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Sample records for adhesive wafer bonding

  1. Void-free wafer-level adhesive bonding utilizing modified poly (diallyl phthalate)

    NASA Astrophysics Data System (ADS)

    Zhong, Fang; Dong, Tao; Yong, He; Yan, Su; Wang, Kaiying

    2013-12-01

    A new thermosetting polymer, modified poly (diallyl phthalate) (PDAP), is used as intermediate layer to realize a void-free wafer-level transfer bonding, in which the bonding interface contains patterned metal. Through glass-silicon bonding experiments, bonding defects are easily recognized with light microscopy. Three typical defect types are identified as: uneven flow defect, particle defect and bubble defect. The processing parameters, such as bonding pressure, pre-baking temperature, polymer thickness and coating conditions, have been optimized based on analysis of the defect formation. The optimized conditions have yielded a void-free wafer-level adhesive bonding. Then, the die shearing test indicates a good bonding strength. Additionally, the transfer bonding process is applied in SOI-silicon bonding as a practical example of MEMS fabrication.

  2. Fabrication of capacitive micromachined ultrasonic transducers based on adhesive wafer bonding technique

    NASA Astrophysics Data System (ADS)

    Li, Zhenhao; Wong, Lawrence L. P.; Chen, Albert I. H.; Na, Shuai; Sun, Jame; Yeow, John T. W.

    2016-11-01

    This paper reports the fabrication process of wafer bonded capacitive micromachined ultrasonic transducers (CMUTs) using photosensitive benzocyclobutene as a polymer adhesive. Compared with direct bonding and anodic bonding, polymer adhesive bonding provides good tolerance to wafer surface defects and contamination. In addition, the low process temperature of 250 °C is compatible with standard CMOS processes. Single-element CMUTs consisting of cells with a diameter of 46 µm and a cavity depth of 323 nm were fabricated. In-air and immersion acoustic characterizations were performed on the fabricated CMUTs, demonstrating their capability for transmitting and receiving ultrasound signals. An in-air resonance frequency of 5.47 MHz was measured by a vibrometer under a bias voltage of 300 V.

  3. Effects of adhesive thickness on the Lamb wave pitch-catch signal using bonded piezoelectric wafer transducers

    NASA Astrophysics Data System (ADS)

    Islam, M. M.; Huang, H.

    2016-08-01

    This paper investigates the effects of adhesive layer on Lamb wave ultrasound pitch-catch signals that are excited and sensed by piezoelectric wafer transducers bonded on a slender structure. Analytical models were established to simulate the longitudinal and flexural vibrations of the structures separately and parametric studies of the bonding layer properties, i.e. the shear transfer parameter, adhesive thickness, and shear modulus, were performed. The parametric studies indicate that there exists an optimal adhesive layer thickness that generates maximum ultrasound pitch-catch signal for both wave modes. This prediction was subsequently validated by measurements. In addition, an improved match between the measured and simulated pitch-catch signals was achieved by adjusting the adhesive layer parameters.

  4. AFOSR Wafer Bonding

    DTIC Science & Technology

    2009-07-31

    cleanliness (foreign particles) and surface morphology (roughness). Two silicon wafers, when properly cleaned, can easily bond at room temperature because of...4 Figure IV data for nSi-nGaN bond. Structure is similar to that shown in Figure Difficulties and Knowledge Added Surface Morphology and...Particles One of the most important features of materials in determining whether they will bond is the quality of the bonding surfaces , in both

  5. Preliminary reliability test of lateral-current-injection GaInAsP/InP membrane distributed feedback laser on Si substrate fabricated by adhesive wafer bonding

    NASA Astrophysics Data System (ADS)

    Fukuda, Kai; Inoue, Daisuke; Hiratani, Takuo; Amemiya, Tomohiro; Nishiyama, Nobuhiko; Arai, Shigehisa

    2017-02-01

    A preliminary reliability test was performed for lateral-current-injection GaInAsP/InP membrane Distributed Feedback (DFB) lasers fabricated by multi-regrowth and adhesive wafer bonding. The measurement was conducted for lasers with two different types of p-side electrode: Ti/Au and Au/Zn/Au. The device with the Au/Zn/Au electrode, which had better current-voltage (I-V) characteristics, showed no degradation of differential quantum efficiency and threshold current after continuous aging for 310 h at a bias current density of 5 kA/cm2. This result indicates that the multi-regrowth and bonding process for the GaInAsP/InP membrane DFB laser will not impact the initial reliability.

  6. Method of bond strength evaluation for silicon direct wafer bonding

    NASA Astrophysics Data System (ADS)

    Spivak, Alexander; Avagyan, Avag; Davies, Brady R.

    2001-09-01

    A crack-opening method used for characterization of silicon direct wafer bonding (DWB) techniques was analyzed. Mathematical model describing the influence of the pattern shape on the wafer pair resistance curve, so-called the R-curve, was developed. Two-dimensional patterns were created on a mirror-polished silicon wafer surface by a combination of photolithography, deposition and etching steps. Experimental observations did show that structured wafers can be used for large bond energy measurements. We propose utilization of structured wafers for bond energy measurements. It allows R-curve shape manipulation, increases the method sensitivity, and reduces probability of wafer failure. The resulting theory can also be used for developing new experimental methods for large bond energy measurements.

  7. Rapid adhesive bonding concepts

    NASA Technical Reports Server (NTRS)

    Stein, B. A.; Tyeryar, J. R.; Hodges, W. T.

    1984-01-01

    Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process is often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid adhesive bonding concepts were developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens are cut by a factor of 10 to 100 compared to standard press bonding. The development of rapid adhesive bonding for lap shear specimens (per ASTM D1003 and D3163), for aerospace panel bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric matrix composite structures are reviewed.

  8. Metallic Adhesion and Bonding

    NASA Technical Reports Server (NTRS)

    Ferrante, J.; Smith, J. R.; Rose, J. H.

    1984-01-01

    Although metallic adhesion has played a central part in much tribological speculation, few quantitative theoretical calculations are available. This is in part because of the difficulties involved in such calculations and in part because the theoretical physics community is not particularly involved with tribology. The calculations currently involved in metallic adhesion are summarized and shown that these can be generalized into a scaled universal relationship. Relationships exist to other types of covalent bonding, such as cohesive, chemisorptive, and molecular bonding. A simple relationship between surface energy and cohesive energy is offered.

  9. Adhesive disbond detection using piezoelectric wafer active sensors

    NASA Astrophysics Data System (ADS)

    Roth, William; Giurgiutiu, Victor

    2015-04-01

    The aerospace industry continues to increase the use of adhesives for structural bonding due to the increased joint efficiency (reduced weight), even distribution of the load path and decreases in stress concentrations. However, the limited techniques for verifying the strength of adhesive bonds has reduced its use on primary structures and requires an intensive inspection schedule. This paper discusses a potential structural health monitoring (SHM) technique for the detection of disbonds through the in situ inspection of adhesive joints. This is achieved through the use of piezoelectric wafer active sensors (PWAS), thin unobtrusive sensors which are permanently bonded to the aircraft structure. The detection method discussed in this study is electromechanical impedance spectroscopy (EMIS), a local vibration method. This method detects disbonds from the change in the mechanical impedance of the structure surrounding the disbond. This paper will discuss how predictive modeling can provide valuable insight into the inspection method, and provide better results than empirical methods alone. The inspection scheme was evaluated using the finite element method, and the results were verified experimentally using a large aluminum test article, and included both pristine and disbond coupons.

  10. Rapid Adhesive Bonding of Composites

    NASA Technical Reports Server (NTRS)

    Stein, B. A.; Tyeryar, J. R.; Fox, R. L.; Sterling, S. Elmo, Jr.; Buckley, J. D.; Inge, Spencer V., Jr.; Burcher, L. G.; Wright, Robert E., Jr.

    1986-01-01

    Strong bonds created in less time and with less power than use of conventional bonding methods. Rapid adhesive bonding (RAB) technique for composites uses high-frequency induction heating toroids to quickly heat metallic susceptor impregnated with thermoplastic adhesive or sandwiched between thermoset or thermoplastic adhesive cloths or films. Susceptor steel screen or perforated steel foil.

  11. Biocompatible silicon wafer bonding for biomedical microdevices

    NASA Astrophysics Data System (ADS)

    Hansford, Derek; Desai, Tejal A.; Tu, Jay K.; Ferrari, Mauro

    1998-03-01

    In this paper,several candidate bonding materials are reviewed for use in biomedical microdevices. These include poly propylmethacrylate (PPMA), poly methylmethacrylate (PMMA), a copolymer of poly methacrylate and two types of silicone gels. They were evaluated based on their cytotoxicity and bond strength, as well as several other qualitative assessments. The cytotoxicity was determined through a cell growth assay protocol in which cells were grown on the various substrate and their growth was compared to cells grown on control substrate. The adhesive strength was assessed by using a pressurized plate test in which the adhesive interface was pressurized to failure. All of the substrate were found to be non-cytotoxic in an inert manner except for the industrial silicone adhesive gel. The adhesive strengths of the various materials are compared to each other and to previously published adhesive strengths. All of the materials were found to have a sufficient bonding strength for biomedical applications, but several other factors were determined that limit the use of each material.

  12. MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

    DOEpatents

    Chanchani, Rajen; Nordquist, Christopher; Olsson, Roy H; Peterson, Tracy C; Shul, Randy J; Ahlers, Catalina; Plut, Thomas A; Patrizi, Gary A

    2013-12-03

    In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

  13. Si-gold-glass hybrid wafer bond for 3D-MEMS and wafer level packaging

    NASA Astrophysics Data System (ADS)

    Reddy, Jayaprakash; Pratap, Rudra

    2017-01-01

    We report a relatively low temperature (<400 °C) hybrid wafer bonding process that results in the simultaneous anodic and eutectic bonding in different predetermined regions of the wafer. This hybrid bonding process has potential applications in CMOS-MEMS device integration and wafer level packaging. We demonstrate the process by realizing a simple MEMS cantilever beam and a complex MEMS gyroscope structure. These structures are characterized for ohmic contact and electromechanical response to verify the electrical interconnect and the mechanical strength of the structure at the bond interface.

  14. Reliability study of wafer bonding for micro-electro-mechanical systems

    NASA Astrophysics Data System (ADS)

    Almasri, Mahmoud; Altemus, Bruce; Gracias, Alison; Clow, Larry; Tokranova, Natalya; Castracane, James; Xu, Bai

    2003-12-01

    Wafer bonding has attracted significant attention in applications that require integration of Micro-Electro-Mechanical Systems (MEMS) with Integrated Circuits (IC). The integration of monolithic MEMS and electronic devices is difficult because of issues such as material compatibility, process compliance and thermal budget. It is important to establish a wafer bonding process which provides long-term protection for the MEMS devices yet does not affect their performance. The attentions for such integration are at the die level and wafer level. Recently, the trend is toward wafer-level integration as a cost effective solution to combine sensing, logic, actuation and communications on a single platform. This paper describes the development of low temperature bonding techniques for post-CMOS MEMS integration in system-on-chip (SOC) applications. The bonding methods discussed in this paper involve Benzocyclobutene polymer (BCB) as glue layer to joint two 200 mm wafers together. The bonding temperature is lower than 400°C. Four-point bending and stud-pull methods were used to investigate the mechanical properties of the bonding interfaces. These methods can provide critical information such as adhesion energy and bonding strength of the bonded interfaces. Initial test results at room temperature showed that the BCB bond stayed intact up to an average stress of 50 MPa. It was observed that the BCB bond strength decreased with increasing temperatures and the energy release rate decreased with decreasing BCB thickness.

  15. Reliability study of wafer bonding for micro-electro-mechanical systems

    NASA Astrophysics Data System (ADS)

    Almasri, Mahmoud; Altemus, Bruce; Gracias, Alison; Clow, Larry; Tokranova, Natalya; Castracane, James; Xu, Bai

    2004-01-01

    Wafer bonding has attracted significant attention in applications that require integration of Micro-Electro-Mechanical Systems (MEMS) with Integrated Circuits (IC). The integration of monolithic MEMS and electronic devices is difficult because of issues such as material compatibility, process compliance and thermal budget. It is important to establish a wafer bonding process which provides long-term protection for the MEMS devices yet does not affect their performance. The attentions for such integration are at the die level and wafer level. Recently, the trend is toward wafer-level integration as a cost effective solution to combine sensing, logic, actuation and communications on a single platform. This paper describes the development of low temperature bonding techniques for post-CMOS MEMS integration in system-on-chip (SOC) applications. The bonding methods discussed in this paper involve Benzocyclobutene polymer (BCB) as glue layer to joint two 200 mm wafers together. The bonding temperature is lower than 400°C. Four-point bending and stud-pull methods were used to investigate the mechanical properties of the bonding interfaces. These methods can provide critical information such as adhesion energy and bonding strength of the bonded interfaces. Initial test results at room temperature showed that the BCB bond stayed intact up to an average stress of 50 MPa. It was observed that the BCB bond strength decreased with increasing temperatures and the energy release rate decreased with decreasing BCB thickness.

  16. Beginning-to-end wafer bonding for advanced optical systems

    NASA Astrophysics Data System (ADS)

    Farrens, Shari N.; Lindner, Paul; Dwyer, Steven; Wimplinger, Markus

    2003-11-01

    The old adage "Work Smarter, Not Harder" is certainly applicable in today's competitive marketplace for Optical MEMS. In order to survive the current economic conditions, high volume manufacturers must get optimum performance and yield from each design and manufactured component. Wafer bonding, and its numerous variants, is entering mainstream production environments by providing solutions throughout the production flow. For example, SOI (silicon on insulator) and other laminated materials such as GaAs/Si are used as cost effective alternatives to molecular epitaxy methods for Bragg mirrors, rf resonators, and hybrid device fabrication. Temporary wafer bonding is used extensively to allow fragile compound semiconductors to be attached to rigid support wafers. This allows for front side and backside processing with a reduction in wafer breakage and increases in thickness uniformity results after backgrind operations. Permanent wafer bonding is used to attach compound semiconductors to each other or silicon to completely integrate optical components and logic or MEMS components. Permanent hermetic sealing is used for waveguide formation and, when combined with vacuum sealing, higher performance is achieved for RF resonators. Finally, many of the low temperature solders and eutectic alloys are finding application in low temperature wafer-to-wafer level packaging of optical devices to ceramic packages. Through clever application of these bonding methods, throughput increases and reduction in fabrication complexity givs a clear edge in the market place. This presentation will provide guidelines and process overviews needed to adopt wafer-to-wafer bonding technologies into the high volume-manufacturing environment.

  17. Uniaxially strained silicon by wafer bonding and layer transfer

    NASA Astrophysics Data System (ADS)

    Himcinschi, C.; Radu, I.; Muster, F.; Singh, R.; Reiche, M.; Petzold, M.; Gösele, U.; Christiansen, S. H.

    2007-02-01

    Uniaxial strain on wafer-level was realised by mechanically bending and direct wafer bonding of Si wafers in the bent state followed by thinning one of the Si wafers by the smart-cut process. This approach is flexible and allows to obtain different strain values at wafer-level in both tension and compression. UV micro-Raman spectroscopy was used to determine the strain in the thin transferred Si layers. Numerical modelling by 3D finite elements of the strain provided a good description of the experimental results.

  18. Rapid defect detections of bonded wafer using near infrared polariscope

    NASA Astrophysics Data System (ADS)

    Ng, Chi Seng; Asundi, Anand K.

    2011-10-01

    In modern field of microelectronics and MEMS, wafer bonding has emerged as an important processing step in wide range of manufacturing applications. During the manufacturing process, even in the modern clean room, small defects result from trapped particles and gas bubbles exist at bonded interface. Defects and trapped particles may exist on the top and bottom of the wafers, or at the interface of bonded wafer pair. These inclusions will generate high stress around debond region at the wafers bonded interface. In this paper, inspection at the bonded interface will be the interest of investigation. Since silicon wafer is opaque to visible light, defect detection at the bonded interface of silicon wafer is not possible. Due to the fact that silicon wafer is transparent to wavelength greater than 1150nm, an Near Infrared Polariscope which has showed some promises on residual stress measurement on silicon devices has been adapted and developed. This method is based on the well known photoelastic principles, where the stress variations are measured based on the changes of light propagation velocity in birefringence material. The results are compared and contrast with conventional Infrared Transmission Imaging tool (IRT) which is widely used to inspect the bonded silicon wafer. In this research, the trapped particles that are not visible via conventional infrared transmission method are identified via the generated residual stress pattern. The magnitude of the residual stress fields associated with each defect is examined qualitatively and quantitatively. The stress field generated at the wafers bonded interface will looks like a 'butterfly' pattern. Wafer pairs Pyrex-Si and Si-Si bonded interface will be examined.

  19. Overview of recent direct wafer bonding advances and applications

    NASA Astrophysics Data System (ADS)

    Moriceau, H.; Rieutord, F.; Fournel, F.; Le Tiec, Y.; Di Cioccio, L.; Morales, C.; Charvet, A. M.; Deguet, C.

    2010-12-01

    Direct wafer bonding processes are being increasingly used to achieve innovative stacking structures. Many of them have already been implemented in industrial applications. This article looks at direct bonding mechanisms, processes developed recently and trends. Homogeneous and heterogeneous bonded structures have been successfully achieved with various materials. Active, insulating or conductive materials have been widely investigated. This article gives an overview of Si and SiO2 direct wafer bonding processes and mechanisms, silicon-on-insulator type bonding, diverse material stacking and the transfer of devices. Direct bonding clearly enables the emergence and development of new applications, such as for microelectronics, microtechnologies, sensors, MEMs, optical devices, biotechnologies and 3D integration.

  20. Reduction of Thermal Conductivity in Wafer-Bonded Silicon

    SciTech Connect

    ZL Liau; LR Danielson; PM Fourspring; L Hu; G Chen; GW Turner

    2006-11-27

    Blocks of silicon up to 3-mm thick have been formed by directly bonding stacks of thin wafer chips. These stacks showed significant reductions in the thermal conductivity in the bonding direction. In each sample, the wafer chips were obtained by polishing a commercial wafer to as thin as 36 {micro}m, followed by dicing. Stacks whose starting wafers were patterned with shallow dots showed greater reductions in thermal conductivity. Diluted-HF treatment of wafer chips prior to bonding led to the largest reduction of the effective thermal conductivity, by approximately a factor of 50. Theoretical modeling based on restricted conduction through the contacting dots and some conduction across the planar nanometer air gaps yielded fair agreement for samples fabricated without the HF treatment.

  1. Infrared differential interference contrast microscopy for overlay metrology on 3D-interconnect bonded wafers

    NASA Astrophysics Data System (ADS)

    Ku, Yi-sha; Shyu, Deh-Ming; Lin, Yeou-Sung; Cho, Chia-Hung

    2013-04-01

    Overlay metrology for stacked layers will be playing a key role in bringing 3D IC devices into manufacturing. However, such bonded wafer pairs present a metrology challenge for optical microscopy tools by the opaque nature of silicon. Using infrared microscopy, silicon wafers become transparent to the near-infrared (NIR) wavelengths of the electromagnetic spectrum, enabling metrology at the interface of bonded wafer pairs. Wafers can be bonded face to face (F2F) or face to back (F2B) which the stacking direction is dictated by how the stacks are carried in the process and functionality required. For example, Memory stacks tend to use F2B stacking enables a better managed design. Current commercial tools use single image technique for F2F bonding overlay measurement because depth of focus is sufficient to include both surfaces; and use multiple image techniques for F2B overlay measurement application for the depth of focus is no longer sufficient to include both stacked wafer surfaces. There is a need to specify the Z coordinate or stacking wafer number through the silicon when visiting measurement wafer sites. Two shown images are of the same (X, Y) but separate Z location acquired at focus position of each wafer surface containing overlay marks. Usually the top surface image is bright and clear; however, the bottom surface image is somewhat darker and noisier as an adhesive layer is used in between to bond the silicon wafers. Thus the top and bottom surface images are further processed to achieve similar brightness and noise level before merged for overlay measurement. This paper presents a special overlay measurement technique, using the infrared differential interference contrast (DIC) microscopy technique to measure the F2B wafer bonding overlay by a single shot image. A pair of thinned wafers at 50 and 150 μm thickness is bonded on top of a carrier wafer to evaluate the bonding overlay. It works on the principle of interferometry to gain information about the

  2. Testing Adhesive Bonds to Cloths

    NASA Technical Reports Server (NTRS)

    Thomann, David G.

    1987-01-01

    Nondestructive tool simple and inexpensive. Easy-to-use tool nondestructively tests strength of adhesive bond between cloth and straight rigid edge. Developed for testing advanced flexible reusable surface insulation.

  3. Durability of Adhesively Bonded Structure

    DTIC Science & Technology

    1992-08-11

    frequently. Significant technology improvements have occurred In surface treatment, primers, joint analyses, adhesives and process controls. These have...clearly established the Initial cost savings potential for adhesive bonding. While this approach addresses the adequacy of joints early in service, there...processes with those changes which occur as a result of residual stress or cyclic loading in the adhesive joint 074-2R-bh 1 To fill a small part of this

  4. Adhesive Bonding for Shelters

    DTIC Science & Technology

    1980-12-01

    weru uvaluated, the type of etch bath " sweetener " and the type of rinse\\water used. The type of etch bath " sweetener " was found to have a dramatic effect...EA9601NW Adhesives on 50521134 Bare Adherenas 39 13 Stress-Durability Behavior Sun-mary 40 14 Effect of Ltch Bath Sweetening Alloy on Interracial Durability...34"’ -,,• , •’• •"• " ,,,,, 9 Adhesive/Primer/Adherend Alloy/Surface Preparation Combinations Adherend OFPL Sweetening Rinse Adhesive:Primer Alloy Alloy

  5. Computational Chemistry of Adhesive Bonds

    NASA Technical Reports Server (NTRS)

    Phillips, Donald H.

    1999-01-01

    This investigation is intended to determine the electrical mechanical, and chemical properties of adhesive bonds at the molecular level. The initial determinations will be followed by investigations of the effects of environmental effects on the chemistry and properties of the bond layer.

  6. Microwave Induced Direct Bonding of Single Crystal Silicon Wafers

    NASA Technical Reports Server (NTRS)

    Budraa, N. K.; Jackson, H. W.; Barmatz, M.

    1999-01-01

    We have heated polished doped single-crystal silicon wafers in a single mode microwave cavity to temperatures where surface to surface bonding occurred. The absorption of microwaves and heating of the wafers is attributed to the inclusion of n-type or p-type impurities into these substrates. A cylindrical cavity TM (sub 010) standing wave mode was used to irradiate samples of various geometry's at positions of high magnetic field. This process was conducted in vacuum to exclude plasma effects. This initial study suggests that the inclusion of impurities in single crystal silicon significantly improved its microwave absorption (loss factor) to a point where heating silicon wafers directly can be accomplished in minimal time. Bonding of these substrates, however, occurs only at points of intimate surface to surface contact. The inclusion of a thin metallic layer on the surfaces enhances the bonding process.

  7. Physical mechanisms of copper-copper wafer bonding

    SciTech Connect

    Rebhan, B.; Hingerl, K.

    2015-10-07

    The study of the physical mechanisms driving Cu-Cu wafer bonding allowed for reducing the bonding temperatures below 200 °C. Metal thermo-compression Cu-Cu wafer bonding results obtained at such low temperatures are very encouraging and suggest that the process is possible even at room temperature if some boundary conditions are fulfilled. Sputtered (PVD) and electroplated Cu thin layers were investigated, and the analysis of both metallization techniques demonstrated the importance of decreasing Cu surface roughness. For an equal surface roughness, the bonding temperature of PVD Cu wafers could be even further reduced due to the favorable microstructure. Their smaller grain size enhances the length of the grain boundaries (observed on the surface prior bonding), acting as efficient mass transfer channels across the interface, and hence the grains are able to grow over the initial bonding interface. Due to the higher concentration of random high-angle grain boundaries, this effect is intensified. The model presented is explaining the microstructural changes based on atomic migration, taking into account that the reduction of the grain boundary area is the major driving force to reduce the Gibbs free energy, and predicts the subsequent microstructure evolution (grain growth) during thermal annealing.

  8. Wafer bonded epitaxial templates for silicon heterostructures

    NASA Technical Reports Server (NTRS)

    Atwater, Harry A., Jr. (Inventor); Zahler, James M. (Inventor); Morral, Anna Fontcubera I (Inventor)

    2008-01-01

    A heterostructure device layer is epitaxially grown on a virtual substrate, such as an InP/InGaAs/InP double heterostructure. A device substrate and a handle substrate form the virtual substrate. The device substrate is bonded to the handle substrate and is composed of a material suitable for fabrication of optoelectronic devices. The handle substrate is composed of a material suitable for providing mechanical support. The mechanical strength of the device and handle substrates is improved and the device substrate is thinned to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. An upper portion of the device film exfoliated from the device substrate is removed to provide a smoother and less defect prone surface for an optoelectronic device. A heterostructure is epitaxially grown on the smoothed surface in which an optoelectronic device may be fabricated.

  9. Wafer bonded epitaxial templates for silicon heterostructures

    DOEpatents

    Atwater, Jr., Harry A.; Zahler, James M.; Morral, Anna Fontcubera I

    2008-03-11

    A heterostructure device layer is epitaxially grown on a virtual substrate, such as an InP/InGaAs/InP double heterostructure. A device substrate and a handle substrate form the virtual substrate. The device substrate is bonded to the handle substrate and is composed of a material suitable for fabrication of optoelectronic devices. The handle substrate is composed of a material suitable for providing mechanical support. The mechanical strength of the device and handle substrates is improved and the device substrate is thinned to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. An upper portion of the device film exfoliated from the device substrate is removed to provide a smoother and less defect prone surface for an optoelectronic device. A heterostructure is epitaxially grown on the smoothed surface in which an optoelectronic device may be fabricated.

  10. Influence of the bonding front propagation on the wafer stack curvature

    SciTech Connect

    Navarro, E.; Bréchet, Y.; Barthelemy, A.; Radu, I.; Pardoen, T.; Raskin, J.-P.

    2014-08-11

    The influence of the dynamics of the direct wafer bonding process on the curvature of the final wafer stack is investigated. An analytical model for the final curvature of the bonded wafers is developed, as a function of the different load components acting during the bonding front propagation, using thin plate theory and considering a strain discontinuity locked at the bonding interface. Experimental profiles are measured for different bonding conditions and wafer thicknesses. A very good agreement with the model prediction is obtained and the influence of the thin air layer trapped in-between the two wafers is demonstrated. The proposed model contributes to further improvement of the bonding process, in particular, for the stacking of layers of electronic devices, which requires a high accuracy of wafer-to-wafer alignment and a very low distortion level.

  11. Chemical strategies for die/wafer submicron alignment and bonding.

    SciTech Connect

    Martin, James Ellis; Baca, Alicia I.; Chu, Dahwey; Rohwer, Lauren Elizabeth Shea

    2010-09-01

    This late-start LDRD explores chemical strategies that will enable sub-micron alignment accuracy of dies and wafers by exploiting the interfacial energies of chemical ligands. We have micropatterned commensurate features, such as 2-d arrays of micron-sized gold lines on the die to be bonded. Each gold line is functionalized with alkanethiol ligands before the die are brought into contact. The ligand interfacial energy is minimized when the lines on the die are brought into registration, due to favorable interactions between the complementary ligand tails. After registration is achieved, standard bonding techniques are used to create precision permanent bonds. We have computed the alignment forces and torque between two surfaces patterned with arrays of lines or square pads to illustrate how best to maximize the tendency to align. We also discuss complex, aperiodic patterns such as rectilinear pad assemblies, concentric circles, and spirals that point the way towards extremely precise alignment.

  12. Weld bonding of titanium with polyimide adhesives

    NASA Technical Reports Server (NTRS)

    Vaughan, R. W.; Sheppard, C. H.; Orell, M. K.

    1975-01-01

    A conductive adhesive primer and a capillary flow adhesive were developed for weld bonding titanium alloy joints. Both formulations contained ingredients considered to be non-carcinogenic. Lap-shear joint test specimens and stringer-stiffened panels were weld bonded using a capillary flow process to apply the adhesive. Static property information was generated for weld bonded joints over the temperature range of 219K (-65 F) to 561K (550 F). The capillary flow process was demonstrated to produce weld bonded joints of equal strength to the weld through weld bonding process developed previously.

  13. Bonding silicon-on-insulator to glass wafers for integrated bio-electronic circuits

    NASA Astrophysics Data System (ADS)

    Kim, Hyun S.; Blick, Robert H.; Kim, D. M.; Eom, C. B.

    2004-09-01

    We report a method for bonding silicon-on-insulator wafers onto glass wafers. After pre-cleaning the wafers by an ozone and ultraviolet exposure, followed by mega-sonic water rinse, the SOI wafers are bonded to glass wafers in a vacuum chamber. This is performed at a temperature of 400 °C under an applied voltage of 700 V. The interface between the glass and SOI wafer is tested mechanically and inspected by electron beam microscopy. Furthermore, we demonstrate removal of the silicon bulk layer after wafer bonding. The quality of the single crystalline Si thin film on the glass wafers has been verified by four-circle x-ray diffraction and scanning electron microscopy. This process will allow us the integration of thin-film electronics in biological sensor applications.

  14. Wafer-bonded 2-D CMUT arrays incorporating through-wafer trench-isolated interconnects with a supporting frame.

    PubMed

    Zhuang, Xuefeng; Wygant, Ira O; Lin, Der-Song; Kupnik, Mario; Oralkan, Omer; Khuri-Yakub, Butrus T

    2009-01-01

    This paper reports on wafer-bonded, fully populated 2-D capacitive micromachined ultrasonic transducer (CMUT) arrays. To date, no successful through-wafer via fabrication technique has been demonstrated that is compatible with the wafer-bonding method of making CMUT arrays. As an alternative to through-wafer vias, trench isolation with a supporting frame is incorporated into the 2-D arrays to provide through-wafer electrical connections. The CMUT arrays are built on a silicon-on-insulator (SOI) wafer, and all electrical connections to the array elements are brought to the back side of the wafer through the highly conductive silicon substrate. Neighboring array elements are separated by trenches on both the device layer and the bulk silicon. A mesh frame structure, providing mechanical support, is embedded between silicon pillars, which electrically connect to individual elements. We successfully fabricated a 16 x 16-element 2-D CMUT array using wafer bonding with a yield of 100%. Across the array, the pulse-echo amplitude distribution is uniform (rho = 6.6% of the mean amplitude). In one design, we measured a center frequency of 7.6 MHz, a peak-to-peak output pressure of 2.9 MPa at the transducer surface, and a 3-dB fractional bandwidth of 95%. Volumetric ultrasound imaging was demonstrated by chip-to-chip bonding one of the fabricated 2-D arrays to a custom-designed integrated circuit (IC). This study shows that through-wafer trench-isolation with a supporting frame is a viable solution for providing electrical interconnects to CMUT elements and that 2-D arrays fabricated using waferbonding deliver good performance.

  15. Chitosan Adhesive Films for Photochemical Tissue Bonding

    NASA Astrophysics Data System (ADS)

    Lauto, Antonio; Mawad, Damia; Barton, Matthew; Piller, Sabine C.; Longo, Leonardo

    2011-08-01

    Photochemical tissue bonding (PTB) is a promising sutureless technique for tissue repair. PTB is often achieved by applying a solution of rose bengal (RB) between two tissue edges, which are irradiated by a green laser to crosslink collagen fibers with minimal heat production. In this study, RB has been incorporated in chitosan films to create a novel tissue adhesive that is laser-activated. Materials and Methods. Adhesive films, based on chitosan and containing ˜0.1wt% RB were manufactured and bonded to calf intestine by a solid state laser (wavelength = 532 nm, Fluence ˜110 J/cm2, spot size ˜5 mm). A single-column tensiometer, interfaced with a personal computer, tested the bonding strength. K-type thermocouples recorded the temperature (T) at the adhesive-tissue interface during laser irradiation. Human fibroblasts were also seeded on the adhesive and cultured for 48 hours to assess cell growth. Results and Conclusion. The RB-chitosan adhesive bonded firmly to the intestine (15±2 kPa, n = 31). The adhesion strength dropped to 0.5±0.1 kPa (n = 8) when the laser was not applied to the adhesive. The average temperature of the adhesive increased from 26 °C to 32 °C during laser exposure. Fibroblasts grew confluent on the adhesive without morphological changes. A new biocompatible chitosan adhesive has been developed that bonds photochemically to tissue with minimal temperature increase.

  16. Bond strength of adhesive resin cement with different adhesive systems

    PubMed Central

    Lorenzoni e Silva, Fabrizio; Pamato, Saulo; Kuga, Milton-Carlos; Só, Marcus-Vinicius-Reis

    2017-01-01

    Background To assess the immediate bond strength of a dual-cure adhesive resin cement to the hybridized dentin with different bonding systems. Material and Methods Fifty-six healthy human molars were randomly divided into 7 groups (n=8). After 3 longitudinal sections, the central cuts were included in PVC matrix and were submitted to dentin hybridization according to the groups: G1 - etch & rinse system with 3-step (Apder™ Scotchbond™ Multi-Purpose, 3M ESPE), G2 - etch & rinse system with 3-step (Optibond™ FL, Kerr), G3 - etch & rinse system with 3-step (All-Bond 3®, Bisco), G4 - etch & rinse simplified system (Adper™ Single Bond 2, 3M ESPE), G5 - self-etching system with one step (Bond Force, Tokuyama), G6 - universal system in moist dentin (Single Bond Universal, 3M ESPE), G7 - universal system in dry dentin (Single Bond Universal, 3M ESPE). Then all groups received the cementing of a self-adhesive resin cement cylinder (Duo-link, Bisco) made from a polypropylene matrix. In the evaluation of bond strength, the samples were subjected to the microshear test and evaluated according to the fracture pattern by optical microscopy. Results The Kruskal-Wallis test suggests a statistically significant difference between groups (p=0,039), and Tukey for multiple comparisons, indicating a statistically significant difference between G3 and G4 (p<0.05). It was verified high prevalence of adhesive failures, followed by mixed failure and cohesive in dentin. Conclusions The technique and the system used to dentin hybridization are able to affect the immediate bond strength of resin cement dual adhesive. Key words:Adhesion, adhesive resin cement, adhesive systems, microshear. PMID:28149471

  17. Effect of adhesive thickness on adhesively bonded T-joint

    NASA Astrophysics Data System (ADS)

    Abdullah, A. R.; Afendi, Mohd; Majid, M. S. Abdul

    2013-12-01

    The aim of this work is to analyze the effect of adhesive thickness on tensile strength of adhesively bonded stainless steel T-joint. Specimens were made from SUS 304 Stainless Steel plate and SUS 304 Stainless Steel perforated plate. Four T-joint specimens with different adhesive thicknesses (0.5, 1.0, 1.5 and 2.0 mm) were made. Experiment result shows T-joint specimen with adhesive thickness of 1.0 mm yield highest maximum load. Identical T-joint specimen jointed by spot welding was also tested. Tensile test shows welded T-Joint had eight times higher tensile load than adhesively bonded T-joint. However, in low pressure application such as urea granulator chamber, high tensile strength is not mandatory. This work is useful for designer in fertilizer industry and others who are searching for alternative to spot welding.

  18. Heat-shrinkable film improves adhesive bonds

    NASA Technical Reports Server (NTRS)

    Johns, J. M.; Reed, M. W.

    1980-01-01

    Pressure is applied during adhesive bonding by wrapping parts in heat-shrinkable plastic film. Film eliminates need to vacuum bag or heat parts in expensive autoclave. With procedure, operators are trained quickly, and no special skills are required.

  19. Polyimide adhesives for titanium and composite bonding

    NASA Technical Reports Server (NTRS)

    St. Clair, A. K.; St. Clair, T. L.

    1978-01-01

    Approach results in synthesis of addition polyimide adhesives with exceptional high temperature capabilities that show excellent potential for bonding titanium metal, polyimide/graphite composites, and combinations of these materials. Adhesives compatible with materials used in high performance aircraft and spacecraft structures also prove highly desirable in many other applications involving similar adherents.

  20. Compressive uniaxially strained silicon on insulator by prestrained wafer bonding and layer transfer

    NASA Astrophysics Data System (ADS)

    Himcinschi, C.; Reiche, M.; Scholz, R.; Christiansen, S. H.; Gösele, U.

    2007-06-01

    Wafer level compressive uniaxially strained silicon on insulator is obtained by direct wafer bonding of silicon wafers in cylindrically curved state, followed by thinning one of the wafers using the smart-cut process. The mapping of the wafer bow demonstrates the uniaxial character of the strain induced by the cylindrical bending. The interfacial properties are investigated by infrared transmission imaging, scanning acoustic microscopy, and transmission electron microscopy. UV-Raman spectroscopy is employed to determine the strain in the thin transferred layer as a function of radius of curvature of the initial bending.

  1. Adhesive bonding using variable frequency microwave energy

    DOEpatents

    Lauf, Robert J.; McMillan, April D.; Paulauskas, Felix L.; Fathi, Zakaryae; Wei, Jianghua

    1998-01-01

    Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy.

  2. Adhesive bonding using variable frequency microwave energy

    DOEpatents

    Lauf, R.J.; McMillan, A.D.; Paulauskas, F.L.; Fathi, Z.; Wei, J.

    1998-08-25

    Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy. 26 figs.

  3. Adhesive bonding using variable frequency microwave energy

    DOEpatents

    Lauf, R.J.; McMillan, A.D.; Paulauskas, F.L.; Fathi, Z.; Wei, J.

    1998-09-08

    Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy. 26 figs.

  4. High Temperature Adhesives for Bonding Kapton

    NASA Technical Reports Server (NTRS)

    Stclair, A. K.; Slemp, W. S.; Stclair, T. L.

    1978-01-01

    Experimental polyimide resins were developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of Kapton/Kapton bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575K (575 F) in vacuum. Glass transition temperatures of the polyimide/Kapton bondlines were monitored by thermomechanical analysis.

  5. Verification of surface preparation for adhesive bonding

    NASA Technical Reports Server (NTRS)

    Myers, Rodney S.

    1995-01-01

    A survey of solid rocket booster (SRB) production operations identified potential contaminants which might adversely affect bonding operations. Lap shear tests quantified these contaminants' effects on adhesive strength. The most potent contaminants were selected for additional studies on SRB thermal protection system (TPS) bonding processes. Test panels were prepared with predetermined levels of contamination, visually inspected using white and black light, then bonded with three different TPS materials over the unremoved contamination. Bond test data showed that white and black light inspections are adequate inspection methods for TPS bonding operations. Extreme levels of contamination (higher than expected on flight hardware) had an insignificant effect on TPS bond strengths because of the apparent insensitivity of the adhesive system to contamination effects, and the comparatively weak cohesive strength of the TPS materials.

  6. Environmental durability of adhesively bonded joints

    NASA Astrophysics Data System (ADS)

    Butkus, Lawrence Michael

    The goal of this project was to evaluate the environmental durability of adhesively bonded aircraft joints using fracture mechanics. Three aerospace adhesives, two epoxies and one polyimide, were investigated. Adhesive specimens were tested for tensile and toughness behavior. Bonded joint specimens were subject to Mode I, Mode II, and mixed mode fracture and fatigue tests. Prior to testing, selected specimens were exposed for up to 10,000 hours to isothermal and thermally cyclic conditions similar to aircraft service environments. Analysis was accomplished using finite element programs and closed-form solutions. Environmental exposure caused reductions in the failure strain, strength, and toughness, of the adhesive specimens and in the toughness and fatigue threshold of the bonded joint specimens. Specimens exposed to high temperature and humidity prior to testing and those tested at low temperatures indicative of high altitude operations experienced the most significant toughness losses. Results are discussed in terms of their relationship to bonded joint design and should prove valuable to efforts aimed at extending the lives of aging aircraft using bonded repairs as well as to efforts focused on using adhesive bonding for future aerospace structures.

  7. Optimizing ultrasonic imaging for adhesively bonded plates

    SciTech Connect

    Conboy, Mike; Hart, Scot; Harris-Weiel, David; Meyer, R. L.; Claytor, T. N.

    2004-01-01

    Bonded materials are used in many critical applications, making it important to determine the state of the adhesive during service or aging. It is also of importance, in many cases, to determine if the adhesive has uniformly and completely covered the area to be joined. Through dual transducer scanning, focused and unfocused transducers, and immersion scanning, the uniformity and adherence of a visco-elastic material can be evaluated. In this report, ultrasonic scanning parameters will be optimized experimentally with guidance from simulation tools including Wave 2000 pro and Imagine 3D. We explored optimizing the contrast ratio by varying the interrogation frequency and also by adjusting the distance between the transducer and bond line. An improvement in contrast should also increase the ability to detect differences in compositions and viscosity of the bonded layer. By maximizing the contrast the quality of the visco-elastic bond can be determined, and imperfections detected before adhesive failure.

  8. 49 CFR 587.16 - Adhesive bonding procedure.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 7 2011-10-01 2011-10-01 false Adhesive bonding procedure. 587.16 Section 587.16... Adhesive bonding procedure. Immediately before bonding, aluminum sheet surfaces to be bonded are thoroughly... the abrading process are removed, as these can adversely affect bonding. The adhesive is applied...

  9. 49 CFR 587.16 - Adhesive bonding procedure.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 7 2010-10-01 2010-10-01 false Adhesive bonding procedure. 587.16 Section 587.16... Adhesive bonding procedure. Immediately before bonding, aluminum sheet surfaces to be bonded are thoroughly... the abrading process are removed, as these can adversely affect bonding. The adhesive is applied...

  10. 49 CFR 587.16 - Adhesive bonding procedure.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 49 Transportation 7 2012-10-01 2012-10-01 false Adhesive bonding procedure. 587.16 Section 587.16... Adhesive bonding procedure. Immediately before bonding, aluminum sheet surfaces to be bonded are thoroughly... the abrading process are removed, as these can adversely affect bonding. The adhesive is applied...

  11. 49 CFR 587.16 - Adhesive bonding procedure.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 49 Transportation 7 2014-10-01 2014-10-01 false Adhesive bonding procedure. 587.16 Section 587.16... Adhesive bonding procedure. Immediately before bonding, aluminum sheet surfaces to be bonded are thoroughly... the abrading process are removed, as these can adversely affect bonding. The adhesive is applied...

  12. 49 CFR 587.16 - Adhesive bonding procedure.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 49 Transportation 7 2013-10-01 2013-10-01 false Adhesive bonding procedure. 587.16 Section 587.16... Adhesive bonding procedure. Immediately before bonding, aluminum sheet surfaces to be bonded are thoroughly... the abrading process are removed, as these can adversely affect bonding. The adhesive is applied...

  13. Wafer bonding technology for new generation vacuum MEMS: challenges and promises

    NASA Astrophysics Data System (ADS)

    Dragoi, V.; Pabo, E.

    2015-05-01

    Various MEMS devices are incorporated into consumer electronic devices. A particular category of MEMS require vacuum packaging by wafer bonding with the need to encapsulate vacuum levels of 10-2 mbar or higher with long time stability. The vacuum requirement is limiting the choice of the wafer bonding process and raises significant challenges to the existing investigation methods (metrology) used for results qualification. From the broad range of wafer bonding processes only few are compatible with vacuum applications: fusion bonding, anodic bonding, glass frit bonding and metal-based bonding. The outgassing from the enclosed surfaces after bonding will affect the vacuum level in the cavity: in some cases, a getter material is used inside the device cavity to compensate for this outgassing. Additionally the selected bonding process must be compatible with the devices on the wafers being bonded. This work reviews the principles of vacuum encapsulation using wafer bonding. Examples showing the suitability of each process for specific applications types will be presented. A significant challenge in vacuum MEMS fabrication is the lack of analytical methods needed for process characterization or reliability testing. A short overview of the most used methods and their limitations will be presented. Specific needs to be addressed will be introduced with examples.

  14. Viscoelastic study of an adhesively bonded joint

    NASA Technical Reports Server (NTRS)

    Joseph, P. F.

    1983-01-01

    The plane strain problem of two dissimilar orthotropic plates bonded with an isotropic, linearly viscoelastic adhesive is considered. Both the shear and the normal stresses in the adhesive are calculated for various geometries and loading conditions. Transverse shear deformations of the adherends are taken into account, and their effect on the solution is shown in the results. All three inplane strains of the adhesive are included. Attention is given to the effect of temperature, both in the adhesive joint problem and to the heat generation in a viscoelastic material under cyclic loading. This separate study is included because heat generation and or spatially varying temperature are at present too difficult to account for in the analytical solution of the bonded joint, but whose effect can not be ignored in design.

  15. High-κ Al2O3 material in low temperature wafer-level bonding for 3D integration application

    NASA Astrophysics Data System (ADS)

    Fan, J.; Tu, L. C.; Tan, C. S.

    2014-03-01

    This work systematically investigated a high-κ Al2O3 material for low temperature wafer-level bonding for potential applications in 3D microsystems. A clean Si wafer with an Al2O3 layer thickness of 50 nm was applied as our experimental approach. Bonding was initiated in a clean room ambient after surface activation, followed by annealing under inert ambient conditions at 300 °C for 3 h. The investigation consisted of three parts: a mechanical support study using the four-point bending method, hermeticity measurements using the helium bomb test, and thermal conductivity analysis for potential heterogeneous bonding. Compared with samples bonded using a conventional oxide bonding material (SiO2), a higher interfacial adhesion energy (˜11.93 J/m2) and a lower helium leak rate (˜6.84 × 10-10 atm.cm3/sec) were detected for samples bonded using Al2O3. More importantly, due to the excellent thermal conductivity performance of Al2O3, this technology can be used in heterogeneous direct bonding, which has potential applications for enhancing the performance of Si photonic integrated devices.

  16. Surface Contamination of Adhesive Bonding Materials.

    DTIC Science & Technology

    1979-12-01

    test is illustrated in Figure 19. The specimen is then exposed to some environment such as high temperature and humidity and monitored for crack growth...bonded and subsequently failed at high humidity and elevated temperatures indicate early crack propagation at the adhesive-oxide interface. Large...Adhesive Tape (A) and a Point Not Exposed to the Tape (B) 21 Positive Secondary Ion Mass Spectra from 44 6AI-4V-Ti at Room Temperature (156-1) and after

  17. Bonding Durability of Four Adhesive Systems

    PubMed Central

    Seyed Tabai, Elaheh; Mohammadi Basir, Mahshid

    2015-01-01

    Objectives: This study aimed to compare the durability of four adhesive systems by assessing their microtensile bond strength (MTBS) and microleakage during six months of water storage. Materials and Methods: A total of 128 human third molars were used. The adhesives tested were Scotch Bond Multipurpose (SBMP), Single Bond (SB), Clearfil-SE bond (CSEB), and All-Bond SE (ABSE). After sample preparation for MTBS testing, the microspecimens were subjected to microtensile tester after one day and six months of water storage. For microleakage evaluation, facial and lingual class V cavities were prepared and restored with composite. After thermocycling, microleakage was evaluated. Bond strength values were subjected to one-way ANOVA and Tamhane’s test, and the microleakage data were analyzed by the Kruskal-Wallis, Dunn, Mann Whitney and Wilcoxon tests (P<0.05). Results: Single Bond yielded the highest and ABSE yielded the lowest bond strength at one day and six months. Short-term bond strength of SBMP and CSEB was similar. After six months, a significant decrease in bond strength was observed in ABSE and SBMP groups. At one day, ABSE showed the highest microleakage at the occlusal margin; however, at the gingival margin, there was no significant difference among groups. Long-term microleakage of all groups at the occlusal margins was similar, whilst gingival margins of SBMP and SB showed significantly higher microleakage. Conclusion: The highest MTBS and favorable sealability were obtained by Clearfil SE bond. Water storage had no effect on microleakage of self-etch adhesives at the gingival margin or MTBS of CSEB and SB. PMID:27123015

  18. High-temperature healing of interfacial voids in GaAs wafer bonding

    NASA Astrophysics Data System (ADS)

    Wu, YewChung Sermon; Liu, Po Chun; Feigelson, R. S.; Route, R. K.

    2002-02-01

    Artificial voids were introduced at bonding interfaces to study how processing parameters affected the healing mechanism of interfacial voids in GaAs wafer bonding. These voids were created by placing unpatterned wafers in contact with topographically patterned wafers. During the bonding process, crystallites formed within these voids and corresponded to bonded regions within the voids. Their formation depended strongly on the height of the surface irregularities at the wafer interfaces. When the void depth (h) was ⩾200 nm, most of the crystallites were diamond shaped. The edges of the diamond features were elongated in the <100> direction. On the other hand, when the void depth was small (h⩽70 nm), dendrites grew quickly in the <110> direction.

  19. Reliable four-point flexion test and model for die-to-wafer direct bonding

    NASA Astrophysics Data System (ADS)

    Tabata, T.; Sanchez, L.; Fournel, F.; Moriceau, H.

    2015-07-01

    For many years, wafer-to-wafer (W2W) direct bonding has been very developed particularly in terms of bonding energy measurement and bonding mechanism comprehension. Nowadays, die-to-wafer (D2W) direct bonding has gained significant attention, for instance, in photonics and microelectro-mechanics, which supposes controlled and reliable fabrication processes. So, whatever the stuck materials may be, it is not obvious whether bonded D2W structures have the same bonding strength as bonded W2W ones, because of possible edge effects of dies. For that reason, it has been strongly required to develop a bonding energy measurement technique which is suitable for D2W structures. In this paper, both D2W- and W2W-type standard SiO2-to-SiO2 direct bonding samples are fabricated from the same full-wafer bonding. Modifications of the four-point flexion test (4PT) technique and applications for measuring D2W direct bonding energies are reported. Thus, the comparison between the modified 4PT and the double-cantilever beam techniques is drawn, also considering possible impacts of the conditions of measures such as the water stress corrosion at the debonding interface and the friction error at the loading contact points. Finally, reliability of a modified technique and a new model established for measuring D2W direct bonding energies is demonstrated.

  20. Ultrasonic Nondestructive Characterization of Adhesive Bonds

    NASA Technical Reports Server (NTRS)

    Qu, Jianmin

    1999-01-01

    Adhesives and adhesive joints are widely used in various industrial applications to reduce weight and costs, and to increase reliability. For example, advances in aerospace technology have been made possible, in part, through the use of lightweight materials and weight-saving structural designs. Joints, in particular, have been and continue to be areas in which weight can be trimmed from an airframe through the use of novel attachment techniques. In order to save weight over traditional riveted designs, to avoid the introduction of stress concentrations associated with rivet holes, and to take full advantage of advanced composite materials, engineers and designers have been specifying an ever-increasing number of adhesively bonded joints for use on airframes. Nondestructive characterization for quality control and remaining life prediction has been a key enabling technology for the effective use of adhesive joints. Conventional linear ultrasonic techniques generally can only detect flaws (delamination, cracks, voids, etc) in the joint assembly. However, more important to structural reliability is the bond strength. Although strength, in principle, cannot be measured nondestructively, a slight change in material nonlinearity may indicate the onset of failure. Furthermore, microstructural variations due to aging or under-curing may also cause changes in the third order elastic constants, which are related to the ultrasonic nonlinear parameter of the polymer adhesive. It is therefore reasonable to anticipate a correlation between changes in the ultrasonic nonlinear acoustic parameter and the remaining bond strength. It has been observed that higher harmonics of the fundamental frequency are generated when an ultrasonic wave passes through a nonlinear material. It seems that such nonlinearity can be effectively used to characterize bond strength. Several theories have been developed to model this nonlinear effect. Based on a microscopic description of the nonlinear

  1. Integrating III-V compound semiconductors with silicon using wafer bonding

    NASA Astrophysics Data System (ADS)

    Zhou, Yucai

    2000-12-01

    From Main Street to Wall Street, everyone has felt the effects caused by the Internet revolution. The Internet has created a new economy in the New Information Age and has brought significant changes in both business and personal life. This revolution has placed strong demands for higher bandwidth and higher computing speed due to high data traffic on today's information highway. In order to alleviate this problem, growing interconnection bottlenecks in digital designs have to be solved. The most feasible and practical way is to replace the conventional electrical interconnect with an optical interconnect. Since silicon does not have the optical properties necessary to accommodate these optical interconnect requirements, III-V based devices, most of which are GaAs-based or InP-based, must be intimately interconnected with the Si circuit at chip level. This monolithic integration technology enables the development of both intrachip and interchip optical connectors to take advantage of the enormous bandwidth provided by both high-performance very-large-scale integrated (VLSI) circuits and allied fiber and free-space optical technologies. However, lattice mismatch and thermal expansion mismatches between III-V materials and Si create enormous challenges for developing a feasible technology to tackle this problem. Among all the available approaches today, wafer bonding distinguishes itself as the most promising technology for integration due to its ability to overcome the constraints of both lattice constant mismatch and thermal expansion coefficient differences and even strain due to the crystal orientation. We present our development of wafer bonding technology for integrating III-V with Si in my dissertation. First, the pick-and-place multiple-wafer bonding technology was introduced. Then we systematically studied the wafer bonding of GaAs and InP with Si. Both high temperature wafer fusion and low/room temperature (LT/RT) wafer bonding have been investigated for

  2. Oxides formation on hydrophilic bonding interface in plasma-assisted InP/Al2O3/SOI direct wafer bonding

    NASA Astrophysics Data System (ADS)

    Gong, Kewei; Sun, Changzheng; Xiong, Bing; Han, Yanjun; Hao, Zhibiao; Wang, Jian; Wang, Lai; Li, Hongtao

    2017-01-01

    Successful direct wafer bonding between InP and silicon-on-insulator (SOI) wafers has been demonstrated by adopting a 20-nm-thick Al2O3 as the intermediate layer. A detailed investigation on the property of the bonding interface is carried out. Water contact angle test reveals an improved hydrophilicity for both the InP and the Al2O3/SOI wafers after oxygen plasma surface activation. X-ray photoelectron spectroscopy is employed to characterize the bonding interface before and after the wafer bonding process. It is found that oxides are formed on the bonding interface during bonding, which helps ensure high quality hydrophilic bonding.

  3. Rapid adhesive bonding of advanced composites and titanium

    NASA Technical Reports Server (NTRS)

    Stein, B. A.; Tyeryart, J. R.; Hodgest, W. T.

    1985-01-01

    Rapid adhesive bonding (RAB) concepts utilize a toroid induction technique to heat the adhesive bond line directly. This technique was used to bond titanium overlap shear specimens with 3 advanced thermoplastic adhesives and APC-2 (graphite/PEEK) composites with PEEK film. Bond strengths equivalent to standard heated-platen press bonds were produced with large reductions in process time. RAB produced very strong bonds in APC-2 adherend specimens; the APC-2 adherends were highly resistant to delamination. Thermal cycling did not significantly affect the shear strengths of RAB titanium bonds with polyimide adhesives. A simple ultrasonic non-destructive evaluation process was found promising for evaluating bond quality.

  4. Nondestructive Evaluation of Adhesively Bonded Joints

    NASA Technical Reports Server (NTRS)

    Nayeb-Hashemi, Hamid; Rossettos, J. N.

    1997-01-01

    The final report consists of 5 published papers in referred journals and a technical letter to the technical monitor. These papers include the following: (1) Comparison of the effects of debonds and voids in adhesive; (2) On the peak shear stresses in adhesive joints with voids; (3) Nondestructive evaluation of adhesively bonded joints by acousto-ultrasonic technique and acoustic emission; (4) Multiaxial fatigue life evaluation of tubular adhesively bonded joints; (5) Theoretical and experimental evaluation of the bond strength under peeling loads. The letter outlines the progress of the research. Also included is preliminary information on the study of nondestructive evaluation of composite materials subjected to localized heat damage. The investigators studied the effects of localized heat on unidirectional fiber glass epoxy composite panels. Specimens of the fiber glass epoxy composites were subjected to 400 C heat for varying lengths of time. The specimens were subjected to nondestructive tests. The specimens were then pulled to their failure and acoustic emission of these specimens were measured. The analysis of the data was continuing as of the writing of the letter, and includes a finite element stress analysis of the problem.

  5. Strength of adhesive-bonded hybrid structures

    NASA Technical Reports Server (NTRS)

    Kirschke, L.; Prinz, R.; Schnell, H.

    1979-01-01

    Structures prepared from materials with different thermal and mechanical properties by means of fiber-strengthened binders can fail in a number of ways. The present lecture is focused on failures through debonding at the metal or at the fiber-reinforced plastic. A method for calculating the stress distribution in adhesive layers as a function of the load is outlined, and its usefulness in providing insight into the behavior of bonds in hybrid structures is noted. Means of eliminating the unfavorable effects of temperature, humidity, creep and relaxation on the bonds in the manufacture of hybrid structures are examined, along with test methods developed for such structures.

  6. Switchable adhesion for wafer-handling based on dielectric elastomer stack transducers

    NASA Astrophysics Data System (ADS)

    Grotepaß, T.; Butz, J.; Förster-Zügel, F.; Schlaak, H. F.

    2016-04-01

    Vacuum grippers are often used for the handling of wafers and small devices. In order to evacuate the gripper, a gas flow is created that can harm the micro structures on the wafer. A promising alternative to vacuum grippers could be adhesive grippers with switchable adhesion. There have been some publications of gecko-inspired adhesive devices. Most of these former works consist of a structured surface which adheres to the object manipulated and an actuator for switching the adhesion. Until now different actuator principles have been investigated, like smart memory alloys and pneumatics. In this work for the first time dielectric elastomer stack transducers (DEST) are combined with a structured surface. DESTs are a promising new transducer technology with many applications in different industry sectors like medical devices, human-machine-interaction and soft robotics. Stacked dielectric elastomer transducers show thickness contraction originating from the electromechanical pressure of two compliant electrodes compressing an elastomeric dielectric when a voltage is applied. Since DESTs and the adhesive surfaces previously described are made of elastomers, it is self-evident to combine both systems in one device. The DESTs are fabricated by a spin coating process. If the flat surface of the spinning carrier is substituted for example by a perforated one, the structured elastomer surface and the DEST can be fabricated in one process. By electrical actuation the DEST contracts and laterally expands which causes the gecko-like cilia to adhere on the object to manipulate. This work describes the assembly and the experimental results of such a device using switchable adhesion. It is intended to be used for the handling of glass wafers.

  7. Analysis of Adhesively Bonded Ceramics Using an Asymmetric Wedge Test

    DTIC Science & Technology

    2008-12-01

    Kern, M.; Wegner, S. M. Bonding to Zirconia Ceramic: Adhesion Methods and Their Durability. Dental Materials 1998, 14 (1), 64. 18. Newman, S. M...moisture durability of adhesive bonding of ceramics is dental applications (12–14). The adhesive bonding of ceramic orthodontic inserts presents unique...removal and repair (15, 18). Determining fracture mechanics–based strain energy release rates across the interface of dental bonds has been

  8. Ultrasonic Evaluation of Thermal Degradation in Adhesive Bonds

    NASA Technical Reports Server (NTRS)

    Lih, Shyh-Shiuh; Mal, Ajit K.; Bar-Cohen, Yoseph

    1994-01-01

    The critical role played by adhesive bonds in lap joints is well known. A good knowledge of the mechanical properties of adhesive bonds in lap joints is a prerequisite to the design and reliable prediction of the performance of these bonded structures. Furthermore, the lap joint may be subject to high-temperature environments in service. Early detection of the degree of thermal degradation in adhesive bonds is required under these circumstances. A variety of ultrasonic nondestructive evaluation (NDE) techniques can be used to determine the thickness and the elastic moduli of adhesively bonded joints. In this paper we apply a previously developed technique based on the leaky Lamb wave (LLW) experiment to investigate the possibility of characterizing the thermal degradation of adhesive bonds in lap joints. The degradation of the adhesive bonds is determined through comparison between experimental data and theoretical calculations.

  9. Urethane/Silicone Adhesives for Bonding Flexing Metal Parts

    NASA Technical Reports Server (NTRS)

    Edwards, Paul D.

    2004-01-01

    Adhesives that are blends of commercially available urethane and silicone adhesives have been found to be useful for bonding metal parts that flex somewhat during use. These urethane/silicone adhesives are formulated for the specific metal parts to be bonded. The bonds formed by these adhesives have peel and shear strengths greater than those of bonds formed by double-sided tapes and by other adhesives, including epoxies and neat silicones. In addition, unlike the bonds formed by epoxies, the bonds formed by these adhesives retain flexibility. In the initial application for which the urethane/silicone adhesives were devised, there was a need to bond spring rings, which provide longitudinal rigidity for inflatable satellite booms, with the blades that provide the booms axial strength. The problem was to make the bonds withstand the stresses, associated with differences in curvature between the bonded parts, that arose when the booms were deflated and the springs were compressed. In experiments using single adhesives (that is, not the urethane/ silicone blends), the bonds were broken and, in each experiment, it was found that the adhesive bonded well with either the ring or with the blade, but not both. After numerous experiments, the adhesive that bonded best with the rings and the adhesive that bonded best with the blades were identified. These adhesives were then blended and, as expected, the blend bonded well with both the rings and the blades. The two adhesives are Kalex (or equivalent) high-shear-strength urethane and Dow Corning 732 (or equivalent) silicone. The nominal mixture ratio is 5 volume parts of the urethane per 1 volume part of the silicone. Increasing the proportion of silicone makes the bond weaker but more flexible, and decreasing the proportion of silicone makes the bond stronger but more brittle. The urethane/silicone blend must be prepared and used quickly because of the limited working time of the urethane: The precursor of the urethane

  10. High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications

    NASA Astrophysics Data System (ADS)

    Singh, R.; Radu, I.; Reiche, M.; Himcinschi, C.; Kuck, B.; Tillack, B.; Gösele, U.; Christiansen, S. H.

    2007-01-01

    Direct wafer bonding between high-density-plasma chemical vapour deposited (HDP-CVD) oxide and thermal oxide (TO) has been investigated. HDP-CVD oxides, about 230 nm in thickness, were deposited on Si(0 0 1) control wafers and the wafers of interest that contain a thin strained silicon (sSi) layer on a so-called virtual substrate that is composed of relaxed SiGe (˜4 μm thick) on Si(0 0 1) wafers. The surfaces of the as-deposited HDP-CVD oxides on the Si control wafers were smooth with a root-mean-square (RMS) roughness of <1 nm, which is sufficiently smooth for direct wafer bonding. The surfaces of the sSi/SiGe/Si(0 0 1) substrates show an RMS roughness of >2 nm. After HDP-CVD oxide deposition on the sSi/SiGe/Si substrates, the RMS roughness of the oxide surfaces was also found to be the same, i.e., >2 nm. To use these wafers for direct bonding the RMS roughness had to be reduced below 1 nm, which was carried out using a chemo-mechanical polishing (CMP) step. After bonding the HDP-CVD oxides to thermally oxidized handle wafers, the bonded interfaces were mostly bubble- and void-free for the silicon control and the sSi/SiGe/Si(0 0 1) wafers. The bonded wafer pairs were then annealed at higher temperatures up to 800 °C and the bonded interfaces were still found to be almost bubble- and void-free. Thus, HDP-CVD oxide is quite suitable for direct wafer bonding and layer transfer of ultrathin sSi layers on oxidized Si wafers for the fabrication of novel sSOI substrates.

  11. Nondestructive Characterization of Adhesive Bonds from Guided Wave Data

    NASA Technical Reports Server (NTRS)

    Mal, A. K.; Lih, S-S.; Bar-Cohen, Y.

    1994-01-01

    The critical role played by adhesive bonds in the fracture and failure of composites and other bonded materials is well known. A good knowledge of the mechanical properties of these adhesion joints is a prerequisite to reliable design and reliable prediction of the performance of these bonded structures.

  12. Room temperature wafer direct bonding of smooth Si surfaces recovered by Ne beam surface treatments

    NASA Astrophysics Data System (ADS)

    Kurashima, Yuichi; Maeda, Atsuhiko; Takagi, Hideki

    2013-06-01

    We examined the applicability of a Ne fast atom beam (FAB) to surface activated bonding of Si wafers at room temperature. With etching depth more than 1.5 nm, the bonding strength comparable to Si bulk strength was attained. Moreover, we found the improvement of the bonding strength by surface smoothing effect of the Ne FAB. Silicon surface roughness decreased from 0.40 to 0.17 nm rms by applying a Ne FAB of 30 nm etching depth. The bonding strength between surfaces recovered by Ne FAB surface smoothing was largely improved and finally became equivalent to Si bulk strength.

  13. Ultrasonic Nondestructive Characterization of Adhesive Bonds

    NASA Technical Reports Server (NTRS)

    Qu, Jianmin

    1997-01-01

    Qualitative measurements of adhesion or binding forces can be accomplished, for example, by using the reflection coefficient of an ultrasound or by using thermal waves (Light and Kwun, 1989, Achenbach and Parikh, 1991, and Bostrom and wickham, 1991). However, a quantitative determination of binding forces is rather difficult. It has been observed that higher harmonics of the fundamental frequency are generated when an ultrasound passes through a nonlinear material. It seems that such non-linearity can be effectively used to characterize the bond strength. Several theories have been developed to model this nonlinear effect (Adler and Nagy, 1991; Achenbach and Parikh, 1991; Parikh and Achenbach, 1992; and Hirose and Kitahara, 1992; Anastasi and Roberts, 1992). Based on a microscopic description of the nonlinear interface binding force, a quantitative method was presented by Pangraz and Arnold (1994). Recently, Tang, Cheng and Achenbach (1997) made a comparison between the experimental and simulated results based on this theoretical model. A water immersion mode-converted shear wave through-transmission setup was used by Berndt and Green (1997) to analyze the nonlinear acoustic behavior of the adhesive bond. In this project, the nonlinear responses of an adhesive joint was investigated through transmission tests of ultrasonic wave and analyzed by the finite element simulations. The higher order harmonics were obtained in the tests. It is found that the amplitude of higher harmonics increases as the aging increases, especially the 3dorder harmonics. Results from the numerical simulation show that the material nonlinearity does indeed generate higher order harmonics. In particular, the elastic-perfect plastic behavior generates significant 3rd and 5th order harmonics.

  14. Wafer bonding solution to epitaxial graphene-silicon integration

    NASA Astrophysics Data System (ADS)

    Dong, Rui; Guo, Zelei; Palmer, James; Hu, Yike; Ruan, Ming; Hankinson, John; Kunc, Jan; Bhattacharya, Swapan K.; Berger, Claire; de Heer, Walt A.

    2014-03-01

    A new strategy for the integration of graphene electronics with silicon complementary metal-oxide-semiconductor (Si-CMOS) technology is demonstrated that requires neither graphene transfer nor patterning. Inspired by silicon-on-insulator and three-dimensional device hyper-integration techniques, a thin monocrystalline silicon layer ready for CMOS processing is bonded to epitaxial graphene (EG) on SiC. The parallel Si and graphene electronic platforms are interconnected by metal vias. In this method, EG is grown prior to bonding so that the process is compatible with EG high temperature growth and preserves graphene integrity and nano-structuring.

  15. Evaluation of composite adhesive bonds using digital image correlation

    NASA Astrophysics Data System (ADS)

    Shrestha, Shashi Shekhar

    Advanced composite materials are widely used for many structural applications in the aerospace/aircraft industries today. Joining of composite structures using adhesive bonding offers several advantages over traditional fastening methods. However, this technique is not yet employed for fastening the primary structures of aircrafts or space vehicles. There are several reasons for this: There are not any reliable non-destructive evaluation (NDE) methods that can quantify the strength of the bonds, and there are no certifications of quality assurance for inspecting the bond quality. Therefore, there is a significant need for an effective, reliable, easy to use NDE method for the analysis of composite adhesive joints. This research aimed to investigate an adhesively bonded composite-aluminum joints of variable bond strength using digital image correlation (DIC). There are many future possibilities in continuing this research work. As the application of composite materials and adhesive bond are increasing rapidly, the reliability of the composite structures using adhesive bond should quantified. Hence a lot of similar research using various adhesive bonds and materials can be conducted for characterizing the behavior of adhesive bond. The results obtained from this research will set the foundation for the development of ultrasonic DIC as a nondestructive approach for the evaluation of adhesive bond line.

  16. Fabricating capacitive micromachined ultrasonic transducers with a novel silicon-nitride-based wafer bonding process.

    PubMed

    Logan, Andrew; Yeow, John T W

    2009-05-01

    We report the fabrication and experimental testing of 1-D 23-element capacitive micromachined ultrasonic transducer (CMUT) arrays that have been fabricated using a novel wafer-bonding process whereby the membrane and the insulation layer are both silicon nitride. The membrane and cell cavities are deposited and patterned on separate wafers and fusion-bonded in a vacuum environment to create CMUT cells. A user-grown silicon-nitride membrane layer avoids the need for expensive silicon-on-insulator (SOI) wafers, reduces parasitic capacitance, and reduces dielectric charging. It allows more freedom in selecting the membrane thickness while also providing the benefits of wafer-bonding fabrication such as excellent fill factor, ease of vacuum sealing, and a simplified fabrication process when compared with the more standard sacrificial release process. The devices fabricated have a cell diameter of 22 microm, a membrane thickness of 400 nm, a gap depth of 150 nm, and an insulation thickness of 250 nm. The resonant frequency of the CMUT in air is 17 MHz and has an attenuation compensated center frequency of approximately 9 MHz in immersion with a -6 dB fractional bandwidth of 123%. This paper presents the fabrication process and some characterization results.

  17. Wafer bonded virtual substrate and method for forming the same

    DOEpatents

    Atwater, Jr., Harry A.; Zahler, James M.; Morral, Anna Fontcuberta i

    2007-07-03

    A method of forming a virtual substrate comprised of an optoelectronic device substrate and handle substrate comprises the steps of initiating bonding of the device substrate to the handle substrate, improving or increasing the mechanical strength of the device and handle substrates, and thinning the device substrate to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. The handle substrate is typically Si or other inexpensive common substrate material, while the optoelectronic device substrate is formed of more expensive and specialized electro-optic material. Using the methodology of the invention a wide variety of thin film electro-optic materials of high quality can be bonded to inexpensive substrates which serve as the mechanical support for an optoelectronic device layer fabricated in the thin film electro-optic material.

  18. Wafer bonded virtual substrate and method for forming the same

    NASA Technical Reports Server (NTRS)

    Atwater, Jr., Harry A. (Inventor); Zahler, James M. (Inventor); Morral, Anna Fontcuberta i (Inventor)

    2007-01-01

    A method of forming a virtual substrate comprised of an optoelectronic device substrate and handle substrate comprises the steps of initiating bonding of the device substrate to the handle substrate, improving or increasing the mechanical strength of the device and handle substrates, and thinning the device substrate to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. The handle substrate is typically Si or other inexpensive common substrate material, while the optoelectronic device substrate is formed of more expensive and specialized electro-optic material. Using the methodology of the invention a wide variety of thin film electro-optic materials of high quality can be bonded to inexpensive substrates which serve as the mechanical support for an optoelectronic device layer fabricated in the thin film electro-optic material.

  19. Primary Adhesively Bonded Structure Technology (PABST). Design Handbook for Adhesive Bonding

    DTIC Science & Technology

    1979-11-01

    47 EFFECT OF MOISTURE IN ADHESIVE ON BOND STRESS DISTRIBUTIONS 95 The use of adhesive to fill up the gaps where parts don’t fit is incompatible with...cap and web and chamfer tht base as shown in Figure 72? If the longeron ends adjacent to another member, which is often the case, the gap between the... to2 ) EVALUATE X4 AT TEMPERATURE GIVING LEAST VALUE - AGAIN, THE HOTTEST OPTIMUM OVERLAP = Rp + I’uY(NO GREATER OVERLAP CAN INCREASE JOINT STRENGTH

  20. [The application of universal adhesives in dental bonding].

