Science.gov

Sample records for advanced microelectronic devices

  1. Photoemission-based microelectronic devices

    PubMed Central

    Forati, Ebrahim; Dill, Tyler J.; Tao, Andrea R.; Sievenpiper, Dan

    2016-01-01

    The vast majority of modern microelectronic devices rely on carriers within semiconductors due to their integrability. Therefore, the performance of these devices is limited due to natural semiconductor properties such as band gap and electron velocity. Replacing the semiconductor channel in conventional microelectronic devices with a gas or vacuum channel may scale their speed, wavelength and power beyond what is available today. However, liberating electrons into gas/vacuum in a practical microelectronic device is quite challenging. It often requires heating, applying high voltages, or using lasers with short wavelengths or high powers. Here, we show that the interaction between an engineered resonant surface and a low-power infrared laser can cause enough photoemission via electron tunnelling to implement feasible microelectronic devices such as transistors, switches and modulators. The proposed photoemission-based devices benefit from the advantages of gas-plasma/vacuum electronic devices while preserving the integrability of semiconductor-based devices. PMID:27811946

  2. Photoemission-based microelectronic devices

    NASA Astrophysics Data System (ADS)

    Forati, Ebrahim; Dill, Tyler J.; Tao, Andrea R.; Sievenpiper, Dan

    2016-11-01

    The vast majority of modern microelectronic devices rely on carriers within semiconductors due to their integrability. Therefore, the performance of these devices is limited due to natural semiconductor properties such as band gap and electron velocity. Replacing the semiconductor channel in conventional microelectronic devices with a gas or vacuum channel may scale their speed, wavelength and power beyond what is available today. However, liberating electrons into gas/vacuum in a practical microelectronic device is quite challenging. It often requires heating, applying high voltages, or using lasers with short wavelengths or high powers. Here, we show that the interaction between an engineered resonant surface and a low-power infrared laser can cause enough photoemission via electron tunnelling to implement feasible microelectronic devices such as transistors, switches and modulators. The proposed photoemission-based devices benefit from the advantages of gas-plasma/vacuum electronic devices while preserving the integrability of semiconductor-based devices.

  3. Electrochemical investigations of advanced materials for microelectronic and energy storage devices

    NASA Astrophysics Data System (ADS)

    Goonetilleke, Pubudu Chaminda

    A broad range of electrochemical techniques are employed in this work to study a selected set of advanced materials for applications in microelectronics and energy storage devices. The primary motivation of this study has been to explore the capabilities of certain modern electrochemical techniques in a number of emerging areas of material processing and characterization. The work includes both aqueous and non-aqueous systems, with applications in two rather general areas of technology, namely microelectronics and energy storage. The sub-systems selected for investigation are: (i) Electrochemical mechanical and chemical mechanical planarization (ECMP and CMP, respectively), (ii) Carbon nanotubes in combination with room temperature ionic liquids (ILs), and (iii) Cathode materials for high-performance Li ion batteries. The first group of systems represents an important building block in the fabrication of microelectronic devices. The second and third groups of systems are relevant for new energy storage technologies, and have generated immense interests in recent years. A common feature of these different systems is that they all are associated with complex surface reactions that dictate the performance of the devices based on them. Fundamental understanding of these reactions is crucial to further development and expansion of their associated technologies. It is the complex mechanistic details of these surface reactions that we address using a judicious combination of a number of state of the art electrochemical techniques. The main electrochemical techniques used in this work include: (i) Cyclic voltammetry (CV) and slow scan cyclic voltammetry (SSCV, a special case of CV); (ii) Galvanostatic (or current-controlled) measurements; (iii) Electrochemical impedance spectroscopy (EIS), based on two different methodologies, namely, Fourier transform EIS (FT-EIS, capable of studying fast reaction kinetics in a time-resolved mode), and EIS using frequency response

  4. Reliability and qualification of advanced microelectronics for space applications

    NASA Technical Reports Server (NTRS)

    Kayali, S.

    2003-01-01

    This paper provides a discussion of the subject and an approach to establish a reliability and qualification methodology to facilitate the utilization of state-of-the-art advanced microelectronic devices and structures in high reliability applications.

  5. Protection of microelectronic devices during packaging

    DOEpatents

    Peterson, Kenneth A.; Conley, William R.

    2002-01-01

    The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

  6. Microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2002-01-01

    An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a cofired ceramic frame or body. The package can have an internal stepped structure made of one or more plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination.

  7. Nanoscale temperature mapping in operating microelectronic devices

    DOE PAGES

    Mecklenburg, Matthew; Hubbard, William A.; White, E. R.; ...

    2015-02-05

    We report that modern microelectronic devices have nanoscale features that dissipate power nonuniformly, but fundamental physical limits frustrate efforts to detect the resulting temperature gradients. Contact thermometers disturb the temperature of a small system, while radiation thermometers struggle to beat the diffraction limit. Exploiting the same physics as Fahrenheit’s glass-bulb thermometer, we mapped the thermal expansion of Joule-heated, 80-nanometer-thick aluminum wires by precisely measuring changes in density. With a scanning transmission electron microscope (STEM) and electron energy loss spectroscopy (EELS), we quantified the local density via the energy of aluminum’s bulk plasmon. Rescaling density to temperature yields maps with amore » statistical precision of 3 kelvin/hertz₋1/2, an accuracy of 10%, and nanometer-scale resolution. Lastly, many common metals and semiconductors have sufficiently sharp plasmon resonances to serve as their own thermometers.« less

  8. Nanoscale temperature mapping in operating microelectronic devices

    SciTech Connect

    Mecklenburg, Matthew; Hubbard, William A.; White, E. R.; Dhall, Rohan; Cronin, Stephen B.; Aloni, Shaul; Regan, B. C.

    2015-02-05

    We report that modern microelectronic devices have nanoscale features that dissipate power nonuniformly, but fundamental physical limits frustrate efforts to detect the resulting temperature gradients. Contact thermometers disturb the temperature of a small system, while radiation thermometers struggle to beat the diffraction limit. Exploiting the same physics as Fahrenheit’s glass-bulb thermometer, we mapped the thermal expansion of Joule-heated, 80-nanometer-thick aluminum wires by precisely measuring changes in density. With a scanning transmission electron microscope (STEM) and electron energy loss spectroscopy (EELS), we quantified the local density via the energy of aluminum’s bulk plasmon. Rescaling density to temperature yields maps with a statistical precision of 3 kelvin/hertz₋1/2, an accuracy of 10%, and nanometer-scale resolution. Lastly, many common metals and semiconductors have sufficiently sharp plasmon resonances to serve as their own thermometers.

  9. Bi-level microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2004-01-06

    A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The multilayered package can be formed of a LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded so that the light-sensitive side is optically accessible through the window. The package has at least two levels of circuits for making electrical interconnections to a pair of microelectronic devices. The result is a compact, low-profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device(s).

  10. Single level microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2003-12-09

    A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.

  11. Adaptive Mesh Refinement for Microelectronic Device Design

    NASA Technical Reports Server (NTRS)

    Cwik, Tom; Lou, John; Norton, Charles

    1999-01-01

    Finite element and finite volume methods are used in a variety of design simulations when it is necessary to compute fields throughout regions that contain varying materials or geometry. Convergence of the simulation can be assessed by uniformly increasing the mesh density until an observable quantity stabilizes. Depending on the electrical size of the problem, uniform refinement of the mesh may be computationally infeasible due to memory limitations. Similarly, depending on the geometric complexity of the object being modeled, uniform refinement can be inefficient since regions that do not need refinement add to the computational expense. In either case, convergence to the correct (measured) solution is not guaranteed. Adaptive mesh refinement methods attempt to selectively refine the region of the mesh that is estimated to contain proportionally higher solution errors. The refinement may be obtained by decreasing the element size (h-refinement), by increasing the order of the element (p-refinement) or by a combination of the two (h-p refinement). A successful adaptive strategy refines the mesh to produce an accurate solution measured against the correct fields without undue computational expense. This is accomplished by the use of a) reliable a posteriori error estimates, b) hierarchal elements, and c) automatic adaptive mesh generation. Adaptive methods are also useful when problems with multi-scale field variations are encountered. These occur in active electronic devices that have thin doped layers and also when mixed physics is used in the calculation. The mesh needs to be fine at and near the thin layer to capture rapid field or charge variations, but can coarsen away from these layers where field variations smoothen and charge densities are uniform. This poster will present an adaptive mesh refinement package that runs on parallel computers and is applied to specific microelectronic device simulations. Passive sensors that operate in the infrared portion of

  12. Advanced Microelectronics Technologies for Future Small Satellite Systems

    NASA Technical Reports Server (NTRS)

    Alkalai, Leon

    1999-01-01

    Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies. Whereas these technological advances are being fueled by the commercial (non-space) industries, more recently there has been an exciting new synergism evolving between the two otherwise disjointed markets. In other words, both the commercial and space industries are enabled by advances in low-power, highly integrated, miniaturized (low-volume), lightweight, and reliable real-time embedded systems. Recent announcements by commercial semiconductor manufacturers to introduce Silicon On Insulator (SOI) technology into their commercial product lines is driven by the need for high-performance low-power integrated devices. Moreover, SOI has been the technology of choice for many space semiconductor manufacturers where radiation requirements are critical. This technology has inherent radiation latch-up immunity built into the process, which makes it very attractive to space applications. In this paper, we describe the advanced microelectronics and avionics technologies under development by NASA's Deep Space Systems Technology Program (also known as X2000). These technologies are of significant benefit to both the commercial satellite as well as the deep-space and Earth orbiting science missions. Such a synergistic technology roadmap may truly enable quick turn-around, low-cost, and highly capable small satellite systems for both Earth observation as well as deep-space missions.

  13. Multilayered Microelectronic Device Package With An Integral Window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2004-10-26

    A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.

  14. Optimization of Microelectronic Devices for Sensor Applications

    NASA Technical Reports Server (NTRS)

    Cwik, Tom; Klimeck, Gerhard

    2000-01-01

    The NASA/JPL goal to reduce payload in future space missions while increasing mission capability demands miniaturization of active and passive sensors, analytical instruments and communication systems among others. Currently, typical system requirements include the detection of particular spectral lines, associated data processing, and communication of the acquired data to other systems. Advances in lithography and deposition methods result in more advanced devices for space application, while the sub-micron resolution currently available opens a vast design space. Though an experimental exploration of this widening design space-searching for optimized performance by repeated fabrication efforts-is unfeasible, it does motivate the development of reliable software design tools. These tools necessitate models based on fundamental physics and mathematics of the device to accurately model effects such as diffraction and scattering in opto-electronic devices, or bandstructure and scattering in heterostructure devices. The software tools must have convenient turn-around times and interfaces that allow effective usage. The first issue is addressed by the application of high-performance computers and the second by the development of graphical user interfaces driven by properly developed data structures. These tools can then be integrated into an optimization environment, and with the available memory capacity and computational speed of high performance parallel platforms, simulation of optimized components can proceed. In this paper, specific applications of the electromagnetic modeling of infrared filtering, as well as heterostructure device design will be presented using genetic algorithm global optimization methods.

  15. Temporary coatings for protection of microelectronic devices during packaging

    DOEpatents

    Peterson, Kenneth A.; Conley, William R.

    2005-01-18

    The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

  16. Sealed symmetric multilayered microelectronic device package with integral windows

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2002-01-01

    A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.

  17. Life cycle assessment applied to the sector of microelectronic devices

    NASA Astrophysics Data System (ADS)

    Matarazzo, Agata; Ingrao, Carlo; Clasadonte, Maria Teresa

    2016-07-01

    This work is about the application of LCA to the ends of the environmental assessment of pure-silicon wafers production. The input-data quantification is realized studying two microelectronic devices and presenting schematically tables and graphs, to be easily interpreted. This will allow help the reader to individuate, clearly and immediately, the materials flows and the relationships among the different steps of the production process. The material flows, in terms of raw materials use and energy consumption, were studied using the data provided by a firm involved in the microelectronic device production field. The two devices environmental analysis was developed considering potential effects such as Acidification, Eutrophication, Ozone reduction, Global warming, Ozone photochemical formation, Human Toxicity.

  18. Multilayered microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2003-01-01

    An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination. The integral window can further include a lens for optically transforming light passing through the window. The package can include an array of binary optic lenslets made integral with the window. The package can include an electrically-switched optical modulator, such as a lithium niobate window attached to the package, for providing a very fast electrically-operated shutter.

  19. Gold-based electrical interconnections for microelectronic devices

    DOEpatents

    Peterson, Kenneth A.; Garrett, Stephen E.; Reber, Cathleen A.; Watson, Robert D.

    2002-01-01

    A method of making an electrical interconnection from a microelectronic device to a package, comprising ball or wedge compression bonding a gold-based conductor directly to a silicon surface, such as a polysilicon bonding pad in a MEMS or IMEMS device, without using layers of aluminum or titanium disposed in-between the conductor and the silicon surface. After compression bonding, optional heating of the bond above 363 C. allows formation of a liquid gold-silicon eutectic phase containing approximately 3% (by weight) silicon, which significantly improves the bond strength by reforming and enhancing the initial compression bond. The same process can be used for improving the bond strength of Au--Ge bonds by forming a liquid Au-12Ge eutectic phase.

  20. Raman Imaging in Semiconductor Physics: Applications to Microelectronic Materials and Devices

    NASA Astrophysics Data System (ADS)

    Tiberj, Antoine; Camassel, Jean

    The unique versatility of micro-Raman spectroscopy (\\upmu RS) in semiconductor physics remains in Raman imaging. Numerous applications cover the whole development of modern electronic and optoelectronic devices: from semiconductor growth to advanced device inspection tools. In this chapter, a wide variety of semiconductors (SiC, graphene, GaN, GaAs, SiGe, strained Si, sSOI, SGOI) and devices (FETs, lasers, MEMS) are addressed. First, it will be shown how Raman mapping enables to check the crystalline quality, the composition, the doping, and the uniformity of as-grown semiconductors. Then, we will focus on the most popular application in microelectronics: strain measurements either at the device or at the full wafer scale. Finally, we will show how \\upmu RS imaging can be used for final device inspection through the temperature mapping of operating devices (FETs, lasers, actuators).

  1. Symmetric miniaturized heating system for active microelectronic devices

    NASA Astrophysics Data System (ADS)

    McCracken, Michael; Mayer, Michael; Jourard, Isaac; Moon, Jeong-Tak; Persic, John

    2010-07-01

    To qualify interconnect technologies such as microelectronic fine wire bonds for mass production of integrated circuit (IC) packages, it is necessary to perform accelerated aging tests, e.g., to age a device at an elevated temperature or to subject the device to thermal cycling and measure the decrease of interconnect quality. There are downsides to using conventional ovens for this as they are relatively large and have relatively slow temperature change rates, and if electrical connections are required between monitoring equipment and the device being heated, they must be located inside the oven and may be aged by the high temperatures. Addressing these downsides, a miniaturized heating system (minioven) is presented, which can heat individual IC packages containing the interconnects to be tested. The core of this system is a piece of copper cut from a square shaped tube with high resistance heating wire looped around it. Ceramic dual in-line packages are clamped against either open end of the core. One package contains a Pt100 temperature sensor and the other package contains the device to be aged placed in symmetry to the temperature sensor. According to the temperature detected by the Pt100, a proportional-integral-derivative controller adjusts the power supplied to the heating wire. The system maintains a dynamic temperature balance with the core hot and the two symmetric sides with electrical connections to the device under test at a cooler temperature. Only the face of the package containing the device is heated, while the socket holding it remains below 75 °C when the oven operates at 200 °C. The minioven can heat packages from room temperature up to 200 °C in less than 5 min and maintain this temperature at 28 W power. During long term aging, a temperature of 200 °C was maintained for 1120 h with negligible resistance change of the heating wires after 900 h (heating wire resistance increased 0.2% over the final 220 h). The device is also subjected to

  2. Symmetric miniaturized heating system for active microelectronic devices.

    PubMed

    McCracken, Michael; Mayer, Michael; Jourard, Isaac; Moon, Jeong-Tak; Persic, John

    2010-07-01

    To qualify interconnect technologies such as microelectronic fine wire bonds for mass production of integrated circuit (IC) packages, it is necessary to perform accelerated aging tests, e.g., to age a device at an elevated temperature or to subject the device to thermal cycling and measure the decrease of interconnect quality. There are downsides to using conventional ovens for this as they are relatively large and have relatively slow temperature change rates, and if electrical connections are required between monitoring equipment and the device being heated, they must be located inside the oven and may be aged by the high temperatures. Addressing these downsides, a miniaturized heating system (minioven) is presented, which can heat individual IC packages containing the interconnects to be tested. The core of this system is a piece of copper cut from a square shaped tube with high resistance heating wire looped around it. Ceramic dual in-line packages are clamped against either open end of the core. One package contains a Pt100 temperature sensor and the other package contains the device to be aged placed in symmetry to the temperature sensor. According to the temperature detected by the Pt100, a proportional-integral-derivative controller adjusts the power supplied to the heating wire. The system maintains a dynamic temperature balance with the core hot and the two symmetric sides with electrical connections to the device under test at a cooler temperature. Only the face of the package containing the device is heated, while the socket holding it remains below 75 degrees C when the oven operates at 200 degrees C. The minioven can heat packages from room temperature up to 200 degrees C in less than 5 min and maintain this temperature at 28 W power. During long term aging, a temperature of 200 degrees C was maintained for 1120 h with negligible resistance change of the heating wires after 900 h (heating wire resistance increased 0.2% over the final 220 h). The

  3. Evaluation of advanced microelectronics for inclusion in MIL-STD-975

    NASA Astrophysics Data System (ADS)

    Scott, W. Richard

    1991-03-01

    The approach taken by NASA and JPL (Jet Propulsion Laboratory) in the development of a MIL-STD-975 section which contains advanced technology such as Large Scale Integration and Very Large Scale Integration (LSI/VLSI) microelectronic devices is described. The parts listed in this section are recommended as satisfactory for NASA flight applications, in the absence of alternate qualified devices, based on satisfactory results of a vendor capability audit, the availability of sufficient characterization and reliability data from the manufacturers and users and negotiated detail procurement specifications. The criteria used in the selection and evaluation of the vendors and candidate parts, the preparation of procurement specifications, and the status of this activity are discussed.

  4. Evaluation of advanced microelectronics for inclusion in MIL-STD-975

    NASA Technical Reports Server (NTRS)

    Scott, W. Richard

    1991-01-01

    The approach taken by NASA and JPL (Jet Propulsion Laboratory) in the development of a MIL-STD-975 section which contains advanced technology such as Large Scale Integration and Very Large Scale Integration (LSI/VLSI) microelectronic devices is described. The parts listed in this section are recommended as satisfactory for NASA flight applications, in the absence of alternate qualified devices, based on satisfactory results of a vendor capability audit, the availability of sufficient characterization and reliability data from the manufacturers and users and negotiated detail procurement specifications. The criteria used in the selection and evaluation of the vendors and candidate parts, the preparation of procurement specifications, and the status of this activity are discussed.

  5. Microelectronic superconducting device with multi-layer contact

    DOEpatents

    Wellstood, Frederick C.; Kingston, John J.; Clarke, John

    1993-01-01

    A microelectronic component comprising a crossover is provided comprising a substrate, a first high T.sub.c superconductor thin film, a second insulating thin film comprising SrTiO.sub.3 ; and a third high T.sub.c superconducting film which has strips which crossover one or more areas of the first superconductor film. An insitu method for depositing all three films on a substrate is provided which does not require annealing steps. The photolithographic process is used to separately pattern the high T.sub.c superconductor thin films.

  6. Microelectronic superconducting device with multi-layer contact

    DOEpatents

    Wellstood, F.C.; Kingston, J.J.; Clarke, J.

    1993-10-26

    A microelectronic component comprising a crossover is provided comprising a substrate, a first high T[sub c] superconductor thin film, a second insulating thin film comprising SrTiO[sub 3] ; and a third high T[sub c] superconducting film which has strips which crossover one or more areas of the first superconductor film. An in situ method for depositing all three films on a substrate is provided which does not require annealing steps. The photolithographic process is used to separately pattern the high T[sub c] superconductor thin films. 14 figures.

  7. Radiation hardness improvement of analog front-end microelectronic devices for particle accelerator

    NASA Astrophysics Data System (ADS)

    Miroshnichenko, A. G.; Rodin, A. S.; Bakerenkov, A. S.; Felitsyn, V. A.

    2016-10-01

    Series of schematic techniques for increasing radiation hardness of the current mirrors is developed. These techniques can be used for the design of analog front-end microelectronic devices based on the operational amplifiers. The circuit simulation of radiation degradation of current transmission coefficients was performed for various circuit solutions in LTSpice software.

  8. Bi-level multilayered microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2002-01-01

    A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that the light-sensitive side is optically accessible through the window. A second chip can be bonded to the backside of the first chip, with the second chip being wirebonded to the second level of the bi-level package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed.

  9. Lithium and lithium ion batteries for applications in microelectronic devices: A review

    NASA Astrophysics Data System (ADS)

    Wang, Yuxing; Liu, Bo; Li, Qiuyan; Cartmell, Samuel; Ferrara, Seth; Deng, Zhiqun Daniel; Xiao, Jie

    2015-07-01

    Batteries employing lithium chemistry have been intensively investigated because of their high energy attributes which may be deployed for vehicle electrification and large-scale energy storage applications. Another important direction of battery research for micro-electronics, however, is relatively less discussed in the field but growing fast in recent years. This paper reviews chemistry and electrochemistry in different microbatteries along with their cell designs to meet the goals of their various applications. The state-of-the-art knowledge and recent progress of microbatteries for emerging micro-electronic devices may shed light on the future development of microbatteries towards high energy density and flexible design.

  10. Spoked-ring microcavities: enabling seamless integration of nanophotonics in unmodified advanced CMOS microelectronics chips

    NASA Astrophysics Data System (ADS)

    Wade, Mark T.; Shainline, Jeffrey M.; Orcutt, Jason S.; Ram, Rajeev J.; Stojanovic, Vladimir; Popovic, Milos A.

    2014-03-01

    We present the spoked-ring microcavity, a nanophotonic building block enabling energy-efficient, active photonics in unmodified, advanced CMOS microelectronics processes. The cavity is realized in the IBM 45nm SOI CMOS process - the same process used to make many commercially available microprocessors including the IBM Power7 and Sony Playstation 3 processors. In advanced SOI CMOS processes, no partial etch steps and no vertical junctions are available, which limits the types of optical cavities that can be used for active nanophotonics. To enable efficient active devices with no process modifications, we designed a novel spoked-ring microcavity which is fully compatible with the constraints of the process. As a modulator, the device leverages the sub-100nm lithography resolution of the process to create radially extending p-n junctions, providing high optical fill factor depletion-mode modulation and thereby eliminating the need for a vertical junction. The device is made entirely in the transistor active layer, low-loss crystalline silicon, which eliminates the need for a partial etch commonly used to create ridge cavities. In this work, we present the full optical and electrical design of the cavity including rigorous mode solver and FDTD simulations to design the Qlimiting electrical contacts and the coupling/excitation. We address the layout of active photonics within the mask set of a standard advanced CMOS process and show that high-performance photonic devices can be seamlessly monolithically integrated alongside electronics on the same chip. The present designs enable monolithically integrated optoelectronic transceivers on a single advanced CMOS chip, without requiring any process changes, enabling the penetration of photonics into the microprocessor.

  11. Method of fabricating a microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2003-01-01

    A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.

  12. Reliability of Small Geometry VLSI Devices for Microelectronics

    DTIC Science & Technology

    1992-02-15

    initiative under Re iable Advanced Electronics. The SDIO agent for the project has beer Dr. Clifford Lau and the ONR technical officer has been Dr. Al...oceration Is DaK -ne ngo ch arge from ’The nitrice tracs r*,o ,lie Siiicon bands. Th.e ac-,-.ai cn;-arce distribution i’n :he nitride is a ’,uncicn of

  13. Development of cost-effective biocompatible packaging for microelectronic devices.

    PubMed

    Qian, Karen; Malachowski, Karl; Fiorini, Paolo; Velenis, Dimitrios; de Beeck, Maaike Op; Van Hoof, Chris

    2011-01-01

    A cost-effective, miniaturized and biocompatible packaging method for medical devices is proposed, resulting in a small, soft and comfortable implantable package. Towards this end, the barrier materials and fabrication process for the individual die encapsulation are largely explored. We demonstrate that various common clean room materials are good candidates for preventing metal leaching into body. In accelerated tests at higher temperature, several conductive barrier materials are damaged by the test bio-fluid, suggesting insufficient resistance to body fluids in long term. Covering electrodes by noble metals will solve this problem. For metallization, noble metals as Pt are best candidates. CoO calculations showed that selective plating of Pt is more cost-effective than sputtering. To reduce the cost of a sputter process, Pt recycling is very important.

  14. Advanced modeling and simulation to design and manufacture high performance and reliable advanced microelectronics and microsystems.

    SciTech Connect

    Nettleship, Ian (University of Pittsburgh, Pittsburgh, PA); Hinklin, Thomas; Holcomb, David Joseph; Tandon, Rajan; Arguello, Jose Guadalupe, Jr.; Dempsey, James Franklin; Ewsuk, Kevin Gregory; Neilsen, Michael K.; Lanagan, Michael (Pennsylvania State University, University Park, PA)

    2007-07-01

    An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The team's efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in ''real systems'', including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.

  15. Reliability of small geometry VLSI devices for microelectronics

    NASA Astrophysics Data System (ADS)

    White, Marvin H.

    1992-02-01

    This proposal is a continuation of a project which began in August 1986. The goal of the project, in a broad sense, is to perform exploratory research into the physics of carriers in silicon inversion layers with a focus on the issues which affect the reliability of small geometry VLSI devices. This project permits us to study the physical electronics of silicon surfaces and the overlying insulators. In the proposed project we stress the application of this research to the area of Wafer Scale Integration where reliability and fault tolerance are key issues for the SDI program. The extensive signal processing and data storage required to implement high-resolution, sensor-based systems demands that consideration be given to the area of system and component reliability. At the component level the issues revolve around the reliability of the scaled MOS Transistor with nanometric feature sizes. One important area is the susceptibility of the gate insulator to (1) hot electron trapping, (2) premature dielectric breakdown, and (3) space radiation environment considerations which can limit the MTTF of the SDIO mission. A second issue at the component level is the SDI need for low-power, high-density, nonvolatile data storage with nondestructive readout (NDRO), radiation tolerance and immunity to single event upsets (SEU's).

  16. Geckoprinting: assembly of microelectronic devices on unconventional surfaces by transfer printing with isolated gecko setal arrays.

    PubMed

    Jeong, Jaeyoung; Kim, Juho; Song, Kwangsun; Autumn, Kellar; Lee, Jongho

    2014-10-06

    Developing electronics in unconventional forms provides opportunities to expand the use of electronics in diverse applications including bio-integrated or implanted electronics. One of the key challenges lies in integrating semiconductor microdevices onto unconventional substrates without glue, high pressure or temperature that may cause damage to microdevices, substrates or interfaces. This paper describes a solution based on natural gecko setal arrays that switch adhesion mechanically on and off, enabling pick and place manipulation of thin microscale semiconductor materials onto diverse surfaces including plants and insects whose surfaces are usually rough and irregular. A demonstration of functional 'geckoprinted' microelectronic devices provides a proof of concept of our results in practical applications.

  17. Delayering of Microelectronic Devices Using an Adjustable Broad-Beam Ion Source

    NASA Astrophysics Data System (ADS)

    Robins, A. C.; Cerchiara, R. R.; Fischione, P. E.; Boccabella, M. F.; Matesa, J. M.; Marsh, L. M.; Zhang, Z.

    2013-11-01

    Analysis of the integrated circuits of a microelectronic device depends on delayering. Focused ion beam (FIB) or broad ion beam (BIB) milling are effective complementary methods of delayering. FIB provides higher removal rates, but is limited in the effective area that can be revealed per unit time, while BIB provides lower removal rates, but has the advantage with respect to the size of the field of view produced. Microstructural features and the appearance of defects were identified and tracked for two model systems: Cu vias and Cu TSVs (through-silicon vias).

  18. Simulation of ion beam induced current in radiation detectors and microelectronic devices.

    SciTech Connect

    Vizkelethy, Gyorgy

    2009-10-01

    Ionizing radiation is known to cause Single Event Effects (SEE) in a variety of electronic devices. The mechanism that leads to these SEEs is current induced by the radiation in these devices. While this phenomenon is detrimental in ICs, this is the basic mechanism behind the operation of semiconductor radiation detectors. To be able to predict SEEs in ICs and detector responses we need to be able to simulate the radiation induced current as the function of time. There are analytical models, which work for very simple detector configurations, but fail for anything more complex. On the other end, TCAD programs can simulate this process in microelectronic devices, but these TCAD codes costs hundreds of thousands of dollars and they require huge computing resources. In addition, in certain cases they fail to predict the correct behavior. A simulation model based on the Gunn theorem was developed and used with the COMSOL Multiphysics framework.

  19. Simulation of ion beam induced current in radiation detectors and microelectronic devices.

    SciTech Connect

    Vizkelethy, Gyorgy

    2010-07-01

    Ionizing radiation is known to cause Single Event Effects (SEE) in a variety of electronic devices. The mechanism that leads to these SEEs is current induced by the radiation in these devices. While this phenomenon is detrimental in ICs, this is the basic mechanism behind the operation of semiconductor radiation detectors. To be able to predict SEEs in ICs and detector responses we need to be able to simulate the radiation induced current as the function of time. There are analytical models, which work for very simple detector configurations, but fail for anything more complex. On the other end, TCAD programs can simulate this process in microelectronic devices, but these TCAD codes costs hundreds of thousands of dollars and they require huge computing resources. In addition, in certain cases they fail to predict the correct behavior. A simulation model based on the Gunn theorem was developed and used with the COMSOL Multiphysics framework.

  20. Advanced Laser Chemical Processing For Microelectronics and Integrated Optics

    DTIC Science & Technology

    1992-08-15

    Barbara, CA (June 25-27, 1990). 15. R.M. Osgood, Jr., " Laser - Fabrication for Integrated Electronics and Optics," OITDA Conference, Tokyo, Japan, (July 5...Society Meeting, Boston, MA, November 26 - December 3, 1990. 20. R.M. Osgood, Jr., "Advances in Laser Fabrication for Solid-State Electronics and...Thin, Excimer Laser-Deposited Cd Interlayers," J. Elec. Mat. 12, 1239 (July, 1990). 14. R.M. Osgood, Jr., " Laser - Fabrication for Solid State

  1. Advanced system on a chip microelectronics for spacecraft and science instruments

    NASA Astrophysics Data System (ADS)

    Paschalidis, Nikolaos P.

    2003-01-01

    instruments, etc. Common measurements that apply to many of these instruments are precise time interval measurement and high resolution read-out of solid state detectors. A precise time interval measurement chip was specially developed that achieves ˜100 ps (×10 improvement) time resolution at a power dissipation ˜20 mW (×50 improvement), dead time ˜1.5 μs (×20 improvement), and chip die size 5 mm×5 mm versus two 20 cm×20 cm doubled sided boards. This device is selected as a key enabling technology for several NASA particle, delay line imaging, and laser range finding instruments onboard (NASA Image, Messenger, etc. missions). Another device with universal application is radiation energy read-out from solid state detectors. Multi-channel low-power and end-to-end sensor input—digital output is key for the new generation instruments. The readout channel comprises of a Charge Sensitive Preamplifier with a target sensitivity of ˜1 KeV FWHM at 20 pf detector capacitance, a Shaper Amplifier with programmable time constant/gain, and an ADC. The read-out chip together with the precise time interval chip comprises the essential elements of a common particle spectroscopy instrument. To mention some more applications fast-signal acquisition—and digitization is a very useful function for a category of instrument such as mass spectroscopy and profile laser rangefinding. The single chip approach includes a high bandwidth preamplifier, fast sampling ˜5 ns, analog memory ˜10K locations, 12-bit ADC and serial/parallel I/Os. The wealth of the applications proves the advanced microelectronics field as a key enabling technology for the new millennium space exploration.

  2. Center for space microelectronics technology

    NASA Technical Reports Server (NTRS)

    1993-01-01

    The 1992 Technical Report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the center during the past year. The report lists 187 publications, 253 presentations, and 111 new technology reports and patents in the areas of solid-state devices, photonics, advanced computing, and custom microcircuits.

  3. Microelectronics technology

    NASA Astrophysics Data System (ADS)

    Sidorovyy, M.

    1985-08-01

    To develop at a leading pace the production of high-speed control and computational systems, peripheral equipment and software for these, electronic devices for control and telemechanics applications, a nation must have a strong microelectronics industry. The world of microelectronics created by man is one of fantastic possibilities and its horizons broaden daily. It is undergoing a process of interlocking growth and of introduction into our daily lives as well as into many fields of human endeavor. Microelectronics is a catalyst for technical progress. It provides artificial intelligence for robots and systems of robots, for automated systems used in control, teaching, design and computing applications, spacecraft and production facilities. A country's economic might and defensive capability are defined by the scale at which it produces pure and ultrapure substances and materials, including semiconductor and metallic crystals.

  4. Geckoprinting: assembly of microelectronic devices on unconventional surfaces by transfer printing with isolated gecko setal arrays

    PubMed Central

    Jeong, Jaeyoung; Kim, Juho; Song, Kwangsun; Autumn, Kellar; Lee, Jongho

    2014-01-01

    Developing electronics in unconventional forms provides opportunities to expand the use of electronics in diverse applications including bio-integrated or implanted electronics. One of the key challenges lies in integrating semiconductor microdevices onto unconventional substrates without glue, high pressure or temperature that may cause damage to microdevices, substrates or interfaces. This paper describes a solution based on natural gecko setal arrays that switch adhesion mechanically on and off, enabling pick and place manipulation of thin microscale semiconductor materials onto diverse surfaces including plants and insects whose surfaces are usually rough and irregular. A demonstration of functional ‘geckoprinted’ microelectronic devices provides a proof of concept of our results in practical applications. PMID:25056216

  5. Silicon carbide: The premier paradigm for structural and microelectronic device applications in severe environments

    SciTech Connect

    Davis, R.F.

    1996-12-31

    The extreme thermal, mechanical, corrosion resistant and electronic properties of SiC provide multiplicative combinations of attributes which allow a variety of products for very different applications. The emphasis herein will be the consideration of both the constant stress creep properties of several types of polycrystalline SiC materials and the characteristics of different SiC-based devices having high power, high frequency and switching applications and which are operational at {ge} 573 K. The controlling mechanism in reaction-bonded SiC within the ranges of temperature and stress of 1,848 K--1,923 K and 110--220 MPa, respectively, is glide/climb controlled by climb. The controlling creep mechanism in CVD material at T < 1,873 K is dislocation glide controlled by the Peierls stress; above this temperature, the evidence suggests that dislocation glide/climb controlled by climb becomes an increasingly important mechanism. For sintered {alpha}-SiC within the respective temperature and stress ranges of 1,670 K--2,073 K and 138--414 MPa, the controlling creep mechanism are grain boundary sliding accommodated by grain boundary diffusion at T < 1,800 K and lattice diffusion at T > 1,920 K. By contrast, the continual development of SiC thin film deposition and the device related technologies of doping, contacts and dry etching have culminated in a host of microelectronic devices operable at high temperatures, namely, MOSFET high power devices, MESFET high frequency devices, and switches including p-n junctions and thyristors. The properties of selected devices and circuits made from them are described with an emphasis on their operation at high temperature. 52 refs., 7 figs.

  6. Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

    NASA Technical Reports Server (NTRS)

    Mandal, R. P.

    1976-01-01

    Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

  7. Listening to Brain Microcircuits for Interfacing With External World—Progress in Wireless Implantable Microelectronic Neuroengineering Devices

    PubMed Central

    Nurmikko, Arto V.; Donoghue, John P.; Hochberg, Leigh R.; Patterson, William R.; Song, Yoon-Kyu; Bull, Christopher W.; Borton, David A.; Laiwalla, Farah; Park, Sunmee; Ming, Yin; Aceros, Juan

    2011-01-01

    Acquiring neural signals at high spatial and temporal resolution directly from brain microcircuits and decoding their activity to interpret commands and/or prior planning activity, such as motion of an arm or a leg, is a prime goal of modern neurotechnology. Its practical aims include assistive devices for subjects whose normal neural information pathways are not functioning due to physical damage or disease. On the fundamental side, researchers are striving to decipher the code of multiple neural microcircuits which collectively make up nature’s amazing computing machine, the brain. By implanting biocompatible neural sensor probes directly into the brain, in the form of microelectrode arrays, it is now possible to extract information from interacting populations of neural cells with spatial and temporal resolution at the single cell level. With parallel advances in application of statistical and mathematical techniques tools for deciphering the neural code, extracted populations or correlated neurons, significant understanding has been achieved of those brain commands that control, e.g., the motion of an arm in a primate (monkey or a human subject). These developments are accelerating the work on neural prosthetics where brain derived signals may be employed to bypass, e.g., an injured spinal cord. One key element in achieving the goals for practical and versatile neural prostheses is the development of fully implantable wireless microelectronic “brain-interfaces” within the body, a point of special emphasis of this paper. PMID:21654935

  8. Assessing Advanced High School and Undergraduate Students' Thinking Skills: The Chemistry--From the Nanoscale to Microelectronics Module

    ERIC Educational Resources Information Center

    Dori, Yehudit Judy; Dangur, Vered; Avargil, Shirly; Peskin, Uri

    2014-01-01

    Chemistry students in Israel have two options for studying chemistry: basic or honors (advanced placement). For instruction in high school honors chemistry courses, we developed a module focusing on abstract topics in quantum mechanics: Chemistry--From the Nanoscale to Microelectronics. The module adopts a visual-conceptual approach, which…

  9. Advanced Resistive Exercise Device

    NASA Technical Reports Server (NTRS)

    Raboin, Jasen; Niebuhr, Jason; Cruz, Santana; Lamoreaux, chris

    2007-01-01

    The advanced resistive exercise device (ARED), now at the prototype stage of development, is a versatile machine that can be used to perform different customized exercises for which, heretofore, it has been necessary to use different machines. Conceived as a means of helping astronauts and others to maintain muscle and bone strength and endurance in low-gravity environments, the ARED could also prove advantageous in terrestrial settings (e.g., health clubs and military training facilities) in which many users are exercising simultaneously and there is heavy demand for use of exercise machines.

  10. Investigation of charge transport and electromagnetic effects in advanced microelectronics and optoelectronics

    SciTech Connect

    Kwan, T.; Booth, T.; Gray, M.

    1996-07-01

    This is the final report of a three-year, Laboratory-Directed Research and Development (LDRD) project at the Los Alamos National Laboratory (LANL). The next generation of electronic microchips will utilize components with sub-micron feature size and optoelectronic devices with picosecond response time. Fundamental understanding of the device performance can only be obtained through first principles physics modeling of charge transport and electromagnetic effects in realistic geometries with material interfaces and dispersive properties. We have developed a general model incorporating important physics such as charge transport processes in materials with multilevel band structures and electromagnetic effects to simulate device characteristics. Accurate treatment of material interfaces and boundaries is included. The Monte Carlo charge transport is coupled self-consistently to Maxwell`s equations to accurately model scattering processes in the presence of an externally biased potential. This detailed multidimensional simulation capability is compared with and verified by experimental data, and could become an industrial standard for benchmarking and improving the {open_quotes}reduced model{close_quotes} codes used for semiconductor design. Specific tasks are the extension of existing capabilities in particle-in-cell plasma simulation technique and Monte Carlo charge transport to study the physics of charged particle dynamics in realistic microelectronic devices, such as bipolar semiconductors, heterojunction transistors, and optoelectronic switches. Our approach has been based on the coupled particle-in-cell/Monte Carlo technique, which can simultaneously treat both electromagnetic wave propagation and charged-particle transport.

  11. A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

    NASA Astrophysics Data System (ADS)

    Liang, Cunman; Wang, Fujun; Tian, Yanling; Zhao, Xingyu; Zhang, Hongjie; Cui, Liangyu; Zhang, Dawei; Ferreira, Placid

    2015-04-01

    A novel monolithic piezoelectric actuated wire clamp is presented in this paper to achieve fast, accurate, and robust microelectronic device packaging. The wire clamp has compact, flexure-based mechanical structure and light weight. To obtain large and robust jaw displacements and ensure parallel jaw grasping, a two-stage amplification composed of a homothetic bridge type mechanism and a parallelogram leverage mechanism was designed. Pseudo-rigid-body model and Lagrange approaches were employed to conduct the kinematic, static, and dynamic modeling of the wire clamp and optimization design was carried out. The displacement amplification ratio, maximum allowable stress, and natural frequency were calculated. Finite element analysis (FEA) was conducted to evaluate the characteristics of the wire clamp and wire electro discharge machining technique was utilized to fabricate the monolithic structure. Experimental tests were carried out to investigate the performance and the experimental results match well with the theoretical calculation and FEA. The amplification ratio of the clamp is 20.96 and the working mode frequency is 895 Hz. Step response test shows that the wire clamp has fast response and high accuracy and the motion resolution is 0.2 μm. High speed precision grasping operations of gold and copper wires were realized using the wire clamper.

  12. Impact of junction temperature on microelectronic device reliability and considerations for space applications

    NASA Technical Reports Server (NTRS)

    White, Mark; Chen, Yuan; Cooper, Mark

    2003-01-01

    This paper provides a summary of an industry survey on junction temperature derating from key microelectronics suppliers, and offers recommendations to users for temperature derating for reliable operation over time. Background information on established derating factors, and reccommendations for safe operating junction temperatures for newer technologies are also presented.

  13. Diagnostics and Microelectronics

    SciTech Connect

    Balch, J.W.

    1993-03-01

    This report discusses activities of the Diagnostics and Microelectronics thrust area which conducts activities in semiconductor devices and semiconductor fabrication technology for programs at Lawrence Livermore National Laboratory. Our multidisciplinary engineering and scientific staff use modern computational tools and semi-conductor microfabrication equipment to develop high-performance devices. Our work concentrates on three broad technologies of semiconductor microdevices: (1) silicon on III-V semiconductor microeletronics, (2) lithium niobate-based and III-V semiconductor-based photonics, and (3) silicon-based micromaching for application to microstructures and microinstruments. In FY-92, we worked on projects in seven areas, described in this report: novel photonic detectors; a wideband phase modulator; an optoelectronic terahertz beam system; the fabrication of microelectrode electrochemical sensors; diamond heatsinks; advanced micromachining technologies; and electrophoresis using silicon microchannels.

  14. Advanced resistive exercise device

    NASA Technical Reports Server (NTRS)

    Raboin, Jasen L. (Inventor); Niebuhr, Jason (Inventor); Cruz, Santana F. (Inventor); Lamoreaux, Christopher D. (Inventor)

    2008-01-01

    The present invention relates to an exercise device, which includes a vacuum cylinder and a flywheel. The flywheel provides an inertial component to the load, which is particularly well suited for use in space as it simulates exercising under normal gravity conditions. Also, the present invention relates to an exercise device, which has a vacuum cylinder and a load adjusting armbase assembly.

  15. Investigations on MGy ionizing dose effects in thin oxides of micro-electronic devices

    SciTech Connect

    Gaillardin, M.; Paillet, P.; Raine, M.; Martinez, M.; Marcandella, C.; Duhamel, O.; Richard, N.; Leray, J.L.; Goiffon, V.; Corbiere, F.; Rolando, S.; Molina, R.; Magnan, P.; Girard, S.; Ouerdane, Y.; Boukenter, A.

    2015-07-01

    Total ionizing dose (TID) effects have been studied for a long time in micro-electronic components designed to operate in natural and artificial environments. In most cases, TID induces both charge trapping in the bulk of irradiated oxides and the buildup of interface traps located at semiconductor/dielectric interfaces. Such effects result from basic mechanisms driven by both the shape of the electric field which stands into the oxide and by fabrication process parameters inducing pre-existing traps in the oxide's bulk. From the pioneering studies based on 'thick' oxide technologies to the most recent ones dedicated to innovative technologies, most studies concluded that the impact of total ionizing dose effects reduces with the oxide thinning. This is specifically the case for the gate-oxide of Metal-Oxide-Semiconductor Field Effect Transistors (MOSFET) for which it is generally considered that TID is not a major issue anymore at kGy dose ranges. TID effects are now mainly due to charge trapping in the field oxides such as Shallow Trench Isolation. This creates either parasitic conduction paths or Radiation-Induced Narrow Channel Effects (RINCE). Static current-voltage (I-V) electrical characteristics are then modified through a significant increase of the off-current of NMOS transistors or by shifting the whole I-V curves (of both NMOS and PMOS transistors). Based on these assumptions, no significant shift of I-V curves should be observed in modern bulk CMOS technologies. However, such phenomenon may not be directly extrapolated to higher TID ranges, typically of several MGy for which only few data are available in the literature. This paper presents evidences of large threshold voltage shifts measured at MGy dose levels despite the fact that transistors are designed in a submicron bulk technology which features a 7-nm thin gate-oxide on GO2 transistors dedicated to mixed analog/digital integrated circuits. Such electrical shifts are encountered on PMOS

  16. Advanced underwater lift device

    NASA Technical Reports Server (NTRS)

    Flanagan, David T.; Hopkins, Robert C.

    1993-01-01

    Flexible underwater lift devices ('lift bags') are used in underwater operations to provide buoyancy to submerged objects. Commercially available designs are heavy, bulky, and awkward to handle, and thus are limited in size and useful lifting capacity. An underwater lift device having less than 20 percent of the bulk and less than 10 percent of the weight of commercially available models was developed. The design features a dual membrane envelope, a nearly homogeneous envelope membrane stress distribution, and a minimum surface-to-volume ratio. A proof-of-concept model of 50 kg capacity was built and tested. Originally designed to provide buoyancy to mock-ups submerged in NASA's weightlessness simulators, the device may have application to water-landed spacecraft which must deploy flotation upon impact, and where launch weight and volume penalties are significant. The device may also be useful for the automated recovery of ocean floor probes or in marine salvage applications.

  17. Biomedical implantable microelectronics.

    PubMed

    Meindl, J D

    1980-10-17

    Innovative applications of microelectronics in new biomedical implantable instruments offer a singular opportunity for advances in medical research and practice because of two salient factors: (i) beyond all other types of biomedical instruments, implants exploit fully the inherent technical advantages--complex functional capability, high reliability, lower power drain, small size and weight-of microelectronics, and (ii) implants bring microelectronics into intimate association with biological systems. The combination of these two factors enables otherwise impossible new experiments to be conducted and new paostheses developed that will improve the quality of human life.

  18. Advanced Semiconductor Devices

    NASA Astrophysics Data System (ADS)

    Shur, Michael S.; Maki, Paul A.; Kolodzey, James

    2007-06-01

    I. Wide band gap devices. Wide-Bandgap Semiconductor devices for automotive applications / M. Sugimoto ... [et al.]. A GaN on SiC HFET device technology for wireless infrastructure applications / B. Green ... [et al.]. Drift velocity limitation in GaN HEMT channels / A. Matulionis. Simulations of field-plated and recessed gate gallium nitride-based heterojunction field-effect transistors / V. O. Turin, M. S. Shur and D. B. Veksler. Low temperature electroluminescence of green and deep green GaInN/GaN light emitting diodes / Y. Li ... [et al.]. Spatial spectral analysis in high brightness GaInN/GaN light emitting diodes / T. Detchprohm ... [et al.]. Self-induced surface texturing of Al2O3 by means of inductively coupled plasma reactive ion etching in Cl2 chemistry / P. Batoni ... [et al.]. Field and termionic field transport in aluminium gallium arsenide heterojunction barriers / D. V. Morgan and A. Porch. Electrical characteristics and carrier lifetime measurements in high voltage 4H-SiC PiN diodes / P. A. Losee ... [et al.]. Geometry and short channel effects on enhancement-mode n-Channel GaN MOSFETs on p and n- GaN/sapphire substrates / W. Huang, T. Khan and T. P. Chow. 4H-SiC Vertical RESURF Schottky Rectifiers and MOSFETs / Y. Wang, P. A. Losee and T. P. Chow. Present status and future Directions of SiGe HBT technology / M. H. Khater ... [et al.]Optical properties of GaInN/GaN multi-quantum Wells structure and light emitting diode grown by metalorganic chemical vapor phase epitaxy / J. Senawiratne ... [et al.]. Electrical comparison of Ta/Ti/Al/Mo/Au and Ti/Al/Mo/Au Ohmic contacts on undoped GaN HEMTs structure with AlN interlayer / Y. Sun and L. F. Eastman. Above 2 A/mm drain current density of GaN HEMTs grown on sapphire / F. Medjdoub ... [et al.]. Focused thermal beam direct patterning on InGaN during molecular beam epitaxy / X. Chen, W. J. Schaff and L. F. Eastman -- II. Terahertz and millimeter wave devices. Temperature-dependent microwave performance of

  19. Advanced Modeling of Micromirror Devices

    NASA Technical Reports Server (NTRS)

    Michalicek, M. Adrian; Sene, Darren E.; Bright, Victor M.

    1995-01-01

    The flexure-beam micromirror device (FBMD) is a phase only piston style spatial light modulator demonstrating properties which can be used for phase adaptive corrective optics. This paper presents a complete study of a square FBMD, from advanced model development through final device testing and model verification. The model relates the electrical and mechanical properties of the device by equating the electrostatic force of a parallel-plate capacitor with the counter-acting spring force of the device's support flexures. The capacitor solution is derived via the Schwartz-Christoffel transformation such that the final solution accounts for non-ideal electric fields. The complete model describes the behavior of any piston-style device, given its design geometry and material properties. It includes operational parameters such as drive frequency and temperature, as well as fringing effects, mirror surface deformations, and cross-talk from neighboring devices. The steps taken to develop this model can be applied to other micromirrors, such as the cantilever and torsion-beam designs, to produce an advanced model for any given device. The micromirror devices studied in this paper were commercially fabricated in a surface micromachining process. A microscope-based laser interferometer is used to test the device in which a beam reflected from the device modulates a fixed reference beam. The mirror displacement is determined from the relative phase which generates a continuous set of data for each selected position on the mirror surface. Plots of this data describe the localized deflection as a function of drive voltage.

  20. Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices

    NASA Astrophysics Data System (ADS)

    Marinov, Val R.; Swenson, Orven; Atanasov, Yuriy; Schneck, Nathan

    2013-03-01

    Ultrathin flip-chip semiconductor die packaging on paper substrates is an enabling technology for a variety of extremely low-cost electronic devices with huge market potential such as RFID smart forms, smart labels, smart tickets, banknotes, security documents, etc. Highly flexible and imperceptible dice are possible only at a thickness of less than 50 μm, preferably down to 10-20 μm or less. Several cents per die cost is achievable only if the die size is <= 500 μm/side. Such ultrathin, ultra-small dice provide the flexibility and low cost required, but no conventional technology today can package such die onto a flexible substrate at low cost and high rate. The laser-enabled advanced packaging (LEAP) technology has been developed at the Center for Nanoscale Science and Engineering, North Dakota State University in Fargo, North Dakota, to accomplish this objective. Presented are results using LEAP to assemble dice with various thicknesses, including 350 μm/side dice as thin as 20 μm and less. To the best of our knowledge, this is the first report of using a laser to package conventional silicon dice with such small size and thickness. LEAP-packaged RFID-enabled paper for financial and security applications is also demonstrated. The cost of packaging using LEAP is lower compared to the conventional pick-and-place methods while the rate of packaging is much higher and independent of the die size.

  1. Space Radiation Environment Prediction for VLSI microelectronics devices onboard a LEO Satellite using OMERE-Trad Software

    NASA Astrophysics Data System (ADS)

    Sajid, Muhammad

    This tutorial/survey paper presents the assessment/determination of level of hazard/threat to emerging microelectronics devices in Low Earth Orbit (LEO) space radiation environment with perigee at 300 Km, apogee at 600Km altitude having different orbital inclinations to predict the reliability of onboard Bulk Built-In Current Sensor (BBICS) fabricated in 350nm technology node at OptMA Lab. UFMG Brazil. In this context, the various parameters for space radiation environment have been analyzed to characterize the ionizing radiation environment effects on proposed BBICS. The Space radiation environment has been modeled in the form of particles trapped in Van-Allen radiation belts(RBs), Energetic Solar Particles Events (ESPE) and Galactic Cosmic Rays (GCR) where as its potential effects on Device- Under-Test (DUT) has been predicted in terms of Total Ionizing Dose (TID), Single-Event Effects (SEE) and Displacement Damage Dose (DDD). Finally, the required mitigation techniques including necessary shielding requirements to avoid undesirable effects of radiation environment at device level has been estimated /determined with assumed standard thickness of Aluminum shielding. In order to evaluate space radiation environment and analyze energetic particles effects on BBICS, OMERE toolkit developed by TRAD was utilized.

  2. Radiation Testing, Characterization and Qualification Challenges for Modern Microelectronics and Photonics Devices and Technologies

    NASA Technical Reports Server (NTRS)

    LaBel, Kenneth A.; Cohn, Lewis M.

    2008-01-01

    At an earlier conference we discussed a selection of the challenges for radiation testing of modern semiconductor devices focusing on state-of-the-art CMOS technologies. In this presentation, we extend this discussion focusing on the following areas: (1) Device packaging, (2) Evolving physical single even upset mechanisms, (3) Device complexity, and (4) the goal of understanding the limitations and interpretation of radiation testing results.

  3. A figure-of-merit for design of high performance inductive power transmission links for implantable microelectronic devices.

    PubMed

    Kiani, Mehdi; Ghovanloo, Maysam

    2012-01-01

    Wireless power transfer through inductive coupling is used in many applications such as high performance implantable microelectronic devices (IMDs). Power transfer efficiency (PTE) and power delivered to the load (PDL) are two conventional inductive link design merits that determine the energy source and driver specifications, heat dissipation, power transmission range, and risk of interference with other devices. Unfortunately designing the inductive link to achieve a high PTE will drastically reduce the PDL and vice versa. Therefore, we are proposing a new figure-of-merit (FoM), which includes both PTE and PDL with proper weights, to help designers of inductive power transfer links to strike a balance between high PTE and PDL at the same time. Three design examples based on the PTE, PDL, and the new FoM have been presented for IMDs to demonstrate the usage and efficacy of the FoM. Our measurement results show that the inductive link optimized based on the FoM can achieved 1.65 times higher PTE than the one optimized for the PDL (72.5% vs. 44%) and at the same time provide 20.8 times larger PDL compared to the one optimized for the PTE (177 mW vs. 8.5 mW for 1 V driving voltage). The inductive links optimized for the PTE and PDL provide 24% higher PTE and PDL compared to the one optimized based on the FoM, respectively.

  4. Radiation Testing, Characterization and Qualification Challenges for Modern Microelectronics and Photonics Devices and Technologies

    NASA Technical Reports Server (NTRS)

    LaBel, Kenneth A.; Cohn, Lewis M.

    2008-01-01

    At GOMAC 2007, we discussed a selection of the challenges for radiation testing of modern semiconductor devices focusing on state-of-the-art memory technologies. This included FLASH non-volatile memories (NVMs) and synchronous dynamic random access memories (SDRAMs). In this presentation, we extend this discussion in device packaging and complexity as well as single event upset (SEU) mechanisms using several technology areas as examples including: system-on-a-chip (SOC) devices and photonic or fiber optic systems. The underlying goal is intended to provoke thought for understanding the limitations and interpretation of radiation testing results.

  5. Microelectronics in Scottish Education.

    ERIC Educational Resources Information Center

    Morris, Ian

    1982-01-01

    Describes the Scottish Microelectronics Development Programme (SMDP), which was undertaken to advance the use of microcomputers in instruction at all educational levels in Scotland. The development of the microprocessor and its effect on educational technology are briefly considered, as well as initial problems and prospects for the future of…

  6. The Influence of Temperature on Microelectronic Device Failure Mechanisms. Phase 2

    DTIC Science & Technology

    1993-09-04

    201 5.9 Derating for Failure Mechanisms in First-level Interconnects 207 5.10 Derating for Failure Mechanisms in the Package Case 222 5.11 Derating for...semiconductor device; first- level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case ; lid...1990] 5.5. Due to the non-linear dependence of life under TDDB on temperature, worst case manufacturing defect magnitude, or electric field, derating

  7. Overview of micro- and nano-technology tools for stem cell applications: micropatterned and microelectronic devices.

    PubMed

    Cagnin, Stefano; Cimetta, Elisa; Guiducci, Carlotta; Martini, Paolo; Lanfranchi, Gerolamo

    2012-11-19

    In the past few decades the scientific community has been recognizing the paramount role of the cell microenvironment in determining cell behavior. In parallel, the study of human stem cells for their potential therapeutic applications has been progressing constantly. The use of advanced technologies, enabling one to mimic the in vivo stem cell microenviroment and to study stem cell physiology and physio-pathology, in settings that better predict human cell biology, is becoming the object of much research effort. In this review we will detail the most relevant and recent advances in the field of biosensors and micro- and nano-technologies in general, highlighting advantages and disadvantages. Particular attention will be devoted to those applications employing stem cells as a sensing element.

  8. Superconducting Microelectronics.

    ERIC Educational Resources Information Center

    Henry, Richard W.

    1984-01-01

    Discusses superconducting microelectronics based on the Josephson effect and its advantages over conventional integrated circuits in speed and sensitivity. Considers present uses in standards laboratories (voltage) and in measuring weak magnetic fields. Also considers future applications in superfast computer circuitry using Superconducting…

  9. New Materials, Methods, and Molecules for Microelectronic and Molecular Electronic Devices

    NASA Astrophysics Data System (ADS)

    Miller, Michael Stephen

    This dissertation reports a variety of new methods and materials for the fabrication of electronic devices. Particular emphasis is placed on low-cost, solution based methods for flexible electronic device fabrication, and new substrates and molecules for molecular electronic tunnel junctions. Chapter 2 reports a low-cost, solution based method for depositing patterned metal circuitry onto a variety of flexible polymer substrates. Microcontact printing an aluminum (III) porphyrin complex activates selected areas of an oxidized polymer substrate to electroless copper metallization. Chapter 3 reports a new transparent conductive electrode for use in optoelectronic devices. A highly conductive, transparent silver nanowire network is embedded at the surface of an optical adhesive, which can be applied to a variety of rigid and flexible polymer substrates. Chapter 4 describes a new approach to the self-assembly of mesoscale components into two-dimensional arrays. Unlike most previously reported self-assembly motifs, this method is completely dry; eliminating solvent makes this method compatible with the assembly of electronic components. Chapter 5 describes a new class of self-assembled monolayer (SAM) on gold formed from dihexadecyldithiophosphinic acid ((C16) 2DTPA) adsorbate molecules. The binding and structure (C16) 2DTPA SAMs is dependent upon the roughness and morphology of the underlying gold substrate. Chapter 6 investigates the influence of chain length on the binding and structure of dialkyl-DTPA SAMs on smooth, template-stripped (TS) gold. Binding of the DTPA head group is independent of the length of the alkyl chain, while the structure of the organic layer has a counter-intuitive dependence: As the length of the alkyl chain increases, these SAMs become more disordered and liquid-like. Chapter 7 describes the fabrication of ultra smooth gold substrates using chemical mechanical polishing (CMP). These substrates are smooth, uniform, and prove to be ideal

  10. Nanoscale Copper and Copper Compounds for Advanced Device Applications

    NASA Astrophysics Data System (ADS)

    Chen, Lih-Juann

    2016-12-01

    Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu2S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu3Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se2 nanotip arrays for high-efficiency solar cell, multilevel Cu2S resistive memory, superlattice Cu2S-Ag2S heterojunction diodes, and facet-dependent Cu2O diode.

  11. A Methodology to Teach Advanced A/D Converters, Combining Digital Signal Processing and Microelectronics Perspectives

    ERIC Educational Resources Information Center

    Quintans, C.; Colmenar, A.; Castro, M.; Moure, M. J.; Mandado, E.

    2010-01-01

    ADCs (analog-to-digital converters), especially Pipeline and Sigma-Delta converters, are designed using complex architectures in order to increase their sampling rate and/or resolution. Consequently, the learning of ADC devices also encompasses complex concepts such as multistage synchronization, latency, oversampling, modulation, noise shaping,…

  12. Ceramic materials of low-temperature synthesis for dielectric coating applied by 3D aerosol printing used in nano- and microelectronics, lighting engineering, and spacecraft control devices

    NASA Astrophysics Data System (ADS)

    Ivanov, A. A.; Tuev, V. I.; Nisan, A. V.; Potapov, G. N.

    2016-11-01

    A synthesis technique of low-temperature ceramic material based on aluminosilicates of dendrimer morphology capable to contain up to 80 wt % of nitrides and oxides of high-melting compounds as filler has been developed. The synthesis is based on a sol-gel method followed by mechanochemical treatment and ultrasonic dispersing. Dielectric ceramic layers with the layer thickness in the nanometer range and high thermal conductivity have been obtained for the first time by 3D aerosol printing of the synthesized material. The study of the obtained ceramic coating on the metal surface (Al) has proved its use prospects in microelectronics, light engineering, and devices for special purposes.

  13. A Review of Failure Analysis Methods for Advanced 3D Microelectronic Packages

    NASA Astrophysics Data System (ADS)

    Li, Yan; Srinath, Purushotham Kaushik Muthur; Goyal, Deepak

    2016-01-01

    Advanced three dimensional (3D) packaging is a key enabler in driving form factor reduction, performance benefits, and package cost reduction, especially in the fast paced mobility and ultraportable consumer electronics segments. The high level of functional integration and the complex package architecture pose a significant challenge for conventional fault isolation (FI) and failure analysis (FA) methods. Innovative FI/FA tools and techniques are required to tackle the technical and throughput challenges. In this paper, the applications of FI and FA techniques such as Electro Optic Terahertz Pulse Reflectometry, 3D x-ray computed tomography, lock-in thermography, and novel physical sample preparation methods to 3D packages with package on package and stacked die with through silicon via configurations are reviewed, along with the key FI and FA challenges.

