017-06-01

    We successfully grew semipolar (10 1 ̅ 3) and (10 1 ̅ 5) GaN films on Si(001) substrates employing metal-organic chemical vapor deposition (MOCVD) by inserting a directionally sputtered AlN (DS-AlN) buffer layer. To improve the crystal quality of the orientation-controlled semipolar (10 1 ̅ 3) and (10 1 ̅ 5) GaN films, a two-step epitaxial lateral overgrowth (ELO) process was performed with a striped mask. According to low-temperature cathodoluminescence (LT-CL) characterization, the ELO results in a coalesced morphology and a low defect density of <2.72×108 cm-2 for both semipolar (10 1 ̅ 3) and (10 1 ̅ 5) GaN films. For comparing the properties of planar and ELO semipolar GaN, a rocking curve of x-ray diffraction (XRD) and low-temperature photoluminescence (LT-PL) spectra was measured. The crystal orientation of semipolar GaN films was confirmed using electron backscatter diffraction (EBSD).

  5. Effect of AlN buffer layer properties on the morphology and polarity of GaN nanowires grown by molecular beam epitaxy

    SciTech Connect

    Brubaker, Matt D.; Rourke, Devin M.; Sanford, Norman A.; Bertness, Kris A.; Bright, Victor M.

    2011-09-01

    Low-temperature AlN buffer layers grown via plasma-assisted molecular beam epitaxy on Si (111) were found to significantly affect the subsequent growth morphology of GaN nanowires. The AlN buffer layers exhibited nanowire-like columnar protrusions, with their size, shape, and tilt determined by the AlN V/III flux ratio. GaN nanowires were frequently observed to adopt the structural characteristics of the underlying AlN columns, including the size and the degree of tilt. Piezoresponse force microscopy and polarity-sensitive etching indicate that the AlN films and the protruding columns have a mixed crystallographic polarity. Convergent beam electron diffraction indicates that GaN nanowires are Ga-polar, suggesting that Al-polar columns are nanowire nucleation sites for Ga-polar nanowires. GaN nanowires of low density could be grown on AlN buffers that were predominantly N-polar with isolated Al-polar columns, indicating a high growth rate for Ga-polar nanowires and suppressed growth of N-polar nanowires under typical growth conditions. AlN buffer layers grown under slightly N-rich conditions (V/III flux ratio = 1.0 to 1.3) were found to provide a favorable growth surface for low-density, coalescence-free nanowires.

  6. Direct growth of GaN layer on carbon nanotube-graphene hybrid structure and its application for light emitting diodes

    PubMed Central

    Seo, Tae Hoon; Park, Ah Hyun; Park, Sungchan; Kim, Yong Hwan; Lee, Gun Hee; Kim, Myung Jong; Jeong, Mun Seok; Lee, Young Hee; Hahn, Yoon-Bong; Suh, Eun-Kyung

    2015-01-01

    We report the growth of high-quality GaN layer on single-walled carbon nanotubes (SWCNTs) and graphene hybrid structure (CGH) as intermediate layer between GaN and sapphire substrate by metal-organic chemical vapor deposition (MOCVD) and fabrication of light emitting diodes (LEDs) using them. The SWCNTs on graphene act as nucleation seeds, resulting in the formation of kink bonds along SWCNTs with the basal plane of the substrate. In the x-ray diffraction, Raman and photoluminescence spectra, high crystalline quality of GaN layer grown on CGH/sapphire was observed due to the reduced threading dislocation and efficient relaxation of residual compressive strain caused by lateral overgrowth process. When applied to the LED structure, the current-voltage characteristics and electroluminescence (EL) performance exhibit that blue LEDs fabricated on CGH/sapphire well-operate at high injection currents and uniformly emit over the whole emission area. We expect that CGH can be applied for the epitaxial growth of GaN on various substrates such as Si and MgO, which can be a great advantage in electrical and thermal properties of optical devices fabricated on them. PMID:25597492

  7. Direct growth of GaN layer on carbon nanotube-graphene hybrid structure and its application for light emitting diodes

    NASA Astrophysics Data System (ADS)

    Seo, Tae Hoon; Park, Ah Hyun; Park, Sungchan; Kim, Yong Hwan; Lee, Gun Hee; Kim, Myung Jong; Jeong, Mun Seok; Lee, Young Hee; Hahn, Yoon-Bong; Suh, Eun-Kyung

    2015-01-01

    We report the growth of high-quality GaN layer on single-walled carbon nanotubes (SWCNTs) and graphene hybrid structure (CGH) as intermediate layer between GaN and sapphire substrate by metal-organic chemical vapor deposition (MOCVD) and fabrication of light emitting diodes (LEDs) using them. The SWCNTs on graphene act as nucleation seeds, resulting in the formation of kink bonds along SWCNTs with the basal plane of the substrate. In the x-ray diffraction, Raman and photoluminescence spectra, high crystalline quality of GaN layer grown on CGH/sapphire was observed due to the reduced threading dislocation and efficient relaxation of residual compressive strain caused by lateral overgrowth process. When applied to the LED structure, the current-voltage characteristics and electroluminescence (EL) performance exhibit that blue LEDs fabricated on CGH/sapphire well-operate at high injection currents and uniformly emit over the whole emission area. We expect that CGH can be applied for the epitaxial growth of GaN on various substrates such as Si and MgO, which can be a great advantage in electrical and thermal properties of optical devices fabricated on them.

  8. High quality InAlN single layers lattice-matched to GaN grown by molecular beam epitaxy

    SciTech Connect

    Gacevic, Z.; Fernandez-Garrido, S.; Calleja, E.; Estrade, S.

    2011-07-18

    We report on properties of high quality {approx}60 nm thick InAlN layers nearly in-plane lattice-matched to GaN, grown on c-plane GaN-on-sapphire templates by plasma-assisted molecular beam epitaxy. Excellent crystalline quality and low surface roughness are confirmed by X-ray diffraction, transmission electron microscopy, and atomic force microscopy. High annular dark field observations reveal a periodic in-plane indium content variation (8 nm period), whereas optical measurements evidence certain residual absorption below the band-gap. The indium fluctuation is estimated to be {+-} 1.2% around the nominal 17% indium content via plasmon energy oscillations assessed by electron energy loss spectroscopy with sub-nanometric spatial resolution.

  9. Layer-transferred MoS2/GaN PN diodes

    NASA Astrophysics Data System (ADS)

    Lee, Edwin W.; Lee, Choong Hee; Paul, Pran K.; Ma, Lu; McCulloch, William D.; Krishnamoorthy, Sriram; Wu, Yiying; Arehart, Aaron R.; Rajan, Siddharth

    2015-09-01

    Electrical and optical characterization of two-dimensional/three-dimensional (2D/3D) p-molybdenum disulfide/n-gallium nitride (p-MoS2/n-GaN) heterojunction diodes are reported. Devices were fabricated on high-quality, large-area p-MoS2 grown by chemical vapor deposition on sapphire substrates. The processed devices were transferred onto GaN/sapphire substrates, and the transferred films were characterized by X-ray diffraction (XRD) and atomic force microscopy (AFM). On-axis XRD spectra and surface topology obtained from AFM scans were consistent with previously grown high-quality, continuous MoS2 films. Current-voltage measurements of these diodes exhibited excellent rectification, and capacitance-voltage measurements were used to extract a conduction band offset of 0.23 eV for the transferred MoS2/GaN heterojunction. This conduction band offset was confirmed by internal photoemission measurements. The energy band lineup of the MoS2/GaN heterojunction is proposed here. This work demonstrates the potential of 2D/3D heterojunctions for novel device applications.

  10. Layer-transferred MoS{sub 2}/GaN PN diodes

    SciTech Connect

    Lee, Edwin W.; Lee, Choong Hee; Paul, Pran K.; Krishnamoorthy, Sriram; Arehart, Aaron R.; Ma, Lu; McCulloch, William D.; Wu, Yiying; Rajan, Siddharth

    2015-09-07

    Electrical and optical characterization of two-dimensional/three-dimensional (2D/3D) p-molybdenum disulfide/n-gallium nitride (p-MoS{sub 2}/n-GaN) heterojunction diodes are reported. Devices were fabricated on high-quality, large-area p-MoS{sub 2} grown by chemical vapor deposition on sapphire substrates. The processed devices were transferred onto GaN/sapphire substrates, and the transferred films were characterized by X-ray diffraction (XRD) and atomic force microscopy (AFM). On-axis XRD spectra and surface topology obtained from AFM scans were consistent with previously grown high-quality, continuous MoS{sub 2} films. Current-voltage measurements of these diodes exhibited excellent rectification, and capacitance-voltage measurements were used to extract a conduction band offset of 0.23 eV for the transferred MoS{sub 2}/GaN heterojunction. This conduction band offset was confirmed by internal photoemission measurements. The energy band lineup of the MoS{sub 2}/GaN heterojunction is proposed here. This work demonstrates the potential of 2D/3D heterojunctions for novel device applications.

  11. Digitally Alloyed Modulated Precursor Flow Epitaxial Growth of Ternary AlGaN with Binary AlN and GaN Sub-Layers and Observation of Compositional Inhomogeneity

    NASA Astrophysics Data System (ADS)

    Kim, Hee Jin; Choi, Suk; Yoo, Dongwon; Ryou, Jae-Hyun; Hawkridge, Michael E.; Liliental-Weber, Zuzanna; Dupuis, Russell D.

    2010-05-01

    We report the growth of ternary aluminum gallium nitride (AlGaN) layers on AlN/sapphire template/substrates by digitally alloyed modulated precursor flow epitaxial growth (DA-MPEG), which combined an MPEG AlN sub-layer with a conventional metalorganic chemical vapor deposition (MOCVD)-grown GaN sub-layer. The overall composition in DA-MPEG Al x Ga1- x N was controlled by adjustment of the growth time (i.e., the thickness) of the GaN sub-layer. As the GaN sub-layer growth time increased, the Al composition in AlGaN decreased to 50%, but the surface morphology of the AlGaN layer became rough, and a three-dimensional structure with islands appeared for the DA-MPEG AlGaN with relatively thick GaN sub-layers, possibly resulting from the Ga adatom surface migration behavior and/or the strain built up from lattice mismatch between AlN and GaN sub-layers with increasing GaN sub-layer growth time. Through strain analysis by high-resolution x-ray diffraction, reciprocal space mapping, and scanning transmission electron microscopy, it was found that there was compositional inhomogeneity in the DA-MPEG AlGaN with AlN and GaN binary sub-layers for the case of the layer with relatively thick GaN sub-layers.

  12. Two-dimensional radiative equilibrium of a gray medium in a plane layer bounded by gray nonisothermal walls

    NASA Technical Reports Server (NTRS)

    Modest, M. F.

    1974-01-01

    Radiative equilibrium temperature and surface heat flux distributions are calculated for an absorbing-emitting gray medium in an infinite plane layer bounded by gray diffuse walls with arbitrary temperature distributions. Superposition is used to obtain the solution for the differential approximation, which yields good accuracy for the optically thick medium. To also obtain accurate results for optically thin and intermediate regimes, the differential approximation is subsequently improved by a number of geometrical parameters, which are derived from the exact expression for the intensity. As an example, the case of constant temperature at the upper wall and a temperature step at the lower wall without heat generation in the medium is presented. Comparison with other available results shows excellent agreement.

  13. Magnetically active vacancy related defects in irradiated GaN layers

    SciTech Connect

    Kilanski, L.; Tuomisto, F.; Szymczak, R.

    2012-08-13

    We present the studies of magnetic properties of 2 MeV {sup 4}He{sup +}-irraadiated GaN grown by metal-organic chemical-vapor deposition. Particle irradiation allowed controllable introduction of Ga-vacancy in the samples. The magnetic moments with concentrations changing between 4.3 and 8.3 Multiplication-Sign 10{sup 17}cm{sup -3} showing superparamagnetic blocking at room temperature are observed. The appearance of clear hysteresis curve at T=5K with coercive field of about H{sub C} Almost-Equal-To 270 Oe suggests that the formation of more complex Ga vacancy related defects is promoted with increasing Ga vacancy content. The small concentration of the observed magnetically active defects with respect to the total Ga-vacancy concentration suggests that the presence of the oxygen/hydrogen-related vacancy complexes is the source of the observed magnetic moments.

  14. Characterization of deep defects responsible for the quenching behavior in undoped GaN layers

    NASA Astrophysics Data System (ADS)

    Witte, H.; Schrenk, E.; Flügge, K.; Krost, A.; Christen, J.; Kuhn, B.; Scholz, F.

    2005-03-01

    In undoped semi-insulating GaN samples grown by metal-organic vapor phase epitaxy on sapphire, the recombination and quenching processes were investigated for the main deep traps responsible for quenching. A comprehensive picture is obtained by using different complementary techniques of thermally stimulated current spectroscopy (TSC). Three traps— Q1 , Q2 , and Q3 —were separated in the temperature region between 200 and 300K . Variations of the excitation and the cleaning temperature suggest a two-step trapping process of the defects Q2 and Q3 . Quenching experiments evidence the involvement of these traps in the quenching process and the existence of two metastable states. These results are summarized in a model involving two metastable states and a complex two-step recharging trapping process.

  15. Growth kinetics for temperature-controlled atomic layer deposition of GaN using trimethylgallium and remote-plasma-excited NH3

    NASA Astrophysics Data System (ADS)

    Pansila, P.; Kanomata, K.; Miura, M.; Ahmmad, B.; Kubota, S.; Hirose, F.

    2015-12-01

    Fundamental surface reactions in the atomic layer deposition of GaN with trimethylgallium (TMG) and plasma-excited NH3 are investigated by multiple-internal-reflection infrared absorption spectroscopy (MIR-IRAS) at surface temperatures varying from room temperature (RT) to 400 °C. It is found that TMG is saturated at RT on GaN surfaces when the TMG exposure exceeds 8 × 104 Langmuir (L), where 1 L corresponds to 1.33 × 10-4 Pa s (or 1.0 × 10-6 Torr s), and its saturation density reaches the maximum value at RT. Nitridation with the plasma-excited NH3 on the TMG-saturated GaN surface is investigated by X-ray photoelectron spectroscopy (XPS). The nitridation becomes effective at surface temperatures in excess of 100 °C. The reaction models of TMG adsorption and nitridation on the GaN surface are proposed in this paper. Based on the surface analysis, a temperature-controlled ALD process consisting of RT-TMG adsorption and nitridation at 115 °C is examined, where the growth per cycle of 0.045 nm/cycle is confirmed. XPS analysis indicates that all N atoms are bonded as GaN. Atomic force microscopy indicates an average roughness of 0.23 nm. We discuss the reaction mechanism of GaN ALD in the low-temperature region at around 115 °C with TMG and plasma-excited NH3.

  16. Optical in-situ monitoring system for simultaneous measurement of thickness and curvature of thick layer stacks during hydride vapor phase epitaxy growth of GaN

    NASA Astrophysics Data System (ADS)

    Semmelroth, K.; Berwian, P.; Schröter, C.; Leibiger, G.; Schönleber, M.; Friedrich, J.

    2015-10-01

    For improved real-time process control we integrated a novel optical in-situ monitoring system in a vertical reactor for hydride vapor phase epitaxy (HVPE) growth of gallium nitride (GaN) bulk crystals. The in-situ monitoring system consists of a fiber-optical interferometric sensor in combination with an optimized differential measuring head. The system only needs one small optical path perpendicular to the center of the layer stack typically consisting of sapphire as substrate and GaN. It can handle sample distances up to 1 m without difficulty. The in-situ monitoring system is simultaneously measuring the optical layer thicknesses of the GaN/sapphire layer stack and the absolute change of the distance between the measuring head and the backside of the layer stack. From this data it is possible to calculate the thickness of the growing GaN up to a thickness of about 1000 μm and the absolute change in curvature of the layer stack. The performance of the in-situ monitoring system is shown and discussed based on the measured interference signals recorded during a short-time and a long-time HVPE growth run.

  17. The three-dimensional evolution of a plane mixing layer. Part 1: The Kelvin-Helmholtz roll-up

    NASA Technical Reports Server (NTRS)

    Rogers, Michael M.; Moser, Robert D.

    1991-01-01

    The Kelvin Helmholtz roll up of three dimensional, temporally evolving, plane mixing layers were simulated numerically. All simulations were begun from a few low wavenumber disturbances, usually derived from linear stability theory, in addition to the mean velocity profile. The spanwise disturbance wavelength was taken to be less than or equal to the streamwise wavelength associated with the Kelvin Helmholtz roll up. A standard set of clean structures develop in most of the simulations. The spanwise vorticity rolls up into a corrugated spanwise roller, with vortex stretching creating strong spanwise vorticity in a cup shaped region at the vends of the roller. Predominantly streamwise rib vortices develop in the braid region between the rollers. For sufficiently strong initial three dimensional disturbances, these ribs collapse into compact axisymmetric vortices. The rib vortex lines connect to neighboring ribs and are kinked in the opposite direction of the roller vortex lines. Because of this, these two sets of vortex lines remain distinct. For certain initial conditions, persistent ribs do not develop. In such cases the development of significant three dimensionality is delayed. When the initial three dimensional disturbance energy is about equal to, or less than, the two dimensional fundamental disturbance energy, the evolution of the three dimensional disturbance is nearly linear (with respect to the mean and the two dimensional disturbances), at least until the first Kelvin Helmholtz roll up is completed.

  18. The three-dimensional evolution of a plane mixing layer. Part 2: Pairing and transition to turbulence

    NASA Technical Reports Server (NTRS)

    Moser, Robert D.; Rogers, Michael M.

    1992-01-01

    The evolution of three-dimensional temporally evolving plane mixing layers through as many as three pairings was simulated numerically. Initial conditions for all simulations consisted of a few low-wavenumber disturbances, usually derived from linear stability theory, in addition to the mean velocity. Three-dimensional perturbations were used with amplitudes ranging from infinitesimal to large enough to trigger a rapid transition to turbulence. Pairing is found both to inhibit the growth of infinitesimal three-dimensional disturbances and to trigger the transition to turbulence in highly three dimensional flows. The mechanisms responsible for the growth of three-dimensionality as well as the initial phases of the transition to turbulence are described. The transition to turbulence is accompanied by the formation of thin sheets of span wise vorticity, which undergo a secondary roll up. Transition also produces an increase in the degree of scalar mixing, in agreement with experimental observations of mixing transition. Simulations were also conducted to investigate changes in span wise length scale that may occur in response to the change in stream wise length scale during a pairing. The linear mechanism for this process was found to be very slow, requiring roughly three pairings to complete a doubling of the span wise scale. Stronger three-dimensionality can produce more rapid scale changes but is also likely to trigger transition to turbulence. No evidence was found for a change from an organized array of rib vortices at one span wise scale to a similar array at a larger span wise scale.

  19. Comparison of trimethylgallium and triethylgallium as “Ga” source materials for the growth of ultrathin GaN films on Si (100) substrates via hollow-cathode plasma-assisted atomic layer deposition

    SciTech Connect

    Alevli, Mustafa; Haider, Ali; Kizir, Seda; Leghari, Shahid A.; Biyikli, Necmi

    2016-01-15

    GaN films grown by hollow cathode plasma-assisted atomic layer deposition using trimethylgallium (TMG) and triethylgallium (TEG) as gallium precursors are compared. Optimized and saturated TMG/TEG pulse widths were used in order to study the effect of group-III precursors. The films were characterized by grazing incidence x-ray diffraction, atomic force microscopy, x-ray photoelectron spectroscopy, and spectroscopic ellipsometry. Refractive index follows the same trend of crystalline quality, mean grain, and crystallite sizes. GaN layers grown using TMG precursor exhibited improved structural and optical properties when compared to GaN films grown with TEG precursor.

  20. Low temperature (100 °C) atomic layer deposited-ZrO2 for recessed gate GaN HEMTs on Si

    NASA Astrophysics Data System (ADS)

    Byun, Young-Chul; Lee, Jae-Gil; Meng, Xin; Lee, Joy S.; Lucero, Antonio T.; Kim, Si Joon; Young, Chadwin D.; Kim, Moon J.; Kim, Jiyoung

    2017-08-01

    In this paper, the effect of atomic layer deposited ZrO2 gate dielectrics, deposited at low temperature (100 °C), on the characteristics of recessed-gate High Electron Mobility Transistors (HEMTs) on Al0.25Ga0.75N/GaN/Si is investigated and compared with the characteristics of those with ZrO2 films deposited at typical atomic layer deposited (ALD) process temperatures (250 °C). Negligible hysteresis (ΔVth < 20 mV), low gate leakage current (Ig@2 V = 6.6 × 10-6 A/cm2), high breakdown voltage (>4 V), and low interfacial state density (Dit = 3.69 × 1011 eV-1 cm-2) were observed on recessed gate HEMTs with ˜5 nm ALD-ZrO2 films grown at 100 °C. The excellent properties of recessed gate HEMTs are due to the absence of an interfacial layer and an amorphous phase of the film. An interfacial layer between 250 °C-ZrO2 and GaN is observed via high-resolution transmission electron microscopy and X-ray photoelectron spectroscopy. However, 100 °C-ZrO2 and GaN shows no significant interfacial layer formation. Moreover, while 100 °C-ZrO2 films maintain an amorphous phase on either substrate (GaN and Si), 250 °C-ZrO2 films exhibit a polycrystalline-phase when deposited on GaN and an amorphous phase when deposited on Si. Contrary to popular belief, the low-temperature ALD process for ZrO2 results in excellent HEMT performance.

  1. GaN Epitaxial Layer Grown with Conductive Al(x)Ga(1-x)N Buffer Layer on SiC Substrate Using Metal Organic Chemical Vapor Deposition.

    PubMed

    So, Byeongchan; Lee, Kyungbae; Lee, Kyungjae; Heo, Cheon; Pyeon, Jaedo; Ko, Kwangse; Jang, Jongjin; Nam, Okhyun

    2016-05-01

    This study investigated GaN epitaxial layer growth with a conductive Al(x)Ga(1-x)N buffer layer on n-type 4H-SiC by high-temperature metalorganic chemical vapor deposition (HT-MOCVD). The Al composition of the Al(x)Ga(1-x)N buffer was varied from 0% to 100%. In terms of the crystal quality of the GaN layer, 79% Al was the optimal composition of the Al(x)Ga(1-x)N buffer layer in our experiment. A vertical conductive structure was fabricated to measure the current voltage (I-V) characteristics as a function of Al composition, and the I-V curves showed that the resistance increased with increasing Al concentration of the Al(x)Ga(1-x)N buffer layer.

  2. Co-adsorption of water and oxygen on GaN: Effects of charge transfer and formation of electron depletion layer

    NASA Astrophysics Data System (ADS)

    Wang, Qi; Puntambekar, Ajinkya; Chakrapani, Vidhya

    2017-09-01

    Species from ambient atmosphere such as water and oxygen are known to affect electronic and optical properties of GaN, but the underlying mechanism is not clearly known. In this work, we show through careful measurement of electrical resistivity and photoluminescence intensity under various adsorbates that the presence of oxygen or water vapor alone is not sufficient to induce electron transfer to these species. Rather, the presence of both water and oxygen is necessary to induce electron transfer from GaN that leads to the formation of an electron depletion region on the surface. Exposure to acidic gases decreases n-type conductivity due to increased electron transfer from GaN, while basic gases increase n-type conductivity and PL intensity due to reduced charge transfer from GaN. These changes in the electrical and optical properties, as explained using a new electrochemical framework based on the phenomenon of surface transfer doping, suggest that gases interact with the semiconductor surface through electrochemical reactions occurring in an adsorbed water layer present on the surface.

  3. The structure of crystallographic damage in GaN formed during rare earth ion implantation with and without an ultrathin AlN capping layer

    NASA Astrophysics Data System (ADS)

    Gloux, F.; Ruterana, P.; Wojtowicz, T.; Lorenz, K.; Alves, E.

    2006-10-01

    The crystallographic nature of the damage created in GaN implanted by rare earth ions at 300 keV and room temperature has been investigated by transmission electron microscopy versus the fluence, from 7×10 13 to 2×10 16 at/cm 2, using Er, Eu or Tm ions. The density of point defect clusters was seen to increase with the fluence. From about 3×10 15 at/cm 2, a highly disordered 'nanocrystalline layer' (NL) appears on the GaN surface. Its structure exhibits a mixture of voids and misoriented nanocrystallites. Basal stacking faults (BSFs) of I 1, E and I 2 types have been noticed from the lowest fluence, they are I 1 in the majority. Their density increases and saturates when the NL is observed. Many prismatic stacking faults (PSFs) with Drum atomic configuration have been identified. The I 1 BSFs are shown to propagate easily through GaN by folding from basal to prismatic planes thanks to the PSFs. When implanting through a 10 nm AlN cap, the NL threshold goes up to about 3×10 16 at/cm 2. The AlN cap plays a protective role against the dissociation of the GaN up to the highest fluences. The flat surface after implantation and the absence of SFs in the AlN cap indicate its high resistance to the damage formation.

  4. Co-adsorption of water and oxygen on GaN: Effects of charge transfer and formation of electron depletion layer.

    PubMed

    Wang, Qi; Puntambekar, Ajinkya; Chakrapani, Vidhya

    2017-09-14

    Species from ambient atmosphere such as water and oxygen are known to affect electronic and optical properties of GaN, but the underlying mechanism is not clearly known. In this work, we show through careful measurement of electrical resistivity and photoluminescence intensity under various adsorbates that the presence of oxygen or water vapor alone is not sufficient to induce electron transfer to these species. Rather, the presence of both water and oxygen is necessary to induce electron transfer from GaN that leads to the formation of an electron depletion region on the surface. Exposure to acidic gases decreases n-type conductivity due to increased electron transfer from GaN, while basic gases increase n-type conductivity and PL intensity due to reduced charge transfer from GaN. These changes in the electrical and optical properties, as explained using a new electrochemical framework based on the phenomenon of surface transfer doping, suggest that gases interact with the semiconductor surface through electrochemical reactions occurring in an adsorbed water layer present on the surface.

  5. Effect of GaN template layer strain on the growth of InxGa1-xN/GaN MQW light emitting diodes

    SciTech Connect

    Johnson, M.C.; Bourret-Courchesne, E.D.; Wu, J.; Liliental-Weber, Z.; Zakharov, D.N.; Jorgenson, R.J.; Ng, T.B.; McCready, D.E.; Williams, J.R.

    2004-01-15

    GaN template layer strain effects were investigated on the growth of InGaN/GaN LED devices. Seven period InGaN/GaN multiple quantum well structures were deposited on 5{micro}m and 15{micro}m GaN template layers. It was found that the electroluminescence emission of the 15{micro}m device was red-shifted by approximately 132meV. Triple-axis X-Ray Diffraction and Cross-Sectional Transmission Electron Microscopy show that the 15{micro}m templay layer device was virtually unstrained while the 5{micro}m layer experienced tensile strain. Dynamic Secondary Ion Mass Spectrometry depth profiles show that the 15{micro}m template layer device had an average indium concentration of 11% higher than that of the 5{micro}m template layer device even though the structures were deposited during the same growth run. It was also found that the 15{micro}m layer device had a higher growth rate than the 5{micro}m template layer device. This difference in indium concentration and growth rate was due to changes in thermodynamic limitations caused by strain differences in the template layers.

  6. Evaluation of the interface of thin GaN layers on c- and m-plane ZnO substrates by Rutherford backscattering

    SciTech Connect

    Izawa, Y.; Oga, T.; Ida, T.; Kuriyama, K.; Hashimoto, A.; Kotake, H.; Kamijoh, T.

    2011-07-11

    Lattice distortion at the interfaces between thin GaN layers with {approx}400 nm in thickness and ZnO substrates with non-polar m-plane (10-10) and polar c-plane (0001) is studied using Rutherford backscattering/ion channeling techniques. The interface between GaN/m-plane ZnO is aligned clearly to m-axis, indicating no lattice distortion, while between GaN/c-plane ZnO causes the lattice distortion in the GaN layer due to the piezoelectric field. The range of distortion exceeds {approx}90 nm from the interface of GaN/c-plane ZnO. These results are confirmed by x-ray diffraction and reflection high energy electron diffraction studies.

  7. Zero lattice mismatch and twin-free single crystalline ScN buffer layers for GaN growth on silicon

    SciTech Connect

    Lupina, L.; Zoellner, M. H.; Dietrich, B.; Capellini, G.; Niermann, T.; Lehmann, M.; Thapa, S. B.; Haeberlen, M.; Storck, P.; Schroeder, T.

    2015-11-16

    We report the growth of thin ScN layers deposited by plasma-assisted molecular beam epitaxy on Sc{sub 2}O{sub 3}/Y{sub 2}O{sub 3}/Si(111) substrates. Using x-ray diffraction, Raman spectroscopy, and transmission electron microscopy, we find that ScN films grown at 600 °C are single crystalline, twin-free with rock-salt crystal structure, and exhibit a direct optical band gap of 2.2 eV. A high degree of crystalline perfection and a very good lattice matching between ScN and GaN (misfit < 0.1%) makes the ScN/Sc{sub 2}O{sub 3}/Y{sub 2}O{sub 3} buffer system a very promising template for the growth of high quality GaN layers on silicon.

  8. Mechanisms of ion-induced GaN thin layer splitting

    NASA Astrophysics Data System (ADS)

    Moutanabbir, O.; Chabal, Y. J.; Chicoine, M.; Christiansen, S.; Krause-Rehberg, R.; Schiettekatte, F.; Scholz, R.; Seitz, O.; Senz, S.; Süßkraut, F.; Gösele, U.

    2009-05-01

    The underlying physics and the role of H-defect interaction in H ion-induced splitting of GaN were investigated by transmission electron microscopy, high resolution X-ray diffraction, positron annihilation spectroscopy, ion channeling, elastic recoil detection, and infrared spectroscopy. A high concentration of void-like nanoscopic structures, nanobubbles, is detected immediately after implantation. Positron annihilation measurements demonstrate that the detected structures are vacancy clusters. FTIR data show that H-defect vibrational spectrum peaks at 3141 cm-1 mode attributed to VGa-H4. A large fraction of H was found to be trapped in higher frequency modes which we associate tentatively to N-H stretch modes in the internal surfaces of nanobubbles. These nanobubbles persist during annealing up to 450 °C. An increase of the strain is observed in this temperature range. This strain relaxes partially above 450 °C following the formation of the platelets which are embryos of the microcracks.

  9. Atomic layer deposition TiO2-Al2O3 stack: An improved gate dielectric on Ga-polar GaN metal oxide semiconductor capacitors

    DOE PAGES

    Wei, Daming; Edgar, James H.; Briggs, Dayrl P.; ...

    2014-10-15

    This research focuses on the benefits and properties of TiO2-Al2O3 nano-stack thin films deposited on Ga2O3/GaN by plasma-assisted atomic layer deposition (PA-ALD) for gate dielectric development. This combination of materials achieved a high dielectric constant, a low leakage current, and a low interface trap density. Correlations were sought between the films’ structure, composition, and electrical properties. The gate dielectrics were approximately 15 nm thick and contained 5.1 nm TiO2, 7.1 nm Al2O3 and 2 nm Ga2O3 as determined by spectroscopic ellipsometry. The interface carbon concentration, as measured by x-ray photoelectron spectroscopy (XPS) depth profile, was negligible for GaN pretreated bymore » thermal oxidation in O2 for 30 minutes at 850°C. The RMS roughness slightly increased after thermal oxidation and remained the same after ALD of the nano-stack, as determined by atomic force microscopy. The dielectric constant of TiO2-Al2O3 on Ga2O3/GaN was increased to 12.5 compared to that of pure Al2O3 (8~9) on GaN. In addition, the nano-stack's capacitance-voltage (C-V) hysteresis was small, with a total trap density of 8.74 × 1011 cm-2. The gate leakage current density (J=2.81× 10-8 A/cm2) was low at +1 V gate bias. These results demonstrate the promising potential of plasma ALD deposited TiO2/Al2O3 for serving as the gate oxide on Ga2O3/GaN based MOS devices.« less

  10. The effect of AlN nucleation temperature on inverted pyramid defects in GaN layers grown on 200 mm silicon wafers

    NASA Astrophysics Data System (ADS)

    Charles, Matthew; Baines, Yannick; Bos, Sandra; Escoffier, René; Garnier, Gennie; Kanyandekwe, Joël; Lebreton, Julie; Vandendaele, William

    2017-04-01

    We have examined 200 mm GaN on silicon wafers, while varying the AlN nucleation temperature, and have found that higher temperatures result in a more convex bow on the wafers. In addition, by performing full wafer defect mapping, we have found that a higher nucleation temperature results in a higher density of inverted pyramid defects, which have previously been found to reduce the breakdown voltage of GaN on silicon layers. We have performed electrical measurements on a wafer with the lowest temperature AlN layer, which is still within our bow specification, and which therefore has the lowest density of inverted pyramid defects. This wafer showed the same leakage current density for both very small and very large test structures (2×10-3 and 18.7 mm2 respectively), with all but one of our large structures maintaining a breakdown voltage greater than 700 V. This is a very promising result for high yield of devices on 200 mm GaN on silicon wafers.

  11. Crystallographic tilt and in-plane anisotropies of an a-plane InGaN/GaN layered structure grown by MOCVD on r-plane sapphire using a ZnO buffer

    NASA Astrophysics Data System (ADS)

    Liu, H. F.; Liu, W.; Guo, S.; Chi, D. Z.

    2016-03-01

    High-resolution x-ray diffraction (HRXRD) was used to investigate the crystallographic tilts and structural anisotropies in epitaxial nonpolar a-plane InGaN/GaN grown by metal-organic chemical vapor deposition on r-plane sapphire using a ZnO buffer. The substrate had an unintentional miscut of 0.14° towards its [-4 2 2 3] axis. However, HRXRD revealed a tilt of 0.26° (0.20°) between the ZnO (GaN) (11-20) and the Al2O3 (1-102) atomic planes, with the (11-20) axis of ZnO (GaN) tilted towards its c-axis, which has a difference of 163° in azimuth from that of the substrate’s miscut. Excess broadenings in the GaN/ZnO (11-20) rocking curves (RCs) were observed along its c-axis. Specific analyses revealed that partial dislocations and anisotropic in-plane strains, rather than surface-related effects, wafer curvature or stacking faults, are the dominant factors for the structural anisotropy. The orientation of the partial dislocations is most likely affected by the miscut of the substrate, e.g. via tilting of the misfit dislocation gliding planes created during island coalescences. Their Burgers vector components in the growth direction, in turn, gave rise to crystallographic tilts in the same direction as that of the excess RC-broadenings.

  12. Local Strain, Defects and Crystallographic Tilt in GaN(0001) Layers Grown by Maskless Pendeo-epitaxy from X-ray Microdiffraction

    SciTech Connect

    Barabash, R.I.; Ice, G.E.; Liu, W.; Einfeldt, S.; Roskovski, A.M.; Davis, R.F.

    2010-07-13

    Polychromatic x-ray microdiffraction, high-resolution monochromatic x-ray diffraction, and finite element simulations have been used to determine the distribution of strain, defects, and crystallographic tilt in uncoalesced GaN layers grown by maskless pendeo-epitaxy. An important materials parameter was the width-to-height ratio of the etched columns of GaN from which occurred the lateral growth of the wings. Tilt boundaries formed at the column/wing interface for samples with a large ratio. Formation of the tilt boundary can be avoided by using smaller ratios. The strain and tilt across the stripe increased with the width-to-height ratio. The wings were tilted upward at room temperature.

  13. Substrate temperature influence on the properties of GaN thin films grown by hollow-cathode plasma-assisted atomic layer deposition

    SciTech Connect

    Alevli, Mustafa Gungor, Neşe; Haider, Ali; Kizir, Seda; Leghari, Shahid A.; Biyikli, Necmi

    2016-01-15

    Gallium nitride films were grown by hollow cathode plasma-assisted atomic layer deposition using triethylgallium and N{sub 2}/H{sub 2} plasma. An optimized recipe for GaN film was developed, and the effect of substrate temperature was studied in both self-limiting growth window and thermal decomposition-limited growth region. With increased substrate temperature, film crystallinity improved, and the optical band edge decreased from 3.60 to 3.52 eV. The refractive index and reflectivity in Reststrahlen band increased with the substrate temperature. Compressive strain is observed for both samples, and the surface roughness is observed to increase with the substrate temperature. Despite these temperature dependent material properties, the chemical composition, E{sub 1}(TO), phonon position, and crystalline phases present in the GaN film were relatively independent from growth temperature.

  14. Dislocation blocking by AlGaN hot electron injecting layer in the epitaxial growth of GaN terahertz Gunn diode

    NASA Astrophysics Data System (ADS)

    Li, Liang; Yang, Lin'an; Zhang, Jincheng; Hao, Yue

    2013-09-01

    This paper reports an efficient method to improve the crystal quality of GaN Gunn diode with AlGaN hot electron injecting layer (HEI). An evident reduction of screw dislocation and edge dislocation densities is achieved by the strain management and the enhanced lateral growth in high temperature grown AlGaN HEI layer. Compared with the top hot electron injecting layer (THEI) structure, the bottom hot electron injecting layer (BHEI) structure enhances the crystal quality of transit region due to the growth sequence modulation of HEI layer. A high Hall mobility of 2934 cm2/Vs at 77 K, a nearly flat downtrend of Hall mobility at the temperature ranging from 300 to 573 K, a low intensity of ratio of yellow luminescence band to band edge emission, a narrow band edge emission line-width, and a smooth surface morphology are observed for the BHEI structural epitaxy of Gunn diode, which indicates that AlGaN BHEI structure is a promising candidate for fabrication of GaN Gunn diodes in terahertz regime.

  15. Effects of trimethylaluminium and tetrakis(ethylmethylamino) hafnium in the early stages of the atomic-layer-deposition of aluminum oxide and hafnium oxide on hydroxylated GaN nanoclusters.

    PubMed

    León-Plata, Paola A; Coan, Mary R; Seminario, Jorge M

    2013-10-01

    We calculate the interactions of two atomic layer deposition (ALD) reactants, trimethylaluminium (TMA) and tetrakis(ethylmethylamino) hafnium (TEMAH) with the hydroxylated Ga-face of GaN clusters when aluminum oxide and hafnium oxide, respectively, are being deposited. The GaN clusters are suitable as testbeds for the actual Ga-face on practical GaN nanocrystals of importance not only in electronics but for several other applications in nanotechnology. We find that TMA spontaneously interacts with hydroxylated GaN; however it does not follow the atomic layer deposition reaction path unless there is an excess in potential energy introduced in the clusters at the beginning of the optimization, for instance, using larger bond lengths of various bonds in the initial structures. TEMAH also does not interact with hydroxylated GaN, unless there is an excess in potential energy. The formation of a Ga-N(CH3)(CH2CH3) bond during the ALD of HfO2 using TEMAH as the reactant without breaking the Hf-N bond could be the key part of the mechanism behind the formation of an interface layer at the HfO2/GaN interface.

  16. Ionic liquid gating on atomic layer deposition passivated GaN: Ultra-high electron density induced high drain current and low contact resistance

    SciTech Connect

    Zhou, Hong; Du, Yuchen; Ye, Peide D.

    2016-05-16

    Herein, we report on achieving ultra-high electron density (exceeding 10{sup 14 }cm{sup −2}) in a GaN bulk material device by ionic liquid gating, through the application of atomic layer deposition (ALD) of Al{sub 2}O{sub 3} to passivate the GaN surface. Output characteristics demonstrate a maximum drain current of 1.47 A/mm, the highest reported among all bulk GaN field-effect transistors, with an on/off ratio of 10{sup 5} at room temperature. An ultra-high electron density exceeding 10{sup 14 }cm{sup −2} accumulated at the surface is confirmed via Hall-effect measurement and transfer length measurement. In addition to the ultra-high electron density, we also observe a reduction of the contact resistance due to the narrowing of the Schottky barrier width on the contacts. Taking advantage of the ALD surface passivation and ionic liquid gating technique, this work provides a route to study the field-effect and carrier transport properties of conventional semiconductors in unprecedented ultra-high charge density regions.

  17. Ionic liquid gating on atomic layer deposition passivated GaN: Ultra-high electron density induced high drain current and low contact resistance

    NASA Astrophysics Data System (ADS)

    Zhou, Hong; Du, Yuchen; Ye, Peide D.

    2016-05-01

    Herein, we report on achieving ultra-high electron density (exceeding 1014 cm-2) in a GaN bulk material device by ionic liquid gating, through the application of atomic layer deposition (ALD) of Al2O3 to passivate the GaN surface. Output characteristics demonstrate a maximum drain current of 1.47 A/mm, the highest reported among all bulk GaN field-effect transistors, with an on/off ratio of 105 at room temperature. An ultra-high electron density exceeding 1014 cm-2 accumulated at the surface is confirmed via Hall-effect measurement and transfer length measurement. In addition to the ultra-high electron density, we also observe a reduction of the contact resistance due to the narrowing of the Schottky barrier width on the contacts. Taking advantage of the ALD surface passivation and ionic liquid gating technique, this work provides a route to study the field-effect and carrier transport properties of conventional semiconductors in unprecedented ultra-high charge density regions.

  18. Highly ordered catalyst-free and mask-free GaN nanorods on r-plane sapphire.

    PubMed

    Aschenbrenner, T; Kruse, C; Kunert, G; Figge, S; Sebald, K; Kalden, J; Voss, T; Gutowski, J; Hommel, D

    2009-02-18

    Self-organized and highly ordered GaN nanorods were grown without catalyst on r-plane sapphire using a combination of molecular beam epitaxy and metal-organic vapor-phase epitaxy. AlN nucleation centers for the nanorods were prepared by nitridation of the sapphire in a metal-organic vapor-phase epitaxy reactor, while the nanorods were grown by molecular beam epitaxy. A coalesced two-dimensional GaN layer was observed between the nanorods. The nanorods are inclined by 62 degrees towards the [Formula: see text]-directions of the a-plane GaN layer. The high degree of ordering and the structural perfection were confirmed by micro-photoluminescence measurements.

  19. Improved interface properties of GaN metal-oxide-semiconductor device with non-polar plane and AlN passivation layer

    NASA Astrophysics Data System (ADS)

    Wu, Xian; Liang, Renrong; Guo, Lei; Liu, Lei; Xiao, Lei; Shen, Shanshan; Xu, Jun; Wang, Jing

    2016-12-01

    Utilizing a non-polar plane substrate and an ultra-thin AlN passivation layer results in significantly improved interface properties of a GaN metal-oxide-semiconductor (MOS) device. After depositing an Al2O3 gate dielectric layer on GaN substrates with polar c-plane and non-polar m-plane surfaces, it is found that the devices on the non-polar surface show much better interface properties than those on the polar surface. To further improve the interface properties, an amorphous ultra-thin AlN layer is deposited on the substrate before the Al2O3 deposition. The interface properties of both devices on the c-plane and m-plane are dramatically improved by the AlN passivation layer. The interface trap density of the Al/Al2O3/AlN/GaN MOS capacitor on the non-polar surface is reduced by two orders of magnitude compared to that on the polar surface.

  20. Proximity Effects of Beryllium-Doped GaN Buffer Layers on the Electronic Properties of Epitaxial AlGaN/GaN Heterostructures

    DTIC Science & Technology

    2010-05-17

    rf - plasma assisted MBE - grown homoepitaxial GaN has shown that oxygen, a shallow donor in GaN , is present at...properties of Al- GaN / GaN HEMTs grown by rf - MBE on native GaN substrates . 2. Experimental Seven AlGaN/ GaN heterostructures were grown by rf - plasma assisted... GaN /Be:GaN heterostructures have been grown by rf - plasma molecular beam epitaxy on free- standing semi-insulating

  1. Self-organization of dislocation-free, high-density, vertically aligned GaN nanocolumns involving InGaN quantum wells on graphene/SiO2 covered with a thin AlN buffer layer.

    PubMed

    Hayashi, Hiroaki; Konno, Yuta; Kishino, Katsumi

    2016-02-05

    We demonstrated the self-organization of high-density GaN nanocolumns on multilayer graphene (MLG)/SiO2 covered with a thin AlN buffer layer by RF-plasma-assisted molecular beam epitaxy. MLG/SiO2 substrates were prepared by the transfer of CVD graphene onto thermally oxidized SiO2/Si [100] substrates. Employing the MLG with an AlN buffer layer enabled the self-organization of high-density and vertically aligned nanocolumns. Transmission electron microscopy observation revealed that no threading dislocations, stacking faults, or twinning defects were included in the self-organized nanocolumns. The photoluminescence (PL) peak intensities of the self-organized GaN nanocolumns were 2.0-2.6 times higher than those of a GaN substrate grown by hydride vapor phase epitaxy. Moreover, no yellow luminescence or ZB-phase GaN emission was observed from the nanocolumns. An InGaN/GaN MQW and p-type GaN were integrated into GaN nanocolumns grown on MLG, displaying a single-peak PL emission at a wavelength of 533 nm. Thus, high-density nitride p-i-n nanocolumns were fabricated on SiO2/Si using the transferred MLG interlayer, indicating the possibility of developing visible nanocolumn LEDs on graphene/SiO2.