    PubMed

    Guo, Jingmei; Lei, Wenlong; Yang, Hongye; Huang, Cui

    2016-03-01

    The bonding restoration has become an important clinical technique for the development of dental bonding technology. Because of its easy operation and the maximum preservation of tooth tissues, bonding repair is widely used in dental restoration. The recent multi-mode universal adhesives have brought new progress in dental bonding restoration. In this article the universal adhesives were reviewed according to its definition, development, improvement, application features and possible problems.

  1. Progressive materials integration: III-V on insulator by wafer bonding

    NASA Astrophysics Data System (ADS)

    Hayashi, Sumiko Lynn

    The development of wafer bonded III-V on insulator structures aims to provide advancements in high-speed electronic applications such as High Electron Mobility Transistors. This study demonstrates the feasibility of hydrogen exfoliated template layers for the growth III-V based device structures. InP layers are transferred to GaAs substrates to assess the suitability of the InP layer as a template for metal-organic vapor phase epitaxial growth. Strong, large area bonds between III-V wafers are achieved using SiN intermediate layers, which provide robust structures at high temperatures. The bonding mechanisms of SiN layers with a short oxygen plasma exposure are found to mimic those of SiO2. These bonds are strong enough to withstand thermal strain imposed by bonded wafers that exhibit appreciable coefficient of thermal expansion mismatch, such as InP and GaAs. These bonded wafers exhibit some stability against defect formation for low thermal strains. However, depending upon the thermal expansion coefficient mismatch and required thermal processing, misfit dislocations can form to relieve this thermal strain. Careful control of both template thickness and annealing temperatures leads to a stable template for subsequent epitaxial growth. Once bonding is complete, the template layer is separated from the bulk by a technique of hydrogen ion implantation and exfoliation. The layer exfoliation from a hydrogen implanted InP substrate is facilitated by the formation of extended defects in a certain temperature regime due to hydrogen trapping. Subsequently increasing the temperature produces rapid planar exfoliation. This two-step annealing scheme simultaneously allows the wafer bond to strengthen during the low temperature defect nucleation phase. After exfoliation, the surface of the template layer is generally very rough, therefore a chemical mechanical polishing step was developed to planarize this layer for subsequent epitaxial growth. Damage-free planarization of the

  2. Improved primer for bonding polyurethane adhesives to metals

    NASA Technical Reports Server (NTRS)

    Constanza, L. J.

    1969-01-01

    Primer ensures effective bonding integrity of polyurethane adhesives on metal surfaces at temperatures ranging from minus 423 degrees to plus 120 degrees F. It provides greater metal surface protection and bond strengths over this temperature range than could be attained with other adhesive systems.

  3. Bond Assembly FOD Zones - A Procedure for Assuring Acceptable Adhesion

    NASA Technical Reports Server (NTRS)

    Evans, Kurt; Wurth, Laura; Mitchell, Mark

    2009-01-01

    Rocket motor components are primarily assembled by adhesion. a) For example, the RSRM (Reusable Solid Rocket Motor - part of the Space Shuttle Boosters) system contains 10,000 sq ft of bondline area. b) Rocket motors contain a variety of adhesive/substrate bond systems c) Bond system performance requirements also vary. To assemble reliable components, ATK Space Systems and customers invest substantial resources to the study of bond assembly processes. a) Surface and adhesion science; b) Adhesive chemistry; c) Process parameters; d) Contamination effects.

  4. Comparison of Bond in Roll-bonded and Adhesively Bonded Aluminums

    NASA Technical Reports Server (NTRS)

    Schwensfeir, R. J., Jr.; Trenkler, G.; Delagi, R. G.; Forster, J. A.

    1985-01-01

    Lap-shear and peel test measurements of bond strength have been carried out as part of an investigation of roll bonding of 2024 and 7075 aluminum alloys. Shear strengths of the bonded material in the F temper are in the range of 14 to 16 ksi. Corresponding peel strengths are 120 to 130 lb/inch. These values, which are three to five times those reported in the literature for adhesively bonded 2024 and 7075, are a result of the true metallurgical bond achieved. The effects of heat-treating the bonded material are described and the improvements in bond strength discussed relative to the shear strength of the parent material. The significance of the findings for aerospace applications is discussed.

  5. Nondestructive Evaluation of Adhesive Bonds via Ultrasonic Phase Measurements

    NASA Technical Reports Server (NTRS)

    Haldren, Harold A.; Perey, Daniel F.; Yost, William T.; Cramer, K. Elliott; Gupta, Mool C.

    2016-01-01

    The use of advanced composites utilizing adhesively bonded structures offers advantages in weight and cost for both the aerospace and automotive industries. Conventional nondestructive evaluation (NDE) has proved unable to reliably detect weak bonds or bond deterioration during service life conditions. A new nondestructive technique for quantitatively measuring adhesive bond strength is demonstrated. In this paper, an ultrasonic technique employing constant frequency pulsed phased-locked loop (CFPPLL) circuitry to monitor the phase response of a bonded structure from change in thermal stress is discussed. Theoretical research suggests that the thermal response of a bonded interface relates well with the quality of the adhesive bond. In particular, the effective stiffness of the adhesive-adherent interface may be extracted from the thermal phase response of the structure. The sensitivity of the CFPPLL instrument allows detection of bond pathologies that have been previously difficult-to-detect. Theoretical results with this ultrasonic technique on single epoxy lap joint (SLJ) specimens are presented and discussed. This technique has the potential to advance the use of adhesive bonds - and by association, advanced composite structures - by providing a reliable method to measure adhesive bond strength, thus permitting more complex, lightweight, and safe designs.

  6. High-κ Al{sub 2}O{sub 3} material in low temperature wafer-level bonding for 3D integration application

    SciTech Connect

    Fan, J. Tu, L. C.; Tan, C. S.

    2014-03-15

    This work systematically investigated a high-κ Al{sub 2}O{sub 3} material for low temperature wafer-level bonding for potential applications in 3D microsystems. A clean Si wafer with an Al{sub 2}O{sub 3} layer thickness of 50 nm was applied as our experimental approach. Bonding was initiated in a clean room ambient after surface activation, followed by annealing under inert ambient conditions at 300 °C for 3 h. The investigation consisted of three parts: a mechanical support study using the four-point bending method, hermeticity measurements using the helium bomb test, and thermal conductivity analysis for potential heterogeneous bonding. Compared with samples bonded using a conventional oxide bonding material (SiO{sub 2}), a higher interfacial adhesion energy (∼11.93 J/m{sup 2}) and a lower helium leak rate (∼6.84 × 10{sup −10} atm.cm{sup 3}/sec) were detected for samples bonded using Al{sub 2}O{sub 3}. More importantly, due to the excellent thermal conductivity performance of Al{sub 2}O{sub 3}, this technology can be used in heterogeneous direct bonding, which has potential applications for enhancing the performance of Si photonic integrated devices.

  7. Rapid adhesive bonding and field repair of aerospace materials

    NASA Technical Reports Server (NTRS)

    Stein, B. A.

    1985-01-01

    Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process are often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid Adhesive Bonding concepts are developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens can be cut by a factor of 10 to 100 compared to standard press or autoclave bonding. The development of Rapid Adhesive Bonding for lap shear specimens (per ASTM D1002 and D3163), for aerospace panel or component bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric-matrix composite structures is reviewed. Equipment and procedures are described for bonding and repairing thin sheets, simple geometries, and honeycomb core panels.

  8. III-V compound semiconductor multi-junction solar cells fabricated by room-temperature wafer-bonding technique

    NASA Astrophysics Data System (ADS)

    Arimochi, Masayuki; Watanabe, Tomomasa; Yoshida, Hiroshi; Tange, Takashi; Nomachi, Ichiro; Ikeda, Masao; Dai, Pan; He, Wei; Ji, Lian; Lu, Shulong; Yang, Hui; Uchida, Shiro

    2015-05-01

    We have developed III-V compound semiconductor multi-junction solar cells by a room-temperature wafer-bonding technique to avoid the formation of dislocations and voids due to lattice mismatch and thermal damage during a conventional high-temperature wafer-bonding process. First, we separately grew an (Al)GaAs top cell on a GaAs substrate and an InGaAs bottom cell on an InP substrate by metal solid source molecular beam epitaxy. Thereafter, we successfully bonded these sub-cells by the room-temperature wafer-bonding technique and fabricated (Al)GaAs ∥ InGaAs wafer-bonded solar cells. To the best of our knowledge, the obtained GaAs ∥ InGaAs and AlGaAs ∥ InGaAs wafer-bonded solar cells exhibited the lowest electrical and optical losses ever reported. The AlGaAs ∥ InGaAs solar cells reached the maximum efficiency of 27.7% at 120 suns. These results suggest that the room-temperature wafer-bonding technique has high potential for achieving higher conversion efficiencies.

  9. Use of an adhesive resin for bonding orthodontic brackets.

    PubMed

    Ireland, A J; Sherriff, M

    1994-02-01

    To date, most successful bonding agents used in orthodontics rely on mechanical retention to both the enamel and bracket base. Chemical adhesion to enamel as seen with glass ionomer cements, and to the silanated base of ceramic brackets have been tried. Recent developments in resin formulation have led to the production of adhesive diacrylate resins capable of forming adhesive bonds to certain metals including stainless steel. The aim of this experiment was to compare such a resin, Panavia EX, with a more conventional 'no-mix' orthodontic bonding resin. Two different base retention mechanisms were used, and the effect of rebonding and differing environmental conditions were also investigated. The results indicated that Panavia EX could produce greater bond strengths than the more conventional bonding resin. Of the two base retention systems tested, braised mesh bases gave consistently greater bond strengths than the cast base, although no base/resin specificity could be detected. Re-using the same brackets showed rebound strengths to be significantly lower than initial bond strength although the results indicated the adhesive resin was still able to bond more effectively to these used brackets than the conventional resin. Environment had the greatest effect on bond strength, such that following environmental exposure there was no significant difference between the two resins. This latter factor, and in particular the more complex bonding technique required for the adhesive resin, means that Panavia EX cannot be recommended for orthodontic use in its present form.

  10. Bonding of adhesive resin luting agents to metal and amalgam.

    PubMed

    Osman, Saad A; McCabe, John F; Walls, Angus W G

    2008-12-01

    The shear bond strength of three adhesives, Panavia 21, Superbond, All Bond C&B Cement, and a dual cure resin (Variolink), to Ni-Cr-Be (Rexillium III), Midigold (Type III gold) and Amalgam (Sybraloy) were determined. Fifteen samples were prepared using 800 grit abrasive papers for Ni-Cr and Midi-Gold, and 100 grit papers for amalgam. Ni-Cr-Be and Midi-Gold samples were sandblasted for 30 s and steam cleaned for 10 s. The adhesives were bonded to the samples using gelatine capsules and were matured for 24 h in water at 37 degrees C. The samples were debonded in shear using an Instron at a cross-head speed of 1 mm/min. The data was analysed using ANOVA and a Tukey test. The bond strength of Superbond to both metal alloys was significantly higher (P<0.05) than any of the materials tested, with the exception Panavia 21 to gold. The bond strength of All Bond C&B cement had shown to be not significant difference from those of Panavia 21 and Variolink, when bonded to Rexillium and Midi-Gold, respectively. The bond strength of All Bond C&B Cement to amalgam was significantly greater (P<0.05) than those of the other materials tested. The shear bond strength to gold showed lower bonding for all adhesives when compared with Rexillium (P<.001). The ranking of bond strength to both alloys was as follows: Superbond>Panavia 21>All Bond C&B>Variolink. The nature of substrate to be used for bonding and the adhesive material itself are important factors in bonding which can be achieved between cast metals and prepared teeth with amalgam filling. Superbond should be successful as an adhesive for the attachment of all substrates tested, with the possible exception of amalgam, for which All Bond C&B Cement gives the best result.

  11. Microleakage under orthodontic brackets bonded with different adhesive systems

    PubMed Central

    Alkis, Huseyin; Turkkahraman, Hakan; Adanir, Necdet

    2015-01-01

    Objective: This in vitro study aimed to compare the microleakage of orthodontic brackets between enamel-adhesive and adhesive-bracket interfaces at the occlusal and gingival margins bonded with different adhesive systems. Materials and Methods: A total of 144 human maxillary premolar teeth extracted for orthodontic reasons was randomly divided into four groups. Each group was then further divided into three sub-groups. Three total-etching bonding systems (Transbond XT, Greengloo and Kurasper F), three one-step self-etching bonding systems (Transbond Plus SEP, Bond Force and Clearfil S3), three two-step self-etching bonding systems (Clearfil SE Bond, Clearfil Protectbond and Clearfil Liner Bond), and three self-adhesive resin cements (Maxcem Elite, Relyx U 100 and Clearfil SA Cement) were used to bond the brackets to the teeth. After bonding, all teeth were sealed with nail varnish and stained with 0.5% basic fuchsine for 24 h. All samples were sectioned and examined under a stereomicroscope to score for microleakage at the adhesive–enamel and adhesive–bracket interfaces from both occlusal and gingival margins. Statistical Analysis Used: Statistical analyses were performed with Kruskal–Wallis and Wilcoxon signed-rank tests. Results: The results indicate no statistically significant differences between the microleakage scores of the adhesives; microleakage was detected in all groups. Comparison of the average values of the microleakage scores in the enamel–adhesive and adhesive–bracket interfaces indicated statistically significant differences (P < 0.05). The amount of the microleakage was higher at the enamel–adhesive interface than at the bracket-adhesive interface. Conclusions: All of the brackets exhibited some amount of microleakage. This result means that microleakage does not depend on the type of adhesive used. PMID:25713494

  12. Indium Zinc Oxide Mediated Wafer Bonding for III-V/Si Tandem Solar Cells

    SciTech Connect

    Tamboli, Adele C.; Essig, Stephanie; Horowitz, Kelsey A. W.; Woodhouse, Michael; van Hest, Maikel F. A. M.; Norman, Andrew G.; Steiner, Myles A.; Stradins, Paul

    2015-06-14

    Silicon-based tandem solar cells are desirable as a high efficiency, economically viable approach to one sun or low concentration photovoltaics. We present an approach to wafer bonded III-V/Si solar cells using amorphous indium zinc oxide (IZO) as an interlayer. We investigate the impact of a heavily doped III-V contact layer on the electrical and optical properties of bonded test samples, including the predicted impact on tandem cell performance. We present economic modeling which indicates that the path to commercial viability for bonded cells includes developing low-cost III-V growth and reducing constraints on material smoothness. If these challenges can be surmounted, bonded tandems on Si can be cost-competitive with incumbent PV technologies, especially in low concentration, single axis tracking systems.

  13. Low temperature wafer-level bonding for hermetic packaging of 3D microsystems

    NASA Astrophysics Data System (ADS)

    Tan, C. S.; Fan, J.; Lim, D. F.; Chong, G. Y.; Li, K. H.

    2011-07-01

    Metallic copper-copper (Cu-Cu) thermo-compression bonding, oxide-oxide (SiO2-SiO2) fusion bonding and silicon-silicon (Si-Si) direct bonding are investigated for potential application as hermetic seal in 3D microsystem packaging. Cavities are etched to a volume of 1.4 × 10-3 cm3 in accordance with the MIL-STD-883E standard prescribed for microelectronics packaging. In the case of metal bonding, a clean Cu layer with a thickness of 300 nm and a Ti barrier layer with an underlying thickness of 50 nm are used. The wafer pair is bonded at 300 °C under the application of a bonding force of 5500 N for 1 h. On the other hand, Si-Si bonding and SiO2-SiO2 bonding are initiated at room ambient after surface activation, followed by annealing in inert ambient at 300 °C for 1 h. The bonded cavities are stored in a helium bomb chamber and the leak rate is measured with a mass spectrometer. An excellent helium leak rate below 5 × 10-9 atm cm3 s-1 is detected for all cases and this is at least ten times better than the reject limit.

  14. Stress analysis of transferred thin-GaN LED by Au-Si wafer bonding

    NASA Astrophysics Data System (ADS)

    Hsu, S. C.; Liu, C. Y.

    2005-09-01

    Nowadays, the high power GaN-based LED has attracted serious attention for the lighting application. One of key issues for high power GaN-base LED to achieve sufficient lighting efficiency over the traditional light sources, such as, white incandescent and halogen light bulb is the efficiency of heat dissipation. Typically, GaN epi-layer is grown on sapphire substrates. The poor thermal conductivity of sapphire substrate has been identified to be the main limitation for the application of high power GaN LED. To improve the heat dissipation and lighting efficiency, we report a thin GaN structure by using Au-Si wafer bonding and Laser lift-off (LLO) technique. The GaN wafer was first deposited with a Au bonding layer and bonded onto a good thermal conduction substrate, i.e., heavy-doped Si. Then, 248nm KrF excimer Laser was used to strip the original sapphire substrate. To assure a successful GaN epi-layer transferring, Raman spectrum on the transferred GaN layer was performed and the result shows no quality change in the transferred GaN layer. In this work, we also fabricated the vertical LED devices on the transferred GaN epi-layer. Therefore, L-I-V result was obtained which will be presented in this talk. Moreover, we will discuss the effects and advantages of Au-Si bonding on the efficiency of lighting.

  15. Automation Tools for Finite Element Analysis of Adhesively Bonded Joints

    NASA Technical Reports Server (NTRS)

    Tahmasebi, Farhad; Brodeur, Stephen J. (Technical Monitor)

    2002-01-01

    This article presents two new automation creation tools that obtain stresses and strains (Shear and peel) in adhesively bonded joints. For a given adhesively bonded joint Finite Element model, in which the adhesive is characterised using springs, these automation tools read the corresponding input and output files, use the spring forces and deformations to obtain the adhesive stresses and strains, sort the stresses and strains in descending order, and generate plot files for 3D visualisation of the stress and strain fields. Grids (nodes) and elements can be numbered in any order that is convenient for the user. Using the automation tools, trade-off studies, which are needed for design of adhesively bonded joints, can be performed very quickly.

  16. Resolving fundamental limits of adhesive bonding in microfabrication.

    SciTech Connect

    Hall, Jessica S.; Frischknecht, Amalie Lucile; Emerson, John Allen; Adkins, Douglas Ray; Kent, Michael Stuart; Read, Douglas H.; Giunta, Rachel Knudsen; Lamppa, Kerry P.; Kawaguchi, Stacie; Holmes, Melissa A.

    2004-04-01

    As electronic and optical components reach the micro- and nanoscales, efficient assembly and packaging require the use of adhesive bonds. This work focuses on resolving several fundamental issues in the transition from macro- to micro- to nanobonding. A primary issue is that, as bondline thicknesses decrease, knowledge of the stability and dewetting dynamics of thin adhesive films is important to obtain robust, void-free adhesive bonds. While researchers have studied dewetting dynamics of thin films of model, non-polar polymers, little experimental work has been done regarding dewetting dynamics of thin adhesive films, which exhibit much more complex behaviors. In this work, the areas of dispensing small volumes of viscous materials, capillary fluid flow, surface energetics, and wetting have all been investigated. By resolving these adhesive-bonding issues, we are allowing significantly smaller devices to be designed and fabricated. Simultaneously, we are increasing the manufacturability and reliability of these devices.

  17. Hexagonal pyramid shaped light-emitting diodes based on ZnO and GaN direct wafer bonding

    NASA Astrophysics Data System (ADS)

    Murai, Akihiko; Thompson, Daniel B.; Masui, Hisashi; Fellows, Natalie; Mishra, Umesh K.; Nakamura, Shuji; DenBaars, Steven P.

    2006-10-01

    The authors report on hexagonal pyramid shaped light-emitting diode (LED) based on ZnO and GaN wafer bonding. After direct wafer bonding of an n-type ZnO substrate to a III-nitride LED wafer, O-plane ZnO was selectively etched to form an electrode having a truncated hexagonal pyramid shape. This wafer bonded LED chip was evaluated with optical output power as a function of forward current and was 2.2 times higher than a conventional-type LED chip having thin Ni (5nm)/Au (10nm) p-type electrode at forward current condition of 20mA.

  18. Investigation of Adhesive Bond Cure Conditions using Nonlinear Ultrasonic Methods

    NASA Technical Reports Server (NTRS)

    Berndt, Tobias P.; Green, Robert E., Jr.

    1999-01-01

    The objective of this presentation is to investigate various cure conditions of adhesive bonds using nonlinear ultrasonic methods with water coupling. Several samples were used to obtain normal incidence, oblique incidence, and wave mixing.

  19. Evolution of the interface structure of bonded Si wafers after high temperature annealing

    NASA Astrophysics Data System (ADS)

    Zakharov, N. D.; Pippel, E.; Werner, P.; Gösele, U.; Vdovin, V.; Milvidskii, M.; Ries, M.; Seacrist, M.; Falster, R.

    2010-02-01

    The evolution of the interfaces of bonded Si wafers and the corresponding low-angle twist boundary have been analysed in dependence on thermal annealing. Two orientation relations were investigated: i) Si(001)/SiO2/Si(001) and ii) Si(110)/SiO2/Si(001). The interfaces were analysed by TEM and STEM/EDX and EELS. It is found that the decomposition rate of the intermediate oxide layer and the formation of a Si-Si bonded interface depend very much on the lattice mismatch and on the twist angle. A dissolution of the oxide and the formation of Si-Si boundaries occur much faster in the case of Si(110)/Si(001) bonding than in Si(001)/Si(001). The process of interface fusion and the dissolution of the oxide layer are discussed.

  20. III-V/Si wafer bonding using transparent, conductive oxide interlayers

    SciTech Connect

    Tamboli, Adele C. Hest, Maikel F. A. M. van; Steiner, Myles A.; Essig, Stephanie; Norman, Andrew G.; Bosco, Nick; Stradins, Paul; Perl, Emmett E.

    2015-06-29

    We present a method for low temperature plasma-activated direct wafer bonding of III-V materials to Si using a transparent, conductive indium zinc oxide interlayer. The transparent, conductive oxide (TCO) layer provides excellent optical transmission as well as electrical conduction, suggesting suitability for Si/III-V hybrid devices including Si-based tandem solar cells. For bonding temperatures ranging from 100 °C to 350 °C, Ohmic behavior is observed in the sample stacks, with specific contact resistivity below 1 Ω cm{sup 2} for samples bonded at 200 °C. Optical absorption measurements show minimal parasitic light absorption, which is limited by the III-V interlayers necessary for Ohmic contact formation to TCOs. These results are promising for Ga{sub 0.5}In{sub 0.5}P/Si tandem solar cells operating at 1 sun or low concentration conditions.

  1. Transparent and electrically conductive GaSb/Si direct wafer bonding at low temperatures by argon-beam surface activation

    NASA Astrophysics Data System (ADS)

    Predan, F.; Reinwand, D.; Klinger, V.; Dimroth, F.

    2015-10-01

    Direct wafer bonds of the material system n-GaSb/n-Si have been achieved by means of a low-temperature direct wafer bonding process, enabling an optical transparency of the bonds along with a high electrical conductivity of the boundary layer. In the used technique, the surfaces are activated by sputter-etching with an argon fast-atom-beam (FAB) and bonded in ultra-high vacuum. The bonds were annealed at temperatures between 300 and 400 °C, followed by an optical, mechanical and electrical characterization of the interface. Additionally, the influence of the sputtering on the surface topography of the GaSb was explicitly investigated. Fully bonded wafer pairs with high bonding strengths were found, as no blade could be inserted into the bonds without destroying the samples. The interfacial resistivities of the bonded wafers were significantly reduced by optimizing the process parameters, by which Ohmic interfacial resistivities of less than 5 mΩ cm2 were reached reproducibly. These promising results make the monolithic integration of GaSb on Si attractive for various applications.

  2. Hydrolytic stability of self-etch adhesives bonded to dentin.

    PubMed

    Inoue, S; Koshiro, K; Yoshida, Y; De Munck, J; Nagakane, K; Suzuki, K; Sano, H; Van Meerbeek, B

    2005-12-01

    Functional monomers chemically interact with hydroxyapatite that remains within submicron hybrid layers produced by mild self-etch adhesives. The functional monomer 10-MDP interacts most intensively with hydroxyapatite, and its calcium salt appeared most hydrolytically stable, as compared with 4-MET and phenyl-P. We investigated the hypothesis that additional chemical interaction of self-etch adhesives improves bond stability. The micro-tensile bond strength (muTBS) of the 10-MDP-based adhesive did not decrease significantly after 100,000 cycles, but did after 50,000 and 30,000 cycles, respectively, for the 4-MET-based and the phenyl-P-based adhesives. Likewise, the interfacial ultrastructure was unchanged after 100,000 thermocycles for the 10-MDP-based adhesive, while that of both the 4-MET- and phenyl-P-based adhesives contained voids and less-defined collagen. The findings of this study support the concept that long-term durability of adhesive-dentin bonds depends on the chemical bonding potential of the functional monomer.

  3. Improved stress prediction in adhesive bonded optical components

    NASA Astrophysics Data System (ADS)

    de Vreugd, J.; te Voert, M. J. A.; Nijenhuis, J. R.; Pijnenburg, J. A. C. M.; Tabak, E.

    2012-09-01

    Adhesives are widely used in optomechanical structures for bonding optical components to their mounts. The main advantage of using adhesives is the excellent strength to weight ratio. Adhesive bonding is seen as a desirable joining technique as it allows for greater flexibility in design. A disadvantage of adhesives however is the limited dimensional stability and loadability. To design stable optical mounts, accurate prediction of stresses and deformation is therefore needed. Adhesives show strong temperature and loading history dependent behavior. Viscoelastic material models are needed for accurate prediction of stresses and strains in bonded joints. However, representative material data for adhesives is difficult to find. In this research, an experimental framework is build up to determine relevant mechanical properties of adhesives for improving stress and deformation prediction. This paper shows the results of the characterization experiments and modeling techniques. Also the implementation of material models in finite element code is briefly discussed. The obtained models are used in the mount design in the EUCLID and TROPOMI programs as described in “Ultra stable isostatic bonded optical mount design for harsh environments, J.A.C.M Pijnenburg et al” (this conference).

  4. Moisture contamination detection in adhesive bond using embedded FBG sensors

    NASA Astrophysics Data System (ADS)

    Mieloszyk, Magdalena; Ostachowicz, Wiesław

    2017-02-01

    The paper presents an application of embedded fibre Bragg grating (FBG) sensors for moisture contamination detection in an adhesive bond between two composite elements. FBG sensors are a great tool to Structural Health Monitoring of composite structures due to their high corrosion resistance as well as their small size and weight. Adhesive bonds are very popular in many industrial branches. One of the major problem limits the use of an adhesive joints is they sensitivity on water form ambient. Even the 1% of moisture affects an adhesive bond layer strength. FBG sensors can be use for detection of even a small amount of moisture concentration (1-3% of sample weight). It can be also used for determination of moisture concentration changes during both soaking and drying processes.

  5. Adhesive bonding via exposure to variable frequency microwave radiation

    SciTech Connect

    Paulauskas, F.L.; McMillan, A.D.; Warren, C.D.

    1996-05-01

    Adhesive bonding through the application of variable frequency microwave (VFM) radiation has been evaluated as an alternative curing method for joining composite materials. The studies showed that the required cure time of a thermosetting epoxy adhesive is substantially reduced by the use of VFM when compared to conventional (thermal) curing methods. Variable frequency microwave processing appeared to yield a slight reduction in the required adhesive cure time when compared to processing by the application of single frequency microwave radiation. In contrast to the single frequency processing, the variable frequency methodology does not readily produce localized overheating (burnt or brown spots) in the adhesive or the composite. This makes handling and location of the sample in the microwave oven less critical for producing high quality bonds and allows for a more homogeneous distribution of the cure energy. Variable frequency microwave processing is a valuable alternative method for rapidly curing thermoset adhesives at low input power levels.

  6. Stress analysis of adhesive bonded stiffener plates and double joints

    NASA Technical Reports Server (NTRS)

    Yuceoglu, U.; Updike, D. P.

    1975-01-01

    The general problem of adhesive bonded stiffener plates and double joints of dissimilar orthotropic adherends with transverse shear deformations are analyzed. Adhesive layers are assumed to be of an isotropic, elastic and relatively flexible material. It is shown that the stress distributions in the adhesive layers are very much dependent on the bending deformations in adherends. Also, it is found that, in the adhesive layer, maximum transverse normal stress is, in many cases, larger than the longitudinal shear stress and that both occur at the edge of the joint. The general method of solution developed is applied to several practical examples.

  7. Bonding of crown and bridge adhesive resins to dentine.

    PubMed

    Osman, Saad A; McCabe, John F; Walls, Angus W G

    2008-12-01

    The shear bond strength of three adhesives, Panavia 21, Superbond, All Bond C&B Cement, and Variolink (a dual cure resin) to various dentine depths were determined. Fifteen human fully erupted permanent first and second molars were wet ground using 500 and then 800 grit abrasive papers to expose the superficial, middle and the deep dentine, for each adhesive tested. Five samples were prepared for each dentine depth. The adhesives were bonded to the samples using gelatine capsules and were matured for 24 h in water at 37 degrees C. The samples were debonded in shear using tensile testing machine at a cross-head speed of 1 mm/min. The data were analysed using ANOVA and the Tukey test. The fracture surfaces were examined by optical microscopy. The bond strength of Superbond to dentine was significantly higher (P<0.05) than any of the materials tested. The bond strength of all materials tested was shown to be affected by dentine depth, except for Superbond. Fractured dentine specimens showed that the samples of Superbond are almost cohesive (>90%), and the samples of other adhesives are mostly adhesive (>70%). These results confirm that Superbond is capable of forming a bond at various dentine depths.

  8. Integrated optical MEMS using through-wafer vias and bump-bonding.

    SciTech Connect

    McCormick, Frederick Bossert; Frederick, Scott K.

    2008-01-01

    This LDRD began as a three year program to integrate through-wafer vias, micro-mirrors and control electronics with high-voltage capability to yield a 64 by 64 array of individually controllable micro-mirrors on 125 or 250 micron pitch with piston, tip and tilt movement. The effort was a mix of R&D and application. Care was taken to create SUMMiT{trademark} (Sandia's ultraplanar, multilevel MEMS technology) compatible via and mirror processes, and the ultimate goal was to mate this MEMS fabrication product to a complementary metal-oxide semiconductor (CMOS) electronics substrate. Significant progress was made on the via and mirror fabrication and design, the attach process development as well as the electronics high voltage (30 volt) and control designs. After approximately 22 months, the program was ready to proceed with fabrication and integration of the electronics, final mirror array, and through wafer vias to create a high resolution OMEMS array with individual mirror electronic control. At this point, however, mission alignment and budget constraints reduced the last year program funding and redirected the program to help support the through-silicon via work in the Hyper-Temporal Sensors (HTS) Grand Challenge (GC) LDRD. Several months of investigation and discussion with the HTS team resulted in a revised plan for the remaining 10 months of the program. We planned to build a capability in finer-pitched via fabrication on thinned substrates along with metallization schemes and bonding techniques for very large arrays of high density interconnects (up to 2000 x 2000 vias). Through this program, Sandia was able to build capability in several different conductive through wafer via processes using internal and external resources, MEMS mirror design and fabrication, various bonding techniques for arrayed substrates, and arrayed electronics control design with high voltage capability.

  9. Laser ablation assisted adhesive bonding of automotive structural composites

    SciTech Connect

    Boeman, R.G.; Paulauskas, F.L.; Warren, C.D.

    1999-07-03

    Laser ablation has been evaluated as a surface pretreatment prior to adhesive bonding. In prior experimental work, it was observed that when adhesively bonded, composite, single lap shear samples fail, the fracture often occurs at either the adhesive/adherend interface or in the resin rich surface layer of the composite. These two areas represent the weakest portion of the joint. Laser ablation pretreatment generates areas where the resin on the composite surface is selectively removed leaving behind exposed reinforcing fibers which are the major load bearing members of the composite. In a subsequent adhesive bonding operation, this allows portions of the fibers to be encapsulated in the adhesive while other portions of the fiber remain in the composite resin. This type of pretreatment permits fibers to bridge and reinforce the interface between adhesive and adherend. A secondary benefit is the removal of surface contaminantes by pyrolysis. Microscopic observation of laser ablated surfaces indicates a prominent, fiber rich area. Results of the mechanical evaluation indicated that the lap shear strength for laser ablated samples was significantly higher than specimens with no pretreatment or with solvent cleaning only, but were slightly lower than specimens that were mechanically roughened and cleaned with solvents prior to bonding.

  10. Adhesion between silica surfaces due to hydrogen bonding

    NASA Astrophysics Data System (ADS)

    Bowen, James; Rossetto, Hebert L.; Kendall, Kevin

    2016-09-01

    The adhesion between surfaces can be enhanced significantly by the presence of hydrogen bonding. Confined water at the nanoscale can display behaviour remarkably different to bulk water due to the formation of hydrogen bonds between two surfaces. In this work we investigate the role of confined water on the interaction between hydrophilic surfaces, specifically the effect of organic contaminants in the aqueous phase, by measuring the peak adhesive force and the work of adhesion. Atomic force microscope cantilevers presenting hemispherical silica tips were interacted with planar single crystals of silica in the presence of dimethylformamide, ethanol, and formamide; solution compositions in the range 0-100 mol% water were investigated for each molecule. Each molecule was chosen for its ability to hydrogen bond with water molecules, with increasing concentrations likely to disrupt the structure of surface-bound water layers. With the exception of aqueous solutions containing low concentrations of ethanol, all molecules decreased the ability of confined water to enhance the adhesion between the silica surfaces in excess of the predicted theoretical adhesion due to van der Waals forces. The conclusion was that adhesion depends strongly on the formation of a hydrogen-bonding network within the water layers confined between the silica surfaces.

  11. Model-based adhesive shrinkage compensation for increased bonding repeatability

    NASA Astrophysics Data System (ADS)

    Müller, Tobias; Schlette, Christian; Lakshmanan, Shunmuganathan; Haag, Sebastian; Zontar, Daniel; Sauer, Sebastian; Wenzel, Christian; Brecher, Christian; Roβmann, Jürgen

    2016-03-01

    The assembly process of optical components consists of two phases - the alignment and the bonding phase. Precision - or better process repeatability - is limited by the latter one. The limitation of the alignment precision is given by the measurement equipment and the manipulation technology applied. Today's micromanipulators in combination with beam imaging setups allow for an alignment in the range of far below 100nm. However, once precisely aligned optics need to be fixed in their position. State o f the art in optics bonding for laser systems is adhesive bonding with UV-curing adhesives. Adhesive bonding is a multi-factorial process and thus subject to statistical process deviations. As a matter of fact, UV-curing adhesives inherit shrinkage effects during their curing process, making offsets for shrinkage compensation mandatory. Enhancing the process control of the adhesive bonding process is the major goal of the activities described in this paper. To improve the precision of shrinkage compensation a dynamic shrinkage prediction is envisioned by Fraunhofer IPT. Intense research activities are being practiced to gather a deeper understanding of the parameters influencing adhesive shrinkage behavior. These effects are of different nature - obviously being the raw adhesive material itself as well as its condition, the bonding geometry, environmental parameters like surrounding temperature and of course process parameters such as curing properties. Understanding the major parameters and linking them in a model-based shrinkage-prediction environment is the basis for improved process control. Results are being deployed by Fraunhofer in prototyping, as well as volume production solutions for laser systems.

  12. Gap measurement and bond strength of five selected adhesive systems bonded to tooth structure.

    PubMed

    Arbabzadeh, F; Gage, J P; Young, W G; Shahabi, S; Swenson, S M

    1998-06-01

    The ability of a restorative material to bond and seal the interface with tooth structure is perhaps the most significant factor in determining resistance to marginal caries. Thus, the quality and durability of marginal seal and bond strength are major considerations in the selection of restorative materials. The purpose of this study was to compare the bond strength and marginal discrepancies of five adhesive systems: All-Bond 2, Clearfil Liner Bond, KB 200, ProBond and AELITE Bond. Twenty-five buccal and 25 lingual cavities were prepared in 25 caries-free extracted molar teeth, giving 10 cavities for each of the 5 adhesive systems. All teeth were restored with the resin composite Pertac Hybrid, or PRISMA Total Performance Hybrid with their appropriate adhesive systems. After restoration, the teeth were thermocycled, were stained with a 1.5% aqueous solution of a procion dye (reactive orange 14) and sectioned coronally with a saw microtome. Three sections of 200 microns thickness were prepared from each restoration which were then examined microscopically to measure marginal gap widths using a confocal tandem microscope. Shear bond strength measurements were carried out on the dentine bond using a universal testing machine. The All-Bond 2 adhesive system was found to have higher shear bond strength and to have the least gap width at the cementodentinal margin.

  13. Comprehensive investigation of sequential plasma activated Si/Si bonded interfaces for nano-integration on the wafer scale.

    PubMed

    Kibria, M G; Zhang, F; Lee, T H; Kim, M J; Howlader, M M R

    2010-04-02

    The sequentially plasma activated bonding of silicon wafers has been investigated to facilitate the development of chemical free, room temperature and spontaneous bonding required for nanostructure integration on the wafer scale. The contact angle of the surface and the electrical and nanostructural behavior of the interface have been studied. The contact angle measurements show that the sequentially plasma (reactive ion etching plasma followed by microwave radicals) treated surfaces offer highly reactive and hydrophilic surfaces. These highly reactive surfaces allow spontaneous integration at the nanometer scale without any chemicals, external pressure or heating. Electrical characteristics show that the current transportation across the nanobonded interface is dependent on the plasma parameters. High resolution transmission electron microscopy results confirm nanometer scale bonding which is needed for the integration of nanostructures. The findings can be applied in spontaneous integration of nanostructures such as nanowires/nanotubes/quantum dots on the wafer scale.

  14. Computed tomography analysis of wood-adhesive bonds

    NASA Astrophysics Data System (ADS)

    Modzel, Gunter Georg Rolf

    The importance of wood bonding increased in the last decades due to the increased usage of wood composites whose performance depends to a large extent on the adhesive penetration and subsequent bonding of the adherends. The presented research used XMT (x-ray microtomography) to perform a non-destructive, three-dimensional analysis of the adhesive bondline and wood-structure of Southern yellow pine, Douglas-fir and yellow-poplar samples. A phenol-formaldehyde adhesive was used. The sodium hydroxide catalyst was replaced with rubidium hydroxide during resin formulation. This was done to improve the image contrast. The reconstructions of the wood structure of Southern yellow pine showed tracheids, rays, fusiform rays, resin canals and pits. On the Douglas-fir sample tracheids, pits and rays were displayed clearly. The yellow-poplar images showed vessels, fibers, bordered pits, scalariform sieve plates and rays. The renderings of the adhesive-bondline of Southern yellow pine proved the dominant role of tracheids for the adhesive flow and showed rays as a secondary pathway of adhesive flow. The results revealed no adhesive flow occured through bordered pits, while simple pits permitted some adhesive flow through ray parenchyma. The results for Douglas-fir showed a similar result; the tracheids were the predominant path of adhesive penetration, while rays played a secondary role and no adhesive flow through the pit aperture was visible. The adhesive flow through the microstructure of yellow-poplar wood occured mainly through vessels and also through rays, but no adhesive flow through the pits was directly observed. The segmentation of the images in three phases: void space, cell wall substance and adhesive, enabled the calculation of the effective bondline thickness based on the adhesive, as well as the volumetric measurement of all three elements and their share on the sample volume. Subsequent experiments showed that the exposure of the Southern yellow pine and yellow

  15. Thermoplastic polymeric adhesive for structural bonding applications for orthopaedic devices

    SciTech Connect

    Devanathan, D.; King, R.; Swarts, D.; Lin, S.; Ramani, K.; Tagle, J.

    1994-12-31

    The orthopaedics industry has witnessed tremendous growth in recent years primarily due to the introduction of high performance, porous coated implants. These devices have eliminated the need for the use of bone cement for in vivo implant fixation, replacing it with the ingrowth of bone into the porous surfaces. The metallurgical bonding processes used for attaching the porous to the implant body introduce some undesirable effect i.e., the reduction of the fatigue strength of the implant due to the ``notches`` created and also due to the high temperature exposure during the sintering operations. This paper describes the development of a thermoplastic polymeric adhesive based structural bonding technique. The high performance polymeric adhesive is fully characterized with respect to its intended application. The design of the porous layer is optimized to achieve a reliable bond to the implant. A thermal heating/cooling process was developed to control the final polymer morphology. Static and fatigue tests were conducted to fully characterize the adhesive bond strength. A ring shear test method was developed to determine the shear strength of the bond interface. Besides the characterization of the adhesive bond, the joints will be analyzed using finite element models. The correlation between the analytical models and the

  16. Cure Monitoring Techniques for Adhesive Bonding Techniques.

    DTIC Science & Technology

    1980-11-01

    Dissipation Factor 21 Derived From Audrey and Phasemeter Data for PH-73 Ad- hesive. Filled symbols represent positive values of tanq .; hollow symbols...bonded joint. Since the absorption of water is a slow diffusion controlled process, it was decided to test the idea by iomursing a siulated bondline in... water . A series of probed bonds (probe 1/4" x 2ŕ) were fabricated between aluminum adherends with a layer of FE? film adjacent to each adherend. This

  17. Chemical role of oxygen plasma in wafer bonding using borosilicate glasses

    NASA Astrophysics Data System (ADS)

    Hansen, D. M.; Albaugh, C. E.; Moran, P. D.; Kuech, T. F.

    2001-11-01

    Plasma-treated oxide layers are commonly used in wafer bonding applications. Borosilicate glass (BSG) layers deposited by low-pressure chemical vapor deposition treated with an O2 plasma in reactive ion etching mode for 5 min at 0.6 W/cm2 and rinsed with DI H2O readily bond to GaAs and Si. The chemical role of this prebonding treatment was investigated using attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy. The peak intensities for both the Si-O and B-O absorbance bands decreased in intensity as a result of the plasma treatment is consistent with the uniform sputtering of 9.8 nm±0.8 nm of BSG. Polarization dependent ATR-FTIR revealed that the H2O/OH absorbance bands decreased in peak intensity with the OH groups being preferentially oriented perpendicular to the sample surface after the plasma treatment. The subsequent DI H2O rinse restores the water to the surface while removing B2O3 from the BSG layer. This prebonding treatment, therefore, results in a hydrophilic bond, but alters the composition of the BSG film at the bonded interface.

  18. Development of a Nonchromate Structural Adhesive Bond Primer

    DTIC Science & Technology

    2014-11-01

    Prevent corrosion of base metal • Applied to porous anodized surface • Overcoated with non-inhibited epoxy adhesive • High adhesive bond strength...primers •Long-running surveillance of chromate-free alternatives by UTC companies shows weak corrosion inhibition • (A) strontium chromate...solubility of multiple inhibitors 7705 Al / EcoTuff™ After corrosion test Bright deposits: 50 wt% W + Zn mixed oxide 3M Commercial EW5000AS(P) 3M Lab

  19. Laser Surface Preparation for Adhesive Bonding of Aerospace Structural Composites

    NASA Technical Reports Server (NTRS)

    Belcher, M. A.; Wohl, C. J.; Hopkins, J. W.; Connell, J. W.

    2010-01-01

    Adhesive bonds are critical to the integrity of built-up structures. Disbonds can often be detected but the strength of adhesion between surfaces in contact is not obtainable without destructive testing. Typically the number one problem in a bonded structure is surface contamination, and by extension, surface preparation. Standard surface preparation techniques, including grit blasting, manual abrasion, and peel ply, are not ideal because of variations in their application. Etching of carbon fiber reinforced plastic (CFRP) panels using a neodymium-doped yttrium aluminum garnet (Nd:YAG) laser appears to be a highly precise and promising way to both clean a composite surface prior to bonding and provide a bond-promoting patterned surface akin to peel ply without the inherent drawbacks from the same (i.e., debris and curvature). CFRP surfaces prepared using laser patterns conducive to adhesive bonding were compared to typical pre-bonding surface treatments through optical microscopy, contact angle goniometry, and post-bonding mechanical testing.

  20. Fatigue Behavior of Adhesively Bonded Joints. Volume I.

    DTIC Science & Technology

    1980-04-01

    electron spectroscopy (AES) and/or XPS scans. The adhesive used is FM-73M, a 2500F-cure tape from American Cyanamid of Havre de Grace, MD. This...34PABST Technical Bulletin No. 1", March 28, 1975. 14. FM 73 Adhesive Film, Data Bulletin BPT 20B, Cyanamid Bloom- ingdale Aerospace Products, Havre de...Joints," J. Appl. Mech. 11, 1944 , A17-A27. 29. Hart-Smith, L. C., Adhesive-Bonded Single-Lap Joints, NASA, CR-11236, January 1973. 30. Quarterly Progress

  1. Proanthocyanidins Alter Adhesive/Dentin Bonding Strengths when Included in a Bonding System

    PubMed Central

    Hechler, Benjamin; Yao, Xiaomei; Wang, Yong

    2014-01-01

    Purpose To determine the effect of proanthocyanidins (PA) incorporation into a bonding system on dentin/adhesive bond stability following long-term storage in buffer and collagenase. Methods Human dentin surfaces were bonded with no PA (0-PA), PA incorporated in the primer (PA-primer), or PA incorporated in the adhesive (PA-adhesive), and composite build-ups were created. Following sectioning into beams, bonded specimens were stored in buffer or collagenase for 0, 1, 4, 26, or 52 weeks before being tested for microtensile bond strength (μTBS). ANOVA and Tukey’s HSD post-hoc were performed. Fractured surfaces were viewed with scanning electron microscopy (SEM). Results Both bonding system and storage time but not storage medium significantly affected μTBS. Initially, 0-PA and PA-primer were superior to PA-adhesive, and after 1 week both PA groups were inferior to 0-PA. However, after 4 weeks PA-adhesive had significantly increased and 0-PA significantly decreased such that all three groups were equal. Thereafter, both PA-primer/adhesive groups trended with an increase (the 0-PA group remaing consistent) such that at 52 weeks PA-primer samples were significantly stronger (p < 0.001) or nearly so (p = 0.08) when compared to 0-PA samples. SEM revealed that initial fractures tended to occur at the middle/bottom of the hybrid layer for 0-PA and PA-primer groups but at the top of the hybrid layer/in the adhesive for PA-adhesive. After 4 weeks, however, all groups fractured similarly at the middle/bottom of the hybrid layer. Clinical Significance PA incorporation into a bonding system significantly alters interfacial bonding strengths, and its incorporation may stabilize the interface and protect degradation over time under clinical conditions. PMID:23243975

  2. Adhesive Bonding Characterization of Composite Joints for Cryogenic Usage

    NASA Technical Reports Server (NTRS)

    Graf, Neil A.; Schieleit, Gregory F.; Biggs, Robert

    2000-01-01

    The development of polymer composite cryogenic tanks is a critical step in creating the next generation of launch vehicles. Future reusable launch vehicles need to minimize the gross liftoff weight (GLOW). This weight reduction is possible due to the large reduction in weight that composite materials can provide over current aluminum technology. In addition to composite technology, adhesively bonded joints potentially have several benefits over mechanically fastened joints, such as weight savings and cryogenic fluid containment. Adhesively bonded joints may be used in several areas of these cryogenic tanks, such as in lobe-to-lobe joints (in a multi-lobe concept), skirt-to-tank joint, strut-to-tank joint, and for attaching stringers and ring frames. The bonds, and the tanks themselves, must be able to withstand liquid cryogenic fuel temperatures that they contain. However, the use of adhesively bonded composite joints at liquid oxygen and hydrogen temperatures is largely unknown and must be characterized. Lockheed Martin Space Systems Company, Michoud Operations performed coupon-level tests to determine effects of material selection, cure process parameters, substrate surface preparation, and other factors on the strength of these composite joints at cryogenic temperatures. This led to the selection of a material and process that would be suitable for a cryogenic tank. KEY WORDS: Composites, Adhesive Bonding, Cryogenics

  3. Two-dimensional X-ray waveguides: fabrication by wafer-bonding process and characterization

    NASA Astrophysics Data System (ADS)

    Kohlstedt, A.; Kalbfleisch, S.; Salditt, T.; Reiche, M.; Gösele, U.; Lima, E.; Willmott, P.

    2008-04-01

    The fabrication of two-dimensionally confining X-ray waveguides enables the generation of nanoscopic X-ray beams. First applications of such waveguides for lens-less holographic imaging have already been demonstrated, but were limited by the fabrication methods and the design. To overcome these limitations, we present here the fabrication process for a second generation of X-ray waveguide with air or vacuum as guiding channel, based on e-beam lithography, ion etching and subsequent wafer bonding. This is a first step towards waveguides fulfilling requirements of high transmission and high confinement, since the process can be scaled down to smaller channel dimensions from the present structures. We address the structuring method used and present results of first X-ray characterization at synchrotron beamlines, under two entirely different beam settings, corresponding to the coupling of a coherent beam and an incoherent beam.

  4. Develop, demonstrate, and verify large area composite structural bonding with polyimide adhesives. [adhesively bonding graphite-polyimide structures

    NASA Technical Reports Server (NTRS)

    Bhombal, B. D.; Wykes, D. H.; Hong, K. C.; Stenersen, A. A.

    1982-01-01

    The technology required to produce graphite-polyimide structural components with operational capability at 598 K (600 F) is considered. A series of polyimide adhesives was screened for mechanical and physical properties and processibility in fabricating large midplane bonded panels and honeycomb sandwich panels in an effort to fabricate a structural test component of the space shuttle aft body flap. From 41 formulations, LaRC-13, FM34B-18, and a modified LaRC-13 adhesive were selected for further evaluation. The LaRC-13 adhesive was rated as the best of the three adhesives in terms of availability, cost, processibility, properties, and ability to produce void fee large area (12" x 12") midplane bonds. Surface treatments and primers for the adhesives were evaluated and processes were developed for the fabrication of honeycomb sandwich panels of very good quality which was evidenced by rupture in the honeycomb core rather than in the facesheet bands on flatwise tensile strength testing. The fabrication of the adhesively bonded honeycomb sandwich cover panels, ribs, and leading edge covers of Celion graphite/LARC-160 polyimide laminates is described.

  5. Fabrication of high quality, thin Ge-on-insulator layers by direct wafer-bonding for nanostructured thermoelectric devices

    NASA Astrophysics Data System (ADS)

    Veerappan, Manimuthu; Mukannan, Arivanandhan; Salleh, Faiz; Shimura, Yosuke; Hayakawa, Yasuhiro; Ikeda, Hiroya

    2017-03-01

    A simple means of fabricating thin Ge-on-insulator (GOI) layers with a strong bond at the Ge/SiO2 interface through direct wafer-bonding is described. In this work, high quality Ge/SiO2 bonding was achieved under ambient air and at room temperature as a result of the extremely hydrophilic bonding surfaces obtained by chemical treatment prior to direct bonding. Based on the results of this work, the first-ever bonding mechanism between ammonium hydroxide treated Ge and SiO2/Si wafer surfaces is proposed. In addition, strain generated during post-annealing as a consequence of the significant thermal-expansion mismatch between Ge and SiO2 was gradually relieved by applying a multistep-cooling process. Structural characteristics of the thin GOI layer were analyzed by cross-sectional scanning electron microscopy, Raman spectroscopy, x-ray diffraction and transmission electron microscopy. It was determined that direct wafer-bonding followed by polishing could produce a GOI layer as thin as 156 nm, with sub-nm surface roughness.

  6. In-Situ Adhesive Bond Assessment

    DTIC Science & Technology

    2010-08-01

    2008, Irvine , CA, August 27-29, 2008. [7] Srivastava, A. and Lanza di Scalea, F., "Quantitative Detection of Bond Defects in Composite Aircraft...Zagrai, S. Buckley, J. Ganley, and J. S. Welsh , "Structural Health Monitoring: An Enabler for Responsive Satellites," Proc. SPIE Smart Structures/NDE 6935...Arritt, L. M. Robertson, A. D. Williams, B. K. Henderson, S. Buckley, J. Ganley, J. S. Welsh , L. Ouyang, S. Beard, E. Clayton, M. D. Todd, D. Doyle, and

  7. Durability of Structural Adhesively Bonded System.

    DTIC Science & Technology

    1981-06-01

    boundary zone at a time interval of At = 60 minutes (i.e. non-linear with strain rate effect solution). Fig. 8.1 Sequence of environmental history cycle...8.2 Sequence of environmental history cycle Nos. 11 and Il, for investigation of hygrothermal behavior of CFRP and adhesiv specimens, representing the... environmental history on the ’eformational behavior of an FRP adherend as part of a bonded structured more information is needed on the HEC and CTE

  8. Shear bond strength of brackets bonded to amalgam with different intermediate resins and adhesives.

    PubMed

    Germec, Derya; Cakan, Umut; Ozdemir, Fulya Isik; Arun, Tulin; Cakan, Murat

    2009-04-01

    The aims of this study were to compare, in vitro, the shear bond strength (SBS) of stainless steel orthodontic brackets bonded to silver amalgam with the use of three different intermediate resins and two different adhesives, and to evaluate bond failure mode. Forty-five amalgam specimens were divided into three equal groups. In groups 1 and 2, the brackets were bonded with Unite (3M Unitek) using Reliance Metal Primer (RMP; Reliance Orthodontic Products) and Power Bond OLC (PB OLC; Ortho Organizers Inc.) as intermediate resins, respectively. In group 3, Resinomer and One-Step Plus (OS+; Bisco Inc.) were used. Thirty bovine teeth served as the controls to test bracket bonding to acid-etched enamel with Unite and Resinomer-OS+. After thermocycling from 10 to 50 degrees C 1000 times, all samples were tested for SBS. Bond failure sites were classified using a modified adhesive remnant index (ARI) system. Data were analyzed with one-way analysis of variance, post hoc Tukey multiple comparison and chi-square tests. The results showed that the mean SBS to amalgam surfaces were significantly lower than those to etched bovine enamel (P<0.001). There were no statistically significant differences in mean SBS between the amalgam bonding groups (P>0.05). For the ARI, significant differences were found between the amalgam- and enamel-bonding groups (P<0.001). The mean SBS of stainless steel orthodontic brackets bonded to amalgam surfaces with RMP, PB OLC, OS+ intermediate resins and Unite and Resinomer adhesives was significantly lower than to etched bovine enamel. Bond failure occurred at the amalgam-adhesive interface regardless of the adhesive system and without damage to the amalgam restoration.

  9. Treatment of AM 355 Steel for Adhesive Bonding.

    DTIC Science & Technology

    1979-07-01

    Surface treatments for AM355 prior to adhesive bonding have been developed. A sulfuric acid-dichromate immersion treatment and nitric acid...chromium content of the surface oxide layer produced using these and other treatments. Experiments indicate that AM355 is essentially impermeable to

  10. Fatigue Behavior of Adhesively Bonded Joints. Volume II. Appendices.

    DTIC Science & Technology

    1980-04-01

    StressoAnayiFnt lmns tic, andc argh th eeemntinar violastrick3 - modelO foAGoES ne 1D 4. MONTOIN A EDITC O *AWL’ NO ADPO~IfSiftfl OBSOLETE lla Offce 1...and Ultra- sonic Holography", Vol. I, Nondestructive Inspection and Control, Eighth Edition, 1976, pp . 198-233. "Fatigue Behavior of Adhesively Bonded

  11. A comparison of shear bond strength of orthodontic brackets bonded with four different orthodontic adhesives

    PubMed Central

    Sharma, Sudhir; Tandon, Pradeep; Nagar, Amit; Singh, Gyan P; Singh, Alka; Chugh, Vinay K

    2014-01-01

    Objectives: The objective of this study is to compare the shear bond strength (SBS) of stainless steel (SS) orthodontic brackets bonded with four different orthodontic adhesives. Materials and Methods: Eighty newly extracted premolars were bonded to 0.022 SS brackets (Ormco, Scafati, Italy) and equally divided into four groups based on adhesive used: (1) Rely-a-Bond (self-cure adhesive, Reliance Orthodontic Product, Inc., Illinois, USA), (2) Transbond XT (light-cure adhesive, 3M Unitek, CA, USA), (3) Transbond Plus (sixth generation self-etch primer, 3M Unitek, CA, USA) with Transbond XT (4) Xeno V (seventh generation self-etch primer, Dentsply, Konstanz, Germany) with Xeno Ortho (light-cure adhesive, Dentsply, Konstanz, Germany) adhesive. Brackets were debonded with a universal testing machine (Model No. 3382 Instron Corp., Canton, Mass, USA). The adhesive remnant index (ARI) was recordedIn addition, the conditioned enamel surfaces were observed under a scanning electron microscope (SEM). Results: Transbond XT (15.49 MPa) attained the highest bond strength. Self-etching adhesives (Xeno V, 13.51 MPa; Transbond Plus, 11.57 MPa) showed clinically acceptable SBS values and almost clean enamel surface after debonding. The analysis of variance (F = 11.85, P < 0.0001) and Chi-square (χ2 = 18.16, P < 0.05) tests revealed significant differences among groups. The ARI score of 3 (i.e., All adhesives left on the tooth) to be the most prevalent in Transbond XT (40%), followed by Rely-a-Bond (30%), Transbond Plus with Transbond XT (15%), and Xeno V with Xeno Ortho (10%). Under SEM, enamel surfaces after debonding of the brackets appeared porous when an acid-etching process was performed on the surfaces of Rely-a-Bond and Transbond XT, whereas with self-etching primers enamel presented smooth and almost clean surfaces (Transbond Plus and Xeno V group). Conclusion: All adhesives yielded SBS values higher than the recommended bond strength (5.9-7–8 MPa), Seventh generation

  12. Failure strength prediction for adhesively bonded single lap joints

    NASA Astrophysics Data System (ADS)

    Rahman, Niat Mahmud

    For adhesively bonded joint, failure strength depends on many factors such as material properties (both adhesive and adherend), specimen geometries, test environments, surface preparation procedures, etc. Failure occurs inside constitutive materials or along joint interfaces. Based on location, adhesively bonded failure mode can be classified as adhesive failure mode, cohesive failure mode and adherend failure mode. Failure mode directly affects the failure strength of joint. For last eight decades, researchers have developed analytical, empirical or semi-empirical methods capable of predicting failure strength for adhesively bonded joints generating either cohesive failure or adherend failure. Applicability of most of the methods is limited to particular cases. In this research, different failure modes for single lap joints (SLJs) were generated experimentally using epoxy based paste adhesive. Based on experimental data and analytical study, simplified failure prediction methods were developed for each failure mode. For adhesive failure mode, it is observed that peel stress distributions concur along interface near crack initiation points. All SLJs for this test endured consistent surface treatments. Geometric parameters of the joints were varied to study their effect on failure strength. Peel stress distributions were calculated using finite analysis (FEA). Based on peel stress distribution near crack initiation point, a failure model is proposed. Numerous analytical, empirical and semi-empirical models are available for predicting failure strengths of SLJs generating cohesive failures. However, most of the methods in the literature failed to capture failure behavior of SLJs having thickness of adhesive layer as variable. Cohesive failure mode was generated experimentally using aluminum as adherend and epoxy adhesive considering thickness of adhesive layers as variable within SLJs. Comparative study was performed among various methods. It was observed that

  13. Plate-like structure health monitoring based on ultrasonic guided wave technology by using bonded piezoelectric ceramic wafers

    NASA Astrophysics Data System (ADS)

    Liu, Zenghua; Zhao, Jichen; He, Cunfu; Wu, Bin

    2008-11-01

    Piezoelectric ceramic wafers are applied for the excitation and detection of ultrasonic guided waves to determine the health state of plate-like structures. Two PZT wafers, whose diameter is 11mm and thickness is 0.4mm respectively, are bonded permanently on the surface of a 1mm thick aluminum plate. One of these wafers is actuated by sinusoidal tone burst at various frequencies ranging from 100kHz to 500kHz, the other one is used as a receiver for acquiring ultrasonic guided wave signals. According to the amplitudes and shapes of these received signals, guided wave modes and their proper frequency range by using these wafers are determined. For the improvement of the signal-to-noise ratio, the Daubechies wavelet of order 40 is used for signal denoising as the mother wavelet. Furthermore, the detection of an artificial cylindrical through-hole defect is achieved by using S0 at 300kHz. Experimental results show that it is feasible and effective to detect defects in plate-like structures based on ultrasonic guided wave technology by using bonded piezoelectric ceramic wafers.

  14. Investigation of adhesive bond cure conditions using nonlinear ultrasonic methods

    NASA Astrophysics Data System (ADS)

    Berndt, Tobias Paul

    2000-09-01

    Various linear and nonlinear ultrasonic methods with water coupling have been used to study aluminum-adhesive- aluminum laminates, prepared under different adhesive curing conditions, for possible nondestructive bond strength determination. Although our improperly cured adhesive bonds are expected to exhibit a reduced adhesion strength, ultrasonic characterization of all samples using small-amplitude techniques did not reveal differences between the various samples. The ill-cured bonds appear to differ from the well-cured ones only in their acoustic velocities in the adhesive. Thus, the ill-cured adhesives exhibit longitudinal and shear wave velocities that are several percent higher than in the normal-cured adhesives. Therefore, in the course of a larger research effort, we have investigated a variety of finite-amplitude experimental methods for the acquisition of data that would possibly allow to differentiate the various cure conditions as well as the degree of adhesion. For example, we have explored numerous normal and oblique incidence approaches, that are based on nonlinear harmonic generation, and we have explored several non- collinear two-wave interaction approaches. In this dissertation, we report on theoretical aspects and experimental results obtained so far using different normal incidence setups. First, we discuss an approach in which the sample is mechanically scanned in various ways with respect to the focus of a transmitting transducer that is operated at one frequency and one excitation level. Subsequently, we discuss several variable excitation frequency and variable excitation level setups. Due to a combination of complicating factors, even if powerful sample-related resonances via a frequency scanning approach are exploited, it is extremely difficult to isolate the nonlinear characteristics of an adhesive bond. However, a multi-frequency multi-power approach has been quite successful in acquiring nonlinear ultrasonic data that appears to be

  15. Durability of bonds and clinical success of adhesive restorations

    PubMed Central

    Carvalho, Ricardo M.; Manso, Adriana P.; Geraldeli, Saulo; Tay, Franklin R.; Pashley, David H.

    2013-01-01

    Resin-dentin bond strength durability testing has been extensively used to evaluate the effectiveness of adhesive systems and the applicability of new strategies to improve that property. Clinical effectiveness is determined by the survival rates of restorations placed in non-carious cervical lesions (NCCL). While there is evidence that the bond strength data generated in laboratory studies somehow correlates with the clinical outcome of NCCL restorations, it is questionable whether the knowledge of bonding mechanisms obtained from laboratory testing can be used to justify clinical performance of resin-dentin bonds. There are significant morphological and structural differences between the bonding substrate used in in vitro testing versus the substrate encountered in NCCL. These differences qualify NCCL as a hostile substrate for bonding, yielding bond strengths that are usually lower than those obtained in normal dentin. However, clinical survival time of NCCL restorations often surpass the durability of normal dentin tested in the laboratory. Likewise, clinical reports on the long-term survival rates of posterior composite restorations defy the relatively rapid rate of degradation of adhesive interfaces reported in laboratory studies. This article critically analyzes how the effectiveness of adhesive systems is currently measured, to identify gaps in knowledge where new research could be encouraged. The morphological and chemical analysis of bonded interfaces of resin composite restorations in teeth that had been in clinical service for many years, but were extracted for periodontal reasons, could be a useful tool to observe the ultrastructural characteristics of restorations that are regarded as clinically acceptable. This could help determine how much degradation is acceptable for clinical success. PMID:22192252

  16. Temperature Effects on Adhesive Bond Strengths and Modulus for Commonly Used Spacecraft Structural Adhesives

    NASA Technical Reports Server (NTRS)

    Ojeda, Cassandra E.; Oakes, Eric J.; Hill, Jennifer R.; Aldi, Dominic; Forsberg, Gustaf A.

    2011-01-01

    A study was performed to observe how changes in temperature and substrate material affected the strength and modulus of an adhesive bondline. Seven different adhesives commonly used in aerospace bonded structures were tested. Aluminum, titanium and Invar adherends were cleaned and primed, then bonded using the manufacturer's recommendations. Following surface preparation, the coupons were bonded with the adhesives. The single lap shear coupons were then pull tested per ASTM D 1002 Standard Test Method for Apparent Shear Strength of Single- Lap-Joint over a temperature range from -150 deg C up to +150 deg C. The ultimate strength was calculated and the resulting data were converted into B-basis design allowables. Average and Bbasis results were compared. Results obtained using aluminum adherends are reported. The effects of using different adherend materials and temperature were also studied and will be reported in a subsequent paper. Dynamic Mechanical Analysis (DMA) was used to study variations in adhesive modulus with temperature. This work resulted in a highly useful database for comparing adhesive performance over a wide range of temperatures, and has facilitated selection of the appropriate adhesive for spacecraft structure applications.

  17. Wafer Bonding and Epitaxial Transfer of GaSb-based Epitaxy to GaAs for Monolithic Interconnection of Thermophotovoltaic Devices

    SciTech Connect

    C.A. Wang; D.A. Shiau; P.G. Murphy; P.W. O'brien; R.K. Huang; M.K. Connors; A.C. Anderson; D. Donetsky; S. Anikeev; G. Belenky; D.M. Depoy; G. Nichols

    2003-06-16

    GaInAsSb/AlGaAsSb/InAsSb/GaSb epitaxial layers were bonded to semi-insulating GaAs handle wafers with SiO{sub x}/Ti/Au as the adhesion layer for monolithic interconnection of thermophotovoltaic (TPV) devices. Epitaxial transfer was completed by removal of the GaSb substrate, GaSb buffer, and InAsSb etch-stop layer by selective chemical etching. The SiO{sub x}/TiAu provides not only electrical isolation, but also high reflectivity and is used as an internal back-surface reflector. Characterization of wafer-bonded epitaxy by high-resolution x-ray diffraction and time-decay photoluminescence indicates minimal residual stress and enhancement in optical quality. 0.54-eV GaInAsSb cells were fabricated and monolithically interconnected in series. A 10-junction device exhibited linear voltage building with an open-circuit voltage of 1.8 V.

  18. Wafer-level packaging with compression-controlled seal ring bonding

    DOEpatents

    Farino, Anthony J

    2013-11-05

    A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a second surface of a second semiconductor wafer and surrounds a portion of the second wafer that contains the device. Forcible movement of the first and second wafer surfaces toward one another compresses the first and second seal rings against one another. A physical barrier against the movement, other than the first and second seal rings, is provided between the first and second wafer surfaces.

  19. A Wafer-Bonded, Floating Element Shear-Stress Sensor Using a Geometric Moire Optical Transduction Technique

    NASA Technical Reports Server (NTRS)

    Horowitz, Stephen; Chen, Tai-An; Chandrasekaran, Venkataraman; Tedjojuwono, Ken; Cattafesta, Louis; Nishida, Toshikazu; Sheplak, Mark

    2004-01-01

    This paper presents a geometric Moir optical-based floating-element shear stress sensor for wind tunnel turbulence measurements. The sensor was fabricated using an aligned wafer-bond/thin-back process producing optical gratings on the backside of a floating element and on the top surface of the support wafer. Measured results indicate a static sensitivity of 0.26 microns/Pa, a resonant frequency of 1.7 kHz, and a noise floor of 6.2 mPa/(square root)Hz.

  20. Influence of additional adhesive application on the microtensile bond strength of adhesive systems.

    PubMed

    de Silva, André Luís Faria; Lima, Débora Alves Nunes Leite; de Souza, Grace Mendonça Dias; dos Santos, Carlos Tadeu Dias; Paulillo, Luís Alexandre Maffei Sartini

    2006-01-01

    This study evaluated microtensile bond strength (pTBS) when an additional adhesive layer was applied to the dentin surface. Thirty-five human third molars were flattened to expose the occlusal dentin surface. The teeth were randomly assigned to 7 experimental groups: G1-Single Bond (SB); G2-additional layer of SB; G3--a layer of Scotchbond Multi-purpose (SMP) adhesive applied over SB; G4-Clearfil SE Bond (CE); G5-additional layer of CE; G6-Adper Prompt (AP) and G7-additional layer of AP. For the G2, G3, G5 and G7 groups, the first adhesive layer was light-cured before application of the additional layer. After bonding procedures, 5-mm high composite crowns were incrementally built up. The samples were sectioned to obtain 0.9 x 0.9 beams, which were tested under tension at a crosshead speed of 0.5-mm/minute until failure. The failure mode and adhesive thickness were evaluated under SEM. The pTBS data were analyzed by 1-way ANOVA and post-hoc Ducan's Test (a=0.05). Mean adhesive thickness was analyzed by 1-way ANOVA and post-hoc Tukey's test (a=0.05). The results indicated that G3 presented the highest microTBS and the thickest adhesive layer. G6 and G7 presented the lowest microTBS values. When solvent-free adhesives systems were used, microTBS values were not affected by the thicker layer.

  1. The effect of adhesive type and thickness on bond strength of orthodontic brackets.

    PubMed

    Mackay, F

    1992-02-01

    Fine-mesh based brackets were bonded to plastic cylinders using four different adhesives. Adhesive thickness was controlled using a bonding jig. The bond was then tested to failure using a shear force. Each adhesive had its own minimum thickness, probably related to its viscosity. Increasing the thickness of the adhesiveness to 0.26 mm, using a stainless steel spacer had minimal effect on their mean shear bond strength.

  2. Strategies for precision adhesive bonding of micro-optical systems

    NASA Astrophysics Data System (ADS)

    Müller, Tobias; Kotnur Venu, Vyshak; Haag, Sebastian; Zontar, Daniel; Sauer, Sebastian; Wenzel, Christian; Brecher, Christian

    2015-02-01

    Today's piezo-based micromanipulator technology allows for highly precise manipulation of optical components. A crucial question for the quality of optical assemblies is the misalignment after curing. The challenge of statistical deviations in the curing process requires a sophisticated knowledge on the relevant process parameters. An approach to meet these requirements is the empirical analysis such as characterization of shrinkage. Gaining sophisticated knowledge about the statistical process of adhesive bonding advances the quality of related production steps like beam-shaping optics, mounting of turning mirrors for fiber coupling or building resonators evaluating power, mode characteristics and beam shape. Maximizing the precision of these single assembly steps fosters the scope of improving the overall efficiency of the entire laser system. At Fraunhofer IPT research activities on the identification of relevant parameters for improved adhesive bonding precision have been undertaken and are ongoing. The influence of the volumetric repeatability of different automatic and manual dispensing methods play an important role. Also, the evaluation of UV-light sources and the relating illumination properties have a significant influence on the bonding result. Furthermore, common UV-curing adhesives are being examined on their performance and reliability for both highest precision prototyping, as well as their application as robust bonding medium in automated optics assembly cells. This paper sums up the parameters of most influence. Overall goal of these activities is the development of a prediction model for optimized shrinkage compensation and thus improved assembly quality.

  3. Curli mediate bacterial adhesion to fibronectin via tensile multiple bonds

    PubMed Central

    Oh, Yoo Jin; Hubauer-Brenner, Michael; Gruber, Hermann J.; Cui, Yidan; Traxler, Lukas; Siligan, Christine; Park, Sungsu; Hinterdorfer, Peter

    2016-01-01

    Many enteric bacteria including pathogenic Escherichia coli and Salmonella strains produce curli fibers that bind to host surfaces, leading to bacterial internalization into host cells. By using a nanomechanical force-sensing approach, we obtained real-time information about the distribution of molecular bonds involved in the adhesion of curliated bacteria to fibronectin. We found that curliated E. coli and fibronectin formed dense quantized and multiple specific bonds with high tensile strength, resulting in tight bacterial binding. Nanomechanical recognition measurements revealed that approximately 10 bonds were disrupted either sequentially or simultaneously under force load. Thus the curli formation of bacterial surfaces leads to multi-bond structural components of fibrous nature, which may explain the strong mechanical binding of curliated bacteria to host cells and unveil the functions of these proteins in bacterial internalization and invasion. PMID:27652888

  4. Curli mediate bacterial adhesion to fibronectin via tensile multiple bonds

    NASA Astrophysics Data System (ADS)

    Oh, Yoo Jin; Hubauer-Brenner, Michael; Gruber, Hermann J.; Cui, Yidan; Traxler, Lukas; Siligan, Christine; Park, Sungsu; Hinterdorfer, Peter

    2016-09-01

    Many enteric bacteria including pathogenic Escherichia coli and Salmonella strains produce curli fibers that bind to host surfaces, leading to bacterial internalization into host cells. By using a nanomechanical force-sensing approach, we obtained real-time information about the distribution of molecular bonds involved in the adhesion of curliated bacteria to fibronectin. We found that curliated E. coli and fibronectin formed dense quantized and multiple specific bonds with high tensile strength, resulting in tight bacterial binding. Nanomechanical recognition measurements revealed that approximately 10 bonds were disrupted either sequentially or simultaneously under force load. Thus the curli formation of bacterial surfaces leads to multi-bond structural components of fibrous nature, which may explain the strong mechanical binding of curliated bacteria to host cells and unveil the functions of these proteins in bacterial internalization and invasion.

