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Sample records for advanced lithography applications

  1. Spectroscopic Ellipsometry Applications in Advanced Lithography Research

    NASA Astrophysics Data System (ADS)

    Synowicki, R. A.; Pribil, Greg K.; Hilfiker, James N.; Edwards, Kevin

    2005-09-01

    Spectroscopic ellipsometry (SE) is an optical metrology technique widely used in the semiconductor industry. For lithography applications SE is routinely used for measurement of film thickness and refractive index of polymer photoresist and antireflective coatings. While this remains a primary use of SE, applications are now expanding into other areas of advanced lithography research. New applications include immersion lithography, phase-shift photomasks, transparent pellicles, 193 and 157 nm lithography, stepper optical coatings, imprint lithography, and even real-time monitoring of etch development rate in liquid ambients. Of recent interest are studies of immersion fluids where knowledge of the fluid refractive index and absorption are critical to their use in immersion lithography. Phase-shift photomasks are also of interest as the thickness and index of the phase-shift and absorber layers must be critically controlled for accurate intensity and phase transmission. Thin transparent pellicles to protect these masks must be also characterized for thickness and refractive index. Infrared ellipsometry is sensitive to chemical composition, film thickness, and how film chemistry changes with processing. Real-time monitoring of polymer film thickness during etching in a liquid developer allows etch rate and endpoint determination with monolayer sensitivity. This work considers these emerging applications to survey the current status of spectroscopic ellipsometry as a characterization technique in advanced lithography applications.

  2. Swords to plowshares: Shock wave applications to advanced lithography

    SciTech Connect

    Trucano, T.G.; Grady, D.E.; Kubiak, G.D.; Kipp, M.E.; Olson, R.E.; Farnsworth, A.

    1995-03-01

    Extreme UltraViolet Lithography (EUVL) seeks to apply radiation in a wavelength region centered near 13 nm to produce microcircuits having features sizes 0.1 micron or less. A critical requirement for the commercial application of this technology is the development of an economical, compact source of this radiation which is suitable for lithographic applications. A good candidate is a laser-plasma source, which is generated by the interaction of an intermediate intensity laser pulse (up to 10{sup 12} W/cm{sup 2}) with a metallic target. While such a source has radiative characteristics which satisfy the needs of an EUVL source, the debris generated during the laser-target interaction strikes at the economy of the source. Here, the authors review the use of concepts and computer modeling, originally developed for hypervelocity impact analysis, to study this problem.

  3. Advanced Mask Aligner Lithography (AMALITH)

    NASA Astrophysics Data System (ADS)

    Voelkel, Reinhard; Vogler, Uwe; Bramati, Arianna

    2015-03-01

    Mask aligner lithography is very attractive for less-critical lithography layers and is widely used for LED, display, CMOS image sensor, micro-fluidics and MEMS manufacturing. Mask aligner lithography is also a preferred choice the semiconductor back-end for 3D-IC, TSV interconnects, advanced packaging (AdP) and wafer-level-packaging (WLP). Mask aligner lithography is a mature technique based on shadow printing and has not much changed since the 1980s. In shadow printing lithography a geometric pattern is transferred by free-space propagation from a photomask to a photosensitive layer on a wafer. The inherent simplicity of the pattern transfer offers ease of operation, low maintenance, moderate capital expenditure, high wafers-per-hour (WPH) throughput, and attractive cost-of-ownership (COO). Advanced mask aligner lithography (AMALITH) comprises different measures to improve shadow printing lithography beyond current limits. The key enabling technology for AMALITH is a novel light integrator systems, referred to as MO Exposure Optics® (MOEO). MOEO allows to fully control and shape the properties of the illumination light in a mask aligner. Full control is the base for accurate simulation and optimization of the shadow printing process (computational lithography). Now photolithography enhancement techniques like customized illumination, optical proximity correction (OPC), phase masks (AAPSM), half-tone lithography and Talbot lithography could be used in mask aligner lithography. We summarize the recent progress in advanced mask aligner lithography (AMALITH) and discuss possible measures to further improve shadow printing lithography.

  4. Advances in Nanoimprint Lithography.

    PubMed

    Traub, Matthew C; Longsine, Whitney; Truskett, Van N

    2016-06-01

    Nanoimprint lithography (NIL), a molding process, can replicate features <10 nm over large areas with long-range order. We describe the early development and fundamental principles underlying the two most commonly used types of NIL, thermal and UV, and contrast them with conventional photolithography methods used in the semiconductor industry. We then describe current advances toward full commercial industrialization of UV-curable NIL (UV-NIL) technology for integrated circuit production. We conclude with brief overviews of some emerging areas of research, from photonics to biotechnology, in which the ability of NIL to fabricate structures of arbitrary geometry is providing new paths for development. As with previous innovations, the increasing availability of tools and techniques from the semiconductor industry is poised to provide a path to bring these innovations from the lab to everyday life. PMID:27070763

  5. Microfluidic Applications of Soft Lithography

    SciTech Connect

    Rose, K A; Krulevitch, P; Hamilton, J

    2001-04-10

    The soft lithography fabrication technique was applied to three microfluidic devices. The method was used to create an original micropump design and retrofit to existing designs for a DNA manipulation device and a counter biological warfare sample preparation device. Each device presented unique and original challenges to the soft lithography application. AI1 design constraints of the retrofit devices were satisfied using PDMS devices created through variation of soft lithography methods. The micropump utilized the versatility of PDMS, creating design options not available with other materials. In all cases, the rapid processing of soft lithography reduced the fabrication time, creating faster turnaround for design modifications.

  6. Advances in nanoimprint lithography and applications in plasmonic-enhanced electron source

    NASA Astrophysics Data System (ADS)

    Liang, Yixing

    The research work in this thesis comprises of two parts. The first part focuses on nanofabrication techniques for better control of nanostructures, such as line edge roughness control and critical structure dimensions, for improvement in large area lift-off of ultra-thin (sub-40 nm) and ultra-small (sub-20 nm) nanostructures, and for improvement in mold-substrate separation. The second part of this thesis studies one important application of nanoimprint lithography (NIL) in the field of plasmonic-enhanced electron source. In the first part, a post-fabrication method, termed Self-limited Self Perfection by Liquefaction (SP-SPEL), is studied. SP-SPEL has experimentally demonstrated to reduce the trench width with precise control down to 20 nm from original 90 nm width, - 450% reduction. In addition, SP-SPEL increases the trench width uniformity and reduces the low-frequency line edge roughness. Second, a tri-layer method is studied to offer large area, efficient lift-off of ultra-thin (sub-40 nm) and ultra-fine (sub-20 nm) nanostructures. Using this method, a nanoimprint mold is fabricated. Third, tribo-electronics in NIL has been studied. It has been shown that tribo-charge can not only skew the AFM measurement by over 400%, but also largely increase the mold-substrate separation force. To solve this problem, a new mold structure is firstly proposed by Professor Stephen Y Chou and has demonstrated to reduce the separation force by over 8 fold. In the second part, a plasmonic-enhanced nanostructured electron source is studied, for both semiconducting and metallic photoemissive materials. For the semiconducting photocathode, a vertical cavity structure, comprising a top sub-wavelength mesh, ultra-thin (~ 40 nm) semiconducting materials in the middle and metallic back-plane, has demonstrated a 30 fold enhancement in photoelectron emission over a planar thin film. In addition, for the metallic photocathode, a 3D nanocavity, termed "Disk coupled Dots-on-Pillar Antenna

  7. SEM metrology for advanced lithographies

    NASA Astrophysics Data System (ADS)

    Bunday, Benjamin; Allgair, John; Rice, Bryan J.; Byers, Jeff; Avitan, Yohanan; Peltinov, Ram; Bar-zvi, Maayan; Adan, Ofer; Swyers, John; Shneck, Roni Z.

    2007-03-01

    For many years, lithographic resolution has been the main obstacle for keeping the pace of transistor densification to meet Moore's Law. The industry standard lithographic wavelength has evolved many times, from G-line to I-line, deep ultraviolet (DUV) based on KrF, and 193nm based on ArF. At each of these steps, new photoresist materials have been used. For the 45nm node and beyond, new lithography techniques are being considered, including immersion ArF lithography and extreme ultraviolet (EUV) lithography. As in the past, these techniques will use new types of photoresists with the capability of printing 45nm node (and beyond) feature widths and pitches. This paper will show results of an evaluation of the critical dimension-scanning electron microscopy (CD-SEM)-based metrology capabilities and limitations for the 193nm immersion and EUV lithography techniques that are suggested in the International Technology Roadmap for Semiconductors. In this study, we will print wafers with these emerging technologies and evaluate the performance of SEM-based metrology on these features. We will conclude with preliminary findings on the readiness of SEM metrology for these new challenges.

  8. Exposure tool control for advanced semiconductor lithography

    NASA Astrophysics Data System (ADS)

    Matsuyama, Tomoyuki

    2015-08-01

    This is a review paper to show how we control exposure tool parameters in order to satisfy patterning performance and productivity requirements for advanced semiconductor lithography. In this paper, we will discuss how we control illumination source shape to satisfy required imaging performance, heat-induced lens aberration during exposure to minimize the aberration impact on imaging, dose and focus control to realize uniform patterning performance across the wafer and patterning position of circuit patterns on different layers. The contents are mainly about current Nikon immersion exposure tools.

  9. Mask cost of ownership for advanced lithography

    NASA Astrophysics Data System (ADS)

    Muzio, Edward G.; Seidel, Philip K.

    2000-07-01

    As technology advances, becoming more difficult and more expensive, the cost of ownership (CoO) metric becomes increasingly important in evaluating technical strategies. The International SEMATECH CoC analysis has steadily gained visibility over the past year, as it attempts to level the playing field between technology choices, and create a fair relative comparison. In order to predict mask cots for advanced lithography, mask process flows are modeled using bets-known processing strategies, equipment cost, and yields. Using a newly revised yield mode, and updated mask manufacture flows, representative mask flows can be built. These flows are then used to calculate mask costs for advanced lithography down to the 50 nm node. It is never the goal of this type of work to provide absolute cost estimates for business planning purposes. However, the combination of a quantifiable yield model with a clearly defined set of mask processing flows and a cost model based upon them serves as an excellent starting point for cost driver analysis and process flow discussion.

  10. Lithography for enabling advances in integrated circuits and devices.

    PubMed

    Garner, C Michael

    2012-08-28

    Because the transistor was fabricated in volume, lithography has enabled the increase in density of devices and integrated circuits. With the invention of the integrated circuit, lithography enabled the integration of higher densities of field-effect transistors through evolutionary applications of optical lithography. In 1994, the semiconductor industry determined that continuing the increase in density transistors was increasingly difficult and required coordinated development of lithography and process capabilities. It established the US National Technology Roadmap for Semiconductors and this was expanded in 1999 to the International Technology Roadmap for Semiconductors to align multiple industries to provide the complex capabilities to continue increasing the density of integrated circuits to nanometre scales. Since the 1960s, lithography has become increasingly complex with the evolution from contact printers, to steppers, pattern reduction technology at i-line, 248 nm and 193 nm wavelengths, which required dramatic improvements of mask-making technology, photolithography printing and alignment capabilities and photoresist capabilities. At the same time, pattern transfer has evolved from wet etching of features, to plasma etch and more complex etching capabilities to fabricate features that are currently 32 nm in high-volume production. To continue increasing the density of devices and interconnects, new pattern transfer technologies will be needed with options for the future including extreme ultraviolet lithography, imprint technology and directed self-assembly. While complementary metal oxide semiconductors will continue to be extended for many years, these advanced pattern transfer technologies may enable development of novel memory and logic technologies based on different physical phenomena in the future to enhance and extend information processing. PMID:22802500

  11. 75 FR 44015 - Certain Semiconductor Products Made by Advanced Lithography Techniques and Products Containing...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-07-27

    ... COMMISSION Certain Semiconductor Products Made by Advanced Lithography Techniques and Products Containing... importation of certain semiconductor products made by advanced lithography techniques and products containing... certain semiconductor products made by advanced lithography techniques or products containing same...

  12. Directed Self-assembly for Lithography Applications

    NASA Astrophysics Data System (ADS)

    Cheng, Joy

    2010-03-01

    Economics dictated that semiconductor devices need to be scaled approximately to 70 percent linearly in order to follow the pace of Moore's law and maintain cost effectiveness. Optical lithography has been the driving force for scaling; however, it approaches its physical limit to print patterns beyond 22nm node. Directed self-assembly (DSA), which combines ``bottom-up'' self-assembled polymers and ``top-down'' lithographically defined substrates, has been considered as a potential candidate to extend optical lithography. Benefit from nanometer-scale self-assembly features and the registration precision of advanced lithography, DSA provides precise and programmable nanopatterns beyond the resolution limit of conventional lithography. We have demonstrated DSA concepts including frequency multiplication and pattern rectification using guiding prepattern with proper chemical and topographical information generated by e-beam lithography. In addition, we seek to integrate DSA with 193 nm optical lithography in a straightforward manner in order to move DSA from the research stage to a viable manufacturing technology. Recently, we implemented various integration strategies using photolithography to produce guiding patterns for DSA. This new ability enables DSA to be applied to large areas with state-of-the-art lithography facilities.

  13. Holographic lithography for biomedical applications

    NASA Astrophysics Data System (ADS)

    Stankevicius, E.; Balciunas, E.; Malinauskas, M.; Raciukaitis, G.; Baltriukiene, D.; Bukelskiene, V.

    2012-06-01

    Fabrication of scaffolds for cell growth with appropriate mechanical characteristics is top-most important for successful creation of tissue. Due to ability of fast fabrication of periodic structures with a different period, the holographic lithography technique is a suitable tool for scaffolds fabrication. The scaffolds fabricated by holographic lithography can be used in various biomedical investigations such as the cellular adhesion, proliferation and viability. These investigations allow selection of the suitable material and geometry of scaffolds which can be used in creation of tissue. Scaffolds fabricated from di-acrylated poly(ethylene glycol) (PEG-DA-258) over a large area by holographic lithography technique are presented in this paper. The PEG-DA scaffolds fabricated by holographic lithography showed good cytocompatibility for rabbit myogenic stem cells. It was observed that adult rabbit muscle-derived myogenic stem cells grew onto PEG-DA scaffolds. They were attached to the pillars and formed cell-cell interactions. It demonstrates that the fabricated structures have potential to be an interconnection channel network for cell-to-cell interactions, flow transport of nutrients and metabolic waste as well as vascular capillary ingrowth. These results are encouraging for further development of holographic lithography by improving its efficiency for microstructuring three-dimensional scaffolds out of biodegradable hydrogels

  14. Precision manufacturing using advanced optical interference lithography. Final report

    SciTech Connect

    Britten, J.A.; Hawryluk, A.M.

    1997-04-03

    Goal was to develop interference lithography (IL) as a reliable process for patterning large-area, deep-submicron scale field emission arrays for field emission display (FED) applications. We have developed a system based on IL which can easily produce an array of 0.2-0.5 micron emitters over large area (up to 400 sq. in. to date) with better than 5% height and spacing uniformity. Process development as a result of this LDRD project represents a significant advance over the current state of the art for FED manufacturing and is applicable to all types of FEDs, independent of the emitter material. Ability of IL to pattern such structures simultaneously and uniformly on a large format has application to other technology areas, such as dynamic random access memory (DRAM) production and magnetic media recording.

  15. Advanced mask aligner lithography: new illumination system.

    PubMed

    Voelkel, Reinhard; Vogler, Uwe; Bich, Andreas; Pernet, Pascal; Weible, Kenneth J; Hornung, Michael; Zoberbier, Ralph; Cullmann, Elmar; Stuerzebecher, Lorenz; Harzendorf, Torsten; Zeitner, Uwe D

    2010-09-27

    A new illumination system for mask aligner lithography is presented. The illumination system uses two subsequent microlens-based Köhler integrators. The second Köhler integrator is located in the Fourier plane of the first. The new illumination system uncouples the illumination light from the light source and provides excellent uniformity of the light irradiance and the angular spectrum. Spatial filtering allows to freely shape the angular spectrum to minimize diffraction effects in contact and proximity lithography. Telecentric illumination and ability to precisely control the illumination light allows to introduce resolution enhancement technologies (RET) like customized illumination, optical proximity correction (OPC) and source-mask optimization (SMO) in mask aligner lithography. PMID:20940992

  16. Advances in the reduction and compensation of film stress in high-reflectance multilayer coatings for extreme ultraviolet lithography applications

    SciTech Connect

    Mirkarimi, P.B., LLNL

    1998-02-20

    Due to the stringent surface figure requirements for the multilayer-coated optics in an extreme ultraviolet (EUV) projection lithography system, it is desirable to minimize deformation due to the multilayer film stress. However, the stress must be reduced or compensated without reducing EUV reflectivity, since the reflectivity has a strong impact on the throughput of a EUV lithography tool. In this work we identify and evaluate several leading techniques for stress reduction and compensation as applied to Mo/Si and Mo/Be multilayer films. The measured film stress for Mo/Si films with EUV reflectances near 67.4% at 13.4 nm is approximately - 420 MPa (compressive), while it is approximately +330 MPa (tensile) for Mo/Be films with EUV reflectances near 69.4% at 11.4 nm. Varying the Mo-to-Si ratio can be used to reduce the stress to near zero levels, but at a large loss in EUV reflectance (> 20%). The technique of varying the base pressure (impurity level) yielded a 10% decrease in stress with a 2% decrease in reflectance for our multilayers. Post-deposition annealing was performed and it was observed that while the cost in reflectance is relatively high (3.5%) to bring the stress to near zero levels (i.e., reduce by 1 00%), the stress can be reduced by 75% with only a 1.3% drop in reflectivity at annealing temperatures near 200{degrees}C. A study of annealing during Mo/Si deposition was also performed; however, no practical advantage was observed by heating during deposition. A new non-thermal (athermal) buffer-layer technique was developed to compensate for the effects of stress. Using this technique with amorphous silicon and Mo/Be buffer-layers it was possible to obtain Mo/Be and Mo/Si multilayer films with a near zero net film stress and less than a 1% loss in reflectivity. For example a Mo/Be film with 68.7% reflectivity at 11.4 nm and a Mo/Si film with 66.5% reflectivity at 13.3 nm were produced with net stress values less than 30 MPa.

  17. Advanced lithography for micro-optics

    NASA Astrophysics Data System (ADS)

    Zeitner, U. D.; Kley, E.-B.

    2006-08-01

    Since the beginning of micro-optics fabrication most of the used technologies have been adapted from or are related to semiconductor fabrication techniques. These are widely known and the special microelectronics fabrication tools, especially lithography machines, are available at numerous places. Besides the fact that therefore micro-optics was able to took advantage of the steady development of semiconductor technology this tight linkage has also a lot of drawbacks. The adaptation of element properties to the fabrication limits given by the available technologies is very often connected with compromises in optical performance. In nowadays micro-optics fabrication has reached a level which justifies the development of fabrication tools specialized to its own demands. In the article the special demands of optical microstructures on the fabrication technologies are discussed and newly developed mico-optics fabrication tools are introduced. The first one is an electron-beam lithography machine for use with up substrates up to 300mm large and 15mm thick achieving a very high overlay accuracy and writing speed. The second one is a laser-lithography system capable to expose micro-optical structures onto non-planar substrates.

  18. Zero expansion glass ceramic ZERODUR® roadmap for advanced lithography

    NASA Astrophysics Data System (ADS)

    Westerhoff, Thomas; Jedamzik, Ralf; Hartmann, Peter

    2013-04-01

    The zero expansion glass ceramic ZERODUR® is a well-established material in microlithography in critical components as wafer- and reticle-stages, mirrors and frames in the stepper positioning and alignment system. The very low coefficient of thermal expansion (CTE) and its extremely high CTE homogeneity are key properties to achieve the tight overlay requirements of advanced lithography processes. SCHOTT is continuously improving critical material properties of ZERODUR® essential for microlithography applications according to a roadmap driven by the ever tighter material specifications broken down from the customer roadmaps. This paper will present the SCHOTT Roadmap for ZERODUR® material property development. In the recent years SCHOTT established a physical model based on structural relaxation to describe the coefficient of thermal expansion's temperature dependence. The model is successfully applied for the new expansion grade ZERODUR® TAILORED introduced to the market in 2012. ZERODUR® TAILORED delivers the lowest thermal expansion of ZERODUR® products at microlithography tool application temperature allowing for higher thermal stability for tighter overlay control in IC production. Data will be reported demonstrating the unique CTE homogeneity of ZERODUR® and its very high reproducibility, a necessary precondition for serial production for microlithography equipment components. New data on the bending strength of ZERODUR® proves its capability to withstand much higher mechanical loads than previously reported. Utilizing a three parameter Weibull distribution it is possible to derive minimum strength values for a given ZERODUR® surface treatment. Consequently the statistical uncertainties of the earlier approach based on a two parameter Weibull distribution have been eliminated. Mechanical fatigue due to stress corrosion was included in a straightforward way. The derived formulae allows calculating life time of ZERODUR® components for a given stress

  19. Advanced statistical process control: controlling sub-0.18-μm lithography and other processes

    NASA Astrophysics Data System (ADS)

    Zeidler, Amit; Veenstra, Klaas-Jelle; Zavecz, Terrence E.

    2001-08-01

    Feed-forward, as a method to control the Lithography process for Critical Dimensions and Overlay, is well known in the semiconductors industry. However, the control provided by simple averaging feed-forward methodologies is not sufficient to support the complexity of a sub-0.18micrometers lithography process. Also, simple feed-forward techniques are not applicable for logics and ASIC production due to many different products, lithography chemistry combinations and the short memory of the averaging method. In the semiconductors industry, feed-forward control applications are generally called APC, Advanced Process Control applications. Today, there are as many APC methods as the number of engineers involved. To meet the stringent requirements of 0.18 micrometers production, we selected a method that is described in SPIE 3998-48 (March 2000) by Terrence Zavecz and Rene Blanquies from Yield Dynamics Inc. This method is called PPC, Predictive Process Control, and employs a methodology of collecting measurement results and the modeled bias attributes of expose tools, reticles and the incoming process in a signatures database. With PPC, before each lot exposure, the signatures of the lithography tool, the reticle and the incoming process are used to predict the setup of the lot process and the expected lot results. Benefits derived from such an implementation are very clear; there is no limitation of the number of products or lithography-chemistry combinations and the technique avoids the short memory of conventional APC techniques. ... and what's next? (Rob Morton, Philips assignee to International Sematech). The next part of the paper will try to answer this question. Observing that CMP and metal deposition significantly influence CD's and overlay results, and even Contact Etch can have a significant influence on Metal 5 overlay, we developed a more general PPC for lithography. Starting with the existing lithography PPC applications database, the authors extended the

  20. Implementation and benefits of advanced process control for lithography CD and overlay

    NASA Astrophysics Data System (ADS)

    Zavyalova, Lena; Fu, Chong-Cheng; Seligman, Gary S.; Tapp, Perry A.; Pol, Victor

    2003-05-01

    Due to the rapidly reduced imaging process windows and increasingly stingent device overlay requirements, sub-130 nm lithography processes are more severely impacted than ever by systamic fault. Limits on critical dimensions (CD) and overlay capability further challenge the operational effectiveness of a mix-and-match environment using multiple lithography tools, as such mode additionally consumes the available error budgets. Therefore, a focus on advanced process control (APC) methodologies is key to gaining control in the lithographic modules for critical device levels, which in turn translates to accelerated yield learning, achieving time-to-market lead, and ultimately a higher return on investment. This paper describes the implementation and unique challenges of a closed-loop CD and overlay control solution in high voume manufacturing of leading edge devices. A particular emphasis has been placed on developing a flexible APC application capable of managing a wide range of control aspects such as process and tool drifts, single and multiple lot excursions, referential overlay control, 'special lot' handling, advanced model hierarchy, and automatic model seeding. Specific integration cases, including the multiple-reticle complementary phase shift lithography process, are discussed. A continuous improvement in the overlay and CD Cpk performance as well as the rework rate has been observed through the implementation of this system, and the results are studied.

  1. Application of optical CD metrology for alternative lithography

    NASA Astrophysics Data System (ADS)

    Asano, Masafumi; Kawamoto, Akiko; Matsuki, Kazuto; Godny, Stephane; Lin, Tingsheng; Wakamoto, Koichi

    2013-04-01

    Directed self-assembly (DSA) and nanoimprint lithography (NIL) have been widely developed for low-cost nanoscale patterning. Although they are currently regarded as "alternative lithography," some papers show their potential to be candidates for next-generation lithography (NGL). To actualize the potential, the contribution of metrology engineers is necessary. Since the characteristics of the lithography techniques are different from those of conventional lithography, new metrology schemes correlated with each characteristic are required. In DSA of block copolymer (BCP), a guide is needed to control the direction and position of BCP. Therefore, it is necessary to monitor the relationship between the guide and the BCP pattern. Since the depth of guide or the coating thickness variation of BCP over guide influences the behavior of phase separation of BCP, 3D metrology becomes increasingly important. In NIL, residual resist thickness (RLT) underneath the pattern should be measured because its variation affects the CD variation of transferred pattern. 3D metrology is also important in NIL. Optical critical dimension (OCD) metrology will be a powerful tool for 3D metrology. In this work, some applications of OCD for alternative lithography have been studied. For DSA, we have tried to simultaneously monitor the guide and BCP pattern in a DSA-based contact hole shrinking process. Sufficient measurement accuracy for CD and shapes for guide and BCP patterns was achievable. For NIL, sufficient sensitivity to RLT measurement was obtained.

  2. Mask characterization for CDU budget breakdown in advanced EUV lithography

    NASA Astrophysics Data System (ADS)

    Nikolsky, Peter; Strolenberg, Chris; Nielsen, Rasmus; Nooitgedacht, Tjitte; Davydova, Natalia; Yang, Greg; Lee, Shawn; Park, Chang-Min; Kim, Insung; Yeo, Jeong-Ho

    2012-11-01

    As the ITRS Critical Dimension Uniformity (CDU) specification shrinks, semiconductor companies need to maintain a high yield of good wafers per day and a high performance (and hence market value) of finished products. This cannot be achieved without continuous analysis and improvement of on-product CDU as one of the main drivers for process control and optimization with better understanding of main contributors from the litho cluster: mask, process, metrology and scanner. In this paper we will demonstrate a study of mask CDU characterization and its impact on CDU Budget Breakdown (CDU BB) performed for an advanced EUV lithography with 1D and 2D feature cases. We will show that this CDU contributor is one of the main differentiators between well-known ArFi and new EUV CDU budgeting principles. We found that reticle contribution to intrafield CDU should be characterized in a specific way: mask absorber thickness fingerprints play a role comparable with reticle CDU in the total reticle part of the CDU budget. Wafer CD fingerprints, introduced by this contributor, may or may not compensate variations of mask CD's and hence influence on total mask impact on intrafield CDU at the wafer level. This will be shown on 1D and 2D feature examples in this paper. Also mask stack reflectivity variations should be taken into account: these fingerprints have visible impact on intrafield CDs at the wafer level and should be considered as another contributor to the reticle part of EUV CDU budget. We observed also MEEF-through-field fingerprints in the studied EUV cases. Variations of MEEF may also play a role for the total intrafield CDU and may be taken into account for EUV Lithography. We characterized MEEF-through-field for the reviewed features, the results to be discussed in our paper, but further analysis of this phenomenon is required. This comprehensive approach to characterization of the mask part of EUV CDU characterization delivers an accurate and integral CDU Budget

  3. Dynamic maskless holographic lithography and applications

    NASA Astrophysics Data System (ADS)

    McAdams, Daniel R.

    The purpose of this research is to improve the resolution of dynamic maskless holographic lithography (DMHL) by using two-photon absorption, to provide a more thorough characterization of the process, and to expand the functionality of the process by adding previously undemonstrated patterning modes. Two-photon DMHL will be performed in both 2D and 3D configurations with specific characterization relating to process resolution and repeatability. The physical limits of DMHL will be discussed and ways to circumvent them will be proposed and tested. DMHL eliminates the need for a separate mask for every different pattern exposure and allows for real-time shaping of the exposure pattern. It uses an electrically addressable spatial light modulator (SLM) to create an arbitrary intensity pattern at the specimen plane. The SLM is a phase mask that displays a hologram. An algorithm is used to find an appropriate phase hologram for each desired intensity pattern. Each pixel of the SLM shapes the wavefront of the incoming laser light so that the natural Fourier transforming property of a lens causes the desired image to appear in the specimen plane. The process enables one-off projects to be done without the cost of fabricating a mask, and makes it possible to perform lithography with fewer (or even no) moving parts.

  4. Total lithography system based on a new application software platform enabling smart scanner management

    NASA Astrophysics Data System (ADS)

    Kono, Hirotaka; Masaki, Kazuo; Matsuyama, Tomoyuki; Wakamoto, Shinji; Park, Seemoon; Sugihara, Taro; Shibazaki, Yuichi

    2015-03-01

    Along with device shrinkage, higher accuracy will continuously be required from photo-lithography tools in order to enhance on-product yield. In order to achieve higher yield, the advanced photo-lithography tools must be equipped with sophisticated tuning knobs on the tool and with software that is flexible enough to be applied per layer. This means photo-lithography tools must be capable of handling many types of sub-recipes and parameters simultaneously. To enable managing such a large amount of data easily and to setup lithography tools smoothly, we have developed a total lithography system called Litho Turnkey Solution based on a new software application platform, which we call Plug and Play Manager (PPM). PPM has its own graphical user interface, which enables total management of various data. Here various data means recipes, sub-recipes, tuning-parameters, measurement results, and so on. Through PPM, parameter making by intelligent applications such as CDU/Overlay tuning tools can easily be implemented. In addition, PPM is also linked to metrology tools and the customer's host computer, which enables data flow automation. Based on measurement data received from the metrology tools, PPM calculates correction parameters and sends them to the scanners automatically. This scheme can make calibration feedback loops possible. It should be noted that the abovementioned functions are running on the same platform through a user-friendly interface. This leads to smart scanner management and usability improvement. In this paper, we will demonstrate the latest development status of Nikon's total lithography solution based on PPM; describe details of each application; and provide supporting data for the accuracy and usability of the system. Keywords: exposure

  5. Applications of nanoimprint lithography/hot embossing: a review

    NASA Astrophysics Data System (ADS)

    Chen, Yifang

    2015-11-01

    This review concentrates on the applications of nanoimprint lithography (NIL) and hot embossing for the fabrications of nanolectronic devices, nanophotonic metamaterials and other nanostructures. Technical challenges and solutions in NIL such as nanofabrication of templates, removal of residual resist, pattern displacement in thermal NIL arising from thermal expansion are first discussed. In the nanofabrication of templates, dry etch in plasma for the formation of multi-step structures and ultra-sharp tip arrays in silicon, nanophotonic chiral structures with high aspect ratio in SiC are demonstrated. A bilayer technique for nondestructive removal of residual resist in thermal NIL is described. This process is successfully applied for the fabrication of T-shape gates and functional high electron mobility transistors. However, pattern displacement intrinsically existing in thermal NIL/hot embossing owing to different thermal expansions in the template and substrate, respectively, limits its further development and scale-up. Low temperature even room temperature NIL (RTNIL) was then proposed on HSQ, trying to eliminate the pattern distortion by avoiding a thermal loop in the imprint. But, considerable pressure needed in RTNIL turned the major attentions to the development of UV-curing NIL in UV-curable monomers at low temperature. A big variety of applications by low-temperature UV-curing NIL in SU-8 are described, including high-aspect-ratio phase gratings, tagging technology by nanobarcode for DNA sequencing, nanofluidic channels, nanophotonic metamaterials and biosensors. Hot embossing, as a parallel technique to NIL, was also developed, and its applications on ferroelectric polymers as well as metals are reviewed. Therefore, it is necessary to emphasize that this review is mainly attempted to review the applications of NIL/embossing instead of NIL technique advances.

  6. Advanced low-complexity compression for maskless lithography data

    NASA Astrophysics Data System (ADS)

    Dai, Vito; Zakhor, Avideh

    2004-05-01

    A direct-write maskless lithography system using 25nm for 50nm feature sizes requires data rates of about 10 Tb/s to maintain a throughput of one wafer per minute per layer achieved by today"s optical lithography systems. In a previous paper, we presented an architecture that achieves this data rate contingent on 25 to 1 compression of lithography data, and on implementation of a real-time decompressor fabricated on the same chip as a massively parallel array of lithography writers for 50 nm feature sizes. A number of compression techniques, including JBIG, ZIP, the novel 2D-LZ, and BZIP2 were demonstrated to achieve sufficiently high compression ratios on lithography data to make the architecture feasible, although no single technique could achieve this for all test layouts. In this paper we present a novel lossless compression algorithm called Context Copy Combinatorial Code (C4) specifically tailored for lithography data. It successfully combines the advantages of context-based modeling in JBIG and copying in ZIP to achieve higher compression ratios across all test layouts. As part of C4, we have developed a low-complexity binary entropy coding technique called combinatorial coding which is simultaneously as efficient as arithmetic coding and as fast as Huffman coding. Compression results show C4 outperforms JBIG, ZIP, BZIP2, and 2D-LZ, and achieves lossless compression ratios greater than 22 for binary layout image data, and greater than 14 for grey-pixel image data. The tradeoff between decoder buffer size, which directly affects implementation complexity and compression ratio is examined. For the same buffer size, C4 achieves higher compression than LZ77, ZIP, and BZIP2.

  7. Microfield exposure tool enables advances in EUV lithography development

    SciTech Connect

    Naulleau, Patrick

    2009-09-07

    , with EUV not expected in production before the 22-nm half pitch node even finer resolution capabilities are now required from development tools. The SEMATECH Berkeley MET's custom-coherence illuminator allows it to be used with aggressive modified illumination enabling kJ factors as low as 0.25. Noting that the lithographic resolution of an exposure tool is defined as k{sub 1}{lambda}/NA, yielding an ultimate resolution limit of 11 nm. To achieve sub-20-nm aerial-image resolution while avoiding forbidden pitches on Manhattan-geometry features with the centrally-obscured MET optic, a 45-degree oriented dipole pupil fill is used. Figure 1 shows the computed aerial-image contrast as a function of half pitch for a dipole pupil fill optimized to print down to the 19-nm half pitch level. This is achieved with relatively uniform performance at larger dimensions. Using this illumination, printing down to the 20-nm half pitch level has been demonstrated in chemically amplified resists as shown in Fig. 2. The SEMATECH Berkeley MET tool plays a crucial role in the advancement of EUV resists. The unique programmable coherence properties of this tool enable it to achieve higher resolution than other EUV projection tools. As presented here, over the past year the tool has been used to demonstrate resist resolutions of 20 half pitch. Although not discussed here, because the Berkeley MET tool is a true projection lithography tool, it also plays a crucial role in advanced EUV mask research. Examples of the work done in this area include defect printability, mask architecture, and phase shift masks.

  8. Hybrid inverse lithography techniques for advanced hierarchical memories

    NASA Astrophysics Data System (ADS)

    Xiao, Guangming; Hooker, Kevin; Irby, Dave; Zhang, Yunqiang; Ward, Brian; Cecil, Tom; Hall, Brett; Lee, Mindy; Kim, Dave; Lucas, Kevin

    2014-03-01

    Traditional segment-based model-based OPC methods have been the mainstream mask layout optimization techniques in volume production for memory and embedded memory devices for many device generations. These techniques have been continually optimized over time to meet the ever increasing difficulties of memory and memory periphery patterning. There are a range of difficult issues for patterning embedded memories successfully. These difficulties include the need for a very high level of symmetry and consistency (both within memory cells themselves and between cells) due to circuit effects such as noise margin requirements in SRAMs. Memory cells and access structures consume a large percentage of area in embedded devices so there is a very high return from shrinking the cell area as much as possible. This aggressive scaling leads to very difficult resolution, 2D CD control and process window requirements. Additionally, the range of interactions between mask synthesis corrections of neighboring areas can extend well beyond the size of the memory cell, making it difficult to fully take advantage of the inherent designed cell hierarchy in mask pattern optimization. This is especially true for non-traditional (i.e., less dependent on geometric rule) OPC/RET methods such as inverse lithography techniques (ILT) which inherently have more model-based decisions in their optimizations. New inverse methods such as model-based SRAF placement and ILT are, however, well known to have considerable benefits in finding flexible mask pattern solutions to improve process window, improve 2D CD control, and improve resolution in ultra-dense memory patterns. They also are known to reduce recipe complexity and provide native MRC compliant mask pattern solutions. Unfortunately, ILT is also known to be several times slower than traditional OPC methods due to the increased computational lithographic optimizations it performs. In this paper, we describe and present results for a methodology to

  9. CD bias reduction in CD-SEM linewidth measurements for advanced lithography

    NASA Astrophysics Data System (ADS)

    Tanaka, Maki; Meessen, Jeroen; Shishido, Chie; Watanabe, Kenji; Minnaert-Janssen, Ingrid; Vanoppen, Peter

    2008-03-01

    The linewidth measurement capability of the model-based library (MBL) matching technique was evaluated experimentally. This technique estimates the dimensions and shape of a target pattern by comparing a measured SEM image profile to a library of simulated line scans. The simulation model uses a non-linear least squares method to estimate pattern geometry parameters. To examine the application of MBL matching in an advanced lithography process, a focus-exposure matrix wafer was prepared with a leading-edge immersion lithography tool. The evaluation used 36 sites with target structures having various linewidths from 45 to 200 nm. The measurement accuracy was evaluated by using an atomic force microscope (AFM) as a reference measurement system. The results of a first trial indicated that two or more solutions could exist in the parameter space in MBL matching. To solve this problem, we obtained a rough estimation of the scale parameter in SEM imaging, based on experimental results, in order to add a constraint in the matching process. As a result, the sensitivity to sidewall variation in MBL matching was improved, and the measurement bias was reduced from 22.1 to 16 nm. These results indicate the possibility of improving the CD measurement capability by applying this tool parameter appropriately.

  10. Metallic nanodot arrays by stencil lithography for plasmonic biosensing applications.

    PubMed

    Vazquez-Mena, Oscar; Sannomiya, Takumi; Villanueva, Luis G; Voros, Janos; Brugger, Juergen

    2011-02-22

    The fabrication of gold nanodots by stencil lithography and its application for optical biosensing based on localized surface plasmon resonance are presented. Arrays of 50-200 nm wide nanodots with different spacing of 50-300 nm are fabricated without any resist, etching, or lift-off process. The dimensions and morphology of the nanodots were characterized by scanning electron and atomic force microscopy. The fabricated nanodots showed localized surface plasmon resonance in their extinction spectra in the visible range. The resonance wavelength depends on the periodicity and dimensions of the nanodots. Bulk refractive index measurements and model biosensing of streptavidin were successfully performed based on the plasmon resonance shift induced by local refractive index change when biomolecules are adsorbed on the nanodots. These results demonstrate the potential of stencil lithography for the realization of plasmon-based biosensing devices. PMID:21192666

  11. 3D nanostructures fabricated by advanced stencil lithography.

    PubMed

    Yesilkoy, F; Flauraud, V; Rüegg, M; Kim, B J; Brugger, J

    2016-03-01

    This letter reports on a novel fabrication method for 3D metal nanostructures using high-throughput nanostencil lithography. Aperture clogging, which occurs on the stencil membranes during physical vapor deposition, is leveraged to create complex topographies on the nanoscale. The precision of the 3D nanofabrication method is studied in terms of geometric parameters and material types. The versatility of the technique is demonstrated by various symmetric and chiral patterns made of Al and Au. PMID:26884085

  12. 3D nanostructures fabricated by advanced stencil lithography

    NASA Astrophysics Data System (ADS)

    Yesilkoy, F.; Flauraud, V.; Rüegg, M.; Kim, B. J.; Brugger, J.

    2016-02-01

    This letter reports on a novel fabrication method for 3D metal nanostructures using high-throughput nanostencil lithography. Aperture clogging, which occurs on the stencil membranes during physical vapor deposition, is leveraged to create complex topographies on the nanoscale. The precision of the 3D nanofabrication method is studied in terms of geometric parameters and material types. The versatility of the technique is demonstrated by various symmetric and chiral patterns made of Al and Au.

  13. Advanced laser driver for soft x-ray projection lithography

    SciTech Connect

    Zapata, L.E.; Beach, R.J.; Dane, C.B.; Reichert, P.; Honig, J.N.; Hackel, L.A.

    1994-03-01

    A diode-pumped Nd:YAG laser for use as a driver for a soft x-ray projection lithography system is described. The laser will output 0.5 to 1 J per pulse with about 5 ns pulse width at up to 1.5 kHz repetition frequency. The design employs microchannel-cooled diode laser arrays for optical pumping, zigzag slab energy storage, and a single frequency oscillator injected regenerative amplifier cavity using phase conjugator beam correction for near diffraction limited beam quality. The design and initial results of this laser`s activation experiments will be presented.

  14. Programmable lithography engine (ProLE) grid-type supercomputer and its applications

    NASA Astrophysics Data System (ADS)

    Petersen, John S.; Maslow, Mark J.; Gerold, David J.; Greenway, Robert T.

    2003-06-01

    There are many variables that can affect lithographic dependent device yield. Because of this, it is not enough to make optical proximity corrections (OPC) based on the mask type, wavelength, lens, illumination-type and coherence. Resist chemistry and physics along with substrate, exposure, and all post-exposure processing must be considered too. Only a holistic approach to finding imaging solutions will accelerate yield and maximize performance. Since experiments are too costly in both time and money, accomplishing this takes massive amounts of accurate simulation capability. Our solution is to create a workbench that has a set of advanced user applications that utilize best-in-class simulator engines for solving litho-related DFM problems using distributive computing. Our product, ProLE (Programmable Lithography Engine), is an integrated system that combines Petersen Advanced Lithography Inc."s (PAL"s) proprietary applications and cluster management software wrapped around commercial software engines, along with optional commercial hardware and software. It uses the most rigorous lithography simulation engines to solve deep sub-wavelength imaging problems accurately and at speeds that are several orders of magnitude faster than current methods. Specifically, ProLE uses full vector thin-mask aerial image models or when needed, full across source 3D electromagnetic field simulation to make accurate aerial image predictions along with calibrated resist models;. The ProLE workstation from Petersen Advanced Lithography, Inc., is the first commercial product that makes it possible to do these intensive calculations at a fraction of a time previously available thus significantly reducing time to market for advance technology devices. In this work, ProLE is introduced, through model comparison to show why vector imaging and rigorous resist models work better than other less rigorous models, then some applications of that use our distributive computing solution are shown

  15. 75 FR 81643 - In the Matter of Certain Semiconductor Products Made by Advanced Lithography Techniques and...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-12-28

    ... certain claims of U.S. Patent No. 6,042,998. 75 FR. 44,015 (July 27, 2010). The complaint named two... COMMISSION In the Matter of Certain Semiconductor Products Made by Advanced Lithography Techniques and... for ] importation, and sale within the United States after importation of certain...

  16. Advanced electric-field scanning probe lithography on molecular resist using active cantilever

    NASA Astrophysics Data System (ADS)

    Kaestner, Marcus; Aydogan, Cemal; Lipowicz, Hubert-Seweryn; Ivanov, Tzvetan; Lenk, Steve; Ahmad, Ahmad; Angelov, Tihomir; Reum, Alexander; Ishchuk, Valentyn; Atanasov, Ivaylo; Krivoshapkina, Yana; Hofer, Manuel; Holz, Mathias; Rangelow, Ivo W.

    2015-03-01

    The routine "on demand" fabrication of features smaller than 10 nm opens up new possibilities for the realization of many novel nanoelectronic, NEMS, optical and bio-nanotechnology-based devices. Based on the thermally actuated, piezoresistive cantilever technology we have developed a first prototype of a scanning probe lithography (SPL) platform able to image, inspect, align and pattern features down to single digit nano regime. The direct, mask-less patterning of molecular resists using active scanning probes represents a promising path circumventing the problems in today's radiation-based lithography. Here, we present examples of practical applications of the previously published electric field based, current-controlled scanning probe lithography on molecular glass resist calixarene by using the developed tabletop SPL system. We demonstrate the application of a step-and-repeat scanning probe lithography scheme including optical as well as AFM based alignment and navigation. In addition, sequential read-write cycle patterning combining positive and negative tone lithography is shown. We are presenting patterning over larger areas (80 x 80 μm) and feature the practical applicability of the lithographic processes.

  17. Fundamental study of droplet spray characteristics in photomask cleaning for advanced lithography

    NASA Astrophysics Data System (ADS)

    Lu, C. L.; Yu, C. H.; Liu, W. H.; Hsu, Luke; Chin, Angus; Lee, S. C.; Yen, Anthony; Lee, Gaston; Dress, Peter; Singh, Sherjang; Dietze, Uwe

    2010-09-01

    The fundamentals of droplet-based cleaning of photomasks are investigated and performance regimes that enable the use of binary spray technologies in advanced mask cleaning are identified. Using phase Doppler anemometry techniques, the effect of key performance parameters such as liquid and gas flow rates and temperature, nozzle design, and surface distance on droplet size, velocity, and distributions were studied. The data are correlated to particle removal efficiency (PRE) and feature damage results obtained on advanced photomasks for 193-nm immersion lithography.

  18. Lithography with infrared illumination alignment for advanced BiCMOS backside processing

    NASA Astrophysics Data System (ADS)

    Kulse, P.; Schulz, K.; Behrendt, U.; Wietstruck, M.; Kaynak, M.; Marschmeyer, S.; Tillack, B.

    2014-10-01

    Driven by new applications such as BiCMOS embedded RF-MEMS, high-Q passives, Si-based microfluidics for bio sensing and InP-Si BiCMOS heterointegration [1-4], accurate alignment between back and front side is highly desired. In this paper, we present an advanced back to front side alignment technique and implementation of it into the back side processing module of IHP's 0.25/0.13 μm high performance SiGe:C BiCMOS technology. Using the Nikon i-line Stepper NSR-SF150, a new infrared alignment system has been introduced. The developed technique enables a high resolution and accurate lithography on the back side of the BiCMOS-processed Si wafers for additional backside processing, such as backside routing metallization. In comparison to previous work [5] with overlay values of 500 nm and the requirement of two-step lithography, the new approach provides significant improvement in the overlay accuracy with overlay values of 200 nm and a significant increase of the fabrication throughput by eliminating the need of the two-step lithography. The new non-contact alignment procedure allows a direct back to front side alignment using any front side alignment mark (Fig. 2), which generated a signal by reflecting the IR light beam. Followed by a measurement of the misalignment between both front to back side overlay marks (Fig. 3) using EVG®NT40 automated measurement system, a final lithography process with wafer interfield corrections is applied to obtain a minimum overlay of 200 nm. For the specific application of deep Si etching using Bosch process, the etch profile angle deviation across the wafer (tilting) has to be considered as well. From experimental data, an etch profile angle deviation of 8 μm across the wafer has been measured (Fig. 7). The overlay error caused by tilting was corrected by optimization and adjustment of the stepper offset parameters. All measurements of back to front side misalignment were performed with the EVG®40NT automated measurement system

  19. YieldStar: a new metrology platform for advanced lithography control

    NASA Astrophysics Data System (ADS)

    Maas, Jos; Ebert, Martin; Bhattacharyya, Kaustuve; Cramer, Hugo; Becht, Arthur; Keij, Stefan; Plug, Reinder; Fuchs, Andreas; Kubis, Michael; Hoogenboom, Tom; Vaenkatesan, Vidya

    2011-03-01

    As leading edge lithography is moving to 2x-nm design rules, lithography control complements resolution as one of the main drivers and enablers to meet the very stringent overlay, focus and CD requirements. As part of ASML's holistic lithography roadmap, ASML is developing several application-specific optimization and control applications, such as LithoTuner Pattern Matcher and BaseLiner. These applications are all explicitly designed to improve the scanner process window (overlay, focus, CDU and matching). All these applications have in common that they require vast amounts of precise, accurate and process robust wafer data (either taken on product stacks or on so-called monitor wafers). To provide such essential data in a cost-effective manner, ASML developed a metrology platform, called YieldStar. This platform is based on an angle-resolved high-NA scatterometer. It is versatile, as YieldStar's sensor can measure overlay, CD and focus in a single measurement. Thanks to its high speed, large amounts of measurements can be quickly collected. In this paper the latest generation YieldStar is presented, the so-called 200 platform. This YieldStar 200 can be used in a stand-alone configuration (S-200) or as an integrated module in a lithography track (T-200). First overlay results show good TMU results without comprising speed. Furthermore, data is shown that demonstrate YieldStar's capability to reconstruct 3D CD patterns as well.

  20. Lithography equipment

    NASA Astrophysics Data System (ADS)

    Levinson, Harry J.

    1996-07-01

    Until recently, lithography capability evolved consistently with Moore's law. It appears that semiconductor manufacturers are now deviating from Moore's law, which has implications for lithography equipment. DUV lithography is moving into production in a mix-and-match environment. Step- and-scan technology is the wave of the near-future, as a way to contend with the difficulty of manufacturing wide-field lenses. Resist processing equipment will undergo few fundamental changes, but will often be integrated with steppers, particularly for DUV applications. Metrology is being stretched beyond its limits for technologies below 250 nm. The move is on to 300 m diameter wafers, and 193 nm lithography is under consideration.

  1. Advanced electric-field scanning probe lithography on molecular resist using active cantilever

    NASA Astrophysics Data System (ADS)

    Kaestner, Marcus; Aydogan, Cemal; Ivanov, Tzvetan; Ahmad, Ahmad; Angelov, Tihomir; Reum, Alexander; Ishchuk, Valentyn; Krivoshapkina, Yana; Hofer, Manuel; Lenk, Steve; Atanasov, Ivaylo; Holz, Mathias; Rangelow, Ivo W.

    2015-07-01

    The routine "on demand" fabrication of features smaller than 10 nm opens up new possibilities for the realization of many devices. Driven by the thermally actuated piezoresistive cantilever technology, we have developed a prototype of a scanning probe lithography (SPL) platform which is able to image, inspect, align, and pattern features down to the single digit nanoregime. Here, we present examples of practical applications of the previously published electric-field based current-controlled scanning probe lithography. In particular, individual patterning tests are carried out on calixarene by using our developed table-top SPL system. We have demonstrated the application of a step-and-repeat SPL method including optical as well as atomic force microscopy-based navigation and alignment. The closed-loop lithography scheme was applied to sequentially write positive and negative tone features. Due to the integrated unique combination of read-write cycling, each single feature is aligned separately with the highest precision and inspected after patterning. This routine was applied to create a pattern step by step. Finally, we have demonstrated the patterning over larger areas, over existing topography, and the practical applicability of the SPL processes for lithography down to 13-nm pitch patterns. To enhance the throughput capability variable beam diameter electric field, current-controlled SPL is briefly discussed.

  2. Workshop on compact storage ring technology: applications to lithography

    SciTech Connect

    Not Available

    1986-05-30

    Project planning in the area of x-ray lithography is discussed. Three technologies that are emphasized are the light source, the lithographic technology, and masking technology. The needs of the semiconductor industry in the lithography area during the next decade are discussed, particularly as regards large scale production of high density dynamic random access memory devices. Storage ring parameters and an overall exposure tool for x-ray lithography are addressed. Competition in this area of technology from Germany and Japan is discussed briefly. The design of a storage ring is considered, including lattice design, magnets, and beam injection systems. (LEW)

  3. Advanced light source technologies that enable high-volume manufacturing of DUV lithography extensions

    NASA Astrophysics Data System (ADS)

    Cacouris, Theodore; Rao, Rajasekhar; Rokitski, Rostislav; Jiang, Rui; Melchior, John; Burfeindt, Bernd; O'Brien, Kevin

    2012-03-01

    Deep UV (DUV) lithography is being applied to pattern increasingly finer geometries, leading to solutions like double- and multiple-patterning. Such process complexities lead to higher costs due to the increasing number of steps required to produce the desired results. One of the consequences is that the lithography equipment needs to provide higher operating efficiencies to minimize the cost increases, especially for producers of memory devices that experience a rapid decline in sales prices of these products over time. In addition to having introduced higher power 193nm light sources to enable higher throughput, we previously described technologies that also enable: higher tool availability via advanced discharge chamber gas management algorithms; improved process monitoring via enhanced on-board beam metrology; and increased depth of focus (DOF) via light source bandwidth modulation. In this paper we will report on the field performance of these technologies with data that supports the desired improvements in on-wafer performance and operational efficiencies.

  4. Fabrication of synthetic diffractive elements using advanced matrix laser lithography

    NASA Astrophysics Data System (ADS)

    Škereň, M.; Svoboda, J.; Květoň, M.; Fiala, P.

    2013-02-01

    In this paper we present a matrix laser writing device based on a demagnified projection of a micro-structure from a computer driven spatial light modulator. The device is capable of writing completely aperiodic micro-structures with resolution higher than 200 000 DPI. An optical system is combined with ultra high precision piezoelectric stages with an elementary step ~ 4 nm. The device operates in a normal environment, which significantly decreases the costs compared to competitive technologies. Simultaneously, large areas can be exposed up to 100 cm2. The capabilities of the constructed device will be demonstrated on particular elements fabricated for real applications. The optical document security is the first interesting field, where the synthetic image holograms are often combined with sophisticated aperiodic micro-structures. The proposed technology can easily write simple micro-gratings creating the color and kinetic visual effects, but also the diffractive cryptograms, waveguide couplers, and other structures recently used in the field of optical security. A general beam shaping elements and special photonic micro-structures are another important applications which will be discussed in this paper.

  5. The study of lithography conditions to use advanced resist performance properly

    NASA Astrophysics Data System (ADS)

    Yang, Zhengkai; Wang, Wuping; Chen, Quan; Aoyama, Hajime; Takemasa, Kengo; Sei, Toshihiko; Miyazawa, Tami; Matsuyama, Tomoyuki; Shao, Chun

    2015-03-01

    Correlation of resist modeling of printed features with lithographic data is a necessary part of developing new lithographic processes. Recently, we have found a case in which the most advanced resist types sometimes show better behavior than expectations from optical simulation in terms of dose latitude, MEEF (mask error enhancement factor), and even CD variation through different pitches. This superior resist performance may allow greater margin for error in each component, such as mask, scanner, and metrology in very low-k1 lithography. On the other hand, since the resist pattern CD for the most advanced resist is very much different from the prediction of optical simulation, it is a challenge to build OPC models using the exposure result with the resist. In order to solve this issue, we have tried to use several litho parameters to reduce the gap between optical simulation and resist CDs for OPC modeling. In this paper we discuss the effect of the parameters to reduce the gap between optical model and actual resist behavior with keeping superior performance as much as possible. The method we mention may be a key to use the most advanced resist in near future. As a result the life of ArF immersion lithography in the critical layer would be extended than we expect today.

  6. Advanced 0.3-NA EUV lithography capabilities at the ALS

    SciTech Connect

    Naulleau, Patrick; Anderson, Erik; Dean, Kim; Denham, Paul; Goldberg, Kenneth A.; Hoef, Brian; Jackson, Keith

    2005-07-07

    For volume nanoelectronics production using Extreme ultraviolet (EUV) lithography [1] to become a reality around the year 2011, advanced EUV research tools are required today. Microfield exposure tools have played a vital role in the early development of EUV lithography [2-4] concentrating on numerical apertures (NA) of 0.2 and smaller. Expected to enter production at the 32-nm node with NAs of 0.25, EUV can no longer rely on these early research tools to provide relevant learning. To overcome this problem, a new generation of microfield exposure tools, operating at an NA of 0.3 have been developed [5-8]. Like their predecessors, these tools trade off field size and speed for greatly reduced complexity. One of these tools is implemented at Lawrence Berkeley National Laboratory's Advanced Light Source synchrotron radiation facility. This tool gets around the problem of the intrinsically high coherence of the synchrotron source [9,10] by using an active illuminator scheme [11]. Here we describe recent printing results obtained from the Berkeley EUV exposure tool. Limited by the availability of ultra-high resolution chemically amplified resists, present resolution limits are approximately 32 nm for equal lines and spaces and 27 nm for semi-isolated lines.

  7. Advanced in-situ electron-beam lithography for deterministic nanophotonic device processing.

    PubMed

    Kaganskiy, Arsenty; Gschrey, Manuel; Schlehahn, Alexander; Schmidt, Ronny; Schulze, Jan-Hindrik; Heindel, Tobias; Strittmatter, André; Rodt, Sven; Reitzenstein, Stephan

    2015-07-01

    We report on an advanced in-situ electron-beam lithography technique based on high-resolution cathodoluminescence (CL) spectroscopy at low temperatures. The technique has been developed for the deterministic fabrication and quantitative evaluation of nanophotonic structures. It is of particular interest for the realization and optimization of non-classical light sources which require the pre-selection of single quantum dots (QDs) with very specific emission features. The two-step electron-beam lithography process comprises (a) the detailed optical study and selection of target QDs by means of CL-spectroscopy and (b) the precise retrieval of the locations and integration of target QDs into lithographically defined nanostructures. Our technology platform allows for a detailed pre-process determination of important optical and quantum optical properties of the QDs, such as the emission energies of excitonic complexes, the excitonic fine-structure splitting, the carrier dynamics, and the quantum nature of emission. In addition, it enables a direct and precise comparison of the optical properties of a single QD before and after integration which is very beneficial for the quantitative evaluation of cavity-enhanced quantum devices. PMID:26233395

  8. Advanced in-situ electron-beam lithography for deterministic nanophotonic device processing

    NASA Astrophysics Data System (ADS)

    Kaganskiy, Arsenty; Gschrey, Manuel; Schlehahn, Alexander; Schmidt, Ronny; Schulze, Jan-Hindrik; Heindel, Tobias; Strittmatter, André; Rodt, Sven; Reitzenstein, Stephan

    2015-07-01

    We report on an advanced in-situ electron-beam lithography technique based on high-resolution cathodoluminescence (CL) spectroscopy at low temperatures. The technique has been developed for the deterministic fabrication and quantitative evaluation of nanophotonic structures. It is of particular interest for the realization and optimization of non-classical light sources which require the pre-selection of single quantum dots (QDs) with very specific emission features. The two-step electron-beam lithography process comprises (a) the detailed optical study and selection of target QDs by means of CL-spectroscopy and (b) the precise retrieval of the locations and integration of target QDs into lithographically defined nanostructures. Our technology platform allows for a detailed pre-process determination of important optical and quantum optical properties of the QDs, such as the emission energies of excitonic complexes, the excitonic fine-structure splitting, the carrier dynamics, and the quantum nature of emission. In addition, it enables a direct and precise comparison of the optical properties of a single QD before and after integration which is very beneficial for the quantitative evaluation of cavity-enhanced quantum devices.

  9. Advanced in-situ electron-beam lithography for deterministic nanophotonic device processing

    SciTech Connect

    Kaganskiy, Arsenty; Gschrey, Manuel; Schlehahn, Alexander; Schmidt, Ronny; Schulze, Jan-Hindrik; Heindel, Tobias; Rodt, Sven Reitzenstein, Stephan; Strittmatter, André

    2015-07-15

    We report on an advanced in-situ electron-beam lithography technique based on high-resolution cathodoluminescence (CL) spectroscopy at low temperatures. The technique has been developed for the deterministic fabrication and quantitative evaluation of nanophotonic structures. It is of particular interest for the realization and optimization of non-classical light sources which require the pre-selection of single quantum dots (QDs) with very specific emission features. The two-step electron-beam lithography process comprises (a) the detailed optical study and selection of target QDs by means of CL-spectroscopy and (b) the precise retrieval of the locations and integration of target QDs into lithographically defined nanostructures. Our technology platform allows for a detailed pre-process determination of important optical and quantum optical properties of the QDs, such as the emission energies of excitonic complexes, the excitonic fine-structure splitting, the carrier dynamics, and the quantum nature of emission. In addition, it enables a direct and precise comparison of the optical properties of a single QD before and after integration which is very beneficial for the quantitative evaluation of cavity-enhanced quantum devices.

  10. Capillary force lithography: the versatility of this facile approach in developing nanoscale applications

    NASA Astrophysics Data System (ADS)

    Ho, Dominic; Zou, Jianli; Zdyrko, Bogdan; Iyer, K. Swaminathan; Luzinov, Igor

    2014-12-01

    Since its inception as a simple, low cost alternative to more complicated lithographic techniques such as electron-beam and dip-pen lithography, capillary force lithography (CFL) has developed into a versatile tool to form sub-100 nm patterns. Utilizing the concept of a polymer melt, structures and devices generated by the technique have been used in applications varying from surfaces regulating cell growth to gas sensing. In this review, we discuss various CFL methodologies which have evolved, their application in both biological and non-biological research, and finally a brief outlook in areas of research where CFL is destined to make an enormous impact in the near future.

  11. Algorithm of lithography advanced process control system for high-mix low-volume products

    NASA Astrophysics Data System (ADS)

    Kawamura, Eiichi

    2007-03-01

    We have proposed a new algorithm of Lithography Advanced Process Control System for high-mix low-volume production. This algorithm works well for 1 st lot of a new device input into the production line, or 1st lot of an existing device to be exposed with a newly introduced exposure tool. The algorithm consists of 1) searching the most suitable trend of other similar devices referring to an attribute table and a look-up table for priority of searching order, and 2) correction of differences between the two devices for deciding optimum exposure conditions. The attribute table categorizes same layers across different devices and similar layers within a device. Look-up table describes the order of searching keys. To attain cost-effective process control system, information useful to compensate referred trend is compiled into the database.

  12. Application of SMIF isolation to lithography processes for contamination control

    NASA Astrophysics Data System (ADS)

    Zhu, Sheng-Bai

    2001-08-01

    Contamination control is particularly important in lithography processes because pattern defects are converted to wafers after each exposure. Contamination, by definition, is undesired matter or energy, which causes product defects or process instabilities, and, consequently, reduces yield and reliability. In lithography processes, particles, condensable hydrocarbosn, base molecules, moisture, and static electricity are examples of contaminants. Particles are inert minute objects, which interfere with the proper formation of circuit features. Condensable hydrocarbosn may cause optics hazing which reduces image homogeneity and energy transmission. Some Chemically Amplified Resists (CAR) are susceptible to molecular base contamination, resulting in image degradation such as T-topping. Moisture can affect the characteristics of photoresist, destabilizing photo-exposure and development processes. In combination with water, amine containing photoresist strippers can form hydroxyl ions that can attack aluminum and aluminum-copper alloys. Charged surfaces can tract and hold contaminants of opposite polarity. In case the electrical field exceeds the dielectric strength, ESD event occurs, often accompanied with damage of reticles, masks, or wafer circuits. With SMIF isolation technologies, yield loss due to defects and/or instabilities is minimized. Reticles, masks, and wafers are isolated form contamination sources through hermetic seal, in conjunction with particle/chemical filtration, and static shielding. Pressurization, inert gas purge, chemical absorbents, and electric grounding or air ionization are techniques of removing contaminants from the critical areas. For best performance, adequate selection of construction materials is critical. This paper discusses impacts of contamination on lithography processes and the possibility of solving such problems using SMIF isolation techniques. Theoretical models are developed and experimental data are presented.

  13. Nanofabrication of Optical Elements for SXR and EUV Applications: Ion Beam Lithography as a New Approach

    NASA Astrophysics Data System (ADS)

    Lenz, J.; Krupp, N.; Wilhein, T.; Irsen, S.

    2011-09-01

    Diffractive optical elements are important components for applications in soft x-ray and extreme ultraviolet radiation. At present, the standard fabrication method for such optics is based on electron beam lithography followed by nanostructuring. This requires a series of complex processes including exposure, reactive ion-etching, and electro-plating. We report on experiments showing the single-step fabrication of such elements using ion beam lithography. Both transmission and reflection gratings were fabricated and successfully implemented as spectrometers at laboratory soft x-ray sources. Additionally, first steps toward zone plate fabrication are described.

  14. Electron-beam lithography for micro and nano-optical applications

    NASA Technical Reports Server (NTRS)

    Wilson, Daniel W.; Muller, Richard E.; Echternach, Pierre M.

    2005-01-01

    Direct-write electron-beam lithography has proven to be a powerful technique for fabricating a variety of micro- and nano-optical devices. Binary E-beam lithography is the workhorse technique for fabricating optical devices that require complicated precision nano-scale features. We describe a bi-layer resist system and virtual-mark height measurement for improving the reliability of fabricating binary patterns. Analog E-beam lithography is a newer technique that has found significant application in the fabrication of diffractive optical elements. We describe our techniques for fabricating analog surface-relief profiles in E-beam resist, including some discussion regarding overcoming the problems of resist heating and charging. We also describe a multiple-field-size exposure scheme for suppression of field-stitch induced ghost diffraction orders produced by blazed diffraction gratings on non-flat substrates.

  15. Mask characterization for critical dimension uniformity budget breakdown in advanced extreme ultraviolet lithography

    NASA Astrophysics Data System (ADS)

    Nikolsky, Peter; Strolenberg, Chris; Nielsen, Rasmus; Nooitgedacht, Tjitte; Davydova, Natalia; Yang, Greg; Lee, Shawn; Park, Chang-Min; Kim, Insung; Yeo, Jeong-Ho

    2013-04-01

    As the International Technology Roadmap for Semiconductors critical dimension uniformity (CDU) specification shrinks, semiconductor companies need to maintain a high yield of good wafers per day and high performance (and hence market value) of finished products. This cannot be achieved without continuous analysis and improvement of on-product CDU as one of the main drivers for process control and optimization with better understanding of main contributors from the litho cluster: mask, process, metrology and scanner. We will demonstrate a study of mask CDU characterization and its impact on CDU Budget Breakdown (CDU BB) performed for advanced extreme ultraviolet (EUV) lithography with 1D (dense lines) and 2D (dense contacts) feature cases. We will show that this CDU contributor is one of the main differentiators between well-known ArFi and new EUV CDU budgeting principles. We found that reticle contribution to intrafield CDU should be characterized in a specific way: mask absorber thickness fingerprints play a role comparable with reticle CDU in the total reticle part of the CDU budget. Wafer CD fingerprints, introduced by this contributor, may or may not compensate variations of mask CDs and hence influence on total mask impact on intrafield CDU at the wafer level. This will be shown on 1D and 2D feature examples. Mask stack reflectivity variations should also be taken into account: these fingerprints have visible impact on intrafield CDs at the wafer level and should be considered as another contributor to the reticle part of EUV CDU budget. We also observed mask error enhancement factor (MEEF) through field fingerprints in the studied EUV cases. Variations of MEEF may play a role towards the total intrafield CDU and may need to be taken into account for EUV lithography. We characterized MEEF-through-field for the reviewed features, with results herein, but further analysis of this phenomenon is required. This comprehensive approach to quantifying the mask part of

  16. Industrial strength lithography APC

    NASA Astrophysics Data System (ADS)

    Ausschnitt, Christopher P.; Barker, Brian; Muth, William A.; Postiglione, Marc; Walentosky, Thomas

    2003-06-01

    Fully automated semiconductor manufacturing, becoming a reality with the ramping of 300mm fabricators throughout the world, demands the integration of advanced process control (APC). APC is particularly critical for the lithography sector, whose performance correlates to yield and whose productivity often gates the line. We describe the implementation of a comprehensive lithography APC system at the IBM Center for Nanoelectronics, a 300mm manufacturing and development facility. The base lithography APC function encompasses closed-loop run-to-run control of exposure tool inputs to sustain the overlay and critical dimension outputs consistent with product specifications. Automation demands that no decision regarding the appropriate exposure tool run-time settings be left to human judgment. For each lot, the APC system provides optimum settings based on existing data derived from pertinent process streams. In the case where insufficient prior data exists, the APC system either invokes the appropriate combination of send ahead processing and/or pre-determined defaults. We give specific examples of the application of APC to stitched field and dose control, and quantify its technical benefits. Field matching < 0.1 ppm and critical dimension control < 2.5% is achieved among multiple exposure tools and masks.

  17. Applications of laser lithography on oxide film to titanium micromachining

    NASA Astrophysics Data System (ADS)

    Chauvy, P.-F.; Hoffmann, P.; Landolt, D.

    2003-03-01

    Due to its good biocompatibility titanium is widely used for dental and orthopaedics implants and for biomedical microsystems. For these applications one needs specific micromachining methods. A new four-step method for electrochemical micromachining of titanium is presented here, which implies anodic oxidation, Excimer laser sensitising irradiation, anodic dissolution, and ultrasonic cleaning. The method is applied to the fabrication of two 3D model structures, surface structuring of a cylinder and machining of a complex two-level architecture. The absence of debris and of a heat affected zone as well as the resulting surface smoothness are the main advantages of the process. Ways to improve the still limited processing speed are discussed with regards to potential applications.

  18. Optical lithography for nanotechnology

    NASA Astrophysics Data System (ADS)

    Flagello, Donis G.; Arnold, Bill

    2006-09-01

    Optical lithography is continually evolving to meet the ever demanding requirements of the micro - and nano- technology communities. Since the optical exposure systems used in lithography are some of the most advanced and complex optical instruments ever built, they involve ever more complex illuminator designs, nearly aberration free lenses, and hyper numerical apertures approaching unity and beyond. Fortunately, the lithography community has risen to the challenge by devising many inventive optical systems and various methods to use and optimize exposure systems. The recent advancement of water immersion technology into lithography for 193nm wavelengths has allowed the numerical aperture (NA) of lithographic lenses to exceed 1.0 or a hyper-NA region. This allows resolution limits to extend to the 45nm node and beyond with NA>1.3. At these extreme NAs, the imaging within the photoresist is accomplished by not only using water immersion but also using polarized light lithography. This paper will review the current state-of-the-art in immersion, hyper-NA lithography. We show the latest results and discuss the various phenomena that may arise using these systems. Furthermore, we show some of the advanced image optimization techniques that allow lithographic printing at the physical limits of resolution. In addition, we show that the future of optical lithography is likely to go well beyond the 30nm regime using advancements in 193nm double-patterning technology and/or the use of extreme ultra-violet (EUV) optical systems.

