Enhancing the ag precipitation by surface mechanical attrition treatment on Cu-Ag alloys

NASA Astrophysics Data System (ADS)

Liu, Jiabin; Zhang, Lehao; Liu, Jingjing; Huang, Liuyi; Gu, Hao; Fang, Youtong; Meng, Liang; Zhang, Jian

2016-09-01

The influence of surface mechanical attrition treatment (SMAT) on Ag precipitation in Cu-Ag alloys was investigated. Cu-6 wt% Ag was melt, cold rolled and solution treated to be Cu-Ag solid solution, which was either aged at 250 and 350 °C for 24 h directly or SMAT-ed before aging. Ag precipitates were hard be found in the directly aged Cu-Ag sample while they were observed clearly in the SMAT-ed counterpart at 250 °C. The Ag precipitates formed in the surface layer by SMAT are much coarser than those in the un-SMAT-ed sample. It is obvious that the precipitating behavior of Ag was promoted significantly by SMAT approach. A large number of defects were generated by SMAT and they were acting as fast atomic diffusion channels that facilitated the atomic diffusion of Ag.

Nano-Nucleation Characteristic of Cu-Ag Alloy Directly Electrodeposited on W Diffusion Barrier for Microelectronic Device Interconnect.

PubMed

Kim, Kang O; Kim, Sunjung

2016-05-01

Cu-Ag alloy interconnect is promising for ultra-large-scale integration (ULSI) microelectronic system of which device dimension keeps shrinking. In this study, seedless electrodeposition of Cu-Ag alloy directly on W diffusion barrier as interconnect technology is presented in respect of nano-nucleation control. Chemical equilibrium state of electrolyte was fundamentally investigated according to the pH of electrolyte because direct nano-nucleation of Cu-Ag alloy on W surface is challenging. Chelation behavior of Cu2+ and Ag+ ions with citrate (Cit) and ammonia ligands was dependent on the pH of electrolyte. The amount and kind of Cu- and Ag-based complexes determine the deposition rate, size, elemental composition, and surface morphology of Cu-Ag alloy nano-nuclei formed on W surface.

Microstructure and Mechanical Properties of C/C Composite/TC17 Joints with Ag-Cu-Ti Brazing Alloy

NASA Astrophysics Data System (ADS)

Cao, Xiujie; Zhu, Ying; Guo, Wei; Peng, Peng; Ma, Kaituo

2017-12-01

Carbon/Carbon composite(C/C) was vacuum brazed to titanium alloy (TC17) using Ag-Cu-Ti brazing alloy. The effects of brazing temperature on the interfacial microstructure and joint properties were investigated by energy dispersive spectrometer (EDS), a scanning electron microscope (SEM), X-ray diffraction (XRD) and Gleeble1500D testing machine. Results show that C/C composite and TC17 were successfully brazed using AgCuTi brazing alloy. Various phases including TiC, Ag(s, s), Cu(s, s), Ti3Cu4, TiCu, and Ti2Cu were formed in the brazed joint. The maximum shear strength of the brazed joints with AgCuTi brazing alloy was 24±1 MPa when brazed at 860°C for 15 min.

Brazing characteristics of a Zr-Ti-Cu-Fe eutectic alloy filler metal for Zircaloy-4

NASA Astrophysics Data System (ADS)

Lee, Jung G.; Lim, C. H.; Kim, K. H.; Park, S. S.; Lee, M. K.; Rhee, C. K.

2013-10-01

A Zr-Ti-Cu-Fe quaternary eutectic alloy was employed as a new Be-free brazing filler metal for Zircaloy-4 to supersede physically vapor-deposited Be coatings used conventionally with several disadvantages. The quaternary eutectic composition of Zr58Ti16Cu10Fe16 (at.%) showing a low melting temperature range from 832 °C to 853 °C was designed by a partial substitution of Zr with Ti based on a Zr-Cu-Fe ternary eutectic system. By applying an alloy ribbon with the determined composition, a highly reliable joint was obtained with a homogeneous formation of predominantly grown α-Zr phases owing to a complete isothermal solidification, exhibiting strength higher than that of Zircaloy-4. The homogenization of the joint was rate-controlled by the diffusion of the filler elements (Ti, Cu, and Fe) into the Zircaloy-4 base metal, and the detrimental segregation of the Zr2Fe phase in the central zone was completely eliminated by an isothermal holding at a brazing temperature of 920 °C for 10 min.