  2. GaN metal-semiconductor-metal UV sensor with multi-layer graphene as Schottky electrodes

    NASA Astrophysics Data System (ADS)

    Lee, Chang-Ju; Kang, Sang-Bum; Cha, Hyeon-Gu; Won, Chul-Ho; Hong, Seul-Ki; Cho, Byung-Jin; Park, Hongsik; Lee, Jung-Hee; Hahm, Sung-Ho

    2015-06-01

    We fabricated a GaN-based metal-semiconductor-metal (MSM)-type UV sensor using a multilayer graphene as transparent Schottky electrodes. The fabricated GaN MSM UV sensor showed a high photo-to-dark current contrast ratio of 3.9 × 105 and a UV-to-visible rejection ratio of 1.8 × 103 at 7 V. The as-fabricated GaN MSM UV sensor with graphene electrodes has a low bias dependence of maximum photoresponsivity and a noise-like response at a visible wavelength in the 500 nm region. These problems were successfully solved by treatment with a buffered oxide etcher (BOE), and the photoresponse characteristics of the fabricated GaN MSM UV sensor after the treatment were better than those before the treatment.

  3. GaN barrier layer dependence of critical thickness in GaInN/GaN superlattice on GaN characterized by in situ X-ray diffraction

    NASA Astrophysics Data System (ADS)

    Osumi, Junya; Ishihara, Koji; Yamamoto, Taiji; Iwaya, Motoaki; Takeuchi, Tetsuya; Kamiyama, Satoshi; Akasaki, Isamu

    2016-05-01

    We investigated the critical thickness dependence on the GaN barrier layer thickness in a GaInN/GaN superlattice (SL). The characterization was done by combining an in situ X-ray diffraction (XRD) system attached to a metalorganic vapor phase epitaxy rector and ex situ analyses such as scanning electron microscopy and transmission electron microscopy. The critical thickness required for the introduction of a + c-type misfit dislocations (MDs) in the GaInN/GaN SL was determined by analyzing the full width at half maximum of the in situ XRD spectrum from a GaInN/GaN SL as a function of SL periods, and we successfully found the critical thicknesses of specific different SLs.

  4. Pulsed laser deposition of ITO/AZO transparent contact layers for GaN LED applications.

    PubMed

    Ou, Sin Liang; Wuu, Dong Sing; Liu, Shu Ping; Fu, Yu Chuan; Huang, Shih Cheng; Horng, Ray Hua

    2011-08-15

    In this study, indium-tin oxide (ITO)/Al-doped zinc oxide (AZO) composite films were fabricated by pulsed laser deposition and used as transparent contact layers (TCLs) in GaN-based blue light emitting diodes (LEDs). The ITO/AZO TCLs were composed of the thin ITO (50 nm) films and AZO films with various thicknesses from 200 to 1000 nm. Conventional LED with ITO (200 nm) TCL prepared by E-beam evaporation was fabricated and characterized for comparison. From the transmittance spectra, the ITO/AZO films exhibited high transparency above 90% at wavelength of 465 nm. The sheet resistance of ITO/AZO TCL decreased as the AZO thickness increased, which could be attributed to the increase in a carrier concentration, leading to a decrease in the forward bias of LED. The LEDs with ITO/AZO composite TCLs showed better light extraction as compared to LED with ITO TCL in compliance with simulation. When an injection current of 20 mA was applied, the output power for LEDs fabricated with ITO/AZO TCLs had 45%, 63%, and 71% enhancement as compared with those fabricated using ITO (200 nm) TCL for the AZO thicknesses of 200, 460, and 1000 nm, respectively.

  5. CONDENSED MATTER: STRUCTURE, THERMAL AND MECHANICAL PROPERTIES: Influence of dislocations in the GaN layer on the electrical properties of an AlGaN/GaN heterostructure

    NASA Astrophysics Data System (ADS)

    Gao, Zhi-Yuan; Hao, Yue; Zhang, Jin-Cheng; Li, Pei-Xian; Gu, Wen-Ping

    2009-11-01

    This paper reports on a comparative study of the spatial distributions of the electrical, optical, and structural properties in an AlGaN/GaN heterostructure. Edge dislocation density in the GaN template layer is shown to decrease in the regions of the wafer where the heterostructure sheet resistance increases and the GaN photoluminescence band-edge energy peak shifts to a high wavelength. This phenomenon is found to be attributed to the local compressive strain surrounding edge dislocation, which will generate a local piezoelectric polarization field in the GaN layer in the opposite direction to the piezoelectric polarization field in the AlGaN layer and thus help to increase the two-dimensional electron gas concentration.

  6. Anodic etching of GaN based film with a strong phase-separated InGaN/GaN layer: Mechanism and properties

    NASA Astrophysics Data System (ADS)

    Gao, Qingxue; Liu, Rong; Xiao, Hongdi; Cao, Dezhong; Liu, Jianqiang; Ma, Jin

    2016-11-01

    A strong phase-separated InGaN/GaN layer, which consists of multiple quantum wells (MQW) and superlattices (SL) layers and can produce a blue wavelength spectrum, has been grown on n-GaN thin film, and then fabricated into nanoporous structures by electrochemical etching method in oxalic acid. Scanning electron microscopy (SEM) technique reveals that the etching voltage of 8 V leads to a vertically aligned nanoporous structure, whereas the films etched at 15 V show branching pores within the n-GaN layer. Due to the low doping concentration of barriers (GaN layers) in the InGaN/GaN layer, we observed a record-low rate of etching (<100 nm/min) and nanopores which are mainly originated from the V-pits in the phase-separated layer. In addition, there exists a horizontal nanoporous structure at the interface between the phase-separated layer and the n-GaN layer, presumably resulting from the high transition of electrons between the barrier and the well (InGaN layer) at the interface. As compared to the as-grown MQW structure, the etched MQW structure exhibits a photoluminescence (PL) enhancement with a partial relaxation of compressive stress due to the increased light-extracting surface area and light-guiding effect. Such a compressive stress relaxation can be further confirmed by Raman spectra.

  7. Observation of reaction between a-type dislocations in GaN layer grown on 4-in. Si(111) substrate with AlGaN/AlN strained layer superlattice after dislocation propagation

    NASA Astrophysics Data System (ADS)

    Sugawara, Yoshihiro; Ishikawa, Yukari; Watanabe, Arata; Miyoshi, Makoto; Egawa, Takashi

    2017-06-01

    Dislocation reaction in a GaN layer grown on 4-in. Si(111) with AlGaN/AlN strained layer superlattice was observed by transmission electron microscopy. The reaction between a dislocation (b=1/3[ 1 2 bar 10 ]) and another dislocation (b =1/3[ 11 2 bar 0 ]) to form a dislocation segment (b =1/3[ 2 1 bar 1 bar 0 ]) was demonstrated by plan-view observation using weak-beam dark-field and large-angle convergent-beam electron diffraction methods. Observed reaction occurred with dislocation motion after dislocation propagation with epitaxial growth.

  8. Trap states in enhancement-mode double heterostructures AlGaN/GaN high electron mobility transistors with different GaN channel layer thicknesses

    SciTech Connect

    He, Yunlong; Wang, Chong Li, Xiangdong; Zhao, Shenglei; Mi, Minhan; Pei, Jiuqing; Zhang, Jincheng; Hao, Yue; Li, Peixian; Ma, Xiaohua

    2015-08-10

    This is the report on trap states in enhancement-mode AlGaN/GaN/AlGaN double heterostructures high electron mobility transistors by fluorine plasma treatment with different GaN channel layer thicknesses. Compared with the thick GaN channel layer sample, the thin one has smaller 2DEG concentration, lower electron mobility, lower saturation current, and lower peak transconductance, but it has a higher threshold voltage of 1.2 V. Deep level transient spectroscopy measurements are used to obtain the accurate capture cross section of trap states. By frequency dependent capacitance and conductance measurements, the trap state density of (1.98–2.56) × 10{sup 12 }cm{sup −2} eV{sup −1} is located at E{sub T} in a range of (0.37–0.44) eV in the thin sample, while the trap state density of (2.3–2.92) × 10{sup 12 }cm{sup −2} eV{sup −1} is located at E{sub T} in a range of (0.33–0.38) eV in the thick one. It indicates that the trap states in the thin sample are deeper than those in the thick one.

  9. Compositionally graded InGaN layers grown on vicinal N-face GaN substrates by plasma-assisted molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Hestroffer, Karine; Lund, Cory; Koksaldi, Onur; Li, Haoran; Schmidt, Gordon; Trippel, Max; Veit, Peter; Bertram, Frank; Lu, Ning; Wang, Qingxiao; Christen, Jürgen; Kim, Moon J.; Mishra, Umesh K.; Keller, Stacia

    2017-05-01

    This work reports on compositionally graded (0 0 0 1 bar) N-polar InxGa1-xN layers. The InGaN grades with different final In compositions xf up to 0.25 were grown by plasma-assisted molecular beam epitaxy on vicinal GaN base layers with a miscut angle of 4° towards the m-direction. When increasing xf the surface morphology evolved from an interlacing finger structure, attributed to the Ehrlich-Schwöbel effect, towards fully strain-relaxed columnar features. Regardless of the crystal morphology and the strain state each graded sample exhibited a bright photoluminescence signal at room temperature spanning the whole visible range. Cross-sectional nanoscale cathodoluminescence evidenced a red-shift of the luminesced signal from 420 to 580 nm along the grade and also showed strong lateral emission inhomogeneities.

  10. Growth kinetics and structural perfection of (InN)1/(GaN)1-20 short-period superlattices on +c-GaN template in dynamic atomic layer epitaxy

    NASA Astrophysics Data System (ADS)

    Kusakabe, Kazuhide; Hashimoto, Naoki; Itoi, Takaomi; Wang, Ke; Imai, Daichi; Yoshikawa, Akihiko

    2016-04-01

    The growth kinetics and structural perfection of (InN)1/(GaN)1-20 short-period superlattices (SPSs) were investigated with their application to ordered alloys in mind. The SPSs were grown on +c-GaN template at 650 °C by dynamic atomic layer epitaxy in conventional plasma-assisted molecular beam epitaxy. It was found that coherent structured InN/GaN SPSs could be fabricated when the thickness of the GaN barrier was 4 ML or above. Below 3 ML, the formation of SPSs was quite difficult owing to the increased strain in the SPS structure caused by the use of GaN as a template. The effective or average In composition of the (InN)1/(GaN)4 SPSs was around 10%, and the corresponding InN coverage in the ˜1 ML-thick InN wells was 50%. It was found that the effective InN coverage in ˜1 ML-thick InN wells could be varied with the growth conditions. In fact, the effective In composition could be increased up to 13.5%, i.e., the corresponding effective InN coverage was about 68%, by improving the capping/freezing speed by increasing the growth rate of the GaN barrier layer.

  11. Effects of concentration and thermal annealing on the optical activation of Er implanted into GaN layers

    NASA Astrophysics Data System (ADS)

    Sathish, N.; Pathak, A. P.; Devaraju, G.; Trave, E.; Mazzoldi, P.; Dhamodaran, S.; Kulkarni, V. N.

    2012-07-01

    The wide band gap semiconductor, GaN, has emerged as an important host for rare earth-electroluminescence. The annealing behaviour and lattice site location of Er implanted into GaN were studied with the Rutherford Backscattering Spectrometry (RBS)/channelling and photoluminescence (PL) techniques. Also Er site dependence on the annealing temperature and implantation dose has been studied in detail. The optical properties of the Er-doped GaN system, evidencing their dependence on the parameters adopted during the synthesis procedure (Er implantation dose, annealing temperature) have been discussed. RBS/channelling measurements suggested that mostly Er occupy substitutional site and depends on the Er concentration. The main result is the activation of a typical Er giving rise to PL emission in the 1450-1650 nm range, related to radiative 4 I 13/2→4 I 15/2 transitions. Depending on the Er dose, we observe a specific behaviour linked to variation of the annealing temperature that strongly determines PL emission band. We observed a PL spectral shape with the main peak located at 1542 nm and shoulder peak at 1558 nm (and full width at half maximum (FWHM) of 33 nm) with a series of weaker PL structures at 1519, 1572 and 1591 nm, due to the Stark sub-level splitting.

  12. Dynamic atomic layer epitaxy of InN on/in +c-GaN matrix: Effect of “In+N” coverage and capping timing by GaN layer on effective InN thickness

    SciTech Connect

    Yoshikawa, Akihiko; Kusakabe, Kazuhide; Hashimoto, Naoki; Hwang, Eun-Sook; Itoi, Takaomi

    2016-01-11

    The growth front in the self-organizing and self-limiting epitaxy of ∼1 monolayer (ML)-thick InN wells on/in +c-GaN matrix by molecular beam epitaxy (MBE) has been studied in detail, with special attention given to the behavior and role of the N atoms. The growth temperatures of interest are above 600 °C, far higher than the typical upper critical temperature of 500 °C in MBE. It was confirmed that 2 ML-thick InN wells can be frozen/inserted in GaN matrix at 620 °C, but it was found that N atoms at the growth front tend to selectively re-evaporate more quickly than In atoms at temperatures higher than 650 °C. As a result, the effective thickness of inserted InN wells in the GaN matrix at 660–670 °C were basically 1 ML or sub-ML, even though they were capped by a GaN barrier at the time of 2 ML “In+N” coverage. Furthermore, it was found that the N atoms located below In atoms in the dynamic atomic layer epitaxy growth front had remarkably weaker bonding to the +c-GaN surface.

  13. Large-roll growth of 25-inch hexagonal BN monolayer film for self-release buffer layer of free-standing GaN wafer

    NASA Astrophysics Data System (ADS)

    Wu, Chenping; Soomro, Abdul Majid; Sun, Feipeng; Wang, Huachun; Huang, Youyang; Wu, Jiejun; Liu, Chuan; Yang, Xiaodong; Gao, Na; Chen, Xiaohong; Kang, Junyong; Cai, Duanjun

    2016-10-01

    Hexagonal boron nitride (h-BN) is known as promising 2D material with a wide band-gap (~6 eV). However, the growth size of h-BN film is strongly limited by the size of reaction chamber. Here, we demonstrate the large-roll synthesis of monolayer and controllable sub-monolayer h-BN film on wound Cu foil by low pressure chemical vapor deposition (LPCVD) method. By winding the Cu foil substrate into mainspring shape supported by a multi-prong quartz fork, the reactor size limit could be overcome by extending the substrate area to a continuous 2D curl of plane inward. An extremely large-size monolayer h-BN film has been achieved over 25 inches in a 1.2” tube. The optical band gap of h-BN monolayer was determined to be 6.0 eV. The h-BN film was uniformly transferred onto 2” GaN or 4” Si wafer surfaces as a release buffer layer. By HVPE method, overgrowth of thick GaN wafer over 200 μm has been achieved free of residual strain, which could provide high quality homo-epitaxial substrate.

  14. ZnO nanorods/graphene/Ni/Au hybrid structures as transparent conductive layer in GaN LED for low work voltage and high light extraction

    NASA Astrophysics Data System (ADS)

    Xu, Kun; Xie, Yiyang; Ma, Huali; Du, Yinxiao; Zeng, Fanguang; Ding, Pei; Gao, Zhiyuan; Xu, Chen; Sun, Jie

    2016-12-01

    In this paper, by virtue of one-dimensional ZnO nanorods and two-dimensional graphene film hybrid structures, both the enhanced current spreading and enhanced light extraction were realized at the same time. A 1 nm/1 nm Ni/Au layer was used as an interlayer between graphene and pGaN to form ohmic contact, which makes the device have a good forward conduction properties. Through the comparison of the two groups of making ZnO nanorods or not, it was found that the 30% light extraction efficiency of the device was improved by using the ZnO nanorods. By analysis key parameters of two groups such as the turn-on voltage, work voltage and reverse leakage current, it was proved that the method for preparing surface nano structure by hydrothermal method self-organization growth ZnO nanorods applied in GaN LEDs has no influence to device's electrical properties. The hybrid structure application in GaN LED, make an achievement of a good ohmic contact, no use of ITO and enhancement of light extraction at the same time, meanwhile it does not change the device structure, introduce additional process, worsen the electrical properties.

  15. Large-roll growth of 25-inch hexagonal BN monolayer film for self-release buffer layer of free-standing GaN wafer.

    PubMed

    Wu, Chenping; Soomro, Abdul Majid; Sun, Feipeng; Wang, Huachun; Huang, Youyang; Wu, Jiejun; Liu, Chuan; Yang, Xiaodong; Gao, Na; Chen, Xiaohong; Kang, Junyong; Cai, Duanjun

    2016-10-19

    Hexagonal boron nitride (h-BN) is known as promising 2D material with a wide band-gap (~6 eV). However, the growth size of h-BN film is strongly limited by the size of reaction chamber. Here, we demonstrate the large-roll synthesis of monolayer and controllable sub-monolayer h-BN film on wound Cu foil by low pressure chemical vapor deposition (LPCVD) method. By winding the Cu foil substrate into mainspring shape supported by a multi-prong quartz fork, the reactor size limit could be overcome by extending the substrate area to a continuous 2D curl of plane inward. An extremely large-size monolayer h-BN film has been achieved over 25 inches in a 1.2" tube. The optical band gap of h-BN monolayer was determined to be 6.0 eV. The h-BN film was uniformly transferred onto 2" GaN or 4" Si wafer surfaces as a release buffer layer. By HVPE method, overgrowth of thick GaN wafer over 200 μm has been achieved free of residual strain, which could provide high quality homo-epitaxial substrate.

  16. Large-roll growth of 25-inch hexagonal BN monolayer film for self-release buffer layer of free-standing GaN wafer

    PubMed Central

    Wu, Chenping; Soomro, Abdul Majid; Sun, Feipeng; Wang, Huachun; Huang, Youyang; Wu, Jiejun; Liu, Chuan; Yang, Xiaodong; Gao, Na; Chen, Xiaohong; Kang, Junyong; Cai, Duanjun

    2016-01-01

    Hexagonal boron nitride (h-BN) is known as promising 2D material with a wide band-gap (~6 eV). However, the growth size of h-BN film is strongly limited by the size of reaction chamber. Here, we demonstrate the large-roll synthesis of monolayer and controllable sub-monolayer h-BN film on wound Cu foil by low pressure chemical vapor deposition (LPCVD) method. By winding the Cu foil substrate into mainspring shape supported by a multi-prong quartz fork, the reactor size limit could be overcome by extending the substrate area to a continuous 2D curl of plane inward. An extremely large-size monolayer h-BN film has been achieved over 25 inches in a 1.2” tube. The optical band gap of h-BN monolayer was determined to be 6.0 eV. The h-BN film was uniformly transferred onto 2” GaN or 4” Si wafer surfaces as a release buffer layer. By HVPE method, overgrowth of thick GaN wafer over 200 μm has been achieved free of residual strain, which could provide high quality homo-epitaxial substrate. PMID:27756906

  17. Effect of V/III ratio on the surface morphology and electrical properties of m-plane (10 1 bar 0) GaN homoepitaxial layers

    NASA Astrophysics Data System (ADS)

    Barry, Ousmane I.; Tanaka, Atsushi; Nagamatsu, Kentaro; Bae, Si-Young; Lekhal, Kaddour; Matsushita, Junya; Deki, Manato; Nitta, Shugo; Honda, Yoshio; Amano, Hiroshi

    2017-06-01

    We have investigated the effect of V/III ratio on the surface morphology, impurity concentration and electrical properties of m-plane (10 1 bar 0) Gallium Nitride (GaN) homoepitaxial layers. Four-sided pyramidal hillocks are observed on the nominally on-axis m-plane GaN films. Hillocks sizes relatively increase by increasing the V/III ratio. All facets of pyramidal hillocks exhibit well-defined step-terrace features. Secondary ion mass spectrometry depth profiles reveal that carbon impurities decrease by increasing the V/III ratio while the lowest oxygen content is found at an optimized V/III ratio of 900. Vertical Schottky barrier diodes fabricated on the m-GaN samples were characterized. Low leakage current densities of the order of 10-10 A/cm2 at -5 V are obtained at the optimum V/III ratio. Oxygen impurities and screw-component dislocations around hillocks are found to have more detrimental impact on the leakage current mechanism.

  18. A Microstructural Comparison of the Initial Growth of AIN and GaN Layers on Basal Plane Sapphire and SiC Substrates by Low Pressure Metalorganic Chemical Vapor Depositon

    NASA Technical Reports Server (NTRS)

    George, T.; Pike, W. T.; Khan, M. A.; Kuznia, J. N.; Chang-Chien, P.

    1994-01-01

    The initial growth by low pressure metalorganic chemical vapor deposition and subsequent thermal annealing of AIN and GaN epitaxial layers on SiC and sapphire substrates is examined using high resolution transmission electron microscopy and atomic force microscopy.

  19. A Microstructural Comparison of the Initial Growth of AIN and GaN Layers on Basal Plane Sapphire and SiC Substrates by Low Pressure Metalorganic Chemical Vapor Depositon

    NASA Technical Reports Server (NTRS)

    George, T.; Pike, W. T.; Khan, M. A.; Kuznia, J. N.; Chang-Chien, P.

    1994-01-01

    The initial growth by low pressure metalorganic chemical vapor deposition and subsequent thermal annealing of AIN and GaN epitaxial layers on SiC and sapphire substrates is examined using high resolution transmission electron microscopy and atomic force microscopy.

  20. Photoluminescence studies of band-edge transitions in GaN epitaxial layers grown by plasma-assisted molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Chen, G. D.; Smith, M.; Lin, J. Y.; Jiang, H. X.; Salvador, A.; Sverdlov, B. N.; Botchkarv, A.; Morkoc, H.

    1996-03-01

    Continuous-wave and time-resolved photoluminescence spectroscopies have been employed to study the band-edge transitions in GaN epitaxial layers grown by plasma assisted molecular beam epitaxy. In addition to the neutral-donor-bound exciton transition (the I2 line), a transition line at about 83 meV below the band gap has been observed in an epitaxial layer grown under a lower plasma power or growth rate. This emission line has been assigned to the band-to-impurity transition resulting from the recombination between electrons bound to shallow donors and free holes D0, h+). Systematic studies of these optical transitions have been carried out under different temperatures and excitation intensities. The temperature variation of the spectral peak position of the D0, h+) emission line differs from the band gap variation with temperature, but is consistent with an existing theory for D0, h+) transitions. The dynamic processes of the D0, h+) transition have also been investigated and subnanosecond recombination lifetimes have been observed. The emission energy and the temperature dependencies of the recombination lifetime have been measured. These results have provided solid evidence for the assignment of the D0, h+) transition and show that the motions of the free holes which participated in this transition are more or less restricted in the plane of the epitaxial layer at temperatures below 140 K and that the thermal quenching of the emission intensity of this transition is due to the dissociation of neutral donors. Our results show that time-resolved photoluminescence spectroscopy can be of immense value in understanding the optical recombination dynamics in GaN.

  1. High-quality III-nitride films on conductive, transparent (2̅01)-oriented β-Ga2O3 using a GaN buffer layer.

    PubMed

    Muhammed, M M; Roldan, M A; Yamashita, Y; Sahonta, S-L; Ajia, I A; Iizuka, K; Kuramata, A; Humphreys, C J; Roqan, I S

    2016-07-14

    We demonstrate the high structural and optical properties of InxGa1-xN epilayers (0 ≤ x ≤ 23) grown on conductive and transparent (01)-oriented β-Ga2O3 substrates using a low-temperature GaN buffer layer rather than AlN buffer layer, which enhances the quality and stability of the crystals compared to those grown on (100)-oriented β-Ga2O3. Raman maps show that the 2″ wafer is relaxed and uniform. Transmission electron microscopy (TEM) reveals that the dislocation density reduces considerably (~4.8 × 10(7) cm(-2)) at the grain centers. High-resolution TEM analysis demonstrates that most dislocations emerge at an angle with respect to the c-axis, whereas dislocations of the opposite phase form a loop and annihilate each other. The dislocation behavior is due to irregular (01) β-Ga2O3 surface at the interface and distorted buffer layer, followed by relaxed GaN epilayer. Photoluminescence results confirm high optical quality and time-resolved spectroscopy shows that the recombination is governed by bound excitons. We find that a low root-mean-square average (≤1.5 nm) of InxGa1-xN epilayers can be achieved with high optical quality of InxGa1-xN epilayers. We reveal that (01)-oriented β-Ga2O3 substrate has a strong potential for use in large-scale high-quality vertical light emitting device design.

  2. High-quality III-nitride films on conductive, transparent (2̅01)-oriented β-Ga2O3 using a GaN buffer layer

    PubMed Central

    Muhammed, M. M.; Roldan, M. A.; Yamashita, Y.; Sahonta, S.-L.; Ajia, I. A.; Iizuka, K.; Kuramata, A.; Humphreys, C. J.; Roqan, I. S.

    2016-01-01

    We demonstrate the high structural and optical properties of InxGa1−xN epilayers (0 ≤ x ≤ 23) grown on conductive and transparent (01)-oriented β-Ga2O3 substrates using a low-temperature GaN buffer layer rather than AlN buffer layer, which enhances the quality and stability of the crystals compared to those grown on (100)-oriented β-Ga2O3. Raman maps show that the 2″ wafer is relaxed and uniform. Transmission electron microscopy (TEM) reveals that the dislocation density reduces considerably (~4.8 × 107 cm−2) at the grain centers. High-resolution TEM analysis demonstrates that most dislocations emerge at an angle with respect to the c-axis, whereas dislocations of the opposite phase form a loop and annihilate each other. The dislocation behavior is due to irregular (01) β-Ga2O3 surface at the interface and distorted buffer layer, followed by relaxed GaN epilayer. Photoluminescence results confirm high optical quality and time-resolved spectroscopy shows that the recombination is governed by bound excitons. We find that a low root-mean-square average (≤1.5 nm) of InxGa1−xN epilayers can be achieved with high optical quality of InxGa1−xN epilayers. We reveal that (01)-oriented β-Ga2O3 substrate has a strong potential for use in large-scale high-quality vertical light emitting device design. PMID:27412372

  3. High-quality III-nitride films on conductive, transparent (2̅01)-oriented β-Ga2O3 using a GaN buffer layer

    NASA Astrophysics Data System (ADS)

    Muhammed, M. M.; Roldan, M. A.; Yamashita, Y.; Sahonta, S.-L.; Ajia, I. A.; Iizuka, K.; Kuramata, A.; Humphreys, C. J.; Roqan, I. S.

    2016-07-01

    We demonstrate the high structural and optical properties of InxGa1‑xN epilayers (0 ≤ x ≤ 23) grown on conductive and transparent (01)-oriented β-Ga2O3 substrates using a low-temperature GaN buffer layer rather than AlN buffer layer, which enhances the quality and stability of the crystals compared to those grown on (100)-oriented β-Ga2O3. Raman maps show that the 2″ wafer is relaxed and uniform. Transmission electron microscopy (TEM) reveals that the dislocation density reduces considerably (~4.8 × 107 cm‑2) at the grain centers. High-resolution TEM analysis demonstrates that most dislocations emerge at an angle with respect to the c-axis, whereas dislocations of the opposite phase form a loop and annihilate each other. The dislocation behavior is due to irregular (01) β-Ga2O3 surface at the interface and distorted buffer layer, followed by relaxed GaN epilayer. Photoluminescence results confirm high optical quality and time-resolved spectroscopy shows that the recombination is governed by bound excitons. We find that a low root-mean-square average (≤1.5 nm) of InxGa1‑xN epilayers can be achieved with high optical quality of InxGa1‑xN epilayers. We reveal that (01)-oriented β-Ga2O3 substrate has a strong potential for use in large-scale high-quality vertical light emitting device design.

  4. GaN High Power Devices

    SciTech Connect

    PEARTON,S.J.; REN,F.; ZHANG,A.P.; DANG,G.; CAO,X.A.; LEE,K.P.; CHO,H.; GILA,B.P.; JOHNSON,J.W.; MONIER,C.; ABERNATHY,C.R.; HAN,JUNG; BACA,ALBERT G.; CHYI,J.-I.; LEE,C.-M.; NEE,T.-E.; CHUO,C.-C.; CHI,G.C.; CHU,S.N.G.

    2000-07-17

    A brief review is given of recent progress in fabrication of high voltage GaN and AlGaN rectifiers, GaN/AlGaN heterojunction bipolar transistors, GaN heterostructure and metal-oxide semiconductor field effect transistors. Improvements in epitaxial layer quality and in fabrication techniques have led to significant advances in device performance.

  5. Growth of thick and high crystalline quality InGaN layers on GaN (0001bar) substrate using tri-halide vapor phase epitaxy

    NASA Astrophysics Data System (ADS)

    Hirasaki, Takahide; Eriksson, Martin; Thieu, Quang Tu; Karlsson, Fredrik; Murakami, Hisashi; Kumagai, Yoshinao; Monemar, Bo; Holtz, Per Olof; Koukitu, Akinori

    2016-12-01

    The growth of thick InGaN layers on free-standing GaN (0001bar) substrates was studied using tri-halide vapor phase epitaxy. It was found that high-indium-content InGaN can be grown under higher InCl3 input partial pressure at higher growth temperature, which allows the fabrication of a high crystalline quality InGaN layer with a smooth surface morphology. Using the growth conditions of high InCl3 input partial pressure and high growth temperature, crack- and droplet-free InGaN layers with a thickness of over 10 μm and with an indium fraction of 0.05 were successfully grown. Although the surface showed many hillocks, the number of hillocks was reduced upon growth of thicker InGaN layers. Photoluminescence measurements confirm that thick InGaN layers could be successfully grown without degradation of the crystalline quality.

  6. Growth of GaN on Sapphire via Low-Temperature Deposited Buffer Layer and Realization of p-Type GaN by Mg Doping Followed by Low-Energy Electron Beam Irradiation

    NASA Astrophysics Data System (ADS)

    Amano, Hiroshi

    2015-12-01

    This is a personal history of one of the Japanese researchers engaged in developing a method for growing GaN on a sapphire substrate, paving the way for the realization of smart television and display systems using blue LEDs. The most important work was done in the mid- to late 80s. The background to the author's work and the process by which the technology enabling the growth of GaN and the realization of p-type GaN was established are reviewed.

  7. Nobel Lecture: Growth of GaN on sapphire via low-temperature deposited buffer layer and realization of p -type GaN by Mg doping followed by low-energy electron beam irradiation*

    NASA Astrophysics Data System (ADS)

    Amano, Hiroshi

    2015-10-01

    This is a personal history of one of the Japanese researchers engaged in developing a method for growing GaN on a sapphire substrate, paving the way for the realization of smart television and display systems using blue LEDs. The most important work was done in the mid to late 1980s. The background to the author's work and the process by which the technology enabling the growth of GaN and the realization of p -type GaN was established are reviewed.

  8. Structural TEM study of nonpolar a-plane gallium nitride grown on(112_0) 4H-SiC by organometallic vapor phase epitaxy

    SciTech Connect

    Zakharov, Dmitri N.; Liliental-Weber, Zuzanna; Wagner, Brian; Reitmeier,Zachary J.; Preble, Edward A.; Davis, Robert F.

    2005-04-05

    Conventional and high resolution electron microscopy havebeen applied for studying lattice defects in nonpolar a-plane GaN grownon a 4H-SiC substrate with an AlN buffer layer. Samples in plan-view andcross-section configurations have been investigated. Basal and prismaticstacking faults together with Frank and Shockley partial dislocationswere found to be the main defects in the GaN layers. High resolutionelectron microscopy in combination with image simulation supported Drum smodel for the prismatic stacking faults. The density of basal stackingfaults was measured to be ~;1.6_106cm-1. The densities of partialdislocations terminating I1 and I2 types of intrinsic basal stackingfaults were ~;4.0_1010cm-2 and ~;0.4_1010cm-2, respectively. The energyof the I2 stacking fault in GaN was estimated to be (40+-4) erg/cm2 basedon the separation of Shockley partial dislocations. To the best of ourknowledge, the theoretically predicted I3 basal stacking fault in GaN wasobserved experimentally for the first time.

  9. Interface control technologies for high-power GaN transistors: Self-stopping etching of p-GaN layers utilizing electrochemical reactions

    NASA Astrophysics Data System (ADS)

    Sato, Taketomo; Kumazaki, Yusuke; Edamoto, Masaaki; Akazawa, Masamichi; Hashizume, Tamotsu

    2016-02-01

    The selective and low-damaged etching of p-type GaN or AlGaN layer is inevitable process for AlGaN/GaN high-power transistors. We have investigated an electrochemical etching of p-GaN layer grown on AlGaN/GaN heterostructures, consisting of an anodic oxidation of p-GaN surface and a subsequent dissolution of the resulting oxide. The p-GaN layer was electrochemically etched by following the pattern of the SiO2 film that acted as an etching mask. Etching depth was linearly controlled by cycle number of triangular waveform at a rate of 25 nm/cycle. The AFM, TEM and μ-AES results showed that the top p-GaN layer was completely removed after 5 cycles applied, and the etching reaction was automatically sopped on the AlGaN surface. I-V and C-V measurements revealed that no significant damages were induced in the AlGaN/GaN heterostructures.

  10. Effects of AlN buffer layer thickness on the crystallinity and surface morphology of 10-µm-thick a-plane AlN films grown on r-plane sapphire substrates

    NASA Astrophysics Data System (ADS)

    Lin, Chia-Hung; Tamaki, Shinya; Yamashita, Yasuhiro; Miyake, Hideto; Hiramatsu, Kazumasa

    2016-08-01

    10-µm-thick a-plane AlN(11\\bar{2}0) films containing a low-temperature AlN (LT-AlN) buffer layer and a high-temperature AlN (HT-AlN) film were prepared on r-plane sapphire (1\\bar{1}02) substrates. The crystallinity of all the samples with different LT-AlN buffer layer thicknesses was improved after thermal annealing and HT-AlN growth, mainly owing to the elimination of domain boundaries and the concurrent suppression of facet formation. The optimum crystallinity of HT-AlN films was obtained with full widths at half maximum of the X-ray rocking curves of 660 arcsec for AlN(11\\bar{2}0)\\parallel [1\\bar{1}00]AlN and 840 arcsec for (0002) using a 200-nm-thick LT-AlN buffer layer.

  11. Deep-defect-induced quenching effects in semi-insulating GaN layers detected by photoelectrical spectroscopic techniques

    NASA Astrophysics Data System (ADS)

    Witte, H.; Krtschil, A.; Lisker, M.; Schrenk, E.; Christen, J.; Krost, A.; Kuhn, B.; Scholz, F.

    2003-06-01

    Quenching effects induced by additional below-bandgap illumination in undoped semi-insulating GaN were investigated using optical admittance spectroscopy (OAS) and photocurrent (PC) spectroscopy as well as optically excited, thermally stimulated currents (TSC). In OAS and PC, a decrease of defect-related signals due to the quenching light was observed. The thermal quenching of the defect band between 2.7 and 3.3 eV shows a good agreement with thermal emissions as measured by TSC, indicating the same defects cause the optical transitions in OAS/PC and the thermal transitions in TSC. The thermal emission in the temperature region between 250 and 300 K, which is responsible for the thermal quenching of the blue band (BB) in OAS, also shows an optical quenching under below-bandgap excitation.

  12. Enhanced performance of a GaN piezoelectric nanogenerator with an embedded nanoporous layer via the suppressed carrier screening effect

    NASA Astrophysics Data System (ADS)

    Kang, Jin-Ho; Jeong, Dae Kyung; Ha, Jun-Seok; Key Lee, June; Ryu, Sang-Wan

    2017-02-01

    Highly efficient nanoporous GaN-based piezoelectric nanogenerators (PNGs) were demonstrated using an electrochemical etching process. The output of the PNGs was enhanced significantly with increasing porosity because Fermi-level pinning depletes free carriers in nanoporous GaN with thin walls, which reduces the internal screening of piezoelectric charges by free carriers. With the average wall thickness below 30 nm, the output of the PNG increased significantly with decreasing wall thickness. It was attributed to the piezoelectric and mechanical size effects, i.e., enhanced piezoelectric polarization by increased piezoelectric coefficient and reduced elastic coefficient in a nano structure. The energy-harvesting capability of a PNG was sufficient for the operation of a microelectronic device when it was combined with a charging capacitor and rectifying circuit.

  13. Effect of Same-Temperature GaN Cap Layer on the InGaN/GaN Multiquantum Well of Green Light-Emitting Diode on Silicon Substrate

    PubMed Central

    Zheng, Changda; Wang, Li; Mo, Chunlan; Fang, Wenqing; Jiang, Fengyi

    2013-01-01

    GaN green LED was grown on Si (111) substrate by MOCVD. To enhance the quality of InGaN/GaN MQWs, same-temperature (ST) GaN protection layers with different thickness of 8 Å, 15 Å, and 30 Å were induced after the InGaN quantum wells (QWs) layer. Results show that a relative thicker cap layer is benefit to get InGaN QWs with higher In percent at fixed well temperature and obtain better QW/QB interface. As the cap thickness increases, the indium distribution becomes homogeneous as verified by fluorescence microscope (FLM). The interface of MQWs turns to be abrupt from XRD analysis. The intensity of photoluminescence (PL) spectrum is increased and the FWHM becomes narrow. PMID:24369453

  14. Effect of same-temperature GaN cap layer on the InGaN/GaN multiquantum well of green light-emitting diode on silicon substrate.

    PubMed

    Zheng, Changda; Wang, Li; Mo, Chunlan; Fang, Wenqing; Jiang, Fengyi

    2013-01-01

    GaN green LED was grown on Si (111) substrate by MOCVD. To enhance the quality of InGaN/GaN MQWs, same-temperature (ST) GaN protection layers with different thickness of 8 Å, 15 Å, and 30 Å were induced after the InGaN quantum wells (QWs) layer. Results show that a relative thicker cap layer is benefit to get InGaN QWs with higher In percent at fixed well temperature and obtain better QW/QB interface. As the cap thickness increases, the indium distribution becomes homogeneous as verified by fluorescence microscope (FLM). The interface of MQWs turns to be abrupt from XRD analysis. The intensity of photoluminescence (PL) spectrum is increased and the FWHM becomes narrow.

  15. Growth of self-standing GaN substrates

    NASA Astrophysics Data System (ADS)

    Lee, Hyun-Jae; Fujii, Katsushi; Goto, Takenari; Kim, Chinkyo; Chang, Jiho; Hong, Soon-Ku; Cho, Meoungwhan; Yao, Takafumi

    2010-03-01

    Large-sized and high-quality free standing GaN are required with the development of GaN-based devices. We have developed new techniques to reduce the price of GaN substrates. In this paper, we introduce a simple fabrication way of freestanding GaN substrate using hydride vapor phase epitaxy (HVPE). An evaporable buffer layer was applied for the fabrication of 2inch freestanding GaN to separate from a sapphire substrate, in other words, a freestanding GaN was fabricated only by HVPE (one-stop process) without any process.

  16. Ultraviolet light-absorbing and emitting diodes consisting of a p-type transparent-semiconducting NiO film deposited on an n-type GaN homoepitaxial layer

    NASA Astrophysics Data System (ADS)

    Nakai, Hiroshi; Sugiyama, Mutsumi; Chichibu, Shigefusa F.

    2017-05-01

    Gallium nitride (GaN) and related (Al,Ga,In)N alloys provide practical benefits in the production of light-emitting diodes (LEDs) and laser diodes operating in ultraviolet (UV) to green wavelength regions. However, obtaining low resistivity p-type AlN or AlGaN of large bandgap energies (Eg) is a critical issue in fabricating UV and deep UV-LEDs. NiO is a promising candidate for useful p-type transparent-semiconducting films because its Eg is 4.0 eV and it can be doped into p-type conductivity of sufficiently low resistivity. By using these technologies, heterogeneous junction diodes consisting of a p-type transparent-semiconducting polycrystalline NiO film on an n-type single crystalline GaN epilayer on a low threading-dislocation density, free-standing GaN substrate were fabricated. The NiO film was deposited by using the conventional RF-sputtering method, and the GaN homoepitaxial layer was grown by metalorganic vapor phase epitaxy. They exhibited a significant photovoltaic effect under UV light and also exhibited an electroluminescence peak at 3.26 eV under forward-biased conditions. From the conduction and valence band (EV) discontinuities, the NiO/GaN heterointerface is assigned to form a staggered-type (TYPE-II) band alignment with the EV of NiO higher by 2.0 eV than that of GaN. A rectifying property that is consistent with the proposed band diagram was observed in the current-voltage characteristics. These results indicate that polycrystalline NiO functions as a hole-extracting and injecting layer of UV optoelectronic devices.

  17. Asymptotic Representation of the Filtration-Wave Field in the Layer of an Inhomogeneous Medium in the Form of a Plane Wave

    NASA Astrophysics Data System (ADS)

    Filippov, A. I.; Akhmetova, O. V.; Koval‧skii, A. A.

    2016-11-01

    The filtration-wave process in the central layer of a three-layer anisotropic medium is described as an equivalent plane wave with a modified asymptotic method accurate in the mean. The initial problem is parametrized and broken down into simpler problems for the coefficients of expansion in an asymptotic parameter. The zero expansion coefficient describes the sought plane wave, whereas the first coefficient ensures refinement of the wave-front geometry. The exact solution of the parametrized problem is obtained on the basis of the Fourier sine transformation. The correctness of the developed method is confirmed by comparing the obtained asymptotic solutions and the coefficients of Maclaurin-series expansion of the exact solution of the parametrized problem in a formal parameter.

  18. Deep levels in a-plane, high Mg-content Mg{sub x}Zn{sub 1-x}O epitaxial layers grown by molecular beam epitaxy

    SciTech Connect

    Guer, Emre; Tabares, G.; Hierro, A.; Chauveau, J. M.

    2012-12-15

    Deep level defects in n-type unintentionally doped a-plane Mg{sub x}Zn{sub 1-x}O, grown by molecular beam epitaxy on r-plane sapphire were fully characterized using deep level optical spectroscopy (DLOS) and related methods. Four compositions of Mg{sub x}Zn{sub 1-x}O were examined with x = 0.31, 0.44, 0.52, and 0.56 together with a control ZnO sample. DLOS measurements revealed the presence of five deep levels in each Mg-containing sample, having energy levels of E{sub c} - 1.4 eV, 2.1 eV, 2.6 V, and E{sub v} + 0.3 eV and 0.6 eV. For all Mg compositions, the activation energies of the first three states were constant with respect to the conduction band edge, whereas the latter two revealed constant activation energies with respect to the valence band edge. In contrast to the ternary materials, only three levels, at E{sub c} - 2.1 eV, E{sub v} + 0.3 eV, and 0.6 eV, were observed for the ZnO control sample in this systematically grown series of samples. Substantially higher concentrations of the deep levels at E{sub v} + 0.3 eV and E{sub c} - 2.1 eV were observed in ZnO compared to the Mg alloyed samples. Moreover, there is a general invariance of trap concentration of the E{sub v} + 0.3 eV and 0.6 eV levels on Mg content, while at least and order of magnitude dependency of the E{sub c} - 1.4 eV and E{sub c} - 2.6 eV levels in Mg alloyed samples.

  19. Bulk GaN Ion Cleaving

    NASA Astrophysics Data System (ADS)

    Moutanabbir, O.; Gösele, U.

    2010-05-01

    Bulk or freestanding GaN is a key material in various devices other than the blue laser diodes. However, the high cost of bulk GaN wafers severely limits the large scale exploitation of these potential technologies. In this paper, we discuss some engineering issues involved in the application of the ion-cut process to split a thin layer from 2-inch freestanding GaN. This process combines the implantation of light ions and wafer bonding and can possibly be used to reduce the cost of the fabrication of GaN-based devices by allowing the transfer of several bulk quality thin layers from the same donor wafer. To achieve this multi-layer transfer several conditions must be fulfilled. Here issues related to bulk GaN surface irregularities and wafer bowing are discussed. We also describe a method to circumvent most of these problems and achieve high quality bonding.

  20. Nanoair-bridged lateral overgrowth of GaN on ordered nanoporous GaN template

    NASA Astrophysics Data System (ADS)

    Wang, Y. D.; Zang, K. Y.; Chua, S. J.; Tripathy, S.; Chen, P.; Fonstad, C. G.

    2005-12-01

    We report the growth of high-quality GaN epilayers on an ordered nanoporous GaN template by metalorganic chemical vapor deposition. The nanopores in GaN template were created by inductively coupled plasma etching using anodic aluminum oxide film as an etch mask. The average pore diameter and interpore distance is about 65 and 110nm, respectively. Subsequent overgrowth of GaN first begins at the GaN crystallite surface between the pores, and then air-bridge-mediated lateral overgrowth leads to the formation of the continuous layer. Microphotoluminescence and micro-Raman measurements show improved optical properties and significant strain relaxation in the overgrown layer when compared to GaN layer of same thickness simultaneously grown on sapphire without any template. Similar to conventional epitaxial lateral overgrown GaN, such overgrown GaN on a nanopatterned surface would also serve as a template for the growth of ultraviolet-visible light-emitting III-nitride devices.

