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Sample records for adhesive thermal conductivity

  1. D0 Silicon Upgrade: Thermal Conductivity Measurements of Adhesives and Metal Strips

    SciTech Connect

    Jostlein, H.; Schmidgall, N.; /Fermilab

    1995-08-10

    This note is a followup to previous work done relating to thermal conductivity tests for the DO Silicon Upgrade. The testing of adhesives described here was done as outlined in the above mentioned note; therefore, the experimental setup and design for testing adhesives is marginally described here. However, some strips were tested to determine their thermal conductivity which utilized a different testing setup. That setup is described here as well. The measured thermal conductivities of the adhesives show Ablefilm 563K to have the highest thermal conductivity value of 0.89 W/m-K. The strip tests also showed that a consistent thermal conductivity value can be obtained for a strip within 5%.

  2. Metalized nanotube tips improve through thickness thermal conductivity in adhesive joints.

    PubMed

    Ganguli, Sabyasachi; Sihn, Sangwook; Roy, Ajit K; Dai, Liming; Qu, Liangti

    2009-03-01

    The through-thickness thermal conductivity in conventional adhesive joints (of approximately 0.3 W/m-K) fails to meet the thermal load transfer requirement in numerous applications to enable lean manufacturing and improve system reliability to thermal load. Carbon nanotubes are known to possess extremely high thermal conductivity along the longitudinal axis. According to molecular dynamics simulations, the value can be as high as 3500 W/m-K at room temperature for multi-walled carbon nanotubes (MWCNT). Meanwhile, the transverse thermal conductivity perpendicular to the longitudinal axis of the MWCNTs is known to be relatively low, approximately 10-15 W/m-K. Existing studies of mixing the MWCNTs in polymers for adhesive joints only achieved minimal enhancement in the thermal conductivity and failed to satisfy the thermal property requirement for the adhesive joints. In order to properly utilize the superior axial thermal conductivity of the MWCNTs, vertically aligned MWCNTs have been used in this study and incorporated in the adhesive joint configuration. Analytical parametric study was conducted to identify critical parameters that affect the overall thermal conductivity of the joint and to provide guidelines for the process development. The process development involved growing the vertically aligned MWCNTs on silicon wafers. The aligned nanotube array was partially infused with epoxy adhesive. Selective reactive ion etching of the epoxy revealed the nanotube tips. In order to reduce the impedance mismatch and phonon scattering at the interface between the nanotube tips and the adherends, gold was thermally evaporated on the nanotube tips. The measured thermal conductivity of the adhesive joint device incorporating the MWCNTs was 262 W/m-K, which is significantly larger compared to that of less than 1 W/m-K without the MWCNTs. PMID:19435032

  3. Correlation Between Thermal Interface Conductance and Mechanical Adhesion Strength in Cu-Coated Glassy Carbon

    NASA Astrophysics Data System (ADS)

    Pelzl, J.; Kijamnajsuk, P.; Chirtoc, M.; Horny, N.; Eisenmenger-Sittner, C.

    2015-09-01

    The influence of defective areas in the interface on the correlation between the thermal interface conductance and the mechanical adhesion strength was investigated on as-prepared and heat-treated samples of copper-coated carbon flat specimens with different bonding layers between the copper film and the substrate. The thermal interface conductance was determined by frequency-domain photothermal radiometry. The mechanical adhesion strength of the film coating was deduced from pull-off experiments. The imperfect interfaces were modeled by two different values for the thermal interface conductance, G1 and G2, which co-exist at different areas on the interface and are weighted according to their areas, A1 and A2. The model parameters were determined by adjusting the frequency dependence of the normalized phases and phase differences of the PTR signals from as-prepared and heat-treated samples. The total thermal conductance of the interface was found to exhibit a correlation with the adhesion strength for most of the heat-treated samples whereas, among the as-prepared samples, considerable deviations from such a trend exist. The observations are explained by the impact of supplementary stress on the adhesion strength measurements which are due to the strain developed during the preparation process at the interface. The interfacial stress and strain are mostly released during thermal annealing. A semi-empirical formula was developed that describes the impact of the defective areas on the adhesion strength using the experimentally determined thermal model parameters.

  4. Qualitative link between work of adhesion and thermal conductance of metal/diamond interfaces

    SciTech Connect

    Monachon, Christian Weber, Ludger; Schusteritsch, Georg; Kaxiras, Efthimios

    2014-03-28

    We report Time-Domain ThermoReflectance experiments measuring the Thermal Boundary Conductance (TBC) of interfaces between diamond and metal surfaces, based on samples consisting of [111]-oriented diamond substrates with hydrogen or with sp{sup 2} carbon surface terminations created using plasma treatments. In a concurrent theoretical study, we calculate the work of adhesion between Ni, Cu, and diamond interfaces with (111) surface orientation, with or without hydrogen termination of the diamond surface, using first-principles electronic structure calculations based on density functional theory (DFT). We find a positive correlation between the calculated work of adhesion and the measured conductance of these interfaces, suggesting that DFT could be used as a screening tool to identify metal/dielectric systems with high TBC. We also explain the negative effect of hydrogen on the thermal conductance of metal/diamond interfaces.

  5. Double-Wall Nanotubes and Graphene Nanoplatelets for Hybrid Conductive Adhesives with Enhanced Thermal and Electrical Conductivity.

    PubMed

    Messina, Elena; Leone, Nancy; Foti, Antonino; Di Marco, Gaetano; Riccucci, Cristina; Di Carlo, Gabriella; Di Maggio, Francesco; Cassata, Antonio; Gargano, Leonardo; D'Andrea, Cristiano; Fazio, Barbara; Maragò, Onofrio Maria; Robba, Benedetto; Vasi, Cirino; Ingo, Gabriel Maria; Gucciardi, Pietro Giuseppe

    2016-09-01

    Improving the electrical and thermal properties of conductive adhesives is essential for the fabrication of compact microelectronic and optoelectronic power devices. Here we report on the addition of a commercially available conductive resin with double-wall carbon nanotubes and graphene nanoplatelets that yields simultaneously improved thermal and electrical conductivity. Using isopropanol as a common solvent for the debundling of nanotubes, exfoliation of graphene, and dispersion of the carbon nanostructures in the epoxy resin, we obtain a nanostructured conducting adhesive with thermal conductivity of ∼12 W/mK and resistivity down to 30 μΩ cm at very small loadings (1% w/w for nanotubes and 0.01% w/w for graphene). The low filler content allows one to keep almost unchanged the glass-transition temperature, the viscosity, and the curing parameters. Die shear measurements show that the nanostructured resins fulfill the MIL-STD-883 requirements when bonding gold-metalized SMD components, even after repeated thermal cycling. The same procedure has been validated on a high-conductivity resin characterized by a higher viscosity, on which we have doubled the thermal conductivity and quadrupled the electrical conductivity. Graphene yields better performances with respect to nanotubes in terms of conductivity and filler quantity needed to improve the resin. We have finally applied the nanostructured resins to bond GaN-based high-electron-mobility transistors in power-amplifier circuits. We observe a decrease of the GaN peak and average temperatures of, respectively, ∼30 °C and ∼10 °C, with respect to the pristine resin. The obtained results are important for the fabrication of advanced packaging materials in power electronic and microwave applications and fit the technological roadmap for CNTs, graphene, and hybrid systems. PMID:27538099

  6. Thermal conductance of copper-cyanoacrylate adhesive YBa 2Cu 3O 7-δ joints between 5 and 300 K

    NASA Astrophysics Data System (ADS)

    Wendling, N.; Chaussy, J.; Mazuer, J.; Odin, J.

    We have measured the thermal conductance per unit area of joints made of cyanoacrylate adhesive between a copper block and various YBa 2Cu 2O 7-δ samples. Below 70 K, the thermal resistance is mainly due to the interfaces between materials. A rough estimate of the bulk thermal conductivity in the high temperature range leads to the value of 0.3 W m -1 K -1, i.e. of the same order of magnitude as for other adhesives commonly used in low temperature experimental physics.

  7. Mechanical Properties of Anisotropic Conductive Adhesive Film Under Hygrothermal Aging and Thermal Cycling

    NASA Astrophysics Data System (ADS)

    Gao, Li-Lan; Chen, Xu; Gao, Hong

    2012-07-01

    Mechanical properties of anisotropic conductive adhesive film (ACF) were investigated experimentally under various environmental conditions. The temperature sweep test was conducted to investigate the effects of temperature on dynamical mechanical properties of the ACF. The ACF exhibited transitions to the glass state, viscoelastic state, and rubber state with increasing temperature, and its glass-transition temperature ( T g) was determined to be 149°C. The creep-recovery behaviors of the ACF were investigated, and it was found that the initial strains, instantaneous strains, and creep or recovery rates increased with increasing temperature. No obvious creep phenomenon was observed at low temperatures (≤0°C). The creep strain and creep rates at any time decreased with increasing hygrothermal aging time. The uniaxial tensile behaviors of the ACF were also investigated under hygrothermal aging and thermal cycling. The results show that the Young's modulus and tensile strength of the ACF decrease with increasing hygrothermal aging time; however, they increase at first and then decrease with increasing thermal cycling time. T g decreases slightly for the ACF after hygrothermal aging; however, it increases after thermal cycling.

  8. Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives

    NASA Astrophysics Data System (ADS)

    Cui, Hui-wang; Li, Dong-sheng; Fan, Qiong

    2013-01-01

    To satisfy the high electrical and thermal conductivity required for the continuous development of electronic products, nano hexagonal boron nitride (BN) particles and nano cubic silicon carbide (SiC) particles were added into electrically conductive adhesives (ECAs) to improve the thermal conductivity. BN and SiC had little negative effect on the electrical conductivity, but improved the thermal conductivity significantly. When their content was 1.5 wt. %, the thermal conductivity at 100°C, 150°C and 200°C was increased by 71% (100°C), 78% (150°C) and 70% (200°C), and 114% (100°C), 110% (150°C) and 98% (200°C) respectively for BN and SiC comparing with those of the ECAs with no thermal conductive fillers. This method is simple, easy to do, and can be used practically in electronic packaging.

  9. Thermal Characterization of Adhesive

    NASA Technical Reports Server (NTRS)

    Spomer, Ken A.

    1999-01-01

    The current Space Shuttle Reusable Solid Rocket Motor (RSRM) nozzle adhesive bond system is being replaced due to obsolescence. Down-selection and performance testing of the structural adhesives resulted in the selection of two candidate replacement adhesives, Resin Technology Group's Tiga 321 and 3M's EC2615XLW. This paper describes rocket motor testing of these two adhesives. Four forty-pound charge motors were fabricated in configurations that would allow side by side comparison testing of the candidate replacement adhesives and the current RSRM adhesives. The motors provided an environment where the thermal performance of adhesives in flame surface bondlines was compared. Results of the FPC testing show that: 1) The phenolic char depths on radial bond lines is approximately the same and vary depending on the position in the blast tube regardless of which adhesive was used; 2) The adhesive char depth of the candidate replacement adhesives is less than the char depth of the current adhesives; 3) The heat-affected depth of the candidate replacement adhesives is less than the heat-affected depth of the current adhesives; and 4) The ablation rates for both replacement adhesives are slower than that of the current adhesives.

  10. Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers

    NASA Astrophysics Data System (ADS)

    Jagannadham, K.

    2016-07-01

    An 8 μm epoxy film deposited on a 350 μm Si (100) Si wafer with a 0.4 μm Au transducer film deposited on top of the polymer film was used to evaluate the thermal conductivity, the modulus of the porous film, and the initiation of spalling upon laser beam irradiation on the back side of the Si wafer. The polymer films were characterized for pore microstructure using scanning electron microscopy and energy dispersive spectrometry. The polymer films were characterized using transient thermo reflectance (TTR) with laser beams illuminating the Au layer. The TTR signal from the polymer film showed only the thermal component and was characteristic of variations associated with thermal conduction into the film. To induce spalling, the back side was illuminated with a Nd-YAG laser beam with a 532 nm wavelength, pulse energy density 1.8 J/cm2, and a repetition rate of 10 Hz for 10 s in conjunction with TTR measurements on the front side. The TTR signal from the polymer film subjected to laser beam incidence from the backside of the Si wafer showed both the thermal and the acoustic components. The acoustic component was used to detect the initial stages of spalling or delamination. The acoustic oscillations were modeled using a modified wave equation to determine the velocity of sound and the modulus of the film. The results were also used to determine the effect of porosity on the modulus of the polymer film. The TTR signal was found to be very sensitive to detection of delamination without complete separation of the film.

  11. Stress evolution in a conductive adhesive during curing and cooling

    NASA Astrophysics Data System (ADS)

    Mei, Yuhai

    2000-10-01

    There is increasing interest in using conductive adhesives, which are composites of polymers and conductive fillers, as replacements for solder in different types of microelectronic assemblies. However, conductive adhesives still suffer from several deficiencies, such as unstable electrical conductivity and inadequate adhesion. The reliability of the conductive adhesive joints is always one of the major considerations during their design and operation, and the curing and thermal stresses generated in polymers and composites during curing, cooling and thermal cycling play a very important role in determining reliability. Because of the mismatch in the mechanical properties between the conductive adhesive and the substrate, appreciable curing and thermal stress is generated during manufacturing, which may be detrimental to the reliability of conductive adhesive joints. In this dissertation, an interactive linear viscoelastic model which considers interaction between the initial gel network and the other networks that form during curing is proposed to simulate stress and volume shrinkage during the thermoset curing process, and an effective method for measuring volume shrinkage during the thermoset cure is developed. A systematic experimental study of the material properties of the conductive adhesive and its epoxy matrix during the curing and cooling processes has been conducted. Based on these experimental data, stresses generated during several spatially homogeneous curing and cooling processes of the conductive adhesive and its epoxy matrix are also calculated. It is found that the conductive adhesive possesses mechanical properties which are substantially different from those of the constituents, and that the conductive adhesive has a relaxation process which is similar to its matrix and generates appreciable curing and thermal stresses during curing and cooling. Finally, a processing procedure designed to provide desired residual stresses is discussed.

  12. Conducting a thermal conductivity survey

    NASA Technical Reports Server (NTRS)

    Allen, P. B.

    1985-01-01

    A physically transparent approximate theory of phonon decay rates is presented starting from a pair potential model of the interatomic forces in an insulator or semiconductor. The theory applies in the classical regime and relates the 3-phonon decay rate to the third derivative of the pair potential. Phonon dispersion relations do not need to be calculated, as sum rules relate all the needed quantities directly to the pair potential. The Brillouin zone averaged phonon lifetime turns out to involve a dimensionless measure of the anharmonicity multiplied by an effective density of states for 3-phonon decay. Results are given for rare gas and alkali halide crystals. For rare gases, the results are in good agreement with more elaborate perturbation calculations. Comparison to experimental data on phonon linewidths and thermal conductivity are made.

  13. Performance of thermal adhesives in forced convection

    NASA Technical Reports Server (NTRS)

    Kundu, Nikhil K.

    1993-01-01

    Cooling is critical for the life and performance of electronic equipment. In most cases cooling may be achieved by natural convection but forced convection may be necessary for high wattage applications. Use of conventional type heat sinks may not be feasible from the viewpoint of specific applications and the costs involved. In a heat sink, fins can be attached to the well by ultrasonic welding, by soldering, or with a number of industrially available thermal adhesives. In this paper, the author investigates the heat transfer characteristics of several adhesives and compares them with ultrasonic welding and theoretically calculated values. This experiment was conducted in an air flow chamber. Heat was generated by using heaters mounted on the well. Thermstrate foil, Uniset A401, and Aremco 571 adhesives were tested along with an ultrasonically welded sample. Ultrasonic welding performed far better than the adhesives and Thermstrate foil. This type of experiment can be adapted for a laboratory exercise in an upper level heat transfer course. It gives students an exposure to industrial applications that help them appreciate the importance of the course material.

  14. Low thermal conductivity oxides

    SciTech Connect

    Pan, Wei; Phillpot, Simon R.; Wan, Chunlei; Chernatynskiy, Aleksandr; Qu, Zhixue

    2012-10-09

    Oxides hold great promise as new and improved materials for thermal-barrier coating applications. The rich variety of structures and compositions of the materials in this class, and the ease with which they can be doped, allow the exploration of various mechanisms for lowering thermal conductivity. In this article, we review recent progress in identifying specific oxides with low thermal conductivity from both theoretical and experimental perspectives. We explore the mechanisms of lowering thermal conductivity, such as introducing structural/chemical disorder, increasing material density, increasing the number of atoms in the primitive cell, and exploiting the structural anisotropy. We conclude that further systematic exploration of oxide crystal structures and chemistries are likely to result in even further improved thermal-barrier coatings.

  15. Highly Thermal Conductive Nanocomposites

    NASA Technical Reports Server (NTRS)

    Sun, Ya-Ping (Inventor); Connell, John W. (Inventor); Veca, Lucia Monica (Inventor)

    2015-01-01

    Disclosed are methods for forming carbon-based fillers as may be utilized in forming highly thermal conductive nanocomposite materials. Formation methods include treatment of an expanded graphite with an alcohol/water mixture followed by further exfoliation of the graphite to form extremely thin carbon nanosheets that are on the order of between about 2 and about 10 nanometers in thickness. Disclosed carbon nanosheets can be functionalized and/or can be incorporated in nanocomposites with extremely high thermal conductivities. Disclosed methods and materials can prove highly valuable in many technological applications including, for instance, in formation of heat management materials for protective clothing and as may be useful in space exploration or in others that require efficient yet light-weight and flexible thermal management solutions.

  16. Method of making thermally removable adhesives

    DOEpatents

    Aubert, James H.

    2004-11-30

    A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90.degree. C. to form a homogeneous solution, which, when cooled to less than approximately 70.degree. C., simultaneously initiates a Diels-Alder reaction between the furan and the bismaleimide and a epoxy curing reaction between the amine curative and the oxirane group to form a thermally-removable adhesive. Subsequent heating to a temperature greater than approximately 100.degree. C. causes the adhesive to melt and allows separation of adhered pieces.

  17. Synthesis and characterization of soluble conducting polymers and conducting adhesives

    NASA Astrophysics Data System (ADS)

    Oztemiz, Serhan

    With the demanding nature of the technology today, scientists are looking for new materials in order to decrease the cost, increase the efficiency of the use of the materials, and decrease time-consuming steps in order to increase the speed of production. New materials are being studied to decrease the weight of cars, planes and space vehicles; surface properties are being modified to decrease the drag coefficient; new technologies are being introduced for speeding up applications in production and assembly lines. In this research we address the needs of different technological applications from a conductivity perspective. In the first part of the thesis, the synthesis of soluble conducting polymers in order to make them more processable for potential electronic and photovoltaic applications is presented. Soluble conducting polymers of 3-hexylthiophene, 3-octylthiophene, 3-decylthiophene and 3-dodecylthiophene were synthesized electrochemically and thus, doped during synthesis. It was found that the conductivities; molecular weights and degrees of polymerization of the polymers strongly depend on the side chain's length. The substitution of alkyl side chains decreases the reactivity of the growing chain, and with an increasing side-chain length, all of these properties show a decrease. The hexyl substituent, being the shortest of the four side chains, causes the least distortion in the background, has the highest conjugation, and has the highest shift in the UV spectrum when it polymerizes. As the length of the side chain increases, the shift in the UV spectrum decreases, too. Decrease in the pi-stacking, conjugation and delocalization decreases the conductivity. This gives the material an opportunity to be used in photovoltaic applications. In the second part of the thesis, a conducting adhesive formulation that eliminates the need for heat or other expensive and rather bothersome application methods to activate the adhesive is investigated. Using the quick

  18. Thermal conductivity of metals

    NASA Technical Reports Server (NTRS)

    Kazem, Sayyed M.

    1990-01-01

    The objective is to familiarize students with steady and unsteady heat transfer by conduction and with the effect of thermal conductivity upon temperature distribution through a homogeneous substance. The elementary heat conduction experiment presented is designed for associate degree technology students in a simple manner to enhance their intuition and to clarify many confusing concepts such as temperature, thermal energy, thermal conductivity, heat, transient and steady flows. The equipment set is safe, small, portable (10 kg) and relatively cheap (about $1200): the electric hot plate 2 kg (4.4 lb) for $175: the 24 channel selector and Thermocouple Digital Readout (Trendicator) 4.5 kg (10 lb) for about $1000; the three metal specimens (each of 2.5 cm diameter and 11 cm length), base plate and the bucket all about 3 kg (7 lb) for about $25. The experiment may take from 60 to 70 minutes. Although the hot plate surface temperature could be set from 90 to 370 C (maximum of 750 watts) it is a good practice to work with temperatures of 180 to 200 C (about 400 watts). They may experiment in squads of 2, 3 or even 4, or the instructor may demonstrate it for the whole class.

  19. Thermally conductive polymers

    NASA Technical Reports Server (NTRS)

    Byrd, N. R.; Jenkins, R. K.; Lister, J. L. (Inventor)

    1971-01-01

    A thermally conductive polymer is provided having physical and chemical properties suited to use as a medium for potting electrical components. The polymer is prepared from hydroquinone, phenol, and formaldehyde, by conventional procedures employed for the preparation of phenol-formaldehyde resins. While the proportions of the monomers can be varied, a preferred polymer is formed from the monomers in a 1:1:2.4 molar or ratio of hydroquinone:phenol:formaldehyde.

  20. Thermal Contact Conductance

    NASA Technical Reports Server (NTRS)

    Salerno, Louis J.; Kittel, Peter

    1997-01-01

    The performance of cryogenic instruments is often a function of their operating temperature. Thus, designers of cryogenic instruments often are required to predict the operating temperature of each instrument they design. This requires accurate thermal models of cryogenic components which include the properties of the materials and assembly techniques used. When components are bolted or otherwise pressed together, a knowledge of the thermal performance of such joints are also needed. In some cases, the temperature drop across these joints represents a significant fraction of the total temperature difference between the instrument and its cooler. While extensive databases exist on the thermal properties of bulk materials, similar databases for pressed contacts do not. This has often lead to instrument designs that avoid pressed contacts or to the over-design of such joints at unnecessary expense. Although many people have made measurements of contact conductances at cryogenic temperatures, this data is often very narrow in scope and even more often it has not been published in an easily retrievable fashion, if published at all. This paper presents a summary of the limited pressed contact data available in the literature.

  1. Waterborne polyacrylic/PEDOT nanocomposites for conductive transparent adhesives.

    PubMed

    Kim, Byeonggwan; Park, Teahoon; Kim, Jeonghun; Kim, Eunkyoung

    2013-11-01

    A new nanocomposite for conductive transparent adhesives (CTAs) was synthesized by emulsion polymerization of acrylate monomers dispersed with poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS). Polymer particles of waterborne CTAs were uniform, and the average size of the particles was 330 nm. The conductive transparent adhesive nanocomposites (CTANs) were casted onto various substrates including slide glass, indium tin oxide (ITO) glass, and PET film. Upon thermal processing at 80 degrees C, highly transparent adhesive films were obtained with surface uniformity. The stress of the CTANs was affected by the contents of PEDOT:PSS, and a 7.5 wt% CTAN film had the highest maximum stress of 0.33 MPa. Importantly, polyacrylic nanoparticles were well dispersed with conductive filler PEDOT:PSS in water because of their high dispersity in water. Therefore, the polyacrylic/PEDOT nanocomposite had a low percolation threshold of approximately 8% due to the enhanced connection between conductive channels. The CTANs with an optimum content (10 wt%) of PEDOT:PSS had high electromagnetic interference shielding effectiveness (36 dB) and transparency (75%) for application to electronics including displays and solar cells. PMID:24245305

  2. Electrical and Thermal Conductivity

    NASA Astrophysics Data System (ADS)

    Ventura, Guglielmo; Perfetti, Mauro

    After a Sect. 1.1 devoted to electrical conductivity and a section that deals with magnetic and dielectric losses ( 1.2 ), this chapter explores the theory of thermal conduction in solids. The examined categories of solids are: metals Sect. 1.3.2 , Dielectrics Sects. 1.3.3 and 1.3.4 and Nanocomposites Sect. 1.3.5 . In Sect. 1.3.6 the problem of thermal and electrical contact between materials is considered because contact resistance occurring at conductor joints in magnets or other high power applications can lead to undesirable electrical losses. At low temperature, thermal contact is also critical in the mounting of temperature sensors, where bad contacts can lead to erroneous results, in particular when superconductivity phenomena are involved.

  3. Thermal Conductivity of Coated Paper

    SciTech Connect

    Kerr, Lei L; Pan, Yun-Long; Dinwiddie, Ralph Barton; Wang, Hsin; Peterson, Robert C.

    2009-01-01

    In this paper, we introduce a method for measuring the thermal conductivity of paper using a hot disk system. To the best of our knowledge, few publications are found discussing the thermal conductivity of a coated paper although it is important to various forms of today s digital printing where heat is used for imaging as well as for toner fusing. This motivates us to investigate the thermal conductivity of paper coating. Our investigation demonstrates that thermal conductivity is affected by the coat weight and the changes in the thermal conductivity affect ink gloss and density. As the coat weight increases, the thermal conductivity increases. Both the ink gloss and density decrease as the thermal conductivity increases. The ink gloss appears to be more sensitive to the changes in the thermal conductivity.

  4. Thermal Conductivity of Coated Paper

    NASA Astrophysics Data System (ADS)

    Kerr, Lei L.; Pan, Yun-Long; Dinwiddie, Ralph B.; Wang, Hsin; Peterson, Robert C.

    2009-04-01

    In this article, a method for measuring the thermal conductivity of paper using a hot disk system is introduced. To the best of our knowledge, few publications are found discussing the thermal conductivity of a coated paper, although it is important to various forms of today’s digital printing where heat is used for imaging, as well as for toner fusing. This motivated an investigation of the thermal conductivity of paper coating. This study demonstrates that the thermal conductivity is affected by the coating mass and the changes in the thermal conductivity affect toner gloss and density. As the coating mass increases, the thermal conductivity increases. Both the toner gloss and density decrease as the thermal conductivity increases. The toner gloss appears to be more sensitive to the changes in the thermal conductivity.

  5. Shape memory thermal conduction switch

    NASA Technical Reports Server (NTRS)

    Vaidyanathan, Rajan (Inventor); Krishnan, Vinu (Inventor); Notardonato, William U. (Inventor)

    2010-01-01

    A thermal conduction switch includes a thermally-conductive first member having a first thermal contacting structure for securing the first member as a stationary member to a thermally regulated body or a body requiring thermal regulation. A movable thermally-conductive second member has a second thermal contacting surface. A thermally conductive coupler is interposed between the first member and the second member for thermally coupling the first member to the second member. At least one control spring is coupled between the first member and the second member. The control spring includes a NiTiFe comprising shape memory (SM) material that provides a phase change temperature <273 K, a transformation range <40 K, and a hysteresis of <10 K. A bias spring is between the first member and the second member. At the phase change the switch provides a distance change (displacement) between first and second member by at least 1 mm, such as 2 to 4 mm.

  6. High performance electrically conductive adhesives (ECAs) for leadfree interconnects

    NASA Astrophysics Data System (ADS)

    Li, Yi

    Electrically conductive adhesives (ECAs) are one of the lead-free interconnect materials with the advantages of environmental friendliness, mild processing conditions, fewer processing steps, low stress on the substrates, and fine pitch interconnect capability. However, some challenging issues still exist for the currently available ECAs, including lower electrical conductivity, conductivity fatigue in reliability tests, limited current-carrying capability, poor impact strength, etc. The interfacial properties is one of the major considerations when resolving these challenges and developing high performance conductive adhesives. Surface functionalization and interface modification are the major approaches used in this thesis. Fundamental understanding and analysis of the interaction between various types of interface modifiers and ECA materials and substrates are the key for the development of high performance ECA for lead-free interconnects. The results of this thesis provide the guideline for the enhancement of interfacial properties of metal-metal and metal-polymer interactions. Systematic investigation of various types of ECAs contributes to a better understanding of materials requirements for different applications, such as surface mount technology (SMT), flip chip applications, flat panel display modules with high resolution, etc. Improvement of the electrical, thermal and reliability of different ECAs make them a potentially ideal candidate for high power and fine pitch microelectronics packaging option.

  7. High performance heat curing copper-silver powders filled electrically conductive adhesives

    NASA Astrophysics Data System (ADS)

    Cui, Hui-Wang; Jiu, Jin-Ting; Sugahara, Tohru; Nagao, Shijo; Suganuma, Katsuaki; Uchida, Hiroshi

    2015-03-01

    In this study, high performance electrically conductive adhesives were fabricated from a vinyl ester resin, a thermal initiator, silver coated copper powders, and pure silver powders, without using any other coupling agent, dispersing agent, and reducing agent. The heat cured copper-silver powders filled electrically conductive adhesives presented low bulk resistivity (e.g., 4.53 × 10-5 Ω·cm) due to the silver powders that had given high electrical conductivity to the adhesives, and high shear strength (e.g., 16.22 MPa) provided by the crosslinked structures of vinyl ester resin. These high performance copper-silver powders filled electrically conductive adhesives have lower cost than those filled by pure silver powders, which can be well used in the electronic packaging and can enlarge the application prospects of electrically conductive adhesives. [Figure not available: see fulltext.

  8. Thermal conductivity of zirconia thermal barrier coatings

    NASA Technical Reports Server (NTRS)

    Dinwiddie, R. B.; Beecher, S. C.; Nagaraj, B. A.; Moore, C. S.

    1995-01-01

    Thermal barrier coatings (TBC's) applied to the hot gas components of turbine engines lead to enhanced fuel efficiency and component reliability. Understanding the mechanisms which control the thermal transport behavior of the TBC's is of primary importance. Physical vapor description (PVD) and plasma spraying (PS) are the two most commonly used coating techniques. These techniques produce coatings with unique microstructures which control their performance and stability. The PS coatings were applied with either standard power or hollow sphere particles. The hollow sphere particles yielded a lower density and lower thermal conductivity coating. The thermal conductivity of both fully and partially stabilized zirconia, before and after thermal aging, will be compared. The thermal conductivity of the coatings permanently increase upon being exposed to high temperatures. These increases are attributed to microstructural changes within the coatings. Sintering of the as fabricated plasma sprayed lamellar structure is observed by scanning electron microscopy of coatings isothermally heat treated at temperatures greater than 1100 C. During this sintering process the planar porosity between lamella is converted to a series of small spherical pores. The change in pore morphology is the primary reason for the observed increase in thermal conductivity. This increase in thermal conductivity can be modeled using a relationship which depends on both the temperature and time of exposure. Although the PVD coatings are less susceptible to thermal aging effects, preliminary results suggest that they have a higher thermal conductivity than PS coatings, both before and after thermal aging. The increases in thermal conductivity due to thermal aging for partially stabilized plasma sprayed zirconia have been found to be less than for fully stabilized plasma sprayed zirconia coatings. The high temperature thermal diffusivity data indicates that if these coatings reach a temperature above

  9. Thermal conductivity of zirconia thermal barrier coatings

    NASA Technical Reports Server (NTRS)

    Dinwiddie, R. B.; Beecher, S. C.; Nagaraj, B. A.; Moore, C. S.

    1995-01-01

    Thermal barrier coatings (TBC's) applied to the hot gas components of turbine engines lead to enhanced fuel efficiency and component reliability. Understanding the mechanisms which control the thermal transport behavior of the TBC's is of primary importance. Physical vapor deposition (PVD) and plasma spraying (PS) are the two most commonly used coating techniques. These techniques produce coatings with unique microstructures which control their performance and stability. The PS coatings were applied with either standard powder or hollow sphere particles. The hollow sphere particles yielded a lower density and lower thermal conductivity coating. The thermal conductivity of both fully and partially stabilized zirconia, before and after thermal aging, will be compared. The thermal conductivity of the coatings permanently increases upon exposed to high temperatures. These increases are attributed to microstructural changes within the coatings. Sintering of the as-fabricated plasma sprayed lamellar structure is observed by scanning electron microscopy of coatings isothermally heat treated at temperatures greater than 1100 C. During this sintering process the planar porosity between lamella is converted to a series of small spherical pores. The change in pore morphology is the primary reason for the observed increase in thermal conductivity. This increase in thermal conductivity can be modeled using a relationship which depends on both the temperature and time of exposure. Although the PVD coatings are less susceptible to thermal aging effects, preliminary results suggest that they have a higher thermal conductivity than PS coatings, both before and after thermal aging. The increases in thermal conductivity due to thermal aging for partially stabilized plasma sprayed zirconia have been found to be less than for fully stabilized plasma sprayed zirconia coatings. The high temperature thermal diffusivity data indicate that if these coatings reach a temperature above 1100 C

  10. Thermal conductivity of zirconia thermal barrier coatings

    SciTech Connect

    Dinwiddie, R.B.; Beecher, S.C.; Nagaraj, B.A.; Moore, C.S.

    1995-10-01

    Thermal barrier coatings (TBC`s) applied to the hot gas components of turbine engines lead to enhanced fuel efficiency and component reliability. Understanding the mechanisms which control the thermal transport behavior of the TBC`s is of primary importance. Physical vapor deposition (PVD) and plasma spraying (PS) are the two most commonly used coating techniques. These techniques produce coatings with unique microstructures which control their performance and stability. The PS coatings were applied with either standard powder or hollow sphere particles. The hollow sphere particles yielded a lower density and lower thermal conductivity coating. The thermal conductivity of both fully and partially stabilized zirconia, before and after thermal aging, will be compared. The thermal conductivity of the coatings permanently increases upon exposed to high temperatures. These increases are attributed to microstructural changes within the coatings. Sintering of the as-fabricated plasma sprayed lamellar structure is observed by scanning electron microscopy of coatings isothermally heat treated at temperatures greater than 1100 C. During this sintering process the planar porosity between lamella is converted to a series of small spherical pores. The change in pore morphology is the primary reason for the observed increase in thermal conductivity. This increase in thermal conductivity can be modeled using a relationship which depends on both the temperature and time of exposure. Although the PVD coatings are less susceptible to thermal aging effects, preliminary results suggest that they have a higher thermal conductivity than PS coatings, both before and after thermal aging. The increases in thermal conductivity due to thermal aging for partially stabilized plasma sprayed zirconia have been found to be less than for fully stabilized plasma sprayed zirconia coatings.

  11. Thermal conductivity of boron carbides

    NASA Technical Reports Server (NTRS)

    Wood, C.; Emin, D.; Gray, P. E.

    1985-01-01

    Knowledge of the thermal conductivity of boron carbide is necessary to evaluate its potential for high-temperature thermoelectric energy conversion applications. Measurements have been conducted of the thermal diffusivity of hot-pressed boron carbide BxC samples as a function of composition (x in the range from 4 to 9), temperature (300-1700 K), and temperature cycling. These data, in concert with density and specific-heat data, yield the thermal conductivities of these materials. The results are discussed in terms of a structural model that has been previously advanced to explain the electronic transport data. Some novel mechanisms for thermal conduction are briefly discussed.

  12. Study for Electric Device Assembly Process Using Conductive Adhesive

    NASA Astrophysics Data System (ADS)

    Fujino, Junji

    Electric devices with semiconductors are applied to all apparatus including substation equipment, transport machines, home electronics, and cellular phones. Power modules deal large current, and high frequency/optical modules control GHz band signals. As a result, these semiconductors have more than 100 times heat density of memory or MPU chips. Pb-rich high temperature solder and expensive Au-rich solder are applied to these modules, however, thermal stress might be a problem not only for long-term reliability but also for the initial characteristics. The authors studied the assembly of these electric devices using conductive adhesive as a substitute bonding material. We proved that atmospheric aluminum oxides caused electric resistance and that power chips with long rectangle sides over 10 mm have a much larger thermal resistance than theoretical values. We found that it is effective to scratch and remove these oxides through transferred adhesive on aluminum electrodes and to diebond them onto the solder projection previously formed on the die pads.

  13. Thermal conductivity Measurements of Kaolite

    SciTech Connect

    Wang, H

    2003-02-21

    Testing was performed to determine the thermal conductivity of Kaolite 1600, which primarily consists of Portland cement and vermiculite. The material was made by Thermal Ceramics for refractory applications. Its combination of light weight, low density, low cost, and noncombustibility made it an attractive alternative to the materials currently used in ES-2 container for radioactive materials. Mechanical properties and energy absorption tests of the Kaolite have been conducted at the Y-12 complex. Heat transfer is also an important factor for the application of the material. The Kaolite samples are porous and trap moisture after extended storage. Thermal conductivity changes as a function of moisture content below 100 C. Thermal conductivity of the Kaolite at high temperatures (up to 700 C) are not available in the literature. There are no standard thermal conductivity values for Kaolite because each sample is somewhat different. Therefore, it is necessary to measure thermal conductivity of each type of Kaolite. Thermal conductivity measurements will help the modeling and calculation of temperatures of the ES-2 containers. This report focuses on the thermal conductivity testing effort at ORNL.

  14. Thermal conductivity of nanoparticle suspensions

    NASA Astrophysics Data System (ADS)

    Cahill, David; Putnam, Shawn

    2006-03-01

    We present our experimental study on the thermal conductivity of nanofluids loaded with small volume fractions of C60-C70 fullerenes and alkanethiolate-protected Au nanoparticles. We use an optical beam deflection technique that measures the thermal diffusivity of fluid mixtures and suspensions of nanoparticles with a precision of better than 1%. Our approach is tested using the thermal conductivity of ethanol-water mixtures; in nearly pure ethanol, the increase in thermal conductivity with water concentration is a factor of two larger than predicted by effective medium theory. The solutions of the C60-C70 fullerenes and the alkanethiolate-protected Au nanoparticles were measured to maximum volume fractions of 0.6% and 0.35 vol%, respectively. We do not observe anomalous enhancements of the thermal conductivity that have been reported in previous studies of nanofluids; the largest increase in thermal conductivity we have observed is 1.3 ±0.8% for 4 nm diameter Au particles suspended in ethanol. However, within the context of effective medium theory, these findings are expected: effective medium theory predicts that the largest possible increase in the thermal conductivity of a fluid loaded by a volume fraction φ1 of spherical particles will be 3φλ0, where λ0 is the thermal conductivity of the carrier fluid.

  15. Low Conductivity Thermal Barrier Coatings

    NASA Technical Reports Server (NTRS)

    Zhu, Dong-Ming

    2005-01-01

    Thermal barrier coatings will be more aggressively designed to protect gas turbine engine hot-section components in order to meet future engine higher fuel efficiency and lower emission goals. In this presentation, thermal barrier coating development considerations and requirements will be discussed. An experimental approach is established to monitor in real time the thermal conductivity of the coating systems subjected to high-heat-flux, steady-state and cyclic temperature gradients. Advanced low conductivity thermal barrier coatings have also been developed using a multi-component defect clustering approach, and shown to have improved thermal stability. The durability and erosion resistance of low conductivity thermal barrier coatings have been improved utilizing advanced coating architecture design, composition optimization, in conjunction with more sophisticated modeling and design tools.

  16. Thermal conductivity of nanoparticle suspensions

    NASA Astrophysics Data System (ADS)

    Putnam, Shawn A.; Cahill, David G.; Braun, Paul V.; Ge, Zhenbin; Shimmin, Robert G.

    2006-04-01

    We describe an optical beam deflection technique for measurements of the thermal diffusivity of fluid mixtures and suspensions of nanoparticles with a precision of better than 1%. Our approach is tested using the thermal conductivity of ethanol-water mixtures; in nearly pure ethanol, the increase in thermal conductivity with water concentration is a factor of 2 larger than predicted by effective medium theory. Solutions of C60-C70 fullerenes in toluene and suspensions of alkanethiolate-protected Au nanoparticles were measured to maximum volume fractions of 0.6% and 0.35 vol %, respectively. We do not observe anomalous enhancements of the thermal conductivity that have been reported in previous studies of nanofluids; the largest increase in thermal conductivity we have observed is 1.3%+/-0.8% for 4 nm diam Au particles suspended in ethanol.

  17. Radiative thermal conduction fronts

    NASA Technical Reports Server (NTRS)

    Borkowski, Kazimierz J.; Balbus, Steven A.; Fristrom, Carl C.

    1990-01-01

    The discovery of the O VI interstellar absorption lines in our Galaxy by the Copernicus observatory was a turning point in our understanding of the Interstellar Medium (ISM). It implied the presence of widespread hot (approx. 10 to the 6th power K) gas in disk galaxies. The detection of highly ionized species in quasi-stellar objects' absorption spectra may be the first indirect observation of this hot phase in external disk galaxies. Previous efforts to understand extensive O VI absorption line data from our Galaxy were not very successful in locating the regions where this absorption originates. The location at interfaces between evaporating ISM clouds and hot gas was favored, but recent studies of steady-state conduction fronts in spherical clouds by Ballet, Arnaud, and Rothenflug (1986) and Bohringer and Hartquist (1987) rejected evaporative fronts as the absorption sites. Researchers report here on time-dependent nonequilibrium calculations of planar conductive fronts whose properties match well with observations, and suggest reasons for the difference between the researchers' results and the above. They included magnetic fields in additional models, not reported here, and the conclusions are not affected by their presence.

  18. Radiative thermal conduction fronts

    NASA Astrophysics Data System (ADS)

    Borkowski, Kazimierz J.; Balbus, Steven A.; Fristrom, Carl C.

    1990-07-01

    The discovery of the O VI interstellar absorption lines in our Galaxy by the Copernicus observatory was a turning point in our understanding of the Interstellar Medium (ISM). It implied the presence of widespread hot (approx. 10 to the 6th power K) gas in disk galaxies. The detection of highly ionized species in quasi-stellar objects' absorption spectra may be the first indirect observation of this hot phase in external disk galaxies. Previous efforts to understand extensive O VI absorption line data from our Galaxy were not very successful in locating the regions where this absorption originates. The location at interfaces between evaporating ISM clouds and hot gas was favored, but recent studies of steady-state conduction fronts in spherical clouds by Ballet, Arnaud, and Rothenflug (1986) and Bohringer and Hartquist (1987) rejected evaporative fronts as the absorption sites. Researchers report here on time-dependent nonequilibrium calculations of planar conductive fronts whose properties match well with observations, and suggest reasons for the difference between the researchers' results and the above. They included magnetic fields in additional models, not reported here, and the conclusions are not affected by their presence.

  19. Thermal Conductances Of Metal Contacts

    NASA Technical Reports Server (NTRS)

    Salerno, L. J.; Kittel, P.; Scherkenbach, F. E.; Spivak, A. L.

    1988-01-01

    Report presents results of measurements of thermal conductances of aluminum and stainless-steel contacts at temperatures from 1.6 to 6.0 K. Measurement apparatus includes gearmotor assembly connected to rocker arm by music wire to load sample pair with forces up to 670 N. Heater placed above upper sample. Germanium resistance thermometers in upper and lower samples measured temperature difference across interface over range of heater powers from 0.1 to 10.0 mW. The thermal conductance calculated from temperature difference. Measurements provide data for prediction of thermal conductances of bolted joints in cryogenic infrared instruments.

  20. Electrochemical deposition of conductive and adhesive polypyrrole-dopamine films

    PubMed Central

    Kim, Semin; Jang, Lindy K.; Park, Hyun S.; Lee, Jae Young

    2016-01-01

    Electrode surfaces have been widely modified with electrically conductive polymers, including polypyrrole (PPY), to improve the performance of electrodes. To utilize conductive polymers for electrode modification, strong adhesion between the polymer films and electrode substrates should be ensured with high electrical/electrochemical activities. In this study, PPY films were electrochemically polymerized on electrodes (e.g., indium tin oxide (ITO)) with dopamine as a bio-inspired adhesive molecule. Efficient and fast PPY electrodeposition with dopamine (PDA/PPY) was found; the resultant PDA/PPY films exhibited greatly increased adhesion strengths of up to 3.7 ± 0.8 MPa and the modified electrodes had electrochemical impedances two to three orders of magnitude lower than that of an unmodified electrode. This electrochemical deposition of adhesive and conductive PDA/PPY offers a facile and versatile electrode modification for various applications, such as biosensors and batteries. PMID:27459901

  1. Electrochemical deposition of conductive and adhesive polypyrrole-dopamine films.

    PubMed

    Kim, Semin; Jang, Lindy K; Park, Hyun S; Lee, Jae Young

    2016-01-01

    Electrode surfaces have been widely modified with electrically conductive polymers, including polypyrrole (PPY), to improve the performance of electrodes. To utilize conductive polymers for electrode modification, strong adhesion between the polymer films and electrode substrates should be ensured with high electrical/electrochemical activities. In this study, PPY films were electrochemically polymerized on electrodes (e.g., indium tin oxide (ITO)) with dopamine as a bio-inspired adhesive molecule. Efficient and fast PPY electrodeposition with dopamine (PDA/PPY) was found; the resultant PDA/PPY films exhibited greatly increased adhesion strengths of up to 3.7 ± 0.8 MPa and the modified electrodes had electrochemical impedances two to three orders of magnitude lower than that of an unmodified electrode. This electrochemical deposition of adhesive and conductive PDA/PPY offers a facile and versatile electrode modification for various applications, such as biosensors and batteries. PMID:27459901

  2. Electrochemical deposition of conductive and adhesive polypyrrole-dopamine films

    NASA Astrophysics Data System (ADS)

    Kim, Semin; Jang, Lindy K.; Park, Hyun S.; Lee, Jae Young

    2016-07-01

    Electrode surfaces have been widely modified with electrically conductive polymers, including polypyrrole (PPY), to improve the performance of electrodes. To utilize conductive polymers for electrode modification, strong adhesion between the polymer films and electrode substrates should be ensured with high electrical/electrochemical activities. In this study, PPY films were electrochemically polymerized on electrodes (e.g., indium tin oxide (ITO)) with dopamine as a bio-inspired adhesive molecule. Efficient and fast PPY electrodeposition with dopamine (PDA/PPY) was found; the resultant PDA/PPY films exhibited greatly increased adhesion strengths of up to 3.7 ± 0.8 MPa and the modified electrodes had electrochemical impedances two to three orders of magnitude lower than that of an unmodified electrode. This electrochemical deposition of adhesive and conductive PDA/PPY offers a facile and versatile electrode modification for various applications, such as biosensors and batteries.

  3. Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

    NASA Astrophysics Data System (ADS)

    Hirman, Martin; Steiner, Frantisek

    2016-05-01

    This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives "EPO-TEKⓇ H20S" and "MG8331S" on three types of substrates (FR-4, MELINEXⓇST504, DuPont™ PyraluxⓇAC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing profiles for each adhesive. Different thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These differences have an effect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different curing profiles, various types of substrates, and different quantities of adhesives on the mechanical strength of the joint.

  4. Low Thermal Conductivity Thermal Barrier Coatings Developed

    NASA Technical Reports Server (NTRS)

    Zhu, Dongming

    2003-01-01

    Thermal barrier coatings (TBCs) are used extensively in modern gas turbine engines to thermally insulate air-cooled metallic components from the hot gases in the engine. These coatings typically consist of a zirconia-yttria ceramic that has been applied by either plasma spraying or physical vapor deposition. Future engines will rely even more heavily on TBCs and will require materials that have even higher temperature capability with improved insulation (i.e., lower thermal conductivity even after many hours at high temperature). This report discusses new TBCs that have been developed with these future requirements in mind. The Ultra-Efficient Engine Technology Program at the NASA Glenn Research Center is funding this effort, which has been conducted primarily at Glenn with contractor support (GE and Howmet) for physical vapor deposition. As stated, the new TBC not only had to be more insulating but the insulation had to persist even after many hours of exposure-that is, the new TBC had to have both lower conductivity and improved sintering resistance. A new type of test rig was developed for this task. This new test approach used a laser to deliver a known high heat flux in an essentially uniform pattern to the surface of the coating, thereby establishing a realistic thermal gradient across its thickness. This gradient was determined from surface and backside pyrometry; and since the heat flux and coating thickness are known, this permitted continuous monitoring of thermal conductivity. Thus, this laser rig allowed very efficient screening of candidate low-conductivity, sinter-resistant TBCs. The coating-design approach selected for these new low-conductivity TBCs was to identify oxide dopants that had the potential to promote the formation of relatively large and stable groupings of defects known as defect clusters. This approach was used because it was felt that such clusters would reduce conductivity while enhancing stability. The approach proved to be

  5. Thermal Conductivity in Supercooled Water

    NASA Astrophysics Data System (ADS)

    Biddle, John; Holten, Vincent; Sengers, Jan; Anisimov, Mikhail

    2013-03-01

    The heat capacity of supercooled water, measured down to -37 C, shows an anomalous increase as temperature decreases. The thermal diffusivity, the ratio of thermal conductivity and the heat capacity per unit volume, shows a decrease. These anomalies may be associated with a hypothetical liquid-liquid critical point in metastable water below the line of homogeneous nucleation. The data suggest that the thermal conductivity does not show a significant critical enhancement, in contrast to what is observed near the vapor-liquid critical point. We have used mode-coupling theory to investigate the possible effect of critical fluctuations on the thermal conductivity of supercooled water, and shown that indeed this effect would be too small to be measurable at experimentally accessible temperatures. We discuss physical reasons for the striking difference between the vapor-liquid and liquid-liquid critical enhancements of thermal conductivity in water. We also discuss the discrepancy between the thermal conductivity calculated from experimental data and that obtained by computer simulations of the TIP5P water-like model. American Chemical Society Petroleum Research Fund Grant No. 52666-ND6

  6. High-Temperature Adhesives for Thermally Stable Aero-Assist Technologies

    NASA Technical Reports Server (NTRS)

    Eberts, Kenneth; Ou, Runqing

    2013-01-01

    Aero-assist technologies are used to control the velocity of exploration vehicles (EVs) when entering Earth or other planetary atmospheres. Since entry of EVs in planetary atmospheres results in significant heating, thermally stable aero-assist technologies are required to avoid the high heating rates while maintaining low mass. Polymer adhesives are used in aero-assist structures because of the need for high flexibility and good bonding between layers of polymer films or fabrics. However, current polymer adhesives cannot withstand temperatures above 400 C. This innovation utilizes nanotechnology capabilities to address this need, leading to the development of high-temperature adhesives that exhibit high thermal conductivity in addition to increased thermal decomposition temperature. Enhanced thermal conductivity will help to dissipate heat quickly and effectively to avoid temperature rising to harmful levels. This, together with increased thermal decomposition temperature, will enable the adhesives to sustain transient high-temperature conditions.

  7. Lightweight, Thermally Conductive Composite Material

    NASA Technical Reports Server (NTRS)

    Sharp, G. Richard; Loftin, Timothy A.

    1990-01-01

    Aluminum reinforced with carbon fibers superior to copper in some respects. Lightweight composite material has high thermal conductivity. Consists of aluminum matrix containing graphite fibers, all oriented in same direction. Available as sheets, tubes, and bars. Thermal conductivity of composite along fibers rises above that of pure copper over substantial range of temperatures. Graphite/aluminum composite useful in variety of heat-transfer applications in which reduction of weight critical. Used to conduct heat in high-density, high-speed integrated-circuit packages for computers and in base plates for electronic equipment. Also used to carry heat away from leading edges of wings in high-speed airplanes.

  8. Thermal conductivity of carbonate rocks

    USGS Publications Warehouse

    Thomas, J., Jr.; Frost, R.R.; Harvey, R.D.

    1973-01-01

    The thermal conductivities of several well-defined carbonate rocks were determined near 40??C. Values range from 1.2 W m-1 C-1 for a highly porous chalk to 5.1 W m-1 C-1 for a dolomite. The thermal conductivity of magnesite (5.0) is at the high end of the range, and that for Iceland Spar Calcite (3.2) is near the middle. The values for limestones decrease linearly with increasing porosity. Dolomites of comparable porosity have greater thermal conductivities than limestones. Water-sorbed samples have expected greater thermal conductivities than air-saturated (dry) samples of the same rock. An anomalously large increase in the thermal conductivity of a water-sorbed clayey dolomite over that of the same sample when dry is attributed to the clay fraction, which swells during water inhibition, causing more solid-to-solid contacts within the dolomite framework. Measurements were made with a Colora Thermoconductometer. Chemical and mineralogical analyses were made and tabulated. Porosity of the rocks was determined by mercury porosimetry and also from density measurements. The Iceland Spar Calcite and magnesite were included for reference. ?? 1973.

  9. Thermal conductivity of cane fiberboard

    SciTech Connect

    Leader, D.R.

    1995-05-01

    The thermal conductivity of cane fiberboard was measured in two planes; parallel to the surface and perpendicular to the surface of the manufactured sheet. The information was necessary to better understand the thermal response of a loaded shipping container. The tests demonstrated that the thermal conductivity of cane fiberboard in the plane parallel to the surface of the sheet was nearly twice as great as the conductivity of the same material in a plane perpendicular to the sheet. There was no significant difference in the conductivity in different directions within the plane parallel to the surface, and the presence of glue between layers of fiberboard did not significantly change the conductivity of the assembly. The tests revealed that the thermal conductivity measured in a direction perpendicular to the plane of the surface of a stack of cane fiberboard sheets not bonded together, decreases with an increase in the mean temperature. This was determined to be the result of air gaps between the sheets of fiberboard, and not related to the properties of the material itself

  10. Thermal conductance of superlattice junctions

    SciTech Connect

    Lu, Simon; McGaughey, Alan J. H.

    2015-05-15

    We use molecular dynamics simulations and the lattice-based scattering boundary method to compute the thermal conductance of finite-length Lennard-Jones superlattice junctions confined by bulk crystalline leads. The superlattice junction thermal conductance depends on the properties of the leads. For junctions with a superlattice period of four atomic monolayers at temperatures between 5 and 20 K, those with mass-mismatched leads have a greater thermal conductance than those with mass-matched leads. We attribute this lead effect to interference between and the ballistic transport of emergent junction vibrational modes. The lead effect diminishes when the temperature is increased, when the superlattice period is increased, and when interfacial disorder is introduced, but is reversed in the harmonic limit.

  11. High thermal conductivity of diamond

    NASA Technical Reports Server (NTRS)

    Stephan, Patrick M.

    1993-01-01

    The objectives of this educational exercise were to demonstrate the high rate of heat flow from a synthetic diamond coupon and to compare it to a commonly used thermal conductor, such as copper. The principles of heat transfer by conduction and convection may also be demonstrated. A list of equipment and supplies and the procedure for the experiment are presented.

  12. Thermal Conductivity of Rubble Piles

    NASA Astrophysics Data System (ADS)

    Luan, Jing; Goldreich, Peter

    2015-11-01

    Rubble piles are a common feature of solar system bodies. They are composed of monolithic elements of ice or rock bound by gravity. Voids occupy a significant fraction of the volume of a rubble pile. They can exist up to pressure P≈ {ε }Yμ , where {ε }Y is the monolithic material's yield strain and μ its rigidity. At low P, contacts between neighboring elements are confined to a small fraction of their surface areas. As a result, the effective thermal conductivity of a rubble pile, {k}{con}≈ k{(P/({ε }Yμ ))}1/2, can be orders of magnitude smaller than the thermal conductivity of its monolithic elements, k. In a fluid-free environment, only radiation can transfer energy across voids. It contributes an additional component, {k}{rad}=16{\\ell }σ {T}3/3, to the total effective conductivity, {k}{eff}={k}{con}+{k}{rad}. Here ℓ, the inverse of the opacity per unit volume, is of the order of the size of the elements, and voids. An important distinction between {k}{con} and {k}{rad} is that the former is independent of the size of the elements, whereas the latter is proportional to it. Our expression for {k}{eff} provides a good fit to the depth dependence of thermal conductivity in the top 140 cm of the lunar regolith. It also offers a good starting point for detailed modeling of thermal inertias for asteroids and satellites. Measurement of the response of surface temperature to variable insolation is a valuable diagnostic of a regolith. There is an opportunity for careful experiments under controlled laboratory conditions to test models of thermal conductivity such as the one we outline.

  13. Amine-functionalized polypyrrole: Inherently cell adhesive conducting polymer.

    PubMed

    Lee, Jae Y; Schmidt, Christine E

    2015-06-01

    Electrically conducting polymers (CPs) have been recognized as novel biomaterials that can electrically communicate with biological systems. For their tissue engineering applications, CPs have been modified to promote cell adhesion for improved interactions between biomaterials and cells/tissues. Conventional approaches to improve cell adhesion involve the surface modification of CPs with biomolecules, such as physical adsorption of cell adhesive proteins and polycationic polymers, or their chemical immobilization; however, these approaches require additional multiple modification steps with expensive biomolecules. In this study, as a simple and effective alternative to such additional biomolecule treatment, we synthesized amine-functionalized polypyrrole (APPy) that inherently presents cell adhesion-supporting positive charges under physiological conditions. The synthesized APPy provides electrical activity in a moderate range and a hydrophilic surface compared to regular polypyrrole (PPy) homopolymers. Under both serum and serum-free conditions, APPy exhibited superior attachment of human dermal fibroblasts and Schwann cells compared to PPy homopolymer controls. Moreover, Schwann cell adhesion onto the APPy copolymer was at least similar to that on poly-l-lysine treated PPy controls. Our results indicate that amine-functionalized CP substrates will be useful to achieve good cell adhesion and potentially electrically stimulate various cells. In addition, amine functionality present on CPs can further serve as a novel and flexible platform to chemically tether various bioactive molecules, such as growth factors, antibodies, and chemical drugs. PMID:25294089

  14. Ultrasonic Evaluation of Thermal Degradation in Adhesive Bonds

    NASA Technical Reports Server (NTRS)

    Lih, Shyh-Shiuh; Mal, Ajit K.; Bar-Cohen, Yoseph

    1994-01-01

    The critical role played by adhesive bonds in lap joints is well known. A good knowledge of the mechanical properties of adhesive bonds in lap joints is a prerequisite to the design and reliable prediction of the performance of these bonded structures. Furthermore, the lap joint may be subject to high-temperature environments in service. Early detection of the degree of thermal degradation in adhesive bonds is required under these circumstances. A variety of ultrasonic nondestructive evaluation (NDE) techniques can be used to determine the thickness and the elastic moduli of adhesively bonded joints. In this paper we apply a previously developed technique based on the leaky Lamb wave (LLW) experiment to investigate the possibility of characterizing the thermal degradation of adhesive bonds in lap joints. The degradation of the adhesive bonds is determined through comparison between experimental data and theoretical calculations.

  15. High-Thermal-Conductivity Fabrics

    NASA Technical Reports Server (NTRS)

    Chibante, L. P. Felipe

    2012-01-01

    Heat management with common textiles such as nylon and spandex is hindered by the poor thermal conductivity from the skin surface to cooling surfaces. This innovation showed marked improvement in thermal conductivity of the individual fibers and tubing, as well as components assembled from them. The problem is centered on improving the heat removal of the liquid-cooled ventilation garments (LCVGs) used by astronauts. The current design uses an extensive network of water-cooling tubes that introduces bulkiness and discomfort, and increases fatigue. Range of motion and ease of movement are affected as well. The current technology is the same as developed during the Apollo program of the 1960s. Tubing material is hand-threaded through a spandex/nylon mesh layer, in a series of loops throughout the torso and limbs such that there is close, form-fitting contact with the user. Usually, there is a nylon liner layer to improve comfort. Circulating water is chilled by an external heat exchanger (sublimator). The purpose of this innovation is to produce new LCVG components with improved thermal conductivity. This was addressed using nanocomposite engineering incorporating high-thermalconductivity nanoscale fillers in the fabric and tubing components. Specifically, carbon nanotubes were added using normal processing methods such as thermoplastic melt mixing (compounding twin screw extruder) and downstream processing (fiber spinning, tubing extrusion). Fibers were produced as yarns and woven into fabric cloths. The application of isotropic nanofillers can be modeled using a modified Nielsen Model for conductive fillers in a matrix based on Einstein s viscosity model. This is a drop-in technology with no additional equipment needed. The loading is limited by the ability to maintain adequate dispersion. Undispersed materials will plug filtering screens in processing equipment. Generally, the viscosity increases were acceptable, and allowed the filled polymers to still be

  16. THERMAL CONDUCTIVITY ANALYSIS OF GASES

    DOEpatents

    Clark, W.J.

    1949-06-01

    This patent describes apparatus for the quantitative analysis of a gaseous mixture at subatmospheric pressure by measurement of its thermal conductivity. A heated wire forms one leg of a bridge circuit, while the gas under test is passed about the wire at a constant rate. The bridge unbalance will be a measure of the change in composition of the gas, if compensation is made for the effect due to gas pressure change. The apparatus provides a voltage varying with fluctuations of pressure in series with the indicating device placed across the bridge, to counterbalance the voltage change caused by fluctuations in the pressure of the gaseous mixture.

  17. Mechanical behavior of adhesive joints subjected to cyclic thermal loading

    SciTech Connect

    Humfeld, G.R.; Dillard, D.A.

    1996-12-31

    Stresses induced in bimaterial systems due to changing temperature has been the subject of much study since the publication of Timoshenko`s classic paper of 1925. An adhesive bond is one example of a bimaterial system in which thermal stress can play an important role. However, adhesives are viscoelastic in nature, and their mechanical behavior is dictated by the temperature- and time-dependence of their material properties; analytical solutions for elastic materials do not adequately describe their true behavior. The effect of the adhesive`s viscoelasticity on stress in an adhesive bond subjected to changing temperature is therefore of compelling interest and importance for the adhesives industry. The objective of this research is to develop an understanding of the viscoelastic effect in an adhesive bond subjected to cycling temperature, particularly when the temperature range spans a transition temperature of the adhesive. Numerical modeling of a simplified geometry was first undertaken to isolate the influence of viscoelasticity on the stress state from any particular specimen geometry effect. Finite element modeling was then undertaken to examine the mechanical behavior of the adhesive in a layered geometry. Both solution methods predicted development of residual tensile stresses in the adhesive. For the layered geometry this was found to correspond with residual tensile peel stresses, which are thought to be the cause of interfacial debonding.

  18. Radiative magnetized thermal conduction fronts

    NASA Technical Reports Server (NTRS)

    Borkowski, Kazimierz J.; Balbus, Steven A.; Fristrom, Carl C.

    1990-01-01

    The evolution of plane-parallel magnetized thermal conduction fronts in the interstellar medium (ISM) was studied. Separating the coronal ISM phase and interstellar clouds, these fronts have been thought to be the site of the intermediate-temperature regions whose presence was inferred from O VI absorption-line studies. The front evolution was followed numerically, starting from the initial discontinuous temperature distribution between the hot and cold medium, and ending in the final cooling stage of the hot medium. It was found that, for the typical ISM pressure of 4000 K/cu cm and the hot medium temperature of 10 to the 6th K, the transition from evaporation to condensation in a nonmagnetized front occurs when the front thickness is 15 pc. This thickness is a factor of 5 smaller than previously estimated. The O VI column densities in both evaporative and condensation stages agree with observations if the initial hot medium temperature Th exceeds 750,000 K. Condensing conduction fronts give better agreement with observed O VI line profiles because of lower gas temperatures.

  19. How to Measure Thermal Conductivity

    NASA Astrophysics Data System (ADS)

    Ventura, Guglielmo; Perfetti, Mauro

    The methods to measure the thermal conductivity at low temperature are described: the steady-state techniques, (Sect. 2.2 ); the 3ω technique (Sect. 2.3 ); and the thermal diffusivity measurement (Sect. 2.4 ). Each of these techniques has its own advantages as well as its inherent limitations, with some techniques more appropriate to specific sample geometry, such as the 3ω technique for thin films which is discussed in detail in Sect. 2.4.2 . The radial flux method is reported in Sect. 2.2.4 , the laser flash diffusivity method in Sect. 2.4.1 and the "pulsed power or Maldonado technique" in Sect. 2.3.2 .

  20. Cellular adhesion, proliferation and viability on conducting polymer substrates.

    PubMed

    del Valle, Luis J; Estrany, Francesc; Armelin, Elaine; Oliver, Ramón; Alemán, Carlos

    2008-12-01

    This work reports a comprehensive study about cell adhesion and proliferation on the surface of different electroactive substrates formed by pi-conjugated polymers. Biological assays were performed considering four different cellular lines: two epithelial and two fibroblasts. On the other hand, the electroactivity of the three conducting systems was determined in physiological conditions. Results indicate that the three substrates behave as a cellular matrix, even though compatibility with cells is larger for PPy and the 3-layered system. Furthermore, the three polymeric systems are electro-compatible with the cellular monolayers. PMID:18683167

  1. Thermal conductivity of sputtered amorphous Ge films

    SciTech Connect

    Zhan, Tianzhuo; Xu, Yibin; Goto, Masahiro; Tanaka, Yoshihisa; Kato, Ryozo; Sasaki, Michiko; Kagawa, Yutaka

    2014-02-15

    We measured the thermal conductivity of amorphous Ge films prepared by magnetron sputtering. The thermal conductivity was significantly higher than the value predicted by the minimum thermal conductivity model and increased with deposition temperature. We found that variations in sound velocity and Ge film density were not the main factors in the high thermal conductivity. Fast Fourier transform patterns of transmission electron micrographs revealed that short-range order in the Ge films was responsible for their high thermal conductivity. The results provide experimental evidences to understand the underlying nature of the variation of phonon mean free path in amorphous solids.

  2. Thermal conductance of multilayered metallic sheets

    NASA Astrophysics Data System (ADS)

    Fletcher, L. S.; Blanchard, D. G.; Kinnear, K. P.

