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Sample records for advanced packaging vol

  1. ALPS: Advanced Learning Packages, 1978-1979.

    ERIC Educational Resources Information Center

    San Juan Unified School District, Carmichael, CA.

    The document describes the ALPS (Advanced Learning Packages) program for teaching gifted students. Introductory materials provide information on teacher requirements, school requirements, ALPS teacher orientation responsibilities, orientation week, field trip procedures, gifted money available, ALPS costs, ALPS evaluations, the Structure of…

  2. Advanced packaging for Integrated Micro-Instruments

    NASA Technical Reports Server (NTRS)

    Lyke, James L.

    1995-01-01

    The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

  3. Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

    NASA Technical Reports Server (NTRS)

    Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

    2011-01-01

    The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

  4. Advanced packaging technology for high frequency photonic applications

    SciTech Connect

    Armendariz, M.G.; Hadley, G.R.; Warren, M.E.

    1996-03-01

    An advanced packaging concept has been developed for optical devices. This concept allows multiple fibers to be coupled to photonic integrated circuits, with no fiber penetration of the package walls. The principles used to accomplish this concept involves a second-order grating to couple light in or out of the photonic circuit, and a binary optic lens which receives this light and focuses it into a single-mode optical fiber. Design, fabrication and electrical/optical measurements of this packaging concept are described.

  5. Advanced Space Suit Portable Life Support Subsystem Packaging Design

    NASA Technical Reports Server (NTRS)

    Howe, Robert; Diep, Chuong; Barnett, Bob; Thomas, Gretchen; Rouen, Michael; Kobus, Jack

    2006-01-01

    This paper discusses the Portable Life Support Subsystem (PLSS) packaging design work done by the NASA and Hamilton Sundstrand in support of the 3 future space missions; Lunar, Mars and zero-g. The goal is to seek ways to reduce the weight of PLSS packaging, and at the same time, develop a packaging scheme that would make PLSS technology changes less costly than the current packaging methods. This study builds on the results of NASA s in-house 1998 study, which resulted in the "Flex PLSS" concept. For this study the present EMU schematic (low earth orbit) was used so that the work team could concentrate on the packaging. The Flex PLSS packaging is required to: protect, connect, and hold the PLSS and its components together internally and externally while providing access to PLSS components internally for maintenance and for technology change without extensive redesign impact. The goal of this study was two fold: 1. Bring the advanced space suit integrated Flex PLSS concept from its current state of development to a preliminary design level and build a proof of concept mockup of the proposed design, and; 2. "Design" a Design Process, which accommodates both the initial Flex PLSS design and the package modifications, required to accommodate new technology.

  6. The Assurance Challenges of Advanced Packaging Technologies for Electronics

    NASA Technical Reports Server (NTRS)

    Sampson, Michael J.

    2010-01-01

    Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

  7. Advances in photonics thermal management and packaging materials

    NASA Astrophysics Data System (ADS)

    Zweben, Carl

    2008-02-01

    Heat dissipation, thermal stresses, and cost are key packaging design issues for virtually all semiconductors, including photonic applications such as diode lasers, light-emitting diodes (LEDs), solid state lighting, photovoltaics, displays, projectors, detectors, sensors and laser weapons. Heat dissipation and thermal stresses affect performance and reliability. Copper, aluminum and conventional polymeric printed circuit boards (PCBs) have high coefficients of thermal expansion, which can cause high thermal stresses. Most traditional low-coefficient-of-thermal-expansion (CTE) materials like tungsten/copper, which date from the mid 20 th century, have thermal conductivities that are no better than those of aluminum alloys, about 200 W/m-K. There are an increasing number of low-CTE materials with thermal conductivities ranging between that of copper (400 W/m-K) and 1700 W/m-K, and many other new low-CTE materials with lower thermal conductivities. An important benefit of low-CTE materials is that they allow use of hard solders. Some advanced materials are low cost. Others have the potential to be low cost in high-volume production. High-thermal-conductivity materials enable higher power levels, potentially reducing the number of required devices. Advanced thermal materials can constrain PCB CTE and greatly increase thermal conductivity. This paper reviews traditional packaging materials and advanced thermal management materials. The latter provide the packaging engineer with a greater range of options than in the past. Topics include properties, status, applications, cost, using advanced materials to fix manufacturing problems, and future directions, including composites reinforced with carbon nanotubes and other thermally conductive materials.

  8. Advanced functional network analysis in the geosciences: The pyunicorn package

    NASA Astrophysics Data System (ADS)

    Donges, Jonathan F.; Heitzig, Jobst; Runge, Jakob; Schultz, Hanna C. H.; Wiedermann, Marc; Zech, Alraune; Feldhoff, Jan; Rheinwalt, Aljoscha; Kutza, Hannes; Radebach, Alexander; Marwan, Norbert; Kurths, Jürgen

    2013-04-01

    Functional networks are a powerful tool for analyzing large geoscientific datasets such as global fields of climate time series originating from observations or model simulations. pyunicorn (pythonic unified complex network and recurrence analysis toolbox) is an open-source, fully object-oriented and easily parallelizable package written in the language Python. It allows for constructing functional networks (aka climate networks) representing the structure of statistical interrelationships in large datasets and, subsequently, investigating this structure using advanced methods of complex network theory such as measures for networks of interacting networks, node-weighted statistics or network surrogates. Additionally, pyunicorn allows to study the complex dynamics of geoscientific systems as recorded by time series by means of recurrence networks and visibility graphs. The range of possible applications of the package is outlined drawing on several examples from climatology.

  9. Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

    NASA Technical Reports Server (NTRS)

    Fayette, Daniel F.; Speicher, Patricia; Stoklosa, Mark J.; Evans, Jillian V.; Evans, John W.; Gentile, Mike; Pagel, Chuck A.; Hakim, Edward

    1993-01-01

    A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

  10. Advances in food packaging films from milk proteins

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Most commercial petroleum-based food packaging films are poor oxygen barriers, do not biodegrade, and some are suspected to even leach compounds into the food product. For instance, three-perfluorinated coatings were banned from convenience food packaging earlier this year. These shortcomings are a ...

  11. Advanced packaging methods for high-power LED modules

    NASA Astrophysics Data System (ADS)

    Jordan, Rafael C.; Weber, Constanze; Ehrhardt, Christian; Wilke, Martin

    2014-02-01

    LED luminaires are already beyond retrofit systems, which are limited in heat dissipation due to the old fitting standards. Actual LED luminaries are based on new LED packages and modules. Heat dissipation through the first and second level interconnect is a key issue for a successful LED package. Therefore the impact of known bonding technologies as gluing and soldering and new technologies like sintering and transient liquid phase soldering were analyzed and compared. A realized hermetic high power LED package will be shown as example. The used new techniques result in a module extremely stable against further assembly processes and harsh operating conditions.

  12. EPANET - AN ADVANCED WATER QUALITY MODELING PACKAGE FOR DISTRIBUTION SYSTEMS

    EPA Science Inventory

    EPANET is a third generation software package for modeling water quality within drinking water distribution systems. he program performs extended period simulation of hydraulic and water quality conditions within pressurized pipe networks. n addition to substance concentration wa...

  13. A Review of Failure Analysis Methods for Advanced 3D Microelectronic Packages

    NASA Astrophysics Data System (ADS)

    Li, Yan; Srinath, Purushotham Kaushik Muthur; Goyal, Deepak

    2016-01-01

    Advanced three dimensional (3D) packaging is a key enabler in driving form factor reduction, performance benefits, and package cost reduction, especially in the fast paced mobility and ultraportable consumer electronics segments. The high level of functional integration and the complex package architecture pose a significant challenge for conventional fault isolation (FI) and failure analysis (FA) methods. Innovative FI/FA tools and techniques are required to tackle the technical and throughput challenges. In this paper, the applications of FI and FA techniques such as Electro Optic Terahertz Pulse Reflectometry, 3D x-ray computed tomography, lock-in thermography, and novel physical sample preparation methods to 3D packages with package on package and stacked die with through silicon via configurations are reviewed, along with the key FI and FA challenges.

  14. Energy Savings and Economics of Advanced Control Strategies for Packaged Heat Pumps

    SciTech Connect

    Wang, Weimin; Huang, Yunzhi; Katipamula, Srinivas

    2012-10-31

    Pacific Northwest National Laboratory (PNNL), with funding from the U.S. Department of Energy’s (DOE’s) Building Technologies Program (BTP), evaluated a number of control strategies for packaged cooling equipment that can be implemented in an advanced controller, which can be retrofit into existing packaged heat pump units to improve their operational efficiency. This report documents the results of that analysis.

  15. Building America Top Innovations 2012: Advanced Framing Systems and Packages

    SciTech Connect

    none,

    2013-01-01

    This Building America Top Innovations profile describes Building America research showing advanced 2x6, 24-inch on-center framing, single top plates, open headers, and 2-stud corners reduced board feet of lumber by more than 1,000 feet, cut energy use by 13%, and cut material and labor costs by more than $1,000 on a typical home.

  16. Attic or Roof? An Evaluation of Two Advanced Weatherization Packages

    SciTech Connect

    Neuhauser, Ken

    2012-06-01

    This project examines implementation of advanced retrofit measures in the context of a large-scale weatherization program and the archetypal Chicago brick bungalow. One strategy applies best practice air sealing methods and a standard insulation method to the attic floor. The other strategy creates an unvented roof assembly using materials and methods typically available to weatherization contractors. Through implementations of the retrofit strategies in a total of eight (8) test homes, the research found that the two different strategies achieve similar reductions in air leakage measurement (55%) and predicted energy performance (18%) relative to the pre-retrofit conditions.

  17. Advanced packaging and integration technologies for microsensors, phase 1

    NASA Astrophysics Data System (ADS)

    Ned, A. A.; Kurtz, A. D.

    1994-08-01

    Advanced microfabrication processes have been developed for producing a hermetic cover wafer with low resistance dielectrically isolated through-wafer interconnects. The feasibility of manufacturing encapsulated pressure sensors, utilizing the cover-wafer approach, has been demonstrated. Such pressure sensors represent a new generation of environmentally protected, cost effective devices. The accomplishments of Phase 1 include the following: (1) the study of conversion of single crystal silicon into porous silicon; (2) the study of conversion of porous silicon into oxide; (3) process for producing through-wafer interconnects has been established; and (4) the stresses in the cover wafer have been investigated, which enabled the fabrication of flat cover-wafers. The surface and cross-sectional morphology of the cover wafer was investigated, the hermeticity and dielectric isolation of the oxidized rings was verified, the sensors compatible with the cover-wafer approach were fabricated and tested, and a new generation of sensors designed.

  18. AISI/DOE Advanced Process Control Program Vol. 6 of 6: Temperature Measurement of Galvanneal Steel

    SciTech Connect

    S.W. Allison; D.L. Beshears; W.W. Manges

    1999-06-30

    This report describes the successful completion of the development of an accurate in-process measurement instrument for galvanneal steel surface temperatures. This achievement results from a joint research effort that is a part of the American Iron and Steel Institute's (AISI) Advanced Process Control Program, a collaboration between the U.S> Department of Energy and fifteen North American Steelmakers. This three-year project entitled ''Temperature Measurement of Galvanneal Steel'' uses phosphor thermography, and outgrowth of Uranium enrichment research at Oak Ridge facilities. Temperature is the controlling factor regarding the distribution of iron and zinc in the galvanneal strip coating, which in turn determines the desired product properties

  19. Advanced copper/low-k IC devices: Packaging process development and materials integrtion

    NASA Astrophysics Data System (ADS)

    Chungpaiboonpatana, Surasit

    Cu/low-k technology provides a number of key advantages including higher interconnect density, improved electrical performance, enhanced thermal performance, and reduced cost. Nevertheless, Cu/low-k IC technology poses many challenges to the packaging industry today. Specifically, low-k dielectric is much more fragile mechanically and copper surfaces are readily oxidized thereby weakening their adhesion to the ILD/metallization layers. The purpose of the study is to provide integrated and reliable materials and process solutions for the packaging of advanced Cu/low-k devices through fundamental materials science understanding. Novel solutions for advanced wirebond and flip-chip technologies are developed, along with resolutions for local and global material interaction issues. The zero-th packaging level study examines a novel direct gold wirebonding onto the Cu/low-k terminal pad structure. The first packaging level study attempts to eliminate the Cu/low-k wiresweeping issue through assembly material interactions with both bonding and transfer molding processes. The second packaging level study exams at the impact of Cu/low-k and processing material implementations on the copper trace cracking failures at the substrate level of a package. An integrated first and second level study on high performance flip chip technology using 8M Cu/low-k silicon chip is performed by the optimization of the underfill and substrate materials selections. Lastly, electromigration phenomena and corrosion mechanisms of copper metallization are developed for biased stressing assembly environment through the fundamental of electrochemistry. Throughout the experiment, the 90/130nm technology node of copper wafer fabrication using Black Diamond low-k dielectric is implemented in several large form-factor package assemblies. Functional test vehicles are assembled, reliability-stressed, and failure-analyzed according to the JEDEC standards for the validity of the integrated materials

  20. Advanced image processing package for FPGA-based re-programmable miniature electronics

    NASA Astrophysics Data System (ADS)

    Ovod, Vladimir I.; Baxter, Christopher R.; Massie, Mark A.; McCarley, Paul L.

    2005-05-01

    Nova Sensors produces miniature electronics for a variety of real-time digital video camera systems, including foveal sensors based on Nova's Variable Acuity Superpixel Imager (VASITM) technology. An advanced image-processing package has been designed at Nova Sensors to re-configure the FPGA-based co-processor board for numerous applications including motion detection, optical, background velocimetry and target tracking. Currently, the processing package consists of 14 processing operations that cover a broad range of point- and area-applied algorithms. Flexible FPGA designs of these operations and re-programmability of the processing board allows for easy updates of the VASITM sensors, and for low-cost customization of VASITM sensors taking into account specific customer requirements. This paper describes the image processing algorithms implemented and verified in Xilinx FPGAs and provides the major technical performances with figures illustrating practical applications of the processing package.

  1. Advanced Spacesuit Portable Life Support System Packaging Concept Mock-Up Design & Development

    NASA Technical Reports Server (NTRS)

    O''Connell, Mary K.; Slade, Howard G.; Stinson, Richard G.

    1998-01-01

    A concentrated development effort was begun at NASA Johnson Space Center to create an advanced Portable Life Support System (PLSS) packaging concept. Ease of maintenance, technological flexibility, low weight, and minimal volume are targeted in the design of future micro-gravity and planetary PLSS configurations. Three main design concepts emerged from conceptual design techniques and were carried forth into detailed design, then full scale mock-up creation. "Foam", "Motherboard", and "LEGOtm" packaging design concepts are described in detail. Results of the evaluation process targeted maintenance, robustness, mass properties, and flexibility as key aspects to a new PLSS packaging configuration. The various design tools used to evolve concepts into high fidelity mock ups revealed that no single tool was all encompassing, several combinations were complimentary, the devil is in the details, and, despite efforts, many lessons were learned only after working with hardware.

  2. Advances in methods and algorithms in a modern quantum chemistry program package.

    PubMed

    Shao, Yihan; Molnar, Laszlo Fusti; Jung, Yousung; Kussmann, Jörg; Ochsenfeld, Christian; Brown, Shawn T; Gilbert, Andrew T B; Slipchenko, Lyudmila V; Levchenko, Sergey V; O'Neill, Darragh P; DiStasio, Robert A; Lochan, Rohini C; Wang, Tao; Beran, Gregory J O; Besley, Nicholas A; Herbert, John M; Lin, Ching Yeh; Van Voorhis, Troy; Chien, Siu Hung; Sodt, Alex; Steele, Ryan P; Rassolov, Vitaly A; Maslen, Paul E; Korambath, Prakashan P; Adamson, Ross D; Austin, Brian; Baker, Jon; Byrd, Edward F C; Dachsel, Holger; Doerksen, Robert J; Dreuw, Andreas; Dunietz, Barry D; Dutoi, Anthony D; Furlani, Thomas R; Gwaltney, Steven R; Heyden, Andreas; Hirata, So; Hsu, Chao-Ping; Kedziora, Gary; Khalliulin, Rustam Z; Klunzinger, Phil; Lee, Aaron M; Lee, Michael S; Liang, Wanzhen; Lotan, Itay; Nair, Nikhil; Peters, Baron; Proynov, Emil I; Pieniazek, Piotr A; Rhee, Young Min; Ritchie, Jim; Rosta, Edina; Sherrill, C David; Simmonett, Andrew C; Subotnik, Joseph E; Woodcock, H Lee; Zhang, Weimin; Bell, Alexis T; Chakraborty, Arup K; Chipman, Daniel M; Keil, Frerich J; Warshel, Arieh; Hehre, Warren J; Schaefer, Henry F; Kong, Jing; Krylov, Anna I; Gill, Peter M W; Head-Gordon, Martin

    2006-07-21

    Advances in theory and algorithms for electronic structure calculations must be incorporated into program packages to enable them to become routinely used by the broader chemical community. This work reviews advances made over the past five years or so that constitute the major improvements contained in a new release of the Q-Chem quantum chemistry package, together with illustrative timings and applications. Specific developments discussed include fast methods for density functional theory calculations, linear scaling evaluation of energies, NMR chemical shifts and electric properties, fast auxiliary basis function methods for correlated energies and gradients, equation-of-motion coupled cluster methods for ground and excited states, geminal wavefunctions, embedding methods and techniques for exploring potential energy surfaces. PMID:16902710

  3. The 1984 IR and D (Independent Research and Development) advanced packaging study

    NASA Astrophysics Data System (ADS)

    Clatterbaugh, G. V.; Charles, H. C., Jr.

    1986-06-01

    An advanced multiyear electronic packaging project has been started. The project is a comprehensive interactive one involving theory, modeling, structure fabrication, and reliability testing. Highlights of the first year's activities are presented in this report. Important results include: the creation of integrated thermal and thermomechanical models, the prediction of lifetimes under environmental and operational stress conditions, model verification and validation by carefully controlled experimentation, development of assembly techniques, and the invention of a new method for preparing controlled solder joint height and geometry.

  4. Field evaluation of advanced controls for the retrofit of packaged air conditioners and heat pumps

    SciTech Connect

    Wang, Weimin; Katipamula, Srinivas; Ngo, Hung; Underhill, Ronald M.; Taasevigen, Danny J.; Lutes, Robert G.

    2015-09-01

    This paper documents the magnitude of energy savings achievable in the field by retrofitting existing packaged rooftop units (RTUs) with advanced control strategies not ordinarily used for RTUs. A total of 66 RTUs on 8 different buildings were retrofitted with a commercially available advanced controller for improving RTU operational efficiency. The controller features enhanced air-side economizer control, multi-speed fan control, and demand controlled ventilation. Of the 66 RTUs, 18 are packaged heat pumps and the rest are packaged air conditioners with gas heat. The eight buildings cover four building types and four climate conditions. Based on the data collected for about a whole year, the advanced controller reduced the normalized annual RTU energy consumption between 22% and 90%, with an average of 57% for all RTUs. The average fractional savings uncertainty was 12% at 95% confidence level. Normalized annual electricity savings were in the range between 0.47 kWh/h (kWh per hour of RTU operation) and 7.21 kWh/h, with an average of 2.39 kWh/h. RTUs greater than 53 kW and runtime greater than 14 hours per day had payback periods less than 3 years even at $0.05/kWh.

  5. Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2013-03-01

    Life testing/qualification of reflowed (1st reflow) and reworked (1st reflow, 1st removal, and then 1st rework) advanced ceramic column grid array (CCGA) surface mount interconnect electronic packaging technologies for future flight projects has been studied to enhance the mission assurance of JPL-NASA projects. The reliability of reworked/reflowed surface mount technology (SMT) packages is very important for short-duration and long-duration deep space harsh extreme thermal environmental missions. The life testing of CCGA electronic packages under extreme thermal environments (for example: -185°C to +125°C) has been performed with reference to various JPL/NASA project requirements which encompass the temperature range studied. The test boards of reflowed and reworked CCGA packages (717 Xilinx package, 624, 1152, and 1272 column Actel Packages) were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases or cycles to failure to assess the life of the hardware. Qualification/life testing was performed by subjecting test boards to the environmental harsh temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance solder-joint failures due to either overstress or thermal cycle fatigue. The large, high density, high input/output (I/O) electronic interconnect SMT packages such as CCGA have increased usage in avionics hardware of NASA projects during the last two decades. The test boards built with CCGA packages are expensive and often require a rework to replace a reflowed, reprogrammed, failed, redesigned, etc., CCGA packages. Theoretically speaking, a good rework process should have similar temperature-time profile as that used for the original manufacturing process of solder reflow. A

  6. Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza; Evans, John W.

    2014-01-01

    For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

  7. Energy savings and economics of advanced control strategies for packaged air conditioners with gas heat

    SciTech Connect

    Wang, Weimin; Katipamula, Srinivas; Huang, Yunzhi; Brambley, Michael R.

    2013-10-01

    This paper presents an evaluation of the potential energy savings from adding advanced control to existing packaged air conditioners. Advanced control options include air-side economizer, multi-speed fan control, demand control ventilation and staged cooling. The energy and cost savings from the different control strategies individually and in combination are estimated using the EnergyPlus detailed energy simulation program for four building types, namely, a small office building, a stand-alone retail building, a strip mall building and a supermarket building. For each of the four building types, the simulation was run for 16 locations covering all 15 climate zones in the U.S. The maximum installed cost of a replacement controller that provides acceptable payback periods to owners is estimated.

  8. Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance

    SciTech Connect

    Sukharev, V.; Kteyan, A.; Choy, J.-H.; Hovsepyan, H.; Markosian, A.; Zschech, E.; Huebner, R.

    2011-11-10

    Potential challenges with managing mechanical stress and the consequent effects on device performance for advanced 3D through-silicon-via (TSV) based technologies are outlined. The paper addresses the growing need in a simulation-based design verification flow capable to analyze a design of 3D IC stacks and to determine across-die out-of-spec variations in device electrical characteristics caused by the layout and through-silicon-via (TSV)/package-induced mechanical stress. The limited characterization/measurement capabilities for 3D IC stacks and a strict ''good die'' requirement make this type of analysis critical for the achievement of an acceptable level of functional and parametric yield and reliability. The paper focuses on the development of a design-for-manufacturability (DFM) type of methodology for managing mechanical stresses during a sequence of designs of 3D TSV-based dies, stacks and packages. A set of physics-based compact models for a multi-scale simulation to assess the mechanical stress across the device layers in silicon chips stacked and packaged with the 3D TSV technology is proposed. A calibration technique based on fitting to measured stress components and electrical characteristics of the test-chip devices is presented. A strategy for generation of a simulation feeding data and respective materials characterization approach are proposed, with the goal to generate a database for multi-scale material parameters of wafer-level and package-level structures. For model validation, high-resolution strain measurements in Si channels of the test-chip devices are needed. At the nanoscale, the transmission electron microscopy (TEM) is the only technique available for sub-10 nm strain measurements so far.

  9. Energy Savings and Economics of Advanced Control Strategies for Packaged Air-Conditioning Units with Gas Heat

    SciTech Connect

    Wang, Weimin; Katipamula, Srinivas; Huang, Yunzhi; Brambley, Michael R.

    2011-12-31

    Pacific Northwest National Laboratory (PNNL) with funding from the U.S. Department of Energy's Building Technologies Program (BTP) evaluated a number of control strategies that can be implemented in a controller, to improve the operational efficiency of the packaged air conditioning units. The two primary objectives of this research project are: (1) determine the magnitude of energy savings achievable by retrofitting existing packaged air conditioning units with advanced control strategies not ordinarily used for packaged units and (2) estimating what the installed cost of a replacement control with the desired features should be in various regions of the U.S. This document reports results of the study.

  10. More Efficient Power Conversion for EVs: Gallium-Nitride Advanced Power Semiconductor and Packaging

    SciTech Connect

    2010-02-01

    Broad Funding Opportunity Announcement Project: Delphi is developing power converters that are smaller and more energy efficient, reliable, and cost-effective than current power converters. Power converters rely on power transistors which act like a very precisely controlled on-off switch, controlling the electrical energy flowing through an electrical circuit. Most power transistors today use silicon (Si) semiconductors. However, Delphi is using semiconductors made with a thin layer of gallium-nitride (GaN) applied on top of the more conventional Si material. The GaN layer increases the energy efficiency of the power transistor and also enables the transistor to operate at much higher temperatures, voltages, and power-density levels compared to its Si counterpart. Delphi is packaging these high-performance GaN semiconductors with advanced electrical connections and a cooling system that extracts waste heat from both sides of the device to further increase the device’s efficiency and allow more electrical current to flow through it. When combined with other electronic components on a circuit board, Delphi’s GaN power transistor package will help improve the overall performance and cost-effectiveness of HEVs and EVs.

  11. Advanced optical system simulation in a coupled CAD/optical analysis package

    NASA Astrophysics Data System (ADS)

    Stevenson, Michael A.; Campillo, Chris J.; Jenkins, David G.

    1999-05-01

    Software packages capable of simulating complex optical systems have the power to shorten the design process for non-imaging illumination, projection display, and other imaging illumination systems, Breault Research Organization's Advanced Systems Analysis Program (ASAP) and Robert McNeel and Associates' Rhinoceros computer aided design software, together, allow complicated optical systems to be simulated and analyzed. Through the use of Rhinoceros, an optical system can be accurately modeled in a 3D design environment. ASAP is then used to assign optical properties to the Rhinoceros CAD model. After the optical system has been characterized, it can be analyzed and optimized, by way of features specific to the ASAP optical analysis engine. Using this simulation technique, an HID arc source manufactured by Ushio America, Inc. is accurately represented. 2D CCD images are gathered for the source's emitting-volume across its spectral bandwidth. The images are processed within ASAP, via the inverse Abel command, to produce a 3D emitting-volume. This emitting-volume is combined with an accurate model of the source geometry and its optical properties, to finalize a functioning virtual source model. The characterized source is then joined with a simulated optical system for detailed performance analysis: namely, a projection display system.

  12. I-SPINE: a software package for advances in image-guided and minimally invasive spine procedures

    NASA Astrophysics Data System (ADS)

    Choi, Jae Jeong; Cleary, Kevin R.; Zeng, Jianchao; Gary, Kevin A.; Freedman, Matthew T.; Watson, Vance; Lindisch, David; Mun, Seong K.

    2000-05-01

    While image guidance is now routinely used in the brain in the form of frameless stereotaxy, it is beginning to be more widely used in other clinical areas such as the spine. At Georgetown University Medical Center, we are developing a program to provide advanced visualization and image guidance for minimally invasive spine procedures. This is a collaboration between an engineering-based research group and physicians from the radiology, neurosurgery, and orthopaedics departments. A major component of this work is the ISIS Center Spine Procedures Imaging and Navigation Engine, which is a software package under development as the base platform for technical advances.

  13. Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni; Ghaffarian, Reza; Shapiro, Andrew; Napala, Phil A.; Martin, Patrick A.

    2005-01-01

    Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

  14. Advances in powder metallurgy - 1991. Vol. 6 - Aerospace, refractory and advanced materials; Proceedings of the Powder Metallurgy Conference and Exhibition, Chicago, IL, June 9-12, 1991

    SciTech Connect

    Pease, L.F. III; Sansoucy, R.J.

    1991-01-01

    Various papers on aerospace, refractory, and advanced materials are presented. Individual topics addressed include: nonequilibrium processing of powder alloys for aerospace applications, chemical conditioning of rapidly solidified aluminum alloy particulate, fabrication of rapidly solidified high temperature aluminum alloys, fatigue and fracture of an advanced PM-aluminum alloy, thermal and mechanical properties of extruded 7075-Al P/M alloys, reactive sintering and reactive hot isostatic pressing of iron aluminides, P/M processing and applications of Fe3Al-based intermetallics, properties of plasma atomized NiAl powders, processing of continuous fiber reinforced NiAl matrix composite. Also discussed are: powder forging process on an alumimum alloy, P/M magnesium particle composites, P/M short-fiber-reinforced magnesium, mechanical properties of a TiAl6V4 alloy processed by powder metallurgy, porous core/Be Ti-6-4 development for aerospace structures, consolidation and plasticity of Bi-Sr-Ca-Cu-O superconductors, development of a new W-Ni-Mn heavy alloy.

  15. Advanced Packaging Technology Used in Fabricating a High-Temperature Silicon Carbide Pressure Sensor

    NASA Technical Reports Server (NTRS)

    Beheim, Glenn M.

    2003-01-01

    The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were

  16. Advances in Librarianship; Vol. 5.

    ERIC Educational Resources Information Center

    Voigt, Melvin J.

    Major themes in library science for 1975 are discussed in depth in a collection of nine writings by ten prominent library figures from the United States, Spain, and France. The articles are titled: (1) international information systems; (2) national planning for library and information services; (3) statistics that describe libraries and library…

  17. VIPER: an advanced software package to support high-throughput LC-MS peptide identification

    SciTech Connect

    Monroe, Matthew E.; Tolic, Nikola; Jaitly, Navdeep; Shaw, Jason L.; Adkins, Joshua N.; Smith, Richard D.

    2007-06-01

    High throughput liquid chromatograph-mass spectrometry (LC-MS) based proteomics analyses have necessitated development of software to manipulate large volumes of detailed data and produce confident peptide/protein identifications. VIPER unites important data processing steps in a single software package that can be used to visualize peptide mass and LC elution (i.e. retention) time “feature” relationships from individual analyses, match these LC-MS features to accurate mass and time (AMT) tags of peptides previously identified in LC-MS/MS analyses, and to identify and quantify pairs of isotopically labeled peptides.

  18. Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics

    NASA Astrophysics Data System (ADS)

    Sundaram, Venkatesh

    The fundamental motivation for this dissertation is to address the widening interconnect gap between integrated circuit (IC) demands and package substrates specifically for high frequency digital-RF systems applications. Moore's law for CMOS ICs predicts that transistor density on ICs will double approximately every 18 months. Packaging of ICs at the 32nm and 22nm nodes in the next few years will require 20mum (peripheral) and 80mum (area array) I/O pad pitch on the IC, which must be matched by flip-chip interconnection and substrate wiring pad pitch of the same 20-80mum dimension. System on a Package (SOP) technology pioneered by Georgia Tech PRC enables future "mega-function" electronic and bio-electronic systems through ultra-thin film component integration from the current 50/cm2 to over 10000/cm2. This puts added wiring density and performance demands on the substrate. The other driving force in this thesis research is the increasing adoption of high frequency wireless and wired communication pushing the need for package substrate materials that are stable into multiple GHz frequencies. The current state-of-the-art in IC package substrates is at 20mum lines/spaces and 50-60mum microvia diameter using epoxy dielectrics with loss tangent above 0.01. The research targets are to overcome the barriers of current technologies and demonstrate a set of advanced materials and process technologies capable of 5-10mum lines and spaces, and 10-30mum diameter microvias in a multilayer 3-D wiring substrate using 10-25mum thin film dielectrics with loss tangent in the <0.005. The research elements are organized as follows with a clear focus on understanding and characterization of fundamental materials structure-processing-property relationships and interfaces to achieve the next generation targets: (1) Low CTE Core Substrate. (2) Low Loss Dielectrics with 25mum and smaller microvias. (3) Sub-10mum Width Cu Conductors. (4) Integration of the various dielectric and conductor

  19. A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist

    NASA Astrophysics Data System (ADS)

    Srinivasa Rao, Vempati; Kripesh, Vaidyanathan; Yoon, Seung Wook; Tay, Andrew A. O.

    2006-09-01

    The development of thick photoresist molds using JSR THB-151N negative tone UV photoresist for the electroplating of interconnects in advanced packaging technologies has been demonstrated. Two different thick photoresist molds 65 and 130 µm high with aspect ratios of up to 2.6 have been fabricated with good reproducibility using single and double coating processes. Optimized lithography parameters using a UV aligner to achieve straight and near-vertical side-wall profiles are also reported. Near-vertical side walls similar to that obtained using SU-8 photoresist have been obtained. JSR photoresist has been found to be easily striped with no residues in solvent stripper solutions, making it suitable for wafer bumping applications and the processing of MEMS devices. Through-mold electroplating of copper and solder is also demonstrated. The simultaneous fabrication of 1167 000 high density interconnects on 8 inch wafers, using lithography and electroplating technologies, is also reported.

  20. Advances in molecular quantum chemistry contained in the Q-Chem 4 program package

    NASA Astrophysics Data System (ADS)

    Shao, Yihan; Gan, Zhengting; Epifanovsky, Evgeny; Gilbert, Andrew T. B.; Wormit, Michael; Kussmann, Joerg; Lange, Adrian W.; Behn, Andrew; Deng, Jia; Feng, Xintian; Ghosh, Debashree; Goldey, Matthew; Horn, Paul R.; Jacobson, Leif D.; Kaliman, Ilya; Khaliullin, Rustam Z.; Kuś, Tomasz; Landau, Arie; Liu, Jie; Proynov, Emil I.; Rhee, Young Min; Richard, Ryan M.; Rohrdanz, Mary A.; Steele, Ryan P.; Sundstrom, Eric J.; Woodcock, H. Lee, III; Zimmerman, Paul M.; Zuev, Dmitry; Albrecht, Ben; Alguire, Ethan; Austin, Brian; Beran, Gregory J. O.; Bernard, Yves A.; Berquist, Eric; Brandhorst, Kai; Bravaya, Ksenia B.; Brown, Shawn T.; Casanova, David; Chang, Chun-Min; Chen, Yunqing; Chien, Siu Hung; Closser, Kristina D.; Crittenden, Deborah L.; Diedenhofen, Michael; DiStasio, Robert A., Jr.; Do, Hainam; Dutoi, Anthony D.; Edgar, Richard G.; Fatehi, Shervin; Fusti-Molnar, Laszlo; Ghysels, An; Golubeva-Zadorozhnaya, Anna; Gomes, Joseph; Hanson-Heine, Magnus W. D.; Harbach, Philipp H. P.; Hauser, Andreas W.; Hohenstein, Edward G.; Holden, Zachary C.; Jagau, Thomas-C.; Ji, Hyunjun; Kaduk, Benjamin; Khistyaev, Kirill; Kim, Jaehoon; Kim, Jihan; King, Rollin A.; Klunzinger, Phil; Kosenkov, Dmytro; Kowalczyk, Tim; Krauter, Caroline M.; Lao, Ka Un; Laurent, Adèle D.; Lawler, Keith V.; Levchenko, Sergey V.; Lin, Ching Yeh; Liu, Fenglai; Livshits, Ester; Lochan, Rohini C.; Luenser, Arne; Manohar, Prashant; Manzer, Samuel F.; Mao, Shan-Ping; Mardirossian, Narbe; Marenich, Aleksandr V.; Maurer, Simon A.; Mayhall, Nicholas J.; Neuscamman, Eric; Oana, C. Melania; Olivares-Amaya, Roberto; O'Neill, Darragh P.; Parkhill, John A.; Perrine, Trilisa M.; Peverati, Roberto; Prociuk, Alexander; Rehn, Dirk R.; Rosta, Edina; Russ, Nicholas J.; Sharada, Shaama M.; Sharma, Sandeep; Small, David W.; Sodt, Alexander; Stein, Tamar; Stück, David; Su, Yu-Chuan; Thom, Alex J. W.; Tsuchimochi, Takashi; Vanovschi, Vitalii; Vogt, Leslie; Vydrov, Oleg; Wang, Tao; Watson, Mark A.; Wenzel, Jan; White, Alec; Williams, Christopher F.; Yang, Jun; Yeganeh, Sina; Yost, Shane R.; You, Zhi-Qiang; Zhang, Igor Ying; Zhang, Xing; Zhao, Yan; Brooks, Bernard R.; Chan, Garnet K. L.; Chipman, Daniel M.; Cramer, Christopher J.; Goddard, William A., III; Gordon, Mark S.; Hehre, Warren J.; Klamt, Andreas; Schaefer, Henry F., III; Schmidt, Michael W.; Sherrill, C. David; Truhlar, Donald G.; Warshel, Arieh; Xu, Xin; Aspuru-Guzik, Alán; Baer, Roi; Bell, Alexis T.; Besley, Nicholas A.; Chai, Jeng-Da; Dreuw, Andreas; Dunietz, Barry D.; Furlani, Thomas R.; Gwaltney, Steven R.; Hsu, Chao-Ping; Jung, Yousung; Kong, Jing; Lambrecht, Daniel S.; Liang, WanZhen; Ochsenfeld, Christian; Rassolov, Vitaly A.; Slipchenko, Lyudmila V.; Subotnik, Joseph E.; Van Voorhis, Troy; Herbert, John M.; Krylov, Anna I.; Gill, Peter M. W.; Head-Gordon, Martin

    2015-01-01

    A summary of the technical advances that are incorporated in the fourth major release of the Q-Chem quantum chemistry program is provided, covering approximately the last seven years. These include developments in density functional theory methods and algorithms, nuclear magnetic resonance (NMR) property evaluation, coupled cluster and perturbation theories, methods for electronically excited and open-shell species, tools for treating extended environments, algorithms for walking on potential surfaces, analysis tools, energy and electron transfer modelling, parallel computing capabilities, and graphical user interfaces. In addition, a selection of example case studies that illustrate these capabilities is given. These include extensive benchmarks of the comparative accuracy of modern density functionals for bonded and non-bonded interactions, tests of attenuated second order Møller-Plesset (MP2) methods for intermolecular interactions, a variety of parallel performance benchmarks, and tests of the accuracy of implicit solvation models. Some specific chemical examples include calculations on the strongly correlated Cr2 dimer, exploring zeolite-catalysed ethane dehydrogenation, energy decomposition analysis of a charged ter-molecular complex arising from glycerol photoionisation, and natural transition orbitals for a Frenkel exciton state in a nine-unit model of a self-assembling nanotube.

  1. A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process

    NASA Astrophysics Data System (ADS)

    Mert Torunbalci, Mustafa; Emre Alper, Said; Akin, Tayfun

    2015-12-01

    This paper presents a novel, inherently simple, and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where a single SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a single glass cap wafer is used for hermetic encapsulation and routing metallization. Hermetic encapsulation can be achieved either with the silicon-glass anodic or Au-Si eutectic bonding techniques. The dies sealed with anodic and Au-Si eutectic bonding provide a low vertical feedthrough resistance around 50 Ω. Glass-to-silicon anodically and Au-Si eutectic bonded seals yield a very stable cavity pressure below 10 mTorr with thin-film getters, which are measured to be stable even after 311 d. The package pressure can be adjusted from 5 mTorr to 20 Torr by using different outgassing, cavity depth, and gettering options. The packaging yield is observed to be around 64% and 84% for the anodic and Au-Si eutectic packages, respectively. The average shear strength of the anodic and eutectic packages is measured to be higher than 17 MPa and 42 MPa, respectively. Temperature cycling, high temperature storage, and ultra-high temperature shock tests result in no degradation in the hermeticity of the packaged chips, proving perfect thermal reliability.

  2. AISI/DOE Advanced Process Control Program Vol. 3 of 6 Microstructure Engineering in Hot Strip Mills, Part 1 of 2: Integrated Mathematical Model

    SciTech Connect

    J.K. Brimacombe; I.V. Samarasekera; E.B. Hawbolt; T.R. Meadowcroft; M. Militzer; W.J. Pool; D.Q. Jin

    1999-07-31

    This report describes the work of developing an integrated model used to predict the thermal history, deformation, roll forces, microstructural evolution and mechanical properties of steel strip in a hot-strip mill. This achievement results from a joint research effort that is part of the American Iron and Steel Institute's (AIS) Advanced Process Control Program, a collaboration between the U.S. DOE and fifteen North American Steelmakers.

  3. Advances in cryogenic engineering. Vols. 37A & 37B - Proceedings of the 1991 Cryogenic Engineering Conference, Univ. of Alabama, Huntsville, June 11-14, 1991

    NASA Technical Reports Server (NTRS)

    Fast, Ronald W. (Editor)

    1991-01-01

    The present volume on advances in cryogenic engineering discusses heat and mass transfer in helium, heat transfer in cryogenic fluids, thermoacoustic oscillations, and insulation. Attention is given to applications of superconductivity with reference to magnetic stability and coil protection, cryogenic techniques, and refrigeration for electronics and superconducting systems. Topics addressed include compressors, expanders, and pumps for liquid helium, magnetic refrigerators, pulse tube refrigerators, and cryocoolers. Also examined are properties of cryogenic fluids, cryogenic applications in transportion and space science and technology, and cryogenic instrumentation.