  19. Advanced Welding Applications

    NASA Technical Reports Server (NTRS)

    Ding, Robert J.

    2010-01-01

    Some of the applications of advanced welding techniques are shown in this poster presentation. Included are brief explanations of the use on the Ares I and Ares V launch vehicle and on the Space Shuttle Launch vehicle. Also included are microstructural views from four advanced welding techniques: Variable Polarity Plasma Arc (VPPA) weld (fusion), self-reacting friction stir welding (SR-FSW), conventional FSW, and Tube Socket Weld (TSW) on aluminum.

  20. Advanced patterning approaches based on negative-tone development (NTD) process for further extension of 193nm immersion lithography

    NASA Astrophysics Data System (ADS)

    Shirakawa, Michihiro; Inoue, Naoki; Furutani, Hajime; Yamamoto, Kei; Goto, Akiyoshi; Fujita, Mitsuhiro

    2015-03-01

    Two approaches which achieve the further evolution of NTD (Negative Tone Development) process are shown in this article. One is ACCEL (Advanced Chemical Contrast Enhancement Layer) process that can improve the lithography performance and the other is DTD (Dual Tone Development) process that can shrink patterning pitch below the limit of single exposure process. ACCEL is an additionally provided layer which is coated on a surface of NTD resist film before exposure and removed by NTD developer. ACCEL can enhance the acid distribution and dissolution contrast of the NTD resist. In fact, lithography performances such as exposure latitude (EL) and DOF improved dramatically by applying ACCEL compared to the NTD resist without ACCEL. We consider that suppression of excessive acid diffusion and material transfer between the resist layer and the ACCEL layer are the causes of the contrast enhancement. DTD process is one of the simplest pitch shrink method which is achieved by repeating PTD and NTD process. Feasibility study of DTD patterning has been demonstrated so far. However, Exposure latitude margin and CDU performance were not sufficient for applying DTD to HVM. We developed the novel DTD specific resist under a new concept, and 32 nm half pitch (hp) contact hole (CH) pattern was successfully formed with enough margins. DTD line and space (L/S) patterning are also demonstrated and 24 nm hp L/S pattern can be resolved. k1 factors of DTD CH and L/S patterns reach to 0.20 and 0.15, respectively.

  1. A hybrid mask mould lithography scheme and its application in nanoscale organic thin film transistors

    NASA Astrophysics Data System (ADS)

    Cheng, Xing; Li, Dawen; Guo, L. Jay

    2006-02-01

    Nanoimprint lithography (NIL) has stimulated great interest in both academic research and industrial development due to its high resolution, high throughput and low cost advantages. Though NIL has been demonstrated to be very successful in replicating nanoscale features, it also has its limitations as a general lithography technique. Its fundamental moulding characteristics (i.e. physically displacing polymer materials) frequently lead to pattern defects when replicating arbitrary patterns, especially patterns with broad size distribution. To solve this problem, we have developed a combined nanoimprint and photolithography technique that uses a hybrid mould to achieve good pattern definitions. In this work, we applied this technique to fabricate finger-shaped nanoelectrodes, and demonstrated nanoscale pentacene organic thin film transistors (OTFTs). Methods of the hybrid mask-mould (HMM) fabrication and results on the device electrical characteristics are provided. With combined advantages of both photolithography and NIL, and the applicability to general nanoscale device and system fabrication, this method can become a valuable choice for low cost mass production of micro- and nanoscale structures, devices and systems.

  2. Step and flash imprint lithography template fabrication for emerging market applications

    NASA Astrophysics Data System (ADS)

    Resnick, Douglas J.; Schmid, Gerard; Miller, Mike; Doyle, Gary; Jones, Chris; LaBrake, Dwayne

    2007-05-01

    The Step and Flash Imprint Lithography (S-FIL TM) process uses field-to-field drop dispensing of UV curable liquids for step and repeat patterning for applications where high-resolution mix-and-match overlay is desired. Several applications, including patterned media, photonic crystals and wire grid polarizers, are better served by a patterning process that prints the full wafer since alignment requirements are not so stringent. In this paper, a methodology for creating high resolution thin templates for full wafer (or disk) imprinting is described. The methods have been applied toward the imprinting of both photonic crystal and patterned media devices using a large area printing tool developed around the S-FIL process.

  3. The DARPA compact superconducting x-ray lithography source features. [Defense Advanced Research Projects Agency (DARPA)

    SciTech Connect

    Heese, R. ); Kalsi, S. ); Leung, E. . Space Systems Div.)

    1991-01-01

    Under DARPA sponsorship, a compact Superconducting X-ray Lithography Source (SXLS) is being designed and built by the Brookhaven National Laboratory (BNL) with industry participation from Grumman Corporation and General Dynamics. This source is optimized for lithography work for sub-micron high density computer chips, and is about the size of a billiard table (1.5 m {times} 4.0 m). The machine has a racetrack configuration with two 180{degree} bending magnets being designed and built by General Dynamics under a subcontract with Grumman Corporation. The machine will have 18 photon ports which would deliver light peaked at a wave length of 10 Angstroms. Grumman is commercializing the SXLS device and plans to book orders for delivery of industrialized SXLS (ISXLS) versions in 1995. This paper will describe the major features of this device. The commercial machine will be equipped with a fully automated user-friendly control systems, major features of which are already working on a compact warm dipole ring at BNL. This ring has normal dipole magnets with dimensions identical to the SXLS device, and has been successfully commissioned. 4 figs., 1 tab.

  4. High refractive index Fresnel lens on a fiber fabricated by nanoimprint lithography for immersion applications

    NASA Astrophysics Data System (ADS)

    Koshelev, Alexander; Calafiore, Giuseppe; Piña-Hernandez, Carlos; Allen, Frances I.; Dhuey, Scott; Sassolini, Simone; Wong, Edward; Lum, Paul; Munechika, Keiko; Cabrini, Stefano

    2016-08-01

    In this Letter we present a Fresnel lens fabricated on the end of an optical fiber. The lens is fabricated using nanoimprint lithography of a functional high refractive index material, which is suitable for mass production. The main advantage of the presented Fresnel lens compared to a conventional fiber lens is its high refractive index (n=1.69), which enables efficient light focusing even inside other media such as water or adhesive. Measurement of the lens performance in an immersion liquid (n=1.51) shows a near diffraction limited focal spot of 810 nm in diameter at the 1/e2 intensity level for a wavelength of 660 nm. Applications of such fiber lenses include integrated optics, optical trapping and fiber probes.

  5. High refractive index Fresnel lens on a fiber fabricated by nanoimprint lithography for immersion applications.

    PubMed

    Koshelev, Alexander; Calafiore, Giuseppe; Piña-Hernandez, Carlos; Allen, Frances I; Dhuey, Scott; Sassolini, Simone; Wong, Edward; Lum, Paul; Munechika, Keiko; Cabrini, Stefano

    2016-08-01

    In this Letter, we present a Fresnel lens fabricated on the end of an optical fiber. The lens is fabricated using nanoimprint lithography of a functional high refractive index material, which is suitable for mass production. The main advantage of the presented Fresnel lens compared to a conventional fiber lens is its high refractive index (n=1.68), which enables efficient light focusing even inside other media, such as water or an adhesive. Measurement of the lens performance in an immersion liquid (n=1.51) shows a near diffraction limited focal spot of 810 nm in diameter at the 1/e2 intensity level for a wavelength of 660 nm. Applications of such fiber lenses include integrated optics, optical trapping, and fiber probes. PMID:27472584

  6. Advanced mask technique to improve bit line CD uniformity of 90 nm node flash memory in low-k1 lithography

    NASA Astrophysics Data System (ADS)

    Kim, Jong-doo; Choi, Jae-young; Kim, Jea-hee; Han, Jae-won

    2008-10-01

    As devices size move toward 90nm technology node or below, defining uniform bit line CD of flash devices is one of the most challenging features to print in KrF lithography. There are two principal difficulties in defining bit line on wafer. One is insufficient process margin besides poor resolution compared with ArF lithography. The other is that asymmetric bit line should be made for OPC(Optical Proximity Correction) modeling. Therefore advanced ArF lithography scanner should be used for define bit line with RETs (Resolution Enhancement Techniques) such as immersion lithography, OPC, PSM(Phase Shift Mask), high NA(Numerical Aperture), OAI(Off-Axis Illumination), SRAF(Sub-resolution Assistant Feature), and mask biasing.. Like this, ArF lithography propose the method of enhancing resolution, however, we must spend an enormous amount of CoC(cost of ownership) to utilize ArF photolithography process than KrF. In this paper, we suggest method to improve of bit line CD uniformity, patterned by KrF lithographic process in 90nm sFlash(stand alone Flash) devices. We applied new scheme of mask manufacturing, which is able to realize 2 different types of mask, binary and phase-shift, into one plate. Finally, we could get the more uniform bit lines and we expect to get more stable properties then before applying this technique.

  7. Nanoimprint lithography for microfluidics manufacturing

    NASA Astrophysics Data System (ADS)

    Kreindl, Gerald; Matthias, Thorsten

    2013-12-01

    The history of imprint technology as lithography method for pattern replication can be traced back to 1970's but the most significant progress has been made by the research group of S. Chou in the 1990's. Since then, it has become a popular technique with a rapidly growing interest from both research and industrial sides and a variety of new approaches have been proposed along the mainstream scientific advances. Nanoimprint lithography (NIL) is a novel method for the fabrication of micro/nanometer scale patterns with low cost, high throughput and high resolution. Unlike traditional optical lithographic approaches, which create pattern through the use of photons or electrons to modify the chemical and physical properties of the resist, NIL relies on direct mechanical deformation of the resist and can therefore achieve resolutions beyond the limitations set by light diffraction or beam scattering that are encountered in conventional lithographic techniques. The ability to fabricate structures from the micro- to the nanoscale with high precision in a wide variety of materials is of crucial importance to the advancement of micro- and nanotechnology and the biotech- sciences as a whole and will be discussed in this paper. Nanoimprinting can not only create resist patterns, as in lithography, but can also imprint functional device structures in various polymers, which can lead to a wide range of applications in electronics, photonics, data storage, and biotechnology.

  8. Improved Ru/Si multilayer reflective coatings for advanced extreme-ultraviolet lithography photomasks

    NASA Astrophysics Data System (ADS)

    Wood, Obert; Wong, Keith; Parks, Valentin; Kearney, Patrick; Meyer-Ilse, Julia; Luong, Vu; Philipsen, Vicky; Faheem, Mohammad; Liang, Yifan; Kumar, Ajay; Chen, Esther; Bennett, Corbin; Fu, Bianzhu; Gribelyuk, Michael; Zhao, Wayne; Mangat, Pawitter; Van der Heide, Paul

    2016-03-01

    Extreme ultraviolet (EUV) lithography with reflective photomasks continues to be a potential patterning technology for high volume manufacturing at the 7 nm technology node and beyond. EUV photomasks with alternative materials to the commonly used Mo/Si multilayer (ML) reflector and patterned Ta-based absorber (both of which are known to require shadow effect corrections and lead to large through-focus pattern placement errors) are being actively explored. Because the reflective bandwidth of a Ru/Si ML is significantly wider than the reflective bandwidth of a Mo/Si ML and the effective reflectance plane in Ru/Si is closer to the ML surface, Ru/Si ML coatings may be viable alternatives to the Mo/Si ML coatings that are commercially available today because they will lead to smaller mask 3D effects. In this paper, increases in the peak reflectivity and the reflective bandwidth of Ru/Si ML reflectors by using B4C interlayers to improve the Ru-Si interfaces are discussed. The conclusions of this paper are supported with the results of both experimental measurements and rigorous simulations.

  9. Beamline and exposure station for deep x-ray lithography at the Advanced Photon Source

    SciTech Connect

    Lai, B.; Mancini, D.C.; Yun, W.; Gluskin, E.

    1996-12-31

    APS is a third-generation synchrotron radiation source. With an x-ray energy of 19.5 keV and highly collimated beam (<0.1 mrad), APS is well suited for producing high-aspect-ratio microstructures in thick resist films (> 1 mm) using deep x-ray lithography (DXRL). The 2-BM beamline was constructed and will be used for DXRL at APS. Selection of appropriate x-ray energy range is done through a variable-angle mirror and various filters in the beamline. At the exposure station, the beam size will be 100(H) x 5(V) mm{sup 2}. Uniform exposure will be achieved by a high-speed (100 mm/sec) vertical scanner, which allows precise angular ({approximately}0.1 mrad) and positional (< 1 {mu}m) control of the sample, allowing full use of the highly collimated beam for lateral accuracy and control of sidewall slopes during exposure of thick resists, as well as generation of conicals and other profiles. For 1-mm-thick PMMA, a 100 x 25 mm{sup 2} area can be fully exposed in about 1/2 hr, while even 10-mm-thick PMMA will require only 2-3 hours.

  10. Novel conformal organic antireflective coatings for advanced I-line lithography

    NASA Astrophysics Data System (ADS)

    Deshpande, Shreeram V.; Nowak, Kelly A.; Fowler, Shelly; Williams, Paul; Arjona, Mikko

    2001-08-01

    Flash memory chips are playing a critical role in semiconductor devices due to increased popularity of hand held electronic communication devices such as cell phones and PDAs (personal Digital Assistants). Flash memory offers two primary advantages in semiconductor devices. First, it offers flexibility of in-circuit programming capability to reduce the loss from programming errors and to significantly reduce commercialization time to market for new devices. Second, flash memory has a double density memory capability through stacked gate structures which increases the memory capability and thus saves significantly on chip real estate. However, due to stacked gate structures the requirements for manufacturing of flash memory devices are significantly different from traditional memory devices. Stacked gate structures also offer unique challenges to lithographic patterning materials such as Bottom Anti-Reflective Coating (BARC) compositions used to achieve CD control and to minimize standing wave effect in photolithography. To be applicable in flash memory manufacturing a BARC should form a conformal coating on high topography of stacked gate features as well as provide the normal anti-reflection properties for CD control. In this paper we report on a new highly conformal advanced i-line BARC for use in design and manufacture of flash memory devices. Conformal BARCs being significantly thinner in trenches than the planarizing BARCs offer the advantage of reducing BARC overetch and thus minimizing resist thickness loss.

  11. EUV lithography

    NASA Astrophysics Data System (ADS)

    Kemp, Kevin; Wurm, Stefan

    2006-10-01

    Extreme ultraviolet lithography (EUVL) technology and infrastructure development has made excellent progress over the past several years, and tool suppliers are delivering alpha tools to customers. However, requirements in source, mask, optics, and resist are very challenging, and significant development efforts are still needed to support beta and production-level performance. Some of the important advances in the past few years include increased source output power, tool and optics system development and integration, and mask blank defect reduction. For example, source power has increased to levels approaching specification, but reliable source operation at these power levels has yet to be fully demonstrated. Significant efforts are also needed to achieve the resolution, line width roughness, and photospeed requirements for EUV photoresists. Cost of ownership and extendibility to future nodes are key factors in determining the outlook for the manufacturing insertion of EUVL. Since wafer throughput is a critical cost factor, source power, resist sensitivity, and system design all need to be carefully considered. However, if the technical and business challenges can be met, then EUVL will be the likely technology of choice for semiconductor manufacturing at the 32, 22, 16 and 11 nm half-pitch nodes. To cite this article: K. Kemp, S. Wurm, C. R. Physique 7 (2006).

  12. Control of zinc oxide nanowire array properties with electron-beam lithography templating for photovoltaic applications

    NASA Astrophysics Data System (ADS)

    Nicaise, Samuel M.; Cheng, Jayce J.; Kiani, Amirreza; Gradečak, Silvija; Berggren, Karl K.

    2015-02-01

    Hydrothermally synthesized zinc oxide nanowire arrays have been used as nanostructured acceptors in emerging photovoltaic (PV) devices. The nanoscale dimensions of such arrays allow for enhanced charge extraction from PV active layers, but the device performance critically depends on the nanowire array pitch and alignment. In this study, we templated hydrothermally-grown ZnO nanowire arrays via high-resolution electron-beam-lithography defined masks, achieving the dual requirements of high-resolution patterning at a pitch of several hundred nanometers, while maintaining hole sizes small enough to control nanowire array morphology. We investigated several process conditions, including the effect of annealing sputtered and spincoated ZnO seed layers on nanowire growth, to optimize array property metrics—branching from individual template holes and off-normal alignment. We found that decreasing template hole size decreased branching prevalence but also reduced alignment. Annealing seed layers typically improved alignment, and sputtered seed layers yielded nanowire arrays superior to spincoated seed layers. We show that these effects arose from variation in the size of the template holes relative to the ZnO grain size in the seed layer. The quantitative control of branching and alignment of the nanowire array that is achieved in this study will open new paths toward engineering more efficient electrodes to increase photocurrent in nanostructured PVs. This control is also applicable to inorganic nanowire growth in general, nanomechanical generators, nanowire transistors, and surface-energy engineering.

  13. Thick SU8 microstructures prepared by broadband UV lithography and the applications in MEMS devices

    NASA Astrophysics Data System (ADS)

    Li, Dong-ling; Wen, Zhi-yu; Shang, Zheng-guo; She, Yin

    2016-05-01

    Thick SU8 microstructures with high aspect ratio and good side wall quality were fabricated by ultraviolet (UV) lithography, and the processing parameters were comprehensively studied. It proves that the adhesion of SU8 on silicon (Si) substrates is influenced by Si-OH on the surface, and can be improved by the HF treatment. Cracks and delamination are caused by large internal stress during fabrication process, and are significantly influenced by soft bake and post-exposure bake processes. The internal stress is reduced by a low post-exposure bake exposure temperature of 85 °C for 40 min. A three-step soft bake enhances the reflowing of SU8 photoresist, and results in uniform surface and less air bubbles. The vertical side wall is obtained with the optimized exposure dose of 800 mJ/cm2 for the thickness of 160 μm. Using the optimized fabrication process combined with a proper structure design, dense SU8 micro pillars are achieved with the aspect ratio of 10 and the taper angle of 89.86°. Finally, some possible applications of SU8 in micro-electromechanical system (MEMS) device are developed and demonstrated.

  14. Control of zinc oxide nanowire array properties with electron-beam lithography templating for photovoltaic applications.

    PubMed

    Nicaise, Samuel M; Cheng, Jayce J; Kiani, Amirreza; Gradečak, Silvija; Berggren, Karl K

    2015-02-20

    Hydrothermally synthesized zinc oxide nanowire arrays have been used as nanostructured acceptors in emerging photovoltaic (PV) devices. The nanoscale dimensions of such arrays allow for enhanced charge extraction from PV active layers, but the device performance critically depends on the nanowire array pitch and alignment. In this study, we templated hydrothermally-grown ZnO nanowire arrays via high-resolution electron-beam-lithography defined masks, achieving the dual requirements of high-resolution patterning at a pitch of several hundred nanometers, while maintaining hole sizes small enough to control nanowire array morphology. We investigated several process conditions, including the effect of annealing sputtered and spincoated ZnO seed layers on nanowire growth, to optimize array property metrics-branching from individual template holes and off-normal alignment. We found that decreasing template hole size decreased branching prevalence but also reduced alignment. Annealing seed layers typically improved alignment, and sputtered seed layers yielded nanowire arrays superior to spincoated seed layers. We show that these effects arose from variation in the size of the template holes relative to the ZnO grain size in the seed layer. The quantitative control of branching and alignment of the nanowire array that is achieved in this study will open new paths toward engineering more efficient electrodes to increase photocurrent in nanostructured PVs. This control is also applicable to inorganic nanowire growth in general, nanomechanical generators, nanowire transistors, and surface-energy engineering. PMID:25642895

  15. Development of Nanosphere Lithography Technique with Enhanced Lithographical Accuracy on Periodic Si Nanostructure for Thin Si Solar Cell Application

    NASA Astrophysics Data System (ADS)

    Choi, Jeayoung

    In this thesis, a novel silica nanosphere (SNS) lithography technique has been developed to offer a fast, cost-effective, and large area applicable nano-lithography approach. The SNS can be easily deposited with a simple spin-coating process after introducing a N,N-dimethyl-formamide (DMF) solvent which can produce a highly close packed SNS monolayer over large silicon (Si) surface area, since DMF offers greatly improved wetting, capillary and convective forces in addition to slow solvent evaporation rate. Since the period and dimension of the surface pattern can be conveniently changed and controlled by introducing a desired size of SNS, and additional SNS size reduction with dry etching process, using SNS for lithography provides a highly effective nano-lithography approach for periodically arrayed nano-/micro-scale surface patterns with a desired dimension and period. Various Si nanostructures ( i.e., nanopillar, nanotip, inverted pyramid, nanohole) are successfully fabricated with the SNS nano-lithography technique by using different etching technique like anisotropic alkaline solution (i.e., KOH) etching, reactive-ion etching (RIE), and metal-assisted chemical etching (MaCE). In this research, computational optical modeling is also introduced to design the Si nanostructure, specifically nanopillars (NPs) with a desired period and dimension. The optical properties of Si NP are calculated with two different optical modeling techniques, which are the rigorous coupled wave analysis (RCWA) and finite-difference time-domain (FDTD) methods. By using these two different optical modeling techniques, the optical properties of Si NPs with different periods and dimensions have been investigated to design ideal Si NP which can be potentially used for thin c-Si solar cell applications. From the results of the computational and experimental work, it was observed that low aspect ratio Si NPs fabricated in a periodic hexagonal array can provide highly enhanced light absorption

  16. Indus-2 X-ray lithography beamline for X-ray optics and material science applications

    SciTech Connect

    Dhamgaye, V. P. Lodha, G. S.

    2014-04-24

    X-ray lithography is an ideal technique by which high aspect ratio and high spatial resolution micro/nano structures are fabricated using X-rays from synchrotron radiation source. The technique has been used for fabricating optics (X-ray, visible and infrared), sensors and actuators, fluidics and photonics. A beamline for X-ray lithography is operational on Indus-2. The beamline offers wide lithographic window from 1-40keV photon energy and wide beam for producing microstructures in polymers upto size ∼100mm × 100mm. X-ray exposures are possible in air, vacuum and He gas environment. The air based exposures enables the X-ray irradiation of resist for lithography and also irradiation of biological and liquid samples.

  17. Fabrication and characterization of nanoelectronic devices for electron beam lithography applications

    NASA Astrophysics Data System (ADS)

    Yang, Xiaojing

    Vertically aligned carbon nanofibers (VACNFs) have shown promise for use as field emission electron sources. Dual-gate field emission structures (triodes) have been fabricated and characterized. The electron beams can be successfully focused in these triodes. These studies show VACNF based field emission devices are promising for electron beam lithography applications. In this thesis, work is continued on triode device investigation. Methods to improve the device fabrication, to understand/optimize the device performance, and to repair defective triodes are presented. Numerical simulation of the triode performance is included. Depth of field (DOF) of these triode structures is calculated by simulation and is determined to be ˜5mum for the current triode structures. The DOF can be improved by employing thicker electrodes. The optimum beam radius is also reduced for thick electrodes. 3D modeling of the structure misalignment shows that a very small and well-converged beam is observed for the maximum shifts studied: 100nm focus electrode shift or 50nm VACNF shift, although astigmatism and coma-type aberrations will increase somewhat from these misalignments. The simulation results are promising and warrant further research on these devices. Single-gate individual cathode-addressable devices are successfully fabricated. VACNFs are successfully grown on an insulating substrate instead of a conductive silicon substrate for this purpose. Electron field emission is demonstrated to be successful from these devices. Several possible fabrication schemes to achieve fully self-aligning aperture formation in triode fabrication are designed and discussed. The best way to achieve self-alignment is to employ a process based on both chemical mechanical polishing (CMP) and reactive ion etching (RIE) selectivity. Fully self-aligned devices are successfully fabricated in this manner. Repair on a missing/defective VACNF in triodes is shown to be promising using an electron beam

  18. Au nanostructure arrays for plasmonic applications: annealed island films versus nanoimprint lithography.

    PubMed

    Lopatynskyi, Andrii M; Lytvyn, Vitalii K; Nazarenko, Volodymyr I; Guo, L Jay; Lucas, Brandon D; Chegel, Volodymyr I

    2015-01-01

    This paper attempts to compare the main features of random and highly ordered gold nanostructure arrays (NSA) prepared by thermally annealed island film and nanoimprint lithography (NIL) techniques, respectively. Each substrate possesses different morphology in terms of plasmonic enhancement. Both methods allow such important features as spectral tuning of plasmon resonance position depending on size and shape of nanostructures; however, the time and cost is quite different. The respective comparison was performed experimentally and theoretically for a number of samples with different geometrical parameters. Spectral characteristics of fabricated NSA exhibited an expressed plasmon peak in the range from 576 to 809 nm for thermally annealed samples and from 606 to 783 nm for samples prepared by NIL. Modelling of the optical response for nanostructures with typical shapes associated with these techniques (parallelepiped for NIL and semi-ellipsoid for annealed island films) was performed using finite-difference time-domain calculations. Mathematical simulations have indicated the dependence of electric field enhancement on the shape and size of the nanoparticles. As an important point, the distribution of electric field at so-called 'hot spots' was considered. Parallelepiped-shaped nanoparticles were shown to yield maximal enhancement values by an order of magnitude greater than their semi-ellipsoid-shaped counterparts; however, both nanoparticle shapes have demonstrated comparable effective electrical field enhancement values. Optimized Au nanostructures with equivalent diameters ranging from 85 to 143 nm and height equal to 35 nm were obtained for both techniques, resulting in the largest electrical field enhancement. The application of island film thermal annealing method for nanochips fabrication can be considered as a possible cost-effective platform for various surface-enhanced spectroscopies; while the NIL-fabricated NSA looks like more effective for

  19. Au nanostructure arrays for plasmonic applications: annealed island films versus nanoimprint lithography

    NASA Astrophysics Data System (ADS)

    Lopatynskyi, Andrii M.; Lytvyn, Vitalii K.; Nazarenko, Volodymyr I.; Guo, L. Jay; Lucas, Brandon D.; Chegel, Volodymyr I.

    2015-03-01

    This paper attempts to compare the main features of random and highly ordered gold nanostructure arrays (NSA) prepared by thermally annealed island film and nanoimprint lithography (NIL) techniques, respectively. Each substrate possesses different morphology in terms of plasmonic enhancement. Both methods allow such important features as spectral tuning of plasmon resonance position depending on size and shape of nanostructures; however, the time and cost is quite different. The respective comparison was performed experimentally and theoretically for a number of samples with different geometrical parameters. Spectral characteristics of fabricated NSA exhibited an expressed plasmon peak in the range from 576 to 809 nm for thermally annealed samples and from 606 to 783 nm for samples prepared by NIL. Modelling of the optical response for nanostructures with typical shapes associated with these techniques (parallelepiped for NIL and semi-ellipsoid for annealed island films) was performed using finite-difference time-domain calculations. Mathematical simulations have indicated the dependence of electric field enhancement on the shape and size of the nanoparticles. As an important point, the distribution of electric field at so-called `hot spots' was considered. Parallelepiped-shaped nanoparticles were shown to yield maximal enhancement values by an order of magnitude greater than their semi-ellipsoid-shaped counterparts; however, both nanoparticle shapes have demonstrated comparable effective electrical field enhancement values. Optimized Au nanostructures with equivalent diameters ranging from 85 to 143 nm and height equal to 35 nm were obtained for both techniques, resulting in the largest electrical field enhancement. The application of island film thermal annealing method for nanochips fabrication can be considered as a possible cost-effective platform for various surface-enhanced spectroscopies; while the NIL-fabricated NSA looks like more effective for sensing of

  20. Next generation electron beam lithography system F7000 for wide range applications

    NASA Astrophysics Data System (ADS)

    Hayakawa, Hirofumi; Takizawa, Masahiro; Kurokawa, Masaki; Tsuda, Akiyoshi; Takigawa, Masami; Hamaguchi, Shin-ichi; Yamada, Akio; Sakamoto, Kiichi; Nakamura, Takayuki

    2013-06-01

    For multi-purpose applications such as advanced LSIs, photonics, MEMS, and other nano- fabrications, it is important for electron beam (EB) writers that handle the various substrates with their own single mechanical platform. We have been developing the adjusting pallet function both 200mm and 300mm bases to satisfy this requirement. By analyzing actual examples of adjusting pallets we proved their effectiveness to their applications. The combination of adjusting pallet function, 1Xnm resolution column and character projection technologies will enable the next generation EB writer "F7000" to fit from Fab to Lab applications.

  1. Radiation induced surface modification and contamination for EUV lithography and fusion applications

    NASA Astrophysics Data System (ADS)

    Al-Ajlony, Al-Montaser Bellah

    Al-Montaser Bellah Al-Ajlony. Ph.D., Purdue University, May 2014. Radiation Induced Surface Modification and Contamination for EUV Lithography and Fusion Applications. Major Professor: Ahmed Hassanein. The effect of ionizing radiation on materials surfaces is of major interest for many engineering applications. The importance of this topic rises from the severity of the implications that a surface at a certain application might suffer due its interaction with some sort of ionizing radiation. The severity of implication is not always related to the severity of the radiation, in many applications the concern comes from the over-sensitivity of the surface to a low doses of radiations. One example of these sensitive applications is the extreme ultraviolet (EUV) induced surface contaminations of the optics in EUV lithography devices. In this application, a small dose of ionizing radiation (EUV at 13.5 nm wavelength) can cause slight change in the chemical composition of the irradiated surface. This change in chemical composition can cause large change in the surface optical properties of the irradiated surface (EUV optics). This degradation in reflectivity is an issue that needs to be avoided. On the other extreme where intense radiation is implemented, the main concern of the radiation-surface interaction comes from the severity of the irradiation process. The plasma-facing component (PFC) in future thermonuclear devices represent the ultimate example where the materials might be exposed to severe irradiation processes. Under such extreme irradiation processes, some candidate PFC materials exhibit the formation of very fine and fragile nanostructure (Fuzz) that can be washed out into the fusion device plasma and stop the fusion reaction. These two extreme examples of the radiation-surface interaction were selected to be my PhD research topic. The change in chemical properties of Ru surface during exposure to a 13.5 nm wavelength of EUV light radiation was investigated

  2. Phototocatalytic Lithography of Poly(Propylene Sulfide) Block Copolymers: Towards High Throughput Nanolithography for Biomolecular Arraying Applications

    PubMed Central

    Stone, Gary; Hiddessen, Amy L.; Dugan, Lawrence C.; Wu, Ligang; Hailey, Philip; Conway, James W.; Kuenzler, Tobias; Feller, Lydia; Cerritelli, Simona; Hubbell, Jeffrey A.

    2009-01-01

    Photocatalytic lithography (PCL) is an inexpensive, fast and robust method of oxidizing surface chemical moieties to produce patterned substrates. This technique has utility in basic biological research, as well as various biochip applications. We report on porphyrin-based PCL for patterning poly(propylene sulfide) block copolymer films on gold substrates at the micron and sub-micron scale. We confirm chemical patterning with imaging ToF-SIMS and low voltage SEM. Biomolecular patterning on micron and submicron scales is demonstrated with proteins, protein-linked beads and fluorescently labeled proteins. PMID:19113808

  3. Beam pen lithography

    NASA Astrophysics Data System (ADS)

    Huo, Fengwei; Zheng, Gengfeng; Liao, Xing; Giam, Louise R.; Chai, Jinan; Chen, Xiaodong; Shim, Wooyoung; Mirkin, Chad A.

    2010-09-01

    Lithography techniques are currently being developed to fabricate nanoscale components for integrated circuits, medical diagnostics and optoelectronics. In conventional far-field optical lithography, lateral feature resolution is diffraction-limited. Approaches that overcome the diffraction limit have been developed, but these are difficult to implement or they preclude arbitrary pattern formation. Techniques based on near-field scanning optical microscopy can overcome the diffraction limit, but they suffer from inherently low throughput and restricted scan areas. Highly parallel two-dimensional, silicon-based, near-field scanning optical microscopy aperture arrays have been fabricated, but aligning a non-deformable aperture array to a large-area substrate with near-field proximity remains challenging. However, recent advances in lithographies based on scanning probe microscopy have made use of transparent two-dimensional arrays of pyramid-shaped elastomeric tips (or `pens') for large-area, high-throughput patterning of ink molecules. Here, we report a massively parallel scanning probe microscopy-based approach that can generate arbitrary patterns by passing 400-nm light through nanoscopic apertures at each tip in the array. The technique, termed beam pen lithography, can toggle between near- and far-field distances, allowing both sub-diffraction limit (100 nm) and larger features to be generated.

  4. Successful demonstration of a comprehensive lithography defect monitoring strategy

    NASA Astrophysics Data System (ADS)

    Peterson, Ingrid B.; Breaux, Louis H.; Cross, Andrew; von den Hoff, Michael

    2003-07-01

    This paper describes the validation of the methodology, the model and the impact of an optimized Lithography Defect Monitoring Strategy at two different semiconductor manufacturing factories. The lithography defect inspection optimization was implemented for the Gate Module at both factories running 0.13-0.15μm technologies on 200mm wafers, one running microprocessor and the other memory devices. As minimum dimensions and process windows decrease in the lithography area, new technologies and technological advances with resists and resist systems are being implemented to meet the demands. Along with these new technological advances in the lithography area comes potentially unforeseen defect issues. The latest lithography processes involve new resists in extremely thin, uniform films, exposing the films under conditions of highly optimized focus and illumination, and finally removing the resist completely and cleanly. The lithography cell is defined as the cluster of process equipment that accomplishes the coating process (surface prep, resist spin, edge-bead removal and soft bake), the alignment and exposure, and the developing process (post-exposure bake, develop, rinse) of the resist. Often the resist spinning process involves multiple materials such as BARC (bottom ARC) and / or TARC (top ARC) materials in addition to the resist itself. The introduction of these new materials with the multiple materials interfaces and the tightness of the process windows leads to an increased variety of defect mechanisms in the lithography area. Defect management in the lithography area has become critical to successful product introduction and yield ramp. The semiconductor process itself contributes the largest number and variety of defects, and a significant portion of the total defects originate within the lithography cell. From a defect management perspective, the lithography cell has some unique characteristics. First, defects in the lithography process module have the

  5. Immersion lithography bevel solutions

    NASA Astrophysics Data System (ADS)

    Tedeschi, Len; Tamada, Osamu; Sanada, Masakazu; Yasuda, Shuichi; Asai, Masaya

    2008-03-01

    The introduction of Immersion lithography, combined with the desire to maximize the number of potential yielding devices per wafer, has brought wafer edge engineering to the forefront for advanced semiconductor manufactures. Bevel cleanliness, the position accuracy of the lithography films, and quality of the EBR cut has become more critical. In this paper, the effectiveness of wafer track based solutions to enable state-of-art bevel schemes is explored. This includes an integrated bevel cleaner and new bevel rinse nozzles. The bevel rinse nozzles are used in the coating process to ensure a precise, clean film edge on or near the bevel. The bevel cleaner is used immediately before the wafer is loaded into the scanner after the coating process. The bevel cleaner shows promise in driving down defectivity levels, specifically printing particles, while not damaging films on the bevel.

  6. Plasma fluorination of diamond-like carbon surfaces: mechanism and application to nanoimprint lithography.

    PubMed

    Schvartzman, M; Wind, S J

    2009-04-01

    Diamond-like carbon (DLC) films, used as molds for nanoimprint lithography, were treated with a fluorocarbon-based plasma in order to enhance their anti-adhesion properties. While ellipsometry and atomic force microscope measurements showed negligible changes in thickness and surface roughness after plasma processing, contact angle measurement found fluorine plasma-treated DLC surfaces to be highly hydrophobic, with surface energy values reduced from approximately 45 mJ m(-2) for untreated films to approximately 20-30 mJ m(-2) after fluorination. X-ray photoelectron spectroscopy revealed a thin (from approximately 0.5 to approximately 3 nm) fluorocarbon layer on the DLC surface. Proposed mechanisms for the formation of this layer include two competing processes: etching of DLC and deposition of fluorocarbon material, with one or the other mechanism dominant, depending on the plasma conditions. Fluorocarbon plasma-treated DLC molds for nanoimprint lithography were used to pattern sub-20 nm size features with a high degree of repeatability, demonstrating an extended lifetime of the anti-adhesion coating. PMID:19420525

  7. The Application of Disturbance Response Decoupling to the Vibration Control of an Electron Beam Lithography System

    NASA Astrophysics Data System (ADS)

    Wang, Fu-Cheng; Tsao, Yu-Chia; Yen, Jia-Yush

    2009-06-01

    This paper demonstrates a method to control an electron beam lithography (EBL) system's vibrations with a newly developed technique called disturbance response decoupling (DRD). Resolution requirements make the vibration control of EBL systems increasingly important. Satisfying performance criteria requires considering two kinds of disturbances, load disturbances from the machine and ground disturbances from the environment, in EBL systems. Controlling lithography tools' vibrations has been studied for many years; however, designing controllers by traditional approaches can be very complicated because of these two types of disturbances' conflicting requirements. Therefore, DRD techniques were applied for this paper to deal independently with these performance requirements. The DRD control method was initially proposed in 2001 to address vehicle suspension control problems. This paper proposes a generalized and experimentally realized DRD control structure to suppress an EBL system's vibrations. The work was carried out in three parts. First, passive isolators were used to isolate ground disturbances. Second, active components were applied to improve the system's responses to load disturbances. Finally, the system was integrated to verify its overall performance. Simulations and experiments verify the proposed control strategies' effectiveness.

  8. Optimization from design rules, source and mask, to full chip with a single computational lithography framework: level-set-methods-based inverse lithography technology (ILT)

    NASA Astrophysics Data System (ADS)

    Pang, Linyong; Peng, Danping; Hu, Peter; Chen, Dongxue; Cecil, Tom; He, Lin; Xiao, Guangming; Tolani, Vikram; Dam, Thuc; Baik, Ki-Ho; Gleason, Bob

    2010-04-01

    For semiconductor manufacturers moving toward advanced technology nodes -32nm, 22nm and below - lithography presents a great challenge, because it is fundamentally constrained by basic principles of optical physics. Because no major lithography hardware improvements are expected over the next couple years, Computational Lithography has been recognized by the industry as the key technology needed to drive lithographic performance. This implies not only simultaneous co-optimization of all the lithographic enhancement tricks that have been learned over the years, but that they also be pushed to the limit by powerful computational techniques and systems. In this paper a single computational lithography framework for design, mask, and source co-optimization will be explained in non-mathematical language. A number of memory and logic device results at the 32nm node and below are presented to demonstrate the benefits of Level-Set-Method-based ILT in applications covering design rule optimization, SMO, and full-chip correction.

  9. Neutral particle lithography

    NASA Astrophysics Data System (ADS)

    Craver, Barry Paul

    Neutral particle lithography (NPL) is a high resolution, proximity exposure technique where a broad beam of energetic neutral particles floods a stencil mask and transmitted beamlets transfer the mask pattern to resist on a substrate, such that each feature is printed in parallel, rather than in the serial manner of electron beam lithography. It preserves the advantages of ion beam lithography (IBL), including extremely large depth-of-field, sub-5 nm resist scattering, and the near absence of diffraction, yet is intrinsically immune to charge-related artifacts including line-edge roughness and pattern placement errors due to charge accumulation on the mask and substrate. In our experiments, a neutral particle beam is formed by passing an ion beam (e.g., 30 keV He+) through a high pressure helium gas cell (e.g., 100 mTorr) to convert the ions to energetic neutrals through charge transfer scattering. The resolution of NPL is generally superior to that of IBL for applications involving insulating substrates, large proximity gaps, and ultra-small features. High accuracy stepped exposures with energetic neutral particles, where magnetic or electrostatic deflection is impossible, have been obtained by clamping the mask to the wafer, setting the proximity gap with a suitable spacer, and mechanically inclining the mask/wafer stack relative to the beam. This approach is remarkably insensitive to vibration and thermal drift; nanometer scale image offsets have been obtained with +/-2 nm placement accuracy for experiments lasting over one hour. Using this nanostepping technique, linewidth versus dose curves were obtained, from which the NPL lithographic blur was determined as 4.4+/-1.4 nm (1sigma), which is 2-3 times smaller than the blur of electron beam lithography. Neutral particle lithography has the potential to form high density, periodic patterns with sub-10 nm resolution.

  10. Hard-tip, soft-spring lithography.

    PubMed

    Shim, Wooyoung; Braunschweig, Adam B; Liao, Xing; Chai, Jinan; Lim, Jong Kuk; Zheng, Gengfeng; Mirkin, Chad A

    2011-01-27

    Nanofabrication strategies are becoming increasingly expensive and equipment-intensive, and consequently less accessible to researchers. As an alternative, scanning probe lithography has become a popular means of preparing nanoscale structures, in part owing to its relatively low cost and high resolution, and a registration accuracy that exceeds most existing technologies. However, increasing the throughput of cantilever-based scanning probe systems while maintaining their resolution and registration advantages has from the outset been a significant challenge. Even with impressive recent advances in cantilever array design, such arrays tend to be highly specialized for a given application, expensive, and often difficult to implement. It is therefore difficult to imagine commercially viable production methods based on scanning probe systems that rely on conventional cantilevers. Here we describe a low-cost and scalable cantilever-free tip-based nanopatterning method that uses an array of hard silicon tips mounted onto an elastomeric backing. This method-which we term hard-tip, soft-spring lithography-overcomes the throughput problems of cantilever-based scanning probe systems and the resolution limits imposed by the use of elastomeric stamps and tips: it is capable of delivering materials or energy to a surface to create arbitrary patterns of features with sub-50-nm resolution over centimetre-scale areas. We argue that hard-tip, soft-spring lithography is a versatile nanolithography strategy that should be widely adopted by academic and industrial researchers for rapid prototyping applications. PMID:21270890

  11. High throughput Jet and Flash Imprint Lithography for semiconductor memory applications

    NASA Astrophysics Data System (ADS)

    Zhang, Wei; Fletcher, Brian; Thompson, Ecron; Liu, Weijun; Stachowiak, Tim; Khusnatdinov, Niyaz; Irving, J. W.; Longsine, Whitney; Traub, Matthew; Truskett, Van; LaBrake, Dwayne; Ye, Zhengmao

    2016-03-01

    Imprint lithography has been shown to be an effective technique for replication of nano-scale features. Jet and Flash* Imprint Lithography (J-FIL*) involves the field-by-field deposition and exposure of a low viscosity resist deposited by jetting technology onto the substrate. The patterned mask is lowered into the fluid which then quickly flows into the relief patterns in the mask by capillary action. Following this filling step, the resist is crosslinked under UV radiation, and then the mask is removed, leaving a patterned resist on the substrate. There are two critical components to meeting throughput requirements for imprint lithography. Using a similar approach to what is already done for many deposition and etch processes, imprint stations can be clustered to enhance throughput. The FPA-1200NZ2C is a four station cluster system designed for high volume manufacturing. For a single station, throughput includes overhead, resist dispense, resist fill time (or spread time), exposure and separation. Resist exposure time and mask/wafer separation are well understood processing steps with typical durations on the order of 0.10 to 0.20 seconds. To achieve a total process throughput of 15 wafers per hour (wph) for a single station, it is necessary to complete the fluid fill step in 1.5 seconds. For a throughput of 20 wph, fill time must be reduced to only one second. There are several parameters that can impact resist filling. Key parameters include resist drop volume (smaller is better), system controls (which address drop spreading after jetting), Design for Imprint or DFI (to accelerate drop spreading) and material engineering (to promote wetting between the resist and underlying adhesion layer). In addition, it is mandatory to maintain fast filling, even for edge field imprinting. In this paper, we address the improvements made in all of these parameters to enable a 1.50 second filling process for a sub-20nm device like pattern and have demonstrated this capability

  12. Charting CEBL's role in mainstream semiconductor lithography

    NASA Astrophysics Data System (ADS)

    Lam, David K.

    2013-09-01

    historically kept it out of mainstream fabs. Thanks to continuing EBDW advances combined with the industry's move to unidirectional (1D) gridded layout style, EBDW promises to cost-efficiently complement 193nm ArF immersion (193i) optical lithography in high volume manufacturing (HVM). Patterning conventional 2D design layouts with 193i is a major roadblock in device scaling: the resolution limitations of optical lithography equipment have led to higher mask cost and increased lithography complexity. To overcome the challenge, IC designers have used 1D layouts with "lines and cuts" in critical layers.1 Leading logic and memory chipmakers have been producing advanced designs with lines-and-cuts in HVM for several technology nodes in recent years. However, cut masks in multiple optical patterning are getting extremely costly. Borodovsky proposes Complementary Lithography in which another lithography technology is used to pattern line-cuts in critical layers to complement optical lithography.2 Complementary E-Beam Lithography (CEBL) is a candidate to pattern the Cuts of optically printed Lines. The concept of CEBL is gaining acceptance. However, challenges in throughput, scaling, and data preparation rate are threatening to deny CEBL's role in solving industry's lithography problem. This paper will examine the following issues: The challenges of massively parallel pixel writing The solutions of multiple mini-column design/architecture in: Boosting CEBL throughput Resolving issues of CD control, CDU, LER, data rate, higher resolution, and 450mm wafers The role of CEBL in next-generation solution of semiconductor lithography

  13. SOFT-MI: a novel microfabrication technique integrating soft-lithography and molecular imprinting for tissue engineering applications.

    PubMed

    Vozzi, Giovanni; Morelli, Ilaria; Vozzi, Federico; Andreoni, Chiara; Salsedo, Elisabetta; Morachioli, Annagiulia; Giusti, Paolo; Ciardelli, Gianluca

    2010-08-01

    An innovative approach has been employed for the realization of bioactive scaffolds able to mimic the in vivo cellular microenvironment for tissue engineering applications. This method is based on the combination of molecular imprinting and soft-lithography technology to enhance cellular adhesion and to guide cell growth and proliferation due to presence of highly specific recognition sites of selected biomolecules on a well-defined polymeric microstructure. In this article polymethylmethacrylate (PMMA) scaffolds have been realized by using poly(dimethylsiloxane) (PDMS) microstructured molds imprinted with FITC-albumin and TRITC-lectin. In addition gelatin, an adhesion protein, was employed for the molecular imprinting of polymeric scaffolds for cellular tests. The most innovative aspect of this research was the molecular imprinting of whole cells for the development of substrates able to enhance the cell adhesion processes. PMID:20564617

  14. Current Status and Perspective of EUV Lithography

    NASA Astrophysics Data System (ADS)

    Nishiyama, Iwao

    The EUV lithography (EUVL) utilizes 13-nm photons as a light source. Because of the short wavelength, it provides a very high resolution and is applicable to the fabrication of multiple generations of semiconductor devices from 45 nm hp down to 32 and even 22 nm hp. This makes EUVL the most promising next-generation lithography, which will follow ArF immersion lithography. However, because the wavelength is so short, bringing EUVL to the level of a practical production tool involves many difficult challenges, such as the development of a high-power light source, high-precision reflective optics, low-defect multilayer masks, a high-resolution high-sensitivity resist, and so on. To overcome the technical difficulties and accelerate the development of EUVL, various projects have been launched and are currently running under the management of SEMATECH (US), NEDEA+ (Europe), and ASET and EUVA (Japan). These activities have produced great advances in EUVL technology in the past several years. A full-field exposure tool for process development (α tool) will be delivered in 2006, and an exposure tool for mass production (γ tool) will be delivered two or three years after that. This presentation gives an overview of recent progress in EUVL.

  15. VUV lithography

    DOEpatents

    George, Edward V.; Oster, Yale; Mundinger, David C.

    1990-01-01

    Deep UV projection lithography can be performed using an e-beam pumped solid excimer UV source, a mask, and a UV reduction camera. The UV source produces deep UV radiation in the range 1700-1300A using xenon, krypton or argon; shorter wavelengths of 850-650A can be obtained using neon or helium. A thin solid layer of the gas is formed on a cryogenically cooled plate and bombarded with an e-beam to cause fluorescence. The UV reduction camera utilizes multilayer mirrors having high reflectivity at the UV wavelength and images the mask onto a resist coated substrate at a preselected demagnification. The mask can be formed integrally with the source as an emitting mask.

  16. VUV lithography

    DOEpatents

    George, E.V.; Oster, Y.; Mundinger, D.C.

    1990-12-25

    Deep UV projection lithography can be performed using an e-beam pumped solid excimer UV source, a mask, and a UV reduction camera. The UV source produces deep UV radiation in the range 1,700--1,300A using xenon, krypton or argon; shorter wavelengths of 850--650A can be obtained using neon or helium. A thin solid layer of the gas is formed on a cryogenically cooled plate and bombarded with an e-beam to cause fluorescence. The UV reduction camera utilizes multilayer mirrors having high reflectivity at the UV wavelength and images the mask onto a resist coated substrate at a preselected demagnification. The mask can be formed integrally with the source as an emitting mask. 6 figs.

  17. Maskless lithography

    DOEpatents

    Sweatt, William C.; Stulen, Richard H.

    1999-01-01

    The present invention provides a method for maskless lithography. A plurality of individually addressable and rotatable micromirrors together comprise a two-dimensional array of micromirrors. Each micromirror in the two-dimensional array can be envisioned as an individually addressable element in the picture that comprises the circuit pattern desired. As each micromirror is addressed it rotates so as to reflect light from a light source onto a portion of the photoresist coated wafer thereby forming a pixel within the circuit pattern. By electronically addressing a two-dimensional array of these micromirrors in the proper sequence a circuit pattern that is comprised of these individual pixels can be constructed on a microchip. The reflecting surface of the micromirror is configured in such a way as to overcome coherence and diffraction effects in order to produce circuit elements having straight sides.

  18. The application of variable universe fuzzy PID controller in computer-aided alignment of lithography projector

    NASA Astrophysics Data System (ADS)

    Zhang, Mei; Zheng, Meng; Li, Yanqiu

    2013-12-01

    A variable universe fuzzy PID algorithm is designed to control the misalignment of the lithography projection optics to meet the requirement of high image quality. This paper first simulates the alignment of Schwarzschild objective designed by us. Secondly, the variable universe fuzzy PID control is introduced to feed back the misalignment of Schwarzschild objective to the control system to drive the stage which holds the objective. So the position can be adjusted automatically. This feedback scheme can adjust the variables' universe self-adaptively by using fuzzy rules so that the concrete function and parameters of the contraction-expansion factor are not necessary. Finally, the proposed approach is demonstrated by simulations. The results show that, variable universe fuzzy PID method exhibits better performance in both improving response speed and decreasing overshoot compared to conventional PID and fuzzy PID control methods. In addition, the interference signal can be effectively restrained. It is concluded that this method can improve the dynamic and static properties of system and meet the requirement of fast response.

  19. Application of electron beam lithography to produce corrugated surface for DFB lasers

    NASA Astrophysics Data System (ADS)

    Deshmukh, P. R.; Singh, Mulayam; Rangra, Kamal J.; Khokle, W. S.; Pal, B. B.

    1992-12-01

    For long wavelength single node DFB type laser devices it Is required to rrugate the surface of InP substrate in the form of lines (Grating) with spatial period In sub-half micron ng. Electron beam lithography (E2L) can be used to make such high resolutlon lines first in the resist and then these lines can be transferred to the substrate by suitable dry or wet etching process. In delineating such closely spaced lines In the resist which Is coated on a relatively high average atctnic number substrate ( At.No.32), the well known proximity exposure (PE) effect associated with EBL requires cxrrection " The paper discusses arid gives the simulation results which depict the effect of PE on the width and spacing of lines. A comparison Is made between the lines on the lower At.No. substrate Si, and high At.No. InP substrate. A proximity exposure compensation (PEC) scheme based on dose variation technique is found to provide just adequate correction to PE effect. The experimental results on the delineation of lines before and after correction show good agreement with the simulated results within experimental limitations.

  20. Study of barrier coats for application in immersion 193-nm lithography

    NASA Astrophysics Data System (ADS)

    Houlihan, Francis; Kim, Wookyu; Sakamuri, Raj; Hamilton, Keino; Dimerli, Alla; Abdallah, David; Romano, Andrew; Dammel, Ralph R.; Pawlowski, Georg; Raub, Alex; Brueck, Steve

    2005-05-01

    We will describe our barrier coat approach for use in immersion 193 nm lithography. These barrier coats may act as either simple barriers providing protection against loss of resist components into water or in the case of one type of these formulations which have a refractive index at 193 nm which is the geometric mean between that of the resist and water provide, also top antireflective properties. Either type of barrier coat can be applied with a simple spinning process compatible with PGMEA based resin employing standard solvents such as alcohols and be removed during the usual resist development process with aqueous 0.26 N TMAH. We will discuss both imaging results with these materials on acrylate type 193 nm resists and also show some fundamental studies we have done to understand the function of the barrier coat and the role of differing spinning solvents and resins. We will show LS (55 nm) and Contact Hole (80 nm) resolved with a 193 nm resist exposed with the interferometric tool at the University of New Mexico (213 nm) with and without the use of a barrier coat.

  1. Advances in uncooled systems applications

    NASA Astrophysics Data System (ADS)

    Anderson, John S.; Bradley, Daryl; Chen, Chungte W.; Chin, Richard; Gonzalez, H.; Hegg, Ronald G.; Kostrzewa, K.; Le Pere, C.; Ton, S.; Kennedy, Adam; Murphy, Daniel F.; Ray, Michael; Wyles, Richard; Miller, James E.; Newsome, Gwendolyn W.

    2003-09-01

    The Low Cost Microsensors (LCMS) Program recently demonstrated state-of-the-art imagery in a long-range infrared (IR) sensor built upon an uncooled vanadium oxide (VOx) 640 x 480 format focal plane array (FPA) engine. The 640 x 480 sensor is applicable to long-range surveillance and targeting missions. The intent of this DUS&T effort was to further reduce the cost, weight, and power of uncooled IR sensors, and to increase the capability of these sensors, thereby expanding their applicability to military and commercial markets never before addressed by thermal imaging. In addition, the Advanced Uncooled Thermal Imaging Sensors (AUTIS) Program extended this development to light-weight, compact unmanned aerial vehicle (UAV) applications.

  2. Enzyme Mimics: Advances and Applications.

    PubMed

    Kuah, Evelyn; Toh, Seraphina; Yee, Jessica; Ma, Qian; Gao, Zhiqiang

    2016-06-13

    Enzyme mimics or artificial enzymes are a class of catalysts that have been actively pursued for decades and have heralded much interest as potentially viable alternatives to natural enzymes. Aside from having catalytic activities similar to their natural counterparts, enzyme mimics have the desired advantages of tunable structures and catalytic efficiencies, excellent tolerance to experimental conditions, lower cost, and purely synthetic routes to their preparation. Although still in the midst of development, impressive advances have already been made. Enzyme mimics have shown immense potential in the catalysis of a wide range of chemical and biological reactions, the development of chemical and biological sensing and anti-biofouling systems, and the production of pharmaceuticals and clean fuels. This Review concerns the development of various types of enzyme mimics, namely polymeric and dendrimeric, supramolecular, nanoparticulate and proteinic enzyme mimics, with an emphasis on their synthesis, catalytic properties and technical applications. It provides an introduction to enzyme mimics and a comprehensive summary of the advances and current standings of their applications, and seeks to inspire researchers to perfect the design and synthesis of enzyme mimics and to tailor their functionality for a much wider range of applications. PMID:27062126

  3. Evaluation of an advanced process control solution to detect wafer positioning issues within the hot and cold plate modules of a lithography track

    NASA Astrophysics Data System (ADS)

    Guillaume, Olivier; Bouchardy, Marc; Armellin, Louis-Pierre

    2006-03-01

    To run the various steps of the process, multiple robot arm transfers within the Hot and Cold Plate modules which directly influence the critical dimension of the production wafers were performed on the lithography track. Wafer positioning inside these modules was found to be one of the key parameters to obtain the best critical dimensional uniformity across the wafer. With the currently realized track monitoring and conventional Statistical Process Control (SPC), potential process drifts or errors within these modules can only be detected from wafers measured during the post process control of product parameters. To catch all potential non-conformal production wafers directly at the tool, minimize equipment downtime and identify the root cause of maintenance issues, the real-time control of tool and process parameters is required. This paper presents the results of the evaluation of an Advanced Process Control (APC) solution used to detect in real-time mode any wafer positioning issues within the Hot and Cold Plate modules of a lithography track based on the monitoring of the plate temperature profile during wafer processing. After an explanation of the methodology used to collect the data from the tool, an initial phase of analysis of the temperature profile of the different Hot Plate modules was carried out. The monitoring of the temperature range was identified as the key parameter for the detection of wafer positioning issues where the temperature profile depends on the number of resistive heating elements, temperature settings and process conditions of the Hot Plate. The wafer tilt was simulated to compare the temperature profile to standard process conditions and in turn determine the detection capability. For the Cold Plate module, it was necessary to know the time between the end of the hot step and the start of the following cold step in order to detect a real tilt issue.

  4. Benzophenone doped polydimethylsiloxane: self developable composite resist system for its use in a direct write laser lithography application

    NASA Astrophysics Data System (ADS)

    Bute, Madhushree G.; Shinde, Shashikant D.; Bodas, Dhananjay; Fouad, H.; Adhi, K. P.; Gosavi, S. W.

    2015-05-01

    This paper reports a benzophenone doped polydimethylsiloxane (PDMS) composite resist system, for micro patterning using direct write laser lithography for its use in lab-on-chip (LOC) applications. A 248 nm excimer laser with a 20 ns pulse width is used for microfabrication of doped-PDMS. The effect of two major aspects viz. resist composition and laser processing parameters on the quality of fabricated microstructures is studied and optimized. The lithographic analysis reveals that the doped-PDMS shows self developable sensitivity at lower threshold fluence, 250 mJ cm-2. The optimized composition ratio 10: 1: 0.3 (wt%) of the PDMS monomer: curing agent: Benzophenone (P:C:B) is used for processing and analysis. Comprehensive analysis on the effect of laser ablation parameters (fluence, frequency and number of laser pulses) on etching performance (etch rate, geometry of micropattern and quality of surface) is presented. Increase in etch rate with fluence (250-650 mJ cm-2) is observed and considered to be in a working range. Simultaneously, increase in surface roughness as a function of fluence >650 mJ cm-2 is observed which can be associated with rapid rise in the photothermal decomposition of the composite resist. However pulse repetition rate (PRR) at 1, 5 and 10 Hz does not offer any significant effect on etch rate. The surface quality at a higher PRR is deprived due to redeposition of ablated material which concludes 1 Hz as a suitable working frequency. The deterioration of surface quality with increasing PRR is associated with the formation of a heat affected zone, due to cumulative heating, as the increase in temperature Δ T≤ft(TsN+1-{{T}s}\\right) is 362 °C at 5 Hz and 624 °C at 10 Hz, above Ts ~ 1099 °C for 1 Hz. However, the number of pulses and etch rate are inversely related due to the plume effect. The overall study provides a guideline for precise control on fast prototyping direct write laser lithography processes

  5. Nanobiocatalyst advancements and bioprocessing applications

    PubMed Central

    Misson, Mailin; Zhang, Hu; Jin, Bo

    2015-01-01

    The nanobiocatalyst (NBC) is an emerging innovation that synergistically integrates advanced nanotechnology with biotechnology and promises exciting advantages for improving enzyme activity, stability, capability and engineering performances in bioprocessing applications. NBCs are fabricated by immobilizing enzymes with functional nanomaterials as enzyme carriers or containers. In this paper, we review the recent developments of novel nanocarriers/nanocontainers with advanced hierarchical porous structures for retaining enzymes, such as nanofibres (NFs), mesoporous nanocarriers and nanocages. Strategies for immobilizing enzymes onto nanocarriers made from polymers, silicas, carbons and metals by physical adsorption, covalent binding, cross-linking or specific ligand spacers are discussed. The resulting NBCs are critically evaluated in terms of their bioprocessing performances. Excellent performances are demonstrated through enhanced NBC catalytic activity and stability due to conformational changes upon immobilization and localized nanoenvironments, and NBC reutilization by assembling magnetic nanoparticles into NBCs to defray the high operational costs associated with enzyme production and nanocarrier synthesis. We also highlight several challenges associated with the NBC-driven bioprocess applications, including the maturation of large-scale nanocarrier synthesis, design and development of bioreactors to accommodate NBCs, and long-term operations of NBCs. We suggest these challenges are to be addressed through joint collaboration of chemists, engineers and material scientists. Finally, we have demonstrated the great potential of NBCs in manufacturing bioprocesses in the near future through successful laboratory trials of NBCs in carbohydrate hydrolysis, biofuel production and biotransformation. PMID:25392397

  6. The Cramer-Rao Bound and Adaptive Estimation with Applications to IC Lithography.

    NASA Astrophysics Data System (ADS)

    Gatherer, Alan

    There are many situations where a finite number of parameters are estimated from an input waveform. Some examples are position estimation in radar and sonar, and lithographic alignment in integrate circuit (IC) fabrication. All of these examples involve position and/or amplitude estimation of a single pulse or a series of overlapping pulses. In this thesis lower bounds on the estimation error of amplitude and position are derived and algorithms are developed for position estimation in lithographic alignment. The first part of this thesis concentrates on the use of the Cramer-Rao Bound (CRB) in pulse position and amplitude estimation. The CRB is a lower bound on the estimation error of a parameter that is independent of the algorithm used to estimate the parameter. A new description of the CRB is given in terms of the projection of a single vector onto a subspace formed by a set of other vectors. Simple intuitive approximations to the CRB in pulse position and amplitude estimation are derived. The effect on a given parameter of the pulse shape and the other unknown amplitudes and positions is clearly seen so that pulse shape optimization to minimize the effect of overlapping pulses is then possible. The CRB is also derived for edge position estimation and the effect of a finite observation window on the CRB is examined. The second part of this thesis is concerned with the problem of alignment in IC fabrication. As the minimum feature size of ICs decreases there is a decrease in the maximum alignment error that can occur before circuit malfunction. Therefore more accurate alignment algorithms are required. However, lithography systems are becoming more expensive and high throughput is required from the alignment system. The algorithms described in this thesis have both high accuracy and high throughput. An adaptive alignment algorithm is described and shown to be robust and of low computational complexity. A multi-step approach to alignment is also presented that can

  7. Advances and Applications for Geodesy

    NASA Astrophysics Data System (ADS)

    Calais, Eric; Schwartz, Susan; Arrowsmith, Ramon

    2010-07-01

    2010 UNAVCO Science Workshop; Boulder, Colorado, 8-11 March 2010; Geodesy's reach has expanded rapidly in recent years as EarthScope and international data sets have grown and new disciplinary applications have emerged. To explore advances in geodesy and its applications in geoscience research and education, approximately 170 scientists (representing 11 countries: Colombia, Denmark, Ecuador, France, Japan, Lebanon, Mexico, New Zealand, Russia, Spain, and the United States), including 15 students, gathered at the 2010 UNAVCO Science Workshop in Colorado. UNAVCO is a nonprofit membership-governed consortium that facilitates geoscience research and education using geodesy. Plenary sessions integrated discovery with broad impact and viewed geodesy through three lenses: (1) pixel-by-pixel geodetic imaging where various remote sensing methodologies are revealing fine-scale changes in the near-surface environment and the geologic processes responsible for them; (2) epoch-by-epoch deformation time series measured in seconds to millennia, which are uncovering ephemeral processes associated with the earthquake cycle and glacial and groundwater flow; and (3) emerging observational powers from advancing geodetic technologies. A fourth plenary session dealt with geodesy and water, a new strategic focus on the hydrosphere, cryosphere, and changing climate. Keynotes included a historical perspective by Bernard Minster (Scripps Institution of Oceanography) on space geodesy and its applications to geophysics, and a summary talk by Susan Eriksson (UNAVCO) on the successes of Research Experience in Solid Earth Science for Students (RESESS) and its 5-year follow-on with opportunities to mentor the next generation of geoscientists through cultivation of diversity.

  8. Application of natural linear polysaccharide to green resist polymers for electron beam and extreme-ultraviolet lithography

    NASA Astrophysics Data System (ADS)

    Takei, Satoshi; Oshima, Akihiro; Oyama, Tomoko G.; Ito, Kenta; Sugahara, Kigen; Kashiwakura, Miki; Kozawa, Takahiro; Tagawa, Seiichi; Hanabata, Makoto

    2014-11-01

    The application of natural linear polysaccharide to green resist polymers was demonstrated for electron beam (EB) and extreme-ultraviolet (EUV) lithography using organic-solvent-free water spin-coating and tetramethylammonium hydroxide (TMAH)-free water-developable techniques. The water spin-coating and water-developable processes in a green resist material were carried out on wafers because of the water solubility of natural polysaccharides for an environmentally friendly manufacturing process for next-generation electronic devices. The developed green resist material with a weight-average molecular weight of 83,000 and 70 mol % hydroxyl groups as a water-developable feature was found to have acceptable properties such as spin-coat ability on 200 mm wafers, prediction sensitivity to EUV at the wavelengths of 6.7 and 13.5 nm, a high contrast of the water dissolution rate before and after EB irradiation, pillar patterns of 100-400 nm with a high EB sensitivity of 10 µC/cm2, and etch selectivity with a silicon-based middle layer in CF4 plasma treatment.

  9. Application of rigorously optimized phase masks for the fabrication of binary and blazed gratings with diffractive proximity lithography

    NASA Astrophysics Data System (ADS)

    Stuerzebecher, Lorenz; Fuchs, Frank; Harzendorf, Torsten; Meyer, Stefan; Zeitner, Uwe D.

    2014-03-01

    Gratings with binary and blazed profiles and periods in the low micron and sub-micron range define a class of microstructures with a huge application potential. We present a mask based photolithographic fabrication method for these demanding grating geometries. It combines the advantages of electron beam lithography and holographic exposure, which are superior homogeneity, high resolution and pattern flexibility on one hand, and a fast, large aerial exposure with the option for smooth profiles on the other hand. This is accomplished by the use of an electron beam written phase mask which contains a very homogeneous pattern of diffractive features and is used for a full-field exposure in a proximity mask aligner. The key for the beneficial use of the technology is the proper design of the phase mask surface profile which can have a binary or multilevel geometry. Since the patterns to be exposed are periodic, this is also the case for the phase mask which allows calculating their physical light transmission with exact methods like rigorous coupled wave analysis. An optimization algorithm has been developed which can find mask geometries that synthesize a desired complex aerial image in the proximity distance of choice. Aerial images offering e.g. high resolution features, phase shifts, and tilted propagation directions can be realized that way. This technology has been successfully used to fabricate e.g. binary gratings of very high quality with a period of 800 nm as well as blazed gratings with a period of 3 μm.

  10. The Application of Silicon Rich Nitride Films for Use as Deep-Ultraviolet Lithography Phase-Shifting Masks

    NASA Astrophysics Data System (ADS)

    Jiang, Zhong-Tao; Yamaguchi, Tomuo; Ohshimo, Kentaro; Aoyama, Mitsuru; Asinovsky, Leo

    1998-02-01

    Silicon rich nitride (SiRN) film prepared by plasma enhanced chemical vapor deposition (PECVD) for use as the phase-shifting mask for Deep-ultraviolet (UV) lithography has been developed. Optical properties and compositional characterizations of the SiRN films using Auger electron spectroscopy (AES) and spectroscopic ellipsometry (SE) combined with an empirical dielectric function (EDF), as well as phase-shifting mask simulation show that the SiRN is feasible for use in the application of single layer halftone phase-shifting mask (SLHTPSM) in the Deep-UV range. Optical constants of n ≈ 2.5 and k < 0.6 at 193 nm were realized by approaching the N/Si composition to the stoichiometric ratio of Si3N4. The deposition conditions for the films having the transmittance of 5 - 10% with a 180° phase shift at 193 nm (ArF) have been determined. Short wavelength extrapolation by EDF best-fit parameters based on a proper film-stack model provides a potential method to characterize the optical properties of amorphous SiRN down to about 190 nm, which is outside the range of most commercial SE's.

  11. Advanced textile applications for primary aircraft structures

    NASA Technical Reports Server (NTRS)

    Jackson, Anthony C.; Barrie, Ronald E.; Shah, Bharat M.; Shukla, Jay G.

    1992-01-01

    Advanced composite primary structural concepts were evaluated for low cost, damage tolerant structures. Development of advanced textile preforms for fuselage structural applications with resin transfer molding and powder epoxy materials are now under development.

  12. Advanced textile applications for primary aircraft structures

    NASA Technical Reports Server (NTRS)

    Jackson, Anthony C.; Barrie, Ronald E.; Shah, Bharat M.; Shukla, Jay G.

    1992-01-01

    Advanced composite primary structural concepts have been evaluated for low cost, damage tolerant structures. Development of advanced textile preforms for fuselage structural applications with resin transfer molding and powder epoxy material is now under development.