  14. Fighting blindness with microelectronics.

    PubMed

    Zrenner, Eberhart

    2013-11-06

    There is no approved cure for blindness caused by degeneration of the photoreceptor cells of the retina. However, there has been encouraging progress with attempts to restore vision using microelectronic retinal implant devices. Yet many questions remain to be addressed. Where is the best location to implant multielectrode arrays? How can spatial and temporal resolution be improved? What are the best ways to ensure the safety and longevity of these devices? Will color vision be possible? This Perspective discusses the current state of the art of retinal implants and attempts to address some of the outstanding questions.

  15. Ultra sensitive magnetic sensors integrating the giant magnetoelectric effect with advanced microelectronics

    NASA Astrophysics Data System (ADS)

    Fang, Zhao

    This dissertation investigates approaches to enhance the performance, especially the sensitivity and signal to noise ratio of magnetoelectric sensors, which exploits the magnetoelectric coupling in magnetostrictive and piezoelectric laminate composites. A magnetic sensor is a system or device that can measure the magnitude of a magnetic field or each of its vector components. Usually the techniques encompass many aspects of physics and electronics. The common technologies used for magnetic field sensing include induction coil sensors, fluxgate, SQUID (superconducting quantum interference device), Hall effect, giant magnetoresistance, magnetostrictive/piezoelectric composites, and MEMS (microelectromechanical systems)-based magnetic sensors. Magnetic sensors have found a broad range of applications for many decades. For example, ultra sensitive magnetic sensors are able to detect tiny magnetic fields produced outside the brain by the neuronal currents which can be used for diagnostic application. Measuring the brain's magnetic field is extremely challenging because they are so weak, have strengths of 0.1--1 pT and thus requiring magnetic sensors with sub-picotesla sensitivity. In fact, to date, these measurements can only performed with the most sensitive magnetic sensors, i.e., SQUID. However, such detectors need expensive and cumbersome cryogenics to operate. Additionally, the thermal insulation of the sensors prevents them from being placed very closed to the tissues under study, thereby preventing high-resolution measurement capability. All of these severely limit their broad usage and proliferation for biomedical imaging, diagnosis, and research. A novel ultra-sensitive magnetic sensor capable of operating at room temperature is investigated in this thesis. Magnetoelectric effect is a material phenomenon featuring the interchange between the magnetic and electric energies or signals. The large ME effect observed in ME composites, especially the ME laminates

  16. Quantum functional devices for advanced electronics

    NASA Astrophysics Data System (ADS)

    Yokoyama, N.; Muto, S.; Imamura, K.; Takatsu, M.; Mori, T.; Sugiyama, Y.; Sakuma, Y.; Nakao, H.; Adachihara, T.

    Recent research in semiconductor device technology seems to be focused on reducing the cost and power dissipation of traditional Si CMOS integrated circuits, rather than developing new and advanced semiconductor devices. We believe however, that devices enter the nanometer-scale regime in the next century, where quantum mechanical effects play an important role in the device's function; therefore, it is important to continue basic research into the physics and technology of nanometer scale structures and device applications in order to cultivate "nanoelectronics". This paper reviews our research activities on quantum functional devices and discusses our future research direction.

  17. Thermoelectric Devices Advance Thermal Management

    NASA Technical Reports Server (NTRS)

    2007-01-01

    Thermoelectric (TE) devices heat, cool, and generate electricity when a temperature differential is provided between the two module faces. In cooperation with NASA, Chico, California-based United States Thermoelectric Consortium Inc. (USTC) built a gas emissions analyzer (GEA) for combustion research. The GEA precipitated hydrocarbon particles, preventing contamination that would hinder precise rocket fuel analysis. The USTC research and design team uses patent-pending dimple, pin-fin, microchannel and microjet structures to develop and design heat dissipation devices on the mini-scale level, which not only guarantee high performance of products, but also scale device size from 1 centimeter to 10 centimeters. USTC continues to integrate the benefits of TE devices in its current line of thermal management solutions and has found the accessibility of NASA technical research to be a valuable, sustainable resource that has continued to positively influence its product design and manufacturing

  18. Biomimetic Microelectronics for Regenerative Neuronal Cuff Implants.

    PubMed

    Karnaushenko, Daniil; Münzenrieder, Niko; Karnaushenko, Dmitriy D; Koch, Britta; Meyer, Anne K; Baunack, Stefan; Petti, Luisa; Tröster, Gerhard; Makarov, Denys; Schmidt, Oliver G

    2015-11-18

    Smart biomimetics, a unique class of devices combining the mechanical adaptivity of soft actuators with the imperceptibility of microelectronics, is introduced. Due to their inherent ability to self-assemble, biomimetic microelectronics can firmly yet gently attach to an inorganic or biological tissue enabling enclosure of, for example, nervous fibers, or guide the growth of neuronal cells during regeneration.

  19. Microelectronics plastic molded packaging

    SciTech Connect

    Johnson, D.R.; Palmer, D.W.; Peterson, D.W.

    1997-02-01

    The use of commercial off-the-shelf (COTS) microelectronics for nuclear weapon applications will soon be reality rather than hearsay. The use of COTS for new technologies for uniquely military applications is being driven by the so-called Perry Initiative that requires the U.S. Department of Defense (DoD) to accept and utilize commercial standards for procurement of military systems. Based on this philosophy, coupled with several practical considerations, new weapons systems as well as future upgrades will contain plastic encapsulated microelectronics. However, a conservative Department of Energy (DOE) approach requires lifetime predictive models. Thus, the focus of the current project is on accelerated testing to advance current aging models as well as on the development of the methodology to be used during WR qualification of plastic encapsulated microelectronics. An additional focal point involves achieving awareness of commercial capabilities, materials, and processes. One of the major outcomes of the project has been the definition of proper techniques for handling and evaluation of modern surface mount parts which might be used in future systems. This program is also raising the familiarity level of plastic within the weapons complex, allowing subsystem design rules accommodating COTS to evolve. A two year program plan is presented along with test results and commercial interactions during this first year.

  20. Center for advanced microstructures and devices (CAMD)

    NASA Astrophysics Data System (ADS)

    Craft, B. C.; Feldman, M.; Morikawa, E.; Poliakoff, E. D.; Saile, V.; Scott, J. D.; Stockbauer, R. L.

    1992-01-01

    The new synchrotron-radiation facility, Center for Advanced Microstructures and Devices, at Louisiana State University is described with regard to the status of installation of the storage ring, implementation of the various programs, and construction of the first beamlines.

  1. Insertion devices at the advanced photon source

    SciTech Connect

    Moog, E.R.

    1996-07-01

    The insertion devices being installed at the Advanced Photon Source cause the stored particle beam to wiggle, emitting x-rays with each wiggle. These x-rays combine to make an intense beam of radiation. Both wiggler and undulator types of insertion devices are being installed; the characteristics of the radiation produced by these two types of insertion devices are discussed, along with the reasons for those characteristics.

  2. Improved Thermoelectric Devices: Advanced Semiconductor Materials for Thermoelectric Devices

    SciTech Connect

    2009-12-11

    Broad Funding Opportunity Announcement Project: Phononic Devices is working to recapture waste heat and convert it into usable electric power. To do this, the company is using thermoelectric devices, which are made from advanced semiconductor materials that convert heat into electricity or actively remove heat for refrigeration and cooling purposes. Thermoelectric devices resemble computer chips, and they manage heat by manipulating the direction of electrons at the nanoscale. These devices aren’t new, but they are currently too inefficient and expensive for widespread use. Phononic Devices is using a high-performance, cost-effective thermoelectric design that will improve the device’s efficiency and enable electronics manufacturers to more easily integrate them into their products.

  3. NDE applications in microelectronic industries

    NASA Astrophysics Data System (ADS)

    Meyendorf, N.; Oppermann, M.; Krueger, P.; Roellig, M.; Wolter, K. J.

    2016-04-01

    New concepts in assembly technology boost our daily life in an unknown way. High end semiconductor industry today deals with functional structures down to a few nanometers. ITRS roadmap predicts an ongoing decrease of the "DRAM half pitch" over the next decade. Packaging of course is not intended to realize pitches at the nanometer scale, but has to face the challenges of integrating such semiconductor devices with smallest pitch and high pin counts into systems. Advanced techniques of nondestructive evaluation (NDE) with resolutions in volume better than 1 micrometer vixen size are urgently needed for the safety and reliability of electronic systems, especially those that are used in long living applications. The development speed of integrated circuits is still very high and is not expected to decrease in the next future. The integration density of microelectronic devices is increasing, the dimensions become smaller and the number of I/O's is getting higher. The development of new types of packages must be done with respect to reliability issues. Potential damage sources must be identified and finally avoided in the new packages. In power electronics production the condition monitoring receives a lot of interest to avoid electrical shortcuts, dead solder joints and interface cracking. It is also desired to detect and characterize very small defects like transportation phenomenon or Kirkendall voids. For this purpose, imaging technologies with resolutions in the sub-micron range are required.

  4. Nanocharacterization Challenges in a Changing Microelectronics Landscape

    NASA Astrophysics Data System (ADS)

    Brilloüt, Michel

    2011-11-01

    As the microelectronics industry enters the "nano"-era new challenges emerge. Traditional scaling of the MOS transistor faces major obstacles in fulfilling "Moore's law". New features like strain and new materials (e.g. high k—metal gate stack) are introduced in order to sustain performance increases. For a better electrostatic control, devices will use the third dimension, e.g., in gate-all-around nanowire structures. Due to the escalating cost and complexity of sub-28 nm technologies fewer industrial players can afford the development and production of advanced CMOS processes and many companies acknowledge the fact that the value in products can also be obtained in using more diversified non-digital technologies (the so-called "More-than-Moore" domain). This evolving landscape brings new requirements—discussed in this paper—in terms of physical characterization of technologies and devices.

  5. Listening to Brain Microcircuits for Interfacing With External World-Progress in Wireless Implantable Microelectronic Neuroengineering Devices: Experimental systems are described for electrical recording in the brain using multiple microelectrodes and short range implantable or wearable broadcasting units.

    PubMed

    Nurmikko, Arto V; Donoghue, John P; Hochberg, Leigh R; Patterson, William R; Song, Yoon-Kyu; Bull, Christopher W; Borton, David A; Laiwalla, Farah; Park, Sunmee; Ming, Yin; Aceros, Juan

    2010-01-01

    Acquiring neural signals at high spatial and temporal resolution directly from brain microcircuits and decoding their activity to interpret commands and/or prior planning activity, such as motion of an arm or a leg, is a prime goal of modern neurotechnology. Its practical aims include assistive devices for subjects whose normal neural information pathways are not functioning due to physical damage or disease. On the fundamental side, researchers are striving to decipher the code of multiple neural microcircuits which collectively make up nature's amazing computing machine, the brain. By implanting biocompatible neural sensor probes directly into the brain, in the form of microelectrode arrays, it is now possible to extract information from interacting populations of neural cells with spatial and temporal resolution at the single cell level. With parallel advances in application of statistical and mathematical techniques tools for deciphering the neural code, extracted populations or correlated neurons, significant understanding has been achieved of those brain commands that control, e.g., the motion of an arm in a primate (monkey or a human subject). These developments are accelerating the work on neural prosthetics where brain derived signals may be employed to bypass, e.g., an injured spinal cord. One key element in achieving the goals for practical and versatile neural prostheses is the development of fully implantable wireless microelectronic "brain-interfaces" within the body, a point of special emphasis of this paper.

  6. Microelectronics, radiation, and superconductivity.

    PubMed

    Gochfeld, M

    1990-06-01

    Among the costs of technology are health hazards that face employees and consumers. New advances in the highly competitive field of microelectronics involve exposure to a variety of hazards such as gallium arsenide. Small high-technology industries appear unprepared to invest in health and safety. Although stray electromagnetic fields are not a new development, researchers are beginning to assemble data indicating that such fields pose a significant cancer risk under certain circumstances. Data have been obtained on fields associated with power lines on the one hand and consumer products on the other. Although not conclusive, the data are sufficient to warrant carefully designed research into the risks posed by electromagnetic fields. Because the scientific issues require research, there is a need to make basic social value decisions that will determine which technologies will be developed and which ones may be set aside because of their danger at the present time.

  7. Advanced Electro-Optic Surety Devices

    SciTech Connect

    Watterson, C.E.

    1997-05-01

    The Advanced Electro-Optic Surety Devices project was initiated in march 1991 to support design laboratory guidance on electro-optic device packaging and evaluation. Sandia National Laboratory requested AlliedSignal Inc., Kansas City Division (KCD), to prepare for future packaging efforts in electro-optic integrated circuits. Los Alamos National Laboratory requested the evaluation of electro-optic waveguide devices for nuclear surety applications. New packaging techniques involving multiple fiber optic alignment and attachment, binary lens array development, silicon V-groove etching, and flip chip bonding were requested. Hermetic sealing of the electro-optic hybrid and submicron alignment of optical components present new challenges to be resolved. A 10-channel electro-optic modulator and laser amplifier were evaluated for potential surety applications.

  8. Design, Fabrication, and Characterization of Carbon Nanotube Field Emission Devices for Advanced Applications

    NASA Astrophysics Data System (ADS)

    Radauscher, Erich Justin

    Carbon nanotubes (CNTs) have recently emerged as promising candidates for electron field emission (FE) cathodes in integrated FE devices. These nanostructured carbon materials possess exceptional properties and their synthesis can be thoroughly controlled. Their integration into advanced electronic devices, including not only FE cathodes, but sensors, energy storage devices, and circuit components, has seen rapid growth in recent years. The results of the studies presented here demonstrate that the CNT field emitter is an excellent candidate for next generation vacuum microelectronics and related electron emission devices in several advanced applications. The work presented in this study addresses determining factors that currently confine the performance and application of CNT-FE devices. Characterization studies and improvements to the FE properties of CNTs, along with Micro-Electro-Mechanical Systems (MEMS) design and fabrication, were utilized in achieving these goals. Important performance limiting parameters, including emitter lifetime and failure from poor substrate adhesion, are examined. The compatibility and integration of CNT emitters with the governing MEMS substrate (i.e., polycrystalline silicon), and its impact on these performance limiting parameters, are reported. CNT growth mechanisms and kinetics were investigated and compared to silicon (100) to improve the design of CNT emitter integrated MEMS based electronic devices, specifically in vacuum microelectronic device (VMD) applications. Improved growth allowed for design and development of novel cold-cathode FE devices utilizing CNT field emitters. A chemical ionization (CI) source based on a CNT-FE electron source was developed and evaluated in a commercial desktop mass spectrometer for explosives trace detection. This work demonstrated the first reported use of a CNT-based ion source capable of collecting CI mass spectra. The CNT-FE source demonstrated low power requirements, pulsing

  9. Health issues in the microelectronics industry.

    PubMed

    LaDou, J

    1986-01-01

    Since 1948, when microelectronics entered the American industrial scene, the rapid growth and advancing technology of the industry has caused production facilities to be spread throughout most industrialized areas in the United States. It is now speculated that microelectronics production will be the fourth largest industry in the United States by the end of the century. This article addresses the questions raised about the safety of this industry both for its workers and for the communities in which production facilities are located.

  10. Microelectronics bioinstrumentation systems

    NASA Technical Reports Server (NTRS)

    Ko, W. H.

    1977-01-01

    Microelectronic bioinstrumentation systems to be employed in the Cardiovascular Deconditioning Program were developed. Implantable telemetry systems for long-term monitoring of animals on earth were designed to collect physiological data necessary for the understanding of the mechanisms of cardiovascular deconditioning. In-flight instrumentation systems, microelectronic instruments, and RF powering techniques for other life science experiments in the NASA program were studied.

  11. Microelectronics in Education

    ERIC Educational Resources Information Center

    Orton, Richard J. J.

    2011-01-01

    The history and meaning of the term "microelectronics" is reviewed, followed by a discussion of the key inventions of the Intel microprocessor in 1971 and the Texas Instruments electronic pocket calculator in 1975. The six characteristic features of microelectronic components are then defined. The UK prime minister Jim Callaghan's…

  12. Microelectronics and Music Education.

    ERIC Educational Resources Information Center

    Hofstetter, Fred T.

    1979-01-01

    This look at the impact of microelectronics on computer-assisted instruction (CAI) in music notes trends toward new applications and lower costs. Included are: a rationale for CAI in music, a list of sample programs, comparison of five microelectronic music systems, PLATO cost projections, and sources of further information. (SJL)

  13. Plasma etching for advanced polymer optical devices

    NASA Astrophysics Data System (ADS)

    Bitting, Donald S.

    Plasma etching is a common microfabrication technique which can be applied to polymers as well as glasses, metals, and semiconductors. The fabrication of low loss and reliable polymer optical devices commonly makes use of advanced microfabrication processing techniques similar in nature to those utilized in standard semiconductor fabrication technology. Among these techniques, plasma/reactive ion etching is commonly used in the formation of waveguiding core structures. Plasma etching is a powerful processing technique with many potential applications in the emerging field of polymer optical device fabrication. One such promising application explored in this study is in the area of thin film-substrate adhesion enhancement. Two approaches involving plasma processing were evaluated to improve substrate-thin film adhesion in the production of polymer waveguide optical devices. Plasma treatment of polymer substrates such as polycarbonate has been studied to promote the adhesion of fluoropolymer thin film coatings for waveguide device fabrication. The effects of blanket oxygen plasma etchback on substrate, microstructural substrate feature formation, and the long term performance and reliability of these methods were investigated. Use of a blanket oxygen plasma to alter the polycarbonate surface prior to fluoropolymer casting was found to have positive but limited capability to improve the adhesive strength between these polymers. Experiments show a strong correlation between surface roughness and adhesion strength. The formation of small scale surface features using microlithography and plasma etching on the polycarbonate surface proved to provide outstanding adhesion strength when compared to any other known treatment methods. Long term environmental performance testing of these surface treatment methods provided validating data. Test results showed these process approaches to be effective solutions to the problem of adhesion between hydrocarbon based polymer

  14. Monolithic integration of microelectronics and photonics using molecularly engineered materials

    NASA Astrophysics Data System (ADS)

    Kubacki, Ronald M.

    2005-03-01

    The monolithic integration of CMOS microelectronics with photonics is inevitable and benefits both technologies. Photonic integration to microelectronics provides such solutions as overcoming microprocessor communication roadblocks through the use of optical interconnection. Microelectronic integration can provide benefits to photonic structures by optimizing electronic signals generated by photonic biosensors for example. Photonic integration must complement, build on, and enhance the existing state of CMOS microelectronic technology. Photonic approaches that ignore the realities of CMOS architectures (such as power and thermal limitations), provide little benefit to the CMOS device performance, are incompatible with CMOS silicon manufacturing processes, or are incapable of achieving levels of long term reliability already well demonstrated by microelectronic devices, give little reason for photonic/microelectronic integration. Practical implementation of photonics on chip, monolithically with CMOS type microelectronic devices, remains in the laboratory. This work presents architectures to integrate photonics and microelectronics that address CMOS fabrication realities, increase performance of both the electronic and optical functions, and retain current levels of reliability. Fabricating these structures with the limited CMOS material set and/or typical photonic materials requires materials to be molecularly engineered to provide required properties. Materials have been investigated that enable economic fabrication of photonic structures for monolithic integration. Low loss self assembled silicon nanocomposite VIPIR waveguide structures are combined with long term stable non-linear poled polymers for fabrication of electro-optic active devices. Materials are fabricated using low temperature plasma enhanced chemical vapor deposition (PECVD).

  15. From Microelectronics to Nanoelectronics

    NASA Astrophysics Data System (ADS)

    Hoefflinger, Bernd

    We highlight key events in over 100 years of electronic amplifiers and their incorporation in computers and communication in order to appreciate the electron as man's most powerful token of information. We recognize that it has taken about 25 years or almost a generation for inventions to make it into new products, and that, within these periods, it still took major campaigns, like the Sputnik effect or what we shall call 10× programs, to achieve major technology steps. From Lilienfeld's invention 1926 of the solid-state field-effect triode to its realization 1959 in Kahng's MOS field-effect transistor, it took 33 years, and this pivotal year also saw the first planar integrated silicon circuit as patented by Noyce. This birth of the integrated microchip launched the unparalleled exponential growth of microelectronics with many great milestones. Among these, we point out the 3D integration of CMOS transistors by Gibbons in 1979 and the related Japanese program on Future Electron Devices (FED). The 3D domain has finally arrived as a broad development since 2005. Consecutively, we mark the neural networks on-chip of 1989 by Mead and others, now, 20 years later, a major project by DARPA. We highlight cooperatives like SRC and SEMATECH, their impact on progress and more recent nanoelectronic milestones until 2010.

  16. Surface analysis in microelectronics.

    PubMed

    Pignataro, S

    1995-10-01

    The contribution given by surface analysis to solve some problems encountered in the production of electronic power devices have been discussed. Mainly two types of problems have been faced. One of these deal with interfacial chemistry. Three examples have been investigated. The first applies to the improvement of the quality and the reliability of plastic packages through the optimization of the resin/metal and resin/die adhesion. The second relies to the adhesion between polyimide and silicon nitride used in the multilevel technology. The third example refers to the so called die-attach process and related problems. Another area of interest in microelectronics is that of the erosion of various types of surfaces and the possibility of wrong etching. A few examples of the application of surface analytical techniques for these problems will be presented. XPS and SIMS working in imaging and multipoint analysis mode, scanning acoustic microscopy, contact angle measurements as well as peeling and tensile strength measurements are the main tools used to obtain useful data.

  17. Fluoropolymer metallization for microelectronic applications

    NASA Astrophysics Data System (ADS)

    Sacher, E.

    1994-11-01

    One of the most important requirements for the fastest microelectronic devices in present use, and for the even faster devices for future use, is the reduction of the signal interconnection delay time to a small fraction of all the switching delay times. The interconnection delay time is the product of the resistance of the metal interconnection and the capacitance of the associated dielectric. One method of lowering this delay time is the use of multilayer devices incorporating low resistivity metals (e.g., Cu) and low capacitance dielectrics (e.g. fluoropolymers). Among the many problems faced in the construction of multilayer devices from these materials is the lack of metal adhesion to flouropolymers. This article attempts to put into perspective the problem of metal adhesion to fluoropolymers by addressing the reason for its necessity. Reviewing the critical properties and techniques and discussing the presently available results.

  18. Microelectronics in the Curriculum--The Science Teacher's Contribution.

    ERIC Educational Resources Information Center

    Association for Science Education, Cambridge (England).

    Rapid advances in microelectronics over the past few years have generally been beneficial, but they have also created some problems, and questions must be asked about the philosophy for including aspects of the new technology in the school curriculum. This statement, prepared by the Microelectronics and Science Education Subcommittee of the…

  19. Analogy among microfluidics, micromechanics, and microelectronics.

    PubMed

    Li, Sheng-Shian; Cheng, Chao-Min

    2013-10-07

    We wish to illuminate the analogous link between microfluidic-based devices, and the already established pairing of micromechanics and microelectronics to create a triangular/three-way scientific relationship as a means of interlinking familial disciplines and accomplishing two primary goals: (1) to facilitate the modeling of multidisciplinary domains; and, (2) to enable us to co-simulate the entire system within a compact circuit simulator (e.g., Cadence or SPICE). A microfluidic channel-like structure embedded in a micro-electro-mechanical resonator via our proposed CMOS-MEMS technology is used to illustrate the connections among microfluidics, micromechanics, and microelectronics.

  20. The Unilab Blue Chip Range for Introducing Microelectronics.

    ERIC Educational Resources Information Center

    Jarvis, W. H.

    1981-01-01

    Discusses various topics in microelectronics to aid those teaching modern electronics for the first time, including, among others, the slang name "micro," attitudes of examining boards, rapid obsolescence of electronic devices, costs, analog systems, and digital systems. (SK)

  1. Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory

    SciTech Connect

    Smith, J.H.

    1996-11-01

    An overview of the surface micromachining program at the Microelectronics Development Laboratory of Sandia National Laboratories is presented. Development efforts are underway for a variety of surface micromachined sensors and actuators for both defense and commercial applications. A technology that embeds micromechanical devices below the surface of the wafer prior to microelectronics fabrication has been developed for integrating microelectronics with surface-micromachined micromechanical devices. The application of chemical-mechanical polishing to increase the manufacturability of micromechanical devices is also presented.

  2. Microelectronics and computers in medicine.

    PubMed

    Meindl, J D

    1982-02-12

    Microelectronics and computers are in use in virtually every aspect of modern medicine. Computers are used widely in medical research, where an important need is for better microelectronic sensors for data acquisition. In medical practice, data collection from patients as well as subsequent storage, retrieval, and manipulation of data are enhanced by the computer. In medical decision-making computers improve accuracy, increase cost-efficiency, and advance understanding of the structure of medical knowledge and of the decision-making process itself. Powerful new noninvasive diagnostic instruments including x-ray tomographic scanners and ultrasonic imaging systems are based on computers. The efficiency and scope of clinical laboratory procedures and advanced analytical instruments are greatly increased by computerization, and careful application of computers has improved the interpretation of diagnostic tests, such as the electrocardiogram, and monitoring of critically ill patients. The powerful sensory, computational, memory, and display capabilities of microcomputer systems and their compact size offer new opportunities to relieve functional deficiencies associated with loss of limbs, paralysis, speech impediments, deafness, and blindness.

  3. Advanced Microelectronics and Materials Programs

    DTIC Science & Technology

    1991-12-01

    grain size have been fabricated using sol-gel processing. The process has also been used to produce composite fibers containing tetragonal zirconia ... tetragonal zirconia have also been produced. Microwave energy has been demonstrated as a viable method for ignition of self- propagating synthesis. A...have been produced on several Isubstrate materials. Yttria-stabilized tetragonal zirconia with dispersed alpha-alumina has been produced in short

  4. Sandia microelectronics development

    SciTech Connect

    Weaver, H.T.

    1997-02-01

    An overview of the operations of Sandia`s Microelectronics Development Lab (MDL) is to develop radiation hardened IC, but techniques used for IC processing have been applied to a variety of related technologies such as micromechanics, smart sensors, and packaging.

  5. Carbon nanotubes for microelectronics?

    PubMed

    Graham, Andrew P; Duesberg, Georg S; Seidel, Robert V; Liebau, Maik; Unger, Eugen; Pamler, Werner; Kreupl, Franz; Hoenlein, Wolfgang

    2005-04-01

    Despite all prophecies of its end, silicon-based microelectronics still follows Moore's Law and continues to develop rapidly. However, the inherent physical limits will eventually be reached. Carbon nanotubes offer the potential for further miniaturization as long as it is possible to selectively deposit them with defined properties.

  6. ARED (Advanced-Resistive Exercise Device) Update

    NASA Technical Reports Server (NTRS)

    Ploutz-Snyder, Lori

    2009-01-01

    This viewgraph presentation describes ARED which is a new hardware exercise device for use on the International Space Station. Astronaut physiological adaptations, muscle parameters, and cardiovascular parameters are also reviewed.

  7. Using SDI-12 with ST microelectronics MCU's

    SciTech Connect

    Saari, Alexandra; Hinzey, Shawn Adrian; Frigo, Janette Rose; Proicou, Michael Chris; Borges, Louis

    2015-09-03

    ST Microelectronics microcontrollers and processors are readily available, capable and economical processors. Unfortunately they lack a broad user base like similar offerings from Texas Instrument, Atmel, or Microchip. All of these devices could be useful in economical devices for remote sensing applications used with environmental sensing. With the increased need for environmental studies, and limited budgets, flexibility in hardware is very important. To that end, and in an effort to increase open support of ST devices, I am sharing my teams' experience in interfacing a common environmental sensor communication protocol (SDI-12) with ST devices.

  8. Eye vision system using programmable micro-optics and micro-electronics

    NASA Astrophysics Data System (ADS)

    Riza, Nabeel A.; Amin, M. Junaid; Riza, Mehdi N.

    2014-02-01

    Proposed is a novel eye vision system that combines the use of advanced micro-optic and microelectronic technologies that includes programmable micro-optic devices, pico-projectors, Radio Frequency (RF) and optical wireless communication and control links, energy harvesting and storage devices and remote wireless energy transfer capabilities. This portable light weight system can measure eye refractive powers, optimize light conditions for the eye under test, conduct color-blindness tests, and implement eye strain relief and eye muscle exercises via time sequenced imaging. Described is the basic design of the proposed system and its first stage system experimental results for vision spherical lens refractive error correction.

  9. Advances in nonlinear optical materials and devices

    NASA Technical Reports Server (NTRS)

    Byer, Robert L.

    1991-01-01

    The recent progress in the application of nonlinear techniques to extend the frequency of laser sources has come from the joint progress in laser sources and in nonlinear materials. A brief summary of the progress in diode pumped solid state lasers is followed by an overview of progress in nonlinear frequency extension by harmonic generation and parametric processes. Improved nonlinear materials including bulk crystals, quasiphasematched interactions, guided wave devices, and quantum well intersubband studies are discussed with the idea of identifying areas of future progress in nonlinear materials and devices.

  10. Guidewire-Controlled Advancement of the Amplatz Thrombectomy Device

    SciTech Connect

    Mueller-Huelsbeck, Stefan; Schwarzenberg, Helmut; Heller, Martin

    1998-01-15

    The Amplatz Thrombectomy Device (ATD) is a percutaneous rotational catheter proven to homogenize thrombus. The catheter design allows neither application over a coaxial running guidewire nor the use of the device as a monorail system. We report a technical modification that provides guided advancement of the catheter over a wire in order to prevent failure of application and to facilitate the interventional procedure.

  11. Femtosecond Optics: Advanced Devices and Ultrafast Phenomena

    DTIC Science & Technology

    2007-05-31

    periodically poled lithium niobate (PPLN), which already represents a significant advance . Gain is given by G=0.25(1+ exp(gl)), where for 7 t2 PPLN, g...H. Sotobayashi, J.T. Gopinath, and E.P. Ippen, ൟ cm long Bi20 3-based EDFA for picosecond pulse amplification with 80 nm gain bandwidth," IEEE...will be minimized by keeping the data in the optical domain. Such all- optical networks require advanced photonic technologies for a variety of

  12. Probing Phase Transformations and Microstructural Evolutions at the Small Scales: Synchrotron X-ray Microdiffraction for Advanced Applications in 3D IC (Integrated Circuits) and Solar PV (Photovoltaic) Devices

    NASA Astrophysics Data System (ADS)

    Radchenko, I.; Tippabhotla, S. K.; Tamura, N.; Budiman, A. S.

    2016-12-01

    Synchrotron x-ray microdiffraction (μ {XRD}) allows characterization of a crystalline material in small, localized volumes. Phase composition, crystal orientation and strain can all be probed in few-second time scales. Crystalline changes over a large areas can be also probed in a reasonable amount of time with submicron spatial resolution. However, despite all the listed capabilities, μ {XRD} is mostly used to study pure materials but its application in actual device characterization is rather limited. This article will explore the recent developments of the μ {XRD} technique illustrated with its advanced applications in microelectronic devices and solar photovoltaic systems. Application of μ {XRD} in microelectronics will be illustrated by studying stress and microstructure evolution in Cu TSV (through silicon via) during and after annealing. The approach allowing study of the microstructural evolution in the solder joint of crystalline Si solar cells due to thermal cycling will be also demonstrated.

  13. Advanced silicon device technologies for optical interconnects

    NASA Astrophysics Data System (ADS)

    Wosinski, Lech; Wang, Zhechao; Lou, Fei; Dai, Daoxin; Lourdudoss, Sebastian; Thylen, Lars

    2012-01-01

    Silicon photonics is an emerging technology offering novel solutions in different areas requiring highly integrated communication systems for optical networking, sensing, bio-applications and computer interconnects. Silicon photonicsbased communication has many advantages over electric wires for multiprocessor and multicore macro-chip architectures including high bandwidth data transmission, high speed and low power consumption. Following the INTEL's concept to "siliconize" photonics, silicon device technologies should be able to solve the fabrication problems for six main building blocks for realization of optical interconnects: light generation, guiding of light including wavelength selectivity, light modulation for signal encoding, detection, low cost assembly including optical connecting of the devices to the real world and finally the electronic control systems.

  14. Microelectronic Stimulator Array

    DTIC Science & Technology

    2000-08-09

    number of researchers and is an active area of medical research. In a normal eye, in a basic concept 10, 20 Figures la and lb shows a ray trace of two...containing an embedded array of microwires . The glass has a curved surface that conforms to the inner radius of the retina 21. The microelectronic imaging...very small channels perpendicular to the plane of the wafer. The channels are filled with a good electrical conductor forming microwires with one

  15. Microelectronic bioinstrumentation system

    NASA Technical Reports Server (NTRS)

    Ko, W. H.; Yon, E. T.; Rodriguez, R. J.

    1974-01-01

    The progess made from April 1973 to June 1974 on a microelectronics bioinstrumentation system is reported and includes data for the following three individual projects: (1) a radio frequency powered implant telemetry system; (2) an ingestible temperature telemeter; and (3) development of pO2 and pH sensors. Proposed activities for continuation of the research for the period September 1, 1974 to August 31, 1975 are also discussed.

  16. Vision Based Instrumentation For Microelectronic Materials Processing

    NASA Astrophysics Data System (ADS)

    Lake, Donald W.

    1990-02-01

    Proper instrumentation, documentation, and analysis are crucial to the continued advance of micro-electronic materials science. Many important phenomenon are visible. Many of those are progressive events that need observation throughout their transitory period. Microelectronics scientists and engineers have long required optical systems tools which properly handle visible phenomena. An optical based system, called a high-resolution Still/Video system, to fulfill crucial microelec-tronic needs is available. Microelectronic dimensions require the highest possible resolution to resolve the small details. The system provides 1134 by 486 pixel video frames. The transient nature of many events requires video and the associated capability of video recording. The system stores over 14,000 high-resolution video frames on a single standard commercial VHS tape. The widespread use of microscopy requires the ability to operate with a variety of optical microscopes. The system is directly compatible with most microscopes. In addition, analysis requires the ability to produce film and computer processed results of all crucial images. The system has both a companion film printer and a direct computer interface.

  17. Advanced Interconnect and Device-Field Modeling

    DTIC Science & Technology

    2007-01-15

    Essaaidi NATO Advanced Research Workshop : Bianisotropics 2002, 99th Conference on Electromagnetics of Complex Media 8-11May, 2002, Marrakech , Morocco...Bianisotropics 2002, 99th Conference on Electromagnetics of Complex Media 8-11May, 2002, Marrakech , Morocco. Study of Substrates Bi-anisotropy Effects on...Conference on Electromagnetics of Complex Media 8-11May, 2002, Marrakech , Morocco. Dielectric Substrates Anisotropic Effects on The Characteristics of

  18. Microelectronic Array for Stimulation of Retinal Tissue

    DTIC Science & Technology

    2005-01-01

    from diseases such as retinitis pigmentosa and age-related macular degeneration are the leading causes of blindness in the developing world...53featured research 2005 NRL Review Microelectronic Array for Stimulation of Retinal Tissue D. Scribner,1 L. Johnson,4 P. Skeath,4 R. Klein,4...GOALS The development of a high-resolution retinal prosthesis device at the Naval Research Laboratory (NRL) was first discussed in the late 1990s

  19. A microelectronics approach for the ROSETTA surface science package

    NASA Technical Reports Server (NTRS)

    Sandau, Rainer (Editor); Alkalaj, Leon

    1996-01-01

    In relation to the Rosetta surface science package, the benefits of the application of advanced microelectronics packaging technologies and other output from the Mars environmental survey (MESUR) integrated microelectronics study are reported on. The surface science package will be designed to operate for tens of hours. Its limited mass and power consumption make necessary a highly integrated design with all the instruments and subunits operated from a centralized control and information management subsystem.

  20. Advanced colour processing for mobile devices

    NASA Astrophysics Data System (ADS)

    Gillich, Eugen; Dörksen, Helene; Lohweg, Volker

    2015-02-01

    Mobile devices such as smartphones are going to play an important role in professionally image processing tasks. However, mobile systems were not designed for such applications, especially in terms of image processing requirements like stability and robustness. One major drawback is the automatic white balance, which comes with the devices. It is necessary for many applications, but of no use when applied to shiny surfaces. Such an issue appears when image acquisition takes place in differently coloured illuminations caused by different environments. This results in inhomogeneous appearances of the same subject. In our paper we show a new approach for handling the complex task of generating a low-noise and sharp image without spatial filtering. Our method is based on the fact that we analyze the spectral and saturation distribution of the channels. Furthermore, the RGB space is transformed into a more convenient space, a particular HSI space. We generate the greyscale image by a control procedure that takes into account the colour channels. This leads in an adaptive colour mixing model with reduced noise. The results of the optimized images are used to show how, e. g., image classification benefits from our colour adaptation approach.

  1. Microscopy imaging device with advanced imaging properties

    DOEpatents

    Ghosh, Kunal; Burns, Laurie; El Gamal, Abbas; Schnitzer, Mark J.; Cocker, Eric; Ho, Tatt Wei

    2016-10-25

    Systems, methods and devices are implemented for microscope imaging solutions. One embodiment of the present disclosure is directed toward an epifluorescence microscope. The microscope includes an image capture circuit including an array of optical sensor. An optical arrangement is configured to direct excitation light of less than about 1 mW to a target object in a field of view of that is at least 0.5 mm.sup.2 and to direct epi-fluorescence emission caused by the excitation light to the array of optical sensors. The optical arrangement and array of optical sensors are each sufficiently close to the target object to provide at least 2.5 .mu.m resolution for an image of the field of view.

  2. Microscopy imaging device with advanced imaging properties

    DOEpatents

    Ghosh, Kunal; Burns, Laurie; El Gamal, Abbas; Schnitzer, Mark J.; Cocker, Eric; Ho, Tatt Wei

    2016-11-22

    Systems, methods and devices are implemented for microscope imaging solutions. One embodiment of the present disclosure is directed toward an epifluorescence microscope. The microscope includes an image capture circuit including an array of optical sensor. An optical arrangement is configured to direct excitation light of less than about 1 mW to a target object in a field of view of that is at least 0.5 mm.sup.2 and to direct epi-fluorescence emission caused by the excitation light to the array of optical sensors. The optical arrangement and array of optical sensors are each sufficiently close to the target object to provide at least 2.5 .mu.m resolution for an image of the field of view.

  3. Microscopy imaging device with advanced imaging properties

    DOEpatents

    Ghosh, Kunal; Burns, Laurie; El Gamal, Abbas; Schnitzer, Mark J.; Cocker, Eric; Ho, Tatt Wei

    2015-11-24

    Systems, methods and devices are implemented for microscope imaging solutions. One embodiment of the present disclosure is directed toward an epifluorescence microscope. The microscope includes an image capture circuit including an array of optical sensor. An optical arrangement is configured to direct excitation light of less than about 1 mW to a target object in a field of view of that is at least 0.5 mm.sup.2 and to direct epi-fluorescence emission caused by the excitation light to the array of optical sensors. The optical arrangement and array of optical sensors are each sufficiently close to the target object to provide at least 2.5 .mu.m resolution for an image of the field of view.

  4. Thin film microelectronics materials production in the vacuum of space

    NASA Astrophysics Data System (ADS)

    Ignatiev, A.; Sterling, M.; Horton, C.; Freundlich, A.; Pei, S.; Hill, R.

    1997-01-01

    The international Space Station era will open up a new dimension in the use of one of the unique attributes of space, vacuum, for the production of advanced semiconductor materials and devices for microelectronics applications. Ultra-vacuum is required for the fabrication in thin film form of high quality semiconductors. This can be accomplished behind a free flying platform similar to the current Wake Shield Facility which is specifically designed to support in-space production. The platform will require apparatus for thin film growth, a robotics interface to allow for the change out of raw materials and the harvesting of finished product, and a servicing plant incorporating Space Station that will support long-term utilization of the platform.

  5. Self-healable electrically conducting wires for wearable microelectronics.

    PubMed

    Sun, Hao; You, Xiao; Jiang, Yishu; Guan, Guozhen; Fang, Xin; Deng, Jue; Chen, Peining; Luo, Yongfeng; Peng, Huisheng

    2014-09-01

    Electrically conducting wires play a critical role in the advancement of modern electronics and in particular are an important key to the development of next-generation wearable microelectronics. However, the thin conducting wires can easily break during use, and the whole device fails to function as a result. Herein, a new family of high-performance conducting wires that can self-heal after breaking has been developed by wrapping sheets of aligned carbon nanotubes around polymer fibers. The aligned carbon nanotubes offer an effective strategy for the self-healing of the electric conductivity, whereas the polymer fiber recovers its mechanical strength. A self-healable wire-shaped supercapacitor fabricated from a wire electrode of this type maintained a high capacitance after breaking and self-healing.

  6. Future opportunities for advancing glucose test device electronics.

    PubMed

    Young, Brian R; Young, Teresa L; Joyce, Margaret K; Kennedy, Spencer I; Atashbar, Massood Z

    2011-09-01

    Advancements in the field of printed electronics can be applied to the field of diabetes testing. A brief history and some new developments in printed electronics components applicable to personal test devices, including circuitry, batteries, transmission devices, displays, and sensors, are presented. Low-cost, thin, and lightweight materials containing printed circuits with energy storage or harvest capability and reactive/display centers, made using new printing/imaging technologies, are ideal for incorporation into personal-use medical devices such as glucose test meters. Semicontinuous rotogravure printing, which utilizes flexible substrates and polymeric, metallic, and/or nano "ink" composite materials to effect rapidly produced, lower-cost printed electronics, is showing promise. Continuing research advancing substrate, "ink," and continuous processing development presents the opportunity for research collaboration with medical device designers.

  7. Future Opportunities for Advancing Glucose Test Device Electronics

    PubMed Central

    Young, Brian R; Young, Teresa L; Joyce, Margaret K; Kennedy, Spencer I; Atashbar, Massood Z

    2011-01-01

    Advancements in the field of printed electronics can be applied to the field of diabetes testing. A brief history and some new developments in printed electronics components applicable to personal test devices, including circuitry, batteries, transmission devices, displays, and sensors, are presented. Low-cost, thin, and lightweight materials containing printed circuits with energy storage or harvest capability and reactive/display centers, made using new printing/imaging technologies, are ideal for incorporation into personal-use medical devices such as glucose test meters. Semicontinuous rotogravure printing, which utilizes flexible substrates and polymeric, metallic, and/or nano “ink” composite materials to effect rapidly produced, lower-cost printed electronics, is showing promise. Continuing research advancing substrate, “ink,” and continuous processing development presents the opportunity for research collaboration with medical device designers. PMID:22027300

  8. Future technologies. I - Microelectronics, micrometrology, and micromechanics

    NASA Astrophysics Data System (ADS)

    Becker, H.

    1986-04-01

    Recent developments in microelectronics design and manufacturing are reviewed, with an emphasis on the activity of West German research institutes and industry. The history of semiconductor development since 1948 is summarized; current efforts to produce submicron VHSICs with throughput 10 to the 13th Hz/sq cm at clock frequency 50 MHz are described; and consideration is given to emitter-coupled-logic gate arrays and GaAs devices. The use of optical measurement techniques or digital analysis of SEM images in fabricating or customizing microelectronic structure is examined, and Si-based sensors for a number of micromechanical applications (pressure sensors, CCD cameras, gas chromatographs, and temperature sensors) are discussed along with the anisotropic etching processes used to fabricate them.

  9. Are bioresorbable polylactate devices comparable to titanium devices for stabilizing Le Fort I advancement?

    PubMed

    Blakey, G H; Rossouw, E; Turvey, T A; Phillips, C; Proffit, W R; White, R P

    2014-04-01

    The purpose of this study was to evaluate whether skeletal and dental outcomes following Le Fort I surgery differed when stabilization was performed with polylactate bioresorbable devices or titanium devices. Fifty-seven patients with preoperative records and at least 1 year postoperative records were identified and grouped according to the stabilization method. All cephalometric X-rays were traced and digitized by a single operator. Analysis of covariance was used to compare the postsurgical change between the two stabilization methods. Twenty-seven patients received bioresorbable devices (group R), while 30 received titanium devices (group M). There were no statistically significant differences between the two groups with respect to gender, race/ethnicity, age, or dental and skeletal movements during surgery. Subtle postsurgical differences were noted, but were not statistically significant. Stabilization of Le Fort I advancement with polylactate bioresorbable and titanium devices produced similar clinical outcomes at 1 year following surgery.

  10. Advanced photon source experience with vacuum chambers for insertion devices

    SciTech Connect

    Hartog, P.D.; Grimmer, J.; Xu, S.; Trakhtenberg, E.; Wiemerslage, G.

    1997-08-01

    During the last five years, a new approach to the design and fabrication of extruded aluminum vacuum chambers for insertion devices was developed at the Advanced Photon Source (APS). With this approach, three different versions of the vacuum chamber, with vertical apertures of 12 mm, 8 mm, and 5 mm, were manufactured and tested. Twenty chambers were installed into the APS vacuum system. All have operated with beam, and 16 have been coupled with insertion devices. Two different vacuum chambers with vertical apertures of 16 mm and 11 mm were developed for the BESSY-II storage ring and 3 of 16 mm chambers were manufactured.

  11. Advanced Sensor Fish Device for ImprovedTurbine Design

    SciTech Connect

    Carlson, Thomas J.

    2009-09-14

    Juvenile salmon (smolts) passing through hydroelectric turbines are subjected to environmental conditions that can potentially kill or injure them. Many turbines are reaching the end of their operational life expectancies and will be replaced with new turbines that incorporate advanced “fish friendly” designs devised to prevent injury and death to fish. To design a fish friendly turbine, it is first necessary to define the current conditions fish encounter. One such device used by biologists at Pacific Northwest National Laboratory was the sensor fish device to collect data that measures the forces fish experience during passage through hydroelectric projects.

  12. Mandibular Advancing Positive Pressure Apnea Remediation Device (MAPPARD)

    DTIC Science & Technology

    2014-06-01

    wiki/Starling_resistor Lankford, D. A., Proctor, C. D., & Richard, R. (2005). Continuous positive airway pressure (CPAP) changes in bariatric surgery ...Mandibular Advancing Device (after Schlaflabor-Saletu, n.d.). ............ 8  Figure 4.  Uvulopalatopharyngoplasty (before and after surgery ) (from...Lastly, when behavioral and medical techniques have been exhausted the last OSA reduction technique is surgery . Within the last 25 years, the

  13. Insertion devices for the Advanced Light Source at LBL

    SciTech Connect

    Hassenzahl, W.; Chin, J.; Halbach, K.; Hoyer, E.; Humphries, D.; Kincaid, B.; Savoy, R.

    1989-03-01

    The Advanced Light Source (ALS) at the Lawrence Berkeley Laboratory will be the first of the new generation of dedicated synchrotron light sources to be put into operation. Specially designed insertion devices will be required to realize the high brightness photon beams made possible by the low emittance of the electron beam. The complement of insertion devices on the ALS will include undulators with periods as short as 3.9 cm and one or more high field wigglers. The first device to be designed is a 5 m long, 5 cm period, hybrid undulator. The goal of very high brightness and high harmonic output imposes unusually tight tolerances on the magnetic field quality and thus on the mechanical structure. The design process, using a generic structure for all undulators, is described. 5 refs., 4 figs., 1 tab.

  14. Materials Advances for Next-Generation Ingestible Electronic Medical Devices.

    PubMed

    Bettinger, Christopher J

    2015-10-01

    Electronic medical implants have collectively transformed the diagnosis and treatment of many diseases, but have many inherent limitations. Electronic implants require invasive surgeries, operate in challenging microenvironments, and are susceptible to bacterial infection and persistent inflammation. Novel materials and nonconventional device fabrication strategies may revolutionize the way electronic devices are integrated with the body. Ingestible electronic devices offer many advantages compared with implantable counterparts that may improve the diagnosis and treatment of pathologies ranging from gastrointestinal infections to diabetes. This review summarizes current technologies and highlights recent materials advances. Specific focus is dedicated to next-generation materials for packaging, circuit design, and on-board power supplies that are benign, nontoxic, and even biodegradable. Future challenges and opportunities are also highlighted.

  15. Porous low dielectric constant materials for microelectronics.

    PubMed

    Baklanov, Mikhail R; Maex, Karen

    2006-01-15

    Materials with a low dielectric constant are required as interlayer dielectrics for the on-chip interconnection of ultra-large-scale integration devices to provide high speed, low dynamic power dissipation and low cross-talk noise. The selection of chemical compounds with low polarizability and the introduction of porosity result in a reduced dielectric constant. Integration of such materials into microelectronic circuits, however, poses a number of challenges, as the materials must meet strict requirements in terms of properties and reliability. These issues are the subject of the present paper.

  16. Dopant materials used in the microelectronics industry.

    PubMed

    Lewis, D R

    1986-01-01

    Advances in microelectronics have transformed the occupational environment of the electronics industry. Large quantities of potentially hazardous materials are now in routine use as integrated circuit manufacturing becomes more complex and specialized. While the acute hazards associated with these dopant materials are clear, the subacute and chronic effects are less evident. Many of these elements are trace elements in humans and may play roles in health and disease in minute concentrations. Early detection and prevention of adverse health effects requires both astute medical surveillance, industrial hygiene, and safety engineering efforts to eliminate the sources of exposure to workers.

  17. Integration of isothermal amplification methods in microfluidic devices: Recent advances.

    PubMed

    Giuffrida, Maria Chiara; Spoto, Giuseppe

    2017-04-15

    The integration of nucleic acids detection assays in microfluidic devices represents a highly promising approach for the development of convenient, cheap and efficient diagnostic tools for clinical, food safety and environmental monitoring applications. Such tools are expected to operate at the point-of-care and in resource-limited settings. The amplification of the target nucleic acid sequence represents a key step for the development of sensitive detection protocols. The integration in microfluidic devices of the most popular technology for nucleic acids amplifications, polymerase chain reaction (PCR), is significantly limited by the thermal cycling needed to obtain the target sequence amplification. This review provides an overview of recent advances in integration of isothermal amplification methods in microfluidic devices. Isothermal methods, that operate at constant temperature, have emerged as promising alternative to PCR and greatly simplify the implementation of amplification methods in point-of-care diagnostic devices and devices to be used in resource-limited settings. Possibilities offered by isothermal methods for digital droplet amplification are discussed.

  18. FOREWORD: Proceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference

    NASA Astrophysics Data System (ADS)

    Jasiński, Piotr; Górecki, Krzysztof; Bogdanowicz, Robert

    2016-01-01

    These proceedings are a collection of the selected articles presented at the 39th International Microelectronics and Packaging IMAPS Poland Conference, held in Gdansk, Poland on September 20-23, 2015 (IMAPS Poland 2015). The conference has been held under the scientific patronage of the International Microelectronics and Packaging Society Poland Chapter and the Committee of Electronics and Telecommunication, Polish Academy of Science and jointly hosted by the Gdansk University of Technology, Faculty of Electronics, Telecommunication and Informatics (GUT) and the Gdynia Maritime University, Faculty of Electrical Engineering (GMU). The IMAPS Poland conference series aims to advance interdisciplinary scientific information exchange and the discussion of the science and technology of advanced electronics. The IMAPS Poland 2015 conference took place in the heart of Gdansk, two minutes walking distance from the beach. The surroundings and location of the venue guaranteed excellent working and leisure conditions. The three-day conference highlighted invited talks by outstanding scientists working in important areas of electronics and electronic material science. The eight sessions covered areas in the fields of electronics packaging, interconnects on PCB, Low Temperature Co-fired Ceramic (LTCC), MEMS devices, transducers, sensors and modelling of electronic devices. The conference was attended by 99 participants from 11 countries. The conference schedule included 18 invited presentations and 78 poster presentations.

  19. Managing the Manpower Aspects of Applying Micro-Electronics Technology.

    ERIC Educational Resources Information Center

    Thornton, P.; Routledge, C.

    1980-01-01

    Outlines major effects that the application of micro-electronics devices in products/processes and in office systems will have on future manpower and skill requirements in manufacturing organizations. Identifies the type of problems these changes will pose for manpower managers. Provides general guidelines for the successful management of these…

  20. Surface reactions in microelectronics process technology.

    PubMed

    Levitin, Galit; Hess, Dennis W

    2011-01-01

    Current integrated circuit (IC) manufacturing consists of more than 800 process steps, nearly all of which involve reactions at surfaces that significantly impact device yield and performance. From initial surface preparation through film deposition, patterning, etching, residue removal, and metallization, an understanding of surface reactions and interactions is critical to the successful continuous scaling, yield, and reliability of electronic devices. In this review, some of the most important surface reactions that drive the development of microelectronic device fabrication are described. The reactions discussed do not constitute comprehensive coverage of this topic in IC manufacture but have been selected to demonstrate the importance of surface/interface reactions and interactions in the development of new materials, processing sequences, and process integration challenges. Specifically, the review focuses on surface reactions related to surface cleaning/preparation, semiconductor film growth, dielectric film growth, metallization, and etching (dry and wet).

  1. Animal experiments with the microelectronics neural bridge IC.

    PubMed

    Li, Wenyuan; Pei, Fei; Wang, Zhigong; Lü, Xiaoying

    2012-01-01

    The combination of the neural science and the microelectronics science offers a new way to restore the function of central nervous system. A neural regeneration module is used to be implanted into body to bridge the damaged nerve. A microelectronics neural bridge IC designed in CSMC 0.5□m CMOS process which can detect the neural signal and stimulate the nerve is presented. The neural regeneration module is composed of the microelectronics neural bridge IC and some discrete devices. An animal experiment has been done to check whether the neural signal can be transmitted with the chip normally or not. The animal experiment results suggest that the neural regeneration module can make the neural signal transmit normally.

  2. TID Simulation of Advanced CMOS Devices for Space Applications

    NASA Astrophysics Data System (ADS)

    Sajid, Muhammad

    2016-07-01

    This paper focuses on Total Ionizing Dose (TID) effects caused by accumulation of charges at silicon dioxide, substrate/silicon dioxide interface, Shallow Trench Isolation (STI) for scaled CMOS bulk devices as well as at Buried Oxide (BOX) layer in devices based on Silicon-On-Insulator (SOI) technology to be operated in space radiation environment. The radiation induced leakage current and corresponding density/concentration electrons in leakage current path was presented/depicted for 180nm, 130nm and 65nm NMOS, PMOS transistors based on CMOS bulk as well as SOI process technologies on-board LEO and GEO satellites. On the basis of simulation results, the TID robustness analysis for advanced deep sub-micron technologies was accomplished up to 500 Krad. The correlation between the impact of technology scaling and magnitude of leakage current with corresponding total dose was established utilizing Visual TCAD Genius program.

  3. Advanced Measurement Devices for the Microgravity Electromagnetic Levitation Facility EML

    NASA Technical Reports Server (NTRS)

    Brillo, Jurgen; Fritze, Holger; Lohofer, Georg; Schulz, Michal; Stenzel, Christian

    2012-01-01

    This paper reports on two advanced measurement devices for the microgravity electromagnetic levitation facility (EML), which is currently under construction for the use onboard the "International Space Station (ISS)": the "Sample Coupling Electronics (SCE)" and the "Oxygen Sensing and Control Unit (OSC)". The SCE measures by a contactless, inductive method the electrical resistivity and the diameter of a spherical levitated metallic droplet by evaluating the voltage and electrical current applied to the levitation coil. The necessity of the OSC comes from the insight that properties like surface tension or, eventually, viscosity cannot seriously be determined by the oscillating drop method in the EML facility without knowing the conditions of the surrounding atmosphere. In the following both measurement devices are explained and laboratory test results are presented.

  4. Magnetic resonance tracking of catheters and mechatronic devices operating in the vascular network with an embedded photovoltaic-based microelectronic circuit.

    PubMed

    Sharafi, Azadeh; Martel, Sylvain

    2013-01-01

    Tracking of a catheter through the arterial system is critical in several medical interventions. To avoid excessive dose of x-ray irradiation, Magnetic Resonance Imaging (MRI) has been proposed. In such a case, a simple ferromagnetic sphere placed at the tip of the catheter could be used. However, due to the artifact created by the ferromagnetic core, it becomes impossible to gather an image of the tissues surrounding such a marker. Hence, in this paper we propose replacing the ferromagnetic marker with a microchip containing a coil and a photovoltaic cell. By radiating light to the photovoltaic cell, the coil generates a magnetic field which is detected as an artifact in MR images. By turning off the light, the effect of the coil is eliminated allowing images of tissues next to the marker to be taken. In this paper, simulated results based on experimental data from the preliminary designs suggest that this approach could be viable not only for catheters but also, it could potentially be used in various tools as well as mechatronic devices being moved inside the body.

  5. MICROELECTRONICS: Flip the Chip.

    PubMed

    Wong, C P; Luo, S; Zhang, Z

    2000-12-22

    As integrated circuit fabrication advances rapidly and the market for faster, lighter, smaller, yet less expensive electronic products accelerates, electronic packaging faces its own challenges. In this Perspective, Wong, Luo, and Zhang describe recent advances in flip chip packaging. This technology has many advantages over the conventional wire bonding technology and offers the possibility of low-cost electronic assembly for modern electronic products.

  6. Microelectronics: Their Implications for Education and Training.

    ERIC Educational Resources Information Center

    Audiovisual Instruction, 1979

    1979-01-01

    This two-part article indicates some probable characteristics of the microelectronics in the future and assesses implications of the microelectronics revolution for the methods and systems currently used in teaching and training. (CMV)

  7. [Device-aided therapies in advanced Parkinson's disease].

    PubMed

    Timofeeva, A A

    2016-01-01

    Advanced stages of Parkinson's disease (PD) is a consequence of the severe neurodegenerative process and are characterized by the development of motor fluctuations and dyskinesia, aggravation of non-motor symptoms. Treatment with peroral and transdermal drugs can't provide an adequate control of PD symptoms and quality-of-life of the patients at this stage of disease. Currently, three device-aided therapies: deep brain stimulation (DBS), intrajejunal infusion of duodopa, subcutaneous infusion of apomorphine can be used in treatment of patients with advanced stages of PD. Timely administration of device-aided therapies and right choice of the method determine, to a large extent, the efficacy and safety of their use. Despite the high efficacy of all three methods with respect to the fluctuation of separate symptoms, each method has its own peculiarities. The authors reviewed the data on the expediency of using each method according to the severity of motor and non-motor symptoms, patient's age, PD duration, concomitant pathology and social support of the patients.

  8. CRRES microelectronics package flight data analysis

    NASA Technical Reports Server (NTRS)

    Stassinopoulos, E. G.; Brucker, G. J.; Stauffer, C. A.

    1993-01-01

    A detailed in-depth analysis was performed on the data from some of the CRRES MEP (Microelectronics Package) devices. These space flight measurements covered a period of about fourteen months of mission lifetime. Several types of invalid data were identified and corrections were made. Other problems were noted and adjustments applied, as necessary. Particularly important and surprising were observations of abnormal device behavior in many parts that could neither be explained nor correlated to causative events. Also, contrary to prevailing theory, proton effects appeared to be far more significant and numerous than cosmic ray effects. Another unexpected result was the realization that only nine out of thirty-two p-MOS dosimeters on the MEP indicated a valid operation. Comments, conclusions, and recommendations are given.

  9. Recent Advances in Conjugated Polymers for Light Emitting Devices

    PubMed Central

    AlSalhi, Mohamad Saleh; Alam, Javed; Dass, Lawrence Arockiasamy; Raja, Mohan

    2011-01-01

    A recent advance in the field of light emitting polymers has been the discovery of electroluminescent conjugated polymers, that is, kind of fluorescent polymers that emit light when excited by the flow of an electric current. These new generation fluorescent materials may now challenge the domination by inorganic semiconductor materials of the commercial market in light-emitting devices such as light-emitting diodes (LED) and polymer laser devices. This review provides information on unique properties of conjugated polymers and how they have been optimized to generate these properties. The review is organized in three sections focusing on the major advances in light emitting materials, recent literature survey and understanding the desirable properties as well as modern solid state lighting and displays. Recently, developed conjugated polymers are also functioning as roll-up displays for computers and mobile phones, flexible solar panels for power portable equipment as well as organic light emitting diodes in displays, in which television screens, luminous traffic, information signs, and light-emitting wallpaper in homes are also expected to broaden the use of conjugated polymers as light emitting polymers. The purpose of this review paper is to examine conjugated polymers in light emitting diodes (LEDs) in addition to organic solid state laser. Furthermore, since conjugated polymers have been approved as light-emitting organic materials similar to inorganic semiconductors, it is clear to motivate these organic light-emitting devices (OLEDs) and organic lasers for modern lighting in terms of energy saving ability. In addition, future aspects of conjugated polymers in LEDs were also highlighted in this review. PMID:21673938

  10. Microelectronics in Education--A Changing Future.

    ERIC Educational Resources Information Center

    Humphries, Chris

    1985-01-01

    Describes major program activities of Microelectronics Education Programme (MEP) for England, Wales, and Northern Ireland, which is designed to help schools prepare children for society with microelectronics. The core elements and potential consequences of the Microelectronics Support Unit, a follow-up to MEP which will conclude activities in…

  11. Insertion device operating experience at the Advanced Photon Source

    NASA Astrophysics Data System (ADS)

    Grimmer, John; Ramanathan, Mohan; Smith, Martin; Merritt, Michael

    2002-03-01

    The Advanced Photon Source has 29 insertion devices (IDs) installed in the 7 GeV electron storage ring; 28 of these devices, most of which are 3.3 cm period undulators, use two horizontal permanent magnet structures positioned over a straight vacuum chamber. A support and drive mechanism allows the vertical gap between the magnet structures to be varied, thus changing the x-ray energy produced by the ID [J. Viccaro, Proc. SPIE 1345, 28 (1990); E. Gluskin, J. Synchrotron Radiat. 5, 189 (1998)]. Most of these IDs use a drive scheme with two stepper motors, one driving each end through a mechanism synchronizing the upper and lower magnet structures. Our experience in almost 5 yr of operating this system will be discussed. All of the IDs are in continuous operation for approximately 10 weeks at a time. Reliability of operation is of paramount importance, as access to the storage ring for servicing of a single ID inhibits operation for all users. Our experience in achieving highly reliable ID operation is reviewed. Accuracy of operation and repeatability over time are also vital. To this end, these devices use absolute optical linear encoders with submicron resolution for primary position feedback. Absolute rotary encoders are used as a backup to the linear encoders. The benefits and limitations of each type of encoder, and our experience dealing with radiation and electrical noise are reviewed. The insertion devices operate down to gaps as small as 8.5 mm, with clearance over the vacuum chamber as small as 200 μm. The vacuum chamber has a minimum wall thickness of only 1 mm. A number of levels of safeguards are used to prevent contact between the magnet structure and the vacuum chamber. These safeguards and their evolution after gaining operational experience are presented.