    1991-06-01

    An experimental investigation was conducted to determine the thermal conductivity, the overall thermal conductance, and the thermal contact conductance between layers of stacked aluminum alloy 3004, 5042, and 5182 sheet. Tests were conducted for aluminum sample thicknesses of 0.0305 to 0.3074 cm (0.012 to 0.121 in.), mean junction temperatures of 79.5 and 165.5 C (175 and 330 F), and contact pressures of 0.689 to 10.34 MPa (100 to 1500 psi). The overall thermal conductance increased with increasing contact pressure and increasing temperature. It decreased as the number of aluminum layers was increased. The experimental data were used to derive thermal contact conductance between layers of stacked aluminum sheet. From these derived values, a correlation for the thermal contact conductance was developed. The resulting expressions are presented as a function of dimensionless parameters for the layer material, apparent contact pressure, and mean junction temperature.

  3. Thermally Conductive-Silicone Composites with Thermally Reversible Cross-links.

    PubMed

    Wertz, J T; Kuczynski, J P; Boday, D J

    2016-06-01

    Thermally conductive-silicone composites that contain thermally reversible cross-links were prepared by blending diene- and dienophile-functionalized polydimethylsiloxane (PDMS) with an aluminum oxide conductive filler. This class of thermally conductive-silicones are useful as thermal interface materials (TIMs) within Information Technology (IT) hardware applications to allow rework of valuable components. The composites were rendered reworkable via retro Diels-Alder cross-links when temperatures were elevated above 130 °C and required little mechanical force to remove, making them advantageous over other TIM materials. Results show high thermal conductivity (0.4 W/m·K) at low filler loadings (45 wt %) compared to other TIM solutions (>45 wt %). Additionally, the adhesion of the material was found to be ∼7 times greater at lower temperatures (25 °C) and ∼2 times greater at higher temperatures (120 °C) than commercially available TIMs. PMID:27224959

  4. Thermal Conductances of Pressed Copper Contacts

    NASA Technical Reports Server (NTRS)

    Salerno, L.; Kittel, P.; Spivak, A.

    1986-01-01

    Report describes investigation of thermal conductivities of smooth copper contacts pressed together at liquid-helium temperatures. Investigation prompted by need for accurate thermal models for infrared detectors and other cryogenic instruments.

  5. Effective Thermal Conductivity of Corrugated Insulating Materials

    NASA Astrophysics Data System (ADS)

    Yamada, Etsuro; Kato, Masayasu; Tomikawa, Takayuki; Takahashi, Kaneko

    The effective thermal conductivity of corrugated insulating materials which are made by polypropylene or polycarbonate have been measured by employing steady state comparison method for several specimen having various thickness and specific weight. The thermal conductivity of them evaluated are also by using the thermal resistance models, and are compared with above measured values and raw materials' conductivity. The main results obtained in this paper are as follows: (1) In regard to the specimen in this paper, the effective thermal conductivity increases with increasing temperature, but the increasing rate of them is small. (2) There are considerable differences between the measured values and the predicted ones that are estimated by using the thermal resistance model in which heat flow by conduction only. This differences increase with increasing specimens' thickness. This difference become extinct by considering the coexistence heat flow of conduction and radiation in the air phase of specimen. (3) The thermal resistance of specimen increases linearly with increasing specimens' thickness.

  6. Thermally Conductive Tape Based on Carbon Nanotube Arrays

    NASA Technical Reports Server (NTRS)

    Kashani, Ali

    2011-01-01

    To increase contact conductance between two mating surfaces, a conductive tape has been developed by growing dense arrays of carbon nanotubes (CNTs, graphite layers folded into cylinders) on both sides of a thermally conductive metallic foil. When the two mating surfaces are brought into contact with the conductive tape in between, the CNT arrays will adhere to the mating surface. The van der Waals force between the contacting tubes and the mating surface provides adhesion between the two mating surfaces. Even though the thermal contact conductance of a single tube-to-tube contact is small, the tremendous amount of CNTs on the surface leads to a very large overall contact conductance. Interface contact thermal resistance rises from the microroughness and the macroscopic non-planar quality of mating surfaces. When two surfaces come into contact with each other, the actual contact area may be much less than the total area of the surfaces. The real area of contact depends on the load, the surface roughness, and the elastic and inelastic properties of the surface. This issue is even more important at cryogenic temperatures, where materials become hard and brittle and vacuum is used, which prevents any gas conduction through the interstitial region. A typical approach to increase thermal contact conductance is to use thermally conducting epoxies or greases, which are not always compatible with vacuum conditions. In addition, the thermal conductivities of these compounds are often relatively low. The CNTs used in this approach can be metallic or semiconducting, depending on the folding angle and diameter. The electrical resistivity of multiwalled carbon nanotubes (MWCNTs) has been reported. MWCNTs can pass a current density and remain stable at high temperatures in air. The thermal conductivity of a MWCNT at room temperature is measured to be approximately 3,000 W/m-K, which is much larger than that of diamond. At room temperature, the thermal conductance of a 0.3 sq cm

  7. Thermal conductivity analysis of lanthanum doped manganites

    SciTech Connect

    Mansuri, Irfan; Shaikh, M. W.; Khan, E.; Varshney, Dinesh

    2014-04-24

    The temperature-dependent thermal conductivity of the doped manganites La{sub 0.7}Ca{sub 0.3}MnO{sub 3} is theoretically analyzed within the framework of Kubo formulae. The Hamiltonian consists of phonon, electron and magnon thermal conductivity contribution term. In this process we took defects, carrier, grain boundary, scattering process term and then calculate phonon, electron and magnon thermal conductivity.

  8. Thermal conductivity of nanostructured boron nitride materials.

    PubMed

    Tang, Chengchun; Bando, Yoshio; Liu, Changhong; Fan, Shoushan; Zhang, Jun; Ding, Xiaoxia; Golberg, Dmitri

    2006-06-01

    We have measured the thermal conductivity of bulky pellets made of various boron nitride (BN)-based nanomaterials, including spherical nanoparticles, perfectly structured, bamboo-like nanotubes, and collapsed nanotubes. The thermal conductivity strongly depends on the morphology of the BN nanomaterials, especially on the surface structure. Spherical BN particles have the lowest thermal conductivity while the collapsed BN nanotubes possess the best thermoconductive properties. A model was proposed to explain the experimental observations based on the heat percolation passage considerations. PMID:16722739

  9. Anisotropic Thermal Conductivity of Exfoliated Black Phosphorus.

    PubMed

    Jang, Hyejin; Wood, Joshua D; Ryder, Christopher R; Hersam, Mark C; Cahill, David G

    2015-12-22

    The anisotropic thermal conductivity of passivated black phosphorus (BP), a reactive two-dimensional material with strong in-plane anisotropy, is ascertained. The room-temperature thermal conductivity for three crystalline axes of exfoliated BP is measured by time-domain thermo-reflectance. The thermal conductivity along the zigzag direction is ≈2.5 times higher than that of the armchair direction. PMID:26516073

  10. Shuttle active thermal control system development testing. Volume 7: Improved radiator coating adhesive tests

    NASA Technical Reports Server (NTRS)

    Reed, M. W.

    1973-01-01

    Silver/Teflon thermal control coatings have been tested on a modular radiator system projected for use on the space shuttle. Seven candidate adhesives have been evaluated in a thermal vacuum test on radiator panels similar to the anticipated flight hardware configuration. Several classes of adhesives based on polyester, silicone, and urethane resin systems were tested. These included contact adhesives, heat cured adhesives, heat and pressure cured adhesives, pressure sensitive adhesives, and two part paint on or spray on adhesives. The coatings attached with four of the adhesives, two silicones and two urethanes, had no changes develop during the thermal vacuum test. The two silicone adhesives, both of which were applied to the silver/Teflon as transfer laminates to form a tape, offered the most promise based on application process and thermal performance. Each of the successful silicone adhesives required a heat and pressure cure to adhere during the cryogenic temperature excursion of the thermal-vacuum test.

  11. Low lattice thermal conductivity of stanene

    PubMed Central

    Peng, Bo; Zhang, Hao; Shao, Hezhu; Xu, Yuchen; Zhang, Xiangchao; Zhu, Heyuan

    2016-01-01

    A fundamental understanding of phonon transport in stanene is crucial to predict the thermal performance in potential stanene-based devices. By combining first-principle calculation and phonon Boltzmann transport equation, we obtain the lattice thermal conductivity of stanene. A much lower thermal conductivity (11.6 W/mK) is observed in stanene, which indicates higher thermoelectric efficiency over other 2D materials. The contributions of acoustic and optical phonons to the lattice thermal conductivity are evaluated. Detailed analysis of phase space for three-phonon processes shows that phonon scattering channels LA + LA/TA/ZA ↔ TA/ZA are restricted, leading to the dominant contributions of high-group-velocity LA phonons to the thermal conductivity. The size dependence of thermal conductivity is investigated as well for the purpose of the design of thermoelectric nanostructures. PMID:26838731

  12. Low lattice thermal conductivity of stanene.

    PubMed

    Peng, Bo; Zhang, Hao; Shao, Hezhu; Xu, Yuchen; Zhang, Xiangchao; Zhu, Heyuan

    2016-01-01

    A fundamental understanding of phonon transport in stanene is crucial to predict the thermal performance in potential stanene-based devices. By combining first-principle calculation and phonon Boltzmann transport equation, we obtain the lattice thermal conductivity of stanene. A much lower thermal conductivity (11.6 W/mK) is observed in stanene, which indicates higher thermoelectric efficiency over other 2D materials. The contributions of acoustic and optical phonons to the lattice thermal conductivity are evaluated. Detailed analysis of phase space for three-phonon processes shows that phonon scattering channels LA + LA/TA/ZA ↔ TA/ZA are restricted, leading to the dominant contributions of high-group-velocity LA phonons to the thermal conductivity. The size dependence of thermal conductivity is investigated as well for the purpose of the design of thermoelectric nanostructures. PMID:26838731

  13. Thermal effects on van der Waals adhesive forces

    NASA Astrophysics Data System (ADS)

    Pinon, A. V.; Wierez-Kien, M.; Craciun, A. D.; Beyer, N.; Gallani, J. L.; Rastei, M. V.

    2016-01-01

    We present an experimental and theoretical study on how thermal energy alters van der Waals adhesion forces in nanoscale contacts stretched by mechanical probes. The force follows a distribution whose density function is an asymmetric bell-shaped curve presenting a temperature-dependent negative skewness. With increasing temperature the asymmetry increases whereas the most probable force value decreases. Using a 2-8 Lennard-Jones interaction potential within the reaction rate theory, we offer a theoretical framework permitting an evaluation of the microscopic parameters governing adhesion in a van der Waals nanocontact subjected to mechanical fluctuations.

  14. An effective thermal conductivity measurement system

    NASA Astrophysics Data System (ADS)

    Madrid, F.; Jordà, X.; Vellvehi, M.; Guraya, C.; Coleto, J.; Rebollo, J.

    2004-11-01

    In the technical literature, there is a lack of reliable thermal parameters and, often, it is necessary to do in situ measurements for every particular material. An effective thermal conductivity measurement system has been designed and implemented to provide reliable and accurate values for that thermal parameter. The thermal conductivity of a given material is deduced from thermal resistance differential measurements of two samples. All parts of the implemented system as well as practical and theoretical solutions are described, including a power controller circuit exclusively conceived for this application. Experimental considerations to reduce the measurement error are exposed, as well as some results obtained for three different materials.

  15. Thermal conductivity behavior of boron carbides

    NASA Technical Reports Server (NTRS)

    Wood, C.; Zoltan, A.; Emin, D.; Gray, P. E.

    1983-01-01

    Knowledge of the thermal conductivity of boron carbides is necessary to evaluate its potential for high temperature thermoelectric energy conversion applications. The thermal diffusivity of hot pressed boron carbide B/sub 1-x/C/sub x/ samples as a function of composition, temperature and temperature cycling was measured. These data in concert with density and specific heat data yield the thermal conductivities of these materials. The results in terms of a structural model to explain the electrical transport data and novel mechanisms for thermal conduction are discussed.

  16. Thermal conductivity of a zirconia thermal barrier coating

    NASA Astrophysics Data System (ADS)

    Slifka, A. J.; Filla, B. J.; Phelps, J. M.; Bancke, G.; Berndt, C. C.

    1998-03-01

    The conductivity of a thermal-barrier coating composed of atmospheric plasma sprayed 8 mass percent yttria partially stabilized zirconia has been measured. This coating was sprayed on a substrate of 410 stainless steel. An absolute, steady-state measurement method was used to measure thermal conductivity from 400 to 800 K. The thermal conductivity of the coating is 0.62 W/(m·K). This measurement has shown to be temperature independent.

  17. Electrically conductive fibers thermally isolate temperature sensor

    NASA Technical Reports Server (NTRS)

    De Waard, R.; Norton, B.

    1966-01-01

    Mounting assembly provides thermal isolation and an electrical path for an unbacked thermal sensor. The sensor is suspended in the center of a plastic mounting ring from four plastic fibers, two of which are coated with an electrically conductive material and connected to electrically conductive coatings on the ring.

  18. Electrostatic control of microstructure thermal conductivity

    NASA Astrophysics Data System (ADS)

    Supino, Ryan N.; Talghader, Joseph J.

    2001-03-01

    A technology for controlling the thermal conductivity of etch-released microstructures is proposed and demonstrated by placing test structures in and out of contact with their underlying substrate. By adjusting the duty cycle of a periodic actuation, the thermal conductivity can be adjusted linearly across a wide range. Experimental work with microfilaments in air has shown a continuous tuning range from approximately 1.7×10-4 W/K to 3.3×10-4 W/K. These numbers are limited by thermal conduction through air and thermal contact conductance, respectively. The fundamental tuning range is orders of magnitude wider, limited by radiation heat transfer and the thermal contact conductance of coated structures.

  19. Anisotropic thermal conductivity in uranium dioxide.

    PubMed

    Gofryk, K; Du, S; Stanek, C R; Lashley, J C; Liu, X-Y; Schulze, R K; Smith, J L; Safarik, D J; Byler, D D; McClellan, K J; Uberuaga, B P; Scott, B L; Andersson, D A

    2014-01-01

    The thermal conductivity of uranium dioxide has been studied for over half a century, as uranium dioxide is the fuel used in a majority of operating nuclear reactors and thermal conductivity controls the conversion of heat produced by fission events to electricity. Because uranium dioxide is a cubic compound and thermal conductivity is a second-rank tensor, it has always been assumed to be isotropic. We report thermal conductivity measurements on oriented uranium dioxide single crystals that show anisotropy from 4 K to above 300 K. Our results indicate that phonon-spin scattering is important for understanding the general thermal conductivity behaviour, and also explains the anisotropy by coupling to the applied temperature gradient and breaking cubic symmetry. PMID:25080878

  20. Anisotropic thermal conductivity in uranium dioxide

    NASA Astrophysics Data System (ADS)

    Gofryk, K.; Du, S.; Stanek, C. R.; Lashley, J. C.; Liu, X.-Y.; Schulze, R. K.; Smith, J. L.; Safarik, D. J.; Byler, D. D.; McClellan, K. J.; Uberuaga, B. P.; Scott, B. L.; Andersson, D. A.

    2014-08-01

    The thermal conductivity of uranium dioxide has been studied for over half a century, as uranium dioxide is the fuel used in a majority of operating nuclear reactors and thermal conductivity controls the conversion of heat produced by fission events to electricity. Because uranium dioxide is a cubic compound and thermal conductivity is a second-rank tensor, it has always been assumed to be isotropic. We report thermal conductivity measurements on oriented uranium dioxide single crystals that show anisotropy from 4 K to above 300 K. Our results indicate that phonon-spin scattering is important for understanding the general thermal conductivity behaviour, and also explains the anisotropy by coupling to the applied temperature gradient and breaking cubic symmetry.

  1. Effective thermal conductivity of damaged composites

    NASA Astrophysics Data System (ADS)

    Graham, Samuel, Jr.

    Ceramic matrix composites (CMCs) are susceptible to matrix cracking, fiber-matrix debonding, and oxidation processes as result of their application environments. These damage mechanisms act to degrade thermal conductivity and is a concern for many CMC applications. Prediction of this degradation relies on an accurate understanding of damage and thermal conductivity, and the development of analytical or numerical models. An experimental investigation into the degradation of thermal conductivity of CMCs was performed. In addition, an assessment was made of current micromechanics models for predicting thermal conductivity degradation. Experiments were performed on unidirectional reinforced Nicalon-LAS II glass-ceramic composites. Thermal conductivity was determined through flash diffusivity experiments. This procedure was also modified to treat orthotropic composite materials. Samples were subjected to mechanical loading-, oxidation-, and thermal shock-induced damage. The results showed that mechanical loading-induced damage resulted in no change in thermal conductivity transverse to the fiber axis and up to a 3.5% change parallel to the fibers. Mechanical loading followed by oxidation resulted in thermal conductivity degradation up to 26% and 10% transverse and parallel to the fibers, respectively. These data show the importance of the fiber-matrix interface in controlling both the longitudinal and transverse thermal conductivities of damaged composites. Predictions of thermal conductivity degradation parallel to the fiber direction were made with a shear-lag type micromechanics model. Results were in excellent agreement with experimental data. Thermal diffusivity data from isothermal oxidation and thermal shock experiments showed that this procedure is an effective nondestructive monitoring method. An assessment of transverse thermal conductivity rnicromechanics models was made through comparison with numerical solutions for random fiber inclusions with random

  2. The Electronic Thermal Conductivity of Graphene.

    PubMed

    Kim, Tae Yun; Park, Cheol-Hwan; Marzari, Nicola

    2016-04-13

    Graphene, as a semimetal with the largest known thermal conductivity, is an ideal system to study the interplay between electronic and lattice contributions to thermal transport. While the total electrical and thermal conductivity have been extensively investigated, a detailed first-principles study of its electronic thermal conductivity is still missing. Here, we first characterize the electron-phonon intrinsic contribution to the electronic thermal resistivity of graphene as a function of doping using electronic and phonon dispersions and electron-phonon couplings calculated from first-principles at the level of density-functional theory and many-body perturbation theory (GW). Then, we include extrinsic electron-impurity scattering using low-temperature experimental estimates. Under these conditions, we find that the in-plane electronic thermal conductivity κe of doped graphene is ∼300 W/mK at room temperature, independently of doping. This result is much larger than expected and comparable to the total thermal conductivity of typical metals, contributing ∼10% to the total thermal conductivity of bulk graphene. Notably, in samples whose physical or domain sizes are of the order of few micrometers or smaller, the relative contribution coming from the electronic thermal conductivity is more important than in the bulk limit, because lattice thermal conductivity is much more sensitive to sample or grain size at these scales. Last, when electron-impurity scattering effects are included we find that the electronic thermal conductivity is reduced by 30 to 70%. We also find that the Wiedemann-Franz law is broadly satisfied at low and high temperatures but with the largest deviations of 20-50% around room temperature. PMID:26907524

  3. A noncontact thermal microprobe for local thermal conductivity measurement.

    PubMed

    Zhang, Yanliang; Castillo, Eduardo E; Mehta, Rutvik J; Ramanath, Ganpati; Borca-Tasciuc, Theodorian

    2011-02-01

    We demonstrate a noncontact thermal microprobe technique for measuring the thermal conductivity κ with ∼3 μm lateral spatial resolution by exploiting quasiballistic air conduction across a 10-100 nm air gap between a joule-heated microprobe and the sample. The thermal conductivity is extracted from the measured effective thermal resistance of the microprobe and the tip-sample thermal contact conductance and radius in the quasiballistic regime determined by calibration on reference samples using a heat transfer model. Our κ values are within 5%-10% of that measured by standard steady-state methods and theoretical predictions for nanostructured bulk and thin film assemblies of pnictogen chalcogenides. Noncontact thermal microprobing demonstrated here mitigates the strong dependence of tip-sample heat transfer on sample surface chemistry and topography inherent in contact methods, and allows the thermal characterization of a wide range of nanomaterials. PMID:21361625

  4. A noncontact thermal microprobe for local thermal conductivity measurement

    NASA Astrophysics Data System (ADS)

    Zhang, Yanliang; Castillo, Eduardo E.; Mehta, Rutvik J.; Ramanath, Ganpati; Borca-Tasciuc, Theodorian

    2011-02-01

    We demonstrate a noncontact thermal microprobe technique for measuring the thermal conductivity κ with ˜3 μm lateral spatial resolution by exploiting quasiballistic air conduction across a 10-100 nm air gap between a joule-heated microprobe and the sample. The thermal conductivity is extracted from the measured effective thermal resistance of the microprobe and the tip-sample thermal contact conductance and radius in the quasiballistic regime determined by calibration on reference samples using a heat transfer model. Our κ values are within 5%-10% of that measured by standard steady-state methods and theoretical predictions for nanostructured bulk and thin film assemblies of pnictogen chalcogenides. Noncontact thermal microprobing demonstrated here mitigates the strong dependence of tip-sample heat transfer on sample surface chemistry and topography inherent in contact methods, and allows the thermal characterization of a wide range of nanomaterials.

  5. Nanostructured conducting polymers for stiffness controlled cell adhesion

    NASA Astrophysics Data System (ADS)

    Moyen, Eric; Hama, Adel; Ismailova, Esma; Assaud, Loic; Malliaras, George; Hanbücken, Margrit; Owens, Roisin M.

    2016-02-01

    We propose a facile and reproducible method, based on ultra thin porous alumina membranes, to produce cm2 ordered arrays of nano-pores and nano-pillars on any kind of substrates. In particular our method enables the fabrication of conducting polymers nano-structures, such as poly[3,4-ethylenedioxythiophene]:poly[styrene sulfonate] (PEDOT:PSS). Here, we demonstrate the potential interest of those templates with controlled cell adhesion studies. The triggering of the eventual fate of the cell (proliferation, death, differentiation or migration) is mediated through chemical cues from the adsorbed proteins and physical cues such as surface energy, stiffness and topography. Interestingly, as well as through material properties, stiffness modifications can be induced by nano-topography, the ability of nano-pillars to bend defining an effective stiffness. By controlling the diameter, length, depth and material of the nano-structures, one can possibly tune the effective stiffness of a (nano) structured substrate. First results indicate a possible change in the fate of living cells on such nano-patterned devices, whether they are made of conducting polymer (soft material) or silicon (hard material).

  6. Electrically conductive and thermally conductive materials for electronic packaging

    NASA Astrophysics Data System (ADS)

    Liu, Zongrong

    The aim of this dissertation is to develop electrically or thermally conductive materials that are needed for electronic packaging and microelectronic cooling. These materials are in the form of coatings and are made from pastes. The research work encompasses paste formulation, studying the process of converting a paste to a conductive material, relating the processing conditions to the structure and performance, and evaluating performance attributes that are relevant to the application of these conductive materials. The research has resulted in new information that is valuable to the microelectronic industry. Work on electrically conductive materials emphasizes the development of electrical interconnection materials in the form of air-firable glass-free silver-based electrically conductive thick films, which use the Ti-Al alloy as the binder and are in contrast to conventional films that use glass as the binder. The air-firability, as enabled by minor additions of tin and zinc to the paste, is in contrast to previous glass-free films that are not firable. The recommended firing condition is 930°C in air. The organic vehicle in the paste comprises ethyl cellulose, which undergoes thermal decomposition during burnout of the paste. The ethyl cellulose is dissolved in ether, which facilitates the burnout. Excessive ethyl cellulose hinders the burnout. A higher heating rate results in more residue after burnout. The presence of silver particles facilitates drying and burnout. Firing in air gives lower resistivity than firing in oxygen. Firing in argon gives poor films. Compared to conventional films that use glass as the binder, these films, when appropriately fired, exhibit lower electrical resistivity (2.5 x 10-6 O.cm) and higher scratch resistance. Work on thermally conductive materials addresses thermal interface materials, which are materials placed at the interface between a heat sink and a heat source for the purpose of improving the thermal contact. Heat

  7. Tensile adhesion testing methodology for thermally sprayed coatings

    NASA Technical Reports Server (NTRS)

    Berndt, Christopher C.

    1990-01-01

    The structure of thermally sprayed coatings consists of lamellae which are oriented parallel to the substrate surface. The lamellae separate and fracture by distinctive mechanisms which are reflected in the failure morphology, and these may be described as adhesive (between the coating and substrate), cohesive (within the coating), or mixed mode. There is a large variability in the failure stress for any nominally identical group of coatings. A lower bound for the fracture toughness of alumina coatings can be calculated as 0.2 MNm exp -3/2. The coating strength values may also be treated as belonging to the statistical distribution of the Weibull function. The Weibull modulus of the coating strength varied from 1.4 to 3.8. This analysis infers that the flaw size within coatings is highly variable and that the flaws are nonuniformly dispersed. The present work focuses on the question of whether tensile adhesion tests are an appropriate testing method for thermally sprayed materials.

  8. Lattice thermal conductivity crossovers in semiconductor nanowires.

    PubMed

    Mingo, N; Broido, D A

    2004-12-10

    For binary compound semiconductor nanowires, we find a striking relationship between the nanowire's thermal conductivity kappa(nwire), the bulk material's thermal conductivity kappa(bulk), and the mass ratio of the material's constituent atoms, r, as kappa(bulk)/kappa(nwire) (alpha) (1+1/r)(-3/2). A significant consequence is the presence of crossovers in which a material with higher bulk thermal conductivity than the rest is no longer the best nanowire thermal conductor. We show that this behavior stems from a change in the dominant phonon scattering mechanism with decreasing nanowire size. The results have important implications for nanoscale heat dissipation, thermoelectricity, and thermal conductivity of nanocomposites. PMID:15697834

  9. Conductivity-limiting bipolar thermal conductivity in semiconductors

    PubMed Central

    Wang, Shanyu; Yang, Jiong; Toll, Trevor; Yang, Jihui; Zhang, Wenqing; Tang, Xinfeng

    2015-01-01

    Intriguing experimental results raised the question about the fundamental mechanisms governing the electron-hole coupling induced bipolar thermal conduction in semiconductors. Our combined theoretical analysis and experimental measurements show that in semiconductors bipolar thermal transport is in general a “conductivity-limiting” phenomenon, and it is thus controlled by the carrier mobility ratio and by the minority carrier partial electrical conductivity for the intrinsic and extrinsic cases, respectively. Our numerical method quantifies the role of electronic band structure and carrier scattering mechanisms. We have successfully demonstrated bipolar thermal conductivity reduction in doped semiconductors via electronic band structure modulation and/or preferential minority carrier scatterings. We expect this study to be beneficial to the current interests in optimizing thermoelectric properties of narrow gap semiconductors. PMID:25970560

  10. Conductivity-limiting bipolar thermal conductivity in semiconductors.

    PubMed

    Wang, Shanyu; Yang, Jiong; Toll, Trevor; Yang, Jihui; Zhang, Wenqing; Tang, Xinfeng

    2015-01-01

    Intriguing experimental results raised the question about the fundamental mechanisms governing the electron-hole coupling induced bipolar thermal conduction in semiconductors. Our combined theoretical analysis and experimental measurements show that in semiconductors bipolar thermal transport is in general a "conductivity-limiting" phenomenon, and it is thus controlled by the carrier mobility ratio and by the minority carrier partial electrical conductivity for the intrinsic and extrinsic cases, respectively. Our numerical method quantifies the role of electronic band structure and carrier scattering mechanisms. We have successfully demonstrated bipolar thermal conductivity reduction in doped semiconductors via electronic band structure modulation and/or preferential minority carrier scatterings. We expect this study to be beneficial to the current interests in optimizing thermoelectric properties of narrow gap semiconductors. PMID:25970560

  11. Thermal conductivity of garnet laser crystals

    NASA Astrophysics Data System (ADS)

    Wang, B. S.; Jiang, H. H.; Zhang, Q. L.; Yin, S. T.

    2008-03-01

    The thermal conductivities of nine different synthetic garnet laser crystals at various temperatures, range from 273 to 393 K have been investigated by instantaneous measurement method. The results show that the thermal conductivity of each crystal decreases exponentially with the temperature increasing. It is notable that, different host crystals, such as YAG, GGG, and GSGG have different thermal conductivity, which is attributed to the crucial influence of crystal structure and composition on the absolute value of their thermal conductivity. Moreover, with respect to the same host crystals, the impurity scattering also results in the change of their thermal conductivities. This is because that a higher concentration of doped ions leads to a more phonon scattering modes, which results in a shorter mean free path of the phonons and a lower thermal conductivity. In addition, different host crystals have various dependences of thermal conductivity on dopant concentration. This works provides reliable and useful information for designing high power, high quality, and high stability laser devices.

  12. Thermal conductivity of synthetic garnet laser crystals

    NASA Astrophysics Data System (ADS)

    Wang, B. S.; Jiang, H. H.; Zhang, Q. L.; Yin, S. T.

    2007-07-01

    The thermal conductivities of nine different synthetic garnet laser crystals at various temperatures, range from 273 to 393K have been investigated by instantaneous measurement method. The results show that the thermal conductivity of each crystal decreases exponentially with the temperature increasing. It is notable that, different host crystals, such as YAG, GGG, and GSGG have different thermal conductivity, which is attributed to the crucial influence of crystal structure and composition on the absolute value of their thermal conductivity. Moreover, with respect to the same host crystals, the impurity scattering also results in the change of their thermal conductivities. This is because that a higher concentration of doped ions leads to a more phonon scattering modes, which results in a shorter mean free path of the phonons and a lower thermal conductivity. In addition, different host crystals have various dependences of thermal conductivity on dopant concentration. This works provides reliable and useful information for designing high power, high quality, and high stability laser devices.

  13. Thermal conductivity of uterine tissue in vitro.

    PubMed

    Olsrud, J; Friberg, B; Ahlgren, M; Persson, B R

    1998-08-01

    Thermotherapy of the uterus has emerged as an alternative to hysterectomy in the treatment of menorrhagia, from whence it follows that the thermal properties of uterine tissue have become of importance. This study presents measurements of the thermal conductivity and the water content of uterine tissue in vitro. A steady-state thermal conductivity apparatus, based on the comparison of test samples with a material with known thermal conductivity, is described. Measurements were conducted on tissue samples from eleven patients, directly after hysterectomy. Samples with and without endometrium, as well as coagulated samples, were examined. The thermal conductivity of myometrial tissue was found to be 0.536 +/- 0.012 W m(-1) K(-1) (mean +/- 1 SD) and the corresponding water content was 81.2 +/- 1.5% (mean +/- 1 SD). Measurements on samples with both endometrium and myometrium showed similar thermal conductivity (0.542 +/- 0.008 W m(-1) K(-1), mean +/- 1 SD) and water content (81.6 +/- 0.7%, mean +/- 1 SD). It was also indicated that coagulation causes dehydration, resulting in a lower thermal conductivity. PMID:9725614

  14. Thermal conductivity measurements of Summit polycrystalline silicon.

    SciTech Connect

    Clemens, Rebecca; Kuppers, Jaron D.; Phinney, Leslie Mary

    2006-11-01

    A capability for measuring the thermal conductivity of microelectromechanical systems (MEMS) materials using a steady state resistance technique was developed and used to measure the thermal conductivities of SUMMiT{trademark} V layers. Thermal conductivities were measured over two temperature ranges: 100K to 350K and 293K to 575K in order to generate two data sets. The steady state resistance technique uses surface micromachined bridge structures fabricated using the standard SUMMiT fabrication process. Electrical resistance and resistivity data are reported for poly1-poly2 laminate, poly2, poly3, and poly4 polysilicon structural layers in the SUMMiT process from 83K to 575K. Thermal conductivity measurements for these polysilicon layers demonstrate for the first time that the thermal conductivity is a function of the particular SUMMiT layer. Also, the poly2 layer has a different variation in thermal conductivity as the temperature is decreased than the poly1-poly2 laminate, poly3, and poly4 layers. As the temperature increases above room temperature, the difference in thermal conductivity between the layers decreases.

  15. Effects of Transitional Buffering Interface coatings on thermal contact conductance

    NASA Astrophysics Data System (ADS)

    Chung, K. C.; Sheffield, J. W.; Sauer, H. J., Jr.; O'Keefe, T. J.; Zhang, J.

    1991-06-01

    Enhancing thermal contact conductance by a reliable and durable coating technique, Transitional Buffering Interface (TBI), has been investigated. A phase mixed coatings, Cu/C, and pure copper coatings on both primary surfaces of specimens were evaluated using four different surface roughnesses. All the samples are being tested at the following contact pressure sequence 125, 250, 375, 500, 375, 250 and 125 kPa. The test results of thermal contact conductance are presented in terms of coating thickness, surface texture and properties of coating materials. Vickers microhardness correlations are also presented for phase mixture copper and carbon and pure copper coatings. Using the experimental data, dimensionless expressions were developed that related the contact conductance of phase mixture copper-carbon and pure copper coatings to the coating thickness, the surface roughness, the contact pressure and the properties of aluminum substrate. The adhesive test indicated good durability of TBI coating surfaces.

  16. Thermal Conductivity and Sintering Behavior of Advanced Thermal Barrier Coatings

    NASA Technical Reports Server (NTRS)

    Zhu, Dongming; Miller, Robert A.

    2002-01-01

    Advanced thermal barrier coatings, having significantly reduced long-term thermal conductivities, are being developed using an approach that emphasizes real-time monitoring of thermal conductivity under conditions that are engine-like in terms of temperatures and heat fluxes. This is in contrast to the traditional approach where coatings are initially optimized in terms of furnace and burner rig durability with subsequent measurement in the as-processed or furnace-sintered condition. The present work establishes a laser high-heat-flux test as the basis for evaluating advanced plasma-sprayed and physical vapor-deposited thermal barrier coatings under the NASA Ultra Efficient Engine Technology (UEET) Program. The candidate coating materials for this program are novel thermal barrier coatings that are found to have significantly reduced thermal conductivities due to an oxide-defect-cluster design. Critical issues for designing advanced low conductivity coatings with improved coating durability are also discussed.

  17. An Innovative High Thermal Conductivity Fuel Design

    SciTech Connect

    Jamil A. Khan

    2009-11-21

    Thermal conductivity of the fuel in today's Light Water Reactors, Uranium dioxide, can be improved by incorporating a uniformly distributed heat conducting network of a higher conductivity material, Silicon Carbide. The higher thermal conductivity of SiC along with its other prominent reactor-grade properties makes it a potential material to address some of the related issues when used in UO2 [97% TD]. This ongoing research, in collaboration with the University of Florida, aims to investigate the feasibility and develop a formal methodology of producing the resultant composite oxide fuel. Calculations of effective thermal conductivity of the new fuel as a function of %SiC for certain percentages and as a function of temperature are presented as a preliminary approach. The effective thermal conductivities are obtained at different temperatures from 600K to 1600K. The corresponding polynomial equations for the temperature-dependent thermal conductivities are given based on the simulation results. Heat transfer mechanism in this fuel is explained using a finite volume approach and validated against existing empirical models. FLUENT 6.1.22 was used for thermal conductivity calculations and to estimate reduction in centerline temperatures achievable within such a fuel rod. Later, computer codes COMBINE-PC and VENTURE-PC were deployed to estimate the fuel enrichment required, to maintain the same burnup levels, corresponding to a volume percent addition of SiC.

  18. Copper-Filled Electrically Conductive Adhesives with Enhanced Shear Strength

    NASA Astrophysics Data System (ADS)

    Ho, Li-Ngee; Nishikawa, Hiroshi

    2014-09-01

    In this study, the effects of diethyl carbitol (diluent) and tertiary amines on the electrical, mechanical, and rheological properties of the Cu-filled polyurethane-based electrically conductive adhesives (ECAs) were investigated. Significant difference could be observed in the electrical resistivity and shear strength of ECA prepared with different amount of diethyl carbitol. Reduced electrical resistivity was found in ECAs prepared with addition of tertiary amines, but no obvious change was observed in the shear strength of the ECA joint. Rheological property of the ECA paste was investigated in order to understand the correlation of the viscosity of ECA paste and electrical resistivity and shear strength of ECA joint. Results revealed that decrease in viscosity of the ECA paste reduced electrical resistivity and enhanced shear strength of ECA joint. A Cu-filled polyurethane-based ECA with considerably low electrical resistivity at the magnitude order range of 10-3 Ω cm, and significantly high shear strength (above 17 MPa) could be achieved.

  19. Adjustable thermal conductivity in carbon nanotube nanofluids

    NASA Astrophysics Data System (ADS)

    Xie, Huaqing; Chen, Lifei

    2009-05-01

    Homogeneous and stable nanofluids have been produced by suspending well dispersible multi-walled carbon nanotubes (CNTs) into ethylene glycol base fluid. CNT nanofluids have enhanced thermal conductivity and the enhancement ratios increase with the nanotube loading and the temperature. Thermal conductivity enhancement was adjusted by ball milling and cutting the treated CNTs suspended in the nanofluids to relatively straight CNTs with an appropriate length distribution. Our findings indicate that the straightness ratio, aspect ratio, and aggregation have collective influence on the thermal conductivity of CNT nanofluids.

  20. Electrical and thermal conductivities in dense plasmas

    SciTech Connect

    Faussurier, G. Blancard, C.; Combis, P.; Videau, L.

    2014-09-15

    Expressions for the electrical and thermal conductivities in dense plasmas are derived combining the Chester-Thellung-Kubo-Greenwood approach and the Kramers approximation. The infrared divergence is removed assuming a Drude-like behaviour. An analytical expression is obtained for the Lorenz number that interpolates between the cold solid-state and the hot plasma phases. An expression for the electrical resistivity is proposed using the Ziman-Evans formula, from which the thermal conductivity can be deduced using the analytical expression for the Lorenz number. The present method can be used to estimate electrical and thermal conductivities of mixtures. Comparisons with experiment and quantum molecular dynamics simulations are done.

  1. Increased thermal conductivity monolithic zeolite structures

    DOEpatents

    Klett, James; Klett, Lynn; Kaufman, Jonathan

    2008-11-25

    A monolith comprises a zeolite, a thermally conductive carbon, and a binder. The zeolite is included in the form of beads, pellets, powders and mixtures thereof. The thermally conductive carbon can be carbon nano-fibers, diamond or graphite which provide thermal conductivities in excess of about 100 W/mK to more than 1,000 W/mK. A method of preparing a zeolite monolith includes the steps of mixing a zeolite dispersion in an aqueous colloidal silica binder with a dispersion of carbon nano-fibers in water followed by dehydration and curing of the binder is given.

  2. Thermal conductivity of bulk nanostructured lead telluride

    SciTech Connect

    Hori, Takuma; Chen, Gang; Shiomi, Junichiro

    2014-01-13

    Thermal conductivity of lead telluride with embedded nanoinclusions was studied using Monte Carlo simulations with intrinsic phonon transport properties obtained from first-principles-based lattice dynamics. The nanoinclusion/matrix interfaces were set to completely reflect phonons to model the maximum interface-phonon-scattering scenario. The simulations with the geometrical cross section and volume fraction of the nanoinclusions matched to those of the experiment show that the experiment has already reached the theoretical limit of thermal conductivity. The frequency-dependent analysis further identifies that the thermal conductivity reduction is dominantly attributed to scattering of low frequency phonons and demonstrates mutual adaptability of nanostructuring and local disordering.

  3. Thermal gelation and tissue adhesion of biomimetic hydrogels

    PubMed Central

    Burke, Sean A; Ritter-Jones, Marsha; Lee, Bruce P; Messersmith, Phillip B

    2008-01-01

    Marine and freshwater mussels are notorious foulers of natural and manmade surfaces, secreting specialized protein adhesives for rapid and durable attachment to wet substrates. Given the strong and water-resistant nature of mussel adhesive proteins, significant potential exists for mimicking their adhesive characteristics in bioinspired synthetic polymer materials. An important component of these proteins is L-3,4-dihydroxylphenylalanine (DOPA), an amino acid believed to contribute to mussel glue solidification through oxidation and crosslinking reactions. Synthetic polymers containing DOPA residues have previously been shown to crosslink into hydrogels upon the introduction of oxidizing reagents. Here we introduce a strategy for stimuli responsive gel formation of mussel adhesive protein mimetic polymers. Lipid vesicles with a bilayer melting transition of 37 °C were designed from a mixture of dipalmitoyl and dimyristoyl phosphatidylcholines and exploited for the release of a sequestered oxidizing reagent upon heating from ambient to physiologic temperature. Colorimetric studies indicated that sodium-periodate-loaded liposomes released their cargo at the phase transition temperature, and when used in conjunction with a DOPA-functionalized poly(ethylene glycol) polymer gave rise to rapid solidification of a crosslinked polymer hydrogel. The tissue adhesive properties of this biomimetic system were determined by in situ thermal gelation of liposome/polymer hydrogel between two porcine dermal tissue surfaces. Bond strength measurements showed that the bond formed by the adhesive hydrogel (mean = 35.1 kPa, SD = 12.5 kPa, n = 11) was several times stronger than a fibrin glue control tested under the same conditions. The results suggest a possible use of this biomimetic strategy for repair of soft tissues. PMID:18458476

  4. Thermal Conductivities of Crystalline Organic Semiconductors

    NASA Astrophysics Data System (ADS)

    Brill, Joseph

    2014-03-01

    As applications for organic semiconductors grow, it is becoming increasingly important to know their thermal conductivities, k. For example, for sub-micron electronic devices, values of k>k0 ~ 5 mW/cm/K are needed, while values kthermal conductivities below k0, many molecular organic crystals also have values of k below this value. We have started measurements of both the in-plane and interplane thermal diffusivities of layered crystalline organic semiconductors using frequency[2] and position dependent[3] ac-calorimetry; the thermal conductivities are then determined from the specific heats measured with differential scanning calorimetry. For rubrene, which has kthermal conductivity is several times smaller than the in-plane value, although its temperature dependence indicates that the phonon mean-free path is at least a few layers.[4] On the other hand, the in-plane thermal conductivity of TIPS-pentacene,[5] is several times greater than k0, similar to that of the quasi-one dimensional organic metal TTF-TCNQ.[6] Remarkably, its interlayer thermal conductivity is several times larger than its in-plane value,[7] perhaps due to interactions between the large (triisopropylsilylethynyl) side groups on the pentacene backbone. Research done with Hao Zhang and Yulong Yao and supported by NSF grants DMR-0800367, EPS-0814194, and DMR-1262261.

  5. A Robust Approach to Lattice Thermal Conductivity

    NASA Astrophysics Data System (ADS)

    Nielson, Weston; Fei Zhou Team; Yi Xia Team; Vidvuds Ozolins Team

    2015-03-01

    Thermal conductivity is a key parameter in designing high performance thermoelectric materials. A multitude of computational methods have been developed to calculate lattice thermal conductivity. Molecular dynamics (MD) based techniques, including equilibrium and non-equilibrium methods, in addition to non MD-based solutions, such as the Boltzmann Transport Equation (BTE), are all capable of calculating thermal conductivity, but each comes with different sets of limitations and difficulties. After extensive use of these different methods, we have developed a robust set of tools for obtaining high-quality lattice thermal conductivity values of crystalline solids. The crux of our method involves a novel compressive sensing (CS) based approach for efficiently calculating high quality force constants for crystalline materials. The result is a technique for building lattice dynamical models that can treat compounds with large, complex unit cells and strong anharmonicity, including those with harmonically unstable phonon modes.

  6. Thermal Conductivity in Nanocrystalline Ceria Thin Films

    SciTech Connect

    Marat Khafizov; In-Wook Park; Aleksandr Chernatynskiy; Lingfeng He; Jianliang Lin; John J. Moore; David Swank; Thomas Lillo; Simon R. Phillpot; Anter El-Azab; David H. Hurley

    2014-02-01

    The thermal conductivity of nanocrystalline ceria films grown by unbalanced magnetron sputtering is determined as a function of temperature using laser-based modulated thermoreflectance. The films exhibit significantly reduced conductivity compared with stoichiometric bulk CeO2. A variety of microstructure imaging techniques including X-ray diffraction, scanning and transmission electron microscopy, X-ray photoelectron analysis, and electron energy loss spectroscopy indicate that the thermal conductivity is influenced by grain boundaries, dislocations, and oxygen vacancies. The temperature dependence of the thermal conductivity is analyzed using an analytical solution of the Boltzmann transport equation. The conclusion of this study is that oxygen vacancies pose a smaller impediment to thermal transport when they segregate along grain boundaries.

  7. Anomalous thermal conductivity of monolayer boron nitride

    NASA Astrophysics Data System (ADS)

    Tabarraei, Alireza; Wang, Xiaonan

    2016-05-01

    In this paper, we use nonequilibrium molecular dynamics modeling to investigate the thermal properties of monolayer hexagonal boron nitride nanoribbons under uniaxial strain along their longitudinal axis. Our simulations predict that hexagonal boron nitride shows an anomalous thermal response to the applied uniaxial strain. Contrary to three dimensional materials, under uniaxial stretching, the thermal conductivity of boron nitride nanoribbons first increases rather than decreasing until it reaches its peak value and then starts decreasing. Under compressive strain, the thermal conductivity of monolayer boron nitride ribbons monolithically reduces rather than increasing. We use phonon spectrum and dispersion curves to investigate the mechanism responsible for the unexpected behavior. Our molecular dynamics modeling and density functional theory results show that application of longitudinal tensile strain leads to the reduction of the group velocities of longitudinal and transverse acoustic modes. Such a phonon softening mechanism acts to reduce the thermal conductivity of the nanoribbons. On the other hand, a significant increase in the group velocity (stiffening) of the flexural acoustic modes is observed, which counteracts the phonon softening effects of the longitudinal and transverse modes. The total thermal conductivity of the ribbons is a result of competition between these two mechanisms. At low tensile strain, the stiffening mechanism overcomes the softening mechanism which leads to an increase in the thermal conductivity. At higher tensile strain, the softening mechanism supersedes the stiffening and the thermal conductivity slightly reduces. Our simulations show that the decrease in the thermal conductivity under compressive strain is attributed to the formation of buckling defects which reduces the phonon mean free path.

  8. Engineering thermal conductivity in polymer blends

    NASA Astrophysics Data System (ADS)

    Rashidi, Vahid; Coyle, Eleanor; Kieffer, John; Pipe, Kevin

    Weak inter-chain bonding in polymers is believed to be a bottleneck for both thermal conductivity and mechanical strength. Most polymers have low thermal conductivity (~0.1 W/mK), hindering their performance in applications for which thermal management is critical (e.g., electronics packaging). In this work, we use computational methods to study how hydrogen bonding between polymer chains as well as water content can be used to engineer thermal transport in bulk polymers. We examine how changes in the number of hydrogen bonds, chain elongation, density, and vibrational density of states correlate with changes in thermal conductivity for polymer blends composed of different relative constituent fractions. We also consider the effects of bond strength, tacticity, and polymer chain mass. For certain blend fractions, we observe large increases in thermal conductivity, and we analyze these increases in terms of modifications to chain chemistry (e.g., inter-chain bonding) and chain morphology (e.g., chain alignment and radius of gyration). We observe that increasing the number of hydrogen bonds in the system results in better packing as well as better chain alignment and elongation that contribute to enhanced thermal conductivity. The Air Force Office of Scientific Research, Grant No. FA9550-14-1-0010.

  9. Thermal conductivity of Apollo 16 lunar fines

    NASA Technical Reports Server (NTRS)

    Cremers, C. J.; Hsia, H. S.

    1974-01-01

    The vacuum thermal conductivity of the Apollo 16 fines is presented as a function of temperature for the approximate range of diurnal temperatures on the moon. The density used is 1500 kg/cu m, which is approximately the density of the core-tube samples returned from the landing site. The thermal diffusivity was calculated from the conductivity, density, and specific heat and is also presented.

  10. Thermal Conductivity of Alumina and Silica Nanofluids

    NASA Astrophysics Data System (ADS)

    Castellanos, Julian G. Bernal

    This thesis studies the effects of the base fluid, particle type/size, and volumetric concentration on the thermal conductivity of Alumina and Silica nanofluids. The effects of base fluid were observed by preparing samples using ethylene glycol (EG), water, and mixtures of EG/water as the base fluid and Al2O3 (10 nm) nanoparticles. The particles type/size and volumetric concentration effects were tested by preparing samples of nanofluids using Al2O3 (10nm), Al2O3 (150nm), SiO2 (15 nm), and SiO2 (80 nm) nanoparticles and ionized water as base fluid at different volumetric concentrations. All samples were mixed using a sonicator for 30 minutes and a water circulator to maintain the sample at room temperature. The thermal conductivity was measured using a Thermtest Transient Plane Source TPS 500S. The effects of gravity, Brownian motion and thermophoresis were also studied. EG produced the highest thermal conductivity enhancement out of all base fluids tested. Smaller particle size produced a higher enhancement of thermal conductivity, while the volumetric concentration did not have a significant effect in the thermal conductivity enhancement. Finally, gravity, Brownian diffusion and thermophoresis effects played a role in the total enhancement of the thermal conductivity. The nanoparticles were observed to settle rapidly after sonication suggesting gravity effects may play a significant role.

  11. Polyethylene nanofibres with very high thermal conductivities.

    PubMed

    Shen, Sheng; Henry, Asegun; Tong, Jonathan; Zheng, Ruiting; Chen, Gang

    2010-04-01

    Bulk polymers are generally regarded as thermal insulators, and typically have thermal conductivities on the order of 0.1 W m(-1) K(-1). However, recent work suggests that individual chains of polyethylene--the simplest and most widely used polymer--can have extremely high thermal conductivity. Practical applications of these polymers may also require that the individual chains form fibres or films. Here, we report the fabrication of high-quality ultra-drawn polyethylene nanofibres with diameters of 50-500 nm and lengths up to tens of millimetres. The thermal conductivity of the nanofibres was found to be as high as approximately 104 W m(-1) K(-1), which is larger than the conductivities of about half of the pure metals. The high thermal conductivity is attributed to the restructuring of the polymer chains by stretching, which improves the fibre quality toward an 'ideal' single crystalline fibre. Such thermally conductive polymers are potentially useful as heat spreaders and could supplement conventional metallic heat-transfer materials, which are used in applications such as solar hot-water collectors, heat exchangers and electronic packaging. PMID:20208547

  12. Simultaneous Measurement of Thermal Diffusivity and Thermal Conductivity by Means of Inverse Solution for One-Dimensional Heat Conduction (Anisotropic Thermal Properties of CFRP for FCEV)

    NASA Astrophysics Data System (ADS)

    Kosaka, Masataka; Monde, Masanori

    2015-11-01

    For safe and fast fueling of hydrogen in a fuel cell electric vehicle at hydrogen fueling stations, an understanding of the heat transferred from the gas into the tank wall (carbon fiber reinforced plastic (CFRP) material) during hydrogen fueling is necessary. Its thermal properties are needed in estimating heat loss accurately during hydrogen fueling. The CFRP has anisotropic thermal properties, because it consists of an adhesive agent and layers of the CFRP which is wound with a carbon fiber. In this paper, the thermal diffusivity and thermal conductivity of the tank wall material were measured by an inverse solution for one-dimensional unsteady heat conduction. As a result, the thermal diffusivity and thermal conductivity were 2.09 × 10^{-6}{ m}2{\\cdot }{s}^{-1} and 3.06{ W}{\\cdot }{m}{\\cdot }^{-1}{K}^{-1} for the axial direction, while they were 6.03 × 10^{-7} {m}2{\\cdot }{s}^{-1} and 0.93 {W}{\\cdot }{m}^{-1}{\\cdot }{K}^{-1} for the radial direction. The thermal conductivity for the axial direction was about three times higher than that for the radial direction. The thermal diffusivity shows the same trend in both directions because the thermal capacity, ρ c, is independent of direction, where ρ is the density and c is the heat capacity.

  13. Thermal Conductivity of Carbon Nanotube Composite Films

    NASA Technical Reports Server (NTRS)

    Ngo, Quoc; Cruden, Brett A.; Cassell, Alan M.; Walker, Megan D.; Koehne, Jessica E.; Meyyappan, M.; Li, Jun; Yang, Cary Y.

    2004-01-01

    State-of-the-art ICs for microprocessors routinely dissipate power densities on the order of 50 W/sq cm. This large power is due to the localized heating of ICs operating at high frequencies, and must be managed for future high-frequency microelectronic applications. Our approach involves finding new and efficient thermally conductive materials. Exploiting carbon nanotube (CNT) films and composites for their superior axial thermal conductance properties has the potential for such an application requiring efficient heat transfer. In this work, we present thermal contact resistance measurement results for CNT and CNT-Cu composite films. It is shown that Cu-filled CNT arrays enhance thermal conductance when compared to as-grown CNT arrays. Furthermore, the CNT-Cu composite material provides a mechanically robust alternative to current IC packaging technology.

  14. Lower-Conductivity Thermal-Barrier Coatings

    NASA Technical Reports Server (NTRS)

    Miller, Robert A.; Zhu, Dongming

    2003-01-01

    Thermal-barrier coatings (TBCs) that have both initial and post-exposure thermal conductivities lower than those of yttria-stabilized zirconia TBCs have been developed. TBCs are thin ceramic layers, generally applied by plasma spraying or physical vapor deposition, that are used to insulate air-cooled metallic components from hot gases in gas turbine and other heat engines. Heretofore, yttria-stabilized zirconia (nominally comprising 95.4 atomic percent ZrO2 + 4.6 atomic percent Y2O3) has been the TBC material of choice. The lower-thermal-conductivity TBCs are modified versions of yttria-stabilized zirconia, the modifications consisting primarily in the addition of other oxides that impart microstructural and defect properties that favor lower thermal conductivity.

  15. Thermal conductivity behavior of superatom molecular crystals

    NASA Astrophysics Data System (ADS)

    Ong, Wee-Liat; O'Brien, Evan; Dougherty, Patrick; Epstein, Jillian; Higgs, C. Fred; McGaughey, Alan; Roy, Xavier; Malen, Jonathan

    The room temperature thermal conductivity of several superatom molecular crystals (SMCs) are measured and found to be below 0.3 W/mK. The trend of room temperature thermal conductivity of the different crystals agree well with their sound speeds obtained independently using nano-indentation. These crystals, however, can exhibit non-crystalline thermal conductivity behavior depending on their constituent elements. A superatom is a cluster of atoms that acts as a stable entity [e.g., fullerenes (C60)]. By careful mixing and assembling these nano-sized superatoms, the resulting superatom-assembled materials hold promises for improving various technological devices. Organic-inorganic superatoms can assemble into unary SMCs or co-crystallized with C60 superatoms into binary SMCs. Thermal transport is of considerable interest with possible new physics in these hierarchically atomic precise crystals in the low temperature regime. The thermal conductivity of the SMCs are measured using the frequency domain thermoreflectance setup. Unary SMCs exhibit an almost invariant thermal conductivity down to a temperature of 150 K. Binary SMCs, however, can either show a crystalline-like increase or an amorphous-like decrease with decreasing temperature.

  16. Thermal contact conductance of spherical, rough metals

    SciTech Connect

    Lambert, M.A.; Fletcher, L.S.

    1996-12-31

    Junction thermal conductance is an important consideration in such applications as thermally induced stresses in supersonic and hypersonic flight vehicles, nuclear reactor cooling, electronics packaging, spacecraft thermal control, gas turbine and internal combustion engine cooling, and cryogenic liquid storage. A fundamental problem in analyzing and predicting junction thermal conductance is thermal contact conductance of non-flat, rough metals. Workable models have been previously derived for the limiting idealized cases of flat, rough and spherical, smooth surfaces. However, until now, no tractable models have been advanced for non-flat, rough surfaces (so called engineering surfaces) which are much more commonly dealt with in practice. The present investigation details the synthesis of previously derived models for macroscopically non-uniform thermal contact conductance and contact of non-flat, rough spheres, into a thermo-mechanical model, its refinement, and its presentation in an easily applied format. The present model is compared to representative experimental conductance results form the literature for stainless steel 304 with widely varying flatness deviation and roughness. Also included in the comparisons is a previous, often cited model for flat, rough metals to which the present model reduces in the limit of flat surfaces. The present model agrees well with the experimental results over the wide ranges of flatness deviation and roughness for which data was available. Conversely, the previous, well known model becomes increasingly overpredictive with increasing flatness deviation.

  17. Thermal Conductivity Of Natural Type IIa Diamond

    NASA Technical Reports Server (NTRS)

    Vandersande, Jan; Vining, Cronin; Zoltan, Andrew

    1992-01-01

    Report describes application of flash diffusivity method to measure thermal conductivity of 8.04 x 8.84 x 2.35-mm specimen of natural, white, type-IIa diamond at temperatures between 500 and 1,250 K. Provides baseline for comparison to isotopically pure (12C) diamond. Results used as reference against which diamond films produced by chemical-vapor deposition at low pressures can be compared. High thermal conductivity of diamond exploited for wide variety of applications, and present results also used to estimate heat-conduction performances of diamond films in high-temperature applications.

  18. Thermal conductivity of uterine tissue in vitro

    NASA Astrophysics Data System (ADS)

    Olsrud, Johan; Friberg, Britt; Ahlgren, Mats; Persson, Bertil R. R.

    1998-08-01

    Thermotherapy of the uterus has emerged as an alternative to hysterectomy in the treatment of menorrhagia, from whence it follows that the thermal properties of uterine tissue have become of importance. This study presents measurements of the thermal conductivity and the water content of uterine tissue in vitro. A steady-state thermal conductivity apparatus, based on the comparison of test samples with a material with known thermal conductivity, is described. Measurements were conducted on tissue samples from eleven patients, directly after hysterectomy. Samples with and without endometrium, as well as coagulated samples, were examined. The thermal conductivity of myometrial tissue was found to be and the corresponding water content was % . Measurements on samples with both endometrium and myometrium showed similar thermal conductivity (, ) and water content (%, ). It was also indicated that coagulation causes dehydration, resulting in a lower thermal conductivity.

  19. The Lattice and Thermal Radiation Conductivity of Thermal Barrier Coatings

    NASA Technical Reports Server (NTRS)

    Zhu, Dongming; Spuckler, Charles M.

    2008-01-01

    The lattice and radiation conductivity of thermal barrier coatings was evaluated using a laser heat flux approach. A diffusion model has been established to correlate the apparent thermal conductivity of the coating to the lattice and radiation conductivity. The radiation conductivity component can be expressed as a function of temperature and the scattering and absorption properties of the coating material. High temperature scattering and absorption of the coating systems can also be derived based on the testing results using the modeling approach. The model prediction is found to have good agreement with experimental observations.

  20. Comparison of thermal diffusivity and thermal conductivity methods

    SciTech Connect

    Sheffield, G.S.; Schorr, J.R. )

    1991-01-01

    This paper reports on applications involving ceramics which require that this diverse group of materials act as either thermal insulators or thermal conductors. Values of thermal conductivity can range over more than 4 orders of magnitude from 0.1 W/(m {center dot} K) (0.7 BTU {center dot} in./(h {center dot} ft{sup 2} {center dot} {degrees}F)) for fiberboard insulation to 1300 W/(M {center dot} K) (9013 BTU {center dot} in./(h {center dot} {degrees}F)) for boron nitride. The magnitude of temperature gradients in materials is governed by thermal diffusivity and thermal conductivity. In ceramic materials, gradients can create significant thermal stresses, cause heat flow (causing furnaces to heat but also causing usually undesirable heat losses) and be a controlling factor in reaction rates. In general, no single method is dominant because of the wide range of temperatures involved, the large variations in diffusivity and conductivity encountered, the differences in sampling requirements (homogeneity), and the duration of measurement time. Five thermal diffusivity and conductivity methods, all of which have been successfully applied to ceramic materials are reviewed. The methods covered are dynamic radial heat flow, laser flash, hot wire, calorimeter, and guarded hot plate. The dynamic radial heat flow and laser flash methods are diffusivity methods, whereas the remaining three are representative of conductivity methods.

  1. Thermal conductivity of tubrostratic carbon nanofiber networks

    DOE PAGESBeta

    Bauer, Matthew L.; Saltonstall, Chris B.; Leseman, Zayd C.; Beechem, Thomas E.; Hopkins, Patrick E.; Norris, Pamela M.

    2016-01-01

    Composite material systems composed of a matrix of nano materials can achieve combinations of mechanical and thermophysical properties outside the range of traditional systems. While many reports have studied the intrinsic thermal properties of individual carbon fibers, to be useful in applications in which thermal stability is critical, an understanding of heat transport in composite materials is required. In this work, air/ carbon nano fiber networks are studied to elucidate the system parameters influencing thermal transport. Sample thermal properties are measured with varying initial carbon fiber fill fraction, environment pressure, loading pressure, and heat treatment temperature through a bidirectional modificationmore » of the 3ω technique. The nanostructures of the individual fibers are characterized with small angle x-ray scattering and Raman spectroscopy providing insight to individual fiber thermal conductivity. Measured thermal conductivity varied from 0.010 W/(m K) to 0.070 W/(m K). An understanding of the intrinsic properties of the individual fibers and the interactions of the two phase composite is used to reconcile low measured thermal conductivities with predictive modeling. This methodology can be more generally applied to a wide range of fiber composite materials and their applications.« less

  2. Thermal conductivity of tubrostratic carbon nanofiber networks

    SciTech Connect

    Bauer, Matthew L.; Saltonstall, Chris B.; Leseman, Zayd C.; Beechem, Thomas E.; Hopkins, Patrick E.; Norris, Pamela M.

    2016-01-01

    Composite material systems composed of a matrix of nano materials can achieve combinations of mechanical and thermophysical properties outside the range of traditional systems. While many reports have studied the intrinsic thermal properties of individual carbon fibers, to be useful in applications in which thermal stability is critical, an understanding of heat transport in composite materials is required. In this work, air/ carbon nano fiber networks are studied to elucidate the system parameters influencing thermal transport. Sample thermal properties are measured with varying initial carbon fiber fill fraction, environment pressure, loading pressure, and heat treatment temperature through a bidirectional modification of the 3ω technique. The nanostructures of the individual fibers are characterized with small angle x-ray scattering and Raman spectroscopy providing insight to individual fiber thermal conductivity. Measured thermal conductivity varied from 0.010 W/(m K) to 0.070 W/(m K). An understanding of the intrinsic properties of the individual fibers and the interactions of the two phase composite is used to reconcile low measured thermal conductivities with predictive modeling. This methodology can be more generally applied to a wide range of fiber composite materials and their applications.

  3. Thermal conductivity of hydrate-bearing sediments

    USGS Publications Warehouse

    Cortes, D.D.; Martin, A.I.; Yun, T.S.; Francisca, F.M.; Santamarina, J.C.; Ruppel, C.

    2009-01-01

    A thorough understanding of the thermal conductivity of hydrate-bearing sediments is necessary for evaluating phase transformation processes that would accompany energy production from gas hydrate deposits and for estimating regional heat flow based on the observed depth to the base of the gas hydrate stability zone. The coexistence of multiple phases (gas hydrate, liquid and gas pore fill, and solid sediment grains) and their complex spatial arrangement hinder the a priori prediction of the thermal conductivity of hydrate-bearing sediments. Previous studies have been unable to capture the full parameter space covered by variations in grain size, specific surface, degree of saturation, nature of pore filling material, and effective stress for hydrate-bearing samples. Here we report on systematic measurements of the thermal conductivity of air dry, water- and tetrohydrofuran (THF)-saturated, and THF hydrate-saturated sand and clay samples at vertical effective stress of 0.05 to 1 MPa (corresponding to depths as great as 100 m below seafloor). Results reveal that the bulk thermal conductivity of the samples in every case reflects a complex interplay among particle size, effective stress, porosity, and fluid-versus-hydrate filled pore spaces. The thermal conductivity of THF hydrate-bearing soils increases upon hydrate formation although the thermal conductivities of THF solution and THF hydrate are almost the same. Several mechanisms can contribute to this effect including cryogenic suction during hydrate crystal growth and the ensuing porosity reduction in the surrounding sediment, increased mean effective stress due to hydrate formation under zero lateral strain conditions, and decreased interface thermal impedance as grain-liquid interfaces are transformed into grain-hydrate interfaces. Copyright 2009 by the American Geophysical Union.

  4. Measurement of the thermal contact conductance and thermal conductivity of anodized aluminum coatings

    SciTech Connect

    Peterson, G.P.; Fletcher, L.S. )

    1990-08-01

    An experimental investigation was conducted to determine the thermal contact conductance and effective thermal conductivity of anodized coatings. One chemically polished Aluminum 6061-T6 test specimen and seven specimens with anodized coatings varying in thickness from 60.9 {mu}m to 163.8 {mu}m were tested while in contact with a single unanodized aluminum surface. Measurements of the overall joint conductance, composed of the thermal contact conductance between the anodized coating and the bare aluminum surface and the bulk conductance of the coating material, indicated that the overall joint conductance decreased with increasing thickness of the anodized coating and increased with increasing interfacial load. Using the experimental data, a dimensionless expression was developed that related the overall joint conductance to the coating thickness, the surface roughness, the interfacial pressure, and the properties of the aluminum substrate. By subtracting the thermal contact conductance from the measured overall joint conductance, estimations of the effective thermal conductivity of the anodized coating as a function of pressure were obtained for each of the seven anodized specimens. At an extrapolated pressure of zero, the effective thermal conductivity was found to be approximately 0.02 W/m-K. In addition to this extrapolated value, a single expression for predicting the effective thermal conductivity as a function of both the interface pressure and the anodized coating thickness was developed and shown to be within {plus minus}5 percent of the experimental data over a pressure range of 0 to 14 MPa.