  1. Fabrication of high-crystallinity a-plane AlN films grown on r-plane sapphire substrates by modulating buffer-layer growth temperature and thermal annealing conditions

    NASA Astrophysics Data System (ADS)

    Lin, Chia-Hung; Yamashita, Yasuhiro; Miyake, Hideto; Hiramatsu, Kazumasa

    2017-06-01

    High-crystallinity a-plane AlN(11 2 ̅0) films containing a low-temperature AlN (LT-AlN) buffer layer and a high-temperature AlN (HT-AlN) film were grown on r-plane sapphire(1 1 ̅02) substrates. We investigated the effect of the growth temperature and thermal annealing conditions for the LT-AlN buffer layers on the crystallinity and surface morphology. The surface roughness of the buffer layers became smooth with the decrease in growth temperature to 900 °C, and the crystallinity of the buffer layers was improved by thermal annealing at temperatures over 1600 °C. HT-AlN films were then grown on the annealed LT-AlN buffer layers at 1500 °C. The optimum crystallinity of HT-AlN films without any facet formation at the surfaces was obtained with full width at half maximum values of the X-ray rocking curves for AlN(11 2 ̅0)//[1 1 ̅00]AlN at 770 and (0002) at 640″.

  2. Structural and electrical properties of Pb(Zr ,Ti)O3 grown on (0001) GaN using a double PbTiO3/PbO bridge layer

    NASA Astrophysics Data System (ADS)

    Xiao, Bo; Gu, Xing; Izyumskaya, Natalia; Avrutin, Vitaliy; Xie, Jinqiao; Liu, Huiyong; Morkoç, Hadis

    2007-10-01

    Pb(Zr0.52Ti0.48)O3 films were deposited by rf magnetron sputtering on silicon-doped GaN(0001)/c-sapphire with a PbTiO3/PbO oxide bridge layer grown by molecular beam epitaxy. X-ray diffraction data showed the highly (111)-oriented perovskite phase in lead zirconate titanate (PZT) films with PbTiO3/PbO bridge layers, compared to the pyrochlore phase grown directly on GaN. The in-plane epitaxial relationships were found from x-ray pole figures to be PZT[112¯]‖GaN[11¯00] and PZT[11¯0]‖GaN[112¯0]. The polarization-electric field measurements revealed the ferroelectric behavior with remanent polarization of 30-40μC /cm2 and asymmetric hysteresis loops due to the depletion layer formed in GaN under reverse bias which resulted in a high negative coercive electric field (950kV/cm).

  3. Atomic-scale investigation of structural defects in GaN layer on c-plane sapphire substrate during initial growth stage

    NASA Astrophysics Data System (ADS)

    Matsubara, Tohoru; Sugimoto, Kohei; Okada, Narihito; Tadatomo, Kazuyuki

    2016-04-01

    Structural defects in the initial growth stages of GaN on sapphire, including stacking faults (SFs), threading dislocations (TDs), and mosaic structure containing grain boundaries, are investigated at the atomic scale. Individual grains in the as-deposited low temperature-GaN buffer layer are found to have twists correlated with those of the adjacent grains. These grains have little similarity on the stacking sequences, and the atomic arrangement on each side of the grain boundaries may be rearranged by annealing to achieve higher similarity in the stacking sequence. The TD identified as a-type at the top of the SFs-rich interfacial region is thought to originate from Frank partial dislocations. The Frank partial dislocation produces a distorted wurtzite-type structure. At the intermediate region of the basal-plane stacking fault between Frank and Shockley partial dislocations, the TD relieves the distortion in the wurtzite-type structure. In the TD, the wurtzite structure slips relative to the surrounding wurtzite.

  4. Mushroom structure of GaN template for epitaxial growth of GaN

    NASA Astrophysics Data System (ADS)

    Lee, Sung Bo; Kwon, Tae-Wan; Park, Jungwon; Jin Choi, Won; Sung Park, Hae

    2012-07-01

    In the present study, we show the formation of mushroom morphology produced by a ramp anneal of a low-temperature GaN buffer layer. Structural analysis by transmission electron microscopy indicates that the cap of the mushroom has the stable wurtzitic GaN structure, whereas the stem possesses the metastable zinc-blende structure. With the air gap introduced between the substrate and the cap of the mushroom structure, threading dislocations propagate along its stem. The formation of the mushroom morphology is suggested to result from the nucleation of wurtzitic GaN on the surface of the low-temperature buffer layer during the ramp anneal, followed by mass transport of GaN from the buffer layer, which remains zinc-blende during the anneal, to the surface, because wurtzitic GaN has the lower structure energy than zinc-blende GaN. This study extends limits of the conventional use of the buffer layer, laying the foundation for the development of low-cost recipes for achieving GaN templates with a low density of threading dislocations.

  5. The impact of substrate nitridation temperature and buffer design and synthesis on the polarity of GaN epitaxial films

    NASA Astrophysics Data System (ADS)

    Namkoong, Gon; Alan Doolittle, W.; Brown, April S.; Losurdo, Maria; Giangregorio, Maria M.; Bruno, Giovanni

    2003-05-01

    The polarity of GaN epitaxial layers grown on GaN and AlN buffer layers was investigated and found to be dependent on nitridation temperature over the range of 200-700°C. When low temperature (LT), 500°C, GaN buffer layers are used, GaN epitaxial layers grown on 200°C nitrided sapphire have a higher density of N-polar inversion domains. However, a high density of dislocation pits was observed on GaN epitaxial layers based on AFM morphology when GaN epitaxial layers were grown on LT GaN buffer of 700°C nitrided sapphire substrate. With high temperature (HT), 850°C, AlN buffer layers, the density of N-polar inversion domains in GaN epitaxial layers depends on the thickness of AlN buffer layer. The structural quality of Ga-polar GaN epitaxial layer is dramatically improved when LT GaN and HT AlN buffer layers are combined with an optimized annealing time. The measured full-widths at half-maximum of (0 0 0 2) symmetric and (1 0 .4) asymmetric reflections are 68 and 246 arcsec, respectively, for 1.0 μm GaN epitaxial layers. The results presented here can be implemented to produce low dislocation density, single Ga-polar GaN epitaxial layers.

  6. Experimental study of light output power for vertical GaN-based light-emitting diodes with various textured surface and thickness of GaN layer

    NASA Astrophysics Data System (ADS)

    Kwack, Ho-Sang; Lim, Hyun Soo; Song, Hyun-Don; Jung, Sung-Hoon; Cho, Hyun Kyong; Kwon, Ho-Ki; Oh, Myeong Seok

    2012-06-01

    The light output power (LOP) of vertical-type GaN-based light emitting diodes (LED) with surface roughness (texture) can be changed by texture size, density, and thickness of GaN film or by the combined effects of texture formation and thickness of GaN film. We have investigated these changes experimentally and note that the enhancement of the LOP by a factor of 2.4 can be improved with optimum texturing parameters as compared to that without texturing. In addition, the LOP of GaN-based LEDs under the same texture density increase slightly as thickness of GaN film decreases. Base on these results, we have evidently demonstrated that the enhancement factors of LOP are related to the correlation between texture size (density) and thickness of GaN film.

  7. Growth kinetics of AlN and GaN films grown by molecular beam epitaxy on R-plane sapphire substrates

    SciTech Connect

    Chandrasekaran, R.; Moustakas, T. D.; Ozcan, A. S.; Ludwig, K. F.; Zhou, L.; Smith, David J.

    2010-08-15

    This paper reports the growth by molecular beam epitaxy of AlN and GaN thin films on R-plane sapphire substrates. Contrary to previous findings that GaN grows with its (1120) A-plane parallel to the (1102) R-plane of sapphire, our results indicate that the crystallographic orientation of the III-nitride films is strongly dependent on the kinetic conditions of growth for the GaN or AlN buffer layers. Thus, group III-rich conditions for growth of either GaN or AlN buffers result in nitride films having (1120) planes parallel to the sapphire surface, and basal-plane stacking faults parallel to the growth direction. The growth of these buffers under N-rich conditions instead leads to nitride films with (1126) planes parallel to the sapphire surface, with inclined c-plane stacking faults that often terminate threading dislocations. Moreover, electron microscope observations indicate that slight miscut ({approx}0.5 deg. ) of the R-plane sapphire substrate almost completely suppresses the formation of twinning defects in the (1126) GaN films.

  8. Enhanced performance of InGaN/GaN multiple-quantum-well light-emitting diodes grown on nanoporous GaN layers.

    PubMed

    Lee, Kwang Jae; Kim, Sang-Jo; Kim, Jae-Joon; Hwang, Kyungwook; Kim, Sung-Tae; Park, Seong-Ju

    2014-06-30

    We demonstrate the high efficiency of InGaN/GaN multiple quantum wells (MQWs) light-emitting diode (LED) grown on the electrochemically etched nanoporous (NP) GaN. The photoluminescence (PL) and Raman spectra show that the LEDs with NP GaN have a strong carrier localization effect resulting from the relaxed strain and reduced defect density in MQWs. Also, the finite-difference time-domain (FDTD) simulation shows that the light extraction efficiency (LEE) is increased by light scattering effect by nanopores. The output power of LED with NP GaN is increased up to 123.1% at 20 mA, compared to that of LED without NP GaN. The outstanding performance of LEDs with NP GaN is attributed to the increased internal quantum efficiency (IQE) by the carrier localization in the indium-rich clusters, low defect density in MQWs, and increased LEE owing to the light scattering in NP GaN.

  9. P-type doping of GaN

    SciTech Connect

    Wong, Raechelle Kimberly

    2000-04-01

    After implantation of As, As + Be, and As + Ga into GaN and annealing for short durations at temperatures as high as 1500 C, the GaN films remained highly resistive. It was apparent from c-RBS studies that although implantation damage did not create an amorphous layer in the GaN film, annealing at 1500 C did not provide enough energy to completely recover the radiation damage. Disorder recovered significantly after annealing at temperatures up to 1500 C, but not completely. From SIMS analysis, oxygen contamination in the AIN capping layer causes oxygen diffusion into the GaN film above 1400 C. The sapphire substrate (A1203) also decomposed and oxygen penetrated into the backside of the GaN layer above 1400 C. To prevent donor-like oxygen impurities from the capping layer and the substrate from contaminating the GaN film and compensating acceptors, post-implantation annealing should be done at temperatures below 1500 C. Oxygen in the cap could be reduced by growing the AIN cap on the GaN layer after the GaN growth run or by depositing the AIN layer in a ultra high vacuum (UHV) system post-growth to minimize residual oxygen and water contamination. With longer annealing times at 1400 C or at higher temperatures with a higher quality AIN, the implantation drainage may fully recover.

  10. Effects of thickness ratio of InGaN to GaN in superlattice strain relief layer on the optoelectrical properties of InGaN-based green LEDs grown on Si substrates

    NASA Astrophysics Data System (ADS)

    Qi, Weijing; Zhang, Jianli; Mo, Chunlan; Wang, Xiaolan; Wu, Xiaoming; Quan, Zhijue; Wang, Guangxu; Pan, Shuan; Fang, Fang; Liu, Junlin; Jiang, Fengyi

    2017-08-01

    InGaN-based multiple quantum well (MQW) green light-emitting diodes with a InGaN/GaN superlattice as a strain relief layer (SSRL) were grown on Si(111) substrates by metal organic chemical vapor deposition. The influences of the thickness ratio of InGaN to GaN in SSRL on the optoelectrical properties have been investigated. Electrical measurements show that the sample with a higher thickness ratio has a lower series resistance. This is mainly ascribed to the improvement of carrier vertical transport due to the thinner GaN in SSRL. However, it is found that the leakage current increases with the thickness ratio from 1:1 to 2.5:1, which could be attributed to the larger density of small size V-pits forming at the first few QW pairs. Compared with the smaller thickness ratio, the sample with a higher thickness ratio of InGaN to GaN in SSRL is found to exhibit larger strain relaxation (about 33.7%), but the electroluminescence measurement exhibits inferior emission efficiency. Carrier leakage via the small V-pits and the rougher interface of MQW are believed to be responsible for the reduction of emission efficiency.

  11. Depth distribution of the strain in the GaN layer with low-temperature AlN interlayer on Si(111) substrate studied by Rutherford backscattering/channeling

    NASA Astrophysics Data System (ADS)

    Lu, Y.; Cong, G. W.; Liu, X. L.; Lu, D. C.; Wang, Z. G.; Wu, M. F.

    2004-12-01

    The depth distribution of the strain-related tetragonal distortion eT in the GaN epilayer with low-temperature AlN interlayer (LT-AlN IL) on Si(111) substrate is investigated by Rutherford backscattering and channeling. The samples with the LT-AlN IL of 8 and 16 nm thickness are studied, which are also compared with the sample without the LT-AlN IL. For the sample with 16-nm-thick LT-AlN IL, it is found that there exists a step-down of eT of about 0.1% in the strain distribution. Meanwhile, the angular scan around the normal GaN ⟨0001⟩ axis shows a tilt difference about 0.01° between the two parts of GaN separated by the LT-AlN IL, which means that these two GaN layers are partially decoupled by the AlN interlayer. However, for the sample with 8-nm-thick LT-AlN IL, neither step-down of eT nor the decoupling phenomenon is found. The 0.01° decoupled angle in the sample with 16-nm-thick LT-AlN IL confirms the relaxation of the LT-AlN IL. Thus the step-down of eT should result from the compressive strain compensation brought by the relaxed AlN interlayer. It is concluded that the strain compensation effect will occur only when the thickness of the LT-AlN IL is beyond a critical thickness.

  12. GaN Electronics For High Power, High Temperature Applications

    SciTech Connect

    PEARTON,S.J.; REN,F.; ZHANG,A.P.; DANG,G.; CAO,X.A.; LEE,K.P.; CHO,H.; GILA,B.P.; JOHNSON,J.W.; MONIER,C.; ABERNATHY,C.R.; HAN,JUNG; BACA,ALBERT G.; CHYI,J.-I.; LEE,C.-M.; NEE,T.-E.; CHUO,C.-C.; CHU,S.N.G.

    2000-06-12

    A brief review is given of recent progress in fabrication of high voltage GaN and AlGaN rectifiers. GaN/AlGaN heterojunction bipolar transistors and GaN metal-oxide semiconductor field effect transistors. Improvements in epitaxial layer quality and in fabrication techniques have led to significant advances in device performance.

  13. Conductivity based on selective etch for GaN devices and applications thereof

    DOEpatents

    Zhang, Yu; Sun, Qian; Han, Jung

    2015-12-08

    This invention relates to methods of generating NP gallium nitride (GaN) across large areas (>1 cm.sup.2) with controlled pore diameters, pore density, and porosity. Also disclosed are methods of generating novel optoelectronic devices based on porous GaN. Additionally a layer transfer scheme to separate and create free-standing crystalline GaN thin layers is disclosed that enables a new device manufacturing paradigm involving substrate recycling. Other disclosed embodiments of this invention relate to fabrication of GaN based nanocrystals and the use of NP GaN electrodes for electrolysis, water splitting, or photosynthetic process applications.

  14. Large degree of polarization of photoluminescence caused by anisotropic strain in nonpolar a-plane MgxZn1-xO layers grown by plasma-assisted molecular beam epitaxy.

    PubMed

    Chen, X Y; Pan, X H; Chen, W; Chen, S S; Huang, J Y; Ye, Z Z

    2016-10-15

    A large degree of polarization (ρ) of photoluminescence (PL) approximate to 1 is obtained in each nonpolar a-plane MgxZn1-xO layer grown by plasma-assisted molecular beam epitaxy (MBE) with x=0.01, 0.03, and 0.10, respectively. Anisotropic in-plane strains are selectively introduced by using foreign substrates and doping with different Mg contents, which strongly modify the valence band structures, leading to anisotropic optical properties. A polarized Raman measurement shows that anisotropic in-plane strains along the y and z axes increase with the increasing Mg contents. Polarized PL spectra show that ρ gradually increases to 0.97 with decreasing in-plane strains, resulting from an increasing difference in transition energy (ΔE) between E⊥c and E‖c caused by a lift of the degeneracy of valence band structures. The obtained highly polarized emission is close to linear polarized light, which is desirable in the backlighting of liquid crystal displays.

  15. Optical properties of GaN pyramids

    SciTech Connect

    Zeng, K.C.; Lin, J.Y.; Jiang, H.X.; Yang, W.

    1999-03-01

    Picosecond time-resolved photoluminescence (PL) spectroscopy has been used to investigate the optical properties of GaN pyramids overgrown on hexagonal-patterned GaN(0001) epilayers on sapphire and silicon substrates with AlN buffer layers. We found that: (i) the release of the biaxial compressive strain in GaN pyramids on GaN/AlN/sapphire substrate led to a 7 meV redshift of the spectral peak position with respect to the strained GaN epilayer grown under identical conditions; (ii) in the GaN pyramids on GaN/AlN/sapphire substrate, strong band edge transitions with much narrower linewidths than those in the GaN epilayer have been observed, indicating the improved crystalline quality of the overgrown pyramids; (iii) PL spectra taken from different parts of the pyramids revealed that the top of the pyramid had the highest crystalline quality; and (iv) the presence of strong band-to-impurity transitions in the pyramids were primarily due to the incorporation of the oxygen and silicon impurities from the SiO{sub 2} mask. {copyright} {ital 1999 American Institute of Physics.}

  16. Synchrotron radiation X-ray photoelectron spectroscopy of Ti/Al ohmic contacts to n-type GaN: Key role of Al capping layers in interface scavenging reactions

    NASA Astrophysics Data System (ADS)

    Nozaki, Mikito; Ito, Joyo; Asahara, Ryohei; Nakazawa, Satoshi; Ishida, Masahiro; Ueda, Tetsuzo; Yoshigoe, Akitaka; Hosoi, Takuji; Shimura, Takayoshi; Watanabe, Heiji

    2016-10-01

    Interface reactions between Ti-based electrodes and n-type GaN epilayers were investigated by synchrotron radiation X-ray photoelectron spectroscopy. Metallic Ga and thin TiN alloys were formed at the interface by subsequently depositing Al capping layers on ultrathin Ti layers even at room temperature. By comparing results from stacked Ti/Al and single Ti electrodes, the essential role of Al capping layers serving as an oxygen-scavenging element to produce reactive Ti underlayers was demonstrated. Further growth of the metallic interlayer during annealing was observed. A strategy for achieving low-resistance ohmic contacts to n-GaN with low-thermal-budget processing is discussed.

  17. Nitrogen vacancies as a common element of the green luminescence and nonradiative recombination centers in Mg-implanted GaN layers formed on a GaN substrate

    NASA Astrophysics Data System (ADS)

    Kojima, Kazunobu; Takashima, Shinya; Edo, Masaharu; Ueno, Katsunori; Shimizu, Mitsuaki; Takahashi, Tokio; Ishibashi, Shoji; Uedono, Akira; Chichibu, Shigefusa F.

    2017-06-01

    The photoluminescences of ion-implanted (I/I) and epitaxial Mg-doped GaN (GaN:Mg) are compared. The intensities and lifetimes of the near-band-edge and ultraviolet luminescences associated with a MgGa acceptor of I/I GaN:Mg were significantly lower and shorter than those of the epilayers, respectively. Simultaneously, the green luminescence (GL) became dominant. These emissions were quenched far below room temperature. The results indicate the generation of point defects common to GL and nonradiative recombination centers (NRCs) by I/I. Taking the results of positron annihilation measurement into account, N vacancies are the prime candidate to emit GL and create NRCs with Ga vacancies, (VGa) m (VN) n , as well as to inhibit p-type conductivity.

  18. Viability and proliferation of endothelial cells upon exposure to GaN nanoparticles.

    PubMed

    Braniste, Tudor; Tiginyanu, Ion; Horvath, Tibor; Raevschi, Simion; Cebotari, Serghei; Lux, Marco; Haverich, Axel; Hilfiker, Andres

    2016-01-01

    Nanotechnology is a rapidly growing and promising field of interest in medicine; however, nanoparticle-cell interactions are not yet fully understood. The goal of this work was to examine the interaction between endothelial cells and gallium nitride (GaN) semiconductor nanoparticles. Cellular viability, adhesion, proliferation, and uptake of nanoparticles by endothelial cells were investigated. The effect of free GaN nanoparticles versus the effect of growing endothelial cells on GaN functionalized surfaces was examined. To functionalize surfaces with GaN, GaN nanoparticles were synthesized on a sacrificial layer of zinc oxide (ZnO) nanoparticles using hydride vapor phase epitaxy. The uptake of GaN nanoparticles by porcine endothelial cells was strongly dependent upon whether they were fixed to the substrate surface or free floating in the medium. The endothelial cells grown on surfaces functionalized with GaN nanoparticles demonstrated excellent adhesion and proliferation, suggesting good biocompatibility of the nanostructured GaN.

  19. Structural defects in GaN revealed by Transmission Electron Microscopy

    DOE PAGES

    Liliental-Weber, Zuzanna

    2014-09-08

    This paper reviews the various types of structural defects observed by Transmission Electron Microscopy in GaN heteroepitaxial layers grown on foreign substrates and homoepitaxial layers grown on bulk GaN substrates. The structural perfection of these layers is compared to the platelet self-standing crystals grown by High Nitrogen Pressure Solution. Defects in undoped and Mg doped GaN are discussed. Lastly, some models explaining the formation of inversion domains in heavily Mg doped layers that are possible defects responsible for the difficulties of p-doping in GaN are also reviewed.

  20. The interface analysis of GaN grown on 0° off 6H-SiC with an ultra-thin buffer layer

    NASA Astrophysics Data System (ADS)

    Sun, Zheng; Ohta, Akio; Miyazaki, Seiichi; Nagamatsu, Kentaro; Lee, Hojun; Olsson, Marc; Ye, Zheng; Deki, Manato; Honda, Yoshio; Amano, Hiroshi

    2016-01-01

    Previously, we reported a growth method by metalorganic vapor phase epitaxy using a single two-dimensional growth step, resulting in 1.2-µm crack-free GaN directly grown on 6H-SiC substrate. The introduction of Al-treatment prior to the standard GaN growth step resulted in improved surface wetting of gallium on the SiC substrate. Transmission electron microscope and energy dispersive spectrometer analysis of the epitaxial interface to the SiC determined that an ultra-thin AlGaN interlayer had formed measuring around 2-3 nm. We expect our growth technique can be applied to the fabrication of GaN/SiC high frequency and high power devices.

  1. Polarity of semipolar wurtzite crystals: X-ray photoelectron diffraction from GaN(101⁻1) and GaN(202⁻1) surfaces

    SciTech Connect

    Romanyuk, O. Jiříček, P.; Bartoš, I.; Paskova, T.

    2014-09-14

    Polarity of semipolar GaN(101⁻1) (101⁻1⁻) and GaN(202⁻1) (202⁻1⁻) surfaces was determined with X-ray photoelectron diffraction (XPD) using a standard MgKα source. The photoelectron emission from N 1s core level measured in the a-plane of the crystals shows significant differences for the two crystal orientations within the polar angle range of 80–100° from the (0001) normal. It was demonstrated that XPD polar plots recorded in the a-plane are similar for each polarity of the GaN(101⁻1) and GaN(202⁻1) crystals if referred to (0001) crystal axes. For polarity determinations of all important GaN(h0h⁻l) semipolar surfaces, the above given polar angle range is suitable.

  2. Mechanism of stress control for GaN growth on Si using AlN interlayers

    NASA Astrophysics Data System (ADS)

    Suzuki, Michihiro; Nakamura, Akihiro; Nakano, Yoshiaki; Sugiyama, Masakazu

    2017-04-01

    For the purpose of controlling the wafer bow of GaN-on-Si structure, in situ curvature transient during the growth of a GaN layer on an AlN interlayer was investigated systematically by estimating the compressive strain applied to the GaN layer with the progress of the layer growth. The compressive strain was dependent on the morphology of the GaN surface prior to the growth of the AlN interlayer. It was found that the transition sequence from GaN growth to AlN growth induces roughening of the GaN surface and both high NH3 partial pressure and the short transition time were effective for reducing the roughness of the GaN surface beneath the AlN interlayer. The improved transition sequence increased the compressive strain in GaN by a factor of 2.5. The AlN grown at the same temperature as that of GaN was beneficial in both better surface morphology and the reduction of the transition time between GaN growth and AlN growth. With this high-temperature AlN interlayer, its thickness is another important factor governing the compressive strain in GaN. To get AlN relaxed for applying the compressive strain to GaN, the AlN layer should be thicker but too thick layer after relaxation results in surface roughening, which in turn introduces defects to the overlying GaN layer and reduces the compressive strain by partial lattice relaxation of GaN.

  3. GaN membrane MSM ultraviolet photodetectors

    NASA Astrophysics Data System (ADS)

    Muller, A.; Konstantinidis, G.; Kostopoulos, A.; Dragoman, M.; Neculoiu, D.; Androulidaki, M.; Kayambaki, M.; Vasilache, D.; Buiculescu, C.; Petrini, I.

    2006-12-01

    GaN exhibits unique physical properties, which make this material very attractive for wide range of applications and among them ultraviolet detection. For the first time a MSM type UV photodetector structure was manufactured on a 2.2 μm. thick GaN membrane obtained using micromachining techniques. The low unintentionally doped GaN layer structure was grown by MOCVD on high resistivity (ρ>10kΩcm) <111> oriented silicon wafers, 500μm thick. The epitaxially grown layers include a thin AlN layer in order to reduce the stress in the GaN layer and avoid cracking. Conventional contact lithography, e-gun Ni/Au (10nm /200nm) evaporation and lift-off techniques were used to define the interdigitated Schottky metalization on the top of the wafer. Ten digits with a width of 1μm and a length of 100μm were defined for each electrode. The distance between the digits was also 1μm. After the backside lapping of the wafer to a thickness of approximately 150μm, a 400nm thick Al layer was patterned and deposited on the backside, to be used as mask for the selective reactive ion etching of silicon. The backside mask, for the membrane formation, was patterned using double side alignment techniques and silicon was etched down to the 2.2μm thin GaN layer using SF 6 plasma. A very low dark current (30ρA at 3V) was obtained. Optical responsivity measurements were performed at 1.5V. A maximum responsivity of 18mA/W was obtained at a wavelength of 370nm. This value is very good and can be further improved using transparent contacts for the interdigitated structure.

  4. Mg-compensation effect in GaN buffer layer for AlGaN/GaN high-electron-mobility transistors grown on 4H-SiC substrate

    NASA Astrophysics Data System (ADS)

    Ko, Kwangse; Lee, Kyeongjae; So, Byeongchan; Heo, Cheon; Lee, Kyungbae; Kwak, Taemyung; Han, Sang-Woo; Cha, Ho-Young; Nam, Okhyun

    2017-01-01

    The present study investigated the Mg doping effect in the gallium nitride (GaN) buffer layers (BLs) of AlGaN/GaN high-electron-mobility transistor (HEMT) structures grown on semi-insulating 4H-SiC substrates by metal organic chemical vapor deposition. When the Mg concentration was increased from 3 × 1017 to 8 × 1018 cm-3, the crystal quality slightly deteriorated, whereas electrical properties were significantly changed. The buffer leakage increased approximately 50 times from 0.77 to 39.2 nA at -50 V with the Mg doping concentration. The Mg-compensation effect and electron trapping effect were observed at Mg concentration of 3 × 1017 and 8 × 1018 cm-3, respectively, which were confirmed by an isolation leakage current test and low-temperature photoluminescence. When the BL was compensated, the two-dimensional electron gas (2DEG) mobility and sheet carrier concentration of the HEMTs were 1560 cm2 V-1 s-1 and 5.06 × 1012 cm-2, respectively. As a result, Mg-doped GaN BLs were demonstrated as a candidates of semi-insulating BLs for AlGaN/GaN HEMT.

  5. Growth and characterizations of various GaN nanostructures on C-plane sapphire using laser MBE

    NASA Astrophysics Data System (ADS)

    Ch., Ramesh; Tyagi, P.; Maurya, K. K.; Kumar, M. Senthil; Kushvaha, S. S.

    2017-05-01

    We have grown various GaN nanostructures such as three-dimensional islands, nanowalls and nanocolumns on c-plane sapphire substrates using laser assisted molecular beam epitaxy (LMBE) system. The shape of the GaN nanostructures was controlled by using different nucleation surfaces such as bare and nitridated sapphire with GaN or AlN buffer layers. The structural and surface morphological properties of grown GaN nanostructures were characterized by ex-situ high resolution x-ray diffraction, Raman spectroscopy and field emission scanning electron microscopy. The symmetric x-ray rocking curve along GaN (0002) plane shows that the GaN grown on pre-nitridated sapphire with GaN or AlN buffer layer possesses good crystalline quality compared to sapphire without nitridation. The Raman spectroscopy measurements revealed the wurtzite phase for all the GaN nanostructures grown on c-sapphire.

  6. GaN film growth on LiNbO3 surfaces using molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Hoai Nam, Man; Goo, Son Chul; Deock Kim, Moon; Yang, Woochul

    2009-09-01

    GaN has been used for high power, high frequency electronic and optoelectronic devices such as light emitting diodes and laser diodes. Most of the GaN films grow on sapphire (0001) and silicon (111) substrates. In these work, we are trying to grow GaN films on lithium niobate (LiNbO3) substrates using molecular beam epitaxy (MBE). As a ferroelectric materials, LiNbO3 has a spontaneous polarization which may provide excellent control of polarity of GaN. The growth of GaN films on LiNbO3 has been performed after the LiNbO3 substrates was annealed in air at 1000°C for 2 hours. The annealed substrates allowed us to prepare atomically flat surfaces and improve adhesion of GaN on LiNbO3. The AlN buffer layer was deposited to get a smaller lattice mismatch with the GaN films. Compared with GaN films grown without a AlN layer, the crystal qualities of GaN films with AlN buffer layers are extremely improved. The surface morphology of LiNbO3 substrates and the grown GaN films were characterized by atomic force microscopy (AFM), and the crystal structures were studied by X-ray diffraction (XRD).

  7. Origin of huge photoluminescence efficiency improvement in InGaN/GaN multiple quantum wells with low-temperature GaN cap layer grown in N2/H2 mixture gas

    NASA Astrophysics Data System (ADS)

    Zhu, Yadan; Lu, Taiping; Zhou, Xiaorun; Zhao, Guangzhou; Dong, Hailiang; Jia, Zhigang; Liu, Xuguang; Xu, Bingshe

    2017-06-01

    The nominal internal quantum efficiency of InGaN/GaN multiple quantum wells significantly increases from 5.6 to 26.8%, as a low-temperature GaN cap layer is grown in N2/H2 mixture gas. Meanwhile, the room-temperature photoluminescence (PL) peak energy shows a merely 73 meV blue shift. On the basis of temperature-dependent PL characteristics analysis, the huge improvement in PL efficiency arises mainly from the “etching effect” of hydrogen, which reduces the defect density and indium segregation at the upper well/barrier interface, and consequently contributes to the decrease in the number of nonradiative recombination centers and the enhancement of carrier localization.

  8. GaN HEMTs

    NASA Astrophysics Data System (ADS)

    Anderson, Jonathan W.; Lee, Kyoung-Keun; Piner, Edwin L.

    2012-03-01

    Gallium nitride (GaN) has enormous potential for applications in high electron mobility transistors (HEMTs) used in RF and power devices. Intrinsic device properties such as high electron mobility, high breakdown voltage, very high current density, electron confinement in a narrow channel, and high electron velocity in the 2-dimensional electron gas of the HEMT structure are due in large part to the wide band gap of this novel semiconductor material system. This presentation discusses the properties of GaN that make it superior to other semiconductor materials, and outlines the research that will be undertaken in a new program at Texas State University to advance GaN HEMT technology. This program's aim is to further innovate the exceptional performance of GaN through improved material growth processes and epitaxial structure design.

  9. Fabrication of GaN nanowire arrays by confined epitaxy

    NASA Astrophysics Data System (ADS)

    Wang, Xin; Sun, Xinyu; Fairchild, Michael; Hersee, Stephen D.

    2006-12-01

    The authors report the fabrication of GaN nanowire arrays inside a thick SiNx, selective growth mask that was patterned by interferometric lithography and dry etching. The GaN nanowires are molded by the apertures in the selective growth mask and the growth is epitaxial with respect to the underlying GaN layer. The precise location and diameter of each nanowire in the array are controlled by the growth mask patterning, and the resulting array has a long-range order that is compatible with photonic crystal applications. This process uses conventional metal organic precursors and does not require any additional metal catalysts.

  10. Step-induced misorientation of GaN grown on r-plane sapphire

    SciTech Connect

    Smalc-Koziorowska, J.; Dimitrakopulos, G. P.; Sahonta, S.-L.; Komninou, Ph.; Tsiakatouras, G.; Georgakilas, A.

    2008-07-14

    In the growth of nonpolar (1120) a-plane GaN on r-plane (1102) sapphire by plasma-assisted molecular beam epitaxy, misoriented crystallites are observed close to the substrate. They have average diameter {approx}10 nm and are oriented with the (0001){sub GaN} plane approximately parallel to the (2113){sub sapph.} plane and [0110]{sub GaN} parallel [1101]{sub sapph.}. This semipolar orientation is promoted by a low misfit (2.4%) between (1011){sub GaN} and (1210){sub sapph.} planes. Its introduction, after nitridation treatment, is due to GaN nucleation on (2113){sub sapph.} step facets inclined at 26 deg. relative to the r-plane. Two variants are observed, leading to twinning when they abut inside the epilayer.

  11. Hydrogen sensing characteristics of semipolar (112{sup ¯}2) GaN Schottky diodes

    SciTech Connect

    Hyeon Baik, Kwang; Kim, Hyonwoong; Jang, Soohwan; Lee, Sung-Nam; Lim, Eunju; Pearton, S. J.; Ren, F.

    2014-02-17

    The hydrogen detection characteristics of semipolar (112{sup ¯}2) plane GaN Schottky diodes were investigated and compared to c-plane Ga- and N-polar and nonpolar a-plane (112{sup ¯}0) GaN diodes. The semipolar GaN diodes showed large current response to 4% hydrogen in nitrogen gas with an accompanying Schottky barrier reduction of 0.53 eV at 25 °C, and the devices exhibited full recovery to the initial current level upon switching to a nitrogen ambient. The current-voltage characteristics of the semipolar devices remained rectifying after hydrogen exposure, in sharp contrast to the case of c-plane N-polar GaN. These results show that the surface atom configuration and polarity play a strong role in hydrogen sensing with GaN.

  12. Theoretical study for heterojunction surface of NEA GaN photocathode dispensed with Cs activation

    NASA Astrophysics Data System (ADS)

    Xia, Sihao; Liu, Lei; Wang, Honggang; Wang, Meishan; Kong, Yike

    2016-09-01

    For the disadvantages of conventional negative electron affinity (NEA) GaN photocathodes activated by Cs or Cs/O, new-type NEA GaN photocathodes with heterojunction surface dispensed with Cs activation are investigated based on first-principle study with density functional theory. Through the growth of an ultrathin n-type GaN cap layer on p-type GaN emission layer, a p-n heterojunction is formed on the surface. According to the calculation results, it is found that Si atoms tend to replace Ga atoms to result in an n-type doped cap layer which contributes to the decreasing of work function. After the growth of n-type GaN cap layer, the atom structure near the p-type emission layer is changed while that away from the surface has no obvious variations. By analyzing the E-Mulliken charge distribution of emission surface with and without cap layer, it is found that the positive charge of Ga and Mg atoms in the emission layer decrease caused by the cap layer, while the negative charge of N atom increases. The conduction band moves downwards after the growth of cap layer. Si atom produces donor levels around the valence band maximum. The absorption coefficient of GaN emission layer decreases and the reflectivity increases caused by n-type GaN cap layer.

  13. GaN nanorods coated with pure BN

    NASA Astrophysics Data System (ADS)

    Han, Wei-Qiang; Zettl, A.

    2002-12-01

    We report a method to efficiently synthesize gallium nitride (GaN) nanorods coated with insulating boron nitride (BN) layers. The GaN core is crystalline (with either a cubic zincblende or hexagonal wurtzite structure) and has diameters ranging from 10 to 85 nm and lengths up to 60 μm. The outer encapsulating BN shells with typical thicknesses less than 5 nm extend fully over, and adhere well to, the entire nanorod surface.

  14. Critical issues for homoepitaxial GaN growth by molecular beam epitaxy on hydride vapor-phase epitaxy-grown GaN substrates

    NASA Astrophysics Data System (ADS)

    Storm, D. F.; Hardy, M. T.; Katzer, D. S.; Nepal, N.; Downey, B. P.; Meyer, D. J.; McConkie, Thomas O.; Zhou, Lin; Smith, David J.

    2016-12-01

    While the heteroepitaxial growth of gallium nitride-based materials and devices on substrates such as SiC, sapphire, and Si has been well-documented, the lack of a cost-effective source of bulk GaN crystals has hindered similar progress on homoepitaxy. Nevertheless, freestanding GaN wafers are becoming more widely available, and there is great interest in growing GaN films and devices on bulk GaN substrates, in order to take advantage of the greatly reduced density of threading dislocations, particularly for vertical devices. However, homoepitaxial GaN growth is far from a trivial task due to the reactivity and different chemical sensitivities of N-polar (000_1) and Ga-polar (0001) GaN surfaces, which can affect the microstructure and concentrations of impurities in homoepitaxial GaN layers. In order to achieve high quality, high purity homoepitaxial GaN, it is necessary to investigate the effect of the ex situ wet chemical clean, the use of in situ cleaning procedures, the sensitivity of the GaN surface to thermal decomposition, and the effect of growth temperature. We review the current understanding of these issues with a focus on homoepitaxial growth of GaN by molecular beam epitaxy (MBE) on c-plane surfaces of freestanding GaN substrates grown by hydride vapor phase epitaxy (HVPE), as HVPE-grown substrates are most widely available. We demonstrate methods for obtaining homoepitaxial GaN layers by plasma-assisted MBE in which no additional threading dislocations are generated from the regrowth interface and impurity concentrations are greatly reduced.

  15. Direct growth of freestanding GaN on C-face SiC by HVPE.

    PubMed

    Tian, Yuan; Shao, Yongliang; Wu, Yongzhong; Hao, Xiaopeng; Zhang, Lei; Dai, Yuanbin; Huo, Qin

    2015-06-02

    In this work, high quality GaN crystal was successfully grown on C-face 6H-SiC by HVPE using a two steps growth process. Due to the small interaction stress between the GaN and the SiC substrate, the GaN was self-separated from the SiC substrate even with a small thickness of about 100 μm. Moreover, the SiC substrate was excellent without damage after the whole process so that it can be repeatedly used in the GaN growth. Hot phosphoric acid etching (at 240 °C for 30 min) was employed to identify the polarity of the GaN layer. According to the etching results, the obtained layer was Ga-polar GaN. High-resolution X-ray diffraction (HRXRD) and electron backscatter diffraction (EBSD) were done to characterize the quality of the freestanding GaN. The Raman measurements showed that the freestanding GaN film grown on the C-face 6H-SiC was stress-free. The optical properties of the freestanding GaN layer were determined by photoluminescence (PL) spectra.

  16. Direct growth of freestanding GaN on C-face SiC by HVPE

    PubMed Central

    Tian, Yuan; Shao, Yongliang; Wu, Yongzhong; Hao, Xiaopeng; Zhang, Lei; Dai, Yuanbin; Huo, Qin

    2015-01-01

    In this work, high quality GaN crystal was successfully grown on C-face 6H-SiC by HVPE using a two steps growth process. Due to the small interaction stress between the GaN and the SiC substrate, the GaN was self-separated from the SiC substrate even with a small thickness of about 100 μm. Moreover, the SiC substrate was excellent without damage after the whole process so that it can be repeatedly used in the GaN growth. Hot phosphoric acid etching (at 240 °C for 30 min) was employed to identify the polarity of the GaN layer. According to the etching results, the obtained layer was Ga-polar GaN. High-resolution X-ray diffraction (HRXRD) and electron backscatter diffraction (EBSD) were done to characterize the quality of the freestanding GaN. The Raman measurements showed that the freestanding GaN film grown on the C-face 6H-SiC was stress-free. The optical properties of the freestanding GaN layer were determined by photoluminescence (PL) spectra. PMID:26034939

  17. O3-sourced atomic layer deposition of high quality Al2O3 gate dielectric for normally-off GaN metal-insulator-semiconductor high-electron-mobility transistors

    NASA Astrophysics Data System (ADS)

    Huang, Sen; Liu, Xinyu; Wei, Ke; Liu, Guoguo; Wang, Xinhua; Sun, Bing; Yang, Xuelin; Shen, Bo; Liu, Cheng; Liu, Shenghou; Hua, Mengyuan; Yang, Shu; Chen, Kevin J.

    2015-01-01

    High quality Al2O3 film grown by atomic layer deposition (ALD), with ozone (O3) as oxygen source, is demonstrated for fabrication of normally-off AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs). Significant suppression of Al-O-H and Al-Al bonds in ALD-Al2O3 has been realized by substituting conventional H2O source with O3. A high dielectric breakdown E-field of 8.5 MV/cm and good TDDB behavior are achieved in a gate dielectric stack consisting of 13-nm O3-Al2O3 and 2-nm H2O-Al2O3 interfacial layer on recessed GaN. By using this 15-nm gate dielectric and a high-temperature gate-recess technique, the density of positive bulk/interface charges in normally-off AlGaN/GaN MIS-HEMTs is remarkably suppressed to as low as 0.9 × 1012 cm-2, contributing to the realization of normally-off operation with a high threshold voltage of +1.6 V and a low specific ON-resistance RON,sp of 0.49 mΩ cm2.

  18. Saturation Behavior of Eu ion emission in GaN

    NASA Astrophysics Data System (ADS)

    Hernandez, Natalie; Mitchell, Brandon; Fujiwara, Yasufumi; Dierolf, Volkmar

    Europium doped Gallium Nitride (GaN:Eu) has been recognized as a candidate for the red-emitting active layer in nitride-based light emitting diodes. To better comprehend the excitation energy transfer from the excited GaN host to the Eu ion, we performed an extensive analysis of GaN:Eu and GaN co-doped with Eu and other dopants (Silicon and Magnesium). We determined how various growth parameters manipulated site formations and measured the optical accessibility of the Eu ions within the GaN host and the excitation efficiency of the energy transfer between the host material and the Eu ions. Furthermore, we derived a model for the saturation behavior of the emission of Eu ions within GaN. Our results suggest that the saturation behavior is strongly influenced by different crystal growth specifications and co-dopants.

  19. GaN growth on Si pillar arrays by metalorganic chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Won, Dongjin; Weng, Xiaojun; Yuwen, Yu A.; Ke, Yue; Kendrick, Chito; Shen, Haoting; Mayer, Theresa S.; Redwing, Joan M.

    2013-05-01

    GaN growth on high aspect ratio Si micro-pillar arrays prepared by deep reactive ion etching (DRIE) was investigated using Si(111), Si(110), Si(112), and Si(100) substrates. The sidewall roughness of the Si pillars resulting from DRIE was reduced by thermal annealing at 1100 °C in H2 for 5 min. Conformal AlN buffer layers were grown at 1100 °C on the pillars. In contrast, GaN films grown at 1100 °C were always faceted since GaN preferentially nucleated and grew on the Si{1 1¯ 0} and Si{1 1¯ 1} sidewall planes of the Si pillars. The preferential growth lead to unique symmetries for the independent GaN fins depending on pillar orientation. Lateral growth of the GaN fins at 1100 °C was enhanced with increasing V/III ratio up to 22710. However, the GaN fins did not coalesce seamlessly. A lower growth temperature of 800 °C gave rise to a conformal polycrystalline GaN shell. Post-annealing of the GaN shells at 1100 °C in H2 for 15 min after growth at 800 °C induced highly textured GaN films although the GaN films became partly faceted.

  20. Fabrication of a Lateral Polarity GaN MESFET: An Exploratory Study

    DTIC Science & Technology

    2007-06-27

    the sheet resistance between Ga- polar and mixed-polar GaN films. Highly resistive Ga-polar GaN is advantageous in optoelectronic and electronic device...re si st an ce [ M Ω /s q. ] 108642 2nd nitridation time [min] (b) Figure 5. Sheet resistance of GaN grown on AlN region for the first set of LT...AlN layers deposited for 4, 6, and 8 min. 2nd nitridation time after ex-situ process was kept at 950°C for 1 min. (b) Sheet resistance of GaN grown on

  1. Demonstration of flexible thin film transistors with GaN channels

    NASA Astrophysics Data System (ADS)

    Bolat, S.; Sisman, Z.; Okyay, A. K.

    2016-12-01

    We report on the thin film transistors (TFTs) with Gallium Nitride (GaN) channels directly fabricated on flexible substrates. GaN thin films are grown by hollow cathode plasma assisted atomic layer deposition (HCPA-ALD) at 200 °C. TFTs exhibit 103 on-to-off current ratios and are shown to exhibit proper transistor saturation behavior in their output characteristics. Gate bias stress tests reveal that flexible GaN TFTs have extremely stable electrical characteristics. Overall fabrication thermal budget is below 200 °C, the lowest reported for the GaN based transistors so far.

  2. DLTS study of n-type GaN grown by MOCVD on GaN substrates

    NASA Astrophysics Data System (ADS)

    Tokuda, Y.; Matsuoka, Y.; Ueda, H.; Ishiguro, O.; Soejima, N.; Kachi, T.