  12. Center for Space Microelectronics Technology

    NASA Technical Reports Server (NTRS)

    1991-01-01

    The 1990 technical report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the center during 1990. The report lists 130 publications, 226 presentations, and 87 new technology reports and patents.

  13. Microelectronics/electronic packaging potential

    NASA Technical Reports Server (NTRS)

    Sandeau, R. F.

    1977-01-01

    The trend toward smaller and lighter electronic packages was examined. It is suggested that electronic packaging engineers and microelectronic designers closely associate and give full attention to optimization of both disciplines on all product lines. Extensive research and development work underway to explore innovative ideas and make new inroads into the technology base, is expected to satisfy the demands of the 1980's.

  14. Center for Space Microelectronics Technology

    NASA Technical Reports Server (NTRS)

    1992-01-01

    The 1991 Technical Report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the Center during the past year. The report lists 193 publications, 211 presentations, and 125 new technology reports and patents.

  15. Microelectronics and Computers in Medicine.

    ERIC Educational Resources Information Center

    Meindl, James D.

    1982-01-01

    The use of microelectronics and computers in medicine is reviewed, focusing on medical research; medical data collection, storage, retrieval, and manipulation; medical decision making; computed tomography; ultrasonic imaging; role in clinical laboratories; and use as adjuncts for diagnostic tests, monitors of critically-ill patients, and with the…

  16. Fundamentals of Microelectronics Processing (VLSI).

    ERIC Educational Resources Information Center

    Takoudis, Christos G.

    1987-01-01

    Describes a 15-week course in the fundamentals of microelectronics processing in chemical engineering, which emphasizes the use of very large scale integration (VLSI). Provides a listing of the topics covered in the course outline, along with a sample of some of the final projects done by students. (TW)

  17. Launching a Programme on Microelectronics.

    ERIC Educational Resources Information Center

    Fothergill, Richard

    1982-01-01

    Discusses the priorities and problems in the development by the United Kingdom Department of Education and Science of a program to introduce microelectronic technology to elementary and secondary level students. The basic needs for program implementation, information support required for the program, inservice teacher training, and curriculum…

  18. Micromechanical structures and microelectronics for acceleration sensing

    NASA Astrophysics Data System (ADS)

    Davies, Brady R.; Montague, Stephen; Smith, James H.; Lemkin, Mark

    1997-09-01

    MEMS is an enabling technology that may provide low-cost devices capable of sensing motion in a reliable and accurate manner. This paper describes work in MEMS accelerometer development at Sandia National Laboratories. This work leverages a process for integrating both the micromechanical structures and microelectronics circuitry of a MEMS accelerometer on the same chip. The design and test results of an integrated MEMS high-g accelerometer will be detailed. Additionally a design for a high-g fuse component (low-G or approximately equals 25 G accelerometer) will be discussed in the paper (where 1 G approximately equals 9.81 m/s). In particular, a design team at Sandia was assembled to develop a new micromachined silicon accelerometer which would be capable of surviving and measuring high-g shocks. Such a sensor is designed to be cheaper and more reliable than currently available sensors. A promising design for a suspended plate mass sensor was developed and the details of that design along with test data will be documented in the paper. Future development in this area at Sandia will focus on implementing accelerometers capable of measuring 200 kilo-g accelerations. Accelerometer development at Sandia will also focus on multi-axis acceleration measurement with integrated microelectronics.

  19. Microelectronics effects as seen on CRRES.

    PubMed

    Mullen, E G; Ray, K P

    1994-10-01

    A MicroElectronics Test Package (MEP) measured total dose degradation and single event upsets (SEUs) on 60 device types on the Combined Release and Radiation Effects Satellite (CRRES) in an 18 degrees inclination orbit between 350 km and 36000 km from July 1990 to October 1991. Simultaneous measurements of the high energy particle environment were used to make a direct cause and effect comparison of the energetic particle backgrounds and microelectronic performance characteristics. The galactic cosmic ray background for the period of the CRRES mission was at a minimum. The SEUs experienced from the cosmic ray background were correspondingly few in number, but surprisingly produced an equal probability of upset over an L-shell range of 8.5 Earth radii (RE) down to less than 3.0 RE. Cosmic ray induced upset frequencies in proton sensitive chips were over 2 orders of magnitude lower than those produced by protons in the heart of the inner proton radiation belts. Multiple upsets, those produced when a single particle upsets more than one memory location, were just as common from protons as from cosmic rays.

  20. Radiation doses to insertion devices at the Advanced Photon Source

    SciTech Connect

    Moog, E.R.; Den Hartog, P.K.; Semones, E.J.; Job, P.K.

    1997-09-01

    Dose measurements made on and around the insertion devices (IDs) at the Advanced Photon Source are reported. Attempts are made to compare these dose rates to dose rates that have been reported to cause radiation-induced demagnetization, but comparisons are complicated by such factors as the particular magnet material and the techniques used in its manufacture, the spectrum and type of radiation, and the demagnetizing field seen by the magnet. The spectrum of radiation at the IDs. It has almost no effect on the dose to the downstream ends of the IDs, however, since much of the radiation travels through the ID vacuum chamber and cannot be readily shielded. Opening the gaps of the IDs during injection and at other times also helps decrease the radiation exposure.

  1. Applications of laser direct-write for embedding microelectronics

    NASA Astrophysics Data System (ADS)

    Piqué, Alberto; Charipar, Nicholas A.; Kim, Heungsoo; Auyeung, Ray C. Y.; Mathews, Scott A.

    2007-03-01

    The use of direct-write techniques might revolutionize the way microelectronic devices such as interconnects, passives, IC's, antennas, sensors and power sources are designed and fabricated. The Naval Research Laboratory has developed a laser-based microfabrication process for direct-writing the materials and components required for the assembly and interconnection of the above devices. This laser direct-write (LDW) technique is capable of operating in subtractive, additive, and transfer mode. In subtractive mode, the system operates as a laser micromachining workstation capable of achieving precise depth and surface roughness control. In additive mode, the system utilizes a laser-forward transfer process for the deposition of metals, oxides, polymers and composites under ambient conditions onto virtually any type of surface, thus functioning as a laser printer for patterns of electronic materials. Furthermore, in transfer mode, the system is capable of transferring individual devices, such as semiconductor bare die or surface mount devices, inside a trench or recess in a substrate, thus performing the same function of the pick-and-place machines used in circuit board manufacture. The use of this technique is ideally suited for the rapid prototyping of embedded microelectronic components and systems while allowing the overall circuit design and layout to be easily modified or adapted to any specific application or form factor. This paper describes the laser direct-write process as applied to the forward transfer of microelectronic devices.

  2. 78 FR 3319 - Amendments to Existing Validated End User Authorizations: Advanced Micro Devices China, Inc., Lam...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-01-16

    ... Authorizations: Advanced Micro Devices China, Inc., Lam Research Corporation, SK hynix Semiconductor (China) Ltd... Advanced Micro Devices China Inc.'s (AMD China) current list of eligible destinations. BIS also amends the...-User Authorizations in the PRC Revisions to the List of Eligible Destinations for Advanced...

  3. 76 FR 48169 - Advancing Regulatory Science for Highly Multiplexed Microbiology/Medical Countermeasure Devices...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-08-08

    ... Microbiology/ Medical Countermeasure Devices; Public Meeting AGENCY: Food and Drug Administration, HHS. ACTION... following public meeting: ``Advancing Regulatory Science for Highly Multiplexed Microbiology/Medical... multiplexed microbiology/medical countermeasure (MCM) devices, their clinical application and public...

  4. PREFACE: The Second Conference on Microelectronics, Microsystems and Nanotechnology

    NASA Astrophysics Data System (ADS)

    Nassiopoulou, Androula G.; Papanikolaou, Nikos; Tsamis, Christos

    2005-01-01

    The Second Conference on Microelectronics, Microsystems and Nanotechnology took place at the National Centre for Scientific Research `Demokritos', in Athens, Greece, between 14 and 17 November 2004. The conference was organized by the Institute of Microelectronics (IMEL) with the aim to bring together scientists and engineers working in the above exciting fields in an interactive forum. The conference included 45 oral presentations with 9 invited papers and was attended by 146 participants from 16 countries. The topics covered were nanotechnologies, quantum devices, sensors, micro- and nano-systems, semiconductor devices, C-MOS fabrication and characterization techniques, new materials, and IC design. Quantum devices and nanostructured materials attracted considerable attention. Both theoretical and experimental studies of metallic and semiconducting quantum systems were presented, with emphasis on their applications in electronics, optoelectronics, and nanocrystal memory devices. Another exciting topic was the recent developments in biocompatible lithographic processes for applications in biosensors. In particular novel processes for bio-friendly lithography, together with innovations in Si sensors for applications in medicine and food industry were presented. Recent developments and perspectives in CMOS technology towards the ultimate limit were also discussed. The conference covered issues and concepts of IC design with two invited talks on RF design and cryptography.The conference included presentations from several companies active in the field of microelectronics and systems in Greece.

  5. PREFACE: E-MRS 2012 Spring Meeting, Symposium M: More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics

    NASA Astrophysics Data System (ADS)

    Wenger, Christian; Fompeyrine, Jean; Vallée, Christophe; Locquet, Jean-Pierre

    2012-12-01

    More than Moore explores a new area of Silicon based microelectronics, which reaches beyond the boundaries of conventional semiconductor applications. Creating new functionality to semiconductor circuits, More than Moore focuses on motivating new technological possibilities. In the past decades, the main stream of microelectronics progresses was mainly powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano scale, and SoC based system integration. While the microelectronics community continues to invent new solutions around the world to keep Moore's law alive, there is increasing momentum for the development of 'More than Moore' technologies which are based on silicon technologies but do not simply scale with Moore's law. Typical examples are RF, Power/HV, Passives, Sensor/Actuator/MEMS or Bio-chips. The More than Moore strategy is driven by the increasing social needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of wafer fabs, and the limiting cost and time factors of advanced SoC development. It is believed that More than Moore will add value to society on top of and beyond advanced CMOS with fast increasing marketing potentials. Important key challenges for the realization of the 'More than Moore' strategy are: perspective materials for future THz devices materials systems for embedded sensors and actuators perspective materials for epitaxial approaches material systems for embedded innovative memory technologies development of new materials with customized characteristics The Hot topics covered by the symposium M (More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics) at E-MRS 2012 Spring Meeting, 14-18 May 2012 have been: development of functional ceramics thin films New dielectric materials for advanced microelectronics bio- and CMOS compatible

  6. Near net shape forming of advanced structural ceramic devices

    NASA Astrophysics Data System (ADS)

    Liu, Hao-Chih

    This research applied a combination of rapid prototyping techniques and ceramic gelcasting processes in the design and manufacturing of advanced structural ceramic components that cannot be fabricated by other shape-forming processes. An Assembly Mold SDM process, a derivative process of Shape Deposition Manufacturing, was adopted along with modified gelcasting with great success. The fabricated gas turbine rotors, inlet nozzles, and mesoscale burner arrays have demonstrated superior shape accuracy, mechanical strength, and surface smoothness with a feature size of 200 mum. The design concepts and functionalities of the ceramic devices were verified with performance tests. The shape complexity and surface quality of ceramic parts have been further improved by the use of a mold assembly made of a low melting temperature metal alloy. The introduction of metal alloy required modifications in the mold design, machining procedure, and ceramic processing. A complete shape forming process (from slurry to final parts) was developed for the low melting temperature metal alloy. In addition, the choice of ceramic material now includes SiC, which is critical to the development of micro heat exchangers. Forty-channel, high-aspect-ratio structured SiC heat exchangers were fabricated, and the thermal conductivity value of SiC was found to be comparable to that of steel. The catalyst deposition and ceramic precursor impregnation processes were proposed to enable use of the SiC heat exchangers as micro reactors. Micro-electro-mechanical-systems (MEMS)-related techniques such as SU-8 deep photolithography and polydimethylsiloxane (PDMS) soft lithography were combined with gelcasting to make micro patterns on structural ceramics. A feature size of 125 mum and aspect ratio of 8 have been achieved in the preliminary experiments. Based on the fabricated ceramic devices, a graphical method to characterize the shape attributes of complex-shaped components was proposed and used to compare

  7. Advanced, High Power, Next Scale, Wave Energy Conversion Device

    SciTech Connect

    Mekhiche, Mike; Dufera, Hiz; Montagna, Deb

    2012-10-29

    The project conducted under DOE contract DE‐EE0002649 is defined as the Advanced, High Power, Next Scale, Wave Energy Converter. The overall project is split into a seven‐stage, gated development program. The work conducted under the DOE contract is OPT Stage Gate III work and a portion of Stage Gate IV work of the seven stage product development process. The project effort includes Full Concept Design & Prototype Assembly Testing building on our existing PowerBuoy technology to deliver a device with much increased power delivery. Scaling‐up from 150kW to 500kW power generating capacity required changes in the PowerBuoy design that addressed cost reduction and mass manufacturing by implementing a Design for Manufacturing (DFM) approach. The design changes also focused on reducing PowerBuoy Installation, Operation and Maintenance (IO&M) costs which are essential to reducing the overall cost of energy. In this design, changes to the core PowerBuoy technology were implemented to increase capability and reduce both CAPEX and OPEX costs. OPT conceptually envisaged moving from a floating structure to a seabed structure. The design change from a floating structure to seabed structure would provide the implementation of stroke‐ unlimited Power Take‐Off (PTO) which has a potential to provide significant power delivery improvement and transform the wave energy industry if proven feasible.

  8. Interconnect mechanisms in microelectronic packaging

    NASA Astrophysics Data System (ADS)

    Roma, Maria Penafrancia C.

    Global economic, environmental and market developments caused major impact in the microelectronics industry. Astronomical rise of gold metal prices over the last decade shifted the use of copper and silver alloys as bonding wires. Environmental legislation on the restriction of the use of Pb launched worldwide search for lead-free solders and platings. Finally, electrical and digital uses demanded smaller, faster and cheaper devices. Ultra-fine pitch bonding, decreasing bond wire sizes and hard to bond substrates have put the once-robust stitch bond in the center of reliability issues due to stitch bond lift or open wires .Unlike the ball bond, stitch bonding does not lead to intermetallic compound formation but adhesion is dependent on mechanical deformation, interdiffusion, solid solution formation, void formation and mechanical interlocking depending on the wire material, bond configuration, substrate type , thickness and surface condition. Using Au standoff stitch bonds on NiPdAu plated substrates eliminated stitch bond lift even when the Au and Pd layers are reduced. Using the Matano-Boltzmann analysis on a STEM (Scanning Transmission Analysis) concentration profile the interdiffusion coefficient is measured to be 10-16 cm 2/s. Wire pull strength data showed that the wire pull strength is 0.062N and increases upon stress testing. Meanwhile, coating the Cu wire with Pd, not only increases oxidation resistance but also improved adhesion due to the formation of a unique interfacial adhesion layers. Adhesion strength as measured by pull showed the Cu wire bonded to Ag plated Cu substrate (0.132N) to be stronger than the Au wire bonded on the same substrate (0.124N). Ag stitch bonded to Au is predicted to be strong but surface modification made the adhesion stronger. However, on the Ag ball bonded to Al showed multiple IMC formation with unique morphology exposed by ion milling and backscattered scanning electron microscopy. Adding alloying elements in the Ag wire

  9. Microelectronics packaging research directions for aerospace applications

    NASA Technical Reports Server (NTRS)

    Galbraith, L.

    2003-01-01

    The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.

  10. Using advanced mobile devices in nursing practice--the views of nurses and nursing students.

    PubMed

    Johansson, Pauline; Petersson, Göran; Saveman, Britt-Inger; Nilsson, Gunilla

    2014-09-01

    Advanced mobile devices allow registered nurses and nursing students to keep up-to-date with expanding health-related knowledge but are rarely used in nursing in Sweden. This study aims at describing registered nurses' and nursing students' views regarding the use of advanced mobile devices in nursing practice. A cross-sectional study was completed in 2012; a total of 398 participants replied to a questionnaire, and descriptive statistics were applied. Results showed that the majority of the participants regarded an advanced mobile device to be useful, giving access to necessary information and also being useful in making notes, planning their work and saving time. Furthermore, the advanced mobile device was regarded to improve patient safety and the quality of care and to increase confidence. In order to continuously improve the safety and quality of health care, advanced mobile devices adjusted for nursing practice should be further developed, implemented and evaluated in research.

  11. Advanced Energy Harvesting Control Schemes for Marine Renewable Energy Devices

    SciTech Connect

    McEntee, Jarlath; Polagye, Brian; Fabien, Brian; Thomson, Jim; Kilcher, Levi; Marnagh, Cian; Donegan, James

    2016-03-31

    The Advanced Energy Harvesting Control Schemes for Marine Renewable Energy Devices (Project) investigated, analyzed and modeled advanced turbine control schemes with the objective of increasing the energy harvested by hydrokinetic turbines in turbulent flow. Ocean Renewable Power Company (ORPC) implemented and validated a feedforward controller to increase power capture; and applied and tested the controls on ORPC’s RivGen® Power Systems in Igiugig, Alaska. Assessments of performance improvements were made for the RivGen® in the Igiugig environment and for ORPC’s TidGen® Power System in a reference tidal environment. Annualized Energy Production (AEP) and Levelized Cost of Energy (LCOE) improvements associated with implementation of the recommended control methodology were made for the TidGen® Power System in the DOE reference tidal environment. System Performance Advancement (SPA) goals were selected for the project. SPA targets were to improve Power to Weight Ratio (PWR) and system Availability, with the intention of reducing Levelized Cost of Electricity (LCOE). This project focused primarily reducing in PWR. Reductions in PWR of 25.5% were achieved. Reductions of 20.3% in LCOE were achieved. This project evaluated four types of controllers which were tested in simulation, emulation, a laboratory flume, and the field. The adaptive Kω2 controller performs similarly to the non-adaptive version of the same controller and may be useful in tidal channels where the mean velocity is continually evolving. Trends in simulation were largely verified through experiments, which also provided the opportunity to test assumptions about turbine responsiveness and control resilience to varying scales of turbulence. Laboratory experiments provided an essential stepping stone between simulation and implementation on a field-scale turbine. Experiments also demonstrated that using “energy loss” as a metric to differentiate between well-designed controllers operating at

  12. Advanced fiber lasers and related all-fiber devices

    NASA Astrophysics Data System (ADS)

    Srinivasan, Balaji

    2000-11-01

    :ZBLAN. The demonstration of substantial second order nonlinearities (~1 pm/V) at UNM using thermal- assisted poling in normally symmetry forbidden silica glass has inspired worldwide research efforts aimed at achieving similar nonlinearities in fibers. All-fiber electro-optic devices based on such poled fibers are anticipated to enhance the performance of various lasers, including modelocked and tunable fiber lasers. This dissertation presents the first demonstration of stable, electro-optically tunable fiber Bragg gratings (FBGs) with a tuning range of 20 pm (2.5 GHz), which should enable applications such as reconfigurable add/drop filters and actively modelocked all-fiber lasers. Two key steps in the fabrication of the tunable FBGs viz. the fabrication of thermally stable FBGs, and a novel method for in-situ monitoring of fiber polishing are also demonstrated. Finally, this dissertation discusses issues related to the demonstration of all-fiber electro- optically tunable polarization rotators and their possible impact on future advanced fiber lasers.

  13. Point-of-Care (POC) Devices by Means of Advanced MEMS

    PubMed Central

    Karsten, Stanislav L.; Tarhan, Mehmet C.; Kudo, Lili C.; Collard, Dominique; Fujita, Hiroyuki

    2015-01-01

    Microelectromechanical systems (MEMS) have become an invaluable technology to advance the development of point-of-care (POC) devices for diagnostics and sample analyses. MEMS can transform sophisticated methods into compact and cost-effective microdevices that offer numerous advantages at many levels. Such devices include microchannels, microsensors, etc., that have been applied to various miniaturized POC products. Here we discuss some of the recent advances made in the use of MEMS devices for POC applications. PMID:26459443

  14. Durable left ventricular assist device therapy in advanced heart failure: Patient selection and clinical outcomes

    PubMed Central

    Shah, Sachin P.; Mehra, Mandeep R.

    2016-01-01

    The increasing adoption of left ventricular assist devices (LVADs) into clinical practice is related to a combination of engineering advances in pump technology and improvements in understanding the appropriate clinical use of these devices in the management of patients with advanced heart failure. This review intends to assist the clinician in identifying candidates for LVAD implantation, to examine long-term outcomes and provide an overview of the common complications related to use of these devices. PMID:27056652

  15. Microelectronic superconducting crossover and coil

    DOEpatents

    Wellstood, Frederick C.; Kingston, John J.; Clarke, John

    1994-01-01

    A microelectronic component comprising a crossover is provided comprising a substrate, a first high T.sub.c superconductor thin film, a second insulating thin film comprising SrTiO.sub.3 ; and a third high T.sub.c superconducting film which has strips which crossover one or more areas of the first superconductor film. An in situ method for depositing all three films on a substrate is provided which does not require annealing steps and which can be opened to the atmosphere between depositions.

  16. Microelectronic superconducting crossover and coil

    DOEpatents

    Wellstood, F.C.; Kingston, J.J.; Clarke, J.

    1994-03-01

    A microelectronic component comprising a crossover is provided comprising a substrate, a first high T[sub c] superconductor thin film, a second insulating thin film comprising SrTiO[sub 3]; and a third high T[sub c] superconducting film which has strips which crossover one or more areas of the first superconductor film. An in situ method for depositing all three films on a substrate is provided which does not require annealing steps and which can be opened to the atmosphere between depositions. 13 figures.

  17. Relevance of microelectronic education to industrial needs

    NASA Technical Reports Server (NTRS)

    Prince, J. L.; Lathrop, J. W.

    1977-01-01

    The relevance of microelectronic education to industrial needs was evaluated, and four categories were surveyed: (1) facts and rules; (2) skills; (3) personality; and (4) deductive-inductive reasoning. Examples of specific items in each category are given to illustrate their meaning and it was indicated as to which items in each category are strongly impacted by microelectronics courses and laboratories.

  18. Educational Implications of Microelectronics and Microprocessors.

    ERIC Educational Resources Information Center

    Harris, N. D. C., Ed.

    This conference report explores microelectronic technology, its effect on educational methods and objectives, and its implications for educator responsibilities. Two main areas were considered: the significance of the likely impact of the large scale introduction of microprocessors and microelectronics on commercial and industrial processes, the…

  19. The Legacy of the Microelectronics Education Programme.

    ERIC Educational Resources Information Center

    Thorne, Michael

    1987-01-01

    Describes the Microelectronics Education Programme (MEP), a plan developed to help British secondary school students learn about microcomputers and the role of technology in society, and its successor, the Microelectronics Support Unit (MESU). Highlights include curriculum development, teacher training, computer assisted instruction and the…

  20. Development of the Microelectronic Education Programme.

    ERIC Educational Resources Information Center

    Fothergill, Richard

    1982-01-01

    Describes the development of the Microelectronics Education Programme for England, Northern Ireland and Wales, including funding, aims, and relationships of the national program with local organizations. The program focuses on incorporating uses/effects of microelectronic technology into the total school curriculum and ways of using this…

  1. Advanced Materials for Use in Soft Self-Healing Devices.

    PubMed

    Huynh, Tan-Phat; Sonar, Prashant; Haick, Hossam

    2017-02-23

    Devices integrated with self-healing ability can benefit from long-term use as well as enhanced reliability, maintenance and durability. This progress report reviews the developments in the field of self-healing polymers/composites and wearable devices thereof. One part of the progress report presents and discusses several aspects of the self-healing materials chemistry (from non-covalent to reversible covalent-based mechanisms), as well as the required main approaches used for functionalizing the composites to enhance their electrical conductivity, magnetic, dielectric, electroactive and/or photoactive properties. The second and complementary part of the progress report links the self-healing materials with partially or fully self-healing device technologies, including wearable sensors, supercapacitors, solar cells and fabrics. Some of the strong and weak points in the development of each self-healing device are clearly highlighted and criticized, respectively. Several ideas regarding further improvement of soft self-healing devices are proposed.

  2. Semiconductor materials and microelectronic circuits

    NASA Astrophysics Data System (ADS)

    Kolesar, Edward S.

    Microminiaturization developments in IC systems have dramatically increased the reliability and performance of electronic components while reducing their physical size and power requirements; these advancements have pervasively affected weapons systems design efforts. Built-in self-test circuitry has greatly reduced maintenance problems and improved overall systems reliability. Increasing circuit complexity has also led to a major expansion of key military operational capabilities for reconnaissance, surveillance, and target acquisition. It is expected that Si-based ICs will continue to dominate high power solid-state switches in hypervelocity projectiles and beam weapons, while GaAs will remain the most commonly employed material in microwave and mm-wave devices for EW, radars, smart weapons, and communications.

  3. Advanced integrated safeguards using front-end-triggering devices

    SciTech Connect

    Howell, J.A.; Whitty, W.J.

    1995-12-01

    This report addresses potential uses of front-end-triggering devices for enhanced safeguards. Such systems incorporate video surveillance as well as radiation and other sensors. Also covered in the report are integration issues and analysis techniques.

  4. Advanced, High Power, Next Scale, Wave Energy Conversion Device

    SciTech Connect

    Hart, Philip R.

    2011-09-27

    This presentation from the Water Peer Review highlights one of the program's marine and hyrokinetics device design projects to scale up the current Ocean Power Technology PowerBuoy from 150kW to 500kW.

  5. Radiation Hardening of CMOS Microelectronics

    SciTech Connect

    McCarthy, A.; Sigmon, T.W.

    2000-02-20

    A unique methodology, silicon transfer to arbitrary substrates, has been developed under this program and is being investigated as a technique for significantly increasing the radiation insensitivity of limited quantities of conventional silicon microelectronic circuits. In this approach, removal of the that part of the silicon substrate not required for circuit operation is carried out, following completion of the circuit fabrication process. This post-processing technique is therefore applicable to state-of-the-art ICs, effectively bypassing the 3-generation technology/performance gap presently separating today's electronics from available radiation-hard electronics. Also, of prime concern are the cost savings that result by eliminating the requirement for costly redesign of commercial circuits for Rad-hard applications. Successful deployment of this technology will result in a major impact on the radiation hard electronics community in circuit functionality, design and software availability and fabrication costs.

  6. To ventricular assist devices or not: When is implantation of a ventricular assist device appropriate in advanced ambulatory heart failure?

    PubMed Central

    Cerier, Emily; Lampert, Brent C; Kilic, Arman; McDavid, Asia; Deo, Salil V; Kilic, Ahmet

    2016-01-01

    Advanced heart failure has been traditionally treated via either heart transplantation, continuous inotropes, consideration for hospice and more recently via left ventricular assist devices (LVAD). Heart transplantation has been limited by organ availability and the futility of other options has thrust LVAD therapy into the mainstream of therapy for end stage heart failure. Improvements in technology and survival combined with improvements in the quality of life have made LVADs a viable option for many patients suffering from heart failure. The question of when to implant these devices in those patients with advanced, yet still ambulatory heart failure remains a controversial topic. We discuss the current state of LVAD therapy and the risk vs benefit of these devices in the treatment of heart failure. PMID:28070237

  7. Devices in the management of advanced, chronic heart failure

    PubMed Central

    Abraham, William T.; Smith, Sakima A.

    2013-01-01

    Heart failure (HF) is a global phenomenon, and the overall incidence and prevalence of the condition are steadily increasing. Medical therapies have proven efficacious, but only a small number of pharmacological options are in development. When patients cease to respond adequately to optimal medical therapy, cardiac resynchronization therapy has been shown to improve symptoms, reduce hospitalizations, promote reverse remodelling, and decrease mortality. However, challenges remain in identifying the ideal recipients for this therapy. The field of mechanical circulatory support has seen immense growth since the early 2000s, and left ventricular assist devices (LVADs) have transitioned over the past decade from large, pulsatile devices to smaller, more-compact, continuous-flow devices. Infections and haematological issues are still important areas that need to be addressed. Whereas LVADs were once approved only for ‘bridge to transplantation’, these devices are now used as destination therapy for critically ill patients with HF, allowing these individuals to return to the community. A host of novel strategies, including cardiac contractility modulation, implantable haemodynamic-monitoring devices, and phrenic and vagus nerve stimulation, are under investigation and might have an impact on the future care of patients with chronic HF. PMID:23229137

  8. Aircrew Training Devices: Utility and Utilization of Advanced Instructional Features. Phase 4. Summary Report.

    DTIC Science & Technology

    1987-11-01

    the automated instructional system on the Advanced Simulator for Pilot Training ( ASPT ) at Williams AF8, Arizona (Faconti & Epps, 1975; Faconti...Nortimer, & Simpson, 1970; Fuller, Waag, & Martin, 1980; Knoop, 1973). The ASPT is a sophisticated research device that incorporates advanced visual and...potential of the ASPT , Gray, Chun, Warner, and Eubanks (1981) found that SIs tended to use the device in a fairly conventional manner. with few

  9. Implications of Pb-free microelectronics assembly in aerospace applications

    NASA Technical Reports Server (NTRS)

    Shapiro, A. A.; Bonner, J. K.; Ogunseitan, D.; Saphores, J. D.; Schoenung, J.

    2003-01-01

    The commercial microelectronics industry is rapidly moving to completely Pb-free assembly strategies within the next decade. This trend is being driven by existing and proposed legislation in Europe and in Japan. The microelectronics industry has become truly global, as indicated by major U .S. firms who already adopted Pb-free implementation programs. Among these forward-looking firms are AT&T, IBM, Motorola, HP and Intel to name a few.Following Moore's law, advances in microelectronics are happening very rapidly. In many cases, commercial industry is ahead of the aerospace sector in technology. Progress by commercial industry, along with cost, drives the use of Commercial Off-The-Shelf (COTS) parts for military and space applications. We can thus anticipate that the aerospace industry will, at some point, be forced to use Pb-free components and subsystems as part of their standard business practices. In this paper we attempt to provide a snapshot of the commercial industry trends and how they may impact electronics in the aerospace environment. In addition, we also look at different strategies for implementation. Finally we present data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The world is moving toward implementation of environmentally friendly manufacturing techniques. The aerospace industry will be forced to deal with issues related with Pb free assembly, either by availability or legislation. This paper provides some insight into some of the tradeoffs that should be considered.

  10. Ferrite-superconductor devices for advanced microwave applications

    SciTech Connect

    Dionne, G.F.; Oates, D.E.; Temme, D.H.; Weiss, J.A.

    1996-07-01

    Microwave devices comprising magnetized ferrite in contact with superconductor circuits designed to eliminate magnetic field penetration of the superconductor have demonstrated phase shift without significant conduction losses. The device structures are adaptable to low- or high-{Tc} superconductors. A nonoptimized design of a ferrite phase shifter that employs niobium or YBCO meanderlines has produced over 1,000 degrees of differential phase shift with a figure of merit exceeding 1,000 degrees/dB at X band. By combining superconductor meanderline sections with alternating T junctions on a ferrite substrate in a configuration with three-fold symmetry, a low-loss three-port switching circulator has been demonstrated.

  11. Carbon-ionogel supercapacitors for integrated microelectronics.

    PubMed

    Leung, Greg; Smith, Leland; Lau, Jonathan; Dunn, Bruce; Chui, Chi On

    2016-01-22

    To exceed the performance limits of dielectric capacitors in microelectronic circuit applications, we design and demonstrate on-chip coplanar electric double-layer capacitors (EDLCs), or supercapacitors, employing carbon-coated gold electrodes with ionogel electrolyte. The formation of carbon-coated microelectrodes is accomplished by solution processing and results in a ten-fold increase in EDLC capacitance compared to bare gold electrodes without carbon. At frequencies up to 10 Hz, an areal capacitance of 2.1 pF μm(-2) is achieved for coplanar carbon-ionogel EDLCs with 10 μm electrode gaps and 0.14 mm(2) electrode area. Our smallest devices, comprised of 5 μm electrode gaps and 80 μm(2) of active electrode area, reach areal capacitance values of ∼0.3 pF μm(-2) at frequencies up to 1 kHz, even without carbon. To our knowledge, these are the highest reported values to date for on-chip EDLCs with sub-mm(2) areas. A physical EDLC model is developed through the use of computer-aided simulations for design exploration and optimization of coplanar EDLCs. Through modeling and comparison with experimental data, we highlight the importance of reducing the electrode gap and electrolyte resistance to achieve maximum performance from on-chip EDLCs.

  12. Using federal technology policy to strength the US microelectronics industry

    SciTech Connect

    Gover, J.E.; Gwyn, C.W.

    1994-07-01

    A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan`s government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

  13. A Comprehensive Microfluidics Device Construction and Characterization Module for the Advanced Undergraduate Analytical Chemistry Laboratory

    ERIC Educational Resources Information Center

    Piunno, Paul A. E.; Zetina, Adrian; Chu, Norman; Tavares, Anthony J.; Noor, M. Omair; Petryayeva, Eleonora; Uddayasankar, Uvaraj; Veglio, Andrew

    2014-01-01

    An advanced analytical chemistry undergraduate laboratory module on microfluidics that spans 4 weeks (4 h per week) is presented. The laboratory module focuses on comprehensive experiential learning of microfluidic device fabrication and the core characteristics of microfluidic devices as they pertain to fluid flow and the manipulation of samples.…

  14. Novel device-based interventional strategies for advanced heart failure

    PubMed Central

    Vanderheyden, Marc; Bartunek, Jozef

    2016-01-01

    While heart failure is one of the leading causes of mortality and morbidity, our tools to provide ultimate treatment solutions are still limited. Recent developments in new devices are designed to fill this therapeutic gap. The scope of this review is to focus on two particular targets, namely (1) left ventricular geometric restoration and (2) atrial depressurization. (1) Reduction of the wall stress by shrinking the ventricular cavity has been traditionally attempted surgically. Recently, the Parachute device (CardioKinetix Inc., Menlo Park, CA, USA) has been introduced to restore ventricular geometry and cardiac mechanics. The intervention aims to partition distal dysfunctional segments that are non-contributory to the ventricular mechanics and forward cardiac output. (2) Diastolic heart failure is characterized by abnormal relaxation and chamber stiffness. The main therapeutic goal achieved should be the reduction of afterload and diastolic pressure load. Recently, new catheter-based approaches were proposed to reduce left atrial pressure and ventricular decompression: the InterAtrial Shunt Device (IASD™) (Corvia Medical Inc., Tewksbury, MA, USA) and the V-Wave Shunt (V-Wave Ltd, Or Akiva, Israel). Both are designed to create a controlled atrial septal defect in symptomatic patients with heart failure. While the assist devices are aimed at end-stage heart failure, emerging device-based percutaneous or minimal invasive techniques comprise a wide spectrum of innovative concepts that target ventricular remodeling, cardiac contractility or neuro-humoral modulation. The clinical adoption is in the early stages of the initial feasibility and safety studies, and clinical evidence needs to be gathered in appropriately designed clinical trials. PMID:26966444

  15. Optical packaging activities at Institute of Microelectronics (IME), Singapore

    NASA Astrophysics Data System (ADS)

    Teo, Keng-Hwa; Sudharsanam, Krishnamachari; Pamidighantam, Ramana V.; Yeo, Yongkee; Iyer, Mahadevan K.

    2002-08-01

    The development of optoelectronic components for gigabit Ethernet communications is converging towards access networks where the cost of device makes a significant impact on the market acceptance. Device fabrication and packaging cost have to be brought down with novel assembly and packaging methods. Singapore has established a reputation in semiconductor device development and fabrication with excellent process and packaging facilities. Institute of Microelectronics (IME) was founded in 1991 to add value to the Singapore electronics industry. IME is involved in the development of active and passive photonics components using Silicon and polymer materials. We present a brief report on the development activities taking place in the field of optical component packaging at IME in recent years. We present a review of our competence and some of the optical device packaging activities that are being undertaken.

  16. BORON NITRIDE CAPACITORS FOR ADVANCED POWER ELECTRONIC DEVICES

    SciTech Connect

    N. Badi; D. Starikov; C. Boney; A. Bensaoula; D. Johnstone

    2010-11-01

    This project fabricates long-life boron nitride/boron oxynitride thin film -based capacitors for advanced SiC power electronics with a broad operating temperature range using a physical vapor deposition (PVD) technique. The use of vapor deposition provides for precise control and quality material formation.

  17. Physical Limitations in Lithography for Microelectronics.

    ERIC Educational Resources Information Center

    Flavin, P. G.

    1981-01-01

    Describes techniques being used in the production of microelectronics kits which have replaced traditional optical lithography, including contact and optical projection printing, and X-ray and electron beam lithography. Also includes limitations of each technique described. (SK)

  18. A band-modulation device in advanced FDSOI technology: Sharp switching characteristics

    NASA Astrophysics Data System (ADS)

    El Dirani, Hassan; Solaro, Yohann; Fonteneau, Pascal; Legrand, Charles-Alex; Marin-Cudraz, David; Golanski, Dominique; Ferrari, Philippe; Cristoloveanu, Sorin

    2016-11-01

    A band-modulation device is demonstrated experimentally in advanced FDSOI (Fully Depleted SOI). The Z2-FET (Zero Impact Ionization and Zero Subthreshold Slope FET) is a very recent sharp switching device which achieves remarkable performance in terms of leakage current and triggering control. The device is fabricated with Ultra-Thin Body and Buried Oxide (UTBB) Silicon-On-Insulator (SOI) technology, features an extremely sharp on-switch, low leakage and an adjustable triggering voltage (VON). The Z2-FET operation relies on the modulation of electrons and holes injection barriers. In this paper, we show, for the first time, experimental data obtained with the most advanced FDSOI node.

  19. Development of a micropump for microelectronic cooling

    SciTech Connect

    Wong, C.C.; Adkins, D.R.; Chu, Dahwey

    1996-10-01

    To demonstrate a system integration process for Micro-Electro-Mechanical Systems (MEMS), we are building an active cooling MEMS unit for microelectronics applications. This integrated unit will incorporate a micropump, temperature sensors, microchannels, and heat exchange devices into a single unit. The first phase of this research project is to develop and test a micropump capable of moving the working fluid within the integrated device. This paper will discuss the design, development, testing, and evaluation of a micropump concept. The micropump which was developed is an electrohydrodynamic (EHD) injection pump. Fabrication of the pump was accomplished using laser micromachining technology, and two initial designs were examined for full fabrication. The first design has two silicon parts stacked vertically on top of each other. Gold is deposited on one side of each stacked plate to serve as electrodes for the electrohydrodynamic pump. A Nd:YAG laser is used to drill an array of circular holes in the {open_quotes}well{close_quotes} region of both silicon parts, leaving an open pathway for fluid movement. Next the silicon parts are aligned and bonded together, thus becoming a EHD pump. Fluid flow has been observed when an electric voltage is applied across the electrodes. The second design has the silicon parts which contain the flow grid oriented {open_quotes}back-to-back{close_quotes} and bonded together. This {open_quotes}back-to-back{close_quotes} design has a shorter grid distance between the anode and cathode plates so that a smaller voltage is required for pumping. Preliminary results from laboratory experiments have demonstrated that this EHD micropump design can achieve a pressure head of about 287 Pa with an applied voltage of 120 V.

  20. Large-Area Laser-Lift-Off Processing in Microelectronics

    NASA Astrophysics Data System (ADS)

    Delmdahl, R.; Pätzel, R.; Brune, J.

    Laser lift-off is an enabling technology for microelectronics growth markets such as light emitting diodes, densely packaged semiconductor devices, and flexible displays. For example, thin film transistor structures fabricated on top of polymer layers spun on glass carriers must be delaminated from rigid substrates to create lightweight and rugged flexible displays on polymers. Low-thermal-budget processes are generically required to protect adjacent functional films. Excimer lasers provide short UV wavelength and short pulse duration required for highly-localized energy coupling. The high output power of excimer lasers enables a large processing footprint and the high-throughput rates needed in mass manufacturing.

  1. Microelectronic components and metallic oxide studies and applications

    NASA Technical Reports Server (NTRS)

    Williams, L., Jr.

    1976-01-01

    The project involved work in two basic areas: (1) Evaluation of commercial screen printable thick film conductors, resistors, thermistors and dielectrics as well as alumina substrates used in hybird microelectronics industries. Results of tests made on materials produced by seven companies are presented. (2) Experimental studies on metallic oxides of copper and vanadium, in an effort to determine their electrochemical properties in crystalline, powder mixtures and as screen printable thick films constituted the second phase of the research effort. Oxide investigations were aimed at finding possible applications of these materials as switching devices memory elements and sensors.

  2. Neuropsychological impairment among former microelectronics workers.

    PubMed

    Bowler, R M; Mergler, D; Huel, G; Harrison, R; Cone, J

    1991-01-01

    Although chemicals posing potential neurotoxic hazards are commonly used in the microelectronics industry, there has been no systematic study of possible chronic nervous system effects in microelectronics workers. The objective of the present study was to assess neuropsychological functions of a group of former microelectronics plant assembly workers and a group of referents, using a matched pair design. During employment, the former microelectronics workers had been exposed to multiple organic solvents, including trichloroethylene, xylene, chlorofluorocarbons and trichloroethane. Referents were recruited from the same geographic region. From a pool of 180 former workers and 157 referents, 67 pairs were matched on the basis of age, sex, ethnicity, educational level, sex and number of children. Comparison of results on the subtests of the California Neuropsychological Screening Battery-Revised (CNS-R) revealed significantly lower performance by the former microelectronics workers on tests of attention/concentration, verbal ability, memory functions, visuospatial functions, visuomotor speed, cognitive flexibility, psychomotor speed, and reaction time (t-test for pairs or Wilcoxon Signed Rank p less than 0.05). No significant differences were observed for performance on tests assessing mental status, visual recall, tactile function and learning. This overall pattern of impairment is consistent with organic solvent-related chronic toxic encephalopathy, and possible early stages of dementia. These findings underline the need for more studies among workers currently or previously employed in microelectronics industries.

  3. Advances in nanoimprint lithography and applications in nanofluidic devices

    NASA Astrophysics Data System (ADS)

    Liang, Xiaogan

    The research work presented in this thesis focuses on three topics: (1) studies of several critical aspects of nanoimprint lithography (NIL), including methods of mold pressing, air bubble defects, and dynamic behaviors of liquid resist flow; (2) applications of NIL to the fabrication of novel nanofluidic devices, which can be used for real-time DNA detection; and (3) additional applications of structured stamps or templates in the direct engineering of functional materials. Based upon these topics, the thesis is divided into three parts. The first part describes recent studies of critical techniques of NIL. First, a novel imprint approach using electrostatic force was developed to pattern spin-on resists in ambient environment. Using this Electrostatic Force-Assisted NIL (EFAN) approach, highly uniform imprints over a 4" diameter wafer area and sub-0.5 mum overlay precision were obtained using very simple equipment. Second, another important method for performing step-and-repeat imprint in the atmosphere, dispensing-based NIL, still suffers from air bubble defects formed by feature pinning and the circling of residual air by the merge of multiple resist droplets. However, it was found that the tiny bubbles can be completely absorbed by the liquid resist. The effects of several key parameters, such as bubble size, imprinting pressure, resist viscosity and solubility, and residual layer thickness, on the air dissolution rate were studied experimentally and theoretically. Their impact to the yield and throughput of NIL was also analyzed. Third, a novel method was developed for filling liquid resists into the air gap between the structured mold and the substrate. The method is assisted by dielectrophoresis, caused by electrohydrodynamic force. The second part describes the applications of NIL to making nanofluidic channel devices and device integration. First, a novel imprint-based method was developed to fabricate precisely positioned single nanofluidic channels of

  4. Advanced semiconductor quantum well devices for infrared applications

    NASA Astrophysics Data System (ADS)

    Kuznetsov, Vladimir V.

    High performance mid-wavelength infrared (MWIR) light emitting diodes (LEDs) are needed for chemical sensing, analysis and medical imaging. Efficient long wavelength infrared (LWIR) photodetectors are highly desirable for remote sensing and space exploration. The goal of this work is to investigate new mid-infrared LEDs and to optimize existing LWIR quantum well infrared photodetectors (QWIPs). Type-II "W" InAs/InGaSb/AlGaAsSb quantum wells were incorporated as optically active layers in MWIR LEDs. Influence of MBE crystal growth conditions on the density of Shockley-Read-Hall centers in the "W" quantum wells was studied and the optimal growth conditions were identified. A qualitative physical model was developed to describe relative importance of the radiative and non-radiative processes for various temperature ranges. MWIR LED structures lattice-matched to InAs and GaSb substrates were grown. Devices on InAs substrates were found to be at least twice as efficient as devices grown on GaSb. LEDs on InAs had 4.5 mum emission wavelength and 26.5 muW/A external efficiency. Possibility to operate GaAs/AIGaAs QWIP under normal-to-surface light incidence was studied. Metal nano-particle surface coating was developed and processes responsible for, light coupling into the QWIP were investigated. QWIP structure itself was optimized to eliminate Si-diffusion-assisted dark current enhancement by employing a new doping profile in the quantum wells. Devices with the new doping profile had an order of magnitude lower dark current and 20% higher photoresponse than commercially available QWIPs.

  5. Integrated microelectronics for smart textiles.

    PubMed

    Lauterbach, Christl; Glaser, Rupert; Savio, Domnic; Schnell, Markus; Weber, Werner

    2005-01-01

    The combination of textile fabrics with microelectronics will lead to completely new applications, thus achieving elements of ambient intelligence. The integration of sensor or actuator networks, using fabrics with conductive fibres as a textile motherboard enable the fabrication of large active areas. In this paper we describe an integration technology for the fabrication of a "smart textile" based on a wired peer-to-peer network of microcontrollers with integrated sensors or actuators. A self-organizing and fault-tolerant architecture is accomplished which detects the physical shape of the network. Routing paths are formed for data transmission, automatically circumventing defective or missing areas. The network architecture allows the smart textiles to be produced by reel-to-reel processes, cut into arbitrary shapes subsequently and implemented in systems at low installation costs. The possible applications are manifold, ranging from alarm systems to intelligent guidance systems, passenger recognition in car seats, air conditioning control in interior lining and smart wallpaper with software-defined light switches.

  6. River Devices to Recover Energy with Advanced Materials (River DREAM)

    SciTech Connect

    McMahon, Daniel P.

    2013-07-03

    The purpose of this project is to develop a generator called a Galloping Hydroelectric Energy Extraction Device (GHEED). It uses a galloping prism to convert water flow into linear motion. This motion is converted into electricity via a dielectric elastomer generator (DEG). The galloping mechanism and the DEG are combined to create a system to effectively generate electricity. This project has three research objectives: 1. Oscillator development and design a. Characterize galloping behavior, evaluate control surface shape change on oscillator performance and demonstrate shape change with water flow change. 2. Dielectric Energy Generator (DEG) characterization and modeling a. Characterize and model the performance of the DEG based on oscillator design 3. Galloping Hydroelectric Energy Extraction Device (GHEED) system modeling and integration a. Create numerical models for construction of a system performance model and define operating capabilities for this approach Accomplishing these three objectives will result in the creation of a model that can be used to fully define the operating parameters and performance capabilities of a generator based on the GHEED design. This information will be used in the next phase of product development, the creation of an integrated laboratory scale generator to confirm model predictions.

  7. Advanced Thermophotovoltaic Devices for Space Nuclear Power Systems

    SciTech Connect

    Wernsman, Bernard; Mahorter, Robert G.; Siergiej, Richard; Link, Samuel D.; Wehrer, Rebecca J.; Belanger, Sean J.; Fourspring, Patrick; Murray, Susan; Newman, Fred; Taylor, Dan; Rahmlow, Tom

    2005-02-06

    Advanced thermophotovoltaic (TPV) modules capable of producing > 0.3 W/cm2 at an efficiency > 22% while operating at a converter radiator and module temperature of 1228 K and 325 K, respectively, have been made. These advanced TPV modules are projected to produce > 0.9 W/cm2 at an efficiency > 24% while operating at a converter radiator and module temperature of 1373 K and 325 K, respectively. Radioisotope and nuclear (fission) powered space systems utilizing these advanced TPV modules have been evaluated. For a 100 We radioisotope TPV system, systems utilizing as low as 2 general purpose heat source (GPHS) units are feasible, where the specific power for the 2 and 3 GPHS unit systems operating in a 200 K environment is as large as {approx} 16 We/kg and {approx} 14 We/kg, respectively. For a 100 kWe nuclear powered (as was entertained for the thermoelectric SP-100 program) TPV system, the minimum system radiator area and mass is {approx} 640 m2 and {approx} 1150 kg, respectively, for a converter radiator, system radiator and environment temperature of 1373 K, 435 K and 200 K, respectively. Also, for a converter radiator temperature of 1373 K, the converter volume and mass remains less than 0.36 m3 and 640 kg, respectively. Thus, the minimum system radiator + converter (reactor and shield not included) specific mass is {approx} 16 kg/kWe for a converter radiator, system radiator and environment temperature of 1373 K, 425 K and 200 K, respectively. Under this operating condition, the reactor thermal rating is {approx} 1110 kWt. Due to the large radiator area, the added complexity and mission risk needs to be weighed against reducing the reactor thermal rating to determine the feasibility of using TPV for space nuclear (fission) power systems.

  8. Advances in graphene-related technologies: synthesis, devices and outlook.

    PubMed

    Frazier, R M; Hough, W L; Chopra, N; Hathcock, K W

    2012-06-01

    Graphene has been the subject of many scientific investigations since exfoliation methods facilitated isolation of the two-dimensional material. During this time, new synthesis methods have been developed which have opened technological opportunities previously hindered by synthetic constraints. An update on the recent advances in graphene-based technologies, including synthesis and applications into electrical, mechanical and thermal uses will be covered. A special focus on the patent space and commercial landscape will be given in an effort to identify current trends and future commercialization of graphene-related technologies.

  9. Advanced Silicon Photonic Device Architectures for Optical Communications: Proposals and Demonstrations

    NASA Astrophysics Data System (ADS)

    Sacher, Wesley David

    Photonic integrated circuits implemented on silicon (Si) hold the potential for densely integrated electro-optic and passive devices manufactured by the high-volume fabrication and sophisticated assembly processes used for complementary metal-oxide-semiconductor (CMOS) electronics. However, high index contrast Si photonics has a number of functional limitations. In this thesis, several devices are proposed, designed, and experimentally demonstrated to overcome challenges in the areas of resonant modulation, waveguide loss, fiber-to-chip coupling, and polarization control. The devices were fabricated using foundry services at IBM and A*STAR Institute of Microelectronics (IME). First, we describe coupling modulated microrings, in which the coupler between a microring and the bus waveguide is modulated. The device circumvents the modulation bandwidth vs. resonator linewidth trade-off of conventional intracavity modulated microrings. We demonstrate a Si coupling modulated microring with a small-signal modulation response free of the parasitic resonator linewidth limitations at frequencies up to about 6x the linewidth. Comparisons of eye diagrams show that coupling modulation achieved data rates > 2x the rate attainable with intracavity modulation. Second, we demonstrate a silicon nitride (Si3N4)-on-Si photonic platform with independent Si3N4 and Si waveguides and taper transitions to couple light between the layers. The platform combines the excellent passive waveguide properties of Si3N4 and the compatibility of Si waveguides with electro-optic devices. Within the platform, we propose and demonstrate dual-level, Si3N 4-on-Si, fiber-to-chip grating couplers that simultaneously have wide bandwidths and high coupling efficiencies. Conventional Si and Si3N 4 grating couplers suffer from a trade-off between bandwidth and coupling efficiency. The dual-level grating coupler achieved a peak coupling efficiency of -1.3 dB and a 1-dB bandwidth of 80 nm, a record for the

  10. Monitoring critical facilities by using advanced RF devices

    SciTech Connect

    Tsai, Hanchung; Liu, Yung Y.; Shuler, James

    2013-07-01

    The ability to monitor critical environment parameters of nuclear plants at all times, particularly during and after a disruptive accident, is vital for the safety of plant personnel, rescue and recovery crews, and the surrounding communities. Conventional hard-wired assets that depend on supplied power may be decimated as a result of such events, as witnessed in the Japanese Fukushima nuclear power plant in March 2011. Self-powered monitoring devices operating on a wireless platform, on the other hand, may survive such calamity and remain functional. The devices would be pre-positioned at strategic locations, particularly where the dangerous build-up of contamination and radiation may preclude subsequent manned entrance and surveillance. Equipped with sensors for β-γ radiation, neutrons, hydrogen gas, temperature, humidity, pressure, and water level, as well as with criticality alarms and imaging equipment for heat, video, and other capabilities, these devices can provide vital surveillance information for assessing the extent of plant damage, mandating responses (e.g., evacuation before impending hydrogen explosion), and enabling overall safe and efficient recovery in a disaster. A radio frequency identification (RFID)-based system - called ARG-US - may be modified and adapted for this task. Developed by Argonne for DOE, ARG-US (meaning 'watchful guardian') has been used successfully to monitor and track sensitive nuclear materials packages at DOE sites. It utilizes sensors in the tags to continuously monitor the state of health of the packaging and promptly disseminates alarms to authorized users when any of the preset sensor thresholds is violated. By adding plant-specific monitoring sensors to the already strong sensor suite and adopting modular hardware, firmware, and software subsystems that are tailored for specific subsystems of a plant, a Remote Area Modular Monitoring (RAMM) system, built on a wireless sensor network (WSN) platform, is being developed

  11. Advanced Epi Tools for Gallium Nitride Light Emitting Diode Devices

    SciTech Connect

    Patibandla, Nag; Agrawal, Vivek

    2012-12-01

    Over the course of this program, Applied Materials, Inc., with generous support from the United States Department of Energy, developed a world-class three chamber III-Nitride epi cluster tool for low-cost, high volume GaN growth for the solid state lighting industry. One of the major achievements of the program was to design, build, and demonstrate the world’s largest wafer capacity HVPE chamber suitable for repeatable high volume III-Nitride template and device manufacturing. Applied Materials’ experience in developing deposition chambers for the silicon chip industry over many decades resulted in many orders of magnitude reductions in the price of transistors. That experience and understanding was used in developing this GaN epi deposition tool. The multi-chamber approach, which continues to be unique in the ability of the each chamber to deposit a section of the full device structure, unlike other cluster tools, allows for extreme flexibility in the manufacturing process. This robust architecture is suitable for not just the LED industry, but GaN power devices as well, both horizontal and vertical designs. The new HVPE technology developed allows GaN to be grown at a rate unheard of with MOCVD, up to 20x the typical MOCVD rates of 3{micro}m per hour, with bulk crystal quality better than the highest-quality commercial GaN films grown by MOCVD at a much cheaper overall cost. This is a unique development as the HVPE process has been known for decades, but never successfully commercially developed for high volume manufacturing. This research shows the potential of the first commercial-grade HVPE chamber, an elusive goal for III-V researchers and those wanting to capitalize on the promise of HVPE. Additionally, in the course of this program, Applied Materials built two MOCVD chambers, in addition to the HVPE chamber, and a robot that moves wafers between them. The MOCVD chambers demonstrated industry-leading wavelength yield for GaN based LED wafers and industry

  12. The Microelectronics Education Programme--Dissemination and Diffusion of Microelectronics Technology in Education.

    ERIC Educational Resources Information Center

    Milne, J. A.; Anderson, J. S. A.

    1984-01-01

    Describes the Microelectronics Education Programme, a development program which embodies the building of a springboard for the dissemination of microelectronic innovations that will benefit education. Springboard activities discussed in detail include information dissemination through regional information centers, inservice teacher training, and…

  13. Integrated Optics And Microelectronics : Toward An Integration On A Single Silicon Chip

    NASA Astrophysics Data System (ADS)

    Valette, S.; Jadot, J. P.; Gidon, P.; Kevorkian, A.

    1988-06-01

    In this paper we present the capabilities of the silicon based integrated optics technology to be associated with microelectronics. Through the first device already achieved, we analyse what kind of poblems remains to solve and in what field of applications this association seems the more attractive.

  14. Micromachined sensor and actuator research at the Microelectronics Development Laboratory

    SciTech Connect

    Smith, J.H.; Barron, C.C.; Fleming, J.G.; Montague, S.; Rodriguez, J.L.; Smith, B.K.; Sniegowski, J.J.

    1994-12-31

    An overview of the major sensor and actuator projects using the micromachining capabilities of the Microelectronics Development Laboratory at Sandia National Laboratories is presented. Development efforts are underway for a variety of micromechanical devices and control electronics for those devices. Surface micromachining is the predominant technology under development. Pressure sensors based on silicon nitride diaphragms have been developed. Hot polysilicon filaments for calorimetric gas sensing have been developed. Accelerometers based upon high-aspect ratio surface micromachining are under development. Actuation mechanisms employing either electrostatic or steam power are being combined with a three-level active (plus an additional passive level) polysilicon surface micromachining process to couple these actuators to external devices. Results of efforts toward integration of micromechanics with the driving electronics for actuators or the amplification/signal processing electronics for sensors is also described. This effort includes a tungsten metallization process to allow the CMOS electronics to withstand high-temperature micromechanical processing.

  15. 9 CFR 381.131 - Preparation of labeling or other devices bearing official inspection marks without advance...

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... devices bearing official inspection marks without advance approval prohibited; exceptions. 381.131 Section... Preparation of labeling or other devices bearing official inspection marks without advance approval prohibited... otherwise make any marking device containing any official mark or simulation thereof, or any label...

  16. 9 CFR 381.131 - Preparation of labeling or other devices bearing official inspection marks without advance...

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... devices bearing official inspection marks without advance approval prohibited; exceptions. 381.131 Section... Preparation of labeling or other devices bearing official inspection marks without advance approval prohibited... otherwise make any marking device containing any official mark or simulation thereof, or any label...

  17. Case studies in advanced monitoring with the Chronicle device.

    PubMed

    Bourge, Robert C

    2006-01-01

    Three case studies illustrate the utility of advanced implantable hemodynamic monitors (IHMs). The cases include a 70-year-old with ischemic cardiomyopathy, chronic kidney disease, and recurrent volume overload; a 53-year-old with ischemic heart disease, mild effort-related angina, and New York Heart Association class III chronic heart failure; and a 21-year-old with severe dilated cardiomyopathy, all 3 patients having an IHM. The outcomes in these cases illustrate the capability of the IHM system for monitoring and detecting early changes in hemodynamic data and the use of these data to adjust medical therapies and reduce morbidity and risk of hospitalization. When pathologic hemodynamic changes are observed, this alerts the cardiologist to search for underlying causes, even when a patient on initial questioning denies any change in compliance or symptoms.

  18. Advance in novel boron nitride nanosheets to nanoelectronic device applications.

    PubMed

    Sajjad, Muhammad; Morell, Gerardo; Feng, Peter

    2013-06-12

    We report low-temperature synthesis of large-scale boron nitride nanosheets (BNNSs) and their applications for high-performance Schottky diode and gas sensor. Ten minutes of synthesis with a short-pulse-laser-produced plasma deposition technique yields a large amount of highly flat, transparent BNNSs. A basic reason for using short-pulse plasma beams is to avoid nanosheet thermal ablation or have low heat generated. Consequently, it greatly reduces the stress and yield large, flat BNNSs. The average size of obtained BNNS is around 10 μm and thickness is around 1.7 nm. Carbon element has been used for doping BNNSs and achieving BNNSs-based Schottky diode and gas sensing device. Typical current versus voltage characteristics of diode are examined. The breakdown reverse voltage is around -70 V. This probably indicates that the breakdown electric field of BNNSs-based diode is up to 1 × 10(8) V/cm. Sensing behavior of BNNSs-based gas sensor toward methane diluted with dry air is also characterized. The response time and recovery time are around 3 and 5 s at the operating temperature of 150 °C. Relatively, the sensor has poor sensitivity to oxygen gas.

  19. Advanced numerical methods and software approaches for semiconductor device simulation

    SciTech Connect

    CAREY,GRAHAM F.; PARDHANANI,A.L.; BOVA,STEVEN W.

    2000-03-23

    In this article the authors concisely present several modern strategies that are applicable to drift-dominated carrier transport in higher-order deterministic models such as the drift-diffusion, hydrodynamic, and quantum hydrodynamic systems. The approaches include extensions of upwind and artificial dissipation schemes, generalization of the traditional Scharfetter-Gummel approach, Petrov-Galerkin and streamline-upwind Petrov Galerkin (SUPG), entropy variables, transformations, least-squares mixed methods and other stabilized Galerkin schemes such as Galerkin least squares and discontinuous Galerkin schemes. The treatment is representative rather than an exhaustive review and several schemes are mentioned only briefly with appropriate reference to the literature. Some of the methods have been applied to the semiconductor device problem while others are still in the early stages of development for this class of applications. They have included numerical examples from the recent research tests with some of the methods. A second aspect of the work deals with algorithms that employ unstructured grids in conjunction with adaptive refinement strategies. The full benefits of such approaches have not yet been developed in this application area and they emphasize the need for further work on analysis, data structures and software to support adaptivity. Finally, they briefly consider some aspects of software frameworks. These include dial-an-operator approaches such as that used in the industrial simulator PROPHET, and object-oriented software support such as those in the SANDIA National Laboratory framework SIERRA.

  20. Advanced Numerical Methods and Software Approaches for Semiconductor Device Simulation

    DOE PAGES

    Carey, Graham F.; Pardhanani, A. L.; Bova, S. W.