  5. Role of interfaces on thermal conductivity

    NASA Astrophysics Data System (ADS)

    Xue, Liping

    Using classical molecular dynamics (MD) simulations we study the role of interfaces on the thermal transport properties, and their role in overall heat flow in nanoscale materials. For the simple monoatomic liquid-solid interface, our simulations reveal that the key factor controlling interfacial thermal resistance is the strength of the bonding between liquid and solid atoms. The functional dependence of the thermal resistance on the strength of the liquid-solid interactions exhibits two distinct regimes. Surprisingly, ordering of the liquid at the liquid-solid interface shows no effect on the thermal transport either normal to the surface or parallel to the surface. The results suggest that the experimentally observed large enhancement of thermal conductivity in suspension of solid nanosized particles (nanofluids) can not be explained by altered thermal transport properties of the layered liquid. For the heat flow between a carbon nanotube and octane liquid interface, our simulation demonstrates the key role played by the soft vibrational modes in the mechanism of the heat flow. The results also imply that the thermal conductivity of carbon nanotube polymer composites and organic suspensions is limited by the interfacial thermal resistance and are consistent with recent experiments. We find that chemical functionalization of carbon nanotube reduces significantly the tube-matrix thermal boundary resistance, but at the same time decreases intrinsic tube conductivity. Interestingly, at high degrees of chemical functionalization, intrinsic tube conductivity becomes independent of the bond density, indicating important role of long-wavelength phonons in carbon nanotubes. Finally, we explore a different type of interfacial system: a bulk macromolecular liquid. In this case, the heat flow is controlled by the inter- and intra-chain thermal transport properties. Our simulations demonstrate that in order to significantly enhance the thermal conductivity of the liquid

  6. Implications of Adhesion Studies for Dust Mitigation on Thermal Control Surfaces

    NASA Technical Reports Server (NTRS)

    Gaier, James R.; Berkebile, Stephen P.

    2012-01-01

    Experiments measuring the adhesion forces under ultrahigh vacuum conditions (10 (exp -10) torr) between a synthetic volcanic glass and commonly used space exploration materials have recently been described. The glass has a chemistry and surface structure typical of the lunar regolith. It was found that Van der Waals forces between the glass and common spacecraft materials was negligible. Charge transfer between the materials was induced by mechanically striking the spacecraft material pin against the glass plate. No measurable adhesion occurred when striking the highly conducting materials, however, on striking insulating dielectric materials the adhesion increased dramatically. This indicates that electrostatic forces dominate over Van der Waals forces under these conditions. The presence of small amounts of surface contaminants was found to lower adhesive forces by at least two orders of magnitude, and perhaps more. Both particle and space exploration material surfaces will be cleaned by the interaction with the solar wind and other energetic processes and stay clean because of the extremely high vacuum (10 (exp -12) torr) so the atomically clean adhesion values are probably the relevant ones for the lunar surface environment. These results are used to interpret the results of dust mitigation technology experiments utilizing textured surfaces, work function matching surfaces and brushing. They have also been used to reinterpret the results of the Apollo 14 Thermal Degradation Samples experiment.

  7. Anisotropic thermal conductivity of semiconducting graphene monoxide

    NASA Astrophysics Data System (ADS)

    Pu, H. H.; Rhim, S. H.; Hirschmugl, C. J.; Gajdardziska-Josifovska, M.; Weinert, M.; Chen, J. H.

    2013-06-01

    The intrinsic thermal conductivity of monolayer graphene monoxide is determined via first-principles calculations. The phonon transport in graphene monoxide is anisotropic, with the lattice thermal conductivity along the armchair direction (…C-2O-C…) about five times higher than that along the zigzag (…C-C…) direction. The predicted thermal conductivity (>3000 Wm-1K-1 at 300 K) of graphene monoxide is 80% of that of graphene along the armchair direction for large sample lateral sizes (>5 μm). In addition, heat is predominantly carried by longitudinal acoustic phonons along the armchair direction, while the contribution from the transverse acoustic phonon mode is prevalent along the zigzag direction.

  8. Gas storage carbon with enhanced thermal conductivity

    DOEpatents

    Burchell, Timothy D.; Rogers, Michael Ray; Judkins, Roddie R.

    2000-01-01

    A carbon fiber carbon matrix hybrid adsorbent monolith with enhanced thermal conductivity for storing and releasing gas through adsorption and desorption is disclosed. The heat of adsorption of the gas species being adsorbed is sufficiently large to cause hybrid monolith heating during adsorption and hybrid monolith cooling during desorption which significantly reduces the storage capacity of the hybrid monolith, or efficiency and economics of a gas separation process. The extent of this phenomenon depends, to a large extent, on the thermal conductivity of the adsorbent hybrid monolith. This invention is a hybrid version of a carbon fiber monolith, which offers significant enhancements to thermal conductivity and potential for improved gas separation and storage systems.

  9. Recent advances in thermal conductivity of nanofluids.

    PubMed

    Witharana, Sanjeeva; Weliwita, Jinendrika Anushi; Chen, Haisheng; Wang, Liang

    2013-11-01

    This paper presents the most recent review of research articles and patents on thermal conductivity on nanofluids. Larger portion of literature accounts for experimental investigations, which is a sign of the preference for hands-on work by experimentalists. Metallic, non-metallic as well as ceramic nanoparticles of different sizes and shapes were suspended in common heat transfer liquids and their thermal conductivities were measured. In contrast to previous belief, it has now been proven that when the nanoparticle concentration is kept low the degree of enhancement falls reasonably within the boundaries predicted by the effective medium theories. There are strong evidences to suggest that the main mechanisms driving the thermal conductivity behavior are nanoparticle aggregation and the particle Brownian motion in suspension. PMID:24330042

  10. Gas storage carbon with enhanced thermal conductivity

    SciTech Connect

    Burchell, T.D.; Rogers, M.R.; Judkins, R.R.

    2000-07-18

    A carbon fiber carbon matrix hybrid adsorbent monolith with enhanced thermal conductivity for storing and releasing gas through adsorption and desorption is disclosed. The heat of adsorption of the gas species being adsorbed is sufficiently large to cause hybrid monolith heating during adsorption and hybrid monolith cooling during desorption which significantly reduces the storage capacity of the hybrid monolith, or efficiency and economics of a gas separation process. The extent of this phenomenon depends, to a large extent, on the thermal conductivity of the adsorbent hybrid monolith. This invention is a hybrid version of a carbon fiber monolith, which offers significant enhancements to thermal conductivity and potential for improved gas separation and storage systems.

  11. Enhancing thermal conductivity of fluids with nanoparticles

    SciTech Connect

    Choi, S.U.S.; Eastman, J.A.

    1995-10-01

    Low thermal conductivity is a primary limitation in the development of energy-efficient heat transfer fluids that are required in many industrial applications. In this paper we propose that an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat transfer fluids. The resulting {open_quotes}nanofluids{close_quotes} are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluids, and they represent the best hope for enhancement of heat transfer. The results of a theoretical study of the thermal conductivity of nanofluids with copper nanophase materials are presented, the potential benefits of the fluids are estimated, and it is shown that one of the benefits of nanofluids will be dramatic reductions in heat exchanger pumping power.

  12. Thermal contact conductance of pressurized surfaces

    NASA Technical Reports Server (NTRS)

    Voss, Fred E.

    1988-01-01

    Thermal vacuum testing has demonstrated the feasibility of the concept of pressurizing contact surfaces for the transfer of waste heat on the Space Station. Data show a thin inflatable bladder design to provide a greater contact conductance than an expandable bellows approach, with substantially less interface volume to transfer the same amount of heat. Extended vacuum testing of the Radiator-to-Thermal Bus assembly indicated a continual increase of conductance as the interface was maintained at 150 psi for a 100-hour period.

  13. An Innovative High Thermal Conductivity Fuel Design

    SciTech Connect

    PI: James S. Tulenko; Co-PI: Ronald H. Baney,

    2007-10-14

    Uranium dioxide (UO2) is the most common fuel material in commercial nuclear power reactors. UO2 has the advantages of a high melting point, good high-temperature stability, good chemical compatibility with cladding and coolant, and resistance to radiation. The main disadvantage of UO2 is its low thermal conductivity. During a reactor’s operation, because the thermal conductivity of UO2 is very low, for example, about 2.8 W/m-K at 1000 oC [1], there is a large temperature gradient in the UO2 fuel pellet, causing a very high centerline temperature, and introducing thermal stresses, which lead to extensive fuel pellet cracking. These cracks will add to the release of fission product gases after high burnup. The high fuel operating temperature also increases the rate of fission gas release and the fuel pellet swelling caused by fission gases bubbles. The amount of fission gas release and fuel swelling limits the life time of UO2 fuel in reactor. In addition, the high centerline temperature and large temperature gradient in the fuel pellet, leading to a large amount of stored heat, increase the Zircaloy cladding temperature in a lost of coolant accident (LOCA). The rate of Zircaloy-water reaction becomes significant at the temperature above 1200 oC [2]. The ZrO2 layer generated on the surface of the Zircaloy cladding will affect the heat conduction, and will cause a Zircaloy cladding rupture. The objective of this research is to increase the thermal conductivity of UO2, while not affecting the neutronic property of UO2 significantly. The concept to accomplish this goal is to incorporate another material with high thermal conductivity into the UO2 pellet. Silicon carbide (SiC) is a good candidate, because the thermal conductivity of single crystal SiC is 60 times higher than that of UO2 at room temperature and 30 times higher at 800 oC [3]. Silicon carbide also has the properties of low thermal neutron absorption cross section, high melting point, good chemical

  14. Thermal conductivity and diffusivity of soil

    SciTech Connect

    Sorour, M.M. ); Saleh, M.M.; Mahmoud, R.A. )

    1990-03-01

    The thermal conductivity and diffusivity of soil has been experimentally measured using the line heat source transient method. Representative samples of different textures were collected and analyzed from different localities and depths. The effect of temperatures, in the range of {minus}10{degrees}C {yields} 35{degrees}C and moisture content up to 40% on the conductivity and diffusivity were investigated. The results of this investigation indicate some interesting results and confirm some previously published data.

  15. Local measurement of thermal conductivity and diffusivity

    SciTech Connect

    Hurley, David H.; Schley, Robert S.; Khafizov, Marat; Wendt, Brycen L.

    2015-12-01

    Simultaneous measurement of local thermal diffusivity and conductivity is demonstrated on a range of ceramic samples. This was accomplished by measuring the temperature field spatial profile of samples excited by an amplitude modulated continuous wave laser beam. A thin gold film is applied to the samples to ensure strong optical absorption and to establish a second boundary condition that introduces an expression containing the substrate thermal conductivity. The diffusivity and conductivity are obtained by comparing the measured phase profile of the temperature field to a continuum based model. A sensitivity analysis is used to identify the optimal film thickness for extracting the both substrate conductivity and diffusivity. Proof of principle studies were conducted on a range of samples having thermal properties that are representative of current and advanced accident tolerant nuclear fuels. It is shown that by including the Kapitza resistance as an additional fitting parameter, the measured conductivity and diffusivity of all the samples considered agree closely with literature values. Lastly, a distinguishing feature of this technique is that it does not require a priori knowledge of the optical spot size which greatly increases measurement reliability and reproducibility.

  16. Thermal Conductance of Nanoscale VOx Epitaxial Layers

    NASA Astrophysics Data System (ADS)

    Oh, Dong-Wook; Petrov, Ivan; Cahill, David

    2010-03-01

    We use time-domain thermoreflectance to measure the thermal conductance of VOx layers in epitaxial Pt/VOx/Pt structures. In particular, the metal-insulator-transition of VO2 at 70^oC allows us to systematically explore channels for heat transport between metals and correlated-electron systems. Pt/VOx/Pt layers are deposited on a sapphire substrates by reactive DC sputtering with O2 partial pressure varied from 0% to 13%. The thermal conductance has a strong dependence on thickness, 3-50 nm, and oxygen content, pure V to V2O5. The thermal conductance of ˜10 nm thick layers of V in series with the two Pt/V interfaces is 1 GW/m^2-K, comparable to what is expected based on the diffuse-mismatch model for electron transport at interfaces. The conductance of ˜10 nm thick layers of VO2 at room temperatures is remarkably high, 0.5 GW/m^2-K, for the series conductance of two metal-dielectric interfaces. At the metal-insulator-transition, the conductance of VO2 layers increases by only 10%, indicating that electrons in Pt and electrons in metallic VO2 are not strongly coupled.

  17. Local measurement of thermal conductivity and diffusivity.

    PubMed

    Hurley, David H; Schley, Robert S; Khafizov, Marat; Wendt, Brycen L

    2015-12-01

    Simultaneous measurement of local thermal diffusivity and conductivity is demonstrated on a range of ceramic samples. This was accomplished by measuring the temperature field spatial profile of samples excited by an amplitude modulated continuous wave laser beam. A thin gold film is applied to the samples to ensure strong optical absorption and to establish a second boundary condition that introduces an expression containing the substrate thermal conductivity. The diffusivity and conductivity are obtained by comparing the measured phase profile of the temperature field to a continuum based model. A sensitivity analysis is used to identify the optimal film thickness for extracting the both substrate conductivity and diffusivity. Proof of principle studies were conducted on a range of samples having thermal properties that are representatives of current and advanced accident tolerant nuclear fuels. It is shown that by including the Kapitza resistance as an additional fitting parameter, the measured conductivity and diffusivity of all the samples considered agreed closely with the literature values. A distinguishing feature of this technique is that it does not require a priori knowledge of the optical spot size which greatly increases measurement reliability and reproducibility. PMID:26724041

  18. Local measurement of thermal conductivity and diffusivity

    NASA Astrophysics Data System (ADS)

    Hurley, David H.; Schley, Robert S.; Khafizov, Marat; Wendt, Brycen L.

    2015-12-01

    Simultaneous measurement of local thermal diffusivity and conductivity is demonstrated on a range of ceramic samples. This was accomplished by measuring the temperature field spatial profile of samples excited by an amplitude modulated continuous wave laser beam. A thin gold film is applied to the samples to ensure strong optical absorption and to establish a second boundary condition that introduces an expression containing the substrate thermal conductivity. The diffusivity and conductivity are obtained by comparing the measured phase profile of the temperature field to a continuum based model. A sensitivity analysis is used to identify the optimal film thickness for extracting the both substrate conductivity and diffusivity. Proof of principle studies were conducted on a range of samples having thermal properties that are representatives of current and advanced accident tolerant nuclear fuels. It is shown that by including the Kapitza resistance as an additional fitting parameter, the measured conductivity and diffusivity of all the samples considered agreed closely with the literature values. A distinguishing feature of this technique is that it does not require a priori knowledge of the optical spot size which greatly increases measurement reliability and reproducibility.

  19. Local measurement of thermal conductivity and diffusivity

    SciTech Connect

    Hurley, David H.; Schley, Robert S.; Khafizov, Marat; Wendt, Brycen L.

    2015-12-15

    Simultaneous measurement of local thermal diffusivity and conductivity is demonstrated on a range of ceramic samples. This was accomplished by measuring the temperature field spatial profile of samples excited by an amplitude modulated continuous wave laser beam. A thin gold film is applied to the samples to ensure strong optical absorption and to establish a second boundary condition that introduces an expression containing the substrate thermal conductivity. The diffusivity and conductivity are obtained by comparing the measured phase profile of the temperature field to a continuum based model. A sensitivity analysis is used to identify the optimal film thickness for extracting the both substrate conductivity and diffusivity. Proof of principle studies were conducted on a range of samples having thermal properties that are representatives of current and advanced accident tolerant nuclear fuels. It is shown that by including the Kapitza resistance as an additional fitting parameter, the measured conductivity and diffusivity of all the samples considered agreed closely with the literature values. A distinguishing feature of this technique is that it does not require a priori knowledge of the optical spot size which greatly increases measurement reliability and reproducibility.

  20. Local measurement of thermal conductivity and diffusivity

    DOE PAGESBeta

    Hurley, David H.; Schley, Robert S.; Khafizov, Marat; Wendt, Brycen L.

    2015-12-01

    Simultaneous measurement of local thermal diffusivity and conductivity is demonstrated on a range of ceramic samples. This was accomplished by measuring the temperature field spatial profile of samples excited by an amplitude modulated continuous wave laser beam. A thin gold film is applied to the samples to ensure strong optical absorption and to establish a second boundary condition that introduces an expression containing the substrate thermal conductivity. The diffusivity and conductivity are obtained by comparing the measured phase profile of the temperature field to a continuum based model. A sensitivity analysis is used to identify the optimal film thickness formore » extracting the both substrate conductivity and diffusivity. Proof of principle studies were conducted on a range of samples having thermal properties that are representative of current and advanced accident tolerant nuclear fuels. It is shown that by including the Kapitza resistance as an additional fitting parameter, the measured conductivity and diffusivity of all the samples considered agree closely with literature values. Lastly, a distinguishing feature of this technique is that it does not require a priori knowledge of the optical spot size which greatly increases measurement reliability and reproducibility.« less

  1. Infrared Detector System with Controlled Thermal Conductance

    NASA Technical Reports Server (NTRS)

    Cunningham, Thomas J. (Inventor)

    2000-01-01

    A thermal infrared detector system includes a heat sink, a support member, a connection support member connecting the support member to the heat sink and including a heater unit is reviewed. An infrared detector element is mounted on the support member and a temperature signal representative of the infrared energy contacting the support member can then be derived by comparing the temperature of the support member and the heat sink. The temperature signal from a support member and a temperature signal from the connection support member can then be used to drive a heater unit mounted on the connection support member to thereby control the thermal conductance of the support member. Thus, the thermal conductance can be controlled so that it can be actively increased or decreased as desired.

  2. Thermal Conductivity of Al-Salt Composites

    NASA Astrophysics Data System (ADS)

    Li, Peng; Zhang, Mei; Wang, Lijun; Seetharaman, Seshadri

    2015-11-01

    With a view to examine the possibility of estimating the content of entrapped metallic aluminium in the salt cake from aluminium remelting, the thermal diffusivity of reference composites of KCl-NaCl-Al was measured as a function of aluminium metal content at room temperature. The thermal conductivity of the reference composites was found to increase with the metallic Al content. The lumped parameter model approach was carried out to discuss the influence of different geometry arrangements of each phase, viz. air, salts and metallic aluminium on the thermal conductivity. Application of the present results to industrial samples indicates that factors such as the interfacial condition of metallic Al particles have to be considered in order to estimate the amount of entrapped Al in the salt cake.

  3. Thermal and electrical contact conductance studies

    NASA Technical Reports Server (NTRS)

    Vansciver, S. W.; Nilles, M.

    1985-01-01

    Prediction of electrical and thermal contact resistance for pressed, nominally flat contacts is complicated by the large number of variables which influence contact formation. This is reflected in experimental results as a wide variation in contact resistances, spanning up to six orders of magnitude. A series of experiments were performed to observe the effects of oxidation and surface roughness on contact resistance. Electrical contact resistance and thermal contact conductance from 4 to 290 K on OFHC Cu contacts are reported. Electrical contact resistance was measured with a 4-wire DC technique. Thermal contact conductance was determined by steady-state longitudinal heat flow. Corrections for the bulk contribution ot the overall measured resistance were made, with the remaining resistance due solely to the presence of the contact.

  4. Thermal Conductivity of Polyimide/Nanofiller Blends

    NASA Technical Reports Server (NTRS)

    Ghose, S.; Watson, K. A.; Delozier, D. M.; Working, D. c.; Connell, J. W.; Smith, J. G.; Sun, Y. P.; Lin, Y.

    2006-01-01

    In efforts to improve the thermal conductivity of Ultem(TM) 1000, it was compounded with three carbon based nano-fillers. Multiwalled carbon nanotubes (MWCNT), vapor grown carbon nanofibers (CNF) and expanded graphite (EG) were investigated. Ribbons were extruded to form samples in which the nano-fillers were aligned. Samples were also fabricated by compression molding in which the nano-fillers were randomly oriented. The thermal properties were evaluated by DSC and TGA, and the mechanical properties of the aligned samples were determined by tensile testing. The degree of dispersion and alignment of the nanoparticles were investigated with high-resolution scanning electron microscopy. The thermal conductivity of the samples was measured in both the direction of alignment as well as perpendicular to that direction using the Nanoflash technique. The results of this study will be presented.

  5. Thermal conductivity of BN-C nanostructures

    NASA Astrophysics Data System (ADS)

    Kınacı, Alper; Haskins, Justin B.; Sevik, Cem; Çaǧın, Tahir

    2012-09-01

    Chemical and structural diversity present in hexagonal boron nitride (h-BN) and graphene hybrid nanostructures provide avenues for tuning various properties for their technological applications. In this paper we investigate the variation of thermal conductivity (κ) of hybrid graphene/h-BN nanostructures: stripe superlattices and BN (graphene) dots embedded in graphene (BN) are investigated using equilibrium molecular dynamics. To simulate these systems, we have parametrized a Tersoff type interaction potential to reproduce the ab initio energetics of the B-C and N-C bonds for studying the various interfaces that emerge in these hybrid nanostructures. We demonstrate that both the details of the interface, including energetic stability and shape, as well as the spacing of the interfaces in the material, exert strong control on the thermal conductivity of these systems. For stripe superlattices, we find that zigzag configured interfaces produce a higher κ in the direction parallel to the interface than the armchair configuration, while the perpendicular conductivity is less prone to the details of the interface and is limited by the κ of h-BN. Additionally, the embedded dot structures, having mixed zigzag and armchair interfaces, affect the thermal transport properties more strongly than superlattices. The largest reduction in thermal conductivity is observed at 50% dot concentration, but the dot radius appears to have little effect on the magnitude of reduction around this concentration.

  6. Reducing Thermal Conduction In Acoustic Levitators

    NASA Technical Reports Server (NTRS)

    Lierke, Ernst G.; Leung, Emily W.; Bhat, Balakrishna T.

    1991-01-01

    Acoustic transducers containing piezoelectric driving elements made more resistant to heat by reduction of effective thermal-conductance cross sections of metal vibration-transmitting rods in them, according to proposal. Used to levitate small objects acoustically for noncontact processing in furnaces. Reductions in cross sections increase amplitudes of transmitted vibrations and reduce loss of heat from furnaces.

  7. Indium Foil Serves As Thermally Conductive Gasket

    NASA Technical Reports Server (NTRS)

    Eastman, G. Yale; Dussinger, Peter M.

    1993-01-01

    Indium foil found useful as gasket to increase thermal conductance between bodies clamped together. Deforms to fill imperfections on mating surfaces. Used where maximum temperature in joint less than melting temperature of indium. Because of low melting temperature of indium, most useful in cryogenic applications.

  8. Tunable Interfacial Thermal Conductance by Molecular Dynamics

    NASA Astrophysics Data System (ADS)

    Shen, Meng

    We study the mechanism of tunable heat transfer through interfaces between solids using a combination of non-equilibrium molecular dynamics simulation (NEMD), vibrational mode analysis and wave packet simulation. We investigate how heat transfer through interfaces is affected by factors including pressure, interfacial modulus, contact area and interfacial layer thickness, with an overreaching goal of developing fundamental knowledge that will allow one to tailor thermal properties of interfacial materials. The role of pressure and interfacial stiffness is unraveled by our studies on an epitaxial interface between two Lennard-Jones (LJ) crystals. The interfacial stiffness is varied by two different methods: (i) indirectly by applying pressure which due to anharmonic nature of bonding, increases interfacial stiffness, and (ii) directly by changing the interfacial bonding strength by varying the depth of the potential well of the LJ potential. When the interfacial bonding strength is low, quantitatively similar behavior to pressure tuning is observed when the interfacial thermal conductance is increased by directly varying the potential-well depth parameter of the LJ potential. By contrast, when the interfacial bonding strength is high, thermal conductance is almost pressure independent, and even slightly decreases with increasing pressure. This decrease can be explained by the change in overlap between the vibrational densities of states of the two crystalline materials. The role of contact area is studied by modeling structures comprised of Van der Waals junctions between single-walled nanotubes (SWCNT). Interfacial thermal conductance between SWCNTs is obtained from NEMD simulation as a function of crossing angle. In this case the junction conductance per unit area is essentially a constant. By contrast, interfacial thermal conductance between multiwalled carbon nanotubes (MWCNTs) is shown to increase with diameter of the nanotubes by recent experimental studies [1

  9. Tunable Interfacial Thermal Conductance by Molecular Dynamics

    NASA Astrophysics Data System (ADS)

    Shen, Meng

    We study the mechanism of tunable heat transfer through interfaces between solids using a combination of non-equilibrium molecular dynamics simulation (NEMD), vibrational mode analysis and wave packet simulation. We investigate how heat transfer through interfaces is affected by factors including pressure, interfacial modulus, contact area and interfacial layer thickness, with an overreaching goal of developing fundamental knowledge that will allow one to tailor thermal properties of interfacial materials. The role of pressure and interfacial stiffness is unraveled by our studies on an epitaxial interface between two Lennard-Jones (LJ) crystals. The interfacial stiffness is varied by two different methods: (i) indirectly by applying pressure which due to anharmonic nature of bonding, increases interfacial stiffness, and (ii) directly by changing the interfacial bonding strength by varying the depth of the potential well of the LJ potential. When the interfacial bonding strength is low, quantitatively similar behavior to pressure tuning is observed when the interfacial thermal conductance is increased by directly varying the potential-well depth parameter of the LJ potential. By contrast, when the interfacial bonding strength is high, thermal conductance is almost pressure independent, and even slightly decreases with increasing pressure. This decrease can be explained by the change in overlap between the vibrational densities of states of the two crystalline materials. The role of contact area is studied by modeling structures comprised of Van der Waals junctions between single-walled nanotubes (SWCNT). Interfacial thermal conductance between SWCNTs is obtained from NEMD simulation as a function of crossing angle. In this case the junction conductance per unit area is essentially a constant. By contrast, interfacial thermal conductance between multiwalled carbon nanotubes (MWCNTs) is shown to increase with diameter of the nanotubes by recent experimental studies [1

  10. THERMAL CONDUCTIVITY OF SIC AND C FIBERS

    SciTech Connect

    Youngblood, Gerald E.; Senor, David J.; Kowbel, W.; Webb, J.; Kohyama, Akira

    2000-09-01

    Several rod-shaped specimens with uniaxially packed fibers (Hi-Nicalon, Hi-Nicalon Type S, Tyranno SA and Amoco K1100 types) and a pre-ceramic polymer matrix have been fabricated. By using appropriate analytic models, the bare fiber thermal conductivity (Kf) and the interface thermal conductance (h) will be determined as a function of temperature up to 1000?C before and after irradiation for samples cut from these rods. Initial results are: (1) for unirradiated Hi-Nicalon SiC fiber, Kf varied from 4.3 up to 5.9 W/mK for the 27-1000?C range, (2) for unirradiated K1100 graphite fiber, Kf varied from 576 down to 242 W/mK for the 27-1000?C range, and (3) h = 43 W/cm2K at 27?C as a typical fiber/matrix interface conductance.

  11. Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention

    NASA Astrophysics Data System (ADS)

    Chen, Wenjun; Deng, Dunying; Cheng, Yuanrong; Xiao, Fei

    2015-07-01

    The easy oxidation of copper is one critical obstacle to high-performance copper-filled isotropically conductive adhesives (ICAs). In this paper, a facile method to prepare highly reliable, highly conductive, and low-cost ICAs is reported. The copper fillers were treated by organic acids for oxidation prevention. Compared with ICA filled with untreated copper flakes, the ICA filled with copper flakes treated by different organic acids exhibited much lower bulk resistivity. The lowest bulk resistivity achieved was 4.5 × 10-5 Ω cm, which is comparable to that of commercially available Ag-filled ICA. After 500 h of 85°C/85% relative humidity (RH) aging, the treated ICAs showed quite stable bulk resistivity and relatively stable contact resistance. Through analyzing the results of x-ray diffraction, x-ray photoelectron spectroscopy, and thermogravimetric analysis, we found that, with the assistance of organic acids, the treated copper flakes exhibited resistance to oxidation, thus guaranteeing good performance.

  12. Thermal Conductivity Measurements on consolidated Soil Analogs

    NASA Astrophysics Data System (ADS)

    Seiferlin, K.; Heimberg, M.; Thomas, N.

    2007-08-01

    Heat transport in porous media such as soils and regolith is significantly reduced compared to the properties of compact samples of the same material. The bottle neck for solid state heat transport is the contact area between adjacent grains. For "dry" and unconsolidated materials the contact areas and thus the thermal conductivity are extremely small. Sintering and cementation are two processes that can increase the cross section of interstitial bonds signifcantly. On Mars, cementation can be caused by condensation of water or carbon dioxide ice from the vapor phase, or from salts and minerals that fall out from aqueous solutions. We produced several artificially cemented samples, using small glass beads of uniform size as soil analog. The cementation is achieved by initially molten wax that is mixed with the glass beads while liqiud. The wax freezes preferably at the contact points between grains, thus minimizing surface energy, and consolidates the samples. The thermal conductivity of these samples is then measured in vacuum. We present the results of these measurements and compare them with theoretical models. The observed range of thermal conductivity values can explain some, but not all of the variations in thermal intertia that can be seen in TES remote sensing data.

  13. The Apparent Thermal Conductivity of Pozzolana Concrete

    NASA Astrophysics Data System (ADS)

    Bessenouci, M. Z.; Triki, N. E. Bibi; Khelladi, S.; Draoui, B.; Abene, A.

    The recent development of some lightweight construction materials, such as light concrete, can play an important role as an insulator, while maintaining sufficient levels of mechanical performance. The quality of insulation to provide depends on the climate, the exposure of the walls and also the materials used in the construction. The choice of a material to be used as an insulator, obviously, depends on its availability and its cost. This is a study of natural pozzolanas as basic components in building materials. It is intended to highlight their thermal advantage. It is economically advantageous to use pozzolana in substitution for a portion of the clinker as hydraulically active additions, as well as in compositions of lightweight concretes in the form of pozzolanic aggregate mixtures, which provide mechanical strengths that comply with current standards. A theoretical study is conducted on the apparent thermal conductivity of building materials, namely concrete containing pozzolana. Thermal modeling, apparent to that commonly used for porous materials, has been applied to pozzolana concrete. Experimental results on measurements of the apparent thermal conductivity of pozzolana concrete are reported in this study, using an approach that considers that concrete is composed of two solid ingredients, a binding matrix (hydrated cement paste) and all aggregates. A second comparative theoretical approach is used for the case where concrete consists of a solid phase and a fluid phase (air).

  14. Universal thermal and electrical conductivity from holography

    NASA Astrophysics Data System (ADS)

    Jain, Sachin

    2010-11-01

    It is known from earlier work of Iqbal, Liu [1] that the boundary transport coefficients such as electrical conductivity (at vanishing chemical potential), shear viscosity etc. at low frequency and finite temperature can be expressed in terms of geometrical quantities evaluated at the horizon. In the case of electrical conductivity, at zero chemical potential gauge field fluctuation and metric fluctuation decouples, resulting in a trivial flow from horizon to boundary. In the presence of chemical potential, the story becomes complicated due to the fact that gauge field and metric fluctuation can no longer be decoupled. This results in a nontrivial flow from horizon to boundary. Though horizon conductivity can be expressed in terms of geometrical quantities evaluated at the horizon, there exist no such neat result for electrical conductivity at the boundary. In this paper we propose an expression for boundary conductivity expressed in terms of geometrical quantities evaluated at the horizon and thermodynamic quantities. We also consider the theory at finite cutoff recently constructed in [2], at radius r c outside the horizon and give an expression for cutoff dependent electrical conductivity ( σ( r c )), which interpolates smoothly between horizon conductivity σ H ( r c → r h ) and boundary conductivity σ B ( r c → ∞). Using the results about the conductivity we gain much insight into the universality of thermal conductivity to viscosity ratio proposed in [3].

  15. Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications

    NASA Astrophysics Data System (ADS)

    Ho, Li-Ngee; Nishikawa, Hiroshi

    2012-09-01

    In this study, a simple one-step microwave-assisted method was developed to synthesize Cu and Cu-Ag particles for application in electrically conductive adhesive (ECA). The particle size of the obtained Cu particles was about 1 μm to 3 μm, whereas Cu-Ag particles were in the range of 0.1 μm to 1.0 μm. ECA samples were cured at 175°C for 1 h. Results revealed that the as-cured ECAs showed significant differences in electrical resistivity. The resistivity of Cu-filled ECA was on the order of 10-5 Ω cm, which was lower than the Cu-Ag-filled ECAs with resistivity on the order of 10-3 Ω cm. The thermal stability of the ECAs was studied under high-temperature exposure at 125°C for 1000 h. Results showed that Cu-filled ECA was thermally stable for 1000 h of aging, whereas Cu-Ag-filled ECAs were thermally stable for aging time above 100 h.

  16. Inhomogeneous thermal conductivity enhances thermoelectric cooling

    NASA Astrophysics Data System (ADS)

    Lu, Tingyu; Zhou, Jun; Li, Nianbei; Yang, Ronggui; Li, Baowen

    2014-12-01

    We theoretically investigate the enhancement of thermoelectric cooling performance in thermoelectric refrigerators made of materials with inhomogeneous thermal conductivity, beyond the usual practice of enhancing thermoelectric figure of merit (ZT) of materials. The dissipation of the Joule heat in such thermoelectric refrigerators is asymmetric which can give rise to better thermoelectric cooling performance. Although the thermoelectric figure of merit and the coefficient-of-performance are slightly enhanced, both the maximum cooling power and the maximum cooling temperature difference can be enhanced significantly. This finding can be used to increase the heat absorption at the cold end. We further find that the asymmetric dissipation of Joule heat leads to thermal rectification.

  17. Thermal conductivity of lower-mantle minerals

    NASA Astrophysics Data System (ADS)

    Goncharov, Alexander F.; Beck, Pierre; Struzhkin, Viktor V.; Haugen, Benjamin D.; Jacobsen, Steven D.

    2009-05-01

    Geodynamic models of heat transport and the thermal evolution of Earth's interior require knowledge of thermal conductivity for high-pressure phases at relevant temperatures and pressures. Here we present new data on radiative and lattice heat transfer in mantle materials determined from optical spectroscopy and time-resolved optical radiometry. The pressure dependence of optical absorption in ferropericlase (Mg,Fe)O, and silicate perovskite (Mg,Fe)SiO 3, has been determined in the IR through UV regions up to 133 GPa. Whereas (Mg,Fe)O exhibits a strong pressure dependence of absorption and spectral changes associated with the high-spin (HS) to low-spin (LS) transition of Fe 2+ [Goncharov, A.F., Struzhkin, V.V., Jacobsen, S.D. 2006. Reduced radiative conductivity of low-spin (Mg,Fe)O in the lower mantle. Science 312, 1205-1208], the pressure dependence of optical absorption in (Mg,Fe)SiO 3 is relatively weak. We observe a moderate increase in absorption with pressure for (Mg,Fe)SiO 3 in the visible and infrared spectral range due to a red-shift of absorption in ultraviolet, however the crystal-field transitions of Fe 2+ become weaker with pressure and disappear above 50 GPa as a result of the HS-LS transition in (Mg,Fe)SiO 3. Intervalence charge-transfer transitions in silicate perovskite shift to higher energies with pressure. The temperature dependence of the optical absorption of (Mg,Fe)O measured up to 65 GPa and 800 K is moderate below 30 GPa and weak above 30 GPa. Thus, the temperature correction of the radiative conductivity is insignificant. The estimated total pressure-dependent radiative conductivity (in approximation of a large grain size) is lower than expected from the pressure extrapolation of the ambient and low-pressure data [Hofmeister, A.M., 1999. Mantle values of thermal conductivity and the geotherm from phonon lifetimes. Science 283, 1699-1706; Hofmeister, A.M., 2005. Dependence of diffusive radiative transfer on grain-size, temperature, and Fe

  18. Thermal effects in microfluidics with thermal conductivity spatially modulated

    NASA Astrophysics Data System (ADS)

    Vargas Toro, Agustín.

    2014-05-01

    A heat transfer model on a microfluidic is resolved analytically. The model describes a fluid at rest between two parallel plates where each plate is maintained at a differentially specified temperature and the thermal conductivity of the microfluidic is spatially modulated. The heat transfer model in such micro-hydrostatic configuration is analytically resolved using the technique of the Laplace transform applying the Bromwich Integral and the Residue theorem. The temperature outline in the microfluidic is presented as an infinite series of Bessel functions. It is shown that the result for the thermal conductivity spatially modulated has as a particular case the solution when the thermal conductivity is spatially constant. All computations were performed using the computer algebra software Maple. It is claimed that the analytical obtained results are important for the design of nanoscale devices with applications in biotechnology. Furthermore, it is suggested some future research lines such as the study of the heat transfer model in a microfluidic resting between coaxial cylinders with radially modulated thermal conductivity in order to achieve future developments in this area.

  19. Thermal Characterization of Epoxy Adhesive by Hotfire Testing

    NASA Technical Reports Server (NTRS)

    Spomer, Ken A.; Haddock, M. Reed; McCool, Alex (Technical Monitor)

    2001-01-01

    This paper describes subscale solid-rocket motor hot-fire testing of epoxy adhesives in flame surface bondlines to evaluate heat-affected depth, char depth and ablation rate. Hot-fire testing is part of an adhesive down-selection program on the Space Shuttle Solid Rocket Motor Nozzle to provide additional confidence in the down-selected adhesives. The current nozzle structural adhesive bond system is being replaced due to obsolescence. Prior to hot-fire testing, adhesives were tested for chemical, physical and mechanical properties, which resulted in the selection of two potential replacement adhesives, Resin Technology Group's TIGA 321 and 3M's EC2615XLW. Hot-fire testing consisted of four forty-pound charge (FPC) motors fabricated in configurations that would allow side-by-side comparison testing of the candidate replacement adhesives with the current RSRM adhesives. Results of the FPC motor testing show that: 1) the phenolic char depths on radial bondlines is approximately the same and vary depending on the position in the blast tube regardless of which adhesive was used, 2) the replacement candidate adhesive char depths are equivalent to the char depths of the current adhesives, 3) the heat-affected depths of the candidate and current adhesives are equivalent, and 4) the ablation rates for both replacement adhesives were equivalent to the current adhesives.

  20. Thermal Boundary Conductance: A Materials Science Perspective

    NASA Astrophysics Data System (ADS)

    Monachon, Christian; Weber, Ludger; Dames, Chris

    2016-07-01

    The thermal boundary conductance (TBC) of materials pairs in atomically intimate contact is reviewed as a practical guide for materials scientists. First, analytical and computational models of TBC are reviewed. Five measurement methods are then compared in terms of their sensitivity to TBC: the 3ω method, frequency- and time-domain thermoreflectance, the cut-bar method, and a composite effective thermal conductivity method. The heart of the review surveys 30 years of TBC measurements around room temperature, highlighting the materials science factors experimentally proven to influence TBC. These factors include the bulk dispersion relations, acoustic contrast, and interfacial chemistry and bonding. The measured TBCs are compared across a wide range of materials systems by using the maximum transmission limit, which with an attenuated transmission coefficient proves to be a good guideline for most clean, strongly bonded interfaces. Finally, opportunities for future research are discussed.

  1. Senftleben-Beenakker thermal conductivity effect apparatus.

    PubMed

    Vevai, J E; Elliot, D G; Honeywell, W I

    1978-08-01

    An apparatus for measuring the influence of magnetic fields on the thermal conductivity of gases, the Senftleben-Beenakker effect, is described. Conventional ''cold finger type'' cooling with appropriate cryogenic fluids is utilized with a helium exchange gas chamber to establish the general temperature level of the cell holder. Automatic temperature control of the trim heater maintains the desired temperature to +/-10(-3) degrees C in the 77-300 K range. A concentric cylinder cell adaptable for use with either conventional electromagnet or superconducting solenoid is described. The use of thin Mylar polyester film end seals minimizes cell ''end effect'' corrections and provides a resolution of 5x10(-6) in gas thermal conductivity. PMID:18699265

  2. The contact area dependent interfacial thermal conductance

    SciTech Connect

    Liu, Chenhan; Wei, Zhiyong; Bi, Kedong; Yang, Juekuan; Chen, Yunfei; Wang, Jian

    2015-12-15

    The effects of the contact area on the interfacial thermal conductance σ are investigated using the atomic Green’s function method. Different from the prediction of the heat diffusion transport model, we obtain an interesting result that the interfacial thermal conductance per unit area Λ is positively dependent on the contact area as the area varies from a few atoms to several square nanometers. Through calculating the phonon transmission function, it is uncovered that the phonon transmission per unit area increases with the increased contact area. This is attributed to that each atom has more neighboring atoms in the counterpart of the interface with the increased contact area, which provides more channels for phonon transport.

  3. Ultralow Thermal Conductivity in Full Heusler Semiconductors.

    PubMed

    He, Jiangang; Amsler, Maximilian; Xia, Yi; Naghavi, S Shahab; Hegde, Vinay I; Hao, Shiqiang; Goedecker, Stefan; Ozoliņš, Vidvuds; Wolverton, Chris

    2016-07-22

    Semiconducting half and, to a lesser extent, full Heusler compounds are promising thermoelectric materials due to their compelling electronic properties with large power factors. However, intrinsically high thermal conductivity resulting in a limited thermoelectric efficiency has so far impeded their widespread use in practical applications. Here, we report the computational discovery of a class of hitherto unknown stable semiconducting full Heusler compounds with ten valence electrons (X_{2}YZ, X=Ca, Sr, and Ba; Y=Au and Hg; Z=Sn, Pb, As, Sb, and Bi) through high-throughput ab initio screening. These new compounds exhibit ultralow lattice thermal conductivity κ_{L} close to the theoretical minimum due to strong anharmonic rattling of the heavy noble metals, while preserving high power factors, thus resulting in excellent phonon-glass electron-crystal materials. PMID:27494488

  4. Ultralow Thermal Conductivity in Full Heusler Semiconductors

    NASA Astrophysics Data System (ADS)

    He, Jiangang; Amsler, Maximilian; Xia, Yi; Naghavi, S. Shahab; Hegde, Vinay I.; Hao, Shiqiang; Goedecker, Stefan; OzoliĆš, Vidvuds; Wolverton, Chris

    2016-07-01

    Semiconducting half and, to a lesser extent, full Heusler compounds are promising thermoelectric materials due to their compelling electronic properties with large power factors. However, intrinsically high thermal conductivity resulting in a limited thermoelectric efficiency has so far impeded their widespread use in practical applications. Here, we report the computational discovery of a class of hitherto unknown stable semiconducting full Heusler compounds with ten valence electrons (X2Y Z , X =Ca , Sr, and Ba; Y =Au and Hg; Z =Sn , Pb, As, Sb, and Bi) through high-throughput ab initio screening. These new compounds exhibit ultralow lattice thermal conductivity κL close to the theoretical minimum due to strong anharmonic rattling of the heavy noble metals, while preserving high power factors, thus resulting in excellent phonon-glass electron-crystal materials.

  5. A low temperature thermal conductivity database

    NASA Astrophysics Data System (ADS)

    Woodcraft, Adam L.; Gray, Adam

    2009-12-01

    Low temperature detectors necessarily require low temperature instruments. Constructing good low temperature instruments requires information on the properties of materials used in their construction, in particular the thermal conductivity. Unfortunately, this is poorly known for many materials. Collections of data in text books tend to be incomplete and in the worst cases are misleading. For most materials, what information is known is scattered through the literature. Searching out this data is time consuming, and in any case often results in conflicting information. We have started a programme to locate, consolidate and critically analyse thermal conductivity measurements from the literature, particularly for the challenging temperature range below 1 K. This has already produced useful results. We present some preliminary results here.

  6. Multiscale Modeling of UHTC: Thermal Conductivity

    NASA Technical Reports Server (NTRS)

    Lawson, John W.; Murry, Daw; Squire, Thomas; Bauschlicher, Charles W.

    2012-01-01

    We are developing a multiscale framework in computational modeling for the ultra high temperature ceramics (UHTC) ZrB2 and HfB2. These materials are characterized by high melting point, good strength, and reasonable oxidation resistance. They are candidate materials for a number of applications in extreme environments including sharp leading edges of hypersonic aircraft. In particular, we used a combination of ab initio methods, atomistic simulations and continuum computations to obtain insights into fundamental properties of these materials. Ab initio methods were used to compute basic structural, mechanical and thermal properties. From these results, a database was constructed to fit a Tersoff style interatomic potential suitable for atomistic simulations. These potentials were used to evaluate the lattice thermal conductivity of single crystals and the thermal resistance of simple grain boundaries. Finite element method (FEM) computations using atomistic results as inputs were performed with meshes constructed on SEM images thereby modeling the realistic microstructure. These continuum computations showed the reduction in thermal conductivity due to the grain boundary network.

  7. Thermally activated conductivity in gapped bilayer graphene

    NASA Astrophysics Data System (ADS)

    Trushin, Maxim

    2012-05-01

    This is a theoretical study of electron transport in gated bilayer graphene —a novel semiconducting material with a tunable band gap. It is shown that the which-layer pseudospin coherence enhances the subgap conductivity and facilitates the thermally activated transport. The mechanism proposed can also lead to the non-monotonic conductivity vs. temperature dependence at a band gap size of the order of 10 meV. The effect can be observed in gapped bilayer graphene sandwiched in boron nitride where the electron-hole puddles and flexural phonons are strongly suppressed.

  8. Design principles of interfacial thermal conductance

    NASA Astrophysics Data System (ADS)

    Polanco, Carlos; Rastgarkafshgarkolaei, Rouzbeh; Zhang, Jingjie; Le, Nam; Norris, Pamela; Ghosh, Avik

    We explore fundamental principles to design the thermal conductance across solid interfaces by changing the composition and disorder of an intermediate matching layer. In absence of phonon-phonon interactions, the layer addition involves two competing effects that influence the conductance. The layer can act as an impedance matching 'bridge' to increase the mode-averaged phonon transmission. However, it also reduces the relevant modes that conserve their momenta transverse to the interface, so that the net result depends on features such as the overlap of conserving modes and the dispersivity of the transverse subbands. Moving into the interacting anharmonic regime, we find that the added layer aids conductance when the decreased resistances at the contact-layer boundaries compensate for the layer resistance. In fact, we show that the maximum conductance corresponds to an exact matching of the two separate contact-layer resistances. For instance, if we vary just the atomic mass across layers, then maximum conductance happens when the intervening layer mass is the geometric mean of the contact masses. We conjecture that the best interfacial layer is one that is compositionally graded into many geometric means - in other words, an exponential variation in thermal impedance.

  9. THERMAL CONDUCTIVITY OF THE POTENTIAL REPOSITORY HORIZON

    SciTech Connect

    J.E. BEAN

    2004-09-27

    The primary purpose of this report is to assess the spatial variability and uncertainty of bulk thermal conductivity in the host horizon for the repository at Yucca Mountain. More specifically, the lithostratigraphic units studied are located within the Topopah Spring Tuff (Tpt) and consist of the upper lithophysal zone (Tptpul), the middle nonlithophysal zone (Tptpmn), the lower lithophysal zone (Tptpll), and the lower nonlithophysal zone (Tptpln). Design plans indicate that approximately 81 percent of the repository will be excavated in the Tptpll, approximately 12 percent in the Tptpmn, and the remainder in the Tptul and Tptpln (BSC 2004 [DIRS 168370]). This report provides three-dimensional geostatistical estimates of the bulk thermal conductivity for the four stratigraphic layers of the repository horizon. The three-dimensional geostatistical estimates of matrix and lithophysal porosity, dry bulk density, and matrix thermal conductivity are also provided. This report provides input to various models and calculations that simulate heat transport through the rock mass. These models include the ''Drift Degradation Analysis, Multiscale Thermohydrologic Model, Ventilation Model and Analysis Report, Igneous Intrusion Impacts on Waste Packages and Waste Forms, Drift-Scale Coupled Processes (DST and TH Seepage) Models'', and ''Drift Scale THM Model''. These models directly or indirectly provide input to the total system performance assessment (TSPA). The main distinguishing characteristic among the lithophysal and nonlithophysal units is the percentage of large-scale (centimeters-meters) voids within the rock. The Tptpul and Tptpll, as their names suggest, have a higher percentage of lithophysae than the Tptpmn and the Tptpln. Understanding the influence of the lithophysae is of great importance to understanding bulk thermal conductivity.

  10. Mechanisms for thermal conduction in hydrogen hydrate

    NASA Astrophysics Data System (ADS)

    English, Niall J.; Gorman, Paul D.; MacElroy, J. M. D.

    2012-01-01

    Extensive equilibrium molecular dynamics simulations have been performed to investigate thermal conduction mechanisms via the Green-Kubo approach for (type II) hydrogen hydrate, at 0.05 kbar and between 30 and 250 K, for both lightly filled H2 hydrates (1s4l) and for more densely filled H2 systems (2s4l), in which four H2 molecules are present in the large cavities, with respective single- and double-occupation of the small cages. The TIP4P water model was used in conjunction with a fully atomistic hydrogen potential along with long-range Ewald electrostatics. It was found that substantially less damping in guest-host energy transfer is present in hydrogen hydrate as is observed in common type I clathrates (e.g., methane hydrate), but more akin in to previous results for type II and H methane hydrate polymorphs. This gives rise to larger thermal conductivities relative to common type I hydrates, and also larger than type II and H methane hydrate polymorphs, and a more crystal-like temperature dependence of the thermal conductivity.

  11. Evaluation of New Thermally Conductive Geopolymer in Thermal Energy Storage

    NASA Astrophysics Data System (ADS)

    Černý, Matěj; Uhlík, Jan; Nosek, Jaroslav; Lachman, Vladimír; Hladký, Radim; Franěk, Jan; Brož, Milan

    This paper describes an evaluation of a newly developed thermally conductive geopolymer (TCG), consisting of a mixture of sodium silicate and carbon micro-particles. The TCG is intended to be used as a component of high temperature energy storage (HTTES) to improve its thermal diffusivity. Energy storage is crucial for both ecological and economical sustainability. HTTES plays a vital role in solar energy technologies and in waste heat recovery. The most advanced HTTES technologies are based on phase change materials or molten salts, but suffer with economic and technological limitations. Rock or concrete HTTES are cheaper, but they have low thermal conductivity without incorporation of TCG. It was observed that TCG is stable up to 400 °C. The thermal conductivity was measured in range of 20-23 W m-1 K-1. The effect of TCG was tested by heating a granite block with an artificial fissure. One half of the fissure was filled with TCG and the other with ballotini. 28 thermometers, 5 dilatometers and strain sensors were installed on the block. The heat transport experiment was evaluated with COMSOL Multiphysics software.

  12. Analytical estimation of skeleton thermal conductivity of a geopolymer foam from thermal conductivity measurements

    NASA Astrophysics Data System (ADS)

    Henon, J.; Alzina, A.; Absi, J.; Smith, D. S.; Rossignol, S.

    2015-07-01

    The geopolymers are alumino-silicate binders. The addition of a high pores volume fraction, gives them a thermal insulation character desired in the building industry. In this work, potassium geopolymer foams were prepared at room temperature (< 70 ∘C) by a process of in situ gas release. The porosity distribution shows a multiscale character. However, the thermal conductivity measurements gave values from 0.35 to 0.12 Wm-1.K-1 for a pore volume fraction values between 65 and 85%. In the aim to predict the thermal properties of these foams and focus on the relationship "thermal-conductivity/microstructure", knowledge of the thermal conductivity of their solid skeleton (λ s ) is paramount. However, there is rare work on the determination of this value depending on the initial composition. By the formulation used, the foaming agent contributes to the final network, and it is not possible to obtain a dense material designate to make a direct measurement of λ s . The objective of this work is to use inverse analytical methods to identify the value of λ s . Measurements of thermal conductivity by the fluxmetre technique were performed. The obtained value of the solid skeleton thermal conductivity by the inverse numerical technique is situated in a framework between 0.95 and 1.35 Wm-1.K-1 and is in agreement with one issue from the literature.

  13. Thermal radiation properties and thermal conductivity of lunar material.

    PubMed

    Birkebak, R C; Cremers, C J; Dawson, J P

    1970-01-30

    The thermal radiation properties were measured for lunar fines and chips from three different lunar rocks. Measurements for the fines were made at atmospheric pressure and at a pressure of 10(-5) torr or lower. The directional reflectance was obtained over a wavelength range of 0.5 to 2.0 microns for angles of incidence up to 60 degrees. The bidirectional reflectance-the distribution of reflected light-was measured for white light angles of illumination up to 60 degrees. The thermal conductivity was measured over a temperature range 200 to 400 degrees K under vacuum conditions. PMID:17781563

  14. Thermal Expansion and Thermal Conductivity of Rare Earth Silicates

    NASA Technical Reports Server (NTRS)

    Zhu, Dongming; Lee, Kang N.; Bansal, Narottam P.

    2006-01-01

    Rare earth silicates are considered promising candidate materials for environmental barrier coatings applications at elevated temperature for ceramic matrix composites. High temperature thermophysical properties are of great importance for coating system design and development. In this study, the thermal expansion and thermal conductivity of hot-pressed rare earth silicate materials were characterized at temperatures up to 1400 C. The effects of specimen porosity, composition and microstructure on the properties were also investigated. The materials processing and testing issues affecting the measurements will also be discussed.

  15. Adhesion

    MedlinePlus

    ... adhesions Ovarian cyst References Munireddy S, Kavalukas SL, Barbul A. Intra-abdominal healing: gastrointestinal tract and adhesions. Surg Clin N Am Kulaylat MN, Dayton, MT. Surgical complications. In: Townsend CM Jr, Beauchamp RD, Evers BM, Mattox KL, ...

  16. Thermal contact conductance of adhered microcantilevers

    NASA Astrophysics Data System (ADS)

    Huxtable, Scott T.; Cahill, David G.; Phinney, Leslie M.

    2004-02-01

    The thermal contact conductance G for polycrystalline silicon cantilever beams that are adhered to an underlying substrate is examined using two different optical techniques. Using time-domain thermoreflectance, we measure G=9±2 MW m-2 K-1 at 25 °C and G=4±1 MW m-2 K-1 at 150 °C. The room temperature value is confirmed using a modified Ångström method, which establishes a lower limit of G>5 MW m-2 K-1. This contact conductance is a factor of 10-105 greater than values reported for metal-metal and ceramic-ceramic interfaces. The large interfacial conductance is consistent with the presence of a thin layer of water trapped between the cantilever and the substrate. The thermal conductivity Λ of the phosphorus doped polysilicon cantilever is nearly isotropic with Λcrossplane=65 W m-1 K-1, and Λin plane=70 W m-1 K-1 at room temperature.

  17. Thermal conductivities of thin, sputtered optical films

    SciTech Connect

    Henager, C.H. Jr.; Pawlewicz, W.T.

    1991-05-01

    The normal component of the thin film thermal conductivity has been measured for the first time for several advanced sputtered optical materials. Included are data for single layers of boron nitride (BN), aluminum nitride (AIN), silicon aluminum nitride (Si-Al-N), silicon aluminum oxynitride (Si-Al-O-N), silicon carbide (SiC), and for dielectric-enhanced metal reflectors of the form Al(SiO{sub 2}/Si{sub 3}N{sub 4}){sup n} and Al(Al{sub 2}O{sub 3}/AIN){sup n}. Sputtered films of more conventional materials like SiO{sub 2}, Al{sub 2}O{sub 3}, Ta{sub 2}O{sub 5}, Ti, and Si have also been measured. The data show that thin film thermal conductivities are typically 10 to 100 times lower than conductivities for the same materials in bulk form. Structural disorder in the amorphous or very fine-grained films appears to account for most of the conductivity difference. Conclusive evidence for a film/substrate interface contribution is presented.

  18. Effective thermal conductivity of a thin composite material

    SciTech Connect

    Phelan, P.E.; Niemann, R.C.

    1996-12-31

    The thermal conductivity of a randomly oriented composite material is modeled using a probabilistic approach in order to determine if a size effect exists for the thermal conductivity at small composite thickness. The numerical scheme employs a random number generator to position the filler elements, which have a relatively high thermal conductivity, within a matrix having a relatively low thermal conductivity. Results indicate that, below some threshold thickness, the composite thermal conductivity increases with decreasing thickness, while above the threshold the thermal conductivity is independent of thickness. The threshold thickness increases for increasing filler fraction and increasing k{sub f}/k{sub m}, the ratio between filler and matrix thermal conductivities.

  19. Treating Fibrous Insulation to Reduce Thermal Conductivity

    NASA Technical Reports Server (NTRS)

    Zinn, Alfred; Tarkanian, Ryan

    2009-01-01

    A chemical treatment reduces the convective and radiative contributions to the effective thermal conductivity of porous fibrous thermal-insulation tile. The net effect of the treatment is to coat the surfaces of fibers with a mixture of transition-metal oxides (TMOs) without filling the pores. The TMO coats reduce the cross-sectional areas available for convection while absorbing and scattering thermal radiation in the pores, thereby rendering the tile largely opaque to thermal radiation. The treatment involves a sol-gel process: A solution containing a mixture of transition-metal-oxide-precursor salts plus a gelling agent (e.g., tetraethylorthosilicate) is partially cured, then, before it visibly gels, is used to impregnate the tile. The solution in the tile is gelled, then dried, and then the tile is fired to convert the precursor salts to the desired mixed TMO phases. The amounts of the various TMOs ultimately incorporated into the tile can be tailored via the concentrations of salts in the solution, and the impregnation depth can be tailored via the viscosity of the solution and/or the volume of the solution relative to that of the tile. The amounts of the TMOs determine the absorption and scattering spectra.

  20. Measuring Thermal Conductivity at LH2 Temperatures

    NASA Technical Reports Server (NTRS)

    Selvidge, Shawn; Watwood, Michael C.

    2004-01-01

    For many years, the National Institute of Standards and Technology (NIST) produced reference materials for materials testing. One such reference material was intended for use with a guarded hot plate apparatus designed to meet the requirements of ASTM C177-97, "Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded-Hot-Plate Apparatus." This apparatus can be used to test materials in various gaseous environments from atmospheric pressure to a vacuum. It allows the thermal transmission properties of insulating materials to be measured from just above ambient temperature down to temperatures below liquid hydrogen. However, NIST did not generate data below 77 K temperature for the reference material in question. This paper describes a test method used at NASA's Marshall Space Flight Center (MSFC) to optimize thermal conductivity measurements during the development of thermal protection systems. The test method extends the usability range of this reference material by generating data at temperatures lower than 77 K. Information provided by this test is discussed, as are the capabilities of the MSFC Hydrogen Test Facility, where advanced methods for materials testing are routinely developed and optimized in support of aerospace applications.

  1. Enhanced adhesion and conductivity of Cu electrode on AlN substrate for thin film thermoelectric device

    NASA Astrophysics Data System (ADS)

    Hu, Shaoxiong; Chen, Xin; Deng, Yuan; Wang, Yao; Gao, Hongli; Zhu, Wei; Cao, Lili; Luo, Bingwei; Zhu, Zhixiang; Ma, Guang; Han, Yu

    2015-02-01

    The Cu thin film electrode grown on aluminum nitride (AlN) substrate is widely used in the thin film thermoelectric devices due to its high electrical conductivity. We have developed a new type of buffer layer by co-sputtering Ti and Cu forming Ti-Cu layer. The Ti-Cu layer was sputtered on the Ti buffered AlN substrate so that the adhesion and electrical conductivity properties of the Cu film electrode on AlN substrate could be improved. The interface between the thin films and the substrate were characterized by the scanning electron microscope (SEM). Nanoscratch tests were conducted on a nanomechanical test system to investigate the adhesion between the Cu film electrodes and AlN substrate. Meanwhile, accelerated ageing test under thermal cycling was conducted to evaluate the reliability of the thin film electrode. The results show that the adhesion and the reliability of Cu film electrode on AlN substrate have been greatly improved by employing Ti-Cu/Ti buffer layers.

  2. Thermal conductivity of hybrid short fiber composites

    SciTech Connect

    Dunn, M.L.; Taya, M.; Hatta, H.; Takei, T.; Nakajima, Y. Inst. of Space and Astronautical Science, Sagamihara Three-D Composites Research, Tsukuba Tohoku Univ., Sendai )

    1993-01-01

    A combined analytical/experimental study has been undertaken to investigate the effective thermal conductivity of hybrid composite materials. The analysis utilizes the equivalent inclusion approach for steady state heat conduction (Hatta and Taya, 1986) through which the interaction between the various reinforcing phases at finite concentrations is approximated by the Mori-Tanaka (1973) mean field approach. The multiple reinforcing phases of the composite are modeled as ellipsoidal in shape and thus can simulate a wide range of microstructural geometries ranging from thin platelet to continuous fiber reinforcement. The case when one phase of the composite is penny-shaped microcracks is studied in detail. Multiphase composites consisting of a Kerimid matrix and Al2O3 short fibers and Si3N4 whiskers were fabricated and, after a careful study of their microstructure, their thermal conductivities were measured. Analytical predictions are shown to be in good agreement with experimental results obtained for the Al2O3/Si3N4/Kerimid short fiber composites. 26 refs.

  3. Interfacial adhesion of zirconia/veneer bilayers with different thermal characteristics.

    PubMed

    Freifrau Von Maltzahn, Nadine; Kleibe, Martin; Stiesch, Meike; Hübsch, Christoph; Kohorst, Philipp

    2014-01-01

    The aim of this study was to investigate how changes in the thermal characteristics of veneer ceramics with almost identical chemical and mechanical properties but with different coefficients of thermal expansion (CTE) can modify their interfacial adhesion to zirconia. 48 bilayers made of one Y-TZP ceramic and four veneer ceramics were fabricated (n=12). Thermal residual stresses were calculated on the basis of the CTE and glass transition temperatures. After defined notching all specimens were loaded in a four-point bending test and the critical loads were recorded which induced stable crack extension at the adhesion interface. The strain energy release rate (G, J/m(2)) was calculated and was taken as a measure of interfacial adhesion. The CTE of the veneer ceramics were significantly correlated with their adhesion to Y-TZP (p<0.001). Interfacial adhesion in zirconia/veneer bilayers is predominantly affected by the thermal characteristics of the veneer ceramic. PMID:24786347

  4. Estimating stomatal conductance with thermal imagery.

    PubMed

    Leinonen, I; Grant, O M; Tagliavia, C P P; Chaves, M M; Jones, H G

    2006-08-01

    Most thermal methods for the study of drought responses in plant leaves are based on the calculation of 'stress indices'. This paper proposes and compares three main extensions of these for the direct estimation of absolute values of stomatal conductance to water vapour (gs) using infrared thermography (IRT). All methods use the measured leaf temperature and two environmental variables (air temperature and boundary layer resistance) as input. Additional variables required, depending on the method, are the temperatures of wet and dry reference surfaces, net radiation and relative humidity. The methods were compared using measured gs data from a vineyard in Southern Portugal. The errors in thermal estimates of conductance were of the same order as the measurement errors using a porometer. Observed variability was also compared with theoretical estimates of errors in estimated gs determined on the basis of the errors in the input variables (leaf temperature, boundary layer resistance, net radiation) and the partial derivatives of the energy balance equations used for the gs calculations. The full energy balance approach requires accurate estimates of net radiation absorbed, which may not be readily available in field conditions, so alternatives using reference surfaces are shown to have advantages. A new approach using a dry reference leaf is particularly robust and recommended for those studies where the specific advantages of thermal imagery, including its non-contact nature and its ability to sample large numbers of leaves, are most apparent. Although the results suggest that estimates of the absolute magnitude of gs are somewhat subjective, depending on the skill of the experimenter at selecting evenly exposed leaves, relative treatment differences in conductance are sensitively detected by different experimenters. PMID:16898014

  5. Thermal conductivity of partially ionized gas mixtures

    NASA Astrophysics Data System (ADS)

    Armaly, B. F.; Sutton, K.

    1981-06-01

    A method is proposed for predicting the translational component of the thermal conductivity of partially ionized gas mixtures. It is approximate but simple in form and offers a significant improvement over commonly utilized approximations. It does not require large computer run times nor storage, thus it is suitable for use with complex flow fields and heat transfer calculations. Results for gas mixtures which are representative of the atmosphere of Jupiter, Earth, and Venus are presented and they compare favorably with results from detailed kinetic theory analyses.

  6. Thermal contact conductance of nominaly flat surfaces

    NASA Astrophysics Data System (ADS)

    Yüncü, H.

    2006-11-01

    The variation of thermal conductance of contact has been investigated as a function of apparent contact pressure experimentally. Experimental data has been obtained for steel, brass, copper and aluminum test pieces having different surface roughness over a wide range of contact pressures. Experimental results are compared with the theoretical predictions of an existing theory. Comparison revealed good agreement of trend with the experimental data, however, numerical values vary widely. Theory can predict the experimental results within an over-all error of less than 35%.

  7. Measuring Contact Thermal Conductances at Low Temperatures

    NASA Technical Reports Server (NTRS)

    Salerno, Louis J.; Kittel, Peter; Brooks, Walter; Spivak, Alan L.; Marks, William G., Jr.

    1987-01-01

    Instrument measures thermal conductance of pressed contacts in liquid helium. Makes measurements automatically as function of force on pairs of brass samples having various surface finishes. Developed as part of effort to determine heat-transfer characteristics of bolted joints on cryogenically cooled focal planes in infrared equipment. Cylindrical chamber hangs from cover plate in bath of liquid helium. Inside chamber rocker arm applies controlled force to samples. Upper sample made slightly wider than lower one so two samples remain in complete contact even under slight lateral misalignment.

  8. Electronic thermal conductivity of suspended graphene

    SciTech Connect

    Begum, K. Rizwana Sankeshwar, N. S.

    2014-04-24

    Electronic thermal conductivity, κ{sub e}, of suspended graphene is studied for 20K 100K, becoming dominant for T > 250K. Good agreement with recent experimental data is obtained.

  9. On the theory of nonlinear thermal conductivity

    NASA Astrophysics Data System (ADS)

    Gladkov, S. O.; Bogdanova, S. B.

    2016-02-01

    A nonlinear differential equation of thermal conductivity is derived phenomenologically from the general principles of construction of functional Q invariant to the inversion operation I(r →-r), and the temperature evolution dynamics is analyzed in the nonstationary case. The proposed method makes it possible to reveal some general regularities in the physical behavior of such systems for describing irreversible phenomena in self-organization processes. It is noted that an analogous situation may take place, for example, in strongly inhomogeneous structures with stochastic internal heat fluxes.

