Science.gov

Sample records for advanced packaging vol

  1. Advances in bioclimatology, Vol. 1

    SciTech Connect

    Desjardins, R.L.; Gifford, R.M.; Nilson, T.; Greenwood, E.A.N.

    1992-12-31

    Bioclimatology has rapidly grown during the last three decades, with its major contributions being in the development of techniques and instrumentation for measurement, and understanding the biophysical processes governing the exchange of mass and energy on various scales ranging from individual leaves to plant communities. The literature published on the subject is rather abundant, but scattered in several specialized journals. The series in Advances in Bioclimatology seeks to summarize the latest progress in the field. In particular, this book addresses the exchange of mass at different spatial scales, light transfer within plant canopies, impact of rising atmospheric carbon dioxide (CO{sub 2}) on biosphere productivity and climate, and regional water balance.

  2. Advanced packaging for Integrated Micro-Instruments

    NASA Technical Reports Server (NTRS)

    Lyke, James L.

    1995-01-01

    The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

  3. Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

    NASA Technical Reports Server (NTRS)

    Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

    2011-01-01

    The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

  4. Advanced Manufacturing Systems in Food Processing and Packaging Industry

    NASA Astrophysics Data System (ADS)

    Shafie Sani, Mohd; Aziz, Faieza Abdul

    2013-06-01

    In this paper, several advanced manufacturing systems in food processing and packaging industry are reviewed, including: biodegradable smart packaging and Nano composites, advanced automation control system consists of fieldbus technology, distributed control system and food safety inspection features. The main purpose of current technology in food processing and packaging industry is discussed due to major concern on efficiency of the plant process, productivity, quality, as well as safety. These application were chosen because they are robust, flexible, reconfigurable, preserve the quality of the food, and efficient.

  5. Advanced packaging technology for high frequency photonic applications

    SciTech Connect

    Armendariz, M.G.; Hadley, G.R.; Warren, M.E.

    1996-03-01

    An advanced packaging concept has been developed for optical devices. This concept allows multiple fibers to be coupled to photonic integrated circuits, with no fiber penetration of the package walls. The principles used to accomplish this concept involves a second-order grating to couple light in or out of the photonic circuit, and a binary optic lens which receives this light and focuses it into a single-mode optical fiber. Design, fabrication and electrical/optical measurements of this packaging concept are described.

  6. Advanced Space Suit Portable Life Support Subsystem Packaging Design

    NASA Technical Reports Server (NTRS)

    Howe, Robert; Diep, Chuong; Barnett, Bob; Thomas, Gretchen; Rouen, Michael; Kobus, Jack

    2006-01-01

    This paper discusses the Portable Life Support Subsystem (PLSS) packaging design work done by the NASA and Hamilton Sundstrand in support of the 3 future space missions; Lunar, Mars and zero-g. The goal is to seek ways to reduce the weight of PLSS packaging, and at the same time, develop a packaging scheme that would make PLSS technology changes less costly than the current packaging methods. This study builds on the results of NASA s in-house 1998 study, which resulted in the "Flex PLSS" concept. For this study the present EMU schematic (low earth orbit) was used so that the work team could concentrate on the packaging. The Flex PLSS packaging is required to: protect, connect, and hold the PLSS and its components together internally and externally while providing access to PLSS components internally for maintenance and for technology change without extensive redesign impact. The goal of this study was two fold: 1. Bring the advanced space suit integrated Flex PLSS concept from its current state of development to a preliminary design level and build a proof of concept mockup of the proposed design, and; 2. "Design" a Design Process, which accommodates both the initial Flex PLSS design and the package modifications, required to accommodate new technology.

  7. The Assurance Challenges of Advanced Packaging Technologies for Electronics

    NASA Technical Reports Server (NTRS)

    Sampson, Michael J.

    2010-01-01

    Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

  8. Achieving miniature sensor systems via advanced packaging techniques

    NASA Astrophysics Data System (ADS)

    Hartup, David C.; Bobier, Kevin; Demmin, Jeffrey

    2005-05-01

    Demands for miniaturized networked sensors that can be deployed in large quantities dictate that the packages be small and cost effective. In order to accomplish these objectives, system developers generally apply advanced packaging techniques to proven systems. A partnership of Nova Engineering and Tessera begins with a baseline of Nova's Unattended Ground Sensors (UGS) technology and utilizes Tessera's three-dimensional (3D) Chip-Scale Packaging (CSP), Multi-Chip Packaging (MCP), and System-in-Package (SIP) innovations to enable novel methods for fabricating compact, vertically integrated sensors utilizing digital, RF, and micro-electromechanical systems (MEMS) devices. These technologies, applied to a variety of sensors and integrated radio architectures, enable diverse multi-modal sensing networks with wireless communication capabilities. Sensors including imaging, accelerometers, acoustical, inertial measurement units, and gas and pressure sensors can be utilized. The greatest challenge to high density, multi-modal sensor networks is the ability to test each component prior to integration, commonly called Known Good Die (KGD) testing. In addition, the mix of multi-sourcing and high technology magnifies the challenge of testing at the die level. Utilizing Tessera proprietary CSP, MCP, and SIP interconnection methods enables fully testable, low profile stacking to create multi-modal sensor radios with high yield.

  9. Advances in photonics thermal management and packaging materials

    NASA Astrophysics Data System (ADS)

    Zweben, Carl

    2008-02-01

    Heat dissipation, thermal stresses, and cost are key packaging design issues for virtually all semiconductors, including photonic applications such as diode lasers, light-emitting diodes (LEDs), solid state lighting, photovoltaics, displays, projectors, detectors, sensors and laser weapons. Heat dissipation and thermal stresses affect performance and reliability. Copper, aluminum and conventional polymeric printed circuit boards (PCBs) have high coefficients of thermal expansion, which can cause high thermal stresses. Most traditional low-coefficient-of-thermal-expansion (CTE) materials like tungsten/copper, which date from the mid 20 th century, have thermal conductivities that are no better than those of aluminum alloys, about 200 W/m-K. There are an increasing number of low-CTE materials with thermal conductivities ranging between that of copper (400 W/m-K) and 1700 W/m-K, and many other new low-CTE materials with lower thermal conductivities. An important benefit of low-CTE materials is that they allow use of hard solders. Some advanced materials are low cost. Others have the potential to be low cost in high-volume production. High-thermal-conductivity materials enable higher power levels, potentially reducing the number of required devices. Advanced thermal materials can constrain PCB CTE and greatly increase thermal conductivity. This paper reviews traditional packaging materials and advanced thermal management materials. The latter provide the packaging engineer with a greater range of options than in the past. Topics include properties, status, applications, cost, using advanced materials to fix manufacturing problems, and future directions, including composites reinforced with carbon nanotubes and other thermally conductive materials.

  10. Advanced functional network analysis in the geosciences: The pyunicorn package

    NASA Astrophysics Data System (ADS)

    Donges, Jonathan F.; Heitzig, Jobst; Runge, Jakob; Schultz, Hanna C. H.; Wiedermann, Marc; Zech, Alraune; Feldhoff, Jan; Rheinwalt, Aljoscha; Kutza, Hannes; Radebach, Alexander; Marwan, Norbert; Kurths, Jürgen

    2013-04-01

    Functional networks are a powerful tool for analyzing large geoscientific datasets such as global fields of climate time series originating from observations or model simulations. pyunicorn (pythonic unified complex network and recurrence analysis toolbox) is an open-source, fully object-oriented and easily parallelizable package written in the language Python. It allows for constructing functional networks (aka climate networks) representing the structure of statistical interrelationships in large datasets and, subsequently, investigating this structure using advanced methods of complex network theory such as measures for networks of interacting networks, node-weighted statistics or network surrogates. Additionally, pyunicorn allows to study the complex dynamics of geoscientific systems as recorded by time series by means of recurrence networks and visibility graphs. The range of possible applications of the package is outlined drawing on several examples from climatology.

  11. Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

    NASA Technical Reports Server (NTRS)

    Fayette, Daniel F.; Speicher, Patricia; Stoklosa, Mark J.; Evans, Jillian V.; Evans, John W.; Gentile, Mike; Pagel, Chuck A.; Hakim, Edward

    1993-01-01

    A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

  12. Advances in food packaging films from milk proteins

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Most commercial petroleum-based food packaging films are poor oxygen barriers, do not biodegrade, and some are suspected to even leach compounds into the food product. For instance, three-perfluorinated coatings were banned from convenience food packaging earlier this year. These shortcomings are a ...

  13. Advanced packaging methods for high-power LED modules

    NASA Astrophysics Data System (ADS)

    Jordan, Rafael C.; Weber, Constanze; Ehrhardt, Christian; Wilke, Martin

    2014-02-01

    LED luminaires are already beyond retrofit systems, which are limited in heat dissipation due to the old fitting standards. Actual LED luminaries are based on new LED packages and modules. Heat dissipation through the first and second level interconnect is a key issue for a successful LED package. Therefore the impact of known bonding technologies as gluing and soldering and new technologies like sintering and transient liquid phase soldering were analyzed and compared. A realized hermetic high power LED package will be shown as example. The used new techniques result in a module extremely stable against further assembly processes and harsh operating conditions.

  14. A Review of Failure Analysis Methods for Advanced 3D Microelectronic Packages

    NASA Astrophysics Data System (ADS)

    Li, Yan; Srinath, Purushotham Kaushik Muthur; Goyal, Deepak

    2016-01-01

    Advanced three dimensional (3D) packaging is a key enabler in driving form factor reduction, performance benefits, and package cost reduction, especially in the fast paced mobility and ultraportable consumer electronics segments. The high level of functional integration and the complex package architecture pose a significant challenge for conventional fault isolation (FI) and failure analysis (FA) methods. Innovative FI/FA tools and techniques are required to tackle the technical and throughput challenges. In this paper, the applications of FI and FA techniques such as Electro Optic Terahertz Pulse Reflectometry, 3D x-ray computed tomography, lock-in thermography, and novel physical sample preparation methods to 3D packages with package on package and stacked die with through silicon via configurations are reviewed, along with the key FI and FA challenges.

  15. Energy Savings and Economics of Advanced Control Strategies for Packaged Heat Pumps

    SciTech Connect

    Wang, Weimin; Huang, Yunzhi; Katipamula, Srinivas

    2012-10-31

    Pacific Northwest National Laboratory (PNNL), with funding from the U.S. Department of Energy’s (DOE’s) Building Technologies Program (BTP), evaluated a number of control strategies for packaged cooling equipment that can be implemented in an advanced controller, which can be retrofit into existing packaged heat pump units to improve their operational efficiency. This report documents the results of that analysis.

  16. Building America Top Innovations 2012: Advanced Framing Systems and Packages

    SciTech Connect

    none,

    2013-01-01

    This Building America Top Innovations profile describes Building America research showing advanced 2x6, 24-inch on-center framing, single top plates, open headers, and 2-stud corners reduced board feet of lumber by more than 1,000 feet, cut energy use by 13%, and cut material and labor costs by more than $1,000 on a typical home.

  17. Advanced parametrical modelling of 24 GHz radar sensor IC packaging components

    NASA Astrophysics Data System (ADS)

    Kazemzadeh, R.; John, W.; Wellmann, J.; Bala, U. B.; Thiede, A.

    2011-08-01

    This paper deals with the development of an advanced parametrical modelling concept for packaging components of a 24 GHz radar sensor IC used in automotive driver assistance systems. For fast and efficient design of packages for system-in-package modules (SiP), a simplified model for the description of parasitic electromagnetic effects within the package is desirable, as 3-D field computation becomes inefficient due to the high density of conductive elements of the various signal paths in the package. By using lumped element models for the characterization of the conductive components, a fast indication of the design's signal-quality can be gained, but so far does not offer enough flexibility to cover the whole range of geometric arrangements of signal paths in a contemporary package. This work pursues to meet the challenge of developing a flexible and fast package modelling concept by defining parametric lumped-element models for all basic signal path components, e.g. bond wires, vias, strip lines, bumps and balls.

  18. Attic or Roof? An Evaluation of Two Advanced Weatherization Packages

    SciTech Connect

    Neuhauser, Ken

    2012-06-01

    This project examines implementation of advanced retrofit measures in the context of a large-scale weatherization program and the archetypal Chicago brick bungalow. One strategy applies best practice air sealing methods and a standard insulation method to the attic floor. The other strategy creates an unvented roof assembly using materials and methods typically available to weatherization contractors. Through implementations of the retrofit strategies in a total of eight (8) test homes, the research found that the two different strategies achieve similar reductions in air leakage measurement (55%) and predicted energy performance (18%) relative to the pre-retrofit conditions.

  19. AISI/DOE Advanced Process Control Program Vol. 6 of 6: Temperature Measurement of Galvanneal Steel

    SciTech Connect

    S.W. Allison; D.L. Beshears; W.W. Manges

    1999-06-30

    This report describes the successful completion of the development of an accurate in-process measurement instrument for galvanneal steel surface temperatures. This achievement results from a joint research effort that is a part of the American Iron and Steel Institute's (AISI) Advanced Process Control Program, a collaboration between the U.S> Department of Energy and fifteen North American Steelmakers. This three-year project entitled ''Temperature Measurement of Galvanneal Steel'' uses phosphor thermography, and outgrowth of Uranium enrichment research at Oak Ridge facilities. Temperature is the controlling factor regarding the distribution of iron and zinc in the galvanneal strip coating, which in turn determines the desired product properties

  20. Advanced Spacesuit Portable Life Support System Packaging Concept Mock-Up Design & Development

    NASA Technical Reports Server (NTRS)

    O''Connell, Mary K.; Slade, Howard G.; Stinson, Richard G.

    1998-01-01

    A concentrated development effort was begun at NASA Johnson Space Center to create an advanced Portable Life Support System (PLSS) packaging concept. Ease of maintenance, technological flexibility, low weight, and minimal volume are targeted in the design of future micro-gravity and planetary PLSS configurations. Three main design concepts emerged from conceptual design techniques and were carried forth into detailed design, then full scale mock-up creation. "Foam", "Motherboard", and "LEGOtm" packaging design concepts are described in detail. Results of the evaluation process targeted maintenance, robustness, mass properties, and flexibility as key aspects to a new PLSS packaging configuration. The various design tools used to evolve concepts into high fidelity mock ups revealed that no single tool was all encompassing, several combinations were complimentary, the devil is in the details, and, despite efforts, many lessons were learned only after working with hardware.

  1. Advanced image processing package for FPGA-based re-programmable miniature electronics

    NASA Astrophysics Data System (ADS)

    Ovod, Vladimir I.; Baxter, Christopher R.; Massie, Mark A.; McCarley, Paul L.

    2005-05-01

    Nova Sensors produces miniature electronics for a variety of real-time digital video camera systems, including foveal sensors based on Nova's Variable Acuity Superpixel Imager (VASITM) technology. An advanced image-processing package has been designed at Nova Sensors to re-configure the FPGA-based co-processor board for numerous applications including motion detection, optical, background velocimetry and target tracking. Currently, the processing package consists of 14 processing operations that cover a broad range of point- and area-applied algorithms. Flexible FPGA designs of these operations and re-programmability of the processing board allows for easy updates of the VASITM sensors, and for low-cost customization of VASITM sensors taking into account specific customer requirements. This paper describes the image processing algorithms implemented and verified in Xilinx FPGAs and provides the major technical performances with figures illustrating practical applications of the processing package.

  2. Advances in methods and algorithms in a modern quantum chemistry program package.

    PubMed

    Shao, Yihan; Molnar, Laszlo Fusti; Jung, Yousung; Kussmann, Jörg; Ochsenfeld, Christian; Brown, Shawn T; Gilbert, Andrew T B; Slipchenko, Lyudmila V; Levchenko, Sergey V; O'Neill, Darragh P; DiStasio, Robert A; Lochan, Rohini C; Wang, Tao; Beran, Gregory J O; Besley, Nicholas A; Herbert, John M; Lin, Ching Yeh; Van Voorhis, Troy; Chien, Siu Hung; Sodt, Alex; Steele, Ryan P; Rassolov, Vitaly A; Maslen, Paul E; Korambath, Prakashan P; Adamson, Ross D; Austin, Brian; Baker, Jon; Byrd, Edward F C; Dachsel, Holger; Doerksen, Robert J; Dreuw, Andreas; Dunietz, Barry D; Dutoi, Anthony D; Furlani, Thomas R; Gwaltney, Steven R; Heyden, Andreas; Hirata, So; Hsu, Chao-Ping; Kedziora, Gary; Khalliulin, Rustam Z; Klunzinger, Phil; Lee, Aaron M; Lee, Michael S; Liang, Wanzhen; Lotan, Itay; Nair, Nikhil; Peters, Baron; Proynov, Emil I; Pieniazek, Piotr A; Rhee, Young Min; Ritchie, Jim; Rosta, Edina; Sherrill, C David; Simmonett, Andrew C; Subotnik, Joseph E; Woodcock, H Lee; Zhang, Weimin; Bell, Alexis T; Chakraborty, Arup K; Chipman, Daniel M; Keil, Frerich J; Warshel, Arieh; Hehre, Warren J; Schaefer, Henry F; Kong, Jing; Krylov, Anna I; Gill, Peter M W; Head-Gordon, Martin

    2006-07-21

    Advances in theory and algorithms for electronic structure calculations must be incorporated into program packages to enable them to become routinely used by the broader chemical community. This work reviews advances made over the past five years or so that constitute the major improvements contained in a new release of the Q-Chem quantum chemistry package, together with illustrative timings and applications. Specific developments discussed include fast methods for density functional theory calculations, linear scaling evaluation of energies, NMR chemical shifts and electric properties, fast auxiliary basis function methods for correlated energies and gradients, equation-of-motion coupled cluster methods for ground and excited states, geminal wavefunctions, embedding methods and techniques for exploring potential energy surfaces. PMID:16902710

  3. Field evaluation of advanced controls for the retrofit of packaged air conditioners and heat pumps

    SciTech Connect

    Wang, Weimin; Katipamula, Srinivas; Ngo, Hung; Underhill, Ronald M.; Taasevigen, Danny J.; Lutes, Robert G.

    2015-09-01

    This paper documents the magnitude of energy savings achievable in the field by retrofitting existing packaged rooftop units (RTUs) with advanced control strategies not ordinarily used for RTUs. A total of 66 RTUs on 8 different buildings were retrofitted with a commercially available advanced controller for improving RTU operational efficiency. The controller features enhanced air-side economizer control, multi-speed fan control, and demand controlled ventilation. Of the 66 RTUs, 18 are packaged heat pumps and the rest are packaged air conditioners with gas heat. The eight buildings cover four building types and four climate conditions. Based on the data collected for about a whole year, the advanced controller reduced the normalized annual RTU energy consumption between 22% and 90%, with an average of 57% for all RTUs. The average fractional savings uncertainty was 12% at 95% confidence level. Normalized annual electricity savings were in the range between 0.47 kWh/h (kWh per hour of RTU operation) and 7.21 kWh/h, with an average of 2.39 kWh/h. RTUs greater than 53 kW and runtime greater than 14 hours per day had payback periods less than 3 years even at $0.05/kWh.

  4. Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2013-03-01

    Life testing/qualification of reflowed (1st reflow) and reworked (1st reflow, 1st removal, and then 1st rework) advanced ceramic column grid array (CCGA) surface mount interconnect electronic packaging technologies for future flight projects has been studied to enhance the mission assurance of JPL-NASA projects. The reliability of reworked/reflowed surface mount technology (SMT) packages is very important for short-duration and long-duration deep space harsh extreme thermal environmental missions. The life testing of CCGA electronic packages under extreme thermal environments (for example: -185°C to +125°C) has been performed with reference to various JPL/NASA project requirements which encompass the temperature range studied. The test boards of reflowed and reworked CCGA packages (717 Xilinx package, 624, 1152, and 1272 column Actel Packages) were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases or cycles to failure to assess the life of the hardware. Qualification/life testing was performed by subjecting test boards to the environmental harsh temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance solder-joint failures due to either overstress or thermal cycle fatigue. The large, high density, high input/output (I/O) electronic interconnect SMT packages such as CCGA have increased usage in avionics hardware of NASA projects during the last two decades. The test boards built with CCGA packages are expensive and often require a rework to replace a reflowed, reprogrammed, failed, redesigned, etc., CCGA packages. Theoretically speaking, a good rework process should have similar temperature-time profile as that used for the original manufacturing process of solder reflow. A

  5. Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza; Evans, John W.

    2014-01-01

    For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

  6. Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance

    SciTech Connect

    Sukharev, V.; Kteyan, A.; Choy, J.-H.; Hovsepyan, H.; Markosian, A.; Zschech, E.; Huebner, R.

    2011-11-10

    Potential challenges with managing mechanical stress and the consequent effects on device performance for advanced 3D through-silicon-via (TSV) based technologies are outlined. The paper addresses the growing need in a simulation-based design verification flow capable to analyze a design of 3D IC stacks and to determine across-die out-of-spec variations in device electrical characteristics caused by the layout and through-silicon-via (TSV)/package-induced mechanical stress. The limited characterization/measurement capabilities for 3D IC stacks and a strict ''good die'' requirement make this type of analysis critical for the achievement of an acceptable level of functional and parametric yield and reliability. The paper focuses on the development of a design-for-manufacturability (DFM) type of methodology for managing mechanical stresses during a sequence of designs of 3D TSV-based dies, stacks and packages. A set of physics-based compact models for a multi-scale simulation to assess the mechanical stress across the device layers in silicon chips stacked and packaged with the 3D TSV technology is proposed. A calibration technique based on fitting to measured stress components and electrical characteristics of the test-chip devices is presented. A strategy for generation of a simulation feeding data and respective materials characterization approach are proposed, with the goal to generate a database for multi-scale material parameters of wafer-level and package-level structures. For model validation, high-resolution strain measurements in Si channels of the test-chip devices are needed. At the nanoscale, the transmission electron microscopy (TEM) is the only technique available for sub-10 nm strain measurements so far.

  7. Energy Savings and Economics of Advanced Control Strategies for Packaged Air-Conditioning Units with Gas Heat

    SciTech Connect

    Wang, Weimin; Katipamula, Srinivas; Huang, Yunzhi; Brambley, Michael R.

    2011-12-31

    Pacific Northwest National Laboratory (PNNL) with funding from the U.S. Department of Energy's Building Technologies Program (BTP) evaluated a number of control strategies that can be implemented in a controller, to improve the operational efficiency of the packaged air conditioning units. The two primary objectives of this research project are: (1) determine the magnitude of energy savings achievable by retrofitting existing packaged air conditioning units with advanced control strategies not ordinarily used for packaged units and (2) estimating what the installed cost of a replacement control with the desired features should be in various regions of the U.S. This document reports results of the study.

  8. More Efficient Power Conversion for EVs: Gallium-Nitride Advanced Power Semiconductor and Packaging

    SciTech Connect

    2010-02-01

    Broad Funding Opportunity Announcement Project: Delphi is developing power converters that are smaller and more energy efficient, reliable, and cost-effective than current power converters. Power converters rely on power transistors which act like a very precisely controlled on-off switch, controlling the electrical energy flowing through an electrical circuit. Most power transistors today use silicon (Si) semiconductors. However, Delphi is using semiconductors made with a thin layer of gallium-nitride (GaN) applied on top of the more conventional Si material. The GaN layer increases the energy efficiency of the power transistor and also enables the transistor to operate at much higher temperatures, voltages, and power-density levels compared to its Si counterpart. Delphi is packaging these high-performance GaN semiconductors with advanced electrical connections and a cooling system that extracts waste heat from both sides of the device to further increase the device’s efficiency and allow more electrical current to flow through it. When combined with other electronic components on a circuit board, Delphi’s GaN power transistor package will help improve the overall performance and cost-effectiveness of HEVs and EVs.

  9. Expected very-near-field thermal environments for advanced spent-fuel and defense high-level waste packages

    SciTech Connect

    Rickertsen, L.D.; Misplon, M.A.; Claiborne, H.C.

    1982-03-01

    The very-near-field thermal environments expected in a nuclear waste repository in a salt formation have been evaluated for the Westinghouse Form I advanced waste package concepts. The repository descriptions used to supplement the waste package designs in these analyses are realistic and take into account design constraints to assure conservatism. As a result, areal loadings are well below the acceptable values established for salt repositories. Predicted temperatures are generally well below any temperature limits which have been discussed for waste packages in a salt formation. These low temperatures result from the conservative repository designs. Investigations are also made of the sensitivity of these temperatures to areal loading, canister separation, and other design features.

  10. Advances in Librarianship; Vol. 5.

    ERIC Educational Resources Information Center

    Voigt, Melvin J.

    Major themes in library science for 1975 are discussed in depth in a collection of nine writings by ten prominent library figures from the United States, Spain, and France. The articles are titled: (1) international information systems; (2) national planning for library and information services; (3) statistics that describe libraries and library…

  11. Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni; Ghaffarian, Reza; Shapiro, Andrew; Napala, Phil A.; Martin, Patrick A.

    2005-01-01

    Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

  12. 30-kW class Arcjet Advanced Technology Transition Demonstration (ATTD) flight experiment diagnostic package

    NASA Astrophysics Data System (ADS)

    Kriebel, M. M.; Stevens, N. J.

    1992-07-01

    TRW, Rocket Research Co and Defense Systems Inc are developing a space qualified 30-kW class arcjet flight unit as a part of the Arcjet ATTD program. During space operation the package will measure plume deposition and contamination, electromagnetic interference, thermal radiation, arcjet thruster performance, and plume heating in order to quantify arcjet operational interactions. The Electric Propulsion Space Experiment (ESEX) diagnostic package is described. The goals of ESEX are the demonstration of a high powered arcjet performance and the measurement of potential arcjet-spacecraft interactions which cannot be determined in ground facilities. Arcjet performance, plume characterization, thermal radiation flux and the electromagnetic interference (EMI) experiment as well as experiment operations with a preliminary operations plan are presented.

  13. Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics

    NASA Astrophysics Data System (ADS)

    Sundaram, Venkatesh

    The fundamental motivation for this dissertation is to address the widening interconnect gap between integrated circuit (IC) demands and package substrates specifically for high frequency digital-RF systems applications. Moore's law for CMOS ICs predicts that transistor density on ICs will double approximately every 18 months. Packaging of ICs at the 32nm and 22nm nodes in the next few years will require 20mum (peripheral) and 80mum (area array) I/O pad pitch on the IC, which must be matched by flip-chip interconnection and substrate wiring pad pitch of the same 20-80mum dimension. System on a Package (SOP) technology pioneered by Georgia Tech PRC enables future "mega-function" electronic and bio-electronic systems through ultra-thin film component integration from the current 50/cm2 to over 10000/cm2. This puts added wiring density and performance demands on the substrate. The other driving force in this thesis research is the increasing adoption of high frequency wireless and wired communication pushing the need for package substrate materials that are stable into multiple GHz frequencies. The current state-of-the-art in IC package substrates is at 20mum lines/spaces and 50-60mum microvia diameter using epoxy dielectrics with loss tangent above 0.01. The research targets are to overcome the barriers of current technologies and demonstrate a set of advanced materials and process technologies capable of 5-10mum lines and spaces, and 10-30mum diameter microvias in a multilayer 3-D wiring substrate using 10-25mum thin film dielectrics with loss tangent in the <0.005. The research elements are organized as follows with a clear focus on understanding and characterization of fundamental materials structure-processing-property relationships and interfaces to achieve the next generation targets: (1) Low CTE Core Substrate. (2) Low Loss Dielectrics with 25mum and smaller microvias. (3) Sub-10mum Width Cu Conductors. (4) Integration of the various dielectric and conductor

  14. Advances in molecular quantum chemistry contained in the Q-Chem 4 program package

    NASA Astrophysics Data System (ADS)

    Shao, Yihan; Gan, Zhengting; Epifanovsky, Evgeny; Gilbert, Andrew T. B.; Wormit, Michael; Kussmann, Joerg; Lange, Adrian W.; Behn, Andrew; Deng, Jia; Feng, Xintian; Ghosh, Debashree; Goldey, Matthew; Horn, Paul R.; Jacobson, Leif D.; Kaliman, Ilya; Khaliullin, Rustam Z.; Kuś, Tomasz; Landau, Arie; Liu, Jie; Proynov, Emil I.; Rhee, Young Min; Richard, Ryan M.; Rohrdanz, Mary A.; Steele, Ryan P.; Sundstrom, Eric J.; Woodcock, H. Lee, III; Zimmerman, Paul M.; Zuev, Dmitry; Albrecht, Ben; Alguire, Ethan; Austin, Brian; Beran, Gregory J. O.; Bernard, Yves A.; Berquist, Eric; Brandhorst, Kai; Bravaya, Ksenia B.; Brown, Shawn T.; Casanova, David; Chang, Chun-Min; Chen, Yunqing; Chien, Siu Hung; Closser, Kristina D.; Crittenden, Deborah L.; Diedenhofen, Michael; DiStasio, Robert A., Jr.; Do, Hainam; Dutoi, Anthony D.; Edgar, Richard G.; Fatehi, Shervin; Fusti-Molnar, Laszlo; Ghysels, An; Golubeva-Zadorozhnaya, Anna; Gomes, Joseph; Hanson-Heine, Magnus W. D.; Harbach, Philipp H. P.; Hauser, Andreas W.; Hohenstein, Edward G.; Holden, Zachary C.; Jagau, Thomas-C.; Ji, Hyunjun; Kaduk, Benjamin; Khistyaev, Kirill; Kim, Jaehoon; Kim, Jihan; King, Rollin A.; Klunzinger, Phil; Kosenkov, Dmytro; Kowalczyk, Tim; Krauter, Caroline M.; Lao, Ka Un; Laurent, Adèle D.; Lawler, Keith V.; Levchenko, Sergey V.; Lin, Ching Yeh; Liu, Fenglai; Livshits, Ester; Lochan, Rohini C.; Luenser, Arne; Manohar, Prashant; Manzer, Samuel F.; Mao, Shan-Ping; Mardirossian, Narbe; Marenich, Aleksandr V.; Maurer, Simon A.; Mayhall, Nicholas J.; Neuscamman, Eric; Oana, C. Melania; Olivares-Amaya, Roberto; O'Neill, Darragh P.; Parkhill, John A.; Perrine, Trilisa M.; Peverati, Roberto; Prociuk, Alexander; Rehn, Dirk R.; Rosta, Edina; Russ, Nicholas J.; Sharada, Shaama M.; Sharma, Sandeep; Small, David W.; Sodt, Alexander; Stein, Tamar; Stück, David; Su, Yu-Chuan; Thom, Alex J. W.; Tsuchimochi, Takashi; Vanovschi, Vitalii; Vogt, Leslie; Vydrov, Oleg; Wang, Tao; Watson, Mark A.; Wenzel, Jan; White, Alec; Williams, Christopher F.; Yang, Jun; Yeganeh, Sina; Yost, Shane R.; You, Zhi-Qiang; Zhang, Igor Ying; Zhang, Xing; Zhao, Yan; Brooks, Bernard R.; Chan, Garnet K. L.; Chipman, Daniel M.; Cramer, Christopher J.; Goddard, William A., III; Gordon, Mark S.; Hehre, Warren J.; Klamt, Andreas; Schaefer, Henry F., III; Schmidt, Michael W.; Sherrill, C. David; Truhlar, Donald G.; Warshel, Arieh; Xu, Xin; Aspuru-Guzik, Alán; Baer, Roi; Bell, Alexis T.; Besley, Nicholas A.; Chai, Jeng-Da; Dreuw, Andreas; Dunietz, Barry D.; Furlani, Thomas R.; Gwaltney, Steven R.; Hsu, Chao-Ping; Jung, Yousung; Kong, Jing; Lambrecht, Daniel S.; Liang, WanZhen; Ochsenfeld, Christian; Rassolov, Vitaly A.; Slipchenko, Lyudmila V.; Subotnik, Joseph E.; Van Voorhis, Troy; Herbert, John M.; Krylov, Anna I.; Gill, Peter M. W.; Head-Gordon, Martin

    2015-01-01

    A summary of the technical advances that are incorporated in the fourth major release of the Q-Chem quantum chemistry program is provided, covering approximately the last seven years. These include developments in density functional theory methods and algorithms, nuclear magnetic resonance (NMR) property evaluation, coupled cluster and perturbation theories, methods for electronically excited and open-shell species, tools for treating extended environments, algorithms for walking on potential surfaces, analysis tools, energy and electron transfer modelling, parallel computing capabilities, and graphical user interfaces. In addition, a selection of example case studies that illustrate these capabilities is given. These include extensive benchmarks of the comparative accuracy of modern density functionals for bonded and non-bonded interactions, tests of attenuated second order Møller-Plesset (MP2) methods for intermolecular interactions, a variety of parallel performance benchmarks, and tests of the accuracy of implicit solvation models. Some specific chemical examples include calculations on the strongly correlated Cr2 dimer, exploring zeolite-catalysed ethane dehydrogenation, energy decomposition analysis of a charged ter-molecular complex arising from glycerol photoionisation, and natural transition orbitals for a Frenkel exciton state in a nine-unit model of a self-assembling nanotube.

  15. A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process

    NASA Astrophysics Data System (ADS)

    Mert Torunbalci, Mustafa; Emre Alper, Said; Akin, Tayfun

    2015-12-01

    This paper presents a novel, inherently simple, and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where a single SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a single glass cap wafer is used for hermetic encapsulation and routing metallization. Hermetic encapsulation can be achieved either with the silicon-glass anodic or Au-Si eutectic bonding techniques. The dies sealed with anodic and Au-Si eutectic bonding provide a low vertical feedthrough resistance around 50 Ω. Glass-to-silicon anodically and Au-Si eutectic bonded seals yield a very stable cavity pressure below 10 mTorr with thin-film getters, which are measured to be stable even after 311 d. The package pressure can be adjusted from 5 mTorr to 20 Torr by using different outgassing, cavity depth, and gettering options. The packaging yield is observed to be around 64% and 84% for the anodic and Au-Si eutectic packages, respectively. The average shear strength of the anodic and eutectic packages is measured to be higher than 17 MPa and 42 MPa, respectively. Temperature cycling, high temperature storage, and ultra-high temperature shock tests result in no degradation in the hermeticity of the packaged chips, proving perfect thermal reliability.

  16. AISI/DOE Advanced Process Control Program Vol. 3 of 6 Microstructure Engineering in Hot Strip Mills, Part 1 of 2: Integrated Mathematical Model

    SciTech Connect

    J.K. Brimacombe; I.V. Samarasekera; E.B. Hawbolt; T.R. Meadowcroft; M. Militzer; W.J. Pool; D.Q. Jin

    1999-07-31

    This report describes the work of developing an integrated model used to predict the thermal history, deformation, roll forces, microstructural evolution and mechanical properties of steel strip in a hot-strip mill. This achievement results from a joint research effort that is part of the American Iron and Steel Institute's (AIS) Advanced Process Control Program, a collaboration between the U.S. DOE and fifteen North American Steelmakers.

  17. Edible packaging materials.

    PubMed

    Janjarasskul, Theeranun; Krochta, John M

    2010-01-01

    Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

  18. Advances in cryogenic engineering. Vols. 37A & 37B - Proceedings of the 1991 Cryogenic Engineering Conference, Univ. of Alabama, Huntsville, June 11-14, 1991

    NASA Astrophysics Data System (ADS)

    Fast, Ronald W.

    The present volume on advances in cryogenic engineering discusses heat and mass transfer in helium, heat transfer in cryogenic fluids, thermoacoustic oscillations, and insulation. Attention is given to applications of superconductivity with reference to magnetic stability and coil protection, cryogenic techniques, and refrigeration for electronics and superconducting systems. Topics addressed include compressors, expanders, and pumps for liquid helium, magnetic refrigerators, pulse tube refrigerators, and cryocoolers. Also examined are properties of cryogenic fluids, cryogenic applications in transportion and space science and technology, and cryogenic instrumentation.

  19. OSA Proceedings on Advanced Solid-State Lasers. Vol. 10 - Proceedings of the Topical Meeting, Hilton Head, SC, Mar. 18-20, 1991

    SciTech Connect

    Dube, G.; Chase, L. Lawrence Livermore National Laboratory, Livermore, CA )

    1991-01-01

    The present volume on advanced solid-state lasers discusses Cr(3+), Cr(4+), short-pulse, titanium, F-center, mid-IR, and diode-pumped lasers, and nonlinear optics. Attention is given to the stabilization and a spectral characterization of an alexandrite laser for water vapor lidar measurements, crystal growth and spectroscopy of Cr:LiBaAlF6, a Q-switched tunable forsterite laser, and electron paramagnetic resonance spectroscopy of chromium-doped forsterite. Topics addressed include efficient frequency doubling of a self-starting additive-pulse mode-locked diode-pumped Nd:YAG laser, recent advances in Ti:Al2O3 unstable-resonator lasers, all-solid-state operation of a CW Ti:Al2O3 laser, and upconversion studies of flashlamp-pumped Cr,T,Ho:YAG. Also discussed are the top output parameters of an Ho-laser, spectroscopy and the 3-micron laser potential of Er crystals, the pulsed operation of microchip lasers, and blue optical parametric generation in LiB3O5.

  20. AISI/DOE Advanced Process Control Program Vol. 1 of 6: Optical Sensors and Controls for Improved Basic Oxygen Furnace Operations

    SciTech Connect

    Sarah Allendorf; David Ottesen; Donald Hardesty

    2002-01-31

    The development of an optical sensor for basic oxygen furnace (BOF) off-gas composition and temperature in this Advanced Process Control project has been a laboratory spectroscopic method evolve into a pre-commercialization prototype sensor system. The sensor simultaneously detects an infrared tunable diode laser ITDL beam transmitted through the process off-gas directly above the furnace mouth, and the infrared greybody emission from the particulate-laden off-gas stream. Following developmental laboratory and field-testing, the sensor prototype was successfully tested in four long-term field trials at Bethlehem Steel's Sparrows Point plant in Baltimore, MD> The resulting optical data were analyzed and reveal correlations with four important process variables: (1) bath turndown temperature; (2) carbon monoxide post-combustion control; (2) bath carbon concentration; and (4) furnace slopping behavior. The optical sensor measurement of the off-gas temperature is modestly correlated with bath turndown temperature. A detailed regression analysis of over 200 heats suggests that a dynamic control level of +25 Degree F can be attained with a stand-alone laser-based optical sensor. The ability to track off-gas temperatures to control post-combustion lance practice is also demonstrated, and may be of great use in optimizing post-combustion efficiency in electric furnace steelmaking operations. In addition to the laser-based absorption spectroscopy data collected by this sensor, a concurrent signal generated by greybody emission from the particle-laden off-gas was collected and analyzed. A detailed regression analysis shows an excellent correlation of a single variable with final bath turndown carbon concentration. Extended field trials in 1998 and early 1999 show a response range from below 0.03% to a least 0.15% carbon concentration with a precision of +0.0007%. Finally, a strong correlation between prolonged drops in the off-gas emission signal and furnace slopping events

  1. Forensic engineering of advanced polymeric materials. Part III - Biodegradation of thermoformed rigid PLA packaging under industrial composting conditions.

    PubMed

    Musioł, Marta; Sikorska, Wanda; Adamus, Grazyna; Janeczek, Henryk; Richert, Jozef; Malinowski, Rafal; Jiang, Guozhan; Kowalczuk, Marek

    2016-06-01

    This paper presents a forensic engineering study on the biodegradation behaviour of prototype packaging thermoformed from PLA-extruded film and plain PLA film under industrial composting conditions. Hydrolytic degradation in water was conducted for reference. The effects of composting duration on changes in molar mass, glass transition temperature and degree of crystallinity of the polymeric material were monitored using gel permeation chromatography (GPC) and differential scanning calorimetry (DSC). The chemical structure of water soluble degradation products of the polymeric material was determined using nuclear magnetic resonance (NMR) and electrospray ionization mass spectrometry (ESI-MS). The results show that the biodegradation process is less dependent on the thermoforming process of PLA and more dependent on the composting/degradation conditions that are applied. The increase in the dispersity index, leading to the bimodal molar mass distribution profile, suggests an autocatalytic hydrolysis effect at the early stage of the composting process, during which the bulk hydrolysis mechanism dominantly operates. Both the prototype PLA-packaging and PLA rigid film samples were shown to have a gradual increase in opacity due to an increase in the degree of crystallinity. PMID:27103398

  2. Forensic engineering of advanced polymeric materials. Part III - Biodegradation of thermoformed rigid PLA packaging under industrial composting conditions.