  5. Adhesive bonding of noble metal alloys with a triazine dithiol derivative primer and an adhesive resin.

    PubMed

    Matsumura, H; Taira, Y; Atsuta, M

    1999-11-01

    The purpose of this study was to evaluate the bond strength and durability of a metal adhesive system bonded to noble metal alloys. Disc specimens were cast from type IV gold (type IV, Casting Gold M. C., metal-ceramic gold (Au-Pt-Pd, Degudent Universal, metal-ceramic palladium (Pd-Ga-Co, PTM 88 silver-indium (Ag-In-Zn, Salivan Hard and silver-palladium-copper-gold (Ag-Pd-Cu, S12) alloys and pure silver (pure Ag). The specimens were air-abraded with 50 micron alumina, conditioned with a thiol-based primer designed for noble alloys (V-Primer), and then bonded with an adhesive resin (Super-Bond Opaque Ivory). Shear bond strengths were determined after repeated thermocycling (4-60 degrees C, 1 min each, 100 000 cycles). The average bond strengths in MPa (n=8) were 30.9 for the type IV alloy, 29.0 for the Ag-Pd-Cu alloy, 28.0 for the Au-Pt-Pd alloy, 26.3 for the pure Ag, 26.0 for the Pd-Ga-Co alloy and 9.3 for the Ag-In-Zn alloy. The Ag-In-Zn alloy exhibited significantly lower bond strength than the other alloys, whereas the bond strengths of the other four alloys and pure Ag were comparable (P<0.05). It is concluded that the combined use of the thiol derivative primer and the adhesive resin is effective for bonding the noble metal alloys examined, with the exception of the Ag-In-Zn alloy.

  6. Adhesive bone bonding prospects for lithium disilicate ceramic implants

    NASA Astrophysics Data System (ADS)

    Vennila Thirugnanam, Sakthi Kumar

    Temporomandibular Joint (TMJ) implants articulating mandible with temporal bone in humans have a very high failure rate. Metallic TMJ implants available in the medical market are not osseointegrated, but bond only by mechanical interlocking using screws which may fail, mandating a second surgery for removal. Stress concentration around fixture screws leads to aseptic loosening or fracture of the bone. It has been proposed that this problem can be overcome by using an all-ceramic TMJ implant bonded to bone with dental adhesives. Structural ceramics are promising materials with an excellent track record in the field of dentis.

  7. Shear bond strength of new self-adhesive flowable composite resins.

    PubMed

    Wajdowicz, Michael N; Vandewalle, Kraig S; Means, Mark T

    2012-01-01

    Recently, new self-adhesive flowable composite resin systems have been introduced to the market. These new composite resin systems reportedly bond to dentin and enamel without the application of an adhesive bonding agent. The purpose of this study was to evaluate the shear bond strength to enamel of two new self-adhesive flowable composites with and without the use of an etch-and-rinse bonding agent. The new self-adhesive flowable composites had significantly lower bond strengths to enamel compared to a traditional adhesively bonded flowable composite. Both self-adhesive flowable composites had a significant increase in bond strength to enamel with the use of a phosphoric acid-etch and adhesive bonding agent.

  8. Adhesive Characterization and Progressive Damage Analysis of Bonded Composite Joints

    NASA Technical Reports Server (NTRS)

    Girolamo, Donato; Davila, Carlos G.; Leone, Frank A.; Lin, Shih-Yung

    2014-01-01

    The results of an experimental/numerical campaign aimed to develop progressive damage analysis (PDA) tools for predicting the strength of a composite bonded joint under tensile loads are presented. The PDA is based on continuum damage mechanics (CDM) to account for intralaminar damage, and cohesive laws to account for interlaminar and adhesive damage. The adhesive response is characterized using standard fracture specimens and digital image correlation (DIC). The displacement fields measured by DIC are used to calculate the J-integrals, from which the associated cohesive laws of the structural adhesive can be derived. A finite element model of a sandwich conventional splice joint (CSJ) under tensile loads was developed. The simulations indicate that the model is capable of predicting the interactions of damage modes that lead to the failure of the joint.

  9. 300 mm InGaAs-on-insulator substrates fabricated using direct wafer bonding and the Smart Cut™ technology

    NASA Astrophysics Data System (ADS)

    Widiez, Julie; Sollier, Sébastien; Baron, Thierry; Martin, Mickaël; Gaudin, Gweltaz; Mazen, Frédéric; Madeira, Florence; Favier, Sylvie; Salaun, Amélie; Alcotte, Reynald; Beche, Elodie; Grampeix, Helen; Veytizou, Christelle; Moulet, Jean-Sébastien

    2016-04-01

    This paper reports the first demonstration of 300 mm In0.53Ga0.47As-on-insulator (InGaAs-OI) substrates. The use of direct wafer bonding and the Smart Cut™ technology lead to the transfer of high quality InGaAs layer on large Si wafer size (300 mm) at low effective cost, taking into account the reclaim of the III-V on Si donor substrate. The optimization of the three key building blocks of this technology is detailed. (1) The III-V epitaxial growth on 300 mm Si wafers has been optimized to decrease the defect density. (2) For the first time, hydrogen-induced thermal splitting is made inside the indium phosphide (InP) epitaxial layer and a wide implantation condition ranges is observed on the contrary to bulk InP. (3) Finally a specific direct wafer bonding with alumina oxide has been chosen to avoid outgas diffusion at the alumina oxide/III-V compound interface.

  10. Regional bond strengths of adhesive resins to pulp chamber dentin.

    PubMed

    Belli, S; Zhang, Y; Pereira, P N; Ozer, F; Pashley, D H

    2001-08-01

    Microleakage of oral microorganisms, which can occur due to the lack of sealing ability of permanent restorative materials, may cause failure of root canal treatments. Although a great deal of research has been done on sealing enamel and coronal dentin with resins, little research has been done on the adhesion of resins to the walls of pulp chambers. The purpose of this study was to evaluate regional bond strengths of two adhesive systems to the walls of pulp chambers. A section was made horizontally through the middle of the pulp chamber of extracted human third molars to divide the chamber into upper and lower halves. The pulp tissue was removed and the tooth segments were then divided into treatment subgroups. The pulp chambers were bonded with C&B Metabond (Parkell) or One-Step (Bisco), with or without 5% NaOCI pretreatment. The microtensile bond strengths of these resins to four different pulp chamber regions (bottom, wall, roof, and pulp horn areas) were then measured using an Instron machine. The data were expressed in MPa and were analyzed by a three-way ANOVA. Statistically significant differences were found among the test groups (p < 0.001). One-Step produced higher bond strengths to all pulp chamber regions except the floor, compared with C&B Metabond. The results indicated that high bond strengths can be achieved between adhesive resins and the various regions of the pulp chamber. This should permit the use of a thick layer of unfilled resin along the floor of the pulp chamber and over the canal orifices as a secondary protective seal after finishing root canal therapy.

  11. Shear bond strength of ceramic and metallic orthodontic brackets bonded with self-etching primer and conventional bonding adhesives

    PubMed Central

    Arash, Valiollah; Naghipour, Fatemeh; Ravadgar, Mehdi; Karkhah, Ahmad; Barati, Mohammad Saleh

    2017-01-01

    Introduction Adult patients typically require high-quality orthodontic treatment for ceramic brackets, but some clinicians remain concerned about the bond strength of these brackets. Therefore, the aim of this study was to determine the shear bond strength and de-bonding characteristics of metallic and ceramic brackets bonded with two types of bonding agents. Methods In an experimental study done in 2013 in Babol, Iran, 120 extracted human maxillary premolar teeth were randomly divided into four groups as follows: HM group: metallic bracket/conventional bonding agent; SM group: metallic bracket/Transbond self-etching primer; HC group: ceramic bracket/conventional bonding agent; SC group: ceramic bracket/Transbond self-etching primer. Twenty-four hours after thermocycling (1000 cycle, 5 °C–55 °C), the shear bond strength values were measured. The amount of resin remaining on the tooth surface (adhesive remnant index: ARI) was determined under a stereomicroscope. Enamel detachment index was evaluated under a scanning electron microscope. To perform statistical analysis, ANOVA, Kruskal–Wallis, and Tukey post-hoc tests were applied. The level of significance was set at p <0.05. Results The mean shear bond strength values (MPa ± SD) were group HM=12.59, group SM=11.15, group HC=7.7, and group SC=7.41. Bond strength differences between groups HM and SM (p=0.063) and between HC and SC (p=0.091) were not statistically significant. There were significant differences between HM and HC and between SM and SC groups (p < 0.05). Insignificant differences were found in ARI among all groups. Conclusion Our findings indicated that the metallic brackets had higher bond strengths in comparison with ceramic brackets. In addition, self-etching primer was able to produce fewer bonds compared with the conventional technique. Many samples showed the bracket-adhesive interface failure or failure inside the adhesive. PMID:28243410

  12. Reliability of Adhesive Bonds Under Severe Environments. Report of the Committee on Reliability of Adhesive Bonds in Severe Environments

    DTIC Science & Technology

    1984-12-01

    all during the workshop. These include the effects of scrim on bond performance, flexible adhesives for textiles, and sensitivity to liquids other...humidity, seawater, and others, including fire and corrosive gases and liquids . EXTREME HIGH TEMPERATURES During the past decade, many high-temperature...arylenesiloxanylene (FASIL, by the Air Force Materials Laboratory), phosphonitrilic fluoroelastomer (PNF, by Firestone Rubber and Tire Company), and flexible polyimides

  13. Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting

    NASA Astrophysics Data System (ADS)

    Farisi, Muhammad Salman Al; Hirano, Hideki; Frömel, Jörg; Tanaka, Shuji

    2017-01-01

    In this paper, a novel wafer-level hermetic packaging technology for heterogeneous device integration is presented. Hermetic sealing is achieved by low-temperature thermo-compression bonding using electroplated Au micro-sealing frame planarized by single-point diamond fly-cutting. The proposed technology has significant advantages compared to other established processes in terms of integration of micro-structured wafer, vacuum encapsulation and electrical interconnection, which can be achieved at the same time. Furthermore, the technology is also achievable for a bonding frame width as narrow as 30 μm, giving it an advantage from a geometry perspective, and bonding temperatures as low as 300 °C, making it advantageous for temperature-sensitive devices. Outgassing in vacuum sealed cavities is studied and a cavity pressure below 500 Pa is achieved by introducing annealing steps prior to bonding. The pressure of the sealed cavity is measured by zero-balance method utilizing diaphragm-structured bonding test devices. The leak rate into the packages is determined by long-term sealed cavity pressure measurement for 1500 h to be less than 2.0× {{10}-14} Pa m3s-1. In addition, the bonding shear strength is also evaluated to be higher than 100 MPa.

  14. Geiger mode theoretical study of a wafer-bonded Ge on Si single-photon avalanche photodiode

    NASA Astrophysics Data System (ADS)

    Ke, Shaoying; Lin, Shaoming; Wei, Huang; Wang, Jianyuan; cheng, Buwen; Liang, Kun; Li, Cheng; Chen, Songyan

    2017-02-01

    The investigation of the single-photon properties of a wafer-bonded Ge/Si single-photon avalanche photodiode (SPAD) is theoretically conducted. We focus on the effect of the natural GeO2 layer (hydrophilic reaction) at the Ge/Si wafer-bonded interface on dark count characteristics and single-photon response. It is found that the wafer-bonded Ge/Si SPAD exhibits very low dark current at 250 K due to the absence of threading dislocation (TD) in the Ge layer. Owing to the increase of the unit-gain bias applied on the SPAD, the primary dark current (I DM) increases with the increase in GeO2 thickness. Furthermore, the dependence of the linear-mode gain and 3 dB bandwidth (BW) for the dark count on GeO2 thickness is also presented. It is observed that the dark count probability of the Ge/Si SPAD significantly increases with the increase in GeO2 thickness due to the increase of the I DM and the reduction of the 3 dB BW. It is also found that with the increase in GeO2 thickness, the external quantum efficiency, which affects the single-photon detection efficiency (SPDE), drastically decreases because of the blocking effect of the GeO2 layer and the serious recombination at the wafer-bonded Ge/Si interface. The afterpulsing probability (AP) shows an abnormal behavior with GeO2 thickness. This results from the decrease in avalanche charge and increase in effective transit time.

  15. Effect of thermal aging on the tensile bond strength at reduced areas of seven current adhesives.

    PubMed

    Baracco, Bruno; Fuentes, M Victoria; Garrido, Miguel A; González-López, Santiago; Ceballos, Laura

    2013-07-01

    The purpose of this study was to determine the micro-tensile bond strength (MTBS) to dentin of seven adhesive systems (total and self-etch adhesives) after 24 h and 5,000 thermocycles. Dentin surfaces of human third molars were exposed and bonded with two total-etch adhesives (Adper Scotchbond 1 XT and XP Bond), two two-step self-etch adhesives (Adper Scotchbond SE and Filtek Silorane Adhesive System) and three one-step self-etch adhesives (G-Bond, Xeno V and Bond Force). All adhesive systems were applied following manufacturers' instructions. Composite buildups were constructed and the bonded teeth were then stored in water (24 h, 37 °C) or thermocycled (5,000 cycles) before being sectioned and submitted to MTBS test. Two-way ANOVA and subsequent comparison tests were applied at α = 0.05. Characteristic de-bonded specimens were analyzed using scanning electron microscopy (SEM). After 24 h water storage, MTBS values were highest with XP Bond, Adper Scotchbond 1 XT, Filtek Silorane Adhesive System and Adper Scotchbond SE and lowest with the one-step self-etch adhesives Bond Force, Xeno V and G-Bond. After thermocycling, MTBS values were highest with XP Bond, followed by Filtek Silorane Adhesive System, Adper Scotchbond SE and Adper Scotchbond 1 XT and lowest with the one-step self-etch adhesives Bond Force, Xeno V and G-Bond. Thermal aging induced a significant decrease in MTBS values with all adhesives tested. The resistance of resin-dentin bonds to thermal-aging degradation was material dependent. One-step self-etch adhesives obtained the lowest MTBS results after both aging treatments, and their adhesive capacity was significantly reduced after thermocycling.

  16. Adhesive-bonded scarf and stepped-lap joints

    NASA Technical Reports Server (NTRS)

    Hart-Smith, L. J.

    1973-01-01

    Continuum mechanics solutions are derived for the static load-carrying capacity of scarf and stepped-lap adhesive-bonded joints. The analyses account for adhesive plasticity and adherend stiffness imbalance and thermal mismatch. The scarf joint solutions include a simple algebraic formula which serves as a close lower bound, within a small fraction of a per cent of the true answer for most practical geometries and materials. Digital computer programs were developed and, for the stepped-lap joints, the critical adherend and adhesive stresses are computed for each step. The scarf joint solutions exhibit grossly different behavior from that for double-lap joints for long overlaps inasmuch as that the potential bond shear strength continues to increase with indefinitely long overlaps on the scarf joints. The stepped-lap joint solutions exhibit some characteristics of both the scarf and double-lap joints. The stepped-lap computer program handles arbitrary (different) step lengths and thickness and the solutions obtained have clarified potentially weak design details and the remedies. The program has been used effectively to optimize the joint proportions.

  17. Analysis Method for Inelastic, Adhesively Bonded Joints with Anisotropic Adherends

    NASA Technical Reports Server (NTRS)

    Smeltzer, Stanley S., III; Klang, Eric C.

    2003-01-01

    A one-dimensional analysis method for evaluating adhesively bonded joints composed of anisotropic adherends and adhesives with nonlinear material behavior is presented in the proposed paper. The strain and resulting stress field in a general, bonded joint overlap are determined by using a variable-step, finite-difference solution algorithm to iteratively solve a system of first-order differential equations. Applied loading is given by a system of combined extensional, bending, and shear forces that are applied to the edge of the joint overlap. Adherends are assumed to behave as linear, cylindrically bent plates using classical laminated plate theory that includes the effects of first-order transverse shear deformation. Using the deformation theory of plasticity and a modified von-Mises yield criterion, inelastic material behavior is modeled in the adhesive layer. Results for the proposed method are verified against previous results from the literature and shown to be in excellent agreement. An additional case that highlights the effects of transverse shear deformation between similar adherends is also presented.

  18. Statistical failure analysis of adhesive resin cement bonded dental ceramics

    PubMed Central

    Wang, Yaou; Katsube, Noriko; Seghi, Robert R; Rokhlin, Stanislav I.

    2007-01-01

    The goal of this work is to quantitatively examine the effect of adhesive resin cement on the probability of crack initiation from the internal surface of ceramic dental restorations. The possible crack bridging mechanism and residual stress effect of the resin cement on the ceramic surface are examined. Based on the fracture-mechanics-based failure probability model, we predict the failure probability of glass-ceramic disks bonded to simulated dentin subjected to indentation loads. The theoretical predictions match experimental data suggesting that both resin bridging and shrinkage plays an important role and need to be considered for accurate prognostics to occur. PMID:18670583

  19. Methods for Using Durable Adhesively Bonded Joints for Sandwich Structures

    NASA Technical Reports Server (NTRS)

    Smeltzer, Stanley S., III (Inventor); Lundgren, Eric C. (Inventor)

    2016-01-01

    Systems, methods, and apparatus for increasing durability of adhesively bonded joints in a sandwich structure. Such systems, methods, and apparatus includes an first face sheet and an second face sheet as well as an insert structure, the insert structure having a first insert face sheet, a second insert face sheet, and an insert core material. In addition, sandwich core material is arranged between the first face sheet and the second face sheet. A primary bondline may be coupled to the face sheet(s) and the splice. Further, systems, methods, and apparatus of the present disclosure advantageously reduce the load, provide a redundant path, reduce structural fatigue, and/or increase fatigue life.

  20. Towards large size substrates for III-V co-integration made by direct wafer bonding on Si

    SciTech Connect

    Daix, N. Uccelli, E.; Czornomaz, L.; Caimi, D.; Rossel, C.; Sousa, M.; Siegwart, H.; Marchiori, C.; Fompeyrine, J.; Hartmann, J. M.; Shiu, K.-T.; Cheng, C.-W.; Krishnan, M.; Lofaro, M.; Kobayashi, M.; Sadana, D.

    2014-08-01

    We report the first demonstration of 200 mm InGaAs-on-insulator (InGaAs-o-I) fabricated by the direct wafer bonding technique with a donor wafer made of III-V heteroepitaxial structure grown on 200 mm silicon wafer. The measured threading dislocation density of the In{sub 0.53}Ga{sub 0.47}As (InGaAs) active layer is equal to 3.5 × 10{sup 9} cm{sup −2}, and it does not degrade after the bonding and the layer transfer steps. The surface roughness of the InGaAs layer can be improved by chemical-mechanical-polishing step, reaching values as low as 0.4 nm root-mean-square. The electron Hall mobility in 450 nm thick InGaAs-o-I layer reaches values of up to 6000 cm{sup 2}/Vs, and working pseudo-MOS transistors are demonstrated with an extracted electron mobility in the range of 2000–3000 cm{sup 2}/Vs. Finally, the fabrication of an InGaAs-o-I substrate with the active layer as thin as 90 nm is achieved with a Buried Oxide of 50 nm. These results open the way to very large scale production of III-V-o-I advanced substrates for future CMOS technology nodes.

  1. Improved Bond Strength of Cyanoacrylate Adhesives Through Nanostructured Chromium Adhesion Layers

    NASA Astrophysics Data System (ADS)

    Gobble, Kyle; Stark, Amelia; Stagon, Stephen P.

    2016-09-01

    The performance of many consumer products suffers due to weak and inconsistent bonds formed to low surface energy polymer materials, such as polyolefin-based high-density polyethylene (HDPE), with adhesives, such as cyanoacrylate. In this letter, we present an industrially relevant means of increasing bond shear strength and consistency through vacuum metallization of chromium thin films and nanorods, using HDPE as a prototype material and cyanoacrylate as a prototype adhesive. For the as received HDPE surfaces, unmodified bond shear strength is shown to be only 0.20 MPa with a standard deviation of 14 %. When Cr metallization layers are added onto the HDPE at thicknesses of 50 nm or less, nanorod-structured coatings outperform continuous films and have a maximum bond shear strength of 0.96 MPa with a standard deviation of 7 %. When the metallization layer is greater than 50 nm thick, continuous films demonstrate greater performance than nanorod coatings and have a maximum shear strength of 1.03 MPa with a standard deviation of 6 %. Further, when the combination of surface roughening with P400 grit sandpaper and metallization is used, 100-nm-thick nanorod coatings show a tenfold increase in shear strength over the baseline, reaching a maximum of 2.03 MPa with a standard deviation of only 3 %. The substantial increase in shear strength through metallization, and the combination of roughening with metallization, may have wide-reaching implications in consumer products which utilize low surface energy plastics.

  2. Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers

    NASA Astrophysics Data System (ADS)

    Jagannadham, K.

    2016-11-01

    An 8 μm epoxy film deposited on a 350 μm Si (100) Si wafer with a 0.4 μm Au transducer film deposited on top of the polymer film was used to evaluate the thermal conductivity, the modulus of the porous film, and the initiation of spalling upon laser beam irradiation on the back side of the Si wafer. The polymer films were characterized for pore microstructure using scanning electron microscopy and energy dispersive spectrometry. The polymer films were characterized using transient thermo reflectance (TTR) with laser beams illuminating the Au layer. The TTR signal from the polymer film showed only the thermal component and was characteristic of variations associated with thermal conduction into the film. To induce spalling, the back side was illuminated with a Nd-YAG laser beam with a 532 nm wavelength, pulse energy density 1.8 J/cm2, and a repetition rate of 10 Hz for 10 s in conjunction with TTR measurements on the front side. The TTR signal from the polymer film subjected to laser beam incidence from the backside of the Si wafer showed both the thermal and the acoustic components. The acoustic component was used to detect the initial stages of spalling or delamination. The acoustic oscillations were modeled using a modified wave equation to determine the velocity of sound and the modulus of the film. The results were also used to determine the effect of porosity on the modulus of the polymer film. The TTR signal was found to be very sensitive to detection of delamination without complete separation of the film.

  3. Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods

    NASA Astrophysics Data System (ADS)

    Langa, S.; Drabe, C.; Kunath, C.; Dreyhaupt, A.; Schenk, H.

    2013-03-01

    In this paper the authors report about the six inch wafer level vacuum packaging of electro-statically driven two dimensional micro-mirrors. The packaging was done by means of two types of wafer bonding methods: anodic and glass frit. The resulting chips after dicing are 4 mm wide, 6 mm long and 1.6 mm high and the residual pressure inside the package after dicing was estimated to be between 2 and 20 mbar. This allowed us to reduce the driving voltage of the micro-mirrors by more than 40% compared to the driving voltage without vacuum packaging. The vacuum stability after 5 months was verified by measurement using the so called "membrane method". Persistence of the vacuum was proven. No getter materials were used for packaging.

  4. Effect of crystal anisotropy and adhesive forces on laser induced deformation patterns in covalently bonded thin films

    NASA Astrophysics Data System (ADS)

    Walgraef, D.; Ghoniem, N. M.

    2002-04-01

    The effect of crystal structure on laser induced deformation patterns in thin films and surfaces is analyzed within the framework of a dynamical model for the coupled evolution of defect densities and deformation fields. In crystals with covalent bonding, such as Si and SiC, preferential bond breaking may occur, as a result of the relative orientation of the laser electric field and crystallographic axes. We extend here our theoretical framework to incorporate the effects of anisotropic defect diffusion, and the influence of film-substrate adhesion on deformation pattern selection and stability of thin films subjected to laser beams. We also compare theoretical predictions to experimental observations on single crystal silicon wafer surfaces. Furthermore, it is predicted that the laser induced damage threshold for SiC single crystals can be in excess of 200 J/cm2.

  5. Heat Transfer in Adhesively Bonded Honeycomb Core Panels

    NASA Technical Reports Server (NTRS)

    Daryabeigi, Kamran

    2001-01-01

    The Swann and Pittman semi-empirical relationship has been used as a standard in aerospace industry to predict the effective thermal conductivity of honeycomb core panels. Recent measurements of the effective thermal conductivity of an adhesively bonded titanium honeycomb core panel using three different techniques, two steady-state and one transient radiant step heating method, at four laboratories varied significantly from each other and from the Swann and Pittman predictions. Average differences between the measurements and the predictions varied between 17 and 61% in the temperature range of 300 to 500 K. In order to determine the correct values of the effective thermal conductivity and determine which set of the measurements or predictions were most accurate, the combined radiation and conduction heat transfer in the honeycomb core panel was modeled using a finite volume numerical formulation. The transient radiant step heating measurements provided the best agreement with the numerical results. It was found that a modification of the Swann and Pittman semi-empirical relationship which incorporated the facesheets and adhesive layers in the thermal model provided satisfactory results. Finally, a parametric study was conducted to investigate the influence of adhesive thickness and thermal conductivity on the overall heat transfer through the panel.

  6. Finite Element Modeling of Viscoelastic Behavior and Interface Damage in Adhesively Bonded Joints

    DTIC Science & Technology

    2012-01-01

    Interface Damage in Adhesively Bonded Joints Feifei Cheng, Ö. Özgü Özsoy and J.N. Reddy* Advanced Computational Mechanics Laboratory, Department of...the adhesive and damage analysis of adhesive-adherend interfaces in adhesively bonded joints. First, viscoelastic finite element analysis of a model...nominal stress criterion and mixed-mode energy criterion are used to determine the damage initiation and evolution at the interface, respectively

  7. Direct wafer bonding technology for large-scale InGaAs-on-insulator transistors

    SciTech Connect

    Kim, SangHyeon E-mail: sh-kim@kist.re.kr; Ikku, Yuki; Takenaka, Mitsuru; Takagi, Shinichi; Yokoyama, Masafumi; Nakane, Ryosho; Li, Jian; Kao, Yung-Chung

    2014-07-28

    Heterogeneous integration of III-V devices on Si wafers have been explored for realizing high device performance as well as merging electrical and photonic applications on the Si platform. Existing methodologies have unavoidable drawbacks such as inferior device quality or high cost in comparison with the current Si-based technology. In this paper, we present InGaAs-on-insulator (-OI) fabrication from an InGaAs layer grown on a Si donor wafer with a III-V buffer layer instead of growth on a InP donor wafer. This technology allows us to yield large wafer size scalability of III-V-OI layers up to the Si wafer size of 300 mm with a high film quality and low cost. The high film quality has been confirmed by Raman and photoluminescence spectra. In addition, the fabricated InGaAs-OI transistors exhibit the high electron mobility of 1700 cm{sup 2}/V s and uniform distribution of the leakage current, indicating high layer quality with low defect density.

  8. Feasibility of Inspecting Adhesive Bonded Structures for Bond Strength Using Ultrasonic Spectroscopy.

    DTIC Science & Technology

    1982-03-01

    sensitivity levels and a correlation to joint strength are desirable, especially in highly stressed rotating parts. In this program, specimens were fabricated...34 specimens. The parameter difference between "dry" and "wet" specimens was not large, especially for thin adhesive bonds. 3.2.2 Fiberglass Epoxy...IF signal amplitude. Tne output of the detector would oe monitoreo with an oscilloscope and connected to the analog to digital converter. 5.1.3

  9. Evaluation of Several Bonding Parameters on the Random Bending Fatigue Life of Adhesively Bonded Aluminum Joints

    DTIC Science & Technology

    1981-08-01

    bag and cured in an autoclave according to the adhesive manufacturer’s recommended cure cycle. Detailed information on processes and fabrication...applied to the bond line during autoclave cure . The assembly was bagged in plastic and sealed. Vacuum was applied to the lay-up and it was placed in the... autoclave . After applying autoclave pressure, the vacuum was vented to the atmosphere, and the heat cure cycle commenced. (2) Autoclave Cure (a) FM73

  10. Adhesive bonding and the use of corrosion resistant primers. [for metal surface preparation

    NASA Technical Reports Server (NTRS)

    Hockridge, R. R.; Thibault, H. G.

    1972-01-01

    The use of an anti-corrosive primer has been shown to be essential to assure survival of a bonded structure in a hostile environment, particularly if a stress is to be applied to the adhesively bonded joint during the environmental exposure. For example, the Lockheed L-1011 TriStar assembly, after exhaustive evaluation tests specifies use of chromate filled inhibitive polysulfide sealants, and use of corrosion inhibiting adhesive primers prior to structural bonding with film adhesive.

  11. Shear bond strength of a new polycarbonate bracket--an in vitro study with 14 adhesives.

    PubMed

    Akin-Nergiz, N; Nergiz, I; Behlfelt, K; Platzer, U

    1996-06-01

    Shear bond strength and failure location were used to evaluate the effectiveness of plastic bracket primers for bonding diacrylate adhesives on a new fibre-reinforced polycarbonate bracket. Maxillary incisor polycarbonate and mesh-based brackets as control were bonded to human incisors with 14 different adhesives (four filled diacrylate two-paste, six diacrylate one-step and four power-liquid acrylic adhesives), and after thermo-cycling for 2000 cycles between 5 degrees and 55 degrees C, tested in shear. A non-parametric test (Mann-Whitney U test) was used to compare the shear bond strength of the polycarbonate brackets with the mesh based brackets and a One-way test (according to Scheffe) to compare the shear bond strength of different adhesives. The following conclusions can be made: 1. Seven of the 14 adhesives used in this study with both types of brackets demonstrated adequate shear bond strength values for the clinical application. The exceptions were: Achieve Mix, No-Mix:30 Silkon, Lee Insta-Bond, Ortho-Loc and Bond-Eze, all with too low a shear bond strength for one or both types of brackets, and finally Quasar, which used with the plastic brackets sometimes caused enamel fractures, due to high bond strength. 2. The adhesives with their own plastic primer demonstrated higher blood strength values than those without plastic primer, and two-paste adhesives used with plastic primer displayed a higher bond strength than the other adhesives. 3. Generally, the shear bond strength values of the one-step adhesives were lower compared with the two-paste adhesives. 4. The liquid-powder adhesives demonstrated very different values for bond strength.

  12. Effect of adhesive layers on microshear bond strength of nanocomposite resin to dentin

    PubMed Central

    Ebrahim, Mohamed I.

    2017-01-01

    Background Bond strength of adhesive layer can absorb unwanted stresses of polymerization shrinkage in composite resin restorations; increased microshear bond strength can prevent failure of restoration materials, the purpose of this study was to evaluate the effect of adhesive layers on microshear bond strength of nanocomposite resin to dentin. Material and Methods Two different types of adhesive systems: universal adhesive (ExciTE) and newly developed adhesive (Nano-Bond), and one type of light-cured resin restorative material (Nanocomposite resin) were used in this study. The occlusal surfaces of extracted human molar teeth were ground perpendicular to the long axis of each tooth to expose a flat dentin surface. The adhesives were applied on dentin surfaces (single application or double application). Nanocomposite resin was then placed and light cured for 40 seconds. After 24 hours of immersion in water at 37°C, then subjected to thermocycling before testing, a microshear bond test was carried out. The data were analyzed by a two-way ANOVA. For comparison between groups, Tukey’s post-hoc test was used. Results The mean bond strengths of ExciTE and Nano-Bond adhesives with a single application were 8.8 and 16.6 MPa, respectively. The mean bond strengths of ExciTE and Nano-Bond adhesives with double application were 13.2 and 21.8MPa, respectively. There were no statistically significant differences in microshear bond strengths between the single application of Nano-Bond and the double application of ExciTE adhesives. Conclusions Microshear bond strength increased significantly as the applied adhesive layer was doubled. Key words:Adhesive, microshear, bond, strength, nanocomposite. PMID:28210433

  13. New surface-active comonomer for adhesive bonding.

    PubMed

    Bowen, R L; Bennett, P S; Groh, R J; Farahani, M; Eichmiller, F C

    1996-01-01

    Previous studies have indicated that chemical and physical characteristics of aromatic amines can be influenced by the nature of their substituents. The experimental question examined in the present study relates to the effects of replacing specific hydrogen atoms with methyl groups in a surface-active comonomer utilized in adhesive bonding protocols. N-2-propionic acid-N-3-(2-hydroxy-1-methacryloxy)propyl-3,5-dimethylaniline sodium salt (N35A) was synthesized by an addition reaction of glycidyl methacrylate with the sodium salt of N-reaction of glycidyl methacrylate with the sodium salt of N-(3,5-dimethylphenyl)alanine, which was formed by alkaline hydrolysis of ethyl-N-(3,5-dimethylphenyl)alanate that was prepared by condensation of ethyl-2-bromopropionate with 3,5-dimethylaniline. 1H and 13C NMR spectra and analysis by mass spectroscopy were consistent with N35A after it had been recrystallized from acetone. Color stability and adhesion-promoting capability of N35A were compared with those of N-2-acetic acid-N-3-(2-hydroxy-1-methacryloxy)propyl-4-methylanaline sodium salt (Na-NTG-GMA), the latter being widely used in commercial bonding formulations. Both N35A and Na-NTG-GMA polymerized within a few minutes at 23 degrees C when dissolved in aliquots from a stock solution containing benzene 85 wt%, ethanol 14 wt%, and benzoyl peroxide 1.0 wt%; but with each at 0.018 molal concentration, the N35A suspension was more color-stable than that of the Na-NTG-GMA. In the protocol used, shear bond strengths of a hybrid composite to human dentin with N35A were 30.2 MPa, SD = 7.5 MPa, and with Na-NTG-GMA, 29.7 MPa, SD = 11.8 MPa(n = 7 each; t test, p = 0.93).

  14. Wafer-level packaging and laser bonding as an approach for silicon-into-lab-on-chip integration

    NASA Astrophysics Data System (ADS)

    Brettschneider, T.; Dorrer, C.; Bründel, M.; Zengerle, R.; Daub, M.

    2013-05-01

    A novel approach for the integration of silicon biosensors into microfluidics is presented. Our approach is based on wafer-level packaging of the silicon die and a laser-bonding process of the resulting mold package into a polymer-multilayer stack. The introduction of a flexible and 40 μm thin hot melt foil as an intermediate layer enables laser bonding between materials with different melting temperatures, where standard laser welding processes cannot be employed. All process steps are suitable for mass production, e.g. the approach does not involve any dispensing steps for glue or underfiller. The integration approach was demonstrated and evaluated regarding process technology by wafer-level redistribution of daisy chain silicon dies representing a generic biosensor. Electrical connection was successfully established and laser-bonding tensile strength of 5.7 N mm-2 and burst pressure of 587 kPa at a temperature of 100 °C were achieved for the new material combination. The feasibility of the complete packaging approach was shown by the fabrication of a microfluidic flow cell with embedded mold package.

  15. Micro-tensile bond strength of adhesive systems applied on occlusal primary enamel.

    PubMed

    Ramires-Romito, Ana Cláudia; Reis, Alessandra; Loguercio, Alessandro Dourado; de Góes, Mario Fernando; Grande, Rosa Helena Miranda

    2004-01-01

    The aim of this study was to evaluate the micro-tensile bond strength of adhesive systems (OptiBond Solo, Kerr; Prime & Bond NT, Dentsply) on occlusal surface of primary molars. The adhesives were tested under manufacturers' specifications and after contamination of the bonding site with saliva. Hourglass cylindrical-shaped samples were obtained and subjected to a tensile force. No significant difference was observed among the groups. OptiBond Solo and Prime & Bond NT showed similar values of bond strengths when applied on occlusal enamel of primary molar under either saliva contamination or not.

  16. Investigation of room-temperature wafer bonded GaInP/GaAs/InGaAsP triple-junction solar cells

    NASA Astrophysics Data System (ADS)

    Yang, Wen-xian; Dai, Pan; Ji, Lian; Tan, Ming; Wu, Yuan-yuan; Uchida, Shiro; Lu, Shu-long; Yang, Hui

    2016-12-01

    We report on the fabrication of III-V compound semiconductor multi-junction solar cells using the room-temperature wafer bonding technique. GaInP/GaAs dual-junction solar cells on GaAs substrate and InGaAsP single junction solar cell on InP substrate were separately grown by all-solid state molecular beam epitaxy (MBE). The two cells were then bonded to a triple-junction solar cell at room-temperature. A conversion efficiency of 30.3% of GaInP/GaAs/InGaAsP wafer-bonded solar cell was obtained at 1-sun condition under the AM1.5G solar simulator. The result suggests that the room-temperature wafer bonding technique and MBE technique have a great potential to improve the performance of multi-junction solar cell.

  17. Improved Bond Strength of Cyanoacrylate Adhesives Through Nanostructured Chromium Adhesion Layers.

    PubMed

    Gobble, Kyle; Stark, Amelia; Stagon, Stephen P

    2016-12-01

    The performance of many consumer products suffers due to weak and inconsistent bonds formed to low surface energy polymer materials, such as polyolefin-based high-density polyethylene (HDPE), with adhesives, such as cyanoacrylate. In this letter, we present an industrially relevant means of increasing bond shear strength and consistency through vacuum metallization of chromium thin films and nanorods, using HDPE as a prototype material and cyanoacrylate as a prototype adhesive. For the as received HDPE surfaces, unmodified bond shear strength is shown to be only 0.20 MPa with a standard deviation of 14 %. When Cr metallization layers are added onto the HDPE at thicknesses of 50 nm or less, nanorod-structured coatings outperform continuous films and have a maximum bond shear strength of 0.96 MPa with a standard deviation of 7 %. When the metallization layer is greater than 50 nm thick, continuous films demonstrate greater performance than nanorod coatings and have a maximum shear strength of 1.03 MPa with a standard deviation of 6 %. Further, when the combination of surface roughening with P400 grit sandpaper and metallization is used, 100-nm-thick nanorod coatings show a tenfold increase in shear strength over the baseline, reaching a maximum of 2.03 MPa with a standard deviation of only 3 %. The substantial increase in shear strength through metallization, and the combination of roughening with metallization, may have wide-reaching implications in consumer products which utilize low surface energy plastics.

  18. Hysteresis-free high-temperature precise bimorph actuators produced by direct bonding of lithium niobate wafers

    SciTech Connect

    Shur, V. Ya.; Baturin, I. S.; Mingaliev, E. A.; Zorikhin, D. V.; Udalov, A. R.; Greshnyakov, E. D.

    2015-02-02

    The current paper presents a piezoelectric bimorph actuator produced by direct bonding of lithium niobate wafers with the mirrored Y and Z axes. Direct bonding technology allowed to fabricate bidomain plate with precise positioning of ideally flat domain boundary. By optimizing the cutting angle (128° Y-cut), the piezoelectric constant became as large as 27.3 pC/N. Investigation of voltage dependence of bending displacement confirmed that bimorph actuator has excellent linearity and hysteresis-free. Decrease of the applied voltage down to mV range showed the perfect linearity up to the sub-nm deflection amplitude. The frequency and temperature dependences of electromechanical transmission coefficient in wide temperature range (from 300 to 900 K) were investigated.

  19. Hysteresis-free high-temperature precise bimorph actuators produced by direct bonding of lithium niobate wafers

    NASA Astrophysics Data System (ADS)

    Shur, V. Ya.; Baturin, I. S.; Mingaliev, E. A.; Zorikhin, D. V.; Udalov, A. R.; Greshnyakov, E. D.

    2015-02-01

    The current paper presents a piezoelectric bimorph actuator produced by direct bonding of lithium niobate wafers with the mirrored Y and Z axes. Direct bonding technology allowed to fabricate bidomain plate with precise positioning of ideally flat domain boundary. By optimizing the cutting angle (128° Y-cut), the piezoelectric constant became as large as 27.3 pC/N. Investigation of voltage dependence of bending displacement confirmed that bimorph actuator has excellent linearity and hysteresis-free. Decrease of the applied voltage down to mV range showed the perfect linearity up to the sub-nm deflection amplitude. The frequency and temperature dependences of electromechanical transmission coefficient in wide temperature range (from 300 to 900 K) were investigated.

  20. Bonding of self-adhesive resin cements to enamel using different surface treatments: bond strength and etching pattern evaluations.

    PubMed

    Lin, Jie; Shinya, Akikazu; Gomi, Harunori; Shinya, Akiyoshi

    2010-08-01

    This study evaluated the shear bond strengths and etching patterns of seven self-adhesive resin cements to human enamel specimens which were subjected to one of the following surface treatments: (1) Polishing with #600 polishing paper; (2) Phosphoric acid; (3) G-Bond one-step adhesive; or (4) Phosphoric acid and G-Bond. After surface treatment, the human incisor specimens were bonded to a resin composite using a self-adhesive resin cement [Maxcem (MA), RelyX Unicem (UN), Breeze (BR), BisCem (BI), seT (SE), Clearfil SA Luting (CL)] or a conventional resin cement [ResiCem (RE)]. Representative morphology formed with self-adhesive resin cements showed areas of etched enamel intermingled with areas of featureless enamel. In conclusion, etching efficacy influenced the bonding effectiveness of self-adhesive resin cements to unground enamel, and that a combined use of phosphoric acid and G-Bond for pretreatment of human enamel surfaces improved the bond strength of self-adhesive resin cements.

  1. Effects of endodontic tri-antibiotic paste on bond strengths of dentin adhesives to coronal dentin

    PubMed Central

    Mirzakoucheki, Parvin; Walter, Ricardo; Jahromi, Maryam Zare; Mirsattari, Sanaz; Akbarzadeh, Navid

    2015-01-01

    Objectives The aim of this study was to evaluate the effects of tri-antibiotic paste (TAP) on microtensile bond strengths (MTBS) of dental adhesives to dentin. Materials and Methods Sixty extracted molars had their occlusal surfaces flattened to expose dentin. They were divided into two groups, i.e., control group with no dentin treatment and experimental group with dentin treatment with TAP. After 10 days, specimens were bonded using self-etch (Filtek P90 adhesive) or etch-and-rinse (Adper Single Bond Plus) adhesives and restored with composite resin. Teeth were sectioned into beams, and the specimens were subjected to MTBS test. Data were analyzed using two-way ANOVA and post hoc Tukey tests. Results There was a statistically significant interaction between dentin treatment and adhesive on MTBS to coronal dentin (p = 0.003). Despite a trend towards worse MTBS being noticed in the experimental groups, TAP application showed no significant effect on MTBS (p = 0.064). Conclusions The etch-and-rinse adhesive Adper Single Bond Plus presented higher mean bond strengths than the self-etch adhesive Filtek P90, irrespective of the group. The superior bond performance for Adper Single Bond when compared to Filtek P90 adhesive was confirmed by a fewer number of adhesive failures. The influence of TAP in bond strength is insignificant. PMID:25984475

  2. Surface Monitoring of CFRP Structures for Adhesive Bonding

    NASA Technical Reports Server (NTRS)

    Ledesma, Rodolfo; Palmieri, Frank L.; Yost, William T.; Connell, John W.; Fitz-Gerald, James M.

    2017-01-01

    Adhesive bonding of composite materials requires reliable monitoring and detection of surface contaminants to assure robust and durable bonded structures. Surface treatment and effective monitoring prior to bonding is essential in order to obtain a surface free from contaminants that may degrade structural performance. Two techniques which monitor the effectiveness of the laser surface treatment of carbon fiber reinforced polymer (CFRP) materials are being investigated: laser induced breakdown spectroscopy (LIBS) and optically stimulated electron emission (OSEE). The applicability of LIBS to detect silicone contaminants on CFRP composites is studied using 35 ns Nd:YAG laser pulses at 355 nm with a pulse energy of 45 mJ. The LIBS regime in which pulse energies are < 100 mJ is referred to as mLIBS. CFRP surfaces were contaminated with polydimethylsiloxane (PDMS), a major component of silicone based mold release agents. The presence of PDMS is found by inspecting the Si I emission line at 288.2 nm. Untreated CFRP samples and CFRP contaminated with PDMS were tested. The PDMS areal density ranged from 0.36 Â+/- 0.04 to 0.51 Â+/- 0.16 mg/cm2. The results demonstrate the successful detection of PDMS on CFRP using mLIBS. In addition, OSEE was used to measure CFRP surface cleanliness pre- and post-treatment by laser ablation on specimens contaminated with PDMS coatings from 8 nm to 1311 nm in thickness. The results showed a significant increase in the OSEE photocurrent after laser surface treatment.

  3. Effect of acid etching on bond strength of nanoionomer as an orthodontic bonding adhesive

    PubMed Central

    Khan, Saba; Verma, Sanjeev K.; Maheshwari, Sandhya

    2015-01-01

    Aims: A new Resin Modified Glass Ionomer Cement known as nanoionomer containing nanofillers of fluoroaluminosilicate glass and nanofiller 'clusters' has been introduced. An in-vitro study aimed at evaluating shear bond strength (SBS) and adhesive remnant index (ARI) of nanoionomer under etching/unetched condition for use as an orthodontic bonding agent. Material and Methods: A total of 75 extracted premolars were used, which were divided into three equal groups of 25 each: 1-Conventional adhesive (Enlight Light Cure, SDS, Ormco, CA, USA) was used after and etching with 37% phosphoric acid for 30 s, followed by Ortho Solo application 2-nanoionomer (Ketac™ N100, 3M, ESPE, St. Paul, MN, USA) was used after etching with 37% phosphoric acid for 30 s 3-nanoionomer was used without etching. The SBS testing was performed using a digital universal testing machine (UTM-G-410B, Shanta Engineering). Evaluation of ARI was done using scanning electron microscopy. The SBS were compared using ANOVA with post-hoc Tukey test for intergroup comparisons and ARI scores were compared with Chi-square test. Results: ANOVA (SBS, F = 104.75) and Chi-square (ARI, Chi-square = 30.71) tests revealed significant differences between groups (P < 0.01). The mean (SD) SBS achieved with conventional light cure adhesive was significantly higher (P < 0.05) (10.59 ± 2.03 Mpa, 95% CI, 9.74-11.41) than the nanoionomer groups (unetched 4.13 ± 0.88 Mpa, 95% CI, 3.79-4.47 and etched 9.32 ± 1.87 Mpa, 95% CI, 8.58-10.06). However, nanoionomer with etching, registered SBS in the clinically acceptable range of 5.9–7.8 MPa, as suggested by Reynolds (1975). The nanoionomer groups gave significantly lower ARI values than the conventional adhesive group. Conclusion: Based on this in-vitro study, nanoionomer with etching can be successfully used as an orthodontic bonding agent leaving less adhesive remnant on enamel surface, making cleaning easier. However, in-vivo studies are needed to confirm the validity

  4. In vitro evaluation of a moisture-active adhesive for indirect bonding.

    PubMed

    Klocke, Arndt; Shi, Jianmin; Kahl-Nieke, Bärbel; Bismayer, Ulrich

    2003-12-01

    The aim of this in vitro investigation was to evaluate bond strength for a cyanoacrylate adhesive in combination with an indirect bonding technique. Eighty bovine permanent mandibular incisors were randomly divided into four groups of 20 teeth each. The influence of two factors on shear bond strength was investigated: (1) type of adhesive (Smartbond cyanoacrylate, Sondhi Rapid Set composite sealant) and (2) time of debonding (30 minutes and 24 hours after bonding). Stainless steel mesh-based brackets were used. Although, bond strength was not significantly different for the two debonding time periods, significantly lower bond strength measurements were found for the cyanoacrylate adhesive (P < .001). The mean bond strength for the cyanoacrylate adhesive group was 5.44 +/- 1.65 MPa for debonding 30 minutes and 6.92 +/- 1.48 MPa for debonding 24 hours after the bonding procedure vs 16.16 +/- 5.25 MPa and 14.98 +/- 2.85 MPa for the composite adhesive groups debonded at 30 minutes and 24 hours, respectively. The Weibull analysis indicated that there was an increased risk of bond failure at clinically relevant levels of stress for indirect bonding with the cyanoacrylate adhesive.

  5. The effect of different adhesive system applications on push-out bond strengths of glass fiber posts

    PubMed Central

    Deniz Arısu, Hacer; Üçtaşlı, Mine Betül; Okay, Tufan Can

    2013-01-01

    PURPOSE Over the past years, the adhesion of fiber posts luted with simplified adhesive systems has been a matter of great interest. The aim of this study was to assess the post retentive potential of a self-adhesive resin cement using different adhesive systems to compare the push-out bond strengths of fiber posts. MATERIALS AND METHODS The post spaces of 56 mandibular premolar roots were prepared and divided into 4 experimental groups and further divided into 2 subgroups according to testing time (n=7). The fiber posts (Rely X Fiber Post) were luted with a self-adhesive resin cement (RelyX Unicem) and one of the following adhesive systems: no adhesive, a total-etch adhesive resin (Single Bond), a two-step self-etch adhesive resin (Clearfil SE Bond) and a one-step self-etch adhesive resin (Clearfil S3 Bond). Each root was cut horizontally, and 1.5 mm thick six root segments were prepared. Push-out tests were performed after one week or three months (0.5 mm/min). Statistical analysis were performed with three-way ANOVA (α=.05). RESULTS Cervical root segments showed higher bond strength values than middle segments. Adhesive application increased the bond strength. For one week group, the total-etch adhesive resin Single Bond showed higher bond strength than the self-adhesive resin cement RelyX Unicem applied without adhesive resin at middle region. For 3 months group, the two-step self-etch adhesive resin Clearfil SE Bond showed the highest bond strength for both regions. Regarding the time considered, Clearfil SE Bond 3 months group showed higher bond strength values than one week group. CONCLUSION Using the adhesive resins in combination with the self-adhesive resin cement improves the bond strengths. The bond strength values of two-step self-etch adhesive resin Clearfil SE Bond improved as time passes. PMID:24049572

  6. Electrostatic bonding of thin (approximately 3 mil) 7070 cover glass to Ta2O5 AR-coated thin (approximately 2 mil) silicon wafers and solar cells

    NASA Technical Reports Server (NTRS)

    Egelkrout, D. W.; Horne, W. E.

    1980-01-01

    Electrostatic bonding (ESB) of thin (3 mil) Corning 7070 cover glasses to Ta2O5 AR-coated thin (2 mil) silicon wafers and solar cells is investigated. An experimental program was conducted to establish the effects of variations in pressure, voltage, temperature, time, Ta2O5 thickness, and various prebond glass treatments. Flat wafers without contact grids were used to study the basic effects for bonding to semiconductor surfaces typical of solar cells. Solar cells with three different grid patterns were used to determine additional requirements caused by the raised metallic contacts.

  7. Shear bond strength of one-step self-etch adhesives: pH influence

    PubMed Central

    Poggio, Claudio; Beltrami, Riccardo; Scribante, Andrea; Colombo, Marco; Chiesa, Marco

    2015-01-01

    Background: The aim of this study was to compare the shear bond strength of four one-step self-etch adhesives with different pH values to enamel and dentin. Materials and Methods: In this in vitro study, 200 bovine permanent mandibular incisors were used. Four one-step self-etch adhesives with different pH values were tested both on enamel and on dentin: Adper™ Easy Bond Self-Etch Adhesive (pH = 0.8-1), Futurabond NR (pH=2), G-aenial Bond (pH = 1.5), Clearfil S3 Bond (pH = 2.7). After adhesive systems application, a nanohybrid composite resin was inserted into the bonded surface. The specimens were placed in a universal testing machine. The shear bond strength was performed at a cross-head speed of 1 mm/min until the sample rupture. The shear bond strength values (MPa) of the different groups were compared with analysis of variance after that Kolmogorov and Smirnov tests were applied to assess normality of distributions. P < 0.05 was considered as significant. Results: In enamel shear bond strength, the highest shear bond strength values were reported with Futurabond NR (P < 0.01); however, no significant differences were found with Clearfil S3 Bond. The others adhesive systems showed lower shear bond strength values with significant differences between them (P < 0.05). When comparing the dentin shear bond strength, the lowest shear bond strength values were reported with Clearfil S3 Bond (P < 0.05), while there were no significant differences among the other three products (P > 0.05). Conclusion: The pH values of adhesive systems did not influence significantly their shear bond strength to enamel or dentin. PMID:26005459

  8. Oxide film microstructure: the link between surface preparation processes and strength/durability of adhesively bonded aluminum. Final report

    SciTech Connect

    Hsia, K. Jimmy; Pearlstein, Arne J.; Scheeline, Alexander; Shang, Jian Ku

    2000-11-30

    Strength and durability of adhesive bonding of aluminum alloys structures are intrinsically determined by the surface microstructures and interfacial failure micromechanisms. The current project presents a multidisciplinary approach to addressing critical issues controlling the strength and durability of adhesive bonds of aluminum alloys. Three main thrust areas have been pursued: surface treatment technology development to achieve desirable surface microstructures; relationship between surface structure and properties of adhesive bonds; and failure mechanisms of adhesively bonded components.

  9. Implementation of various vacuum conditions in sealed chambers for wafer-level bonding by using embedded cavity

    NASA Astrophysics Data System (ADS)

    Cheng, C.-W.; Liang, K.-C.; Chu, C.-H.; Fang, W.

    2017-01-01

    The existing foundry processes enable the fabrication and integration of various sensors on a single chip. However, various vacuum conditions of these sensors remain a critical concern after packaging. For example, accelerometers and gyroscopes are operated under two different vacuum conditions. This study extends the concept of using outgassing to realize sealed chambers under different vacuum conditions in one wafer-level bonding step. In other words, by etching various numbers and sizes of cavities on a substrate, the vacuum condition of a sealed chamber can be modulated. In applications, resonators and Pirani gauges were fabricated and characterized to demonstrate the feasibility of the proposed process scheme. The vacuum condition of the sealed chambers was then monitored using the quality factor (detected by resonators) and the pressure (measured by Pirani gauges). The measurements indicate that the sealed chambers with vacuum conditions ranging from approximately 2 to 180 mbar were simultaneously fabricated and integrated on the same wafer. This approach could facilitate the monolithic integration of devices with different vacuum requirements, such as approximately 100 mbar chamber pressure for accelerometers, and single-digit millibars vacuum conditions for gyroscopes.

  10. Directional diffusion and void formation at a Si (001) bonded wafer interface

    NASA Astrophysics Data System (ADS)

    Esser, R. H.; Hobart, K. D.; Kub, F. J.

    2002-08-01

    Low-temperature hydrophobic bonding is an enabling technology allowing the fabrication of device structures. Current research into improvement of hydrophobic bonding has focused on the elimination of thermally generated voids. It has been observed that a regular grid etched into the bonding interface can eliminate the thermally generated voids. By manipulation of patterns etched into the bond interface, it was possible to ascertain that the diffusion of interfacial gasses that form the thermally generated voids is enhanced along the <110> directions. This is shown by an analysis of the void density at various locations in relation to the etched trenches at the bonded interface. Void density between trenches is shown to be 12% of the void density near trenches but nto along a <110> direction.

  11. Adhesive Bonding for Optical Metrology Systems in Space Applications

    NASA Astrophysics Data System (ADS)

    Gohlke, Martin; Schuldt, Thilo; Döringshoff, Klaus; Peters, Achim; Johann, Ulrich; Weise, Dennis; Braxmaier, Claus

    2015-05-01

    Laser based metrology systems become more and more attractive for space applications and are the core elements of planned missions such as LISA (NGO, eLISA) or NGGM where laser interferometry is used for distance measurements between satellites. The GRACE-FO mission will for the first time demonstrate a Laser Ranging Instrument (LRI) in space, starting 2017. Laser based metrology also includes optical clocks/references, either as ultra-stable light source for high sensitivity interferometry or as scientific payload e.g. proposed in fundamental physics missions such as mSTAR (mini SpaceTime Asymmetry Research), a mission dedicated to perform a Kennedy-Thorndike experiment on a satellite in a low-Earth orbit. To enable the use of existing optical laboratory setups, optimization with respect to power consumption, weight and dimensions is necessary. At the same time the thermal and structural stability must be increased. Over the last few years we investigated adhesive bonding of optical components to thermally highly stable glass ceramics as an easy-to-handle assembly integration technology. Several setups were implemented and tested for potential later use in space applications. We realized a heterodyne LISA related interferometer with demonstrated noise levels in the pm-range for translation measurement and nano-radiant-range for tilt measurements and two iodine frequency references on Elegant Breadboard (EBB) and Engineering Model (EM) level with frequency stabilities in the 10-15 range for longer integration times. The EM setup was thermally cycled and vibration tested.

  12. Bond Strength of Methacrylate-Based Composite to Dentin using a Silorane Adhesive

    DTIC Science & Technology

    2013-06-06

    failures using Clearfil SE Bond were mixed or cohesive in nature suggesting a more stable adhesive interface (Al- Salehi and Burke, 1997). However, the...REFERENCES Al- Salehi SK, Burke FJ. Methods used in dentin bonding tests: An analysis of 50 investigations on bond strength. Quint Inter 1997;28:717–723

  13. Does hybridized dentin affect bond strength of self-adhesive resin cement?

    PubMed Central

    do Valle, Accácio-Lins; de Andrade, Gustavo-Henrique-Barbosa; Vidotti, Hugo-Alberto; Só, Marcus-Vinícius-Reis; Pereira, Jefferson-Ricardo

    2016-01-01

    Background Evaluate the influence of different hybridization bonding techniques of a self-adhesive resin cement. Material and Methods 30 human health molars were divided into six groups (n=10). The specimens received three longitudinal sections, allowing insertion of central cuts in PVC matrices. Each group received a different dentin pretreatment according to the manufacturer’s recommendations, except the control group (G1), as follows. G2 - a 3-step total-etch adhesive system (Optibond™ FL, Kerr); G3 - a 3-step total-etch adhesive system (Adper™ Scotchbond™ Multi-Purpose, 3M ESPE); G4 - a 2-step total-etch adhesive system (Adper™ Single Bond 2, 3M ESPE); G5 - a single-step self-etching system (Bond Force, Tokuyama); and G6 - universal bonding system (Single Bond Universal, 3M ESPE). Then, cylinders made of self-adhesive resin cement with polypropylene matrix was cemented in all groups (RelyX U200, 3M ESPE). Bond strength was assessed by submitting the specimens to micro-shear test and was characterized according to the fracture pattern observed through optical microscopy. Results The results were submitted to the Kruskal-Wallis test, which indicated a statistically significant difference between the groups (p=0.04), and Tukey’s multiple comparisons, which indicated a statistically significant difference between G1 and G3 (p<0.05). The microscopic analysis revealed a high prevalence of adhesive failures, followed by mixed fractures, and cohesive failures in the dentin. Conclusions The use of a previous dentin hybridization protocol is able to increase adhesive bonding resistance of self-adhesive resin cement, especially when used Adper™ Scotchbond™ Multi-Purpose system. Key words:Bonding, self-adhesive resin cement, adhesive systems, microshear. PMID:27703609

  14. The influence of cyclical environmental exposure on the durability of adhesively bonded titanium

    SciTech Connect

    Creegan, C.A.; Shephard, N.E.; Dillard, J.G.

    1996-12-31

    Bonded systems must be able to withstand a variety of conditions including environmental exposure throughout their lifetime. This is especially important in the aerospace industry where adhesives are used for fastening as well as sealing and insulating. Conditions such as high and low temperatures and high relative humidity may be particularly detrimental to adhesive bonds. Previous durability studies have focused on exposing bonded joints to static environments. This study examines the potential differences in durability when comparing static and cyclical environmental exposure of adhesively bonded titanium. Cyclical tests may more readily simulate actual use exposure conditions for aerospace applications. Base/acid cleaning and chromic acid anodization (CAA) treatments were used to treat the titanium-6Al-4V, and the adherends were bonded with a polyimide adhesive. After static and cyclical environmental exposure tests were conducted, failed samples were characterized via surface sensitive analytical methods.

  15. Design and fabrication of high performance wafer-level vacuum packaging based on glass-silicon-glass bonding techniques

    NASA Astrophysics Data System (ADS)

    Zhang, Jinwen; Jiang, Wei; Wang, Xin; Zhou, Jilong; Yang, Huabing

    2012-12-01

    In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer sealing structure for encapsulating large mass inertial MEMS devices fabricated by silicon-on-glass bulk micromachining technology is presented. Roughness controlling strategy of bonding surfaces was proposed and described in detail. Silicon substrate was thinned and polished by CMP after the first bonding with the glass substrate and was then bonded with the glass micro-cap. Zr thin film was embedded into the concave of the micro-cap by a shadow-mask technique. The glass substrate was thinned to about 100 µm, wet etched through and metalized for realizing vertical feedthrough. During the fabrication, all patterning processes were operated carefully so as to reduce extrusive fragments to as little as possible. In addition, a high-performance micro-Pirani vacuum gauge was integrated into the package for monitoring the pressure and the leak rate further. The result shows that the pressure in the package is about 120 Pa and has no obvious change for more than one year indicating 10-13 stdcc s-1 leak rate.

  16. Eroded dentin does not jeopardize the bond strength of adhesive restorative materials.

    PubMed

    Cruz, Janaina Barros; Lenzi, Tathiane Larissa; Tedesco, Tamara Kerber; Guglielmi, Camila de Almeida Brandão; Raggio, Daniela Prócida

    2012-01-01

    This in vitro study evaluated the bond strength of adhesive restorative materials to sound and eroded dentin. Thirty-six bovine incisors were embedded in acrylic resin and ground to obtain flat buccal dentin surfaces. Specimens were randomly allocated in 2 groups: sound dentin (immersion in artificial saliva) and eroded dentin (pH cycling model - 3× / cola drink for 7 days). Specimens were then reassigned according to restorative material: glass ionomer cement (KetacTM Molar Easy Mix), resin-modified glass ionomer cement (VitremerTM) or adhesive system with resin composite (Adper Single Bond 2 + Filtek Z250). Polyethylene tubes with an internal diameter of 0.76 mm were placed over the dentin and filled with the material. The microshear bond test was performed after 24 h of water storage at 37ºC. The failure mode was evaluated using a stereomicroscope (400×). Bond strength data were analyzed with two-way ANOVA and Tukey's post hoc tests (α = 0.05). Eroded dentin showed bond strength values similar to those for sound dentin for all materials. The adhesive system showed the highest bond strength values, regardless of the substrate (p < 0.0001). For all groups, the adhesive/mixed failure prevailed. In conclusion, adhesive materials may be used in eroded dentin without jeopardizing the bonding quality. It is preferable to use an etch-and-rinse adhesive system because it shows the highest bond strength values compared with the glass ionomer cements tested.

  17. Influence of Etching Mode on Enamel Bond Durability of Universal Adhesive Systems.

    PubMed

    Suzuki, T; Takamizawa, T; Barkmeier, W W; Tsujimoto, A; Endo, H; Erickson, R L; Latta, M A; Miyazaki, M

    2016-01-01

    The purpose of this study was to determine the enamel bond durability of three universal adhesives in different etching modes through fatigue testing. The three universal adhesives used were Scotchbond Universal, Prime&Bond Elect universal dental adhesive, and All-Bond Universal light-cured dental adhesive. A single-step self-etch adhesive, Clearfil S(3) Bond Plus was used as a control. The shear bond strength (SBS) and shear fatigue strength (SFS) to human enamel were evaluated in total-etch mode and self-etch mode. A stainless steel metal ring with an internal diameter of 2.4 mm was used to bond the resin composite to the flat-ground (4000-grit) tooth surfaces for determination of both SBS and SFS. For each enamel surface treatment, 15 specimens were prepared for SBS and 30 specimens for SFS. The staircase method for fatigue testing was then used to determine the SFS of the resin composite bonded to the enamel using 10-Hz frequencies for 50,000 cycles or until failure occurred. Scanning electron microscopy was used to observe representative debonded specimen surfaces and the resin-enamel interfaces. A two-way analysis of variance and the Tukey post hoc test were used for analysis of the SBS data, whereas a modified t-test with Bonferroni correction was used for the SFS data. All adhesives in total-etch mode showed significantly higher SBS and SFS values than those in self-etch mode. Although All-Bond Universal in self-etch mode showed a significantly lower SBS value than the other adhesives, there was no significant difference in SFS values among the adhesives in this mode. All adhesives showed higher SFS:SBS ratios in total-etch mode than in self-etch mode. With regard to the adhesive systems used in this study, universal adhesives showed higher enamel bond strengths in total-etch mode. Although the influence of different etching modes on the enamel-bonding performance of universal adhesives was found to be dependent on the adhesive material, total-etch mode

  18. Effect of Different Bonding Strategies on Adhesion to Deep and Superficial Permanent Dentin

    PubMed Central

    Pegado, Rafael Eduardo Fernandes; do Amaral, Flávia Lucisano Botelho; Flório, Flávia Martão; Basting, Roberta Tarkany

    2010-01-01

    Objectives: To evaluate the effect of different bonding strategies on the microtensile bond strength to deep and superficial permanent dentin. Methods: Forty-eight teeth were randomly flattened according to the dentin depth: superficial dentin (SD) and deep dentin (DD). Subsequently, three adhesive systems were applied (n=8): an etch-and-rinse (Adper Single Bond 2 - SB), a “mild” two-step self-etching (Clearfil SE Bond - SE) and a one-step self-etching adhesive system (Futurabond – FB). Each specimen was restored with a composite resin and sectioned into 1.0-mm2 thick slabs. After 24 hours, resin-dentin sticks were submitted to tensile stress in a universal testing machine (0.5 mm/min). Data were submitted to two-way ANOVA and Tukey’s test at a level of 0.05%. Results: Superficial dentin showed the highest microtensile bond strength values, which differed statistically from those obtained in the deep dentin, irrespective of the adhesive system used. FB yielded the highest bond strength values, which were statistically similar to the bond strength values of SE, but statistically different from those obtained when the SB adhesive was used. Conclusions: Bond strength obtained in superficial dentin was significantly higher than in deep dentin, for all adhesive systems tested. Adhesion was affected by the different bonding strategies: the one-step, low pH, acetone-based self-etching adhesive promoted the higher bond strength values, which were statistically similar to those obtained with the two-step, water-based self-etching adhesive. PMID:20396440

  19. BOND STRENGTH AND MORPHOLOGY OF ENAMEL USING SELF-ETCHING ADHESIVE SYSTEMS WITH DIFFERENT ACIDITIES

    PubMed Central

    Moura, Sandra Kiss; Reis, Alessandra; Pelizzaro, Arlete; Dal-Bianco, Karen; Loguercio, Alessandro Dourado; Arana-Chavez, Victor Elias; Grande, Rosa Helena Miranda

    2009-01-01

    Objectives: To assess the bond strength and the morphology of enamel after application of self-etching adhesive systems with different acidities. The tested hypothesis was that the performance of the self-etching adhesive systems does not vary for the studied parameters. Material and methods: Composite resin (Filtek Z250) buildups were bonded to untreated (prophylaxis) and treated (burcut or SiC-paper) enamel surfaces of third molars after application of four self-etching and two etch-and-rinse adhesive systems (n=6/condition): Clearfil SE Bond (CSE); OptiBond Solo Plus Self-Etch (OP); AdheSe (AD); Tyrian Self Priming Etching (TY), Adper Scotchbond Multi-Purpose Plus (SBMP) and Adper Single Bond (SB). After storage in water (24 h/37°C), the bonded specimens were sectioned into sticks with 0.8 mm2 cross-sectional area and the microtensile bond strength was tested at a crosshead speed of 0.5 mm/min. The mean bond strength values (MPa) were subjected to two-way ANOVA and Tukey's test (α=0.05). The etching patterns of the adhesive systems were also observed with a scanning electron microscope. Results: The main factor adhesive system was statistically significant (p<0.05). The mean bond strength values (MPa) and standard deviations were: CSE (20.5±3.5), OP (11.3±2.3), AD (11.2±2.8), TY (11.1±3.0), SBMP (21.9±4.0) and SB (24.9±3.0). Different etching patterns were observed for the self-etching primers depending on the enamel treatment and the pH of the adhesive system. Conclusion: Although there is a tendency towards using adhesive systems with simplified application procedures, this may compromise the bonding performance of some systems to enamel, even when the prismless enamel is removed. PMID:19668991

  20. An Ultrasonic Technique to Determine the Residual Strength of Adhesive Bonds

    NASA Technical Reports Server (NTRS)

    Achenbach, J. D.; Tang, Z.

    1999-01-01

    In this work, ultrasonic techniques to nondestructively evaluate adhesive bond degradation have been studied. The key to the present approach is the introduction of an external factor which pulls the adhesive bond in the nonlinear range, simultaneously with the application of an ultrasonic technique. With the aid of an external static tensile loading, a superimposed longitudinal wave has.been used to obtain the slopes of the stress-strain curve of an adhesive bond at a series of load levels. The critical load, at which a reduction of the slope is detected by the superimposed longitudinal wave, is an indication of the onset of nonlinear behavior of the adhesive bond, and therefore of bond degradation. This approach has been applied to the detection of adhesive bond degradation induced by cyclic fatigue loading. Analogously to the longitudinal wave case, a superimposed shear wave has been used to obtain the effective shear modulus of adhesive layers at different shear load levels. The onset of the nonlinear behavior of an adhesive bond under shear loading has been detected by the use of a superimposed shear wave. Experiments show that a longitudinal wave can also detect the nonlinear behavior when an adhesive bond is subjected to shear loading. An optimal combination of ultrasonic testing and mechanical loading methods for the detection of degradation related nonlinear behavior of adhesive bonds has been discussed. For the purpose of a practical application, an ultrasonic technique that uses a temperature increase as an alternative to static loading has also been investigated. A general strain-temperature correspondence principle that relates a mechanical strain to a temperature has been presented. Explicit strain-temperature correspondence relations for both the tension and shear cases have been derived. An important parameter which quantifies the relation between the wave velocity and temperature has been defined. This parameter, which is indicative of adhesive

  1. Evaluation of enamel damages following orthodontic bracket debonding in fluorosed teeth bonded with adhesion promoter

    PubMed Central

    Baherimoghadam, Tahreh; Akbarian, Sahar; Rasouli, Reza; Naseri, Navid

    2016-01-01

    Objective: To evaluate shear bond strength (SBS) of the orthodontic brackets bonded to fluorosed and nonfluorosed teeth using Light Bond with and without adhesion promoters and compare their enamel damages following debonding. Materials and Methods: In this study, 30 fluorosed (Thylstrup and Fejerskov Index = 4–5) and 30 nonfluorosed teeth were randomly distributed between two subgroups according to the bonding materials: Group 1, fluorosed teeth bonded with Light Bond; Group 2, fluorosed teeth bonded with adhesion promoters and Light Bond; Group 3, nonfluorosed teeth bonded with Light Bond; Group 4, nonfluorosed bonded with adhesion promoters and Light Bond. After bonding, the SBS of the brackets was tested with a universal testing machine. Stereomicroscopic evaluation was performed by unbiased stereology in all teeth to determine the amount of adhesive remnants and the number and length of enamel cracks before bonding and after debonding. The data were analyzed using two-way analysis of variance, Kruskal–Wallis, Wilcoxon Signed Rank, and Mann–Whitney test. Results: While fluorosis reduced the SBS of orthodontic bracket (P = 0.017), Enhance Locus Ceruleus LC significantly increased the SBS of the orthodontic bracket in fluorosed and nonfluorosed teeth (P = 0.039). Significant increasing in the number and length of enamel crack after debonding was found in all four groups. There were no significant differences in the length of enamel crack increased after debonding among four groups (P = 0.768) while increasing in the number of enamel cracks after debonding was significantly different among the four groups (P = 0.023). Teeth in Group 2 showed the highest enamel damages among four groups following debonding. Conclusion: Adhesion promoters could improve the bond strength of orthodontic brackets, but conservative debonding methods for decreasing enamel damages would be necessary. PMID:27095895

  2. Comparison of shear bond strength of two self-etch primer/adhesive systems.

    PubMed

    Bishara, Samir E; Ajlouni, Raed; Laffoon, John F; Warren, John J

    2006-01-01

    Orthodontic brackets adhesive systems use three different agents, an enamel conditioner, a primer solution, and an adhesive resin. A unique characteristic of some new bonding systems is that they combine the conditioning, priming, and adhesive agents into a single application. The purpose of this study was to assess and compare the effects of using one-step and two-step self-etch primer/adhesive systems on the shear bond strength of orthodontic brackets. The brackets were bonded to extracted human molars according to one of two protocols. Group I (control): a two-step self-etch acidic primer/adhesive system was used, Transbond Plus was applied to the enamel surface as suggested by the manufacturer. The brackets were bonded with Transbond XT and light cured for 20 seconds. Group II: a one-step self-etch, self-adhesive resin cement system, Maxcem, was applied directly to the bracket. The self-etch primer/adhesive is made of two components that mix automatically during application. The brackets were then light cured for 20 seconds. The mean shear bond strength of the two-step acid-etch primer/adhesive was 5.9 +/- 2.7 Mpa and the mean for the one-step system was 3.1 +/- 1.7 MPa. The in vitro findings of this study indicated that the shear bond strengths (t = 3.79) of the two adhesive systems were significantly different (P = .001). One-step adhesive systems could potentially be advantageous for orthodontic purposes if their bond strength can be improved.