  4. OSA Proceedings on Advanced Solid-State Lasers. Vol. 10 - Proceedings of the Topical Meeting, Hilton Head, SC, Mar. 18-20, 1991

    SciTech Connect

    Dube, G.; Chase, L. Lawrence Livermore National Laboratory, Livermore, CA )

    1991-01-01

    The present volume on advanced solid-state lasers discusses Cr(3+), Cr(4+), short-pulse, titanium, F-center, mid-IR, and diode-pumped lasers, and nonlinear optics. Attention is given to the stabilization and a spectral characterization of an alexandrite laser for water vapor lidar measurements, crystal growth and spectroscopy of Cr:LiBaAlF6, a Q-switched tunable forsterite laser, and electron paramagnetic resonance spectroscopy of chromium-doped forsterite. Topics addressed include efficient frequency doubling of a self-starting additive-pulse mode-locked diode-pumped Nd:YAG laser, recent advances in Ti:Al2O3 unstable-resonator lasers, all-solid-state operation of a CW Ti:Al2O3 laser, and upconversion studies of flashlamp-pumped Cr,T,Ho:YAG. Also discussed are the top output parameters of an Ho-laser, spectroscopy and the 3-micron laser potential of Er crystals, the pulsed operation of microchip lasers, and blue optical parametric generation in LiB3O5.

  5. Advances in powder metallurgy - 1991. Vol. 5 - P/M materials; Proceedings of the Powder Metallurgy Conference and Exhibition, Chicago, IL, June 9-12, 1991

    SciTech Connect

    Pease, L.F. III; Sansoucy, R.J.

    1991-01-01

    The present volume powder metallurgy materials discusses the state of the PM industry, a metallurgical evaluation of new steel powders, design criteria for the manufacturing of low-alloy steel powders, and homogenization processing of a PM maraging steel. Attention is given to the corrosion resistance of full density sintered 316 SS, the performance characteristics of a new sinter-hardening low-alloy steel, wear performance of compositions made by low alloy iron/high alloy powder mixtures, and the strengthening of an AISI 1020 steel by aluminum-microalloying during liquid dynamic compaction. Topics addressed include the influence of alloying on the properties of water-atomized copper powders, fundamentals of high pressure gas atomization process control, advanced sensors and process control of gas atomization, and bimetallic tubulars via spray forming. Also discussed are factors affecting the delamination of PM molybdenum during stamping, applications of powder metallurgy molybdenum in the 1990s, and powder processing of high-temperature oxides.

  6. AISI/DOE Advanced Process Control Program Vol. 1 of 6: Optical Sensors and Controls for Improved Basic Oxygen Furnace Operations

    SciTech Connect

    Sarah Allendorf; David Ottesen; Donald Hardesty

    2002-01-31

    The development of an optical sensor for basic oxygen furnace (BOF) off-gas composition and temperature in this Advanced Process Control project has been a laboratory spectroscopic method evolve into a pre-commercialization prototype sensor system. The sensor simultaneously detects an infrared tunable diode laser ITDL beam transmitted through the process off-gas directly above the furnace mouth, and the infrared greybody emission from the particulate-laden off-gas stream. Following developmental laboratory and field-testing, the sensor prototype was successfully tested in four long-term field trials at Bethlehem Steel's Sparrows Point plant in Baltimore, MD> The resulting optical data were analyzed and reveal correlations with four important process variables: (1) bath turndown temperature; (2) carbon monoxide post-combustion control; (2) bath carbon concentration; and (4) furnace slopping behavior. The optical sensor measurement of the off-gas temperature is modestly correlated with bath turndown temperature. A detailed regression analysis of over 200 heats suggests that a dynamic control level of +25 Degree F can be attained with a stand-alone laser-based optical sensor. The ability to track off-gas temperatures to control post-combustion lance practice is also demonstrated, and may be of great use in optimizing post-combustion efficiency in electric furnace steelmaking operations. In addition to the laser-based absorption spectroscopy data collected by this sensor, a concurrent signal generated by greybody emission from the particle-laden off-gas was collected and analyzed. A detailed regression analysis shows an excellent correlation of a single variable with final bath turndown carbon concentration. Extended field trials in 1998 and early 1999 show a response range from below 0.03% to a least 0.15% carbon concentration with a precision of +0.0007%. Finally, a strong correlation between prolonged drops in the off-gas emission signal and furnace slopping events

  7. Forensic engineering of advanced polymeric materials. Part III - Biodegradation of thermoformed rigid PLA packaging under industrial composting conditions.

    PubMed

    Musioł, Marta; Sikorska, Wanda; Adamus, Grazyna; Janeczek, Henryk; Richert, Jozef; Malinowski, Rafal; Jiang, Guozhan; Kowalczuk, Marek

    2016-06-01

    This paper presents a forensic engineering study on the biodegradation behaviour of prototype packaging thermoformed from PLA-extruded film and plain PLA film under industrial composting conditions. Hydrolytic degradation in water was conducted for reference. The effects of composting duration on changes in molar mass, glass transition temperature and degree of crystallinity of the polymeric material were monitored using gel permeation chromatography (GPC) and differential scanning calorimetry (DSC). The chemical structure of water soluble degradation products of the polymeric material was determined using nuclear magnetic resonance (NMR) and electrospray ionization mass spectrometry (ESI-MS). The results show that the biodegradation process is less dependent on the thermoforming process of PLA and more dependent on the composting/degradation conditions that are applied. The increase in the dispersity index, leading to the bimodal molar mass distribution profile, suggests an autocatalytic hydrolysis effect at the early stage of the composting process, during which the bulk hydrolysis mechanism dominantly operates. Both the prototype PLA-packaging and PLA rigid film samples were shown to have a gradual increase in opacity due to an increase in the degree of crystallinity. PMID:27103398

  8. Environmental Loss Characterization of an Advanced Stirling Convertor (ASC-E2) Insulation Package Using a Mock Heater Head

    NASA Technical Reports Server (NTRS)

    Schifer, Nicholas A.; Briggs, Maxwell H.

    2012-01-01

    The U.S. Department of Energy (DOE) and Lockheed Martin Space Systems Company (LMSSC) have been developing the Advanced Stirling Radioisotope Generator (ASRG) for use as a power system for space science missions. This generator would use two highefficiency Advanced Stirling Convertors (ASCs), developed by Sunpower Inc. and NASA Glenn Research Center (GRC). As part of ground testing of these ASCs, different operating conditions are used to simulate expected mission conditions. These conditions require achieving a specified electrical power output for a given net heat input. While electrical power output can be precisely quantified, thermal power input to the Stirling cycle cannot be directly measured. In an effort to improve net heat input predictions, the Mock Heater Head was developed with the same relative thermal paths as a convertor using a conducting rod to represent the Stirling cycle and tested to provide a direct comparison to numerical and empirical models used to predict convertor net heat input. The Mock Heater Head also served as the pathfinder for a higher fidelity version of validation test hardware, known as the Thermal Standard. This paper describes how the Mock Heater Head was tested and utilized to validate a process for the Thermal Standard.

  9. Packaging and Embedded Electronics for the Next Generation

    NASA Technical Reports Server (NTRS)

    Sampson, Michael J.

    2010-01-01

    This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

  10. High Frequency Electronic Packaging Technology

    NASA Technical Reports Server (NTRS)

    Herman, M.; Lowry, L.; Lee, K.; Kolawa, E.; Tulintseff, A.; Shalkhauser, K.; Whitaker, J.; Piket-May, M.

    1994-01-01

    Commercial and government communication, radar, and information systems face the challenge of cost and mass reduction via the application of advanced packaging technology. A majority of both government and industry support has been focused on low frequency digital electronics.

  11. Scoring Package

    National Institute of Standards and Technology Data Gateway

    NIST Scoring Package (PC database for purchase)   The NIST Scoring Package (Special Database 1) is a reference implementation of the draft Standard Method for Evaluating the Performance of Systems Intended to Recognize Hand-printed Characters from Image Data Scanned from Forms.

  12. Reliability of BGA Packages for Highly Reliable Application and Chip Scale Package Board Level Reliability

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    1997-01-01

    Diffenent aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included understanding assembly reliability behavior of conventional surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.

  13. System packager strategies

    SciTech Connect

    Hennagir, T.

    1995-03-01

    Advances in combined equipment technologies, the ability to supply fuel flexibility and new financial support structures are helping power systems packagers meet a diverse series of client and project needs. Systems packagers continue to capture orders for various size power plants around the globe. A competitive buyer`s market remains the order of the day. In cogeneration markets, clients continue to search for efficiency rather than specific output for inside-the-fence projects. Letter-perfect service remains a requisite as successful suppliers strive to meet customers` ever-changing needs for thermal and power applications.

  14. Experiment Safety Assurance Package for Mixed Oxide Fuel Irradiation in an Average Power Position (I-24) in the Advanced Test Reactor

    SciTech Connect

    J. M . Ryskamp; R. C. Howard; R. C. Pedersen; S. T. Khericha

    1998-10-01

    The Fissile Material Disposition Program Light Water Reactor Mixed Oxide Fuel Irradiation Test Project Plan details a series of test irradiations designed to investigate the use of weapons-grade plutonium in MOX fuel for light water reactors (LWR) (Cowell 1996a, Cowell 1997a, Thoms 1997a). Commercial MOX fuel has been successfully used in overseas reactors for many years; however, weapons-derived test fuel contains small amounts of gallium (about 2 parts per million). A concern exists that the gallium may migrate out of the fuel and into the clad, inducing embrittlement. For preliminary out-of-pile experiments, Wilson (1997) states that intermetallic compound formation is the principal interaction mechanism between zircaloy cladding and gallium. This interaction is very limited by the low mass of gallium, so problems are not expected with the zircaloy cladding, but an in-pile experiment is needed to confirm the out-of-pile experiments. Ryskamp (1998) provides an overview of this experiment and its documentation. The purpose of this Experiment Safety Assurance Package (ESAP) is to demonstrate the safe irradiation and handling of the mixed uranium and plutonium oxide (MOX) Fuel Average Power Test (APT) experiment as required by Advanced Test Reactor (ATR) Technical Safety Requirement (TSR) 3.9.1 (LMITCO 1998). This ESAP addresses the specific operation of the MOX Fuel APT experiment with respect to the operating envelope for irradiation established by the Upgraded Final Safety Analysis Report (UFSAR) Lockheed Martin Idaho Technologies Company (LMITCO 1997a). Experiment handling activities are discussed herein.

  15. Packaging Materials

    NASA Astrophysics Data System (ADS)

    Frear, Darrel

    This chapter is a high-level overview of the materials used in an electronic package including: metals used as conductors in the package, ceramics and glasses used as dielectrics or insulators and polymers used as insulators and, in a composite form, as conductors. There is a need for new materials to meet the ever-changing requirements for high-speed digital and radio-frequency (RF) applications. There are different requirements for digital and RF packages that translate into the need for unique materials for each application. The interconnect and dielectric (insulating) requirements are presented for each application and the relevant materials properties and characteristics are discussed. The fundamental materials characteristics are: dielectric constant, dielectric loss, thermal and electric conductivity, resistivity, moisture absorption, glass-transition temperature, strength, time-dependent deformation (creep), and fracture toughness. The materials characteristics and properties are dependant on how they are processed to form the electronic package so the fundamentals of electronic packaging processes are discussed including wirebonding, solder interconnects, flip-chip interconnects, underfill for flip chip and overmolding. The relevant materials properties are given along with requirements (including environmentally friendly Pb-free packages) that require new materials to be developed to meet future electronics needs for both digital and RF applications.

  16. Sterile Product Packaging and Delivery Systems.

    PubMed

    Akers, Michael J

    2015-01-01

    Both conventional and more advanced product container and delivery systems are the focus of this brief article. Six different product container systems will be discussed, plus advances in primary packaging for special delivery systems and needle technology. PMID:26891564

  17. Evaluation of Five Microcomputer CAD Packages.

    ERIC Educational Resources Information Center

    Leach, James A.

    1987-01-01

    Discusses the similarities, differences, advanced features, applications and number of users of five microcomputer computer-aided design (CAD) packages. Included are: "AutoCAD (V.2.17)"; "CADKEY (V.2.0)"; "CADVANCE (V.1.0)"; "Super MicroCAD"; and "VersaCAD Advanced (V.4.00)." Describes the evaluation of the packages and makes recommendations for…

  18. MEMS Packaging and Thermal Issues in Reliability

    NASA Astrophysics Data System (ADS)

    Cheng, Yu-Ting; Lin, Liwei

    The potential of MEMS/NEMS technologies has been viewed as a comparable or even bigger revolution than that of microelectronics. These scientific and engineering advancements in MEMS/NEMS could bring applications to reality previously unthinkable, from space systems, environmental instruments, to daily life appliances. As presented in previous chapters, the development of core MEMS/NEMS processes has already demonstrated a lot of commercial applications as well as future potentials with elaborated functionalities. However, a low cost and reliable package for the protection of these MEMS/NEMS products is still a very difficult task. Without addressing the packaging and reliability issues, no commercial products can be sold on the market. Packaging design and modeling, packaging material selection, packaging process integration, and packaging cost are main issues to be considered when developing a new MEMS packaging process. In this chapter, we will present the fundamentals of MEMS/NEMS packaging technology, including packaging processes, hermetic and vacuum encapsulations, thermal issues, packaging reliability, and future packaging trends. The future development of MEMS packaging will rely on the success of the implementation of several unique techniques, such as packaging design kits for system and circuit designer, low cost and high yield wafer level, chip-scale packaging techniques, effective testing techniques at the wafer-level to reduce overall testing costs; and reliable fabrication of an interposer [37.1] with vertical through-interconnects for device integrations.

  19. Active and intelligent packaging systems for a modern society.

    PubMed

    Realini, Carolina E; Marcos, Begonya

    2014-11-01

    Active and intelligent packaging systems are continuously evolving in response to growing challenges from a modern society. This article reviews: (1) the different categories of active and intelligent packaging concepts and currently available commercial applications, (2) latest packaging research trends and innovations, and (3) the growth perspectives of the active and intelligent packaging market. Active packaging aiming at extending shelf life or improving safety while maintaining quality is progressing towards the incorporation of natural active agents into more sustainable packaging materials. Intelligent packaging systems which monitor the condition of the packed food or its environment are progressing towards more cost-effective, convenient and integrated systems to provide innovative packaging solutions. Market growth is expected for active packaging with leading shares for moisture absorbers, oxygen scavengers, microwave susceptors and antimicrobial packaging. The market for intelligent packaging is also promising with strong gains for time-temperature indicator labels and advancements in the integration of intelligent concepts into packaging materials. PMID:25034453

  20. Packaged Food

    NASA Technical Reports Server (NTRS)

    1976-01-01

    After studies found that many elderly persons don't eat adequately because they can't afford to, they have limited mobility, or they just don't bother, Innovated Foods, Inc. and JSC developed shelf-stable foods processed and packaged for home preparation with minimum effort. Various food-processing techniques and delivery systems are under study and freeze dried foods originally used for space flight are being marketed. (See 77N76140)

  1. Reflective Packaging

    NASA Technical Reports Server (NTRS)

    1994-01-01

    The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

  2. Tamper indicating packaging

    SciTech Connect

    Baumann, M.J.; Bartberger, J.C.; Welch, T.D.

    1994-08-01

    Protecting sensitive items from undetected tampering in an unattended environment is crucial to the success of non-proliferation efforts relying on the verification of critical activities. Tamper Indicating Packaging (TIP) technologies are applied to containers, packages, and equipment that require an indication of a tamper attempt. Examples include: the transportation and storage of nuclear material, the operation and shipment of surveillance equipment and monitoring sensors, and the retail storage of medicine and food products. The spectrum of adversarial tampering ranges from attempted concealment of a pin-hole sized penetration to the complete container replacement, which would involve counterfeiting efforts of various degrees. Sandia National Laboratories (SNL) has developed a technology base for advanced TIP materials, sensors, designs, and processes which can be adapted to various future monitoring systems. The purpose of this technology base is to investigate potential new technologies, and to perform basic research of advanced technologies. This paper will describe the theory of TIP technologies and recent investigations of TIP technologies at SNL.

  3. High density packaging technology ultra thin package & new tab package

    NASA Astrophysics Data System (ADS)

    Nakagawa, Osamu; Shimamoto, Haruo; Ueda, Tetsuya; Shimomura, Kou; Hata, Tsutomu; Tachikawa, Toru; Fukushima, Jiro; Banjo, Toshinobu; Yamamoto, Isamu

    1989-09-01

    As electronic devices become more highly integrated, the demand for small, high pin count packages has been increasing. We have developed two new types of IC packages in response to this demand. One is an ultra thin small outline package (TSOP) which has been reduced in size from the standard SOP and the other, which uses Tape Automated Bonding (TAB) technology, is a super thin, high pin count TAB in cap (T.I.C.) package. In this paper, we present these packages and their features along with the technologies used to improve package reliability and TAB. Thin packages are vulnerable to high humidity exposure, especially after heat shock.1 The following items were therefore investigated in order to improve humidity resistance: (1) The molding compound thermal stress, (2) Water absorption into the molding compound and its effect on package cracking during solder dipping, (3) Chip attach pad area and its affect on package cracking, (4) Adhesion between molding resin and chip attach pad and its affect on humidity resistance. With the improvements made as a result of these investigations, the reliability of the new thin packages is similar to that of the standard thicker plastic packages.

  4. Hermetic Packages For Millimeter-Wave Circuits

    NASA Technical Reports Server (NTRS)

    Herman, Martin I.; Lee, Karen A.; Lowry, Lynn E.; Carpenter, Alain; Wamhof, Paul

    1994-01-01

    Advanced hermetic packages developed to house electronic circuits operating at frequencies from 1 to 100 gigahertz and beyond. Signals coupled into and out of packages electromagnetically. Provides circuit packages small, lightweight, rugged, and inexpensive in mass production. Packages embedded in planar microstrip and coplanar waveguide circuits, in waveguide-to-planar and planar-to-waveguide circuitry, in waveguide-to-waveguide circuitry, between radiating (antenna) elements, and between planar transmission lines and radiating elements. Other applications in automotive, communication, radar, remote sensing, and biomedical electronic systems foreseen.

  5. NASA Electronic Parts and Packaging Program

    NASA Technical Reports Server (NTRS)

    Kayali, Sammy

    2000-01-01

    NEPP program objectives are to: (1) Access the reliability of newly available electronic parts and packaging technologies for usage on NASA projects through validations, assessments, and characterizations, and the development of test methods/tools; (2)Expedite infusion paths for advanced (emerging) electronic parts and packaging technologies by evaluations of readiness for manufacturability and project usage consideration; (3) Provide NASA projects with technology selection, application, and validation guidelines for electronic parts and packaging hardware and processes; nd (4) Retain and disseminate electronic parts and packaging quality assurance, reliability validations, tools, and availability information to the NASA community.

  6. Science packages

    NASA Astrophysics Data System (ADS)

    1997-01-01

    Primary science teachers in Scotland have a new updating method at their disposal with the launch of a package of CDi (Compact Discs Interactive) materials developed by the BBC and the Scottish Office. These were a response to the claim that many primary teachers felt they had been inadequately trained in science and lacked the confidence to teach it properly. Consequently they felt the need for more in-service training to equip them with the personal understanding required. The pack contains five disks and a printed user's guide divided up as follows: disk 1 Investigations; disk 2 Developing understanding; disks 3,4,5 Primary Science staff development videos. It was produced by the Scottish Interactive Technology Centre (Moray House Institute) and is available from BBC Education at £149.99 including VAT. Free Internet distribution of science education materials has also begun as part of the Global Schoolhouse (GSH) scheme. The US National Science Teachers' Association (NSTA) and Microsoft Corporation are making available field-tested comprehensive curriculum material including 'Micro-units' on more than 80 topics in biology, chemistry, earth and space science and physics. The latter are the work of the Scope, Sequence and Coordination of High School Science project, which can be found at http://www.gsh.org/NSTA_SSandC/. More information on NSTA can be obtained from its Web site at http://www.nsta.org.

  7. An Arbitrary Precision Computation Package

    2003-06-14

    This package permits a scientist to perform computations using an arbitrarily high level of numeric precision (the equivalent of hundreds or even thousands of digits), by making only minor changes to conventional C++ or Fortran-90 soruce code. This software takes advantage of certain properties of IEEE floating-point arithmetic, together with advanced numeric algorithms, custom data types and operator overloading. Also included in this package is the "Experimental Mathematician's Toolkit", which incorporates many of these facilitiesmore » into an easy-to-use interactive program.« less

  8. 75 FR 56922 - Implementation of the Intelligent Mail Package Barcode

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-09-17

    ... 111 Implementation of the Intelligent Mail Package Barcode AGENCY: Postal Service TM . ACTION: Advance... Intelligent Mail package barcodes (IMpb), no later than January of 2011; and expects to require the mandatory...Standards@usps.gov , with a subject line of ``Intelligent Mail Package Barcode comments.'' Faxed...

  9. Review: nanocomposites in food packaging.

    PubMed

    Arora, Amit; Padua, G W

    2010-01-01

    The development of nanocomposites is a new strategy to improve physical properties of polymers, including mechanical strength, thermal stability, and gas barrier properties. The most promising nanoscale size fillers are montmorillonite and kaolinite clays. Graphite nanoplates are currently under study. In food packaging, a major emphasis is on the development of high barrier properties against the migration of oxygen, carbon dioxide, flavor compounds, and water vapor. Decreasing water vapor permeability is a critical issue in the development of biopolymers as sustainable packaging materials. The nanoscale plate morphology of clays and other fillers promotes the development of gas barrier properties. Several examples are cited. Challenges remain in increasing the compatibility between clays and polymers and reaching complete dispersion of nanoplates. Nanocomposites may advance the utilization of biopolymers in food packaging. PMID:20492194

  10. Packaging for logistical support

    NASA Astrophysics Data System (ADS)

    Twede, Diana; Hughes, Harold

    Logistical packaging is conducted to furnish protection, utility, and communication for elements of a logistical system. Once the functional requirements of space logistical support packaging have been identified, decision-makers have a reasonable basis on which to compare package alternatives. Flexible packages may be found, for example, to provide adequate protection and superior utility to that of rigid packages requiring greater storage and postuse waste volumes.

  11. CIRF Publications, Vol. 12, No. 5.

    ERIC Educational Resources Information Center

    International Labour Office, Geneva (Switzerland).

    CIRF Publications, Vol. 12, No. 5 is a collection of 80 abstracts giving particular attention to education, training, and economic growth in developing countries, Iran, Japan, Kenya, the Solomon Islands, and Sri Lanka; vocational rehabilitation in Italy, Spain, the United Kingdom, and the U. S. A.; agriculture in Chad, developing countries, and…

  12. volBrain: An Online MRI Brain Volumetry System

    PubMed Central

    Manjón, José V.; Coupé, Pierrick

    2016-01-01

    The amount of medical image data produced in clinical and research settings is rapidly growing resulting in vast amount of data to analyze. Automatic and reliable quantitative analysis tools, including segmentation, allow to analyze brain development and to understand specific patterns of many neurological diseases. This field has recently experienced many advances with successful techniques based on non-linear warping and label fusion. In this work we present a novel and fully automatic pipeline for volumetric brain analysis based on multi-atlas label fusion technology that is able to provide accurate volumetric information at different levels of detail in a short time. This method is available through the volBrain online web interface (http://volbrain.upv.es), which is publically and freely accessible to the scientific community. Our new framework has been compared with current state-of-the-art methods showing very competitive results. PMID:27512372

  13. volBrain: An Online MRI Brain Volumetry System.

    PubMed

    Manjón, José V; Coupé, Pierrick

    2016-01-01

    The amount of medical image data produced in clinical and research settings is rapidly growing resulting in vast amount of data to analyze. Automatic and reliable quantitative analysis tools, including segmentation, allow to analyze brain development and to understand specific patterns of many neurological diseases. This field has recently experienced many advances with successful techniques based on non-linear warping and label fusion. In this work we present a novel and fully automatic pipeline for volumetric brain analysis based on multi-atlas label fusion technology that is able to provide accurate volumetric information at different levels of detail in a short time. This method is available through the volBrain online web interface (http://volbrain.upv.es), which is publically and freely accessible to the scientific community. Our new framework has been compared with current state-of-the-art methods showing very competitive results. PMID:27512372

  14. Packaging for Food Service

    NASA Technical Reports Server (NTRS)

    Stilwell, E. J.

    1985-01-01

    Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

  15. Waste Package Lifting Calculation

    SciTech Connect

    H. Marr

    2000-05-11

    The objective of this calculation is to evaluate the structural response of the waste package during the horizontal and vertical lifting operations in order to support the waste package lifting feature design. The scope of this calculation includes the evaluation of the 21 PWR UCF (pressurized water reactor uncanistered fuel) waste package, naval waste package, 5 DHLW/DOE SNF (defense high-level waste/Department of Energy spent nuclear fuel)--short waste package, and 44 BWR (boiling water reactor) UCF waste package. Procedure AP-3.12Q, Revision 0, ICN 0, calculations, is used to develop and document this calculation.

  16. Advances in space biology and medicine. Vol. 1

    NASA Technical Reports Server (NTRS)

    Bonting, Sjoerd L. (Editor)

    1991-01-01

    Topics discussed include the effects of prolonged spaceflights on the human body; skeletal responses to spaceflight; gravity effects on reproduction, development, and aging; neurovestibular physiology in fish; and gravity perception and circumnutation in plants. Attention is also given to the development of higher plants under altered gravitational conditions; the techniques, findings, and theory concerning gravity effects on single cells; protein crystal growth in space; and facilities for animal research in space.

  17. 1973 Advances in Socio-Dental Research. Vol. 1.

    ERIC Educational Resources Information Center

    Goetz, John B., Ed.

    This publication is a collection of abstracts from volumes 6 and 7 (1971 and 1972) of "Oral Research Abstracts," selected because the abstracts contain information relating one of the social sciences with dentistry. The compilation is intended to be useful to epidemiologists, public health workers, and all those who have an interest in the…

  18. CH Packaging Operations Manual

    SciTech Connect

    Washington TRU Solutions LLC

    2005-06-13

    This procedure provides instructions for assembling the CH Packaging Drum payload assembly, Standard Waste Box (SWB) assembly, Abnormal Operations and ICV and OCV Preshipment Leakage Rate Tests on the packaging seals, using a nondestructive Helium (He) Leak Test.

  19. Comparative Packaging Study

    NASA Technical Reports Server (NTRS)

    Perchonok, Michele; Antonini, David

    2008-01-01

    This viewgraph presentation describes a comparative packaging study for use on long duration space missions. The topics include: 1) Purpose; 2) Deliverables; 3) Food Sample Selection; 4) Experimental Design Matrix; 5) Permeation Rate Comparison; and 6) Packaging Material Information.

  20. ATLAS software packaging

    NASA Astrophysics Data System (ADS)

    Rybkin, Grigory

    2012-12-01

    Software packaging is indispensable part of build and prerequisite for deployment processes. Full ATLAS software stack consists of TDAQ, HLT, and Offline software. These software groups depend on some 80 external software packages. We present tools, package PackDist, developed and used to package all this software except for TDAQ project. PackDist is based on and driven by CMT, ATLAS software configuration and build tool, and consists of shell and Python scripts. The packaging unit used is CMT project. Each CMT project is packaged as several packages—platform dependent (one per platform available), source code excluding header files, other platform independent files, documentation, and debug information packages (the last two being built optionally). Packaging can be done recursively to package all the dependencies. The whole set of packages for one software release, distribution kit, also includes configuration packages and contains some 120 packages for one platform. Also packaged are physics analysis projects (currently 6) used by particular physics groups on top of the full release. The tools provide an installation test for the full distribution kit. Packaging is done in two formats for use with the Pacman and RPM package managers. The tools are functional on the platforms supported by ATLAS—GNU/Linux and Mac OS X. The packaged software is used for software deployment on all ATLAS computing resources from the detector and trigger computing farms, collaboration laboratories computing centres, grid sites, to physicist laptops, and CERN VMFS and covers the use cases of running all applications as well as of software development.

  1. Modular avionics packaging standardization

    NASA Astrophysics Data System (ADS)

    Austin, M.; McNichols, J. K.

    The Modular Avionics Packaging (MAP) Program for packaging future military avionics systems with the objective of improving reliability, maintainability, and supportability, and reducing equipment life cycle costs is addressed. The basic MAP packaging concepts called the Standard Avionics Module, the Standard Enclosure, and the Integrated Rack are summarized, and the benefits of modular avionics packaging, including low risk design, technology independence with common functions, improved maintainability and life cycle costs are discussed. Progress made in MAP is briefly reviewed.

  2. Comparison of different LED Packages

    NASA Astrophysics Data System (ADS)

    Dieker, Henning; Miesner, Christian; Püttjer, Dirk; Bachl, Bernhard

    2007-09-01

    In this paper different technologies for LED packaging are compared, focusing on Chip on Board (COB) and SMD technology. The package technology which is used depends on the LED application. A critical fact in LED technology is the thermal management, especially for high brightness LED applications because the thermal management is important for reliability, lifetime and electrooptical performance of the LED module. To design certain and long life LED applications knowledge of the heat flow from LEDs to the complete application is required. High sophisticated FEM simulations are indispensable for modern development of high power LED applications. We compare simulations of various substrate materials and packaging technologies simulated using FLOTHERM software. Thereby different substrates such as standard FR4, ceramic and metal core printed circuit boards are considered. For the verification of the simulated results and the testing of manufactured modules, advanced measurement tools are required. We show different ways to experimentally characterize the thermal behavior of LED modules. The thermal path is determined by the transient thermal analysis using the MicReD T3Ster analyzer. Afterwards it will be compared to the conventional method using thermocouples. The heat distribution over the module is investigated by an IR-Camera. We demonstrate and compare simulation and measurement results of Chip-on-Board (COB) and Sub-Mounted Devices (SMD) technology. The results reveal that for different applications certain packages are ideal.

  3. Trends in Food Packaging.

    ERIC Educational Resources Information Center

    Ott, Dana B.

    1988-01-01

    This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

  4. Packaging of electronic modules

    NASA Technical Reports Server (NTRS)

    Katzin, L.

    1966-01-01

    Study of design approaches that are taken toward optimizing the packaging of electronic modules with respect to size, shape, component orientation, interconnections, and structural support. The study does not present a solution to specific packaging problems, but rather the factors to be considered to achieve optimum packaging designs.

  5. Packaging and Reliability Issues in Micro/Nano Systems

    NASA Astrophysics Data System (ADS)

    Kim, Jongbaeg; Cheng, Yu-Ting; Chiao, Mu; Lin, Liwei

    The potential of MEMS/NEMS technologies has been viewed as a revolution comparable or even bigger than that of microelectronics. These scientific and engineering advancements in micro-/nano-electromechanical systems (MEMS)/(NEMS) could bring previously unthinkable applications to reality, from space systems, environmental instruments, to daily-life appliances. As presented in previous chapters, the development of core MEMS/NEMS processes has already demonstrated a lot of commercial applications as well as future potentials with elaborate functionalities. However, creating a low-cost reliable package for the protection of these MEMS/NEMS products is still a very difficult task. Without addressing these packaging and reliability issues, no commercial products can be sold on the market. Packaging design and modeling, packaging material selection, packaging process integration, and packaging cost are the main issues to be considered. In this chapter, we will present the fundamentals of MEMS/NEMS packaging technology, including packaging processes, hermetic and vacuum encapsulations, thermal issues, packaging reliability, and future packaging trends. The future development of MEMS packaging will rely on the success of the implementation of several unique techniques, such as packaging design kits for system and circuit designer, low-cost wafer-level and chip-scale packaging techniques, effective testing techniques, and reliable fabrication of an interposer [56.1] with vertical through-interconnects for device integrations.

  6. Molecular genetic medicine. Vol. 2

    SciTech Connect

    Friedmann, T.

    1992-01-01

    Theodore Friedmann has put together an interesting spectrum of articles for volume 2 of Molecular Genetic Medicine. Perhaps related to his own interest in the X chromosome, three articles deal with X-chromosomal topics, while two deal with autosomal disorders and two treat viral disorders. The fragile-X syndrome is thoroughly covered by Brown and Jenkins with an article that is heavily weighted to clinical aspects and now out-of-date RFLP approaches. The timeliness of the volume is insured by the coverage (albeit brief) that they give to the cloning of FMR-1. Gartler et al. present a balanced review of X inactivation - the oft-surveyed subject was comprehensively covered in a manner that provided new perspectives. Lambert et al. provide an exhaustive review of natural and induced mutation of hypoxanthine phosphoribosyltransferase. For autosomal disorders, an excellent review of the molecular genetics of hemoglobin syntheses and their alterations in disease is provided by Berg and Schecter. The level of detail presented seemed just right to this reviewer. A concise review of recent advances in the study of Down syndrome and its animal model, trisomy 16 mice, is provided by Holtzman and Epstein. With regard to viral topics, Chisari thoughtfully reviews hepatitis B virus structure and function and the possible pathogenic mechanisms involved in its induction of hepatocellular carcinoma. Wong-Staal and Haseltine's up-to-date review of the increasingly complex regulatory genes of HIV is marred by a mix-up in figure legends - an exception to an otherwise well-proofread book. In summary, this is a good volume of its type and is recommended for those who might benefit from reading such review articles.

  7. Highlights of Astronomy, Vol. 15

    NASA Astrophysics Data System (ADS)

    Corbett, Ian

    2010-11-01

    Preface; Part I. Gruber Cosmology Prize Lecture; Part II. Invited Discourses; Part III. Joint Discussions: 1. Dark matter in early-type galaxies Léon V. E. Koopmans and Tommaso Treu; 2. Diffuse light in galaxy clusters Magda Arnaboldi and Ortwin Gerhard; 3. Neutron stars - timing in extreme environments Tomaso Belloni, Mariano Méndez and Chengmin Zhang; 4. Progress in understanding the physics of Ap and related stars Margarida Cunha; 5. Modelling the Milky Way in the age of Gaia Annie C. Robin; 6. Time and astronomy Pascale Defraigne; 7. Astrophysical outflows and associated accretion phenomena Elisabete M. de Gouveia Dal Pino and Alex C. Raga; 8. Hot interstellar matter in elliptical galaxies Dong-Woo Kim and Silvia Pellegrini; 9. Are the fundamental constants varying with time? Paolo Molaro and Elisabeth Vangioni; 10. 3D views on cool stellar atmospheres - theory meets observation K. N. Nagendra, P. Bonifacio and H. G. Ludwig; 11. New advances in helio- and astero-seismology; 12. The first galaxies - theoretical predictions and observational clues; 13. Eta Carinae in the context of the most massive stars Theodore R. Gull and Augusto Damineli; 14. The ISM of galaxies in the far-infrared and sub-millimetre; 15. Magnetic fields in diffuse media Elisabete M. de Gouveia Dal Pino and Alex Lazarian; 16. IHY global campaign - whole heliosphere interval; Part IV. Special Sessions: SpS 1. IR and sub-mm spectroscopy - a new tool for studying stellar evolution Glenn Wahlgren, Hans Käufl and Florian Kerber; SpS 2. The international year of astronomy Pedro Russo, Catherine Cesarsky and Lars Lindberg Christensen; SpS 3. Astronomy in Antarctica in 2009 Michael G. Burton; SpS 4. Astronomy education between past and future J. P. De Greve; SpS 5. Accelerating the rate of astronomical discovery Ray P. Norris; SpS 6. Planetary systems as potential sites for life Régis Courtin, Alan Boss and Michel Mayor; SpS 7. Young stars, brown dwarfs, and protoplanetary disks Jane Gregorio

  8. VolRoverN: Enhancing surface and volumetric reconstruction for realistic dynamical simulation of cellular and subcellular function

    PubMed Central

    Edwards, John; Daniel, Eric; Kinney, Justin; Bartol, Tom; Sejnowski, Terrence; Johnston, Daniel; Harris, Kristen; Bajaj, Chandrajit

    2014-01-01

    Establishing meaningful relationships between cellular structure and function requires accurate morphological reconstructions. In particular, there is an unmet need for high quality surface reconstructions to model subcellular and synaptic interactions among neurons at nanometer resolution. We address this need with VolRoverN, a software package that produces accurate, efficient, and automated 3D surface reconstructions from stacked 2D contour tracings. While many techniques and tools have been developed in the past for 3D visualization of cellular structure, the reconstructions from VolRoverN meet specific quality criteria that are important for dynamical simulations. These criteria include manifoldness, water-tightness, lack of self- and object-object-intersections, and geometric accuracy. These enhanced surface reconstructions are readily extensible to any cell type (including glia) and are used here on complex spiny dendrites and axons from mature rat hippocampal area CA1. Both spatially realistic surface reconstructions and reduced skeletonizations are produced and formatted by VolRoverN for easy input into analysis software packages for neurophysiological simulations at multiple spatial and temporal scales ranging from ion electro-diffusion to electrical cable models. PMID:24100964

  9. Working with Consortia - Advanced Packaging Reliability

    NASA Technical Reports Server (NTRS)

    Blanche, Jim; Strickland, Mark

    2010-01-01

    Description: Support the responsible NASA official for lead-free solder evaluation. Serve as the NASA technical liaison to the NASA/DoD Pb-free Project. Assure NASA areas of interest are included in JG-PP follow-on work. Support NASA/DoD telcons and face-to-face meetings. Update MSFC lead-free solder lessons learned report. FY10 plans: - Reliability data on lead-free solder applications for various part lead finishes and board finishes. - Update lead-free solder risks and risk mitigation strategies for NASA. - Evaluate lead-free alloy/lead-free finish reliability in design application. - Status CAVE project on Pb-free solder aging effects. - Compile the LTESE flight and bench data.

  10. A microelectronics approach for the ROSETTA surface science package

    NASA Technical Reports Server (NTRS)

    Sandau, Rainer (Editor); Alkalaj, Leon

    1996-01-01

    In relation to the Rosetta surface science package, the benefits of the application of advanced microelectronics packaging technologies and other output from the Mars environmental survey (MESUR) integrated microelectronics study are reported on. The surface science package will be designed to operate for tens of hours. Its limited mass and power consumption make necessary a highly integrated design with all the instruments and subunits operated from a centralized control and information management subsystem.

  11. Smart packaging for photonics

    SciTech Connect

    Smith, J.H.; Carson, R.F.; Sullivan, C.T.; McClellan, G.; Palmer, D.W.

    1997-09-01

    Unlike silicon microelectronics, photonics packaging has proven to be low yield and expensive. One approach to make photonics packaging practical for low cost applications is the use of {open_quotes}smart{close_quotes} packages. {open_quotes}Smart{close_quotes} in this context means the ability of the package to actuate a mechanical change based on either a measurement taken by the package itself or by an input signal based on an external measurement. One avenue of smart photonics packaging, the use of polysilicon micromechanical devices integrated with photonic waveguides, was investigated in this research (LDRD 3505.340). The integration of optical components with polysilicon surface micromechanical actuation mechanisms shows significant promise for signal switching, fiber alignment, and optical sensing applications. The optical and stress properties of the oxides and nitrides considered for optical waveguides and how they are integrated with micromechanical devices were investigated.

  12. Packaged die heater

    SciTech Connect

    Spielberger, Richard; Ohme, Bruce Walker; Jensen, Ronald J.

    2011-06-21

    A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

  13. Advance Directives and Do Not Resuscitate Orders

    MedlinePlus

    ... a form. Call a lawyer. Use a computer software package for legal documents. Advance directives and living ... you write by yourself or with a computer software package should follow your state laws. You may ...

  14. Stratimikos Wrapper Package

    2006-08-22

    Stratimikos is a small package of C++ wrappers for linear solver and preconditioning functionality exposed through Thyra interfaces. This package makes is possible to aggregate all of the general linear solver capability from the packages Amesos, AztecOO, Belos, lfpack, ML and others into a simple to use, parameter-list driven, interface to linear solvers. This initial version of Stratimikos contains just one utility class for building linear solvrs and preconditioners out of Epetra-based linear operators.

  15. Integrated microsystems packaging approach with LCP

    NASA Astrophysics Data System (ADS)

    Jaynes, Paul; Shacklette, Lawrence W.