  10. Investigation of a Biocompatible Polyurethane-Based Isotropically Conductive Adhesive for UHF RFID Tag Antennas

    NASA Astrophysics Data System (ADS)

    Yang, Cheng; Yuen, Matthew M. F.; Gao, Bo; Ma, Yuhui; Wong, C. P.

    2011-01-01

    As a candidate dispersant for silver-based isotropically conductive adhesives (ICAs), polyurethane (PU) is an environmentally benign material that can withstand a high deformation rate and that exhibits excellent reliability. In this work we investigated methyl ethyl ketoxime (MEKO) blocked isophorone diisocyanate (IPDI) and MEKO blocked hexamethylene diisocyanate (HDI) as dispersant materials, and we characterize the electrical conductivity, mechanical properties, and reliability of these PU-based ICAs with silver-flake filler content ranging from 30 wt.% to 75 wt.%. Results of temperature-humidity testing (THT) at 85°C and 85% relative humidity (RH) and thermal cycling testing (TCT) at -40°C to 125°C show that these ICAs have excellent reliability. Our experimental results suggest that the MEKO blocked PU dispersants are suitable for preparing ultralow-cost, flexible, high-performance ICAs for printing antennas for ultrahigh-frequency radiofrequency identification (RFID) tags. These tags can potentially be used for identifying washable items and food packaging.

  11. Effective thermal conductivity in thermoelectric materials

    SciTech Connect

    Baranowski, LL; Snyder, GJ; Toberer, ES

    2013-05-28

    Thermoelectric generators (TEGs) are solid state heat engines that generate electricity from a temperature gradient. Optimizing these devices for maximum power production can be difficult due to the many heat transport mechanisms occurring simultaneously within the TEG. In this paper, we develop a model for heat transport in thermoelectric materials in which an "effective thermal conductivity" (kappa(eff)) encompasses both the one dimensional steady-state Fourier conduction and the heat generation/consumption due to secondary thermoelectric effects. This model is especially powerful in that the value of kappa(eff) does not depend upon the operating conditions of the TEG but rather on the transport properties of the TE materials themselves. We analyze a variety of thermoelectric materials and generator designs using this concept and demonstrate that kappa(eff) predicts the heat fluxes within these devices to 5% of the exact value. (C) 2013 AIP Publishing LLC.

  12. Thermal conductance of metallic interface in vacuum

    SciTech Connect

    Mortazavi, P.; Shu, D.

    1985-10-01

    In most heat transfer applications, the deposited heat is transfered by any of the following classical methods: conduction, convection, radiation, or any combinations of these three. Depending on how critical the nature is of the designed equipment, the response time must be short enough in order to safeguard the proper performance of the devices. For instance, currently at the National Synchrotron Light Source (NSLS), various hardware equipment are being designed to intercept or to stop intense radiation beams induced by insertion devices such as wiggler and undulators. Due to the nature of some of these designs, the deposited high flux thermal load must be transferred across unbonded contact surfaces. Since any miscalculation would result in the disintegration of exposed material and therefore cause substantial problems, a true actual conductance measurement of the material in question is highly desirable. In the following three sections, background summary, the method of measurement, and the obtained results are discussed.

  13. Thermal conductance of metallic interface in vacuum

    SciTech Connect

    Mortazavi, P.; Shu, D.

    1985-01-01

    In most heat transfer applications, the deposited heat is transferred by any of the following classical methods: conduction, convection, radiation, or any combinations of these three. Depending on how critical the nature is of the designed equipment, the response time must be short enough in order to safeguard the proper performance of the devices. For instance, currently at the National Synchrotron Light Source (NSLS), various hardware equipment are being designed to intercept or to stop intense radiation beams induced by insertion devices such as wiggler and undulators. Due to the nature of some of these designs, the deposited high flux thermal load must be transferred across unbonded contact surfaces. Since any miscalculation would result in the disintegration of exposed material and therefore cause substantial problems, a true actual conductance measurement of the material in question is highly desirable. In the following three sections, background summary, the method of measurement, and the obtained results are discussed.

  14. Effective thermal conductivity in thermoelectric materials

    NASA Astrophysics Data System (ADS)

    Baranowski, Lauryn L.; Jeffrey Snyder, G.; Toberer, Eric S.

    2013-05-01

    Thermoelectric generators (TEGs) are solid state heat engines that generate electricity from a temperature gradient. Optimizing these devices for maximum power production can be difficult due to the many heat transport mechanisms occurring simultaneously within the TEG. In this paper, we develop a model for heat transport in thermoelectric materials in which an "effective thermal conductivity" (κeff) encompasses both the one dimensional steady-state Fourier conduction and the heat generation/consumption due to secondary thermoelectric effects. This model is especially powerful in that the value of κeff does not depend upon the operating conditions of the TEG but rather on the transport properties of the TE materials themselves. We analyze a variety of thermoelectric materials and generator designs using this concept and demonstrate that κeff predicts the heat fluxes within these devices to 5% of the exact value.

  15. Thermally unstable perturbations in stratified conducting atmospheres

    NASA Astrophysics Data System (ADS)

    Reale, Fabio; Serio, Salvatore; Peres, Giovanni

    1994-10-01

    We investigate the thermal stability of isobaric perturbations in a stratified isothermal background atmosphere with solar abundances, as resulting from the competition of optically thin plasma radiative cooling and of heating conducted from the surrounding atmosphere. We have analyzed the threshold line between stable and unstable perturbations, in the plane of the two important control parameters: the initial size of the perturbation and the temperature of the unperturbed medium; this line changes with the pressure of the unperturbed atmosphere. We have extended the results of linear perturbation analysis by means of numerical calculations of the evolution of spherical isobaric perturbations, using a two-dimensional hydrodynamic code including Spitzer heat conduction. We explore a wide range of the parameters appropriate to the solar and stellar upper atmospheres: the background uniform temperature is between 105 K and 107 K, the initial pressure betweeen 0.1 and 10 dyn/sq cm, and the perturbation size between 105 and 1010 cm. The numerical results are in substantial agreement with the linear analysis. We discuss possible implications of our results also in terms of observable effects, especially concerning plasma downflows, and propose thermal instability as a possible candidate to explain the observed redshifts in solar and stellar transition region lines.

  16. Multifunctional Lattices with Low Thermal Expansion and Low Thermal Conductivity

    NASA Astrophysics Data System (ADS)

    Xu, Hang; Liu, Lu; Pasini, Damiano

    Systems in space are vulnerable to large temperature changes when travelling into and out of the Earth's shadow. Variations in temperature can lead to undesired geometric changes in susceptible applications requiring very fine precision. In addition, temperature-sensitive electronic equipment hosted in a satellite needs adequate thermal-control to guarantee a moderate ambient temperature. To address these specifications, materials with low coefficient of thermal expansion (CTE) and low coefficient of thermal conductivity (CTC) over a wide range of temperatures are often sought, especially for bearing components in satellites. Besides low CTE and low CTC, these materials should also provide desirable stiffness, strength and extraordinarily low mass. This work presents ultralightweight bi-material lattices with tunable CTE and CTC, besides high stiffness and strength. We show that the compensation of the thermal expansion and joint rotation at the lattice joints can be used as an effective strategy to tailor thermomechanical performance. Proof-of-concept lattices are fabricated from Al and Ti alloy sheets via a simple snap-fit technique and vacuum brazing, and their CTE and CTC are assessed via a combination of experiments and theory. Corresponding Author.

  17. Introduction to the adhesive bonding session. [foam system for attaching thermal insulation on space shuttle

    NASA Technical Reports Server (NTRS)

    Mccarty, J. E.

    1972-01-01

    Space shuttle unique requirements call for the development of a specific adhesive system to reliable attach reusable surface insulation. A low density foam system has been developed that provides strain isolation from the support structure and remains structurally stable in space shuttle thermal environment. Surface preparation and its stabilization by an adhesive primer system are the most important factors in preventing corrosion from reducing the reliability and durability of the adhesive bonding component.

  18. Effective thermal conductivity of a thin, randomly oriented composite material

    SciTech Connect

    Phelan, P.E.; Niemann, R.C.

    1997-10-01

    The thermal conductivity of a randomly oriented composite material is modeled using a probabilistic approach in order to determine if a size effect exists for the thermal conductivity at small composite thicknesses. The numerical scheme employs a random number generator to position the filler elements, which have a relatively high thermal conductivity, within a matrix having a relative low thermal conductivity. The results indicate that, below some threshold thickness, the composite thermal conductivity is independent of thickness. The threshold thickness increases for increasing filler fraction and increasing k{sub f}/k{sub m}, the ratio between the filler and matrix thermal conductivities.

  19. Non-thermal atmospheric plasmas in dental restoration: improved resin adhesive penetration

    PubMed Central

    Zhang, Ying; Yu, Qingsong; Wang, Yong

    2014-01-01

    Objective To investigate the influence of non-thermal plasma treatment on the penetration of a model dental adhesive into the demineralized dentin. Methods Prepared dentin surfaces were conditioned with Scotchbond Universal etchant for 15 s and sectioned equally perpendicular to the etched surfaces. The separated halves were randomly selected for treatment with an argon plasma brush (input current 6 mA, treatment time 30 s) or gentle argon air blowing (treatment time 30 s, as control). The plasma-treated specimens and control specimens were applied with a model adhesive containing 2,2-bis[4-(2-hydroxy-3-methacryloxypropoxy) phenyl]-propane (BisGMA) and 2-hydroxyethyl methacrylate (HEMA) (mass ratio of 30/70), gently air-dried for 5 s, and light-cured for 20 s. Cross-sectional specimens were characterized using micro-Raman spectral mapping across the dentin, adhesive/dentin interface, and adhesive layer at 1∼micron spatial resolution. SEM was also employed to examine the adhesive/dentin interfacial morphology. Results The micro-Raman result disclosed that plasma treatment significantly improved the penetration of the adhesive, evidenced by the apparently higher content of the adhesive at the adhesive/dentin interface as compared to the control. Specifically, the improvement of the adhesive penetration using plasma technique was achieved by dramatically enhancing the penetration of hydrophilic monomer (HEMA), while maintaining the penetration of hydrophobic monomer (BisGMA). Morphological observation at the adhesive/dentin interface using SEM also confirmed the improved adhesive penetration. The results further suggested that plasma treatment could benefit polymerization of the adhesive, especially in the interface region. Conclusion The significant role of the non-thermal plasma brush in improving the adhesive penetration into demineralized dentin has been demonstrated. The results obtained may offer a better prospect of using plasma in dental restoration to

  20. Thermal contact conductance of actuated interfaces

    NASA Astrophysics Data System (ADS)

    Song, Woo-Bin; Sutton, Michael S.; Talghader, Joseph J.

    2002-08-01

    The thermal contact conductance (TCC) of microactuated mechanical interfaces has been characterized using an electronic technique, where micromachined test structures were heated with a current and the TCC was inferred from the change in resistance. For every device tested, the TCC was higher in vacuum than in air. This is in stark contrast to the behavior of bulk interfaces, and several experiments suggest that it may be the result of a decreased solid-solid contact area in air caused by the pressure of the interstitial gas. The average effective TCC of a polysilicon/nitride interface brought together by electrostatic actuation varies about values of 6.0 x104 W/(K m2) in air and 9.5 x104 W/(K m2) under vacuum for applied pressures of 1 MPa. These values are significantly higher than commonly reported for nonmetallic materials and probably reflect the very smooth surfaces of deposited thin films.

  1. Electronic thermal conduction in suspended graphene

    NASA Astrophysics Data System (ADS)

    Rizwana Begum, K.; Sankeshwar, N. S.

    2015-09-01

    The electronic thermal conductivity (ETC), κe, of suspended graphene (SG) is studied for 15

  2. Thermally conductive porous element-based recuperators

    NASA Technical Reports Server (NTRS)

    Du, Jian Hua (Inventor); Chow, Louis C (Inventor); Lin, Yeong-Ren (Inventor); Wu, Wei (Inventor); Kapat, Jayanta (Inventor); Notardonato, William U. (Inventor)

    2012-01-01

    A heat exchanger includes at least one hot fluid flow channel comprising a first plurality of open cell porous elements having first gaps there between for flowing a hot fluid in a flow direction and at least one cold fluid flow channel comprising a second plurality of open cell porous elements having second gaps therebetween for flowing a cold fluid in a countercurrent flow direction relative to the flow direction. The thermal conductivity of the porous elements is at least 10 W/mK. A separation member is interposed between the hot and cold flow channels for isolating flow paths associated these flow channels. The first and second plurality of porous elements at least partially overlap one another to form a plurality of heat transfer pairs which transfer heat from respective ones of the first porous elements to respective ones of the second porous elements through the separation member.

  3. Efficient Reformulation of HOTFGM: Heat Conduction with Variable Thermal Conductivity

    NASA Technical Reports Server (NTRS)

    Zhong, Yi; Pindera, Marek-Jerzy; Arnold, Steven M. (Technical Monitor)

    2002-01-01

    Functionally graded materials (FGMs) have become one of the major research topics in the mechanics of materials community during the past fifteen years. FGMs are heterogeneous materials, characterized by spatially variable microstructure, and thus spatially variable macroscopic properties, introduced to enhance material or structural performance. The spatially variable material properties make FGMs challenging to analyze. The review of the various techniques employed to analyze the thermodynamical response of FGMs reveals two distinct and fundamentally different computational strategies, called uncoupled macromechanical and coupled micromechanical approaches by some investigators. The uncoupled macromechanical approaches ignore the effect of microstructural gradation by employing specific spatial variations of material properties, which are either assumed or obtained by local homogenization, thereby resulting in erroneous results under certain circumstances. In contrast, the coupled approaches explicitly account for the micro-macrostructural interaction, albeit at a significantly higher computational cost. The higher-order theory for functionally graded materials (HOTFGM) developed by Aboudi et al. is representative of the coupled approach. However, despite its demonstrated utility in applications where micro-macrostructural coupling effects are important, the theory's full potential is yet to be realized because the original formulation of HOTFGM is computationally intensive. This, in turn, limits the size of problems that can be solved due to the large number of equations required to mimic realistic material microstructures. Therefore, a basis for an efficient reformulation of HOTFGM, referred to as user-friendly formulation, is developed herein, and subsequently employed in the construction of the efficient reformulation using the local/global conductivity matrix approach. In order to extend HOTFGM's range of applicability, spatially variable thermal

  4. Rolling silver nanowire electrodes: simultaneously addressing adhesion, roughness, and conductivity.

    PubMed

    Hauger, Tate C; Al-Rafia, S M Ibrahim; Buriak, Jillian M

    2013-12-11

    Silver nanowire mesh electrodes represent a possible mass-manufacturable route toward transparent and flexible electrodes for plastic-based electronics such as organic photovoltaics (OPVs), organic light emitting diodes (OLEDs), and others. Here we describe a route that is based upon spray-coated silver nanowire meshes on polyethylene terephthalate (PET) sheets that are treated with a straightforward combination of heat and pressure to generate electrodes that have low sheet resistance, good optical transmission, that are topologically flat, and adhere well to the PET substrate. The silver nanowire meshes were prepared by spray-coating a solution of silver nanowires onto PET, in air at slightly elevated temperatures. The as-prepared silver nanowire electrodes are highly resistive due to the poor contact between the individual silver nanowires. Light pressure applied with a stainless steel rod, rolled over the as-sprayed silver nanowire meshes on PET with a speed of 10 cm s(-1) and a pressure of 50 psi, results in silver nanowire mesh arrays with sheet resistances of less than 20 Ω/□. Bending of these rolled nanowire meshes on PET with different radii of curvature, from 50 to 0.625 mm, showed no degradation of the conductivity of the electrodes, as shown by the constant sheet resistance before and after bending. Repeated bending (100 times) around a rod with a radius of curvature of 1 mm also showed no increase in the sheet resistance, demonstrating good adherence and no signs of delamination of the nanowire mesh array. The diffuse and direct transmittance of the silver nanowires (both rolled and as-sprayed) was measured for wavelengths from 350 to 1200 nm, and the diffuse transmission was similar to that of the PET substrate; the direct transmission decreases by about 7-8%. The silver nanowires were then incorporated into OPV devices with the following architecture: transparent electrode/PEDOT:PSS/P3HT:PC61BM/LiF/Al. While slightly lower in efficiency than the

  5. Thermal conductivity of silver loaded conductive epoxy from cryogenic to ambient temperature and its application for precision cryogenic noise measurements

    NASA Astrophysics Data System (ADS)

    Amils, Ricardo I.; Gallego, Juan Daniel; Sebastián, José Luis; Muñoz, Sagrario; Martín, Agustín; Leuther, Arnulf

    2016-06-01

    The pressure to increase the sensitivity of instrumentation has pushed the use of cryogenic Low Noise Amplifier (LNA) technology into a growing number of fields. These areas range from radio astronomy and deep space communications to fundamental physics. In this context manufacturing for cryogenic environments requires a proper thermal knowledge of the materials to be able to achieve adequate design behavior. In this work, we present experimental measurements of the thermal conductivity of a silver filled conductive epoxy (EPO-TEK H20E) which is widely used in cryogenic electronics applications. The characterization has been made using a sample preparation which mimics the practical use of this adhesive in the fabrication of cryogenic devices. We apply the data obtained to a detailed analysis of the effects of the conductive epoxy in a monolithic thermal noise source used for high accuracy cryogenic microwave noise measurements. In this application the epoxy plays a fundamental role since its limited thermal conductivity allows heating the chip with relatively low power. To our knowledge, the cryogenic thermal conductivity data of this epoxy has not been reported before in the literature in the 4-300 K temperature range. A second non-conductive epoxy (Gray Scotch-Weld 2216 B/A), also widely used in cryogenic applications, has been measured in order to validate the method by comparing with previous published data.

  6. Method for Measuring Thermal Conductivity of Small Samples Having Very Low Thermal Conductivity

    NASA Technical Reports Server (NTRS)

    Miller, Robert A.; Kuczmarski, Maria a.

    2009-01-01

    This paper describes the development of a hot plate method capable of using air as a standard reference material for the steady-state measurement of the thermal conductivity of very small test samples having thermal conductivity on the order of air. As with other approaches, care is taken to ensure that the heat flow through the test sample is essentially one-dimensional. However, unlike other approaches, no attempt is made to use heated guards to block the flow of heat from the hot plate to the surroundings. It is argued that since large correction factors must be applied to account for guard imperfections when sample dimensions are small, it may be preferable to simply measure and correct for the heat that flows from the heater disc to directions other than into the sample. Experimental measurements taken in a prototype apparatus, combined with extensive computational modeling of the heat transfer in the apparatus, show that sufficiently accurate measurements can be obtained to allow determination of the thermal conductivity of low thermal conductivity materials. Suggestions are made for further improvements in the method based on results from regression analyses of the generated data.

  7. Mussel-Inspired Polydopamine-Functionalized Graphene as a Conductive Adhesion Promoter and Protective Layer for Silver Nanowire Transparent Electrodes.

    PubMed

    Miao, Jinlei; Liu, Haihui; Li, Wei; Zhang, Xingxiang

    2016-05-31

    For the scalable fabrication of transparent electrodes and optoelectronic devices, excellent adhesion between the conductive films and the substrates is essential. In this work, a novel mussel-inspired polydopamine-functionalized graphene/silver nanowire hybrid nanomaterial for transparent electrodes was fabricated in a facile manner. Graphene oxide (GO) was functionalized and reduced by polydopamine while remaining stable in water without precipitation. It is shown that the polydopamine-functionalized GO (PFGO) film adhered to the substrate much more easily and more uniformly than the GO film. The PFGO film had a sheet resistance of ∼3.46 × 10(8) Ω/sq and a transparency of 78.2%, with excellent thermal and chemical stability; these characteristics are appropriate for antistatic coatings. Further reduced PFGO (RPFGO) as a conductive adhesion promoter and protective layer for the Ag nanowire (AgNW) significantly enhanced the adhesion force between AgNW networks and the substrate. The RPFGO-AgNW electrode was found to have a sheet resistance of 63 Ω/sq and a transparency of 70.5%. Moreover, the long-term stability of the RPFGO-AgNW electrode was greatly enhanced via the effective protection of the AgNW by RPFGO. These solution-processed antistatic coatings and electrodes have tremendous potential in the applications of optoelectronic devices as a result of their low production cost and facile processing. PMID:27142815

  8. Origin of reduction in phonon thermal conductivity of microporous solids

    NASA Astrophysics Data System (ADS)

    Hopkins, Patrick E.; Rakich, Peter T.; Olsson, Roy H.; El-kady, Ihab F.; Phinney, Leslie M.

    2009-10-01

    Porous structures have strong tunable size effects due to increased surface area. Size effects on phonon thermal conductivity have been observed in porous materials with periodic voids on the order of microns. This letter explores the origin of this size effect on phonon thermal conductivity observed in periodic microporous membranes. Pore-edge boundary scattering of low frequency phonons explains the temperature trends in the thermal conductivity; further reduction in thermal conductivity is explained by the porosity.

  9. Strain-controlled thermal conductivity in ferroic twinned films

    PubMed Central

    Li, Suzhi; Ding, Xiangdong; Ren, Jie; Moya, Xavier; Li, Ju; Sun, Jun; Salje, Ekhard K. H.

    2014-01-01

    Large reversible changes of thermal conductivity are induced by mechanical stress, and the corresponding device is a key element for phononics applications. We show that the thermal conductivity κ of ferroic twinned thin films can be reversibly controlled by strain. Nonequilibrium molecular dynamics simulations reveal that thermal conductivity decreases linearly with the number of twin boundaries perpendicular to the direction of heat flow. Our demonstration of large and reversible changes in thermal conductivity driven by strain may inspire the design of controllable thermal switches for thermal logic gates and all-solid-state cooling devices. PMID:25224749

  10. Deterioration in effective thermal conductivity of aqueous magnetic nanofluids

    NASA Astrophysics Data System (ADS)

    Altan, Cem L.; Gurten, Berna; Sommerdijk, Nico A. J. M.; Bucak, Seyda

    2014-12-01

    Common heat transfer fluids have low thermal conductivities, which decrease their efficiency in many applications. On the other hand, solids have much higher thermal conductivity values. Previously, it was shown that the addition of different nanoparticles to various base fluids increases the thermal conductivity of the carrier fluid remarkably. However, there are limited studies that focus on the thermal conductivity of magnetic fluids. In this study, thermal conductivity of magnetic nanofluids composed of magnetite nanoparticles synthesized via co-precipitation and thermal decomposition methods is investigated. Results showed that the addition of magnetite nanoparticles decreased the thermal conductivity of water and ethylene glycol. This decrease was found to increase with increasing particle concentration and to be independent of the synthesis method, the type of surfactant, and the interfacial thermal resistance.

  11. Size effects in thermal conduction by phonons

    NASA Astrophysics Data System (ADS)

    Allen, Philip B.

    2014-08-01

    Heat transport in nanoscale systems is both hard to measure microscopically, and hard to interpret. Ballistic and diffusive heat flow coexist, adding confusion. This paper looks at a very simple case: a nanoscale crystal repeated periodically. This is a popular model for simulation of bulk heat transport using classical molecular dynamics (MD), and is related to transient thermal grating experiments. Nanoscale effects are seen in perhaps their simplest form. The model is solved by an extension of standard quasiparticle gas theory of bulk solids. Both structure and heat flow are constrained by periodic boundary conditions. Diffusive transport is fully included, while ballistic transport by phonons of a long mean free path is diminished in a specific way. Heat current J (x) and temperature gradient ∇T (x') have a nonlocal relationship, via κ (x-x'), over a distance |x-x'| determined by phonon mean free paths. In MD modeling of bulk conductivity, finite computer resources limit system size. Long mean free paths, comparable to the scale of heating and cooling, cause undesired finite-size effects that have to be removed by extrapolation. The present model allows this extrapolation to be quantified. Calculations based on the Peierls-Boltzmann equation, using a generalized Debye model, show that extrapolation involves fractional powers of 1/L. It is also argued that heating and cooling should be distributed sinusoidally [ė∝cos(2πx/L)] to improve convergence of numerics.

  12. High Thermal Conductivity Aligned Polyethylene-Graphene Nanocomposites

    NASA Astrophysics Data System (ADS)

    Garg, Jivtesh; Saeidijavash, Mortaza

    We investigate enhancement of thermal conductivity in polyethylene-graphene nanocomposites. The effect of alignment of both the polymer chains and the dispersed graphene flakes on thermal conductivity enhancement will be reported. In this work nanocomposites are prepared through microextrusion of polyethylene pellets and graphene nanopowder. Alignment is achieved through mechanical stretching of the nanocomposites. Thermal conductivity is measured using both Angstrom method and Laser flash. Variables involved in the study are the draw ratio and the weight percentage of graphene nanopowder. Results will shed light on the role of alignment of graphene flakes on enhancing thermal transport and provide new avenues to achieve ultra-high thermal conductivity in polymeric materials.

  13. High-precision thermal conductivity measurements as a probe of polymer/nanoparticle interfaces

    NASA Astrophysics Data System (ADS)

    Putnam, Shawn A.; Cahill, David G.; Ash, Benjamin J.; Schadler, Linda S.

    2003-11-01

    We use the 3ω method to study the thermal conductivity of composites of nanoscale alumina particles in polymethylmethacrylate (PMMA) matrices. Effective medium theory and data for the changes in conductivity produced by low volume fractions of particle fillers are used to estimate the thermal conductance G of PMMA/alumina interfaces in the temperature range of 40conductivity of the PMMA matrix.) Therefore, high volume fractions of typical ceramic nanoparticles with r≫r0 can be used in thermal interface materials such as adhesives, pastes, and pads.

  14. Experiments on thermal contact conductance between metals below 100 K

    NASA Astrophysics Data System (ADS)

    Choi, Yeon Suk; Kim, Myung Su

    2014-01-01

    The thermal contact conductance is one of the important components in heat transfer mechanism. The accurate estimation of thermal contact conductance is necessary for the development of a conduction-cooled superconducting magnet system because the metallic materials are thermally connected to the refrigerator or heat sink to cool the superconducting magnet without cryogen. The contact resistance occurs at the interface between metals and the amount of conductance can be affected by various factors, such as surface roughness, contact area, and contact pressure. In the superconducting magnet system, there are several metal components in contact with each other for cooling magnet as well as supplying current to the magnet. Therefore, a temperature gradient exists between superconducting magnet and cryocooler. In this study, we have developed the thermal contact conductance measurement system and used the steady state method to measure the thermal conductance between metals. The effects of temperature, contact pressure and interfacial materials on the thermal contact conductance are also discussed.

  15. Flexible Fabrics with High Thermal Conductivity for Advanced Spacesuits

    NASA Technical Reports Server (NTRS)

    Trevino, Luis A.; Bue, Grant; Orndoff, Evelyne; Kesterson, Matt; Connel, John W.; Smith, Joseph G., Jr.; Southward, Robin E.; Working, Dennis; Watson, Kent A.; Delozier, Donovan M.

    2006-01-01

    This paper describes the effort and accomplishments for developing flexible fabrics with high thermal conductivity (FFHTC) for spacesuits to improve thermal performance, lower weight and reduce complexity. Commercial and additional space exploration applications that require substantial performance enhancements in removal and transport of heat away from equipment as well as from the human body can benefit from this technology. Improvements in thermal conductivity were achieved through the use of modified polymers containing thermally conductive additives. The objective of the FFHTC effort is to significantly improve the thermal conductivity of the liquid cooled ventilation garment by improving the thermal conductivity of the subcomponents (i.e., fabric and plastic tubes). This paper presents the initial system modeling studies, including a detailed liquid cooling garment model incorporated into the Wissler human thermal regulatory model, to quantify the necessary improvements in thermal conductivity and garment geometries needed to affect system performance. In addition, preliminary results of thermal conductivity improvements of the polymer components of the liquid cooled ventilation garment are presented. By improving thermal garment performance, major technology drivers will be addressed for lightweight, high thermal conductivity, flexible materials for spacesuits that are strategic technical challenges of the Exploration

  16. Thermal contact conductance across filled polyimide films at cryogenic temperatures

    NASA Astrophysics Data System (ADS)

    Zhao, L.; Phelan, P. E.

    1999-12-01

    Thermal contact resistance arises in the region of contact where two solid specimens are pressed together. The thermal resistance can be controlled by inserting an interstitial material at the interface, such as Kapton MT, a polyimide film containing alumina particles, which has a relatively low thermal resistance, but yet a high voltage standoff capability. The thermal resistance consists of two components: thermal contact resistance at the copper/Kapton MT interfaces, and the thermal conduction resistance across the Kapton MT film. The measured thermal resistance at low temperatures indicates that increasing the contact pressure reduces the thermal resistance, to a limit determined by the film conduction resistance. The effects of the contact pressure, the average interface temperature and the thickness of the interstitial layer are evaluated. A novel dimensionless correlation is derived from the experimental results that describes the thermal contact conductance of joints which include a soft interstitial material, at cryogenic temperatures.

  17. Phonon thermal conductivity of monolayer MoS2

    NASA Astrophysics Data System (ADS)

    Wang, Xiaonan; Tabarraei, Alireza

    2016-05-01

    We use nonequilibrium molecular dynamics modeling using Stillinger-Weber interatomic potential to investigate the thermal properties of monolayer molybdenum disulfide (MoS2) nanoribbons. We study the impact of factors such as length, edge chirality, monovacancies, and uniaxial stretching on the thermal conductivity of MoS2 nanoribbons. Our results show that longer ribbons have a higher thermal conductivity, and the thermal conductivity of infinitely long zigzag and armchair MoS2 nanoribbons is, respectively, 54 W/mK and 33 W/mK. This is significantly lower than the thermal conductivity of some other graphene-like two-dimensional materials such as graphene and boron nitride. While the presence of molybdenum or sulfur vacancies reduces the thermal conductivity of ribbons, molybdenum vacancies have a more deteriorating effect on thermal conductivities. We also have studied the impact of uniaxial stretching on the thermal conductivity of MoS2 nanoribbons. The results show that in contrast to three dimensional materials, thermal conductivity of MoS2 is fairly insensitive to stretching. We have used the phonon dispersion curves and group velocities to investigate the mechanism of this unexpected behavior. Our results show that tensile strain does not alter the phonon dispersion curves and hence the thermal conductivity does not change.

  18. Thermal Conductivity of Functional Citrus Tree Wood 1

    PubMed Central

    Turrell, F. M.; Austin, S. W.; McNee, Dan; Park, W. J.

    1967-01-01

    Thermal conductivity coefficients have been determined for longitudinal and transverse flow in 4 varieties of fresh Citrus wood using steady state-methods. Equations were developed from which thermal conductivity could be rapidly estimated from moisture content or electrical conductivity. The heat balance of large and small tree trunks on a freezing night has been calculated on the basis of the coefficients. PMID:16656610

  19. Effective thermal conductivity determination for low-density insulating materials

    NASA Technical Reports Server (NTRS)

    Williams, S. D.; Curry, D. M.

    1978-01-01

    That nonlinear least squares can be used to determine effective thermal conductivity was demonstrated, and a method for assessing the relative error associated with these predicted values was provided. The differences between dynamic and static determination of effective thermal conductivity of low-density materials that transfer heat by a combination of conduction, convection, and radiation were discussed.

  20. Final Report: Thermal Conductance of Solid-Liquid Interfaces

    SciTech Connect

    Cahil, David, G.; Braun, Paul, V.

    2006-05-31

    Research supported by this grant has significantly advanced fundamental understanding of the thermal conductance of solid-liquid interfaces, and the thermal conductivity of nanofluids and nanoscale composite materials. • The thermal conductance of interfaces between carbon nanotubes and a surrounding matrix of organic molecules is exceptionally small and this small value of the interface conductance limits the enhancement in thermal conductivity that can be achieved by loading a fluid or a polymer with nanotubes. • The thermal conductance of interfaces between metal nanoparticles coated with hydrophilic surfactants and water is relatively high and surprisingly independent of the details of the chemical structure of the surfactant. • We extended our experimental methods to enable studies of planar interfaces between surfactant-coated metals and water where the chemical functionalization can be varied between strongly hydrophobic and strongly hydrophilic. The thermal conductance of hydrophobic interfaces establishes an upper-limit of 0.25 nm on the thickness of the vapor-layer that is often proposed to exist at hydrophobic interfaces. • Our high-precision measurements of fluid suspensions show that the thermal conductivity of fluids is not significantly enhanced by loading with a small volume fraction of spherical nanoparticles. These experimental results directly contradict some of the anomalous results in the recent literature and also rule-out proposed mechanisms for the enhanced thermal conductivity of nanofluids that are based on modification of the fluid thermal conductivity by the coupling of fluid motion and the Brownian motion of the nanoparticles.

  1. Thermal conductivity degradation of graphites irradiated at low temperature

    SciTech Connect

    Snead, L.L.; Burchell, T.D.

    1995-04-01

    The objective of this work is to study the thermal conductivity degradation of new, high thermal conductivity graphites and to compare these results to more standard graphites irradiated at low temperatures. Several graphites and graphite composites (C/C`s) have been irradiated near 150{degree}C and at fluences up to a displacement level of 0.24 dpa. The materials ranged in unirradiated room temperature thermal conductivity of these materials varied from 114 W/m-K for H-451 isotropic graphite, to 670 W/m-K for unidirectional FMI-1D C/C composite. At the irradiation temperature a saturation reduction in thermal conductivity was seen to occur at displacement levels of approximately 0.1 dpa. All materials were seen to degrade to approximately 10 to 14 % of their original thermal conductivity after irradiation. The effect of post irradiation annealing on the thermal conductivity was also studied.

  2. Bistability of Membrane Conductance in Cell Adhesion Observed in a Neuron Transistor

    NASA Astrophysics Data System (ADS)

    Jenkner, Martin; Fromherz, Peter

    1997-12-01

    We attached individual nerve cells from leech ganglia to oxidized silicon using polylysine. We studied the electrical current through the cell membrane in the region of adhesion taking advantage of field-effect transistors integrated in the substrate. We found that a minute mechanical deformation of the cell triggered a bistable reversible switching of the attached membrane between states of high and low conductance. Feasible mechanisms of the nonlinear effect are discussed.

  3. Controlling the adhesion of conducting polymer films with patterned self-assembled monolayers

    SciTech Connect

    Rozsnyai, L.F.; Wrighton, M.S.

    1996-02-01

    A photosensitive self-assembled monolayer (SAM) is selectively irradiated to fabricate a pattern on an Au electrode, and a thin film of aniline or 3-methylthiophene is deposited on it by electopolymerization. Adhesion of the polymer films can be controlled by the monolayer terminal group. Applying tape to the sample and peeling it away selectively removes the conducting polymer film to the tape in a near-micron resolution pattern. 14 refs., 1 fig.

  4. Thermal conductivity of graphene nanoribbons in noble gaseous environments

    SciTech Connect

    Zhong, Wei-Rong Xu, Zhi-Cheng; Zheng, Dong-Qin; Ai, Bao-Quan

    2014-02-24

    We investigate the thermal conductivity of suspended graphene nanoribbons in noble gaseous environments using molecular dynamics simulations. It is reported that the thermal conductivity of perfect graphene nanoribbons decreases with the gaseous pressure. The decreasing is more obvious for the noble gas with large atomic number. However, the gaseous pressure cannot change the thermal conductivity of defective graphene nanoribbons apparently. The phonon spectra of graphene nanoribbons are also provided to give corresponding supports.

  5. Thermophysical Properties of Polymer Materials with High Thermal Conductivity

    NASA Astrophysics Data System (ADS)

    Lebedev, S. M.; Gefle, O. S.; Dneprovskii, S. N.; Amitov, E. T.

    2015-06-01

    Results of studies on the main thermophysical properties of new thermally conductive polymer materials are presented. It is shown that modification of polymer dielectrics by micron-sized fillers allows thermally conductive materials with thermal conductivity not less than 2 W/(m K) to be produced, which makes it possible to use such materials as cooling elements of various electrical engineering and semiconductor equipment and devices.

  6. Thermal conductivity of Rene 41 honeycomb panels. [space transportation vehicles

    NASA Technical Reports Server (NTRS)

    Deriugin, V.

    1980-01-01

    Effective thermal conductivities of Rene 41 panels suitable for advanced space transportation vehicle structures were determined analytically and experimentally for temperature ranges between 20.4K (423 F) and 1186K (1675 F). The cryogenic data were obtained using a cryostat whereas the high temperature data were measured using a heat flow meter and a comparative thermal conductivity instrument respectively. Comparisons were made between analysis and experimental data. Analytical methods appear to provide reasonable definition of the honeycomb panel effective thermal conductivities.

  7. Tensile adhesion testing of thermal spray coatings on flat substrates

    SciTech Connect

    Leigh, S.H.; Berndt, C.C.; Wu, C.L.; Nakamura, T.

    1994-12-31

    The standard tensile adhesion test (TAT), ASTM C633, has been modified to perform multiple tests on flat and wide substrates. The TAT geometry which specifies a 25.4 mm (1 in.) diameter cylindrical substrate has been employed as the pull-off bar. Two renditions of this test were implemented and the Weibull moduli and characteristics tresses for both test methods obtained. The modified TAT, termed as the single bar (SB) method, yields a higher Weibull modulus and characteristic strength than the other method which is termed as the double bar (DB) method. It is expected that the different test results between the two methods arise from different stress distributions near the interface of the coating and substrate. Finite element analysis was used to obtain the stress distribution near the interface of the coating and substrate, and the relationship between the adhesion strength of the SB and DB methods were derived.

  8. Thermal Conductivity of Alumina-Toughened Zirconia Composites

    NASA Technical Reports Server (NTRS)

    Bansal, Narottam P.; Zhu, Dong-Ming

    2003-01-01

    10-mol% yttria-stabilized zirconia (10YSZ)-alumina composites containing 0 to 30 mol% alumina were fabricated by hot pressing at 1500 C in vacuum. Thermal conductivity of the composites, determined at various temperatures using a steady-state laser heat flux technique, increased with increase in alumina content. Composites containing 0, 5, and 10-mol% alumina did not show any change in thermal conductivity with temperature. However, those containing 20 and 30-mol% alumina showed a decrease in thermal conductivity with increase in temperature. The measured values of thermal conductivity were in good agreement with those calculated from simple rule of mixtures.

  9. Modelling of thermal conductance during microthermal machining with scanning thermal microscope using an inverse methodology

    NASA Astrophysics Data System (ADS)

    Yang, Yu-Ching; Chang, Win-Jin; Fang, Te-Hua; Fang, Shih-Chung

    2008-01-01

    In this study, a general methodology for determining the thermal conductance between the probe tip and the workpiece during microthermal machining using Scanning Thermal Microscopy (SThM) has been proposed. The processing system was considered as an inverse heat conduction problem with an unknown thermal conductance. Temperature dependence for the material properties and thermal conductance in the analysis of heat conduction is taken into account. The conjugate gradient method is used to solve the inverse problem. Furthermore, this methodology can also be applied to estimate the thermal contact conductance in other transient heat conduction problems, like metal casting process, injection molding process, and electronic circuit systems.

  10. Thermal conductivity of penta-graphene from molecular dynamics study

    NASA Astrophysics Data System (ADS)

    Xu, Wen; Zhang, Gang; Li, Baowen

    2015-10-01

    Using classical equilibrium molecular dynamics simulations and applying the original Tersoff interatomic potential, we study the thermal transport property of the latest two dimensional carbon allotrope, penta-graphene. It is predicted that its room-temperature thermal conductivity is about 167 W/mK, which is much lower than that of graphene. With normal mode decomposition, the accumulated thermal conductivity with respect to phonon frequency and mean free path is analyzed. It is found that the acoustic phonons make a contribution of about 90% to the thermal conductivity, and phonons with mean free paths larger than 100 nm make a contribution over 50%. We demonstrate that the remarkably lower thermal conductivity of penta-graphene compared with graphene results from the lower phonon group velocities and fewer collective phonon excitations. Our study highlights the importance of structure-property relationship and provides better understanding of thermal transport property and valuable insight into thermal management of penta-graphene.

  11. Thermal conductivity of penta-graphene from molecular dynamics study.

    PubMed

    Xu, Wen; Zhang, Gang; Li, Baowen

    2015-10-21

    Using classical equilibrium molecular dynamics simulations and applying the original Tersoff interatomic potential, we study the thermal transport property of the latest two dimensional carbon allotrope, penta-graphene. It is predicted that its room-temperature thermal conductivity is about 167 W/mK, which is much lower than that of graphene. With normal mode decomposition, the accumulated thermal conductivity with respect to phonon frequency and mean free path is analyzed. It is found that the acoustic phonons make a contribution of about 90% to the thermal conductivity, and phonons with mean free paths larger than 100 nm make a contribution over 50%. We demonstrate that the remarkably lower thermal conductivity of penta-graphene compared with graphene results from the lower phonon group velocities and fewer collective phonon excitations. Our study highlights the importance of structure-property relationship and provides better understanding of thermal transport property and valuable insight into thermal management of penta-graphene. PMID:26493918

  12. High thermal conductivity of hexagonal boron nitride laminates

    NASA Astrophysics Data System (ADS)

    Zheng, Jin-Cheng; Zhang, Liang; Kretinin, A. V.; Morozov, S. V.; Wang, Yi Bo; Wang, Tun; Li, Xiaojun; Ren, Fei; Zhang, Jingyu; Lu, Ching-Yu; Chen, Jia-Cing; Lu, Miao; Wang, Hui-Qiong; Geim, A. K.; Novoselov, K. S.

    2016-03-01

    Two-dimensional materials are characterised by a number of unique physical properties which can potentially make them useful to a wide diversity of applications. In particular, the large thermal conductivity of graphene and hexagonal boron nitride (hBN) has already been acknowledged and these materials have been suggested as novel core materials for thermal management in electronics. However, it was not clear if mass produced flakes of hBN would allow one to achieve an industrially-relevant value of thermal conductivity. Here we demonstrate that laminates of hBN exhibit thermal conductivity of up to 20 W/m·K, which is significantly larger than that currently used in thermal management. We also show that the thermal conductivity of laminates increases with the increasing volumetric mass density, which creates a way of fine tuning its thermal properties.

  13. Peel resistance characterization of localized polymer film bonding via thin film adhesive thermally activated by scanned CO2 laser

    NASA Astrophysics Data System (ADS)

    Dowding, Colin; Dowding, Robert; Griffiths, Jonathan; Lawrence, Jonathan

    2013-06-01

    Thermal laser polymer bonding is a non-contact process for the joining of polymer laminates using thermally activated adhesives. Conventional, contact based bonding techniques suffer from mechanical wear, geometric inflexibility and poor energy efficiency. The application of lasers offers the potential for highly localized delivery of energy and increased process flexibility whilst achieving controlled and repeatable bonding of polymer laminates in a contact free process. Unlike previously reported techniques, here it is reported that laser based non-contact bonding is both viable and highly desirable due to the increased levels of control it affords the user. In this work, laser polymer bonding of 75 μm thick linear low density polyethylene (LLDPE) film backed with a thermally activated adhesive to a 640 μm thick polypropylene (PP) substrate was conducted using continuous wave 10.6 μm laser radiation and scanning galvanometric optics. The effect of laser power and scanning traverse speed on the peel resistance properties of the bonded polymer laminates is presented, with a threshold specific energy density for successful adhesive activation determined.

  14. Electrochemically tunable thermal conductivity of lithium cobalt oxide

    NASA Astrophysics Data System (ADS)

    Cho, Jiung; Losego, Mark D.; Zhang, Hui Gang; Kim, Honggyu; Zuo, Jianmin; Petrov, Ivan; Cahill, David G.; Braun, Paul V.

    2014-06-01

    Using time-domain thermoreflectance, the thermal conductivity and elastic properties of a sputter deposited LiCoO2 film, a common lithium-ion cathode material, are measured as a function of the degree of lithiation. Here we report that via in situ measurements during cycling, the thermal conductivity of a LiCoO2 cathode reversibly decreases from ~5.4 to 3.7 W m-1 K-1, and its elastic modulus decreases from 325 to 225 GPa, as it is delithiated from Li1.0CoO2 to Li0.6CoO2. The dependence of the thermal conductivity on lithiation appears correlated with the lithiation-dependent phase behaviour. The oxidation-state-dependent thermal conductivity of electrolytically active transition metal oxides provides opportunities for dynamic control of thermal conductivity and is important to understand for thermal management in electrochemical energy storage devices.

  15. Electrochemically tunable thermal conductivity of lithium cobalt oxide.

    PubMed

    Cho, Jiung; Losego, Mark D; Zhang, Hui Gang; Kim, Honggyu; Zuo, Jianmin; Petrov, Ivan; Cahill, David G; Braun, Paul V

    2014-01-01

    Using time-domain thermoreflectance, the thermal conductivity and elastic properties of a sputter deposited LiCoO2 film, a common lithium-ion cathode material, are measured as a function of the degree of lithiation. Here we report that via in situ measurements during cycling, the thermal conductivity of a LiCoO2 cathode reversibly decreases from ~5.4 to 3.7 W m(-1) K(-1), and its elastic modulus decreases from 325 to 225 GPa, as it is delithiated from Li1.0CoO2 to Li0.6CoO2. The dependence of the thermal conductivity on lithiation appears correlated with the lithiation-dependent phase behaviour. The oxidation-state-dependent thermal conductivity of electrolytically active transition metal oxides provides opportunities for dynamic control of thermal conductivity and is important to understand for thermal management in electrochemical energy storage devices. PMID:24892640

  16. Anisotropic thermal conductivity of thin polycrystalline oxide samples

    SciTech Connect

    Tiwari, A.; Boussois, K.; Nait-Ali, B.; Smith, D. S.; Blanchart, P.

    2013-11-15

    This paper reports about the development of a modified laser-flash technique and relation to measure the in-plane thermal diffusivity of thin polycrystalline oxide samples. Thermal conductivity is then calculated with the product of diffusivity, specific heat and density. Design and operating features for evaluating in-plane thermal conductivities are described. The technique is advantageous as thin samples are not glued together to measure in-plane thermal conductivities like earlier methods reported in literature. The approach was employed to study anisotropic thermal conductivity in alumina sheet, textured kaolin ceramics and montmorillonite. Since it is rare to find in-plane thermal conductivity values for such anisotropic thin samples in literature, this technique offers a useful variant to existing techniques.

  17. Thermal conductance of pressed contacts at liquid helium temperatures

    NASA Technical Reports Server (NTRS)

    Salerno, L. J.; Kittel, P.; Spivak, A. L.

    1983-01-01

    It is pointed out that the optimum design of cryogenic instruments requires accurate thermal models. The present models are limited by a lack of knowledge of the low temperature thermal conductance of the bolted joints which are typically used in the instrument-to-system interface. In connection with studies of pressed contacts, it has been found that the thermal conductance does not obey the Wiedemann-Franz law. The present investigation is concerned with the characterization of the thermal conductance of pressed contacts at liquid helium-4 temperatures, taking into account the dependence of thermal contact conductance on applied force and temperature. It is shown that for the 0.4 micron OFHC copper pressed contact pair, the thermal conductance varies roughly as the second power of the temperature, and increases with increasing applied force.

  18. Thermal conductance of space suit insulations, thermal micrometeroid garments, and other insulations

    NASA Technical Reports Server (NTRS)

    Richardson, D. L.; Stevens, J. M.

    1976-01-01

    The thermal protection capabilities of development and operational thermal micrometeroid garments and other insulations were evaluated. The relationship among sample thermal conductance, surface temperature, and compressive loads was empirically defined.

  19. Pulse voltage determination for electrostatic micro manipulation considering surface conductivity and adhesion of glass particle

    NASA Astrophysics Data System (ADS)

    Fujiwara, Ryo; Hemthavy, Pasomphone; Takahashi, Kunio; Saito, Shigeki

    2015-05-01

    A model with surface conductivity and adhesional force is proposed to investigate the mechanism for electrostatic micro manipulation of a dielectric object using a single probe. The manipulation system consists of three elements: a conductive probe as a manipulator, a conductive plate as a substrate, and a dielectric particle as the target object for manipulation. The particle can be successfully picked up/placed if a rectangular pulse voltage is applied between the probe and the plate. The reliability of the picking up/placing operation is improved by applying a pulse voltage that is determined by a theoretical model considering surface conductivity and adhesion. To verify the theoretical prediction, manipulation experiment is conducted using soda-lime glass particles with radii of 20 μm and 40 μm.

  20. Preliminary experimental evaluation of thermal conductivity of ceramic pebble beds

    NASA Astrophysics Data System (ADS)

    Aquaro, D.; Lo Frano, R.

    2014-04-01

    This paper illustrates the preliminary experimental tests for determining the effective thermal conductivity of ceramic pebble beds versus temperature and compression strains. Ceramic pebble beds are promising candidates to be used in breeding blankets for nuclear fusion reactor as breeder and neutron multiplier. The tests were performed with an experimental rig, built at the DICI-University of Pisa, which permits to determine the thermal conductivity of pebble beds in steady state conditions, at several temperatures and compression forces. The values of thermal conductivity of pebble beds are obtained as function of a known conductivity of an alumina disc. The assessment of the method has been performed determining the effective thermal conductivity of alumina pebbles beds of different diameters. Void fraction and compression strains are the parameters that mainly influence the variability of the thermal conductivity of the beds.

  1. Effective electrical and thermal conductivity of multifilament twisted superconductors

    NASA Astrophysics Data System (ADS)

    Chechetkin, V. R.

    2013-06-01

    The effective electrical and thermal conductivity of composite wire with twisted superconducting filaments embedded into normal metal matrix is calculated using the extension of Bruggeman method. The resistive conductivity of superconducting filaments is described in terms of symmetric tensor, whereas the conductivity of a matrix is assumed to be isotropic and homogeneous. The dependence of the resistive electrical conductivity of superconducting filaments on temperature, magnetic field, and current density is implied to be parametric. The resulting effective conductivity tensor proved to be non-diagonal and symmetric. The non-diagonal transverse-longitudinal components of effective electrical conductivity tensor are responsible for the redistribution of current between filaments. In the limits of high and low electrical conductivity of filaments the transverse effective conductivity tends to that of obtained previously by Carr. The effective thermal conductivity of composite wires is non-diagonal and radius-dependent even for the isotropic and homogeneous thermal conductivities of matrix and filaments.

  2. Experimental investigation of thermal conductance of finned tube contacts

    NASA Astrophysics Data System (ADS)

    Sheffield, J. W.; Wood, R. A.; Sauer, H. J., Jr.

    1989-01-01

    An experimental study was conducted to investigate the contact conductance of plate finned tubes. The basic theory of thermal contact conductance supports the use of measurable parameters including interference, fin spacing, fin thickness, tube hardness, and tube diameter as prediction parameters. Thirty-one coils were tested in a vacuum chamber. A correlation was developed that predicts the thermal contact conductance. The heat transfer results of the experimental study are presented.

  3. Measurement of the anisotropic thermal conductivity of the porcine cornea.

    PubMed

    Barton, Michael D; Trembly, B Stuart

    2013-10-01

    Accurate thermal models for the cornea of the eye support the development of thermal techniques for reshaping the cornea and other scientific purposes. Heat transfer in the cornea must be quantified accurately so that a thermal treatment does not destroy the endothelial layer, which cannot regenerate, and yet is responsible for maintaining corneal transparency. We developed a custom apparatus to measure the thermal conductivity of ex vivo porcine corneas perpendicular to the surface and applied a commercial apparatus to measure thermal conductivity parallel to the surface. We found that corneal thermal conductivity is 14% anisotropic at the normal state of corneal hydration. Small numbers of ex vivo feline and human corneas had a thermal conductivity perpendicular to the surface that was indistinguishable from the porcine corneas. Aqueous humor from ex vivo porcine, feline, and human eyes had a thermal conductivity nearly equal to that of water. Including the anisotropy of corneal thermal conductivity will improve the predictive power of thermal models of the eye. PMID:23933570

  4. Thermal conduction effects in human skin.

    PubMed

    Stoll, A M; Chianta, M A; Piergallini, J R

    1979-08-01

    To determine the maximum permissible temperature any material may attain without causing pain or burn on contact with bare skin, over 2000 observations were made of pain threshold during contact with materials at elevated temperatures. Six materials were used representing the full range of thermal properties from good conductors to good insulators. Time to pain threshold was converted to time to threshold blister on the basis of the relationship between pain and burn established earlier for radiant and for convective heating. Calculated times to blister were used to predict the material temperatures causative of "touch-burn". Experimentally produced threshold blisters at the predicted temperature-times verified the predictions. Graphs and equations were generated for determining safe temperatures for any material in contact with bare skin for 1-5 s solely from a knowledge of its thermal properties. Conversely, the thermal inertia (k rho c) of the optimal material for a specific use and skin contact can be predicted from a knowledge of the maximum material temperature and length of contact time anticipated. PMID:496745

  5. Superior thermal conductivity in suspended bilayer hexagonal boron nitride

    NASA Astrophysics Data System (ADS)

    Wang, Chengru; Guo, Jie; Dong, Lan; Aiyiti, Adili; Xu, Xiangfan; Li, Baowen

    2016-05-01

    We reported the basal-plane thermal conductivity in exfoliated bilayer hexagonal boron nitride h-BN that was measured using suspended prepatterned microstructures. The h-BN sample suitable for thermal measurements was fabricated by dry-transfer method, whose sample quality, due to less polymer residues on surfaces, is believed to be superior to that of PMMA-mediated samples. The measured room temperature thermal conductivity is around 484 Wm‑1K‑1(+141 Wm‑1K‑1/ ‑24 Wm‑1K‑1) which exceeds that in bulk h-BN, providing experimental observation of the thickness-dependent thermal conductivity in suspended few-layer h-BN.

  6. Thermal conductivity and other properties of cementitious grouts

    SciTech Connect

    Allan, M.

    1998-08-01

    The thermal conductivity and other properties cementitious grouts have been investigated in order to determine suitability of these materials for grouting vertical boreholes used with geothermal heat pumps. The roles of mix variables such as water/cement ratio, sand/cement ratio and superplasticizer dosage were measured. In addition to thermal conductivity, the cementitious grouts were also tested for bleeding, permeability, bond to HDPE pipe, shrinkage, coefficient of thermal expansion, exotherm, durability and environmental impact. This paper summarizes the results for selected grout mixes. Relatively high thermal conductivities were obtained and this leads to reduction in predicted bore length and installation costs. Improvements in shrinkage resistance and bonding were achieved.

  7. THERMAL CONDUCTIVITY AND OTHER PROPERTIES OF CEMENTITIOUS GROUTS

    SciTech Connect

    ALLAN,M.

    1998-05-01

    The thermal conductivity and other properties cementitious grouts have been investigated in order to determine suitability of these materials for grouting vertical boreholes used with geothermal heat pumps. The roles of mix variables such as water/cement ratio, sand/cement ratio and superplasticizer dosage were measured. In addition to thermal conductivity, the cementitious grouts were also tested for bleeding, permeability, bond to HDPE pipe, shrinkage, coefficient of thermal expansion, exotherm, durability and environmental impact. This paper summarizes the results for selected grout mixes. Relatively high thermal conductivities were obtained and this leads to reduction in predicted bore length and installation costs. Improvements in shrinkage resistance and bonding were achieved.

  8. Thermal conductivity of halide solid solutions: measurement and prediction.

    PubMed

    Gheribi, Aïmen E; Poncsák, Sándor; St-Pierre, Rémi; Kiss, László I; Chartrand, Patrice

    2014-09-14

    The composition dependence of the lattice thermal conductivity in NaCl-KCl solid solutions has been measured as a function of composition and temperature. Samples with systematically varied compositions were prepared and the laser flash technique was used to determine the thermal diffusivity from 373 K to 823 K. A theoretical model, based on the Debye approximation of phonon density of state (which contains no adjustable parameters) was used to predict the thermal conductivity of both stoichiometric compounds and fully disordered solid solutions. The predictions obtained with the model agree very well with our measurement. A general method for predicting the thermal conductivity of different halide systems is discussed. PMID:25217938

  9. High conductance thermal interface concept for space applications

    NASA Technical Reports Server (NTRS)

    Poulin, Elizabeth C.; Horan, D. C.

    1991-01-01

    An interface concept has been developed which produces high conductance at a thermal/mechanical joint without resorting to high clamping forces or potentially contaminating fillers such as thermal grease. This paper discusses the characteristics of several variations of the high conductance interface concept and compares them to those of existing interface concepts proposed for several Space Station applications. The application of the high conductance concept to thermal joints such as internal coldplate interfaces and external equipment module to heat acquisition plate interfaces would reduce the weight and complexity and increase the efficiency of the Space Station Thermal Management System.

  10. Coherent thermal conductance of 1-D photonic crystals

    NASA Astrophysics Data System (ADS)

    Tschikin, Maria; Ben-Abdallah, Philippe; Biehs, Svend-Age

    2012-10-01

    We present an exact calculation of coherent thermal conductance in 1-D multilayer photonic crystals using the S-matrix method. In particular, we study the thermal conductance in a bilayer structure of Si/vacuum or Al2O3/vacuum slabs by means of the exact radiative heat flux expression. Based on the results obtained for the Al2O3/vacuum structure we show by comparison with previous works that the material losses and (localized) surface modes supported by the inner layers play a fundamental role and cannot be omitted in the definition of thermal conductance. Our results could have significant implications in the conception of efficient thermal barriers.

  11. Depressing thermal conductivity of fullerene by caging rare gas

    NASA Astrophysics Data System (ADS)

    Li, Jian; Zheng, Dong-Qin; Zhong, Wei-Rong

    2016-01-01

    We have investigated the thermal conductivity of C60 and its derivatives caged with rare gas by using the nonequilibrium molecular dynamics method. It is reported that embedding C60 with different rare gas atoms has a significant impact on its thermal conductivity. We analyze the phenomenon through the phonon spectra of rare gas atom and the C-C bonds length of C60. When the number of atoms inside the C60 increases, the phonon spectra band width of rare gas expands and the length of C-C bonds becomes longer, which contributes to the depression of the thermal conductivity of C60. The method is applied to control the thermal conductivity of C60 chains, which maybe a kind of potential materials in thermal circuits. Our results also provide a controllable method for the thermal management in nanoscale materials.

  12. Low-Thermal-Conduction Links For Silicon Sensors

    NASA Technical Reports Server (NTRS)

    Mott, D. Brent

    1991-01-01

    Simple method of texturing surface of silicon reduces thermal conductivities of links in silicon x-ray calorimeters and infrared bolometers. Gives links high density of phonon scattering sites reducing conduction of heat. Links made shorter and more robust. Used in making x-ray calorimeters and infrared bolometers. Applicable to any microelectronic device in which high degree of thermal isolation needed.

  13. Role of Powder Granulometry and Substrate Topography in Adhesion Strength of Thermal Spray Coatings

    NASA Astrophysics Data System (ADS)

    Kromer, R.; Cormier, J.; Costil, S.

    2016-06-01

    APS coating is deposited with different treated surfaces to understand the effects of surface topography and particle sizes on adhesion bond strength. Grit blasting and laser surface texturing have been used to create a controlled roughness and controlled surface topography, respectively. Coating adhesion is mainly controlled by a mechanical interlocking mechanism. Fully melted Ni-Al powder fills the respected target surface with high-speed radial flow. Pores around central flattening splat are usually seen due to splash effects. Laser surface texturing has been used to study near interface coating depending on the target shape and in-contact area. Pull-off test results have revealed predominant correlation with powder, surface topography, and adhesion bond strength. Adhesion bond strength is linked to the in-contact area. So, coating adhesion might be optimized with powder granulometry. Pores near the interface would be localized zones for crack initiations and propagations. A mixed-mode failure has been reported for sharp interface (interface and inter-splats cracks) due to crack kicking out phenomena. Coating toughness near the interface is a key issue to maximize adhesion bond strength. Volume particles and topography parameters have been proposed to enhance adhesion bond strength for thermal spray process for small and large in-contact area.

  14. Role of Powder Granulometry and Substrate Topography in Adhesion Strength of Thermal Spray Coatings

    NASA Astrophysics Data System (ADS)

    Kromer, R.; Cormier, J.; Costil, S.

    2016-05-01

    APS coating is deposited with different treated surfaces to understand the effects of surface topography and particle sizes on adhesion bond strength. Grit blasting and laser surface texturing have been used to create a controlled roughness and controlled surface topography, respectively. Coating adhesion is mainly controlled by a mechanical interlocking mechanism. Fully melted Ni-Al powder fills the respected target surface with high-speed radial flow. Pores around central flattening splat are usually seen due to splash effects. Laser surface texturing has been used to study near interface coating depending on the target shape and in-contact area. Pull-off test results have revealed predominant correlation with powder, surface topography, and adhesion bond strength. Adhesion bond strength is linked to the in-contact area. So, coating adhesion might be optimized with powder granulometry. Pores near the interface would be localized zones for crack initiations and propagations. A mixed-mode failure has been reported for sharp interface (interface and inter-splats cracks) due to crack kicking out phenomena. Coating toughness near the interface is a key issue to maximize adhesion bond strength. Volume particles and topography parameters have been proposed to enhance adhesion bond strength for thermal spray process for small and large in-contact area.

  15. Methods of measuring adhesion for thermally grown oxide scales

    SciTech Connect

    Hou, P.Y.; Atkinson, A.

    1994-06-01

    High temperature alloys and coatings rely on the formation of adherent scales to protect against further oxidation, but scale spallation is often problematic. Despite the technical importance of the problem, ``practical adhesion``, which refers to the separation of the oxide from the metal, has mainly been treated qualitatively in the past. Various techniques now exist such that the subject can be assessed in quantitative or semi-quantitative terms. Some of the techniques are described in this paper, and their weakness and strength are discussed. The experimental methods addressed here include: tensile pulling, micro-indentation, scratch test, residual stress induced delamination, laser or shock wave induced spallation, double cantilever beam and several 4-point beam bending approaches. To date, there is not an universal, easy test for oxide adhesion measurement that can provide reproducible information on interfacial fracture energy for a variety of oxide/metal systems. Much experimentation is still needed to increase confidence in many of the existing tests, and the fundamental mechanics for some present techniques also require further development.

  16. Prediction of effective thermal conductivity of cellular ceramics

    SciTech Connect

    Fu, X.; Viskanta, R.; Gore, J.P.

    1998-02-01

    Two unit cell based models have been developed to predict the effective thermal conductivity of porous materials using the thermal-circuit method. The first unit cell is a cubic-shaped box. The second unit cell is formed by a solid cube which is voided centrally by a sphere. The model predictions of the effective thermal conductivity of cellular ceramics are compared with experimental data.

  17. Thermal conductivity of vertically aligned boron nitride nanotubes

    NASA Astrophysics Data System (ADS)

    Essedik Belkerk, Boubakeur; Achour, Amine; Zhang, Dongyan; Sahli, Salah; Djouadi, M.-Abdou; Khin Yap, Yoke

    2016-07-01

    For the first time, we report the thermal conductivity of vertically aligned boron nitride nanotube (BNNT) films produced by catalytic chemical vapor deposition. High-quality BNNTs were synthesized at 1200 °C on fused silica substrates precoated with Pt thin-film thermometers. The thermal conductivity of the BNNTs was measured at room temperature by using a pulsed photothermal technique. The apparent thermal conductivity of the BNNT coatings increased from 55 to 170 W m‑1 K‑1 when the thickness increased from 10 to 28 µm, while the thermal conductivity attained a value as high as 2400 W m‑1 K‑1. These results suggested that BNNTs, which are highly thermally conductive, but electrically insulating, are promising materials with unique properties.

  18. Thermal Conductivity of Alumina-reinforced Zirconia Composites

    NASA Technical Reports Server (NTRS)

    Bansal, Narottam P.

    2005-01-01

    10-mol% yttria-stabilized zirconia (10SZ) - alumina composites containing 0-30 mol% alumina were fabricated by hot pressing at 1500 C in vacuum. Thermal conductivity was determined at various temperatures using a steady-state laser heat flux technique. Thermal conductivity of the composites increased with increase in alumina content. Composites containing 0, 5, and 10-mol% alumina did not show any change in thermal conductivity with temperature. However, those containing 20 and 30-mol% alumina showed a decrease in thermal conductivity with increase in temperature. The measured values of thermal conductivity were in good agreement with those calculated from the Maxwell-Eucken model where one phase is uniformly dispersed within a second major continuous phase.

  19. Thermal Conductivity of Polyimide/Carbon Nanofiller Blends

    NASA Technical Reports Server (NTRS)

    Delozier, D. M.; Watson, K. A.; Ghose, S.; Working, D. C.; Connell, J. W.; Smith, J. G.; Sun, Y. P.; Lin, Y.

    2006-01-01

    Ultem(TM) was mixed with three different carbon-based nanofillers in efforts to increase the thermal conductivity of the polymer. After initial mixing, the nanocomposites were extruded or processed via the Laboratory Mixing Molder (LMM) process. High resolution scanning electron microscopy (HRSEM) revealed significant alignment of the nanofillers in the extruded samples. Thermal conductivity measurements were made both in the direction and perpendicular to the direction of alignment of nanofillers as well as for unaligned samples. It was found that the largest improvement in thermal conductivity was achieved in the case of aligned samples when the measurement was performed in the direction of alignment. Unaligned samples also showed a significant improvement in thermal conductivity and may be useful in applications when it is not possible to align the nanofiller. However the improvements in thermal conductivity did not approach those expected based on a rule of mixtures. This is likely due to poor phonon transfer through the matrix.

  20. Therma1 Conductivity and Durability of Advanced Thermal Barrier Coatings

    NASA Technical Reports Server (NTRS)

    Zhu, Dong-Ming; Miller, Robert A.