    PubMed

    Musioł, Marta; Sikorska, Wanda; Adamus, Grazyna; Janeczek, Henryk; Richert, Jozef; Malinowski, Rafal; Jiang, Guozhan; Kowalczuk, Marek

    2016-06-01

    This paper presents a forensic engineering study on the biodegradation behaviour of prototype packaging thermoformed from PLA-extruded film and plain PLA film under industrial composting conditions. Hydrolytic degradation in water was conducted for reference. The effects of composting duration on changes in molar mass, glass transition temperature and degree of crystallinity of the polymeric material were monitored using gel permeation chromatography (GPC) and differential scanning calorimetry (DSC). The chemical structure of water soluble degradation products of the polymeric material was determined using nuclear magnetic resonance (NMR) and electrospray ionization mass spectrometry (ESI-MS). The results show that the biodegradation process is less dependent on the thermoforming process of PLA and more dependent on the composting/degradation conditions that are applied. The increase in the dispersity index, leading to the bimodal molar mass distribution profile, suggests an autocatalytic hydrolysis effect at the early stage of the composting process, during which the bulk hydrolysis mechanism dominantly operates. Both the prototype PLA-packaging and PLA rigid film samples were shown to have a gradual increase in opacity due to an increase in the degree of crystallinity.

  3. Advances in molten salt chemistry: Vol. 4

    SciTech Connect

    Mamautov, G.; Braunstein, J.

    1981-01-01

    This book presents information on the following topics: electronic properties of solutions of liquid metals and ionic melts; metal-metal halide, metal-chalcogen, and metal-metal solutions; metallic models; the use of high pressure in the study of molten salts; the purpose of high pressure experimentation; melting point curves and phase diagrams; compressibilities and equations of state; electrical conductivity measurements; physical chemistry and electrochemistry of alkali carbonate melts; equilibrium properties of molten carbonates; electrochemical characteristics and corrosion; stability of ceramics; some new molten salt electrolytic processes; sodium metal production by the use of a beta-alumina diaphragm; recovery of metallic sodium or caustic soda and sulfur from flue gas; high temperature electrolysis of water; and LiCl electrolysis by the use of a bipolar liquid metal electrode.

  4. Thin film CIGS photovoltaic modules: monolithic integration and advanced packaging for high performance, high reliability and low cost

    NASA Astrophysics Data System (ADS)

    Eldada, Louay

    2011-01-01

    In recent years, thin-film photovoltaic companies started realizing their low manufacturing cost potential, and have been grabbing an increasingly larger market share. Copper Indium Gallium Selenide (CIGS) is the most promising thin-film PV material, having demonstrated the highest energy conversion efficiency in both cells and modules. However, most CIGS manufacturers still face the challenge of delivering a reliable and rapid manufacturing process that can scale effectively and deliver on the promise of this material system. HelioVolt has developed a reactive transfer process for CIGS absorber formation that has the benefits of good compositional control, and a fast high-quality CIGS reaction. The reactive transfer process is a two stage CIGS fabrication method. Precursor films are deposited onto substrates and reusable cover plates in the first stage, while in the second stage the CIGS layer is formed by rapid heating with Se confinement. HelioVolt also developed best-in-class packaging technologies that provide unparalleled environmental stability. High quality CIGS films with large grains were fabricated on the production line, and high-performance highreliability monolithic modules with a form factor of 120 cm × 60 cm are being produced at high yield and low cost. With conversion efficiency levels around 14% for cells and 12% for modules, HelioVolt is commercializing the process on its first production line with 20 MW capacity, and is planning its next GW-scale factory.

  5. Environmental Loss Characterization of an Advanced Stirling Convertor (ASC-E2) Insulation Package Using a Mock Heater Head

    NASA Technical Reports Server (NTRS)

    Schifer, Nicholas A.; Briggs, Maxwell H.

    2012-01-01

    The U.S. Department of Energy (DOE) and Lockheed Martin Space Systems Company (LMSSC) have been developing the Advanced Stirling Radioisotope Generator (ASRG) for use as a power system for space science missions. This generator would use two highefficiency Advanced Stirling Convertors (ASCs), developed by Sunpower Inc. and NASA Glenn Research Center (GRC). As part of ground testing of these ASCs, different operating conditions are used to simulate expected mission conditions. These conditions require achieving a specified electrical power output for a given net heat input. While electrical power output can be precisely quantified, thermal power input to the Stirling cycle cannot be directly measured. In an effort to improve net heat input predictions, the Mock Heater Head was developed with the same relative thermal paths as a convertor using a conducting rod to represent the Stirling cycle and tested to provide a direct comparison to numerical and empirical models used to predict convertor net heat input. The Mock Heater Head also served as the pathfinder for a higher fidelity version of validation test hardware, known as the Thermal Standard. This paper describes how the Mock Heater Head was tested and utilized to validate a process for the Thermal Standard.

  6. Packaging and Embedded Electronics for the Next Generation

    NASA Technical Reports Server (NTRS)

    Sampson, Michael J.

    2010-01-01

    This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

  7. High Frequency Electronic Packaging Technology

    NASA Technical Reports Server (NTRS)

    Herman, M.; Lowry, L.; Lee, K.; Kolawa, E.; Tulintseff, A.; Shalkhauser, K.; Whitaker, J.; Piket-May, M.

    1994-01-01

    Commercial and government communication, radar, and information systems face the challenge of cost and mass reduction via the application of advanced packaging technology. A majority of both government and industry support has been focused on low frequency digital electronics.

  8. Scoring Package

    National Institute of Standards and Technology Data Gateway

    NIST Scoring Package (PC database for purchase)   The NIST Scoring Package (Special Database 1) is a reference implementation of the draft Standard Method for Evaluating the Performance of Systems Intended to Recognize Hand-printed Characters from Image Data Scanned from Forms.

  9. System packager strategies

    SciTech Connect

    Hennagir, T.

    1995-03-01

    Advances in combined equipment technologies, the ability to supply fuel flexibility and new financial support structures are helping power systems packagers meet a diverse series of client and project needs. Systems packagers continue to capture orders for various size power plants around the globe. A competitive buyer`s market remains the order of the day. In cogeneration markets, clients continue to search for efficiency rather than specific output for inside-the-fence projects. Letter-perfect service remains a requisite as successful suppliers strive to meet customers` ever-changing needs for thermal and power applications.

  10. Components of Adenovirus Genome Packaging

    PubMed Central

    Ahi, Yadvinder S.; Mittal, Suresh K.

    2016-01-01

    Adenoviruses (AdVs) are icosahedral viruses with double-stranded DNA (dsDNA) genomes. Genome packaging in AdV is thought to be similar to that seen in dsDNA containing icosahedral bacteriophages and herpesviruses. Specific recognition of the AdV genome is mediated by a packaging domain located close to the left end of the viral genome and is mediated by the viral packaging machinery. Our understanding of the role of various components of the viral packaging machinery in AdV genome packaging has greatly advanced in recent years. Characterization of empty capsids assembled in the absence of one or more components involved in packaging, identification of the unique vertex, and demonstration of the role of IVa2, the putative packaging ATPase, in genome packaging have provided compelling evidence that AdVs follow a sequential assembly pathway. This review provides a detailed discussion on the functions of the various viral and cellular factors involved in AdV genome packaging. We conclude by briefly discussing the roles of the empty capsids, assembly intermediates, scaffolding proteins, portal vertex and DNA encapsidating enzymes in AdV assembly and packaging. PMID:27721809

  11. Experiment Safety Assurance Package for Mixed Oxide Fuel Irradiation in an Average Power Position (I-24) in the Advanced Test Reactor

    SciTech Connect

    J. M . Ryskamp; R. C. Howard; R. C. Pedersen; S. T. Khericha

    1998-10-01

    The Fissile Material Disposition Program Light Water Reactor Mixed Oxide Fuel Irradiation Test Project Plan details a series of test irradiations designed to investigate the use of weapons-grade plutonium in MOX fuel for light water reactors (LWR) (Cowell 1996a, Cowell 1997a, Thoms 1997a). Commercial MOX fuel has been successfully used in overseas reactors for many years; however, weapons-derived test fuel contains small amounts of gallium (about 2 parts per million). A concern exists that the gallium may migrate out of the fuel and into the clad, inducing embrittlement. For preliminary out-of-pile experiments, Wilson (1997) states that intermetallic compound formation is the principal interaction mechanism between zircaloy cladding and gallium. This interaction is very limited by the low mass of gallium, so problems are not expected with the zircaloy cladding, but an in-pile experiment is needed to confirm the out-of-pile experiments. Ryskamp (1998) provides an overview of this experiment and its documentation. The purpose of this Experiment Safety Assurance Package (ESAP) is to demonstrate the safe irradiation and handling of the mixed uranium and plutonium oxide (MOX) Fuel Average Power Test (APT) experiment as required by Advanced Test Reactor (ATR) Technical Safety Requirement (TSR) 3.9.1 (LMITCO 1998). This ESAP addresses the specific operation of the MOX Fuel APT experiment with respect to the operating envelope for irradiation established by the Upgraded Final Safety Analysis Report (UFSAR) Lockheed Martin Idaho Technologies Company (LMITCO 1997a). Experiment handling activities are discussed herein.

  12. Sterile Product Packaging and Delivery Systems.

    PubMed

    Akers, Michael J

    2015-01-01

    Both conventional and more advanced product container and delivery systems are the focus of this brief article. Six different product container systems will be discussed, plus advances in primary packaging for special delivery systems and needle technology. PMID:26891564

  13. Sterile Product Packaging and Delivery Systems.

    PubMed

    Akers, Michael J

    2015-01-01

    Both conventional and more advanced product container and delivery systems are the focus of this brief article. Six different product container systems will be discussed, plus advances in primary packaging for special delivery systems and needle technology.

  14. Packaging the MAMA module

    NASA Astrophysics Data System (ADS)

    Seals, J. Dennis

    1994-10-01

    The MAMA (Mixed Arithmetic, Multiprocessing Array) module is being developed to evaluate new packaging technologies and processing paradigms for advanced military processing systems. The architecture supports a tight mix of signal, data,and I/O processing at GFLOP throughput rates. It is fabricated using only commercial-on-the-sehlf (COTS) chips and will provide a high level of durability. Its attributes are largely the result of two new interconnection and packaging technologies. Chip-in-board packaging is used to reduce local x-y communication delays and solder joints, while significantly improving board-level packaging density. A unique 3-D interconnection technology called a cross-over cell has been developed to reduce board-to-board communication delays, drive power, glue logic, and card-edge pin-outs. These technologies enable true 3-D structures that are form, fit and connector compatible with conventional line-replacable modules. The module's design rational, packaging technology, and basic architecture will be presented in this paper.

  15. Evaluation of Five Microcomputer CAD Packages.

    ERIC Educational Resources Information Center

    Leach, James A.

    1987-01-01

    Discusses the similarities, differences, advanced features, applications and number of users of five microcomputer computer-aided design (CAD) packages. Included are: "AutoCAD (V.2.17)"; "CADKEY (V.2.0)"; "CADVANCE (V.1.0)"; "Super MicroCAD"; and "VersaCAD Advanced (V.4.00)." Describes the evaluation of the packages and makes recommendations for…

  16. Active and intelligent packaging systems for a modern society.

    PubMed

    Realini, Carolina E; Marcos, Begonya

    2014-11-01

    Active and intelligent packaging systems are continuously evolving in response to growing challenges from a modern society. This article reviews: (1) the different categories of active and intelligent packaging concepts and currently available commercial applications, (2) latest packaging research trends and innovations, and (3) the growth perspectives of the active and intelligent packaging market. Active packaging aiming at extending shelf life or improving safety while maintaining quality is progressing towards the incorporation of natural active agents into more sustainable packaging materials. Intelligent packaging systems which monitor the condition of the packed food or its environment are progressing towards more cost-effective, convenient and integrated systems to provide innovative packaging solutions. Market growth is expected for active packaging with leading shares for moisture absorbers, oxygen scavengers, microwave susceptors and antimicrobial packaging. The market for intelligent packaging is also promising with strong gains for time-temperature indicator labels and advancements in the integration of intelligent concepts into packaging materials. PMID:25034453

  17. Packaged Food

    NASA Technical Reports Server (NTRS)

    1976-01-01

    After studies found that many elderly persons don't eat adequately because they can't afford to, they have limited mobility, or they just don't bother, Innovated Foods, Inc. and JSC developed shelf-stable foods processed and packaged for home preparation with minimum effort. Various food-processing techniques and delivery systems are under study and freeze dried foods originally used for space flight are being marketed. (See 77N76140)

  18. Seafood Packaging

    NASA Technical Reports Server (NTRS)

    1996-01-01

    NASA's Technology Transfer Office at Stennis Space Center worked with a New Orleans seafood packaging company to develop a container to improve the shipping longevity of seafood, primarily frozen and fresh fish, while preserving the taste. A NASA engineer developed metalized heat resistant polybags with thermal foam liners using an enhanced version of the metalized mylar commonly known as 'space blanket material,' which was produced during the Apollo era.

  19. New advancements in 793 nm fiber-coupled modules for Th fiber laser pumping, including packages optimized for low SWaP applications

    NASA Astrophysics Data System (ADS)

    Ebert, Chris; Guiney, Tina; Irwin, David; Patterson, Steve

    2016-05-01

    Targeted at the 793nm absorption band, DILAS Diode Laser, Inc. offers a range of products specifically designed for Thulium fiber laser pumping, spanning from 12 W to <300W of pump power and coupled into fiber sizes starting at 105um and upwards. A variety of different diode architectures are utilized, ranging from single-emitters, conduction-cooled bars, and DILAS's T-bar structure extended to the 793nm range, resulting in a wide variety of power levels and packaging options to support different applications. As IRCM for airborne platforms is a major application for Tm fiber lasers, packages optimized for low SWaP will be presented, which utilize a combination of the T-bar structure and macrochannel coolers specifically designed for compact, lightweight applications. Examples and results of Tm fiber lasers pumped using DILAS diodes will also be presented and discussed.

  20. Reflective Packaging

    NASA Technical Reports Server (NTRS)

    1994-01-01

    The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

  1. Plutonium packaging and long-term storage

    NASA Astrophysics Data System (ADS)

    Lloyd, Jane A.; Wedman, Douglas E.

    2000-07-01

    It has been demonstrated that the Advanced Recovery and Integrated Extraction System (ARIES) packaging line at Los Alamos National Laboratory can successfully package plutonium to meet DOE requirements for safe long-term storage. The ARIES system has just completed the disassembly and conversion of its first cores ("pits") for nuclear weapons.

  2. Index to the Journal of American Indian Education, Vol. 1, No. 1 - Vol. 8, No. 1.

    ERIC Educational Resources Information Center

    Loomis, Charlotte Ann

    All articles (112) that appeared in the "Journal of American Indian Education" (JAIE), Vol. 1., No. 1 (June 1961) through Vol. 8, No 1 (October 1968) are indexed and annotated. The publication is divided into 3 parts: (1) annotations listed in order of appearance in JAIE by volume, number, and page; (2) author index; and (3) subject index. Later…

  3. Packaging Your Training Materials

    ERIC Educational Resources Information Center

    Espeland, Pamela

    1977-01-01

    The types of packaging and packaging materials to use for training materials should be determined during the planning of the training programs, according to the packaging market. Five steps to follow in shopping for packaging are presented, along with a list of packaging manufacturers. (MF)

  4. Tamper indicating packaging

    SciTech Connect

    Baumann, M.J.; Bartberger, J.C.; Welch, T.D.

    1994-08-01

    Protecting sensitive items from undetected tampering in an unattended environment is crucial to the success of non-proliferation efforts relying on the verification of critical activities. Tamper Indicating Packaging (TIP) technologies are applied to containers, packages, and equipment that require an indication of a tamper attempt. Examples include: the transportation and storage of nuclear material, the operation and shipment of surveillance equipment and monitoring sensors, and the retail storage of medicine and food products. The spectrum of adversarial tampering ranges from attempted concealment of a pin-hole sized penetration to the complete container replacement, which would involve counterfeiting efforts of various degrees. Sandia National Laboratories (SNL) has developed a technology base for advanced TIP materials, sensors, designs, and processes which can be adapted to various future monitoring systems. The purpose of this technology base is to investigate potential new technologies, and to perform basic research of advanced technologies. This paper will describe the theory of TIP technologies and recent investigations of TIP technologies at SNL.

  5. NASA Electronic Parts and Packaging Program

    NASA Technical Reports Server (NTRS)

    Kayali, Sammy

    2000-01-01

    NEPP program objectives are to: (1) Access the reliability of newly available electronic parts and packaging technologies for usage on NASA projects through validations, assessments, and characterizations, and the development of test methods/tools; (2)Expedite infusion paths for advanced (emerging) electronic parts and packaging technologies by evaluations of readiness for manufacturability and project usage consideration; (3) Provide NASA projects with technology selection, application, and validation guidelines for electronic parts and packaging hardware and processes; nd (4) Retain and disseminate electronic parts and packaging quality assurance, reliability validations, tools, and availability information to the NASA community.

  6. Science packages

    NASA Astrophysics Data System (ADS)

    1997-01-01

    Primary science teachers in Scotland have a new updating method at their disposal with the launch of a package of CDi (Compact Discs Interactive) materials developed by the BBC and the Scottish Office. These were a response to the claim that many primary teachers felt they had been inadequately trained in science and lacked the confidence to teach it properly. Consequently they felt the need for more in-service training to equip them with the personal understanding required. The pack contains five disks and a printed user's guide divided up as follows: disk 1 Investigations; disk 2 Developing understanding; disks 3,4,5 Primary Science staff development videos. It was produced by the Scottish Interactive Technology Centre (Moray House Institute) and is available from BBC Education at £149.99 including VAT. Free Internet distribution of science education materials has also begun as part of the Global Schoolhouse (GSH) scheme. The US National Science Teachers' Association (NSTA) and Microsoft Corporation are making available field-tested comprehensive curriculum material including 'Micro-units' on more than 80 topics in biology, chemistry, earth and space science and physics. The latter are the work of the Scope, Sequence and Coordination of High School Science project, which can be found at http://www.gsh.org/NSTA_SSandC/. More information on NSTA can be obtained from its Web site at http://www.nsta.org.

  7. An Arbitrary Precision Computation Package

    2003-06-14

    This package permits a scientist to perform computations using an arbitrarily high level of numeric precision (the equivalent of hundreds or even thousands of digits), by making only minor changes to conventional C++ or Fortran-90 soruce code. This software takes advantage of certain properties of IEEE floating-point arithmetic, together with advanced numeric algorithms, custom data types and operator overloading. Also included in this package is the "Experimental Mathematician's Toolkit", which incorporates many of these facilitiesmore » into an easy-to-use interactive program.« less

  8. Types, production and assessment of biobased food packaging materials

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Food packaging performs an essential function, but packaging materials can have a negative impact on the environment. This book describes the latest advances in bio-based food packaging materials. Book provides a comprehensive review on bio-based, biodegradable and recycled materials and discusses t...

  9. Review: nanocomposites in food packaging.

    PubMed

    Arora, Amit; Padua, G W

    2010-01-01

    The development of nanocomposites is a new strategy to improve physical properties of polymers, including mechanical strength, thermal stability, and gas barrier properties. The most promising nanoscale size fillers are montmorillonite and kaolinite clays. Graphite nanoplates are currently under study. In food packaging, a major emphasis is on the development of high barrier properties against the migration of oxygen, carbon dioxide, flavor compounds, and water vapor. Decreasing water vapor permeability is a critical issue in the development of biopolymers as sustainable packaging materials. The nanoscale plate morphology of clays and other fillers promotes the development of gas barrier properties. Several examples are cited. Challenges remain in increasing the compatibility between clays and polymers and reaching complete dispersion of nanoplates. Nanocomposites may advance the utilization of biopolymers in food packaging. PMID:20492194

  10. CIRF Publications, Vol. 12, No. 5.

    ERIC Educational Resources Information Center

    International Labour Office, Geneva (Switzerland).

    CIRF Publications, Vol. 12, No. 5 is a collection of 80 abstracts giving particular attention to education, training, and economic growth in developing countries, Iran, Japan, Kenya, the Solomon Islands, and Sri Lanka; vocational rehabilitation in Italy, Spain, the United Kingdom, and the U. S. A.; agriculture in Chad, developing countries, and…

  11. volBrain: An Online MRI Brain Volumetry System.

    PubMed

    Manjón, José V; Coupé, Pierrick

    2016-01-01

    The amount of medical image data produced in clinical and research settings is rapidly growing resulting in vast amount of data to analyze. Automatic and reliable quantitative analysis tools, including segmentation, allow to analyze brain development and to understand specific patterns of many neurological diseases. This field has recently experienced many advances with successful techniques based on non-linear warping and label fusion. In this work we present a novel and fully automatic pipeline for volumetric brain analysis based on multi-atlas label fusion technology that is able to provide accurate volumetric information at different levels of detail in a short time. This method is available through the volBrain online web interface (http://volbrain.upv.es), which is publically and freely accessible to the scientific community. Our new framework has been compared with current state-of-the-art methods showing very competitive results. PMID:27512372

  12. volBrain: An Online MRI Brain Volumetry System.

    PubMed

    Manjón, José V; Coupé, Pierrick

    2016-01-01

    The amount of medical image data produced in clinical and research settings is rapidly growing resulting in vast amount of data to analyze. Automatic and reliable quantitative analysis tools, including segmentation, allow to analyze brain development and to understand specific patterns of many neurological diseases. This field has recently experienced many advances with successful techniques based on non-linear warping and label fusion. In this work we present a novel and fully automatic pipeline for volumetric brain analysis based on multi-atlas label fusion technology that is able to provide accurate volumetric information at different levels of detail in a short time. This method is available through the volBrain online web interface (http://volbrain.upv.es), which is publically and freely accessible to the scientific community. Our new framework has been compared with current state-of-the-art methods showing very competitive results.

  13. volBrain: An Online MRI Brain Volumetry System

    PubMed Central

    Manjón, José V.; Coupé, Pierrick

    2016-01-01

    The amount of medical image data produced in clinical and research settings is rapidly growing resulting in vast amount of data to analyze. Automatic and reliable quantitative analysis tools, including segmentation, allow to analyze brain development and to understand specific patterns of many neurological diseases. This field has recently experienced many advances with successful techniques based on non-linear warping and label fusion. In this work we present a novel and fully automatic pipeline for volumetric brain analysis based on multi-atlas label fusion technology that is able to provide accurate volumetric information at different levels of detail in a short time. This method is available through the volBrain online web interface (http://volbrain.upv.es), which is publically and freely accessible to the scientific community. Our new framework has been compared with current state-of-the-art methods showing very competitive results. PMID:27512372

  14. Recent advances in the EPRI high-concentration photovoltaic program. Volume 1, Cell design and fabrication, cell performance, cell packages, and optical system design and fabrication

    SciTech Connect

    McNaughton, W.P.; Richman, R.H.

    1992-02-01

    During the 1970s and early 1980s a promising solar cell technology evolved in the laboratory at Stanford University. The work produced a point-contact photovoltaic cell that has established a number of world record achievements. Since 1984, the Electric Power Research Institute has moved the laboratory concept forward commercial application. The design and processing of the cell has progressed from laboratory device research toward a mass-produced commodity, with concurrent reduction in cost and improvement in uniformity. An extension test program to determine module and array performance and reliability has been put in place. More than 1500 high concentration cells have been produced in the evolutionary process. Approximately 700 of those cells have been or are presently being installed in fully operational modules for field tests. Over 130 modules have been constructed and are in field testing for electrical, thermal or weathering tests. Two full-sized array structures (each containing 60 instrumented ``thermal`` modules) have been constructed and continue to undergo field testing for alignment, performance, and reliability. This two volume report reviews the activities that have occurred in this technology since the issue of the early conceptual design study. The intent is to inform interested readers -- utilities, commercializers, researchers -- as to the primary developments and test results that have been achieved. A considerable body of of ``raw data`` has been included so that interested researchers can draw their own conclusions. Volume 1 discusses design and fabrication of the cell; performance of the cell; design, construction and testing of the cell package and the design, fabrication and testing of the optical system. Volume 2 reviews the module and array programs, discusses other system issues and presents a short review of the technology`s open issues.

  15. Life cycle management of radioactive materials packaging.

    SciTech Connect

    Liu, Y.; Bellamy, S.; Shuler, J.; Decision and Information Sciences; SRL; DOE

    2007-01-01

    The objective of life cycle management of radioactive materials packaging is to ensure the safety functions (i.e. containment of radioactivity, protection against radiation, and criticality safety for fissile contents) during the entire life cycle of the packaging in storage, transportation and disposal. A framework has been developed for life cycle management regarding type B radioactive and fissile materials packaging, drawing upon current US Department of Energy (DOE) storage standards and examples from interim storage of Pu bearing materials in model 9975 transportation packagings. Key issues highlighted during long term storage of Pu bearing materials included gas generation and stability of PuO{sub 2+x}; other operation safety issues highlighted for interim storage of model 9975 transportation packagings included the need to consider a facility design basis fire event and the long term behaviour of packaging components such as Celotex and elastomeric O-ring seals. The principles of aging management are described, and the key attributes and examples of effective aging management programmes are provided based on the guidance documents for license renewal of nuclear power plants. The Packaging Certification Program of DOE Environmental Management, Office of Safety Management and Operations, plans to expand its mission into packaging certification for storage and aging management, as well as application of advanced technology, such as radiofrequency identification, for life cycle management of radioactive materials packagings.

  16. Advances in space biology and medicine. Vol. 1

    NASA Technical Reports Server (NTRS)

    Bonting, Sjoerd L. (Editor)

    1991-01-01

    Topics discussed include the effects of prolonged spaceflights on the human body; skeletal responses to spaceflight; gravity effects on reproduction, development, and aging; neurovestibular physiology in fish; and gravity perception and circumnutation in plants. Attention is also given to the development of higher plants under altered gravitational conditions; the techniques, findings, and theory concerning gravity effects on single cells; protein crystal growth in space; and facilities for animal research in space.

  17. 1973 Advances in Socio-Dental Research. Vol. 1.

    ERIC Educational Resources Information Center

    Goetz, John B., Ed.

    This publication is a collection of abstracts from volumes 6 and 7 (1971 and 1972) of "Oral Research Abstracts," selected because the abstracts contain information relating one of the social sciences with dentistry. The compilation is intended to be useful to epidemiologists, public health workers, and all those who have an interest in the…

  18. Genome packaging in viruses.

    PubMed

    Sun, Siyang; Rao, Venigalla B; Rossmann, Michael G

    2010-02-01

    Genome packaging is a fundamental process in a viral life cycle. Many viruses assemble preformed capsids into which the genomic material is subsequently packaged. These viruses use a packaging motor protein that is driven by the hydrolysis of ATP to condense the nucleic acids into a confined space. How these motor proteins package viral genomes had been poorly understood until recently, when a few X-ray crystal structures and cryo-electron microscopy (cryo-EM) structures became available. Here we discuss various aspects of genome packaging and compare the mechanisms proposed for packaging motors on the basis of structural information. PMID:20060706

  19. Packaging for Food Service

    NASA Technical Reports Server (NTRS)

    Stilwell, E. J.

    1985-01-01

    Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

  20. Waste Package Lifting Calculation

    SciTech Connect

    H. Marr

    2000-05-11

    The objective of this calculation is to evaluate the structural response of the waste package during the horizontal and vertical lifting operations in order to support the waste package lifting feature design. The scope of this calculation includes the evaluation of the 21 PWR UCF (pressurized water reactor uncanistered fuel) waste package, naval waste package, 5 DHLW/DOE SNF (defense high-level waste/Department of Energy spent nuclear fuel)--short waste package, and 44 BWR (boiling water reactor) UCF waste package. Procedure AP-3.12Q, Revision 0, ICN 0, calculations, is used to develop and document this calculation.

  1. On DNA packaging into elastic nanoparticles

    NASA Astrophysics Data System (ADS)

    Li, Long; Wang, Jizeng

    2013-10-01

    In recent years, understanding the process of DNA packaging into elastic nanoparticles is of great interest to advancing practical applications in fields such as drug delivery, global ecology and bacterial pathogenicity. In this study, we adopt a unified continuum and statistical mechanics model by taking into account the effects of DNA bending, electrostatic repulsion between DNA-DNA strands and elastic deformation of the nanoparticles to quantitatively reveal the relation between packaging force, Young's modulus of the nanoparticles and DNA length packaged. We find that particle stiffness can significantly influence the ejection force when the particles are immersed in high electrostatic repulsion solution.

  2. Comparative Packaging Study

    NASA Technical Reports Server (NTRS)

    Perchonok, Michele; Antonini, David

    2008-01-01

    This viewgraph presentation describes a comparative packaging study for use on long duration space missions. The topics include: 1) Purpose; 2) Deliverables; 3) Food Sample Selection; 4) Experimental Design Matrix; 5) Permeation Rate Comparison; and 6) Packaging Material Information.

  3. CH Packaging Operations Manual

    SciTech Connect

    Washington TRU Solutions LLC

    2005-06-13

    This procedure provides instructions for assembling the CH Packaging Drum payload assembly, Standard Waste Box (SWB) assembly, Abnormal Operations and ICV and OCV Preshipment Leakage Rate Tests on the packaging seals, using a nondestructive Helium (He) Leak Test.

  4. Creative Thinking Package

    ERIC Educational Resources Information Center

    Jones, Clive

    1972-01-01

    A look at the latest package from a British managment training organization, which explains and demonstrates creative thinking techniques, including brainstorming. The package, designed for groups of twelve or more, consists of tapes, visuals, and associated exercises. (Editor/JB)

  5. Comparison of different LED Packages

    NASA Astrophysics Data System (ADS)

    Dieker, Henning; Miesner, Christian; Püttjer, Dirk; Bachl, Bernhard

    2007-09-01

    In this paper different technologies for LED packaging are compared, focusing on Chip on Board (COB) and SMD technology. The package technology which is used depends on the LED application. A critical fact in LED technology is the thermal management, especially for high brightness LED applications because the thermal management is important for reliability, lifetime and electrooptical performance of the LED module. To design certain and long life LED applications knowledge of the heat flow from LEDs to the complete application is required. High sophisticated FEM simulations are indispensable for modern development of high power LED applications. We compare simulations of various substrate materials and packaging technologies simulated using FLOTHERM software. Thereby different substrates such as standard FR4, ceramic and metal core printed circuit boards are considered. For the verification of the simulated results and the testing of manufactured modules, advanced measurement tools are required. We show different ways to experimentally characterize the thermal behavior of LED modules. The thermal path is determined by the transient thermal analysis using the MicReD T3Ster analyzer. Afterwards it will be compared to the conventional method using thermocouples. The heat distribution over the module is investigated by an IR-Camera. We demonstrate and compare simulation and measurement results of Chip-on-Board (COB) and Sub-Mounted Devices (SMD) technology. The results reveal that for different applications certain packages are ideal.

  6. Highlights of Astronomy, Vol. 15

    NASA Astrophysics Data System (ADS)

    Corbett, Ian

    2010-11-01

    Preface; Part I. Gruber Cosmology Prize Lecture; Part II. Invited Discourses; Part III. Joint Discussions: 1. Dark matter in early-type galaxies Léon V. E. Koopmans and Tommaso Treu; 2. Diffuse light in galaxy clusters Magda Arnaboldi and Ortwin Gerhard; 3. Neutron stars - timing in extreme environments Tomaso Belloni, Mariano Méndez and Chengmin Zhang; 4. Progress in understanding the physics of Ap and related stars Margarida Cunha; 5. Modelling the Milky Way in the age of Gaia Annie C. Robin; 6. Time and astronomy Pascale Defraigne; 7. Astrophysical outflows and associated accretion phenomena Elisabete M. de Gouveia Dal Pino and Alex C. Raga; 8. Hot interstellar matter in elliptical galaxies Dong-Woo Kim and Silvia Pellegrini; 9. Are the fundamental constants varying with time? Paolo Molaro and Elisabeth Vangioni; 10. 3D views on cool stellar atmospheres - theory meets observation K. N. Nagendra, P. Bonifacio and H. G. Ludwig; 11. New advances in helio- and astero-seismology; 12. The first galaxies - theoretical predictions and observational clues; 13. Eta Carinae in the context of the most massive stars Theodore R. Gull and Augusto Damineli; 14. The ISM of galaxies in the far-infrared and sub-millimetre; 15. Magnetic fields in diffuse media Elisabete M. de Gouveia Dal Pino and Alex Lazarian; 16. IHY global campaign - whole heliosphere interval; Part IV. Special Sessions: SpS 1. IR and sub-mm spectroscopy - a new tool for studying stellar evolution Glenn Wahlgren, Hans Käufl and Florian Kerber; SpS 2. The international year of astronomy Pedro Russo, Catherine Cesarsky and Lars Lindberg Christensen; SpS 3. Astronomy in Antarctica in 2009 Michael G. Burton; SpS 4. Astronomy education between past and future J. P. De Greve; SpS 5. Accelerating the rate of astronomical discovery Ray P. Norris; SpS 6. Planetary systems as potential sites for life Régis Courtin, Alan Boss and Michel Mayor; SpS 7. Young stars, brown dwarfs, and protoplanetary disks Jane Gregorio

  7. Trends in Food Packaging.

    ERIC Educational Resources Information Center

    Ott, Dana B.

    1988-01-01

    This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

  8. Packaging of electronic modules

    NASA Technical Reports Server (NTRS)

    Katzin, L.

    1966-01-01

    Study of design approaches that are taken toward optimizing the packaging of electronic modules with respect to size, shape, component orientation, interconnections, and structural support. The study does not present a solution to specific packaging problems, but rather the factors to be considered to achieve optimum packaging designs.

  9. Packaging and Reliability Issues in Micro/Nano Systems

    NASA Astrophysics Data System (ADS)

    Kim, Jongbaeg; Cheng, Yu-Ting; Chiao, Mu; Lin, Liwei

    The potential of MEMS/NEMS technologies has been viewed as a revolution comparable or even bigger than that of microelectronics. These scientific and engineering advancements in micro-/nano-electromechanical systems (MEMS)/(NEMS) could bring previously unthinkable applications to reality, from space systems, environmental instruments, to daily-life appliances. As presented in previous chapters, the development of core MEMS/NEMS processes has already demonstrated a lot of commercial applications as well as future potentials with elaborate functionalities. However, creating a low-cost reliable package for the protection of these MEMS/NEMS products is still a very difficult task. Without addressing these packaging and reliability issues, no commercial products can be sold on the market. Packaging design and modeling, packaging material selection, packaging process integration, and packaging cost are the main issues to be considered. In this chapter, we will present the fundamentals of MEMS/NEMS packaging technology, including packaging processes, hermetic and vacuum encapsulations, thermal issues, packaging reliability, and future packaging trends. The future development of MEMS packaging will rely on the success of the implementation of several unique techniques, such as packaging design kits for system and circuit designer, low-cost wafer-level and chip-scale packaging techniques, effective testing techniques, and reliable fabrication of an interposer [56.1] with vertical through-interconnects for device integrations.

  10. [SMEAC Newsletters, Science Education, Vol. 2, No. 2--Vol. 2, No. 3, 1969].

    ERIC Educational Resources Information Center

    ERIC Clearinghouse for Science, Mathematics, and Environmental Education, Columbus, OH.

    Each of these newsletters, produced by the ERIC Information Analysis Center for Science, Mathematics, and Environmental Education, Contains information concerning center publications and activities, as well as other items considered of interest to researchers and educators of various educational levels. One of the emphases in Vol. 2, No. 2, is a…

  11. [SMEAC Newsletters, Science Education, Vol. 1, No. 1--Vol. 2, No. 1, 1967-1968].

    ERIC Educational Resources Information Center

    ERIC Clearinghouse for Science, Mathematics, and Environmental Education, Columbus, OH.

    Each of these newsletters, produced by the ERIC Information Analysis Center for Science, Mathematics, and Environmental Education, contains information concerning center publications and other items considered of interest to researchers and educators of various education levels. Vol. 1, No. 1 highlights selected bibliographies (no longer produced…

  12. Extreme temperature packaging: challenges and opportunities

    NASA Astrophysics Data System (ADS)

    Johnson, R. Wayne

    2016-05-01

    Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

  13. A microelectronics approach for the ROSETTA surface science package

    NASA Technical Reports Server (NTRS)

    Sandau, Rainer (Editor); Alkalaj, Leon

    1996-01-01

    In relation to the Rosetta surface science package, the benefits of the application of advanced microelectronics packaging technologies and other output from the Mars environmental survey (MESUR) integrated microelectronics study are reported on. The surface science package will be designed to operate for tens of hours. Its limited mass and power consumption make necessary a highly integrated design with all the instruments and subunits operated from a centralized control and information management subsystem.

  14. Packaged die heater

    SciTech Connect

    Spielberger, Richard; Ohme, Bruce Walker; Jensen, Ronald J.

    2011-06-21

    A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

  15. Smart packaging for photonics

    SciTech Connect

    Smith, J.H.; Carson, R.F.; Sullivan, C.T.; McClellan, G.; Palmer, D.W.

    1997-09-01

    Unlike silicon microelectronics, photonics packaging has proven to be low yield and expensive. One approach to make photonics packaging practical for low cost applications is the use of {open_quotes}smart{close_quotes} packages. {open_quotes}Smart{close_quotes} in this context means the ability of the package to actuate a mechanical change based on either a measurement taken by the package itself or by an input signal based on an external measurement. One avenue of smart photonics packaging, the use of polysilicon micromechanical devices integrated with photonic waveguides, was investigated in this research (LDRD 3505.340). The integration of optical components with polysilicon surface micromechanical actuation mechanisms shows significant promise for signal switching, fiber alignment, and optical sensing applications. The optical and stress properties of the oxides and nitrides considered for optical waveguides and how they are integrated with micromechanical devices were investigated.

  16. Advance Directives and Do Not Resuscitate Orders

    MedlinePlus

    ... a form. Call a lawyer. Use a computer software package for legal documents. Advance directives and living ... you write by yourself or with a computer software package should follow your state laws. You may ...

  17. Working with Consortia - Advanced Packaging Reliability

    NASA Technical Reports Server (NTRS)

    Blanche, Jim; Strickland, Mark

    2010-01-01

    Description: Support the responsible NASA official for lead-free solder evaluation. Serve as the NASA technical liaison to the NASA/DoD Pb-free Project. Assure NASA areas of interest are included in JG-PP follow-on work. Support NASA/DoD telcons and face-to-face meetings. Update MSFC lead-free solder lessons learned report. FY10 plans: - Reliability data on lead-free solder applications for various part lead finishes and board finishes. - Update lead-free solder risks and risk mitigation strategies for NASA. - Evaluate lead-free alloy/lead-free finish reliability in design application. - Status CAVE project on Pb-free solder aging effects. - Compile the LTESE flight and bench data.

  18. The ZOOM minimization package

    SciTech Connect

    Fischler, Mark S.; Sachs, D.; /Fermilab

    2004-11-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete.

  19. Index to the "Journal of American Indian Education", Vol. 1, No. 1, 1961 - Vol. 13, No. 2, 1974.

    ERIC Educational Resources Information Center

    Gill, George A., Ed.

    Articles that appear in the "Journal of American Indian Education", Vol. 1, No. 1 (June 1961) through Vol. 13, No. 2 (January 1974), inclusive, are annotated in this index. Each of the approximately 190 citations gives: (1) title of article/manuscript, (2) author(s), (3) volume, number, pages, and date, and (4) subject annotation. Although most of…

  20. The LCDROOT Analysis Package

    SciTech Connect

    Abe, Toshinori

    2001-10-18

    The North American Linear Collider Detector group has developed simulation and analysis program packages. LCDROOT is one of the packages, and is based on ROOT and the C++ programing language to maximally benefit from object oriented programming techniques. LCDROOT is constantly improved and now has a new topological vertex finder, ZVTOP3. In this proceeding, the features of the LCDROOT simulation are briefly described.