  3. Bond strength of a fluoride-releasing bracket adhesive. Experimental study.

    PubMed

    Graf, I; Breier, M; Huck, L; Schwarze, C W

    1999-01-01

    The aim of the study was to examine a new fluoride-releasing light-cured filling composite for its bonding and debonding qualities when used as a bracket adhesive. The material investigated was a hybrid composite containing a chemically modified fluoride apatite, which is claimed to provide the enamel with phosphate, calcium, and fluoride ions in the presence of an acid pH, recharging its resources of these ions through fluoride-containing toothpastes used in daily oral hygiene. Concurrently suitability as an enamel conditioner was tested in a new self-etching primer, which does not require water rinsing but is gently air dried instead. For comparison a conventional light-cure single-component adhesive was used together with 37% orthophosphoric acid. After application of the respective conditioners, mesh-backed metal brackets were bonded to 20 human premolars in each of the 2 adhesive groups and subjected to a shear test. Bond failure location was evaluated using the Adhesive Remnant Index (ARI). Average bond strength of the experimental bracket adhesive and the conventional etchant was 8.96 MPa. Conditioning with the self-etching primer led to a decrease of mean shear bond strength values to 6.55 MPa. Highest bond strength was determined in the control group (12.19 MPa). The bond strength results obtained in the shear test recommend the new material as a bracket adhesive to be used with orthophosphoric acid for etching.

  4. Principle and modelling of Transient Current Technique for interface traps characterization in monolithic pixel detectors obtained by CMOS-compatible wafer bonding

    NASA Astrophysics Data System (ADS)

    Bronuzzi, J.; Mapelli, A.; Moll, M.; Sallese, J. M.

    2016-08-01

    In the framework of monolithic silicon radiation detectors, a fabrication process based on a recently developed silicon wafer bonding technique at low temperature was proposed. Ideally, this new process would enable direct bonding of a read-out electronic chip wafer on a highly resistive silicon substrate wafer, which is expected to present many advantages since it would combine high performance IC's with high sensitive ultra-low doped bulk silicon detectors. But electrical properties of the bonded interface are critical for this kind of application since the mobile charges generated by radiation inside the bonded bulk are expected to transit through the interface in order to be collected by the read-out electronics. In this work, we propose to explore and develop a model for the so-called Transient Current Technique (TCT) to identify the presence of deep traps at the bonded interface. For this purpose, we consider a simple PIN diode reversely biased where the ultra-low doped active region of interest is set in full depletion. In a first step, Synopsys Sentaurus TCAD is used to evaluate the soundness of this technique for interface traps characterization such as it may happen in bonded interfaces. Next, an analytical model is developed in details to give a better insight into the physics behind the TCT for interface layers. Further, this can be used as a simple tool to evidence what are the relevant parameters influencing the TCT signal and to set the basis for preliminary characterizations.

  5. Dentin bond strength and degree of conversion evaluation of experimental self-etch adhesive systems

    PubMed Central

    Yazdi, Fatemeh-Maleknejad; Atai, Mohammad; Zeynali, Mahsa

    2015-01-01

    Background The aim of this study was to investigate the effect of different concentrations of 10-methacryloyloxydecyl dihydrogen phosphate (10-MDP) monomer in one-step self-etch experimental adhesives on dentinal microshear bond strength (µSBS), their degree of conversion and bonded micro structure. Material and Methods Composite resin cylinders (Clearfil AP-X) were bonded on human sound molar dentinal surfaces by using five experimental one-step self-etching adhesives (1-SEAs) containing 0% (E0), 5% (E5), 10% (E10), 15% (E15), 20% (E20) (by weight) 10-MDP monomer and Clearfil S3 Bond (CS3) as a control. After 24 hours, microshear bond strength was tested. The degree of conversion was also measured using Fourier transform infrared spectroscopy. Interfacial ultrastructure was observed under a scanning electron microscope in all the groups. Results A higher microshear bond strength was observed with adhesives containing 10% and 15% 10-MDP in comparison to study groups (P<.05). Clearfil S3 Bond and 10% MDP had a significantly greater degree of conversion than other groups (P<.05). Conclusions The amount of functional monomer in 1-SEAs influences both the bonding performance and degree of conversion; 10% 10-MDP showed the best combination of bond strength and degree of conversion. Key words:Self-etch adhesives, 10-MDP, bond strength, degree of conversion. PMID:26155340

  6. Evaluation of bonding behavior of silver-tin-zinc-indium alloy to adhesive luting cements.

    PubMed

    Shimizu, H; Kawaguchi, T; Takahashi, K; Takahashi, Y

    2010-12-01

    The bond strengths of a silver-tin-zinc-indium alloy used with adhesive luting cements were investigated. The metal surfaces were primed with two metal conditioners designed for noble metal alloys or base metal alloys, or prepared using a Rocatec tribochemical coating unit. Two adhesive luting cements (Super-Bond C&B and Panavia F 2.0) were applied. It can be concluded that airborne-particle abrasion with alumina was effective, but the effects on the bond durability of both the metal conditioners and the tribochemical silica coating method were not clear Such bonding behavior seems to be particular to this kind of silver-rich dental casting alloy.

  7. Adhesive Bonding of Titanium to Carbon-Carbon Composites for Heat Rejection Systems

    NASA Technical Reports Server (NTRS)

    Cerny, Jennifer; Morscher, Gregory

    2006-01-01

    High temperature adhesives with good thermal conductivity, mechanical performance, and long term durability are crucial for the assembly of heat rejection system components for space exploration missions. In the present study, commercially available adhesives were used to bond high conductivity carbon-carbon composites to titanium sheets. Bonded pieces were also exposed to high (530 to 600 Kelvin for 24 hours) and low (liquid nitrogen 77K for 15 minutes) temperatures to evaluate the integrity of the bonds. Results of the microstructural characterization and tensile shear strengths of bonded specimens will be reported. The effect of titanium surface roughness on the interface microstructure will also be discussed.

  8. Evaluation of a high-temperature adhesive for aerospace structural bonding

    SciTech Connect

    Falcone, A.; Pate, K.D.; Cao, T.Q.; Hsu, G.F.; Rogalski, M.E.

    1996-12-31

    High-temperature polymeric adhesives are required for many new aerospace applications, and such adhesives must possess both processability for bonding as well as durability for elevated temperature service. Evaluation of one candidate adhesive, based on phenylethynyl terminated imide oligomers (PETI) developed at the NASA Langley Research Center, for titanium bonding is described here and includes a discussion of processing, and physical and mechanical properties. Mechanical testing included single lap shear, wedge-crack extension, climbing drum peel, and flatwise tension for honeycomb sandwich. Thermal aging with and without fluids was conducted for up to 5,000 hours for preliminary short term durability testing. Excellent processability and mechanical performance was obtained from PETI adhesive films, including adhesive films produced with production equipment in production scale batches. Processability and elevated temperature durability indicate that PETI resinbased adhesives are promising candidates for demanding high-temperature aerospace applications.

  9. High performance InAs quantum dot lasers on silicon substrates by low temperature Pd-GaAs wafer bonding

    SciTech Connect

    Wang, Zihao; Preble, Stefan F.; Yao, Ruizhe; Lee, Chi-Sen; Guo, Wei; Lester, Luke F.

    2015-12-28

    InAs quantum dot (QD) laser heterostructures have been grown by molecular beam epitaxy system on GaAs substrates, and then transferred to silicon substrates by a low temperature (250 °C) Pd-mediated wafer bonding process. A low interfacial resistivity of only 0.2 Ω cm{sup 2} formed during the bonding process is characterized by the current-voltage measurements. The InAs QD lasers on Si exhibit comparable characteristics to state-of-the-art QD lasers on silicon substrates, where the threshold current density J{sub th} and differential quantum efficiency η{sub d} of 240 A/cm{sup 2} and 23.9%, respectively, at room temperature are obtained with laser bars of cavity length and waveguide ridge of 1.5 mm and 5 μm, respectively. The InAs QD lasers also show operation up to 100 °C with a threshold current density J{sub th} and differential quantum efficiency η{sub d} of 950 A/cm{sup 2} and 9.3%, respectively. The temperature coefficient T{sub 0} of 69 K from 60 to 100 °C is characterized from the temperature dependent J{sub th} measurements.

  10. Comparison of the shear bond strength of 2 self-etch primer/adhesive systems.

    PubMed

    Bishara, Samir E; Oonsombat, Charuphan; Ajlouni, Raed; Laffoon, John F

    2004-03-01

    Conventional adhesive systems use 3 different agents-an enamel conditioner, a primer solution, and an adhesive resin for bonding orthodontic brackets to enamel. A unique characteristic of some new bonding systems in operative dentistry is that they combine the conditioning and priming agents into a single application. Combining conditioning and priming saves time and should be more cost-effective to the clinician and indirectly to the patient. The purpose of this study was to assess and compare the effects of mix and no-mix self-etch primers/bonding systems on the shear bond strengths of orthodontic brackets. The brackets were bonded to extracted human molars according to the following protocols. In group I, a self-etch acidic primer/adhesive system, Transbond Plus (3M Unitek, Monrovia, Calif), was applied on the enamel surface as suggested by the manufacturer; it has 2 components that must be mixed before use. The brackets were then bonded with Transbond XT and light-cured for 20 seconds. In group II, a no-mix self-etch bracket adhesive system, Ideal 1 (GAG International, Islandia, NY), was applied to the teeth as suggested by the manufacturer. The self-etch primer has 1 component that does not need to be mixed before use. The brackets were then bonded with the adhesive and light-cured for 20 seconds. The in vitro findings indicated that the shear bond strength comparisons (t = 0.681) of the 2 adhesive systems were not significantly different (P =.501). The mean shear bond strength of the 2-component acid etch primer was 5.9 +/- 2.7 MPa, and the mean for the 1-component system was 6.6 +/- 3.2 MPa. The clinician should consider the bond strength and the ease of application of the various components of the bracket bonding systems available on the market.

  11. Tensile bond strength and SEM evaluation of caries-affected dentin using dentin adhesives.

    PubMed

    Nakajima, M; Sano, H; Burrow, M F; Tagami, J; Yoshiyama, M; Ebisu, S; Ciucchi, B; Russell, C M; Pashley, D H

    1995-10-01

    Tensile bond strength measurements are commonly used for the evaluation of dentin adhesive systems. Most tests are performed using extracted non-carious human or bovine dentin. However, the adhesion of resins to caries-affected dentin is still unclear. The objectives of this study were to test the hypothesis that bonding to caries-affected dentin is inferior to bonding to normal dentin, and that the quality of the hybrid layer plays a major role in creating good adhesion. We used a micro-tensile bond strength test to compare test bond strengths made to either caries-affected dentin or normal dentin, using three commercial adhesive systems (All Bond 2, Scotchbond Multi-Purpose, and Clearfil Liner Bond II). For scanning electron microscopy, the polished interfaces between the adhesive bond and dentin were subjected to brief exposure to 10% phosphoric acid solution and 5% sodium hypochlorite, so that the quality of the hybrid layers could be observed. Bonding to normal dentin with either All Bond 2 (26.9 +/- 8.8 MPa) or Clearfil Liner Bond II (29.5 +/- 10.9 MPa) showed tensile bond strengths higher than those to caries-affected dentin (13.0 +/- 3.6 MPa and 14.0 +/- 4.3 MPa, respectively). The tensile bond strengths obtained with Scotchbond Multi-Purpose were similar in normal and caries-affected dentin (20.3 +/- 5.5 MPa and 18.5 +/- 4.0 MPa, respectively). The hybrid layers created by All Bond 2 in normal dentin and by Clearfil Liner Bond II in normal or caries-affected dentin showed phosphoric acid and sodium hypochlorite resistance, whereas the hybrid layers created by All Bond 2 in caries-affected dentin and those created by Scotchbond Multi-Purpose to normal and caries-affected dentin showed partial susceptibility to the acid and sodium hypochlorite treatment. The results indicate that the strength of adhesion to dentin depends upon both the adhesive system used and the type of dentin. Moreover, the quality of the hybrid layer may not always contribute

  12. Bond strength of self-adhesive resin cements to composite submitted to different surface pretreatments

    PubMed Central

    dos Santos, Victor Hugo; Griza, Sandro; de Moraes, Rafael Ratto

    2014-01-01

    Objectives Extensively destroyed teeth are commonly restored with composite resin before cavity preparation for indirect restorations. The longevity of the restoration can be related to the proper bonding of the resin cement to the composite. This study aimed to evaluate the microshear bond strength of two self-adhesive resin cements to composite resin. Materials and Methods Composite discs were subject to one of six different surface pretreatments: none (control), 35% phosphoric acid etching for 30 seconds (PA), application of silane (silane), PA + silane, PA + adhesive, or PA + silane + adhesive (n = 6). A silicone mold containing a cylindrical orifice (1 mm2 diameter) was placed over the composite resin. RelyX Unicem (3M ESPE) or BisCem (Bisco Inc.) self-adhesive resin cement was inserted into the orifices and light-cured. Self-adhesive cement cylinders were submitted to shear loading. Data were analyzed by two-way ANOVA and Tukey's test (p < 0.05). Results Independent of the cement used, the PA + Silane + Adhesive group showed higher microshear bond strength than those of the PA and PA + Silane groups. There was no difference among the other treatments. Unicem presented higher bond strength than BisCem for all experimental conditions. Conclusions Pretreatments of the composite resin surface might have an effect on the bond strength of self-adhesive resin cements to this substrate. PMID:24516824

  13. Tensile Bond Strengths of Two Adhesives on Irradiated and Nonirradiated Human Dentin

    PubMed Central

    Bernard, Cécile; Abouelleil, Hazem; Gustin, Marie-Paule; Grosgogeat, Brigitte

    2015-01-01

    The aim of this study was to assess the effect of radiotherapy on bond efficiency of two different adhesive systems using tensile bond strength test. Twenty extracted teeth after radiotherapy and twenty nonirradiated extracted teeth were used. The irradiation was applied in vivo to a minimal dose of 50 Gy. The specimens of each group were randomly assigned to two subgroups to test two different adhesive systems. A three-step/etch-and-rinse adhesive system (Optibond FL) and a two-steps/self-etch adhesive system (Optibond XTR) were used. Composite buildups were performed with a nanohybrid composite (Herculite XTR). All specimens were submitted to thermocycling ageing (10000 cycles). The specimens were sectioned in 1 mm2 sticks. Microtensile bond strength tests were measured. Nonparametric statistical analyses were performed due to nonnormality of data. Optibond XTR on irradiated and nonirradiated teeth did not show any significant differences. However, Optibond FL bond strength was more effective on nonirradiated teeth than on irradiated teeth. Within the limitations of an in vitro study, it can be concluded that radiotherapy had a significant detrimental effect on bond strength to human dentin. However, it seems that adhesive choice could be adapted to the substrata. According to the present study, the two-steps/self-etch (Optibond XTR) adhesive system tested could be more effective on irradiated dentin compared to three-steps/etch-and-rinse adhesive system (Optibond FL). PMID:26783528

  14. Embedded proteins and sacrificial bonds provide the strong adhesive properties of gastroliths

    NASA Astrophysics Data System (ADS)

    Thormann, Esben; MizunoPresent Address: Nihon L'Oreal, Research; Innovation Center, 3-2-1 Sakado, Takatsu, Kawasaki, Kanagawa, Japan., Hiroyasu; Jansson, Kjell; Hedin, Niklas; Fernández, M. Soledad; Arias, José Luis; Rutland, Mark W.; PaiPresent Address: CenterFunctional Nanomaterials, Brookhaven National Laboratory, 735 Brookhaven Avenue, Upton, New York 11973., Ranjith Krishna; Bergström, Lennart

    2012-06-01

    The adhesive properties of gastroliths from a freshwater crayfish (Cherax quadricarinatus) were quantified by colloidal probe atomic force microscopy (AFM) between heavily demineralized gastrolith microparticles and gastrolith substrates of different composition. Combined AFM and transmission electron microscopy studies demonstrated that the sequential detachment and large adhesion energies that characterise the adhesive behaviour of a native gastrolith substrate are dominated by sacrificial bonds between chitin fibres and between chitin fibres and CaCO3. The sacrificial bonds were shown to be strongly related to the gastrolith proteins and when the majority of these proteins were removed by ethylenediaminetetraacetic acid (EDTA), the sequential detachment disappeared and the adhesive energy was reduced by more than two orders of magnitude.The adhesive properties of gastroliths from a freshwater crayfish (Cherax quadricarinatus) were quantified by colloidal probe atomic force microscopy (AFM) between heavily demineralized gastrolith microparticles and gastrolith substrates of different composition. Combined AFM and transmission electron microscopy studies demonstrated that the sequential detachment and large adhesion energies that characterise the adhesive behaviour of a native gastrolith substrate are dominated by sacrificial bonds between chitin fibres and between chitin fibres and CaCO3. The sacrificial bonds were shown to be strongly related to the gastrolith proteins and when the majority of these proteins were removed by ethylenediaminetetraacetic acid (EDTA), the sequential detachment disappeared and the adhesive energy was reduced by more than two orders of magnitude. Electronic supplementary information (ESI) available. See DOI: 10.1039/c2nr30536d

  15. Rapid adhesive bonding concepts for specimen and panel fabrication and field repair

    NASA Technical Reports Server (NTRS)

    Stein, B. A.; Hodges, W. T.

    1984-01-01

    The NASA Langley Research Center has developed bonding concepts for aerospace composite materials which employ induction heating to directly apply heat to the bond line and/or adherends without simultaneously heating the entire structure, supports, and fixtures of a bonding assembly. These methods have demonstrated bonding process time reductions of two to three orders of magnitude, by comparison with conventional press molding. Attention is presently given to rapid adhesive bonding for lap shear specimens for aerospace panel bonding or field repair, as well as for the field repair requirements of metallic and advanced polymeric matrix composite structures.

  16. Influence of previous acid etching on bond strength of universal adhesives to enamel and dentin.

    PubMed

    Torres, Carlos Rocha Gomes; Zanatta, Rayssa Ferreira; Silva, Tatiane Josefa; Huhtala, Maria Filomena Rocha Lima; Borges, Alessandra Bühler

    2017-01-01

    The objective of this study was to evaluate the effect of acid pretreatment on the bond strength of composite resin bonded to enamel and dentin with 2 different universal self-etching adhesives. The null hypothesis was that the acid treatment performed prior to adhesive application would not significantly change the bond strength to enamel or dentin for either universal adhesive tested. A sample of 112 bovine incisors were selected and embedded in acrylic resin. Half were ground until a flat enamel surface was obtained, and the other half were polished until a 6 × 6-mm area of dentin was exposed, resulting into 2 groups (n = 56). The enamel and dentin groups were divided into 2 subgroups according to the adhesive system applied: Futurabond U or Scotchbond Universal. Each of these subgroups was divided into 2 additional subgroups (n = 14); 1 subgroup received phosphoric acid pretreatment, and 1 subgroup did not. The bond strength was assessed with a microtensile test. Data from enamel and dentin specimens were analyzed separately using 1-way analysis of variance. The acid pretreatment did not significantly change the bond strength of the adhesives tested, either to enamel (P = 0.4161) or to dentin (P = 0.4857). The acid etching pretreatment did not affect the bond strength to dentin and enamel when the tested universal multipurpose adhesive systems were used.

  17. An electrical test method for quality detecting of wafer level eutectic bonding

    NASA Astrophysics Data System (ADS)

    Zhang, Lemin; Jiao, Binbin; Ku, Will; Tseng, Li-Tien; Kong, Yanmei; Chien, Yu-Hao; Yun, Shichang; Chen, Dapeng

    2017-01-01

    As the costs of packaging and testing account for a substantial portion of microelectromechanical system (MEMS) devices, an effective and convenient characterization method is urgent to be investigated to lower the cost. In this paper, an electrical test method was utilized, and the test key used for a four-probe current-voltage test was designed to monitor the quality of the AuSn eutectic bonding. The electrical test can directly detect whether or not voids existed in the bonding layer. The difference in alloy state, for example, the existence of the (Au, Ni) 3Sn2 phase confirmed by the scanning electron microscope and energy dispersive x-ray spectroscopy test, can also be reflected by resistivity variation. The electrical test can be implemented automatically and conveniently unlike other characterization methods. Therefore, it is suitable to be applied in quality inspection in industrial production.

  18. Shear Bond Strengths and Morphological Evaluation of Filled and Unfilled Adhesive Interfaces to Enamel and Dentine

    PubMed Central

    Mortazavi, Vajihesadat; Fathi, Mohammadhosein; Ataei, Ebrahim; Khodaeian, Niloufar; Askari, Navid

    2012-01-01

    In this laboratory study shear bond strengths of three filled and one unfilled adhesive systems to enamel and dentine were compared. Forty-eight extracted intact noncarious human mandibular molars were randomly assigned to two groups of 24 one for bonding to enamel and the other for bonding to dentine. Buccal and lingual surfaces of each tooth were randomly assigned for application of each one of filled (Prime & Bond NT (PBNT), Optibond Solo Plus (OBSP), and Clearfil SE Bond (CSEB)) and unfilled (Single Bond (SB)) adhesive systems (n = 12). A universal resin composite was placed into the translucent plastic cylinders (3 mm in diameter and 2 mm in length) and seated against the enamel and dentine surfaces and polymerized for 40 seconds. Shear bond strength was determined using a universal testing machine, and the results were statistically analyzed using two-way ANOVA, one-way ANOVA, t-test, and Tukey HSD post hoc test with a 5% level of significance.There were no statistically significant differences in bond strength between the adhesive systems in enamel, but CSEB and SB exhibited significantly higher and lower bond strength to dentine, respectively, than the other tested adhesive systems while there were no statistically significant differences between PBNT and OBSP. PMID:23209471

  19. Strength distributions of adhesive bonded and adhesive/rivet combined joints

    NASA Astrophysics Data System (ADS)

    Imanaka, Makoto; Haraga, Kosuke; Nishikawa, Tetsuya

    1992-11-01

    The tensile and shear strengths of adhesive and adhesive/rivet combined joints are statistically evaluated, and the probability of failure is calculated for these two types of joints. Attention is given to the effects of the adhesive/rivet combination on mean tensile shear strength and coefficient of variation. The adhesive joint's strength distribution was well approximated by Weibull or doubly-exponential distribution function; tensile shear strength is significantly improved by the combination with rivets.

  20. Bond strength evaluation in adhesive joints using NDE and DIC methods

    NASA Astrophysics Data System (ADS)

    Poudel, Anish

    Adhesive bonding of graphite epoxy composite laminates to itself or traditional metal alloys in modern aerospace and aircraft structural applications offers an excellent opportunity to use the most efficient and intelligent combination of materials available thus providing an attractive package for efficient structural designs. However, one of the major issues of adhesive bonding is the occasional formation of interfacial defects such as kissing or weak bonds in the bondline interface. Also, there are shortcomings of existing non-destructive evaluation (NDE) methods to non-destructively detect/characterize these interfacial defects and reliably predicting the bond shear strength. As a result, adhesive bonding technology is still not solely implemented in primary structures of an aircraft. Therefore, there is a greater demand for a novel NDE tool that can meet the existing aerospace requirement for adhesive bondline characterization. This research implemented a novel Acoustography ultrasonic imaging and digital image correlation (DIC) technique to detect and characterize interfacial defects in the bondline and determine bond shear strength in adhesively bonded composite-metal joints. Adhesively bonded Carbon Fiber Reinforced Plastic (CFRP) laminate and 2024-T3 Aluminum single lap shear panels subjected to various implanted kissing/weak bond defects were the primary focus of this study. Kissing/weak bonds were prepared by controlled surface contamination in the composite bonding surface and also by improperly mixing the adhesive constituent. SEM analyses were also conducted to understand the surface morphology of substrates and their interaction with the contaminants. Morphological changes were observed in the microscopic scale and the chemical analysis confirmed the stability of the contaminant at or very close to the interface. In addition, it was also demonstrated that contaminants migrated during the curing of the adhesive from CFRP substrate which caused a

  1. Bond strength of self-adhesive resin cements to tooth structure

    PubMed Central

    Hattar, Susan; Hatamleh, Muhanad M.; Sawair, Faleh; Al-Rabab’ah, Mohammad

    2015-01-01

    Objectives The aim of this study was to evaluate the strength of the bond between newly introduced self-adhesive resin cements and tooth structures (i.e., enamel and dentin). Methods Three self-adhesive cements (SmartCem2, RelyX Unicem, seT SDI) were tested. Cylindrical-shaped cement specimens (diameter, 3 mm; height, 3 mm) were bonded to enamel and dentin. Test specimens were incubated at 37 °C for 24 h. The shear bond strength (SBS) was tested in a Zwick Roll testing machine. Results were analyzed by one-way ANOVA and t-test. Statistically significant differences were defined at the α = 0.05 level. Bond failures were categorized as adhesive, cohesive, or mixed. Results The SBS values ranged from 3.76 to 6.81 MPa for cements bonded to enamel and from 4.48 to 5.94 MPa for cements bonded to dentin (p > 0.05 between surfaces). There were no statistically significant differences between the SBS values to enamel versus dentin for any given cement type. All cements exhibited adhesive failure at the resin/tooth interface. Conclusions Regardless of their clinical simplicity, the self-adhesive resin cements examined in this study exhibit limited bond performance to tooth structures; therefore, these cements must be used with caution. PMID:26082572

  2. Bond strength comparison of color-change adhesives for orthodontic bonding using a self-etching primer

    PubMed Central

    Ekhlassi, Sara; English, Jeryl D; Ontiveros, Joe C; Powers, John M; Bussa, Harry I; Frey, Gary N; Colville, Clark D; Ellis, Randy K

    2011-01-01

    Background The purpose of this study was to compare the shear bond strengths of two color-change adhesives with a commonly used conventional light-cure adhesive while using a self-etching primer, and to compare any changes in shear bond strengths over time. Methods One hundred and eighty extracted bovine incisors were randomly divided into nine groups of 20 teeth each. The teeth were prepared with a self-etching primer (Transbond™ Plus) Metal lower incisor brackets were bonded directly to each tooth with two different color-change adhesives (TransbondPlus and Grēngloo™) and a control (Transbond XT). The teeth were debonded at three different time points (15 minutes, 24 hours, 1 week) using an Instron at 1.0 mm/min. The teeth that were to be debonded at 24 hours and 1 week were stored in distilled water at 37°C to simulate the oral environment. The data were analyzed by two-way analysis of variance and with Fisher’s protected least-significant difference multiple comparisons test at the P < 0.05 level of significance. Adhesive remnant index (ARI) scores were calculated for each debonded tooth. Results Transbond Plus at 1 week had the highest mean shear bond strength (14.7 mPa). Grēngloo tested at 24 hours had the lowest mean shear bond strength (11.3 mPa). The mean shear bond strengths for the remaining seven groups had a range of 12–14.5 mPa. Grēngloo had >80% samples presenting with an ARI score of 1 at all times. Interestingly, both Transbond groups had ARI scores of 3 in more than 50% of their samples. Conclusion Time had no significant effect on the mean shear bond strength of Transbond XT, Grēngloo, or Transbond Plus adhesive. PMID:23674913

  3. Bonded amalgam restorations: using a glass-ionomer as an adhesive liner.

    PubMed

    Chen, R S; Liu, C C; Cheng, M R; Lin, C P

    2000-01-01

    Due to the lack of adhesiveness of amalgam to tooth structure, several adhesive cements have been utilized in bonded amalgam restorations. This study evaluated whether Fuji-II glass-ionomer cement is an appropriate adhesive liner in bonded amalgam restorations. Two adhesive composite luting cements (Amalgambond Plus and Panavia-21) and Copalite cavity liner were compared. The study was conducted in two phases. In the first part, we quantitatively assessed the tensile bond strengths as well as the failure modes of amalgam bonded to human dentin, using different adhesive liners. In each group, the flat dentin surface was treated with the assigned adhesive cement with a Teflon mold, followed by condensation of amalgam (Valiant PhD) onto it. Each group's mean tensile bond strengths were recorded and the statistical analysis by one way ANOVA showed no significant differences among groups (p > 0.05). Similar to the fracture patterns of the Amalgambond Plus and Panavia-21 groups, the failure mode of Fuji-II group was predominantly adhesive fracture. In the second part, the fracture strengths of amalgam restored teeth were measured using different adhesive liners. Standard MOD cavities were prepared in each tooth except for the intact tooth group. After treatment with the assigned adhesives or varnish, the cavities were restored with amalgam. Fracture strengths were then measured and the fractured interfaces examined using a scanning electron microscope. The fracture strengths of the intact tooth, Amalgambond Plus, Panavia-21 and Fuji-II groups were significantly higher than those of the Copalite and prepared cavity without restoration groups (p < 0.01). Accordingly, Fuji-II glass-ionomer cement, when used as an adhesive liner of amalgam restoration, may effectively reinforce the remaining tooth structure and, therefore, enhance the fracture resistance of the amalgam-restored teeth.

  4. Adhesive bonding of super-elastic titanium-nickel alloy castings with a phosphate metal conditioner and an acrylic adhesive.

    PubMed

    Matsumura, H; Tanoue, N; Yanagida, H; Atsuta, M; Koike, M; Yoneyama, T

    2003-06-01

    The purpose of the current study was to evaluate the bonding characteristics of super-elastic titanium-nickel (Ti-Ni) alloy castings. Disk specimens were cast from a Ti-Ni alloy (Ti-50.85Ni mol%) using an arc centrifugal casting machine. High-purity titanium and nickel specimens were also prepared as experimental references. The specimens were air-abraded with alumina, and bonded with an adhesive resin (Super-Bond C & B). A metal conditioner containing a phosphate monomer (Cesead II Opaque Primer) was also used for priming the specimens. Post-thermocycling average bond strengths (MPa) of the primed groups were 41.5 for Ti-Ni, 30.4 for Ti and 19.5 for Ni, whereas those of the unprimed groups were 21.6 for Ti, 19.3 for Ti-Ni and 9.3 for Ni. Application of the phosphate conditioner elevated the bond strengths of all alloy/metals (P < 0.05). X-ray fluorescence analysis revealed that nickel was attached to the debonded resin surface of the resin-to-nickel bonded specimen, indicating that corrosion of high-purity nickel occurred at the resin-nickel interface. Durable bonding to super-elastic Ti-Ni alloy castings can be achieved with a combination of a phosphate metal conditioner and a tri-n-butylborane-initiated adhesive resin.

  5. Bonding of adhesives to Er:YAG laser-treated dentin

    PubMed Central

    Koliniotou-Koumpia, Eugenia; Kouros, Pantelis; Zafiriadis, Lazaros; Koumpia, Effimia; Dionysopoulos, Pavlos; Karagiannis, Vassilis

    2012-01-01

    Objective: The shear bond strength of adhesives applied to dentin was investigated after irradiation with an erbium-doped yttrium aluminum garnet (Er:YAG) laser. Methods: Superficial and deep dentin specimens from human molars were treated either with carbide bur or an Er:YAG laser. Two etch and rinse adhesives (Single Bond and XP Bond) and two self-etch adhesives (Prompt L-Pop and Xeno III) were employed to bond the composite. Shear bond strength (SBS) was determined after storage in water for 24 h using a universal testing machine with a crosshead speed of 0.5 mm/min. Failure patterns and modes were analyzed and evaluated using a stereomicroscope. In addition, samples were processed for Scanning Electron Microscopy SEM evaluation. A linear mixed model was used, and pairwise comparisons were made using the Bonferroni test. Results: Results showed significant differences between the levels of dentin treatment (p=.01) in carbide bur-cut dentin and lased dentin, as well as significant interaction effects due to the depth of dentin and the bonding system used. The etch and rinse adhesives bonded less effectively with lased dentin than with carbide bur-cut dentin, while self-etch adhesives bonded equally well with lased and bur-cut superficial dentin but much less effectively with lased deep dentin than with bur-cut deep dentin. SEM revealed a predominantly adhesive failure mode in laser-ablated fractured specimens, while a mixed failure mode was apparent in the bur-cut fractured specimens. Conclusions: Cavities prepared by laser seem less receptive to adhesive procedures than conventional bur-cut cavities. PMID:22229003

  6. Adhesive bonding of a lithium disilicate ceramic material with resin-based luting agents.

    PubMed

    Nagai, T; Kawamoto, Y; Kakehashi, Y; Matsumura, H

    2005-08-01

    This study evaluates the bonding characteristics of a lithium disilicate-based ceramic material (IPS Empress 2). Two sizes of disk specimens of the material were made, and three groups of disk pairs were separately surface-prepared using three techniques; etching with phosphoric acid, etching with hydrofluoric acid, and air-abrasion with alumina. Each group was further divided into four sub-groups; group (i) was bonded with the Variolink II composite, (ii) was treated with the Monobond-S silane primer and bonded with the Variolink II composite, (iii) was bonded with the Super-Bond acrylic adhesive and (iv) was treated with the Porcelain Liner M silane primer and bonded with the Super-Bond acrylic adhesive. Shear bond strengths were determined before and after 100 000 thermocycles. Bond strength varied from 10.6 to 71.5 MPa before thermocycling, whereas post-thermocycling bond strength ranged from 0 to 61.2 MPa. Among the three surface preparations, hydrofluoric acid etching (HF) was most effective in enhancing bond strength of both luting materials, especially for unsilanized specimens. Application of the silane primer elevated bond strength of both luting agents regardless of surface preparation method. It can be concluded, for both luting agents, that durable bond to the Empress 2 ceramic material can be achieved through the combined application of HF and the proprietary silane primer.

  7. Casein Phosphopeptide-Amorphous Calcium Phosphate and Shear Bond Strength of Adhesives to Primary Teeth Enamel

    PubMed Central

    Farokh Gisovar, Elham; Hedayati, Nassim; Shadman, Niloofar; Shafiee, Leila

    2015-01-01

    Background: CPP-ACP (Phosphopeptide-Amorphous Calcium Phosphate) has an important role in caries prevention in pediatric patients. This study was done, because of the great use of CPP-ACP and the need for restoration for teeth treated with CPP-ACP as well as the importance of shear bond strength of adhesives in the success of restorations. Objectives: This study aimed to evaluate the effect of casein phosphopeptide-amorphous calcium phosphate (CPP-ACP) on shear bond strength of dental adhesives to enamel of primary teeth molars. Materials and Methods: This in vitro study was conducted on 180 extracted primary molars. They were randomly divided into 6 groups and each group was divided into 2 subgroups (treated with CPP-ACP and untreated). In subgroups with CPP-ACP, enamel was treated with CPP-ACP paste 1 h/d for 5 days. Types of adhesives that were evaluated in this study were Tetric N-Bond, AdheSE, AdheSE One F, single Bond 2, SE Bond, and Adper Prompt L-Pop. Shear bond strength was tested with a universal testing machine and mode of failure was evaluated under stereomicroscope. Data were analyzed by T test, 2-way analysis of variance (ANOVA), Tukey and Fisher exact test using SPSS18. P < 0.05 was considered as significance level. Results: Shear bond strengths of different adhesive systems to enamel of primary teeth treated and untreated with CPP-ACP showed no significant difference (P > 0.05). Mode of failure in all groups regardless of CPP-ACP administration was mainly adhesive type. Our results indicated that CPP-ACP did not affect shear bond strength of studied adhesives to primary teeth enamel. Conclusions: To have a successful and durable composite restoration, having a high strength bonding is essential. Considering the wide use of CPP-ACP in preventing tooth decay and the role of adhesive shear bond strength (SBS) in success of composite restoration, we conducted the present study to evaluate the effect of CPP-ACP on the SBS of adhesives to primary teeth

  8. Tensile Bond Strength of Self Adhesive Resin Cement After Various Surface Treatment of Enamel

    PubMed Central

    Sekhri, Sahil; Garg, Sandeep

    2016-01-01

    Introduction In self adhesive resin cements adhesion is achieved to dental surface without surface pre-treatment, and requires only single step application. This makes the luting procedure less technique-sensitive and decreases postoperative sensitivity. Aim The purpose of this study was to evaluate bond strength of self adhesive resin after surface treatment of enamel for bonding base metal alloy. Materials and Methods On the labial surface of 64 central incisor rectangular base metal block of dimension 6 mm length, 5mm width and 1 mm height was cemented with RelyX U200 and Maxcem Elite self adhesive cements with and without surface treatment of enamel. Surface treatment of enamel was application of etchant, one step bonding agent and both. Tensile bond strength of specimen was measured with universal testing machine at a cross head speed of 1mm/min. Results Least tensile bond strength (MPa) was in control group i.e. 1.33 (0.32) & 1.59 (0.299), Highest bond strength observed when enamel treated with both etchant and bonding agent i.e. 2.72 (0.43) & 2.97 (0.19) for Relyx U200 and Elite cement. When alone etchant and bonding agent were applied alone bond strength is 2.19 (0.18) & 2.24 (0.47) for Relyx U200, and 2.38 (0.27) 2.49 (0.16) for Max-cem elite. Mean bond strength was higher in case of Max-cem Elite as compared to RelyX U200 resin cement, although differences were non–significant (p > 0.05). Conclusion Surface treatment of enamel increases the bond strength of self adhesive resin cement. PMID:26894165

  9. The effect of cavity disinfectants on the micro-shear bond strength of dentin adhesives

    PubMed Central

    Elkassas, Dina Wafik; Fawzi, Elham Mostafa; El Zohairy, Ahmed

    2014-01-01

    Objectives: This study was carried out to examine the effect of application of four different disinfecting agents on the micro-shear bond strength (μ-SBS) of an etch-and-rinse and self-etch adhesive systems. Materials and Methods: One hundred flat dentin surfaces of human molars were produced by wet grinding the buccal surfaces. Specimens were randomly assigned to five groups according to the disinfectant used: Group I: Control (no disinfectant); Group II: 5.25% sodium hypochlorite based; Group III: 2% chlorhexidine based (Consepsis), Group IV: 0.1% benzalkoniumchloride based (Tubulicid red) and Group V: 3% doxycycline based (Biopure, MTAD). Specimens were bonded using either Adper Single Bond 2 or Clearfil S3 Bond, which were employed according to the manufacturer's instructions. Resin composite microcylinders were bonded using Tygon® tubes for μ-SBS testing. The modes of failure were noted after visual examination using a binocular stereomicroscope at ×25 magnification. Failures were classified as adhesive, or mixed. μ-SBS results were analyzed using two-way ANOVA followed by Tukey's post-hoc test. Results: Dentin disinfectants tested significantly negated the bonding of Adper Single bond 2 and the groups were ranked; Group I > Group V = Group IV > Group II = Group III, meanwhile they enhanced significantly the μ-SBS values upon using Clearfil S3 Bond and were ranked; Group II > Group III = Group IV = Group V > Group I. Most failures were adhesive with the Adper single bond adhesive system. Mixed modes of failure were evident with Clearfil S3 bond. Conclusions: The disinfectants tested should not be used with Adper Single Bond 2 when applied before the etching step, However they could be used safely prior to bonding with Clearfil S3 Bond. PMID:24966768

  10. A mussel-inspired adhesive with stronger bonding strength under underwater conditions than under dry conditions.

    PubMed

    Li, Ailei; Mu, Youbing; Jiang, Wei; Wan, Xiaobo

    2015-06-04

    A mussel-inspired adhesive based on a polyvinylpyrrolidone (PVP) backbone shows a much higher bonding strength under underwater/seawater conditions than under dry conditions. We reasoned that besides catechol moieties, the structure and properties of the backbone also play an important role in the realization of strong underwater bonding.

  11. Effect of interfacial chemical bonding and surface topography on adhesion in carbon fiber/epoxy composites

    SciTech Connect

    Drzal, L.T.; Sugiura, N.; Hook, D. |

    1994-12-31

    A series of PAN-based IM6 carbon fibers having varying amounts of surface treatment were, pretreated with compounds representing the constituents encountered in epoxy composites to pre-react any groups on the fiber surface before composite fabrication in order to determine the effect of chemical bonding on fiber-matrix adhesion. Chemical bonding was quantified using XPS. Chemical bonding between reactive groups in amine cured epoxy matrices and the surface groups present on IN46 carbon fibers as a result of commercial surface treatments has been detected although the absolute amount of chemical bonding is low (1-3%). It was found that reaction with monofunctional epoxy groups having hydrocarbon functionalities blocked the surface from further reaction and reduced the adhesion that could be attained to its lowest value. Prereaction with difunctional amines had little effect on adhesion when compared to normal composite fabrication procedures. Prereaction with difunctional epoxy groups did enhance adhesion levels over the level attained in normal composite fabrication methods. These results showed that chemical bonding between epoxy and the carbon fiber surface could increases the adhesion between fiber and matrix about 25% while between the amino group and the carbon fiber surface about 15%. Quantitative measurements of the fiber surface microtopography were made with scanning tunneling microscopy. An increase in roughness was detected with increasing surface treatment. It was concluded that surface roughness also accounted for a significant increase in fiber-matrix adhesion.

  12. Haemostatic agents on the shear bond strength of self-adhesive resin

    PubMed Central

    Anil, Akansha; Sekhar, Anand; Ginjupalli, Kishor

    2015-01-01

    Background Dentin surface contaminated with haemostatic agents can interfere with the bonding of self-adhesive resin cement. Therefore the purpose of this study was to evaluate the effect of various haemostatic agents such as Aluminium chloride, Ferric sulphate and Tannic acid on the shear bond strength of self-adhesive resin luting agent. Material and Methods The buccal surfaces of extracted premolars were flattened to expose the dentine. The teeth were then randomly divided into four groups. In Group I Aluminium Chloride was applied on the flattened dentinal surface, in Group II Ferric Sulphate was applied to exposed dentin surface, in Group III tannic acid was applied on to the dentinal surface, and the control group, i.e. Group IV was rinsed with saline. After the surface treatment, all the teeth were air dried. Then a predetermined dimension of RelyX™ U200 self-adhesive resin cement was bonded to the pretreated dentin surfaces. The samples were then stored under 370C in distilled water for 24 hours under 100 % humidity. Following this each sample was tested for shear bond strength with an Instron testing machine at a crosshead speed of 1mm/min. Results There was significant difference in the shear bond strength of control and tannic acid contaminated group (p<0.05), whereas there was no significant differences between the shear bond strength between control and aluminium chloride and ferric sulphate groups (p>0.05). Conclusions The usage of haemostatic agent can negatively affect the bond strength of self-adhesive resin cement (Rely X) on to the dentin surface. As per the study Tannic acid significantly weakened the bond between the self-adhesive resin and dentin. Key words:Aluminium chloride, Ferric sulphate, haemostatic agent, self-adhesive resin cement, shear bond strength, Tannic acid. PMID:26330930

  13. Nondestructive inspection in adhesive-bonded joint CFRP using pulsed phase thermography

    NASA Astrophysics Data System (ADS)

    Shin, P. H.; Webb, S. C.; Peters, K. J.

    2013-05-01

    Many forms of damages in fiber reinforcement polymer (FRP) composites are difficult to detect because they occurs in subsurface layers of the composites. One challenging need for inspection capabilities is in adhesively bonded joints between composite components, a common location of premature failure in aerospace structures. This paper investigates pulsed phase thermography (PPT) imaging of fatigue damage in these adhesively bonded joints. Simulated defects were created to calibrate parameters for fatigue loading conditions, PPT imaging parameters, and a damage sizing algorithm for carbon fiber reinforced polymer (CFRP) single lap joints. Afterwards, lap joint specimens were fabricated with varying quality of manufacturing. PPT imaging of the pristine specimens revealed defects such as air bubbles, adhesive thickness variations, and weak bonding surface between the laminate and adhesive. Next, fatigue testing was performed and acquired PPT imaging data identified fatigue induced damage prior to final failure cycles. After failure of each sample, those images were confirmed by visual inspections of failure surface.

  14. Adhesive-bonded double-lap joints. [analytical solutions for static load carrying capacity

    NASA Technical Reports Server (NTRS)

    Hart-Smith, L. J.

    1973-01-01

    Explicit analytical solutions are derived for the static load carrying capacity of double-lap adhesive-bonded joints. The analyses extend the elastic solution Volkersen and cover adhesive plasticity, adherend stiffness imbalance and thermal mismatch between the adherends. Both elastic-plastic and bi-elastic adhesive representations lead to the explicit result that the influence of the adhesive on the maximum potential bond strength is defined uniquely by the strain energy in shear per unit area of bond. Failures induced by peel stresses at the ends of the joint are examined. This failure mode is particularly important for composite adherends. The explicit solutions are sufficiently simple to be used for design purposes

  15. Bond strengths of three chemical adhesive cements adhered to a nickel-chromium alloy for direct bonded retainers.

    PubMed

    Atta, M O; Smith, B G; Brown, D

    1990-02-01

    Sandblasted surfaces of a beryllium-free, nickel-chromium alloy were bonded with one of three chemical adhesives. After either immersion in water for up to 6 months or thermal cycling between 5 degrees and 60 degrees C for 500 cycles, the bonded specimens were tested for both shear and tensile strength. The highest values of tensile and shear bond strengths were found with Panavia Ex material, and these values showed no significant changes after thermal cycling. For ABC cement and for Super-Bond C & B material, the strength of the bond was significantly improved with thermal cycling. However, immersion in water for 6 months caused a significant decrease in the strength of the bond of specimens adhered with ABC cement.

  16. Stresses in adhesively bonded joints: A closed form solution. [plate theory

    NASA Technical Reports Server (NTRS)

    Delale, F.; Erdogan, F.; Aydinoglu, M. N.

    1980-01-01

    The plane strain of adhesively bonded structures which consist of two different orthotropic adherents is considered. Assuming that the thicknesses of the adherends are constant and are small in relation to the lateral dimensions of the bonded region, the adherends are treated as plates. The transverse shear effects in the adherends and the in-plane normal strain in the adhesive are taken into account. The problem is reduced to a system of differential equations for the adhesive stresses which is solved in closed form. A single lap joint and a stiffened plate under various loading conditions are considered as examples. To verify the basic trend of the solutions obtained from the plate theory a sample problem is solved by using the finite element method and by treating the adherends and the adhesive as elastic continua. The plate theory not only predicts the correct trend for the adhesive stresses but also gives rather surprisingly accurate results.

  17. Preliminary evaluation of adhesion strength measurement devices for ceramic/titanium matrix composite bonds

    NASA Technical Reports Server (NTRS)

    Pohlchuck, Bobby; Zeller, Mary V.

    1992-01-01

    The adhesive bond between ceramic cement and a titanium matrix composite substrate to be used in the National Aerospace Plane program is evaluated. Two commercially available adhesion testers, the Sebastian Adherence Tester and the CSEM REVETEST Scratch Tester, are evaluated to determine their suitability for quantitatively measuring adhesion strength. Various thicknesses of cements are applied to several substrates, and bond strengths are determined with both testers. The Sabastian Adherence Tester has provided limited data due to an interference from the sample mounting procedure, and has been shown to be incapable of distinguishing adhesion strength from tensile and shear properties of the cement itself. The data from the scratch tester has been found to be difficult to interpret due to the porosity and hardness of the cement. Recommendations are proposed for a more reliable adhesion test method.

  18. New primers for adhesive bonding of aluminum alloys

    NASA Technical Reports Server (NTRS)

    Burrell, B. W.; Port, W. S.

    1971-01-01

    Synthetic polypeptide adhesive primers are effective, with high temperature epoxy resins, at temperatures from 100 deg to 300 deg C. Lap-shear failure loads and lap-shear strength of both primers are discussed.

  19. The effect of saliva decontamination procedures on dentin bond strength after universal adhesive curing

    PubMed Central

    Kim, Jayang; Hong, Sungok; Choi, Yoorina

    2015-01-01

    Objectives The purpose of this study was to investigate the effectiveness of multiple decontamination procedures for salivary contamination after curing of a universal adhesive on dentin bond strength according to its etch modes. Materials and Methods Forty-two extracted bovine incisors were trimmed by exposing the labial dentin surfaces and embedded in cylindrical molds. A universal adhesive (All-Bond Universal, Bisco) was used. The teeth were randomly divided into groups according to etch mode and decontamination procedure. The adhesive was applied according to the manufacturer's instructions for a given etch mode. With the exception of the control groups, the cured adhesive was contaminated with saliva for 20 sec. In the self-etch group, the teeth were divided into three groups: control, decontamination with rinsing and drying, and decontamination with rinsing, drying, and adhesive. In the etch-and-rinse group, the teeth were divided into four groups: control, decontamination with rinsing and drying, decontamination with rinsing, drying, and adhesive, and decontamination with rinsing, drying, re-etching, and reapplication of adhesive. A composite resin (Filtek Z350XT, 3M ESPE) was used for filling and was cured on the treated surfaces. Shear bond strength was measured, and failure modes were evaluated. The data were subjected to one-way analysis of variation and Tukey's HSD test. Results The etch-and-rinse subgroup that was decontaminated by rinse, drying, re-etching, and reapplication of adhesive showed a significantly higher bond strength. Conclusions When salivary contamination occurs after curing of the universal adhesive, additional etching improves the bond strength to dentin. PMID:26587416

  20. Ce:YIG/Silicon-on-Insulator waveguide optical isolator realized by adhesive bonding.

    PubMed

    Ghosh, S; Keyvavinia, S; Van Roy, W; Mizumoto, T; Roelkens, G; Baets, R

    2012-01-16

    A waveguide optical isolator realized by adhesive bonding of a garnet die, containing a Ce:YIG magneto-optic layer, on a silicon-on-insulator waveguide circuit is demonstrated. The die was bonded on top of an asymmetric Mach-Zehnder interferometer using a 100nm thick DVS-BCB adhesive bonding layer. A static magnetic field applied perpendicular to the light propagation direction results in a non-reciprocal phase shift for the fundamental quasi-TM mode in the hybrid waveguide geometry. A maximum optical isolation of 25 dB is obtained.

  1. The use of fluoroepoxy compounds as adhesives to bond fluoroplastics without any surface treatment

    NASA Technical Reports Server (NTRS)

    Lee, Sheng Yen

    1988-01-01

    The use of fluoroepoxy compounds as adhesives to bond fluoroplastics was investigated. Fluoroepoxy compounds with a F-content higher than 46 percent were able to bond a highly fluorinated plastic such as Teflon PTFE (76 percent F) to give a respectable bond strength without any surface treatment. The advantage of the fluoroepoxy adhesive vanished when applied to a less fluorinated plastic such as Tefzel which contains 55 percent fluorine. Among the curing agents explored, octafluorooctamethylenediamine showed its potential as a cocuring agent for improving both the viscosity of the compound and the flexibility of the cured product.

  2. System integration and demonstration of adhesive bonded high temperature aluminum alloys for aerospace structure, phase 2

    NASA Technical Reports Server (NTRS)

    Falcone, Anthony; Laakso, John H.

    1993-01-01

    Adhesive bonding materials and processes were evaluated for assembly of future high-temperature aluminum alloy structural components such as may be used in high-speed civil transport aircraft and space launch vehicles. A number of candidate high-temperature adhesives were selected and screening tests were conducted using single lap shear specimens. The selected adhesives were then used to bond sandwich (titanium core) test specimens, adhesive toughness test specimens, and isothermally aged lap shear specimens. Moderate-to-high lap shear strengths were obtained from bonded high-temperature aluminum and silicon carbide particulate-reinforced (SiC(sub p)) aluminum specimens. Shear strengths typically exceeded 3500 to 4000 lb/in(sup 2) and flatwise tensile strengths exceeded 750 lb/in(sup 2) even at elevated temperatures (300 F) using a bismaleimide adhesive. All faceskin-to-core bonds displayed excellent tear strength. The existing production phosphoric acid anodize surface preparation process developed at Boeing was used, and gave good performance with all of the aluminum and silicon carbide particulate-reinforced aluminum alloys investigated. The results of this program support using bonded assemblies of high-temperature aluminum components in applications where bonding is often used (e.g., secondary structures and tear stoppers).

  3. Effect of dentin location and long-term water storage on bonding effectiveness of dentin adhesives.

    PubMed

    De Munck, Jan; Mine, Atsushi; Vivan Cardoso, Marcio; De Almeida Neves, Aline; Van Landuyt, Kirsten L; Poitevin, André; Van Meerbeek, Bart

    2011-01-01

    Dentin is a variable substrate with properties that change considerable in a single surface. The purpose of this study was to evaluate the bonding effectiveness to these different dentin locations and evaluate these differences over time. After bonding procedures with five different adhesives, small micro-tensile bond strength (µTBS) beams were prepared and dichotomously divided in 'center' and 'periphery' dentin specimens. After 1 week, 3, 6 and 12 months of water storage the µTBS of specimens of each group was determined, enabling a paired study design. The bond strengths of both etch&rinse adhesives were insensitive to regional variability. For the two-step self-etch adhesives, a marked increase in bond strengths was observed with increasing amount of intertubular dentin. Regional variability did not affect the long-term bonding effectiveness for any of the adhesives tested. In conclusion, only for the mild self-etch adhesives, µTBS to 'periphery' dentin was higher than for the 'center' specimens.

  4. Effect of collagen removal on shear bond strength of two single-bottle adhesive systems.

    PubMed

    Saboia, V P; Rodrigues, A L; Pimenta, L A

    2000-01-01

    This study evaluated the effect of collagen removal on the shear bond strength for two single-bottle adhesive systems. The ultrastructure of the dentin after treatments and the dentin-resin interface were examined under SEM. The buccal and lingual surfaces of 80 extracted human third molars were ground to expose dentin. Teeth were randomly assigned to four groups and received the following treatments: Group 1(P&B 2.1), Prime & Bond 2.1 adhesive was applied according to the manufacturer's directions and Restorative Z100 composite resin was bonded to the dentin surface; Group 2 (P&B 2.1/NaOCl), the same procedures were followed as for Group 1 except that the surfaces were treated with 10% sodium hypochlorite (NaOCl) for one minute after acid conditioning; Group 3 (SB), Single Bond (3M) was applied according to the manufacturer's recommendations; Group 4 (SB/NaOCl), the same procedure was followed for Group 2, using Single Bond. The specimens were stored in humidity at 37 degrees C for 24 hours and tested in a shear mode at a crosshead speed of 0.5 mm/minute. The Kruskal-Wallis test and Multiple Comparisons were used for statistical analysis of the data. A one-minute exposure of dentin to 10% NaOCl following acid conditioning resulted in a significant increase of the dentin shear bond strength for Prime & Bond 2.1. The same treatment for Single Bond resulted in a significant reduction in bond strength. Groups 1 and 3 were not statistically different from each other. The presence of a collagen layer resulted in the formation of a hybrid layer and similar values of adhesion for both adhesive systems. The results may suggest that collagen removal improves the bond strength for this acetone-based adhesive system but several such systems would need to be investigated.

  5. Transient luminescence induced by electrical refilling of charge carrier traps of dislocation network at hydrophilically bonded Si wafers interface

    SciTech Connect

    Bondarenko, Anton; Vyvenko, Oleg

    2014-02-21

    Dislocation network (DN) at hydrophilically bonded Si wafers interface is placed in space charge region (SCR) of a Schottky diode at a depth of about 150 nm from Schottky electrode for simultaneous investigation of its electrical and luminescent properties. Our recently proposed pulsed traps refilling enhanced luminescence (Pulsed-TREL) technique based on the effect of transient luminescence induced by refilling of charge carrier traps with electrical pulses is further developed and used as a tool to establish DN energy levels responsible for D1 band of dislocation-related luminescence in Si (DRL). In present work we do theoretical analysis and simulation of traps refilling kinetics dependence on refilling pulse magnitude (Vp) in two levels model: shallow and deep. The influence of initial charge state of deep level on shallow level occupation-Vp dependence is discussed. Characteristic features predicted by simulations are used for Pulsed-TREL experimental results interpretation. We conclude that only shallow (∼0.1 eV from conduction and valence band) energetic levels in the band gap participate in D1 DRL.

  6. Impact of oxalate desensitizer combined with ethylene-diamine tetra acetic acid-conditioning on dentin bond strength of one-bottle adhesives during dry bonding

    PubMed Central

    Shafiei, Fereshteh; Doozandeh, Maryam

    2013-01-01

    Background: Elimination of water entrapment in hybrid layer during bonding procedure would increase bonding durability. Aims: This study evaluated the effect of oxalate desensitizer (OX) pretreatment on bond strength of three one-bottle adhesives to ethylene-diamine tetra acetic acid (EDTA)-conditioned dentin under dry bonding. Materials and Methods: Three adhesive systems, One-Step Plus (OS), Optibond Solo Plus (OP) and Adper Single Bond (SB) were bonded on dentin surfaces under four bonding conditions: (1) Wet-bonding on acid-etched dentin, (2) wet bonding on EDTA-conditioned dentin, (3) dry bonding on EDTA-conditioned dentin, (4) dry bonding associated with OX on the EDTA-conditioned dentin. After storage and thermo cycling, shear bond strength test was performed. Data were analyzed using two-way analysis of variance and Tukey tests. Results: Wet bonding with EDTA or acid etching showed similar bond strength for test adhesives. Dry bonding with EDTA significantly decreased the bond strength of OS, but it had no effect on the bonding of OP and SB. OX application in the forth bonding condition, in comparison with the third condition, had a negative effect on the bond strength of OP, but not influence on OS and SB. Conclusions: The use of an OX on EDTA-conditioned dentin compromised the bonding efficacy of OS and OP under dry bonding but compatible for SB. PMID:23833461

  7. Post-bleaching application of an antioxidant on dentin bond strength of three dental adhesives

    PubMed Central

    Khoroushi, Maryam; Saneie, Tahereh

    2012-01-01

    Background: Antioxidizing agents have recently been suggested to compensate decreased bond strength of resin materials to bleached tooth tissues. This study compared the shear bond strength (SBS) of three different adhesives on bleached dentin immediately after bleaching, bleached/delayed for 1 week, and bleached/applied antioxidizing agent. Materials and Methods: The dentinal surfaces of 132 intact extracted molars were prepared and divided into 12 groups. The following adhesives were investigated: Optibond FL (OFL) (three-step etch-and-rinse), Optibond Solo Plus (two-step etch-and-rinse), and Optibond all-in-one (OA) (one-step self-etch) (Kerr, Orange, USA). Unbleached dentin groups (groups 1-3) were prepared as negative controls (NC). The remainder surfaces (groups 4-12) were bleached with 20% Opalescent PF (Ultradent, USA). Specimens were bonded immediately after bleaching (groups 4-6), after 1 week (groups 7-9), or after using 10% sodium ascorbate (SA) gel (groups 10-12). Subsequent to bonding of composite resin, the samples were tested for SBS and analyzed using Kruskal-Wallis and Mann-Whitney tests (α=0.05). Results: Regarding control groups, OA showed the highest SBS among the studied adhesives (P<0.05). The SBS decreased for the adhesives after bleaching except for OFL. No statistically significant difference in SBS were noted when the SA and delayed bonding groups were compared with their similar NC groups (P>0.05) except the of delay bonding with OA. Conclusions: The findings suggest that bond strength of resin to bleached dentin may be affected with the adhesive system. Reduced SBS to bleached dentin can be amended by the use of SA as an antioxidizing agent. However, the amount of reversed bond strength subsequent to applying antioxidant might be related to the kind of dental adhesive. PMID:22363363

  8. The Effect of Epigallocatechin Gallate on the Dentin Bond Durability of Two Self-etch Adhesives

    PubMed Central

    Khamverdi, Zahra; Rezaei-Soufi, Loghman; Rostamzadeh, Tayebeh

    2015-01-01

    Statement of the Problem Self-etch adhesives can activate matrix metalloproteinase (MMP) which hydrolyzes organic matrix of demineralized dentin. Epigallocatechin gallate (EGCG), especially found in green tea, could inhibit the activation of MMP. Purpose The aim of this study was to evaluate the effect of adding Epigallocatechin gallate (EGCG) into two types of adhesives on dentin bond strength. Materials and Method In this experimental study, 64 extracted third molars were randomly divided into 16 groups. Clearfil SE Bond and Filtek Silorane System with 0 µM, 25µM, 50µM, and 100µM concentration of 95% EGCG were used for bonding. Following the bonding and fabrication of beams (1±0.1 mm2) and storage in distilled water, the specimens were subjected to thermal cycles. Microtensile bond strengths of 8 groups were examined after 24 hours and others were tested after 6 months. The fracture modes of specimens were evaluated by stereomicroscope and SEM. Data were analyzed by three-way ANOVA and t-test (α = 0.05). Results The results of the three- way ANOVA test showed that types of bonding, storage time and interactive effect of EGCG concentration and bonding influenced the bond strength of specimens significantly (p<0.05). The results of the t-test indicated that storage time only had significant effect on bond strength of Clearfil SE Bond with no EGCG (p= 0.017). The most common failure modes in Filtek Silorane System groups and Clearfil SE Bond groups were adhesive and mixed/cohesive, respectively. The results of SEM at different magnifications showed that most fractures have occurred in the hybrid layer. Conclusion Although adding 100 µM volume of EGCG to Clearfil SE Bond can preserve the dentin bond, incorporation of EGCG in the silorane system, especially in high concentrations, decreases the bond strength after 6 months. PMID:26046100

  9. Effect of indirect composite treatment microtensile bond strength of self-adhesive resin cements

    PubMed Central

    Escribano, Nuria; Baracco, Bruno; Romero, Martin; Ceballos, Laura

    2016-01-01

    Background No specific indications about the pre-treatment of indirect composite restorations is provided by the manufacturers of most self-adhesive resin cements. The potential effect of silane treatment to the bond strength of the complete tooth/indirect restoration complex is not available.The aim of this study was to determine the contribution of different surface treatments on microtensile bond strength of composite overlays to dentin using several self-adhesive resin cements and a total-etch one. Material and Methods Composite overlays were fabricated and bonding surfaces were airborne-particle abraded and randomly assigned to two different surface treatments: no treatment or silane application (RelyX Ceramic Primer) followed by an adhesive (Adper Scotchbond 1 XT). Composite overlays were luted to flat dentin surfaces using the following self-adhesive resin cements: RelyX Unicem, G-Cem, Speedcem, Maxcem Elite or Smartcem2, and the total-etch resin cement RelyX ARC. After 24 h, bonded specimens were cut into sticks 1 mm thick and stressed in tension until failure. Two-way ANOVA and SNK tests were applied at α=0.05. Results Bond strength values were significantly influenced by the resin cement used (p<0.001). However, composite surface treatment and the interaction between the resin cement applied and surface treatment did not significantly affect dentin bond strength (p>0.05). All self-adhesive resin cements showed lower bond strength values than the total-etch RelyX ARC. Among self-adhesive resin cements, RelyX Unicem and G-Cem attained statistically higher bond strength values. Smartcem2 and Maxcem Elite exhibited 80-90% of pre-test failures. Conclusions The silane and adhesive application after indirect resin composite sandblasting did not improve the bond strength of dentin-composite overlay complex. Selection of the resin cement seems to be a more relevant factor when bonding indirect composites to dentin than its surface treatment. Key words:Bond

  10. High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor

    PubMed Central

    Wang, Liying; Du, Xiaohui; Wang, Lingyun; Xu, Zhanhao; Zhang, Chenying; Gu, Dandan

    2017-01-01

    In order to achieve and maintain a high quality factor (high-Q) for the micro resonant pressure sensor, this paper presents a new wafer level package by adopting cross-layer anodic bonding technique of the glass/silicon/silica (GSS) stackable structure and integrated Ti getter. A double-layer structure similar to a silicon-on-insulator (SOI) wafer is formed after the resonant layer and the pressure-sensitive layer are bonded by silicon direct bonding (SDB). In order to form good bonding quality between the pressure-sensitive layer and the glass cap layer, the cross-layer anodic bonding technique is proposed for vacuum package by sputtering Aluminum (Al) on the combination wafer of the pressure-sensitive layer and the resonant layer to achieve electrical interconnection. The model and the bonding effect of this technique are discussed. In addition, in order to enhance the performance of titanium (Ti) getter, the prepared and activation parameters of Ti getter under different sputtering conditions are optimized and discussed. Based on the optimized results, the Ti getter (thickness of 300 nm to 500 nm) is also deposited on the inside of the glass groove by magnetron sputtering to maintain stable quality factor (Q). The Q test of the built testing system shows that the number of resonators with a Q value of more than 10,000 accounts for more than 73% of the total. With an interval of 1.5 years, the Q value of the samples remains almost constant. It proves the proposed cross-layer anodic bonding and getter technique can realize high-Q resonant structure for long-term stable operation. PMID:28300752

  11. Effects of silver nanoparticles on the bonding of three adhesive systems to fluorotic enamel.

    PubMed

    Torres-Méndez, Fernando; Martinez-Castañon, Gabriel-Alejandro; Torres-Gallegos, Iranzihuatl; Zavala-Alonso, Norma-Verónica; Patiño-Marin, Nuria; Niño-Martínez, Nereyda; Ruiz, Facundo

    2017-02-01

    The objective was to evaluate the effect of adding silver nanoparticles into three commercial adhesive systems (Excite™, Adper Prompt L-Pop™ and AdheSE™). Nanoparticles were prepared by a chemical method then mixed with the commercial adhesive systems. This was later applied to the fluorotic enamel, and then micro-tensile bond strength, contact angle measurements and scanning electron microscopy observations were conducted. The commercial adhesive systems achieved the lowest micro-tensile bond strength (Excite™: 11.0±2.1, Adper Prompt L-Pop™: 14.0±5.4 and AdheSE™: 16.0±3.0 MPa) with the highest adhesive failure mode related with the highest contact angle (46.0±0.6º, 30.0±0.5º and 28.0±0.4º respectively). The bond strength achieved in all the experimental adhesive systems (19.0±5.4, 20.0±4.0 and 19.0±3.5 MPa respectively) was statistically higher (p<0.05) than the control and showed the highest cohesive failures related to the lowest contact angle. Adding silver nanoparticles in order to decrease the contact angle improve the adhesive system wetting and its bond strength.

  12. Failure analysis of adhesively bonded composite joint: an elasto-plastic approach

    NASA Astrophysics Data System (ADS)

    Pradhan, S. C.; Kishore, N. N.; Iyengar, N. G. R.

    1993-09-01

    Joints are important load transferring members in large assembled structures. In joining similar and dissimilar materials, the use of adhesives offers many advantages when compared to other conventional methods. Most commonly used adhesives are the polymers, which exhibit nonlinear behavior. Finite element analysis with paired nodes along the crack path is employed to predict the crack initiation and growth leading to failure. The bond strength is predicted by investigating the possibility of propagation of a crack at the interface of adherend and adhesive. Paired nodes are opened in a sequence, modelling the crack growth. The adhesive is treated to be elasto-plastic for its response. Effect of the parameters such as, stacking sequences in composite adherend, crack growth locations, bond length, bond thicknesses and adhesive stiffnesses on the failure load is studied. The growth of plastic zone as the crack propagates is also examined. On the basis of this study optimal geometrical and material parameters are suggested. The elasto-plastic analysis predicts higher failure loads as compared to linear elastic analysis. The computed bond strength assuming elastic behavior for the adhesive shows satisfactory comparison with experimental results.

  13. Bonding and nondestructive evaluation of graphite/PEEK composite and titanium adherends with thermoplastic adhesives

    NASA Technical Reports Server (NTRS)

    Hodges, W. T.; Tyeryar, J. R.; Berry, M.

    1985-01-01

    Bonded single overlap shear specimens were fabricated from Graphite/PEEK (Polyetheretherketone) composite adherends and titanium adherends. Six advanced thermoplastic adhesives were used for the bonding. The specimens were bonded by an electromagnetic induction technique producing high heating rates and high-strength bonds in a few minutes. This contrasts with conventionally heated presses or autoclaves that take hours to process comparable quality bonds. The Graphite/PEEK composites were highly resistant to delamination during the testing. This allowed the specimen to fail exclusively through the bondline, even at very high shear loads. Nondestructive evaluation of bonded specimens was performed ultrasonically by energizing the entire thickness of the material through the bondline and measuring acoustic impedance parameters. Destructive testing confirmed the unique ultrasonic profiles of strong and weak bonds, establishing a standard for predicting relative bond strength in subsequent specimens.

  14. Bonding performance of universal adhesives to er,cr:YSGG laser-irradiated enamel.

    PubMed

    Ayar, Muhammet Kerim; Erdemir, Fatih

    2016-11-23

    Universal adhesives have been recently introduced for use as self-etch or etch-and-rinse adhesives depending on the dental substrate and clinical condition. However, their bonding effectiveness to laser-irradiated enamel is still not well-known. Thus, the aim of this study was to compare the shear bond strength (SBS) of universal adhesives (Single Bond Universal; Nova Compo-B Plus) applied to Er,Cr:YSGG laser-irradiated enamel with SBS of the same adhesives applied in self-etch and acid-etching modes, respectively. Crown segments of sixty bovine incisors were embedded into standardized acrylic blocks. Flattened enamel surfaces were prepared. Specimens were divided into six groups according to universal adhesives and application modes randomly (n = 10), as follows: Single Bond Universal/acid-etching mode; Nova Compo-B Plus/acid-etching mode; Single Bond Universal/self-etching mode; Nova Compo-B Plus/self-etching mode; and Single Bond Universal/Er,Cr:YSGG Laser-etching mode; Nova Compo-B Plus/Er,Cr:YSGG Laser-etching mode. After surface treatments, universal adhesives were applied onto surfaces. SBS was determined after storage in water for 24 h using a universal testing machine with a crosshead speed of 0.5 mm min(-1) . Failure modes were evaluated using a stereomicroscope. Data was analyzed using two-way of analyses of variances (ANOVA) (p = 0.05). Two-way ANOVA revealed that adhesive had no effect on SBS (p = 0.88), but application mode significantly influenced SBS (p = 0.00). Acid-etching significantly increased SBS, whereas there are no significant differences between self-etch mode and laser-etching for both adhesives. The bond strength of universal adhesives may depend on application mode. Acid etching may significantly increase bond strength, while laser etching may provide similar bond strength when compared to self-etch mode.

  15. Effects of adhesion promoter on orthodontic bonding in fluorosed teeth: A scanning electron microscopy study

    PubMed Central

    Gaur, Aditi; Maheshwari, Sandhya; Verma, Sanjeev Kumar; Tariq, Mohd.