    2006-10-01

    Electron traps in n-type GaN layers grown homoepitaxially by MOCVD on free-standing GaN substrates have been characterized using DLTS for vertical Schottky diodes. Two free-standing HVPE GaN substrates (A and B), obtained from two different sources, are used. The Si-doped GaN layers with the thickness of 5 μm are grown on an area of 0.9×0.9 cm 2 of substrate A and on an area of 1×1 cm 2 of substrate B. Two traps labeled B1 (Ec-0.23 eV) and B2 (Ec-0.58 eV) are observed with trap B2 dominant in GaN on both substrates. There exist no dislocation-related traps which have been previously observed in MOCVD GaN on sapphire. This might be correlated to the reduction in dislocation density due to the homoepitaxial growth. However, it is found that there is a large variation, more than an order of magnitude, in trap B2 concentration and that the B2 spatial distributions are different between the two substrates used.

  3. Growth of freestanding GaN using pillar-epitaxial lateral overgrowth from GaN nanocolumns

    NASA Astrophysics Data System (ADS)

    Bougrioua, Z.; Gibart, P.; Calleja, E.; Jahn, U.; Trampert, A.; Ristic, J.; Utrera, M.; Nataf, G.

    2007-12-01

    Dislocation-free and strain-free GaN nanopillars, grown on Si by molecular beam epitaxy, were used as nanoseeds for a new form of epitaxial lateral overgrowth (ELO) by metalorganic vapour phase epitaxy (MOVPE) until full coalescence. Such overgrown GaN films are almost relaxed and were used as templates for producing thick GaN layers by halide vapour phase epitaxy (HVPE). The final GaN film is easily separated from the starting Si substrate. This is henceforth a new technology to produce freestanding GaN. The GaN crystal quality was assessed by transmission electron microscopy (TEM), photo- and cathodoluminescence (PL, CL). It was seen that the pillar-ELO is produced from a limited number of nanopillars. Some dislocations and basal stacking faults are formed during the coalescence. However, those that propagate parallel to the substrate do not replicate in the top layer and it is expected that the thickened material present a reduced defect density.

  4. Spontaneous nucleation and growth of GaN nanowires: the fundamental role of crystal polarity.

    PubMed

    Fernández-Garrido, Sergio; Kong, Xiang; Gotschke, Tobias; Calarco, Raffaella; Geelhaar, Lutz; Trampert, Achim; Brandt, Oliver

    2012-12-12

    We experimentally investigate whether crystal polarity affects the growth of GaN nanowires in plasma-assisted molecular beam epitaxy and whether their formation has to be induced by defects. For this purpose, we prepare smooth and coherently strained AlN layers on 6H-SiC(0001) and SiC(0001̅) substrates to ensure a well-defined polarity and an absence of structural and morphological defects. On N-polar AlN, a homogeneous and dense N-polar GaN nanowire array forms, evidencing that GaN nanowires form spontaneously in the absence of defects. On Al-polar AlN, we do not observe the formation of Ga-polar GaN NWs. Instead, sparse N-polar GaN nanowires grow embedded in a Ga-polar GaN layer. These N-polar GaN nanowires are shown to be accidental in that the necessary polarity inversion is induced by the formation of Si(x)N. The present findings thus demonstrate that spontaneously formed GaN nanowires are irrevocably N-polar. Due to the strong impact of the polarity on the properties of GaN-based devices, these results are not only essential to understand the spontaneous formation of GaN nanowires but also of high technological relevance.

  5. Phase-field simulations of GaN growth by selective area epitaxy on complex mask geometries

    SciTech Connect

    Aagesen, Larry K.; Coltrin, Michael Elliott; Han, Jung; Thornton, Katsuyo

    2015-05-15

    Three-dimensional phase-field simulations of GaN growth by selective area epitaxy were performed. Furthermore, this model includes a crystallographic-orientation-dependent deposition rate and arbitrarily complex mask geometries. The orientation-dependent deposition rate can be determined from experimental measurements of the relative growth rates of low-index crystallographic facets. Growth on various complex mask geometries was simulated on both c-plane and a-plane template layers. Agreement was observed between simulations and experiment, including complex phenomena occurring at the intersections between facets. The sources of the discrepancies between simulated and experimental morphologies were also investigated. We found that the model provides a route to optimize masks and processing conditions during materials synthesis for solar cells, light-emitting diodes, and other electronic and opto-electronic applications.

  6. Phase-field simulations of GaN growth by selective area epitaxy from complex mask geometries

    SciTech Connect

    Aagesen, Larry K.; Thornton, Katsuyo; Coltrin, Michael E.; Han, Jung

    2015-05-21

    Three-dimensional phase-field simulations of GaN growth by selective area epitaxy were performed. The model includes a crystallographic-orientation-dependent deposition rate and arbitrarily complex mask geometries. The orientation-dependent deposition rate can be determined from experimental measurements of the relative growth rates of low-index crystallographic facets. Growth on various complex mask geometries was simulated on both c-plane and a-plane template layers. Agreement was observed between simulations and experiment, including complex phenomena occurring at the intersections between facets. The sources of the discrepancies between simulated and experimental morphologies were also investigated. The model provides a route to optimize masks and processing conditions during materials synthesis for solar cells, light-emitting diodes, and other electronic and opto-electronic applications.

  7. Phase-field simulations of GaN growth by selective area epitaxy on complex mask geometries

    DOE PAGES

    Aagesen, Larry K.; Coltrin, Michael Elliott; Han, Jung; ...

    2015-05-15

    Three-dimensional phase-field simulations of GaN growth by selective area epitaxy were performed. Furthermore, this model includes a crystallographic-orientation-dependent deposition rate and arbitrarily complex mask geometries. The orientation-dependent deposition rate can be determined from experimental measurements of the relative growth rates of low-index crystallographic facets. Growth on various complex mask geometries was simulated on both c-plane and a-plane template layers. Agreement was observed between simulations and experiment, including complex phenomena occurring at the intersections between facets. The sources of the discrepancies between simulated and experimental morphologies were also investigated. We found that the model provides a route to optimize masks andmore » processing conditions during materials synthesis for solar cells, light-emitting diodes, and other electronic and opto-electronic applications.« less

  8. Highly reliable Ti-based ohmic contact to N-polar n-type GaN for vertical-geometry light-emitting diodes by using a Ta barrier layer.

    PubMed

    Park, Jae-Seong; Han, Jaecheon; Seong, Tae-Yeon

    2014-05-05

    The formation of thermally stable and low resistance Ti/Al-based ohmic contacts to N-polar n-GaN for high-power vertical light-emitting diodes (VLEDs) using a Ta diffusion barrier is presented. Before annealing, both Ti/Al/Au and Ti/Ta/Al/Au contacts reveal ohmic behavior with specific contact resistances of 2.4 × 10⁻⁴ and 1.2 × 10⁻⁴ Ωcm², respectively. However, unlike the Ti/Al/Au samples that are electrically degraded with increasing annealing time at 250 °C, the Ti/Ta/Al/Au samples remain thermally stable even after annealing for 600 min. LEDs fabricated with the Ti/Ta/Al/Au contacts yield 8.3% higher output power (at 300 mA) than LEDs with the Ti/Al/Au contact. X-ray photoemission spectroscopy results show that the Ta layer serves as an efficient barrier to the indiffusion of oxygen toward the GaN. On the basis of the XPS and electrical results, the annealing dependence of the electrical characteristics of Ti/Al-based contacts are described and discussed.

  9. Structural and morphological properties of GaN buffer layers grown by ammonia molecular beam epitaxy on SiC substrates for AlGaN/GaN high electron mobility transistors

    SciTech Connect

    Corrion, A. L.; Poblenz, C.; Wu, F.; Speck, J. S.

    2008-05-01

    The impact of growth conditions on the surface morphology and structural properties of ammonia molecular beam epitaxy GaN buffers layers on SiC substrates was investigated. The threading dislocation (TD) density was found to decrease with decreasing NH{sub 3}:Ga flux ratio, which corresponded to an increase in surface roughness and reduction in residual compressive lattice mismatch stress. Furthermore, the dislocation density and compressive stress decreased for increasing buffer thickness. TD inclination was proposed to account for these observations. Optimized surface morphologies were realized at high NH{sub 3}:Ga flux ratios and were characterized by monolayer-high steps, spiral hillocks, and pyramidal mounds, with rms roughness of {approx}1.0 nm over 2x2 {mu}m{sup 2} atomic force microscopy images. Smooth surface morphologies were realized over a large range of growth temperatures and fluxes, and growth rates of up to 1 {mu}m/h were achieved. TD densities in the buffers as low as 3x10{sup 9} cm{sup -2} were demonstrated. These buffers were highly insulating and were used in recently reported AlGaN/GaN HEMTs with power densities of >11 W/mm at 4 and 10 GHz.

  10. Synthesis of p-type GaN nanowires.

    PubMed

    Kim, Sung Wook; Park, Youn Ho; Kim, Ilsoo; Park, Tae-Eon; Kwon, Byoung Wook; Choi, Won Kook; Choi, Heon-Jin

    2013-09-21

    GaN has been utilized in optoelectronics for two decades. However, p-type doping still remains crucial for realization of high performance GaN optoelectronics. Though Mg has been used as a p-dopant, its efficiency is low due to the formation of Mg-H complexes and/or structural defects in the course of doping. As a potential alternative p-type dopant, Cu has been recognized as an acceptor impurity for GaN. Herein, we report the fabrication of Cu-doped GaN nanowires (Cu:GaN NWs) and their p-type characteristics. The NWs were grown vertically via a vapor-liquid-solid (VLS) mechanism using a Au/Ni catalyst. Electrical characterization using a nanowire-field effect transistor (NW-FET) showed that the NWs exhibited n-type characteristics. However, with further annealing, the NWs showed p-type characteristics. A homo-junction structure (consisting of annealed Cu:GaN NW/n-type GaN thin film) exhibited p-n junction characteristics. A hybrid organic light emitting diode (OLED) employing the annealed Cu:GaN NWs as a hole injection layer (HIL) also demonstrated current injected luminescence. These results suggest that Cu can be used as a p-type dopant for GaN NWs.

  11. Nanoheteroepitaxy of GaN on AlN/Si(111) nanorods fabricated by nanosphere lithography

    NASA Astrophysics Data System (ADS)

    Lee, Donghyun; Shin, In-Su; Jin, Lu; Kim, Donghyun; Park, Yongjo; Yoon, Euijoon

    2016-06-01

    Nanoheteroepitaxy (NHE) of GaN on an AlN/Si(111) nanorod structure was investigated by metal-organic chemical vapor deposition. Silica nanosphere lithography was employed to fabricate a periodic hexagonal nanorod array with a narrow gap of 30 nm between the nanorods. We were successful in obtaining a fully coalesced GaN film on the AlN/Si(111) nanorod structure. Transmission electron microscopy revealed that threading dislocation (TD) bending and termination by stacking faults occurred near the interface between GaN and the AlN/Si(111) nanorods, resulting in the reduction of TD density for the NHE GaN layer. The full width at half-maximum of the X-ray rocking curve for (102) plane of the NHE GaN was found to decrease down to 728 arcsec from 1005 arcsec for the GaN layer on a planar AlN/Si(111) substrate, indicating that the crystalline quality of the NHE GaN was improved. Also, micro-Raman measurement showed that tensile stress in the NHE GaN layer was reduced significantly as much as 70% by introducing air voids between the nanorods.

  12. Opportunities and challenges in GaN metal organic chemical vapor deposition for electron devices

    NASA Astrophysics Data System (ADS)

    Matsumoto, Koh; Yamaoka, Yuya; Ubukata, Akinori; Arimura, Tadanobu; Piao, Guanxi; Yano, Yoshiki; Tokunaga, Hiroki; Tabuchi, Toshiya

    2016-05-01

    The current situation and next challenge in GaN metal organic chemical vapor deposition (MOCVD) for electron devices of both GaN on Si and GaN on GaN are presented. We have examined the possibility of increasing the growth rate of GaN on 200-mm-diameter Si by using a multiwafer production MOCVD machine, in which the vapor phase parasitic reaction is well controlled. The impact of a high-growth-rate strained-layer-superlattice (SLS) buffer layer is presented in terms of material properties. An SLS growth rate of as high as 3.46 µm/h, which was 73% higher than the current optimum, was demonstrated. As a result, comparable material properties were obtained. Next, a typical result of GaN doped with Si of 1 × 1016 cm-3 grown at the growth rate of 3.7 µm/h is shown. For high-voltage application, we need a thick high-purity GaN drift layer with a low carbon concentration, of less than 1016 cm-3. It is shown that achieving a high growth rate by precise control of the vapor phase reaction is still challenge in GaN MOCVD.

  13. High electron mobility GaN grown under N-rich conditions by plasma-assisted molecular beam epitaxy

    SciTech Connect

    Koblmueller, G.; Wu, F.; Mates, T.; Speck, J. S.; Fernandez-Garrido, S.; Calleja, E.

    2007-11-26

    An alternative approach is presented for the plasma-assisted molecular beam epitaxy of high-quality GaN. Under N-rich growth conditions, an unexpected layer-by-layer growth mode was found for a wide range of growth temperatures in the GaN thermal decomposition regime (>750 deg. C). Consequently, superior surface morphologies with roughness of less than 1 nm (rms) have been achieved. For lightly Si-doped GaN films, room-temperature electron mobilities exceeding 1100 cm{sup 2}/V s were measured, surpassing the commonly insulating nature of GaN grown under N-rich conditions at low temperature.

  14. Formation of helical dislocations in ammonothermal GaN substrate by heat treatment

    NASA Astrophysics Data System (ADS)

    Horibuchi, Kayo; Yamaguchi, Satoshi; Kimoto, Yasuji; Nishikawa, Koichi; Kachi, Tetsu

    2016-03-01

    GaN substrate produced by the basic ammonothermal method and an epitaxial layer on the substrate was evaluated using synchrotron radiation x-ray topography and transmission electron microscopy. We revealed that the threading dislocations present in the GaN substrate are deformed into helical dislocations and the generation of the voids by heat treatment in the substrate for the first observation in the GaN crystal. These phenomena are formed by the interactions between the dislocations and vacancies. The helical dislocation was formed in the substrate region, and not in the epitaxial layer region. Furthermore, the evaluation of the influence of the dislocations on the leakage current of Schottky barrier diodes fabricated on the epitaxial layer is discussed. The dislocations did not affect the leakage current characteristics of the epitaxial layer. Our results suggest that the deformation of dislocations in the GaN substrate does not adversely affect the epitaxial layer.

  15. Semipolar single component GaN on planar high index Si(11h) substrates

    SciTech Connect

    Ravash, Roghaiyeh; Blaesing, Juergen; Dadgar, Armin; Krost, Alois

    2010-10-04

    We present metal organic vapor phase epitaxy growth of polarization reduced, single component GaN on nonpatterned Si(112), Si(113), Si(114), Si(115), and Si(116) substrates. We find that the inclination angle of GaN c-axis with respect to the surface normal depends on the angle between Si(111) and above mentioned Si(11h)-surfaces. The growth of the GaN layer is essentially performed as c-axis oriented growth on the naturally occurring Si(111) facets of these Si(11h)-surfaces. The c-axis tilt-angle of GaN crystallites depends on the Si-surface direction and increases from Si(112) to Si(116) planes. GaN layers are investigated by x-ray analysis and scanning electron microscopy.

  16. High responsivity A-plane GaN-based metal-semiconductor-metal photodetectors for polarization-sensitive applications

    SciTech Connect

    Navarro, A.; Rivera, C.; Pereiro, J.; Munoz, E.; Imer, B.; DenBaars, S. P.; Speck, J. S.

    2009-05-25

    The fabrication and characterization of metal-semiconductor-metal polarization-sensitive photodetectors based on A-plane GaN grown on R-plane sapphire substrates is reported. These photodetectors take advantage of the in-plane crystal anisotropy, which results in linear dichroism near the band gap energy. The high resistivity of the A-plane GaN material leads to extremely low dark currents. For an optimized finger spacing of 1 {mu}m, dark current density and responsivity at 30 V are 0.3 nA/mm{sup 2} and 2 A/W, respectively. A maximum polarization sensitivity ratio of 1.8 was determined. In a differential configuration, the full width at half maximum of the polarization-sensitive region is 8.5 nm.

  17. O{sub 3}-sourced atomic layer deposition of high quality Al{sub 2}O{sub 3} gate dielectric for normally-off GaN metal-insulator-semiconductor high-electron-mobility transistors

    SciTech Connect

    Huang, Sen; Liu, Xinyu Wei, Ke; Liu, Guoguo; Wang, Xinhua; Sun, Bing; Yang, Xuelin; Shen, Bo; Liu, Cheng; Liu, Shenghou; Hua, Mengyuan; Yang, Shu; Chen, Kevin J.

    2015-01-19

    High quality Al{sub 2}O{sub 3} film grown by atomic layer deposition (ALD), with ozone (O{sub 3}) as oxygen source, is demonstrated for fabrication of normally-off AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs). Significant suppression of Al–O–H and Al–Al bonds in ALD-Al{sub 2}O{sub 3} has been realized by substituting conventional H{sub 2}O source with O{sub 3}. A high dielectric breakdown E-field of 8.5 MV/cm and good TDDB behavior are achieved in a gate dielectric stack consisting of 13-nm O{sub 3}-Al{sub 2}O{sub 3} and 2-nm H{sub 2}O-Al{sub 2}O{sub 3} interfacial layer on recessed GaN. By using this 15-nm gate dielectric and a high-temperature gate-recess technique, the density of positive bulk/interface charges in normally-off AlGaN/GaN MIS-HEMTs is remarkably suppressed to as low as 0.9 × 10{sup 12 }cm{sup −2}, contributing to the realization of normally-off operation with a high threshold voltage of +1.6 V and a low specific ON-resistance R{sub ON,sp} of 0.49 mΩ cm{sup 2}.

  18. Gallium kinetics on m-plane GaN

    NASA Astrophysics Data System (ADS)

    Lim, C. B.; Ajay, A.; Monroy, E.

    2017-07-01

    In this paper, we study the adsorption/desorption kinetics of gallium on (1-100) m-GaN during molecular-beam epitaxy on bulk substrates. We demonstrate the stabilization of a laterally contracted biatomic layer of Ga containing up to ≈2.5 times the (0001) surface atom density, on top of the GaN(1-100) surface. By assessing the surface morphology of m-GaN layers grown under different Ga/N flux ratios, we show that the presence of the Ga bilayer allows the growth of atomically smooth m-GaN without accumulation of Ga droplets and in conditions (substrate temperature and Ga/N ratio) that are compatible with the growth of c-GaN.

  19. Adsorption of Al on GaN(110) Surface

    NASA Astrophysics Data System (ADS)

    Xie, Jianjun; Ping, Jiang; Zhang, Kaiming; Xie, Xide

    The electronic properties of Al deposited on GaN(110) surface with different adsorption geometries have been studied by using the surface linear muffin tin orbital approach. The layer projected density of states for Al-covered GaN(110) surface is calculated and compared with that of the clean surface. The charge distribution before and after the adsorption of Al are investigated. It is found that the deposited Al atoms prefer to bond with the surface N atoms with some charge transferred from Al to the GaN substrate. Finally, the Al-Ga exchange mechanism is also studied and it is found that the adsorbed Al may replace the second layer Ga atom to form a more stable configuration.

  20. Wafer-scale epitaxial lift-off of optoelectronic grade GaN from a GaN substrate using a sacrificial ZnO interlayer

    NASA Astrophysics Data System (ADS)

    Rajan, Akhil; Rogers, David J.; Ton-That, Cuong; Zhu, Liangchen; Phillips, Matthew R.; Sundaram, Suresh; Gautier, Simon; Moudakir, Tarik; El-Gmili, Youssef; Ougazzaden, Abdallah; Sandana, Vinod E.; Teherani, Ferechteh H.; Bove, Philippe; Prior, Kevin A.; Djebbour, Zakaria; McClintock, Ryan; Razeghi, Manijeh

    2016-08-01

    Full 2 inch GaN epilayers were lifted off GaN and c-sapphire substrates by preferential chemical dissolution of sacrificial ZnO underlayers. Modification of the standard epitaxial lift-off (ELO) process by supporting the wax host with a glass substrate proved key in enabling full wafer scale-up. Scanning electron microscopy and x-ray diffraction confirmed that intact epitaxial GaN had been transferred to the glass host. Depth-resolved cathodoluminescence (CL) analysis of the bottom surface of the lifted-off GaN layer revealed strong near-band-edge (3.33 eV) emission indicating a superior optical quality for the GaN which was lifted off the GaN substrate. This modified ELO approach demonstrates that previous theories proposing that wax host curling was necessary to keep the ELO etch channel open do not apply to the GaN/ZnO system. The unprecedented full wafer transfer of epitaxial GaN to an alternative support by ELO offers the perspective of accelerating industrial adoption of the expensive GaN substrate through cost-reducing recycling.

  1. The investigation of stress in freestanding GaN crystals grown from Si substrates by HVPE.

    PubMed

    Lee, Moonsang; Mikulik, Dmitry; Yang, Mino; Park, Sungsoo

    2017-08-17

    We investigate the stress evolution of 400 µm-thick freestanding GaN crystals grown from Si substrates by hydride vapour phase epitaxy (HVPE) and the in situ removal of Si substrates. The stress generated in growing GaN can be tuned by varying the thickness of the MOCVD AlGaN/AlN buffer layers. Micro Raman analysis shows the presence of slight tensile stress in the freestanding GaN crystals and no stress accumulation in HVPE GaN layers during the growth. Additionally, it is demonstrated that the residual tensile stress in HVPE GaN is caused only by elastic stress arising from the crystal quality difference between Ga- and N-face GaN. TEM analysis revealed that the dislocations in freestanding GaN crystals have high inclination angles that are attributed to the stress relaxation of the crystals. We believe that the understanding and characterization on the structural properties of the freestanding GaN crystals will help us to use these crystals for high-performance opto-electronic devices.

  2. Study of the integrated growth of dielectric films on GaN semiconductor substrates.

    PubMed

    Li, Yanrong; Zhu, Jun; Luo, Wenbo

    2010-10-01

    Typical perovskite oxides SrTiO₃ (STO) and PbZr₀.₅₂Ti₀.₄₈O₃ (PZT) were fabricated on GaN semiconductor substrates by pulsed laser deposition. STO and PZT films were deposited on bare GaN, TiO₂, and MgO-buffered GaN. The effects of TiO₂ and MgO buffer-layers on the orientations and electric properties of the perovskite films were systematically studied. The crystalline properties were in situ monitored by reflective high energy electron diffraction and ex situ characterized by X-ray diffraction. It was found that the epitaxial temperature of STO and PZT was reduced by inserting a buffer layer. (111)-oriented films were obtained on bare and TiO₂-buffered GaN. However, the orientations of the perovskite films were changed to be (110) when deposited on MgO buffer layer. Furthermore, PZT films deposited on MgO- and TiO₂-buffered GaN show better electric performance compared with these films directly deposited on GaN. These results show that perovskite oxide could be epitaxially grown on GaN semiconductor substrates by inserting a proper buffer layer.

  3. Depth dependence of defect density and stress in GaN grown on SiC

    SciTech Connect

    Faleev, N.; Temkin, H.; Ahmad, I.; Holtz, M.; Melnik, Yu.

    2005-12-15

    We report high resolution x-ray diffraction studies of the relaxation of elastic strain in GaN grown on SiC(0001). The GaN layers were grown with thickness ranging from 0.29 to 30 {mu}m. High level of residual elastic strain was found in thin (0.29 to 0.73 {mu}m thick) GaN layers. This correlates with low density of threading screw dislocations of 1-2x10{sup 7} cm{sup -2}, observed in a surface layer formed over a defective nucleation layer. Stress was found to be very close to what is expected from thermal expansion mismatch between the GaN and SiC. A model based on generation and diffusion of point defects accounts for these observations.

  4. Strain-induced step bunching in orientation-controlled GaN on Si

    NASA Astrophysics Data System (ADS)

    Narita, Tetsuo; Iguchi, Hiroko; Horibuchi, Kayo; Otake, Nobuyuki; Hoshi, Shinichi; Tomita, Kazuyoshi

    2016-05-01

    We report a technique for the fabrication of high-quality GaN-on-silicon (Si) substrates for use in various power applications. GaN epitaxial layers were generated on Si(111) vicinal faces that had been previously covered with a thin coating of Al2O3 to control the orientation of the AlN seed layers. We obtained orientation-controlled GaN layers and found a linear relationship between the GaN c-axis and Si[111] tilt angles. As a result, the threading dislocation density in the AlN seed layer was reduced and high-quality GaN layers were generated. The X-ray rocking curves for these layers exhibited full width at half maximum values of 390‧‧ and 550‧‧ for the (004) and (114) reflections, respectively. Significant step bunching was observed on a GaN(0001) vicinal face produced using this technique, attributed to strain-induced attractive interactions between steps. Thus, by controlling the strain near the surface layer, we achieved the step flow growth of GaN on Si.

  5. Abnormal selective area growth of irregularly-shaped GaN structures on the apex of GaN pyramids and its application for wide spectral emission

    NASA Astrophysics Data System (ADS)

    Yu, Yeon Su; Lee, Jun Hyeong; Ahn, Hyung Soo; Yang, Min

    2014-12-01

    We report on the growth and the characterization of three-dimensional randomly-shaped InGaN/GaN structures selectively grown on the apex of GaN pyramids for the purpose of enlarging the emission spectral range. We found that the variations in the shape and the size of the three-dimensional GaN structures depend on the growth temperature and the surface area for selective growth under intentional turbulence in the gas stream. The selectively grown GaN structures grown at 1020 °C have irregular shape, while the samples grown at 1100 °C have rather uniform hexagonal pyramidal shapes. Irregularly shaped GaN structures were also obtained on the apex of GaN pyramids when the SiO2 mask was removed to 1/10 of the total height of the underlying GaN pyramid. When only 1/5 of the SiO2 mask was removed, however, the selectively grown GaN structures had similar hexagonal pyramidal shapes resembling those of the underlying GaN pyramids. The CL (Cathodoluminescence) spectra of the InGaN layers grown on the randomly shaped GaN structures showed a wide emission spectral range from 388 to 433 nm due to the non-uniform thickness and spatially inhomogeneous indium composition of the InGaN layers. This new selective growth method might have great potential for applications of non-phosphor white light emitting diodes (LEDs) with optimized growth conditions for InGaN active layers of high indium composition and with optimum process for fabrication of electrodes for electrical injection.

  6. High-resistivity GaN buffer templates and their optimization for GaN-based HFETs

    NASA Astrophysics Data System (ADS)

    Hubbard, S. M.; Zhao, G.; Pavlidis, D.; Sutton, W.; Cho, E.

    2005-11-01

    High-resistance (HR) GaN templates for AlGaN/GaN heterojunction field effect transistor (HFET) applications were grown using organometallic vapor phase epitaxy. The GaN sheet resistance was tuned using final nucleation layer (NL) annealing temperature and NL thickness. Using an annealing temperature of 1033 °C and NL thickness of 26 nm, GaN with sheet resistance of 10 10 Ω/sq was achieved, comparable to that of Fe-doped GaN. Material characterization results show that the high-resistance GaN is achieved due to compensating acceptor levels that may be introduced through edge-type threading dislocations. Optimization of annealing temperature and NL thickness provided a means to maximize GaN sheet resistance without significantly degrading material quality. In situ laser reflectance was used to correlate the NL properties to sheet resistance and material quality, providing a figure of merit for expected sheet resistance. AlGaN/GaN HFET layers grown using HR GaN templates with R of 10 10 Ω/sq gave surface and interface roughness of 14 and 7 Å, respectively. The 2DEG Hall mobility and sheet charge of HFETs grown using HR GaN templates was comparable to similar layers grown using unintentionally doped (UID) GaN templates.

  7. Growth of Y3Fe5O12/GaN layers by laser molecular-beam epitaxy and characterization of their structural and magnetic properties

    NASA Astrophysics Data System (ADS)

    Kaveev, A. K.; Bursian, V. E.; Gastev, S. V.; Krichevtsov, B. B.; Suturin, S. M.; Volkov, M. P.; Sokolov, N. S.

    2016-12-01

    Laser molecular-beam epitaxy has been employed to obtain layers of yttrium-iron garnet (YIG) Y3Fe5O12 on gallium nitride substrates. It was found that there exists a polycrystalline YIG phase without admixtures of other structural phases. A magnetic anisotropy of films of the "easy-magnetic plane" type was found. The gyromagnetic ratio and the demagnetizing field 4π M S were calculated.

  8. Evolution of deep centers in GaN grown by hydride vapor phaseepitaxy

    SciTech Connect

    Fang, Z.-Q.; Look, D.C.; Jasinski, J.; Benamara, M.; Liliental-Weber, Z.; Molnar, R.J.

    2001-04-18

    Deep centers and dislocation densities in undoped n GaN, grown by hydride vapor phase epitaxy (HVPE), were characterized as a function of the layer thickness by deep level transient spectroscopy and transmission electron microscopy, respectively. As the layer thickness decreases, the variety and concentration of deep centers increase, in conjunction with the increase of dislocation density. Based on comparison with electron irradiation induced centers, some dominant centers in HVPE GaN are identified as possible point defects.

  9. Chemical etching behavior of non-polar GaN sidewalls

    NASA Astrophysics Data System (ADS)

    Jung, Younghun; Jang, Soohwan; Baik, Kwang Hyeon; Kim, Hong-Yeol; Kim, Jihyun

    2016-12-01

    Wet-chemical etching of non-polar GaN films can be applied to form textured surfaces that enhance light extraction efficiency in light-emitting diodes. The etch-induced shapes (trigonal prisms) on the sidewalls of concave and convex mesa patterns defined on a-plane GaN films exhibited an alignment towards the [000 1 ̅] direction. An etch-rate vector model that includes one fast etching direction and two etching directions normal to the fast direction was developed to explain the creation of the etch-induced trigonal prisms. The large lattice parameter along with [000 1 ̅] and single dangling bond of a-plane surface supply enough space for attack of OH- ions, which is confirmed by XPS analysis that indicates the increased hydroxide spectra on a-plane after KOH etching and these are the reason for different etch rate and formation of trigonal prisms.

  10. Valence band offset of β-Ga2O3/wurtzite GaN heterostructure measured by X-ray photoelectron spectroscopy.

    PubMed

    Wei, Wei; Qin, Zhixin; Fan, Shunfei; Li, Zhiwei; Shi, Kai; Zhu, Qinsheng; Zhang, Guoyi

    2012-10-10

    A sample of the β-Ga2O3/wurtzite GaN heterostructure has been grown by dry thermal oxidation of GaN on a sapphire substrate. X-ray diffraction measurements show that the β-Ga2O3 layer was formed epitaxially on GaN. The valence band offset of the β-Ga2O3/wurtzite GaN heterostructure is measured by X-ray photoelectron spectroscopy. It is demonstrated that the valence band of the β-Ga2O3/GaN structure is 1.40 ± 0.08 eV.

  11. Valence band offset of β-Ga2O3/wurtzite GaN heterostructure measured by X-ray photoelectron spectroscopy

    PubMed Central

    2012-01-01

    A sample of the β-Ga2O3/wurtzite GaN heterostructure has been grown by dry thermal oxidation of GaN on a sapphire substrate. X-ray diffraction measurements show that the β-Ga2O3 layer was formed epitaxially on GaN. The valence band offset of the β-Ga2O3/wurtzite GaN heterostructure is measured by X-ray photoelectron spectroscopy. It is demonstrated that the valence band of the β-Ga2O3/GaN structure is 1.40 ± 0.08 eV. PMID:23046910

  12. Structural defects in bulk GaN

    NASA Astrophysics Data System (ADS)

    Liliental-Weber, Z.; dos Reis, R.; Mancuso, M.; Song, C. Y.; Grzegory, I.; Porowski, S.; Bockowski, M.

    2014-10-01

    Transmission Electron Microscopy (TEM) studies of undoped and Mg doped GaN layers grown on the HVPE substrates by High Nitrogen Pressure Solution (HNPS) with the multi-feed-seed (MFS) configuration are shown. The propagation of dislocations from the HVPE substrate to the layer is observed. Due to the interaction between these dislocations in the thick layers much lower density of these defects is observed in the upper part of the HNPS layers. Amorphous Ga precipitates with attached voids pointing toward the growth direction are observed in the undoped layer. This is similar to the presence of Ga precipitates in high-pressure platelets, however the shape of these precipitates is different. The Mg doped layers do not show Ga precipitates, but MgO rectangular precipitates are formed, decorating the dislocations. Results of TEM studies of HVPE layers grown on Ammonothermal substrates are also presented. These layers have superior crystal quality in comparison to the HNPS layers, as far as density of dislocation is concern. Occasionally some small inclusions can be found, but their chemical composition was not yet determined. It is expected that growth of the HNPS layers on these substrate will lead to large layer thickness obtained in a short time and with high crystal perfection needed in devices.

  13. The role of AlN encapsulation of GaN during implant activation annealing

    SciTech Connect

    Zolper, J.C.; Rieger, D.J.; Baca, A.G.; Pearton, S.J.; Lee, J.W.; Vartulli, C.R.; Stall, R.A.

    1996-09-01

    With the demonstration of implant doping of GaN and the resulting need to perform the activation anneal at 1100 C, details of thermal stability of the GaN surface needs to be understood. This work reports on the use of a sputtered AlN encapsulant to preserve the surface of GaN during such annealing. The surface was characterized by formation of Pt/Au Schottky contacts and by AES. Schottky contacts deposited an GaN annealed wtih the AlN encapsulant displayed good rectification properties while those formed on GaN annealed uncapped approached ohmic behavior. AES analysis supports the hypothesis that the uncapped sample has lost N from the very near surface which creates N-vacancies that act as donors and thereby form an n{sup +}-surface layer.

  14. MOCVD growth of GaN on Si through novel substrate modification techniques

    NASA Astrophysics Data System (ADS)

    Gagnon, Jarod C.

    GaN is a semiconductor material with great potential for use in high power electronics and optoelectronics due to the high electron mobility, high breakdown voltage, high thermal stability, and large direct bandgap of GaN. Si is a desirable substrate material for GaN heteroepitaxy due to the low cost of production, large wafer sizes available, and current widespread use in the electronics industry. The growth of GaN/Si devices suffers from the lattice and CTE mismatches between GaN and Si and therefore multiple methods of strain reduction have been employed to counter these effects. In this work we presented two novel methods of substrate modification to promote the growth of device quality GaN on Si. Initial work focused on the implantation of AlN/Si(111) substrates with N+ ions below the AlN/Si(111) interface. A reduction in the initial compressive stress in GaN films as well as the degree of tensile stress generation during growth was observed on implanted samples. Optical microscopy of the GaN surfaces showed reduced channeling crack density on implanted substrates. Transmission electron microscopy (TEM) studies showed a disordered layer in the Si substrate at the implantation depth which consisted of a mixture of polycrystalline and amorphous Si. Evidence was provided to suggest that the disordered layer at the implantation depth was acting as a compliant layer which decoupled the GaN film from the bulk Si substrate and partially accommodated the tensile stress formed during growth and cooling. A reduction in threading dislocation (TD) density on ion implanted substrates was also observed. Additional studies showed that by increasing the lateral size of AlN islands, the tensile growth stress and TD density in GaN films on ion implanted substrates could be further reduced. XRD studies showed an expansion of the AlN lattice on implanted substrates with larger lateral island sizes. The final tensile growth stress of films on implanted substrates was further

  15. Application of GaN for photoelectrolysis of water

    NASA Astrophysics Data System (ADS)

    Puzyk, M. V.; Usikov, A. S.; Kurin, S. Yu; Puzyk, A. M.; Fomichev, A. D.; Ermakov, I. A.; Kovalev, D. S.; Papchenko, B. P.; Helava, H.; Makarov, Yu N.

    2015-11-01

    GaN layers of n-type and p-type conductivity grown by HVPE on sapphire substrates were used as working electrodes for water electrolysis, photoelectrolysis and hydrogen gas generation. Specifically the water splitting process is discussed. Corrosion of the GaN materials is also considered. The hydrogen production rate under 365-nm UV LED irradiation of the GaN and external bias was 0.3 ml/(cm2*h) for an n-GaN photoanode (n∼8×1016 cm-3) in 1M Na2SO4 electrolyte and 1.2 ml/(cm2*h) for an n-GaN photoanode (n∼1×1017 cm-3) in 1M KOH electrolyte.

  16. Gate stack engineering for GaN lateral power transistors

    NASA Astrophysics Data System (ADS)

    Yang, Shu; Liu, Shenghou; Liu, Cheng; Hua, Mengyuan; Chen, Kevin J.

    2016-02-01

    Developing optimal gate-stack technology is a key to enhancing the reliability and performance of GaN insulated-gate devices for high-voltage power switching applications. In this paper, we discuss current challenges and review our recent progresses in gate-stack technology development toward high-performance and high-reliability GaN power devices, including (1) interface engineering that creates a high-quality dielectric/III-nitride interface with low trap density; (2) barrier-layer engineering that enables optimal trade-off between performance and stability; (3) bulk quality and reliability enhancement of the gate dielectric. These gate-stack techniques in terms of new process development and device structure design are valuable to realize highly reliable and competitive GaN power devices.

  17. Pulsed laser annealing of Be-implanted GaN

    SciTech Connect

    Wang, H.T.; Tan, L.S.; Chor, E.F.

    2005-11-01

    Postimplantation thermal processing of Be in molecular-beam-epitaxy-grown GaN by rapid thermal annealing (RTA) and pulsed laser annealing (PLA) was investigated. It has been found that the activation of Be dopants and the repair of implantation-induced defects in GaN films cannot be achieved efficiently by conventional RTA alone. On the other hand, good dopant activation and surface morphology and quality were obtained when the Be-implanted GaN film was annealed by PLA with a 248 nm KrF excimer laser. However, observations of off-resonant micro-Raman and high-resolution x-ray-diffraction spectra indicated that crystal defects and strain resulting from Be implantation were still existent after PLA, which probably degraded the carrier mobility and limited the activation efficiency to some extent. This can be attributed to the shallow penetration depth of the 248 nm laser in GaN, which only repaired the crystal defects in a thin near-surface layer, while the deeper defects were not annealed out well. This situation was significantly improved when the Be-implanted GaN was subjected to a combined process of PLA followed by RTA, which produced good activation of the dopants, good surface morphology, and repaired bulk and surface defects well.

  18. Pulsed laser annealing of Be-implanted GaN

    NASA Astrophysics Data System (ADS)

    Wang, H. T.; Tan, L. S.; Chor, E. F.

    2005-11-01

    Postimplantation thermal processing of Be in molecular-beam-epitaxy-grown GaN by rapid thermal annealing (RTA) and pulsed laser annealing (PLA) was investigated. It has been found that the activation of Be dopants and the repair of implantation-induced defects in GaN films cannot be achieved efficiently by conventional RTA alone. On the other hand, good dopant activation and surface morphology and quality were obtained when the Be-implanted GaN film was annealed by PLA with a 248 nm KrF excimer laser. However, observations of off-resonant micro-Raman and high-resolution x-ray-diffraction spectra indicated that crystal defects and strain resulting from Be implantation were still existent after PLA, which probably degraded the carrier mobility and limited the activation efficiency to some extent. This can be attributed to the shallow penetration depth of the 248 nm laser in GaN, which only repaired the crystal defects in a thin near-surface layer, while the deeper defects were not annealed out well. This situation was significantly improved when the Be-implanted GaN was subjected to a combined process of PLA followed by RTA, which produced good activation of the dopants, good surface morphology, and repaired bulk and surface defects well.

  19. Terahertz study of m-plane GaN thin fims

    NASA Astrophysics Data System (ADS)

    Quadir, Shaham; Jang, Der-Jun; Lin, Ching-Liang; Lo, Ikai

    2014-03-01

    We investigate the optical properties of m-plane GaN thin films using the terahertz time domain spectroscopy. The m-plane GaN thin films were grown on γ-LiAlO2 substrates with buffer layers of low temperature grown GaN. The thin films were illuminated with terahertz radiation generated by a LT-GaAs antenna and the transmitted signal was detected by a ZnTe crystal. The polarization of the terahertz wave was chosen to be either parallel or perpendicular to the GaN [0001] direction. We compared the transmitted signals of the m-plane GaN thin films to that of the LAO substrate. The samples as well as the LAO substrate exhibited polarization dependence of absorption in terahertz spectrum. The carrier densities and the mobilities were derived from the transmittance of the THz wave using extended Drude model. We found, in all samples, both the carrier densities and mobilities along the GaN [0001] direction were smaller than those along the GaN [1120] direction due to the stripe formation along the GaN [1120].

  20. Viability and proliferation of endothelial cells upon exposure to GaN nanoparticles

    PubMed Central

    Braniste, Tudor; Tiginyanu, Ion; Horvath, Tibor; Raevschi, Simion; Cebotari, Serghei; Lux, Marco; Haverich, Axel

    2016-01-01

    Summary Nanotechnology is a rapidly growing and promising field of interest in medicine; however, nanoparticle–cell interactions are not yet fully understood. The goal of this work was to examine the interaction between endothelial cells and gallium nitride (GaN) semiconductor nanoparticles. Cellular viability, adhesion, proliferation, and uptake of nanoparticles by endothelial cells were investigated. The effect of free GaN nanoparticles versus the effect of growing endothelial cells on GaN functionalized surfaces was examined. To functionalize surfaces with GaN, GaN nanoparticles were synthesized on a sacrificial layer of zinc oxide (ZnO) nanoparticles using hydride vapor phase epitaxy. The uptake of GaN nanoparticles by porcine endothelial cells was strongly dependent upon whether they were fixed to the substrate surface or free floating in the medium. The endothelial cells grown on surfaces functionalized with GaN nanoparticles demonstrated excellent adhesion and proliferation, suggesting good biocompatibility of the nanostructured GaN. PMID:27826507

  1. Nucleation conditions for catalyst-free GaN nanowires

    NASA Astrophysics Data System (ADS)

    Bertness, K. A.; Roshko, A.; Mansfield, L. M.; Harvey, T. E.; Sanford, N. A.

    2007-03-01

    We have examined the initial steps for catalyst-free growth of GaN nanowires by molecular beam epitaxy (MBE) on Si (1 1 1) substrates using AlN buffer layers. These wires form spontaneously under high N-to-Ga ratios for a growth temperature range of about 810-830 °C. Field emission scanning electron microscopy (FESEM) shows that part of the GaN forms a "matrix layer" that also grows with the [0 0 0 1] direction perpendicular to the substrate surface. This layer contains small, dense hexagonal pits in which the nanowires nucleate. Using both FESEM and atomic force microscopy (AFM), we identify the pit facets as {1 0 1¯ 2} planes. The nucleation studies show that the use of an AlN buffer layer is essential to the regular formation of the nanowires and matrix layers under our growth conditions. Our typical AlN buffer layer is 40-50 nm thick. We conclude that the nucleation mechanism for nanowires includes formation of nanocolumns in the AlN buffer layer. The propagation of the nanowires in GaN growth appears to be driven by differences in growth rates among crystallographic planes under N-rich conditions.

  2. The process and mechanism of the GaN nanoparticles formed by nitridation of β-Ga2O3 crystal

    NASA Astrophysics Data System (ADS)

    Cui, Xiao-Jun; Wang, Liang-Ling

    2017-04-01

    The process of conversion from β-Ga2O3 single crystal to gallium nitride (GaN) in an atmosphere of NH3 by chemical vapor deposition is investigated. The surface morphology and microstructure of the GaN nanoparticles are observed by scanning electron microscope, which indicates that the growth of GaN is via the Volmer-Weber mechanism. The β-Ga2O3 is firstly evaporated at high temperature to form the porous layer, followed by the surface-defect induced GaN nucleation formation. The crystalline structure and epitaxial relationship of the GaN nanoparticles are investigated by X-ray diffraction (XRD) via ω-2𝜃, showing GaN (0002) and (0004) diffraction peaks in the XRD spectra. It is concluded that the polycrystalline GaN film with hexagonal structure has a strong c-axis preferential orientation.

  3. Realization of compressively strained GaN films grown on Si(110) substrates by inserting a thin AlN/GaN superlattice interlayer

    SciTech Connect

    Shen, X. Q.; Takahashi, T.; Kawashima, H.; Ide, T.; Shimizu, M.

    2012-07-16

    We investigate the strain properties of GaN films grown by plasma-assisted molecular beam epitaxy on Si(110) substrates. It is found that the strain of the GaN film can be converted from a tensile to a compressive state simply by inserting a thin AlN/GaN superlattice structure (SLs) within the GaN film. The GaN layers seperated by the SLs can have different strain states, which indicates that the SLs plays a key role in the strain modulation during the growth and the cooling down processes. Using this simple technique, we grow a crack-free GaN film exceeding 2-{mu}m-thick. The realization of the compressively strained GaN film makes it possible to grow thick GaN films without crack generation on Si substrates for optic and electronic device applications.

  4. Annealing effects on polycrystalline GaN using nitrogen and ammonia ambients

    NASA Astrophysics Data System (ADS)

    Ariff, A.; Zainal, N.; Hassan, Z.