  1. The West: Curriculum Package.

    ERIC Educational Resources Information Center

    Public Broadcasting Service, Alexandria, VA.

    This document consists of the printed components only of a PBS curriculum package intended to be used with the 9-videotape PBS documentary series entitled "The West." The complete curriculum package includes a teacher's guide, lesson plans, a student guide, audio tapes, a video index, and promotional poster. The teacher's guide and lesson plans…

  2. Developing Large CAI Packages.

    ERIC Educational Resources Information Center

    Reed, Mary Jac M.; Smith, Lynn H.

    1983-01-01

    When developing large computer-assisted instructional (CAI) courseware packages, it is suggested that there be more attentive planning to the overall package design before actual lesson development is begun. This process has been simplified by modifying the systems approach used to develop single CAI lessons, followed by planning for the…

  3. Nutrition. Learning Activity Package.

    ERIC Educational Resources Information Center

    Lee, Carolyn

    This learning activity package on nutrition is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

  4. Grooming. Learning Activity Package.

    ERIC Educational Resources Information Center

    Stark, Pamela

    This learning activity package on grooming for health workers is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

  5. WASTE PACKAGE TRANSPORTER DESIGN

    SciTech Connect

    D.C. Weddle; R. Novotny; J. Cron

    1998-09-23

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''.

  6. TRNSYS for windows packages

    SciTech Connect

    Blair, N.J.; Beckman, W.A.; Klein, S.A.; Mitchell, J.W.

    1996-09-01

    TRNSYS 14.1 was released in 1994. This package represents a significant step forward in usability due to several graphical utility programs for DOS. These programs include TRNSHELL, which encapsulates TRNSYS functions, PRESIM, which allows the graphical creation of a simulation system, and TRNSED, which allows the easy sharing of simulations. The increase in usability leads to a decrease in the time necessary to prepare the simulation. Most TRNSYS users operate on PC computers with the Windows operating system. Therefore, the next logical step in increased usability was to port the current TRNSYS package to the Windows operating system. Several organizations worked on this conversion that has resulted in two distinct Windows packages. One package closely resembles the DOS version and includes TRNSHELL for Windows and PRESIM for Windows. The other package incorporates a general front-end, called IISIBat, that is a general simulation tool front-end. 8 figs.

  7. RH Packaging Operations Manual

    SciTech Connect

    Washington TRU Solutions LLC

    2003-09-17

    This procedure provides operating instructions for the RH-TRU 72-B Road Cask, Waste Shipping Package. In this document, ''Packaging'' refers to the assembly of components necessary to ensure compliance with the packaging requirements (not loaded with a payload). ''Package'' refers to a Type B packaging that, with its radioactive contents, is designed to retain the integrity of its containment and shielding when subject to the normal conditions of transport and hypothetical accident test conditions set forth in 10 CFR Part 71. Loading of the RH 72-B cask can be done two ways, on the RH cask trailer in the vertical position or by removing the cask from the trailer and loading it in a facility designed for remote-handling (RH). Before loading the 72-B cask, loading procedures and changes to the loading procedures for the 72-B cask must be sent to CBFO at sitedocuments@wipp.ws for approval.

  8. Modular electronics packaging system

    NASA Technical Reports Server (NTRS)

    Hunter, Don J. (Inventor)

    2001-01-01

    A modular electronics packaging system includes multiple packaging slices that are mounted horizontally to a base structure. The slices interlock to provide added structural support. Each packaging slice includes a rigid and thermally conductive housing having four side walls that together form a cavity to house an electronic circuit. The chamber is enclosed on one end by an end wall, or web, that isolates the electronic circuit from a circuit in an adjacent packaging slice. The web also provides a thermal path between the electronic circuit and the base structure. Each slice also includes a mounting bracket that connects the packaging slice to the base structure. Four guide pins protrude from the slice into four corresponding receptacles in an adjacent slice. A locking element, such as a set screw, protrudes into each receptacle and interlocks with the corresponding guide pin. A conduit is formed in the slice to allow electrical connection to the electronic circuit.

  9. Packaging Concerns/Techniques for Large Devices

    NASA Technical Reports Server (NTRS)

    Sampson, Michael J.

    2009-01-01

    This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

  10. Optoelectronic packaging: A review

    SciTech Connect

    Carson, R.F.

    1993-09-01

    Optoelectronics and photonics hold great potential for high data-rate communication and computing. Wide using in computing applications was limited first by device technologies and now suffers due to the need for high-precision, mass-produced packaging. The use of phontons as a medium of communication and control implies a unique set of packaging constraints that was not present in traditional telecommunications applications. The state-of-the-art in optoelectronic packaging is now driven by microelectric techniques that have potential for low cost and high volume manufacturing.

  11. Seawater Chemistry Package

    2005-11-23

    SeaChem Seawater Chemistry package provides routines to calculate pH, carbonate chemistry, density, and other quantities for seawater, based on the latest community standards. The chemistry is adapted from fortran routines provided by the OCMIP3/NOCES project, details of which are available at http://www.ipsl.jussieu.fr/OCMIP/. The SeaChem package can generate Fortran subroutines as well as Python wrappers for those routines. Thus the same code can be used by Python or Fortran analysis packages and Fortran ocean models alike.

  12. Recent trends and future of pharmaceutical packaging technology

    PubMed Central

    Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

    2013-01-01

    The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future. PMID:23833515

  13. Photocopy from Evan Leigh's Modern Cotton Spinning (Vol 2), Manchester, ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    Photocopy from Evan Leigh's Modern Cotton Spinning (Vol 2), Manchester, 1873 (PL XXIX top); illustration of full milll, as enlarged to south. - Harmony Manufacturing Company, Mill Number 3, 100 North Mohawk Street, Cohoes, Albany County, NY

  14. Photocopy from Evan Leigh's Modern Cotton Spinning (Vol 1), Manchester, ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    Photocopy from Evan Leigh's Modern Cotton Spinning (Vol 1), Manchester, 1873 (PL XXI); illustration of turbine and belt system. - Harmony Manufacturing Company, Mill Number 3, 100 North Mohawk Street, Cohoes, Albany County, NY

  15. 2. Historic American Buildings Survey Photocopy from Harpers, vol. 20 ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    2. Historic American Buildings Survey Photocopy from Harpers, vol. 20 1859 Courtesy of Library of Congress NORTH AND EAST FRONTS - United States General Post Office, Between Seventh, Eighth, E, & F Streets, Northwest, Washington, District of Columbia, DC

  16. Packaging for Posterity.

    ERIC Educational Resources Information Center

    Sias, Jim

    1990-01-01

    A project in which students designed environmentally responsible food packaging is described. The problem definition; research on topics such as waste paper, plastic, metal, glass, incineration, recycling, and consumer preferences; and the presentation design are provided. (KR)

  17. Electronic Packaging Techniques

    NASA Technical Reports Server (NTRS)

    1979-01-01

    A characteristic of aerospace system design is that equipment size and weight must always be kept to a minimum, even in small components such as electronic packages. The dictates of spacecraft design have spawned a number of high-density packaging techniques, among them methods of connecting circuits in printed wiring boards by processes called stitchbond welding and parallel gap welding. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.

  18. The ENSDF Java Package

    SciTech Connect

    Sonzogni, A.A.

    2005-05-24

    A package of computer codes has been developed to process and display nuclear structure and decay data stored in the ENSDF (Evaluated Nuclear Structure Data File) library. The codes were written in an object-oriented fashion using the java language. This allows for an easy implementation across multiple platforms as well as deployment on web pages. The structure of the different java classes that make up the package is discussed as well as several different implementations.

  19. Battery packaging - Technology review

    SciTech Connect

    Maiser, Eric

    2014-06-16

    This paper gives a brief overview of battery packaging concepts, their specific advantages and drawbacks, as well as the importance of packaging for performance and cost. Production processes, scaling and automation are discussed in detail to reveal opportunities for cost reduction. Module standardization as an additional path to drive down cost is introduced. A comparison to electronics and photovoltaics production shows 'lessons learned' in those related industries and how they can accelerate learning curves in battery production.

  20. Comparative Packaging Study

    NASA Technical Reports Server (NTRS)

    Perchonok, Michele H.; Oziomek, Thomas V.

    2009-01-01

    Future long duration manned space flights beyond low earth orbit will require the food system to remain safe, acceptable and nutritious. Development of high barrier food packaging will enable this requirement by preventing the ingress and egress of gases and moisture. New high barrier food packaging materials have been identified through a trade study. Practical application of this packaging material within a shelf life test will allow for better determination of whether this material will allow the food system to meet given requirements after the package has undergone processing. The reason to conduct shelf life testing, using a variety of packaging materials, stems from the need to preserve food used for mission durations of several years. Chemical reactions that take place during longer durations may decrease food quality to a point where crew physical or psychological well-being is compromised. This can result in a reduction or loss of mission success. The rate of chemical reactions, including oxidative rancidity and staling, can be controlled by limiting the reactants, reducing the amount of energy available to drive the reaction, and minimizing the amount of water available. Water not only acts as a media for microbial growth, but also as a reactant and means by which two reactants may come into contact with each other. The objective of this study is to evaluate three packaging materials for potential use in long duration space exploration missions.

  1. Conditioning of Degradated Packages with Radioactive Waste

    SciTech Connect

    Dogaru, G. C.

    2002-02-25

    The development of the nuclear techniques in Romania and the commissioning of the WWR-S research reactor belonging to the Institute of Physics and Nuclear Engineering-(NIPNE) demand to deal with the storage and disposal of radioactive waste. The institute decided to store the radioactive waste inside a building that belonged to the Defense of Capital City System (the Army) called ''Fort'' which is located on the Magurele site. There are still about 800 packages containing cement conditioned radioactive in the storage facility of NIPNE which need to be repackaged, because they are in an advanced state of degradation. The new package obtained the regulatory design approval. It consists in an internal basket in which the degraded package are placed, a cement containment system, and an external cask in which the basket are placed and conditioned with the cement.

  2. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2009-06-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  3. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2008-09-11

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the pplication." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  4. RH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions LLC

    2008-01-12

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package (also known as the "RH-TRU 72-B cask") and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: "...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." It further states: "...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M&O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8, "Deliberate Misconduct." Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, "Packaging and Transportation of Radioactive Material," certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, "Reporting of Defects and Noncompliance," regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a

  5. Inference---A Python Package for Astrostatistics

    NASA Astrophysics Data System (ADS)

    Loredo, T. J.; Connors, A.; Oliphant, T. E.

    2004-08-01

    Python is an object-oriented ``very high level language'' that is easy to learn, actively supported, and freely available for a large variety of computing platforms. It possesses sophisticated scientific computing capabilities thanks to ongoing work by a community of scientists and engineers who maintain a suite of open source scientific packages. Key contributions come from the STScI group maintaining PyRAF, a Python environment for running IRAF tasks. Python's main scientific computing packages are the Numeric and numarray packages implementing efficient array and image processing, and the SciPy package implementing a wide variety of general-use algorithms including optimization, root finding, special functions, numerical integration, and basic statistical tasks. We describe the Inference package, a collection of tools for carrying out advanced astrostatistical analyses that is about to be released as a supplement to SciPy. The Inference package has two main parts. First is a Parametric Inference Engine that offers a unified environment for analysis of parametric models with a variety of methods, including minimum χ2, maximum likelihood, and Bayesian methods. Several common analysis tasks are available with simple syntax (e.g., optimization, multidimensional exploration and integration, simulation); its parameter syntax is remensicent of that of SHERPA. Second, the package includes a growing library of diverse, specialized astrostatistical methods in a variety of domains including time series, spectrum and survey analysis, and basic image analysis. Where possible, a variety of methods are available for a given problem, enabling users to explore alternative methods in a unified environment, with the guidance of significant documentation. The Inference project is supported by NASA AISRP grant NAG5-12082.

  6. Food packages for Space Shuttle

    NASA Technical Reports Server (NTRS)

    Fohey, M. F.; Sauer, R. L.; Westover, J. B.; Rockafeller, E. F.

    1978-01-01

    The paper reviews food packaging techniques used in space flight missions and describes the system developed for the Space Shuttle. Attention is directed to bite-size food cubes used in Gemini, Gemini rehydratable food packages, Apollo spoon-bowl rehydratable packages, thermostabilized flex pouch for Apollo, tear-top commercial food cans used in Skylab, polyethylene beverage containers, Skylab rehydratable food package, Space Shuttle food package configuration, duck-bill septum rehydration device, and a drinking/dispensing nozzle for Space Shuttle liquids. Constraints and testing of packaging is considered, a comparison of food package materials is presented, and typical Shuttle foods and beverages are listed.

  7. CH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions LLC

    2005-02-28

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.

  8. Food Packaging Materials

    NASA Technical Reports Server (NTRS)

    1978-01-01

    The photos show a few of the food products packaged in Alure, a metallized plastic material developed and manufactured by St. Regis Paper Company's Flexible Packaging Division, Dallas, Texas. The material incorporates a metallized film originally developed for space applications. Among the suppliers of the film to St. Regis is King-Seeley Thermos Company, Winchester, Ma'ssachusetts. Initially used by NASA as a signal-bouncing reflective coating for the Echo 1 communications satellite, the film was developed by a company later absorbed by King-Seeley. The metallized film was also used as insulating material for components of a number of other spacecraft. St. Regis developed Alure to meet a multiple packaging material need: good eye appeal, product protection for long periods and the ability to be used successfully on a wide variety of food packaging equipment. When the cost of aluminum foil skyrocketed, packagers sought substitute metallized materials but experiments with a number of them uncovered problems; some were too expensive, some did not adequately protect the product, some were difficult for the machinery to handle. Alure offers a solution. St. Regis created Alure by sandwiching the metallized film between layers of plastics. The resulting laminated metallized material has the superior eye appeal of foil but is less expensive and more easily machined. Alure effectively blocks out light, moisture and oxygen and therefore gives the packaged food long shelf life. A major packaging firm conducted its own tests of the material and confirmed the advantages of machinability and shelf life, adding that it runs faster on machines than materials used in the past and it decreases product waste; the net effect is increased productivity.

  9. Detecting small holes in packages

    DOEpatents

    Kronberg, James W.; Cadieux, James R.

    1996-01-01

    A package containing a tracer gas, and a method for determining the presence of a hole in the package by sensing the presence of the gas outside the package. The preferred tracer gas, especially for food packaging, is sulfur hexafluoride. A quantity of the gas is added to the package and the package is closed. The concentration of the gas in the atmosphere outside the package is measured and compared to a predetermined value of the concentration of the gas in the absence of the package. A measured concentration greater than the predetermined value indicates the presence of a hole in the package. Measuring may be done in a chamber having a lower pressure than that in the package.

  10. Detecting small holes in packages

    DOEpatents

    Kronberg, J.W.; Cadieux, J.R.

    1996-03-19

    A package containing a tracer gas, and a method for determining the presence of a hole in the package by sensing the presence of the gas outside the package are disclosed. The preferred tracer gas, especially for food packaging, is sulfur hexafluoride. A quantity of the gas is added to the package and the package is closed. The concentration of the gas in the atmosphere outside the package is measured and compared to a predetermined value of the concentration of the gas in the absence of the package. A measured concentration greater than the predetermined value indicates the presence of a hole in the package. Measuring may be done in a chamber having a lower pressure than that in the package. 3 figs.

  11. MEEP: A flexible free-software package for electromagnetic simulations by the FDTD method

    NASA Astrophysics Data System (ADS)

    Oskooi, Ardavan F.; Roundy, David; Ibanescu, Mihai; Bermel, Peter; Joannopoulos, J. D.; Johnson, Steven G.

    2010-03-01

    This paper describes Meep, a popular free implementation of the finite-difference time-domain (FDTD) method for simulating electromagnetism. In particular, we focus on aspects of implementing a full-featured FDTD package that go beyond standard textbook descriptions of the algorithm, or ways in which Meep differs from typical FDTD implementations. These include pervasive interpolation and accurate modeling of subpixel features, advanced signal processing, support for nonlinear materials via Padé approximants, and flexible scripting capabilities. Program summaryProgram title: Meep Catalogue identifier: AEFU_v1_0 Program summary URL::http://cpc.cs.qub.ac.uk/summaries/AEFU_v1_0.html Program obtainable from: CPC Program Library, Queen's University, Belfast, N. Ireland Licensing provisions: GNU GPL No. of lines in distributed program, including test data, etc.: 151 821 No. of bytes in distributed program, including test data, etc.: 1 925 774 Distribution format: tar.gz Programming language: C++ Computer: Any computer with a Unix-like system and a C++ compiler; optionally exploits additional free software packages: GNU Guile [1], libctl interface library [2], HDF5 [3], MPI message-passing interface [4], and Harminv filter-diagonalization [5]. Developed on 2.8 GHz Intel Core 2 Duo. Operating system: Any Unix-like system; developed under Debian GNU/Linux 5.0.2. RAM: Problem dependent (roughly 100 bytes per pixel/voxel) Classification: 10 External routines: Optionally exploits additional free software packages: GNU Guile [1], libctl interface library [2], HDF5 [3], MPI message-passing interface [4], and Harminv filter-diagonalization [5] (which requires LAPACK and BLAS linear-algebra software [6]). Nature of problem: Classical electrodynamics Solution method: Finite-difference time-domain (FDTD) method Running time: Problem dependent (typically about 10 ns per pixel per timestep) References:[1] GNU Guile, http://www.gnu.org/software/guile[2] Libctl, http

  12. 78 FR 13083 - Products Having Laminated Packaging, Laminated Packaging, and Components Thereof; Notice of...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-02-26

    ... COMMISSION Products Having Laminated Packaging, Laminated Packaging, and Components Thereof; Notice of... Commission has received a complaint entitled Products Having Laminated ] Packaging, Laminated Packaging, and... having laminated packaging, laminated packaging, and components thereof. The complaint names...

  13. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2006-04-25

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package TransporterModel II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant| (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations(CFR) §71.8. Any time a user suspects or has indications that the conditions ofapproval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  14. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2007-12-13

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  15. [Development of a Japanese version of the Valuation of Life (VOL) scale].

    PubMed

    Nakagawa, Takeshi; Gondo, Yasuyuki; Masui, Yukie; Ishioka, Yoshiko; Tabuchi, Megumi; Kamide, Kei; Ikebe, Kazunori; Arai, Yasumichi; Takahashi, Ryutaro

    2013-04-01

    This study developed a Japanese version of the Valuation of Life (VOL) scale, to measure psychological wellbeing among older adults. In Analysis 1, we conducted a factor analysis of 13 items, and identified two factors: positive VOL and spiritual well-being. These factors had adequate degrees of internal consistency, and were related to positive mental health. In Analysis 2, we examined sociodemographic, social, and health predictors for VOL. The role of social factors was stronger than the role of health factors, and spiritual well-being was more related to moral or religious activities than positive VOL. These results suggest that predictors for VOL vary by culture. In Analysis 3, we investigated the relationship between VOL and desired years of life. Positive VOL significantly predicted more desired years of life, whereas spiritual well-being did not. Positive VOL had acceptable reliability and validity. Future research is required to investigate whether VOL predicts survival duration or end-of-life decisions.

  16. TSF Interface Package

    2004-03-01

    A collection of packages of classes for interfacing to sparse and dense matrices, vectors and graphs, and to linear operators. TSF (via TSFCore, TSFCoreUtils and TSFExtended) provides the application programmer interface to any number of solvers, linear algebra libraries and preconditioner packages, providing also a sophisticated technique for combining multiple packages to solve a single problem. TSF provides a collection of abstract base classes that define the interfaces to abstract vector, matrix and linear soeratormore » objects. By using abstract interfaces, users of TSF are not limiting themselves to any one concrete library and can in fact easily combine multiple libraries to solve a single problem.« less

  17. Clean Cities Now Vol. 17, No. 1

    SciTech Connect

    2013-05-24

    Biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on advanced vehicle deployment, idle reduction, and articles on Clean Cities coalition successes across the country.

  18. Clean Cities Now Vol. 16.1

    SciTech Connect

    2012-05-01

    Biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on advanced vehicle deployment, idle reduction, and articles on Clean Cities coalition successes across the country.

  19. SPHINX experimenters information package

    SciTech Connect

    Zarick, T.A.

    1996-08-01

    This information package was prepared for both new and experienced users of the SPHINX (Short Pulse High Intensity Nanosecond X-radiator) flash X-Ray facility. It was compiled to help facilitate experiment design and preparation for both the experimenter(s) and the SPHINX operational staff. The major areas covered include: Recording Systems Capabilities,Recording System Cable Plant, Physical Dimensions of SPHINX and the SPHINX Test cell, SPHINX Operating Parameters and Modes, Dose Rate Map, Experiment Safety Approval Form, and a Feedback Questionnaire. This package will be updated as the SPHINX facilities and capabilities are enhanced.

  20. AN ADA NAMELIST PACKAGE

    NASA Technical Reports Server (NTRS)

    Klumpp, A. R.

    1994-01-01

    The Ada Namelist Package, developed for the Ada programming language, enables a calling program to read and write FORTRAN-style namelist files. A namelist file consists of any number of assignment statements in any order. Features of the Ada Namelist Package are: the handling of any combination of user-defined types; the ability to read vectors, matrices, and slices of vectors and matrices; the handling of mismatches between variables in the namelist file and those in the programmed list of namelist variables; and the ability to avoid searching the entire input file for each variable. The principle user benefits of this software are the following: the ability to write namelist-readable files, the ability to detect most file errors in the initialization phase, a package organization that reduces the number of instantiated units to a few packages rather than to many subprograms, a reduced number of restrictions, and an increased execution speed. The Ada Namelist reads data from an input file into variables declared within a user program. It then writes data from the user program to an output file, printer, or display. The input file contains a sequence of assignment statements in arbitrary order. The output is in namelist-readable form. There is a one-to-one correspondence between namelist I/O statements executed in the user program and variables read or written. Nevertheless, in the input file, mismatches are allowed between assignment statements in the file and the namelist read procedure statements in the user program. The Ada Namelist Package itself is non-generic. However, it has a group of nested generic packages following the nongeneric opening portion. The opening portion declares a variety of useraccessible constants, variables and subprograms. The subprograms are procedures for initializing namelists for reading, reading and writing strings. The subprograms are also functions for analyzing the content of the current dataset and diagnosing errors. Two nested

  1. Alternative Packaging for Back-Illuminated Imagers

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata

    2009-01-01

    An alternative scheme has been conceived for packaging of silicon-based back-illuminated, back-side-thinned complementary metal oxide/semiconductor (CMOS) and charge-coupled-device image-detector integrated circuits, including an associated fabrication process. This scheme and process are complementary to those described in "Making a Back-Illuminated Imager With Back-Side Connections" (NPO-42839), NASA Tech Briefs, Vol. 32, No. 7 (July 2008), page 38. To avoid misunderstanding, it should be noted that in the terminology of imaging integrated circuits, "front side" or "back side" does not necessarily refer to the side that, during operation, faces toward or away from a source of light or other object to be imaged. Instead, "front side" signifies that side of a semiconductor substrate upon which the pixel pattern and the associated semiconductor devices and metal conductor lines are initially formed during fabrication, and "back side" signifies the opposite side. If the imager is of the type called "back-illuminated," then the back side is the one that faces an object to be imaged. Initially, a back-illuminated, back-side-thinned image-detector is fabricated with its back side bonded to a silicon handle wafer. At a subsequent stage of fabrication, the front side is bonded to a glass wafer (for mechanical support) and the silicon handle wafer is etched away to expose the back side. The frontside integrated circuitry includes metal input/output contact pads, which are rendered inaccessible by the bonding of the front side to the glass wafer. Hence, one of the main problems is to make the input/output contact pads accessible from the back side, which is ultimately to be the side accessible to the external world. The present combination of an alternative packaging scheme and associated fabrication process constitute a solution of the problem.

  2. Packaging Materials Properties Data

    SciTech Connect

    Leduc, D.

    1991-10-30

    Several energy absorbing materials are used in nuclear weapons component shipping containers recently designed for the Y-12 Plant Program Management Packaging Group. As a part of the independent review procedure leading to Certificates of Compliance, the U.S. Department of Energy Technical Safety Review Panels requested compression versus deflection . data on these materials. This report is a compilation of that data.

  3. Packaging materials properties data

    SciTech Connect

    Walker, M.S.

    1991-01-01

    Several energy absorbing materials are used in nuclear weapons component shipping containers recently designed for the Y-12 Plant Program Management Packaging Group. As a part of the independent review procedure leading to Certificates of Compliance, the US Department of Energy Technical Safety Review Panels requested compression versus deflection data on these materials. This report is a compilation of that data.

  4. Electro-Microfluidic Packaging

    NASA Astrophysics Data System (ADS)

    Benavides, G. L.; Galambos, P. C.

    2002-06-01

    There are many examples of electro-microfluidic products that require cost effective packaging solutions. Industry has responded to a demand for products such as drop ejectors, chemical sensors, and biological sensors. Drop ejectors have consumer applications such as ink jet printing and scientific applications such as patterning self-assembled monolayers or ejecting picoliters of expensive analytes/reagents for chemical analysis. Drop ejectors can be used to perform chemical analysis, combinatorial chemistry, drug manufacture, drug discovery, drug delivery, and DNA sequencing. Chemical and biological micro-sensors can sniff the ambient environment for traces of dangerous materials such as explosives, toxins, or pathogens. Other biological sensors can be used to improve world health by providing timely diagnostics and applying corrective measures to the human body. Electro-microfluidic packaging can easily represent over fifty percent of the product cost and, as with Integrated Circuits (IC), the industry should evolve to standard packaging solutions. Standard packaging schemes will minimize cost and bring products to market sooner.

  5. Automatic Differentiation Package

    SciTech Connect

    Gay, David M.; Phipps, Eric; Bratlett, Roscoe

    2007-03-01

    Sacado is an automatic differentiation package for C++ codes using operator overloading and C++ templating. Sacado provide forward, reverse, and Taylor polynomial automatic differentiation classes and utilities for incorporating these classes into C++ codes. Users can compute derivatives of computations arising in engineering and scientific applications, including nonlinear equation solving, time integration, sensitivity analysis, stability analysis, optimization and uncertainity quantification.

  6. Radioactive waste disposal package

    DOEpatents

    Lampe, Robert F.

    1986-01-01

    A radioactive waste disposal package comprising a canister for containing vitrified radioactive waste material and a sealed outer shell encapsulating the canister. A solid block of filler material is supported in said shell and convertible into a liquid state for flow into the space between the canister and outer shell and subsequently hardened to form a solid, impervious layer occupying such space.

  7. Radioactive waste disposal package

    DOEpatents

    Lampe, Robert F.

    1986-11-04

    A radioactive waste disposal package comprising a canister for containing vitrified radioactive waste material and a sealed outer shell encapsulating the canister. A solid block of filler material is supported in said shell and convertible into a liquid state for flow into the space between the canister and outer shell and subsequently hardened to form a solid, impervious layer occupying such space.

  8. Waste disposal package

    DOEpatents

    Smith, M.J.

    1985-06-19

    This is a claim for a waste disposal package including an inner or primary canister for containing hazardous and/or radioactive wastes. The primary canister is encapsulated by an outer or secondary barrier formed of a porous ceramic material to control ingress of water to the canister and the release rate of wastes upon breach on the canister. 4 figs.

  9. Jpetra Kernel Package

    SciTech Connect

    Heroux, Michael A.

    2004-03-01

    A package of classes for constructing and using distributed sparse and dense matrices, vectors and graphs, written in Java. Jpetra is intended to provide the foundation for basic matrix and vector operations for Java developers. Jpetra provides distributed memory operations via an abstract parallel machine interface. The most common implementation of this interface will be Java sockets.

  10. CH Packaging Maintenance Manual

    SciTech Connect

    Washington TRU Solutions

    2002-01-02

    This procedure provides instructions for performing inner containment vessel (ICV) and outer containment vessel (OCV) maintenance and periodic leakage rate testing on the following packaging seals and corresponding seal surfaces using a nondestructive helium (He) leak test. In addition, this procedure provides instructions for performing ICV and OCV structural pressure tests.

  11. Metric Education Evaluation Package.

    ERIC Educational Resources Information Center

    Kansky, Bob; And Others

    This document was developed out of a need for a complete, carefully designed set of evaluation instruments and procedures that might be applied in metric inservice programs across the nation. Components of this package were prepared in such a way as to permit local adaptation to the evaluation of a broad spectrum of metric education activities.…

  12. Printer Graphics Package

    NASA Technical Reports Server (NTRS)

    Blanchard, D. C.

    1986-01-01

    Printer Graphics Package (PGP) is tool for making two-dimensional symbolic plots on line printer. PGP created to support development of Heads-Up Display (HUD) simulation. Standard symbols defined with HUD in mind. Available symbols include circle, triangle, quadrangle, window, line, numbers, and text. Additional symbols easily added or built up from available symbols.

  13. High Efficiency Integrated Package

    SciTech Connect

    Ibbetson, James

    2013-09-15

    Solid-state lighting based on LEDs has emerged as a superior alternative to inefficient conventional lighting, particularly incandescent. LED lighting can lead to 80 percent energy savings; can last 50,000 hours – 2-50 times longer than most bulbs; and contains no toxic lead or mercury. However, to enable mass adoption, particularly at the consumer level, the cost of LED luminaires must be reduced by an order of magnitude while achieving superior efficiency, light quality and lifetime. To become viable, energy-efficient replacement solutions must deliver system efficacies of ≥ 100 lumens per watt (LPW) with excellent color rendering (CRI > 85) at a cost that enables payback cycles of two years or less for commercial applications. This development will enable significant site energy savings as it targets commercial and retail lighting applications that are most sensitive to the lifetime operating costs with their extended operating hours per day. If costs are reduced substantially, dramatic energy savings can be realized by replacing incandescent lighting in the residential market as well. In light of these challenges, Cree proposed to develop a multi-chip integrated LED package with an output of > 1000 lumens of warm white light operating at an efficacy of at least 128 LPW with a CRI > 85. This product will serve as the light engine for replacement lamps and luminaires. At the end of the proposed program, this integrated package was to be used in a proof-of-concept lamp prototype to demonstrate the component’s viability in a common form factor. During this project Cree SBTC developed an efficient, compact warm-white LED package with an integrated remote color down-converter. Via a combination of intensive optical, electrical, and thermal optimization, a package design was obtained that met nearly all project goals. This package emitted 1295 lm under instant-on, room-temperature testing conditions, with an efficacy of 128.4 lm/W at a color temperature of ~2873

  14. Packaging design criteria for the Hanford Ecorok Packaging

    SciTech Connect

    Mercado, M.S.

    1996-01-19

    The Hanford Ecorok Packaging (HEP) will be used to ship contaminated water purification filters from K Basins to the Central Waste Complex. This packaging design criteria documents the design of the HEP, its intended use, and the transportation safety criteria it is required to meet. This information will serve as a basis for the safety analysis report for packaging.

  15. Clean Cities Now Vol. 17, No. 2

    SciTech Connect

    2013-10-23

    The Fall 2013 issue of the biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on deployment of alternative fuels and advanced vehicles, and articles on Clean Cities coalition successes across the country.

  16. Clean Cities Now, Vol. 18, No. 1

    SciTech Connect

    2014-04-30

    The Spring 2014 edition of the semi-annual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on deployment of alternative fuels and advanced vehicles, and articles on Clean Cities coalition successes across the country.

  17. Clean Cities Now Vol. 19, No. 2

    SciTech Connect

    2015-12-18

    Clean Cities Now is the official bi-annual newsletter of Clean Cities, an initiative designed to reduce petroleum consumption in the transportation sector by advancing the use of alternative and renewable fuels, fuel economy improvements, idle-reduction measures, and new technologies, as they emerge.

  18. Clean Cities Now, Vol. 18, No. 2

    SciTech Connect

    2015-01-19

    This is version 18.2 of Clean Cities Now, the official biannual newsletter of the Clean Cities program. Clean Cities is an initiative designed to reduce petroleum consumption in the transportation sector by advancing the use of alternative and renewable fuels, fuel economy improvements, idle-reduction measures, and new technologies, as they emerge.

  19. Clean Cities Now Vol. 19, No. 1

    SciTech Connect

    2015-07-24

    Now is the official bi-annual newsletter of Clean Cities, an initiative designed to reduce petroleum consumption in the transportation sector by advancing the use of alternative and renewable fuels, fuel economy improvements, idle-reduction measures, and new technologies, as they emerge.

  20. Francais langue seconde: trousse d'evaluation--tests modeles pour les cours: French 31a (Avance 7); French 31b (Avance 8); French 31c (Avance 9) (French as a Second Language: Evaluation Resource Package--Model Tests for the Courses: French 31a (Advanced 7); French 31b (Advanced 8); French 31c (Advanced 9)).

    ERIC Educational Resources Information Center

    Alberta Dept. of Education, Edmonton. Language Services Branch.

    The French as a Second Language model tests for advanced levels 7, 8, and 9 were designed to evaluate students' language performance, as outlined in the program of studies for Alberta, Canada, in listening and reading comprehension and oral and written production, communication skills, culture, language and general language knowledge. The tests…

  1. A Compact, Modular Package for Superconducting Bolometer Arrays

    NASA Technical Reports Server (NTRS)

    Benford, D.

    2008-01-01

    As bolometer arrays grow to ever-larger formats, packaging becomes a more critical engineering issue. We have designed a detector package to house a superconducting bolometer array, SQUID multiplexers, bias and filtering circuitry, and electrical connectors. The package includes an optical filter, magnetic shielding, and has well-defined thermal and mechanical interfaces. An early version of this package has been used successfully in the GISMO 2mm camera, a 128-pixel camera operating at a base temperature of 270mK. A more advanced package permits operation at lower temperatures by providing direct heat sinking to the SQUIDS and bias resistors, which generate the bulk of the dissipation in the package. Standard electrical connectors provide reliable contact while enabling quick installation and removal of the package. We describe how the design compensates for differing thermal expansions, allows heat sinking of the bolometer array, and features magnetic shielding in critical areas. We highlight the performance of this detector package and describe its scalability to 1280-pixel arrays in the near future.

  2. Sustainable Library Development Training Package

    ERIC Educational Resources Information Center

    Peace Corps, 2012

    2012-01-01

    This Sustainable Library Development Training Package supports Peace Corps' Focus In/Train Up strategy, which was implemented following the 2010 Comprehensive Agency Assessment. Sustainable Library Development is a technical training package in Peace Corps programming within the Education sector. The training package addresses the Volunteer…

  3. Technical comparison between Hythane, GNG and gasoline fueled vehicles. [Hythane = 85 vol% natural gas, 15 vol% H[sub 2

    SciTech Connect

    Not Available

    1992-05-01

    This interim report documents progress on this 2-year Alternative Fuel project, scheduled to end early 1993. Hythane is 85 vol% compressed natural gas (CNG) and 15 vol% hydrogen; it has the potential to meet or exceed the California Ultra-Low Emission Vehicle (ULEV) standard. Three USA trucks (3/4 ton pickup) were operated on single fuel (unleaded gasoline, CNG, Hythane) in Denver. The report includes emission testing, fueling facility, hazard and operability study, and a framework for a national hythane strategy.

  4. KAPPA -- Kernel Application Package

    NASA Astrophysics Data System (ADS)

    Currie, Malcolm J.; Berry, David. S.

    KAPPA is an applications package comprising about 180 general-purpose commands for image processing, data visualisation, and manipulation of the standard Starlink data format---the NDF. It is intended to work in conjunction with Starlink's various specialised packages. In addition to the NDF, KAPPA can also process data in other formats by using the `on-the-fly' conversion scheme. Many commands can process data arrays of arbitrary dimension, and others work on both spectra and images. KAPPA operates from both the UNIX C-shell and the ICL command language. This document describes how to use KAPPA and its features. There is some description of techniques too, including a section on writing scripts. This document includes several tutorials and is illustrated with numerous examples. The bulk of this document comprises detailed descriptions of each command as well as classified and alphabetical summaries.

  5. TIDEV: Tidal Evolution package

    NASA Astrophysics Data System (ADS)

    Cuartas-Restrepo, P.; Melita, M.; Zuluaga, J.; Portilla, B.; Sucerquia, M.; Miloni, O.

    2016-09-01

    TIDEV (Tidal Evolution package) calculates the evolution of rotation for tidally interacting bodies using Efroimsky-Makarov-Williams (EMW) formalism. The package integrates tidal evolution equations and computes the rotational and dynamical evolution of a planet under tidal and triaxial torques. TIDEV accounts for the perturbative effects due to the presence of the other planets in the system, especially the secular variations of the eccentricity. Bulk parameters include the mass and radius of the planet (and those of the other planets involved in the integration), the size and mass of the host star, the Maxwell time and Andrade's parameter. TIDEV also calculates the time scale that a planet takes to be tidally locked as well as the periods of rotation reached at the end of the spin-orbit evolution.

  6. Anticounterfeit packaging technologies

    PubMed Central

    Shah, Ruchir Y.; Prajapati, Prajesh N.; Agrawal, Y. K.

    2010-01-01

    Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology. PMID:22247875

  7. The Ettention software package.

    PubMed

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-02-01

    We present a novel software package for the problem "reconstruction from projections" in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. PMID:26686659

  8. Anticounterfeit packaging technologies.

    PubMed

    Shah, Ruchir Y; Prajapati, Prajesh N; Agrawal, Y K

    2010-10-01

    Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology. PMID:22247875

  9. Aquaculture information package

    SciTech Connect

    Boyd, T.; Rafferty, K.

    1998-08-01

    This package of information is intended to provide background information to developers of geothermal aquaculture projects. The material is divided into eight sections and includes information on market and price information for typical species, aquaculture water quality issues, typical species culture information, pond heat loss calculations, an aquaculture glossary, regional and university aquaculture offices and state aquaculture permit requirements. A bibliography containing 68 references is also included.

  10. Software packager user's guide

    NASA Technical Reports Server (NTRS)

    Callahan, John R.

    1995-01-01

    Software integration is a growing area of concern for many programmers and software managers because the need to build new programs quickly from existing components is greater than ever. This includes building versions of software products for multiple hardware platforms and operating systems, building programs from components written in different languages, and building systems from components that must execute on different machines in a distributed network. The goal of software integration is to make building new programs from existing components more seamless -- programmers should pay minimal attention to the underlying configuration issues involved. Libraries of reusable components and classes are important tools but only partial solutions to software development problems. Even though software components may have compatible interfaces, there may be other reasons, such as differences between execution environments, why they cannot be integrated. Often, components must be adapted or reimplemented to fit into another application because of implementation differences -- they are implemented in different programming languages, dependent on different operating system resources, or must execute on different physical machines. The software packager is a tool that allows programmers to deal with interfaces between software components and ignore complex integration details. The packager takes modular descriptions of the structure of a software system written in the package specification language and produces an integration program in the form of a makefile. If complex integration tools are needed to integrate a set of components, such as remote procedure call stubs, their use is implied by the packager automatically and stub generation tools are invoked in the corresponding makefile. The programmer deals only with the components themselves and not the details of how to build the system on any given platform.

  11. Navy packaging standardization thrusts

    NASA Astrophysics Data System (ADS)

    Kidwell, J. R.

    1982-11-01

    Standardization is a concept that is basic to our world today. The idea of reducing costs through the economics of mass production is an easy one to grasp. Henry Ford started the process of large scale standardization in this country with the Detroit production lines for his automobiles. In the process additional benefits accrued, such as improved reliability through design maturity, off-the-shelf repair parts, faster repair time, and a resultant lower cost of ownership (lower life-cycle cost). The need to attain standardization benefits with military equipments exists now. Defense budgets, although recently increased, are not going to permit us to continue the tremendous investment required to maintain even the status quo and develop new hardware at the same time. Needed are more reliable, maintainable, testable hardware in the Fleet. It is imperative to recognize the obsolescence problems created by the use of high technology devices in our equipments, and find ways to combat these shortfalls. The Navy has two packaging standardization programs that will be addressed in this paper; the Standard Electronic Modules and the Modular Avionics Packaging programs. Following a brief overview of the salient features of each program, the packaging technology aspects of the program will be addressed, and developmental areas currently being investigated will be identified.