    2000-01-01

    In this article we concisely present several modern strategies that are applicable to driftdominated carrier transport in higher-order deterministic models such as the driftdiffusion, hydrodynamic, and quantum hydrodynamic systems. The approaches include extensions of “upwind” and artificial dissipation schemes, generalization of the traditional Scharfetter – Gummel approach, Petrov – Galerkin and streamline-upwind Petrov Galerkin (SUPG), “entropy” variables, transformations, least-squares mixed methods and other stabilized Galerkin schemes such as Galerkin least squares and discontinuous Galerkin schemes. The treatment is representative rather than an exhaustive review and several schemes are mentioned only briefly with appropriate reference to the literature. Some of themore » methods have been applied to the semiconductor device problem while others are still in the early stages of development for this class of applications. We have included numerical examples from our recent research tests with some of the methods. A second aspect of the work deals with algorithms that employ unstructured grids in conjunction with adaptive refinement strategies. The full benefits of such approaches have not yet been developed in this application area and we emphasize the need for further work on analysis, data structures and software to support adaptivity. Finally, we briefly consider some aspects of software frameworks. These include dial-an-operator approaches such as that used in the industrial simulator PROPHET, and object-oriented software support such as those in the SANDIA National Laboratory framework SIERRA.« less

  1. Advanced Controls for the Multi-pod Centipod WEC device

    SciTech Connect

    McCall, Alan; Fleming, Alex

    2016-02-15

    Dehlsen Associates, LLC (DA) has developed a Wave Energy Converter (WEC), Centipod, which is a multiple point absorber, extracting wave energy primarily in the heave direction through a plurality of point absorber floats sharing a common stable reference structure. The objective of this project was to develop advanced control algorithms that will be used to reduce Levelized Cost of Energy (LCOE). This project investigated the use of Model Predictive Control (MPC) to improve the power capture of the WEC. The MPC controller developed in this work is a state-space, “look ahead” controller approach using knowledge of past and current states to predict future states to take action with the PTO to maximize power capture while still respecting system constraints. In order to maximize power, which is the product of force and velocity, the controller must aim to create phase alignment between excitation force and velocity. This project showed a 161% improvement in the Annual Energy Production (AEP) for the Centipod WEC when utilizing MPC, compared to a baseline, fixed passive damping control strategy. This improvement in AEP was shown to provide a substantial benefit to the WEC’s overall Cost of Energy, reducing LCOE by 50% from baseline. The results of this work proved great potential for the adoption of Model Predictive Controls in Wave Energy Converters.

  2. Advanced Simulation Technology to Design Etching Process on CMOS Devices

    NASA Astrophysics Data System (ADS)

    Kuboi, Nobuyuki

    2015-09-01

    Prediction and control of plasma-induced damage is needed to mass-produce high performance CMOS devices. In particular, side-wall (SW) etching with low damage is a key process for the next generation of MOSFETs and FinFETs. To predict and control the damage, we have developed a SiN etching simulation technique for CHxFy/Ar/O2 plasma processes using a three-dimensional (3D) voxel model. This model includes new concepts for the gas transportation in the pattern, detailed surface reactions on the SiN reactive layer divided into several thin slabs and C-F polymer layer dependent on the H/N ratio, and use of ``smart voxels''. We successfully predicted the etching properties such as the etch rate, polymer layer thickness, and selectivity for Si, SiO2, and SiN films along with process variations and demonstrated the 3D damage distribution time-dependently during SW etching on MOSFETs and FinFETs. We confirmed that a large amount of Si damage was caused in the source/drain region with the passage of time in spite of the existing SiO2 layer of 15 nm in the over etch step and the Si fin having been directly damaged by a large amount of high energy H during the removal step of the parasitic fin spacer leading to Si fin damage to a depth of 14 to 18 nm. By analyzing the results of these simulations and our previous simulations, we found that it is important to carefully control the dose of high energy H, incident energy of H, polymer layer thickness, and over-etch time considering the effects of the pattern structure, chamber-wall condition, and wafer open area ratio. In collaboration with Masanaga Fukasawa and Tetsuya Tatsumi, Sony Corporation. We thank Mr. T. Shigetoshi and Mr. T. Kinoshita of Sony Corporation for their assistance with the experiments.

  3. Verification, Validation and Credibility Assessment of a Computational Model of the Advanced Resistive Exercise Device (ARED)

    NASA Technical Reports Server (NTRS)

    Werner, C. R.; Humphreys, B. T.; Mulugeta, L.

    2014-01-01

    The Advanced Resistive Exercise Device (ARED) is the resistive exercise device used by astronauts on the International Space Station (ISS) to mitigate bone loss and muscle atrophy due to extended exposure to microgravity (micro g). The Digital Astronaut Project (DAP) has developed a multi-body dynamics model of biomechanics models for use in spaceflight exercise physiology research and operations. In an effort to advance model maturity and credibility of the ARED model, the DAP performed verification, validation and credibility (VV and C) assessment of the analyses of the model in accordance to NASA-STD-7009 'Standards for Models and Simulations'.

  4. Microelectronics and nanotechnology, and the fractal-like structure of information, knowledge, and science

    NASA Astrophysics Data System (ADS)

    Nutu, Catalin Silviu; Axinte, Tiberiu

    2016-12-01

    The article is centralizing and is concentrating the information from a considerable amount of papers related to the field of microelectronics and nanotechnology and also provides an approach to science and to the future evolution of science, based on the theory of the fractals. The new science of microelectronics and nanotechnology is one of the best examples of how the science of future will look like, namely at the confluence of increasingly more other sciences, where increasingly more sciences are to be added in the structure of the new science and the role of the multidisciplinary and interdisciplinary is becoming more and more important. Although not giving explicit details (e.g. specific formulas) the theory of fractals is used in the paper to explain the way of generation of new science for the specific case of microelectronics and nanotechnology, but is also used in the paper to outline a different way to approach new science and eventually to approach new sciences to come. There are mainly two motivations for the present article, namely: on the one hand, the position of the microelectronics and nanotechnologies in the fractal-like structure of science, and, on the other hand, that much of the communication, information, knowledge and science transfer, dissemination and advancement in sciences are taking place using the new technologies related to microelectronics and nanotechnologies.

  5. Co-Extrusion: Advanced Manufacturing for Energy Devices

    SciTech Connect

    Cobb, Corie Lynn

    2016-11-18

    The development of mass markets for large-format batteries, including electric vehicles (EVs) and grid support, depends on both cost reductions and performance enhancements to improve their economic viability. Palo Alto Research Center (PARC) has developed a multi-material, advanced manufacturing process called co-extrusion (CoEx) to remove multiple steps in a conventional battery coating process with the potential to simultaneously increase battery energy and power density. CoEx can revolutionize battery manufacturing across most chemistries, significantly lowering end-product cost and shifting the underlying economics to make EVs and other battery applications a reality. PARC’s scale-up of CoEx for electric vehicle (EV) batteries builds on a solid base of experience in applying CoEx to solar cell manufacturing, deposition of viscous ceramic pastes, and Li-ion battery chemistries. In the solar application, CoEx has been deployed commercially at production scale where multi-channel CoEx printheads are used to print viscous silver gridline pastes at full production speeds (>40 ft/min). This operational scale-up provided invaluable experience with the nuances of speed, yield, and maintenance inherent in taking a new technology to the factory floor. PARC has leveraged this experience, adapting the CoEx process for Lithium-ion (Li-ion) battery manufacturing. To date, PARC has worked with Li-ion battery materials and structured cathodes with high-density Li-ion regions and low-density conduction regions, documenting both energy and power performance. Modeling results for a CoEx cathode show a path towards a 10-20% improvement in capacity for an EV pouch cell. Experimentally, we have realized a co-extruded battery structure with a Lithium Nickel Manganese Cobalt (NMC) cathode at print speeds equivalent to conventional roll coating processes. The heterogeneous CoEx cathode enables improved capacity in thick electrodes at higher C-rates. The proof-of-principle coin cells

  6. Advanced upper limb prosthetic devices: implications for upper limb prosthetic rehabilitation.

    PubMed

    Resnik, Linda; Meucci, Marissa R; Lieberman-Klinger, Shana; Fantini, Christopher; Kelty, Debra L; Disla, Roxanne; Sasson, Nicole

    2012-04-01

    The number of catastrophic injuries caused by improvised explosive devices in the Afghanistan and Iraq Wars has increased public, legislative, and research attention to upper limb amputation. The Department of Veterans Affairs (VA) has partnered with the Defense Advanced Research Projects Agency and DEKA Integrated Solutions to optimize the function of an advanced prosthetic arm system that will enable greater independence and function. In this special communication, we examine current practices in prosthetic rehabilitation including trends in adoption and use of prosthetic devices, financial considerations, and the role of rehabilitation team members in light of our experiences with a prototype advanced upper limb prosthesis during a VA study to optimize the device. We discuss key challenges in the adoption of advanced prosthetic technology and make recommendations for service provision and use of advanced upper limb prosthetics. Rates of prosthetic rejection are high among upper limb amputees. However, these rates may be reduced with sufficient training by a highly specialized, multidisciplinary team of clinicians, and a focus on patient education and empowerment throughout the rehabilitation process. There are significant challenges emerging that are unique to implementing the use of advanced upper limb prosthetic technology, and a lack of evidence to establish clinical guidelines regarding prosthetic prescription and treatment. Finally, we make recommendations for future research to aid in the identification of best practices and development of policy decisions regarding insurance coverage of prosthetic rehabilitation.

  7. Miniature environmental chambers for temperature humidity bias testing of microelectronics.

    PubMed

    Hook, Michael David; Mayer, Michael

    2017-03-01

    Environmental chambers are commonly used for reliability testing of microelectronics and other products and materials. These chambers are large, expensive, and limit electrical connectivity to devices under test. In this paper, we present a collection of ten small, low-cost environmental chambers, with humidity control based on mixtures of water and glycerol placed inside the chambers. We demonstrate relative humidities from 44% to 90%, at temperatures from 30 to 85 °C, enabling industry-standard testing at 85% humidity and 85 °C. The division of samples between ten separate chambers allows different conditions to be applied to each sample, in order to quickly characterize the effects of the environment on device reliability, enabling extrapolation to estimate lifetimes in working conditions.

  8. Aircrew Training Devices: Utility and Utilization of Advanced Instructional Features (Phase IV--Summary Report).

    ERIC Educational Resources Information Center

    Polzella, Donald J.; And Others

    Modern aircrew training devices (ATDs) are equipped with sophisticated hardware and software capabilities, known as advanced instructional features (AIFs), that permit a simulator instructor to prepare briefings, manage training, vary task difficulty/fidelity, monitor performance, and provide feedback for flight simulation training missions. The…

  9. Non-CPAP therapies in obstructive sleep apnoea: mandibular advancement device therapy.

    PubMed

    Marklund, Marie; Verbraecken, Johan; Randerath, Winfried

    2012-05-01

    Mandibular advancement devices (MADs) represent the main non-continuous positive airway pressure (non-CPAP) therapy for patients with obstructive sleep apnoea (OSA). The aim of the European Respiratory Society Task Force was to review the evidence in favour of MAD therapy. Effects of tongue-retaining devices are not included in this report. Custom-made MADs reduce apnoea/hypopnoea index (AHI) and daytime sleepiness compared with placebo devices. CPAP more effectively diminishes AHI, while increasing data suggest fairly similar outcomes in relation to symptoms and cardiovascular health from these treatments. Patients often prefer MADs to CPAP. Milder cases and patients with a proven increase in upper airway size as a result of mandibular advancement are most likely to experience treatment success with MADs. A custom-made device titrated from an initial 50% of maximum mandibular advancement has been recommended. More research is needed to define the patients who will benefit from MAD treatment compared with CPAP, in terms of the effects on sleep-disordered breathing and on other diseases related to OSA. In conclusion, MADs are recommended for patients with mild to moderate OSA (Recommendation Level A) and for those who do not tolerate CPAP. The treatment must be followed up and the device adjusted or exchanged in relation to the outcome.

  10. Recent Advances in Organic Photovoltaics: Device Structure and Optical Engineering Optimization on the Nanoscale.

    PubMed

    Luo, Guoping; Ren, Xingang; Zhang, Su; Wu, Hongbin; Choy, Wallace C H; He, Zhicai; Cao, Yong

    2016-03-23

    Organic photovoltaic (OPV) devices, which can directly convert absorbed sunlight to electricity, are stacked thin films of tens to hundreds of nanometers. They have emerged as a promising candidate for affordable, clean, and renewable energy. In the past few years, a rapid increase has been seen in the power conversion efficiency of OPV devices toward 10% and above, through comprehensive optimizations via novel photoactive donor and acceptor materials, control of thin-film morphology on the nanoscale, device structure developments, and interfacial and optical engineering. The intrinsic problems of short exciton diffusion length and low carrier mobility in organic semiconductors creates a challenge for OPV designs for achieving optically thick and electrically thin device structures to achieve sufficient light absorption and efficient electron/hole extraction. Recent advances in the field of OPV devices are reviewed, with a focus on the progress in device architecture and optical engineering approaches that lead to improved electrical and optical characteristics in OPV devices. Successful strategies are highlighted for light wave distribution, modulation, and absorption promotion inside the active layer of OPV devices by incorporating periodic nanopatterns/nanostructures or incorporating metallic nanomaterials and nanostructures.

  11. Military applications for heterostructure microelectronics technology

    NASA Astrophysics Data System (ADS)

    Greiling, Paul; Kirkpatrick, Conilee; Valentine, Gary

    1995-09-01

    Military systems, whether radar, communications, electronic warfare (EW) or smart munitions, require superior device and IC performance. The performance advantages of heterostructure devices over standard Si CMOS, Si bipolar transistors or GaAs MESFETs has motivated major aerospace firms in the United States to develop Si, GaAs and InP-based heterojunction bipolar (HBT) and high electron mobility transistor (HEMT) technologies. In response to advanced system performance requirements, technology efforts are being pushed toward devices which can yield {T}/{R} modules with octave bandwidths, noise figures under 3 dB, output power of 20 W and power greater than 30%. Device technology development for satellite communications is being driven in part by the need for ultra low noise high output power with high power added efficiency with high MMTF. For these systems as well as EW applications, designers want to digitize the signal as close to the front end as possible. This is driving the development of a 100 GHz IC technology for A/D converters, synthesizers, MUX/DEMUXs, DDSs. and PRNs. Requirements for A/D converters with 16 bits @ 100-200 MHz up to 8-10 bits @ 10 GHz are appearing for advanced radars and EW systems. The military system requirements continue to drive the development of the newer, better and higher performance heterostructure device technologies.

  12. CEMA cooperation in microelectronics research, production

    NASA Astrophysics Data System (ADS)

    1984-03-01

    The assignments resulting from an agreement concerning multilateral specialization and cooperation among European socialist countries in the development and production of microelectronic components for computer technology are enumerated. Several areas which impact directly on the manufacture of large scale and very large scale integrated components are identified.

  13. Problems in CEMA microelectronic cooperation noted

    NASA Astrophysics Data System (ADS)

    Grzybowski, J.; Kusinski, J.

    1983-10-01

    The development and market trends of products, which use large scale integrated circuits are discussed. Products such as pocket calculators, electronic wrist watches, telephones, and automobiles are used to illustrate the economic results of market saturation with specialized integrated circuits. The status of microelectronics in socialist countries in Europe is addressed.

  14. Teaching and Learning in a Microelectronic Age.

    ERIC Educational Resources Information Center

    Shane, Harold G.

    General background information on microtechnologies with implications for educators provides an introduction to this review of past and current developments in microelectronics and specific ways in which the microchip is permeating society, creating problems and opportunities both in the workplace and the home. Topics discussed in the first of two…

  15. Uses of ceramics in microelectronics: A survey

    NASA Technical Reports Server (NTRS)

    Bratschun, W. R.; Mountvala, A. J.; Pincus, A. G.

    1971-01-01

    The properties and behavior of ceramic materials used in components for electronic circuitry are examined to appraise the present and future directions for microelectronics, and to suggest further product development, and how innovations may be useful in other technologies. Ceramic and glass insulators, resistors, capacitors, and the use of ceramics and glasses in microcircuitry are discussed along with technology transfer to nonaerospace uses.

  16. Visual dysfunction among former microelectronics assembly workers.

    PubMed

    Mergler, D; Huel, G; Bowler, R; Frenette, B; Cone, J

    1991-01-01

    Although known neurotoxins with potential ophthalmotoxic properties are commonly used in microelectronics assembly, there has been no systematic study of visual disturbances among past or present workers in this industry. The objective of the present study was to compare visual functions, using a matched-pair design, between former workers from a microelectronics plant and a local reference population. From an initial population of 180 former workers and 157 potential referents, 54 pairs were matched for age (+/- 3 y), education (+/- 2 y), sex, ethnic origin, and number of children. Near and far visual acuity, chromatic discrimination, and near contrast sensitivity were assessed monocularly. Paired comparisons (Signed-rank Wilcoxon test) revealed that the former microelectronics workers had significantly lower contrast sensitivity, particularly in the intermediate frequencies, independently of near visual acuity loss. There were no differences for far visual acuity in both eyes. Even though near visual acuity and color vision were compromised among the former workers, the differences were only significant for one eye, as was the prevalence of acquired dyschromatopsia (chi-square for matched pairs, p less than .001). These findings suggest a pattern of contrast sensitivity deficits consistent with impairment to foveal and/or neuro-optic pathways among these former microelectronics workers. Exposure to ophthalmotoxic chemicals is proposed as the most probable risk factor.

  17. Education, Computers and Micro-Electronics.

    ERIC Educational Resources Information Center

    Lewis, R.

    1981-01-01

    Traces general educational changes over the last 20 years, summarizes past and present uses of computers in education, and identifies the impact microelectronics will have on present and future education. Discusses vocational training, availability of inexpensive educational resources, teaching methods, and teacher education. (DC)

  18. Leveraging Microelectronics Research to Enable A Smarter Planet

    NASA Astrophysics Data System (ADS)

    Dalton, Timothy J.

    2009-10-01

    Over the course of the last fifty years, the microelectronics industry has made tremendous strides in the development and manufacturing of ever more complex integrated circuits (IC). These circuits have typically been applied to the information technology (IT) industry and have driven improvements in the computational power per dollar of many orders of magnitude. Part of the ``toolbox'' of skills acquired to produce integrated circuits is the ability to form desired patterns at ever decreasing sizes. The minimum controllable feature size has been reduced by six orders of magnitude (from millimeters to nanometers) during the last fifty years. With feature sizes rapidly approaching 10nm, the conventional silicon IC industry is nearing a threshold with the end of conventional silicon scaling approaching. Research today focuses on new device structure to replace the CMOS FET as the engine of the IT industry. A very exciting research area today is the concept of taking the skill-set acquired from IC research, development, and manufacturing, and applying those skills into new domains where they can enable a ``smarter planet''. These new domains include areas such as energy, water, and health care / life sciences. All of these are outside of the traditional IT focus for microelectronics research, yet, the new ``smarter planet'' domains may form the basis for future industries. This presentation will look at the evolution of IBM's research model and focus, shifting from one solely focused on IT, to one that compliments IT research with Smarter Planet domains.

  19. Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan

    NASA Astrophysics Data System (ADS)

    Washio, Kunihiko; Kouta, Hikaru

    2002-06-01

    This paper presents an overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan. Various kinds of lasers and material processing technologies have been developed and applied for manufacturing electronic and photonic devices to meet the strong demands for high-performance, lightweight, low energy-consumption mobile digital consumer electronics, broadband optical fiber communications, low-emission and fuel-efficient, easy-to-steer smart cars, etc. This paper emphasizes solid-state lasers as convenient and versatile light sources for packaging advanced compact devices with sensitive passive or active components having small feature sizes. Some of the representative material processing applications using solid-state lasers for electronic and photonic devices are, opaque and clear defects repairing of LCDs, trimming of functional modules, fine-tuning of optical characteristics of photonic devices, forming of various micro-vias for high-density interconnection circuits, laser patterning of amorphous solar-cells, and high-precision laser welding of electronic components such as optical modules, miniature relays and lithium ion batteries. The recent progress in high-power ultra-short pulse solid-state lasers seems to be rapidly increasing their processing capabilities such as for fine adjustment of optical filters, etc.

  20. Breakthrough: micro-electronic photovoltaics

    ScienceCinema

    Okandan, Murat; Gupta, Vipin

    2016-07-12

    Sandia developed tiny glitter-sized photovoltaic (PV) cells that could revolutionize solar energy collection. The crystalline silicon micro-PV cells will be cheaper and have greater efficiencies than current PV collectors. Micro-PV cells require relatively little material to form well-controlled, highly efficient devices. Cell fabrication uses common microelectric and micro-electromechanical systems (MEMS) techniques.

  1. AN ADVANCED CALIBRATION PROCEDURE FOR COMPLEX IMPEDANCE SPECTRUM MEASUREMENTS OF ADVANCED ENERGY STORAGE DEVICES

    SciTech Connect

    William H. Morrison; Jon P. Christophersen; Patrick Bald; John L. Morrison

    2012-06-01

    With the increasing demand for electric and hybrid electric vehicles and the explosion in popularity of mobile and portable electronic devices such as laptops, cell phones, e-readers, tablet computers and the like, reliance on portable energy storage devices such as batteries has likewise increased. The concern for the availability of critical systems in turn drives the availability of battery systems and thus the need for accurate battery health monitoring has become paramount. Over the past decade the Idaho National Laboratory (INL), Montana Tech of the University of Montana (Tech), and Qualtech Systems, Inc. (QSI) have been developing the Smart Battery Status Monitor (SBSM), an integrated battery management system designed to monitor battery health, performance and degradation and use this knowledge for effective battery management and increased battery life. Key to the success of the SBSM is an in-situ impedance measurement system called the Impedance Measurement Box (IMB). One of the challenges encountered has been development of an accurate, simple, robust calibration process. This paper discusses the successful realization of this process.

  2. Recent advances in medical device triage technologies for chemical, biological, radiological, and nuclear events.

    PubMed

    Lansdowne, Krystal; Scully, Christopher G; Galeotti, Loriano; Schwartz, Suzanne; Marcozzi, David; Strauss, David G

    2015-06-01

    In 2010, the US Food and Drug Administration (Silver Spring, Maryland USA) created the Medical Countermeasures Initiative with the mission of development and promoting medical countermeasures that would be needed to protect the nation from identified, high-priority chemical, biological, radiological, or nuclear (CBRN) threats and emerging infectious diseases. The aim of this review was to promote regulatory science research of medical devices and to analyze how the devices can be employed in different CBRN scenarios. Triage in CBRN scenarios presents unique challenges for first responders because the effects of CBRN agents and the clinical presentations of casualties at each triage stage can vary. The uniqueness of a CBRN event can render standard patient monitoring medical device and conventional triage algorithms ineffective. Despite the challenges, there have been recent advances in CBRN triage technology that include: novel technologies; mobile medical applications ("medical apps") for CBRN disasters; electronic triage tags, such as eTriage; diagnostic field devices, such as the Joint Biological Agent Identification System; and decision support systems, such as the Chemical Hazards Emergency Medical Management Intelligent Syndromes Tool (CHEMM-IST). Further research and medical device validation can help to advance prehospital triage technology for CBRN events.

  3. Genetically Engineered Microelectronic Infrared Filters

    NASA Technical Reports Server (NTRS)

    Cwik, Tom; Klimeck, Gerhard

    1998-01-01

    A genetic algorithm is used for design of infrared filters and in the understanding of the material structure of a resonant tunneling diode. These two components are examples of microdevices and nanodevices that can be numerically simulated using fundamental mathematical and physical models. Because the number of parameters that can be used in the design of one of these devices is large, and because experimental exploration of the design space is unfeasible, reliable software models integrated with global optimization methods are examined The genetic algorithm and engineering design codes have been implemented on massively parallel computers to exploit their high performance. Design results are presented for the infrared filter showing new and optimized device design. Results for nanodevices are presented in a companion paper at this workshop.

  4. Advanced Technology for Improved Quantum Device Properties Using Highly Strained Materials

    DTIC Science & Technology

    1991-03-01

    Improved Quantum PE 61153N Device Properties Using Highly Strained Materials PE 1401N~R&T 414s 001-02 IN G. AUTHOR(S) (William J. Schaff , S.D. Offsey and...DECEMBER 15, 1989 CORNELL UNIVERSITY.......................... ITHACA, NY 14853-5401 PREPARED BY: WJ. Schaff ........ S.D. Offsey I - L.F. Eastman D ’’. i...Mandeville, R. Saito, P.J. Tasker, W.J. Schaff and L.F. Eastman, 12th IEEE/Comell Conference on’Advanced Concepts in High Speed Semiconductor Devices

  5. Development of advanced electron holographic techniques and application to industrial materials and devices.

    PubMed

    Yamamoto, Kazuo; Hirayama, Tsukasa; Tanji, Takayoshi

    2013-06-01

    The development of a transmission electron microscope equipped with a field emission gun paved the way for electron holography to be put to practical use in various fields. In this paper, we review three advanced electron holography techniques: on-line real-time electron holography, three-dimensional (3D) tomographic holography and phase-shifting electron holography, which are becoming important techniques for materials science and device engineering. We also describe some applications of electron holography to the analysis of industrial materials and devices: GaAs compound semiconductors, solid oxide fuel cells and all-solid-state lithium ion batteries.

  6. Porous graphene materials for advanced electrochemical energy storage and conversion devices.

    PubMed

    Han, Sheng; Wu, Dongqing; Li, Shuang; Zhang, Fan; Feng, Xinliang

    2014-02-12

    Combining the advantages from both porous materials and graphene, porous graphene materials have attracted vast interests due to their large surface areas, unique porous structures, diversified compositions and excellent electronic conductivity. These unordinary features enable porous graphene materials to serve as key components in high-performance electrochemical energy storage and conversion devices such as lithium ion batteries, supercapacitors, and fuel cells. This progress report summarizes the typical fabrication methods for porous graphene materials with micro-, meso-, and macro-porous structures. The structure-property relationships of these materials and their application in advanced electrochemical devices are also discussed.

  7. Micropatterning proteins and synthetic peptides on solid supports: a novel application for microelectronics fabrication technology.

    PubMed

    Britland, S; Perez-Arnaud, E; Clark, P; McGinn, B; Connolly, P; Moores, G

    1992-01-01

    In this paper, we describe a method for immobilizing proteins and synthesizing peptides in micrometer-dimension patterns on solid supports. Microelectronics fabrication technology was adapted and used to lithographically direct the location of immobilization of proteins on appropriately derivatized surfaces. As examples, we micropatterned the protein bovine serum albumin (BSA) and the enzyme horseradish peroxidase (HRP). The catalytic activity of HRP was shown to be retained after being cross-linked to the support. When coupled with solid-phase peptide synthesis, the technique allowed synthetic peptides to be constructed in patterns again having micrometer dimensions. Synthetic polypeptides, polylysine, were constructed in patterns with dimensions that approached the practical limit of resolution for optical lithography at 1-2 microns. The patterns of immobilized molecules and synthetic peptides were visualized using histochemical methods together with light and fluorescence microscopy. The protein and peptide patterning technique described here is an advance in the field of bioelectronics. In particular, it should now be possible to devise novel methods for interfacing with biological systems and constructing new devices for incorporation into miniaturized biosensors.

  8. Effect of Mandibular Advancement Device Therapy on the Signs and Symptoms of Temporomandibular Disorders

    PubMed Central

    Raunio, Antti; Sipilä, Kirsi; Raustia, Aune

    2012-01-01

    ABSTRACT Objectives Mandibular advancement device therapy is effectively used in the treatment of obstructive sleep apnea, but also several side effects in the masticatory system have been reported. The aim of this study was to evaluate the subjective symptoms and clinical signs of temporomandibular disorders connected to mandibular advancement device therapy. Material and Methods The material consisted of 15 patients (9 men and 6 women, mean age 51.1 years, range 21 to 70 years) diagnosed with obstructive sleep apnea (OSA). Subjective symptoms and clinical temporomandibular disorders (TMD) signs were recorded at the beginning of the treatment (baseline) and at 1-month, 3-month, 6-month and 24-month follow-ups. The degree of TMD was assessed using the anamnestic (Ai) and the clinical dysfunction index (Di) of Helkimo. For assessing the effect of TMD the patients were divided in discontinuing and continuing groups. Results According to Ai and Di, the severity of TMD remained unchanged during the follow-up in most of the patients. Temporomandibular joint (TMJ) crepitation was found more frequently in discontinuing patients at all follow-ups. The difference was statistically significant (P < 0.05) at the six-month follow-up. Masticatory muscle pain during palpation was a frequent clinical sign at the baseline and during the follow-up period but the difference between discontinuing and continuing patients was not significant. Conclusions It seems that signs and symptoms of temporomandibular disorders do not necessarily increase during long-term mandibular advancement device therapy. However, it seems that patients with clinically assessed temporomandibular joint crepitation may discontinue their mandibular advancement device therapy due to temporomandibular disorders. PMID:24422023

  9. Aircrew Training Devices: Utility and Utilization of Advanced Instructional Features. Phase III. Electronic Warfare Trainers.

    DTIC Science & Technology

    1986-04-01

    Devices: Utility and Utilization of Advanced Instructional Features (Phase III- Electronic Warfare Trainers) 12 PERSONAL AUTHOR(S) Polzella . Donald J...Features, addressed a portion of this subthrust. Dr. Wayne Waag (AFHRL/OTU) was the Contract Monitor and Dr. Donald J. Polzella and Dr. David C. Hubbard...training is practicable (see Polzella , 1983, p.8). However, instructional features are expensive to implement, especially those features that require the

  10. [Application of microelectronics CAD tools to synthetic biology].

    PubMed

    Madec, Morgan; Haiech, Jacques; Rosati, Élise; Rezgui, Abir; Gendrault, Yves; Lallement, Christophe

    2017-02-01

    Synthetic biology is an emerging science that aims to create new biological functions that do not exist in nature, based on the knowledge acquired in life science over the last century. Since the beginning of this century, several projects in synthetic biology have emerged. The complexity of the developed artificial bio-functions is relatively low so that empirical design methods could be used for the design process. Nevertheless, with the increasing complexity of biological circuits, this is no longer the case and a large number of computer aided design softwares have been developed in the past few years. These tools include languages for the behavioral description and the mathematical modelling of biological systems, simulators at different levels of abstraction, libraries of biological devices and circuit design automation algorithms. All of these tools already exist in other fields of engineering sciences, particularly in microelectronics. This is the approach that is put forward in this paper.

  11. Micro-Electronic Nose System

    NASA Astrophysics Data System (ADS)

    Zee, Frank C.

    2011-12-01

    The ability to "smell" various gas vapors and complex odors is important for many applications such as environmental monitoring for detecting toxic gases as well as quality control in the processing of food, cosmetics, and other chemical products for commercial industries. Mimicking the architecture of the biological nose, a miniature electronic nose system was designed and developed consisting of an array of sensor devices, signal-processing circuits, and software pattern-recognition algorithms. The array of sensors used polymer/carbon-black composite thin-films, which would swell or expand reversibly and reproducibly and cause a resistance change upon exposure to a wide variety of gases. Two types of sensor devices were fabricated using silicon micromachining techniques to form "wells" that confined the polymer/carbon-black to a small and specific area. The first type of sensor device formed the "well" by etching into the silicon substrate using bulk micromachining. The second type built a high-aspect-ratio "well" on the surface of a silicon wafer using SU-8 photoresist. Two sizes of "wells" were fabricated: 500 x 600 mum² and 250 x 250 mum². Custom signal-processing circuits were implemented on a printed circuit board and as an application-specific integrated-circuit (ASIC) chip. The circuits were not only able to measure and amplify the small resistance changes, which corresponded to small ppm (parts-per-million) changes in gas concentrations, but were also adaptable to accommodate the various characteristics of the different thin-films. Since the thin-films were not specific to any one particular gas vapor, an array of sensors each containing a different thin-film was used to produce a distributed response pattern when exposed to a gas vapor. Pattern recognition, including a clustering algorithm and two artificial neural network algorithms, was used to classify the response pattern and identify the gas vapor or odor. Two gas experiments were performed, one

  12. Environmental health aspects of the microelectronics industry.

    PubMed

    Himmelstein, J S; Levy, B S

    1986-01-01

    This article reviews examples of contamination to the surface or groundwater, the ambient air, and soil resulting from the microelectronics industry. The potential effects on human health arising from such environmental contamination are discussed, as well as aspects of their diagnosis, treatment, and related public health implications. Given the high costs of pollution control, the emphasis must be on prevention, which can be facilitated by a high level of suspicion and by the design of safety and pollution control into manufacturing processes.

  13. Technique for rapid inspection of hermetic seals of microelectronic packages using shearography

    NASA Astrophysics Data System (ADS)

    Hung, Y. (Michael) Y.; Shi, Dahuan

    1998-05-01

    One possible failure of microelectronic devices is due to leakage resulting from an imperfect hermetical seal in microelectronic packages such as microchips. This malfunction is often experienced in automobiles in which the electronic devices are exposed to hostile environments. Traditional leak-testing methods are very time consuming. A shearographic technique for rapid evaluation of hermetic seals is presented. The package under test is stressed by an external pressure change. With the pressure change maintained, the lid of a perfectly sealed package will remain deformed while a leaky package will not hold the deformation, which can be monitored by shearography. This leak testing is fast and practical and can be extended to testing pharmaceutical packages, food packages, etc.

  14. Reliability of Strength Testing using the Advanced Resistive Exercise Device and Free Weights

    NASA Technical Reports Server (NTRS)

    English, Kirk L.; Loehr, James A.; Laughlin, Mitzi A.; Lee, Stuart M. C.; Hagan, R. Donald

    2008-01-01

    The Advanced Resistive Exercise Device (ARED) was developed for use on the International Space Station as a countermeasure against muscle atrophy and decreased strength. This investigation examined the reliability of one-repetition maximum (1RM) strength testing using ARED and traditional free weight (FW) exercise. Methods: Six males (180.8 +/- 4.3 cm, 83.6 +/- 6.4 kg, 36 +/- 8 y, mean +/- SD) who had not engaged in resistive exercise for at least six months volunteered to participate in this project. Subjects completed four 1RM testing sessions each for FW and ARED (eight total sessions) using a balanced, randomized, crossover design. All testing using one device was completed before progressing to the other. During each session, 1RM was measured for the squat, heel raise, and deadlift exercises. Generalizability (G) and intraclass correlation coefficients (ICC) were calculated for each exercise on each device and were used to predict the number of sessions needed to obtain a reliable 1RM measurement (G . 0.90). Interclass reliability coefficients and Pearson's correlation coefficients (R) also were calculated for the highest 1RM value (1RM9sub peak)) obtained for each exercise on each device to quantify 1RM relationships between devices.

  15. Devices and systems-on-chip for photonic communication links in a microprocessor

    NASA Astrophysics Data System (ADS)

    Wade, Mark T.

    For the first time, high-performance photonic devices and electronic-photonic systems-on-chip are monolithically integrated in an advanced CMOS microelectronics fabrication process. This includes a silicon optical resonator termed the "spoked-ring" cavity that meets the constraints of thin-SOI microelectronics CMOS processes and enables energy efficient modulators and thermally tunable filters. For low-loss fiber-to-chip optical coupling, a phased-array antenna concept is demonstrated, and the 45 nm CMOS microelectronics process is shown to support a near ideal implementation of the device using the crystalline silicon and polysilicon material layers that comprise the active region and gate, respectively, of the native MOSFET transistors. The active devices and vertical grating couplers are implemented in large-scale electronic-photonic systems-on-chip to demonstrate a wavelength stabilized, microring-based chip-to-chip communications link and an 11-channel wavelength division multiplexed (WDM) transmitter. The link is shown to be robust against thermal environmental variations which is critical for operation in realistic systems. The chip-to-chip link is then used to demonstrate a CPU-to-memory communication link, the first demonstration of its kind. The first microprocessor with photonic I/O is demonstrated as part of this work, with substantial implications for computer architecture. Advanced photonic device technology demonstrations, including photonic crystals, a quantum-correlated photon-pair source, an active photonic device platform in a 32 nm SOI node, and a 180 nm bulk silicon process, are presented to show the wide range of applications that monolithic integration could support in the future of photonics. These results taken together show that monolithic integration directly into CMOS microelectronics processes does allow high performance photonics, and is a viable approach to build large-scale electronic-photonic systems with a realistic path to

  16. Trusted Defense Microelectronics: Future Access and Capabilities Are Uncertain

    DTIC Science & Technology

    2015-10-28

    stemming from manufacturing costs, supply chain globalization, and market trends, creating uncertainty regarding future access about U.S.-based...microelectronics market has short life cycles, with little need to support older technologies. Conversely, DOD’s needs for microelectronics are low...influence on the commercial market . A decade ago, the Defense Science Board concluded that DOD had “no overall vision of its future microelectronics

  17. [Research progress on the treatment of obstructive sleep apnea and hypopnea syndrome with mandibular advancement device].

    PubMed

    Li, De-hong; Yang, Xiang-hong; Guo, Tian-wen

    2010-04-01

    Obstructive sleep apnea and hypopnea syndrome (OSAHS) is characterized by obstruction of upper airway and respiratory disturbance, excessive daytime sleepiness and tiredness.The possible causes are obesity, hypertension, and upper airway malformations,etc. The location and degree of upper airway structure narrowing in patients have been investigated in many ways, such as X-ray, multi-slices spiral computed tomography, etc. With multi-planar reconstruction technique,3-dimensional construction of upper airway can be established which shows the delicate changes of the upper airway structure. Mandibular advancement device is known as an effective treatment on mild and moderate OSAHS. By advancing the mandible forward, it can increase the space of upper airway, especially the oropharyngeal space. This paper reviewed the methods of investigating on OSAHS and the change of upper airway structure in OSAHS patients treated with mandibular advancement device. Supported by Combined Research Fund of Bureau of Health, Yunan Province and Kunming Medical College(Grant No.2009CD205).

  18. Tribochemical investigation of microelectronic materials

    NASA Astrophysics Data System (ADS)

    Kulkarni, Milind Sudhakar

    To achieve efficient planarization with reduced device dimensions in integrated circuits, a better understanding of the physics, chemistry, and the complex interplay involved in chemical mechanical planarization (CMP) is needed. The CMP process takes place at the interface of the pad and wafer in the presence of the fluid slurry medium. The hardness of Cu is significantly less than the slurry abrasive particles which are usually alumina or silica. It has been accepted that a surface layer can protect the Cu surface from scratching during CMP. Four competing mechanisms in materials removal have been reported: the chemical dissolution of Cu, the mechanical removal through slurry abrasives, the formation of thin layer of Cu oxide and the sweeping surface material by slurry flow. Despite the previous investigation of Cu removal, the electrochemical properties of Cu surface layer is yet to be understood. The motivation of this research was to understand the fundamental aspects of removal mechanisms in terms of electrochemical interactions, chemical dissolution, mechanical wear, and factors affecting planarization. Since one of the major requirements in CMP is to have a high surface finish, i.e., low surface roughness, optimization of the surface finish in reference to various parameters was emphasized. Three approaches were used in this research: in situ measurement of material removal, exploration of the electropotential activation and passivation at the copper surface and modeling of the synergistic electrochemical-mechanical interactions on the copper surface. In this research, copper polishing experiments were conducted using a table top tribometer. A potentiostat was coupled with this tribometer. This combination enabled the evaluation of important variables such as applied pressure, polishing speed, slurry chemistry, pH, materials, and applied DC potential. Experiments were designed to understand the combined and individual effect of electrochemical interactions

  19. Sub-Shot Noise Power Source for Microelectronics

    NASA Technical Reports Server (NTRS)

    Strekalov, Dmitry V.; Yu, Nan; Mansour, Kamjou

    2011-01-01

    Low-current, high-impedance microelectronic devices can be affected by electric current shot noise more than they are affected by Nyquist noise, even at room temperature. An approach to implementing a sub-shot noise current source for powering such devices is based on direct conversion of amplitude-squeezed light to photocurrent. The phenomenon of optical squeezing allows for the optical measurements below the fundamental shot noise limit, which would be impossible in the domain of classical optics. This becomes possible by affecting the statistical properties of photons in an optical mode, which can be considered as a case of information encoding. Once encoded, the information describing the photon (or any other elementary excitations) statistics can be also transmitted. In fact, it is such information transduction from optics to an electronics circuit, via photoelectric effect, that has allowed the observation of the optical squeezing. It is very difficult, if not technically impossible, to directly measure the statistical distribution of optical photons except at extremely low light level. The photoelectric current, on the other hand, can be easily analyzed using RF spectrum analyzers. Once it was observed that the photocurrent noise generated by a tested light source in question is below the shot noise limit (e.g. produced by a coherent light beam), it was concluded that the light source in question possess the property of amplitude squeezing. The main novelty of this technology is to turn this well-known information transduction approach around. Instead of studying the statistical property of an optical mode by measuring the photoelectron statistics, an amplitude-squeezed light source and a high-efficiency linear photodiode are used to generate photocurrent with sub-Poissonian electron statistics. By powering microelectronic devices with this current source, their performance can be improved, especially their noise parameters. Therefore, a room-temperature sub

  20. Porous Diblock Copolymer Thin Films in High-Performance Semiconductor Microelectronics

    SciTech Connect

    Black, C.T.

    2011-02-01

    The engine fueling more than 40 years of performance improvements in semiconductor integrated circuits (ICs) has been industry's ability to pattern circuit elements at ever-higher resolution and with ever-greater precision. Steady advances in photolithography - the process wherein ultraviolet light chemically changes a photosensitive polymer resist material in order to create a latent image - have resulted in scaling of minimum printed feature sizes from tens of microns during the 1980s to sub-50 nanometer transistor gate lengths in today's state-of-the-art ICs. The history of semiconductor technology scaling as well as future technology requirements is documented in the International Technology Roadmap for Semiconductors (ITRS). The progression of the semiconductor industry to the realm of nanometer-scale sizes has brought enormous challenges to device and circuit fabrication, rendering performance improvements by conventional scaling alone increasingly difficult. Most often this discussion is couched in terms of field effect transistor (FET) feature sizes such as the gate length or gate oxide thickness, however these challenges extend to many other aspects of the IC, including interconnect dimensions and pitch, device packing density, power consumption, and heat dissipation. The ITRS Technology Roadmap forecasts a difficult set of scientific and engineering challenges with no presently-known solutions. The primary focus of this chapter is the research performed at IBM on diblock copolymer films composed of polystyrene (PS) and poly(methyl-methacrylate) (PMMA) (PS-b-PMMA) with total molecular weights M{sub n} in the range of {approx}60K (g/mol) and polydispersities (PD) of {approx}1.1. These materials self assemble to form patterns having feature sizes in the range of 15-20nm. PS-b-PMMA was selected as a self-assembling patterning material due to its compatibility with the semiconductor microelectronics manufacturing infrastructure, as well as the significant body

  1. Descriptions of a linear device developed for research on advanced plasma imaging and dynamics.

    PubMed

    Chung, J; Lee, K D; Seo, D C; Nam, Y U; Ko, W H; Lee, J H; Choi, M C

    2009-10-01

    The research on advanced plasma imaging and dynamics (RAPID) device is a newly developed linear electron cyclotron resonance (ECR) plasma device. It has a variety of axial magnetic field profiles provided by eight water-cooled magnetic coils and two dc power supplies. The positions of the magnetic coils are freely adjustable along the axial direction and the power supplies can be operated with many combinations of electrical wiring to the coils. A 6 kW 2.45 GHz magnetron is used to produce steady-state ECR plasmas with central magnetic fields of 875 and/or 437.5 G (second harmonic). The cylindrical stainless steel vacuum chamber is 300 mm in diameter and 750 mm in length and has eight radial and ten axial ports including 6-in. and 8-in. viewing windows for heating and diagnostics. Experimental observation of ECR plasma heating has been recently carried out during the initial plasma operation. The main diagnostic systems including a 94 GHz heterodyne interferometer, a high-resolution 25 channel one-dimensional array spectrometer, a single channel survey spectrometer, and an electric probe have been also prepared. The RAPID device is a flexible simulator for the understanding of tokamak edge plasma physics and new diagnostic system development. In this work, we describe the RAPID device and initial operation results.

  2. Descriptions of a linear device developed for research on advanced plasma imaging and dynamics

    SciTech Connect

    Chung, J.; Lee, K. D.; Seo, D. C.; Nam, Y. U.; Ko, W. H.; Lee, J. H.; Choi, M. C.

    2009-10-15

    The research on advanced plasma imaging and dynamics (RAPID) device is a newly developed linear electron cyclotron resonance (ECR) plasma device. It has a variety of axial magnetic field profiles provided by eight water-cooled magnetic coils and two dc power supplies. The positions of the magnetic coils are freely adjustable along the axial direction and the power supplies can be operated with many combinations of electrical wiring to the coils. A 6 kW 2.45 GHz magnetron is used to produce steady-state ECR plasmas with central magnetic fields of 875 and/or 437.5 G (second harmonic). The cylindrical stainless steel vacuum chamber is 300 mm in diameter and 750 mm in length and has eight radial and ten axial ports including 6-in. and 8-in. viewing windows for heating and diagnostics. Experimental observation of ECR plasma heating has been recently carried out during the initial plasma operation. The main diagnostic systems including a 94 GHz heterodyne interferometer, a high-resolution 25 channel one-dimensional array spectrometer, a single channel survey spectrometer, and an electric probe have been also prepared. The RAPID device is a flexible simulator for the understanding of tokamak edge plasma physics and new diagnostic system development. In this work, we describe the RAPID device and initial operation results.

  3. Characterization of organic and inorganic optoelectronic semiconductor devices using advanced spectroscopic methods

    NASA Astrophysics Data System (ADS)

    Schroeder, Raoul

    In this thesis, advanced spectroscopy methods are discussed and applied to gain understanding of the physical properties of organic conjugated molecules, II-VI thin film semiconductors, and vertical cavity surface emitting lasers (VCSEL). Experiments include single photon and two-photon excitation with lasers, with subsequent measurements of the absorption and photoluminescence, as well as photocurrent measurements using tungsten and xenon lamps, measuring the direct current and the alternating current of the devices. The materials are investigated in dissolved form (conjugated polymers), thin films (polymers, II-VI semiconductors), and complex layer structures (hybrid device, VCSEL). The experiments are analyzed and interpreted by newly developed or applied theories for two-photon saturation processes in semiconductors, bandgap shrinkage due to optically induced electron hole pairs, and the principle of detailed balance to describe the photoluminescence in thin film cadmium sulfide.

  4. Centre for Advanced Microstructures and Devices (CAMD) at Louisiana State University

    NASA Astrophysics Data System (ADS)

    Stockbauer, Roger L.; Poliakoff, Erwin D.; Ajmera, Pratul; Craft, Ben C.; Saile, Volker

    1990-06-01

    The Centre for Advanced Microstructures and Devices (CAMD) has been established by the Department of Energy at Louisiana State University for the expressed purpose of developing X-ray lithography based techniques for manufacturing microcircuits. The heart of the Center will be a synchrotron light source optimized for the soft X-ray region and will be the first commercially manufactured electron storage ring in the United States. The magnet lattice is based on a design developed by Chasman and Green and will be similar to the VUV ring at Brookhaven NSLS and will operate at 1.2 GeV with a critical wavelength of 9.5 Å. Straight sections will allow up to three insertion devices to be installed for higher energy and higher intensity radiation. In addition to the lithography effort, experimental programs are being established in physics, chemistry, and related areas.

  5. A new synchrotron light source at Louisiana State University's Center for Advanced Microstructures and Devices

    NASA Astrophysics Data System (ADS)

    Stockbauer, Roger L.; Ajmera, Pratul; Poliakoff, Erwin D.; Craft, Ben C.; Saile, Volker

    1990-05-01

    A 1.2-GeV synchrotron light source is being constructed at the Center for Advanced Microstructures and Devices (CAMD) at Louisiana State University. The expressed purpose of the center, which has been funded by a grant from the US Department of Energy, is to develop X-ray lithography techniques for manufacturing microcircuits, although basic science programs are also being established. The storage ring will be optimized for the soft-X-ray region and will be the first commercially manufactured electron storage ring in the United States. The magnetic lattice is based on a design developed by Chasman and Green and will allow up to three insertion devices to be installed for higher-energy and higher-intensity radiation. In addition to the lithography effort, experimental programs are being established in physics, chemistry, and related areas.

  6. Sharp-switching band-modulation back-gated devices in advanced FDSOI technology

    NASA Astrophysics Data System (ADS)

    El Dirani, Hassan; Fonteneau, Pascal; Solaro, Yohann; Legrand, Charles-Alex; Marin-Cudraz, David; Ferrari, Philippe; Cristoloveanu, Sorin

    2017-02-01

    A band-modulation device with a free top surface, named Z3-FET (Zero front-gate, Zero swing slope and Zero impact ionization) and fabricated in the most advanced Fully Depleted Silicon-On-Insulator technology, is demonstrated experimentally. Since the device has no front gate, the operation mechanism is controlled by two adjacent heavily doped buried ground planes acting as back-gates. Characteristics such as sharp quasi-vertical switching, low leakage, and tunable trigger voltage are measured and discussed. We explore several variants (thin and thick silicon or SiGe body) and show promising results in terms of high current, switching performance and ESD capability with relatively low back-gate and drain bias operation.

  7. Left ventricular assist device driveline infections: recent advances and future goals

    PubMed Central

    2015-01-01

    Left ventricular assist devices (LVADs) have revolutionized the treatment of advanced heart failure, but infection remains a substantial risk. LVAD driveline infections (DLIs) are the most common type of LVAD-associated infection (LVADI). In the past several years we have expanded our understanding of DLI epidemiology, standardized the definition of LVADIs, improved infection rates through changes in implantation techniques, and investigated potential new modalities for DLI diagnosis. However, significant challenges remain for optimizing DLI prevention and treatment. These challenges include standardizing and improving both empiric and targeted antimicrobial therapy, expanding our understanding of effective driveline exit site dressings and topical therapies, and defining the patient population that benefits from device exchange and transplant. Additionally, in an era of expanding antibiotic resistance we need to continue investigating novel, non-antibiotic therapies for prevention and treatment of DLIs. PMID:26793335

  8. Management of severe obstructive sleep apnea using mandibular advancement devices with auto continuous positive airway pressures

    PubMed Central

    Upadhyay, Rashmi; Dubey, Abhishek; Kant, Surya; Singh, Balendra Pratap

    2015-01-01

    The use of continuous positive airway pressures (CPAP) is considered standard treatment of moderate to severe obstructive sleep apnea (OSA). Treatment of the disease poses a great challenge not only for its diagnostic purpose but also for its treatment part. In about 29-83% of the patients, treatment is difficult because of non-compliance resulting due to high pressures, air leaks and other related issues. In such situations, alternative methods of treatment need to be looked for so as to ascertain better management. Mandibular advancement devices along with CPAP may show better treatment outcome in specific situations. PMID:25814802

  9. Development of the Vibration Isolation System for the Advanced Resistive Exercise Device

    NASA Technical Reports Server (NTRS)

    Niebuhr, Jason H.; Hagen, Richard A.

    2011-01-01

    This paper describes the development of the Vibration Isolation System for the Advanced Resistive Exercise Device from conceptual design to lessons learned. Maintaining a micro-g environment on the International Space Station requires that experiment racks and major vibration sources be isolated. The challenge in characterizing exercise loads and testing the system in the presence of gravity led to a decision to qualify the system by analysis. Available data suggests that the system is successful in attenuating loads, yet there has been a major component failure and several procedural issues during its 3 years of operational use.

  10. Computational Models of Exercise on the Advanced Resistance Exercise Device (ARED)

    NASA Technical Reports Server (NTRS)

    Newby, Nate; Caldwell, Erin; Scott-Pandorf, Melissa; Peters,Brian; Fincke, Renita; DeWitt, John; Poutz-Snyder, Lori

    2011-01-01

    Muscle and bone loss remain a concern for crew returning from space flight. The advanced resistance exercise device (ARED) is used for on-orbit resistance exercise to help mitigate these losses. However, characterization of how the ARED loads the body in microgravity has yet to be determined. Computational models allow us to analyze ARED exercise in both 1G and 0G environments. To this end, biomechanical models of the squat, single-leg squat, and deadlift exercise on the ARED have been developed to further investigate bone and muscle forces resulting from the exercises.

  11. [Objective surgery -- advanced robotic devices and simulators used for surgical skill assessment].

    PubMed

    Suhánszki, Norbert; Haidegger, Tamás

    2014-12-01

    Robotic assistance became a leading trend in minimally invasive surgery, which is based on the global success of laparoscopic surgery. Manual laparoscopy requires advanced skills and capabilities, which is acquired through tedious learning procedure, while da Vinci type surgical systems offer intuitive control and advanced ergonomics. Nevertheless, in either case, the key issue is to be able to assess objectively the surgeons' skills and capabilities. Robotic devices offer radically new way to collect data during surgical procedures, opening the space for new ways of skill parameterization. This may be revolutionary in MIS training, given the new and objective surgical curriculum and examination methods. The article reviews currently developed skill assessment techniques for robotic surgery and simulators, thoroughly inspecting their validation procedure and utility. In the coming years, these methods will become the mainstream of Western surgical education.

  12. Radiation Effects and Hardening Techniques for Spacecraft Microelectronics

    NASA Astrophysics Data System (ADS)

    Gambles, J. W.; Maki, G. K.

    2002-01-01

    The natural radiation from the Van Allen belts, solar flares, and cosmic rays found outside of the protection of the earth's atmosphere can produce deleterious effects on microelectronics used in space systems. Historically civil space agencies and the commercial satellite industry have been able to utilize components produced in special radiation hardened fabrication process foundries that were developed during the 1970s and 1980s under sponsorship of the Departments of Defense (DoD) and Energy (DoE). In the post--cold war world the DoD and DoE push to advance the rad--hard processes has waned. Today the available rad--hard components lag two-plus technology node generations behind state- of-the-art commercial technologies. As a result space craft designers face a large performance gap when trying to utilize available rad--hard components. Compounding the performance gap problems, rad--hard components are becoming increasingly harder to get. Faced with the economic pitfalls associated with low demand versus the ever increasing investment required for integrated circuit manufacturing equipment most sources of rad--hard parts have simply exited this market in recent years, leaving only two domestic US suppliers of digital rad--hard components. This paper summarizes the radiation induced mechanisms that can cause digital microelectronics to fail in space, techniques that can be applied to mitigate these failure mechanisms, and ground based testing used to validate radiation hardness/tolerance. The radiation hardening techniques can be broken down into two classes, Hardness By Process (HBP) and Hardness By Design (HBD). Fortunately many HBD techniques can be applied to commercial fabrication processes providing space craft designer with radiation tolerant Application Specific Integrated Circuits (ASICs) that can bridge the performance gap between the special HBP foundries and the commercial state-of-the-art performance.

  13. A Retinal Prosthesis Technology Based on CMOS Microelectronics and Microwire Glass Electrodes.

    PubMed

    Scribner, D; Johnson, L; Skeath, P; Klein, R; Ilg, D; Wasserman, L; Fernandez, N; Freeman, W; Peele, J; Perkins, F K; Friebele, E J; Bassett, W E; Howard, J G; Krebs, W

    2007-03-01

    A very large format neural stimulator device, to be used in future retinal prosthesis experiments, has been designed, fabricated, and tested. The device was designed to be positioned against a human retina for short periods in an operating room environment. Demonstrating a very large format, parallel interface between a 2-D microelectronic stimulator array and neural tissue would be an important step in proving the feasibility of high resolution retinal prosthesis for the blind. The architecture of the test device combines several novel components, including microwire glass, a microelectronic multiplexer, and a microcable connector. The array format is 80 times 40 array pixels with approximately 20 microwire electrodes per pixel. The custom assembly techniques involve indium bump bonding, ribbon bonding, and encapsulation. The design, fabrication, and testing of the device has resolved several important issues regarding the feasibility of high-resolution retinal prosthesis, namely, that the combination of conventional CMOS electronics and microwire glass provides a viable approach for a high resolution retinal prosthesis device. Temperature change from power dissipation within the device and maximum electrical output current levels suggest that the device is acceptable for acute human tests.

  14. Measurement of the Radiation Incident on NbFeB Insertion Devices at the Advanced Light Source

    NASA Astrophysics Data System (ADS)

    Krebs, Gary; Holmes, Michael

    1997-05-01

    The Lawrence Berkeley National Laboratories Advanced Light Source is a third generation light source containing NdFeB permanent magnet insertion devices.The lifetime of the permanent magnets in a radiation environment is of paramount importance. Measurements of the radiation incident on the insertion device magnets under various operating conditions are presented.

  15. Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance

    NASA Astrophysics Data System (ADS)

    Sukharev, V.; Kteyan, A.; Choy, J.-H.; Hovsepyan, H.; Markosian, A.; Zschech, E.; Huebner, R.

    2011-11-01

    Potential challenges with managing mechanical stress and the consequent effects on device performance for advanced 3D through-silicon-via (TSV) based technologies are outlined. The paper addresses the growing need in a simulation-based design verification flow capable to analyze a design of 3D IC stacks and to determine across-die out-of-spec variations in device electrical characteristics caused by the layout and through-silicon-via (TSV)/package-induced mechanical stress. The limited characterization/measurement capabilities for 3D IC stacks and a strict "good die" requirement make this type of analysis critical for the achievement of an acceptable level of functional and parametric yield and reliability. The paper focuses on the development of a design-for-manufacturability (DFM) type of methodology for managing mechanical stresses during a sequence of designs of 3D TSV-based dies, stacks and packages. A set of physics-based compact models for a multi-scale simulation to assess the mechanical stress across the device layers in silicon chips stacked and packaged with the 3D TSV technology is proposed. A calibration technique based on fitting to measured stress components and electrical characteristics of the test-chip devices is presented. A strategy for generation of a simulation feeding data and respective materials characterization approach are proposed, with the goal to generate a database for multi-scale material parameters of wafer-level and package-level structures. For model validation, high-resolution strain measurements in Si channels of the test-chip devices are needed. At the nanoscale, the transmission electron microscopy (TEM) is the only technique available for sub-10 nm strain measurements so far.

  16. Total ionizing dose radiation effects on NMOS parasitic transistors in advanced bulk CMOS technology devices

    NASA Astrophysics Data System (ADS)

    Baoping, He; Zujun, Wang; Jiangkun, Sheng; Shaoyan, Huang

    2016-12-01

    In this paper, total ionizing dose effect of NMOS transistors in advanced CMOS technology are examined. The radiation tests are performed at 60Co sources at the dose rate of 50 rad (Si)/s. The investigation's results show that the radiation-induced charge buildup in the gate oxide can be ignored, and the field oxide isolation structure is the main total dose problem. The total ionizing dose (TID) radiation effects of field oxide parasitic transistors are studied in detail. An analytical model of radiation defect charge induced by TID damage in field oxide is established. The I - V characteristics of the NMOS parasitic transistors at different doses are modeled by using a surface potential method. The modeling method is verified by the experimental I - V characteristics of 180 nm commercial NMOS device induced by TID radiation at different doses. The model results are in good agreement with the radiation experimental results, which shows the analytical model can accurately predict the radiation response characteristics of advanced bulk CMOS technology device. Project supported by the National Natural Science Foundation of China (No. 11305126).

  17. Advances in Resistive Pulse Sensors: Devices bridging the void between molecular and microscopic detection

    PubMed Central

    Kozak, Darby; Anderson, Will; Vogel, Robert; Trau, Matt

    2011-01-01

    Since the first reported use of a biological ion channel to detect differences in single stranded genomic base pairs in 1996, a renaissance in nanoscale resistive pulse sensors has ensued. This resurgence of a technique originally outlined and commercialized over fifty years ago has largely been driven by advances in nanoscaled fabrication, and ultimately, the prospect of a rapid and inexpensive means for genomic sequencing as well as other macromolecular characterization. In this pursuit, the potential application of these devices to characterize additional properties such as the size, shape, charge, and concentration of nanoscaled materials (10 – 900 nm) has been largely overlooked. Advances in nanotechnology and biotechnology are driving the need for simple yet sensitive individual object readout devices such as resistive pulse sensors. This review will examine the recent progress in pore-based sensing in the nanoscale range. A detailed analysis of three new types of pore sensors – in-series, parallel, and size-tunable pores – has been included. These pores offer improved measurement sensitivity over a wider particle size range. The fundamental physical chemistry of these techniques, which is still evolving, will be reviewed. PMID:22034585

  18. Evaluation of ExPress glaucoma filtration device in Indian patients with advanced glaucoma.

    PubMed

    Angmo, Dewang; Sharma, Reetika; Temkar, Shreyas; Dada, Tanuj

    2015-05-01

    ExPress glaucoma filtration device (GFD) has recently become available in India as a surgical option for glaucoma patients. We retrospectively evaluated the outcome of ExPress GFD in 12 eyes with advanced glaucoma with intraocular pressures (IOPs) not controlled on maximal tolerable medical therapy. The mean preoperative IOP of 29.58 ± 7.13 mmHg decreased to 17.0 ± 2.67 and 17.40 ± 0.89 mmHg at 6 and 12 months after surgery. Absolute success (IOP ≤ 18 mmHg, with no additional glaucoma medications) was achieved in eight cases (66.7%) and qualified success (IOP ≤ 18 mmHg, with additional glaucoma medications) in two cases (16.7%) at 1-year after surgery. Early intervention was needed in 4 patients; two underwent anterior chamber reformation while the other two required needling. Two patients required resurgery. There was no significant change in the best corrected visual acuity postoperatively (P = 0.37). ExPress GFD does not seem to offer a benefit over standard trabeculectomy in patients with advanced glaucomatous disease in terms of IOP control or complication rate. However, due to the small sample size with a heterogeneous mixture of primary and secondary glaucoma's, we await further studies with a larger sample size and long-term follow-up, to see how the device performs.

  19. Acoustic, fiber optic, and silicon microelectronic microsensors research and development activities at Sandia National Laboratories

    SciTech Connect

    Wiczer, J.J.