    2003-01-01

    Thermal barrier coatings (TBCs) will play a crucial role in advanced gas turbine engines because of their ability to further increase engine operating temperature and reduce cooling, thus helping to achieve engine emission and efficiency goals. Future TBCs must be designed with increased phase stability, lower thermal conductivity, and improved sintering and thermal stress resistance in order to effectively protect engine hot-section components. Advanced low conductivity TBCs are being developed at NASA by incorporating multi-component oxide dopants into zirconia-yttria or hafnia-yttria to promote the formation of thermodynamically stable defect clusters within the coating structures. This presentation will primarily focus on thermal conductivity and durability of the novel defect cluster thermal barrier coatings for turbine airfoil and combustor applications, determined by a unique CO2 laser heat-flux approach. The laser heat-flux testing approach emphasizes the real-time monitoring and assessment of the coating thermal conductivity under simulated engine temperature and thermal gradient conditions. The conductivity increase due to coating sintering (and/or phase change) and the conductivity decrease due to coating delamination have been determined under steady-state, cyclic, uniform or non-uniform heat-flux conditions. The coating radiation flux resistance has been evaluated by varying coating thermal gradients, and also by using a laser-heated radiative-flux source. Advanced multi-component TBC systems have been shown to have significantly reduced thermal conductivity and improved high temperature stability due to the nano-sized, low mobility defect clusters associated with the paired rare earth dopant additions. The effect of oxide defect cluster dopants on coating thermal conductivity, thermal stability and furnace cyclic durability will also be discussed. The current low conductivity TBC systems have demonstrated long-term cyclic durability at very high

  1. Adhesive Stretchable Printed Conductive Thin Film Patterns on PDMS Surface with an Atmospheric Plasma Treatment.

    PubMed

    Li, Chun-Yi; Liao, Ying-Chih

    2016-05-11

    In this study, a plasma surface modification with printing process was developed to fabricate printed flexible conductor patterns or devices directly on polydimethylsiloxane (PDMS) surface. An atmospheric plasma treatment was first used to oxidize the PDMS surface and create a hydrophilic silica surface layer, which was confirmed with photoelectron spectra. The plasma operating parameters, such as gas types and plasma powers, were optimized to obtain surface silica layers with the longest lifetime. Conductive paste with epoxy resin was screen-printed on the plasma-treated PDMS surface to fabricate flexible conductive tracks. As a result of the strong binding forces between epoxy resin and the silica surface layer, the printed patterns showed great adhesion on PDMS and were undamaged after several stringent adhesion tests. The printed conductive tracks showed strong mechanical stability and exhibited great electric conductivity under bending, twisting, and stretching conditions. Finally, a printed pressure sensor with good sensitivity and a fast response time was fabricated to demonstrate the capability of this method for the realization of printed electronic devices. PMID:27082455

  2. A theoretical model for lunar surface material thermal conductivity.

    NASA Technical Reports Server (NTRS)

    Khader, M. S.; Vachon, R. I.

    1973-01-01

    This paper presents a theoretical thermal conductivity model for the uppermost layer of lunar surface material under the lunar vacuum environment. The model assumes that the lunar soil can be simulated by spherical particles in contact with each other and that the effective thermal conductivity is a function of depth, temperature, porosity, particle dimension, and mechanical-thermal properties of the solid particles. Two modes of heat transport are considered, conduction and radiation - with emphasis on the contact resistance between particles. The model gives effective conductivity values that compare favorably with the experimental data from lunar surface samples obtained on Apollo 11 and 12 missions.

  3. Measurement of thermal conductivity in proton irradiated silicon

    SciTech Connect

    Marat Khafizov; Clarissa Yablinsky; Todd Allen; David Hurley

    2014-04-01

    We investigate the influence of proton irradiation on thermal conductivity in single crystal silicon. We apply laser based modulated thermoreflectance technique to extract the change in conductivity of the thin layer damaged by proton irradiation. Unlike time domain thermoreflectance techniques that require application of a metal film, we perform our measurement on uncoated samples. This provides greater sensitivity to the change in conductivity of the thin damaged layer. Using sample temperature as a parameter provides a means to deduce the primary defect structures that limit thermal transport. We find that under high temperature irradiation the degradation of thermal conductivity is caused primarily by extended defects.

  4. Injury and adhesion formation following ovarian wedge resection with different thermal surgical modalities.

    PubMed

    Bhatta, N; Isaacson, K; Flotte, T; Schiff, I; Anderson, R R

    1993-01-01

    The purpose of this study is to determine the role of bleeding, acute thermal damage, and charring in adhesion formation. Postoperative adhesions were compared following ovarian wedge resection in 48 rabbits using different lasers, electrosurgery, and scalpel. Twelve ovaries were sectioned per modality, in randomized pairs. Acute thermal injury as assessed by histology, bleeding, and charring differed among the modalities used. Adhesions were assessed 4 weeks later, by an investigator completely blinded of the treatment protocol. The adhesion scores were 11.6 +/- 8.0 with pulsed Er:YAG laser; 11.9 +/- 7.5 with scalpel; 8.3 +/- 9.3 with electrocautery; 6.7 +/- 8.8 with a continuous (c.w.) Nd:YAG laser; 5.3 +/- 4.8 with c.w. CO2 laser; 3.1 +/- 2.7 with pulsed CO2 laser; 1.7 +/- 1.8 with pulsed Ho:YAG laser; and 0.8 +/- 1.5 in the control (no resection) group. Ho:YAG, Nd:YAG, and electrocautery were completely hemostatic. Bleeding was minimal with the CO2 lasers. Er:YAG and scalpel caused maximum bleeding, requiring hemostatic measures to prevent exsanguination. Charring occurred with electrocautery, CO2 laser, and Nd:YAG laser. Bleeding and charring correlated with adhesion formation, but the histological depth of thermal damage did not. The Ho:YAG laser is a hemostatic, fiber-optic compatible laser causing significantly fewer adhesions (P < 0.04) than scalpel, electrocautery, Nd:YAG, Er:YAG, and c.w. CO2 lasers. Clinical use of the Ho:YAG laser, and the role of carbonization in promoting adhesions, deserve further study. PMID:8515673

  5. Neutrophil lipoxygenase metabolism and adhesive function following acute thermal injury.

    PubMed

    Damtew, B; Marino, J A; Fratianne, R B; Spagnuolo, P J

    1993-02-01

    Leukotrienes, especially leukotriene B4, are important modulators of various neutrophil functions including adherence and chemotaxis. In previous work, we demonstrated that neutrophil adherence to extracellular matrixes was diminished in the acute stages of burn injury. In this study, we demonstrated that neutrophil adhesion to human and bovine endothelium in the baseline state and after stimulation with leukotriene B4 is depressed markedly after burn injury. The defect in stimulated adherence to endothelium was not specific to leukotriene B4 because impaired adhesion was observed with n-formyl-methionyl-leucyl-phenylalanine and ionophore A23187 as well. Moreover, the adherence defect correlated with 95% and 81% decreases in the release of leukotriene B4 and 5-hydroxy-(6E,87,117,147)-eicosatetraenoic acid, respectively, from burn PMN treated with A23187. Burn neutrophils also released proportionately more byproducts of leukotriene B4 omega oxidation, particularly 20-COOH-leukotriene B4, than did control neutrophils. When examined 3 1/2 weeks after injury, abnormalities in neutrophil leukotriene B4 generation and the adherence of burn neutrophils had recovered to near normal values. To determine whether the decreased release of leukotriene B4 from burn neutrophils was due to increased degradation or diminished synthesis of leukotriene B4, we examined the degradation of exogenous tritiated leukotriene B4 as well as the production of leukotriene B4 from tritiated arachidonic acid in neutrophils. Burn neutrophils converted significantly greater quantities of tritiated leukotriene B4 to tritiated 20-COOH-leukotriene B4 and synthesized markedly less tritiated leukotriene B4 from tritiated arachidonic acid than did control neutrophils, suggesting that decreased leukotriene B4 release by burn neutrophils was the result of both enhanced degradation and decreased synthesis.(ABSTRACT TRUNCATED AT 250 WORDS) PMID:8381849

  6. Effect of Aggregation on Thermal Conduction in Colloidal Nanofluids

    SciTech Connect

    R Prasher; W Evans; J Fish; P Meakin; P Phelan; Pawel Keblinski

    2006-08-10

    Using effective medium theory we demonstrate that the thermal conductivity of nanofluids can be significantly enhanced by the aggregation of nanoparticles into clusters. The enhancement is based purely on conduction and does not require a novel mechanism. Predictions of the effective medium theory are in excellent agreement with detailed numerical calculations on model nanofluids involving fractal clusters and show the importance of cluster morphology on thermal conductivity enhancements.

  7. Acoustic transducer apparatus with reduced thermal conduction

    NASA Technical Reports Server (NTRS)

    Lierke, Ernst G. (Inventor); Leung, Emily W. (Inventor); Bhat, Balakrishna T. (Inventor)

    1990-01-01

    A horn is described for transmitting sound from a transducer to a heated chamber containing an object which is levitated by acoustic energy while it is heated to a molten state, which minimizes heat transfer to thereby minimize heating of the transducer, minimize temperature variation in the chamber, and minimize loss of heat from the chamber. The forward portion of the horn, which is the portion closest to the chamber, has holes that reduce its cross-sectional area to minimize the conduction of heat along the length of the horn, with the entire front portion of the horn being rigid and having an even front face to efficiently transfer high frequency acoustic energy to fluid in the chamber. In one arrangement, the horn has numerous rows of holes extending perpendicular to the length of horn, with alternate rows extending perpendicular to one another to form a sinuous path for the conduction of heat along the length of the horn.

  8. Steady heat conduction-based thermal conductivity measurement of single walled carbon nanotubes thin film using a micropipette thermal sensor

    NASA Astrophysics Data System (ADS)

    Shrestha, R.; Lee, K. M.; Chang, W. S.; Kim, D. S.; Rhee, G. H.; Choi, T. Y.

    2013-03-01

    In this paper, we describe the thermal conductivity measurement of single-walled carbon nanotubes thin film using a laser point source-based steady state heat conduction method. A high precision micropipette thermal sensor fabricated with a sensing tip size varying from 2 μm to 5 μm and capable of measuring thermal fluctuation with resolution of ±0.01 K was used to measure the temperature gradient across the suspended carbon nanotubes (CNT) film with a thickness of 100 nm. We used a steady heat conduction model to correlate the temperature gradient to the thermal conductivity of the film. We measured the average thermal conductivity of CNT film as 74.3 ± 7.9 W m-1 K-1 at room temperature.

  9. Steady heat conduction-based thermal conductivity measurement of single walled carbon nanotubes thin film using a micropipette thermal sensor.

    PubMed

    Shrestha, R; Lee, K M; Chang, W S; Kim, D S; Rhee, G H; Choi, T Y

    2013-03-01

    In this paper, we describe the thermal conductivity measurement of single-walled carbon nanotubes thin film using a laser point source-based steady state heat conduction method. A high precision micropipette thermal sensor fabricated with a sensing tip size varying from 2 μm to 5 μm and capable of measuring thermal fluctuation with resolution of ±0.01 K was used to measure the temperature gradient across the suspended carbon nanotubes (CNT) film with a thickness of 100 nm. We used a steady heat conduction model to correlate the temperature gradient to the thermal conductivity of the film. We measured the average thermal conductivity of CNT film as 74.3 ± 7.9 W m(-1) K(-1) at room temperature. PMID:23556837

  10. Highly anisotropic thermal conductivity of arsenene: An ab initio study

    NASA Astrophysics Data System (ADS)

    Zeraati, Majid; Vaez Allaei, S. Mehdi; Abdolhosseini Sarsari, I.; Pourfath, Mahdi; Donadio, Davide

    2016-02-01

    Elemental two-dimensional (2D) materials exhibit intriguing heat transport and phononic properties. Here we have investigated the lattice thermal conductivity of newly proposed arsenene, the 2D honeycomb structure of arsenic, using ab initio calculations. Solving the Boltzmann transport equation for phonons, we predict a highly anisotropic thermal conductivity of 30.4 and 7.8 W/mK along the zigzag and armchair directions, respectively, at room temperature. Our calculations reveal that phonons with mean free paths between 20 nm and 1 μ m provide the main contribution to the large thermal conductivity in the zigzag direction; mean free paths of phonons contributing to heat transport in the armchair directions range between 20 and 100 nm. The obtained anisotropic thermal conductivity and feasibility of synthesis, in addition to high electron mobility reported elsewhere, make arsenene a promising material for nanoelectronic applications and thermal management.

  11. The best nanoparticle size distribution for minimum thermal conductivity

    PubMed Central

    Zhang, Hang; Minnich, Austin J.

    2015-01-01

    Which sizes of nanoparticles embedded in a crystalline solid yield the lowest thermal conductivity? Nanoparticles have long been demonstrated to reduce the thermal conductivity of crystals by scattering phonons, but most previous works assumed the nanoparticles to have a single size. Here, we use optimization methods to show that the best nanoparticle size distribution to scatter the broad thermal phonon spectrum is not a similarly broad distribution but rather several discrete peaks at well-chosen nanoparticle radii. For SiGe, the best size distribution yields a thermal conductivity below that of amorphous silicon. Further, we demonstrate that a simplified distribution yields nearly the same low thermal conductivity and can be readily fabricated. Our work provides important insights into how to manipulate the full spectrum of phonons and will guide the design of more efficient thermoelectric materials. PMID:25757414

  12. High-resolution and high-conductive electrode fabrication on a low thermal resistance flexible substrate

    NASA Astrophysics Data System (ADS)

    Kang, Bongchul; Kno, Jinsung; Yang, Minyang

    2011-07-01

    Processes based on the liquid-state pattern transfer, like inkjet printing, have critical limitations including low resolution and low electrical conductivity when fabricating electrodes on low thermal resistance flexible substrates such as polyethylene terephthalate (PET). Those are due to the nonlinear transfer mechanism and the limit of the sintering temperature. Although the laser direct curing (LDC) of metallic inks is an alternative process to improve the resolution, it is also associated with the disadvantages of causing thermal damage to the polymer substrate. This paper suggests the laser induced pattern adhesion transfer method to fabricate electrodes of both high electrical conductivity and high resolution on a PET substrate. First, solid patterns are cost-effectively created by the LDC of the organometallic silver ink on a glass that is optically and thermally stable. The solid patterns sintered on the glass are transferred to the PET substrate by the photo-thermally generated adhesion force of the substrate. Therefore, we achieved electrodes with a minimum line width of 10 µm and a specific resistance of 3.6 μΩcm on the PET substrate. The patterns also showed high mechanical reliability.

  13. Conductive ink containing thermally exfoliated graphite oxide and method a conductive circuit using the same

    NASA Technical Reports Server (NTRS)

    Prud'Homme, Robert K. (Inventor); Aksay, Ilhan A. (Inventor)

    2011-01-01

    A conductive ink containing a conductive polymer, wherein the conductive polymer contains at least one polymer and a modified graphite oxide material, which is a thermally exfoliated graphite oxide with a surface area of from about 300 sq m/g to 2600 sq m/g, and it use in a method for making a conductive circuit.

  14. Computer Modeling of the Thermal Conductivity of Cometary Ice

    NASA Technical Reports Server (NTRS)

    Bunch, Theodore E.; Wilson, Michael A.; Pohorille, Andrew

    1998-01-01

    The main objective of this research was to estimate the thermal conductivity of cometry ices from computer simulations of model amorphous ices. This was divided into four specific tasks: (1) Generating samples of amorphous water ices at different microporosities; (2) Comparing the resulting molecular structures of the ices with experimental results, for those densities where data was available; (3) Calculating the thermal conductivities of liquid water and bulk amorphous ices and comparing these results with experimentally determined thermal conductivities; and (4) Investigating how the thermal conductivity of amorphous ice depends upon the microscopic porosity of the samples. The thermal conductivity was found to be only weakly dependent on the microstructure of the amorphous ice. In general, the amorphous ices were found to have thermal conductivities of the same order of magnitude as liquid water. This is in contradiction to recent experimental estimates of the thermal conductivity of amorphous ice, and it is suggested that the extremely low value obtained experimentally is due to larger-scale defects in the ice, such as cracks, but it is not an intrinsic property of the bulk amorphous ice.

  15. Fractal prediction model of thermal contact conductance of rough surfaces

    NASA Astrophysics Data System (ADS)

    Ji, Cuicui; Zhu, Hua; Jiang, Wei

    2013-01-01

    The thermal contact conductance problem is an important issue in studying the heat transfer of engineering surfaces, which has been widely studied since last few decades, and for predicting which many theoretical models have been established. However, the models which have been existed are lack of objectivity due to that they are mostly studied based on the statistical methodology characterization for rough surfaces and simple partition for the deformation formats of contact asperity. In this paper, a fractal prediction model is developed for the thermal contact conductance between two rough surfaces based on the rough surface being described by three-dimensional Weierstrass and Mandelbrot fractal function and assuming that there are three kinds of asperity deformation modes: elastic, elastoplastic and fully plastic. Influences of contact load and contact area as well as fractal parameters and material properties on the thermal contact conductance are investigated by using the presented model. The investigation results show that the thermal contact conductance increases with the increasing of the contact load and contact area. The larger the fractal dimension, or the smaller the fractal roughness, the larger the thermal contact conductance is. The thermal contact conductance increases with decreasing the ratio of Young's elastic modulus to the microhardness. The results obtained indicate that the proposed model can effectively predict the thermal contact conductance at the interface, which provide certain reference to the further study on the issue of heat transfer between contact surfaces.

  16. Thermal Conductivity of Quantum Wires with Surface Roughness

    NASA Astrophysics Data System (ADS)

    Hershfield, Selman; Muttalib, Khandker

    Quantum wires have been shown to have greatly reduced thermal conductivity compared to bulk systems because of the increased role of surface scattering. The lattice thermal conductance and conductivity is calculated in the harmonic approximation for a long quantum wire placed between two heat baths using the Landauer formula for phonons and a recursive Green function technique to compute the transmission probabilities. The width of the wires is varied in the transverse direction so as to have a root mean square value σ and correlation length L. As observed experimentally, we find that the thermal conductance is decreased with increasing σ and increased as L increases. The full scaling of the thermal conductance as a function of σ, L, the width and the length of the sample is discussed. The simulations are also compared to approximate techniques such as modeling the surfaces as having diffusive scattering.

  17. Extremes of heat conduction-Pushing the boundaries of the thermal conductivity of materials

    SciTech Connect

    Cahill, DG

    2012-09-12

    Thermal conductivity is a familiar property of materials: silver conducts heat well, and plastic does not. In recent years, an interdisciplinary group of materials scientists, engineers, physicists, and chemists have succeeded in pushing back long-established limits in the thermal conductivity of materials. Carbon nanotubes and graphene are at the high end of the thermal conductivity spectrum due to their high sound velocities and relative lack of processes that scatter phonons. Unfortunately, the superlative thermal properties of carbon nanotubes have not found immediate application in composites or interface materials because of difficulties in making good thermal contact with the nanotubes. At the low end of the thermal conductivity spectrum, solids that combine order and disorder in the random stacking of two-dimensional crystalline sheets, so-called "disordered layered crystals," show a thermal conductivity that is only a factor of 2 larger than air. The cause of this low thermal conductivity may be explained by the large anisotropy in elastic constants that suppresses the density of phonon modes that propagate along the soft direction. Low-dimensional quantum magnets demonstrate that electrons and phonons are not the only significant carriers of heat. Near room temperature, the spin thermal conductivity of spin-ladders is comparable to the electronic thermal conductivities of metals. Our measurements of nanoscale thermal transport properties employ a variety of ultrafast optical pump-probe metrology tools that we have developed over the past several years. We are currently working to extend these techniques to high pressures (60 GPa), high magnetic fields (5 T), and high temperatures (1000 K).

  18. Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives

    NASA Astrophysics Data System (ADS)

    Wu, Haoyi; Chiang, Sum Wai; Lin, Wei; Yang, Cheng; Li, Zhuo; Liu, Jingping; Cui, Xiaoya; Kang, Feiyu; Wong, Ching Ping

    2014-09-01

    Direct printing nanoparticle-based conductive inks onto paper substrates has encountered difficulties e.g. the nanoparticles are prone to penetrate into the pores of the paper and become partially segmented, and the necessary low-temperature-sintering process is harmful to the dimension-stability of paper. Here we prototyped the paper-based circuit substrate in combination with printed thermoplastic electrically conductive adhesives (ECA), which takes the advantage of the capillarity of paper and thus both the conductivity and mechanical robustness of the printed circuitsweredrastically improved without sintering process. For instance, the electrical resistivity of the ECA specimen on a pulp paper (6 × 10-5Ω.cm, with 50 wt% loading of Ag) was only 14% of that on PET film than that on PET film. This improvement has been found directly related to the sizing degree of paper, in agreement with the effective medium approximation simulation results in this work. The thermoplastic nature also enables excellent mechanical strength of the printed ECA to resist repeated folding. Considering the generality of the process and the wide acceptance of ECA technique in the modern electronic packages, this method may find vast applications in e.g. circuit boards, capacitive touch pads, and radio frequency identification antennas, which have been prototyped in the manuscript.

  19. Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives

    PubMed Central

    Wu, Haoyi; Chiang, Sum Wai; Lin, Wei; Yang, Cheng; Li, Zhuo; Liu, Jingping; Cui, Xiaoya; Kang, Feiyu; Wong, Ching Ping

    2014-01-01

    Direct printing nanoparticle-based conductive inks onto paper substrates has encountered difficulties e.g. the nanoparticles are prone to penetrate into the pores of the paper and become partially segmented, and the necessary low-temperature-sintering process is harmful to the dimension-stability of paper. Here we prototyped the paper-based circuit substrate in combination with printed thermoplastic electrically conductive adhesives (ECA), which takes the advantage of the capillarity of paper and thus both the conductivity and mechanical robustness of the printed circuitsweredrastically improved without sintering process. For instance, the electrical resistivity of the ECA specimen on a pulp paper (6 × 10−5Ω·cm, with 50 wt% loading of Ag) was only 14% of that on PET film than that on PET film. This improvement has been found directly related to the sizing degree of paper, in agreement with the effective medium approximation simulation results in this work. The thermoplastic nature also enables excellent mechanical strength of the printed ECA to resist repeated folding. Considering the generality of the process and the wide acceptance of ECA technique in the modern electronic packages, this method may find vast applications in e.g. circuit boards, capacitive touch pads, and radio frequency identification antennas, which have been prototyped in the manuscript. PMID:25182052

  20. Low temperature thermal hall conductivity of a nodal chiral superconductor

    NASA Astrophysics Data System (ADS)

    Yip, Sungkit

    2016-08-01

    Motivated by Sr2RuO4, we consider a chiral superconductor where the gap is strongly suppressed along certain momentum directions. We evaluate the thermal Hall conductivity in the gapless regime, i.e., at low temperature compared with the impurity band width γ, taking the simplest model of isotropic impurity scattering. We find that, under favorable circumstances, this thermal Hall conductivity can be quite significant and is smaller than the diagonal component (the universal thermal conductivity) only by a factor of 1/{ln}(2{{{Δ }}}M/γ ), where {{{Δ }}}M is the maximum gap.

  1. A thermal conductivity cell for small powdered samples.

    NASA Technical Reports Server (NTRS)

    Cremers, C. J.

    1971-01-01

    A thermal conductivity cell is described for making measurements of the thermal conductivity and thermal diffusivity of small samples of powdered dielectric materials. The principle used is that of the line heat source. A novel way is described for applying this method so that much smaller samples than normal may be tested. This size requirement is necessary for investigations involving limited samples as does the Lunar Science Program. The method is checked by measuring the conductivity of standard samples and comparing the results with those found in the literature.

  2. Mechanisms and models of effective thermal conductivities of nanofluids.

    SciTech Connect

    Yu, W.; France, D. M.; Singh, D.; Timofeeva, E. V.; Smith, D. S.; Routbort, J. L.; Univ. of Illinois

    2010-08-01

    The physical mechanisms and mathematical models of the effective thermal conductivities of nanofluids have long been of interest to the nanofluid research community because the effective thermal conductivities of nanofluids cannot generally be fully explained and predicted by classical effective medium theories. This review article summarizes considerable progress made on this topic. Specifically, the physical mechanisms and mathematical models of the effective thermal conductivities of nanofluids are reviewed, the potential contributions of those physical mechanisms are evaluated, and the comparisons of the theoretical predictions and experimental data are presented along with opportunities for future research.

  3. Thermal conductivity of mechanically joined semiconducting/metal nanomembrane superlattices.

    PubMed

    Grimm, Daniel; Wilson, Richard B; Teshome, Bezuayehu; Gorantla, Sandeep; Rümmeli, Mark H; Bublat, Thomas; Zallo, Eugenio; Li, Guodong; Cahill, David G; Schmidt, Oliver G

    2014-05-14

    The decrease of thermal conductivity is crucial for the development of efficient thermal energy converters. Systems composed of a periodic set of very thin layers show among the smallest thermal conductivities reported to-date. Here, we fabricate in an unconventional but straightforward way hybrid superlattices consisting of a large number of nanomembranes mechanically stacked on top of each other. The superlattices can consist of an arbitrary composition of n- or p-type doped single-crystalline semiconductors and a polycrystalline metal layer. These hybrid multilayered systems are fabricated by taking advantage of the self-rolling technique. First, differentially strained nanomembranes are rolled into three-dimensional microtubes with multiple windings. By applying vertical pressure, the tubes are then compressed and converted into a planar hybrid superlattice. The thermal measurements show a substantial reduction of the cross-sectional heat transport through the nanomembrane superlattice compared to a single nanomembrane layer. Time-domain thermoreflectance measurements yield thermal conductivity values below 2 W m(-1) K(-1). Compared to bulk values, this represents a reduction of 2 orders of magnitude by the incorporation of the mechanically joined interfaces. The scanning thermal atomic force microscopy measurements support the observation of reduced thermal transport on top of the superlattices. In addition, small defects with a spatial resolution of ∼100 nm can be resolved in the thermal maps. The low thermal conductivity reveals the potential of this approach to fabricate miniaturized on-chip solutions for energy harvesters in, e.g., microautonomous systems. PMID:24738656

  4. In-Pile Thermal Conductivity Measurement Method for Nuclear Fuels

    SciTech Connect

    Joy L. Rempe; Brandon Fox; Heng Ban; Joshua E. Daw; Darrell L. Knudson; Keith G. Condie

    2009-08-01

    Thermophysical properties of advanced nuclear fuels and materials during irradiation must be known prior to their use in existing, advanced, or next generation reactors. Thermal conductivity is one of the most important properties for predicting fuel and material performance. A joint Utah State University (USU) / Idaho National Laboratory (INL) project, which is being conducted with assistance from the Institute for Energy Technology at the Norway Halden Reactor Project, is investigating in-pile fuel thermal conductivity measurement methods. This paper focuses on one of these methods – a multiple thermocouple method. This two-thermocouple method uses a surrogate fuel rod with Joule heating to simulate volumetric heat generation to gain insights about in-pile detection of thermal conductivity. Preliminary results indicated that this method can measure thermal conductivity over a specific temperature range. This paper reports the thermal conductivity values obtained by this technique and compares these values with thermal property data obtained from standard thermal property measurement techniques available at INL’s High Test Temperature Laboratory. Experimental results and material properties data are also compared to finite element analysis results.

  5. Remarkable reduction of thermal conductivity in phosphorene phononic crystal

    NASA Astrophysics Data System (ADS)

    Xu, Wen; Zhang, Gang

    2016-05-01

    Phosphorene has received much attention due to its interesting physical and chemical properties, and its potential applications such as thermoelectricity. In thermoelectric applications, low thermal conductivity is essential for achieving a high figure of merit. In this work, we propose to reduce the thermal conductivity of phosphorene by adopting the phononic crystal structure, phosphorene nanomesh. With equilibrium molecular dynamics simulations, we find that the thermal conductivity is remarkably reduced in the phononic crystal. Our analysis shows that the reduction is due to the depressed phonon group velocities induced by Brillouin zone folding, and the reduced phonon lifetimes in the phononic crystal. Interestingly, it is found that the anisotropy ratio of thermal conductivity could be tuned by the ‘non-square’ pores in the phononic crystal, as the phonon group velocities in the direction with larger projection of pores is more severely suppressed, leading to greater reduction of thermal conductivity in this direction. Our work provides deep insight into thermal transport in phononic crystals and proposes a new strategy to reduce the thermal conductivity of monolayer phosphorene.

  6. Remarkable reduction of thermal conductivity in phosphorene phononic crystal.

    PubMed

    Xu, Wen; Zhang, Gang

    2016-05-01

    Phosphorene has received much attention due to its interesting physical and chemical properties, and its potential applications such as thermoelectricity. In thermoelectric applications, low thermal conductivity is essential for achieving a high figure of merit. In this work, we propose to reduce the thermal conductivity of phosphorene by adopting the phononic crystal structure, phosphorene nanomesh. With equilibrium molecular dynamics simulations, we find that the thermal conductivity is remarkably reduced in the phononic crystal. Our analysis shows that the reduction is due to the depressed phonon group velocities induced by Brillouin zone folding, and the reduced phonon lifetimes in the phononic crystal. Interestingly, it is found that the anisotropy ratio of thermal conductivity could be tuned by the 'non-square' pores in the phononic crystal, as the phonon group velocities in the direction with larger projection of pores is more severely suppressed, leading to greater reduction of thermal conductivity in this direction. Our work provides deep insight into thermal transport in phononic crystals and proposes a new strategy to reduce the thermal conductivity of monolayer phosphorene. PMID:27033566

  7. Predicting lattice thermal conductivity with help from ab initio methods

    NASA Astrophysics Data System (ADS)

    Broido, David

    2015-03-01

    The lattice thermal conductivity is a fundamental transport parameter that determines the utility a material for specific thermal management applications. Materials with low thermal conductivity find applicability in thermoelectric cooling and energy harvesting. High thermal conductivity materials are urgently needed to help address the ever-growing heat dissipation problem in microelectronic devices. Predictive computational approaches can provide critical guidance in the search and development of new materials for such applications. Ab initio methods for calculating lattice thermal conductivity have demonstrated predictive capability, but while they are becoming increasingly efficient, they are still computationally expensive particularly for complex crystals with large unit cells . In this talk, I will review our work on first principles phonon transport for which the intrinsic lattice thermal conductivity is limited only by phonon-phonon scattering arising from anharmonicity. I will examine use of the phase space for anharmonic phonon scattering and the Grüneisen parameters as measures of the thermal conductivities for a range of materials and compare these to the widely used guidelines stemming from the theory of Liebfried and Schölmann. This research was supported primarily by the NSF under Grant CBET-1402949, and by the S3TEC, an Energy Frontier Research Center funded by the US DOE, office of Basic Energy Sciences under Award No. DE-SC0001299.

  8. Processing dependent thermal conductivity of nanoporous silica xerogel films

    NASA Astrophysics Data System (ADS)

    Jain, Anurag; Rogojevic, Svetlana; Ponoth, Shom; Gill, William N.; Plawsky, Joel L.; Simonyi, Eva; Chen, Shyng-Tsong; Ho, P. S.

    2002-03-01

    Sintered xerogel films (porous SiO2) show a much higher thermal conductivity than other low dielectric constant (low-K) materials available for the same value of K. The thermal conductivity of xerogels which we have processed using different methods is compared with that of other low-K materials such as silica hybrid (silsesquioxanes) and polymeric low-K materials. The methods used were: (1) single solvent (ethanol) method, (2) binary solvent (mixture of ethanol and ethylene glycol) method, (3) sintering. For the xerogel films, we show that process history is as important as the chemistry of the solid matrix or the porosity in determining the thermal conductivity. The thermal conductivity, measured by the 3-ω method or the photothermal deflection method, is affected by phonon scattering, which in turn is effected by the size and distribution of pores and particles and the presence of imperfections such as interfaces, substituted chemical species, impurities, microcracks, and microporosity. The thermal conductivity extrapolated to zero porosity for porous sintered xerogel films approaches that of thermally grown SiO2 indicating the least phonon scattering of all processing methods. For these films, the elastic modulus is proportional to thermal conductivity squared, in agreement with theories developed for materials with few defects and a connected matrix.

  9. Fabrication and Characterization of a Conduction Cooled Thermal Neutron Filter

    SciTech Connect

    Heather Wampler; Adam Gerth; Heng Ban; Donna Post Guillen; Douglas Porter; Cynthia Papesch

    2010-06-01

    Installation of a conduction cooled thermal (low-energy) neutron filter in an existing domestic test reactor would provide the U.S. the capability to test new reactor fuels and materials for advanced fast (high-energy) reactor concepts. A composite consisting of Al3Hf-Al has been proposed for the neutron filter due to both the neutron filtering properties of hafnium and the conducting capabilities of aluminum. Knowledge of the thermal conductivity of the Al3Hf-Al composite is essential for the design of the filtering system. The present objectives are to identify a suitable fabrication technique and to measure the thermophysical properties of the Al3Hf intermetallic, which has not been done previous to this study. A centrifugal casting method was used to prepare samples of Al3Hf. X-ray diffraction and Rietveld analysis were conducted to determine the structural make-up of each of the samples. Thermophysical properties were measured as follows: specific heat by a differential scanning calorimeter (DSC), thermal diffusivity by a laser flash thermal diffusivity measuring system, thermal expansion by a dilatometer, and thermal conductivity was calculated based on the previous measurements. All measurements were acquired over a temperature range of 90°C - 375°C with some measurements outside these bounds. The average thermal conductivity of the intermetallic Al3Hf (~7 at.% Hf) was found to be ~ 41 W/m-K for the given temperature range. This information fills a knowledge gap in the thermophysical properties of the intermetallic Al3Hf with the specified percentage of hafnium. A model designed to predict composite properties was used to calculate a thermal conductivity of ~177 W/m-K for an Al3Hf-Al composite with 23 vol% Al3Hf. This calculation was based upon the average thermal conductivity of Al3Hf over the specified temperature range.

  10. Submicron Mapping of Thermal Conductivity of Thermoelectric Thin Films

    NASA Astrophysics Data System (ADS)

    Lo, Hsinyi; Ram, Rajeev J.

    2012-06-01

    A tool for evaluating thin-film thermal conductivity to submicron spatial resolution has been developed. The micro-instrumentation utilizes the thermoreflectance (TR) technique to characterize thermal conductivity and material uniformity. The instrument consists of a heating element for creating temperature gradients and an Invar bar with in situ temperature monitoring for heat flux measurements. The thin-film sample is sandwiched between the heater and Invar bar while a microscope is used to direct light onto a cross-section of the sample and reflected light is collected with a camera. By using this technique, we can achieve submicron spatial resolution for thermal conductivity and eliminate contributions from thermal contact resistance, thereby also eliminating the need for sample preparation other than cleaving. The method offers temperature resolution of 10 mK, spatial resolution of 200 nm, and thermal conductivity measurement with 0.01 ± 0.001 W/mK resolution. The thermal conductivity of a 0.6% ErAs:InGaAlAs thermoelectric (TE) element, prepared by molecular beam epitaxy (MBE) growth, obtained with the new instrument is 2.3 W/mK, while the average thermal conductivity obtained with the 3-omega method is 2.5 W/mK. Energy-dispersive x-ray (EDX) spectroscopy is also used to prove that the elemental composition has uniformity consistent with the material variation observed by the TR technique. Moreover, a temperature profile across a 0.6% ErAs:InGaAlAs TE element on InP substrate is imaged. Two different slopes, corresponding to different thermal conductivities, have been observed, showing that the thermal conductivity of the TE element is lower than that of the InP substrate as expected.

  11. High performance low cost interconnections for flip chip attachment with electrically conductive adhesive. Final report

    SciTech Connect

    1998-05-01

    This final report is a compilation of final reports from each of the groups participating in the program. The main three groups involved in this effort are the Thomas J. Watson Research Center of IBM Corporation in Yorktown Heights, New York, Assembly Process Design of IBM Corporation in Endicott, New York, and SMT Laboratory of Universal Instruments Corporation in Binghamton, New York. The group at the research center focused on the conductive adhesive materials development and characterization. The group in process development focused on processing of the Polymer-Metal-Solvent Paste (PMSP) to form conductive adhesive bumps, formation of the Polymer-Metal Composite (PMC) on semiconductor devices and study of the bonding process to circuitized organic carriers, and the long term durability and reliability of joints formed using the process. The group at Universal Instruments focused on development of an equipment set and bonding parameters for the equipment to produce bond assembly tooling. Reports of each of these individual groups are presented here reviewing their technical efforts and achievements.

  12. Contact Resistance and Metallurgical Connections Between Silver Coated Polymer Particles in Isotropic Conductive Adhesives

    NASA Astrophysics Data System (ADS)

    Pettersen, Sigurd R.; Kristiansen, Helge; Nagao, Shijo; Helland, Susanne; Njagi, John; Suganuma, Katsuaki; Zhang, Zhiliang; He, Jianying

    2016-04-01

    Recently, there has been an increasing interest in silver thin film coated polymer spheres as conductive fillers in isotropic conductive adhesives (ICAs). Such ICAs yield resistivities similar to conventional silver flake based ICAs while requiring only a fraction of the silver content. In this work, effects of the nanostructure of silver thin films on inter-particle contact resistance were investigated. The electrical resistivity of ICAs with similar particle content was shown to decrease with increasing coating thickness. Scanning electron micrographs of ion milled cross-sections revealed that the silver coatings formed continuous metallurgical connections at the contacts between the filler particles after adhesive curing at 150°C. The electrical resistivity decreased for all samples after environmental treatment for 3 weeks at 85°C/85% relative humidity. It was concluded that after the metallurgical connections formed, the bulk resistance of these ICAs were no longer dominated by the contact resistance, but by the geometry and nanostructure of the silver coatings. A figure of merit (FoM) was defined based on the ratio between bulk silver resistivity and the ICA resistivity, and this showed that although the resistivity was lowest in the ICAs containing the most silver, the volume of silver was more effectively used in the ICAs with intermediate silver contents. This was attributed to a size effect due to smaller grains in the thickest coating.

  13. Extraordinarily high conductivity of flexible adhesive films by hybrids of silver nanoparticle-nanowires.

    PubMed

    Ajmal, C Muhammed; Menamparambath, Mini Mol; Choi, Hyouk Ryeol; Baik, Seunghyun

    2016-06-01

    Highly conductive flexible adhesive (CFA) film was developed using micro-sized silver flakes (primary fillers), hybrids of silver nanoparticle-nanowires (secondary fillers) and nitrile butadiene rubber. The hybrids of silver nanoparticle-nanowires were synthesized by decorating silver nanowires with silver nanoparticle clusters using bifunctional cysteamine as a linker. The dispersion in ethanol was excellent for several months. Silver nanowires constructed electrical networks between the micro-scale silver flakes. The low-temperature surface sintering of silver nanoparticles enabled effective joining of silver nanowires to silver flakes. The hybrids of silver nanoparticle-nanowires provided a greater maximum conductivity (54 390 S cm(-1)) than pure silver nanowires, pure multiwalled carbon nanotubes, and multiwalled carbon nanotubes decorated with silver nanoparticles in nitrile butadiene rubber matrix. The resistance change was smallest upon bending when the hybrids of silver nanoparticle-nanowires were employed. The adhesion of the film on polyethylene terephthalate substrate was excellent. Light emitting diodes were successfully wired to the CFA circuit patterned by the screen printing method for application demonstration. PMID:27109551

  14. Contact Resistance and Metallurgical Connections Between Silver Coated Polymer Particles in Isotropic Conductive Adhesives

    NASA Astrophysics Data System (ADS)

    Pettersen, Sigurd R.; Kristiansen, Helge; Nagao, Shijo; Helland, Susanne; Njagi, John; Suganuma, Katsuaki; Zhang, Zhiliang; He, Jianying

    2016-07-01

    Recently, there has been an increasing interest in silver thin film coated polymer spheres as conductive fillers in isotropic conductive adhesives (ICAs). Such ICAs yield resistivities similar to conventional silver flake based ICAs while requiring only a fraction of the silver content. In this work, effects of the nanostructure of silver thin films on inter-particle contact resistance were investigated. The electrical resistivity of ICAs with similar particle content was shown to decrease with increasing coating thickness. Scanning electron micrographs of ion milled cross-sections revealed that the silver coatings formed continuous metallurgical connections at the contacts between the filler particles after adhesive curing at 150°C. The electrical resistivity decreased for all samples after environmental treatment for 3 weeks at 85°C/85% relative humidity. It was concluded that after the metallurgical connections formed, the bulk resistance of these ICAs were no longer dominated by the contact resistance, but by the geometry and nanostructure of the silver coatings. A figure of merit (FoM) was defined based on the ratio between bulk silver resistivity and the ICA resistivity, and this showed that although the resistivity was lowest in the ICAs containing the most silver, the volume of silver was more effectively used in the ICAs with intermediate silver contents. This was attributed to a size effect due to smaller grains in the thickest coating.

  15. Extraordinarily high conductivity of flexible adhesive films by hybrids of silver nanoparticle–nanowires

    NASA Astrophysics Data System (ADS)

    Muhammed Ajmal, C.; Mol Menamparambath, Mini; Ryeol Choi, Hyouk; Baik, Seunghyun

    2016-06-01

    Highly conductive flexible adhesive (CFA) film was developed using micro-sized silver flakes (primary fillers), hybrids of silver nanoparticle–nanowires (secondary fillers) and nitrile butadiene rubber. The hybrids of silver nanoparticle–nanowires were synthesized by decorating silver nanowires with silver nanoparticle clusters using bifunctional cysteamine as a linker. The dispersion in ethanol was excellent for several months. Silver nanowires constructed electrical networks between the micro-scale silver flakes. The low-temperature surface sintering of silver nanoparticles enabled effective joining of silver nanowires to silver flakes. The hybrids of silver nanoparticle–nanowires provided a greater maximum conductivity (54 390 S cm‑1) than pure silver nanowires, pure multiwalled carbon nanotubes, and multiwalled carbon nanotubes decorated with silver nanoparticles in nitrile butadiene rubber matrix. The resistance change was smallest upon bending when the hybrids of silver nanoparticle–nanowires were employed. The adhesion of the film on polyethylene terephthalate substrate was excellent. Light emitting diodes were successfully wired to the CFA circuit patterned by the screen printing method for application demonstration.

  16. Ultralow thermal conductivity in highly anion-defective aluminates.

    PubMed

    Wan, Chunlei; Qu, Zhixue; He, Yong; Luan, Dong; Pan, Wei

    2008-08-22

    Ultralow thermal conductivity (1.1 W/m.K, 1000 degrees C) in anion-deficient Ba2RAlO5 (R=Dy, Er, Yb) compounds was reported. The low thermal conductivity was then analyzed by kinetic theory. The highly defective structure of Ba2RAlO5 results in weak atomic bond strength and low sound speeds, and phonon scattering by large concentration of oxygen vacancies reduces the phonon mean free path to the order of interatomic distance. Ba2DyAlO5 exhibits the shortest phonon mean free path and lowest thermal conductivity among the three compositions investigated, which can be attributed to additional phonon scattering by DyO6 octahedron tilting as a result of a low tolerance factor. The Ba2RAlO5 (R=Dy, Er, Yb) compounds have shown great potential in high-temperature thermal insulation applications, particularly as a thermal barrier coating material. PMID:18764638

  17. Engineering thermal conductance using a two-dimensional phononic crystal

    PubMed Central

    Zen, Nobuyuki; Puurtinen, Tuomas A.; Isotalo, Tero J.; Chaudhuri, Saumyadip; Maasilta, Ilari J.

    2014-01-01

    Controlling thermal transport has become relevant in recent years. Traditionally, this control has been achieved by tuning the scattering of phonons by including various types of scattering centres in the material (nanoparticles, impurities, etc). Here we take another approach and demonstrate that one can also use coherent band structure effects to control phonon thermal conductance, with the help of periodically nanostructured phononic crystals. We perform the experiments at low temperatures below 1 K, which not only leads to negligible bulk phonon scattering, but also increases the wavelength of the dominant thermal phonons by more than two orders of magnitude compared to room temperature. Thus, phononic crystals with lattice constants ≥1 μm are shown to strongly reduce the thermal conduction. The observed effect is in quantitative agreement with the theoretical calculation presented, which accurately determined the ballistic thermal conductance in a phononic crystal device. PMID:24647049

  18. Indirect measurement of thermal conductivity in silicon nanowires

    SciTech Connect

    Pennelli, Giovanni Nannini, Andrea; Macucci, Massimo

    2014-02-28

    We report indirect measurements of thermal conductivity in silicon nanostructures. We have exploited a measurement technique based on the Joule self-heating of silicon nanowires. A standard model for the electron mobility has been used to determine the temperature through the accurate measurement of the nanowire resistance. We have applied this technique to devices fabricated with a top-down process that yields nanowires together with large silicon areas used both as electrical and as thermal contacts. As there is crystalline continuity between the nanowires and the large contact areas, our thermal conductivity measurements are not affected by any temperature drop due to the contact thermal resistance. Our results confirm the observed reduction of thermal conductivity in nanostructures and are comparable with those previously reported in the literature, achieved with more complex measurement techniques.

  19. Quantifying Molecular-Level Cell Adhesion on Electroactive Conducting Polymers using Electrochemical-Single Cell Force Spectroscopy

    NASA Astrophysics Data System (ADS)

    Zhang, Hongrui; Molino, Paul J.; Wallace, Gordon G.; Higgins, Michael J.

    2015-09-01

    Single Cell Force Spectroscopy was combined with Electrochemical-AFM to quantify the adhesion between live single cells and conducting polymers whilst simultaneously applying a voltage to electrically switch the polymer from oxidized to reduced states. The cell-conducting polymer adhesion represents the non-specific interaction between cell surface glycocalyx molecules and polymer groups such as sulfonate and dodecylbenzene groups, which rearrange their orientation during electrical switching. Single cell adhesion significantly increases as the polymer is switched from an oxidized to fully reduced state, indicating stronger cell binding to sulfonate groups as opposed to hydrophobic groups. This increase in single cell adhesion is concomitant with an increase in surface hydrophilicity and uptake of cell media, driven by cation movement, into the polymer film during electrochemical reduction. Binding forces between the glycocalyx and polymer surface are indicative of molecular-level interactions and during electrical stimulation there is a decrease in both the binding force and stiffness of the adhesive bonds. The study provides insight into the effects of electrochemical switching on cell adhesion at the cell-conducting polymer interface and is more broadly applicable to elucidating the binding of cell adhesion molecules in the presence of electrical fields and directly at electrode interfaces.

  20. Quantifying Molecular-Level Cell Adhesion on Electroactive Conducting Polymers using Electrochemical-Single Cell Force Spectroscopy.

    PubMed

    Zhang, Hongrui; Molino, Paul J; Wallace, Gordon G; Higgins, Michael J

    2015-01-01

    Single Cell Force Spectroscopy was combined with Electrochemical-AFM to quantify the adhesion between live single cells and conducting polymers whilst simultaneously applying a voltage to electrically switch the polymer from oxidized to reduced states. The cell-conducting polymer adhesion represents the non-specific interaction between cell surface glycocalyx molecules and polymer groups such as sulfonate and dodecylbenzene groups, which rearrange their orientation during electrical switching. Single cell adhesion significantly increases as the polymer is switched from an oxidized to fully reduced state, indicating stronger cell binding to sulfonate groups as opposed to hydrophobic groups. This increase in single cell adhesion is concomitant with an increase in surface hydrophilicity and uptake of cell media, driven by cation movement, into the polymer film during electrochemical reduction. Binding forces between the glycocalyx and polymer surface are indicative of molecular-level interactions and during electrical stimulation there is a decrease in both the binding force and stiffness of the adhesive bonds. The study provides insight into the effects of electrochemical switching on cell adhesion at the cell-conducting polymer interface and is more broadly applicable to elucidating the binding of cell adhesion molecules in the presence of electrical fields and directly at electrode interfaces. PMID:26335299

  1. Quantifying Molecular-Level Cell Adhesion on Electroactive Conducting Polymers using Electrochemical-Single Cell Force Spectroscopy

    PubMed Central

    Zhang, Hongrui; Molino, Paul J.; Wallace, Gordon G.; Higgins, Michael J.

    2015-01-01

    Single Cell Force Spectroscopy was combined with Electrochemical-AFM to quantify the adhesion between live single cells and conducting polymers whilst simultaneously applying a voltage to electrically switch the polymer from oxidized to reduced states. The cell-conducting polymer adhesion represents the non-specific interaction between cell surface glycocalyx molecules and polymer groups such as sulfonate and dodecylbenzene groups, which rearrange their orientation during electrical switching. Single cell adhesion significantly increases as the polymer is switched from an oxidized to fully reduced state, indicating stronger cell binding to sulfonate groups as opposed to hydrophobic groups. This increase in single cell adhesion is concomitant with an increase in surface hydrophilicity and uptake of cell media, driven by cation movement, into the polymer film during electrochemical reduction. Binding forces between the glycocalyx and polymer surface are indicative of molecular-level interactions and during electrical stimulation there is a decrease in both the binding force and stiffness of the adhesive bonds. The study provides insight into the effects of electrochemical switching on cell adhesion at the cell-conducting polymer interface and is more broadly applicable to elucidating the binding of cell adhesion molecules in the presence of electrical fields and directly at electrode interfaces. PMID:26335299

  2. Manipulating Steady Heat Conduction by Sensu-shaped Thermal Metamaterials

    PubMed Central

    Han, Tiancheng; Bai, Xue; Liu, Dan; Gao, Dongliang; Li, Baowen; Thong, John T. L.; Qiu, Cheng-Wei

    2015-01-01

    The ability to design the control of heat flow has innumerable benefits in the design of electronic systems such as thermoelectric energy harvesters, solid-state lighting, and thermal imagers, where the thermal design plays a key role in performance and device reliability. In this work, we employ one identical sensu-unit with facile natural composition to experimentally realize a new class of thermal metamaterials for controlling thermal conduction (e.g., thermal concentrator, focusing/resolving, uniform heating), only resorting to positioning and locating the same unit element of sensu-shape structure. The thermal metamaterial unit and the proper arrangement of multiple identical units are capable of transferring, redistributing and managing thermal energy in a versatile fashion. It is also shown that our sensu-shape unit elements can be used in manipulating dc currents without any change in the layout for the thermal counterpart. These could markedly enhance the capabilities in thermal sensing, thermal imaging, thermal-energy storage, thermal packaging, thermal therapy, and more domains beyond. PMID:25974383

  3. Thermal insulation attaching means. [adhesive bonding of felt vibration insulators under ceramic tiles

    NASA Technical Reports Server (NTRS)

    Leger, L. J. (Inventor)

    1978-01-01

    An improved isolation system is provided for attaching ceramic tiles of insulating material to the surface of a structure to be protected against extreme temperatures of the nature expected to be encountered by the space shuttle orbiter. This system isolates the fragile ceramic tiles from thermally and mechanically induced vehicle structural strains. The insulating tiles are affixed to a felt isolation pad formed of closely arranged and randomly oriented fibers by means of a flexible adhesive and in turn the felt pad is affixed to the metallic vehicle structure by an additional layer of flexible adhesive.

  4. Fiber/Matrix Interfacial Thermal Conductance Effect on the Thermal Conductivity of SiC/SiC Composites

    SciTech Connect

    Nguyen, Ba Nghiep; Henager, Charles H.

    2013-04-20

    SiC/SiC composites used in fusion reactor applications are subjected to high heat fluxes and require knowledge and tailoring of their in-service thermal conductivity. Accurately predicting the thermal conductivity of SiC/SiC composites as a function of temperature will guide the design of these materials for their intended use, which will eventually include the effects of 14-MeV neutron irradiations. This paper applies an Eshelby-Mori-Tanaka approach (EMTA) to compute the thermal conductivity of unirradiated SiC/SiC composites. The homogenization procedure includes three steps. In the first step EMTA computes the homogenized thermal conductivity of the unidirectional (UD) SiC fiber embraced by its coating layer. The second step computes the thermal conductivity of the UD composite formed by the equivalent SiC fibers embedded in a SiC matrix, and finally the thermal conductivity of the as-formed SiC/SiC composite is obtained by averaging the solution for the UD composite over all possible fiber orientations using the second-order fiber orientation tensor. The EMTA predictions for the transverse thermal conductivity of several types of SiC/SiC composites with different fiber types and interfaces are compared to the predicted and experimental results by Youngblood et al.

  5. Thermally responsive polymer systems for self-healing, reversible adhesion and shape memory applications

    NASA Astrophysics Data System (ADS)

    Luo, Xiaofan

    Responsive polymers are "smart" materials that are capable of performing prescribed, dynamic functions under an applied stimulus. In this dissertation, we explore several novel design strategies to develop thermally responsive polymers and polymer composites for self-healing, reversible adhesion and shape memory applications. In the first case described in Chapters 2 and 3, a thermally triggered self-healing material was prepared by blending a high-temperature epoxy resin with a thermoplastic polymer, poly(epsilon-caprolactone) (PCL). The initially miscible system undergoes polymerization induced phase separation (PIPS) during the curing of epoxy and yields a variety of compositionally dependent morphologies. At a particular PCL loading, the cured blend displays a "bricks-and-mortar" morphology in which epoxy exists as interconnected spheres ("bricks") within a continuous PCL matrix ("mortar"). A heat induced "bleeding" phenomenon was observed in the form of spontaneous wetting of all free surfaces by the molten PCL, and is attributed to the volumetric thermal expansion of PCL above its melting point in excess of epoxy brick expansion, which we term differential expansive bleeding (DEB). This DEB is capable of healing damage such as cracks. In controlled self-healing experiments, heating of a cracked specimen led to PCL bleeding from the bulk that yields a liquid layer bridging the crack gap. Upon cooling, a "scar" composed of PCL crystals was formed at the site of the crack, restoring a significant portion of mechanical strength. We further utilized DEB to enable strong and thermally-reversible adhesion of the material to itself and to metallic substrates, without any requirement for macroscopic softening or flow. After that, Chapters 4--6 present a novel composite strategy for the design and fabrication of shape memory polymer composites. The basic approach involves physically combining two or more functional components into an interpenetrating fiber

  6. Thermal conductance modulator based on folded graphene nanoribbons

    SciTech Connect

    Ouyang, Tao; Chen, Yuanping; Xie, Yuee; Stocks, George Malcolm; Zhong, Jianxin

    2011-01-01

    Based on folded graphene nanoribbons, we report a thermal conductance modulator which performs analogous operations as the rheostat in electronic circuits. This fundamental device can controllably and reversibly modulate the thermal conductance by varying the geometric structures and its tuning range can be up to 40% of the conductance of unfolded nanoribbons ( 1 nm wide and 7 15 nm long). Under this modulation, the conductance shows a linearly dependence on the folded angle, while undergoes a transition with the variation of the inter-layer distance. This primary thermal device may have great potential applications for phononic circuits and nanoscale thermal management. VC2011 American Institute of Physics. [doi:10.1063/1.3665184

  7. Comparative Study of the Thermal Conductivity of Solid Biomass Fuels

    PubMed Central

    2016-01-01

    The thermal conductivity of solid biomass fuels is useful information in the investigation of biomass combustion behavior and the development of modeling especially in the context of large scale power generation. There are little published data on the thermal conductivity of certain types of biomass such as wheat straw, miscanthus, and torrefied woods. Much published data on wood is in the context of bulk materials. A method for determining the thermal conductivities of small particles of biomass fuels has been developed using a custom built test apparatus. Fourteen different samples of various solid biomass fuel were processed to form a homogenized pellet for analysis. The thermal conductivities of the pelletized materials were determined and compared against each other and to existing data. PMID:27041819

  8. Thermal Conductivity of Gas Mixtures in Chemical Equilibrium

    NASA Technical Reports Server (NTRS)

    Brokaw, Richard S.

    1960-01-01

    The expression for the thermal conductivity of gas mixtures in chemical equilibrium is presented in a simpler and less restrictive form. This new form is shown to be equivalent to the previous equations.

  9. Lattice thermal conductance of quantum wires with disorder

    NASA Astrophysics Data System (ADS)

    Vyhmeister, Erik; Hershfield, Selman

    We model the lattice thermal conductance in long quantum wires connected to two large heat baths at different temperatures in the harmonic approximation. The thermal conductance is computed with the Landauer formula for phonons, where it is related to the sum over all transmission probabilities for phonons through the wire. The net transmission probability is computed using a recursive Green function technique, which allows one to study long wires efficiently. We consider several different kinds of disorder to reduce the lattice thermal conductivity: periodic rectangular holes of varying sizes and shapes, periodic triangular holes, and narrow bands, averaged over randomness to account for variance in manufacturing. Depending on the model, the thermal conductance was reduced by 80 percent or more from the perfectly ordered wire case. Funded by NSF grant DMR-1461019.

  10. Experimental Determination of Thermal Conductivity of Low-Density Ice

    NASA Technical Reports Server (NTRS)

    Coles, Willard D.

    1954-01-01

    The thermal conductivity of low-density ice has been computed from data obtained in an experimental investigation of the heat transfer and mass transfer by sublimation for an iced surface on a flat plate in a high-velocity tangential air stream. The results are compared with data from several sources on the thermal conductivity of packed snow and solid glaze ice. The results show good agreement with the equations for the thermal conductivity of packed snow as a function of snow density. The agreement of the curves for packed snow near the solid ice regime with the values of thermal conductivity, of ice indicates that the curves are applicable over the entire-ice-density range.

  11. Anisotropic lattice thermal conductivity in chiral tellurium from first principles

    NASA Astrophysics Data System (ADS)

    Peng, Hua; Kioussis, Nicholas; Stewart, Derek A.

    2015-12-01

    Using ab initio based calculations, we have calculated the intrinsic lattice thermal conductivity of chiral tellurium. We show that the interplay between the strong covalent intrachain and weak van der Waals interchain interactions gives rise to the phonon band gap between the lower and higher optical phonon branches. The underlying mechanism of the large anisotropy of the thermal conductivity is the anisotropy of the phonon group velocities and of the anharmonic interatomic force constants (IFCs), where large interchain anharmonic IFCs are associated with the lone electron pairs. We predict that tellurium has a large three-phonon scattering phase space that results in low thermal conductivity. The thermal conductivity anisotropy decreases under applied hydrostatic pressure.

  12. Thermal conductance of pressed brass contacts at liquid helium temperatures

    NASA Technical Reports Server (NTRS)

    Salerno, L. J.; Kittel, P.; Brooks, W. F.; Spivak, A. L.; Marks, W. G., Jr.

    1986-01-01

    An apparatus has been designed and fabricated which will measure the thermal conductance of pressed contacts at liquid helium temperatures as a function of applied force, with surface finish as a parameter. The apparatus is automated and was used to measure thermal conductance at temperatures from 1.5 to 6.5 K at applied forces up to 700 N for brass sample pairs having surface finishes from 0.1 to 1.6 micron rms. The experimental data were found to fit a simple power law where the thermal conductance is given by k = alpha T exp n, where k is the thermal conductance, T is the absolute temperature, and alpha and n are empirically determined constants.

  13. Enhanced thermal conductivity through the development of nanofluids

    SciTech Connect

    Eastman, J.A.; Choi, U.S.; Li, S.; Thompson, L.J.; Lee, S.

    1996-11-01

    Low thermal conductivity is a primary limitation in the development of energy-efficient heat transfer fluids required in many industrial applications. To overcome this limitation, a new class of heat transfer fluids is being developed by suspending nanocrystalline particles in liquids such as water or oil. The resulting nanofluids possess extremely high thermal conductivities compared to the liquids without dispersed nanocrystalline particles. For example, 5 volume % of nanocrystalline copper oxide particles suspended in water results in an improvement in thermal conductivity of almost 60% compared to water without nanoparticles. Excellent suspension properties are also observed, with no significant settling of nanocrystalline oxide particles occurring in stationary fluids over time periods longer than several days. Direct evaporation of Cu nanoparticles into pump oil results in similar improvements in thermal conductivity compared to oxide-in-water systems, but importantly, requires far smaller concentrations of dispersed nanocrystalline powder.

  14. Calculation of the lattice thermal conductivity in granular crystals

    SciTech Connect

    Kazan, M.; Volz, S.

    2014-02-21

    This paper provides a general model for the lattice thermal conductivity in granular crystals. The key development presented in this model is that the contribution of surface phonons to the thermal conductivity and the interplay between phonon anharmonic scattering and phonon scattering by boundaries are considered explicitly. Exact Boltzmann equation including spatial dependence of phonon distribution function is solved to yield expressions for the rates at which phonons scatter by the grain boundaries in the presence of intrinsic phonon scattering mechanisms. The intrinsic phonon scattering rates are calculated from Fermi's golden rule, and the vibration parameters of the model are derived as functions of temperature and crystallographic directions by using a lattice dynamics approach. The accuracy of the model is demonstrated with reference to experimental measurements regarding the effects of surface orientation and isotope composition on the thermal conductivity in single crystals, and the effect of grains size and shape on the thermal conductivity tensor in granular crystals.

  15. Anisotropic lattice thermal conductivity in chiral tellurium from first principles

    SciTech Connect

    Peng, Hua; Kioussis, Nicholas; Stewart, Derek A.

    2015-12-21

    Using ab initio based calculations, we have calculated the intrinsic lattice thermal conductivity of chiral tellurium. We show that the interplay between the strong covalent intrachain and weak van der Waals interchain interactions gives rise to the phonon band gap between the lower and higher optical phonon branches. The underlying mechanism of the large anisotropy of the thermal conductivity is the anisotropy of the phonon group velocities and of the anharmonic interatomic force constants (IFCs), where large interchain anharmonic IFCs are associated with the lone electron pairs. We predict that tellurium has a large three-phonon scattering phase space that results in low thermal conductivity. The thermal conductivity anisotropy decreases under applied hydrostatic pressure.

  16. Toward nanofluids of ultra-high thermal conductivity

    PubMed Central

    2011-01-01

    The assessment of proposed origins for thermal conductivity enhancement in nanofluids signifies the importance of particle morphology and coupled transport in determining nanofluid heat conduction and thermal conductivity. The success of developing nanofluids of superior conductivity depends thus very much on our understanding and manipulation of the morphology and the coupled transport. Nanofluids with conductivity of upper Hashin-Shtrikman (H-S) bound can be obtained by manipulating particles into an interconnected configuration that disperses the base fluid and thus significantly enhancing the particle-fluid interfacial energy transport. Nanofluids with conductivity higher than the upper H-S bound could also be developed by manipulating the coupled transport among various transport processes, and thus the nature of heat conduction in nanofluids. While the direct contributions of ordered liquid layer and particle Brownian motion to the nanofluid conductivity are negligible, their indirect effects can be significant via their influence on the particle morphology and/or the coupled transport. PMID:21711677

  17. Thermal conductance of pressed contacts at liquid helium temperatures

    SciTech Connect

    Salerno, L.J.; Kittel, P.; Spivak, A.L.

    1983-05-01

    The thermal contact conductance of a 0.4 micrometer surface finish OFHC copper sample pair has been investigated from 1.6 to 3.8 K for a range of applied contact forces up to 670 N. Experimental data have been fitted to the relation for the integral alpha T to the nth power dt by assuming that the thermal contact conductance is a simple power function of the sample temperature. It has been found that the conductance is proportional to T squared and that conductance increases with an increase in applied contact force. These results confirm earlier work.

  18. Thermal conductance of pressed contacts at liquid helium temperatures

    NASA Technical Reports Server (NTRS)

    Salerno, L. J.; Kittel, P.; Spivak, A. L.

    1983-01-01

    The thermal contact conductance of a 0.4 micrometer surface finish OFHC copper sample pair has been investigated from 1.6 to 3.8 K for a range of applied contact forces up to 670 N. Experimental data have been fitted to the relation Q = the integral alpha T to the nth power dt by assuming that the thermal contact conductance is a simple power function of the sample temperature. It has been found that the conductance is proportional to T squared and that conductance increases with an increase in applied contact force. These results confirm earlier work.

  19. Analysis of effective thermal conductivity of fibrous materials

    NASA Technical Reports Server (NTRS)

    Futschik, Michael W.; Witte, Larry C.

    1993-01-01

    The objective of this research is to gain a better understanding of the various mechanisms of heat transfer through fibrous materials and to gain insight into how fill-gas pressure influences the effective thermal conductivity. By way of first principles and some empiricism, two mathematical models are constructed to correlate experimental data. The data are obtained from a test series measuring the effective thermal conductivity of Nomex using a two-sided guarded hot-plate heater apparatus. Tests are conducted for certain mean temperatures and fill-gases over a range of pressures varying from vacuum to atmospheric conditions. The models are then evaluated to determine their effectiveness in representing the effective thermal conductivity of a fibrous material. The models presented herein predict the effective thermal conductivity of Nomex extremely well. Since the influence of gas conduction is determined to be the most influential component in predicting the effective thermal conductivity of a fibrous material, an improved representation of gas conduction is developed. Finally, some recommendations for extension to other random-oriented fiber materials are made concerning the usefulness of each model depending on their advantages and disadvantages.