  12. Plutonium stabilization and packaging system

    SciTech Connect

    1996-05-01

    This document describes the functional design of the Plutonium Stabilization and Packaging System (Pu SPS). The objective of this system is to stabilize and package plutonium metals and oxides of greater than 50% wt, as well as other selected isotopes, in accordance with the requirements of the DOE standard for safe storage of these materials for 50 years. This system will support completion of stabilization and packaging campaigns of the inventory at a number of affected sites before the year 2002. The package will be standard for all sites and will provide a minimum of two uncontaminated, organics free confinement barriers for the packaged material.

  13. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  14. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  15. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  16. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  17. Photocopy from Evan Leigh's Modern Cotton Spinning (Vol 1), Manchester, ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    Photocopy from Evan Leigh's Modern Cotton Spinning (Vol 1), Manchester, 1873 (PL XX); illustration used by eminent British textile engineer to exemplify the ultimate development in American cotton mill technology. - Harmony Manufacturing Company, Mill Number 3, 100 North Mohawk Street, Cohoes, Albany County, NY

  18. 14. Photocopy of engraving from History of Westchester County, Vol. ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    14. Photocopy of engraving from History of Westchester County, Vol. 2, by L.E. Preston & Company, Philadelphia, 1886 ALEXANDER SMITH AND SONS CARPET COMPANY, DETAIL, SPINNING AND PRINT MILLS, - Moquette Row Housing, Moquette Row North & Moquette Row South, Yonkers, Westchester County, NY

  19. 13. Photocopy of engraving from History of Westchester County, Vol. ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    13. Photocopy of engraving from History of Westchester County, Vol. 2, by J. Thomas Scharf, published by L.E. Preston & Company, Philadelphia, 1886 ALEXANDER SMITH AND SONS CARPET COMPANY, MOQUETTE MILLS, WEAVING MILLS, SPINNING AND PRINT MILLS - Moquette Row Housing, Moquette Row North & Moquette Row South, Yonkers, Westchester County, NY

  20. 15. Photocopy of engraving from History of Westchester County, Vol. ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    15. Photocopy of engraving from History of Westchester County, Vol. 2, by J. Thomas Scharf, published by L.E. Preston ALEXANDER SMITH AND SONS CARPET COMPANY, DETAIL, MOQUETTE MILLS - Moquette Row Housing, Moquette Row North & Moquette Row South, Yonkers, Westchester County, NY

  1. 3. Photocopy form Western Architect, Vol, 19, No. 8, August ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    3. Photocopy form Western Architect, Vol, 19, No. 8, August 1913, following page 80. 'TOWN AND COMMUNITY PLANNING, WALTER BURLEY GRIFFEN.' ORIGINAL PRESENTATION DRAWING AT NORTHWESTERN UNIVERSITY, ART DEPARTMENT. - Joshua G. Melson House, 56 River Heights Drive, Mason City, Cerro Gordo County, IA

  2. Optimal segmentation and packaging process

    DOEpatents

    Kostelnik, Kevin M.; Meservey, Richard H.; Landon, Mark D.

    1999-01-01

    A process for improving packaging efficiency uses three dimensional, computer simulated models with various optimization algorithms to determine the optimal segmentation process and packaging configurations based on constraints including container limitations. The present invention is applied to a process for decontaminating, decommissioning (D&D), and remediating a nuclear facility involving the segmentation and packaging of contaminated items in waste containers in order to minimize the number of cuts, maximize packaging density, and reduce worker radiation exposure. A three-dimensional, computer simulated, facility model of the contaminated items are created. The contaminated items are differentiated. The optimal location, orientation and sequence of the segmentation and packaging of the contaminated items is determined using the simulated model, the algorithms, and various constraints including container limitations. The cut locations and orientations are transposed to the simulated model. The contaminated items are actually segmented and packaged. The segmentation and packaging may be simulated beforehand. In addition, the contaminated items may be cataloged and recorded.

  3. Miniaturization of dielectric liquid microlens in package

    PubMed Central

    Yang, Chih-Cheng; Tsai, C. Gary; Yeh, J. Andrew

    2010-01-01

    This study presents packaged microscale liquid lenses actuated with liquid droplets of 300–700 μm in diameter using the dielectric force manipulation. The liquid microlens demonstrated function focal length tunability in a plastic package. The focal length of the liquid lens with a lens droplet of 500 μm in diameter is shortened from 4.4 to 2.2 mm when voltages applied change from 0 to 79 Vrms. Dynamic responses that are analyzed using 2000 frames∕s high speed motion cameras show that the advancing and receding times are measured to be 90 and 60 ms, respectively. The size effect of dielectric liquid microlens is characterized for a lens droplet of 300–700 μm in diameter in an aspect of focal length. PMID:21267438

  4. (abstract) Electronic Packaging for Microspacecraft Applications

    NASA Technical Reports Server (NTRS)

    Wasler, David

    1993-01-01

    The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft.

  5. Experiment Safety Assurance Package for the 40- to 52-GWd/MT Burnup Phase of Mixed Oxide Fuel Irradiation in Small I-hole Positions in the Advanced Test Reactor

    SciTech Connect

    S. T. Khericha; R. C. Pedersen

    2003-09-01

    This experiment safety assurance package (ESAP) is a revision of the last mixed uranium and plutonium oxide (MOX) ESAP issued in June 2002). The purpose of this revision is to provide a basis to continue irradiation up to 52 GWd/MT burnup [as predicted by MCNP (Monte Carlo N-Particle) transport code The last ESAP provided basis for irradiation, at a linear heat generation rate (LHGR) no greater than 9 kW/ft, of the highest burnup capsule assembly to 50 GWd/MT. This ESAP extends the basis for irradiation, at a LHGR no greater than 5 kW/ft, of the highest burnup capsule assembly from 50 to 52 GWd/MT.

  6. New packaging technologies for the 21st century.

    PubMed

    Eilert, S J

    2005-09-01

    This paper reviews the major influencers that will drive change in meat packaging. A review of the current state of fresh-meat packaging in the US has shown a continued evolution to case ready packaging, with 60% of the packages audited being in the case ready format, versus 49% just two years earlier. Additionally, the market is moving to a higher degree of convenience in the meat case, and reducing the linear feet devoted to fresh meat (69% fresh meat linear feet two years ago, versus 63% in 2004). Additional evidence for the growth of convenience items was shown by a 48% growth in shelf stable meal kits between 1998 and 2003. Packaging innovations have been developed to meet these needs for convenience, but have largely been implemented outside of the meat industry. These include, but are not limited to, lines of hand-held soups, self-heating cans and cartons that are replacing the traditional steel can for retort purposes. The recent developments of films that are ovenable in traditional as well as microwave ovens are critical to the further advancement of convenience meat items. Material costs are also driving the need for packaging innovations. Polyethylene costs rose 20% during the second half of 2003, which is largely due to increased petroleum costs. As petroleum costs are sustained at the current high levels, renewable packaging for food, such as materials based on polylactide, will become more feasible. Labor costs and availability at retail will continue to drive the demand for case ready packaging innovations. The recent regulatory approval of carbon monoxide in fresh meat packaging in the US will enable greater usage of low oxygen packaging formats and should provide greater retail acceptance of case ready in the US.

  7. Packaging - Materials review

    SciTech Connect

    Herrmann, Matthias

    2014-06-16

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  8. Packaging - Materials review

    NASA Astrophysics Data System (ADS)

    Herrmann, Matthias

    2014-06-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  9. The LEOS Interpolation Package

    SciTech Connect

    Fritsch, F N

    2003-03-12

    This report describes the interpolation package in the Livermore Equation of State (LEOS) system. It is an updated and expanded version of report [1], which described the status of the package as of May 1998, and of [2], which described its status as of the August 2001 release of the LEOS access library, and of [3], which described its status as of library version 7.02, released April 2002. This corresponds to library version 7.11, released March 2003. The main change since [3] has been the addition of the monotone bicubic Hermite (bimond) interpolation method. Throughout this report we assume that data has been given for some function f({rho},T) on a rectangular mesh {rho} = {rho}{sub 0}, {rho}{sub 1}, ..., {rho}{sub nr-1}; T = T{sub 0}, T{sub 1}, ..., T{sub nt-1}. Subscripting is from zero to be consistent with the C code. (Although we use this notation throughout, there is nothing in the package that assumes that the independent variables are actually density and temperature.) The data values are f{sub ij} = f({rho}{sub j},T{sub i}). (This subscript order is historical and reflects the notation used in the program.) There are nr x nt data values, (nr-1) x (nt-1) mesh rectangles (boxes). In the C code, the data array is one-dimensional, with data [i*(nr-1)+j] = f({rho}{sub j},T{sub i}). In the case of the few univariate functions supported by LEOS, the T variable is omitted, as well as the associated index on the data array: data [j] = f({rho}{sub j}).

  10. Mother-baby package.

    PubMed

    Tamburlini, G

    1995-07-01

    The World Health Organization (WHO) Maternal Health and Safe Motherhood Programme developed the Mother-Baby package to facilitate the development of national strategies and plans of action. It was presented at an international meeting in Geneva in April 1994. The goals of the package are by the year 2000 to reduce maternal mortality by half and perinatal and neonatal mortality by 30-40% of 1990 levels. The package comprises: 1) a section on the technical basis and underlying strategies, 2) a section describing intervention before and during pregnancy, and during and after delivery, and 3) detailed recommendations on operating the program. The underlying strategy aims to reduce the number of high-risk and unwanted pregnancies; the number of obstetric complications; and the case fatality rate in women with complications. Interventions are based on a fourfold approach of family planning, quality antenatal care, clean and safe delivery, and access to essential obstetric care for high-risk pregnancies and complications. The district health system is the basic unit for planning and implementing the interventions. Midwives who live in the community are best equipped to provide appropriate community-based care to pregnant women. Pregnancy and obstetric complications requiring surgery and anesthesia should be available in the district hospital with an adequate referral system. Upgrading the skills of traditional birth attendants is also essential. National authorities should undertake a series of steps to carry out the interventions. A basic infrastructure, the upgrading of peripheral facilities, the development of human resources for safe motherhood, the effective delegation of responsibility, information, education, and communication (IEC), the involvement of nongovernmental organizations and women's groups, and the monitoring of results are other important elements in carrying out the interventions.

  11. New package for CMOS sensors

    NASA Astrophysics Data System (ADS)

    Diot, Jean-Luc; Loo, Kum Weng; Moscicki, Jean-Pierre; Ng, Hun Shen; Tee, Tong Yan; Teysseyre, Jerome; Yap, Daniel

    2004-02-01

    Cost is the main drawback of existing packages for C-MOS sensors (mainly CLCC family). Alternative packages are thus developed world-wide. And in particular, S.T.Microelectronics has studied a low cost alternative packages based on QFN structure, still with a cavity. Intensive work was done to optimize the over-molding operation forming the cavity onto a metallic lead-frame (metallic lead-frame is a low cost substrate allowing very good mechanical definition of the final package). Material selection (thermo-set resin and glue for glass sealing) was done through standard reliability tests for cavity packages (Moisture Sensitivity Level 3 followed by temperature cycling, humidity storage and high temperature storage). As this package concept is new (without leads protruding the molded cavity), the effect of variation of package dimensions, as well as board lay-out design, are simulated on package life time (during temperature cycling, thermal mismatch between board and package leads to thermal fatigue of solder joints). These simulations are correlated with an experimental temperature cycling test with daisy-chain packages.

  12. Aristos Optimization Package

    SciTech Connect

    Ridzal, Danis

    2007-03-01

    Aristos is a Trilinos package for nonlinear continuous optimization, based on full-space sequential quadratic programming (SQP) methods. Aristos is specifically designed for the solution of large-scale constrained optimization problems in which the linearized constraint equations require iterative (i.e. inexact) linear solver techniques. Aristos' unique feature is an efficient handling of inexactness in linear system solves. Aristos currently supports the solution of equality-constrained convex and nonconvex optimization problems. It has been used successfully in the area of PDE-constrained optimization, for the solution of nonlinear optimal control, optimal design, and inverse problems.

  13. KAPPA: Kernel Applications Package

    NASA Astrophysics Data System (ADS)

    Currie, Malcolm J.; Berry, David S.

    2014-03-01

    KAPPA comprising about 180 general-purpose commands for image processing, data visualization, and manipulation of the standard Starlink data format--the NDF. It works with Starlink's various specialized packages; in addition to the NDF, KAPPA can also process data in other formats by using the "on-the-fly" conversion scheme. Many commands can process data arrays of arbitrary dimension, and others work on both spectra and images. KAPPA operates from both the UNIX C-shell and the ICL command language. KAPPA uses the Starlink environment (ascl:1110.012).

  14. Aristos Optimization Package

    2007-03-01

    Aristos is a Trilinos package for nonlinear continuous optimization, based on full-space sequential quadratic programming (SQP) methods. Aristos is specifically designed for the solution of large-scale constrained optimization problems in which the linearized constraint equations require iterative (i.e. inexact) linear solver techniques. Aristos' unique feature is an efficient handling of inexactness in linear system solves. Aristos currently supports the solution of equality-constrained convex and nonconvex optimization problems. It has been used successfully in the areamore » of PDE-constrained optimization, for the solution of nonlinear optimal control, optimal design, and inverse problems.« less

  15. Safety Analysis Report for packaging (onsite) steel waste package

    SciTech Connect

    BOEHNKE, W.M.

    2000-07-13

    The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A{sub 2}s) and is a type B packaging.

  16. Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system.

    PubMed

    Sterken, Tom; Vanfleteren, Jan; Torfs, Tom; de Beeck, Maaike Op; Bossuyt, Frederick; Van Hoof, Chris

    2011-01-01

    A comfortable, wearable wireless ECG monitoring system is proposed. The device is realized using the combination of two proprietary advanced technologies for electronic packaging and interconnection : the UTCP (Ultra-Thin Chip Package) technology and the SMI (Stretchable Mould Interconnect) technology for elastic and stretchable circuits. Introduction of these technologies results in small fully functional devices, exhibiting a significant increase in user comfort compared to devices fabricated with more conventional packaging and interconnection technologies.

  17. IIP Update: A Packaged Coherent Doppler Wind Lidar Transceiver. Doppler Aerosol WiNd Lidar (DAWN)

    NASA Technical Reports Server (NTRS)

    Kavaya, Michael J.; Koch, Grady J.; Yu, Jirong; Trieu, Bo C.; Amzajerdian, Farzin; Singh, Upendra N.; Petros, Mulugeta

    2006-01-01

    The state-of-the-art 2-micron coherent Doppler wind lidar breadboard at NASA/LaRC will be engineered and compactly packaged consistent with future aircraft flights. The packaged transceiver will be integrated into a coherent Doppler wind lidar system test bed at LaRC. Atmospheric wind measurements will be made to validate the packaged technology. This will greatly advance the coherent part of the hybrid Doppler wind lidar solution to the need for global tropospheric wind measurements.

  18. Japan's electronic packaging technologies

    NASA Technical Reports Server (NTRS)

    Tummala, Rao R.; Pecht, Michael

    1995-01-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  19. Japan's electronic packaging technologies

    NASA Astrophysics Data System (ADS)

    Tummala, Rao R.; Pecht, Michael

    1995-02-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  20. CH Packaging Operations Manual

    SciTech Connect

    None, None

    2008-09-11

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing "Short" 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing "Tall" 85-gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing SWB Payload Assembly; and 1.7, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence.

  1. CH Packaging Operations Manual

    SciTech Connect

    None, None

    2009-05-27

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing "Short" 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing "Tall" 85-Gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing Shielded Container Payload Assembly; 1.7, Preparing SWB Payload Assembly; and 1.8, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence, except as noted.

  2. The reduction of packaging waste

    SciTech Connect

    Raney, E.A.; McCollom, M.; Hogan, J.

    1993-04-01

    Nationwide, packaging waste comprises approximately one third of the waste being sent to our solid waste landfills. These wastes range from product and shipping containers made from plastic, glass, wood, and corrugated cardboard to packaging fillers and wraps made from a variety of plastic materials such as shrink wrap and polystyrene peanuts. The amount of packaging waste generated is becoming an important issue for manufacturers, retailers, and consumers. Elimination of packaging not only conserves precious landfill space, it also reduces consumption of raw materials and energy, all of which result in important economic and environmental benefits. At the US Department of Energy-Richland Field Office's (DOE-RL) Hanford Site as well as other DOE sites the generation of packaging waste has added importance. By reducing the amount of packaging waste, DOE also reduces the costs and liabilities associated with waste handling, treatment, storage, and disposal.

  3. The reduction of packaging waste

    SciTech Connect

    Raney, E.A.; McCollom, M.; Hogan, J.

    1993-04-01

    Nationwide, packaging waste comprises approximately one third of the waste being sent to our solid waste landfills. These wastes range from product and shipping containers made from plastic, glass, wood, and corrugated cardboard to packaging fillers and wraps made from a variety of plastic materials such as shrink wrap and polystyrene peanuts. The amount of packaging waste generated is becoming an important issue for manufacturers, retailers, and consumers. Elimination of packaging not only conserves precious landfill space, it also reduces consumption of raw materials and energy, all of which result in important economic and environmental benefits. At the US Department of Energy-Richland Field Office`s (DOE-RL) Hanford Site as well as other DOE sites the generation of packaging waste has added importance. By reducing the amount of packaging waste, DOE also reduces the costs and liabilities associated with waste handling, treatment, storage, and disposal.

  4. Space station power semiconductor package

    NASA Technical Reports Server (NTRS)

    Balodis, Vilnis; Berman, Albert; Devance, Darrell; Ludlow, Gerry; Wagner, Lee

    1987-01-01

    A package of high-power switching semiconductors for the space station have been designed and fabricated. The package includes a high-voltage (600 volts) high current (50 amps) NPN Fast Switching Power Transistor and a high-voltage (1200 volts), high-current (50 amps) Fast Recovery Diode. The package features an isolated collector for the transistors and an isolated anode for the diode. Beryllia is used as the isolation material resulting in a thermal resistance for both devices of .2 degrees per watt. Additional features include a hermetical seal for long life -- greater than 10 years in a space environment. Also, the package design resulted in a low electrical energy loss with the reduction of eddy currents, stray inductances, circuit inductance, and capacitance. The required package design and device parameters have been achieved. Test results for the transistor and diode utilizing the space station package is given.

  5. IN-PACKAGE CHEMISTRY ABSTRACTION

    SciTech Connect

    E. Thomas

    2005-07-14

    This report was developed in accordance with the requirements in ''Technical Work Plan for Postclosure Waste Form Modeling'' (BSC 2005 [DIRS 173246]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as a function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model, which uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model, which is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials, and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed (CDSP) waste packages containing high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor diffusing into the waste package, and (2) seepage water entering the waste package as a liquid from the drift. (1) Vapor-Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H{sub 2}O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Liquid-Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package.

  6. Naval Waste Package Design Report

    SciTech Connect

    M.M. Lewis

    2004-03-15

    A design methodology for the waste packages and ancillary components, viz., the emplacement pallets and drip shields, has been developed to provide designs that satisfy the safety and operational requirements of the Yucca Mountain Project. This methodology is described in the ''Waste Package Design Methodology Report'' Mecham 2004 [DIRS 166168]. To demonstrate the practicability of this design methodology, four waste package design configurations have been selected to illustrate the application of the methodology. These four design configurations are the 21-pressurized water reactor (PWR) Absorber Plate waste package, the 44-boiling water reactor (BWR) waste package, the 5-defense high-level waste (DHLW)/United States (U.S.) Department of Energy (DOE) spent nuclear fuel (SNF) Co-disposal Short waste package, and the Naval Canistered SNF Long waste package. Also included in this demonstration is the emplacement pallet and continuous drip shield. The purpose of this report is to document how that design methodology has been applied to the waste package design configurations intended to accommodate naval canistered SNF. This demonstrates that the design methodology can be applied successfully to this waste package design configuration and support the License Application for construction of the repository.

  7. Hazardous materials package performance regulations

    SciTech Connect

    Russell, N. A.; Glass, R. E.; McClure, J. D.; Finley, N. C.

    1991-01-01

    This paper discusses a hazardous materials Hazmat Packaging Performance Evaluation (HPPE) project being conducted at Sandia National Laboratories for the US Department of Transportation Research Special Programs Administration (DOT-RSPA) to look at the subset of bulk packagings that are larger than 2000 gallons. The objectives of this project are to evaluate current hazmat specification packagings and develop supporting documentation for determining performance requirements for packagings in excess of 2000 gallons that transport hazardous materials that have been classified as extremely toxic by inhalation (METBI).

  8. Experiment Safety Assurance Package for the 40- to 50-GWd/MT Burnup Phase of Mixed Oxide Fuel Irradiation in Small I-Hole Positions in the Advanced Test Reactor

    SciTech Connect

    Khericha, S.T.

    2002-06-30

    This experiment safety assurance package (ESAP) is a revision of the last MOX ESAP issued in February 2001(Khericha 2001). The purpose of this revision is to identify the changes in the loading pattern and to provide a basis to continue irradiation up to {approx}42 GWd/MT burnup (+ 2.5%) as predicted by MCNP (Monte Carlo N-Particle) transport code before the preliminary postirradiation examination (PIE) results for 40 GWd/MT burnup are available. Note that the safety analysis performed for the last ESAP is still applicable and no additional analysis is required (Khericha 2001). In July 2001, it was decided to reconfigure the test assembly using the loading pattern for Phase IV, Part 3, at the end of Phase IV, Part 1, as the loading pattern for Phase IV, Parts 2 and 3. Three capsule assemblies will be irradiated until the highest burnup capsule assembly accumulates: {approx}50 GWd/MT burnup, based on the MCNP code predictions. The last ESAP suggests that at the end of Phase IV, Part 1, we remove the two highest burnup capsule assemblies ({at} {approx}40 GWd/MT burnup) and send them to ORNL for PIE. Then, irradiate the test assembly using the loading pattern for Phase IV, Part 2, until the highest burnup capsule reaches {approx}40 GWd/MT burnup per MCNP-predicted values.

  9. Experiment Safety Assurance Package for the 40- to 50-GWd/MT Burnup Phase of Mixed Oxide Fuel Irradiation in Small I-Hole Positions in the Advanced Test Reactor

    SciTech Connect

    Khericha, Soli T

    2002-06-01

    This experiment safety assurance package (ESAP) is a revision of the last MOX ESAP issued in February 2001(Khericha 2001). The purpose of this revision is to identify the changes in the loading pattern and to provide a basis to continue irradiation up to ~42 GWd/MT burnup (+ 2.5% as predicted by MCNP (Monte Carlo N-Particle) transport code before the preliminary postirradiation examination (PIE) results for 40 GWd/MT burnup are available. Note that the safety analysis performed for the last ESAP is still applicable and no additional analysis is required (Khericha 2001). In July 2001, it was decided to reconfigure the test assembly using the loading pattern for Phase IV, Part 3, at the end of Phase IV, Part 1, as the loading pattern for Phase IV, Parts 2 and 3. Three capsule assemblies will be irradiated until the highest burnup capsule assembly accumulates: ~50 GWd/MT burnup, based on the MCNP code predictions. The last ESAP suggests that at the end of Phase IV, Part 1, we remove the two highest burnup capsule assemblies (@ ~40 GWd/MT burnup) and send them to ORNL for PIE. Then, irradiate the test assembly using the loading pattern for Phase IV, Part 2, until the highest burnup capsule reaches ~40 GWd/MT burnup per MCNP-predicted values.

  10. QD : A Double-Double/ Quad-Double Package

    2003-06-04

    This package permits a scientist to perform computations using a precision level of either 32 or 64 decimal digits, by making only minor changes to conventional C++ or Fortran-90 source code. This software takes advantage of certain properties of IEEE floating-point arithmetic, together with advanced numeric algorithms, custom datatypes and operator overloading.

  11. Learning Activity Package, Algebra 124, LAPs 46-55.

    ERIC Educational Resources Information Center

    Holland, Bill

    A series of 10 teacher-prepared Learning Activity Packages (LAPs) in advanced algebra and trigonometry, these units cover absolute value, inequalities, exponents, radicals, and complex numbers; functions; higher degree equations and the derivative; the trigonometric functions; graphs and applications of the trigonometric functions; sequences and…

  12. [Reliability of % vol. declarations on labels of wine bottles].

    PubMed

    Schütz, Harald; Erdmann, Freidoon; Verhoff, Marcel A; Weiler, Günter

    2005-01-01

    The Council Regulation (EC) no. 1493/1999 of 17 May 1999 on the common organisation of the market in wine (Abl. L 179 dated 14/7/1999) and the GMO Wine 2000 (Annex VII A) stipulates that the labels of wine bottles have to indicate, among others, information on the sales designation of the product, the nominal volume and the alcoholic strength. The latter must not differ by more than 0.5% vol. from the alcoholic strength as established by analysis. Only when quality wines are stored in bottles for more than three years, the accepted tolerance limits are +/- 0.8% vol. The presented investigation results show that deviations have to be taken into account which may be highly relevant for forensic practice.

  13. [Reliability of % vol. declarations on labels of wine bottles].

    PubMed

    Schütz, Harald; Erdmann, Freidoon; Verhoff, Marcel A; Weiler, Günter

    2005-01-01

    The Council Regulation (EC) no. 1493/1999 of 17 May 1999 on the common organisation of the market in wine (Abl. L 179 dated 14/7/1999) and the GMO Wine 2000 (Annex VII A) stipulates that the labels of wine bottles have to indicate, among others, information on the sales designation of the product, the nominal volume and the alcoholic strength. The latter must not differ by more than 0.5% vol. from the alcoholic strength as established by analysis. Only when quality wines are stored in bottles for more than three years, the accepted tolerance limits are +/- 0.8% vol. The presented investigation results show that deviations have to be taken into account which may be highly relevant for forensic practice. PMID:15887778

  14. Packaging Design Criteria for the Steel Waste Package

    SciTech Connect

    BOEHNKE, W.M.

    2000-10-19

    This packaging design criteria provides the criteria for the design, fabrication, safety evaluation, and use of the steel waste package (SWP) to transport remote-handled waste and special-case waste from the 324 facility to Central Waste Complex (CWC) for interim storage.

  15. Anhydrous Ammonia Training Module. Trainer's Package. Participant's Package.

    ERIC Educational Resources Information Center

    Beaudin, Bart; And Others

    This document contains a trainer's and a participant's package for teaching employees on site safe handling procedures for working with anhydrous ammonia, especially on farms. The trainer's package includes the following: a description of the module; a competency; objectives; suggested instructional aids; a training outline (or lesson plan) for…

  16. Package Up Your Troubles--An Introduction to Package Libraries

    ERIC Educational Resources Information Center

    Frank, Colin

    1978-01-01

    Discusses a "package deal" library--a prefabricated building including interior furnishing--in terms of costs, fitness for purpose, and interior design, i.e., shelving, flooring, heating, lighting, and humidity. Advantages and disadvantages of the package library are also considered. (Author/MBR)

  17. Praxis I/O package

    SciTech Connect

    Holloway, F.W.; Sherman, T.A.

    1988-04-07

    The Praxis language specification, like Algol and Ada, does not specify any I/O statements. The intent was to provide a standard I/O package as a companion to the compiler. This would allow the user to substitute, or supplement, the I/O package, as needed, for specialized applications. Like Algol, however, Praxis provided only limited (text) I/O for several years. Ada, in contrast, provided a comprehensive standard I/O package from its inception. Digital Equipment Corporation's (DEC's) implementation of Ada, on their VAX family of computers, further supplemented this package with other packages which exploit the I/O facilities available under the VMS operating system. The Praxis I/O package described in this document has been modeled after DEC's implementation of Ada and provides a similar set of I/O facilities. Currently, the I/O package is supported only under VAX/VMS. The design of the package, however, is essentially independent of any operating system (with the exception of the module COMMAND IO). The VAX/VMS version of the I/O package fully exploits the vast I/O facilities which are provided under VAX/VMS and makes them directly available to the Praxis programmer. The design, prototype implementation, and draft documentation of the Praxis I/O Package was done by Tim Sherman as part of a University project in computer science. Subsequent work by both Tim and Fred Holloway lead to a more complete implementation, testing and development of example programs, and inclusion of the package into the Praxis compilers as their principal interface to RMS and VMS.

  18. Tpetra Kernel Package

    2004-03-01

    A package of classes for constructing and using distributed sparse and dense matrices, vectors and graphs. Templated on the scalar and ordinal types so that any valid floating-point type, as well as any valid integer type can be used with these classes. Other non-standard types, such as 3-by-3 matrices for the scalar type and mod-based integers for ordinal types, can also be used. Tpetra is intended to provide the foundation for basic matrix and vectormore » operations for the next generation of Trilinos preconditioners and solvers, It can be considered as the follow-on to Epetra. Tpetra provides distributed memory operations via an abstract parallel machine interface, The most common implementation of this interface will be MPI.« less

  19. Piecewise Cubic Interpolation Package

    1982-04-23

    PCHIP (Piecewise Cubic Interpolation Package) is a set of subroutines for piecewise cubic Hermite interpolation of data. It features software to produce a monotone and "visually pleasing" interpolant to monotone data. Such an interpolant may be more reasonable than a cubic spline if the data contain both 'steep' and 'flat' sections. Interpolation of cumulative probability distribution functions is another application. In PCHIP, all piecewise cubic functions are represented in cubic Hermite form; that is, f(x)more » is determined by its values f(i) and derivatives d(i) at the breakpoints x(i), i=1(1)N. PCHIP contains three routines - PCHIM, PCHIC, and PCHSP to determine derivative values, six routines - CHFEV, PCHFE, CHFDV, PCHFD, PCHID, and PCHIA to evaluate, differentiate, or integrate the resulting cubic Hermite function, and one routine to check for monotonicity. A FORTRAN 77 version and SLATEC version of PCHIP are included.« less

  20. Anasazi Block Eigensolvers Package

    2004-03-01

    ANASAZI is an extensible and interoperable framework for large-scale eigenvalue algorithms. The motivation for this framework is to provide a generic interface to a collection of algorithms for solving large-scale eigenvalue problems. ANASAZI is interoperable because both the matrix and vectors (defining the eigenspace) are considered to be opaque objects---only knowledge of the matrix and vectors via elementary operations is necessary. An implementation of Anasazi is accomplished via the use of interfaces. One of themore » goals of ANASAZI is to allow the user the flexibility to specify the data representation for the matrix and vectors and so leverage any existing software investment. The algorithms that will be included in package are Krylov-based and preconditioned eigensolvers.« less

  1. Tritium waste package

    DOEpatents

    Rossmassler, Rich; Ciebiera, Lloyd; Tulipano, Francis J.; Vinson, Sylvester; Walters, R. Thomas

    1995-01-01

    A containment and waste package system for processing and shipping tritium xide waste received from a process gas includes an outer drum and an inner drum containing a disposable molecular sieve bed (DMSB) seated within outer drum. The DMSB includes an inlet diffuser assembly, an outlet diffuser assembly, and a hydrogen catalytic recombiner. The DMSB absorbs tritium oxide from the process gas and converts it to a solid form so that the tritium is contained during shipment to a disposal site. The DMSB is filled with type 4A molecular sieve pellets capable of adsorbing up to 1000 curies of tritium. The recombiner contains a sufficient amount of catalyst to cause any hydrogen add oxygen present in the process gas to recombine to form water vapor, which is then adsorbed onto the DMSB.

  2. Balloon gondola diagnostics package

    NASA Technical Reports Server (NTRS)

    Cantor, K. M.

    1986-01-01

    In order to define a new gondola structural specification and to quantify the balloon termination environment, NASA developed a balloon gondola diagnostics package (GDP). This addition to the balloon flight train is comprised of a large array of electronic sensors employed to define the forces and accelerations imposed on a gondola during the termination event. These sensors include the following: a load cell, a three-axis accelerometer, two three-axis rate gyros, two magnetometers, and a two axis inclinometer. A transceiver couple allows the data to be telemetered across any in-line rotator to the gondola-mounted memory system. The GDP is commanded 'ON' just prior to parachute deployment in order to record the entire event.

  3. Tritium waste package

    DOEpatents

    Rossmassler, R.; Ciebiera, L.; Tulipano, F.J.; Vinson, S.; Walters, R.T.

    1995-11-07

    A containment and waste package system for processing and shipping tritium oxide waste received from a process gas includes an outer drum and an inner drum containing a disposable molecular sieve bed (DMSB) seated within the outer drum. The DMSB includes an inlet diffuser assembly, an outlet diffuser assembly, and a hydrogen catalytic recombiner. The DMSB absorbs tritium oxide from the process gas and converts it to a solid form so that the tritium is contained during shipment to a disposal site. The DMSB is filled with type 4A molecular sieve pellets capable of adsorbing up to 1000 curies of tritium. The recombiner contains a sufficient amount of catalyst to cause any hydrogen and oxygen present in the process gas to recombine to form water vapor, which is then adsorbed onto the DMSB. 1 fig.

  4. Meros Preconditioner Package

    2004-04-01

    Meros uses the compositional, aggregation, and overload operator capabilities of TSF to provide an object-oriented package providing segregated/block preconditioners for linear systems related to fully-coupled Navier-Stokes problems. This class of preconditioners exploits the special properties of these problems to segregate the equations and use multi-level preconditioners (through ML) on the matrix sub-blocks. Several preconditioners are provided, including the Fp and BFB preconditioners of Kay & Loghin and Silvester, Elman, Kay & Wathen. The overall performancemore » and scalability of these preconditioners approaches that of multigrid for certain types of problems. Meros also provides more traditional pressure projection methods including SIMPLE and SIMPLEC.« less

  5. Thyra Abstract Interface Package

    2005-09-01

    Thrya primarily defines a set of abstract C++ class interfaces needed for the development of abstract numerical atgorithms (ANAs) such as iterative linear solvers, transient solvers all the way up to optimization. At the foundation of these interfaces are abstract C++ classes for vectors, vector spaces, linear operators and multi-vectors. Also included in the Thyra package is C++ code for creating concrete vector, vector space, linear operator, and multi-vector subclasses as well as other utilitiesmore » to aid in the development of ANAs. Currently, very general and efficient concrete subclass implementations exist for serial and SPMD in-core vectors and multi-vectors. Code also currently exists for testing objects and providing composite objects such as product vectors.« less

  6. Chip packaging technique

    NASA Technical Reports Server (NTRS)

    Jayaraj, Kumaraswamy (Inventor); Noll, Thomas E. (Inventor); Lockwood, Harry F. (Inventor)

    2001-01-01

    A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

  7. Electro-Microfluidic Packaging

    SciTech Connect

    BENAVIDES, GILBERT L.; GALAMBOS, PAUL C.

    2002-06-01

    Electro-microfluidics is experiencing explosive growth in new product developments. There are many commercial applications for electro-microfluidic devices such as chemical sensors, biological sensors, and drop ejectors for both printing and chemical analysis. The number of silicon surface micromachined electro-microfluidic products is likely to increase. Manufacturing efficiency and integration of microfluidics with electronics will become important. Surface micromachined microfluidic devices are manufactured with the same tools as IC's (integrated circuits) and their fabrication can be incorporated into the IC fabrication process. In order to realize applications for devices must be developed. An Electro-Microfluidic Dual In-line Package (EMDIP{trademark}) was developed surface micromachined electro-microfluidic devices, a practical method for getting fluid into these to be a standard solution that allows for both the electrical and the fluidic connections needed to operate a great variety of electro-microfluidic devices. The EMDIP{trademark} includes a fan-out manifold that, on one side, mates directly with the 200 micron diameter Bosch etched holes found on the device, and, on the other side, mates to lager 1 mm diameter holes. To minimize cost the EMDIP{trademark} can be injection molded in a great variety of thermoplastics which also serve to optimize fluid compatibility. The EMDIP{trademark} plugs directly into a fluidic printed wiring board using a standard dual in-line package pattern for the electrical connections and having a grid of multiple 1 mm diameter fluidic connections to mate to the underside of the EMDIP{trademark}.

  8. AGC-2 Graphite Preirradiation Data Package

    SciTech Connect

    David Swank; Joseph Lord; David Rohrbaugh; William Windes

    2012-10-01

    The NGNP Graphite R&D program is currently establishing the safe operating envelope of graphite core components for a Very High Temperature Reactor (VHTR) design. The program is generating quantitative data necessary for predicting the behavior and operating performance of the new nuclear graphite grades. To determine the in-service behavior of the graphite for pebble bed and prismatic designs, the Advanced Graphite Creep (AGC) experiment is underway. This experiment is examining the properties and behavior of nuclear grade graphite over a large spectrum of temperatures, neutron fluences and compressive loads. Each experiment consists of over 400 graphite specimens that are characterized prior to irradiation and following irradiation. Six experiments are planned with the first, AGC-1, currently being irradiated in the Advanced Test Reactor (ATR) and pre-irradiation characterization of the second, AGC-2, completed. This data package establishes the readiness of 512 specimens for assembly into the AGC-2 capsule.

  9. Chemical Energy: A Learning Package.

    ERIC Educational Resources Information Center

    Cohen, Ita; Ben-Zvi, Ruth

    1982-01-01

    A comprehensive teaching/learning chemical energy package was developed to overcome conceptual/experimental difficulties and time required for calculation of enthalpy changes. The package consists of five types of activities occuring in repeated cycles: group activities, laboratory experiments, inquiry questionnaires, teacher-led class…

  10. The Macro - TIPS Course Package.

    ERIC Educational Resources Information Center

    Heriot-Watt Univ., Edinburgh (Scotland). Esmee Fairbairn Economics Research Centre.

    The TIPS (Teaching Information Processing System) Course Package was designed to be used with the Macro-Games Course Package (SO 011 930) in order to train college students to apply the tools of economic analysis to current problems. TIPS is used to provide feedback and individualized assignments to students, as well as information about the…

  11. Floriculture. Selected Learning Activity Packages.

    ERIC Educational Resources Information Center

    Clemson Univ., SC. Vocational Education Media Center.

    This series of learning activity packages is based on a catalog of performance objectives, criterion-referenced measures, and performance guides for gardening/groundskeeping developed by the Vocational Education Consortium of States (V-TECS). Learning activity packages are presented in four areas: (1) preparation of soils and planting media, (2)…

  12. Oral Hygiene. Learning Activity Package.

    ERIC Educational Resources Information Center

    Hime, Kirsten

    This learning activity package on oral hygiene is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics…

  13. Packaging Software Assets for Reuse

    NASA Astrophysics Data System (ADS)

    Mattmann, C. A.; Marshall, J. J.; Downs, R. R.

    2010-12-01

    The reuse of existing software assets such as code, architecture, libraries, and modules in current software and systems development projects can provide many benefits, including reduced costs, in time and effort, and increased reliability. Many reusable assets are currently available in various online catalogs and repositories, usually broken down by disciplines such as programming language (Ibiblio for Maven/Java developers, PyPI for Python developers, CPAN for Perl developers, etc.). The way these assets are packaged for distribution can play a role in their reuse - an asset that is packaged simply and logically is typically easier to understand, install, and use, thereby increasing its reusability. A well-packaged asset has advantages in being more reusable and thus more likely to provide benefits through its reuse. This presentation will discuss various aspects of software asset packaging and how they can affect the reusability of the assets. The characteristics of well-packaged software will be described. A software packaging domain model will be introduced, and some existing packaging approaches examined. An example case study of a Reuse Enablement System (RES), currently being created by near-term Earth science decadal survey missions, will provide information about the use of the domain model. Awareness of these factors will help software developers package their reusable assets so that they can provide the most benefits for software reuse.

  14. Solar water heater design package

    NASA Technical Reports Server (NTRS)

    1981-01-01

    Package describes commercial domestic-hot-water heater with roof or rack mounted solar collectors. System is adjustable to pre-existing gas or electric hot-water house units. Design package includes drawings, description of automatic control logic, evaluation measurements, possible design variations, list of materials and installation tools, and trouble-shooting guide and manual.