    1993-08-01

    Sandia National Laboratories, an 8500+ person, multiprogram research and development facility operated for the US Department of Energy, has over 400 research, development and applications scientists and engineers working on sensor technologies. Sandia`s 20 person Microsensors Research and Development Department has invented, developed and fielded sensor systems based on acoustic, fiber optic, and silicon microelectronic technologies. These sensors have been used for diverse applications inducting the monitoring of cleaning chemical concentrations in industrial process effluent streams, detection of explosive gas concentrations in aging industrial equipment, real-time measurements of fluid viscosity in equipment lubricants, and monitoring of contaminant concentration levels in ultrapure process gases. Representative sensor technologies available for technology transfer will be described including bulk acoustic wave resonators, surface acoustic wave devices, fiber optic micromirror sensors, and silicon microelectronic sensors.

  20. Interlaced, Nanostructured Interface with Graphene Buffer Layer Reduces Thermal Boundary Resistance in Nano/Microelectronic Systems.

    PubMed

    Tao, Lei; Theruvakkattil Sreenivasan, Sreeprasad; Shahsavari, Rouzbeh

    2017-01-11

    Improving heat transfer in hybrid nano/microelectronic systems is a challenge, mainly due to the high thermal boundary resistance (TBR) across the interface. Herein, we focus on gallium nitride (GaN)/diamond interface-as a model system with various high power, high temperature, and optoelectronic applications-and perform extensive reverse nonequilibrium molecular dynamics simulations, decoding the interplay between the pillar length, size, shape, hierarchy, density, arrangement, system size, and the interfacial heat transfer mechanisms to substantially reduce TBR in GaN-on-diamond devices. We found that changing the conventional planar interface to nanoengineered, interlaced architecture with optimal geometry results in >80% reduction in TBR. Moreover, introduction of conformal graphene buffer layer further reduces the TBR by ∼33%. Our findings demonstrate that the enhanced generation of intermediate frequency phonons activates the dominant group velocities, resulting in reduced TBR. This work has important implications on experimental studies, opening up a new space for engineering hybrid nano/microelectronics.

  1. Microelectronics Availability for the Army’s Missiles.

    DTIC Science & Technology

    1980-09-15

    necoea, and identidi by block number) Microelectronics Military electronics Semiconductor technology Emergency mobilization Integrated circuit market...production of military standard components; and the mobilization of the microelectronics industry, should the need arise. In this report the many facets...5 3. Development of a Mobilization Strategy. .. .. .. .. ... ... .... ... ..... 6 IV. THE MICOM STRATEGY

  2. Microelectronics and Special Education. CET/MEP Information Sheet.

    ERIC Educational Resources Information Center

    Council for Educational Technology, London (England).

    Used as an additional aid by the teacher, microelectronics can assist mentally and physically handicapped children to meet educational objectives that have been specifically agreed upon for the individual child. Microelectronics can help deaf children develop speech production, communication skills, and grammar and sentence construction;…

  3. Moving Education and Its Administration into the Microelectronic Age.

    ERIC Educational Resources Information Center

    Culbertson, Jack A.

    Education is in transition between the ascendent microelectronic and descendent industrial revolutions, with purposes ambiguously linked to both. These purposes must be clarified before educational leaders can establish priorities for adapting education to the needs of a society transformed by microelectronic technology. Accordingly, the features…

  4. Recent advances in computational methodology for simulation of mechanical circulatory assist devices

    PubMed Central

    Marsden, Alison L.; Bazilevs, Yuri; Long, Christopher C.; Behr, Marek

    2014-01-01

    Ventricular assist devices (VADs) provide mechanical circulatory support to offload the work of one or both ventricles during heart failure. They are used in the clinical setting as destination therapy, as bridge to transplant, or more recently as bridge to recovery to allow for myocardial remodeling. Recent developments in computational simulation allow for detailed assessment of VAD hemodynamics for device design and optimization for both children and adults. Here, we provide a focused review of the recent literature on finite element methods and optimization for VAD simulations. As VAD designs typically fall into two categories, pulsatile and continuous flow devices, we separately address computational challenges of both types of designs, and the interaction with the circulatory system with three representative case studies. In particular, we focus on recent advancements in finite element methodology that has increased the fidelity of VAD simulations. We outline key challenges, which extend to the incorporation of biological response such as thrombosis and hemolysis, as well as shape optimization methods and challenges in computational methodology. PMID:24449607

  5. Mechanism Development, Testing, and Lessons Learned for the Advanced Resistive Exercise Device

    NASA Technical Reports Server (NTRS)

    Lamoreaux, Christopher D.; Landeck, Mark E.

    2006-01-01

    The Advanced Resistive Exercise Device (ARED) has been developed at NASA Johnson Space Center, for the International Space Station (ISS) program. ARED is a multi-exercise, high-load resistive exercise device, designed for long duration, human space missions. ARED will enable astronauts to effectively maintain their muscle strength and bone mass in the micro-gravity environment more effectively than any other existing devices. ARED's resistance is provided via two, 20.3 cm (8 in) diameter vacuum cylinders, which provide a nearly constant resistance source. ARED also has a means to simulate the inertia that is felt during a 1-G exercise routine via the flywheel subassembly, which is directly tied to the motion of the ARED cylinders. ARED is scheduled to fly on flight ULF 2 to the ISS and will be located in Node 1. Presently, ARED is in the middle of its qualification and acceptance test program. An extensive testing program and engineering evaluation has increased the reliability of ARED by bringing potential design issues to light before flight production. Some of those design issues, resolutions, and design details will be discussed in this paper.

  6. WE-DE-207A-03: Recent Advances in Devices Used in Neuro--Interventions.

    PubMed

    Gounis, M

    2016-06-01

    1. Parallels in the evolution of x-ray angiographic systems and devices used for minimally invasive endovascular therapy Charles Strother - DSA, invented by Dr. Charles Mistretta at UW-Madison, was the technology which enabled the development of minimally invasive endovascular procedures. As DSA became widely available and the potential benefits for accessing the cerebral vasculature from an endovascular approach began to be apparent, industry began efforts to develop tools for use in these procedures. Along with development of catheters, embolic materials, pushable coils and the GDC coils there was simultaneous development and improvement of 2D DSA image quality and the introduction of 3D DSA. Together, these advances resulted in an enormous expansion in the scope and numbers of minimally invasive endovascular procedures. The introduction of flat detectors for c-arm angiographic systems in 2002 provided the possibility of the angiographic suite becoming not just a location for vascular imaging where physiological assessments might also be performed. Over the last decade algorithmic and hardware advances have been sufficient to now realize this potential in clinical practice. The selection of patients for endovascular treatments is enhanced by this dual capability. Along with these advances has been a steady reduction in the radiation exposure required so that today, vascular and soft tissue images may be obtained with equal or in many cases less radiation exposure than is the case for comparable images obtained with multi-detector CT.

  7. Properties and Adhesion of Polyimides in Microelectronic Devices

    DTIC Science & Technology

    1990-08-15

    where they react at room temperature to polyamic acid. Spin coating (SC) requires that the polymer precursor polyamic acid is applied in a polar ...j.Vac.Sci.Technol A7 (3) (1989) 1402 /31/ J.Russat, Surface and Interface Analyisis , Vol. 11 (1988)414 /32/ M. Grunze and R.N. Lamb, Chem. Phys.Lett. (:987) 133

  8. Glucose oxidase characterization for the fabrication of hybrid microelectronic devices

    NASA Astrophysics Data System (ADS)

    Fichera, Manuela; Libertino, Sebania; Aiello, Venera; Scandurra, Antonino; Sinatra, Fulvia; Renis, Marcella; Lombardo, Salvatore

    2007-05-01

    We studied the enzyme glucose oxidase (GOx) immobilization on silicon oxide surfaces. In particular, we optimized the immobilization protocol and verified that it fulfills both requirements of enzyme preservation (measured by enzymatic activity) and VLSI compatibility. The immobilization consists of four steps: oxide activation, silanization, linker molecule deposition and GOx immobilization. It is crucial to form an uniform linker layer on the sample surface in order to maximize the sites available for enzyme bonding and achieving the best enzyme deposition. In this study, utilizing glutaraldehyde as bifunctional reagent, we monitored its uniformity on the surface through X-ray Photoelectron Spectroscopy (XPS). Once optimized, the same protocol was used to anchor the enzyme in a porous silicon dioxide matrix. Gold labeled GOx molecules were monitored by electron diffraction X-ray (EDX) measurements coupled with scanning electron microscopy (SEM). The enzymatic activity was also monitored to confirm the goodness of the proposed immobilization method. Finally, the electrical characterization of MOS capacitors, showing a shift of about 1 V in the flat band voltage, demonstrated the possibility to use this approach for electrical detection.

  9. Development of a High Fidelity Dynamic Module of the Advanced Resistive Exercise Device (ARED) Using Adams

    NASA Technical Reports Server (NTRS)

    Humphreys, B. T.; Thompson, W. K.; Lewandowski, B. E.; Cadwell, E. E.; Newby, N. J.; Fincke, R. S.; Sheehan, C.; Mulugeta, L.

    2012-01-01

    NASA's Digital Astronaut Project (DAP) implements well-vetted computational models to predict and assess spaceflight health and performance risks, and enhance countermeasure development. DAP provides expertise and computation tools to its research customers for model development, integration, or analysis. DAP is currently supporting the NASA Exercise Physiology and Countermeasures (ExPC) project by integrating their biomechanical models of specific exercise movements with dynamic models of the devices on which the exercises were performed. This presentation focuses on the development of a high fidelity dynamic module of the Advanced Resistive Exercise Device (ARED) on board the ISS. The ARED module, illustrated in the figure below, was developed using the Adams (MSC Santa Ana, California) simulation package. The Adams package provides the capabilities to perform multi rigid body, flexible body, and mixed dynamic analyses of complex mechanisms. These capabilities were applied to accurately simulate: Inertial and mass properties of the device such as the vibration isolation system (VIS) effects and other ARED components, Non-linear joint friction effects, The gas law dynamics of the vacuum cylinders and VIS components using custom written differential state equations, The ARED flywheel dynamics, including torque limiting clutch. Design data from the JSC ARED Engineering team was utilized in developing the model. This included solid modeling geometry files, component/system specifications, engineering reports and available data sets. The Adams ARED module is importable into LifeMOD (Life Modeler, Inc., San Clemente, CA) for biomechanical analyses of different resistive exercises such as squat and dead-lift. Using motion capture data from ground test subjects, the ExPC developed biomechanical exercise models in LifeMOD. The Adams ARED device module was then integrated with the exercise subject model into one integrated dynamic model. This presentation will describe the

  10. Analysis of insertion device magnet measurements for the Advanced Light Source

    SciTech Connect

    Marks, S.; Humphries, D.; Kincaid, B.M.; Schlueter, R.; Wang, C.

    1993-07-01

    The Advanced Light Source (ALS), which is currently being commissioned at Lawrence Berkeley Laboratory, is a third generation light source designed to produce XUV radiation of unprecedented brightness. To meet the high brightness goal the storage ring has been designed for very small electron beam emittance and the undulators installed in the ALS are built to a high degree of precision. The allowable magnetic field errors are driven by electron beam and radiation requirements. Detailed magnetic measurements and adjustments are performed on each undulator to qualify it for installation in the ALS. The first two ALS undulators, IDA and IDB, have been installed. This paper describes the program of measurements, data analysis, and adjustments carried out for these two devices. Calculations of the radiation spectrum, based upon magnetic measurements, are included. Final field integral distributions are also shown. Good field integral uniformity has been achieved using a novel correction scheme, which is also described.

  11. Analysis of insertion device magnet measurements for the advanced light source

    NASA Astrophysics Data System (ADS)

    Marks, Steve; Humphries, David E.; Kincaid, Brian M.; Schlueter, Ross D.; Wang, Chunxi

    1993-11-01

    The Advanced Light Source (ALS), which is currently being commissioned at Lawrence Berkeley Laboratory, is a third generation light source designed to produce XUV radiation of unprecedented brightness. To meet the high brightness goal the storage ring has been designed for very small electron beam emittance and the undulators installed in the ALS are built to a high degree of precision. The allowable magnetic field errors are driven by electron beam and radiation requirements. Detailed magnetic measurements and adjustments are performed on each undulator to qualify it for installation in the ALS. The first two ALS undulators, IDA and IDB, have been installed. This paper describes the program of measurements, data analysis, and adjustments carried out for these two devices. Calculations of the radiation spectrum, based upon magnetic measurements, are included. Final field integral distributions are also shown. Good field integral uniformity has been achieved using a novel correction scheme, which is also described.

  12. Advance ultra sensitive multi-layered nano plasmonic devices for label free biosensing targeting immunodiagnostics

    NASA Astrophysics Data System (ADS)

    Sharma, Divya; Dwivedi, R. P.

    2016-09-01

    The rapid advancement in technology has envisaged and drafted the use of optical bio-sensing units into label free and multiplexed bio-sensing, exploring the surface plasmon polaritons, which has turned into a gold standard on the commercial basis, but they are bulky and find difficulty in scaling up for the throughput detection. The integration of plasmonic crystals with microfluidics on the bio-sensing frontier offers a multi-level validation of results with the ease of real-time detection and imaging and holds a great promise to develop ultra-sensitive, fast, portable device for the point-of-care diagnostics. The paper describes the fast, low cost approach of designing and simulating label free biosensor using open source MEEP and other software tools targeting Immunodiagnostics.

  13. Liver enzymes among microelectronics equipment maintenance technicians.

    PubMed

    Upfal, M

    1992-04-01

    Equipment maintenance workers within the microelectronics industry have opportunities for occupational exposure to a variety of toxic agents. This pilot investigation compares liver enzymes in this population with that of other coworkers. Participants (n = 135) were randomly selected from a medical surveillance program at the manufacturing facility. Nine job categories were examined, including equipment maintenance workers and electronic technicians. Although abnormal liver enzymes were detected among equipment maintenance workers (odds ratio 16.4; P less than .008) and electronic technicians (odds ratio 27; P less than .0005), the numbers of participants were small (n = 8, 10). The data suggest that independent and/or interactive etiologic roles of occupation and alcohol should be further investigated. Early detection of subclinical occupational or recreational hepatotoxicity with appropriate employment of industrial hygiene control technology and/or the reduction of alcohol consumption may provide a means of preventing liver disease.

  14. Dimensionally Stable Poyimide Copolymers for Microelectronics Applications

    NASA Technical Reports Server (NTRS)

    Fay, Catherine C.; St.Clair, Anne K.

    1998-01-01

    Polyimides are finding increased applications in microelectronics due to their high thermal stability, good chemical resistance, good adhesion, low moisture absorption, good mechanical properties, and low coefficient of thermal expansion (CTE). Four series of random copolyimides were synthesized and characterized for potential application as encapsulants, stress-relief layers, and interlevel dielectrics. Several candidates exhibited good combinations of physical and mechanical properties with inherent viscosities from 1.21 to 1.42 dL/g, T(sub g)'s ranging from 251 to 277 C, 10% weight loss temperatures between 503 and 527 C, and CTEs ranging from 33 to 39 ppm/deg C. Mechanical properties at room temperature for the best candidates included tensile strengths of 17.8-21.3 ksi, moduli between 388 and 506 ksi, and elongations of 11-43%. Moisture absorption for these copolyimides ranged between 0.85 and 1.38 wt %.

  15. Monitoring Composite Material Pressure Vessels with a Fiber-Optic/Microelectronic Sensor System

    NASA Technical Reports Server (NTRS)

    Klimcak, C.; Jaduszliwer, B.

    1995-01-01

    We discuss the concept of an integrated, fiber-optic/microelectronic distributed sensor system that can monitor composite material pressure vessels for Air Force space systems to provide assessments of the overall health and integrity of the vessel throughout its entire operating history from birth to end of life. The fiber optic component would include either a semiconductor light emitting diode or diode laser and a multiplexed fiber optic sensing network incorporating Bragg grating sensors capable of detecting internal temperature and strain. The microelectronic components include a power source, a pulsed laser driver, time domain data acquisition hardware, a microprocessor, a data storage device, and a communication interface. The sensing system would be incorporated within the composite during its manufacture. The microelectronic data acquisition and logging system would record the environmental conditions to which the vessel has been subjected to during its storage and transit, e.g., the history of thermal excursions, pressure loading data, the occurrence of mechanical impacts, the presence of changing internal strain due to aging, delamination, material decomposition, etc. Data would be maintained din non-volatile memory for subsequent readout through a microcomputer interface.

  16. Tunable and reconfigurable THz devices for advanced imaging and adaptive wireless communication

    NASA Astrophysics Data System (ADS)

    Liu, L.; Shams, M. I. B.; Jiang, Z.; Rahman, S.; Hesler, J. L.; Cheng, L.-J.; Fay, P.

    2016-09-01

    In this paper, we report on two different approaches that have been explored to realize tunable and reconfigurable THz devices for advanced imaging and adaptive wireless communication. The first approach makes use of electronically tunable varactor diodes. Frequency tunable THz antennas based on this approach have been successfully demonstrated for the first time in G-band, enabling the development of spectroscopic THz detectors and focal-plane imaging arrays. The second approach takes advantages of optical THz spatial modulation based on photo-induced free carriers in semiconductors. Using this approach, high-performance tunable THz modulators/attenuators, reconfigurable masks for THz coded aperture imaging, and photo-induced Fresnel-zone-plate antennas for dynamic THz beam steering and forming have been successfully demonstrated. Our recent study also shows that by employing the so-called mesa array technique, sub-wavelength spatial resolution and higher than 100 dB modulation depth can be achieved, making it possible to develop tunable THz devices (e.g., tunable filters) with performance and versatility far beyond those realized by conventional approaches. On the basis of the above investigation, the prospects of high-speed near-field THz imaging, real-time ultra-sensitive heterodyne imaging and prototype adaptive THz wireless communication links will be discussed.

  17. Advances in Ch-LCD devices using plastic substrates with conducting polymer

    NASA Astrophysics Data System (ADS)

    Fritz, William J.; Wonderly, H.; Smith, Steven W.; Kim, Yoan; Chonko, Jason; Doane, J. William; Shashidhar, Ranganathan; O'Ferrall, Catherine E.; Cuttino, David S.

    1999-03-01

    Cholesteric liquid crystal display (Ch-LCD) are lightweight, low power, sunlight readable displays. In addition, they can serve a dual function as pen-input device switch no additional hardware. Because of the unique properties of this technology, Ch-LCDs can be made with plastic substrates thus making the displayed extremely lightweight, compact and unbreakable. We discuss in this paper cent advances in merging Ch-LCD technology with conducting polymer electrodes. Conducting polymer provides potential benefits over the use of the standard display electrode materials, indium tin oxide, by improving the reliability of the display. Furthermore, the potential to print the conducting polymer electrodes could significantly increase manufacturing volume and decrease display cost. We report on scaling display size and resolution by demonstrating a 1/8 VGA Ch-LCD using polypyrrole as the conducting polymer. We fabricated these displays using either a vacuum fill or polymer wall/lamination approach and we discus subsequent failure analysis to determine the cause for the line-outs observed on these displays. We present initial results in determining the suitability for using Ch-LCD technology as a pen-input device. Finally, we discuss initial work towards printing the conducting polymer electrodes to determine the feasibility of printing electrodes on plastic substrates in a roll-to-roll, high volume, low cost process.

  18. Silicon high speed modulator for advanced modulation: device structures and exemplary modulator performance

    NASA Astrophysics Data System (ADS)

    Milivojevic, Biljana; Wiese, Stefan; Whiteaway, James; Raabe, Christian; Shastri, Anujit; Webster, Mark; Metz, Peter; Sunder, Sanjay; Chattin, Bill; Anderson, Sean P.; Dama, Bipin; Shastri, Kal

    2014-03-01

    Fiber optics is well established today due to the high capacity and speed, unrivaled flexibility and quality of service. However, state of the art optical elements and components are hardly scalable in terms of cost and size required to achieve competitive port density and cost per bit. Next-generation high-speed coherent optical communication systems targeting a data rate of 100-Gb/s and beyond goes along with innovations in component and subsystem areas. Consequently, by leveraging the advanced silicon micro and nano-fabrication technologies, significant progress in developing CMOS platform-based silicon photonic devices has been made all over the world. These achievements include the demonstration of high-speed IQ modulators, which are important building blocks in coherent optical communication systems. In this paper, we demonstrate silicon photonic QPSK modulator based on a metal-oxide-semiconductor (MOS) capacitor structure, address different modulator configuration structures and report our progress and research associated with highspeed advanced optical modulation in silicon photonics

  19. Organic transistors in optical displays and microelectronic applications.

    PubMed

    Gelinck, Gerwin; Heremans, Paul; Nomoto, Kazumasa; Anthopoulos, Thomas D

    2010-09-08

    Organic thin-film transistors (OTFTs) offer unprecedented opportunities for implementation in a broad range of technological applications spanning from large-volume microelectronics and optical displays to chemical and biological sensors. In this Progress Report, we review the application of organic transistors in the fields of flexible optical displays and microelectronics. The advantages associated with the use of OTFT technology are discussed with primary emphasis on the latest developments in the area of active-matrix electrophoretic and organic light-emitting diode displays based on OTFT backplanes and on the application of organic transistors in microelectronics including digital and analog circuits.

  20. Developing and validating advanced divertor solutions on DIII-D for next-step fusion devices

    SciTech Connect

    Guo, H. Y.; Hill, D. N.; Leonard, A. W.; Allen, S. L.; Stangeby, P. C.; Thomas, D.; Unterberg, E. A.; Abrams, T.; Boedo, J.; Briesemeister, A. R.; Buchenauer, D.; Bykov, I.; Canik, J. M.; Chrobak, C.; Covele, B.; Ding, R.; Doerner, R.; Donovan, D.; Du, H.; Elder, D.; Eldon, D.; Lasa, A.; Groth, M.; Guterl, J.; Jarvinen, A.; Hinson, E.; Kolemen, E.; Lasnier, C. J.; Lore, J.; Makowski, M. A.; McLean, A.; Meyer, B.; Moser, A. L.; Nygren, R.; Owen, L.; Petrie, T. W.; Porter, G. D.; Rognlien, T. D.; Rudakov, D.; Sang, C. F.; Samuell, C.; Si, H.; Schmitz, O.; Sontag, A.; Soukhanovskii, V.; Wampler, W.; Wang, H.; Watkins, J. G.

    2016-09-14

    A major challenge facing the design and operation of next-step high-power steady-state fusion devices is to develop a viable divertor solution with order-of-magnitude increases in power handling capability relative to present experience, while having acceptable divertor target plate erosion and being compatible with maintaining good core plasma confinement. A new initiative has been launched on DIII-D to develop the scientific basis for design, installation, and operation of an advanced divertor to evaluate boundary plasma solutions applicable to next step fusion experiments beyond ITER. Developing the scientific basis for fusion reactor divertor solutions must necessarily follow three lines of research, which we plan to pursue in DIII-D: (1) Advance scientific understanding and predictive capability through development and comparison between state-of-the art computational models and enhanced measurements using targeted parametric scans; (2) Develop and validate key divertor design concepts and codes through innovative variations in physical structure and magnetic geometry; (3) Assess candidate materials, determining the implications for core plasma operation and control, and develop mitigation techniques for any deleterious effects, incorporating development of plasma-material interaction models. These efforts will lead to design, installation, and evaluation of an advanced divertor for DIII-D to enable highly dissipative divertor operation at core density (n e/n GW), neutral fueling and impurity influx most compatible with high performance plasma scenarios and reactor relevant plasma facing components (PFCs). In conclusion, this paper highlights the current progress and near-term strategies of boundary/PMI research on DIII-D.

  1. Developing and validating advanced divertor solutions on DIII-D for next-step fusion devices

    NASA Astrophysics Data System (ADS)

    Guo, H. Y.; Hill, D. N.; Leonard, A. W.; Allen, S. L.; Stangeby, P. C.; Thomas, D.; Unterberg, E. A.; Abrams, T.; Boedo, J.; Briesemeister, A. R.; Buchenauer, D.; Bykov, I.; Canik, J. M.; Chrobak, C.; Covele, B.; Ding, R.; Doerner, R.; Donovan, D.; Du, H.; Elder, D.; Eldon, D.; Lasa, A.; Groth, M.; Guterl, J.; Jarvinen, A.; Hinson, E.; Kolemen, E.; Lasnier, C. J.; Lore, J.; Makowski, M. A.; McLean, A.; Meyer, B.; Moser, A. L.; Nygren, R.; Owen, L.; Petrie, T. W.; Porter, G. D.; Rognlien, T. D.; Rudakov, D.; Sang, C. F.; Samuell, C.; Si, H.; Schmitz, O.; Sontag, A.; Soukhanovskii, V.; Wampler, W.; Wang, H.; Watkins, J. G.

    2016-12-01

    A major challenge facing the design and operation of next-step high-power steady-state fusion devices is to develop a viable divertor solution with order-of-magnitude increases in power handling capability relative to present experience, while having acceptable divertor target plate erosion and being compatible with maintaining good core plasma confinement. A new initiative has been launched on DIII-D to develop the scientific basis for design, installation, and operation of an advanced divertor to evaluate boundary plasma solutions applicable to next step fusion experiments beyond ITER. Developing the scientific basis for fusion reactor divertor solutions must necessarily follow three lines of research, which we plan to pursue in DIII-D: (1) Advance scientific understanding and predictive capability through development and comparison between state-of-the art computational models and enhanced measurements using targeted parametric scans; (2) Develop and validate key divertor design concepts and codes through innovative variations in physical structure and magnetic geometry; (3) Assess candidate materials, determining the implications for core plasma operation and control, and develop mitigation techniques for any deleterious effects, incorporating development of plasma-material interaction models. These efforts will lead to design, installation, and evaluation of an advanced divertor for DIII-D to enable highly dissipative divertor operation at core density (n e/n GW), neutral fueling and impurity influx most compatible with high performance plasma scenarios and reactor relevant plasma facing components (PFCs). This paper highlights the current progress and near-term strategies of boundary/PMI research on DIII-D.

  2. Developing and validating advanced divertor solutions on DIII-D for next-step fusion devices

    DOE PAGES

    Guo, H. Y.; Hill, D. N.; Leonard, A. W.; ...

    2016-09-14

    A major challenge facing the design and operation of next-step high-power steady-state fusion devices is to develop a viable divertor solution with order-of-magnitude increases in power handling capability relative to present experience, while having acceptable divertor target plate erosion and being compatible with maintaining good core plasma confinement. A new initiative has been launched on DIII-D to develop the scientific basis for design, installation, and operation of an advanced divertor to evaluate boundary plasma solutions applicable to next step fusion experiments beyond ITER. Developing the scientific basis for fusion reactor divertor solutions must necessarily follow three lines of research, whichmore » we plan to pursue in DIII-D: (1) Advance scientific understanding and predictive capability through development and comparison between state-of-the art computational models and enhanced measurements using targeted parametric scans; (2) Develop and validate key divertor design concepts and codes through innovative variations in physical structure and magnetic geometry; (3) Assess candidate materials, determining the implications for core plasma operation and control, and develop mitigation techniques for any deleterious effects, incorporating development of plasma-material interaction models. These efforts will lead to design, installation, and evaluation of an advanced divertor for DIII-D to enable highly dissipative divertor operation at core density (n e/n GW), neutral fueling and impurity influx most compatible with high performance plasma scenarios and reactor relevant plasma facing components (PFCs). In conclusion, this paper highlights the current progress and near-term strategies of boundary/PMI research on DIII-D.« less

  3. Beam shaping applications in laser micromachining for the microelectronics industry

    NASA Astrophysics Data System (ADS)

    Dunsky, Corey M.

    2001-10-01

    Laser micromachining has been a part of the manufacturing process for semiconductors and microelectronics devices for several decades. More recent applications such as the drilling of microvia holes in high-density electronic packages have recently entered broad industrial use for high-volume production. In such applications, process stability and throughput are key drivers of commercial success. Particularly in the UV, where solid-state laser power is growing rapidly but is still limited to less than 10 watts, innovations that permit the available laser power to be applied at the work surface more efficiently are of interest. Within the last two years, the use of beam shapers to create round laser spots with near-uniform irradiance at the work surface has been demonstrated. Shaping the irradiance profile has been shown to both increase process speed and improve the quality of the drilled holes, which range in diameter between 20 and 150 micrometers . This paper gives an historical overview of laser via drilling, presents the Gaussian-to-flattop beam shaping optics used in the microvia laser drills, and discusses the process results obtained.

  4. Cold-Cathodes for Sensors and Vacuum Microelectronics

    SciTech Connect

    Siegal, M.P.; Sullivan, J.P.; Tallant, D.R.; Simpson, R.L.; DiNardo, N.J.; Mercer, T.W.; Martinez-Miranda, L.J.

    1998-05-01

    The aim of this laboratory-directed research and development project was to study amorphous carbon (a-C) thin films for eventual cold-cathode electron emitter applications. The development of robust, cold-cathode emitters are likely to have significant implications for modern technology and possibly launch a new industry: vacuum micro-electronics (VME). The potential impact of VME on Sandia`s National Security missions, such as defense against military threats and economic challenges, is profound. VME enables new microsensors and intrinsically radiation-hard electronics compatible with MOSFET and IMEM technologies. Furthermore, VME is expected to result in a breakthrough technology for the development of high-visibility, low-power flat-panel displays. This work covers four important research areas. First, the authors studied the nature of the C-C bonding structures within these a-C thin films. Second, they determined the changes in the film structures resulting from thermal annealing to simulate the effects of device processing on a-C properties. Third, they performed detailed electrical transport measurements as a function of annealing temperature to correlate changes in transport properties with structural changes and to propose a model for transport in these a-C materials with implications on the nature of electron emission. Finally, they used scanning atom probes to determine important aspects on the nature of emission in a-C.

  5. Crosslinking of polynorbornene based dielectrics for application in microelectronics

    NASA Astrophysics Data System (ADS)

    Chiniwalla, Punit Paresh

    2001-07-01

    The miniaturization of microelectronic devices and the need for higher computing speeds has created a demand for low dielectric constant materials. In this study, two functionalized polynorbornene copolymers are being investigated for this purpose: butyl norbornene/triethoxysilane norbornene and decyl norbornene/epoxide norbornene. Although polynorbornenes inherently possess properties that are attractive for microelectronics packaging, films of these polymers are not solvent resistant. The work presented in this study incorporates reactive additives into the polymer matrix to promote crosslinking reactions. The results of this study have shown that solvent resistant films are attainable in for both systems studied. Two distinct reactions have been identified to occur during the cure of butyl norbornene/triethoxysilane norbornene systems with azide additives: azide crosslinking and silane crosslinking. Although both of these mechanisms result in the formation of a crosslinked polymer film, silane crosslinking was found to undesirably alter the dielectric and mechanical properties of the film. The results of a cure study indicate that cure atmosphere and temperature are critical parameters to determine which of these two reactions will control the final properties of the cured film. Two reactions were also identified during the cure reaction of decyl norbornene/epoxide norbornene with cationic initiators: epoxide crosslinking and epoxide decomposition. Epoxide decomposition occurs at temperatures greater than 160°C and results in the complete loss of crosslinkable epoxide groups. Although both of these reactions have independent mechanisms, both reactions directly affect the level of crosslinking. As such, the final mechanical properties of decyl norbornene/epoxide norbornene films were determined to be strongly dependant on the extent of both epoxide crosslinking and decomposition reactions. Finally, solvent swelling effects during the fabrication of a multilayer

  6. 76 FR 71982 - Advancing Regulatory Science for Highly Multiplexed Microbiology/Medical Countermeasure Devices...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-11-21

    ... Microbiology/ Medical Countermeasure Devices; Public Meeting; Reopening of Comment Period AGENCY: Food and Drug... Regulatory Science for Highly Multiplexed Microbiology/ Medical Countermeasure Devices'' that published in... highly multiplexed microbiology/medical countermeasure (MCM) devices, their clinical application...

  7. Center for Space Microelectronics Technology 1988-1989 technical report

    NASA Technical Reports Server (NTRS)

    Olsen, Peggy

    1990-01-01

    The 1988 to 1989 Technical Report of the JPL Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the center. Listed are 321 publications, 282 presentations, and 140 new technology reports and patents.

  8. The International Implications of the Development of Microelectronics.

    ERIC Educational Resources Information Center

    Sieghart, Paul

    1981-01-01

    Synthesizes issues covered at a conference on microelectronics: production, productivity, and employment; social implications; market mechanisms v government intervention; the role of national governments; data protection laws; and cultural pollution. (SW)

  9. Military requirements for microelectronics: View from the field

    NASA Technical Reports Server (NTRS)

    Residori, L. B.

    1977-01-01

    During the past decade, the field of military application of microelectronics has grown by leaps and bounds. Costs to develop these systems have taken on a primary role in technology as opposed to previous emphasis on innovative designs. The future of microelectronics is investigated in regard to the military developer who must insure that a system is developed which can be operated and maintained in an economical manner in a field environment.

  10. Characterization of a linear device developed for research on advanced plasma imaging and dynamics.

    PubMed

    Chung, J; Lee, K D; Seo, D C; Nam, Y U; Choi, M C

    2010-10-01

    Within the scope of long term research on imaging diagnostics for steady-state plasmas and understanding of edge plasma physics through diagnostics with conventional spectroscopic methods, we have constructed a linear electron cyclotron resonance (ECR) plasma device named Research on Advanced Plasma Imaging and Dynamics (RAPID). It has a variety of axial magnetic field profiles provided by eight water-cooled magnetic coils and two dc power supplies. The positions of the magnetic coils are freely adjustable along the axial direction and the power supplies can be operated with many combinations of electrical wiring to the coils. Here, a 6 kW 2.45 GHz magnetron is used to produce steady-state hydrogen, helium, and argon plasmas with central magnetic fields of 875 and/or 437.5 G (second harmonic). In order to achieve the highest possible plasma performance within the limited input parameters, wall conditioning experiments were carried out. Chamber bake-out was achieved with heating coils that were wound covering the vessel, and long-pulse electron cyclotron heating discharge cleaning was also followed after 4 days of bake-out. A uniform bake-out temperature (150 °C) was achieved by wrapping the vessel in high temperature thermal insulation textile and by controlling the heating coil current using a digital control system. The partial pressure changes were observed using a residual gas analyzer, and a total system pressure of 5×10(-8) Torr was finally reached. Diagnostic systems including a millimeter-wave interferometer, a high resolution survey spectrometer, a Langmuir probe, and an ultrasoft x-ray detector were used to provide the evidence that the plasma performance was improved as we desired. In this work, we present characterization of the RAPID device for various system conditions and configurations.

  11. Characterization of a linear device developed for research on advanced plasma imaging and dynamics

    SciTech Connect

    Chung, J.; Lee, K. D.; Seo, D. C.; Nam, Y. U.; Choi, M. C.

    2010-10-15

    Within the scope of long term research on imaging diagnostics for steady-state plasmas and understanding of edge plasma physics through diagnostics with conventional spectroscopic methods, we have constructed a linear electron cyclotron resonance (ECR) plasma device named Research on Advanced Plasma Imaging and Dynamics (RAPID). It has a variety of axial magnetic field profiles provided by eight water-cooled magnetic coils and two dc power supplies. The positions of the magnetic coils are freely adjustable along the axial direction and the power supplies can be operated with many combinations of electrical wiring to the coils. Here, a 6 kW 2.45 GHz magnetron is used to produce steady-state hydrogen, helium, and argon plasmas with central magnetic fields of 875 and/or 437.5 G (second harmonic). In order to achieve the highest possible plasma performance within the limited input parameters, wall conditioning experiments were carried out. Chamber bake-out was achieved with heating coils that were wound covering the vessel, and long-pulse electron cyclotron heating discharge cleaning was also followed after 4 days of bake-out. A uniform bake-out temperature (150 deg. C) was achieved by wrapping the vessel in high temperature thermal insulation textile and by controlling the heating coil current using a digital control system. The partial pressure changes were observed using a residual gas analyzer, and a total system pressure of 5x10{sup -8} Torr was finally reached. Diagnostic systems including a millimeter-wave interferometer, a high resolution survey spectrometer, a Langmuir probe, and an ultrasoft x-ray detector were used to provide the evidence that the plasma performance was improved as we desired. In this work, we present characterization of the RAPID device for various system conditions and configurations.

  12. A microtomography beamline at the Louisiana State University Center for Advanced Microstructures and Devices synchrotron

    NASA Astrophysics Data System (ADS)

    Ham, Kyungmin; Jin, Hua; Butler, Leslie G.; Kurtz, Richard L.

    2002-03-01

    A microtomography beamline has been recently assembled and is currently operating at the Louisiana State University's Center for Advanced Microstructures and Devices synchrotron (CAMD). It has been installed on a bending magnet white-light beamline at port 7A. With the storage ring operating at 1.5 GeV, this beamline has a maximum usable x-ray energy of ˜15 keV. The instrumentation consists of computer-controlled positioning stages for alignment and rotation, a CsI(Tl) phosphor screen, a reflecting mirror, a microscope objective (1:1, 1:4), and Linux/LabVIEW-controlled charge coupled device. With the 1:4 objective, the maximum spatial resolution is 2.25 μm. The positioning and image acquisition computers communicate via transfer control protocol/internet protocol (TCP/IP). A small G4/Linux cluster has been installed for the purpose of on-site reconstruction. Instrument, alignment and reconstruction programs are written in MATLAB, IDL, and C. The applications to date are many and we present several examples. Several biological samples have been studied as part of an effort on biological visualization and computation. Future improvements to this microtomography station include the addition of a double-multilayer monochromator, allowing one to evaluate the three-dimensional elemental composition of materials. Plans also include eventual installation at the CAMD 7 T wiggler beamline, providing x rays in excess of 50 keV to provide better penetration of higher mass-density materials.

  13. [Modern hearing-aids at the cutting edge of microelectronics. Increased possibilities for individual customization].

    PubMed

    Arlinger, S

    1999-08-25

    The development of modern hearing aids has been so great that they now represent the cutting edge of micro-electronics. Flexibility has been enhanced by computer-aided programming of the devices, and particularly by digital signal processing, developments which enable improved customization. Increased knowledge of the pathophysiology of the auditory system, fundamental processes in central auditory pathways, and cognitive function enable technological developments to be exploited, thus enhancing our ability to cope with an increasingly broad spectrum of hearing impairment, ranging from mild high-frequency loss to severe loss across the entire frequency range.

  14. Instrumentation for synchrotron based micromachining at the Center for Advanced Microstructures and Devices (abstract)

    NASA Astrophysics Data System (ADS)

    Aigeldinger, G.; Goettert, J.; Desta, Y.; Ling, Z. L.; Rupp, L.

    2002-03-01

    The J. Bennett Johnston Sr., Center for Advanced Microstructures and Devices (CAMD) is a synchrotron radiation facility owned by Louisiana State University and operated with financial support from the State of Louisiana (for information how to submit a project proposal go to: http://www.camd.lsu.edu). The centerpiece of CAMD is a 1.3-1.5 GeV electron storage ring. CAMD supports a strong program in x-ray lithography micromachining (XRLM) or LIGA. A total of four beamlines equipped with different scanners is available for exposures. A 2.500 sq. ft class 100 clean room provides basic processing capability for MEMS including optical lithography, thin film deposition, electroplating, and metrology. Three micromachining beamlines are connected to bending magnets. All beamlines are "white light" beamlines, terminated with a beryllium window. The typical source point to scanner distance is 10 m and the horizontal acceptance ranges from 6.5 to 10 mrad. A number of low Z filters can be inserted into the beam adapting the exposure spectrum to the resist thickness. Two beamlines are equipped with commercial scanners from Jenoptik GmbH (for details see Jenoptik's webpage at www.jo-mikrotechnik.com/) and one beamline with a "vacuum" scanner designed in house. The latest model of Jenoptik's DEX02 scanner has been installed at CAMD's XRLM1 beamline in December 2000 and allows advanced exposures using overlay as well as tilt and rotate functions. In addition to these beamlines CAMD has installed a "white light" beamline at its 7 T wiggler source. Preliminary exposure tests in ultrathick samples (1 mm and thicker) have been conducted using an "air scanner." Currently this beamline is dismantled and will be reinstalled together with a PX beamline. In the article further details of the beamlines and scanners as well as some examples of applications of LIGA microstructures fabricated at CAMD will be discussed.

  15. Return on Investment and Technology-Based Training--An Introduction and a Case Study at Advanced Micro Devices.

    ERIC Educational Resources Information Center

    Masumian, Bijan

    1999-01-01

    Summarizes findings from studies comparing classroom and technology-based approaches to training and the respective Return on Investment (ROI) data. Highlights several advantages of technology-based training. Offers information and initial ROI numbers on the use of technology-based training at Advanced Micro Devices, a global manufacturer of…

  16. Teaching Advanced Operation of an iPod-Based Speech-Generating Device to Two Students with Autism Spectrum Disorders

    ERIC Educational Resources Information Center

    Achmadi, Donna; Kagohara, Debora M.; van der Meer, Larah; O'Reilly, Mark F.; Lancioni, Giulio E.; Sutherland, Dean; Lang, Russell; Marschik, Peter B.; Green, Vanessa A.; Sigafoos, Jeff

    2012-01-01

    We evaluated a program for teaching two adolescents with autism spectrum disorders (ASD) to perform more advanced operations on an iPod-based speech-generating device (SGD). The effects of the teaching program were evaluated in a multiprobe multiple baseline across participants design that included two intervention phases. The first intervention…

  17. Army Instructors’ Use of Mobile Devices in the Infantry Advanced Leaders Course

    DTIC Science & Technology

    2014-08-01

    mobile devices in the classroom . 15. SUBJECT TERMS Training, Mobile Devices, Army Training, Adaptive Training, Blended Learning...either in a classroom or in a field location. This project explored the use of mobile devices to assist instructors as their role moves from... classroom technology infrastructure. Overall, instructors saw some promise for the future potential of tablet devices for instructor use, but encountered

  18. High Dielectric Constant Oxides for Advanced Micro-Electronic Applications

    DTIC Science & Technology

    2006-11-29

    having an appropriately larger dielectric constant, other physical considerations come into play: a) the material must be thermodynamically stable...substrate bias. 7 The primary activity outside the domain of deposition involved extensive characterization of the physical and electrical properties of...from Si. Interacts with Si when recrystallizing to form silicide and SiO2. LaAlO3 expected ε ~ 29 in crystalline phase but much lower in amorphous

  19. Advanced microelectronics research for space applications, phase 2

    NASA Technical Reports Server (NTRS)

    Gaertner, W. W.

    1971-01-01

    Negative-resistance circuits with possible space flight applications are discussed. The basic design approach is to use impedance rotation, i.e., the conversion from capacitance to negative resistance, and from resistance to inductance by the phase shift of the transistor current gain at high frequencies. The subjects discussed in detail are the following: hybrid fabrication of VHF and UHF negative-resistance stages with lumped passive elements; formulation of measurement techniques to characterize transistors and to extend the frequency of negative-resistance transistor amplifiers to higher microwave frequencies; and derivation of transistor characteristics required to increase the frequency range of negative-resistance transistor stages.

  20. III-Nitride advanced technologies and equipment for microelectronics

    NASA Astrophysics Data System (ADS)

    Petrov, S. I.; Alexeev, A. N.; Mamaev, V. V.; Krasovitsky, D. M.; Chaly, V. P.

    2016-12-01

    Using of complex equipment SemiTEq shown in example of a closed cycle of basic technological operations for production of high-power field microwave transistors based on gallium nitride in the "Svetlana-Rost" JSC. Basic technological operations are shown: MBE growth of heterostructures, metal deposition of contacts using electron-beam evaporation system, thermal annealing of ohmic contacts, meza-isolation plasma-chemical etching and dielectric plasma deposition. The main problems during the technological route as well as ways to solve are discussed. In particular, ways to reduce the dislocation density in the active region of the transistor heterostructures grown on the mismatched substrates are described in detail. Special attention given to the homogeneity and reproducibility both after some manufacturing operations and applied to the end product.

  1. Health hazards in the microelectronics industry.

    PubMed

    Geiser, K

    1986-01-01

    The microelectronics industry is explored as a source of occupational health hazards resulting from the extensive use of toxic chemicals in the production of semiconductor chips and the assembly of electronic components. Information is provided on the range of chemicals used in the industry and their particular health implications. Case materials are drawn from Massachusetts' "Route 128" region and California's "Silicon Valley." Problems with worker exposure in the plants are compared with the risks experienced by residents of local neighborhoods from the leakage of industrial chemicals from underground storage tanks into the local groundwater used for drinking water. The recent development of the industry, its highly innovative character, the absence of unions and organizations for worker protection, and the persistence of a public perception that the industry is relatively safe and clean, are all identified as determinants of the extent of health hazards posed by chemical exposure. The paper concludes with recommendations for further studies, worker organization, and increased attention to the reduction of the volume and toxicity of chemicals in industrial production.

  2. Use of COTS microelectronics in radiation environments

    SciTech Connect

    Winokur, P.S.; Lum, G.K.; Shaneyfelt, M.R.; Sexton, F.W.; Hash, G.L.; Scott, L.

    1999-12-01

    This paper addresses key issues for the cost-effective use of COTS (Commercially available Off The Shelf) microelectronics in radiation environments that enable circuit or system designers to manage risks and ensure mission success. They review several factors and tradeoffs affecting the successful application of COTS parts including (1) hardness assurance and qualification issues, (2) system hardening techniques, and (3) life-cycle costs. The paper also describes several experimental studies that address trends in total-dose, transient, and single-event radiation hardness as COTS technology scales to smaller feature sizes. As an example, the level at which dose-rate upset occurs in Samsung SRAMs increases from 1.4 x 10{sup 8} rad(Si)/s for a 256K SRAM to 7.7 x 10{sup 9} rad(Si)/s for a 4M SRAM, indicating unintentional hardening improvements in the design of process of a commercial technology. Additional experiments were performed to quantify variations in radiation hardness for COTS parts. In one study, only small (10--15%) variations were found in the dose-rate upset and latchup thresholds for Samsung 4M SRAMs from three different date codes. In another study, irradiations of 4M SRAMs from Samsung, Hitachi, and Toshiba indicate large differences in total-dose radiation hardness. The paper attempts to carefully define terms and clear up misunderstandings about the definitions of COTS and radiation-hardened (RH) technology.

  3. Advanced in-situ electron-beam lithography for deterministic nanophotonic device processing

    SciTech Connect

    Kaganskiy, Arsenty; Gschrey, Manuel; Schlehahn, Alexander; Schmidt, Ronny; Schulze, Jan-Hindrik; Heindel, Tobias; Rodt, Sven Reitzenstein, Stephan; Strittmatter, André

    2015-07-15

    We report on an advanced in-situ electron-beam lithography technique based on high-resolution cathodoluminescence (CL) spectroscopy at low temperatures. The technique has been developed for the deterministic fabrication and quantitative evaluation of nanophotonic structures. It is of particular interest for the realization and optimization of non-classical light sources which require the pre-selection of single quantum dots (QDs) with very specific emission features. The two-step electron-beam lithography process comprises (a) the detailed optical study and selection of target QDs by means of CL-spectroscopy and (b) the precise retrieval of the locations and integration of target QDs into lithographically defined nanostructures. Our technology platform allows for a detailed pre-process determination of important optical and quantum optical properties of the QDs, such as the emission energies of excitonic complexes, the excitonic fine-structure splitting, the carrier dynamics, and the quantum nature of emission. In addition, it enables a direct and precise comparison of the optical properties of a single QD before and after integration which is very beneficial for the quantitative evaluation of cavity-enhanced quantum devices.

  4. Efficient Multi-Dimensional Simulation of Quantum Confinement Effects in Advanced MOS Devices

    NASA Technical Reports Server (NTRS)

    Biegel, Bryan A.; Ancona, Mario G.; Rafferty, Conor S.; Yu, Zhiping

    2000-01-01

    We investigate the density-gradient (DG) transport model for efficient multi-dimensional simulation of quantum confinement effects in advanced MOS devices. The formulation of the DG model is described as a quantum correction ot the classical drift-diffusion model. Quantum confinement effects are shown to be significant in sub-100nm MOSFETs. In thin-oxide MOS capacitors, quantum effects may reduce gate capacitance by 25% or more. As a result, the inclusion of quantum effects may reduce gate capacitance by 25% or more. As a result, the inclusion of quantum effects in simulations dramatically improves the match between C-V simulations and measurements for oxide thickness down to 2 nm. Significant quantum corrections also occur in the I-V characteristics of short-channel (30 to 100 nm) n-MOSFETs, with current drive reduced by up to 70%. This effect is shown to result from reduced inversion charge due to quantum confinement of electrons in the channel. Also, subthreshold slope is degraded by 15 to 20 mV/decade with the inclusion of quantum effects via the density-gradient model, and short channel effects (in particular, drain-induced barrier lowering) are noticeably increased.

  5. Efficient Multi-Dimensional Simulation of Quantum Confinement Effects in Advanced MOS Devices

    NASA Technical Reports Server (NTRS)

    Biegel, Bryan A.; Rafferty, Conor S.; Ancona, Mario G.; Yu, Zhi-Ping

    2000-01-01

    We investigate the density-gradient (DG) transport model for efficient multi-dimensional simulation of quantum confinement effects in advanced MOS devices. The formulation of the DG model is described as a quantum correction to the classical drift-diffusion model. Quantum confinement effects are shown to be significant in sub-100nm MOSFETs. In thin-oxide MOS capacitors, quantum effects may reduce gate capacitance by 25% or more. As a result, the inclusion or quantum effects in simulations dramatically improves the match between C-V simulations and measurements for oxide thickness down to 2 nm. Significant quantum corrections also occur in the I-V characteristics of short-channel (30 to 100 nm) n-MOSFETs, with current drive reduced by up to 70%. This effect is shown to result from reduced inversion charge due to quantum confinement of electrons in the channel. Also, subthreshold slope is degraded by 15 to 20 mV/decade with the inclusion of quantum effects via the density-gradient model, and short channel effects (in particular, drain-induced barrier lowering) are noticeably increased.

  6. [Treatment of advanced heart failure in women: heart transplantation and ventricular assist devices].

    PubMed

    Cipriani, Manlio; Macera, Francesca; Verde, Alessandro; Bruschi, Giuseppe; del Medico, Marta; Oliva, Fabrizio; Martinelli, Luigi; Frigerio, Maria

    2012-05-01

    Women candidates for heart transplantation are definitely less than men, just 20% of all patients transplanted; even in the INTERMACS registry they represent only 21% of all ventricular assist devices (VAD) implanted. The reasons for this big difference are discussed in this article. Why women are less frequently assessed for unconventional therapies? Are they sicker or just less regarded? Our experience and the literature show us clear epidemiological, clinical and treatment differences that could lead to a lower prevalence of end-stage disease in women of an age suitable for unconventional therapies. Once on the transplant list, women wait less than men for a heart transplant, because they present with more severe disease, have a lower body mass index and undergo less VAD implants. After transplantation women's survival is comparable to men's, although they usually complain of a lower quality of life. Females receive less often a VAD than men. The main reasons for this include presentation with advanced heart failure at an older age than men, worse outcomes related to small body surface area, and lower survival rates on VAD when implanted as bridge to heart transplantation.

  7. Advanced Aerodynamic Devices to Improve the Performance, Economics, Handling, and Safety of Heavy Vehicles

    SciTech Connect

    Robert J. Englar

    2001-05-14

    Research is being conducted at the Georgia Tech Research Institute (GTRI) to develop advanced aerodynamic devices to improve the performance, economics, stability, handling and safety of operation of Heavy Vehicles by using previously-developed and flight-tested pneumatic (blown) aircraft technology. Recent wind-tunnel investigations of a generic Heavy Vehicle model with blowing slots on both the leading and trailing edges of the trailer have been conducted under contract to the DOE Office of Heavy Vehicle Technologies. These experimental results show overall aerodynamic drag reductions on the Pneumatic Heavy Vehicle of 50% using only 1 psig blowing pressure in the plenums, and over 80% drag reductions if additional blowing air were available. Additionally, an increase in drag force for braking was confirmed by blowing different slots. Lift coefficient was increased for rolling resistance reduction by blowing only the top slot, while downforce was produced for traction increase by blowing only the bottom. Also, side force and yawing moment were generated on either side of the vehicle, and directional stability was restored by blowing the appropriate side slot. These experimental results and the predicted full-scale payoffs are presented in this paper, as is a discussion of additional applications to conventional commercial autos, buses, motor homes, and Sport Utility Vehicles.

  8. Advanced in-situ electron-beam lithography for deterministic nanophotonic device processing

    NASA Astrophysics Data System (ADS)

    Kaganskiy, Arsenty; Gschrey, Manuel; Schlehahn, Alexander; Schmidt, Ronny; Schulze, Jan-Hindrik; Heindel, Tobias; Strittmatter, André; Rodt, Sven; Reitzenstein, Stephan

    2015-07-01

    We report on an advanced in-situ electron-beam lithography technique based on high-resolution cathodoluminescence (CL) spectroscopy at low temperatures. The technique has been developed for the deterministic fabrication and quantitative evaluation of nanophotonic structures. It is of particular interest for the realization and optimization of non-classical light sources which require the pre-selection of single quantum dots (QDs) with very specific emission features. The two-step electron-beam lithography process comprises (a) the detailed optical study and selection of target QDs by means of CL-spectroscopy and (b) the precise retrieval of the locations and integration of target QDs into lithographically defined nanostructures. Our technology platform allows for a detailed pre-process determination of important optical and quantum optical properties of the QDs, such as the emission energies of excitonic complexes, the excitonic fine-structure splitting, the carrier dynamics, and the quantum nature of emission. In addition, it enables a direct and precise comparison of the optical properties of a single QD before and after integration which is very beneficial for the quantitative evaluation of cavity-enhanced quantum devices.

  9. Proceedings of the Goddard Space Flight Center Workshop on Robotics for Commercial Microelectronic Processes in Space

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Potential applications of robots for cost effective commercial microelectronic processes in space were studied and the associated robotic requirements were defined. Potential space application areas include advanced materials processing, bulk crystal growth, and epitaxial thin film growth and related processes. All possible automation of these processes was considered, along with energy and environmental requirements. Aspects of robot capabilities considered include system intelligence, ROM requirements, kinematic and dynamic specifications, sensor design and configuration, flexibility and maintainability. Support elements discussed included facilities, logistics, ground support, launch and recovery, and management systems.

  10. Molten-Metal Droplet Deposition on a Moving Substrate in Microgravity: Aiding the Development of Novel Technologies for Microelectronic Assembly

    NASA Technical Reports Server (NTRS)

    Megaridis, C. M.; Bayer, I. S.; Poulikakos, D.; Nayagam, V.

    2002-01-01

    Driven by advancements in microelectronics manufacturing, this research investigates the oblique (non-axisymmetric) impact of liquid-metal droplets on flat substrates. The problem of interest is relevant to the development of the novel technology of on-demand dispension (printing) of microscopic solder deposits for the surface mounting of microelectronic devices. The technology, known as solder jetting, features on-demand deposition of miniature solder droplets (30 to 120 microns in diameter) in very fine, very accurate patterns using techniques analogous to those developed for the ink-jet printing industry. Despite its promise, severe limitations exist currently with regards to the throughput rates of the technology; some of these limitations are largely due to the lack of the capability for reliable prediction of solder bump positioning and shapes, especially under ballistic deposition conditions where the droplet impact phenomena are inherently three-dimensional. The study consists of a theoretical and an experimental component. The theoretical work uses a finite element formulation to simulate numerically the non-axisymmetric (3-D) fluid mechanics and heat transfer phenomena of a liquid solder droplet impacting at an angle alpha on a flat substrate. The work focuses on the pre-solidification regime. The modeling of the most challenging fluid mechanics part of the process has been completed successfully. It is based upon the full laminar Navier-Stokes equations employing a Lagrangian frame of reference. Due to the large droplet deformation, the surface (skin) as well as the volumetric mesh have to be regenerated during the calculations in order to maintain the high accuracy of the numerical scheme. The pressure and velocity fields are then interpolated on the newly created mesh. The numerical predictions are being tested against experiments, for cases where wetting phenomena are not important. For the impact parameters used in the example shown (We = 2.38, Fr

  11. Long Term Therapeutic Efficacy of a Soft Monobloc Mandibular Advancement Device in Adults with Obstructive Sleep Apnea

    PubMed Central

    Ballanti, Fabiana; Ranieri, Salvatore; Cozza, Paola

    2015-01-01

    Aim. To evaluate the long term (48 months) therapeutic efficacy of a soft monobloc mandibular advancement device in adult patients with mild or moderate obstructive sleep apnea. Methods. The study population comprised 28 patients (6 female and 22 male, mean age 52.2 ± 6.8 years) affected by obstructive sleep apnea. After a baseline medical and somnographic examination, a functional examination of the stomatognathic system, and a questionnaire focused on sleep-related qualities and a daytime somnolence, each patient received an individual device. Two follow-ups were made 6 months (T1) and 48 months (T2) after soft monobloc mandibular advancement device treatment had been initiated, and all initial examinations were repeated. Results. The statistical analysis showed a significant decrease in body mass index value between T1 and T2 (ρ = 0,012), an increase of Epworth sleepiness scale value between T1 and T2 (ρ = 0,012), and a significant improvement and decrease of apnea/hypopnea index between T0 and T1 (ρ = 0,010) and between T0 and T2 (ρ = 0,013). Conclusion. Treatment with the soft monobloc mandibular advancement device is a therapeutic solution with long term and stable effects (48 months) for patients suffering from mild or moderate obstructive sleep apnea. PMID:25642453

  12. Large-area nanofabrication and applications in advanced nanoelectronic and nanophotonic devices

    NASA Astrophysics Data System (ADS)

    Ding, Wei

    The research work presented in this dissertation includes novel large area nanofabrication techniques and their applications in advanced nanoelectronic and nanophotonic devices. The fabrications and applications include: 1) high performance transparent electrodes, 2) a novel plasmonic nanocavity and its applications in organic solar cells and light emitting diodes, and 3) a bipolar plasmonic nonlinear optical device to enhance and tune second harmonic generation. Based upon these topics, the thesis is divided into the following parts. First, a novel transparent electrode (TE), metallic deep subwavelength mesh electrode is developed and fabricated, showing better transmittance and conductance than previous TEs. Its performance dependence on nanostructure geometries and materials are investigated. The deep-subwavelength mesh electrode also has excellent antiglare properties. Such electrodes are fabricated on 4" wafer by nanoimprint, scalable to meter sizes. Second, a novel plasmonic nanocavity from the MESH is developed, named "plasmonic cavity with subwavelength hole-array (PlaCSH)", consisting of a thin MESH as a transparent front electrode, a thin metal back electrode, and in-between layer of active material. This structure is used to create high performance solar cells and LEDs. PlaCSH solar cell gives a solution to three central challenges in organic solar cells (light coupling into solar cell, light trapping in a sub-absorption-length-thick layer, and replacement of the indium-tin-oxide). Experimentally, the PlaCSH polymer SCs achieve high light coupling-efficiency/absorptance/power conversion efficiency, along with broad-band, Omni angle/polarization acceptance. In OLEDs, PlaCSH shows numerous benefits with both the small- molecule and polymer active materials. Enhanced light extraction, internal quantum efficiency, ambient light absorption, contrast, viewing angle, brightness, and decreased glare are all observed. The above experiments -- along with

  13. Automated hotspot analysis with aerial image CD metrology for advanced logic devices

    NASA Astrophysics Data System (ADS)

    Buttgereit, Ute; Trautzsch, Thomas; Kim, Min-ho; Seo, Jung-Uk; Yoon, Young-Keun; Han, Hak-Seung; Chung, Dong Hoon; Jeon, Chan-Uk; Meyers, Gary

    2014-09-01

    Continuously shrinking designs by further extension of 193nm technology lead to a much higher probability of hotspots especially for the manufacturing of advanced logic devices. The CD of these potential hotspots needs to be precisely controlled and measured on the mask. On top of that, the feature complexity increases due to high OPC load in the logic mask design which is an additional challenge for CD metrology. Therefore the hotspot measurements have been performed on WLCD from ZEISS, which provides the benefit of reduced complexity by measuring the CD in the aerial image and qualifying the printing relevant CD. This is especially of advantage for complex 2D feature measurements. Additionally, the data preparation for CD measurement becomes more critical due to the larger amount of CD measurements and the increasing feature diversity. For the data preparation this means to identify these hotspots and mark them automatically with the correct marker required to make the feature specific CD measurement successful. Currently available methods can address generic pattern but cannot deal with the pattern diversity of the hotspots. The paper will explore a method how to overcome those limitations and to enhance the time-to-result in the marking process dramatically. For the marking process the Synopsys WLCD Output Module was utilized, which is an interface between the CATS mask data prep software and the WLCD metrology tool. It translates the CATS marking directly into an executable WLCD measurement job including CD analysis. The paper will describe the utilized method and flow for the hotspot measurement. Additionally, the achieved results on hotspot measurements utilizing this method will be presented.