  20. Si/Ge superlattice nanowires with ultralow thermal conductivity.

    PubMed

    Hu, Ming; Poulikakos, Dimos

    2012-11-14

    The engineering of nanostructured materials with very low thermal conductivity is a necessary step toward the realization of efficient thermoelectric devices. We report here the main results of an investigation with nonequilibrium molecular dynamics simulations on thermal transport in Si/Ge superlattice nanowires aiming at taking advantage of the inherent one dimensionality and the combined presence of surface and interfacial phonon scattering to yield ultralow values for their thermal conductivity. Our calculations revealed that the thermal conductivity of a Si/Ge superlattice nanowire varies nonmonotonically with both the Si/Ge lattice periodic length and the nanowire cross-sectional width. The optimal periodic length corresponds to an order of magnitude (92%) decrease in thermal conductivity at room temperature, compared to pristine single-crystalline Si nanowires. We also identified two competing mechanisms governing the thermal transport in superlattice nanowires, responsible for this nonmonotonic behavior: interface modulation in the longitudinal direction significantly depressing the phonon group velocities and hindering heat conduction, and coherent phonons occurring at extremely short periodic lengths counteracting the interface effect and facilitating thermal transport. Our results show trends for superlattice nanowire design for efficient thermoelectrics. PMID:23106449

  1. Identification of temperature-dependent thermal conductivity and experimental verification

    NASA Astrophysics Data System (ADS)

    Pan, Weizhen; Yi, Fajun; Zhu, Yanwei; Meng, Songhe

    2016-07-01

    A modified Levenberg–Marquardt method (LMM) for the identification of temperature-dependent thermal conductivity is proposed; the experiment and structure of the specimen for identification are also designed. The temperature-dependent thermal conductivities of copper C10200 and brass C28000 are identified to verify the effectiveness of the proposed identification method. The comparison between identified results and the measured data of laser flash diffusivity apparatus indicates the fine consistency and potential usage of the proposed method.

  2. Solid spot thermal conductance of Zircaloy-2/uranium dioxide interfaces

    SciTech Connect

    Madhusudana, C.V.; Fletcher, L.S.

    1983-03-01

    Simple power-law correlations have been deduced to predict the dependence of nondimensional thermal contact conductance on the nondimensional contact pressure for Zircaloy-2/uranium dioxide surfaces in contact. These correlations are based on the experimental results of several workers. These results indicate that further experimental work is needed to cover a broader range of pressures and temperatures and to ascertain the effect of mean junction temperature on the thermal contact conductance.

  3. Automation of a guarded hot plate thermal conductivity instrument

    SciTech Connect

    Holland, L.L.

    1980-06-01

    The Thermo-Physics Corporation's GP-1800 guarded hot plate thermal conductivity instrument has been automated using a Digital Equipment Corporation PDP 11/35 minicomputer with an Industrial Control Subsystem Remote. Automation included constructing a hardware link between the instrument and the minicomputer system and designing, writing, and documenting software to perform equipment control, data acquisition, data reduction, and report generation. The software was designed and written so that non-programmers can run the thermal conductivity experiment.

  4. Modeling the thermal conductivity of fiber-reinforced ceramic composites

    SciTech Connect

    Beecher, S.C.; Dinwiddie, R.B.

    1993-06-01

    A review of models for the prediction of the thermal conductivity of uni-directional fiber-reinforced composites will be presented. The ability of these models to give an accurate prediction of the composite thermal conductivity depends on the amount of information known about the constituent phase properties under the assumption that these properties do not change as a result of processing. Also presented are models that take into account the effects of fiber coatings.

  5. Thermal conductivity anisotropy of metasedimentary and igneous rocks

    NASA Astrophysics Data System (ADS)

    Davis, Michael G.; Chapman, David S.; van Wagoner, Thomas M.; Armstrong, Phillip A.

    2007-05-01

    Thermal conductivity anisotropy was determined for three sets of metasedimentary and igneous rocks from central Utah, USA. Most conductivity measurements were made in transient mode with a half-space, line source instrument oriented in two orthogonal directions on a flat face cut perpendicular to bedding. One orientation of the probe yields thermal conductivity parallel to bedding (kpar) directly, the other orientation of the probe measures a product of conductivities parallel and perpendicular to bedding from which the perpendicular conductivity (kperp) is calculated. Some direct measurements of kpar and kperp were made on oriented cylindrical discs using a conventional divided bar device in steady state mode. Anisotropy is defined as kpar/kperp. Precambrian argillites from Big Cottonwood Canyon have anisotropy values from 0.8 to 2.1 with corresponding conductivity perpendicular to bedding of 2.0 to 6.2 W m-1 K-1. Anisotropy values for Price Canyon sedimentary samples are less than 1.2 with a mean of 1.04 although thermal conductivity perpendicular to bedding for the samples varied from 1.3 to 5.0 W m-1 K-1. The granitic rocks were found to be essentially isotropic with thermal conductivity perpendicular to bedding having a range of 2.2 to 3.2 W m-1 K-1 and a mean of 2.68 W m-1 K-1. The results confirm the observation by Deming [1994] that anisotropy is negligible for rocks having kperp greater than 4.0 W m-1 K-1 and generally increases for low conductivity metamorphic and clay-rich rocks. There is little evidence, however, for his suggestion that thermal conductivity anisotropy of all rocks increases systematically to about 2.5 for low thermal conductivity rocks.

  6. Maneuvering thermal conductivity of magnetic nanofluids by tunable magnetic fields

    NASA Astrophysics Data System (ADS)

    Patel, Jaykumar; Parekh, Kinnari; Upadhyay, R. V.

    2015-06-01

    We report an experimental investigation of magnetic field dependent thermal conductivity of a transformer oil base magnetic fluid as a function of volume fractions. In the absence of magnetic field, thermal conductivity increases linearly with an increase in volume fraction, and magnitude of thermal conductivity thus obtained is lower than that predicted by Maxwell's theory. This reveals the presence of clusters/oligomers in the system. On application of magnetic field, it exhibits a non-monotonous increase in thermal conductivity. The results are interpreted using the concept of a two-step homogenization method (which is based on differential effective medium theory). The results show a transformation of particle cluster configuration from long chain like prolate shape to the aggregated drop-like structure with increasing concentration as well as a magnetic field. The aggregated drop-like structure for concentrated system is supported by optical microscopic images. This shape change of clusters reduces thermal conductivity enhancement. Moreover, this structure formation is observed as a dynamic phenomenon, and at 226 mT field, the length of the structure extends with time, becomes maximum, and then reduces. This change results in the increase or decrease of thermal conductivity.

  7. Metallic coatings for enhancement of thermal contact conductance

    SciTech Connect

    Lambert, M.A.; Fletcher, L.S. )

    1994-04-01

    The reliability of standard electronic modules may be improved by decreasing overall module temperature. This may be accomplished by enhancing the thermal contact conductance at the interface between the module frame guide rib and the card rail to which the module is clamped. Some metallic coatings, when applied to the card rail, would deform under load, increasing the contact area and associated conductance. This investigation evaluates the enhancements in thermal conductance afforded by vapor deposited silver and gold coatings. Experimental thermal conductance measurements were made for anodized aluminum 6101-T6 and electroless nickel-plated copper C11000-H03 card materials to the aluminum A356-T61 rail material. Conductance values for the electroless nickel-plated copper junction ranged from 600 to 2800 W/m(exp 2)K and those for the anodized aluminum junction ranged from 25 to 91 W/m(exp 2)K for contact pressures of 0.172-0.862 MPa and mean junction temperatures of 20-100 C. Experimental thermal conductance values of vapor deposited silver- and gold-coated aluminum A356-T61 rail surfaces indicate thermal enhancements of 1.25-2.19 for the electroless nickel-plated copper junctions and 1.79-3.41 for the anodized aluminum junctions. The silver and gold coatings provide significant thermal enhancement; however, these coating-substrate combinations are susceptible to galvanic corrosion under some conditions. 25 refs.

  8. Metallic coatings for enhancement of thermal contact conductance

    NASA Astrophysics Data System (ADS)

    Lambert, M. A.; Fletcher, L. S.

    1994-04-01

    The reliability of standard electronic modules may be improved by decreasing overall module temperature. This may be accomplished by enhancing the thermal contact conductance at the interface between the module frame guide rib and the card rail to which the module is clamped. Some metallic coatings, when applied to the card rail, would deform under load, increasing the contact area and associated conductance. This investigation evaluates the enhancements in thermal conductance afforded by vapor deposited silver and gold coatings. Experimental thermal conductance measurements were made for anodized aluminum 6101-T6 and electroless nickel-plated copper C11000-H03 card materials to the aluminum A356-T61 rail material. Conductance values for the electroless nickel-plated copper junction ranged from 600 to 2800 W/m(exp 2)K and those for the anodized aluminum junction ranged from 25 to 91 W/m(exp 2)K for contact pressures of 0.172-0.862 MPa and mean junction temperatures of 20-100 C. Experimental thermal conductance values of vapor deposited silver- and gold-coated aluminum A356-T61 rail surfaces indicate thermal enhancements of 1.25-2.19 for the electroless nickel-plated copper junctions and 1.79-3.41 for the anodized aluminum junctions. The silver and gold coatings provide significant thermal enhancement; however, these coating-substrate combinations are susceptible to galvanic corrosion under some conditions.

  9. Low-temperature thermal conductivity of terbium-gallium garnet

    SciTech Connect

    Inyushkin, A. V. Taldenkov, A. N.

    2010-11-15

    Thermal conductivity of paramagnetic Tb{sub 3}Ga{sub 5}O{sub 12} (TbGG) terbium-gallium garnet single crystals is investigated at temperatures from 0.4 to 300 K in magnetic fields up to 3.25 T. A minimum is observed in the temperature dependence {kappa}(T) of thermal conductivity at T{sub min} = 0.52 K. This and other singularities on the {kappa}(T) dependence are associated with scattering of phonons from terbium ions. The thermal conductivity at T = 5.1 K strongly depends on the magnetic field direction relative to the crystallographic axes of the crystal. Experimental data are considered using the Debye theory of thermal conductivity taking into account resonance scattering of phonons from Tb{sup 3+} ions. Analysis of the temperature and field dependences of the thermal conductivity indicates the existence of a strong spin-phonon interaction in TbGG. The low-temperature behavior of the thermal conductivity (field and angular dependences) is mainly determined by resonance scattering of phonons at the first quasi-doublet of the electron spectrum of Tb{sup 3+} ion.

  10. Thermal Conductivity Changes in Titanium-Graphene Composite upon Annealing

    NASA Astrophysics Data System (ADS)

    Jagannadham, Kasichainula

    2016-02-01

    Ti-graphene composite films were prepared on polished Ti substrates by deposition of graphene platelets from suspension followed by deposition of Ti by magnetron sputtering. The films were annealed at different temperatures up to 1073 K (800 °C) and different time periods in argon atmosphere. The annealed films were characterized by X-ray diffraction for phase identification, scanning electron microscopy for microstructure, energy-dispersive spectrometry for chemical analysis, atomic force microscopy for surface roughness, and transient thermoreflectance for thermal conductivity and interface thermal conductance. The results showed that the interface between the composite film and Ti substrate remained continuous with the absence of voids. Oxygen concentration in the composite films has increased for higher temperature and time of annealing. TiO2 and TiC phases are formed only in the film annealed at 1073 K (800 °C). The thermal conductivity of the composite film decreased with increasing oxygen concentration. The effective thermal conductance of the film annealed at 1073 K (800 °C) was significantly lower. The interface thermal conductance between the composite film and the Ti substrate is also reduced for higher oxygen concentration. Formation of microscopic TiO2 phase bound by interface boundaries and oxygen incorporation is considered responsible for the lower thermal conductance of the Ti-graphene composite annealed at 1073 K (800 °C).

  11. Advanced Low Conductivity Thermal Barrier Coatings: Performance and Future Directions

    NASA Technical Reports Server (NTRS)

    Zhu, Dongming; Miller, Robert A.

    2008-01-01

    Thermal barrier coatings will be more aggressively designed to protect gas turbine engine hot-section components in order to meet future engine higher fuel efficiency and lower emission goals. In this presentation, thermal barrier coating development considerations and performance will be emphasized. Advanced thermal barrier coatings have been developed using a multi-component defect clustering approach, and shown to have improved thermal stability and lower conductivity. The coating systems have been demonstrated for high temperature combustor applications. For thermal barrier coatings designed for turbine airfoil applications, further improved erosion and impact resistance are crucial for engine performance and durability. Erosion resistant thermal barrier coatings are being developed, with a current emphasis on the toughness improvements using a combined rare earth- and transition metal-oxide doping approach. The performance of the toughened thermal barrier coatings has been evaluated in burner rig and laser heat-flux rig simulated engine erosion and thermal gradient environments. The results have shown that the coating composition optimizations can effectively improve the erosion and impact resistance of the coating systems, while maintaining low thermal conductivity and cyclic durability. The erosion, impact and high heat-flux damage mechanisms of the thermal barrier coatings will also be described.

  12. Experimental determination of thermal and adhesion stress in particle filled thermoplasts

    SciTech Connect

    Vollenberg, P.; Heikens, D.; Ladan, H.C.B.

    1988-12-01

    The phenomena of dewetting in filled thermoplastics were studied by light microscopy and were correlated with variations in the slope of stress-strain diagrams in constant strain rate tests. In such diagrams, kinks in the plots were found to correspond to the dewetting stress. The corresponding local stress at a filler particle is then equal to the sum of the thermal compressive stress and the adhesion stress. It was shown that the adhesion stress was proportional to the reciprocal root of the particle radius. Also, values of dewetting stress predicted for inorganic particles with radii smaller than 2-4 micrometers are higher than the stresses at which crazes and shear-bands are formed near such particles, indicating that dewetting will not occur in those cases, and adhesion aids may be superfluous. 10 references.

  13. Reduction of Thermal Conductivity in Wafer-Bonded Silicon

    SciTech Connect

    ZL Liau; LR Danielson; PM Fourspring; L Hu; G Chen; GW Turner

    2006-11-27

    Blocks of silicon up to 3-mm thick have been formed by directly bonding stacks of thin wafer chips. These stacks showed significant reductions in the thermal conductivity in the bonding direction. In each sample, the wafer chips were obtained by polishing a commercial wafer to as thin as 36 {micro}m, followed by dicing. Stacks whose starting wafers were patterned with shallow dots showed greater reductions in thermal conductivity. Diluted-HF treatment of wafer chips prior to bonding led to the largest reduction of the effective thermal conductivity, by approximately a factor of 50. Theoretical modeling based on restricted conduction through the contacting dots and some conduction across the planar nanometer air gaps yielded fair agreement for samples fabricated without the HF treatment.

  14. Thermal and Electrical Conductivity Measurements of CDA 510 Phosphor Bronze

    NASA Technical Reports Server (NTRS)

    Tuttle, James E.; Canavan, Edgar; DiPirro, Michael

    2009-01-01

    Many cryogenic systems use electrical cables containing phosphor bronze wire. While phosphor bronze's electrical and thermal conductivity values have been published, there is significant variation among different phosphor bronze formulations. The James Webb Space Telescope (JWST) will use several phosphor bronze wire harnesses containing a specific formulation (CDA 510, annealed temper). The heat conducted into the JWST instrument stage is dominated by these harnesses, and approximately half of the harness conductance is due to the phosphor bronze wires. Since the JWST radiators are expected to just keep the instruments at their operating temperature with limited cooling margin, it is important to know the thermal conductivity of the actual alloy being used. We describe an experiment which measured the electrical and thermal conductivity of this material between 4 and 295 Kelvin.

  15. Thermal conductivity enhancement of nanofluids containing graphene nanosheets

    NASA Astrophysics Data System (ADS)

    Sen Gupta, Soujit; Manoj Siva, V.; Krishnan, Sreenath; Sreeprasad, T. S.; Singh, Pawan K.; Pradeep, T.; Das, Sarit K.

    2011-10-01

    This paper envisages a mechanism of heat conduction behind the thermal conductivity enhancement observed in graphene nanofluids. Graphene nanofluids have been prepared, characterized, and their thermal conductivity was measured using the transient hot wire method. The enhancements in thermal conductivity are substantial even at lower concentrations and are not predicted by the classical Maxwell model. The enhancement also shows strong temperature dependence which is unlike its carbon predecessors, carbon nanotube (CNT) and graphene oxide nanofluids. It is also seen that the magnitude of enhancement is in-between CNT and metallic/metal oxide nanofluids. This could be an indication that the mechanism of heat conduction is a combination of percolation in CNT and Brownian motion and micro convection effects in metallic/metal oxide nanofluids, leading to a strong proposition of a hybrid model.

  16. Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals.

    PubMed

    Barako, Michael T; Sood, Aditya; Zhang, Chi; Wang, Junjie; Kodama, Takashi; Asheghi, Mehdi; Zheng, Xiaolin; Braun, Paul V; Goodson, Kenneth E

    2016-04-13

    Porous metals are used in interfacial transport applications that leverage the combination of electrical and/or thermal conductivity and the large available surface area. As nanomaterials push toward smaller pore sizes to increase the total surface area and reduce diffusion length scales, electron conduction within the metal scaffold becomes suppressed due to increased surface scattering. Here we observe the transition from diffusive to quasi-ballistic thermal conduction using metal inverse opals (IOs), which are metal films that contain a periodic arrangement of interconnected spherical pores. As the material dimensions are reduced from ∼230 nm to ∼23 nm, the thermal conductivity of copper IOs is reduced by more than 57% due to the increase in surface scattering. In contrast, nickel IOs exhibit diffusive-like conduction and have a constant thermal conductivity over this size regime. The quasi-ballistic nature of electron transport at these length scales is modeled considering the inverse opal geometry, surface scattering, and grain boundaries. Understanding the characteristics of electron conduction at the nanoscale is essential to minimizing the total resistance of porous metals for interfacial transport applications, such as the total electrical resistance of battery electrodes and the total thermal resistance of microscale heat exchangers. PMID:26986050

  17. Method of simultaneous measurement of radiative and lattice thermal conductivity.

    NASA Technical Reports Server (NTRS)

    Schatz, J. F.; Simmons, G.

    1972-01-01

    A new technique of high-temperature thermal-conductivity measurement is described. A CO2 gas laser is used to generate a low-frequency temperature wave at one face of a small disk-shaped sample, and an infrared detector views the opposite face to detect the phase of the emerging radiation. A mathematical expression is derived which enables phase data at several frequencies to be used for the simultaneous determination of thermal diffusivity and mean extinction coefficient. Lattice and radiative thermal conductivities are then calculated. Test results for sintered aluminum oxide at temperatures from 530 to 1924 K are within the range of error of previously existing data.

  18. Thermal conductivity measurements of particulate materials under Martian conditions

    NASA Technical Reports Server (NTRS)

    Presley, M. A.; Christensen, P. R.

    1993-01-01

    The mean particle diameter of surficial units on Mars has been approximated by applying thermal inertia determinations from the Mariner 9 Infrared Radiometer and the Viking Infrared Thermal Mapper data together with thermal conductivity measurement. Several studies have used this approximation to characterize surficial units and infer their nature and possible origin. Such interpretations are possible because previous measurements of the thermal conductivity of particulate materials have shown that particle size significantly affects thermal conductivity under martian atmospheric pressures. The transfer of thermal energy due to collisions of gas molecules is the predominant mechanism of thermal conductivity in porous systems for gas pressures above about 0.01 torr. At martian atmospheric pressures the mean free path of the gas molecules becomes greater than the effective distance over which conduction takes place between the particles. Gas particles are then more likely to collide with the solid particles than they are with each other. The average heat transfer distance between particles, which is related to particle size, shape and packing, thus determines how fast heat will flow through a particulate material.The derived one-to-one correspondence of thermal inertia to mean particle diameter implies a certain homogeneity in the materials analyzed. Yet the samples used were often characterized by fairly wide ranges of particle sizes with little information about the possible distribution of sizes within those ranges. Interpretation of thermal inertia data is further limited by the lack of data on other effects on the interparticle spacing relative to particle size, such as particle shape, bimodal or polymodal mixtures of grain sizes and formation of salt cements between grains. To address these limitations and to provide a more comprehensive set of thermal conductivities vs. particle size a linear heat source apparatus, similar to that of Cremers, was assembled to

  19. Thermal radiation and conduction in microscale structures. Final report

    SciTech Connect

    Tien, C.L.

    1998-09-02

    The general objective of the current research program is to achieve a better understanding of the fundamental mechanisms of thermal radiation and heat conduction in microscale structures commonly encountered in engineering applications. Specifically, the program includes both experimental and analytical investigations of radiative heat transfer in microstructures, conductive heat transfer in micro devices, and short-pulse laser material interactions. Future work is planned to apply the knowledge of microscale heat transfer gained in this project to developing thermal insulating aerogel materials, thermal design schemes for quantum well lasers, and short-pulse laser micro-fabrication techniques. A listing of publications by Chang-Lin Tien is included.

  20. Revisiting the block method for evaluating thermal conductivities of clay and granite

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Determination of thermal conductivities of porous media using the contact method is revisited and revalidated with consideration of thermal contact resistance. Problems that limit the accuracy of determination of thermal conductivities of porous media are discussed. Thermal conductivities of granite...

  1. THERMAL CONDUCTIVITY OF NON-REPOSITORY LITHOSTRATIGRAPHIC LAYERS

    SciTech Connect

    R. JONES

    2004-10-22

    This model report addresses activities described in ''Technical Work Plan for: Near-Field Environment and Transport Thermal Properties and Analysis Reports Integration'' (BSC 2004 [DIRS 171708]). The model develops values for thermal conductivity, and its uncertainty, for the nonrepository layers of Yucca Mountain; in addition, the model provides estimates for matrix porosity and dry bulk density for the nonrepository layers. The studied lithostratigraphic units, as identified in the ''Geologic Framework Model'' (GFM 2000) (BSC 2004 [DIRS 170029]), are the Timber Mountain Group, the Tiva Canyon Tuff, the Yucca Mountain Tuff, the Pah Canyon Tuff, the Topopah Spring Tuff (excluding the repository layers), the Calico Hills Formation, the Prow Pass Tuff, the Bullfrog Tuff, and the Tram Tuff. The deepest model units of the GFM (Tund and Paleozoic) are excluded from this study because no data suitable for model input are available. The parameter estimates developed in this report are used as input to various models and calculations that simulate heat transport through the rock mass. Specifically, analysis model reports that use product output from this report are: (1) Drift-scale coupled processes (DST and TH seepage) models; (2) Drift degradation analysis; (3) Multiscale thermohydrologic model; and (4) Ventilation model and analysis report. In keeping with the methodology of the thermal conductivity model for the repository layers in ''Thermal Conductivity of the Potential Repository Horizon'' (BSC 2004 [DIRS 169854]), the Hsu et al. (1995 [DIRS 158073]) three-dimensional (3-D) cubic model (referred to herein as ''the Hsu model'') was used to represent the matrix thermal conductivity as a function of the four parameters (matrix porosity, thermal conductivity of the saturating fluid, thermal conductivity of the solid, and geometric connectivity of the solid). The Hsu model requires input data from each test specimen to meet three specific conditions: (1) Known value for

  2. Voltage tunability of thermal conductivity in ferroelectric materials

    DOEpatents

    Ihlefeld, Jon; Hopkins, Patrick Edward

    2016-02-09

    A method to control thermal energy transport uses mobile coherent interfaces in nanoscale ferroelectric films to scatter phonons. The thermal conductivity can be actively tuned, simply by applying an electrical potential across the ferroelectric material and thereby altering the density of these coherent boundaries to directly impact thermal transport at room temperature and above. The invention eliminates the necessity of using moving components or poor efficiency methods to control heat transfer, enabling a means of thermal energy control at the micro- and nano-scales.

  3. Atomistic Modeling of Thermal Conductivity of Epoxy Nanotube Composites

    NASA Astrophysics Data System (ADS)

    Fasanella, Nicholas A.; Sundararaghavan, Veera

    2016-05-01

    The Green-Kubo method was used to investigate the thermal conductivity as a function of temperature for epoxy/single wall carbon nanotube (SWNT) nanocomposites. An epoxy network of DGEBA-DDS was built using the `dendrimer' growth approach, and conductivity was computed by taking into account long-range Coulombic forces via a k-space approach. Thermal conductivity was calculated in the direction perpendicular to, and along the SWNT axis for functionalized and pristine SWNT/epoxy nanocomposites. Inefficient phonon transport at the ends of nanotubes is an important factor in the thermal conductivity of the nanocomposites, and for this reason discontinuous nanotubes were modeled in addition to long nanotubes. The thermal conductivity of the long, pristine SWNT/epoxy system is equivalent to that of an isolated SWNT along its axis, but there was a 27% reduction perpendicular to the nanotube axis. The functionalized, long SWNT/epoxy system had a very large increase in thermal conductivity along the nanotube axis (~700%), as well as the directions perpendicular to the nanotube (64%). The discontinuous nanotubes displayed an increased thermal conductivity along the SWNT axis compared to neat epoxy (103-115% for the pristine SWNT/epoxy, and 91-103% for functionalized SWNT/epoxy system). The functionalized system also showed a 42% improvement perpendicular to the nanotube, while the pristine SWNT/epoxy system had no improvement over epoxy. The thermal conductivity tensor is averaged over all possible orientations to see the effects of randomly orientated nanotubes, and allow for experimental comparison. Excellent agreement is seen for the discontinuous, pristine SWNT/epoxy nanocomposite. These simulations demonstrate there exists a threshold of the SWNT length where the best improvement for a composite system with randomly oriented nanotubes would transition from pristine SWNTs to functionalized SWNTs.

  4. Thermal and Electrical Conductivities of Porous Si Membranes

    NASA Astrophysics Data System (ADS)

    Hagino, Harutoshi; Tanaka, Saburo; Tanimura, Naoki; Miyazaki, Koji

    2015-11-01

    The microstructure of materials affects thermal and electrical transport as well as the physical properties. The effects of the microstructure on both thermal and electrical transport in silicon membranes with periodic microporous structures produced from silicon-on-insulator wafers using microfabrication processes were studied. The in-plane thermal and electrical conductivities of the Si membranes were measured simultaneously by using a self-heating method. The measured thermal conductivity was compared with the result from the periodically laser-heating method. The thermal and electrical conductivities were much lower in the porous membranes than in the non-porous membrane. The measured thermal conductivity was much lower than expected based on values determined using classical models. A significant phonon size effect was observed even in microsized structures, and the mean free path for phonons was very long. It was concluded that phonon transport is quasi-ballistic and electron transport is diffuse in microporous Si structures. It was suggested that the microstructure had a different effect on thermal and electrical transport.

  5. Multiwalled Carbon Nanotube/nanofiber Arrays as Conductive and Dry Adhesive Interface Materials

    NASA Technical Reports Server (NTRS)

    Tong, Tao; Zhao, Yang; Delzeit, Lance; Majumdar, Arun; Kashani, Ali

    2004-01-01

    We demonstrate the possibility of making conductive and dry adhesive interfaces between multiwalled carbon nanotube (MWNT) and nanofiber (MWNF) arrays grown by chemical vapor deposition with transition-metal as catalyst on highly Boron doped silicon substrates. The maximum observed adhesion force between MWNT and MWNF surfaces is 3.5 mN for an apparent contact area of 2 mm by 4 mm. The minimum contact resistance measured at the same time is approx.20 Omega. Contact resistances of MWNT-MWNT and MWNT-gold interfaces were also measured as pressure forces around several mN were applied at the interface. The resulting minimum contact resistances are on the same order but with considerable variation from sample to sample. For MWNT-MWNT contacts, a minimum contact resistance of approx.1 Omega is observed for a contact area of 2 mm by 1 mm. The relatively high contact resistances, considering the area density of the nanotubes, might be explained by the high cross-tube resistances at the contact interfaces.

  6. Multiscale Modeling of Thermal Conductivity of Polymer/Carbon Nanocomposites

    NASA Technical Reports Server (NTRS)

    Clancy, Thomas C.; Frankland, Sarah-Jane V.; Hinkley, Jeffrey A.; Gates, Thomas S.

    2010-01-01

    Molecular dynamics simulation was used to estimate the interfacial thermal (Kapitza) resistance between nanoparticles and amorphous and crystalline polymer matrices. Bulk thermal conductivities of the nanocomposites were then estimated using an established effective medium approach. To study functionalization, oligomeric ethylene-vinyl alcohol copolymers were chemically bonded to a single wall carbon nanotube. The results, in a poly(ethylene-vinyl acetate) matrix, are similar to those obtained previously for grafted linear hydrocarbon chains. To study the effect of noncovalent functionalization, two types of polyethylene matrices. -- aligned (extended-chain crystalline) vs. amorphous (random coils) were modeled. Both matrices produced the same interfacial thermal resistance values. Finally, functionalization of edges and faces of plate-like graphite nanoparticles was found to be only modestly effective in reducing the interfacial thermal resistance and improving the composite thermal conductivity

  7. Thermal Conductivity Based on Modified Laser Flash Measurement

    NASA Technical Reports Server (NTRS)

    Lin, Bochuan; Ban, Heng; Li, Chao; Scripa, Rosalia N.; Su, Ching-Hua; Lehoczky, Sandor L.

    2005-01-01

    The laser flash method is a standard method for thermal diffusivity measurement. It employs single-pulse heating of one side of a thin specimen and measures the temperature response of the other side. The thermal diffusivity of the specimen can be obtained based on a one-dimensional transient heat transfer analysis. This paper reports the development of a theory that includes a transparent reference layer with known thermal property attached to the back of sample. With the inclusion of heat conduction from the sample to the reference layer in the theoretical analysis, the thermal conductivity and thermal diffusivity of sample can be extracted from the temperature response data. Furthermore, a procedure is established to select two points from the data to calculate these properties. The uncertainty analysis indicates that this method can be used with acceptable levels of uncertainty.

  8. Accurate calculation of conductive conductances in complex geometries for spacecrafts thermal models

    NASA Astrophysics Data System (ADS)

    Garmendia, Iñaki; Anglada, Eva; Vallejo, Haritz; Seco, Miguel

    2016-02-01

    The thermal subsystem of spacecrafts and payloads is always designed with the help of Thermal Mathematical Models. In the case of the Thermal Lumped Parameter (TLP) method, the non-linear system of equations that is created is solved to calculate the temperature distribution and the heat power that goes between nodes. The accuracy of the results depends largely on the appropriate calculation of the conductive and radiative conductances. Several established methods for the determination of conductive conductances exist but they present some limitations for complex geometries. Two new methods are proposed in this paper to calculate accurately these conductive conductances: The Extended Far Field method and the Mid-Section method. Both are based on a finite element calculation but while the Extended Far Field method uses the calculation of node mean temperatures, the Mid-Section method is based on assuming specific temperature values. They are compared with traditionally used methods showing the advantages of these two new methods.

  9. Effective thermal conductivity of composites with fibre-matrix debonding

    NASA Technical Reports Server (NTRS)

    Fadale, T. D.; Taya, M.

    1991-01-01

    Debonding of the fiber-matrix interface is a major cause for the degradation of the mechanical properties and the loss of thermal conductivity of fiber-reinforced composites. This paper discusses two analytical approaches for modeling the thermal conduction problem of composites. One is based on the concept of modeling the thermal barrier by an equivalent heat transfer coefficient at the fiber-matrix interface, as described by Hasselman and Johnson (1987) and Benveniste and Miloh (1986). The other approach, suggested by Hatta and Taya (1986), is by treating a composite with debonded interface as a coated-fiber composite. The major advantage of the latter aproach is that the thickness of the fiber coating can be realistically modeled depending upon the extent of degradation of the composite with the thermal conductivity of the coating as that of air.

  10. Low Frequency Thermal Conductivity in Micro Phononic Crystals

    NASA Astrophysics Data System (ADS)

    Anjos, Virgilio; Arantes, Alison

    2015-03-01

    We study theoretically the cumulative thermal conductivity of a micro phononic crystal at low temperature regime. The phononic crystal considered presents carbon microtubes inclusions arranged periodically in a two-dimensional square lattice embebed in soft elastic matrix. Moderate and high impedance mismatch are considered concerning the material composition. The low frequency phonon spectra (up to tens of GHz) are obtained solving the generalized wave equation for inhomogeneous media within the Plane Wave Expansion method. We consider low temperatures in order to increase the participation of GHz thermal phonons. We observed suppression in the cumulative thermal conductivity at the band gap region and thus a reduction of thermal conductivity of the phononic crystal when compared with the bulk matrix. The authors would like to thank the Brazilian agencies, National Council of Technological and Scientific Development (CNPq), Foundation for Research Support of Minas Gerais (FAPEMIG) and CAPES for their support.

  11. Thermal Conductivity behavior of MWCNT based PMMA and PC composites

    NASA Astrophysics Data System (ADS)

    Dubey, Girija; Jindal, Prashant; Bhandari, Rajiv; Dhiman, Neha; Bajaj, Chetan; Jindal, Vijay

    Poly methyl methacrylate (PMMA) and Polycarbonate (PC) are low cost polymer materials which can be easily transformed into desired shapes for various applications. However they have poor mechanical, thermal and electrical properties which are required to be enhanced to widen their scope of applications specifically where along with high strength, rapid heat transfer is essential. Multi Walled Carbon nanotubes (MWCNTs) are excellent new materials having extraordinary mechanical and transport properties. We will report results of fabricating composites of varying compositions of MWCNTs with PMMA and PC and their thermal conductivity behaviour using simple transient heat flow methods. The samples in disk shapes of around 2 cm diameters and 0.2 cm thickness with MWCNT compositions varying up to 10 wt% were fabricated. We found that both PMMA and PC measured high thermal conductivity with increase in the composition of CNTs. The thermal conductivity of 10wt% MWCNT/PMMA composite increased by nearly two times in comparison to pure PMMA.

  12. Superior thermal conductivity in suspended bilayer hexagonal boron nitride

    PubMed Central

    Wang, Chengru; Guo, Jie; Dong, Lan; Aiyiti, Adili; Xu, Xiangfan; Li, Baowen

    2016-01-01

    We reported the basal-plane thermal conductivity in exfoliated bilayer hexagonal boron nitride h-BN that was measured using suspended prepatterned microstructures. The h-BN sample suitable for thermal measurements was fabricated by dry-transfer method, whose sample quality, due to less polymer residues on surfaces, is believed to be superior to that of PMMA-mediated samples. The measured room temperature thermal conductivity is around 484 Wm−1K−1(+141 Wm−1K−1/ −24 Wm−1K−1) which exceeds that in bulk h-BN, providing experimental observation of the thickness-dependent thermal conductivity in suspended few-layer h-BN. PMID:27142571

  13. Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding

    NASA Astrophysics Data System (ADS)

    Zhang, Xiaoliang; Gao, Yufei; Chen, Yuli; Hu, Ming

    2016-02-01

    Graphene and its bilayer structure are the two-dimensional crystalline form of carbon, whose extraordinary electron mobility and other unique features hold great promise for nanoscale electronics and photonics. Their realistic applications in emerging nanoelectronics usually call for thermal transport manipulation in a controllable and precise manner. In this paper we systematically studied the effect of interlayer covalent bonding, in particular different interlay bonding arrangement, on the thermal conductivity of bilayer graphene using equilibrium molecular dynamics simulations. It is revealed that, the thermal conductivity of randomly bonded bilayer graphene decreases monotonically with the increase of interlayer bonding density, however, for the regularly bonded bilayer graphene structure the thermal conductivity possesses unexpectedly non-monotonic dependence on the interlayer bonding density. The results suggest that the thermal conductivity of bilayer graphene depends not only on the interlayer bonding density, but also on the detailed topological configuration of the interlayer bonding. The underlying mechanism for this abnormal phenomenon is identified by means of phonon spectral energy density, participation ratio and mode weight factor analysis. The large tunability of thermal conductivity of bilayer graphene through rational interlayer bonding arrangement paves the way to achieve other desired properties for potential nanoelectronics applications involving graphene layers.

  14. Discussion on the thermal conductivity enhancement of nanofluids

    PubMed Central

    2011-01-01

    Increasing interests have been paid to nanofluids because of the intriguing heat transfer enhancement performances presented by this kind of promising heat transfer media. We produced a series of nanofluids and measured their thermal conductivities. In this article, we discussed the measurements and the enhancements of the thermal conductivity of a variety of nanofluids. The base fluids used included those that are most employed heat transfer fluids, such as deionized water (DW), ethylene glycol (EG), glycerol, silicone oil, and the binary mixture of DW and EG. Various nanoparticles (NPs) involving Al2O3 NPs with different sizes, SiC NPs with different shapes, MgO NPs, ZnO NPs, SiO2 NPs, Fe3O4 NPs, TiO2 NPs, diamond NPs, and carbon nanotubes with different pretreatments were used as additives. Our findings demonstrated that the thermal conductivity enhancements of nanofluids could be influenced by multi-faceted factors including the volume fraction of the dispersed NPs, the tested temperature, the thermal conductivity of the base fluid, the size of the dispersed NPs, the pretreatment process, and the additives of the fluids. The thermal transport mechanisms in nanofluids were further discussed, and the promising approaches for optimizing the thermal conductivity of nanofluids have been proposed. PMID:21711638

  15. Thermal conductivity modeling of core-shell and tubular nanowires.

    PubMed

    Yang, Ronggui; Chen, Gang; Dresselhaus, Mildred S

    2005-06-01

    The heteroepitaxial growth of crystalline core-shell nanostructures of a variety of materials has become possible in recent years, allowing the realization of various novel nanoscale electronic and optoelectronic devices. The increased surface or interface area will decrease the thermal conductivity of such nanostructures and impose challenges for the thermal management of such devices. In the meantime, the decreased thermal conductivity might benefit the thermoelectric conversion efficiency. In this paper, we present modeling results on the lattice thermal conductivity of core-shell and tubular nanowires along the wire axis direction using the phonon Boltzmann equation. We report the dependence of the thermal conductivity on the surface conditions and the core-shell geometry for silicon core-germanium shell and tubular silicon nanowires at room temperature. The results show that the effective thermal conductivity changes not only with the composition of the constituents but also with the radius of the nanowires and nanopores due to the nature of the ballistic phonon transport. The results in this work have implications for the design and operation of a variety of nanoelectronic devices, optoelectronic devices, and thermoelectric materials and devices. PMID:15943452

  16. Monodisperse magnetite nanofluids: Synthesis, aggregation, and thermal conductivity

    NASA Astrophysics Data System (ADS)

    Jiang, Wei; Wang, Liqiu

    2010-12-01

    Magnetic nanofluids possess some unique properties that can significantly affect their thermal conductivity. We synthesize monodispersed magnetite (Fe3O4) nanofluids in toluene with the particle size from 4 to 12 nm and obtain aqueous nanofluids by a simple "one-step" phase transfer. Even without the effect of external field, the magnetic-interaction-induced self-assembled aggregation can still be significant in magnetite nanofluids. Investigation of the microstructures of self-assembled aggregation is carried out by the dynamic light scattering, which unveils the variation of aggregated configurations with particle concentration and time. Based on the calculation from the existing models, the aggregates decrease the thermal conductivity of both themselves and the entire system, mainly due to the less solid contents and weaker mobility compared with the single particles as well as the increase in interfacial thermal resistance. As the manifestation of the aggregation-structure variation, the measured thermal conductivity is of a wavelike shape as a function of particle concentration. The particle coating layers are also of importance in cluster formation so that nanofluid thermal conductivity can be manipulated for some nanofluids by changing the stabilizer used and thus controlling the particle aggregated structures. Due to the effects of temperature, viscosity and coating layers, the thermal conductivity for aqueous system varies in a different way as that for the toluene system.

  17. Beating the amorphous limit in thermal conductivity by superlattices design

    PubMed Central

    Mizuno, Hideyuki; Mossa, Stefano; Barrat, Jean-Louis

    2015-01-01

    The value measured in the amorphous structure with the same chemical composition is often considered as a lower bound for the thermal conductivity of any material: the heat carriers are strongly scattered by disorder, and their lifetimes reach the minimum time scale of thermal vibrations. An appropriate design at the nano-scale, however, may allow one to reduce the thermal conductivity even below the amorphous limit. In the present contribution, using molecular-dynamics simulation and the Green-Kubo formulation, we study systematically the thermal conductivity of layered phononic materials (superlattices), by tuning different parameters that can characterize such structures. We have discovered that the key to reach a lower-than-amorphous thermal conductivity is to block almost completely the propagation of the heat carriers, the superlattice phonons. We demonstrate that a large mass difference in the two intercalated layers, or weakened interactions across the interface between layers result in materials with very low thermal conductivity, below the values of the corresponding amorphous counterparts. PMID:26374147

  18. Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding

    PubMed Central

    Zhang, Xiaoliang; Gao, Yufei; Chen, Yuli; Hu, Ming

    2016-01-01

    Graphene and its bilayer structure are the two-dimensional crystalline form of carbon, whose extraordinary electron mobility and other unique features hold great promise for nanoscale electronics and photonics. Their realistic applications in emerging nanoelectronics usually call for thermal transport manipulation in a controllable and precise manner. In this paper we systematically studied the effect of interlayer covalent bonding, in particular different interlay bonding arrangement, on the thermal conductivity of bilayer graphene using equilibrium molecular dynamics simulations. It is revealed that, the thermal conductivity of randomly bonded bilayer graphene decreases monotonically with the increase of interlayer bonding density, however, for the regularly bonded bilayer graphene structure the thermal conductivity possesses unexpectedly non-monotonic dependence on the interlayer bonding density. The results suggest that the thermal conductivity of bilayer graphene depends not only on the interlayer bonding density, but also on the detailed topological configuration of the interlayer bonding. The underlying mechanism for this abnormal phenomenon is identified by means of phonon spectral energy density, participation ratio and mode weight factor analysis. The large tunability of thermal conductivity of bilayer graphene through rational interlayer bonding arrangement paves the way to achieve other desired properties for potential nanoelectronics applications involving graphene layers. PMID:26911859

  19. Rock thermal conductivity as key parameter for geothermal numerical models

    NASA Astrophysics Data System (ADS)

    Di Sipio, Eloisa; Chiesa, Sergio; Destro, Elisa; Galgaro, Antonio; Giaretta, Aurelio; Gola, Gianluca; Manzella, Adele

    2013-04-01

    The geothermal energy applications are undergoing a rapid development. However, there are still several challenges in the successful exploitation of geothermal energy resources. In particular, a special effort is required to characterize the thermal properties of the ground along with the implementation of efficient thermal energy transfer technologies. This paper focuses on understanding the quantitative contribution that geosciences can receive from the characterization of rock thermal conductivity. The thermal conductivity of materials is one of the main input parameters in geothermal modeling since it directly controls the steady state temperature field. An evaluation of this thermal property is required in several fields, such as Thermo-Hydro-Mechanical multiphysics analysis of frozen soils, designing ground source heat pumps plant, modeling the deep geothermal reservoirs structure, assessing the geothermal potential of subsoil. Aim of this study is to provide original rock thermal conductivity values useful for the evaluation of both low and high enthalpy resources at regional or local scale. To overcome the existing lack of thermal conductivity data of sedimentary, igneous and metamorphic rocks, a series of laboratory measurements has been performed on several samples, collected in outcrop, representative of the main lithologies of the regions included in the VIGOR Project (southern Italy). Thermal properties tests were carried out both in dry and wet conditions, using a C-Therm TCi device, operating following the Modified Transient Plane Source method.Measurements were made at standard laboratory conditions on samples both water saturated and dehydrated with a fan-forced drying oven at 70 ° C for 24 hr, for preserving the mineral assemblage and preventing the change of effective porosity. Subsequently, the samples have been stored in an air-conditioned room while bulk density, solid volume and porosity were detected. The measured thermal conductivity

  20. Effect of thermal cycling on the bond strength of self-adhesive cements to fiber posts.

    PubMed

    Mazzitelli, Claudia; Monticelli, Francesca; Toledano, Manuel; Ferrari, Marco; Osorio, Raquel

    2012-06-01

    The aim of this study was to assess the push-out bond strengths of self-adhesive resin cements to epoxy resin-based fiber posts after challenging by thermocycling. Thirty-six single-rooted premolars were endodontically treated, and the post-spaces were drilled to receive RelyX Fiber posts #1. Three self-adhesive resin cements (RelyX Unicem, G-Cem, and Breeze) were used for luting fiber posts. The bonded specimens were either stored for 1 month in a moist field (37°C) or submitted to thermocycling (5,000 times) prior to push-out test. The maximum force required to dislodge the post via an apical-coronal direction was recorded (megapascal). The data were statistically analyzed with two-way ANOVA and Tukey tests (p < 0.05). The factors "luting cement" and "thermocycling" significantly influenced bond strengths. The initial push-out values of RelyX Unicem and Breeze were higher than those of G-Cem. After thermocycling, the bond strength of G-Cem increased and no differences were found between groups. RelyX Unicem and Breeze bond strengths were not affected by the thermal challenge. Thermal cycling and cement type differently influence the bond strengths of self-adhesive resin cements. Self-adhesive cements can represent an option for luting fiber posts into root canal. PMID:21670983

  1. Scanning thermal microscopy with heat conductive nanowire probes.

    PubMed

    Timofeeva, Maria; Bolshakov, Alexey; Tovee, Peter D; Zeze, Dagou A; Dubrovskii, Vladimir G; Kolosov, Oleg V

    2016-03-01

    Scanning thermal microscopy (SThM), which enables measurement of thermal transport and temperature distribution in devices and materials with nanoscale resolution is rapidly becoming a key approach in resolving heat dissipation problems in modern processors and assisting development of new thermoelectric materials. In SThM, the self-heating thermal sensor contacts the sample allowing studying of the temperature distribution and heat transport in nanoscaled materials and devices. The main factors that limit the resolution and sensitivities of SThM measurements are the low efficiency of thermal coupling and the lateral dimensions of the probed area of the surface studied. The thermal conductivity of the sample plays a key role in the sensitivity of SThM measurements. During the SThM measurements of the areas with higher thermal conductivity the heat flux via SThM probe is increased compared to the areas with lower thermal conductivity. For optimal SThM measurements of interfaces between low and high thermal conductivity materials, well defined nanoscale probes with high thermal conductivity at the probe apex are required to achieve a higher quality of the probe-sample thermal contact while preserving the lateral resolution of the system. In this paper, we consider a SThM approach that can help address these complex problems by using high thermal conductivity nanowires (NW) attached to a tip apex. We propose analytical models of such NW-SThM probes and analyse the influence of the contact resistance between the SThM probe and the sample studied. The latter becomes particularly important when both tip and sample surface have high thermal conductivities. These models were complemented by finite element analysis simulations and experimental tests using prototype probe where a multiwall carbon nanotube (MWCNT) is exploited as an excellent example of a high thermal conductivity NW. These results elucidate critical relationships between the performance of the SThM probe on

  2. Thermal conductivity of Si{endash}Ge superlattices

    SciTech Connect

    Lee, S.; Cahill, D.G.; Venkatasubramanian, R.

    1997-06-01

    The thermal conductivity of Si{endash}Ge superlattices with superlattice periods 30{lt}L{lt}300 {Angstrom}, and a Si{sub 0.85}Ge{sub 0.15} thin film alloy is measured using the 3{omega} method. The alloy film shows a conductivity comparable to bulk SiGe alloys while the superlattice samples have a thermal conductivity that is smaller than the alloy. For 30{lt}L{lt}70 {Angstrom}, the thermal conductivity decreases with decreasing L; these data provide a lower limit to the interface thermal conductance G of epitaxial Si{endash}Ge interfaces: G{gt}2{times}10{sup 9}Wm{sup {minus}2}K{sup {minus}1} at 200 K. Superlattices with relatively longer periods, L{gt}130 {Angstrom}, have smaller thermal conductivities than the short-period samples. This unexpected result is attributed to a strong disruption of the lattice vibrations by extended defects produced during lattice-mismatched growth. {copyright} {ital 1997 American Institute of Physics.}

  3. Process for fabricating composite material having high thermal conductivity

    DOEpatents

    Colella, Nicholas J.; Davidson, Howard L.; Kerns, John A.; Makowiecki, Daniel M.

    2001-01-01

    A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and copper, and basically consists of coated diamond particles dispersed in a high conductivity metal, such as copper. The composite material can be fabricated in small or relatively large sizes using inexpensive materials. The process basically consists, for example, of sputter coating diamond powder with several elements, including a carbide forming element and a brazeable material, compacting them into a porous body, and infiltrating the porous body with a suitable braze material, such as copper-silver alloy, thereby producing a dense diamond-copper composite material with a thermal conductivity comparable to synthetic diamond films at a fraction of the cost.

  4. Lattice dynamics and lattice thermal conductivity of thorium dicarbide

    NASA Astrophysics Data System (ADS)

    Liao, Zongmeng; Huai, Ping; Qiu, Wujie; Ke, Xuezhi; Zhang, Wenqing; Zhu, Zhiyuan

    2014-11-01

    The elastic and thermodynamic properties of ThC2 with a monoclinic symmetry have been studied by means of density functional theory and direct force-constant method. The calculated properties including the thermal expansion, the heat capacity and the elastic constants are in a good agreement with experiment. Our results show that the vibrational property of the C2 dimer in ThC2 is similar to that of a free standing C2 dimer. This indicates that the C2 dimer in ThC2 is not strongly bonded to Th atoms. The lattice thermal conductivity for ThC2 was calculated by means of the Debye-Callaway model. As a comparison, the conductivity of ThC was also calculated. Our results show that the ThC and ThC2 contributions of the lattice thermal conductivity to the total conductivity are 29% and 17%, respectively.

  5. Electric and thermal conductivities of quenched neutron star crusts

    NASA Technical Reports Server (NTRS)

    Ogata, Shuji; Ichimaru, Setsuo

    1990-01-01

    The electric and thermal conductivities in the outer crustal matter of a neutron star quenched into a solid state by cooling are estimated using a Monte Carlo simulation of freezing transition for dense plasmas. The conductivities are calculated by the precise evaluation of the scattering integrals, using the procedure of Ichimaru et al. (1983) and Iyetomi and Ichimaru (1983). The results predict the conductivities lower, by a factor of about 3, than those with the single-phonon approximation.

  6. Lattice thermal conductivity of dense silicate glass at high pressures

    NASA Astrophysics Data System (ADS)

    Chang, Y. Y.; Hsieh, W. P.

    2015-12-01

    The layered structure of the Earth's interior is generally believed to develop through the magma ocean differentiation in the early Earth. Previous seismic studies revealed the existence of ultra low velocity zones above the core mantle boundary (CMB) which was inferred to be associated with the remnant of a deep magma ocean. The heat flux through the core mantle boundary therefore would strongly depend on the thermal conductivity, both lattice (klat) and radiative (krad) of dense silicate melts and major constituent minerals of the lower mantle. Recent experimental results on the radiative thermal conductivity of dense silicate glasses and lower-mantle minerals suggest that krad of dense silicate glasses could be remarkably lower than krad of the surrounding solid mantle phases. In this case, the dense silicate melts will act as a trap for heat from the Earth's outer core. However, this conclusion remains uncertain because of the lack of direct measurements on lattice thermal conductivities of silicate glasses/melts under lower mantle pressures up to date. Here we report experimental results on lattice thermal conductivities of dense silicate glass with basaltic composition under pressures relevant to the Earth's lower mantle in a diamond-anvil cell using time-domain thermoreflectance method. The study will assist the comprehension of thermal transport properties of silicate melts in the Earth's deep interior and is crucial for understanding the dynamic and thermal evolution of the Earth's internal structure.

  7. Thermal conductivity of III-V semiconductor superlattices

    SciTech Connect

    Mei, S. Knezevic, I.

    2015-11-07

    This paper presents a semiclassical model for the anisotropic thermal transport in III-V semiconductor superlattices (SLs). An effective interface rms roughness is the only adjustable parameter. Thermal transport inside a layer is described by the Boltzmann transport equation in the relaxation time approximation and is affected by the relevant scattering mechanisms (three-phonon, mass-difference, and dopant and electron scattering of phonons), as well as by diffuse scattering from the interfaces captured via an effective interface scattering rate. The in-plane thermal conductivity is obtained from the layer conductivities connected in parallel. The cross-plane thermal conductivity is calculated from the layer thermal conductivities in series with one another and with thermal boundary resistances (TBRs) associated with each interface; the TBRs dominate cross-plane transport. The TBR of each interface is calculated from the transmission coefficient obtained by interpolating between the acoustic mismatch model (AMM) and the diffuse mismatch model (DMM), where the weight of the AMM transmission coefficient is the same wavelength-dependent specularity parameter related to the effective interface rms roughness that is commonly used to describe diffuse interface scattering. The model is applied to multiple III-arsenide superlattices, and the results are in very good agreement with experimental findings. The method is both simple and accurate, easy to implement, and applicable to complicated SL systems, such as the active regions of quantum cascade lasers. It is also valid for other SL material systems with high-quality interfaces and predominantly incoherent phonon transport.

  8. Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites.

    PubMed

    Barako, Michael T; Roy-Panzer, Shilpi; English, Timothy S; Kodama, Takashi; Asheghi, Mehdi; Kenny, Thomas W; Goodson, Kenneth E

    2015-09-01

    The ability to efficiently and reliably transfer heat between sources and sinks is often a bottleneck in the thermal management of modern energy conversion technologies ranging from microelectronics to thermoelectric power generation. These interfaces contribute parasitic thermal resistances that reduce device performance and are subjected to thermomechanical stresses that degrade device lifetime. Dense arrays of vertically aligned metal nanowires (NWs) offer the unique combination of thermal conductance from the constituent metal and mechanical compliance from the high aspect ratio geometry to increase interfacial heat transfer and device reliability. In the present work, we synthesize copper NW arrays directly onto substrates via templated electrodeposition and extend this technique through the use of a sacrificial overplating layer to achieve improved uniformity. Furthermore, we infiltrate the array with an organic phase change material and demonstrate the preservation of thermal properties. We use the 3ω method to measure the axial thermal conductivity of freestanding copper NW arrays to be as high as 70 W m(-1) K(-1), which is more than an order of magnitude larger than most commercial interface materials and enhanced-conductivity nanocomposites reported in the literature. These arrays are highly anisotropic, and the lateral thermal conductivity is found to be only 1-2 W m(-1) K(-1). We use these measured properties to elucidate the governing array-scale transport mechanisms, which include the effects of morphology and energy carrier scattering from size effects and grain boundaries. PMID:26284489

  9. Highly thermally conductive papers with percolative layered boron nitride nanosheets.

    PubMed

    Zhu, Hongli; Li, Yuanyuan; Fang, Zhiqiang; Xu, Jiajun; Cao, Fangyu; Wan, Jiayu; Preston, Colin; Yang, Bao; Hu, Liangbing

    2014-04-22

    In this work, we report a dielectric nanocomposite paper with layered boron nitride (BN) nanosheets wired by one-dimensional (1D) nanofibrillated cellulose (NFC) that has superior thermal and mechanical properties. These nanocomposite papers are fabricated from a filtration of BN and NFC suspensions, in which NFC is used as a stabilizer to stabilize BN nanosheets. In these nanocomposite papers, two-dimensional (2D) nanosheets form a thermally conductive network, while 1D NFC provides mechanical strength. A high thermal conductivity has been achieved along the BN paper surface (up to 145.7 W/m K for 50 wt % of BN), which is an order of magnitude higher than that in randomly distributed BN nanosheet composites and is even comparable to the thermal conductivity of aluminum alloys. Such a high thermal conductivity is mainly attributed to the structural alignment within the BN nanosheet papers; the effects of the interfacial thermal contact resistance are minimized by the fact that the heat transfer is in the direction parallel to the interface between BN nanosheets and that a large contact area occurs between BN nanosheets. PMID:24601534

  10. Thermal conductivity of III-V semiconductor superlattices

    NASA Astrophysics Data System (ADS)

    Mei, S.; Knezevic, I.

    2015-11-01

    This paper presents a semiclassical model for the anisotropic thermal transport in III-V semiconductor superlattices (SLs). An effective interface rms roughness is the only adjustable parameter. Thermal transport inside a layer is described by the Boltzmann transport equation in the relaxation time approximation and is affected by the relevant scattering mechanisms (three-phonon, mass-difference, and dopant and electron scattering of phonons), as well as by diffuse scattering from the interfaces captured via an effective interface scattering rate. The in-plane thermal conductivity is obtained from the layer conductivities connected in parallel. The cross-plane thermal conductivity is calculated from the layer thermal conductivities in series with one another and with thermal boundary resistances (TBRs) associated with each interface; the TBRs dominate cross-plane transport. The TBR of each interface is calculated from the transmission coefficient obtained by interpolating between the acoustic mismatch model (AMM) and the diffuse mismatch model (DMM), where the weight of the AMM transmission coefficient is the same wavelength-dependent specularity parameter related to the effective interface rms roughness that is commonly used to describe diffuse interface scattering. The model is applied to multiple III-arsenide superlattices, and the results are in very good agreement with experimental findings. The method is both simple and accurate, easy to implement, and applicable to complicated SL systems, such as the active regions of quantum cascade lasers. It is also valid for other SL material systems with high-quality interfaces and predominantly incoherent phonon transport.

  11. Development of Advanced Low Conductivity Thermal Barrier Coatings

    NASA Technical Reports Server (NTRS)

    Zhu, Dong-Ming; Miller, Robert A.

    2004-01-01

    Advanced multi-component, low conductivity oxide thermal barrier coatings have been developed using an approach that emphasizes real-time monitoring of thermal conductivity under conditions that are engine-like in terms of temperatures and heat fluxes. This is in contrast to the traditional approach where coatings are initially optimized in terms of furnace and burner rig durability with subsequent measurement in the as-processed or furnace-sintered condition. The present work establishes a laser high-heat-flux test as the basis for evaluating advanced plasma-sprayed and electron beam-physical vapor deposited (EB-PVD) thermal barrier coatings under the NASA Ultra-Efficient Engine Technology (UEET) Program. The candidate coating materials for this program are novel thermal barrier coatings that are found to have significantly reduced thermal conductivities and improved thermal stability due to an oxide-defect-cluster design. Critical issues for designing advanced low conductivity coatings with improved coating durability are also discussed.

  12. Effects of lithium insertion on thermal conductivity of silicon nanowires

    SciTech Connect

    Xu, Wen; Zhang, Gang; Li, Baowen

    2015-04-27

    Recently, silicon nanowires (SiNWs) have been applied as high-performance Li battery anodes, since they can overcome the pulverization and mechanical fracture during lithiation. Although thermal stability is one of the most important parameters that determine safety of Li batteries, thermal conductivity of SiNWs with Li insertion remains unclear. In this letter, using molecular dynamics simulations, we study room temperature thermal conductivity of SiNWs with Li insertion. It is found that compared with the pristine SiNW, there is as much as 60% reduction in thermal conductivity with 10% concentration of inserted Li atoms, while under the same impurity concentration the reduction in thermal conductivity of the mass-disordered SiNW is only 30%. With lattice dynamics calculations and normal mode decomposition, it is revealed that the phonon lifetimes in SiNWs decrease greatly due to strong scattering of phonons by vibrational modes of Li atoms, especially for those high frequency phonons. The observed strong phonon scattering phenomenon in Li-inserted SiNWs is similar to the phonon rattling effect. Our study serves as an exploration of thermal properties of SiNWs as Li battery anodes or weakly coupled with impurity atoms.

  13. Effective Thermal Conductivity of High Porosity Open Cell Nickel Foam

    NASA Technical Reports Server (NTRS)

    Sullins, Alan D.; Daryabeigi, Kamran

    2001-01-01

    The effective thermal conductivity of high-porosity open cell nickel foam samples was measured over a wide range of temperatures and pressures using a standard steady-state technique. The samples, measuring 23.8 mm, 18.7 mm, and 13.6 mm in thickness, were constructed with layers of 1.7 mm thick foam with a porosity of 0.968. Tests were conducted with the specimens subjected to temperature differences of 100 to 1000 K across the thickness and at environmental pressures of 10(exp -4) to 750 mm Hg. All test were conducted in a gaseous nitrogen environment. A one-dimensional finite volume numerical model was developed to model combined radiation/conduction heat transfer in the foam. The radiation heat transfer was modeled using the two-flux approximation. Solid and gas conduction were modeled using standard techniques for high porosity media. A parameter estimation technique was used in conjunction with the measured and predicted thermal conductivities at pressures of 10(exp -4) and 750 mm Hg to determine the extinction coefficient, albedo of scattering, and weighting factors for modeling the conduction thermal conductivity. The measured and predicted conductivities over the intermediate pressure values differed by 13%.

  14. Thermal stability and adhesion of low-emissivity electroplated Au coatings.

    SciTech Connect

    Jorenby, Jeff W.; Hachman, John T., Jr.; Yang, Nancy Y. C.; Chames, Jeffrey M.; Clift, W. Miles

    2010-12-01

    We are developing a low-emissivity thermal management coating system to minimize radiative heat losses under a high-vacuum environment. Good adhesion, low outgassing, and good thermal stability of the coating material are essential elements for a long-life, reliable thermal management device. The system of electroplated Au coating on the adhesion-enhancing Wood's Ni strike and 304L substrate was selected due to its low emissivity and low surface chemical reactivity. The physical and chemical properties, interface bonding, thermal aging, and compatibility of the above Au/Ni/304L system were examined extensively. The study shows that the as-plated electroplated Au and Ni samples contain submicron columnar grains, stringers of nanopores, and/or H{sub 2} gas bubbles, as expected. The grain structure of Au and Ni are thermally stable up to 250 C for 63 days. The interface bonding is strong, which can be attributed to good mechanical locking among the Au, the 304L, and the porous Ni strike. However, thermal instability of the nanopore structure (i.e., pore coalescence and coarsening due to vacancy and/or entrapped gaseous phase diffusion) and Ni diffusion were observed. In addition, the study also found that prebaking 304L in the furnace at {ge} 1 x 10{sup -4} Torr promotes surface Cr-oxides on the 304L surface, which reduces the effectiveness of the intended H-removal. The extent of the pore coalescence and coarsening and their effect on the long-term system integrity and outgassing are yet to be understood. Mitigating system outgassing and improving Au adhesion require a further understanding of the process-structure-system performance relationships within the electroplated Au/Ni/304L system.

  15. Thermal Conductivity of Nonazeotropic Gaseous Mixtures of Fluorocarbon Refrigerants

    NASA Astrophysics Data System (ADS)

    Tanaka, Yoshiyuki; Ueno, Hiroshi; Kubota, Hironobu; Makita, Tadashi

    The thermal conductivity of four binary gaseous mixtures of R22 (CHCIF2) with R13(CClF3), R23(CHF3), R12(CCl2F2) and R114(CClF2·CClF2) has been measured at temperatures 298.15 and 323.15K under pressures from atmospheric to saturated pressures by a coaxial cylinder cell. The precision of the thermal conductivity obtained is within 2%. The thermal conductivity of mixtures increases with increasing temperature and pressure at a constant composition. The thermal conductivity in each mixture changes almost linearly with the concentration of R22 at a constant temperature and pressure, although the thermal conductivity at each composition is slightly larger than the calculated values by a simple molefraction average method. The experimental results were correlated with composition and pressure by empirical equations and compared with several kinds of prediction methods. The Brokaw's equation is found to reproduce the experimental data most successfully with a mean deviation of 0.7%.

  16. Characterization of the thermal conductivity for ceramic pebble beds

    NASA Astrophysics Data System (ADS)

    Lo Frano, R.; Aquaro, D.; Scaletti, L.; Olivi, N.

    2015-11-01

    The evaluation of the thermal conductivity of breeder materials is one of the main goals to find the best candidate material for the fusion reactor technology. The aim of this paper is to evaluate experimentally the thermal conductivity of a ceramic material by applying the hot wire method at different temperatures, ranging from 50 to about 800°C. The updated experimental facility, available at the Department of Civil and Industrial Engineering (DICI) of the University of Pisa, used to determine the thermal conductivity of a ceramic material (alumina), will be described along with the measurement acquisition system. Moreover it will be also provided an overview of the current state of art of the ceramic pebble bed breeder thermos-mechanics R&D (e.g. Lithium Orthosilicate (Li4SiO4) and Lithium Metatitanate (Li2TiO3)) focusing on the up-to-date analysis. The methodological approach adopted is articulated in two phase: the first one aimed at the experimental evaluation of thermal conductivity of a ceramic material by means of hot wire method, to be subsequently used in the second phase that is based on the test rig method, through which is measured the thermal conductivity of pebble bed material. In this framework, the experimental procedure and the measured results obtained varying the temperature, are presented and discussed.

  17. Thermal conductivity of solid thiophene in an incommensurate orientational state

    NASA Astrophysics Data System (ADS)

    Korolyuk, O. A.; Krivchikov, A. I.; Vdovichenko, G. A.; Romantsova, O. O.; Horbatenko, Yu. V.

    2016-01-01

    The thermal conductivity of solid thiophene at equilibrium vapor pressure between 2 K < T < 170 K, has been measured in a sequence of incommensurate metastable orientationally disordered phases II, II1, II2, and II2g with different degrees of orientational ordering of the molecules. It is found that in phase states II, II1 and II2 with dynamic orientational disorder of the molecules, the thermal conductivity does not depend on the temperature. It is shown that the temperature dependence of the thermal conductivity κ(T) of orientational glass Vg and II2g (incommensurate) does not have any of the anomalies that are typical for amorphous materials and glasses. The temperature dependence κ(T) of the incommensurate state of orientational glass II2g is bell-shaped, which is typical for the thermal conductivity of crystals with long-range orientational order. In the II2g state, as temperature drops from Tg to almost 10 K, the thermal conductivity increases according to κ(T) = A/T + B, where the first term describes the input of the propagating phonons, wherein the average length of their mean free path is greater than half of the phonon wavelength. The B term is associated with the input of localized short-wave, or "diffuse" vibrational modes. At low temperatures T ≤ 7 K, κ(T) ∝ T3 is observed with increasing temperatures, which corresponds to the boundary scattering of phonons.

  18. Thermal Conductivity Measurement of Liquid-Quenched Higher Manganese Silicides

    NASA Astrophysics Data System (ADS)

    Nishino, Shunsuke; Miyata, Masanobu; Ohdaira, Keisuke; Koyano, Mikio; Takeuchi, Tsunehiro

    2016-03-01

    Higher manganese silicides (HMSs, MnSi γ , γ ˜ 1.75) show promise for use as low-cost and environmentally friendly thermoelectric materials. To reduce their thermal conductivity, we partially substituted the Mn site with heavy elements using liquid quenching. Fabricated samples possess a curly ribbon-shape with about a 10- μm thickness and 1-mm width, with high surface roughness. In this study, we determined the thermal conductivity of the curly-ribbon-shaped samples using two independent methods: the 3 ω method with two heat flow models, and the steady-state method using a physical property measurement system (PPMS; Quantum Design). We succeeded in estimating the thermal conductivity at the temperature range of 100-200 K using the PPMS. The estimated thermal conductivity of non-doped HMSs shows a constant value without temperature dependence of 2.2 ± 0.8 W K-1m-1 at 100-200 K. The difference of thermal conductivities of W-doped and non-doped HMSs was not recognized within the measurement error.