    2016-01-01

    Introduction: The objectives of the present study were to elucidate the effects of fluorosis in orthodontic bonding and to evaluate the efficiency of an adhesion promoter (Assure Universal Bonding Resin) in bonding to fluorosed teeth. Materials and Methods: Extracted premolars were divided into two groups on the basis of Thylstrup and Fejerskov Index. Ten samples from each group were etched and evaluated for etching patterns using scanning electron microscope (SEM). The remaining samples were subdivided into four groups of 20 each on the basis of adhesives used: IA, IIA - Transbond XT and IB, IIB - Transbond XT plus Assure Universal Bonding Resin. Shear bond strength (SBS) was measured after 24 h using the universal testing machine. Adhesive remnant index (ARI) scores were recorded using SEM. Statistical analysis was conducted using a two-way analysis of variance, and Tukey's post hoc test was performed on SBS and ARI scores. Results: Similar etching patterns were observed in both fluorosed and nonfluorosed teeth. No significant differences were found in the SBS values observed in both groups (8.66 ± 3.19 vs. 8.53 ± 3.44, P = 1.000). Increase in SBS was observed when Assure Universal Bonding Resin was used. Higher ARI scores were observed when adhesion promoter was used for bonding. Conclusions: Mild-moderately fluorosed teeth etch in a manner similar to the nonfluorosed teeth. Similar bond strengths were achieved in fluorosed and nonfluorosed teeth when conventional composite was used. Use of adhesion promoter increases the bond strengths in both groups of teeth. PMID:27556020

  16. Monolithic Series-Interconnected GaInAsSb/AlGaAsSb Thermophotovoltaic Devices Wafer Bonded to GaAs

    NASA Astrophysics Data System (ADS)

    Wang, C. A.; Huang, R. K.; Connors, M. K.; Shiau, D. A.; Murphy, P. G.; O'Brien, P. W.; Anderson, A. C.; Donetsky, D.; Anikeev, S.; Belenky, G.; Luryi, S.; Nichols, G.

    2004-11-01

    GaInAsSb/AlGaAsSb/GaSb epitaxial layers were wafer bonded to semi-insulating GaAs wafers for monolithic series interconnection of thermophotovoltaic (TPV) devices. SiOx/Ti/Au was used as a bonding layer to provide electrical isolation and to serve as an internal back-surface reflector (BSR). The minority-carrier lifetime in WB BSR structures is more than two times longer than that of control structures without a BSR. WB GaInAsSb/AlGaAsSb TPV cells were fabricated and monolithically interconnected in series. These cells exhibit nearly linear voltage building. At a short-circuit current density of 0.4 A/cm2, Voc of a single TPV cell is 0.2 V, compared to 0.37 and 1.8 V for 2- and 10-junction series-interconnected TPV cells, respectively.

  17. Adhesive dentistry: the development of immediate dentin sealing/selective etching bonding technique.

    PubMed

    Helvey, Gregg A

    2011-01-01

    A major objective of dental research over the past 60 years has been a search for the "dream-team" of dental adhesives. In fact, a recent Medline search produced more than 6,500 papers on dentin bonding and its techniques. Adhesive systems are designed to retain direct and indirect restorations, minimize leakage at the margin, and be simple to place while producing consistent results. The development of materials and techniques has an interesting history; some have recirculated from the past and are being used in some form today. Buonocore used the etchant phosphoric acid at the beginning of the adhesive revolution. Though not accepted for many years it eventually became the "gold standard" for etching enamel. Technique sensitivity moved it out of favor and, through the development of self-etching acidic primers, was eliminated from some adhesive systems. Although these primers may have successfully addressed postoperative sensitivity, adhesion was compromised. The bond strength of these systems has now been improved with the incorporation of phosphoric acid-etch to condition enamel prior to using the adhesive system. This article will trace the history of adhesive techniques and materials and how it has led to the creation of a new technique that combines two bonding methods.

  18. Thermo-oxidative and hydrothermal ageing of epoxy-dicyandiamide adhesive in bonded stainless steel joints

    NASA Astrophysics Data System (ADS)

    Gaukler, J. Ch; Fehling, P.; Possart, W.

    2009-09-01

    The ageing behaviour of stainless steel joints bonded with hot-curing adhesives is crucial for their reliability and durability in engineering applications. In industry, accelerated artificial ageing regimes are combined with short-term mechanical tests to simulate the in-service long-term behaviour and to predict the life time of the adhesive joints. With such a focus on mechanical bond strength, chemical changes in the adhesive are widely disregarded. Hence, neither the very causes for the decreasing performance of the joint nor their relevance for application can be revealed. Reasoning this study, lap shear samples of the stainless steel alloy 1.4376 are bonded with an epoxy-dicyandiamide adhesive and aged artificially under moderate thermo-oxidative (60 °C, dried air) or hydrothermal (60 °C, distilled water) condition. After testing (shear stress-strain analysis), chemical modifications of this adhesive due to ageing are detected on the fracture faces by μ-ATR-FTIR-spectroscopy as function of ageing time and position in the adhesive joint. The results attest high thermo-oxidative stability to these adhesive joints. For hydrothermal ageing, permeating water deteriorates the EP network from the edges towards the centre of the joint via hydrolysis of imine groups to ammonia, amine species and carbonyls.

  19. The Evaluation of High Temperature Adhesive Bonding Processes for Rocket Engine Combustion Chamber Applications

    NASA Technical Reports Server (NTRS)

    McCray, Daniel; Smith, Jeffrey; Rice, Brian; Blohowiak, Kay; Anderson, Robert; Shin, E. Eugene; McCorkle, Linda; Sutter, James

    2003-01-01

    NASA Glenn Research Center is currently evaluating the possibility of using high- temperature polymer matrix composites to reinforce the combustion chamber of a rocket engine. One potential design utilizes a honeycomb structure composed of a PMR-II- 50/M40J 4HS composite facesheet and titanium honeycomb core to reinforce a stainless steel shell. In order to properly fabricate this structure, adhesive bond PMR-II-50 composite. Proper prebond surface preparation is critical in order to obtain an acceptable adhesive bond. Improperly treated surfaces will exhibit decreased bond strength and durability, especially in metallic bonds where interface are susceptible to degradation due to heat and moisture. Most treatments for titanium and stainless steel alloys require the use of strong chemicals to etch and clean the surface. This processes are difficult to perform due to limited processing facilities as well as safety and environmental risks and they do not consistently yield optimum bond durability. Boeing Phantom Works previously developed sol-gel surface preparations for titanium alloys using a PETI-5 based polyimide adhesive. In support of part of NASA Glenn Research Center, UDRI and Boeing Phantom Works evaluated variations of this high temperature sol-gel surface preparation, primer type, and primer cure conditions on the adhesion performance of titanium and stainless steel using Cytec FM 680-1 polyimide adhesive. It was also found that a modified cure cycle of the FM 680-1 adhesive, i.e., 4 hrs at 370 F in vacuum + post cure, significantly increased the adhesion strength compared to the manufacturer's suggested cure cycle. In addition, the surface preparation of the PMR-II-50 composite was evaluated in terms of surface cleanness and roughness. This presentation will discuss the results of strength and durability testing conducted on titanium, stainless steel, and PMR-II-50 composite adherends to evaluate possible bonding processes.

  20. Nondestructive inspection of CFRP adhesively bonded joints using embedded FBG sensors

    NASA Astrophysics Data System (ADS)

    Webb, S.; Shin, P.; Peters, K.; Selfridge, R.; Schultz, S.

    2013-05-01

    One challenging need for inspection capabilities is in adhesively bonded joints between composite components, a common location of premature failure in aerospace structures. In this work we demonstrate that dynamic, full spectral scanning of FBG sensors embedded in the adhesive bond can identify changes in bond quality through the measurement of non-linear dynamics of the joint. Eighteen lap joint specimens were fabricated with varying manufacturing quality. Ten samples also included fiber Bragg grating (FBG) sensors embedded in the adhesive bond for real-time inspection during a simulated flight condition of these single-lap joints. Prior to testing, pulse phase thermography imaging of the pristine specimens revealed defects such as air bubbles, adhesive thickness variations, and weak bonding surface between the laminate and adhesive. The lap joint specimens were then subjected to fatigue loading, with regular interrogation of the FBG sensors at selected load cycle intervals. The FBG data was collected during vibration loading of the lap joint to represent an in-flight environment. Changes in the lap joint dynamic response, including the transition to non-linear responses, were measured from both the full-spectral and peak wavelength FBG data. These changes were correlated to initial manufacturing defects and the progression of fatigue-induced damage independently measured with pulse phase imaging and visual inspections of the failure surfaces.

  1. A glass microfluidic chip adhesive bonding method at room temperature

    NASA Astrophysics Data System (ADS)

    Pan, Yu-Jen; Yang, Ruey-Jen

    2006-12-01

    This paper presents a novel method using UV epoxy resin for the bonding of glass blanks and patterned plates at room temperature. There is no need to use a high-temperature thermal fusion process and therefore avoid damaging temperature-sensitive metals in a microchip. The proposed technique has the further advantage that the sealed glass blanks and patterned plates can be separated by the application of adequate heat. In this way, the microchip can be opened, the fouling microchannels may be easily cleaned-up and the plates then re-bonded to recycle the microchip. The proposed sealing method is used to bond a microfluidic device, and the bonding strength is then investigated in a series of chemical resistance tests conducted in various chemicals. Leakage of solution was evaluated in a microfluidic chip using pressure testing to 1.792 × 102 kPa (26 psi), and the microchannel had no observable leak. Electrical leakage between channels was tested by comparing the resistances of two bonding methods, and the result shows no significant electrical leakage. The performance of the device obtained from the proposed bonding method is compared with that of the thermal fusion bonding technique for an identical microfluidic device. It is found that identical results are obtained under the same operating conditions. The proposed method provides a simple, quick and inexpensive method for sealing glass microfluidic chips.

  2. Bond Strength of One-Step Adhesives under Different Substrate Moisture Conditions

    PubMed Central

    Faria-e-Silva, André Luís; Fabião, Mayra Melo; Sfalcin, Ravana Angelini; de Souza Meneses, Murilo; Santos-Filho, Paulo César Freitas; Soares, Paulo Vinícius; Martins, Luís Roberto

    2009-01-01

    Objectives The aim of this study was to evaluate the bond strength of one-step adhesive systems to dry or moist dental substrate. Methods Thirty human third molars were sectioned into two halves, in the mesio-distal direction, parallel to the long axis of the tooth. Each half was embedded in a polystyrene resin cylinder so that the buccal/lingual surface remained exposed. This exposed surface was abraded to obtain both flat exposed enamel and dentin. The samples were randomly allocated according to the adhesive system (Xeno III, Adper Prompt and iBond) and moisture condition (dry and moist). The substrates were air-dried for 30 s for dry condition, while the moist substrates were re-wet with 2.5 μl of distilled water after drying. After the adhesive procedures, two resin composite cylinders were build-up on dentin and enamel substrates, totaling four per sample. A shear load was applied to the samples at a crosshead speed of 0.5 mm/min until failure. Data were statistically analyzed by three-way ANOVA and the Tukey test (α=0.05). Results The evaluated one-step adhesives showed higher bond strength to dentin than enamel. The iBond presented better bond performance to moist substrate and Xeno III to dry substrate. The moisture condition did not interfere in the performance of Adper Prompt. The Xeno III and iBond presented higher bond strength than the other adhesives to both dry and moist substrates. Conclusions The moisture condition of substrate interfered in the performance of one-step self-etching adhesives and the best moisture condition was material dependent. PMID:19826601

  3. Adhesive bond strength evaluation in composite materials by laser-generated high amplitude ultrasound

    NASA Astrophysics Data System (ADS)

    Perton, M.; Blouin, A.; Monchalin, J.-P.

    2011-01-01

    Adhesive bonding of composites laminates is highly efficient but is not used for joining primary aircraft structures, since there is presently no nondestructive inspection technique to ensure the quality of the bond. We are developing a technique based on the propagation of high amplitude ultrasonic waves to evaluate the adhesive bond strength. Large amplitude compression waves are generated by a short pulse powerful laser under water confinement and are converted after reflection by the assembly back surface into tensile waves. The resulting tensile stresses can cause a delamination inside the laminates or at the bond interfaces. The adhesion strength is evaluated by increasing the laser pulse energy until disbond. A good bond is unaffected by a certain level of stress whereas a weaker one is damaged. The method is shown completely non invasive throughout the whole composite assembly. The sample back surface velocity is measured by an optical interferometer and used to estimate stress history inside the sample. The depth and size of the disbonds are revealed by a post-test inspection by the well established laser-ultrasonic technique. Experimental results show that the proposed method is able to differentiate weak bond from strong bonds and to estimate quantitatively their bond strength.

  4. The Effect of Peel Stress on the Strength of Adhesively Bonded Joints

    SciTech Connect

    Guess, T.R.; Metzinger, K.E.

    1998-10-14

    Composite wind turbine blades are often attached to a metallic structure with an adhesive bond. The objective of this investigation is to determine which parameters affect the durability of these adhesively bonded joints. The composite-to-steel joint considered in this study typically fails when the adhesive debonds from the steel adherend. Previously, this joint was monotonically loaded in either compression or tension. Compressive and tensile axial loads of the same magnitude produce adhesive stresses with very similar magnitudes but opposite signs. (For the joint considered, tensile loads produce compressive peeh stresses in the adhesive at the location where debonding initiates.) The tensile specimens failed at much higher loads, establishing that the sign of the adhesive peel stresses strongly influences the single-cycle strength of these joints. Building on this earlier work, this study demonstrates that the adhesive peel stresses are also critical for fatigue loading. The results of low-cycle (axial) and high- cycle (bending) fatigue tests are presented. To complement the test results, finite element analyses demonstrate the localized nature of the peel stresses that develop in the adhesive. In addition, these analyses are used to investigate some of the causes of these peel stresses.

  5. Analysis of interfacial structure and bond strength of self-etch adhesive systems

    PubMed Central

    Pinzon, Lilliam M; Watanabe, Larry G; Reis, Andre F; Powers, John M; Marshall, Sally J; Marshall, Grayson W

    2013-01-01

    Purpose To determine the bond strength, nanoleakage and interfacial morphology of four self-etch adhesives bonded to superficial dentin. Methods Micro-tensile (MT, n=15) and single plane shear (SP, n=8) bond tests were performed using human dentin polished through 320-grit SiC paper. Clearfil Protect Bond (PB), Clearfil S3 Bond (S3), Prompt L-Pop (PLP) and G-BOND (GB) were used according to manufacturers’ instructions. Composite was applied as cylinders with a thickness of 4 mm with a 1-mm diameter and stored in water at 37° C for 24 hours. Specimens were debonded with a testing machine at a cross-head speed of 1 mm/min. Means and standard deviations of bond strength were calculated. Data were analyzed using ANOVA. Fisher’s PLSD intervals were calculated at the 0.05 level of significance. Failure modes were determined at 100X. The hybrid layer was revealed by treatment with 5N HCl/5% NaOCl or fractured perpendicular to the interface and sputter coated with gold. Specimens were viewed at 1000X, 2500X, and 5000X in a field emission SEM at 15 kV. Teeth (n=2) sectioned into 0.9-mm thick slabs were immersed in ammoniacal silver nitrate solution for 24 hours, rinsed and immersed in photo-developing solution for 8h. Specimens were sectioned (90-nm thick) and observed under TEM. Results Means ranged from 25.0 to 73.1 MPa for MT and from 15.5 to 56.4 MPa for SP. MT values were greater than SP, but were highly correlated (R2 = 0.99, p= 0.003) and provided the same order for the systems studied. Fisher’s PLSD intervals (p<0.05) for bond strength techniques and adhesives results were 1.7 and 2.3 MPa, respectively. Failures sites were mixed. TEM showed that hybrid layers were ~0.5 µm for PB, GB and S3 and ~5 µm for PLP. SEM showed morphologic differences among adhesives. Silver nitrate deposits were observed within interfaces for all adhesive systems. Clinical significance Simplification of application procedures appears to induce loss of adhesion capabilities. In this

  6. Silver Adhesive Layer for Enhanced Pressure-Free Bonding Using Copper Nanoparticles

    NASA Astrophysics Data System (ADS)

    Satoh, Toshikazu; Ishizaki, Toshitaka; Akedo, Kunio

    2017-02-01

    Pressure-free Cu nanoparticle bonding between two Cu plates with an Ag adhesive layer was examined. Insertion of the Ag adhesive layer considerably enhanced the bonding strength at firing temperatures between 523 K and 673 K. The bonding strength generally increased with the firing temperature. The strength enhancement of the Ag adhesive layer was observed even for a very thin (3 nm) Ag layer, and there was no obvious dependence of the thickness of the Ag layer on the bonding strength for Ag layers of thickness up to 200 nm. Ag atoms from the adhesive layer diffused away to the bonding layer with an increase in the firing temperature. The elemental mapping images showed that the Ag had two morphologies: thin Ag layers existing between particulate Cu grains, and fine Ag particles dispersed in coarse Cu crystals. The microstructure near the interface between the Cu nanoparticle bonding layer and Cu plate used as the substrate suggests that the enhancement effect of the Ag layer originates in the active migration of the Ag layer itself.

  7. Effect of Self-adhesive Resin Cement and Tribochemical Treatment on Bond Strength to Zirconia

    PubMed Central

    Lin, Jie; Shinya, Akikazu; Gomi, Harunori; Shinya, Akiyoshi

    2010-01-01

    Aim To evaluate the interactive effects of different self-adhesive resin cements and tribochemical treatment on bond strength to zirconia. Methodology The following self-adhesive resin cements for bonding two zirconia blocks were evaluated: Maxcem (MA), Smartcem (SM), Rely X Unicem Aplicap (UN), Breeze (BR), Biscem (BI), Set (SE), and Clearfil SA luting (CL). The specimens were grouped according to conditioning as follows: Group 1, polishing with 600 grit polishing paper; Group 2, silica coating with 110 µm Al2O3 particles which modified with silica; and, Group 3, tribochemical treatment - silica coating + silanization. Specimens were stored in distilled water at 37°C for 24 hours before testing shear bond strength. Results Silica coating and tribochemical treatment significantly increased the bond strength of the MA, UN, BR, BI, SE and CL to zirconia compared to #600 polishing. For both #600 polished and silica coating treatments, MDP-containing self-adhesive resin cement CL had the highest bond strengths to zirconia. Conclusion Applying silica coating and tribochemical treatment improved the bond strength of self-adhesive resin cement to zirconia, especially for CL. PMID:20690416

  8. A randomized clinical trial evaluating the success rate of ethanol wet bonding technique and two adhesives

    PubMed Central

    Mortazavi, Vajihesadat; Samimi, Pouran; Rafizadeh, Mojgan; Kazemi, Shantia

    2012-01-01

    Background: Composite resin restorations may have a short lifespan due to the degradation of resin–dentin interface. Ethanol wet bonding technique may extend the longevity of resin–dentin bond. The purpose of this one year randomized clinical trial was to compare clinical performance of two adhesives with ethanol wet bonding technique. Materials and Methods: This randomized clinical trial was performed on 36 non-carious cervical lesions in 12 patients restored with composite resin using one of the following approaches: 1. OptiBond FL (Kerr, USA); 2. Clearfil SE Bond (Kuraray, Japan) with enamel etching and 3. Ethanol wet bonding technique with the part of adhesive of OptiBond FL. The clinical success rate was assessed after 24 h, 6, 9 and 12 months according to the United States Public Health Service (USPHS) criteria: Marginal discoloration, marginal defect, retention rate, caries occurrence, and postoperative sensitivity. The tooth vitality was also assessed. Results: The retention rate was 100% at baseline and at 6 months follow up for all types of bonding protocols and was 91.67% at 9 and 12 months follow up for ethanol wet bonding group. None of the restorations in three groups showed marginal defects, marginal discoloration or caries occurrence and were vital after 12 months. There was no statistically significant difference between three groups after 12 months follow up (p value = 0.358). Conclusions: Composite restorations placed using ethanol wet bonding technique presented equal performance to the other groups. PMID:23559924

  9. Loss effects on adhesively-bonded multilayer ultrasonic transducers by self-heating.

    PubMed

    Wu, Zhengbin; Cochran, Sandy

    2010-04-01

    Multilayer ultrasonic transducers are widely being used for high power applications. In these applications, typical Langevin/Tonpilz structures without any adhesive bondings however have the disadvantage of limited bandwidth. Therefore adhesively-bonded structures are still a potential solution for this issue. In this paper, two-layer piezoelectric ceramic ultrasonic transducers with two different adhesive bondlines were investigated comparing to a single-layer transducer in terms of loss effects during operation with excitation signals sufficient to cause self-heating. The theoretical functions fitted to the measured time-temperature dependency data are compared with experimental results of different piezoelectric transducers. Theoretical analysis of loss characteristics at various surface displacements and the relationship with increasing temperature are reported. The effects of self-heating on the practical performance of multilayer ultrasonic transducers with adhesive bondlines are discussed.

  10. Shear bond strength of orthodontic color-change adhesives with different light-curing times

    PubMed Central

    Bayani, Shahin; Ghassemi, Amirreza; Manafi, Safa; Delavarian, Mohadeseh

    2015-01-01

    Background: The purpose of this study was to evaluate the effect of light-curing time on the shear bond strength (SBS) of two orthodontic color-change adhesives (CCAs). Materials and Methods: A total of 72 extracted premolars were randomly assigned into 6 groups of 12 teeth each. Subsequent to primer application, a metal bracket was bonded to the buccal surface using an orthodontic adhesive. Two CCAs (Greengloo and Transbond Plus) were tested and one conventional light-cured adhesive (Resilience) served as control. For each adhesive, the specimens were light-cured for two different times of 20 and 40 s. All the specimens underwent mechanical testing using a universal testing machine to measure the SBS. Adhesive remnant index (ARI) was used to assess the remnant adhesive material on the tooth surface. All statistical analyses were performed using SPSS software. The significance level for all statistical tests was set at P ≤ 0.05. Results: The SBSs of the tested groups were in the range of 14.05-31.25 MPa. Greengloo adhesive showed the highest SBS values when light-cured for 40 s, and Transbond Plus adhesive showed the lowest values when light-cured for 20 s. ARI scores of Transbond Plus adhesive were significantly higher than those of controls, while other differences in ARI values were not significant. Conclusion: Within the limitations of his study, decreasing the light-curing time from 40 to 20 s decreased the SBS of the tested adhesives; however, this decline in SBS was statistically significant only in Transbond Plus adhesive PMID:26005468

  11. Effect of Saliva on the Tensile Bond Strength of Different Generation Adhesive Systems: An In-Vitro Study

    PubMed Central

    Tripathi, Abhay Mani; Saha, Sonali; Dhinsa, Kavita; Garg, Aarti

    2015-01-01

    Background Newer development of bonding agents have gained a better understanding of factors affecting adhesion of interface between composite and dentin surface to improve longevity of restorations. Objective The present study evaluated the influence of salivary contamination on the tensile bond strength of different generation adhesive systems (two-step etch-and-rinse, two-step self-etch and one-step self-etch) during different bonding stages to dentin where isolation is not maintained. Materials and Methods Superficial dentin surfaces of 90 extracted human molars were randomly divided into three study Groups (Group A: Two-step etch-and-rinse adhesive system; Group B: Two-step self-etch adhesive system and Group C: One-step self-etch adhesive system) according to the different generation of adhesives used. According to treatment conditions in different bonding steps, each Group was further divided into three Subgroups containing ten teeth in each. After adhesive application, resin composite blocks were built on dentin and light cured subsequently. The teeth were then stored in water for 24 hours before sending for testing of tensile bond strength by Universal Testing Machine. The collected data were then statistically analysed using one-way ANOVA and Tukey HSD test. Results One-step self-etch adhesive system revealed maximum mean tensile bond strength followed in descending order by Two-step self-etch adhesive system and Two-step etch-and-rinse adhesive system both in uncontaminated and saliva contaminated conditions respectively. Conclusion Unlike One-step self-etch adhesive system, saliva contamination could reduce tensile bond strength of the two-step self-etch and two-step etch-and-rinse adhesive system. Furthermore, the step of bonding procedures and the type of adhesive seems to be effective on the bond strength of adhesives contaminated with saliva. PMID:26393214

  12. Lamb wave based active damage identification in adhesively bonded composite lap joints

    NASA Astrophysics Data System (ADS)

    Jolly, Prateek

    Bonding composite structures using adhesives offers several advantages over mechanical fastening such as better flow stress, weight saving, improved fatigue resistance and the ability to join dissimilar structures. The hesitation to adopt adhesively bonded composite joints stems from the lack of knowledge regarding damage initiation and propagation mechanisms within the joint. A means of overcoming this hesitation is to continuously monitor damage in the joint. This study proposes a methodology to conduct structural health monitoring (SHM) of an adhesively bonded composite lap joint using acoustic, guided Lamb waves by detecting, locating and predicting the size of damage. Finite element modeling of a joint in both 2D and 3D is used to test the feasibility of the proposed damage triangulation technique. Experimental validation of the methodology is conducted by detecting the presence, location and size of inflicted damage with the use of tuned guided Lamb waves.

  13. Active Site Formation, Not Bond Kinetics, Limits Adhesion Rate between Human Neutrophils and Immobilized Vascular Cell Adhesion Molecule 1

    PubMed Central

    Waugh, Richard E.; Lomakina, Elena B.

    2009-01-01

    Abstract The formation of receptor ligand bonds at the interface between different cells and between cells and substrates is a widespread phenomenon in biological systems. Physical measurements of bond formation rates between cells and substrates have been exploited to increase our understanding of the biophysical mechanisms that regulate bond formation at interfaces. Heretofore, these measurements have been interpreted in terms of simple bimolecular reaction kinetics. Discrepancies between this simple framework and the behavior of neutrophils adhering to surfaces expressing vascular cell adhesion molecule 1 (VCAM-1) motivated the development of a new kinetic framework in which the explicit formation of active bond formation sites (reaction zones) are a prerequisite for bond formation to occur. Measurements of cells interacting with surfaces having a wide range of VCAM-1 concentrations, and for different durations of contact, enabled the determination of novel kinetic rate constants for the formation of reaction zones and for the intrinsic bond kinetics. Comparison of these rates with rates determined previously for other receptor-ligand pairs points to a predominant role of extrinsic factors such as surface topography and accessibility of active molecules to regions of close contact in determining forward rates of bond formation at cell interfaces. PMID:19134479

  14. Polymer Composition and Substrate Influences on the Adhesive Bonding of a Biomimetic, Cross-Linking Polymer

    PubMed Central

    Matos-Pérez, Cristina R.; White, James D.; Wilker, Jonathan J.

    2012-01-01

    Hierarchical biological materials such as bone, sea shells, and marine bioadhesives are providing inspiration for the assembly of synthetic molecules into complex structures. The adhesive system of marine mussels has been the focus of much attention in recent years. Several catechol-containing polymers are being developed to mimic the cross-linking of proteins containing 3,4-dihydroxyphenylalanine (DOPA) used by shellfish for sticking to rocks. Many of these biomimetic polymer systems have been shown to form surface coatings or hydrogels, however bulk adhesion is demonstrated less often. Developing adhesives requires addressing design issues including finding a good balance between cohesive and adhesive bonding interactions. Despite the growing number of mussel mimicking polymers, there has been little effort to generate structure-property relations and gain insights on what chemical traits give rise to the best glues. In this report, we examined the simplest of these biomimetic polymers, poly[(3,4-dihydroxystyrene)-co-styrene]. Pendant catechol groups (i.e., 3,4-dihydroxystyrene) were distributed throughout a polystyrene backbone. Several polymer derivatives were prepared, each with a different 3,4-dihyroxystyrene content. Bulk adhesion testing showed where the optimal middle ground of cohesive and adhesive bonding resides. Adhesive performance was benchmarked against commercial glues as well as the genuine material produced by live mussels. In the best case, bonding was similar to cyanoacrylate “Krazy” or “Super” glue. Performance was also examined using low (e.g., plastics) and high (e.g., metals, wood) energy surfaces. Adhesive bonding of poly[(3,4-dihydroxystyrene)-co-styrene] may be the strongest of reported mussel protein mimics. These insights should help us to design future biomimetic systems, thereby bringing us closer to development of bone cements, dental composites, and surgical glues. PMID:22582754

  15. Polymer composition and substrate influences on the adhesive bonding of a biomimetic, cross-linking polymer.

    PubMed

    Matos-Pérez, Cristina R; White, James D; Wilker, Jonathan J

    2012-06-06

    Hierarchical biological materials such as bone, sea shells, and marine bioadhesives are providing inspiration for the assembly of synthetic molecules into complex structures. The adhesive system of marine mussels has been the focus of much attention in recent years. Several catechol-containing polymers are being developed to mimic the cross-linking of proteins containing 3,4-dihydroxyphenylalanine (DOPA) used by shellfish for sticking to rocks. Many of these biomimetic polymer systems have been shown to form surface coatings or hydrogels; however, bulk adhesion is demonstrated less often. Developing adhesives requires addressing design issues including finding a good balance between cohesive and adhesive bonding interactions. Despite the growing number of mussel-mimicking polymers, there has been little effort to generate structure-property relations and gain insights on what chemical traits give rise to the best glues. In this report, we examine the simplest of these biomimetic polymers, poly[(3,4-dihydroxystyrene)-co-styrene]. Pendant catechol groups (i.e., 3,4-dihydroxystyrene) are distributed throughout a polystyrene backbone. Several polymer derivatives were prepared, each with a different 3,4-dihyroxystyrene content. Bulk adhesion testing showed where the optimal middle ground of cohesive and adhesive bonding resides. Adhesive performance was benchmarked against commercial glues as well as the genuine material produced by live mussels. In the best case, bonding was similar to that obtained with cyanoacrylate "Krazy Glue". Performance was also examined using low- (e.g., plastics) and high-energy (e.g., metals, wood) surfaces. The adhesive bonding of poly[(3,4-dihydroxystyrene)-co-styrene] may be the strongest of reported mussel protein mimics. These insights should help us to design future biomimetic systems, thereby bringing us closer to development of bone cements, dental composites, and surgical glues.

  16. The development of ultrasonic techniques for nondestructive evaluation of adhesive bonds

    NASA Astrophysics Data System (ADS)

    Chapman, Gilbert B., II

    Demands for improvements in aerospace and automotive energy-efficiency, performance, corrosion resistance, body stiffness and style have increased the use of adhesive bonds to help meet those demands by providing joining technology that accommodates a wider variety of materials and design options. However, the history of adhesive bond performance clearly indicates the need for a robust method of assuring the existence of the required consistent level of adhesive bond integrity in every bonded region. This investigation seeks to meet that need by the development of new, complementary ultrasonic techniques for the evaluation of these bonds, and thus provide improvements over previous methods by extending the range of resolution, speed and applications. The development of a 20 MHz pulse-echo method for nondestructive evaluation of adhesive bonds will accomplish the assessment of bond joints with adhesive as thin as 0.1 mm. This new method advances the state of the art by providing a high-resolution, phase-sensitive procedure that identifies the bond state at each interface of the adhesive with the substrate(s), by the acquisition and analysis of acoustic echoes reflected from interfaces between layers with large acoustic impedance mismatch. Because interface echo amplitudes are marginal when the acoustic impedance of the substrate is close to that of the adhesive, a 25 kHz Lamb wave technique was developed to be employed in such cases, albeit with reduced resolution. Modeling the ultrasonic echoes and Lamb-wave signals was accomplished using mathematical expressions developed from the physics of acoustic transmission, attenuation and reflection in layered media. The models were validated by experimental results from a variety of bond joint materials, geometries and conditions, thereby confirming the validity of the methodology used for extracting interpretations from the phase-sensitive indications, as well as identifying the range and limits of applications. Results

  17. Interaction morphology and bond strength of nanofilled simplified-step adhesives to acid etched dentin

    PubMed Central

    Di Hipólito, Vinicius; Reis, André Figueiredo; Mitra, Sumita B.; de Goes, Mario Fernando

    2012-01-01

    Objective: To evaluate the effect of nanofillers incorporated into adhesives on the microtensile bond strength (μ-TBS) and interfacial micromorphology to dentin. Methods: The occlusal enamel of 5 human molars was removed and each tooth sectioned into four quarters. The exposed dentin was treated with one of the following adhesives: Adper Single Bond (SB-unfilled), OptiBond Solo Plus (OS-barium aluminoborosilicate, 400nm Ø), Prime & Bond NT (NT-colloidal silica, 7–40 nm Ø) and Adper Single Bond 2 (SB2-colloidal silica, 5nm Ø). Cylinders of resin-based composite were constructed on the adhesive layers. After 24-hour storage, the restored tooth-quadrants were sectioned to obtain stick-shaped specimens (0.8 mm2, cross-sectional area) and submitted to μ-TBS at a cross-speed of 0.5 mm/min. Data were analyzed using one-way ANOVA and Tukey’s test (alpha = .05). Twenty-eight additional teeth were used for interfacial micro-morphologic analysis by SEM (16-teeth) and TEM (12-teeth). The dentin surfaces of 32 discs were treated with the adhesives (8 discs for adhesive) and laminated to form disc-pairs using a flowable resin composite for SEM/EDS analysis. For TEM, 90nm-thick nondemineralized unstained sections were processed. Results: SB2 showed significant higher bond strength than SB, OS and NT. The SEM/EDS and TEM analysis revealed nanofillers infiltrated within the interfibrillar spaces of the SB2-hybrid layer. Fillers were concentrated around patent tubular orifices and in the adhesive layer for OS and NT. Conclusion: The presence of nanofillers within the interfibrillar spaces of the SB2-hybrid layer suggests its importance in the improvement of the μ-TBS. PMID:23077413

  18. Molecular weight effects upon the adhesive bonding of a mussel mimetic polymer.

    PubMed

    Jenkins, Courtney L; Meredith, Heather J; Wilker, Jonathan J

    2013-06-12

    Characterization of marine biological adhesives are teaching us how nature makes materials and providing new ideas for synthetic systems. One of the most widely studied adhering animals is the marine mussel. This mollusk bonds to wet rocks by producing an adhesive from cross-linked proteins. Several laboratories are now making synthetic mimics of mussel adhesive proteins, with 3,4-dihydroxyphenylalanine (DOPA) or similar molecules pendant from polymer chains. In select cases, appreciable bulk bonding results, with strengths as high as commercial glues. Polymer molecular weight is amongst several parameters that need to be examined in order to both understand biomimetic adhesion as well as to maximize performance. Experiments presented here explore how the bulk adhesion of a mussel mimetic polymer varies as a function of molecular weight. Systematic structure-function studies were carried out both with and without the presence of an oxidative cross-linker. Without cross-linking, higher molecular weights generally afforded higher adhesion. When a [N(C4H9)4](IO4) cross-linker was added, adhesion peaked at molecular weights of ~50,000-65,000 g/mol. These data help to illustrate how changes to the balance of cohesion versus adhesion influence bulk bonding. Mussel adhesive plaques achieve this balance by incorporating several proteins with molecular weights ranging from 6000 to 110,000 g/mol. To mimic these varied proteins we made a blend of polymers containing a range of molecular weights. Interestingly, this blend adhered more strongly than any of the individual polymers when cross-linked with [N(C4H9)4](IO4). These results are helping us to both understand the origins of biological materials as well as design high performance polymers.

  19. Surface activated bonding of GaAs and SiC wafers at room temperature for improved heat dissipation in high-power semiconductor lasers

    NASA Astrophysics Data System (ADS)

    Higurashi, Eiji; Okumura, Ken; Nakasuji, Kaori; Suga, Tadatomo

    2015-03-01

    Thermal management of high-power semiconductor lasers is of great importance since the output power and beam quality are affected by the temperature rise of the gain region. Thermal simulations of a vertical-external-cavity surface-emitting laser by a finite-element method showed that the solder layer between the semiconductor thin film consisting of the gain region and a heat sink has a strong influence on the thermal resistance and direct bonding is preferred to achieve effective heat dissipation. To realize thin-film semiconductor lasers directly bonded on a high-thermal-conductivity substrate, surface-activated bonding using an argon fast atom beam was applied to the bonding of gallium arsenide (GaAs) and silicon carbide (SiC) wafers. The GaAs/SiC structure was demonstrated in the wafer scale (2 in. in diameter) at room temperature. The cross-sectional transmission electron microscopy observations showed that void-free bonding interfaces were achieved.

  20. Influence of conditioning time on bond strength: evaluation of self-etching adhesive systems.

    PubMed

    Borges, Marciano de Freitas; Skupien, Jovito Adiel; Montagner, Anelise Fernandes; Marchiori, Jeferson da Costa; Bortolotto, Tissiana; Krejci, Ivo; Susin, Alexandre Henrique

    2011-01-01

    The aim of this study was to evaluate the tensile bond strength of self-etching adhesive systems with different dentin conditioning times. Sixty caries-free, extracted third molars were selected, with the occlusal surface removed by a diamond saw disc. The specimens were embedded in epoxy resin and divided randomly into six groups (n = 10), according to the conditioning time and adhesive system used. After restoration, the specimens were stored in distilled water at room temperature for 24 hours; they then were submitted to the tensile bond strength test. The results were measured in MPa, then submitted to ANOVA and Tukey's test (P = 0.05). The adhesive system used and the length of dentin conditioning time were statistically significant (P < 0.05). The application time of the conditioner before photocuring did not have a significant effect on tensile bond strength. These results indicate that the resting time of adhesive above the dentin does not directly affect the bond strength of the adhesive system.

  1. Multitechnique monitoring of fatigue damage in adhesively bonded composite lap-joints

    NASA Astrophysics Data System (ADS)

    Karpenko, Oleksii; Koricho, Ermias; Khomenko, Anton; Dib, Gerges; Haq, Mahmoodul; Udpa, Lalita

    2015-03-01

    The requirement for reduced structural weight has driven the development of adhesively bonded joints. However, a major issue preventing their full acceptance is the initiation of premature failure in the form of a disbond between adherends, mainly due to fatigue, manufacturing flaws or impact damage. This work presents the integrated approach for in-situ monitoring of degradation of the adhesive bond in the GFRP composite lap-joint using ultrasonic guided waves and dynamic measurements from strategically embedded FBG sensors. Guided waves are actuated with surface mounted piezoelectric elements and mode tuning is used to provide high sensitivity to the degradation of the adhesive layer parameters. Composite lap-joints are subjected to fatigue loading, and data from piezoceramic transducers are collected at regular intervals to evaluate the progression of damage. Results demonstrate that quasi-static loading affects guided wave measurements considerably, but FBG sensors can be used to monitor the applied load levels and residual strains in the adhesive bond. The proposed technique shows promise for determining the post-damage stiffness of adhesively bonded joints.

  2. Effect of cleaning methods on bond strength of self-etching adhesive to dentin

    PubMed Central

    Bronzato, Juliana Delatorre; Cecchin, Doglas; Miyagaki, Daniela Cristina; de Almeida, José Flávio Affonso; Ferraz, Caio Cezar Randi

    2016-01-01

    Aim: The aim of this study was to investigate the influence of cleaning methods to remove zinc oxide-eugenol-based root canal sealer (Endomethasone) on the bond strength of the self-etching adhesive to dentin. Materials and Methods: Twenty crowns of bovine incisors were cut to expose the pulp chamber. A zinc oxide- and eugenol-based sealer was placed for 10 min in contact with the pulp chamber dentin. Specimens were divided into four groups according to the cleaning method of dentin used: G1, no root canal sealer (control); G2, 0.9% sodium chlorite (NaCl); G3, ethanol; and G4, followed by diamond drill. After cleaning, the teeth were restored with composite resin and Clearfil SE Bond. All specimens were sectioned to produce rectangular sticks and dentin/resin interface was submitted to microtensile bond testing. The mean bond strengths were analyzed using ANOVA/Tukey (α = 0.05). Results: G3 and G4 showed bond strengths similar to the G1 (P > 0.05). A significant decrease in the bond strength in the G2 was observed (P < 0.05). G1, G3, and G4, the predominant failure mode was the mixed type. The prevalence of adhesive failure mode was verified in the G2. Conclusion: The cleaning methods affected the bond strength of the self-etching adhesive to dentin differently. PMID:26957789

  3. Effect of Self-etching Adhesives on the Bond Strength of Glass-Ionomer Cements

    PubMed Central

    Jaberi Ansari, Zahra; Panahandeh, Narges; Tabatabaei Shafiei, Zahra Sadat; Akbarzadeh Baghban, Alireza

    2014-01-01

    Objective: Statement of Problem: Adequate bond strength between glass ionomer cements and composite resin is necessary for the success of the sandwich technique. Purpose of Study: This study assessed the micro-shear bond strength of composite resin to glass-ionomer cements (GIC) using self-etch adhesives with different pH values. Materials and Methods: One hundred specimens (6×4×2 mm) were made using Fuji II and Fuji II LC GICs and treated with different adhesives as follows: Group 1:Fuji II+ Adper Prompt L-Pop, Group-2: Fuji II+SE bond, Group-3: Fuji II + AdheSE, Group-4:Fuji II+ Protect bond, Group-5: Fuji II + Single bond, Group-6:Fuji II LC+ Adper Prompt LPop, Group-7: Fuji II LC+SE bond, Group-8:Fuji II LC+ AdheSE, Group-9: Fuji II LC+ Protect bond, and Group-10: Fuji II LC+ Single bond. Each group consisted of 10 specimens. A cylinder of Z100 composite resin was placed on each sample and light cured. After 24 hours of water storage (37°C), the specimens were subjected to micro-shear bond strength tests (0.5 mm/min). Data were analyzed using two-way ANOVA and Tukey’s test. Results: The mean micro-shear bond strength of groups 1–10 was 11.66±1.79, 16.50±1.85, 18.47±1.77, 13.95±1.77, 15.27±1.49, 15.14±0.90, 20.03±1.19, 17.48±3.00, 16.24±1.98 and 16.03±1.49 MPa, respectively. There were significant differences between groups 1 and 7 (P<0.05). No significant difference was observed between other groups (P>0.05). Fuji II LC showed higher bond strength than Fuji II (P<0.05). Conclusion: Type of self-etch adhesive had no significant effect on micro-shear bond strength of glass-ionomer to composite resin. Resin modified glass ionomer cement (RMGIC) exhibited higher bond strength than the conventional GIC. PMID:25628698

  4. Laser Surface Preparation for Adhesive Bonding of Ti-6Al-4V

    NASA Technical Reports Server (NTRS)

    Belcher, Marcus A.; List, Martina S.; Wohl, Christopher J.; Ghose, Sayata; Watson, Kent A.; Hopkins, John W.; Connell, John W.

    2010-01-01

    Adhesively bonded structures are potentially lighter in weight than mechanically fastened ones, but existing surface treatments are often considered unreliable. Two main problems in achieving reproducible and durable adhesive bonds are surface contamination and variability in standard surface preparation techniques. In this work three surface pretreatments were compared: laser etching with and without grit blasting and conventional Pasa-Jell treatment. Ti-6Al-4V surfaces were characterized by contact angle goniometry, optical microscopy, and X-ray photoelectron spectroscopy (XPS). Laser -etching was found to produce clean surfaces with precisely controlled surface topographies and PETI-5 lap shear strengths and durabilities were equivalent to those produced with Pasa-Jell.

  5. Adhesive bonding of ion beam textured metals and fluoropolymers

    NASA Technical Reports Server (NTRS)

    Mirtich, M. J.; Sovey, J. S.

    1978-01-01

    An electron bombardment argon ion source was used to ion etch various metals and fluoropolymers. The metal and fluoropolymers were exposed to (0.5 to 1.0) keV Ar ions at ion current densities of (0.2 to 1.5) mA/sq cm for various exposure times. The resulting surface texture is in the form of needles or spires whose vertical dimensions may range from tenths to hundreds of micrometers, depending on the selection of beam energy, ion current density, and etch time. The bonding of textured surfaces is accomplished by ion beam texturing mating pieces of either metals or fluoropolymers and applying a bonding agent which wets in and around the microscopic cone-like structures. After bonding, both tensile and shear strength measurements were made on the samples. Also tested, for comparison's sake, were untextured and chemically etched fluoropolymers. The results of these measurements are presented.

  6. Effect of laser preparation on bond strength of a self-adhesive flowable resin.

    PubMed

    Yazici, A Rüya; Agarwal, Ishita; Campillo-Funollet, Marc; Munoz-Viveros, Carlos; Antonson, Sibel A; Antonson, Donald E; Mang, Thomas

    2013-01-01

    The aim of this in vitro study was to evaluate the effect of laser treatment on shear bond strength of a self-adhesive flowable resin composite to human dentin. Eighty extracted sound human molar teeth were used for the study. The teeth were sectioned mesiodistally and embedded in acrylic blocks. The dentin surfaces were ground wet with 600-grit silicon carbide (SiC) paper. They were randomly divided into two preparation groups: laser (Er:YAG laser, with 12 Hz, 350 mJ energy) and control (SiC). Each group was then divided into two subgroups according to the flowable resin composite type (n = 20). A self-adhesive flowable (Vertise Flow) and a conventional flowable resin (Premise Flow) were used. Flowable resin composites were applied according to the manufacturer's recommendations using the Ultradent shear bond Teflon mold system. The bonded specimens were stored in water at 37 °C for 24 h. Shear bond strength was tested at 1 mm/min. The data were logarithmically transformed and analyzed using two-way analysis of variance and Student-Newman-Keul's test at a significance level of 0.05. The self-adhesive flowable resin showed significantly higher bond strength values to laser-prepared surfaces than to SiC-prepared surfaces (p < 0.001). The conventional flowable resin did not show such differences (p = 0.224). While there was a significant difference between the two flowable resin composites in SiC-prepared surfaces (p < 0.001), no significant difference was detected in laser-prepared surfaces (p = 0.053). The bond strength of a self-adhesive flowable resin composite differs according to the type of dentin surface preparation. Laser treatment increased the dentin bonding values of the self-adhesive flowable resin.

  7. Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds

    NASA Astrophysics Data System (ADS)

    Qian, Jin; Lin, Ji; Xu, Guang-Kui; Lin, Yuan; Gao, Huajian

    A statistical model is proposed to describe the peeling of an elastic strip in adhesion with a flat substrate via an array of non-covalent molecular bonds. Under an imposed tensile peeling force, the interfacial bonds undergo diffusion-type transition in their bonding state, a process governed by a set of probabilistic equations coupled to the stretching, bending and shearing of the elastic strip. Because of the low characteristic energy scale associated with molecular bonding, thermal excitations are found to play an important role in assisting the escape of individual molecular bonds from their bonding energy well, leading to propagation of the peeling front well below the threshold peel-off force predicted by the classical theories. Our study establishes a link between the deformation of the strip and the spatiotemporal evolution of interfacial bonds, and delineates how factors like the peeling force, bending rigidity of the strip and binding energy of bonds influence the resultant peeling velocity and dimensions of the process zone. In terms of the apparent adhesion strength and dissipated energy, the bond-mediated interface is found to resist peeling in a strongly rate-dependent manner.

  8. [Bond strength to dentin of resin composites associated with filled and unfilled adhesive systems].

    PubMed

    Youssef, J A; Turbino, M L; Youssef, M N; Matson, E

    2001-01-01

    This study analyzed in vitro two brands of one-step adhesive systems of fourth generation (Optisolo--Kerr, filled; and Single Bond--3M, unfilled) and two composite resins (Prodigy--Kerr and Z100--3M), aiming at evaluating their bond strength to dentin. Eighty human extracted molars were embedded in acrylic resin and grounded until dentin was exposed in longitudinal direction. The specimens were divided in 4 groups. Composite resin cones were bonded to the specimens using the mentioned adhesive systems, following the instructions of the manufacturers. The test-specimens were submitted to tensile tests using a 4442 Universal Mini-Instron Machine with the speed of 0.5 mm/min. The results were converted into MPa, according to the area of adhesion, and submitted to statistical analysis with ANOVA. There was significant statistical difference (p < 0.01) between the adhesive systems (F = 7.24). Optisolo (m = 11.03 +/- 4.23) showed better bond strength than Single Bond (m = 8.37 +/- 4.54). There was no significant statistical difference (p > 0.05) between the composites (F = 0.43).

  9. Effect of prior acid etching on bonding durability of single-step adhesives.

    PubMed

    Watanabe, Takayuki; Tsubota, Keishi; Takamizawa, Toshiki; Kurokawa, Hiroyasu; Rikuta, Akitomo; Ando, Susumu; Miyazaki, Masashi

    2008-01-01

    This study investigated the effect of prior phosphoric acid etching on the enamel bond strength of five single-step self-etch adhesive systems: Absolute, Clearfil tri-S Bond, Fluoro Bond Shake One, G-Bond and One-Up Bond F Plus. Bovine mandibular incisors were mounted in self-curing resin, and the facial surfaces were wet ground with #600 silicon carbide paper. Adhesives were applied to the enamel surfaces with or without prior phosphoric-acid etching and light irradiated. The resin composites were condensed into a mold and light irradiated. In total, 40 specimens were tested per adhesive system with and without prior acid etching and were further divided into two groups: those stored in water at 37 degrees C for 24 hours without cycling and those stored in water at 37 degrees C for 24 hours followed by thermal cycling between 5 degrees C and 55 degrees C with 10,000 repeats. After storage under each set of conditions, the specimens were tested in shear mode at a crosshead speed of 1.0 mm/minute. Two-way analysis of variance, the Student's t-test and the Tukey HSD test were used to analyze the data at a significance level of 0.05. For the specimens without prior acid etching, the mean bond strengths to enamel ranged from 11.0 to 14.6 MPa after 24-hour storage in water, while the corresponding values for specimens with prior acid etching ranged from 15.2 to 19.3 MPa. When these specimens were subjected to thermal cycling, the mean bond strengths ranged from 11.3 to 17.0 MPa without prior acid etching and from 12.3 to 23.2 MPa with prior acid etching. The changes in enamel bond strengths differed among the adhesive systems tested. After 24-hour storage in water, the most common failure modes were adhesive failure and mixed failure for specimens with and without prior acid etching, respectively. Thus, through a careful choice of adhesive system, prior acid etching can increase the bond strengths of single-step self-etch adhesive systems.

  10. Nondestructive Characterization of Adhesive Bonds from Guided Wave Data

    NASA Technical Reports Server (NTRS)

    Mal, A.; Lih, S-S.; Bar-Cohen, Y.

    1994-01-01

    The critical role played by interface zones in the fracture and failure of composites and other bonded materials is well known. The existing nondestructive evaluation methods are generally not capable of yielding useful quantitative information of the strength of an interface.

  11. Adhesive bond strengths to enamel and dentin using recommended and extended treatment times.

    PubMed

    Kimmes, Nicole S; Barkmeier, Wayne W; Erickson, Robert L; Latta, Mark A

    2010-01-01

    This study examined the effect of different enamel and dentin conditioning times on the shear bond strength of a resin composite using etch-and-rinse and self-etch adhesive systems. Shear bond strengths were determined following treatment of flat ground human enamel and dentin surfaces (4000 grit) with 11 adhesive systems: 1) AdheSE One Viva Pen-(ASE), 2) Adper Prompt L-Pop-(PLP), 3) Adper Single Bond Plus-(SBP), 4) Clearfil SE Bond-(CSE), 5) Clearfil S3 Bond-(CS3), 6) OptiBond All-In-One-(OBA), 7) OptiBond Solo Plus-(OBS), 8) Peak SE-(PSE), 9) Xeno IV-(X4), 10) Xeno V-(X5) and 11) XP Bond-(XPB) using recommended treatment times and an extended treatment time of 60 seconds (n = 10/group). Composite (Z100) to enamel and dentin bond strengths (24 hours) were determined using Ultradent fixtures and debonded with a crosshead speed of 1 mm/minute. The data were analyzed with a three-way Analysis of Variance (ANOVA) and Fisher's LSD post hoc test. The highest shear bond strengths (MPa) to enamel were achieved by the three etch-and-rinse systems at both the recommended treatment time (SBP-40.5 +/- 6.1; XPB-38.7 +/- 3.7; OBS- 35.2 +/- 6.2) and the extended treatment time (SBP-44.5 +/- 8.1; XPB-40.9 +/- 5.7; OBS-35.0 +/- 4.5). Extending the enamel treatment time did not produce a significant change (p > 0.05) in bond strength for the 11 adhesive systems tested. OBS generated the highest (46.2 +/- 7.9) bond strengths to dentin at the recommended treatment time. At the extended treatment time X4 (42.2 +/- 11.7), PSE (42.1 +/- 9.7) and OBS (41.4 +/- 8.0) produced the highest bond strengths to dentin. The bond strength change between recommend and extended treatment times was significant (p < 0.05) for PSE, but the other 10 systems did not exhibit any significant change.

  12. Effect of adhesive resin cements and post surface silanization on the bond strengths of adhesively inserted fiber posts.

    PubMed

    Wrbas, Karl-Thomas; Altenburger, Markus Jörg; Schirrmeister, Jörg Fabian; Bitter, Kerstin; Kielbassa, Andrej Michael

    2007-07-01

    This study evaluated the tensile bond strengths and the effect of silanization of fiber posts inserted with different adhesive systems. Sixty DT Light Posts (size 1) were used. Thirty posts were pretreated with silane. The posts were cemented into form-congruent artificial root canals (12 mm) of bovine dentine. Six groups were formed: G1, Prime&Bond NT/Calibra; G2, Monobond-S+Prime&Bond NT/Calibra; G3, ED Primer/Panavia 21ex; G4, Monobond-S+ED Primer/Panavia 21ex; G5, RelyX Unicem; and G6, Monobond-S+RelyX Unicem. The mean (standard deviation) tensile bond strengths (megapascals) were 7.69 (0.85) for G1, 7.15 (1.01) for G2, 6.73 (0.85) for G3, 6.78 (0.97) for G4, 4.79 (0.58) for G5, and 4.74 (0.88) for G6. G1 achieved significantly higher bond strengths than G3 and G5; G3 had significantly higher values than G5 (P < .05; Scheffé procedure). Silanization had no significant effect (P > .05, one-way analysis of variance). Tensile bond strengths were significantly influenced by the type of resin cement. Silanization of fiber post surfaces seems to have no clinical relevance.

  13. Effect of MTAD on the shear bond strength of self-etch adhesives to dentin

    PubMed Central

    Mortazavi, Vajihesadat; Khademi, Abbasali; Khosravi, Kazem; Fathi, Mohammadhossein; Ebrahimi–Chaharom, Mohammadesmaeil; Shahnaseri, Shirin; Khalighinejad, Navid; Badrian, Hamid

    2012-01-01

    Background: As the use of different irrigants to eliminate residual debris and smear layer in the field of endodontic is unavoidable, by considering the effect of irrigants on the bond strength of resin composite restorations, this study was designed to evaluate the effect of a mixture of a tetracycline isomer, an acid, and a detergent (MTAD) on the shear bond strength of two self-etch adhesives, Clearfil SE Bond and Adper Prompt L- Pop to dentin. Materials and Methods: The crowns of 80 extracted premolars were transversally sectioned to expose dentin. Flat dentin surfaces were wet abraded with 320-grit abrasive paper and randomly assigned to eight groups according to two self-etch adhesive and four dentin surface treatments: direct application over smear layer (no treatment), etching with 35% phosphoric acid for 15s, 1 min 5.25% NaOCl/1 min MTAD and 20min 1.3% NaOCl/5min MTAD. Shear bond strength was tested 24 h after storage in distilled water at 37°C in incubator. Data were analyzed using one-way ANOVA followed by duncan post-hoc (α=0.05). Results: Phosphoric acid etching prior to SE Bond application significantly decreased the shear bond strength to dentin (P<0.05). Application of MTAD clinical protocol (20min 1.3% NaOCl/5min MTAD) did not significantly decrease the shear bond strength of self-etch adhesives to dentin (P=0.745) Conclusions: Based on the results of present investigation, it seems that the use of clinical protocol of 1.3% NaOCl as a root canal irrigant and a 5-min application of MTAD as a final rinse to remove the smear layer has no adverse effect on the shear bond strength of self-etch adhesives to dentin. PMID:22363359

  14. Bond strength of a self-adhesive resin cement to enamel and dentin.

    PubMed

    Fernandes, Virgílio Vilas Boas; Rodrigues, José Roberto; da Silva, João Maurício Ferraz; Pagani, Clovis; Souza, Rodrigo Othávio Assunção

    2015-01-01

    The purpose of this study was to evaluate the influence of surface treatments and thermocycling on the microtensile bond strength (μTBS) of self-adhesive resin cement to human enamel and dentin. Eighty human third molars were selected. The crowns of 40 teeth were transversally sectioned, exposing the mid-coronal dentin. The buccal surfaces of the other 40 teeth were grinded to obtain a 5 mm2 flat enamel area. Eighty resin blocks were produced and cemented to the dental surfaces with RelyX Unicem, then grouped according to the surface treatment (n=10): UnicemC with no conditioning, UnicemP with 37% phosphoric acid/15 s, and UnicemPA with 37% phosphoric acid/15 s plus adhesive bonding (Single Bond 2). There were two control groups, one for enamel and the other for dentin: VR with 37% phosphoric acid/15 s plus adhesive bonding (Single Bond 2) plus Variolink II. The enamel-dentin resin cement blocks were sectioned to produce non-trimmed bar specimens, which were divided into two storage conditions: dry, μTBS immediately after cutting; TC (5,000 x; 5°C/55°C). The samples were submitted to μTBS, and data were statistically analyzed by ANOVA and Tukey's test. The results showed statistical differences between UnicemC and the others. UnicemPA and VR showed better bond strength to dentin during the period before and after thermocycling, respectively. For the enamel, UnicemP showed better bond strength for both situations. Only for UnicemPA did the thermocycling significantly decrease the bond strength values. Within the limits of this study, it could be concluded that the bond strength is influenced by the surface treatments, and that thermocycling decreases the bond strength of all groups, but significantly only for UnicemPA.

  15. Plasma treatment of dentin surfaces for improving self-etching adhesive/dentin interface bonding

    PubMed Central

    Dong, Xiaoqing; Li, Hao; Chen, Meng; Wang, Yong; Yu, Qingsong

    2015-01-01

    This study is to evaluate plasma treatment effects on dentin surfaces for improving self-etching adhesive and dentin interface bonding. Extracted unerupted human third molars were used after crown removal to expose dentin. One half of each dentin surface was treated with atmospheric non-thermal argon plasmas, while another half was untreated and used as the same tooth control. Self-etching adhesive and universal resin composite was applied to the dentin surfaces as directed. After restoration, the adhesive-dentin bonding strength was evaluated by micro-tensile bonding strength (μTBS) test. Bonding strength data was analyzed using histograms and Welch’s t-test based on unequal variances. μTBS test results showed that, with plasma treatment, the average μTBS value increased to 69.7±11.5 MPa as compared with the 57.1±17.5 MPa obtained from the untreated controls. After 2 months immersion of the restored teeth in 37 °C phosphate buffered saline (PBS), the adhesive-dentin bonding strengths of the plasma-treated specimens slightly decreased from 69.7±11.5 MPa to 63.9±14.4 MPa, while the strengths of the untreated specimens reduced from 57.1±17.5 MPa to 48.9±14.6 MPa. Water contact angle measurement and scanning electron microscopy (SEM) examination verified that plasma treatment followed by water rewetting could partially open dentin tubules, which could enhance adhesive penetration to form thicker hybrid layer and longer resin tags and consequently improve the adhesive/dentin interface quality. PMID:26273561

  16. The Effect of Primer Application Modifications on the Bond Strength of 4th Generation Adhesive Bonding Agents

    DTIC Science & Technology

    2012-03-30

    dentin. Methods: The coronal enamel of 120 extracted human third molars was removed with a low-speed saw. The teeth were mounted in PVC pipe with dental...LITERATURE REVIEW A. Background 1. Acid Etching in Dentistry. Buonocore demonstrated in 1955 that the preparation of dental enamel with an...The influence of deviations from the manufacturer’s instructions for the use of six adhesive systems on the bond strengths to enamel and dentin

  17. Adhesion studies of GaAs-based ohmic contact and bond pad metallization

    SciTech Connect

    Seigal, P.K.; Briggs, R.D.; Rieger, D.J.; Baca, A.G.; Howard, A.J.

    1996-03-01

    Adhesion strength and surface morphology of commonly used n- and p-type ohmic contacts and pad metallization schemes for GaAs were investigated. GeNiAu, GePdAu, BeAu, and TiPtAu (being studied as potential ohmic contacts for internal optoelectronic devices) had quantitiative measurements made using wire bond pull testing to determine adhesion. Bond pad metals deposited as evaporated TiAu, TiPtAu, and 2-5 micron thick electroplated Au deposited on both semi-insulating GaAs and on Si{sub 3}N{sub 4}/GaAs were evaluated independently from the ohmic contact metals. In all samples was observed a strong correlation between surface treatment, surface morphology, wire bondability, and bond strength. Very high bond strengths (pull test average values above 6.5 grams force with 25 micron dia Au wire) wereobtained for n-type, p-type, and bond pad metals. Average values of 8.0 gram force were achieved with two-step GeAu/NiAu/TiPtAu metallization, while one-step deposition yielded poorer values. Adhesion was also monitored after aging at 250 C in air for four different times up to 60 hr by wire bond pull testing, with little degradation occurring.

  18. Effect of digluconate chlorhexidine on bond strength between dental adhesive systems and dentin: A systematic review

    PubMed Central

    Dionysopoulos, Dimitrios

    2016-01-01

    Aim: This study aimed to systematically review the literature for the effect of digluconate chlorhexidine (CHX) on bond strength between dental adhesive systems and dentin of composite restorations. Materials and Methods: The electronic databases that were searched to identify manuscripts for inclusion were Medline via PubMed and Google search engine. The search strategies were computer search of the database and review of reference lists of the related articles. Search words/terms were as follows: (digluconate chlorhexidine*) AND (dentin* OR adhesive system* OR bond strength*). Results: Bond strength reduction after CHX treatments varied among the studies, ranging 0-84.9%. In most of the studies, pretreatment CHX exhibited lower bond strength reduction than the control experimental groups. Researchers who previously investigated the effect of CHX on the bond strength of dental adhesive systems on dentin have reported contrary results, which may be attributed to different experimental methods, different designs of the experiments, and different materials investigated. Conclusions: Further investigations, in particular clinical studies, would be necessary to clarify the effect of CHX on the longevity of dentin bonds. PMID:26957786

  19. Effect of silorane-based adhesive system on bond strength between composite and dentin substrate

    PubMed Central

    Pereira, Jefferson Ricardo; Júnior, Lindomar Corrêa; de Souza Almeida, Mauro; do Valle, Accácio Lins; Honório, Heitor Marques; Vidotti, Hugo Alberto; De Souza, Grace Mendonca

    2015-01-01

    Context: The complexities of the oral environment, the dentin substrate, and the different bond and composite resin systems represent a challenge to the maintenance of reasonable bond between the composite resin and the tooth structure. Aims: To evaluate the effect of the adhesive system on bond strength between silorane-based composite resin and dentin. Materials and Methods: Fourteen human molars extracted were selected and vertically cut into 3 dentin fragments, randomly divided among the experimental groups and restored with Z250 and P90 composite resin using different adhesive protocols (Adper Single Bond 2, Silorano primer, Adper SE Plus, and Scotchbond Multiuse). Two composite resin cylinders were built up on each dentin surface (n = 10) and subjected to a micro-shear bond strength test. Statistical Analysis Used: Kruskal–Wallis one-way analysis of variance and Tukey test (P = 0.05). Results: According to the results, Kruskal–Wallis test evidenced at least one statistical significant difference (P = 0.001). The Tukey test showed statistically significant differences among the group (P < 0.05). Group PSM8 (P90 + SM) showed statically significant higher results when compared with groups PSP4 (P90 + SP), PSB2 (P90 + SB), and ZSE5 (Z250 + SE). Conclusion: The results evidenced that the monomer of the adhesive system has an effect on bond strength between the composite resin and dentin. PMID:26752846

  20. Innovative use of adhesive interface characteristics to nondestructively quantify the strength of bonded joints.

    SciTech Connect

    Roach, Dennis Patrick; Duvall, Randy L.; Rackow, Kirk A.

    2010-05-01

    Advances in structural adhesives have permitted engineers to contemplate the use of bonded joints in areas that have long been dominated by mechanical fasteners and welds. Although strength, modulus, and toughness have been improved in modern adhesives, the typical concerns with using these polymers still exist. These include concerns over long-term durability and an inability to quantify bond strength (i.e., identify weak bonds) in adhesive joints. Bond deterioration in aging structures and bond strength in original construction are now critical issues that require more than simple flaw detection. Whether the structure involves metallic or composite materials, it is necessary to extend inspections beyond the detection of disbond flaws to include an assessment of the strength of the bond. Use of advanced nondestructive inspection (NDI) methods to measure the mechanical properties of a bonded joint and associated correlations with post-inspection failure tests have provided some clues regarding the key parameters involved in assessing bond strength. Recent advances in ultrasonic- and thermographic-based inspection methods have shown promise for measuring such properties. Specialized noise reduction and signal enhancement schemes have allowed thermographic interrogations to image the subtle differences between bond lines of various strengths. Similarly, specialized ultrasonic (UT) inspection techniques, including laser UT, guided waves, UT spectroscopy, and resonance methods, can be coupled with unique signal analysis algorithms to accurately characterize the properties of weak interfacial bonds. The generation of sufficient energy input levels to derive bond strength variations, the production of sufficient technique sensitivity to measure such minor response variations, and the difficulty in manufacturing repeatable weak bond specimens are all issues that exacerbate these investigations. The key to evaluating the bond strength lies in the ability to exploit the

  1. Effect of adhesion promoting monomer addition to MMA-TBBO resin on bonding to pure palladium.

    PubMed

    Minami, Hiroyuki; Murahara, Sadaaki; Muraguchi, Koichi; Sakoguchi, Kenji; Suzuki, Shiro; Tanaka, Takuo

    2013-01-01

    This study evaluated the effects of combined use of metal primers and modified monomers on the bonding of MMA-TBBO resins to pure palladium (Pd). Bonding surface was polished with 600-grit silicon carbide paper and primed with one of these four metal primers: V-Primer, M. L. Primer, Metaltite, or Alloy Primer. Four monomers, including three modified ones, were added to MMATBBO resin. One was a methyl methacrylate monomer containing no adhesion promoting monomers, while the other two modified monomers contained the functional monomer of either V-Primer or Alloy Primer. Bonded specimens were prepared by incremental build-up of MMA-TBBO resin on primed Pd surfaces. Shear bond strengths were measured after thermal cycling. Bonding to Pd was significantly improved when modified monomer containing the functional monomer of Alloy Primer was used in combination with M. L. Primer or Metaltite applied on the bonding surface.

  2. Current-injection two-color lasing in a wafer-bonded coupled multilayer cavity with InGaAs multiple quantum wells

    NASA Astrophysics Data System (ADS)

    Minami, Yasuo; Ota, Hiroto; Lu, Xiangmeng; Kumagai, Naoto; Kitada, Takahiro; Isu, Toshiro

    2017-04-01

    Current-injection two-color lasing has been demonstrated using a GaAs/AlGaAs coupled multilayer cavity that is a good candidate for novel terahertz-emitting devices based on difference-frequency generation (DFG) inside the structure. The coupled cavity structure was fabricated by the direct wafer bonding of (001)- and (113)B-oriented epitaxial wafers for the efficient DFG of two modes in the (113)B side cavity, and two types of InGaAs multiple quantum wells (MQWs) were introduced only in the (001) side cavity as optical gain materials. The threshold behavior was clearly observed in the current–light output curve even at room temperature. Two-color lasing was successfully observed when the gain peaks of MQWs were considerably tuned to the cavity modes by the operating temperature.

  3. Bonding durability of single-step adhesives to previously acid-etched dentin.

    PubMed

    Ikeda, Masahiko; Tsubota, Keishi; Takamizawa, Toshiki; Yoshida, Takeshi; Miyazaki, Masashi; Platt, Jeffrey A

    2008-01-01

    This study investigated the effect of phosphoric acid etching on the dentin bond strength of five single-step self-etch adhesive systems; Absolute, Clearfil tri-S Bond, Fluoro Bond Shake One, G-Bond and One-Up Bond F Plus. Bovine mandibular incisors were mounted in self-curing resin and the facial surfaces were wet ground with #600 SiC paper. Adhesives were applied on the prepared dentin surfaces with and without prior phosphoric acid etching and light irradiated. Resin composite was condensed into a mold (ø4x2 mm), light irradiated and stored in water at 37 degrees C. Four groups (n=10) were made per adhesive system: with and without prior acid etching and with and without thermal cycling between 5 degrees C and 55 degrees C for 10,000 cycles. The specimens were tested in a shear mode at a crosshead speed of 1.0 mm/minute. Two-way ANOVA, Student t-test and Tukey HSD test at a level of 0.05 were done. For specimens without prior acid etching, the mean bond strengths to bovine dentin ranged from 12.8 to 17.1 MPa and ranged from 6.7 to 13.3 MPa for specimens with prior acid etching after 24 hours storage in water. When the specimens were subjected to thermal cycling, the mean bond strengths ranged from 10.7 to 24.8 MPa for the specimens without prior acid etching and 4.6 to 13.9 MPa for the specimens with prior acid etching. The changes in dentin bond strength were different among the adhesive systems tested. Failure modes were commonly adhesive failure associated with mixed failure for specimens with prior acid etching. For specimens without prior acid etching, failures in composite and dentin were increased. From the results of this in vitro study, prior acid etching might be not acceptable for increasing the dentin bond strengths of single-step self-etch adhesive systems.

  4. The Analysis of Adhesively Bonded Advanced Composite Joints Using Joint Finite Elements

    NASA Technical Reports Server (NTRS)

    Stapleton, Scott E.; Waas, Anthony M.

    2012-01-01

    The design and sizing of adhesively bonded joints has always been a major bottleneck in the design of composite vehicles. Dense finite element (FE) meshes are required to capture the full behavior of a joint numerically, but these dense meshes are impractical in vehicle-scale models where a course mesh is more desirable to make quick assessments and comparisons of different joint geometries. Analytical models are often helpful in sizing, but difficulties arise in coupling these models with full-vehicle FE models. Therefore, a joint FE was created which can be used within structural FE models to make quick assessments of bonded composite joints. The shape functions of the joint FE were found by solving the governing equations for a structural model for a joint. By analytically determining the shape functions of the joint FE, the complex joint behavior can be captured with very few elements. This joint FE was modified and used to consider adhesives with functionally graded material properties to reduce the peel stress concentrations located near adherend discontinuities. Several practical concerns impede the actual use of such adhesives. These include increased manufacturing complications, alterations to the grading due to adhesive flow during manufacturing, and whether changing the loading conditions significantly impact the effectiveness of the grading. An analytical study is conducted to address these three concerns. Furthermore, proof-of-concept testing is conducted to show the potential advantages of functionally graded adhesives. In this study, grading is achieved by strategically placing glass beads within the adhesive layer at different densities along the joint. Furthermore, the capability to model non-linear adhesive constitutive behavior with large rotations was developed, and progressive failure of the adhesive was modeled by re-meshing the joint as the adhesive fails. Results predicted using the joint FE was compared with experimental results for various

  5. A study on the compatibility between one-bottle dentin adhesives and composite resins using micro-shear bond strength

    PubMed Central

    2015-01-01

    Objectives This study was performed to determine whether the combined use of one-bottle self-etch adhesives and composite resins from same manufacturers have better bond strengths than combinations of adhesive and resins from different manufacturers. Materials and Methods 25 experimental micro-shear bond test groups were made from combinations of five dentin adhesives and five composite resins with extracted human molars stored in saline for 24 hr. Testing was performed using the wire-loop method and a universal testing machine. Bond strength data was statistically analyzed using two way analysis of variance (ANOVA) and Tukey's post hoc test. Results Two way ANOVA revealed significant differences for the factors of dentin adhesives and composite resins, and significant interaction effect (p < 0.001). All combinations with Xeno V (Dentsply De Trey) and Clearfil S3 Bond (Kuraray Dental) adhesives showed no significant differences in micro-shear bond strength, but other adhesives showed significant differences depending on the composite resin (p < 0.05). Contrary to the other adhesives, Xeno V and BondForce (Tokuyama Dental) had higher bond strengths with the same manufacturer's composite resin than other manufacturer's composite resin. Conclusions Not all combinations of adhesive and composite resin by same manufacturers failed to show significantly higher bond strengths than mixed manufacturer combinations. PMID:25671210

  6. Non-classical adhesive-bonded joints in practical aerospace construction

    NASA Technical Reports Server (NTRS)

    Hart-Smith, L. J.