    2016-09-01

    This paper describes effects of using post-annealing treatment in different conditions on the properties of polycrystalline GaN layer grown on m-plane sapphire substrate by electron beam (e-beam) evaporator. Without annealing, GaN surface was found to have a low RMS roughness with agglomeration of GaN grains in a specific direction and the sample consisted of gallium oxide (Ga2O3) material. When the post-annealing treatment was carried out in N2 ambient at 650 °C, initial re-crystallization of the GaN grains was observed while the evidence of Ga2O3 almost disappeared. As the NH3 annealing was conducted at 950 °C, more effect of re-crystallization occurred but with less grains coalescence. Three dominant XRD peaks of GaN in (10 1 bar 0) , (0002) and (10 1 bar 1) orientations were evident. Near band edge (NBE) related emission in GaN was also observed. The significant improvement was attributed to simultaneous recrystallization and effective reduction of N deficiency density. The post-annealing in a mixture of N2 and NH3 ambient at 950 °C was also conducted, but has limited the effectiveness of the N atoms to incorporate on the GaN layer due to 'clouding' effect by the inert N2 gas. Further increase in the annealing temperature at 980 °C and 1100 °C, respectively caused severe deteriorations of the structural and optical properties of the GaN layer. Overall, this work demonstrated initial potential in improving polycrystalline GaN material in simple and inexpensive manner.

  5. A new approach to epitaxially grow high-quality GaN films on Si substrates: the combination of MBE and PLD

    PubMed Central

    Wang, Wenliang; Wang, Haiyan; Yang, Weijia; Zhu, Yunnong; Li, Guoqiang

    2016-01-01

    High-quality GaN epitaxial films have been grown on Si substrates with Al buffer layer by the combination of molecular beam epitaxy (MBE) and pulsed laser deposition (PLD) technologies. MBE is used to grow Al buffer layer at first, and then PLD is deployed to grow GaN epitaxial films on the Al buffer layer. The surface morphology, crystalline quality, and interfacial property of as-grown GaN epitaxial films on Si substrates are studied systematically. The as-grown ~300 nm-thick GaN epitaxial films grown at 850 °C with ~30 nm-thick Al buffer layer on Si substrates show high crystalline quality with the full-width at half-maximum (FWHM) for GaN(0002) and GaN(102) X-ray rocking curves of 0.45° and 0.61°, respectively; very flat GaN surface with the root-mean-square surface roughness of 2.5 nm; as well as the sharp and abrupt GaN/AlGaN/Al/Si hetero-interfaces. Furthermore, the corresponding growth mechanism of GaN epitaxial films grown on Si substrates with Al buffer layer by the combination of MBE and PLD is hence studied in depth. This work provides a novel and simple approach for the epitaxial growth of high-quality GaN epitaxial films on Si substrates. PMID:27101930

  6. Stress and Defect Control in GaN Using Low Temperature Interlayers

    SciTech Connect

    Akasaki, I.; Amano, H.; Chason, E.; Figiel, J.; Floro, J.A.; Han, J.; Hearne, S.; Iwaya, M.; Kashima, T.; Katsuragcawa, M.

    1998-12-04

    In organometallic vapor phase epitaxial growth of Gail on sapphire, the role of the low- temperature-deposited interlayers inserted between high-temperature-grown GaN layers was investigated by in situ stress measurement, X-ray diffraction, and transmission electron microscopy. Insertion of a series of low temperature GaN interlayers reduces the density of threading dislocations while simultaneously increasing the tensile stress during growth, ultimately resulting in cracking of the GaN film. Low temperature AIN interlayers were found to be effective in suppressing cracking by reducing tensile stress. The intedayer approach permits tailoring of the film stress to optimize film structure and properties.

  7. Nanopatterned epitaxy of non-polar Ga1-yInyN layers with caps and voids

    NASA Astrophysics Data System (ADS)

    Bross, Adam S.; Durniak, Mark T.; Elsaesser, David R.; Wetzel, Christian

    2017-09-01

    Low-defect density non-polar a-plane Ga1-yInyN layers on r-plane sapphire substrates are reported by implementing self-assembling nanopatterning in metalorganic vapor phase epitaxy. Nanopillar capping and void formation in regrowth lead to a 90% defect reduction. An ex-situ Ni layer transforms into a nanoisland etch mask to pattern GaN templates. a-Plane GaN and Ga1-yInyN layers with an InN content in the range of y = 0.04-0.11 are then regrown. Both exhibit a low density of basal-plane stacking faults of (4.6 ± 1.3) × 104 cm-1 by transmission electron microscopy analysis. Growth parameters and the template pattern are discussed by help of an X-ray rocking curve analysis. We find pattern the fill factor and V/III ratio to dominate the defect reduction. Resulting layers should enable efficient long-wavelength light-emitting and solar cell devices.

  8. Surface potential barrier in m-plane GaN studied by contactless electroreflectance

    NASA Astrophysics Data System (ADS)

    Janicki, Lukasz; Misiewicz, Jan; Cywiński, Grzegorz; Sawicka, Marta; Skierbiszewski, Czeslaw; Kudrawiec, Robert

    2016-02-01

    Contactless electroreflectance (CER) is used to study the surface potential barrier in m-plane GaN UN+ [GaN (d = 20,30,50,70 nm)/GaN:Si] structures grown by using molecular beam epitaxy. Clear bandgap-related transitions followed by Franz-Keldysh oscillations (FKO) have been observed in the CER spectra of all samples at room temperature. The built-in electric fields in the undoped cap layers have been determined from the FKO period. From the built-in electric field and the undoped GaN layer thickness, the Fermi level location at the air-exposed m-plane GaN surface has been estimated as 0.42 ± 0.05 eV below the conduction band.

  9. Traveling Wave Modes of a Plane Layered Anelastic Earth

    DTIC Science & Technology

    2016-05-20

    Theo- retical seismology , Wave propagation 1 Distribution Statement A: Approved for public release; distribution is unlimited Accepted for publication...Quantitative Seismology , Theory and Methods, Vol I San Fran- cisco: W.H. Freeman and Company. Apsel, R.J. and J.E. Luco, 1983. On the Green’s function for a

  10. Travelling wave modes of a plane layered anelastic earth

    NASA Astrophysics Data System (ADS)

    Odom, Robert I.

    2016-08-01

    Incorporation of attenuation into the normal mode sum representations of seismic signals is commonly effected by applying perturbation theory. This is fine for weak attenuation, but problematic for stronger attenuation. In this work, modes of the anelastic medium are represented as complex superpositions of elastic eigenfunctions. For the P-SV system, a generalized eigenvalue equation for the complex eigenwavenumbers and complex coefficients used to construct the anelastic eigenfunctions is derived. The generalized eigenvalue problem for the P-SV problem is exactly linear in the eigenwavenumber at the expense of doubling the dimension. The SH problem is exactly linear in the square of the eigenwavenumber. This is in contrast to a similar standing wave problem for the earth free oscillations. Attenuation is commonly incorporated into synthetic seismogram calculations by introduction of complex frequency-dependent elastic moduli. The moduli depend nonlinearly on the frequency. The independent variable in the standing wave free oscillation problem is the frequency, which makes the eigenvalue problem nonlinear. The choice of the wavenumber as the independent variable for the travelling wave problem leads to a linear problem. The Earth model may be transversely isotropic. Compressional waves and both polarizations of shear waves (SV, SH) are treated.

  11. Preparation of Freestanding GaN Wafers by Hydride Vapor Phase Epitaxy with Void-Assisted Separation

    NASA Astrophysics Data System (ADS)

    Oshima, Yuichi; Eri, Takeshi; Shibata, Masatomo; Sunakawa, Haruo; Kobayashi, Kenji; Ichihashi, Toshinari; Usui, Akira

    2003-01-01

    We have developed a novel technique for preparing large-scale freestanding GaN wafers. Hydride vapor phase epitaxy (HVPE) growth of thick GaN layer was performed on a GaN template with a thin TiN film on the top. After the cooling process of the HVPE growth, the thick GaN layer was easily separated from the template by the assistance of many voids generated around the TiN film. As a result, a freestanding GaN wafer was obtained. The wafer obtained had a diameter of 45 mm, and a mirror-like surface. The-full-width-at-half-maximum (FWHM) of (0002) and (10\\bar{1}0) peaks in the X-ray rocking curve profile were 60 and 92 arcsec, respectively. The dislocation density was evaluated at 5× 106 cm-3 by etch pit density measurement.

  12. Influence of GaN column diameter on structural properties for InGaN nanocolumns grown on top of GaN nanocolumns

    NASA Astrophysics Data System (ADS)

    Oto, Takao; Mizuno, Yutaro; Yanagihara, Ai; Miyagawa, Rin; Kano, Tatsuya; Yoshida, Jun; Sakakibara, Naoki; Kishino, Katsumi

    2016-11-01

    The influence of GaN column diameter DGaN on structural properties was systematically investigated for InGaN nanocolumns (NCs) grown on top of GaN NCs. We demonstrated a large critical layer thickness of above 400 nm for In0.3Ga0.7N/GaN NCs. The structural properties were changed at the boundary of DGaN=D0 (˜120 nm). Homogeneous InGaN NCs grew axially on the GaN NCs with DGaN≤D0, while InGaN-InGaN core-shell structures were spontaneously formed on the GaN NCs with DGaN>D0. These results can be explained by a growth system that minimizes the total strain energy of the NCs.

  13. Optical and structural properties of GaN nanopillar and nanostripe arrays with embedded InGaN /GaN multi-quantum wells

    NASA Astrophysics Data System (ADS)

    Keller, S.; Schaake, C.; Fichtenbaum, N. A.; Neufeld, C. J.; Wu, Y.; McGroddy, K.; David, A.; DenBaars, S. P.; Weisbuch, C.; Speck, J. S.; Mishra, U. K.

    2006-09-01

    GaN nanopillar and nanostripe arrays with embedded InGaN /GaN multi-quantum wells (MQWs) were fabricated by holographic lithography and subsequent reactive ion etching. Etch related damage of the nanostructures was successfully healed through annealing in NH3/N2 mixtures under optimized conditions. The nanopatterned samples exhibited enhanced luminescence in comparison to the planar wafers. X-ray reciprocal space maps recorded around the asymmetric (101¯5) reflection revealed that the MQWs in both nanopillars and nanostripes relaxed after nanopatterning and adopted a larger in-plane lattice constant than the underlying GaN layer. The pillar relaxation process had no measurable effect on the Stokes shift typically observed in MQWs on c-plane GaN, as evaluated by excitation power dependent photoluminescence (PL) measurements. Angular-resolved PL measurements revealed the extraction of guided modes from the nanopillar arrays.

  14. Size dictated thermal conductivity of GaN

    SciTech Connect

    Thomas Edwin Beechem; McDonald, Anthony E.; Fuller, Elliot James; Talin, Albert Alec; Rost, Christina M.; Maria, Jon -Paul; Gaskins, John T.; Hopkins, Patrick E.; Allerman, Andrew A.

    2016-04-01

    The thermal conductivity on n- and p-type doped gallium nitride (GaN) epilayers having thickness of 3-4 μm was investigated using time domain thermoreflectance (TDTR). Despite possessing carrier concentrations ranging across 3 decades (1015 – 1018 cm–3), n-type layers exhibit a nearly constant thermal conductivity of 180 W/mK. The thermal conductivity of p-type epilayers, in contrast, reduces from 160 to 110 W/mK with increased doping. These trends–and their overall reduction relative to bulk–are explained leveraging established scattering models where it is shown that size effects play a primary role in limiting thermal conductivity for layers even tens of microns thick. GaN device layers, even of pristine quality, will therefore exhibit thermal conductivities less than the bulk value of 240 W/mK owing to their finite thickness.

  15. Microstructures of GaN and In{sub x}Ga{sub 1-x}N films grown by MOCVD on free-standing GaN templates

    SciTech Connect

    Jasinski, J.; Liliental-Weber, Z.; Huang, D.; Reshchikov, M.A.; Yun, F.; Morkoc, H.; Sone, C.; Park, S.S.; Lee, K.Y.

    2002-04-30

    We summarize structural properties of thick HVPE GaN templates from the point of view of their application as substrates for growth of nitride layers. This is followed by the results of optical and structural studies, mostly transmission electron microscopy, of nitride layers grown by MOCVD on top of the HVPE substrates. The results indicate high structural quality of these layers with a low density of threading dislocations (in the range of 10{sup 6} cm{sup -2}). Convergent beam electron diffraction studies showed that the MOCVD GaN films have Ga-polarity, the same polarity as the HVPE GaN substrates. Structural studies of an InGaN layer grown on top of the MOCVD GaN film showed the presence of two layers, which differed in lattice parameter and composition. The upper layer, on the top of the structure had a c-lattice parameter about 2% larger than that of GaN and contained 10.3 {+-} 0.8% of In. Values measured for the thinner, intermediate layer adjacent to the GaN layer were about 2 .5 times lower.

  16. Non-destructive assessment of the polarity of GaN nanowire ensembles using low-energy electron diffraction and x-ray photoelectron diffraction

    NASA Astrophysics Data System (ADS)

    Romanyuk, O.; Fernández-Garrido, S.; Jiříček, P.; Bartoš, I.; Geelhaar, L.; Brandt, O.; Paskova, T.

    2015-01-01

    We investigate GaN nanowire ensembles spontaneously formed in plasma-assisted molecular beam epitaxy by non-destructive low-energy electron diffraction (LEED) and x-ray photoelectron diffraction (XPD). We show that GaN nanowire ensembles prepared on AlN-buffered 6 H-SiC ( 000 1 ¯ ) substrates with well-defined N polarity exhibit similar LEED intensity-voltage curves and angular distribution of photo-emitted electrons as N-polar free-standing GaN layers. Therefore, as in the case of GaN layers, LEED and XPD are found to be suitable techniques to assess the polarity of GaN nanowire ensembles on a macroscopic scale. The analysis of GaN nanowire ensembles prepared on bare Si(111) allows us to conclude that, on this non-polar substrate, the majority of nanowires is also N-polar.

  17. Formation of distinctive structures of GaN by inductively-coupled-plasma and reactive ion etching under optimized chemical etching conditions

    NASA Astrophysics Data System (ADS)

    Okada, N.; Nojima, K.; Ishibashi, N.; Nagatoshi, K.; Itagaki, N.; Inomoto, R.; Motoyama, S.; Kobayashi, T.; Tadatomo, K.

    2017-06-01

    We focused on inductively coupled plasma and reactive ion etching (ICP-RIE) for etching GaN and tried to fabricate distinctive GaN structures under optimized chemical etching conditions. To determine the optimum chemical etching conditions, the flow rates of Ar and Cl2, ICP power, and chamber pressure were varied in the etching of c-plane GaN layers with stripe patterns. It was determined that the combination of Ar and Cl2 flow rates of 100 sccm, chamber pressure of 7 Pa, and ICP power of 800 W resulted in the most enhanced reaction, yielding distinctive GaN structures such as pillars with inverted mesa structures for c-plane GaN and a semipolar GaN layer with asymmetric inclined sidewalls. The selectivity and etching rate were also investigated.

  18. Non-destructive assessment of the polarity of GaN nanowire ensembles using low-energy electron diffraction and x-ray photoelectron diffraction

    SciTech Connect

    Romanyuk, O. Jiříček, P.; Bartoš, I.; Fernández-Garrido, S.; Geelhaar, L.; Brandt, O.; Paskova, T.

    2015-01-12

    We investigate GaN nanowire ensembles spontaneously formed in plasma-assisted molecular beam epitaxy by non-destructive low-energy electron diffraction (LEED) and x-ray photoelectron diffraction (XPD). We show that GaN nanowire ensembles prepared on AlN-buffered 6H-SiC(0001{sup ¯}) substrates with well-defined N polarity exhibit similar LEED intensity-voltage curves and angular distribution of photo-emitted electrons as N-polar free-standing GaN layers. Therefore, as in the case of GaN layers, LEED and XPD are found to be suitable techniques to assess the polarity of GaN nanowire ensembles on a macroscopic scale. The analysis of GaN nanowire ensembles prepared on bare Si(111) allows us to conclude that, on this non-polar substrate, the majority of nanowires is also N-polar.

  19. GaN MOSHEMT employing HfO2 as a gate dielectric with partially etched barrier

    NASA Astrophysics Data System (ADS)

    Han, Kefeng; Zhu, Lin

    2017-09-01

    In order to suppress the gate leakage current of a GaN high electron mobility transistor (GaN HEMT), a GaN metal-oxide-semiconductor high electron mobility transistor (MOSHEMT) is proposed, in which a metal-oxide-semiconductor gate with high-dielectric-constant HfO2 as an insulating dielectric is employed to replace the traditional GaN HEMT Schottky gate. A 0.5 μm gate length GaN MOSHEMT was fabricated based on the proposed structure, the {{{Al}}}0.28{{{Ga}}}0.72{{N}} barrier layer is partially etched to produce a higher transconductance without deteriorating the transport characteristics of the two-dimensional electron gas in the channel, the gate dielectric is HfO2 deposited by atomic layer deposition. Current-voltage characteristics and radio frequency characteristics are obtained after device preparation, the maximum current density of the device is 900 mA mm-1, the source-drain breakdown voltage is 75 V, gate current is significantly suppressed and the forward gate voltage swing range is about ten times higher than traditional GaN HEMTs, the GaN MOSHEMT also demonstrates radio frequency characteristics comparable to traditional GaN HEMTs with the same gate length.

  20. GaN quantum dot polarity determination by X-ray photoelectron diffraction

    NASA Astrophysics Data System (ADS)

    Romanyuk, O.; Bartoš, I.; Brault, J.; Mierry, P. De; Paskova, T.; Jiříček, P.

    2016-12-01

    Growth of GaN quantum dots (QDs) on polar and semipolar GaN substrates is a promising technology for efficient nitride-based light emitting diodes (LED). The QDs crystal orientation typically repeats the polarity of the substrate. In case of non-polar or semipolar substrates, the polarity of QDs is not obvious. In this article, the polarity of GaN QDs and of underlying layers was investigated nondestructively by X-ray photoelectron diffraction (XPD). Polar and semipolar GaN/Al0.5Ga0.5N heterostructures were grown on the sapphire substrates with (0001) and (1 1 bar 00) orientations by molecular beam epitaxy (MBE). Polar angle dependence of N 1s core-level photoelectron intensities were measured from GaN QDs and compared with the corresponding experimental curves from free-standing GaN crystals. It is confirmed experimentally, that the crystalline orientation of polar (0001) GaN QDs follows the orientation of the (0001) sapphire substrate. In case of semipolar GaN QDs grown on (1 1 bar 00) sapphire substrate, the (11 2 bar 2) polarity of QDs was determined.

  1. Air-bridged lateral epitaxial overgrowth of GaN thin films

    NASA Astrophysics Data System (ADS)

    Kidoguchi, Isao; Ishibashi, Akihiko; Sugahara, Gaku; Ban, Yuzaburoh

    2000-06-01

    A promising technique of selective lateral epitaxy, namely air-bridged lateral epitaxial overgrowth, is demonstrated in order to reduce the wing tilt as well as the threading dislocation density in GaN thin films. A seed GaN layer was etched to make ridge-stripe along <11¯00>GaN direction and a GaN material was regrown from the exposed (0001) top facet of the ridged GaN seed structures, whose sidewalls and etched bottoms were covered with silicon nitride mask, using low-pressure metalorganic vapor phase epitaxy. The density of dislocations in the wing region was reduced to be <107cm-2, which was at least two orders of magnitude lower than that of underlying GaN. The magnitude of the wing tilt was determined to be 0.08° by x-ray diffraction (XRD) measurements, which was smaller than other lateral epitaxial overgrown GaN thin films. The full width at half maximum of XRD for the wing region was 138 arc sec, indicating high uniformity of c-axis orientation.

  2. Anisotropic strain and phonon deformation potentials in GaN

    SciTech Connect

    Darakchieva, V.; Arwin, H.; Paskov, P. P.; Monemar, B.; Paskova, T.; Hommel, D.; Schubert, M.; Heuken, M.; Off, J.; Scholz, F.; Haskell, B. A.; Fini, P. T.; Speck, J. S.; Nakamura, S.

    2007-05-15

    We report optical phonon frequency studies in anisotropically strained c-plane- and a-plane-oriented GaN films by generalized infrared spectroscopic ellipsometry and Raman scattering spectroscopy. The anisotropic strain in the films is obtained from high-resolution x-ray diffraction measurements. Experimental evidence for splitting of the GaN E{sub 1}(TO), E{sub 1}(LO), and E{sub 2} phonons under anisotropic strain in the basal plane is presented, and their phonon deformation potentials c{sub E{sub 1}}{sub (TO)}, c{sub E{sub 1}}{sub (LO)}, and c{sub E{sub 2}} are determined. A distinct correlation between anisotropic strain and the A{sub 1}(TO) and E{sub 1}(LO) frequencies of a-plane GaN films reveals the a{sub A{sub 1}}{sub (TO)}, b{sub A{sub 1}}{sub (TO)}, a{sub E{sub 1}}{sub (LO)}, and b{sub E{sub 1}}{sub (LO)} phonon deformation potentials. The a{sub A{sub 1}}{sub (TO)} and b{sub A{sub 1}}{sub (TO)} are found to be in very good agreement with previous results from Raman experiments [V. Yu. Davydov et al., J. Appl. Phys. 82, 5097 (1997)]. Our a{sub A{sub 1}}{sub (TO)} and a{sub E{sub 1}}{sub (LO)} phonon deformation potentials agree well with recently reported theoretical estimations [J.-M. Wagner and F. Bechstedt, Phys. Rev. B 66, 115202 (2002)], while b{sub A{sub 1}}{sub (TO)} and b{sub E{sub 1}}{sub (LO)} are found to be significantly larger than the theoretical values. A discussion of the observed differences is presented.

  3. Nitrogen-Polar (0001¯) GaN Grown on c-Plane Sapphire with a High-Temperature AlN Buffer

    PubMed Central

    Song, Jie; Han, Jung

    2017-01-01

    We demonstrate growing nitrogen-polar (N-polar) GaN epilayer on c-plane sapphire using a thin AlN buffer layer by metalorganic chemical vapor deposition. We have studied the influence of the AlN buffer layer on the polarity, crystalline quality, and surface morphology of the GaN epilayer and found that the growth temperature of the AlN buffer layer played a critical role in the growth of the GaN epilayer. The low growth temperature of the AlN buffer results in gallium-polar GaN. Even a nitridation process has been conducted. High growth temperature for an AlN buffer layer is required to achieve pure N-polarity, high crystalline quality, and smooth surface morphology for a GaN epilayer. PMID:28772612

  4. Understanding the pyramidal growth of GaN

    SciTech Connect

    Rouviere, J.L.; Arlery, M.; Bourret, A.

    1996-11-01

    By a combination of conventional, HREM and CBED TEM experiments the authors have studied wurtzite GaN layers grown by Metal-Organic Chemical Vapor Deposition (MOCVD) on (0001)Al{sub 2}O{sub 3}. They experimentally determine the structure of the macroscopic hexagonal pyramids that are visible at the surface of the layers when no optimized buffer is introduced. These pyramids look like hexagonal volcanoes with one hexagonal microscopic chimney (up to 75 nm wide) at their core. The crystal inside the chimney is a pure GaN crystal with a polarity opposed to the one of the neighboring material: the GaN layers grown on (0001)Al{sub 2}O{sub 3} are everywhere Ga-terminated except in the chimneys where they are N-terminated. Some of the N-terminated chimneys grow faster and form macroscopic hexagonal pyramids. Chimneys bounded by Inversion Domains Boundaries (IDBs) originate from steps at the surface of the substrate and may be suppressed by an adapted buffer layer.

  5. Anisotropically biaxial strain in non-polar (112-0) plane In x Ga1-x N/GaN layers investigated by X-ray reciprocal space mapping.

    PubMed

    Zhao, Guijuan; Li, Huijie; Wang, Lianshan; Meng, Yulin; Ji, Zesheng; Li, Fangzheng; Wei, Hongyuan; Yang, Shaoyan; Wang, Zhanguo

    2017-07-03

    In this study, the indium composition x as well as the anisotropically biaxial strain in non-polar a-plane In x Ga1-x N on GaN is studied by X-ray diffraction (XRD) analysis. In accordance with XRD reciprocal lattice space mapping, with increasing indium composition, the maximum of the In x Ga1-x N reciprocal lattice points progressively shifts from a fully compressive strained to a fully relaxed position, then to reversed tensile strained. To fully understand the strain in the ternary alloy layers, it is helpful to grow high-quality device structures using a-plane nitrides. As the layer thickness increases, the strain of In x Ga1-x N layer releases through surface roughening and the 3D growth-mode.

  6. The structure of sheared turbulence near a plane boundary

    NASA Technical Reports Server (NTRS)

    Lee, Moon J.; Hunt, J. C. R.

    1988-01-01

    An analysis is presented of how a plane boundary affects the structure of turbulence in a sheared free stream. A uniform-shear boundary layer (USBL) is formulated with slip velocity condition at the surface, and inhomogeneous rapid distortion theory is applied. The effects of blocking by the surface on the turbulence structure in USBL is compared with those in the shear-free boundary layer (SFBL). Shear produces highly anisotropic eddies elongated in the flow direction. The vertical velocity variance is reduced with shear at all heights, roughly in proportion to the reduction in the homogeneous value, but the shape of the profile remains unchanged only near the surface. The streamwise integral scales increase with shear, indicating elongation of the streamwise extent of eddies.

  7. Optical and structural characterisation of epitaxial nanoporous GaN grown by CVD.

    PubMed

    Mena, Josué; Carvajal, Joan J; Martínez, Oscar; Jiménez, Juan; Zubialevich, Vitaly Z; Parbrook, Peter J; Diaz, Francesc; Aguiló, Magdalena

    2017-09-15

    In this paper we study the optical properties of nanoporous gallium nitride (GaN) epitaxial layers grown by chemical vapour deposition on non-porous GaN substrates, using photoluminescence, cathodoluminescence, and resonant Raman scattering, and correlate them with the structural characteristic of these films. We pay special attention to the analysis of the residual strain of the layers and the influence of the porosity in the light extraction. The nanoporous GaN epitaxial layers are under tensile strain, although the strain is progressively reduced as the deposition time and the thickness of the porous layer increases, becoming nearly strain free for a thickness of 1.7 μm. The analysis of the experimental data point to the existence of vacancy complexes as the main source of the tensile strain.

  8. Optical and structural characterisation of epitaxial nanoporous GaN grown by CVD

    NASA Astrophysics Data System (ADS)

    Mena, Josué; Carvajal, Joan J.; Martínez, Oscar; Jiménez, Juan; Zubialevich, Vitaly Z.; Parbrook, Peter J.; Diaz, Francesc; Aguiló, Magdalena

    2017-09-01

    In this paper we study the optical properties of nanoporous gallium nitride (GaN) epitaxial layers grown by chemical vapour deposition on non-porous GaN substrates, using photoluminescence, cathodoluminescence, and resonant Raman scattering, and correlate them with the structural characteristic of these films. We pay special attention to the analysis of the residual strain of the layers and the influence of the porosity in the light extraction. The nanoporous GaN epitaxial layers are under tensile strain, although the strain is progressively reduced as the deposition time and the thickness of the porous layer increases, becoming nearly strain free for a thickness of 1.7 μm. The analysis of the experimental data point to the existence of vacancy complexes as the main source of the tensile strain.

  9. Si Complies with GaN to Overcome Thermal Mismatches for the Heteroepitaxy of Thick GaN on Si.

    PubMed

    Tanaka, Atsunori; Choi, Woojin; Chen, Renjie; Dayeh, Shadi A

    2017-08-21

    Heteroepitaxial growth of lattice mismatched materials has advanced through the epitaxy of thin coherently strained layers, the strain sharing in virtual and nanoscale substrates, and the growth of thick films with intermediate strain-relaxed buffer layers. However, the thermal mismatch is not completely resolved in highly mismatched systems such as in GaN-on-Si. Here, geometrical effects and surface faceting to dilate thermal stresses at the surface of selectively grown epitaxial GaN layers on Si are exploited. The growth of thick (19 µm), crack-free, and pure GaN layers on Si with the lowest threading dislocation density of 1.1 × 10(7) cm(-2) achieved to date in GaN-on-Si is demonstrated. With these advances, the first vertical GaN metal-insulator-semiconductor field-effect transistors on Si substrates with low leakage currents and high on/off ratios paving the way for a cost-effective high power device paradigm on an Si CMOS platform are demonstrated. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  10. Photoluminescence characterization of Mg implanted GaN

    SciTech Connect

    Ronning, C.; Hofsaess, H.; Stoetzler, A.; Deicher, M.; Carlson, E.P.; Hartlieb, P.J.; Gehrke, T.; Rajagopal, P.; Davis, R.F.

    2000-07-01

    Single crystalline (0001) gallium nitride layers, capped with a thin epitaxial aluminum nitride layer, were implanted with magnesium and subsequently annealed in vacuum to 1150--1300 C for 10--60 minutes. Photoluminescence (PL) measurements showed the typical donor acceptor pair (DAP) transition at 3.25 eV after annealing at high temperatures, which is related to optically active Mg acceptors in GaN. After annealing at 1300 C a high degree of optical activation of the implanted Mg atoms was reached in the case of low implantation doses. Electrical measurements, performed after removing the AlN-cap and the deposition of Pd/Au contacts, showed no p-type behavior of the GaN samples due to the compensation of the Mg acceptors with native n-type defects.

  11. Investigation of structural and optical properties of GaN on flat and porous silicon

    NASA Astrophysics Data System (ADS)

    Abud, Saleh H.; Selman, Abbas M.; Hassan, Z.

    2016-09-01

    In this work, gallium nitride (GaN) layers were successfully grown on Flat-Si and porous silicon (PSi) using a radio frequency-magnetron sputtering system. Field emission scanning electron microscopy and atomic force microscopy images showed that the grown film on Flat-Si had smoother surface, even though there were some cracks on it. Furthermore, the X-ray diffraction measurements showed that the peak intensity of all the grown layers on PSi was higher than that of the grown layer on Flat-Si. Our detailed observation showed that PSi is a promising substrate to obtain GaN films.

  12. Transparent, Flexible Piezoelectric Nanogenerator Based on GaN Membrane Using Electrochemical Lift-Off.

    PubMed

    Kang, Jin-Ho; Jeong, Dae Kyung; Ryu, Sang-Wan

    2017-03-29

    A transparent and flexible piezoelectric nanogenerator (TF PNG) is demonstrated based on a GaN membrane fabricated by electrochemical lift-off. Under shear stress on the TF PNG by finger force (∼182 mN), the GaN membrane effectively undergoes normal stress and generates piezoelectric polarization along the c-axis, resulting in the generation of piezoelectric output from the TF PNG. Although the GaN layer is 315 times thinner than the flexible polyethylene terephthalate (PET) substrate, the low Young's modulus of PET allows the GaN membranes to absorb ∼41% of the applied strain energy, which leads to their large lattice deformation under extremely low applied stress. Maximum output voltage and current values of 4.2 V and 150 nA are obtained, and the time decay of the output voltage is discussed.

  13. High-resistance GaN epilayers with low dislocation density via growth mode modification

    NASA Astrophysics Data System (ADS)

    Xu, Z. Y.; Xu, F. J.; Wang, J. M.; Lu, L.; Yang, Z. J.; Wang, X. Q.; Shen, B.

    2016-09-01

    High-resistance GaN with low dislocation density adopting growth mode modification has been investigated by metalorganic chemical vapor deposition. The sheet resistance of the order of 1016 Ω/sq has been achieved at room temperature by diminishing the oxygen impurity level close to the substrate with an AlN blocking layer. Attributed to this method which offers more freedom to tailor the growth mode, a three-dimensional (3D) growth process is introduced by adjusting the growth pressure and temperature at the initial stage of the GaN epitaxy to improve the crystalline quality. The large 3D GaN grains formed during this period roughen the surface, and the following coalescence of the GaN grains causes threading dislocations bending, which finally remarkably reduces the dislocation density.

  14. Hybrid device based on GaN nanoneedles and MEH-PPV/PEDOT:PSS polymer

    SciTech Connect

    Shin, Min Jeong; Gwon, Dong-Oh; Lee, Chan-Mi; Lee, Gang Seok; Jeon, In-Jun; Ahn, Hyung Soo; Yi, Sam Nyung; Ha, Dong Han

    2015-08-15

    Highlights: • A hybrid device was demonstrated by using MEH-PPV, PEDOT:PSS, and GaN nanoneedles. • I–V curve of the hybrid device showed its rectification behaviour, similar to a diode. • EL peak originated by the different potential barriers at MEH-PPV and GaN interface. - Abstract: A hybrid device that combines the properties of organic and inorganic semiconductors was fabricated and studied. It incorporated poly[2-methoxy-5-(2-ethylhexyloxy)- 1,4-phenylenevinylene] (MEH-PPV) and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) as organic polymers and GaN nanoneedles as an inorganic semiconductor. Layers of the two polymers were spin coated on to the GaN nanoneedles. The one peak in the electroluminescence spectrum originated from the MEH-PPV layer owing to the different potential barriers of electrons and holes at its interface with the GaN nanoneedles. However, the photoluminescence spectrum showed peaks due to both GaN nanoneedles and MEH-PPV. Such hybrid structures, suitably developed, might be able to improve the efficiency of optoelectronic devices.

  15. Structural, electronic and magnetic properties of Ti-doped polar and nonpolar GaN surfaces

    NASA Astrophysics Data System (ADS)

    Mendoza-Estrada, Victor; González-García, Alvaro; López-Pérez, William; Pinilla, Carlos; González-Hernández, Rafael

    2017-06-01

    Based on density functional theory, first-principles calculations were performed in order to study the titanium incorporation on polar and nonpolar GaN surfaces. The formation energy calculations indicate that Ti impurity atoms prefer to incorporate in surface layers (first and second) of GaN. It is also concluded that the incorporation of Ti atoms in Ga-substitutional sites are more energetically favorable compared with N-substitutional or interstitial sites on the polar and nonpolar GaN surfaces. For Ti-rich growth conditions, formation energy calculations show the formation of TixN layers on the a and c GaN surfaces, which corroborates recent experimental observations. Results also display that the 3d-Ti states are the responsible for the metallization of the surface on the c and m planes, forming an intermetallic alloy (TixN), which could be used as low-resistance ohmic contacts for GaN. In addition, the magnetic properties with Ti doping show magnetization of about 1.0 μB /Ti atom for the nonpolar GaN surfaces.

  16. Correlation between macroscopic transport parameters and microscopic electrical properties in GaN

    NASA Astrophysics Data System (ADS)

    Witte, H.; Krtschil, A.; Schrenk, E.; Fluegge, K.; Dadgar, A.; Krost, A.

    2005-02-01

    In GaN layers grown by metal-organic vapor phase epitaxy on sapphire substrates the temperature-dependent Hall (TDH) and photo-Hall-effect (PHE) measurements show essential differences between undoped and Si-doped GaN. In undoped GaN the maximum of the Hall mobility occurs at temperatures near 300K with a low value. In PHE, an illumination introduces an enhancement of the mobility and a decrease of the electron density. In contrast, in Si-doped GaN the maximum Hall mobility is higher by a factor of 10 and is observed at temperatures between 100 and 180K. The photoinduced changes in the mobility and electron density are only marginal. Intensity dependent PHE measurements suggest the existence of internal potential barriers caused by inhomogeneities in the undoped samples. These results are combined with the surface-potential roughness on a microscale, as determined by scanning surface-potential microscopy (SSPM). In SSPM the undoped layers show strong potential fluctuations while they are lower for the Si-doped GaN samples. A correlation among the rms roughness of the surface potential, the maximum Hall mobility in TDH, and the maximum changes of the photo-Hall mobility is observed. In undoped GaN the mobility seems to be determined by the scattering at inner potential barriers stemming from structural inhomogeneities.

  17. A New Method to Modify Two-Dimensional Electron Gas Density by GaN Cap Etching

    NASA Astrophysics Data System (ADS)

    Li, Zhongda; Chow, T. Paul

    2013-08-01

    We have experimentally demonstrated a new method for modifying the two-dimensional electron density (2DEG) at the AlGaN/GaN interface by etching of the GaN cap layer on top of the AlGaN. GaN MOS capacitors have been fabricated on samples with partially or fully etched GaN cap, and the 2DEG density has been extracted. The results show a linear relation between the 2DEG density and the thickness of the GaN cap being etched. We have also fabricated van der Pauw structures and obtained the 2DEG density using Hall measurements, and the results are consistent with that from the GaN MOS capacitors.

  18. The depth-profiled carrier concentration and scattering mechanism in undoped GaN film grown on sapphire

    NASA Astrophysics Data System (ADS)

    Huang, Y.; Chen, X. D.; Fung, S.; Beling, C. D.; Ling, C. C.; Wei, Z. F.; Xu, S. J.; Zhi, C. Y.

    2004-07-01

    Temperature-dependent Hall (TDH) measurements and confocal micro-Raman spectroscopy have been used to study the free carrier spatial distribution and scattering mechanism in unintentionally doped GaN film grown on the sapphire substrate with the method of metalorganic chemical vapor deposition. Both the TDH data and the depth-profiled Raman spectra agreed with the existence of a nonuniform spatial distribution of free carriers in the GaN film with a highly conductive layer of ˜1 μm thickness near the GaN sapphire boundary. With the consideration of this parallel conduction channel adjacent to GaN sapphire boundary, detailed analysis of the TDH mobility data suggests that a relatively high concentration of nitrogen vacancies exists and nitrogen vacancy scattering has an important influence on limiting the electron mobility in the bulk film of the present GaN sample.

  19. Crystallographically tilted and partially strain relaxed GaN grown on inclined {111} facets etched on Si(100) substrate

    NASA Astrophysics Data System (ADS)

    Ansah Antwi, K. K.; Soh, C. B.; Wee, Q.; Tan, Rayson J. N.; Yang, P.; Tan, H. R.; Sun, L. F.; Shen, Z. X.; Chua, S. J.

    2013-12-01

    High resolution X-ray diffractometry (HR-XRD), Photoluminescence, Raman spectroscopy, and Transmission electron microscope measurements are reported for GaN deposited on a conventional Si(111) substrate and on the {111} facets etched on a Si(100) substrate. HR-XRD reciprocal space mappings showed that the GaN(0002) plane is tilted by about 0.63° ± 0.02° away from the exposed Si{111} growth surface for GaN deposited on the patterned Si(100) substrate, while no observable tilt existed between the GaN(0002) and Si(111) planes for GaN deposited on the conventional Si(111) substrate. The ratio of integrated intensities of the yellow to near band edge (NBE) luminescence (IYL/INBE) was determined to be about one order of magnitude lower in the case of GaN deposited on the patterned Si(100) substrate compared with GaN deposited on the conventional Si(111) substrate. The Raman E2(high) optical phonon mode at 565.224 ± 0.001 cm-1 with a narrow full width at half maximum of 1.526 ± 0.002 cm-1 was measured, for GaN deposited on the patterned Si(100) indicating high material quality. GaN deposition within the trench etched on the Si(100) substrate occurred via diffusion and mass-transport limited mechanism. This resulted in a differential GaN layer thickness from the top (i.e., 1.8 μm) of the trench to the bottom (i.e., 0.3 μm) of the trench. Mixed-type dislocation constituted about 80% of the total dislocations in the GaN grown on the inclined Si{111} surface etched on Si(100).

  20. Crystallographically tilted and partially strain relaxed GaN grown on inclined (111) facets etched on Si(100) substrate

    SciTech Connect

    Ansah Antwi, K. K.; Soh, C. B.; Wee, Q.; Tan, Rayson J. N.; Tan, H. R.; Yang, P.; Sun, L. F.; Shen, Z. X.; Chua, S. J.

    2013-12-28

    High resolution X-ray diffractometry (HR-XRD), Photoluminescence, Raman spectroscopy, and Transmission electron microscope measurements are reported for GaN deposited on a conventional Si(111) substrate and on the (111) facets etched on a Si(100) substrate. HR-XRD reciprocal space mappings showed that the GaN(0002) plane is tilted by about 0.63° ± 0.02° away from the exposed Si(111) growth surface for GaN deposited on the patterned Si(100) substrate, while no observable tilt existed between the GaN(0002) and Si(111) planes for GaN deposited on the conventional Si(111) substrate. The ratio of integrated intensities of the yellow to near band edge (NBE) luminescence (I{sub YL}/I{sub NBE}) was determined to be about one order of magnitude lower in the case of GaN deposited on the patterned Si(100) substrate compared with GaN deposited on the conventional Si(111) substrate. The Raman E{sub 2}(high) optical phonon mode at 565.224 ± 0.001 cm{sup −1} with a narrow full width at half maximum of 1.526 ± 0.002 cm{sup −1} was measured, for GaN deposited on the patterned Si(100) indicating high material quality. GaN deposition within the trench etched on the Si(100) substrate occurred via diffusion and mass-transport limited mechanism. This resulted in a differential GaN layer thickness from the top (i.e., 1.8 μm) of the trench to the bottom (i.e., 0.3 μm) of the trench. Mixed-type dislocation constituted about 80% of the total dislocations in the GaN grown on the inclined Si(111) surface etched on Si(100)

  1. Structure and morphology characters of GaN grown by ECR-MBE using hydrogen-nitrogen mixed gas plasma[Electron Cyclotron Resonance-Molecular Beam Epitaxy

    SciTech Connect

    Araki, Tsutomu; Chiba, Yasuo; Nanishi, Yasushi

    2000-07-01

    GaN growth by electron-cyclotron-resonance plasma-excited molecular beam epitaxy using hydrogen-nitrogen mixed gas plasma were carried out on GaN templates with a different polar-surface. Structure and surface morphology of the GaN layers were characterized using transmission electron microscopy. The GaN layer grown with hydrogen on N-polar template showed a relatively flat morphology including hillocks. Columnar domain existed in the center of the hillock, which might be attributed to the existence of tiny inversion domain with Ga-polarity. On the other hand, columnar structure was formed in the GaN layer grown with hydrogen on Ga-polar template.

  2. Effect of GaN interlayer on polarity control of epitaxial ZnO thin films grown by molecular beam epitaxy

    SciTech Connect

    Wang, X. Q.; Sun, H. P.; Pan, X. Q.

    2010-10-11

    Epitaxial ZnO thin films were grown on nitrided (0001) sapphire substrates with an intervening GaN layer by rf-plasma-assisted molecular beam epitaxy. It was found that polarity of the ZnO epilayer could be controlled by modifying the GaN interlayer. ZnO grown on a distorted 3-nm-thick GaN interlayer has Zn-polarity while ZnO on a 20-nm-thick GaN interlayer with a high structural quality has O-polarity. High resolution transmission electron microscopy analysis indicates that the polarity of ZnO epilayer is controlled by the atomic structure of the interface between the ZnO buffer layer and the intervening GaN layer.

  3. Thermal evolution of microstructure in ion-irradiated GaN

    SciTech Connect

    Bae, In-Tae; Jiang, Weilin; Wang, Chong M.; Weber, William J.; Zhang, Yanwen

    2009-04-20

    The thermal evolution of the microstructure created by irradiation of a GaN single crystal with 2 MeV Au2+ ions at 150 K is characterized following annealing at 973 K using transmission electron microscopy. In the as-irradiated sample characterized at 300 K, Ga nanocrystals with the diamond structure, which is an unstable configuration for Ga, are directly observed together with nitrogen bubbles in the irradiation-induced amorphous layer. Upon thermal annealing, the thickness of the amorphous layer decreases by ~13.1 %, and nano-beam electron diffraction analysis indicates no evidence for residual Ga nanocrystals, but instead reveals a mixture of hexagonal and cubic GaN phases in the annealed sample. Nitrogen molecules, captured in the as-irradiated bubbles, appear to debond and react with the Ga nanocrystals during the thermal annealing to form crystalline GaN. In addition, electron energy loss spectroscopy measurements reveal an atomic volume change of 18.9 % for the as-irradiated amorphous layer relative to the virgin single crystal GaN. This relative swelling of the damaged layer reduces to 7.7 % after thermal annealing. Partial recrystallization and structural relaxation of the GaN amorphous state are believed responsible for the volume change.

  4. Specific peptide for functionalization of GaN

    NASA Astrophysics Data System (ADS)

    Estephan, E.; Larroque, C.; Cloitre, T.; Cuisinier, F. J. G.; Gergely, C.

    2008-04-01

    Nanobiotechnology aims to exploit biomolecular recognition and self-assembly capabilities for integrating advanced materials into medicine and biology. However frequent problems are encountered at the interface of substrate-biological molecule, as the direct physical adsorption of biological molecules is dependent of unpredictable non-specific interactions with the surface, often causing their denaturation. Therefore, a proper functionalization of the substrate should avoid a loss of biological activity. In this work we address the functionalization of the semiconductor GaN (0001) for biosensing applications. The basic interest of using III-V class semiconductors is their good light emitting properties and a fair chemical stability that allows various applications of these materials. The technology chosen to elaborate GaN-specific peptides is the combinatorial phage-display method, a biological screening procedure based on affinity selection. An M13 bacteriophage library has been used to screen 10 10 different peptides against the GaN (0001) surface to finally isolate one specific peptide. The preferential attachment of the biotinylated selected peptide onto the GaN (0001), in close proximity to a surface of different chemical and structural composition has been demonstrated by fluorescence microscopy. Further physicochemical studies have been initiated to evaluate the semiconductor-peptide interface and understand the details in the specific recognition of peptides for semiconductor substrates. Fourier Transform Infrared spectroscopy in Attenuated Total Reflection mode (FTIR-ATR) has been employed to prove the presence of peptides on the surface. Our Atomic Force Microscopy (AFM) studies on the morphology of the GaN surface after functionalization revealed a total surface coverage by a very thin, homogeneous peptide layer. Due to its good biocompatibility, functionalized GaN devices might evolve in a new class of implantable biosensors for medical applications.