  13. E-beam to complement optical lithography for 1D layouts

    NASA Astrophysics Data System (ADS)

    Lam, David K.; Liu, Enden D.; Smayling, Michael C.; Prescop, Ted

    2011-04-01

    The semiconductor industry is moving to highly regular designs, or 1D gridded layouts, to enable scaling to advanced nodes, as well as improve process latitude, chip size and chip energy consumption. The fabrication of highly regular ICs is straightforward. Poly and metal layers are arranged into 1D layouts. These 1D layouts facilitate a two-step patterning approach: a line-creation step, followed by a line-cutting step, to form the desired IC pattern (See Figure 1). The first step, line creation, can be accomplished with a variety of lithography techniques including 193nm immersion (193i) and Self-Aligned Double Patterning (SADP). It appears feasible to create unidirectional parallel lines to at least 11 nm half-pitch, with two applications of SADP for pitch division by four. Potentially, this step can also be accomplished with interference lithography or directed self assembly in the future. The second step, line cutting, requires an extremely high-resolution lithography technique. At advanced nodes, the only options appear to be the costly quadruple patterning with 193i, or EUV or E-Beam Lithography (EBL). This paper focuses on the requirements for a lithography system for "line cutting", using EBL to complement Optical. EBL is the most cost-effective option for line cutting at advanced nodes for HVM.

  14. Porphyrin-Based Photocatalytic Lithography

    SciTech Connect

    Bearinger, J; Stone, G; Christian, A; Dugan, L; Hiddessen, A; Wu, K J; Wu, L; Hamilton, J; Stockton, C; Hubbell, J

    2007-10-15

    Photocatalytic lithography is an emerging technique that couples light with coated mask materials in order to pattern surface chemistry. We excite porphyrins to create radical species that photocatalytically oxidize, and thereby pattern, chemistries in the local vicinity. The technique advantageously does not necessitate mass transport or specified substrates, it is fast and robust and the wavelength of light does not limit the resolution of patterned features. We have patterned proteins and cells in order to demonstrate the utility of photocatalytic lithography in life science applications.

  15. Mask defect printing mechanisms for future lithography generations

    NASA Astrophysics Data System (ADS)

    Erdmann, Andreas; Graf, Thomas; Bubke, Karsten; Höllein, Ingo; Teuber, Silvio

    2006-03-01

    Mask defects are of increasing concern for future lithography generations. The improved resolution capabilities of immersion and EUV systems increase also the sensitivity of these systems with respect to small imperfections of the mask. Advanced mask technologies such as alternating phase shift masks (AltPSM), chromeless phase shift lithography (CPL), or "thick" absorbers on EUV masks introduce new defect types. The paper presents an application of rigorous electromagnetic field modeling for the study of typical defect printing mechanisms in ArF immersion lithography and in EUV lithography. For standard imaging and mask technologies, such as binary masks or attenuated phase shift masks, small defects usually print as linewidth or critical dimension (CD) errors with the largest effect at best focus. For AltPSM, CPL masks, and EUV masks this is not always the case. Several unusual printing scenarios were observed: placement errors due to defects can become more critical than CD-errors, defects may print more critical at defocus positions different from the center of the process window, the defect printing may become asymmetric through focus, and the risk of defect printing depends on the polarization of the used light source. Several simulation examples will demonstrate these effects. Rigorous EMF simulations in combination with vector imaging simulations are very useful to understand the origins of the observed defect printing mechanisms.

  16. Plan for advanced microelectronics processing technology application

    SciTech Connect

    Goland, A.N.

    1990-10-01

    The ultimate objective of the tasks described in the research agreement was to identify resources primarily, but not exclusively, within New York State that are available for the development of a Center for Advanced Microelectronics Processing (CAMP). Identification of those resources would enable Brookhaven National Laboratory to prepare a program plan for the CAMP. In order to achieve the stated goal, the principal investigators undertook to meet the key personnel in relevant NYS industrial and academic organizations to discuss the potential for economic development that could accompany such a Center and to gauge the extent of participation that could be expected from each interested party. Integrated of these discussions was to be achieved through a workshop convened in the summer of 1990. The culmination of this workshop was to be a report (the final report) outlining a plan for implementing a Center in the state. As events unfolded, it became possible to identify the elements of a major center for x-ray lithography on Lone Island at Brookhaven National Laboratory. The principal investigators were than advised to substitute a working document based upon that concept in place of a report based upon the more general CAMP workshop originally envisioned. Following that suggestion from the New York State Science and Technology Foundation, the principals established a working group consisting of representatives of the Grumman Corporation, Columbia University, the State University of New York at Stony Brook, and Brookhaven National Laboratory. Regular meetings and additional communications between these collaborators have produced a preproposal that constitutes the main body of the final report required by the contract. Other components of this final report include the interim report and a brief description of the activities which followed the establishment of the X-ray Lithography Center working group.

  17. Bubble-Pen Lithography.

    PubMed

    Lin, Linhan; Peng, Xiaolei; Mao, Zhangming; Li, Wei; Yogeesh, Maruthi N; Rajeeva, Bharath Bangalore; Perillo, Evan P; Dunn, Andrew K; Akinwande, Deji; Zheng, Yuebing

    2016-01-13

    Current lithography techniques, which employ photon, electron, or ion beams to induce chemical or physical reactions for micro/nano-fabrication, have remained challenging in patterning chemically synthesized colloidal particles, which are emerging as building blocks for functional devices. Herein, we develop a new technique - bubble-pen lithography (BPL) - to pattern colloidal particles on substrates using optically controlled microbubbles. Briefly, a single laser beam generates a microbubble at the interface of colloidal suspension and a plasmonic substrate via plasmon-enhanced photothermal effects. The microbubble captures and immobilizes the colloidal particles on the substrate through coordinated actions of Marangoni convection, surface tension, gas pressure, and substrate adhesion. Through directing the laser beam to move the microbubble, we create arbitrary single-particle patterns and particle assemblies with different resolutions and architectures. Furthermore, we have applied BPL to pattern CdSe/ZnS quantum dots on plasmonic substrates and polystyrene (PS) microparticles on two-dimensional (2D) atomic-layer materials. With the low-power operation, arbitrary patterning and applicability to general colloidal particles, BPL will find a wide range of applications in microelectronics, nanophotonics, and nanomedicine. PMID:26678845

  18. Maskless, reticle-free, lithography

    DOEpatents

    Ceglio, Natale M.; Markle, David A.

    1997-11-25

    A lithography system in which the mask or reticle, which usually carries the pattern to be printed onto a substrate, is replaced by a programmable array of binary (i.e. on/off) light valves or switches which can be programmed to replicate a portion of the pattern each time an illuminating light source is flashed. The pattern of light produced by the programmable array is imaged onto a lithographic substrate which is mounted on a scanning stage as is common in optical lithography. The stage motion and the pattern of light displayed by the programmable array are precisely synchronized with the flashing illumination system so that each flash accurately positions the image of the pattern on the substrate. This is achieved by advancing the pattern held in the programmable array by an amount which corresponds to the travel of the substrate stage each time the light source flashes. In this manner the image is built up of multiple flashes and an isolated defect in the array will only have a small effect on the printed pattern. The method includes projection lithographies using radiation other than optical or ultraviolet light. The programmable array of binary switches would be used to control extreme ultraviolet (EUV), x-ray, or electron, illumination systems, obviating the need for stable, defect free masks for projection EUV, x-ray, or electron, lithographies.

  19. Maskless, reticle-free, lithography

    DOEpatents

    Ceglio, N.M.; Markle, D.A.

    1997-11-25

    A lithography system in which the mask or reticle, which usually carries the pattern to be printed onto a substrate, is replaced by a programmable array of binary (i.e. on/off) light valves or switches which can be programmed to replicate a portion of the pattern each time an illuminating light source is flashed. The pattern of light produced by the programmable array is imaged onto a lithographic substrate which is mounted on a scanning stage as is common in optical lithography. The stage motion and the pattern of light displayed by the programmable array are precisely synchronized with the flashing illumination system so that each flash accurately positions the image of the pattern on the substrate. This is achieved by advancing the pattern held in the programmable array by an amount which corresponds to the travel of the substrate stage each time the light source flashes. In this manner the image is built up of multiple flashes and an isolated defect in the array will only have a small effect on the printed pattern. The method includes projection lithographies using radiation other than optical or ultraviolet light. The programmable array of binary switches would be used to control extreme ultraviolet (EUV), x-ray, or electron, illumination systems, obviating the need for stable, defect free masks for projection EUV, x-ray, or electron, lithographies. 7 figs.

  20. Advanced materials for space applications

    NASA Astrophysics Data System (ADS)

    Pater, Ruth H.; Curto, Paul A.

    2007-12-01

    Since NASA was created in 1958, over 6400 patents have been issued to the agency—nearly one in a thousand of all patents ever issued in the United States. A large number of these inventions have focused on new materials that have made space travel and exploration of the moon, Mars, and the outer planets possible. In the last few years, the materials developed by NASA Langley Research Center embody breakthroughs in performance and properties that will enable great achievements in space. The examples discussed below offer significant advantages for use in small satellites, i.e., those with payloads under a metric ton. These include patented products such as LaRC SI, LaRC RP 46, LaRC RP 50, PETI-5, TEEK, PETI-330, LaRC CP, TOR-LM and LaRC LCR (patent pending). These and other new advances in nanotechnology engineering, self-assembling nanostructures and multifunctional aerospace materials are presented and discussed below, and applications with significant technological and commercial advantages are proposed.

  1. Advanced Materials for Space Applications

    NASA Technical Reports Server (NTRS)

    Pater, Ruth H.; Curto, Paul A.

    2005-01-01

    Since NASA was created in 1958, over 6400 patents have been issued to the agency--nearly one in a thousand of all patents ever issued in the United States. A large number of these inventions have focused on new materials that have made space travel and exploration of the moon, Mars, and the outer planets possible. In the last few years, the materials developed by NASA Langley Research Center embody breakthroughs in performance and properties that will enable great achievements in space. The examples discussed below offer significant advantages for use in small satellites, i.e., those with payloads under a metric ton. These include patented products such as LaRC SI, LaRC RP 46, LaRC RP 50, PETI-5, TEEK, PETI-330, LaRC CP, TOR-LM and LaRC LCR (patent pending). These and other new advances in nanotechnology engineering, self-assembling nanostructures and multifunctional aerospace materials are presented and discussed below, and applications with significant technological and commercial advantages are proposed.

  2. Nanostructured surfaces using thermal nanoimprint lithography: Applications in thin membrane technology, piezoelectric energy harvesting and tactile pressure sensing

    NASA Astrophysics Data System (ADS)

    Nabar, Bhargav Pradip

    Nanoimprint lithography (NIL) is emerging as a viable contender for fabrication of large-scale arrays of 5-500 nm features. The work presented in this dissertation aims to leverage the advantages of NIL for realization of novel Nano Electro Mechanical Systems (NEMS). The first application is a nanoporous membrane blood oxygenator system. A fabrication process for realization of thin nanoporous membranes using thermal nanoimprint lithography is presented. Suspended silicon nitride membranes were fabricated by Low-Pressure Chemical Vapor Deposition (LPCVD) in conjunction with a potassium hydroxide-based bulk micromachining process. Nanoscale features were imprinted into a commercially available thermoplastic polymer resist using a pre-fabricated silicon mold. The pattern was reversed and transferred to a thin aluminum oxide layer by means of a novel two stage lift-off technique. The patterned aluminum oxide was used as an etch mask in a CHF3/He based reactive ion etch process to transfer the pattern to silicon nitride. Highly directional etch profiles with near vertical sidewalls and excellent Si3N4/Al2O3 etch selectivity was observed. One-micrometer-thick porous membranes with varying dimensions of 250x250 microm2 to 450x450 microm 2 and pore diameter of 400 nm have been engineered and evaluated. Results indicate that the membranes have consistent nanopore dimensions and precisely defined porosity, which makes them ideal as gas exchange interfaces in blood oxygenation systems as well as other applications such as dialysis. Additionally, bulk -- micromachined microfluidic channels have been developed for uniform, laminar blood flow with minimal cell trauma. NIL has been used for ordered growth of crystalline nanostructures for sensing and energy harvesting. Highly ordered arrays of crystalline ZnO nanorods have been fabricated using a polymer template patterned by thermal nanoimprint lithography, in conjunction with a low temperature hydrothermal growth process. Zinc

  3. Novel 3D resist shaping process via e-beam lithography, with application for the formation of blased planar waveguide gratings and planar lenses on GaAs

    NASA Astrophysics Data System (ADS)

    Poli, Louis C.; Kondek, Christine A.; Novembre, Anthony E.; McLane, George F.

    1995-06-01

    Planar waveguide gratings are finding applications in wide band signal processing for imaging and location radars. Advanced forms may take the form of a `blased' topology, in which height as well as line and space dimensioning are engineered. This allows more complicated beam steering and wave interaction along the grating, promising better control over efficiency and more diverse engineering application. Planar lenses are being investigated as a method of coupling optical signals to the substrate. Realizing these devices also requires modification of the host substrate in three dimensions and is a difficult technological hurdle. Inherently low contrast resists can be shaped with the aid of clever processing techniques and have been classically used to obtain smaller line widths than the lithography technique would have normally allowed. In this work we utilize an experimental negative tone resist formulation to realize three dimensional features on GaAs substrates. The negative tone resist of interest, P(SI-CMS)-20, is under development (AT&T Bell Labs, Murray Hill, NJ) as a high performance single component system to be used in the fabrication of x-ray masks. Its properties include high resolution and the more unusual ability to faithfully retain a post processed film thickness that is primarily dependent upon e-beam dose, while using a fixed post exposure processing methodology. A curve of film thickness retention versus dose is then selected to define a required post exposure processed film thickness. A nominal 200 nm thick film is first spun onto the GaAs host wafer and softbaked. A Leica EBMF-10.5 vector scan electron beam lithography tool working at 25 KeV beam energy is used for patterning. A saw tooth or step ramping in processed resist height may now be achieved with a series of single pass lines or small areal features of successively higher dose density. The minimum dose corresponds to the minimum incipient gel of the resist and clears the foot of the

  4. Combined dose and geometry correction (DMG) for low energy multi electron beam lithography (5kV): application to the 16nm node

    NASA Astrophysics Data System (ADS)

    Martin, Luc; Manakli, Serdar; Bayle, Sebastien; Belledent, Jérôme; Soulan, Sebastien; Wiedemann, Pablo; Farah, Abdi; Schiavone, Patrick

    2012-03-01

    Lithography faces today many challenges to meet the ITRS road-map. 193nm is still today the only existing industrial option to address high volume production for the 22nm node. Nevertheless to achieve such a resolution, double exposure is mandatory for critical level patterning. EUV lithography is still challenged by the availability of high power source and mask defectivity and suffers from a high cost of ownership perspective. Its introduction is now not foreseen before 2015. Parallel to these mask-based technologies, maskless lithography regularly makes significant progress in terms of potential and maturity. The massively parallel e-beam solution appears as a real candidate for high volume manufacturing. Several industrial projects are under development, one in the US, with the KLA REBL project and two in Europe driven by IMS Nanofabrication (Austria; MAPPER (The Netherlands). Among the developments to be performed to secure the takeoff of the multi-beam technology, the availability of a rapid and robust data treatment solution will be one of the major challenges. Within this data preparation flow, advanced proximity effect corrections must be implemented to address the 16nm node and below. This paper will detail this process and compare correction strategies in terms of robustness and accuracy. It will be based on results obtained using a MAPPER tool within the IMAGINE program driven by CEA-LETI, in Grenoble, France. All proximity effects corrections and the dithering step were performed using the software platform Inscale® from Aselta Nanographics. One important advantage of Inscale® is the ability to combine both model based dose and geometry adjustment to accurately pattern critical features. The paper will focus on the advantage of combining those two corrections at the 16nm node instead of using only geometry corrections. Thanks to the simulation capability of Inscale®, pattern fidelity and correction robustness will be evaluated and compared between

  5. Multiplex lithography for multilevel multiscale architectures and its application to polymer electrolyte membrane fuel cell

    PubMed Central

    Cho, Hyesung; Moon Kim, Sang; Sik Kang, Yun; Kim, Junsoo; Jang, Segeun; Kim, Minhyoung; Park, Hyunchul; Won Bang, Jung; Seo, Soonmin; Suh, Kahp-Yang; Sung, Yung-Eun; Choi, Mansoo

    2015-01-01

    The production of multiscale architectures is of significant interest in materials science, and the integration of those structures could provide a breakthrough for various applications. Here we report a simple yet versatile strategy that allows for the LEGO-like integrations of microscale membranes by quantitatively controlling the oxygen inhibition effects of ultraviolet-curable materials, leading to multilevel multiscale architectures. The spatial control of oxygen concentration induces different curing contrasts in a resin allowing the selective imprinting and bonding at different sides of a membrane, which enables LEGO-like integration together with the multiscale pattern formation. Utilizing the method, the multilevel multiscale Nafion membranes are prepared and applied to polymer electrolyte membrane fuel cell. Our multiscale membrane fuel cell demonstrates significant enhancement of performance while ensuring mechanical robustness. The performance enhancement is caused by the combined effect of the decrease of membrane resistance and the increase of the electrochemical active surface area. PMID:26412619

  6. Multiplex lithography for multilevel multiscale architectures and its application to polymer electrolyte membrane fuel cell

    NASA Astrophysics Data System (ADS)

    Cho, Hyesung; Moon Kim, Sang; Sik Kang, Yun; Kim, Junsoo; Jang, Segeun; Kim, Minhyoung; Park, Hyunchul; Won Bang, Jung; Seo, Soonmin; Suh, Kahp-Yang; Sung, Yung-Eun; Choi, Mansoo

    2015-09-01

    The production of multiscale architectures is of significant interest in materials science, and the integration of those structures could provide a breakthrough for various applications. Here we report a simple yet versatile strategy that allows for the LEGO-like integrations of microscale membranes by quantitatively controlling the oxygen inhibition effects of ultraviolet-curable materials, leading to multilevel multiscale architectures. The spatial control of oxygen concentration induces different curing contrasts in a resin allowing the selective imprinting and bonding at different sides of a membrane, which enables LEGO-like integration together with the multiscale pattern formation. Utilizing the method, the multilevel multiscale Nafion membranes are prepared and applied to polymer electrolyte membrane fuel cell. Our multiscale membrane fuel cell demonstrates significant enhancement of performance while ensuring mechanical robustness. The performance enhancement is caused by the combined effect of the decrease of membrane resistance and the increase of the electrochemical active surface area.

  7. Multiplex lithography for multilevel multiscale architectures and its application to polymer electrolyte membrane fuel cell.

    PubMed

    Cho, Hyesung; Moon Kim, Sang; Sik Kang, Yun; Kim, Junsoo; Jang, Segeun; Kim, Minhyoung; Park, Hyunchul; Won Bang, Jung; Seo, Soonmin; Suh, Kahp-Yang; Sung, Yung-Eun; Choi, Mansoo

    2015-01-01

    The production of multiscale architectures is of significant interest in materials science, and the integration of those structures could provide a breakthrough for various applications. Here we report a simple yet versatile strategy that allows for the LEGO-like integrations of microscale membranes by quantitatively controlling the oxygen inhibition effects of ultraviolet-curable materials, leading to multilevel multiscale architectures. The spatial control of oxygen concentration induces different curing contrasts in a resin allowing the selective imprinting and bonding at different sides of a membrane, which enables LEGO-like integration together with the multiscale pattern formation. Utilizing the method, the multilevel multiscale Nafion membranes are prepared and applied to polymer electrolyte membrane fuel cell. Our multiscale membrane fuel cell demonstrates significant enhancement of performance while ensuring mechanical robustness. The performance enhancement is caused by the combined effect of the decrease of membrane resistance and the increase of the electrochemical active surface area. PMID:26412619

  8. High throughput optical lithography by scanning a massive array of bowtie aperture antennas at near-field

    NASA Astrophysics Data System (ADS)

    Wen, X.; Datta, A.; Traverso, L. M.; Pan, L.; Xu, X.; Moon, E. E.

    2015-11-01

    Optical lithography, the enabling process for defining features, has been widely used in semiconductor industry and many other nanotechnology applications. Advances of nanotechnology require developments of high-throughput optical lithography capabilities to overcome the optical diffraction limit and meet the ever-decreasing device dimensions. We report our recent experimental advancements to scale up diffraction unlimited optical lithography in a massive scale using the near field nanolithography capabilities of bowtie apertures. A record number of near-field optical elements, an array of 1,024 bowtie antenna apertures, are simultaneously employed to generate a large number of patterns by carefully controlling their working distances over the entire array using an optical gap metrology system. Our experimental results reiterated the ability of using massively-parallel near-field devices to achieve high-throughput optical nanolithography, which can be promising for many important nanotechnology applications such as computation, data storage, communication, and energy.

  9. High throughput optical lithography by scanning a massive array of bowtie aperture antennas at near-field

    PubMed Central

    Wen, X.; Datta, A.; Traverso, L. M.; Pan, L.; Xu, X.; Moon, E. E.

    2015-01-01

    Optical lithography, the enabling process for defining features, has been widely used in semiconductor industry and many other nanotechnology applications. Advances of nanotechnology require developments of high-throughput optical lithography capabilities to overcome the optical diffraction limit and meet the ever-decreasing device dimensions. We report our recent experimental advancements to scale up diffraction unlimited optical lithography in a massive scale using the near field nanolithography capabilities of bowtie apertures. A record number of near-field optical elements, an array of 1,024 bowtie antenna apertures, are simultaneously employed to generate a large number of patterns by carefully controlling their working distances over the entire array using an optical gap metrology system. Our experimental results reiterated the ability of using massively-parallel near-field devices to achieve high-throughput optical nanolithography, which can be promising for many important nanotechnology applications such as computation, data storage, communication, and energy. PMID:26525906

  10. Partially Coherent Quantitative Phase Retrieval with Applications to Extreme Ultraviolet Lithography

    NASA Astrophysics Data System (ADS)

    Claus, Rene Andre

    This dissertation presents a new quantitative phase retrieval algorithm that fully models partially coherent imaging in microscopes. Unlike existing algorithms, our algorithm fully considers the pupil function and illumination by using the Weak Object Transfer Function (WOTF). Using an iterative approach, we extend the applicability of the WOTF beyond weakly scattering objects. This allows almost any measurement to be used during phase retrieval. As an example of how this feature can be used to invent practical new measurement schemes, we present the illumination switched pupil. This measurement uses a phase contrast objective and varied illumination to maximize the sensitivity of the microscope to both the phase and amplitude of the sample. Using only two images, the complex field can be recovered with high sensitivity at almost all spatial frequencies. A complete model of imaging in the microscope enables self-calibration of the measurements and improved phase retrieval. Since all important characteristics of the microscope can be incorporated, an optimization over critical parameters, such as the best focus position and image alignment, can be performed after the images have been captured. This allows errors in the calibration to be corrected after the measurements have been performed, improving the accuracy of the recovered field while simplifying the experiments. To verify and apply the algorithm experimentally, we have performed phase retrieval measurements of Extreme Ultraviolet (EUV) photomasks on the zone plate microscope, SHARP, at Lawrence Berkeley National Laboratory (LBNL). Phase retrieval has enabled the quantitative analysis of multilayer roughness and defects. Experiments, comparing the size of defects measured using phase retrieval to measurements performed by AFM, indicate that AFM consistently underestimates the effective height of the buried multilayer defects by 1 nm. Other measurements of defects, comparing the recovered field extracted from

  11. Hybrid lithography for triple patterning decomposition and E-beam lithography

    NASA Astrophysics Data System (ADS)

    Tian, Haitong; Zhang, Hongbo; Xiao, Zigang; Wong, Martin D. F.

    2014-03-01

    As we advances into 14/10nm technology node, single patterning technology is far from enough to fabricate the features with shrinking feature size. According to International Technology Roadmap for Semiconductors in 2011,1 double patterning lithography is already available for massive productions in industry for sub-32nm half pitch technology node. For 14/10nm technology node, double patterning begins to show its limitations as it uses too many stitches to resolve the native coloring conflicts. Stitches will increase the manufacturing cost, lead to potential functional errors of the chip, and cause the yield lost. Triple patterning lithography and E-Beam lithography are two emerging techniques to beat the diffraction limit for current optical lithography system. In this paper, we investigate combining the merits of triple patterning lithography and E-Beam lithography for standard cell based designs. We devise an approach to compute a stitch free decomposition with the optimal number of E-Beam shots for row structure layout. The approach is expected to highlight the necessity and advantages of using hybrid lithography for advanced technology node.

  12. A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist

    NASA Astrophysics Data System (ADS)

    Srinivasa Rao, Vempati; Kripesh, Vaidyanathan; Yoon, Seung Wook; Tay, Andrew A. O.

    2006-09-01

    The development of thick photoresist molds using JSR THB-151N negative tone UV photoresist for the electroplating of interconnects in advanced packaging technologies has been demonstrated. Two different thick photoresist molds 65 and 130 µm high with aspect ratios of up to 2.6 have been fabricated with good reproducibility using single and double coating processes. Optimized lithography parameters using a UV aligner to achieve straight and near-vertical side-wall profiles are also reported. Near-vertical side walls similar to that obtained using SU-8 photoresist have been obtained. JSR photoresist has been found to be easily striped with no residues in solvent stripper solutions, making it suitable for wafer bumping applications and the processing of MEMS devices. Through-mold electroplating of copper and solder is also demonstrated. The simultaneous fabrication of 1167 000 high density interconnects on 8 inch wafers, using lithography and electroplating technologies, is also reported.

  13. Implementation of KrF DBARCs for implant applications on advanced lithography nodes

    NASA Astrophysics Data System (ADS)

    Lowes, Joyce; Guerrero, Alice; Weigand, Michael; Washburn, Carlton; Stroud, Charlyn; Sharma, Shalini; Torres, David; Slezak, Mark; Dabbagh, Gary; Tang, Cherry

    2011-04-01

    Traditional implant layers are becoming increasingly complex in design and continuously pushing resolution limits lower. In response, developer-soluble bottom anti-reflective coatings (DBARCs) were introduced to meet these more challenging requirements. These DBARCs excelled over the traditional combination of single-layer resist and dyed resist/top anti-reflective coating (TARC). DBARCs offered the resolution and critical dimension (CD) control needed for the increasingly critical implant layers. Lithographic performance, focusing on CD control over topography and through-pitch behavior, demonstrated the inherent benefit of the DBARCs over the alternative solutions. Small-space residue testing showed the benefit of photosensitive (PS) DBARCs for cleanout of sub-100 nm trenches. A study of improved post-develop residue in various ion-implantation processes validated the use of new DBARC materials in implant layers.

  14. Application of advanced materials to rotating machines

    NASA Technical Reports Server (NTRS)

    Triner, J. E.

    1983-01-01

    In discussing the application of advanced materials to rotating machinery, the following topics are covered: the torque speed characteristics of ac and dc machines, motor and transformer losses, the factors affecting core loss in motors, advanced magnetic materials and conductors, and design tradeoffs for samarium cobalt motors.

  15. Aerospace applications of advanced aluminum alloys

    NASA Technical Reports Server (NTRS)

    Chellman, D. J.; Langenbeck, S. L.

    1993-01-01

    Advanced metallic materials within the Al-base family are being developed for applications on current and future aerospace vehicles. These advanced materials offer significant improvements in density, strength, stiffness, fracture resistance, and/or higher use temperature which translates into improved vehicle performance. Aerospace applications of advanced metallic materials include space structures, fighters, military and commercial transport aircraft, and missiles. Structural design requirements, including not only static and durability/damage tolerance criteria but also environmental considerations, drive material selections. Often trade-offs must be made regarding strength, fracture resistance, cost, reliability, and maintainability in order to select the optimum material for a specific application. These trade studies not only include various metallic materials but also many times include advanced composite materials. Details of material comparisons, aerospace applications, and material trades will be presented.

  16. 450mm wafer patterning with jet and flash imprint lithography

    NASA Astrophysics Data System (ADS)

    Thompson, Ecron; Hellebrekers, Paul; Hofemann, Paul; LaBrake, Dwayne L.; Resnick, Douglas J.; Sreenivasan, S. V.

    2013-09-01

    The next step in the evolution of wafer size is 450mm. Any transition in sizing is an enormous task that must account for fabrication space, environmental health and safety concerns, wafer standards, metrology capability, individual process module development and device integration. For 450mm, an aggressive goal of 2018 has been set, with pilot line operation as early as 2016. To address these goals, consortiums have been formed to establish the infrastructure necessary to the transition, with a focus on the development of both process and metrology tools. Central to any process module development, which includes deposition, etch and chemical mechanical polishing is the lithography tool. In order to address the need for early learning and advance process module development, Molecular Imprints Inc. has provided the industry with the first advanced lithography platform, the Imprio® 450, capable of patterning a full 450mm wafer. The Imprio 450 was accepted by Intel at the end of 2012 and is now being used to support the 450mm wafer process development demands as part of a multi-year wafer services contract to facilitate the semiconductor industry's transition to lower cost 450mm wafer production. The Imprio 450 uses a Jet and Flash Imprint Lithography (J-FILTM) process that employs drop dispensing of UV curable resists to assist high resolution patterning for subsequent dry etch pattern transfer. The technology is actively being used to develop solutions for markets including NAND Flash memory, patterned media for hard disk drives and displays. This paper reviews the recent performance of the J-FIL technology (including overlay, throughput and defectivity), mask development improvements provided by Dai Nippon Printing, and the application of the technology to a 450mm lithography platform.

  17. Wafer scale fabrication of submicron chessboard gratings using phase masks in proximity lithography

    NASA Astrophysics Data System (ADS)

    Stuerzebecher, Lorenz; Harzendorf, Torsten; Fuchs, Frank; Zeitner, Uwe D.

    2012-03-01

    One and two dimensional grating structures with submicron period have a huge number of applications in optics and photonics. Such structures are conventionally fabricated using interference or e-beam lithography. However, both technologies have significant drawbacks. Interference lithography is limited to rather simple geometries and the sequential writing scheme of e-beam lithography leads to time consuming exposures for each grating. We present a novel fabrication technique for this class of microstructures which is based on proximity lithography in a mask aligner. The technology is capable to pattern a complete wafer within less than one minute of exposure time and offers thereby high lateral resolution and a reliable process. Our advancements compared to standard mask aligner lithography are twofold: First of all, we are using periodic binary phase masks instead of chromium masks to generate an aerial image of high resolution and exceptional light efficiency at certain distances behind the mask. Second, a special mask aligner illumination set-up is employed which allows to precisely control the incidence angles of the exposure light. This degree of freedom allows both, to shape the aerial image (e. g. transformation of a periodic spot pattern into a chessboard pattern) and to increase its depth of focus considerably. That way, our technology enables the fabrication of high quality gratings with arbitrary geometry in a fast and stable wafer scale process.

  18. NAS Applications and Advanced Algorithms

    NASA Technical Reports Server (NTRS)

    Bailey, David H.; Biswas, Rupak; VanDerWijngaart, Rob; Kutler, Paul (Technical Monitor)

    1997-01-01

    This paper examines the applications most commonly run on the supercomputers at the Numerical Aerospace Simulation (NAS) facility. It analyzes the extent to which such applications are fundamentally oriented to vector computers, and whether or not they can be efficiently implemented on hierarchical memory machines, such as systems with cache memories and highly parallel, distributed memory systems.

  19. Feasibility study of optical/e-beam complementary lithography

    NASA Astrophysics Data System (ADS)

    Hohle, Christoph; Choi, Kang-Hoon; Freitag, Martin; Gutsch, Manuela; Jaschinsky, Philipp; Kahlenberg, Frank; Klein, Christof; Klikovits, Jan; Paul, Jan; Rudolph, Matthias; Thrun, Xaver

    2012-03-01

    Using electron beam direct write (EBDW) as a complementary approach together with standard optical lithography at 193nm or EUV wavelength has been proposed only lately and might be a reasonable solution for low volume CMOS manufacturing and special applications as well as design rule restrictions. Here, the high throughput of the optical litho can be combined with the high resolution and the high flexibility of the e-beam by using a mix & match approach (Litho- Etch-Litho-Etch, LELE). Complementary Lithography is mainly driven by special design requirements for unidirectional (1-D gridded) Manhattan type design layouts that enable scaling of advanced logic chips. This requires significant data prep efforts such as layout splitting. In this paper we will show recent results of Complementary Lithography using 193nm immersion generated 50nm lines/space pattern addressing the 32nm logic technology node that were cut with electron beam direct write. Regular lines and space arrays were patterned at GLOBALFOUNDRIES Dresden and have been cut in predefined areas using a VISTEC SB3050DW e-beam direct writer (50KV Variable Shaped Beam) at Fraunhofer Center Nanoelectronic Technologies (CNT), Dresden, as well as on the PML2 tool at IMS Nanofabrication, Vienna. Two types of e-beam resists were used for the cut exposure. Integration issues as well as overlay requirements and performance improvements necessary for this mix & match approach will be discussed.

  20. Towards advanced OCT clinical applications

    NASA Astrophysics Data System (ADS)

    Kirillin, Mikhail; Panteleeva, Olga; Agrba, Pavel; Pasukhin, Mikhail; Sergeeva, Ekaterina; Plankina, Elena; Dudenkova, Varvara; Gubarkova, Ekaterina; Kiseleva, Elena; Gladkova, Natalia; Shakhova, Natalia; Vitkin, Alex

    2015-07-01

    In this paper we report on our recent achievement in application of conventional and cross-polarization OCT (CP OCT) modalities for in vivo clinical diagnostics in different medical areas including gynecology, dermatology, and stomatology. In gynecology, CP OCT was employed for diagnosing fallopian tubes and cervix; in dermatology OCT for monitoring of treatment of psoriasis, scleroderma and atopic dermatitis; and in stomatology for diagnosis of oral diseases. For all considered application, we propose and develop different image processing methods which enhance the diagnostic value of the technique. In particular, we use histogram analysis, Fourier analysis and neural networks, thus calculating different tissue characteristics as revealed by OCT's polarization evolution. These approaches enable improved OCT image quantification and increase its resultant diagnostic accuracy.

  1. Nanoscale Advances in Catalysis and Energy Applications

    SciTech Connect

    Li, Yimin; Somorjai, Gabor A.

    2010-05-12

    In this perspective, we present an overview of nanoscience applications in catalysis, energy conversion, and energy conservation technologies. We discuss how novel physical and chemical properties of nanomaterials can be applied and engineered to meet the advanced material requirements in the new generation of chemical and energy conversion devices. We highlight some of the latest advances in these nanotechnologies and provide an outlook at the major challenges for further developments.

  2. Soft Lithography Using Nectar Droplets.

    PubMed

    Biswas, Saheli; Chakrabarti, Aditi; Chateauminois, Antoine; Wandersman, Elie; Prevost, Alexis M; Chaudhury, Manoj K

    2015-12-01

    In spite of significant advances in replication technologies, methods to produce well-defined three-dimensional structures are still at its infancy. Such a limitation would be evident if we were to produce a large array of simple and, especially, compound convex lenses, also guaranteeing that their surfaces would be molecularly smooth. Here, we report a novel method to produce such structures by cloning the 3D shape of nectar drops, found widely in nature, using conventional soft lithography.The elementary process involves transfer of a thin patch of the sugar solution coated on a glass slide onto a hydrophobic substrate on which this patch evolves into a microdroplet. Upon the absorption of water vapor, such a microdroplet grows linearly with time, and its final size can be controlled by varying its exposure time to water vapor. At any stage of the evolution of the size of the drop, its shape can be cloned onto a soft elastomer by following the well-known methods of molding and cross-linking the same. A unique new science that emerges in our attempt to understand the transfer of the sugar patch and its evolution to a spherical drop is the elucidation of the mechanics underlying the contact of a deformable sphere against a solid support intervening a thin liquid film. A unique aspect of this work is to demonstrate that higher level structures can also be generated by transferring even smaller nucleation sites on the surface of the primary lenses and then allowing them to grow by absorption of water vapor. What results at the end is either a well-controlled distribution of smooth hemispherical lenses or compound structures that could have potential applications in the fundamental studies of contact mechanics, wettability, and even in optics. PMID:26563988

  3. Signature molecular descriptor : advanced applications.

    SciTech Connect

    Visco, Donald Patrick, Jr.

    2010-04-01

    In this work we report on the development of the Signature Molecular Descriptor (or Signature) for use in the solution of inverse design problems as well as in highthroughput screening applications. The ultimate goal of using Signature is to identify novel and non-intuitive chemical structures with optimal predicted properties for a given application. We demonstrate this in three studies: green solvent design, glucocorticoid receptor ligand design and the design of inhibitors for Factor XIa. In many areas of engineering, compounds are designed and/or modified in incremental ways which rely upon heuristics or institutional knowledge. Often multiple experiments are performed and the optimal compound is identified in this brute-force fashion. Perhaps a traditional chemical scaffold is identified and movement of a substituent group around a ring constitutes the whole of the design process. Also notably, a chemical being evaluated in one area might demonstrate properties very attractive in another area and serendipity was the mechanism for solution. In contrast to such approaches, computer-aided molecular design (CAMD) looks to encompass both experimental and heuristic-based knowledge into a strategy that will design a molecule on a computer to meet a given target. Depending on the algorithm employed, the molecule which is designed might be quite novel (re: no CAS registration number) and/or non-intuitive relative to what is known about the problem at hand. While CAMD is a fairly recent strategy (dating to the early 1980s), it contains a variety of bottlenecks and limitations which have prevented the technique from garnering more attention in the academic, governmental and industrial institutions. A main reason for this is how the molecules are described in the computer. This step can control how models are developed for the properties of interest on a given problem as well as how to go from an output of the algorithm to an actual chemical structure. This report

  4. Advanced Materials for Automotive Application

    NASA Astrophysics Data System (ADS)

    Tisza, M.

    2013-12-01

    In this paper some recent material developments will be overviewed mainly from the point of view of automotive industry. In car industry, metal forming is one of the most important manufacturing processes imposing severe restrictions on materials; these are often contradictory requirements, e.g. high strength simultaneously with good formability, etc. Due to these challenges and the ever increasing demand new material classes have been developed; however, the more and more wide application of high strength materials meeting the requirements stated by the mass reduction lead to increasing difficulties concerning the formability which requires significant technological developments as well. In this paper, the recent materials developments will be overviewed from the point of view of the automotive industry.

  5. Survey of Advanced Applications Over ACTS

    NASA Technical Reports Server (NTRS)

    Bauer, Robert; McMasters, Paul

    2000-01-01

    The Advanced Communications Technology Satellite (ACTS) system provided a national testbed that enabled advanced applications to be tested and demonstrated over a live satellite link. Of the applications that used ACTS. some offered unique advantages over current methods, while others simply could not be accommodated by conventional systems. The initial technical and experiments results of the program were reported at the 1995 ACTS Results Conference. in Cleveland, Ohio. Since then, the Experiments Program has involved 45 new experiments comprising 30 application experiments and 15 technology related experiments that took advantage of the advanced technologies and unique capabilities offered by ACTS. The experiments are categorized and quantified to show the organizational mix of the experiments program and relative usage of the satellite. Since paper length guidelines preclude each experiment from being individually reported, the application experiments and significant demonstrations are surveyed to show the breadth of the activities that have been supported. Experiments in a similar application category are collectively discussed, such as. telemedicine. or networking and protocol evaluation. Where available. experiment conclusions and impact are presented and references of results and experiment information are provided. The quantity and diversity of the experiments program demonstrated a variety of service areas for the next generation of commercially available, advanced satellite communications.

  6. Advances in DOE modeling and optical performance for SMO applications

    NASA Astrophysics Data System (ADS)

    Carriere, James; Stack, Jared; Childers, John; Welch, Kevin; Himel, Marc D.

    2010-04-01

    The introduction of source mask optimization (SMO) to the design process addresses an urgent need for the 32nm node and beyond as alternative lithography approaches continue to push out. To take full advantage of SMO routines, an understanding of the characteristic properties of diffractive optical elements (DOEs) is required. Greater flexibility in the DOE output is needed to optimize lithographic process windows. In addition, new and tighter constraints on the DOEs used for off-axis illumination (OAI) are being introduced to precisely predict, control and reduce the effects of pole imbalance and stray light on the CD budget. We present recent advancements in the modeling and optical performance of these DOEs.

  7. Deep X-Ray Lithography Based Fabrication of Rare-Earth Based Permanent Magnets and their Applications to Microactuators

    SciTech Connect

    Christenson, T.R.; Garino, T.J.; Venturini, E.L.

    1999-01-27

    Precision high aspect-ratio micro molds constructed by deep x-ray lithography have been used to batch fabricate accurately shaped bonded rare-earth based permanent magnets with features as small as 5 microns and thicknesses up to 500 microns. Maximum energy products of up to 8 MGOe have been achieved with a 20%/vol. epoxy bonded melt-spun isotropic Nd2Fe14b powder composite. Using individually processed sub- millimeter permanent sections multipole rotors have been assembled. Despite the fact that these permanent magnet structures are small, their magnetic field producing capability remains the same as at any scale. Combining permanent magnet structures with soft magnetic materials and micro-coils makes possible new and more efficient magnetic microdevices.

  8. Advanced Ceramic Materials for Future Aerospace Applications

    NASA Technical Reports Server (NTRS)

    Misra, Ajay

    2015-01-01

    With growing trend toward higher temperature capabilities, lightweight, and multifunctionality, significant advances in ceramic matrix composites (CMCs) will be required for future aerospace applications. The presentation will provide an overview of material requirements for future aerospace missions, and the role of ceramics and CMCs in meeting those requirements. Aerospace applications will include gas turbine engines, aircraft structure, hypersonic and access to space vehicles, space power and propulsion, and space communication.

  9. Advanced Laboratory NMR Spectrometer with Applications.

    ERIC Educational Resources Information Center

    Biscegli, Clovis; And Others

    1982-01-01

    A description is given of an inexpensive nuclear magnetic resonance (NMR) spectrometer suitable for use in advanced laboratory courses. Applications to the nondestructive analysis of the oil content in corn seeds and in monitoring the crystallization of polymers are presented. (SK)

  10. Development of MOEMS technology in maskless lithography

    NASA Astrophysics Data System (ADS)

    Smith, David; Klenk, Dieter

    2009-02-01

    Micro-opto-electro-mechanical-systems (MOEMS) have proven to be a facilitating technology in the lithography industry. Recently, there have been significant advancements in digital micromirror device (DMD) based maskless lithography. These advancements have been in the areas of throughput, resolution, accuracy, and cost reduction. This progression in digital micromirror evolution provides considerable opportunities to displace existing lithographic techniques. Precise control of the individual mircormirrors, including scrolling, and full utilization of the FPGA, have allowed DMD-based lithography systems to reach new levels of throughput and repeatability, while reducing production and warranty costs. Throughput levels have far surpassed scanning laser techniques. Chip level cooling technologies allow for higher incident power to be reliably distributed over larger areas of the substrate. Resolution roadmaps are in place to migrate from the current 2400dpi (11μm) to 4800dpi (5.3μm). Without the constraints of mask requirements, mask alignment, storage, and defect analysis are not required, thus increasing accuracy and reducing cost. This contribution will examine the advancements in and benefits of DMD based maskless lithography.

  11. Triple AIM evaluation and application in advanced node

    NASA Astrophysics Data System (ADS)

    Wang, Gary C.; Lio, En Chuan; Hung, Yuting; Chen, Charlie; Wang, Sybil; Weng, Tang Chun; Lin, Bill; Yu, Chun Chi

    2016-03-01

    A novel method on advanced node for IBO (Image Based Overlay) data extraction accuracy is demonstrated in this work, and here some special design in triple-AIM (Advanced Imaging Metrology) is able to realize the approach. Since triple AIM design has 3 locations left for patterning layers insertion, a new design with 2 layers locations, location-A (inner) and location-B (middle), are generated by 1st pattering, i.e. once lithography exposure, and the 2 marks grouping are formed on dielectric through lithography and etching process with a predetermined overlay "zero offset" through original mask layout design, as illustrated in Fig. (1). And then, as following top photo resist layer, assumed location-C (outer), lithography patterning process, PR coating, exposure and development complete, full triple-AIM patterns is generated, and 3 sets of overlay data could be obtained, A to B, C to B, C to A. Through re-calculating the overlay raw data of current (2nd patterning layer) to previous (1st patterning layer) layer by averaging [C to B] and [C to A], then theoretically the data extraction of sites would be more accuracy, since the variation of local marks signal, induced by inline process instability, could be minimized through the raw data averaging procedure. Moreover, from raw data [A to B], an extra monitor function for detections of the inline process variation, marks selection and recipe setting optimization could be obtained, since marks in [A] and [BB] locations are both generated in 1st patterning, and with the target "zero". So if the raw data [A to BB] is bigger or smaller than "zero" in some degree, there should be some process issue or marks condition setting error in triple-AIM design.

  12. Defectivity reduction by optimization of 193-nm immersion lithography using an interfaced exposure-track system

    NASA Astrophysics Data System (ADS)

    Carcasi, Michael; Hatakeyama, Shinichi; Nafus, Kathleen; Moerman, Richard; van Dommelen, Youri; Huisman, Peter; Hooge, Joshua; Scheer, Steven; Foubert, Philippe

    2006-03-01

    As the integration of semiconductor devices continues, pattern sizes required in lithography get smaller and smaller. To achieve even more scaling down of these patterns without changing the basic infrastructure technology of current cutting-edge 193-nm lithography, 193-nm immersion lithography is being viewed as a powerful technique that can accommodate next-generation mass productions needs. Therefore this technology has been seriously considered and after proof of concept it is currently entering the stage of practical application. In the case of 193-nm immersion lithography, however, because liquid fills the area between the projection optics and the silicon wafer, several causes of concern have been raised - namely, diffusion of moisture into the resist film due to direct resist-water interaction during exposure, dissolution of internal components of the resist into the de-ionized water, and the influence of residual moisture generated during exposure on post-exposure processing. To prevent these unwanted effects, optimization of the three main components of the lithography system: materials, track and scanner, is required. For the materials, 193nm resist formulation improvements specifically for immersion processing have reduced the leaching and the sensitivity to water related defects, further benefits can be seen by the application of protective top coat materials. For the track component, optimization of the processing conditions and immersion specific modules are proven to advance the progress made by the material suppliers. Finally, by optimizing conditions on the 3 rd generation immersion scanner with the latest hardware configuration, defectivity levels comparable to dry processing can be achieved. In this evaluation, we detail the improvements that can be realized with new immersion specific track rinse modules and formulate a hypothesis for the improvements seen with the rinsing process. Additionally, we show the current status of water induced

  13. Maskless, resistless ion beam lithography

    SciTech Connect

    Ji, Qing

    2003-03-10

    As the dimensions of semiconductor devices are scaled down, in order to achieve higher levels of integration, optical lithography will no longer be sufficient for the needs of the semiconductor industry. Alternative next-generation lithography (NGL) approaches, such as extreme ultra-violet (EUV), X-ray, electron-beam, and ion projection lithography face some challenging issues with complicated mask technology and low throughput. Among the four major alternative NGL approaches, ion beam lithography is the only one that can provide both maskless and resistless patterning. As such, it can potentially make nano-fabrication much simpler. This thesis investigates a focused ion beam system for maskless, resistless patterning that can be made practical for high-volume production. In order to achieve maskless, resistless patterning, the ion source must be able to produce a variety of ion species. The compact FIB system being developed uses a multicusp plasma ion source, which can generate ion beams of various elements, such as O{sub 2}{sup +}, BF{sub 2}{sup +}, P{sup +} etc., for surface modification and doping applications. With optimized source condition, around 85% of BF{sub 2}{sup +}, over 90% of O{sub 2}{sup +} and P{sup +} have been achieved. The brightness of the multicusp-plasma ion source is a key issue for its application to maskless ion beam lithography. It can be substantially improved by optimizing the source configuration and extractor geometry. Measured brightness of 2 keV He{sup +} beam is as high as 440 A/cm{sup 2} {center_dot} Sr, which represents a 30x improvement over prior work. Direct patterning of Si thin film using a focused O{sub 2}{sup +} ion beam has been investigated. A thin surface oxide film can be selectively formed using 3 keV O{sub 2}{sup +} ions with the dose of 10{sup 15} cm{sup -2}. The oxide can then serve as a hard mask for patterning of the Si film. The process flow and the experimental results for directly patterned poly-Si features

  14. Advanced energy storage for space applications: A follow-up

    NASA Technical Reports Server (NTRS)

    Halpert, Gerald; Surampudi, Subbarao

    1994-01-01

    Viewgraphs on advanced energy storage for space applications are presented. Topics covered include: categories of space missions using batteries; battery challenges; properties of SOA and advanced primary batteries; lithium primary cell applications; advanced rechargeable battery applications; present limitations of advanced battery technologies; and status of Li-TiS2, Ni-MH, and Na-NiCl2 cell technologies.

  15. Optimization of extreme ultraviolet photons emission and collection in mass-limited laser produced plasmas for lithography application

    SciTech Connect

    Sizyuk, T.; Hassanein, A.

    2012-08-01

    The progress in development of commercial system for next generation EUV lithography requires, among other factors, significant improvement in EUV photon sources such as discharge produced plasma (DPP) and laser produced plasma (LPP) devices. There are still many uncertainties in determining the optimum device since there are many parameters for the suitable and efficient energy source and target configuration and size. Complex devices with trigger lasers in DPP or with pre-pulsing in LPP provide wide area for optimization in regards to conversion efficiency (CE) and components lifetime. We considered in our analysis a promising LPP source configuration using 10-30 {mu}m tin droplet targets, and predicted conditions for the most efficient EUV radiation output and collection as well as calculating photons source location and size. We optimized several parameters of dual-beam lasers and their relationship to target size. We used our HEIGHTS comprehensive and integrated full 3D simulation package to study and optimize LPP processes with various target sizes to maximize the CE of the system.

  16. Fabrication of gold-deposited plasmonic crystal based on nanoimprint lithography for label-free biosensing application

    NASA Astrophysics Data System (ADS)

    Nishiguchi, Kiichi; Sueyoshi, Kenji; Hisamoto, Hideaki; Endo, Tatsuro

    2016-08-01

    Here, we developed a highly sensitive label-free plasmonic crystal (PC). The PC is composed of two types of nanoperiodic metal structures, nanodiscs and nanohole arrays, fabricated simultaneously by nanoimprint lithography using a nanostructured polymer mold. The PC absorbed light at specific wavelengths based on localized surface plasmon resonance (LSPR). The strongly enhanced electric field was excited by the combined structures of nanodiscs and nanohole arrays; thus, highly sensitive biosensing was possible. The LSPR-based optical characteristics of the PC were analyzed by finite-difference time-domain simulation; the structure (metal layer thickness) was optimized to respond to changes in the surrounding refractive index with high sensitivity. PC-based biosensor chips were prepared by immobilizing anti-human immunoglobulin G, which was successfully detected in the 200 pg/mL to 200 ng/mL range. Our approach introduces an easy and rapid process allowing large-area fabrication of PCs, resulting in a highly sensitive label-free biosensor device.

  17. Recent advances in vacuum sciences and applications

    NASA Astrophysics Data System (ADS)

    Mozetič, M.; Ostrikov, K.; Ruzic, D. N.; Curreli, D.; Cvelbar, U.; Vesel, A.; Primc, G.; Leisch, M.; Jousten, K.; Malyshev, O. B.; Hendricks, J. H.; Kövér, L.; Tagliaferro, A.; Conde, O.; Silvestre, A. J.; Giapintzakis, J.; Buljan, M.; Radić, N.; Dražić, G.; Bernstorff, S.; Biederman, H.; Kylián, O.; Hanuš, J.; Miloševič, S.; Galtayries, A.; Dietrich, P.; Unger, W.; Lehocky, M.; Sedlarik, V.; Stana-Kleinschek, K.; Drmota-Petrič, A.; Pireaux, J. J.; Rogers, J. W.; Anderle, M.

    2014-04-01

    Recent advances in vacuum sciences and applications are reviewed. Novel optical interferometer cavity devices enable pressure measurements with ppm accuracy. The innovative dynamic vacuum standard allows for pressure measurements with temporal resolution of 2 ms. Vacuum issues in the construction of huge ultra-high vacuum devices worldwide are reviewed. Recent advances in surface science and thin films include new phenomena observed in electron transport near solid surfaces as well as novel results on the properties of carbon nanomaterials. Precise techniques for surface and thin-film characterization have been applied in the conservation technology of cultural heritage objects and recent advances in the characterization of biointerfaces are presented. The combination of various vacuum and atmospheric-pressure techniques enables an insight into the complex phenomena of protein and other biomolecule conformations on solid surfaces. Studying these phenomena at solid-liquid interfaces is regarded as the main issue in the development of alternative techniques for drug delivery, tissue engineering and thus the development of innovative techniques for curing cancer and cardiovascular diseases. A review on recent advances in plasma medicine is presented as well as novel hypotheses on cell apoptosis upon treatment with gaseous plasma. Finally, recent advances in plasma nanoscience are illustrated with several examples and a roadmap for future activities is presented.

  18. New Advanced Dielectric Materials for Accelerator Applications

    SciTech Connect

    Kanareykin, A.

    2010-11-04

    We present our recent results on the development and experimental testing of advanced dielectric materials that are capable of supporting the high RF electric fields generated by electron beams or pulsed high power microwaves. These materials have been optimized or specially designed for accelerator applications. The materials discussed here include low loss microwave ceramics, quartz, Chemical Vapor Deposition diamonds and nonlinear Barium Strontium Titanate based ferroelectrics.

  19. Tutorial: Advanced fault tree applications using HARP

    NASA Technical Reports Server (NTRS)

    Dugan, Joanne Bechta; Bavuso, Salvatore J.; Boyd, Mark A.

    1993-01-01

    Reliability analysis of fault tolerant computer systems for critical applications is complicated by several factors. These modeling difficulties are discussed and dynamic fault tree modeling techniques for handling them are described and demonstrated. Several advanced fault tolerant computer systems are described, and fault tree models for their analysis are presented. HARP (Hybrid Automated Reliability Predictor) is a software package developed at Duke University and NASA Langley Research Center that is capable of solving the fault tree models presented.

  20. Ion beam lithography system

    DOEpatents

    Leung, Ka-Ngo

    2005-08-02

    A maskless plasma-formed ion beam lithography tool provides for patterning of sub-50 nm features on large area flat or curved substrate surfaces. The system is very compact and does not require an accelerator column and electrostatic beam scanning components. The patterns are formed by switching beamlets on or off from a two electrode blanking system with the substrate being scanned mechanically in one dimension. This arrangement can provide a maskless nano-beam lithography tool for economic and high throughput processing.

  1. Advanced Turbine Technology Applications Project (ATTAP)

    NASA Technical Reports Server (NTRS)

    1989-01-01

    Work to develop and demonstrate the technology of structural ceramics for automotive engines and similar applications is described. Long-range technology is being sought to produce gas turbine engines for automobiles with reduced fuel consumption and reduced environmental impact. The Advanced Turbine Technology Application Project (ATTAP) test bed engine is designed such that, when installed in a 3,000 pound inertia weight automobile, it will provide low emissions, 42 miles per gallon fuel economy on diesel fuel, multifuel capability, costs competitive with current spark ignition engines, and noise and safety characteristics that meet Federal standards.

  2. Environmental Applications of Biosurfactants: Recent Advances

    PubMed Central

    Pacwa-Płociniczak, Magdalena; Płaza, Grażyna A.; Piotrowska-Seget, Zofia; Cameotra, Swaranjit Singh

    2011-01-01

    Increasing public awareness of environmental pollution influences the search and development of technologies that help in clean up of organic and inorganic contaminants such as hydrocarbons and metals. An alternative and eco-friendly method of remediation technology of environments contaminated with these pollutants is the use of biosurfactants and biosurfactant-producing microorganisms. The diversity of biosurfactants makes them an attractive group of compounds for potential use in a wide variety of industrial and biotechnological applications. The purpose of this review is to provide a comprehensive overview of advances in the applications of biosurfactants and biosurfactant-producing microorganisms in hydrocarbon and metal remediation technologies. PMID:21340005

  3. LAVA: lithography analysis using virtual access

    NASA Astrophysics Data System (ADS)

    Hsu, Chang; Yang, Rona; Cheng, Jeffery; Chien, Peter; Wen, Victor; Neureuther, Andrew R.

    1998-06-01

    A web site allowing remote operation of the SPLAT, SAMPLE, TEMPEST and SIMPL simulators has been developed to promote collaborative work on lithography and in particular on EUV technology. Based on the extensive use of platform independent programming languages, LAVA is accessible from all modern computing platforms. The software supporting the web site is available to others in creating similar web site sites and in making simulators such as those from other universities 'play' together. The web site explores new paradigms in remote operation of lithography simulators and introduces more application-oriented modes of interaction with technologists. The LAVA web site URL is http://cuervo.eecs.berkeley.edu/Volcano/

  4. Communication services for advanced network applications.

    SciTech Connect

    Bresnahan, J.; Foster, I.; Insley, J.; Toonen, B.; Tuecke, S.

    1999-06-10

    Advanced network applications such as remote instrument control, collaborative environments, and remote I/O are distinguished by traditional applications such as videoconferencing by their need to create multiple, heterogeneous flows with different characteristics. For example, a single application may require remote I/O for raw datasets, shared controls for a collaborative analysis system, streaming video for image rendering data, and audio for collaboration. Furthermore, each flow can have different requirements in terms of reliability, network quality of service, security, etc. They argue that new approaches to communication services, protocols, and network architecture are required both to provide high-level abstractions for common flow types and to support user-level management of flow creation and quality. They describe experiences with the development of such applications and communication services.

  5. Lithography focus/exposure control and corrections to improve CDU at post etch step

    NASA Astrophysics Data System (ADS)

    Kim, Young Ki; Yelverton, Mark; Tristan, John; Lee, Joungchel; Gutjahr, Karsten; Hsu, Ching-Hsiang; Wei, Hong; Wang, Lester; Li, Chen; Subramany, Lokesh; Chung, Woong Jae; Kim, Jeong Soo; Ramanathan, Vidya; Yap, LipKong; Gao, Jie; Karur-Shanmugam, Ram; Golotsvan, Anna; Herrera, Pedro; Huang, Kevin; Pierson, Bill

    2014-04-01

    As leading edge lithography moves to advanced nodes in high-mix, high-volume manufacturing environment, automated control of critical dimension (CD) within wafer has become a requirement. Current control methods to improve CD uniformity (CDU) generally rely upon the use of field by field exposure corrections via factory automation or through scanner sub-recipe. Such CDU control methods are limited to lithography step and cannot be extended to etch step. In this paper, a new method to improve CDU at post etch step by optimizing exposure at lithography step is introduced. This new solution utilizes GLOBALFOUNDRIES' factory automation system and KLA-Tencor's K-T Analyzer as the infrastructure to calculate and feed the necessary field by field level exposure corrections back to scanner, so as to achieve the optimal CDU at post etch step. CD at post lithography and post etch steps are measured by scatterometry metrology tools respectively and are used by K-T Analyzer as the input for correction calculations. This paper will explain in detail the philosophy as well as the methodology behind this novel CDU control solution. In addition, applications and use cases will be reviewed to demonstrate the capability and potential of this solution. The feasibility of adopting this solution in high-mix, high-volume manufacturing environment will be discussed as well.

  6. Water Management Applications of Advanced Precipitation Products

    NASA Astrophysics Data System (ADS)

    Johnson, L. E.; Braswell, G.; Delaney, C.

    2012-12-01

    Advanced precipitation sensors and numerical models track storms as they occur and forecast the likelihood of heavy rain for time frames ranging from 1 to 8 hours, 1 day, and extended outlooks out to 3 to 7 days. Forecast skill decreases at the extended time frames but the outlooks have been shown to provide "situational awareness" which aids in preparation for flood mitigation and water supply operations. In California the California-Nevada River Forecast Centers and local Weather Forecast Offices provide precipitation products that are widely used to support water management and flood response activities of various kinds. The Hydrometeorology Testbed (HMT) program is being conducted to help advance the science of precipitation tracking and forecasting in support of the NWS. HMT high-resolution products have found applications for other non-federal water management activities as well. This presentation will describe water management applications of HMT advanced precipitation products, and characterization of benefits expected to accrue. Two case examples will be highlighted, 1) reservoir operations for flood control and water supply, and 2) urban stormwater management. Application of advanced precipitation products in support of reservoir operations is a focus of the Sonoma County Water Agency. Examples include: a) interfacing the high-resolution QPE products with a distributed hydrologic model for the Russian-Napa watersheds, b) providing early warning of in-coming storms for flood preparedness and water supply storage operations. For the stormwater case, San Francisco wastewater engineers are developing a plan to deploy high resolution gap-filling radars looking off shore to obtain longer lead times on approaching storms. A 4 to 8 hour lead time would provide opportunity to optimize stormwater capture and treatment operations, and minimize combined sewer overflows into the Bay.ussian River distributed hydrologic model.

  7. Advanced Applications of RNA Sequencing and Challenges

    PubMed Central

    Han, Yixing; Gao, Shouguo; Muegge, Kathrin; Zhang, Wei; Zhou, Bing

    2015-01-01

    Next-generation sequencing technologies have revolutionarily advanced sequence-based research with the advantages of high-throughput, high-sensitivity, and high-speed. RNA-seq is now being used widely for uncovering multiple facets of transcriptome to facilitate the biological applications. However, the large-scale data analyses associated with RNA-seq harbors challenges. In this study, we present a detailed overview of the applications of this technology and the challenges that need to be addressed, including data preprocessing, differential gene expression analysis, alternative splicing analysis, variants detection and allele-specific expression, pathway analysis, co-expression network analysis, and applications combining various experimental procedures beyond the achievements that have been made. Specifically, we discuss essential principles of computational methods that are required to meet the key challenges of the RNA-seq data analyses, development of various bioinformatics tools, challenges associated with the RNA-seq applications, and examples that represent the advances made so far in the characterization of the transcriptome. PMID:26609224

  8. Advanced Turbine Technology Applications Project (ATTAP)

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Reports technical effort by AlliedSignal Engines in sixth year of DOE/NASA funded project. Topics include: gas turbine engine design modifications of production APU to incorporate ceramic components; fabrication and processing of silicon nitride blades and nozzles; component and engine testing; and refinement and development of critical ceramics technologies, including: hot corrosion testing and environmental life predictive model; advanced NDE methods for internal flaws in ceramic components; and improved carbon pulverization modeling during impact. ATTAP project is oriented toward developing high-risk technology of ceramic structural component design and fabrication to carry forward to commercial production by 'bridging the gap' between structural ceramics in the laboratory and near-term commercial heat engine application. Current ATTAP project goal is to support accelerated commercialization of advanced, high-temperature engines for hybrid vehicles and other applications. Project objectives are to provide essential and substantial early field experience demonstrating ceramic component reliability and durability in modified, available, gas turbine engine applications; and to scale-up and improve manufacturing processes of ceramic turbine engine components and demonstrate application of these processes in the production environment.

  9. A review of roll-to-roll nanoimprint lithography

    PubMed Central

    2014-01-01

    Since its introduction in 1995, nanoimprint lithography has been demonstrated in many researches as a simple, low-cost, and high-throughput process for replicating micro- and nanoscale patterns. Due to its advantages, the nanoimprint lithography method has been rapidly developed over the years as a promising alternative to conventional nanolithography processes to fulfill the demands generated from the recent developments in the semiconductor and flexible electronics industries, which results in variations of the process. Roll-to-roll (R2R) nanoimprint lithography (NIL) is the most demanded technique due to its high-throughput fulfilling industrial-scale application. In the present work, a general literature review on the various types of nanoimprint lithography processes especially R2R NIL and the methods commonly adapted to fabricate imprint molds are presented to provide a clear view and understanding on the nanoimprint lithography technique as well as its recent developments. PACS 81.16.Nd PMID:25024682

  10. Thirty years of lithography simulation

    NASA Astrophysics Data System (ADS)

    Mack, Chris A.

    2005-05-01

    Thirty years ago Rick Dill and his team at IBM published the first account of lithography simulation - the accurate description of semiconductor optical lithography by mathematical equations. Since then, lithography simulation has grown dramatically in importance in four important areas: as a research tool, as a development tool, as a manufacturing tool, and as a learning tool. In this paper, the history of lithography simulations is traced from its roots to today"s indispensable tools for lithographic technology development. Along the way, an attempt will be made to define the true value of lithography simulation to the semiconductor industry.

  11. An ice lithography instrument

    NASA Astrophysics Data System (ADS)

    Han, Anpan; Chervinsky, John; Branton, Daniel; Golovchenko, J. A.

    2011-06-01

    We describe the design of an instrument that can fully implement a new nanopatterning method called ice lithography, where ice is used as the resist. Water vapor is introduced into a scanning electron microscope (SEM) vacuum chamber above a sample cooled down to 110 K. The vapor condenses, covering the sample with an amorphous layer of ice. To form a lift-off mask, ice is removed by the SEM electron beam (e-beam) guided by an e-beam lithography system. Without breaking vacuum, the sample with the ice mask is then transferred into a metal deposition chamber where metals are deposited by sputtering. The cold sample is then unloaded from the vacuum system and immersed in isopropanol at room temperature. As the ice melts, metal deposited on the ice disperses while the metals deposited on the sample where the ice had been removed by the e-beam remains. The instrument combines a high beam-current thermal field emission SEM fitted with an e-beam lithography system, cryogenic systems, and a high vacuum metal deposition system in a design that optimizes ice lithography for high throughput nanodevice fabrication. The nanoscale capability of the instrument is demonstrated with the fabrication of nanoscale metal lines.

  12. An ice lithography instrument

    SciTech Connect

    Han, Anpan; Chervinsky, John; Branton, Daniel; Golovchenko, J. A.

    2011-06-15

    We describe the design of an instrument that can fully implement a new nanopatterning method called ice lithography, where ice is used as the resist. Water vapor is introduced into a scanning electron microscope (SEM) vacuum chamber above a sample cooled down to 110 K. The vapor condenses, covering the sample with an amorphous layer of ice. To form a lift-off mask, ice is removed by the SEM electron beam (e-beam) guided by an e-beam lithography system. Without breaking vacuum, the sample with the ice mask is then transferred into a metal deposition chamber where metals are deposited by sputtering. The cold sample is then unloaded from the vacuum system and immersed in isopropanol at room temperature. As the ice melts, metal deposited on the ice disperses while the metals deposited on the sample where the ice had been removed by the e-beam remains. The instrument combines a high beam-current thermal field emission SEM fitted with an e-beam lithography system, cryogenic systems, and a high vacuum metal deposition system in a design that optimizes ice lithography for high throughput nanodevice fabrication. The nanoscale capability of the instrument is demonstrated with the fabrication of nanoscale metal lines.

  13. An ice lithography instrument.

    PubMed

    Han, Anpan; Chervinsky, John; Branton, Daniel; Golovchenko, J A

    2011-06-01

    We describe the design of an instrument that can fully implement a new nanopatterning method called ice lithography, where ice is used as the resist. Water vapor is introduced into a scanning electron microscope (SEM) vacuum chamber above a sample cooled down to 110 K. The vapor condenses, covering the sample with an amorphous layer of ice. To form a lift-off mask, ice is removed by the SEM electron beam (e-beam) guided by an e-beam lithography system. Without breaking vacuum, the sample with the ice mask is then transferred into a metal deposition chamber where metals are deposited by sputtering. The cold sample is then unloaded from the vacuum system and immersed in isopropanol at room temperature. As the ice melts, metal deposited on the ice disperses while the metals deposited on the sample where the ice had been removed by the e-beam remains. The instrument combines a high beam-current thermal field emission SEM fitted with an e-beam lithography system, cryogenic systems, and a high vacuum metal deposition system in a design that optimizes ice lithography for high throughput nanodevice fabrication. The nanoscale capability of the instrument is demonstrated with the fabrication of nanoscale metal lines. PMID:21721733

  14. An ice lithography instrument

    PubMed Central

    Han, Anpan; Chervinsky, John; Branton, Daniel; Golovchenko, J. A.

    2011-01-01

    We describe the design of an instrument that can fully implement a new nanopatterning method called ice lithography, where ice is used as the resist. Water vapor is introduced into a scanning electron microscope (SEM) vacuum chamber above a sample cooled down to 110 K. The vapor condenses, covering the sample with an amorphous layer of ice. To form a lift-off mask, ice is removed by the SEM electron beam (e-beam) guided by an e-beam lithography system. Without breaking vacuum, the sample with the ice mask is then transferred into a metal deposition chamber where metals are deposited by sputtering. The cold sample is then unloaded from the vacuum system and immersed in isopropanol at room temperature. As the ice melts, metal deposited on the ice disperses while the metals deposited on the sample where the ice had been removed by the e-beam remains. The instrument combines a high beam-current thermal field emission SEM fitted with an e-beam lithography system, cryogenic systems, and a high vacuum metal deposition system in a design that optimizes ice lithography for high throughput nanodevice fabrication. The nanoscale capability of the instrument is demonstrated with the fabrication of nanoscale metal lines. PMID:21721733

  15. Recent Progress On Submicron Electron Beam Lithography

    NASA Astrophysics Data System (ADS)

    Takigawa, Tadahiro; Shimazaki, Kuniya; Kusui, Naoki

    1986-06-01

    In order to fabricate submicron pattern, total electron beam (EB) lithography system has been developed. Upper submicron pattern will be realized by optical lithography, which requires reticle with high accuracy. An EB writing system, EBM-130/40, has the performance of drawing capability of 4 M bit DRAM reticle pattern in about 40 minutes. The EB system incorporated with peripheral technologies including data compaction conversion software, reticle inspection system, APC-130R, and EBR-9 resist process can produce advanced reticles of number of about 600 per month. For lower submicron pattern formation, next generation lithography system is required. The EBM-130V is the variable shaped EB system with high acceleration voltage of 50 kV and high dosage of 50 μC/cm2 for direct writing and X-ray mask fabrication for development of the high bit density VLSI pattern. This system makes possible EB/optical combined lithography. Its metrology function allows it to measure X-ray mask distortion.

  16. Scaling behavior in interference lithography

    SciTech Connect

    Agayan, R.R.; Banyai, W.C.; Fernandez, A.