    2006-05-01

    Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

  16. The ZOOM minimization package

    SciTech Connect

    Fischler, Mark S.; Sachs, D.; /Fermilab

    2004-11-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete.

  17. Learning Activity Package, Algebra-Trigonometry.

    ERIC Educational Resources Information Center

    Holland, Bill

    A series of ten teacher-prepared Learning Activity Packages (LAPs) in advanced algebra and trigonometry, the units cover logic; absolute value, inequalities, exponents, and complex numbers; functions; higher degree equations and the derivative; the trigonometric function; graphs and applications of the trigonometric functions; sequences and…

  18. 78 FR 76548 - New Standards To Enhance Package Visibility

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-12-18

    ... Mail Manual (DMM ) to require the use of Intelligent Mail package barcodes (IMpb) on all commercial... its operational capability to scan Intelligent Mail package barcodes (IMpb) and other extra services... Register, advanced notice of proposed rulemaking (78 FR 13006-13007) in which it announced its intention...

  19. WASTE PACKAGE TRANSPORTER DESIGN

    SciTech Connect

    D.C. Weddle; R. Novotny; J. Cron

    1998-09-23

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''.

  20. Developing Large CAI Packages.

    ERIC Educational Resources Information Center

    Reed, Mary Jac M.; Smith, Lynn H.

    1983-01-01

    When developing large computer-assisted instructional (CAI) courseware packages, it is suggested that there be more attentive planning to the overall package design before actual lesson development is begun. This process has been simplified by modifying the systems approach used to develop single CAI lessons, followed by planning for the…

  1. NRF TRIGA packaging

    SciTech Connect

    Clements, M.D.

    1995-11-01

    Training Reactor Isotopes, General Atomics (TRIGA{reg_sign}) Reactors are in use at four US Department of Energy (DOE) complex facilities and at least 23 university, commercial, or government facilities. The development of the Neutron Radiography Facility (NRF) TRIGA packaging system began in October 1993. The Hanford Site NRF is being shut down and requires an operationally user-friendly transportation and storage packaging system for removal of the TRIGA fuel elements. The NRF TRIGA packaging system is designed to remotely remove the fuel from the reactor and transport the fuel to interim storage (up to 50 years) on the Hanford Site. The packaging system consists of a cask and an overpack. The overpack is used only for transport and is not necessary for storage. Based upon the cask`s small size and light weight, small TRIGA reactors will find it versatile for numerous refueling and fuel storage needs. The NRF TRIGA packaging design also provides the basis for developing a certifiable and economical packaging system for other TRIGA reactor facilities. The small size of the NRF TRIGA cask also accommodates placing the cask into a larger certified packaging for offsite transport. The Westinghouse Hanford Company NRF TRIGA packaging, as described herein can serve other DOE sites for their onsite use, and the design can be adapted to serve university reactor facilities, handling a variety of fuel payloads.

  2. The West: Curriculum Package.

    ERIC Educational Resources Information Center

    Public Broadcasting Service, Alexandria, VA.

    This document consists of the printed components only of a PBS curriculum package intended to be used with the 9-videotape PBS documentary series entitled "The West." The complete curriculum package includes a teacher's guide, lesson plans, a student guide, audio tapes, a video index, and promotional poster. The teacher's guide and lesson plans…

  3. Modular electronics packaging system

    NASA Technical Reports Server (NTRS)

    Hunter, Don J. (Inventor)

    2001-01-01

    A modular electronics packaging system includes multiple packaging slices that are mounted horizontally to a base structure. The slices interlock to provide added structural support. Each packaging slice includes a rigid and thermally conductive housing having four side walls that together form a cavity to house an electronic circuit. The chamber is enclosed on one end by an end wall, or web, that isolates the electronic circuit from a circuit in an adjacent packaging slice. The web also provides a thermal path between the electronic circuit and the base structure. Each slice also includes a mounting bracket that connects the packaging slice to the base structure. Four guide pins protrude from the slice into four corresponding receptacles in an adjacent slice. A locking element, such as a set screw, protrudes into each receptacle and interlocks with the corresponding guide pin. A conduit is formed in the slice to allow electrical connection to the electronic circuit.

  4. Microelectronic Packaging Trends and the Role of Nanotechnology

    NASA Astrophysics Data System (ADS)

    Datta, Madhav

    The microelectronic packaging industry is undergoing major changes to keep pace with the ever-increasing demands imposed by high performing chips and by end-use system applications. Solutions using advanced materials for microprocessor interconnect scaling and chip package interconnects, novel concepts in heat management systems, and improvements in package substrates continue to drive major packaging efforts. Advances in electrochemical technologies have played an important role in the evolution of such solutions for miniaturization of microelectronic devices and packages. Indeed, since the development of through-mask plating for thin film heads in the1960s and 1970s, an enormous amount of industrial and academic R&D effort has positioned electrochemical processing among the most sophisticated processing technologies employed in the microelectronics industry today [1-4]. Electrochemical processing is perhaps better understood than some of the dry processing technologies used in the microelectronics industry. Compared to other competing dry processing technologies, it has emerged as a more environmentally-friendly and cost-effective fabrication method. Electrochemical processing has, thus, become an integral part of advanced wafer processing fabs and an enabling technology for nanofabrication [5]. As the electronics industry faces the challenges of extending Moore's law, electrochemical processing is expected to continue to enable further miniaturization of high-performance chip interconnects, packages, and printed circuit boards. Evolving novel approaches to electrochemical processing using nano-materials and nano-fabrication techniques have started to make tremendous impact on further miniaturization of high performance devices and packages. A detailed discussion of different facets of technology advances in electronic packaging is difficult to present in the limited space of this chapter. The current chapter, therefore, makes an effort to capture some of the key

  5. Packaging Concerns/Techniques for Large Devices

    NASA Technical Reports Server (NTRS)

    Sampson, Michael J.

    2009-01-01

    This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

  6. TSF Interface Package

    SciTech Connect

    2004-03-01

    A collection of packages of classes for interfacing to sparse and dense matrices, vectors and graphs, and to linear operators. TSF (via TSFCore, TSFCoreUtils and TSFExtended) provides the application programmer interface to any number of solvers, linear algebra libraries and preconditioner packages, providing also a sophisticated technique for combining multiple packages to solve a single problem. TSF provides a collection of abstract base classes that define the interfaces to abstract vector, matrix and linear soerator objects. By using abstract interfaces, users of TSF are not limiting themselves to any one concrete library and can in fact easily combine multiple libraries to solve a single problem.

  7. Seawater Chemistry Package

    2005-11-23

    SeaChem Seawater Chemistry package provides routines to calculate pH, carbonate chemistry, density, and other quantities for seawater, based on the latest community standards. The chemistry is adapted from fortran routines provided by the OCMIP3/NOCES project, details of which are available at http://www.ipsl.jussieu.fr/OCMIP/. The SeaChem package can generate Fortran subroutines as well as Python wrappers for those routines. Thus the same code can be used by Python or Fortran analysis packages and Fortran ocean models alike.

  8. Optoelectronic packaging: A review

    SciTech Connect

    Carson, R.F.

    1993-09-01

    Optoelectronics and photonics hold great potential for high data-rate communication and computing. Wide using in computing applications was limited first by device technologies and now suffers due to the need for high-precision, mass-produced packaging. The use of phontons as a medium of communication and control implies a unique set of packaging constraints that was not present in traditional telecommunications applications. The state-of-the-art in optoelectronic packaging is now driven by microelectric techniques that have potential for low cost and high volume manufacturing.

  9. Recent trends and future of pharmaceutical packaging technology

    PubMed Central

    Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

    2013-01-01

    The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future. PMID:23833515

  10. Packaging for Posterity.

    ERIC Educational Resources Information Center

    Sias, Jim

    1990-01-01

    A project in which students designed environmentally responsible food packaging is described. The problem definition; research on topics such as waste paper, plastic, metal, glass, incineration, recycling, and consumer preferences; and the presentation design are provided. (KR)

  11. Waste Package Program

    SciTech Connect

    Culbreth, W.; Ladkany, S.

    1991-07-21

    This was a progress report on the research program of waste packages at the University of Nevada, Las Vegas. The report has the overviews of what the program has done from January 1991 to June 1991, such as task assignments for personnel, equipment acquisitions, and staff meetings and travels on behalf of the project. Also, included was an abstract on the structural analysis of the waste package container design. (MB)

  12. Battery packaging - Technology review

    SciTech Connect

    Maiser, Eric

    2014-06-16

    This paper gives a brief overview of battery packaging concepts, their specific advantages and drawbacks, as well as the importance of packaging for performance and cost. Production processes, scaling and automation are discussed in detail to reveal opportunities for cost reduction. Module standardization as an additional path to drive down cost is introduced. A comparison to electronics and photovoltaics production shows 'lessons learned' in those related industries and how they can accelerate learning curves in battery production.

  13. CH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions LLC

    2002-03-04

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT Shipping Package, and directly related components. This document complies with the minimum requirements as specified in TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event there is a conflict between this document and the SARP or C of C, the SARP and/or C of C shall govern. C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SAR P charges the WIPP Management and Operation (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 CFR 71.11. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the TRUPACT-II and HalfPACT packaging. The intent of these instructions is to standardize these operations. All users will follow these instructions or equivalent instructions that assure operations are safe and meet the requirements of the SARPs.

  14. Battery packaging - Technology review

    NASA Astrophysics Data System (ADS)

    Maiser, Eric

    2014-06-01

    This paper gives a brief overview of battery packaging concepts, their specific advantages and drawbacks, as well as the importance of packaging for performance and cost. Production processes, scaling and automation are discussed in detail to reveal opportunities for cost reduction. Module standardization as an additional path to drive down cost is introduced. A comparison to electronics and photovoltaics production shows "lessons learned" in those related industries and how they can accelerate learning curves in battery production.

  15. The ENSDF Java Package

    SciTech Connect

    Sonzogni, A.A.

    2005-05-24

    A package of computer codes has been developed to process and display nuclear structure and decay data stored in the ENSDF (Evaluated Nuclear Structure Data File) library. The codes were written in an object-oriented fashion using the java language. This allows for an easy implementation across multiple platforms as well as deployment on web pages. The structure of the different java classes that make up the package is discussed as well as several different implementations.

  16. Electronic Packaging Techniques

    NASA Technical Reports Server (NTRS)

    1979-01-01

    A characteristic of aerospace system design is that equipment size and weight must always be kept to a minimum, even in small components such as electronic packages. The dictates of spacecraft design have spawned a number of high-density packaging techniques, among them methods of connecting circuits in printed wiring boards by processes called stitchbond welding and parallel gap welding. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.

  17. CH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions LLC

    2003-04-30

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP charges the WIPP management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 CFR 71.11. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document provides the instructions to be followed to operate, maintain, and test the TRUPACT-II and HalfPACT packaging. The intent of these instructions is to standardize operations. All users will follow these instructions or equivalent instructions that assure operations are safe and meet the requirements of the SARPs.

  18. 76 FR 68011 - Medicare Program; Advanced Payment Model

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-11-02

    ... Medicare Program; Advanced Payment Model; Notice #0;#0;Federal Register / Vol. 76, No. 212 / Wednesday... Services Medicare Program; Advanced Payment Model AGENCY: Centers for Medicare & Medicaid Services (CMS), HHS. ACTION: Notice. SUMMARY: This notice announces the testing of the Advance Payment Model...

  19. Comparative Packaging Study

    NASA Technical Reports Server (NTRS)

    Perchonok, Michele H.; Oziomek, Thomas V.

    2009-01-01

    Future long duration manned space flights beyond low earth orbit will require the food system to remain safe, acceptable and nutritious. Development of high barrier food packaging will enable this requirement by preventing the ingress and egress of gases and moisture. New high barrier food packaging materials have been identified through a trade study. Practical application of this packaging material within a shelf life test will allow for better determination of whether this material will allow the food system to meet given requirements after the package has undergone processing. The reason to conduct shelf life testing, using a variety of packaging materials, stems from the need to preserve food used for mission durations of several years. Chemical reactions that take place during longer durations may decrease food quality to a point where crew physical or psychological well-being is compromised. This can result in a reduction or loss of mission success. The rate of chemical reactions, including oxidative rancidity and staling, can be controlled by limiting the reactants, reducing the amount of energy available to drive the reaction, and minimizing the amount of water available. Water not only acts as a media for microbial growth, but also as a reactant and means by which two reactants may come into contact with each other. The objective of this study is to evaluate three packaging materials for potential use in long duration space exploration missions.

  20. MEMS performance challenges: packaging and shock tests

    NASA Astrophysics Data System (ADS)

    Chang, Jiyoung; Yang, Chen; Zhang, Bin; Lin, Liwei

    2011-06-01

    This paper describes recent advances in the MEMS performance challenges with emphases on packaging and shock tests. In the packaging area, metal to metal bonding processes have been developed to overcome limitations of the glass frit bonding by means of two specific methods: (1) pre-reflow of solder for enhanced bonding adhesion, and (2) the insertion of thin metal layer between parent metal bonding materials. In the shock test area, multiscale analysis for a MEMS package system has been developed with experimental verifications to investigate dynamic responses under drop-shock tests. Structural deformation and stress distribution data are extracted and predicted for device fracture and in-operation stiction analyses for micro mechanical components in various MEMS sensors, including accelerometers and gyroscopes.

  1. RH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions LLC

    2008-01-12

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package (also known as the "RH-TRU 72-B cask") and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: "...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." It further states: "...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M&O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8, "Deliberate Misconduct." Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, "Packaging and Transportation of Radioactive Material," certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, "Reporting of Defects and Noncompliance," regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a

  2. RH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions LLC

    2006-11-07

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: "...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." It further states: "...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M&O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 Code of Federal Regulations (CFR) §71.8, "Deliberate Misconduct." Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, "Packaging and Transportation of Radioactive Material," certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, "Reporting of Defects and Noncompliance," regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to

  3. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2009-06-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  4. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2008-09-11

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the pplication." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  5. CH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions LLC

    2005-02-28

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.

  6. Packaging signals in alphaviruses.

    PubMed

    Frolova, E; Frolov, I; Schlesinger, S

    1997-01-01

    Alphaviruses synthesize large amounts of both genomic and subgenomic RNA in infected cells, but usually only the genomic RNA is packaged. This implies the existence of an encapsidation or packaging signal which would be responsible for selectivity. Previously, we had identified a region of the Sindbis virus genome that interacts specifically with the viral capsid protein. This 132-nucleotide (nt) fragment lies within the coding region of the nsP1 gene (nt 945 to 1076). We proposed that the 132-mer is important for capsid recognition and initiates the formation of the viral nucleocapsid. To study the encapsidation of Sindbis virus RNAs in infected cells, we designed a new assay that uses the self-replicating Sindbis virus genomes (replicons) which lack the viral structural protein genes and contain heterologous sequences under the control of the subgenomic RNA promoter. These replicons can be packaged into viral particles by using defective helper RNAs that contain the structural protein genes (P. Bredenbeek, I. Frolov, C. M. Rice, and S. Schlesinger, J. Virol. 67:6439-6446, 1993). Insertion of the 132-mer into the subgenomic RNA significantly increased the packaging of this RNA into viral particles. We have used this assay and defective helpers that contain the structural protein genes of Ross River virus (RRV) to investigate the location of the encapsidation signal in the RRV genome. Our results show that there are several fragments that could act as packaging signals. They are all located in a different region of the genome than the signal for the Sindbis virus genome. For RRV, the strongest packaging signal lies between nt 2761 and 3062 in the nsP2 gene. This is the same region that was proposed to contain the packaging signal for Semliki Forest virus genomic RNA. PMID:8985344

  7. Food Packaging Materials

    NASA Technical Reports Server (NTRS)

    1978-01-01

    The photos show a few of the food products packaged in Alure, a metallized plastic material developed and manufactured by St. Regis Paper Company's Flexible Packaging Division, Dallas, Texas. The material incorporates a metallized film originally developed for space applications. Among the suppliers of the film to St. Regis is King-Seeley Thermos Company, Winchester, Ma'ssachusetts. Initially used by NASA as a signal-bouncing reflective coating for the Echo 1 communications satellite, the film was developed by a company later absorbed by King-Seeley. The metallized film was also used as insulating material for components of a number of other spacecraft. St. Regis developed Alure to meet a multiple packaging material need: good eye appeal, product protection for long periods and the ability to be used successfully on a wide variety of food packaging equipment. When the cost of aluminum foil skyrocketed, packagers sought substitute metallized materials but experiments with a number of them uncovered problems; some were too expensive, some did not adequately protect the product, some were difficult for the machinery to handle. Alure offers a solution. St. Regis created Alure by sandwiching the metallized film between layers of plastics. The resulting laminated metallized material has the superior eye appeal of foil but is less expensive and more easily machined. Alure effectively blocks out light, moisture and oxygen and therefore gives the packaged food long shelf life. A major packaging firm conducted its own tests of the material and confirmed the advantages of machinability and shelf life, adding that it runs faster on machines than materials used in the past and it decreases product waste; the net effect is increased productivity.

  8. Food packages for Space Shuttle

    NASA Technical Reports Server (NTRS)

    Fohey, M. F.; Sauer, R. L.; Westover, J. B.; Rockafeller, E. F.

    1978-01-01

    The paper reviews food packaging techniques used in space flight missions and describes the system developed for the Space Shuttle. Attention is directed to bite-size food cubes used in Gemini, Gemini rehydratable food packages, Apollo spoon-bowl rehydratable packages, thermostabilized flex pouch for Apollo, tear-top commercial food cans used in Skylab, polyethylene beverage containers, Skylab rehydratable food package, Space Shuttle food package configuration, duck-bill septum rehydration device, and a drinking/dispensing nozzle for Space Shuttle liquids. Constraints and testing of packaging is considered, a comparison of food package materials is presented, and typical Shuttle foods and beverages are listed.

  9. Detecting small holes in packages

    DOEpatents

    Kronberg, James W.; Cadieux, James R.

    1996-01-01

    A package containing a tracer gas, and a method for determining the presence of a hole in the package by sensing the presence of the gas outside the package. The preferred tracer gas, especially for food packaging, is sulfur hexafluoride. A quantity of the gas is added to the package and the package is closed. The concentration of the gas in the atmosphere outside the package is measured and compared to a predetermined value of the concentration of the gas in the absence of the package. A measured concentration greater than the predetermined value indicates the presence of a hole in the package. Measuring may be done in a chamber having a lower pressure than that in the package.

  10. Detecting small holes in packages

    DOEpatents

    Kronberg, J.W.; Cadieux, J.R.

    1996-03-19

    A package containing a tracer gas, and a method for determining the presence of a hole in the package by sensing the presence of the gas outside the package are disclosed. The preferred tracer gas, especially for food packaging, is sulfur hexafluoride. A quantity of the gas is added to the package and the package is closed. The concentration of the gas in the atmosphere outside the package is measured and compared to a predetermined value of the concentration of the gas in the absence of the package. A measured concentration greater than the predetermined value indicates the presence of a hole in the package. Measuring may be done in a chamber having a lower pressure than that in the package. 3 figs.

  11. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2006-04-25

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package TransporterModel II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant| (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations(CFR) §71.8. Any time a user suspects or has indications that the conditions ofapproval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  12. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2007-12-13

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  13. Photocopy from Evan Leigh's Modern Cotton Spinning (Vol 2), Manchester, ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    Photocopy from Evan Leigh's Modern Cotton Spinning (Vol 2), Manchester, 1873 (PL XXIX top); illustration of full milll, as enlarged to south. - Harmony Manufacturing Company, Mill Number 3, 100 North Mohawk Street, Cohoes, Albany County, NY

  14. 2. Historic American Buildings Survey Photocopy from Harpers, vol. 20 ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    2. Historic American Buildings Survey Photocopy from Harpers, vol. 20 1859 Courtesy of Library of Congress NORTH AND EAST FRONTS - United States General Post Office, Between Seventh, Eighth, E, & F Streets, Northwest, Washington, District of Columbia, DC

  15. RF packaging for space applications

    NASA Astrophysics Data System (ADS)

    Drevon, C.; Monfraix, P.; Paillard, M.; Schaffauser, C.; Vendier, O.

    2002-12-01

    Alcatel Space has been working in the field of RF hybrids for a long time. This paper presents the evolution of microwave packaging, up to 40 GHz, towards more and more miniaturisation. RF packaging presents challenging trade-offs between electrical performances and manufacturability, the higher the frequency; the more these two parameters are intertwined. An important step in the field of miniaturisation was the use, beginning of 90's, of MMICs based on GaAs - Gallium Arsenide - and micropackages, following by the introduction of mixed LF/MMwave MCM. Now a good choice could be made between those MCMs and advanced micropackages. The next evolution is the use of flip-chip interconnection to minimise the length of RF connections. In term of bonding reliability, the results give values over more than five times the limits from the standards, even after 500 thermal cycles. The association of power flip-chip which high thermal conductive substrates like Aluminum Nitride - could give at least 40% reduction in the Rth for an amplifier with MMIC mounted flip-chip with emitter bumps. The glob-top technology is not yet used for higher frequencies (i.e. some or some tens of GHz). However, the results presented in this paper show that glob-top are compatible with GaAs MMICs working up to 12 GHz. With some specific design rules, the right encapsulant and the associated processes, there are little degradations of the electrical performances of a Low Level Amplifier working at 10.7 - 12.7 GHz. This has been also checked after thermal cycles.Another emergent technology with MEMS - MicroElectroMechanical Systems - could be used soon for space application, especially for very small switches with low losses. This will be made only if they could be encapsulated with an adapted packaging and if the reliability is full demonstrated following space criteria. Now, those different technologies could be associated with other miniaturization new concepts adapted to the microwave needs, such

  16. TSF Interface Package

    2004-03-01

    A collection of packages of classes for interfacing to sparse and dense matrices, vectors and graphs, and to linear operators. TSF (via TSFCore, TSFCoreUtils and TSFExtended) provides the application programmer interface to any number of solvers, linear algebra libraries and preconditioner packages, providing also a sophisticated technique for combining multiple packages to solve a single problem. TSF provides a collection of abstract base classes that define the interfaces to abstract vector, matrix and linear soeratormore » objects. By using abstract interfaces, users of TSF are not limiting themselves to any one concrete library and can in fact easily combine multiple libraries to solve a single problem.« less

  17. MEEP: A flexible free-software package for electromagnetic simulations by the FDTD method

    NASA Astrophysics Data System (ADS)

    Oskooi, Ardavan F.; Roundy, David; Ibanescu, Mihai; Bermel, Peter; Joannopoulos, J. D.; Johnson, Steven G.

    2010-03-01

    This paper describes Meep, a popular free implementation of the finite-difference time-domain (FDTD) method for simulating electromagnetism. In particular, we focus on aspects of implementing a full-featured FDTD package that go beyond standard textbook descriptions of the algorithm, or ways in which Meep differs from typical FDTD implementations. These include pervasive interpolation and accurate modeling of subpixel features, advanced signal processing, support for nonlinear materials via Padé approximants, and flexible scripting capabilities. Program summaryProgram title: Meep Catalogue identifier: AEFU_v1_0 Program summary URL::http://cpc.cs.qub.ac.uk/summaries/AEFU_v1_0.html Program obtainable from: CPC Program Library, Queen's University, Belfast, N. Ireland Licensing provisions: GNU GPL No. of lines in distributed program, including test data, etc.: 151 821 No. of bytes in distributed program, including test data, etc.: 1 925 774 Distribution format: tar.gz Programming language: C++ Computer: Any computer with a Unix-like system and a C++ compiler; optionally exploits additional free software packages: GNU Guile [1], libctl interface library [2], HDF5 [3], MPI message-passing interface [4], and Harminv filter-diagonalization [5]. Developed on 2.8 GHz Intel Core 2 Duo. Operating system: Any Unix-like system; developed under Debian GNU/Linux 5.0.2. RAM: Problem dependent (roughly 100 bytes per pixel/voxel) Classification: 10 External routines: Optionally exploits additional free software packages: GNU Guile [1], libctl interface library [2], HDF5 [3], MPI message-passing interface [4], and Harminv filter-diagonalization [5] (which requires LAPACK and BLAS linear-algebra software [6]). Nature of problem: Classical electrodynamics Solution method: Finite-difference time-domain (FDTD) method Running time: Problem dependent (typically about 10 ns per pixel per timestep) References:[1] GNU Guile, http://www.gnu.org/software/guile[2] Libctl, http

  18. SPHINX experimenters information package

    SciTech Connect

    Zarick, T.A.

    1996-08-01

    This information package was prepared for both new and experienced users of the SPHINX (Short Pulse High Intensity Nanosecond X-radiator) flash X-Ray facility. It was compiled to help facilitate experiment design and preparation for both the experimenter(s) and the SPHINX operational staff. The major areas covered include: Recording Systems Capabilities,Recording System Cable Plant, Physical Dimensions of SPHINX and the SPHINX Test cell, SPHINX Operating Parameters and Modes, Dose Rate Map, Experiment Safety Approval Form, and a Feedback Questionnaire. This package will be updated as the SPHINX facilities and capabilities are enhanced.

  19. AN ADA NAMELIST PACKAGE

    NASA Technical Reports Server (NTRS)

    Klumpp, A. R.

    1994-01-01

    The Ada Namelist Package, developed for the Ada programming language, enables a calling program to read and write FORTRAN-style namelist files. A namelist file consists of any number of assignment statements in any order. Features of the Ada Namelist Package are: the handling of any combination of user-defined types; the ability to read vectors, matrices, and slices of vectors and matrices; the handling of mismatches between variables in the namelist file and those in the programmed list of namelist variables; and the ability to avoid searching the entire input file for each variable. The principle user benefits of this software are the following: the ability to write namelist-readable files, the ability to detect most file errors in the initialization phase, a package organization that reduces the number of instantiated units to a few packages rather than to many subprograms, a reduced number of restrictions, and an increased execution speed. The Ada Namelist reads data from an input file into variables declared within a user program. It then writes data from the user program to an output file, printer, or display. The input file contains a sequence of assignment statements in arbitrary order. The output is in namelist-readable form. There is a one-to-one correspondence between namelist I/O statements executed in the user program and variables read or written. Nevertheless, in the input file, mismatches are allowed between assignment statements in the file and the namelist read procedure statements in the user program. The Ada Namelist Package itself is non-generic. However, it has a group of nested generic packages following the nongeneric opening portion. The opening portion declares a variety of useraccessible constants, variables and subprograms. The subprograms are procedures for initializing namelists for reading, reading and writing strings. The subprograms are also functions for analyzing the content of the current dataset and diagnosing errors. Two nested

  20. Spooled packaging of shape memory alloy actuators

    NASA Astrophysics Data System (ADS)

    Redmond, John A.

    A vast cross-section of transportation, manufacturing, consumer product, and medical technologies rely heavily on actuation. Accordingly, progress in these industries is often strongly coupled to the advancement of actuation technologies. As the field of actuation continues to evolve, smart materials show significant promise for satisfying the growing needs of industry. In particular, shape memory alloy (SMA) wire actuators present an opportunity for low-cost, high performance actuation, but until now, they have been limited or restricted from use in many otherwise suitable applications by the difficulty in packaging the SMA wires within tight or unusually shaped form constraints. To address this packaging problem, SMA wires can be spool-packaged by wrapping around mandrels to make the actuator more compact or by redirecting around multiple mandrels to customize SMA wire pathways to unusual form factors. The goal of this dissertation is to develop the scientific knowledge base for spooled packaging of low-cost SMA wire actuators that enables high, predictable performance within compact, customizable form factors. In developing the scientific knowledge base, this dissertation defines a systematic general representation of single and multiple mandrel spool-packaged SMA actuators and provides tools for their analysis, understanding, and synthesis. A quasi-static analytical model distills the underlying mechanics down to the three effects of friction, bending, and binding, which enables prediction of the behavior of generic spool-packaged SMA actuators with specifiable geometric, loading, frictional, and SMA material parameters. An extensive experimental and simulation-based parameter study establishes the necessary understanding of how primary design tradeoffs between performance, packaging, and cost are governed by the underlying mechanics of spooled actuators. A design methodology outlines a systematic approach to synthesizing high performance SMA wire actuators

  1. Printer Graphics Package

    NASA Technical Reports Server (NTRS)

    Blanchard, D. C.

    1986-01-01

    Printer Graphics Package (PGP) is tool for making two-dimensional symbolic plots on line printer. PGP created to support development of Heads-Up Display (HUD) simulation. Standard symbols defined with HUD in mind. Available symbols include circle, triangle, quadrangle, window, line, numbers, and text. Additional symbols easily added or built up from available symbols.

  2. Electro-Microfluidic Packaging

    NASA Astrophysics Data System (ADS)

    Benavides, G. L.; Galambos, P. C.

    2002-06-01

    There are many examples of electro-microfluidic products that require cost effective packaging solutions. Industry has responded to a demand for products such as drop ejectors, chemical sensors, and biological sensors. Drop ejectors have consumer applications such as ink jet printing and scientific applications such as patterning self-assembled monolayers or ejecting picoliters of expensive analytes/reagents for chemical analysis. Drop ejectors can be used to perform chemical analysis, combinatorial chemistry, drug manufacture, drug discovery, drug delivery, and DNA sequencing. Chemical and biological micro-sensors can sniff the ambient environment for traces of dangerous materials such as explosives, toxins, or pathogens. Other biological sensors can be used to improve world health by providing timely diagnostics and applying corrective measures to the human body. Electro-microfluidic packaging can easily represent over fifty percent of the product cost and, as with Integrated Circuits (IC), the industry should evolve to standard packaging solutions. Standard packaging schemes will minimize cost and bring products to market sooner.

  3. Radioactive waste disposal package

    DOEpatents

    Lampe, Robert F.

    1986-11-04

    A radioactive waste disposal package comprising a canister for containing vitrified radioactive waste material and a sealed outer shell encapsulating the canister. A solid block of filler material is supported in said shell and convertible into a liquid state for flow into the space between the canister and outer shell and subsequently hardened to form a solid, impervious layer occupying such space.

  4. Radioactive waste disposal package

    DOEpatents

    Lampe, Robert F.

    1986-01-01

    A radioactive waste disposal package comprising a canister for containing vitrified radioactive waste material and a sealed outer shell encapsulating the canister. A solid block of filler material is supported in said shell and convertible into a liquid state for flow into the space between the canister and outer shell and subsequently hardened to form a solid, impervious layer occupying such space.

  5. CH Packaging Maintenance Manual

    SciTech Connect

    Washington TRU Solutions

    2002-01-02

    This procedure provides instructions for performing inner containment vessel (ICV) and outer containment vessel (OCV) maintenance and periodic leakage rate testing on the following packaging seals and corresponding seal surfaces using a nondestructive helium (He) leak test. In addition, this procedure provides instructions for performing ICV and OCV structural pressure tests.

  6. Project Information Packages Kit.

    ERIC Educational Resources Information Center

    RMC Research Corp., Mountain View, CA.

    Presented are an overview booklet, a project selection guide, and six Project Information Packages (PIPs) for six exemplary projects serving underachieving students in grades k through 9. The overview booklet outlines the PIP projects and includes a chart of major project features. A project selection guide reviews the PIP history, PIP contents,…

  7. Jpetra Kernel Package

    SciTech Connect

    Heroux, Michael A.

    2004-03-01

    A package of classes for constructing and using distributed sparse and dense matrices, vectors and graphs, written in Java. Jpetra is intended to provide the foundation for basic matrix and vector operations for Java developers. Jpetra provides distributed memory operations via an abstract parallel machine interface. The most common implementation of this interface will be Java sockets.

  8. Waste disposal package

    DOEpatents

    Smith, M.J.

    1985-06-19

    This is a claim for a waste disposal package including an inner or primary canister for containing hazardous and/or radioactive wastes. The primary canister is encapsulated by an outer or secondary barrier formed of a porous ceramic material to control ingress of water to the canister and the release rate of wastes upon breach on the canister. 4 figs.

  9. Automatic Differentiation Package

    2007-03-01

    Sacado is an automatic differentiation package for C++ codes using operator overloading and C++ templating. Sacado provide forward, reverse, and Taylor polynomial automatic differentiation classes and utilities for incorporating these classes into C++ codes. Users can compute derivatives of computations arising in engineering and scientific applications, including nonlinear equation solving, time integration, sensitivity analysis, stability analysis, optimization and uncertainity quantification.

  10. Package for fragile objects

    DOEpatents

    Burgeson, Duane A.

    1977-01-01

    A package for fragile objects such as radioactive fusion pellets of micron size shipped in mounted condition or unmounted condition with a frangible inner container which is supported in a second inner container which in turn is supported in a final outer container, the second inner container having recesses for supporting alternate design inner containers.

  11. Metric Education Evaluation Package.

    ERIC Educational Resources Information Center

    Kansky, Bob; And Others

    This document was developed out of a need for a complete, carefully designed set of evaluation instruments and procedures that might be applied in metric inservice programs across the nation. Components of this package were prepared in such a way as to permit local adaptation to the evaluation of a broad spectrum of metric education activities.…

  12. High Efficiency Integrated Package

    SciTech Connect

    Ibbetson, James

    2013-09-15

    Solid-state lighting based on LEDs has emerged as a superior alternative to inefficient conventional lighting, particularly incandescent. LED lighting can lead to 80 percent energy savings; can last 50,000 hours – 2-50 times longer than most bulbs; and contains no toxic lead or mercury. However, to enable mass adoption, particularly at the consumer level, the cost of LED luminaires must be reduced by an order of magnitude while achieving superior efficiency, light quality and lifetime. To become viable, energy-efficient replacement solutions must deliver system efficacies of ≥ 100 lumens per watt (LPW) with excellent color rendering (CRI > 85) at a cost that enables payback cycles of two years or less for commercial applications. This development will enable significant site energy savings as it targets commercial and retail lighting applications that are most sensitive to the lifetime operating costs with their extended operating hours per day. If costs are reduced substantially, dramatic energy savings can be realized by replacing incandescent lighting in the residential market as well. In light of these challenges, Cree proposed to develop a multi-chip integrated LED package with an output of > 1000 lumens of warm white light operating at an efficacy of at least 128 LPW with a CRI > 85. This product will serve as the light engine for replacement lamps and luminaires. At the end of the proposed program, this integrated package was to be used in a proof-of-concept lamp prototype to demonstrate the component’s viability in a common form factor. During this project Cree SBTC developed an efficient, compact warm-white LED package with an integrated remote color down-converter. Via a combination of intensive optical, electrical, and thermal optimization, a package design was obtained that met nearly all project goals. This package emitted 1295 lm under instant-on, room-temperature testing conditions, with an efficacy of 128.4 lm/W at a color temperature of ~2873

  13. Clean Cities Now Vol. 16.1

    SciTech Connect

    2012-05-01

    Biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on advanced vehicle deployment, idle reduction, and articles on Clean Cities coalition successes across the country.

  14. Clean Cities Now Vol. 17, No. 1

    SciTech Connect

    2013-05-24

    Biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on advanced vehicle deployment, idle reduction, and articles on Clean Cities coalition successes across the country.

  15. Alternative Packaging for Back-Illuminated Imagers

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata

    2009-01-01

    An alternative scheme has been conceived for packaging of silicon-based back-illuminated, back-side-thinned complementary metal oxide/semiconductor (CMOS) and charge-coupled-device image-detector integrated circuits, including an associated fabrication process. This scheme and process are complementary to those described in "Making a Back-Illuminated Imager With Back-Side Connections" (NPO-42839), NASA Tech Briefs, Vol. 32, No. 7 (July 2008), page 38. To avoid misunderstanding, it should be noted that in the terminology of imaging integrated circuits, "front side" or "back side" does not necessarily refer to the side that, during operation, faces toward or away from a source of light or other object to be imaged. Instead, "front side" signifies that side of a semiconductor substrate upon which the pixel pattern and the associated semiconductor devices and metal conductor lines are initially formed during fabrication, and "back side" signifies the opposite side. If the imager is of the type called "back-illuminated," then the back side is the one that faces an object to be imaged. Initially, a back-illuminated, back-side-thinned image-detector is fabricated with its back side bonded to a silicon handle wafer. At a subsequent stage of fabrication, the front side is bonded to a glass wafer (for mechanical support) and the silicon handle wafer is etched away to expose the back side. The frontside integrated circuitry includes metal input/output contact pads, which are rendered inaccessible by the bonding of the front side to the glass wafer. Hence, one of the main problems is to make the input/output contact pads accessible from the back side, which is ultimately to be the side accessible to the external world. The present combination of an alternative packaging scheme and associated fabrication process constitute a solution of the problem.

  16. Francais langue seconde: trousse d'evaluation--tests modeles pour les cours: French 31a (Avance 7); French 31b (Avance 8); French 31c (Avance 9) (French as a Second Language: Evaluation Resource Package--Model Tests for the Courses: French 31a (Advanced 7); French 31b (Advanced 8); French 31c (Advanced 9)).

    ERIC Educational Resources Information Center

    Alberta Dept. of Education, Edmonton. Language Services Branch.

    The French as a Second Language model tests for advanced levels 7, 8, and 9 were designed to evaluate students' language performance, as outlined in the program of studies for Alberta, Canada, in listening and reading comprehension and oral and written production, communication skills, culture, language and general language knowledge. The tests…

  17. Packaging design criteria for the Hanford Ecorok Packaging

    SciTech Connect

    Mercado, M.S.

    1996-01-19

    The Hanford Ecorok Packaging (HEP) will be used to ship contaminated water purification filters from K Basins to the Central Waste Complex. This packaging design criteria documents the design of the HEP, its intended use, and the transportation safety criteria it is required to meet. This information will serve as a basis for the safety analysis report for packaging.

  18. A Compact, Modular Package for Superconducting Bolometer Arrays

    NASA Technical Reports Server (NTRS)

    Benford, D.

    2008-01-01

    As bolometer arrays grow to ever-larger formats, packaging becomes a more critical engineering issue. We have designed a detector package to house a superconducting bolometer array, SQUID multiplexers, bias and filtering circuitry, and electrical connectors. The package includes an optical filter, magnetic shielding, and has well-defined thermal and mechanical interfaces. An early version of this package has been used successfully in the GISMO 2mm camera, a 128-pixel camera operating at a base temperature of 270mK. A more advanced package permits operation at lower temperatures by providing direct heat sinking to the SQUIDS and bias resistors, which generate the bulk of the dissipation in the package. Standard electrical connectors provide reliable contact while enabling quick installation and removal of the package. We describe how the design compensates for differing thermal expansions, allows heat sinking of the bolometer array, and features magnetic shielding in critical areas. We highlight the performance of this detector package and describe its scalability to 1280-pixel arrays in the near future.

  19. Sustainable Library Development Training Package

    ERIC Educational Resources Information Center

    Peace Corps, 2012

    2012-01-01

    This Sustainable Library Development Training Package supports Peace Corps' Focus In/Train Up strategy, which was implemented following the 2010 Comprehensive Agency Assessment. Sustainable Library Development is a technical training package in Peace Corps programming within the Education sector. The training package addresses the Volunteer…

  20. SAT Packages--An Update.

    ERIC Educational Resources Information Center

    Staples, Betsy

    1985-01-01

    Describes software packages used to help prepare for the Scholastic Aptitude Test, considering features that the packages have in common as well as unique features that each package has. Also lists and ranks the products and their features in a chart (indicating system requirements and current cost). (JN)

  1. Anticounterfeit packaging technologies.

    PubMed

    Shah, Ruchir Y; Prajapati, Prajesh N; Agrawal, Y K

    2010-10-01

    Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology. PMID:22247875

  2. Anticounterfeit packaging technologies

    PubMed Central

    Shah, Ruchir Y.; Prajapati, Prajesh N.; Agrawal, Y. K.

    2010-01-01

    Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology. PMID:22247875

  3. RH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions, LLC

    2003-08-25

    The purpose of this program guidance document is to provide technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the SARP and/or C of C shall govern. The C of C states: ''...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, ''Operating Procedures,'' of the application.'' It further states: ''...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, ''Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M&O) contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC approved, users need to be familiar with 10 CFR {section} 71.11, ''Deliberate Misconduct.'' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the RH-TRU 72-B packaging. This Program Guidance standardizes instructions for all users. Users shall follow these instructions. Following these instructions assures that operations are safe and meet the requirements of the SARP. This document is available on the Internet at: ttp://www.ws/library/t2omi/t2omi.htm. Users are responsible for ensuring they are using the current revision and change notices. Sites may prepare their own document using the word

  4. The Ettention software package.

    PubMed

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-02-01

    We present a novel software package for the problem "reconstruction from projections" in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. PMID:26686659

  5. KAPPA -- Kernel Application Package

    NASA Astrophysics Data System (ADS)

    Currie, Malcolm J.; Berry, David. S.