  14. Therapeutic outcomes of mandibular advancement devices as an initial treatment modality for obstructive sleep apnea

    PubMed Central

    Park, Pona; Jeon, Hyoung Won; Han, Doo Hee; Won, Tae-Bin; Kim, Dong-Young; Rhee, Chae-Seo; Kim, Hyun Jik

    2016-01-01

    Abstract Although continuous positive airway pressure (CPAP) is a highly efficacious treatment for obstructive sleep apnea (OSA), there is a need for alternative treatment options, such as sleep surgeries and mandibular advancement devices (MADs), to overcome the limitations of CPAP. This study aimed to analyze the therapeutic outcomes of OSA subjects who were treated with a MAD, and to estimate the clinical impact of MAD as a first-line treatment for OSA. Forty-seven patients diagnosed with OSA received an adjustable MAD as an initial treatment. Drug-induced sleep endoscopic findings and sleep parameters (both pre-MAD and post-MAD treatment), such as apnea index, oxygen saturation, and degree of daytime sleepiness, were assessed retrospectively. The MAD treatment resulted in a significant reduction in apnea–hypopnea index, and also a significant elevation in lowest oxygen saturation. Satisfactory results of MAD treatment as a first treatment modality were observed in 27 patients, and a successful outcome was reached in approximately 72% of patients. The OSA patients who had lower body mass index and upper airway narrowing at the level of palate and tongue base showed relatively higher rates of a satisfactory outcome even in cases of moderate or severe OSA. These results suggest that the use of a MAD may be an alternative treatment option in OSA patients with retropalatal and retroglossal area narrowing regardless of disease severity. Additionally, MADs can be recommended as an initial treatment modality, and the effectiveness of MADs in achieving success may not be inferior to CPAP. PMID:27861349

  15. Isotropic copper-invar alloys for microelectronics packaging

    NASA Astrophysics Data System (ADS)

    Cottle, Rand Duprez

    The recent trend in microelectronics packaging toward surface mounted devices (SMD) has created a need for new types of materials that possess low thermal expansion and high electrical and thermal conductivity. Laminates that combine the high thermal and electrical conductivity of copper with the low thermal expansion of Invar, know as CuInvarCu or CIC, are widely use as core constraining materials in printed wire boards where SMDs are to be employed. CIC is highly anisotropic, and there are potential problems resulting from its anisotropy. An isotropic CuInvar alloy would be of great interest for a variety of applications. In suitable Cu-Fe-Ni alloys, a copper-rich solid solution equilibrates with an Invar-rich solid solution; casting such alloys invariably produces Invar-rich dendrites in a copper-rich solid solution. Casting followed by suitable heat treatments can produce two-phase alloys that combine the properties of copper and Invar. The overall composition controls the relative fractions of Invar and copper and the resulting trade-off between low thermal expansivity and electrical conductivity. Measured thermal expansivities (CTE) of CuInvar alloys follow very closely a linear rule of mixing. Electrical conductivities of as-cast specimens are quite poor due to iron and nickel contamination. Theoretical phase diagrams indicate that nearly pure copper equilibrates with an Invar-rich phase at temperatures below, roughly, 500°C. However, equilibrium compositions have been shown to take extremely, long to form, due to the very sluggish kinetics in the system. Long-term annealing was shown to improve conductivity significantly, but much greater improvements are needed to make CuInvar viable as an electrical conductive material.

  16. ISS Squat and Deadlift Kinematics on the Advanced Resistive Exercise Device

    NASA Technical Reports Server (NTRS)

    Newby, N.; Caldwell, E.; Sibonga, J.; Ploutz-Snyder, L.

    2014-01-01

    Visual assessment of exercise form on the Advanced Resistive Exercise Device (ARED) on orbit is difficult due to the motion of the entire device on its Vibration Isolation System (VIS). The VIS allows for two degrees of device translational motion, and one degree of rotational motion. In order to minimize the forces that the VIS must damp in these planes of motion, the floor of the ARED moves as well during exercise to reduce changes in the center of mass of the system. To help trainers and other exercise personnel better assess squat and deadlift form a tool was developed that removes the VIS motion and creates a stick figure video of the exerciser. Another goal of the study was to determine whether any useful kinematic information could be obtained from just a single camera. Finally, the use of these data may aid in the interpretation of QCT hip structure data in response to ARED exercises performed in-flight. After obtaining informed consent, four International Space Station (ISS) crewmembers participated in this investigation. Exercise was videotaped using a single camera positioned to view the side of the crewmember during exercise on the ARED. One crewmember wore reflective tape on the toe, heel, ankle, knee, hip, and shoulder joints. This technique was not available for the other three crewmembers, so joint locations were assessed and digitized frame-by-frame by lab personnel. A custom Matlab program was used to assign two-dimensional coordinates to the joint locations throughout exercise. A second custom Matlab program was used to scale the data, calculate joint angles, estimate the foot center of pressure (COP), approximate normal and shear loads, and to create the VIS motion-corrected stick figure videos. Kinematics for the squat and deadlift vary considerably for the four crewmembers in this investigation. Some have very shallow knee and hip angles, and others have quite large ranges of motion at these joints. Joint angle analysis showed that crewmembers

  17. Kovar Micro Heat Pipe Substrates for Microelectronic Cooling

    SciTech Connect

    Benson, David A.; Burchett, Steven N.; Kravitz, Stanley H.; Robino, Charles V.; Schmidt, Carrie; Tigges, Chris P.

    1999-04-01

    We describe the development of a new technology for cooling microelectronics. This report documents the design, fabrication, and prototype testing of micro scale heat pipes embedded in a flat plate substrate or heat spreader. A thermal model tuned to the test results enables us to describe heat transfer in the prototype, as well as evaluate the use of this technology in other applications. The substrate walls are Kovar alloy, which has a coefficient of thermal expansion close to that of microelectronic die. The prototype designs integrating micro heat pipes with Kovar enhance thermal conductivity by more than a factor of two over that of Kovar alone, thus improving the cooling of micro-electronic die.

  18. Potential occupational health hazards in the microelectronics industry.

    PubMed

    LaDou, J

    1983-02-01

    The microelectronics industry is a major user of a wide variety of chemicals and other toxic materials. In the recent past semiconductor manufacturers have located in many countries and brought a new set of challenging clinical problems to occupational physicians. California, an area with a significant history in the statistical study of health and safety in the microelectronics industry, presents some evidence of potential health hazards in the semiconductor manufacturing process. The Semiconductor Industry Study done in California in 1981 explains the application of many toxic materials in the semiconductor manufacturing process, including a variety of solvents, acids, and metals such as arsenic. The Study documents the extensive use of dopant gases, primarily arsine, phosphine and diborane. Further study is necessary to assure the health and safety of microelectronics workers, particularly in the application of dopant gases.

  19. Affective and personality disturbances among female former microelectronics workers.

    PubMed

    Bowler, R M; Mergler, D; Rauch, S S; Harrison, R; Cone, J

    1991-01-01

    The production and manufacture of microelectronic components, carried out primarily by women workers, require extensive use of organic solvents. Affective and personality disturbances frequently have been associated with organic solvent toxicity. A group of women, former microelectronics workers (N = 70), primarily of Hispanic origin (77.1%) but raised in the United States, were evaluated for affective and personality disturbance with the MMPI. Profiles were analyzed, and diagnostic classification was performed blind. Results showed that (1) 85.7% of the profiles indicated abnormally high clinical elevations; and (2) MMPI profile classification revealed four clinical diagnostic groups: somatoform (24.3%), depression (15.7%), anxiety (28.6%), and psychotic (14.3%). These findings indicate significant psychopathology among these women, who formerly had worked in a microelectronics plant. The patterns of impairment present similarities to previous reports of organic solvent toxicity.

  20. Atomic layer deposition of oxides for microelectronics

    NASA Astrophysics Data System (ADS)

    Wang, Hongtao

    Atomic layer deposition of high-kappa oxides has gained interest due to the wide applications in microelectronics. For gate dielectric application, amorphous oxides are preferred for the structural uniformity at nanometer scale. LaxM2-xO 3 (M = Sc, Lu or Y) films were deposited by ALD with metal amidinate precursors and H2O. Both LaScO3 and LaLuO3 films are amorphous and free of interfacial layers. Besides the structural benefits, both oxides have high dielectric constants (˜23 for LaScO 3 and 28 +/- 1 for LaLuO3), low leakage current density, and very few bulk traps, and are scalable to EOT < 1 nm. La1.23Y 0.77O3 films have polycrystalline structures with moderately high kappa ˜ 17 and low leakage current. The Poole-Frenkel mechanism is verified in the ternary oxide films by studying temperature dependence of the leakage current. For La1.1Al0.9O3/Si, the thermal stability was evaluated by studying the interface structure evolution under different annealing conditions. It concludes that an interfacial layer forms at the temperature above 600°C and the oxygen source resides in the film. For DRAM application, ALD deposition of rutile phase TiO2 is developed for its 70. The substrate, SnO2 and RuO2/Ru, works as both bottom electrodes and templates for rutile TiO2 nucleation. The growth rate is ˜ 0.3 A/cycle and is regardless of phases and crystallinity. The crystallinity strongly depends on the substrates. High quality ruthenium thin films were deposited by ALD with bis( N,N'-di-tert-butylacetamidinato) ruthenium(II) dicarbonyl and O2. The film crystallinity, density, and resistivity strongly depend on the O2 exposure. As EO ≈ Emax, the films have the lowest resistivity, highest density and best crystallinity (˜10 muO·cm, ˜12.3 g/cm3 and grain size comparable to film thickness). When EO > Emax, films peel off from the substrate due to the recombinative desorption of O2. The impurities are mainly O (0.27+/-0.03at.%) and C (0.30+/-0.05at.%). The C is mostly

  1. Active microelectronic array system for DNA hybridization, genotyping and pharmacogenomic applications.

    PubMed

    Sosnowski, Ron; Heller, Michael J; Tu, Eugene; Forster, Anita H; Radtkey, Ray

    2002-12-01

    Microelectronic arrays have been developed for DNA hybridization analysis of point mutations, single nucleotide polymorphisms, short tandem repeats and gene expression. In addition to a variety of molecular biology and genomic research applications, such devices will also be used for infectious disease detection, genetic and cancer diagnostics, and pharmacogenomic applications. These microelectronic array devices are able to produce defined electric fields on their surfaces that allow charged molecules and other entities to be transported to or from any test site or micro-location on the planar surface of the device. These molecules and entities include DNA, RNA, proteins, enzymes, antibodies and cells. Electronic-based molecule addressing and hybridization can then be carried out, where the electric field is now used to greatly accelerate the hybridization reactions that occur on the selected test sites. When reversed, the electric field can be used to provide an additional parameter for improved hybridization. Special low-conductance buffers have been developed that provide for the rapid transport of the DNA molecules and facilitate the electronic hybridization reactions under conditions that do not support hybridization. Important to the device function is the permeation layer that overcoats the underlying microelectrodes. Generally composed of a porous hydrogel material impregnated with attachment chemistry, this permeation layer prevents the destruction of analytes at the active microelectrode surface, ameliorates the adverse effects of electrolysis products on the sensitive hybridization and affinity reactions, and serves as a support structure for attaching DNA probes and other molecules to the array. The microelectronic chip or array device is incorporated into a cartridge package (NanoChip trade mark cartridge) that provides the electronic, optical, and fluidic interfacing. A complete instrument system (NanoChip trade mark Molecular Biology Workstation

  2. Recent Advances in Photonic Devices for Optical Computing and the Role of Nonlinear Optics-Part II

    NASA Technical Reports Server (NTRS)

    Abdeldayem, Hossin; Frazier, Donald O.; Witherow, William K.; Banks, Curtis E.; Paley, Mark S.

    2007-01-01

    The twentieth century has been the era of semiconductor materials and electronic technology while this millennium is expected to be the age of photonic materials and all-optical technology. Optical technology has led to countless optical devices that have become indispensable in our daily lives in storage area networks, parallel processing, optical switches, all-optical data networks, holographic storage devices, and biometric devices at airports. This chapters intends to bring some awareness to the state-of-the-art of optical technologies, which have potential for optical computing and demonstrate the role of nonlinear optics in many of these components. Our intent, in this Chapter, is to present an overview of the current status of optical computing, and a brief evaluation of the recent advances and performance of the following key components necessary to build an optical computing system: all-optical logic gates, adders, optical processors, optical storage, holographic storage, optical interconnects, spatial light modulators and optical materials.

  3. Design, processing and testing of LSI arrays, hybrid microelectronics task

    NASA Technical Reports Server (NTRS)

    Himmel, R. P.; Stuhlbarg, S. M.; Ravetti, R. G.; Zulueta, P. J.; Rothrock, C. W.

    1979-01-01

    Mathematical cost models previously developed for hybrid microelectronic subsystems were refined and expanded. Rework terms related to substrate fabrication, nonrecurring developmental and manufacturing operations, and prototype production are included. Sample computer programs were written to demonstrate hybrid microelectric applications of these cost models. Computer programs were generated to calculate and analyze values for the total microelectronics costs. Large scale integrated (LST) chips utilizing tape chip carrier technology were studied. The feasibility of interconnecting arrays of LSU chips utilizing tape chip carrier and semiautomatic wire bonding technology was demonstrated.

  4. Center for Space Microelectronics Technology. 1993 Technical Report

    NASA Technical Reports Server (NTRS)

    1995-01-01

    The 1993 Technical Report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the Center during the past year. The report lists 170 publications, 193 presentations, and 84 New Technology Reports and patents. The 1993 Technical Report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the Center during the past year. The report lists 170 publications, 193 presentations, and 84 New Technology Reports and patents.

  5. Development of a container for handling, testing, and storing discrete microelectronic components

    NASA Technical Reports Server (NTRS)

    Filip, G. L.; Caruso, S. V.

    1972-01-01

    A container has been developed for handling, testing, burning-in, and storing discrete microelectronic components without removal from the protective package. The package was designed to accommodate the leadless inverted device and other carrier-mounted active devices and chip-type discrete resistors and capacitors. Before the indicated development, components were handled and tested in various ways, some of which resulted in damage or contamination. The basic design of the container utilizes precision machined printed circuit boards and chemically milled (photoetched) contact springs. Included in this design for protection is an O-ring-sealed cover. Methods of fabrication and limitations of the current hardware are presented. Current applications of and possible extensions to the technology are discussed.

  6. Local tetrahedron modeling of microelectronics using the finite-volume hybrid-grid technique

    SciTech Connect

    Riley, D.J.; Turner, C.D.

    1995-12-01

    The finite-volume hybrid-grid (FVHG) technique uses both structured and unstructured grid regions in obtaining a solution to the time-domain Maxwell`s equations. The method is based on explicit time differencing and utilizes rectilinear finite-difference time-domain (FDTD) and nonorthogonal finite-volume time-domain (FVTD). The technique directly couples structured FDTD grids with unstructured FVTD grids without the need for spatial interpolation across grid interfaces. In this paper, the FVHG method is applied to simple planar microelectronic devices. Local tetrahedron grids are used to model portions of the device under study, with the remainder of the problem space being modeled with cubical hexahedral cells. The accuracy of propagating microstrip-guided waves from a low-density hexahedron region through a high-density tetrahedron grid is investigated.

  7. The spatial and logical organization of devices in an advanced industrial robot system

    NASA Technical Reports Server (NTRS)

    Ruoff, C. F.

    1980-01-01

    This paper describes the geometrical and device organization of a robot system which is based in part upon transformations of Cartesian frames and exchangeable device tree structures. It discusses coordinate frame transformations, geometrical device representation and solution degeneracy along with the data structures which support the exchangeable logical-physical device assignments. The system, which has been implemented in a minicomputer, supports vision, force, and other sensors. It allows tasks to be instantiated with logically equivalent devices and it allows tasks to be defined relative to appropriate frames. Since these frames are, in turn, defined relative other frames this organization provides a significant simplification in task specification and a high degree of system modularity.

  8. Area Reports. Advanced materials and devices research area. Silicon materials research task, and advanced silicon sheet task

    NASA Technical Reports Server (NTRS)

    1986-01-01

    The objectives of the Silicon Materials Task and the Advanced Silicon Sheet Task are to identify the critical technical barriers to low-cost silicon purification and sheet growth that must be overcome to produce a PV cell substrate material at a price consistent with Flat-plate Solar Array (FSA) Project objectives and to overcome these barriers by performing and supporting appropriate R&D. Progress reports are given on silicon refinement using silane, a chemical vapor transport process for purifying metallurgical grade silicon, silicon particle growth research, and modeling of silane pyrolysis in fluidized-bed reactors.

  9. Micromachined chemical sensor with integrated microelectronics

    NASA Astrophysics Data System (ADS)

    Smith, J.; Sniegowski, J.; Koehler, D.; Ricco, T.; Martin, S.; McWhorter, P.

    With today's continued emphasis on environmental safety and health issues, a resurgence of interest has developed in the area of chemical sensors. These sensors would typically be used to monitor contamination hazards such as underground storage tanks or to assess previous contamination at waste disposal sites. Human exposure to chemical hazards can also be monitored. Additionally, these sensors can be used as part of a manufacturing process control loop. One type of sensor suitable for gas phase monitoring of chemicals is the quartz resonator or quartz crystal microbalance (QCM) sensor. In this type of sensor, a thickness shear mode (TSM) quartz resonator is coated with a film that interacts with the chemical species of interest. Changes in the mass and elasticity of this film are reflected as changes in the resonant properties of the device. Therefore, the presence of the species of interest can be detected by monitoring the frequency of an oscillator based on the resonance of the quartz. These QCM sensors compete with surface acoustic wave (SAW) devices as a means for monitoring gas phase species. SAW devices are typically more sensitive to small amounts of a species, but the instrumentation associated with a SAW device is an order of magnitude more expensive than the instrumentation associated with a TSM wave resonator since the SAW devices operate in the 100's of MHz frequency regime while quartz resonators operate in the 5-25 MHz regime. We are working to improve the sensitivity of the QCM sensor by increasing the frequency of the device to 25 MHz (compared to the typical 5 MHz crystal) and by increasing the frequency stability of the system to an ultimate goal of 0.1 Hz. The 25 MHz QCM has already been achieved, and once the stability goal is achieved, the QCM will have the same sensitivity as a SAW device.

  10. Detecting Nano-Scale Vibrations in Rotating Devices by Using Advanced Computational Methods

    PubMed Central

    del Toro, Raúl M.; Haber, Rodolfo E.; Schmittdiel, Michael C.

    2010-01-01

    This paper presents a computational method for detecting vibrations related to eccentricity in ultra precision rotation devices used for nano-scale manufacturing. The vibration is indirectly measured via a frequency domain analysis of the signal from a piezoelectric sensor attached to the stationary component of the rotating device. The algorithm searches for particular harmonic sequences associated with the eccentricity of the device rotation axis. The detected sequence is quantified and serves as input to a regression model that estimates the eccentricity. A case study presents the application of the computational algorithm during precision manufacturing processes. PMID:22399918

  11. Encapsulation methods for organic electrical devices

    DOEpatents

    Blum, Yigal D.; Chu, William Siu-Keung; MacQueen, David Brent; Shi, Yijian

    2013-06-18

    The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.

  12. Advanced biosensing methodologies developed for evaluating performance quality and safety of emerging biophotonics technologies and medical devices (Conference Presentation)

    NASA Astrophysics Data System (ADS)

    Ilev, Ilko K.; Walker, Bennett; Calhoun, William; Hassan, Moinuddin

    2016-03-01

    Biophotonics is an emerging field in modern biomedical technology that has opened up new horizons for transfer of state-of-the-art techniques from the areas of lasers, fiber optics and biomedical optics to the life sciences and medicine. This field continues to vastly expand with advanced developments across the entire spectrum of biomedical applications ranging from fundamental "bench" laboratory studies to clinical patient "bedside" diagnostics and therapeutics. However, in order to translate these technologies to clinical device applications, the scientific and industrial community, and FDA are facing the requirement for a thorough evaluation and review of laser radiation safety and efficacy concerns. In many cases, however, the review process is complicated due the lack of effective means and standard test methods to precisely analyze safety and effectiveness of some of the newly developed biophotonics techniques and devices. There is, therefore, an immediate public health need for new test protocols, guidance documents and standard test methods to precisely evaluate fundamental characteristics, performance quality and safety of these technologies and devices. Here, we will overview our recent developments of novel test methodologies for safety and efficacy evaluation of some emerging biophotonics technologies and medical devices. These methodologies are based on integrating the advanced features of state-of-the-art optical sensor technologies and approaches such as high-resolution fiber-optic sensing, confocal and optical coherence tomography imaging, and infrared spectroscopy. The presentation will also illustrate some methodologies developed and implemented for testing intraocular lens implants, biochemical contaminations of medical devices, ultrahigh-resolution nanoscopy, and femtosecond laser therapeutics.

  13. Wireless Integrated Microelectronic Vacuum Sensor System

    NASA Technical Reports Server (NTRS)

    Krug, Eric; Philpot, Brian; Trott, Aaron; Lawrence, Shaun

    2013-01-01

    NASA Stennis Space Center's (SSC's) large rocket engine test facility requires the use of liquid propellants, including the use of cryogenic fluids like liquid hydrogen as fuel, and liquid oxygen as an oxidizer (gases which have been liquefied at very low temperatures). These fluids require special handling, storage, and transfer technology. The biggest problem associated with transferring cryogenic liquids is product loss due to heat transfer. Vacuum jacketed piping is specifically designed to maintain high thermal efficiency so that cryogenic liquids can be transferred with minimal heat transfer. A vacuum jacketed pipe is essentially two pipes in one. There is an inner carrier pipe, in which the cryogenic liquid is actually transferred, and an outer jacket pipe that supports and seals the vacuum insulation, forming the "vacuum jacket." The integrity of the vacuum jacketed transmission lines that transfer the cryogenic fluid from delivery barges to the test stand must be maintained prior to and during engine testing. To monitor the vacuum in these vacuum jacketed transmission lines, vacuum gauge readings are used. At SSC, vacuum gauge measurements are done on a manual rotation basis with two technicians, each using a handheld instrument. Manual collection of vacuum data is labor intensive and uses valuable personnel time. Additionally, there are times when personnel cannot collect the data in a timely fashion (i.e., when a leak is detected, measurements must be taken more often). Additionally, distribution of this data to all interested parties can be cumbersome. To simplify the vacuum-gauge data collection process, automate the data collection, and decrease the labor costs associated with acquiring these measurements, an automated system that monitors the existing gauges was developed by Invocon, Inc. For this project, Invocon developed a Wireless Integrated Microelectronic Vacuum Sensor System (WIMVSS) that provides the ability to gather vacuum

  14. Carbon nanotubes for thermal interface materials in microelectronic packaging

    NASA Astrophysics Data System (ADS)

    Lin, Wei

    As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment

  15. Microelectronics in F. E.: Some Personal Perceptions. An Occasional Paper.

    ERIC Educational Resources Information Center

    Dean, K. J.

    The recent microelectronics developments are having, and will continue to have, a sharp impact on various industries in Great Britain, and thus on the capacity of the Further Education System to produce qualified graduates. To maintain a high quality of education, instructors must learn of these new developments and teach them to their vocational…

  16. Reparable, high-density microelectronic module provides effective heat sink

    NASA Technical Reports Server (NTRS)

    Carlson, K. J.; Maytone, F. F.

    1967-01-01

    Reparable modular system is used for packaging microelectronic flat packs and miniature discrete components. This three-dimensional compartmented structure incorporates etched phosphor bronze sheets and frames with etched wire conductors. It provides an effective heat sink for electric power dissipation in the absence of convective cooling means.

  17. The Wales Region: Microelectronics Education to the Mid Eighties.

    ERIC Educational Resources Information Center

    Taylor, Lionel

    1982-01-01

    Discusses developments which should occur in the Wales region by the end of the Microelectronics Education Programme (1984). Indicates that a major curriculum project has been started to enable developments in information technology to be reflected in classrooms, focusing on the production of software and resource materials. (Author/JN)

  18. Integrating Microcomputers and Microelectronics into the Physics Curriculum.

    ERIC Educational Resources Information Center

    Gale, Douglas S.

    1980-01-01

    Describes an interdisciplinary microcomputer and microelectronics program offered jointly by the Physics and Computer Science Departments of East Texas State University. The program operates on both the graduate and undergraduate level. Content as well as structure of the program are discussed. (Author/DS)

  19. Speculations on the Social Effects of New Microelectronics Technology.

    ERIC Educational Resources Information Center

    Cherns, A. B.

    1980-01-01

    Examines the implications of the reduced importance of employment for individuals, for enterprises (work conditions, management styles), trade unions (with a more political than industrial role), and the conservation of resources, concluding with a brief look at the possible benefits of microelectronics for the developing countries. (CT)

  20. Microelectronic Technology and the Hearing Impaired: The Future. Keynote Address.

    ERIC Educational Resources Information Center

    Thorkildsen, Ron

    1985-01-01

    The potential of microelectronic technology for alleviating communication problems of hearing-impaired persons is discussed from a futuristic point of view. The need for computer literacy training is related to changing career opportunities. Computer literacy, artificial intelligence, and videodisc technology are described and related to training…

  1. The Spin Torque Lego - from spin torque nano-devices to advanced computing architectures

    NASA Astrophysics Data System (ADS)

    Grollier, Julie

    2013-03-01

    Spin transfer torque (STT), predicted in 1996, and first observed around 2000, brought spintronic devices to the realm of active elements. A whole class of new devices, based on the combined effects of STT for writing and Giant Magneto-Resistance or Tunnel Magneto-Resistance for reading has emerged. The second generation of MRAMs, based on spin torque writing : the STT-RAM, is under industrial development and should be out on the market in three years. But spin torque devices are not limited to binary memories. We will rapidly present how the spin torque effect also allows to implement non-linear nano-oscillators, spin-wave emitters, controlled stochastic devices and microwave nano-detectors. What is extremely interesting is that all these functionalities can be obtained using the same materials, the exact same stack, simply by changing the device geometry and its bias conditions. So these different devices can be seen as Lego bricks, each brick with its own functionality. During this talk, I will show how spin torque can be engineered to build new bricks, such as the Spintronic Memristor, an artificial magnetic nano-synapse. I will then give hints on how to assemble these bricks in order to build novel types of computing architectures, with a special focus on neuromorphic circuits. Financial support by the European Research Council Starting Grant NanoBrain (ERC 2010 Stg 259068) is acknowledged.

  2. Performance of a Water Recirculation Loop Maintenance Device and Process for the Advanced Spacesuit Water Membrane Evaporator

    NASA Technical Reports Server (NTRS)

    Rector, Tony; Steele, John W.; Bue, Grant C.; Campbell, Colin; Makinen, Janice

    2012-01-01

    A water loop maintenance device and process to maintain the water quality of the Advanced Spacesuit Water Membrane Evaporation (SWME) water recirculation loop has been undergoing a performance evaluation. The SWME is a heat rejection device under development at the NASA Johnson Space Center to perform thermal control for advanced spacesuits. One advantage to this technology is the potential for a significantly greater degree of tolerance to contamination when compared to the existing Sublimator technology. The driver for the water recirculation maintenance device and process is to further enhance this advantage through the leveraging of fluid loop management lessons-learned from the International Space Station (ISS). A bed design that was developed for a Hamilton Sundstrand military application, and considered for a potential ISS application with the Urine Processor Assembly, provides a low pressure drop means for water maintenance in a recirculation loop. The bed design is coupled with high capacity ion exchange resins, organic adsorbents, and a cyclic methodology developed for the Extravehicular Mobility Unit (EMU) Transport Water loop. The maintenance process further leverages a sorbent developed for ISS that introduces a biocide in a microgravity-compatible manner for the Internal Active Thermal Control System (IATCS). The leveraging of these water maintenance technologies to the SWME recirculation loop is a unique demonstration of applying the valuable lessons learned on the ISS to the next generation of manned spaceflight Environmental Control and Life Support System (ECLSS) hardware. This

  3. Design and Evaluation of a Water Recirculation Loop Maintenance Device for the Advanced Spacesuit Water Membrane Evaporator

    NASA Technical Reports Server (NTRS)

    Steele, John W.; Rector, Tony; Bue, Grant C.; Campbell, Colin; Makinen, Janice

    2011-01-01

    A dual-bed device to maintain the water quality of the Advanced Spacesuit Water Membrane Evaporation (SWME) water recirculation loop has been designed and is undergoing testing. The SWME is a heat rejection device under development at the NASA Johnson Space Center to perform thermal control for advanced spacesuits. One advantage to this technology is the potential for a significantly greater degree of tolerance to contamination when compared to the existing Sublimator technology. The driver for the development of a water recirculation maintenance device is to further enhance this advantage through the leveraging of fluid loop management lessons-learned from the International Space Station (ISS). A bed design that was developed for a Hamilton Sundstrand military application, and considered for a potential ISS application with the Urine Processor Assembly, provides a low pressure drop means for water maintenance in a recirculation loop. The bed design is coupled with high capacity ion exchange resins, organic adsorbents, and a cyclic methodology developed for the Extravehicular Mobility Unit (EMU) Transport Water loop. The bed design further leverages a sorbent developed for ISS that introduces a biocide in a microgravity-compatible manner for the Internal Active Thermal Control System (IATCS). The leveraging of these water maintenance technologies to the SWME recirculation loop is a clear demonstration of applying the valuable lessons learned on the ISS to the next generation of manned spaceflight Environmental Control and Life Support System (ECLSS) hardware.

  4. Design and Evaluation of a Water Recirculation Loop Maintenance Device for the Advanced Spacesuit Water Membrane Evaporator

    NASA Technical Reports Server (NTRS)

    Steele, John W.; Rector, Tony; Bue, Grant C.; Campbell, Colin; Makinen, Janice

    2012-01-01

    A dual-bed device to maintain the water quality of the Advanced Spacesuit Water Membrane Evaporation (SWME) water recirculation loop has been designed and is undergoing testing. The SWME is a heat rejection device under development at the NASA Johnson Space Center to perform thermal control for advanced spacesuits. One advantage to this technology is the potential for a significantly greater degree of tolerance to contamination when compared to the existing sublimator technology. The driver for the development of a water recirculation maintenance device is to further enhance this advantage through the leveraging of fluid loop management lessons learned from the International Space Station (ISS). A bed design that was developed for a Hamilton Sundstrand military application, and considered for a potential ISS application with the Urine Processor Assembly, provides a low pressure drop means for water maintenance in a recirculation loop. The bed design is coupled with high-capacity ion exchange resins, organic adsorbents, and a cyclic methodology developed for the Extravehicular Mobility Unit Transport Water Loop. The bed design further leverages a sorbent developed for the ISS that introduces a biocide in a microgravity-compatible manner for the Internal Active Thermal Control System. The leveraging of these water maintenance technologies to the SWME recirculation loop is a unique demonstration of applying the valuable lessons learned on the ISS to the next generation of crewed spaceflight Environmental Control and Life Support System hardware.

  5. Performance of a Water Recirculation Loop Maintenance Device and Process for the Advanced Spacesuit Water Membrane Evaporator

    NASA Technical Reports Server (NTRS)

    Steele, John W.; Rector, Tony; Bue, Grant C.; Campbell, Colin; Makinen, Janice

    2013-01-01

    A dual-bed device to maintain the water quality of the Advanced Spacesuit Water Membrane Evaporation (SWME) water recirculation loop has been designed and is undergoing testing. The SWME is a heat rejection device under development at the NASA Johnson Space Center to perform thermal control for advanced spacesuits. One advantage to this technology is the potential for a significantly greater degree of tolerance to contamination when compared to the existing Sublimator technology. The driver for the development of a water recirculation maintenance device is to further enhance this advantage through the leveraging of fluid loop management lessons-learned from the International Space Station (ISS). A bed design that was developed for a Hamilton Sundstrand military application, and considered for a potential ISS application with the Urine Processor Assembly, provides a low pressure drop means for water maintenance in a recirculation loop. The bed design is coupled with high capacity ion exchange resins, organic adsorbents, and a cyclic methodology developed for the Extravehicular Mobility Unit (EMU) Transport Water loop. The bed design further leverages a sorbent developed for ISS that introduces a biocide in a microgravity-compatible manner for the Internal Active Thermal Control System (IATCS). The leveraging of these water maintenance technologies to the SWME recirculation loop is a unique demonstration of applying the valuable lessons learned on the ISS to the next generation of manned spaceflight Environmental Control and Life Support System (ECLSS) hardware.

  6. Functional imaging using computational fluid dynamics to predict treatment success of mandibular advancement devices in sleep-disordered breathing.

    PubMed

    De Backer, J W; Vanderveken, O M; Vos, W G; Devolder, A; Verhulst, S L; Verbraecken, J A; Parizel, P M; Braem, M J; Van de Heyning, P H; De Backer, W A

    2007-01-01

    Mandibular advancement devices (MADs) have emerged as a popular alternative for the treatment of sleep-disordered breathing. These devices bring the mandibula forward in order to increase upper airway (UA) volume and prevent total UA collapse during sleep. However, the precise mechanism of action appears to be quite complex and is not yet completely understood; this might explain interindividual variation in treatment success. We examined whether an UA model, that combines imaging techniques and computational fluid dynamics (CFD), allows for a prediction of the treatment outcome with MADs. Ten patients that were treated with a custom-made mandibular advancement device (MAD), underwent split-night polysomnography. The morning after the sleep study, a low radiation dose CT scan was scheduled with and without the MAD. The CT examinations allowed for a comparison between the change in UA volume and the anatomical characteristics through the conversion to three-dimensional computer models. Furthermore, the change in UA resistance could be calculated through flow simulations with CFD. Boundary conditions for the model such as mass flow rate and pressure distributions were obtained during the split-night polysomnography. Therefore, the flow modeling was based on a patient specific geometry and patient specific boundary conditions. The results indicated that a decrease in UA resistance and an increase in UA volume correlate with both a clinical and an objective improvement. The results of this pilot study suggest that the outcome of MAD treatment can be predicted using the described UA model.

  7. Fully Integrated Biochip Platforms for Advanced Healthcare

    PubMed Central

    Carrara, Sandro; Ghoreishizadeh, Sara; Olivo, Jacopo; Taurino, Irene; Baj-Rossi, Camilla; Cavallini, Andrea; de Beeck, Maaike Op; Dehollain, Catherine; Burleson, Wayne; Moussy, Francis Gabriel; Guiseppi-Elie, Anthony; De Micheli, Giovanni

    2012-01-01

    Recent advances in microelectronics and biosensors are enabling developments of innovative biochips for advanced healthcare by providing fully integrated platforms for continuous monitoring of a large set of human disease biomarkers. Continuous monitoring of several human metabolites can be addressed by using fully integrated and minimally invasive devices located in the sub-cutis, typically in the peritoneal region. This extends the techniques of continuous monitoring of glucose currently being pursued with diabetic patients. However, several issues have to be considered in order to succeed in developing fully integrated and minimally invasive implantable devices. These innovative devices require a high-degree of integration, minimal invasive surgery, long-term biocompatibility, security and privacy in data transmission, high reliability, high reproducibility, high specificity, low detection limit and high sensitivity. Recent advances in the field have already proposed possible solutions for several of these issues. The aim of the present paper is to present a broad spectrum of recent results and to propose future directions of development in order to obtain fully implantable systems for the continuous monitoring of the human metabolism in advanced healthcare applications. PMID:23112644

  8. Temperature-independent resistor for microelectronic circuits

    NASA Technical Reports Server (NTRS)

    Aegerter, S.; Libby, W. F.

    1970-01-01

    Heat treating insulating crystals in gaseous hydrogen atmosphere produce resistive device which is temperature-independent from 77 to 295 degrees K. Increasing the concentration of hydrogen within the crystal yields semiconductor, hybrid, and metallic conduction characteristics which are combined with a depletion layer at the surface.

  9. Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2000-01-01

    MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed

  10. Characterization of Amorphous Silicon Advanced Materials and PV Devices: Final Technical Report, 15 December 2001--31 January 2005

    SciTech Connect

    Taylor, P. C.

    2005-11-01

    The major objectives of this subcontract have been: (1) understand the microscopic properties of the defects that contribute to the Staebler-Wronski effect to eliminate this effect, (2) perform correlated studies on films and devices made by novel techniques, especially those with promise to improve stability or deposition rates, (3) understand the structural, electronic, and optical properties of films of hydrogenated amorphous silicon (a-Si:H) made on the boundary between the amorphous and microcrystalline phases, (4) search for more stable intrinsic layers of a-Si:H, (5) characterize the important defects, impurities, and metastabilities in the bulk and at surfaces and interfaces in a-Si:H films and devices and in important alloy systems, and (6) make state-of-the-art plasma-enhanced chemical vapor deposition (PECVD) devices out of new, advanced materials, when appropriate. All of these goals are highly relevant to improving photovoltaic devices based on a-Si:H and related alloys. With regard to the first objective, we have identified a paired hydrogen site that may be the defect that stabilizes the silicon dangling bonds formed in the Staebler-Wronski effect.

  11. Advances in Hydrogen, Carbon Dioxide, and Hydrocarbon Gas Sensor Technology Using GaN and ZnO-Based Devices

    PubMed Central

    Anderson, Travis; Ren, Fan; Pearton, Stephen; Kang, Byoung Sam; Wang, Hung-Ta; Chang, Chih-Yang; Lin, Jenshan

    2009-01-01

    In this paper, we review our recent results in developing gas sensors for hydrogen using various device structures, including ZnO nanowires and GaN High Electron Mobility Transistors (HEMTs). ZnO nanowires are particularly interesting because they have a large surface area to volume ratio, which will improve sensitivity, and because they operate at low current levels, will have low power requirements in a sensor module. GaN-based devices offer the advantage of the HEMT structure, high temperature operation, and simple integration with existing fabrication technology and sensing systems. Improvements in sensitivity, recoverability, and reliability are presented. Also reported are demonstrations of detection of other gases, including CO2 and C2H4 using functionalized GaN HEMTs. This is critical for the development of lab-on-a-chip type systems and can provide a significant advance towards a market-ready sensor application. PMID:22408548

  12. [Advances on enzymes and enzyme inhibitors research based on microfluidic devices].

    PubMed

    Hou, Feng-Hua; Ye, Jian-Qing; Chen, Zuan-Guang; Cheng, Zhi-Yi

    2010-06-01

    With the continuous development in microfluidic fabrication technology, microfluidic analysis has evolved from a concept to one of research frontiers in last twenty years. The research of enzymes and enzyme inhibitors based on microfluidic devices has also made great progress. Microfluidic technology improved greatly the analytical performance of the research of enzymes and enzyme inhibitors by reducing the consumption of reagents, decreasing the analysis time, and developing automation. This review focuses on the development and classification of enzymes and enzyme inhibitors research based on microfluidic devices.

  13. Advances in microbial biofilm prevention on indwelling medical devices with emphasis on usage of acoustic energy.

    PubMed

    Dror, Naama; Mandel, Mathilda; Hazan, Zadik; Lavie, Gad

    2009-01-01

    Microbial biofilms are a major impediment to the use of indwelling medical devices, generating device-related infections with high morbidity and mortality. Major efforts directed towards preventing and eradicating the biofilm problem face difficulties because biofilms protect themselves very effectively by producing a polysaccharide coating, reducing biofilm sensitivity to antimicrobial agents. Techniques applied to combating biofilms have been primarily chemical. These have met with partial and limited success rates, leading to current trends of eradicating biofilms through physico-mechanical strategies. Here we review the different approaches that have been developed to control biofilm formation and removal, focusing on the utilization of acoustic energy to achieve these objectives.

  14. Reversible Motor Paralysis and Early Cardiac Rehabilitation in Patients With Advanced Heart Failure Receiving Left Ventricular Assist Device Therapy.

    PubMed

    Amao, Rie; Imamura, Teruhiko; Nakahara, Yasuo; Noguchi, Satoko; Kinoshita, Osamu; Yamauchi, Haruo; Ono, Minoru; Haga, Nobuhiko

    2016-12-02

    Advanced heart failure (HF) is sometimes complicated with brain impairment because of a microthrombosis caused by decreased left ventricular contraction or reduced brain circulation. Some patients may recover after left ventricular assist device (LVAD) implantation. However, little is known about the perioperative therapeutic strategy in patients suffering from such complications, particularly from a cardiac rehabilitation viewpoint. We report on a 58-year-old male patient with a previous history of poliomyelitis and a light paralysis in the left upper extremity, who suffered left hemiplegia with no evidence of stroke after hemodynamic deterioration. The combination therapy of perioperative cardiac rehabilitation and LVAD therapy improved his left hemiplegia as well as activities of daily living, and the patient was discharged on foot on postoperative day 72 after briefing the family on LVAD home management. Early initiation of cardiac rehabilitation before LVAD implantation may be a key for the smooth discharge and resocialization of patients suffering from brain impairment complicated with advanced HF.

  15. Efficacy of mandibular advancement device in the treatment of obstructive sleep apnea syndrome: A randomized controlled crossover clinical trial

    PubMed Central

    Crovetto-Martínez, Rafael; Alkhraisat, Mohammad-Hamdan; Crovetto, Miguel; Municio, Antonio; Kutz, Ramón; Aizpuru, Felipe; Miranda, Erika; Anitua, Eduardo

    2015-01-01

    Background Evaluation of the efficacy and safety of a mandibular advancement device (MAD) (KlearwayTM) in the treatment of mild-to-moderate obstructive sleep apnea and chronic roncopathy. Material and Methods A randomized, placebo-controlled, double blinded, and crossover clinical trial was conducted. Placebo device (PD) defined as a splint in the centric occlusion that did not induce a mandibular advancement served as a control. The mandible was advanced to the maximum tolerable distance or to a minimum of 65% of the maximum protrusion. After each sequence of treatment, patients were assessed by questionnaires, conventional polysomnography, and objective measurement of snoring at the patient’s own home. Results Forty two patients participated in the study and 38 completed the study. Patients mean age was 46 ±9 years and the 79% were males. The mean mandibular advancement was 8.6 ±2.8 mm. Patients used the MAD and the PD for 6.4 +2.4 hours and 6.2 +2.0 hours, respectively. Secondary effects (mostly mild) occurred in the 85.7% and the 86.8% of the users of MAD and PD, respectively. The MAD induced a decrease in the apnea-hypopnea index (AHI) from 15.3 +10.2 to 11.9 +15.5. The 50% reduction in the AHI was achieved in the 46.2% and the 18.4% of the patients treated with MAD and PD, respectively. The use of the MAD induced a reduction in the AHI by 3.4 +15.9 while the PD induced an increase by 10.6 +26.1. The subjective evaluation of the roncopathy indicated an improvement by the MAD and an increase in the perceptive quality of sleep. However, the objective evaluation of the roncopathy did not show significant improvements. Conclusions The use of MAD is efficient to reduce the AHI and improve subjectively the roncopathy. MAD could be considered in the treatment of mild-to-moderate OSA and chronic roncopathy. Key words:Obstructive sleep apnea (OSA), mandibular advance device, treatment, efficacy, clinical assay. PMID:26241460

  16. Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems

    NASA Astrophysics Data System (ADS)

    Arik, Mehmet; Tamdogan, Enes

    Rapid progress in science and information technology, growing manufacturing activities and increase in globalization have boosted the demand for advanced electronics devices. Moreover, increase in microprocessor power dissipation coupled with the reduction in feature sizes due to manufacturing process improvements have resulted in continuously increasing heat fluxes. Thus, ever increasing heat fluxes have required the development of novel, reliable and affordable thermal management technologies. Although some of those proposed solutions for high flux cooling problems based on liquid cooling methods such as spray and evaporative cooling; air cooling is still commonly preferred due to its availability, reliability, easiness and low cost. Therefore, over the last decade microfluidics devices such as synthetic jets have been investigated as an alternative to conventional air moving devices, and have been shown as highly effective for cooling of electronics in compact thermal real estates...

  17. Advanced laser-based tracking device for motor vehicle lane position monitoring and steering assistance

    NASA Astrophysics Data System (ADS)

    Bachalo, William D.; Inenaga, Andrew; Schuler, Carlos A.

    1995-12-01

    Aerometrics is developing an innovative laser-diode based device that provides a warning signal when a motor-vehicle deviates from the center of the lane. The device is based on a sensor that scans the roadway on either side of the vehicle and determines the lateral position relative to the existing painted lines marking the lane. No additional markings are required. A warning is used to alert the driver of excessive weaving or unanticipated departure from the center of the lane. The laser beams are at invisible wavelengths to that operation of the device does not pose a distraction to the driver or other motorists: When appropriate markers are not present on the road, the device is capable of detecting this condition and warn the driver. The sensor system is expected to work well irrespective of ambient light levels, fog and rain. This sensor has enormous commercial potential. It could be marketed as an instrument to warn drivers that they are weaving, used as a research tool to monitor driving patterns, be required equipment for those previously convicted of driving under the influence, or used as a backup sensor for vehicle lateral position control. It can also be used in storage plants to guide robotic delivery vehicles. In this paper, the principles of operation of the sensor, and the results of Aerometrics ongoing testing will be presented.

  18. SAW-grade SiO2 for advanced microfluidic devices

    NASA Astrophysics Data System (ADS)

    Winkler, Andreas; Menzel, Siegfried; Schmidt, Hagen

    2009-05-01

    Acoustoelectronic devices based on surface acoustic wave (SAW) technology are primarily used in radio frequency filters, delay lines, duplexers, amplifiers and RFID tags. Thereby, SAW's are excited at the surface of piezoelectric materials (e.g. Quartz, LiTaO3, LiNbO3) by an RF signal applied via interdigital transducers (IDTs)1. Novel SAW applications that emerged recently in the field of microfluidics such as the handling of minimum quantities of fluids or gases2,3 require a fluid compatible design approach, high power durability and long lifetime of the devices. However, conventional SAW devices with finger electrodes arranged on top of the chip surface experience acoustomigration damage4,5 at high power input and/or higher operating temperature leading to failure of the device. Additionally, inappropriate material systems or chip surface topography can limit their performance in microfluidic application. To overcome these limitations the electrodes can be buried in an acoustically suited ("SAW-grade") functional layer which moreover should be adjustable to the specific biotechnological task. Depending on the properties of this layer, it can suppress the acoustomigration impact6 and improve the power durability of the device. Also, a reduction of the thermally-induced frequency shift is possible7. The present paper describes a novel SAW based chip technology approach using a modular concept. Here, the electrodes are buried in surface polished SAW-grade SiO2 fabricated by means of reactive RF magnetron sputtering from a SiO2- target. This approach will be demonstrated for two different metallization systems based on Al or Cu thin films on 128° YX-LiNbO3 substrates. We also show the application of the SiO2-layer with respect to compensation of thermallyinduced frequency shift and bio /chemical surface modification. Investigations were carried out using atomic force microscopy, laser-pulse acoustic measurement, glow-discharge optical emission spectroscopy

  19. Preliminary investigation of polystyrene/MoS{sub 2}-Oleylamine polymer composite for potential application as low-dielectric material in microelectronics

    SciTech Connect

    Landi, Giovanni; Altavilla, Claudia; Iannace, Salvatore; Sorrentino, Andrea; Ciambelli, Paolo; Neitzert, Heinrich C.

    2015-12-17

    Insulating materials play a vital role in the design and performance of electrical systems for both steady and transient state conditions. Among the other properties, also in this field, polymer nanocomposites promise to offer exciting improvements. Many studies in the last decade has witnessed significant developments in the area of nano-dielectric materials and significant effects of nano-scale fillers on electric, thermal and mechanical properties of polymeric materials have been observed. However, the developments of new and advanced materials to be used the miniaturization of electronic devices fabrication require extensive studies on electrical insulation characteristics of these materials before they can be used in commercial systems. In this work, Polystyrene (PS) composites were prepared by the blend solution method using MoS{sub 2}@Oleylamine nanosheets as filler. The dielectric properties of the resulting comoposite have been investigated at 300K and in the frequency range between 1000 Hz and 1 MHz. The addition of the MoS{sub 2}@Oleylamine nanosheets leads to a decreasing of the relative dielectric constant and of the electrical conductivity measured in the voltage range between ±500V. Thanks to a possibility to tune the electrical permittivity with the control of MoS{sub 2} concentration, these materials could be used as a low-dielectric material in the microelectronics applications.

  20. Harmonic balance optimization of terahertz Schottky diode multipliers using an advanced device model

    NASA Technical Reports Server (NTRS)

    Schlecht, E. T.; Chattopadhyay, G.; Maestrini, A.; Pukala, D.; Gill, J.; Mehdi, I.

    2002-01-01

    Substantial proress has been made recently in the advancement of solid state terahertz sources using chains of Schottky diode frequency multipliers. We have developed a harmonic balance simulator and corresponding diode model that incorporates many other factors participating in the diode behavior.

  1. Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections

    DOEpatents

    Griffiths, Stewart K.; Nilson, Robert H.; Hruby, Jill M.

    2002-01-01

    An apparatus and procedure for performing microfabrication of detailed metal structures by electroforming metal deposits within small cavities. Two primary areas of application are: the LIGA process which manufactures complex three-dimensional metal parts and the damascene process used for electroplating line and via interconnections of microelectronic devices. A porous electrode held in contact or in close proximity with a plating substrate or mold top to ensure one-dimensional and uniform current flow into all mold cavities is used. Electrolyte is pumped over the exposed surface of the porous electrode to ensure uniform ion concentrations at this external surface. The porous electrode prevents electrolyte circulation within individual mold cavities, avoiding preferential enhancement of ion transport in cavities having favorable geometries. Both current flow and ion transport are one-dimensional and identical in all mold cavities, so all metal deposits grow at the same rate eliminating nonuniformities of the prior art.

  2. High and low threshold P-channel metal oxide semiconductor process and description of microelectronics facility

    NASA Technical Reports Server (NTRS)

    Bouldin, D. L.; Feltner, W. R.; Hollis, B. R.; Routh, D. E.

    1976-01-01

    The fabrication techniques and detail procedures for creating P-channel Metal-Oxide-Semiconductor (P-MOS) integrated circuits at George C. Marshall Space Flight Center (MSFC) are described. Examples of P-MOS integrated circuits fabricated at MSFC together with functional descriptions of each are given. Typical electrical characteristics of high and low threshold P-MOS discrete devices under given conditions are provided. A general description of MSFC design, mask making, packaging, and testing procedures is included. The capabilities described in this report are being utilized in: (1) research and development of new technology, (2) education of individuals in the various disciplines and technologies of the field of microelectronics, and (3) fabrication of many types of specially designed integrated circuits which are not commercially feasible in small quantities for in-house research and development programs.

  3. Advanced InSb monolithic Charge Coupled Infrared Imaging Devices (CCIRID)

    NASA Technical Reports Server (NTRS)

    Koch, T. L.; Thom, R. D.; Parrish, W. D.

    1981-01-01

    The continued development of monolithic InSb charge coupled infrared imaging devices (CCIRIDs) is discussed. The processing sequence and structural design of 20-element linear arrays are discussed. Also, results obtained from radiometric testing of the 20-element arrays using a clamped sample-and-hold output circuit are reported. The design and layout of a next-generation CCIRID chip are discussed. The major devices on this chip are a 20 by 16 time-delay-and-integration (TDI) area array and a 100-element linear imaging array. The development of a process for incorporating an ion implanted S(+) planar channel stop into the CCIRID structure and the development of a thin film transparent photogate are also addressed. The transparent photogates will increase quantum efficiency to greater than 70% across the 2.5 to 5.4 micrometer spectral region in future front-side illuminated CCIRIDs.

  4. Non-Intrusive Device for Real-Time Circulatory System Assessment with Advanced Signal Processing Capabilities

    NASA Astrophysics Data System (ADS)

    Pinheiro, E.; Postolache, O.; Girão, P.

    2010-01-01

    This paper presents a device that uses three cardiography signals to characterize several important parameters of a subject's circulatory system. Using electrocardiogram, finger photoplethysmogram, and ballistocardiogram, three heart rate estimates are acquired from beat-to-beat time interval extraction. Furthermore, pre-ejection period, pulse transit time (PTT), and pulse arrival time (PAT) are computed, and their long-term evolution is analyzed. The system estimates heart rate variability (HRV) and blood pressure variability (BPV) from the heart rate and PAT time series, to infer the activity of the cardiac autonomic system. The software component of the device evaluates the frequency content of HRV and BPV, and also their fractal dimension and entropy, thus providing a detailed analysis of the time series' regularity and complexity evolution, to allow personalized subject evaluation.

  5. National Center for Advanced Information Components Manufacturing. Program summary report, Volume 1

    SciTech Connect

    1996-10-01

    The National Center for Advanced Information Components Manufacturing focused on manufacturing research and development for flat panel displays, advanced lithography, microelectronics, and optoelectronics. This report provides an overview of the program, summaries of the technical projects, and key program accomplishments.

  6. Giga-Hertz Electromagnetic Wave Science and Devices for Advanced Battlefield Communications

    DTIC Science & Technology

    2010-12-15

    Microwave Assisted Magnetic Reversal”, MMM Conference, Washington D. C. (2010 19. “Hexagonal barium ferrite thin film-based millimeter wave phase...International Conference on Microwave Magnetics, Boston, June 1-4, 2010. (Contributed talk) 25. “Hexagonal barium ferrite -based millimeter wave notch...Wafer Microwave Devices, Study of Material Properties in the the GHz range Z. Celinski University of Colorado - Colorado Springs Regents of the Univ

  7. Challenges of Electrical Measurements of Advanced Gate Dielectrics in Metal-Oxide-Semiconductor Devices

    NASA Astrophysics Data System (ADS)

    Vogel, Eric M.; Brown, George A.

    2003-09-01

    Experimental measurements and simulations are used to provide an overview of key issues with the electrical characterization of metal-oxide-semiconductor (MOS) devices with ultra-thin oxide and alternate gate dielectrics. Experimental issues associated with the most common electrical characterization method, capacitance-voltage (C-V), are first described. Issues associated with equivalent oxide thickness extraction and comparison, interface state measurement, extrinsic defects, and defect generation are then overviewed.

  8. Thermal control for space microelectronic equipment via pyroelectric material: Design, characterisation and experimental campaign

    NASA Astrophysics Data System (ADS)

    Monti, Riccardo; Gasbarri, Paolo; Lecci, Umberto

    2012-12-01

    In the last decades the development of new satellite platforms from a smaller to a bigger size goes in parallel with the development of the microelectronics equipment boarded on. Avionics, control systems and payloads equipment exploit the microelectronics in order to reduce the overall dimensions and masses and to increase the performances of each unit for the improvement of goals in each mission. A larger use of electronic elements with the relevant components increases the importance of a carefully equipment designed under different points of view. One of them is the thermal management. It is well known that the Joule Effect causes the heat overstocking which in turn reduces the efficiency of the electronic devices and increases the difficulties to manage the thermal power budget on board. A new design philosophy sees a possibility for a simpler and a more efficient thermal control on the use of the pyroelectric materials. Pyroelectrics are a "special" class of materials that demonstrates a spontaneous capacity to convert thermal fluxes in electrical charge and if applied on a "passive" structure they can "actively" reduce the heat overstocking. The electrical charge could be eventually stored for different purposes such as for instance the auto-feeding, or better the energy harvesting. With the reduction of the temperature of each component, and consequently with the reduction of the heat flux that flows through microelectronics, better efficiency and better performances are ensured. In this way the reliability is increased and the goals of the mission could be achieved easier and easier. In this paper the design of a thermal rig made up of pyroelectric devices and dummy electronics components in order to verify the thermo-electric conversion is presented. Furthermore an experimental campaign has been performed to validate the technology here introduced and the relevant results presented. In particular the characterisation of a typical aerospace pyroelectric

  9. Materials and processing science: Limits for microelectronics

    NASA Astrophysics Data System (ADS)

    Rosenberg, R.

    1988-09-01

    The theme of this talk will be to illustrate examples of technologies that will drive materials and processing sciences to the limit and to describe some of the research being pursued to understand materials interactions which are pervasive to projected structure fabrication. It is to be expected that the future will see a progression to nanostructures where scaling laws will be tested and quantum transport will become more in evidence, to low temperature operation for tighter control and improved performance, to complex vertical profiles where 3D stacking and superlattices will produce denser packing and device flexibility, to faster communication links with optoelectronics, and to compatible packaging technologies. New low temperature processing techniques, such as epitaxy of silicon, PECVD of dielectrics, low temperature high pressure oxidation, silicon-germanium heterostructures, etc., must be combined with shallow metallurgies, new lithographic technologies, maskless patterning, rapid thermal processing (RTP) to produce needed profile control, reduce process incompatibilities and develop new device geometries. Materials interactions are of special consequence for chip substrates and illustrations of work in metal-ceramic and metal-polymer adhesion will be offered.

  10. Low-Cost Photolithographic Fabrication of Nanowires and Microfilters for Advanced Bioassay Devices

    PubMed Central

    Doan, Nhi M.; Qiang, Liangliang; Li, Zhe; Vaddiraju, Santhisagar; Bishop, Gregory W.; Rusling, James F.; Papadimitrakopoulos, Fotios

    2015-01-01

    Integrated microfluidic devices with nanosized array electrodes and microfiltration capabilities can greatly increase sensitivity and enhance automation in immunoassay devices. In this contribution, we utilize the edge-patterning method of thin aluminum (Al) films in order to form nano- to micron-sized gaps. Evaporation of high work-function metals (i.e., Au, Ag, etc.) on these gaps, followed by Al lift-off, enables the formation of electrical uniform nanowires from low-cost, plastic-based, photomasks. By replacing Al with chromium (Cr), the formation of high resolution, custom-made photomasks that are ideal for low-cost fabrication of a plurality of array devices were realized. To demonstrate the feasibility of such Cr photomasks, SU-8 micro-pillar masters were formed and replicated into PDMS to produce micron-sized filters with 3–4 µm gaps and an aspect ratio of 3. These microfilters were capable of retaining 6 µm beads within a localized site, while allowing solvent flow. The combination of nanowire arrays and micro-pillar filtration opens new perspectives for rapid R&D screening of various microfluidic-based immunoassay geometries, where analyte pre-concentration and highly sensitive, electrochemical detection can be readily co-localized. PMID:25774709

  11. Lessons learned from early microelectronics production at Sandia National Laboratories

    SciTech Connect

    Weaver, H.T.

    1998-02-01

    During the 1980s Sandia designed, developed, fabricated, tested, and delivered hundreds of thousands of radiation hardened Integrated Circuits (IC) for use in weapons and satellites. Initially, Sandia carried out all phases, design through delivery, so that development of next generation ICs and production of current generation circuits were carried out simultaneously. All this changed in the mid-eighties when an outside contractor was brought in to produce ICs that Sandia developed, in effect creating a crisp separation between development and production. This partnership had a severe impact on operations, but its more damaging effect was the degradation of Sandia`s microelectronics capabilities. This report outlines microelectronics development and production in the early eighties and summarizes the impact of changing to a separate contractor for production. This record suggests that low volume production be best accomplished within the development organization.

  12. Radiofrequency and microwave radiation in the microelectronics industry.

    PubMed

    Cohen, R

    1986-01-01

    The microscopic precision required to produce minute integrated circuits is dependent on several processes utilizing radiofrequency and microwave radiation. This article provides a review of radiofrequency and microwave exposures in microelectronics and of the physical and biologic properties of these types of radiation; summarizes the existing, relevant medical literature; and provides the clinician with guidelines for diagnosis and treatment of excessive exposures to microwave and radiofrequency radiation.

  13. Advances in nonlinear characterization of millimetre-wave devices for telecommunications

    NASA Astrophysics Data System (ADS)

    Parker, Anthony E.

    2007-12-01

    Field Effect Transistors exhibit a variety of complicated dynamic and nonlinear interactions that affect millimetre-wave devices used for telecommunications. The dynamics include self heating, bias dependent change in trapped charge, and variations due to impact ionization. These are feedback mechanisms that contribute to intermodulation as a memory effect does. A FET is better viewed as a nonlinear system with feedback, bias dependent rates, and high-order nonlinear conductance and charge storage with specific terminal to terminal interaction. Identifying and characterizing FET dynamics and linearity is a key step in the design process. Extraction of true intrinsic characteristics is an important first step to understanding the physics of trapping and heating within the device. Standard measurement techniques tend to derive access networks with an emphasis on scaling with layout geometry. The intrinsic device is then modelled as whatever is left after de-embedding the measurements. As such, the intrinsic model exhibits significant frequency dispersions and behaviour that is not easily related to the operation of the transistor. A correct determination of the access network reveals that the dispersions within the intrinsic data are related to physical process, such as heating and trapping. Recent work has been carried out to accurately implement trapping within a circuit simulator. This is key to correct prediction of intermodulation and bias dependence effects generated by a FET. It is shown that heating significantly affects trapping and is an important factor in the transient rate dependence of the characteristics. The implementation of trapping within a circuit model, and its consequences on linearity are explored.

  14. Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory

    SciTech Connect

    Smith, J.H.

    1995-08-01

    An overview of the major sensor and actuator projects using the micromachining capabilities of the Microelectronics Development Laboratory at Sandia National Laboratories are presented. Development efforts are underway for a variety of micromechanical devices and control electronics for those devices. Our efforts are concentrated in the area of surface micromachining. Pressure sensors based on silicon nitride diaphragms and hot polysilicon filaments for calorimetric gas sensing have been developed. Accelerometers based upon high-aspect ratio surface micromachining are being developed. Actuation mechanisms employing either electrostatic or steam power are being combined with a three-level active (plus an additional passive level) polysilicon surface micromachining process to couple these actuators to external devices. The results of efforts toward integration of micromechanics with the driving electronics for actuators or the amplification/signal processing electronics for sensors is also described. This effort includes a CMOS-first, tungsten metallization process to allow the CMOS electronics to withstand high-temperature micromechanical processing. Also, a unique micromechanics-first approach is being pursued in which the micromechanical devices are embedded below the surface of the starting material for the CMOS.

  15. Advanced Technology for Improved Quantum Device Properties Using Highly Strained Materials

    DTIC Science & Technology

    1989-06-15

    PREPARED BY: W.J. Schaff S.D. OffseyI DL)L.,C ;.. $T A H. Park At~pio-ved tc- ;p7ua~ic tel-e:a~o L.F. Eastman q uoig4 04 Table of Contents Page...Graded-Index Separate-Confinement Heterostructure Single Quantum Well Lasers Grown by Molecular Beam Epitaxy", S.D. Offsey, W.J. Schaff , P.J. Tasker, H...gle Confinement Single Quantum Well Lasers Grown by Molecular Beam Epitaxy", S.D. Offsey, W.J. Schaff , P.J. Tasker and L.F. Eastman, Device Research

  16. Scalable Iterative Solvers Applied to 3D Parallel Simulation of Advanced Semiconductor Devices

    NASA Astrophysics Data System (ADS)

    García-Loureiro, A. J.; Aldegunde, M.; Seoane, N.

    2009-08-01

    We have studied the performance of a preconditioned iterative solver to speed up a 3D semiconductor device simulator. Since 3D simulations necessitate large computing resources, the choice of algorithms and their parameters become of utmost importance. This code uses a density gradient drift-diffusion semiconductor transport model based on the finite element method which is one of the most general and complex discretisation techniques. It has been implemented for a distributed memory multiprocessor environment using the Message Passing Interface (MPI) library. We have applied this simulator to a 67 nm effective gate length Si MOSFET.