  15. Sterility of packaged implant components.

    PubMed

    Worthington, Philip

    2005-01-01

    Several implant components in their original glass vial and peel-back packages were subjected to sterility testing to determine whether the contents remained sterile after the expiration date marked on the package had passed. The results from a university microbiology laboratory showed that the contents remained sterile for 6 to 11 years after the expiration dates. PMID:15973959

  16. Blood Pressure. Learning Activity Package.

    ERIC Educational Resources Information Center

    Hime, Kirsten

    This learning activity package on blood pressure is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics…

  17. 19 CFR 191.13 - Packaging materials.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 19 Customs Duties 2 2012-04-01 2012-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed...

  18. 19 CFR 191.13 - Packaging materials.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 19 Customs Duties 2 2011-04-01 2011-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed...

  19. Drug packaging in 2015: risky industry choices and lax regulation.

    PubMed

    2016-06-01

    Prescrire examined the packaging quality of 240 drugs in 2015. No new advances were identified, but drug packaging continues to expose patients to a variety of dangers. Some past advances persist: for example, INNs are often more legible, and recent patient leaflets tend to be clearer and more informative. But these measures are not applied to all drugs, and are rarely applied retroactively to older drugs. The overall picture in 2015 is that many drugs are difficult to identify, risky or downright dangerous to prepare, or supplied with patient leaflets that fail to correctly inform patients about their medication. And measures to prevent drug poisoning in children need to be completely rethought. It is high time for regulators and policy makers to take the issue of drug packaging seriously, so blatant are the signs of their failure to do so: the increasing use of bulk bottles for new drugs; failure to implement guidelines on safe drug packaging (unit-dose presentations, appropriate dosing devices, etc.); and expanding umbrella brands which, given the dangers they pose to patients, should be banned instead. All things considered, healthcare professionals and patients must remain vigilant and report any dangers they identify. A major European initiative on drug packaging is becoming increasingly necessary.

  20. Application of silicon piezoresistive stress test chips in electronic packages

    NASA Astrophysics Data System (ADS)

    Zou, Yida

    In this work, both special (100) and (111) silicon test chips containing an array of optimized piezoresistive stress sensor rosettes have been successfully applied within several electronic packaging configurations. Unlike (100) silicon test chips, (111) silicon test chips are able to measure the complete stress state on the die surface. After calibration and characterization of the test chips, they were packaged into various assemblies. The post packaging resistances of the sensors were then recorded at room temperature, as a function of temperature excursion, and during long term packaging reliability qualification tests (thermal cycling and thermal aging). The stresses on the die surface were calculated using the measured resistance changes and the appropriate theoretical equations. For comparison purposes, three-dimensional nonlinear finite element simulations of the packaging processes were also performed, and the stress predictions were correlated with the experimental test chip data. AAA2 (100) silicon test chips containing optimized four element dual polarity rosettes have been applied within 44 pin Plastic Leaded Chip Carrier (PLCC) packages and 240 pin Quad Flat Packs (QFP's). In these plastic package experiments, comparison of the stress levels induced by various molding compounds was emphasized. Advanced (111) silicon test chips (BMW-1 or BMW-2) comprising an array of optimized eight-element dual polarity piezoresistive sensor rosettes were encapsulated in 240 pin QFP's, 160 pin QFP's, Chip on Board (COB) packages, and 281 pin ceramic Pin Grid Array (PGA) packages. In addition to molding compound evaluations, BMW-1 test chips encapsulated in 240 pin QFP's were used to detect the presence of delaminations between the die surface and the encapsulant. In the wire bonded COB package studies, die surface stress evaluations were conducted after die attachment, and throughout the cure cycle of the liquid encapsulant. The stresses were also studied as a

  1. [Development of a Japanese version of the Valuation of Life (VOL) scale].

    PubMed

    Nakagawa, Takeshi; Gondo, Yasuyuki; Masui, Yukie; Ishioka, Yoshiko; Tabuchi, Megumi; Kamide, Kei; Ikebe, Kazunori; Arai, Yasumichi; Takahashi, Ryutaro

    2013-04-01

    This study developed a Japanese version of the Valuation of Life (VOL) scale, to measure psychological wellbeing among older adults. In Analysis 1, we conducted a factor analysis of 13 items, and identified two factors: positive VOL and spiritual well-being. These factors had adequate degrees of internal consistency, and were related to positive mental health. In Analysis 2, we examined sociodemographic, social, and health predictors for VOL. The role of social factors was stronger than the role of health factors, and spiritual well-being was more related to moral or religious activities than positive VOL. These results suggest that predictors for VOL vary by culture. In Analysis 3, we investigated the relationship between VOL and desired years of life. Positive VOL significantly predicted more desired years of life, whereas spiritual well-being did not. Positive VOL had acceptable reliability and validity. Future research is required to investigate whether VOL predicts survival duration or end-of-life decisions. PMID:23705232

  2. In-Package Chemistry Abstraction

    SciTech Connect

    E. Thomas

    2004-11-09

    This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste package has been

  3. Amesos Solver Package

    SciTech Connect

    Stanley, Vendall S.; Heroux, Michael A.; Hoekstra, Robert J.; Sala, Marzio

    2004-03-01

    Amesos is the Direct Sparse Solver Package in Trilinos. The goal of Amesos is to make AX=S as easy as it sounds, at least for direct methods. Amesos provides interfaces to a number of third party sparse direct solvers, including SuperLU, SuperLU MPI, DSCPACK, UMFPACK and KLU. Amesos provides a common object oriented interface to the best sparse direct solvers in the world. A sparse direct solver solves for x in Ax = b. where A is a matrix and x and b are vectors (or multi-vectors). A sparse direct solver flrst factors A into trinagular matrices L and U such that A = LU via gaussian elimination and then solves LU x = b. Switching amongst solvers in Amesos roquires a change to a single parameter. Yet, no solver needs to be linked it, unless it is used. All conversions between the matrices provided by the user and the format required by the underlying solver is performed by Amesos. As new sparse direct solvers are created, they will be incorporated into Amesos, allowing the user to simpty link with the new solver, change a single parameter in the calling sequence, and use the new solver. Amesos allows users to specify whether the matrix has changed. Amesos can be used anywhere that any sparse direct solver is needed.

  4. Amesos Solver Package

    2004-03-01

    Amesos is the Direct Sparse Solver Package in Trilinos. The goal of Amesos is to make AX=S as easy as it sounds, at least for direct methods. Amesos provides interfaces to a number of third party sparse direct solvers, including SuperLU, SuperLU MPI, DSCPACK, UMFPACK and KLU. Amesos provides a common object oriented interface to the best sparse direct solvers in the world. A sparse direct solver solves for x in Ax = b. wheremore » A is a matrix and x and b are vectors (or multi-vectors). A sparse direct solver flrst factors A into trinagular matrices L and U such that A = LU via gaussian elimination and then solves LU x = b. Switching amongst solvers in Amesos roquires a change to a single parameter. Yet, no solver needs to be linked it, unless it is used. All conversions between the matrices provided by the user and the format required by the underlying solver is performed by Amesos. As new sparse direct solvers are created, they will be incorporated into Amesos, allowing the user to simpty link with the new solver, change a single parameter in the calling sequence, and use the new solver. Amesos allows users to specify whether the matrix has changed. Amesos can be used anywhere that any sparse direct solver is needed.« less

  5. Packaging Considerations for Biopreservation

    PubMed Central

    Woods, Erik J.; Thirumala, Sreedhar

    2011-01-01

    Summary The packaging system chosen for biopreservation is critical for many reasons. An ideal biopreservation container system must provide for closure integrity, sample stability and ready access to the preserved material. This means the system needs to be hermetically sealed to ensure integrity of the specimen is maintained throughout processing, storage and distribution; the system must remain stable over long periods of time as many biobanked samples may be stored indefinitely; and functionally closed access systems must be used to avoid contamination upon sample withdraw. This study reviews the suitability of a new commercially available vial configuration container utilizing blood bag style closure and access systems that can be hermetically sealed and remain stable through cryopreservation and biobanking procedures. This vial based systems allow for current good manufacturing/tissue practice (cGTP) requirements during processing of samples and may provide the benefit of ease of delivery by a care giver. In this study, the CellSeal® closed system cryovial was evaluated and compared to standard screw cap vials. The CellSeal system was evaluated for durability, closure integrity through transportation and maintenance of functional viability of a cryopreserved mesenchymal stem cell model. The results of this initial proof-of-concept study indicated that the CellSeal vials are highly suitable for biopreservation and biobanking, and provide a suitable container system for clinical and commercial cell therapy products frozen in small volumes. PMID:21566715

  6. Laser Welding in Electronic Packaging

    NASA Technical Reports Server (NTRS)

    2000-01-01

    The laser has proven its worth in numerous high reliability electronic packaging applications ranging from medical to missile electronics. In particular, the pulsed YAG laser is an extremely flexible and versatile too] capable of hermetically sealing microelectronics packages containing sensitive components without damaging them. This paper presents an overview of details that must be considered for successful use of laser welding when addressing electronic package sealing. These include; metallurgical considerations such as alloy and plating selection, weld joint configuration, design of optics, use of protective gases and control of thermal distortions. The primary limitations on use of laser welding electronic for packaging applications are economic ones. The laser itself is a relatively costly device when compared to competing welding equipment. Further, the cost of consumables and repairs can be significant. These facts have relegated laser welding to use only where it presents a distinct quality or reliability advantages over other techniques of electronic package sealing. Because of the unique noncontact and low heat inputs characteristics of laser welding, it is an ideal candidate for sealing electronic packages containing MEMS devices (microelectromechanical systems). This paper addresses how the unique advantages of the pulsed YAG laser can be used to simplify MEMS packaging and deliver a product of improved quality.

  7. Naval Waste Package Design Sensitivity

    SciTech Connect

    T. Schmitt

    2006-12-13

    The purpose of this calculation is to determine the sensitivity of the structural response of the Naval waste packages to varying inner cavity dimensions when subjected to a comer drop and tip-over from elevated surface. This calculation will also determine the sensitivity of the structural response of the Naval waste packages to the upper bound of the naval canister masses. The scope of this document is limited to reporting the calculation results in terms of through-wall stress intensities in the outer corrosion barrier. This calculation is intended for use in support of the preliminary design activities for the license application design of the Naval waste package. It examines the effects of small changes between the naval canister and the inner vessel, and in these dimensions, the Naval Long waste package and Naval Short waste package are similar. Therefore, only the Naval Long waste package is used in this calculation and is based on the proposed potential designs presented by the drawings and sketches in References 2.1.10 to 2.1.17 and 2.1.20. All conclusions are valid for both the Naval Long and Naval Short waste packages.

  8. Optimal segmentation and packaging process

    DOEpatents

    Kostelnik, K.M.; Meservey, R.H.; Landon, M.D.

    1999-08-10

    A process for improving packaging efficiency uses three dimensional, computer simulated models with various optimization algorithms to determine the optimal segmentation process and packaging configurations based on constraints including container limitations. The present invention is applied to a process for decontaminating, decommissioning (D and D), and remediating a nuclear facility involving the segmentation and packaging of contaminated items in waste containers in order to minimize the number of cuts, maximize packaging density, and reduce worker radiation exposure. A three-dimensional, computer simulated, facility model of the contaminated items are created. The contaminated items are differentiated. The optimal location, orientation and sequence of the segmentation and packaging of the contaminated items is determined using the simulated model, the algorithms, and various constraints including container limitations. The cut locations and orientations are transposed to the simulated model. The contaminated items are actually segmented and packaged. The segmentation and packaging may be simulated beforehand. In addition, the contaminated items may be cataloged and recorded. 3 figs.

  9. Materials for high-density electronic packaging and interconnection

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production.

  10. Qualification and Reliability for MEMS and IC Packages

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2004-01-01

    Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

  11. Safety evaluation for packaging (onsite) concrete-lined waste packaging

    SciTech Connect

    Romano, T.

    1997-09-25

    The Pacific Northwest National Laboratory developed a package to ship Type A, non-transuranic, fissile excepted quantities of liquid or solid radioactive material and radioactive mixed waste to the Central Waste Complex for storage on the Hanford Site.

  12. Packaging of solid state devices

    DOEpatents

    Glidden, Steven C.; Sanders, Howard D.

    2006-01-03

    A package for one or more solid state devices in a single module that allows for operation at high voltage, high current, or both high voltage and high current. Low thermal resistance between the solid state devices and an exterior of the package and matched coefficient of thermal expansion between the solid state devices and the materials used in packaging enables high power operation. The solid state devices are soldered between two layers of ceramic with metal traces that interconnect the devices and external contacts. This approach provides a simple method for assembling and encapsulating high power solid state devices.

  13. Microelectronics packaging research directions for aerospace applications

    NASA Technical Reports Server (NTRS)

    Galbraith, L.

    2003-01-01

    The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.

  14. Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2012-03-01

    Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surfacemount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

  15. High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

    NASA Technical Reports Server (NTRS)

    Shalkhauser, K. A.; Li, K.; Shih, Y. C.

    1992-01-01

    Packaging schemes were developed that provide low-loss, hermetic enclosure for advanced monolithic microwave and millimeter-wave integrated circuits (MMICs). The package designs are based on a fused quartz substrate material that offers improved radio frequency (RF) performance through 44 gigahertz (GHz). The small size and weight of the packages make them appropriate for a variety of applications, including phased array antenna systems. Packages were designed in two forms; one for housing a single MMIC chip, the second in the form of a multi-chip phased array module. The single chip array module was developed in three separate sizes, for chips of different geometry and frequency requirements. The phased array module was developed to address packaging directly for antenna applications, and includes transmission line and interconnect structures to support multi-element operation. All packages are fabricated using fused quartz substrate materials. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. The package and test fixture designs were both developed in a generic sense, optimizing performance for a wide range of possible applications and devices.

  16. New Packaging for Amplifier Slabs

    SciTech Connect

    Riley, M.; Thorsness, C.; Suratwala, T.; Steele, R.; Rogowski, G.

    2015-03-18

    The following memo provides a discussion and detailed procedure for a new finished amplifier slab shipping and storage container. The new package is designed to maintain an environment of <5% RH to minimize weathering.

  17. Spack: the Supercomputing Package Manager

    SciTech Connect

    Gamblin, T.

    2013-11-09

    The HPC software ecosystem is growing larger and more complex, but software distribution mechanisms have not kept up with this trend. Tools, Libraries, and applications need to run on multiple platforms and build with multiple compliers. Increasingly, packages leverage common software components, and building any one component requires building all of its dependencies. In HPC environments, ABI-incompatible interfaces (likeMPI), binary-incompatible compilers, and cross-compiled environments converge to make the build process a combinatoric nightmare. This obstacle deters many users from adopting useful tools, and others waste countless hours building and rebuilding tools. Many package managers exist to solve these problems for typical desktop environments, but none suits the unique needs of supercomputing facilities or users. To address these problems, we have Spack, a package manager that eases the task of managing software for end-users, across multiple platforms, package versions, compilers, and ABI incompatibilities.

  18. Spack: the Supercomputing Package Manager

    2013-11-09

    The HPC software ecosystem is growing larger and more complex, but software distribution mechanisms have not kept up with this trend. Tools, Libraries, and applications need to run on multiple platforms and build with multiple compliers. Increasingly, packages leverage common software components, and building any one component requires building all of its dependencies. In HPC environments, ABI-incompatible interfaces (likeMPI), binary-incompatible compilers, and cross-compiled environments converge to make the build process a combinatoric nightmare. This obstaclemore » deters many users from adopting useful tools, and others waste countless hours building and rebuilding tools. Many package managers exist to solve these problems for typical desktop environments, but none suits the unique needs of supercomputing facilities or users. To address these problems, we have Spack, a package manager that eases the task of managing software for end-users, across multiple platforms, package versions, compilers, and ABI incompatibilities.« less

  19. Packaging Review Guide for Reviewing Safety Analysis Reports for Packagings

    SciTech Connect

    DiSabatino, A; Biswas, D; DeMicco, M; Fisher, L E; Hafner, R; Haslam, J; Mok, G; Patel, C; Russell, E

    2007-04-12

    This Packaging Review Guide (PRG) provides guidance for Department of Energy (DOE) review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE Order 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his or her review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. This PRG is generally organized at the section level in a format similar to that recommended in Regulatory Guide 7.9 (RG 7.9). One notable exception is the addition of Section 9 (Quality Assurance), which is not included as a separate chapter in RG 7.9. Within each section, this PRG addresses the technical and regulatory bases for the review, the manner in which the review is accomplished, and findings that are generally applicable for a package that meets the approval standards. This Packaging Review Guide (PRG) provides guidance for DOE review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE O 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. The primary objectives of this PRG are to: (1) Summarize the regulatory requirements for package approval; (2) Describe the technical review procedures by which DOE determines that these requirements have been satisfied; (3) Establish and maintain the quality and uniformity of reviews; (4) Define the base from which to evaluate proposed changes in scope

  20. Watermarking spot colors in packaging

    NASA Astrophysics Data System (ADS)

    Reed, Alastair; Filler, TomáÅ.¡; Falkenstern, Kristyn; Bai, Yang

    2015-03-01

    In January 2014, Digimarc announced Digimarc® Barcode for the packaging industry to improve the check-out efficiency and customer experience for retailers. Digimarc Barcode is a machine readable code that carries the same information as a traditional Universal Product Code (UPC) and is introduced by adding a robust digital watermark to the package design. It is imperceptible to the human eye but can be read by a modern barcode scanner at the Point of Sale (POS) station. Compared to a traditional linear barcode, Digimarc Barcode covers the whole package with minimal impact on the graphic design. This significantly improves the Items per Minute (IPM) metric, which retailers use to track the checkout efficiency since it closely relates to their profitability. Increasing IPM by a few percent could lead to potential savings of millions of dollars for retailers, giving them a strong incentive to add the Digimarc Barcode to their packages. Testing performed by Digimarc showed increases in IPM of at least 33% using the Digimarc Barcode, compared to using a traditional barcode. A method of watermarking print ready image data used in the commercial packaging industry is described. A significant proportion of packages are printed using spot colors, therefore spot colors needs to be supported by an embedder for Digimarc Barcode. Digimarc Barcode supports the PANTONE spot color system, which is commonly used in the packaging industry. The Digimarc Barcode embedder allows a user to insert the UPC code in an image while minimizing perceptibility to the Human Visual System (HVS). The Digimarc Barcode is inserted in the printing ink domain, using an Adobe Photoshop plug-in as the last step before printing. Since Photoshop is an industry standard widely used by pre-press shops in the packaging industry, a Digimarc Barcode can be easily inserted and proofed.

  1. TRU waste transportation package development

    SciTech Connect

    Eakes, R. G.; Lamoreaux, G. H.; Romesberg, L. E.; Sutherland, S. H.; Duffey, T. A.

    1980-01-01

    Inventories of the transuranic wastes buried or stored at various US DOE sites are tabulated. The leading conceptual design of Type-B packaging for contact-handled transuranic waste is the Transuranic Package Transporter (TRUPACT), a large metal container comprising inner and outer tubular steel frameworks which are separated by rigid polyurethane foam and sheathed with steel plate. Testing of TRUPACT is reported. The schedule for its development is given. 6 figures. (DLC)

  2. Rapid Active Sampling Package

    NASA Technical Reports Server (NTRS)

    Peters, Gregory

    2010-01-01

    A field-deployable, battery-powered Rapid Active Sampling Package (RASP), originally designed for sampling strong materials during lunar and planetary missions, shows strong utility for terrestrial geological use. The technology is proving to be simple and effective for sampling and processing materials of strength. Although this originally was intended for planetary and lunar applications, the RASP is very useful as a powered hand tool for geologists and the mining industry to quickly sample and process rocks in the field on Earth. The RASP allows geologists to surgically acquire samples of rock for later laboratory analysis. This tool, roughly the size of a wrench, allows the user to cut away swaths of weathering rinds, revealing pristine rock surfaces for observation and subsequent sampling with the same tool. RASPing deeper (.3.5 cm) exposes single rock strata in-situ. Where a geologist fs hammer can only expose unweathered layers of rock, the RASP can do the same, and then has the added ability to capture and process samples into powder with particle sizes less than 150 microns, making it easier for XRD/XRF (x-ray diffraction/x-ray fluorescence). The tool uses a rotating rasp bit (or two counter-rotating bits) that resides inside or above the catch container. The container has an open slot to allow the bit to extend outside the container and to allow cuttings to enter and be caught. When the slot and rasp bit are in contact with a substrate, the bit is plunged into it in a matter of seconds to reach pristine rock. A user in the field may sample a rock multiple times at multiple depths in minutes, instead of having to cut out huge, heavy rock samples for transport back to a lab for analysis. Because of the speed and accuracy of the RASP, hundreds of samples can be taken in one day. RASP-acquired samples are small and easily carried. A user can characterize more area in less time than by using conventional methods. The field-deployable RASP used a Ni

  3. Prevention policies addressing packaging and packaging waste: Some emerging trends.

    PubMed

    Tencati, Antonio; Pogutz, Stefano; Moda, Beatrice; Brambilla, Matteo; Cacia, Claudia

    2016-10-01

    Packaging waste is a major issue in several countries. Representing in industrialized countries around 30-35% of municipal solid waste yearly generated, this waste stream has steadily grown over the years even if, especially in Europe, specific recycling and recovery targets have been fixed. Therefore, an increasing attention starts to be devoted to prevention measures and interventions. Filling a gap in the current literature, this explorative paper is a first attempt to map the increasingly important phenomenon of prevention policies in the packaging sector. Through a theoretical sampling, 11 countries/states (7 in and 4 outside Europe) have been selected and analyzed by gathering and studying primary and secondary data. Results show evidence of three specific trends in packaging waste prevention policies: fostering the adoption of measures directed at improving packaging design and production through an extensive use of the life cycle assessment; raising the awareness of final consumers by increasing the accountability of firms; promoting collaborative efforts along the packaging supply chains. PMID:27372152

  4. Prevention policies addressing packaging and packaging waste: Some emerging trends.

    PubMed

    Tencati, Antonio; Pogutz, Stefano; Moda, Beatrice; Brambilla, Matteo; Cacia, Claudia

    2016-10-01

    Packaging waste is a major issue in several countries. Representing in industrialized countries around 30-35% of municipal solid waste yearly generated, this waste stream has steadily grown over the years even if, especially in Europe, specific recycling and recovery targets have been fixed. Therefore, an increasing attention starts to be devoted to prevention measures and interventions. Filling a gap in the current literature, this explorative paper is a first attempt to map the increasingly important phenomenon of prevention policies in the packaging sector. Through a theoretical sampling, 11 countries/states (7 in and 4 outside Europe) have been selected and analyzed by gathering and studying primary and secondary data. Results show evidence of three specific trends in packaging waste prevention policies: fostering the adoption of measures directed at improving packaging design and production through an extensive use of the life cycle assessment; raising the awareness of final consumers by increasing the accountability of firms; promoting collaborative efforts along the packaging supply chains.

  5. 49 CFR 173.29 - Empty packagings.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Empty packagings. 173.29 Section 173.29... SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for Transportation § 173.29 Empty packagings. (a) General. Except as otherwise provided in this section, an empty packaging containing only the residue of...

  6. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 40 Protection of Environment 23 2010-07-01 2010-07-01 false Unit packaging. 157.27 Section 157.27 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide...

  7. 7 CFR 58.626 - Packaging equipment.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Packaging equipment. 58.626 Section 58.626 Agriculture....626 Packaging equipment. Packaging equipment designed to mechanically fill and close single service... Standards for Equipment for Packaging Frozen Desserts and Cottage Cheese. Quality Specifications for...

  8. 49 CFR 173.63 - Packaging exceptions.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ...) Detonators containing no more than 1 g explosive (excluding ignition and delay charges) that are electric... excepted from the packaging requirements of § 173.62: (1) No more than 50 detonators in one inner packaging... outer packaging; (3) No more than 1000 detonators in one outer packaging; and (4) No material may...

  9. 49 CFR 173.63 - Packaging exceptions.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... packagings. (c)-(e) (f) Detonators containing no more than 1 g explosive (excluding ignition and delay... which case they are excepted from the packaging requirements of § 173.62: (1) No more than 50 detonators... compartment is used as the outer packaging; (3) No more than 1000 detonators in one outer packaging; and...

  10. Think INSIDE the Box: Package Engineering

    ERIC Educational Resources Information Center

    Snyder, Mark; Painter, Donna

    2014-01-01

    Most products people purchase, keep in their homes, and often discard, are typically packaged in some way. Packaging is so prevalent in daily lives that many of take it for granted. That is by design-the expectation of good packaging is that it exists for the sake of the product. The primary purposes of any package (to contain, inform, display,…

  11. 49 CFR 173.411 - Industrial packagings.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... record retention applicable to Industrial Packaging Type 1 (IP-1), Industrial Packaging Type 2 (IP-2), and Industrial Packaging Type 3 (IP-3). (b) Industrial packaging certification and tests. (1) Each IP-1 must meet the general design requirements prescribed in § 173.410. (2) Each IP-2 must meet...

  12. 27 CFR 19.276 - Package scales.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    .... Scales used to weigh packages designed to hold 10 wine gallons or less shall indicate weight in ounces or... 27 Alcohol, Tobacco Products and Firearms 1 2010-04-01 2010-04-01 false Package scales. 19.276... Package scales. Proprietors shall ensure the accuracy of scales used for weighing packages of...

  13. 10 CFR 71.35 - Package evaluation.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 10 Energy 2 2012-01-01 2012-01-01 false Package evaluation. 71.35 Section 71.35 Energy NUCLEAR REGULATORY COMMISSION (CONTINUED) PACKAGING AND TRANSPORTATION OF RADIOACTIVE MATERIAL Application for Package Approval § 71.35 Package evaluation. The application must include the following: (a)...

  14. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 40 Protection of Environment 24 2011-07-01 2011-07-01 false Unit packaging. 157.27 Section 157.27 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide...

  15. 49 CFR 173.29 - Empty packagings.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 2 2011-10-01 2011-10-01 false Empty packagings. 173.29 Section 173.29... SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for Transportation § 173.29 Empty packagings. (a) General. Except as otherwise provided in this section, an empty packaging containing only the residue of...

  16. 7 CFR 58.626 - Packaging equipment.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 3 2011-01-01 2011-01-01 false Packaging equipment. 58.626 Section 58.626 Agriculture....626 Packaging equipment. Packaging equipment designed to mechanically fill and close single service... Standards for Equipment for Packaging Frozen Desserts and Cottage Cheese. Quality Specifications for...

  17. 10 CFR 71.35 - Package evaluation.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 10 Energy 2 2010-01-01 2010-01-01 false Package evaluation. 71.35 Section 71.35 Energy NUCLEAR REGULATORY COMMISSION (CONTINUED) PACKAGING AND TRANSPORTATION OF RADIOACTIVE MATERIAL Application for Package Approval § 71.35 Package evaluation. The application must include the following: (a)...

  18. Packaging commercial CMOS chips for lab on a chip integration.

    PubMed

    Datta-Chaudhuri, Timir; Abshire, Pamela; Smela, Elisabeth

    2014-05-21

    Combining integrated circuitry with microfluidics enables lab-on-a-chip (LOC) devices to perform sensing, freeing them from benchtop equipment. However, this integration is challenging with small chips, as is briefly reviewed with reference to key metrics for package comparison. In this paper we present a simple packaging method for including mm-sized, foundry-fabricated dies containing complementary metal oxide semiconductor (CMOS) circuits within LOCs. The chip is embedded in an epoxy handle wafer to yield a level, large-area surface, allowing subsequent photolithographic post-processing and microfluidic integration. Electrical connection off-chip is provided by thin film metal traces passivated with parylene-C. The parylene is patterned to selectively expose the active sensing area of the chip, allowing direct interaction with a fluidic environment. The method accommodates any die size and automatically levels the die and handle wafer surfaces. Functionality was demonstrated by packaging two different types of CMOS sensor ICs, a bioamplifier chip with an array of surface electrodes connected to internal amplifiers for recording extracellular electrical signals and a capacitance sensor chip for monitoring cell adhesion and viability. Cells were cultured on the surface of both types of chips, and data were acquired using a PC. Long term culture (weeks) showed the packaging materials to be biocompatible. Package lifetime was demonstrated by exposure to fluids over a longer duration (months), and the package was robust enough to allow repeated sterilization and re-use. The ease of fabrication and good performance of this packaging method should allow wide adoption, thereby spurring advances in miniaturized sensing systems. PMID:24682025

  19. BOK-Underfill Optimization for FPGA Package/Assembly

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2011-01-01

    Commercial-off-the-shelf area array package technologies in high-reliability versions are being considered for NASA electronic systems. These packages are prone to early failure due to the severe mechanical shock and vibration of launch, as well as other less severe conditions, such as mechanical loading during descent, rough terrain mobility, handling, and ground tests. As the density of these packages increases and the size of ball interconnections decrease, susceptibility to mechanical loading and cycling fatigue grows. This report presents a summary of the body of knowledge developed for the evaluation of area array packages and is based on surveys of literature from industry and academia. For high-reliability applications, the limited data that exists will be presented. Most data from industry deals with mechanical fatigue caused by four-point bend tests, as well as from drop tests for hand-held electronics; the most recent data will be presented, along with a brief background of prior literature. Understanding the key design guidelines and failure mechanisms from past tests is critical to developing an approach that will minimize future failures. Additional specific testing enables low-risk insertion of these advanced electronic packages.

  20. Green Packaging Management of Logistics Enterprises

    NASA Astrophysics Data System (ADS)

    Zhang, Guirong; Zhao, Zongjian

    From the connotation of green logistics management, we discuss the principles of green packaging, and from the two levels of government and enterprises, we put forward a specific management strategy. The management of green packaging can be directly and indirectly promoted by laws, regulations, taxation, institutional and other measures. The government can also promote new investment to the development of green packaging materials, and establish specialized institutions to identify new packaging materials, standardization of packaging must also be accomplished through the power of the government. Business units of large scale through the packaging and container-based to reduce the use of packaging materials, develop and use green packaging materials and easy recycling packaging materials for proper packaging.

  1. Material efficiency in Dutch packaging policy.

    PubMed

    Worrell, Ernst; van Sluisveld, Mariësse A E

    2013-03-13

    Packaging materials are one of the largest contributors to municipal solid waste generation. In this paper, we evaluate the material impacts of packaging policy in The Netherlands, focusing on the role of material efficiency (or waste prevention). Since 1991, five different policies have been implemented to reduce the environmental impact of packaging. The analysis shows that Dutch packaging policies helped to reduce the total packaging volume until 1999. After 2000, packaging consumption increased more rapidly than the baseline, suggesting that policy measures were not effective. Generally, we see limited attention to material efficiency to reduce packaging material use. For this purpose, we tried to gain more insight in recent activities on material efficiency, by building a database of packaging prevention initiatives. We identified 131 alterations to packaging implemented in the period 2005-2010, of which weight reduction was the predominant approach. More appropriate packaging policy is needed to increase the effectiveness of policies, with special attention to material efficiency. PMID:23359741

  2. The Focal Plane Package for Solar B

    NASA Astrophysics Data System (ADS)

    Title, A.; Tsuneta, S.

    The Focal Plane Package (FPP) of the JAXA Solar B Solar Optical Telescope (SOT) combines an advanced version of Stokes Polarimeter, a tunable birefringent filter, and a set of narrow spectral filters. The Stokes Polarimeter and the filter systems can operate simultaneously allowing the construction of precise vector magnetograms and images in a range of spectral lines. Both the Stokes Polarimeter and the filter systems have controllable fields of view and cadence. A local correlation tracker in the FFP operates a high speed tip-tilt mirror to stabilize the image in all focal planes. The time sequences of precise vector magnetic maps uncompromised by seeing will enable new understanding of how flux emerges through and disappears from the solar surface. The tunable filter can measure the flows in the atmosphere from the lower photosphere through the Chromosphere enabling new insights in the magneto-hydrodynamics of magnetic evolution.

  3. Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2012-01-01

    This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non

  4. Reference waste package environment report

    SciTech Connect

    Glassley, W.E.

    1986-10-01

    One of three candidate repository sites for high-level radioactive waste packages is located at Yucca Mountain, Nevada, in rhyolitic tuff 700 to 1400 ft above the static water table. Calculations indicate that the package environment will experience a maximum temperature of {similar_to}230{sup 0}C at 9 years after emplacement. For the next 300 years the rock within 1 m of the waste packages will remain dehydrated. Preliminary results suggest that the waste package radiation field will have very little effect on the mechanical properties of the rock. Radiolysis products will have a negligible effect on the rock even after rehydration. Unfractured specimens of repository rock show no change in hydrologic characteristics during repeated dehydration-rehydration cycles. Fractured samples with initially high permeabilities show a striking permeability decrease during dehydration-rehydration cycling, which may be due to fracture healing via deposition of silica. Rock-water interaction studies demonstrate low and benign levels of anions and most cations. The development of sorptive secondary phases such as zeolites and clays suggests that anticipated rock-water interaction may produce beneficial changes in the package environment.

  5. Capillary-driven automatic packaging.

    PubMed

    Ding, Yuzhe; Hong, Lingfei; Nie, Baoqing; Lam, Kit S; Pan, Tingrui

    2011-04-21

    Packaging continues to be one of the most challenging steps in micro-nanofabrication, as many emerging techniques (e.g., soft lithography) are incompatible with the standard high-precision alignment and bonding equipment. In this paper, we present a simple-to-operate, easy-to-adapt packaging strategy, referred to as Capillary-driven Automatic Packaging (CAP), to achieve automatic packaging process, including the desired features of spontaneous alignment and bonding, wide applicability to various materials, potential scalability, and direct incorporation in the layout. Specifically, self-alignment and self-engagement of the CAP process induced by the interfacial capillary interactions between a liquid capillary bridge and the top and bottom substrates have been experimentally characterized and theoretically analyzed with scalable implications. High-precision alignment (of less than 10 µm) and outstanding bonding performance (up to 300 kPa) has been reliably obtained. In addition, a 3D microfluidic network, aligned and bonded by the CAP technique, has been devised to demonstrate the applicability of this facile yet robust packaging technique for emerging microfluidic and bioengineering applications.

  6. Package inspection using inverse diffraction

    NASA Astrophysics Data System (ADS)

    McAulay, Alastair D.

    2008-08-01

    More efficient cost-effective hand-held methods of inspecting packages without opening them are in demand for security. Recent new work in TeraHertz sources,1 millimeter waves, presents new possibilities. Millimeter waves pass through cardboard and styrofoam, common packing materials, and also pass through most materials except those with high conductivity like metals which block light and are easily spotted. Estimating refractive index along the path of the beam through the package from observations of the beam passing out of the package provides the necessary information to inspect the package and is a nonlinear problem. So we use a generalized linear inverse technique that we first developed for finding oil by reflection in geophysics.2 The computation assumes parallel slices in the packet of homogeneous material for which the refractive index is estimated. A beam is propagated through this model in a forward computation. The output is compared with the actual observations for the package and an update computed for the refractive indices. The loop is repeated until convergence. The approach can be modified for a reflection system or to include estimation of absorption.

  7. The reduction of packaging waste

    SciTech Connect

    Raney, E.A.; Hogan, J.J.; McCollom, M.L.; Meyer, R.J.

    1994-04-01

    Nationwide, packaging waste comprises approximately one-third of the waste disposed in sanitary landfills. the US Department of Energy (DOE) generated close to 90,000 metric tons of sanitary waste. With roughly one-third of that being packaging waste, approximately 30,000 metric tons are generated per year. The purpose of the Reduction of Packaging Waste project was to investigate opportunities to reduce this packaging waste through source reduction and recycling. The project was divided into three areas: procurement, onsite packaging and distribution, and recycling. Waste minimization opportunities were identified and investigated within each area, several of which were chosen for further study and small-scale testing at the Hanford Site. Test results, were compiled into five ``how-to`` recipes for implementation at other sites. The subject of the recipes are as follows: (1) Vendor Participation Program; (2) Reusable Containers System; (3) Shrink-wrap System -- Plastic and Corrugated Cardboard Waste Reduction; (4) Cardboard Recycling ; and (5) Wood Recycling.

  8. Microelectronics plastic molded packaging

    SciTech Connect

    Johnson, D.R.; Palmer, D.W.; Peterson, D.W.

    1997-02-01

    The use of commercial off-the-shelf (COTS) microelectronics for nuclear weapon applications will soon be reality rather than hearsay. The use of COTS for new technologies for uniquely military applications is being driven by the so-called Perry Initiative that requires the U.S. Department of Defense (DoD) to accept and utilize commercial standards for procurement of military systems. Based on this philosophy, coupled with several practical considerations, new weapons systems as well as future upgrades will contain plastic encapsulated microelectronics. However, a conservative Department of Energy (DOE) approach requires lifetime predictive models. Thus, the focus of the current project is on accelerated testing to advance current aging models as well as on the development of the methodology to be used during WR qualification of plastic encapsulated microelectronics. An additional focal point involves achieving awareness of commercial capabilities, materials, and processes. One of the major outcomes of the project has been the definition of proper techniques for handling and evaluation of modern surface mount parts which might be used in future systems. This program is also raising the familiarity level of plastic within the weapons complex, allowing subsystem design rules accommodating COTS to evolve. A two year program plan is presented along with test results and commercial interactions during this first year.

  9. HALT to qualify electronic packages: a proof of concept

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2014-03-01

    A proof of concept of the Highly Accelerated Life Testing (HALT) technique was explored to assess and optimize electronic packaging designs for long duration deep space missions in a wide temperature range (-150°C to +125°C). HALT is a custom hybrid package suite of testing techniques using environments such as extreme temperatures and dynamic shock step processing from 0g up to 50g of acceleration. HALT testing used in this study implemented repetitive shock on the test vehicle components at various temperatures to precipitate workmanship and/or manufacturing defects to show the weak links of the designs. The purpose is to reduce the product development cycle time for improvements to the packaging design qualification. A test article was built using advanced electronic package designs and surface mount technology processes, which are considered useful for a variety of JPL and NASA projects, i.e. (surface mount packages such as ball grid arrays (BGA), plastic ball grid arrays (PBGA), very thin chip array ball grid array (CVBGA), quad flat-pack (QFP), micro-lead-frame (MLF) packages, several passive components, etc.). These packages were daisy-chained and independently monitored during the HALT test. The HALT technique was then implemented to predict reliability and assess survivability of these advanced packaging techniques for long duration deep space missions in much shorter test durations. Test articles were built using advanced electronic package designs that are considered useful in various NASA projects. All the advanced electronic packages were daisychained independently to monitor the continuity of the individual electronic packages. Continuity of the daisy chain packages was monitored during the HALT testing using a data logging system. We were able to test the boards up to 40g to 50g shock levels at temperatures ranging from +125°C to -150°C. The HALT system can deliver 50g shock levels at room temperature. Several tests were performed by subjecting

  10. Packaging of complete indium-free high reliable and high power diode laser array

    NASA Astrophysics Data System (ADS)

    Wang, Jingwei; Li, Xiaoning; Feng, Feifei; Liu, Yalong; Hou, Dong; Liu, Xingsheng

    2015-02-01

    High power diode lasers have been widely used in many fields. For many applications, a diode laser needs to be robust under on-off power-cycling as well as environmental thermal cycling conditions. To meet the requirements, the conduction cooled single bar CS-packaged diode laser arrays must have high durability to withstand thermal fatigue and long lifetime. In this paper, a complete indium-free bonding technology is presented for packaging high power diode laser arrays. Numerical simulations on the thermal behavior of CS-packaged diode laser array with different packaging structure were conducted and analyzed. Based on the simulation results, the device structure and packaging process of complete indium-free CS-packaged diode laser array were optimized. A series of high power hard solder CS (HCS) diode laser arrays were fabricated and characterized. Under the harsh working condition of 90s on and 30s off, good lifetime was demonstrated on 825nm 60W single bar CS-packaged diode laser with a lifetime test of more than 6100hours achieved so far with less 5% power degradation and less 1.5nm wavelength shift. Additionally, the measurement results indicated that the lower smile of complete indium-free CS-packaged diode laser arrays were achieved by advanced packaging process.