    1998-02-27

    Interference lithography is an emerging, technology that provides a means for achieving high resolution over large exposure areas (approximately 1 m{sup 2}) with virtually unlimited depth of field. One- and two-dimensional arrays of deep submicron structures can be created using near i-line wavelengths and standard resist processing. In this paper, we report on recent advances in the development of this technology, focusing, in particular, on how exposure latitude and resist profile scale with interference period We present structure width vs dose curves for periods ranging from 200 nm to 1 um, demonstrating that deep submicron structures can be generated with exposure latitudes exceeding 30%. Our experimental results are compared to simulations based on PROLITIV2.

  17. Advances in monoclonal antibody application in myocarditis*

    PubMed Central

    Han, Li-na; He, Shuang; Wang, Yu-tang; Yang, Li-ming; Liu, Si-yu; Zhang, Ting

    2013-01-01

    Monoclonal antibodies have become a part of daily preparation technologies in many laboratories. Attempts have been made to apply monoclonal antibodies to open a new train of thought for clinical treatments of autoimmune diseases, inflammatory diseases, cancer, and other immune-associated diseases. This paper is a prospective review to anticipate that monoclonal antibody application in the treatment of myocarditis, an inflammatory disease of the heart, could be a novel approach in the future. In order to better understand the current state of the art in monoclonal antibody techniques and advance applications in myocarditis, we, through a significant amount of literature research both domestic and abroad, developed a systematic elaboration of monoclonal antibodies, pathogenesis of myocarditis, and application of monoclonal antibodies in myocarditis. This paper presents review of the literature of some therapeutic aspects of monoclonal antibodies in myocarditis and dilated cardiomyopathy to demonstrate the advance of monoclonal antibody application in myocarditis and a strong anticipation that monoclonal antibody application may supply an effective therapeutic approach to relieve the severity of myocarditis in the future. Under conventional therapy, myocarditis is typically associated with congestive heart failure as a progressive outcome, indicating the need for alternative therapeutic strategies to improve long-term results. Reviewing some therapeutic aspects of monoclonal antibodies in myocarditis, we recently found that monoclonal antibodies with high purity and strong specificity can accurately act on target and achieve definite progress in the treatment of viral myocarditis in rat model and may meet the need above. However, several issues remain. The technology on how to make a higher homologous and weak immunogenic humanized or human source antibody and the treatment mechanism of monoclonal antibodies may provide solutions for these open issues. If we are to

  18. Advanced Energetics for Aeronautical Applications. Volume II

    NASA Technical Reports Server (NTRS)

    Alexander, David S.

    2005-01-01

    NASA has identified water vapor emission into the upper atmosphere from commercial transport aircraft, particularly as it relates to the formation of persistent contrails, as a potential environmental problem. Since 1999, MSE has been working with NASA-LaRC to investigate the concept of a transport-size emissionless aircraft fueled with liquid hydrogen combined with other possible breakthrough technologies. The goal of the project is to significantly advance air transportation in the next decade and beyond. The power and propulsion (P/P) system currently being studied would be based on hydrogen fuel cells (HFCs) powering electric motors, which drive fans for propulsion. The liquid water reaction product is retained onboard the aircraft until a flight mission is completed. As of now, NASA-LaRC and MSE have identified P/P system components that, according to the high-level analysis conducted to date, are light enough to make the emissionless aircraft concept feasible. Calculated maximum aircraft ranges (within a maximum weight constraint) and other performance predictions are included in this report. This report also includes current information on advanced energy-related technologies, which are still being researched, as well as breakthrough physics concepts that may be applicable for advanced energetics and aerospace propulsion in the future.

  19. Automotive applications for advanced composite materials

    NASA Technical Reports Server (NTRS)

    Deutsch, G. C.

    1978-01-01

    A description is presented of nonaerospace applications for advanced composite materials with special emphasis on the automotive applications. The automotive industry has to satisfy exacting requirements to reduce the average fuel consumption of cars. A feasible approach to accomplish this involves the development of composites cars with a total weight of 2400 pounds and a fuel consumption of 33 miles per gallon. In connection with this possibility, the automotive companies have started to look seriously at composite materials. The aerospace industry has over the past decade accumulated a considerable data base on composite materials and this is being made available to the nonaerospace sector. However, the automotive companies will place prime emphasis on low cost resins which lend themselves to rapid fabrication techniques.

  20. High power disk lasers: advances and applications

    NASA Astrophysics Data System (ADS)

    Havrilla, David; Holzer, Marco

    2011-02-01

    Though the genesis of the disk laser concept dates to the early 90's, the disk laser continues to demonstrate the flexibility and the certain future of a breakthrough technology. On-going increases in power per disk, and improvements in beam quality and efficiency continue to validate the genius of the disk laser concept. As of today, the disk principle has not reached any fundamental limits regarding output power per disk or beam quality, and offers numerous advantages over other high power resonator concepts, especially over monolithic architectures. With well over 1000 high power disk lasers installations, the disk laser has proven to be a robust and reliable industrial tool. With advancements in running cost, investment cost and footprint, manufacturers continue to implement disk laser technology with more vigor than ever. This paper will explain important details of the TruDisk laser series and process relevant features of the system, like pump diode arrangement, resonator design and integrated beam guidance. In addition, advances in applications in the thick sheet area and very cost efficient high productivity applications like remote welding, remote cutting and cutting of thin sheets will be discussed.

  1. Advances in hypersonic vehicle synthesis with application to studies of advanced thermal protection system

    NASA Technical Reports Server (NTRS)

    Ardema, Mark D.

    1995-01-01

    This report summarizes the work entitled 'Advances in Hypersonic Vehicle Synthesis with Application to Studies of Advanced Thermal Protection Systems.' The effort was in two areas: (1) development of advanced methods of trajectory and propulsion system optimization; and (2) development of advanced methods of structural weight estimation. The majority of the effort was spent in the trajectory area.

  2. Colloidal pen lithography.

    PubMed

    Xue, Mianqi; Cai, Xiaojing; Chen, Ghenfu

    2015-02-01

    Colloidal pen lithography, a low-cost, high-throughput scanning probe contact printing method, has been developed, which is based on self-assembled colloidal arrays embedded in a soft elastomeric stamp. Patterned protein arrays are demonstrated using this method, with a feature size ranging from 100 nm to several micrometers. A brief study into the specificity reorganization of protein gives evidence for the feasibility of this method for writing protein chips. PMID:25288364

  3. HIAD Advancements and Extension of Mission Applications

    NASA Technical Reports Server (NTRS)

    Johnson, R. Keith; Cheatwood, F. McNeil; Calomino, Anthony M.; Hughes, Stephen J.; Korzun, Ashley M.; DiNonno, John M.; Lindell, Mike C.; Swanson, Greg T.

    2016-01-01

    The Hypersonic Inflatable Aerodynamic Decelerator (HIAD) technology has made significant advancements over the last decade with flight test demonstrations and ground development campaigns. The first generation (Gen-1) design and materials were flight tested with the successful third Inflatable Reentry Vehicle Experiment flight test of a 3-m HIAD (IRVE-3). Ground development efforts incorporated materials with higher thermal capabilities for the inflatable structure (IS) and flexible thermal protection system (F-TPS) as a second generation (Gen-2) system. Current efforts and plans are focused on extending capabilities to improve overall system performance and reduce areal weight, as well as expand mission applicability. F-TPS materials that offer greater thermal resistance, and ability to be packed to greater density, for a given thickness are being tested to demonstrated thermal performance benefits and manufacturability at flight-relevant scale. IS materials and construction methods are being investigated to reduce mass, increase load capacities, and improve durability for packing. Previous HIAD systems focused on symmetric geometries using stacked torus construction. Flight simulations and trajectory analysis show that symmetrical HIADs may provide L/D up to 0.25 via movable center of gravity (CG) offsets. HIAD capabilities can be greatly expanded to suit a broader range of mission applications with asymmetric shapes and/or modulating L/D. Various HIAD concepts are being developed to provide greater control to improve landing accuracy and reduce dependency upon propulsion systems during descent and landing. Concepts being studied include a canted stack torus design, control surfaces, and morphing configurations that allow the shape to be actively manipulated for flight control. This paper provides a summary of recent HIAD development activities, and plans for future HIAD developments including advanced materials, improved construction techniques, and alternate

  4. Impacts of cost functions on inverse lithography patterning.

    PubMed

    Yu, Jue-Chin; Yu, Peichen

    2010-10-25

    For advanced CMOS processes, inverse lithography promises better patterning fidelity than conventional mask correction techniques due to a more complete exploration of the solution space. However, the success of inverse lithography relies highly on customized cost functions whose design and know-how have rarely been discussed. In this paper, we investigate the impacts of various objective functions and their superposition for inverse lithography patterning using a generic gradient descent approach. We investigate the most commonly used objective functions, which are the resist and aerial images, and also present a derivation for the aerial image contrast. We then discuss the resulting pattern fidelity and final mask characteristics for simple layouts with a single isolated contact and two nested contacts. We show that a cost function composed of a dominant resist-image component and a minor aerial-image or image-contrast component can achieve a good mask correction and contour targets when using inverse lithography patterning. PMID:21164674

  5. Direct three-dimensional patterning using nanoimprint lithography

    NASA Astrophysics Data System (ADS)

    Li, Mingtao; Chen, Lei; Chou, Stephen Y.

    2001-05-01

    We demonstrated that nanoimprint lithography (NIL) can create three-dimensional patterns, sub-40 nm T-gates, and air-bridge structures, in a single step imprint in polymer and metal by lift-off. A method based on electron beam lithography and reactive ion etching was developed to fabricate NIL molds with three-dimensional protrusions. The low-cost and high-throughput nanoimprint lithography for three-dimensional nanostructures has many significant applications such as monolithic microwave integrated circuits and nanoelectromechanical system.

  6. Application development environment for advanced digital workstations

    NASA Astrophysics Data System (ADS)

    Valentino, Daniel J.; Harreld, Michael R.; Liu, Brent J.; Brown, Matthew S.; Huang, Lu J.

    1998-06-01

    One remaining barrier to the clinical acceptance of electronic imaging and information systems is the difficulty in providing intuitive access to the information needed for a specific clinical task (such as reaching a diagnosis or tracking clinical progress). The purpose of this research was to create a development environment that enables the design and implementation of advanced digital imaging workstations. We used formal data and process modeling to identify the diagnostic and quantitative data that radiologists use and the tasks that they typically perform to make clinical decisions. We studied a diverse range of radiology applications, including diagnostic neuroradiology in an academic medical center, pediatric radiology in a children's hospital, screening mammography in a breast cancer center, and thoracic radiology consultation for an oncology clinic. We used object- oriented analysis to develop software toolkits that enable a programmer to rapidly implement applications that closely match clinical tasks. The toolkits support browsing patient information, integrating patient images and reports, manipulating images, and making quantitative measurements on images. Collectively, we refer to these toolkits as the UCLA Digital ViewBox toolkit (ViewBox/Tk). We used the ViewBox/Tk to rapidly prototype and develop a number of diverse medical imaging applications. Our task-based toolkit approach enabled rapid and iterative prototyping of workstations that matched clinical tasks. The toolkit functionality and performance provided a 'hands-on' feeling for manipulating images, and for accessing textual information and reports. The toolkits directly support a new concept for protocol based-reading of diagnostic studies. The design supports the implementation of network-based application services (e.g., prefetching, workflow management, and post-processing) that will facilitate the development of future clinical applications.

  7. Advanced Stirling conversion systems for terrestrial applications

    NASA Technical Reports Server (NTRS)

    Shaltens, R. K.

    1987-01-01

    Under the Department of Energy's (DOE) Solar Thermal Technology Program, Sandia National Laboratories (SNLA) is developing heat engines for terrestrial Solar Distributed Heat Receivers. SNLA has identified the Stirling to be one of the most promising candidates for the terrestrial applications. The free-piston Stirling engine (FPSE) has the potential to meet the DOE goals for both performance and cost. The National Aeronautics and Space Administration (NASA) Lewis Research Center (LeRC) is conducting free-piston Stirling activities which are directed toward a dynamic power source for space applications. Space power system requirements include high efficiency, very long life, high reliability and low vibration. The FPSE has the potential for future high power space conversion systems, either solar or nuclear. Generic free-piston technology is currently being developed by LeRC for DOE/ORNL for use with a residential heat pump under an Interagency Agreement. Since 1983, the SP-100 Program (DOD/NASA/DOE) is developing dynamic power sources for space. Although both applications (heat pump and space power) appear to be quite different, their requirements complement each other. A cooperative Interagency Agreement (IAA) was signed in 1985 with NASA Lewis to provide technical management for an Advanced Stirling Conversion System (ASCS) for SNLA. Conceptual design(s) using a free-piston Stirling (FPSE), and a heat pipe will be discussed. The ASCS will be designed using technology which can reasonably be expected to be available in the 1980's.

  8. Advanced teleoperation: Technology innovations and applications

    NASA Technical Reports Server (NTRS)

    Schenker, Paul S.; Bejczy, Antal K.; Kim, Won S.

    1994-01-01

    The capability to remotely, robotically perform space assembly, inspection, servicing, and science functions would rapidly expand our presence in space, and the cost efficiency of being there. There is considerable interest in developing 'telerobotic' technologies, which also have comparably important terrestrial applications to health care, underwater salvage, nuclear waste remediation and other. Such tasks, both space and terrestrial, require both a robot and operator interface that is highly flexible and adaptive, i.e., capable of efficiently working in changing and often casually structured environments. One systems approach to this requirement is to augment traditional teleoperation with computer assists -- advanced teleoperation. We have spent a number of years pursuing this approach, and highlight some key technology developments and their potential commercial impact. This paper is an illustrative summary rather than self-contained presentation; for completeness, we include representative technical references to our work which will allow the reader to follow up items of particular interest.

  9. Extending HPF for advanced data parallel applications

    NASA Technical Reports Server (NTRS)

    Chapman, Barbara; Mehrotra, Piyush; Zima, Hans

    1994-01-01

    The stated goal of High Performance Fortran (HPF) was to 'address the problems of writing data parallel programs where the distribution of data affects performance'. After examining the current version of the language we are led to the conclusion that HPF has not fully achieved this goal. While the basic distribution functions offered by the language - regular block, cyclic, and block cyclic distributions - can support regular numerical algorithms, advanced applications such as particle-in-cell codes or unstructured mesh solvers cannot be expressed adequately. We believe that this is a major weakness of HPF, significantly reducing its chances of becoming accepted in the numeric community. The paper discusses the data distribution and alignment issues in detail, points out some flaws in the basic language, and outlines possible future paths of development. Furthermore, we briefly deal with the issue of task parallelism and its integration with the data parallel paradigm of HPF.

  10. Advanced Turbine Technology Applications Project (ATTAP)

    NASA Technical Reports Server (NTRS)

    1993-01-01

    This report is the fifth in a series of Annual Technical Summary Reports for the Advanced Turbine Technology Applications Project (ATTAP), sponsored by the U.S. Department of Energy (DOE). The report was prepared by Garrett Auxiliary Power Division (GAPD), a unit of Allied-Signal Aerospace Company, a unit of Allied Signal, Inc. The report includes information provided by Garrett Ceramic Components, and the Norton Advanced Ceramics Company, (formerly Norton/TRW Ceramics), subcontractors to GAPD on the ATTAP. This report covers plans and progress on ceramics development for commercial automotive applications over the period 1 Jan. through 31 Dec. 1992. Project effort conducted under this contract is part of the DOE Gas Turbine Highway Vehicle System program. This program is directed to provide the U.S. automotive industry the high-risk, long-range technology necessary to produce gas turbine engines for automobiles with reduced fuel consumption, reduced environmental impact, and a decreased reliance on scarce materials and resources. The program is oriented toward developing the high-risk technology of ceramic structural component design and fabrication, such that industry can carry this technology forward to production in the 1990's. The ATTAP test bed engine, carried over from the previous AGT101 project, is being used for verification testing of the durability of next generation ceramic components, and their suitability for service at Reference Powertrain Design conditions. This document reports the technical effort conducted by GAPD and the ATTAP subcontractors during the fifth year of the project. Topics covered include ceramic processing definition and refinement, design improvements to the ATTAP test bed engine and test rigs, and the methodology development of ceramic impact and fracture mechanisms. Appendices include reports by ATTAP subcontractors in the development of silicon nitride materials and processes.

  11. Method for extreme ultraviolet lithography

    DOEpatents

    Felter, T. E.; Kubiak, G. D.

    2000-01-01

    A method of producing a patterned array of features, in particular, gate apertures, in the size range 0.4-0.05 .mu.m using projection lithography and extreme ultraviolet (EUV) radiation. A high energy laser beam is used to vaporize a target material in order to produce a plasma which in turn, produces extreme ultraviolet radiation of a characteristic wavelength of about 13 nm for lithographic applications. The radiation is transmitted by a series of reflective mirrors to a mask which bears the pattern to be printed. The demagnified focused mask pattern is, in turn, transmitted by means of appropriate optics and in a single exposure, to a substrate coated with photoresists designed to be transparent to EUV radiation and also satisfy conventional processing methods.

  12. Defect tolerant transmission lithography mask

    DOEpatents

    Vernon, Stephen P.

    2000-01-01

    A transmission lithography mask that utilizes a transparent substrate or a partially transparent membrane as the active region of the mask. A reflective single layer or multilayer coating is deposited on the membrane surface facing the illumination system. The coating is selectively patterned (removed) to form transmissive (bright) regions. Structural imperfections and defects in the coating have negligible effect on the aerial image of the mask master pattern since the coating is used to reflect radiation out of the entrance pupil of the imaging system. Similarly, structural imperfections in the clear regions of the membrane have little influence on the amplitude or phase of the transmitted electromagnetic fields. Since the mask "discards," rather than absorbs, unwanted radiation, it has reduced optical absorption and reduced thermal loading as compared to conventional designs. For EUV applications, the mask circumvents the phase defect problem, and is independent of the thermal load during exposure.

  13. Method for extreme ultraviolet lithography

    DOEpatents

    Felter, T. E.; Kubiak, Glenn D.

    1999-01-01

    A method of producing a patterned array of features, in particular, gate apertures, in the size range 0.4-0.05 .mu.m using projection lithography and extreme ultraviolet (EUV) radiation. A high energy laser beam is used to vaporize a target material in order to produce a plasma which in turn, produces extreme ultraviolet radiation of a characteristic wavelength of about 13 nm for lithographic applications. The radiation is transmitted by a series of reflective mirrors to a mask which bears the pattern to be printed. The demagnified focused mask pattern is, in turn, transmitted by means of appropriate optics and in a single exposure, to a substrate coated with photoresists designed to be transparent to EUV radiation and also satisfy conventional processing methods.

  14. Synchrotron beamlines for x-ray lithography

    NASA Astrophysics Data System (ADS)

    Trippe, Anthony P.; Pearce, W. J.

    1994-02-01

    Louisiana State University established the J. Bennett Johnston, Sr., Center for Advanced Microstructures and Devices (CAMD). Designed and constructed by the Brobeck Division of Maxwell Laboratories, the CAMD synchrotron light source is the first electron storage ring to be built by a commercial company in the United States. The synchrotron x-ray radiation generated at CAMD is an extremely useful exposure source for both thin and thick film lithography. Passing through a beamline containing two plane mirrors, the synchrotron light is used to expose thin resists for lithography of patterns with feature sizes of 0.25 micron and smaller. Two thick-resist beamlines, one using a single aspheric (collimating) mirror and one using a plane mirror, provide the higher flux photons required for miniaturization in silicon to produce microscopic mechanical devices including gears, motors, filters, and valves.

  15. Plan for advanced microelectronics processing technology application. Final report

    SciTech Connect

    Goland, A.N.

    1990-10-01

    The ultimate objective of the tasks described in the research agreement was to identify resources primarily, but not exclusively, within New York State that are available for the development of a Center for Advanced Microelectronics Processing (CAMP). Identification of those resources would enable Brookhaven National Laboratory to prepare a program plan for the CAMP. In order to achieve the stated goal, the principal investigators undertook to meet the key personnel in relevant NYS industrial and academic organizations to discuss the potential for economic development that could accompany such a Center and to gauge the extent of participation that could be expected from each interested party. Integrated of these discussions was to be achieved through a workshop convened in the summer of 1990. The culmination of this workshop was to be a report (the final report) outlining a plan for implementing a Center in the state. As events unfolded, it became possible to identify the elements of a major center for x-ray lithography on Lone Island at Brookhaven National Laboratory. The principal investigators were than advised to substitute a working document based upon that concept in place of a report based upon the more general CAMP workshop originally envisioned. Following that suggestion from the New York State Science and Technology Foundation, the principals established a working group consisting of representatives of the Grumman Corporation, Columbia University, the State University of New York at Stony Brook, and Brookhaven National Laboratory. Regular meetings and additional communications between these collaborators have produced a preproposal that constitutes the main body of the final report required by the contract. Other components of this final report include the interim report and a brief description of the activities which followed the establishment of the X-ray Lithography Center working group.

  16. Advanced Stirling conversion systems for terrestrial applications

    SciTech Connect

    Shaltens, R.K.

    1987-01-01

    Sandia National Laboratories (SNLA) is developing heat engines for terrestrial Solar distributed Heat Receivers. SNLA has identified the Stirling to be one of the most promising candidates for the terrestrial applications. The free-piston Stirling engine (FPSE) has the potential to meet the DOE goals for both performance and cost. Free-piston Stirling activities which are directed toward a dynamic power source for the space application are being conducted. Space power system requirements include high efficiency, very long life, high reliability and low vibration. The FPSE has the potential for future high power space conversion systems, either solar or nuclear powered. Generic free-piston technology is currently being developed for use with a residential heat pump under an Interagency Agreement. Also, an overview is presented of proposed conceptual designs for the Advanced Stirling Conversion System (ASCS) using a free-piston Stirling engine and a liquid metal heat pipe receiver. Power extraction includes both a linear alternator and hydraulic output capable of delivering approximately 25 kW of electrical power to the electric utility grid. Target cost of the engine/alternator is 300 dollars per kilowatt at a manufacturing rate of 10,000 units per year. The design life of the ASCS is 60,000 h (30 y) with an engine overhaul at 40,000 h (20 y). Also discussed are the key features and characteristics of the ASCS conceptual designs.

  17. Advanced Turbine Technology Applications Project (ATTAP)

    NASA Technical Reports Server (NTRS)

    1992-01-01

    This report is the fourth in a series of Annual Technical Summary Reports for the Advanced Turbine Technology Applications Project (ATTAP). This report covers plans and progress on ceramics development for commercial automotive applications over the period 1 Jan. - 31 Dec. 1991. Project effort conducted under this contract is part of the DOE Gas Turbine Highway Vehicle System program. This program is directed to provide the U.S. automotive industry the high-risk, long-range technology necessary to produce gas turbine engines for automobiles with reduced fuel consumption, reduced environmental impact, and a decreased reliance on scarce materials and resources. The program is oriented toward developing the high-risk technology of ceramic structural component design and fabrication, such that industry can carry this technology forward to production in the 1990s. The ATTAP test bed engine, carried over from the previous AGT101 project, is being used for verification testing of the durability of next-generation ceramic components, and their suitability for service at Reference Powertrain Design conditions. This document reports the technical effort conducted by GAPD and the ATTAP subcontractors during the fourth year of the project. Topics covered include ceramic processing definition and refinement, design improvements to the ATTAP test bed engine and test rigs and the methodology development of ceramic impact and fracture mechanisms. Appendices include reports by ATTAP subcontractors in the development of silicon nitride and silicon carbide families of materials and processes.

  18. Advanced flow MRI: emerging techniques and applications.

    PubMed

    Markl, M; Schnell, S; Wu, C; Bollache, E; Jarvis, K; Barker, A J; Robinson, J D; Rigsby, C K

    2016-08-01

    Magnetic resonance imaging (MRI) techniques provide non-invasive and non-ionising methods for the highly accurate anatomical depiction of the heart and vessels throughout the cardiac cycle. In addition, the intrinsic sensitivity of MRI to motion offers the unique ability to acquire spatially registered blood flow simultaneously with the morphological data, within a single measurement. In clinical routine, flow MRI is typically accomplished using methods that resolve two spatial dimensions in individual planes and encode the time-resolved velocity in one principal direction, typically oriented perpendicular to the two-dimensional (2D) section. This review describes recently developed advanced MRI flow techniques, which allow for more comprehensive evaluation of blood flow characteristics, such as real-time flow imaging, 2D multiple-venc phase contrast MRI, four-dimensional (4D) flow MRI, quantification of complex haemodynamic properties, and highly accelerated flow imaging. Emerging techniques and novel applications are explored. In addition, applications of these new techniques for the improved evaluation of cardiovascular (aorta, pulmonary arteries, congenital heart disease, atrial fibrillation, coronary arteries) as well as cerebrovascular disease (intra-cranial arteries and veins) are presented. PMID:26944696

  19. Advances in artificial olfaction: sensors and applications.

    PubMed

    Gutiérrez, J; Horrillo, M C

    2014-06-01

    The artificial olfaction, based on electronic systems (electronic noses), includes three basic functions that operate on an odorant: a sample handler, an array of gas sensors, and a signal-processing method. The response of these artificial systems can be the identity of the odorant, an estimate concentration of the odorant, or characteristic properties of the odour as might be perceived by a human. These electronic noses are bio inspired instruments that mimic the sense of smell. The complexity of most odorants makes characterisation difficult with conventional analysis techniques, such as gas chromatography. Sensory analysis by a panel of experts is a costly process since it requires trained people who can work for only relatively short periods of time. The electronic noses are easy to build, provide short analysis times, in real time and on-line, and show high sensitivity and selectivity to the tested odorants. These systems are non-destructive techniques used to characterise odorants in diverse applications linked with the quality of life such as: control of foods, environmental quality, citizen security or clinical diagnostics. However, there is much research still to be done especially with regard to new materials and sensors technology, data processing, interpretation and validation of results. This work examines the main features of modern electronic noses and their most important applications in the environmental, and security fields. The above mentioned main components of an electronic nose (sample handling system, more advanced materials and methods for sensing, and data processing system) are described. Finally, some interesting remarks concerning the strengths and weaknesses of electronic noses in the different applications are also mentioned. PMID:24767451

  20. Advanced Turbine Technology Applications Project (ATTAP)

    NASA Technical Reports Server (NTRS)

    1989-01-01

    ATTAP activities during the past year were highlighted by an extensive materials assessment, execution of a reference powertrain design, test-bed engine design and development, ceramic component design, materials and component characterization, ceramic component process development and fabrication, component rig design and fabrication, test-bed engine fabrication, and hot gasifier rig and engine testing. Materials assessment activities entailed engine environment evaluation of domestically supplied radial gasifier turbine rotors that were available at the conclusion of the Advanced Gas Turbine (AGT) Technology Development Project as well as an extensive survey of both domestic and foreign ceramic suppliers and Government laboratories performing ceramic materials research applicable to advanced heat engines. A reference powertrain design was executed to reflect the selection of the AGT-5 as the ceramic component test-bed engine for the ATTAP. Test-bed engine development activity focused on upgrading the AGT-5 from a 1038 C (1900 F) metal engine to a durable 1371 C (2500 F) structural ceramic component test-bed engine. Ceramic component design activities included the combustor, gasifier turbine static structure, and gasifier turbine rotor. The materials and component characterization efforts have included the testing and evaluation of several candidate ceramic materials and components being developed for use in the ATTAP. Ceramic component process development and fabrication activities were initiated for the gasifier turbine rotor, gasifier turbine vanes, gasifier turbine scroll, extruded regenerator disks, and thermal insulation. Component rig development activities included combustor, hot gasifier, and regenerator rigs. Test-bed engine fabrication activities consisted of the fabrication of an all-new AGT-5 durability test-bed engine and support of all engine test activities through instrumentation/build/repair. Hot gasifier rig and test-bed engine testing

  1. Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin films deposition in solutions

    NASA Astrophysics Data System (ADS)

    Koshida, N.; Kojima, A.; Ikegami, N.; Suda, R.; Yagi, M.; Shirakashi, J.; Yoshida, T.; Miyaguchi, H.; Muroyama, M.; Nishino, H.; Yoshida, S.; Sugata, M.; Totsu, K.; Esashi, M.

    2015-03-01

    Making the best use of the characteristic features in nanocrystalline Si (nc-Si) ballistic hot electron source, the alternative lithographic technology is presented based on the two approaches: physical excitation in vacuum and chemical reduction in solutions. The nc-Si cold cathode is a kind of metal-insulator-semiconductor (MIS) diode, composed of a thin metal film, an nc-Si layer, an n+-Si substrate, and an ohmic back contact. Under a biased condition, energetic electrons are uniformly and directionally emitted through the thin surface electrodes. In vacuum, this emitter is available for active-matrix drive massive parallel lithography. Arrayed 100×100 emitters (each size: 10×10 μm2, pitch: 100 μm) are fabricated on silicon substrate by conventional planar process, and then every emitter is bonded with integrated complementary metal-oxide-semiconductor (CMOS) driver using through-silicon-via (TSV) interconnect technology. Electron multi-beams emitted from selected devices are focused by a micro-electro-mechanical system (MEMS) condenser lens array and introduced into an accelerating system with a demagnification factor of 100. The electron accelerating voltage is 5 kV. The designed size of each beam landing on the target is 10×10 nm2 in square. Here we discuss the fabrication process of the emitter array with TSV holes, implementation of integrated ctive-matrix driver circuit, the bonding of these components, the construction of electron optics, and the overall operation in the exposure system including the correction of possible aberrations. The experimental results of this mask-less parallel pattern transfer are shown in terms of simple 1:1 projection and parallel lithography under an active-matrix drive scheme. Another application is the use of this emitter as an active electrode supplying highly reducing electrons into solutions. A very small amount of metal-salt solutions is dripped onto the nc-Si emitter surface, and the emitter is driven without

  2. Diamond nanoimprint lithography

    NASA Astrophysics Data System (ADS)

    Taniguchi, Jun; Tokano, Yuji; Miyamoto, Iwao; Komuro, Masanori; Hiroshima, Hiroshi

    2002-10-01

    Electron beam (EB) lithography using polymethylmethacrylate (PMMA) and oxygen gas reactive ion etching (RIE) were used to fabricate fine patterns in a diamond mould. To prevent charge-up during EB lithography, thin conductive polymer was spin-coated over the PMMA resist, yielding dented line patterns 2 μ m wide and 270 nm deep. The diamond mould was pressed into PMMA on a silicon substrate heated to 130, 150 and 170ºC at 43.6, 65.4 and 87.2 MPa. All transferred PMMA convex line patterns were 2 μ m wide. Imprinted pattern depth increased with rising temperature and pressure. PMMA patterns on diamond were transferred by the diamond mould at 150ºC and 65.4 MPa, yielding convex line patterns 2 μ m wide and 200 nm high. Direct aluminium and copper patterns were obtained using the diamond mould at room temperature and 130.8 MPa. The diamond mould is thus useful for replicating patterns on PMMA and metals.

  3. Challenges and opportunities in applying grapho-epitaxy DSA lithography to metal cut and contact/via applications

    NASA Astrophysics Data System (ADS)

    Ma, Yuansheng; Torres, J. Andres; Fenger, Germain; Granik, Yuri; Ryckaert, Julien; Vanderberghe, Geert; Bekaert, Joost; Word, James

    2014-10-01

    Directed self assembly has become a very attractive technology for Fin and contact/via applications. Some of the issues related to pattern placement error, defectivity rates and process integration are actively being addressed by the industry and have not faced significant roadblocks for contact-hole applications. While many DSA applications have been proposed, deploying DSA for Fin structures competes in cost and variability control with SADP techniques. Given the 1D nature of find structures, it is difficult to control fin placement with accuracy better than 4nm 3 sigma. In addition, a second patterning step is needed to remove the un-wanted sections of the grating and leaving behind only the required fin structures, therefore limiting its adoption. On the other hand, DSA applied to contact/via holes has demonstrated low defectivity rates due to improved polymerization and processing techniques, as well as an adequate control to reduce the placement error due to thermal fluctuations during the annealing and cylinder formation process. For that reason, the results from contact/via layers can extend to the metal cut layer printing with DSA grapho-epitaxy. In this paper, we show that DSA provides a promising cost-effective solution for the technology scaling by reducing mask number from N to N-1. It is shown that pxOPC may provide better guiding patterns than the conventional one. In addition, the practical grouping rules for DSA should avoid 2D grouping, avoid putting more than 3 features in a group with different pitches, and avoid grouping features with different sizes. Our recommendations to designers for DSA technology are the following: if the design is to be decomposed with 2 or more DSA masks, then the design rules should be set up in this way: first the minimum pitch is better to be on DSA material's own natural pitch; second, for each DSA mask, singletons and bar-like grouping shapes with DSA's natural pitch should be used as much as possible.

  4. A new architecture as transparent electrodes for solar and IR applications based on photonic structures via soft lithography

    SciTech Connect

    Kuang, Ping

    2011-01-01

    Transparent conducting electrodes with the combination of high optical transmission and good electrical conductivity are essential for solar energy harvesting and electric lighting devices. Currently, indium tin oxide (ITO) is used because ITO offers relatively high transparency (>80%) to visible light and low sheet resistance (Rs = 10 ohms/square (Ω /2)) for electrical conduction. However, ITO is costly due to limited indium reserves, and it is brittle. These disadvantages have motivated the search for other conducting electrodes with similar or better properties. There has been research on a variety of electrode structures involving carbon nanotube networks, graphene films, nanowire and nanopatterned meshes and grids. Due to their novel characteristics in light manipulation and collection, photonic crystal structures show promise for further improvement. Here, we report on a new architecture consisting of nanoscale high aspect ratio metallic photonic structures as transparent electrodes fabricated via a combination of processes. For (Au) and silver (Ag) structures, the visible light transmission can reach as high as 80%, and the sheet resistance of the structure can be as low as 3.2Ω /2. The optical transparency of the high aspect ratio metal structures at visible wavelength range is comparable to that of ITO glass, while their sheet resistance is more than 3 times lower, which indicates a much higher electrical conductivity of the metal structures. Furthermore, the high aspect ratio metal structures have very high infrared (IR) reflection (90%) for the transverse magnetic (TM) mode, which can lead to the development of fabrication of metallic structures as IR filters for heat control applications. Investigations of interdigitated structures based on the high aspect ratio metal electrodes are ongoing to study the feasibility in smart window applications in light transmission modulation.

  5. Induced pluripotent stem cells: advances to applications

    PubMed Central

    Nelson, Timothy J; Martinez-Fernandez, Almudena; Yamada, Satsuki; Ikeda, Yasuhiro; Perez-Terzic, Carmen; Terzic, Andre

    2010-01-01

    Induced pluripotent stem cell (iPS) technology has enriched the armamentarium of regenerative medicine by introducing autologous pluripotent progenitor pools bioengineered from ordinary somatic tissue. Through nuclear reprogramming, patient-specific iPS cells have been derived and validated. Optimizing iPS-based methodology will ensure robust applications across discovery science, offering opportunities for the development of personalized diagnostics and targeted therapeutics. Here, we highlight the process of nuclear reprogramming of somatic tissues that, when forced to ectopically express stemness factors, are converted into bona fide pluripotent stem cells. Bioengineered stem cells acquire the genuine ability to generate replacement tissues for a wide-spectrum of diseased conditions, and have so far demonstrated therapeutic benefit upon transplantation in model systems of sickle cell anemia, Parkinson’s disease, hemophilia A, and ischemic heart disease. The field of regenerative medicine is therefore primed to adopt and incorporate iPS cell-based advancements as a next generation stem cell platforms. PMID:21165156

  6. Polymers as advanced materials for desiccant applications

    SciTech Connect

    Czanderna, A.W.

    1990-12-01

    This research is concerned with solid materials used as desiccants for desiccant cooling systems (DCSs) that process water vapor in an atmosphere to produce cooling. Background information includes an introduction to DCSs and the role of the desiccant as a system component. The water vapor sorption performance criteria used for screening the modified polymers prepared include the water sorption capacity from 5% to 80% relative humidity (R.H.), isotherm shape, and rate of adsorption and desorption. Measurements are presented for the sorption performance of modified polymeric advanced desiccant materials with the quartz crystal microbalance. Isotherms of polystyrene sulfonic acid (PSSA) taken over a 5-month period show that the material has a dramatic loss in capacity and that the isotherm shape is time dependent. The adsorption and desorption kinetics for PSSA and all the ionic salts of it studied are easily fast enough for commercial DCS applications with a wheel rotation speed of 6 min per revolution. Future activities for the project are addressed, and a 5-year summary of the project is included as Appendix A. 34 refs., 20 figs., 3 tabs.

  7. Advanced Turbine Technology Applications Project (ATTAP)

    NASA Technical Reports Server (NTRS)

    1993-01-01

    The Advanced Turbine Technologies Application Project (ATTAP) is in the fifth year of a multiyear development program to bring the automotive gas turbine engine to a state at which industry can make commercialization decisions. Activities during the past year included reference powertrain design updates, test-bed engine design and development, ceramic component design, materials and component characterization, ceramic component process development and fabrication, ceramic component rig testing, and test-bed engine fabrication and testing. Engine design and development included mechanical design, combustion system development, alternate aerodynamic flow testing, and controls development. Design activities included development of the ceramic gasifier turbine static structure, the ceramic gasifier rotor, and the ceramic power turbine rotor. Material characterization efforts included the testing and evaluation of five candidate high temperature ceramic materials. Ceramic component process development and fabrication, with the objective of approaching automotive volumes and costs, continued for the gasifier turbine rotor, gasifier turbine scroll, extruded regenerator disks, and thermal insulation. Engine and rig fabrication, testing, and development supported improvements in ceramic component technology. Total test time in 1992 amounted to 599 hours, of which 147 hours were engine testing and 452 were hot rig testing.

  8. Applications and advances of positron beam spectroscopy

    SciTech Connect

    Howell, R., LLNL

    1998-03-18

    Over 50 scientists from DOE-DP, DOE-ER, the national laboratories, academia and industry attended a workshop held on November 5-7, 1997 at Lawrence Livermore National Laboratory. Workshop participants were charged to address two questions: Is there a need for a national center for materials analysis using positron techniques and can the capabilities at Lawrence Livermore National Laboratory serve this need. To demonstrate the need for a national center, the workshop participants discussed the technical advantages enabled by high positron currents and advanced measurement techniques, the role that these techniques would play in materials analysis and the demand for the data. Livermore now leads the world in materials analysis capabilities by positrons due to developments in response to demands of stockpile stewardship. The Livermore facilities now include the world`s highest current beam of keV positrons, a scanning pulsed positron microprobe under development capable of three dimensional maps of defect size and concentration, an MeV positron beam for defect analysis of large samples, and electron momentum spectroscopy by positrons. It was concluded that the positron microprobe under development at LLNL and other new instruments that would be relocated at LLNL at the high current keV source are an exciting step forward in providing results for the positron technique. These new data will impact a wide variety of applications.

  9. Designing materials for advanced microelectronic patterning applications using controlled polymerization RAFT technology

    NASA Astrophysics Data System (ADS)

    Sheehan, Michael T.; Farnham, William B.; Chambers, Charles R.; Tran, Hoang V.; Okazaki, Hiroshi; Brun, Yefim; Romberger, Matthew L.; Sounik, James R.

    2011-04-01

    Reversible Addition Fragmentation Chain Transfer (RAFT) polymerization technology enables the production of polymers possessing low polydispersity (PD) in high yield for many applications. RAFT technology also enables control over polymer architecture. With synthetic control over these polymer characteristics, a variety of polymers can be designed and manufactured for use in advanced electronic applications. By matching the specific RAFT reagent and monomer combinations, we can accommodate monomer reactivity and optimize acrylate or methacrylate polymerizations (193 and 193i photoresist polymers) or optimize styrenic monomer systems (248 nm photoresist polymers) to yield polymers with PD as low as 1.05. For 193i lithography, we have used RAFT technology to produce block copolymers comprising of a random "resist" block with composition and size based on conventional dry photoresist materials and a "low surface energy" block The relative block lengths and compositions may be varied to tune solution migration behavior, surface energy, contact angles, and solubility in developer. Directed self assembly is proving to be an interesting and innovative method to make 2- and even 3-dimensional periodic, uniform patterns. Two keys to acceptable performance of directed self assembly from block copolymers are the uniformity and the purity of the materials will be discussed.

  10. Novel organosilicone materials and patterning techniques for nanoimprint lithography

    NASA Astrophysics Data System (ADS)

    Pina, Carlos Alberto

    Nanoimprint Lithography (NIL) is a high-throughput patterning technique that allows the fabrication of nanostructures with great precision. It has been listed on the International Technology Roadmap for Semiconductors (ITRS) as a candidate technology for future generation Si chip manufacturing. In nanoimprint Lithography a resist material, e.g. a thermoplastic polymer, is placed in contact with a mold and then mechanically deformed under an applied load to transfer the nano-features on the mold surface into the resist. The success of NIL relies heavily in the capability of fabricating nanostructures on different types of materials. Thus, a key factor for NIL implementation in industrial settings is the development of advanced materials suitable as the nanoimprint resist. This dissertation focuses on the engineering of new polymer materials suitable as NIL resist. A variety of silicone-based polymer precursors were synthesized and formulated for NIL applications. High throughput and high yield nanopatterning was successfully achieved. Furthermore, additional capabilities of the developed materials were explored for a range of NIL applications such as their use as flexible, UV-transparent stamps and silicon compatible etching layers. Finally, new strategies were investigated to expand the NIL potentiality. High throughput, non-residual layer imprinting was achieved with the newly developed resist materials. In addition, several strategies were designed for the precise control of nanoscale size patterned structures with multifunctional resist systems by post-imprinting modification of the pattern size. These developments provide NIL with a new set of tools for a variety of additional important applications.

  11. Advanced Energy Storage for Space Applications

    NASA Technical Reports Server (NTRS)

    Halpert, G.; Surampudi, S.

    1993-01-01

    NASA is planning a number of space science and space exploration missions into the early 21st century. The JPL Advanced Battery Program, which has the goal of developing batteries for these missions, is described. Under program consideration are Li-SOCl(sub 2) cells, secondary lithium cells, advanced metal hydride cells, and high-temperature sodium-nickel chloride cells.

  12. Advanced Turbine Technology Applications Project (ATTAP)

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Advanced Turbine Technology Application Project (ATTAP) activities during the past year were highlighted by test-bed engine design and development activities; ceramic component design; materials and component characterization; ceramic component process development and fabrication; component rig testing; and test-bed engine fabrication and testing. Although substantial technical challenges remain, all areas exhibited progress. Test-bed engine design and development activity included engine mechanical design, power turbine flow-path design and mechanical layout, and engine system integration aimed at upgrading the AGT-5 from a 1038 C metal engine to a durable 1371 C structural ceramic component test-bed engine. ATTAP-defined ceramic and associated ceramic/metal component design activities include: the ceramic combustor body, the ceramic gasifier turbine static structure, the ceramic gasifier turbine rotor, the ceramic/metal power turbine static structure, and the ceramic power turbine rotors. The materials and component characterization efforts included the testing and evaluation of several candidate ceramic materials and components being developed for use in the ATTAP. Ceramic component process development and fabrication activities are being conducted for the gasifier turbine rotor, gasifier turbine vanes, gasifier turbine scroll, extruded regenerator disks, and thermal insulation. Component rig testing activities include the development of the necessary test procedures and conduction of rig testing of the ceramic components and assemblies. Four-hundred hours of hot gasifier rig test time were accumulated with turbine inlet temperatures exceeding 1204 C at 100 percent design gasifier speed. A total of 348.6 test hours were achieved on a single ceramic rotor without failure and a second ceramic rotor was retired in engine-ready condition at 364.9 test hours. Test-bed engine fabrication, testing, and development supported improvements in ceramic component technology

  13. Advances in LEDs for automotive applications

    NASA Astrophysics Data System (ADS)

    Bhardwaj, Jy; Peddada, Rao; Spinger, Benno

    2016-03-01

    High power LEDs were introduced in automotive headlights in 2006-2007, for example as full LED headlights in the Audi R8 or low beam in Lexus. Since then, LED headlighting has become established in premium and volume automotive segments and beginning to enable new compact form factors such as distributed low beam and new functions such as adaptive driving beam. New generations of highly versatile high power LEDs are emerging to meet these application needs. In this paper, we will detail ongoing advances in LED technology that enable revolutionary styling, performance and adaptive control in automotive headlights. As the standards which govern the necessary lumens on the road are well established, increasing luminance enables not only more design freedom but also headlight cost reduction with space and weight saving through more compact optics. Adaptive headlighting is based on LED pixelation and requires high contrast, high luminance, smaller LEDs with high-packing density for pixelated Matrix Lighting sources. Matrix applications require an extremely tight tolerance on not only the X, Y placement accuracy, but also on the Z height of the LEDs given the precision optics used to image the LEDs onto the road. A new generation of chip scale packaged (CSP) LEDs based on Wafer Level Packaging (WLP) have been developed to meet these needs, offering a form factor less than 20% increase over the LED emitter surface footprint. These miniature LEDs are surface mount devices compatible with automated tools for L2 board direct attach (without the need for an interposer or L1 substrate), meeting the high position accuracy as well as the optical and thermal performance. To illustrate the versatility of the CSP LEDs, we will show the results of, firstly, a reflector-based distributed low beam using multiple individual cavities each with only 20mm height and secondly 3x4 to 3x28 Matrix arrays for adaptive full beam. Also a few key trends in rear lighting and impact on LED light

  14. Neon Ion Beam Lithography (NIBL).

    PubMed

    Winston, Donald; Manfrinato, Vitor R; Nicaise, Samuel M; Cheong, Lin Lee; Duan, Huigao; Ferranti, David; Marshman, Jeff; McVey, Shawn; Stern, Lewis; Notte, John; Berggren, Karl K

    2011-10-12

    Existing techniques for electron- and ion-beam lithography, routinely employed for nanoscale device fabrication and mask/mold prototyping, do not simultaneously achieve efficient (low fluence) exposure and high resolution. We report lithography using neon ions with fluence <1 ion/nm(2), ∼1000× more efficient than using 30 keV electrons, and resolution down to 7 nm half-pitch. This combination of resolution and exposure efficiency is expected to impact a wide array of fields that are dependent on beam-based lithography. PMID:21899279

  15. Reflective electron-beam lithography performance for the 10nm logic node

    NASA Astrophysics Data System (ADS)

    Freed, Regina; Gubiotti, Thomas; Sun, Jeff; Cheung, Anthony; Yang, Jason; McCord, Mark; Petric, Paul; Carroll, Allen; Ummethala, Upendra; Hale, Layton; Hench, John; Kojima, Shinichi; Mieher, Walter; Bevis, Chris F.

    2012-11-01

    Maskless electron beam lithography has the potential to extend semiconductor manufacturing to the sub-10 nm technology node. KLA-Tencor is currently developing Reflective Electron Beam Lithography (REBL) for high-volume 10 nm logic (16 nm HP). This paper reviews progress in the development of the REBL system towards its goal of 100 wph throughput for High Volume Lithography (HVL) at the 2X and 1X nm nodes. In this paper we introduce the Digital Pattern Generator (DPG) with integrated CMOS and MEMs lenslets that was manufactured at TSMC and IMEC. For REBL, the DPG is integrated to KLA-Tencor pattern generating software that can be programmed to produce complex, gray-scaled lithography patterns. Additionally, we show printing results for a range of interesting lithography patterns using Time Domain Imaging (TDI). Previously, KLA-Tencor reported on the development of a Reflective Electron Beam Lithography (REBL) tool for maskless lithography at and below the 22 nm technology node1. Since that time, the REBL team and its partners (TSMC, IMEC) have made good progress towards developing the REBL system and Digital Pattern Generator (DPG) for direct write lithography. Traditionally, e-beam direct write lithography has been too slow for most lithography applications. Ebeam direct write lithography has been used for mask writing rather than wafer processing since the maximum blur requirements limit column beam current - which drives e-beam throughput. To print small features and a fine pitch with an e-beam tool requires a sacrifice in processing time unless one significantly increases the total number of beams on a single writing tool. Because of the continued uncertainty with regards to the optical lithography roadmap beyond the 22 nm technology node, the semiconductor equipment industry is in the process of designing and testing e-beam lithography tools with the potential for HVL.

  16. Programmable imprint lithography template

    DOEpatents

    Cardinale, Gregory F.; Talin, Albert A.

    2006-10-31

    A template for imprint lithography (IL) that reduces significantly template production costs by allowing the same template to be re-used for several technology generations. The template is composed of an array of spaced-apart moveable and individually addressable rods or plungers. Thus, the template can be configured to provide a desired pattern by programming the array of plungers such that certain of the plungers are in an "up" or actuated configuration. This arrangement of "up" and "down" plungers forms a pattern composed of protruding and recessed features which can then be impressed onto a polymer film coated substrate by applying a pressure to the template impressing the programmed configuration into the polymer film. The pattern impressed into the polymer film will be reproduced on the substrate by subsequent processing.

  17. Scatterometry for EUV lithography at the 22-nm node

    NASA Astrophysics Data System (ADS)

    Bunday, Benjamin; Vartanian, Victor; Ren, Liping; Huang, George; Montgomery, Cecilia; Montgomery, Warren; Elia, Alex; Liu, Xiaoping

    2011-03-01

    Moore's Law continues to drive improvements to lithographic resolution to increase integrated circuit transistor density, improve performance, and reduce cost. For the 22 nm node and beyond, extreme ultraviolet lithography (EUVL) is a promising technology with λ=13.5 nm, a larger k1 value and lower cost of ownership than other available technologies. For small feature sizes, process control will be increasingly challenging, as small features will create measurement uncertainties, yet with tighter specifications. Optical scatterometry is a primary candidate metrology for EUV lithography process control. Using simulation and experimental data, this work will explore scatterometry's application to a typical lithography process being used for EUV development, which should be representative of lithography processes that will be utilized for EUV High Volume manufacturing (HVM). EUV lithography will be performed using much thinner photoresist thicknesses than were used at the 248nm or 193nm lithography generations, and will probably include underlayers for adhesion improvement; these new processes conditions were investigated in this metrological study.

  18. Antireflective surface patterned by rolling mask lithography

    NASA Astrophysics Data System (ADS)

    Seitz, Oliver; Geddes, Joseph B.; Aryal, Mukti; Perez, Joseph; Wassei, Jonathan; McMackin, Ian; Kobrin, Boris

    2014-03-01

    A growing number of commercial products such as displays, solar panels, light emitting diodes (LEDs and OLEDs), automotive and architectural glass are driving demand for glass with high performance surfaces that offer anti-reflective, self-cleaning, and other advanced functions. State-of-the-art coatings do not meet the desired performance characteristics or cannot be applied over large areas in a cost-effective manner. "Rolling Mask Lithography" (RML™) enables highresolution lithographic nano-patterning over large-areas at low-cost and high-throughput. RML is a photolithographic process performed using ultraviolet (UV) illumination transmitted through a soft cylindrical mask as it rolls across a substrate. Subsequent transfer of photoresist patterns into the substrate is achieved using an etching process, which creates a nanostructured surface. The current generation exposure tool is capable of patterning one-meter long substrates with a width of 300 mm. High-throughput and low-cost are achieved using continuous exposure of the resist by the cylindrical photomask. Here, we report on significant improvements in the application of RML™ to fabricate anti-reflective surfaces. Briefly, an optical surface can be made antireflective by "texturing" it with a nano-scale pattern to reduce the discontinuity in the index of refraction between the air and the bulk optical material. An array of cones, similar to the structure of a moth's eye, performs this way. Substrates are patterned using RML™ and etched to produce an array of cones with an aspect ratio of 3:1, which decreases the reflectivity below 0.1%.

  19. Advanced technologies for remote sensing imaging applications

    SciTech Connect

    Wood, L.L.

    1993-06-07

    Generating and returning imagery from great distances has been generally associated with national security activities, with emphasis on reliability of system operation. (While the introduction of such capabilities was usually characterized by high levels of innovation, the evolution of such systems has followed the classical track of proliferation of ``standardized items`` expressing ever more incremental technological advances.) Recent focusing of interest on the use of remote imaging systems for commercial and scientific purposes can be expected to induce comparatively rapid advances along the axes of efficiency and technological sophistication, respectively. This paper reviews the most basic reasons for expecting the next decade of advances to dwarf the impressive accomplishments of the past ten years. The impact of these advances clearly will be felt in all major areas of large-scale human endeavor, commercial, military and scientific.

  20. Formation of Magnetic Anisotropy by Lithography.

    PubMed

    Kim, Si Nyeon; Nam, Yoon Jae; Kim, Yang Doo; Choi, Jun Woo; Lee, Heon; Lim, Sang Ho

    2016-01-01

    Artificial interface anisotropy is demonstrated in alternating Co/Pt and Co/Pd stripe patterns, providing a means of forming magnetic anisotropy using lithography. In-plane hysteresis loops measured along two principal directions are explained in depth by two competing shape and interface anisotropies, thus confirming the formation of interface anisotropy at the Co/Pt and Co/Pd interfaces of the stripe patterns. The measured interface anisotropy energies, which are in the range of 0.2-0.3 erg/cm(2) for both stripes, are smaller than those observed in conventional multilayers, indicating a decrease in smoothness of the interfaces when formed by lithography. The demonstration of interface anisotropy in the Co/Pt and Co/Pd stripe patterns is of significant practical importance, because this setup makes it possible to form anisotropy using lithography and to modulate its strength by controlling the pattern width. Furthermore, this makes it possible to form more complex interface anisotropy by fabricating two-dimensional patterns. These artificial anisotropies are expected to open up new device applications such as multilevel bits using in-plane magnetoresistive thin-film structures. PMID:27216420

  1. Formation of Magnetic Anisotropy by Lithography

    PubMed Central

    Kim, Si Nyeon; Nam, Yoon Jae; Kim, Yang Doo; Choi, Jun Woo; Lee, Heon; Lim, Sang Ho

    2016-01-01

    Artificial interface anisotropy is demonstrated in alternating Co/Pt and Co/Pd stripe patterns, providing a means of forming magnetic anisotropy using lithography. In-plane hysteresis loops measured along two principal directions are explained in depth by two competing shape and interface anisotropies, thus confirming the formation of interface anisotropy at the Co/Pt and Co/Pd interfaces of the stripe patterns. The measured interface anisotropy energies, which are in the range of 0.2–0.3 erg/cm2 for both stripes, are smaller than those observed in conventional multilayers, indicating a decrease in smoothness of the interfaces when formed by lithography. The demonstration of interface anisotropy in the Co/Pt and Co/Pd stripe patterns is of significant practical importance, because this setup makes it possible to form anisotropy using lithography and to modulate its strength by controlling the pattern width. Furthermore, this makes it possible to form more complex interface anisotropy by fabricating two-dimensional patterns. These artificial anisotropies are expected to open up new device applications such as multilevel bits using in-plane magnetoresistive thin-film structures. PMID:27216420

  2. Self-segregating materials for immersion lithography

    NASA Astrophysics Data System (ADS)

    Sanders, Daniel P.; Sundberg, Linda K.; Brock, Phillip J.; Ito, Hiroshi; Truong, Hoa D.; Allen, Robert D.; McIntyre, Gregory R.; Goldfarb, Dario L.

    2008-03-01

    In this paper, we employ the self-segregating materials approach used in topcoat-free resists for water immersion lithography to extend the performance of topcoat materials for water immersion and to increase the contact angles of organic fluids on topcoat-free resists for high index immersion lithography. By tailoring polymers that segregate to the air and resist interfaces of the topcoat, high contact angle topcoats with relatively low fluorine content are achieved. While graded topcoats may extend the performance and/or reduce the cost of topcoat materials, the large amount of unprotected acidic groups necessary for TMAH development prevent them from achieving the high contact angles and low hysteresis exhibited by topcoat-free resists. Another application of this self-segregating approach is tailoring resist surfaces for high index immersion. Due to the low surface tension and higher viscosities of organic fluids relative to water and their lower contact angles on most surfaces, film pulling cannot be prevented without dramatically reducing wafer scan rates; however, tuning the surface energy of the resist may be important to control stain morphology and facilitate fluid removal from the wafer. By tailoring fluoropolymer additives for high contact angles with second generation organic high index immersion fluids, we show herein that topcoat-free resists can be developed specifically for high index immersion lithography with good contact angles and lithographic imaging performance.

  3. Synthesis and characterization of advanced materials for Navy applications

    SciTech Connect

    Covino, J.

    1993-12-31

    This paper addresses the synthesis of ceramics and ceramic coatings, via the sol-gel process for use in specific Navy applications. Among the specific applications are: coatings for electrocromic devices; laser gyro bodies, hermetic coatings for optical fibers for use in ocean environments; coating development for advanced light weight structural applications; and incorporation of organic and inorganic dyes in silica based ceramics for laser applications. It will also address the characterization of these systems as well as advanced structural materials with respect to durability, chemical stability, optical properties and other properties which are more specific to their applications and end use.

  4. Resolution improvement and pattern generator development for the maskless micro-ion-beam reduction lithography system

    NASA Astrophysics Data System (ADS)

    Jiang, Ximan

    The shrinking of IC devices has followed the Moore's Law for over three decades, which states that the density of transistors on integrated circuits will double about every two years. This great achievement is obtained via continuous advance in lithography technology. With the adoption of complicated resolution enhancement technologies, such as the phase shifting mask (PSM), the optical proximity correction (OPC), optical lithography with wavelength of 193 nm has enabled 45 nm printing by immersion method. However, this achievement comes together with the skyrocketing cost of masks, which makes the production of low volume application-specific IC (ASIC) impractical. In order to provide an economical lithography approach for low to medium volume advanced IC fabrication, a maskless ion beam lithography method, called Maskless Micro-ion-beam Reduction Lithography (MMRL), has been developed in the Lawrence Berkeley National Laboratory. The development of the prototype MMRL system has been described by Dr. Vinh Van Ngo in his Ph.D. thesis. But the resolution realized on the prototype MMRL system was far from the design expectation. In order to improve the resolution of the MMRL system, the ion optical system has been investigated. By integrating a field-free limiting aperture into the optical column, reducing the electromagnetic interference and cleaning the RF plasma, the resolution has been improved to around 50 nm. Computational analysis indicates that the MMRL system can be operated with an exposure field size of 0.25 mm and a beam half angle of 1.0 mrad on the wafer plane. Ion-ion interactions have been studied with a two-particle physics model. The results are in excellent agreement with those published by the other research groups. The charge-interaction analysis of MMRL shows that the ion-ion interactions must be reduced in order to obtain a throughput higher than 10 wafers per hour on 300-mm wafers. In addition, two different maskless lithography strategies

  5. Lithography alternatives meet design style reality: How do they "line" up?

    NASA Astrophysics Data System (ADS)

    Smayling, Michael C.

    2016-03-01

    Optical lithography resolution scaling has stalled, giving innovative alternatives a window of opportunity. One important factor that impacts these lithographic approaches is the transition in design style from 2D to 1D for advanced CMOS logic. Just as the transition from 3D circuits to 2D fabrication 50 years ago created an opportunity for a new breed of electronics companies, the transition today presents exciting and challenging time for lithographers. Today, we are looking at a range of non-optical lithography processes. Those considered here can be broadly categorized: self-aligned lithography, self-assembled lithography, deposition lithography, nano-imprint lithography, pixelated e-beam lithography, shot-based e-beam lithography .Do any of these alternatives benefit from or take advantage of 1D layout? Yes, for example SAPD + CL (Self Aligned Pitch Division combined with Complementary Lithography). This is a widely adopted process for CMOS nodes at 22nm and below. Can there be additional design / process co-optimization? In spite of the simple-looking nature of 1D layout, the placement of "cut" in the lines and "holes" for interlayer connections can be tuned for a given process capability. Examples of such optimization have been presented at this conference, typically showing a reduction of at least one in the number of cut or hole patterns needed.[1,2] Can any of the alternatives complement each other or optical lithography? Yes.[3] For example, DSA (Directed Self Assembly) combines optical lithography with self-assembly. CEBL (Complementary e-Beam Lithography) combines optical lithography with SAPD for lines with shot-based e-beam lithography for cuts and holes. Does one (shrinking) size fit all? No, that's why we have many alternatives. For example NIL (Nano-imprint Lithography) has been introduced for NAND Flash patterning where the (trending lower) defectivity is acceptable for the product. Deposition lithography has been introduced in 3D NAND Flash to

  6. Synthesis and characterization of advanced materials for Navy applications

    NASA Technical Reports Server (NTRS)

    Covino, J.; Lee, I.

    1994-01-01

    The synthesis of ceramics and ceramic coatings through the sol-gel process has extensive application with the United States Navy and a broad range of potential commercial applications as well. This paper surveys seven specific applications for which the Navy is investigating these advanced materials. For each area, the synthetic process is described and the characteristics of the materials are discussed.

  7. Advanced thermal control for spacecraft applications

    NASA Astrophysics Data System (ADS)

    Hardesty, Robert; Parker, Kelsey

    2015-09-01

    In optical systems just like any other space borne system, thermal control plays an important role. In fact, most advanced designs are plagued with volume constraints that further complicate the thermal control challenges for even the most experienced systems engineers. Peregrine will present advances in satellite thermal control based upon passive heat transfer technologies to dissipate large thermal loads. This will address the use of 700 W/m K and higher conducting products that are five times better than aluminum on a specific basis providing enabling thermal control while maintaining structural support.

  8. Magnetic nanostructures by colloidal lithography

    NASA Astrophysics Data System (ADS)

    Zhu, Frank Qing

    Structural, magnetic and in some cases magneto-transport properties of (1) symmetric and asymmetric ferromagnetic nanorings and (2) single layer, multilayer, and exchange biased ferromagnetic nanodots prepared by colloidal lithography are presented. A fast, reliable and cost effective method has been developed to fabricate large number (˜ 109) of magnetic nanorings over macroscopic areas (˜ cm2) with large areal densities (up to 45 rings/mum 2). Cobalt nanorings with diameters ranging from 100 nm to 500 nm have been fabricated by sputtering Co onto nanosphere-coated substrates followed by ion beam etching. X-ray diffraction verifies that the Co nanorings still have hexagonal close-packed (hcp) structure. Scanning electron microscopy reveals that the cross-section of the symmetric nanoring is tapered and uniform along the circumference, and the cross-section of the asymmetric nanoring changes progressively along the circumference. Two magnetic reversal processes have been found in magnetic nanorings---the vortex formation process and the onion rotation process. The co-existence of these two processes is the manifestation of the competition between the exchange energy and the magnetostatic energy in the nanorings. Micromagnetics simulations have been carried out to reveal the details of the magnetic reversals. The experimental and the computed hysteresis loops agree both qualitatively and quantitatively. For the 100 nm symmetric Co nanorings, the vortex formation process has a probability of about 40%, while the onion rotation process has 60% chances. To increase the probability of vortex formation process, a desirable process for application, asymmetric nanorings have been fabricated by ion beam etching at oblique angles. Unlike the symmetric nanorings, the probability of the vortex formation process in asymmetric nanorings can be controlled by the direction of the external field. For the 100 nm asymmetric nanorings, the fraction of the vortex formation process

  9. Nanometer x-ray lithography

    NASA Astrophysics Data System (ADS)

    Hartley, Frank T.; Khan Malek, Chantal G.

    1999-10-01

    New developments for x-ray nanomachining include pattern transfer onto non-planar surfaces coated with electrodeposited resists using synchrotron radiation x-rays through extremely high-resolution mask made by chemically assisted focused ion beam lithography. Standard UV photolithographic processes cannot maintain sub-micron definitions over large variation in feature topography. The ability of x-ray printing to pattern thin or thick layers of photoresist with high resolution on non-planar surfaces of large and complex topographies with limited diffraction and scattering effects and no substrate reflection is known and can be exploited for patterning microsystems with non-planar 3D geometries as well as multisided and multilayered substrates. Thin conformal coatings of electro-deposited positive and negative tone photoresist have been shown to be x-ray sensitive and accommodate sub-micro pattern transfer over surface of extreme topographical variations. Chemically assisted focused ion beam selective anisotropic erosion was used to fabricate x-ray masks directly. Masks with feature sizes less than 20 nm through 7 microns of gold were made on bulk silicon substrates and x-ray mask membranes. The technique is also applicable to other high density materials. Such masks enable the primary and secondary patterning and/or 3D machining of Nano-Electro-Mechanical Systems over large depths or complex relief and the patterning of large surface areas with sub-optically dimensioned features.

  10. Introduction to Natural Resources: Advanced Applications.

    ERIC Educational Resources Information Center

    Crummett, Dan

    This guide, which is designed for use with student and teacher guides to a 10-unit secondary-level course in natural resources, contains a series of student supplements and advanced assignment and job sheets that provide students with additional opportunities to explore the following areas of natural resources and conservation education: outdoor…

  11. Advanced transponders for deep space applications

    NASA Technical Reports Server (NTRS)

    Nguyen, Tien M.; Kayalar, Selahattin; Yeh, Hen-Geul; Kyriacou, Charles

    1993-01-01

    Three architectures for advanced deep space transponders are proposed. The architectures possess various digital techniques such as fast Fourier transform (FFT), digital phase-locked loop (PLL), and digital sideband aided carrier detection with analog or digital turn-around ranging. Preliminary results on the design and conceptual implementation are presented. Modifications to the command detector unit (CDU) are also presented.

  12. Advanced lightweight alloys for aerospace applications

    NASA Astrophysics Data System (ADS)

    Frazier, William E.; Lee, Eui W.; Donnellan, Mary E.; Thompson, James J.

    1989-05-01

    The design requirements of the next generation of advanced aerospace vehicles and propulsion systems necessitate the development of structural materials with properties vastly superior to those which are currently achievable. Recognizing that each class of materials possesses its own unique set of advantages and disadvantages, the designers of tomorrow's aircraft must choose wisely from the plethora of available alloys.

  13. Photonic crystal fibre-based light source for STED lithography

    SciTech Connect

    Glubokov, D A; Sychev, V V; Vitukhnovsky, Alexey G; Korol'kov, A E

    2013-06-30

    A light source having a relative noise level in the order of 10{sup -6} and sufficient stability for application in STED lithography has been obtained using the generation of Cherenkov peaks in a supercontinuum spectrum. (laser applications and other topics in quantum electronics)

  14. Optical Multiple Access Network (OMAN) for advanced processing satellite applications

    NASA Technical Reports Server (NTRS)

    Mendez, Antonio J.; Gagliardi, Robert M.; Park, Eugene; Ivancic, William D.; Sherman, Bradley D.

    1991-01-01

    An OMAN breadboard for exploring advanced processing satellite circuit switch applications is introduced. Network architecture, hardware trade offs, and multiple user interference issues are presented. The breadboard test set up and experimental results are discussed.

  15. Agricultural and environmental applications of biochar: Advances and barriers

    Technology Transfer Automated Retrieval System (TEKTRAN)

    This summary chapter highlights the achieved advances in biochar research and the existing barriers to biochar application. Substantial research over the past decade on biochar production, characterization, and utilization has indicated that biochar serves as a promising agricultural and environment...

  16. Mix-and-match lithography for half-micron technology

    NASA Astrophysics Data System (ADS)

    Flack, Warren W.; Dameron, David H.

    1991-08-01

    Half-micron lithography for a production environment is not considered realistic with currently available lithography tools. While optical steppers have high wafer throughputs, they do not have sufficient process latitude at half-micron geometries. In contrast, advanced technologies with sufficient capabilities for half-micron processing such as direct-write e-beam and x-ray lithography are extremely expensive and have low effective throughputs. A mix-and- match lithography approach can take advantage of the best features of both types of systems by sing an optical stepper for noncritical levels and an advanced lithography system for critical levels. In order to facilitate processing of a triple level metal half-micron CMOS technology, a mix-and-match scheme has been developed between a Hitachi HL-700 D e-beam direct write system and an Ultratech 1500 wide-field 1x stepper. The Hitachi is used to pattern an accurate zero or registration level. All critical levels are exposed on the Hitachi and aligned back to this zero level. The Ultratech is used to align all other process levels which do not have critical targets that are placed on subsequent process levels. The mix-and-match approach is discussed, and optical to e-beam as well as e-beam to optical alignment results from seven production lots are presented. The linear alignment error components X translation, Y translation, rotation and magnification are extracted and analyzed to determine their source. It was found that a simple adjustment improved the registration capabilities of these two lithography tools by reducing the X translation, Y translation and rotation standard deviations by a factor of two or more, while greatly reducing the magnification errors between the two tools.

  17. Extreme ultraviolet lithography machine

    DOEpatents

    Tichenor, Daniel A.; Kubiak, Glenn D.; Haney, Steven J.; Sweeney, Donald W.

    2000-01-01

    An extreme ultraviolet lithography (EUVL) machine or system for producing integrated circuit (IC) components, such as transistors, formed on a substrate. The EUVL machine utilizes a laser plasma point source directed via an optical arrangement onto a mask or reticle which is reflected by a multiple mirror system onto the substrate or target. The EUVL machine operates in the 10-14 nm wavelength soft x-ray photon. Basically the EUV machine includes an evacuated source chamber, an evacuated main or project chamber interconnected by a transport tube arrangement, wherein a laser beam is directed into a plasma generator which produces an illumination beam which is directed by optics from the source chamber through the connecting tube, into the projection chamber, and onto the reticle or mask, from which a patterned beam is reflected by optics in a projection optics (PO) box mounted in the main or projection chamber onto the substrate. In one embodiment of a EUVL machine, nine optical components are utilized, with four of the optical components located in the PO box. The main or projection chamber includes vibration isolators for the PO box and a vibration isolator mounting for the substrate, with the main or projection chamber being mounted on a support structure and being isolated.