    KAPPA is an applications package comprising about 180 general-purpose commands for image processing, data visualisation, and manipulation of the standard Starlink data format---the NDF. It is intended to work in conjunction with Starlink's various specialised packages. In addition to the NDF, KAPPA can also process data in other formats by using the `on-the-fly' conversion scheme. Many commands can process data arrays of arbitrary dimension, and others work on both spectra and images. KAPPA operates from both the UNIX C-shell and the ICL command language. This document describes how to use KAPPA and its features. There is some description of techniques too, including a section on writing scripts. This document includes several tutorials and is illustrated with numerous examples. The bulk of this document comprises detailed descriptions of each command as well as classified and alphabetical summaries.

  6. Aquaculture information package

    SciTech Connect

    Boyd, T.; Rafferty, K.

    1998-08-01

    This package of information is intended to provide background information to developers of geothermal aquaculture projects. The material is divided into eight sections and includes information on market and price information for typical species, aquaculture water quality issues, typical species culture information, pond heat loss calculations, an aquaculture glossary, regional and university aquaculture offices and state aquaculture permit requirements. A bibliography containing 68 references is also included.

  7. Software packager user's guide

    NASA Technical Reports Server (NTRS)

    Callahan, John R.

    1995-01-01

    Software integration is a growing area of concern for many programmers and software managers because the need to build new programs quickly from existing components is greater than ever. This includes building versions of software products for multiple hardware platforms and operating systems, building programs from components written in different languages, and building systems from components that must execute on different machines in a distributed network. The goal of software integration is to make building new programs from existing components more seamless -- programmers should pay minimal attention to the underlying configuration issues involved. Libraries of reusable components and classes are important tools but only partial solutions to software development problems. Even though software components may have compatible interfaces, there may be other reasons, such as differences between execution environments, why they cannot be integrated. Often, components must be adapted or reimplemented to fit into another application because of implementation differences -- they are implemented in different programming languages, dependent on different operating system resources, or must execute on different physical machines. The software packager is a tool that allows programmers to deal with interfaces between software components and ignore complex integration details. The packager takes modular descriptions of the structure of a software system written in the package specification language and produces an integration program in the form of a makefile. If complex integration tools are needed to integrate a set of components, such as remote procedure call stubs, their use is implied by the packager automatically and stub generation tools are invoked in the corresponding makefile. The programmer deals only with the components themselves and not the details of how to build the system on any given platform.

  8. Navy packaging standardization thrusts

    NASA Astrophysics Data System (ADS)

    Kidwell, J. R.

    1982-11-01

    Standardization is a concept that is basic to our world today. The idea of reducing costs through the economics of mass production is an easy one to grasp. Henry Ford started the process of large scale standardization in this country with the Detroit production lines for his automobiles. In the process additional benefits accrued, such as improved reliability through design maturity, off-the-shelf repair parts, faster repair time, and a resultant lower cost of ownership (lower life-cycle cost). The need to attain standardization benefits with military equipments exists now. Defense budgets, although recently increased, are not going to permit us to continue the tremendous investment required to maintain even the status quo and develop new hardware at the same time. Needed are more reliable, maintainable, testable hardware in the Fleet. It is imperative to recognize the obsolescence problems created by the use of high technology devices in our equipments, and find ways to combat these shortfalls. The Navy has two packaging standardization programs that will be addressed in this paper; the Standard Electronic Modules and the Modular Avionics Packaging programs. Following a brief overview of the salient features of each program, the packaging technology aspects of the program will be addressed, and developmental areas currently being investigated will be identified.

  9. 78 FR 19007 - Certain Products Having Laminated Packaging, Laminated Packaging, and Components Thereof...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-03-28

    ... COMMISSION Certain Products Having Laminated Packaging, Laminated Packaging, and Components Thereof.... 1337, on behalf of Lamina Packaging Innovations LLC of Longview, Texas. An amended complaint was filed... importation of certain products having laminated packaging, laminated packaging, and components thereof...

  10. 78 FR 13083 - Products Having Laminated Packaging, Laminated Packaging, and Components Thereof; Notice of...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-02-26

    ... COMMISSION Products Having Laminated Packaging, Laminated Packaging, and Components Thereof; Notice of... Commission has received a complaint entitled Products Having Laminated ] Packaging, Laminated Packaging, and... filed on behalf of Lamina Packaging Innovations LLC on February 20, 2013. The complaint...

  11. Plutonium stabilization and packaging system

    SciTech Connect

    1996-05-01

    This document describes the functional design of the Plutonium Stabilization and Packaging System (Pu SPS). The objective of this system is to stabilize and package plutonium metals and oxides of greater than 50% wt, as well as other selected isotopes, in accordance with the requirements of the DOE standard for safe storage of these materials for 50 years. This system will support completion of stabilization and packaging campaigns of the inventory at a number of affected sites before the year 2002. The package will be standard for all sites and will provide a minimum of two uncontaminated, organics free confinement barriers for the packaged material.

  12. Clean Cities Now, Vol. 18, No. 1

    SciTech Connect

    2014-04-30

    The Spring 2014 edition of the semi-annual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on deployment of alternative fuels and advanced vehicles, and articles on Clean Cities coalition successes across the country.

  13. Clean Cities Now Vol. 19, No. 1

    SciTech Connect

    2015-07-24

    Now is the official bi-annual newsletter of Clean Cities, an initiative designed to reduce petroleum consumption in the transportation sector by advancing the use of alternative and renewable fuels, fuel economy improvements, idle-reduction measures, and new technologies, as they emerge.

  14. Clean Cities Now, Vol. 18, No. 2

    SciTech Connect

    2015-01-19

    This is version 18.2 of Clean Cities Now, the official biannual newsletter of the Clean Cities program. Clean Cities is an initiative designed to reduce petroleum consumption in the transportation sector by advancing the use of alternative and renewable fuels, fuel economy improvements, idle-reduction measures, and new technologies, as they emerge.

  15. Clean Cities Now Vol. 19, No. 2

    SciTech Connect

    2015-12-18

    Clean Cities Now is the official bi-annual newsletter of Clean Cities, an initiative designed to reduce petroleum consumption in the transportation sector by advancing the use of alternative and renewable fuels, fuel economy improvements, idle-reduction measures, and new technologies, as they emerge.

  16. Clean Cities Now Vol. 17, No. 2

    SciTech Connect

    2013-10-23

    The Fall 2013 issue of the biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on deployment of alternative fuels and advanced vehicles, and articles on Clean Cities coalition successes across the country.

  17. Science Books, Vol. 10 No. 3.

    ERIC Educational Resources Information Center

    Wolff, Kathryn, Ed.

    This quarterly journal reviews trade books, textbooks, and reference works in the pure and applied sciences for students in elementary and secondary schools and in the first two years of college. Included are selected advanced and professional books useful for reference to students and teachers. Each book is reviewed and annotated by a qualified…

  18. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  19. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  20. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  1. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  2. Optimal segmentation and packaging process

    DOEpatents

    Kostelnik, Kevin M.; Meservey, Richard H.; Landon, Mark D.

    1999-01-01

    A process for improving packaging efficiency uses three dimensional, computer simulated models with various optimization algorithms to determine the optimal segmentation process and packaging configurations based on constraints including container limitations. The present invention is applied to a process for decontaminating, decommissioning (D&D), and remediating a nuclear facility involving the segmentation and packaging of contaminated items in waste containers in order to minimize the number of cuts, maximize packaging density, and reduce worker radiation exposure. A three-dimensional, computer simulated, facility model of the contaminated items are created. The contaminated items are differentiated. The optimal location, orientation and sequence of the segmentation and packaging of the contaminated items is determined using the simulated model, the algorithms, and various constraints including container limitations. The cut locations and orientations are transposed to the simulated model. The contaminated items are actually segmented and packaged. The segmentation and packaging may be simulated beforehand. In addition, the contaminated items may be cataloged and recorded.

  3. Miniaturization of dielectric liquid microlens in package

    PubMed Central

    Yang, Chih-Cheng; Tsai, C. Gary; Yeh, J. Andrew

    2010-01-01

    This study presents packaged microscale liquid lenses actuated with liquid droplets of 300–700 μm in diameter using the dielectric force manipulation. The liquid microlens demonstrated function focal length tunability in a plastic package. The focal length of the liquid lens with a lens droplet of 500 μm in diameter is shortened from 4.4 to 2.2 mm when voltages applied change from 0 to 79 Vrms. Dynamic responses that are analyzed using 2000 frames∕s high speed motion cameras show that the advancing and receding times are measured to be 90 and 60 ms, respectively. The size effect of dielectric liquid microlens is characterized for a lens droplet of 300–700 μm in diameter in an aspect of focal length. PMID:21267438

  4. (abstract) Electronic Packaging for Microspacecraft Applications

    NASA Technical Reports Server (NTRS)

    Wasler, David

    1993-01-01

    The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft.

  5. Compact integrated piezoelectric vibration control package

    NASA Astrophysics Data System (ADS)

    Spangler, Ronald L., Jr.; Russo, Farla M.; Palombo, Daniel A.

    1997-06-01

    Using recent advances in small, surface-mount electronics, coupled with proprietary packaging techniques, ACX has developed the SmartPackTM. The design and realization of this self-contained, active piezoelectric control device are described in this paper. The SmartPack uses a local control architecture, consisting of two parallel, analog, positive position feedback (PPF) filters, along with nearly collocated piezo strain sensors and actuators, to control multiple structural vibration modes. A key issue is the management of waste heat from the power electronics required to drive the piezo actuators. This issue is addressed through thermal/electrical modeling of the packaged amplifier. The effectiveness of the device is demonstrated through multi-mode active damping on a 24 inch square plate.

  6. Experiment Safety Assurance Package for the 40- to 52-GWd/MT Burnup Phase of Mixed Oxide Fuel Irradiation in Small I-hole Positions in the Advanced Test Reactor

    SciTech Connect

    S. T. Khericha; R. C. Pedersen

    2003-09-01

    This experiment safety assurance package (ESAP) is a revision of the last mixed uranium and plutonium oxide (MOX) ESAP issued in June 2002). The purpose of this revision is to provide a basis to continue irradiation up to 52 GWd/MT burnup [as predicted by MCNP (Monte Carlo N-Particle) transport code The last ESAP provided basis for irradiation, at a linear heat generation rate (LHGR) no greater than 9 kW/ft, of the highest burnup capsule assembly to 50 GWd/MT. This ESAP extends the basis for irradiation, at a LHGR no greater than 5 kW/ft, of the highest burnup capsule assembly from 50 to 52 GWd/MT.

  7. Packaging - Materials review

    NASA Astrophysics Data System (ADS)

    Herrmann, Matthias

    2014-06-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  8. Packaging - Materials review

    SciTech Connect

    Herrmann, Matthias

    2014-06-16

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  9. The Kull IMC package

    SciTech Connect

    Gentile, N A; Keen,N; Rathkopf, J

    1998-10-01

    We describe the Kull IMC package, and Implicit Monte Carlo Program written for use in A and X division radiation hydro codes. The Kull IMC has been extensively tested. Written in C++ and using genericity via the template feature to allow easy integration into different codes, the Kull IMC currently runs coupled radiation hydrodynamic problems in 2 different 3D codes. A stand-alone version also exists, which has been parallelized with mesh replication. This version has been run on up to 384 processors on ASCI Blue Pacific.

  10. Aristos Optimization Package

    2007-03-01

    Aristos is a Trilinos package for nonlinear continuous optimization, based on full-space sequential quadratic programming (SQP) methods. Aristos is specifically designed for the solution of large-scale constrained optimization problems in which the linearized constraint equations require iterative (i.e. inexact) linear solver techniques. Aristos' unique feature is an efficient handling of inexactness in linear system solves. Aristos currently supports the solution of equality-constrained convex and nonconvex optimization problems. It has been used successfully in the areamore » of PDE-constrained optimization, for the solution of nonlinear optimal control, optimal design, and inverse problems.« less

  11. Safety Analysis Report for packaging (onsite) steel waste package

    SciTech Connect

    BOEHNKE, W.M.

    2000-07-13

    The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A{sub 2}s) and is a type B packaging.

  12. Photocopy from Evan Leigh's Modern Cotton Spinning (Vol 1), Manchester, ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    Photocopy from Evan Leigh's Modern Cotton Spinning (Vol 1), Manchester, 1873 (PL XX); illustration used by eminent British textile engineer to exemplify the ultimate development in American cotton mill technology. - Harmony Manufacturing Company, Mill Number 3, 100 North Mohawk Street, Cohoes, Albany County, NY

  13. 3. Photocopy form Western Architect, Vol, 19, No. 8, August ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    3. Photocopy form Western Architect, Vol, 19, No. 8, August 1913, following page 80. 'TOWN AND COMMUNITY PLANNING, WALTER BURLEY GRIFFEN.' ORIGINAL PRESENTATION DRAWING AT NORTHWESTERN UNIVERSITY, ART DEPARTMENT. - Joshua G. Melson House, 56 River Heights Drive, Mason City, Cerro Gordo County, IA

  14. Optimizing sensor packaging costs and performances in environmental applications

    NASA Astrophysics Data System (ADS)

    Gandelli, Alessandro; Grimaccia, Francesco; Zich, Riccardo E.

    2005-02-01

    Sensor packaging has been identified as one of the most significant areas of research for enabling sensor usage in harsh environments for several application fields. Protection is one of the primary goals of sensor packaging; however, research deals not only with robust and resistant packages optimization, but also with electromagnetic performance. On the other hand, from the economic point of view, wireless sensor networks present hundreds of thousands of small sensors, namely motes, whose costs should be reduced at the lowest level, thus driving low the packaging cost also. So far, packaging issues have not been extended to such topics because these products are not yet in the advanced production cycle. However, in order to guarantee high EMC performance and low packaging costs, it is necessary to address the packaging strategy from the very beginning. Technological improvements that impacts on production time and costs can be suitable organized by anticipating the above mentioned issues in the development and design of the motes, obtaining in this way a significant reduction of final efforts for optimization. The paper addresses the development and production techniques necessary to identify the real needs in such a field and provides the suitable strategies to enhance industrial performance of high-volumes productions. Moreover the electrical and mechanical characteristics of these devices are reviewed and better identified in function of the environmental requirements and electromagnetic compatibility. Future developments complete the scenario and introduce the next mote generation characterized by a cost lower by an order of magnitude.

  15. Japan's electronic packaging technologies

    NASA Technical Reports Server (NTRS)

    Tummala, Rao R.; Pecht, Michael

    1995-01-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  16. CH Packaging Operations Manual

    SciTech Connect

    None, None

    2009-05-27

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing "Short" 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing "Tall" 85-Gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing Shielded Container Payload Assembly; 1.7, Preparing SWB Payload Assembly; and 1.8, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence, except as noted.

  17. Japan's electronic packaging technologies

    NASA Astrophysics Data System (ADS)

    Tummala, Rao R.; Pecht, Michael

    1995-02-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  18. CH Packaging Operations Manual

    SciTech Connect

    None, None

    2008-09-11

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing "Short" 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing "Tall" 85-gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing SWB Payload Assembly; and 1.7, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence.

  19. IIP Update: A Packaged Coherent Doppler Wind Lidar Transceiver. Doppler Aerosol WiNd Lidar (DAWN)

    NASA Technical Reports Server (NTRS)

    Kavaya, Michael J.; Koch, Grady J.; Yu, Jirong; Trieu, Bo C.; Amzajerdian, Farzin; Singh, Upendra N.; Petros, Mulugeta

    2006-01-01

    The state-of-the-art 2-micron coherent Doppler wind lidar breadboard at NASA/LaRC will be engineered and compactly packaged consistent with future aircraft flights. The packaged transceiver will be integrated into a coherent Doppler wind lidar system test bed at LaRC. Atmospheric wind measurements will be made to validate the packaged technology. This will greatly advance the coherent part of the hybrid Doppler wind lidar solution to the need for global tropospheric wind measurements.

  20. Progress in biomass conversion. Vol. 4

    SciTech Connect

    Tillman, D.A.; Jahn, E.C.

    1983-01-01

    This book contains 10 chapters by various authors: Lipid crops for chemicals and fuels; Lignin utilization: potential and challenge; Adhesives from natural resources; Formation of NO and particulates during suspension-phase wood combustion; Wood energy use in the wood products industry: what the data show; Advances in chemical pulping processes; Making the best energy use of wood; A predictive model for stratified downdraft gasification of biomass; Small scale industrial biomass systems; and Biomass augmented ocean thermal energy conversion systems. An index is included.

  1. Space station power semiconductor package

    NASA Technical Reports Server (NTRS)

    Balodis, Vilnis; Berman, Albert; Devance, Darrell; Ludlow, Gerry; Wagner, Lee

    1987-01-01

    A package of high-power switching semiconductors for the space station have been designed and fabricated. The package includes a high-voltage (600 volts) high current (50 amps) NPN Fast Switching Power Transistor and a high-voltage (1200 volts), high-current (50 amps) Fast Recovery Diode. The package features an isolated collector for the transistors and an isolated anode for the diode. Beryllia is used as the isolation material resulting in a thermal resistance for both devices of .2 degrees per watt. Additional features include a hermetical seal for long life -- greater than 10 years in a space environment. Also, the package design resulted in a low electrical energy loss with the reduction of eddy currents, stray inductances, circuit inductance, and capacitance. The required package design and device parameters have been achieved. Test results for the transistor and diode utilizing the space station package is given.

  2. Experiment Safety Assurance Package for the 40- to 50-GWd/MT Burnup Phase of Mixed Oxide Fuel Irradiation in Small I-Hole Positions in the Advanced Test Reactor

    SciTech Connect

    Khericha, S.T.

    2002-06-30

    This experiment safety assurance package (ESAP) is a revision of the last MOX ESAP issued in February 2001(Khericha 2001). The purpose of this revision is to identify the changes in the loading pattern and to provide a basis to continue irradiation up to {approx}42 GWd/MT burnup (+ 2.5%) as predicted by MCNP (Monte Carlo N-Particle) transport code before the preliminary postirradiation examination (PIE) results for 40 GWd/MT burnup are available. Note that the safety analysis performed for the last ESAP is still applicable and no additional analysis is required (Khericha 2001). In July 2001, it was decided to reconfigure the test assembly using the loading pattern for Phase IV, Part 3, at the end of Phase IV, Part 1, as the loading pattern for Phase IV, Parts 2 and 3. Three capsule assemblies will be irradiated until the highest burnup capsule assembly accumulates: {approx}50 GWd/MT burnup, based on the MCNP code predictions. The last ESAP suggests that at the end of Phase IV, Part 1, we remove the two highest burnup capsule assemblies ({at} {approx}40 GWd/MT burnup) and send them to ORNL for PIE. Then, irradiate the test assembly using the loading pattern for Phase IV, Part 2, until the highest burnup capsule reaches {approx}40 GWd/MT burnup per MCNP-predicted values.

  3. Experiment Safety Assurance Package for the 40- to 50-GWd/MT Burnup Phase of Mixed Oxide Fuel Irradiation in Small I-Hole Positions in the Advanced Test Reactor

    SciTech Connect

    Khericha, Soli T

    2002-06-01

    This experiment safety assurance package (ESAP) is a revision of the last MOX ESAP issued in February 2001(Khericha 2001). The purpose of this revision is to identify the changes in the loading pattern and to provide a basis to continue irradiation up to ~42 GWd/MT burnup (+ 2.5% as predicted by MCNP (Monte Carlo N-Particle) transport code before the preliminary postirradiation examination (PIE) results for 40 GWd/MT burnup are available. Note that the safety analysis performed for the last ESAP is still applicable and no additional analysis is required (Khericha 2001). In July 2001, it was decided to reconfigure the test assembly using the loading pattern for Phase IV, Part 3, at the end of Phase IV, Part 1, as the loading pattern for Phase IV, Parts 2 and 3. Three capsule assemblies will be irradiated until the highest burnup capsule assembly accumulates: ~50 GWd/MT burnup, based on the MCNP code predictions. The last ESAP suggests that at the end of Phase IV, Part 1, we remove the two highest burnup capsule assemblies (@ ~40 GWd/MT burnup) and send them to ORNL for PIE. Then, irradiate the test assembly using the loading pattern for Phase IV, Part 2, until the highest burnup capsule reaches ~40 GWd/MT burnup per MCNP-predicted values.

  4. Packaging investigation of optoelectronic devices

    NASA Astrophysics Data System (ADS)

    Zhike, Zhang; Yu, Liu; Jianguo, Liu; Ninghua, Zhu

    2015-10-01

    Compared with microelectronic packaging, optoelectronic packaging as a new packaging type has been developed rapidly and it will play an essential role in optical communication. In this paper, we try to summarize the development history, research status, technology issues and future prospects, and hope to provide a meaningful reference. Project supported by the National High Technology Research and Development Program of China (Nos. 2013AA014201, 2013AA014203) and the National Natural Science Foundation of China (Nos. 61177080, 61335004, 61275031).

  5. IN-PACKAGE CHEMISTRY ABSTRACTION

    SciTech Connect

    E. Thomas

    2005-07-14

    This report was developed in accordance with the requirements in ''Technical Work Plan for Postclosure Waste Form Modeling'' (BSC 2005 [DIRS 173246]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as a function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model, which uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model, which is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials, and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed (CDSP) waste packages containing high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor diffusing into the waste package, and (2) seepage water entering the waste package as a liquid from the drift. (1) Vapor-Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H{sub 2}O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Liquid-Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package.

  6. Micromachining of packaging materials for MEMS using lasers

    NASA Astrophysics Data System (ADS)

    Kancharla, Vijay; Hendricks, Kira; Chen, Shaochen

    2001-09-01

    New lithographic, deposition, and etching tools for micro fabrication on planar silicon substrates have led to remarkable advances in miniaturization of silicon devices. However silicon is often not the substrate material of choice for applications in which there are requirements for electrically or thermally insulating substrates, low capacitance, resistance to corrosion, or hermetic sealing. Some of the MEMS packaging materials such as ceramics, polymers, and glass are currently being used to fabricate many microdevices. To support the rapid advancements of non-silicon MEMS it is necessary to introduce innovative techniques to process these MEMS packaging materials. In this study we present the application of pulsed laser ablation of ceramics, polymers and glass (MEMS packaging materials) to assist in fabrication of MEMS devices. Microstructuring of Al2O3 ceramic, polymers Poly-Vinyl-Alcohol (PVA), polystyrene (PS), and Pyrex glass were performed and studied by pulsed lasers at 193-nm, 266-nm and 308-nm wavelengths.

  7. Hazardous materials package performance regulations

    SciTech Connect

    Russell, N. A.; Glass, R. E.; McClure, J. D.; Finley, N. C.

    1991-01-01

    This paper discusses a hazardous materials Hazmat Packaging Performance Evaluation (HPPE) project being conducted at Sandia National Laboratories for the US Department of Transportation Research Special Programs Administration (DOT-RSPA) to look at the subset of bulk packagings that are larger than 2000 gallons. The objectives of this project are to evaluate current hazmat specification packagings and develop supporting documentation for determining performance requirements for packagings in excess of 2000 gallons that transport hazardous materials that have been classified as extremely toxic by inhalation (METBI).

  8. About the ZOOM minimization package

    SciTech Connect

    Fischler, M.; Sachs, D.; /Fermilab

    2004-11-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete.

  9. Naval Waste Package Design Report

    SciTech Connect

    M.M. Lewis

    2004-03-15

    A design methodology for the waste packages and ancillary components, viz., the emplacement pallets and drip shields, has been developed to provide designs that satisfy the safety and operational requirements of the Yucca Mountain Project. This methodology is described in the ''Waste Package Design Methodology Report'' Mecham 2004 [DIRS 166168]. To demonstrate the practicability of this design methodology, four waste package design configurations have been selected to illustrate the application of the methodology. These four design configurations are the 21-pressurized water reactor (PWR) Absorber Plate waste package, the 44-boiling water reactor (BWR) waste package, the 5-defense high-level waste (DHLW)/United States (U.S.) Department of Energy (DOE) spent nuclear fuel (SNF) Co-disposal Short waste package, and the Naval Canistered SNF Long waste package. Also included in this demonstration is the emplacement pallet and continuous drip shield. The purpose of this report is to document how that design methodology has been applied to the waste package design configurations intended to accommodate naval canistered SNF. This demonstrates that the design methodology can be applied successfully to this waste package design configuration and support the License Application for construction of the repository.

  10. Dry Sliding Wear Behavior of 6351 Al-(4 vol.% SiC + 4 vol.% Al2O3) Hybrid Composite

    NASA Astrophysics Data System (ADS)

    Show, Bijay Kumar; Mondal, Dipak Kumar; Maity, Joydeep

    2014-09-01

    In this research work, the dry sliding wear behavior of 6351 Al-(4 vol.% SiC + 4 vol.% Al2O3) hybrid composite was investigated at low sliding speed (1 m/s) against a hardened EN 31 disk at different loads. In general, the wear mechanism involved adhesion (along with associated subsurface cracking and delamination) and microcutting abrasion at lower load. While at higher load, abrasive wear involving microcutting and microploughing along with adherent oxide formation was observed. The overall wear rate increased with increasing normal load. The massive particle clusters as well as individual reinforcement particles were found to stand tall to resist abrasive wear. Besides, at higher load, the generation of adherent nodular tribo-oxide through nucleation and epitaxial growth on existing Al2O3 particles lowered down the wear rate. Accordingly, at any normal load, 6351 Al-(4 vol.% SiC + 4 vol.% Al2O3) hybrid composite exhibited superior wear resistance (lower overall wear rate) than the reported wear resistance of monolithic 6351 Al alloy.

  11. QD : A Double-Double/ Quad-Double Package

    2003-06-04

    This package permits a scientist to perform computations using a precision level of either 32 or 64 decimal digits, by making only minor changes to conventional C++ or Fortran-90 source code. This software takes advantage of certain properties of IEEE floating-point arithmetic, together with advanced numeric algorithms, custom datatypes and operator overloading.

  12. Learning Activity Package, Algebra 124, LAPs 46-55.

    ERIC Educational Resources Information Center

    Holland, Bill

    A series of 10 teacher-prepared Learning Activity Packages (LAPs) in advanced algebra and trigonometry, these units cover absolute value, inequalities, exponents, radicals, and complex numbers; functions; higher degree equations and the derivative; the trigonometric functions; graphs and applications of the trigonometric functions; sequences and…

  13. Anhydrous Ammonia Training Module. Trainer's Package. Participant's Package.

    ERIC Educational Resources Information Center

    Beaudin, Bart; And Others

    This document contains a trainer's and a participant's package for teaching employees on site safe handling procedures for working with anhydrous ammonia, especially on farms. The trainer's package includes the following: a description of the module; a competency; objectives; suggested instructional aids; a training outline (or lesson plan) for…

  14. Packaging Design Criteria for the Steel Waste Package

    SciTech Connect

    BOEHNKE, W.M.

    2000-10-19

    This packaging design criteria provides the criteria for the design, fabrication, safety evaluation, and use of the steel waste package (SWP) to transport remote-handled waste and special-case waste from the 324 facility to Central Waste Complex (CWC) for interim storage.

  15. Package Up Your Troubles--An Introduction to Package Libraries

    ERIC Educational Resources Information Center

    Frank, Colin

    1978-01-01

    Discusses a "package deal" library--a prefabricated building including interior furnishing--in terms of costs, fitness for purpose, and interior design, i.e., shelving, flooring, heating, lighting, and humidity. Advantages and disadvantages of the package library are also considered. (Author/MBR)

  16. Piecewise Cubic Interpolation Package

    1982-04-23

    PCHIP (Piecewise Cubic Interpolation Package) is a set of subroutines for piecewise cubic Hermite interpolation of data. It features software to produce a monotone and "visually pleasing" interpolant to monotone data. Such an interpolant may be more reasonable than a cubic spline if the data contain both 'steep' and 'flat' sections. Interpolation of cumulative probability distribution functions is another application. In PCHIP, all piecewise cubic functions are represented in cubic Hermite form; that is, f(x)more » is determined by its values f(i) and derivatives d(i) at the breakpoints x(i), i=1(1)N. PCHIP contains three routines - PCHIM, PCHIC, and PCHSP to determine derivative values, six routines - CHFEV, PCHFE, CHFDV, PCHFD, PCHID, and PCHIA to evaluate, differentiate, or integrate the resulting cubic Hermite function, and one routine to check for monotonicity. A FORTRAN 77 version and SLATEC version of PCHIP are included.« less

  17. Thyra Abstract Interface Package

    2005-09-01

    Thrya primarily defines a set of abstract C++ class interfaces needed for the development of abstract numerical atgorithms (ANAs) such as iterative linear solvers, transient solvers all the way up to optimization. At the foundation of these interfaces are abstract C++ classes for vectors, vector spaces, linear operators and multi-vectors. Also included in the Thyra package is C++ code for creating concrete vector, vector space, linear operator, and multi-vector subclasses as well as other utilitiesmore » to aid in the development of ANAs. Currently, very general and efficient concrete subclass implementations exist for serial and SPMD in-core vectors and multi-vectors. Code also currently exists for testing objects and providing composite objects such as product vectors.« less

  18. Meros Preconditioner Package

    2004-04-01

    Meros uses the compositional, aggregation, and overload operator capabilities of TSF to provide an object-oriented package providing segregated/block preconditioners for linear systems related to fully-coupled Navier-Stokes problems. This class of preconditioners exploits the special properties of these problems to segregate the equations and use multi-level preconditioners (through ML) on the matrix sub-blocks. Several preconditioners are provided, including the Fp and BFB preconditioners of Kay & Loghin and Silvester, Elman, Kay & Wathen. The overall performancemore » and scalability of these preconditioners approaches that of multigrid for certain types of problems. Meros also provides more traditional pressure projection methods including SIMPLE and SIMPLEC.« less

  19. Tritium waste package

    DOEpatents

    Rossmassler, R.; Ciebiera, L.; Tulipano, F.J.; Vinson, S.; Walters, R.T.

    1995-11-07

    A containment and waste package system for processing and shipping tritium oxide waste received from a process gas includes an outer drum and an inner drum containing a disposable molecular sieve bed (DMSB) seated within the outer drum. The DMSB includes an inlet diffuser assembly, an outlet diffuser assembly, and a hydrogen catalytic recombiner. The DMSB absorbs tritium oxide from the process gas and converts it to a solid form so that the tritium is contained during shipment to a disposal site. The DMSB is filled with type 4A molecular sieve pellets capable of adsorbing up to 1000 curies of tritium. The recombiner contains a sufficient amount of catalyst to cause any hydrogen and oxygen present in the process gas to recombine to form water vapor, which is then adsorbed onto the DMSB. 1 fig.

  20. Pliris Solver Package

    SciTech Connect

    Kotulski, Joseph D.; Womble, David E.; Greenberg, David; Driessen, Brian

    2004-03-01

    PLIRIS is an object-oriented solver built on top of a previous matrix solver used in a number of application codes. Puns solves a linear system directly via LU factorization with partial pivoting. The user provides the linear system in terms of Epetra Objects including a matrix and right-hand-sides. The user can then factor the matrix and perform the forward and back solve at a later time or solve for multiple right-hand-sides at once. This package is used when dense matrices are obtained in the problem formulation. These dense matrices occur whenever boundary element techniques are chosen for the solution procedure. This has been used in electromagnetics for both static and frequency domain problems.

  1. The LISA Technology Package

    NASA Technical Reports Server (NTRS)

    Livas, Jeff

    2009-01-01

    The LISA Technology Package (LTP) is the payload of the European Space Agency's LISA Pathfinder mission. LISA Pathfinder was instigated to test, in a flight environment, the critical technologies required by LISA; namely, the inertial sensing subsystem and associated control laws and micro-Newton thrusters required to place a macroscopic test mass in pure free-fall. The UP is in the late stages of development -- all subsystems are currently either in the final stages of manufacture or in test. Available flight units are being integrated into the real-time testbeds for system verification tests. This poster will describe the UP and its subsystems, give the current status of the hardware and test campaign, and outline the future milestones leading to the UP delivery.

  2. Tritium waste package

    DOEpatents

    Rossmassler, Rich; Ciebiera, Lloyd; Tulipano, Francis J.; Vinson, Sylvester; Walters, R. Thomas

    1995-01-01

    A containment and waste package system for processing and shipping tritium xide waste received from a process gas includes an outer drum and an inner drum containing a disposable molecular sieve bed (DMSB) seated within outer drum. The DMSB includes an inlet diffuser assembly, an outlet diffuser assembly, and a hydrogen catalytic recombiner. The DMSB absorbs tritium oxide from the process gas and converts it to a solid form so that the tritium is contained during shipment to a disposal site. The DMSB is filled with type 4A molecular sieve pellets capable of adsorbing up to 1000 curies of tritium. The recombiner contains a sufficient amount of catalyst to cause any hydrogen add oxygen present in the process gas to recombine to form water vapor, which is then adsorbed onto the DMSB.

  3. Tpetra Kernel Package

    2004-03-01

    A package of classes for constructing and using distributed sparse and dense matrices, vectors and graphs. Templated on the scalar and ordinal types so that any valid floating-point type, as well as any valid integer type can be used with these classes. Other non-standard types, such as 3-by-3 matrices for the scalar type and mod-based integers for ordinal types, can also be used. Tpetra is intended to provide the foundation for basic matrix and vectormore » operations for the next generation of Trilinos preconditioners and solvers, It can be considered as the follow-on to Epetra. Tpetra provides distributed memory operations via an abstract parallel machine interface, The most common implementation of this interface will be MPI.« less

  4. The LISA Technology Package

    NASA Astrophysics Data System (ADS)

    Livas, Jeffrey C.; LISA Pathfinder Science Working Team

    2010-01-01

    The LISA Technology Package (LTP) is the payload of the European Space Agency's LISA Pathfinder mission. LISA Pathfinder was instigated to test, in a flight environment, the critical technologies required by LISA; namely, the inertial sensing subsystem and associated control laws and micro-Newton thrusters required to place a macroscopic test mass in pure free-fall. The LTP is in the late stages of development - all subsystems are currently either in the final stages of manufacture or in test. Available flight units are being integrated into the real-time testbeds for system verification tests. This poster will describe the LTP and its subsystems, give the current status of the hardware and test campaign, and outline the future milestones leading to the LTP delivery.

  5. The LISA Technology Package

    NASA Astrophysics Data System (ADS)

    McNamara, Paul

    The LISA Technology Package (LTP) is the payload of the European Space Agency's LISA Pathfinder mission. LISA Pathfinder was instigated to test, in a flight environment, the critical technologies required by LISA; namely, the inertial sensing subsystem and associated control laws and micro-Newton thrusters required to place a macroscopic test mass in pure free-fall. The LTP is in the late stages of development -all subsystems are currently either in the final stages of manufacture or in test. Available flight units are being integrated into the real-time testbeds for system verification tests. This poster will describe the LTP and its subsystems, give the current status of the hardware and test campaigns, and outline the future milestones leading to the LTP delivery.

  6. Anasazi Block Eigensolvers Package

    2004-03-01

    ANASAZI is an extensible and interoperable framework for large-scale eigenvalue algorithms. The motivation for this framework is to provide a generic interface to a collection of algorithms for solving large-scale eigenvalue problems. ANASAZI is interoperable because both the matrix and vectors (defining the eigenspace) are considered to be opaque objects---only knowledge of the matrix and vectors via elementary operations is necessary. An implementation of Anasazi is accomplished via the use of interfaces. One of themore » goals of ANASAZI is to allow the user the flexibility to specify the data representation for the matrix and vectors and so leverage any existing software investment. The algorithms that will be included in package are Krylov-based and preconditioned eigensolvers.« less

  7. Balloon gondola diagnostics package

    NASA Technical Reports Server (NTRS)

    Cantor, K. M.

    1986-01-01

    In order to define a new gondola structural specification and to quantify the balloon termination environment, NASA developed a balloon gondola diagnostics package (GDP). This addition to the balloon flight train is comprised of a large array of electronic sensors employed to define the forces and accelerations imposed on a gondola during the termination event. These sensors include the following: a load cell, a three-axis accelerometer, two three-axis rate gyros, two magnetometers, and a two axis inclinometer. A transceiver couple allows the data to be telemetered across any in-line rotator to the gondola-mounted memory system. The GDP is commanded 'ON' just prior to parachute deployment in order to record the entire event.

  8. Romanian experience on packaging testing

    SciTech Connect

    Vieru, G.

    2007-07-01

    With more than twenty years ago, the Institute for Nuclear Research Pitesti (INR), through its Reliability and Testing Laboratory, was licensed by the Romanian Nuclear Regulatory Body- CNCAN and to carry out qualification tests [1] for packages intended to be used for the transport and storage of radioactive materials. Radioactive materials, generated by Romanian nuclear facilities [2] are packaged in accordance with national [3] and the IAEA's Regulations [1,6] for a safe transport to the disposal center. Subjecting these packages to the normal and simulating test conditions accomplish the evaluation and certification in order to prove the package technical performances. The paper describes the qualification tests for type A and B packages used for transport and storage of radioactive materials, during a period of 20 years of experience. Testing is used to substantiate assumption in analytical models and to demonstrate package structural response. The Romanian test facilities [1,3,6] are used to simulate the required qualification tests and have been developed at INR Pitesti, the main supplier of type A packages used for transport and storage of low radioactive wastes in Romania. The testing programme will continue to be a strong option to support future package development, to perform a broad range of verification and certification tests on radioactive material packages or component sections, such as packages used for transport of radioactive sources to be used for industrial or medical purposes [2,8]. The paper describes and contain illustrations showing some of the various tests packages which have been performed during certain periods and how they relate to normal conditions and minor mishaps during transport. Quality assurance and quality controls measures taken in order to meet technical specification provided by the design there are also presented and commented. (authors)

  9. Praxis I/O package

    SciTech Connect

    Holloway, F.W.; Sherman, T.A.

    1988-04-07

    The Praxis language specification, like Algol and Ada, does not specify any I/O statements. The intent was to provide a standard I/O package as a companion to the compiler. This would allow the user to substitute, or supplement, the I/O package, as needed, for specialized applications. Like Algol, however, Praxis provided only limited (text) I/O for several years. Ada, in contrast, provided a comprehensive standard I/O package from its inception. Digital Equipment Corporation's (DEC's) implementation of Ada, on their VAX family of computers, further supplemented this package with other packages which exploit the I/O facilities available under the VMS operating system. The Praxis I/O package described in this document has been modeled after DEC's implementation of Ada and provides a similar set of I/O facilities. Currently, the I/O package is supported only under VAX/VMS. The design of the package, however, is essentially independent of any operating system (with the exception of the module COMMAND IO). The VAX/VMS version of the I/O package fully exploits the vast I/O facilities which are provided under VAX/VMS and makes them directly available to the Praxis programmer. The design, prototype implementation, and draft documentation of the Praxis I/O Package was done by Tim Sherman as part of a University project in computer science. Subsequent work by both Tim and Fred Holloway lead to a more complete implementation, testing and development of example programs, and inclusion of the package into the Praxis compilers as their principal interface to RMS and VMS.

  10. Chip packaging technique

    NASA Technical Reports Server (NTRS)

    Jayaraj, Kumaraswamy (Inventor); Noll, Thomas E. (Inventor); Lockwood, Harry F. (Inventor)

    2001-01-01

    A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

  11. Electro-Microfluidic Packaging

    SciTech Connect

    BENAVIDES, GILBERT L.; GALAMBOS, PAUL C.