  11. Solidification of Magnesium (AM50A) / vol%. SiCp composite

    NASA Astrophysics Data System (ADS)

    Zhang, X.; Hu, H.

    2012-01-01

    Magnesium matrix composite is one of the advanced lightweight materials with high potential to be used in automotive and aircraft industries due to its low density and high specific mechanical properties. The magnesium composites can be fabricated by adding the reinforcements of fibers or/and particles. In the previous literature, extensive studies have been performed on the development of matrix grain structure of aluminum-based metal matrix composites. However, there is limited information available on the development of grain structure during the solidification of particulate-reinforced magnesium. In this work, a 5 vol.% SiCp particulate-reinforced magnesium (AM50A) matrix composite (AM50A/SiCp) was prepared by stir casting. The solidification behavior of the cast AM50A/SiCp composite was investigated by computer-based thermal analysis. Optical and scanning electron microscopies (SEM) were employed to examine the occurrence of nucleation and grain refinement involved. The results indicate that the addition of SiCp particulates leads to a finer grain structure in the composite compared with the matrix alloy. The refinement of grain structure should be attributed to both the heterogeneous nucleation and the restricted primary crystal growth.

  12. Truss Performance and Packaging Metrics

    NASA Technical Reports Server (NTRS)

    Mikulas, Martin M.; Collins, Timothy J.; Doggett, William; Dorsey, John; Watson, Judith

    2006-01-01

    In the present paper a set of performance metrics are derived from first principals to assess the efficiency of competing space truss structural concepts in terms of mass, stiffness, and strength, for designs that are constrained by packaging. The use of these performance metrics provides unique insight into the primary drivers for lowering structural mass and packaging volume as well as enabling quantitative concept performance evaluation and comparison. To demonstrate the use of these performance metrics, data for existing structural concepts are plotted and discussed. Structural performance data is presented for various mechanical deployable concepts, for erectable structures, and for rigidizable structures.

  13. GNS-12 Packaging design criteria

    SciTech Connect

    Clements, E.P., Westinghouse Hanford

    1996-07-24

    The purpose of this Packaging Design Criteria (PDC) is to provide criteria for the Safety Analysis Report for Packaging (SARP)(Onsite). The SARP provides the evaluation to demonstrate that the onsite transportation safety criteria are met for the transport and storage of the 324 Building vitrified encapsulated material in the GNS-12 cask. In this application, the approved PDC provides a formal set of standards for the payload requirements, and guidance for the current cask transport configuration and a revised storage seal and primary lid modification design.

  14. 49 CFR 173.24a - Additional general requirements for non-bulk packagings and packages.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... PIPELINE AND HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS MATERIALS REGULATIONS SHIPPERS-GENERAL REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for... packaging containing liquid hazardous materials must be packed so that closures on inner packagings...

  15. 49 CFR 173.24a - Additional general requirements for non-bulk packagings and packages.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... PIPELINE AND HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS MATERIALS REGULATIONS SHIPPERS-GENERAL REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for... packaging containing liquid hazardous materials must be packed so that closures on inner packagings...

  16. Package for integrated optic circuit and method

    DOEpatents

    Kravitz, S.H.; Hadley, G.R.; Warren, M.E.; Carson, R.F.; Armendariz, M.G.

    1998-08-04

    A structure and method are disclosed for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package. 6 figs.

  17. Package for integrated optic circuit and method

    DOEpatents

    Kravitz, Stanley H.; Hadley, G. Ronald; Warren, Mial E.; Carson, Richard F.; Armendariz, Marcelino G.

    1998-01-01

    A structure and method for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package.

  18. Multiple Learning Strategies Project. Medical Assistant. Visually Impaired. [Vol. 1.

    ERIC Educational Resources Information Center

    Varney, Beverly; And Others

    This instructional package, one of two designed for visually impaired students, focuses on the vocational area of medical assistant. Contained in this document are twelve learning modules organized into five units: language; receptioning; asepsis; supplies and equipment maintenance; and diagnostic tests. Each module, printed in block type,…

  19. Multiple Learning Strategies Project. Medical Assistant. [Regular Vocational. Vol. 1.

    ERIC Educational Resources Information Center

    Varney, Beverly; And Others

    This instructional package, one of four designed for regular vocational students, focuses on the vocational area of medical assistant. Contained in this document are twenty-six learning modules organized into three units: language; receptioning; and asepsis. Each module includes these elements: a performance objective page telling what will be…

  20. Multiple Learning Strategies Project. Dietetic Assistant. Visually Impaired. [Vol 1.

    ERIC Educational Resources Information Center

    Mackinnon, Barbara; And Others

    This instructional package is one of two designed for visually impaired students on the vocational area of dietetic assistant. The forty-seven learning modules are organized into three units: nutrition; menu planning and food ordering; and housekeeping and safety. Each module, printed in large block type, includes these elements: a performance…

  1. RAGG - R EPISODIC AGGREGATION PACKAGE

    EPA Science Inventory

    The RAGG package is an R implementation of the CMAQ episodic model aggregation method developed by Constella Group and the Environmental Protection Agency. RAGG is a tool to provide climatological seasonal and annual deposition of sulphur and nitrogen for multimedia management. ...

  2. The Macro - Games Course Package.

    ERIC Educational Resources Information Center

    Heriot-Watt Univ., Edinburgh (Scotland). Esmee Fairbairn Economics Research Centre.

    Part of an Economic Education Series, the course package is designed to teach basic concepts and fundamental principles of macroeconomics and how they can be applied to various world problems. For use with college students, learning is gained through lectures, discussion, simulation games, programmed learning, and text. Time allotment is a 15-week…

  3. Improved switch-resistor packaging

    NASA Technical Reports Server (NTRS)

    Redmerski, R. E.

    1980-01-01

    Packaging approach makes resistors more accessible and easily identified with specific switches. Failures are repaired more quickly because of improved accessibility. Typical board includes one resistor that acts as circuit breaker, and others are positioned so that their values can be easily measured when switch is operated. Approach saves weight by using less wire and saves valuable panel space.

  4. ULFEM time series analysis package

    USGS Publications Warehouse

    Karl, Susan M.; McPhee, Darcy K.; Glen, Jonathan M. G.; Klemperer, Simon L.

    2013-01-01

    This manual describes how to use the Ultra-Low-Frequency ElectroMagnetic (ULFEM) software package. Casual users can read the quick-start guide and will probably not need any more information than this. For users who may wish to modify the code, we provide further description of the routines.

  5. Electronic Spreadsheet Packages for Microcomputers.

    ERIC Educational Resources Information Center

    Gibson, Larry M.

    1984-01-01

    Describes capabilities and advantages of spreadsheet software, including its ability to perform "what-if" analysis quickly and easily. Also noted are additional advantages; applications, including use in the library environment; history and development; new-generation spreadsheets; and enhanced packaging in the near future. A spreadsheet software…

  6. DATACUBE: A datacube manipulation package

    NASA Astrophysics Data System (ADS)

    Allan, Alasdair; Currie, Malcolm J.

    2014-05-01

    DATACUBE is a command-line package for manipulating and visualizing data cubes. It was designed for integral field spectroscopy but has been extended to be a generic data cube tool, used in particular for sub-millimeter data cubes from the James Clerk Maxwell Telescope. It is part of the Starlink software collection (ascl:1110.012).

  7. COLDMON -- Cold File Analysis Package

    NASA Astrophysics Data System (ADS)

    Rawlinson, D. J.

    The COLDMON package has been written to allow system managers to identify those items of software that are not used (or used infrequently) on their systems. It consists of a few command procedures and a Fortran program to analyze the results. It makes use of the AUDIT facility and security ACLs in VMS.

  8. Designing for Small Volume Assembly of Advanced Electronics Packages

    NASA Technical Reports Server (NTRS)

    Galbraith, L.; Bonner, J. K.

    1995-01-01

    We describe a general methodology to Design for Producibility and Reliability (DFPAR) for very small volume production runs. In cases where the entire volume for fabrication is less than five products, traditional Statistical Process Control (SPC) is inadequate due to reliance on statistics of much larger volumes and the Central Limit Theorem. Data acquisition for process parameter estimation from such a small sample size is difficult; however, it is critical to producing high reliability product.

  9. 9975 SHIPPING PACKAGE LIFE EXTENSION SURVEILLANCE PROGRAM RESULTS SUMMARY

    SciTech Connect

    Daugherty, W.; Dunn, K.; Hackney, B.; Hoffman, E.; Skidmore, E.

    2011-01-06

    Results from the 9975 Surveillance Program at the Savannah River Site (SRS) are summarized for justification to extend the life of the 9975 packages currently stored in the K-Area Materials Storage (KAMS) facility from 10 years to 15 years. This justification is established with the stipulation that surveillance activities will continue throughout this extended time to ensure the continued integrity of the 9975 materials of construction and to further understand the currently identified degradation mechanisms. The current 10 year storage life was developed prior to storage. A subsequent report was later used to extend the qualification of the 9975 shipping packages for 2 years for shipping plus 10 years for storage. However the qualification for the storage period was provided by the monitoring requirements of the Storage and Surveillance Program. This report summarizes efforts to determine a new safe storage limit for the 9975 shipping package based on the surveillance data collected since 2005 when the surveillance program began. KAMS is a zero-release facility that depends upon containment by the 9975 to meet design basis storage requirements. Therefore, to confirm the continued integrity of the 9975 packages while stored in KAMS, a 9975 Storage and Surveillance Program was implemented alongside the DOE required Integrated Surveillance Program (ISP) for 3013 plutonium-bearing containers. The 9975 Storage and Surveillance Program performs field surveillance as well as accelerated aging tests to ensure any degradation due to aging, to the extent that could affect packaging performance, is detected in advance of such degradation occurring in the field. The Program has demonstrated that the 9975 package has a robust design that can perform under a variety of conditions. As such the primary emphasis of the on-going 9975 Surveillance Program is an aging study of the 9975 Viton(reg.sign) GLT containment vessel O-rings and the Celotex(reg.sign) fiberboard thermal

  10. Enhanced thermaly managed packaging for III-nitride light emitters

    NASA Astrophysics Data System (ADS)

    Kudsieh, Nicolas

    In this Dissertation our work on `enhanced thermally managed packaging of high power semiconductor light sources for solid state lighting (SSL)' is presented. The motivation of this research and development is to design thermally high stable cost-efficient packaging of single and multi-chip arrays of III-nitrides wide bandgap semiconductor light sources through mathematical modeling and simulations. Major issues linked with this technology are device overheating which causes serious degradation in their illumination intensity and decrease in the lifetime. In the introduction the basics of III-nitrides WBG semiconductor light emitters are presented along with necessary thermal management of high power cingulated and multi-chip LEDs and laser diodes. This work starts at chip level followed by its extension to fully packaged lighting modules and devices. Different III-nitride structures of multi-quantum well InGaN/GaN and AlGaN/GaN based LEDs and LDs were analyzed using advanced modeling and simulation for different packaging designs and high thermal conductivity materials. Study started with basic surface mounted devices using conventional packaging strategies and was concluded with the latest thermal management of chip-on-plate (COP) method. Newly discovered high thermal conductivity materials have also been incorporated for this work. Our study also presents the new approach of 2D heat spreaders using such materials for SSL and micro LED array packaging. Most of the work has been presented in international conferences proceedings and peer review journals. Some of the latest work has also been submitted to well reputed international journals which are currently been reviewed for publication. .

  11. New Directions in Discourse Processing. Advances in Discourse Processes, Vol. 2.

    ERIC Educational Resources Information Center

    Freedle, Roy O., Ed.

    Two theoretical orientations-schema theory and cultural norms for the use of language unify this multidisciplinary collection of papers examining discourse. Chapters by Adams and Collins; Warren; Nicholas and Trabasso; Stein and Glenn; and Freedle and Hale highlight the application of schema theory to the study of story recall, reading, and the…

  12. AISI/DOE Advanced Process Control Program Vol. 5 of 6: Phase Measurement of Galvanneal

    SciTech Connect

    Cristopher Burnett; Ronald Guel; James R. Philips; L. Lowry; Beverly Tai

    1999-05-31

    Augmentation of the internal software of a commercial X-ray fluorescence gauge is shown to enable the instrument to extend its continuous on-line real-time measurements of a galvanneal coating's total elemental content to encompass similar measurements of the relative thickness of the coating's three principal metallurgical phases. The mathematical structure of this software augmentation is derived from the theory of neural networks. The performance of the augmented gauge is validated by comparing the gauge implied real-time phase distribution with the phase distribution independently measured off-line on between the gauge and laboratory measurements and to suggest preferred approaches to be followed in future application of the augmented gauge.

  13. FDCSUSYDecay: An MSSM decay package

    NASA Astrophysics Data System (ADS)

    Qi, Wei; Wang, Jian-xiong

    2007-08-01

    FDCSUSYDecay is a FORTRAN program package generated by FDC (Feynman Diagram Calculation) system fully automatically. It is dedicated to calculate at tree-level all the possible 2-body decays of SUSY and Higgs particles in the Minimal Supersymmetric extension of the Standard Model (MSSM). The format of its output files complies with SUSY Les Houches Accord and can be easily imported by other packages. Program summaryManuscript title:FDCSUSYDecay: An MSSM decay package Authors:Wei Qi, Jian-xiong Wang Program title:FDCSUSYDecay (Version 1.00) Catalogue identifier:ADYV_v1_0 Program summary URL:http://cpc.cs.qub.ac.uk/summaries/ADYV_v1_0.html Program obtainable from:CPC Program Library, Queen's University, Belfast, N. Ireland Licensing provisions:Standard CPC licence, http://cpc.cs.qub.ac.uk/licence/licence.html No. of lines in distributed program, including test data, etc.:22 008 No. of bytes in distributed program, including test data, etc.:622 751 Distribution format:tar.gz Programming language:FORTRAN 77 Operating system:Linux Keywords:SUSY decay, MSSM, FDC PACS:02.70.-c, 12.60.Jv Classification:11.1, 11.6 External routines:CERNLIB 2003 (or up) Nature of problem: This package can calculate all the possible SUSY particle and Higgs 2-body decay width and branch ratio at tree-level in the MSSM model. Solution method: By running FDC, the Feynman rules for the MSSM model are generated, all the decay widths are calculated analytically and corresponding FORTRAN codes are generated for this package. Running time: Less than 1 second for both high-scale and low-scale modes on a Pentium IV 2.4 GHz machine (512 MB memory).

  14. Sensory impacts of food-packaging interactions.

    PubMed

    Duncan, Susan E; Webster, Janet B

    2009-01-01

    Sensory changes in food products result from intentional or unintentional interactions with packaging materials and from failure of materials to protect product integrity or quality. Resolving sensory issues related to plastic food packaging involves knowledge provided by sensory scientists, materials scientists, packaging manufacturers, food processors, and consumers. Effective communication among scientists and engineers from different disciplines and industries can help scientists understand package-product interactions. Very limited published literature describes sensory perceptions associated with food-package interactions. This article discusses sensory impacts, with emphasis on oxidation reactions, associated with the interaction of food and materials, including taints, scalping, changes in food quality as a function of packaging, and examples of material innovations for smart packaging that can improve sensory quality of foods and beverages. Sensory evaluation is an important tool for improved package selection and development of new materials. PMID:19389606

  15. Amesos2 Templated Direct Sparse Solver Package

    2011-05-24

    Amesos2 is a templated direct sparse solver package. Amesos2 provides interfaces to direct sparse solvers, rather than providing native solver capabilities. Amesos2 is a derivative work of the Trilinos package Amesos.

  16. Flat-package DIP handling tool

    NASA Technical Reports Server (NTRS)

    Angelou, E.; Fraser, R.

    1977-01-01

    Device, using magnetic attraction, can facilitate handling of integrated-circuit flat packages and prevent contamination and bent leads. Tool lifts packages by their cases and releases them by operation of manual plunger.

  17. Packaging and the environment: a regulation update.

    PubMed

    Fielding, P

    2000-04-01

    This article reports on the progress that is being made on standards and associated documents to support the Packaging and Packaging Waste Directive. Potential revisions are also discussed. PMID:10947328

  18. Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2013-01-01

    Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal

  19. The Feat of Packaging Eight Unique Genome Segments

    PubMed Central

    Giese, Sebastian; Bolte, Hardin; Schwemmle, Martin

    2016-01-01

    Influenza A viruses (IAVs) harbor a segmented RNA genome that is organized into eight distinct viral ribonucleoprotein (vRNP) complexes. Although a segmented genome may be a major advantage to adapt to new host environments, it comes at the cost of a highly sophisticated genome packaging mechanism. Newly synthesized vRNPs conquer the cellular endosomal recycling machinery to access the viral budding site at the plasma membrane. Genome packaging sequences unique to each RNA genome segment are thought to be key determinants ensuring the assembly and incorporation of eight distinct vRNPs into progeny viral particles. Recent studies using advanced fluorescence microscopy techniques suggest the formation of vRNP sub-bundles (comprising less than eight vRNPs) during their transport on recycling endosomes. The formation of such sub-bundles might be required for efficient packaging of a bundle of eight different genomes segments at the budding site, further highlighting the complexity of IAV genome packaging. PMID:27322310

  20. 7 CFR 65.130 - Consumer package.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 3 2011-01-01 2011-01-01 false Consumer package. 65.130 Section 65.130 Agriculture... OF BEEF, PORK, LAMB, CHICKEN, GOAT MEAT, PERISHABLE AGRICULTURAL COMMODITIES, MACADAMIA NUTS, PECANS, PEANUTS, AND GINSENG General Provisions Definitions § 65.130 Consumer package. Consumer package means...

  1. 7 CFR 65.130 - Consumer package.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Consumer package. 65.130 Section 65.130 Agriculture... OF BEEF, PORK, LAMB, CHICKEN, GOAT MEAT, PERISHABLE AGRICULTURAL COMMODITIES, MACADAMIA NUTS, PECANS, PEANUTS, AND GINSENG General Provisions Definitions § 65.130 Consumer package. Consumer package means...

  2. 27 CFR 6.93 - Combination packaging.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ..., DEPARTMENT OF THE TREASURY LIQUORS âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and distributing distilled spirits, wine, or malt beverages in combination... 27 Alcohol, Tobacco Products and Firearms 1 2011-04-01 2011-04-01 false Combination packaging....

  3. 7 CFR 33.6 - Package.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 2 2010-01-01 2010-01-01 false Package. 33.6 Section 33.6 Agriculture Regulations of the Department of Agriculture AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing... ISSUED UNDER AUTHORITY OF THE EXPORT APPLE ACT Definitions § 33.6 Package. Package means any container...

  4. 27 CFR 6.93 - Combination packaging.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2010-04-01 2010-04-01 false Combination packaging. 6..., DEPARTMENT OF THE TREASURY LIQUORS âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and distributing distilled spirits, wine, or malt beverages in...

  5. 9 CFR 354.72 - Packaging.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Packaging. 354.72 Section 354.72... CERTIFICATION VOLUNTARY INSPECTION OF RABBITS AND EDIBLE PRODUCTS THEREOF Supervision of Marking and Packaging § 354.72 Packaging. No container which bears or may bear any official identification or any...

  6. 76 FR 30551 - Specifications for Packagings

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-05-26

    ... Pipeline and Hazardous Materials Safety Administration 49 CFR Part 178 Specifications for Packagings CFR... on a packaging, a test report must be prepared. The test report must be maintained at each location where the packaging is manufactured and each location where the design qualification tests are...

  7. EDExpress Packaging Training, 2001-2002.

    ERIC Educational Resources Information Center

    Office of Student Financial Assistance (ED), Washington, DC.

    Packaging is the process of finding the best combination of aid to meet a student's financial need for college, given limited resources and the institutional constraints that vary from school to school. This guide to packaging under the EDExpress software system outlines three steps to packaging. The first is determining the student's need for…

  8. 7 CFR 58.640 - Packaging.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Packaging. 58.640 Section 58.640 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... Procedures § 58.640 Packaging. The packaging of the semifrozen product shall be done by means which will...

  9. 27 CFR 19.186 - Package scales.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2012-04-01 2012-04-01 false Package scales. 19.186... Package Scale and Pipeline Requirements § 19.186 Package scales. Proprietors must ensure that scales used.... However, if a scale is not used during a 6-month period, it is only necessary to test the scale prior...

  10. 27 CFR 19.186 - Package scales.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2014-04-01 2014-04-01 false Package scales. 19.186... Package Scale and Pipeline Requirements § 19.186 Package scales. Proprietors must ensure that scales used.... However, if a scale is not used during a 6-month period, it is only necessary to test the scale prior...

  11. 27 CFR 19.186 - Package scales.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2011-04-01 2011-04-01 false Package scales. 19.186... Package Scale and Pipeline Requirements § 19.186 Package scales. Proprietors must ensure that scales used.... However, if a scale is not used during a 6-month period, it is only necessary to test the scale prior...

  12. 27 CFR 19.186 - Package scales.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2013-04-01 2013-04-01 false Package scales. 19.186... Package Scale and Pipeline Requirements § 19.186 Package scales. Proprietors must ensure that scales used.... However, if a scale is not used during a 6-month period, it is only necessary to test the scale prior...

  13. 27 CFR 6.93 - Combination packaging.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2012-04-01 2012-04-01 false Combination packaging. 6.93 Section 6.93 Alcohol, Tobacco Products and Firearms ALCOHOL AND TOBACCO TAX AND TRADE BUREAU, DEPARTMENT OF THE TREASURY LIQUORS âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and...

  14. 27 CFR 6.93 - Combination packaging.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2014-04-01 2014-04-01 false Combination packaging. 6.93 Section 6.93 Alcohol, Tobacco Products and Firearms ALCOHOL AND TOBACCO TAX AND TRADE BUREAU, DEPARTMENT OF THE TREASURY ALCOHOL âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and...

  15. 27 CFR 6.93 - Combination packaging.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2013-04-01 2013-04-01 false Combination packaging. 6.93 Section 6.93 Alcohol, Tobacco Products and Firearms ALCOHOL AND TOBACCO TAX AND TRADE BUREAU, DEPARTMENT OF THE TREASURY ALCOHOL âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and...

  16. 49 CFR 173.63 - Packaging exceptions.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    .... (c)-(e) (f) Detonators containing no more than 1 g explosive (excluding ignition and delay charges... which case they are excepted from the packaging requirements of § 173.62: (1) No more than 50 detonators... compartment is used as the outer packaging; (3) No more than 1000 detonators in one outer packaging; and...

  17. 21 CFR 820.130 - Device packaging.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Device packaging. 820.130 Section 820.130 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) MEDICAL DEVICES QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each...

  18. 16 CFR 1702.12 - Packaging specifications.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 16 Commercial Practices 2 2013-01-01 2013-01-01 false Packaging specifications. 1702.12 Section 1702.12 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS PETITIONS FOR EXEMPTIONS FROM POISON PREVENTION PACKAGING ACT REQUIREMENTS; PETITION...

  19. 16 CFR 1702.12 - Packaging specifications.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 16 Commercial Practices 2 2011-01-01 2011-01-01 false Packaging specifications. 1702.12 Section 1702.12 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS PETITIONS FOR EXEMPTIONS FROM POISON PREVENTION PACKAGING ACT REQUIREMENTS; PETITION...

  20. 16 CFR 1702.12 - Packaging specifications.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 16 Commercial Practices 2 2012-01-01 2012-01-01 false Packaging specifications. 1702.12 Section 1702.12 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS PETITIONS FOR EXEMPTIONS FROM POISON PREVENTION PACKAGING ACT REQUIREMENTS; PETITION...

  1. 16 CFR 1702.12 - Packaging specifications.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 16 Commercial Practices 2 2010-01-01 2010-01-01 false Packaging specifications. 1702.12 Section 1702.12 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS PETITIONS FOR EXEMPTIONS FROM POISON PREVENTION PACKAGING ACT REQUIREMENTS; PETITION...

  2. 16 CFR 1702.12 - Packaging specifications.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 16 Commercial Practices 2 2014-01-01 2014-01-01 false Packaging specifications. 1702.12 Section 1702.12 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS PETITIONS FOR EXEMPTIONS FROM POISON PREVENTION PACKAGING ACT REQUIREMENTS; PETITION...

  3. 9 CFR 381.144 - Packaging materials.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... consistent with the Food and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Packaging materials. 381.144 Section... Packaging materials. (a) Edible products may not be packaged in a container which is composed in whole or...

  4. 7 CFR 932.9 - Packaged olives.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 7 Agriculture 8 2013-01-01 2013-01-01 false Packaged olives. 932.9 Section 932.9 Agriculture... AND ORDERS; FRUITS, VEGETABLES, NUTS), DEPARTMENT OF AGRICULTURE OLIVES GROWN IN CALIFORNIA Order Regulating Handling Definitions § 932.9 Packaged olives. Packaged olives means (a) processed olives...

  5. 7 CFR 932.9 - Packaged olives.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 8 2010-01-01 2010-01-01 false Packaged olives. 932.9 Section 932.9 Agriculture... and Orders; Fruits, Vegetables, Nuts), DEPARTMENT OF AGRICULTURE OLIVES GROWN IN CALIFORNIA Order Regulating Handling Definitions § 932.9 Packaged olives. Packaged olives means (a) processed olives...

  6. 7 CFR 932.9 - Packaged olives.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 7 Agriculture 8 2012-01-01 2012-01-01 false Packaged olives. 932.9 Section 932.9 Agriculture... and Orders; Fruits, Vegetables, Nuts), DEPARTMENT OF AGRICULTURE OLIVES GROWN IN CALIFORNIA Order Regulating Handling Definitions § 932.9 Packaged olives. Packaged olives means (a) processed olives...

  7. 7 CFR 932.9 - Packaged olives.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 7 Agriculture 8 2014-01-01 2014-01-01 false Packaged olives. 932.9 Section 932.9 Agriculture... AND ORDERS; FRUITS, VEGETABLES, NUTS), DEPARTMENT OF AGRICULTURE OLIVES GROWN IN CALIFORNIA Order Regulating Handling Definitions § 932.9 Packaged olives. Packaged olives means (a) processed olives...

  8. 7 CFR 932.9 - Packaged olives.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 8 2011-01-01 2011-01-01 false Packaged olives. 932.9 Section 932.9 Agriculture... and Orders; Fruits, Vegetables, Nuts), DEPARTMENT OF AGRICULTURE OLIVES GROWN IN CALIFORNIA Order Regulating Handling Definitions § 932.9 Packaged olives. Packaged olives means (a) processed olives...

  9. 9 CFR 381.144 - Packaging materials.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... consistent with the Food and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7... 9 Animals and Animal Products 2 2011-01-01 2011-01-01 false Packaging materials. 381.144 Section... Packaging materials. (a) Edible products may not be packaged in a container which is composed in whole or...

  10. 9 CFR 381.144 - Packaging materials.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... consistent with the Food and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7... 9 Animals and Animal Products 2 2012-01-01 2012-01-01 false Packaging materials. 381.144 Section... Packaging materials. (a) Edible products may not be packaged in a container which is composed in whole or...

  11. 9 CFR 381.144 - Packaging materials.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... consistent with the Food and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7... 9 Animals and Animal Products 2 2014-01-01 2014-01-01 false Packaging materials. 381.144 Section... Packaging materials. (a) Edible products may not be packaged in a container which is composed in whole or...

  12. 7 CFR 58.640 - Packaging.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 3 2011-01-01 2011-01-01 false Packaging. 58.640 Section 58.640 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... Procedures § 58.640 Packaging. The packaging of the semifrozen product shall be done by means which will...

  13. 49 CFR 172.514 - Bulk packagings.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 2 2011-10-01 2011-10-01 false Bulk packagings. 172.514 Section 172.514... SECURITY PLANS Placarding § 172.514 Bulk packagings. (a) Except as provided in paragraph (c) of this section, each person who offers for transportation a bulk packaging which contains a hazardous...

  14. Chip Scale Package Implementation Challenges

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    1998-01-01

    The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. In the process of building the Consortium CSP test vehicles, many challenges were identified regarding various aspects of technology implementation. This paper will present our experience in the areas of technology implementation challenges, including design and building both standard and microvia boards, and assembly of two types of test vehicles. We also discuss the most current package isothermal aging to 2,000 hours at 100 C and 125 C and thermal cycling test results to 1,700 cycles in the range of -30 to 100 C.

  15. Microwave thawing package and method

    DOEpatents

    Fathi, Zakaryae; Lauf, Robert J.

    2004-03-16

    A package for containing frozen liquids during an electromagnetic thawing process includes: a first section adapted for containing a frozen material and exposing the frozen material to electromagnetic energy; a second section adapted for receiving thawed liquid material and shielding the thawed liquid material from further exposure to electromagnetic energy; and a fluid communication means for allowing fluid flow between the first section and the second section.

  16. Transportation and packaging resource guide

    SciTech Connect

    Arendt, J.W.; Gove, R.M.; Welch, M.J.

    1994-12-01

    The purpose of this resource guide is to provide a convenient reference document of information that may be useful to the U.S. Department of Energy (DOE) and DOE contractor personnel involved in packaging and transportation activities. An attempt has been made to present the terminology of DOE community usage as it currently exists. DOE`s mission is changing with emphasis on environmental cleanup. The terminology or nomenclature that has resulted from this expanded mission is included for the packaging and transportation user for reference purposes. Older terms still in use during the transition have been maintained. The Packaging and Transportation Resource Guide consists of four sections: Sect. 1, Introduction; Sect. 2, Abbreviations and Acronyms; Sect. 3, Definitions; and Sect. 4, References for packaging and transportation of hazardous materials and related activities, and Appendices A and B. Information has been collected from DOE Orders and DOE documents; U.S Department of Transportation (DOT), U.S. Environmental Protection Agency (EPA), and U.S. Nuclear Regulatory Commission (NRC) regulations; and International Atomic Energy Agency (IAEA) standards and other international documents. The definitions included in this guide may not always be a regulatory definition but are the more common DOE usage. In addition, the definitions vary among regulatory agencies. It is, therefore, suggested that if a definition is to be used in a regulatory or a legal compliance issue, the definition should be verified with the appropriate regulation. To assist in locating definitions in the regulations, a listing of all definition sections in the regulations are included in Appendix B. In many instances, the appropriate regulatory reference is indicated in the right-hand margin.

  17. Radioactive material package seal tests

    SciTech Connect

    Madsen, M.M.; Humphreys, D.L.; Edwards, K.R.

    1990-01-01

    General design or test performance requirements for radioactive materials (RAM) packages are specified in Title 10 of the US Code of Federal Regulations Part 71 (US Nuclear Regulatory Commission, 1983). The requirements for Type B packages provide a broad range of environments under which the system must contain the RAM without posing a threat to health or property. Seals that provide the containment system interface between the packaging body and the closure must function in both high- and low-temperature environments under dynamic and static conditions. A seal technology program, jointly funded by the US Department of Energy Office of Environmental Restoration and Waste Management (EM) and the Office of Civilian Radioactive Waste Management (OCRWM), was initiated at Sandia National Laboratories. Experiments were performed in this program to characterize the behavior of several static seal materials at low temperatures. Helium leak tests on face seals were used to compare the materials. Materials tested include butyl, neoprene, ethylene propylene, fluorosilicone, silicone, Eypel, Kalrez, Teflon, fluorocarbon, and Teflon/silicone composites. Because most elastomer O-ring applications are for hydraulic systems, manufacturer low-temperature ratings are based on methods that simulate this use. The seal materials tested in this program with a fixture similar to a RAM cask closure, with the exception of silicone S613-60, are not leak tight (1.0 {times} 10{sup {minus}7} std cm{sup 3}/s) at manufacturer low-temperature ratings. 8 refs., 3 figs., 1 tab.

  18. Auxiliary propulsion system flight package

    NASA Technical Reports Server (NTRS)

    Collett, C. R.

    1987-01-01

    Hughes Aircraft Company developed qualified and integrated flight, a flight test Ion Auxiliary Propulsion System (IAPS), on an Air Force technology satellite. The IAPS Flight Package consists of two identical Thruster Subsystems and a Diagnostic Subsystem. Each thruster subsystem (TSS) is comprised of an 8-cm ion Thruster-Gimbal-Beam Shield Unit (TGBSU); Power Electronics Unit; Digital Controller and Interface Unit (DCIU); and Propellant Tank, Valve and Feed Unit (PTVFU) plus the requisite cables. The Diagnostic Subsystem (DSS) includes four types of sensors for measuring the effect of the ion thrusters on the spacecraft and the surrounding plasma. Flight qualifications of IAPS, prior to installation on the spacecraft, consisted of performance, vibration and thermal-vacuum testing at the unit level, and thermal-vacuum testing at the subsystem level. Mutual compatibility between IAPS and the host spacecraft was demonstrated during a series of performance and environmental tests after the IAPS Flight Package was installed on the spacecraft. After a spacecraft acoustic test, performance of the ion thrusters was reverified by removing the TGBSUs for a thorough performance test at Hughes Research Laboratories (HRL). The TGBSUs were then reinstalled on the spacecraft. The IAPS Flight Package is ready for flight testing when Shuttle flights are resumed.

  19. Active packaging with antifungal activities.

    PubMed

    Nguyen Van Long, N; Joly, Catherine; Dantigny, Philippe

    2016-03-01

    There have been many reviews concerned with antimicrobial food packaging, and with the use of antifungal compounds, but none provided an exhaustive picture of the applications of active packaging to control fungal spoilage. Very recently, many studies have been done in these fields, therefore it is timely to review this topic. This article examines the effects of essential oils, preservatives, natural products, chemical fungicides, nanoparticles coated to different films, and chitosan in vitro on the growth of moulds, but also in vivo on the mould free shelf-life of bread, cheese, and fresh fruits and vegetables. A short section is also dedicated to yeasts. All the applications are described from a microbiological point of view, and these were sorted depending on the name of the species. Methods and results obtained are discussed. Essential oils and preservatives were ranked by increased efficacy on mould growth. For all the tested molecules, Penicillium species were shown more sensitive than Aspergillus species. However, comparison between the results was difficult because it appeared that the efficiency of active packaging depended greatly on the environmental factors of food such as water activity, pH, temperature, NaCl concentration, the nature, the size, and the mode of application of the films, in addition to the fact that the amount of released antifungal compounds was not constant with time.

  20. Waste Package Design Methodology Report

    SciTech Connect

    D.A. Brownson

    2001-09-28

    The objective of this report is to describe the analytical methods and processes used by the Waste Package Design Section to establish the integrity of the various waste package designs, the emplacement pallet, and the drip shield. The scope of this report shall be the methodology used in criticality, risk-informed, shielding, source term, structural, and thermal analyses. The basic features and appropriateness of the methods are illustrated, and the processes are defined whereby input values and assumptions flow through the application of those methods to obtain designs that ensure defense-in-depth as well as satisfy requirements on system performance. Such requirements include those imposed by federal regulation, from both the U.S. Department of Energy (DOE) and U.S. Nuclear Regulatory Commission (NRC), and those imposed by the Yucca Mountain Project to meet repository performance goals. The report is to be used, in part, to describe the waste package design methods and techniques to be used for producing input to the License Application Report.

  1. "Programmed packaging" for gene delivery.

    PubMed

    Hyodo, M; Sakurai, Y; Akita, H; Harashima, H

    2014-11-10

    We report on the development of a multifunctional envelope-type nano device (MEND) based on our packaging concept "Programmed packaging" to control not only intracellular trafficking but also the biodistribution of encapsulated compounds such as nucleic acids/proteins/peptides. Our strategy for achieving this is based on molecular mechanisms of cell biology such as endocytosis, vesicular trafficking, etc. In this review, we summarize the concept of programmed packaging and discuss some of our recent successful examples of using MENDs. Systematic evolution of ligands by exponential enrichment (SELEX) was applied as a new methodology for identifying a new ligand toward cell or mitochondria. The delivery of siRNA to tumors and the tumor vasculature was achieved using pH sensitive lipid (YSK05), which was newly designed and optimized under in vivo conditions. The efficient delivery of pDNA to immune cells such as dendritic cells has also been developed using the KALA ligand, which can be a breakthrough technology for DNA vaccine. Finally, ss-cleavable and pH-activated lipid-like surfactant (ssPalm) which is a lipid like material with pH-activatable and SS-cleavable properties is also introduced as a proof of our concept. PMID:24780263

  2. Active packaging with antifungal activities.

    PubMed

    Nguyen Van Long, N; Joly, Catherine; Dantigny, Philippe

    2016-03-01

    There have been many reviews concerned with antimicrobial food packaging, and with the use of antifungal compounds, but none provided an exhaustive picture of the applications of active packaging to control fungal spoilage. Very recently, many studies have been done in these fields, therefore it is timely to review this topic. This article examines the effects of essential oils, preservatives, natural products, chemical fungicides, nanoparticles coated to different films, and chitosan in vitro on the growth of moulds, but also in vivo on the mould free shelf-life of bread, cheese, and fresh fruits and vegetables. A short section is also dedicated to yeasts. All the applications are described from a microbiological point of view, and these were sorted depending on the name of the species. Methods and results obtained are discussed. Essential oils and preservatives were ranked by increased efficacy on mould growth. For all the tested molecules, Penicillium species were shown more sensitive than Aspergillus species. However, comparison between the results was difficult because it appeared that the efficiency of active packaging depended greatly on the environmental factors of food such as water activity, pH, temperature, NaCl concentration, the nature, the size, and the mode of application of the films, in addition to the fact that the amount of released antifungal compounds was not constant with time. PMID:26803804

  3. The Model 9977 Radioactive Material Packaging Primer

    SciTech Connect

    Abramczyk, G.

    2015-10-09

    The Model 9977 Packaging is a single containment drum style radioactive material (RAM) shipping container designed, tested and analyzed to meet the performance requirements of Title 10 the Code of Federal Regulations Part 71. A radioactive material shipping package, in combination with its contents, must perform three functions (please note that the performance criteria specified in the Code of Federal Regulations have alternate limits for normal operations and after accident conditions): Containment, the package must “contain” the radioactive material within it; Shielding, the packaging must limit its users and the public to radiation doses within specified limits; and Subcriticality, the package must maintain its radioactive material as subcritical

  4. RECLAMATION OF RADIOACTIVE MATERIAL PACKAGING COMPONENTS

    SciTech Connect

    Abramczyk, G.; Nathan, S.; Loftin, B.; Bellamy, S.

    2011-06-06

    Radioactive material packages are withdrawn from use for various reasons; loss of mission, decertification, damage, replacement, etc. While the packages themselves may be decertified, various components may still be able to perform to their required standards and find useful service. The Packaging Technology and Pressurized Systems group of the Savannah River National Laboratory has been reducing the cost of producing new Type B Packagings by reclaiming, refurbishing, and returning to service the containment vessels from older decertified packagings. The program and its benefits are presented.

  5. Challenges in the Packaging of MEMS

    SciTech Connect

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O'Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  6. UWV (Unmanned Water Vehicle) - Umbra Package v. 1.0

    SciTech Connect

    Fred Oppel, SNL 06134

    2012-09-13

    This package contains modules that model the mobility of systems moving in the water. This package currently models first order physics -basically a velocity integrator. This package depends on interface classes (typically base classes) that reside in the Mobility package.

  7. 49 CFR 178.915 - General Large Packaging standards.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... Large Packaging. (d) A Large Packaging consisting of packagings within a framework must be so constructed that the packaging is not damaged by the framework and is retained within the framework at...

  8. Combined effect of active coating and modified atmosphere packaging on prolonging the shelf life of low-moisture Mozzarella cheese.