    1973-01-01

    Solutions are derived for adhesive-bonded joints of non-classical geometries. Particular attention is given to bonded doublers and to selective reinforcement by unidirectional composites. Non-dimensionalized charts are presented for the efficiency limit imposed on the skin as the result of the eccentricity in the load path through the doubler. It is desirable to employ a relativly large doubler to minimize the effective eccentricity in the load path. The transfer stresses associated with selective reinforcement of metal structures by advanced composites are analyzed. Reinforcement of bolt holes in composites by bonded metal doublers is covered quantitatively. Also included is the adhesive joint analysis for shear flow in a multi-cell torque box, in which the bond on one angle becomes more critical sooner than those on the others, thereby restricting the strength to less than the total of each maximum strength when acting alone. Adhesive plasticity and adherend stiffness and thermal imbalances are included. A simple analysis/design technique of solution in terms of upper and lower bounds on an all-plastic adhesive analysis is introduced.

  7. Adhesively bonded steel and composites-durability in substitute ocean water

    SciTech Connect

    Aartun, L.; Dillard, J.G.

    1996-12-31

    Ocean water, marine life and certain oil-well fluids constitute a highly aggressive environment for most metals. In the offshore oil industry, the economic driving force to seek new materials points towards polymeric composites which offer reduction of weight and elimination of corrosion. However, a combined use of steel and composites creates a joining problem. Exposure to humid air and liquid water affects adhesive bonds in a negative manner, and adhesively bonded metal systems are even less durable in marine than in non-ocean environments. In marine environments and sea coast atmospheres, marine life and salts can contribute to the degradation process. On an operating oil rig, repair and replacements involving adhesive bonding are forced to be carried out under non-ideal conditions because of environmental regulations (affecting surface treatments) and safety requirements (affecting the curing method). The objective of this work is to develop environmentally friendly surface preparations and to study, the influence of salt water on the durability of adhesively bonded steel/composite systems.

  8. The Environmental and Impact Resistance of Adhesively Bonded Thermoplastic Fibre Composites

    DTIC Science & Technology

    1992-11-01

    129 5.4.3 XPS Narrow Scan Spectra ................................................. 131 S5.4.4 Peak Synthesis ...crosslinking elastomers against reactive substrates. Klein et al. [17], using an infrared analysis, found evidence for covalent primary bonds between a...electron acceptor and electron donor e.g. amides and polyamides . The significance of these interactions to the intrinsic adhesion of polymeric materials

  9. Adhesion to tooth structure: a critical review of "micro" bond strength test methods.

    PubMed

    Armstrong, Steve; Geraldeli, Saulo; Maia, Rodrigo; Raposo, Luís Henrique Araújo; Soares, Carlos José; Yamagawa, Junichiro

    2010-02-01

    The objective of this paper is to critically review the literature regarding the mechanics, geometry, load application and other testing parameters of "micro" shear and tensile adhesion tests, and to outline their advantages and limitations. The testing of multiple specimens from a single tooth conserves teeth and allows research designs not possible using conventional 'macro' methods. Specimen fabrication, gripping and load application methods, in addition to material properties of the various components comprising the resin-tooth adhesive bond, will influence the stress distribution and consequently, the nominal bond strength and failure mode. These issues must be understood; as should the limitations inherent to strength-based testing of a complicated adhesive bond joining dissimilar substrates, for proper test selection, conduct and interpretation. Finite element analysis and comprehensive reporting of test conduct and results will further our efforts towards a standardization of test procedures. For the foreseeable future, both "micro" and "macro" bond strength tests will, as well as various morphological and spectroscopic investigative techniques, continue to be important tools for improving resin-tooth adhesion to increase the service life of dental resin-based composite restorations.

  10. Aircraft surface coatings study: Energy efficient transport program. [sprayed and adhesive bonded coatings for drag reduction

    NASA Technical Reports Server (NTRS)

    1979-01-01

    Surface coating materials for application on transport type aircraft to reduce drag, were investigated. The investigation included two basic types of materials: spray on coatings and adhesively bonded films. A cost/benefits analysis was performed, and recommendations were made for future work toward the application of this technology.

  11. Hybridization quality and bond strength of adhesive systems according to interaction with dentin

    PubMed Central

    Salvio, Luciana Andrea; Hipólito, Vinicius Di; Martins, Adriano Luis; de Goes, Mario Fernando

    2013-01-01

    Objective: To evaluate the hybridization quality and bond strength of adhesives to dentin. Materials and Methods: Ten human molars were ground to expose the dentin and then sectioned in four tooth-quarters. They were randomly divided into 5 groups according to the adhesive used: Two single-step self-etch adhesives – Adper Prompt (ADP) and Xeno III (XE), two two-step self-etching primer systems – Clearfil SE Bond (SE) and Adhe SE (ADSE), and one one-step etch-and-rinse system – Adper Single Bond (SB). Resin composite (Filtek Z250) crown buildups were made on the bonded surfaces and incrementally light-cured for 20 s. The restored tooth-quarters were stored in water at 37°C for 24 h and then sectioned into beams (0.8 mm2 in cross-section). Maximal microtensile bond strength (μ-TBS) was recorded (0.5 mm/min in crosshead speed). The results were submitted to one-way ANOVA and Tukey's test (α = 0.05). Thirty additional teeth were used to investigate the hybridization quality by SEM using silver methenamine or ammoniacal silver nitrate dyes. Results: SE reached significantly higher μ-TBS (P < 0.05); no significance was found between ADSE and XE (P > 0.05), and between SB and ADP (P > 0.05); ADSE and XE were significantly higher than SB and ADP (P < 0.05). The bonding interface of SB showed the most intense silver uptake. SE and ADSE showed more favorable hybridization quality than that observed for ADP and XE. Conclusions: The bond strength and hybridization quality were affected by the interaction form of the adhesives with dentin. The hybridization quality was essential to improve the immediate μ-TBS to dentin. PMID:24926212

  12. Effect of new adhesion promoter and mechanical interlocking on bonding strength in metal-polymer composites

    NASA Astrophysics Data System (ADS)

    Schuberth, A.; Göring, M.; Lindner, T.; Töberling, G.; Puschmann, M.; Riedel, F.; Scharf, I.; Schreiter, K.; Spange, S.; Lampke, T.

    2016-03-01

    There are various opportunities to improve the adhesion between polymer and metal in metal-plastic composites. The addition of a bonding agent which reacts with both joining components at the interfaces of the composite can enhance the bonding strength. An alternative method for the adjustment of interfaces in metal-plastic composites is the specific surface structuring of the joining partners in order to exploit the mechanical interlock effect. In this study the potential of using an adhesion promoter based on twin polymerization for metal-plastic composites in combination with different methods of mechanical surface treatment is evaluated by using the tensile shear test. It is shown that the new adhesion promoter has a major effect when applied on smooth metal surfaces. A combination of both mechanical and chemical surface treatment of the metal part is mostly just as effective as the application of only one of these surface treatment methods.

  13. Adhesive bond failure monitoring with triboluminescent optical fiber sensor

    NASA Astrophysics Data System (ADS)

    Shohag, Md Abu S.; Hammel, Emily C.; Olawale, David O.; Okoli, Okenwa O.

    2016-04-01

    One of the most severe damage modes in modern wind turbines is the failure of the adhesive joints in the trailing edge of the large composite blades. The geometrical shape of the blade and current manufacturing techniques make the trailing edge of the wind turbine blade more sensitive to damage. Failure to timely detect this damage type may result in catastrophic failures, expensive system downtime, and high repair costs. A novel sensing system called the In-situ Triboluminescent Optical Fiber (ITOF) sensor has been proposed for monitoring the initiation and propagation of disbonds in composite adhesive joints. The ITOF sensor combines the triboluminescent property of ZnS:Mn with the many desirable features of optical fiber to provide in-situ and distributed damage sensing in large composite structures like the wind blades. Unlike other sensor systems, the ITOF sensor does not require a power source at the sensing location or for transmitting damage-induced signals to the hub of the wind turbine. Composite parts will be fabricated and the ITOF integrated within the bondline to provide in-situ and real time damage sensing. Samples of the fabricated composite parts with integrated ITOF will be subjected to tensile and flexural loads, and the response from the integrated sensors will be monitored and analyzed to characterize the performance of the ITOF sensor as a debonding damage monitoring system. In addition, C-scan and optical microscopy will be employed to gain greater insights into the damage propagation behavior and the signals received from the ITOF sensors.

  14. Effect of Sodium Ascorbate and Delayed Bonding on the Bond Strength of Silorane and Two-step Self-etch Adhesive Systems in Bleached Enamel

    PubMed Central

    Abed Kahnemooyi, Mehdi; Ajami, Amir Ahmad; Kimyai, Soodabeh; Pournaghiazar, Fatemeh; Savadi Oskoee, Siavash; Mhammadi Torkani, Mohammad Ali

    2014-01-01

    Background and aims. Studies have shown decreased bond strength of composite resin to human and bovine bleached enamel. This study evaluated the effect of sodium ascorbate and delayed bonding on the bond strength of two adhesive systems to bleached enamel. Materials and methods. The labial surfaces of 150 sound bovine incisor teeth were abraded with abrasive paper. The teeth were randomly divided into 8 groups: A: control; B: bleached with 35% hydrogen peroxide; C: bleached with 35% hydrogen peroxide + sodium ascorbate gel; and D: bleached with 35% hydrogen peroxide + delayed bonding. In groups A‒D, silorane adhesive system and Filtek silorane composite resin were used. In groups E‒H, the same preparation methods of groups A-D were used. Two-step self-etch Clearfil SE Bond adhesive systems and AP-X composite resin were administered. Shear bond strength of each group was measured. Two samples were prepared for each surface preparation for ultra-structural evaluation. Two-way ANOVA and Tukey test were used for data analysis at P<0.05. Results. The interaction between the adhesive system type and surface preparation protocol was significant (P=0.014), withsignificant differences in shear bond strengths in terms of the adhesive systems (P<0.01). There were significant differences in shear bond strength in terms of surface preparation techniques irrespective of the adhesive system (P<0.01). Conclusion. The results showed that bleaching with 35% hydrogen peroxide decreased the shear bond strength values with both adhesive systems, and a one-week delay in bonding and 10% sodium ascorbate for10 minutes restored the bond strength in both adhesive systems. PMID:25587382

  15. Effects of long-term repeated topical fluoride applications and adhesion promoter on shear bond strengths of orthodontic brackets

    PubMed Central

    Endo, Toshiya; Ishida, Rieko; Komatsuzaki, Akira; Sanpei, Shinya; Tanaka, Satoshi; Sekimoto, Tsuneo

    2014-01-01

    Objective: The purpose of this study was to assess the effects of long-term repeated topical application of fluoride before bonding and an adhesion promoter on the bond strength of orthodontic brackets. Materials and Methods: A total of 76 bovine incisors were collected and divided equally into four groups. In group 1, the brackets were bonded without topical fluoride application or adhesion promoter. In group 2, before bonding, the adhesion promoter was applied to nonfluoridated enamel. In group 3, the brackets were bonded without the application of the adhesion promoter to enamel, which had undergone long-term repeated topical fluoride treatments. Teeth in group 4 received the long-term repeated topical applications of fluoride, and the brackets were bonded using the adhesion promoter. All the brackets were bonded using BeautyOrtho Bond self-etching adhesive. The shear bond strength was measured and the bond failure modes were evaluated with the use of the adhesive remnant index (ARI) after debonding. Results: The mean shear bond strength was significantly lower in group 3 than in groups 1, 2, and 4, and there were no significant differences between the groups except for group 3. There were significant differences in the distribution of ARI scores between groups 2 and 3, and between groups 3 and 4. Conclusions: The adhesion promoter can recover the bond strength reduced by the long-term repeated topical applications of fluoride to the prefluoridation level and had a significantly great amount of adhesives left on either fluoridated or nonfluoridated enamel. PMID:25512720

  16. Primary Adhesively Bonded Structure Technology (PABST). Phase 2. Detail Design

    DTIC Science & Technology

    1977-12-01

    stopper :,. v 7 is bonded under the longeron. The frame tee is cutout at this intersection to allow for the longeron. It is joggled to fit on top of the...frame, and (5) a filler. The fillers occupy the gaps under the tees which allows the tees to be made in straight pieces without joggles to reduce...and are Joggled on top of the teir-stoppers to minimize fatigue problems in the skin. A typical frame tee anu internal longeron intersection is shown

  17. Antibacterial effect and shear bond strength of an orthodontic adhesive cement containing Galla chinensis extract

    PubMed Central

    WANG, LU-FEI; LUO, FENG; XUE, CHAO-RAN; DENG, MENG; CHEN, CHEN; WU, HAO

    2016-01-01

    Galla chinensis extract (GCE), a naturally-derived agent, has a significant inhibitory effect on cariogenic bacteria. The present study aims to evaluate the antibacterial effect and shear bond strength of an orthodontic adhesive cement containing GCE. A resin-modified glass ionomer cement incorporated GCE at five mass fractions (0, 0.1, 0.2, 0.4, and 0.8%) to prepare GCE-containing cement for analysis. For the agar diffusion test, cement specimens were placed on agar disk inoculated with Streptococcus mutans (strain ATCC 25175). Following 48 h incubation, the inhibition halo diameter was measured. To assess bacteria colonization susceptibility, S. mutans adhesion to cement specimens was detected by scanning electron microscopy (SEM) following 48 h incubation. To evaluate bond strength, a total of 50 metal brackets were bonded on premolar surfaces by using cement (10 teeth/group). Following immersion in an artificial saliva for 3 days, shear bond strength (SBS) was measured. The results demonstrated that GCE-containing samples exhibited a larger bacterial inhibition halo than control, and the inhibition zone increased as the GCE mass fraction increased. SEM analysis demonstrated that S. mutans presented a weaker adherent capacity to all GCE-containing cements compared with control, but the difference between each GCE-containing group was not significant. SBS values of each GCE-containing group exhibited no difference compared with the control. In conclusion, GCE-containing adhesive cement exhibits a promising inhibitory effect on S. mutans growth and adhesion. Without compromising bond strength, adding GCE in adhesive cement may be an attractive option for preventing white spot lesions during orthodontic treatment. PMID:27073642

  18. In vitro analysis of shear bond strength and adhesive remnant index of different metal brackets

    PubMed Central

    Henkin, Fernanda de Souza; de Macêdo, Érika de Oliveira Dias; Santos, Karoline da Silva; Schwarzbach, Marília; Samuel, Susana Maria Werner; Mundstock, Karina Santos

    2016-01-01

    ABSTRACT Introduction: There is a great variety of orthodontic brackets in the Brazilian market, and constantly evaluating them is critical for professionals to know their properties, so as to be able to choose which product best suits their clinical practice. Objectives: To evaluate the bond strength and the adhesive remnant index (ARI) of different brands of metal brackets. Material and Methods: A total of 105 bovine incisors were used, and brackets of different brands were bonded to teeth. Seven different bracket brands were tested (MorelliTM, American OrthodonticsTM, TP OrthodonticsTM, Abzil-3MTM, OrthometricTM, TecnidentTM and UNIDENTM). Twenty-four hours after bonding, shear bond strength test was performed; and after debonding, the ARI was determined by using an optical microscope at a 10-fold increase. Results: Mean shear bond strength values ranged from 3.845 ± 3.997 (MorelliTM) to 9.871 ± 5.106 MPa (TecnidentTM). The majority of the ARI index scores was 0 and 1. Conclusion: Among the evaluated brackets, the one with the lowest mean shear bond strength values was MorelliTM. General evaluation of groups indicated that a greater number of bond failure occurred at the enamel/adhesive interface. PMID:28125142

  19. LONG-TERM BOND STRENGTH OF ADHESIVE SYSTEMS APPLIED TO ETCHED AND DEPROTEINIZED DENTIN

    PubMed Central

    Uceda-Gómez, Ninoshka; Loguercio, Alessandro Dourado; Moura, Sandra Kiss; Grande, Rosa Helena Miranda; Oda, Margareth; Reis, Alessandra

    2007-01-01

    The aim of this study was to evaluate the early and 12-month bond strength of two adhesive systems (Single Bond-SB and One Step-OS) applied to demineralized dentin (WH) and demineralized/NaOCl-treated dentin (H). Twenty flat dentin surfaces were exposed, etched, rinsed and slightly dried. For the H groups, a solution of 10% NaOCl was applied for 60 s, rinsed (15 s) and slightly dried. The adhesives were applied according to the manufacturer's instructions and composite resin crowns were incrementally constructed. After 24 h (water-37°C), the specimens was sectioned in order to obtain resin-dentin sticks (0.8 mm2). The specimens were tested in microtensile (0.5 mm/min) immediately (IM) or after 12 months of water storage (12M). The data (MPa) were subjected to ANOVA and Tukey's test (α=0.05). Only the main factors adhesive and time were significant (p=0.004 and p=0.003, respectively). SB (42.3±9.1) showed higher bond strengths than OS (33.6±11.6). The mean bond strength for IM-group (42.5±8.7) was statistically superior to 12M (33.3±11.8). The use of 10% NaOCl, after acid etching, did not improve the immediate and the long-term resin-dentin bond strength. PMID:19089183

  20. Evaluation of thiouracil-based adhesive systems for bonding cast silver-palladium-copper-gold alloy.

    PubMed

    Yamashita, Miyuki; Koizumi, Hiroyasu; Ishii, Takaya; Furuchi, Mika; Matsumura, Hideo

    2010-09-01

    This study aimed to evaluate the effect of adhesive systems based on a thiouracil monomer on bonding to silver-palladium-copper-gold (Ag-Pd-Cu-Au) alloy (Castwell M.C.12). Disk specimens were cast from the alloy and then air-abraded with alumina. The disks were bonded using six bonding systems selected from four primers and three luting materials. Shear bond strengths were determined both before and after thermocycling. Bond strength varied from 2.7 MPa to 32.0 MPa. Three systems based on a thiouracil monomer (MTU-6) showed durable bonding to the alloy, with post-thermocycling bond strengths of 22.4 MPa for the Metaltite (MTU-6) primer and Super-Bond, a tri-n-butylborane (TBB) initiated resin, 9.0 MPa for the Multi-Bond II resin, and 8.1 MPa for the Metaltite and Bistite II system. It can be concluded that a combination of thiouracil-based primer and TBB initiated resin is effective for bonding Ag-Pd-Cu-Au alloy.

  1. Effect of bond thickness on fracture and fatigue strength of adhesively bonded composite joints

    NASA Technical Reports Server (NTRS)

    Mall, S.; Ramamurthy, G.

    1989-01-01

    An experimental investigation of composite to composite bonded joints was undertaken to study the effect of bond thickness on debond growth rate under cyclic loading and critical strain energy release rate under static loading. Double cantilever beam specimens of graphite/epoxy adherends bonded with EC 3445 were tested under mode I loading. A different behavior of fracture and fatigue strength was observed with variation of bondline thickness.

  2. Fracture resistance of zirconia FPDs with adhesive bonding versus conventional cementation.

    PubMed

    Rosentritt, Martin; Hmaidouch, Rim; Behr, Michael; Handel, Gerhard; Schneider-Feyrer, Sibylle

    2011-01-01

    This study investigated the fracture resistance of three different zirconia fixed partial dentures (FPDs) with different cementation methods. Forty-eight three-unit FPDs were adhesively bonded (AB) or conventionally cemented (CC). Sixteen glass-infiltrated zirconia FPDs were used as a control. Fracture resistance was determined after aging. The zirconia systems showed no significant different fracture forces with the different bonding methods (CC: Cercon [1,231.5 ± 410.1 N], Ceramill [1,311.3 ± 318.3 N], Vita YZ [1,269.0 ± 317.4 N]; AB: Cercon [1,072.3 ± 516.7 N], Ceramill [1,358.6 ± 176.4 N], Vita YZ [1,270.6 ± 267.6N]) or between the different materials. The control group provided significantly lower fracture strength. Regarding fracture resistance, adhesive bonding or conventional cementation of zirconia FPDs showed no restrictions for posterior application.

  3. The bond strength of different tray adhesives on vinyl polysiloxane to two tray materials: an in vitro study.

    PubMed

    Ashwini, B L; Manjunath, S; Mathew, K Xavier

    2014-03-01

    There has been no established chemical bonding between custom tray resin and the elastomeric impression materials without the use of manufacturer's recommended specific tray adhesive. The present study was aimed to compare the bond strength of the manufacturer recommended tray adhesives with the universal tray adhesives using the medium body consistency vinyl polysiloxane (VPS) material and custom tray made of autopolymerising resin and visible light cure (VLC) resin. A total 90 cubicle specimens of autopolymerising resin and 90 specimens of VLC resin were tested for its tensile bond strength. Effectiveness of universal tray adhesive was compared with manufactured tray adhesive. Each of these specimens was then subjected to tensile load in hounsefield universal testing machine at a cross head speed of 5 mm/min and the results were compared and evaluated using one way analysis of variance and post hoc Tuckey's test. Analysis of bond strength revealed that the universal tray adhesive showed better strength and was statiscally significant when compared to the manufacture supplied tray adhesive. Comparison between both the groups, VLC resin showed better bond strength as compared to autopolymerizing resin. Universal tray adhesive had better tensile bond strength than the manufacturers recommended tray adhesive with the medium body viscosity VPS impression material for both autopolymerising and VLC tray resin.

  4. Comparisons of two approaches for removing excess adhesive during the bonding procedure.

    PubMed

    Bishara, S E; VonWald, L; Olsen, M E; Laffoon, J F

    2000-04-01

    The purpose of this study was to compare the effects on shear bond strength of removing excess adhesive from around the bracket base at 2 time periods: (1) immediately after placing the bracket on the tooth, and (2) after subjecting the adhesive to 5 seconds of light curing to initially secure the bracket in its proper position. The debonding forces were evaluated at 2 times; within half an hour after bonding and after storing for 24 hours in water at 37 degrees qC. These comparisons will help determine the most advantageous time for the clinician to remove excess adhesive from around the brackets during the bonding process. The teeth were randomly divided into 4 groups according to: (a) the time of removal of the excess adhesive from around the bracket base namely; immediately after placing the bracket or after 5 seconds of light cure and (b) the time of debonding the brackets, namely within half an hour or after 24 hours. Shear bond strength was measured using a Zwick test machine and calculated in Megapascals. The results of the analysis of variance (F = 35.05) comparing the 4 experimental groups indicated the presence of significant differences between all 4 groups (P = .0001). In general, the shear bond strengths were significantly larger for the 2 groups debonded after 24 hours, whether they were light cured for a total of 40 seconds (X = 8.8 +/- 3.6 MPa) or 45 seconds (X = 6.9 +/- 3.4 MPa). On the other hand, the shear bond strengths was significantly lower in the 2 groups debonded within half an hour from their initial bonding, whether light cured for 40 seconds (X = 0.4 +/- 1.0 MPa) or 45 seconds (X = 3.4 +/- 2.7 MPa). In conclusion, the additional 5 seconds of light cure significantly increased the initial shear bond strength. On the other hand, removing excess adhesive after 5 seconds of light cure significantly decreased the shear bond strength at 24 hours.

  5. Locally measuring the adhesion of InP directly bonded on sub-100 nm patterned Si

    NASA Astrophysics Data System (ADS)

    Pantzas, K.; Le Bourhis, E.; Patriarche, G.; Troadec, D.; Beaudoin, G.; Itawi, A.; Sagnes, I.; Talneau, A.

    2016-03-01

    A nano-scale analogue to the double cantilever experiment that combines instrumented nano-indentation and atomic force microscopy is used to precisely and locally measure the adhesion of InP bonded on sub-100 nm patterned Si using oxide-free or oxide-mediated bonding. Surface-bonding energies of 0.548 and 0.628 J m-2, respectively, are reported. These energies correspond in turn to 51% and 57% of the surface bonding energy measured in unpatterned regions on the same samples, i.e. the proportion of unetched Si surface in the patterned areas. The results show that bonding on patterned surfaces can be as robust as on unpatterned surfaces, provided care is taken with the post-patterning surface preparation process and, therefore, open the path towards innovative designs that include patterns embedded in the Si guiding layer of hybrid III-V/Si photonic integrated circuits.

  6. Effects of Type I Collagen Degradation on the Durability of Three Adhesive Systems in the Early Phase of Dentin Bonding

    PubMed Central

    Hu, Lin; Xiao, Yu-hong; Fang, Ming; Gao, Yu; Huang, Li; Jia, An-qi; Chen, Ji-hua

    2015-01-01

    Objective This study was designed to evaluate the effects of type I collagen degradation on the durability of three adhesive systems in the early phase of dentin bonding. Methods Bonded dentin specimens were prepared using three different types of adhesive systems. Micro-tensile bond strength and degradation of collagen were tested before, and after 1 month or 4 months of aging in artificial saliva. The relationship between micro-tensile bond strength and collagen degradation was analyzed by calculating their Pearson’s correlation coefficient. Results Aging induced time-dependent reduction in micro-tensile bond strengths for all the tested adhesive systems, although such reduction for the single-step self-etching adhesive G-Bond (GB) was not statistically significant. The bond strength of the two-step self-etching primer adhesive system Clearfil SE Bond (SEB) was similar to that of the two-step etch-and-rinse self-priming adhesive system Single Bond 2 (SB), and they were both significantly reduced after one or four months of aging. A negative correlation was found between the degree of collagen degradation and magnitude of micro-tensile bond strength (r = - 0.65, p = 0.003). The Pearson’s correlation coefficient was 0.426, indicating that 42.6% of the aging-induced reduction in bond strength can be explained by the degradation of collagen. Conclusions In the early phase of dentin bonding, there was a negative correlation between the degree of collagen degradation and the magnitude of micro-tensile bond strength. The reduction of bond strength was accompanied by the degradation of collagen. These results provide evidence for the causative relationship between the degradation of collagen and the deterioration of dentin-adhesive interface. PMID:25689141

  7. Installation of adhesively bonded composites to repair carbon steel structure.

    SciTech Connect

    Roach, Dennis Patrick; Dunn, Dennis P.; Rackow, Kirk A.

    2003-02-01

    In the past decade, an advanced composite repair technology has made great strides in commercial aviation use. Extensive testing and analysis, through joint programs between the Sandia Labs FAA Airworthiness Assurance Center and the aviation industry, have proven that composite materials can be used to repair damaged aluminum structure. Successful pilot programs have produced flight performance history to establish the viability and durability of bonded composite patches as a permanent repair on commercial aircraft structures. With this foundation in place, efforts are underway to adapt bonded composite repair technology to civil structures. This paper presents a study in the application of composite patches on large trucks and hydraulic shovels typically used in mining operations. Extreme fatigue, temperature, erosive, and corrosive environments induce an array of equipment damage. The current weld repair techniques for these structures provide a fatigue life that is inferior to that of the original plate. Subsequent cracking must be revisited on a regular basis. It is believed that the use of composite doublers, which do not have brittle fracture problems such as those inherent in welds, will help extend the structure's fatigue life and reduce the equipment downtime. Two of the main issues for adapting aircraft composite repairs to civil applications are developing an installation technique for carbon steel structure and accommodating large repairs on extremely thick structures. This paper will focus on the first phase of this study which evaluated the performance of different mechanical and chemical surface preparation techniques. The factors influencing the durability of composite patches in severe field environments will be discussed along with related laminate design and installation issues.

  8. Do matrix metalloproteinase inhibitors improve the bond durability of universal dental adhesives?

    PubMed

    Tekçe, Neslihan; Tuncer, Safa; Demirci, Mustafa; Balci, Sibel

    2016-11-01

    The aim of this study was to evaluate the effects of matrix metalloproteinases (MMPs) inhibitors on the microtensile bond strength (μTBS) and the adhesive-dentin interface of two universal dentin bonding agents, Single Bond Universal and All Bond Universal, after 12 months of water storage. Seventy extracted, caries-free, human third molars were used in this study. Of these, 50 were used for μTBS testing and 20 were used for scanning electron microscopy. The two bonding agents were applied to flat dentin surfaces in five different ways: self-etch mode, etch-and-rinse mode with 37% phosphoric acid, etch-and-rinse mode with phosphoric acid containing 1% benzalkonium chloride, etch-and-rinse mode with phosphoric acid and 2% chlorhexidine, and etch-and-rinse mode with 0.5 M ethylenediaminetetraacetic acid (EDTA) (n = 5 for each bonding agent in each group; N = 50). Half the specimens were subjected to μTBS tests at 24 h, while half were subjected to the tests after 12 months of water storage. For each bonding agent, inhibition, storage, and their interaction effects were tested by two-way analysis of variance and Bonferroni tests. For Single Bond Universal, the benzalkonium chloride (p = 0.024) and chlorhexidine groups (p = 0.033) exhibited significantly higher μTBS values at 24 h compared with the self-etch group. For All Bond Universal, all groups displayed similar bond strengths at 24 h (p > 0.05). After 12 months of water storage, the μTBS values decreased significantly in the benzalkonium chloride group for Single Bond Universal (p = 0.001) and the self-etch (p = 0.029), chlorhexidine (p = 0.046), and EDTA (p = 0.032) groups for All Bond Universal. These results suggest that the immediate dentin bond strength increases when universal bonding systems are applied in the etch-and-rinse mode, although the durability decreases. The use of chlorhexidine and EDTA can increase the bond durability of mild adhesives such as

  9. Dichromatic InGaN-based white light emitting diodes by using laser lift-off and wafer-bonding schemes

    NASA Astrophysics Data System (ADS)

    Lee, Y. J.; Lin, P. C.; Lu, T. C.; Kuo, H. C.; Wang, S. C.

    2007-04-01

    An InGaN-based dual-wavelength blue/green (470nm/550nm) light emitting diode (LED) with three terminal operations has been designed and fabricated by using sapphire laser lift-off and wafer-bonding schemes. The device is equivalent to a parallel connection of blue and green LEDs; thus the effective electrical resistance of the device could be reduced. The luminous efficiency is 40lm/W at 20mA, accompanied by a broad electroluminescence emission with a combination of blue and green colors. This monolithically integrated dichromatic lighting structure has great potential in the application of the solid-state lighting.

  10. Influence of Adhesives and Methods of Enamel Pretreatment on the Shear Bond Strength of Orthodontic Brackets

    PubMed Central

    Jurišić, Sanja; Jurišić, Gordan

    2015-01-01

    Aim The objective of present study was to examine influence of adhesives and methods of enamel pretreatment on the shear bond strength (SBS) of orthodontic brackets. The adhesives used were resin-reinforced glass ionomer cements-GIC (Fuji Ortho LC) and composite resin (Transbond XT). Material and Methods The experimental sample consisted of 80 extracted human first premolars. The sample was divided into four equal groups, and the metal brackets were bonded with different enamel pretreatments by using two adhesives: group A-10% polyacrylic acid; Fuji Ortho LC, group B–37% phosphoric acid; Fuji Ortho LC, group C–self etching primer; Transbond XT, group D–37% phosphoric acid, primer; Transbond XT. SBS of brackets was measured. After debonding of brackets, the adhesive remnant index (ARI) was evaluated. Results After the statistical analysis of the collected data was performed (ANOVA; Sheffe post-hoc test), the results showed that significantly lower SBS of the group B was found in relation to the groups C (p=0.031) and D (p=0.026). The results of ARI were similar in all testing groups and it was not possible to determine any statistically significant difference of the ARI (Chi- square test) between all four experimental groups. Conclusion The conclusion is that the use of composite resins material with appropriate enamel pretreatment according to manufacturer’s recommendation is the “gold standard” for brackets bonding for fixed orthodontic appliances. PMID:27688410

  11. Nondestructive Evaluation of Adhesively Bonded Joints by Acousto-Ultrasonic Technique and Acoustic Emission

    NASA Technical Reports Server (NTRS)

    Nayeb-Hashemi, Hamid; Rossettos, J. N.

    1997-01-01

    Reliable applications of adhesively bonded joints require an effective nondestructive evaluation technique for their bond strength prediction. To properly evaluate factors affecting bond strength, effects of defects such as voids and disbonds on stress distribution in the overlap region must be understood. At the same time, in order to use acousto-ultrasonic (AU) technique to evaluate bond quality, the effect of these defects on dynamic response of single lap joints must be clear. The stress distribution in a single lap joint with and without defects (void or disbond) is analyzed. A bar-Theta parameter which contains adherend and adhesive thickness and properties is introduced. It is shown for bonded joints with bar-Theta greater than 10, that a symmetric void or disbond in the middle of overlap up to the 70 percent of overlap length has negligible effect on bond strength. In contrast frequency response analyses by a finite element technique showed that the dynamic response is affected significantly by the presence of voids or disbonds. These results have direct implication in the interpretations of AU results. Through transmission attenuation and a number of AU parameters for various specimens with and without defects are evaluated. It is found that although void and disbond have similar effects on bond strength (stress distribution), they have completely different effects on wave propagation characteristics. For steel-adhesive-steel specimens with voids, the attenuation changes are related to the bond strength. However, the attenuation changes for specimens with disbond are fairly constant over a disbond range. In order to incorporate the location of defects in AU parameters, a weighting function is introduced. Using an immersion system with focused transducers, a number of AU parameters are evaluated. It is found that by incorporating weighting functions in these parameters better sensitivities (AU parameters vs. bond strength) are achieved. Acoustic emission

  12. Effect of ethanol-wet bonding with hydrophobic adhesive on caries-affected dentine.

    PubMed

    Huang, Xueqing; Li, Li; Huang, Cui; Du, Xijin

    2011-08-01

    Frequently encountered in clinical practice, caries-affected dentine (CAD) is the most challenging bonding substrate. This study evaluated the effect of ethanol-wet bonding with hydrophobic adhesive to sound dentine and to CAD. In the control groups, prepared sound dentine and CAD were bonded with Adper Single Bond 2 using a traditional water-wet bonding technique. In the experimental groups, the specimens were treated as follows: Group 1, rinsed with stepwise ethanol dehydration; Group 2, immersion in 100% ethanol, three times, for 20 s each time; and Group 3, immersion in 100% ethanol for 20 s. Microtensile bond strength (μTBS) testing was used to evaluate the effects of the different protocols on bonding. The microhardness of debonded dentine surfaces was measured to ensure the presence of CAD. Interfacial nanoleakage was evaluated by field-emission scanning electron microscopy. Treatment significantly improved the μTBS in CAD in Groups 1 and 2, but had no effect on Group 3. Conversely, treatment significantly reduced the μTBS in sound dentine in Groups 2 and 3, but had no effect in Group 1. The presence of nanoleakage varied with the ethanol-wet protocol used. In conclusion, ethanol-wet bonding can potentially improve bond efficacy to CAD when an appropriate protocol is used.

  13. The durability of adhesively bonded titanium: Performance of plasma-sprayed polymeric coating pretreatments

    SciTech Connect

    Jackson, F.; Dillard, J.; Dillard, D.

    1996-12-31

    The role of a surface treatment of an adherend is to promote highly stable adhesive-adherend interactions; high stability is accomplished by making the chemistry of the adherend and adhesive compatible. The common surface preparations used to enhance durability include grit blasting, chromic acid or sodium hydroxide anodization, and other chemical treatments for titanium. As interest has grown in the development of environmentally benign surface treatments, other methods have been explored. In this study, plasma-sprayed polymeric materials have been evaluated as a surface coating pretreatment for adhesively bonding titanium alloy. Polyimide and polyether powders were plasm-sprayed onto grit-blasted titanium-6Al-4V. The alloy was adhesively bonded using a high performance polyimide adhesive. The coating was characterized using surface sensitive analytical measurements. The durability performance of the plasma-sprayed adherends was compared to the performance for chromic acid anodized titanium. Among the plasma-sprayed coatings, a LaRC-TPI polyimide-based coating exhibited performance comparable to that for chromic acid anodized specimens.

  14. Superplastic Forming/Adhesive Bonding of Aluminum (SPF/AB) Multi-Sheet Structures

    NASA Technical Reports Server (NTRS)

    Wagner, John A. (Technical Monitor); Will, Jeff D.; Cotton, James D.

    2003-01-01

    A significant fraction of airframe structure consists of stiffened panels that are costly and difficult to fabricate. This program explored a potentially lower-cost processing route for producing such panels. The alternative process sought to apply concurrent superplastic forming and adhesive bonding of aluminum alloy sheets. Processing conditions were chosen to balance adequate superplasticity of the alloy with thermal stability of the adhesive. As a first objective, an air-quenchable, superplastic aluminum-lithium alloy and a low-volatile content, low-viscosity adhesive with compatible forming/curing cycles were identified. A four-sheet forming pack was assembled which consisted of a welded two-sheet core separated from the face sheets by a layer of adhesive. Despite some preliminary success, of over 30 forming trials none was completely successful. The main problem was inadequate superplasticity in the heat-affected zones of the rib welds, which generally fractured prior to completion of the forming cycle. The welds are a necessary component in producing internal ribs by the 'four-sheet' process. Other challenges, such as surface preparation and adhesive bonding, were adequately solved. But without the larger issue of tearing at the weld locations, complex panel fabrication by SPF/AB does not appear viable.

  15. A Single-Lap Joint Adhesive Bonding Optimization Method Using Gradient and Genetic Algorithms

    NASA Technical Reports Server (NTRS)

    Smeltzer, Stanley S., III; Finckenor, Jeffrey L.

    1999-01-01

    A natural process for any engineer, scientist, educator, etc. is to seek the most efficient method for accomplishing a given task. In the case of structural design, an area that has a significant impact on the structural efficiency is joint design. Unless the structure is machined from a solid block of material, the individual components which compose the overall structure must be joined together. The method for joining a structure varies depending on the applied loads, material, assembly and disassembly requirements, service life, environment, etc. Using both metallic and fiber reinforced plastic materials limits the user to two methods or a combination of these methods for joining the components into one structure. The first is mechanical fastening and the second is adhesive bonding. Mechanical fastening is by far the most popular joining technique; however, in terms of structural efficiency, adhesive bonding provides a superior joint since the load is distributed uniformly across the joint. The purpose of this paper is to develop a method for optimizing single-lap joint adhesive bonded structures using both gradient and genetic algorithms and comparing the solution process for each method. The goal of the single-lap joint optimization is to find the most efficient structure that meets the imposed requirements while still remaining as lightweight, economical, and reliable as possible. For the single-lap joint, an optimum joint is determined by minimizing the weight of the overall joint based on constraints from adhesive strengths as well as empirically derived rules. The analytical solution of the sin-le-lap joint is determined using the classical Goland-Reissner technique for case 2 type adhesive joints. Joint weight minimization is achieved using a commercially available routine, Design Optimization Tool (DOT), for the gradient solution while an author developed method is used for the genetic algorithm solution. Results illustrate the critical design variables

  16. Investigation of the impact of cleaning on the adhesive bond and the process implications

    SciTech Connect

    EMERSON,JOHN A.; GUESS,TOMMY R.; ADKINS,CAROL L. JONES; CURRO,JOHN G.; REEDY JR.,EARL DAVID; LOPEZ,EDWIN P.; LEMKE,PAUL A.

    2000-05-01

    While surface cleaning is the most common process step in DOE manufacturing operations, the link between a successful adhesive bond and the surface clean performed before adhesion is not well understood. An innovative approach that combines computer modeling expertise, fracture mechanics understanding, and cleaning experience to address how to achieve a good adhesive bond is discussed here to develop a capability that would result in reduced cleaning development time and testing, improved bonds, improved manufacturability, and even an understanding that leads to improved aging. A simulation modeling technique, polymer reference interaction site model applied near wall (Wall PRISM), provided the capability to include contaminants on the surface. Calculations determined an approximately 8% reduction in the work of adhesion for 1% by weight of ethanol contamination on the structure of a silicone adhesive near a surface. The demonstration of repeatable coatings and quantitative analysis of the surface for deposition of controlled amounts of contamination (hexadecane and mineral oil) was based on three deposition methods. The effect of the cleaning process used on interfacial toughness was determined. The measured interfacial toughness of samples with a Brulin cleaned sandblasted aluminum surface was found to be {approximately} 15% greater than that with a TCE cleaned aluminum surface. The sensitivity of measured fracture toughness to various test conditions determined that both interfacial toughness and interface corner toughness depended strongly on surface roughness. The work of adhesion value for silicone/silicone interface was determined by a contact mechanics technique known as the JKR method. Correlation with fracture data has allowed a better understanding between interfacial fracture parameters and surface energy.

  17. Dentin bond strength of an adhesive system irradiated with an Nd:YAG laser

    NASA Astrophysics Data System (ADS)

    Ruschel, V. C.; Malta, D. A. M. P.; Monteiro, S., Jr.

    2016-11-01

    The objective of this study was to evaluate the microtensile bond strength of an adhesive system applied to dentin, followed by Nd:YAG laser irradiation. Twenty-two recently extracted third molars were divided into four groups (n  =  5). In the G1 and G2 groups, the adhesive system was applied conventionally, and in groups G3 and G4, the adhesive system was irradiated with an Nd:YAG laser (100 J cm-2). The specimens were stored in distilled water at 37 °C, those in groups G1 and G3 for 24 h, and those in groups G2 and G4 for 3 months. Two teeth from groups G1 and G3 were used for observation of the hybrid layer, using a confocal microscope (n  =  1). The teeth were submitted to a microtensile bond strength test. Analysis of the type of fracture was performed using a stereoscope (40×). The results for microtensile bond strength (MPa) and standard deviation (±SD) were: G1—31.68 (5.14); G2—37.88 (±5.04) G3—35.32 (±8.79) G4—31.53 (±9.01). There were no significant differences among the groups (p  >  0.05). Adhesive failure was predominant in all the groups. The Nd:YAG laser irradiation of the adhesives did not influence dentin bond strength during the periods of 24 h or 3 months of storage in distilled water.

  18. INFLUENCE OF DIFFERENT ADHESIVE SYSTEMS ON THE PULL-OUT BOND STRENGTH OF GLASS FIBER POSTS

    PubMed Central

    da Silva, Luciana Mendonça; de Andrade, Andréa Mello; Machuca, Melissa Fernanda Garcia; da Silva, Paulo Maurício Batista; da Silva, Ricardo Virgolino C.; Veronezi, Maria Cecília

    2008-01-01

    This in vitro study evaluated the tensile bond strength of glass fiber posts (Reforpost – Angelus-Brazil) cemented to root dentin with a resin cement (RelyX ARC – 3M/ESPE) associated with two different adhesive systems (Adper Single Bond - 3M/ESPE and Adper Scotchbond Multi Purpose (MP) Plus – 3M/ESPE), using the pull-out test. Twenty single-rooted human teeth with standardized root canals were randomly assigned to 2 groups (n=10): G1- etching with 37% phosphoric acid gel (3M/ESPE) + Adper Single Bond + #1 post (Reforpost – Angelus) + four #1 accessory posts (Reforpin – Angelus) + resin cement; G2- etching with 37% phosphoric acid gel + Adper Scotchbond MP Plus + #1 post + four #1 accessory posts + resin cement. The specimens were stored in distilled water at 37°C for 7 days and submitted to the pull-out test in a universal testing machine (EMIC) at a crosshead speed of 0.5 mm/min. The mean values of bond strength (kgf) and standard deviation were: G1- 29.163 ± 7.123; G2- 37.752 ±13.054. Statistical analysis (Student's t-test; α=0.05 showed no statistically significant difference (p<0.05) between the groups. Adhesive bonding failures between resin cement and root canal dentin surface were observed in both groups, with non-polymerized resin cement in the apical portion of the post space when Single Bond was used (G1). The type of adhesive system employed on the fiber post cementation did not influence the pull-out bond strength. PMID:19089224

  19. TECHNICAL NOTE: Silicon MEMS probe using a simple adhesive bonding process for permittivity measurement

    NASA Astrophysics Data System (ADS)

    Kim, Jung-Mu; Oh, Dong Hoon; Yoon, Jeonghoon; Cho, Sungjoon; Kim, Namgon; Cho, Jeiwon; Kwon, Youngwoo; Cheon, Changyul; Kim, Yong-Kweon

    2005-11-01

    We developed a silicon MEMS probe for permittivity measurements using an adhesive bonding process. Only two photolithographic masks are required to fabricate the probe, which can be implemented through simple bonding processes using silicon substrates and a benzo cyclo butene (BCB) adhesive layer. Undoped silicon substrates with thicknesses of 300 µm are used as the dielectric layers of the proposed probe. BCB layers, which have good electrical properties at high frequencies as well as adhesive properties for the bonding process, play the role of bonding materials between the two silicon substrates. The length of the probe is 30 mm, and the aperture located at the tip of the probe is 1.1 mm × 0.62 mm. The permittivity of 0.5% saline was measured, and the results agreed with the values obtained through the Cole Cole equation. To validate the feasibility of this probe for practical biological applications, we also performed in vivo measurements of the muscle, skin and blood of mice. Due to the simple fabrication process, the cost of the probe can be reduced in comparison with the previous micromachined probe (Kim et al 2005 J. Micromech. Microeng. 15 543 50) as well as the conventional laser machined probe. Low cost leads to disposability, which is an important factor for practical biomedical applications; and thus, coupled with the probe's capabilities of MMIC integration and CMOS compatibility, this probe has excellent potential in the field of microwave permittivity measurements.

  20. Elastomer toughened polyimide adhesives. [bonding metal and composite material structures for aircraft and spacecraft

    NASA Technical Reports Server (NTRS)

    St.clair, A. K.; St.clair, T. L. (Inventor)

    1985-01-01

    A rubber-toughened, addition-type polyimide composition is disclosed which has excellent high temperature bonding characteristics in the fully cured state and improved peel strength and adhesive fracture resistance physical property characteristics. The process for making the improved adhesive involves preparing the rubber-containing amic acid prepolymer by chemically reacting an amine-terminated elastomer and an aromatic diamine with an aromatic dianhydride with which a reactive chain stopper anhydride has been mixed, and utilizing solvent or mixture of solvents for the reaction.

  1. Permeability testing of composite material and adhesive bonds for the DC-XA composite feedline program

    NASA Technical Reports Server (NTRS)

    Nettles, A. T.

    1995-01-01

    Hercules IM7/8552 carbon/epoxy and Hysol EA 9394 epoxy adhesive bonded between composite/titanium were tested for permeability after various numbers of thermal cycles between 100 C and liquid nitrogen (-196 C). The specimens were quenched from the 100 C temperature into liquid nitrogen to induce thermal shock into the material. Results showed that the carbon/epoxy system was practically impermeable even after 12 thermal cycles. The EA 9394 adhesive bondline was more permeable than the carbon/epoxy, but vacuum mixing minimized the permeability and kept it within allowable limits. Thermal cycling had little effect on the permeability values of the bondline specimens.

  2. Bond Strength and Interfacial Morphology of Different Dentin Adhesives in Primary Teeth

    PubMed Central

    Vashisth, Pallavi; Mittal, Mudit; Goswami, Mousumi; Chaudhary, Seema; Dwivedi, Swati

    2014-01-01

    Objective: To evaluate the interfacial morphology and the bond strength produced by the three-step, two-step and single-step bonding systems in primary teeth. Materials and Methods: Occlusal surfaces of 72 extracted human deciduous teeth were ground to expose the dentin. The teeth were divided into four groups: (a) Scotchbond Multipurpose (3M, ESPE), (b) Adh Se (Vivadent), (d) OptiBond All-in-One (Kerr) and (e)Futurabond NR (VOCO, Cuxhaven, Germany). The adhesives were applied to each group following the manufacturer’s instructions. Then, teeth from each group were divided into two groups: (A) For viewing interfacial morphology (32 teeth), with 8 teeth in each group, and (B) For measurement of bond strength (40 teeth), with 10 teeth in each group. All the samples were prepared for viewing under SEM. The statistical analysis was done using SPSS version 15.0 software. Results: Observational measurement of tag length in different adhesives revealed that Scotchbond had the most widely spread values with a range from 12.20 to 89.10μm while OptiBond AIO had the narrowest range (0 to 22.50). The bond strength of Scotchbond Multipurpose was significantly higher (7.4744±1.88763) (p<0.001) as compared to Futurabond NR (3.8070±1.61345), Adhe SE (4.4478 ± 1.3820) and OptiBond-all-in-one (4.4856±1.07925). Conclusion: The three-step bonding system showed better results as compared to simplified studied bonding systems PMID:24910694

  3. Dentin bond strength of a fluoride-releasing adhesive system submitted to pH-cycling.

    PubMed

    Costa, Ana Rosa; Correr-Sobrinho, Lourenço; Ambrosano, Glaucia Maria Bovi; Sinhoreti, Mario Alexandre Coelho; Borges, Gilberto Antonio; Platt, Jeffrey A; Puppin-Rontani, Regina Maria

    2014-01-01

    To evaluate the microtensile bond strength (µTBS) of a fluoride-containing adhesive system submitted to a pH-cycling and storage time regimen for primary outcomes. As secondary outcomes the fluoride released amount was evaluated. Twelve dentin surfaces from sound third molar were divided into 2 groups according to adhesive systems: Clearfil SE Protect (PB) and Clearfil SE Bond (SE). Sticks obtained (1.0 mm2) from teeth were randomly divided into 3 subgroups according to storage regimen model: immediate (24h); 5-month deionized water (W); and pH-cycling model (C). All sticks were tested for µTBS in a universal testing machine. Fluoride concentration was obtained from 1-4 days and 30-day in W and 1-4 days in demineralization (DE)/remineralization (RE) solutions from C, using a fluoride-specific electrode. µTBS and fluoride released data were, respectively, submitted to ANOVA in a split plot design and Tukey, and Friedman' tests (a=0.05). There was no significant interaction between adhesive system and storage regimen for µTBS. W showed the lowest µTBS values. There was no significant difference between 24 h and C models for µTBS. There was no significant difference between adhesive systems. Failure mode was predominantly cohesive within composite for the 24 h and W, for the C group it was mixed for SE and cohesive within composite for PB adhesive system. Fluoride concentrations in the DE/RE solutions were less than 0.03125 ppm and not detected in W. In conclusion, the fluoride-containing adhesive system performed similarly to the regular one. Hydrolytic degradation is the main problem with both adhesive systems, regardless of fluoride contents.

  4. Electrostatic bonding of thin (cycle sine 3 mil) 7070 cover glass to Ta2O5 AR-coated thin (cycle sine 2 mil) silicon wafers and solar cells

    NASA Technical Reports Server (NTRS)

    Egelkrout, D. W.

    1981-01-01

    Electrostatic bonding of thin cover glass to thin solar cells was researched. Silicon solar cells, wafers, and Corning 7070 glass of from about 0.002" to about 0.003" in thickness were used in the investigation to establish optimum parameters for producing mechanically acceptable bonds while minimizing thermal stresses and resultant solar cell electrical parameter degradation.

  5. Effect of EDTA Conditioning and Carbodiimide Pretreatment on the Bonding Performance of All-in-One Self-Etch Adhesives

    PubMed Central

    Singh, Shipra; Nagpal, Rajni; Tyagi, Shashi Prabha; Manuja, Naveen

    2015-01-01

    Objective. This study evaluated the effect of ethylenediaminetetraacetic acid (EDTA) conditioning and carbodiimide (EDC) pretreatment on the shear bond strength of two all-in-one self-etch adhesives to dentin. Methods. Flat coronal dentin surfaces were prepared on one hundred and sixty extracted human molars. Teeth were randomly divided into eight groups according to two different self-etch adhesives used [G-Bond and OptiBond-All-In-One] and four different surface pretreatments: (a) adhesive applied following manufacturer's instructions; (b) dentin conditioning with 24% EDTA gel prior to application of adhesive; (c) EDC pretreatment followed by application of adhesive; (d) application of EDC on EDTA conditioned dentin surface followed by application of adhesive. Composite restorations were placed in all the samples. Ten samples from each group were subjected to immediate and delayed (6-month storage in artificial saliva) shear bond strength evaluation. Data collected was subjected to statistical analysis using three-way ANOVA and post hoc Tukey's test at a significance level of p < 0.05.  Results and Conclusion. EDTA preconditioning as well as EDC pretreatment alone had no significant effect on the immediate and delayed bond strengths of either of the adhesives. However, EDC pretreatment on EDTA conditioned dentin surface resulted in preservation of resin-dentin bond strength of both adhesives with no significant fall over six months. PMID:26557850

  6. Influence of different tooth types on the bond strength of two orthodontic adhesive systems

    PubMed Central

    Öztürk, Bora; Koyutürk, Alp Erdin; Çatalbaş, Bülent; Özer, Füsun

    2008-01-01

    The aim of this investigation was to evaluate the effects of different tooth types on the shear bond strength (SBS) of two orthodontic resin adhesive systems in vitro. Two hundred extracted sound human teeth were used in the study. Ten teeth of each tooth type were the mounted in acrylic resin leaving the buccal surface of the crowns parallel to the base of the moulds. In each experimental group, the adhesives (Transbond XT™ and Light Bond™) were applied to the etched enamel surfaces. The orthodontic composite resins were then applied to the surface in cylindrical-shaped plastic matrices. For SBS testing, a force transducer (Ultradent™) was applied at a crosshead speed of 1 mm/minute at the interface between the tooth and composite until failure occurred. Data were analysed using two-way analysis of variance (ANOVA), Kruskal–Wallis one-way ANOVA, a Bonferroni adjusted Mann–Whitney U-test, and an independent t-test. Generally, it was found that tooth type had a significant effect on SBS (P < 0.05) with Light Bond™ showing a higher SBS than Transbond XT™ (P < 0.05). The highest bond strengths were observed for the upper central incisor and lower molars with Light Bond™ (P < 0.05) and the lowest mean bond strengths for the upper molars and lower canine with Transbond XT™ (P <0.05). The results demonstrated that enamel SBS was significantly altered by both tooth type and adhesive system. Thus, the findings of this study confirm that enamel bond strength is not uniform for all teeth. These results may also explain the variability in the enamel-bonding efficacy of adhesives. PMID:18678760

  7. Effect of moisture and drying time on the bond strength of the one-step self-etching adhesive system

    PubMed Central

    Lee, Yoon

    2012-01-01

    Objectives To investigate the effect of dentin moisture degree and air-drying time on dentin-bond strength of two different one-step self-etching adhesive systems. Materials and Methods Twenty-four human third molars were used for microtensile bond strength testing of G-Bond and Clearfil S3 Bond. The dentin surface was either blot-dried or air-dried before applying these adhesive agents. After application of the adhesive agent, three different air drying times were evaluated: 1, 5, and 10 sec. Composite resin was build up to 4 mm thickness and light cured for 40 sec with 2 separate layers. Then the tooth was sectioned and trimmed to measure the microtensile bond strength using a universal testing machine. The measured bond strengths were analyzed with three-way ANOVA and regression analysis was done (p = 0.05). Results All three factors, materials, dentin wetness and air drying time, showed significant effect on the microtensile bond strength. Clearfil S3 Bond, dry dentin surface and 10 sec air drying time showed higher bond strength. Conclusions Within the limitation of this experiment, air drying time after the application of the one-step self-etching adhesive agent was the most significant factor affecting the bond strength, followed by the material difference and dentin moisture before applying the adhesive agent. PMID:23429228

  8. Bonding efficacy of an acetone/based etch-and-rinse adhesive after dentin deproteinization

    PubMed Central

    Aguilera, Fátima S.; Osorio, Raquel; Osorio, Estrella; Moura, Pedro

    2012-01-01

    Objectives: to evaluate the effect of sodium hypochlorite (NaOCl) treatment on dentin bonding by means of shear bond strength (SBS) measurements when using Prime&Bond NT (PB NT) adhesive. Ultrastructure of the interfaces was examined by scanning electron microscopy (SEM). Study design: Extracted human third molars were sectioned and ground to expose flat surfaces of superficial or deep dentin. Specimens were randomly assigned to two equal groups, and bonded as follows: (1) according to the manufacturers’ directions, after 35% H3PO4 etching, (2) 5% NaOCl treated for 2 minutes, after 35% H3PO4 etching. Each sample was embedded in a Watanabe shear test assembly for a single plane lap shear. After PB NT bonding, specimens were stored in water for 24 h at 37ºC and thermocycled (500x). Samples were tested in shear to failure using a universal testing machine at 0.75 mm/min. Data were analyzed with ANOVA and Newman-Keuls multiple comparison test procedures. Two samples of each group were randomly selected to investigate the morphologic aspect of the resin/dentin interface with SEM. Results: After etching and after aqueous sodium hypochlorite (NaOClaq) application, SBS values were similar on superficial than deep dentin (p>0.05). SEM findings shows for H3PO4 etching conditioned samples a detectable hybrid layer and long resin tags; for NaOCl treated specimens, it may be observed a non apparent hybrid layer, and the adhesive contact directly with the neck of the cylindrical resin tags. Conclusions: The use of 5% NaOCl for 2 min after dentin demineralization when PB NT was employed did not improve the bond strength to dentin, probably due to nanofiller content and/or oxidative changes on collagen-depleted dentin. Key words:Sodium hypochlorite, shear bond strength, SEM, Prime&Bond NT, superficial dentin, deep dentin. PMID:22322501

  9. Effects of metal primers on bonding of adhesive resin cement to noble alloys for porcelain fusing.

    PubMed

    Okuya, Nobuhiro; Minami, Hiroyuki; Kurashige, Hisanori; Murahara, Sadaaki; Suzuki, Shiro; Tanaka, Takuo

    2010-03-01

    This study evaluated the effects of metal primers on the bonding of adhesive resin to four pure metals (Au, Pd, Ag, Cu) and two noble alloys for porcelain fusing (high-gold and high-palladium content alloys). Bonding surface was polished with 600-grit silicon carbide paper and primed with one of the three metal primers (V-Primer, Metaltite, and M.L. Primer). Bonded specimens were fabricated by applying adhesive resin (Super-Bond C&B) on the primed surface. Shear bond strength (SBS) was determined both before and after thermocycling (4-60 degrees C for 2,000 cycles). The highest SBS values to each pure metal after thermocycling were 33.5 MPa for Au by M.L. Primer, 35.0 MPa for Ag by V-Primer, and 34.4 MPa for Cu by Metaltite. SBS to high-gold content alloy after thermocycling was 33.3 MPa by M.L. Primer. None of the primers was effective for pure Pd and high-palladium content alloy after thermocycling.

  10. In vivo bracket bond strength using two adhesive systems applied under wet and dry conditions.

    PubMed

    Ciola, Elida N; Picco, Alicia M; Sois, Ana M; Lucena, Mercedes H; Alonso, Verónica; Valvo, Maela; García, Luis; Geazzi, Ariel

    2006-01-01

    The purpose of this study was to investigate, in vivo, the bond strength of two adhesive materials: a moisture insensitive primer (MIP)* and a one step self etching primer (SEP)*, both used with Transbond XT* on dry and wet enamel and an adhesion time of 10-15 minutes. First or second upper and/or lower bicuspids (n = 124), to be extracted for orthodontic reasons, were used. A comparison of the materials' behavior was conducted under four different situations: 1) MIP on enamel etched and dry; 2) MIP on a surface etched and wetted with patient's saliva; 3) SEP on a dry field, 4) SEP on a saliva-wet enamel. For statistical analysis, Dunn-Sidak's multiple comparison test was applied with a probability of less than 0.05 (before correction). Stainless steel brackets with mesh-backed pads were bonded to the teeth. Bond strength was tested with modified orthodontic pliers on which a strain-gage was fixed to measure handle deformation while debonding. Moisture insensitive primer tested on wet enamel showed the highest mean bond strength outcomes (8.98 MPa) compared to one step etching primer (5.81 MPa). Statistical difference between these groups was significant (p = 0.000). Standard deviation was lower for the one-step technique, under dry and wet conditions. Since the media bond strength of SEP proved sufficient for clinical purposes and its behavior tended to be more homogeneous, this was considered the best choice.

  11. Bonding between oxide ceramics and adhesive cement systems: a systematic review.

    PubMed

    Papia, Evaggelia; Larsson, Christel; du Toit, Madeleine; Vult von Steyern, Per

    2014-02-01

    The following aims were set for this systematic literature review: (a) to make an inventory of existing methods to achieve bondable surfaces on oxide ceramics and (b) to evaluate which methods might provide sufficient bond strength. Current literature of in vitro studies regarding bond strength achieved using different surface treatments on oxide ceramics in combination with adhesive cement systems was selected from PubMed and systematically analyzed and completed with reference tracking. The total number of publications included for aim a was 127 studies, 23 of which were used for aim b. The surface treatments are divided into seven main groups: as-produced, grinding/polishing, airborne particle abrasion, surface coating, laser treatment, acid treatment, and primer treatment. There are large variations, making comparison of the studies difficult. An as-produced surface of oxide ceramic needs to be surface treated to achieve durable bond strength. Abrasive surface treatment and/or silica-coating treatment with the use of primer treatment can provide sufficient bond strength for bonding oxide ceramics. This conclusion, however, needs to be confirmed by clinical studies. There is no universal surface treatment. Consideration should be given to the specific materials to be cemented and to the adhesive cement system to be used.

  12. Development of an adhesively bonded beryllium propulsion structure for the Mariner Mars 1971 spacecraft

    NASA Technical Reports Server (NTRS)

    Stevens, J. H.; Layman, W. E.

    1972-01-01

    The design, testing, and fabrication of the support truss structure for the propulsion system of the Mariner 9 spacecraft are described. Support is provided by an 8.9-kg (19.5-lbm) truss assembly consisting of beryllium tubes adhesively bonded to magnesium end fittings. Beryllium was selected for the tubular struts in the truss because of its exceptionally high stiffness-to-weight ratio. Adhesive bonding, rather than riveting, was utilized to join the struts to the end fittings because of the low toughness (high notch sensitivity) of beryllium. Magnesium, used in the end fittings, resulted in a 50% weight saving over aluminum since geometric factors in the fitting design resulted in low stress areas where magnesium's lower density is a benefit.

  13. Characterization of debond growth mechanism in adhesively bonded composites under mode II static and fatigue loadings

    NASA Technical Reports Server (NTRS)

    Mall, S.; Kochhar, N. K.

    1988-01-01

    An experimental investigation of adhesively bonded composite joint was conducted to characterize the debond growth mechanism under mode II static and fatigue loadings. For this purpose, end-notched flexure specimens of graphite/epoxy (T300/5208) adherends bonded with EC 3445 adhesive were tested. In all specimen tested, the fatigue failure occurred in the form of cyclic debonding. The present study confirmed the result of previous studies that total strain-energy-release rate is the driving parameter for cyclic debonding. Further, the debond growth resistance under cyclic loading with full shear reversal (i.e., stress ratio, R = -1) is drastically reduced in comparison to the case when subjected to cyclic shear loading with no shear reversal (i.e., R = 0.1).

  14. Research of Adhesion Bonds Between Gas-Thermal Coating and Pre-Modified Base

    NASA Astrophysics Data System (ADS)

    Kovalevskaya, Z.; Zaitsev, K.; Klimenov, V.

    2016-08-01

    Nature of adhesive bonds between gas-thermal nickel alloy coating and carbon steel base was examined using laser profilometry, optical metallography, transmission and scanning electron microscopy. The steel surface was plastically pre-deformed by an ultrasonic tool. Proved that ultrasound pre-treatment modifies the steel surface. Increase of dislocation density and formation of sub micro-structure are base elements of surface modification. While using high-speed gas-flame, plasma and detonation modes of coatings, surface activation occurs and durable adhesion is formed. Ultrasonic pre-treatment of base material is effective when sprayed particles and base material interact through physical-chemical bond formation. Before applying high-speed gas flame and plasma sprayed coatings, authors recommend ultrasonic pretreatment, which creates periodic wavy topography with a stroke of 250 microns on the steel surface. Before applying detonation sprayed coatings, authors recommend ultrasound pretreatment that create modified surface with a uniform micro-topography.

  15. Glenn Refractory Adhesive for Bonding and Exterior Repair (GRABER) Developed for Repairing Shuttle Damage

    NASA Technical Reports Server (NTRS)

    Singh, Mrityunjay; Shpargel, Tarah P.

    2005-01-01

    Advanced in-space repair technologies for reinforced carbon/carbon composite (RCC) thermal protection system (TPS) structures are critically needed for the space shuttle Return To Flight (RTF) efforts. These technologies are also critical for the repair and refurbishment of thermal protection system structures of future Crew Exploration Vehicles of space exploration programs. The Glenn Refractory Adhesive for Bonding and Exterior Repair (GRABER) material developed at the NASA Glenn Research Center has demonstrated capabilities for repair of small cracks and damage in RCC leading-edge material. The concept consists of preparing an adhesive paste of desired ceramic in a polymer/phenolic resin matrix with appropriate additives, such as surfactants, and then applying the paste into the damaged or cracked area of the RCC composite components with caulking guns. The adhesive paste cures at 100 to 120 C and transforms into a high-temperature ceramic during simulated vehicle reentry testing conditions.

  16. Veneer vs. core failure in adhesively bonded all-ceramic crown layers.

    PubMed

    Lee, J J-W; Kwon, J-Y; Bhowmick, S; Lloyd, I K; Rekow, E D; Lawn, B R

    2008-04-01

    Joining a brittle veneer to a strong ceramic core with an adhesive offers potential benefits over current fabrication methods for all-ceramic crowns. We tested the hypothesis that such joining can withstand subsurface radial cracking in the veneer, from enhanced flexure in occlusal loading, as well as in the core. Critical conditions to initiate fractures were investigated in model crown-like layer structures consisting of glass veneers epoxy-joined onto alumina or zirconia cores, all bonded to a dentin-like polymer base. The results showed a competition between critical loads for radial crack initiation in the veneers and cores. Core radial cracking was relatively independent of adhesive thickness. Zirconia cores were much less susceptible to fracture than alumina, attributable to a relatively high strength and low modulus. Veneer cracking did depend on adhesive thickness. However, no significant differences in critical loads for veneer cracking were observed for specimens containing alumina or zirconia cores.

  17. Comparing Adhesive Bonding and LAMP Joining Technology in Case of Hybrid Material Combination

    NASA Astrophysics Data System (ADS)

    Markovits, T.; Bauernhuber, A.

    As plastics are utilized more and more frequently in our devices, it becomes necessary that they can be adequately joined to other materials, like metals. Bonding different materials was carried so far out primarily by adhesives, however, novel technologies, like laser assisted metal-plastic joining are showing benefits against current technologies. In the course of this study, the authors joined PMMA plastic to structural steel by adhesives and by laser assisted metal-plastic joining. Mechanical tests were carried out to compare the two different technologies, and to be able to position the LAMP joining within the field of joining technologies. Results show clearly the advantages of laser transmission joining as compared to adhesives.

  18. Adhesives for bonding RSI tile to Gr/Pi structure for advanced space transportation systems

    NASA Technical Reports Server (NTRS)

    Smith, K. E.; Hamermesh, C. L.; Hogenson, P. A.

    1979-01-01

    An adhesive was developed having improved high-temperature capability while retaining the ideal processing characteristics of RTV silicones. After evaluating several possibilities, mixtures of RTV with glass resins were selected as most promising. While results are not conclusive, tests of the final mixture evaluated, designated RA59, indicated capability of performing as a tile bonding agent to temperatures approaching 370C (700F) during repeated cycling.

  19. Effect of quaternary ammonium and silver nanoparticle-containing adhesives on dentin bond strength and dental plaque microcosm biofilms

    PubMed Central

    Zhang, Ke; Melo, Mary Anne S.; Cheng, Lei; Weir, Michael D.; Bai, Yuxing; Xu, Hockin H. K.

    2012-01-01

    Objectives Antibacterial bonding agents are promising to hinder the residual and invading bacteria at the tooth-restoration interfaces. The objectives of this study were to develop an antibacterial bonding agent by incorporation of quaternary ammonium dimethacrylate (QADM) and nanoparticles of silver (NAg), and to investigate the effect of QADM-NAg adhesive and primer on dentin bond strength and plaque microcosm biofilm response for the first time. Methods Scotchbond Multi-Purpose adhesive and primer were used as control. Experimental adhesive and primer were made by adding QADM and NAg into control adhesive and primer. Human dentin shear bond strengths were measured (n = 10). A dental plaque microcosm biofilm model with human saliva as inoculum was used to investigate biofilm metabolic activity, colony-forming unit (CFU) counts, lactic acid production, and live/dead staining assay (n = 6). Results Adding QADM and NAg into adhesive and primer did not compromise the dentin shear bond strength which ranged from 30 to 35 MPa (p > 0.1). Scanning electron microscopy (SEM) examinations revealed numerous resin tags, which were similar for the control and the QADM and NAg groups. Adding QADM or NAg markedly reduced the biofilm viability, compared to adhesive control. QADM and NAg together in the adhesive had a much stronger antibacterial effect than using each agent alone (p < 0.05). Adding QADM and NAg in both adhesive and primer had the strongest antibacterial activity, reducing metabolic activity, CFU, and lactic acid by an order of magnitude, compared to control. Significance Without compromising dentin bond strength and resin tag formation, the QADM and NAg containing adhesive and primer achieved strong antibacterial effects against microcosm biofilms for the first time. QADM-NAg adhesive and primer are promising to combat residual bacteria in tooth cavity and invading bacteria at the margins, thereby to inhibit secondary caries. QADM and NAg incorporation may have a

  20. Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips.

    PubMed

    Lima, Renato S; Leão, Paulo A G C; Piazzetta, Maria H O; Monteiro, Alessandra M; Shiroma, Leandro Y; Gobbi, Angelo L; Carrilho, Emanuel

    2015-08-21

    A new protocol for fabrication of glass microchips is addressed in this research paper. Initially, the method involves the use of an uncured SU-8 intermediate to seal two glass slides irreversibly as in conventional adhesive bonding-based approaches. Subsequently, an additional step removes the adhesive layer from the channels. This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests. Named sacrificial adhesive layer (SAB), the protocol meets the requirements of an ideal microfabrication technique such as throughput, relatively low cost, feasibility for ultra large-scale integration (ULSI), and high adhesion strength, supporting pressures on the order of 5 MPa. Furthermore, SAB eliminates the use of high temperature, pressure, or potential, enabling the deposition of thin films for electrical or electrochemical experiments. Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature. Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives.

  1. Microtensile Bond Strength of Self-Adhesive Luting Cements to Ceramics

    PubMed Central

    Abo, Tomoko; Uno, Shigeru; Yoshiyama, Masahiro; Yamada, Toshimoto; Hanada, Nobuhiro

    2012-01-01

    The purpose of this paper was to compare the bond strengths of the self-adhesive luting cements between ceramics and resin cores and examine their relation to the cement thickness. Three self-adhesive luting cements (Smartcem, Maxcem, and G-CEM) and a resin cement (Panavia F 2.0) for control were used in the paper. The thickness of the cements was controlled in approximately 25, 50, 100, or 200 μm. Each 10 specimens were made according to the manufacturers' instructions and stored in water at 37°C. After 24 hours, microtensile bond strength (μTBS) was measured. There were significant differences in cements. Three self-adhesive cements showed significantly lower μTBSs than control that required both etching and priming before cementation (Tukey, P < 0.05). The cement thickness of 50 or 100 μm tended to induce the highest μTBSs for each self-adhesive luting cements though no difference was found. PMID:22606202

  2. Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips

    PubMed Central

    Lima, Renato S.; Leão, Paulo A. G. C.; Piazzetta, Maria H. O.; Monteiro, Alessandra M.; Shiroma, Leandro Y.; Gobbi, Angelo L.; Carrilho, Emanuel

    2015-01-01

    A new protocol for fabrication of glass microchips is addressed in this research paper. Initially, the method involves the use of an uncured SU-8 intermediate to seal two glass slides irreversibly as in conventional adhesive bonding-based approaches. Subsequently, an additional step removes the adhesive layer from the channels. This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests. Named sacrificial adhesive layer (SAB), the protocol meets the requirements of an ideal microfabrication technique such as throughput, relatively low cost, feasibility for ultra large-scale integration (ULSI), and high adhesion strength, supporting pressures on the order of 5 MPa. Furthermore, SAB eliminates the use of high temperature, pressure, or potential, enabling the deposition of thin films for electrical or electrochemical experiments. Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature. Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives. PMID:26293346

  3. [Bond strength of a bioresorbable bone adhesive: results of a biomechanical study in a sheep model].