  18. Nanowire lithography on silicon.

    PubMed

    Colli, Alan; Fasoli, Andrea; Pisana, Simone; Fu, Yongqing; Beecher, Paul; Milne, William I; Ferrari, Andrea C

    2008-05-01

    Nanowire lithography (NWL) uses nanowires (NWs), grown and assembled by chemical methods, as etch masks to transfer their one-dimensional morphology to an underlying substrate. Here, we show that SiO2 NWs are a simple and compatible system to implement NWL on crystalline silicon and fabricate a wide range of architectures and devices. Planar field-effect transistors made of a single SOI-NW channel exhibit a contact resistance below 20 kOmega and scale with the channel width. Further, we assess the electrical response of NW networks obtained using a mask of SiO2 NWs ink-jetted from solution. The resulting conformal network etched into the underlying wafer is monolithic, with single-crystalline bulk junctions; thus no difference in conductivity is seen between a direct NW bridge and a percolating network. We also extend the potential of NWL into the third dimension, by using a periodic undercutting that produces an array of vertically stacked NWs from a single NW mask. PMID:18386934

  19. Scanning probe nanoimprint lithography

    NASA Astrophysics Data System (ADS)

    Dinelli, F.; Menozzi, C.; Baschieri, P.; Facci, P.; Pingue, P.

    2010-02-01

    The present paper reports on a novel lithographic approach at the nanoscale level, which is based on scanning probe microscopy (SPM) and nanoimprint lithography (NIL). The experimental set-up consists of an atomic force microscope (AFM) operated via software specifically developed for the purpose. In particular, this software allows one to apply a predefined external load for a given lapse of time while monitoring in real-time the relative distance between the tip and the sample as well as the normal and lateral force during the embossing process. Additionally, we have employed AFM tips sculptured by means of focused ion beam in order to create indenting tools of the desired shape. Anti-sticking layers can also be used to functionalize the tips if one needs to investigate the effects of different treatments on the indentation and de-molding processes. The lithographic capabilities of this set-up are demonstrated on a polystyrene NIL-patterned sample, where imprinted features have been obtained upon using different normal load values for increasing time intervals, and on a thermoplastic polymer film, where the imprint process has been monitored in real-time.

  20. Large area gold coated nano-needles fabricated by proximity mask aligner lithography for plasmonic AR-structures

    NASA Astrophysics Data System (ADS)

    Bourgin, Yannick; Michaelis, Dirk; Käsebier, Thomas; Dannberg, Peter; Zeitner, Uwe D.

    2016-04-01

    Mask-aligner (MA) lithography is a well-known method for the fabrication of micrometer sized structures on a substrate with a diameter up to 300 mm. In spite of a theoretical resolution below 200 nm, the minimum printable feature sized remained above 1μm due to diffraction effects and limit its utilization to advanced packaging, or MEMS fabrication. Recently, developments in the illumination system and mechanical parts (known as AMALTIH for Advanced MA LITHography) as well as mask design, have permitted to used diffractive based photo-mask, and then reach the resolution limit mentioned above. This opens the possibility to fabricate smaller structures, usually accessible only by ebeam lithography. We propose here to demonstrate a fast and robust fabrication method of large area plasmonic absorber structures based on 2D sub-micrometric (350 nm period) nano-needles in a transparent polymer on a glass substrate and coated with a 50 nm thick gold layer. The interaction of the incoming light with metallic structured surface leads to the small total reflections of the 0th order below 5 %, over a large spectral band (460-660 nm) and a large set of incidence angles with TE and TM polarizations. Those results demonstrate that our fabrication process is a step toward the implementation of plasmonic based effect structures for a wide range of application.

  1. Advanced remote handling for future applications: The advanced integrated maintenance system

    SciTech Connect

    Herndon, J.N.; Kring, C.T.; Rowe, J.C.

    1986-01-01

    The Consolidated Fuel Reprocessing Program at Oak Ridge National Laboratory has been developing advanced techniques for remote maintenance of future US fuel reprocessing plants. The developed technology has a wide spectrum of application for other hazardous environments. These efforts are based on the application of teleoperated, force-reflecting servomanipulators for dexterous remote handling with television viewing for large-volume hazardous applications. These developments fully address the nonrepetitive nature of remote maintenance in the unstructured environments encountered in fuel reprocessing. This paper covers the primary emphasis in the present program; the design, fabrication, installation, and operation of a prototype remote handling system for reprocessing applications, the Advanced Integrated Maintenance System.

  2. Inorganic antireflective coating process for deep-UV lithography

    NASA Astrophysics Data System (ADS)

    He, Qizhi; Lee, Wei W.; Hanratty, Maureen A.; Rogers, Daty; Xing, Guoqiang; Singh, Abha; Zielinski, Eden

    1998-06-01

    Antireflective coatings (ARCs) have been used to enhance IC lithography for years, however, many conventional bottom ARCs can no longer maintain acceptable linewidth control, cannot meet stringent deep-UV (DUV) photoresist processing requirements, and increase the etch complexity. In this paper, we report the development of an inorganic ARC for DUV lithography in sub-0.25 micrometer advanced device applications. Plasma-enhanced chemical vapor deposition (PECVD) is employed to deposit a dielectric film silicon oxynitride (SixOyNz) with specific optical properties. The three optical parameters of the SixOyNz film: refractive index n, extinction coefficient k, and thickness d are specifically designed to ensure that the reflection light that passes through the ARC/substrate is equal in amplitude and opposite in phase to the reflected light from the resist/ARC interface. The reflection light is canceled by destructive interference and therefore photoresist receives the minimum substrate reflection wave. Using this technique, we have successfully patterned features at 0.25 micrometer and below. The dielectric film can not only function as an ARC layer, but also serve as a hardmask for the pattern transfer etch process. With an aggressive etch bias process, linewidths down to 0.60 micrometer poly-Si gate are achieved with good linewidth control (3(sigma) less than 12 nm) and a near perfect linearity. For the marginal metal etch resistance of DUV photoresist, the designed SixOyNz is effective in imparting more etch resistance and suppressing metal substrate reflection. Excellent optical uniformity of the n, k and thickness d of the SixOyNz ARC is obtained with a manufacturable PECVD deposition process.

  3. Advanced composite applications for sub-micron biologically derived microstructures

    NASA Technical Reports Server (NTRS)

    Schnur, J. M.; Price, R. R.; Schoen, P. E.; Bonanventura, Joseph; Kirkpatrick, Douglas

    1991-01-01

    A major thrust of advanced material development is in the area of self-assembled ultra-fine particulate based composites (micro-composites). The application of biologically derived, self-assembled microstructures to form advanced composite materials is discussed. Hollow 0.5 micron diameter cylindrical shaped microcylinders self-assemble from diacetylenic lipids. These microstructures have a multiplicity of potential applications in the material sciences. Exploratory development is proceeding in application areas such as controlled release for drug delivery, wound repair, and biofouling as well as composites for electronic and magnetic applications, and high power microwave cathodes.

  4. Advanced superconducting materials for electronic applications

    NASA Astrophysics Data System (ADS)

    Beasley, M. R.

    1980-10-01

    Developments in the fabrication of tunnel junctions using Nb- and V-base transition-metal compounds and alloys are summarized. Particular attention is given to the advances in codeposition of these refractory high-transition-temperature superconductors and the properties of thin films deposited by the dual-electron-beam coevaporation technique. Problems associated with these materials are identified, and prospects for the future are discussed. Of the materials reviewed, Nb3Sn is singled out as one deserving further development.

  5. DSA via hole shrink for advanced node applications

    NASA Astrophysics Data System (ADS)

    Chi, Cheng; Liu, Chi-Chun; Meli, Luciana; Schmidt, Kristin; Xu, Yongan; DeSilva, Ekmini Anuja; Sanchez, Martha; Farrell, Richard; Cottle, Hongyun; Kawamura, Daiji; Singh, Lovejeet; Furukawa, Tsuyoshi; Lai, Kafai; Pitera, Jed W.; Sanders, Daniel; Hetzer, David R.; Metz, Andrew; Felix, Nelson; Arnold, John; Colburn, Matthew

    2016-04-01

    Directed self-assembly (DSA) of block copolymers (BCPs) has become a promising patterning technique for 7nm node hole shrink process due to its material-controlled CD uniformity and process simplicity.[1] For such application, cylinder-forming BCP system has been extensively investigated compared to its counterpart, lamella-forming system, mainly because cylindrical BCPs will form multiple vias in non-circular guiding patterns (GPs), which is considered to be closer to technological needs.[2-5] This technological need to generate multiple DSA domains in a bar-shape GP originated from the resolution limit of lithography, i.e. those vias placed too close to each other will merge and short the circuit. In practice, multiple patterning and self-aligned via (SAV) processes have been implemented in semiconductor manufacturing to address this resolution issue.[6] The former approach separates one pattern layer with unresolvable dense features into several layers with resolvable features, while the latter approach simply utilizes the superposition of via bars and the pre-defined metal trench patterns in a thin hard mask layer to resolve individual vias, as illustrated in Fig 1 (upper). With proper design, using DSA to generate via bars with the SAV process could provide another approach to address the resolution issue.

  6. Photoinhibition superresolution lithography

    NASA Astrophysics Data System (ADS)

    Forman, Darren Lawrence

    While the prospect of nanoscale manufacturing has generated tremendous excitement, arbitrary patterning at nanometer length scales cannot be brought about with current photolithography---the technology that for decades has driven electronics miniaturization and enabled mass production of digital logic, memory, MEMS and flat-panel displays. This is due to the relatively long wavelength of light and diffraction, which imposes a physical not technological limit on the resolution of a far-field optical pattern. Photoinhibited superresolution (PInSR) lithography is a new scheme designed to beat the diffraction limit through two-color confinement of photopolymerization and, via efficient single-photon absorption kinetics, also be high-throughput capable. This thesis describes development of an integrated optical and materials system for investigating spatiotemporal dynamics of photoinhibited superresolution lithography, with a demonstrated 3x superresolution beyond the diffraction limit. The two-color response, arising from orthogonal photogeneration of species that participate in competing reactions, is shown to be highly complex. This is both a direct and indirect consequence of mobility. Interesting trade-offs arise: thin-film resins (necessitated by single-photon absorption kinetics) require high viscosity for film stability, but the photoinhibition effect is suppressed in viscous resins. Despite this apparent suppression, which can be overcome with high excitation of the photoinhibition system, the low mobility afforded by viscous materials is beneficial for confinement of active species. Diffusion-induced blurring of patterned photoinhibition is problematic in a resin with viscosity = 1,000 cP, and overcome in a resin with viscosity eta = 500,000 cP. Superresolution of factor 3x beyond the diffraction limit is demonstrated at 0.2 NA, with additional results indicating superresolution ability at 1.2 NA. Investigating the effect of diminished photoinhibition efficacy

  7. Advanced Sensors and Applications Study (ASAS)

    NASA Technical Reports Server (NTRS)

    Chism, S. B.; Hughes, C. L.

    1976-01-01

    The present EOD requirements for sensors in the space shuttle era are reported with emphasis on those applications which were deemed important enough to warrant separate sections. The application areas developed are: (1) agriculture; (2) atmospheric corrections; (3) cartography; (4) coastal studies; (5) forestry; (6) geology; (7) hydrology; (8) land use; (9) oceanography; and (10) soil moisture. For each application area. The following aspects were covered: (1) specific goals and techniques, (2) individual sensor requirements including types, bands, resolution, etc.; (3) definition of mission requirements, type orbits, coverages, etc.; and (4) discussion of anticipated problem areas and solutions. The remote sensors required for these application areas include; (1) camera systems; (2) multispectral scanners; (3) microwave scatterometers; (4) synthetic aperture radars; (5) microwave radiometers; and (6) vidicons. The emphasis in the remote sensor area was on the evaluation of present technology implications about future systems.

  8. Nanoimprint lithography: an enabling technology for nanophotonics

    NASA Astrophysics Data System (ADS)

    Yao, Yuhan; Liu, He; Wang, Yifei; Li, Yuanrui; Song, Boxiang; Bratkovsk, Alexandre; Wang, Shih-Yuan; Wu, Wei

    2015-11-01

    Nanoimprint lithography (NIL) is an indispensable tool to realize a fast and accurate nanoscale patterning in nanophotonics due to high resolution and high yield. The number of publication on NIL has increased from less than a hundred per year to over three thousand per year. In this paper, the most recent developments on NIL patterning transfer processes and its applications on nanophotonics are discussed and reviewed. NIL has been opening up new opportunities for nanophotonics, especially in fabricating optical meta-materials. With more researches on this low-cost high-throughput fabrication technology, we should anticipate a brighter future for nanophotonics and NIL.

  9. Atom Lithography with a Holographic Light Mask

    NASA Astrophysics Data System (ADS)

    Mützel, M.; Tandler, S.; Haubrich, D.; Meschede, D.; Peithmann, K.; Flaspöhler, M.; Buse, K.

    2002-02-01

    In atom lithography with optical masks, deposition of an atomic beam on a given substrate is controlled by a standing light-wave field. The lateral intensity distribution of the light field is transferred to the substrate with nanometer scale. We have tailored a complex pattern of this intensity distribution through diffraction of a laser beam from a hologram that is stored in a photorefractive crystal. This method can be extended to superpose 1000 or more laser beams. The method is furthermore applicable during growth processes and thus allows full 3D structuring of suitable materials with periodic and nonperiodic patterns at nanometer scales.

  10. Advanced technology application for combustion chamber concepts

    NASA Technical Reports Server (NTRS)

    Tygielski, Kathy S.

    1992-01-01

    NASA-Marshall is engaged in the development of an Advanced Main Combustion Chamber under the aegis of the Earth-to-Orbit Propulsion Technology Program. AMCC is to be a robust and highly reliable combustion-chamber prototype costing one-third as much as current designs of comparable performance; it will be associated with a reduction of fabrication time by one-half. Attention is presently given to the three component-manufacturing processes used: single-piece investment casting for the structural jacket and manifolds; vacuum plasma spraying, for the combustion liner, and an alternative, platelet-compounded liner.

  11. Advanced miniature processing handware for ATR applications

    NASA Technical Reports Server (NTRS)

    Chao, Tien-Hsin (Inventor); Daud, Taher (Inventor); Thakoor, Anikumar (Inventor)

    2003-01-01

    A Hybrid Optoelectronic Neural Object Recognition System (HONORS), is disclosed, comprising two major building blocks: (1) an advanced grayscale optical correlator (OC) and (2) a massively parallel three-dimensional neural-processor. The optical correlator, with its inherent advantages in parallel processing and shift invariance, is used for target of interest (TOI) detection and segmentation. The three-dimensional neural-processor, with its robust neural learning capability, is used for target classification and identification. The hybrid optoelectronic neural object recognition system, with its powerful combination of optical processing and neural networks, enables real-time, large frame, automatic target recognition (ATR).

  12. Advance leads to new diamond coatings applications

    SciTech Connect

    Cederquist, S.C.

    1999-06-01

    a significant advance in producing wear-resistant coatings has been achieved by scientists at the US Department of Energy's Sandia National Laboratories (SNL) (Albuquerque, New Mexico) through the discovery of a stress-free amorphous (noncrystalline) diamond thin film material that has many of the same properties as its crystalline diamond cousin. The stress-free amorphous diamond coating is harder than any other known coating--with the exception of crystalline diamond. Crystalline diamond films are difficult to grow, and even harder to shape into parts. Thin films of amorphous diamond offer some flexibility, but are associated with problems like warping.

  13. Advanced materials for aircraft engine applications.

    PubMed

    Backman, D G; Williams, J C

    1992-02-28

    A review of advances for aircraft engine structural materials and processes is presented. Improved materials, such as superalloys, and the processes for making turbine disks and blades have had a major impact on the capability of modern gas turbine engines. New structural materials, notably composites and intermetallic materials, are emerging that will eventually further enhance engine performance, reduce engine weight, and thereby enable new aircraft systems. In the future, successful aerospace manufacturers will combine product design and materials excellence with improved manufacturing methods to increase production efficiency, enhance product quality, and decrease the engine development cycle time. PMID:17817782

  14. Uncooled thermal imaging sensor and application advances

    NASA Astrophysics Data System (ADS)

    Norton, Peter W.; Cox, Stephen; Murphy, Bob; Grealish, Kevin; Joswick, Mike; Denley, Brian; Feda, Frank; Elmali, Loriann; Kohin, Margaret

    2006-05-01

    BAE Systems continues to advance the technology and performance of microbolometer-based thermal imaging modules and systems. 640x480 digital uncooled infrared focal plane arrays are in full production, illustrated by recent production line test data for two thousand focal plane arrays. This paper presents a snapshot of microbolometer technology at BAE Systems and an overview of two of the most important thermal imaging sensor programs currently in production: a family of thermal weapons sights for the United States Army and a thermal imager for the remote weapons station on the Stryker vehicle.

  15. Advanced composites: Design and application. Proceedings of the meeting of the Mechanical Failures Prevention Group

    NASA Technical Reports Server (NTRS)

    Shives, T. R.; Willard, W. A.

    1979-01-01

    The design and application of advanced composites is discussed with emphasis on aerospace, aircraft, automotive, marine, and industrial applications. Failure modes in advanced composites are also discussed.

  16. Physical Limitations in Lithography for Microelectronics.

    ERIC Educational Resources Information Center

    Flavin, P. G.

    1981-01-01

    Describes techniques being used in the production of microelectronics kits which have replaced traditional optical lithography, including contact and optical projection printing, and X-ray and electron beam lithography. Also includes limitations of each technique described. (SK)

  17. Ceramic applications in the advanced Stirling automotive engine

    NASA Technical Reports Server (NTRS)

    Tomazic, W. A.; Cairelli, J. E.

    1977-01-01

    The ideal cycle, its application to a practical machine, and the specific advantages of high efficiency, low emissions, multi-fuel capability, and low noise of the stirling engine are discussed. Certain portions of the Stirling engine must operate continuously at high temperature. Ceramics offer the potential of cost reduction and efficiency improvement for advanced engine applications. Potential applications for ceramics in Stirling engines, and some of the special problems pertinent to using ceramics in the Stirling engine are described. The research and technology program in ceramics which is planned to support the development of advanced Stirling engines is outlined.

  18. Advanced remote handling developments for high radiation applications

    SciTech Connect

    Herndon, J.N.; Kring, C.T.; Feldman, M.J.; Kuban, D.P.; Martin, H.L.; Rowe, J.C.; Hamel, W.R.

    1985-01-01

    The Remote Control Engineering Task of the Consolidated Fuel Reprocessing Program at Oak Ridge National Laboratory has been developing advanced techniques for remote maintenance of future US fuel reprocessing plants. These efforts are based on the application of teleoperated, force-reflecting servomanipulators for dexterous remote handling with television viewing for large-volume hazardous applications. These developments fully address the nonrepetitive nature of remote maintenance in the unstructured environments encountered in fuel reprocessing. This paper covers the primary emphasis in the present program; the design, fabrication, and installation of a prototype remote handling system for reprocessing applications, the Advanced Integrated Maintenance System.

  19. Materials Design for Block Copolymer Lithography

    NASA Astrophysics Data System (ADS)

    Sweat, Daniel Patrick

    Block copolymers (BCPs) have attracted a great deal of scientific and technological interest due to their ability to spontaneously self-assemble into dense periodic nanostructures with a typical length scale of 5 to 50 nm. The use of self-assembled BCP thin-films as templates to form nanopatterns over large-area is referred to as BCP lithography. Directed self-assembly of BCPs is now viewed as a viable candidate for sub-20 nm lithography by the semiconductor industry. However, there are multiple aspects of assembly and materials design that need to be addressed in order for BCP lithography to be successful. These include substrate modification with polymer brushes or mats, tailoring of the block copolymer chemistry, understanding thin-film assembly and developing epitaxial like methods to control long range alignment. The rational design, synthesis and self-assembly of block copolymers with large interaction parameters (chi) is described in the first part of this dissertation. Two main blocks were chosen for introducing polarity into the BCP system, namely poly(4-hydroxystyrene) and poly(2-vinylpyridine). Each of these blocks are capable of ligating Lewis acids which can increase the etch contrast between the blocks allowing for facile pattern transfer to the underlying substrate. These BCPs were synthesized by living anionic polymerization and showed excellent control over molecular weight and dispersity, providing access to sub 5-nm domain sizes. Polymer brushes consist of a polymer chain with one end tethered to the surface and have wide applicability in tuning surface energy, forming responsive surfaces and increasing biocompatibility. In the second part of the dissertation, we present a universal method to grow dense polymer brushes on a wide range of substrates and combine this chemistry with BCP assembly to fabricate nanopatterned polymer brushes. This is the first demonstration of introducing additional functionality into a BCP directing layer and opens up

  20. Advanced Turbine Technology Applications Project (ATTAP)

    NASA Technical Reports Server (NTRS)

    1991-01-01

    This report summarizes work performed in support of the development and demonstration of a structural ceramic technology for automotive gas turbine engines. The AGT101 regenerated gas turbine engine developed under the previous DOE/NASA Advanced Gas Turbine (AGT) program is being utilized for verification testing of the durability of next-generation ceramic components and their suitability for service at reference powertrain design conditions. Topics covered in this report include ceramic processing definition and refinement, design improvements to the test bed engine and test rigs, and design methodologies related to ceramic impact and fracture mechanisms. Appendices include reports by ATTAP subcontractors addressing the development of silicon nitride and silicon carbide families of materials and processes.

  1. Advanced communications payload for mobile applications

    NASA Technical Reports Server (NTRS)

    Ames, S. A.; Kwan, R. K.

    1990-01-01

    An advanced satellite payload is proposed for single hop linking of mobile terminals of all classes as well as Very Small Aperture Terminal's (VSAT's). It relies on an intensive use of communications on-board processing and beam hopping for efficient link design to maximize capacity and a large satellite antenna aperture and high satellite transmitter power to minimize the cost of the ground terminals. Intersatellite links are used to improve the link quality and for high capacity relay. Power budgets are presented for links between the satellite and mobile, VSAT, and hub terminals. Defeating the effects of shadowing and fading requires the use of differentially coherent demodulation, concatenated forward error correction coding, and interleaving, all on a single link basis.

  2. Applications technology satellites advanced mission study

    NASA Technical Reports Server (NTRS)

    Gould, L. M.

    1972-01-01

    Three spacecraft configurations were designed for operation as a high powered synchronous communications satellite. Each spacecraft includes a 1 kw TWT and a 2 kw Klystron power amplifier feeding an antenna with multiple shaped beams. One of the spacecraft is designed to be boosted by a Thor-Delta launch vehicle and raised to synchronous orbit with electric propulsion. The other two are inserted into a elliptical transfer orbit with an Atlas Centaur and injected into final orbit with an apogee kick motor. Advanced technologies employed in the several configurations include tubes with multiple stage collectors radiating directly to space, multiple-contoured beam antennas, high voltage rollout solar cell arrays with integral power conditioning, electric propulsion for orbit raising and on-station attitude control and station-keeping, and liquid metal slip rings.

  3. RECENT ADVANCES IN PESTICIDE SPRAY APPLICATION TECHNOLOGY

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Applications of pesticides and other production strategies have ensured adequate and high quality food, fiber, floral and nursery crops. To meet the wide variety of canopy structure characteristics, growing circumstances and marketing requirements, high quality of pesticide transport is essential t...

  4. Advances in laser diodes for pyrotechnic applications

    NASA Technical Reports Server (NTRS)

    Craig, Richard R.

    1993-01-01

    Background information concerning the use of laser diodes in pyrotechnic applications is provided in viewgraph form. The following topics are discussed: damage limits, temperature stability, fiber coupling issues, and small (100 micron) and large (400 micron) fiber results. The discussions concerning fiber results concentrate on the areas of package geometry and electro-optical properties.

  5. Polymer nanofibers by soft lithography

    NASA Astrophysics Data System (ADS)

    Pisignano, Dario; Maruccio, Giuseppe; Mele, Elisa; Persano, Luana; Di Benedetto, Francesca; Cingolani, Roberto

    2005-09-01

    The fabrication of polymeric fibers by soft lithography is demonstrated. Polyurethane, patterned by capillarity-induced molding with high-resolution elastomeric templates, forms mm-long fibers with a diameter below 0.3μm. The Young's modulus of the fabricated structures, evaluated by force-distance scanning probe spectroscopy, has a value of 0.8MPa. This is an excellent example of nanostructures feasible by the combination of soft nanopatterning and high-resolution fabrication approaches for master templates, and particularly electron-beam lithography.

  6. Towards Using DNAzyme in Sub-20 nm Lithography

    NASA Astrophysics Data System (ADS)

    Dirar, Qassim

    DNAzyme is a unique molecule with applications ranging from gene regulation to molecular machines. Another attractive venue for the use of DNAzyme is next generation lithography, sub-20 nm lithography, harnessing the unique features of specific recognition and self-assembly. Tools to achieve that goal are discussed and experimental procedures were presented. Loading DNAzyme on gold nanoparticles, depositing self-assembled monolayers and DNA patterning using soft lithographic techniques are tools that are explored. To support the findings, different characterization techniques are employed.

  7. Optimization of high average power FEL beam for EUV lithography

    NASA Astrophysics Data System (ADS)

    Endo, Akira

    2015-05-01

    Extreme Ultraviolet Lithography (EUVL) is entering into high volume manufacturing (HVM) stage, with high average power (250W) EUV source from laser produced plasma at 13.5nm. Semiconductor industry road map indicates a scaling of the source technology more than 1kW average power by high repetition rate FEL. This paper discusses on the lowest risk approach to construct a prototype based on superconducting linac and normal conducting undulator, to demonstrate a high average power 13.5nm FEL equipped with optimized optical components and solid state lasers, to study FEL application in EUV lithography.

  8. Predefined planar structures in semiconductor surfaces patterned by NSOM lithography

    NASA Astrophysics Data System (ADS)

    Lettrichova, Ivana; Pudis, Dusan; Laurencikova, Agata; Hasenohrl, Stanislav; Novak, Jozef; Skriniarova, Jaroslava; Kovac, Jaroslav

    2013-09-01

    Near-field scanning optical microscope (NSOM) lithography is one of optical technologies for planar structure fabrication, where exposure process is performed by optical near field produced at tip of fiber probe. Maskless exposure of defined regions is performed so that different periodic and predefined arrangement can be achieved. In this contribution, NSOM lithography is presented as effective tool for semiconductor device surface patterning. Non-contact mode of NSOM lithography was used to pattern planar predefined structures in GaAs, AlGaAs and GaP surfaces. In this way, GaAs/AlGaAs-based LED with patterned structure in the emitting surface was prepared, where patterned air holes show enhancement of radiation in comparison with the surrounding surface. Furthermore, NSOM in combination with lift-off technique was used to prepare metal-catalyst particles on GaP substrate for subsequent growth of GaP nanowires which can be used in photovoltaic applications.

  9. High power infrared QCLs: advances and applications

    NASA Astrophysics Data System (ADS)

    Patel, C. Kumar N.

    2012-01-01

    QCLs are becoming the most important sources of laser radiation in the midwave infrared (MWIR) and longwave infrared (LWIR) regions because of their size, weight, power and reliability advantages over other laser sources in the same spectral regions. The availability of multiwatt RT operation QCLs from 3.5 μm to >16 μm with wall plug efficiency of 10% or higher is hastening the replacement of traditional sources such as OPOs and OPSELs in many applications. QCLs can replace CO2 lasers in many low power applications. Of the two leading groups in improvements in QCL performance, Pranalytica is the commercial organization that has been supplying the highest performance QCLs to various customers for over four year. Using a new QCL design concept, the non-resonant extraction [1], we have achieved CW/RT power of >4.7 W and WPE of >17% in the 4.4 μm - 5.0 μm region. In the LWIR region, we have recently demonstrated QCLs with CW/RT power exceeding 1 W with WPE of nearly 10 % in the 7.0 μm-10.0 μm region. In general, the high power CW/RT operation requires use of TECs to maintain QCLs at appropriate operating temperatures. However, TECs consume additional electrical power, which is not desirable for handheld, battery-operated applications, where system power conversion efficiency is more important than just the QCL chip level power conversion efficiency. In high duty cycle pulsed (quasi-CW) mode, the QCLs can be operated without TECs and have produced nearly the same average power as that available in CW mode with TECs. Multiwatt average powers are obtained even in ambient T>70°C, with true efficiency of electrical power-to-optical power conversion being above 10%. Because of the availability of QCLs with multiwatt power outputs and wavelength range covering a spectral region from ~3.5 μm to >16 μm, the QCLs have found instantaneous acceptance for insertion into multitude of defense and homeland security applications, including laser sources for infrared

  10. Microfabrication using soft lithography

    NASA Astrophysics Data System (ADS)

    Zhao, Xiao-Mei

    Soft Lithography is a group of non-photolithographic techniques currently being explored in our group. Four such techniques-microcontact printing (μCP), replica molding (REM), micromolding in capillaries (MIMIC), and microtransfer molding (μTM)-have been demonstrated for fabricating micro- and nanostructures of a variety of materials with dimension >=30 nm. Part I (Chapters 1-5) reviews several aspects of the three molding techniques REM, MIMIC, and μTM. Chapters 1-3 describe μTM and MIMIC, and the use of these techniques in the fabrication of functional devices. μTM is capable of generating μm-scale structures over large areas, on both planar and contoured surfaces, and is able to make 3-dimensional structures layer by layer. The capability of μTM and MIMIC has been demonstrated in the fabrication of single-mode waveguides, waveguide couplers and interferometers. The coupling between waveguides can be tailored by waveguide spacing or the differential in curing time between the waveguides and the cladding. Chapters 4-5 demonstrate the combination of REM and shrinkable polystyrene (PS) films to reduce the feature size of microstructures and to generate microstructures with high aspect ratios on both planar and curved surfaces. A shrinkable PS film is patterned with relief structures, and then heated and shrinks. Thermal shrinkage results in a 100-fold increase in the aspect ratio of the patterned microstructures in the PS film. The microstructures in the shrunken PS films can be transferred to many other materials by REM. Part II (Chapters 6-7) focuses on two issues in the microfabrication using self-assembled monolayers (SAMs) as ultrathin resists. Chapter 6 describes a selective etching solution for transferring patterns of SAMs of alkanethiolates into the underlying layers (e.g., gold, silver, and copper). This etching solution uses thiosulfate as the ligand that coordinates to the metal ions, and ferricyanide as the oxidant. It has been demonstrated to be

  11. [Advances in independent component analysis and its application].

    PubMed

    Chen, Huafu; Yao, Dezhong

    2003-06-01

    The independent component analysis (ICA) is a new technique in statistical signal processing, which decomposes mixed signals into statistical independent components. The reported applications in biomedical and radar signal have demonstrated its good prospect in various blind signal separation. In this paper, the progress of ICA in such as its principle, algorithm and application and advance direction of ICA in future is reviewed. The aim is to promote the research in theory and application in the future. PMID:12856621

  12. Generating mask inspection rules for advanced lithography

    NASA Astrophysics Data System (ADS)

    Badger, Karen; Broadbent, Bill; Dayal, Aditya; Gallagher, Emily; Hsiang, ChingYun; Redding, Vincent

    2005-11-01

    Semiconductor product designs are necessarily constrained by both the wafer and mask lithographic capabilities. When mask image sizes approach the exposure wavelength, optical and resist effects distort the printed images. Applying optical proximity correction (OPC) to design features on the mask compensates for diffraction effects. However, aggressive OPC introduces even smaller minimum features, adds notches and bulges, introduces sub-resolution assist features (SRAFs) and generally creates a more challenging mask design with respect to data handling, printing and inspection. Mask defect inspection is a critical part of the mask process, ensuring that the mask pattern matches the intended design. However, the inspection itself imposes constraints on mask patterns that can be inspected with high defect sensitivity but low nuisance defect counts. These additional restrictions are undesirable since they can reduce the effectiveness of the OPC. IBM and KLA-Tencor have developed a test mask methodology to investigate the inspectability limits of the 576 and 516 mask inspection systems. The test mask design contains a variety of rules or features that currently impose inspectability limits on the inspection tools, in a range of sizes. The design also incorporates many features essential for obtaining valid results, such as a user-friendly layout, multiple pattern orientations, and background patterns. The mask was built and inspected in IBM Burlington's mask house. Preliminary inspection results will be presented; they underscore the importance of understanding both the inspection tool and the mask process when restricting mask design rules.

  13. Digraph reliability model processing advances and applications

    NASA Technical Reports Server (NTRS)

    Iverson, D. L.; Patterson-Hine, F. A.

    1993-01-01

    This paper describes a new algorithm, called SourceDoubls, which efficiently solves for singletons and doubletons of a digraph reliability model. Compared with previous methods, the SourceDoubls algorithm provides up to a two order of magnitude reduction in the amount of time required to solve large digraph models. This significant increase in model solution speed allows complex digraphs containing thousands of nodes to be used as knowledge bases for real time automated monitoring and diagnosis applications. Currently, an application to provide monitoring and diagnosis of the Space Station Freedom Data Management System is under development at NASA/Ames Research Center and NASA/Johnson Space Center. This paper contains an overview of this system and provides details of how it will use digraph models processed by the SourceDoubls algorithm to accomplish its task.

  14. MEMS temperature scanner: principles, advances, and applications

    NASA Astrophysics Data System (ADS)

    Otto, Thomas; Saupe, Ray; Stock, Volker; Gessner, Thomas

    2010-02-01

    Contactless measurement of temperatures has gained enormous significance in many application fields, ranging from climate protection over quality control to object recognition in public places or military objects. Thereby measurement of linear or spatially temperature distribution is often necessary. For this purposes mostly thermographic cameras or motor driven temperature scanners are used today. Both are relatively expensive and the motor drive devices are limited regarding to the scanning rate additionally. An economic alternative are temperature scanner devices based on micro mirrors. The micro mirror, attached in a simple optical setup, reflects the emitted radiation from the observed heat onto an adapted detector. A line scan of the target object is obtained by periodic deflection of the micro scanner. Planar temperature distribution will be achieved by perpendicularly moving the target object or the scanner device. Using Planck radiation law the temperature of the object is calculated. The device can be adapted to different temperature ranges and resolution by using different detectors - cooled or uncooled - and parameterized scanner parameters. With the basic configuration 40 spatially distributed measuring points can be determined with temperatures in a range from 350°C - 1000°C. The achieved miniaturization of such scanners permits the employment in complex plants with high building density or in direct proximity to the measuring point. The price advantage enables a lot of applications, especially new application in the low-price market segment This paper shows principle, setup and application of a temperature measurement system based on micro scanners working in the near infrared range. Packaging issues and measurement results will be discussed as well.

  15. Advanced Interconnect Roadmap for Space Applications

    NASA Technical Reports Server (NTRS)

    Galbraith, Lissa

    1999-01-01

    This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

  16. Advances and applications of occupancy models

    USGS Publications Warehouse

    Bailey, Larissa; MacKenzie, Darry I.; Nichols, James D.

    2013-01-01

    Summary: The past decade has seen an explosion in the development and application of models aimed at estimating species occurrence and occupancy dynamics while accounting for possible non-detection or species misidentification. We discuss some recent occupancy estimation methods and the biological systems that motivated their development. Collectively, these models offer tremendous flexibility, but simultaneously place added demands on the investigator. Unlike many mark–recapture scenarios, investigators utilizing occupancy models have the ability, and responsibility, to define their sample units (i.e. sites), replicate sampling occasions, time period over which species occurrence is assumed to be static and even the criteria that constitute ‘detection’ of a target species. Subsequent biological inference and interpretation of model parameters depend on these definitions and the ability to meet model assumptions. We demonstrate the relevance of these definitions by highlighting applications from a single biological system (an amphibian–pathogen system) and discuss situations where the use of occupancy models has been criticized. Finally, we use these applications to suggest future research and model development.

  17. Advanced giant magnetoresistance technology for measurement applications

    NASA Astrophysics Data System (ADS)

    Weiss, Roland; Mattheis, Roland; Reiss, Günter

    2013-08-01

    Giant magnetoresistance (GMR) sensors are considered one of the first real applications of nanotechnology. They consist of nm-thick layered structures where ferromagnetic metals are sandwiched by nonmagnetic metals. Such multilayered films produce a large change in resistance (typically 10 to 20%) when subjected to a magnetic field, compared with a maximum change of a few per cent for other types of magnetic sensors. This technology has been intensively used in read heads for hard disk drives and now increasingly finds applications due to the high sensitivity and signal-to-noise ratio. Additionally these sensors are compatible with miniaturization and thus offer a high spatial resolution combined with a frequency range up to the 100 MHz regime and simple electronic conditioning. In this review, we first discuss the basics of the underlying magnetoresistance effects in layered structures and then present three prominent examples for future applications: in the field of current sensing the new GMR sensors offer high bandwidth and good accuracy in a space-saving open loop measurement configuration. In rotating systems they can be used for multiturn angle measurements, and in biotechnology the detection of magnetic particles enables the quantitative measurement of biomolecule concentrations.

  18. Advanced helium magnetometer for space applications

    NASA Technical Reports Server (NTRS)

    Slocum, Robert E.

    1987-01-01

    The goal of this effort was demonstration of the concepts for an advanced helium magnetometer which meets the demands of future NASA earth orbiting, interplanetary, solar, and interstellar missions. The technical effort focused on optical pumping of helium with tunable solid state lasers. We were able to demonstrate the concept of a laser pumped helium magnetometer with improved accuracy, low power, and sensitivity of the order of 1 pT. A number of technical approaches were investigated for building a solid state laser tunable to the helium absorption line at 1083 nm. The laser selected was an Nd-doped LNA crystal pumped by a diode laser. Two laboratory versions of the lanthanum neodymium hexa-aluminate (LNA) laser were fabricated and used to conduct optical pumping experiments in helium and demonstrate laser pumped magnetometer concepts for both the low field vector mode and the scalar mode of operation. A digital resonance spectrometer was designed and built in order to evaluate the helium resonance signals and observe scalar magnetometer operation. The results indicate that the laser pumped sensor in the VHM mode is 45 times more sensitive than a lamp pumped sensor for identical system noise levels. A study was made of typical laser pumped resonance signals in the conventional magnetic resonance mode. The laser pumped sensor was operated as a scalar magnetometer, and it is concluded that magnetometers with 1 pT sensitivity can be achieved with the use of laser pumping and stable laser pump sources.

  19. Vertical Flow Lithography for Fabrication of 3D Anisotropic Particles.

    PubMed

    Habasaki, Shohei; Lee, Won Chul; Yoshida, Shotaro; Takeuchi, Shoji

    2015-12-22

    A microfluidics-based method for the 3D fabrication of anisotropic particles is reported. The method uses a vertical microchannel where tunable light patterns solidify photocurable resins for stacking multiple layers of the resins, thus enabling an application of stereolithography concepts to conventional flow lithography. Multilayered, tapered, and angular compartmental microparticles are demonstrated. PMID:26551590

  20. Molecular dynamics simulations: advances and applications

    PubMed Central

    Hospital, Adam; Goñi, Josep Ramon; Orozco, Modesto; Gelpí, Josep L

    2015-01-01

    Molecular dynamics simulations have evolved into a mature technique that can be used effectively to understand macromolecular structure-to-function relationships. Present simulation times are close to biologically relevant ones. Information gathered about the dynamic properties of macromolecules is rich enough to shift the usual paradigm of structural bioinformatics from studying single structures to analyze conformational ensembles. Here, we describe the foundations of molecular dynamics and the improvements made in the direction of getting such ensemble. Specific application of the technique to three main issues (allosteric regulation, docking, and structure refinement) is discussed.

  1. Biomedical Applications of Advanced Multifunctional Magnetic Nanoparticles.

    PubMed

    Long, Nguyen Viet; Yang, Yong; Teranishi, Toshiharu; Thi, Cao Minh; Cao, Yanqin; Nogami, Masayuki

    2015-12-01

    In this review, we have presented the latest results and highlights on biomedical applications of a class of noble metal nanoparticles, such as gold, silver and platinum, and a class of magnetic nanoparticles, such as cobalt, nickel and iron. Their most important related compounds are also discussed for biomedical applications for treating various diseases, typically as cancers. At present, both physical and chemical methods have been proved very successful to synthesize, shape, control, and produce metal- and oxide-based homogeneous particle systems, e.g., nanoparticles and microparticles. Therefore, we have mainly focused on functional magnetic nanoparticles for nanomedicine because of their high bioadaptability to the organs inside human body. Here, bioconjugation techniques are very crucial to link nanoparticles with conventional drugs, nanodrugs, biomolecules or polymers for biomedical applications. Biofunctionalization of engineered nanoparticles for biomedicine is shown respective to in vitro and in vivo analysis protocols that typically include drug delivery, hyperthermia therapy, magnetic resonance imaging (MRI), and recent outstanding progress in sweep imaging technique with Fourier transformation (SWIFT) MRI. The latter can be especially applied using magnetic nanoparticles, such as Co-, Fe-, Ni-based nanoparticles, α-Fe2O3, and Fe3O4 oxide nanoparticles for analysis and treatment of malignancies. Therefore, this review focuses on recent results of scientists, and related research on diagnosis and treatment methods of common and dangerous diseases by biomedical engineered nanoparticles. Importantly, nanosysems (nanoparticles) or microsystems (microparticles) or hybrid micronano systems are shortly introduced into nanomedicine. Here, Fe oxide nanoparticles ultimately enable potential and applicable technologies for tumor-targeted imaging and therapy. Finally, we have shown the latest aspects of the most important Fe-based particle systems, such as Fe,

  2. LBB application in the US operating and advanced reactors

    SciTech Connect

    Wichman, K.; Tsao, J.; Mayfield, M.

    1997-04-01

    The regulatory application of leak before break (LBB) for operating and advanced reactors in the U.S. is described. The U.S. Nuclear Regulatory Commission (NRC) has approved the application of LBB for six piping systems in operating reactors: reactor coolant system primary loop piping, pressurizer surge, safety injection accumulator, residual heat removal, safety injection, and reactor coolant loop bypass. The LBB concept has also been applied in the design of advanced light water reactors. LBB applications, and regulatory considerations, for pressurized water reactors and advanced light water reactors are summarized in this paper. Technology development for LBB performed by the NRC and the International Piping Integrity Research Group is also briefly summarized.

  3. Advanced Pattern Material for Investment Casting Applications

    SciTech Connect

    F. Douglas Neece Neil Chaudhry

    2006-02-08

    Cleveland Tool and Machine (CTM) of Cleveland, Ohio in conjunction with Harrington Product Development Center (HPDC) of Cincinnati, Ohio have developed an advanced, dimensionally accurate, temperature-stable, energy-efficient and cost-effective material and process to manufacture patterns for the investment casting industry. In the proposed technology, FOPAT (aFOam PATtern material) has been developed which is especially compatible with the investment casting process and offers the following advantages: increased dimensional accuracy; increased temperature stability; lower cost per pattern; less energy consumption per pattern; decreased cost of pattern making equipment; decreased tooling cost; increased casting yield. The present method for investment casting is "the lost wax" process, which is exactly that, the use of wax as a pattern material, which is then melted out or "lost" from the ceramic shell. The molten metal is then poured into the ceramic shell to produce a metal casting. This process goes back thousands of years and while there have been improvements in the wax and processing technology, the material is basically the same, wax. The proposed technology is based upon an established industrial process of "Reaction Injection Molding" (RIM) where two components react when mixed and then "molded" to form a part. The proposed technology has been modified and improved with the needs of investment casting in mind. A proprietary mix of components has been formulated which react and expand to form a foam-like product. The result is an investment casting pattern with smooth surface finish and excellent dimensional predictability along with the other key benefits listed above.

  4. Analysis of laser durability of CaF2 for optical lithography

    NASA Astrophysics Data System (ADS)

    Grabosch, Guenter; Parthier, Lutz; Natura, Ute; Poehl, Karin; Letz, Martin; Muehlig, Christian; Knapp, Konrad

    2005-02-01

    Photolithography is a key technolgoy for the production of semiconductor devices. It supports the continuing trend towards higher integration density of microelectronic devices. The material used in the optics of lithography tools has to be of extremely high quality to ensure the high demand of the imaging. Due to its properties CaF2 is a material of choice for the application in lithography systems. Because of the compexity of the lithography tools single lenses or lens system modules cannot be replaced. Therefore the lens material has to last the full lifetime of the tool without major degradation. According to the roadmap for next generation of optical lithography tools, like immersion lithography, the requirements of CaF2 for radiation hardness are increasing considerably. We will present a detailed analysis of the key factors influencing the laser hardness covering the complete production chain. Some aspects of the evaluation methods for testing CaF2 laser durability will be presented.

  5. Advancing differential atom interferometry for space applications

    NASA Astrophysics Data System (ADS)

    Chiow, Sheng-Wey; Williams, Jason; Yu, Nan

    2016-05-01

    Atom interferometer (AI) based sensors exhibit precision and accuracy unattainable with classical sensors, thanks to the inherent stability of atomic properties. Dual atomic sensors operating in a differential mode further extend AI applicability beyond environmental disturbances. Extraction of the phase difference between dual AIs, however, typically introduces uncertainty and systematic in excess of that warranted by each AI's intrinsic noise characteristics, especially in practical applications and real time measurements. In this presentation, we report our efforts in developing practical schemes for reducing noises and enhancing sensitivities in the differential AI measurement implementations. We will describe an active phase extraction method that eliminates the noise overhead and demonstrates a performance boost of a gravity gradiometer by a factor of 3. We will also describe a new long-baseline approach for differential AI measurements in a laser ranging assisted AI configuration. The approach uses well-developed AIs for local measurements but leverage the mature schemes of space laser interferometry for LISA and GRACE. This research was carried out at the Jet Propulsion Laboratory, California Institute of Technology, under a Contract with NASA.

  6. Photonics in advanced process control applications

    NASA Astrophysics Data System (ADS)

    Lundqvist, Stefan H.; Andersson, Torbjoern; Grimbrandt, Jan

    1999-02-01

    A measurement system optimized for process control in the industrial environment has been developed and successfully commercialized. The system comprises a central unit, which contains all sensitive electronic and electro-optic parts. Fiber optics is used to transport the probing laser light to the measuring points in the process. Extremely rugged sensor heads are used to interface to the harsh industrial environment. Adaptation to the different applications is solely made up by changing the type of sensor head used. Six different process control applications will be presented. Ammonia slip monitoring in the NO(subscript x4/ reduction process in power stations, waste incinerators and heavy-duty diesel engines. Measurement of water vapor and oxygen in municipal waste to energy plants. Monitoring of oxygen and the thermodynamic gas temperature in steel pellets manufacturing. Monitoring HF reduction in a dry scrubber and HF emission from a pot room. Experiences of CO emission peak monitoring to protect electro filter in a chemical waste incinerator. Finally, we will describe measurements of HCI in the raw gas to access the calorific value of waste and to optimize bag-house filter operation.

  7. Advanced Materials and Coatings for Aerospace Applications

    NASA Technical Reports Server (NTRS)

    Miyoshi, Kazuhisa

    2004-01-01

    In the application area of aerospace tribology, researchers and developers must guarantee the highest degree of reliability for materials, components, and systems. Even a small tribological failure can lead to catastrophic results. The absence of the required knowledge of tribology, as Professor H.P. Jost has said, can act as a severe brake in aerospace vehicle systems-and indeed has already done so. Materials and coatings must be able to withstand the aerospace environments that they encounter, such as vacuum terrestrial, ascent, and descent environments; be resistant to the degrading effects of air, water vapor, sand, foreign substances, and radiation during a lengthy service; be able to withstand the loads, stresses, and temperatures encountered form acceleration and vibration during operation; and be able to support reliable tribological operations in harsh environments throughout the mission of the vehicle. This presentation id divided into two sections: surface properties and technology practice related to aerospace tribology. The first section is concerned with the fundamental properties of the surfaces of solid-film lubricants and related materials and coatings, including carbon nanotubes. The second is devoted to applications. Case studies are used to review some aspects of real problems related to aerospace systems to help engineers and scientists to understand the tribological issues and failures. The nature of each problem is analyzed, and the tribological properties are examined. All the fundamental studies and case studies were conducted at the NASA Glenn Research Center.

  8. RET masks for the final frontier of optical lithography

    NASA Astrophysics Data System (ADS)

    Chen, J. F.; van den Broeke, Douglas; Hsu, Stephen; Hsu, Michael C. W.; Laidig, Tom; Shi, Xuelong; Chen, Ting; Socha, Robert J.; Hollerbach, Uwe; Wampler, Kurt E.; Park, Jungchul; Park, Sangbong; Gronlund, Keith

    2005-06-01

    With immersion and hyper numerical aperture (NA>1) optics apply to the ITRS 2003/4 roadmap scenario (Figure 1); it is very clear that the IC manufacturing has already stepped into the final frontier of optical lithography. Today"s advanced lithography for DRAM/Flash is operating at k1 close to 0.3. The manufacturing for leading edge logic devices does not follow too far behind. Patterning at near theoretical lithography imaging limit (k1=0.25) even with hyper NA optics, the attainable aerial image contrast is marginal at best for the critical feature. Thus, one of the key objectives for low k1 lithography is to ensure the printing performance of critical features for manufacturing. Resolution enhancement technology (RET) mask in combination with hyper NA and illumination optimization is one primary candidate to enable lithography manufacturing at very low k1 factor. The use of rule-based Scattering Bars (SB) for all types of phase-shifting masks has become the de facto OPC standard since 180nm node. Model-based SB OPC method derives from interference mapping lithography (IML) has shown impressive printing result for both clear (gate) and dark field (contact and via) mask types. There are four basic types of RET mask candidates for 65nm node, namely, alternating phase-shifting mask (altPSM), attenuated PSM (attPSM), chromeless phase lithography (CPL) PSM, and double dipole lithography (DDL) using binary chrome mask. The wafer printing performances from CPL and DDL have proven both are strong candidates for 45nm nodes. One concern for using RET masks to target 45 nm nodes is likely to be the scaling for SB dimension for 4X mask. To assist imaging effectively with high NA, SB cannot be too small in width. However, for SB to be larger than sub-resolution, they can easily cause unwanted SB printing. The other major concern is the unwanted side lobe printing. This may occur for semi-dense pitch ranges under high NA and strong off-axis-illumination (OAI). Looking ahead

  9. ITRS lithography roadmap: 2015 challenges

    NASA Astrophysics Data System (ADS)

    Neisser, Mark; Wurm, Stefan

    2015-08-01

    In the past few years, novel methods of patterning have made considerable progress. In 2011, extreme ultraviolet (EUV) lithography was the front runner to succeed optical lithography. However, although EUV tools for pilot production capability have been installed, its high volume manufacturing (HVM) readiness continues to be gated by productivity and availability improvements taking longer than expected. In the same time frame, alternative and/or complementary technologies to EUV have made progress. Directed self-assembly (DSA) has demonstrated improved defectivity and progress in integration with design and pattern process flows. Nanoimprint improved performance considerably and is pilot production capable for memory products. Maskless lithography has made progress in tool development and could have an α tool ready in the late 2015 or early 2016. But they all have to compete with multiple patterning. Quadruple patterning is already demonstrated and can pattern lines and spaces down to close to 10-nm half pitch. The other techniques have to do something better than quadruple patterning does to be chosen for implementation. DSA and NIL promise a lower cost. EUV promises a simpler and shorter process and the creation of 2-D patterns more easily with much reduced complexity compared to multiple patterning. Maskless lithography promises to make chip personalization easy and to be particularly cost effective for low-volume chip designs. Decision dates for all of the technologies are this year or next year.

  10. Biomolecular Patterning via Photocatalytic Lithography

    SciTech Connect

    Bearinger, J P; Hiddessen, A L; Wu, K J; Christian, A T; Dugan, L C; Stone, G; Camarero, J; Hinz, A K; Hubbell, J A

    2005-02-18

    We have developed a novel method for patterning surface chemistry: Photocatalytic Lithography. This technique relies on inexpensive stamp materials and light; it does not necessitate mass transport or specified substrates, and the wavelength of light should not limit feature resolution. We have demonstrated the utility of this technique through the patterning of proteins, single cells and bacteria.

  11. Graphic Arts/Offset Lithography.

    ERIC Educational Resources Information Center

    Hoisington, James; Metcalf, Joseph

    This revised curriculum for graphic arts is designed to provide secondary and postsecondary students with entry-level skills and an understanding of current printing technology. It contains lesson plans based on entry-level competencies for offset lithography as identified by educators and industry representatives. The guide is divided into 15…

  12. Marine applications for advanced composite materials

    SciTech Connect

    Hihara, L.H.; Bregman, R.; Takahashi, P.K.

    1993-12-31

    Very large floating structures (VLFSs) may one day be essential to the study and utilization of the ocean. Some possible applications for VLFSs are ocean ranching homeports. observatories for ocean research, seabed mineral refineries, energy generation platforms. and waste management facilities. A VLFS that is in the conceptual phase, and may one day be based off the coast of Hawaii, has been named Blue Revolution. Candidate materials for Blue Revolution were identified based on criteria of rigidity, strength, and weight. Priority was given to materials that could be used to construct lightweight VLFSs. Major static forces were considered in this preliminary analysis. The best materials were identified as those having low values of density/modulus ({rho}/E) and density/strength ({rho}/{sigma}). Concrete, metal alloys, organic-matrix composites (OMCs), and metal-matrix composites (MMCs) were evaluated. OMCs and MMCs were generally the best materials based on their very low {rho}/E and {rho}/{sigma} values.

  13. An advanced unmanned vehicle for remote applications

    SciTech Connect

    Pletta, J.B.; Sackos, J.

    1998-03-01

    An autonomous mobile robotic capability is critical to developing remote work applications for hazardous environments. A few potential applications include humanitarian demining and ordnance neutralization, extraterrestrial science exploration, and hazardous waste cleanup. The ability of the remote platform to sense and maneuver within its environment is a basic technology requirement which is currently lacking. This enabling technology will open the door for force multiplication and cost effective solutions to remote operations. The ultimate goal of this work is to develop a mobile robotic platform that can identify and avoid local obstacles as it traverses from its current location to a specified destination. This goal directed autonomous navigation scheme uses the Global Positioning System (GPS) to identify the robot`s current coordinates in space and neural network processing of LADAR range images for local obstacle detection and avoidance. The initial year funding provided by this LDRD project has developed a small exterior mobile robotic development platform and a fieldable version of Sandia`s Scannerless Range Imager (SRI) system. The robotic testbed platform is based on the Surveillance And Reconnaissance ground Equipment (SARGE) robotic vehicle design recently developed for the US DoD. Contingent upon follow-on funding, future enhancements will develop neural network processing of the range map data to traverse unstructured exterior terrain while avoiding obstacles. The SRI will provide real-time range images to a neural network for autonomous guidance. Neural network processing of the range map data will allow real-time operation on a Pentium based embedded processor board.

  14. A survey of advanced battery systems for space applications

    NASA Technical Reports Server (NTRS)

    Attia, Alan I.

    1989-01-01

    The results of a survey on advanced secondary battery systems for space applications are presented. Fifty-five battery experts from government, industry and universities participated in the survey by providing their opinions on the use of several battery types for six space missions, and their predictions of likely technological advances that would impact the development of these batteries. The results of the survey predict that only four battery types are likely to exceed a specific energy of 150 Wh/kg and meet the safety and reliability requirements for space applications within the next 15 years.

  15. Lithography light source fault detection

    NASA Astrophysics Data System (ADS)

    Graham, Matthew; Pantel, Erica; Nelissen, Patrick; Moen, Jeffrey; Tincu, Eduard; Dunstan, Wayne; Brown, Daniel

    2010-04-01

    High productivity is a key requirement for today's advanced lithography exposure tools. Achieving targets for wafers per day output requires consistently high throughput and availability. One of the keys to high availability is minimizing unscheduled downtime of the litho cell, including the scanner, track and light source. From the earliest eximer laser light sources, Cymer has collected extensive performance data during operation of the source, and this data has been used to identify the root causes of downtime and failures on the system. Recently, new techniques have been developed for more extensive analysis of this data to characterize the onset of typical end-of-life behavior of components within the light source and allow greater predictive capability for identifying both the type of upcoming service that will be required and when it will be required. The new techniques described in this paper are based on two core elements of Cymer's light source data management architecture. The first is enhanced performance logging features added to newer-generation light source software that captures detailed performance data; and the second is Cymer OnLine (COL) which facilitates collection and transmission of light source data. Extensive analysis of the performance data collected using this architecture has demonstrated that many light source issues exhibit recognizable patterns in their symptoms. These patterns are amenable to automated identification using a Cymer-developed model-based fault detection system, thereby alleviating the need for detailed manual review of all light source performance information. Automated recognition of these patterns also augments our ability to predict the performance trending of light sources. Such automated analysis provides several efficiency improvements for light source troubleshooting by providing more content-rich standardized summaries of light source performance, along with reduced time-to-identification for previously

  16. A physical resist shrinkage model for full-chip lithography simulations

    NASA Astrophysics Data System (ADS)

    Liu, Peng; Zheng, Leiwu; Ma, Maggie; Zhao, Qian; Fan, Yongfa; Zhang, Qiang; Feng, Mu; Guo, Xin; Wallow, Tom; Gronlund, Keith; Goossens, Ronald; Zhang, Gary; Lu, Yenwen

    2016-03-01

    Strong resist shrinkage effects have been widely observed in resist profiles after negative tone development (NTD) and therefore must be taken into account in computational lithography applications. However, existing lithography simulation tools, especially those designed for full-chip applications, lack resist shrinkage modeling capabilities because they are not needed until only recently when NTD processes begin to replace the conventional positive tone development (PTD) processes where resist shrinkage effects are negligible. In this work we describe the development of a physical resist shrinkage (PRS) model for full-chip lithography simulations and present its accuracy evaluation against experimental data.

  17. Advanced communications, tracking, robotic vision technology for space applications

    NASA Technical Reports Server (NTRS)

    Krishen, Kumar

    1987-01-01

    Recent advancements in the areas of tracking, communications, and robotics vision sensors being pursued within NASA, as applicable to space programs, are presented. Optical and laser-based communications and tracking systems and applications to space programs are discussed. Communication systems for multiple access, broadband, high data rate, and efficient operations are given. Current efforts at 20/30 GHz and millimeter wave bands are summarized. The use of optical data processing in control system applications for rendezvous and docking is presented. Robotics vision, based on television, laser, and microwave sensors for space applications, is discussed. The fusion of these technologies for remote control, station keeping, tracking, inspection, and satellite repair is detailed.

  18. Technology of alignment mark in electron beam lithography

    NASA Astrophysics Data System (ADS)

    Zhao, Min; Xu, Tang; Chen, Baoqin; Niu, Jiebin

    2014-08-01

    Electron beam direct wring lithography has been an indispensable approach by which all sorts of novel nano-scale devices include many kinds optical devices can be fabricated. Alignment accuracy is a key factor especially to those devices which need multi-level lithography. In addition to electron beam lithography system itself the quality of alignment mark directly influences alignment accuracy. This paper introduces fundamental of alignment mark detection and discusses some techniques of alignment mark fabrication along with considerations for obtaining highly accurate alignment taking JBX5000LS and JBX6300FS e-beam lithography systems for example. The fundamental of alignment mark detection is expounded first. Many kinds of factors which can impact on the quality of alignment mark are analyzed including mark materials, depth of mark groove and influence of multi-channel process. It has been proved from experiments that material used as metal mark with higher average atomic number is better beneficial for getting high alignment accuracy. Depth of mark groove is required to 1.5~5 μm on our experience. The more process steps alignment mark must pass through, the more probability of being damaged there will be. So the compatibility of alignment mark fabrication with the whole device process and the protection of alignment mark are both need to be considered in advance.

  19. PREFACE: Advanced Materials for Demanding Applications

    NASA Astrophysics Data System (ADS)

    McMillan, Alison; Schofield, Stephen; Kelly, Michael

    2015-02-01

    This was a special conference. It was small enough (60+ delegates) but covering a wide range of topics, under a broad end-use focussed heading. Most conferences today either have hundreds or thousands of delegates or are small and very focussed. The topics ranged over composite materials, the testing of durability aspects of materials, and an eclectic set of papers on radar screening using weak ionized plasmas, composites for microvascular applications, composites in space rockets, and materials for spallation neutron sources etc. There were several papers of new characterisation techniques and, very importantly, several papers that started with the end-user requirements leading back into materials selection. In my own area, there were three talks about the technology for the ultra-precise positioning of individual atoms, donors, and complete monolayers to take modern electronics and optoelectronics ideas closer to the market place. The President of the Institute opened with an experience-based talk on translating innovative technology into business. Everyone gave a generous introduction to bring all-comers up to speed with the burning contemporary issues. Indeed, I wish that a larger cohort of first-year engineering PhD students were present to see the full gamut of what takes a physics idea to a success in the market place. I would urge groups to learn from Prof Alison McMillan (a Vice President of the Institute of Physics) and Steven Schofield, to set up conferences of similar scale and breadth. I took in more than I do from mega-meetings, and in greater depth. Professor Michael Kelly Department of Engineering University of Cambridge

  20. Advanced photovoltaic power system technology for lunar base applications

    NASA Technical Reports Server (NTRS)

    Brinker, David J.; Flood, Dennis J.

    1992-01-01

    The development of an advanced photovoltaic power system that would have application for a manned lunar base is currently planned under the Surface Power element of Pathfinder. Significant mass savings over state-of-the-art photovoltaic/battery systems are possible with the use of advanced lightweight solar arrays coupled with regenerative fuel cell storage. The solar blanket, using either ultrathin GaAs or amorphous silicon solar cells, would be integrated with a reduced-g structure. Regenerative fuel cells with high-pressure gas storage in filament-wound tanks are planned for energy storage. An advanced PV/RFC power system is a leading candidate for a manned lunar base as it offers a tremendous weight advantage over state-of-the-art photovoltaic/battery systems and is comparable in mass to other advanced power generation technologies.

  1. Spacecraft applications of advanced global positioning system technology

    NASA Technical Reports Server (NTRS)

    Huth, Gaylord; Dodds, James; Udalov, Sergei; Austin, Richard; Loomis, Peter; Duboraw, I. Newton, III

    1988-01-01

    The purpose of this study was to evaluate potential uses of Global Positioning System (GPS) in spacecraft applications in the following areas: attitude control and tracking; structural control; traffic control; and time base definition (synchronization). Each of these functions are addressed. Also addressed are the hardware related issues concerning the application of GPS technology and comparisons are provided with alternative instrumentation methods for specific functions required for an advanced low earth orbit spacecraft.

  2. Advanced Boost System Developing for High EGR Applications

    SciTech Connect

    Sun, Harold

    2012-09-30

    To support industry efforts of clean and efficient internal combustion engine development for passenger and commercial applications • This program focuses on turbocharger improvement for medium and light duty diesel applications, from complete system optimization percepective to enable commercialization of advanced diesel combustion technologies, such as HCCI/LTC. • Improve combined turbocharger efficiency up to 10% or fuel economy by 3% on FTP cycle at Tier II Bin 5 emission level.

  3. Metrology of 13-nm optics for extreme ultraviolet lithography

    SciTech Connect

    Beckwith, J.F.; Patterson, S.R.; Thompson, D.C.; Badami, V.; Smith, S.

    1997-02-03

    This report documents activities carried in support of the design and construction of an ultra-high precision measuring machine intended for the support of Extreme Ultraviolet Lithography development (for semiconductor fabrication). At the outset, this project was aimed at the overall fabrication of such a measuring machine. Shortly after initiation, however, the scope of activities was reduced and effort was concentrated on the key technical advances necessary to support such machine development: high accuracy surface sensing and highly linear distance interferometry.

  4. Application of advanced computational technology to propulsion CFD

    NASA Astrophysics Data System (ADS)

    Szuch, John R.

    The Internal Fluid Mechanics Division of the NASA Lewis Research Center is combining the key elements of computational fluid dynamics, aerothermodynamic experiments, and advanced computational technology to bring internal computational fluid dynamics (ICFM) to a state of practical application for aerospace propulsion system design. This paper presents an overview of efforts underway at NASA Lewis to advance and apply computational technology to ICFM. These efforts include the use of modern, software engineering principles for code development, the development of an AI-based user-interface for large codes, the establishment of a high-performance, data communications network to link ICFM researchers and facilities, and the application of parallel processing to speed up computationally intensive and/or time-critical ICFM problems. A multistage compressor flow physics program is cited as an example of efforts to use advanced computational technology to enhance a current NASA Lewis ICFM research program.

  5. Introduction, recent advances in immunochemistry and their application to agrochemicals.

    Technology Transfer Automated Retrieval System (TEKTRAN)

    The cluster of papers presented here, represent a cross section of the topics discussed at the Agrochemicals Division Symposium on Recent Advancements in Immunochemistry and Their Application to Agrochemicals, held at the 232nd meeting of the American Chemical Society in San Francisco, CA (September...

  6. Tele-Immersion: An Internet 2 Advanced Application.

    ERIC Educational Resources Information Center

    Simco, Greg

    2000-01-01

    Describes Tele-Immersion, and Advanced Applications initiative of the Internet 2 to develop group collaboration and interactivity beyond the current practices of the Internet. Discusses research areas that relate to this realm of virtual reality, including depth perception and rendering, which maps digital representations to a human compatible…

  7. Application of advanced technologies to future military transports

    NASA Technical Reports Server (NTRS)

    Clark, Rodney L.; Lange, Roy H.; Wagner, Richard D.

    1990-01-01

    Long range military transport technologies are addressed with emphasis of defining the potential benefits of the hybrid laminar flow control (HLFC) concept currently being flight tested. Results of a 1990's global range transport study are presented showing the expected payoff from application of advanced technologies. Technology forecast for military transports is also presented.

  8. Absolute dosimetry for extreme-ultraviolet lithography

    NASA Astrophysics Data System (ADS)

    Berger, Kurt W.; Campiotti, Richard H.

    2000-06-01

    The accurate measurement of an exposure dose reaching the wafer on an extreme ultraviolet (EUV) lithographic system has been a technical challenge directly applicable to the evaluation of candidate EUV resist materials and calculating lithography system throughputs. We have developed a dose monitoring sensor system that can directly measure EUV intensities at the wafer plane of a prototype EUV lithographic system. This sensor system, located on the wafer stage adjacent to the electrostatic chuck used to grip wafers, operates by translating the sensor into the aerial image, typically illuminating an 'open' (unpatterned) area on the reticle. The absolute signal strength can be related to energy density at the wafer, and thus used to determine resist sensitivity, and the signal as a function of position can be used to determine illumination uniformity at the wafer plane. Spectral filtering to enhance the detection of 13.4 nm radiation was incorporated into the sensor. Other critical design parameters include the packaging and amplification technologies required to place this device into the space and vacuum constraints of a EUV lithography environment. We describe two approaches used to determine the absolute calibration of this sensor. The first conventional approach requires separate characterization of each element of the sensor. A second novel approach uses x-ray emission from a mildly radioactive iron source to calibrate the absolute response of the entire sensor system (detector and electronics) in a single measurement.

  9. Pattern-integrated interference lithography instrumentation

    NASA Astrophysics Data System (ADS)

    Burrow, G. M.; Leibovici, M. C. R.; Kummer, J. W.; Gaylord, T. K.

    2012-06-01

    Multi-beam interference (MBI) provides the ability to form a wide range of sub-micron periodic optical-intensity distributions with applications to a variety of areas, including photonic crystals (PCs), nanoelectronics, biomedical structures, optical trapping, metamaterials, and numerous subwavelength structures. Recently, pattern-integrated interference lithography (PIIL) was presented as a new lithographic method that integrates superposed pattern imaging with interference lithography in a single-exposure step. In the present work, the basic design and systematic implementation of a pattern-integrated interference exposure system (PIIES) is presented to realize PIIL by incorporating a projection imaging capability in a novel three-beam interference configuration. A fundamental optimization methodology is presented to model the system and predict MBI-patterning performance. To demonstrate the PIIL method, a prototype PIIES experimental configuration is presented, including detailed alignment techniques and experimental procedures. Examples of well-defined PC structures, fabricated with a PIIES prototype, are presented to demonstrate the potential of PIIL for fabricating dense integrated optical circuits, as well as numerous other subwavelength structures.

  10. Advances in resist technology and processing V

    SciTech Connect

    MacDonald, S.A.

    1988-01-01

    These proceedings discuss the technology and processing advances made in the resist materials. The topics included are: Mid-UV photoresists combining chemical amplification and dissolution inhibition; new photoactive compounds for deep-UV lithography; contrast-enhancement materials for mid-UV applications; materials for CMOS and bipolar circuits; effects of ion bombardment in oxygen plasma etching; silicone-based positive photoresist; and ion-etching properties of polysilane polysilane copolymers.

  11. A survey of advanced battery systems for space applications

    NASA Technical Reports Server (NTRS)

    Attia, Alan I.

    1989-01-01

    The results of a survey on advanced secondary battery systems for space applications are presented. The objectives were: to identify advanced battery systems capable of meeting the requirements of various types of space missions, with significant advantages over currently available batteries, to obtain an accurate estimate of the anticipated improvements of these advanced systems, and to obtain a consensus for the selection of systems most likely to yield the desired improvements. Few advanced systems are likely to exceed a specific energy of 150 Wh/kg and meet the additional requirements of safety and reliability within the next 15 years. The few that have this potential are: (1) regenerative fuel cells, both alkaline and solid polymer electrolyte (SPE) types for large power systems; (2) lithium-intercalatable cathodes, particularly the metal ozides intercalatable cathodes (MnO2 or CoO2), with applications limited to small spacecrafts requiring limited cycle life and low power levels; (3) lithium molten salt systems (e.g., LiAl-FeS2); and (4) Na/beta Alumina/Sulfur or metal chlorides cells. Likely technological advances that would enhance the performance of all the above systems are also identified, in particular: improved bifunctional oxygen electrodes; improved manufacturing technology for thin film lithium electrodes in combination with polymeric electrolytes; improved seals for the lithium molten salt cells; and improved ceramics for sodium/solid electrolyte cells.