    PubMed

    Mastromatteo, Marianna; Conte, Amalia; Faccia, Michele; Del Nobile, Matteo Alessandro; Zambrini, Angelo Vittorio

    2014-01-01

    In this work, the effect of active coating on the shelf life of low-moisture Mozzarella cheese packaged in air and modified atmosphere (MAP) was studied. The active coating was based on sodium alginate (2%, wt/vol) and potassium sorbate (1%, wt/vol). The MAP was made up of 75% CO₂ and 25% N₂ (MAP1), 25% CO₂ and 75% N₂ (MAP2), or 50% CO₂ and 50% N₂ (MAP3). The product quality decay was assessed by monitoring microbiological and sensory changes during storage at 4, 8, and 14°C. Results showed that the combination of active coating and MAP was able to improve the preservation of low-moisture Mozzarella cheese. Specifically, the shelf life increased up to 160 d for samples stored at 4°C, and 40 and 11 d for those at 8 and 14°C, respectively. A faster quality decay for untreated samples packaged in air was observed. In particular, the Pseudomonas spp. growth and the appearance of molds were responsible for product unacceptability. The combination of active coating and MAP represents a strategic solution to prolong the shelf life of low-moisture Mozzarella cheese and to ensure the safety of the product under thermal abuse conditions.

  9. Combined effect of active coating and modified atmosphere packaging on prolonging the shelf life of low-moisture Mozzarella cheese.

    PubMed

    Mastromatteo, Marianna; Conte, Amalia; Faccia, Michele; Del Nobile, Matteo Alessandro; Zambrini, Angelo Vittorio

    2014-01-01

    In this work, the effect of active coating on the shelf life of low-moisture Mozzarella cheese packaged in air and modified atmosphere (MAP) was studied. The active coating was based on sodium alginate (2%, wt/vol) and potassium sorbate (1%, wt/vol). The MAP was made up of 75% CO₂ and 25% N₂ (MAP1), 25% CO₂ and 75% N₂ (MAP2), or 50% CO₂ and 50% N₂ (MAP3). The product quality decay was assessed by monitoring microbiological and sensory changes during storage at 4, 8, and 14°C. Results showed that the combination of active coating and MAP was able to improve the preservation of low-moisture Mozzarella cheese. Specifically, the shelf life increased up to 160 d for samples stored at 4°C, and 40 and 11 d for those at 8 and 14°C, respectively. A faster quality decay for untreated samples packaged in air was observed. In particular, the Pseudomonas spp. growth and the appearance of molds were responsible for product unacceptability. The combination of active coating and MAP represents a strategic solution to prolong the shelf life of low-moisture Mozzarella cheese and to ensure the safety of the product under thermal abuse conditions. PMID:24239077

  10. Low-dielectric constant insulators for future integrated circuits and packages.

    PubMed

    Kohl, Paul A

    2011-01-01

    Future integrated circuits and packages will require extraordinary dielectric materials for interconnects to allow transistor advances to be translated into system-level advances. Exceedingly low-permittivity and low-loss materials are required at every level of the electronic system, from chip-level insulators to packages and printed wiring boards. In this review, the requirements and goals for future insulators are discussed followed by a summary of current state-of-the-art materials and technical approaches. Much work needs to be done for insulating materials and structures to meet future needs.

  11. Overview of the DOE packaging certification process

    SciTech Connect

    Liu, Y.Y.; Carlson, R.D.; Carlson, R.W.; Kapoor, A.

    1995-12-31

    This paper gives an overview of the DOE packaging certification process, which is implemented by the Office of Facility Safety Analysis, under the Assistance Secretary for Environment, Safety and Health, for packagings that are not used for weapons and weapons components, nor for naval nuclear propulsion. The overview will emphasize Type B packagings and the Safety Analysis Report for Packaging (SARP) review that parallels the NRC packaging review. Other important elements in the DOE packaging certification program, such as training, methods development, data bases, and technical assistance, are also emphasized, because they have contributed significantly to the improvement of the certification process since DOE consolidated its packaging certification function in 1985. The paper finishes with a discussion of the roles and functions of the DOE Packaging Safety Review Steering Committee, which is chartered to address issues and concerns of interest to the DOE packaging and transportation safety community. Two articles related to DOE packaging certification were published earlier on the SARP review procedures and the DOE Packaging Review Guide. These articles may be consulted for additional information.

  12. EXAMINATION OF SHIPPING PACKAGE 9975-05050

    SciTech Connect

    Daugherty, W.

    2014-11-06

    Shipping package 9975-05050 was examined in K-Area following its identification as a high wattage package. Elevated temperature and fiberboard moisture content are key parameters that impact the degradation rate of fiberboard within 9975 packages in a storage environment. The high wattage of this package contributes significantly to component temperatures. After examination in K-Area, the package was provided to SRNL for further examination of the fiberboard assembly. The moisture content of the fiberboard was relatively low (compared to packages examined previously), but the moisture gradient (between fiberboard ID and OD surfaces) was relatively high, as would be expected for the high heat load. The cane fiberboard appeared intact and displayed no apparent change in integrity relative to a new package.

  13. Replacement Energy Cost Analysis Package (RECAP): User`s guide. Revision 1

    SciTech Connect

    VanKuiken, J.C.; Willing, D.L.

    1994-07-01

    A microcomputer program called the Replacement Energy Cost Analysis Package (RECAP) has been developed to assist the US Nuclear Regulatory Commission (NRC) in determining the replacement energy costs associated with short-term shutdowns or deratings of one or more nuclear reactors. The calculations are based on the seasonal, unit-specific cost estimates for 1993--1996 previously published in NRC Report NUREG/CR--4012, Vol. 3 (1992), for all 112 US reactors. Because the RECAP program is menu-driven, the user can define specific case studies in terms of such parameters as the units to be included, the length and timing of the shutdown or derating period, the unit capacity factors, and the reference year for reporting cost results. In addition to simultaneous shutdown cases, more complicated situations, such as overlapping shutdown periods or shutdowns that occur in different years, can be examined through the use of a present-worth calculation option.

  14. 49 CFR 178.905 - Large Packaging identification codes.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 3 2011-10-01 2011-10-01 false Large Packaging identification codes. 178.905... PACKAGINGS Large Packagings Standards § 178.905 Large Packaging identification codes. Large packaging code... letter(s) specified in paragraph (b) of this section. (a) Large packaging code number designations are...

  15. 49 CFR 178.935 - Standards for wooden Large Packagings.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 3 2011-10-01 2011-10-01 false Standards for wooden Large Packagings. 178.935... PACKAGINGS Large Packagings Standards § 178.935 Standards for wooden Large Packagings. (a) The provisions in this section apply to wooden Large Packagings intended to contain solids. Wooden Large Packaging...

  16. PORTABLE ACOUSTIC MONITORING PACKAGE (PAMP)

    SciTech Connect

    John l. Loth; Gary J. Morris; George M. Palmer; Richard Guiler; Deepak Mehra

    2003-07-01

    The 1st generation acoustic monitoring package was designed to detect and analyze weak acoustic signals inside natural gas transmission lines. Besides a microphone it housed a three-inch diameter aerodynamic acoustic signal amplifier to maximize sensitivity to leak induced {Delta}p type signals. The theory and test results of this aerodynamic signal amplifier was described in the master's degree thesis of our Research Assistant Deepak Mehra who is about to graduate. To house such a large three-inch diameter sensor required the use of a steel 300-psi rated 4 inch weld neck flange, which itself weighed already 29 pounds. The completed 1st generation Acoustic Monitoring Package weighed almost 100 pounds. This was too cumbersome to mount in the field, on an access port at a pipeline shut-off valve. Therefore a 2nd generation and truly Portable Acoustic Monitor was built. It incorporated a fully self-contained {Delta}p type signal sensor, rated for line pressures up to 1000 psi with a base weight of only 6 pounds. This is the Rosemont Inc. Model 3051CD-Range 0, software driven sensor, which is believed to have industries best total performance. Its most sensitive unit was purchased with a {Delta}p range from 0 to 3 inch water. This resulted in the herein described 2nd generation: Portable Acoustic Monitoring Package (PAMP) for pipelines up to 1000 psi. Its 32-pound total weight includes an 18-volt battery. Together with a 3 pound laptop with its 4-channel data acquisition card, completes the equipment needed for field acoustic monitoring of natural gas transmission pipelines.

  17. MMIC Package for Millimeter Wave Frequency

    NASA Technical Reports Server (NTRS)

    Bharj, Sarjit Singh; Yuan, Steve

    1997-01-01

    Princeton Microwave Technology has successfully demonstrated the transfer of technology for the MMIC package. During this contract the package design was licensed from Hughes Aircraft Company for manufacture within the U.S. A major effort was directed towards characterization of the ceramic material for its dielectric constant and loss tangent properties. After selection of a ceramic tape, the high temperature co-fired ceramic package was manufactured in the U.S. by Microcircuit Packaging of America, Inc. Microwave measurements of the MMIC package were conducted by an intercontinental microwave test fixture. The package demonstrated a typical insertion loss of 0.5 dB per transition up to 32 Ghz and a return loss of better than 15 db. The performance of the package has been demonstrated from 2 to 30 Ghz by assembling three different MMIC amplifiers. Two of the MMIC amplifiers were designed for the 26 Ghz to 30 Ghz operation while the third MMIC was a distributed amplifier from 2 to 26.5 Ghz. The measured gain of the amplifier is consistent with the device data. The package costs are substantially lower than comparable packages available commercially. Typically the price difference is greater than a factor of three. The package cost is well under $5.00 for a quantity of 10,000 pieces.

  18. Challenges in the Packaging of MEMS

    SciTech Connect

    BROWN, WILLIAM D.; EATON, WILLIAM P.; MALSHE, AJAY P.; MILLER, WILLIAM M.; O'NEAL, CHAD; SINGH, SUSHILA B.

    1999-09-24

    Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of functional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and to expose these issues to new audiences from the integrated circuit packaging community.

  19. 78 FR 49061 - Valuation of Federal Coal for Advance Royalty Purposes and Information Collection Applicable to...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-08-12

    ... Applicable to All Solid Minerals Leases; Proposed Rule #0;#0;Federal Register / Vol. 78, No. 155 / Monday... Purposes and Information Collection Applicable to All Solid Minerals Leases AGENCY: Office of Natural... solid minerals leases and also are necessary to implement the EPAct Federal coal advance...

  20. Natural biopolimers in organic food packaging

    NASA Astrophysics Data System (ADS)

    Wieczynska, Justyna; Cavoski, Ivana; Chami, Ziad Al; Mondelli, Donato; Di Donato, Paola; Di Terlizzi, Biagio

    2014-05-01

    Concerns on environmental and waste problems caused by use of non-biodegradable and non-renewable based plastic packaging have caused an increase interest in developing biodegradable packaging using renewable natural biopolymers. Recently, different types of biopolymers like starch, cellulose, chitosan, casein, whey protein, collagen, egg white, soybean protein, corn zein, gelatin and wheat gluten have attracted considerable attention as potential food packaging materials. Recyclable or biodegradable packaging material in organic processing standards is preferable where possible but specific principles of packaging are not precisely defined and standards have to be assessed. There is evidence that consumers of organic products have specific expectations not only with respect to quality characteristics of processed food but also in social and environmental aspects of food production. Growing consumer sophistication is leading to a proliferation in food eco-label like carbon footprint. Biopolymers based packaging for organic products can help to create a green industry. Moreover, biopolymers can be appropriate materials for the development of an active surfaces designed to deliver incorporated natural antimicrobials into environment surrounding packaged food. Active packaging is an innovative mode of packaging in which the product and the environment interact to prolong shelf life or enhance safety or sensory properties, while maintaining the quality of the product. The work will discuss the various techniques that have been used for development of an active antimicrobial biodegradable packaging materials focusing on a recent findings in research studies. With the current focus on exploring a new generation of biopolymer-based food packaging materials with possible applications in organic food packaging. Keywords: organic food, active packaging, biopolymers , green technology

  1. PIV Data Validation Software Package

    NASA Technical Reports Server (NTRS)

    Blackshire, James L.

    1997-01-01

    A PIV data validation and post-processing software package was developed to provide semi-automated data validation and data reduction capabilities for Particle Image Velocimetry data sets. The software provides three primary capabilities including (1) removal of spurious vector data, (2) filtering, smoothing, and interpolating of PIV data, and (3) calculations of out-of-plane vorticity, ensemble statistics, and turbulence statistics information. The software runs on an IBM PC/AT host computer working either under Microsoft Windows 3.1 or Windows 95 operating systems.

  2. Block LancZos PACKage

    2005-05-01

    BLZPACK (for Block LancZos PACKage) is a standard Fortran 77 implementation of the block Lanczos algorithm intended for the solution of the standard eigenvalue problem Ax=ux or the generalized eigenvalue problem Ax=uBx, where A and B are real, sparse symmetric matrices, u and eigenvalue and x and eigenvector. The development of this eigensolver was motivated by the need to solve large, sparse, generalized problems from free vibration analyses in structural engineering. Several upgrades were performedmore » afterwards aiming at the solution of eigenvalues problems from a wider range of applications.« less

  3. Block LancZos PACKage

    SciTech Connect

    Marques, Osni

    2005-05-01

    BLZPACK (for Block LancZos PACKage) is a standard Fortran 77 implementation of the block Lanczos algorithm intended for the solution of the standard eigenvalue problem Ax=ux or the generalized eigenvalue problem Ax=uBx, where A and B are real, sparse symmetric matrices, u and eigenvalue and x and eigenvector. The development of this eigensolver was motivated by the need to solve large, sparse, generalized problems from free vibration analyses in structural engineering. Several upgrades were performed afterwards aiming at the solution of eigenvalues problems from a wider range of applications.

  4. Imagecube: an astropy affiliated package

    NASA Astrophysics Data System (ADS)

    Lianou, S.; Barmby, P.; Taylor, J.

    2013-09-01

    Astropy is a community python library for astronomy. Imagecube has been developed as an astropy affiliated package for processing multiwavelength (spectro)-imaging. This module automates tedious steps of image processing and analysis and delivers a science-ready image datacube. The included steps involve converting to common flux units, image registration to a common WCS, and convolution to a common resolution. Individual steps can be performed separately. We test the module using the dwarf galaxy NGC1569 by producing its observed spectral energy distribution on a pixel-by-pixel basis.

  5. Recoverable Plasma Diagnostics Package (RPDP)

    NASA Technical Reports Server (NTRS)

    Roberts, B.

    1986-01-01

    The recoverable plasma diagnostics package (RPDP) is an ejectable and recoverable satellite with flight and ground support systems so that it can be utilized in three modes: attached to an remote manipulator system; tethered; or as a subsatellite. The satellite is well instrumented with particle and field diagnostic as well as optical sensors to: investigate the dynamics of the natural environment or ejected perturbations from particle beams; measure the characteristics and propagation of electrostatic and electromagnetic waves; study wave particle interactions; and study natural properties of the magnetosphere, ionosphere, and upper atmosphere.

  6. Recoverable Plasma Diagnostics Package (RPDP)

    NASA Technical Reports Server (NTRS)

    Roberts, W. T.

    1985-01-01

    The recoverable plasma diagnostics package (RPDP) is an ejectable and recoverable satellite with flight and ground support systems so that it can be utilized in three modes: attached to an remote manipulator system; tethered; or as a subsatellite. The satellite is well instrumented with particle and field diagnostic as well as optical sensors to: investigate the dynamics of the natural environment or ejected perturbations from particle beams; measure the characteristics and propagation of electrostatic and electromagnetic waves; study wave particle interactions; and study natural properties of the magnetosphere, ionosphere, and upper atmosphere.

  7. The resuscitation package in sepsis.

    PubMed

    Demertzis, Lee M; Kollef, Marin H

    2010-09-01

    Sepsis and its attendant complications are commonly encountered in the intensive care unit. Early recognition of sepsis is critical because it allows for rapid deployment of a multifaceted resuscitation package. The cornerstones of sepsis management are antibiotic therapy, source control, and hemodynamic resuscitation. In select patients, ancillary therapies are indicated, such as activated protein C, corticosteroids, and glycemic control. Given the complexity of sepsis management, optimal care can be delivered as a bundle-a protocol encompassing the above interventions. The evidence behind the various components of sepsis management are reviewed here.

  8. Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices

    NASA Astrophysics Data System (ADS)

    Marinov, Val R.; Swenson, Orven; Atanasov, Yuriy; Schneck, Nathan

    2013-03-01

    Ultrathin flip-chip semiconductor die packaging on paper substrates is an enabling technology for a variety of extremely low-cost electronic devices with huge market potential such as RFID smart forms, smart labels, smart tickets, banknotes, security documents, etc. Highly flexible and imperceptible dice are possible only at a thickness of less than 50 μm, preferably down to 10-20 μm or less. Several cents per die cost is achievable only if the die size is <= 500 μm/side. Such ultrathin, ultra-small dice provide the flexibility and low cost required, but no conventional technology today can package such die onto a flexible substrate at low cost and high rate. The laser-enabled advanced packaging (LEAP) technology has been developed at the Center for Nanoscale Science and Engineering, North Dakota State University in Fargo, North Dakota, to accomplish this objective. Presented are results using LEAP to assemble dice with various thicknesses, including 350 μm/side dice as thin as 20 μm and less. To the best of our knowledge, this is the first report of using a laser to package conventional silicon dice with such small size and thickness. LEAP-packaged RFID-enabled paper for financial and security applications is also demonstrated. The cost of packaging using LEAP is lower compared to the conventional pick-and-place methods while the rate of packaging is much higher and independent of the die size.

  9. Clean Cities Now: Vol. 16, No. 1, May 2012 (Brochure)

    SciTech Connect

    Not Available

    2012-05-01

    Biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on advanced vehicle deployment, idle reduction, and articles on Clean Cities coalition successes across the country.

  10. Clean Cities Now: Vol. 16, No. 2, Fall 2012 (Brochure)

    SciTech Connect

    Not Available

    2012-09-01

    Biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on advanced vehicle deployment, idle reduction, and articles on Clean Cities coalition successes across the country.

  11. Clean Cities Now: Vol. 17, No. 1, Spring 2013 (Brochure)

    SciTech Connect

    Sutor, J.; Tucker, E.; Thomas, J.

    2013-05-01

    Biannual newsletter for the U.S. Department of Energy's Clean Cities initiative. The newsletter includes feature stories on advanced vehicle deployment, idle reduction, and articles on Clean Cities coalition successes across the country.

  12. Simulations of Embedded Electromagnetic Particle Velocity Gauge Package Response in Gas-Gun Experiments

    NASA Astrophysics Data System (ADS)

    Finn, K. L.; James, H. R.; Whitworth, N. J.; Handley, C. A.

    2009-12-01

    In recent years a comprehensive suite of gas-gun particle velocity gauge experiments have been conducted at Los Alamos National Laboratory. Detailed analysis of this data has led to advances in the understanding of the shock to detonation transition in polymer bonded explosives hydrocode simulations of the experiments are frequently used to calibrate reactive-burn models. In these simulations the gauges are modelled using Lagrangian markers with no physical representation of the gauge package. In contrast the experimental gauge package consists of etched aluminium sandwiched between two sheets of FEP Teflon using an urethane-based glue. The gauge package is approximately 60 μm thick is positioned between two wedge-shaped pieces of explosive at an angle of 30 degrees to form a right circular cylinder. This paper investigates with one-dimensional calculations whether there is a need to include an accurate representation of the gauge package within future hydrocode simulations.

  13. WASTE PACKAGE DESIGN SENSITIVITY REPORT

    SciTech Connect

    P. Mecharet

    2001-03-09

    The purpose of this technical report is to present the current designs for waste packages and determine which designs will be evaluated for the Site Recommendation (SR) or Licence Application (LA), to demonstrate how the design will be shown to comply with the applicable design criteria. The evaluations to support SR or LA are based on system description document criteria. The objective is to determine those system description document criteria for which compliance is to be demonstrated for SR; and, having identified the criteria, to refer to the documents that show compliance. In addition, those system description document criteria for which compliance will be addressed for LA are identified, with a distinction made between two steps of the LA process: the LA-Construction Authorization (LA-CA) phase on one hand, and the LA-Receive and Possess (LA-R&P) phase on the other hand. The scope of this work encompasses the Waste Package Project disciplines for criticality, shielding, structural, and thermal analysis.

  14. Packaging of electro-microfluidic devices

    DOEpatents

    Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

    2003-04-15

    A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

  15. Packaging of electro-microfluidic devices

    DOEpatents

    Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Watson, Robert D.

    2002-01-01

    A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

  16. Design considerations for automated packaging operations

    SciTech Connect

    Fahrenholtz, J.; Jones, J.; Kincy, M.

    1993-12-31

    The paper is based on work performed at Sandia National Laboratories to automate DOE packaging operations. It is a general summary of work from several projects which may be applicable to other packaging operations. Examples are provided of robotic operations which have been demonstrated as well as operations that are currently being developed. General design considerations for packages and for automated handling systems are described.

  17. High performance microsystem packaging: A perspective

    SciTech Connect

    Romig, A.D. Jr.; Dressendorfer, P.V.; Palmer, D.W.

    1997-10-01

    The second silicon revolution will be based on intelligent, integrated microsystems where multiple technologies (such as analog, digital, memory, sensor, micro-electro-mechanical, and communication devices) are integrated onto a single chip or within a multichip module. A necessary element for such systems is cost-effective, high-performance packaging. This paper examines many of the issues associated with the packaging of integrated microsystems, with an emphasis on the areas of packaging design, manufacturability, and reliability.

  18. NFR TRIGA package design review report

    SciTech Connect

    Clements, M.D.

    1994-08-26

    The purpose of this document is to compile, present and document the formal design review of the NRF TRIGA packaging. The contents of this document include: the briefing meeting presentations, package description, design calculations, package review drawings, meeting minutes, action item lists, review comment records, final resolutions, and released drawings. This design review required more than two meeting to resolve comments. Therefore, there are three meeting minutes and two action item lists.

  19. Polymer Composites for Intelligent Food Packaging

    NASA Astrophysics Data System (ADS)

    He, Jiating; Yap, Ray Chin Chong; Wong, Siew Yee; Li, Xu

    2015-09-01

    Over the last 50 years, remarkable improvements in mechanical and barrier properties of polymer composites have been realized. Their improved properties have been widely studied and employed for food packaging to keep food fresh, clean and suitable for consumption over sufficiently long storage period. In this paper, the current progress of science and technology development of polymer composites for intelligent food packaging will be highlighted. Future directions and perspectives for exploring polymer composites for intelligent food packaging to reveal freshness and quality of food packaged will also be put forward.

  20. Packaged optofluidic microbubble resonators for optical sensing.

    PubMed

    Tang, Ting; Wu, Xiang; Liu, Liying; Xu, Lei

    2016-01-10

    A microbubble resonator (MBR) coupled with a fiber taper is packaged with low-index polymer. The cladding polymer serves as a protective matrix for the coupling system to avoid environmental disturbance. The packaged structure is portable and provides good performance to maintain high Q factors for a long working period. The hollow structure of the MBR makes the packaged system useful for practical chemical and biomedical sensing applications. To evaluate the performance of the packaged MBRs-based sensor, we carry out bulk refractive index and surface-sensing measurements with achieved sensitivities of 18.8 nm/RIU and 31.29 pm/nm, respectively. PMID:26835777

  1. Yucca Mountain Waste Package Closure System

    SciTech Connect

    shelton-davis; Colleen Shelton-Davis; Greg Housley

    2005-10-01

    The current disposal path for high-level waste is to place the material into secure waste packages that are inserted into a repository. The Idaho National Laboratory has been tasked with the development, design, and demonstration of the waste package closure system for the repository project. The closure system design includes welding three lids and a purge port cap, four methods of nondestructive examination, and evacuation and backfill of the waste package, all performed in a remote environment. A demonstration of the closure system will be performed with a full-scale waste package.

  2. Yucca Mountain Waste Package Closure System

    SciTech Connect

    Herschel Smartt; Arthur Watkins; David Pace; Rodney Bitsoi; Eric Larsen; Timothy McJunkin; Charles Tolle

    2006-04-01

    The current disposal path for high-level waste is to place the material into secure waste packages that are inserted into a repository. The Idaho National Laboratory has been tasked with the development, design, and demonstration of the waste package closure system for the repository project. The closure system design includes welding three lids and a purge port cap, four methods of nondestructive examination, and evacuation and backfill of the waste package, all performed in a remote environment. A demonstration of the closure system will be performed with a full-scale waste package.

  3. Hermetic packaging for microwave modules. Final report

    SciTech Connect

    Hollar, D.L.

    1996-10-01

    Microwave assemblies, such as radar modules, require hermetically sealed packaging. Since most of these assemblies are used for airborne applications, the packages must be lightweight. The aluminum alloy A-40 provides the needed characteristics of these applications. This project developed packaging techniques using the A-40 alloy as a housing material and laser welding processes to install connectors, purge tube, and covers on the housings. The completed package successfully passed the hermetic leak requirements and environmental testing. Optimum laser welding parameters were established in addition to all of the related tooling for assembly.

  4. Microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2002-01-01

    An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a cofired ceramic frame or body. The package can have an internal stepped structure made of one or more plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination.

  5. Type B Packaging and Transportation Planning

    SciTech Connect

    Beebe, C. L.; Anderson, T. J.; Hintze, W. D.

    2003-02-27

    This paper describes the analyses performed to determine whether or not the eleven major Department of Energy sites had adequate planning and resources available to implement their shipping baselines. The study covers only Environmental Management off-site shipments using Type B and Type A-Fissile packaging. The time frame evaluated is from 2001-2010. The results indicate issues with respect to having certified packaging for planned shipments, the packaging inventory available to support schedules, and the material sufficiently characterized to enable package selection.

  6. Investigations into High Temperature Components and Packaging

    SciTech Connect

    Marlino, L.D.; Seiber, L.E.; Scudiere, M.B.; M.S. Chinthavali, M.S.; McCluskey, F.P.

    2007-12-31

    The purpose of this report is to document the work that was performed at the Oak Ridge National Laboratory (ORNL) in support of the development of high temperature power electronics and components with monies remaining from the Semikron High Temperature Inverter Project managed by the National Energy Technology Laboratory (NETL). High temperature electronic components are needed to allow inverters to operate in more extreme operating conditions as required in advanced traction drive applications. The trend to try to eliminate secondary cooling loops and utilize the internal combustion (IC) cooling system, which operates with approximately 105 C water/ethylene glycol coolant at the output of the radiator, is necessary to further reduce vehicle costs and weight. The activity documented in this report includes development and testing of high temperature components, activities in support of high temperature testing, an assessment of several component packaging methods, and how elevated operating temperatures would impact their reliability. This report is organized with testing of new high temperature capacitors in Section 2 and testing of new 150 C junction temperature trench insulated gate bipolar transistor (IGBTs) in Section 3. Section 4 addresses some operational OPAL-GT information, which was necessary for developing module level tests. Section 5 summarizes calibration of equipment needed for the high temperature testing. Section 6 details some additional work that was funded on silicon carbide (SiC) device testing for high temperature use, and Section 7 is the complete text of a report funded from this effort summarizing packaging methods and their reliability issues for use in high temperature power electronics. Components were tested to evaluate the performance characteristics of the component at different operating temperatures. The temperature of the component is determined by the ambient temperature (i.e., temperature surrounding the device) plus the

  7. PRIDE Surveillance Projects Data Packaging Project Information Package Specification Version 1.1

    SciTech Connect

    Kelleher, D. M.; Shipp, R. L.; Mason, J. D.

    2010-08-31

    Information Package Specification version 1.1 describes an XML document format called an information package that can be used to store information in information management systems and other information archives. An information package consists of package information, the context required to understand and use that information, package metadata that describes the information, and XML signatures that protect the information. The information package described in this specification was designed to store Department of Energy (DOE) and National Nuclear Security Administration (NNSA) information and includes the metadata required for that information: a unique package identifier, information marking that conforms to DOE and NNSA requirements, and access control metadata. It is an implementation of the Open Archival Information System (OAIS) Reference Model archival information package tailored to meet NNSA information storage requirements and designed to be used in the computing environments at the Y-12 National Security Complex and at other NNSA sites.

  8. 49 CFR 173.24a - Additional general requirements for non-bulk packagings and packages.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... likely to damage inner packagings or receptacles. (5) Vibration. Each non-bulk package must be capable of withstanding, without rupture or leakage, the vibration test procedure specified in § 178.608 of...

  9. Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

    NASA Technical Reports Server (NTRS)

    Dawe, R. H.; Arnett, J. C.

    1974-01-01

    Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.

  10. Packaging performance evaluation and performance oriented packaging standards for large packages for poison inhalation hazard materials

    SciTech Connect

    Griego, N.R.; Mills, G.S.; McClure, J.D.

    1997-07-01

    The U.S. Department of Transportation Research & Special Programs Administration (DOT-RSPA) has sponsored a project at Sandia National Laboratories to evaluate the protection provided by current packagings used for truck and rail transport of materials that have been classified as Poison Inhalation Hazards (PIH) and to recommend performance standards for these PIH packagings. Hazardous materials span a wide range of toxicity and there are many parameters used to characterize toxicity; for any given hazardous material, data are not available for all of the possible toxicity parameters. Therefore, it was necessary to select a toxicity criterion to characterize all of the PIH compounds (a value of the criterion was derived from other parameters in many cases) and to calculate their dispersion in the event of a release resulting from a transportation accident. Methodologies which account for material toxicity and dispersal characteristics were developed as a major portion of this project and applied to 72 PIH materials. This report presents details of the PIH material toxicity comparisons, calculation of their dispersion, and their classification into five severity categories. 16 refs., 5 figs., 7 tabs.

  11. Stationary table CT dosimetry and anomalous scanner-reported values of CTDI{sub vol}

    SciTech Connect

    Dixon, Robert L.; Boone, John M.

    2014-01-15

    Purpose: Anomalous, scanner-reported values of CTDI{sub vol} for stationary phantom/table protocols (having elevated values of CTDI{sub vol} over 300% higher than the actual dose to the phantom) have been observed; which are well-beyond the typical accuracy expected of CTDI{sub vol} as a phantom dose. Recognition of these outliers as “bad data” is important to users of CT dose index tracking systems (e.g., ACR DIR), and a method for recognition and correction is provided. Methods: Rigorous methods and equations are presented which describe the dose distributions for stationary-table CT. A comparison with formulae for scanner-reported values of CTDI{sub vol} clearly identifies the source of these anomalies. Results: For the stationary table, use of the CTDI{sub 100} formula (applicable to a moving phantom only) overestimates the dose due to extra scatter and also includes an overbeaming correction, both of which are nonexistent when the phantom (or patient) is held stationary. The reported DLP remains robust for the stationary phantom. Conclusions: The CTDI-paradigm does not apply in the case of a stationary phantom and simpler nonintegral equations suffice. A method of correction of the currently reported CTDI{sub vol} using the approach-to-equilibrium formula H(a) and an overbeaming correction factor serves to scale the reported CTDI{sub vol} values to more accurate levels for stationary-table CT, as well as serving as an indicator in the detection of “bad data.”.

  12. Belos Block Linear Solvers Package

    2004-03-01

    Belos is an extensible and interoperable framework for large-scale, iterative methods for solving systems of linear equations with multiple right-hand sides. The motivation for this framework is to provide a generic interface to a collection of algorithms for solving large-scale linear systems. Belos is interoperable because both the matrix and vectors are considered to be opaque objects--only knowledge of the matrix and vectors via elementary operations is necessary. An implementation of Balos is accomplished viamore » the use of interfaces. One of the goals of Belos is to allow the user flexibility in specifying the data representation for the matrix and vectors and so leverage any existing software investment. The algorithms that will be included in package are Krylov-based linear solvers, like Block GMRES (Generalized Minimal RESidual) and Block CG (Conjugate-Gradient).« less

  13. Antimicrobial seafood packaging: a review.

    PubMed

    Singh, Suman; Ho Lee, Myung; Park, Lnsik; Shin, Yangjai; Lee, Youn Suk

    2016-06-01

    Microorganisms are the major cause of spoilage in most seafood products; however, only few microbes, called the specific spoilage organisms (SSOs), contribute to the offensive off-flavors associated with seafood spoilage. In food, microbial degradation manifests itself as spoilage, or changes in the sensory properties of a food product, rendering it unsuitable for human consumption. The use of antimicrobial substances can control the general microflora as well as specific microorganisms related to spoilage to provide products with higher safety and better quality. Many antimicrobial compounds have been evaluated in film structures for use in seafood, especially organic acids and their salts, enzymes, bacteriocins; some studies have considered inorganic compounds such as AgSiO2, zinc oxide, silver zeolite, and titanium oxide. The characteristics of some organic antimicrobial packaging systems for seafood and their antimicrobial efficiency in film structures are reviewed in this article. PMID:27478206

  14. Recycled plastics for food packaging

    SciTech Connect

    Thorsheim, H.R.; Armstrong, D.J.

    1993-08-01

    There is a strong movement in this country to decrease the amount of waste produced and to use resources more efficiently. The Food and Drug Administration (FDA) is interested in helping to resolve the solid waste problem. The FDA supports recycling and the broader societal goal of diverting material from the solid waste stream, when it is consistent with the statutory responsibilities to protect the public health. The National Environmental Policy Act of 1969 (NEPA) mandates that the FDA review the impact of new food-packaging materials on the environment. Currently, no regulations have been issued for the use of recycled polymers in contact with food. Plastics are permeable, and the possibility that a contaminant such as a pesticide or motor oil might be absorbed by a plastic container and remain in the resin after recycling is very real. The paper discusses FDA policy and research to ensure that recycled plastics are safe for food-contact use.

  15. ISHAN: sequence homology analysis package.

    PubMed

    Shil, Pratip; Dudani, Niraj; Vidyasagar, Pandit B

    2006-01-01

    Sequence based homology studies play an important role in evolutionary tracing and classification of proteins. Various methods are available to analyze biological sequence information. However, with the advent of proteomics era, there is a growing demand for analysis of huge amount of biological sequence information, and it has become necessary to have programs that would provide speedy analysis. ISHAN has been developed as a homology analysis package, built on various sequence analysis tools viz FASTA, ALIGN, CLUSTALW, PHYLIP and CODONW (for DNA sequences). This JAVA application offers the user choice of analysis tools. For testing, ISHAN was applied to perform phylogenetic analysis for sets of Caspase 3 DNA sequences and NF-kappaB p105 amino acid sequences. By integrating several tools it has made analysis much faster and reduced manual intervention. PMID:17274766

  16. 49 CFR 173.24 - General requirements for packagings and packages.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... significant chemical or galvanic reaction between the materials and contents of the package. (3) Plastic... this part (“Procedure for Testing Chemical Compatibility and Rate of Permeation in Plastic Packagings... plastic packaging or receptacle used for Packing Group I materials. The maximum rate of permeation...

  17. 49 CFR 173.24 - General requirements for packagings and packages.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... significant chemical or galvanic reaction between the materials and contents of the package. (3) Plastic... this part (“Procedure for Testing Chemical Compatibility and Rate of Permeation in Plastic Packagings... plastic packaging or receptacle used for Packing Group I materials. The maximum rate of permeation...

  18. 49 CFR 173.24 - General requirements for packagings and packages.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... significant chemical or galvanic reaction between the materials and contents of the package. (3) Plastic... this part (“Procedure for Testing Chemical Compatibility and Rate of Permeation in Plastic Packagings... plastic packaging or receptacle used for Packing Group I materials. The maximum rate of permeation...

  19. 49 CFR 173.24 - General requirements for packagings and packages.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... significant chemical or galvanic reaction between the materials and contents of the package. (3) Plastic... this part (“Procedure for Testing Chemical Compatibility and Rate of Permeation in Plastic Packagings... plastic packaging or receptacle used for Packing Group I materials. The maximum rate of permeation...

  20. K Basin sludge packaging design criteria (PDC) and safety analysis report for packaging (SARP) approval plan

    SciTech Connect

    Brisbin, S.A.

    1996-03-06

    This document delineates the plan for preparation, review, and approval of the Packaging Design Crieteria for the K Basin Sludge Transportation System and the Associated on-site Safety Analysis Report for Packaging. The transportation system addressed in the subject documents will be used to transport sludge from the K Basins using bulk packaging.

  1. Modular optimization code package: MOZAIK

    NASA Astrophysics Data System (ADS)

    Bekar, Kursat B.

    This dissertation addresses the development of a modular optimization code package, MOZAIK, for geometric shape optimization problems in nuclear engineering applications. MOZAIK's first mission, determining the optimal shape of the D2O moderator tank for the current and new beam tube configurations for the Penn State Breazeale Reactor's (PSBR) beam port facility, is used to demonstrate its capabilities and test its performance. MOZAIK was designed as a modular optimization sequence including three primary independent modules: the initializer, the physics and the optimizer, each having a specific task. By using fixed interface blocks among the modules, the code attains its two most important characteristics: generic form and modularity. The benefit of this modular structure is that the contents of the modules can be switched depending on the requirements of accuracy, computational efficiency, or compatibility with the other modules. Oak Ridge National Laboratory's discrete ordinates transport code TORT was selected as the transport solver in the physics module of MOZAIK, and two different optimizers, Min-max and Genetic Algorithms (GA), were implemented in the optimizer module of the code package. A distributed memory parallelism was also applied to MOZAIK via MPI (Message Passing Interface) to execute the physics module concurrently on a number of processors for various states in the same search. Moreover, dynamic scheduling was enabled to enhance load balance among the processors while running MOZAIK's physics module thus improving the parallel speedup and efficiency. In this way, the total computation time consumed by the physics module is reduced by a factor close to M, where M is the number of processors. This capability also encourages the use of MOZAIK for shape optimization problems in nuclear applications because many traditional codes related to radiation transport do not have parallel execution capability. A set of computational models based on the

  2. AGC-2 Graphite Pre-irradiation Data Package

    SciTech Connect

    David Swank; Joseph Lord; David Rohrbaugh; William Windes

    2010-08-01

    The NGNP Graphite R&D program is currently establishing the safe operating envelope of graphite core components for a Very High Temperature Reactor (VHTR) design. The program is generating quantitative data necessary for predicting the behavior and operating performance of the new nuclear graphite grades. To determine the in-service behavior of the graphite for pebble bed and prismatic designs, the Advanced Graphite Creep (AGC) experiment is underway. This experiment is examining the properties and behavior of nuclear grade graphite over a large spectrum of temperatures, neutron fluences and compressive loads. Each experiment consists of over 400 graphite specimens that are characterized prior to irradiation and following irradiation. Six experiments are planned with the first, AGC-1, currently being irradiated in the Advanced Test Reactor (ATR) and pre-irradiation characterization of the second, AGC-2, completed. This data package establishes the readiness of 512 specimens for assembly into the AGC-2 capsule.

  3. Survivability of MEMS Packages at High-G Loads

    NASA Astrophysics Data System (ADS)

    Pryputniewicz, Ryszard J.

    2014-10-01

    Advances in emerging technology of microelectromechanical systems (MEMS) are one of the most challenging tasks in today's experimental mechanics. More specifically, development of these miniature devices requires sophisticated design, analysis, fabrication, testing, and characterization tools that have multiphysics and multiscale capabilities, especially as MEMS are being developed for use at harsh conditions. In harsh-environment and high-performance (e.g., military) guidance applications inertial sensors must be sensitive to low rates of rotation yet survive the high blast loads associated with the initial launch. In this multi-year study, a set of tuning fork gyroscopes were subjected to a series of increasing g-loads (culminating at approximately 60,000 g's) with measurements of shape made after each test. A custom set of test sample packages (aka articles) were hermetically sealed with glass lids to allow optical inspection of components while preserving the operating environment (i.e., vacuum). Initial test measurements were made upon fabrication of the articles. Optical and interferometric measurements have been made prior to and after each shock g-loading. The shape of the tuning fork gyroscope (TFG) test articles was measured using a phase shifting Michelson interferometer with compensation for package cover glass. Full field shape was determined and traces of pertinent structures were extracted for comparison. Failure of the die was observed in the form of fractures below the chip surface as well as fractures in the glass lid sealing the package. Potential causes of the failure are discussed as well as a recommendation for modified packaging techniques to mitigate future component failures.

  4. Machine learning: An artificial intelligence approach. Vol. II

    SciTech Connect

    Michalski, R.S.; Carbonell, J.G.; Mitchell, T.M.

    1986-01-01

    This book reflects the expansion of machine learning research through presentation of recent advances in the field. The book provides an account of current research directions. Major topics covered include the following: learning concepts and rules from examples; cognitive aspects of learning; learning by analogy; learning by observation and discovery; and an exploration of general aspects of learning.