  5. Growth of β-Ga2O3 and GaN nanowires on GaN for photoelectrochemical hydrogen generation.

    PubMed

    Hwang, Jih-Shang; Liu, Tai-Yan; Chattopadhyay, Surjit; Hsu, Geng-Ming; Basilio, Antonio M; Chen, Han-Wei; Hsu, Yu-Kuei; Tu, Wen-Hsun; Lin, Yan-Gu; Chen, Kuei-Hsien; Li, Chien-Cheng; Wang, Sheng-Bo; Chen, Hsin-Yi; Chen, Li-Chyong

    2013-02-08

    Enhanced photoelectrochemical (PEC) performances of Ga(2)O(3) and GaN nanowires (NWs) grown in situ from GaN were demonstrated. The PEC conversion efficiencies of Ga(2)O(3) and GaN NWs have been shown to be 0.906% and 1.09% respectively, in contrast to their 0.581% GaN thin film counterpart under similar experimental conditions. A low crystallinity buffer layer between the grown NWs and the substrate was found to be detrimental to the PEC performance, but the layer can be avoided at suitable growth conditions. A band bending at the surface of the GaN NWs generates an electric field that drives the photogenerated electrons and holes away from each other, preventing recombination, and was found to be responsible for the enhanced PEC performance. The enhanced PEC efficiency of the Ga(2)O(3) NWs is aided by the optical absorption through a defect band centered 3.3 eV above the valence band of Ga(2)O(3). These findings are believed to have opened up possibilities for enabling visible absorption, either by tailoring ion doping into wide bandgap Ga(2)O(3) NWs, or by incorporation of indium to form InGaN NWs.

  6. Wafer-Size and Single-Crystal MoSe2 Atomically Thin Films Grown on GaN Substrate for Light Emission and Harvesting.

    PubMed

    Chen, Zuxin; Liu, Huiqiang; Chen, Xuechen; Chu, Guang; Chu, Sheng; Zhang, Hang

    2016-08-10

    Two-dimensional (2D) atomic-layered semiconductors are important for next-generation electronics and optoelectronics. Here, we designed the growth of an MoSe2 atomic layer on a lattice-matched GaN semiconductor substrate. The results demonstrated that the MoSe2 films were less than three atomic layers thick and were single crystalline of MoSe2 over the entire GaN substrate. The ultrathin MoSe2/GaN heterojunction diode demonstrated ∼850 nm light emission and could also be used in photovoltaic applications.

  7. Defect analysis in GaN films of HEMT structure by cross-sectional cathodoluminescence

    NASA Astrophysics Data System (ADS)

    Isobe, Yasuhiro; Hung, Hung; Oasa, Kohei; Ono, Tasuku; Onizawa, Takashi; Yoshioka, Akira; Takada, Yoshiharu; Saito, Yasunobu; Sugiyama, Naoharu; Tsuda, Kunio; Sugiyama, Toru; Mizushima, Ichiro

    2017-06-01

    Defect analysis of GaN films in high electron mobility transistor (HEMT) structures by cross-sectional cathodoluminescence (X-CL) is demonstrated as a useful technique for improving the current collapse of GaN-HEMT devices, and the relationship between crystal quality and device characteristics is also investigated. The crystal quality of intrinsic-GaN (i-GaN) and carbon-doped GaN produced clearly different peak intensities of blue luminescence (BL), yellow luminescence (YL), and band-edge emission (BE), which is independently detected by X-CL. Current collapse in GaN-HEMT devices is found to be determined by the BL/BE and YL/BE ratios at the top of the i-GaN layer, which is close to the channel. Moreover, the i-GaN thickness required in order to minimize the BL/BE and YL/BE ratios and the thickness dependency of GaN for minimizing the BL/BE and YL/BE ratios depending on the growth conditions can be evaluated by X-CL. However, there is no correlation between current collapse in GaN-HEMT devices and the YL/BE ratio by conventional photoluminescence because HEMT devices consist of multiple GaN layers and the YL signal is detected from the carbon-doped GaN layer. Thus, the X-CL analysis method is a useful technique for device design in order to suppress current collapse.

  8. Polar properties of a hexagonally bonded GaN sheet under biaxial compression

    NASA Astrophysics Data System (ADS)

    Gao, Yanlin; Yayama, Tomoe; Okada, Susumu

    2016-09-01

    Using the density functional theory, we study the geometric and electronic structures of a GaN sheet possessing a honeycomb network. The sheet preserves the planar conformation under an equilibrium lattice constant of 3.2 Å, and has a semiconducting electronic structure with an indirect band gap of 2.28 eV. The biaxial compressive strain causes structural buckling, leading to polarization normal to the atomic layer. An external electric field normal to the layer also induces structural buckling with a height proportional to the field strength. The polarity of the buckled GaN sheet is tunable by attaching H atoms on Ga and N atoms.

  9. Very strong photoluminescence emission from GaN grown on amorphous silica substrate by gas source MBE

    NASA Astrophysics Data System (ADS)

    Asahi, H.; Iwata, K.; Tampo, H.; Kuroiwa, R.; Hiroki, M.; Asami, K.; Nakamura, S.; Gonda, S.

    1999-05-01

    Polycrystalline GaN layers showing very strong photoluminescence (PL) intensities are successfully grown on amorphous fused silica (SiO 2) substrates by gas source molecular beam epitaxy (MBE) using an ion removed electron cyclotron resonance radical cell. The PL intensity is larger than that of undoped single crystalline GaN grown on sapphire by gas source MBE and is comparable to that of Si-doped single crystalline GaN grown on sapphire by metalorganic vapor-phase epitaxy at Nichia Chemical. The PL peak emission is considered to be excitonic. Undoped GaN layers grown on silica substrates exhibit n-type conduction and both n- and p-type conductions are achieved by impurity doping. These results open up the area of "Polycrystalline Semiconductor Photonics".

  10. In situ GaN decomposition analysis by quadrupole mass spectrometry and reflection high-energy electron diffraction

    SciTech Connect

    Fernandez-Garrido, S.; Calleja, E.; Koblmueller, G.; Speck, J. S.

    2008-08-01

    Thermal decomposition of wurtzite (0001)-oriented GaN was analyzed: in vacuum, under active N exposure, and during growth by rf plasma-assisted molecular beam epitaxy. The GaN decomposition rate was determined by measurements of the Ga desorption using in situ quadrupole mass spectrometry, which showed Arrhenius behavior with an apparent activation energy of 3.1 eV. Clear signatures of intensity oscillations during reflection high-energy electron diffraction measurements facilitated complementary evaluation of the decomposition rate and highlighted a layer-by-layer decomposition mode in vacuum. Exposure to active nitrogen, either under vacuum or during growth under N-rich growth conditions, strongly reduced the GaN losses due to GaN decomposition.

  11. Highly c-axis oriented growth of GaN film on sapphire (0001) by laser molecular beam epitaxy using HVPE grown GaN bulk target

    SciTech Connect

    Kushvaha, S. S.; Kumar, M. Senthil; Maurya, K. K.; Dalai, M. K.; Sharma, Nita D.

    2013-09-15

    Growth temperature dependant surface morphology and crystalline properties of the epitaxial GaN layers grown on pre-nitridated sapphire (0001) substrates by laser molecular beam epitaxy (LMBE) were investigated in the range of 500–750 °C. The grown GaN films were characterized using high resolution x-ray diffraction, atomic force microscopy (AFM), micro-Raman spectroscopy, and secondary ion mass spectroscopy (SIMS). The x-ray rocking curve full width at a half maximum (FWHM) value for (0002) reflection dramatically decreased from 1582 arc sec to 153 arc sec when the growth temperature was increased from 500 °C to 600 °C and the value further decreased with increase of growth temperature up to 720 °C. A highly c-axis oriented GaN epitaxial film was obtained at 720 °C with a (0002) plane rocking curve FWHM value as low as 102 arc sec. From AFM studies, it is observed that the GaN grain size also increased with increasing growth temperature and flat, large lateral grains of size 200-300 nm was obtained for the film grown at 720 °C. The micro-Raman spectroscopy studies also exhibited the high-quality wurtzite nature of GaN film grown on sapphire at 720 °C. The SIMS measurements revealed a non-traceable amount of background oxygen impurity in the grown GaN films. The results show that the growth temperature strongly influences the surface morphology and crystalline quality of the epitaxial GaN films on sapphire grown by LMBE.

  12. Highly c-axis oriented growth of GaN film on sapphire (0001) by laser molecular beam epitaxy using HVPE grown GaN bulk target

    NASA Astrophysics Data System (ADS)

    Kushvaha, S. S.; Kumar, M. Senthil; Maurya, K. K.; Dalai, M. K.; Sharma, Nita D.

    2013-09-01

    Growth temperature dependant surface morphology and crystalline properties of the epitaxial GaN layers grown on pre-nitridated sapphire (0001) substrates by laser molecular beam epitaxy (LMBE) were investigated in the range of 500-750 °C. The grown GaN films were characterized using high resolution x-ray diffraction, atomic force microscopy (AFM), micro-Raman spectroscopy, and secondary ion mass spectroscopy (SIMS). The x-ray rocking curve full width at a half maximum (FWHM) value for (0002) reflection dramatically decreased from 1582 arc sec to 153 arc sec when the growth temperature was increased from 500 °C to 600 °C and the value further decreased with increase of growth temperature up to 720 °C. A highly c-axis oriented GaN epitaxial film was obtained at 720 °C with a (0002) plane rocking curve FWHM value as low as 102 arc sec. From AFM studies, it is observed that the GaN grain size also increased with increasing growth temperature and flat, large lateral grains of size 200-300 nm was obtained for the film grown at 720 °C. The micro-Raman spectroscopy studies also exhibited the high-quality wurtzite nature of GaN film grown on sapphire at 720 °C. The SIMS measurements revealed a non-traceable amount of background oxygen impurity in the grown GaN films. The results show that the growth temperature strongly influences the surface morphology and crystalline quality of the epitaxial GaN films on sapphire grown by LMBE.

  13. Atomic-scale and pit-free flattening of GaN by combination of plasma pretreatment and time-controlled chemical mechanical polishing

    NASA Astrophysics Data System (ADS)

    Deng, Hui; Endo, Katsuyoshi; Yamamura, Kazuya

    2015-08-01

    Chemical mechanical polishing (CMP) combined with atmospheric-pressure plasma pretreatment was applied to a GaN (0001) substrate. The irradiation of a CF4-containing plasma was proven to be very useful for modifying the surface of GaN. When CMP was conducted on a plasma-irradiated surface, a modified layer of GaF3 acted as a protective layer on GaN by preventing the formation of etch pits. Within a short duration (8 min) of CMP using a commercially available CeO2 slurry, an atomically flat surface with a root mean square (rms) roughness of 0.11 nm was obtained. Moreover, etch pits, which are inevitably introduced in conventional CMP, could not be observed at the dislocation sites on the polished GaN surface. It was revealed that CMP combined with the plasma pretreatment was very effective for obtaining a pit-free and atomically flat GaN surface.

  14. Strong light-matter coupling at room temperature in simple geometry GaN microcavities grown on silicon

    SciTech Connect

    Semond, F.; Sellers, I.R.; Natali, F.; Byrne, D.; Leroux, M.; Massies, J.; Ollier, N.; Leymarie, J.; Disseix, P.; Vasson, A.

    2005-07-11

    The reflectance spectra of simple design GaN-based microcavities have been studied in the 5 K-300 K range. The epitaxial structure consists of the silicon substrate and the stack of buffer layers as the back mirror, a GaN active layer, and a 100 A thick aluminium layer as the top mirror. Active layer thicknesses of {lambda}/2, {lambda}, or 3{lambda}/2 were investigated. The samples with GaN thicknesses {lambda}/2 and {lambda} display an anticrossing behavior between the cavity and exciton modes, with measured Rabi splittings of 47 and 60 meV, respectively, both at 5 K and room temperature.

  15. Characterization and density control of GaN nanodots on Si (111) by droplet epitaxy using plasma-assisted molecular beam epitaxy.

    PubMed

    Yu, Ing-Song; Chang, Chun-Pu; Yang, Chung-Pei; Lin, Chun-Ting; Ma, Yuan-Ron; Chen, Chun-Chi

    2014-01-01

    In this report, self-organized GaN nanodots have been grown on Si (111) by droplet epitaxy method, and their density can be controlled from 1.1 × 10(10) to 1.1 × 10(11) cm(-2) by various growth parameters, such as substrate temperatures for Ga droplet formation, the pre-nitridation treatment of Si substrate, the nitridation duration for GaN crystallization, and in situ annealing after GaN formation. Based on the characterization of in situ RHEED, we can observe the surface condition of Si and the formation of GaN nanodots on Si. The surface nitridaiton treatment at 600°C provides a-SiNx layer which makes higher density of GaN nanodots. Crystal GaN nanodots can be observed by the HRTEM. The surface composition of GaN nanodots can be analyzed by SPEM and μ-XPS with a synchrotron x-ray source. We can find GaN nanodots form by droplet epitaxy and then in situ annealing make higher-degree nitridation of GaN nanodots.

  16. Characterization and density control of GaN nanodots on Si (111) by droplet epitaxy using plasma-assisted molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Yu, Ing-Song; Chang, Chun-Pu; Yang, Chung-Pei; Lin, Chun-Ting; Ma, Yuan-Ron; Chen, Chun-Chi

    2014-12-01

    In this report, self-organized GaN nanodots have been grown on Si (111) by droplet epitaxy method, and their density can be controlled from 1.1 × 1010 to 1.1 × 1011 cm-2 by various growth parameters, such as substrate temperatures for Ga droplet formation, the pre-nitridation treatment of Si substrate, the nitridation duration for GaN crystallization, and in situ annealing after GaN formation. Based on the characterization of in situ RHEED, we can observe the surface condition of Si and the formation of GaN nanodots on Si. The surface nitridaiton treatment at 600°C provides a-SiNx layer which makes higher density of GaN nanodots. Crystal GaN nanodots can be observed by the HRTEM. The surface composition of GaN nanodots can be analyzed by SPEM and μ-XPS with a synchrotron x-ray source. We can find GaN nanodots form by droplet epitaxy and then in situ annealing make higher-degree nitridation of GaN nanodots.

  17. Direct Observation of Mn Clusters in GaN by X-ray Scanning Microscopy

    NASA Astrophysics Data System (ADS)

    Martínez-Criado, Gema; Somogyi, Andrea; Hermann, Martin; Eickhoff, Martin; Stutzmann, Martin

    2004-06-01

    The effect of Mn doping in GaN was studied by X-ray absorption techniques. In fluorescence detection mode, Ga and Mn elemental maps show homogeneous distributions in most of the samples, except for the highest Mn-doped GaN layer, which clearly exhibits the Mn cluster formation on the micrometer scale. X-ray absorption near-edge structure (XANES) spectra measured around the Mn atom have revealed a smoothing and broadening of all features as a function of Mn content, suggesting the presence of short-range disorder. However, no evidence of disorder activated phonon modes and/or additional secondary phases were observed by Raman scattering, supporting that the long-range crystalline order was retained. Nevertheless, the frequency shift of the E2 phonon mode as well as the bound exciton data confirm the doping-induced tensile strain in the GaN layers.

  18. Strong photoluminescence emission from GaN grown on amorphous silica substrates by gas source MBE

    NASA Astrophysics Data System (ADS)

    Iwata, K.; Asahi, H.; Asami, K.; Kuroiwa, R.; Gonda, S.

    1998-06-01

    GaN layers are grown on amorphous fused silica glass substrates by gas source MBE using an ion removed electron cyclotron resonance (ECR) radical cell. Reflection high-energy electron diffraction (RHEED) and X-ray diffraction measurements reveal that they are polycrystalline. However, they show a strong photoluminescence emission peak without deep level emission. The emission peak is red-shifted by about 150 meV from that of the excitonic emission peak of GaN grown on a sapphire substrate and has wide spectral half-width (˜250 meV at 77 K). The peak is not corresponding to the donor-acceptor pair (DAP) emission but is excitonic from the excitation power and temperature dependence of PL spectrum. These optical properties indicate that GaN layers grown on a glass substrate are promising for fabrication of large area and low cost light emitting devices and solar cells.

  19. Studies on high temperature vapor phase epitaxy of GaN

    NASA Astrophysics Data System (ADS)

    Schneider, T.; Lukin, G.; Zimmermann, F.; Barchuk, M.; Niederschlag, E.; Pätzold, O.; Stelter, M.

    2017-06-01

    This paper deals with technological development and investigation of the high temperature vapor phase epitaxy (HTVPE) for the growth of GaN films. A novel Ga evaporation cell designed for an optimal local temperature field and gas flow is described. The influence of the reactor pressure and the temperature of the Ga melt on the growth rate in HTVPE is studied. The experiments demonstrated growth rates up to 165 μm/h, which could be of potential interest for the deposition of thick GaN layers. Optical properties of the HTVPE layers, as well as typical process impurities are studied by PL, SIMS and GDMS, and discussed in detail. First experiments on a deposition of GaN films on sapphire substrates by HTVPE are presented.

  20. Coaxial metal-oxide-semiconductor (MOS) Au/Ga2O3/GaN nanowires.

    PubMed

    Hsieh, Chin-Hua; Chang, Mu-Tung; Chien, Yu-Jen; Chou, Li-Jen; Chen, Lih-Juann; Chen, Chii-Dong

    2008-10-01

    Coaxial metal-oxide-semiconductor (MOS) Au-Ga2O3-GaN heterostructure nanowires were successfully fabricated by an in situ two-step process. The Au-Ga2O3 core-shell nanowires were first synthesized by the reaction of Ga powder, a mediated Au thin layer, and a SiO2 substrate at 800 degrees C. Subsequently, these core-shell nanowires were nitridized in ambient ammonia to form a GaN coating layer at 600 degrees C. The GaN shell is a single crystal, an atomic flat interface between the oxide and semiconductor that ensures that the high quality of the MOS device is achieved. These novel 1D nitride-based MOS nanowires may have promise as building blocks to the future nitride-based vertical nanodevices.

  1. Quantum dynamics of a plane pendulum

    SciTech Connect

    Leibscher, Monika; Schmidt, Burkhard

    2009-07-15

    A semianalytical approach to the quantum dynamics of a plane pendulum is developed, based on Mathieu functions which appear as stationary wave functions. The time-dependent Schroedinger equation is solved for pendular analogs of coherent and squeezed states of a harmonic oscillator, induced by instantaneous changes of the periodic potential energy function. Coherent pendular states are discussed between the harmonic limit for small displacements and the inverted pendulum limit, while squeezed pendular states are shown to interpolate between vibrational and free rotational motion. In the latter case, full and fractional revivals as well as spatiotemporal structures in the time evolution of the probability densities (quantum carpets) are quantitatively analyzed. Corresponding expressions for the mean orientation are derived in terms of Mathieu functions in time. For periodic double well potentials, different revival schemes, and different quantum carpets are found for the even and odd initial states forming the ground tunneling doublet. Time evolution of the mean alignment allows the separation of states with different parity. Implications for external (rotational) and internal (torsional) motion of molecules induced by intense laser fields are discussed.

  2. GaN Device Processing

    SciTech Connect

    Pearton, S.J.; Ren, F.; Zolper, J.C.; Shul, R.J.

    1998-01-01

    Recent progress in the development of dry and wet etching techniques, implant doping and isolation, thermal processing, gate insulator technology and high reliability contacts is reviewed. Etch selectivities up to 10 for InN over AlN are possible in Inductively Coupled Plasmas using a Cl2/Ar chemistry, but in general selectivities for each binary nitride relative to each other are low ({lt} OR = 2) BECAUSE OF THE HIGH ION ENERGIES NEEDED TO INITIATE ETCHING. IMPROVED N-TYPE OHMIC CONTACT RESISTANCES ARE OBTAINED BY SELECTIVE AREA SI+ IMPLANTATION FOLLOWED BY VERY HIGH TEMPERATURE ({gt}1300 deg C) anneals in which the thermal budget is minimized and AlN encapsulation prevents GaN surface decomposition. Implant isolation is effective in GaN, AlGaN and AlInN, but marginal in InGaN. Candidate gate insulators for GaN include AlN, AlON and Ga(Gd)O(x), but interface state densities are still to high to realize state-of-the-art MIS devices.

  3. Instability and Spontaneous Reconstruction of Few-Monolayer Thick GaN Graphitic Structures.

    PubMed

    Kolobov, A V; Fons, P; Tominaga, J; Hyot, B; André, B

    2016-08-10

    Two-dimensional (2D) semiconductors are a very hot topic in solid state science and technology. In addition to van der Waals solids that can be easily formed into 2D layers, it was argued that single layers of nominally 3D tetrahedrally bonded semiconductors, such as GaN or ZnO, also become flat in the monolayer limit; the planar structure was also proposed for few-layers of such materials. In this work, using first-principles calculations, we demonstrate that contrary to the existing consensus the graphitic structure of few-layer GaN is unstable and spontaneously reconstructs into a structure that remains hexagonal in plane but with covalent interlayer bonds that form alternating octagonal and square (8|4 Haeckelite) rings with pronounced in-plane anisotropy. Of special interest is the transformation of the band gap from indirect in planar GaN toward direct in the Haeckelite phase, making Haeckelite few-layer GaN an appealing material for flexible nano-optoelectronics.

  4. Polarity control of GaN grown on pulsed-laser-deposited AlN/GaN template by metalorganic vapor phase epitaxy

    NASA Astrophysics Data System (ADS)

    Yoo, Jinyeop; Shojiki, Kanako; Tanikawa, Tomoyuki; Kuboya, Shigeyuki; Hanada, Takashi; Katayama, Ryuji; Matsuoka, Takashi

    2016-05-01

    We report on the polarity control of GaN regrown on pulsed-laser-deposition-grown N-polar AlN on a metalorganic-vapor-phase-epitaxy-grown Ga-polar GaN template. The polarity of the regrown GaN, which was confirmed using aqueous KOH solutions, can be inverted from that of AlN by inserting a low-temperature GaN (LT-GaN) buffer layer. We hypothetically ascribe the Ga-polarity selection of GaN on the LT-GaN buffer layer to the mixed polarity of LT-GaN grains and higher growth rate of the Ga-polar grain, which covers up the N-polar grain during the initial stage of the high-temperature growth. The X-ray rocking curve analysis revealed that the edge-dislocation density in the N-polar regrown GaN is 5 to 8 times smaller than that in the Ga-polar regrown GaN. N-polar GaN grows directly on N-polar AlN at higher temperatures. Therefore, nucleus islands grow larger than those of LT-GaN and the area fraction of coalescence boundaries between islands, where edge dislocations emerge, becomes smaller.

  5. Direct spontaneous growth and interfacial structural properties of inclined GaN nanopillars on r-plane sapphire

    SciTech Connect

    Adikimenakis, A.; Aretouli, K. E.; Tsagaraki, K.; Androulidaki, M.; Georgakilas, A.; Lotsari, A.; Dimitrakopulos, G. P. Kehagias, Th.; Komninou, Ph.

    2015-06-28

    The spontaneous growth of GaN nanopillars (NPs) by direct plasma-assisted molecular beam epitaxy on nitridated r-plane sapphire substrates has been studied. The emanation of metal-polarity NPs from inside an a-plane nonpolar GaN film was found to depend on both the substrate nitridation and the growth conditions. The density of NPs increased with increasing the duration of the nitridation process and the power applied on the radio-frequency plasma source, as well as the III/V flux ratio, while variation of the first two parameters enhanced the roughness of the substrate's surface. Transmission electron microscopy (TEM) techniques were employed to reveal the structural characteristics of the NPs and their nucleation mechanism from steps on the sapphire surface and/or interfacial semipolar GaN nanocrystals. Lattice strain measurements showed a possible Al enrichment of the first 5–6 monolayers of the NPs. By combining cross-sectional and plan-view TEM observations, the three-dimensional model of the NPs was constructed. The orientation relationship and interfacial accommodation between the NPs and the nonpolar a-plane GaN film were also elucidated. The NPs exhibited strong and narrow excitonic emission, suggesting an excellent structural quality.

  6. Direct spontaneous growth and interfacial structural properties of inclined GaN nanopillars on r-plane sapphire

    NASA Astrophysics Data System (ADS)

    Adikimenakis, A.; Lotsari, A.; Dimitrakopulos, G. P.; Kehagias, Th.; Aretouli, K. E.; Tsagaraki, K.; Androulidaki, M.; Komninou, Ph.; Georgakilas, A.

    2015-06-01

    The spontaneous growth of GaN nanopillars (NPs) by direct plasma-assisted molecular beam epitaxy on nitridated r-plane sapphire substrates has been studied. The emanation of metal-polarity NPs from inside an a-plane nonpolar GaN film was found to depend on both the substrate nitridation and the growth conditions. The density of NPs increased with increasing the duration of the nitridation process and the power applied on the radio-frequency plasma source, as well as the III/V flux ratio, while variation of the first two parameters enhanced the roughness of the substrate's surface. Transmission electron microscopy (TEM) techniques were employed to reveal the structural characteristics of the NPs and their nucleation mechanism from steps on the sapphire surface and/or interfacial semipolar GaN nanocrystals. Lattice strain measurements showed a possible Al enrichment of the first 5-6 monolayers of the NPs. By combining cross-sectional and plan-view TEM observations, the three-dimensional model of the NPs was constructed. The orientation relationship and interfacial accommodation between the NPs and the nonpolar a-plane GaN film were also elucidated. The NPs exhibited strong and narrow excitonic emission, suggesting an excellent structural quality.

  7. Finite-difference time-domain analysis on light extraction in a GaN light-emitting diode by empirically capable dielectric nano-features

    NASA Astrophysics Data System (ADS)

    Park, ByeongChan; Noh, Heeso; Yu, Young Moon; Jang, Jae-Won

    2014-11-01

    Enhancement of light extraction in GaN light-emitting diode (LED) by addressing an array of nanomaterials is investigated by means of three dimensional (3D) finite-difference time-domain (FDTD) simulation experiments. The array of nanomaterials is placed on top of the GaN LED and is used as a light extraction layer. Depending on its empirically capable features, the refractive index of nanomaterials with perfectly spherical (particle) and hemispherical (plano-convex lens) shapes were decided as 1.47 [Polyethylene glycol (PEG)] and 2.13 [Zirconia (ZrO2)]. As a control experiment, a 3D FDTD simulation experiment of GaN LED with PEG film deposited on top is also carried out. Different light extraction profiles between subwavelength- and over-wavelength-scaled nanomaterials addressed GaN LEDs are observed in distributions of Poynting vector intensity of the light extraction layer-applied GaN LEDs. In addition, our results show that the dielectric effect on light extraction is more efficient in the light extraction layer with over-wavelength scaled features. In the case of a Zirconia particle array (ϕ = 500 nm) with hexagonal closed packed (hcp) structure on top of a GaN LED, light extraction along the normal axis of the LED surface is about six times larger than a GaN LED without the extraction layer.

  8. Tellurium n-type doping of highly mismatched amorphous GaN1-xAsx alloys in plasma-assisted molecular beam epitaxy

    DOE PAGES

    Novikov, S. V.; Ting, M.; Yu, K. M.; ...

    2014-10-01

    In this paper we report our study on n-type Te doping of amorphous GaN1-xAsx layers grown by plasma-assisted molecular beam epitaxy. We have used a low temperature PbTe source as a source of tellurium. Reproducible and uniform tellurium incorporation in amorphous GaN1-xAsx layers has been successfully achieved with a maximum Te concentration of 9×10²⁰ cm⁻³. Tellurium incorporation resulted in n-doping of GaN1-xAsx layers with Hall carrier concentrations up to 3×10¹⁹ cm⁻³ and mobilities of ~1 cm²/V s. The optimal growth temperature window for efficient Te doping of the amorphous GaN1-xAsx layers has been determined.

  9. Epitaxially-Grown GaN Junction Field Effect Transistors

    SciTech Connect

    Baca, A.G.; Chang, P.C.; Denbaars, S.P.; Lester, L.F.; Mishra, U.K.; Shul, R.J.; Willison, C.G.; Zhang, L.; Zolper, J.C.

    1999-05-19

    Junction field effect transistors (JFET) are fabricated on a GaN epitaxial structure grown by metal organic chemical vapor deposition (MOCVD). The DC and microwave characteristics of the device are presented. A junction breakdown voltage of 56 V is obtained corresponding to the theoretical limit of the breakdown field in GaN for the doping levels used. A maximum extrinsic transconductance (gm) of 48 mS/mm and a maximum source-drain current of 270 mA/mm are achieved on a 0.8 µ m gate JFET device at VGS= 1 V and VDS=15 V. The intrinsic transconductance, calculated from the measured gm and the source series resistance, is 81 mS/mm. The fT and fmax for these devices are 6 GHz and 12 GHz, respectively. These JFETs exhibit a significant current reduction after a high drain bias is applied, which is attributed to a partially depleted channel caused by trapped hot-electrons in the semi-insulating GaN buffer layer. A theoretical model describing the current collapse is described, and an estimate for the length of the trapped electron region is given.

  10. Self-assembled GaN nanowires on diamond.

    PubMed

    Schuster, Fabian; Furtmayr, Florian; Zamani, Reza; Magén, Cesar; Morante, Joan R; Arbiol, Jordi; Garrido, Jose A; Stutzmann, Martin

    2012-05-09

    We demonstrate the nucleation of self-assembled, epitaxial GaN nanowires (NWs) on (111) single-crystalline diamond without using a catalyst or buffer layer. The NWs show an excellent crystalline quality of the wurtzite crystal structure with m-plane faceting, a low defect density, and axial growth along the c-axis with N-face polarity, as shown by aberration corrected annular bright-field scanning transmission electron microscopy. X-ray diffraction confirms single domain growth with an in-plane epitaxial relationship of (10 ̅10)(GaN) [parallel] (01 ̅1)(Diamond) as well as some biaxial tensile strain induced by thermal expansion mismatch. In photoluminescence, a strong and sharp excitonic emission reveals excellent optical properties superior to state-of-the-art GaN NWs on silicon substrates. In combination with the high-quality diamond/NW interface, confirmed by high-resolution transmission electron microscopy measurements, these results underline the potential of p-type diamond/n-type nitride heterojunctions for efficient UV optoelectronic devices.

  11. MgCaO Dry Etching on GaN

    NASA Astrophysics Data System (ADS)

    Hlad, M.; Ren, F.

    2005-11-01

    MgCaO films grown by rf plasma-assisted Molecular Beam Epitaxy and capped with Sc2O3 are promising candidates as surface passivation layers and gate dielectrics on GaN-based high electron mobility transistors (HEMTs) and metal-oxide semiconductor HEMTs (MOS-HEMTs) respectively. Two different plasma chemistries were examined for etching these thin films on GaN. Inductively Coupled Plasmas of CH4/H2/Ar produced etch rates only in the range 20-70 å/min, comparable to the Ar sputter rates under the same conditions. Similarly slow MgCaO etch rates (˜100 å/min) were obtained with Cl2/Ar discharges under the same conditions, but GaN showed rates almost an order of magnitude higher. The MgCaO removal rates are limited by the low volatilities of the respective etch products. The CH4/H2/Ar plasma chemistry produced a selectivity of around 2 or etching the MgCaO with respect to GaN.

  12. Magnesium diffusion profile in GaN grown by MOVPE

    NASA Astrophysics Data System (ADS)

    Benzarti, Z.; Halidou, I.; Bougrioua, Z.; Boufaden, T.; El Jani, B.

    2008-07-01

    The diffusion of magnesium has been studied in GaN layers grown on sapphire substrate by atmospheric pressure metalorganic vapor-phase-epitaxy (MOVPE) in a "home-made" reactor. Secondary Ion Mass Spectroscopy (SIMS) was used to visualise the Mg profiles in two kinds of multi-sublayer GaN structures. One structure was grown with a variable flow of Ga precursor (TMG) and the second one with a variable growth temperature. In both cases, the Mg dopant precursor (Cp 2Mg) flow was kept constant. Using the second Fick's law to fit the experimental SIMS data, we have deduced an increasing then a saturating Mg diffusion coefficient versus the Mg concentration. Mg incorporation was found to get higher for lower growth rate, i.e. when TMG flow is reduced. Furthermore, based on the temperature-related behaviour we have found that the activation energy for Mg diffusion coefficient in GaN was 1.9 eV. It is suggested that Mg diffuses via substitutional sites.

  13. Theoretical and Experiment Study of Cathodoluminescence of GaN

    NASA Astrophysics Data System (ADS)

    Ben Nasr, F.; Matoussi, A.; Salh, R.; Boufaden, T.; Guermazi, S.; Fitting, H.-J.; Eljani, B.; Fakhfakh, Z.

    2007-09-01

    In this work, we report the theoretical and experimental results of cathodoluminescence (CL) from GaN layers with thickness (1-3) micron grown at 800 °C by MOVPE on silicon substrate. The CL measurements were performed in a digital scanning electron microscope DSM 960 at room temperature. The CL spectra recorded at room temperature (RT) show the main UV peak at 3.42 eV of the fundamental transition and a broad yellow band at 2.2 eV attributed the intrinsic defects and extrinsic dopants and impurities. The simulation of the CL excitation and intensity is developed using consistent 2-D model based on the electron beam energy dissipation and taking into account the effects of carrier diffusion, internal absorption and the recombination processes in GaN. Then, we have investigated the evolution of the CL intensity from GaN as a function the electron beam energy in the range Eo = (5-20) keV. A comparative study between experimental and simulated CL spectra at room temperature is presented.

  14. Layering

    NASA Image and Video Library

    2011-04-01

    At the bottom of this image from NASA Mars Odyssey is the cliff-face that is the sidewall of Ophir Chasma. Layering is easily visible in the upper cliff wall, with the thickness of the surface clearly visible.

  15. Growth and optical properties of filamentary GaN nanocrystals grown on a hybrid SiC/Si(111) substrate by molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Reznik, R. R.; Kotlyar, K. P.; Il'kiv, I. V.; Soshnikov, I. P.; Kukushkin, S. A.; Osipov, A. V.; Nikitina, E. V.; Cirlin, G. E.

    2016-10-01

    The potential to grow filamentary GaN nanocrystals by molecular beam epitaxy on a silicon substrate with a nanosized buffer layer of silicon carbide has been demonstrated. Morphological and optical properties of the obtained system have been studied. It has been shown that the intensity of the photoluminescence spectrum peak of such structures is higher than that of the best filamentary GaN nanocrystals without the buffer silicon carbide layer by a factor of more than two.

  16. Anisotropy of two-photon absorption and free-carrier effect in nonpolar GaN

    SciTech Connect

    Fang, Yu; Zhou, Feng; Yang, Junyi; Wu, Xingzhi; Xiao, Zhengguo; Li, Zhongguo; Song, Yinglin

    2015-03-30

    We reported a systematic study about the anisotropic optical nonlinearities in bulk m-plane and a-plane GaN crystals by Z-scan and pump-probe with phase object methods under picosecond at 532 nm. The two-photon absorption coefficient, which was measured as a function of polarization angle, exhibited oscillation curves with a period of π/2, indicating a highly polarized optical third-order nonlinearity in both nonpolar GaN samples. Furthermore, free-carrier absorption revealed stronger hole-related absorption for E⊥c than for E//c probe polarization. In contrast, free-carrier refraction was found almost isotropic due to electron-related refraction in the isotropic conduction bands.

  17. Threading dislocation reduction in transit region of GaN terahertz Gunn diodes

    NASA Astrophysics Data System (ADS)

    Li, Liang; Yang, Lin-An; Zhang, Jin-Cheng; Xue, Jun-Shuai; Xu, Sheng-Rui; Lv, Ling; Hao, Yue; Niu, Mu-Tong

    2012-02-01

    An effect of the position of notch-doping layer in 1-μm GaN Gunn diode on threading dislocations (TDs) distribution is investigated by transmission electron microscopy. Compared with the top-notching-layer (TNL) structure, the bottom-notching-layer (BNL) structure can efficiently reduce the TDs density and improve the crystal quality in the transit region of GaN Gunn diode because it exhibits twice-transition of growth mode from atomic step flow to layer-by-layer nucleation and leads to a significant annihilation of TDs before penetrating into the transit region. X-ray diffraction and Raman spectroscopy reveal that the BNL structure has less compressive stress than the TNL structure.

  18. Effect of residual stress on the microstructure of GaN epitaxial films grown by pulsed laser deposition

    NASA Astrophysics Data System (ADS)

    Wang, Haiyan; Wang, Wenliang; Yang, Weijia; Zhu, Yunnong; Lin, Zhiting; Li, Guoqiang

    2016-04-01

    The stress-free GaN epitaxial films have been directly grown by pulsed laser deposition (PLD) at 850 °C, and the effect of different stress on the microstructure of as-grown GaN epitaxial films has been explored in detail. The as-grown stress-free GaN epitaxial films exhibit very smooth surface without any particles and grains, which is confirmed by the smallest surface root-mean-square roughness of 2.3 nm measured by atomic force microscopy. In addition, they also have relatively high crystalline quality, which is proved by the small full-width at half maximum values of GaN(0002) and GaN (10 1 bar 2) X-ray rocking curves as 0.27° and 0.68°, respectively. However, when the growth temperature is lower or higher than 850 °C, internal or thermal stress would be increased in as-grown GaN epitaxial films. To release the larger stress, a great number of dislocations are generated. Many irregular particulates, hexagonal GaN gains and pits are therefore produced on the films surface, and the crystalline quality is greatly reduced consequently. This work has demonstrated the direct growth of stress-free GaN epitaxial films with excellent surface morphology and high crystalline quality by PLD, and presented a comprehensive study on the origins and the effect of stress in GaN layer. It is instructional to achieve high-quality nitride films by PLD, and shows great potential and broad prospect for the further development of high-performance GaN-based devices.

  19. Design and simulation of a novel GaN based resonant tunneling high electron mobility transistor on a silicon substrate

    NASA Astrophysics Data System (ADS)

    Chowdhury, Subhra; Chattaraj, Swarnabha; Biswas, Dhrubes

    2015-04-01

    For the first time, we have introduced a novel GaN based resonant tunneling high electron mobility transistor (RTHEMT) on a silicon substrate. A monolithically integrated GaN based inverted high electron mobility transistor (HEMT) and a resonant tunneling diode (RTD) are designed and simulated using the ATLAS simulator and MATLAB in this study. The 10% Al composition in the barrier layer of the GaN based RTD structure provides a peak-to-valley current ratio of 2.66 which controls the GaN based HEMT performance. Thus the results indicate an improvement in the current-voltage characteristics of the RTHEMT by controlling the gate voltage in this structure. The introduction of silicon as a substrate is a unique step taken by us for this type of RTHEMT structure.

  20. Tolerance of GaAs as an original substrate for HVPE growth of free standing GaN

    NASA Astrophysics Data System (ADS)

    Suzuki, Mio; Sato, T.; Suemasu, T.; Hasegawa, F.

    2004-09-01

    In order to investigate possibility of thick GaN growth on a GaAs substrate by halide vapar phase epitaxy (HVPE), GaN was grown on GaAs(111)/Ti wafer with Ti deposited by E-gun. It was found that surface treatment of the GaAs substrate by HF solution deteriorated greatly the tolerence of GaAs and that Ti can protected GaAs from erosion by NH3. By depositing Ti on GaAs(111)A surface, a millor-like GaN layer could be grown at 1000 °C for 1 hour without serious deterioration of the original GaAs substrate. By increasing the growth rate, a thick free standing GaN will be obtained with GaAs as an original substrate in near future.

  1. Step-flow growth mode instability of N-polar GaN under N-excess

    SciTech Connect

    Chèze, C.

    2013-08-12

    GaN layers were grown on N-polar GaN substrates by plasma-assisted molecular beam epitaxy under different III/V ratios. Ga-rich conditions assure step-flow growth with atomically flat surface covered by doubly-bunched steps, as for Ga-polar GaN. Growth under N-excess however leads to an unstable step-flow morphology. Particularly, for substrates slightly miscut towards <1010>, interlacing fingers are covered by atomic steps pinned on both sides by small hexagonal pits. In contrast, a three-dimensional island morphology is observed on the Ga-polar equivalent sample. We attribute this result to lower diffusion barriers on N-polar compared to Ga-polar GaN under N-rich conditions.

  2. Tri-halide vapor phase epitaxy of thick GaN using gaseous GaCl3 precursor

    NASA Astrophysics Data System (ADS)

    Murakami, Hisashi; Takekawa, Nao; Shiono, Anna; Thieu, Quang Tu; Togashi, Rie; Kumagai, Yoshinao; Matsumoto, Koh; Koukitu, Akinori

    2016-12-01

    Tri-halide vapor phase epitaxy (THVPE) of thick GaN using GaCl3 was investigated for fabricating low-cost, high-crystalline-quality GaN substrates instead of the conventional manufacturing method of GaCl-based hydride vapor phase epitaxy (HVPE). The growth rate and upper growth temperature limit of GaN using THVPE were found to be much higher than those obtained using conventional HVPE under the same growth conditions. Drastic reduction in the number of dark spots measured by cathodoluminescence at room temperature was observed for the high-temperature-grown GaN layer on the (000-1) GaN/sapphire template due to the enhancement of precursor migration on the growing surface. It was found that the incorporation of impurities such as O, C, and Cl can be reduced even on the N-polarity GaN by increasing the growth temperature. The possibility of enlargement of the crystal diameter by growing the N-polarity GaN layer using THVPE was also proposed.

  3. Functionalizing the GaN(0001)-(1 x 1) Surface. I. The Chemisorption of Aniline

    DTIC Science & Technology

    2001-11-01

    tion. Extending this work to wide-bandgap materials such as SiC and GaN offers advantages over the use of Si as a substrate . In optoelectronic devices...the wide bandgap of 6H–SiC (3.0 eV) or GaN (3.4 eV) permits optical access to the organic layer through the substrate as well as through space...occupied and lowest unoccupied molecular orbitals (HOMO and LUMO, respectively) of the organic adsorbate with the substrate band edges. This opens the

  4. Estimation of Hot Electron Relaxation Time in GaN Using Hot Electron Transistors

    NASA Astrophysics Data System (ADS)

    Dasgupta, Sansaptak; Lu, Jing; Nidhi; Raman, Ajay; Hurni, Christophe; Gupta, Geetak; Speck, James S.; Mishra, Umesh K.

    2013-03-01

    In this paper, we report for the first time an estimation of hot electron relaxation time in GaN using electrical measurements. Hot electron transistors (HETs) with GaN as the base layer and different base-emitter barrier-height configurations and base thicknesses were fabricated. Common-base measurements were performed to extract the differential transfer ratio, and an exponential decay of the transfer ratio with increasing base thickness was observed. A hot electron mean free path was extracted from the corresponding exponential fitting and a relaxation time was computed, which, for low energy injection, matched well with theoretically predicted relaxation times based on longitudinal optical (LO) phonon scattering.

  5. Eliminating stacking faults in semi-polar GaN by AlN interlayers

    SciTech Connect

    Dadgar, A.; Ravash, R.; Veit, P.; Schmidt, G.; Mueller, M.; Dempewolf, A.; Bertram, F.; Wieneke, M.; Christen, J.; Krost, A.

    2011-07-11

    We report on the elimination of stacking faults by the insertion of low-temperature AlN interlayers in nearly (1016) and (1104) oriented semi-polar GaN grown by metalorganic vapor phase epitaxy on Si(112) and Si(113), respectively. The elimination of these defects is visualized by cathodoluminescence (CL) as well as scanning transmission electron microscopy (STEM) and STEM-CL. A possible annihilation mechanism is discussed which leads to the conclusion that the elimination mechanism is most likely valid for all layers with (1101) surfaces, enabling heteroepitaxial semi- and non-polar GaN free from stacking faults.

  6. Luminescence of GaN nanocolumns obtained by photon-assisted anodic etching

    NASA Astrophysics Data System (ADS)

    Tiginyanu, I. M.; Ursaki, V. V.; Zalamai, V. V.; Langa, S.; Hubbard, S.; Pavlidis, D.; Föll, H.

    2003-08-01

    GaN nanocolumns with transverse dimensions of about 50 nm were obtained by illumination-assisted anodic etching of epilayers grown by metalorganic chemical vapor deposition on sapphire substrates. The photoluminescence spectroscopy characterization shows that the as-grown bulk GaN layers suffer from compressive biaxial strain of 0.5 GPa. The majority of nanocolumns are fully relaxed from strain, and the room-temperature luminescence is free excitonic. The high quality of the columnar nanostructures evidenced by the enhanced intensity of the exciton luminescence and by the decrease of the yellow luminescence is explained by the peculiarities of the anodic etching processing.