    PubMed

    Heiss, Christian; Schettler, Nicky; Schilke, Peter; Horas, Uwe; Kilian, Olaf; Meyer, Christof; Kraus, Ralf; Schnettler, Reinhard

    2008-04-01

    The purpose of this study was to investigate the bond strength of a new bone adhesive based on ethylene glycol-oligolactide-bismethacrylate on 36 sheep. A 2-cm metaphysial segment was produced on the ulna of each sheep by an oscillating saw and it was not stabilized by any type of additional osteosynthesis. Adhesive was applied to the osteotomy gaps in 18 sheep, the remaining 18 animals served as controls. A total of 6 animals with glue and 6 controls were euthanized after 21, 42 and 84 days. The bond strength after repair of the gaps through bone adhesive compared to a control group was studied by using a four-point bending test. There was a continual increase of bending stiffness from 21 to 84 days in all sheep, with the highest bending stiffness of 102.83 N/mm2 by the glue group after 84 days as opposed to the control group with 58.48 N/mm2 (p = 0.25). Morphological investigations showed more callus formation by the control group than the adhesive group after 84 days (p = 0.04). In addition, an in vitro gluing of the ulna segment was performed with a four-point bending test after 10, 60 and 360 min polymerization time. The in vitro gluing of the ulna segment showed a continual increase of bending stiffness to 17.32 N/mm2 after 360 min (p = 0.59).

  4. Single-molecule force spectroscopy of the Aplysia cell adhesion molecule reveals two homophilic bonds.

    PubMed

    Martines, E; Zhong, J; Muzard, J; Lee, A C; Akhremitchev, B B; Suter, D M; Lee, G U

    2012-08-22

    Aplysia californica neurons comprise a powerful model system for quantitative analysis of cellular and biophysical properties that are essential for neuronal development and function. The Aplysia cell adhesion molecule (apCAM), a member of the immunoglobulin superfamily of cell adhesion molecules, is present in the growth cone plasma membrane and involved in neurite growth, synapse formation, and synaptic plasticity. apCAM has been considered to be the Aplysia homolog of the vertebrate neural cell adhesion molecule (NCAM); however, whether apCAM exhibits similar binding properties and neuronal functions has not been fully established because of the lack of detailed binding data for the extracellular portion of apCAM. In this work, we used the atomic force microscope to perform single-molecule force spectroscopy of the extracellular region of apCAM and show for the first time (to our knowledge) that apCAM, like NCAM, is indeed a homophilic cell adhesion molecule. Furthermore, like NCAM, apCAM exhibits two distinct bonds in the trans configuration, although the kinetic and structural parameters of the apCAM bonds are quite different from those of NCAM. In summary, these single-molecule analyses further indicate that apCAM and NCAM are species homologs likely performing similar functions.

  5. Effects of solvent volatilization time on the bond strength of etch-and-rinse adhesive to dentin using conventional or deproteinization bonding techniques

    PubMed Central

    de Sousa Júnior, José Aginaldo; Carregosa Santana, Márcia Luciana; de Figueiredo, Fabricio Eneas Diniz

    2015-01-01

    Objectives This study determined the effect of the air-stream application time and the bonding technique on the dentin bond strength of adhesives with different solvents. Furthermore, the content and volatilization rate of the solvents contained in the adhesives were also evaluated. Materials and Methods Three adhesive systems with different solvents (Stae, SDI, acetone; XP Bond, Dentsply De Trey, butanol; Ambar, FGM, ethanol) were evaluated. The concentrations and evaporation rates of each adhesive were measured using an analytical balance. After acid-etching and rinsing, medium occlusal dentin surfaces of human molars were kept moist (conventional) or were treated with 10% sodium hypochlorite for deproteinization. After applying adhesives over the dentin, slight air-stream was applied for 10, 30 or 60 sec. Composite cylinders were built up and submitted to shear testing. The data were submitted to ANOVA and Tukey's test (α = 0.05). Results Stae showed the highest solvent content and Ambar the lowest. Acetone presented the highest evaporation rate, followed by butanol. Shear bond strengths were significantly affected only by the factors of 'adhesive' and 'bonding technique' (p < 0.05), while the factor 'duration of air-stream' was not significant. Deproteinization of dentin increased the bond strength (p < 0.05). Stae showed the lowest bond strength values (p < 0.05), while no significant difference was observed between XP Bond and Ambar. Conclusions Despite the differences in content and evaporation rate of the solvents, the duration of air-stream application did not affect the bond strength to dentin irrespective of the bonding technique. PMID:26295023

  6. Laser Ablation Surface Preparation of Ti-6A1-4V for Adhesive Bonding

    NASA Technical Reports Server (NTRS)

    Palmieri, Frank L.; Watson, Kent A.; Morales, Guillermo; Williams, Thomas; Hicks, Robert; Wohl, Christopher J.; Hopkins, John W.; Connell, John W.

    2012-01-01

    Adhesive bonding offers many advantages over mechanical fastening, but requires certification before it can be incorporated in primary structures for commercial aviation without disbond-arrestment features or redundant load paths. Surface preparation is widely recognized as the key step to producing robust and predictable bonds. Laser ablation imparts both topographical and chemical changes to a surface which can lead to increased bond durability. A laser based process provides an alternative to chemical-dip, manual abrasion and grit blast treatments which are expensive, hazardous, polluting, and less precise. This report documents preliminary testing of a surface preparation technique using laser ablation as a replacement for the chemical etch and abrasive processes currently applied to Ti-6Al-4V alloy adherends. Failure mode, surface roughness, and chemical makeup were analyzed using fluorescence enhanced visualization, microscopy, and X-ray photoelectron spectroscopy, respectively. Single lap shear tests were conducted on bonded and aged specimens to observe bond strength retention and failure mode. Some promising results showed increasing strength and durability of lap shear specimens as laser ablation coverage area and beam intensity increased. Chemical analyses showed trends for surface chemical species which correlated with improved bond strength and durability. Combined, these results suggest that laser ablation is a viable process for inclusion with or/and replacement of one or more currently used titanium surface treatments. On-going work will focus on additional mechanical tests to further demonstrate improved bond durability.

  7. Effect of saliva and blood contamination on the bond strength of self-etching adhesive system- An in vitro study

    PubMed Central

    Koppolu, Madhusudhana; Gogala, Dorasani; Mathew, Vinod B; Thangala, Venugopal; Deepthi, Mandava; Sasidhar, Nalluru

    2012-01-01

    Aim: The aims of this study were to determine the effect of saliva and blood contamination on the shear bond strength of self-etching adhesive to enamel and dentin; and, to compare the difference in bond strength due to contamination beforeand after application of the self-etch adhesive. Materials and Methods: 40 human mandibular molars were wet ground on both buccal and lingual surfaces to prepare flat superficial enamel and dentin surfaces. They were randomly divided into two groups (n = 40) based on the substrate (enamel and dentin). Each group was further divided into five subgroups (n = 8) based on the type of contamination it was subjected to, and the step in the bonding sequence when the contamination occurred (before or after adhesive application). Fresh saliva and fresh human blood were applied either before or after the application of Xeno III® self-etching adhesive system (SES). Composite resin was applied as inverted, truncated cured cones that were subjected to shear bond strength test. Statistical Analysis: One-way analysis of variance (ANOVA) and Tukey's Honestly Significant Difference (HSD) test were used. Results: Statistically significant reduction in the bond strength was shown after both saliva and blood contamination before and after Xeno III® application (P< 0.05). Bond strength is significantly reduced after contamination with blood as compared to saliva. Conclusions: When self-etching adhesive systems are used, saliva and blood contamination significantly decrease the bond strength of the adhesive to enamel and dentin of the tooth. PMID:22876017

  8. Novel 1.3-micron high-speed directly modulated semiconductor laser device designs and the development of wafer bonding technology for compliant-substrate fabrication

    NASA Astrophysics Data System (ADS)

    Greenberg, Joseph

    2000-10-01

    substrate production requires the wafer fusion of two substrates. A wafer bonding system has been designed, built and tested to improve wafer bonding techniques for this application. This machine's scalable design is capable of improved reproducibility, uniformity and yield over comparable techniques.

  9. Evaluation of Adhesive Bonding of Lithium Disilicate Ceramic Material with Duel Cured Resin Luting Agents

    PubMed Central

    Gundawar, Sham M.; Radke, Usha M.

    2015-01-01

    Purpose: The purpose of this vitro study was to comparatively evaluate the adhesive bonding of dual cured resin luting agents with lithium disilicate ceramic material. Materials and Methods: Porcelain laminate veneers were prepared with lithium disilicate ceramic material i.e. IPS Empress II( E-Max Press). These laminates were bonded with RelyX ARC, Panavia F 2.0, Variolink II, Duolink and Nexus NX3.The porcelain laminates were etched with 9.6% hydrofluoric acid (Pulpdent Corporation) for one minute, washed for 15 sec with three way syringe and dried for 15 sec with air syringe. The silane (Ultradent) was applied with the help of applicator tip in a single coat and kept undisturbed for one minute. The prepared surfaces of the premolars were treated with 37% phosphoric acid (Prime dent) for 15 sec, thoroughly rinsed and dried as per manufactures instructions. The shear bond test was carried out on all samples with the Universal testing machine (Instron U.S.A.) The scanning electron microscopic study was performed at the fractured interface of representative samples from each group of luting agents. Result: In this study, the highest value of shear bond strength was obtained for NEXUS NX3 and the lowest for VARIOLINK II. Conclusion: The difference in bond strength can be interpreted as the difference in fracture resistance of luting agents, to which shearing load was applied during the shear bond strength test. It is inferred from this study that the composition of the luting agent determines the adhesive characteristics in addition to surface treatment and bonding surface area. PMID:25859514

  10. Shear bond strengths of self-adhesive luting resins fixing dentine to different restorative materials.

    PubMed

    Zhang, Congxiao; Degrange, Michel

    2010-01-01

    The purpose of this study was to assess the bond strengths of three self-adhesive resin cements (Rely X Unicem, Maxcem and Multilink Sprint) fixing dentine to four different restorative substrates (Ni-Cr alloy, E-Max glass-ceramic, Y-TZP Zirconia and Adoro micro-filled composite) and to compare their performances with those of two conventional dual-cured luting cements (Variolink II + Total-etch Excite DSC and Multilink Automix + Self-etching Primer A + B). Cylindric specimens (5 x 5 mm) were prepared with the four restorative materials for bonding to human dentine. Three surface treatments were performed depending on the restorative material: (i) Al2O3 50 microm sandblasting (Ni-Cr, Adoro), (ii) #800 SiC polishing (Zirconia, E-Max), (iii) hydrofluoric acid (HF)-etching (E-Max). Twenty-five groups (n = 10) were designed according to luting cements, restorative materials and surface pre-treatments. In some experimental groups, Variolink II and Multilink Automix were coupled with, respectively, a silane primer (Monobond S) and an alloy/zirconia primer (Multilink A/Z primer). Specimens were stored in distilled water at 37 degrees C for 24 h and then loaded in shear until failure. Variolink II and Multilink Automix showed the highest bond strengths, regardless of the restorative substrate, when used with dentine bonding systems and primers, while the weakest bonds were with Maxcem. The bond strength recorded with the two other self-adhesive cements depended on the nature of the restorative substrate. Increasing retention at the interfaces (i.e., HF ceramic etching) and using specific primers significantly improves the bond strength of luted restorative materials to dentine.

  11. Room-temperature wafer bonded InGaP/GaAs//InGaAsP/InGaAs four-junction solar cell grown by all-solid state molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Dai, Pan; Lu, Shulong; Uchida, Shiro; Ji, Lian; Wu, Yuanyuan; Tan, Ming; Bian, Lifeng; Yang, Hui

    2016-01-01

    An InGaP/GaAs tandem cell on a GaAs substrate and an InGaAsP/InGaAs tandem cell on an InP substrate were grown separately by all-solid-state molecular beam epitaxy. A room-temperature direct wafer-bonding technique was used to integrate these subcells into an InGaP/GaAs//InGaAsP/InGaAs wafer-bonded solar cell, which resulted in an abrupt interface with low resistance and high optical transmission. The current-matching design for the base layer thickness of each cell was investigated. The resulting efficiency of the four-junction solar cell was 42.0% at 230 suns, which demonstrates the great potential of the room-temperature wafer-bonding technique to achieve high conversion efficiency for cells with four or more junctions.

  12. Room-temperature bonding method for polymer substrate of flexible electronics by surface activation using nano-adhesion layers

    NASA Astrophysics Data System (ADS)

    Matsumae, Takashi; Fujino, Masahisa; Suga, Tadatomo

    2015-10-01

    A sealing method for polymer substrates to be used in flexible electronics is studied. For this application, a low-temperature sealing method that achieves flexible bonding of inorganic bonding material is required, but no conventional technique satisfies these requirements simultaneously. In this study, a new polymer bonding method using thin Si and Fe layers and the surface activated bonding (SAB) method are applied to bond poly(ethylene naphthalate) (PEN) films to each other. PEN films can be bonded via the proposed method without voids at room temperature, and the bonded samples are bendable. The adhesion strength of the bonded samples is so strong that fracture occurs in the polymer bulk rather than at the bond interface. Investigations of the bonded samples by transmission electron microscopy (TEM) and Fourier-transform infrared spectroscopy (FTIR) reveal that bonding is achieved by chemical interactions between the polymer surface and deposited atoms.

  13. Adaptive Shape Functions and Internal Mesh Adaptation for Modelling Progressive Failure in Adhesively Bonded Joints

    NASA Technical Reports Server (NTRS)

    Stapleton, Scott; Gries, Thomas; Waas, Anthony M.; Pineda, Evan J.

    2014-01-01

    Enhanced finite elements are elements with an embedded analytical solution that can capture detailed local fields, enabling more efficient, mesh independent finite element analysis. The shape functions are determined based on the analytical model rather than prescribed. This method was applied to adhesively bonded joints to model joint behavior with one element through the thickness. This study demonstrates two methods of maintaining the fidelity of such elements during adhesive non-linearity and cracking without increasing the mesh needed for an accurate solution. The first method uses adaptive shape functions, where the shape functions are recalculated at each load step based on the softening of the adhesive. The second method is internal mesh adaption, where cracking of the adhesive within an element is captured by further discretizing the element internally to represent the partially cracked geometry. By keeping mesh adaptations within an element, a finer mesh can be used during the analysis without affecting the global finite element model mesh. Examples are shown which highlight when each method is most effective in reducing the number of elements needed to capture adhesive nonlinearity and cracking. These methods are validated against analogous finite element models utilizing cohesive zone elements.

  14. Bond strength evaluation of three self-adhesive luting systems used for cementing composite and porcelain.

    PubMed

    De Angelis, F; Minnoni, A; Vitalone, L M; Carluccio, F; Vadini, M; Paolantonio, M; D'Arcangelo, C

    2011-01-01

    Self-adhesive resin cements were recently introduced with the purpose of simplifying the cementation technique, as they combine the use of adhesive and cement in a single application, eliminating the need for pretreatment of the tooth. In the present study a microtensile bond strength test (μ-TBS) was used to compare three self-adhesives, an etch-and-rinse and a self-etch luting system, in the cementation of resin-based composite (RBC) and ceramic disks to dentin. Freshly extracted molars were transversally sectioned to expose flat, deep dentin surfaces. Cylindrical specimens (5 mm in diameter and 10 mm in height), consisting of RBC disks and leucite-based glass ceramic disks, were produced. The RBC disks were sandblasted with 50-μm Al2O3. The ceramic disks were conditioned with 9.5% hydrofluoric acid gel and silane application. All of the disks were then bonded to dentin surfaces employing five different luting agents: iCEM Self Adhesive (Heraeus Kulzer), MaxCem (Kerr Corporation), RelyX UniCem (3M ESPE), EnaCem HF (Micerium), and Panavia F2.0 (Kuraray-Dental). The products were applied according to the manufacturers' instructions. The specimens were sectioned perpendicular to the adhesive interface to produce multiple beams measuring approximately 1 mm2 in cross section. For each experimental group 12 beams were tested. The preterm failures were also taken into account. All of the specimen preparations were performed by the same operator. The beams were tested under tension at a crosshead speed of 0.5 mm/min until failure. Mean μ-TBS values were calculated for each group. Data were analyzed by a two-way analysis of variance, and multiple comparisons were performed using a Tukey test (α=0.05). The UniCem group showed the lowest number of preterm failures among the tested self-adhesive systems. When premature debondings were included in the mean value calculation, bond strength values for the UniCem group were statistically equal to or even higher than those

  15. Bonding efficacy of etch-and-rinse adhesives after dentin biomodification using ethanol saturation and collagen cross-linker pretreatment

    PubMed Central

    Sharma, Pallavi; Nagpal, Rajni; Tyagi, Shashi Prabha; Manuja, Naveen

    2015-01-01

    Aim: To evaluate whether the application of two simplified etch-and-rinse adhesives to biomodified dentin using ethanol-wet bonding (EWB) and collagen cross-linker (CCL) pretreatment improves their sealing ability. Materials and Methods: In 176 extracted human molars, the pulp-chambers were deroofed, and teeth were sectioned horizontally. Samples were randomly divided into eight groups according to four bonding techniques using two simplified etch-and-rinse adhesives; Adper Single Bond 2 (ASB) and XP Bond (XPB). The bonding protocols included: (a) Water-wet bonding (WWB); (b) EWB; (c) WWB and CCL application; (d) EWB and CCL application. After composite resin restorations, dye leakage evaluation and scanning electron microscope analysis were done. Leakage scores were statistically analyzed using Kruskal-Wallis and Mann-Whitney U tests at a significance level of P < 0.05. Result: For both ASB and XPB adhesives, least dye leakage was observed in EWB groups (b and d) (P = 0.918 and P = 0.399 respectively) which showed no significant difference, while maximum leakage scores were seen in WWB groups (a and c). Regardless of CCL application and adhesives used, EWB technique depicted (P = 0.003 and P = 0.004) significantly greater sealing ability than WWB. Conclusion: Bonding of ASB and XPB using EWB significantly improved their sealing ability. Biomodification using CCL pretreatment had no significant effect on the sealing ability of adhesives bonded with either WWB or EWB. PMID:26180421

  16. Tensile bond strength of indirect composites luted with three new self-adhesive resin cements to dentin

    PubMed Central

    TÜRKMEN, Cafer; DURKAN, Meral; CİMİLLİ, Hale; ÖKSÜZ, Mustafa

    2011-01-01

    Objective The aims of this study were to evaluate the tensile bond strengths between indirect composites and dentin of 3 recently developed self-adhesive resin cements and to determine mode of failure by SEM. Material and Methods Exposed dentin surfaces of 70 mandibular third molars were used. Teeth were randomly divided into 7 groups: Group 1 (control group): direct composite resin restoration (Alert) with etch-and-rinse adhesive system (Bond 1 primer/adhesive), Group 2: indirect composite restoration (Estenia) luted with a resin cement (Cement-It) combined with the same etch-and-rinse adhesive, Group 3: direct composite resin restoration with self-etch adhesive system (Nano-Bond), Group 4: indirect composite restoration luted with the resin cement combined with the same self-etch adhesive, Groups 5-7: indirect composite restoration luted with self-adhesive resin cements (RelyX Unicem, Maxcem, and Embrace WetBond, respectively) onto the non-pretreated dentin surfaces. Tensile bond strengths of groups were tested with a universal testing machine at a constant speed of 1 mm/min using a 50 kgf load cell. Results were statistically analyzed by the Student's t-test. The failure modes of all groups were also evaluated. Results The indirect composite restorations luted with the self-adhesive resin cements (groups 5-7) showed better results compared to the other groups (p<0.05). Group 4 showed the weakest bond strength (p>0.05). The surfaces of all debonded specimens showed evidence of both adhesive and cohesive failure. Conclusion The new universal self-adhesive resins may be considered an alternative for luting indirect composite restorations onto non-pretreated dentin surfaces. PMID:21710095

  17. Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability

    NASA Astrophysics Data System (ADS)

    Fan, J.; Peng, L.; Li, K. H.; Tan, C. S.

    2012-10-01

    Low-temperature wafer-level Cu-to-Cu thermo-compression bonding and its reliability for hermetic sealing application have been investigated in this work. The volume of the encapsulated cavities is about 1.4×10-3 cm3 in accordance with the MIL-STD-883E standard prescribed for microelectronics packaging hermeticity measurement. The samples under test are bonded at 300 °C under a bonding force of 5500 N for 1 h in vacuum (˜2.5 × 10-4 mbar) with a 300 nm thick Cu diffusion layer and 50 nm thick Ti barrier layer which are deposited in an e-beam evaporator. The reliability test is accomplished through a temperature cycling test (TCT) from -40 to 125 °C up to 1000 cycles and a humidity test based on IPC/JEDEC J-STD-020 standard. In addition, an immersion in acid/base solution is applied to verify the corrosion resistance of the Cu frame for hermetic application. Excellent helium leak rate which is smaller than the reject limit defined by the MIL-STD-883E standard (method 1014.10) is detected for all the samples. These excellent helium leak rates show an outstanding bonding quality against harsh environment for hermetic encapsulation in 3D integration applications.

  18. Effect of different adhesion strategies on bond strength of resin composite to composite-dentin complex.

    PubMed

    Özcan, M; Pekkan, G

    2013-01-01

    Service life of discolored and abraded resin composite restorations could be prolonged by repair or relayering actions. Composite-composite adhesion can be achieved successfully using some surface conditioning methods, but the most effective adhesion protocol for relayering is not known when the composite restorations are surrounded with dentin. This study evaluated the effect of three adhesion strategies on the bond strength of resin composite to the composite-dentin complex. Intact maxillary central incisors (N=72, n=8 per subgroup) were collected and the coronal parts of the teeth were embedded in autopolymerized poly(methyl tfr54methacrylate) surrounded by a polyvinyl chloride cylinder. Cylindrical cavities (diameter: 2.6 mm; depth: 2 mm) were opened in the middle of the labial surfaces of the teeth using a standard diamond bur, and the specimens were randomly divided into three groups. Two types of resin composite, namely microhybrid (Quadrant Anterior Shine; AS) and nanohybrid (Grandio; G), were photo-polymerized incrementally in the cavities according to each manufacturer's recommendations. The composite-enamel surfaces were ground finished to 1200-grit silicone carbide paper until the dentin was exposed. The surfaces of the substrate composites and the surrounding dentin were conditioned according to one of the following adhesion protocols: protocol 1: acid-etching (dentin) + silica coating (composite) + silanization (composite) + primer (dentin) + bonding agent (dentin + composite); protocol 2: silica coating (composite) + acid-etching (dentin) + silanization (composite) + primer (dentin) + bonding agent (dentin + composite); and protocol 3: acid-etching (dentin) + primer (dentin) + silanization (composite) + bonding agent (dentin + composite). Applied primer and bonding agents were the corresponding materials of the composite manufacturer. Silica coating (CoJet sand, 30 μm) was achieved using a chairside air-abrasion device (distance: 10 mm; duration

  19. Adhesion bonding techniques for highly loaded parts of continuous carbon-fiber reinforced polyetheretherketone (CF-PEEK/APC2)

    NASA Astrophysics Data System (ADS)

    Kempe, G.; Krauss, H.

    It is shown that the adhesion technology is applicable to the bonding of continuous fiber reinforced thermplastics. The influences and conditions under which an enhancement of the bonding strength can be achieved are described. Attention is focused on the applicability of the adhesion method to continuous fiber reinforced PEEK, acknowledging that PEEK is very resistant to chemicals and thereby, a poor candidate for the technique.

  20. Mixed-mode cyclic debonding of adhesively bonded composite joints. M.S. Thesis

    NASA Technical Reports Server (NTRS)

    Rezaizadeh, M. A.; Mall, S.

    1985-01-01

    A combined experimental-analytical investigation to characterize the cyclic failure mechanism of a simple composite-to-composite bonded joint is conducted. The cracked lap shear (CLS) specimens of graphite/epoxy adherend bonded with EC-3445 adhesive are tested under combined mode 1 and 2 loading. In all specimens tested, fatigue failure occurs in the form of cyclic debonding. The cyclic debond growth rates are measured. The finite element analysis is employed to compute the mode 1, mode 2, and total strain energy release rates (i.e., GI, GII, and GT). A wide range of mixed-mode loading, i.e., GI/GII ranging from 0.03 to 0.38, is obtained. The total strain energy release rate, G sub T, appeared to be the driving parameter for cyclic debonding in the tested composite bonded system.

  1. Adhesive bonding and brazing of nanocrystalline diamond foil onto different substrate materials

    NASA Astrophysics Data System (ADS)

    Lodes, Matthias A.; Sailer, Stefan; Rosiwal, Stefan M.; Singer, Robert F.

    2013-10-01

    Diamond coatings are used in heavily stressed industrial applications to reduce friction and wear. Hot-filament chemical vapour deposition (HFCVD) is the favourable coating method, as it allows a coating of large surface areas with high homogeneity. Due to the high temperatures occurring in this CVD-process, the selection of substrate materials is limited. With the desire to coat light materials, steels and polymers a new approach has been developed. First, by using temperature-stable templates in the HFCVD and stripping off the diamond layer afterwards, a flexible, up to 150 μm thick and free standing nanocrystalline diamond foil (NCDF) can be produced. Afterwards, these NCDF can be applied on technical components through bonding and brazing, allowing any material as substrate. This two-step process offers the possibility to join a diamond layer on any desired surface. With a modified scratch test and Rockwell indentation testing the adhesion strength of NCDF on aluminium and steel is analysed. The results show that sufficient adhesion strength is reached both on steel and aluminium. The thermal stress in the substrates is very low and if failure occurs, cracks grow undercritically. Adhesion strength is even higher for the brazed samples, but here crack growth is critical, delaminating the diamond layer to some extent. In comparison to a sample directly coated with diamond, using a high-temperature CVD interlayer, the brazed as well as the adhesively bonded samples show very good performance, proving their competitiveness. A high support of the bonding layer could be identified as crucial, though in some cases a lower stiffness of the latter might be acceptable considering the possibility to completely avoid thermal stresses which occur during joining at higher temperatures.

  2. Influence of laser etching on enamel and dentin bond strength of Silorane System Adhesive.

    PubMed

    Ustunkol, Ildem; Yazici, A Ruya; Gorucu, Jale; Dayangac, Berrin

    2015-02-01

    The aim of this in vitro study was to evaluate the shear bond strength (SBS) of Silorane System Adhesive to enamel and dentin surfaces that had been etched with different procedures. Ninety freshly extracted human third molars were used for the study. After the teeth were embedded with buccal surfaces facing up, they were randomly divided into two groups. In group I, specimens were polished with a 600-grit silicon carbide (SiC) paper to obtain flat exposed enamel. In group II, the overlying enamel layer was removed and exposed dentin surfaces were polished with a 600-grit SiC paper. Then, the teeth in each group were randomly divided into three subgroups according to etching procedures: etched with erbium, chromium:yttrium-scandium-gallium-garnet laser (a), etched with 35% phosphoric acid (b), and non-etched (c, control). Silorane System Adhesive was used to bond silorane restorative to both enamel and dentin. After 24-h storage in distilled water at room temperature, a SBS test was performed using a universal testing machine at a crosshead speed of 1 mm/min. The data were analyzed using two-way ANOVA and Bonferroni tests (p < 0.05). The highest SBS was found after additional phosphoric acid treatment in dentin groups (p < 0.05). There were no statistically significant differences between the laser-etched and non-etched groups in enamel and dentin (p > 0.05). The SBS of self-etch adhesive to dentin was not statistically different from enamel (p > 0.05). Phosphoric acid treatment seems the most promising surface treatment for increasing the enamel and dentin bond strength of Silorane System Adhesive.

  3. Relationship between mechanical properties and bond durability of short fiber-reinforced resin composite with universal adhesive.

    PubMed

    Tsujimoto, Akimasa; Barkmeier, Wayne W; Takamizawa, Toshiki; Watanabe, Hidehiko; Johnson, William W; Latta, Mark A; Miyazaki, Masashi

    2016-10-01

    The purpose of this study was to determine the relationship between mechanical properties and bond durability of short fiber-reinforced resin composite with universal adhesive. As controls, micro-hybrid and nano-hybrid resin composites were tested. The universal adhesives used were Scotchbond Universal, Adhese Universal, and G-Premio Bond. The fracture toughness and flexural properties of resin composites, and shear bond strength and shear fatigue strength of universal adhesive with resin composite using both total-etch and self-etch modes were determined. In the results, short fiber-reinforced resin composite showed significantly higher fracture toughness than did micro-hybrid and nano-hybrid resin composites. The flexural strength and modulus of short fiber-reinforced and nano-hybrid resin composites were significantly lower than were those of micro-hybrid resin composites. Regardless of etching mode, the shear bond strength of universal adhesives with short fiber-reinforced resin composite did not show any significant differences from micro-hybrid and nano-hybrid resin composites. The shear fatigue strength of universal adhesives with short fiber-reinforced resin composite and micro-hybrid resin composites were significantly higher than that of nano-hybrid resin composites. The results of this study suggest that the mechanical properties of short fiber-reinforced resin composite improve their bond durability with universal adhesive.

  4. Shear bond strength of self-adhesive resins compared to resin cements with etch and rinse adhesives to enamel and dentin in vitro.

    PubMed

    Lührs, A-K; Guhr, S; Günay, H; Geurtsen, W

    2010-04-01

    Self-adhesive resin cements should ease the placement of dental restorations. The purpose of this study was to evaluate their shear bond strength to enamel and dentin. Sixty molars were randomly assigned to 12 test groups (each n = 10), and the approximal surfaces were ground flat to get an enamel and dentin surface with a diameter of at least 4 mm. Ceramic specimens were bonded to the surfaces with either Variolink/Syntac Classic (VSC), Panavia F2.0 (PAF), RelyX Unicem (RLX), Maxcem Elite (MCE), iCem (IC), or an experimental self-adhesive resin cement (EXP). The shear bond strength (crosshead speed: 1 mm/min) was measured after 24-h storage in NaCl (37 degrees C). The fracture modes were determined with a stereomicroscope (magnification, 8-50-fold). VSC had the highest shear bond strength within the enamel groups (42.9 +/- 9 MPa) and IC the lowest (10.5 +/- 4.2 MPa, p < 0.001). The highest dentin shear bond strength was determined for VSC (39.2 +/- 8.9 MPa, p < 0.001) and the lowest for EXP (7.8 +/- 3.9 MPa, p < 0.001). Self-adhesive resin cements fractured mainly between resin and enamel or dentin. The shear bond strength of self-adhesive resin cements was inferior compared to conventional composite resin cements.

  5. Manipulation of polystyrene nanoparticles on a silicon wafer in the peak force tapping mode in water: pH-dependent friction and adhesion force

    SciTech Connect

    Schiwek, Simon; Stark, Robert W. E-mail: dietz@csi.tu-darmstadt.de; Dietz, Christian E-mail: dietz@csi.tu-darmstadt.de; Heim, Lars-Oliver

    2015-03-14

    The friction force between nanoparticles and a silicon wafer is a crucial parameter for cleaning processes in the semiconductor industry. However, little is known about the pH-dependency of the friction forces and the shear strength at the interface. Here, we push polystyrene nanoparticles, 100 nm in diameter, with the tip of an atomic force microscope and measure the pH-dependency of the friction, adhesion, and normal forces on a silicon substrate covered with a native silicon dioxide layer. The peak force tapping mode was applied to control the vertical force on these particles. We successively increased the applied load until the particles started to move. The main advantage of this technique over single manipulation processes is the achievement of a large number of manipulation events in short time and in a straightforward manner. Geometrical considerations of the interaction forces at the tip-particle interface allowed us to calculate the friction force and shear strength from the applied normal force depending on the pH of an aqueous solution. The results clearly demonstrated that particle removal should be performed with a basic solution at pH 9 because of the low interaction forces between particle and substrate.

  6. The effect of simplified adhesives on the bond strength to dentin of dual-cure resin cements.

    PubMed

    Shade, A M; Wajdowicz, M N; Bailey, C W; Vandewalle, K S

    2014-01-01

    The purpose of this study was to compare the shear bond strengths to dentin of two dual-cure resin cements, one with a unique initiator, NX3 (Kerr Corp), and the other with a traditional redox-initiator system, Calibra (Dentsply), when used in combination with simplified or nonsimplified adhesive agents. The two dual-cure resin cements, in either self- or dual-cure activation modes, were bonded to human dentin with four dental adhesives to create 16 subgroups of 10 specimens each. After 24 hours of storage in distilled water at 37°C, the specimens were tested in shear in a universal testing machine. With both NX3 and Calibra, bond strengths significantly increased when the specimens were dual cured. In addition, with either cement in either mode, the nonsimplified adhesives performed significantly better than did the simplified adhesive bonding agents. When used specifically with simplified adhesives in either cure mode, NX3 did not produce significantly higher bond strengths than did Calibra. In general, lower dentin bond strengths were found with simplified adhesives or self-cure activation with either resin cement.

  7. In vitro evaluation of the bonding durability of self-adhesive resin cement to titanium using highly accelerated life test.

    PubMed

    Lin, Jie; Shinya, Akikazu; Gomi, Harunori; Matinlinna, Jukka Pekka; Shinya, Akiyoshi

    2011-01-01

    The purpose of this in vitro study was to evaluate the bonding durability of three self-adhesive resin cements to titanium using the Highly Accelerated Life Test (HALT). The following self-adhesive resin cements were used to bond pairs of titanium blocks together according to manufacturers' instructions: RelyX Unicem, Breeze, and Clearfil SA Luting. After storage in water at 37°C for 24 h, bonded specimens (n=15) immersed in 37°C water were subjected to cyclic shear load testing regimes of 20, 30, or 40 kg using a fatigue testing machine. Cyclic loading continued until failure occurred, and the number of cycles taken to reach failure was recorded. The bonding durability of a self-adhesive resin cement to titanium was largely influenced by the weight of impact load. HALT showed that Clearfil SA Luting, which contained MDP monomer, yielded the highest median bonding lifetime to titanium.

  8. Resin Bonding of Self-Etch Adhesives to Bovine Dentin Bleached from Pulp Chamber

    PubMed Central

    Haruyama, Akiko; Kato, Junji; Takemoto, Shinji; Oda, Yutaka; Kawada, Eiji; Takahashi, Toshiyuki; Furusawa, Masahiro

    2016-01-01

    This study evaluated the microtensile bond strength (μTBS) of 1-step self-etch adhesives (1-SEAs) and 2-step self-etch adhesives (2-SEAs) to pulp chamber dentin immediately after bleaching with 2 types of common bleaching techniques. Pulp chamber dentin of bovine teeth was bleached using 30% hydrogen peroxide (H2O2) solution with quartz-tungsten-halogen light-curing unit (Group 1) and 3.5% H2O2-containing titanium dioxide (TiO2) (Pyrenees®) activated with 405-nm violet diode laser for 15 min (Group 2). Unbleached specimens were placed in distilled water for 15 min and used as controls. After treatment, dentin was bonded with resin composite using 1-SEA or 2-SEA and stored in water at 37°C for 24 h. Each specimen was sectioned and trimmed to an hourglass-shape and μTBS was measured. Fractured specimens were examined under a scanning electron microscope to determine fracture modes. All specimens in Group 1 failed before proper bonding tests. In Group 2, the μTBS of 2-SEA was significantly greater (with no failed specimens) than 1-SEA (where 21 out of 36 failed). These results indicate that 2-SEA is a better adhesive system than 1-SEA on bleached dentin. Our results also demonstrated that application of H2O2 significantly decreases bond strength of resin to dentin; however, in the case of nonvital tooth bleaching, Pyrenees® is a better alternative to the conventional 30% H2O2 bleaching. PMID:27747220

  9. Resin Bonding of Self-Etch Adhesives to Bovine Dentin Bleached from Pulp Chamber.

    PubMed

    Haruyama, Akiko; Kameyama, Atsushi; Kato, Junji; Takemoto, Shinji; Oda, Yutaka; Kawada, Eiji; Takahashi, Toshiyuki; Furusawa, Masahiro

    2016-01-01

    This study evaluated the microtensile bond strength (μTBS) of 1-step self-etch adhesives (1-SEAs) and 2-step self-etch adhesives (2-SEAs) to pulp chamber dentin immediately after bleaching with 2 types of common bleaching techniques. Pulp chamber dentin of bovine teeth was bleached using 30% hydrogen peroxide (H2O2) solution with quartz-tungsten-halogen light-curing unit (Group 1) and 3.5% H2O2-containing titanium dioxide (TiO2) (Pyrenees®) activated with 405-nm violet diode laser for 15 min (Group 2). Unbleached specimens were placed in distilled water for 15 min and used as controls. After treatment, dentin was bonded with resin composite using 1-SEA or 2-SEA and stored in water at 37°C for 24 h. Each specimen was sectioned and trimmed to an hourglass-shape and μTBS was measured. Fractured specimens were examined under a scanning electron microscope to determine fracture modes. All specimens in Group 1 failed before proper bonding tests. In Group 2, the μTBS of 2-SEA was significantly greater (with no failed specimens) than 1-SEA (where 21 out of 36 failed). These results indicate that 2-SEA is a better adhesive system than 1-SEA on bleached dentin. Our results also demonstrated that application of H2O2 significantly decreases bond strength of resin to dentin; however, in the case of nonvital tooth bleaching, Pyrenees® is a better alternative to the conventional 30% H2O2 bleaching.

  10. Ultrathin body GaSb-on-insulator p-channel metal-oxide-semiconductor field-effect transistors on Si fabricated by direct wafer bonding

    SciTech Connect

    Yokoyama, Masafumi Takenaka, Mitsuru; Takagi, Shinichi; Yokoyama, Haruki

    2015-02-16

    We have realized ultrathin body GaSb-on-insulator (GaSb-OI) on Si wafers by direct wafer bonding technology using atomic-layer deposition (ALD) Al{sub 2}O{sub 3} and have demonstrated GaSb-OI p-channel metal-oxide-semiconductor field-effect transistors (p-MOSFETs) on Si. A 23-nm-thick GaSb-OI p-MOSFET exhibits the peak effective mobility of ∼76 cm{sup 2}/V s. We have found that the effective hole mobility of the thin-body GaSb-OI p-MOSFETs decreases with a decrease in the GaSb-OI thickness or with an increase in Al{sub 2}O{sub 3} ALD temperature. The InAs passivation of GaSb-OI MOS interfaces can enhance the peak effective mobility up to 159 cm{sup 2}/V s for GaSb-OI p-MOSFETs with the 20-nm-thick GaSb layer.

  11. Effect of EDTA and Phosphoric Acid Pretreatment on the Bonding Effectiveness of Self-Etch Adhesives to Ground Enamel

    PubMed Central

    Ibrahim, Ihab M.; Elkassas, Dina W.; Yousry, Mai M.

    2010-01-01

    Objectives: This in vitro study determined the effect of enamel pretreatment with phosphoric acid and ethylenediaminetetraacetic acid (EDTA) on the bond strength of strong, intermediary strong, and mild self-etching adhesive systems. Methods: Ninety sound human premolars were used. Resin composite cylinders were bonded to flat ground enamel surfaces using three self-etching adhesive systems: strong Adper Prompt L-Pop (pH=0.9–1.0), intermediary strong AdheSE (pH=1.6–1.7), and mild Frog (pH=2). Adhesive systems were applied either according to manufacturer instructions (control) or after pretreatment with either phosphoric acid or EDTA (n=10). After 24 hours, shear bond strength was tested using a universal testing machine at a cross-head speed of 0.5 mm/minute. Ultra-morphological characterization of the surface topography and resin/enamel interfaces as well as representative fractured enamel specimens were examined using scanning electron microscopy (SEM). Results: Neither surface pretreatment statistically increased the mean shear bond strength values of either the strong or the intermediary strong self-etching adhesive systems. However, phosphoric acid pretreatment significantly increased the mean shear bond strength values of the mild self-etching adhesive system. SEM examination of enamel surface topography showed that phosphoric acid pretreatment deepened the same etching pattern of the strong and intermediary strong adhesive systems but converted the irregular etching pattern of the mild self-etching adhesive system to a regular etching pattern. SEM examination of the resin/enamel interface revealed that deepening of the etching pattern was consistent with increase in the length of resin tags. EDTA pretreatment had a negligible effect on ultra-morphological features. Conclusions: Use of phosphoric acid pretreatment can be beneficial with mild self-etching adhesive systems for bonding to enamel. PMID:20922162

  12. Durable bonds at the adhesive/dentin interface: an impossible mission or simply a moving target?

    PubMed Central

    SPENCER, Paulette; Jonggu PARK, Qiang YE; MISRA, Anil; BOHATY, Brenda S.; SINGH, Viraj; PARTHASARATHY, Ranga; SENE, Fábio; de Paiva GONÇALVES, Sérgio Eduardo; LAURENCE, Jennifer

    2013-01-01

    Composite restorations have higher failure rates, more recurrent caries and increased frequency of replacement as compared to dental amalgam. Penetration of bacterial enzymes, oral fluids, and bacteria into the crevices between the tooth and composite undermines the restoration and leads to recurrent decay and failure. The gingival margin of composite restora tions is particularly vulnerable to decay and at this margin, the adhesive and its seal to dentin provides the primary barrier between the prepared tooth and the environment. The intent of this article is to examine physico-chemical factors that affect the integrity and durability of the adhesive/dentin interfacial bond; and to explore how these factors act synergistically with mechanical forces to undermine the composite restoration. The article will examine the various avenues that have been pursued to address these problems and it will explore how alterations in material chemistry could address the detrimental impact of physico-chemical stresses on the bond formed at the adhesive/dentin interface. PMID:24855586

  13. An in vitro study of the bond strength of five adhesives used for vinyl polysiloxane impression materials and tray materials.

    PubMed

    Kumar, Surender; Gandhi, Udey Vir; Banerjee, Saurav

    2014-03-01

    Although stock trays often provide mechanical retention for elastomeric impression materials, manufacturers typically recommend the use of an adhesive, whether a stock or custom tray is used. The mention of the bond strength on the adhesive packaging is not available, therefore the clinician has no idea whatsoever of the ideal adhesive. The aim of this study was to evaluate the bond strength of three vinyl polysiloxane (VPS) materials, one with a poly(methyl methacrylate) autopolymerizing (PMMA) specimen and another with a light-polymerizing tray material (VLC), using the adhesive recommended by the manufacturer of the impression material, and two universal adhesives. A total of ninety specimens (15 × 15 × 20 mm) were used, 45 specimens were made in PMMA and rest 45 was made in VLC. Five paint-on adhesives (Coltene, Caulk, 3M, universal Zhermack and universal GC) were applied. Three impression materials, Affinis, Reprosil, and 3M, were mixed and injected into a perforated poly vinyl chloride cylinder. Tray specimens were positioned against the open cylinder end in contact with the VPS material. Tensile strength tests were conducted until adhesive separation failure. Mean values and standard errors of the adhesive strength were recorded in MPa for each material combination. GC paint-on universal adhesive provided significantly higher adhesive strength values.

  14. Multi-step adhesive cementation versus one-step adhesive cementation: push-out bond strength between fiber post and root dentin before and after mechanical cycling.

    PubMed

    Amaral, Marina; Rippe, Marilia Pivetta; Bergoli, Cesar Dalmolin; Monaco, Carlo; Valandro, Luiz Felipe

    2011-01-01

    This study evaluated the effects of mechanical cycling on resin push-out bond strength to root dentin, using two strategies for fiber post cementation. Forty bovine roots were embedded in acrylic resin after root canal preparation using a custom drill of the fiber post system. The fiber posts were cemented into root canals using two different strategies (N = 20): a conventional adhesive approach using a three-step etch-and-rinse adhesive system combined with a conventional resin cement (ScotchBond Multi Purpose Plus + RelyX ARC ), or a simplified adhesive approach using a self-adhesive resin cement (RelyX U100). The core was built up with composite resin and half of the specimens from each cementation strategy were submitted to mechanical cycling (45 degree angle; 37 degrees C; 88 N; 4 Hz; 700,000 cycles). Each specimen was cross-sectioned and the disk specimens were pushed-out. The means from every group (n = 10) were statistically analyzed using a two-way ANOVA and a Tukey test (P = 0.05). The cementation strategy affected the push-out results (P < 0.001), while mechanical cycling did not (P = 0.3716). The simplified approach (a self-adhesive resin cement) had better bond performance despite the conditioning. The self-adhesive resin cement appears to be a good option for post cementation. Further trials are needed to confirm these results.

  15. Comparative evaluation of microtensile bond strength of different solvent based one step and two step adhesive systems to dentin. An in-vitro study

    PubMed Central

    Somasundaram, Pavithra; Uthappa, Roshan; Shivgange, Vinay; Shivamurthy, GB; Shivanna, Vasundhara

    2013-01-01

    Aim and Objective: To compare and evaluate the micro tensile bond strength of different solvent based one step and two step adhesive systems to dentin. Materials and Methods: Sixty recently extracted human mandibular premolars were subjected for the study and divided into 4 groups of fifteen each. The adhesive materials Single Bond, Prime and Bond XP, Clearfil S3 Bond and G-Bond were applied to flat dentin surfaces according to the manufacturer's instructions. After resin composite build up, teeth were sectioned to obtain beams with an approximate cross sectional area of 2 mm2 and stressed to failure. Data were analysed statistically by ANOVA and student Neuman Keuls multiple comparison tests. Results: The study demonstrated that Single Bond has better bond strength to dentin compared to the other adhesive systems. Conclusion: Ethanol and water based two-step adhesive Single Bond exhibited significantly higher microtensile bond strength values to dentin among all the adhesive systems tested. PMID:23956544

  16. Bonding Strength Properties of Adhesively-Timber Joint with Thixotropic and Room Temperature Cured Epoxy Based Adhesive Reinforced with Nano- and Micro-particles

    NASA Astrophysics Data System (ADS)

    Ahmad, Z.; Ansell, M. P.; Smedley, D.

    2011-02-01

    This research work is concerned with in situ bonded-in timber connection using pultruded rod; where the manufacturing of such joint requires adhesive which can produce thick glue-lines and does not allow any use of pressure and heat. Four types of thixotropic (for ease application) and room temperature cured epoxy based were used namely CB10TSS (regarded as standards adhesive), Nanopox (modification of CB10TSS with addition of nanosilica), Albipox (modification of CB10TSS with addition of liquid rubber) and Timberset (an epoxy-based adhesive with addition of micro-size ceramic particles). The quality of the adhesive bonds was accessed using block shear test in accordance with ASTM D905. The bond strength depends on how good the adhesive wet the timber surface. Therefore the viscosity and contact angle was also measured. The nano- and microfiller additions increased the bond strength significantly. The viscosity correlates well with contact angle measurements where lower viscosities are associated with lower contact angles. However contact angle contradicts with measured strength and wettability.

  17. Plasma polymerized primer for rubber-to-metal bonding: Adhesion measurement and interphase characterization

    SciTech Connect

    Tsai, Y.M.; Boerio, F.J.; Kim, D.K.

    1996-12-31

    Adhesion of rubber to steel is of considerable practical importance in many areas of technology. However, direct adhesion of natural rubber to most metals is very poor. As a result, metals are frequently plated with brass, to which rubber adheres very strongly, or else the metals are coated with proprietary primers and adhesives in order to obtain adhesion of rubber. Plasma processing has been attracting attention in many areas due to some of its unique features. During the process, the synthesis and deposition of plasma polymers can be accomplished at the same time, making plasma processing a very efficient method for polymer coating. Plasma processing also allows flexible combinations of reactor parameters which would provide a great deal of process control and versatility. Moreover, in plasma processing, there are no solvents involved and there are no solvent-disposal problems. The purpose of this paper is to describe results the authors have obtained in developing plasma polymerized primer films to enhance rubber-to-steel bonding. Preliminary durability test results are reported. Results obtained using a model rubber system to simulate reactions in the rubber/primer {open_quotes}interphase{close_quotes} are also described.

  18. Increasing the Strength of Adhesively Bonded Joints by Tapering the Adherends

    SciTech Connect

    GUESS,TOMMY R.; METZINGER,KURT E.

    1999-09-09

    Wind turbine blades are often fabricated with composite materials. These composite blades are frequently attached to a metallic structure with an adhesive bond. For the baseline composite-to-steel joint considered in this study, failure typically occurs when the adhesive debonds from the steel adherend. Previous efforts established that the adhesive peel stresses strongly influence the strength of these joints for both single-cycle and fatigue loading. This study focused on reducing the adhesive peel stresses present in these joints by tapering the steel adherends. Several different tapers were evaluated using finite element analysis before arriving at a final design. To confirm that the selected taper was an improvement to the existing design, the baseline joint and the modified joint were tested in both compression and tension. In these axial tests, the compressive strengths of the joints with tapered adherends were greater than those of the baseline joints for both single-cycle and low-cycle fatigue. In addition, only a minor reduction in tensile strength was observed for the joints with tapered adherends when compared to the baseline joints. Thus, the modification would be expected to enhance the overall performance of this joint.

  19. Analytical and Numerical Results for an Adhesively Bonded Joint Subjected to Pure Bending

    NASA Technical Reports Server (NTRS)

    Smeltzer, Stanley S., III; Lundgren, Eric

    2006-01-01

    A one-dimensional, semi-analytical methodology that was previously developed for evaluating adhesively bonded joints composed of anisotropic adherends and adhesives that exhibit inelastic material behavior is further verified in the present paper. A summary of the first-order differential equations and applied joint loading used to determine the adhesive response from the methodology are also presented. The method was previously verified against a variety of single-lap joint configurations from the literature that subjected the joints to cases of axial tension and pure bending. Using the same joint configuration and applied bending load presented in a study by Yang, the finite element analysis software ABAQUS was used to further verify the semi-analytical method. Linear static ABAQUS results are presented for two models, one with a coarse and one with a fine element meshing, that were used to verify convergence of the finite element analyses. Close agreement between the finite element results and the semi-analytical methodology were determined for both the shear and normal stress responses of the adhesive bondline. Thus, the semi-analytical methodology was successfully verified using the ABAQUS finite element software and a single-lap joint configuration subjected to pure bending.

  20. Effect of bromelain enzyme for dentin deproteinization on bond strength of adhesive system

    PubMed Central

    Chauhan, Kirti; Basavanna, Revaplar Siddaveerappa; Shivanna, Vasundhara

    2015-01-01

    Aims: To assess the deproteinizing effect of bromelain enzyme and compare it with 5% sodium hypochlorite (NaOCl) on shear bond strength before application of the adhesive system. Materials and Methods: A total of 30 extracted human premolars were divided into three groups, each one consisted of 10 teeth. The occlusal surface was wet ground to expose superficial dentin. In Group 1, teeth were etched; in Group 2, teeth were etched and deproteinized with bromelain enzyme; in Group 3, teeth were etched and deproteinized with 5% NaOCl. Upon completion of the adhesive procedures, resin composite was inserted into the plastic tube and light-polymerized. All specimens were stored at 37°C in water for 24 h, and the specimens were transferred to the universal testing machine, and then subjected to shear bond strength analysis at a crosshead speed of 1.0 mm/min. Statistical Analysis Used: Data were statistically analyzed using one-way analysis of variance and unpaired t-test at a significance level of 0.05. The statistical analysis was performed using SPSS version 12.0.1 for Windows (SPSS Inc., Chicago, IL, USA). Results: The bond strength results were significantly influenced by the application of bromelain enzyme. Statistically significant differences were not demonstrated in control group and NaOCl-treated group. The highest bond strength was seen in bromelain enzyme-treated group. Conclusions: Within the limitations of the present study, it was concluded that removal of unsupported collagen fiber with bromelain enzyme after acid etching results in improved bond strength. PMID:26430297

  1. Effect of low-shrinking composite on the bonding effectiveness of two adhesives in occlusal Class-I cavities.

    PubMed

    Mine, Atsushi; De Munck, Jan; Cardoso, Marcio V; Van Landuyt, Kirsten L; Poitevin, André; Kuboki, Takuo; Yoshida, Yasuhiro; Suzuki, Kazuomi; Van Meerbeek, Bart

    2012-01-01

    The purpose of this study was to evaluate if a low-shrinking composite can improve the bonding effectiveness of adhesives in highly constrained conditions. A low-shrinking composite ('els-extra low shrinkage', Saremco) was bonded in standardized occlusal Class-I cavities using a three-step ('cmf', Saremco) and a two-step etch-and-rinse adhesive ('XP Bond', Dentsply). Both adhesives were also combined with a conventional composite ('Z100', 3M ESPE). Half of the restored cavities were exposed to 20,000 thermo-cycles. 3-way ANOVA revealed a significant effect for the factors 'adhesive' and 'composite' (both p<0.0001), but not for 'thermo-cycling' (p=0.994). Significantly higher bond strengths were recorded for the low-shrinking composite than for the control composite, using either of the adhesives. The low-shrinking composite in combination with the three-step etch-and-rinse adhesive performed best in the high C-factor Class-I cavity. The two-step etch-and-rinse adhesive suffered strongly from polymerization-shrinkage stress, which could be partially restored by using the low-shrinking composite.

  2. Antibacterial Activity and Bonding Ability of an Orthodontic Adhesive Containing the Antibacterial Monomer 2-Methacryloxylethyl Hexadecyl Methyl Ammonium Bromide

    PubMed Central

    Yu, Fan; Dong, Yan; Yu, Hao-han; Lin, Ping-ting; Zhang, Ling; Sun, Xiang; Liu, Yan; Xia, Yu-ning; Huang, Li; Chen, Ji-hua

    2017-01-01

    Irreversible white spot lesion (WSL) occurs in up to 50% of patients during orthodontic treatment. Therefore, orthodontic adhesives need to be able to inhibit or reduce bacterial growth in order to prevent or minimize WSL. This study evaluated the antibacterial effect and shear bond strength (SBS) of a resin-based orthodontic adhesive containing the antibacterial monomer 2-methacryloxylethyl hexadecyl methyl ammonium bromide (MAE-HB). MAE-HB was added at three concentrations (1, 3, and 5 wt%) to a commercial orthodontic adhesive Transbond XT, while the blank control comprised unmodified Transbond XT. Their antibacterial effects on Streptococcus mutans were investigated after 0 and 180 days of aging. The SBS of metal brackets bonded to the buccal enamel surface of human premolars was assessed. Compared with the blank control, the MAE-HB-incorporated adhesive exhibited a significant contact inhibitory effect on the growth of S. mutans (P < 0.05), even after 180 days of aging. SBS and adhesive remnant index values revealed that the bonding ability of the experimental adhesive was not significantly adversely affected by the incorporation of MAE-HB at any of the three concentrations. Therefore, orthodontic adhesives with strong and long-lasting bacteriostatic properties can be created through the incorporation of MAE-HB without negatively influencing bonding ability. PMID:28169312

  3. Supersonic Retropulsion Surface Preparation of Carbon Fiber Reinforced Epoxy Composites for Adhesive Bonding

    NASA Technical Reports Server (NTRS)

    Palmieri, Frank L.; Belcher, Marcus A.; Wohl, Christopher J.; Blohowiak, Kay Y.; Connell, John W.

    2013-01-01

    Surface preparation is widely recognized as a key step to producing robust and predictable bonds in a precise and reproducible manner. Standard surface preparation techniques, including grit blasting, manual abrasion, and peel ply, can lack precision and reproducibility, which can lead to variation in surface properties and subsequent bonding performance. The use of a laser to ablate composite surface resin can provide an efficient, precise, and reproducible means of preparing composite surfaces for adhesive bonding. Advantages include elimination of physical waste (i.e., grit media and sacrificial peel ply layers that ultimately require disposal), reduction in process variability due to increased precision (e.g. increased reproducibility), and automation of surface preparation, all of which improve reliability and process control. This paper describes a Nd:YAG laser surface preparation technique for composite substrates and the mechanical performance and failure modes of bonded laminates thus prepared. Additionally, bonded specimens were aged in a hot, wet environment for approximately one year and subsequently mechanically tested. The results of a one year hygrothermal aging study will be presented.

  4. Investigation of the adhesive bonding technology for the insulator structure of EAST neutral beam injector

    SciTech Connect

    Wei, Jiang-Long Li, Jun; Hu, Chun-Dong; Xie, Ya-Hong; Jing, Hao

    2014-07-15

    A key issue on the development of EAST ion source was the junction design of insulator structure, which consists of three insulators and four supporting flanges of electrode grid. Because the ion source is installed on the vertical plane, the insulator structure has to withstand large bending and shear stress due to the gravity of whole ion source. Through a mechanical analysis, it was calculated that the maximum bending normal stress was 0.34 MPa and shear stress was 0.23 MPa on the insulator structure. Due to the advantages of simplicity and high strength, the adhesive bonding technology was applied to the junction of insulator structure. A tensile testing campaign of different junction designs between insulator and supporting flange was performed, and a junction design of stainless steel and fiber enhanced epoxy resin with epoxy adhesive was determined. The insulator structure based on the determined design can satisfy both the requirements of high-voltage holding and mechanical strength.

  5. Assessment of the Shear Bond Strength between Nanofilled Composite Bonded to Glass-ionomer Cement Using Self-etch Adhesive with Different pHs and Total-Etch Adhesive

    PubMed Central

    Sharafeddin, Farahnaz; Choobineh, Mohammad Mehdi

    2016-01-01

    Statement of the Problem In the sandwich technique, the undesirable bond between the composite resin and glass-ionomer cement (GIc) is one of the most important factors which lead to the failure of restoration. Total-etch and self-etch adhesives may improve the bond strength based on their pH. Purpose The purpose of this study was to evaluate the shear bond strength between the nanofilled composite resin and GIc using different adhesives. Materials and Method In this experimental study, 40 specimens (6×6mm) in 4 groups (n=10) were prepared in acrylic mold. Each specimen contained conventional GI ChemFil Superior with a height of 3mm, bonded to Z350 composite resin with a height measured 3mm. In order to bond the composite to the GI, the following adhesives were used, respectively: A: mild Clearfil SE Bond self-etch (pH=2), B: intermediate OptiBond self-etch (pH=1.4), C: strong Adper Prompt L-Pop (pH=1), and D: Adper Single Bond 2 total-etch (pH=7.2). The shear bond strength was measured by using universal testing machine with a crosshead speed of 1mm/min. One-way ANOVA and Tukey’s test were used to analyze the data (p< 0.05). Results The shear bond strength in group A was significantly higher than group B (p= 0.002), C (p< 0.001), and D (p< 0.001). Moreover, the shear bond strength of groups A and B (self-etch) was significantly different from group D (total-etch) (p< 0.001); and C (self-etch) with D (p= 0.024). Conclusion The results of this study showed that applying the mild self-etch adhesive between the composite and the GIc results in stronger shear bond strength compared to intermediate and strong self-etch adhesives. Moreover, the self-etch adhesive increased the shear bond strength between composite resin and GIc more significantly than total-etch adhesive. PMID:26966701

  6. Influence of zinc-oxide eugenol, formocresol, and ferric sulfate on bond strength of dentin adhesives to primary teeth.

    PubMed

    Salama, Fouad Saad

    2005-08-15

    This study evaluated in vitro the influence of a temporary filling {zinc oxide-eugenol (ZOE)} and two pulpotomy agents {formocresol (FC) and ferric sulfate (FS)} on shear bond strength (SBS) of two dentin adhesives to the dentin of primary molars. A total of 80 dentin surfaces were prepared and randomly allocated into 10 groups of 8 specimens each. Groups were subjected to different treatments, which included covering with a paste of ZOE mixed at different powder:liquid (P:L) ratios, placement on a gauze soaked in FC or FS, or they received no pretreatment and served as a control. XRV Herculite composite cylinders were bonded to dentin surfaces using Prime and Bond NT adhesive resin or Opti Bond Solo Plus adhesive resin. SBSs were determined using the lnstron testing machine running at a crosshead speed of 0.5 mm/min. The use of ZOE mixed at the lower P:L ratio of 10g:2g significantly decreased the values of SBS of the two adhesives. The use of two pulpotomy agents (FC and FS) significantly decreased the SBS of the two adhesives. The bond strength to dentin of primary teeth was influenced by the pulpotomy agents used and the ZOE P:L ratio but not by the adhesive system used.

  7. Shear Bond Strengths of Methacrylate- and Silorane-based Composite Resins to Feldspathic Porcelain using Different Adhesive Systems

    PubMed Central

    Mohammadi, Narmin; Shakur Shahabi, Maryam; Kimyai, Soodabeh; Pournagi Azar, Fatemeh; Ebrahimi Chaharom, Mohammad Esmaeel

    2015-01-01

    Background and aims. Use of porcelain as inlays, laminates and metal-ceramic and all-ceramic crowns is common in modern dentistry. The high cost of ceramic restorations, time limitations and difficulty of removing these restorations result in delays in replacing fractured restorations; therefore, their repair is indicated. The aim of the present study was to compare the shear bond strengths of two types of composite resins (methacrylate-based and silorane-based) to porcelain, using three adhesive types. Materials and methods. A total of 156 samples of feldspathic porcelain surfaces were prepared with air-abrasion and randomly divided into 6 groups (n=26). In groups 1-3, Z250 composite resin was used to repair porcelain samples with Ad-per Single Bond 2 (ASB), Clearfil SE Bond (CSB) and Silorane Adhesive (SA) as the bonding systems, afterapplication of silane, respectively. In groups 4-6, the same adhesives were used in the same manner with Filtek Silorane composite resin. Finally, the shear bond strengths of the samples were measured. Two-way ANOVA and post hoc Tukey tests were used to compare bond strengths between the groups with different adhesives at P<0.05. Results. There were significant differences in the mean bond strength values in terms of the adhesive type (P<0.001). In addition, the interactive effect of the adhesive type and composite resin type had no significant effect on bond strength (P=0.602). Conclusion. The results of the present study showed the highest repair bond strength values to porcelain with both composite resin types with the application of SA and ASB. PMID:26697151

  8. A self-diagnostic adhesive for monitoring bonded joints in aerospace structures

    NASA Astrophysics Data System (ADS)

    Zhuang, Yitao; Li, Yu-hung; Kopsaftopoulos, Fotis; Chang, Fu-Kuo

    2016-04-01

    Bondline integrity is still one of the most critical concerns in the design of aircraft structures up to date. Due to the lack of confidence on the integrity of the bondline both during fabrication and service, the industry standards and regulations still require assembling the composite using conventional fasteners. Furthermore, current state-of-the-art non-destructive evaluation (NDE) and structural health monitoring (SHM) techniques are incapable of offering mature solutions on the issue of bondline integrity monitoring. Therefore, the objective of this work is the development of an intelligent adhesive film with integrated micro-sensors for monitoring the integrity of the bondline interface. The proposed method makes use of an electromechanical-impedance (EMI) based method, which is a rapidly evolving approach within the SHM family. Furthermore, an innovative screen-printing technique to fabricate piezoelectric ceramic sensors with minimal thickness has been developed at Stanford. The approach presented in this study is based on the use of (i) micro screen-printed piezoelectric sensors integrated into adhesive leaving a minimal footprint on the material, (ii) numerical and analytical modeling of the EMI spectrum of the adhesive bondline, (iii) novel diagnostic algorithms for monitoring the bondline integrity based on advanced signal processing techniques, and (iv) the experimental assessment via prototype adhesively bonded structures in static (varying loads) and dynamic (fatigue) environments. The proposed method will provide a huge confidence on the use of bonded joints for aerospace structures and lead to a paradigm change in their design by enabling enormous weight savings while maximizing the economic and performance efficiency.

  9. Adhesives in Building--Lamination of Structural Timber Beams, Bonding of Cementitious Materials, Bonding of Gypsum Drywall Construction. Proceedings of a Conference of the Building Research Institute, Division of Engineering and Industrial Research (Spring 1960).

    ERIC Educational Resources Information Center

    National Academy of Sciences - National Research Council, Washington, DC.

    The role of adhesives in building design is discussed. Three major areas are as follows--(1) lamination of structural timber beams, (2) bonding of cementitious materials, and (3) bonding of gypsum drywall construction. Topical coverage includes--(1) structural lamination today, (2) adhesives in use today, (3) new adhesives needed, (4) production…

  10. Ultrasonic study of adhesive bond quality at a steel-to-rubber interface by using quadrature phase detection techniques

    NASA Technical Reports Server (NTRS)

    Smith, A. C.; Yang, H.

    1989-01-01

    The quadrature phase detection technique was used to simultaneously monitor the phase and amplitude of a toneburst signal normally reflected from an adhesively bonded steel-to-rubber interface. The measured phase was found to show a positive shift for all bonded samples with respect to the disbonded state - the phase shift being larger for samples with weaker bonds, as manifested by smaller values of applied tensile loads at failure. A model calculation, which incorporates the concept of interfacial strength into the usual problem of wave propagation in multilayered media, was used to deduce a bond-quality parameter from an experimentally measured phase shift. This bond-quality parameter was found to be correlated with the tensile strength of the adhesive bonds at failure loads.

  11. Effect of chlorhexidine on bonding durability of two self-etching adhesives with and without antibacterial agent to dentin

    PubMed Central

    Shafiei, Fereshteh; Alikhani, Armaghan; Alavi, Ali Asghar

    2013-01-01

    Background: Considering the possibility of remaining bacteria in the cavity or invading via microgaps, the use of antibacterial agents in adhesive restoration may be beneficial. This study evaluated the effect of chlorhexidine on immediate and long-term shear bond strength of adhesives with and without antibacterial agent to dentin. Materials and Methods: In this in vitro study, the occlusal surfaces of 80 intact human premolars were removed to expose the flat midcoronal dentin. The teeth were assigned to four groups. Two adhesive systems, Clearfil SE Bond (SE) and Clearfil Protect Bond (PB) were used according to manufacturer's instructions as the control groups. In the experimental groups, 2% chlorhexidine was applied prior to acidic primer of two adhesives. Then, resin composite was applied. Half of the specimens in each group were submitted to shear bond test after 24 h without thermocycling, and the other half were submitted to water storage for 6 months and thermocycling before testing. The data was analyzed using three-way analysis of variance (ANOVA) and t-test (α = 0.05). Results: Chlorhexidine application significantly decreased the initial bond strength (BS) of the two self-etch adhesives to dentin (P < 0.05). There was a significant reduction in BS of SE and PB after aging compared to initial bonding (P < 0.05). However, there was no significant difference between BS of the control and chlorhexidine-treated groups for the tested adhesives after aging. PB showed a lower BS than SE in two time periods (P < 0.05). Conclusion: Chlorhexidine was capable of diminishing the loss of BS of these adhesives over time. However, considering the negative effect of chlorhexidine on the initial BS, the benefits of chlorhexidine associated with these adhesives cannot possibly be used. PMID:24379870

  12. Adhesive Bonding to Hybrid Materials: An Overview of Materials and Recommendations.

    PubMed

    Spitznagel, Frank A; Vuck, Alexander; Gierthmühlen, Petra C; Blatz, Markus B; Horvath, Sebastian D

    2016-10-01

    Recently, hybrid materials have been introduced to the dental market. Together with computer-assisted design/computer-assisted manufacturing (CAD/CAM) composite resins, they form a new class of dental CAD/CAM materials that combine the positive effects of ceramics and composites. As bonding is essential for their clinical longevity, it is crucial to have a good understanding of their material properties and cementation protocols. This review offers clinicians an overview of available hybrid materials and recommendations for their respective adhesive placements.

  13. Systems, Apparatuses, and Methods for Using Durable Adhesively Bonded Joints for Sandwich Structures

    NASA Technical Reports Server (NTRS)

    Smeltzer, III, Stanley S. (Inventor); Lundgren, Eric C. (Inventor)

    2014-01-01

    Systems, methods, and apparatus for increasing durability of adhesively bonded joints in a sandwich structure. Such systems, methods, and apparatus includes an first face sheet and an second face sheet as well as an insert structure, the insert structure having a first insert face sheet, a second insert face sheet, and an insert core material. In addition, sandwich core material is arranged between the first face sheet and the second face sheet. A primary bondline may be coupled to the face sheet(s) and the splice. Further, systems, methods, and apparatus of the present disclosure advantageously reduce the load, provide a redundant path, reduce structural fatigue, and/or increase fatigue life.

  14. Laser treatment of carbon fibre reinforced thermoplastic matrix for adhesive bonding

    NASA Astrophysics Data System (ADS)

    Genna, S.; Leone, C.; Ucciardello, N.; Giuliani, M.

    2016-05-01

    In the present study, laser surface treatment of CFRP made of PPS thermoplastic matrix by means of a 30 W Q-Switched Yb:YAG fiber laser, is investigated with the aim to improve adhesive bonding. The process parameters pulse power, scanning speed, hatch distance and scanning strategy, were varied to the aim to study the influence of the process condition on the first top resin layer removal and fibre damage. The operating window was experimentally determined. The effectiveness of laser treatment was verified by single lap shear test.

  15. The Role of Reactive Functional Groups in Adhesive Bonding at the Aramid-Epoxy Interface.

    DTIC Science & Technology

    1986-09-15

    sta end ZIP CeO . 800 North Quincy Street i-q ?AiI 3 Arlington, VA 22217 " ae’Iv o. ’to. 6 -o. !The Role of Reactive Functional . . . 1 12. onsRonfaI...Unclassified SICUMI VY’V Ct.ASSiiICATyO OP ’T-S PAGE I Cont ... 11. The Role of Reactive Functional Groups in Adhesive Bonding at the Aramid-Epoxy...T-1 ROLE OF REACTIVE FUNCTIONAL GROUPS IN ADHESIVI 3ODI;G AT THE ARA fID-EPOXY INTIFA> BY L.S. PENN, T.J. BYERLEY, AND T.K. LIAO 1IDWEST RESEARCR

  16. Barrier reduction via implementation of InGaN interlayer in wafer-bonded current aperture vertical electron transistors consisting of InGaAs channel and N-polar GaN drain

    SciTech Connect

    Kim, Jeonghee Laurent, Matthew A.; Li, Haoran; Lal, Shalini; Mishra, Umesh K.

    2015-01-12

    This letter reports the influence of the added InGaN interlayer on reducing the inherent interfacial barrier and hence improving the electrical characteristics of wafer-bonded current aperture vertical electron transistors consisting of an InGaAs channel and N-polar GaN drain. The current-voltage characteristics of the transistors show that the implementation of N-polar InGaN interlayer effectively reduces the barrier to electron transport across the wafer-bonded interface most likely due to its polarization induced downward band bending, which increases the electron tunneling probability. Fully functional wafer-bonded transistors with nearly 600 mA/mm of drain current at V{sub GS} = 0 V and L{sub go} = 2 μm have been achieved, and thus demonstrate the feasibility of using wafer-bonded heterostructures for applications that require active carrier transport through both materials.

  17. Use of Hydration Inhibitors to Improve Bond Durability of Aluminum Adhesive Joints

    NASA Technical Reports Server (NTRS)

    Davis, G. D.; Ahearn, J. S.; Matienzo, L. J.; Venables, J. D.