  5. Clean Cities Now: Vol. 18, No. 1, Spring 2014 (Newsletter)

    SciTech Connect

    Not Available

    2014-04-01

    Spring 2014 edition of the biannual newsletter of the U.S. Department of Energy's Clean Cities program. Each issue contains program news, success stories, and information about tools and resources to assist in the deployment of alternative fuels, advanced vehicles, idle reduction, fuel efficiency improvements, and other measures to cut petroleum use in transportation.

  6. A Reader of Classical Urdu Poetry, Vol. Three.

    ERIC Educational Resources Information Center

    Barker, Muhammad Abd-Al-Rahman; And Others

    This is the third of three volumes intended to be used as pedagogical materials in advanced Urdu courses at Western colleges and universities. An optional set of tape recordings and an optional set of 35mm slides accompany the three-volume work. Volume III first includes an appendix describing the phonemic alphabet (with rough correspondences to…

  7. OIT Times--Spring 2002, Vol. 5, No. 2

    SciTech Connect

    Not Available

    2002-04-01

    The OIT Times Spring 2002 newsletter focuses on the new initiatives, services and tools of the Office of Industrial Technologies' Industries of the Future, Financial Assistance, States, and Enabling Technologies programs. The feature story reports on the findings of a National Coalition for Advanced Manufacturing study on how trade deficits affect the products and inputs of energy-intensive industries.

  8. Teaching Old Packaging New Tricks - 12593

    SciTech Connect

    England, Jeffery L.; Shuler, James M.

    2012-07-01

    Waste disposition campaigns have been an industry and government focus area since the mid- 1970's. With increased focus on this issue, and a lot of hard work, most waste packaging and transportation issues have been addressed. The material has been successfully shipped and dis-positioned. DOE has successfully de-inventoried materials from multiple sites to meet material consolidation, footprint reduction, nonproliferation, and regulatory obligations with cost savings from reduced maintenance and regulatory compliance. There has been a wide range of certified shipping packagings for the transportation of hazardous materials to meet most of the waste needs. The remaining materials are problematic, generally low volume, and do not meet the certified content of the existing inventory of packaging. Designing, testing and certifying new packaging designs can be a long and expensive process and for small volumes of material it is cost prohibitive. One very cost effective option is to lease and use a certified packaging to overpack waste containers. There are many robust certified packagings available with the capability to envelope the waste content. The capability to use inner containers, inside the current fleet of certified casks or packaging, to address specific content problems of additional shielding (e.g., U-233) or containment (e.g., sodium bonded nuclear material) has successfully expanded the capability for timely cost effective shipment of unique contents. This option has been used successfully in the NAC-LWT, T-3 and other packagings. (authors)

  9. Indicators of Effective Inservice: Instructional Packages.

    ERIC Educational Resources Information Center

    Basile, Joseph C., II; And Others

    Stressing that instructional behaviors, programs, and materials developed for inservice education must be systematic, stimulating, psychologically sound, and organized, this document provides a guide to the development of inservice instructional packages. It includes extensive criteria for evaluating inservice instructional packages under the…

  10. 7 CFR 29.30 - Package.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 2 2010-01-01 2010-01-01 false Package. 29.30 Section 29.30 Agriculture Regulations of the Department of Agriculture AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing... INSPECTION Regulations Definitions § 29.30 Package. A hogshead, tierce, case, bale, or other...

  11. 7 CFR 322.9 - Mailed packages.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ..., DEPARTMENT OF AGRICULTURE BEES, BEEKEEPING BYPRODUCTS, AND BEEKEEPING EQUIPMENT Importation of Adult Honeybees, Honeybee Germ Plasm, and Bees Other Than Honeybees From Approved Regions § 322.9 Mailed packages. (a) If you import a package of honeybees, honeybee germ plasm, or bees other than honeybees...

  12. 7 CFR 322.9 - Mailed packages.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ..., DEPARTMENT OF AGRICULTURE BEES, BEEKEEPING BYPRODUCTS, AND BEEKEEPING EQUIPMENT Importation of Adult Honeybees, Honeybee Germ Plasm, and Bees Other Than Honeybees From Approved Regions § 322.9 Mailed packages. (a) If you import a package of honeybees, honeybee germ plasm, or bees other than honeybees...

  13. 7 CFR 322.9 - Mailed packages.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ..., DEPARTMENT OF AGRICULTURE BEES, BEEKEEPING BYPRODUCTS, AND BEEKEEPING EQUIPMENT Importation of Adult Honeybees, Honeybee Germ Plasm, and Bees Other Than Honeybees From Approved Regions § 322.9 Mailed packages. (a) If you import a package of honeybees, honeybee germ plasm, or bees other than honeybees...

  14. Shock & Anaphylactic Shock. Learning Activity Package.

    ERIC Educational Resources Information Center

    Hime, Kirsten

    This learning activity package on shock and anaphylactic shock is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

  15. A Thermodynamics Course Package in Onenote

    ERIC Educational Resources Information Center

    Falconer, John L.; Nicodemus, Garret D.; Medlin, J. Will; deGrazia, Janet; McDanel, Katherine P.

    2014-01-01

    A ready-to-use package of active-learning materials for a semester-long chemical engineering thermodynamics course was prepared for instructors, and similar materials are being prepared for a material and energy balance course. The course package includes ConcepTests, explanations of the ConcepTests for instructors, links to screencasts, chapter…

  16. 49 CFR 130.21 - Packaging requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... ADMINISTRATION, DEPARTMENT OF TRANSPORTATION OIL TRANSPORTATION OIL SPILL PREVENTION AND RESPONSE PLANS § 130.21 Packaging requirements. Each packaging used for the transportation of oil subject to this part must be... transportation, there will be no release of oil to the environment....

  17. 49 CFR 130.21 - Packaging requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... ADMINISTRATION, DEPARTMENT OF TRANSPORTATION OIL TRANSPORTATION OIL SPILL PREVENTION AND RESPONSE PLANS § 130.21 Packaging requirements. Each packaging used for the transportation of oil subject to this part must be... transportation, there will be no release of oil to the environment....

  18. 49 CFR 130.21 - Packaging requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... ADMINISTRATION, DEPARTMENT OF TRANSPORTATION OIL TRANSPORTATION OIL SPILL PREVENTION AND RESPONSE PLANS § 130.21 Packaging requirements. Each packaging used for the transportation of oil subject to this part must be... transportation, there will be no release of oil to the environment....

  19. 49 CFR 130.21 - Packaging requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... ADMINISTRATION, DEPARTMENT OF TRANSPORTATION OIL TRANSPORTATION OIL SPILL PREVENTION AND RESPONSE PLANS § 130.21 Packaging requirements. Each packaging used for the transportation of oil subject to this part must be... transportation, there will be no release of oil to the environment....

  20. 49 CFR 130.21 - Packaging requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... ADMINISTRATION, DEPARTMENT OF TRANSPORTATION OIL TRANSPORTATION OIL SPILL PREVENTION AND RESPONSE PLANS § 130.21 Packaging requirements. Each packaging used for the transportation of oil subject to this part must be... transportation, there will be no release of oil to the environment....

  1. Comparison of TAPS Packages for Engineering

    ERIC Educational Resources Information Center

    Sidhu, S. Manjit

    2008-01-01

    Purpose: This paper aims to present the development of technology-assisted problem solving (TAPS) packages at University Tenaga Nasional (UNITEN). The project is the further work of the development of interactive multimedia based packages targeted for students having problems in understanding the subject of engineering mechanics dynamics.…

  2. Fiberboard humidity data for 9975 shipping packages

    SciTech Connect

    Daugherty, W. L.

    2015-07-31

    The 9975 surveillance program is identifying a technical basis to support extending the storage period of 9975 packages in KAC beyond the currently approved 15 years. A key element of this effort is developing a better understanding of degradation of the fiberboard assembly under storage conditions. This degradation is influenced greatly by the moisture content of the fiberboard, which is not well characterized on an individual package basis.Two efforts have been undertaken to better understand the levels and behavior of moisture within the fiberboard assemblies of the 9975 shipping package. In the first effort, an initial survey of humidity and temperature in the upper air space of 26 packages stored in KAC was made. The data collected within this first effort help to illustrate how the upper air space humidity varies with the local ambient temperature and package heat load. In the second effort, direct measurements of two test packages are providing a correlation between humidity and fiberboard moisture levels within the package, and variations in moisture throughout the fiberboard assembly. This effort has examined packages with cane fiberboard and internal heat levels of 5 and 10W to date. Additional testing is expected to include 15 and 19W heat levels, and then repeat the same four heat levels with softwood fiberboard assemblies. This report documents the data collected to date within these two efforts.

  3. Fiberboard Humidity Data for 9975 Shipping Packages

    SciTech Connect

    Daugherty, W.

    2015-07-31

    The 9975 surveillance program is identifying a technical basis to support extending the storage period of 9975 packages in KAC beyond the currently approved 15 years. A key element of this effort is developing a better understanding of degradation of the fiberboard assembly under storage conditions. This degradation is influenced greatly by the moisture content of the fiberboard, which is not well characterized on an individual package basis. Two efforts have been undertaken to better understand the levels and behavior of moisture within the fiberboard assemblies of the 9975 shipping package. In the first effort, an initial survey of humidity and temperature in the upper air space of 26 packages stored in KAC was made. The data collected within this first effort help to illustrate how the upper air space humidity varies with the local ambient temperature and package heat load. In the second effort, direct measurements of two test packages are providing a correlation between humidity and fiberboard moisture levels within the package, and variations in moisture throughout the fiberboard assembly. This effort has examined packages with cane fiberboard and internal heat levels of 5 and 10W to date. Additional testing is expected to include 15 and 19W heat levels, and then repeat the same four heat levels with softwood fiberboard assemblies. This report documents the data collected to date within these two efforts

  4. Temperature, Pulse, and Respiration. Learning Activity Package.

    ERIC Educational Resources Information Center

    Runge, Lillian

    This learning activity package on temperature, pulse, and respiration is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics…

  5. Cigarette package design: opportunities for disease prevention

    PubMed Central

    DiFranza, JR; Clark, DM; Pollay, RW

    2003-01-01

    Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers. PMID:19570250

  6. Cigarette package design: opportunities for disease prevention

    PubMed Central

    DiFranza, JR; Clark, DM; Pollay, RW

    2003-01-01

    Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

  7. The Surgical Scrub. Learning Activity Package.

    ERIC Educational Resources Information Center

    Runge, Lillian

    This learning activity package on the surgical scrub is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These…

  8. 21 CFR 820.130 - Device packaging.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 8 2011-04-01 2011-04-01 false Device packaging. 820.130 Section 820.130 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) MEDICAL DEVICES... shall ensure that device packaging and shipping containers are designed and constructed to protect...

  9. 7 CFR 322.9 - Mailed packages.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ..., DEPARTMENT OF AGRICULTURE BEES, BEEKEEPING BYPRODUCTS, AND BEEKEEPING EQUIPMENT Importation of Adult Honeybees, Honeybee Germ Plasm, and Bees Other Than Honeybees From Approved Regions § 322.9 Mailed packages. (a) If you import a package of honeybees, honeybee germ plasm, or bees other than honeybees...

  10. 7 CFR 322.9 - Mailed packages.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ..., DEPARTMENT OF AGRICULTURE BEES, BEEKEEPING BYPRODUCTS, AND BEEKEEPING EQUIPMENT Importation of Adult Honeybees, Honeybee Germ Plasm, and Bees Other Than Honeybees From Approved Regions § 322.9 Mailed packages. (a) If you import a package of honeybees, honeybee germ plasm, or bees other than honeybees...

  11. Developing a Package Training System for Industry

    ERIC Educational Resources Information Center

    Battersby, D. L. N.

    1974-01-01

    The hotel and catering industry is one of Great Britain's largest. A packaged training system has been developed to satisfy the needs of this industry, an ever-growing occupational field with multiple categories. The material provided in each package outlines short pieces of instruction and helps the trainer create appropriate training. (DS)

  12. "From Immigrant to Ethnic": A Curriculum Package.

    ERIC Educational Resources Information Center

    Murray, Katherine

    1977-01-01

    This article describes a curriculum package in ethnic studies designed for high school use by the Ethnic Heritage Studies Project, Rhode Island College. This multi-ethnic curriculum examines the experiences common to all immigrant groups which came to the United States. The package consists of three self-contained units: "The Immigrant…

  13. 39 CFR 3055.60 - Package Services.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 39 Postal Service 1 2011-07-01 2011-07-01 false Package Services. 3055.60 Section 3055.60 Postal Service POSTAL REGULATORY COMMISSION PERSONNEL SERVICE PERFORMANCE AND CUSTOMER SATISFACTION REPORTING Periodic Reporting of Service Performance Achievements § 3055.60 Package Services. (a) Single-Piece...

  14. 39 CFR 3055.23 - Package Services.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 39 Postal Service 1 2011-07-01 2011-07-01 false Package Services. 3055.23 Section 3055.23 Postal Service POSTAL REGULATORY COMMISSION PERSONNEL SERVICE PERFORMANCE AND CUSTOMER SATISFACTION REPORTING Annual Reporting of Service Performance Achievements § 3055.23 Package Services. For each product...

  15. Antimicrobial packaging for fresh-cut fruits

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Fresh-cut fruits are minimally processed produce which are consumed directly at their fresh stage without any further kill step. Microbiological quality and safety are major challenges to fresh-cut fruits. Antimicrobial packaging is one of the innovative food packaging systems that is able to kill o...

  16. 19 CFR 134.53 - Examination packages.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 19 Customs Duties 1 2010-04-01 2010-04-01 false Examination packages. 134.53 Section 134.53 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION, DEPARTMENT OF HOMELAND SECURITY; DEPARTMENT OF THE TREASURY COUNTRY OF ORIGIN MARKING Articles Found Not Legally Marked § 134.53 Examination packages....

  17. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... conditions. (a) Package size limitation. Due to the toxicity associated with fluoride active ingredients, the... accord with § 355.60. (b) Tight container packaging. To minimize moisture contamination, all fluoride... contents from contamination by extraneous liquids, solids, or vapors, from loss of the article, and...

  18. 9 CFR 317.24 - Packaging materials.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7.13) will be... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Packaging materials. 317.24 Section... INSPECTION AND CERTIFICATION LABELING, MARKING DEVICES, AND CONTAINERS General § 317.24 Packaging...

  19. Introduction to Software Packages. [Final Report.

    ERIC Educational Resources Information Center

    Frankel, Sheila, Ed.; And Others

    This document provides an introduction to applications computer software packages that support functional managers in government and encourages the use of such packages as an alternative to in-house development. A review of current application areas includes budget/project management, financial management/accounting, payroll, personnel,…

  20. PyTrilinos Rapid Prototyping Package

    2005-03-01

    PyTrilinos provides access to selected Trilinos packages from the python scripting language. This allows interactive and dynamic creation of Trilinos objects, rapid prototyping that does not require compilation, and "gluing" Trilinos scripts to other python modules, such as plotting, etc. The currently supported packages are Epetra, EpetraExt, and NOX.

  1. KLU2 Direct Linear Solver Package

    2012-01-04

    KLU2 is a direct sparse solver for solving unsymmetric linear systems. It is related to the existing KLU solver, (in Amesos package and also as a stand-alone package from University of Florida) but provides template support for scalar and ordinal types. It uses a left looking LU factorization method.

  2. Plastic-Sealed Hybrid Power Circuit Package

    NASA Technical Reports Server (NTRS)

    Miller, W. N.; Gray, O. E.

    1983-01-01

    Proposed design for hybrid high-voltage power-circuit package uses molded plastic for hermetic sealing instead of glass-to-metal seal. New package used to house high-voltage regulators and solid-state switches for applications in aircraft, electric automobiles, industrial equipment, satellites, solarcell arrays, and other equipment in extreme environments.

  3. 9 CFR 317.24 - Packaging materials.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7.13) will be... 9 Animals and Animal Products 2 2014-01-01 2014-01-01 false Packaging materials. 317.24 Section... INSPECTION AND CERTIFICATION LABELING, MARKING DEVICES, AND CONTAINERS General § 317.24 Packaging...

  4. 9 CFR 317.24 - Packaging materials.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7.13) will be... 9 Animals and Animal Products 2 2011-01-01 2011-01-01 false Packaging materials. 317.24 Section... INSPECTION AND CERTIFICATION LABELING, MARKING DEVICES, AND CONTAINERS General § 317.24 Packaging...

  5. 9 CFR 317.24 - Packaging materials.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... and Drug Administration's regulations regarding such guaranties (21 CFR 7.12 and 7.13) will be... 9 Animals and Animal Products 2 2012-01-01 2012-01-01 false Packaging materials. 317.24 Section... INSPECTION AND CERTIFICATION LABELING, MARKING DEVICES, AND CONTAINERS General § 317.24 Packaging...

  6. 19 CFR 191.13 - Packaging materials.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... material. The packaging material and the imported merchandise used in its manufacture or production must be... drawback provision under which the claim is made must be provided for the packaging material as well as the imported merchandise used in its manufacture or production, for purposes of determining the...

  7. Browndye: A Software Package for Brownian Dynamics

    PubMed Central

    McCammon, J. Andrew

    2010-01-01

    A new software package, Browndye, is presented for simulating the diffusional encounter of two large biological molecules. It can be used to estimate second-order rate constants and encounter probabilities, and to explore reaction trajectories. Browndye builds upon previous knowledge and algorithms from software packages such as UHBD, SDA, and Macrodox, while implementing algorithms that scale to larger systems. PMID:21132109

  8. Teachers' Guidelines for Evaluating Commercial Phonics Packages.

    ERIC Educational Resources Information Center

    Osborn, Jean; Stahl, Steven; Stein, Marcy

    The number of packages--kits, games, computer discs, audiotapes, and videotapes--offering phonics instruction is growing almost daily. These commercial packages are marketed to parents to use with their children or to teachers and school districts as supplements to classroom programs of reading instruction. This booklet outlines questions which…

  9. Packaging Your Educational Program. Draft Version.

    ERIC Educational Resources Information Center

    Rosenau, Fred S.; McIntyre, Diane H.

    This handbook for educators focuses on the packaging of validated educational products or processes as one part of the total diffusion process. Included are the planning, preparation, production, and putting together of all the parts of an effective program so that it will then be transportable to other sites: the package itself focuses…

  10. PRIDE Surveillance Projects Data Packaging Project, Information Package Specification Version 1.0

    SciTech Connect

    Kelleher, D.M.; Shipp, R. L.; Mason, J. D.

    2009-09-28

    This document contains a specification for a standard XML document format called an information package that can be used to store information and the context required to understand and use that information in information management systems and other types of information archives. An information package consists of packaged information, a set of information metadata that describes the packaged information, and an XML signature that protects the packaged information. The information package described in this specification was designed to be used to store Department of Energy (DOE) and National Nuclear Security Administration (NNSA) information and includes the metadata required for that information: a unique package identifier, information marking that conforms to DOE and NNSA requirements, and access control metadata. Information package metadata can also include information search terms, package history, and notes. Packaged information can be text content, binary content, and the contents of files and other containers. A single information package can contain multiple types of information. All content not in a text form compatible with XML must be in a text encoding such as base64. Package information is protected by a digital XML signature that can be used to determine whether the information has changed since it was signed and to identify the source of the information. This specification has been tested but has not been used to create production information packages. The authors expect that gaps and unclear requirements in this specification will be identified as this specification is used to create information packages and as information stored in information packages is used. The authors expect to issue revised versions of this specification as needed to address these issues.

  11. 49 CFR 178.910 - Marking of Large Packagings.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Marking of Large Packagings. 178.910 Section 178... PACKAGINGS Large Packagings Standards § 178.910 Marking of Large Packagings. (a) The manufacturer must: (1) Mark every Large Packaging in a durable and clearly visible manner. The marking may be applied in...

  12. 49 CFR 178.930 - Standards for fiberboard Large Packagings.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Standards for fiberboard Large Packagings. 178.930... FOR PACKAGINGS Large Packagings Standards § 178.930 Standards for fiberboard Large Packagings. (a) The provisions in this section apply to fiberboard Large Packagings intended to contain solids. Rigid...

  13. 49 CFR 178.920 - Standards for metal Large Packagings.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 49 Transportation 3 2014-10-01 2014-10-01 false Standards for metal Large Packagings. 178.920... PACKAGINGS Large Packagings Standards § 178.920 Standards for metal Large Packagings. (a) The provisions in this section apply to metal Large Packagings intended to contain liquids and solids. Metal...

  14. 49 CFR 178.920 - Standards for metal Large Packagings.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Standards for metal Large Packagings. 178.920... FOR PACKAGINGS Large Packagings Standards § 178.920 Standards for metal Large Packagings. (a) The provisions in this section apply to metal Large Packagings intended to contain liquids and solids....

  15. 49 CFR 178.920 - Standards for metal Large Packagings.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 49 Transportation 3 2013-10-01 2013-10-01 false Standards for metal Large Packagings. 178.920... PACKAGINGS Large Packagings Standards § 178.920 Standards for metal Large Packagings. (a) The provisions in this section apply to metal Large Packagings intended to contain liquids and solids. Metal...

  16. 49 CFR 178.920 - Standards for metal Large Packagings.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 49 Transportation 3 2012-10-01 2012-10-01 false Standards for metal Large Packagings. 178.920... PACKAGINGS Large Packagings Standards § 178.920 Standards for metal Large Packagings. (a) The provisions in this section apply to metal Large Packagings intended to contain liquids and solids. Metal...

  17. 49 CFR 178.920 - Standards for metal Large Packagings.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 3 2011-10-01 2011-10-01 false Standards for metal Large Packagings. 178.920... PACKAGINGS Large Packagings Standards § 178.920 Standards for metal Large Packagings. (a) The provisions in this section apply to metal Large Packagings intended to contain liquids and solids. Metal...

  18. 10 CFR 71.43 - General standards for all packages.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... packaging. (g) A package must be designed, constructed, and prepared for transport so that in still air at... 10 Energy 2 2010-01-01 2010-01-01 false General standards for all packages. 71.43 Section 71.43... Package Approval Standards § 71.43 General standards for all packages. (a) The smallest overall...

  19. 10 CFR 71.43 - General standards for all packages.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... packaging. (g) A package must be designed, constructed, and prepared for transport so that in still air at... 10 Energy 2 2011-01-01 2011-01-01 false General standards for all packages. 71.43 Section 71.43... Package Approval Standards § 71.43 General standards for all packages. (a) The smallest overall...

  20. IFT Scientific Status Summary 2008: Innovative Food Packaging Solutions

    Technology Transfer Automated Retrieval System (TEKTRAN)

    Food and beverage packaging comprises 55-65% of the $110 billion value of packaging in the United States. This review provides a summary of innovative technology developments in food packaging. The expanded role of food and beverage packaging is reviewed. Active and intelligent food packaging, ba...

  1. 49 CFR 173.61 - Mixed packaging requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 2 2011-10-01 2011-10-01 false Mixed packaging requirements. 173.61 Section 173... REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Definitions, Classification and Packaging for Class 1 § 173.61 Mixed packaging requirements. (a) An explosive may not be packed in the same outside packaging with any...

  2. 49 CFR 178.930 - Standards for fiberboard Large Packagings.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 3 2011-10-01 2011-10-01 false Standards for fiberboard Large Packagings. 178.930... PACKAGINGS Large Packagings Standards § 178.930 Standards for fiberboard Large Packagings. (a) The provisions in this section apply to fiberboard Large Packagings intended to contain solids. Rigid...

  3. Advanced uncooled sensor product development

    NASA Astrophysics Data System (ADS)

    Kennedy, A.; Masini, P.; Lamb, M.; Hamers, J.; Kocian, T.; Gordon, E.; Parrish, W.; Williams, R.; LeBeau, T.

    2015-06-01

    The partnership between RVS, Seek Thermal and Freescale Semiconductor continues on the path to bring the latest technology and innovation to both military and commercial customers. The partnership has matured the 17μm pixel for volume production on the Thermal Weapon Sight (TWS) program in efforts to bring advanced production capability to produce a low cost, high performance product. The partnership has developed the 12μm pixel and has demonstrated performance across a family of detector sizes ranging from formats as small as 206 x 156 to full high definition formats. Detector pixel sensitivities have been achieved using the RVS double level advanced pixel structure. Transition of the packaging of microbolometers from a traditional die level package to a wafer level package (WLP) in a high volume commercial environment is complete. Innovations in wafer fabrication techniques have been incorporated into this product line to assist in the high yield required for volume production. The WLP seal yield is currently > 95%. Simulated package vacuum lives >> 20 years have been demonstrated through accelerated life testing where the package has been shown to have no degradation after 2,500 hours at 150°C. Additionally the rugged assembly has shown no degradation after mechanical shock and vibration and thermal shock testing. The transition to production effort was successfully completed in 2014 and the WLP design has been integrated into multiple new production products including the TWS and the innovative Seek Thermal commercial product that interfaces directly to an iPhone or android device.

  4. A Compact, Modular Superconducting Bolometer Array Package

    NASA Technical Reports Server (NTRS)

    Benford, Dominic J.

    2008-01-01

    We have designed a detector package to house a superconducting bolometer array, SQUID multiplexers, bias and integration circuitry, optical filtering, electrical connectors, and thermal/mechanical interfaces. This package has been used successfully in the GISMO 2mm camera, a 128-pixel camera operating at a base temperature of 270mK. Operation at lower temperatures is allowed by providing direct heat sinking to the SQUIDS and bias resistors, which generate the bulk of the dissipation in the package. Standard electrical connectors provide reliable contact while enabling quick installation and removal of the package. Careful design has gone into the compensation for differing thermal expansions, the need for heat sinking of the bolometer array, and the placement of magnetic shielding in critical areas. In this presentation, we detail the design and performance of this detector package and describe its scalability to 1280- pixel arrays in the near future.

  5. Radiation treatment for sterilization of packaging materials

    NASA Astrophysics Data System (ADS)

    Haji-Saeid, Mohammad; Sampa, Maria Helena O.; Chmielewski, Andrzej G.

    2007-08-01

    Treatment with gamma and electron radiation is becoming a common process for the sterilization of packages, mostly made of natural or synthetic plastics, used in the aseptic processing of foods and pharmaceuticals. The effect of irradiation on these materials is crucial for packaging engineering to understand the effects of these new treatments. Packaging material may be irradiated either prior to or after filling. The irradiation prior to filling is usually chosen for dairy products, processed food, beverages, pharmaceutical, and medical device industries in the United States, Europe, and Canada. Radiation effects on packaging material properties still need further investigation. This paper summarizes the work done by different groups and discusses recent developments in regulations and testing procedures in the field of packaging technology.

  6. European packaging laws: Can it happen here?

    SciTech Connect

    Rogers, B.

    1996-06-01

    European packaging recycling and reduction efforts helped reshape recycling efforts and thinking. This article provides an update on what is happening with packaging recycling in Europe and how it affects the rest of the world, especially the US. World recycling markets were shaken by the enactment of the German Packaging Recycling ordinance of 1991. While the initial market shock waves may have subsided, the effects are still being felt. The ordinance has changed the way European countries think about packaging waste, and that way of thinking has spread, in various forms, around the world, affecting US manufacturers and causing US lawmakers to at least consider similar legislation here. The German Packaging Ordinance, its counterparts in other countries, and the European Union (EU) Directive have, themselves, been evolutionary as well as revolutionary--reacting and changing over the past five years. US reaction to the European laws has also evolved, moving from horror and annoyance to a reasoned analysis and evaluation.

  7. High-Performance Power-Semiconductor Packages

    NASA Technical Reports Server (NTRS)

    Renz, David; Hansen, Irving; Berman, Albert

    1989-01-01

    A 600-V, 50-A transistor and 1,200-V, 50-A diode in rugged, compact, lightweight packages intended for use in inverter-type power supplies having switching frequencies up to 20 kHz. Packages provide low-inductance connections, low loss, electrical isolation, and long-life hermetic seal. Low inductance achieved by making all electrical connections to each package on same plane. Also reduces high-frequency losses by reducing coupling into inherent shorted turns in packaging material around conductor axes. Stranded internal power conductors aid conduction at high frequencies, where skin effect predominates. Design of packages solves historical problem of separation of electrical interface from thermal interface of high-power semiconductor device.

  8. Dynamic modelling of packaging material flow systems.

    PubMed

    Tsiliyannis, Christos A

    2005-04-01

    A dynamic model has been developed for reused and recycled packaging material flows. It allows a rigorous description of the flows and stocks during the transition to new targets imposed by legislation, product demand variations or even by variations in consumer discard behaviour. Given the annual reuse and recycle frequency and packaging lifetime, the model determines all packaging flows (e.g., consumption and reuse) and variables through which environmental policy is formulated, such as recycling, waste and reuse rates and it identifies the minimum number of variables to be surveyed for complete packaging flow monitoring. Simulation of the transition to the new flow conditions is given for flows of packaging materials in Greece, based on 1995--1998 field inventory and statistical data. PMID:15864957

  9. Nonreturnable packaging: The environmental debate. (Latest citations from Packaging Science and Technology Abstracts database). Published Search

    SciTech Connect

    Not Available

    1993-05-01

    The bibliography contains citations concerning the environmental and economic impacts of nonreturnable versus returnable food packaging containers. Topics include the burdens on the environment due to nonreturnable beverage containers, economic considerations for the packaging industry, and government regulations imposed to reduce waste disposal. Various packaging containers are examined, including glass, aluminum, tin-plate, cardboard, and plastics. Government legislation in the soft drink and beverage industries, dairy packaged products, and paperboard packaging are discussed. (Contains a minimum of 199 citations and includes a subject term index and title list.)

  10. Where is MAP Going? A review and future potential of modified atmosphere packaging for meat.

    PubMed

    McMillin, Kenneth W

    2008-09-01

    Modified atmosphere packaging (MAP) is the removal and/or replacement of the atmosphere surrounding the product before sealing in vapor-barrier materials. While technically different, many forms of MAP are also case-ready packaging, where meat is cut and packaged at a centralized location for transport to and display at a retail store. Most of the shelf life properties of meat are extended by use of MAP, but anoxic forms of MAP without carbon monoxide (CO) do not provide bloomed red meat color and MAP with oxygen (O(2)) may promote oxidation of lipids and pigments. Advances in plastic materials and equipment have propelled advances in MAP, but other technological and logistical considerations are needed for successful MAP systems for raw chilled fresh meat. Current MAP options of air-permeable overwrapped trays in master packs, low O(2) formats of shrunk film vacuum packaging (VP) or MAP with carbon dioxide (CO(2)) and nitrogen (N(2)) and their peelable barrier film derivatives, and high O(2) MAP each have advantages and disadvantages. Packaging technology innovations and ingenuity will continue to provide MAP that is consumer oriented, product enhancing, environmentally responsive, and cost effective, but continued research and development by the scientific and industry sectors will be needed. PMID:22063169

  11. A Review of Soviet Studies in the Psychology of Learning and Teaching Mathematics (6 Volumes). Proceedings of the National Academy of Education, Vol. 4, 1977.

    ERIC Educational Resources Information Center

    van Bruggen, Johan C.; Freudenthal, Hans

    The English translations of the first six volumes of Studies on the Teaching and Learning of Mathematics in the Soviet Union are viewed in this document. The contents of each volume are briefly described: vol. 1, The Learning of Mathematical Concepts; vol. 2, The Structure of Mathematical Abilities; vol. 3, Problem Solving in Arithmetic and…

  12. Raytheon Advanced Miniature Cryocooler Characterization Testing

    NASA Astrophysics Data System (ADS)

    Conrad, T.; Yates, R.; Schaefer, B.; Bellis, L.; Pillar, M.; Barr, M.

    2015-12-01

    The Raytheon Advanced Miniature (RAM) cryocooler is a flight packaged, high frequency pulse tube cooler with an integrated surge volume and inertance tube. Its design has been fully optimized to make use of the Raytheon Advanced Regenerator, resulting in improved efficiency relative to previous Raytheon pulse tube coolers. In this paper, thermodynamic characterization data for the RAM cryocooler is presented along with details of its design specifications.

  13. Drug packaging in 2014: authorities should direct more efforts towards medication safety.

    PubMed

    2015-05-01

    In 2014, Prescrire examined the packaging quality of about 250 drugs. A few advances stand out, mainly involving recent drugs, but on the whole, the situation is worrisome in terms of medication safety. Although pharmaceutical companies and drug regulatory agencies seem to be taking more account of the risk of accidental poisoning in children, the level of protection remains low overall in the absence of stringent measures on the part of the authorities. New drugs too often have poor-quality or even dangerous packaging at the time of their market introduction. And the packaging quality of older drugs is disturbing. Pharmaceutical companies no longer invest in the packaging of these products, and agencies often fail to take advantage of the opportunities provided by their reassessment to improve the situation. The inappropriate labelling of certain injectable drugs remains a source of medication errors, sometimes resulting in very serious consequences. In 2014, signs of progress in the packaging of several drugs show that its role in medication safety is better appreciated. But the persistence of dangers in the pharmaceuticals market, created by "unfinished", overly complex or poor-quality packaging, raises the question of the responsibility of pharmaceutical companies and agencies for past and present accidents.

  14. Women, environmental management and sustainable development: multi-media training package.

    PubMed

    Bulajic, B

    1997-01-01

    The Women, Environmental Management and Sustainable Development training package is a major part of the International Research and Training Institute for the Advancement of Women¿s programs on women and sustainable development. This training package highlights an integrated approach in the organization and management of environmental policies and programs integrating the needs of women and their participation in planning, management, implementation and evaluation of environmental programs and projects. With 400 pages of text, 170 transparencies, trainer's guide, bibliography, and audiovisual support material, this package provides an overall presentation of existing problems, solutions, and policies. The training package is designed for 1) senior officials of Ministries of Environment, Natural Resources, Planning, Women's Affairs, Education, and Health; 2) development planners and provincial or local authorities in charge of environmental programs and projects; 3) engineers in charge of designing technologies for environmental projects; 4) university professors, trainers and managers of national training institutes and educational institutions, training staff on women, environmental management and sustainable development; and 5) representatives of nongovernmental organizations involved in environmental projects. The five modular units of the training package include: Introduction--Agenda 21; Module 1--Women and Environmental Health; Module 2--Women as Agents of Change in the Developmental Sector; Module 3--Women as Managers of the Environment; Module 4--Women, Environmental Indicators and Capacity Building Programs. The training package has undergone evaluation for content accuracy comprehensiveness, sequence and relationship of ideas within context, technical quality and media compatibility.

  15. Compostability of bioplastic packaging materials: an overview.

    PubMed

    Kale, Gaurav; Kijchavengkul, Thitisilp; Auras, Rafael; Rubino, Maria; Selke, Susan E; Singh, Sher Paul

    2007-03-01

    Packaging waste accounted for 78.81 million tons or 31.6% of the total municipal solid waste (MSW) in 2003 in the USA, 56.3 million tons or 25% of the MSW in 2005 in Europe, and 3.3 million tons or 10% of the MSW in 2004 in Australia. Currently, in the USA the dominant method of packaging waste disposal is landfill, followed by recycling, incineration, and composting. Since landfill occupies valuable space and results in the generation of greenhouse gases and contaminants, recovery methods such as reuse, recycling and/or composting are encouraged as a way of reducing packaging waste disposal. Most of the common materials used in packaging (i.e., steel, aluminum, glass, paper, paperboard, plastics, and wood) can be efficiently recovered by recycling; however, if packaging materials are soiled with foods or other biological substances, physical recycling of these materials may be impractical. Therefore, composting some of these packaging materials is a promising way to reduce MSW. As biopolymers are developed and increasingly used in applications such as food, pharmaceutical, and consumer goods packaging, composting could become one of the prevailing methods for disposal of packaging waste provided that industry, governments, and consumers encourage and embrace this alternative. The main objective of this article is to provide an overview of the current situation of packaging compostability, to describe the main mechanisms that make a biopolymer compostable, to delineate the main methods to compost these biomaterials, and to explain the main standards for assessing compostability, and the current status of biopolymer labeling. Biopolymers such as polylactide and poly(hydroxybutyrate) are increasingly becoming available for use in food, medical, and consumer goods packaging applications. The main claims of these new biomaterials are that they are obtained from renewable resources and that they can be biodegraded in biological environments such as soil and compost

  16. Compostability of bioplastic packaging materials: an overview.

    PubMed

    Kale, Gaurav; Kijchavengkul, Thitisilp; Auras, Rafael; Rubino, Maria; Selke, Susan E; Singh, Sher Paul

    2007-03-01

    Packaging waste accounted for 78.81 million tons or 31.6% of the total municipal solid waste (MSW) in 2003 in the USA, 56.3 million tons or 25% of the MSW in 2005 in Europe, and 3.3 million tons or 10% of the MSW in 2004 in Australia. Currently, in the USA the dominant method of packaging waste disposal is landfill, followed by recycling, incineration, and composting. Since landfill occupies valuable space and results in the generation of greenhouse gases and contaminants, recovery methods such as reuse, recycling and/or composting are encouraged as a way of reducing packaging waste disposal. Most of the common materials used in packaging (i.e., steel, aluminum, glass, paper, paperboard, plastics, and wood) can be efficiently recovered by recycling; however, if packaging materials are soiled with foods or other biological substances, physical recycling of these materials may be impractical. Therefore, composting some of these packaging materials is a promising way to reduce MSW. As biopolymers are developed and increasingly used in applications such as food, pharmaceutical, and consumer goods packaging, composting could become one of the prevailing methods for disposal of packaging waste provided that industry, governments, and consumers encourage and embrace this alternative. The main objective of this article is to provide an overview of the current situation of packaging compostability, to describe the main mechanisms that make a biopolymer compostable, to delineate the main methods to compost these biomaterials, and to explain the main standards for assessing compostability, and the current status of biopolymer labeling. Biopolymers such as polylactide and poly(hydroxybutyrate) are increasingly becoming available for use in food, medical, and consumer goods packaging applications. The main claims of these new biomaterials are that they are obtained from renewable resources and that they can be biodegraded in biological environments such as soil and compost

  17. Recertification and stress classification issues. PVP-Vol. 277

    SciTech Connect

    Petrinec, J.N. Jr.; Garic, G.; Jones, D.P.; Becht, C. IV

    1994-01-01

    A primary objective of the Design and Analysis Committee of the ASME Pressure Vessels and Piping Division is to disseminate information and advance current theories and practices in design and analysis of pressure vessels and components. This volume includes the following topics: (1) maintenance issues in aerospace ground support systems; (2) space flight pressure vessel issues; (3) stress classification for code primary stress limits; and (4) inelastic and severe accident analysis. Separate abstracts were prepared for 13 papers in this volume.

  18. Reviews of environmental contamination and toxicology. Vol. 98

    SciTech Connect

    Ware, G.W.

    1987-01-01

    This text contains timely review articles concerned with all aspects of chemical contaminants (including pesticides) in the total environment, including toxicological considerations and consequences. It attempts to provide concise, critical reviews of advances, philosophy, and significant areas of accomplished or needed endeavor in the total field of residues of these and other foreign chemicals in any segment of the environment, as well as toxicological implications.

  19. 1995 Edward Teller Lecture Patience and Optimism (LIRPP Vol. 12)

    NASA Astrophysics Data System (ADS)

    Miley, George H.

    2016-10-01

    Remarks made in the author's acceptance lecture for the 1995 Edward Teller Medal are presented and expanded. Topics covered include research on nuclear-pumped lasers, the first direct e-beam-pumped laser, direct energy conversion and advanced fuel fusion, plus recent work on inertial electrostatic confinement. "Patience" and "optimism" are viewed as essential elements needed by scientists following the "zig-zag" path to fusion energy production.

  20. Working with Design: A Package for Sheet Metal

    ERIC Educational Resources Information Center

    Fiebich, Paul D.

    1974-01-01

    The author describes a design approach used to study sheet metal layout in junior high and high school mechanical drafting courses. Students observe packaging in stores, study package construction, and design and produce their own packages. (EA)