  7. Bulk ammonothermal GaN

    NASA Astrophysics Data System (ADS)

    Dwiliński, R.; Doradziński, R.; Garczyński, J.; Sierzputowski, L. P.; Puchalski, A.; Kanbara, Y.; Yagi, K.; Minakuchi, H.; Hayashi, H.

    2009-05-01

    In this work, results of structural characterization of high-quality ammonothermal GaN are presented. Besides expected low dislocation density (being of the order of 10 3 cm -2) the most interesting feature seems perfect flatness of the crystal lattice of studied crystals. Regardless the size of crystals, lattice curvature radius exceeds 100 m, whereas better crystals reveal radius of several hundred meters and the best above 1000 m. Excellent crystallinity manifests in very narrow X-ray diffraction peaks of full-width at half-maximum (FWHM) values about 16 arcsec.

  8. Growth and characterizations of GaN micro-rods on graphene films for flexible light emitting diodes

    SciTech Connect

    Chung, Kunook; Beak, Hyeonjun; Tchoe, Youngbin; Oh, Hongseok; Yi, Gyu-Chul; Yoo, Hyobin; Kim, Miyoung

    2014-09-01

    We report the growth of GaN micro-rods and coaxial quantum-well heterostructures on graphene films, together with structural and optical characterization, for applications in flexible optical devices. Graphene films were grown on Cu foil by means of chemical vapor deposition, and used as the substrates for the growth of the GaN micro-rods, which were subsequently transferred onto SiO{sub 2}/Si substrates. Highly Si-doped, n-type GaN micro-rods were grown on the graphene films using metal–organic chemical vapor deposition. The growth and vertical alignment of the GaN micro-rods, which is a critical factor for the fabrication of high-performance light-emitting diodes (LEDs), were characterized using electron microscopy and X-ray diffraction. The GaN micro-rods exhibited promising photoluminescence characteristics for optoelectronic device applications, including room-temperature stimulated emission. To fabricate flexible LEDs, In{sub x}Ga{sub 1–x}N/GaN multiple quantum wells and a p-type GaN layer were deposited coaxially on the GaN micro-rods, and transferred onto Ag-coated polymer substrates using lift-off. Ti/Au and Ni/Au metal layers were formed to provide electrical contacts to the n-type and p-type GaN regions, respectively. The micro-rod LEDs exhibited intense emission of visible light, even after transfer onto the flexible polymer substrate, and reliable operation was achieved following numerous cycles of mechanical deformation.

  9. Influence of growth temperature and temperature ramps on deep level defect incorporation in m-plane GaN

    SciTech Connect

    Armstrong, A. M.; Kelchner, K.; Nakamura, S.; DenBaars, S. P.; Speck, J. S.

    2013-12-02

    The dependence of deep level defect incorporation in m-plane GaN films grown by metal-organic chemical vapor deposition on bulk m-plane GaN substrates as a function of growth temperature (T{sub g}) and T{sub g} ramping method was investigated using deep level optical spectroscopy. Understanding the influence of T{sub g} on GaN deep level incorporation is important for InGaN/GaN multi-quantum well (MQW) light emitting diodes (LEDs) and laser diodes (LDs) because GaN quantum barrier (QB) layers are grown much colder than thin film GaN to accommodate InGaN QW growth. Deep level spectra of low T{sub g} (800 °C) GaN films grown under QB conditions were compared to deep level spectra of high T{sub g} (1150 °C) GaN. Reducing T{sub g}, increased the defect density significantly (>50×) through introduction of emergent deep level defects at 2.09 eV and 2.9 eV below the conduction band minimum. However, optimizing growth conditions during the temperature ramp when transitioning from high to low T{sub g} substantially reduced the density of these emergent deep levels by approximately 40%. The results suggest that it is important to consider the potential for non-radiative recombination in QBs of LED or LD active regions, and tailoring the transition from high T{sub g} GaN growth to active layer growth can mitigate such non-radiative channels.

  10. White emission from non-planar InGaN/GaN MQW LEDs grown on GaN template with truncated hexagonal pyramids.

    PubMed

    Lee, Ming-Lun; Yeh, Yu-Hsiang; Tu, Shang-Ju; Chen, P C; Lai, Wei-Chih; Sheu, Jinn-Kong

    2015-04-06

    Non-planar InGaN/GaN multiple quantum well (MQW) structures are grown on a GaN template with truncated hexagonal pyramids (THPs) featuring c-plane and r-plane surfaces. The THP array is formed by the regrowth of the GaN layer on a selective-area Si-implanted GaN template. Transmission electron microscopy shows that the InGaN/GaN epitaxial layers regrown on the THPs exhibit different growth rates and indium compositions of the InGaN layer between the c-plane and r-plane surfaces. Consequently, InGaN/GaN MQW light-emitting diodes grown on the GaN THP array emit multiple wavelengths approaching near white light.

  11. Visualization of GaN surface potential using terahertz emission enhanced by local defects.

    PubMed

    Sakai, Yuji; Kawayama, Iwao; Nakanishi, Hidetoshi; Tonouchi, Masayoshi

    2015-09-09

    Wide-gap semiconductors have received significant attention for their advantages over existing semiconductors in energy-efficient power devices. To realize stable and reliable wide-gap semiconductor devices, the basic physical properties, such as the electric properties on the surface and at the interface, should be revealed. Here, we report visualization of terahertz (THz) emission from the surface of GaN, which is excited by ultraviolet femtosecond laser pulses. We found that the THz emission is enhanced by defects related to yellow luminescence, and this phenomenon is explained through the modification of band structures in the surface depletion layer owing to trapped electrons at defect sites. Our results demonstrate that the surface potential in a GaN surface could be detected by laser-induced THz emission. Moreover, this method enables feasible evaluation of the distribution of non-radiative defects, which are undetectable with photoluminescence, and it contributes to the realization normally-off GaN devices.

  12. P-type doping of GaN(000\\bar{1}) by magnesium ion implantation

    NASA Astrophysics Data System (ADS)

    Narita, Tetsuo; Kachi, Tetsu; Kataoka, Keita; Uesugi, Tsutomu

    2017-01-01

    Magnesium ion implantation has been performed on a GaN(000\\bar{1}) substrate, whose surface has a high thermal stability, thus allowing postimplantation annealing without the use of a protective layer. The current-voltage characteristics of p-n diodes fabricated on GaN(000\\bar{1}) showed distinct rectification at a turn-on voltage of about 3 V, although the leakage current varied widely among the diodes. Coimplantation with magnesium and hydrogen ions effectively suppressed the leakage currents and device-to-device variations. In addition, an electroluminescence band was observed at wavelengths shorter than 450 nm for these diodes. These results provide strong evidence that implanted magnesium ions create acceptors in GaN(000\\bar{1}).

  13. Visualization of GaN surface potential using terahertz emission enhanced by local defects

    NASA Astrophysics Data System (ADS)

    Sakai, Yuji; Kawayama, Iwao; Nakanishi, Hidetoshi; Tonouchi, Masayoshi

    2015-09-01

    Wide-gap semiconductors have received significant attention for their advantages over existing semiconductors in energy-efficient power devices. To realize stable and reliable wide-gap semiconductor devices, the basic physical properties, such as the electric properties on the surface and at the interface, should be revealed. Here, we report visualization of terahertz (THz) emission from the surface of GaN, which is excited by ultraviolet femtosecond laser pulses. We found that the THz emission is enhanced by defects related to yellow luminescence, and this phenomenon is explained through the modification of band structures in the surface depletion layer owing to trapped electrons at defect sites. Our results demonstrate that the surface potential in a GaN surface could be detected by laser-induced THz emission. Moreover, this method enables feasible evaluation of the distribution of non-radiative defects, which are undetectable with photoluminescence, and it contributes to the realization normally-off GaN devices.

  14. Spontaneously grown GaN and AlGaN nanowires

    NASA Astrophysics Data System (ADS)

    Bertness, K. A.; Roshko, A.; Sanford, N. A.; Barker, J. M.; Davydov, A. V.

    2006-01-01

    We have identified crystal growth conditions in gas-source molecular beam epitaxy (MBE) that lead to spontaneous formation of GaN nanowires with high aspect ratio on Si (1 1 1) substrates. The nanowires were oriented along the GaN c-axis and normal to the substrate surface. Unlike in many other reports of GaN nanowire growth, no metal catalysts were used. Low growth rates at substrate temperatures near 820 °C were combined with high nitrogen flux (partially dissociated with RF plasma excitation) to form well-separated GaN wires with diameters from 50 to 250 nm in diameter and lengths ranging from 2 to 7 μm. The nanowires grew out of an irregular matrix layer containing deep faceted holes. X-ray diffraction indicated that the wires were fully relaxed and aligned to the silicon substrate. The growth morphology was strongly affected by the presence of Al and Be. The changes suggest that surface diffusion is a primary driving force in the growth of GaN nanowires with MBE.

  15. Nanotexturing of GaN light-emitting diode material through mask-less dry etching.

    PubMed

    Dylewicz, Rafal; Khokhar, Ali Z; Wasielewski, Radoslaw; Mazur, Piotr; Rahman, Faiz

    2011-02-04

    We describe a new technique for random surface texturing of a gallium nitride (GaN) light-emitting diode wafer through a mask-less dry etch process. This involves depositing a sub-monolayer film of silica nanospheres (typical diameter of 200 nm) and then subjecting the coated wafer to a dry etch process with enhanced physical bombardment. The silica spheres acting as nanotargets get sputtered and silica fragments are randomly deposited on the GaN epi-layer. Subsequently, the reactive component of the dry etch plasma etches through the exposed GaN surface. Silica fragments act as nanoparticles, locally masking the underlying GaN. The etch rate is much reduced at these sites and consequently a rough topography develops. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) inspections show that random topographic features at the scale of a few tens of nanometres are formed. Optical measurements using angle-resolved photoluminescence show that GaN light-emitting diode material thus roughened has the capability to extract more light from within the epilayers.

  16. Nanotexturing of GaN light-emitting diode material through mask-less dry etching

    NASA Astrophysics Data System (ADS)

    Dylewicz, Rafal; Khokhar, Ali Z.; Wasielewski, Radoslaw; Mazur, Piotr; Rahman, Faiz

    2011-02-01

    We describe a new technique for random surface texturing of a gallium nitride (GaN) light-emitting diode wafer through a mask-less dry etch process. This involves depositing a sub-monolayer film of silica nanospheres (typical diameter of 200 nm) and then subjecting the coated wafer to a dry etch process with enhanced physical bombardment. The silica spheres acting as nanotargets get sputtered and silica fragments are randomly deposited on the GaN epi-layer. Subsequently, the reactive component of the dry etch plasma etches through the exposed GaN surface. Silica fragments act as nanoparticles, locally masking the underlying GaN. The etch rate is much reduced at these sites and consequently a rough topography develops. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) inspections show that random topographic features at the scale of a few tens of nanometres are formed. Optical measurements using angle-resolved photoluminescence show that GaN light-emitting diode material thus roughened has the capability to extract more light from within the epilayers.

  17. Strain engineering of atomic and electronic structures of few-monolayer-thick GaN

    NASA Astrophysics Data System (ADS)

    Kolobov, A. V.; Fons, P.; Saito, Y.; Tominaga, J.; Hyot, B.; André, B.

    2017-07-01

    Two-dimensional (2D) semiconductors possess the potential to ultimately minimize the size of devices and concomitantly drastically reduce the corresponding energy consumption. In addition, materials in their atomic-scale limit often possess properties different from their bulk counterparts paving the way to conceptually novel devices. While graphene and 2D transition-metal dichalcogenides remain the most studied materials, significant interest also exists in the fabrication of atomically thin structures from traditionally 3D semiconductors such as GaN. While in the monolayer limit GaN possesses a graphenelike structure and an indirect band gap, it was recently demonstrated that few-layer GaN acquires a Haeckelite structure in the direction of growth with an effectively direct gap. In this work, we demonstrate the possibility of strain engineering of the atomic and electronic structure of few-monolayer-thick GaN structures, which opens new avenues for their practical application in flexible nanoelectronics and nano-optoelectronics. Our simulations further suggest that due to the weak van der Waals-like interaction between a substrate and an overlayer, the use of a MoS2 substrate may be a promising route to fabricate few-monolayer Haeckelite GaN experimentally.

  18. Nearly stress-free substrates for GaN homoepitaxy

    NASA Astrophysics Data System (ADS)

    Hermann, M.; Gogova, D.; Siche, D.; Schmidbauer, M.; Monemar, B.; Stutzmann, M.; Eickhoff, M.

    2006-08-01

    High-quality 300 μm thick GaN crack-free layers grown by hydride vapor phase epitaxy (HVPE) on c-plane sapphire without buffer layers and separated from the substrate by laser lift-off were investigated by high resolution X-ray diffraction (XRD), low-temperature photoluminescence and cathodoluminescence. All these characterization techniques confirm the high structural quality of the resulting material. Lateral X-ray mapping of the free-standing bulk-like GaN shows a homogeneous compressive stress of less than 40 MPa and a heterogeneous stress of about 80 MPa. The formation of twin grains (domains) were observed both in the reciprocal space mapping of the (2 0 .5) reflection and in rocking curve measurements. The latter ones revealed an estimated lateral coherence length of about 1.2 μm. The crystallite size along the c-axis is estimated to be larger than 20 μm. An upper limit of the density of dislocations with a component of the Burgers vector along the c-axis (screw and mixed type) of 1.3×10 7 cm -2 was extracted from the XRD data, while transmission electron microscopy measurements revealed a dislocation density of 1.7×10 7 cm -2. Thus, these layers are suitable as lattice-parameter and thermal-expansion matched substrates for strain-free homoepitaxy of GaN-based device heterostructures.

  19. Indium clustering in a-plane InGaN quantum wells as evidenced by atom probe tomography

    SciTech Connect

    Tang, Fengzai; Zhu, Tongtong; Oehler, Fabrice; Fu, Wai Yuen; Griffiths, James T.; Massabuau, Fabien C.-P.; Kappers, Menno J.; Oliver, Rachel A.; Martin, Tomas L.; Bagot, Paul A. J.; Moody, Michael P.

    2015-02-16

    Atom probe tomography (APT) has been used to characterize the distribution of In atoms within non-polar a-plane InGaN quantum wells (QWs) grown on a GaN pseudo-substrate produced using epitaxial lateral overgrowth. Application of the focused ion beam microscope enabled APT needles to be prepared from the low defect density regions of the grown sample. A complementary analysis was also undertaken on QWs having comparable In contents grown on polar c-plane sample pseudo-substrates. Both frequency distribution and modified nearest neighbor analyses indicate a statistically non-randomized In distribution in the a-plane QWs, but a random distribution in the c-plane QWs. This work not only provides insights into the structure of non-polar a-plane QWs but also shows that APT is capable of detecting as-grown nanoscale clustering in InGaN and thus validates the reliability of earlier APT analyses of the In distribution in c-plane InGaN QWs which show no such clustering.

  20. Growth of bulk GaN by HVPE on pressure grown seeds

    NASA Astrophysics Data System (ADS)

    Grzegory, I.; Łucznik, B.; Boćkowski, M.; Pastuszka, B.; Kryśko, M.; Kamler, G.; Nowak, G.; Porowski, S.

    2006-02-01

    Growth of GaN under pressure from solution in gallium results in almost dislocation free plate-like crystals but with size limited to app. 1-2 cm (lateral) and 100 μm (thickness) or up to about 1cm long needles. Deposition of GaN by HVPE on the pressure grown seeds allows stable crystallization (in terms of flatness of the crystallization front and uniformity of the new grown material) at a rate of about 100 μm/h on both types of seed crystals. However, in the thick GaN crystals grown on almost dislocation free plate-like substrates quite a high number of dislocations appears if the crystal thickness exceeds certain critical value. Since the critical thickness for defect generation is of the order of 100 μm, almost dislocation free layers (density below 10 4 cm -2) thinner than 100 μm can be grown. The most obvious further step is removing the substrate and continuation of the HVPE deposition on the free standing low dislocation density layer of sub-critical thickness. The pressure grown substrates were removed by mechanical polishing or conductivity sensitive electrochemical etching (for strongly n-type substrates). Then the HVPE low dislocation density GaN 1platelets were used as substrates for the growth of a few mm thick bulk GaN crystals. The crystals were characterized by defect selective etching of both polar (0001) and non-polar (10 -10) surfaces to check presence and distribution of structural defects. The X-ray measurements allowed concluding about character of strain and deformation in high pressure GaN-HVPE GaN system.

  1. Low-temperature growth of AlN and GaN by metal organic vapor phase epitaxy for polarization engineered water splitting photocathode

    NASA Astrophysics Data System (ADS)

    Nakamura, Akihiro; Suzuki, Michihiro; Fujii, Katsushi; Nakano, Yoshiaki; Sugiyama, Masakazu

    2017-04-01

    Crystal properties of low-temperature grown AlN (LT-AlN) combined with low temperature GaN (LT-GaN) grown by metal organic vapor phase epitaxy (MOVPE) were investigated to obtain a high quality GaN/AlN/GaN structure with a few-nm-thick AlN layer. LT-AlN suppresses unintentional Ga incorporation and can be pseudomorphically grown on GaN with a relatively smooth surface morphology. The lattice of LT-AlN coherent to GaN, however, was found to relax after reactor conditions were changed to grow the subsequent GaN layer at higher temperature. The top GaN layer grown on the relaxed LT-AlN, thus, exhibited a rough surface morphology and a threading dislocation density (TDD) higher than 109 cm-2 estimated from an X-ray diffraction measurement. An LT-GaN capping layer was found to be highly effective for avoiding such lattice relaxation of LT-AlN. The combination of LT-AlN and LT-GaN enables us to obtain a GaN/AlN/GaN junction with high Al content, a low TDD, and abrupt interfaces. As a result, introducing an LT-GaN layer improved the photoelectrochemical (PEC) property of a polarization engineered un-doped GaN/AlN/n-type GaN (u-GaN/AlN/n-GaN) photocathode for water splitting.

  2. Microstructure of GaN films grown on Si(1 1 1) substrates by metalorganic chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Hu, G. Q.; Kong, X.; Wan, L.; Wang, Y. Q.; Duan, X. F.; Lu, Y.; Liu, X. L.

    2003-09-01

    We report the transmission electron microscopy (TEM) study of the microstructure of wurtzitic GaN films grown on Si(1 1 1) substrates with AlN buffer layers by metalorganic chemical vapor deposition (MOCVD) method. An amorphous layer was formed at the interface between Si and AlN when thick GaN film was grown. We propose the amorphous layer was induced by the large stress at the interface when thick GaN was grown. The In 0.1Ga 0.9N/GaN multiple quantum well (MQW) reduced the dislocation density by obstructing the mixed and screw dislocations from passing through the MQW. But no evident reduction of the edge dislocations by the MQW was observed. It was found that dislocations located at the boundaries of grains slightly in-plane misoriented have screw component. Inversion domain is also observed.

  3. Size dictated thermal conductivity of GaN

    DOE PAGES

    Thomas Edwin Beechem; McDonald, Anthony E.; Fuller, Elliot James; ...

    2016-04-01

    The thermal conductivity on n- and p-type doped gallium nitride (GaN) epilayers having thickness of 3-4 μm was investigated using time domain thermoreflectance (TDTR). Despite possessing carrier concentrations ranging across 3 decades (1015 – 1018 cm–3), n-type layers exhibit a nearly constant thermal conductivity of 180 W/mK. The thermal conductivity of p-type epilayers, in contrast, reduces from 160 to 110 W/mK with increased doping. These trends–and their overall reduction relative to bulk–are explained leveraging established scattering models where it is shown that size effects play a primary role in limiting thermal conductivity for layers even tens of microns thick. GaNmore » device layers, even of pristine quality, will therefore exhibit thermal conductivities less than the bulk value of 240 W/mK owing to their finite thickness.« less

  4. Microwave annealing of Mg-implanted and in situ Be-doped GaN

    NASA Astrophysics Data System (ADS)

    Aluri, Geetha S.; Gowda, Madhu; Mahadik, Nadeemullah A.; Sundaresan, Siddarth G.; Rao, Mulpuri V.; Schreifels, John A.; Freitas, J. A.; Qadri, S. B.; Tian, Y.-L.

    2010-10-01

    An ultrafast microwave annealing method, different from conventional thermal annealing, is used to activate Mg-implants in GaN layer. The x-ray diffraction measurements indicated complete disappearance of the defect sublattice peak, introduced by the implantation process for single-energy Mg-implantation, when the annealing was performed at ≥1400 °C for 15 s. An increase in the intensity of Mg-acceptor related luminescence peak (at 3.26 eV) in the photoluminescence spectra confirms the Mg-acceptor activation in single-energy Mg-implanted GaN. In case of multiple-energy implantation, the implant generated defects persisted even after 1500 °C/15 s annealing, resulting in no net Mg-acceptor activation of the Mg-implant. The Mg-implant is relatively thermally stable and the sample surface roughness is 6 nm after 1500 °C/15 s annealing, using a 600 nm thick AlN cap. In situ Be-doped GaN films, after 1300 °C/5 s annealing have shown Be out-diffusion into the AlN layer and also in-diffusion toward the GaN/SiC interface. The in-diffusion and out-diffusion of the Be increased with increasing annealing temperature. In fact, after 1500 °C/5 s annealing, only a small fraction of in situ doped Be remained in the GaN layer, revealing the inadequateness of using Be-implantation for forming p-type doped layers in the GaN.

  5. GaN HEMT with AlGaN back barrier for high power MMIC switch application

    NASA Astrophysics Data System (ADS)

    Chunjiang, Ren; Hongchang, Shen; Zhonghui, Li; Tangsheng, Chen; Bin, Zhang; Tao, Gao

    2015-01-01

    0.25 μm GaN HEMT with AlGaN back barrier for high power switch application has been presented. By introducing AlGaN back barrier, the buffer layer breakdown voltage for the metal-organic chemical vapor deposited AlGaN/GaN hetero-structure on 3-inch SiC substrate showed a considerable increment, which was nearly 4× and 2× of that for the conventional GaN buffer layer and GaN buffer layer with Fe doped, respectively. GaN switch HEMTs with source to drain spacing of 2, 2.5, 3, 3.5 and 4 μm were fabricated on the AlGaN/GaN epitaxial material with AlGaN back barrier and estimated off state power handling for the GaN switch HEMTs were 25.0, 46.2, 64.0, 79.2, and 88.4 W, respectively. A demonstrator DC-12 GHz GaN SPDT MMIC switch was designed in reflective series-shunt-shunt configuration based on the GaN HEMT, with a source to drain spacing of 2.5 μm. The developed SPDT MMIC switch showed a maximum insertion loss of 1.0 dB and a minimum isolation of 30 dB at a frequency range of DC-12 GHz. A power handling capability of 44.1 dBm was achieved at 10 GHz for the MMIC switch with continuous wave power compression measurement.

  6. Surfactant effect of gallium during molecular-beam epitaxy of GaN on AlN (0001)

    NASA Astrophysics Data System (ADS)

    Mula, Guido; Adelmann, C.; Moehl, S.; Oullier, J.; Daudin, B.

    2001-11-01

    We study the adsorption of Ga on (0001) GaN surfaces by reflection high-energy electron diffraction. It is shown that a dynamically stable Ga bilayer can be formed on the GaN surface for appropriate Ga fluxes and substrate temperatures. The influence of the presence of this Ga film on the growth mode of GaN on AlN(0001) by plasma-assisted molecular-beam epitaxy is studied. It is demonstrated that under nearly stoichiometric and N-rich conditions, the GaN layer relaxes elastically during the first stages of epitaxy. At high temperatures the growth follows a Stranski-Krastanov mode, whereas at lower temperatures kinetically formed flat platelets are observed. Under Ga-rich conditions-where a Ga bilayer is rapidly formed due to excess Ga accumulating on the surface-the growth follows a Frank-van der Merwe layer-by-layer mode at any growth temperature and no initial elastic relaxation occurs. Hence, it is concluded that excess Ga acts as a surfactant, effectively suppressing both Stranski-Krastanov islanding and platelet formation. It is further demonstrated that the Stranski-Krastanov transition is in competition with elastic relaxation by platelets, and it is only observed when relaxation by platelets is inefficient. As a result, a growth mode phase diagram is outlined for the growth of GaN on AlN(0001).

  7. Critical impact of Ehrlich-Schwöbel barrier on GaN surface morphology during homoepitaxial growth

    NASA Astrophysics Data System (ADS)

    Kaufmann, Nils. A. K.; Lahourcade, L.; Hourahine, B.; Martin, D.; Grandjean, N.

    2016-01-01

    We discuss the impact of kinetics, and in particular the effect of the Ehrlich-Schwöbel barrier (ESB), on the growth and surface morphology of homoepitaxial GaN layers. The presence of an ESB can lead to various self-assembled surface features, which strongly affect the surface roughness. We present an in-depth study of this phenomenon on GaN homoepitaxial layers grown by metal organic vapor phase epitaxy and molecular beam epitaxy. We show how a proper tuning of the growth parameters allows for the control of the surface morphology, independent of the growth technique.

  8. Dislocation confinement in the growth of Na flux GaN on metalorganic chemical vapor deposition-GaN

    SciTech Connect

    Takeuchi, S. Asazu, H.; Nakamura, Y.; Sakai, A.; Imanishi, M.; Imade, M.; Mori, Y.

    2015-12-28

    We have demonstrated a GaN growth technique in the Na flux method to confine c-, (a+c)-, and a-type dislocations around the interface between a Na flux GaN crystal and a GaN layer grown by metalorganic chemical vapor deposition (MOCVD) on a (0001) sapphire substrate. Transmission electron microscopy (TEM) clearly revealed detailed interface structures and dislocation behaviors that reduced the density of vertically aligned dislocations threading to the Na flux GaN surface. Submicron-scale voids were formed at the interface above the dislocations with a c component in MOCVD-GaN, while no such voids were formed above the a-type dislocations. The penetration of the dislocations with a c component into Na flux GaN was, in most cases, effectively blocked by the presence of the voids. Although some dislocations with a c component in the MOCVD-GaN penetrated into the Na flux GaN, their propagation direction changed laterally through the voids. On the other hand, the a-type dislocations propagated laterally and collectively near the interface, when these dislocations in the MOCVD-GaN penetrated into the Na flux GaN. These results indicated that the dislocation propagation behavior was highly sensitive to the type of dislocation, but all types of dislocations were confined to within several micrometers region of the Na flux GaN from the interface. The cause of void formation, the role of voids in controlling the dislocation behavior, and the mechanism of lateral and collective dislocation propagation are discussed on the basis of TEM results.

  9. Influence of different aspect ratios on the structural and electrical properties of GaN thin films grown on nanoscale-patterned sapphire substrates

    NASA Astrophysics Data System (ADS)

    Lee, Fang-Wei; Ke, Wen-Cheng; Cheng, Chun-Hong; Liao, Bo-Wei; Chen, Wei-Kuo

    2016-07-01

    This study presents GaN thin films grown on nanoscale-patterned sapphire substrates (NPSSs) with different aspect ratios (ARs) using a homemade metal-organic chemical vapor deposition system. The anodic aluminum oxide (AAO) technique is used to prepare the dry etching mask. The cross-sectional view of the scanning electron microscope image shows that voids exist between the interface of the GaN thin film and the high-AR (i.e. ∼2) NPSS. In contrast, patterns on the low-AR (∼0.7) NPSS are filled full of GaN. The formation of voids on the high-AR NPSS is believed to be due to the enhancement of the lateral growth in the initial growth stage, and the quick-merging GaN thin film blocks the precursors from continuing to supply the bottom of the pattern. The atomic force microscopy images of GaN on bare sapphire show a layer-by-layer surface morphology, which becomes a step-flow surface morphology for GaN on a high-AR NPSS. The edge-type threading dislocation density can be reduced from 7.1 × 108 cm-2 for GaN on bare sapphire to 4.9 × 108 cm-2 for GaN on a high-AR NPSS. In addition, the carrier mobility increases from 85 cm2/Vs for GaN on bare sapphire to 199 cm2/Vs for GaN on a high-AR NPSS. However, the increased screw-type threading dislocation density for GaN on a low-AR NPSS is due to the competition of lateral growth on the flat-top patterns and vertical growth on the bottom of the patterns that causes the material quality of the GaN thin film to degenerate. Thus, the experimental results indicate that the AR of the particular patterning of a NPSS plays a crucial role in achieving GaN thin film with a high crystalline quality.

  10. Molecular Beam Epitaxy of GaN Nanowires on Epitaxial Graphene.

    PubMed

    Fernández-Garrido, Sergio; Ramsteiner, Manfred; Gao, Guanhui; Galves, Lauren A; Sharma, Bharat; Corfdir, Pierre; Calabrese, Gabriele; de Souza Schiaber, Ziani; Pfüller, Carsten; Trampert, Achim; Lopes, João Marcelo J; Brandt, Oliver; Geelhaar, Lutz

    2017-09-13

    We demonstrate an all-epitaxial and scalable growth approach to fabricate single-crystalline GaN nanowires on graphene by plasma-assisted molecular beam epitaxy. As substrate, we explore several types of epitaxial graphene layer structures synthesized on SiC. The different structures differ mainly in their total number of graphene layers. Because graphene is found to be etched under active N exposure, the direct growth of GaN nanowires on graphene is only achieved on multilayer graphene structures. The analysis of the nanowire ensembles prepared on multilayer graphene by Raman spectroscopy and transmission electron microscopy reveals the presence of graphene underneath as well as in between nanowires, as desired for the use of this material as contact layer in nanowire-based devices. The nanowires nucleate preferentially at step edges, are vertical, well aligned, epitaxial, and of comparable structural quality as similar structures fabricated on conventional substrates.

  11. Spectroscopic study of semipolar (112{sup ¯}2)-HVPE GaN exhibiting high oxygen incorporation

    SciTech Connect

    Schustek, Philipp; Hocker, Matthias; Thonke, Klaus; Klein, Martin; Scholz, Ferdinand; Simon, Ulrich

    2014-10-28

    Spatially resolved luminescence and Raman spectroscopy investigations are applied to a series of (112{sup ¯}2)-GaN samples grown by hydride vapor phase epitaxy (HVPE) grown over an initial layer deposited by metal organic vapor phase epitaxy on patterned sapphire substrates. Whereas these two differently grown GaN layers are crystallographically homogeneous, they differ largely in their doping level due to high unintentional oxygen uptake in the HVPE layer. This high doping shows up in luminescence spectra, which can be explained by a free-electron recombination band for which an analytical model considering the Burstein-Moss shift, conduction band tailing, and the bandgap renormalization is included. Secondary ion mass spectrometry, Raman spectroscopy, and Hall measurements concordantly determine the electron density to be above 10{sup 19 }cm{sup −3}. In addition, the strain state is assessed by Raman spectroscopy and compared to a finite element analysis.

  12. Doping of GaN by ion implantation: Does It Work?

    SciTech Connect

    Suvkhanov, A.; Wu, W.; Price, K.; Parikh, N.; Irene, E.; Hunn, J.; Thomson, D.; Davis, R.F.; Krasnobaev, L.

    1998-04-01

    Epitaxially grown GaN by metal organic chemical vapor deposition (MOCVD) on SiC were implanted with 100 keV Si{sup +} (for n-type) and 80 keV Mg{sup +} (for p-type) with various fluences from 1 {times} 10{sup 12} to 7 {times} 10 {sup 15} ions/cm{sup 2} at liquid nitrogen temperature (LT), room temperature (RT), and 700 C (HT). High temperature (1,200 C and 1,500 C) annealing was carried out after capping the GaN with epitaxial AlN by MOCVD to study damage recovery. Samples were capped by a layer of AlN in order to protect the GaN surface during annealing. Effects of implant temperature, damage and dopant activation are critically studied to evaluate a role of ion implantation in doping of GaN. The damage was studied by Rutherford Backscattering/Channeling, spectroscopic ellipsometry and photoluminescence. Results show dependence of radiation damage level on temperature of the substrate during implantation: implantations at elevated temperatures up to 550 C decrease the lattice disorder; hot implants above 550 C can not be useful in doping of GaN due to nitrogen loss from the surface. SE measurements have indicated very high sensitivity to the implantation damage. PL measurements at LT of 80 keV Mg{sup +} (5 {times} 10{sup 14} cm{sup 2}) implanted and annealed GaN showed two peaks: one {approximately} 100 meV and another {approximately} 140 meV away from the band edge.

  13. Spatial distribution of carrier concentration in un-doped GaN film grown on sapphire

    NASA Astrophysics Data System (ADS)

    Huang, Y.; Chen, X. D.; Beling, C. D.; Fung, S.; Ling, C. C.

    2004-03-01

    The depth and lateral dependent carrier concentration of un-intentionally doped GaN film grown on sapphire substrate have been studied by temperature-dependent Hall effect measurement, confocal micro-Raman spectroscopy and capacitance-voltage (C-V) measurements. The depth-dependent free carrier concentration extracted from the depth-profiled Raman spectra confirms a non-uniform spatial distribution of free carriers in the GaN film with a highly conductive layer of 1 m thickness near the GaN/sapphire boundary. The temperature dependent Hall data have been analyzed using two-layer model to extract the carrier concentration in the GaN bulk film and in the parallel conduction channel adjacent to the GaN/sapphire boundary. The carrier concentrations of the two layers derived from the Raman technique and the Hall measurements agree with each other. The lateral-dependent carrier concentration of the 2-inch GaN epitaxial wafer has also been studied by micro-Raman spectroscopy and C-V measurements. The line-shape fitting of the Raman A1(LO) coupled modes taken from horizontal lateral-different positions on the wafer yielded a rudimentary spatial map of the carrier concentration. These data are compared well with a lateral-dependent carrier concentration map of the wafer revealed by C-V measurements. The study in the article indicates that Raman spectroscopy of the LO phonon-plasmon mode can be used as a nondestructive and reliable, in situ diagnostic for GaN wafer production.

  14. GaN nanowire arrays with nonpolar sidewalls for vertically integrated field-effect transistors.

    PubMed

    Yu, Feng; Yao, Shengbo; Römer, Friedhard; Witzigmann, Bernd; Schimpke, Tilman; Strassburg, Martin; Bakin, Andrey; Schumacher, Hans Werner; Peiner, Erwin; Wasisto, Hutomo Suryo; Waag, Andreas

    2017-03-03

    Vertically aligned gallium nitride (GaN) nanowire (NW) arrays have attracted a lot of attention because of their potential for novel devices in the fields of optoelectronics and nanoelectronics. In this work, GaN NW arrays have been designed and fabricated by combining suitable nanomachining processes including dry and wet etching. After inductively coupled plasma dry reactive ion etching, the GaN NWs are subsequently treated in wet chemical etching using AZ400K developer (i.e., with an activation energy of 0.69 ± 0.02 eV and a Cr mask) to form hexagonal and smooth a-plane sidewalls. Etching experiments using potassium hydroxide (KOH) water solution reveal that the sidewall orientation preference depends on etchant concentration. A model concerning surface bonding configuration on crystallography facets has been proposed to understand the anisotropic wet etching mechanism. Finally, NW array-based vertical field-effect transistors with wrap-gated structure have been fabricated. A device composed of 99 NWs exhibits enhancement mode operation with a threshold voltage of 1.5 V, a superior electrostatic control, and a high current output of >10 mA, which prevail potential applications in next-generation power switches and high-temperature digital circuits.

  15. GaN nanowire arrays with nonpolar sidewalls for vertically integrated field-effect transistors

    NASA Astrophysics Data System (ADS)

    Yu, Feng; Yao, Shengbo; Römer, Friedhard; Witzigmann, Bernd; Schimpke, Tilman; Strassburg, Martin; Bakin, Andrey; Schumacher, Hans Werner; Peiner, Erwin; Suryo Wasisto, Hutomo; Waag, Andreas

    2017-03-01

    Vertically aligned gallium nitride (GaN) nanowire (NW) arrays have attracted a lot of attention because of their potential for novel devices in the fields of optoelectronics and nanoelectronics. In this work, GaN NW arrays have been designed and fabricated by combining suitable nanomachining processes including dry and wet etching. After inductively coupled plasma dry reactive ion etching, the GaN NWs are subsequently treated in wet chemical etching using AZ400K developer (i.e., with an activation energy of 0.69 ± 0.02 eV and a Cr mask) to form hexagonal and smooth a-plane sidewalls. Etching experiments using potassium hydroxide (KOH) water solution reveal that the sidewall orientation preference depends on etchant concentration. A model concerning surface bonding configuration on crystallography facets has been proposed to understand the anisotropic wet etching mechanism. Finally, NW array-based vertical field-effect transistors with wrap-gated structure have been fabricated. A device composed of 99 NWs exhibits enhancement mode operation with a threshold voltage of 1.5 V, a superior electrostatic control, and a high current output of >10 mA, which prevail potential applications in next-generation power switches and high-temperature digital circuits.

  16. GaN and AlGaN/GaN heterostructures grown on two dimensional BN templates

    NASA Astrophysics Data System (ADS)

    Snure, Michael; Siegel, Gene; Look, David C.; Paduano, Qing

    2017-04-01

    Two dimension materials, like BN and graphene, have been shown to be excellent templates for the growth and fabrication of freestanding III-nitride materials. In this paper we study the effects of BN morphology on GaN and AlGaN/GaN heterostructures grown on these templates. The crystallinity, transport, and optical properties of the GaN layer are examined and found to be well correlated to the BN template. The self-separation of GaN from the BN/sapphire template is also connected to morphology, resulting in freestanding GaN layers. Transport properties of Si doped GaN and AlGaN/GaN heterostructures were examined for different BN templates. The bulk GaN mobility was closely linked to the morphology of the BN template resulting in room temperature mobility from 395 to 520 cm2/Vs. The range in 3D mobility can be linked to increased dislocation densities in GaN grown on rougher BN templates. High 2DEG mobility ( 2000 cm2/Vs at 300 K) is achieved in AlGaN/GaN grown on atomically smooth BN templates, with a sheet electron density of 1×1013 cm-2, comparable to values obtained on conventional substrates. Samples grown on BN/sapphire showed mobilities (at 9 K) from 33000 cm2/Vs to 15200 cm2/Vs depending on BN roughness. The differences are associated with variations in AlGaN/GaN interface-roughness scattering and dislocation density due to the BN template morphology.

  17. Heteroepitaxial VO{sub 2} thin films on GaN: Structure and metal-insulator transition characteristics

    SciTech Connect

    Zhou You; Ramanathan, Shriram

    2012-10-01

    Monolithic integration of correlated oxide and nitride semiconductors may open up new opportunities in solid-state electronics and opto-electronics that combine desirable functional properties of both classes of materials. Here, we report on epitaxial growth and phase transition-related electrical properties of vanadium dioxide (VO{sub 2}) thin films on GaN epitaxial layers on c-sapphire. The epitaxial relation is determined to be (010){sub vo{sub 2}} parallel (0001){sub GaN} parallel (0001){sub A1{sub 2O{sub 3}}} and [100]{sub vo{sub 2}} parallel [1210]{sub GaN} parallel [0110]{sub A1{sub 2O{sub 3}}} from x-ray diffraction. VO{sub 2} heteroepitaxial growth and lattice mismatch are analyzed by comparing the GaN basal plane (0001) with the almost close packed corrugated oxygen plane in vanadium dioxide and an experimental stereographic projection describing the orientation relationship is established. X-ray photoelectron spectroscopy suggests a slightly oxygen rich composition at the surface, while Raman scattering measurements suggests that the quality of GaN layer is not significantly degraded by the high-temperature deposition of VO{sub 2}. Electrical characterization of VO{sub 2} films on GaN indicates that the resistance changes by about four orders of magnitude upon heating, similar to epitaxial VO{sub 2} films grown directly on c-sapphire. It is shown that the metal-insulator transition could also be voltage-triggered at room temperature and the transition threshold voltage scaling variation with temperature is analyzed in the framework of a current-driven Joule heating model. The ability to synthesize high quality correlated oxide films on GaN with sharp phase transition could enable new directions in semiconductor-photonic integrated devices.

  18. The Formation and Characterization of GaN Hexagonal Pyramids

    NASA Astrophysics Data System (ADS)

    Zhang, Shi-Ying; Xiu, Xiang-Qian; Lin, Zeng-Qin; Hua, Xue-Mei; Xie, Zi-Li; Zhang, Rong; Zheng, You-Dou

    2013-05-01

    GaN with hexagonal pyramids is fabricated using the photo-assisted electroless chemical etching method. Defective areas of the GaN substrate are selectively etched in a mixed solution of KOH and K2S2O8 under ultraviolet illumination, producing submicron-sized pyramids. Hexagonal pyramids on the etched GaN with well-defined {101¯1¯} facets and very sharp tips are formed. High-resolution x-ray diffraction shows that etched GaN with pyramids has a higher crystal quality, and micro-Raman spectra reveal a tensile stress relaxation in GaN with pyramids compared with normal GaN. The cathodoluminescence intensity of GaN after etching is significantly increased by three times, which is attributed to the reduction in the internal reflection, high-quality GaN with pyramids and the Bragg effect.

  19. Fabrication and characterization of GaN FETs

    NASA Astrophysics Data System (ADS)

    Binari, S. C.; Kruppa, W.; Dietrich, H. B.; Kelner, G.; Wickenden, A. E.; Freitas, J. A.

    1997-10-01

    The current status of GaN-based FET technology and performance is reviewed. The fabrication details and the dc and microwave characteristics of GaN MESFETs that utilize Si-doped channels on semi-insulating buffer layers are presented. MESFETs with a 0.8 μm gate have exhibited an fT and fmax of 6 and 14 GHz, respectively. These devices have excellent pinchoff characteristics and a source-drain breakdown voltage of over 85 V. A high-field current-collapse phenomenon is observed in these MESFETs in the absence of light. The characteristics of this current collapse as a function of temperature, illuminating wavelength, and time are described. A model describing the current collapse in terms of hot electron injection into the buffer layer is presented.

  20. In situ investigation of growth modes during plasma-assisted molecular beam epitaxy of (0001) GaN

    SciTech Connect

    Koblmueller, G.; Fernandez-Garrido, S.; Calleja, E.; Speck, J. S.

    2007-10-15

    Real-time analysis of the growth modes during homoepitaxial (0001) GaN growth by plasma-assisted molecular beam epitaxy was performed using reflection high energy electron diffraction. A growth mode map was established as a function of Ga/N flux ratio and growth temperature, exhibiting distinct transitions between three-dimensional (3D), layer-by-layer, and step-flow growth modes. The layer-by-layer to step-flow growth transition under Ga-rich growth was surfactant mediated and related to a Ga adlayer coverage of one monolayer. Under N-rich conditions the transition from 3D to layer-by-layer growth was predominantly thermally activated, facilitating two-dimensional growth at temperatures of thermal decomposition.

  1. Self-assembled growth and structural analysis of inclined GaN nanorods on nanoimprinted m-sapphire using catalyst-free metal-organic chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Lee, Kyuseung; Chae, Sooryong; Jang, Jongjin; Min, Daehong; Kim, Jaehwan; Nam, Okhyun

    2016-04-01

    In this study, self-assembled inclined (1-10-3)-oriented GaN nanorods (NRs) were grown on nanoimprinted (10-10) m-sapphire substrates using catalyst-free metal-organic chemical vapor deposition. According to X-ray phi-scans, the inclined GaN NRs were tilted at an angle of ˜57.5° to the [10-10]sapp direction. Specifically, the GaN NRs grew in a single inclined direction to the [11-20]sapp. Uni-directionally inclined NRs were formed through the one-sided (10-11)-faceted growth of the interfacial a-GaN plane layer. It was confirmed that a thin layer of a-GaN was formed on r-facet nanogrooves of the m-sapphire substrate by nitridation. The interfacial a-GaN nucleation affected both the inclined angle and the growth direction of the inclined GaN NRs. Using X-ray diffraction and selective area electron diffraction, the epitaxial relationship between the inclined (1-10-3) GaN NRs and interfacial a-GaN layer on m-sapphire substrates was systematically investigated. Moreover, the inclined GaN NRs were observed to be mostly free of stacking fault-related defects using high-resolution transmission electron microscopy.

  2. Self-assembled growth and structural analysis of inclined GaN nanorods on nanoimprinted m-sapphire using catalyst-free metal-organic chemical vapor deposition

    SciTech Connect

    Lee, Kyuseung; Chae, Sooryong; Jang, Jongjin; Min, Daehong; Kim, Jaehwan; Nam, Okhyun

    2016-04-15

    In this study, self-assembled inclined (1-10-3)-oriented GaN nanorods (NRs) were grown on nanoimprinted (10-10) m-sapphire substrates using catalyst-free metal-organic chemical vapor deposition. According to X-ray phi-scans, the inclined GaN NRs were tilted at an angle of ∼57.5° to the [10-10]{sub sapp} direction. Specifically, the GaN NRs grew in a single inclined direction to the [11-20]{sub sapp}. Uni-directionally inclined NRs were formed through the one-sided (10-11)-faceted growth of the interfacial a-GaN plane layer. It was confirmed that a thin layer of a-GaN was formed on r-facet nanogrooves of the m-sapphire substrate by nitridation. The interfacial a-GaN nucleation affected both the inclined angle and the growth direction of the inclined GaN NRs. Using X-ray diffraction and selective area electron diffraction, the epitaxial relationship between the inclined (1-10-3) GaN NRs and interfacial a-GaN layer on m-sapphire substrates was systematically investigated. Moreover, the inclined GaN NRs were observed to be mostly free of stacking fault-related defects using high-resolution transmission electron microscopy.