    2002-06-01

    Electro-microfluidics is experiencing explosive growth in new product developments. There are many commercial applications for electro-microfluidic devices such as chemical sensors, biological sensors, and drop ejectors for both printing and chemical analysis. The number of silicon surface micromachined electro-microfluidic products is likely to increase. Manufacturing efficiency and integration of microfluidics with electronics will become important. Surface micromachined microfluidic devices are manufactured with the same tools as IC's (integrated circuits) and their fabrication can be incorporated into the IC fabrication process. In order to realize applications for devices must be developed. An Electro-Microfluidic Dual In-line Package (EMDIP{trademark}) was developed surface micromachined electro-microfluidic devices, a practical method for getting fluid into these to be a standard solution that allows for both the electrical and the fluidic connections needed to operate a great variety of electro-microfluidic devices. The EMDIP{trademark} includes a fan-out manifold that, on one side, mates directly with the 200 micron diameter Bosch etched holes found on the device, and, on the other side, mates to lager 1 mm diameter holes. To minimize cost the EMDIP{trademark} can be injection molded in a great variety of thermoplastics which also serve to optimize fluid compatibility. The EMDIP{trademark} plugs directly into a fluidic printed wiring board using a standard dual in-line package pattern for the electrical connections and having a grid of multiple 1 mm diameter fluidic connections to mate to the underside of the EMDIP{trademark}.

  12. AGC-2 Graphite Preirradiation Data Package

    SciTech Connect

    David Swank; Joseph Lord; David Rohrbaugh; William Windes

    2012-10-01

    The NGNP Graphite R&D program is currently establishing the safe operating envelope of graphite core components for a Very High Temperature Reactor (VHTR) design. The program is generating quantitative data necessary for predicting the behavior and operating performance of the new nuclear graphite grades. To determine the in-service behavior of the graphite for pebble bed and prismatic designs, the Advanced Graphite Creep (AGC) experiment is underway. This experiment is examining the properties and behavior of nuclear grade graphite over a large spectrum of temperatures, neutron fluences and compressive loads. Each experiment consists of over 400 graphite specimens that are characterized prior to irradiation and following irradiation. Six experiments are planned with the first, AGC-1, currently being irradiated in the Advanced Test Reactor (ATR) and pre-irradiation characterization of the second, AGC-2, completed. This data package establishes the readiness of 512 specimens for assembly into the AGC-2 capsule.

  13. The Macro - TIPS Course Package.

    ERIC Educational Resources Information Center

    Heriot-Watt Univ., Edinburgh (Scotland). Esmee Fairbairn Economics Research Centre.

    The TIPS (Teaching Information Processing System) Course Package was designed to be used with the Macro-Games Course Package (SO 011 930) in order to train college students to apply the tools of economic analysis to current problems. TIPS is used to provide feedback and individualized assignments to students, as well as information about the…

  14. Solar water heater design package

    NASA Technical Reports Server (NTRS)

    1981-01-01

    Package describes commercial domestic-hot-water heater with roof or rack mounted solar collectors. System is adjustable to pre-existing gas or electric hot-water house units. Design package includes drawings, description of automatic control logic, evaluation measurements, possible design variations, list of materials and installation tools, and trouble-shooting guide and manual.

  15. Packaging Software Assets for Reuse

    NASA Astrophysics Data System (ADS)

    Mattmann, C. A.; Marshall, J. J.; Downs, R. R.

    2010-12-01

    The reuse of existing software assets such as code, architecture, libraries, and modules in current software and systems development projects can provide many benefits, including reduced costs, in time and effort, and increased reliability. Many reusable assets are currently available in various online catalogs and repositories, usually broken down by disciplines such as programming language (Ibiblio for Maven/Java developers, PyPI for Python developers, CPAN for Perl developers, etc.). The way these assets are packaged for distribution can play a role in their reuse - an asset that is packaged simply and logically is typically easier to understand, install, and use, thereby increasing its reusability. A well-packaged asset has advantages in being more reusable and thus more likely to provide benefits through its reuse. This presentation will discuss various aspects of software asset packaging and how they can affect the reusability of the assets. The characteristics of well-packaged software will be described. A software packaging domain model will be introduced, and some existing packaging approaches examined. An example case study of a Reuse Enablement System (RES), currently being created by near-term Earth science decadal survey missions, will provide information about the use of the domain model. Awareness of these factors will help software developers package their reusable assets so that they can provide the most benefits for software reuse.

  16. Chemical Energy: A Learning Package.

    ERIC Educational Resources Information Center

    Cohen, Ita; Ben-Zvi, Ruth

    1982-01-01

    A comprehensive teaching/learning chemical energy package was developed to overcome conceptual/experimental difficulties and time required for calculation of enthalpy changes. The package consists of five types of activities occuring in repeated cycles: group activities, laboratory experiments, inquiry questionnaires, teacher-led class…

  17. Status of PERST-5 package

    SciTech Connect

    Gomin, E. A.; Gurevich, M. I.; Kalugin, M. A.; Lazarenko, A. P.; Pryanichnikov, A. V. Sidorenko, V. D.; Druzhinin, V. E.; Zhirnov, A. P.; Rozhdestvenskiy, I. M.

    2012-12-15

    The methods and algorithms used in the PERST-5 package are described. This package is part of the MCU-5 code and is intended for neutron-physical calculation of the cells and parts of nuclear reactors using a generalized method of first collision probabilities.

  18. Status of PERST-5 package

    NASA Astrophysics Data System (ADS)

    Gomin, E. A.; Gurevich, M. I.; Kalugin, M. A.; Lazarenko, A. P.; Pryanichnikov, A. V.; Sidorenko, V. D.; Druzhinin, V. E.; Zhirnov, A. P.; Rozhdestvenskiy, I. M.

    2012-12-01

    The methods and algorithms used in the PERST-5 package are described. This package is part of the MCU-5 code and is intended for neutron-physical calculation of the cells and parts of nuclear reactors using a generalized method of first collision probabilities.

  19. Oral Hygiene. Learning Activity Package.

    ERIC Educational Resources Information Center

    Hime, Kirsten

    This learning activity package on oral hygiene is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics…

  20. Floriculture. Selected Learning Activity Packages.

    ERIC Educational Resources Information Center

    Clemson Univ., SC. Vocational Education Media Center.

    This series of learning activity packages is based on a catalog of performance objectives, criterion-referenced measures, and performance guides for gardening/groundskeeping developed by the Vocational Education Consortium of States (V-TECS). Learning activity packages are presented in four areas: (1) preparation of soils and planting media, (2)…

  1. Sterility of packaged implant components.

    PubMed

    Worthington, Philip

    2005-01-01

    Several implant components in their original glass vial and peel-back packages were subjected to sterility testing to determine whether the contents remained sterile after the expiration date marked on the package had passed. The results from a university microbiology laboratory showed that the contents remained sterile for 6 to 11 years after the expiration dates. PMID:15973959

  2. Individualized Learning Package about Etching.

    ERIC Educational Resources Information Center

    Sauer, Michael J.

    An individualized learning package provides step-by-step instruction in the fundamentals of the etching process. Thirteen specific behavioral objectives are listed. A pretest, consisting of matching 15 etching terms with their definitions, is provided along with an answer key. The remainder of the learning package teaches the 13 steps of the…

  3. 49 CFR 173.411 - Industrial packagings.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Industrial packagings. 173.411 Section 173.411... SHIPMENTS AND PACKAGINGS Class 7 (Radioactive) Materials § 173.411 Industrial packagings. (a) General. Each industrial packaging must comply with the requirements of this section which specifies packaging tests,...

  4. 49 CFR 173.411 - Industrial packagings.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 49 Transportation 2 2012-10-01 2012-10-01 false Industrial packagings. 173.411 Section 173.411... SHIPMENTS AND PACKAGINGS Class 7 (Radioactive) Materials § 173.411 Industrial packagings. (a) General. Each industrial packaging must comply with the requirements of this section which specifies packaging tests,...

  5. 49 CFR 173.411 - Industrial packagings.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 2 2011-10-01 2011-10-01 false Industrial packagings. 173.411 Section 173.411... SHIPMENTS AND PACKAGINGS Class 7 (Radioactive) Materials § 173.411 Industrial packagings. (a) General. Each industrial packaging must comply with the requirements of this section which specifies packaging tests,...

  6. 49 CFR 173.411 - Industrial packages.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 49 Transportation 2 2014-10-01 2014-10-01 false Industrial packages. 173.411 Section 173.411... SHIPMENTS AND PACKAGINGS Class 7 (Radioactive) Materials § 173.411 Industrial packages. (a) General. Each industrial package must comply with the requirements of this section which specifies package tests,...

  7. 49 CFR 173.411 - Industrial packagings.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 49 Transportation 2 2013-10-01 2013-10-01 false Industrial packagings. 173.411 Section 173.411... SHIPMENTS AND PACKAGINGS Class 7 (Radioactive) Materials § 173.411 Industrial packagings. (a) General. Each industrial packaging must comply with the requirements of this section which specifies packaging tests,...

  8. 10 CFR 71.33 - Package description.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 10 Energy 2 2013-01-01 2013-01-01 false Package description. 71.33 Section 71.33 Energy NUCLEAR REGULATORY COMMISSION (CONTINUED) PACKAGING AND TRANSPORTATION OF RADIOACTIVE MATERIAL Application for Package Approval § 71.33 Package description. The application must include a description of the proposed package in sufficient detail to identify...

  9. 10 CFR 71.33 - Package description.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 10 Energy 2 2010-01-01 2010-01-01 false Package description. 71.33 Section 71.33 Energy NUCLEAR REGULATORY COMMISSION (CONTINUED) PACKAGING AND TRANSPORTATION OF RADIOACTIVE MATERIAL Application for Package Approval § 71.33 Package description. The application must include a description of the proposed package in sufficient detail to identify...

  10. 19 CFR 191.13 - Packaging materials.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 19 Customs Duties 2 2010-04-01 2010-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed...

  11. 49 CFR 173.63 - Packaging exceptions.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 2 2011-10-01 2011-10-01 false Packaging exceptions. 173.63 Section 173.63... SHIPMENTS AND PACKAGINGS Definitions, Classification and Packaging for Class 1 § 173.63 Packaging exceptions...) Cartridges, power devices which are used to project fastening devices. (2) Packaging for Cartridges,...

  12. 19 CFR 191.13 - Packaging materials.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 19 Customs Duties 2 2011-04-01 2011-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed...

  13. 19 CFR 191.13 - Packaging materials.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 19 Customs Duties 2 2012-04-01 2012-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed...

  14. 49 CFR 173.63 - Packaging exceptions.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 49 Transportation 2 2014-10-01 2014-10-01 false Packaging exceptions. 173.63 Section 173.63... SHIPMENTS AND PACKAGINGS Definitions, Classification and Packaging for Class 1 § 173.63 Packaging exceptions... fastening devices). (2) Packaging for Cartridges, small arms, Cartridges for tools, blank, Cases,...

  15. 19 CFR 191.13 - Packaging materials.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 19 Customs Duties 2 2013-04-01 2013-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed...

  16. 49 CFR 173.63 - Packaging exceptions.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 49 Transportation 2 2012-10-01 2012-10-01 false Packaging exceptions. 173.63 Section 173.63... SHIPMENTS AND PACKAGINGS Definitions, Classification and Packaging for Class 1 § 173.63 Packaging exceptions...) Cartridges, power devices which are used to project fastening devices. (2) Packaging for Cartridges,...

  17. 19 CFR 191.13 - Packaging materials.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 19 Customs Duties 2 2014-04-01 2014-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed...

  18. 49 CFR 173.63 - Packaging exceptions.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Packaging exceptions. 173.63 Section 173.63... SHIPMENTS AND PACKAGINGS Definitions, Classification and Packaging for Class 1 § 173.63 Packaging exceptions... which are used to project fastening devices. (2) Packaging for cartridges, small arms, and...

  19. Nanocomposite Sensors for Food Packaging

    NASA Astrophysics Data System (ADS)

    Avella, Maurizio; Errico, Maria Emanuela; Gentile, Gennaro; Volpe, Maria Grazia

    Nowadays nanotechnologies applied to the food packaging sector find always more applications due to a wide range of benefits that they can offer, such as improved barrier properties, improved mechanical performance, antimicrobial properties and so on. Recently many researches are addressed to the set up of new food packaging materials, in which polymer nanocomposites incorporate nanosensors, developing the so-called "smart" packaging. Some examples of nanocomposite sensors specifically realised for the food packaging industry are reported. The second part of this work deals with the preparation and characterisation of two new polymer-based nanocomposite systems that can be used as food packaging materials. Particularly the results concerning the following systems are illustrated: isotactic polypropylene (iPP) filled with CaCO3 nanoparticles and polycaprolactone (PCL) filled with SiO2 nanoparticles.

  20. [Reliability of % vol. declarations on labels of wine bottles].

    PubMed

    Schütz, Harald; Erdmann, Freidoon; Verhoff, Marcel A; Weiler, Günter

    2005-01-01

    The Council Regulation (EC) no. 1493/1999 of 17 May 1999 on the common organisation of the market in wine (Abl. L 179 dated 14/7/1999) and the GMO Wine 2000 (Annex VII A) stipulates that the labels of wine bottles have to indicate, among others, information on the sales designation of the product, the nominal volume and the alcoholic strength. The latter must not differ by more than 0.5% vol. from the alcoholic strength as established by analysis. Only when quality wines are stored in bottles for more than three years, the accepted tolerance limits are +/- 0.8% vol. The presented investigation results show that deviations have to be taken into account which may be highly relevant for forensic practice. PMID:15887778

  1. Application of silicon piezoresistive stress test chips in electronic packages

    NASA Astrophysics Data System (ADS)

    Zou, Yida

    In this work, both special (100) and (111) silicon test chips containing an array of optimized piezoresistive stress sensor rosettes have been successfully applied within several electronic packaging configurations. Unlike (100) silicon test chips, (111) silicon test chips are able to measure the complete stress state on the die surface. After calibration and characterization of the test chips, they were packaged into various assemblies. The post packaging resistances of the sensors were then recorded at room temperature, as a function of temperature excursion, and during long term packaging reliability qualification tests (thermal cycling and thermal aging). The stresses on the die surface were calculated using the measured resistance changes and the appropriate theoretical equations. For comparison purposes, three-dimensional nonlinear finite element simulations of the packaging processes were also performed, and the stress predictions were correlated with the experimental test chip data. AAA2 (100) silicon test chips containing optimized four element dual polarity rosettes have been applied within 44 pin Plastic Leaded Chip Carrier (PLCC) packages and 240 pin Quad Flat Packs (QFP's). In these plastic package experiments, comparison of the stress levels induced by various molding compounds was emphasized. Advanced (111) silicon test chips (BMW-1 or BMW-2) comprising an array of optimized eight-element dual polarity piezoresistive sensor rosettes were encapsulated in 240 pin QFP's, 160 pin QFP's, Chip on Board (COB) packages, and 281 pin ceramic Pin Grid Array (PGA) packages. In addition to molding compound evaluations, BMW-1 test chips encapsulated in 240 pin QFP's were used to detect the presence of delaminations between the die surface and the encapsulant. In the wire bonded COB package studies, die surface stress evaluations were conducted after die attachment, and throughout the cure cycle of the liquid encapsulant. The stresses were also studied as a

  2. dendextend: an R package for visualizing, adjusting and comparing trees of hierarchical clustering

    PubMed Central

    2015-01-01

    Summary: dendextend is an R package for creating and comparing visually appealing tree diagrams. dendextend provides utility functions for manipulating dendrogram objects (their color, shape and content) as well as several advanced methods for comparing trees to one another (both statistically and visually). As such, dendextend offers a flexible framework for enhancing R's rich ecosystem of packages for performing hierarchical clustering of items. Availability and implementation: The dendextend R package (including detailed introductory vignettes) is available under the GPL-2 Open Source license and is freely available to download from CRAN at: (http://cran.r-project.org/package=dendextend) Contact: Tal.Galili@math.tau.ac.il PMID:26209431

  3. Amesos Solver Package

    2004-03-01

    Amesos is the Direct Sparse Solver Package in Trilinos. The goal of Amesos is to make AX=S as easy as it sounds, at least for direct methods. Amesos provides interfaces to a number of third party sparse direct solvers, including SuperLU, SuperLU MPI, DSCPACK, UMFPACK and KLU. Amesos provides a common object oriented interface to the best sparse direct solvers in the world. A sparse direct solver solves for x in Ax = b. wheremore » A is a matrix and x and b are vectors (or multi-vectors). A sparse direct solver flrst factors A into trinagular matrices L and U such that A = LU via gaussian elimination and then solves LU x = b. Switching amongst solvers in Amesos roquires a change to a single parameter. Yet, no solver needs to be linked it, unless it is used. All conversions between the matrices provided by the user and the format required by the underlying solver is performed by Amesos. As new sparse direct solvers are created, they will be incorporated into Amesos, allowing the user to simpty link with the new solver, change a single parameter in the calling sequence, and use the new solver. Amesos allows users to specify whether the matrix has changed. Amesos can be used anywhere that any sparse direct solver is needed.« less

  4. Nuclear waste packaging facility

    SciTech Connect

    Mallory, C.W.; Watts, R.E.; Paladino, J.B.; Razor, J.E.; Lilley, A.W.; Winston, S.J.; Stricklin, B.C.

    1987-07-21

    A nuclear waste packaging facility comprising: (a) a first section substantially surrounded by radiation shielding, including means for remotely handling waste delivered to the first section and for placing the waste into a disposal module; (b) a second section substantially surrounded by radiation shielding, including means for handling a deformable container bearing waste delivered to the second section, the handling means including a compactor and means for placing the waste bearing deformable container into the compactor, the compactor capable of applying a compacting force to the waste bearing containers sufficient to inelastically deform the waste and container, and means for delivering the deformed waste bearing containers to a disposal module; (c) a module transportation and loading section disposed between the first and second sections including a means for handling empty modules delivered to the facility and for loading the empty modules on the transport means; the transport means moving empty disposal modules to the first section and empty disposal modules to the second section for locating empty modules in a position for loading with nuclear waste, and (d) a grouting station comprising means for pouring grout into the waste bearing disposal module, and a capping station comprising means for placing a lid onto the waste bearing grout-filled disposal module to completely encapsulate the waste.

  5. The CDF software package

    NASA Technical Reports Server (NTRS)

    Wilson, C. E.

    1986-01-01

    The concepts that are fundamental to the new Common Data Format are outlined. With Pilot Climate Data System (PCDS) Version 4.0, the Common Data Format (CDF) will supersede the Climate Data File (also CDF) or earlier versions. This new format incorporates generalizations in both design and terminology that make it applicable to multidisciplinary data sets. Furthermore, the new CDF will be made available to programmers as a software package that shields them from the low-level details of file formats. The CDF interface routines create an abstract conceptual environment for the scientific programmer. The principle concept for visualizing a CDF is known as the basic grid. A basic grid is an n-dimensional block by means of which a CDF is constructed. The size of the block may vary from one CDF to another, but is consistent within any individual CDF. Thus, the basic grid serves as a fundamental uniform building block for a CDF. The number of grid dimensions and the size of each dimension are chosen by the scientist/programmer to represent the patterns by which data are structured. The uniform grid structure appears to the programmer to be propagated into each record for each variable. The CDF stores a variable value for each lattice point of the grid for each record. These data values are inserted and retrieved simply by specifying the variable's identifier, a record number, and the indices that specify the lattice point of interest.

  6. Particle Environment Package (PEP)

    NASA Astrophysics Data System (ADS)

    Barabash, S.; Wurz, P.; Brandt, P.; Wieser, M.; Holmström, M.; Futaana, Y.; Stenberg, G.; Nilsson, H.; Eriksson, A.; Tulej, M.; Vorburger, A.; Thomas, N.; Paranicas, C.; Mitchell, D. G.; Ho, G.; Mauk, B. H.; Haggerty, D.; Westlake, J. H.; Fränz, M.; Krupp, N.; Roussos, E.; Kallio, E.; Schmidt, W.; Szego, K.; Szalai, S.; Khurana, Krishan; Jia, Xianzhe; Paty, C.; Wimmer-Schweingruber, R. F.; Heber, B.; Kazushi, Asamura; Grande, M.; Lammer, H.; Zhang, T.; McKenna-Lawlor, S.; Krimigis, S. M.; Sarris, Th.; Grodent, D.

    2013-09-01

    Particle Environment Package (PEP) is a suite of particle sensors proposed for the ESA JUICE mission. PEP includes sensors for the comprehensive measurements of electrons, ions, energetic neutrals, and neutral gas. PEP covers over nine decades of energy <0.001 eV to >1 MeV with full angular coverage. Combining remote global imaging via energetic neutral atoms (ENAs) with in-situ measurements, PEP addresses all scientific objectives of the JUICE mission relevant to particle measurements. PEP will seek answers for four overarching science questions: How does the corotating magnetosphere of Jupiter interact with complex and diverse environment of Ganymede? How does the rapidly rotating magnetosphere of Jupiter interact with seemingly inert Callisto? What are the governing mechanisms and their global impact of release of material into the Jupiter magnetosphere from Europa and Io? How do internal and solar wind drivers cause such energetic, time variable and multi-scale phenomena in the steadily rotating giant magnetosphere of Jupiter? We discuss the suite's sensor basic design, performance, radiation mitigation principles and demonstrate how the suite fully addresses its scientific objectives.

  7. Amesos Solver Package

    SciTech Connect

    Stanley, Vendall S.; Heroux, Michael A.; Hoekstra, Robert J.; Sala, Marzio

    2004-03-01

    Amesos is the Direct Sparse Solver Package in Trilinos. The goal of Amesos is to make AX=S as easy as it sounds, at least for direct methods. Amesos provides interfaces to a number of third party sparse direct solvers, including SuperLU, SuperLU MPI, DSCPACK, UMFPACK and KLU. Amesos provides a common object oriented interface to the best sparse direct solvers in the world. A sparse direct solver solves for x in Ax = b. where A is a matrix and x and b are vectors (or multi-vectors). A sparse direct solver flrst factors A into trinagular matrices L and U such that A = LU via gaussian elimination and then solves LU x = b. Switching amongst solvers in Amesos roquires a change to a single parameter. Yet, no solver needs to be linked it, unless it is used. All conversions between the matrices provided by the user and the format required by the underlying solver is performed by Amesos. As new sparse direct solvers are created, they will be incorporated into Amesos, allowing the user to simpty link with the new solver, change a single parameter in the calling sequence, and use the new solver. Amesos allows users to specify whether the matrix has changed. Amesos can be used anywhere that any sparse direct solver is needed.

  8. Packaging Considerations for Biopreservation

    PubMed Central

    Woods, Erik J.; Thirumala, Sreedhar

    2011-01-01

    Summary The packaging system chosen for biopreservation is critical for many reasons. An ideal biopreservation container system must provide for closure integrity, sample stability and ready access to the preserved material. This means the system needs to be hermetically sealed to ensure integrity of the specimen is maintained throughout processing, storage and distribution; the system must remain stable over long periods of time as many biobanked samples may be stored indefinitely; and functionally closed access systems must be used to avoid contamination upon sample withdraw. This study reviews the suitability of a new commercially available vial configuration container utilizing blood bag style closure and access systems that can be hermetically sealed and remain stable through cryopreservation and biobanking procedures. This vial based systems allow for current good manufacturing/tissue practice (cGTP) requirements during processing of samples and may provide the benefit of ease of delivery by a care giver. In this study, the CellSeal® closed system cryovial was evaluated and compared to standard screw cap vials. The CellSeal system was evaluated for durability, closure integrity through transportation and maintenance of functional viability of a cryopreserved mesenchymal stem cell model. The results of this initial proof-of-concept study indicated that the CellSeal vials are highly suitable for biopreservation and biobanking, and provide a suitable container system for clinical and commercial cell therapy products frozen in small volumes. PMID:21566715

  9. In-Package Chemistry Abstraction

    SciTech Connect

    E. Thomas

    2004-11-09

    This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste package has been

  10. Materials for high-density electronic packaging and interconnection

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production.

  11. Optimal segmentation and packaging process

    DOEpatents

    Kostelnik, K.M.; Meservey, R.H.; Landon, M.D.

    1999-08-10

    A process for improving packaging efficiency uses three dimensional, computer simulated models with various optimization algorithms to determine the optimal segmentation process and packaging configurations based on constraints including container limitations. The present invention is applied to a process for decontaminating, decommissioning (D and D), and remediating a nuclear facility involving the segmentation and packaging of contaminated items in waste containers in order to minimize the number of cuts, maximize packaging density, and reduce worker radiation exposure. A three-dimensional, computer simulated, facility model of the contaminated items are created. The contaminated items are differentiated. The optimal location, orientation and sequence of the segmentation and packaging of the contaminated items is determined using the simulated model, the algorithms, and various constraints including container limitations. The cut locations and orientations are transposed to the simulated model. The contaminated items are actually segmented and packaged. The segmentation and packaging may be simulated beforehand. In addition, the contaminated items may be cataloged and recorded. 3 figs.

  12. Laser Welding in Electronic Packaging

    NASA Technical Reports Server (NTRS)

    2000-01-01

    The laser has proven its worth in numerous high reliability electronic packaging applications ranging from medical to missile electronics. In particular, the pulsed YAG laser is an extremely flexible and versatile too] capable of hermetically sealing microelectronics packages containing sensitive components without damaging them. This paper presents an overview of details that must be considered for successful use of laser welding when addressing electronic package sealing. These include; metallurgical considerations such as alloy and plating selection, weld joint configuration, design of optics, use of protective gases and control of thermal distortions. The primary limitations on use of laser welding electronic for packaging applications are economic ones. The laser itself is a relatively costly device when compared to competing welding equipment. Further, the cost of consumables and repairs can be significant. These facts have relegated laser welding to use only where it presents a distinct quality or reliability advantages over other techniques of electronic package sealing. Because of the unique noncontact and low heat inputs characteristics of laser welding, it is an ideal candidate for sealing electronic packages containing MEMS devices (microelectromechanical systems). This paper addresses how the unique advantages of the pulsed YAG laser can be used to simplify MEMS packaging and deliver a product of improved quality.

  13. Naval Waste Package Design Sensitivity

    SciTech Connect

    T. Schmitt

    2006-12-13

    The purpose of this calculation is to determine the sensitivity of the structural response of the Naval waste packages to varying inner cavity dimensions when subjected to a comer drop and tip-over from elevated surface. This calculation will also determine the sensitivity of the structural response of the Naval waste packages to the upper bound of the naval canister masses. The scope of this document is limited to reporting the calculation results in terms of through-wall stress intensities in the outer corrosion barrier. This calculation is intended for use in support of the preliminary design activities for the license application design of the Naval waste package. It examines the effects of small changes between the naval canister and the inner vessel, and in these dimensions, the Naval Long waste package and Naval Short waste package are similar. Therefore, only the Naval Long waste package is used in this calculation and is based on the proposed potential designs presented by the drawings and sketches in References 2.1.10 to 2.1.17 and 2.1.20. All conclusions are valid for both the Naval Long and Naval Short waste packages.

  14. Radioactive material packaging performance testing

    SciTech Connect

    Romano, T.

    1992-06-01

    In an effort to provide uniform packaging of hazardous material on an international level, recommendations for the transport of dangerous goods have been developed by the United Nations. These recommendations are performance oriented and contrast with a large number of packaging specifications in the US Department of Transportation's hazard materials regulations. This dual system presents problems when international shipments enter the US Department of Transportation's system. Faced with the question of continuing a dual system or aligning with the international system, the Research and Special Programs Administration of the US Department of Transportation responded with Docket HM-181. This began the transition toward the international transportation system. Following close behind is Docket HM-169A, which addressed low specific activity radioactive material packaging. This paper will discuss the differences between performance-oriented and specification packaging, the transition toward performance-oriented packaging by the US Department of Transportation, and performance-oriented testing of radioactive material packaging by Westinghouse Hanford Company. Dockets HM-181 and HM-169A will be discussed along with Type A (low activity) and Type B (high activity) radioactive material packaging evaluations.

  15. Radioactive material packaging performance testing

    SciTech Connect

    Romano, T.

    1992-06-01

    In an effort to provide uniform packaging of hazardous material on an international level, recommendations for the transport of dangerous goods have been developed by the United Nations. These recommendations are performance oriented and contrast with a large number of packaging specifications in the US Department of Transportation`s hazard materials regulations. This dual system presents problems when international shipments enter the US Department of Transportation`s system. Faced with the question of continuing a dual system or aligning with the international system, the Research and Special Programs Administration of the US Department of Transportation responded with Docket HM-181. This began the transition toward the international transportation system. Following close behind is Docket HM-169A, which addressed low specific activity radioactive material packaging. This paper will discuss the differences between performance-oriented and specification packaging, the transition toward performance-oriented packaging by the US Department of Transportation, and performance-oriented testing of radioactive material packaging by Westinghouse Hanford Company. Dockets HM-181 and HM-169A will be discussed along with Type A (low activity) and Type B (high activity) radioactive material packaging evaluations.

  16. Directions in General Relativity, Vol. 1

    NASA Astrophysics Data System (ADS)

    Hu, B. L.; Ryan, M. P., Jr.; Vishveshwara, C. V.

    2005-10-01

    1. Remarks concerning the geometrics of gravity, gauge fields and quantum theory J. S. Anandan; 2. Gravity and the unification of fundamental interactions R. L. Arnowitt and P. Nath; 3. Minisuperspaces: symmetrics and quantization A. Ashtekar, R. S. Tate and C. Uggla; 4. Quantum cosmology B. K. Berger; 5. A pictorial history of some gravitational instanton D. Brill and K.- T. Pirk; 6. No time machines from lightlike sources in 2+1 gravity S. Deser and A. R. Steif; 7. Inhomogeneity and anisotropy genertation in FRW cosmologies G. F. R. Ellis and D. R. Matravers; 8. Misner, kinks and Black Holes D. Finkelstein; 9. The quantum mechanics of closed systems J. B. Hartle; 10. Cosmological vacuum open system W. A. Hiscock and D. A. Samuel; 11. Minisuperspace as a quantum open system B. L. Hu, J. P. Paz and S. Sinha; 12. Ricci flow on minisuperspaces and the geometry-topology problem J. Isenberg and M. Jackson; 13. Classical and quantum dynamics of Black Hole interiors W. Israel; 14. Matter time in canonical quantum gravity K. V. Kuchar; 15. The isotropy and homogeneity of the universe R. A. Matzner; 16. Recent advances in ADM reduction V. Moncrief; 17. Some progress in classical canonical gravity J. M. Nester; 18. Harmonic map formulation of colliding electrovac place waves Y. Nutku; 19. Geometry, the renormalization groups and gravity D. J. O'Connor and C. R. Stephens; 20. An example of the indeterminacy of the already-unified theory R. Penrose; 21. Nonstatic metric of Hiscock-Gott type A. K. Raychaudhuri; 22. Non-standard phase space variables, quantization and path-integrals, or little ado about much M. P. Ryan, Jr. and Sergio Hojmann; 23. The present status of the decaying neutrino theory D. W. Sciama; 24. Exploiting the computer to investigate Black Holes and cosmic censorship S. L. Shapiro and S. A. Teukolsky; 25. Misner space as a prototype for almost any pathology K. S. Thorne; 26. Relativity and rotation C. V. Vishveshwara; 27. The first law of Black Hole

  17. Oxygen indicators and intelligent inks for packaging food.

    PubMed

    Mills, Andrew

    2005-12-01

    The detection of oxygen using optical sensors is of increasing interest, especially in modified atmosphere food packaging (MAP), in which the package, usually containing food, is flushed with a gas, such as carbon dioxide or nitrogen. This tutorial review examines the ideal properties of an oxygen optical sensor for MAP and compares them with those developed to date, including the most recent advances. The basic technologies underpinning the different indicator types are described, examples given and their potential for application in MAP assessed. This tutorial review should be of interest to the MAP industry and researchers in optical sensors and oxygen sensing. PMID:16284666

  18. Qualification and Reliability for MEMS and IC Packages

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2004-01-01

    Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

  19. Safety evaluation for packaging (onsite) concrete-lined waste packaging

    SciTech Connect

    Romano, T.

    1997-09-25

    The Pacific Northwest National Laboratory developed a package to ship Type A, non-transuranic, fissile excepted quantities of liquid or solid radioactive material and radioactive mixed waste to the Central Waste Complex for storage on the Hanford Site.

  20. Packaging of solid state devices

    DOEpatents

    Glidden, Steven C.; Sanders, Howard D.

    2006-01-03

    A package for one or more solid state devices in a single module that allows for operation at high voltage, high current, or both high voltage and high current. Low thermal resistance between the solid state devices and an exterior of the package and matched coefficient of thermal expansion between the solid state devices and the materials used in packaging enables high power operation. The solid state devices are soldered between two layers of ceramic with metal traces that interconnect the devices and external contacts. This approach provides a simple method for assembling and encapsulating high power solid state devices.

  1. Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2012-03-01

    Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surfacemount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

  2. Large area LED package

    NASA Astrophysics Data System (ADS)

    Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.-D.

    2015-03-01

    Solid state lighting using LED-dies is a rapidly growing market. LED-dies with the needed increasing luminous flux per chip area produce a lot of heat. Therefore an appropriate thermal management is required for general lighting with LEDdies. One way to avoid overheating and shorter lifetime is the use of many small LED-dies on a large area heat sink (down to 70 μm edge length), so that heat can spread into a large area while at the same time light also appears on a larger area. The handling with such small LED-dies is very difficult because they are too small to be picked with common equipment. Therefore a new concept called collective transfer bonding using a temporary carrier chip was developed. A further benefit of this new technology is the high precision assembly as well as the plane parallel assembly of the LED-dies which is necessary for wire bonding. It has been shown that hundred functional LED-dies were transferred and soldered at the same time. After the assembly a cost effective established PCB-technology was applied to produce a large-area light source consisting of many small LED-dies and electrically connected on a PCB-substrate. The top contacts of the LED-dies were realized by laminating an adhesive copper sheet followed by LDI structuring as known from PCB-via-technology. This assembly can be completed by adding converting and light forming optical elements. In summary two technologies based on standard SMD and PCB technology have been developed for panel level LED packaging up to 610x 457 mm2 area size.

  3. Spack: the Supercomputing Package Manager

    2013-11-09

    The HPC software ecosystem is growing larger and more complex, but software distribution mechanisms have not kept up with this trend. Tools, Libraries, and applications need to run on multiple platforms and build with multiple compliers. Increasingly, packages leverage common software components, and building any one component requires building all of its dependencies. In HPC environments, ABI-incompatible interfaces (likeMPI), binary-incompatible compilers, and cross-compiled environments converge to make the build process a combinatoric nightmare. This obstaclemore » deters many users from adopting useful tools, and others waste countless hours building and rebuilding tools. Many package managers exist to solve these problems for typical desktop environments, but none suits the unique needs of supercomputing facilities or users. To address these problems, we have Spack, a package manager that eases the task of managing software for end-users, across multiple platforms, package versions, compilers, and ABI incompatibilities.« less

  4. Spack: the Supercomputing Package Manager

    SciTech Connect

    Gamblin, T.

    2013-11-09

    The HPC software ecosystem is growing larger and more complex, but software distribution mechanisms have not kept up with this trend. Tools, Libraries, and applications need to run on multiple platforms and build with multiple compliers. Increasingly, packages leverage common software components, and building any one component requires building all of its dependencies. In HPC environments, ABI-incompatible interfaces (likeMPI), binary-incompatible compilers, and cross-compiled environments converge to make the build process a combinatoric nightmare. This obstacle deters many users from adopting useful tools, and others waste countless hours building and rebuilding tools. Many package managers exist to solve these problems for typical desktop environments, but none suits the unique needs of supercomputing facilities or users. To address these problems, we have Spack, a package manager that eases the task of managing software for end-users, across multiple platforms, package versions, compilers, and ABI incompatibilities.

  5. New Packaging for Amplifier Slabs

    SciTech Connect

    Riley, M.; Thorsness, C.; Suratwala, T.; Steele, R.; Rogowski, G.

    2015-03-18

    The following memo provides a discussion and detailed procedure for a new finished amplifier slab shipping and storage container. The new package is designed to maintain an environment of <5% RH to minimize weathering.

  6. Packaging Review Guide for Reviewing Safety Analysis Reports for Packagings

    SciTech Connect

    DiSabatino, A; Biswas, D; DeMicco, M; Fisher, L E; Hafner, R; Haslam, J; Mok, G; Patel, C; Russell, E

    2007-04-12

    This Packaging Review Guide (PRG) provides guidance for Department of Energy (DOE) review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE Order 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his or her review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. This PRG is generally organized at the section level in a format similar to that recommended in Regulatory Guide 7.9 (RG 7.9). One notable exception is the addition of Section 9 (Quality Assurance), which is not included as a separate chapter in RG 7.9. Within each section, this PRG addresses the technical and regulatory bases for the review, the manner in which the review is accomplished, and findings that are generally applicable for a package that meets the approval standards. This Packaging Review Guide (PRG) provides guidance for DOE review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE O 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. The primary objectives of this PRG are to: (1) Summarize the regulatory requirements for package approval; (2) Describe the technical review procedures by which DOE determines that these requirements have been satisfied; (3) Establish and maintain the quality and uniformity of reviews; (4) Define the base from which to evaluate proposed changes in scope

  7. High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

    NASA Technical Reports Server (NTRS)

    Shalkhauser, K. A.; Li, K.; Shih, Y. C.

    1992-01-01

    Packaging schemes were developed that provide low-loss, hermetic enclosure for advanced monolithic microwave and millimeter-wave integrated circuits (MMICs). The package designs are based on a fused quartz substrate material that offers improved radio frequency (RF) performance through 44 gigahertz (GHz). The small size and weight of the packages make them appropriate for a variety of applications, including phased array antenna systems. Packages were designed in two forms; one for housing a single MMIC chip, the second in the form of a multi-chip phased array module. The single chip array module was developed in three separate sizes, for chips of different geometry and frequency requirements. The phased array module was developed to address packaging directly for antenna applications, and includes transmission line and interconnect structures to support multi-element operation. All packages are fabricated using fused quartz substrate materials. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. The package and test fixture designs were both developed in a generic sense, optimizing performance for a wide range of possible applications and devices.

  8. CompHEP/SUSY package

    NASA Astrophysics Data System (ADS)

    Semenov, A.

    2003-04-01

    The CompHEP software package allows evaluation of cross-section and decays of elementary particles with a high level of automation. Arbitrary tree level processes can be calculated starting from the set of vertices prescribed by a given physical model. This article describes implementation of the Minimal Supersymmetric Standard Model in the CompHEP package. Several CompHEP/SUSY models can be found on the WWW page http://theory.sinp.msu.ru/~semenov/mssm.html.

  9. Watermarking spot colors in packaging

    NASA Astrophysics Data System (ADS)

    Reed, Alastair; Filler, TomáÅ.¡; Falkenstern, Kristyn; Bai, Yang

    2015-03-01

    In January 2014, Digimarc announced Digimarc® Barcode for the packaging industry to improve the check-out efficiency and customer experience for retailers. Digimarc Barcode is a machine readable code that carries the same information as a traditional Universal Product Code (UPC) and is introduced by adding a robust digital watermark to the package design. It is imperceptible to the human eye but can be read by a modern barcode scanner at the Point of Sale (POS) station. Compared to a traditional linear barcode, Digimarc Barcode covers the whole package with minimal impact on the graphic design. This significantly improves the Items per Minute (IPM) metric, which retailers use to track the checkout efficiency since it closely relates to their profitability. Increasing IPM by a few percent could lead to potential savings of millions of dollars for retailers, giving them a strong incentive to add the Digimarc Barcode to their packages. Testing performed by Digimarc showed increases in IPM of at least 33% using the Digimarc Barcode, compared to using a traditional barcode. A method of watermarking print ready image data used in the commercial packaging industry is described. A significant proportion of packages are printed using spot colors, therefore spot colors needs to be supported by an embedder for Digimarc Barcode. Digimarc Barcode supports the PANTONE spot color system, which is commonly used in the packaging industry. The Digimarc Barcode embedder allows a user to insert the UPC code in an image while minimizing perceptibility to the Human Visual System (HVS). The Digimarc Barcode is inserted in the printing ink domain, using an Adobe Photoshop plug-in as the last step before printing. Since Photoshop is an industry standard widely used by pre-press shops in the packaging industry, a Digimarc Barcode can be easily inserted and proofed.