  12. Tunable Nanopatterning of Conductive Polymers via Electrohydrodynamic Lithography.

    PubMed

    Rickard, Jonathan James Stanley; Farrer, Ian; Goldberg Oppenheimer, Pola

    2016-03-22

    An increasing number of technologies require the fabrication of conductive structures on a broad range of scales and over large areas. Here, we introduce advanced yet simple electrohydrodynamic lithography (EHL) for patterning conductive polymers directly on a substrate with high fidelity. We illustrate the generality of this robust, low-cost method by structuring thin polypyrrole films via electric-field-induced instabilities, yielding well-defined conductive structures with feature sizes ranging from tens of micrometers to hundreds of nanometers. Exploitation of a conductive polymer induces free charge suppression of the field in the polymer film, paving the way for accessing scale sizes in the low submicron range. We show the feasibility of the polypyrrole-based structures for field-effect transistor devices. Controlled EHL pattering of conductive polymer structures at the micro and nano scale demonstrated in this study combined with the possibility of effectively tuning the dimensions of the tailor-made architectures might herald a route toward various submicron device applications in supercapacitors, photovoltaics, sensors, and electronic displays. PMID:26905779

  13. 3D Stretchable Arch Ribbon Array Fabricated via Grayscale Lithography

    PubMed Central

    Pang, Yu; Shu, Yi; Shavezipur, Mohammad; Wang, Xuefeng; Mohammad, Mohammad Ali; Yang, Yi; Zhao, Haiming; Deng, Ningqin; Maboudian, Roya; Ren, Tian-Ling

    2016-01-01

    Microstructures with flexible and stretchable properties display tremendous potential applications including integrated systems, wearable devices and bio-sensor electronics. Hence, it is essential to develop an effective method for fabricating curvilinear and flexural microstructures. Despite significant advances in 2D stretchable inorganic structures, large scale fabrication of unique 3D microstructures at a low cost remains challenging. Here, we demonstrate that the 3D microstructures can be achieved by grayscale lithography to produce a curved photoresist (PR) template, where the PR acts as sacrificial layer to form wavelike arched structures. Using plasma-enhanced chemical vapor deposition (PECVD) process at low temperature, the curved PR topography can be transferred to the silicon dioxide layer. Subsequently, plasma etching can be used to fabricate the arched stripe arrays. The wavelike silicon dioxide arch microstructure exhibits Young modulus and fracture strength of 52 GPa and 300 MPa, respectively. The model of stress distribution inside the microstructure was also established, which compares well with the experimental results. This approach of fabricating a wavelike arch structure may become a promising route to produce a variety of stretchable sensors, actuators and circuits, thus providing unique opportunities for emerging classes of robust 3D integrated systems. PMID:27345766

  14. 3D Stretchable Arch Ribbon Array Fabricated via Grayscale Lithography

    NASA Astrophysics Data System (ADS)

    Pang, Yu; Shu, Yi; Shavezipur, Mohammad; Wang, Xuefeng; Mohammad, Mohammad Ali; Yang, Yi; Zhao, Haiming; Deng, Ningqin; Maboudian, Roya; Ren, Tian-Ling

    2016-06-01

    Microstructures with flexible and stretchable properties display tremendous potential applications including integrated systems, wearable devices and bio-sensor electronics. Hence, it is essential to develop an effective method for fabricating curvilinear and flexural microstructures. Despite significant advances in 2D stretchable inorganic structures, large scale fabrication of unique 3D microstructures at a low cost remains challenging. Here, we demonstrate that the 3D microstructures can be achieved by grayscale lithography to produce a curved photoresist (PR) template, where the PR acts as sacrificial layer to form wavelike arched structures. Using plasma-enhanced chemical vapor deposition (PECVD) process at low temperature, the curved PR topography can be transferred to the silicon dioxide layer. Subsequently, plasma etching can be used to fabricate the arched stripe arrays. The wavelike silicon dioxide arch microstructure exhibits Young modulus and fracture strength of 52 GPa and 300 MPa, respectively. The model of stress distribution inside the microstructure was also established, which compares well with the experimental results. This approach of fabricating a wavelike arch structure may become a promising route to produce a variety of stretchable sensors, actuators and circuits, thus providing unique opportunities for emerging classes of robust 3D integrated systems.

  15. 3D Stretchable Arch Ribbon Array Fabricated via Grayscale Lithography.

    PubMed

    Pang, Yu; Shu, Yi; Shavezipur, Mohammad; Wang, Xuefeng; Mohammad, Mohammad Ali; Yang, Yi; Zhao, Haiming; Deng, Ningqin; Maboudian, Roya; Ren, Tian-Ling

    2016-01-01

    Microstructures with flexible and stretchable properties display tremendous potential applications including integrated systems, wearable devices and bio-sensor electronics. Hence, it is essential to develop an effective method for fabricating curvilinear and flexural microstructures. Despite significant advances in 2D stretchable inorganic structures, large scale fabrication of unique 3D microstructures at a low cost remains challenging. Here, we demonstrate that the 3D microstructures can be achieved by grayscale lithography to produce a curved photoresist (PR) template, where the PR acts as sacrificial layer to form wavelike arched structures. Using plasma-enhanced chemical vapor deposition (PECVD) process at low temperature, the curved PR topography can be transferred to the silicon dioxide layer. Subsequently, plasma etching can be used to fabricate the arched stripe arrays. The wavelike silicon dioxide arch microstructure exhibits Young modulus and fracture strength of 52 GPa and 300 MPa, respectively. The model of stress distribution inside the microstructure was also established, which compares well with the experimental results. This approach of fabricating a wavelike arch structure may become a promising route to produce a variety of stretchable sensors, actuators and circuits, thus providing unique opportunities for emerging classes of robust 3D integrated systems. PMID:27345766

  16. Tunable Nanopatterning of Conductive Polymers via Electrohydrodynamic Lithography

    PubMed Central

    2016-01-01

    An increasing number of technologies require the fabrication of conductive structures on a broad range of scales and over large areas. Here, we introduce advanced yet simple electrohydrodynamic lithography (EHL) for patterning conductive polymers directly on a substrate with high fidelity. We illustrate the generality of this robust, low-cost method by structuring thin polypyrrole films via electric-field-induced instabilities, yielding well-defined conductive structures with feature sizes ranging from tens of micrometers to hundreds of nanometers. Exploitation of a conductive polymer induces free charge suppression of the field in the polymer film, paving the way for accessing scale sizes in the low submicron range. We show the feasibility of the polypyrrole-based structures for field-effect transistor devices. Controlled EHL pattering of conductive polymer structures at the micro and nano scale demonstrated in this study combined with the possibility of effectively tuning the dimensions of the tailor-made architectures might herald a route toward various submicron device applications in supercapacitors, photovoltaics, sensors, and electronic displays. PMID:26905779

  17. SYSTEM CONSIDERATIONS FOR MASKLESS LITHOGRAPHY

    SciTech Connect

    Karnowski, Thomas Paul; Joy, David; Allard Jr, Lawrence Frederick; Clonts, Lloyd G

    2004-01-01

    Lithographic processes for printing device structures on integrated circuits (ICs) are the fundamental technology behind Moore's law. Next-generation techniques like maskless lithography or ML2 have the advantage that the long, tedious and expensive process of fabricating a unique mask for the manufactured chip is not necessary. However, there are some rather daunting problems with establishing ML2 as a viable commercial technology. The data rate necessary for ML2 to be competitive in manufacturing is not feasible with technology in the near future. There is also doubt that the competing technologies for the writing mechanisms and corresponding photoresist (or analogous medium) will be able to accurately produce the desired patterns necessary to produce multi-layer semiconductor devices. In this work, we model the maskless printing system from a signal processing point of view, utilizing image processing algorithms and concepts to study the effects of various real-world constraints and their implications for a ML2 system. The ML2 elements are discrete devices, and it is doubtful that their motion can be controlled to the level where a one-for-one element to exposed pixel relationship is allowable. Some level of sub-element resolution can be achieved with gray scale levels, but with the highly integrated manufacturing practices required to achieve massive parallelism, the most effective elements will be simple on-off switches that fire a fixed level of energy at the target medium. Consequently gray-scale level devices are likely not an option. Another problem with highly integrated manufacturing methods is device uniformity. Consequently, we analyze the redundant scanning array concept (RSA) conceived by Berglund et al. which can defeat many of these problems. We determine some basic equations governing its application and we focus on applying the technique to an array of low-energy electron emitters. Using the results of Monte Carlo simulations on electron beam

  18. System considerations for maskless lithography

    NASA Astrophysics Data System (ADS)

    Karnowski, Thomas; Joy, David; Allard, Larry; Clonts, Lloyd

    2004-05-01

    Lithographic processes for printing device structures on integrated circuits (ICs) are the fundamental technology behind Moore's law. Next-generation techniques like maskless lithography or ML2 have the advantage that the long, tedious and expensive process of fabricating a unique mask for the manufactured chip is not necessary. However, there are some rather daunting prblems with establishing ML2 as a viable commercial technology. The data rate necessary for ML2 to be competitive in manufacturing is not feasible with technology in the near future. There is also doubt that the competing technologies for the writing mechanisms and corresponding photoresist (or analogous medium) will be able to accurately produce the desired patterns necessary to produce multi-layer semiconductor devices. In this work, we model the maskless printing system from a signal processing point of view, utilizing image processing algorithms and concepts to study the effects of various real-world constraints and their implications for a ML2 system. The ML2 elements are discrete devices, and it is doubtful that their motion can be controlled to the level where a one-for-one element to exposed pixel relationship is allowable. Some level of sub-element resolution can be achieved with gray scale levels, but with the highly integrated manufacturing practices required to achieve massive parallelism, the most effective elements will be simple on-ofrf switches that fire a fixed level of energy at the target medium. Consequently gray-scale level devidces are likely not an option. Another problem with highly integrated manufacturing methods is device uniformity. Consequently, we analyze the redundant scanning array concept (RSA) conceived by Berglund et al. which can defeat many of these problems. We determine some basic equations governing its application and we focus on applying the technique to an array of low-energy electron emitters. Using the results of Monte Carlo simulations on electron beam

  19. Advances in Multi-Sensor Data Fusion: Algorithms and Applications

    PubMed Central

    Dong, Jiang; Zhuang, Dafang; Huang, Yaohuan; Fu, Jingying

    2009-01-01

    With the development of satellite and remote sensing techniques, more and more image data from airborne/satellite sensors have become available. Multi-sensor image fusion seeks to combine information from different images to obtain more inferences than can be derived from a single sensor. In image-based application fields, image fusion has emerged as a promising research area since the end of the last century. The paper presents an overview of recent advances in multi-sensor satellite image fusion. Firstly, the most popular existing fusion algorithms are introduced, with emphasis on their recent improvements. Advances in main applications fields in remote sensing, including object identification, classification, change detection and maneuvering targets tracking, are described. Both advantages and limitations of those applications are then discussed. Recommendations are addressed, including: (1) Improvements of fusion algorithms; (2) Development of “algorithm fusion” methods; (3) Establishment of an automatic quality assessment scheme. PMID:22408479

  20. X-ray lithography source

    DOEpatents

    Piestrup, Melvin A.; Boyers, David G.; Pincus, Cary

    1991-01-01

    A high-intensity, inexpensive X-ray source for X-ray lithography for the production of integrated circuits. Foil stacks are bombarded with a high-energy electron beam of 25 to 250 MeV to produce a flux of soft X-rays of 500 eV to 3 keV. Methods of increasing the total X-ray power and making the cross section of the X-ray beam uniform are described. Methods of obtaining the desired X-ray-beam field size, optimum frequency spectrum and elminating the neutron flux are all described. A method of obtaining a plurality of station operation is also described which makes the process more efficient and economical. The satisfying of these issues makes transition radiation an exellent moderate-priced X-ray source for lithography.

  1. X-ray lithography source

    DOEpatents

    Piestrup, M.A.; Boyers, D.G.; Pincus, C.

    1991-12-31

    A high-intensity, inexpensive X-ray source for X-ray lithography for the production of integrated circuits is disclosed. Foil stacks are bombarded with a high-energy electron beam of 25 to 250 MeV to produce a flux of soft X-rays of 500 eV to 3 keV. Methods of increasing the total X-ray power and making the cross section of the X-ray beam uniform are described. Methods of obtaining the desired X-ray-beam field size, optimum frequency spectrum and eliminating the neutron flux are all described. A method of obtaining a plurality of station operation is also described which makes the process more efficient and economical. The satisfying of these issues makes transition radiation an excellent moderate-priced X-ray source for lithography. 26 figures.

  2. Mask technology for EUV lithography

    NASA Astrophysics Data System (ADS)

    Bujak, M.; Burkhart, Scott C.; Cerjan, Charles J.; Kearney, Patrick A.; Moore, Craig E.; Prisbrey, Shon T.; Sweeney, Donald W.; Tong, William M.; Vernon, Stephen P.; Walton, Christopher C.; Warrick, Abbie L.; Weber, Frank J.; Wedowski, Marco; Wilhelmsen, Karl C.; Bokor, Jeffrey; Jeong, Sungho; Cardinale, Gregory F.; Ray-Chaudhuri, Avijit K.; Stivers, Alan R.; Tejnil, Edita; Yan, Pei-yang; Hector, Scott D.; Nguyen, Khanh B.

    1999-04-01

    Extreme UV Lithography (EUVL) is one of the leading candidates for the next generation lithography, which will decrease critical feature size to below 100 nm within 5 years. EUVL uses 10-14 nm light as envisioned by the EUV Limited Liability Company, a consortium formed by Intel and supported by Motorola and AMD to perform R and D work at three national laboratories. Much work has already taken place, with the first prototypical cameras operational at 13.4 nm using low energy laser plasma EUV light sources to investigate issues including the source, camera, electro- mechanical and system issues, photoresists, and of course the masks. EUV lithograph masks are fundamentally different than conventional photolithographic masks as they are reflective instead of transmissive. EUV light at 13.4 nm is rapidly absorbed by most materials, thus all light transmission within the EUVL system from source to silicon wafer, including EUV reflected from the mask, is performed by multilayer mirrors in vacuum.

  3. Protein assay structured on paper by using lithography

    NASA Astrophysics Data System (ADS)

    Wilhelm, E.; Nargang, T. M.; Al Bitar, W.; Waterkotte, B.; Rapp, B. E.

    2015-03-01

    There are two main challenges in producing a robust, paper-based analytical device. The first one is to create a hydrophobic barrier which unlike the commonly used wax barriers does not break if the paper is bent. The second one is the creation of the (bio-)specific sensing layer. For this proteins have to be immobilized without diminishing their activity. We solve both problems using light-based fabrication methods that enable fast, efficient manufacturing of paper-based analytical devices. The first technique relies on silanization by which we create a flexible hydrophobic barrier made of dimethoxydimethylsilane. The second technique demonstrated within this paper uses photobleaching to immobilize proteins by means of maskless projection lithography. Both techniques have been tested on a classical lithography setup using printed toner masks and on a lithography system for maskless lithography. Using these setups we could demonstrate that the proposed manufacturing techniques can be carried out at low costs. The resolution of the paper-based analytical devices obtained with static masks was lower due to the lower mask resolution. Better results were obtained using advanced lithography equipment. By doing so we demonstrated, that our technique enables fabrication of effective hydrophobic boundary layers with a thickness of only 342 μm. Furthermore we showed that flourescine-5-biotin can be immobilized on the non-structured paper and be employed for the detection of streptavidinalkaline phosphatase. By carrying out this assay on a paper-based analytical device which had been structured using the silanization technique we proofed biological compatibility of the suggested patterning technique.

  4. Resolution Improvement and Pattern Generator Development for theMaskless Micro-Ion-Beam Reduction Lithography System

    SciTech Connect

    Jiang, Ximan

    2006-05-18

    The shrinking of IC devices has followed the Moore's Law for over three decades, which states that the density of transistors on integrated circuits will double about every two years. This great achievement is obtained via continuous advance in lithography technology. With the adoption of complicated resolution enhancement technologies, such as the phase shifting mask (PSM), the optical proximity correction (OPC), optical lithography with wavelength of 193 nm has enabled 45 nm printing by immersion method. However, this achievement comes together with the skyrocketing cost of masks, which makes the production of low volume application-specific IC (ASIC) impractical. In order to provide an economical lithography approach for low to medium volume advanced IC fabrication, a maskless ion beam lithography method, called Maskless Micro-ion-beam Reduction Lithography (MMRL), has been developed in the Lawrence Berkeley National Laboratory. The development of the prototype MMRL system has been described by Dr. Vinh Van Ngo in his Ph.D. thesis. But the resolution realized on the prototype MMRL system was far from the design expectation. In order to improve the resolution of the MMRL system, the ion optical system has been investigated. By integrating a field-free limiting aperture into the optical column, reducing the electromagnetic interference and cleaning the RF plasma, the resolution has been improved to around 50 nm. Computational analysis indicates that the MMRL system can be operated with an exposure field size of 0.25 mm and a beam half angle of 1.0 mrad on the wafer plane. Ion-ion interactions have been studied with a two-particle physics model. The results are in excellent agreement with those published by the other research groups. The charge-interaction analysis of MMRL shows that the ion-ion interactions must be reduced in order to obtain a throughput higher than 10 wafers per hour on 300-mm wafers. In addition, two different maskless lithography strategies

  5. The New X-Ray Lithography Beamline BL1 At DELTA

    SciTech Connect

    Lietz, D.; Paulus, M.; Sternemann, C.; Berges, U.; Hippert, B.; Tolan, M.

    2010-06-23

    Lithography using synchrotron radiation in the x-ray regime provides a powerful method to produce mechanical components of sub-millimeter size with a very good quality for microtechnological applications. In recent years the demand for x-ray lithography beamtime for industrial production of microparts increased rapidly resulting in the development of new experimental endstations at synchrotron radiation sources dedicated for the production of micromechanical devices. We present in this work the layout of the new x-ray lithography beamline BL1 at the synchrotron radiation source DELTA in Dortmund and discuss first results of exposure tests.

  6. Development of an advanced photovoltaic concentrator system for space applications

    NASA Technical Reports Server (NTRS)

    Piszczor, Michael F., Jr.; Oneill, Mark J.

    1987-01-01

    Recent studies indicate that significant increases in system performance (increased efficiency and reduced system mass) are possible for high power space based systems by incorporating technological developments with photovoltaic power systems. The Advanced Photovoltaic Concentrator Program is an effort to take advantage of recent advancements in refractive optical elements. By using a domed Fresnel lens concentrator and a prismatic cell cover, to eliminate metallization losses, dramatic reductions in the required area and mass over current space photovoltaic systems are possible. The advanced concentrator concept also has significant advantages when compared to solar dynamic Organic Rankine Cycle power systems in Low Earth Orbit applications where energy storage is required. The program is currently involved in the selection of a material for the optical element that will survive the space environment and a demonstration of the system performance of the panel design.

  7. Advanced Turbine Technology Applications Project (ATTAP). Annual report 1992

    SciTech Connect

    Not Available

    1993-03-01

    This report summarizes work performed by Garrett Auxiliary Power Division (GAPD), a unit of Allied-Signal Aerospace Company, during calendar year 1992, toward development and demonstration of structural ceramic technology for automotive gas turbine engines. This work was performed for the US Department of Energy (DOE) under National Aeronautics and Space Administration (NASA) Contract DEN3-335, Advanced Turbine Technology Applications Project (ATTAP). GAPD utilized the AGT101 regenerated gas turbine engine developed under the previous DOE/NASA Advanced Gas Turbine (AGT) program as the ATTAP test bed for ceramic engine technology demonstration. ATTAP focussed on improving AGT101 test bed reliability, development of ceramic design methodologies, and improvement of fabrication and materials processing technology by domestic US ceramics fabricators. A series of durability tests was conducted to verify technology advancements. This is the fifth in a series of technical summary reports published annually over the course of the five-year contract.

  8. Lithography develop process electrostatic discharge effect mechanism study

    NASA Astrophysics Data System (ADS)

    Yang, Xiaosong; Ye, Yi Zhou; Zou, Yongxiang; Zhu, XiaoZheng

    2015-03-01

    Electrostatic discharge (ESD) problem resulting from charges on wafers is a serious concern in IC manufacturing. As is discovered in our paper, three types of defect, AA (active area) damage, IMD (Inter Metal Dielectric) crack and Via hole W corrosion that are confirmed to be induced by lithography process related ESD charging effect. We carefully studied the mechanism of these ESD charging effect by DOE splits and succeeded to dig out that these electric charge major comes from the lithography develop process. In the lithography coating and developing wafer process, the wafer will be at high spin speed at many of the steps which will easy help to store the electric charge on the wafer. In our study, the rinse step in developing process is the most key factor to store the electric charge on wafer. In generally, the higher rinse speed, the higher positive electric charge. Furthermore, we also discovered that the different step in develop rinse process have different impact on charge level, in which the acceleration and deceleration step has the highest charge voltage. As to minimize and eliminate the ESD damage in lithography process, we finally carry out the simplified recipe optimization solution which only need optimize for the develop rinse speed with different in-coming surface charge level and process application, so that can be easy implemented in the worldwide fabs.

  9. Multilayer reflective coatings for extreme-ultraviolet lithography

    SciTech Connect

    Montcalm, C., LLNL

    1998-03-10

    Multilayer mirror coatings which reflect extreme ultraviolet (EUV) radiation are a key enabling technology for EUV lithography. Mo/Si multilayers with reflectances of 67.5% at 13.4 nm are now routinely achieved and reflectances of 70 2% at 11.4 nm were obtained with MO/Be multilayers. High reflectance is achieved with careful control of substrate quality, layer thicknesses, multilayer materials, interface quality, and surface termination. Reflectance and film stress were found to be stable relative to the requirements for application to EUV lithography. The run-to-run reproducibility of the reflectance peak position was characterized to be better than 0.2%, providing the required wavelength matching among the seven multilayer-coated mirrors used in the present lithography system design. Uniformity of coating was improved to better than 0.5% across 150 mm diameter substrates. These improvements in EUV multilayer mirror technology will enable us to meet the stringent specifications for coating the large optical substrates for our next-generation EUV lithography system.

  10. Reduction of nanowire diameter beyond lithography limits by controlled catalyst dewetting

    NASA Astrophysics Data System (ADS)

    Calahorra, Yonatan; Kerlich, Alexander; Amram, Dor; Gavrilov, Arkady; Cohen, Shimon; Ritter, Dan

    2016-04-01

    Catalyst assisted vapour-liquid-solid is the most common method to realize bottom-up nanowire growth; establishing a parallel process for obtaining nanoscale catalysts at pre-defined locations is paramount for further advancement towards commercial nanowire applications. Herein, the effect of a selective area mask on the dewetting of metallic nanowire catalysts, deposited within lithography-defined mask pinholes, is reported. It was found that thin disc-like catalysts, with diameters of 120-450 nm, were transformed through dewetting into hemisphere-like catalysts, having diameters 2-3 fold smaller; the process was optimized to about 95% yield in preventing catalyst splitting, as would otherwise be expected due to their thickness-to-diameter ratio, which was as low as 1/60. The catalysts subsequently facilitated InP and InAs nanowire growth. We suggest that the mask edges prevent surface migration mediated spreading of the dewetted metal, and therefore induce its agglomeration into a single particle. This result presents a general strategy to diminish lithography-set dimensions for NW growth, and may answer a fundamental challenge faced by bottom-up nanowire technology.

  11. Single-molecule protein arrays enabled by scanning probe block copolymer lithography.

    PubMed

    Chai, Jinan; Wong, Lu Shin; Giam, Louise; Mirkin, Chad A

    2011-12-01

    The ability to control the placement of individual protein molecules on surfaces could enable advances in a wide range of areas, from the development of nanoscale biomolecular devices to fundamental studies in cell biology. Such control, however, remains a challenge in nanobiotechnology due to the limitations of current lithographic techniques. Herein we report an approach that combines scanning probe block copolymer lithography with site-selective immobilization strategies to create arrays of proteins down to the single-molecule level with arbitrary pattern control. Scanning probe block copolymer lithography was used to synthesize individual sub-10-nm single crystal gold nanoparticles that can act as scaffolds for the adsorption of functionalized alkylthiol monolayers, which facilitate the immobilization of specific proteins. The number of protein molecules that adsorb onto the nanoparticles is dependent upon particle size; when the particle size approaches the dimensions of a protein molecule, each particle can support a single protein. This was demonstrated with both gold nanoparticle and quantum dot labeling coupled with transmission electron microscopy imaging experiments. The immobilized proteins remain bioactive, as evidenced by enzymatic assays and antigen-antibody binding experiments. Importantly, this approach to generate single-biomolecule arrays is, in principle, applicable to many parallelized cantilever and cantilever-free scanning probe molecular printing methods. PMID:22106270

  12. Large-area pattern transfer of metallic nanostructures on glass substrates via interference lithography.

    PubMed

    Du, Ke; Wathuthanthri, Ishan; Mao, Weidong; Xu, Wei; Choi, Chang-Hwan

    2011-07-15

    In this paper, we report a simple and effective nanofabrication method for the pattern transfer of metallic nanostructures over a large surface area on a glass substrate. Photoresist (PR) nano-patterns, defined by laser interference lithography, are used as template structures where a metal film of controlled thickness is directly deposited and then transferred onto a glass substrate by the sacrificial etching of the PR inter-layer. The laser interference lithography, capable of creating periodic nano-patterns with good control of their dimensions and shapes over a relatively large area, allows the wafer-scale pattern transfer of metallic nanostructures in a very convenient way. By using the approach, we have successfully fabricated on a glass substrate uniform arrays of hole, grating, and pillar patterns of Ti, Al, and Au in varying pattern periodicities (200 nm-1 µm) over a surface area of up to several cm(2) with little mechanical crack and delamination. Such robust metallic nanostructures defined well on a transparent glass substrate with large pattern coverage will lead to advanced scientific and engineering applications such as microfluidics and nanophotonics. PMID:21642762

  13. Large-area pattern transfer of metallic nanostructures on glass substrates via interference lithography

    NASA Astrophysics Data System (ADS)

    Du, Ke; Wathuthanthri, Ishan; Mao, Weidong; Xu, Wei; Choi, Chang-Hwan

    2011-07-01

    In this paper, we report a simple and effective nanofabrication method for the pattern transfer of metallic nanostructures over a large surface area on a glass substrate. Photoresist (PR) nano-patterns, defined by laser interference lithography, are used as template structures where a metal film of controlled thickness is directly deposited and then transferred onto a glass substrate by the sacrificial etching of the PR inter-layer. The laser interference lithography, capable of creating periodic nano-patterns with good control of their dimensions and shapes over a relatively large area, allows the wafer-scale pattern transfer of metallic nanostructures in a very convenient way. By using the approach, we have successfully fabricated on a glass substrate uniform arrays of hole, grating, and pillar patterns of Ti, Al, and Au in varying pattern periodicities (200 nm-1 µm) over a surface area of up to several cm2 with little mechanical crack and delamination. Such robust metallic nanostructures defined well on a transparent glass substrate with large pattern coverage will lead to advanced scientific and engineering applications such as microfluidics and nanophotonics.

  14. Nanoimprint lithography using TiO2-SiO2 ultraviolet curable materials

    NASA Astrophysics Data System (ADS)

    Takei, Satoshi

    2015-05-01

    Ultraviolet nanoimprint lithography has great potential for commercial device applications that are closest to production such as optical gratings, planar waveguides, photonic crystals, semiconductor, displays, solar cell panel, sensors, highbrightness LEDs, OLEDs, and optical data storage. I report and demonstrate the newly TiO2-SiO2 ultraviolet curable materials with 20-25 wt% ratio of high titanium for CF4/O2 etch selectivity using nanoimprint lithography process. The multiple structured three-dimensional micro- and nanolines patterns were observed to be successfully patterned over the large areas. The effect of titanium concentration on CF4/O2 etch selectivity with pattern transferring carbon layer imprinting time was investigated. CF4/O2 etching rate of the TiO2-SiO2 ultraviolet curable material was approximately 3.8 times lower than that of the referenced SiO2 sol-gel ultraviolet curable material. The TiO2-SiO2 ultraviolet curable material with high titanium concentration has been proved to be versatile in advanced nanofabrication.

  15. The application of advanced analytical techniques to direct coal liquefaction

    SciTech Connect

    Brandes, S.D.; Winschel, R.A.; Burke, F.P.; Robbins, G.A.

    1991-12-31

    Consol is coordinating a program designed to bridge the gap between the advanced, modern techniques of the analytical chemist and the application of those techniques by the direct coal liquefaction process developer, and to advance our knowledge of the process chemistry of direct coal liquefaction. The program is designed to provide well-documented samples to researchers who are utilizing techniques potentially useful for the analysis of coal derived samples. The choice of samples and techniques was based on an extensive survey made by Consol of the present status of analytical methodology associated with direct coal liquefaction technology. Sources of information included process developers and analytical chemists. Identified in the survey are a number of broadly characterizable needs. These categories include a need for: A better understanding of the nature of the high molecular weight, non-distillable residual materials (both soluble and insoluble) in the process streams; improved techniques for molecular characterization, heteroatom and hydrogen speciation and a knowledge of the hydrocarbon structural changes across coal liquefaction systems; better methods for sample separation; application of advanced data analysis methods; the use of more advanced predictive models; on-line analytical techniques; and better methods for catalyst monitoring.

  16. Advanced boundary layer transition measurement methods for flight applications

    NASA Technical Reports Server (NTRS)

    Holmes, B. J.; Croom, C. C.; Gail, P. D.; Manuel, G. S.; Carraway, D. L.

    1986-01-01

    In modern laminar flow flight research, it is important to understand the specific cause(s) of laminar to turbulent boundary-layer transition. Such information is crucial to the exploration of the limits of practical application of laminar flow for drag reduction on aircraft. The transition modes of interest in current flight investigations include the viscous Tollmien-Schlichting instability, the inflectional instability at laminar separation, and the crossflow inflectional instability, as well as others. This paper presents the results to date of research on advanced devices and methods used for the study of laminar boundary-layer transition phenomena in the flight environment. Recent advancements in the development of arrayed hot-film devices and of a new flow visualization method are discussed. Arrayed hot-film devices have been designed to detect the presence of laminar separation, and of crossflow vorticity. The advanced flow visualization method utilizes color changes in liquid-crystal coatings to detect boundary-layer transition at high altitude flight conditions. Flight and wind tunnel data are presented to illustrate the design and operation of these advanced methods. These new research tools provide information on disturbance growth and transition mode which is essential to furthering our understanding of practical design limits for applications of laminar flow technology.

  17. Amphiphile nanoarchitectonics: from basic physical chemistry to advanced applications.

    PubMed

    Ramanathan, Muruganathan; Shrestha, Lok Kumar; Mori, Taizo; Ji, Qingmin; Hill, Jonathan P; Ariga, Katsuhiko

    2013-07-14

    Amphiphiles, either synthetic or natural, are structurally simple molecules with the unprecedented capacity to self-assemble into complex, hierarchical geometries in nanospace. Effective self-assembly processes of amphiphiles are often used to mimic biological systems, such as assembly of lipids and proteins, which has paved a way for bottom-up nanotechnology with bio-like advanced functions. Recent developments in nanostructure formation combine simple processes of assembly with the more advanced concept of nanoarchitectonics. In this perspective, we summarize research on self-assembly of amphiphilic molecules such as lipids, surfactants or block copolymers that are a focus of interest for many colloid, polymer, and materials scientists and which have become increasingly important in emerging nanotechnology and practical applications, latter of which are often accomplished by amphiphile-like polymers. Because the fundamental science of amphiphiles was initially developed for their solution assembly then transferred to assemblies on surfaces as a development of nanotechnological techniques, this perspective attempts to mirror this development by introducing solution systems and progressing to interfacial systems, which are roughly categorized as (i) basic properties of amphiphiles, (ii) self-assembly of amphiphiles in bulk phases, (iii) assembly on static surfaces, (iv) assembly at dynamic interfaces, and (v) advanced topics from simulation to application. This progression also represents the evolution of amphiphile science and technology from simple assemblies to advanced assemblies to nanoarchitectonics. PMID:23639971

  18. Recent Advances in Bioprinting and Applications for Biosensing

    PubMed Central

    Dias, Andrew D.; Kingsley, David M.; Corr, David T.

    2014-01-01

    Future biosensing applications will require high performance, including real-time monitoring of physiological events, incorporation of biosensors into feedback-based devices, detection of toxins, and advanced diagnostics. Such functionality will necessitate biosensors with increased sensitivity, specificity, and throughput, as well as the ability to simultaneously detect multiple analytes. While these demands have yet to be fully realized, recent advances in biofabrication may allow sensors to achieve the high spatial sensitivity required, and bring us closer to achieving devices with these capabilities. To this end, we review recent advances in biofabrication techniques that may enable cutting-edge biosensors. In particular, we focus on bioprinting techniques (e.g., microcontact printing, inkjet printing, and laser direct-write) that may prove pivotal to biosensor fabrication and scaling. Recent biosensors have employed these fabrication techniques with success, and further development may enable higher performance, including multiplexing multiple analytes or cell types within a single biosensor. We also review recent advances in 3D bioprinting, and explore their potential to create biosensors with live cells encapsulated in 3D microenvironments. Such advances in biofabrication will expand biosensor utility and availability, with impact realized in many interdisciplinary fields, as well as in the clinic. PMID:25587413

  19. Recent advances in bioprinting and applications for biosensing.

    PubMed

    Dias, Andrew D; Kingsley, David M; Corr, David T

    2014-06-01

    Future biosensing applications will require high performance, including real-time monitoring of physiological events, incorporation of biosensors into feedback-based devices, detection of toxins, and advanced diagnostics. Such functionality will necessitate biosensors with increased sensitivity, specificity, and throughput, as well as the ability to simultaneously detect multiple analytes. While these demands have yet to be fully realized, recent advances in biofabrication may allow sensors to achieve the high spatial sensitivity required, and bring us closer to achieving devices with these capabilities. To this end, we review recent advances in biofabrication techniques that may enable cutting-edge biosensors. In particular, we focus on bioprinting techniques (e.g., microcontact printing, inkjet printing, and laser direct-write) that may prove pivotal to biosensor fabrication and scaling. Recent biosensors have employed these fabrication techniques with success, and further development may enable higher performance, including multiplexing multiple analytes or cell types within a single biosensor. We also review recent advances in 3D bioprinting, and explore their potential to create biosensors with live cells encapsulated in 3D microenvironments. Such advances in biofabrication will expand biosensor utility and availability, with impact realized in many interdisciplinary fields, as well as in the clinic. PMID:25587413

  20. Thermoplastic microcantilevers fabricated by nanoimprint lithography

    NASA Astrophysics Data System (ADS)

    Greve, Anders; Keller, Stephan; Vig, Asger L.; Kristensen, Anders; Larsson, David; Yvind, Kresten; Hvam, Jørn M.; Cerruti, Marta; Majumdar, Arunava; Boisen, Anja

    2010-01-01

    Nanoimprint lithography has been exploited to fabricate micrometre-sized cantilevers in thermoplastic. This technique allows for very well defined microcantilevers and gives the possibility of embedding structures into the cantilever surface. The microcantilevers are fabricated in TOPAS and are up to 500 µm long, 100 µm wide, and 4.5 µm thick. Some of the cantilevers have built-in ripple surface structures with heights of 800 nm and pitches of 4 µm. The yield for the cantilever fabrication is 95% and the initial out-of-plane bending is below 10 µm. The stiffness of the cantilevers is measured by deflecting the cantilever with a well-characterized AFM probe. An average stiffness of 61.3 mN m-1 is found. Preliminary tests with water vapour indicate that the microcantilevers can be used directly for vapour sensing applications and illustrate the influence of surface structuring of the cantilevers.

  1. Photoresist composition for extreme ultraviolet lithography

    DOEpatents

    Felter, T. E.; Kubiak, G. D.

    1999-01-01

    A method of producing a patterned array of features, in particular, gate apertures, in the size range 0.4-0.05 .mu.m using projection lithography and extreme ultraviolet (EUV) radiation. A high energy laser beam is used to vaporize a target material in order to produce a plasma which in turn, produces extreme ultraviolet radiation of a characteristic wavelength of about 13 nm for lithographic applications. The radiation is transmitted by a series of reflective mirrors to a mask which bears the pattern to be printed. The demagnified focused mask pattern is, in turn, transmitted by means of appropriate optics and in a single exposure, to a substrate coated with photoresists designed to be transparent to EUV radiation and also satisfy conventional processing methods. A photoresist composition for extreme ultraviolet radiation of boron carbide polymers, hydrochlorocarbons and mixtures thereof.

  2. Nanoscale plasmonic stamp lithography on silicon.

    PubMed

    Liu, Fenglin; Luber, Erik J; Huck, Lawrence A; Olsen, Brian C; Buriak, Jillian M

    2015-02-24

    Nanoscale lithography on silicon is of interest for applications ranging from computer chip design to tissue interfacing. Block copolymer-based self-assembly, also called directed self-assembly (DSA) within the semiconductor industry, can produce a variety of complex nanopatterns on silicon, but these polymeric films typically require transformation into functional materials. Here we demonstrate how gold nanopatterns, produced via block copolymer self-assembly, can be incorporated into an optically transparent flexible PDMS stamp, termed a plasmonic stamp, and used to directly functionalize silicon surfaces on a sub-100 nm scale. We propose that the high intensity electric fields that result from the localized surface plasmons of the gold nanoparticles in the plasmonic stamps upon illumination with low intensity green light, lead to generation of electron-hole pairs in the silicon that drive spatially localized hydrosilylation. This approach demonstrates how localized surface plasmons can be used to enable functionalization of technologically relevant surfaces with nanoscale control. PMID:25654172

  3. Applications of fiber optic sensors in advanced engine controls

    NASA Astrophysics Data System (ADS)

    Nitka, Edward F., II

    1989-06-01

    Measured parameters, operating ranges, accuracy requirements, environmental constraints, and speed of response of fiber optic sensors are identified for three categories of engines. The three engine categories are: (1) current turbojet, turbofan, and turboprop engines; (2) next generation and turbofan engines to be built in the 1990s; and (3) advanced supersonic/hypersonic engines represented by ramjet, scramjet, and air-turbo-ramjet concepts. The key development and test efforts in engine control applications of fiber optic sensors are discussed.

  4. Recent advances in carbon nanodots: synthesis, properties and biomedical applications

    NASA Astrophysics Data System (ADS)

    Miao, Peng; Han, Kun; Tang, Yuguo; Wang, Bidou; Lin, Tao; Cheng, Wenbo

    2015-01-01

    Herein, a mini review is presented concerning the most recent research progress of carbon nanodots, which have emerged as one of the most attractive photoluminescent materials. Different synthetic methodologies to achieve advanced functions and better photoluminescence performances are summarized, which are mainly divided into two classes: top-down and bottom-up. The inspiring properties, including photoluminescence emission, chemiluminescence, electrochemical luminescence, peroxidase-like activity and toxicity, are discussed. Moreover, the biomedical applications in biosensing, bioimaging and drug delivery are reviewed.

  5. Recent advances in natural language processing for biomedical applications.

    PubMed

    Collier, Nigel; Nazarenko, Adeline; Baud, Robert; Ruch, Patrick

    2006-06-01

    We survey a set a recent advances in natural language processing applied to biomedical applications, which were presented in Geneva, Switzerland, in 2004 at an international workshop. While text mining applied to molecular biology and biomedical literature can report several interesting achievements, we observe that studies applied to clinical contents are still rare. In general, we argue that clinical corpora, including electronic patient records, must be made available to fill the gap between bioinformatics and medical informatics. PMID:16139564

  6. Continuously variable transmission: Assessment of applicability to advance electric vehicles

    NASA Technical Reports Server (NTRS)

    Loewenthal, S. H.; Parker, R. J.

    1981-01-01

    A brief historical account of the evolution of continuously variable transmissions (CVT) for automotive use is given. The CVT concepts which are potentially suitable for application with electric and hybrid vehicles are discussed. The arrangement and function of several CVT concepts are cited along with their current developmental status. The results of preliminary design studies conducted on four CVT concepts for use in advanced electric vehicles are discussed.

  7. Advanced stress analysis methods applicable to turbine engine structures

    NASA Technical Reports Server (NTRS)

    Pian, T. H. H.

    1985-01-01

    Advanced stress analysis methods applicable to turbine engine structures are investigated. Constructions of special elements which containing traction-free circular boundaries are investigated. New versions of mixed variational principle and version of hybrid stress elements are formulated. A method is established for suppression of kinematic deformation modes. semiLoof plate and shell elements are constructed by assumed stress hybrid method. An elastic-plastic analysis is conducted by viscoplasticity theory using the mechanical subelement model.

  8. High resolution patterning for flexible electronics via roll-to-roll nanoimprint lithography

    NASA Astrophysics Data System (ADS)

    Sabik, Sami; de Riet, Joris; Yakimets, Iryna; Smits, Edsger

    2014-03-01

    Flexible electronics is a growing field and is currently maturing in applications such as displays, smart packaging, organic light-emitting diodes and organic photovoltaic cells. In order to process on flexible substrates at high throughput and large areas, novel patterning techniques will be essential. Conventional optical lithography is limited in throughput as well as resolution, and requires several alignment steps to generate multi-layered patterns, required for applications such as thin-film transistors. It therefore remains a complex and expensive process. Nanoimprint lithography is an emerging alternative to optical lithography, demonstrating patterning capabilities over a wide range of resolutions, from several microns down to a few nanometres. For display applications, nanoimprint lithography can be used to pattern various layers. Micron sized thin-film transistors for backplane can be fabricated where a self-aligned geometry is used to decrease the number of alignment steps, and increase the overlay accuracy. In addition, nano-structures can be used for optical applications such as anti-reflective surfaces and nano patterned transparent electrodes. Imprint lithography is a fully roll-to-roll compatible process and enables large area and high throughput fabrication for flexible electronics. In this paper we discuss the possibilities and the challenges of large area patterning by roll-to-roll nanoimprint lithography, reviewing micron and nano sized structures realized on our roll-to-roll equipment. Nano patterned transparent electrodes, moth-eye antireflective coatings, and multilevel structures will be covered.

  9. DNA Origami Mask for Sub-Ten-Nanometer Lithography.

    PubMed

    Diagne, Cheikh Tidiane; Brun, Christophe; Gasparutto, Didier; Baillin, Xavier; Tiron, Raluca

    2016-07-26

    DNA nanotechnology is currently widely explored and especially shows promises for advanced lithography due to its ability to define nanometer scale features. We demonstrate a 9 × 14 nm(2) hole pattern transfer from DNA origami into an SiO2 layer with a sub-10-nm resolution using anhydrous HF vapor in a semiconductor etching machine. We show that the resulting SiO2 pattern inherits its shape from the DNA structure within a process time ranging from 30 to 60 s at an etching rate of 0.2 nm/s. At 600 s of etching, the SiO2 pattern meets corrosion and the overall etching reaction is blocked. These results, in addition to the entire surface coverage by magnesium occurring on the substrate at a density of 1.1 × 10(15) atom/cm(2), define a process window, fabrication rules, and limits for DNA-based lithography. PMID:27281227

  10. Direct Simulation Monte Carlo: Recent Advances and Applications

    NASA Astrophysics Data System (ADS)

    Oran, E. S.; Oh, C. K.; Cybyk, B. Z.

    The principles of and procedures for implementing direct simulation Monte Carlo (DSMC) are described. Guidelines to inherent and external errors common in DSMC applications are provided. Three applications of DSMC to transitional and nonequilibrium flows are considered: rarefied atmospheric flows, growth of thin films, and microsystems. Selected new, potentially important advances in DSMC capabilities are described: Lagrangian DSMC, optimization on parallel computers, and hybrid algorithms for computations in mixed flow regimes. Finally, the limitations of current computer technology for using DSMC to compute low-speed, high-Knudsen-number flows are outlined as future challenges.

  11. Survey of advanced nuclear technologies for potential applications of sonoprocessing.

    PubMed

    Rubio, Floren; Blandford, Edward D; Bond, Leonard J

    2016-09-01

    Ultrasonics has been used in many industrial applications for both sensing at low power and processing at higher power. Generally, the high power applications fall within the categories of liquid stream degassing, impurity separation, and sonochemical enhancement of chemical processes. Examples of such industrial applications include metal production, food processing, chemical production, and pharmaceutical production. There are many nuclear process streams that have similar physical and chemical processes to those applications listed above. These nuclear processes could potentially benefit from the use of high-power ultrasonics. There are also potential benefits to applying these techniques in advanced nuclear fuel cycle processes, and these benefits have not been fully investigated. Currently the dominant use of ultrasonic technology in the nuclear industry has been using low power ultrasonics for non-destructive testing/evaluation (NDT/NDE), where it is primarily used for inspections and for characterizing material degradation. Because there has been very little consideration given to how sonoprocessing can potentially improve efficiency and add value to important process streams throughout the nuclear fuel cycle, there are numerous opportunities for improvement in current and future nuclear technologies. In this paper, the relevant fundamental theory underlying sonoprocessing is highlighted, and some potential applications to advanced nuclear technologies throughout the nuclear fuel cycle are discussed. PMID:27400217

  12. Advances in the manufacturing, types, and applications of biosensors

    NASA Astrophysics Data System (ADS)

    Ravindra, Nuggehalli M.; Prodan, Camelia; Fnu, Shanmugamurthy; Padronl, Ivan; Sikha, Sushil K.

    2007-12-01

    In recent years, there have been significant technological advancements in the manufacturing, types, and applications of biosensors. Applications include clinical and non-clinical diagnostics for home, bio-defense, bio-remediation, environment, agriculture, and the food industry. Biosensors have progressed beyond the detection of biological threats such as anthrax and are finding use in a number of non-biological applications. Emerging biosensor technologies such as lab-on-a-chip have revolutionized the integration approaches for a very flexible, innovative, and user-friendly platform. An overview of the fundamentals, types, applications, and manufacturers, as well as the market trends of biosensors is presented here. Two case studies are discussed: one focused on a characterization technique—patch clamping and dielectric spectroscopy as a biological sensor—and the other about lithium phthalocyanine, a material that is being developed for in-vivo oxymetry.

  13. Membrane projection lithography

    DOEpatents

    Burckel, David Bruce; Davids, Paul S; Resnick, Paul J; Draper, Bruce L

    2015-03-17

    The various technologies presented herein relate to a three dimensional manufacturing technique for application with semiconductor technologies. A membrane layer can be formed over a cavity. An opening can be formed in the membrane such that the membrane can act as a mask layer to the underlying wall surfaces and bottom surface of the cavity. A beam to facilitate an operation comprising any of implantation, etching or deposition can be directed through the opening onto the underlying surface, with the opening acting as a mask to control the area of the underlying surfaces on which any of implantation occurs, material is removed, and/or material is deposited. The membrane can be removed, a new membrane placed over the cavity and a new opening formed to facilitate another implantation, etching, or deposition operation. By changing the direction of the beam different wall/bottom surfaces can be utilized to form a plurality of structures.

  14. Reflective electron-beam lithography: progress toward high-throughput production capability

    NASA Astrophysics Data System (ADS)

    Freed, Regina; Gubiotti, Thomas; Sun, Jeff; Kidwingira, Francoise; Yang, Jason; Ummethala, Upendra; Hale, Layton C.; Hench, John J.; Kojima, Shinichi; Mieher, Walter D.; Bevis, Chris F.; Lin, Shy-Jay; Wang, Wen-Chuan

    2012-03-01

    Maskless electron beam lithography can potentially extend semiconductor manufacturing to the 16 nm technology node and beyond. KLA-Tencor is developing Reflective Electron Beam Lithography (REBL) targeting high-volume 16 nm half pitch (HP) production. This paper reviews progress in the development of the REBL system towards its goal of 100 wph throughput for High Volume Manufacturing (HVM) at the 2X and 1X nm nodes. We will demonstrate the ability to print TSMC test patterns with the integrated system in photoresist on silicon wafers at 45 nm resolution. Additionally, we present simulation and experimental results that demonstrate that the system meets performance targets for a typical foundry product mix. Previously, KLA-Tencor reported on the development of a REBL tool for maskless lithography at and below the 16 nm HP technology node1. Since that time, the REBL team and its partners (TSMC, IMEC) have made good progress towards developing the REBL system and Digital Pattern Generator (DPG) for direct write lithography. Traditionally, e-beam direct write lithography has been too slow for most lithography applications. E-beam direct write lithography has been used for mask writing rather than wafer processing since the maximum blur requirements limit column beam current - which drives e-beam throughput. To print small features and a fine pitch with an e-beam tool requires a sacrifice in processing time unless one significantly increases the total number of beams on a single writing tool. Because of the continued uncertainty with regards to the optical lithography roadmap beyond the 16 nm HP technology node, the semiconductor equipment industry is in the process of designing and testing e-beam lithography tools with the potential for HVM.

  15. Nanostructure patterning on flexible substrates using electron beam lithography

    NASA Astrophysics Data System (ADS)

    Nagaraj, K. S.; Sangeeth, K.; Hegde, G. M.

    2014-06-01

    Patterning nanostructures on flexible substrates plays a key role in the emerging flexible electronics technology. The flexible electronic devices are inexpensive and can be conformed to any shape. The potential applications for such devices are sensors, displays, solar cells, RFID, high-density biochips, optoelectronics etc. E-beam lithography is established as a powerful tool for nanoscale fabrication, but its applicability on insulating flexible substrates is often limited because of surface charging effects. This paper presents the fabrication of nanostructures on insulating flexible substrates using low energy E-beam lithography along with metallic layers for charge dissipation. Nano Structures are patterned on different substrates of materials such as acetate and PET foils. The fabrication process parameters such as the proximity gap of exposure, the exposure dosage and developing conditions have been optimized for each substrate.

  16. Feature-based tolerancing for advanced manufacturing applications

    SciTech Connect

    Brown, C.W.; Kirk, W.J. III; Simons, W.R.; Ward, R.C.; Brooks, S.L.

    1994-11-01

    A primary requirement for the successful deployment of advanced manufacturing applications is the need for a complete and accessible definition of the product. This product definition must not only provide an unambiguous description of a product`s nominal shape but must also contain complete tolerance specification and general property attributes. Likewise, the product definition`s geometry, topology, tolerance data, and modeler manipulative routines must be fully accessible through a robust application programmer interface. This paper describes a tolerancing capability using features that complements a geometric solid model with a representation of conventional and geometric tolerances and non-shape property attributes. This capability guarantees a complete and unambiguous definition of tolerances for manufacturing applications. An object-oriented analysis and design of the feature-based tolerance domain was performed. The design represents and relates tolerance features, tolerances, and datum reference frames. The design also incorporates operations that verify correctness and check for the completeness of the overall tolerance definition. The checking algorithm is based upon the notion of satisfying all of a feature`s toleranceable aspects. Benefits from the feature-based tolerance modeler include: advancing complete product definition initiatives, incorporating tolerances in product data exchange, and supplying computer-integrated manufacturing applications with tolerance information.

  17. Applications and Advances in Electronic-Nose Technologies

    PubMed Central

    Wilson, Alphus D.; Baietto, Manuela

    2009-01-01

    Electronic-nose devices have received considerable attention in the field of sensor technology during the past twenty years, largely due to the discovery of numerous applications derived from research in diverse fields of applied sciences. Recent applications of electronic nose technologies have come through advances in sensor design, material improvements, software innovations and progress in microcircuitry design and systems integration. The invention of many new e-nose sensor types and arrays, based on different detection principles and mechanisms, is closely correlated with the expansion of new applications. Electronic noses have provided a plethora of benefits to a variety of commercial industries, including the agricultural, biomedical, cosmetics, environmental, food, manufacturing, military, pharmaceutical, regulatory, and various scientific research fields. Advances have improved product attributes, uniformity, and consistency as a result of increases in quality control capabilities afforded by electronic-nose monitoring of all phases of industrial manufacturing processes. This paper is a review of the major electronic-nose technologies, developed since this specialized field was born and became prominent in the mid 1980s, and a summarization of some of the more important and useful applications that have been of greatest benefit to man. PMID:22346690

  18. Amphiphile nanoarchitectonics: from basic physical chemistry to advanced applications

    SciTech Connect

    Ramanathan, Nathan Muruganathan; Shrestha, Lok Kumar; Mori, Taizo; Ji, Dr. Qingmin; Hill, Dr. Jonathan P; Ariga, Katsuhiko

    2013-01-01

    Amphiphiles, either synthetic or natural, are structurally simple molecules with the unprecedented capacity to self-assemble into complex, hierarchical geometries in nanospace. Effective self-assembly processes of amphiphiles are often used to mimic biological systems, such as, assembly of lipids and proteins, which has paved a way for bottom-up nanotechnology with bio-like advanced functions. Recent developments on nanostructure formation combine simple processes of assembly with the more advanced concept of nanoarchitectonics. In this pespective, we summarize research on self-assembly of amphiphilic molecules such as lipids, surfactants or block copolymers that are a focus of interest for many colloid, polymer, and materials scientists and which have become increasingly important in emerging nanotechnology. Because the fundamental science of amphiphiles was initially developed for their solution assembly then transferred to assemblies on surfaces as a development of nanotechnological technique, this perspective attempts to mirro this development by introducing solution systems and progressing to interfacial systems, which are roughly categorized as (i) basic properties of amphiphiles, (ii) self-assembly of amphiphiles in bulk phases, (iii) assembly on static surfaces, (iv) assembly at dynamic interfaces, and (v) advanced topics from simulation to application. This progression also represents the evolution of amphiphile science and technology from simple assemblies to advanced assemblies to nanoarchitectonics.

  19. Future trends in high-resolution lithography

    NASA Astrophysics Data System (ADS)

    Lawes, R. A.

    2000-02-01

    A perennial question is "what is the future of high-resolution lithography, a key technology that drives the semiconductor industry"? The dominant technology over the last 30 years has been optical lithography, which by lowering wavelengths to 193 nm (ArF) and 157 nm (F 2) and by using optical "tricks" such as phase shift masks, off-axis illumination and phase filters, should be capable of 100 nm CMOS technology. So where does this leave the competition? The 100-nm lithography used to be the domain of electron beam lithography but only in research laboratories. Significant efforts are being made to increase throughput by electron projection (scattering with angular limitation projection electron beam lithography or SCALPEL). X-ray lithography remains a demonstrated R&D tool waiting to be commercially exploited but the initial expenditure to do so is very high. Ion beam lithography and extreme ultraviolet (EUV) ( λ<12 nm) have also received attention in recent years. This paper will concentrate on some of the key issues and speculate on how and when an alternative to optical lithography will be embraced by industry.

  20. Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin-film deposition in solutions

    NASA Astrophysics Data System (ADS)

    Koshida, Nobuyoshi; Kojima, Akira; Ikegami, Naokatsu; Suda, Ryutaro; Yagi, Mamiko; Shirakashi, Junichi; Miyaguchi, Hiroshi; Muroyama, Masanori; Yoshida, Shinya; Totsu, Kentaro; Esashi, Masayoshi

    2015-07-01

    Making the best use of the characteristic features in nanocrystalline Si (nc-Si) ballistic hot electron source, an alternative lithographic technology is presented based on two approaches: physical excitation in vacuum and chemical reduction in solutions. The nc-Si cold cathode is composed of a thin metal film, an nc-Si layer, an n+-Si substrate, and an ohmic back contact. Under a biased condition, energetic electrons are uniformly and directionally emitted through the thin surface electrodes. In vacuum, this emitter is available for active-matrix drive massive parallel lithography. Arrayed 100×100 emitters (each emitting area: 10×10 μm2) are fabricated on a silicon substrate by a conventional planar process, and then every emitter is bonded with the integrated driver using through-silicon-via interconnect technology. Another application is the use of this emitter as an active electrode supplying highly reducing electrons into solutions. A very small amount of metal-salt solutions is dripped onto the nc-Si emitter surface, and the emitter is driven without using any counter electrodes. After the emitter operation, thin metal and elemental semiconductors (Si and Ge) films are uniformly deposited on the emitting surface. Spectroscopic surface and compositional analyses indicate that there are no significant contaminations in deposited thin films.

  1. Design Advances in Particulate Systems for Biomedical Applications.

    PubMed

    Lima, Ana Catarina; Alvarez-Lorenzo, Carmen; Mano, João F

    2016-07-01

    The search for more efficient therapeutic strategies and diagnosis tools is a continuous challenge. Advances in understanding the biological mechanisms behind diseases and tissues regeneration have widened the field of applications of particulate systems. Particles are no more just protective systems for the encapsulated drugs, but they play an active role in the success of the therapy. Moreover, particles have been explored for innovative purposes as templates for cells growth and as diagnostic tools. Until few years ago the most relevant parameters in particles formulation were the chemistry and the size. Currently, it is known that other physical characteristics can remarkably affect the performance of particulate systems. Particles with non-conventional shapes exhibit advantages due to the increasing circulation time in blood stream, less clearance by the immune system and more efficient cell internalization and trafficking. Creation of compartments has been found useful to control drug release, to tune the transport of substances across biological barriers, to supply the target with more than one bioactive agent or even to act as theranostic systems. It is expected that such complex shaped and compartmentalized systems improve the therapeutic outcomes and also the patient's compliance, acting as advanced devices that serve for simultaneous diagnosis and treatment of the disease, combining agents of very different features, at the same time. In this review, we overview and analyse the most recent advances in particle shape and compartmentalization and applications of newly designed particulate systems in the biomedical field. PMID:27332041

  2. High-power disk lasers: advances and applications

    NASA Astrophysics Data System (ADS)

    Havrilla, David; Ryba, Tracey; Holzer, Marco

    2012-03-01

    Though the genesis of the disk laser concept dates to the early 90's, the disk laser continues to demonstrate the flexibility and the certain future of a breakthrough technology. On-going increases in power per disk, and improvements in beam quality and efficiency continue to validate the genius of the disk laser concept. As of today, the disk principle has not reached any fundamental limits regarding output power per disk or beam quality, and offers numerous advantages over other high power resonator concepts, especially over monolithic architectures. With about 2,000 high power disk lasers installations, and a demand upwards of 1,000 lasers per year, the disk laser has proven to be a robust and reliable industrial tool. With advancements in running cost, investment cost and footprint, manufacturers continue to implement disk laser technology with more vigor than ever. This paper will explain recent advances in disk laser technology and process relevant features of the laser, like pump diode arrangement, resonator design and integrated beam guidance. In addition, advances in applications in the thick sheet area and very cost efficient high productivity applications like remote welding, remote cutting and cutting of thin sheets will be discussed.

  3. Nanoscience and Nanotechnology: From Energy Applications to Advanced Medical Therapies

    ScienceCinema

    Tijana Rajh

    2010-01-08

    Dr. Rajh will present a general talk on nanotechnology ? an overview of why nanotechnology is important and how it is useful in various fields. The specific focus will be on Solar energy conversion, environmental applications and advanced medical therapies. She has broad expertise in synthesis and characterization of nanomaterials that are used in nanotechnology including novel hybrid systems connecting semiconductors to biological molecules like DNA and antibodies. This technology could lead to new gene therapy procedures, cancer treatments and other medical applications. She will also discuss technologies made possible by organizing small semiconductor particles called quantum dots, materials that exhibit a rich variety of phenomena that are size and shape dependent. Development of these new materials that harnesses the unique properties of materials at the 1-100 nanometer scale resulted in the new field of nanotechnology that currently affects many applications in technological and medical fields.

  4. Buckling-induced smart applications: recent advances and trends

    NASA Astrophysics Data System (ADS)

    Hu, Nan; Burgueño, Rigoberto

    2015-06-01

    A paradigm shift has emerged over the last decade pointing to an exciting research area dealing with the harnessing of elastic structural instabilities for ‘smart’ purposes in a variety of venues. Among the different types of unstable responses, buckling is a phenomenon that has been known for centuries, and yet it is generally avoided through special design modifications. Increasing interest in the design of smart devices and mechanical systems has identified buckling and postbuckling response as a favorable behavior. The objective of this topical review is to showcase the recent advances in buckling-induced smart applications and to explain why buckling responses have certain advantages and are especially suitable for these particular applications. Interesting prototypes in terms of structural forms and material uses associated with these applications are summarized. Finally, this review identifies potential research avenues and emerging trends for using buckling and other elastic instabilities for future innovations.

  5. Why bother with x-ray lithography?

    NASA Astrophysics Data System (ADS)

    Smith, Henry I.; Schattenburg, Mark L.

    1992-07-01

    The manufacture of state-of-the-art integrated circuits uses UV optical projection lithography. Conventional wisdom (i.e., the trade journals) holds that this technology will take the industry to quarter-micrometer minimum features sizes and below. So, why bother with X-ray lithography? The reason is that lithography is a 'system problem', and proximity X-ray lithography is better matched to that system problem than any other technology, once the initial investment is surmounted. X-ray lithography offers the most cost-effective path to the future of ultra-large-scale integrated circuits with feature sizes of tenth micrometer and below (i.e., gigascale electronics and quantum-effect electronics).

  6. Development of advanced battery systems for vehicle applications

    SciTech Connect

    Zagrodnik, J.P.; Eskra, M.D.; Andrew, M.G.; Gentry, W.O.

    1989-01-01

    The Advanced Battery Business Unit (ABBU) of Johnson Controls, Inc. is developing several promising advanced battery technologies including flow-through lead-acid, zinc/bromine, and nickel hydrogen. The flow-through lead-acid technology, which is being developed under Department of Energy (DOE) sponsorship, is progressing towards the fabrication of a 39 kWh battery system. Recent efforts have focused on achieving the aggressive specific energy goal of 56 Wh/kg in 12 volt module form. Recent DOE sponsored work in the zinc/bromine program has focused on the development of a proof-of concept 50 kWh electric vehicle system for a light van application. Efforts in the nickel hydrogen program have focused on reducing system cost in order to make the life-time premium market and EV market possible targets. The status and future direction of each of these programs are summarized.

  7. Advanced aerospace remote sensing systems for global resource applications

    NASA Technical Reports Server (NTRS)

    Taranik, J. V.

    1981-01-01

    The Landsat program, which was concerned with testing the use of satellite data for global resource observations, has been an unqualified success, and users of Landsat data demand now that repetitive global multispectral data be provided on a routine basis for a wide variety of applications. A review is provided of the current status of NASA's land observation program, new developments in advanced aerospace remote sensing techniques, and issues related to the development and testing of new prototype systems by the U.S. The current Landsat program is considered along with developments in solid-state imaging technology, short wave infrared research using the Space Shuttle, the Shuttle Orbiter camera payload system large format camera, and advanced research in thermal remote sensing. Attention is also given to the potential of imaging radar for global resource observations, and research related to geopotential field mapping.

  8. Demonstration of lithography patterns using reflective e-beam direct write

    NASA Astrophysics Data System (ADS)

    Freed, Regina; Sun, Jeff; Brodie, Alan; Petric, Paul; McCord, Mark; Ronse, Kurt; Haspeslagh, Luc; Vereecke, Bart

    2011-04-01

    Traditionally, e-beam direct write lithography has been too slow for most lithography applications. E-beam direct write lithography has been used for mask writing rather than wafer processing since the maximum blur requirements limit column beam current - which drives e-beam throughput. To print small features and a fine pitch with an e-beam tool requires a sacrifice in processing time unless one significantly increases the total number of beams on a single writing tool. Because of the uncertainty with regards to the optical lithography roadmap beyond the 22 nm technology node, the semiconductor equipment industry is in the process of designing and testing e-beam lithography tools with the potential for high volume wafer processing. For this work, we report on the development and current status of a new maskless, direct write e-beam lithography tool which has the potential for high volume lithography at and below the 22 nm technology node. A Reflective Electron Beam Lithography (REBL) tool is being developed for high throughput electron beam direct write maskless lithography. The system is targeting critical patterning steps at the 22 nm node and beyond at a capital cost equivalent to conventional lithography. Reflective Electron Beam Lithography incorporates a number of novel technologies to generate and expose lithographic patterns with a throughput and footprint comparable to current 193 nm immersion lithography systems. A patented, reflective electron optic or Digital Pattern Generator (DPG) enables the unique approach. The Digital Pattern Generator is a CMOS ASIC chip with an array of small, independently controllable lens elements (lenslets), which act as an array of electron mirrors. In this way, the REBL system is capable of generating the pattern to be written using massively parallel exposure by ~1 million beams at extremely high data rates (~ 1Tbps). A rotary stage concept using a rotating platen carrying multiple wafers optimizes the writing strategy of

  9. Ultraviolet nanoimprint lithography using cyclodextrin-based porous template for pattern failure reduction

    NASA Astrophysics Data System (ADS)

    Takei, Satoshi; Hanabata, Makoto

    2015-10-01

    An approach to ultraviolet (UV) nanoimprint lithography using a cyclodextrin-based porous template was investigated for the reduction of air trapping and template damage caused by gases such as nitrogen and oxygen generated from UV cross-linked materials. The accuracy of the printed pattern using UV nanoimprint lithography with the porous transparent template was improved because of enhanced material adsorption and increased permeability to gaseous species. The use of volatile solvents in the UV cross-linked materials for nanoimprint lithography has been limited because of high pattern failure rates. However, using the cyclodextrin-based porous template, the UV cross-linked materials with a 5 wt. % volatile solvent exhibited well-defined nanoscale patterns. Based on this study, acceptable chemistries for the UV cross-linked materials have been expanded, which will be beneficial for future device applications using UV nanoimprint lithography.

  10. Scanning probe lithography approach for beyond CMOS devices

    NASA Astrophysics Data System (ADS)

    Durrani, Zahid; Jones, Mervyn; Kaestner, Marcus; Hofer, Manuel; Guliyev, Elshad; Ahmad, Ahmad; Ivanov, Tzvetan; Zoellner, Jens-Peter; Rangelow, Ivo W.

    2013-03-01

    As present CMOS devices approach technological and physical limits at the sub-10 nm scale, a `beyond CMOS' information-processing technology is necessary for timescales beyond the semiconductor technology roadmap. This requires new approaches to logic and memory devices, and to associated lithographic processes. At the sub-5 nm scale, a technology platform based on a combination of high-resolution scanning probe lithography (SPL) and nano-imprint lithography (NIL) is regarded as a promising candidate for both resolution and high throughput production. The practical application of quantum-effect devices, such as room temperature single-electron and quantum-dot devices, then becomes feasible. This paper considers lithographic and device approaches to such a `single nanometer manufacturing' technology. We consider the application of scanning probes, capable of imaging, probing of material properties and lithography at the single nanometer scale. Modified scanning probes are used to pattern molecular glass based resist materials, where the small particle size (<1 nm) and mono-disperse nature leads to more uniform and smaller lithographic pixel size. We also review the current status of single-electron and quantum dot devices capable of room-temperature operation, and discuss the requirements for these devices with regards to practical application.

  11. Advances in Electronic-Nose Technologies Developed for Biomedical Applications

    PubMed Central

    Wilson, Alphus D.; Baietto, Manuela

    2011-01-01

    The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and recent biomedical research findings and developments of electronic-nose sensor technologies, and to identify current and future potential e-nose applications that will continue to advance the effectiveness and efficiency of biomedical treatments and healthcare services for many years. An abundance of electronic-nose applications has been developed for a variety of healthcare sectors including diagnostics, immunology, pathology, patient recovery, pharmacology, physical therapy, physiology, preventative medicine, remote healthcare, and wound and graft healing. Specific biomedical e-nose applications range from uses in biochemical testing, blood-compatibility evaluations, disease diagnoses, and drug delivery to monitoring of metabolic levels, organ dysfunctions, and patient conditions through telemedicine. This paper summarizes the major electronic-nose technologies developed for healthcare and biomedical applications since the late 1980s when electronic aroma detection technologies were first recognized to be potentially useful in providing effective solutions to problems in the healthcare industry. PMID:22346620

  12. Mask lithography for display manufacturing

    NASA Astrophysics Data System (ADS)

    Sandstrom, T.; Ekberg, P.

    2010-05-01

    The last ten years have seen flat displays conquer our briefcases, desktops, and living rooms. There has been an enormous development in production technology, not least in lithography and photomasks. Current masks for large displays are more than 2 m2 and make 4-6 1X prints on glass substrates that are 9 m2. One of the most challenging aspects of photomasks for displays is the so called mura, stripes or blemishes which cause visible defects in the finished display. For the future new and even tighter maskwriter specifications are driven by faster transistors and more complex pixel layouts made necessary by the market's wish for still better image quality, multi-touch panels, 3D TVs, and the next wave of e-book readers. Large OLED screens will pose new challenges. Many new types of displays will be lowcost and use simple lithography, but anything which can show video and high quality photographic images needs a transistor backplane and sophisticated masks for its production.

  13. A combined electron beam/optical lithography process step for the fabrication of sub-half-micron-gate-length MMIC chips

    NASA Technical Reports Server (NTRS)

    Sewell, James S.; Bozada, Christopher A.