  17. Advances in crystal growth, device fabrication and characterization of thallium bromide detectors for room temperature applications

    NASA Astrophysics Data System (ADS)

    Datta, Amlan; Moed, Demi; Becla, Piotr; Overholt, Matthew; Motakef, Shariar

    2016-10-01

    Thallium bromide (TlBr) is a promising room-temperature radiation detector candidate with excellent charge transport properties. However, several critical issues need to be addressed before deployment of this material for long-term field applications can be realized. In this paper, progress made towards solving some of these challenges is discussed. The most significant factors for achieving long-term performance stability for TlBr devices include residual stress as generated during crystal growth and fabrication processes, surface conditions, and the choice of contact metal. Modifications to the commonly used traveling molten zone growth technique for TlBr crystals can significantly minimize the stresses generated by large temperature gradients near the melt-solid interface of the growing crystal. Plasma processing techniques were introduced for the first time to modify the Br-etched TlBr surfaces, which resulted in improvements to the surface conditions, and consequently the spectroscopic response of the detectors. Palladium electrodes resulted a 20-fold improvement in the room-temperature device lifetime when compared to its Br-etched Pt counterpart.

  18. Advanced devices for photoacoustic imaging to improve cancer and cerebrovascular medicine

    NASA Astrophysics Data System (ADS)

    Montilla Marien, Leonardo Gabriel

    Recent clinical studies have demonstrated that photoacoustic imaging (PAI) provides important diagnostic information for breast cancer staging. Despite these promising studies, PAI remains an unfeasible option for clinics due to the cost to implement, the required large modification in user conduct and the inflexibility of the hardware to accommodate other applications for the incremental enhancement in diagnostic information. The research described in this dissertation addresses these issues by designing attachments to clinical ultrasound probes and incorporating custom detectors into commercial ultrasound scanners. The ultimate benefit of these handheld devices is to expand the capability of current ultrasound systems and facilitate the translation of PAI to enhance cancer diagnostics and neurosurgical outcomes. Photoacoustic enabling devices (PEDs) were designed as attachments to two clinical ultrasound probes optimized for breast cancer diagnostics. PAI uses pulsed laser excitation to create transient heating (<1°C) and thermoelastic expansion that is detected as an ultrasonic emission. These ultrasonic emissions are remotely sensed to construct noninvasive images with optical contrast at depths much greater than other optical modalities. The PEDs are feasible in terms of cost, user familiarity and flexibility for various applications. Another possible application for PAI is in assisting neurosurgeons treating aneurysms. Aneurysms are often treated by placing a clip to prevent blood flow into the aneurysm. However, this procedure has risks associated with damaging nearby vessels. One of the developed PEDs demonstrated the feasibility to three-dimensionally image tiny microvasculature (<0.3mm) beyond large blood occlusions (>2.4mm) in a phantom model. The capability to use this during surgery would suggest decreasing the risks associated with these treatments. However, clinical ultrasound arrays are not clinically feasible for microsurgical applications due to

  19. Moore's law and the impact on trusted and radiation-hardened microelectronics.

    SciTech Connect

    Ma, Kwok Kee

    2011-12-01

    In 1965 Gordon Moore wrote an article claiming that integrated circuit density would scale exponentially. His prediction has remained valid for more than four decades. Integrated circuits have changed all aspects of everyday life. They are also the 'heart and soul' of modern systems for defense, national infrastructure, and intelligence applications. The United States government needs an assured and trusted microelectronics supply for military systems. However, migration of microelectronics design and manufacturing from the United States to other countries in recent years has placed the supply of trusted microelectronics in jeopardy. Prevailing wisdom dictates that it is necessary to use microelectronics fabricated in a state-of-the-art technology for highest performance and military system superiority. Close examination of silicon microelectronics technology evolution and Moore's Law reveals that this prevailing wisdom is not necessarily true. This presents the US government the possibility of a totally new approach to acquire trusted microelectronics.

  20. High reliability plastic packaging for microelectronics

    SciTech Connect

    Sweet, J.N.; Peterson, D.W.; Hsia, A.H.; Tuck, M.

    1997-07-01

    Goal was Assembly Test Chips (ATCs) which could be used for evaluating plastic encapsulation technologies. Circuits were demonstrated for measuring Au-Al wirebond and Al metal corrosion failure rates during accelerated temperature and humidity testing. The test circuits on the ATC02.5 chip were very sensitive to extrinsic or processing induced failure rates. Accelerated aging experiments were conducted with unpassivated triple track Al structures on the ATC02.6 chip; the unpassivated tracks were found to be very sensitive to particulate contamination. Some modifications to existing circuitry were suggested. The piezoresistive stress sensing circuitry designed for the ATC04 test chip was found suitable for determining the change in the state of mechanical stress at the die when both initial and final measurements were made near room temperature (RT). Attempt to measure thermal stress between RT and a typical polymer glass transition temperature failed because of excessive die resistor- substrate leakage currents at the high temperature end; suitable circuitry changes were developed to overcome this problem. One temperature and humidity experiment was conducted with Sandia developed static radom access memory parts to examine non-corrosion CMOS failures; this objective was not achieved, but corrosion failure at the metal to Si contacts on the die surface could be detected. This 2-year effort resulted in new designs for test circuits which could be used on an advanced ATC for reliability assessment in Defense Programs electronics development projects.

  1. The ion beam sputtering facility at KURRI: Coatings for advanced neutron optical devices

    NASA Astrophysics Data System (ADS)

    Hino, Masahiro; Oda, Tatsuro; Kitaguchi, Masaaki; Yamada, Norifumi L.; Tasaki, Seiji; Kawabata, Yuji

    2015-10-01

    We describe a film coating facility for the development of multilayer mirrors for use in neutron optical devices that handle slow neutron beams. Recently, we succeeded in fabricating a large neutron supermirror with high reflectivity using an ion beam sputtering system (KUR-IBS), as well as all neutron supermirrors in two neutron guide tubes at BL06 at J-PARC/MLF. We also realized a large flexible self-standing m=5 NiC/Ti supermirror and very small d-spacing (d=1.65 nm) multilayer sheets. In this paper, we present an overview of the performance and utility of non-magnetic neutron multilayer mirrors fabricated with the KUR-IBS

  2. Development and characterization of 3D, nano-confined multicellular constructs for advanced biohybrid devices.

    SciTech Connect

    Kaehr, Bryan James

    2011-09-01

    This is the final report for the President Harry S. Truman Fellowship in National Security Science and Engineering (LDRD project 130813) awarded to Dr. Bryan Kaehr from 2008-2011. Biological chemistries, cells, and integrated systems (e.g., organisms, ecologies, etc.) offer important lessons for the design of synthetic strategies and materials. The desire to both understand and ultimately improve upon biological processes has been a driving force for considerable scientific efforts worldwide. However, to impart the useful properties of biological systems into modern devices and materials requires new ideas and technologies. The research herein addresses aspects of these issues through the development of (1) a rapid-prototyping methodology to build 3D bio-interfaces and catalytic architectures, (2) a quantitative method to measure cell/material mechanical interactions in situ and at the microscale, and (3) a breakthrough approach to generate functional biocomposites from bacteria and cultured cells.

  3. Advances in CO2 laser fabrication for high power fibre laser devices

    NASA Astrophysics Data System (ADS)

    Boyd, Keiron; Rees, Simon; Simakov, Nikita; Daniel, Jae M. O.; Swain, Robert; Mies, Eric; Hemming, Alexander; Clarkson, W. A.; Haub, John

    2016-03-01

    CO2 laser processing facilitates contamination free, rapid, precise and reproducible fabrication of devices for high power fibre laser applications. We present recent progress in fibre end-face preparation and cladding surface modification techniques. We demonstrate a fine feature CO2 laser process that yields topography significantly smaller than that achieved with typical mechanical cleaving processes. We also investigate the side processing of optical fibres for the fabrication of all-glass cladding light strippers and demonstrate extremely efficient cladding mode removal. We apply both techniques to fibres with complex designs containing multiple layers of doped and un-doped silica as well as shaped and circularly symmetric structures. Finally, we discuss the challenges and approaches to working with various fibre and glass-types.

  4. Advanced techniques for latent fingerprint detection and validation using a CWL device

    NASA Astrophysics Data System (ADS)

    Makrushin, Andrey; Hildebrandt, Mario; Fischer, Robert; Kiertscher, Tobias; Dittmann, Jana; Vielhauer, Claus

    2012-06-01

    The technology-aided support of forensic experts while investigating crime scenes and collecting traces becomes a more and more important part in the domains of image acquisition and signal processing. The manual lifting of latent fingerprints using conventional methods like the use of carbon black powder is time-consuming and very limited in its scope of application. New technologies for a contact-less and non-invasive acquisition and automatic processing of latent fingerprints, promise the possibilities to inspect much more and larger surface areas and can significantly simplify and speed up the workflow. Furthermore, it allows multiple investigations of the same trace, subsequent chemical analysis of the residue left behind and the acquisition of latent fingerprints on sensitive surfaces without destroying the surface itself. In this work, a FRT MicroProf200 surface measurement device equipped with a chromatic white-light sensor CWL600 is used. The device provides a gray-scale intensity image and 3D-topography data simultaneously. While large area scans are time-consuming, the detection and localization of finger traces are done based on low-resolution scans. The localized areas are scanned again with higher resolution. Due to the broad variety of different surface characteristics the fingerprint pattern is often overlaid by the surface structure or texture. Thus, image processing and classification techniques are proposed for validation and visualization of ridge lines in high-resolution scans. Positively validated regions containing complete or sufficient partial fingerprints are passed on to forensic experts. The experiments are provided on a set of three surfaces with different reflection and texture characteristics, and fingerprints from ten different persons.

  5. Improvement of process control using wafer geometry for enhanced manufacturability of advanced semiconductor devices

    NASA Astrophysics Data System (ADS)

    Lee, Honggoo; Lee, Jongsu; Kim, Sang Min; Lee, Changhwan; Han, Sangjun; Kim, Myoungsoo; Kwon, Wontaik; Park, Sung-Ki; Vukkadala, Pradeep; Awasthi, Amartya; Kim, J. H.; Veeraraghavan, Sathish; Choi, DongSub; Huang, Kevin; Dighe, Prasanna; Lee, Cheouljung; Byeon, Jungho; Dey, Soham; Sinha, Jaydeep

    2015-03-01

    Aggressive advancements in semiconductor technology have resulted in integrated chip (IC) manufacturing capability at sub-20nm half-pitch nodes. With this, lithography overlay error budgets are becoming increasingly stringent. The delay in EUV lithography readiness for high volume manufacturing (HVM) and the need for multiple-patterning lithography with 193i technology has further amplified the overlay issue. Thus there exists a need for technologies that can improve overlay errors in HVM. The traditional method for reducing overlay errors predominantly focused on improving lithography scanner printability performance. However, processes outside of the lithography sector known as processinduced overlay errors can contribute significantly to the total overlay at the current requirements. Monitoring and characterizing process-induced overlay has become critical for advanced node patterning. Recently a relatively new technique for overlay control that uses high-resolution wafer geometry measurements has gained significance. In this work we present the implementation of this technique in an IC fabrication environment to monitor wafer geometry changes induced across several points in the process flow, of multiple product layers with critical overlay performance requirement. Several production wafer lots were measured and analyzed on a patterned wafer geometry tool. Changes induced in wafer geometry as a result of wafer processing were related to down-stream overlay error contribution using the analytical in-plane distortion (IPD) calculation model. Through this segmentation, process steps that are major contributors to down-stream overlay were identified. Subsequent process optimization was then isolated to those process steps where maximum benefit might be realized. Root-cause for the within-wafer, wafer-to-wafer, tool-to-tool, and station-to-station variations observed were further investigated using local shape curvature changes - which is directly related to

  6. Advances in three-dimensional rapid prototyping of microfluidic devices for biological applications

    PubMed Central

    O'Neill, P. F.; Ben Azouz, A.; Vázquez, M.; Liu, J.; Marczak, S.; Slouka, Z.; Chang, H. C.; Diamond, D.; Brabazon, D.

    2014-01-01

    The capability of 3D printing technologies for direct production of complex 3D structures in a single step has recently attracted an ever increasing interest within the field of microfluidics. Recently, ultrafast lasers have also allowed developing new methods for production of internal microfluidic channels within the bulk of glass and polymer materials by direct internal 3D laser writing. This review critically summarizes the latest advances in the production of microfluidic 3D structures by using 3D printing technologies and direct internal 3D laser writing fabrication methods. Current applications of these rapid prototyped microfluidic platforms in biology will be also discussed. These include imaging of cells and living organisms, electrochemical detection of viruses and neurotransmitters, and studies in drug transport and induced-release of adenosine triphosphate from erythrocytes. PMID:25538804

  7. Advanced Biasing Experiments on the C-2 Field-Reversed Configuration Device

    NASA Astrophysics Data System (ADS)

    Thompson, Matthew; Korepanov, Sergey; Garate, Eusebio; Yang, Xiaokang; Gota, Hiroshi; Douglass, Jon; Allfrey, Ian; Valentine, Travis; Uchizono, Nolan; TAE Team

    2014-10-01

    The C-2 experiment seeks to study the evolution, heating and sustainment effects of neutral beam injection on field-reversed configuration (FRC) plasmas. Recently, substantial improvements in plasma performance were achieved through the application of edge biasing with coaxial plasma guns located in the divertors. Edge biasing provides rotation control that reduces instabilities and E × B shear that improves confinement. Typically, the plasma gun arcs are run at ~ 10 MW for the entire shot duration (~ 5 ms), which will become unsustainable as the plasma duration increases. We have conducted several advanced biasing experiments with reduced-average-power plasma gun operating modes and alternative biasing cathodes in an effort to develop an effective biasing scenario applicable to steady state FRC plasmas. Early results show that several techniques can potentially provide effective, long-duration edge biasing.

  8. Mandibular Advancement Device as a Comparable Treatment to Nasal Continuous Positive Airway Pressure for Positional Obstructive Sleep Apnea

    PubMed Central

    Takaesu, Yoshikazu; Tsuiki, Satoru; Kobayashi, Mina; Komada, Yoko; Nakayama, Hideaki; Inoue, Yuichi

    2016-01-01

    Study Objectives: Positional obstructive sleep apnea (P-OSA) is a clinically common phenotype of OSA, which can be treated effectively with mandibular advancement devices (MADs). We hypothesized that the efficacy of an MAD is comparable to that of nasal continuous positive airway pressure (nCPAP) in P-OSA patients. Methods: Among patients diagnosed with OSA at a single sleep center from January 2008 to May 2014, male subjects with moderate OSA were recruited and stringently categorized as having P-OSA when the ratio of their lateral apnea-hypopnea index (AHI) to supine AHI was ≤ 0.5, their lateral sleep time was > 60 minutes, and their lateral REM sleep time was longer than 10 minutes. Treatment efficacy was compared between P-OSA subjects with an MAD (n = 34) and those with nCPAP (n = 34) after matching for age, body-mass index, and baseline AHI. Results: There were no significant differences in baseline AHI (MAD: nCPAP = 20.6 ± 3.9/h: 21.3 ± 1.7/h, p = 0.35) or in follow-up AHI (MAD: nCPAP = 4.7 ± 3.5/h: 3.4 ± 3.7/h, p = 0.12) between the 2 treatment groups, and hence MADs lowered the AHI to the same extent as nCPAP. Conclusions: These findings suggest that an MAD is as efficacious as nCPAP for P-OSA patients. MAD treatment for this specific phenotype may be a promising patient-tailored and first-line approach to OSA. Commentary: A commentary on this article appears in this issue on page 1079. Citation: Takaesu Y, Tsuiki S, Kobayashi M, Komada Y, Nakayama H, Inoue Y. Mandibular advancement device as a comparable treatment to nasal continuous positive airway pressure for positional obstructive sleep apnea. J Clin Sleep Med 2016;12(8):1113–1119. PMID:27250814

  9. Moving graphene devices from lab to market: advanced graphene-coated nanoprobes

    NASA Astrophysics Data System (ADS)

    Hui, Fei; Vajha, Pujashree; Shi, Yuanyuan; Ji, Yanfeng; Duan, Huiling; Padovani, Andrea; Larcher, Luca; Li, Xiao Rong; Xu, Jing Juan; Lanza, Mario

    2016-04-01

    After more than a decade working with graphene there is still a preoccupying lack of commercial devices based on this wonder material. Here we report the use of high-quality solution-processed graphene sheets to fabricate ultra-sharp probes with superior performance. Nanoprobes are versatile tools used in many fields of science, but they can wear fast after some experiments, reducing the quality and increasing the cost of the research. As the market of nanoprobes is huge, providing a solution for this problem should be a priority for the nanotechnology industry. Our graphene-coated nanoprobes not only show enhanced lifetime, but also additional unique properties of graphene, such as hydrophobicity. Moreover, we have functionalized the surface of graphene to provide piezoelectric capability, and have fabricated a nano relay. The simplicity and low cost of this method, which can be used to coat any kind of sharp tip, make it suitable for the industry, allowing production on demand.After more than a decade working with graphene there is still a preoccupying lack of commercial devices based on this wonder material. Here we report the use of high-quality solution-processed graphene sheets to fabricate ultra-sharp probes with superior performance. Nanoprobes are versatile tools used in many fields of science, but they can wear fast after some experiments, reducing the quality and increasing the cost of the research. As the market of nanoprobes is huge, providing a solution for this problem should be a priority for the nanotechnology industry. Our graphene-coated nanoprobes not only show enhanced lifetime, but also additional unique properties of graphene, such as hydrophobicity. Moreover, we have functionalized the surface of graphene to provide piezoelectric capability, and have fabricated a nano relay. The simplicity and low cost of this method, which can be used to coat any kind of sharp tip, make it suitable for the industry, allowing production on demand. Electronic

  10. Microgravity experiments on boiling and applications: research activity of advanced high heat flux cooling technology for electronic devices in Japan.

    PubMed

    Suzuki, Koichi; Kawamura, Hiroshi

    2004-11-01

    Research and development on advanced high heat flux cooling technology for electronic devices has been carried out as the Project of Fundamental Technology Development for Energy Conservation, promoted by the New Energy and Industrial Technology Development Organization of Japan (NEDO). Based on the microgravity experiments on boiling heat transfer, the following useful results have obtained for the cooling of electronic devices. In subcooled flow boiling in a small channel, heat flux increases considerably more than the ordinary critical heat flux with microbubble emission in transition boiling, and dry out of the heating surface is disturbed. Successful enhancement of heat transfer is achieved by a capillary effect from grooved surface dual subchannels on the liquid supply. The critical heat flux increases 30-40 percent more than for ordinary subchannels. A self-wetting mechanism has been proposed, following investigation of bubble behavior in pool boiling of binary mixtures under microgravity. Ideas and a new concept have been proposed for the design of future cooling system in power electronics.

  11. Computational Analysis of Advanced Shape-Memory Alloy Devices Through a Robust Modeling Framework

    NASA Astrophysics Data System (ADS)

    Scalet, Giulia; Conti, Michele; Auricchio, Ferdinando

    2017-03-01

    Shape-memory alloys (SMA) provide significant advantages in various industrial fields, but their manufacturing and commercialization are currently hindered. This is attributed mainly to the poor knowledge of material behavior and the lack of standards in its mechanical characterization. SMA products are usually developed by trial-and-error testing to address specific design requirements, thus increasing costs and time. The development of simulation tools offers a possible solution to assist engineers and designers and allows to better understand SMA transformation phenomena. Accordingly, the purpose of the present paper is to numerically analyze and predict the response of spring-like actuators and septal occluders, which are industrial components exploiting the shape-memory and pseudoelastic properties of SMAs, respectively. The methodology includes two main stages: the implementation of the three-dimensional phenomenological model known as Souza-Auricchio model and the finite element modeling of the device. A discussion about the steps of each stage, as parameter identification and model generalizations, is provided. Validation results are presented through a comparison with the results of a performed experimental campaign. The framework proves good prediction capabilities and allows to reduce the number of experimental tests in the future.

  12. A review of recent advances in the spherical harmonics expansion method for semiconductor device simulation.

    PubMed

    Rupp, K; Jungemann, C; Hong, S-M; Bina, M; Grasser, T; Jüngel, A

    The Boltzmann transport equation is commonly considered to be the best semi-classical description of carrier transport in semiconductors, providing precise information about the distribution of carriers with respect to time (one dimension), location (three dimensions), and momentum (three dimensions). However, numerical solutions for the seven-dimensional carrier distribution functions are very demanding. The most common solution approach is the stochastic Monte Carlo method, because the gigabytes of memory requirements of deterministic direct solution approaches has not been available until recently. As a remedy, the higher accuracy provided by solutions of the Boltzmann transport equation is often exchanged for lower computational expense by using simpler models based on macroscopic quantities such as carrier density and mean carrier velocity. Recent developments for the deterministic spherical harmonics expansion method have reduced the computational cost for solving the Boltzmann transport equation, enabling the computation of carrier distribution functions even for spatially three-dimensional device simulations within minutes to hours. We summarize recent progress for the spherical harmonics expansion method and show that small currents, reasonable execution times, and rare events such as low-frequency noise, which are all hard or even impossible to simulate with the established Monte Carlo method, can be handled in a straight-forward manner. The applicability of the method for important practical applications is demonstrated for noise simulation, small-signal analysis, hot-carrier degradation, and avalanche breakdown.

  13. From Microscale Devices to 3D Printing: Advances in Fabrication of 3D Cardiovascular Tissues.

    PubMed

    Borovjagin, Anton V; Ogle, Brenda M; Berry, Joel L; Zhang, Jianyi

    2017-01-06

    Current strategies for engineering cardiovascular cells and tissues have yielded a variety of sophisticated tools for studying disease mechanisms, for development of drug therapies, and for fabrication of tissue equivalents that may have application in future clinical use. These efforts are motivated by the need to extend traditional 2-dimensional (2D) cell culture systems into 3D to more accurately replicate in vivo cell and tissue function of cardiovascular structures. Developments in microscale devices and bioprinted 3D tissues are beginning to supplant traditional 2D cell cultures and preclinical animal studies that have historically been the standard for drug and tissue development. These new approaches lend themselves to patient-specific diagnostics, therapeutics, and tissue regeneration. The emergence of these technologies also carries technical challenges to be met before traditional cell culture and animal testing become obsolete. Successful development and validation of 3D human tissue constructs will provide powerful new paradigms for more cost effective and timely translation of cardiovascular tissue equivalents.

  14. New regulations for medical devices: Rationale, advances and impact on research and patient care.

    PubMed

    Labek, Gerold; Schöffl, Harald; Stoica, Christian Ioan

    2016-03-18

    A series of events relating to inferior medical devices has brought about changes in the legal requirements regarding quality control on the part of regulators. Apart from clinical studies, register and routine data will play an essential role in this context. To ensure adequate use of these data, adapted methodologies are required as register data in fact represent a new scientific entity. For the interpretation of register and routine data several limitations of published data should be taken into account. In many cases essential parameters of study cohorts - such as age, comorbidities, the patients' risk profiles or the hospital profile - are not presented. Required data and evaluation procedures differ significantly, for example, between hip and spine implants. A "one fits for all" methodology is quite unlikely to exist and vigorous efforts will be required to develop suitable standards in the next future. The new legislation will affect all high-risk products, besides joint implants also contact lenses, cardiac pacemakers or stents, for example, the new regulations can markedly enhance product quality monitoring. Register data and clinical studies should not be considered as competitors, they complement each other when used responsibly. In the future follow-up studies should increasingly focus on specific questions, while global follow-up investigations regarding product complication rates and surgical methods will increasingly be covered by registers.

  15. Introductory lecture. Advanced laser spectroscopy in combustion chemistry: from elementary steps to practical devices.

    PubMed

    Wolfrum, J

    2001-01-01

    In recent years a large number of linear and nonlinear laser-based diagnostic techniques for nonintrusive measurements of species concentrations, temperatures, and gas velocities in a wide pressure and temperature range with high temporal and spatial resolution have been developed and have become extremely valuable tools to study many aspects of combustion. Beside the nonintrusive diagnostics of technical combustion devices the kinetics and microscopic dynamics of elementary chemical combustion reactions can be investigated in great detail by laser spectroscopy. These investigations show, that a small number of relatively simple elementary steps like H + O2-->OH + O, H2O2-->2OH, O + N2-->NO + N, NH2 + NO-->H2O + N2, OH + N2H control a large variety of combustion phenomena and pollutant formation processes. Laminar flames are ideal objects to develop the application of laser spectroscopic methods for practical combustion systems and to test and improve the gas-phase reaction mechanism in combustion models. Nonintrusive laser point and field measurements are of basic importance in the validation and further development of turbulent combustion models. Nonlinear laser spectroscopic techniques using infrared-visible sum-frequency generation can now bridge the pressure and materials gap to provide kinetic data for catalytic combustion. Finally, the potential of laser techniques for active combustion control in municipal waste incinerators is illustrated.

  16. Advances in molecular electronics: Synthesis and testing of potential molecular electronic devices

    NASA Astrophysics Data System (ADS)

    Price, David Wilson, Jr.

    New potential molecular electronics devices have been synthesized based on our knowledge of previous systems that have come out of our group. Previous studies and current studies have shown that simple molecular systems demonstrate negative differential resistance (NDR) and memory characteristics. The new systems rely primarily on the redox properties of the compounds to improve upon the solid state properties already observed. Most of these new organic compounds use thiol-based "alligator clips" for attachment to metal surfaces. Some of the compounds, however, contain different "alligator clips," primarily isonitriles, for attachment to metal substrates. It is our hope that these new "alligator clips" will offer lower conductivity barriers (higher current density). Electrochemical tests have been performed in order to evaluate those redox properties and in the hope of using those electrochemical results as a predictive tool to evaluate the usefulness of those compounds. Also, organic structures with polymerizable functionalities have been synthesized in order to cross-link the molecules once they are a part of a self-assembled monolayer (SAM). This has been shown to enable the electrochemical growth of polypyrrole from a SAM in a controllable manner.

  17. Cell Phone-Based and Adherence Device Technologies for HIV Care and Treatment in Resource-Limited Settings: Recent Advances.

    PubMed

    Campbell, Jeffrey I; Haberer, Jessica E

    2015-12-01

    Numerous cell phone-based and adherence monitoring technologies have been developed to address barriers to effective HIV prevention, testing, and treatment. Because most people living with HIV and AIDS reside in resource-limited settings (RLS), it is important to understand the development and use of these technologies in RLS. Recent research on cell phone-based technologies has focused on HIV education, linkage to and retention in care, disease tracking, and antiretroviral therapy adherence reminders. Advances in adherence devices have focused on real-time adherence monitors, which have been used for both antiretroviral therapy and pre-exposure prophylaxis. Real-time monitoring has recently been combined with cell phone-based technologies to create real-time adherence interventions using short message service (SMS). New developments in adherence technologies are exploring ingestion monitoring and metabolite detection to confirm adherence. This article provides an overview of recent advances in these two families of technologies and includes research on their acceptability and cost-effectiveness when available. It additionally outlines key challenges and needed research as use of these technologies continues to expand and evolve.

  18. 4D Ultrasound - Medical Devices for Recent Advances on the Etiology of Cerebral Palsy

    PubMed Central

    Tomasovic, Sanja; Predojevic, Maja

    2011-01-01

    Children cerebral palsy (CCP) encompasses a group of nonprogessive and noninfectious conditions, which cause light, moderate, and severe deviations in neurological development. Diagnosis of CCP is set mostly by the age of 3 years. The fact that a large number of cerebral damage occurs prenatally and the fact that early intervention in cases of neurological damage is successful, prompted some researchers to explore the possibility of detecting neurologically damaged fetus in the uterus. This research was made possible thanks to the development of two-dimensional ultrasound technology in a real time, which enabled the display of the mobility of the fetus. Advancement of the ultrasound technology has enabled the development of 4D ultrasound where a spontaneous fetal movement can be observed almost in a real time. Estimate of the number and quality of spontaneous fetal movements and stitches on the head, the neurology thumb and a high palate were included in the prenatal neurological screening of the fetus. This raises the question, as to does the fetal behavior reflect, (which was revealed in 2D or 4D ultrasound), fetal neurological development in a manner that will allow the detection of the brain damage. PMID:23407920

  19. 4D Ultrasound - Medical Devices for Recent Advances on the Etiology of Cerebral Palsy.

    PubMed

    Tomasovic, Sanja; Predojevic, Maja

    2011-12-01

    Children cerebral palsy (CCP) encompasses a group of nonprogessive and noninfectious conditions, which cause light, moderate, and severe deviations in neurological development. Diagnosis of CCP is set mostly by the age of 3 years. The fact that a large number of cerebral damage occurs prenatally and the fact that early intervention in cases of neurological damage is successful, prompted some researchers to explore the possibility of detecting neurologically damaged fetus in the uterus. This research was made possible thanks to the development of two-dimensional ultrasound technology in a real time, which enabled the display of the mobility of the fetus. Advancement of the ultrasound technology has enabled the development of 4D ultrasound where a spontaneous fetal movement can be observed almost in a real time. Estimate of the number and quality of spontaneous fetal movements and stitches on the head, the neurology thumb and a high palate were included in the prenatal neurological screening of the fetus. This raises the question, as to does the fetal behavior reflect, (which was revealed in 2D or 4D ultrasound), fetal neurological development in a manner that will allow the detection of the brain damage.

  20. Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages.

    PubMed

    Carlton, Holly D; Elmer, John W; Li, Yan; Pacheco, Mario; Goyal, Deepak; Parkinson, Dilworth Y; MacDowell, Alastair A

    2016-04-13

    Synchrotron radiation micro-tomography (SRµT) is a non-destructive three-dimensional (3D) imaging technique that offers high flux for fast data acquisition times with high spatial resolution. In the electronics industry there is serious interest in performing failure analysis on 3D microelectronic packages, many which contain multiple levels of high-density interconnections. Often in tomography there is a trade-off between image resolution and the volume of a sample that can be imaged. This inverse relationship limits the usefulness of conventional computed tomography (CT) systems since a microelectronic package is often large in cross sectional area 100-3,600 mm(2), but has important features on the micron scale. The micro-tomography beamline at the Advanced Light Source (ALS), in Berkeley, CA USA, has a setup which is adaptable and can be tailored to a sample's properties, i.e., density, thickness, etc., with a maximum allowable cross-section of 36 x 36 mm. This setup also has the option of being either monochromatic in the energy range ~7-43 keV or operating with maximum flux in white light mode using a polychromatic beam. Presented here are details of the experimental steps taken to image an entire 16 x 16 mm system within a package, in order to obtain 3D images of the system with a spatial resolution of 8.7 µm all within a scan time of less than 3 min. Also shown are results from packages scanned in different orientations and a sectioned package for higher resolution imaging. In contrast a conventional CT system would take hours to record data with potentially poorer resolution. Indeed, the ratio of field-of-view to throughput time is much higher when using the synchrotron radiation tomography setup. The description below of the experimental setup can be implemented and adapted for use with many other multi-materials.

  1. Measurement of gas bremsstrahlung from the insertion device beamlines of the advanced photon source

    SciTech Connect

    Pisharody, M.; Job, P.K.; Magill, S.

    1997-03-01

    High energy electron storage rings generate energetic bremsstrahlung photons through radiative interaction of the electrons (or positrons) with the residual gas molecules inside the storage ring. The resulting radiation exits at an average emittance angle of (m{sub 0}c{sub 2}/E) radian with respect to the electron beam path, where m{sub 0}c{sup 2} is the rest mass of E the electron and E its kinetic energy. Thus, at straight sections of the storage rings, moving electrons will produce a narrow and intense monodirectional photon beam. At synchrotron radiation facilities, where beamlines are channeled out of the storage ring, a continuous gas bremsstrahlung spectrum, with a maximum energy of the electron beam, will be present. There are a number of compelling reasons that a measurement of the bremsstrahlung characteristics be conducted at the Advanced Photon Source (APS) storage ring. Although the number of residual gas molecules present in the storage ring at typical nTorr vacuum is low, because of the long straight paths of the electrons in the storage ring at APS, significant production of bremsstrahlung will be produced. This may pose a radiation hazard. It is then imperative that personnel be shielded from dose rates due to this radiation. There are not many measurements available for gas bremsstrahlung, especially for higher electron beam energies. The quantitative estimates of gas bremsstrahlung from storage rings as evaluated by Monte Carlo codes also have several uncertainties. They are in general calculated for air at atmospheric pressure, the results of which are then extrapolated to typical storage ring vacuum values (of the order of 10{sup -9} Torr). Realistically, the actual pressure profile can vary inside the narrow vacuum chamber. Also, the actual chemical composition of the residual gas inside the storage ring is generally different from that of air.

  2. Research and Development on Advanced Silicon Carbide Thin Film Growth Techniques and Fabrication of High Power and Microwave Frequency Silicon Carbide-Based Device Structures

    DTIC Science & Technology

    1990-12-01

    0W " -Annual Letter Report- N,4 Research and Developmen. on Advanced Silicon Carbide Thin Film Growth Techniques and Fabrication of High Power and...Microwave Frequency Silicon Carbide -Based Device Structures Supported under Grant #N00014-88-K-0341/P00002 Office of the Chief of Naval Research Report...SUBTITLE Research and Development on Advanced S. FUNDING NUMBERS Silicon Carbide Thin Filn.Growth Technl.ques and R&T:212k003---03 Fabrication of High

  3. Advanced Microfabricated Devices for Sensitive Biomarker Detection and Analysis on Mars

    NASA Astrophysics Data System (ADS)

    Skelley, A. M.; Scherer, J. R.; Aubrey, A. D.; Grover, W. H.; Ehrenfreund, P.; Grunthaner, F. J.; Bada, J. L.; Willis, P.; Mathies, R. A.

    2006-12-01

    Detection of life on Mars requires definition of a suitable biomarker and development of sensitive instrumentation capable of performing in situ chemical analyses [1]. Our studies have focused on amino acid analysis because amino acids are more resistant to decomposition than other biomolecules, and because amino acid chirality is a well-defined biomarker. We have developed the Mars Organic Analyzer (MOA), a portable amino acid analysis system that consists of a compact instrument and a novel multi-layer CE microchip, and we have performed extensive laboratory and field validation of this instrument [2]. The heart of the MOA is the 100-mm diameter, 4-mm thick microchip that contains the CE separation channels as well as microfabricated valves and pumps for automated integrated sample preparation and handling. The microfabricated device is operated by a portable instrument that performs CE separation and LIF detection. The limits of detection of fluorescamine-labeled amino acids are in the nM to pM range corresponding to part- per-trillion sensitivities. The MOA has been field tested on soil samples rich in jarosite from the Panoche Valley, CA. These results demonstrate that amines and amino acids can be extracted from sulfate-rich acidic soils such as jarosite and analyzed using the MOA. The MOA was also recently field tested in the Yungay region of the Atacama Desert in Chile. The instrument was successfully operated in this challenging environment and performed over 300 amino acid analyses in a two week period. The MOA has also been used to label and analyze two of the four nucleobases, and methods are being developed to detect PAH's [3]. This presentation will discuss the unique challenges of developing microdevices for sensitive analysis of biomarker compounds. We will also describe current efforts to develop multichannel analysis systems and microfluidic automated analysis systems that will be used to enable flight versions of this instrument. For more details

  4. Highly effective and accurate weak point monitoring method for advanced design rule (1x nm) devices

    NASA Astrophysics Data System (ADS)

    Ahn, Jeongho; Seong, ShiJin; Yoon, Minjung; Park, Il-Suk; Kim, HyungSeop; Ihm, Dongchul; Chin, Soobok; Sivaraman, Gangadharan; Li, Mingwei; Babulnath, Raghav; Lee, Chang Ho; Kurada, Satya; Brown, Christine; Galani, Rajiv; Kim, JaeHyun

    2014-04-01

    Historically when we used to manufacture semiconductor devices for 45 nm or above design rules, IC manufacturing yield was mainly determined by global random variations and therefore the chip manufacturers / manufacturing team were mainly responsible for yield improvement. With the introduction of sub-45 nm semiconductor technologies, yield started to be dominated by systematic variations, primarily centered on resolution problems, copper/low-k interconnects and CMP. These local systematic variations, which have become decisively greater than global random variations, are design-dependent [1, 2] and therefore designers now share the responsibility of increasing yield with manufacturers / manufacturing teams. A widening manufacturing gap has led to a dramatic increase in design rules that are either too restrictive or do not guarantee a litho/etch hotspot-free design. The semiconductor industry is currently limited to 193 nm scanners and no relief is expected from the equipment side to prevent / eliminate these systematic hotspots. Hence we have seen a lot of design houses coming up with innovative design products to check hotspots based on model based lithography checks to validate design manufacturability, which will also account for complex two-dimensional effects that stem from aggressive scaling of 193 nm lithography. Most of these hotspots (a.k.a., weak points) are especially seen on Back End of the Line (BEOL) process levels like Mx ADI, Mx Etch and Mx CMP. Inspecting some of these BEOL levels can be extremely challenging as there are lots of wafer noises or nuisances that can hinder an inspector's ability to detect and monitor the defects or weak points of interest. In this work we have attempted to accurately inspect the weak points using a novel broadband plasma optical inspection approach that enhances defect signal from patterns of interest (POI) and precisely suppresses surrounding wafer noises. This new approach is a paradigm shift in wafer inspection

  5. An Approach for Impression Creep of Lead Free Microelectronic Solders

    NASA Astrophysics Data System (ADS)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  6. Advanced finite-difference time-domain techniques for simulation of optical devices with complex material properties and geometric configurations

    NASA Astrophysics Data System (ADS)

    Zhou, Dong

    2005-11-01

    Modeling and simulation play increasingly more important roles in the development and commercialization of optical devices and integrated circuits. The current trend in photonic technologies is to push the level of integration and to utilize materials and structures of increasing complexity. On the other hand, the superb characteristics of free-space and fiber-optics continue to hold strong position to serve a wide range of applications. All these constitute significant challenges for the computer-aided modeling, simulation, and design of such optical devices and systems. The research work in this thesis deals with investigation and development of advanced finite-difference time-domain (FDTD) methods with focus on emerging optical devices and integrated circuits with complex material and/or structural properties. On the material aspects, we consider in a systematic fashion the dispersive and anisotropic characteristics of different materials (i.e., insulators, semiconductors, and conductors) in a broad wavelength range. The Lorentz model is examined and adapted as a general model for treating the material dispersion in the context of FDTD solutions. A dispersive FDTD method based on the multi-term Lorentz dispersive model is developed and employed for the modeling and design of the optical devices. In the FDTD scheme, the perfectly matched layer (PML) boundary condition is extended to the dispersive medium with arbitrary high order Lorentz terms. Finally, a parameter extraction scheme that links the Lorentz model to the experimental results is established. Further, the dispersive FDTD method is then applied to modeling and simulation of magneto-optical (MO) disk system, in combination of the vector diffraction theory. While the former is used for analysis of the interaction of the focused optical field interacting with the conducting materials on the surface of disk, the latter is to simulate the beam propagation from the objective lens to the disk surface. The

  7. Encapsulation methods and dielectric layers for organic electrical devices

    DOEpatents

    Blum, Yigal D; Chu, William Siu-Keung; MacQueen, David Brent; Shi, Yijan

    2013-07-02

    The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.

  8. Microelectronics at Work: Productivity and Jobs in the World Economy. Worldwatch Paper 39.

    ERIC Educational Resources Information Center

    Norman, Colin

    A combination of revitalized employment policies, greater industrial democracy, and new ways of distributing both the hours of work and the fruits of technological change are essential if the benefits of the microelectronic revolution are to be equitably shared. Microelectronic technology promises an array of benefits, and the electronic age is…

  9. Development of a Ground-Based Analog to the Advanced Resistive Exercise Device Aboard the International Space Station

    NASA Technical Reports Server (NTRS)

    Newby, Nathaniel J.; Scott-Pandorf, M. M.; Caldwell, E.; DeWitt, J.K.; Fincke, R.; Peters, B.T.

    2010-01-01

    NASA and Wyle engineers constructed a Horizontal Exercise Fixture (HEF) that was patented in 2006. Recently modifications were made to HEF with the goal of creating a device that mimics squat exercise on the Advanced Resistive Exercise Device (ARED) and can be used by bed rest subjects who must remain supine during exercise. This project posed several engineering challenges, such as how best to reproduce the hip motions (we used a sled that allowed hip motion in the sagittal plane), how to counterweight the pelvis against gravity (we used a pulley and free-weight mechanism), and how to apply large loads (body weight plus squat load) to the shoulders while simultaneously supporting the back against gravity (we tested a standard and a safety bar that allowed movement in the subject s z-axis, both of which used a retractable plate for back support). METHODS An evaluation of the HEF was conducted with human subjects (3F, 3M), who performed sets of squat exercises of increasing load from 10-repetition maximum (RM) up to 1-RM. Three pelvic counterweight loads were tested along with each of the two back-support squat bars. Data collection included 3-dimensional ground reaction forces (GRF), muscle activation (EMG), body motion (video-based motion capture), and subjective comments. These data were compared with previous ground-based ARED study data. RESULTS All subjects in the evaluation were able to perform low- to high-loading squats on the HEF. Four of the 6 subjects preferred a pelvic counterweight equivalent to 60 percent of their body weight. Four subjects preferred the standard squat bar, whereas 2 female subjects preferred the safety bar. EMG data showed muscle activation in the legs and low back typical of squat motion. GRF trajectories and eccentric-concentric loading ratios were similar to ARED. CONCLUSION: Squat exercise performed on HEF approximated squat exercise on ARED.

  10. Final LDRD report : design and fabrication of advanced device structures for ultra high efficiency solid state lighting.

    SciTech Connect

    Koleske, Daniel David; Bogart, Katherine Huderle Andersen; Shul, Randy John; Wendt, Joel Robert; Crawford, Mary Hagerott; Allerman, Andrew Alan; Fischer, Arthur Joseph

    2005-04-01

    The goal of this one year LDRD was to improve the overall efficiency of InGaN LEDs by improving the extraction of light from the semiconductor chip. InGaN LEDs are currently the most promising technology for producing high efficiency blue and green semiconductor light emitters. Improving the efficiency of InGaN LEDs will enable a more rapid adoption of semiconductor based lighting. In this LDRD, we proposed to develop photonic structures to improve light extraction from nitride-based light emitting diodes (LEDs). While many advanced device geometries were considered for this work, we focused on the use of a photonic crystal for improved light extraction. Although resonant cavity LEDs and other advanced structures certainly have the potential to improve light extraction, the photonic crystal approach showed the most promise in the early stages of this short program. The photonic crystal (PX)-LED developed here incorporates a two dimensional photonic crystal, or photonic lattice, into a nitride-based LED. The dimensions of the photonic crystal are selected such that there are very few or no optical modes in the plane of the LED ('lateral' modes). This will reduce or eliminate any radiation in the lateral direction so that the majority of the LED radiation will be in vertical modes that escape the semiconductor, which will improve the light-extraction efficiency. PX-LEDs were fabricated using a range of hole diameters and lattice constants and compared to control LEDs without a photonic crystal. The far field patterns from the PX-LEDs were dramatically modified by the presence of the photonic crystal. An increase in LED brightness of 1.75X was observed for light measured into a 40 degree emission cone with a total increase in power of 1.5X for an unencapsulated LED.

  11. Ventricular Assist Device Implantation Corrects Myocardial Lipotoxicity, Reverses Insulin Resistance and Normalizes Cardiac Metabolism in Patients with Advanced Heart Failure

    PubMed Central

    Chokshi, Aalap; Drosatos, Konstantinos; Cheema, Faisal H.; Ji, Ruiping; Khawaja, Tuba; Yu, Shuiqing; Kato, Tomoko; Khan, Raffay; Takayama, Hiroo; Knöll, Ralph; Milting, Hendrik; Chung, Christine S.; Jorde, Ulrich; Naka, Yoshifumi; Mancini, Donna M.; Goldberg, Ira J.; Schulze, P. Christian

    2012-01-01

    Background Heart failure is associated with impaired myocardial metabolism with a shift from fatty acids to glucose utilization for ATP generation. We hypothesized that cardiac accumulation of toxic lipid intermediates inhibits insulin signaling in advanced heart failure and that mechanical unloading of the failing myocardium corrects impaired cardiac metabolism. Methods and Results We analyzed myocardium and serum of 61 patients with heart failure (BMI 26.5±5.1 kg/m2, age 51±12 years) obtained during left ventricular assist device (LVAD) implantation and at explantation (mean duration 185±156 days) and from 9 controls. Systemic insulin resistance in heart failure was accompanied by decreased myocardial triglyceride and overall fatty acid content but increased toxic lipid intermediates, diacylglycerol and ceramide. Increased membrane localization of protein kinase C isoforms, inhibitors of insulin signaling, and decreased activity of insulin signaling molecules Akt and FOXO, were detectable in heart failure compared to controls. LVAD implantation improved whole body insulin resistance (HOMA-IR: 4.5±0.6 to 3.2±0.5; p<0.05) and decreased myocardial levels of diacylglycerol and ceramide while triglyceride and fatty acid content remained unchanged. Improved activation of the insulin/PI3kinase/Akt signaling cascade after LVAD implantation was confirmed by increased phosphorylation of Akt and FOXO, which was accompanied by decreased membrane localization of protein kinase C isoforms after LVAD implantation. Conclusions Mechanical unloading after LVAD implantation corrects systemic and local metabolic derangements in advanced heart failure leading to reduced myocardial levels of toxic lipid intermediates and improved cardiac insulin signaling. PMID:22586279

  12. MEMS probes for on-wafer RF microwave characterization of future microelectronics: design, fabrication and characterization

    NASA Astrophysics Data System (ADS)

    Marzouk, Jaouad; Arscott, Steve; El Fellahi, Abdelhatif; Haddadi, Kamel; Lasri, Tuami; Boyaval, Christophe; Dambrine, Gilles

    2015-07-01

    This article presents microelectromechanical system (MEMS) ground-signal-ground (GSG) probes based on silicon-on-insulator (SOI) technology for on-wafer microwave characterization of radio-frequency (RF) microelectronics. The probe is designed using optimized coplanar waveguide structures with the aim of ensuring a low-contact resistance between the probe and the pads of the device under test (DUT). The probes are batch fabricated using SOI substrates and employ a simple silicon micromachining process. The probes have a pitch of 4.5 µm with miniaturized dimensions for a DUT pad area with a similar size. Electrical (dc) measurements show that the fabricated probe has a low-contact resistance (~0.02 Ω) on gold pads. Excellent extracted RF performances of the probe are observed up to 30 GHz, showing an insertion loss better than 2.2 dB and return loss better than 20 dB over the frequency range. An ageing study shows the probes are capable of forming this dc contact for over 6000 contact cycles. The preliminary result of the repeatability of on-wafer one-port measurements with the miniaturized probe shows a consistent RF performance maintained through several contacts. The data indicates that the proposed MEMS probe is suitable for the high-frequency characterization of integrated nanoscale devices having reduced pad dimensions.

  13. In Vivo and in Vitro Evaluations of Repeatability and Accuracy of VITA Easyshade® Advance 4.0 Dental Shade-Matching Device

    PubMed Central

    Illeš, Iva Ž.; Alajbeg, Maja; Žagar

    2015-01-01

    Objectives The objective of this study was to evaluate the intra-device repeatability and accuracy of dental shade-matching device (VITA Easyshade® Advance 4.0) using both in vitro and in vivo models. Materials and methods For the repeatability assessment, the in vivo model utilized shade-matching device to measure the central region of the labial surface of right maxillary central incisors of 10 people twice. The following tooth colors were measured: B1, A1, A2, A3, C1 and C3. The in vitro model included the same six Vitapan Classical tabs. Two measurements were made of the central region of each shade tab. For the accuracy assessment, each shade tab from 3 Vitapan Classical shade guides was measured once. CIE L*a*b* values were determined. Intraclass correlation coefficients (ICCs) were used to analyze the in vitro and in vivo intra-device repeatability of the shade-matching device. The difference between in vitro and in vivo models was analyzed. Accuracy of the device tested was calculated. Results The mean color differences for in vivo and in vitro models were 3.51 and 1.25 E units, respectively. The device repeatability ICCs for in vivo measurements ranged from 0.858 to 0.971 and for in vitro from 0.992 to 0.994. Accuracy of the device tested was 93.75%. Conclusion Within the limitations of the experiment, VITA Easyshade®Advance 4.0 dental shade-matching device enabled reliable and accurate measurement. It can be a valuable tool for the determination of tooth colours. PMID:27688393

  14. Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2000-01-01

    Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS

  15. Devices Materials and Processes for Nanoelectronics: Characterization with Advanced X-Ray Techniques Using Lab-Based and Synchrotron Radiation Sources

    SciTech Connect

    E Zschech; C Wyon; C Murray; G Schneider

    2011-12-31

    Future nanoelectronics manufacturing at extraordinary length scales, new device structures, and advanced materials will provide challenges to process development and engineering but also to process control and physical failure analysis. Advanced X-ray techniques, using lab systems and synchrotron radiation sources, will play a key role for the characterization of thin films, nanostructures, surfaces, and interfaces. The development of advanced X-ray techniques and tools will reduce risk and time for the introduction of new technologies. Eventually, time-to-market for new products will be reduced by the timely implementation of the best techniques for process development and process control. The development and use of advanced methods at synchrotron radiation sources will be increasingly important, particularly for research and development in the field of advanced processes and new materials but also for the development of new X-ray components and procedures. The application of advanced X-ray techniques, in-line, in out-of-fab analytical labs and at synchrotron radiation sources, for research, development, and manufacturing in the nanoelectronics industry is reviewed. The focus of this paper is on the study of nanoscale device and on-chip interconnect materials, and materials for 3D IC integration as well.

  16. Request for assistance in reducing the potential risk of developing cancer from exposure to gallium arsenide in the microelectronics industry

    SciTech Connect

    Not Available

    1987-10-01

    Various methods through which exposure to gallium-arsenide might be reduced in the microelectronics industry were discussed. While there were no reported studies showing ill effects in workers from exposure to gallium arsenide or gallium particulates, three studies in animals indicated that gallium arsenide dissociates into gallium and arsenic in biological tissue, the latter being a carcinogen. NIOSH Recommended Exposure Limit (REL) for arsenic was 2 micrograms/cubic meter air (microg/cu m). NIOSH recommends control of worker exposure to gallium arsenide by observing NIOSH REL for inorganic arsenic, and that concentration of gallium arsenide in air be estimated by determining arsenic. Workers should be educated in possible hazards connected with gallium arsenide exposure. Proper engineering controls should be installed during production of microelectronic devices where exposure to gallium-arsenide is likely. Personal protective clothing and equipment should be available to workers, and proper procedures for washing, removal of wastes, transport, and disposal of contaminated materials should be explained and carried out. Specific safety recommendations are offered for use during crystal growth, crystal puller cleaning, crystal surface grinding and sawing, and wafer polishing, backlapping, and dicing.

  17. Muscle Volume Increases Following 16 Weeks of Resistive Exercise Training with the Advanced Resistive Exercise Device (ARED) and Free Weights

    NASA Technical Reports Server (NTRS)

    Nash, R. E.; Loehr, J. A.; Lee, S. M. C.; English, K. L.; Evans, H.; Smith, S. A.; Hagan, R. D.

    2009-01-01

    Space flight-induced muscle atrophy, particularly in the postural and locomotorymuscles, may impair task performance during long-duration space missions and planetary exploration. High intensity free weight (FW) resistive exercise training has been shown to prevent atrophy during bed rest, a space flight analog. NASA developed the Advanced Resistive Exercise Device (ARED) to simulate the characteristics of FW exercise (i.e. constant mass, inertial force) and to be used as a countermeasure during International Space Station (ISS) missions. PURPOSE: To compare the efficacy of ARED and FW training to induce hypertrophy in specific muscle groups in ambulatory subjects prior to deploying ARED on the ISS. METHODS: Twenty untrained subjects were assigned to either the ARED (8 males, 3 females) or FW (6 males, 3 females) group and participated in a periodizedtraining protocol consisting of squat (SQ), heel raise (HR), and deadlift(DL) exercises 3 d wk-1 for 16 wks. SQ, HR, and DL muscle strength (1RM) was measured before, after 8 wks, and after 16 wks of training to prescribe exercise and measure strength changes. Muscle volume of the vastigroup (V), hamstring group (H), hip adductor group (ADD), medial gastrocnemius(MG), lateral gastrocnemius(LG), and deep posterior muscles including soleus(DP) was measured using MRI pre-and post-training. Consecutive cross-sectional images (8 mm slices with a 2 mm gap) were analyzed and summed. Anatomical references insured that the same muscle sections were analyzed pre-and post-training. Two-way repeated measures ANOVAs (p<0.05) were used to test for differences in muscle strength and volume between training devices. RESULTS: SQ, HR, and DL 1RM increased in both FW (SQ: 49+/-6%, HR: 12+/-2%, DL: 23+/-4%) and ARED (SQ: 31+/-4%, HR: 18+/-2%, DL: 23+/-3%) groups. Both groups increased muscle volume in the V (FW: 13+/-2%, ARED: 10+/-2%), H (FW: 3+/-1%, ARED: 3+/-1 %), ADD (FW: 15=/-2%, ARED: 10+/-1%), LG (FW: 7+/-2%, ARED: 4+/-1%), MG (FW

  18. Japanese technology assessment: Computer science, opto- and microelectronics mechatronics, biotechnology

    SciTech Connect

    Brandin, D.; Wieder, H.; Spicer, W.; Nevins, J.; Oxender, D.

    1986-01-01

    The series studies Japanese research and development in four high-technology areas - computer science, opto and microelectronics, mechatronics (a term created by the Japanese to describe the union of mechanical and electronic engineering to produce the next generation of machines, robots, and the like), and biotechnology. The evaluations were conducted by panels of U.S. scientists - chosen from academia, government, and industry - actively involved in research in areas of expertise. The studies were prepared for the purpose of aiding the U.S. response to Japan's technological challenge. The main focus of the assessments is on the current status and long-term direction and emphasis of Japanese research and development. Other aspects covered include evolution of the state of the art; identification of Japanese researchers, R and D organizations, and resources; and comparative U.S. efforts. The general time frame of the studies corresponds to future industrial applications and potential commercial impacts spanning approximately the next two decades.

  19. Pattern-integrated interference lithography: prospects for nano- and microelectronics.

    PubMed

    Leibovici, Matthieu C R; Burrow, Guy M; Gaylord, Thomas K

    2012-10-08

    In recent years, limitations in optical lithography have challenged the cost-effective manufacture of nano- and microelectronic chips. Spatially regular designs have been introduced to improve manufacturability. However, regular designed layouts typically require an interference step followed by a trim step. These multiple steps increase cost and reduce yield. In the present work, Pattern-Integrated Interference Lithography (PIIL) is introduced to address this problem. PIIL is the integration of interference lithography and superposed pattern mask imaging, combining the interference and the trim into a single-exposure step. Example PIIL implementations and experimental demonstrations are presented. The degrees of freedom associated with the source, pattern mask, and Fourier filter designs are described.

  20. Using microelectronics technology to communicate with living cells.

    PubMed

    Heer, F; Hafizovic, S; Ugniwenko, T; Frey, U; Roscic, B; Blau, A; Hierlemann, A

    2007-01-01

    A monolithic microsystem in CMOS (complementary metal oxide semiconductor) technology is presented that provides bidirectional communication (stimulation and recording) between standard microelectronics and cultured electrogenic cells. The 128-electrode chip can be directly used as a substrate for cell culturing. It features circuitry units for stimulation and immediate cell signal treatment near each electrode. In addition, it provides on-chip A/D conversion as well as a digital interface so that a fast interaction is possible at good signal quality. Spontaneous and stimulated electrical activity recordings with neuronal and cardiac cell cultures will be presented. The system can be used to, e.g., study the behavior and development of neural networks in vitro, to reveal the effects of neuronal plasticity and to study network activity in response to pharmacological treatments.

  1. Smallest Nanoelectronic with Atomic Devices with Precise Structures

    NASA Technical Reports Server (NTRS)

    Yamada, Toshishige

    2000-01-01

    Since its invention in 1948, the transistor has revolutionized our everyday life - transistor radios and TV's appeared in the early 1960s, personal computers came into widespread use in the mid-1980s, and cellular phones, laptops, and palm-sized organizers dominated the 1990s. The electronics revolution is based upon transistor miniaturization; smaller transistors are faster, and denser circuitry has more functionality. Transistors in current generation chips are 0.25 micron or 250 nanometers in size, and the electronics industry has completed development of 0.18 micron transistors which will enter production within the next few years. Industry researchers are now working to reduce transistor size down to 0.13 micron - a thousandth of the width of a human hair. However, studies indicate that the miniaturization of silicon transistors will soon reach its limit. For further progress in microelectronics, scientists have turned to nanotechnology to advance the science. Rather than continuing to miniaturize transistors to a point where they become unreliable, nanotechnology offers the new approach of building devices on the atomic scale [see sidebar]. One vision for the next generation of miniature electronics is atomic chain electronics, where devices are composed of atoms aligned on top of a substrate surface in a regular pattern. The Atomic Chain Electronics Project (ACEP) - part of the Semiconductor Device Modeling and Nanotechnology group, Integrated Product Team at the NAS Facility has been developing the theory of understanding atomic chain devices, and the author's patent for atomic chain electronics is now pending.

  2. Microwave and millimeter-wave resonant-tunneling devices

    NASA Technical Reports Server (NTRS)

    Sollner, T. C. L. Gerhard; Le, Han Quang; Brown, E. L.

    1988-01-01

    Resonant-tunneling devices in microelectronic component form, whose structure is the electron analog of a Fabry-Perot resonator, encompass oscillators, self-oscillating mixers, and harmonic multipliers. The negative differential resistance characteristic of these devices has been obtained at room temperature, and resonant-tunneling transistors capable of operation in the THz-frequency range appear to be feasible. Three-terminal resonant-tunneling device development is in its infancy, as is that of devices for digital applications.

  3. Thermo-mechanical analysis of fixed mask 1 for the Advanced Photon Source insertion device front ends

    SciTech Connect

    Nian, H.L.T.; Shu, D.; Sheng, I.C.A.; Kuzay, T.M.

    1993-10-01

    The first fixed mask (FM1) is one of the critical elements on the insertion device front ends of the beamlines at the Advanced Photon Source (APS) now under construction at Argonne National Laboratory (ANL). The heat flux from the APS undulators is enormous. For example, FM1 placed at a distance of 16 m from the Undulator A source will be subjected to 519 W/mm{sup 2} at normal incidence with a total power of 3.8 kW. Due to a high localized thermal gradient on this component, inclined geometry (1.5{degree}) is used in the design to spread the footprint of the x-ray beam. A box-cone-shape geometry was designed due to the limited space available in the front end. The box shape is a highly constrained geometry, which induces larger stress levels than would occur in a plate or a tube. In order to handle the expected higher stress and the stress concentration at the corners, a single Glidcop block (rather than copper) was used in the construction. The FM1 uses an enhanced heat transfer mechanism developed at Argonne National Laboratory, which increases the convective heat transfer coefficient to about 3 W/cm{sup 2}{center_dot}{degree}C with single-phase water as the coolant. The authors simulated the location of the x-ray beam in several places to cover the worst possible case. The maximum temperature (about 180{degree}C) occurs when the beam hits the center of horizontal surface. The maximum effective stress (about 313 MPa) occurs when the x-ray beam hits about the corners.

  4. An Approach To Fabricate PDMS Encapsulated All-Solid-State Advanced Asymmetric Supercapacitor Device with Vertically Aligned Hierarchical Zn-Fe-Co Ternary Oxide Nanowire and Nitrogen Doped Graphene Nanosheet for High Power Device Applications.

    PubMed

    Maitra, Anirban; Das, Amit Kumar; Bera, Ranadip; Karan, Sumanta Kumar; Paria, Sarbaranjan; Si, Suman Kumar; Khatua, Bhanu Bhusan

    2017-02-22

    We highlight the design and fabrication of a polydimethylsiloxane (PDMS) encapsulated advanced all-solid-state asymmetric supercapacitor (ASC) device consisting of hierarchical mesoporous zinc-iron-cobalt ternary oxide (ZICO) nanowire coated nickel (Ni) foam (ZICO@Ni foam) as a promising positive electrode and nitrogen doped graphene coated Ni foam (N-G@Ni foam) as negative electrode in the presence of PVA-KOH gel electrolyte. Owing to outstanding electrochemical behavior and ultrahigh specific capacitance of ZICO (≈ 2587.4 F/g at 1 A/g) and N-G (550 F/g at 1 A/g) along with their mutual synergistic outputs, the assembled all-solid-state ASC device exhibits an outstanding energy density of ≈40.5 Wh/kg accompanied by a remarkable long-term cycle stability with ≈95% specific capacitance retention even after 5000 charge-discharge cycles. The exclusive hierarchical ZICO nanowires were synthesized by a facile two-step process comprising of a hydrothermal protocol followed by an annealing treatment on a quartz substrate. While Zn(2+) gives the stability of the oxide system, Fe and Co ions provide better electronic conductivity and capacitive response under vigorous cyclic condition. The extraordinary performance of as-fabricated ASC device resembles its suitability for the construction of advanced energy storage devices in modern electronic industries.