  10. Rapid Active Sampling Package

    NASA Technical Reports Server (NTRS)

    Peters, Gregory

    2010-01-01

    A field-deployable, battery-powered Rapid Active Sampling Package (RASP), originally designed for sampling strong materials during lunar and planetary missions, shows strong utility for terrestrial geological use. The technology is proving to be simple and effective for sampling and processing materials of strength. Although this originally was intended for planetary and lunar applications, the RASP is very useful as a powered hand tool for geologists and the mining industry to quickly sample and process rocks in the field on Earth. The RASP allows geologists to surgically acquire samples of rock for later laboratory analysis. This tool, roughly the size of a wrench, allows the user to cut away swaths of weathering rinds, revealing pristine rock surfaces for observation and subsequent sampling with the same tool. RASPing deeper (.3.5 cm) exposes single rock strata in-situ. Where a geologist fs hammer can only expose unweathered layers of rock, the RASP can do the same, and then has the added ability to capture and process samples into powder with particle sizes less than 150 microns, making it easier for XRD/XRF (x-ray diffraction/x-ray fluorescence). The tool uses a rotating rasp bit (or two counter-rotating bits) that resides inside or above the catch container. The container has an open slot to allow the bit to extend outside the container and to allow cuttings to enter and be caught. When the slot and rasp bit are in contact with a substrate, the bit is plunged into it in a matter of seconds to reach pristine rock. A user in the field may sample a rock multiple times at multiple depths in minutes, instead of having to cut out huge, heavy rock samples for transport back to a lab for analysis. Because of the speed and accuracy of the RASP, hundreds of samples can be taken in one day. RASP-acquired samples are small and easily carried. A user can characterize more area in less time than by using conventional methods. The field-deployable RASP used a Ni

  11. [Development of a Japanese version of the Valuation of Life (VOL) scale].

    PubMed

    Nakagawa, Takeshi; Gondo, Yasuyuki; Masui, Yukie; Ishioka, Yoshiko; Tabuchi, Megumi; Kamide, Kei; Ikebe, Kazunori; Arai, Yasumichi; Takahashi, Ryutaro

    2013-04-01

    This study developed a Japanese version of the Valuation of Life (VOL) scale, to measure psychological wellbeing among older adults. In Analysis 1, we conducted a factor analysis of 13 items, and identified two factors: positive VOL and spiritual well-being. These factors had adequate degrees of internal consistency, and were related to positive mental health. In Analysis 2, we examined sociodemographic, social, and health predictors for VOL. The role of social factors was stronger than the role of health factors, and spiritual well-being was more related to moral or religious activities than positive VOL. These results suggest that predictors for VOL vary by culture. In Analysis 3, we investigated the relationship between VOL and desired years of life. Positive VOL significantly predicted more desired years of life, whereas spiritual well-being did not. Positive VOL had acceptable reliability and validity. Future research is required to investigate whether VOL predicts survival duration or end-of-life decisions. PMID:23705232

  12. Prevention policies addressing packaging and packaging waste: Some emerging trends.

    PubMed

    Tencati, Antonio; Pogutz, Stefano; Moda, Beatrice; Brambilla, Matteo; Cacia, Claudia

    2016-10-01

    Packaging waste is a major issue in several countries. Representing in industrialized countries around 30-35% of municipal solid waste yearly generated, this waste stream has steadily grown over the years even if, especially in Europe, specific recycling and recovery targets have been fixed. Therefore, an increasing attention starts to be devoted to prevention measures and interventions. Filling a gap in the current literature, this explorative paper is a first attempt to map the increasingly important phenomenon of prevention policies in the packaging sector. Through a theoretical sampling, 11 countries/states (7 in and 4 outside Europe) have been selected and analyzed by gathering and studying primary and secondary data. Results show evidence of three specific trends in packaging waste prevention policies: fostering the adoption of measures directed at improving packaging design and production through an extensive use of the life cycle assessment; raising the awareness of final consumers by increasing the accountability of firms; promoting collaborative efforts along the packaging supply chains. PMID:27372152

  13. 21 CFR 820.130 - Device packaging.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Device packaging. 820.130 Section 820.130 Food and... QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each manufacturer shall ensure that device packaging and shipping containers are designed and constructed to protect...

  14. Think INSIDE the Box: Package Engineering

    ERIC Educational Resources Information Center

    Snyder, Mark; Painter, Donna

    2014-01-01

    Most products people purchase, keep in their homes, and often discard, are typically packaged in some way. Packaging is so prevalent in daily lives that many of take it for granted. That is by design-the expectation of good packaging is that it exists for the sake of the product. The primary purposes of any package (to contain, inform, display,…

  15. 7 CFR 58.626 - Packaging equipment.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 3 2011-01-01 2011-01-01 false Packaging equipment. 58.626 Section 58.626 Agriculture....626 Packaging equipment. Packaging equipment designed to mechanically fill and close single service... Standards for Equipment for Packaging Frozen Desserts and Cottage Cheese. Quality Specifications for...

  16. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 40 Protection of Environment 24 2011-07-01 2011-07-01 false Unit packaging. 157.27 Section 157.27 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide...

  17. 49 CFR 173.29 - Empty packagings.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 2 2011-10-01 2011-10-01 false Empty packagings. 173.29 Section 173.29... SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for Transportation § 173.29 Empty packagings. (a) General. Except as otherwise provided in this section, an empty packaging containing only the residue of...

  18. 49 CFR 173.29 - Empty packagings.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 49 Transportation 2 2012-10-01 2012-10-01 false Empty packagings. 173.29 Section 173.29... SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for Transportation § 173.29 Empty packagings. (a) General. Except as otherwise provided in this section, an empty packaging containing only the residue of...

  19. 21 CFR 820.130 - Device packaging.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 8 2012-04-01 2012-04-01 false Device packaging. 820.130 Section 820.130 Food and... QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each manufacturer shall ensure that device packaging and shipping containers are designed and constructed to protect...

  20. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 25 2013-07-01 2013-07-01 false Unit packaging. 157.27 Section 157.27 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide...

  1. 49 CFR 173.29 - Empty packagings.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 49 Transportation 2 2014-10-01 2014-10-01 false Empty packagings. 173.29 Section 173.29... SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for Transportation § 173.29 Empty packagings. (a) General. Except as otherwise provided in this section, an empty packaging containing only the residue of...

  2. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 24 2014-07-01 2014-07-01 false Unit packaging. 157.27 Section 157.27 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide...

  3. 21 CFR 820.130 - Device packaging.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 8 2013-04-01 2013-04-01 false Device packaging. 820.130 Section 820.130 Food and... QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each manufacturer shall ensure that device packaging and shipping containers are designed and constructed to protect...

  4. 49 CFR 173.29 - Empty packagings.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 49 Transportation 2 2013-10-01 2013-10-01 false Empty packagings. 173.29 Section 173.29... SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for Transportation § 173.29 Empty packagings. (a) General. Except as otherwise provided in this section, an empty packaging containing only the residue of...

  5. 7 CFR 58.626 - Packaging equipment.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 7 Agriculture 3 2012-01-01 2012-01-01 false Packaging equipment. 58.626 Section 58.626 Agriculture....626 Packaging equipment. Packaging equipment designed to mechanically fill and close single service... Standards for Equipment for Packaging Frozen Desserts and Cottage Cheese. Quality Specifications for...

  6. 7 CFR 58.626 - Packaging equipment.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 7 Agriculture 3 2014-01-01 2014-01-01 false Packaging equipment. 58.626 Section 58.626 Agriculture....626 Packaging equipment. Packaging equipment designed to mechanically fill and close single service... Standards for Equipment for Packaging Frozen Desserts and Cottage Cheese. Quality Specifications for...

  7. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 25 2012-07-01 2012-07-01 false Unit packaging. 157.27 Section 157.27 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide...

  8. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 40 Protection of Environment 23 2010-07-01 2010-07-01 false Unit packaging. 157.27 Section 157.27 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide...

  9. 49 CFR 173.29 - Empty packagings.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Empty packagings. 173.29 Section 173.29... SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for Transportation § 173.29 Empty packagings. (a) General. Except as otherwise provided in this section, an empty packaging containing only the residue of...

  10. Packaging commercial CMOS chips for lab on a chip integration.

    PubMed

    Datta-Chaudhuri, Timir; Abshire, Pamela; Smela, Elisabeth

    2014-05-21

    Combining integrated circuitry with microfluidics enables lab-on-a-chip (LOC) devices to perform sensing, freeing them from benchtop equipment. However, this integration is challenging with small chips, as is briefly reviewed with reference to key metrics for package comparison. In this paper we present a simple packaging method for including mm-sized, foundry-fabricated dies containing complementary metal oxide semiconductor (CMOS) circuits within LOCs. The chip is embedded in an epoxy handle wafer to yield a level, large-area surface, allowing subsequent photolithographic post-processing and microfluidic integration. Electrical connection off-chip is provided by thin film metal traces passivated with parylene-C. The parylene is patterned to selectively expose the active sensing area of the chip, allowing direct interaction with a fluidic environment. The method accommodates any die size and automatically levels the die and handle wafer surfaces. Functionality was demonstrated by packaging two different types of CMOS sensor ICs, a bioamplifier chip with an array of surface electrodes connected to internal amplifiers for recording extracellular electrical signals and a capacitance sensor chip for monitoring cell adhesion and viability. Cells were cultured on the surface of both types of chips, and data were acquired using a PC. Long term culture (weeks) showed the packaging materials to be biocompatible. Package lifetime was demonstrated by exposure to fluids over a longer duration (months), and the package was robust enough to allow repeated sterilization and re-use. The ease of fabrication and good performance of this packaging method should allow wide adoption, thereby spurring advances in miniaturized sensing systems. PMID:24682025

  11. BOK-Underfill Optimization for FPGA Package/Assembly

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2011-01-01

    Commercial-off-the-shelf area array package technologies in high-reliability versions are being considered for NASA electronic systems. These packages are prone to early failure due to the severe mechanical shock and vibration of launch, as well as other less severe conditions, such as mechanical loading during descent, rough terrain mobility, handling, and ground tests. As the density of these packages increases and the size of ball interconnections decrease, susceptibility to mechanical loading and cycling fatigue grows. This report presents a summary of the body of knowledge developed for the evaluation of area array packages and is based on surveys of literature from industry and academia. For high-reliability applications, the limited data that exists will be presented. Most data from industry deals with mechanical fatigue caused by four-point bend tests, as well as from drop tests for hand-held electronics; the most recent data will be presented, along with a brief background of prior literature. Understanding the key design guidelines and failure mechanisms from past tests is critical to developing an approach that will minimize future failures. Additional specific testing enables low-risk insertion of these advanced electronic packages.

  12. Material efficiency in Dutch packaging policy.

    PubMed

    Worrell, Ernst; van Sluisveld, Mariësse A E

    2013-03-13

    Packaging materials are one of the largest contributors to municipal solid waste generation. In this paper, we evaluate the material impacts of packaging policy in The Netherlands, focusing on the role of material efficiency (or waste prevention). Since 1991, five different policies have been implemented to reduce the environmental impact of packaging. The analysis shows that Dutch packaging policies helped to reduce the total packaging volume until 1999. After 2000, packaging consumption increased more rapidly than the baseline, suggesting that policy measures were not effective. Generally, we see limited attention to material efficiency to reduce packaging material use. For this purpose, we tried to gain more insight in recent activities on material efficiency, by building a database of packaging prevention initiatives. We identified 131 alterations to packaging implemented in the period 2005-2010, of which weight reduction was the predominant approach. More appropriate packaging policy is needed to increase the effectiveness of policies, with special attention to material efficiency. PMID:23359741

  13. Green Packaging Management of Logistics Enterprises

    NASA Astrophysics Data System (ADS)

    Zhang, Guirong; Zhao, Zongjian

    From the connotation of green logistics management, we discuss the principles of green packaging, and from the two levels of government and enterprises, we put forward a specific management strategy. The management of green packaging can be directly and indirectly promoted by laws, regulations, taxation, institutional and other measures. The government can also promote new investment to the development of green packaging materials, and establish specialized institutions to identify new packaging materials, standardization of packaging must also be accomplished through the power of the government. Business units of large scale through the packaging and container-based to reduce the use of packaging materials, develop and use green packaging materials and easy recycling packaging materials for proper packaging.

  14. Powerful scriptable ray tracing package xrt

    NASA Astrophysics Data System (ADS)

    Klementiev, Konstantin; Chernikov, Roman

    2014-09-01

    We present an open source python based ray tracing tool that offers several useful features in graphical presentation, material properties, advanced calculations of synchrotron sources, implementation of diffractive and refractive elements, complex (also closed) surfaces and multiprocessing. The package has many usage examples which are supplied together with the code and visualized on its web page. We exemplify the present version by modeling (i) a curved crystal analyzer, (ii) a quarter wave plate, (iii) Bragg-Fresnel optics and (iv) multiple reflective and non-sequential optics (polycapillary). The present version implements the use of OpenCL framework that executes calculations on both CPUs and GPUs. Currently, the calculations of an undulator source on a GPU show a gain of about two orders of magnitude in computing time. The development version is successful in modelling the wavefront propagation. Two examples of diffraction on a plane mirror and a plane blazed grating are given for a beam with a finite energy band.

  15. Microelectronics plastic molded packaging

    SciTech Connect

    Johnson, D.R.; Palmer, D.W.; Peterson, D.W.

    1997-02-01

    The use of commercial off-the-shelf (COTS) microelectronics for nuclear weapon applications will soon be reality rather than hearsay. The use of COTS for new technologies for uniquely military applications is being driven by the so-called Perry Initiative that requires the U.S. Department of Defense (DoD) to accept and utilize commercial standards for procurement of military systems. Based on this philosophy, coupled with several practical considerations, new weapons systems as well as future upgrades will contain plastic encapsulated microelectronics. However, a conservative Department of Energy (DOE) approach requires lifetime predictive models. Thus, the focus of the current project is on accelerated testing to advance current aging models as well as on the development of the methodology to be used during WR qualification of plastic encapsulated microelectronics. An additional focal point involves achieving awareness of commercial capabilities, materials, and processes. One of the major outcomes of the project has been the definition of proper techniques for handling and evaluation of modern surface mount parts which might be used in future systems. This program is also raising the familiarity level of plastic within the weapons complex, allowing subsystem design rules accommodating COTS to evolve. A two year program plan is presented along with test results and commercial interactions during this first year.

  16. 49 CFR 173.24 - General requirements for packagings and packages.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ..., packaging compatibility, etc. must be maintained for the minimum and maximum temperatures, changes in... increase of heat or pressure, significantly reduce the effectiveness of the packaging; (4) There will be no... packagings. A packaging is authorized for a hazardous material only if— (1) The packaging is prescribed...

  17. Package inspection using inverse diffraction

    NASA Astrophysics Data System (ADS)

    McAulay, Alastair D.

    2008-08-01

    More efficient cost-effective hand-held methods of inspecting packages without opening them are in demand for security. Recent new work in TeraHertz sources,1 millimeter waves, presents new possibilities. Millimeter waves pass through cardboard and styrofoam, common packing materials, and also pass through most materials except those with high conductivity like metals which block light and are easily spotted. Estimating refractive index along the path of the beam through the package from observations of the beam passing out of the package provides the necessary information to inspect the package and is a nonlinear problem. So we use a generalized linear inverse technique that we first developed for finding oil by reflection in geophysics.2 The computation assumes parallel slices in the packet of homogeneous material for which the refractive index is estimated. A beam is propagated through this model in a forward computation. The output is compared with the actual observations for the package and an update computed for the refractive indices. The loop is repeated until convergence. The approach can be modified for a reflection system or to include estimation of absorption.

  18. The reduction of packaging waste

    SciTech Connect

    Raney, E.A.; Hogan, J.J.; McCollom, M.L.; Meyer, R.J.

    1994-04-01

    Nationwide, packaging waste comprises approximately one-third of the waste disposed in sanitary landfills. the US Department of Energy (DOE) generated close to 90,000 metric tons of sanitary waste. With roughly one-third of that being packaging waste, approximately 30,000 metric tons are generated per year. The purpose of the Reduction of Packaging Waste project was to investigate opportunities to reduce this packaging waste through source reduction and recycling. The project was divided into three areas: procurement, onsite packaging and distribution, and recycling. Waste minimization opportunities were identified and investigated within each area, several of which were chosen for further study and small-scale testing at the Hanford Site. Test results, were compiled into five ``how-to`` recipes for implementation at other sites. The subject of the recipes are as follows: (1) Vendor Participation Program; (2) Reusable Containers System; (3) Shrink-wrap System -- Plastic and Corrugated Cardboard Waste Reduction; (4) Cardboard Recycling ; and (5) Wood Recycling.

  19. Reference waste package environment report

    SciTech Connect

    Glassley, W.E.

    1986-10-01

    One of three candidate repository sites for high-level radioactive waste packages is located at Yucca Mountain, Nevada, in rhyolitic tuff 700 to 1400 ft above the static water table. Calculations indicate that the package environment will experience a maximum temperature of {similar_to}230{sup 0}C at 9 years after emplacement. For the next 300 years the rock within 1 m of the waste packages will remain dehydrated. Preliminary results suggest that the waste package radiation field will have very little effect on the mechanical properties of the rock. Radiolysis products will have a negligible effect on the rock even after rehydration. Unfractured specimens of repository rock show no change in hydrologic characteristics during repeated dehydration-rehydration cycles. Fractured samples with initially high permeabilities show a striking permeability decrease during dehydration-rehydration cycling, which may be due to fracture healing via deposition of silica. Rock-water interaction studies demonstrate low and benign levels of anions and most cations. The development of sorptive secondary phases such as zeolites and clays suggests that anticipated rock-water interaction may produce beneficial changes in the package environment.

  20. [SMMP] A modern package for simulation of proteins

    NASA Astrophysics Data System (ADS)

    Eisenmenger, Frank; Hansmann, Ulrich H. E.; Hayryan, Shura; Hu, Chin-Kun

    2001-08-01

    A Fortran package is presented which provides useful routines for molecular simulation of proteins within the standard geometry model. Highly efficient algorithms for the calculation of energy and its derivatives are implemented. A set of energy minimization routines and modern Monte Carlo algorithms are added. Three different parameter sets are used to calculate the internal energy: ECEPP/2 potential, ECEPP/3 and the FLEX potential. The solvation energy of the protein can be calculated using the solvent accessible area method. The program is fast and may be successfully exploited even on a single PC. The code is free and open, and can be easily modified. Hence, the package allows researchers and students in a simple and inexpensive way to become familiar with protein simulation techniques, and is especially suitable for lecturers teaching molecular simulation. Yet, when exploited on advanced computers or PC clusters, it is a powerful tool and also valuable for advanced researchers.

  1. Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2012-01-01

    This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non

  2. High-performance GaAs/AlGaAs optical modulators: Their performance and packaging for microwave photonic integrated circuits

    SciTech Connect

    Kravitz, S.H.; Hietala, V.M.; Vawter, G.A.

    1994-12-31

    The goal of this effort is to build and package photonic integrated circuits (PICs). This infers that compact device design is very important, with all building blocks of the circuit aimed toward integration, low voltage operation, and manufacturability. With such a device, it is important that optical packaging by considered in the initial design. To this end, an advanced photonic packaging concept was designed. This concept employs vertical coupling of light both in and out of the package. This package concept is aimed at hermeticity, with no fiber penetrations through the walls of the package. This paper will describe the building blocks of this package, including output gratings, binary optics, and an automatic fiber capture device, called CLASP.

  3. HALT to qualify electronic packages: a proof of concept

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2014-03-01

    A proof of concept of the Highly Accelerated Life Testing (HALT) technique was explored to assess and optimize electronic packaging designs for long duration deep space missions in a wide temperature range (-150°C to +125°C). HALT is a custom hybrid package suite of testing techniques using environments such as extreme temperatures and dynamic shock step processing from 0g up to 50g of acceleration. HALT testing used in this study implemented repetitive shock on the test vehicle components at various temperatures to precipitate workmanship and/or manufacturing defects to show the weak links of the designs. The purpose is to reduce the product development cycle time for improvements to the packaging design qualification. A test article was built using advanced electronic package designs and surface mount technology processes, which are considered useful for a variety of JPL and NASA projects, i.e. (surface mount packages such as ball grid arrays (BGA), plastic ball grid arrays (PBGA), very thin chip array ball grid array (CVBGA), quad flat-pack (QFP), micro-lead-frame (MLF) packages, several passive components, etc.). These packages were daisy-chained and independently monitored during the HALT test. The HALT technique was then implemented to predict reliability and assess survivability of these advanced packaging techniques for long duration deep space missions in much shorter test durations. Test articles were built using advanced electronic package designs that are considered useful in various NASA projects. All the advanced electronic packages were daisychained independently to monitor the continuity of the individual electronic packages. Continuity of the daisy chain packages was monitored during the HALT testing using a data logging system. We were able to test the boards up to 40g to 50g shock levels at temperatures ranging from +125°C to -150°C. The HALT system can deliver 50g shock levels at room temperature. Several tests were performed by subjecting

  4. GNS-12 Packaging design criteria

    SciTech Connect

    Clements, E.P., Westinghouse Hanford

    1996-07-24

    The purpose of this Packaging Design Criteria (PDC) is to provide criteria for the Safety Analysis Report for Packaging (SARP)(Onsite). The SARP provides the evaluation to demonstrate that the onsite transportation safety criteria are met for the transport and storage of the 324 Building vitrified encapsulated material in the GNS-12 cask. In this application, the approved PDC provides a formal set of standards for the payload requirements, and guidance for the current cask transport configuration and a revised storage seal and primary lid modification design.

  5. SAM -- A Spectral Extraction Package

    NASA Astrophysics Data System (ADS)

    Lewis, J. R.

    In this note a description is given of SAM, a package written at RGO for the extraction of spectra from two dimensional data frames. The need to extract spectra from two dimensional frames in an optimal manner (e.g. one in which the signal to noise ratio was maximised) was the primary reason for the writing of the package. The programs were originally written with FOS, ISIS and IDS in mind, but contain nothing which is instrument specific and hence should be applicable to any two dimensional spectral data frame.

  6. Truss Performance and Packaging Metrics

    NASA Technical Reports Server (NTRS)

    Mikulas, Martin M.; Collins, Timothy J.; Doggett, William; Dorsey, John; Watson, Judith

    2006-01-01

    In the present paper a set of performance metrics are derived from first principals to assess the efficiency of competing space truss structural concepts in terms of mass, stiffness, and strength, for designs that are constrained by packaging. The use of these performance metrics provides unique insight into the primary drivers for lowering structural mass and packaging volume as well as enabling quantitative concept performance evaluation and comparison. To demonstrate the use of these performance metrics, data for existing structural concepts are plotted and discussed. Structural performance data is presented for various mechanical deployable concepts, for erectable structures, and for rigidizable structures.

  7. Package for integrated optic circuit and method

    DOEpatents

    Kravitz, S.H.; Hadley, G.R.; Warren, M.E.; Carson, R.F.; Armendariz, M.G.

    1998-08-04

    A structure and method are disclosed for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package. 6 figs.

  8. Package for integrated optic circuit and method

    DOEpatents

    Kravitz, Stanley H.; Hadley, G. Ronald; Warren, Mial E.; Carson, Richard F.; Armendariz, Marcelino G.

    1998-01-01

    A structure and method for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package.

  9. Modeling with the Advanced Science Analysis Package (ASAP)

    NASA Astrophysics Data System (ADS)

    Boone, F.; Schilke, P.; Muders, D.; Comito, C.; Leurini, S.; Parise, B.; van der Tak, F.; Menten, K.

    ASAP is a project initiated at the MPIfR which aims at providing a new generation of scientific analysis tools to extract the physical information from the high dynamical range data of current and future instruments. It was motivated by the ALMA project but the concepts and their implementations are applicable to all wavelengths. This presentation is focused on DALIA (Direct Aproach to spectral Line Analysis), a prototype software for forward modeling. It consists of a JAVA graphical user interface through which the user can fit models to observations. The models are stored as binaries and are described by XML files according to a schema. New models developed in any language can thus be easily added to the model database by the user. The different steps of the fit (simulation, evaluation, parameter change) can be executed manually or automatically through an optimization engine. The interface allows the user to have a direct control on the model parameters which can be fixed or constrained. The data to be modeled can be of any type (1D, 2D, 3D, specral, spatial, temporal...) and associations of datasets of different types are supported as long as the axes are identical to those of the model output. In this prototype the FITS format is supported. For spectral synthesis, the spectroscopic data from the molecular databases (Cologne, JPL) are used. This approach is very generic and uses concepts similar to those of the Virtual Observatory. Its integration into the VO would allow astronomers to use the data archives to constrain a model and would permit to store model solutions for each source. These model solutions could thus be easily shared and be improved with the aquisition of new data.

  10. Modeling with the Advanced Science Analysis Package (ASAP)

    NASA Astrophysics Data System (ADS)

    Boone, F.; Schilke, P.; Muders, D.; Comito, C.; Leurini, S.; Parise, B.; van der Tak, F.; Menten, K.

    2005-12-01

    ASAP is a project initiated at the MPIfR which aims at providing a new generation of scientific analysis tools to extract the physical information from the high dynamical range data of current and future instruments. It was motivated by the ALMA project but the concepts and their implementations are applicable to all wavelengths. This presentation is focused on DALIA (Direct Aproach to spectral Line Analysis), a prototype software for forward modeling. It consists of a JAVA graphical user interface through which the user can fit models to observations. The models are stored as binaries and are described by XML files according to a schema. New models developed in any language can thus be easily added to the model database by the user. The different steps of the fit (simulation, evaluation, parameter change) can be executed manually or automatically through an optimization engine. The interface allows the user to have a direct control on the model parameters which can be fixed or constrained. The data to be modeled can be of any type (1D, 2D, 3D, spectral, spatial, temporal...) and associations of datasets of different types are supported as long as the axes are identical to those of the model output. In this prototype the data need to be in FITS format. For spectral synthesis, the spectroscopic data from the molecular databases (Cologne, JPL) are used. This approach is very generic and uses concepts similar to those of the Virtual Observatory. Its integration into the VO would allow astronomers to use the data archives to constrain a model and would permit to store model solutions for each source. These model solutions could thus be easily shared and be improved each time new observations of the source are made.

  11. Designing for Small Volume Assembly of Advanced Electronics Packages

    NASA Technical Reports Server (NTRS)

    Galbraith, L.; Bonner, J. K.

    1995-01-01

    We describe a general methodology to Design for Producibility and Reliability (DFPAR) for very small volume production runs. In cases where the entire volume for fabrication is less than five products, traditional Statistical Process Control (SPC) is inadequate due to reliance on statistics of much larger volumes and the Central Limit Theorem. Data acquisition for process parameter estimation from such a small sample size is difficult; however, it is critical to producing high reliability product.

  12. Hanford Site radioactive hazardous materials packaging directory

    SciTech Connect

    McCarthy, T.L.

    1995-12-01

    The Hanford Site Radioactive Hazardous Materials Packaging Directory (RHMPD) provides information concerning packagings owned or routinely leased by Westinghouse Hanford Company (WHC) for offsite shipments or onsite transfers of hazardous materials. Specific information is provided for selected packagings including the following: general description; approval documents/specifications (Certificates of Compliance and Safety Analysis Reports for Packaging); technical information (drawing numbers and dimensions); approved contents; areas of operation; and general information. Packaging Operations & Development (PO&D) maintains the RHMPD and may be contacted for additional information or assistance in obtaining referenced documentation or assistance concerning packaging selection, availability, and usage.

  13. A Computerized Petroleum Geology Package.

    ERIC Educational Resources Information Center

    Moser, Louise E.

    1983-01-01

    Describes a package of computer programs developed to implement an oil exploration game that gives undergraduate students practical experience in applying theoretical principles of petroleum geology. The programs facilitate management of the game by the instructor and enhance the learning experience. (Author/MBR)

  14. COLDMON -- Cold File Analysis Package

    NASA Astrophysics Data System (ADS)

    Rawlinson, D. J.

    The COLDMON package has been written to allow system managers to identify those items of software that are not used (or used infrequently) on their systems. It consists of a few command procedures and a Fortran program to analyze the results. It makes use of the AUDIT facility and security ACLs in VMS.

  15. The Macro - Games Course Package.

    ERIC Educational Resources Information Center

    Heriot-Watt Univ., Edinburgh (Scotland). Esmee Fairbairn Economics Research Centre.

    Part of an Economic Education Series, the course package is designed to teach basic concepts and fundamental principles of macroeconomics and how they can be applied to various world problems. For use with college students, learning is gained through lectures, discussion, simulation games, programmed learning, and text. Time allotment is a 15-week…

  16. DATACUBE: A datacube manipulation package

    NASA Astrophysics Data System (ADS)

    Allan, Alasdair; Currie, Malcolm J.

    2014-05-01

    DATACUBE is a command-line package for manipulating and visualizing data cubes. It was designed for integral field spectroscopy but has been extended to be a generic data cube tool, used in particular for sub-millimeter data cubes from the James Clerk Maxwell Telescope. It is part of the Starlink software collection (ascl:1110.012).

  17. Food Nanotechnology: Food Packaging Applications

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Astonishing growth in the market for nanofoods is predicted in the future, from the current market of $2.6 billion to $20.4 billion in 2010. The market for nanotechnology in food packaging alone is expected to reach $360 million in 2008. In large part the impetus for this predicted growth is the e...

  18. Electronic Spreadsheet Packages for Microcomputers.

    ERIC Educational Resources Information Center

    Gibson, Larry M.

    1984-01-01

    Describes capabilities and advantages of spreadsheet software, including its ability to perform "what-if" analysis quickly and easily. Also noted are additional advantages; applications, including use in the library environment; history and development; new-generation spreadsheets; and enhanced packaging in the near future. A spreadsheet software…

  19. RAGG - R EPISODIC AGGREGATION PACKAGE

    EPA Science Inventory

    The RAGG package is an R implementation of the CMAQ episodic model aggregation method developed by Constella Group and the Environmental Protection Agency. RAGG is a tool to provide climatological seasonal and annual deposition of sulphur and nitrogen for multimedia management. ...

  20. Food Nanotechnology - Food Packaging Applications

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Astonishing growth in the market for nanofoods is predicted in the future, from the current market of $2.6 billion to $20.4 billion in 2010. The market for nanotechnology in food packaging alone is expected to reach $360 million in 2008. In large part, the impetus for this predicted growth is the ...

  1. 9975 SHIPPING PACKAGE LIFE EXTENSION SURVEILLANCE PROGRAM RESULTS SUMMARY

    SciTech Connect

    Daugherty, W.; Dunn, K.; Hackney, B.; Hoffman, E.; Skidmore, E.

    2011-01-06

    Results from the 9975 Surveillance Program at the Savannah River Site (SRS) are summarized for justification to extend the life of the 9975 packages currently stored in the K-Area Materials Storage (KAMS) facility from 10 years to 15 years. This justification is established with the stipulation that surveillance activities will continue throughout this extended time to ensure the continued integrity of the 9975 materials of construction and to further understand the currently identified degradation mechanisms. The current 10 year storage life was developed prior to storage. A subsequent report was later used to extend the qualification of the 9975 shipping packages for 2 years for shipping plus 10 years for storage. However the qualification for the storage period was provided by the monitoring requirements of the Storage and Surveillance Program. This report summarizes efforts to determine a new safe storage limit for the 9975 shipping package based on the surveillance data collected since 2005 when the surveillance program began. KAMS is a zero-release facility that depends upon containment by the 9975 to meet design basis storage requirements. Therefore, to confirm the continued integrity of the 9975 packages while stored in KAMS, a 9975 Storage and Surveillance Program was implemented alongside the DOE required Integrated Surveillance Program (ISP) for 3013 plutonium-bearing containers. The 9975 Storage and Surveillance Program performs field surveillance as well as accelerated aging tests to ensure any degradation due to aging, to the extent that could affect packaging performance, is detected in advance of such degradation occurring in the field. The Program has demonstrated that the 9975 package has a robust design that can perform under a variety of conditions. As such the primary emphasis of the on-going 9975 Surveillance Program is an aging study of the 9975 Viton(reg.sign) GLT containment vessel O-rings and the Celotex(reg.sign) fiberboard thermal

  2. Enhanced thermaly managed packaging for III-nitride light emitters

    NASA Astrophysics Data System (ADS)

    Kudsieh, Nicolas

    In this Dissertation our work on `enhanced thermally managed packaging of high power semiconductor light sources for solid state lighting (SSL)' is presented. The motivation of this research and development is to design thermally high stable cost-efficient packaging of single and multi-chip arrays of III-nitrides wide bandgap semiconductor light sources through mathematical modeling and simulations. Major issues linked with this technology are device overheating which causes serious degradation in their illumination intensity and decrease in the lifetime. In the introduction the basics of III-nitrides WBG semiconductor light emitters are presented along with necessary thermal management of high power cingulated and multi-chip LEDs and laser diodes. This work starts at chip level followed by its extension to fully packaged lighting modules and devices. Different III-nitride structures of multi-quantum well InGaN/GaN and AlGaN/GaN based LEDs and LDs were analyzed using advanced modeling and simulation for different packaging designs and high thermal conductivity materials. Study started with basic surface mounted devices using conventional packaging strategies and was concluded with the latest thermal management of chip-on-plate (COP) method. Newly discovered high thermal conductivity materials have also been incorporated for this work. Our study also presents the new approach of 2D heat spreaders using such materials for SSL and micro LED array packaging. Most of the work has been presented in international conferences proceedings and peer review journals. Some of the latest work has also been submitted to well reputed international journals which are currently been reviewed for publication. .

  3. Solidification of Magnesium (AM50A) / vol%. SiCp composite

    NASA Astrophysics Data System (ADS)

    Zhang, X.; Hu, H.

    2012-01-01

    Magnesium matrix composite is one of the advanced lightweight materials with high potential to be used in automotive and aircraft industries due to its low density and high specific mechanical properties. The magnesium composites can be fabricated by adding the reinforcements of fibers or/and particles. In the previous literature, extensive studies have been performed on the development of matrix grain structure of aluminum-based metal matrix composites. However, there is limited information available on the development of grain structure during the solidification of particulate-reinforced magnesium. In this work, a 5 vol.% SiCp particulate-reinforced magnesium (AM50A) matrix composite (AM50A/SiCp) was prepared by stir casting. The solidification behavior of the cast AM50A/SiCp composite was investigated by computer-based thermal analysis. Optical and scanning electron microscopies (SEM) were employed to examine the occurrence of nucleation and grain refinement involved. The results indicate that the addition of SiCp particulates leads to a finer grain structure in the composite compared with the matrix alloy. The refinement of grain structure should be attributed to both the heterogeneous nucleation and the restricted primary crystal growth.

  4. Multiple Learning Strategies Project. Medical Assistant. [Regular Vocational. Vol. 3.

    ERIC Educational Resources Information Center

    Varney, Beverly; And Others

    This instructional package, one of four designed for regular vocational students, focuses on the vocational area of medical assistant. Contained in this document are forty learning modules organized into four units: office surgery; telephoning; bandaging; and medications and treatments. Each module includes these elements: a performance objective…

  5. Multiple Learning Strategies Project. Medical Assistant. Visually Impaired. [Vol. 2.

    ERIC Educational Resources Information Center

    Varney, Beverly; And Others

    This instructional package, one of two designed for visually impaired students, focuses on the vocational area of medical assistant. Contained in this document are thirty-five learning modules organized into nine units: telephoning; medications and treatments; review for competency; third-party billing; skill building; bookkeeping; interpersonal…

  6. Multiple Learning Strategies Project. Medical Assistant. [Regular Vocational. Vol. 4.

    ERIC Educational Resources Information Center

    Varney, Beverly; And Others

    This instructional package, one of four designed for regular vocational students, focuses on the vocational area of medical assistant. Contained in this document are forty-seven learning modules organized into nine units: review for competency; third-party billing; patient teaching; skill building; bookkeeping; interpersonal relationships; medical…

  7. New Directions in Discourse Processing. Advances in Discourse Processes, Vol. 2.

    ERIC Educational Resources Information Center

    Freedle, Roy O., Ed.

    Two theoretical orientations-schema theory and cultural norms for the use of language unify this multidisciplinary collection of papers examining discourse. Chapters by Adams and Collins; Warren; Nicholas and Trabasso; Stein and Glenn; and Freedle and Hale highlight the application of schema theory to the study of story recall, reading, and the…

  8. AISI/DOE Advanced Process Control Program Vol. 5 of 6: Phase Measurement of Galvanneal

    SciTech Connect

    Cristopher Burnett; Ronald Guel; James R. Philips; L. Lowry; Beverly Tai

    1999-05-31

    Augmentation of the internal software of a commercial X-ray fluorescence gauge is shown to enable the instrument to extend its continuous on-line real-time measurements of a galvanneal coating's total elemental content to encompass similar measurements of the relative thickness of the coating's three principal metallurgical phases. The mathematical structure of this software augmentation is derived from the theory of neural networks. The performance of the augmented gauge is validated by comparing the gauge implied real-time phase distribution with the phase distribution independently measured off-line on between the gauge and laboratory measurements and to suggest preferred approaches to be followed in future application of the augmented gauge.

  9. Sensory impacts of food-packaging interactions.

    PubMed

    Duncan, Susan E; Webster, Janet B

    2009-01-01

    Sensory changes in food products result from intentional or unintentional interactions with packaging materials and from failure of materials to protect product integrity or quality. Resolving sensory issues related to plastic food packaging involves knowledge provided by sensory scientists, materials scientists, packaging manufacturers, food processors, and consumers. Effective communication among scientists and engineers from different disciplines and industries can help scientists understand package-product interactions. Very limited published literature describes sensory perceptions associated with food-package interactions. This article discusses sensory impacts, with emphasis on oxidation reactions, associated with the interaction of food and materials, including taints, scalping, changes in food quality as a function of packaging, and examples of material innovations for smart packaging that can improve sensory quality of foods and beverages. Sensory evaluation is an important tool for improved package selection and development of new materials. PMID:19389606

  10. Software Packages to Deal with Fuzzy Systems

    NASA Astrophysics Data System (ADS)

    Zahariev, Z.

    2007-10-01

    This paper investigates currently available software packages dealing with fuzzy inference systems (FIS). Fifteen packages are investigated and are described here. Some comparisons are created. At the end there are some conclusions.

  11. 27 CFR 44.181 - Packages.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... Tubes by Manufacturers and Export Warehouse Proprietors Packaging Requirements § 44.181 Packages. All... cellophane wrapping material. (Sec. 202, Pub. L. 85-859, 72 Stat. 1422 (26 U.S.C. 5723))...

  12. Amesos2 Templated Direct Sparse Solver Package

    2011-05-24

    Amesos2 is a templated direct sparse solver package. Amesos2 provides interfaces to direct sparse solvers, rather than providing native solver capabilities. Amesos2 is a derivative work of the Trilinos package Amesos.

  13. Flat-package DIP handling tool

    NASA Technical Reports Server (NTRS)

    Angelou, E.; Fraser, R.

    1977-01-01

    Device, using magnetic attraction, can facilitate handling of integrated-circuit flat packages and prevent contamination and bent leads. Tool lifts packages by their cases and releases them by operation of manual plunger.