    1994-01-01

    Advanced radar and communication systems rely heavily on state-of-the-art microelectronics. Systems such as the phased-array radar require many transmit/receive (T/R) modules which are made up of many millimeter wave - microwave integrated circuits (MMIC's). The heart of a MMIC chip is the Gallium Arsenide (GaAs) field-effect transistor (FET). The transistor gate length is the critical feature that determines the operating frequency of the radar system. A smaller gate length will typically result in a higher frequency. In order to make a phased array radar system economically feasible, manufacturers must be capable of producing very large quantities of small-gate-length MMIC chips at a relatively low cost per chip. This requires the processing of a large number of wafers with a large number of chips per wafer, minimum processing time, and a very high chip yield. One of the bottlenecks in the fabrication of MIMIC chips is the transistor gate definition. The definition of sub-half-micron gates for GaAs-based field-effect transistors is generally performed by direct-write electron beam lithography (EBL). Because of the throughput limitations of EBL, the gate-layer fabrication is conventionally divided into two lithographic processes where EBL is used to generate the gate fingers and optical lithography is used to generate the large-area gate pads and interconnects. As a result, two complete sequences of resist application, exposure, development, metallization and lift-off are required for the entire gate structure. We have baselined a hybrid process, referred to as EBOL (electron beam/optical lithography), in which a single application of a multi-level resist is used for both exposures. The entire gate structure, (gate fingers, interconnects and pads), is then formed with a single metallization and lift-off process. The EBOL process thus retains the advantages of the high-resolution E-beam lithography and the high throughput of optical lithography while essentially

  14. Nanoscale Copper and Copper Compounds for Advanced Device Applications

    NASA Astrophysics Data System (ADS)

    Chen, Lih-Juann

    2016-04-01

    Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu2S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu3Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se2 nanotip arrays for high-efficiency solar cell, multilevel Cu2S resistive memory, superlattice Cu2S-Ag2S heterojunction diodes, and facet-dependent Cu2O diode.

  15. Advances in targeted proteomics and applications to biomedical research.

    PubMed

    Shi, Tujin; Song, Ehwang; Nie, Song; Rodland, Karin D; Liu, Tao; Qian, Wei-Jun; Smith, Richard D

    2016-08-01

    Targeted proteomics technique has emerged as a powerful protein quantification tool in systems biology, biomedical research, and increasing for clinical applications. The most widely used targeted proteomics approach, selected reaction monitoring (SRM), also known as multiple reaction monitoring (MRM), can be used for quantification of cellular signaling networks and preclinical verification of candidate protein biomarkers. As an extension to our previous review on advances in SRM sensitivity (Shi et al., Proteomics, 12, 1074-1092, 2012) herein we review recent advances in the method and technology for further enhancing SRM sensitivity (from 2012 to present), and highlighting its broad biomedical applications in human bodily fluids, tissue and cell lines. Furthermore, we also review two recently introduced targeted proteomics approaches, parallel reaction monitoring (PRM) and data-independent acquisition (DIA) with targeted data extraction on fast scanning high-resolution accurate-mass (HR/AM) instruments. Such HR/AM targeted quantification with monitoring all target product ions addresses SRM limitations effectively in specificity and multiplexing; whereas when compared to SRM, PRM and DIA are still in the infancy with a limited number of applications. Thus, for HR/AM targeted quantification we focus our discussion on method development, data processing and analysis, and its advantages and limitations in targeted proteomics. Finally, general perspectives on the potential of achieving both high sensitivity and high sample throughput for large-scale quantification of hundreds of target proteins are discussed. PMID:27302376

  16. Thermal and Environmental Barrier Coatings for Advanced Turbine Engine Applications

    NASA Technical Reports Server (NTRS)

    Zhu, Dong-Ming; Miller, Robert A.

    2005-01-01

    Ceramic thermal and environmental barrier coatings (T/EBCs) will play a crucial role in advanced gas turbine engine systems because of their ability to significantly increase engine operating temperatures and reduce cooling requirements, thus help achieve engine low emission and high efficiency goals. Advanced T/EBCs are being developed for the low emission SiC/SiC ceramic matrix composite (CMC) combustor applications by extending the CMC liner and vane temperature capability to 1650 C (3000 F) in oxidizing and water vapor containing combustion environments. Low conductivity thermal barrier coatings (TBCs) are also being developed for metallic turbine airfoil and combustor applications, providing the component temperature capability up to 1650 C (3000 F). In this paper, ceramic coating development considerations and requirements for both the ceramic and metallic components will be described for engine high temperature and high-heat-flux applications. The underlying coating failure mechanisms and life prediction approaches will be discussed based on the simulated engine tests and fracture mechanics modeling results.

  17. Spacecraft applications of advanced global positioning system technology

    NASA Technical Reports Server (NTRS)

    1988-01-01

    This is the final report on the Texas Instruments Incorporated (TI) simulations study of Spacecraft Application of Advanced Global Positioning System (GPS) Technology. This work was conducted for the NASA Johnson Space Center (JSC) under contract NAS9-17781. GPS, in addition to its baselined capability as a highly accurate spacecraft navigation system, can provide traffic control, attitude control, structural control, and uniform time base. In Phase 1 of this program, another contractor investigated the potential of GPS in these four areas and compared GPS to other techniques. This contract was for the Phase 2 effort, to study the performance of GPS for these spacecraft applications through computer simulations. TI had previously developed simulation programs for GPS differential navigation and attitude measurement. These programs were adapted for these specific spacecraft applications. In addition, TI has extensive expertise in the design and production of advanced GPS receivers, including space-qualified GPS receivers. We have drawn on this background to augment the simulation results in the system level overview, which is Section 2 of this report.

  18. A Submicron Lithography Process Using Philips I-Line Stepper

    NASA Astrophysics Data System (ADS)

    van der Looij, Guido; Nagaswami, Venkat; Baltussen, Peter; Hartog, Peter; Vervoordeldonk, Rene; Moonen, Joost

    1988-01-01

    Recent advances in lens design have pushed optical lithography well into the submicron domain which was once considered to belong to X-ray or E-beam lithography. Realisation of submicron design rules of a 1 Mbit memory has been possible at PHILIPS using an i-line lens (Zeiss 10-78-48) incorporated in internally developed stepper (Sire-3) using a single layer resist technology. This paper will give a schematic description of the stepper and describe the lens characteristics of the two in house systems. The stability of the steppers will be illustrated by means of system parameters which were monitored during a prolonged period. The resist process was characterised on accelerated pathfinder lots which were used to detect lithography related problems in an earlier phase and to determine machine and process latitudes. The results of this characterisation and implementation activity will be reported. Special attention was given to focus determination which proved to be very critical due to the lens characteristics and large chip-size. Finally the results obtained on the 1M SRAM device with 0.7 ium minimum geometry will be presented. Based on this work it appears that with proper planarization procedures for minimizing the topography problems, a 0.7 μm design rule is practical using single layer resist on this stepper.

  19. SP-100 advanced radiator designs for thermoelectric and Stirling applications

    NASA Technical Reports Server (NTRS)

    Moriarty, M. P.; Determan, W. R.

    1989-01-01

    Advanced radiator designs employing carbon-carbon liquid metal heat pipe technology, which significantly reduce the mass of the heat rejection subsystem for high temperature space technology systems such as the SP-100 are discussed. This technology is being developed to address the need for lightweight heat transfer components and structures for space applications. Heat pipe and subsystem designs were optimized for thermoelectric- and Stirling-engine-based SP-100 system designs. A multiple, deployed-petal radiator concept was selected for the heat rejection subsystem design as it provided minimum mass. Radiator stowage in the space transportation system cargo bay and deployment schemes were investigated for each of the optimized designs.

  20. Advanced stress analysis methods applicable to turbine engine structures

    NASA Technical Reports Server (NTRS)

    Pian, Theodore H. H.

    1991-01-01

    The following tasks on the study of advanced stress analysis methods applicable to turbine engine structures are described: (1) constructions of special elements which contain traction-free circular boundaries; (2) formulation of new version of mixed variational principles and new version of hybrid stress elements; (3) establishment of methods for suppression of kinematic deformation modes; (4) construction of semiLoof plate and shell elements by assumed stress hybrid method; and (5) elastic-plastic analysis by viscoplasticity theory using the mechanical subelement model.

  1. Advancing Risk Assessment through the Application of Systems Toxicology.

    PubMed

    Sauer, John Michael; Kleensang, André; Peitsch, Manuel C; Hayes, A Wallace

    2016-01-01

    Risk assessment is the process of quantifying the probability of a harmful effect to individuals or populations from human activities. Mechanistic approaches to risk assessment have been generally referred to as systems toxicology. Systems toxicology makes use of advanced analytical and computational tools to integrate classical toxicology and quantitative analysis of large networks of molecular and functional changes occurring across multiple levels of biological organization. Three presentations including two case studies involving both in vitro and in vivo approaches described the current state of systems toxicology and the potential for its future application in chemical risk assessment. PMID:26977253

  2. Application of advanced coating techniques to rocket engine components

    NASA Technical Reports Server (NTRS)

    Verma, S. K.

    1988-01-01

    The materials problem in the space shuttle main engine (SSME) is reviewed. Potential coatings and the method of their application for improved life of SSME components are discussed. A number of advanced coatings for turbine blade components and disks are being developed and tested in a multispecimen thermal fatigue fluidized bed facility at IIT Research Institute. This facility is capable of producing severe strains of the degree present in blades and disk components of the SSME. The potential coating systems and current efforts at IITRI being taken for life extension of the SSME components are summarized.

  3. Application of advanced technology to future long-range aircraft

    NASA Technical Reports Server (NTRS)

    Schrader, O. E.

    1976-01-01

    An assessment is presented of three separate programs that have incorporated advanced technology into the design of long-range passenger and cargo aircraft. The first technology centers around the use of a span-loaded cargo aircraft with the payload distributed along the wing. The second technology is the application of laminar flow control to the aircraft to reduce the aerodynamic drag. The last program evaluates the production of alternate aircraft fuels from coal and the use of liquid hydrogen as an aircraft fuel.

  4. Transcranial Doppler: Techniques and advanced applications: Part 2

    PubMed Central

    Sharma, Arvind K.; Bathala, Lokesh; Batra, Amit; Mehndiratta, Man Mohan; Sharma, Vijay K.

    2016-01-01

    Transcranial Doppler (TCD) is the only diagnostic tool that can provide continuous information about cerebral hemodynamics in real time and over extended periods. In the previous paper (Part 1), we have already presented the basic ultrasound physics pertaining to TCD, insonation methods, and various flow patterns. This article describes various advanced applications of TCD such as detection of right-to-left shunt, emboli monitoring, vasomotor reactivity (VMR), monitoring of vasospasm in subarachnoid hemorrhage (SAH), monitoring of intracranial pressure, its role in stoke prevention in sickle cell disease, and as a supplementary test for confirmation of brain death. PMID:27011639

  5. Advancing Risk Assessment through the Application of Systems Toxicology

    PubMed Central

    Sauer, John Michael; Kleensang, André; Peitsch, Manuel C.; Hayes, A. Wallace

    2016-01-01

    Risk assessment is the process of quantifying the probability of a harmful effect to individuals or populations from human activities. Mechanistic approaches to risk assessment have been generally referred to as systems toxicology. Systems toxicology makes use of advanced analytical and computational tools to integrate classical toxicology and quantitative analysis of large networks of molecular and functional changes occurring across multiple levels of biological organization. Three presentations including two case studies involving both in vitro and in vivo approaches described the current state of systems toxicology and the potential for its future application in chemical risk assessment. PMID:26977253

  6. Transcranial Doppler: Techniques and advanced applications: Part 2.

    PubMed

    Sharma, Arvind K; Bathala, Lokesh; Batra, Amit; Mehndiratta, Man Mohan; Sharma, Vijay K

    2016-01-01

    Transcranial Doppler (TCD) is the only diagnostic tool that can provide continuous information about cerebral hemodynamics in real time and over extended periods. In the previous paper (Part 1), we have already presented the basic ultrasound physics pertaining to TCD, insonation methods, and various flow patterns. This article describes various advanced applications of TCD such as detection of right-to-left shunt, emboli monitoring, vasomotor reactivity (VMR), monitoring of vasospasm in subarachnoid hemorrhage (SAH), monitoring of intracranial pressure, its role in stoke prevention in sickle cell disease, and as a supplementary test for confirmation of brain death. PMID:27011639

  7. Applications of advanced transport aircraft in developing countries

    NASA Technical Reports Server (NTRS)

    Gobetz, F. W.; Assarabowski, R. J.; Leshane, A. A.

    1978-01-01

    Four representative market scenarios were studied to evaluate the relative performance of air-and surface-based transportation systems in meeting the needs of two developing contries, Brazil and Indonesia, which were selected for detailed case studies. The market scenarios were: remote mining, low-density transport, tropical forestry, and large cargo aircraft serving processing centers in resource-rich, remote areas. The long-term potential of various aircraft types, together with fleet requirements and necessary technology advances, is determined for each application.

  8. Nanoscale biomaterial interface modification for advanced tissue engineering applications

    NASA Astrophysics Data System (ADS)

    Safonov, V.; Zykova, A.; Smolik, J.; Rogovska, R.; Donkov, N.; Goltsev, A.; Dubrava, T.; Rassokha, I.; Georgieva, V.

    2012-03-01

    Recently, various stem cells, including mesenchymal stem cells (MSCs), have been found to have considerable potential for application in tissue engineering and future advanced therapies due to their biological capability to differentiate into specific lineages. Modified surface properties, such as composition, nano-roughness and wettability, affect the most important processes at the biomaterial interface. The aim of the present is work is to study the stem cells' (MSCs) adhesive potential, morphology, phenotypical characteristics in in vitro tests, and to distinguish betwen the different factors influencing the cell/biomaterial interaction, such as nano-topography, surface chemistry and surface free energy.

  9. Advanced Developments in Cyclic Polymers: Synthesis, Applications, and Perspectives

    PubMed Central

    Zhu, Yinghuai; Hosmane, Narayan S

    2015-01-01

    Due to the topological effect, cyclic polymers demonstrate different and unique physical and biological properties in comparison with linear counterparts having the same molecular-weight range. With advanced synthetic and analytic technologies, cyclic polymers with different topologies, e.g. multicyclic polymers, have been reported and well characterized. For example, various cyclic DNA and related structures, such as cyclic duplexes, have been prepared conveniently by click chemistry. These types of DNA have increased resistance to enzymatic degradation and have high thermodynamic stability, and thus, have potential therapeutic applications. In addition, cyclic polymers have also been used to prepare organic–inorganic hybrids for applications in catalysis, e.g. catalyst supports. Due to developments in synthetic technology, highly pure cyclic polymers could now be produced in large scale. Therefore, we anticipate discovering more applications in the near future. Despite their promise, cyclic polymers are still less explored than linear polymers like polyolefins and polycarbonates, which are widely used in daily life. Some critical issues, including controlling the molecular weight and finding suitable applications, remain big challenges in the cyclic-polymer field. This review briefly summarizes the commonly used synthetic methodologies and focuses more on the attractive functional materials and their biological properties and potential applications. PMID:26478835

  10. Recent Advances in Application of Biosensors in Tissue Engineering

    PubMed Central

    Paul, Arghya; Lee, Yong-kyu; Jaffa, Ayad A.

    2014-01-01

    Biosensors research is a fast growing field in which tens of thousands of papers have been published over the years, and the industry is now worth billions of dollars. The biosensor products have found their applications in numerous industries including food and beverages, agricultural, environmental, medical diagnostics, and pharmaceutical industries and many more. Even though numerous biosensors have been developed for detection of proteins, peptides, enzymes, and numerous other biomolecules for diverse applications, their applications in tissue engineering have remained limited. In recent years, there has been a growing interest in application of novel biosensors in cell culture and tissue engineering, for example, real-time detection of small molecules such as glucose, lactose, and H2O2 as well as serum proteins of large molecular size, such as albumin and alpha-fetoprotein, and inflammatory cytokines, such as IFN-g and TNF-α. In this review, we provide an overview of the recent advancements in biosensors for tissue engineering applications. PMID:25165697

  11. Recent advances in application of biosensors in tissue engineering.

    PubMed

    Hasan, Anwarul; Nurunnabi, Md; Morshed, Mahboob; Paul, Arghya; Polini, Alessandro; Kuila, Tapas; Al Hariri, Moustafa; Lee, Yong-kyu; Jaffa, Ayad A

    2014-01-01

    Biosensors research is a fast growing field in which tens of thousands of papers have been published over the years, and the industry is now worth billions of dollars. The biosensor products have found their applications in numerous industries including food and beverages, agricultural, environmental, medical diagnostics, and pharmaceutical industries and many more. Even though numerous biosensors have been developed for detection of proteins, peptides, enzymes, and numerous other biomolecules for diverse applications, their applications in tissue engineering have remained limited. In recent years, there has been a growing interest in application of novel biosensors in cell culture and tissue engineering, for example, real-time detection of small molecules such as glucose, lactose, and H2O2 as well as serum proteins of large molecular size, such as albumin and alpha-fetoprotein, and inflammatory cytokines, such as IFN-g and TNF-α. In this review, we provide an overview of the recent advancements in biosensors for tissue engineering applications. PMID:25165697

  12. Application of NASA's advanced life support technologies in polar regions

    NASA Astrophysics Data System (ADS)

    Bubenheim, D. L.; Lewis, C.

    1997-01-01

    NASA's advanced life support technologies are being combined with Arctic science and engineering knowledge in the Advanced Life Systems for Extreme Environments (ALSEE) project. This project addresses treatment and reduction of waste, purification and recycling of water, and production of food in remote communities of Alaska. The project focus is a major issue in the state of Alaska and other areas of the Circumpolar North; the health and welfare of people, their lives and the subsistence lifestyle in remote communities, care for the environment, and economic opportunity through technology transfer. The challenge is to implement the technologies in a manner compatible with the social and economic structures of native communities, the state, and the commercial sector. NASA goals are technology selection, system design and methods development of regenerative life support systems for planetary and Lunar bases and other space exploration missions. The ALSEE project will provide similar advanced technologies to address the multiple problems facing the remote communities of Alaska and provide an extreme environment testbed for future space applications. These technologies have never been assembled for this purpose. They offer an integrated approach to solving pressing problems in remote communities.

  13. Advanced Embedded Active Assemblies for Extreme Space Applications

    NASA Technical Reports Server (NTRS)

    DelCastillo, Linda; Moussessian, Alina; Mojarradi, Mohammad; Kolawa, Elizabeth

    2009-01-01

    This work describes the development and evaluation of advanced technologies for the integration of electronic die within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible liquid crystal polymer (LCP), using gold thermo-compression flip chip bonding, and embedding them within the material. Daisy chain LCP assemblies were thermal cycled from -135 to +85degC (Mars surface conditions for motor control electronics). The LCP assembly method was further utilized to embed an operational amplifier designed for operation within the Mars surface ambient. The embedded op-amp assembly was evaluated with respect to the influence of temperature on the operational characteristics of the device. Applications for this technology range from multifunctional, large area, flexible membrane structures to small-scale, flexible circuits that can be fit into tight spaces for flex to fit applications.

  14. Advanced Electric Submersible Pump Design Tool for Geothermal Applications

    SciTech Connect

    Xuele Qi; Norman Turnquist; Farshad Ghasripoor

    2012-05-31

    Electrical Submersible Pumps (ESPs) present higher efficiency, larger production rate, and can be operated in deeper wells than the other geothermal artificial lifting systems. Enhanced Geothermal Systems (EGS) applications recommend lifting 300 C geothermal water at 80kg/s flow rate in a maximum 10-5/8-inch diameter wellbore to improve the cost-effectiveness. In this paper, an advanced ESP design tool comprising a 1D theoretical model and a 3D CFD analysis has been developed to design ESPs for geothermal applications. Design of Experiments was also performed to optimize the geometry and performance. The designed mixed-flow type centrifugal impeller and diffuser exhibit high efficiency and head rise under simulated EGS conditions. The design tool has been validated by comparing the prediction to experimental data of an existing ESP product.

  15. Red Fluorescent Proteins: Advanced Imaging Applications and Future Design

    PubMed Central

    Shcherbakova, Daria M.; Subach, Oksana M.; Verkhusha, Vladislav V.

    2015-01-01

    In the past few years a large series of the advanced red-shifted fluorescent proteins (RFPs) has been developed. These enhanced RFPs provide new possibilities to study biological processes at the levels ranging from single molecules to whole organisms. Herein the relationship between the properties of the RFPs of different phenotypes and their applications to various imaging techniques are described. Existing and emerging imaging approaches are discussed for conventional RFPs, far-red FPs, RFPs with a large Stokes shift, fluorescent timers, irreversibly photoactivatable and reversibly photo-switchable RFPs. Advantages and limitations of specific RFPs for each technique are presented. Recent progress in understanding the chemical transformations of red chromophores allows the future RFP phenotypes and their respective novel imaging applications to be foreseen. PMID:22851529

  16. Feasibility of Air Levitated Surface Stage for Lithography Tool

    NASA Astrophysics Data System (ADS)

    Tanaka, Keiichi

    The application of light-weight drive technology into the lithography stage has been the current state of art because of minimization of power loss. The purpose of this article is to point out the so-called, "surface stage" which is composed of Lorentz forced 3 DOF (Degree Of Freedom) planar motor (x, y and theta z), air levitation (bearing) system and motor cooling system, is the most balanced concept for the next generation lithography through the verification of each component by manufacturing simple parts and test stand. This paper presents the design method and procedure, and experimental results of the air levitated surface stage which was conducted several years ago, however the author is convinced that the results are enough to adapt various developments of precision machining tool.

  17. Optimized antireflective silicon nanostructure arrays using nanosphere lithography

    NASA Astrophysics Data System (ADS)

    Lee, Dohaeng; Bae, Jiwoong; Hong, Soonwook; Yang, Hwichul; Kim, Young-Beom

    2016-05-01

    Broadband optical antireflective arrays of sub-wavelength structures were fabricated on silicon substrates using colloidal nanosphere lithography in conjunction with reactive ion etching. The morphology of the nanostructures, including the shape, base diameter and height, was precisely controlled by modifying the conventional process of nanosphere lithography. We investigated their effects on the optical characteristics based on experimentally measured reflectance performance. The Si nanostructure arrays demonstrated optical antireflection performance with an average reflectance of about 1% across the spectral range from 300 to 800 nm, i.e. near-ultraviolet to visible wavelengths. This fabrication method can be used to create a large surface area and offers a promising approach for antireflective applications.

  18. Optimized antireflective silicon nanostructure arrays using nanosphere lithography.

    PubMed

    Lee, Dohaeng; Bae, Jiwoong; Hong, Soonwook; Yang, Hwichul; Kim, Young-Beom

    2016-05-27

    Broadband optical antireflective arrays of sub-wavelength structures were fabricated on silicon substrates using colloidal nanosphere lithography in conjunction with reactive ion etching. The morphology of the nanostructures, including the shape, base diameter and height, was precisely controlled by modifying the conventional process of nanosphere lithography. We investigated their effects on the optical characteristics based on experimentally measured reflectance performance. The Si nanostructure arrays demonstrated optical antireflection performance with an average reflectance of about 1% across the spectral range from 300 to 800 nm, i.e. near-ultraviolet to visible wavelengths. This fabrication method can be used to create a large surface area and offers a promising approach for antireflective applications. PMID:27087196

  19. Intelligent Facial Recognition Systems: Technology advancements for security applications

    SciTech Connect

    Beer, C.L.

    1993-07-01

    Insider problems such as theft and sabotage can occur within the security and surveillance realm of operations when unauthorized people obtain access to sensitive areas. A possible solution to these problems is a means to identify individuals (not just credentials or badges) in a given sensitive area and provide full time personnel accountability. One approach desirable at Department of Energy facilities for access control and/or personnel identification is an Intelligent Facial Recognition System (IFRS) that is non-invasive to personnel. Automatic facial recognition does not require the active participation of the enrolled subjects, unlike most other biological measurement (biometric) systems (e.g., fingerprint, hand geometry, or eye retinal scan systems). It is this feature that makes an IFRS attractive for applications other than access control such as emergency evacuation verification, screening, and personnel tracking. This paper discusses current technology that shows promising results for DOE and other security applications. A survey of research and development in facial recognition identified several companies and universities that were interested and/or involved in the area. A few advanced prototype systems were also identified. Sandia National Laboratories is currently evaluating facial recognition systems that are in the advanced prototype stage. The initial application for the evaluation is access control in a controlled environment with a constant background and with cooperative subjects. Further evaluations will be conducted in a less controlled environment, which may include a cluttered background and subjects that are not looking towards the camera. The outcome of the evaluations will help identify areas of facial recognition systems that need further development and will help to determine the effectiveness of the current systems for security applications.

  20. Optimization of X-ray sources from a high-average-power ND:Glass laser-produced plasma for proximity lithography

    SciTech Connect

    Celliers, P.; Da Silva, L.B.; Dane, C.B.

    1996-06-01

    The concept of a laser-based proximity lithography system for electronic microcircuit production has advanced to the point where a detailed design of a prototype system capable of exposing wafers at 40 wafer levels per hr is technically feasible with high-average-power laser technology. In proximity x-ray lithography, a photoresist composed of polymethyl- methacrylate (PMMA) or similar material is exposed to x rays transmitted through a mask placed near the photoresist, a procedure which is similar to making a photographic contact print. The mask contains a pattern of opaque metal features, with line widths as small as 0.12 {mu}m, placed on a thin (1-{mu}m thick) Si membrane. During the exposure, the shadow of the mask projected onto the resist produces in the physical and chemical properties of the resist a pattern of variation with the same size and shape as the features contained in the metal mask. This pattern can be further processed to produce microscopic structures in the Si substrate. The main application envisioned for this technology is the production of electronic microcircuits with spatial features significantly smaller than currently achievable with conventional optical lithographic techniques (0.12 {micro}m vs 0.25 {micro}m). This article describes work on optimizing a laser-produced plasma x-ray source intended for microcircuit production by proximity lithography.

  1. Smartphone sensors for stone lithography authentication.

    PubMed

    Spagnolo, Giuseppe Schirripa; Cozzella, Lorenzo; Papalillo, Donato

    2014-01-01

    Nowadays mobile phones include quality photo and video cameras, access to wireless networks and the internet, GPS assistance and other innovative systems. These facilities open them to innovative uses, other than the classical telephonic communication one. Smartphones are a more sophisticated version of classic mobile phones, which have advanced computing power, memory and connectivity. Because fake lithographs are flooding the art market, in this work, we propose a smartphone as simple, robust and efficient sensor for lithograph authentication. When we buy an artwork object, the seller issues a certificate of authenticity, which contains specific details about the artwork itself. Unscrupulous sellers can duplicate the classic certificates of authenticity, and then use them to "authenticate" non-genuine works of art. In this way, the buyer will have a copy of an original certificate to attest that the "not original artwork" is an original one. A solution for this problem would be to insert a system that links together the certificate and the related specific artwork. To do this it is necessary, for a single artwork, to find unique, unrepeatable, and unchangeable characteristics. In this article we propose an innovative method for the authentication of stone lithographs. We use the color spots distribution captured by means of a smartphone camera as a non-cloneable texture of the specific artworks and an information management system for verifying it in mobility stone lithography. PMID:24811077

  2. Smartphone Sensors for Stone Lithography Authentication

    PubMed Central

    Schirripa Spagnolo, Giuseppe; Cozzella, Lorenzo; Papalillo, Donato

    2014-01-01

    Nowadays mobile phones include quality photo and video cameras, access to wireless networks and the internet, GPS assistance and other innovative systems. These facilities open them to innovative uses, other than the classical telephonic communication one. Smartphones are a more sophisticated version of classic mobile phones, which have advanced computing power, memory and connectivity. Because fake lithographs are flooding the art market, in this work, we propose a smartphone as simple, robust and efficient sensor for lithograph authentication. When we buy an artwork object, the seller issues a certificate of authenticity, which contains specific details about the artwork itself. Unscrupulous sellers can duplicate the classic certificates of authenticity, and then use them to “authenticate” non-genuine works of art. In this way, the buyer will have a copy of an original certificate to attest that the “not original artwork” is an original one. A solution for this problem would be to insert a system that links together the certificate and the related specific artwork. To do this it is necessary, for a single artwork, to find unique, unrepeatable, and unchangeable characteristics. In this article we propose an innovative method for the authentication of stone lithographs. We use the color spots distribution captured by means of a smartphone camera as a non-cloneable texture of the specific artworks and an information management system for verifying it in mobility stone lithography. PMID:24811077

  3. Fabricating Blazed Diffraction Gratings by X-Ray Lithography

    NASA Technical Reports Server (NTRS)

    Mouroulis, Pantazis; Hartley, Frank; Wilson, Daniel

    2004-01-01

    Gray-scale x-ray lithography is undergoing development as a technique for fabricating blazed diffraction gratings. As such, gray-scale x-ray lithography now complements such other grating-fabrication techniques as mechanical ruling, holography, ion etching, laser ablation, laser writing, and electron-beam lithography. Each of these techniques offers advantages and disadvantages for implementing specific grating designs; no single one of these techniques can satisfy the design requirements for all applications. Gray-scale x-ray lithography is expected to be advantageous for making gratings on steeper substrates than those that can be made by electron-beam lithography. This technique is not limited to sawtooth groove profiles and flat substrates: various groove profiles can be generated on arbitrarily shaped (including highly curved) substrates with the same ease as sawtooth profiles can be generated on flat substrates. Moreover, the gratings fabricated by this technique can be made free of ghosts (spurious diffraction components attributable to small spurious periodicities in the locations of grooves). The first step in gray-scale x-ray lithography is to conformally coat a substrate with a suitable photoresist. An x-ray mask (see Figure 1) is generated, placed between the substrate and a source of collimated x-rays, and scanned over the substrate so as to create a spatial modulation in the exposure of the photoresist. Development of the exposed photoresist results in a surface corrugation that corresponds to the spatial modulation and that defines the grating surface. The grating pattern is generated by scanning an appropriately shaped x-ray area mask along the substrate. The mask example of Figure 1 would generate a blazed grating profile when scanned in the perpendicular direction at constant speed, assuming the photoresist responds linearly to incident radiation. If the resist response is nonlinear, then the mask shape can be modified to account for the

  4. Miniature electron microscopes for lithography

    NASA Astrophysics Data System (ADS)

    Feinerman, Alan D.; Crewe, David A.; Perng, Dung-Ching; Spindt, Capp A.; Schwoebel, Paul R.; Crewe, Albert V.

    1994-05-01

    Two inexpensive and extremely accurate methods for fabricating miniature 10 - 50 kV and 0.5 - 10 kV electron beam columns have been developed: `slicing,' and `stacking.' Two or three miniature columns could be used to perform a 20 nm or better alignment of an x-ray mask to a substrate. An array of miniature columns could be used for rapid wafer inspection and high throughput electron beam lithography. The column fabrication methods combine the precision of semiconductor processing and fiber optic technologies to create macroscopic structures consisting of charged particle sources, deflecting and focusing electrodes, and detectors. The overall performance of the miniature column also depends on the emission characteristics of the micromachined electron source which is currently being investigated.

  5. Microwave processing of silicon nitride for advanced gas turbine applications

    SciTech Connect

    Tiegs, T.N.; Kiggans, J.O.

    1993-04-01

    Results from previous studies on microwave processing of silicon nitride-based ceramics are reviewed to ascertain the application of this technology to advanced gas turbine (AGT) materials. Areas of microwave processing that have been examined in the past are (1) sintering of powder compacts; (2) heat treatment of dense materials; and (3) nitridation of Si for reactionbonded silicon nitride. The sintering of Si{sub 3}N{sub 4} powder compacts showed improved densification and enhanced grain growth. However, the high additive levels required to produce crack-free parts generally limit these materials to low temperature applications. Improved high-temperature creep resistance has been observed for microwave heat-treated materials and therefore has application to materials used in highly demanding service conditions. In contrast to Si{sub 3}N{sub 4}, Si couples well in the microwave and sintered reaction-bonded silicon nitride materials have been fabricated in a one-step process with cost-effective raw materials. However, these materials are also limited to lower temperature applications, under about 1000{degrees}C.

  6. Microwave processing of silicon nitride for advanced gas turbine applications

    SciTech Connect

    Tiegs, T.N.; Kiggans, J.O.

    1993-01-01

    Results from previous studies on microwave processing of silicon nitride-based ceramics are reviewed to ascertain the application of this technology to advanced gas turbine (AGT) materials. Areas of microwave processing that have been examined in the past are (1) sintering of powder compacts; (2) heat treatment of dense materials; and (3) nitridation of Si for reactionbonded silicon nitride. The sintering of Si[sub 3]N[sub 4] powder compacts showed improved densification and enhanced grain growth. However, the high additive levels required to produce crack-free parts generally limit these materials to low temperature applications. Improved high-temperature creep resistance has been observed for microwave heat-treated materials and therefore has application to materials used in highly demanding service conditions. In contrast to Si[sub 3]N[sub 4], Si couples well in the microwave and sintered reaction-bonded silicon nitride materials have been fabricated in a one-step process with cost-effective raw materials. However, these materials are also limited to lower temperature applications, under about 1000[degrees]C.

  7. Advances and applications of molecular cloning in clinical microbiology.

    PubMed

    Sharma, Kamal; Mishra, Ajay Kumar; Mehraj, Vikram; Duraisamy, Ganesh Selvaraj

    2014-10-01

    Molecular cloning is based on isolation of a DNA sequence of interest to obtain multiple copies of it in vitro. Application of this technique has become an increasingly important tool in clinical microbiology due to its simplicity, cost effectiveness, rapidity, and reliability. This review entails the recent advances in molecular cloning and its application in the clinical microbiology in the context of polymicrobial infections, recombinant antigens, recombinant vaccines, diagnostic probes, antimicrobial peptides, and recombinant cytokines. Culture-based methods in polymicrobial infection have many limitation, which has been overcome by cloning techniques and provide gold standard technique. Recombinant antigens produced by cloning technique are now being used for screening of HIV, HCV, HBV, CMV, Treponema pallidum, and other clinical infectious agents. Recombinant vaccines for hepatitis B, cholera, influenza A, and other diseases also use recombinant antigens which have replaced the use of live vaccines and thus reduce the risk for adverse effects. Gene probes developed by gene cloning have many applications including in early diagnosis of hereditary diseases, forensic investigations, and routine diagnosis. Industrial application of this technology produces new antibiotics in the form of antimicrobial peptides and recombinant cytokines that can be used as therapeutic agents. PMID:25023463

  8. Advanced Ceramic Matrix Composites (CMCs) for High Temperature Applications

    NASA Technical Reports Server (NTRS)

    Singh, M.

    2005-01-01

    Advanced ceramic matrix composites (CMCs) are enabling materials for a number of demanding applications in aerospace, energy, and nuclear industries. In the aerospace systems, these materials are being considered for applications in hot sections of jet engines such as the combustor liner, vanes, nozzle components, nose cones, leading edges of reentry vehicles, and space propulsion components. Applications in the energy and environmental industries include radiant heater tubes, heat exchangers, heat recuperators, gas and diesel particulate filters, and components for land based turbines for power generation. These materials are also being considered for use in the first wall and blanket components of fusion reactors. In the last few years, a number of CMC components have been developed and successfully tested for various aerospace and ground based applications. However, a number of challenges still remain slowing the wide scale implementation of these materials. They include robust fabrication and manufacturing, assembly and integration, coatings, property modeling and life prediction, design codes and databases, repair and refurbishment, and cost. Fabrication of net and complex shape components with high density and tailorable matrix properties is quite expensive, and even then various desirable properties are not achievable. In this presentation, a number of examples of successful CMC component development and testing will be provided. In addition, critical need for robust manufacturing, joining and assembly technologies in successful implementation of these systems will be discussed.

  9. Large area direct-write focused ion-beam lithography with dual-beam microscope.

    SciTech Connect

    Imre-Joshi, A.; Ocola, L. E.; Rich, L.; Klingfus, J.

    2010-03-01

    The authors have investigated the performance of focused ion-beam (FIB) direct-write lithography for large area (multiple write-field) patterning in an FEI Nova Nanolab 600 dual-beam microscope. Their system is configured with a 100 nm resolution X-Y stage and a RAITH ELPHY LITHOGRAPHY control interface, with its own integrated 16 bit DAC pattern generator and software. Key issues with regard to configuration, process parameters, and procedures have been addressed. Characterization of stitching errors, pattern repeatability, and drift were performed. Offset lithography (multiple exposures with offset write fields) and in-field registration marks were evaluated for correcting stitching errors, and a test microfluidic device covering an area of 1 x 1.4 mm{sup 2} was successfully fabricated. The authors found that by using a combination of offset lithography and in-field registration mark correction methods, the stitching errors can be kept well below 100 nm. They also found that due to higher beam deflection speed provided by the electrostatic scanning in FIB systems versus the wide-spread electron-beam systems with electromagnetic scanning, FIB lithography can be just as fast as electron-beam lithography for typical mill depths down to about 200-500 nm (material dependent). This opens the door for a large suite of applications for materials where pattern transfer is difficult or impossible by reactive methods.

  10. Advanced carbon manufacturing for energy and biological applications

    NASA Astrophysics Data System (ADS)

    Turon Teixidor, Genis

    The science of miniaturization has experienced revolutionary advances during the last decades, witnessing the development of the Integrated Circuit and the emergence of MEMS and Nanotechnology. Particularly, MEMS technology has pioneered the use of non-traditional materials in microfabrication by including polymers, ceramics and composites to the well known list of metals and semiconductors. One of the latest additions to this set of materials is carbon, which represents a very important inclusion given its significance in electrochemical energy conversion systems and in applications where it is used as sensor probe material. For these applications, carbon is optimal in several counts: It has a wide electrochemical stability window, good electrical and thermal conductivity, high corrosion resistance and mechanical stability, and is available in high purity at a low cost. Furthermore carbon is biocompatible. This thesis presents several microfabricated devices that take advantage of these properties. The thesis has two clearly differentiated parts. In the first one, applications of micromachined carbon in the field of energy conversion and energy storage are presented. These applications include lithium ion micro batteries and the development of new carbon electrodes with fractal geometries. In the second part, the focus shifts to biological applications. First, the study of the interaction of living cells with micromachined carbon is presented, followed by the description of a sensor based on interdigitated nano-electrode arrays, and finally the development of the new instrumentation needed to address arrays of carbon electrodes, a multiplexed potentiostat. The underlying theme that connects all these seemingly different topics is the use of carbon microfabrication techniques in electrochemical systems.

  11. Limiting factors to advancing thermal battery technology for naval applications

    NASA Astrophysics Data System (ADS)

    Davis, Patrick B.; Winchester, Clinton S.

    1991-10-01

    Thermal batteries are primary reserve electrochemical power sources using molten salt electrolyte which experience little effective aging while in storage or dormant deployment. Thermal batteries are primarily used in military applications, and are currently used in a wide variety of Navy devices such as missiles, torpedoes, decays, and training targets, usually as power supplies in guidance, propulsion, and Safe/Arm applications. Technology developments have increased the available energy and power density ratings by an order of magnitude in the last ten years. Present thermal batteries, using lithium anodes and metal sulfide cathodes, are capable of performing applications where only less rugged and more expensive silver oxide/zinc or silver/magnesium chloride seawater batteries could serve previously. Additionally, these batteries are capable of supplanting lithium/thionyl chloride reserve batteries in a variety of specifically optimized designs. Increases in thermal battery energy and power density capabilities are not projected to continue with the current available technology. Several battery designs are now at the edge of feasibility and safety. Since future naval systems are likely to require continued growth of battery energy and power densities, there must be significant advances in battery technology. Specifically, anode alloy composition and new cathode materials must be investigated to allow for safe development and deployment of these high power, higher energy density batteries.

  12. Applications of advanced oxidation processes: present and future.

    PubMed

    Suty, H; De Traversay, C; Cost, M

    2004-01-01

    The use of advanced oxidation processes (AOPs) to remove pollutants in various water treatment applications has been the subject of study for around 30 years. Most of the available processes (Fenton reagent, O3 under basic conditions, O3/H2O2, O3/UV, O3/solid catalyst, H2O2/M(n+), H2O2/UV, photo-assisted Fenton, H2O2/solid catalyst, H2O2/NaClO, TiO2/UV etc.) have been investigated in depth and a considerable body of knowledge has been built up about the reactivity of many pollutants. Various industrial applications have been developed, including ones for ground remediation (TCE, PCE), the removal of pesticides from drinking water, the removal of formaldehyde and phenol from industrial waste water and a reduction in COD from industrial waste water. The development of such AOP applications has been stimulated by increasingly stringent regulations, the pollution of water resources through agricultural and industrial activities and the requirement that industry meet effluent discharge standards. Nevertheless, it is difficult to obtain an accurate picture of the use of AOPs and its exact position in the range of water treatment processes has not been determined to date. The purpose of this overview is to discuss those processes and provide an indication of future trends. PMID:15077976

  13. Inorganic immersion fluids for ultrahigh numerical aperture 193 nm lithography

    NASA Astrophysics Data System (ADS)

    Zhou, Jianming; Fan, Yongfa; Bourov, Anatoly; Smith, Bruce W.

    2006-05-01

    Immersion lithography has become attractive since it can reduce critical dimensions by increasing numerical aperture (NA) beyond unity. Among all the candidates for immersion fluids, those with higher refractive indices and low absorbance are desired. Characterization of the refractive indices and absorbance of various inorganic fluid candidates has been performed. To measure the refractive indices of these fluids, a prism deviation angle method was developed. Several candidates have been identified for 193 nm application with refractive indices near 1.55, which is approximately 0.1 higher than that of water at this wavelength. Cauchy parameters of these fluids were generated and approaches were investigated to tailor the fluid absorption edges to be close to 193 nm. The effects of these fluids on photoresist performance were also examined with 193 nm immersion lithography exposure at various NAs. Half-pitch 32 nm lines were obtained with phosphoric acid as the immersion medium at 1.5 NA. These fluids are potential candidates for immersion lithography technology.

  14. Highly Stable Nanolattice Structures using Nonlinear Laser Lithography

    NASA Astrophysics Data System (ADS)

    Yavuz, Ozgun; Tokel, Onur; Ergecen, Emre; Pavlov, Ihor; Makey, Ghaith; Ilday, Fatih Omer

    Periodic nanopatterning is crucial for multiple technologies, including photovoltaics and display technologies. Conventional optical lithography techniques require complex masks, while e-beam and ion-beam lithography require expensive equipment. With the Nonlinear Laser Lithography (NLL) technique, we had recently shown that various surfaces can be covered with extremely periodic nanopatterns with ultrafast lasers through a single-step, maskless and inexpensive method. Here, we expand NLL nanopatterns to flexible materials, and also present a fully predictive model for the formation of NLL nanostructures as confirmed with experiments. In NLL, a nonlocal positive feedback mechanism (dipole scattering) competes with a rate limiting negative feedback mechanism. Here, we show that judicious use of the laser polarisation can constrain the lattice symmetry, while the nonlinearities regulate periodicity. We experimentally demonstrate that in addition to one dimensional periodic stripes, two dimensional lattices can be produced on surfaces. In particular, hexagonal and square lattices were produced, which are highly desired for display technologies. Notably, with this approach, we can tile flexible substrates, which can find applications in next generation display technologies.

  15. 32 nm logic patterning options with immersion lithography

    NASA Astrophysics Data System (ADS)

    Lai, K.; Burns, S.; Halle, S.; Zhuang, L.; Colburn, M.; Allen, S.; Babcock, C.; Baum, Z.; Burkhardt, M.; Dai, V.; Dunn, D.; Geiss, E.; Haffner, H.; Han, G.; Lawson, P.; Mansfield, S.; Meiring, J.; Morgenfeld, B.; Tabery, C.; Zou, Y.; Sarma, C.; Tsou, L.; Yan, W.; Zhuang, H.; Gil, D.; Medeiros, D.

    2008-03-01

    The semiconductor industry faces a lithographic scaling limit as the industry completes the transition to 1.35 NA immersion lithography. Both high-index immersion lithography and EUV lithography are facing technical challenges and commercial timing issues. Consequently, the industry has focused on enabling double patterning technology (DPT) as a means to circumvent the limitations of Rayleigh scaling. Here, the IBM development alliance demonstrate a series of double patterning solutions that enable scaling of logic constructs by decoupling the pattern spatially through mask design or temporally through innovative processes. These techniques have been successfully employed for early 32nm node development using 45nm generation tooling. Four different double patterning techniques were implemented. The first process illustrates local RET optimization through the use of a split reticle design. In this approach, a layout is decomposed into a series of regions with similar imaging properties and the illumination conditions for each are independently optimized. These regions are then printed separately into the same resist film in a multiple exposure process. The result is a singly developed pattern that could not be printed with a single illumination-mask combination. The second approach addresses 2D imaging with particular focus on both line-end dimension and linewidth control [1]. A double exposure-double etch (DE2) approach is used in conjunction with a pitch-filling sacrificial feature strategy. The third double exposure process, optimized for via patterns also utilizes DE2. In this method, a design is split between two separate masks such that the minimum pitch between any two vias is larger than the minimum metal pitch. This allows for final structures with vias at pitches beyond the capability of a single exposure. In the fourth method,, dark field double dipole lithography (DDL) has been successfully applied to BEOL metal structures and has been shown to be

  16. Development of a computational lithography roadmap

    NASA Astrophysics Data System (ADS)

    Chen, J. Fung; Liu, Hua-Yu; Laidig, Thomas; Zuniga, Christian; Cao, Yu; Socha, Robert

    2008-03-01

    While lithography R&D community at large has already gotten the mind set for 32nm, all eyes are on 22nm node. Current consensus is to employ computational lithography to meet wafer CD uniformity (CDU) requirement. Resolution enhancement technologies (RET) and model OPC are the two fundamental components for computational lithography. Today's full-chip CDU specifications are already pushing physical limits at extreme lithography k I factor. While increasingly aggressive RET either by double exposure or double patterning are enabling imaging performance, for CDU control we need ever more accurate OPC at a greater computational efficiency. In this report, we discuss the desire for wanting more robust and accurate OPC models. One important trend is to have predictive OPC models allowing accurate OPC results to be obtained much faster, shortening the qualification process for exposure tools. We investigate several key parameters constitute to accuracy achievable in computational lithography. Such as the choice of image pixel size, numbers of terms needed for transmission cross coefficients (TCC), and "safe" ambit radius for assuring accurate CD prediction. Selections of image pixel size and "safe" ambit radius together determine % utilization for 2D fast Fourier transformation (FFT) for efficient full-chip OPC computation. For IC manufacturing beyond ArF, we made initial observations and estimations on EUV computational lithography. These discussions pave the way for developing a computational lithography roadmap extends to the end of Moore's Law. This computational lithography roadmap aims to be a complement for the current ITRS roadmap on what does it take to achieve CD correction accuracy.

  17. Recent Advances in Infrasound Science for National Security Applications

    NASA Astrophysics Data System (ADS)

    Arrowsmith, S.; Blom, P. S.; Marcillo, O. E.; Whitaker, R. W.

    2014-12-01

    Infrasound is sound below the frequency-threshold of human hearing, covering the frequency range from 0.01 - 20 Hz. Infrasound science studies the generation, propagation, measurement, and analysis of infrasound. Sources of infrasound include a wide variety of energetic natural and manmade phenomena that include chemical and nuclear explosions, rockets and missiles, and aircraft. The dominant factors influencing the propagation of infrasound are the spatial and temporal variations in temperature, wind speed, and wind direction. In recent years, Infrasound Science has experienced a renaissance due to the installation of an international monitoring system of 60 infrasound arrays for monitoring the Comprehensive Nuclear Test Ban Treaty, and to the demonstrated value of regional infrasound networks for both scientific and applied purposes. Furthermore, in the past decade, significant advances have been made on using measurements of infrasound to invert for these properties of the atmosphere at altitudes where alternative measurement techniques are extremely costly. This presentation provides a review of recent advances in infrasound science as relevant to National Security applications.

  18. Advanced materials and biochemical processes for geothermal applications

    SciTech Connect

    Kukacka, L.E.; van Rooyen, D.; Premuzic, E.T.

    1987-04-01

    Two Geothermal Technology Division (GTD)-sponsored programs: (1) Geothermal Materials Development, and (2) Advanced Biochemical Processes for Geothermal Brines, are described. In the former, work in the following tasks is in progress: (1) high temperature elastomeric materials for dynamic sealing applications, (2) advanced high temperature (300/sup 0/C) lightweight (1.1 g/cc) well cementing materials, (3) thermally conductive composites for heat exchanger tubing, (4) corrosion rates for metals in brine-contaminated binary plant working fluids, and (5) elastomeric liners for well casing. Methods for the utilization and/or the low cost environmentally acceptable disposal of toxic geothermal residues are being developed in the second program. This work is performed in two tasks. In one, microorganisms that can interact with toxic metals found in geothermal residues to convert them into soluble species for subsequent reinjection back into the reservoir or to concentrate them for removal by conventional processes are being identified. In the second task, process conditions are being defined for the encapsulation of untreated or partially biochemically treated residues in Portland cement-based formulations and the subsequent utilization of the waste fractions in building materials. Both processing methods yield materials which appear to meet disposal criteria for non-toxic solid waste, and their technical and economic feasibilities have been established.

  19. Advances in nanomedicine towards clinical application in oncology and immunology.

    PubMed

    Herreros, Eduardo; Morales, Sebastián; Cortés, Cristian; Cabaña, Mauricio; Peñaloza, Juan P; Jara, Lilian; Geraldo, Daniela; Otero, Carolina; Fernández-Ramires, Ricardo

    2014-01-01

    Recent advances in nanotechnology and nanobiotechnology have contributed to the development of nanomaterials, able to be used as drug carriers, probes, targets or cytostatic drugs by itself. Nanomedicine is now the leading area in nanotechnology where a large number and types of nanoparticles (NPs) has been developed and several are already in the clinical practice. Chemotherapy is one of the most widely used strategies to treat cancer. Most chemotherapeutic agents have poor solubility, low bioavailability, and are formulated with toxic solvents. NPs have been designed to overcome the lack of specificity of chemotherapeutic agents as well to improve circulation time in blood, taking advantages on tumor cells characteristics. In immunology, recent advances regarding the activation of the innate immune system artificially enhanced by NPs functionalized with immune-stimulators open a new window as novel methods in vaccines. Also, viruses and virus-like particles (VLPs) engineered to stimulate immune response against their similar virus or as molecular platforms for the presentation of foreign epitopes have been described. In this review we focused in the use of different types of NPs in oncology and immunology, pinpointing the main novelties regarding their development and use of nanotechnology in a broad array of applications, ranging from tumor diagnostics, immune-modulation up to cancer therapeutics. PMID:25213311

  20. Application of advanced technology to future long-range aircraft

    NASA Technical Reports Server (NTRS)

    Schrader, O. E.

    1976-01-01

    The objective of this paper is to provide an overview assessment of three separate programs at Langley Research Center that have incorporated advanced technology into the design of long-range passenger and cargo aircraft. The first technology centers around the use of an span-loaded cargo aircraft with the payload distributed along the wing. This concept has the potential for reduced structural weights. The second technology is the application of laminar flow control (LFC) to the aircraft to reduce the aerodynamic drag. The use of LFC can reduce the fuel requirements during long-range cruise. The last program evaluates the production of alternate aircraft fuels from coal and the use of liquid hydrogen as an aircraft fuel. Coal-derived hydrogen as an aircraft fuel offers both the prospect for reduced dependence on petroleum fuels and improved performance for long-range aircraft.

  1. SciDAC Advances and Applications in Computational Beam Dynamics

    SciTech Connect

    Ryne, R.; Abell, D.; Adelmann, A.; Amundson, J.; Bohn, C.; Cary, J.; Colella, P.; Dechow, D.; Decyk, V.; Dragt, A.; Gerber, R.; Habib, S.; Higdon, D.; Katsouleas, T.; Ma, K.-L.; McCorquodale, P.; Mihalcea, D.; Mitchell, C.; Mori, W.; Mottershead, C.T.; Neri, F.; Pogorelov, I.; Qiang, J.; Samulyak, R.; Serafini, D.; Shalf, J.; Siegerist, C.; Spentzouris, P.; Stoltz, P.; Terzic, B.; Venturini, M.; Walstrom, P.

    2005-06-26

    SciDAC has had a major impact on computational beam dynamics and the design of particle accelerators. Particle accelerators--which account for half of the facilities in the DOE Office of Science Facilities for the Future of Science 20 Year Outlook--are crucial for US scientific, industrial, and economic competitiveness. Thanks to SciDAC, accelerator design calculations that were once thought impossible are now carried routinely, and new challenging and important calculations are within reach. SciDAC accelerator modeling codes are being used to get the most science out of existing facilities, to produce optimal designs for future facilities, and to explore advanced accelerator concepts that may hold the key to qualitatively new ways of accelerating charged particle beams. In this poster we present highlights from the SciDAC Accelerator Science and Technology (AST) project Beam Dynamics focus area in regard to algorithm development, software development, and applications.

  2. Joining SI3N4 for Advanced Turbomachinery Applications

    SciTech Connect

    GLASS, S. JILL; LOEHMAN, RONALD E.; HOSKING, F. MICHAEL; STEPHENS JR., JOHN J.; VIANCO, PAUL T.; NEILSEN, MICHAEL K.; WALKER, CHARLES A.; POLLINGER, J.P.; MAHONEY, F.M.; QUILLEN, B.G.

    2000-07-01

    The main objective of this project was to develop reliable, low-cost techniques for joining silicon nitride (Si{sub 3}N{sub 4}) to itself and to metals. For Si{sub 3}N{sub 4} to be widely used in advanced turbomachinery applications, joining techniques must be developed that are reliable, cost-effective, and manufacturable. This project addressed those needs by developing and testing two Si{sub 3}N{sub 4} joining systems; oxynitride glass joining materials and high temperature braze alloys. Extensive measurements were also made of the mechanical properties and oxidation resistance of the braze materials. Finite element models were used to predict the magnitudes and positions of the stresses in the ceramic regions of ceramic-to-metal joints sleeve and butt joints, similar to the geometries used for stator assemblies.

  3. Evaluation of undeveloped rocket engine cycle applications to advanced transportation

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Undeveloped pump-fed, liquid propellant rocket engine cycles were assessed and evaluated for application to Next Manned Transportation System (NMTS) vehicles, which would include the evolving Space Transportation System (STS Evolution), the Personnel Launch System (PLS), and the Advanced Manned Launch System (AMLS). Undeveloped engine cycles selected for further analysis had potential for increased reliability, more maintainability, reduced cost, and improved (or possibly level) performance when compared to the existing SSME and proposed STME engines. The split expander (SX) cycle, the full flow staged combustion (FFSC) cycle, and a hybrid version of the FFSC, which has a LOX expander drive for the LOX pump, were selected for definition and analysis. Technology requirements and issues were identified and analyses of vehicle systems weight deltas using the SX and FFSC cycles in AMLS vehicles were performed. A strawman schedule and cost estimate for FFSC subsystem technology developments and integrated engine system demonstration was also provided.

  4. Advanced materials for high-temperature solid electrolyte applications

    SciTech Connect

    Bates, J.L.; Chick, L.A.; Weber, W.J.; Youngblood, G.E.

    1990-05-01

    Advanced materials for use as electrodes, interconnections, and electrolytes in high-temperature electrochemical applications are under investigation. The air sinterability of La{sub 1-x}Sr{sub x}CrO{sub 3} is highly dependent upon a synergistic relationship between the (La + Sr)/Cr ratio, cation volatility, and second phase formation and transformation. Electrical conductivity in the ZrO{sub 2}--Y{sub 2}O{sub 3}--CeO{sub 2} and ZrO{sub 2}--Y{sub 2}O{sub 3}--TiO{sub 2} systems is highly dependent on composition and atmosphere. The electrochemical processes that occur at the solid-solid-gas interfaces in La(Sr)MnO{sub 3}/ZrO{sub 2}(Y{sub 2}O{sub 3}) have been studied using an unbonded interface cell and impedance spectroscopy. 6 refs., 7 figs.

  5. Experiments applications guide: Advanced Communications Technology Satellite (ACTS)

    NASA Technical Reports Server (NTRS)

    1988-01-01

    This applications guide first surveys the capabilities of the Advanced Communication Technology Satellite (ACTS) system (both the flight and ground segments). This overview is followed by a description of the baseband processor (BBP) and microwave switch matrix (MSM) operating modes. Terminals operating with the baseband processor are referred to as low burst rate (LBR); and those operating with the microwave switch matrix, as high burst rate (HBR). Three very small-aperture terminals (VSATs), LBR-1, LBR-2, and HBR, are described for various ACTS operating modes. Also described is the NASA Lewis link evaluation terminal. A section on ACTS experiment opportunities introduces a wide spectrum of network control, telecommunications, system, and scientific experiments. The performance of the VSATs is discussed in detail. This guide is intended as a catalyst to encourage participation by the telecommunications, business, and science communities in a broad spectrum of experiments.

  6. Development of Advanced Robotic Hand System for space application

    NASA Technical Reports Server (NTRS)

    Machida, Kazuo; Akita, Kenzo; Mikami, Tatsuo; Komada, Satoru

    1994-01-01

    The Advanced Robotic Hand System (ARH) is a precise telerobotics system with a semi dexterous hand for future space application. The ARH will be tested in space as one of the missions of the Engineering Tests Satellite 7 (ETS-7) which will be launched in 1997. The objectives of the ARH development are to evaluate the capability of a possible robot hand for precise and delicate tasks and to validate the related technologies implemented in the system. The ARH is designed to be controlled both from ground as a teleoperation and by locally autonomous control. This paper presents the overall system design and the functional capabilities of the ARH as well as its mission outline as the preliminary design has been completed.

  7. VHF NEMS-CMOS piezoresistive resonators for advanced sensing applications

    NASA Astrophysics Data System (ADS)

    Arcamone, Julien; Dupré, Cécilia; Arndt, Grégory; Colinet, Eric; Hentz, Sébastien; Ollier, Eric; Duraffourg, Laurent

    2014-10-01

    This work reports on top-down nanoelectromechanical resonators, which are among the smallest resonators listed in the literature. To overcome the fact that their electromechanical transduction is intrinsically very challenging due to their very high frequency (100 MHz) and ultimate size (each resonator is a 1.2 μm long, 100 nm wide, 20 nm thick silicon beam with 100 nm long and 30 nm wide piezoresistive lateral nanowire gauges), they have been monolithically integrated with an advanced fully depleted SOI CMOS technology. By advantageously combining the unique benefits of nanomechanics and nanoelectronics, this hybrid NEMS-CMOS device paves the way for novel breakthrough applications, such as NEMS-based mass spectrometry or hybrid NEMS/CMOS logic, which cannot be fully implemented without this association.

  8. Advanced Power Batteries for Renewable Energy Applications 3.09

    SciTech Connect

    Shane, Rodney

    2011-12-01

    This report describes the research that was completed under project title Advanced Power Batteries for Renewable Energy Applications 3.09, Award Number DE-EE0001112. The report details all tasks described in the Statement of Project Objectives (SOPO). The SOPO includes purchasing of test equipment, designing tooling, building cells and batteries, testing all variables and final evaluation of results. The SOPO is included. There were various types of tests performed during the project, such as; gas collection, float current monitoring, initial capacity, high rate partial state of charge (HRPSoC), hybrid pulse power characterization (HPPC), high rate capacity, corrosion, software modeling and solar life cycle tests. The grant covered a period of two years starting October 1, 2009 and ending September 30, 2011.

  9. Ultraviolet Nano Imprint Lithography Using Fluorinated Silicon-Based Resist Materials

    NASA Astrophysics Data System (ADS)

    Takei, Satoshi

    2010-02-01

    Fluorinated silicon-based resist materials have recently been applied as ultraviolet crosslinkable materials for nano imprint lithography. I report and demonstrate the step and flash nano imprint lithography process using the newly fluorinated silicon-based resist materials for next generation technologies. This paper presents progress in the formulation of advanced resist materials design, the development of suitable ultraviolet imprint conditions and etch processes to achieve thin residual resist layers, low volumetric shrinkage of the resist film, and low imprint pressures for defect reduction. High quality imprint images were produced with multiple pattern-structured templates on wafers using these developed fluorinated silicon-based resist materials.

  10. Chemical trimming overcoat: an enhancing composition and process for 193nm lithography

    NASA Astrophysics Data System (ADS)

    Liu, Cong; Rowell, Kevin; Joesten, Lori; Baranowski, Paul; Kaur, Irvinder; Huang, Wanyi; Leonard, JoAnne; Jeong, Hae-Mi; Im, Kwang-Hwyi; Estelle, Tom; Cutler, Charlotte; Pohlers, Gerd; Yin, Wenyan; Fallon, Patricia; Li, Mingqi; Jeon, Hyun; Xu, Cheng Bai; Trefonas, Pete

    2016-03-01

    As the critical dimension of devices is approaching the resolution limit of 193nm photo lithography, multiple patterning processes have been developed to print smaller CD and pitch. Multiple patterning and other advanced lithographic processes often require the formation of isolated features such as lines or posts by direct lithographic printing. The formation of isolated features with an acceptable process window, however, can pose a challenge as a result of poor aerial image contrast at defocus. Herein we report a novel Chemical Trimming Overcoat (CTO) as an extra step after lithography that allows us to achieve smaller feature size and better process window.

  11. Fabrication and application of advanced functional materials from lignincellulosic biomass

    NASA Astrophysics Data System (ADS)

    Hu, Sixiao

    This dissertation explored the conversion of lignocellulosic biomass into advanced functional materials and their potential applications. Lignocellulosic biomass represents an as-of-yet underutilized renewable source for not only biofuel production but also functional materials fabrication. This renewable source is a great alternative for fossil fuel based chemicals, which could be one of the solutions to energy crisis. In this work, it was demonstrated a variety of advanced materials including functional carbons, metal and silica nanoparticles could be derived from lignocellulosic biomass. Chapter 1 provided overall reviewed of the lignin structures, productions and its utilizations as plastics, absorbents and carbons, as well as the preparation of nano-structured silver, silica and silicon carbide/nitride from biomass. Chapter 2, 3 and 4 discussed the fabrication of highly porous carbons from isolated lignin, and their applications as electric supercapacitors for energy storage. In chapter 2, ultrafine porous carbon fibers were prepared via electrospinning followed by simultaneous carbonization and activation. Chapter 3 covered the fabrication of supercapacitor based on the porous carbon fibers and the investigation of their electrochemical performances. In chapter 4, porous carbon particulates with layered carbon nano plates structures were produced by simple oven-drying followed by simultaneous carbonization and activation. The effects of heat processing parameters on the resulting carbon structures and their electrochemical properties were discussed in details. Chapter 5 and 6 addressed the preparation of silver nanoparticles using lignin. Chapter 5 reported the synthesis, underlying kinetics and mechanism of monodispersed silver nanospheres with diameter less than 25 nm in aqueous solutions using lignin as dual reducing and capping agents. Chapter 6 covered the preparation of silver nanoparticles on electrospun celluloses ultrafine fibers using lignin as both

  12. ITRS lithography roadmap: status and challenges

    NASA Astrophysics Data System (ADS)

    Neisser, Mark; Wurm, Stefan

    2012-09-01

    Recent ITRS lithography roadmaps show a big technology decision approaching the semiconductor industry about how to do leading edge lithography. The need is rapidly approaching for the industry to select an option for the 22-nm half pitch, but no decision has been made yet. The main options for the 22-nm half pitch are extreme ultraviolet (EUV), ArF immersion lithography with multiple patterning, and maskless lithography. For the 16-nm half pitch, directed self-assembly (DSA) is also an option. The EUV has the most industry investment and is the closest to current lithography in the way it works but still faces challenges in tool productivity and defect-free masks. The nanoimprint needs to overcome the defect, contamination, and overlay challenges before it can be applied to the semiconductor production. Maskless lithography may be used first for prototyping and small volume products where mask costs per chip produced would be very high. Double patterning could be extended to multiple pattering, but would give tremendous process complexity and exponentially rising mask costs due to the many exposures needed per level. The DSA, which only recently has emerged from the research stage, has the potential for very high resolution but represents a huge change in how critical dimensions are formed and controlled.

  13. Advanced Life Systems for Extreme Environments: An Arctic Application

    NASA Technical Reports Server (NTRS)

    Lewis, Carol E.; Stanford, Kerry L.; Bubenheim, David L.; Covington, Alan (Technical Monitor)

    1995-01-01

    The problems of obtaining adequate pure drinking water and disposing of liquid and solid waste in the U.S. Arctic, a region where virtually all water is frozen solid for much of the year, has led to unsanitary solutions (U.S. Arctic Research Commission). These solutions are also damaging to the environment. Sanitation and a safe water supply are particularly problems in rural villages. About one-fourth of Alaska's 86.000 Native residents live in these communities. They are without running water and use plastic buckets for toilets. The outbreak of diseases is believed to be partially attributable to exposure to human waste. Villages with the most frequent outbreaks of disease are those in which running water is difficult to obtain (Office of Technology Assessment, 1994). Waste is emptied into open lagoons, rivers, or onto the sea coast. It does not degrade rapidly and in addition to affecting human health, can be harmful to the fragile ecology of the Arctic and the indigenous wildlife and fish populations. Advanced Life Systems for Extreme Environments (ALSEE) provides a solution to sanitation and safe water problems. The system uses an advanced integrated technology developed for Antarctic and space applications. ALSEE uses the systems approach to address more than waste and water problems. By incorporating hydroponic horticulture and aquaculture into the waste treatment system, ALSEE addresses the quality and quantity of fresh foods available to Arctic residents. A temperate climate is required for year-round plant growth. ALSEE facilities can be designed to include a climate controlled area within the structure. This type of environment is a change from the long periods of darkness and cold found in the Arctic and can help alleviate stress so often associated with these extremes. While the overall concept of ALSEE projects is advanced, system facilities can be operated by village residents with appropriate training. ALSEE provides continuing training and

  14. Recent advances and applications of probabilistic topic models

    NASA Astrophysics Data System (ADS)

    Wood, Ian

    2014-12-01

    I present here an overview of recent advances in probabilistic topic modelling and related Bayesian graphical models as well as some of their more atypical applications outside of their home: text analysis. These techniques allow the modelling of high dimensional count vectors with strong correlations. With such data, simply calculating a correlation matrix is infeasible. Probabilistic topic models address this using mixtures of multinomials estimated via Bayesian inference with Dirichlet priors. The use of conjugate priors allows for efficient inference, and these techniques scale well to data sets with many millions of vectors. The first of these techniques to attract significant attention was Latent Dirichlet Allocation (LDA) [1, 2]. Numerous extensions and adaptations of LDA have been proposed: non-parametric models; assorted models incorporating authors, sentiment and other features; models regularised through the use of extra metadata or extra priors on topic structure, and many more [3]. They have become widely used in the text analysis and population genetics communities, with a number of compelling applications. These techniques are not restricted to text analysis, however, and can be applied to other types of data which can be sensibly discretised and represented as counts of labels/properties/etc. LDA and it's variants have been used to find patterns in data from diverse areas of inquiry, including genetics, plant physiology, image analysis, social network analysis, remote sensing and astrophysics. Nonetheless, it is relatively recently that probabilistic topic models have found applications outside of text analysis, and to date few such applications have been considered. I suggest that there is substantial untapped potential for topic models and models inspired by or incorporating topic models to be fruitfully applied, and outline the characteristics of systems and data for which this may be the case.

  15. Nanoimprint lithography for green water-repellent film derived from biomass with high-light transparency

    NASA Astrophysics Data System (ADS)

    Takei, Satoshi; Hanabata, Makoto

    2015-03-01

    Newly eco-friendly high light transparency film with plant-based materials was investigated to future development of liquid crystal displays and optical devices with water repellency as a chemical design concept of nanoimprint lithography. This procedure is proven to be suitable for material design and the process conditions of ultraviolet curing nanoimprint lithography for green water-repellent film derived from biomass with high-light transparency. The developed formulation of advanced nanoimprinted materials design derived from lactulose and psicose, and the development of suitable UV nanoimprint conditions produced high resolutions of the conical shaped moth-eye regularly-nanostructure less than approximately 200 nm diameter, and acceptable patterning dimensional accuracy by the replication of 100 times of UV nanoimprint lithography cycles. The newly plant-based materials and the process conditions are expected as one of the defect less nanoimprint lithographic technologies in next generation electronic devices.

  16. Demonstration of EDA flow for massively parallel e-beam lithography

    NASA Astrophysics Data System (ADS)

    Brandt, P.; Belledent, J.; Tranquillin, C.; Figueiro, T.; Meunier, S.; Bayle, S.; Fay, A.; Milléquant, M.; Icard, B.; Wieland, M.

    2014-03-01

    Today's soaring complexity in pushing the limits of 193nm immersion lithography drives the development of other technologies. One of these alternatives is mask-less massively parallel electron beam lithography, (MP-EBL), a promising candidate in which future resolution needs can be fulfilled at competitive cost. MAPPER Lithography's MATRIX MP-EBL platform has currently entered an advanced stage of development. The first tool in this platform, the FLX 1200, will operate using more than 1,300 beams, each one writing a stripe 2.2μm wide. 0.2μm overlap from stripe to stripe is allocated for stitching. Each beam is composed of 49 individual sub-beams that can be blanked independently in order to write in a raster scan pixels onto the wafer.