  5. Research and Development on Advanced Silicon Carbide Thin Film Growth Techniques and Fabrication of High Power and Microwave Frequency Silicon Carbide-Based Device Structures

    DTIC Science & Technology

    1991-12-01

    AD-A243 531IIII!IIHUHllAlll| DTIC Annual Letter Report EL Vr DECA S C Research and Development on Advanced Silicon Carbide Thin Film Growth...Techniques and Fabrication of High Power and Microwave Frequency Silicon Carbide -Based Device Structures Supported under Grant #N00014-88-K-0341/P00002 Office...Letter l/,1- 2 3 lj9 l 4. TITLE AND SUBTITLE Research and Develp~nt on Advanced S. FUNDING NUMBERS Silicon Carbide Thin Film .Growth Techniques and R&T

  6. Feasibility of Observing and Characterizing Single Ion Strikes in Microelectronic Components.

    SciTech Connect

    Dingreville, Remi Philippe Michel; Hattar, Khalid Mikhiel; Bufford, Daniel Charles

    2015-11-01

    The transient degradation of semiconductor device performance under irradiation has long been an issue of concern. A single high-energy charged particle can degrade or permanently destroy the microelectronic component, potentially altering the course or function of the systems. Disruption of the the crystalline structure through the introduction of quasi-stable defect structures can change properties from semiconductor to conductor. Typically, the initial defect formation phase is followed by a recovery phase in which defect-defect or defect-dopant interactions modify the characteristics of the damaged structure. In this LDRD Express, in-situ ion irradiation transmission microscopy (TEM) in-situ TEM experiments combined with atomistic simulations have been conducted to determine the feasibility of imaging and characterizing the defect structure resulting from a single cascade in silicon. In-situ TEM experiments have been conducted to demonstrate that a single ion strike can be observed in Si thin films with nanometer resolution in real time using the in-situ ion irradiation transmission electron microscope (I3TEM). Parallel to this experimental effort, ion implantation has been numerically simulated using Molecular Dynamics (MD). This numerical framework provides detailed predictions of the damage and follow the evolution of the damage during the first nanoseconds. The experimental results demonstrate that single ion strike can be observed in prototypical semiconductors.

  7. Electrodeposition of platinum-iridium alloy nanowires for hermetic packaging of microelectronics.

    PubMed

    Petrossians, Artin; Whalen, John J; Weiland, James D; Mansfeld, Florian

    2012-01-01

    An electrodeposition technique was applied for fabrication of dense platinum-iridium alloy nanowires as interconnect structures in hermetic microelectronic packaging to be used in implantable devices. Vertically aligned arrays of platinum-iridium alloy nanowires with controllable length and a diameter of about 200 nm were fabricated using a cyclic potential technique from a novel electrodeposition bath in nanoporous aluminum oxide templates. Ti/Au thin films were sputter deposited on one side of the alumina membranes to form a base material for electrodeposition. Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS) were used to characterize the morphology and the chemical composition of the nanowires, respectively. SEM micrographs revealed that the electrodeposited nanowires have dense and compact structures. EDS analysis showed a 60:40% platinum-iridium nanowire composition. Deposition rates were estimated by determining nanowire length as a function of deposition time. High Resolution Transmission Electron Microscopy (HRTEM) images revealed that the nanowires have a nanocrystalline structure with grain sizes ranging from 3 nm to 5 nm. Helium leak tests performed using a helium leak detector showed leak rates as low as 1 × 10(-11) mbar L s(-1) indicating that dense nanowires were electrodeposited inside the nanoporous membranes. Comparison of electrical measurements on platinum and platinum-iridium nanowires revealed that platinum-iridium nanowires have improved electrical conductivity.

  8. Laser ultrasonic characterization of membranes for use as micro-electronic mechanical systems (MEMS)

    NASA Astrophysics Data System (ADS)

    Edwards, R. S.; Zhou, L. Q.; Pearce, M. J.; Prince, R. G.; Colston, G.; Myronov, M.; Leadley, D. R.; Trushkevych, O.

    2017-02-01

    Germanium (Ge) on Silicon (Si) has the potential to produce a wide variety of devices, including sensors, solar cells and transistors. Modification of these materials so that a suspended membrane layer is formed, through removing regions of the Si substrate, offers the potential for sensors with a more rapid response and higher sensitivity. Such membranes are a very simple micro-electronic mechanical system (MEMS). It is essential to ensure that the membranes are robust against shock and vibration, with well-characterised resonant frequencies, prior to any practical application. We present work using laser interferometry to characterise the resonant modes of membranes produced from Ge or silicon carbide (SiC) on a Si substrate, with the membranes typically having around 1 mm lateral dimensions. Two dimensional scanning of the sample enables visualisation of each mode. The stress measured from the resonant frequencies agrees well with that calculated from the growth conditions. SiC provides a more robust platform for electronics, while Ge offers better resonant properties. This offers a potential technique for characterising production quality or lifetime testing for the MEMS produced.

  9. Accelerating tomorrow's opto-electronic technologies: a comprehensive introduction to advanced optoelectronic materials and devices in the National Hi-Tech R&D Plan (863-Plan)

    NASA Astrophysics Data System (ADS)

    Jiang, Shan; Chen, Haoming; Ren, Xiaomin; Wang, Zhigong; Qian, Longsheng; Zhang, Rong; Feng, Songlin; Yang, Hui; Xu, Ningsheng

    2004-05-01

    The National Hi-Tech R&D Program (the 863-Program) is to enhance China's international competitiveness and improve China's overall capability of R&D in high technology and to bridge the gap between the laboratory and the marketplace. Advanced Optoelectronic Materials and Devices are one of the technology areas strategically important to China's information industry. It has been one of the major priority research fields funded by the 863 Program even since 1987 when the plan was first initiated. From the viewpoint of Priority Expert Group (PEG), this paper will give a comprehensive introduction to advanced optoelectronic materials and devices in the national 863-Program during the current five years period (up to 2005) which includes the main aims and goals and especially the main content of each subject.

  10. Pilot Investigation into the Ruggedized Advanced Pathogen Detection Device (R.A.P.I.D.) for Dengue Detection in East Timor

    DTIC Science & Technology

    2003-06-01

    were modified for real - time PCR using a LightCycler. Two reporter fluorochromes, the double stranded DNA specific dye SYBR Green I, and 6-hydroxy...fluorescein conjugated to TaqMan DNA probes, were employed to detect positive reactions. Following optimisation of the assays for real - time PCR , portable... real - time PCR equipment, the Ruggedized Advanced Pathogen Detection Device (R.A.P.I.D.(trademark)), was deployed to East Timor and a field trial was

  11. Recent advances in polymer solar cells: realization of high device performance by incorporating water/alcohol-soluble conjugated polymers as electrode buffer layer.

    PubMed

    He, Zhicai; Wu, Hongbin; Cao, Yong

    2014-02-01

    This Progress Report highlights recent advances in polymer solar cells with special attention focused on the recent rapid-growing progress in methods that use a thin layer of alcohol/water-soluble conjugated polymers as key component to obtain optimized device performance, but also discusses novel materials and device architectures made by major prestigious institutions in this field. We anticipate that due to drastic improvements in efficiency and easy utilization, this method opens up new opportunities for PSCs from various material systems to improve towards 10% efficiency, and many novel device structures will emerge as suitable architectures for developing the ideal roll-to-roll type processing of polymer-based solar cells.

  12. In Vivo Evaluations of Inter-Observer Reliability Using VITA Easyshade® Advance 4.0 Dental Shade-Matching Device

    PubMed Central

    KNEZOVIĆ, Dubravka; ZLATARIĆ, Davor; Illeš, Iva Ž.; Alajbeg, Maja; Žagar

    2016-01-01

    Objectives The aim of this study was to evaluate the inter-observer reliability of dental shade-matching device using an in vivo model. Materials and methods Four observers who were well trained in color assessment and handling of the dental shade-matching device determined teeth color and CIE-Lab values on maxillary right central incisors in 10 patients with completely healthy and intact dentitions. VITA Easyshade® Advance 4.0 shade-matching device was utilized to measure the central region of the labial surface of all investigated teeth, twice by each observer. The inter-observer reliability of the measurements was observed and deviations between Lab and ∆E values between the observers were calculated. Intraclass correlation coefficients (ICCs) were used to analyze inter-observer reliability. Results One-way ANOVA showed no statistically significant differences in color measurement of four observers in all the measured values (p>0.05). Delta E values ranged from 3.018 to 5.234. Although some small differences existed, statistically significant differences between the observers were not found (p>0.05). Inter-observer ICCs were very high for all observers (from 0.651 to 0.992). Conclusion Inter-examiner reliability of measurements using VITA Easyshade® Advance 4.0 shade-matching device was acceptable. Apart from the digital equipment, a well trained observer seems to be crucial in order to achieve correct dental color measurement. PMID:27688424

  13. Fundamentals of Modern VLSI Devices

    NASA Astrophysics Data System (ADS)

    Taur, Yuan; Ning, Tak H.

    1998-10-01

    This book examines in detail the basic properties and design, including chip integration, of CMOS and bipolar VLSI devices and discusses the various factors that affect their performance. The authors begin with a thorough review of the relevant aspects of semiconductor physics, and proceed to a description of the design of CMOS and bipolar devices. The optimization of these devices for VLSI applications is also covered. The authors highlight the intricate interdependencies and subtle tradeoffs between those device parameters, such as power consumption and packing density, that affect circuit performance and manufacturability. They also discuss in detail the scaling, and physical limits to the scaling, of CMOS and bipolar devices. The book contains many exercises, and can be used as a textbook for senior undergraduate or first-year graduate courses on microelectronics or VLSI devices. It will also be a valuable reference volume for practicing engineers involved in research and development in the electronics industry.

  14. C-scan transmission ultrasound based on a hybrid microelectronic sensor array and its physical performance

    NASA Astrophysics Data System (ADS)

    Lo, Shih-Chung B.; Rich, David; Lasser, Marvin E.; Kula, John; Zhao, Hui; Lasser, Bob; Freedman, Matthew T.

    2001-05-01

    A C-scan through-transmission ultrasound system has been constructed based on a patented hybrid microelectronic array that is capable of generating ultrasound images with fluoroscopic presentation. To generate real-time images, ultrasound is introduced into the object under study with a large unfocused plane wave source. The resultant pressure wave strikes the object and is attenuated and scattered. The device detects scattered as well as attenuated ultrasound energy which allows the use of an acoustic lens to focus on detected energy from an object plane. The acoustic lens collects the transmitted energy and focuses it onto the ultrasound sensitive array. The array is made up to two components, a silicon detector/readout array and a piezoelectric material that is deposited onto the array through semiconductor processing. The array is 1 cm on a side consisting of 128x128 pixel elements with 85micrometers pixel spacing. The energy that strikes the piezoelectric material is converted to an analog voltage that is digitized and processed by low cost commercial video electronics. The images generated by the device appear with no speckle artifact with fluoroscopy-like presentation. The images show no obvious geometrical distortion. The experimental results indicated that the system has a spatial resolution of 0.32 mm. It can resolve 3mm objects with low differential contrast and an attenuation coefficient difference less than 0.07 dB/cm/MHz. Phase contrast of the objects are also clearly measurable. A presentation of a C- scan image guided breast biopsy was demonstrated. In addition, punctured needle tracks in a tumor was clearly observed. This implies the potential of observing the spiculation of masses in vivo.

  15. Advances in superconducting quantum electronic microcircuit fabrication

    NASA Technical Reports Server (NTRS)

    Kirschman, R. K.; Notarys, H. A.; Mercereau, J. E.

    1975-01-01

    Standard microelectronic fabrication techniques have been utilized to produce batch quantities of superconducting quantum electronic devices and circuits. The overall goal is a fabrication technology yielding circuits that are rugged and stable and capable of being fabricated controllably and reproducibly in sizeable quantities. Our progress toward this goal is presented, with primary emphasis on the most recent work, which includes the use of electron-beam lithography and techniques of hybrid microelectronics. Several prototype microcircuits have been successfully fabricated. These microcircuits are formed in a thin-film parent material consisting of layers of superconducting and normal metals, and use proximity-effect structures as the active circuit elements.

  16. Wireless link and microelectronics design for retinal prostheses

    SciTech Connect

    Liu, Wentai

    2012-02-29

    This project focuses on delivering power and data to the artificial retinal implant inside the eye and the implant microstimulator electronics which delivers the current pulses to stimulate the retinal layer to elicit visual perception. Since the use of invasive means such as tethering wires to transmit power and data results in discomfort to the patients which could eventually cause infection due to the abrasion caused by the wire and contact of the internals of the eye to the external environment, a completely wireless approach is used to transfer both power and data. Power is required inside the eye for the microelectronic implant which uses a dual voltage supply scheme (positive and negative) to deliver biphasic (anodic and cathodic) current pulses. Data in the form of digital bits from the data transmitter external to the eye, carries information about the amplitude, phase width, interphase delay, stimulation sequence for each implant electrode. The data receiver unit decodes the digital stream and the microstimulator unit generates the appropriate current stimuli. Since the external unit consisting of the power transmitter can experience coupling a variation with the power receiver due to the patient’s movements, a closed loop approach is used which varies the transmitted power dynamically to automatically compensate for such movements. This report presents the salient features of this research activities and results.

  17. Precise selective deposition of microparticles on electrodes of microelectronic chips

    NASA Astrophysics Data System (ADS)

    Nesterov, Alexander; König, Kai; Felgenhauer, Thomas; Lindenstruth, Volker; Trunk, Ulrich; Fernandez, Simon; Hausmann, Michael; Ralf Bischoff, F.; Breitling, Frank; Stadler, Volker

    2008-03-01

    We examined the high precision deposition of toner and polymer microparticles with a typical size of ˜10μm on electrode arrays with electrodes of 100μm and below using custom-made microelectronic chips. Selective desorption of redundant particles was employed to obtain a given particle pattern from preadsorbed particle layers. Microparticle desorption was regulated by dielectrophoretic attracting forces generated by individual pixel electrodes, tangential detaching forces of an air flow, and adhesion forces on the microchip surface. A theoretical consideration of the acting forces showed that without pixel voltage, the tangential force applied for particle detachment exceeded the particle adhesion force. When the pixel voltage was switched on, however, the sum of attracting forces was larger than the tangential detaching force, which was crucial for desorption efficiency. In our experiments, appropriately large dielectrophoretic forces were achieved by applying high voltages of up to 100V on the pixel electrodes. In addition, electrode geometries on the chip's surface as well as particle size influenced the desorption quality. We further demonstrated the compatibility of this procedure to complementary metal oxide semiconductor chip technology, which should allow for an easy technical implementation with respect to high-resolution microparticle deposition.

  18. Piezoelectric-nanowire-enabled power source for driving wireless microelectronics.

    PubMed

    Xu, Sheng; Hansen, Benjamin J; Wang, Zhong Lin

    2010-10-19

    Harvesting energy from irregular/random mechanical actions in variable and uncontrollable environments is an effective approach for powering wireless mobile electronics to meet a wide range of applications in our daily life. Piezoelectric nanowires are robust and can be stimulated by tiny physical motions/disturbances over a range of frequencies. Here, we demonstrate the first chemical epitaxial growth of PbZr(x)Ti(1-x)O(3) (PZT) nanowire arrays at 230 °C and their application as high-output energy converters. The nanogenerators fabricated using a single array of PZT nanowires produce a peak output voltage of ~0.7 V, current density of 4 μA cm(-2) and an average power density of 2.8 mW cm(-3). The alternating current output of the nanogenerator is rectified, and the harvested energy is stored and later used to light up a commercial laser diode. This work demonstrates the feasibility of using nanogenerators for powering mobile and even personal microelectronics.

  19. Drug-induced sleep endoscopy as a selection tool for mandibular advancement therapy by oral device in patients with mild to moderate obstructive sleep apnoea.

    PubMed

    De Corso, E; Bastanza, G; Della Marca, G; Grippaudo, C; Rizzotto, G; Marchese, M R; Fiorita, A; Sergi, B; Meucci, D; Di Nardo, W; Paludetti, G; Scarano, E

    2015-12-01

    Nowadays oral appliance therapy is recognised as an effective therapy for many patients with primary snoring and mild to moderate obstructive sleep apnoea (OSA), as well as those with more severe OSA who cannot tolerate positive airway pressure (PAP) therapies. For this reason, it is important to focus on objective criteria to indicate which subjects may benefit from treatment with a mandibular advancement device (MAD). Various anthropometric and polysomnographic predictors have been described in the literature, whereas there are still controversies about the role of drug-induced sleep endoscopy (DISE) and advancement bimanual manoeuvre as predictor factors of treatment outcome by oral device. Herein, we report our experience in treatment of mild moderate OSA by oral appliance selected by DISE. We performed a single institution, longitudinal prospective evaluation of a consecutive group of mild moderate patients with obstructive sleep apnoea syndrome who underwent DISE. During sleep endoscopy, gentle manoeuvre of mandibular advancement less than 5 mm was performed. In 30 of 65 patients (46.2%) we obtained an unsuccessful improvement of airway patency whereas in 35 of 65 patients (53.8%) the improvement was successful and patients were considered suitable for oral device application. Because 7 of 35 patients were excluded due to conditions interfering with oral appliance therapy, we finally treated 28 patients. After 3 months of treatment, we observed a significant improvement in the Epworth medium index [(7.35 ± 2.8 versus 4.1 ± 2.2 (p < 0.05)], in mean AHI [(21.4 ± 6 events per hour versus 8.85 ± 6.9 (p < 0.05)] and in mean ODI [(18.6 ± 8 events per hour to 7 ± 5.8 (p < 0.05)]. We observed that the apnoea/hypopnoea index (AHI) improved by up to 50% from baseline in 71.4% of patients selected after DISE for MAD therapy. In the current study, mandibular advancement splint therapy was successfully prescribed on the basis not only of severity of disease, as

  20. Growth and characterization of silicon-based optoelectronic devices

    NASA Astrophysics Data System (ADS)

    Filios, Adam A.

    Photonics, a blending of optics and electronics, has emerged as one of the world's most rapidly developing fields. Along with microelectronics, they constitute the core technologies of the information industry, and their advances are complementing each other in the tasks of the acquisition, transmission, storage, and processing of increasing amounts of information. Microelectronic device integration has progressed to the point that complete "systems-on-the-chip" have been realized. Photonic materials need to be integrated with standard electronic circuits for the implementation of the next generation optoelectronic "super-chip" where both electrons and photons participate in the transmission and processing of information. Silicon is the cornerstone material in conventional VLSI systems. However, having a relatively small and indirect fundamental energy band-gap, silicon is an inefficient lightemitter. On the other hand, direct integration of III-V photonic materials on a silicon chip is still very problematic. Squeezing light out of silicon itself appears to be an attractive alternative. Light emission from silicon is an important fundamental issue with enormous technological implications. In this work we explore several strategies towards developing silicon based optoelectronic devices. Porous silicon, a material produced by electrochemically etching silicon in aqueous hydrofluoric acid solutions, generated great interest in the early 1990s when it was shown to exhibit relatively bright, room temperature, visible photoluminescence. However, having a poor surface morphology, the material is fragile and chemically unstable leading to degradation of light emission and preventing integration with silicon processing technology. With the development of the epitaxially grown crystalline-Si/O superlattice, we attempt to overcome the morphological problems of porous silicon, retaining its light emission characteristics. Our multilayer c-Si/O device consists of thin silicon

  1. Multi-scale radiographic applications in microelectronic industry

    NASA Astrophysics Data System (ADS)

    Gluch, J.; Löffler, M.; Meyendorf, N.; Oppermann, M.; Röllig, M.; Sättler, P.; Wolter, K. J.; Zschech, E.

    2016-02-01

    New concepts in assembly technology boost our daily life in an unknown way. High end semiconductor industry today deals with functional structures down to a few nanometers. ITRS roadmap predicts an ongoing decrease of the "DRAM half pitch" over the next decade. Packaging of course is not intended to realize pitches at the nanometer scale, but has to face the challenges of integrating such semiconductor devices with smallest pitch and high pin counts into systems. System integration (SiP, SoP, Hetero System Integration etc.) into the third dimension is the only way to reduce the gap between semiconductor level and packaging level interconnection. The described development is mainly driven by communication technology but also other branches like power electronics benefit from the vast progress in integration and assembly technology. The challenge of advanced packaging requires new nondestructive evaluation (NDE) techniques for technology development and production control. In power electronics production the condition monitoring receives a lot of interest to avoid electrical shortcuts, dead solder joints and interface cracking. It is also desired to detect and characterize very small defects like transportation phenomenon or Kirkendall voids. For this purpose imaging technologies with resolutions in the sub-micron range are required. Our presentation discusses the potentials and the limits of X-ray NDE techniques, illustrated by crack observation in solder joints, evaluation of micro vias in PCBs and interposers and the investigation of solder material composition and other aftermaths of electro migration in solder joints. Applied radiographic methods are X-ray through transmission, multi-energy techniques, laminography, CT and nano-CT.

  2. Bridging to Heart Transplantation from the Biventricular Pulsatile Berlin Heart EXCOR Assist Device Support in a Patient with Advanced End-Organ Failure

    PubMed Central

    Tuba Demirozu, Zumrut; Suha Kucukaksu, Deniz

    2015-01-01

    Long-term mechanical circulatory support is a life-saving technology while briding to heart transplantation. It increases the quality of life and preserves end-organ function for patients with advanced heart failure. The number of patients with advanced heart failure scheduled for heart transplantation before comorbidities escalate is on the rise. However, the device function is complicated by the bleeding-thrombosis and infection paradigm, hence the interest in understanding device thrombosis and infection. We describe a 27-year-old man with idiopathic cardiomyopathy, advanced end-organ failure, and severe infection, who was bridged to heart transplantation after 8 months on the Berlin Heart EXCOR (Berlin Heart AG, Berlin, Germany) biventricular support. The patient was discharged from the hospital in the third postoperative week after the recovery of his end-organ functions. At 29 months’ post-transplantation follow-up, his last cardiac biopsy was grade 0, his ejection fraction was 60%, and he was enjoying a good quality of life. PMID:26985209

  3. 75 FR 25763 - Addition to the List of Validated End-Users: Advanced Micro Devices China, Inc.

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-05-10

    ... ``development'' and ``production'' of integrated circuits for commercial applications), 4D001, 4D002, 4D003 and... to the ``development'' 215021. and ``production'' of integrated Advanced Micro circuits...

  4. Monolithic silicon photonics in a sub-100nm SOI CMOS microprocessor foundry: progress from devices to systems

    NASA Astrophysics Data System (ADS)

    Popović, Miloš A.; Wade, Mark T.; Orcutt, Jason S.; Shainline, Jeffrey M.; Sun, Chen; Georgas, Michael; Moss, Benjamin; Kumar, Rajesh; Alloatti, Luca; Pavanello, Fabio; Chen, Yu-Hsin; Nammari, Kareem; Notaros, Jelena; Atabaki, Amir; Leu, Jonathan; Stojanović, Vladimir; Ram, Rajeev J.

    2015-02-01

    We review recent progress of an effort led by the Stojanović (UC Berkeley), Ram (MIT) and Popović (CU Boulder) research groups to enable the design of photonic devices, and complete on-chip electro-optic systems and interfaces, directly in standard microelectronics CMOS processes in a microprocessor foundry, with no in-foundry process modifications. This approach allows tight and large-scale monolithic integration of silicon photonics with state-of-the-art (sub-100nm-node) microelectronics, here a 45nm SOI CMOS process. It enables natural scale-up to manufacturing, and rapid advances in device design due to process repeatability. The initial driver application was addressing the processor-to-memory communication energy bottleneck. Device results include 5Gbps modulators based on an interleaved junction that take advantage of the high resolution of the sub-100nm CMOS process. We demonstrate operation at 5fJ/bit with 1.5dB insertion loss and 8dB extinction ratio. We also demonstrate the first infrared detectors in a zero-change CMOS process, using absorption in transistor source/drain SiGe stressors. Subsystems described include the first monolithically integrated electronic-photonic transmitter on chip (modulator+driver) with 20-70fJ/bit wall plug energy/bit (2-3.5Gbps), to our knowledge the lowest transmitter energy demonstrated to date. We also demonstrate native-process infrared receivers at 220fJ/bit (5Gbps). These are encouraging signs for the prospects of monolithic electronics-photonics integration. Beyond processor-to-memory interconnects, our approach to photonics as a "More-than- Moore" technology inside advanced CMOS promises to enable VLSI electronic-photonic chip platforms tailored to a vast array of emerging applications, from optical and acoustic sensing, high-speed signal processing, RF and optical metrology and clocks, through to analog computation and quantum technology.

  5. Advanced in-line optical metrology of sub-10nm structures for gate all around devices (GAA)

    NASA Astrophysics Data System (ADS)

    Muthinti, Raja; Loubet, Nicolas; Chao, Robin; Ott, John; Guillorn, Michael; Felix, Nelson; Gaudiello, John; Lund, Parker; Cepler, Aron; Sendelbach, Matthew; Cohen, Oded; Wolfling, Shay; Bozdog, Cornel; Klare, Mark

    2016-03-01

    Gate-all-around (GAA) nanowire (NW) devices have long been acknowledged as the ultimate device from an electrostatic scaling point of view. The GAA architecture offers improved short channel effect (SCE) immunity compared to single and double gate planar, FinFET, and trigate structures. One attractive proposal for making GAA devices involves the use of a multilayer fin-like structure consisting of layers of Si and SiGe. However, such structures pose various metrology challenges, both geometrical and material. Optical Scatterometry, also called optical critical dimension (OCD) is a fast, accurate and non-destructive in-line metrology technique well suited for GAA integration challenges. In this work, OCD is used as an enabler for the process development of nanowire devices, extending its abilities to learn new material and process aspects specific to this novel device integration. The specific metrology challenges from multiple key steps in the process flow are detailed, along with the corresponding OCD solutions and results. In addition, Low Energy X-Ray Fluorescence (LE-XRF) is applied to process steps before and after the removal of the SiGe layers in order to quantify the amount of Ge present at each step. These results are correlated to OCD measurements of the Ge content, demonstrating that both OCD and LE-XRF are sensitive to Ge content for these applications.

  6. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea

    PubMed Central

    Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

    2015-01-01

    Objectives Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Methods Based on claim data from the National Health Insurance (2008–2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Results Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Conclusions Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results. PMID:25938673

  7. Recent advances in particle and droplet manipulation for lab-on-a-chip devices based on surface acoustic waves.

    PubMed

    Wang, Zhuochen; Zhe, Jiang

    2011-04-07

    Manipulation of microscale particles and fluid liquid droplets is an important task for lab-on-a-chip devices for numerous biological researches and applications, such as cell detection and tissue engineering. Particle manipulation techniques based on surface acoustic waves (SAWs) appear effective for lab-on-a-chip devices because they are non-invasive, compatible with soft lithography micromachining, have high energy density, and work for nearly any type of microscale particles. Here we review the most recent research and development of the past two years in SAW based particle and liquid droplet manipulation for lab-on-a-chip devices including particle focusing and separation, particle alignment and patterning, particle directing, and liquid droplet delivery.

  8. [Projects to accelerate the practical use of innovative medical devices to collaborate with TWIns, Center for Advanced Biomedical Sciences, Waseda University and School of Engineering, The University of Tokyo].

    PubMed

    Niimi, Shingo; Umezu, Mitsuo; Iseki, Hiroshi; Harada, Hiroshi Kasanuki Noboru; Mitsuishi, Mamoru; Kitamori, Takehiko; Tei, Yuichi; Nakaoka, Ryusuke; Haishima, Yuji

    2014-01-01

    Division of Medical Devices has been conducting the projects to accelerate the practical use of innovative medical devices to collaborate with TWIns, Center for Advanced Biomedical Sciences, Waseda University and School of Engineering, The University of Tokyo. The TWIns has been studying to aim at establishment of preclinical evaluation methods by "Engineering Based Medicine", and established Regulatory Science Institute for Medical Devices. School of Engineering, The University of Tokyo has been studying to aim at establishment of assessment methodology for innovative minimally invasive therapeutic devices, materials, and nanobio diagnostic devices. This report reviews the exchanges of personnel, the implement systems and the research progress of these projects.

  9. Novel low-permittivity dielectrics for Si-based microelectronics

    SciTech Connect

    Sullivan, J.P.

    1997-09-01

    The purpose of this laboratory-directed research and development (LDRD) project was to develop and assess novel low-permittivity dielectric materials for applications as interlevel dielectrics (ILDs) in Si-based microelectronics. There were three classes of materials investigated: (1) novel covalently-bonded ceramics containing carbon, boron, and/or nitrogen, (2) fluorinated SiO{sub 2} (SiOF), and (3) plasma polymerized fluorocarbon (PPFC). The specific advantages and disadvantages for each potential low k ILD material were evaluated. It was discovered that highly energetic deposition processes are required for the formation of thermally and environmentally stable carbon or boron nitride ceramics, and the resulting films may have many potentially valuable applications, such as diffusion barriers, tribological coatings, micro-sensor materials, etc. The films are not suitable as low k ILDs, however, because the highly energetic deposition process leads to films with high atomic density, and this leads to high dielectric constants. SiOF shows a promise as low k ILD material for near-term applications, but special passivation or encapsulation strategies may be required in order to reduce two instability problems that the authors have discovered: moisture absorption and thermal instability of the SiOF/Al interface. PPFC films offer promise for even lower dielectric constant ILDs than SiOF, but it will be necessary to develop new strategies to passivate the free radicals in the films generated during deposition. These free radicals lead to increase in dielectric loss over time when the films are exposed to room ambient conditions.

  10. Controlling microstructure and mechanical properties of the new microelectronic interconnect alloys

    NASA Astrophysics Data System (ADS)

    Mutuku, Francis M.

    An in-depth understanding of the physics of solidification could lead to the optimization of the properties of micro-electronic interconnects. Sn is the base material in the billions of interconnects in devices such as smart phones. These interconnects are formed by melting and solidifying a solder alloy (e.g. SnAgCu) in situ. But Sn has a low symmetry structure, Sn nucleation from the solder melt is complex and the morphology of the Sn and Sn alloys precipitates that form during solidification can vary tremendously (along with resultant mechanical properties). The effect of processing parameters on the solidification behavior, microstructure, and properties must be carefully addressed. Strong evidence adduced in this study shows that under many conditions, when cooling near eutectic SnAgCu from the melt, Ag3Sn nucleates before beta-Sn. The difficulty in the nucleation of beta-Sn provides a window of time between the nucleation of Ag3Sn precipitates and of beta-Sn solidification within which the Ag3Sn precipitate morphology can be manipulated. Thus distinct variations in precipitate number density, and inter-particle spacing were observed for different thermal histories, e.g. for different cooling rates. The average number density of Ag3Sn particles and the area of the pseudo-eutectic phase were observed to increase with increase in the Ag concentration, and with increase in the cooling rate. The shear strength and shear fatigue life increased with increase in the area fraction of the pseudo-eutectic phase. Upon aging of SnAgCu solder joints at an elevated temperature, the Ag3Sn particles coarsened, and became less effective in impeding dislocation motion. Consequently, the shear strength and shear fatigue performance degraded. On the other hand, alloys with constituents that formed solid solutions in Sn, such as small concentrations of Bi or Sb registered less degradation in both shear strength and shear fatigue life upon aging.

  11. Advanced packaging for Integrated Micro-Instruments

    NASA Technical Reports Server (NTRS)

    Lyke, James L.

    1995-01-01

    The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

  12. Unidirectional electric field-induced spin-state switching in spin crossover based microelectronic devices

    NASA Astrophysics Data System (ADS)

    Lefter, Constantin; Tan, Reasmey; Dugay, Julien; Tricard, Simon; Molnár, Gábor; Salmon, Lionel; Carrey, Julian; Nicolazzi, William; Rotaru, Aurelian; Bousseksou, Azzedine

    2016-01-01

    We report on a molecular spin-state switching phenomenon induced by an electric field in micrometric objects of the [Fe(Htrz)2(trz)](BF4) spin crossover complex, organized between interdigitated electrodes. By applying an electric field step of 40 kV/cm at temperatures within the thermal hysteresis region of the first-order spin transition, the iron(II) ions are switched from the metastable high spin to the stable low spin state obtaining a rather incomplete transition but perfectly reversible by heating. A model based on the interaction between the electric field and the electric dipolar moment of spin crossover complexes, grasps the main features of the experimental data.

  13. Application of a model for treatment of time dependent effects on irradiation of microelectronic devices

    SciTech Connect

    Brown, D.B.; Jenkins, W.C. ); Johnston, A.H. )

    1989-12-01

    A simple model for interpreting and extrapolating time dependent effects is tested by fitting to published and previously unpublished experimental data. The goal is to evaluate the applicability of such a model to hardness assurance testing in cases where defect growth and annealing processes (time dependent effects) are significant. Data is presented indicating hole annealing times varying by more than six orders of magnitude. The implications of the large variation in hole annealing times for hardness assurance testing are explored.

  14. Pd effect on reliability of Ag bonding wires in microelectronic devices in high-humidity environments

    NASA Astrophysics Data System (ADS)

    Cho, Jong-Soo; Yoo, Kyung-Ah; Moon, Jeong-Tak; Son, Seoung-Bum; Lee, Se-Hee; Oh, Kyu Hwan

    2012-10-01

    We investigated the effect of Pd concentration in Pd-doped Ag wires on the humidity reliability and interfacial corrosion characteristics between Ag wire and Al metallization. Additionally, we confirmed no corrosion problem between Ag wire and noble metal (Pd, Au) metallization, even after a pressure cooker test (PCT). The chemical composition of the tested Ag wires was pure Ag, Ag-1wt% Pd and Ag-3wt% Pd. These wires were bonded to Al and noble metal (Au, Pd) metallization using a thermo-sonic bonder. The interfaces were characterized by focused ion beam (FIB), high resolution transmission electron microscope (HRTEM) and energy dispersive X-ray spectroscopy (EDS). The interface corrosion of Pd doped Ag wires was significantly reduced as the Pd concentration in the Ag wires increased. Furthermore, the Ag wires on the noble metal (Au, Pd) metallization exhibited stable reliability during the PCT.

  15. Safe inductive power transmission to millimeter-sized implantable microelectronics devices.

    PubMed

    Ibrahim, Ahmed; Kiani, Mehdi

    2015-08-01

    Power transfer efficiency (PTE) and power delivered to the load (PDL) are key inductive link design parameters for powering millimeter-sized implants. While several groups have suggested increasing the power carrier frequency (fp) of inductive links to 100s of MHz to maximize PTE, we have demonstrated that operating at 10s of MHz offers higher allowable PDL under the safety absorption rate (SAR) constraints. We have proposed a closed-form power function that relates maximum power levels that can safely be transferred at different frequencies under the SAR constraints. Three sets of inductive links at different frequencies of 50 MHz, 200 MHz, and 400 MHz have been optimized for powering a 1 mm(3)-sized implant. We have shown in simulations that reducing fp from 200 MHz to 50 MHz along with shrinking the size of the transmitter coil results in ~7.8 times higher PDL under SAR constraints, at the cost of only 52% drop in PTE.

  16. Use of an individual mandibular advancement device for an?obstructive sleep apnoea patient with facial paralysis: a short-term follow-up case report.

    PubMed

    Pişkin, B; Sipahi, C; Köse, M; Karakoç, Ö; Şevketbeyoğlu, H; Ataç, G K

    2012-06-01

    This case report aimed to describe the fabrication procedure and treatment efficacy of an individual, one-piece, non-adjustable mandibular advancement device (MAD) for a moderate obstructive sleep apnoea patient with facial paralysis (FP). Mandibular advancement device was fabricated with autopolymerising acrylic resin. The intermaxillary relations were recorded such as to fix the mandible at a protruded position with increased vertical dimension. Initial evaluation of the MAD was made with axial magnetic resonance imaging and polysomnography on the first day of usage. Following evaluations were made on the third and sixth month. After a follow-up period of 6 months, Apnoea/Hypopnea Index (AHI) significantly decreased from 26·7 to 3·0. However, the average oxygen saturation did not improve as expected initially. The MAD therapy decreased the AHI scores of a patient with FP. At the end of a follow-up period of 6 months, the patient did not report any serious complaint except temporary tooth pains.

  17. Smart x-ray beam position monitor system using artificial intelligence methods for the Advanced Photon Source insertion-device beamlines

    SciTech Connect

    Shu, D.; Ding, H.; Barraza, J.; Kuzay, T.M.; Haeffner, D.; Ramanathan, M.

    1997-09-01

    At the Advanced Photon Source (APS), each insertion device (ID) beamline front-end has two XBPMs to monitor the X-ray beam position for both that vertical and horizontal directions. Performance challenges for a conventional photoemission type X-ray beam position monitor (XBPM) during operations are contamination of the signal from the neighboring bending magnet sources and the sensitivity of the XBPM to the insertion device (ID) gap variations. Problems are exacerbated because users change the ID gap during their operations, and hence the percentage level of the contamination in the front end XBPM signals varies. A smart XBPM system with a high speed digital signal processor has been built at the Advanced Photon Source for the ID beamline front ends. The new version of the software, which uses an artificial intelligence method, provides a self learning and self-calibration capability to the smart XBPM system. The structure of and recent test results with the system are presented in this paper.

  18. Less invasive methods of advanced hemodynamic monitoring: principles, devices, and their role in the perioperative hemodynamic optimization

    PubMed Central

    2013-01-01

    The monitoring of the cardiac output (CO) and other hemodynamic parameters, traditionally performed with the thermodilution method via a pulmonary artery catheter (PAC), is now increasingly done with the aid of less invasive and much easier to use devices. When used within the context of a hemodynamic optimization protocol, they can positively influence the outcome in both surgical and non-surgical patient populations. While these monitoring tools have simplified the hemodynamic calculations, they are subject to limitations and can lead to erroneous results if not used properly. In this article we will review the commercially available minimally invasive CO monitoring devices, explore their technical characteristics and describe the limitations that should be taken into consideration when clinical decisions are made. PMID:24472443

  19. Simulating total-dose and dose-rate effects on digital microelectronics timing delays using VHDL

    SciTech Connect

    Brothers, C.P. Jr.; Pugh, R.D.

    1995-12-01

    This paper describes a fast timing simulator based on Very High Speed Integrated Circuit (VHSIC) Hardware Description Language (VHDL) for simulating the timing of digital microelectronics in pre-irradiation, total dose, and dose-rate radiation environments. The goal of this research is the rapid and accurate timing simulation of radiation-hardened microelectronic circuits before, during, and after exposure to ionizing radiation. The results of this research effort were the development of VHDL compatible models capable of rapid and accurate simulation of the effect of radiation on the timing performance of microelectronic circuits. The effects of radiation for total dose at 1 Mrad(Si) and dose rates up to 2 {times} 10{sup 12} rads(Si) per second were modeled for a variety of Separation by IMplantion of OXygen (SIMOX) circuits. In all cases tested, the VHDL simulations ran at least 600 times faster than SPICE while maintaining a timing accuracy to within 15% of SPICE values.

  20. Recent advances in preparation, properties and device applications of two-dimensional h-BN and its vertical heterostructures

    NASA Astrophysics Data System (ADS)

    Yang, Huihui; Gao, Feng; Dai, Mingjin; Jia, Dechang; Zhou, Yu; Hu, Pingan

    2017-03-01

    Two-dimensional (2D) layered materials, such as graphene, hexagonal boron nitride (h-BN), molybdenum disulfide (MoS{}2 ), have attracted tremendous interest due to their atom-thickness structures and excellent physical properties. h-BN has predominant advantages as the dielectric substrate in FET devices due to its outstanding properties such as chemically inert surface, being free of dangling bonds and surface charge traps, especially the large-band-gap insulativity. h-BN involved vertical heterostructures have been widely exploited during the past few years. Such heterostructures adopting h-BN as dielectric layers exhibit enhanced electronic performance, and provide further possibilities for device engineering. Besides, a series of intriguing physical phenomena are observed in certain vertical heterostructures, such as superlattice potential induced replication of Dirac points, band gap tuning, Hofstadter butterfly states, gate-dependent pseudospin mixing. Herein we focus on the rapid developments of h-BN synthesis and fabrication of vertical heterostructures devices based on h-BN, and review the novel properties as well as the potential applications of the heterostructures composed of h-BN. Project supported by the National Natural Science Foundation of China (Nos. 61390502, 21373068), the National Basic Research Program of China (No. 2013CB632900), the Foundation for Innovative Research Groups of the National Natural Science Foundation of China (No. 51521003), and the Self-Planned Task of State Key Laboratory of Robotics and System (No. SKLRS201607B).

  1. Creep of two-phase microstructures for microelectronic applications

    NASA Astrophysics Data System (ADS)

    Reynolds, Heidi Linch

    The mechanical properties of low-melting temperature alloys are highly influenced by their creep behavior. This study investigates the dominant mechanisms that control creep behavior of two-phase, low-melting temperature alloys as a function of microstructure. The alloy systems selected for study were In-Ag and Sn-Bi because their eutectic compositions represent distinctly different microstructures. The In-Ag eutectic contains a discontinuous phase while the Sn-Bi eutectic consists of two continuous phases. In addition, this work generates useful engineering data on Pb-free alloys with a joint specimen geometry that simulates microstructures found in microelectronic applications. The use of joint test specimens allows for observations regarding the practical attainability of superplastic microstructures in real solder joints by varying the cooling rate. Steady-state creep properties of In-Ag eutectic, Sn-Bi eutectic, Sn-xBi solid-solution and pure Bi joints have been measured using constant load tests at temperatures ranging from 0°C to 90°C. Constitutive equations are derived to describe the steady-state creep behavior for In-Ag eutectic solder joints and Sn-xBi solid-solution joints. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Rate-controlling creep mechanisms, as a function of applied shear stress, test temperature, and joint microstructure, are discussed. Literature data on the steady-state creep properties of Sn-Bi eutectic are reviewed and compared with the Sn-xBi solid-solution and pure Bi joint data measured in the current study. The role of constituent phases in controlling eutectic creep behavior is discussed for both alloy systems. In general, for continuous, two-phase microstructures, where each phase exhibits significantly different creep behavior, the harder or more creep resistant phase will dominate the creep behavior in a lamellar microstructure. If a

  2. Creep of Two-Phase Microstructures for Microelectronic Applications

    SciTech Connect

    Reynolds, Heidi Linch

    1998-12-01

    The mechanical properties of low-melting temperature alloys are highly influenced by their creep behavior. This study investigates the dominant mechanisms that control creep behavior of two-phase, low-melting temperature alloys as a function of microstructure. The alloy systems selected for study were In-Ag and Sn-Bi because their eutectic compositions represent distinctly different microstructure.” The In-Ag eutectic contains a discontinuous phase while the Sn-Bi eutectic consists of two continuous phases. In addition, this work generates useful engineering data on Pb-free alloys with a joint specimen geometry that simulates microstructure found in microelectronic applications. The use of joint test specimens allows for observations regarding the practical attainability of superplastic microstructure in real solder joints by varying the cooling rate. Steady-state creep properties of In-Ag eutectic, Sn-Bi eutectic, Sn-xBi solid-solution and pure Bi joints have been measured using constant load tests at temperatures ranging from O°C to 90°C. Constitutive equations are derived to describe the steady-state creep behavior for In-Ageutectic solder joints and Sn-xBi solid-solution joints. The data are well represented by an equation of the form proposed by Dom: a power-law equation applies to each independent creep mechanism. Rate-controlling creep mechanisms, as a function of applied shear stress, test temperature, and joint microstructure, are discussed. Literature data on the steady-state creep properties of Sn-Bi eutectic are reviewed and compared with the Sn-xBi solid-solution and pure Bi joint data measured in the current study. The role of constituent phases in controlling eutectic creep behavior is discussed for both alloy systems. In general, for continuous, two-phase microstructure, where each phase exhibits significantly different creep behavior, the harder or more creep resistant phase will dominate the creep behavior in a lamellar microstructure. If a

  3. Contrast-sensitivity loss in a group of former microelectronics workers with normal visual acuity.

    PubMed

    Frenette, B; Mergler, D; Bowler, R

    1991-07-01

    The measurement of contrast sensitivity at varying grating frequencies is used increasingly to study visual and neural disorders. It provides more information than conventional acuity measures. Refractive errors initially affect high spatial frequencies, whereas lower spatial frequencies are affected only when these errors are pronounced. Neurophysiological alterations are reflected by depressed sensitivity to coarse gratings. Visual dysfunction has been associated with workplace exposures to a wide range of organic solvents. In microelectronics assembly where large quantities of organic solvents are used in many aspects of the work processes, visual deficits have been observed. The objective of the present study was to compare contrast sensitivity among former microelectronics assembly workers, with normal far and near visual acuity, and a reference group from the same region, with similar acuity. No significant differences were observed between scores at the two ends of the contrast sensitivity curves; however, at the intermediate spatial frequencies, the former microelectronics workers' scores were significantly lower (Student's t-test; p less than 0.05). For the microelectronics workers, no relation was observed between age and contrast sensitivity at any spatial frequency, whereas for the reference group, contrast sensitivity scores were progressively lower with age at spatial frequencies greater than or equal to 6.0 cpd (r2 = 0.15 at 6 cpd to r2 = 0.45 at 18.0 cpd), suggesting that for the former there is some form of interference with the expected contrast sensitivity loss with age. Lower contrast sensitivity scores in intermediate spatial frequencies, observed among the former microelectronics workers, possibly reflect neural alterations, which may have resulted from exposure to neurotoxic substances. These findings suggest the need for further studies on visual functions in microelectronics workers.

  4. [Physiological and hygienic characteristic of high-precision manufacturing operations in microelectronics].

    PubMed

    Kirillov, V F; Mironov, A I; Gadakchan, K A; Mekhova, M M; Spiridonova, V S

    2010-01-01

    It was shown that workers performing high-precision manufacturing operations in microelectronic industry undergo severe visual, nervous and emotional stress combined with significant locomotor load, air deionization and deozonation, bacterial contamination, and UV deficit at their workplaces. These working conditions promote development of negative changes in the visual analyzer, nervous and emotional disorders, disturbances of systemic and regional hemodynamics. Also impaired is the functional state of the upper limb neuromuscular apparatus, central nervous and cardiovascular systems. The proposed certified complex of organizational, sanitary, hygienic, physiological, ergonomic, therapeutic and preventive measures has positive influence on the working capacity of employees in microelectronic industry.

  5. Design, processing and testing of LSI arrays hybrid microelectronics task

    NASA Technical Reports Server (NTRS)

    Himmel, R. P.; Stuhlbarg, S. M.; Salmassy, S.

    1978-01-01

    Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed.

  6. A progress report on the LDRD project entitled {open_quotes}Microelectronic silicon-based chemical sensors: Ultradetection of high value molecules{close_quotes}

    SciTech Connect

    Hughes, R.C.

    1996-09-01

    This work addresses a new kind of silicon based chemical sensor that combines the reliability and stability of silicon microelectronic field effect devices with the highly selective and sensitive immunoassay. The sensor works on the principle that thin SiN layers on lightly doped Si can detect pH changes rapidly and reversibly. The pH changes affect the surface potential, and that can be quickly determined by pulsed photovoltage measurements. To detect other species, chemically sensitive films were deposited on the SiN where the presence of the chosen analyte results in pH changes through chemical reactions. A invention of a cell sorting device based on these principles is also described. A new method of immobilizing enzymes using Sandia`s sol-gel glasses is documented and biosensors based on the silicon wafer and an amperometric technique are detailed.

  7. Architectures for Improved Organic Semiconductor Devices

    NASA Astrophysics Data System (ADS)

    Beck, Jonathan H.

    Advancements in the microelectronics industry have brought increasing performance and decreasing prices to a wide range of users. Conventional silicon-based electronics have followed Moore's law to provide an ever-increasing integrated circuit transistor density, which drives processing power, solid-state memory density, and sensor technologies. As shrinking conventional integrated circuits became more challenging, researchers began exploring electronics with the potential to penetrate new applications with a low price of entry: "Electronics everywhere." The new generation of electronics is thin, light, flexible, and inexpensive. Organic electronics are part of the new generation of thin-film electronics, relying on the synthetic flexibility of carbon molecules to create organic semiconductors, absorbers, and emitters which perform useful tasks. Organic electronics can be fabricated with low energy input on a variety of novel substrates, including inexpensive plastic sheets. The potential ease of synthesis and fabrication of organic-based devices means that organic electronics can be made at very low cost. Successfully demonstrated organic semiconductor devices include photovoltaics, photodetectors, transistors, and light emitting diodes. Several challenges that face organic semiconductor devices are low performance relative to conventional devices, long-term device stability, and development of new organic-compatible processes and materials. While the absorption and emission performance of organic materials in photovoltaics and light emitting diodes is extraordinarily high for thin films, the charge conduction mobilities are generally low. Building highly efficient devices with low-mobility materials is one challenge. Many organic semiconductor films are unstable during fabrication, storage, and operation due to reactions with water, oxygen and hydroxide. A final challenge facing organic electronics is the need for new processes and materials for electrodes

  8. Interest and preferences for using advanced physical activity tracking devices: results of a national cross-sectional survey

    PubMed Central

    Alley, Stephanie; Schoeppe, Stephanie; Guertler, Diana; Jennings, Cally; Vandelanotte, Corneel

    2016-01-01

    Objectives Pedometers are an effective self-monitoring tool to increase users' physical activity. However, a range of advanced trackers that measure physical activity 24 hours per day have emerged (eg, Fitbit). The current study aims to determine people's current use, interest and preferences for advanced trackers. Design and participants A cross-sectional national telephone survey was conducted in Australia with 1349 respondents. Outcome measures Regression analyses were used to determine whether tracker interest and use, and use of advanced trackers over pedometers is a function of demographics. Preferences for tracker features and reasons for not wanting to wear a tracker are also presented. Results Over one-third of participants (35%) had used a tracker, and 16% are interested in using one. Multinomial regression (n=1257) revealed that the use of trackers was lower in males (OR=0.48, 95% CI 0.36 to 0.65), non-working participants (OR=0.43, 95% CI 0.30 to 0.61), participants with lower education (OR=0.52, 95% CI 0.38 to 0.72) and inactive participants (OR=0.52, 95% CI 0.39 to 0.70). Interest in using a tracker was higher in younger participants (OR=1.73, 95% CI 1.15 to 2.58). The most frequently used tracker was a pedometer (59%). Logistic regression (n=445) revealed that use of advanced trackers compared with pedometers was higher in males (OR=1.67, 95% CI 1.01 to 2.79) and younger participants (OR=2.96, 95% CI 1.71 to 5.13), and lower in inactive participants (OR=0.35, 95% CI 0.19 to 0.63). Over half of current or interested tracker users (53%) prefer to wear it on their wrist, 31% considered counting steps the most important function and 30% regarded accuracy as the most important characteristic. The main reasons for not wanting to use a tracker were, ‘I don't think it would help me’ (39%), and ‘I don't want to increase my activity’ (47%). Conclusions Activity trackers are a promising tool to engage people in self-monitoring a physical activity

  9. Assessment of the Coupled Heat and Mass Transfer Through Protective Garments Using Manikins and Other Advanced Measurement Devices

    NASA Astrophysics Data System (ADS)

    Rossi, René M.; Psikuta, Agnes

    The assessment of the coupled heat and mass transfer in protective clothing is very complex as the layers of the system are a combination of fabric and air layers that constantly change with the movements of the wearer. The methods to measure these mechanisms become more and more sophisticated which increases the precision of models to predict the impact of heat and moisture fluxes on the human thermal physiology. The simulation of the human thermoregulatory mechanisms requires the combination of physical models representing the body (manikins) with physiological (mathematical) models. This chapter gives different examples of advanced measurement methods to characterize the thermal properties of fabrics and garments.

  10. Electromagnetics and Electrothermal Approach to Evaluate Failures in Microelectronic Devices Caused by Electrostatic Discharges: Stochastical Aspects of the Device Reliability.

    DTIC Science & Technology

    1987-08-01

    FINALREPOR Dr.A P..Neaknawm I’ W. 9R..2 *Or. FIASEPOR -’ a Sa NOO4844O32’ roeT d 1-0 Dr. PSNeaatsavI V.4 74 6. J a. RIT RESEARCH CORPORATION i ’Al...Principal Investigator) S. PERiVORMING ORGANIZATION NAME AND ADDRESS 10. PROGRAM ELEMENT. PROJECT, TASK RIT Research Corporation AREA & WORK UNIT...PERFORMING ORGANIZATION NAME AND ADDRESS 10. PROGRAM ELEMENT, PROJECT, TASKAREA & WORKr UNIT NUMBERS RIT Research Corporation 75 Highpower Road NR 613

  11. Microelectronics at work: productivity and jobs in the world economy. [Monograph

    SciTech Connect

    Norman, C.

    1980-01-01

    Some of the technological developments that lie at the core of this electronic revolution are less than a decade old. An attempt to assess their social and economic significance is thus akin to forecasting the impact of the automobile on society as the first Model T rolled off the assembly line. Yet one thing is clear: microelectronic technology will have a pervasive and long-lasting influence on international trade, patterns of employment, communications, industrial productivity, entertainment, and social relationships. The spread of microelectronic technology will be a mixed blessing. Its impact on levels and patterns of employment could be enormous. The labor-saving potential of microelectronics is such that many jobs could disappear as employers take advantage of the increased productivity offered by computer-controlled equipment. Indeed, it is this potential that provides much of the driving force behind the rapid adoption of the technology. The complex social and economic issues raised by the development of microelectronics are likely to pose difficult problems for industrial and economic policy in every country. An intense debate has already erupted in Europe over some of these issues, though it has yet to be joined in the United States. Moreover, the special problems posed for developing countries by the emergence of a technology that could fundamentally affect patterns of production, world trade, and international investment have received only scant attention.

  12. The Microelectronics Center: A new force in cooperative VLSI signal processing research

    NASA Astrophysics Data System (ADS)

    Fair, R. B.

    1983-11-01

    The needs of the microelectronics industry in applying VLSI to modern signal processing are stated: (1) to innovate new designs at a rapid rate: (2) to maintain an edge on the numbers of new designs and innovations; (3) to reduces the amount of parallel research and development efforts required to make effective technology and design decisions and to achieve successful market dominance.

  13. Labour-Saving versus Work-Amplifying Effects of Micro-Electronics.

    ERIC Educational Resources Information Center

    Watanabe, Susumu

    1986-01-01

    This article argues that the labor-displacement effect of microelectronic machinery, especially numerically controlled machine tools and robots, has been exaggerated and that people tend to confuse the impact of intensified international competition with that of the new technology. (Author/CT)

  14. Microelectronic Information Processing Systems: Computing Systems. Summary of Awards Fiscal Year 1994.

    ERIC Educational Resources Information Center

    National Science Foundation, Arlington, VA. Directorate for Computer and Information Science and Engineering.

    The purpose of this summary of awards is to provide the scientific and engineering communities with a summary of the grants awarded in 1994 by the National Science Foundation's Division of Microelectronic Information Processing Systems. Similar areas of research are grouped together. Grantee institutions and principal investigators are identified…

  15. Advanced processing methods to introduce and preserve dipole orientation in organic electro-optic materials for next generation photonic devices

    NASA Astrophysics Data System (ADS)

    Huang, Su

    ) (PVP) and TOPAS as well as ferroelectric polymer poly(vinylidene fluoride-co-trifluoroethylene) (P(VDF-TrFE), 65/35 copolymer), which differ largely from the others in dielectric constant, conductivity and surface properties. The only common feature of them is that they all lowered the charge injection and leakage current for 1-2 orders during poling. On every buffer layer we tried, similar trend of stability enhancement is found. These results suggest that the observed temporal stability enhancement is indeed an effect from the abovementioned mechanism. Chapter 4 focuses on the development of an innovative new poling method, which utilizes pyroelectric effect instead of external power sources to overcome the limitations of conventional contact poling and corona poling. With careful theory assisted design, we developed a reliable protocol to efficiently introduce dipole orientation in organic E-O materials by heating and cooling them with detachable pyroelectric crystals. This new method can potentially improve the process adaptability of organic E-O materials in a variety of photonic devices. Large Pockels coefficients (up to 81 pm/V at 1.3 micron) have been successfully achieved in thin films poled using this method. The effective fields in these experiments are estimated to be around 0.5 to 0.9 MV/cm, which agree well with the electrostatics analysis using an idealized model. The same method is directly applied to surface modified hybrid polymer silicon slot waveguide ring-resonator modulators devices. A 25 pm/V tunability of resonance peak wavelength shift has been realized, which was higher than any reported results in similar devices. Chapter 5 discusses about the possible application of the pyroelectric poling in a multi-stack waveguide device architecture. A long-existing challenge to pole E-O polymer based photonic devices is how to effectively drop the poling voltage to the core layer, which is usually sandwiched between two dielectric claddings. In the past

  16. Development of a Decision Aid for Patients with Advanced Heart Failure Considering a Destination Therapy Left Ventricular Assist Device

    PubMed Central

    Thompson, Jocelyn S.; Matlock, Daniel D.; McIlvennan, Colleen K.; Jenkins, Amy R.; Allen, Larry A.

    2015-01-01

    STRUCTURED ABSTRACT Objective We aimed to create decision aids (DAs) for patients considering destination therapy left ventricular assist device (DT LVAD). Background DT LVAD is a major decision for patients with end-stage heart failure. Patients facing decisions with complex tradeoffs may benefit from high-quality decision support resources. Methods Following the International Patient Decision Aid Standards (IPDAS) guidelines and based on a needs assessment with stakeholders, we developed drafts of paper and video DAs. With input from patients, caregivers, and clinicians through alpha testing, we iteratively modified the DAs to ensure acceptability. Results We conducted semi-structured interviews with 24 patients, 20 caregivers, and 24 clinicians to assess readability, bias, and usability of the DAs. Stakeholder feedback allowed us to integrate aspects critical to decision-making around highly invasive therapies for life-threatening diseases, including addressing emotion and fear of death, using gain frames for all options that focus on living, highlighting palliative and hospice care, integrating the caregiver role, and utilizing a range of balanced testimonials. After 19 iterative versions of the paper DA and four versions of the video DA, final materials were made available for wider use. Conclusion We developed the first IPDAS-level DAs for DT LVAD. Given the extreme nature of this medical decision, we augmented traditional DA characteristics with non-traditional DA features to address a spectrum of cognitive, automatic, and emotional aspects of end-of-life decision-making. Not only are the DAs important tools for those confronting end-stage heart failure, but the lessons learned will likely inform decision support for other invasive therapies. UNSTRUCTURED ABSTRACT Destination therapy left ventricular assist device (DT LVAD) is a major decision for patients with end-stage heart failure. We aimed to create decision aids (DAs) to support patients and their

  17. Beam lead microelectronics. Citations from the NTIS data base

    NASA Astrophysics Data System (ADS)

    Reed, W. E.

    1980-04-01

    The technology and application of beam lead devices are treated in these Federally-sponsored research reports. Topics include design, fabrication, bonding, packaging, testing, and radiation hardening. This updated bibliography contains 85 abstracts, 4 of which are new entries to the previous edition.

  18. Advanced Resistive Exercise Device (ARED) Flight Software (FSW): A Unique Approach to Exercise in Long Duration Habitats

    NASA Technical Reports Server (NTRS)

    Mangieri, Mark

    2005-01-01

    ARED flight instrumentation software is associated with an overall custom designed resistive exercise system that will be deployed on the International Space Station (ISS). This innovative software application fuses together many diverse and new technologies into a robust and usable package. The software takes advantage of touchscreen user interface technology by providing a graphical user interface on a Windows based tablet PC, meeting a design constraint of keyboard-less interaction with flight crewmembers. The software interacts with modified commercial data acquisition (DAQ) hardware to acquire multiple channels of sensor measurment from the ARED device. This information is recorded on the tablet PC and made available, via International Space Station (ISS) Wireless LAN (WLAN) and telemetry subsystems, to ground based mission medics and trainers for analysis. The software includes a feature to accept electronically encoded prescriptions of exercises that guide crewmembers through a customized regimen of resistive weight training, based on personal analysis. These electronically encoded prescriptions are provided to the crew via ISS WLAN and telemetry subsystems. All personal data is securely associated with an individual crew member, based on a PIN ID mechanism.

  19. Fast imaging diagnostics on the C-2U advanced beam-driven field-reversed configuration device

    NASA Astrophysics Data System (ADS)

    Granstedt, E. M.; Petrov, P.; Knapp, K.; Cordero, M.; Patel, V.

    2016-11-01

    The C-2U device employed neutral beam injection, end-biasing, and various particle fueling techniques to sustain a Field-Reversed Configuration (FRC) plasma. As part of the diagnostic suite, two fast imaging instruments with radial and nearly axial plasma views were developed using a common camera platform. To achieve the necessary viewing geometry, imaging lenses were mounted behind re-entrant viewports attached to welded bellows. During gettering, the vacuum optics were retracted and isolated behind a gate valve permitting their removal if cleaning was necessary. The axial view incorporated a stainless-steel mirror in a protective cap assembly attached to the vacuum-side of the viewport. For each system, a custom lens-based, high-throughput optical periscope was designed to relay the plasma image about half a meter to a high-speed camera. Each instrument also contained a remote-controlled filter wheel, set between shots to isolate a particular hydrogen or impurity emission line. The design of the camera platform, imaging performance, and sample data for each view is presented.

  20. Smart time-pulse coding photoconverters as basic components 2D-array logic devices for advanced neural networks and optical computers

    NASA Astrophysics Data System (ADS)

    Krasilenko, Vladimir G.; Nikolsky, Alexander I.; Lazarev, Alexander A.; Michalnichenko, Nikolay N.

    2004-04-01

    The article deals with a conception of building arithmetic-logic devices (ALD) with a 2D-structure and optical 2D-array inputs-outputs as advanced high-productivity parallel basic operational training modules for realization of basic operation of continuous, neuro-fuzzy, multilevel, threshold and others logics and vector-matrix, vector-tensor procedures in neural networks, that consists in use of time-pulse coding (TPC) architecture and 2D-array smart optoelectronic pulse-width (or pulse-phase) modulators (PWM or PPM) for transformation of input pictures. The input grayscale image is transformed into a group of corresponding short optical pulses or time positions of optical two-level signal swing. We consider optoelectronic implementations of universal (quasi-universal) picture element of two-valued ALD, multi-valued ALD, analog-to-digital converters, multilevel threshold discriminators and we show that 2D-array time-pulse photoconverters are the base elements for these devices. We show simulation results of the time-pulse photoconverters as base components. Considered devices have technical parameters: input optical signals power is 200nW_200μW (if photodiode responsivity is 0.5A/W), conversion time is from tens of microseconds to a millisecond, supply voltage is 1.5_15V, consumption power is from tens of microwatts to a milliwatt, conversion nonlinearity is less than 1%. One cell consists of 2-3 photodiodes and about ten CMOS transistors. This simplicity of the cells allows to carry out their integration in arrays of 32x32, 64x64 elements and more.