  19. Anisotropic thermal conduction with magnetic fields in galaxy clusters

    NASA Astrophysics Data System (ADS)

    Arth, Alexander; Dolag, Klaus; Beck, Alexander; Petkova, Margarita; Lesch, Harald

    2015-08-01

    Magnetic fields play an important role for the propagation and diffusion of charged particles, which are responsible for thermal conduction. In this poster, we present an implementation of thermal conduction including the anisotropic effects of magnetic fields for smoothed particle hydrodynamics (SPH). The anisotropic thermal conduction is mainly proceeding parallel to magnetic fields and suppressed perpendicular to the fields. We derive the SPH formalism for the anisotropic heat transport and solve the corresponding equation with an implicit conjugate gradient scheme. We discuss several issues of unphysical heat transport in the cases of extreme ansiotropies or unmagnetized regions and present possible numerical workarounds. We implement our algorithm into the cosmological simulation code GADGET and study its behaviour in several test cases. In general, we reproduce the analytical solutions of our idealised test problems, and obtain good results in cosmological simulations of galaxy cluster formations. Within galaxy clusters, the anisotropic conduction produces a net heat transport similar to an isotropic Spitzer conduction model with low efficiency. In contrast to isotropic conduction our new formalism allows small-scale structure in the temperature distribution to remain stable, because of their decoupling caused by magnetic field lines. Compared to observations, strong isotropic conduction leads to an oversmoothed temperature distribution within clusters, while the results obtained with anisotropic thermal conduction reproduce the observed temperature fluctuations well. A proper treatment of heat transport is crucial especially in the outskirts of clusters and also in high density regions. It's connection to the local dynamical state of the cluster also might contribute to the observed bimodal distribution of cool core and non cool core clusters. Our new scheme significantly advances the modelling of thermal conduction in numerical simulations and overall gives

  20. Analytical model for thermal boundary conductance and equilibrium thermal accommodation coefficient at solid/gas interfaces.

    PubMed

    Giri, Ashutosh; Hopkins, Patrick E

    2016-02-28

    We develop an analytical model for the thermal boundary conductance between a solid and a gas. By considering the thermal fluxes in the solid and the gas, we describe the transmission of energy across the solid/gas interface with diffuse mismatch theory. From the predicted thermal boundary conductances across solid/gas interfaces, the equilibrium thermal accommodation coefficient is determined and compared to predictions from molecular dynamics simulations on the model solid-gas systems. We show that our model is applicable for modeling the thermal accommodation of gases on solid surfaces at non-cryogenic temperatures and relatively strong solid-gas interactions (εsf ≳ kBT). PMID:26931716

  1. Thermal distribution in high power optical devices with power-law thermal conductivity

    NASA Astrophysics Data System (ADS)

    Zhou, Chuanle; Grayson, M.

    2012-01-01

    We introduce a power-law approximation to model non-linear ranges of the thermal conductivity, and under this approximation derive a simple analytical expression for calculating the temperature profile in high power quantum cascade lasers and light emitting diodes. The thermal conductivity of a type II InAs/GaSb superlattice (T2SL) is used as an example, having negative or positive power-law exponents depending on the thermal range of interest. The result is an increase or decrease in the temperature, respectively, relative to the uniform thermal conductivity assumption.

  2. Thermal conductivity and thermal expansion of graphite fiber-reinforced copper matrix composites

    NASA Technical Reports Server (NTRS)

    Ellis, David L.; Mcdanels, David L.

    1993-01-01

    The high specific conductivity of graphite fiber/copper matrix (Gr/Cu) composites offers great potential for high heat flux structures operating at elevated temperatures. To determine the feasibility of applying Gr/Cu composites to high heat flux structures, composite plates were fabricated using unidirectional and cross-plied pitch-based P100 graphite fibers in a pure copper matrix. Thermal conductivity of the composites was measured from room temperature to 1073 K, and thermal expansion was measured from room temperature to 1050 K. The longitudinal thermal conductivity, parallel to the fiber direction, was comparable to pure copper. The transverse thermal conductivity, normal to the fiber direction, was less than that of pure copper and decreased with increasing fiber content. The longitudinal thermal expansion decreased with increasing fiber content. The transverse thermal expansion was greater than pure copper and nearly independent of fiber content.

  3. Thermal conductivity and thermal expansion of graphite fiber/copper matrix composites

    NASA Technical Reports Server (NTRS)

    Ellis, David L.; Mcdanels, David L.

    1991-01-01

    The high specific conductivity of graphite fiber/copper matrix (Gr/Cu) composites offers great potential for high heat flux structures operating at elevated temperatures. To determine the feasibility of applying Gr/Cu composites to high heat flux structures, composite plates were fabricated using unidirectional and cross-plied pitch-based P100 graphite fibers in a pure copper matrix. Thermal conductivity of the composites was measured from room temperature to 1073 K, and thermal expansion was measured from room temperature to 1050 K. The longitudinal thermal conductivity, parallel to the fiber direction, was comparable to pure copper. The transverse thermal conductivity, normal to the fiber direction, was less than that of pure copper and decreased with increasing fiber content. The longitudinal thermal expansion decreased with increasing fiber content. The transverse thermal expansion was greater than pure copper and nearly independent of fiber content.

  4. Numerical Investigation of the Thermal Conductivity of Graphite Nanofibers

    NASA Astrophysics Data System (ADS)

    Hakak Khadem, Masoud

    The thermal conductivity of graphite nano-fibers (GNFs) with different styles is predicted computationally. GNFs are formed as basal planes of graphene stacked based on the catalytic configuration. The large GNF thermal conductivity relative to a base phase change material (PCM) may lead to improved PCM performance when embedded with GNFs. Three different types of GNFs are modeled: platelet, ribbon, and herringbone. Molecular dynamics (MD) simulations are used in this study as a means to predict the thermal conductivity tensor based on atomic behavior. The in-house MD code, Molecular Dynamics in Arbitrary Geometries (MDAG), was updated with the features required to create the predictions. To model both interlayer van-der Waals and intralayer covalent bonding of carbon atoms in GNFs, a combination of the optimized Tersoff potential function for atoms within the layers and a pairwise Lennard-Jones (LJ) potential function to model the interactions between the layers was used. Tests of energy conservation in the NVE ensemble have been performed to validate the employed potential model. Nose-Hoover, Andersen, and Berendsen thermostats were also incorporated into MDAG to enable MD simulations in NVT ensembles, where the volume, number of atoms, and temperature of the system are conserved. Equilibrium MD with Green-Kubo (GK) relations was then employed to extract the thermal conductivity tensor for symmetric GNFs (platelet and ribbon). The thermal conductivity of solid argon at different temperatures was calculated and compared to other studies to validate the GK implementation. Different heat current formulations, as a result of using the three-body Tersoff potential, were considered and the discrepancy in the calculated thermal conductivity values of graphene using each formula was resolved by employing a novel comparative technique that identifies the most accurate formulation. The effect of stacking configuration on the thermal conductivity of platelet and ribbon GNFs

  5. A model for including thermal conduction in molecular dynamics simulations

    NASA Technical Reports Server (NTRS)

    Wu, Yue; Friauf, Robert J.

    1989-01-01

    A technique is introduced for including thermal conduction in molecular dynamics simulations for solids. A model is developed to allow energy flow between the computational cell and the bulk of the solid when periodic boundary conditions cannot be used. Thermal conduction is achieved by scaling the velocities of atoms in a transitional boundary layer. The scaling factor is obtained from the thermal diffusivity, and the results show good agreement with the solution for a continuous medium at long times. The effects of different temperature and size of the system, and of variations in strength parameter, atomic mass, and thermal diffusivity were investigated. In all cases, no significant change in simulation results has been found.

  6. Anisotropic Effective Thermal Conductivity of Particle Beds Under Uniaxial Compression

    NASA Astrophysics Data System (ADS)

    Mo, Jingwen; Garrett, Daniel; Ban, Heng

    2015-11-01

    The effective thermal conductivity (ETC) of particle beds has been shown to be anisotropic under uniaxial compression. The objective of this study is to validate the assumption that vertical and horizontal effective thermal conductivities of particle beds under uniaxial (vertical) compression can be correlated to compressive stresses in each direction. The horizontal compressive pressure, which is perpendicular to the applied compressive pressure, can be calculated with the use of the at-rest pressure coefficient and subsequently used in a modified macro-contact thermal resistance model to predict the horizontal ETC. The vertical ETC is obtained using the same model by substituting the vertical compressive pressure into the macro-contact thermal resistance. The modified model prediction is shown to match well with experimental data of both vertical and horizontal ETCs of particle beds under uniaxial compression in air and vacuum.

  7. Thermal conductivity and electrical resistivity of porous material

    NASA Technical Reports Server (NTRS)

    Koh, J. C. Y.; Fortini, A.

    1971-01-01

    Thermal conductivity and electrical resistivity of porous materials, including 304L stainless steel Rigimesh, 304L stainless steel sintered spherical powders, and OFHC sintered spherical powders at different porosities and temperatures are reported and correlated. It was found that the thermal conductivity and electrical resistivity can be related to the solid material properties and the porosity of the porous matrix regardless of the matrix structure. It was also found that the Wiedermann-Franz-Lorenz relationship is valid for the porous materials under consideration. For high conductivity materials, the Lorenz constant and the lattice component of conductivity depend on the material and are independent of the porosity. For low conductivity, the lattice component depends on the porosity as well.

  8. Thermal conductivity of graphene in corbino membrane geometry.

    PubMed

    Faugeras, Clement; Faugeras, Blaise; Orlita, Milan; Potemski, M; Nair, Rahul R; Geim, A K

    2010-04-27

    Local laser excitation and temperature readout from the intensity ratio of Stokes to anti-Stokes Raman scattering signals are employed to study the thermal properties of a large graphene membrane. The concluded value of the heat conductivity coefficient kappa approximately 600 W/(m.K) is smaller than previously reported but still validates the conclusion that graphene is a very good thermal conductor. PMID:20218666

  9. Relationship between the thermal conductivity and shear viscosity of nanofluids

    NASA Astrophysics Data System (ADS)

    Ding, Yulong; Chen, Haisheng; Musina, Zenfira; Jin, Yi; Zhang, Tianfu; Witharana, Sanjeeva; Yang, Wei

    2010-05-01

    Nanofluids are dilute liquid suspensions of nanoparticles. Nanoparticles and liquid media, in such fluids, mix and interact at the nanoscale. Interactions between nanoparticles in nanofluids can lead to structuring of the particles. This paper discusses how the nanoparticle structuring affects the thermal conductivity and viscosity of nanofluids and how the two transport properties are related through the nanoparticle structuring. It is shown that the experimentally measured thermal conductivity enhancement and the viscosity increase due to the presence of nanoparticles can be interpreted by the aggregation of nanoparticles. It is also shown that modification of the conventional form of the effective medium theory by taking into account nanoparticle structuring information from the rheological analyses gives good agreement with experimentally measured thermal conductivity.

  10. Increased Thermal Conductivity in Metal-Organic Heat Carrier Nanofluids

    NASA Astrophysics Data System (ADS)

    Nandasiri, Manjula I.; Liu, Jian; McGrail, B. Peter; Jenks, Jeromy; Schaef, Herbert T.; Shutthanandan, Vaithiyalingam; Nie, Zimin; Martin, Paul F.; Nune, Satish K.

    2016-06-01

    Metal-organic heat carriers (MOHCs) are recently developed nanofluids containing metal-organic framework (MOF) nanoparticles dispersed in various base fluids including refrigerants (R245Fa) and methanol. Here, we report the synthesis and characterization of MOHCs containing nanoMIL-101(Cr) and graphene oxide (GO) in an effort to improve the thermo-physical properties of various base fluids. MOHC/GO nanocomposites showed enhanced surface area, porosity, and nitrogen adsorption compared with the intrinsic nanoMIL-101(Cr) and the properties depended on the amount of GO added. MIL-101(Cr)/GO in methanol exhibited a significant increase in the thermal conductivity (by approximately 50%) relative to that of the intrinsic nanoMIL-101(Cr) in methanol. The thermal conductivity of the base fluid (methanol) was increased by about 20%. The increase in the thermal conductivity of nanoMIL-101(Cr) MOHCs due to GO functionalization is explained using a classical Maxwell model.

  11. Thermal conductivity at a disordered quantum critical point

    NASA Astrophysics Data System (ADS)

    Hartnoll, Sean A.; Ramirez, David M.; Santos, Jorge E.

    2016-04-01

    Strongly disordered and strongly interacting quantum critical points are difficult to access with conventional field theoretic methods. They are, however, both experimentally important and theoretically interesting. In particular, they are expected to realize universal incoherent transport. Such disordered quantum critical theories have recently been constructed holographically by deforming a CFT by marginally relevant disorder. In this paper we find additional disordered fixed points via relevant disordered deformations of a holographic CFT. Using recently developed methods in holographic transport, we characterize the thermal conductivity in both sets of theories in 1+1 dimensions. The thermal conductivity is found to tend to a constant at low temperatures in one class of fixed points, and to scale as T 0.3 in the other. Furthermore, in all cases the thermal conductivity exhibits discrete scale invariance, with logarithmic in temperature oscillations superimposed on the low temperature scaling behavior. At no point do we use the replica trick.

  12. Experimental investigation of thermal conductivity of magnetic nanofluids

    NASA Astrophysics Data System (ADS)

    Parekh, Kinnari; Lee, H. S.

    2012-06-01

    Two different magnetic nanofluids comprising of magnetite and Mn-Zn ferrite particles were synthesized in light hydrocarbon oil using continuous chemical process. Powder XRD and TEM image show single phase spinel structure with size of 10 nm and 6.7 nm, respectively for magnetite and Mn-Zn ferrite. Thermal conductivity of nanofluids has been studied as a function of volume fraction under transverse magnetic field. Magnetite nanofluid shows 17% enhancements in thermal conductivity for 4.7% volume fraction while Mn-Zn ferrite shows 45% enhancement at 10% volume fraction. In presence of transverse magnetic field the magnetite nanofluids shows further enhancement from 17% to 30% while no change in thermal conductivity has been observed for Mn-Zn ferrite. These results are explained considering the dipolar coupling co-efficient which for magnetite particles favors chain structures.

  13. Effect of variable thermal conductivity on isotherms in Bridgman growth

    NASA Technical Reports Server (NTRS)

    Naumann, R. J.; Lehoczky, S. L.

    1983-01-01

    A change in thermal conductivity associated with melting or solidification can have a profound influence on the isotherms near the solidification interface if the material is being directionally solidified in an ampoule whose walls carry a substantial portion of the heat. This analysis was prompted by a recent discovery that the thermal conductivity of Hg(1-x)CD(x)Te increased dramatically as the material is heated above the solidus curve. An illustrative example is shown in which the sample is approximated as an infinite cylinder with constant but diffferent thermal properties in the solid and melt. The boundary conditions are fixed on the surface by a conductive ampoule in a two-zone Bridgman furnace with an adiabatic region separating the two zones. The effect of the adiabatic zone in this case is to intensify the curvature of the interface rather than to lessen it.

  14. Lattice thermal conductivity of nanograined half-Heusler solid solutions

    SciTech Connect

    Geng, Huiyuan Meng, Xianfu; Zhang, Hao; Zhang, Jian

    2014-05-19

    We report a phenomenological model of atomic weight, lattice constant, temperature, and grain size to calculate the high-temperature lattice thermal conductivity of nanograined solid solutions. The theoretical treatment developed here is reasonably consistent with the experimental results of n-type MNiSn and p-type MCoSb alloys, where M is the combination of Hf, Zr, and Ti. For disordered half-Heusler alloys with moderated grain sizes, we predict that the reduction in lattice thermal conductivity due to grain boundary scattering is independent of the scattering parameter, which characterizes the phonon scattering cross section of point defects. In addition, the lattice thermal conductivity falls off with temperature as T{sup –1∕2} around the Debye temperature.

  15. Increased Thermal Conductivity in Metal-Organic Heat Carrier Nanofluids.

    PubMed

    Nandasiri, Manjula I; Liu, Jian; McGrail, B Peter; Jenks, Jeromy; Schaef, Herbert T; Shutthanandan, Vaithiyalingam; Nie, Zimin; Martin, Paul F; Nune, Satish K

    2016-01-01

    Metal-organic heat carriers (MOHCs) are recently developed nanofluids containing metal-organic framework (MOF) nanoparticles dispersed in various base fluids including refrigerants (R245Fa) and methanol. Here, we report the synthesis and characterization of MOHCs containing nanoMIL-101(Cr) and graphene oxide (GO) in an effort to improve the thermo-physical properties of various base fluids. MOHC/GO nanocomposites showed enhanced surface area, porosity, and nitrogen adsorption compared with the intrinsic nanoMIL-101(Cr) and the properties depended on the amount of GO added. MIL-101(Cr)/GO in methanol exhibited a significant increase in the thermal conductivity (by approximately 50%) relative to that of the intrinsic nanoMIL-101(Cr) in methanol. The thermal conductivity of the base fluid (methanol) was increased by about 20%. The increase in the thermal conductivity of nanoMIL-101(Cr) MOHCs due to GO functionalization is explained using a classical Maxwell model. PMID:27302196

  16. Thermally conductive cementitious grout for geothermal heat pump systems

    DOEpatents

    Allan, Marita

    2001-01-01

    A thermally conductive cement-sand grout for use with a geothermal heat pump system. The cement sand grout contains cement, silica sand, a superplasticizer, water and optionally bentonite. The present invention also includes a method of filling boreholes used for geothermal heat pump systems with the thermally conductive cement-sand grout. The cement-sand grout has improved thermal conductivity over neat cement and bentonite grouts, which allows shallower bore holes to be used to provide an equivalent heat transfer capacity. In addition, the cement-sand grouts of the present invention also provide improved bond strengths and decreased permeabilities. The cement-sand grouts can also contain blast furnace slag, fly ash, a thermoplastic air entraining agent, latex, a shrinkage reducing admixture, calcium oxide and combinations thereof.

  17. Increased Thermal Conductivity in Metal-Organic Heat Carrier Nanofluids

    PubMed Central

    Nandasiri, Manjula I.; Liu, Jian; McGrail, B. Peter; Jenks, Jeromy; Schaef, Herbert T.; Shutthanandan, Vaithiyalingam; Nie, Zimin; Martin, Paul F.; Nune, Satish K.

    2016-01-01

    Metal-organic heat carriers (MOHCs) are recently developed nanofluids containing metal-organic framework (MOF) nanoparticles dispersed in various base fluids including refrigerants (R245Fa) and methanol. Here, we report the synthesis and characterization of MOHCs containing nanoMIL-101(Cr) and graphene oxide (GO) in an effort to improve the thermo-physical properties of various base fluids. MOHC/GO nanocomposites showed enhanced surface area, porosity, and nitrogen adsorption compared with the intrinsic nanoMIL-101(Cr) and the properties depended on the amount of GO added. MIL-101(Cr)/GO in methanol exhibited a significant increase in the thermal conductivity (by approximately 50%) relative to that of the intrinsic nanoMIL-101(Cr) in methanol. The thermal conductivity of the base fluid (methanol) was increased by about 20%. The increase in the thermal conductivity of nanoMIL-101(Cr) MOHCs due to GO functionalization is explained using a classical Maxwell model. PMID:27302196

  18. Dynamical thermal conductivity of the spin Lieb lattice

    NASA Astrophysics Data System (ADS)

    Yarmohammadi, Mohsen

    2016-05-01

    In the ferromagnetic insulator with the Dzyaloshinskii-Moriya interaction (DMI), we have theoretically investigated the dynamical thermal conductivity (DTC). In other words, we have investigated the frequency dependence of thermal conductivity, κ, of the Lieb lattice, a face-centered square lattice, subjected to a time dependence temperature gradient. Using linear response theory and Green's function approach, DTC has been obtained in the context of Heisenberg Hamiltonian. At low frequencies, DTC is found to be monotonically increasing with DMI strength (DMIS), temperature and next-nearest-neighbor (NNN) coupling. Also we have found that DTC includes a peak for different values of temperature, DMIS and NNN coupling. Furthermore we study the temperature dependence of thermal conductivity of Lieb lattice for different values of DMIS, NNN coupling and external magnetic filed. We witness a decrease in DTC with temperature due to the quantum effects in the system.

  19. Upper bound to the thermal conductivity of carbon nanotube pellets

    NASA Astrophysics Data System (ADS)

    Chalopin, Yann; Volz, Sebastian; Mingo, Natalio

    2009-04-01

    Using atomistic Green's function calculations, we find that the phonon thermal conductivity of pellets composed of ˜μm long carbon nanotubes has an upper bound of a few W/m K. This is in striking contrast with the extremely high thermal conductivity of individual nanotubes (˜3000 W/m K). We show that, at room temperature, this upper bound does not depend on the nanotube diameter. Conversely, for low temperatures, an inverse proportionality with nanotube diameter is predicted. We present concrete results as a function of nanotube length and chirality, pellet density, and temperature. These results imply that carbon nanotube pellets belong to the category of thermal insulators, contrasting with the good conducting properties of parallel nanotube arrays, or individual nanotubes.

  20. Thermal Conductivity of AlN-Ethanol Nanofluids

    NASA Astrophysics Data System (ADS)

    Hu, Peng; Shan, Wan-Liang; Yu, Fei; Chen, Ze-Shao

    2008-12-01

    Aluminum nitride (AlN) particles of 20 nm diameter were dispersed into ethanol by a two-step process, first magnetic striation and then ultrasonic agitation. Castor oil was added as a dispersant to improve the stability of the AlN suspension. The thermal conductivities of AlN-ethanol nanofluids were measured by a hot-disk method from 0.5 vol% to 4.0 vol% at temperatures of 273.15 K and 297.15 K. Results show about 20% increase in the thermal conductivity of ethanol with the addition of 4.0 vol% at 273.15 K, and a strong temperature dependence of the thermal conductivity.

  1. Reduction of Thermal Conductivity by Nanoscale 3D Phononic Crystal

    PubMed Central

    Yang, Lina; Yang, Nuo; Li, Baowen

    2013-01-01

    We studied how the period length and the mass ratio affect the thermal conductivity of isotopic nanoscale three-dimensional (3D) phononic crystal of Si. Simulation results by equilibrium molecular dynamics show isotopic nanoscale 3D phononic crystals can significantly reduce the thermal conductivity of bulk Si at high temperature (1000 K), which leads to a larger ZT than unity. The thermal conductivity decreases as the period length and mass ratio increases. The phonon dispersion curves show an obvious decrease of group velocities in 3D phononic crystals. The phonon's localization and band gap is also clearly observed in spectra of normalized inverse participation ratio in nanoscale 3D phononic crystal. PMID:23378898

  2. Reduction of thermal conductivity by nanoscale 3D phononic crystal.

    PubMed

    Yang, Lina; Yang, Nuo; Li, Baowen

    2013-01-01

    We studied how the period length and the mass ratio affect the thermal conductivity of isotopic nanoscale three-dimensional (3D) phononic crystal of Si. Simulation results by equilibrium molecular dynamics show isotopic nanoscale 3D phononic crystals can significantly reduce the thermal conductivity of bulk Si at high temperature (1000 K), which leads to a larger ZT than unity. The thermal conductivity decreases as the period length and mass ratio increases. The phonon dispersion curves show an obvious decrease of group velocities in 3D phononic crystals. The phonon's localization and band gap is also clearly observed in spectra of normalized inverse participation ratio in nanoscale 3D phononic crystal. PMID:23378898

  3. Spectral mapping of thermal conductivity through nanoscale ballistic transport

    NASA Astrophysics Data System (ADS)

    Hu, Yongjie; Zeng, Lingping; Minnich, Austin J.; Dresselhaus, Mildred S.; Chen, Gang

    2015-08-01

    Controlling thermal properties is central to many applications, such as thermoelectric energy conversion and the thermal management of integrated circuits. Progress has been made over the past decade by structuring materials at different length scales, but a clear relationship between structure size and thermal properties remains to be established. The main challenge comes from the unknown intrinsic spectral distribution of energy among heat carriers. Here, we experimentally measure this spectral distribution by probing quasi-ballistic transport near nanostructured heaters down to 30 nm using ultrafast optical spectroscopy. Our approach allows us to quantify up to 95% of the total spectral contribution to thermal conductivity from all phonon modes. The measurement agrees well with multiscale and first-principles-based simulations. We further demonstrate the direct construction of mean free path distributions. Our results provide a new fundamental understanding of thermal transport and will enable materials design in a rational way to achieve high performance.

  4. Spectral mapping of thermal conductivity through nanoscale ballistic transport.

    PubMed

    Hu, Yongjie; Zeng, Lingping; Minnich, Austin J; Dresselhaus, Mildred S; Chen, Gang

    2015-08-01

    Controlling thermal properties is central to many applications, such as thermoelectric energy conversion and the thermal management of integrated circuits. Progress has been made over the past decade by structuring materials at different length scales, but a clear relationship between structure size and thermal properties remains to be established. The main challenge comes from the unknown intrinsic spectral distribution of energy among heat carriers. Here, we experimentally measure this spectral distribution by probing quasi-ballistic transport near nanostructured heaters down to 30 nm using ultrafast optical spectroscopy. Our approach allows us to quantify up to 95% of the total spectral contribution to thermal conductivity from all phonon modes. The measurement agrees well with multiscale and first-principles-based simulations. We further demonstrate the direct construction of mean free path distributions. Our results provide a new fundamental understanding of thermal transport and will enable materials design in a rational way to achieve high performance. PMID:26030656

  5. Estimating interfacial thermal conductivity in metamaterials through heat flux mapping

    SciTech Connect

    Canbazoglu, Fatih M.; Vemuri, Krishna P.; Bandaru, Prabhakar R.

    2015-04-06

    The variability of the thickness as well as the thermal conductivity of interfaces in composites may significantly influence thermal transport characteristics and the notion of a metamaterial as an effective medium. The consequent modulations of the heat flux passage are analytically and experimentally examined through a non-contact methodology using radiative imaging, on a model anisotropic thermal metamaterial. It was indicated that a lower Al layer/silver interfacial epoxy ratio of ∼25 compared to that of a Al layer/alumina interfacial epoxy (of ∼39) contributes to a smaller deviation of the heat flux bending angle.

  6. Thermal conductivity of model zeolites: molecular dynamics simulation study

    NASA Astrophysics Data System (ADS)

    Murashov, Vladimir V.

    1999-02-01

    The thermal conductivity of model zeolites was investigated using non-equilibrium molecular dynamics calculations. This type of calculation was found to overestimate the thermal conductivity of low-density silica polymorphs. A better reproduction of the experimental results was found for zeolites, and this was related to the lower phonon mean free path. The thermal conductivity of framework silicates was shown to be determined primarily by the vibrations of the continuous oxygen sublattice. Thus, the most drastic suppression of the heat transfer was related to alterations of the O-O distances; for example, a sixfold reduction in thermal conductivity compared to that of siliceous LTA zeolite was found for LTA-A1PO4. Framework cations were shown to affect the heat transfer by changing the vibrational modes of the structural building units of the framework and non-framework counter-cations, by disturbing the oxygen sublattice locally and acting as Rayleigh and resonant scatterers. A model assuming the heat transfer to be due only to non-dispersive acoustic phonons failed to reproduce the dependence of the thermal conductivity on the mass of the cations and the unit-cell dimension, thus suggesting a more sophisticated mechanism of heat transfer to be operative in framework materials. The effect of non-framework non-ionic species on the thermal conductivity was shown to be determined by their effect on the characteristics of the oxygen framework vibrations. Thus, repulsive interactions between the oxygen sublattice and Xe8 clusters, reducing the anisotropy and anharmonicity of the oxygen vibrations, give rise to enhanced heat transfer in LTA-SiO2 at ambient conditions.

  7. Mechanisms of nonequilibrium electron-phonon coupling and thermal conductance at interfaces

    SciTech Connect

    Giri, Ashutosh; Gaskins, John T.; Donovan, Brian F.; Szwejkowski, Chester; Hopkins, Patrick E.; Warzoha, Ronald J.; Rodriguez, Mark A.; Ihlefeld, Jon

    2015-03-14

    We study the electron and phonon thermal coupling mechanisms at interfaces between gold films with and without Ti adhesion layers on various substrates via pump-probe time-domain thermoreflectance. The coupling between the electronic and the vibrational states is increased by more than a factor of five with the inclusion of an ∼3 nm Ti adhesion layer between the Au film and the non-metal substrate. Furthermore, we show an increase in the rate of relaxation of the electron system with increasing electron and lattice temperatures induced by the laser power and attribute this to enhanced electron-electron scattering, a transport channel that becomes more pronounced with increased electron temperatures. The inclusion of the Ti layer also results in a linear dependence of the electron-phonon relaxation rate with temperature, which we attribute to the coupling of electrons at and near the Ti/substrate interface. This enhanced electron-phonon coupling due to electron-interface scattering is shown to have negligible influence on the Kapitza conductances between the Au/Ti and the substrates at longer time scales when the electrons and phonons in the metal have equilibrated. These results suggest that only during highly nonequilibrium conditions between the electrons and phonons (T{sub e} ≫ T{sub p}) does electron-phonon scattering at an interface contribute to thermal boundary conductance.

  8. Thermal conductivity of chirality-sorted carbon nanotube networks

    NASA Astrophysics Data System (ADS)

    Lian, Feifei; Llinas, Juan P.; Li, Zuanyi; Estrada, David; Pop, Eric

    2016-03-01

    The thermal properties of single-walled carbon nanotubes (SWNTs) are of significant interest, yet their dependence on SWNT chirality has been, until now, not explored experimentally. Here, we used electrical heating and infrared thermal imaging to simultaneously study thermal and electrical transport in chirality-sorted SWNT networks. We examined solution processed 90% semiconducting, 90% metallic, purified unsorted (66% semiconducting), and as-grown HiPco SWNT films. The thermal conductivities of these films range from 80 to 370 W m-1 K-1 but are not controlled by chirality, instead being dependent on the morphology (i.e., mass and junction density, quasi-alignment) of the networks. The upper range of the thermal conductivities measured is comparable to that of the best metals (Cu and Ag), but with over an order of magnitude lower mass density. This study reveals important factors controlling the thermal properties of light-weight chirality-sorted SWNT films, for potential thermal and thermoelectric applications.

  9. High thermal conductivity of chain-oriented amorphous polythiophene.

    PubMed

    Singh, Virendra; Bougher, Thomas L; Weathers, Annie; Cai, Ye; Bi, Kedong; Pettes, Michael T; McMenamin, Sally A; Lv, Wei; Resler, Daniel P; Gattuso, Todd R; Altman, David H; Sandhage, Kenneth H; Shi, Li; Henry, Asegun; Cola, Baratunde A

    2014-05-01

    Polymers are usually considered thermal insulators, because the amorphous arrangement of the molecular chains reduces the mean free path of heat-conducting phonons. The most common method to increase thermal conductivity is to draw polymeric fibres, which increases chain alignment and crystallinity, but creates a material that currently has limited thermal applications. Here we show that pure polythiophene nanofibres can have a thermal conductivity up to ∼ 4.4 W m(-1) K(-1) (more than 20 times higher than the bulk polymer value) while remaining amorphous. This enhancement results from significant molecular chain orientation along the fibre axis that is obtained during electropolymerization using nanoscale templates. Thermal conductivity data suggest that, unlike in drawn crystalline fibres, in our fibres the dominant phonon-scattering process at room temperature is still related to structural disorder. Using vertically aligned arrays of nanofibres, we demonstrate effective heat transfer at critical contacts in electronic devices operating under high-power conditions at 200 °C over numerous cycles. PMID:24681778

  10. Thermal Conductivity Measurements in Metals at High Pressures and Temperatures.

    NASA Astrophysics Data System (ADS)

    Konopkova, Z.; McWilliams, R. S.; Goncharov, A.

    2014-12-01

    The transport properties of iron and iron alloys at high pressures and temperatures are crucial parameters in planetary evolution models, yet are difficult to determine both theoretically and experimentally. Estimates of thermal conductivity in the Earth's core range from 30 to 150 W/mK, a substantial range leaving many open questions regarding the age of the inner core, the thermal structure of the outer core, and the conditions for a working geodynamo. Most experiments have measured electrical resistivity rather than directly measuring thermal conductivity, and have used models to extrapolate from low-temperature data to the high temperature conditions of the core. Here we present direct, in-situ high-pressure and high-temperature measurements of the thermal conductivity of metals in the diamond-anvil cell. Double-sided continuous laser heating is combined with one-side flash heating of a metallic foil, while the time-resolved temperature is measured from both sides with spectral radiometry in an optical streak camera. Emission and temperature perturbations measured on opposite sides of the foil were modeled using finite element calculations in order to extract thermal diffusivity and conductivity of foils. Results on platinum and iron at high pressures and temperatures will be presented.

  11. Study on Thermal Conductivities of Aromatic Polyimide Aerogels.

    PubMed

    Feng, Junzong; Wang, Xin; Jiang, Yonggang; Du, Dongxuan; Feng, Jian

    2016-05-25

    Polyimide aerogels for low density thermal insulation materials were produced by 4,4'-diaminodiphenyl ether and 3,3',4,4'-biphenyltetracarboxylic dianhydride, cross-linked with 1,3,5-triaminophenoxybenzene. The densities of obtained polyimide aerogels are between 0.081 and 0.141 g cm(-3), and the specific surface areas are between 288 and 322 m(2) g(-1). The thermal conductivities were measured by a Hot Disk thermal constant analyzer. The value of the measured thermal conductivity under carbon dioxide atmosphere is lower than that under nitrogen atmosphere. Under pressure of 5 Pa at -130 °C, the thermal conductivity is the lowest, which is 8.42 mW (m K)(-1). The polyimide aerogels have lower conductivity [30.80 mW (m K)(-1)], compared to the value for other organic foams (polyurethane foam, phenolic foam, and polystyrene foam) with similar apparent densities under ambient pressure at 25 °C. The results indicate that polyimide aerogel is an ideal insulation material for aerospace and other applications. PMID:27149155

  12. Theory of thermal conductivity in the disordered electron liquid

    NASA Astrophysics Data System (ADS)

    Schwiete, G.; Finkel'stein, A. M.

    2016-03-01

    We study thermal conductivity in the disordered two-dimensional electron liquid in the presence of long-range Coulomb interactions. We describe a microscopic analysis of the problem using the partition function defined on the Keldysh contour as a starting point. We extend the renormalization group (RG) analysis developed for thermal transport in the disordered Fermi liquid and include scattering processes induced by the long-range Coulomb interaction in the sub-temperature energy range. For the thermal conductivity, unlike for the electrical conductivity, these scattering processes yield a logarithmic correction that may compete with the RG corrections. The interest in this correction arises from the fact that it violates the Wiedemann-Franz law. We checked that the sub-temperature correction to the thermal conductivity is not modified either by the inclusion of Fermi liquid interaction amplitudes or as a result of the RG flow. We therefore expect that the answer obtained for this correction is final. We use the theory to describe thermal transport on the metallic side of the metal-insulator transition in Si MOSFETs.

  13. Simultaneous specific heat and thermal conductivity measurement of individual nanostructures

    NASA Astrophysics Data System (ADS)

    Zheng, Jianlin; Wingert, Matthew C.; Moon, Jaeyun; Chen, Renkun

    2016-08-01

    Fundamental phonon transport properties in semiconductor nanostructures are important for their applications in energy conversion and storage, such as thermoelectrics and photovoltaics. Thermal conductivity measurements of semiconductor nanostructures have been extensively pursued and have enhanced our understanding of phonon transport physics. Specific heat of individual nanostructures, despite being an important thermophysical parameter that reflects the thermodynamics of solids, has remained difficult to characterize. Prior measurements were limited to ensembles of nanostructures in which coupling and sample inhomogeneity could play a role. Herein we report the first simultaneous specific heat and thermal conductivity measurements of individual rod-like nanostructures such as nanowires and nanofibers. This technique is demonstrated by measuring the specific heat and thermal conductivity of single ∼600–700 nm diameter Nylon-11 nanofibers (NFs). The results show that the thermal conductivity of the NF is increased by 50% over the bulk value, while the specific heat of the NFs exhibits bulk-like behavior. We find that the thermal diffusivity obtained from the measurement, which is related to the phonon mean free path (MFP), decreases with temperature, indicating that the intrinsic phonon Umklapp scattering plays a role in the NFs. This platform can also be applied to one- and two- dimensional semiconductor nanostructures to probe size effects on the phonon spectra and other transport physics.

  14. Thermal conductivity prediction of mesoporous composites (Cu/MCM-41)

    NASA Astrophysics Data System (ADS)

    Huang, Congliang; Feng, Yanhui; Zhang, Xinxin; Wang, Ge

    2014-06-01

    The thermal conductivity of the mesoporous composites Cu/MCM-41 was studied to provide some useful data for promising applications. Both of the lattice and electronic thermal conductivities of Cu nanowires with different size were predicted. With the shell of the matrix MCM-41 and the air confined in the mesochannels considered, the effective thermal conductivity (EffTC) of composites Cu/MCM-41 was obtained. The EffTC shows a great anisotropy. The EffTC along the Z direction (axial of the mesochannel) is much lower than that along directions perpendicular to the axial. It is unnecessary to further raise the filling ratio of Cu nanowires for improving the EffTC along the directions perpendicular to the axial, since the filling ratio 20% is high enough. As long as there is a void space in the mesochannel, the EffTC along the Z direction will be as low as the thermal conductivity of the matrix MCM-41, due to the large thermal resistance of the void space in mesochannels.

  15. CO2 laser debonding of a ceramic bracket bonded with orthodontic adhesive containing thermal expansion microcapsules.

    PubMed

    Saito, Ayano; Namura, Yasuhiro; Isokawa, Keitaro; Shimizu, Noriyoshi

    2015-02-01

    We have been studying an easy bracket debonding method using heating of an orthodontic adhesive containing thermal expansion microcapsules. However, heating with a high-temperature heater brings obvious risks of burns around the oral cavity. Thus, we examined safer and more effective bracket debonding methods. The purpose of this in vitro study was to examine the reduction in debonding strength and the time taken using a bracket bonded with an orthodontic adhesive containing thermal expansion microcapsules and a CO2 laser as the heating method while maintaining safety. Ceramic brackets were bonded to bovine permanent mandibular incisors using bonding materials containing various microcapsule contents (0, 30, and 40 wt%), and the bond strengths were measured after laser irradiation for 4, 5, and 6 s and compared with nonlaser-treated groups. Subsequently, the temperature in the pulp chamber during laser irradiation was measured. After laser irradiation for 5 or 6 s, the bond strengths of the adhesive containing 40 wt% microcapsules were significantly decreased to ∼0.40 - 0.48-fold (4.6-5.5 MPa) compared with the nonlaser groups. The mean temperature rise of the pulp chamber was 4.3 °C with laser irradiation for 6 s, which was less than that required to induce pulp damage. Based on these results, we conclude that the combined use of a CO2 laser and an orthodontic adhesive containing thermal expansion microcapsules can be effective and safe for debonding ceramic brackets with less enamel damage or tooth pain. PMID:24220847

  16. Diffusion, aggregation, and the thermal conductivity of nanofluids

    NASA Astrophysics Data System (ADS)

    Gharagozloo, Patricia E.; Eaton, John K.; Goodson, Kenneth E.

    2008-09-01

    The effects of nanoparticle aggregation and diffusion are difficult to separate using most nanofluid thermal conductivity data, for which the temperature dependence is collected sequentially. The present work captures the instantaneous temperature-dependent thermal conductivity using cross-sectional infrared microscopy and tracks the effects of aggregation and diffusion over time. The resulting data are strongly influenced by spatial and temperature variations in particle size and concentration and are interpreted using a Monte Carlo simulation and rate equations for particle and heat transport. These experiments improve our understanding of nanofluid behavior in practical systems including microscale heat exchangers.

  17. The effective thermal conductivity of an adsorbent - Praseodymium cerium oxide

    NASA Technical Reports Server (NTRS)

    Secary, J. J.; Tong, T. W.

    1992-01-01

    The results of an experimental study to determine the effective thermal conductivity of praseodymium cerium oxide are reported. Praseodymium cerium oxide is an adsorbent used in the development of adsorption compressors for spaceborne refrigeration systems. A guarded-hot-plate apparatus was built for this study. Measurements were carried out for mean temperatures ranging from 300 to 600 C under a vacuum of 10 exp -5 torr. For the temperature range studied, the effective thermal conductivity increased from 0.14 to 0.76 W/m per C with increasing temperature, while displaying a cubic temperature dependency.

  18. Thermal contact conductance between metals in a vacuum environment

    NASA Technical Reports Server (NTRS)

    1965-01-01

    Basic heat transfer data for structural materials used in the Saturn 1B/V 1U component case structural design were obtained. The main emphasis is on thermal contact conductance between dissimilar metallic surfaces, since thermal conductivity values within solids have been sufficiently established previously. The test program outline and test results are described. The following materials were tested: aluminum 6061-T6 (12 samples), aluminum 356 (as cast), almag 35 (as cast), magnesium AZ91C-T4 (4 samples), and mag lithium LA-141 (2 samples).

  19. Anisotropic thermal conduction in cosmological cluster formation simulations

    NASA Astrophysics Data System (ADS)

    Ruszkowski, Mateusz; Parrish, Ian; Brueggen, Marcus

    2009-05-01

    We investigate the role of the magnetothermal instability (MTI) in the cosmological cluster formation simulations. Our simulations self-consistently incorporate the effects of the field amplification by the structure formation (i.e., gravitational collapse and shearing) and by anisotropic thermal conduction, as well as the effects of violent sloshing motions (e.g., due to mergers) that tend to slow down the field growth. We quantify the effects of these processes on the temperature and density profiles, the strength and topology of the magnetic fields as well as the effective thermal conduction in the intarcluster medium.

  20. Viscosity and thermal conductivity coefficients of gaseous and liquid oxygen

    NASA Technical Reports Server (NTRS)

    Hanley, H. J. M.; Mccarty, R. D.; Sengers, J. V.

    1974-01-01

    Equations and tables are presented for the viscosity and thermal conductivity coefficients of gaseous and liquid oxygen at temperatures between 80 K and 400 K for pressures up to 200 atm. and at temperatures between 80 K and 2000 K for the dilute gas. A description of the anomalous behavior of the thermal conductivity in the critical region is included. The tabulated coefficients are reliable to within about 15% except for a region in the immediate vicinity of the critical point. Some possibilities for future improvements of this reliability are discussed.

  1. Obtaining high thermally conductive materials by pressing from the granulate

    NASA Astrophysics Data System (ADS)

    Ditts, A.; Revva, I.; Pautova, Y.; Pogrebenkov, V.; Nepochatov, Y.; Galashov, E.; Tarnovskiy, R.

    2015-01-01

    This work contains results of investigation of obtaining high thermally conductive ceramics from commercial powders of aluminum nitride and yttrium oxide by the method of monoaxial compaction of granulate. The principal scheme of preparation is proposed and technological properties of granulate are defined. Compaction conditions for simple items to use as heat removal in microelectronics and power electrical engineering have been established. Investigations of thermophysical properties of obtained ceramics and its structure by the XRD and SEM methods have been carried out. Ceramics with thermal conductivity from 172 to 174 W/m·K has been obtained as result of this work.

  2. High thermal conductivity lossy dielectric using a multi layer configuration

    DOEpatents

    Tiegs, Terry N.; Kiggans, Jr., James O.

    2003-01-01

    Systems and methods are described for loss dielectrics. A loss dielectric includes at least one high dielectric loss layer and at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. A method of manufacturing a loss dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. The systems and methods provide advantages because the loss dielectrics are less costly and more environmentally friendly than the available alternatives.

  3. Thermal Conductivity Anisotropy of Metasedimentary and Igneous Rocks

    NASA Astrophysics Data System (ADS)

    Davis, M. G.; Chapman, D. S.; van Wagoner, T. M.; Armstrong, P. A.

    2005-12-01

    Thermal conductivity anisotropy was determined for two sets of rocks: a series of sandstones, mudstones, and limey shales of Cretaceous age from Price Canyon, Utah, and metasedimentary argillites and quartzites of Precambrian age from the Big Cottonwood Formation in north central Utah. Additional anisotropy measurements were made on granitic rocks from two Tertiary plutons in Little Cottonwood Canyon, north central Utah. Most conductivity measurements were made in transient mode with a half-space, line-source instrument oriented in two orthogonal directions on a flat face cut perpendicular to bedding. One orientation of the probe yields thermal conductivity parallel to bedding (kmax) directly, the other orientation of the probe measures a product of conductivities parallel and perpendicular to bedding from which the perpendicular conductivity (kperp) is calculated. Some direct measurements of kmax and kperp were made on oriented cylindrical discs using a conventional divided bar device in steady-state mode. Anisotropy is defined as kmax/kperp. The Precambrian argillites from Big Cottonwood Canyon have anisotropy values from 0.8 to 2.1 with corresponding conductivity perpendicular to bedding of 2.0 to 6.2 W m-1 K-1. Anisotropy values for the Price Canyon samples are less than 1.2 with a mean of 1.04 although thermal conductivity perpendicular to bedding for the samples varied from 1.3 to 5.0 W m-1 K-1. The granitic rocks were found to be essentially isotropic with thermal conductivity perpendicular to bedding having a range of 2.2 to 3.2 W m-1 K-1 and a mean of 2.68 W m-1 K-1. The results confirm the observation by Deming (1994) that anisotropy is negligible for rocks having kperp greater than 4.0 W m-1 K-1 and generally increases for low conductivity metamorphic and clay-rich rocks. There is little evidence, however, for his suggestion that thermal conductivity anisotropy of all rocks increases systematically to about 2.5 for low thermal conductivity rocks.

  4. Interfacial thermal conductance of thiolate-protected gold nanospheres

    NASA Astrophysics Data System (ADS)

    Stocker, Kelsey M.; Neidhart, Suzanne M.; Gezelter, J. Daniel

    2016-01-01

    Molecular dynamics simulations of thiolate-protected and solvated gold nanoparticles were carried out in the presence of a non-equilibrium heat flux between the solvent and the core of the particle. The interfacial thermal conductance (G) was computed for these interfaces, and the behavior of the thermal conductance was studied as a function of particle size, ligand flexibility, and ligand chain length. In all cases, thermal conductance of the ligand-protected particles was higher than the bare metal-solvent interface. A number of mechanisms for the enhanced conductance were investigated, including thiolate-driven corrugation of the metal surface, solvent ordering at the interface, solvent-ligand interpenetration, and ligand ordering relative to the particle surface. Only the smallest particles exhibited significant corrugation. All ligands permitted substantial solvent-ligand interpenetration, and ligand chain length has a significant influence on the orientational ordering of interfacial solvent. Solvent-ligand vibrational overlap, particularly in the low frequency range (<80 cm-1), was significantly altered by ligand rigidity, and had direct influence on the interfacial thermal conductance.

  5. Thermal contact conductance of pressed contacts at low temperatures

    NASA Astrophysics Data System (ADS)

    Sunil Kumar, S.; Ramamurthi, K.

    2004-10-01

    The influence of variations of interface temperature in the range 50-300 K on the thermal contact conductance between aluminium and stainless steel joints was determined. Predictions were done by modeling the deformation at the interface for different values of surface finish and contact pressure over the range of interface temperatures. Both elastic and plastic deformation was considered. Experiments were carried out in a closed loop cryostat and the results were shown to compare well with the predictions. A reduction of the interface temperature resulted in a smaller value of thermal contact conductance. Interfacial pressure variation had much lower influence at the smaller value of temperatures. The role of surface roughness at the contact was also seen to be less significant at lower interface temperatures and the zone of hysteresis was smaller. A correlation was developed for estimating thermal contact conductance at joints over this temperature range. An explicit dependence of contact conductance on temperature was not seen to be necessary as long as the changes in the hardness and thermal conductivity of the material with temperature are incorporated in the correlation.

  6. Enhancement of thermal contact conductance of coated junctions

    NASA Astrophysics Data System (ADS)

    Chung, Kee-Chiang; Sheffield, John W.

    1995-04-01

    The thermal contact conductance of coated, contacting aluminum 6061-T651 surfaces was studied experimentally. Four different coating materials, copper, silver, a phase mixture of copper-carbon, and a phase mixture of silver-carbon were evaluated using four different surface roughnesses for each coating material. All of the samples were tested at contact pressures of 125, 250, 375, and 500 kPa. The test results of thermal contact conductance are presented in terms of coating thickness, surface texture, and properties of the coating materials. Using the experimental data, dimensionless expressions were developed that relate the contact conductance of the phase mixture and pure coatings to the coating thickness, the surface roughness, the contact pressure, and the properties of the aluminum substrate. The effects of the surface roughness and of the phase mixture of the coatings on the thermal contact conductance were investigated. In addition, the load cycling effect on the thermal contact conductance was examined for bare aluminum 6061-T651 specimens.

  7. Enhancement of thermal contact conductance of coated junctions

    SciTech Connect

    Chung, K.C.; Sheffield, J.W.

    1995-04-01

    The thermal contact conductance of coated, contacting aluminum 6061-T651 surfaces was studied experimentally. Four different coating materials, copper, silver, a phase mixture of copper-carbon, and a phase mixture of silver-carbon were evaluated using four different surface roughnesses for each coating material. All of the samples were tested at contact pressures of 125, 250, 375, and 500 kPa. The test results of thermal contact conductance are presented in terms of coating thickness, surface texture, and properties of the coating materials. Using the experimental data, dimensionless expressions were developed that relate the contact conductance of the phase mixture and pure coatings to the coating thickness, the surface roughness, the contact pressure, and the properties of the aluminum substrate. The effects of the surface roughness and of the phase mixture of the coatings on the thermal contact conductance were investigated. In addition, the load cycling effect on the thermal contact conductance was examined for bare aluminum 6061-T651 specimens. 15 refs.

  8. Thermal conduction in a mirror-unstable plasma

    NASA Astrophysics Data System (ADS)

    Komarov, S. V.; Churazov, E. M.; Kunz, M. W.; Schekochihin, A. A.

    2016-07-01

    The plasma of galaxy clusters is subject to firehose and mirror instabilities at scales of order the ion Larmor radius. The mirror instability generates fluctuations of magnetic-field strength δB/B ˜ 1. These fluctuations act as magnetic traps for the heat-conducting electrons, suppressing their transport. We calculate the effective parallel thermal conductivity in the ICM in the presence of the mirror fluctuations for different stages of the evolution of the instability. The mirror fluctuations are limited in amplitude by the maximum and minimum values of the field strength, with no large deviations from the mean value. This key property leads to a finite suppression of thermal conduction at large scales. We find suppression down to ≈0.2 of the Spitzer value for the secular phase of the perturbations' growth, and ≈0.3 for their saturated phase. The effect operates in addition to other suppression mechanisms and independently of them. Globally, fluctuations δB/B ˜ 1 can be present on much larger scales, of the order of the scale of turbulent motions. However, we do not expect large suppression of thermal conduction by these, because their scale is considerably larger than the collisional mean free path of the ICM electrons. The obtained suppression of thermal conduction by a factor of ˜5 appears to be characteristic and potentially universal for a weakly collisional mirror-unstable plasma.

  9. Developing a High Thermal Conductivity Fuel with Silicon Carbide Additives

    SciTech Connect

    baney, Ronald; Tulenko, James

    2012-11-20

    The objective of this research is to increase the thermal conductivity of uranium oxide (UO{sub 2}) without significantly impacting its neutronic properties. The concept is to incorporate another high thermal conductivity material, silicon carbide (SiC), in the form of whiskers or from nanoparticles of SiC and a SiC polymeric precursor into UO{sub 2}. This is expected to form a percolation pathway lattice for conductive heat transfer out of the fuel pellet. The thermal conductivity of SiC would control the overall fuel pellet thermal conductivity. The challenge is to show the effectiveness of a low temperature sintering process, because of a UO{sub 2}-SiC reaction at 1,377°C, a temperature far below the normal sintering temperature. Researchers will study three strategies to overcome the processing difficulties associated with pore clogging and the chemical reaction of SiC and UO{sub 2} at temperatures above 1,300°C:

  10. High conductivity, low cost aluminum composite for thermal management

    SciTech Connect

    Sommer, J.L.

    1997-04-01

    In order to produce an inexpensive packaging material that exhibits high thermal conductivity and low CTE, Technical Research Associates, Inc. (TRA) has shown in Phase I the feasibility of incorporating natural flake graphite in an aluminum matrix. TRA has developed a proprietary coating technique where graphite flakes have been coated with a thin layer of molybdenum/molybdenum carbide (approximately 0.2 microns). This barrier coating can protect the graphite flake from chemical reaction and high temperature degradation in molten aluminum silicon alloys. Methods to successfully vacuum infiltrate coated flake with molten aluminum alloys were developed. The resulted metal matrix composites exhibited lower CTE than aluminum metal. The CTE of the composites were significantly lower than aluminum and its alloys. The CTE can potentially be tailored for specific applications. The in plane thermal conductivity was higher than the aluminum matrix alloy. The thermal conductivity and CTE of the composite may be significantly improved by improving the bond strength of the molybdenum coating on the graphite flake. The flake can potentially be incorporated in the molten aluminum and pressure die cast to align the flakes within the aluminum matrix. By preferentially aligning high conductivity graphite flakes within a plane or direction, the thermal conductivity of the resulting composite will be above pure aluminum in the alignment direction.

  11. Low Temperature Thermal Conductivity in Ni-doped Bi-2212.

    NASA Astrophysics Data System (ADS)

    Movshovich, Roman; Hubbard, Margaret A.; Salamon, Myron B.; Yoshizaki, Ryozo

    1997-03-01

    Non-magnetic impurities in HTS materials are expected to contribute to electrical and thermal conductivity via formation of the electronic impurity states. Universal electrical conductivity(P.A. Lee, Phys. Rev. Lett.) 71, 1887 (1993). and universal linear-in-temperature thermal conductivity(M. L. Graf, S-K. Yip, J. Sauls, and D. Rainer, Phys. Rev. B) 53, 15147 (1996). is predicted below the cross-over energy scale γ which is the width of the impurity generated band. We performed experimental investigation of thermal conductivity in Ni-doped Bi_2Sr_2CaCu_208 (Bi-2212) with Ni-concentration up to 2.4%, for temperature between 50 mK and 2 K. We do not observe a linear-in-temperature regime in the temperature range studied. Instead, thermal conductivity can be described well by a power law κ ∝ A× T^α with α between 12\\over 3 and 13\\over 4 over the whole temperature range from 50 mK to 2 K. Possible reconciliation of our data with theoretical prediction may lie in the narrowness of the impurity band generated by the weak-scattering Ni dopants.

  12. Error and uncertainty in Raman thermal conductivity measurements

    SciTech Connect

    Thomas Edwin Beechem; Yates, Luke; Graham, Samuel

    2015-04-22

    We investigated error and uncertainty in Raman thermal conductivity measurements via finite element based numerical simulation of two geometries often employed -- Joule-heating of a wire and laser-heating of a suspended wafer. Using this methodology, the accuracy and precision of the Raman-derived thermal conductivity are shown to depend on (1) assumptions within the analytical model used in the deduction of thermal conductivity, (2) uncertainty in the quantification of heat flux and temperature, and (3) the evolution of thermomechanical stress during testing. Apart from the influence of stress, errors of 5% coupled with uncertainties of ±15% are achievable for most materials under conditions typical of Raman thermometry experiments. Error can increase to >20%, however, for materials having highly temperature dependent thermal conductivities or, in some materials, when thermomechanical stress develops concurrent with the heating. A dimensionless parameter -- termed the Raman stress factor -- is derived to identify when stress effects will induce large levels of error. Together, the results compare the utility of Raman based conductivity measurements relative to more established techniques while at the same time identifying situations where its use is most efficacious.

  13. Error and uncertainty in Raman thermal conductivity measurements

    DOE PAGESBeta

    Thomas Edwin Beechem; Yates, Luke; Graham, Samuel

    2015-04-22

    We investigated error and uncertainty in Raman thermal conductivity measurements via finite element based numerical simulation of two geometries often employed -- Joule-heating of a wire and laser-heating of a suspended wafer. Using this methodology, the accuracy and precision of the Raman-derived thermal conductivity are shown to depend on (1) assumptions within the analytical model used in the deduction of thermal conductivity, (2) uncertainty in the quantification of heat flux and temperature, and (3) the evolution of thermomechanical stress during testing. Apart from the influence of stress, errors of 5% coupled with uncertainties of ±15% are achievable for most materialsmore » under conditions typical of Raman thermometry experiments. Error can increase to >20%, however, for materials having highly temperature dependent thermal conductivities or, in some materials, when thermomechanical stress develops concurrent with the heating. A dimensionless parameter -- termed the Raman stress factor -- is derived to identify when stress effects will induce large levels of error. Together, the results compare the utility of Raman based conductivity measurements relative to more established techniques while at the same time identifying situations where its use is most efficacious.« less

  14. Measurement of the thermal conductivity of dielectric thin solid films with a thermal comparator

    SciTech Connect

    Amsden, C.A.; Gilman, S.E.; Jacobs, S.D.; Torok, J.S.

    1988-04-01

    Low thermal conductivity has important implications for electric and optical applications, where heat deposited in a thin layer must be dissipated to prevent damage. Models which account for thermal transport in thin film structures may have no predictive value if they employ bulk conductivity data. Most techniques utilized to measure the thermal conductivity of thin solid films are difficult and time consuming. The method we have developed is relatively rapid, nondestructive, and is capable of evaluating the samples in a conventional film on substrate geometry. Our thermal conductivity apparatus consists of a control and readout module, signal processing equipment, and an environmentally isolated sample chamber enclosing a sample stage. The commercial unit was converted into a high precision device by temperature controlling both the samples and the sample stage, and by performing averaging of the output signal. The thermal conductivity values obtained are below those of bulk solids. In addition, the conductivities seem to increase with increasing film thickness. Titania seems to have a higher thermal conductivity when deposited by ion-beam sputtering rather than electron-beam evaporation. Some of the electron-beam films were crazed, indicating high levels of stress. The effect of stress and crazing on thermal conductivity is not readily apparent. 11 refs., 1 fig., 1 tab.

  15. Pretest Caluculations of Temperature Changes for Field Thermal Conductivity Tests

    SciTech Connect

    N.S. Brodsky

    2002-07-17

    A large volume fraction of the potential monitored geologic repository at Yucca Mountain may reside in the Tptpll (Tertiary, Paintbrush Group, Topopah Spring Tuff, crystal poor, lower lithophysal) lithostratigraphic unit. This unit is characterized by voids, or lithophysae, which range in size from centimeters to meters. A series of thermal conductivity field tests are planned in the Enhanced Characterization of the Repository Block (ECRB) Cross Drift. The objective of the pretest calculation described in this document is to predict changes in temperatures in the surrounding rock for these tests for a given heater power and a set of thermal transport properties. The calculation can be extended, as described in this document, to obtain thermal conductivity, thermal capacitance (density x heat capacity, J {center_dot} m{sup -3} {center_dot} K{sup -1}), and thermal diffusivity from the field data. The work has been conducted under the ''Technical Work Plan For: Testing and Monitoring'' (BSC 2001). One of the outcomes of this analysis is to determine the initial output of the heater. This heater output must be sufficiently high that it will provide results in a reasonably short period of time (within several weeks or a month) and be sufficiently high that the heat increase is detectable by the instruments employed in the test. The test will be conducted in stages and heater output will be step increased as the test progresses. If the initial temperature is set too high, the experiment will not have as many steps and thus fewer thermal conductivity data points will result.

  16. Estimating thermal diffusivity and specific heat from needle probe thermal conductivity data

    USGS Publications Warehouse

    Waite, W.F.; Gilbert, L.Y.; Winters, W.J.; Mason, D.H.

    2006-01-01

    Thermal diffusivity and specific heat can be estimated from thermal conductivity measurements made using a standard needle probe and a suitably high data acquisition rate. Thermal properties are calculated from the measured temperature change in a sample subjected to heating by a needle probe. Accurate thermal conductivity measurements are obtained from a linear fit to many tens or hundreds of temperature change data points. In contrast, thermal diffusivity calculations require a nonlinear fit to the measured temperature change occurring in the first few tenths of a second of the measurement, resulting in a lower accuracy than that obtained for thermal conductivity. Specific heat is calculated from the ratio of thermal conductivity to diffusivity, and thus can have an uncertainty no better than that of the diffusivity estimate. Our thermal conductivity measurements of ice Ih and of tetrahydrofuran (THF) hydrate, made using a 1.6 mm outer diameter needle probe and a data acquisition rate of 18.2 pointss, agree with published results. Our thermal diffusivity and specific heat results reproduce published results within 25% for ice Ih and 3% for THF hydrate. ?? 2006 American Institute of Physics.

  17. Development of thermal rectifier using unusual electron thermal conductivity of icosahedral quasicrystals

    NASA Astrophysics Data System (ADS)

    Takeuchi, Tsunehiro

    2015-03-01

    The bulk thermal rectifiers usable at high temperature were developed using the unusual increase of electron thermal conductivity of icosahedral quasicrystals (ICQ's) at high temperature. Our previously performed analyses in terms of linear response theory suggested that the unusual increase of electron thermal conductivity of ICQ was brought about by the synergy effect of quasiperiodicity and narrow pseudogap at the Fermi level. Since the linear response theory suggests that the unusual increase of electron thermal conductivity is coupled with the small magnitude of Seebeck coefficient, the composition of Al-Cu-Fe ICQ, where the thermal conductivity shows the most significant increase with increasing temperature, was determined with a great help of Seebeck coefficient measurements. Consequently obtained Al61.5Cu26.5Fe12.0 ICQ, which was characterized by the small magnitude of Seebeck coefficient, possessed 9 times larger value of thermal conductivity at 1000 K than that observed at 300 K. The increasing tendency of electron thermal conductivity with increasing temperature was further enhanced by means of small amount of Re substitution for Fe. This substitution definitely reduced the lattice thermal conductivity while the electron thermal conductivity was kept unchanged. The lattice thermal conductivity was reduced by 35 % under the presence of 0.5 at.% Re, and the thermal conductivity at 1000 K consequently became about 11 times larger than that at 300 K. The thermal rectifiers were constructed using our newly developed ICQ (Al61.5Cu26.5Fe12.0 or Al61.0Si0.5Cu26.5Fe11.5Re0.5) together with one of the selected materials (Si, Al2O3, CuGeTe2 or Ag2Te) that possess thermal conductivity decreasing with increasing temperature. The heat current flowing in the rectifiers was confirmed to show significant direction dependence. The consequently obtained TRR =|Jlarge|/ |Jsmall | for the composite consisting of

  18. Thermal Conductivity of Spin-Polarized Liquid {sup 3}He

    SciTech Connect

    Sawkey, D.; Puech, L.; Wolf, P.E.

    2006-06-02

    We present the first measurements of the thermal conductivity of spin-polarized normal liquid {sup 3}He. Using the rapid melting technique to produce nuclear polarizations up to 0.7, and a vibrating wire both as a heater and a thermometer, we show that, unlike the viscosity, the conductivity increases much less than predicted for s-wave scattering. We suggest that this might be due to a small probability for head-on collisions between quasiparticles.

  19. An analytical solution for transverse thermal conductivities of unidirectional fibre composites with thermal barrier

    NASA Astrophysics Data System (ADS)

    Zou, Mingqing; Yu, Boming; Zhang, Duanming

    2002-08-01

    In this paper, an analytical expression for transverse thermal conductivities of unidirectional fibre composites with thermal barrier is derived based on the electrical analogy technique and on the cylindrical filament-square packing array unit cell model (C-S model). The present analytical expressions both with and without thermal barrier between fibre and matrix are presented. The present theoretical predictions without thermal barrier are found to be in excellent agreement with the existing analytical model and nomogram from the finite difference method (FDM), and in good agreement with existing experimental data. Furthermore, the present analytical predictions with thermal barrier can best fit the experimental data and can provide a higher accuracy than the finite element method (FEM). The validity of the present analytical solution is thus verified for transverse thermal conductivities of unidirectional fibre composites with thermal barrier.

  20. Effective thermal conductivity and thermal diffusivity of nanofluids containing spherical and cylindrical nanoparticles

    NASA Astrophysics Data System (ADS)

    Zhang, Xing; Gu, Hua; Fujii, Motoo

    2006-08-01

    This paper reports on measurements of the effective thermal conductivity and thermal diffusivity of various nanofluids using the transient short-hot-wire technique. To remove the influences of the static charge and electrical conductance of the nanoparticles on measurement accuracy, the short-hot-wire probes are carefully coated with a pure Al2O3 thin film and only those probes that are coated well are used for measurements. In the present study, the effective thermal conductivities and thermal diffusivities of Au/toluene, Al2O3/water, and carbon nanofiber (CNF)/water nanofluids are measured and the effects of the volume fraction and thermal conductivity of the nanoparticles and temperature are clarified. The average diameters of Au and Al2O3 spherical particles are 1.65 and 20nm, respectively. The average length and diameter of CNFs are 10μm and 150nm, respectively. The uncertainty of the present measurements is estimated to be within 1% for the thermal conductivity and 5% for the thermal diffusivity. The measured results demonstrate that the effective thermal conductivities of the nanofluids show no anomalous enhancements and can be predicted accurately by the model equation of Hamilton and Crosser [Ind. Eng. Chem. Fundam. 1, 187 (1962)] for the spherical nanoparticles and by the unit-cell model equation of Yamada and Ota [Waerme-Stoffuebertrag. 13, 27 (1980)] for carbon nanofibers.