  17. Recent Advances in Biosensor Technology for Potential Applications - An Overview.

    PubMed

    Vigneshvar, S; Sudhakumari, C C; Senthilkumaran, Balasubramanian; Prakash, Hridayesh

    2016-01-01

    Imperative utilization of biosensors has acquired paramount importance in the field of drug discovery, biomedicine, food safety standards, defense, security, and environmental monitoring. This has led to the invention of precise and powerful analytical tools using biological sensing element as biosensor. Glucometers utilizing the strategy of electrochemical detection of oxygen or hydrogen peroxide using immobilized glucose oxidase electrode seeded the discovery of biosensors. Recent advances in biological techniques and instrumentation involving fluorescence tag to nanomaterials have increased the sensitive limit of biosensors. Use of aptamers or nucleotides, affibodies, peptide arrays, and molecule imprinted polymers provide tools to develop innovative biosensors over classical methods. Integrated approaches provided a better perspective for developing specific and sensitive biosensors with high regenerative potentials. Various biosensors ranging from nanomaterials, polymers to microbes have wider potential applications. It is quite important to integrate multifaceted approaches to design biosensors that have the potential for diverse usage. In light of this, this review provides an overview of different types of biosensors being used ranging from electrochemical, fluorescence tagged, nanomaterials, silica or quartz, and microbes for various biomedical and environmental applications with future outlook of biosensor technology. PMID:26909346

  18. Advances in microbeam technologies and applications to radiation biology.

    PubMed

    Barberet, P; Seznec, H

    2015-09-01

    Charged-particle microbeams (CPMs) allow the targeting of sub-cellular compartments with a counted number of energetic ions. While initially developed in the late 1990s to overcome the statistical fluctuation on the number of traversals per cell inevitably associated with broad beam irradiations, CPMs have generated a growing interest and are now used in a wide range of radiation biology studies. Besides the study of the low-dose cellular response that has prevailed in the applications of these facilities for many years, several new topics have appeared recently. By combining their ability to generate highly clustered damages in a micrometric volume with immunostaining or live-cell GFP labelling, a huge potential for monitoring radiation-induced DNA damage and repair has been introduced. This type of studies has pushed end-stations towards advanced fluorescence microscopy techniques, and several microbeam lines are currently equipped with the state-of-the-art time-lapse fluorescence imaging microscopes. In addition, CPMs are nowadays also used to irradiate multicellular models in a highly controlled way. This review presents the latest developments and applications of charged-particle microbeams to radiation biology. PMID:25911406

  19. Advanced fuel cells for transportation applications. Final report

    SciTech Connect

    1998-02-10

    This Research and Development (R and D) contract was directed at developing an advanced technology compressor/expander for supplying compressed air to Proton Exchange Membrane (PEM) fuel cells in transportation applications. The objective of this project was to develop a low-cost high-efficiency long-life lubrication-free integrated compressor/expander utilizing scroll technology. The goal of this compressor/expander was to be capable of providing compressed air over the flow and pressure ranges required for the operation of 50 kW PEM fuel cells in transportation applications. The desired ranges of flow, pressure, and other performance parameters were outlined in a set of guidelines provided by DOE. The project consisted of the design, fabrication, and test of a prototype compressor/expander module. The scroll CEM development program summarized in this report has been very successful, demonstrating that scroll technology is a leading candidate for automotive fuel cell compressor/expanders. The objectives of the program are: develop an integrated scroll CEM; demonstrate efficiency and capacity goals; demonstrate manufacturability and cost goals; and evaluate operating envelope. In summary, while the scroll CEM program did not demonstrate a level of performance as high as the DOE guidelines in all cases, it did meet the overriding objectives of the program. A fully-integrated, low-cost CEM was developed that demonstrated high efficiency and reliable operation throughout the test program. 26 figs., 13 tabs.

  20. Artificial placenta: Recent advances and potential clinical applications.

    PubMed

    Metelo-Coimbra, Catarina; Roncon-Albuquerque, Roberto

    2016-06-01

    Lung immaturity remains a major cause of morbidity and mortality in extremely premature infants. Positive-pressure mechanical ventilation, the method of choice for respiratory support in premature infants, frequently promotes by itself lung injury and a negative impact in the circulatory function. Extracorporeal lung support has been proposed for more than 50 years as a potential alternative to mechanical ventilation in the treatment of severe respiratory failure of extremely premature infants. Recent advances in this field included the development of miniaturized centrifugal pumps and polymethylpentene oxygenators, as well as the successful use of pump-assisted veno-venous extracorporeal gas exchange systems in experimental artificial placenta models. This review, which includes studies published from 1958 to 2015, presents an update on the artificial placenta concept and its potential clinical applications. Special focus will be devoted to the milestones achieved so far and to the limitations that must be overcome before its clinical application. Notwithstanding, the artificial placenta stands as a promising alternative to mechanical ventilation in extremely premature infants. Pediatr Pulmonol. 2016;51:643-649. © 2016 Wiley Periodicals, Inc. PMID:26915478

  1. Stimulus-responsive hydrogels: Theory, modern advances, and applications

    PubMed Central

    Koetting, Michael C.; Peters, Jonathan T.; Steichen, Stephanie D.; Peppas, Nicholas A.

    2016-01-01

    Over the past century, hydrogels have emerged as effective materials for an immense variety of applications. The unique network structure of hydrogels enables very high levels of hydrophilicity and biocompatibility, while at the same time exhibiting the soft physical properties associated with living tissue, making them ideal biomaterials. Stimulus-responsive hydrogels have been especially impactful, allowing for unprecedented levels of control over material properties in response to external cues. This enhanced control has enabled groundbreaking advances in healthcare, allowing for more effective treatment of a vast array of diseases and improved approaches for tissue engineering and wound healing. In this extensive review, we identify and discuss the multitude of response modalities that have been developed, including temperature, pH, chemical, light, electro, and shear-sensitive hydrogels. We discuss the theoretical analysis of hydrogel properties and the mechanisms used to create these responses, highlighting both the pioneering and most recent work in all of these fields. Finally, we review the many current and proposed applications of these hydrogels in medicine and industry. PMID:27134415

  2. Results of advanced battery technology evaluations for electric vehicle applications

    SciTech Connect

    DeLuca, W.H.; Gillie, K.R.; Kulaga, J.E.; Smaga, J.A.; Tummillo, A.F.; Webster, C.E.

    1992-09-01

    Advanced battery technology evaluations are performed under simulated electric-vehicle operating conditions at the Analysis & Diagnostic Laboratory (ADL) of Argonne National Laboratory. The ADL results provide insight Into those factors that limit battery performance and life. The ADL facilities include a test laboratory to conduct battery experimental evaluations under simulated application conditions and a post-test analysis laboratory to determine, In a protected atmosphere if needed, component compositional changes and failure mechanisms. This paper summarizes the performance characterizations and life evaluations conducted during 1991--1992 on both single cells and multi-cell modules that encompass eight battery technologies [Na/S, Li/MS (M=metal), Ni/MH, Ni/Cd, Ni/Zn, Ni/Fe, Zn/Br, and Pb-acid]. These evaluations were performed for the Department of Energy, Office of Transportation Technologies, Electric and Hybrid Propulsion Division, and the Electric Power Research Institute. The ADL provides a common basis for battery performance characterization and life evaluations with unbiased application of tests and analyses. The results help identify the most-promising R&D approaches for overcoming battery limitations, and provide battery users, developers, and program managers with a measure of the progress being made in battery R&D programs, a comparison of battery technologies, and basic data for modeling.

  3. Results of advanced batter technology evaluations for electric vehicle applications

    SciTech Connect

    DeLuca, W.H.; Gillie, K.R.; Kulaga, J.E.; Smaga, J.A.; Tummillo, A.F.; Webster, C.E.

    1992-01-01

    Advanced battery technology evaluations are performed under simulated electric-vehicle operating conditions at the Analysis Diagnostic Laboratory (ADL) of Argonne National Laboratory. The ADL results provide insight Into those factors that limit battery performance and life. The ADL facilities include a test laboratory to conduct battery experimental evaluations under simulated application conditions and a post-test analysis laboratory to determine, In a protected atmosphere if needed, component compositional changes and failure mechanisms. This paper summarizes the performance characterizations and life evaluations conducted during 1991--1992 on both single cells and multi-cell modules that encompass eight battery technologies (Na/S, Li/MS (M=metal), Ni/MH, Ni/Cd, Ni/Zn, Ni/Fe, Zn/Br, and Pb-acid). These evaluations were performed for the Department of Energy, Office of Transportation Technologies, Electric and Hybrid Propulsion Division, and the Electric Power Research Institute. The ADL provides a common basis for battery performance characterization and life evaluations with unbiased application of tests and analyses. The results help identify the most-promising R D approaches for overcoming battery limitations, and provide battery users, developers, and program managers with a measure of the progress being made in battery R D programs, a comparison of battery technologies, and basic data for modeling.

  4. Resist profile simulation with fast lithography model

    NASA Astrophysics Data System (ADS)

    He, Yan-Ying; Chou, Chih-Shiang; Tang, Yu-Po; Huang, Wen-Chun; Liu, Ru-Gun; Gau, Tsai-Sheng

    2014-03-01

    A traditional approach to construct a fast lithographic model is to match wafer top-down SEM images, contours and/or gauge CDs with a TCC model plus some simple resist representation. This modeling method has been proven and is extensively used for OPC modeling. As the technology moves forward, this traditional approach has become insufficient in regard to lithography weak point detection, etching bias prediction, etc. The drawback of this approach is from metrology and simulation. First, top-down SEM is only good for acquiring planar CD information. Some 3D metrology such as cross-section SEM or AFM is necessary to obtain the true resist profile. Second, the TCC modeling approach is only suitable for planar image simulation. In order to model the resist profile, full 3D image simulation is needed. Even though there are many rigorous simulators capable of catching the resist profile very well, none of them is feasible for full-chip application due to the tremendous consumption of computational resource. The authors have proposed a quasi-3D image simulation method in the previous study [1], which is suitable for full-chip simulation with the consideration of sidewall angles, to improve the model accuracy of planar models. In this paper, the quasi-3D image simulation is extended to directly model the resist profile with AFM and/or cross-section SEM data. Resist weak points detected by the model generated with this 3D approach are verified on the wafer.

  5. A Low-Cost Hands-On Laboratory to Introduce Lithography Concepts

    ERIC Educational Resources Information Center

    Jalali, M.; Marti, J. J.; Kirchhoff, A. L.; Lawrenz, F.; Campbell, S. A.

    2012-01-01

    A lithography lab course has been developed that is applicable to students from the middle-school level up to college students. It can also be inserted into electronics technology or similar courses in two- and four-year colleges, or used to demonstrate applications of polymers in chemistry classes. Some of these techniques would enable research…

  6. Soft X-Ray Microscopy and EUV Lithography: An Update on Imaging at 20-40 nm Spatial Resolution

    NASA Astrophysics Data System (ADS)

    Attwood, D.; Anderson, E.; Denbeaux, G.; Goldberg, K.; Naulleau, P.; Schneider, G.

    2002-11-01

    Major advances in both soft x-ray microscopy, at wavelengths from 0.6 to 4 nm, and EUV lithography, at wavelengths between 13 and 14 nm, are reviewed. In the XRL-2000 proceedings we reported soft x-ray microscopy resolved to 25 nm, in static two-dimensional imaging, with applications to biology, magnetic materials, and various "wet" environmental samples. In this 2002 update we report significant extensions to three-dimensional tomographic imaging, dynamical studies of magnetic and electronic devices, and static two-dimensional microscopy poised for extension to below 20 nm spatial resolution. In the XRL-2000 proceedings we reported EUV lithographic imaging of 50 nm lines/100 nm spaces in static microfield (approx100 mum) exposures. In this 2002 update we report scanned full-field (25 mm by 32 mm) images at better than 100 nm lines/100 nm spaces, static microfield exposures down to 50 nm lines/50 nm spaces, and isolated lines to 39 nm wide at 0.1 NA. With soon to be available 0.3 NA optics, we expect to print isolated lines, in static micro exposures, at 16-20 nm width in 2003. These results will demonstrate EUV lithography's ability to meet not only the ITRS Roadmap 45 nm node (26 nm isolated lines in resist) in 2007, but also the 32 nm node (18 nm isolated lines in resist) in 2009, both of which the semiconductor industry is now preparing for.

  7. Secondary Electrons in EUV Lithography

    SciTech Connect

    Torok, Justin; Re, Ryan Del; Herbol, Henry; Das, Sanjana; Bocharova, Irina; Paolucci, Angela; Ocola, Leonidas E.; Ventrice Jr., Carl; Lifshin, Eric; Denbeaux, Greg; Brainard, Robert L.

    2013-01-01

    Secondary electrons play critical roles in several imaging technologies, including extreme ultraviolet (EUV) lithography. At longer wavelengths of light (e.g. 193 and 248 nm), the photons are directly involved in the photochemistry occurring during photolysis. EUV light (13.5 nm, 92 eV), however, first creates a photoelectron, and this electron, or its subsequent daughter electrons create most of the chemical changes that occur during exposure. Despite the importance of these electrons, the details surrounding the chemical events leading to acid production remain poorly understood. Previously reported experimental results using high PAG-loaded resists have demonstrated that up to five or six photoacids can be generated per incident photon. Until recently, only electron recombination events were thought to play a role in acid generation, requiring that at least as many secondary electrons are produced to yield a given number of acid molecules. However, the initial results we have obtained using a Monte Carlo-based modeling program, LESiS, demonstrate that only two to three secondary electrons are made per absorbed EUV photon. A more comprehensive understanding of EUV-induced acid generation is therefore needed for the development of higher performance resists

  8. Masks for extreme ultraviolet lithography

    SciTech Connect

    Cardinale, G; Goldsmith, J; Kearney, P A; Larson, C; Moore, C E; Prisbrey, S; Tong, W; Vernon, S P; Weber, F; Yan, P-Y

    1998-09-01

    In extreme ultraviolet lithography (EUVL), the technology specific requirements on the mask are a direct consequence of the utilization of radiation in the spectral region between 10 and 15 nm. At these wavelengths, all condensed materials are highly absorbing and efficient radiation transport mandates the use of all-reflective optical systems. Reflectivity is achieved with resonant, wavelength-matched multilayer (ML) coatings on all of the optical surfaces - including the mask. The EUV mask has a unique architecture - it consists of a substrate with a highly reflective ML coating (the mask blank) that is subsequently over-coated with a patterned absorber layer (the mask). Particulate contamination on the EUVL mask surface, errors in absorber definition and defects in the ML coating all have the potential to print in the lithographic process. While highly developed technologies exist for repair of the absorber layer, no viable strategy for the repair of ML coating defects has been identified. In this paper the state-of-the-art in ML deposition technology, optical inspection of EUVL mask blank defects and candidate absorber patterning approaches are reviewed.

  9. Semiconductor foundry, lithography, and partners

    NASA Astrophysics Data System (ADS)

    Lin, Burn J.

    2002-07-01

    The semiconductor foundry took off in 1990 with an annual capacity of less than 0.1M 8-inch-equivalent wafers at the 2-mm node. In 2000, the annual capacity rose to more than 10M. Initially, the technology practiced at foundries was 1 to 2 generations behind that at integrated device manufacturers (IDMs). Presently, the progress in 0.13-mm manufacturing goes hand-in-hand with any of the IDMs. There is a two-order of magnitude rise in output and the progress of technology development outpaces IDMs. What are the reasons of the success? Is it possible to sustain the pace? This paper shows the quick rise of foundries in capacity, sales, and market share. It discusses the their uniqueness which gives rise to advantages in conjunction with challenges. It also shows the role foundries take with their customer partners and supplier partners, their mutual dependencies, as well as expectations. What role then does lithography play in the foundries? What are the lithographic challenges to sustain the pace of technology? The experience of technology development and transfer, at one of the major foundries, is used to illustrate the difficulties and progresses made. Looking into the future, as semiconductor manufacturing will become even more expensive and capital investment more prohibitive, we will make an attempt to suggest possible solutions.

  10. Extreme-UV lithography condenser

    DOEpatents

    Sweatt, William C.; Sweeney, Donald W.; Shafer, David; McGuire, James

    2001-01-01

    Condenser system for use with a ringfield camera in projection lithography where the condenser includes a series of segments of a parent aspheric mirror having one foci at a quasi-point source of radiation and the other foci at the radius of a ringfield have all but one or all of their beams translated and rotated by sets of mirrors such that all of the beams pass through the real entrance pupil of a ringfield camera about one of the beams and fall onto the ringfield radius as a coincident image as an arc of the ringfield. The condenser has a set of correcting mirrors with one of the correcting mirrors of each set, or a mirror that is common to said sets of mirrors, from which the radiation emanates, is a concave mirror that is positioned to shape a beam segment having a chord angle of about 25 to 85 degrees into a second beam segment having a chord angle of about 0 to 60 degrees.

  11. Advanced Health Management Algorithms for Crew Exploration Applications

    NASA Technical Reports Server (NTRS)

    Davidson, Matt; Stephens, John; Jones, Judit

    2005-01-01

    Achieving the goals of the President's Vision for Exploration will require new and innovative ways to achieve reliability increases of key systems and sub-systems. The most prominent approach used in current systems is to maintain hardware redundancy. This imposes constraints to the system and utilizes weight that could be used for payload for extended lunar, Martian, or other deep space missions. A technique to improve reliability while reducing the system weight and constraints is through the use of an Advanced Health Management System (AHMS). This system contains diagnostic algorithms and decision logic to mitigate or minimize the impact of system anomalies on propulsion system performance throughout the powered flight regime. The purposes of the AHMS are to increase the probability of successfully placing the vehicle into the intended orbit (Earth, Lunar, or Martian escape trajectory), increase the probability of being able to safely execute an abort after it has developed anomalous performance during launch or ascent phases of the mission, and to minimize or mitigate anomalies during the cruise portion of the mission. This is accomplished by improving the knowledge of the state of the propulsion system operation at any given turbomachinery vibration protection logic and an overall system analysis algorithm that utilizes an underlying physical model and a wide array of engine system operational parameters to detect and mitigate predefined engine anomalies. These algorithms are generic enough to be utilized on any propulsion system yet can be easily tailored to each application by changing input data and engine specific parameters. The key to the advancement of such a system is the verification of the algorithms. These algorithms will be validated through the use of a database of nominal and anomalous performance from a large propulsion system where data exists for catastrophic and noncatastrophic propulsion sytem failures.

  12. Applications and advances of positron beam spectroscopy: appendix a

    SciTech Connect

    Howell, R. H., LLNL

    1997-11-05

    Over 50 scientists from DOE-DP, DOE-ER, the national laboratories, academia and industry attended a workshop held on November 5-7, 1997 at Lawrence Livermore National Laboratory jointly sponsored by the DOE-Division of Materials Science, The Materials Research Institute at LLNL and the University of California Presidents Office. Workshop participants were charged to address two questions: Is there a need for a national center for materials analysis using positron techniques and can the capabilities at Lawrence Livermore National Laboratory serve this need. To demonstrate the need for a national center the workshop participants discussed the technical advantages enabled by high positron currents and advanced measurement techniques, the role that these techniques will play in materials analysis and the demand for the data. There were general discussions lead by review talks on positron analysis techniques, and their applications to problems in semiconductors, polymers and composites, metals and engineering materials, surface analysis and advanced techniques. These were followed by focus sessions on positron analysis opportunities in these same areas. Livermore now leads the world in materials analysis capabilities by positrons due to developments in response to demands of science based stockpile stewardship. There was a detailed discussion of the LLNL capabilities and a tour of the facilities. The Livermore facilities now include the worlds highest current beam of keV positrons, a scanning pulsed positron microprobe under development capable of three dimensional maps of defect size and concentration, an MeV positron beam for defect analysis of large samples, and electron momentum spectroscopy by positrons. This document is a supplement to the written summary report. It contains a complete schedule, list of attendees and the vuegraphs for the presentations in the review and focus sessions.

  13. Vacuum-free self-powered parallel electron lithography with sub-35-nm resolution.

    PubMed

    Lu, Yuerui; Lal, Amit

    2010-06-01

    The critical dimension, throughput, and cost of nanolithography are central to developing commercially viable high-performance nanodevices. Available top-down lithography approaches to fabricate large-area nanostructures at low cost, such as controllable nanowire (NW) array fabrication for solar cells applications, are challenging due to the requirement of both high lithography resolution and high throughput. Here, a minimum 35 nm resolution is experimentally demonstrated by using a new mask fabrication technique in our demonstrated vacuum-free high-throughput self-powered parallel electron lithography (SPEL) system, which uses large-area planar radioactive beta-electron thin film emitters to parallel expose e-beam resist through a stencil mask. SPEL is the first-time demonstrated vacuum-free electron lithography, which overcomes the membrane mask distortion challenge that was shown to be the Achilles heel of previous attempts at electron projection lithography in vacuum. Monte Carlo simulations show that by using beryllium tritide thin film source in SPEL system, the exposure time can be reduced down to 2 min for each large-area (10000 cm(2) or more) parallel exposure, with resolution not larger than 20 nm. Moreover, experimental demonstration of large-area diameter-and-density controllable vertical NW arrays fabricated by SPEL shows its promising utility for an application requiring large-area nanostructure definition. PMID:20481509

  14. Study of the application of advanced technologies to long range transport aircraft. Volume 2: Advanced technology program recommendations

    NASA Technical Reports Server (NTRS)

    1972-01-01

    The benefits of the application of advanced technology to future transport aircraft were investigated. The noise reduction goals established by the CARD (Civil Aviation Research and Development) study for the 1981-1985 time period can be satisfied. Reduced terminal area and airway congestion can result from use of advanced on-board systems and operating procedures. The use of advanced structural design concepts can result in greatly reduced gross weight and improved operating economics. The full potential of these benefits can be realized in a 1985 airplane by implementing a research and development program that is funded to an average level of approximately $55 million per year over a ten year period.

  15. Lithography aware overlay metrology target design method

    NASA Astrophysics Data System (ADS)

    Lee, Myungjun; Smith, Mark D.; Lee, Joonseuk; Jung, Mirim; Lee, Honggoo; Kim, Youngsik; Han, Sangjun; Adel, Michael E.; Lee, Kangsan; Lee, Dohwa; Choi, Dongsub; Liu, Zephyr; Itzkovich, Tal; Levinski, Vladimir; Levy, Ady

    2016-03-01

    We present a metrology target design (MTD) framework based on co-optimizing lithography and metrology performance. The overlay metrology performance is strongly related to the target design and optimizing the target under different process variations in a high NA optical lithography tool and measurement conditions in a metrology tool becomes critical for sub-20nm nodes. The lithography performance can be quantified by device matching and printability metrics, while accuracy and precision metrics are used to quantify the metrology performance. Based on using these metrics, we demonstrate how the optimized target can improve target printability while maintaining the good metrology performance for rotated dipole illumination used for printing a sub-100nm diagonal feature in a memory active layer. The remaining challenges and the existing tradeoff between metrology and lithography performance are explored with the metrology target designer's perspective. The proposed target design framework is completely general and can be used to optimize targets for different lithography conditions. The results from our analysis are both physically sensible and in good agreement with experimental results.

  16. Ground-to-orbit laser propulsion: Advanced applications

    SciTech Connect

    Kare, J.T.

    1990-01-01

    Laser propulsion uses a large fixed laser to supply energy to heat an inert propellant in a rocket thruster. Such a system has two potential advantages: extreme simplicity of the thruster, and potentially high performance -- particularly high exhaust velocity. By taking advantage of the simplicity of the thruster, it should be possible to launch small (10--1000 kg) payloads to orbit using roughly 1 MW of average laser power per kg of payload. The incremental cost of such launches would be of order $200/kg for the smallest systems, decreasing to essentially the cost of electricity to run the laser (a few times $10/kg) for large systems. Although the individual payload size would be small, a laser launch system would be inherently high-volume, with the capacity to launch tens of thousands of payloads per year. Also, with high exhaust velocity, a laser launch system could launch payloads to high velocities -- geosynchronous transfer, Earth escape, or beyond -- at a relatively small premium over launches to LEO. In this paper, we briefly review the status of pulsed laser propulsion, including proposals for advanced vehicles. We then discuss qualitatively several unique applications appropriate to the early part of the next century, and perhaps valuable well into the next millenium: space habitat supply, deep space mission supply, nuclear waste disposal, and manned vehicle launching.

  17. Advanced polymer systems for optoelectronic integrated circuit applications

    NASA Astrophysics Data System (ADS)

    Eldada, Louay A.; Stengel, Kelly M. T.; Shacklette, Lawrence W.; Norwood, Robert A.; Xu, Chengzeng; Wu, Chengjiu; Yardley, James T.

    1997-01-01

    An advanced versatile low-cost polymeric waveguide technology is proposed for optoelectronic integrated circuit applications. We have developed high-performance organic polymeric materials that can be readily made into both multimode and single-mode optical waveguide structures of controlled numerical aperture (NA) and geometry. These materials are formed from highly crosslinked acrylate monomers with specific linkages that determine properties such as flexibility, toughness, loss, and stability against yellowing and humidity. These monomers are intermiscible, providing for precise adjustment of the refractive index from 1.30 to 1.60. Waveguides are formed photolithographically, with the liquid monomer mixture polymerizing upon illumination in the UV via either mask exposure or laser direct-writing. A wide range of rigid and flexible substrates can be used, including glass, quartz, oxidized silicon, glass-filled epoxy printed circuit board substrate, and flexible polyimide film. We discuss the use of these materials on chips and on multi-chip modules (MCMs), specifically in transceivers where we adaptively produced waveguides on vertical-cavity surface-emitting lasers (VCSELs) embedded in transmitter MCMs and on high- speed photodetector chips in receiver MCMs. Light coupling from and to chips is achieved by cutting 45 degree mirrors using excimer laser ablation. The fabrication of our polymeric structures directly on the modules provides for stability, ruggedness, and hermeticity in packaging.

  18. Applications of advanced upper surface blowing propulsive-lift technology

    NASA Technical Reports Server (NTRS)

    Cochrane, J. A.; Riddle, D. W.; Youth, S.

    1982-01-01

    The success of the Quiet Short-Haul Research Aircraft led to studies of this technology for a business jet and a Short-Haul Transport. The studies showed that the Short-Haul Transport could operate from a 762.0-m runway with 95 passengers at low noise levels. Design range was 500 n. mi. but with maximum fuel load the runway length is only increased to 883.9 m while the range is increased to more than 1000 n. mi. Two business jet designs were studied; one design was based on a 457.2-m field length and the other was designed for a 760.0-m field length. The business jet designed for a 457.2-m field length can also be loaded to maximum fuel capacity. In this case the range increases from 500 n. mi. to 1400 n. mi. while the runway length increases from 457.2 m to 632.5 m. The business jet studies showed that the application of advanced propulsive-lift technology to this class aircraft can result in payload-range-speed performance comparable to current aircraft with about one-half the runway length requirement.

  19. Engineering derivatives from biological systems for advanced aerospace applications

    NASA Technical Reports Server (NTRS)

    Winfield, Daniel L.; Hering, Dean H.; Cole, David

    1991-01-01

    The present study consisted of a literature survey, a survey of researchers, and a workshop on bionics. These tasks produced an extensive annotated bibliography of bionics research (282 citations), a directory of bionics researchers, and a workshop report on specific bionics research topics applicable to space technology. These deliverables are included as Appendix A, Appendix B, and Section 5.0, respectively. To provide organization to this highly interdisciplinary field and to serve as a guide for interested researchers, we have also prepared a taxonomy or classification of the various subelements of natural engineering systems. Finally, we have synthesized the results of the various components of this study into a discussion of the most promising opportunities for accelerated research, seeking solutions which apply engineering principles from natural systems to advanced aerospace problems. A discussion of opportunities within the areas of materials, structures, sensors, information processing, robotics, autonomous systems, life support systems, and aeronautics is given. Following the conclusions are six discipline summaries that highlight the potential benefits of research in these areas for NASA's space technology programs.

  20. Ground-to-orbit laser propulsion: Advanced applications

    NASA Technical Reports Server (NTRS)

    Kare, Jordin T.

    1990-01-01

    Laser propulsion uses a large fixed laser to supply energy to heat an inert propellant in a rocket thruster. Such a system has two potential advantages: extreme simplicity of the thruster, and potentially high performance, particularly high exhaust velocity. By taking advantage of the simplicity of the thruster, it should be possible to launch small (10 to 1000 kg) payloads to orbit using roughly 1 MW of average laser power per kg of payload. The incremental cost of such launches would be of an order of $200/kg for the smallest systems, decreasing to essentially the cost of electricity to run the laser (a few times $10/kg) for larger systems. Although the individual payload size would be smaller, a laser launch system would be inherently high-volume, with the capacity to launch tens of thousands of payloads per year. Also, with high exhaust velocity, a laser launch system could launch payloads to high velocities - geosynchronous transfer, Earth escape, or beyond - at a relatively small premium over launches to LEO. The status of pulsed laser propulsion is briefly reviewed including proposals for advanced vehicles. Several applications appropriate to the early part of the next century and perhaps valuable well into the next millennium are discussed qualitatively: space habitat supply, deep space mission supply, nuclear waste disposal, and manned vehicle launching.

  1. Tandem Fan Applications in Advanced STOVL Fighter Configurations

    NASA Technical Reports Server (NTRS)

    Zola, Charlse L.; Wilson, Samuel B., III; Eskey, Megan A.

    1984-01-01

    The series/parallel tandem fan engine is evaluated for application in advanced STOVL supersonic fighter aircraft. Options in engine cycle parameters and design of the front fan flow diverter are examined for their effects on engine weight, dimensions, and other factors in integration of the engine with the aircraft. Operation of the engine in high-bypass flow mode during cruise and loiter flight is considered as a means of minimizizng fuel consumption. Engine thrust augmentation by burning in the front fan exhaust is discussed. Achievement of very sort takeoff with vectored thrust in briefly reviewed for tandem fan engine configurations with vectorable front fan nozzles. Examples are given of two aircraft configuration planforms, a delta-canard, and a forward-swept wing, to illustrate the major features. design considerations, and potential performance of the tandem fan installation in each. Full realization of the advantages of tandem fan propulsion are found to depend on careful selection of the aircraft configuration, since integration requirements can strongly influence the engine performance.

  2. Polymers as advanced materials for desiccant applications, 1988

    SciTech Connect

    Czanderna, A.W.; Neidlinger, H.H.

    1990-09-01

    This report documents work to identify a next-generation, low-cost material with which solar energy or heat from another low-cost energy source can be used for regenerating the water vapor sorption activity of the desiccant. The objective of the work is to determine how the desired sorption performance of advanced desiccant materials can be predicted by understanding the role of the material modifications and material surfaces. The work concentrates on solid materials to be used for desiccant cooling systems and which process water vapor in an atmosphere to produce cooling. The work involved preparing modifications of polystyrene sulfonic acid sodium salt, synthesizing a hydrogel, and evaluating the sorption performances of these and similar commercially available polymeric materials; all materials were studied for their potential application in solid commercial desiccant cooling systems. Background information is also provided on desiccant cooling systems and the role of a desiccant material within such a system, and it includes the use of polymers as desiccant materials. 31 refs., 16 figs., 5 tabs.

  3. Managing Linguistic Data Summaries in Advanced P2P Applications

    NASA Astrophysics Data System (ADS)

    Hayek, Rabab; Raschia, Guillaume; Valduriez, Patrick; Mouaddib, Noureddine

    As the amount of stored data increases, data localization techniques become no longer sufficient in P2P systems. A practical approach is to rely on compact database summaries rather than raw database records, whose access is costly in large P2P systems. In this chapter, we describe a solution for managing linguistic data summaries in advanced P2P applications which are dealing with semantically rich data. The produced summaries are synthetic, multidimensional views over relational tables. The novelty of this proposal relies on the double summary exploitation in distributed P2P systems. First, as semantic indexes, they support locating relevant nodes based on their data descriptions. Second, due to their intelligibility, these summaries can be directly queried and thus approximately answer a query without the need for exploring original data. The proposed solution consists first in defining a summary model for hierarchical P2P systems. Second, appropriate algorithms for summary creation and maintenance are presented. A query processing mechanism, which relies on summary querying, is then proposed to demonstrate the benefits that might be obtained from summary exploitation.

  4. Advanced Turbine Technology Applications Project (ATTAP) 1993 annual report

    NASA Technical Reports Server (NTRS)

    1994-01-01

    This report summarizes work performed by AlliedSignal Engines, a unit of AlliedSignal Aerospace Company, during calendar year 1993, toward development and demonstration of structural ceramic technology for automotive gas turbine engines. This work was performed for the U.S. Department of Energy (DOE) under National Aeronautics and Space Administration (NASA) Contract DEN3-335, Advanced Turbine Technology Applications Project (ATFAP). During 1993, the test bed used to demonstrate ceramic technology was changed from the AlliedSignal Engines/Garrett Model AGT101 regenerated gas turbine engine to the Model 331-200(CT) engine. The 331-200(CT) ceramic demonstrator is a fully-developed test platform based on the existing production AlliedSignal 331-200(ER) gas turbine auxiliary power unit (APU), and is well suited to evaluating ceramic turbine blades and nozzles. In addition, commonality of the 331-200(CT) engine with existing gas turbine APU's in commercial service provides the potential for field testing of ceramic components. The 1993 ATTAP activities emphasized design modifications of the 331-200 engine test bed to accommodate ceramic first-stage turbine nozzles and blades, fabrication of the ceramic components, ceramic component proof and rig tests, operational tests of the test bed equipped with the ceramic components, and refinement of critical ceramic design technologies.

  5. Advanced Turbine Technology Applications Project (ATTAP) 1993 annual report

    NASA Astrophysics Data System (ADS)

    1994-07-01

    This report summarizes work performed by AlliedSignal Engines, a unit of AlliedSignal Aerospace Company, during calendar year 1993, toward development and demonstration of structural ceramic technology for automotive gas turbine engines. This work was performed for the U.S. Department of Energy (DOE) under National Aeronautics and Space Administration (NASA) Contract DEN3-335, Advanced Turbine Technology Applications Project (ATFAP). During 1993, the test bed used to demonstrate ceramic technology was changed from the AlliedSignal Engines/Garrett Model AGT101 regenerated gas turbine engine to the Model 331-200(CT) engine. The 331-200(CT) ceramic demonstrator is a fully-developed test platform based on the existing production AlliedSignal 331-200(ER) gas turbine auxiliary power unit (APU), and is well suited to evaluating ceramic turbine blades and nozzles. In addition, commonality of the 331-200(CT) engine with existing gas turbine APU's in commercial service provides the potential for field testing of ceramic components. The 1993 ATTAP activities emphasized design modifications of the 331-200 engine test bed to accommodate ceramic first-stage turbine nozzles and blades, fabrication of the ceramic components, ceramic component proof and rig tests, operational tests of the test bed equipped with the ceramic components, and refinement of critical ceramic design technologies.

  6. Application of the GSFUDS to advanced batteries and vehicles

    SciTech Connect

    Burke, A.F.; Cole, G.H.

    1990-01-01

    The GSFUDS approach to determining appropriate battery test power profiles is applied to various combinations of advanced batteries and electric vehicles. Computer simulations are used to show that the SFUDS velocity driving profile developed for the IDSEP electric vehicle also yielded energy consumption (Wh/km) and peak power values for other vehicles of greatly different characteristics that are in good agreement with the corresponding values for the same vehicles on the FUDS driving cycle. The computer results also showed that the GSFUDS power steps expressed as multiples of the average power, Pav are applicable to electric vehicles in general for the SFUDS driving profile if the peak power step is altered to reflect the changes in the vehicle design. A general procedure is given for presenting battery test data in terms of the constant power and GSFUDS Ragone curves from which the vehicle range can be determined for the FUDS and other driving cycles for different vehicle designs. 5 refs., 6 figs., 6 tabs.

  7. High-n immersion lithography

    NASA Astrophysics Data System (ADS)

    Sewell, Harry; Mulkens, Jan; Graeupner, Paul; McCafferty, Diane; Markoya, Louis; Donders, Sjoerd; Cortie, Rogier; Meijers, Ralph; Evangelista, Fabrizio; Samarakone, Nandarisi

    2008-03-01

    A two-year study on the feasibility of High-n Immersion Lithography shows very promising results. This paper reports the findings of the study. The evaluation shows the tremendous progress made in the development of second-generation immersion fluid technology. Candidate fluids from several suppliers have been evaluated. All the commercial fluids evaluated are viable, so there are a number of options. Life tests have been conducted on bench top fluid-handling systems and the results referenced to full-scale systems. Parameters such as Dose per Laser Pulse, Pulse Rate, Fluid Flow Rate, and Fluid Absorbency at 193nm, and Oxygen/Air Contamination Levels were explored. A detailed evaluation of phenomena such as Last Lens Element (LLE) contamination has been conducted. Lens cleaning has been evaluated. A comparison of High-n fluid-based technology and water-based immersion technology shows interesting advantages of High-n fluid in the areas of Defect and Resist Interaction. Droplet Drying tests, Resist Staining evaluations, and Resist Contrast impact studies have all been run. Defect-generating mechanisms have been identified and are being eliminated. The lower evaporation rate of the High-n fluids compared with water shows the advantages of High-n Immersion. The core issue for the technology, the availability of High-n optical material for use as the final lens element, is updated. Samples of LuAG material have been received from development partners and have been evaluated. The latest status of optical materials and the technology timelines are reported. The potential impact of the availability of the technology is discussed. Synergy with technologies such as Double Patterning is discussed. The prospects for <22nm (hp) are evaluated.

  8. Self-cleaning optic for extreme ultraviolet lithography

    DOEpatents

    Klebanoff, Leonard E.; Stulen, Richard H.

    2003-12-16

    A multilayer reflective optic or mirror for lithographic applications, and particularly extreme ultraviolet (EUV) lithography, having a surface or "capping" layer which in combination with incident radiation and gaseous molecular species such as O.sub.2, H.sub.2, H.sub.2 O provides for continuous cleaning of carbon deposits from the optic surface. The metal capping layer is required to be oxidation resistant and capable of transmitting at least 90% of incident EUV radiation. Materials for the capping layer include Ru, Rh, Pd, Ir, Pt and Au and combinations thereof.

  9. Masks for high aspect ratio x-ray lithography

    SciTech Connect

    Malek, C.K.; Jackson, K.H.; Bonivert, W.D.; Hruby, J.

    1997-04-01

    Fabrication of very high aspect ratio microstructures, as well as ultra-high precision manufacturing is of increasing interest in a multitude of applications. Fields as diverse as micromechanics, robotics, integrated optics, and sensors benefit from this technology. The scale-length of this spatial regime is between what can be achieved using classical machine tool operations and that which is used in microelectronics. This requires new manufacturing techniques, such as the LIGA process, which combines x-ray lithography, electroforming, and plastic molding.

  10. Advancements in web-database applications for rabies surveillance

    PubMed Central

    2011-01-01

    Background Protection of public health from rabies is informed by the analysis of surveillance data from human and animal populations. In Canada, public health, agricultural and wildlife agencies at the provincial and federal level are responsible for rabies disease control, and this has led to multiple agency-specific data repositories. Aggregation of agency-specific data into one database application would enable more comprehensive data analyses and effective communication among participating agencies. In Québec, RageDB was developed to house surveillance data for the raccoon rabies variant, representing the next generation in web-based database applications that provide a key resource for the protection of public health. Results RageDB incorporates data from, and grants access to, all agencies responsible for the surveillance of raccoon rabies in Québec. Technological advancements of RageDB to rabies surveillance databases include 1) automatic integration of multi-agency data and diagnostic results on a daily basis; 2) a web-based data editing interface that enables authorized users to add, edit and extract data; and 3) an interactive dashboard to help visualize data simply and efficiently, in table, chart, and cartographic formats. Furthermore, RageDB stores data from citizens who voluntarily report sightings of rabies suspect animals. We also discuss how sightings data can indicate public perception to the risk of racoon rabies and thus aid in directing the allocation of disease control resources for protecting public health. Conclusions RageDB provides an example in the evolution of spatio-temporal database applications for the storage, analysis and communication of disease surveillance data. The database was fast and inexpensive to develop by using open-source technologies, simple and efficient design strategies, and shared web hosting. The database increases communication among agencies collaborating to protect human health from raccoon rabies

  11. Advances in endodontics: Potential applications in clinical practice

    PubMed Central

    Kishen, Anil; Peters, Ove A.; Zehnder, Matthias; Diogenes, Anibal R.; Nair, Madhu K.

    2016-01-01

    Contemporary endodontics has seen an unprecedented advance in technology and materials. This article aimed to review some of the challenges and advances in the following sections: (1) endodontic imaging, (2) root canal preparation, (3) root canal disinfection, (4) root canal filling, and (4) regenerative endodontic procedures (REPs). Jointly, these advances are aimed at improving the state of the art and science of root canal treatment. PMID:27217630

  12. Advances in endodontics: Potential applications in clinical practice.

    PubMed

    Kishen, Anil; Peters, Ove A; Zehnder, Matthias; Diogenes, Anibal R; Nair, Madhu K

    2016-01-01

    Contemporary endodontics has seen an unprecedented advance in technology and materials. This article aimed to review some of the challenges and advances in the following sections: (1) endodontic imaging, (2) root canal preparation, (3) root canal disinfection, (4) root canal filling, and (4) regenerative endodontic procedures (REPs). Jointly, these advances are aimed at improving the state of the art and science of root canal treatment. PMID:27217630

  13. Application of advanced electronics to a future spacecraft computer design

    NASA Technical Reports Server (NTRS)

    Carney, P. C.

    1980-01-01

    Advancements in hardware and software technology are summarized with specific emphasis on spacecraft computer capabilities. Available state of the art technology is reviewed and candidate architectures are defined.

  14. Lithography and design in partnership: a new roadmap

    NASA Astrophysics Data System (ADS)

    Kahng, Andrew B.

    2008-10-01

    We discuss the notion of a 'shared technology roadmap' between lithography and design from several perspectives. First, we examine cultural gaps and other intrinsic barriers to a shared roadmap. Second, we discuss how lithography technology can change the design technology roadmap. Third, we discuss how design technology can change the lithography technology roadmap. We conclude with an example of the 'flavor' of technology roadmapping activity that can truly bridge lithography and design.

  15. Submicrometer photonic structure fabrication by phase spatial-light-modulator-based interference lithography.

    PubMed

    Behera, Saraswati; Kumar, Manish; Joseph, Joby

    2016-04-15

    We present a large-area and single-step fabrication approach based on phase spatial light modulator (SLM)-assisted interference lithography for the realization of submicrometer photonic structures on photoresist. A multimirror beam steering unit is used to reflect the SLM-generated phase-engineered beams leading to a large angle between interfering beams while also preserving the large area of the interfering plane beams. Both translational and rotational periodic submicrometer structures are experimentally realized. This approach increases the flexibility of interference lithography to fabricate more complex submicrometer photonic structures and photonic metamaterial structures for future applications. PMID:27082372

  16. Note: fabrication of a simple versatile micro-positioning setup for automated soft lithography.

    PubMed

    Hautefeuille, M; Cortes, J G Lopez; Alfaro, M C Ortega; Castro, M P Carreon; Velazquez, V

    2011-11-01

    In this note, we report the simple development of a homemade versatile device that allows micrometric vertical micro-positioning for computer-controlled dip-coating thin film deposition and micro-contact printing capabilities. Using mostly recycled parts, the resulting low-cost setup offers great precision, ease of use, and portability while complying with common soft lithography technique's specifications. It results in an excellent benchtop alternative to more expensive commercial solutions or more complex custom soft lithography devices, especially for organic electronics and quantum optics applications. PMID:22129020

  17. Self-aligned grating couplers on template-stripped metal pyramids via nanostencil lithography

    NASA Astrophysics Data System (ADS)

    Klemme, Daniel J.; Johnson, Timothy W.; Mohr, Daniel A.; Oh, Sang-Hyun

    2016-05-01

    We combine nanostencil lithography and template stripping to create self-aligned patterns about the apex of ultrasmooth metal pyramids with high throughput. Three-dimensional patterns such as spiral and asymmetric linear gratings, which can couple incident light into a hot spot at the tip, are presented as examples of this fabrication method. Computer simulations demonstrate that spiral and linear diffraction grating patterns are both effective at coupling light to the tip. The self-aligned stencil lithography technique can be useful for integrating plasmonic couplers with sharp metallic tips for applications such as near-field optical spectroscopy, tip-based optical trapping, plasmonic sensing, and heat-assisted magnetic recording.

  18. Note: Fabrication of a simple versatile micro-positioning setup for automated soft lithography

    NASA Astrophysics Data System (ADS)

    Hautefeuille, M.; Lopez Cortes, J. G.; Ortega Alfaro, M. C.; Carreon Castro, M. P.; Velazquez, V.

    2011-11-01

    In this note, we report the simple development of a homemade versatile device that allows micrometric vertical micro-positioning for computer-controlled dip-coating thin film deposition and micro-contact printing capabilities. Using mostly recycled parts, the resulting low-cost setup offers great precision, ease of use, and portability while complying with common soft lithography technique's specifications. It results in an excellent benchtop alternative to more expensive commercial solutions or more complex custom soft lithography devices, especially for organic electronics and quantum optics applications.

  19. Generation of high-resolution kagome lattice structures using extreme ultraviolet interference lithography

    NASA Astrophysics Data System (ADS)

    Wang, Li; Terhalle, Bernd; Guzenko, Vitaliy A.; Farhan, Alan; Hojeij, Mohamad; Ekinci, Yasin

    2012-08-01

    High-resolution kagome lattice structures with feature sizes down to the sub-50 nm regime are fabricated using diffraction-based extreme ultraviolet interference lithography. The resulting interference pattern of multiple beams is sensitive to the relative phase of the interfering beams. The precise control of their phases is achieved by precise positioning of transmission diffraction gratings on a mask using a high-end electron beam lithography tool. The presented method may find applications in providing high-resolution and large-area kagome lattice structures for studies on frustrated magnetic systems, photonic crystals, and plasmonics.

  20. Fabrication of moth-eye structures on silicon by direct six-beam laser interference lithography

    SciTech Connect

    Xu, Jia; Zhang, Ziang; Weng, Zhankun; Wang, Zuobin Wang, Dapeng

    2014-05-28

    This paper presents a new method for the generation of cross-scale laser interference patterns and the fabrication of moth-eye structures on silicon. In the method, moth-eye structures were produced on a surface of silicon wafer using direct six-beam laser interference lithography to improve the antireflection performance of the material surface. The periodic dot arrays of the moth-eye structures were formed due to the ablation of the irradiance distribution of interference patterns on the wafer surface. The shape, size, and distribution of the moth-eye structures can be adjusted by controlling the wavelength, incidence angles, and exposure doses in a direct six-beam laser interference lithography setup. The theoretical and experimental results have shown that direct six-beam laser interference lithography can provide a way to fabricate cross-scale moth-eye structures for antireflection applications.

  1. Fabrication of moth-eye structures on silicon by direct six-beam laser interference lithography

    NASA Astrophysics Data System (ADS)

    Xu, Jia; Wang, Zuobin; Zhang, Ziang; Wang, Dapeng; Weng, Zhankun

    2014-05-01

    This paper presents a new method for the generation of cross-scale laser interference patterns and the fabrication of moth-eye structures on silicon. In the method, moth-eye structures were produced on a surface of silicon wafer using direct six-beam laser interference lithography to improve the antireflection performance of the material surface. The periodic dot arrays of the moth-eye structures were formed due to the ablation of the irradiance distribution of interference patterns on the wafer surface. The shape, size, and distribution of the moth-eye structures can be adjusted by controlling the wavelength, incidence angles, and exposure doses in a direct six-beam laser interference lithography setup. The theoretical and experimental results have shown that direct six-beam laser interference lithography can provide a way to fabricate cross-scale moth-eye structures for antireflection applications.

  2. Rapid fabrication of microfluidic chips based on the simplest LED lithography

    NASA Astrophysics Data System (ADS)

    Li, Yue; Wu, Ping; Luo, Zhaofeng; Ren, Yuxuan; Liao, Meixiang; Feng, Lili; Li, Yuting; He, Liqun

    2015-05-01

    Microfluidic chips are generally fabricated by a soft lithography method employing commercial lithography equipment. These heavy machines require a critical room environment and high lamp power, and the cost remains too high for most normal laboratories. Here we present a novel microfluidics fabrication method utilizing a portable ultraviolet (UV) LED as an alternative UV source for photolithography. With this approach, we can repeat several common microchannels as do these conventional commercial exposure machines, and both the verticality of the channel sidewall and lithography resolution are proved to be acceptable. Further microfluidics applications such as mixing, blood typing and microdroplet generation are implemented to validate the practicability of the chips. This simple but innovative method decreases the cost and requirement of chip fabrication dramatically and may be more popular with ordinary laboratories.

  3. 48 CFR 32.408 - Application for advance payments.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... contract. (2) A cash flow forecast showing estimated disbursements and receipts for the period of contract... shall limit the forecast to the contract to be financed by advance payments. (3) The proposed total amount of advance payments. (4) The name and address of the financial institution at which the...

  4. Advanced teleradiology: a specification of a DICOM teleradiology application profile

    NASA Astrophysics Data System (ADS)

    von Gehlen, Sandra; Fritz, Steven L.; Eichelberg, Marco; Hewett, Andrew J.; Boesenberg, Holger; Jensch, Peter F.

    1998-07-01

    The functionality of many teleradiology systems is limited to image transfer to a remote workstation. It is not possible to access reports or images from older studies, or to create new reports of current cases. Additionally, teleradiology systems from different vendors are usually not interoperable. Future teleradiology systems should provide bi-directional image transfer as well as image annotation, the possibility to create and send back text reports, and access to previous reports. Furthermore, it becomes increasingly important that teleradiology systems are conformant to the DICOM standard. The advanced teleradiology service (ATS) is compatible to the DICOM standard and is based on the functional model of the standard. In addition to receiving current images which is straightforward, the ATS supports retrieving of correlative images, studies and reports. One further feature of ATS is the review of images which is supported with flexible image compression to keep the demand for bandwidth minimal. Additionally, creating and modifying multimedia results is supported. The multimedia results are based on 'Structured Reporting' (SR) which is a supplement of the DICOM standard. SR offers a mechanism to represent results for many fields of application in medicine. The types of documents supported by SR range from simple text descriptions to multimedia interpretation reports. For this reason it is important to evaluate scenarios and to define the requirements of SR in the radiological environment. The definition of ATS is intended to provide a tested reference architecture for teleradiology to which vendors can adhere in order to develop teleradiology systems with DICOM 'plug and play' capability.

  5. Roll-to-Roll Nanoimprint Lithography Simulations for Flexible Substrates

    NASA Astrophysics Data System (ADS)

    Spann, Andrew; Jain, Akhilesh; Bonnecaze, Roger

    2015-11-01

    UV roll-to-roll nanoimprint lithography enables the patterning of features onto a flexible substrate for bendable electronics in a continuous process. One of the most important design goals in this process is to make the residual layer thickness of the photoresist in unpatterned regions as thin and uniform as possible. Another important goal is to minimize the imprint time to maximize throughput. We develop a multi-scale model to simulate the spreading of photoresist drops as the template is pressed against the substrate. We include the effect of capillary pressure on the bending of the substrate and show how this distorts uniformity in the residual thickness layer. Our simulation code is parallelized and can simulate the flow and merging of thousands of drops. We investigate the effect of substrate tension and the initial arrangement of drops on the residual layer thickness and imprint time. We find that for a given volume of photoresist, distributing that volume to more drops initially decreases the imprint time. We conclude with recommendations for scale-up and optimal operations of roll-to-roll nanoimprint lithography systems. The authors acknowledge the Texas Advanced Computing Center at The University of Texas at Austin for providing high performance computing resources.

  6. Masks for high aspect ratio x-ray lithography

    NASA Astrophysics Data System (ADS)

    Malek, Chantal Khan; Jackson, Keith H.; Bonivert, William D.; Hruby, Jill

    1996-06-01

    The requirements for deep x-ray lithography (DXRL) masks are reviewed and a recently developed cost effective mask fabrication process is described. The review includes a summary of tabulated properties for materials used in the fabrication of DXRL masks. X-ray transparency and mask contrast are calculated for material combinations using simulations of exposure at the Advanced Light Source (ALS) at Berkeley, and compared to the requirements for standard x-ray lithography (XRL) mask technology. Guided by the requirements, a cost-effective fabrication process for manufacturing high contrast masks for DXRL has been developed. Thick absorber patterns (0960-1317/6/2/004/img7) on a thin silicon wafer (0960-1317/6/2/004/img8m) were made using contact printing in thick positive (Hoechst 4620) and negative (OCG 7020) photoresist and subsequent gold electrodeposition. Gold was deposited using a commercially available gold sulphite bath with low current density and good agitation. The resultant gold films were fine-grained and stress-free. Replication of such masks into 0960-1317/6/2/004/img9 thick acrylic sheets was performed at the ALS.

  7. Research and development on the application of advanced control technologies to advanced nuclear reactor systems: A US national perspective

    SciTech Connect

    White, J.D.; Monson, L.R.; Carrol, D.G.; Dayal, Y.; Argonne National Lab., IL; General Electric Co., San Jose, CA )

    1989-01-01

    Control system designs for nuclear power plants are becoming more advanced through the use of digital technology and automation. This evolution is taking place because of: (1) the limitations in analog based control system performance and maintenance and availability and (2) the promise of significant improvement in plant operation and availability due to advances in digital and other control technologies. Digital retrofits of control systems in US nuclear plants are occurring now. Designs of control and protection systems for advanced LWRs are based on digital technology. The use of small inexpensive, fast, large-capacity computers in these designs is the first step of an evolutionary process described in this paper. Under the sponsorship of the US Department of Energy (DOE), Oak Ridge National Laboratory, Argonne National Laboratory, GE Nuclear Energy and several universities are performing research and development in the application of advances in control theory, software engineering, advanced computer architectures, artificial intelligence, and man-machine interface analysis to control system design. The target plant concept for the work described in this paper is the Power Reactor Inherently Safe Module reactor (PRISM), an advanced modular liquid metal reactor concept. This and other reactor designs which provide strong passive responses to operational upsets or accidents afford good opportunities to apply these advances in control technology. 18 refs., 5 figs.

  8. Extreme Ultraviolet Lithography - Reflective Mask Technology

    SciTech Connect

    Walton, C.C.; Kearney, P.A.; Mirkarimi, P.B.; Bowers, J.M.; Cerjan, C.; Warrick, A.L.; Wilhelmsen, K.; Fought, E.; Moore, C.; Larson, C.; Baker, S.; Burkhart, S.C.; Hector, S.D.

    2000-05-09

    EUVL mask blanks consist of a distributed Bragg reflector made of 6.7nm-pitch bi-layers of MO and Si deposited upon a precision Si or glass substrate. The layer deposition process has been optimized for low defects, by application of a vendor-supplied but highly modified ion-beam sputter deposition system. This system is fully automated using SMIF technology to obtain the lowest possible environmental- and handling-added defect levels. Originally designed to coat 150mm substrates, it was upgraded in July, 1999 to 200 mm and has coated runs of over 50 substrates at a time with median added defects >100nm below 0.05/cm{sup 2}. These improvements have resulted from a number of ion-beam sputter deposition system modifications, upgrades, and operational changes, which will be discussed. Success in defect reduction is highly dependent upon defect detection, characterization, and cross-platform positional registration. We have made significant progress in adapting and extending commercial tools to this purpose, and have identified the surface scanner detection limits for different defect classes, and the signatures of false counts and non-printable scattering anomalies on the mask blank. We will present key results and how they have helped reduce added defects. The physics of defect reduction and mitigation is being investigated by a program on multilayer growth over deliberately placed perturbations (defects) of varying size. This program includes modeling of multilayer growth and modeling of defect printability. We developed a technique for depositing uniformly sized gold spheres on EUVL substrates, and have studied the suppression of the perturbations during multilayer growth under varying conditions. This work is key to determining the lower limit of critical defect size for EUV Lithography. We present key aspects of this work. We will summarize progress in all aspects of EUVL mask blank development, and present detailed results on defect reduction and mask blank

  9. Double-Sided Opportunities Using Chemical Lift-Off Lithography.

    PubMed

    Andrews, Anne M; Liao, Wei-Ssu; Weiss, Paul S

    2016-08-16

    We discuss the origins, motivation, invention, development, applications, and future of chemical lift-off lithography, in which a specified pattern of a self-assembled monolayer is removed, i.e., lifted off, using a reactive, patterned stamp that is brought into contact with the monolayer. For Au substrates, this process produces a supported, patterned monolayer of Au on the stamp in addition to the negative pattern in the original molecular monolayer. Both the patterned molecular monolayer on the original substrate and the patterned supported metal monolayer on the stamp are useful as materials and for further applications in sensing and other areas. Chemical lift-off lithography effectively lowers the barriers to and costs of high-resolution, large-area nanopatterning. On the patterned monolayer side, features in the single-nanometer range can be produced across large (square millimeter or larger) areas. Patterns smaller than the original stamp feature sizes can be produced by controlling the degree of contact between the stamp and the lifted-off monolayer. We note that this process is different than conventional lift-off processes in lithography in that chemical lift-off lithography removes material, whereas conventional lift-off is a positive-tone patterning method. Chemical lift-off lithography is in some ways similar to microtransfer printing. Chemical lift-off lithography has critical advantages in the preparation of biocapture surfaces because the molecules left behind are exploited to space and to orient functional(ized) molecules. On the supported metal monolayer side, a new two-dimensional material has been produced. The useful important chemical properties of Au (vis-à-vis functionalization with thiols) are retained, but the electronic and optical properties of bulk Au or even Au nanoparticles are not. These metal monolayers do not quench excitation and may be useful in optical measurements, particularly in combination with selective binding due to

  10. High speed e-beam lithography for gold nanoarray fabrication and use in nanotechnology.

    PubMed

    Trasobares, Jorge; Vaurette, François; François, Marc; Romijn, Hans; Codron, Jean-Louis; Vuillaume, Dominique; Théron, Didier; Clément, Nicolas

    2014-01-01

    E-beam lithography has been used for reliable and versatile fabrication of sub-15 nm single-crystal gold nanoarrays and led to convincing applications in nanotechnology. However, so far this technique was either too slow for centimeter to wafer-scale writing or fast enough with the so-called dot on the fly (DOTF) technique but not optimized for sub-15 nm dots dimension. This prevents use of this technology for some applications and characterization techniques. Here, we show that the DOTF technique can be used without degradation in dots dimension. In addition, we propose two other techniques. The first one is an advanced conventional technique that goes five times faster than the conventional one. The second one relies on sequences defined before writing which enable versatility in e-beam patterns compared to the DOTF technique with same writing speed. By comparing the four different techniques, we evidence the limiting parameters for the writing speed. Wafer-scale fabrication of such arrays with 50 nm pitch allowed XPS analysis of a ferrocenylalkyl thiol self-assembled monolayer coated gold nanoarray. PMID:25383303

  11. High speed e-beam lithography for gold nanoarray fabrication and use in nanotechnology

    PubMed Central

    François, Marc; Romijn, Hans; Codron, Jean-Louis; Vuillaume, Dominique; Théron, Didier; Clément, Nicolas

    2014-01-01

    Summary E-beam lithography has been used for reliable and versatile fabrication of sub-15 nm single-crystal gold nanoarrays and led to convincing applications in nanotechnology. However, so far this technique was either too slow for centimeter to wafer-scale writing or fast enough with the so-called dot on the fly (DOTF) technique but not optimized for sub-15 nm dots dimension. This prevents use of this technology for some applications and characterization techniques. Here, we show that the DOTF technique can be used without degradation in dots dimension. In addition, we propose two other techniques. The first one is an advanced conventional technique that goes five times faster than the conventional one. The second one relies on sequences defined before writing which enable versatility in e-beam patterns compared to the DOTF technique with same writing speed. By comparing the four different techniques, we evidence the limiting parameters for the writing speed. Wafer-scale fabrication of such arrays with 50 nm pitch allowed XPS analysis of a ferrocenylalkyl thiol self-assembled monolayer coated gold nanoarray. PMID:25383303

  12. Sloped irradiation techniques in deep x-ray lithography for 3D shaping of microstructures

    NASA Astrophysics Data System (ADS)

    Feiertag, Gregor; Ehrfeld, Wolfgang; Lehr, Heinz; Schmidt, Martin

    1997-07-01

    Deep x-ray lithography (DXRL) makes use of synchrotron radiation (SR) to transfer an absorber pattern from a mask into a thick resist layer. For most applications the direction of the SR beam is perpendicular to the mask and the resist plane. Subsequent replication techniques, e.g. electroforming, moulding or hot embossing, convert the resist relief obtained after development into micromechanical, microfluidic or micro- optical elements made from metals, polymers or ceramic materials. This process sequence is well known as the LIGA technique. The normal shadow printing process is complemented and enhanced by advanced techniques, e.g. by tilting the mask and the resist with respect to the SR beam or aligned multiple exposures to produce step-like structures. In this paper a technology for the fabrication of multidirectional inclined microstructures applying multiple tilted DXRL will be presented. Instead of one exposure with the mask/substrate assembly perpendicular to the SR beam, irradiation is performed several times applying tilt and rotational angles of the mask/substrate assembly relative to the SR beam. A huge variety of 3-D structures can be obtained using this technique. Some possible applications will be discussed.

  13. Sources for beyond extreme ultraviolet lithography and water window imaging

    NASA Astrophysics Data System (ADS)

    O'Sullivan, Gerry; Li, Bowen; Dunne, Padraig; Hayden, Paddy; Kilbane, Deirdre; Lokasani, Ragava; Long, Elaine; Ohashi, Hayato; O'Reilly, Fergal; Sheil, John; Sheridan, Paul; Sokell, Emma; Suzuki, Chihiro; White, Elgiva; Higashiguchi, Takeshi

    2015-05-01

    Lithography tools are being built and shipped to semiconductor manufacturers for high volume manufacturing using extreme ultraviolet lithography (EUVL) at a wavelength of 13.5 nm. This wavelength is based on the availability of Mo/Si multilayer mirrors (MLMs) with a reflectivity of ˜70% at this wavelength. Moreover, the primary lithography tool manufacturer, ASML, has identified 6.x nm, where x˜7, as the wavelength of choice for so-called Beyond EUVL, based on the availability of La/B4C MLMs, with theoretical reflectance approaching 80% at this wavelength. The optimum sources have been identified as laser produced plasmas of Gd and Tb, as n = 4-n = 4 transitions in their ions emit strongly near this wavelength. However, to date, the highest conversion efficiency obtained, for laser to EUV energy emitted within the 0.6% wavelength bandwidth of the mirror is only 0.8%, pointing to the need to identify other potential sources or consider the selection of other wavelengths. At the same time, sources for other applications are being developed. Conventional sources for soft x-ray microscopy use H-like line emission from liquid nitrogen or carbon containing liquid jets which can be focused using zone plates. Recently the possibility of using MLMs with n = 4-n = 4 emission from a highly charged Bi plasma was proposed and subsequently the possibility of using Δn = 1 transitions in 3rd row transition elements was identified. All of these studies seek to identify spectral features that coincide with the reflectance characteristics of available MLMs, determine the conditions under which they are optimized and establish the maximum conversion efficiencies obtainable. Thus, there is a need for systematic studies of laser produced plasmas of a wide range of elements as some of the challenges are similar for all of these sources and some recent results will be presented.

  14. Design and fabrication of micromirror arrays for UV lithography

    NASA Astrophysics Data System (ADS)

    Lakner, Hubert K.; Duerr, Peter; Dauderstaedt, Ulrike; Doleschal, Wolfgang; Amelung, Joerg

    2001-10-01

    Modern UV-lithography is searching for new highly parallel writing concepts. Spatial light modulation (SLM) offers such possibilities but special emphasis must be put on the ability of SLM devices to handle ultraviolet light (UV). We designed and fabricated micromirror arrays which fulfill these requirements. Possible applications for such UV-SLMs are direct writing systems for semiconductor and printing, and UV-stimulated biochemistry. For deep UV laser pattern generation (248 nm) e.g. we designed and fabricated a 2048x512 pixel UV-SLM with individually addressable aluminum micromirrors. They are illuminated by an excimer laser pulse and imaged onto a photomask substrate. A complete pattern is stitched together at a rate of 1 kHz. The minimum feature size is 320 nm and analog modulation of the pixels allows to realize an address grid of only 1.6 nm. The design of the array is modular so that other array sizes can be tailor made to customers needs. Design and fabrication aspects for a CMOS compatible realization of these micromirror arrays are addressed as well as their performance in lithography applications.

  15. Integration of plant viruses in electron beam lithography nanostructures

    NASA Astrophysics Data System (ADS)

    Alonso, Jose M.; Ondarçuhu, Thierry; Bittner, Alexander M.

    2013-03-01

    Tobacco mosaic virus (TMV) is the textbook example of a virus, and also of a self-assembling nanoscale structure. This tubular RNA/protein architecture has also found applications as biotemplate for the synthesis of nanomaterials such as wires, as tubes, or as nanoparticle assemblies. Although TMV is, being a biological structure, quite resilient to environmental conditions (temperature, chemicals), it cannot be processed in electron beam lithography (eBL) fabrication, which is the most important and most versatile method of nanoscale structuring. Here we present adjusted eBL-compatible processes that allow the incorporation of TMV in nanostructures made of positive and negative tone eBL resists. The key steps are covering TMV by polymer resists, which are only heated to 50 °C, and development (selective dissolution) in carefully selected organic solvents. We demonstrate the post-lithography biochemical functionality of TMV by selective immunocoating of the viral particles, and the use of immobilized TMV as direct immunosensor. Our modified eBL process should be applicable to incorporate a wide range of sensitive materials in nanofabrication schemes.

  16. Nanoimprint lithography: 2D or not 2D? A review

    NASA Astrophysics Data System (ADS)

    Schift, Helmut

    2015-11-01

    Nanoimprint lithography (NIL) is more than a planar high-end technology for the patterning of wafer-like substrates. It is essentially a 3D process, because it replicates various stamp topographies by 3D displacement of material and takes advantage of the bending of stamps while the mold cavities are filled. But at the same time, it keeps all assets of a 2D technique being able to pattern thin masking layers like in photon- and electron-based traditional lithography. This review reports about 20 years of development of replication techniques at Paul Scherrer Institut, with a focus on 3D aspects of molding, which enable NIL to stay 2D, but at the same time enable 3D applications which are "more than Moore." As an example, the manufacturing of a demonstrator for backlighting applications based on thermally activated selective topography equilibration will be presented. This technique allows generating almost arbitrary sloped, convex and concave profiles in the same polymer film with dimensions in micro- and nanometer scale.

  17. Advanced nanomaterials–sustainable preparation and their catalytic applications

    EPA Science Inventory

    Sustainable nanomaterials have attracted great attention as highly functionalized nanocatalysts in diverse forms including solid-supported nanocatalysts, graphene materials, and core-shell catalysts among other nanostructures. Technology advancements in last decades have allowed ...

  18. Application of advanced filtering methods to the determination of the interplanetary orbit of Mariner '71.

    NASA Technical Reports Server (NTRS)

    Rourke, K. H.; Jordan, J. F.

    1972-01-01

    This paper presents the results of the applications of advanced filtering methods to the determination of the interplanetary orbit of the Mariner '71 spacecraft. The advanced techniques are specific extensions of the Kalman filter. The special problems associated with applying these techniques are discussed and the particular algorithmic implementations are outlined. The advanced methods are compared against the weighted least squares filters of conventional application. The results reveal that relatively simple advanced filter configurations yield solutions superior to those of the conventional methods when applied to the Mariner '71 radio measurements.

  19. Application of advanced technologies to small, short-haul aircraft

    NASA Technical Reports Server (NTRS)

    Andrews, D. G.; Brubaker, P. W.; Bryant, S. L.; Clay, C. W.; Giridharadas, B.; Hamamoto, M.; Kelly, T. J.; Proctor, D. K.; Myron, C. E.; Sullivan, R. L.

    1978-01-01

    The results of a preliminary design study which investigates the use of selected advanced technologies to achieve low cost design for small (50-passenger), short haul (50 to 1000 mile) transports are reported. The largest single item in the cost of manufacturing an airplane of this type is labor. A careful examination of advanced technology to airframe structure was performed since one of the most labor-intensive parts of the airplane is structures. Also, preliminary investigation of advanced aerodynamics flight controls, ride control and gust load alleviation systems, aircraft systems and turbo-prop propulsion systems was performed. The most beneficial advanced technology examined was bonded aluminum primary structure. The use of this structure in large wing panels and body sections resulted in a greatly reduced number of parts and fasteners and therefore, labor hours. The resultant cost of assembled airplane structure was reduced by 40% and the total airplane manufacturing cost by 16% - a major cost reduction. With further development, test verification and optimization appreciable weight saving is also achievable. Other advanced technology items which showed significant gains are as follows: (1) advanced turboprop-reduced block fuel by 15.30% depending on range; (2) configuration revisions (vee-tail)-empennage cost reduction of 25%; (3) leading-edge flap addition-weight reduction of 2500 pounds.

  20. [Depression screening and possible applications of advance care planning].

    PubMed

    Wada, Taizo

    2013-01-01

    Depression screening was conducted to determine the health status of community-dwelling elderly individuals, and the concept of advance care planning was introduced. While depression screening among the elderly often uses the Geriatric Depression Scale, a single question regarding depressive mood also provides a valid measure of depression in elderly persons. Depression is associated with lower activities of daily living, competence, and subjective quality of life among the elderly living in Vietnam and Indonesia, as well as in Japan. Advance care planning is a process of discussion between individuals and their care providers to make decisions about future care preferences and priorities, while they are still capable. If they wish, they may prepare an advance directive to inform others about their decisions and best interests, such as a written advance decision to refuse treatment and/or appointment of a person with lasting powers of attorney. The purpose of advance care planning is to enable elderly persons to receive better end-of-life care. To promote introduction of advance care planning in Japan, voluntary discussion among family members should be encouraged. PMID:23979330