  14. The Feat of Packaging Eight Unique Genome Segments

    PubMed Central

    Giese, Sebastian; Bolte, Hardin; Schwemmle, Martin

    2016-01-01

    Influenza A viruses (IAVs) harbor a segmented RNA genome that is organized into eight distinct viral ribonucleoprotein (vRNP) complexes. Although a segmented genome may be a major advantage to adapt to new host environments, it comes at the cost of a highly sophisticated genome packaging mechanism. Newly synthesized vRNPs conquer the cellular endosomal recycling machinery to access the viral budding site at the plasma membrane. Genome packaging sequences unique to each RNA genome segment are thought to be key determinants ensuring the assembly and incorporation of eight distinct vRNPs into progeny viral particles. Recent studies using advanced fluorescence microscopy techniques suggest the formation of vRNP sub-bundles (comprising less than eight vRNPs) during their transport on recycling endosomes. The formation of such sub-bundles might be required for efficient packaging of a bundle of eight different genomes segments at the budding site, further highlighting the complexity of IAV genome packaging. PMID:27322310

  15. Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2013-01-01

    Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal

  16. MIBPB: A software package for electrostatic analysis

    PubMed Central

    Chen, Duan; Chen, Zhan; Chen, Changjun; Geng, Weihua; Wei, Guo-Wei

    2010-01-01

    The Poisson-Boltzmann equation (PBE) is an established model for the electrostatic analysis of biomolecules. The development of advanced computational techniques for the solution of the PBE has been an important topic in the past two decades. This paper presents a matched interface and boundary (MIB) based PBE software package, the MIBPB solver, for electrostatic analysis. The MIBPB has a unique feature that it is the first interface technique based PBE solver that rigorously enforces the solution and flux continuity conditions at the dielectric interface between the biomolecule and the solvent. For protein molecular surfaces which may possess troublesome geometrical singularities, the MIB scheme makes the MIBPB by far the only existing PBE solver that is able to deliver the second order convergence, i.e., the accuracy increases four times when the mesh size is halved. The MIBPB method is also equipped with a Dirichlet-to-Neumann mapping (DNM) technique, that builds a Green's function approach to analytically resolve the singular charge distribution in biomolecules in order to obtain reliable solutions at meshes as coarse as 1Å — while it usually takes other traditional PB solvers 0.25Å to reach similar level of reliability. The present work further accelerates the rate of convergence of linear equation systems resulting from the MIBPB by utilizing the Krylov subspace (KS) techniques. Condition numbers of the MIBPB matrices are significantly reduced by using appropriate Krylov subspace solver and preconditioner combinations. Both linear and nonlinear PBE solvers in the MIBPB package are tested by protein-solvent solvation energy calculations and analysis of salt effects on protein-protein binding energies, respectively. PMID:20845420

  17. MIBPB: a software package for electrostatic analysis.

    PubMed

    Chen, Duan; Chen, Zhan; Chen, Changjun; Geng, Weihua; Wei, Guo-Wei

    2011-03-01

    The Poisson-Boltzmann equation (PBE) is an established model for the electrostatic analysis of biomolecules. The development of advanced computational techniques for the solution of the PBE has been an important topic in the past two decades. This article presents a matched interface and boundary (MIB)-based PBE software package, the MIBPB solver, for electrostatic analysis. The MIBPB has a unique feature that it is the first interface technique-based PBE solver that rigorously enforces the solution and flux continuity conditions at the dielectric interface between the biomolecule and the solvent. For protein molecular surfaces, which may possess troublesome geometrical singularities, the MIB scheme makes the MIBPB by far the only existing PBE solver that is able to deliver the second-order convergence, that is, the accuracy increases four times when the mesh size is halved. The MIBPB method is also equipped with a Dirichlet-to-Neumann mapping technique that builds a Green's function approach to analytically resolve the singular charge distribution in biomolecules in order to obtain reliable solutions at meshes as coarse as 1 Å--whereas it usually takes other traditional PB solvers 0.25 Å to reach similar level of reliability. This work further accelerates the rate of convergence of linear equation systems resulting from the MIBPB by using the Krylov subspace (KS) techniques. Condition numbers of the MIBPB matrices are significantly reduced by using appropriate KS solver and preconditioner combinations. Both linear and nonlinear PBE solvers in the MIBPB package are tested by protein-solvent solvation energy calculations and analysis of salt effects on protein-protein binding energies, respectively. PMID:20845420

  18. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 5 2014-04-01 2014-04-01 false Packaging conditions. 355.20 Section 355.20 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) DRUGS FOR HUMAN USE ANTICARIES DRUG PRODUCTS FOR OVER-THE-COUNTER HUMAN USE Active Ingredients § 355.20 Packaging conditions. (a) Package size limitation....

  19. YUCCA MOUNTAIN WASTE PACKAGE CLOSURE SYSTEM

    SciTech Connect

    G. Housley; C. Shelton-davis; K. Skinner

    2005-08-26

    The method selected for dealing with spent nuclear fuel in the US is to seal the fuel in waste packages and then to place them in an underground repository at the Yucca Mountain Site in Nevada. This article describes the Waste Package Closure System (WPCS) currently being designed for sealing the waste packages.

  20. 9 CFR 381.144 - Packaging materials.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... consistent with the Food and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7... 9 Animals and Animal Products 2 2011-01-01 2011-01-01 false Packaging materials. 381.144 Section... Packaging materials. (a) Edible products may not be packaged in a container which is composed in whole or...

  1. 27 CFR 41.71 - Package.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 2 2010-04-01 2010-04-01 false Package. 41.71 Section 41.71 Alcohol, Tobacco Products and Firearms ALCOHOL AND TOBACCO TAX AND TRADE BUREAU, DEPARTMENT OF THE TREASURY (CONTINUED) TOBACCO IMPORTATION OF TOBACCO PRODUCTS, CIGARETTE PAPERS AND TUBES, AND PROCESSED TOBACCO Packages § 41.71 Package....

  2. 7 CFR 932.9 - Packaged olives.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 7 Agriculture 8 2012-01-01 2012-01-01 false Packaged olives. 932.9 Section 932.9 Agriculture... and Orders; Fruits, Vegetables, Nuts), DEPARTMENT OF AGRICULTURE OLIVES GROWN IN CALIFORNIA Order Regulating Handling Definitions § 932.9 Packaged olives. Packaged olives means (a) processed olives...

  3. 7 CFR 932.9 - Packaged olives.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 8 2010-01-01 2010-01-01 false Packaged olives. 932.9 Section 932.9 Agriculture... and Orders; Fruits, Vegetables, Nuts), DEPARTMENT OF AGRICULTURE OLIVES GROWN IN CALIFORNIA Order Regulating Handling Definitions § 932.9 Packaged olives. Packaged olives means (a) processed olives...

  4. 7 CFR 932.9 - Packaged olives.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 7 Agriculture 8 2014-01-01 2014-01-01 false Packaged olives. 932.9 Section 932.9 Agriculture... AND ORDERS; FRUITS, VEGETABLES, NUTS), DEPARTMENT OF AGRICULTURE OLIVES GROWN IN CALIFORNIA Order Regulating Handling Definitions § 932.9 Packaged olives. Packaged olives means (a) processed olives...

  5. 7 CFR 932.9 - Packaged olives.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 7 Agriculture 8 2013-01-01 2013-01-01 false Packaged olives. 932.9 Section 932.9 Agriculture... AND ORDERS; FRUITS, VEGETABLES, NUTS), DEPARTMENT OF AGRICULTURE OLIVES GROWN IN CALIFORNIA Order Regulating Handling Definitions § 932.9 Packaged olives. Packaged olives means (a) processed olives...

  6. 7 CFR 932.9 - Packaged olives.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 8 2011-01-01 2011-01-01 false Packaged olives. 932.9 Section 932.9 Agriculture... and Orders; Fruits, Vegetables, Nuts), DEPARTMENT OF AGRICULTURE OLIVES GROWN IN CALIFORNIA Order Regulating Handling Definitions § 932.9 Packaged olives. Packaged olives means (a) processed olives...

  7. PACKAGING, FILMS AND COATINGS: TECHNOLOGIES AND APPLICATIONS

    Technology Transfer Automated Retrieval System (TEKTRAN)

    There is an increasing demand for biodegradable and compostable packaging by both industry and consumers. With the growing concern over the state of the environment and a desire to decrease the use of petroleum-based packaging, packaging from renewable resources that is produced using environmental...

  8. 27 CFR 19.186 - Package scales.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2012-04-01 2012-04-01 false Package scales. 19.186... Package Scale and Pipeline Requirements § 19.186 Package scales. Proprietors must ensure that scales used.... However, if a scale is not used during a 6-month period, it is only necessary to test the scale prior...

  9. 27 CFR 19.276 - Package scales.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2010-04-01 2010-04-01 false Package scales. 19.276... Package scales. Proprietors shall ensure the accuracy of scales used for weighing packages of spirits through tests conducted at intervals of not more than 6 months or whenever scales are adjusted or...

  10. 27 CFR 19.186 - Package scales.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2014-04-01 2014-04-01 false Package scales. 19.186... Package Scale and Pipeline Requirements § 19.186 Package scales. Proprietors must ensure that scales used.... However, if a scale is not used during a 6-month period, it is only necessary to test the scale prior...

  11. 27 CFR 19.186 - Package scales.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2011-04-01 2011-04-01 false Package scales. 19.186... Package Scale and Pipeline Requirements § 19.186 Package scales. Proprietors must ensure that scales used.... However, if a scale is not used during a 6-month period, it is only necessary to test the scale prior...

  12. 27 CFR 19.186 - Package scales.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2013-04-01 2013-04-01 false Package scales. 19.186... Package Scale and Pipeline Requirements § 19.186 Package scales. Proprietors must ensure that scales used.... However, if a scale is not used during a 6-month period, it is only necessary to test the scale prior...

  13. 27 CFR 6.93 - Combination packaging.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2012-04-01 2012-04-01 false Combination packaging. 6.93 Section 6.93 Alcohol, Tobacco Products and Firearms ALCOHOL AND TOBACCO TAX AND TRADE BUREAU, DEPARTMENT OF THE TREASURY LIQUORS âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and...

  14. 27 CFR 6.93 - Combination packaging.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2014-04-01 2014-04-01 false Combination packaging. 6.93 Section 6.93 Alcohol, Tobacco Products and Firearms ALCOHOL AND TOBACCO TAX AND TRADE BUREAU, DEPARTMENT OF THE TREASURY ALCOHOL âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and...

  15. 27 CFR 6.93 - Combination packaging.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2013-04-01 2013-04-01 false Combination packaging. 6.93 Section 6.93 Alcohol, Tobacco Products and Firearms ALCOHOL AND TOBACCO TAX AND TRADE BUREAU, DEPARTMENT OF THE TREASURY ALCOHOL âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and...

  16. 19 CFR 134.53 - Examination packages.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 19 Customs Duties 1 2010-04-01 2010-04-01 false Examination packages. 134.53 Section 134.53... TREASURY COUNTRY OF ORIGIN MARKING Articles Found Not Legally Marked § 134.53 Examination packages. (a) Site of marking—(1) Customs custody. Articles (or containers) in examination packages may be marked...

  17. 7 CFR 58.626 - Packaging equipment.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Packaging equipment. 58.626 Section 58.626 Agriculture....626 Packaging equipment. Packaging equipment designed to mechanically fill and close single service... accessible for cleaning. The design and operation of the machine shall in no way contaminate the container...

  18. 7 CFR 993.22 - Consumer package.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 8 2011-01-01 2011-01-01 false Consumer package. 993.22 Section 993.22 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Marketing Agreements... Order Regulating Handling Definitions § 993.22 Consumer package. Consumer package means: (a)...

  19. 7 CFR 993.22 - Consumer package.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 7 Agriculture 8 2014-01-01 2014-01-01 false Consumer package. 993.22 Section 993.22 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (MARKETING AGREEMENTS... Order Regulating Handling Definitions § 993.22 Consumer package. Consumer package means: (a)...

  20. 7 CFR 993.22 - Consumer package.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 7 Agriculture 8 2013-01-01 2013-01-01 false Consumer package. 993.22 Section 993.22 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (MARKETING AGREEMENTS... Order Regulating Handling Definitions § 993.22 Consumer package. Consumer package means: (a)...

  1. 7 CFR 993.22 - Consumer package.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 7 Agriculture 8 2012-01-01 2012-01-01 false Consumer package. 993.22 Section 993.22 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Marketing Agreements... Order Regulating Handling Definitions § 993.22 Consumer package. Consumer package means: (a)...

  2. 9 CFR 381.144 - Packaging materials.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... consistent with the Food and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7... 9 Animals and Animal Products 2 2014-01-01 2014-01-01 false Packaging materials. 381.144 Section... Packaging materials. (a) Edible products may not be packaged in a container which is composed in whole or...

  3. 21 CFR 610.61 - Package label.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... GENERAL BIOLOGICAL PRODUCTS STANDARDS Labeling Standards § 610.61 Package label. The following items shall appear on the label affixed to each package containing a product: (a) The proper name of the product; (b... 21 Food and Drugs 7 2010-04-01 2010-04-01 false Package label. 610.61 Section 610.61 Food...

  4. 21 CFR 610.61 - Package label.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... GENERAL BIOLOGICAL PRODUCTS STANDARDS Labeling Standards § 610.61 Package label. The following items shall appear on the label affixed to each package containing a product: (a) The proper name of the product; (b... 21 Food and Drugs 7 2013-04-01 2013-04-01 false Package label. 610.61 Section 610.61 Food...

  5. 21 CFR 610.61 - Package label.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... BIOLOGICAL PRODUCTS STANDARDS Labeling Standards § 610.61 Package label. The following items shall appear on the label affixed to each package containing a product: (a) The proper name of the product; (b) The... 21 Food and Drugs 7 2011-04-01 2010-04-01 true Package label. 610.61 Section 610.61 Food and...

  6. 21 CFR 610.61 - Package label.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... GENERAL BIOLOGICAL PRODUCTS STANDARDS Labeling Standards § 610.61 Package label. The following items shall appear on the label affixed to each package containing a product: (a) The proper name of the product; (b... 21 Food and Drugs 7 2012-04-01 2012-04-01 false Package label. 610.61 Section 610.61 Food...

  7. 21 CFR 610.61 - Package label.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... GENERAL BIOLOGICAL PRODUCTS STANDARDS Labeling Standards § 610.61 Package label. The following items shall appear on the label affixed to each package containing a product: (a) The proper name of the product; (b... 21 Food and Drugs 7 2014-04-01 2014-04-01 false Package label. 610.61 Section 610.61 Food...

  8. 21 CFR 820.130 - Device packaging.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 8 2011-04-01 2011-04-01 false Device packaging. 820.130 Section 820.130 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) MEDICAL DEVICES QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each...

  9. 7 CFR 58.640 - Packaging.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 3 2011-01-01 2011-01-01 false Packaging. 58.640 Section 58.640 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... Procedures § 58.640 Packaging. The packaging of the semifrozen product shall be done by means which will...

  10. 9 CFR 354.72 - Packaging.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 9 Animals and Animal Products 2 2011-01-01 2011-01-01 false Packaging. 354.72 Section 354.72... CERTIFICATION VOLUNTARY INSPECTION OF RABBITS AND EDIBLE PRODUCTS THEREOF Supervision of Marking and Packaging § 354.72 Packaging. No container which bears or may bear any official identification or any...

  11. 49 CFR 172.514 - Bulk packagings.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 2 2011-10-01 2011-10-01 false Bulk packagings. 172.514 Section 172.514... SECURITY PLANS Placarding § 172.514 Bulk packagings. (a) Except as provided in paragraph (c) of this section, each person who offers for transportation a bulk packaging which contains a hazardous...

  12. 27 CFR 6.93 - Combination packaging.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2011-04-01 2011-04-01 false Combination packaging. 6..., DEPARTMENT OF THE TREASURY LIQUORS âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and distributing distilled spirits, wine, or malt beverages in...

  13. 9 CFR 354.72 - Packaging.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 9 Animals and Animal Products 2 2014-01-01 2014-01-01 false Packaging. 354.72 Section 354.72... CERTIFICATION VOLUNTARY INSPECTION OF RABBITS AND EDIBLE PRODUCTS THEREOF Supervision of Marking and Packaging § 354.72 Packaging. No container which bears or may bear any official identification or any...

  14. 49 CFR 172.514 - Bulk packagings.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 49 Transportation 2 2014-10-01 2014-10-01 false Bulk packagings. 172.514 Section 172.514... SECURITY PLANS Placarding § 172.514 Bulk packagings. (a) Except as provided in paragraph (c) of this section, each person who offers for transportation a bulk packaging which contains a hazardous...

  15. EDExpress Packaging Training, 2001-2002.

    ERIC Educational Resources Information Center

    Office of Student Financial Assistance (ED), Washington, DC.

    Packaging is the process of finding the best combination of aid to meet a student's financial need for college, given limited resources and the institutional constraints that vary from school to school. This guide to packaging under the EDExpress software system outlines three steps to packaging. The first is determining the student's need for…

  16. 49 CFR 172.514 - Bulk packagings.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 49 Transportation 2 2013-10-01 2013-10-01 false Bulk packagings. 172.514 Section 172.514... SECURITY PLANS Placarding § 172.514 Bulk packagings. (a) Except as provided in paragraph (c) of this section, each person who offers for transportation a bulk packaging which contains a hazardous...

  17. 49 CFR 172.514 - Bulk packagings.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 49 Transportation 2 2012-10-01 2012-10-01 false Bulk packagings. 172.514 Section 172.514... SECURITY PLANS Placarding § 172.514 Bulk packagings. (a) Except as provided in paragraph (c) of this section, each person who offers for transportation a bulk packaging which contains a hazardous...

  18. 7 CFR 58.640 - Packaging.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 7 Agriculture 3 2013-01-01 2013-01-01 false Packaging. 58.640 Section 58.640 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... Procedures § 58.640 Packaging. The packaging of the semifrozen product shall be done by means which will...

  19. 7 CFR 58.640 - Packaging.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 7 Agriculture 3 2012-01-01 2012-01-01 false Packaging. 58.640 Section 58.640 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... Procedures § 58.640 Packaging. The packaging of the semifrozen product shall be done by means which will...

  20. 9 CFR 354.72 - Packaging.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 9 Animals and Animal Products 2 2012-01-01 2012-01-01 false Packaging. 354.72 Section 354.72... CERTIFICATION VOLUNTARY INSPECTION OF RABBITS AND EDIBLE PRODUCTS THEREOF Supervision of Marking and Packaging § 354.72 Packaging. No container which bears or may bear any official identification or any...

  1. 9 CFR 354.72 - Packaging.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 9 Animals and Animal Products 2 2013-01-01 2013-01-01 false Packaging. 354.72 Section 354.72... CERTIFICATION VOLUNTARY INSPECTION OF RABBITS AND EDIBLE PRODUCTS THEREOF Supervision of Marking and Packaging § 354.72 Packaging. No container which bears or may bear any official identification or any...

  2. 7 CFR 58.640 - Packaging.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 7 Agriculture 3 2014-01-01 2014-01-01 false Packaging. 58.640 Section 58.640 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... Procedures § 58.640 Packaging. The packaging of the semifrozen product shall be done by means which will...

  3. 7 CFR 1944.73 - Package submission.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 13 2011-01-01 2009-01-01 true Package submission. 1944.73 Section 1944.73 Agriculture Regulations of the Department of Agriculture (Continued) RURAL HOUSING SERVICE, RURAL BUSINESS...) PROGRAM REGULATIONS (CONTINUED) HOUSING Housing Application Packaging Grants § 1944.73 Package...

  4. 7 CFR 1944.73 - Package submission.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 7 Agriculture 13 2012-01-01 2012-01-01 false Package submission. 1944.73 Section 1944.73 Agriculture Regulations of the Department of Agriculture (Continued) RURAL HOUSING SERVICE, RURAL BUSINESS...) PROGRAM REGULATIONS (CONTINUED) HOUSING Housing Application Packaging Grants § 1944.73 Package...

  5. 7 CFR 1944.73 - Package submission.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 7 Agriculture 13 2014-01-01 2013-01-01 true Package submission. 1944.73 Section 1944.73 Agriculture Regulations of the Department of Agriculture (Continued) RURAL HOUSING SERVICE, RURAL BUSINESS...) PROGRAM REGULATIONS (CONTINUED) HOUSING Housing Application Packaging Grants § 1944.73 Package...

  6. 7 CFR 1944.73 - Package submission.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 13 2010-01-01 2009-01-01 true Package submission. 1944.73 Section 1944.73 Agriculture Regulations of the Department of Agriculture (Continued) RURAL HOUSING SERVICE, RURAL BUSINESS...) PROGRAM REGULATIONS (CONTINUED) HOUSING Housing Application Packaging Grants § 1944.73 Package...

  7. 7 CFR 58.640 - Packaging.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Packaging. 58.640 Section 58.640 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... Procedures § 58.640 Packaging. The packaging of the semifrozen product shall be done by means which will...

  8. 9 CFR 354.72 - Packaging.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Packaging. 354.72 Section 354.72... CERTIFICATION VOLUNTARY INSPECTION OF RABBITS AND EDIBLE PRODUCTS THEREOF Supervision of Marking and Packaging § 354.72 Packaging. No container which bears or may bear any official identification or any...

  9. 49 CFR 172.514 - Bulk packagings.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Bulk packagings. 172.514 Section 172.514... SECURITY PLANS Placarding § 172.514 Bulk packagings. (a) Except as provided in paragraph (c) of this section, each person who offers for transportation a bulk packaging which contains a hazardous...

  10. 27 CFR 6.93 - Combination packaging.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2010-04-01 2010-04-01 false Combination packaging. 6..., DEPARTMENT OF THE TREASURY LIQUORS âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and distributing distilled spirits, wine, or malt beverages in...

  11. 21 CFR 820.130 - Device packaging.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 8 2014-04-01 2014-04-01 false Device packaging. 820.130 Section 820.130 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) MEDICAL DEVICES QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each...

  12. 16 CFR 1702.12 - Packaging specifications.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 16 Commercial Practices 2 2014-01-01 2014-01-01 false Packaging specifications. 1702.12 Section 1702.12 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS PETITIONS FOR EXEMPTIONS FROM POISON PREVENTION PACKAGING ACT REQUIREMENTS; PETITION...

  13. 16 CFR 1702.12 - Packaging specifications.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 16 Commercial Practices 2 2013-01-01 2013-01-01 false Packaging specifications. 1702.12 Section 1702.12 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS PETITIONS FOR EXEMPTIONS FROM POISON PREVENTION PACKAGING ACT REQUIREMENTS; PETITION...

  14. 16 CFR 1702.12 - Packaging specifications.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 16 Commercial Practices 2 2012-01-01 2012-01-01 false Packaging specifications. 1702.12 Section 1702.12 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS PETITIONS FOR EXEMPTIONS FROM POISON PREVENTION PACKAGING ACT REQUIREMENTS; PETITION...

  15. 16 CFR 1702.12 - Packaging specifications.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 16 Commercial Practices 2 2011-01-01 2011-01-01 false Packaging specifications. 1702.12 Section 1702.12 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS PETITIONS FOR EXEMPTIONS FROM POISON PREVENTION PACKAGING ACT REQUIREMENTS; PETITION...

  16. 16 CFR 1702.12 - Packaging specifications.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 16 Commercial Practices 2 2010-01-01 2010-01-01 false Packaging specifications. 1702.12 Section 1702.12 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS PETITIONS FOR EXEMPTIONS FROM POISON PREVENTION PACKAGING ACT REQUIREMENTS; PETITION...

  17. Chip Scale Package Implementation Challenges

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    1998-01-01

    The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. In the process of building the Consortium CSP test vehicles, many challenges were identified regarding various aspects of technology implementation. This paper will present our experience in the areas of technology implementation challenges, including design and building both standard and microvia boards, and assembly of two types of test vehicles. We also discuss the most current package isothermal aging to 2,000 hours at 100 C and 125 C and thermal cycling test results to 1,700 cycles in the range of -30 to 100 C.

  18. 49 CFR 178.602 - Preparation of packagings and packages for testing.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... packages for testing. (a) Except as otherwise provided in this subchapter, each packaging and package must... testing at periodic intervals only (i.e., other than initial design qualification testing), at ambient conditions. (e) Except as otherwise provided, each packaging must be closed in preparation for testing in...

  19. Microwave thawing package and method

    DOEpatents

    Fathi, Zakaryae; Lauf, Robert J.

    2004-03-16

    A package for containing frozen liquids during an electromagnetic thawing process includes: a first section adapted for containing a frozen material and exposing the frozen material to electromagnetic energy; a second section adapted for receiving thawed liquid material and shielding the thawed liquid material from further exposure to electromagnetic energy; and a fluid communication means for allowing fluid flow between the first section and the second section.

  20. Transportation and packaging resource guide

    SciTech Connect

    Arendt, J.W.; Gove, R.M.; Welch, M.J.

    1994-12-01

    The purpose of this resource guide is to provide a convenient reference document of information that may be useful to the U.S. Department of Energy (DOE) and DOE contractor personnel involved in packaging and transportation activities. An attempt has been made to present the terminology of DOE community usage as it currently exists. DOE`s mission is changing with emphasis on environmental cleanup. The terminology or nomenclature that has resulted from this expanded mission is included for the packaging and transportation user for reference purposes. Older terms still in use during the transition have been maintained. The Packaging and Transportation Resource Guide consists of four sections: Sect. 1, Introduction; Sect. 2, Abbreviations and Acronyms; Sect. 3, Definitions; and Sect. 4, References for packaging and transportation of hazardous materials and related activities, and Appendices A and B. Information has been collected from DOE Orders and DOE documents; U.S Department of Transportation (DOT), U.S. Environmental Protection Agency (EPA), and U.S. Nuclear Regulatory Commission (NRC) regulations; and International Atomic Energy Agency (IAEA) standards and other international documents. The definitions included in this guide may not always be a regulatory definition but are the more common DOE usage. In addition, the definitions vary among regulatory agencies. It is, therefore, suggested that if a definition is to be used in a regulatory or a legal compliance issue, the definition should be verified with the appropriate regulation. To assist in locating definitions in the regulations, a listing of all definition sections in the regulations are included in Appendix B. In many instances, the appropriate regulatory reference is indicated in the right-hand margin.

  1. High density modular avionics packaging

    NASA Astrophysics Data System (ADS)

    Poradish, F.

    Requirements and design configurations for high density modular avionics packaging are examined, with particular attention given to new hardware trends, the design of high-density standard modules (HDSM's), and HDSM requirements. The discussion of the HDSM's covers thermal management, system testability, power supply, and performance specifications. The general design of an integrated HDSM demonstration system currently under construction is briefly described, and some test data are presented.

  2. The bacteriophage DNA packaging machine.

    PubMed

    Feiss, Michael; Rao, Venigalla B

    2012-01-01

    Large dsDNA bacteriophages and herpesviruses encode a powerful ATP-driven DNA-translocating machine that encapsidates a viral genome into a preformed capsid shell or prohead. The key components of the packaging machine are the packaging enzyme (terminase, motor) and the portal protein that forms the unique DNA entrance vertex of prohead. The terminase complex, comprised of a recognition subunit (small terminase) and an endonuclease/translocase subunit (large terminase), cuts viral genome concatemers. The terminase-viral DNA complex docks on the portal vertex, assembling a motor complex containing five large terminase subunits. The pentameric motor processively translocates DNA until the head shell is full with one viral genome. The motor cuts the DNA again and dissociates from the full head, allowing head-finishing proteins to assemble on the portal, sealing the portal, and constructing a platform for tail attachment. A body of evidence from molecular genetics and biochemical, structural, and biophysical approaches suggests that ATP hydrolysis-driven conformational changes in the packaging motor (large terminase) power DNA motion. Various parts of the motor subunit, such as the ATPase, arginine finger, transmission domain, hinge, and DNA groove, work in concert to translocate about 2 bp of DNA per ATP hydrolyzed. Powerful single-molecule approaches are providing precise delineation of steps during each translocation event in a motor that has a speed as high as a millisecond/step. The phage packaging machine has emerged as an excellent model for understanding the molecular machines, given the mechanistic parallels between terminases, helicases, and numerous motor proteins. PMID:22297528

  3. "Programmed packaging" for gene delivery.

    PubMed

    Hyodo, M; Sakurai, Y; Akita, H; Harashima, H

    2014-11-10

    We report on the development of a multifunctional envelope-type nano device (MEND) based on our packaging concept "Programmed packaging" to control not only intracellular trafficking but also the biodistribution of encapsulated compounds such as nucleic acids/proteins/peptides. Our strategy for achieving this is based on molecular mechanisms of cell biology such as endocytosis, vesicular trafficking, etc. In this review, we summarize the concept of programmed packaging and discuss some of our recent successful examples of using MENDs. Systematic evolution of ligands by exponential enrichment (SELEX) was applied as a new methodology for identifying a new ligand toward cell or mitochondria. The delivery of siRNA to tumors and the tumor vasculature was achieved using pH sensitive lipid (YSK05), which was newly designed and optimized under in vivo conditions. The efficient delivery of pDNA to immune cells such as dendritic cells has also been developed using the KALA ligand, which can be a breakthrough technology for DNA vaccine. Finally, ss-cleavable and pH-activated lipid-like surfactant (ssPalm) which is a lipid like material with pH-activatable and SS-cleavable properties is also introduced as a proof of our concept. PMID:24780263

  4. Waste Package Design Methodology Report

    SciTech Connect

    D.A. Brownson

    2001-09-28

    The objective of this report is to describe the analytical methods and processes used by the Waste Package Design Section to establish the integrity of the various waste package designs, the emplacement pallet, and the drip shield. The scope of this report shall be the methodology used in criticality, risk-informed, shielding, source term, structural, and thermal analyses. The basic features and appropriateness of the methods are illustrated, and the processes are defined whereby input values and assumptions flow through the application of those methods to obtain designs that ensure defense-in-depth as well as satisfy requirements on system performance. Such requirements include those imposed by federal regulation, from both the U.S. Department of Energy (DOE) and U.S. Nuclear Regulatory Commission (NRC), and those imposed by the Yucca Mountain Project to meet repository performance goals. The report is to be used, in part, to describe the waste package design methods and techniques to be used for producing input to the License Application Report.

  5. [Organoleptic analysis of food packaging].

    PubMed

    Stelmach, Agnieszka; Cwiek-Ludwicka, Kazimiera

    2006-01-01

    The basic rules for the organoleptic analysis of food contact materials and food packaging and the criteria of their assessment was presented. According to the EU legislation food contact materials can not release their constituents into the food in quantities that can be harmful for the consumers and/or can change the organoleptic characteristics of food. Conformity of food contact materials and food packaging with the regulation for overall and specific migration and organoleptic characteristics should be shown by their performance in relevant tests. The standardised method for the organoleptic analysis of the food contact materials does not exist in the UE. Member States use the own methods published as national standards. For sensory analysis of foreign taste and odour Poland uses the triangle method according to Polish Standard PN-87/O-79114. Some countries use Robinson test according to German Standard DIN 10955. These two tests are basing on the same principle. Food contact materials and food packaging, which give negative results in sensory analysis can not be used in direct contact with food, even though all testing parameters in overall and specific migration were fulfil the requirements for the permissible limits. PMID:17713198

  6. Package security recorder of vibration

    NASA Astrophysics Data System (ADS)

    Wang, Xiao-na; Hu, Jin-liang; Song, Shi-de

    2013-08-01

    This paper introduces a new kind of electronic product — Package Security Recorder of Vibration. It utilizes STC89C54RD+ LQFP-44 MCU as its main controller. At the same time, it also utilizes Freescale MMA845A 3-Axis 8-bit/12-bit Digital Accelerometer and Maxim DS1302 Trickle Charge Timekeeping Chip. It utilizes the MCU to read the value of the accelerometer and the value of the timekeeping chip, and records the data into the inner E2PROM of MCU. The whole device achieves measuring, reading and recording the time of the vibration and the intensity of the vibration. When we need the data, we can read them out. The data can be used in analyzing the condition of the cargo when it transported. The device can be applied to monitor the security of package. It solves the problem of responsibility affirming, when the valuable cargo are damaged while it transported. It offers powerful safeguard for the package. It's very value for application.

  7. Active packaging with antifungal activities.

    PubMed

    Nguyen Van Long, N; Joly, Catherine; Dantigny, Philippe

    2016-03-01

    There have been many reviews concerned with antimicrobial food packaging, and with the use of antifungal compounds, but none provided an exhaustive picture of the applications of active packaging to control fungal spoilage. Very recently, many studies have been done in these fields, therefore it is timely to review this topic. This article examines the effects of essential oils, preservatives, natural products, chemical fungicides, nanoparticles coated to different films, and chitosan in vitro on the growth of moulds, but also in vivo on the mould free shelf-life of bread, cheese, and fresh fruits and vegetables. A short section is also dedicated to yeasts. All the applications are described from a microbiological point of view, and these were sorted depending on the name of the species. Methods and results obtained are discussed. Essential oils and preservatives were ranked by increased efficacy on mould growth. For all the tested molecules, Penicillium species were shown more sensitive than Aspergillus species. However, comparison between the results was difficult because it appeared that the efficiency of active packaging depended greatly on the environmental factors of food such as water activity, pH, temperature, NaCl concentration, the nature, the size, and the mode of application of the films, in addition to the fact that the amount of released antifungal compounds was not constant with time. PMID:26803804

  8. Auxiliary propulsion system flight package

    NASA Technical Reports Server (NTRS)

    Collett, C. R.

    1987-01-01

    Hughes Aircraft Company developed qualified and integrated flight, a flight test Ion Auxiliary Propulsion System (IAPS), on an Air Force technology satellite. The IAPS Flight Package consists of two identical Thruster Subsystems and a Diagnostic Subsystem. Each thruster subsystem (TSS) is comprised of an 8-cm ion Thruster-Gimbal-Beam Shield Unit (TGBSU); Power Electronics Unit; Digital Controller and Interface Unit (DCIU); and Propellant Tank, Valve and Feed Unit (PTVFU) plus the requisite cables. The Diagnostic Subsystem (DSS) includes four types of sensors for measuring the effect of the ion thrusters on the spacecraft and the surrounding plasma. Flight qualifications of IAPS, prior to installation on the spacecraft, consisted of performance, vibration and thermal-vacuum testing at the unit level, and thermal-vacuum testing at the subsystem level. Mutual compatibility between IAPS and the host spacecraft was demonstrated during a series of performance and environmental tests after the IAPS Flight Package was installed on the spacecraft. After a spacecraft acoustic test, performance of the ion thrusters was reverified by removing the TGBSUs for a thorough performance test at Hughes Research Laboratories (HRL). The TGBSUs were then reinstalled on the spacecraft. The IAPS Flight Package is ready for flight testing when Shuttle flights are resumed.

  9. The Model 9977 Radioactive Material Packaging Primer

    SciTech Connect

    Abramczyk, G.

    2015-10-09

    The Model 9977 Packaging is a single containment drum style radioactive material (RAM) shipping container designed, tested and analyzed to meet the performance requirements of Title 10 the Code of Federal Regulations Part 71. A radioactive material shipping package, in combination with its contents, must perform three functions (please note that the performance criteria specified in the Code of Federal Regulations have alternate limits for normal operations and after accident conditions): Containment, the package must “contain” the radioactive material within it; Shielding, the packaging must limit its users and the public to radiation doses within specified limits; and Subcriticality, the package must maintain its radioactive material as subcritical

  10. RECLAMATION OF RADIOACTIVE MATERIAL PACKAGING COMPONENTS

    SciTech Connect

    Abramczyk, G.; Nathan, S.; Loftin, B.; Bellamy, S.

    2011-06-06

    Radioactive material packages are withdrawn from use for various reasons; loss of mission, decertification, damage, replacement, etc. While the packages themselves may be decertified, various components may still be able to perform to their required standards and find useful service. The Packaging Technology and Pressurized Systems group of the Savannah River National Laboratory has been reducing the cost of producing new Type B Packagings by reclaiming, refurbishing, and returning to service the containment vessels from older decertified packagings. The program and its benefits are presented.

  11. ARPREC: An arbitrary precision computation package

    SciTech Connect

    Bailey, David H.; Yozo, Hida; Li, Xiaoye S.; Thompson, Brandon

    2002-09-01

    This paper describes a new software package for performing arithmetic with an arbitrarily high level of numeric precision. It is based on the earlier MPFUN package, enhanced with special IEEE floating-point numerical techniques and several new functions. This package is written in C++ code for high performance and broad portability and includes both C++ and Fortran-90 translation modules, so that conventional C++ and Fortran-90 programs can utilize the package with only very minor changes. This paper includes a survey of some of the interesting applications of this package and its predecessors.

  12. Challenges in the Packaging of MEMS

    SciTech Connect

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O'Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  13. Automated visual inspection stations for next-generation semiconductor package quality control

    NASA Astrophysics Data System (ADS)

    DeYong, Mark R.; Eskridge, Thomas C.; Grace, John W.; Newberry, Jeff E.; Jones, J. H.; Hart, B. E.

    1996-09-01

    In the last several years, the semiconductor industry has come to the realization that the package into which a die is placed is at least as critical to the performance of the complete electronic system as the die itself. This realization has led to an explosive effort across the entire industry to advance the state-of-the-art in semiconductor packaging. To date, this effort has already produced semiconductor packaging options on the scale of the die (i.e., chip scale packaging -- CSP). While CSPs and other advanced packaging techniques provide improved electronic system performance, they also increase the quality control burden (despite the highly automated processes used to manufacture the packages, quality control remains, for the most part, a manual operation). This paper addresses the necessary requirements of automated visual inspection (AVI) for quality control of current and future semiconductor packaging. The necessary requirements of the station are subdivided into two categories: those pertaining to the hardware platform, and those pertaining to the software reasoning engine. Hardware requirements are discussed in terms of finding the best match between commercial, off-the- shelf, hardware components and a given inspection application. Components reviewed include: imagers, optics, illumination systems, auto-focus/alignment systems, material handlers, parallel image preprocessors, and host computers. Applications reviewed include: pin grid array (PGA), ball grid array (BGA), and flip-chip package inspection. Also discussed in the hardware section are options that may be used when commercial components are not adequate. Software requirements are discussed in terms of the functionality required to provide accurate, real-time characterization of package quality, to gain operator acceptance, and to produce meaningful statistics for use in process control.

  14. UWV (Unmanned Water Vehicle) - Umbra Package v. 1.0

    2012-09-13

    This package contains modules that model the mobility of systems moving in the water. This package currently models first order physics -basically a velocity integrator. This package depends on interface classes (typically base classes) that reside in the Mobility package.

  15. Lunar Dust Analysis Package - LDAP

    NASA Astrophysics Data System (ADS)

    Chalkley, S. A.; Richter, L.; Goepel, M.; Sovago, M.; Pike, W. T.; Yang, S.; Rodenburg, J.; Claus, D.

    2012-09-01

    The Lunar Dust Analysis package (L-DAP) is a suite of payloads which have been designed to operate in synergy with each other at the Lunar Surface. The benefits of combining these payloads in a single package allow very precise measurements of a particular regolith sample. At the same time the integration allows mass savings since common resources are shared and this also means that interfaces with the Lander are simplified significantly leading to benefits of integration and development of the overall mission. Lunar Dust represents a real hazard for lunar exploration due to its invasive, fine microscopic structure and toxic properties. However it is also valuable resource which could be exploited for future exploration if the characteristics and chemical composition is well known. Scientifically, the regolith provides an insight into the moon formation process and there are areas on the Moon which have never been ex-plored before. For example the Lunar South Pole Aitken Basin is the oldest and largest on the moon, providing excavated deep crust which has not been found on the previous lunar landing missions. The SEA-led team has been designing a compact package, known as LDAP, which will provide key data on the lunar dust properties. The intention is for this package to be part of the payload suite deployed on the ESA Lunar Lander Mission in 2018. The LDAP has a centralised power and data electronics, including front end electronics for the detectors as well as sample handling subsystem for the following set of internal instruments : • Optical Microscope - with a 1μm resolution to provide context of the regolith samples • Raman and LIBS spectrographic instrumentation providing quantification of mineral and elemental composition information of the soil at close to grain scale. This includes the capability to detect (and measure abundance of) crystalline and adsorbed volatile phases, from their Raman signature. The LIBS equipment will also allow chemical

  16. EXAMINATION OF SHIPPING PACKAGE 9975-05050

    SciTech Connect

    Daugherty, W.

    2014-11-06

    Shipping package 9975-05050 was examined in K-Area following its identification as a high wattage package. Elevated temperature and fiberboard moisture content are key parameters that impact the degradation rate of fiberboard within 9975 packages in a storage environment. The high wattage of this package contributes significantly to component temperatures. After examination in K-Area, the package was provided to SRNL for further examination of the fiberboard assembly. The moisture content of the fiberboard was relatively low (compared to packages examined previously), but the moisture gradient (between fiberboard ID and OD surfaces) was relatively high, as would be expected for the high heat load. The cane fiberboard appeared intact and displayed no apparent change in integrity relative to a new package.

  17. 8. Drawing,front elevation, published in 'The New York Architect', Vol. ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    8. Drawing,front elevation, published in 'The New York Architect', Vol. 3,October 1909,page unknown,courtesy of the Art Institute of Chicago - Chicago City Hall, 121 North LaSalle Street, Chicago, Cook County, IL

  18. 49 CFR 178.905 - Large Packaging identification codes.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 3 2011-10-01 2011-10-01 false Large Packaging identification codes. 178.905... PACKAGINGS Large Packagings Standards § 178.905 Large Packaging identification codes. Large packaging code... letter(s) specified in paragraph (b) of this section. (a) Large packaging code number designations are...