  1. Boundary scattering effect on the thermal conductivity of nanowires

    NASA Astrophysics Data System (ADS)

    Zhou, Yanguang; Yao, Yagang; Hu, Ming

    2016-07-01

    Tuning the surface boundary structures of crystal nanowires (NWs) is one of the most popular ways to control the thermal conductivity of NWs. In this paper, non-equilibrium molecular dynamic simulations (NEMD) and time domain normal mode analysis (TDNMA) are performed to investigate the thermal transport properties of Ar (length of 52.9 nm, width of 4.23 nm) and Ge (56.5 nm long and 4.52 nm wide) NWs with different surface boundary structures. Results show that both the total and modal thermal conductivity have a dramatic difference among the NWs with the same diameter (the maximal and minimal thermal conductivity of Ar (Ge) NWs are 1.25 (15.3) and 0.60 (5.64) W/mK, respectively), which suggests the efficiency of nanoscale thermoelectric devices and heat dissipation devices can be largely tuned by only changing the boundary orientation. The fundamental mechanism responsible for such a discrepancy is found to mainly originate from different phonon group velocity (combined with phonon relaxation time for Ar NWs). The results are quite helpful for understanding the boundary scattering effect on thermal transport and also facilitating the design of nanoscale devices by tailoring the boundary structures.

  2. Analysis of thermal conductivity of polymeric nanocomposites under mechanical loading

    NASA Astrophysics Data System (ADS)

    Yu, Suyoung; Yang, Seunghwa; Cho, Maenghyo

    2013-12-01

    When the plastic deformation is applied to neat polymer, the polymer chains are aligned and the thermal conductivity of neat polymer increases linearly along the loading direction. However, the thermal conductivity change of nanocomposites consisting of polymer matrix and nanofillers during plastic deformation is not simple. The volume fraction and size of nanofillers scarcely affect the structural change of polymer chains during the plastic deformation. In this study, the structural change of polymeric materials according to the mechanical loading and its effect on the thermal transport properties are investigated through a molecular dynamics simulation. To investigate the effects of nanofiller, its volume fraction, and size on the thermal transport properties, the unit cells of neat amorphous nylon 6 and nanocomposites consisting of amorphous nylon 6 matrix and spherical silica particles are prepared. The molecular unit cells are uniaxially stretched by applying constant strain along the loading directions. Then, non-equilibrium molecular dynamics (NEMD) simulations are performed to estimate the thermal conductivities during plastic deformation. The alignment of polymer chains is analyzed by tracing the orientation correlation function of each polymer molecule and the free volume change during the mechanical loading is also analyzed.

  3. Comparison of different methods for measuring thermal conductivities

    SciTech Connect

    Hartung, D.; Gather, F.; Klar, P. J.

    2012-06-26

    Two different methods for the measurement of the thermal conductivity have been applied to a glass (borosilicate) bulk sample. The first method was in the steady-state using an arrangement of gold wires on the sample to create a thermal gradient and to measure the temperatures locally. This allows one to calculate the in-plane thermal conductivity of the sample. The same wire arrangement was also used for a 3{omega}-measurement of the direction-independent bulk thermal conductivity. The 3{omega}-approach is based on periodical heating and a frequency dependent analysis of the temperature response. The results of both methods are in good agreement with each other for this isotropic material, if thermal and radiative losses are accounted for. Our results demonstrate that especially in the case of thin-film measurements, finite element analysis has to be applied to correct for heat losses due to geometry and radiation. In this fashion, the wire positions can be optimized in order to minimize measurement errors.

  4. Sub-amorphous thermal conductivity in ultrathin crystalline silicon nanotubes.

    PubMed

    Wingert, Matthew C; Kwon, Soonshin; Hu, Ming; Poulikakos, Dimos; Xiang, Jie; Chen, Renkun

    2015-04-01

    Thermal transport behavior in nanostructures has become increasingly important for understanding and designing next generation electronic and energy devices. This has fueled vibrant research targeting both the causes and ability to induce extraordinary reductions of thermal conductivity in crystalline materials, which has predominantly been achieved by understanding that the phonon mean free path (MFP) is limited by the characteristic size of crystalline nanostructures, known as the boundary scattering or Casimir limit. Herein, by using a highly sensitive measurement system, we show that crystalline Si (c-Si) nanotubes (NTs) with shell thickness as thin as ∼5 nm exhibit a low thermal conductivity of ∼1.1 W m(-1) K(-1). Importantly, this value is lower than the apparent boundary scattering limit and is even about 30% lower than the measured value for amorphous Si (a-Si) NTs with similar geometries. This finding diverges from the prevailing general notion that amorphous materials represent the lower limit of thermal transport but can be explained by the strong elastic softening effect observed in the c-Si NTs, measured as a 6-fold reduction in Young's modulus compared to bulk Si and nearly half that of the a-Si NTs. These results illustrate the potent prospect of employing the elastic softening effect to engineer lower than amorphous, or subamorphous, thermal conductivity in ultrathin crystalline nanostructures. PMID:25758163

  5. Thermal conductivity and rectification study of restructured Graphene

    NASA Astrophysics Data System (ADS)

    Arora, Anuj

    Electronics' miniaturization, has led to search for better thermal management techniques and discovery of important transport phenomenon. Thermal rectification, directionally preferential heat transport analogous to electrical diode, is one such technique, garnering tremendous interest. Its possibility has been explored through structural asymmetry, introducing a differential phonon density of states in hot and cold regions. As of now, mass and shape asymmetries have been studied, both experimentally and theoretically. However, strict requirements of material length being shorter than phonon mean free path and phonon coherence preservation at surface, makes connecting two materials with different temperature-dependent thermal conductivities, a more natural approach. To avoid resultant thermal boundary resistance and integration complexities, we achieve the affect in single material, by restructuring a region of Graphene by introducing defects. The asymmetry impedes ballistic phonon transport, modulating temperature dependence of thermal conductivity in the two regions. We perform deviational Monte Carlo simulations based on Energy-based formulation to microscopically investigate phonon transport, possibility and optimal conditions for thermal rectification. The proposed method uses phonon properties obtained from first principle, treat phonon-boundary scattering explicitly with properties drawn from Bose-Einstein Distribution.

  6. Non-diffusive thermal conductivity in semiconductors at room temperature

    NASA Astrophysics Data System (ADS)

    Maznev, Alexei; Johnson, Jeremy; Eliason, Jeffrey; Nelson, Keith; Minnich, Austin; Collins, Kimberlee; Chen, Gang; Cuffe, John; Kehoe, Timothy; Sotomayor Torres, Clivia

    2012-02-01

    The ``textbook'' value of phonon mean free path (MFP) in silicon at room temperature is ˜40 nm. However, a large contribution to thermal conductivity comes from low-frequency phonons with much longer MFPs. We find that heat transport in semiconductors such as Si and GaAs significantly deviates from the Fourier law at distances much longer than previously thought, >=1 μm at room temperature and above. We use the laser-induced transient thermal grating technique in which absorption of crossed laser pulses in a sample sets up a sinusoidal temperature profile monitored via diffraction of a probe laser beam. By changing the period of the thermal grating we vary the thermal transport distance within the range ˜1-10 μm. In measurements performed on thin free-standing Si membranes and on bulk GaAs the thermal grating decay time deviates from the expected quadratic dependence on the grating period, thus providing model-independent evidence of non-diffusive transport. The simplicity of the experimental configuration permits analytical treatment of non-equilibrium phonon transport with the Boltzmann transport equation. Our analysis shows that at small grating periods the effective thermal conductivity is reduced due to diminishing contributions of ``ballistic'' low-frequency phonons with long MFPs.

  7. The effect of thermal aging on the thermal conductivity of plasma sprayed and EB-PVD thermal barrier coatings

    SciTech Connect

    Dinwiddie, R.B.; Beecher, S.C.; Porter, W.D.; Nagaraj, B.A.

    1996-05-01

    Thermal barrier coatings (TBCs) applied to the hot gas components of turbine engines lead to enhanced fuel efficiency and component reliability. Understanding the mechanisms which control the thermal transport behavior of the TBCs is of primary importance. Electron beam-physical vapor deposition (EV-PVD) and air plasma spraying (APS) are the two most commonly used coating techniques. These techniques produce coatings with unique microstructures which control their performance and stability. The density of the APS coatings was controlled by varying the spray parameters. The low density APS yttria-partially stabilized zirconia (yttria-PSZ) coatings yielded a thermal conductivity that is lower than both the high density APS coatings and the EB-PVD coatings. The thermal aging of both fully and partially stabilized zirconia are compared. The thermal conductivity of the coatings permanently increases upon exposure to high temperatures. These increases are attributed to microstructural changes within the coatings. This increase in thermal conductivity can be modeled using a relationship which depends on both the temperature and time of exposure. Although the EB-PVD coatings are less susceptible to thermal aging effects, results suggest that they typically have a higher thermal conductivity than APS coatings before thermal aging. The increases in thermal conductivity due to thermal aging for plasma sprayed partially stabilized zirconia have been found to be less than for plasma sprayed fully stabilized zirconia coatings.

  8. Investigation of thermal conductivity and tribological properties of nanofluids

    NASA Astrophysics Data System (ADS)

    Gara, Luan

    Nanofluids are engineered by dispersing and stably suspending nanoparticles with typical length on the order of 1--50 nm in traditional fluids. In the past decade, scientists and engineers have made great progresses in finding that a very small amount (< 1 vol %) of dispersed nanoparticles can provide dramatic improvement in the thermal properties of the base fluids. Therefore, numerous mechanisms and models have been proposed to account for the thermal enhancement of nanofluids. The molecular dynamics (MD) simulation has become an important tool in the study of dynamic properties of liquids, molecular solutions, and macromolecules. Therefore, MD simulation is a very helpful tool to model the enhanced thermal conduction and predict thermal conductivities of nanofluids. In recent years, investigations on the tribological properties of nanofluids have also been carried out. Some papers have reported that nanofluids are effective in reducing wear and friction. The mechanisms of friction reduction and anti-wear of nanoparticles in lubricants have been reported as colloidal effect, rolling effect, protective film, and third body. The objective of this research is to study the thermal conductivity and tribological properties of nanofluids. The thermal conductivity of nanofluids was investigated theoretically through MD simulation. Nanodiamond was selected as the nanoparticle and octane as the base oil. The Large-scale Atomic-Molecular Massively Parallel Simulator (LAMMPS) was used. The effects of the particle size, shape and concentration on the thermal conductivity of nanofluids was investigated. The thermal conductivity of oil based nanofluids with nanodiamond particles was also measured experimentally using transient hot-wire method. The tribological properties of nanofluids were studied through experimental investigation using commercially available nanopowders and nanofluids. Both water based and oil based nanofluids were investigated. A Universal Micro

  9. Thermal-conductivity measurements of tungsten-fiber-reinforced superalloy composites using a thermal-conductivity comparator

    NASA Technical Reports Server (NTRS)

    Westfall, L. J.; Winsa, E. A.

    1979-01-01

    The thermal conductivity (TC) of tungsten-fiber-reinforced superalloys was determined for two composite systems by using a thermal conductivity standard from the National Bureau of Standards and a comparator and technique developed for that purpose. The results were compared with TC data for the nickel-base alloy MAR-M200. The technique lends itself to applications involving thin specimens, such as thin-walled turbine blades. The TC's of the composite systems were considerably higher in both the longitudinal and transverse directions than that of the monolithic superalloys used as the matrices.

  10. Boosting magnetic reconnection by viscosity and thermal conduction

    NASA Astrophysics Data System (ADS)

    Minoshima, Takashi; Miyoshi, Takahiro; Imada, Shinsuke

    2016-07-01

    Nonlinear evolution of magnetic reconnection is investigated by means of magnetohydrodynamic simulations including uniform resistivity, uniform viscosity, and anisotropic thermal conduction. When viscosity exceeds resistivity (the magnetic Prandtl number P r m > 1 ), the viscous dissipation dominates outflow dynamics and leads to the decrease in the plasma density inside a current sheet. The low-density current sheet supports the excitation of the vortex. The thickness of the vortex is broader than that of the current for P r m > 1 . The broader vortex flow more efficiently carries the upstream magnetic flux toward the reconnection region, and consequently, boosts the reconnection. The reconnection rate increases with viscosity provided that thermal conduction is fast enough to take away the thermal energy increased by the viscous dissipation (the fluid Prandtl number Pr < 1). The result suggests the need to control the Prandtl numbers for the reconnection against the conventional resistive model.

  11. Thermal Conductivity of Powder Insulations for Cryogenic Storage Vessels

    NASA Astrophysics Data System (ADS)

    Choi, Y. S.; Barrios, M. N.; Chang, H. M.; Van Sciver, S. W.

    2006-04-01

    The objective of the present work was to develop a precise instrument for measuring the thermal conductivity of powder insulating materials over a temperature range from 20 K to near room temperature. The instrument consists of two concentric copper cylinders with the annular space filled with the insulating material. The outer cylinder is thermally anchored to the coldhead of a single stage Gifford-McMahon cryocooler, while the inner copper cylinder is used for generating uniform heat flux through the insulating material. The temperature of both cylinders is measured at several locations to ensure uniform boundary conditions. The entire apparatus is wrapped in multi-layer insulation and suspended in a vacuum cryostat that provides an insulating environment. For a supplied heat flux, the temperature difference between the two cylinders is measured in steady state, from which the thermal conductivity of powder insulation is calculated and compared with published results.

  12. Homogeneous Thermal Cloak with Constant Conductivity and Tunable Heat Localization

    PubMed Central

    Han, Tiancheng; Yuan, Tao; Li, Baowen; Qiu, Cheng-Wei

    2013-01-01

    Invisible cloak has long captivated the popular conjecture and attracted intensive research in various communities of wave dynamics, e.g., optics, electromagnetics, acoustics, etc. However, their inhomogeneous and extreme parameters imposed by transformation-optic method will usually require challenging realization with metamaterials, resulting in narrow bandwidth, loss, polarization-dependence, etc. In this paper, we demonstrate that thermodynamic cloak can be achieved with homogeneous and finite conductivity only employing naturally available materials. It is demonstrated that the thermal localization inside the coating layer can be tuned and controlled robustly by anisotropy, which enables an incomplete cloak to function perfectly. Practical realization of such homogeneous thermal cloak has been suggested by using two naturally occurring conductive materials, which provides an unprecedentedly plausible way to flexibly realize thermal cloak and manipulate heat flow with phonons. PMID:23549139

  13. Homogeneous thermal cloak with constant conductivity and tunable heat localization.

    PubMed

    Han, Tiancheng; Yuan, Tao; Li, Baowen; Qiu, Cheng-Wei

    2013-01-01

    Invisible cloak has long captivated the popular conjecture and attracted intensive research in various communities of wave dynamics, e.g., optics, electromagnetics, acoustics, etc. However, their inhomogeneous and extreme parameters imposed by transformation-optic method will usually require challenging realization with metamaterials, resulting in narrow bandwidth, loss, polarization-dependence, etc. In this paper, we demonstrate that thermodynamic cloak can be achieved with homogeneous and finite conductivity only employing naturally available materials. It is demonstrated that the thermal localization inside the coating layer can be tuned and controlled robustly by anisotropy, which enables an incomplete cloak to function perfectly. Practical realization of such homogeneous thermal cloak has been suggested by using two naturally occurring conductive materials, which provides an unprecedentedly plausible way to flexibly realize thermal cloak and manipulate heat flow with phonons. PMID:23549139

  14. Analysis of measurements of the thermal conductivity of liquid urania

    SciTech Connect

    Fink, J.K.; Leibowitz, L.

    1984-09-17

    An analysis was performed of the three existing measurements of the thermal conductivity and thermal diffusivity of molten uranium dioxide. A transient heat transfer code (THTB) was used for this analysis. A much smaller range of values for thermal conductivity than originally reported was found: the original values ranged from 2.4 to 11 W . m/sup -1/ . K/sup -1/, with a mean of 7.3 W . m/sup -1/ . K/sup -1/, whereas the recalculated values ranged from 4.5 to 6.75 W . m/sup -1/ . K/sup -1/, with a mean of 5.6 W . m/sup -1/ . K/sup -1/.

  15. Thermal conductance measurement of windows: An innovative radiative method

    SciTech Connect

    Arpino, F.; Buonanno, G.; Giovinco, G.

    2008-09-15

    Heat transfer through window surfaces is one of the most important contributions to energy losses in buildings. Therefore, great efforts are made to design new window frames and glass assemblies with low thermal conductance. At the same time, it is also necessary to develop accurate measurement techniques in thermal characterisation of the above-mentioned building components. In this paper the authors show an innovative measurement method mainly based on radiative heat transfer (instead of the traditional convective one) which allows window thermal conductance measurements with corresponding uncertainty budget evaluation. The authors used the 3D finite volume software FLUENT {sup registered} to design the experimental apparatus. The numerical results have been employed for the system optimisation and metrological characterisation. (author)

  16. Thermal Conductivity of Polyimide/Carbon Nanofiller Blends

    NASA Technical Reports Server (NTRS)

    Ghose, S.; Watson, K. A.; Delozier, D. M.; Working, D. C.; Connell, J. W.; Smith, J. G.; Sun, Y. P.; Lin, Y.

    2007-01-01

    In efforts to improve the thermal conductivity (TC) of Ultem(TM) 1000, it was compounded with three carbon based nano-fillers. Multiwalled carbon nanotubes (MWCNT), vapor grown carbon nanofibers (CNF) and expanded graphite (EG) were investigated. Ribbons were extruded to form samples in which the nano-fillers were aligned. Samples were also fabricated by compression molding in which the nano-fillers were randomly oriented. The thermal properties were evaluated by DSC and TGA, and the mechanical properties of the aligned samples were determined by tensile testing. The degree of dispersion and alignment of the nanoparticles were investigated with high-resolution scanning electron microscopy. The thermal conductivity of the samples was measured in both the direction of alignment as well as perpendicular to that direction using the Nanoflash technique. The results of this study will be presented.

  17. Silicate bonding properties: Investigation through thermal conductivity measurements

    NASA Astrophysics Data System (ADS)

    Lorenzini, M.; Cesarini, E.; Cagnoli, G.; Campagna, E.; Haughian, K.; Hough, J.; Losurdo, G.; Martelli, F.; Martin, I.; Piergiovanni, F.; Reid, S.; Rowan, S.; van Veggel, A. A.; Vetrano, F.

    2010-05-01

    A direct approach to reduce the thermal noise contribution to the sensitivity limit of a GW interferometric detector is the cryogenic cooling of the mirrors and mirrors suspensions. Future generations of detectors are foreseen to implement this solution. Silicon has been proposed as a candidate material, thanks to its very low intrinsic loss angle at low temperatures and due to its very high thermal conductivity, allowing the heat deposited in the mirrors by high power lasers to be efficiently extracted. To accomplish such a scheme, both mirror masses and suspension elements must be made of silicon, then bonded together forming a quasi-monolithic stage. Elements can be assembled using hydroxide-catalysis silicate bonding, as for silica monolithic joints. The effect of Si to Si bonding on suspension thermal conductance has therefore to be experimentally studied. A measurement of the effect of silicate bonding on thermal conductance carried out on 1 inch thick silicon bonded samples, from room temperature down to 77 K, is reported. In the explored temperature range, the silicate bonding does not seem to affect in a relevant way the sample conductance.

  18. Thermal conductivity of earth materials at high temperatures.

    NASA Technical Reports Server (NTRS)

    Schatz, J. F.; Simmons, G.

    1972-01-01

    The total thermal conductivity (lattice plus radiative) of several important earth materials is measured in the temperature range from 500 to 1900 K. A new technique is used in which a CO2 laser generates a low-frequency temperature wave at one face of a small disk-shaped sample, and an infrared detector views the opposite face to detect the phase of the emerging radiation. Phase data at several frequencies yield the simultaneous determination of the thermal diffusivity and the mean extinction coefficient of the material. The lattice, radiative, and total thermal conductivities are then calculated. Results for single-crystal and polycrystalline forsterite-rich olivines and an enstatite indicate that, even in relatively pure large-grained material, the radiative conductivity does not increase rapidly with temperature. The predicted maximum total thermal conductivity at a depth of 400 km in an olivine mantle is 0.020 cal/cm/sec/deg C, which is less than twice the surface value.

  19. Viscosity and thermal conductivity of stable graphite suspensions near percolation.

    PubMed

    Ma, Lei; Wang, Jianjian; Marconnet, Amy M; Barbati, Alexander C; McKinley, Gareth H; Liu, Wei; Chen, Gang

    2015-01-14

    Nanofluids have received much attention in part due to the range of properties possible with different combinations of nanoparticles and base fluids. In this work, we measure the viscosity of suspensions of graphite particles in ethylene glycol as a function of the volume fraction, shear rate, and temperature below and above the percolation threshold. We also measure and contrast the trends observed in the viscosity with increasing volume fraction to the thermal conductivity behavior of the same suspensions: above the percolation threshold, the slope that describes the rate of thermal conductivity enhancement with concentration reduces compared to below the percolation threshold, whereas that of the viscosity enhancement increases. While the thermal conductivity enhancement is independent of temperature, the viscosity changes show a strong dependence on temperature and exhibit different trends with respect to the temperature at different shear rates above the percolation threshold. Interpretation of the experimental observations is provided within the framework of Stokesian dynamics simulations of the suspension microstructure and suggests that although diffusive contributions are not important for the observed thermal conductivity enhancement, they are important for understanding the variations in the viscosity with changes of temperature and shear rate above the percolation threshold. The experimental results can be collapsed to a single master curve through calculation of a single dimensionless parameter (a Péclet number based on the rotary diffusivity of the graphite particles). PMID:25469709

  20. Thermal conductivity of alternative refrigerants in the liquid phase

    SciTech Connect

    Yata, J.; Hori, M.; Kobayashi, K.; Minamiyama, T.

    1996-05-01

    Measurements of the thermal conductivity of five alternative refrigerants, namely, difluoromethane (HFC-32), pentafluoroethane (HFC-125), 1,1,1-trifluorethane (HFC-143a), and dichloropentafluoropropanes (HCFC-225ca and HCFC-225cb), are carried out in the liquid phase. The range of temperature is 253-324 K for HFC-32, 257-305 K for HFC-125, 268-314 K for HFC-134a, 267-325 K for HCF-225ca, and 286-345 K for HCFC-225cb. The pressure range is from saturation to 30 MPa. The reproducibility of the data is better than 0.5%, and the accuracy of the data is estimated to be of the order of 1%. The experimental results for the thermal conductivity of each substance are correlated by an equation which is a function of temperature and pressure. A short discussion is given to the comparison of the present results with literature values for HFC-125. The saturated liquid thermal conductivity values of HFC-32, HFC-125, and HFC-143a are compared with those of chlorodifluoromethane (HCFC-22) and tetrafluoroethane (HFC-134a) and it is shown that the value of HFC-32 is highest, while that of HFC-125 is lowest, among these substances. The dependence of thermal conductivity on number of fluorine atoms among the refrigerants with the same number of carbon and hydrogen atoms is discussed.

  1. Thermal Conductivity of Tetryl by Modulated Differential Scanning Calorimetry

    SciTech Connect

    Weese, R K

    2003-07-28

    We investigated the use of the Modulated Differential Scanning Calorimeter to measure thermal conductivity (K) of the explosive, Tetryl, using two different methods, isothermal and nonthermal. A discussion of our methods and a comparison of our measured values to literature values of K for Tetryl, which deviated by as much as 50%, will be presented.

  2. Metastable Lennard-Jones fluids. II. Thermal conductivity.

    PubMed

    Baidakov, Vladimir G; Protsenko, Sergey P

    2014-06-01

    The method of equilibrium molecular dynamics with the use of the Green-Kubo formalism has been used to calculate the thermal conductivity λ in stable and metastable regions of a Lennard-Jones fluid. Calculations have been made in the range of reduced temperatures 0.4 ≤ T* = k(b)T/ε ≤ 2.0 and densities 0.01 ≤ ρ* = ρσ³ ≤ 1.2 on 15 isotherms for 234 states, 130 of which refer to metastable regions: superheated and supercooled liquids, supersaturated vapor. Equations have been built up which describe the dependence of the regular part of the thermal conductivity on temperature and density, and also on temperature and pressure. It has been found that in (p, T) variables in the region of a liquid-gas phase transition a family of lines of constant value of excess thermal conductivity Δλ = λ - λ0, where λ0 is the thermal conductivity of a dilute gas, has an envelope which coincides with the spinodal. Thus, at the approach to the spinodal of a superheated liquid and supersaturated vapor (∂Δλ/∂p)T → ∞, (∂Δλ/∂T)p → ∞. PMID:24908025

  3. Prediction of thermal conductivity of rocks by soft computing

    NASA Astrophysics Data System (ADS)

    Khandelwal, Manoj

    2010-05-01

    The transfer of energy between two adjacent parts of rock mainly depends on its thermal conductivity. Knowledge of the thermal conductivity of rocks is necessary for the calculation of heat flow or for the longtime modeling of geothermal resources. In recent years, considerable effort has been made to develop artificial intelligence techniques to determine these properties. Present study supports the application of artificial neural network (ANN) in the study of thermal conductivity along with other intrinsic properties of rock due to its increasing importance in many areas of rock engineering, agronomy, and geoenvironmental engineering field. In this paper, an attempt has been made to predict the thermal conductivity (TC) of rocks by incorporating uniaxial compressive strength, density, porosity, and P-wave velocity using artificial neural network (ANN) technique. A three-layer feed forward back propagation neural network with 4-7-1 architecture was trained and tested using 107 experimental data sets of various rocks. Twenty new data sets were used for the validation and comparison of the TC by ANN. Multivariate regression analysis (MVRA) has also been done with same data sets of ANN. ANN and MVRA results were compared based on coefficient of determination (CoD) and mean absolute error (MAE) between experimental and predicted values of TC. It was found that CoD between measured and predicted values of TC by ANN and MVRA were 0.984 and 0.914, respectively, whereas MAE was 0.0894 and 0.2085 for ANN and MVRA, respectively.

  4. Decreasing the Effective Thermal Conductivity in Glass Supported Thermoelectric Layers

    PubMed Central

    Bethke, Kevin; Andrei, Virgil; Rademann, Klaus

    2016-01-01

    As thermoelectric devices begin to make their way into commercial applications, the emphasis is put on decreasing the thermal conductivity. In this purely theoretical study, finite element analysis is used to determine the effect of a supporting material on the thermal conductivity of a thermoelectric module. The simulations illustrate the heat transfer along a sample, consisting from Cu, Cu2O and PbTe thermoelectric layers on a 1 mm thick Pyrex glass substrate. The influence of two different types of heating, at a constant temperature and at a constant heat flux, is also investigated. It is revealed that the presence of a supporting material plays an important role on lowering the effective thermal conductivity of the layer-substrate ensemble. By using thinner thermoelectric layers the effective thermal conductivity is further reduced, almost down to the value of the glass substrate. As a result, the temperature gradient becomes steeper for a fixed heating temperature, which allows the production of devices with improved performance under certain conditions. Based on the simulation results, we also propose a model for a robust thin film thermoelectric device. With this suggestion, we invite the thermoelectric community to prove the applicability of the presented concept for practical purposes. PMID:26982458

  5. Thermal conductivity and temperature profiles in carbon electrodes for supercapacitors

    NASA Astrophysics Data System (ADS)

    Burheim, Odne S.; Aslan, Mesut; Atchison, Jennifer S.; Presser, Volker

    2014-01-01

    The thermal conductivity of supercapacitor film electrodes composed of activated carbon (AC), AC with 15 mass% multi-walled carbon nanotubes (MWCNTs), AC with 15 mass% onion-like carbon (OLC), and only OLC, all mixed with polymer binder (polytetrafluoroethylene), has been measured. This was done for dry electrodes and after the electrodes have been saturated with an organic electrolyte (1 M tetraethylammonium-tetrafluoroborate in acetonitrile, TEA-BF4). The thermal conductivity data was implemented in a simple model of generation and transport of heat in a cylindrical cell supercapacitor systems. Dry electrodes showed a thermal conductivity in the range of 0.09-0.19 W K-1 m-1 and the electrodes soaked with an organic electrolyte yielded values for the thermal conductivity between 0.42 and 0.47 W K-1 m-1. It was seen that the values related strongly to the porosity of the carbon electrode materials. Modeling of the internal temperature profiles of a supercapacitor under conditions corresponding to extreme cycling demonstrated that only a moderate temperature gradient of several degrees Celsius can be expected and which depends on the ohmic resistance of the cell as well as the wetting of the electrode materials.

  6. Thermal conductivity and dielectric constant of silicate materials

    NASA Technical Reports Server (NTRS)

    Simon, I.; Wechsler, A. E.

    1968-01-01

    Report on the thermal conductivity and dielectric constant of nonmetallic materials evaluates the mechanisms of heat transfer in evacuated silicate powders and establishes the complex dielectric constant of these materials. Experimental measurements and results are related to postulated lunar surface materials.

  7. Thermal conductivity of heterogeneous mixtures and lunar soils

    NASA Technical Reports Server (NTRS)

    Vachon, R. I.; Prakouras, A. G.; Crane, R.; Khader, M. S.

    1973-01-01

    The theoretical evaluation of the effective thermal conductivity of granular materials is discussed with emphasis upon the heat transport properties of lunar soil. The following types of models are compared: probabilistic, parallel isotherm, stochastic, lunar, and a model based on nonlinear heat flow system synthesis.

  8. Apparatus measures thermal conductivity of honeycomb-core panels

    NASA Technical Reports Server (NTRS)

    1966-01-01

    Overall thermal conductivity of honeycomb-core panels at elevated temperatures is measured by an apparatus with a heater assembly and a calibrated heat-rate transducer. The apparatus has space between the heater and transducer for insertion of a test panel and insulation.

  9. Mode dependent lattice thermal conductivity of single layer graphene

    SciTech Connect

    Wei, Zhiyong; Yang, Juekuan; Bi, Kedong; Chen, Yunfei

    2014-10-21

    Molecular dynamics simulation is performed to extract the phonon dispersion and phonon lifetime of single layer graphene. The mode dependent thermal conductivity is calculated from the phonon kinetic theory. The predicted thermal conductivity at room temperature exhibits important quantum effects due to the high Debye temperature of graphene. But the quantum effects are reduced significantly when the simulated temperature is as high as 1000 K. Our calculations show that out-of-plane modes contribute about 41.1% to the total thermal conductivity at room temperature. The relative contribution of out-of-plane modes has a little decrease with the increase of temperature. Contact with substrate can reduce both the total thermal conductivity of graphene and the relative contribution of out-of-plane modes, in agreement with previous experiments and theories. Increasing the coupling strength between graphene and substrate can further reduce the relative contribution of out-of-plane modes. The present investigations also show that the relative contribution of different mode phonons is not sensitive to the grain size of graphene. The obtained phonon relaxation time provides useful insight for understanding the phonon mean free path and the size effects in graphene.

  10. Thermal conductivity of silicene from first-principles

    SciTech Connect

    Xie, Han; Bao, Hua E-mail: hua.bao@sjtu.edu.cn; Hu, Ming E-mail: hua.bao@sjtu.edu.cn

    2014-03-31

    Silicene, as a graphene-like two-dimensional material, now receives exceptional attention of a wide community of scientists and engineers beyond graphene. Despite extensive study on its electric property, little research has been done to accurately calculate the phonon transport of silicene so far. In this paper, thermal conductivity of monolayer silicene is predicted from first-principles method. At 300 K, the thermal conductivity of monolayer silicene is found to be 9.4 W/mK and much smaller than bulk silicon. The contributions from in-plane and out-of-plane vibrations to thermal conductivity are quantified, and the out-of-plane vibration contributes less than 10% of the overall thermal conductivity, which is different from the results of the similar studies on graphene. The difference is explained by the presence of small buckling, which breaks the reflectional symmetry of the structure. The flexural modes are thus not purely out-of-plane vibration and have strong scattering with other modes.

  11. Thermally Conductive Metal-Tube/Carbon-Composite Joints

    NASA Technical Reports Server (NTRS)

    Copeland, Robert J.

    2004-01-01

    An improved method of fabricating joints between metal and carbon-fiber-based composite materials in lightweight radiators and heat sinks has been devised. Carbon-fiber-based composite materials have been used in such heat-transfer devices because they offer a combination of high thermal conductivity and low mass density. Metal tubes are typically used to carry heat-transfer fluids to and from such heat-transfer devices. The present fabrication method helps to ensure that the joints between the metal tubes and the composite-material parts in such heat-transfer devices have both (1) the relatively high thermal conductances needed for efficient transfer of heat and (2) the flexibility needed to accommodate differences among thermal expansions of dissimilar materials in operation over wide temperature ranges. Techniques used previously to join metal tubes with carbon-fiber-based composite parts have included press fitting and bonding with epoxy. Both of these prior techniques have been found to yield joints characterized by relatively high thermal resistances. The present method involves the use of a solder (63 percent Sn, 37 percent Pb) to form a highly thermally conductive joint between a metal tube and a carbon-fiber-based composite structure. Ordinarily, the large differences among the coefficients of thermal expansion of the metal tube, solder, and carbon-fiber-based composite would cause the solder to pull away from the composite upon post-fabrication cooldown from the molten state. In the present method, the structure of the solder is modified (see figure) to enable it to deform readily to accommodate the differential thermal expansion.

  12. THERMAL DIFFUSIVITY/CONDUCTIVITY OF IRRADIATED MONOLITHIC CVD-SIC

    SciTech Connect

    Youngblood, Gerald E.; Senor, David J.; Jones, Russell H.

    2003-03-31

    Several thermal diffusivity disc samples of high purity CVD-SiC were neutron-irradiated to equivalent doses of about 5-8 dpa-SiC at temperatures from 252 up to 800 C. For this temperature range, the degradation in the thermal diffusivity ranged from about 95 percent down to 89 percent, respectively. The reciprocal thermal diffusivity method was used to estimate the phonon mean free paths and defect concentrations before and after the irradiations for these materials. Even though the CVD-SiC material is an excellent monitor of certain neutron irradiation effects, the degradation in the thermal diffusivity (conductivity) appears to be more than a factor of two greater than predicted by recent theoretical model simulations.

  13. System to Measure Thermal Conductivity and Seebeck Coefficient for Thermoelectrics

    NASA Technical Reports Server (NTRS)

    Kim, Hyun-Jung; Skuza, Jonathan R.; Park, Yeonjoon; King, Glen C.; Choi, Sang H.; Nagavalli, Anita

    2012-01-01

    The Seebeck coefficient, when combined with thermal and electrical conductivity, is an essential property measurement for evaluating the potential performance of novel thermoelectric materials. However, there is some question as to which measurement technique(s) provides the most accurate determination of the Seebeck coefficient at elevated temperatures. This has led to the implementation of nonstandardized practices that have further complicated the confirmation of reported high ZT materials. The major objective of the procedure described is for the simultaneous measurement of the Seebeck coefficient and thermal diffusivity within a given temperature range. These thermoelectric measurements must be precise, accurate, and reproducible to ensure meaningful interlaboratory comparison of data. The custom-built thermal characterization system described in this NASA-TM is specifically designed to measure the inplane thermal diffusivity, and the Seebeck coefficient for materials in the ranging from 73 K through 373 K.

  14. Low Thermal Conductance Transition Edge Sensor (TES) for SPICA

    SciTech Connect

    Khosropanah, P.; Dirks, B.; Kuur, J. van der; Ridder, M.; Bruijn, M.; Popescu, M.; Hoevers, H.; Gao, J. R.; Morozov, D.; Mauskopf, P.

    2009-12-16

    We fabricated and characterized low thermal conductance transition edge sensors (TES) for SAFARI instrument on SPICA. The device is based on a superconducting Ti/Au bilayer deposited on suspended SiN membrane. The critical temperature of the device is 113 mK. The low thermal conductance is realized by using long and narrow SiN supporting legs. All measurements were performed having the device in a light-tight box, which to a great extent eliminates the loading of the background radiation. We measured the current-voltage (IV) characteristics of the device in different bath temperatures and determine the thermal conductance (G) to be equal to 320 fW/K. This value corresponds to a noise equivalent power (NEP) of 3x10{sup -19} W/{radical}(Hz). The current noise and complex impedance is also measured at different bias points at 55 mK bath temperature. The measured electrical (dark) NEP is 1x10{sup -18} W/{radical}(Hz), which is about a factor of 3 higher than what we expect from the thermal conductance that comes out of the IV curves. Despite using a light-tight box, the photon noise might still be the source of this excess noise. We also measured the complex impedance of the same device at several bias points. Fitting a simple first order thermal-electrical model to the measured data, we find an effective time constant of about 2.7 ms and a thermal capacity of 13 fJ/K in the middle of the transition.

  15. High-Temperature Structures, Adhesives, and Advanced Thermal Protection Materials for Next-Generation Aeroshell Design

    NASA Technical Reports Server (NTRS)

    Collins, Timothy J.; Congdon, William M.; Smeltzer, Stanley S.; Whitley, Karen S.

    2005-01-01

    The next generation of planetary exploration vehicles will rely heavily on robust aero-assist technologies, especially those that include aerocapture. This paper provides an overview of an ongoing development program, led by NASA Langley Research Center (LaRC) and aimed at introducing high-temperature structures, adhesives, and advanced thermal protection system (TPS) materials into the aeroshell design process. The purpose of this work is to demonstrate TPS materials that can withstand the higher heating rates of NASA's next generation planetary missions, and to validate high-temperature structures and adhesives that can reduce required TPS thickness and total aeroshell mass, thus allowing for larger science payloads. The effort described consists of parallel work in several advanced aeroshell technology areas. The areas of work include high-temperature adhesives, high-temperature composite materials, advanced ablator (TPS) materials, sub-scale demonstration test articles, and aeroshell modeling and analysis. The status of screening test results for a broad selection of available higher-temperature adhesives is presented. It appears that at least one (and perhaps a few) adhesives have working temperatures ranging from 315-400 C (600-750 F), and are suitable for TPS-to-structure bondline temperatures that are significantly above the traditional allowable of 250 C (482 F). The status of mechanical testing of advanced high-temperature composite materials is also summarized. To date, these tests indicate the potential for good material performance at temperatures of at least 600 F. Application of these materials and adhesives to aeroshell systems that incorporate advanced TPS materials may reduce aeroshell TPS mass by 15% - 30%. A brief outline is given of work scheduled for completion in 2006 that will include fabrication and testing of large panels and subscale aeroshell test articles at the Solar-Tower Test Facility located at Kirtland AFB and operated by Sandia

  16. Effect of Thermal Conduction on Acoustic Waves in Coronal Loops

    NASA Astrophysics Data System (ADS)

    Bogdan, T. J.

    2006-05-01

    The influence of classical (Spitzer) thermal conduction on longitudinal acoustic waves in a coronal loop is determined through an idealized but exactly solvable model. The model consists of an isothermal, stratified (constant gravity) atmosphere in which a monochromatic acoustic wave, traveling in the direction of decreasing density, is imposed throughout the lower half of the atmosphere. Based on the linearized equations of motion, the complete steady state (t-->∞) solution is obtained. In addition to the imposed driving wave, the solution also contains reflected and transmitted acoustic and thermal conduction waves. The mode transformation and mixing occurs in the vicinity of the atmospheric layer where the gas pressure passes through a critical value set by the magnitude of the thermal conduction and other model parameters. For 5 minute waves in a million degree loop, this critical pressure is on the order of 8×10-4 in cgs units. Since the apex gas pressure of many coronal loops of current interest is thought to be comfortably in excess of this value, mode mixing and transformation is not likely to be a relevant factor for understanding acoustic waves in these structures. On the other hand, enhanced thermal conductivity as a result of plasma instabilities, for example, could revive the importance of this mechanism for coronal loops. If this mixing layer is present, the calculations show that the pair of thermal conduction waves invariably gains the overwhelming majority of the energy flux of the incoming acoustic wave. This energy is rapidly dissipated in the neighborhood of the mixing layer.

  17. Experimental Study on the Effective Thermal Conductivity and Thermal Diffusivity of Nanofluids

    NASA Astrophysics Data System (ADS)

    Zhang, X.; Gu, H.; Fujii, M.

    2006-03-01

    This paper reports measurements of the effective thermal conductivity and thermal diffusivity of various nanofluids using the transient short-hot-wire technique. To remove the influences of the static charge and electrical conductance of the nanoparticles on measurement accuracy, the short-hot-wire probes are carefully coated with a pure Al2O3 thin film. Using distilled water and toluene as standard liquids of known thermal conductivity and thermal diffusivity, the length and radius of the hot wire and the thickness of the Al2O3 film are calibrated before and after application of the coating. The electrical leakage of the short-hot-wire probes is frequently checked, and only those probes that are coated well are used for measurements. In the present study, the effective thermal conductivities and thermal diffusivities of Al2O3/water, ZrO2/water, TiO2/water, and CuO/water nanofluids are measured and the effects of the volume fractions and thermal conductivities of nanoparticles and temperature are clarified. The average diameters of Al2O3, ZrO2, TiO2, and CuO particles are 20, 20, 40, and 33 nm, respectively. The uncertainty of the present measurements is estimated to be within 1% for the thermal conductivity and 5% for the thermal diffusivity. The measured results demonstrate that the effective thermal conductivities of the nanofluids show no anomalous enhancement and can be predicted accurately by the model equation of Hamilton and Crosser, when the spherical nanoparticles are dispersed into fluids.

  18. Thermal Conductivity of Powder Aggregates and Porous Compacts

    NASA Astrophysics Data System (ADS)

    Montes, J. M.; Cuevas, F. G.; Cintas, J.; Muñoz, S.

    2012-12-01

    A new equation for calculating the thermal conductivity of metal powder aggregates and sintered metal powder compacts is proposed. In this equation, the effective conductivity of the powder system is a function of the conductivity of the fully dense material, the porosity of the system, and the tap porosity of the starting powder. The new equation is applicable to powder systems, from the tap porosity to zero porosity, as well as to consolidated powders. The proposed equation has been experimentally validated by fitting to data from other authors. The results confirm a good agreement with theoretical predictions.

  19. Enhancing Thermal Conductivity of Hexagonal Boron Nitride Filled Thermoplastics for Thermal Interface Management

    NASA Astrophysics Data System (ADS)

    Prindl, John

    Hexagonal Boron Nitride has been shown to enhance thermal conductivity in polymer composites more so than conventional ceramic fillers. However, to see a significant increase in thermal conductivity a high loading level of the advanced ceramic is often needed which can have an adverse effect on the mechanical behavior of the composite part. Applications for thermal management using thermal interface materials (TIM) continue to grow with thermoplastic injection molded parts emerging as an area for market growth. There is a growing need for published technical data in this particular area of application. In the current study, the thermal conductivity and mechanical behavior of hexagonal Boron Nitride (hBN) loaded thermoplastic composites is investigated. The main objectives of this work is produce a novel data package which illustrates the effects of hBN, loaded at high concentrations, across several different thermoplastic resins with the ultimate goal being to find a desirable formulation for specific thermal management applications. The desired properties for such applications being high thermal conductivity and high electrical resistivity with a minimal decrease in mechanical properties. Hexagonal BN cooling filler agglomerates were compounded into polypropylene (PP), nylon-6 (PA-6), and thermoplastic elastomer (TPE) via twin-screw extruder at 3 different loading levels. Injection molded samples were produced and characterized to show varying degrees of thermal conductivity and mechanical strength. Results from this research showed that in all cases, the thermal conductivity increased with increasing levels of hBN addition. The largest increases in thermal conductivity were seen in the PA-6 and TPE systems with the possible indication of exceeding the percolation threshold in the TPE system. This is hypothesized to occur due to the preferential migration of hBN to form conduction pathways around the elastomeric domains in the TPE matrix. Though TPE produced

  20. Measurement of thermal contact conductance of SPring-8 beamline components

    NASA Astrophysics Data System (ADS)

    Mochizuki, Tetsuro; Ohashi, Haruhiko; Sano, Mutsumi; Takahashi, Sunao; Goto, Shunji

    2007-09-01

    Direct cooling is adopted for most high heat load components in SPring-8 beamlines. On the other hand, contact cooling is employed for some components such as a graphite filter, aluminum filter, mirror, and cryogenic monochromator silicon crystal. For the thermal design of the contact cooling components, it is important to obtain reliable thermal contact conductance value. The conductance depends on many parameters such as the surface materials, surface roughness, flatness of the surface, interstitial materials, temperature of the contact surface, and contact pressure. An experimental setup is fablicated to measure the conductance at liquid nitrogen temperature and room temperature. The thermal contact conductance of a Si-Cu interface and that of a Si-In-Cu interface are measured at cryogenic temperature at contact pressures ranging from 0.1-1.1 MPa. The conductance of an Al-Cu interface and that of a graphite-Cu interface are measured using gold and silver foils as interstitial materials. The measurements are performed at room temperature and at pressures ranging from 0.5-4 MPa. The experimental setup and the results obtained are presented.

  1. Strength of VGCF/Al Composites for High Thermal Conductivity

    NASA Astrophysics Data System (ADS)

    Fukuchi, Kohei; Sasaki, Katsuhiko; Imanishi, Terumitsu; Katagiri, Kazuaki; Kakitsuji, Atsushi; Shimizu, Akiyuki

    In this paper, the evaluation of the strength of the VGCF/Aluminum composites which have high thermal conductivity is reported. VGCF (Vapor Growth Carbon Fiber) is a kind of the Carbon nanotube (CNT) which has very high thermal conductivity as well as CNT. The composites are made by spark plasma sintering. The stress-strain curves of the composites are obtained by the tensile tests and show that the composites have brittle behavior. The brittleness of the composites increases with increase in the volume fraction of VGCF. A numerical simulation based on the micromechanics is conducted to estimate nonlinear behavior in the elastic deformation and plastic deformation of the stress-strain relations of the composites. The theories of Eshelby, Mori-Tanaka, Weibull, and Ramberg-Osgood are employed for the numerical simulation. The simulations give some information of the microstructural change in the composite related to the volume fraction of VGCF.

  2. Effect of interfacial interactions on the thermal conductivity and interfacial thermal conductance in tungsten–graphene layered structure

    SciTech Connect

    Jagannadham, K.

    2014-09-01

    Graphene film was deposited by microwave plasma assisted deposition on polished oxygen free high conductivity copper foils. Tungsten–graphene layered film was formed by deposition of tungsten film by magnetron sputtering on the graphene covered copper foils. Tungsten film was also deposited directly on copper foil without graphene as the intermediate film. The tungsten–graphene–copper samples were heated at different temperatures up to 900 °C in argon atmosphere to form an interfacial tungsten carbide film. Tungsten film deposited on thicker graphene platelets dispersed on silicon wafer was also heated at 900 °C to identify the formation of tungsten carbide film by reaction of tungsten with graphene platelets. The films were characterized by scanning electron microscopy, Raman spectroscopy, and x-ray diffraction. It was found that tungsten carbide film formed at the interface upon heating only above 650 °C. Transient thermoreflectance signal from the tungsten film surface on the samples was collected and modeled using one-dimensional heat equation. The experimental and modeled results showed that the presence of graphene at the interface reduced the cross-plane effective thermal conductivity and the interfacial thermal conductance of the layer structure. Heating at 650 and 900 °C in argon further reduced the cross-plane thermal conductivity and interface thermal conductance as a result of formation nanocrystalline tungsten carbide at the interface leading to separation and formation of voids. The present results emphasize that interfacial interactions between graphene and carbide forming bcc and hcp elements will reduce the cross-plane effective thermal conductivity in composites.

  3. High-precision micropipette thermal sensor for measurement of thermal conductivity of carbon nanotubes thin film

    NASA Astrophysics Data System (ADS)

    Shrestha, Ramesh

    The thesis describes novel glass micropipette thermal sensor fabricated in cost-effective manner and thermal conductivity measurement of carbon nanotubes (CNT) thin film using the developed sensor. Various micrometer-sized sensors, which range from 2 microm to 30 microm, were produced and tested. The capability of the sensor in measuring thermal fluctuation at micro level with an estimated resolution of +/-0.002°C is demonstrated. The sensitivity of sensors was recorded from 3.34 to 8.86 microV/°C, which is independent of tip size and dependent on the coating of Nickel. The detailed experimental setup for thermal conductivity measurement of CNT film is discussed and 73.418 W/m°C was determined as the thermal conductivity of the CNT film at room temperature.

  4. The Origin of High Thermal Conductivity and Ultralow Thermal Expansion in Copper-Graphite Composites.

    PubMed

    Firkowska, Izabela; Boden, André; Boerner, Benji; Reich, Stephanie

    2015-07-01

    We developed a nanocomposite with highly aligned graphite platelets in a copper matrix. Spark plasma sintering ensured an excellent copper-graphite interface for transmitting heat and stress. The resulting composite has superior thermal conductivity (500 W m(-1) K(-1), 140% of copper), which is in excellent agreement with modeling based on the effective medium approximation. The thermal expansion perpendicular to the graphite platelets drops dramatically from ∼20 ppm K(-1) for graphite and copper separately to 2 ppm K(-1) for the combined structure. We show that this originates from the layered, highly anisotropic structure of graphite combined with residual stress under ambient conditions, that is, strain-engineering of the thermal expansion. Combining excellent thermal conductivity with ultralow thermal expansion results in ideal materials for heat sinks and other devices for thermal management. PMID:26083322

  5. Determination of BWR Spent Nuclear Fuel Assembly Effective Thermal Conductivity

    SciTech Connect

    Matthew D. Hinds

    2001-10-17

    The purpose of this calculation is to provide an effective thermal conductivity for use in predicting peak cladding temperatures in boiling water reactor (BWR) fuel assemblies with 7x7,8x8, and 9x9 rod arrays. The first objective of this calculation is to describe the development and application of a finite element representation that predicts peak spent nuclear fuel temperatures for BWR assemblies. The second objective is to use the discrete representation to develop a basis for determining an effective thermal conductivity (described later) for a BWR assembly with srneared/homogeneous properties and to investigate the thermal behavior of a spent fuel assembly. The scope of this calculation is limited to a steady-state two-dimensional representation of the waste package interior region. This calculation is subject to procedure AP-3.124, Calculations (Ref. 27) and guided by the applicable technical work plan (Ref. 14). While these evaluations were originally developed for the thermal analysis of conceptual waste package designs emplaced in the potential repository at Yucca Mountain, the methodology applies to storage and transportation thermal analyses as well. Note that the waste package sketch in Attachment V depicts a preliminary design, and should not be interpreted otherwise.

  6. Determining in-situ thermal conductivity of coarse textured materials through numerical analysis of thermal

    NASA Astrophysics Data System (ADS)

    Saito, H.; Hamamoto, S.; Moldrup, P.; Komatsu, T.

    2013-12-01

    Ground source heat pump (GSHP) systems use ground or groundwater as a heat/cooling source, typically by circulating anti-freezing solution inside a vertically installed closed-loop tube known as a U-tube to transfer heat to/from the ground. Since GSHP systems are based on renewable energy and can achieve much higher coefficient of performance (COP) than conventional air source heat pump systems, use of GSHP systems has been rapidly increasing worldwide. However, environmental impacts by GSHP systems including thermal effects on subsurface physical-chemical and microbiological properties have not been fully investigated. To rigorously assess GSHP impact on the subsurface environment, ground thermal properties including thermal conductivity and heat capacity need to be accurately characterized. Ground thermal properties were investigated at two experimental sites at Tokyo University of Agriculture and Technology (TAT) and Saitama University (SA), both located in the Kanto area of Japan. Thermal properties were evaluated both by thermal probe measurements on boring core samples and by performing in-situ Thermal Response Tests (TRT) in 50-80 m deep U-tubes. At both TAT and SU sites, heat-pulse probe measurements gave unrealistic low thermal conductivities for coarse textured materials (dominated by particles > 75 micrometers). Such underestimation can be partly due to poor contact between probe and porous material and partly to markedly decreasing sample water content during drilling, carrying, and storing sandy/gravelly samples. A more reliable approach for estimating in-situ thermal conductivity of coarse textured materials is therefore needed, and may be based on the commonly used TRT test. However, analyses of TRT data is typically based on Kelvin's line source model and provides an average (effective) thermal property for the whole soil profile around the U-tube but not for each geological layer. The main objective of this study was therefore to develop a method

  7. Thermal Conductivity of Polymer/Nano-filler Blends

    NASA Technical Reports Server (NTRS)

    Ghose, Sayata; Watson, Kent A.; Delozier, Donovan M.; Working, Dennis C.; Connell, John W.; Smith, Joseph G.; Sun, Y. P.; Lin, Y.

    2006-01-01

    To improve the thermal conductivity of an ethylene vinyl acetate copolymer, Elvax 260 was compounded with three carbon based nano-fillers. Multiwalled carbon nanotubes (MWCNT), vapor grown carbon nanofibers (CNF) and expanded graphite (EG) were investigated. In an attempt to improve compatibility between the Elvax and nanofillers, MWCNTs and EGs were modified through non covalent and covalent attachment of alkyl groups. Ribbons were extruded to form samples in which the nanofillers were aligned, and samples were also fabricated by compression molding in which the nano-fillers were randomly oriented. The thermal properties were evaluated by DSC and TGA, and mechanical properties of the aligned samples were determined by tensile testing. The degree of dispersion and alignment of the nanoparticles were investigated using high-resolution scanning electron microscopy. Thermal conductivity measurements were performed using a Nanoflash technique. The thermal conductivity of the samples was measured in both the direction of alignment as well as perpendicular to that direction. The results of this study will be presented.

  8. Thermal conductivity and sound attenuation in dilute atomic Fermi gases

    SciTech Connect

    Braby, Matt; Chao Jingyi; Schaefer, Thomas

    2010-09-15

    We compute the thermal conductivity and sound attenuation length of a dilute atomic Fermi gas in the framework of kinetic theory. Above the critical temperature for superfluidity, T{sub c}, the quasiparticles are fermions, whereas below T{sub c}, the dominant excitations are phonons. We calculate the thermal conductivity in both cases. We find that at unitarity the thermal conductivity {kappa} in the normal phase scales as {kappa}{proportional_to}T{sup 3/2}. In the superfluid phase we find {kappa}{proportional_to}T{sup 2}. At high temperature the Prandtl number, the ratio of the momentum and thermal diffusion constants, is 2/3. The ratio increases as the temperature is lowered. As a consequence we expect sound attenuation in the normal phase just above T{sub c} to be dominated by shear viscosity. We comment on the possibility of extracting the shear viscosity of the dilute Fermi gas at unitarity using measurements of the sound absorption length.

  9. Two-temperature radiative shocks with electron thermal conduction

    NASA Technical Reports Server (NTRS)

    Borkowski, Kazimierz J.; Shull, J. Michael; Mckee, Christopher F.

    1989-01-01

    The influence of electron thermal conduction on radiative shock structure is studied for both one- and two-temperature plasmas. The dimensionless ratio of the conductive length to the cooling length determines whether or not conduction is important, and shock jump conditions with conduction are established for a collisionless shock front. Approximate solutions are obtained, with the assumptions that the ionization state of the gas is constant and the cooling rate is a function of temperature alone. In the absence of magnetic fields, these solutions indicate that conduction noticeably influences normal-abundance interstellar shocks with velocities 50-100 km/s and dramatically affects metal-dominated shocks over a wide range of shock velocities.

  10. Influence of moisture content and temperature on thermal conductivity and thermal diffusivity of rice flours

    Technology Transfer Automated Retrieval System (TEKTRAN)

    The thermal conductivity and thermal diffusivity of four types of rice flours and one type of rice protein were determine at temperatures ranging from 4.8 to 36.8 C, bulk densities 535 to 875.8 kg/m3, and moisture contents 2.6 to 16.7 percent (w.b.), using a KD2 Thermal Properties Analyzer. It was ...

  11. Thermal conductivity modeling of U-Mo/Al dispersion fuel

    NASA Astrophysics Data System (ADS)

    Kim, Yeon Soo; Cho, Byoung Jin; Sohn, Dong-Seong; Park, Jong Man

    2015-11-01

    A dataset for the thermal conductivity of U-Mo/Al dispersion fuel made available by KAERI was reanalyzed. Using this dataset, an analytical model was obtained by expanding the Bruggeman model. The newly developed model incorporates thermal resistances at the interface between the U-Mo particles and the Al matrix and the defects within the Al matrix (grain boundaries, cracks, and dislocations). The interfacial resistances are expressed as functions of U-Mo particle size and Al grain size obtained empirically by fitting to measured data from KAERI. The model was then validated against an independently measured dataset from ANL.

  12. Effects of Intergranular Gas Bubbles on Thermal Conductivity

    SciTech Connect

    K. Chockalingam; Paul C. Millett; M. R. Tonks

    2012-11-01

    Model microstructures obtained from phase-field simulations are used to study the effective heat transfer across bicrys- tals with stationary grain boundary bubble populations. We find that the grain boundary coverage, irrespective of the intergranular bubble radii, is the most relevant parameter to the thermal resistance, which we use to derive effec- tive Kapitza resistances that are dependent on the grain boundary coverage and Kaptiza resistance of the intact grain boundary. We propose a model to predict thermal conductivity as a function of porosity, grain-size, Kaptiza resistance of the intact grain boundary, and grain boundary bubble coverage.

  13. Electrical and thermal conductivity of beta-BN

    SciTech Connect

    Shipilo, V.B.; GUSEVA, i.p.; Leushkina, G.V.; Makovetskaya, L.A.; Popel'nyuk, G.P.

    1986-08-01

    This investigation deals with the influence of selenium impurity and thermal annealing on the properties of beta-BN. It is shown that as a result of annealing of cubic boron nitride, undoped or doped with selenium, both electrical and thermal conductivity are increased, depending also on the defects in the beta-BN crystals. The concentration of selenium in boron nitride was obtained by x-ray luminescence methods. To excite the x-ray radiation of selenium, a Cd 109 radioisotope source was used with an integrated activity of approximately 1 MBq.

  14. Instrument for Measuring Thermal Conductivity of Materials at Low Temperatures

    NASA Technical Reports Server (NTRS)

    Fesmire, James; Sass, Jared; Johnson, Wesley

    2010-01-01

    With the advance of polymer and other non-metallic material sciences, whole new series of polymeric materials and composites are being created. These materials are being optimized for many different applications including cryogenic and low-temperature industrial processes. Engineers need these data to perform detailed system designs and enable new design possibilities for improved control, reliability, and efficiency in specific applications. One main area of interest is cryogenic structural elements and fluid handling components and other parts, films, and coatings for low-temperature application. An important thermal property of these new materials is the apparent thermal conductivity (k-value).

  15. Applications of high thermal conductivity composites to electronics and spacecraft thermal design

    NASA Technical Reports Server (NTRS)

    Sharp, G. Richard; Loftin, Timothy A.

    1990-01-01

    Recently, high thermal conductivity continuous graphite fiber reinforced metal matrix composites (MMC's) have become available that can save much weight over present methods of heat conduction. These materials have two or three times higher thermal conductivity in the fiber direction than the pure metals when compared on a thermal conductivity to weight basis. Use of these materials for heat conduction purposes can result in weight savings of from 50 to 70 percent over structural aluminum. Another significant advantage is that these materials can be used without the plumbing and testing complexities that accompany the use of liquid heat pipes. A spinoff of this research was the development of other MMC's as electronic device heat sinks. These use particulates rather than fibers and are formulated to match the coefficient of thermal expansion of electronic substrates in order to alleviate thermally induced stresses. The development of both types of these materials as viable weight saving substitutes for traditional methods of thermal control for electronics packaging and also for spacecraft thermal control applications are the subject of this report.

  16. Thermal conductivity of a film of single walled carbon nanotubes measured with infrared thermal imager

    NASA Astrophysics Data System (ADS)

    Feng, Ya; Inoue, Taiki; Xiang, Rong; Chiashi, Shohei; Maruyama, Shigeo

    Heat dissipation has restricted the modern miniaturization trend with the development of electronic devices. Theoretically proven to be with high axial thermal conductivity, single walled carbon nanotubes (SWNT) have long been expected to cool down the nanoscale world. Even though the tube-tube contact resistance limits the capability of heat transfer of the bulk film, the high intrinsic thermal conductivity of SWNT still glorify the application of films of SWNT network as a thermal interface material. In this work, we proposed a new method to straightly measure the thermal conductivity of SWNT film. We bridged two cantilevered Si thin plate with SWNT film, and kept a steady state heat flow in between. With the infrared camera to record the temperature distribution, the Si plates with known thermal conductivity can work as a reference to calculate the heat flux going through the SWNT film. Further, the thermal conductivity of the SWNT film can be obtained through Fourier's law after deducting the effect of thermal radiation. The sizes of the structure, the heating temperature, the vacuum degree and other crucial impact factors are carefully considered and analyzed. The author Y. F. was supported through the Advanced Integration Science Innovation Education and Research Consortium Program by the Ministry of Education, Culture, Sport, Science and Technology.

  17. Effects of Doping on Thermal Conductivity of Pyrochlore Oxides for Advanced Thermal Barrier Coatings

    NASA Technical Reports Server (NTRS)

    Bansal, Narottam P.; Zhu, Dongming; Eslamloo-Grami, Maryam

    2006-01-01

    Pyrochlore oxides of general composition, A2B2O7, where A is a 3(+) cation (La to Lu) and B is a 4(+) cation (Zr, Hf, Ti, etc.) have high melting point, relatively high coefficient of thermal expansion, and low thermal conductivity which make them suitable for applications as high-temperature thermal barrier coatings. The effect of doping at the A site on the thermal conductivity of a pyrochlore oxide La2Zr2O7, has been investigated. Oxide powders of various compositions La2Zr2O7, La(1.7)Gd(0.3)Zr2O7, La(1.7)Yb(0.3)Zr2O7 and La(1.7)Gd(0.15)Yb(0.15)Zr2O7 were synthesized by the citric acid sol-gel method. These powders were hot pressed into discs and used for thermal conductivity measurements using a steady-state laser heat flux test technique. The rare earth oxide doped pyrochlores La(1.7)Gd(0.3)Zr2O7, La(1.7)Yb(0.3)Zr2O7 and La(1.7)Gd(0.15)Yb(0.15)Zr2O7 had lower thermal conductivity than the un-doped La2Zr2O7. The Gd2O3 and Yb2O3 co-doped composition showed the lowest thermal conductivity.

  18. Thermal conductance of metal-diamond interfaces at high pressure.

    PubMed

    Hohensee, Gregory T; Wilson, R B; Cahill, David G

    2015-01-01

    The thermal conductance of interfaces between metals and diamond, which has a comparatively high Debye temperature, is often greater than can be accounted for by two-phonon processes. The high pressures achievable in a diamond anvil cell (DAC) can significantly extend the metal phonon density of states to higher frequencies, and can also suppress extrinsic effects by greatly stiffening interface bonding. Here we report time-domain thermoreflectance measurements of metal-diamond interface thermal conductance up to 50 GPa in the DAC for Pb, Au0.95Pd0.05, Pt and Al films deposited on type 1A natural [100] and type 2A synthetic [110] diamond anvils. In all cases, the thermal conductances increase weakly or saturate to similar values at high pressure. Our results suggest that anharmonic conductance at metal-diamond interfaces is controlled by partial transmission processes, where a diamond phonon that inelastically scatters at the interface absorbs or emits a metal phonon. PMID:25744853

  19. VALIDATION OF A THERMAL CONDUCTIVITY MEASUREMENT SYSTEM FOR FUEL COMPACTS

    SciTech Connect

    Jeff Phillips; Colby Jensen; Changhu Xing; Heng Ban

    2011-03-01

    A high temperature guarded-comparative-longitudinal heat flow measurement system has been built to measure the thermal conductivity of a composite nuclear fuel compact. It is a steady-state measurement device designed to operate over a temperature range of 300 K to 1200 K. No existing apparatus is currently available for obtaining the thermal conductivity of the composite fuel in a non-destructive manner due to the compact’s unique geometry and composite nature. The current system design has been adapted from ASTM E 1225. As a way to simplify the design and operation of the system, it uses a unique radiative heat sink to conduct heat away from the sample column. A finite element analysis was performed on the measurement system to analyze the associated error for various operating conditions. Optimal operational conditions have been discovered through this analysis and results are presented. Several materials have been measured by the system and results are presented for stainless steel 304, inconel 625, and 99.95% pure iron covering a range of thermal conductivities of 10 W/m*K to 70 W/m*K. A comparison of the results has been made to data from existing literature.

  20. Thermal conductivity in nanocrystalline-SiC/C superlattices

    NASA Astrophysics Data System (ADS)

    Habermehl, S.; Serrano, J. R.

    2015-11-01

    The formation of thin film superlattices consisting of alternating layers of nitrogen-doped SiC (SiC:N) and C is reported. Periodically terminating the SiC:N surface with a graphitic C boundary layer and controlling the SiC:N/C thickness ratio yield nanocrystalline SiC grains ranging in size from 365 to 23 nm. Frequency domain thermo-reflectance is employed to determine the thermal conductivity, which is found to vary from 35.5 W m-1 K-1 for monolithic undoped α-SiC films to 1.6 W m-1 K-1 for a SiC:N/C superlattice with a 47 nm period and a SiC:N/C thickness ratio of 11. A series conductance model is employed to explain the dependence of the thermal conductivity on the superlattice structure. The results indicate that the thermal conductivity is more dependent on the SiC:N/C thickness ratio than the SiC:N grain size, indicative of strong boundary layer phonon scattering.