    1985-01-01

    An investigation is conducted of the mechanisms by which nitrilotris methylene phosphonic acid (NTMP) and related compounds are adsorbed onto oxidized aluminum surfaces to inhibit hydration and increase the durability of adhesive bonds formed with inhibitor-treated panels. P - O - Al bonds are identified as the basis of adsorption, and it is found that water initially adsorbed onto the etched aluminum surfaces is displaced by the NTMP. The hydration of the NTMP-treated surfaces occurs in three stages, namely the reverisble physisorption of water, the slow dissolution of NTMP followed by rapid hydration of the freshly exposed Al2O3 to AlOOH and further hydration of the surface to Al(OH)3. Five properties of an ideal inhibitor are identified.

  18. AMORPHOUS CALCIUM PHOSPHATE COMPOSITES AND THEIR EFFECT ON COMPOSITE-ADHESIVE-DENTIN BONDING

    PubMed Central

    Antonucci, J.M.; O’Donnell, J.N.R.; Schumacher, G.E.; Skrtic, D.

    2009-01-01

    This study evaluates the bond strength and related properties of photo-polymerizable, remineralizing amorphous calcium phosphate (ACP) polymeric composite-adhesive systems to dentin after various periods of aqueous aging at 37 °C. An experimental ACP base and lining composite was made from a photo-activated resin comprising 2,2-bis[p-(2’-hydroxy-3’-methacryloxypropoxy)phenyl]propane (Bis-GMA), triethylene glycol dimethacrylate (TEGDMA), 2-hydroxyethyl methacrylate (HEMA) and zirconyl dimethacrylate (ZrDMA); designated BTHZ. An experimental orthodontic composite was formulated from a photo-activated resin comprising ethoxylated bisphenol A dimethacrylate (EBPADMA), TEGDMA, HEMA and methacryloxyethyl phthalate (MEP); designated ETHM. In both composite series three fillers were compared: 1) freshly precipitated zirconium-modified ACP freshly precipitated (as-prepared Zr-ACP), 2) milled Zr-ACP and 3) an ion-leachable fluoride glass. In addition to the shear bond strength (SBS), work to fracture and failure modes of the orthodontic composites were determined. The SBS of the base and lining ACP composites appeared unaffected by filler type or immersion time. In the orthodontic ACP composite series, milled ACP composites showed initial mechanical advantages over as-prepared ACP composites, and produced higher incidence of a failure mode consistent with stronger adhesion. After six months of aqueous exposure, 80 % of specimens failed at the dentin-primer interface, with a 42 % overall reduction in bond strength. BTHZ and ETHM based ACP composites are potentially effective anti-demineralizing-remineralizing agents with possible clinical utility as protective base-liners and orthodontic cements, respectively. The analysis of the bond strength and failure modalities suggests that milled ACP composites may offer greater potential in clinical applications. PMID:19696914

  19. The Role of Host-derived Dentinal Matrix Metalloproteinases in Reducing Dentin Bonding of Resin Adhesives

    PubMed Central

    Zhang, Shan-chuan; Kern, Matthias

    2009-01-01

    Dentin matrix metalloproteinases (MMPs) are a family of host-derived proteolytic enzymes trapped within mineralized dentin matrix, which have the ability to hydrolyze the organic matrix of demineralized dentin. After bonding with resins to dentin there are usually some exposed collagen fibrils at the bottom of the hybrid layer owing to imperfect resin impregnation of the demineralized dentin matrix. Exposed collagen fibrils might be affected by MMPs inducing hydrolytic degradation, which might result in reduced bond strength. Most MMPs are synthesized and released from odontoblasts in the form of proenzymes, requiring activation to degrade extracellular matrix components. Unfortunately, they can be activated by modern self-etch and etch-and-rinse adhesives. The aim of this review is to summarize the current knowledge of the role of dentinal host-derived MMPs in dentin matrix degradation. We also discuss various available MMP inhibitors, especially chlorhexidine, and suggest that they could provide a potential pathway for inhibiting collagen degradation in bonding interfaces thereby increasing dentin bonding durability. PMID:20690420

  20. The role of host-derived dentinal matrix metalloproteinases in reducing dentin bonding of resin adhesives.

    PubMed

    Zhang, Shan-chuan; Kern, Matthias

    2009-12-01

    Dentin matrix metalloproteinases (MMPs) are a family of host-derived proteolytic enzymes trapped within mineralized dentin matrix, which have the ability to hydrolyze the organic matrix of demineralized dentin. After bonding with resins to dentin there are usually some exposed collagen fibrils at the bottom of the hybrid layer owing to imperfect resin impregnation of the demineralized dentin matrix. Exposed collagen fibrils might be affected by MMPs inducing hydrolytic degradation, which might result in reduced bond strength. Most MMPs are synthesized and released from odontoblasts in the form of proenzymes, requiring activation to degrade extracellular matrix components. Unfortunately, they can be activated by modem self-etch and etch-and-rinse adhesives. The aim of this review is to summarize the current knowledge of the role of dentinal host-derived MMPs in dentin matrix degradation. We also discuss various available MMP inhibitors, especially chlorhexidine, and suggest that they could provide a potential pathway for inhibiting collagen degradation in bonding interfaces thereby increasing dentin bonding durability.

  1. Ultrastructural examination of one-step self-etch adhesive bonded primary sound and caries-affected dentin

    PubMed Central

    HOSOYA, YUMIKO; TAY, FRANKLIN R.; GARCÍA-GODOY, FRANKLIN; PASHLEY, DAVID H.

    2013-01-01

    Purpose This study examined the ultrastructure and silver nanoleakage of the resin-dentin interfaces in sound and caries-affected primary tooth dentin bonded with a 4-META one-step self-etch adhesive. Materials and Methods Each of five sound and carious primary molars was bonded with Hybrid Bond. Resin-dentin interfaces were observed with TEM micrographs obtained from silver-impregnated, unstained and undemineralized sections of bonded sound and caries-affected primary dentin, and stained and demineralized sections of bonded sound primary dentin with silver impregnation. Results For sound dentin, silver nanoleakage was observed extensively in the patent dentinal tubules, within the dentin beneath the hybrid layer, within the hybrid layer in some specimens, and as water trees that partially protruded into the overlying adhesive layer. The hybrid layer was about 1 μm thick. Smear plugs in the dentinal tubules and smear on the ground dentin protruded in the hybrid layer. Remnants of demineralized smear were observed overlying adhesive layer. For caries-affected dentin, the hybrid layer was obscure. Dentinal tubules were occluded with mineral deposits. There were no water trees or nanoleakage in the adhesive layer or hybrid layer. However, smear remnants were observed in adhesive layer and heavily silver deposits were observed in the highly porous underlying caries-affected dentin. PMID:19146129

  2. Ultrasonic, microwave, and millimeter wave inspection techniques for adhesively bonded stacked open honeycomb core composites

    NASA Astrophysics Data System (ADS)

    Thomson, Clint D.; Cox, Ian; Ghasr, Mohammad Tayeb Ahmed; Ying, Kuang P.; Zoughi, Reza

    2015-03-01

    Honeycomb sandwich composites are used extensively in the aerospace industry to provide stiffness and thickness to lightweight structures. A common fabrication method for thick, curved sandwich structures is to stack and bond multiple honeycomb layers prior to machining core curvatures. Once bonded, each adhesive layer must be inspected for delaminations and the presence of unwanted foreign materials. From a manufacturing and cost standpoint, it can be advantageous to inspect the open core prior to face sheet closeout in order to reduce end-article scrap rates. However, by nature, these honeycomb sandwich composite structures are primarily manufactured from low permittivity and low loss materials making detection of delamination and some of the foreign materials (which also are low permittivity and low loss) quite challenging in the microwave and millimeter wave regime. Likewise, foreign materials such as release film in adhesive layers can be sufficiently thin as to not cause significant attenuation in through-transmission ultrasonic signals, making them difficult to detect. This paper presents a collaborative effort intended to explore the efficacy of different non-contact NDI techniques for detecting flaws in a stacked open fiberglass honeycomb core panel. These techniques primarily included air-coupled through-transmission ultrasonics, single-sided wideband synthetic aperture microwave and millimeter-wave imaging, and lens-focused technique. The goal of this investigation has been to not only evaluate the efficacy of these techniques, but also to determine their unique advantages and limitations for evaluating parameters such as flaw type, flaw size, and flaw depth.

  3. Air-coupled ultrasonic testing of metal adhesively bonded joints using cellular polypropylene transducers

    NASA Astrophysics Data System (ADS)

    Gaal, Mate; Bartusch, Jürgen; Dohse, Elmar; Kreutzbruck, Marc; Amos, Jay

    2014-02-01

    Adhesively bonded aluminum components have been widely used in the aerospace industry for weight-efficient and damage-tolerant structures. Automated squirter jet immersion ultrasonic testing is a common inspection technique to assure the bond integrity of large, contoured assemblies. However, squirter jet inspection presents several limitations in scanning speed, related to water splash noise over protruding stiffeners and splash interference crosstalk in multi-channel inspection systems. Air-coupled ultrasonic testing has been evaluated as an alternative, possibly offering the benefits of increased throughput by enabling higher speeds, and eliminating the contamination concerns and maintenance issues of water couplant systems. Adhesive joints of multi-layer aluminum plates with artificial disbonds were inspected with novel air-coupled ultrasonic probes based on cellular polypropylene. Disbonds of various sizes were engineered in several multi-layer configurations and at various depths. Results were compared with squirter jet immersion and conventional piezoelectric transducer designs in terms of scan contrast, resolution and inspection time.

  4. Evaluation of the bond strength of different adhesive agents to a resin-modified calcium silicate material (TheraCal LC).

    PubMed

    Karadas, Muhammed; Cantekin, Kenan; Gumus, Husniye; Ateş, Sabit Melih; Duymuş, Zeynep Yesil

    2016-09-01

    This study evaluated the bond strength of different adhesive agents to TheraCal LC and mineral trioxide aggregate (MTA) and examined the morphologic changes of these materials with different surface treatments. A total of 120 specimens, 60 of MTA Angelus (AMTA), and 60 of TheraCal LC, were prepared and divided into six subgroups according to the adhesive agent used; these agents included Scotchbond Multipurpose, Clearfil SE Bond, Clearfil Protect Bond, Clearfil S(3) Bond, OptiBond All-in-One, and G-aenial Bond. After application of adhesive agents, Filtek Z250 composite resin was placed onto the specimens. Shear bond strengths were measured using a universal testing machine, followed by examination of the fractured surfaces. The surface changes of the specimens were observed using scanning electron microscopy. Data were compared by two-way analysis of variance. Although no significant differences were found among the bond strengths of different adhesives to AMTA (p = 0.69), a significant difference was found in terms of bond strengths of different adhesives to the TheraCal LC surface (p < 0.001). The total-etch adhesive system more strongly bonded to TheraCal LC compared to the bond with other adhesives. TheraCal LC bonded significantly more strongly than AMTA regardless of the adhesive agents tested. Resin-modified calcium silicate showed higher bond strength than AMTA in terms of the composite bond to these materials with different bonding systems. On the other hand, the highest shear bond-strength values were found for composite bonds with the combination of TheraCal LC and the total-etch adhesive system. SCANNING 38:403-411, 2016. © 2015 Wiley Periodicals, Inc.

  5. Mechanisms of degradation in adhesive joint strength: Glassy polymer thermoset bond in a humid environment

    DOE PAGES

    Kropka, Jamie Michael; Adolf, Douglas Brian; Spangler, Scott Wilmer; ...

    2015-08-06

    The degradation in the strength of napkin-ring (NR) joints bonded with an epoxy thermoset is evaluated in a humid environment. While adherend composition (stainless steel and aluminum) and surface preparation (polished, grit blasted, primed, coupling agent coated) do not affect virgin (time=0) joint strength, they can significantly affect the role of moisture on the strength of the joint. Adherend surface abrasion and corrosion processes are found to be key factors in determining the reliability of joint strength in humid environments. In cases where surface specific joint strength degradation processes are not active, decreases in joint strength can be accounted formore » by the glass transition temperature, Tg, depression of the adhesive associated with water sorption. Under these conditions, joint strength can be rejuvenated to virgin strength by drying. In addition, the decrease in joint strength associated with water sorption can be predicted by the Simplified Potential Energy Clock (SPEC) model by shifting the adhesive reference temperature, Tref, by the same amount as the Tg depression. When surface specific degradation mechanisms are active, they can reduce joint strength below that associated with adhesive Tg depression, and joint strength is not recoverable by drying. Furthermore, a critical relative humidity (or, potentially, critical water sorption concentration), below which the surface specific degradation does not occur, appears to exist for the polished stainless steel joints.« less

  6. Mechanisms of degradation in adhesive joint strength: Glassy polymer thermoset bond in a humid environment

    SciTech Connect

    Kropka, Jamie Michael; Adolf, Douglas Brian; Spangler, Scott Wilmer; Austin, Kevin N.; Chambers, Robert S.

    2015-08-06

    The degradation in the strength of napkin-ring (NR) joints bonded with an epoxy thermoset is evaluated in a humid environment. While adherend composition (stainless steel and aluminum) and surface preparation (polished, grit blasted, primed, coupling agent coated) do not affect virgin (time=0) joint strength, they can significantly affect the role of moisture on the strength of the joint. Adherend surface abrasion and corrosion processes are found to be key factors in determining the reliability of joint strength in humid environments. In cases where surface specific joint strength degradation processes are not active, decreases in joint strength can be accounted for by the glass transition temperature, Tg, depression of the adhesive associated with water sorption. Under these conditions, joint strength can be rejuvenated to virgin strength by drying. In addition, the decrease in joint strength associated with water sorption can be predicted by the Simplified Potential Energy Clock (SPEC) model by shifting the adhesive reference temperature, Tref, by the same amount as the Tg depression. When surface specific degradation mechanisms are active, they can reduce joint strength below that associated with adhesive Tg depression, and joint strength is not recoverable by drying. Furthermore, a critical relative humidity (or, potentially, critical water sorption concentration), below which the surface specific degradation does not occur, appears to exist for the polished stainless steel joints.

  7. The effects of two soft drinks on bond strength, bracket microleakage, and adhesive remnant on intact and sealed enamel.

    PubMed

    Navarro, Raúl; Vicente, Ascensión; Ortiz, Antonio J; Bravo, Luis A

    2011-02-01

    The purpose of this study was to evaluate the effects of Coca-Cola and Schweppes Limón on bond strength, adhesive remnant, and microleakage beneath brackets. One hundred and twenty upper central incisor brackets were bonded to bovine incisors and divided into three groups: (1) Control, (2) Coca-Cola, and (3) Schweppes Limón. The teeth were submerged in the drinks three times a day for 15 minutes over a 15 day period. Shear bond strength (SBS) was measured with a universal testing machine, and adhesive remnant evaluated using image analysis equipment. Microleakage at the enamel-adhesive and adhesive-bracket interfaces was determined using methylene blue. One hundred and eight teeth were used for scanning electron microscopy to determine the effect of the drinks on intact and sealed enamel. SBS and adhesive remnant data were analysed using the Kruskal-Wallis test (P < 0.05) and microleakage using the Kruskal-Wallis and Mann-Whitney tests applying Bonferroni correction (P < 0.017). No significant differences were found in SBS and adhesive remnant between the groups (P > 0.05). Microleakage at the enamel-adhesive interface for groups 2 and 3 was significantly greater than for group 1 (P < 0.017). At the adhesive-bracket interface, microleakage was significantly greater in group 2 than in group 1 (P < 0.017) while microleakage in group 3 did not differ significantly from either group 1 or 2 (P < 0.017). The drinks produced enamel erosion, loss of adhesive and microleakage. Coca-Cola and Schweppes Limón did not affect the SBS of brackets or the adhesive remnant.

  8. ADHESION OF AMORPHOUS CALCIUM PHOSPHATE COMPOSITES BONDED TO DENTIN: A STUDY IN FAILURE MODALITY

    PubMed Central

    O’Donnell, J.N.R.; Schumacher, G.E.; Antonucci, J.M.; Skrtic, D.

    2009-01-01

    Aims As a bioactive filler capable of remineralizing tooth structures, the main disadvantage of as-made amorphous calcium phosphate (am-ACP) are its large agglomerates. The objective of this study was to mill ACP, and compare the adhesive strength to dentin, work to fracture, and failure modes of both groups to glass-filled composites and one commercial compomer after 24 h, 1 week, 1, 3 and 6 months of exposure to simulated saliva solution (SLS). Flat dentin surfaces were acid-etched, primed, and photopolymerized. Composites were applied, photo-cured, and debonded in shear. The resin used in each composite was identical: ethoxylated bisphenol A dimethacrylate, triethylene glycol dimethacrylate, 2-hydroxyethyl methacrylate and methacryloxyethyl phthalate. Fillers consisted of am-ACP and milled ACP (m-ACP), and a strontium-containing glass (Sr-glass) at respective mass fractions of (40, 60, and 75) %. Findings 90 % of the fracture surfaces in this study showed adhesive failure, with most of these occurring at the dentin/primer interface. 52 % of failures after 24 h immersion occurred at the primer/composite interface. After six months of SLS exposure, 80 % of specimens failed at the dentin/primer interface, with a 42 % overall reduction in bond strength. Conclusions Milled ACP composites showed initial mechanical advantages over am-ACP composites and the compomer, and produced a higher incidence of a failure mode consistent with stronger adhesion. Evidence is provided which suggests that milled ACP composites may offer enhanced potential in clinical bonding applications. PMID:19107798

  9. The bond strength of adhesive resins to AH plus contaminated dentin cleaned by various gutta-percha solvents.

    PubMed

    Topçuoğlu, Hüseyin Sinan; Demirbuga, Sezer; Pala, Kansad; Cayabatmaz, Muhammed; Topçuoğlu, Gamze

    2015-01-01

    The optimal bonding of adhesives to dentin requires the sealer to be completely removed from dentinal walls. The aim of this study was to investigate the effect of different cleaning procedures using gutta-percha solvents on bond strength of adhesive resins to AH Plus contaminated dentin (APCD). The pulp chamber dentin surfaces were contaminated with AH Plus and cleaned with five different techniques (dry cotton, chloroform, orange oil, eucalyptol, and ethanol). Then, Clearfil SE Bond (CSE) (Kuraray), and Tetric N Bond (TNB) (Ivoclar Vivadent) were applied and filled with a composite resin. The serial sticks (1 × 1 mm) were obtained and tested for microtensile bond strength. Scanning electron microscopy (SEM) was used for analysis of debonded surfaces. Ethanol exhibited the highest bond strength to APCD followed by dry cotton. There was no statistically significant difference between ethanol and dry cotton (p > 0.05). Eucalyptol showed the lowest bond strength to APCD and statistically significant differences (p < 0.05) in comparison with other groups. APCD reduced the bond strength of all adhesive resins. Dry cotton, ethanol, and chloroform were the most suitable techniques when used with CSE together, whereas ethanol was best with TNB.

  10. Shear Bond Strength of Orthodontic Brackets Fixed with Remineralizing Adhesive Systems after Simulating One Year of Orthodontic Treatment.

    PubMed

    Bezerra, Gisele Lima; Torres, Carlos Rocha Gomes; Tonetto, Mateus Rodrigues; Borges, Alvaro Henrique; Kuga, Milton Carlos; Bandeca, Matheus Coelho; Firoozmand, Leily Macedo

    2015-01-01

    The objective of this study is to assess, in vitro, the shear bond strength of orthodontic brackets fixed with remineralizing adhesive systems submitted to thermomechanical cycling, simulating one year of orthodontic treatment. Sixty-four bovine incisor teeth were randomly divided into 4 experimental groups (n = 16): XT: Transbond XT, QC: Quick Cure, OL: Ortholite Color, and SEP: Transbond Plus Self-Etching Primer. The samples were submitted to thermomechanical cycling simulating one year of orthodontic treatment. Shear bond strength tests were carried out using a universal testing machine with a load cell of 50 KgF at 0.5 mm/minute. The samples were examined with a stereomicroscope and a scanning electron microscope (SEM) in order to analyze enamel surface and Adhesive Remnant Index (ARI). Kruskal-Wallis and Mann-Whitney (with Bonferroni correction) tests showed a significant difference between the studied groups (p < 0.05). Groups XT, QC, and SEP presented the highest values of adhesive resistance and no statistical differences were found between them. The highest frequency of failures between enamel and adhesive was observed in groups XT, QC, and OL. Quick Cure (QC) remineralizing adhesive system presented average adhesive resistance values similar to conventional (XT) and self-etching (SEP) adhesives, while remineralizing system (OL) provided the lowest values of adhesive resistance.

  11. Shear Bond Strength of Orthodontic Brackets Fixed with Remineralizing Adhesive Systems after Simulating One Year of Orthodontic Treatment

    PubMed Central

    Bezerra, Gisele Lima; Torres, Carlos Rocha Gomes; Tonetto, Mateus Rodrigues; Borges, Alvaro Henrique; Kuga, Milton Carlos; Bandeca, Matheus Coelho; Firoozmand, Leily Macedo

    2015-01-01

    The objective of this study is to assess, in vitro, the shear bond strength of orthodontic brackets fixed with remineralizing adhesive systems submitted to thermomechanical cycling, simulating one year of orthodontic treatment. Sixty-four bovine incisor teeth were randomly divided into 4 experimental groups (n = 16): XT: Transbond XT, QC: Quick Cure, OL: Ortholite Color, and SEP: Transbond Plus Self-Etching Primer. The samples were submitted to thermomechanical cycling simulating one year of orthodontic treatment. Shear bond strength tests were carried out using a universal testing machine with a load cell of 50 KgF at 0.5 mm/minute. The samples were examined with a stereomicroscope and a scanning electron microscope (SEM) in order to analyze enamel surface and Adhesive Remnant Index (ARI). Kruskal-Wallis and Mann-Whitney (with Bonferroni correction) tests showed a significant difference between the studied groups (p < 0.05). Groups XT, QC, and SEP presented the highest values of adhesive resistance and no statistical differences were found between them. The highest frequency of failures between enamel and adhesive was observed in groups XT, QC, and OL. Quick Cure (QC) remineralizing adhesive system presented average adhesive resistance values similar to conventional (XT) and self-etching (SEP) adhesives, while remineralizing system (OL) provided the lowest values of adhesive resistance. PMID:26380371

  12. Influence of warm air-drying on enamel bond strength and surface free-energy of self-etch adhesives.

    PubMed

    Shiratsuchi, Koji; Tsujimoto, Akimasa; Takamizawa, Toshiki; Furuichi, Tetsuya; Tsubota, Keishi; Kurokawa, Hiroyasu; Miyazaki, Masashi

    2013-08-01

    We examined the effect of warm air-drying on the enamel bond strengths and the surface free-energy of three single-step self-etch adhesives. Bovine mandibular incisors were mounted in self-curing resin and then wet ground with #600 silicon carbide (SiC) paper. The adhesives were applied according to the instructions of the respective manufacturers and then dried in a stream of normal (23°C) or warm (37°C) air for 5, 10, and 20 s. After visible-light irradiation of the adhesives, resin composites were condensed into a mold and polymerized. Ten samples per test group were stored in distilled water at 37°C for 24 h and then the bond strengths were measured. The surface free-energies were determined by measuring the contact angles of three test liquids placed on the cured adhesives. The enamel bond strengths varied according to the air-drying time and ranged from 15.8 to 19.1 MPa. The trends for the bond strengths were different among the materials. The value of the γS⁺ component increased slightly when drying was performed with a stream of warm air, whereas that of the γS⁻ component decreased significantly. These data suggest that warm air-drying is essential to obtain adequate enamel bond strengths, although increasing the drying time did not significantly influence the bond strength.

  13. Effects of etching and adhesive applications on the bond strength between composite resin and glass-ionomer cements

    PubMed Central

    PAMIR, Tijen; ŞEN, Bilge Hakan; EVCIN, Özgür

    2012-01-01

    Objective This study determined the effects of various surface treatment modalities on the bond strength of composite resins to glass-ionomer cements. Material and Methods Conventional (KetacTM Molar Quick ApplicapTM) or resin-modified (PhotacTM Fil Quick AplicapTM) glass-ionomer cements were prepared. Two-step etch-rinse & bond adhesive (AdperTM Single Bond 2) or single-step self-etching adhesive (AdperTM PromptTM L-PopTM) was applied to the set cements. In the etch-rinse & bond group, the sample surfaces were pre-treated as follows: (1) no etching, (2) 15 s of etching with 35% phosphoric acid, (3) 30 s of etching, and (4) 60 s of etching. Following the placement of the composite resin (FiltekTM Z250), the bond strength was measured in a universal testing machine and the data obtained were analyzed with the two-way analysis of variance (ANOVA) followed by the Tukey's HSD post hoc analysis (p=0.05). Then, the fractured surfaces were examined by scanning electron microscopy. Results The bond strength of the composite resin to the conventional glass-ionomer cement was significantly lower than that to the resin-modified glass-ionomer cement (p<0.001). No significant differences were determined between the self-etching and etch-rinse & bond adhesives at any etching time (p>0.05). However, a greater bond strength was obtained with 30 s of phosphoric acid application. Conclusions The resin-modified glass-ionomer cement improved the bond strength of the composite resin to the glass-ionomer cement. Both etch-rinse & bond and self-etching adhesives may be used effectively in the lamination of glass-ionomer cements. However, an etching time of at least 30 s appears to be optimal. PMID:23329245

  14. Micro-tensile bond strength of self-etching primer adhesive systems to human coronal carious dentin.

    PubMed

    Doi, J; Itota, T; Torii, Y; Nakabo, S; Yoshiyama, M

    2004-10-01

    The aim of this study was to evaluate the micro-tensile bond strengths of three self-etching primer adhesive systems to normal dentin (ND), caries-affected dentin (CAD) and caries-infected dentin (CID). Human extracted molars with caries were used, and flat dentin surfaces ground by 600-grit SiC paper were prepared. The surfaces were dyed using Caries-Detector solution, treated with Clearfil SE Bond, Mac-Bond II and UniFil Bond, and then covered with resin composites according to manufacturer's instructions. After immersion in 37 degrees C water for 24 h, the teeth were serially sectioned into multiple slices. Each slice was distinguished into ND, CAD and CID groups by the degree of staining, and the bond strength was measured in a universal testing machine. Scanning electron microscopic (SEM) observation was also performed. For statistical analysis, anova and Scheffe's test were used (P < 0.05). The bond strengths of the three adhesive systems to CAD and CID were significantly lower than those to ND. There was significant difference in the bond strength to ND between Clearfil SE Bond and UniFil Bond, but no significant differences to CAD and CID among the three adhesive systems. On SEM, the hybrid layers in CAD and CID showed more porous structures compared with ND. The results indicated that the bond strengths to CAD and CID were not affected by a variety of self-etching primer adhesive systems because of the porous hybrid layer formation in carious dentin.

  15. Adhesions

    MedlinePlus

    Adhesions are bands of scar-like tissue. Normally, internal tissues and organs have slippery surfaces so they can shift easily as the body moves. Adhesions cause tissues and organs to stick together. They ...

  16. Adhesion

    MedlinePlus

    ... the intestines, adhesions can cause partial or complete bowel obstruction . Adhesions inside the uterine cavity, called Asherman syndrome , ... 1. Read More Appendicitis Asherman syndrome Glaucoma Infertility Intestinal obstruction Review Date 4/5/2016 Updated by: Irina ...

  17. Damage prognosis of adhesively-bonded joints in laminated composite structural components of unmanned aerial vehicles

    SciTech Connect

    Farrar, Charles R; Gobbato, Maurizio; Conte, Joel; Kosmatke, John; Oliver, Joseph A

    2009-01-01

    The extensive use of lightweight advanced composite materials in unmanned aerial vehicles (UAVs) drastically increases the sensitivity to both fatigue- and impact-induced damage of their critical structural components (e.g., wings and tail stabilizers) during service life. The spar-to-skin adhesive joints are considered one of the most fatigue sensitive subcomponents of a lightweight UAV composite wing with damage progressively evolving from the wing root. This paper presents a comprehensive probabilistic methodology for predicting the remaining service life of adhesively-bonded joints in laminated composite structural components of UAVs. Non-destructive evaluation techniques and Bayesian inference are used to (i) assess the current state of damage of the system and, (ii) update the probability distribution of the damage extent at various locations. A probabilistic model for future loads and a mechanics-based damage model are then used to stochastically propagate damage through the joint. Combined local (e.g., exceedance of a critical damage size) and global (e.g.. flutter instability) failure criteria are finally used to compute the probability of component failure at future times. The applicability and the partial validation of the proposed methodology are then briefly discussed by analyzing the debonding propagation, along a pre-defined adhesive interface, in a simply supported laminated composite beam with solid rectangular cross section, subjected to a concentrated load applied at mid-span. A specially developed Eliler-Bernoulli beam finite element with interlaminar slip along the damageable interface is used in combination with a cohesive zone model to study the fatigue-induced degradation in the adhesive material. The preliminary numerical results presented are promising for the future validation of the methodology.

  18. Degradation in the Fatigue Strength of Dentin by Cutting, Etching and Adhesive Bonding

    PubMed Central

    Lee, H.-H.; Majd, H.; Orrego, S.; Majd, B.; Romberg, E.; Mutluay, M.M.; Arola, D.

    2014-01-01

    The processes involved in placing resin composite restorations may degrade the fatigue strength of dentin and increase the likelihood of fractures in restored teeth. Objective The objective of this study was to evaluate the relative changes in strength and fatigue behavior of dentin caused by bur preparation, etching and resin bonding procedures using a 3-step system. Methods Specimens of dentin were prepared from the crowns of unrestored 3rd molars and subjected to either quasi-static or cyclic flexural loading to failure. Four treated groups were prepared including dentin beams subjected to a burr treatment only with a conventional straight-sided bur, or etching treatment only. An additional treated group received both bur and etching treatments, and the last was treated by bur treatment and etching, followed by application of a commercial resin adhesive. The control group consisted of “as sectioned” dentin specimens. Results Under quasi-static loading to failure there was no significant difference between the strength of the control group and treated groups. Dentin beams receiving only etching or bur cutting treatments exhibited fatigue strengths that were significantly lower (p≤0.0001) than the control; there was no significant difference in the fatigue resistance of these two groups. Similarly, the dentin receiving bur and etching treatments exhibited significantly lower (p≤0.0001) fatigue strength than that of the control, regardless of whether an adhesive was applied. Significance The individual steps involved in the placement of bonded resin composite restorations significantly decrease the fatigue strength of dentin, and application of a bonding agent does not increase the fatigue strength of dentin. PMID:24985539

  19. Active Metal Brazing and Adhesive Bonding of Titanium to C/C Composites for Heat Rejection System

    NASA Technical Reports Server (NTRS)

    Singh, M.; Shpargel, Tarah; Cerny, Jennifer

    2006-01-01

    Robust assembly and integration technologies are critically needed for the manufacturing of heat rejection system (HRS) components for current and future space exploration missions. Active metal brazing and adhesive bonding technologies are being assessed for the bonding of titanium to high conductivity Carbon-Carbon composite sub components in various shapes and sizes. Currently a number of different silver and copper based active metal brazes and adhesive compositions are being evaluated. The joint microstructures were examined using optical microscopy, and scanning electron microscopy (SEM) coupled with energy dispersive spectrometry (EDS). Several mechanical tests have been employed to ascertain the effectiveness of different brazing and adhesive approaches in tension and in shear that are both simple and representative of the actual system and relatively straightforward in analysis. The results of these mechanical tests along with the fractographic analysis will be discussed. In addition, advantages, technical issues and concerns in using different bonding approaches will also be presented.

  20. Environment-friendly adhesives for surface bonding of wood-based flooring using natural tannin to reduce formaldehyde and TVOC emission.

    PubMed

    Kim, Sumin

    2009-01-01

    The objective of this research was to develop environment-friendly adhesives for face fancy veneer bonding of engineered flooring using the natural tannin form bark in the wood. The natural wattle tannin adhesive were used to replace UF resin in the formaldehyde-based resin system in order to reduce formaldehyde and volatile organic compound (VOC) emissions from the adhesives used between plywoods and fancy veneers. PVAc was added to the natural tannin adhesive to increase viscosity of tannin adhesive for surface bonding. For tannin/PVAc hybrid adhesives, 5%, 10%, 20% and 30% of PVAc to the natural tannin adhesives were added. tannin/PVAc hybrid adhesives showed better bonding than the commercial natural tannin adhesive with a higher level of wood penetration. The initial adhesion strength was sufficient to be maintained within the optimum initial tack range. The standard formaldehyde emission test (desiccator method), field and laboratory emission cell (FLEC) and VOC analyzer were used to determine the formaldehyde and VOC emissions from engineered flooring bonded with commercial the natural tannin adhesive and tannin/PVAc hybrid adhesives. By desiccator method and FLEC, the formaldehyde emission level of each adhesive showed the similar tendency. All adhesives satisfied the E(1) grade (below 1.5 mg/L) and E(0) grade (below 0.5 mg/L) with UV coating. VOC emission results by FLEC and VOC analyzer were different with the formaldehyde emission results. TVOC emission was slightly increased as adding PVAc.

  1. Evaluation of dental adhesive systems with amalgam and resin composite restorations: comparison of microleakage and bond strength results.

    PubMed

    Neme, A L; Evans, D B; Maxson, B B

    2000-01-01

    A variety of laboratory tests have been developed to assist in predicting the clinical performance of dental restorative materials. Additionally, more than one methodology is in use for many types of tests performed in vitro. This project assessed and compared results derived from two specific laboratory testing methods, one for bond strength and one for microleakage. Seven multi-purpose dental adhesives were tested with the two methodologies in both amalgam and resin composite restorations. Bond strength was determined with a punch-out method in sections of human molar dentin. Microleakage was analyzed with a digital imaging system (Image-Pro Plus, Version 1.3) to determine the extent of dye penetration in Class V preparations centered at the CEJ on both the buccal and lingual surfaces of human molar teeth. There were 32 treatment groups (n = 10); seven experimental (dental adhesives) and one control (copal varnish, 37% phosphoric acid) followed by restoration with either amalgam or resin composite. Specimens were thermocycled 500 times in 5 degrees and 55 degrees C water with a one-minute dwell time. Bond strength and microleakage values were determined for each group. ANOVA and Student-Newman-Keuls tests demonstrated an interaction between restorative material and adhesive system with a significant difference among adhesives (p < 0.05). Using a multi-purpose adhesive system resulted in both a statistically significant increase in bond strength and a statistically significant decrease in extent of microleakage (p < 0.05). The effect of the adhesive upon both microleakage and bond strength was greater in the resin composite restorations than in the amalgam restorations. Bond strength testing was more discriminating than microleakage evaluation in identifying differences among materials.

  2. Shock adhesion test for composite bonded assembly using a high pulsed power generator

    NASA Astrophysics Data System (ADS)

    Gay, E.; Berthe, L.; Buzaud, E.; Boustie, M.; Arrigoni, M.

    2013-07-01

    In a context of the rising use of composite assemblies in aeronautic or defense fields, the assessment of their strength is a key issue. The method developed in this study attempts to provide solutions. A shock adhesion test based on short compressive loads, obtained by a high pulsed power generator, is proposed as a proof test to ensure the quality of composite bonded assemblies. A calibrated load induces a local tensile stress able to damage the bond interface. The high pulsed power source is the GEnerateur de Pression Isentropique device (Isentropic Pressure Generator), used to generate the required stresses, with a 450 ns pulse duration to test assemblies above the mm thickness range. The understanding of the mechanisms of wave propagation and tensile stress generation within these multilayer assemblies are scientific challenges. The ability of the technique to induce a tensile stress able to disbond the laminates and the assemblies is demonstrated. This paper details the response of carbon epoxy laminates and their bonded assemblies to a shock loading near the damage threshold.

  3. Effect of noble metal adhesive systems on bonding between an indirect composite material and a gold alloy.

    PubMed

    Nagano, Kiyoshi; Tanoue, Naomi; Atsuta, Mitsuru; Koizumi, Hiroyasu; Matsumura, Hideo

    2004-12-01

    In this study, the bond strength between an indirect composite and a gold alloy was determined for the purpose of evaluating noble metal bonding systems. A single liquid primer designed for conditioning noble metal alloys (Infis Opaque Primer) and tri-n-butylborane-initiated adhesive resins (Super-Bond C & B), with or without the powder component, were assessed. Cast gold alloy disks (Casting Gold type IV) were air-abraded with alumina, followed by six surface preparations, and were then bonded with a light-activated composite material (New Metacolor Infis). Shear testing was performed both before and after thermocycling for evaluation of bond durability. The results showed that three primed groups improved post-thermocycling bond strengths compared to each of the corresponding unprimed groups (P < 0.01). The bond strength was reduced for all six groups by the application of thermocycling (P < 0.01). After thermocycling, the group primed with the Infis Opaque Primer material and bonded with the Super-Bond C & B resin exhibited the greatest bond strength (23.4 MPa). The Infis Opaque Primer and Super-Bond bonding system increased the post-thermocycling bond strength of the control group by a factor of approximately ten. This simple technique is applicable in the fabrication of composite veneered restorations and cone-telescope dentures.

  4. Influence of an arginine-containing toothpaste on bond strength of different adhesive systems to eroded dentin.

    PubMed

    Bergamin, Ana Cláudia Pietrobom; Bridi, Enrico Coser; Amaral, Flávia Lucisano Botelho; Turssi, Cecília Pedroso; Basting, Roberta Tarkany; Aguiar, Flávio Henrique Baggio; França, Fabiana Mantovani Gomes

    2016-01-01

    The aim of this study was to evaluate the bond strength of different adhesive systems to eroded dentin following toothbrushing with an arginine-containing toothpaste. Sixty standardized 3 × 3 × 2-mm fragments of root dentin (n = 10) were prepared. After all surfaces except the buccal surfaces were impermeabilized, specimens were subjected to an erosive wear protocol and stored for 24 hours at 37°C. The specimens underwent 1000 toothbrushing cycles with an arginine-containing toothpaste, an arginine-free toothpaste (positive control group), or artificial saliva (negative control group). Following application of a self-etching or an etch-and-rinse adhesive to the buccal surfaces of the specimens, 6-mm-high composite resin blocks were built up in 2-mm increments. After 24 hours' storage in 100% relative humidity, microtensile test specimens with an approximate area of 1 mm² were prepared. The test was performed at a speed of 0.5 mm/min until specimen fracture, and the failure patterns were evaluated using a stereoscopic loupe. Two-way analysis of variance revealed no significant difference between the toothpastes, the adhesive systems, or the interactions between toothpaste and adhesive system in terms of the bond strength to eroded dentin (P > 0.05). The predominant failure pattern was adhesive in all groups. It was concluded that a toothpaste containing arginine did not interfere with the bond between either the self-etching or the etch-and-rinse adhesive system and eroded dentin.

  5. Shear Bond Strength of Calcium Enriched Mixture Cement and Mineral Trioxide Aggregate to Composite Resin with Two Different Adhesive Systems

    PubMed Central

    Savadi Oskoee, Siavash; Bahari, Mahmoud; Kimyai, Soodabeh; Motahhari, Paria; Eghbal, Mohammad Jafar; Asgary, Saeed

    2014-01-01

    Objective: Immediate restoration after vital pulp therapy is essential in order to create and maintain effective coronal seal. Purpose of Study: The aim of this study was to evaluate the shear bond strength of recently used pulp capping materials: white mineral trioxide aggregate (MTA), and calcium enriched mixture cement (CEM) to composite resin with the use of etch-and-rinse and self-etch adhesive systems and compare them with the bond strength of commonly used resin modified glass ionomer (RMGI) cement. Materials and Methods: Forty specimens from each test material were fabricated, measuring 4 mm in diameter and 2 mm in depth. The specimens of each material were divided into 2 groups of 20 specimens according to the adhesive system (Single Bond vs. Clearfil SE Bond) used for bonding of resin composite. The shear bond strength values were measured at a crosshead speed of 1.0 mm/min and fractured surfaces were examined. Data were analyzed using two-way ANOVA and a post hoc Tukey’s test (P<0.05). Results: Analysis of data showed a significantly higher bond strength for RMGI compared to MTA and CEM (P<0.001); however, no significant differences were observed in the bond strength values of MTA and CEM (P=0.9). Furthermore, there were no significant differences in relation to the type of the adhesive system irrespective of the type of the material used (P=0.95) All the failures were of cohesive type in RMGI, MTA and CEM. Conclusion: Bond strength of RMGI cement to composite resin was higher than that of MTA or CEM cement irrespective of the type of the adhesive system. PMID:25628696

  6. Long-term bonding effectiveness of simplified etch-and-rinse adhesives to dentin after different surface pre-treatments

    PubMed Central

    Verma, Radhika; Singh, Udai Pratap; Tyagi, Shashi Prabha; Nagpal, Rajni; Manuja, Naveen

    2013-01-01

    Objective: To evaluate the effect of 2% chlorhexidine (CHX) and 30% proanthocyanidin (PA) application on the immediate and long-term bond strength of simplified etch-and-rinse adhesives to dentin. Materials and Methods: One hundred twenty extracted human molar teeth were ground to expose the flat dentin surface. The teeth were equally divided into six groups according to the adhesives used, either Tetric N Bond or Solobond M and pretreatments given either none, CHX, or PA. Composite cylinder was bonded to each specimen using the respective adhesive technique. Half the samples from each group (n = 10) were then tested immediately. The remaining samples were tested after 6 month storage in distilled water. Results: The mean bond strength of samples was not significantly different upon immediate testing being in the range of 8.4(±0.7) MPa. The bond strength fell dramatically in the control specimens after 6 month storage to around 4.7(±0.33) MPa, while the bond strength was maintained in the samples treated with both CHX and PA. Conclusion: Thirty percent PA was comparable to 2% CHX with respect to preservation of the resin dentin bond over 6 months. PMID:23956543

  7. Micro-tensile bond strength of different adhesive systems on sound dentin and resin-based composite: An in-vitro study

    PubMed Central

    Mallick, Rashmirekha; Sarangi, Priyanka; Mohanty, Sandhyarani; Behera, Subasish; Nanda, Soumyaranjan; Satapathy, Sukanta Kumar

    2015-01-01

    Aim: To analyze the difference in the micro-tensile bond strength of specimens made with two different adhesive systems and compare them with two homogenous substrates. Materials and Methods: Sixty permanent mandibular molars were mounted in acrylic blocks and sectioned with exposed dentin surfaces. Samples were then divided into four groups. To Group-I Adper Single Bond 2 and to Group-II Adper Self-Etch plus bonding agents were applied. For Group-I and Group-II beams consisted of resin composite in the upper half and dentin in the lower half. In Group-III beams were made of only dentin. In Group-IV beams were made of only composite. Fifteen specimens of each group were taken for the micro-tensile bond strength test. Statistical Analysis: The results are analyzed using one-way analysis of variance and Critical Difference test. Results: The interface bonded with the two adhesive systems had lower micro-tensile bond strength than those of dentin and resin composite and the self-etching adhesive Adper Self-Etch plus had comparable bond strength with total-etch adhesive Adper Single Bond 2. Conclusion: The bond strength values for current adhesive systems cannot be compared to the micro-tensile bond strength of dentin and resin composite, and self-etching adhesives have comparable bond strength with total-etch adhesives. PMID:26430301

  8. The role of MDP in a bonding resin of a two-step self-etching adhesive system.

    PubMed

    Matsui, Naoko; Takagaki, Tomohiro; Sadr, Alireza; Ikeda, Masaomi; Ichinose, Shizuko; Nikaido, Toru; Tagami, Junji

    2015-01-01

    The purpose of this study was to evaluate the role of 10-methacryloyloxydecyl dihydrogen phosphate (MDP) contained in the bonding resin of a two-step self-etch adhesive system. An experimental adhesive (M0) containing MDP only in the primer, but not in the bonding resin was prepared. Clearfil SE Bond (MM) and M0 were compared in terms of microtensile bond strength to dentin, ultimate tensile strength of the bonding resin, and dentin-resin bonding interface morphology under SEM and TEM. The immediate µTBS values of MM significantly decreased after thermal cycles while M0 were stable even after 10,000 cycles. In the SEM observations, formation of erosion was observed beneath the acid-base resistant zone only in M0. The results suggested that MDP in the bonding resin of the two-step self-etching system; 1) improved the immediate bond strength, but caused reduction in long-term bond durability; 2) offered the advantages of acid-base resistance at the ABRZ forefront area.

  9. Effect of self-etching primer/adhesive and conventional bonding on the shear bond strength in metallic and ceramic brackets

    PubMed Central

    Kimyai, Soodabeh; Hydari, Mahboubeh; Shahrbaf, Shirin; Mirzakouchaki-Boroujeni, Parvin

    2012-01-01

    Introduction: Bracket debonding from the tooth surface is a common problem in fixed orthodontics. The aims of the present study were to assess the bond strength and failure sites in two ways of bonding technique, with metallic and ceramic brackets. Material and Methods: One hundred premolars were assigned to 4 groups of 25 each: Group A, metallic brackets/ conventional procedure; Group B, metallic brackets/Transbond XT; Group C, ceramic brackets/conventional procedure; and Group D, ceramic brackets/Transbond XT. Transbond XT composite paste was used for bracket bonding and cured by conventional light-cure device. Specimens were subjected to thermocycling. One week after bonding shearing force was applied to the bracket-tooth interface. Bonding failure site optically examined using a stereomicroscope under 10 × magnifications and scoring was done using the adhesive remnant index (ARI). Data were subjected to analysis of One-way variance, Tukey post hoc, Chi-square and Spearman’s tests. Results: Mean bond strength (in MPa) were: group A=9.2, group B=8.5, group C=6.2 and group D=5.7. Bond strength differences between groups A and B, and between C and D were not significant, (p<0.0005). Insignificant difference found in ARI in all groups. Conclusion: The bond strengths of metallic brackets were significantly higher than ceramic ones and the selfetching primer produce fewer bonds than the conventional method (clinically acceptable). A positive correlation found between changes in shearing bond strength and ARI. Key words: Acid etching, adhesive remnant index, orthodontic brackets, self-etching primer, shearing bond strength. PMID:21743430

  10. Evaluation of self-etching adhesive and Er:YAG laser conditioning on the shear bond strength of orthodontic brackets.

    PubMed

    Contreras-Bulnes, Rosalía; Scougall-Vilchis, Rogelio J; Rodríguez-Vilchis, Laura E; Centeno-Pedraza, Claudia; Olea-Mejía, Oscar F; Alcántara-Galena, María del Carmen Z

    2013-01-01

    The purpose of this study was to evaluate the shear bond strength, the adhesive remnant index scores, and etch surface of teeth prepared for orthodontic bracket bonding with self-etching primer and Er:YAG laser conditioning. One hundred and twenty bovine incisors were randomly divided into four groups. In Group I (Control), the teeth were conditioned with 35% phosphoric acid for 15 seconds. In Group II the teeth were conditioned with Transbond Plus SEP (5 sec); III and IV were irradiated with the Er:YAG 150 mJ (11.0 J/cm²), 150 mJ (19.1 J/cm²), respectively, at 7-12 Hz with water spray. After surface preparation, upper central incisor stainless steel brackets were bonded with Transbond Plus Color Change Adhesive. The teeth were stored in water at 37°C for 24 hours and shear bond strengths were measured, and adhesive remnant index (ARI) was determined. The conditioned surface was observed under a scanning electron microscope. One-way ANOVA and chi-square test were used. Group I showed the significantly highest values of bond strength with a mean value of 8.2 megapascals (MPa). The lesser amount of adhesive remnant was found in Group III. The results of this study suggest that Er:YAG laser irradiation could not be an option for enamel conditioning.

  11. The Influence of No-Primer Adhesives and Anchor Pylons Bracket Bases on Shear Bond Strength of Orthodontic Brackets

    PubMed Central

    Sfondrini, Maria Francesca; Fraticelli, Danilo; Daina, Paola; Tamagnone, Alessandra; Gandini, Paola

    2013-01-01

    Objective. The aim of this study was to compare the shear bond strength (SBS) and adhesive remnant index (ARI) scores of no-primer adhesives tested with two different bracket bases. Materials and Methods. 120 bovine permanent mandibular incisors were divided into 6 groups of 20 specimens. Two brackets (ODP) with different bracket bases (anchor pylons and 80-gauge mesh) were bonded to the teeth using a conventional adhesive (Transbond XT) and two different no-primer adhesive (Ortho Cem; Heliosit) systems. Groups were tested using an instron universal testing machine. SBS values were recorded. ARI scores were measured. SEM microphotographs were taken to evaluate the pattern of bracket bases. Statistical analysis was performed. ANOVA and Tukey tests were carried out for SBS values, whereas a chi-squared test was applied for ARI scores. Results. Highest bond strength values were reported with Transbond XT (with both pad designs), Ortho Cem bonded on anchor pylons and Heliosit on 80-gauge mesh. A higher frequency of ARI score of “3” was reported for Transbond XT groups. Other groups showed a higher frequency of ARI score “2” and “1.” Conclusion. Transbond XT showed the highest shear bond strength values with both pad designs. PMID:23984339

  12. Evaluation of Self-Etching Adhesive and Er:YAG Laser Conditioning on the Shear Bond Strength of Orthodontic Brackets

    PubMed Central

    Contreras-Bulnes, Rosalía; Scougall-Vilchis, Rogelio J.; Rodríguez-Vilchis, Laura E.; Centeno-Pedraza, Claudia; Olea-Mejía, Oscar F.; Alcántara-Galena, María del Carmen Z.

    2013-01-01

    The purpose of this study was to evaluate the shear bond strength, the adhesive remnant index scores, and etch surface of teeth prepared for orthodontic bracket bonding with self-etching primer and Er:YAG laser conditioning. One hundred and twenty bovine incisors were randomly divided into four groups. In Group I (Control), the teeth were conditioned with 35% phosphoric acid for 15 seconds. In Group II the teeth were conditioned with Transbond Plus SEP (5 sec); III and IV were irradiated with the Er:YAG 150 mJ (11.0 J/cm2), 150 mJ (19.1 J/cm2), respectively, at 7–12 Hz with water spray. After surface preparation, upper central incisor stainless steel brackets were bonded with Transbond Plus Color Change Adhesive. The teeth were stored in water at 37°C for 24 hours and shear bond strengths were measured, and adhesive remnant index (ARI) was determined. The conditioned surface was observed under a scanning electron microscope. One-way ANOVA and chi-square test were used. Group I showed the significantly highest values of bond strength with a mean value of 8.2 megapascals (MPa). The lesser amount of adhesive remnant was found in Group III. The results of this study suggest that Er:YAG laser irradiation could not be an option for enamel conditioning. PMID:24228014

  13. Influence of different repair procedures on bond strength of adhesive filling materials to etched enamel in vitro.

    PubMed

    Hannig, Christian; Hahn, Petra; Thiele, Patrick-Philipp; Attin, Thomas

    2003-01-01

    Contamination of etched enamel with repair bond agents during repair of dental restorations may interfere with the bonding of composite to enamel. This study examined the bond strength of adhesive filling materials to etched bovine enamel after pre-treatment with the repair systems Monobond S, Silibond and Co-Jet. The materials Tetric Ceram, Dyract and Definite and their corresponding bonding agents (Syntac Single Comp, Prime & Bond NT, Etch and Prime) were tested in combination with the repair systems. One hundred and thirty-five enamel specimens were etched (37% phosphoric acid, 60 seconds) and equally distributed among three groups (A-C). In Group A, the repair materials were applied on etched enamel followed by applying the composite materials without using their respective bonding material. In Group B, the composite materials were placed on etched enamel after applying the repair materials and bonding agents. In control Group C, the composite materials and bonding agents were applied on etched enamel without using the repair systems. In each sub-group, every composite material was applied on 15 specimens. Samples were stored in artificial saliva for 14 days and thermocycled 1,000 times (5 degrees C/55 degrees C). The shear bond strength of the samples were then determined in a universal testing machine (ISO 10477). Applying Monobond or Silibond followed by the use of its respective bonding agents resulted in a bond strength that was not statistically different from the controls for all filling materials (Group C). The three composites that used Monobond and Silibond without applying the corresponding bonding agent resulted in bond strengths that were significantly lower than the controls. Utilizing the Co-Jet-System drastically reduced the bond strength of composites on etched enamel. Contamination of etched enamel with the repairing bonding agents Monobond and Silibond does not interfere with bond strength if the application of Monobond and Silibond is

  14. Analysis of interface cracks in adhesively bonded lap shear joints, part 4

    NASA Technical Reports Server (NTRS)

    Wang, S. S.; Yau, J. F.

    1981-01-01

    Conservation laws of elasticity for nonhomogeneous materials were developed and were used to study the crack behavior in adhesively bonded lap shear joints. By using these laws and the fundamental relationships in fracture mechanics of interface cracks, the problem is reduced to a pair of linear algebraic equations, and stress intensity solutions can be determined directly by information extracted from the far field. The numerical results obtained show that: (1) in the lap-shear joint with a given adherend, the opening-mode stress intensity factor, (K sub 1) is always larger than that of the shearing-mode (K sub 2); (2) (K sub 1) is not sensitive to adherent thickness abut (K sub 2) increases rapidly with increasing thickness; and (3) (K sub 1) and (K sub 2) increase simultaneously as the interfacial crack length increases.

  15. Effect of different adhesive strategies on microtensile bond strength of computer aided design/computer aided manufacturing blocks bonded to dentin

    PubMed Central

    Roperto, Renato; Akkus, Anna; Akkus, Ozan; Lang, Lisa; Sousa-Neto, Manoel Damiao; Teich, Sorin; Porto, Thiago Soares

    2016-01-01

    Background: The aim of this study was to determine the microtensile bond strength (μTBS) of ceramic and composite computer aided design-computer aided manufacturing (CAD-CAM) blocks bonded to dentin using different adhesive strategies. Materials and Methods: In this in vitro study, 30 crowns of sound freshly extracted human molars were sectioned horizontally 3 mm above the cementoenamel junction to produce flat dentin surfaces. Ceramic and composite CAD/CAM blocks, size 14, were sectioned into slices of 3 mm thick. Before bonding, CAD/CAM block surfaces were treated according to the manufacturer's instructions. Groups were created based on the adhesive strategy used: Group 1 (GI) - conventional resin cement + total-etch adhesive system, Group 2 (GII) - conventional resin cement + self-etch adhesive system, and Group 3 (GIII) - self-adhesive resin cement with no adhesive. Bonded specimens were stored in 100% humidity for 24h at 37΀C, and then sectioned with a slow-speed diamond saw to obtain 1 mm × 1 mm × 6 mm microsticks. Microtensile testing was then conducted using a microtensile tester. μTBS values were expressed in MPa and analyzed by one-way ANOVA with post hoc (Tukey) test at the 5% significance level. Results: Mean values and standard deviations of μTBS (MPa) were 17.68 (±2.71) for GI/ceramic; 17.62 (±3.99) for GI/composite; 13.61 (±6.92) for GII/composite; 12.22 (±4.24) for GII/ceramic; 7.47 (±2.29) for GIII/composite; and 6.48 (±3.10) for GIII/ceramic; ANOVA indicated significant differences among the adhesive modality and block interaction (P < 0.05), and no significant differences among blocks only, except between GI and GII/ceramic. Bond strength of GIII was consistently lower (P < 0.05) than GI and GII groups, regardless the block used. Conclusion: Cementation of CAD/CAM restorations, either composite or ceramic, can be significantly affected by different adhesive strategies used. PMID:27076825

  16. Effect of Bioactive Glass air Abrasion on Shear Bond Strength of Two Adhesive Resins to Decalcified Enamel

    PubMed Central

    Eshghi, Alireza; Khoroushi, Maryam; Rezvani, Alireza

    2014-01-01

    Objective: Bioactive glass air abrasion is a conservative technique to remove initial decalcified tissue and caries. This study examined the shear bond strength of composite resin to sound and decalcified enamel air-abraded by bioactive glass (BAG) or alumina using etch-and-rinse and self-etch adhesives. Materials and Methods: Forty-eight permanent molars were root-amputated and sectioned mesiodistally. The obtained 96 specimens were mounted in acrylic resin; the buccal and lingual surfaces remained exposed. A demineralizing solution was used to decalcify half the specimens. Both sound and decalcified specimens were divided into two groups of alumina and bioactive glass air abrasion. In each group, the specimens were subdivided into two subgroups of Clearfil SE Bond or OptiBond FL adhesives (n=12). Composite resin cylinders were bonded on enamel surfaces cured and underwent thermocycling. The specimens were tested for shear bond strength. Data were analyzed using SPSS 16.0 and three-way ANOVA (α=0.05). Similar to the experimental groups, the enamel surface of one specimen underwent SEM evaluation. Results: No significant differences were observed in composite resin bond strength subsequent to alumina or bioactive glass air abrasion preparation techniques (P=0.987). There were no statistically significant differences between the bond strength of etch-and-rinse and self-etch adhesive groups (P=1). Also, decalcified or intact enamel groups had no significant difference (P=0.918). However, SEM analysis showed much less enamel irregularities with BAG air abrasion compared to alumina air abrasion. Conclusion: Under the limitations of this study, preparation of both intact and decalcified enamel surfaces with bioactive glass air abrasion results in similar bond strength of composite resin in comparison with alumina air abrasion using etch-&-rinse or self-etch adhesives. PMID:25628694

  17. Exposed Dentin: Influence of Cleaning Procedures and Simulated Pulpal Pressure on Bond Strength of a Universal Adhesive System

    PubMed Central

    2017-01-01

    Purpose To compare various pre-treatments serving as cleaning procedures of dentin on the bond strength of resin composite promoted by a universal adhesive system applied either in the absence or presence of simulated pulpal pressure. Materials and Methods Prior to application of the adhesive system (Scotchbond Universal) and resin composite (Filtek Z250), ground dentin surfaces were given one of five pre-treatments either without or with simulated pulpal pressure: 1) no pre-treatment, adhesive system in “self-etch” mode, 2) phosphoric acid etching, adhesive system in “total-etch” mode, 3) polishing with pumice on prophylaxis cup, 4) air abrasion with AIR-FLOW PLUS powder, 5) air abrasion with AIR-FLOW PERIO powder; n = 20/group of pre-treatment. After storage (37°C, 100% humidity, 24 h), micro shear bond strength was measured and data analyzed with parametric ANOVA including Bonferroni-Holm correction for multiple testing followed by Student’s t tests (significance level: α = 0.05). Results The ANOVA found type of pre-treatment and simulated pulpal pressure to have no significant effect on dentin bond strength. The explorative post-hoc tests showed a negative effect of simulated pulpal pressure for phosphoric acid etching (adhesive system in “total-etch” mode; p = 0.020), but not for the other four pre-treatments (all p = 1.000). Conclusion Air abrasion with powders containing either erythritol and chlorhexidine (AIR-FLOW PLUS) or glycine (AIR-FLOW PERIO) yielded dentin bond strengths similar to no pre-treatment, phosphoric acid etching, or polishing with pumice. Simulated pulpal pressure reduced the bond strength only when the self-etch adhesive system was used in total-etch mode. PMID:28081572

  18. Microtensile bond strength of one- and two-step self-etching adhesives on sclerotic dentin: the effects of thermocycling.

    PubMed

    Xie, Chao; Han, Ying; Zhao, Xin-Yi; Wang, Zhong-Yi; He, Hui-Ming

    2010-01-01

    This study evaluated the effects of thermocycling on the microtensile bond strength (microTBS) of one- and two-step self-etch adhesives (SEAs) to sclerotic dentin. Two adhesives, Clearfil S3 Bond (S3), a one-step self-etch adhesive (1-SEA), and Clearfil SE Bond (SE), a two-step self-etch adhesive (2-SEA), were applied on cervical lesions in human premolars with sclerotic or normal dentin. After adhesive application, the lesions were restored and built up using a resin composite (Clearfil AP-X). After 24 hours in water storage, the restored teeth were sectioned into 0.7 x 0.7 mm composite-dentin beams. The beams were then aged with 0, 5,000 or 10,000 thermocycles. The use of two adhesives, two substrate types and three thermocycling regimens yielded 12 experimental groups of 14-19 beams each. The beams were subsequently subjected to microTBS testing at a crosshead speed of 1 mm/minute and statistical analyses were computed with three-way ANOVA and Tukey's post hoc test at p < 0.05. Three-way ANOVA showed statistically significant effects on bonding effectiveness by lesion type, adhesive system, thermocycling or combinations of the adhesive system and thermocycling (p < 0.05). With sclerotic dentin, although S3 and SE provided comparable microTBS after 24 hours of water storage, S3 showed significantly lower microTBS than SE after thermocycling (p < 0.05). Regardless of lesion type, the microTBS for S3 decreased significantly after 5,000 or 10,000 thermocycles, while the microTBS for SE showed a significant decrease only after 10,000 thermocycles. Regardless of the extent of thermocycling, the microTBS values for either SE or S3 bonded to sclerotic dentin were significantly lower than to normal dentin (p < 0.05). The results suggested that thermocycling had a significant negative effect on the bond strength of the two SEAs tested. In contrast to 2-SEA, 1-SEA might not be a good choice for sclerotic dentin when seeking durability of the resin-dentin bond.

  19. Adhesive-Bonded Composite Joint Analysis with Delaminated Surface Ply Using Strain-Energy Release Rate

    NASA Technical Reports Server (NTRS)

    Chadegani, Alireza; Yang, Chihdar; Smeltzer, Stanley S. III

    2012-01-01

    This paper presents an analytical model to determine the strain energy release rate due to an interlaminar crack of the surface ply in adhesively bonded composite joints subjected to axial tension. Single-lap shear-joint standard test specimen geometry with thick bondline is followed for model development. The field equations are formulated by using the first-order shear-deformation theory in laminated plates together with kinematics relations and force equilibrium conditions. The stress distributions for the adherends and adhesive are determined after the appropriate boundary and loading conditions are applied and the equations for the field displacements are solved. The system of second-order differential equations is solved to using the symbolic computation tool Maple 9.52 to provide displacements fields. The equivalent forces at the tip of the prescribed interlaminar crack are obtained based on interlaminar stress distributions. The strain energy release rate of the crack is then determined by using the crack closure method. Finite element analyses using the J integral as well as the crack closure method are performed to verify the developed analytical model. It has been shown that the results using the analytical method correlate well with the results from the finite element analyses. An attempt is made to predict the failure loads of the joints based on limited test data from the literature. The effectiveness of the inclusion of bondline thickness is justified when compared with the results obtained from the previous model in which a thin bondline and uniform adhesive stresses through the bondline thickness are assumed.

  20. Effects of Er:YAG laser on bond strength of self-etching adhesives to caries-affected dentin.

    PubMed

    Koyuturk, Alp Erdin; Ozmen, Bilal; Cortcu, Murat; Tokay, Ugur; Tosun, Gul; Erhan Sari, Mustafa

    2014-04-01

    The erbium:yttrium-aluminum-garnet (Er:YAG) laser may be effective the bond strength of adhesive systems on dentine surfaces, the chemical composition and aggressiveness of adhesive systems in clinical practice. The purpose of this study was to evaluate the effects of the Er:YAG laser system with the bonding ability of two different self-etching adhesives to caries-affected dentine in primary molars. Ninety mid-coronal flat dentine surfaces obtained from sound and caries-affected human primary dentine were treated with an Er:YAG laser or a bur. The prepared surfaces were restored with an adhesive system (Xeno V; Clearfil S³) and a compomer (Dyract Extra). The restored teeth were sectioned with a low-speed saw and 162 samples were obtained. The bond strength of the adhesive systems was tested using the micro-tensile test method. The data were statistically analyzed. A restored tooth in each group was processed for scanning electron microscopy evaluation. The values of the highest bond strength were obtained from the Clearfil S³-Er:YAG laser-sound dentine group in all groups. (24.57 ± 7.27 MPa) (P > 0.05). The values of the lowest bond strength were obtained from the Xeno V-Er:YAG laser-sound dentine group in all groups (11.01 ± 3.89 MPa). It was determined that the Clearfil S³ increased the bond strength on the surface applied with Er:YAG laser according to the Xeno V.

  1. Influence of salivary contamination on the dentin bond strength of two different seventh generation adhesive systems: In vitro study

    PubMed Central

    Bhatia, Taranjeet Kaur; Asrani, Hemant; Banga, Harpreet; Jain, Aditi; Rawlani, Sudhir S.

    2015-01-01

    Aim: To investigate the effect of salivary contamination on the bond strength of two different seventh generation adhesive systems. Materials and Methods: Sixty caries-free human premolars with flat dentin surfaces were randomly divided into six groups of 10 teeth each and bonding was done using seventh-generation bonding agents Adper Easy One (3M ESPE) and Xeno V (Dentsply). Following the bonding procedure, resin composite was bonded to the surfaces using a plastic mould. The prepared specimen with composite cylinders attached were placed in 37°C distilled water for 24 h and then subjected to shear bond strength (SBS) with 0 h universal testing machine and the data were subjected to one-way analysis of variance and unpaired t-test. Results: Statistical significant difference between the Groups I, II and III in which Adper Easy One was used and similarly for Groups IV, V, and VI in which Xeno V was used. When an intergroup comparison was made using unpaired t-test Group II and Group V showed the nonsignificant difference. Conclusion: Salivary contamination significantly affects the SBS of both the seventh generation dentin bonding agents. However, 2-hydroxyethyl methacryate based adhesive has higher bond strength. PMID:26752841

  2. In vitro analysis of bond strength of self-etching adhesives applied on superficial and deep dentin.

    PubMed

    Garcia, Eugenio J; Gomes, Osnara M M; Gomes, João C

    2009-01-01

    The purpose of this study was to evaluate the bond strength of three adhesive systems to superficial and deep dentine using the microtensile bond strength test (microTBS). The occlusal enamel of thirty human third molars was removed to expose a flat surface of superficial or deep dentin. For each type of surface, the test specimens were randomly divided into three groups which underwent the application of a conventional two-step adhesive system [Single Bond (SB)] as the control group (n=10), a two-bottle self-etching system [One Coat SE Bond (OCSE)] (n=10) and a one bottle one-step system [Clearfil S3 Bond (CFS3)] (n=10). Adhesives were applied, a 5-mm high "crown" as built-up with resin composite Z250 (3M) and the specimens with a cross-sectional area of 0.7 +/- 0.1 mm2 were tested in tension (0.5 mm/min). Four fractured sticks from each tooth were randomly selected and the dentin side was gently abraded with a 1200-grit SiC paper etched with 35% phosphoric acid for 15 s and air dried. SEM micrographs at 70X and 2400X magnification were taken using scanning electron microscopy (SEM) to calculate the area of tubular dentin (ATD) and tubular density (TD) with Image Pro Plus 5. Two-way ANOVA (dentin depth-adhesive) showed higher bond strength values for SB. However the values did not depend on dentin depth. Linear regression showed a significant relationship between bond strength and area of intertubular dentin for SB (p = 0.004), and a significant inverse relationship between tubular density and bond strength for CFS3 (p = 0.009). OCSE exhibited a tendency that was similar to SB and opposite to CFS3, but was not statistically significant. The conventional two-step adhesive had higher bond strength values. The use of digital image analysis facilitates the manipulation of data and contributes to the interpretation of the behavior of new adhesive systems.

  3. Chemical adhesion rather than mechanical retention enhances resin bond durability of a dental glass-ceramic with leucite crystallites.

    PubMed

    Meng, X F; Yoshida, K; Gu, N

    2010-08-01

    This study aims to evaluate the effect of chemical adhesion by a silane coupler and mechanical retention by hydrofluoric acid (HFA) etching on the bond durability of resin to a dental glass ceramic with leucite crystallites. Half of the ceramic plates were etched with 4.8% HFA (HFA group) for 60 s, and the other half were not treated (NoHFA group). The scale of their surface roughness and rough area was measured by a 3D laser scanning microscope. These plates then received one of the following two bond procedures to form four bond test groups: HFA/cement, NoHFA/cement, HFA/silane/cement and NoHFA/silane/cement. The associated micro-shear bond strength and bond failure modes were tested after 0 and 30 000 thermal water bath cycles. Four different silane/cement systems (Monobond S/Variolink II, GC Ceramic Primer/Linkmax HV, Clearfil Ceramic Primer/Clearfil Esthetic Cement and Porcelain Liner M/SuperBond C&B) were used. The data for each silane/cement system were analyzed by three-way ANOVA. HFA treatment significantly increased the surface R(a) and R(y) values and the rough area of the ceramic plates compared with NoHFA treatment. After 30 000 thermal water bath cycles, the bond strength of all the test groups except the HFA/Linkmax HV group was significantly reduced, while the HFA/Linkmax HV group showed only adhesive interface failure. The other HFA/cement groups and all NoHFA/cement groups lost bond strength completely, and all NoHFA/silane/cement groups with chemical adhesion had significantly higher bond strength and more ceramic cohesive failures than the respective HFA/cement groups with mechanical retention. The result of the HFA/silane/cement groups with both chemical adhesion and mechanical retention revealed that HFA treatment could enhance the bond durability of resin/silanized glass ceramics, which might result from the increase of the chemical adhesion area on the ceramic rough surface and subsequently reduced degradation speed of the silane coupler

  4. Durability of Ti-6Al-4V/LaRC-PETI-5 adhesive bonded system for HSCT applications

    SciTech Connect

    Parvatareddy, H.; Pasricha, A.; Dillard, D.A.; Dillard, J.G.

    1996-12-31

    Structural adhesive joints are being widely used and studied as alternatives to conventional fasteners in the aerospace, automotive, and other industries. Adhesive bonding offers advantages such as lower weight and lower manufacturing costs. Furthermore, high performance adhesives which are currently being synthesized (e.g. epoxies, phenolics, acrylics, thermoplastic polyimides) offer other useful properties such as higher modulus, higher toughness, and stability at high temperatures. In the present study, the durability of the Ti-6Al-4V/LaRC PETI-5 adhesive bonded system is being evaluated utilizing double cantilever beam (DCB) fracture specimens. These DCB tests have been used extensively to study adhesive joints. The current study is part of a comprehensive study to develop a durable material system for application in the proposed mach 2.4 high speed civil transport (HSCT) aircraft. According to the design criteria, the material system to be used on the aircraft should be durable for over 60,000 hours of flight encountering temperatures during flight in the range of 177{degrees}C. Physical aging and chemical aging of the adhesive material are some of the important issues which have to be evaluated and taken into consideration for predicting the bond durability. In order to simulate the service environment conditions of the HSCT, the Ti-6Al-4V/LaRC PETI-5 bonds were aged in one of three temperatures; 150, 177, and 204{degrees}C, at one of three different environments; atmospheric air, and reduced air pressures of 2 psi air (13.8 KPa) and 0.2 psi air (1.38 KPa).

  5. Effect of postoperative peroxide bleaching on the marginal seal of composite restorations bonded with self-etch adhesives.

    PubMed

    Roubickova, A; Dudek, M; Comba, L; Housova, D; Bradna, P

    2013-01-01

    The aim of this study was to determine the effect of peroxide bleaching on the marginal seal of composite restorations bonded with several adhesive systems. Combined cylindrical Class V cavities located half in enamel and half in dentin were prepared on the buccal and lingual surfaces of human molars. The cavities were bonded with the self-etch adhesives Clearfil SE-Bond (CLF), Adper Prompt (ADP), and iBond (IBO) and an etch-and-rinse adhesive Gluma Comfort Bond (GLU) and restored with a microhybrid composite Charisma. Experimental groups were treated 25 times for eight hours per day with a peroxide bleaching gel Opalescence PF 20, while the control groups were stored in distilled water for two months and then subjected to a microleakage test using a dye penetration method. Scanning electron microscopy was used to investigate the etching and penetration abilities of the adhesives and morphology of debonded restoration-enamel interfaces after the microleakage tests. Statistical analyses were performed using nonparametric Kruskal-Wallis, Mann-Whitney, and Wilcoxon tests at p=0.05. The microleakage of all GLU groups was low and not significantly affected by pero