  19. 49 CFR 178.935 - Standards for wooden Large Packagings.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 3 2011-10-01 2011-10-01 false Standards for wooden Large Packagings. 178.935... PACKAGINGS Large Packagings Standards § 178.935 Standards for wooden Large Packagings. (a) The provisions in this section apply to wooden Large Packagings intended to contain solids. Wooden Large Packaging...

  20. 49 CFR 178.905 - Large Packaging identification codes.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 49 Transportation 3 2012-10-01 2012-10-01 false Large Packaging identification codes. 178.905... PACKAGINGS Large Packagings Standards § 178.905 Large Packaging identification codes. Large packaging code... letter(s) specified in paragraph (b) of this section. (a) Large packaging code number designations are...

  1. 49 CFR 178.905 - Large Packaging identification codes.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 49 Transportation 3 2013-10-01 2013-10-01 false Large Packaging identification codes. 178.905... PACKAGINGS Large Packagings Standards § 178.905 Large Packaging identification codes. Large packaging code... letter(s) specified in paragraph (b) of this section. (a) Large packaging code number designations are...

  2. 49 CFR 178.905 - Large Packaging identification codes.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 49 Transportation 3 2014-10-01 2014-10-01 false Large Packaging identification codes. 178.905... PACKAGINGS Large Packagings Standards § 178.905 Large Packaging identification codes. Large packaging code... letter(s) specified in paragraph (b) of this section. (a) Large packaging code number designations are...

  3. PORTABLE ACOUSTIC MONITORING PACKAGE (PAMP)

    SciTech Connect

    John l. Loth; Gary J. Morris; George M. Palmer; Richard Guiler; Deepak Mehra

    2003-07-01

    The 1st generation acoustic monitoring package was designed to detect and analyze weak acoustic signals inside natural gas transmission lines. Besides a microphone it housed a three-inch diameter aerodynamic acoustic signal amplifier to maximize sensitivity to leak induced {Delta}p type signals. The theory and test results of this aerodynamic signal amplifier was described in the master's degree thesis of our Research Assistant Deepak Mehra who is about to graduate. To house such a large three-inch diameter sensor required the use of a steel 300-psi rated 4 inch weld neck flange, which itself weighed already 29 pounds. The completed 1st generation Acoustic Monitoring Package weighed almost 100 pounds. This was too cumbersome to mount in the field, on an access port at a pipeline shut-off valve. Therefore a 2nd generation and truly Portable Acoustic Monitor was built. It incorporated a fully self-contained {Delta}p type signal sensor, rated for line pressures up to 1000 psi with a base weight of only 6 pounds. This is the Rosemont Inc. Model 3051CD-Range 0, software driven sensor, which is believed to have industries best total performance. Its most sensitive unit was purchased with a {Delta}p range from 0 to 3 inch water. This resulted in the herein described 2nd generation: Portable Acoustic Monitoring Package (PAMP) for pipelines up to 1000 psi. Its 32-pound total weight includes an 18-volt battery. Together with a 3 pound laptop with its 4-channel data acquisition card, completes the equipment needed for field acoustic monitoring of natural gas transmission pipelines.

  4. Block LancZos PACKage

    2005-05-01

    BLZPACK (for Block LancZos PACKage) is a standard Fortran 77 implementation of the block Lanczos algorithm intended for the solution of the standard eigenvalue problem Ax=ux or the generalized eigenvalue problem Ax=uBx, where A and B are real, sparse symmetric matrices, u and eigenvalue and x and eigenvector. The development of this eigensolver was motivated by the need to solve large, sparse, generalized problems from free vibration analyses in structural engineering. Several upgrades were performedmore » afterwards aiming at the solution of eigenvalues problems from a wider range of applications.« less

  5. Tempo2: Pulsar Timing Package

    NASA Astrophysics Data System (ADS)

    Hobbs, George; Edwards, Russell

    2012-10-01

    Tempo2 is a pulsar timing package developed to be used both for general pulsar timing applications and also for pulsar timing array research in which data-sets from multiple pulsars need to be processed simultaneously. It was initially developed by George Hobbs and Russell Edwards as part of the Parkes Pulsar Timing Array project. Tempo2 is based on the original Tempo (ascl:1509.002) code and can be used (from the command-line) in a similar fashion. It is very versatile and can be extended by plugins.

  6. Biopolymer-based antimicrobial packaging: a review.

    PubMed

    Cha, Dong Su; Chinnan, Manjeet S

    2004-01-01

    The term antimicrobialpackaging encompasses any packaging technique(s) used to control microbial growth in a food product. These include packaging materials and edible films and coatings that contain antimicrobial agents and also techniques that modify the atmosphere within the package. In recent years, antimicrobial packaging has attracted much attention from the food industry because of the increase in consumer demand for minimally processed, preservative-free products. Reflecting this demand, the preservative agents must be applied to packaging in such away that only low levels of preservatives come into contact with the food. The film or coating technique is considered to be more effective, although more complicated to apply. New antimicrobial packaging materials are continually being developed. Many of them exploit natural agents to control common food-borne microorganisms. Current trends suggest that, in due course, packaging will generally incorporate antimicrobial agents, and the sealing systems will continue to improve. The focus of packaging in the past has been on the appearance, size, and integrity of the package. A greater emphasis on safety features associated with the addition of antimicrobial agents is perhaps the next area for development in packaging technology. PMID:15462127

  7. MMIC Package for Millimeter Wave Frequency

    NASA Technical Reports Server (NTRS)

    Bharj, Sarjit Singh; Yuan, Steve

    1997-01-01

    Princeton Microwave Technology has successfully demonstrated the transfer of technology for the MMIC package. During this contract the package design was licensed from Hughes Aircraft Company for manufacture within the U.S. A major effort was directed towards characterization of the ceramic material for its dielectric constant and loss tangent properties. After selection of a ceramic tape, the high temperature co-fired ceramic package was manufactured in the U.S. by Microcircuit Packaging of America, Inc. Microwave measurements of the MMIC package were conducted by an intercontinental microwave test fixture. The package demonstrated a typical insertion loss of 0.5 dB per transition up to 32 Ghz and a return loss of better than 15 db. The performance of the package has been demonstrated from 2 to 30 Ghz by assembling three different MMIC amplifiers. Two of the MMIC amplifiers were designed for the 26 Ghz to 30 Ghz operation while the third MMIC was a distributed amplifier from 2 to 26.5 Ghz. The measured gain of the amplifier is consistent with the device data. The package costs are substantially lower than comparable packages available commercially. Typically the price difference is greater than a factor of three. The package cost is well under $5.00 for a quantity of 10,000 pieces.

  8. Challenges in the Packaging of MEMS

    SciTech Connect

    BROWN, WILLIAM D.; EATON, WILLIAM P.; MALSHE, AJAY P.; MILLER, WILLIAM M.; O'NEAL, CHAD; SINGH, SUSHILA B.

    1999-09-24

    Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of functional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and to expose these issues to new audiences from the integrated circuit packaging community.

  9. Microcomputer statistics packages for biomedical scientists.

    PubMed

    Ludbrook, J

    1995-12-01

    1. There are hundreds of commercially available microcomputer statistics packages, ranging from the very cheap and elementary to the very expensive and complex, and from the very general to the very specialized. This review covers only those that appear to be popular with biomedical investigators who deal with fairly small sets of data but may wish to use relatively complex analytical techniques. 2. It is highly desirable, if not essential, that biomedical investigators who use microcomputer statistics packages have access to a spreadsheet program. These provide sample statistics and simple statistical analyses but, more importantly, they are often the best way of entering data into the files of the statistics packages proper. 3. A vital component of any statistics package is its manual. This should be easy to follow, but at the same time it must provide full documentation of, and references to, precisely how the various statistical tests are performed. 4. Some packages are elementary and offer only a narrow range of test procedures (mini-packages). Some are designed to be used as statistical libraries and programming tools for professional statisticians. Between these extremes are the general purpose packages (mid-range, maxi- and supermaxi-packages) that constitute the main body of this review. 5. All the packages reviewed have some shortcomings or flaws. It is argued that the ideal package for biomedical investigators should have the following features: (i) it should provide a wide range of test procedures for analysing continuous, rank-ordered, and categorical data; (ii) the way in which these tests are carried out should be clearly stated in the manual; and (iii) lastly, although not unimportantly, the package should be easy to use. 6. It is recommended that biomedical investigators purchase a package that provides many more statistical routines than they use in their everyday practice. Provided the manual is a good one and the package itself has no serious

  10. Natural biopolimers in organic food packaging

    NASA Astrophysics Data System (ADS)

    Wieczynska, Justyna; Cavoski, Ivana; Chami, Ziad Al; Mondelli, Donato; Di Donato, Paola; Di Terlizzi, Biagio

    2014-05-01

    Concerns on environmental and waste problems caused by use of non-biodegradable and non-renewable based plastic packaging have caused an increase interest in developing biodegradable packaging using renewable natural biopolymers. Recently, different types of biopolymers like starch, cellulose, chitosan, casein, whey protein, collagen, egg white, soybean protein, corn zein, gelatin and wheat gluten have attracted considerable attention as potential food packaging materials. Recyclable or biodegradable packaging material in organic processing standards is preferable where possible but specific principles of packaging are not precisely defined and standards have to be assessed. There is evidence that consumers of organic products have specific expectations not only with respect to quality characteristics of processed food but also in social and environmental aspects of food production. Growing consumer sophistication is leading to a proliferation in food eco-label like carbon footprint. Biopolymers based packaging for organic products can help to create a green industry. Moreover, biopolymers can be appropriate materials for the development of an active surfaces designed to deliver incorporated natural antimicrobials into environment surrounding packaged food. Active packaging is an innovative mode of packaging in which the product and the environment interact to prolong shelf life or enhance safety or sensory properties, while maintaining the quality of the product. The work will discuss the various techniques that have been used for development of an active antimicrobial biodegradable packaging materials focusing on a recent findings in research studies. With the current focus on exploring a new generation of biopolymer-based food packaging materials with possible applications in organic food packaging. Keywords: organic food, active packaging, biopolymers , green technology

  11. Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices

    NASA Astrophysics Data System (ADS)

    Marinov, Val R.; Swenson, Orven; Atanasov, Yuriy; Schneck, Nathan

    2013-03-01

    Ultrathin flip-chip semiconductor die packaging on paper substrates is an enabling technology for a variety of extremely low-cost electronic devices with huge market potential such as RFID smart forms, smart labels, smart tickets, banknotes, security documents, etc. Highly flexible and imperceptible dice are possible only at a thickness of less than 50 μm, preferably down to 10-20 μm or less. Several cents per die cost is achievable only if the die size is <= 500 μm/side. Such ultrathin, ultra-small dice provide the flexibility and low cost required, but no conventional technology today can package such die onto a flexible substrate at low cost and high rate. The laser-enabled advanced packaging (LEAP) technology has been developed at the Center for Nanoscale Science and Engineering, North Dakota State University in Fargo, North Dakota, to accomplish this objective. Presented are results using LEAP to assemble dice with various thicknesses, including 350 μm/side dice as thin as 20 μm and less. To the best of our knowledge, this is the first report of using a laser to package conventional silicon dice with such small size and thickness. LEAP-packaged RFID-enabled paper for financial and security applications is also demonstrated. The cost of packaging using LEAP is lower compared to the conventional pick-and-place methods while the rate of packaging is much higher and independent of the die size.

  12. Software package SIMPRE--revisited.

    PubMed

    Karbowiak, Mirosław; Rudowicz, Czesław

    2014-10-01

    This article elucidates the pitfalls identified in the software package SIMPRE recently developed by Baldoví et al. (J. Comput. Chem. 2013, 34, 1961) for modeling the spectroscopic and magnetic properties of single ion magnets as well as single-molecule magnets. Analysis of the methodology used therein reveals that the crystal field parameters (CFPs), expressed nominally in the Stevens formalism, exhibit features characteristic for the CFPs expressed in the Wybourne notation. The resemblance of the two types of CFPs introduces a serious confusion that may lead to wrong comparisons of the CFPs taken from various sources. To clarify this confusion, the properties of the CFPs Bkq ( Akq, Ckq) associated with the Stevens operators Okq(X = S, J, or L), which belong to the class of the tesseral-tensor operators, are contrasted with those of the CFPs Bkq associated with the Wybourne operators Cq(k), which belong to the class of the spherical-tensor operators. Importantly, the confused properties of Stevens and Wybourne operators may bear on reliability of SIMPRE calculations. To consider this question independent calculations are carried out using the complete approach and compared with those of the restricted approach utilized earlier. It appears that the numerical results of the package SIMPRE are formally acceptable, however, the meaning of the CFPs must be properly reformulated. Several other conceptual problems arising from misinterpretations of the crucial notions and the CFP notations identified therein are also discussed and clarified. PMID:25082729

  13. WASTE PACKAGE DESIGN SENSITIVITY REPORT

    SciTech Connect

    P. Mecharet

    2001-03-09

    The purpose of this technical report is to present the current designs for waste packages and determine which designs will be evaluated for the Site Recommendation (SR) or Licence Application (LA), to demonstrate how the design will be shown to comply with the applicable design criteria. The evaluations to support SR or LA are based on system description document criteria. The objective is to determine those system description document criteria for which compliance is to be demonstrated for SR; and, having identified the criteria, to refer to the documents that show compliance. In addition, those system description document criteria for which compliance will be addressed for LA are identified, with a distinction made between two steps of the LA process: the LA-Construction Authorization (LA-CA) phase on one hand, and the LA-Receive and Possess (LA-R&P) phase on the other hand. The scope of this work encompasses the Waste Package Project disciplines for criticality, shielding, structural, and thermal analysis.

  14. Lessons learned during Type A Packaging testing

    SciTech Connect

    O`Brien, J.H.; Kelly, D.L.

    1995-11-01

    For the past 6 years, the US Department of Energy (DOE) Office of Facility Safety Analysis (EH-32) has contracted Westinghouse Hanford Company (WHC) to conduct compliance testing on DOE Type A packagings. The packagings are tested for compliance with the U.S. Department of Transportation (DOT) Specification 7A, general packaging, Type A requirements. The DOE has shared the Type A packaging information throughout the nuclear materials transportation community. During testing, there have been recurring areas of packaging design that resulted in testing delays and/or initial failure. The lessons learned during the testing are considered a valuable resource. DOE requested that WHC share this resource. By sharing what is and can be encountered during packaging testing, individuals will hopefully avoid past mistakes.

  15. Packaging of electro-microfluidic devices

    DOEpatents

    Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

    2003-04-15

    A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

  16. Packaging of electro-microfluidic devices

    DOEpatents

    Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Watson, Robert D.

    2002-01-01

    A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

  17. Apparatus and method for skin packaging articles

    NASA Technical Reports Server (NTRS)

    Madsen, B.; Pozsony, E. R.; Collin, E. E. (Inventor)

    1973-01-01

    A system for skin packaging articles including a loading zone for positioning articles to be packaged upon a substrate, a thermoplastic film heating and vacuum operated skin packaging zone for covering the articles with film laminated to the substrate and a slitting zone for separating and trimming the individual skin packaged articles. The articles are passed to the successive zones. The loading zone may be adapted for conveyorized instead of hand loading. In some cases, where only transverse cutting of the film web is necessary, it may be desirable to eliminate the slitting zone and remove the skin packaged article or articles directly from the packaging zone. A conveniently located operating panel contains controls for effecting automatic, semiautomatic or manual operation of the entire system of any portions in any manner desired.

  18. Type A radioactive liquid sample packaging family

    SciTech Connect

    Edwards, W.S.

    1995-11-01

    Westinghouse Hanford Company (WHC) has developed two packagings that can be used to ship Type A quantities of radioactive liquids. WHC designed these packagings to take advantage of commercially available items where feasible to reduce the overall packaging cost. The Hedgehog packaging can ship up to one liter of Type A radioactive liquid with no shielding and 15 cm of distance between the liquid and the package exterior, or 30 ml of liquid with 3.8 cm of stainless steel shielding and 19 cm of distance between the liquid and the package exterior. The One Liter Shipper can ship up to one liter of Type A radioactive liquid that does not require shielding.

  19. Design considerations for automated packaging operations

    SciTech Connect

    Fahrenholtz, J.; Jones, J.; Kincy, M.

    1993-12-31

    The paper is based on work performed at Sandia National Laboratories to automate DOE packaging operations. It is a general summary of work from several projects which may be applicable to other packaging operations. Examples are provided of robotic operations which have been demonstrated as well as operations that are currently being developed. General design considerations for packages and for automated handling systems are described.

  20. NFR TRIGA package design review report

    SciTech Connect

    Clements, M.D.

    1994-08-26

    The purpose of this document is to compile, present and document the formal design review of the NRF TRIGA packaging. The contents of this document include: the briefing meeting presentations, package description, design calculations, package review drawings, meeting minutes, action item lists, review comment records, final resolutions, and released drawings. This design review required more than two meeting to resolve comments. Therefore, there are three meeting minutes and two action item lists.

  1. High performance microsystem packaging: A perspective

    SciTech Connect

    Romig, A.D. Jr.; Dressendorfer, P.V.; Palmer, D.W.

    1997-10-01

    The second silicon revolution will be based on intelligent, integrated microsystems where multiple technologies (such as analog, digital, memory, sensor, micro-electro-mechanical, and communication devices) are integrated onto a single chip or within a multichip module. A necessary element for such systems is cost-effective, high-performance packaging. This paper examines many of the issues associated with the packaging of integrated microsystems, with an emphasis on the areas of packaging design, manufacturability, and reliability.

  2. Polymer Composites for Intelligent Food Packaging

    NASA Astrophysics Data System (ADS)

    He, Jiating; Yap, Ray Chin Chong; Wong, Siew Yee; Li, Xu

    2015-09-01

    Over the last 50 years, remarkable improvements in mechanical and barrier properties of polymer composites have been realized. Their improved properties have been widely studied and employed for food packaging to keep food fresh, clean and suitable for consumption over sufficiently long storage period. In this paper, the current progress of science and technology development of polymer composites for intelligent food packaging will be highlighted. Future directions and perspectives for exploring polymer composites for intelligent food packaging to reveal freshness and quality of food packaged will also be put forward.

  3. Microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2002-01-01

    An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a cofired ceramic frame or body. The package can have an internal stepped structure made of one or more plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination.

  4. XERROR, the SLATEC error-handling package

    SciTech Connect

    Jones, R.E.; Kahaner, D.K.

    1982-05-01

    The XERROR package is a collection of portable Fortran routines for processing of errors that occur in other routines. It was developed as the error-handling package for the SLATEC Common Mathematical Library, which is currently in use at a number of DOE and other facilities. This document describes how to use the package, from the viewpoint of the writer of library routines which need to call the XERROR package to handle errors, and from the viewpoint of the user of those library routines.

  5. Antimicrobial food packaging in meat industry.

    PubMed

    Quintavalla, Stefania; Vicini, Loredana

    2002-11-01

    Antimicrobial packaging, an active packaging concept, can be considered an extremely challenging technology that could have a significant impact on shelf-life extension and food safety of meat and meat products. Use of antimicrobial substances can control the microbial population and target specific microorganisms to provide higher safety and quality products. Many classes of antimicrobial compounds have been evaluated in film structures, both synthetic polymers and edible films: organic acids and their salts, enzymes, bacteriocins, and miscellaneous compounds such as triclosan, silver zeolites, and fungicides. The characteristics of some antimicrobial packaging systems are reviewed in this article. The regulatory status of antimicrobial packaging in EU is also examined. PMID:22061613

  6. Yucca Mountain Waste Package Closure System

    SciTech Connect

    shelton-davis; Colleen Shelton-Davis; Greg Housley

    2005-10-01

    The current disposal path for high-level waste is to place the material into secure waste packages that are inserted into a repository. The Idaho National Laboratory has been tasked with the development, design, and demonstration of the waste package closure system for the repository project. The closure system design includes welding three lids and a purge port cap, four methods of nondestructive examination, and evacuation and backfill of the waste package, all performed in a remote environment. A demonstration of the closure system will be performed with a full-scale waste package.

  7. Yucca Mountain Waste Package Closure System

    SciTech Connect

    Herschel Smartt; Arthur Watkins; David Pace; Rodney Bitsoi; Eric Larsen; Timothy McJunkin; Charles Tolle

    2006-04-01

    The current disposal path for high-level waste is to place the material into secure waste packages that are inserted into a repository. The Idaho National Laboratory has been tasked with the development, design, and demonstration of the waste package closure system for the repository project. The closure system design includes welding three lids and a purge port cap, four methods of nondestructive examination, and evacuation and backfill of the waste package, all performed in a remote environment. A demonstration of the closure system will be performed with a full-scale waste package.

  8. Clean Cities Now: Vol. 16, No. 2, Fall 2012 (Brochure)

    SciTech Connect

    Not Available

    2012-09-01

    Biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on advanced vehicle deployment, idle reduction, and articles on Clean Cities coalition successes across the country.

  9. Clean Cities Now: Vol. 17, No. 1, Spring 2013 (Brochure)

    SciTech Connect

    Sutor, J.; Tucker, E.; Thomas, J.

    2013-05-01

    Biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on advanced vehicle deployment, idle reduction, and articles on Clean Cities coalition successes across the country.

  10. Clean Cities Now: Vol. 16, No. 1, May 2012 (Brochure)

    SciTech Connect

    Not Available

    2012-05-01

    Biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on advanced vehicle deployment, idle reduction, and articles on Clean Cities coalition successes across the country.

  11. Investigations into High Temperature Components and Packaging

    SciTech Connect

    Marlino, L.D.; Seiber, L.E.; Scudiere, M.B.; M.S. Chinthavali, M.S.; McCluskey, F.P.

    2007-12-31

    The purpose of this report is to document the work that was performed at the Oak Ridge National Laboratory (ORNL) in support of the development of high temperature power electronics and components with monies remaining from the Semikron High Temperature Inverter Project managed by the National Energy Technology Laboratory (NETL). High temperature electronic components are needed to allow inverters to operate in more extreme operating conditions as required in advanced traction drive applications. The trend to try to eliminate secondary cooling loops and utilize the internal combustion (IC) cooling system, which operates with approximately 105 C water/ethylene glycol coolant at the output of the radiator, is necessary to further reduce vehicle costs and weight. The activity documented in this report includes development and testing of high temperature components, activities in support of high temperature testing, an assessment of several component packaging methods, and how elevated operating temperatures would impact their reliability. This report is organized with testing of new high temperature capacitors in Section 2 and testing of new 150 C junction temperature trench insulated gate bipolar transistor (IGBTs) in Section 3. Section 4 addresses some operational OPAL-GT information, which was necessary for developing module level tests. Section 5 summarizes calibration of equipment needed for the high temperature testing. Section 6 details some additional work that was funded on silicon carbide (SiC) device testing for high temperature use, and Section 7 is the complete text of a report funded from this effort summarizing packaging methods and their reliability issues for use in high temperature power electronics. Components were tested to evaluate the performance characteristics of the component at different operating temperatures. The temperature of the component is determined by the ambient temperature (i.e., temperature surrounding the device) plus the

  12. Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation)

    SciTech Connect

    Bennion, K.; Moreno, G.

    2010-04-27

    Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package. The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.

  13. PRIDE Surveillance Projects Data Packaging Project Information Package Specification Version 1.1

    SciTech Connect

    Kelleher, D. M.; Shipp, R. L.; Mason, J. D.

    2010-08-31

    Information Package Specification version 1.1 describes an XML document format called an information package that can be used to store information in information management systems and other information archives. An information package consists of package information, the context required to understand and use that information, package metadata that describes the information, and XML signatures that protect the information. The information package described in this specification was designed to store Department of Energy (DOE) and National Nuclear Security Administration (NNSA) information and includes the metadata required for that information: a unique package identifier, information marking that conforms to DOE and NNSA requirements, and access control metadata. It is an implementation of the Open Archival Information System (OAIS) Reference Model archival information package tailored to meet NNSA information storage requirements and designed to be used in the computing environments at the Y-12 National Security Complex and at other NNSA sites.

  14. Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

    NASA Technical Reports Server (NTRS)

    Dawe, R. H.; Arnett, J. C.

    1974-01-01

    Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.

  15. Packaging performance evaluation and performance oriented packaging standards for large packages for poison inhalation hazard materials

    SciTech Connect

    Griego, N.R.; Mills, G.S.; McClure, J.D.

    1997-07-01

    The U.S. Department of Transportation Research & Special Programs Administration (DOT-RSPA) has sponsored a project at Sandia National Laboratories to evaluate the protection provided by current packagings used for truck and rail transport of materials that have been classified as Poison Inhalation Hazards (PIH) and to recommend performance standards for these PIH packagings. Hazardous materials span a wide range of toxicity and there are many parameters used to characterize toxicity; for any given hazardous material, data are not available for all of the possible toxicity parameters. Therefore, it was necessary to select a toxicity criterion to characterize all of the PIH compounds (a value of the criterion was derived from other parameters in many cases) and to calculate their dispersion in the event of a release resulting from a transportation accident. Methodologies which account for material toxicity and dispersal characteristics were developed as a major portion of this project and applied to 72 PIH materials. This report presents details of the PIH material toxicity comparisons, calculation of their dispersion, and their classification into five severity categories. 16 refs., 5 figs., 7 tabs.

  16. Belos Block Linear Solvers Package

    2004-03-01

    Belos is an extensible and interoperable framework for large-scale, iterative methods for solving systems of linear equations with multiple right-hand sides. The motivation for this framework is to provide a generic interface to a collection of algorithms for solving large-scale linear systems. Belos is interoperable because both the matrix and vectors are considered to be opaque objects--only knowledge of the matrix and vectors via elementary operations is necessary. An implementation of Balos is accomplished viamore » the use of interfaces. One of the goals of Belos is to allow the user flexibility in specifying the data representation for the matrix and vectors and so leverage any existing software investment. The algorithms that will be included in package are Krylov-based linear solvers, like Block GMRES (Generalized Minimal RESidual) and Block CG (Conjugate-Gradient).« less

  17. ISHAN: sequence homology analysis package.

    PubMed

    Shil, Pratip; Dudani, Niraj; Vidyasagar, Pandit B

    2006-01-01

    Sequence based homology studies play an important role in evolutionary tracing and classification of proteins. Various methods are available to analyze biological sequence information. However, with the advent of proteomics era, there is a growing demand for analysis of huge amount of biological sequence information, and it has become necessary to have programs that would provide speedy analysis. ISHAN has been developed as a homology analysis package, built on various sequence analysis tools viz FASTA, ALIGN, CLUSTALW, PHYLIP and CODONW (for DNA sequences). This JAVA application offers the user choice of analysis tools. For testing, ISHAN was applied to perform phylogenetic analysis for sets of Caspase 3 DNA sequences and NF-kappaB p105 amino acid sequences. By integrating several tools it has made analysis much faster and reduced manual intervention. PMID:17274766

  18. Antimicrobial seafood packaging: a review.

    PubMed

    Singh, Suman; Ho Lee, Myung; Park, Lnsik; Shin, Yangjai; Lee, Youn Suk

    2016-06-01

    Microorganisms are the major cause of spoilage in most seafood products; however, only few microbes, called the specific spoilage organisms (SSOs), contribute to the offensive off-flavors associated with seafood spoilage. In food, microbial degradation manifests itself as spoilage, or changes in the sensory properties of a food product, rendering it unsuitable for human consumption. The use of antimicrobial substances can control the general microflora as well as specific microorganisms related to spoilage to provide products with higher safety and better quality. Many antimicrobial compounds have been evaluated in film structures for use in seafood, especially organic acids and their salts, enzymes, bacteriocins; some studies have considered inorganic compounds such as AgSiO2, zinc oxide, silver zeolite, and titanium oxide. The characteristics of some organic antimicrobial packaging systems for seafood and their antimicrobial efficiency in film structures are reviewed in this article. PMID:27478206

  19. 78 FR 13006 - New Intelligent Mail Package Barcode Standards To Enhance Package Visibility; Opportunity for...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-02-26

    ... 111 New Intelligent Mail Package Barcode Standards To Enhance Package Visibility; Opportunity for... Postal Service is exploring the advisability of requiring the use of Intelligent Mail package barcodes...-stream efficiency within USPS mail processing, delivery, payment, and reporting. Intelligent Mail...

  20. Modular optimization code package: MOZAIK

    NASA Astrophysics Data System (ADS)

    Bekar, Kursat B.

    This dissertation addresses the development of a modular optimization code package, MOZAIK, for geometric shape optimization problems in nuclear engineering applications. MOZAIK's first mission, determining the optimal shape of the D2O moderator tank for the current and new beam tube configurations for the Penn State Breazeale Reactor's (PSBR) beam port facility, is used to demonstrate its capabilities and test its performance. MOZAIK was designed as a modular optimization sequence including three primary independent modules: the initializer, the physics and the optimizer, each having a specific task. By using fixed interface blocks among the modules, the code attains its two most important characteristics: generic form and modularity. The benefit of this modular structure is that the contents of the modules can be switched depending on the requirements of accuracy, computational efficiency, or compatibility with the other modules. Oak Ridge National Laboratory's discrete ordinates transport code TORT was selected as the transport solver in the physics module of MOZAIK, and two different optimizers, Min-max and Genetic Algorithms (GA), were implemented in the optimizer module of the code package. A distributed memory parallelism was also applied to MOZAIK via MPI (Message Passing Interface) to execute the physics module concurrently on a number of processors for various states in the same search. Moreover, dynamic scheduling was enabled to enhance load balance among the processors while running MOZAIK's physics module thus improving the parallel speedup and efficiency. In this way, the total computation time consumed by the physics module is reduced by a factor close to M, where M is the number of processors. This capability also encourages the use of MOZAIK for shape optimization problems in nuclear applications because many traditional codes related to radiation transport do not have parallel execution capability. A set of computational models based on the

  1. AGC-2 Graphite Pre-irradiation Data Package

    SciTech Connect

    David Swank; Joseph Lord; David Rohrbaugh; William Windes

    2010-08-01

    The NGNP Graphite R&D program is currently establishing the safe operating envelope of graphite core components for a Very High Temperature Reactor (VHTR) design. The program is generating quantitative data necessary for predicting the behavior and operating performance of the new nuclear graphite grades. To determine the in-service behavior of the graphite for pebble bed and prismatic designs, the Advanced Graphite Creep (AGC) experiment is underway. This experiment is examining the properties and behavior of nuclear grade graphite over a large spectrum of temperatures, neutron fluences and compressive loads. Each experiment consists of over 400 graphite specimens that are characterized prior to irradiation and following irradiation. Six experiments are planned with the first, AGC-1, currently being irradiated in the Advanced Test Reactor (ATR) and pre-irradiation characterization of the second, AGC-2, completed. This data package establishes the readiness of 512 specimens for assembly into the AGC-2 capsule.

  2. A comparison of InVivoStat with other statistical software packages for analysis of data generated from animal experiments.

    PubMed

    Clark, Robin A; Shoaib, Mohammed; Hewitt, Katherine N; Stanford, S Clare; Bate, Simon T

    2012-08-01

    InVivoStat is a free-to-use statistical software package for analysis of data generated from animal experiments. The package is designed specifically for researchers in the behavioural sciences, where exploiting the experimental design is crucial for reliable statistical analyses. This paper compares the analysis of three experiments conducted using InVivoStat with other widely used statistical packages: SPSS (V19), PRISM (V5), UniStat (V5.6) and Statistica (V9). We show that InVivoStat provides results that are similar to those from the other packages and, in some cases, are more advanced. This investigation provides evidence of further validation of InVivoStat and should strengthen users' confidence in this new software package. PMID:22071578

  3. Advanced uncooled sensor product development

    NASA Astrophysics Data System (ADS)

    Kennedy, A.; Masini, P.; Lamb, M.; Hamers, J.; Kocian, T.; Gordon, E.; Parrish, W.; Williams, R.; LeBeau, T.

    2015-06-01

    The partnership between RVS, Seek Thermal and Freescale Semiconductor continues on the path to bring the latest technology and innovation to both military and commercial customers. The partnership has matured the 17μm pixel for volume production on the Thermal Weapon Sight (TWS) program in efforts to bring advanced production capability to produce a low cost, high performance product. The partnership has developed the 12μm pixel and has demonstrated performance across a family of detector sizes ranging from formats as small as 206 x 156 to full high definition formats. Detector pixel sensitivities have been achieved using the RVS double level advanced pixel structure. Transition of the packaging of microbolometers from a traditional die level package to a wafer level package (WLP) in a high volume commercial environment is complete. Innovations in wafer fabrication techniques have been incorporated into this product line to assist in the high yield required for volume production. The WLP seal yield is currently > 95%. Simulated package vacuum lives >> 20 years have been demonstrated through accelerated life testing where the package has been shown to have no degradation after 2,500 hours at 150°C. Additionally the rugged assembly has shown no degradation after mechanical shock and vibration and thermal shock testing. The transition to production effort was successfully completed in 2014 and the WLP design has been integrated into multiple new production products including the TWS and the innovative Seek Thermal commercial product that interfaces directly to an iPhone or android device.

  4. Survivability of MEMS Packages at High-G Loads

    NASA Astrophysics Data System (ADS)

    Pryputniewicz, Ryszard J.

    2014-10-01

    Advances in emerging technology of microelectromechanical systems (MEMS) are one of the most challenging tasks in today's experimental mechanics. More specifically, development of these miniature devices requires sophisticated design, analysis, fabrication, testing, and characterization tools that have multiphysics and multiscale capabilities, especially as MEMS are being developed for use at harsh conditions. In harsh-environment and high-performance (e.g., military) guidance applications inertial sensors must be sensitive to low rates of rotation yet survive the high blast loads associated with the initial launch. In this multi-year study, a set of tuning fork gyroscopes were subjected to a series of increasing g-loads (culminating at approximately 60,000 g's) with measurements of shape made after each test. A custom set of test sample packages (aka articles) were hermetically sealed with glass lids to allow optical inspection of components while preserving the operating environment (i.e., vacuum). Initial test measurements were made upon fabrication of the articles. Optical and interferometric measurements have been made prior to and after each shock g-loading. The shape of the tuning fork gyroscope (TFG) test articles was measured using a phase shifting Michelson interferometer with compensation for package cover glass. Full field shape was determined and traces of pertinent structures were extracted for comparison. Failure of the die was observed in the form of fractures below the chip surface as well as fractures in the glass lid sealing the package. Potential causes of the failure are discussed as well as a recommendation for modified packaging techniques to mitigate future component failures.

  5. 9 CFR 317.24 - Packaging materials.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7.13) will be... 9 Animals and Animal Products 2 2011-01-01 2011-01-01 false Packaging materials. 317.24 Section... INSPECTION AND CERTIFICATION LABELING, MARKING DEVICES, AND CONTAINERS General § 317.24 Packaging...

  6. Antimicrobial packaging for fresh-cut fruits

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Fresh-cut fruits are minimally processed produce which are consumed directly at their fresh stage without any further kill step. Microbiological quality and safety are major challenges to fresh-cut fruits. Antimicrobial packaging is one of the innovative food packaging systems that is able to kill o...

  7. Developing a Package Training System for Industry

    ERIC Educational Resources Information Center

    Battersby, D. L. N.

    1974-01-01

    The hotel and catering industry is one of Great Britain's largest. A packaged training system has been developed to satisfy the needs of this industry, an ever-growing occupational field with multiple categories. The material provided in each package outlines short pieces of instruction and helps the trainer create appropriate training. (DS)

  8. Plastic-Sealed Hybrid Power Circuit Package

    NASA Technical Reports Server (NTRS)

    Miller, W. N.; Gray, O. E.

    1983-01-01

    Proposed design for hybrid high-voltage power-circuit package uses molded plastic for hermetic sealing instead of glass-to-metal seal. New package used to house high-voltage regulators and solid-state switches for applications in aircraft, electric automobiles, industrial equipment, satellites, solarcell arrays, and other equipment in extreme environments.

  9. Introduction to Software Packages. [Final Report.

    ERIC Educational Resources Information Center

    Frankel, Sheila, Ed.; And Others

    This document provides an introduction to applications computer software packages that support functional managers in government and encourages the use of such packages as an alternative to in-house development. A review of current application areas includes budget/project management, financial management/accounting, payroll, personnel,…

  10. 19 CFR 19.10 - Examination packages.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 19 Customs Duties 1 2010-04-01 2010-04-01 false Examination packages. 19.10 Section 19.10 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION, DEPARTMENT OF HOMELAND SECURITY; DEPARTMENT OF THE TREASURY... Examination packages. Merchandise sent from a bonded warehouse to the appraiser's stores for examination...

  11. 76 FR 30551 - Specifications for Packagings

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-05-26

    ... where the packaging is manufactured and each location where the design qualification tests are conducted...; (6) Description of the packaging design type (e.g. dimensions, materials, closures, thickness, etc... requirements. * * * * * (l) Record retention. Following each design qualification test and each periodic...

  12. 7 CFR 322.9 - Mailed packages.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ..., DEPARTMENT OF AGRICULTURE BEES, BEEKEEPING BYPRODUCTS, AND BEEKEEPING EQUIPMENT Importation of Adult Honeybees, Honeybee Germ Plasm, and Bees Other Than Honeybees From Approved Regions § 322.9 Mailed packages. (a) If you import a package of honeybees, honeybee germ plasm, or bees other than honeybees...

  13. 7 CFR 322.9 - Mailed packages.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ..., DEPARTMENT OF AGRICULTURE BEES, BEEKEEPING BYPRODUCTS, AND BEEKEEPING EQUIPMENT Importation of Adult Honeybees, Honeybee Germ Plasm, and Bees Other Than Honeybees From Approved Regions § 322.9 Mailed packages. (a) If you import a package of honeybees, honeybee germ plasm, or bees other than honeybees...

  14. 7 CFR 322.9 - Mailed packages.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ..., DEPARTMENT OF AGRICULTURE BEES, BEEKEEPING BYPRODUCTS, AND BEEKEEPING EQUIPMENT Importation of Adult Honeybees, Honeybee Germ Plasm, and Bees Other Than Honeybees From Approved Regions § 322.9 Mailed packages. (a) If you import a package of honeybees, honeybee germ plasm, or bees other than honeybees...

  15. 7 CFR 322.9 - Mailed packages.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ..., DEPARTMENT OF AGRICULTURE BEES, BEEKEEPING BYPRODUCTS, AND BEEKEEPING EQUIPMENT Importation of Adult Honeybees, Honeybee Germ Plasm, and Bees Other Than Honeybees From Approved Regions § 322.9 Mailed packages. (a) If you import a package of honeybees, honeybee germ plasm, or bees other than honeybees...

  16. 7 CFR 322.9 - Mailed packages.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ..., DEPARTMENT OF AGRICULTURE BEES, BEEKEEPING BYPRODUCTS, AND BEEKEEPING EQUIPMENT Importation of Adult Honeybees, Honeybee Germ Plasm, and Bees Other Than Honeybees From Approved Regions § 322.9 Mailed packages. (a) If you import a package of honeybees, honeybee germ plasm, or bees other than honeybees...

  17. 7 CFR 60.104 - Consumer package.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 7 Agriculture 3 2013-01-01 2013-01-01 false Consumer package. 60.104 Section 60.104 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... FOR FISH AND SHELLFISH General Provisions Definitions § 60.104 Consumer package. Consumer...

  18. 7 CFR 60.104 - Consumer package.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 3 2011-01-01 2011-01-01 false Consumer package. 60.104 Section 60.104 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... FOR FISH AND SHELLFISH General Provisions Definitions § 60.104 Consumer package. Consumer...

  19. 7 CFR 60.104 - Consumer package.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 7 Agriculture 3 2012-01-01 2012-01-01 false Consumer package. 60.104 Section 60.104 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... FOR FISH AND SHELLFISH General Provisions Definitions § 60.104 Consumer package. Consumer...

  20. 7 CFR 60.104 - Consumer package.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 7 Agriculture 3 2014-01-01 2014-01-01 false Consumer package. 60.104 Section 60.104 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... FOR FISH AND SHELLFISH General Provisions Definitions § 60.104 Consumer package. Consumer...