  3. III-nitride heterostructure field-effect transistors grown on semi-insulating GaN substrate without regrowth interface charge

    NASA Astrophysics Data System (ADS)

    Liu, J. P.; Ryou, J.-H.; Yoo, D.; Zhang, Y.; Limb, J.; Horne, C. A.; Shen, S.-C.; Dupuis, R. D.; Hanser, A. D.; Preble, E. A.; Evans, K. R.

    2008-03-01

    Charge is observed at the regrowth interface for heterostructure field-effect transistors (HFETs) grown on semi-insulating (SI) bulk GaN substrates, even with Fe doping in the regrown buffer layer for reduction of the interface charge. Ultraviolet photoenhanced chemical (PEC) etching is used to treat the surface of SI bulk GaN substrates. Employing optimized etching conditions, a very smooth surface is achieved for the bulk GaN substrate after the etching. The charge at the regrowth interface is eliminated for HFETs grown on etched SI GaN substrates. Secondary ion mass spectrometry measurements show that the Si impurity concentration at the regrowth interface for HFETs grown on etched SI GaN substrates is much lower than that for HFETs grown on unetched SI GaN substrates, which suggests that the charge-containing layer on the SI substrate is removed by PEC etching and that the effects of the reduced charge layer near the regrowth interface can be eliminated by Fe doping for HFETs grown on etched SI substrates.

  4. Growth of GaN epitaxial films on polycrystalline diamond by metal-organic vapor phase epitaxy

    NASA Astrophysics Data System (ADS)

    Jiang, Quanzhong; Allsopp, Duncan W. E.; Bowen, Chris R.

    2017-04-01

    Heat extraction is often essential in ensuring efficient performance of semiconductor devices and requires minimising the thermal resistance between the functional semiconductor layers and any heat sink. This paper reports the epitaxial growth of N-polar GaN films on polycrystalline diamond substrates of high thermal conductivity with metal-organic vapor phase epitaxy, by using a Si x C layer formed during deposition of polycrystalline diamond on a silicon substrate. The Si x C layer acts to provide the necessary structure ordering information for the formation of a single crystal GaN film at the wafer scale. It is shown that a three-dimensional island (3D) growth process removes hexagonal defects that are induced by the non-single crystal nature of the Si x C layer. It is also shown that intensive 3D growth and the introduction of a convex curvature of the substrate can be deployed to reduce tensile stress in the GaN epitaxy to enable the growth of a crack-free layer up to a thickness of 1.1µm. The twist and tilt can be as low as 0.65° and 0.39° respectively, values broadly comparable with GaN grown on Si substrates with a similar structure.

  5. Growth of AlN and GaN thin films via OMVPE and gas source MBE and their characterization

    NASA Astrophysics Data System (ADS)

    Davis, Robert F.; Weeks, T. W.; Bremser, M. D.; Tanaka, S.; Kern, R. S.; Sitar, Z.; Ailey, K. S.; Perry, W. G.; Wang, C.

    1997-02-01

    Thin films of AlN and GaN are deposited primarily via the common forms of organometallic vapor phase epitaxy (OMVPE) and molecular beam epitaxy (MBE). Sapphire is the most common substrate; however, a host of materials have been used with varying degrees of success. Both growth techniques have been employed by the authors to grow AlN and GaN primarily on 6H-SiC(0001). The mismatch in atomic layer stacking sequences along the growth direction produces inversion domain boundaries in the AlN at the SiC steps; this sequence problem may discourage the nucleation of GaN. Films of AlN and GaN grown by MBE at 650°C are textured; monocrystalline films are achieved at 1050°C by this technique and OMVPE. Donor and acceptor doping of GaN has been achieved via MBE without post growth annealing. Acceptor doping in CVD material requires annealing to displace the H from the Mg and eventually remove it from the material. High brightness light emitting diodes are commercially available; however, numerous concerns regarding metal and nitrogen sources, heteroepitaxial nucleation, the role of buffer layers, surface migration rates as a function of temperature, substantial defect densities and their effect on film and device properties, ohmic and rectifying contacts, wet and dry etching and suitable gate and field insulators must and are being addressed.

  6. High field effects of GaN HEMTs.

    SciTech Connect

    Barker, Joy; Shul, Randy John

    2004-09-01

    This report represents the completion of a Laboratory-Directed Research and Development (LDRD) program to develop and fabricate geometric test structures for the measurement of transport properties in bulk GaN and AlGaN/GaN heterostructures. A large part of this study was spent examining fabrication issues related to the test structures used in these measurements, due to the fact that GaN processing is still in its infancy. One such issue had to do with surface passivation. Test samples without a surface passivation, often failed at electric fields below 50 kV/cm, due to surface breakdown. A silicon nitride passivation layer of approximately 200 nm was used to reduce the effects of surface states and premature surface breakdown. Another issue was finding quality contacts for the material, especially in the case of the AlGaN/GaN heterostructure samples. Poor contact performance in the heterostructures plagued the test structures with lower than expected velocities due to carrier injection from the contacts themselves. Using a titanium-rich ohmic contact reduced the contact resistance and stopped the carrier injection. The final test structures had an etch constriction with varying lengths and widths (8x2, 10x3, 12x3, 12x4, 15x5, and 16x4 {micro}m) and massive contacts. A pulsed voltage input and a four-point measurement in a 50 {Omega} environment was used to determine the current through and the voltage dropped across the constriction. From these measurements, the drift velocity as a function of the applied electric field was calculated and thus, the velocity-field characteristics in n-type bulk GaN and AlGaN/GaN test structures were determined. These measurements show an apparent saturation velocity near to 2.5x10{sup 7} cm/s at 180 kV/cm and 3.1x10{sup 7} cm/s, at a field of 140 kV/cm, for the bulk GaN and AlGaN heterostructure samples, respectively. These experimental drift velocities mark the highest velocities measured in these materials to date and confirm

  7. Heteroepitaxial VO2 thin films on GaN: Structure and metal-insulator transition characteristics

    NASA Astrophysics Data System (ADS)

    Zhou, You; Ramanathan, Shriram

    2012-10-01

    Monolithic integration of correlated oxide and nitride semiconductors may open up new opportunities in solid-state electronics and opto-electronics that combine desirable functional properties of both classes of materials. Here, we report on epitaxial growth and phase transition-related electrical properties of vanadium dioxide (VO2) thin films on GaN epitaxial layers on c-sapphire. The epitaxial relation is determined to be (010)vo2‖(0001)GaN‖(0001)A12O3 and [100]vo2‖[1¯21¯0]A12O3 from x-ray diffraction. VO2 heteroepitaxial growth and lattice mismatch are analyzed by comparing the GaN basal plane (0001) with the almost close packed corrugated oxygen plane in vanadium dioxide and an experimental stereographic projection describing the orientation relationship is established. X-ray photoelectron spectroscopy suggests a slightly oxygen rich composition at the surface, while Raman scattering measurements suggests that the quality of GaN layer is not significantly degraded by the high-temperature deposition of VO2. Electrical characterization of VO2 films on GaN indicates that the resistance changes by about four orders of magnitude upon heating, similar to epitaxial VO2 films grown directly on c-sapphire. It is shown that the metal-insulator transition could also be voltage-triggered at room temperature and the transition threshold voltage scaling variation with temperature is analyzed in the framework of a current-driven Joule heating model. The ability to synthesize high quality correlated oxide films on GaN with sharp phase transition could enable new directions in semiconductor-photonic integrated devices.

  8. Low defect large area semi-polar (112) GaN grown on patterned (113) silicon

    PubMed Central

    Pristovsek, Markus; Han, Yisong; Zhu, Tongtong; Frentrup, Martin; Kappers, Menno J; Humphreys, Colin J; Kozlowski, Grzegorz; Maaskant, Pleun; Corbett, Brian

    2015-01-01

    We report on the growth of semi-polar GaN (112) templates on patterned Si (113) substrates. Trenches were etched in Si (113) using KOH to expose Si {111} sidewalls. Subsequently an AlN layer to prevent meltback etching, an AlGaN layer for stress management, and finally two GaN layers were deposited. Total thicknesses up to 5 m were realised without cracks in the layer. Transmission electron microscopy showed that most dislocations propagate along [0001] direction and hence can be covered by overgrowth from the next trench. The defect densities were below and stacking fault densities less than 100 cm . These numbers are similar to reports on patterned r-plane sapphire. Typical X-ray full width at half maximum (FHWM) were 500” for the asymmetric (00.6) and 450” for the (11.2) reflection. These FHWMs were 50 % broader than reported for patterned r-plane sapphire which is attributed to different defect structures and total thicknesses. The surface roughness shows strong variation on templates. For the final surface roughness the roughness of the sidewalls of the GaN ridges at the time of coalescence are critical. PMID:26212392

  9. Low operation voltage of GaN-based LEDs with Al-doped ZnO upper contact directly on p-type GaN without insert layer

    NASA Astrophysics Data System (ADS)

    Chen, P. H.; Chen, Yu An; Chang, L. C.; Lai, W. C.; Kuo, Cheng Huang

    2015-07-01

    Al-doped ZnO (AZO) film was evaporated on double-side polished sapphire, p-GaN layers, n+-InGaN-GaN short-period superlattice (SPS) structures, and GaN-based light-emitting diodes (LEDs) by e-beam. The AZO film on the p-GaN layer after thermal annealing exhibited an extremely high transparency (98% at 450 nm) and a small specific contact resistance of 2.19 × 10-2 Ω cm2, which was almost the same as that of as-deposited AZO on n+-SPS structure. With 20 mA injection current, the forward voltages were 3.30 and 3.27 V, whereas the output powers were 4.32 and 4.07 mW for the LED with AZO on insert n+-SPS upper contact and the LED with AZO on p-GaN upper contact (without insert layer), respectively. The small specific contact resistance and low operation voltage of LED with AZO on p-GaN upper contact was achieved by rapid thermal annealing (RTA) process.

  10. Theoretical study of gallium nitride molecules, GaN2 and GaN4.

    PubMed

    Tzeli, Demeter; Theodorakopoulos, Giannoula; Petsalakis, Ioannis D

    2008-09-18

    The electronic and geometric structures of gallium dinitride GaN 2, and gallium tetranitride molecules, GaN 4, were systematically studied by employing density functional theory and perturbation theory (MP2, MP4) in conjunction with the aug-cc-pVTZ basis set. In addition, for the ground-state of GaN 4( (2)B 1) a density functional theory study was carried out combining different functionals with different basis sets. A total of 7 minima have been identified for GaN 2, while 37 structures were identified for GaN 4 corresponding to minima, transition states, and saddle points. We report geometries and dissociation energies for all the above structures as well as potential energy profiles, potential energy surfaces and bonding mechanisms for some low-lying electronic states of GaN 4. The dissociation energy of the ground-state GaN 2 ( X (2)Pi) is 1.1 kcal/mol with respect to Ga( (2)P) + N 2( X (1)Sigma g (+)). The ground-state and the first two excited minima of GaN 4 are of (2)B 1( C 2 v ), (2)A 1( C 2 v , five member ring), and (4)Sigma g (-)( D infinityh ) symmetry, respectively. The dissociation energy ( D e) of the ground-state of GaN 4, X (2)B 1, with respect to Ga( (2)P) + 2 N 2( X (1)Sigma g (+)), is 2.4 kcal/mol, whereas the D e of (4)Sigma g (-) with respect to Ga( (4)P) + 2 N 2( X (1)Sigma g (+)) is 17.6 kcal/mol.

  11. Europium doping of zincblende GaN by ion implantation

    SciTech Connect

    Lorenz, K.; Franco, N.; Darakchieva, V.; Alves, E.; Roqan, I. S.; O'Donnell, K. P.; Trager-Cowan, C.; Martin, R. W.; As, D. J.; Panfilova, M.

    2009-06-01

    Eu was implanted into high quality cubic (zincblende) GaN (ZB-GaN) layers grown by molecular beam epitaxy. Detailed structural characterization before and after implantation was performed by x-ray diffraction (XRD) and Rutherford backscattering/channeling spectrometry. A low concentration (<10%) of wurtzite phase inclusions was observed by XRD analysis in as-grown samples with their (0001) planes aligned with the (111) planes of the cubic lattice. Implantation of Eu causes an expansion of the lattice parameter in the implanted region similar to that observed for the c-lattice parameter of wurtzite GaN (W-GaN). For ZB-GaN:Eu, a large fraction of Eu ions is found on a high symmetry interstitial site aligned with the <110> direction, while a Ga substitutional site is observed for W-GaN:Eu. The implantation damage in ZB-GaN:Eu could partly be removed by thermal annealing, but an increase in the wurtzite phase fraction was observed at the same time. Cathodoluminescence, photoluminescence (PL), and PL excitation spectroscopy revealed several emission lines which can be attributed to distinct Eu-related optical centers in ZB-GaN and W-GaN inclusions.

  12. Abnormal variation of the growth rate under high NH3 injected regime in the growth of GaN by NH3-source MBE

    NASA Astrophysics Data System (ADS)

    Choi, Sungkuk; Jung, Soohoon; Cho, Youngji; Lee, Sangtae; Chang, Jiho

    2017-03-01

    Unusual growth-rate variation during GaN formation using gas-source MBE has been discussed with respect to the chemical reactions occurring in the transition layer. A series of samples were prepared to confirm the assumption by verifying the growth regime and the impacts on the crystal quality of the GaN film. We found that the growth rate can be varied along with the amount of NH3 supply even under NH3-rich condition with a fixed Ga flux. Two growth conditions were investigated for their impact on the transition layer. One was the atomic force microscopy result, which revealed that the adatom migration length is closely related to the transition layer formation. The other one is the photoluminescent spectra, which revealed that the luminescence property of GaN is strongly related to the transition layer.

  13. Influence of Vacancy Defect on Surface Feature and Adsorption of Cs on GaN(0001) Surface

    PubMed Central

    Ji, Yanjun; Du, Yujie; Wang, Meishan

    2014-01-01

    The effects of Ga and N vacancy defect on the change in surface feature, work function, and characteristic of Cs adsorption on a (2 × 2) GaN(0001) surface have been investigated using density functional theory with a plane-wave ultrasoft pseudopotential method based on first-principles calculations. The covalent bonds gain strength for Ga vacancy defect, whereas they grow weak for N vacancy defect. The lower work function is achieved for Ga and N vacancy defect surfaces than intact surface. The most stable position of Cs adatom on Ga vacancy defect surface is at T1 site, whereas it is at BGa site on N vacancy defect surface. The E ads of Cs on GaN(0001) vacancy defect surface increases compared with that of intact surface; this illustrates that the adsorption of Cs on intact surface is more stable. PMID:25126599

  14. Fine structure of the red luminescence band in undoped GaN

    SciTech Connect

    Reshchikov, M. A.; Usikov, A.; Helava, H.; Makarov, Yu.

    2014-01-20

    Many point defects in GaN responsible for broad photoluminescence (PL) bands remain unidentified. Their presence in thick GaN layers grown by hydride vapor phase epitaxy (HVPE) detrimentally affects the material quality and may hinder the use of GaN in high-power electronic devices. One of the main PL bands in HVPE-grown GaN is the red luminescence (RL) band with a maximum at 1.8 eV. We observed the fine structure of this band with a zero-phonon line (ZPL) at 2.36 eV, which may help to identify the related defect. The shift of the ZPL with excitation intensity and the temperature-related transformation of the RL band fine structure indicate that the RL band is caused by transitions from a shallow donor (at low temperature) or from the conduction band (above 50 K) to an unknown deep acceptor having an energy level 1.130 eV above the valence band.

  15. Tunnel-injection GaN quantum dot ultraviolet light-emitting diodes

    SciTech Connect

    Verma, Jai; Kandaswamy, Prem Kumar; Protasenko, Vladimir; Verma, Amit; Grace Xing, Huili; Jena, Debdeep

    2013-01-28

    We demonstrate a GaN quantum dot ultraviolet light-emitting diode that uses tunnel injection of carriers through AlN barriers into the active region. The quantum dot heterostructure is grown by molecular beam epitaxy on AlN templates. The large lattice mismatch between GaN and AlN favors the formation of GaN quantum dots in the Stranski-Krastanov growth mode. Carrier injection by tunneling can mitigate losses incurred in hot-carrier injection in light emitting heterostructures. To achieve tunnel injection, relatively low composition AlGaN is used for n- and p-type layers to simultaneously take advantage of effective band alignment and efficient doping. The small height of the quantum dots results in short-wavelength emission and are simultaneously an effective tool to fight the reduction of oscillator strength from quantum-confined Stark effect due to polarization fields. The strong quantum confinement results in room-temperature electroluminescence peaks at 261 and 340 nm, well above the 365 nm bandgap of bulk GaN. The demonstration opens the doorway to exploit many varied features of quantum dot physics to realize high-efficiency short-wavelength light sources.

  16. Epitaxial Growth of GaN Films by Pulse-Mode Hot-Mesh Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Komae, Yasuaki; Yasui, Kanji; Suemitsu, Maki; Endoh, Tetsuo; Ito, Takashi; Nakazawa, Hideki; Narita, Yuzuru; Takata, Masasuke; Akahane, Tadashi

    2009-07-01

    Intermittent gas supplies for hot-mesh chemical vapor deposition (CVD) for the epitaxial growth of gallium nitride (GaN) films were investigated to improve film crystallinity and optical properties. The GaN films were deposited on SiC/Si(111) substrates using an alternating-source gas supply or an intermittent supply of source gases such as ammonia (NH3) and trimethylgallium (TMG) in hot-mesh CVD after deposition of an aluminum nitride (AlN) buffer layer. The AlN layer was deposited using NH3 and trimethylaluminum (TMA) on a SiC layer grown by carbonization of a Si substrate using propane (C3H8). GaN films were grown on the AlN layer by a reaction between NHx radicals generated on a ruthenium (Ru)-coated tungsten (W) mesh and TMG molecules. After testing various gas supply modes, GaN films with good crystallinity and surface morphology were obtained using an intermittent supply of TMG and a continuous supply of NH3 gas. An optimal interval for the TMG gas supply was also obtained for the apparatus employed.

  17. Surfactant assisted growth of MgO films on GaN

    SciTech Connect

    Paisley, E. A.; Shelton, T. C.; Collazo, R.; Sitar, Z.; Maria, J.-P.; Christen, H. M.; Biegalski, M. D.; Mita, S.

    2012-08-27

    Thin epitaxial films of <111> oriented MgO on [0001]-oriented GaN were grown by molecular beam epitaxy and pulsed laser deposition using the assistance of a vapor phase surfactant. In both cases, surfactant incorporation enabled layer-by-layer growth and a smooth terminal surface by stabilizing the {l_brace}111{r_brace} rocksalt facet. Metal-insulator-semiconductor capacitor structures were fabricated on n-type GaN. A comparison of leakage current density for conventional and surfactant-assisted growth reveals a nearly 100 Multiplication-Sign reduction in leakage current density for the surfactant-assisted samples. These data verify numerous predictions regarding the role of H-termination in regulating the habit of rocksalt crystals.

  18. Growth regimes during homoepitaxial growth of GaN by ammonia molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Corrion, A. L.; Wu, F.; Speck, J. S.

    2012-09-01

    c-plane GaN films were grown by ammonia molecular beam epitaxy on metal-organic chemical vapor deposition templates for a wide range of NH3:Ga flux ratios and growth temperatures, and the resulting films were characterized using atomic force microscopy, reflection high-energy electron diffraction, and transmission electron microscopy. Three distinct nitrogen-rich growth regimes—unstable layer-by-layer, quasi-stable step flow, and dislocation-mediated pitting—were identified based on the growth mode and film properties. In addition, step flow growth was observed under conditions of gallium droplet accumulation. The results indicate the existence of two regimes for step-flow growth of GaN by ammonia MBE—both gallium-rich and nitrogen-rich. Growth mode instabilities and mound formation were observed and are discussed in the context of a step-edge energy barrier to adatom diffusion over a terrace.

  19. Microstructural evolution in H ion induced splitting of freestanding GaN

    NASA Astrophysics Data System (ADS)

    Moutanabbir, O.; Scholz, R.; Senz, S.; Gösele, U.; Chicoine, M.; Schiettekatte, F.; Süßkraut, F.; Krause-Rehberg, R.

    2008-07-01

    We investigated the microstructural transformations during hydrogen ion-induced splitting of GaN thin layers. Cross-sectional transmission electron microscopy and positron annihilation spectroscopy data show that the implanted region is decorated with a high density of 1-2nm bubbles resulting from vacancy clustering during implantation. These nanobubbles persist up to 450°C. Ion channeling data show a strong dechanneling enhancement in this temperature range tentatively attributed to strain-induced lattice distortion. The dechanneling level decreases following the formation of plateletlike structures at 475°C. Extended internal surfaces develop around 550°C leading to the exfoliation of GaN thin layer.

  20. Growth regimes during homoepitaxial growth of GaN by ammonia molecular beam epitaxy

    SciTech Connect

    Corrion, A. L.; Wu, F.; Speck, J. S.

    2012-09-01

    c-plane GaN films were grown by ammonia molecular beam epitaxy on metal-organic chemical vapor deposition templates for a wide range of NH{sub 3}:Ga flux ratios and growth temperatures, and the resulting films were characterized using atomic force microscopy, reflection high-energy electron diffraction, and transmission electron microscopy. Three distinct nitrogen-rich growth regimes - unstable layer-by-layer, quasi-stable step flow, and dislocation-mediated pitting - were identified based on the growth mode and film properties. In addition, step flow growth was observed under conditions of gallium droplet accumulation. The results indicate the existence of two regimes for step-flow growth of GaN by ammonia MBE - both gallium-rich and nitrogen-rich. Growth mode instabilities and mound formation were observed and are discussed in the context of a step-edge energy barrier to adatom diffusion over a terrace.

  1. Germanium doping of GaN by metalorganic chemical vapor deposition for polarization screening applications

    NASA Astrophysics Data System (ADS)

    Young, N. G.; Farrell, R. M.; Iza, M.; Nakamura, S.; DenBaars, S. P.; Weisbuch, C.; Speck, J. S.

    2016-12-01

    We demonstrate n-type doping of GaN with Ge by MOCVD at high concentrations that are necessary to fully screen the polarization fields in c-plane InGaN/GaN quantum wells. Hall measurements show linear Ge incorporation with dopant flow rate and carrier concentrations exceeding 1×1020 cm-3. GaN:Ge layers exhibit excellent electron mobility, high conductivity, and contact resistivity comparable to the best unannealed contacts to Si-doped GaN. However, the surface morphology begins to degrade with Ge concentrations above 1×1019 cm-3, resulting in severe step bunching and a network of plateaus and trenches, even in layers as thin as 10 nm.

  2. Characterization of vertical GaN p-n diodes and junction field-effect transistors on bulk GaN down to cryogenic temperatures

    NASA Astrophysics Data System (ADS)

    Kizilyalli, I. C.; Aktas, O.

    2015-12-01

    There is great interest in wide-bandgap semiconductor devices and most recently in vertical GaN structures for power electronic applications such as power supplies, solar inverters and motor drives. In this paper the temperature-dependent electrical behavior of vertical GaN p-n diodes and vertical junction field-effect transistors fabricated on bulk GaN substrates of low defect density (104 to 106 cm-2) is described. Homoepitaxial MOCVD growth of GaN on its native substrate and the ability to control the doping in the drift layers in GaN have allowed the realization of vertical device architectures with drift layer thicknesses of 6 to 40 μm and net carrier electron concentrations as low as 1 × 1015 cm-3. This parameter range is suitable for applications requiring breakdown voltages of 1.2 kV to 5 kV. Mg, which is used as a p-type dopant in GaN, is a relatively deep acceptor (E A ≈ 0.18 eV) and susceptible to freeze-out at temperatures below 200 K. The loss of holes in p-GaN has a deleterious effect on p-n junction behavior, p-GaN contacts and channel control in junction field-effect transistors at temperatures below 200 K. Impact ionization-based avalanche breakdown (BV > 1200 V) in GaN p-n junctions is characterized between 77 K and 423 K for the first time. At higher temperatures the p-n junction breakdown voltage improves due to increased phonon scattering. A positive temperature coefficient in the breakdown voltage is demonstrated down to 77 K; however, the device breakdown characteristics are not as abrupt at temperatures below 200 K. On the other hand, contact resistance to p-GaN is reduced dramatically above room temperature, improving the overall device performance in GaN p-n diodes in all cases except where the n-type drift region resistance dominates the total forward resistance. In this case, the electron mobility can be deconvolved and is found to decrease with T -3/2, consistent with a phonon scattering model. Also, normally-on vertical junction

  3. Resonantly enhanced selective photochemical etching of GaN

    NASA Astrophysics Data System (ADS)

    Trichas, E.; Kayambaki, M.; Iliopoulos, E.; Pelekanos, N. T.; Savvidis, P. G.

    2009-04-01

    Wavelength dependent photochemical etching of GaN films reveals a strong resonant enhancement of the photocurrent at the GaN gap, in close agreement with the excitonic absorption profile of GaN. The corresponding etching rate of GaN strongly correlates with the measured photocurrent. No photocurrent, nor etching is observed for AlGaN films under same excitation conditions. The method could pave the way to the development of truly selective etching of GaN on AlGaN for the fabrication of nitride based optoelectronic devices.

  4. Microstructure of heteroepitaxial GaN grown on mesa-patterned 4H-SiC substrates

    NASA Astrophysics Data System (ADS)

    Bassim, N. D.; Twigg, M. E.; Eddy, C. R.; Henry, R. L.; Holm, R. T.; Culbertson, J. C.; Stahlbush, R. E.; Neudeck, P. G.; Trunek, A. J.; Powell, J. A.

    2004-06-01

    Cross-sectional transmission electron microscopy and atomic force microscopy have been used to study the microstructure of a thin heteroeptiaxial GaN film grown on (0001) 4H-SiC mesa surfaces with and without atomic scale steps. Analysis of a mesa that was completely free of atomic-scale surface steps prior to III -N film deposition showed that these GaN layers had a wide variation in island height (1-3μm ) and included the presence of pit-like defects on the film surface. This sample had a low dislocation density (5×108/cm2) as compared to conventionally grown samples on unpatterned (0001) on-axis 4H-SiC (2×109/cm2), coupled with a 3-5 times increase in grain size. A comparison of a GaN film on the step-free 4H-SiC mesa region with a GaN film on a stepped 4H-SiC mesa region on the same substrate showed that the presence of surface steps reduced the overall grain size of the film from 7-10μm to a grain size of about 2-3μm. Since the GaN films grow via a Volmer-Weber mechanism, a decrease in the number of heterogeneous nucleation sites may allow the growth of large GaN islands before coalescence, thus reducing the number of threading dislocations. These results are promising for the further development of unique, low-dislocation density active regions for GaN device structures on 4H-SiC.

  5. Direct growth of GaN on off-oriented SiC (0001) by molecular-beam epitaxy for GaN/SiC heterojunction bipolar transistor

    NASA Astrophysics Data System (ADS)

    Nakano, Y.; Suda, J.; Kimoto, T.

    2005-05-01

    Direct growth of GaN on misoriented 4H- and 6H-SiC (0001) Si-face substrates and electrical characteristics of n-GaN/p-SiC heterojunction mesa diodes are presented. GaN was grown by molecular-beam epitaxy (MBE) using elemental Ga and rf plasma-excited active nitrogen. SiC substrates misoriented 8° toward the [11-20] direction were used in this study. The surfaces of MBE-grown GaN layers have wavy features with peak-to-valley height of 30 nm. These features originated from the substrate misorientation. It was found that step bunching and large faceting along [01-10] and [10-10] directions occurred during the growth of GaN. Lowering the growth temperature suppresses large faceting, and results in reduction of the peak-to-valley height to 3 nm. However, the surface still has the same undulating features (on a smaller length scale). Mesa diodes were fabricated from the grown GaN layers. The correlation between the diode electrical characteristics and GaN growth conditions is discussed.

  6. Interfacial chemistry and valence band offset between GaN and Al{sub 2}O{sub 3} studied by X-ray photoelectron spectroscopy

    SciTech Connect

    Duan, T. L.; Ang, D. S.; Pan, J. S.

    2013-05-20

    The interface region between Ga-face n-type GaN and Al{sub 2}O{sub 3} dielectric (achieved via atomic-layer deposition or ALD) is investigated by X-ray photoelectron spectroscopy (XPS). An increase in the Ga-O to Ga-N bond intensity ratio following Al{sub 2}O{sub 3} deposition implies that the growth of an interfacial gallium sub-oxide (GaO{sub x}) layer occurred during the ALD process. This finding may be ascribed to GaN oxidation, which may still happen following the reduction of a thin native GaO{sub x} by trimethylaluminum (TMA) in the initial TMA-only cycles. The valence band offset between GaN and Al{sub 2}O{sub 3}, obtained using both core-level and valence band spectra, is found to vary with the thickness of the deposited Al{sub 2}O{sub 3}. This observation may be explained by an upward energy band bending at the GaN surface (due to the spontaneous polarization induced negative bound charge on the Ga-face GaN) and the intrinsic limitation of the XPS method for band offset determination.

  7. Robust Visible and Infrared Light Emitting Devices Using Rare-Earth-Doped GaN

    DTIC Science & Technology

    2006-05-31

    is encapsulated within thin barium titanate (BTO) dielectric layers for enhanced charge trapping at phosphor-dielectric interface. A high density...XRD). Fig. 3 illustrates the XRD spectra for the 4 15 min IGE and 60 min MBE GaN samples . The inserts of Fig. 3 show SEM microphotographs of both... samples grown using various 3 20 min IGE and 60 min MBE on Si substrates. Above bandgap PL was measured at room temperature under 325nm HeCd laser

  8. Halogen-free vapor phase epitaxy for high-rate growth of GaN bulk crystals

    NASA Astrophysics Data System (ADS)

    Nakamura, Daisuke; Kimura, Taishi; Horibuchi, Kayo

    2017-04-01

    Here, we propose a halogen-free vapor phase epitaxy (HF-VPE) technique to grow bulk GaN single crystals. This technique employs the simplest reaction for GaN synthesis (reaction of Ga vapor with NH3) and can potentially achieve a high growth rate, a prolonged growth duration, a high crystal quality, and a low cost. The analyses of thick HF-VPE-GaN layers grown under optimized growth conditions revealed that high-quality crystals, both in terms of dislocation density and impurity concentration, are obtained at high growth rates of over 100 µm/h.

  9. The Effect of Hydrogen Carrier Gas on the Morphological Evolution and Material Properties of GaN on Sapphire

    SciTech Connect

    Ng, T.B.; Han, J.; Biefeld, R.M.; Zolper, J.C.; Crawford, M.H.; Follstaell, D.M.

    1998-01-01

    In-situ optical reflectance is used to monitor the morphological evolution of the two-step GaN growth on sapphire. The amount of H{sub 2} carrier gas used in the growth is observed to strongly influence the morphological evolution of the low temperature buffer layer and the subsequent high temperature nucleation behavior, which in turn affects the structural and electrical properties of the GaN epitaxial films. The optical reflectance transients correlate with the sizes and distributions of nuclei as observed by AFM.

  10. Structural and optical properties of vanadium ion-implanted GaN

    NASA Astrophysics Data System (ADS)

    Macková, A.; Malinský, P.; Jagerová, A.; Sofer, Z.; Klímová, K.; Sedmidubský, D.; Mikulics, M.; Lorinčík, J.; Veselá, D.; Böttger, R.; Akhmadaliev, S.

    2017-09-01

    The field of advanced electronic and optical devices searches for a new generation of transistors and lasers. The practical development of these novel devices depends on the availability of materials with the appropriate magnetic and optical properties, which is strongly connected to the internal morphology and the structural properties of the prepared doped structures. In this contribution, we present the characterisation of V ion-doped GaN epitaxial layers. GaN layers, oriented along the (0 0 0 1) crystallographic direction, grown by low-pressure metal-organic vapour-phase epitaxy (MOVPE) on c-plane sapphire substrates were implanted with 400 keV V+ ions at fluences of 5 × 1015 and 5 × 1016 cm-2. Elemental depth profiling was accomplished by Rutherford Backscattering Spectrometry (RBS) and Secondary Ion Mass Spectrometry (SIMS) to obtain precise information about the dopant distribution. Structural investigations are needed to understand the influence of defect distribution on the crystal-matrix recovery and the desired structural and optical properties. The structural properties of the ion-implanted layers were characterised by RBS-channelling and Raman spectroscopy to get a comprehensive insight into the structural modification of implanted GaN and to study the influence of subsequent annealing on the crystalline matrix reconstruction. Photoluminescence measurement was carried out to check the optical properties of the prepared structures.

  11. Vertical GaN power diodes with a bilayer edge termination

    SciTech Connect

    Dickerson, Jeramy R.; Allerman, Andrew A.; Bryant, Benjamin N.; Fischer, Arthur J.; King, Michael P.; Moseley, Michael W.; Armstrong, Andrew M.; Kaplar, Robert J.; Kizilyalli, Isik C.; Aktas, Ozgur; Wierer, Jr., Jonathan J.

    2015-12-07

    Vertical GaN power diodes with a bilayer edge termination (ET) are demonstrated. The GaN p-n junction is formed on a low threading dislocation defect density (104 - 105 cm-2) GaN substrate, and has a 15-μm-thick n-type drift layer with a free carrier concentration of 5 × 1015 cm-3. The ET structure is formed by N implantation into the p+-GaN epilayer just outside the p-type contact to create compensating defects. The implant defect profile may be approximated by a bilayer structure consisting of a fully compensated layer near the surface, followed by a 90% compensated (p) layer near the n-type drift region. These devices exhibit avalanche breakdown as high as 2.6 kV at room temperature. In addition simulations show that the ET created by implantation is an effective way to laterally distribute the electric field over a large area. This increases the voltage at which impact ionization occurs and leads to the observed higher breakdown voltages.

  12. Vertical GaN power diodes with a bilayer edge termination

    DOE PAGES

    Dickerson, Jeramy R.; Allerman, Andrew A.; Bryant, Benjamin N.; ...

    2015-12-07

    Vertical GaN power diodes with a bilayer edge termination (ET) are demonstrated. The GaN p-n junction is formed on a low threading dislocation defect density (104 - 105 cm-2) GaN substrate, and has a 15-μm-thick n-type drift layer with a free carrier concentration of 5 × 1015 cm-3. The ET structure is formed by N implantation into the p+-GaN epilayer just outside the p-type contact to create compensating defects. The implant defect profile may be approximated by a bilayer structure consisting of a fully compensated layer near the surface, followed by a 90% compensated (p) layer near the n-type driftmore » region. These devices exhibit avalanche breakdown as high as 2.6 kV at room temperature. In addition simulations show that the ET created by implantation is an effective way to laterally distribute the electric field over a large area. This increases the voltage at which impact ionization occurs and leads to the observed higher breakdown voltages.« less

  13. GaN based LEDs with semipolar QWs employing embedded sub-micrometer sized selectively grown 3D structures

    NASA Astrophysics Data System (ADS)

    Leute, R. A. R.; Heinz, D.; Wang, J.; Lipski, F.; Meisch, T.; Thonke, K.; Thalmair, J.; Zweck, J.; Scholz, F.

    2013-05-01

    We present LED structures with embedded semipolar {101¯1} quantum wells based on 2-inch c-plane GaN templates grown on c-plane sapphire substrates. Using selective area epitaxy, we achieved periodic GaN stripe structures with triangular cross-section with dimensions of a few 100 nm on continuous areas of several cm2. These structures exhibit semipolar side facets on which GaInN quantum wells with reduced piezoelectric fields have been deposited. The small dimensions of these structures allow complete embedding by GaN cladding layers eventually resulting in a flat c-plane surface. Consequently, our approach allows conventional device processing to be applied. Structural, optical, and electrical characterization is presented and the influence of mask material and pattern on the performances of LED structures is investigated.

  14. Low-dislocation-density, nonplanar GaN templates for buried heterostructure lasers grown by lateral epitaxial overgrowth

    NASA Astrophysics Data System (ADS)

    Ren, Dawei; Zhou, Wei; Dapkus, P. Daniel

    2005-03-01

    We report here the formation of nonplanar GaN templates, which consist of low-dislocation-density, naturally grown GaN ridge mesas, as a mean to facilitate the fabrication of buried heterostructure lasers. Defect reduction is realized by introducing a two-step lateral epitaxial overgrowth procedure that utilizes dislocation bending in the formation of pyramidal mesas to eradicate the threading dislocations that originate from a planar buffer layer. Transmission electron microscopy and atomic force microscopy indicate a mesa top facet having low defect density (˜8×107cm-2), atomic flatness (˜0.29nm mean roughness). Our demonstration has opened the possibility of forming buried heterostructure lasers on nonplanar GaN templates.

  15. Wafer-scale Fabrication of Non-Polar Mesoporous GaN Distributed Bragg Reflectors via Electrochemical Porosification

    NASA Astrophysics Data System (ADS)

    Zhu, Tongtong; Liu, Yingjun; Ding, Tao; Fu, Wai Yuen; Jarman, John; Ren, Christopher Xiang; Kumar, R. Vasant; Oliver, Rachel A.

    2017-03-01

    Distributed Bragg reflectors (DBRs) are essential components for the development of optoelectronic devices. For many device applications, it is highly desirable to achieve not only high reflectivity and low absorption, but also good conductivity to allow effective electrical injection of charges. Here, we demonstrate the wafer-scale fabrication of highly reflective and conductive non-polar gallium nitride (GaN) DBRs, consisting of perfectly lattice-matched non-polar (11-20) GaN and mesoporous GaN layers that are obtained by a facile one-step electrochemical etching method without any extra processing steps. The GaN/mesoporous GaN DBRs exhibit high peak reflectivities (>96%) across the entire visible spectrum and wide spectral stop-band widths (full-width at half-maximum >80 nm), while preserving the material quality and showing good electrical conductivity. Such mesoporous GaN DBRs thus provide a promising and scalable platform for high performance GaN-based optoelectronic, photonic, and quantum photonic devices.

  16. Wafer-scale Fabrication of Non-Polar Mesoporous GaN Distributed Bragg Reflectors via Electrochemical Porosification

    PubMed Central

    Zhu, Tongtong; Liu, Yingjun; Ding, Tao; Fu, Wai Yuen; Jarman, John; Ren, Christopher Xiang; Kumar, R. Vasant; Oliver, Rachel A.

    2017-01-01

    Distributed Bragg reflectors (DBRs) are essential components for the development of optoelectronic devices. For many device applications, it is highly desirable to achieve not only high reflectivity and low absorption, but also good conductivity to allow effective electrical injection of charges. Here, we demonstrate the wafer-scale fabrication of highly reflective and conductive non-polar gallium nitride (GaN) DBRs, consisting of perfectly lattice-matched non-polar (11–20) GaN and mesoporous GaN layers that are obtained by a facile one-step electrochemical etching method without any extra processing steps. The GaN/mesoporous GaN DBRs exhibit high peak reflectivities (>96%) across the entire visible spectrum and wide spectral stop-band widths (full-width at half-maximum >80 nm), while preserving the material quality and showing good electrical conductivity. Such mesoporous GaN DBRs thus provide a promising and scalable platform for high performance GaN-based optoelectronic, photonic, and quantum photonic devices. PMID:28345612

  17. Fabrication of normally-off GaN nanowire gate-all-around FET with top-down approach

    NASA Astrophysics Data System (ADS)

    Im, Ki-Sik; Won, Chul-Ho; Vodapally, Sindhuri; Caulmilone, Raphaël; Cristoloveanu, Sorin; Kim, Yong-Tae; Lee, Jung-Hee

    2016-10-01

    Lateral GaN nanowire gate-all-around transistor has been fabricated with top-down process and characterized. A triangle-shaped GaN nanowire with 56 nm width was implemented on the GaN-on-insulator (GaNOI) wafer by utilizing (i) buried oxide as sacrificial layer and (ii) anisotropic lateral wet etching of GaN in tetramethylammonium hydroxide solution. During subsequent GaN and AlGaN epitaxy of source/drain planar regions, no growth occurred on the nanowire, due to self-limiting growth property. Transmission electron microscopy and energy-dispersive X-ray spectroscopy elemental mapping reveal that the GaN nanowire consists of only Ga and N atoms. The transistor exhibits normally-off operation with the threshold voltage of 3.5 V and promising performance: the maximum drain current of 0.11 mA, the maximum transconductance of 0.04 mS, the record off-state leakage current of ˜10-13 A/mm, and a very high Ion/Ioff ratio of 108. The proposed top-down device concept using the GaNOI wafer enables the fabrication of multiple parallel nanowires with positive threshold voltage and is advantageous compared with the bottom-up approach.

  18. Multicycle rapid thermal annealing optimization of Mg-implanted GaN: Evolution of surface, optical, and structural properties

    NASA Astrophysics Data System (ADS)

    Greenlee, Jordan D.; Feigelson, Boris N.; Anderson, Travis J.; Tadjer, Marko J.; Hite, Jennifer K.; Mastro, Michael A.; Eddy, Charles R.; Hobart, Karl D.; Kub, Francis J.

    2014-08-01

    The first step of a multi-cycle rapid thermal annealing process was systematically studied. The surface, structure, and optical properties of Mg implanted GaN thin films annealed at temperatures ranging from 900 to 1200 °C were investigated by Raman spectroscopy, photoluminescence, UV-visible spectroscopy, atomic force microscopy, and Nomarski microscopy. The GaN thin films are capped with two layers of in-situ metal organic chemical vapor deposition -grown AlN and annealed in 24 bar of N2 overpressure to avoid GaN decomposition. The crystal quality of the GaN improves with increasing annealing temperature as confirmed by UV-visible spectroscopy and the full widths at half maximums of the E2 and A1 (LO) Raman modes. The crystal quality of films annealed above 1100 °C exceeds the quality of the as-grown films. At 1200 °C, Mg is optically activated, which is determined by photoluminescence measurements. However, at 1200 °C, the GaN begins to decompose as evidenced by pit formation on the surface of the samples. Therefore, it was determined that the optimal temperature for the first step in a multi-cycle rapid thermal anneal process should be conducted at 1150 °C due to crystal quality and surface morphology considerations.

  19. The effect of substrate on high-temperature annealing of GaN epilayers: Si versus sapphire

    SciTech Connect

    Pastor, D.; Cusco, R.; Artus, L.; Gonzalez-Diaz, G.; Iborra, E.; Jimenez, J.; Peiro, F.; Calleja, E.

    2006-08-15

    We have studied the effects of rapid thermal annealing at 1300 deg.C on GaN epilayers grown on AlN buffered Si(111) and on sapphire substrates. After annealing, the epilayers grown on Si display visible alterations with craterlike morphology scattered over the surface. The annealed GaN/Si layers were characterized by a range of experimental techniques: scanning electron microscopy, optical confocal imaging, energy dispersive x-ray microanalysis, Raman scattering, and cathodoluminescence. A substantial Si migration to the GaN epilayer was observed in the crater regions, where decomposition of GaN and formation of Si{sub 3}N{sub 4} crystallites as well as metallic Ga droplets and Si nanocrystals have occurred. The average diameter of the Si nanocrystals was estimated from Raman scattering to be around 3 nm. Such annealing effects, which are not observed in GaN grown on sapphire, are a significant issue for applications of GaN grown on Si(111) substrates when subsequent high-temperature processing is required.

  20. Multicycle rapid thermal annealing optimization of Mg-implanted GaN: Evolution of surface, optical, and structural properties

    SciTech Connect

    Greenlee, Jordan D.; Feigelson, Boris N.; Anderson, Travis J.; Hite, Jennifer K.; Mastro, Michael A.; Eddy, Charles R.; Hobart, Karl D.; Kub, Francis J.; Tadjer, Marko J.

    2014-08-14

    The first step of a multi-cycle rapid thermal annealing process was systematically studied. The surface, structure, and optical properties of Mg implanted GaN thin films annealed at temperatures ranging from 900 to 1200 °C were investigated by Raman spectroscopy, photoluminescence, UV-visible spectroscopy, atomic force microscopy, and Nomarski microscopy. The GaN thin films are capped with two layers of in-situ metal organic chemical vapor deposition -grown AlN and annealed in 24 bar of N{sub 2} overpressure to avoid GaN decomposition. The crystal quality of the GaN improves with increasing annealing temperature as confirmed by UV-visible spectroscopy and the full widths at half maximums of the E{sub 2} and A{sub 1} (LO) Raman modes. The crystal quality of films annealed above 1100 °C exceeds the quality of the as-grown films. At 1200 °C, Mg is optically activated, which is determined by photoluminescence measurements. However, at 1200 °C, the GaN begins to decompose as evidenced by pit formation on the surface of the samples. Therefore, it was determined that the optimal temperature for the first step in a multi-cycle rapid thermal anneal process should be conducted at 1150 °C due to crystal quality and surface morphology considerations.