The dissimilar brazing of Kovar alloy to SiCp/Al composites using silver-based filler metal foil

NASA Astrophysics Data System (ADS)

Wang, Peng; Xu, Dongxia; Zhai, Yahong; Niu, Jitai

2017-09-01

Aluminum metal matrix composites with high SiC content (60 vol.% SiCp/Al MMCs) were surface metallized with a Ni-P alloy coating, and vacuum brazing between the composites and Kovar alloy were performed using rapidly cooled Ag-22.0Cu-15.9In-10.86Sn-1.84Ti (wt%) foil. The effects of Ni-P alloy coating and brazing parameters on the joint microstructures and properties were researched by SEM, EDS, and single lap shear test, respectively. Results show that Ag-Al intermetallic strips were formed in the 6063Al matrix and filler metal layer because of diffusion, and they were arranged regularly and accumulated gradually as the brazing temperature was increased ( T/°C = 550-600) or the soaking time was prolonged ( t/min = 10-50). However, excessive strips would destroy the uniformity of seams and lead to a reduced bonding strength (at most 70 MPa). Using a Ni-P alloy coating, void free joints without those strips were obtained at 560 °C after 20 min soaking time, and a higher shear strength of 90 MPa was achieved. The appropriate interface reaction ( 2 μm transition layer) that occurred along the Ni-P alloy coating/filler metal/Kovar alloy interfaces resulted in better metallurgical bonding. In this research, the developed Ag-based filler metal was suitable for brazing the dissimilar materials of Ni-P alloy-coated SiCp/Al MMCs and Kovar alloy, and capable welding parameters were also broadened.

Evaluation of the amalgamation reaction of experimental Ag-Sn-Cu alloys containing Pd using a mercury plating technique.

PubMed

Koike, Marie; Ferracane, Jack L; Fujii, Hiroyuki; Okabe, Toru

2003-09-01

A mercury plating technique was used to determine the phases forming on experimental Ag-Sn-Cu alloy powders (with and without Pd) exposed to electrolytically deposited mercury. Four series of alloy powders were made: a) 1.5% Pd with 10-14% Cu (CU series); b) 1.0% Pd with 10-14% Cu (1PD series); c) 1.5% Pd with different ratios of Ag3Sn (gamma) to Ag4Sn (beta) with 12% Cu (AGSN series); and d) 9-13% Cu with no Pd (NOPD series). Each powder was pressed on a freshly prepared amalgam specimen made from the same powder and metallographically polished until cross sections appeared; mercury was electroplated on the alloy particles. Alloy powders, amalgams and electroplated specimens were examined using XRD and SEM/EDS. XRD confirmed the presence of gamma2 in amalgams made from alloys with Cu < 13% or with Ag3Sn/Ag4Sn > 0.8. Specimens with moderately plated Hg showed gamma1 (Ag2Hg3) polyhedra and eta' Cu6Sn5, but not gamma2. This method effectively identifies alloys prone to forming gamma2.

Microstructural Evolution and Tensile Properties of SnAgCu Mixed with Sn-Pb Solder Alloys (Preprint)

DTIC Science & Technology

2009-03-01

AFRL-RX-WP-TP-2009-4132 MICROSTRUCTURAL EVOLUTION AND TENSILE PROPERTIES OF SnAgCu MIXED WITH Sn-Pb SOLDER ALLOYS (PREPRINT...PROPERTIES OF SnAgCu MIXED WITH Sn-Pb SOLDER ALLOYS (PREPRINT) 5a. CONTRACT NUMBER FA8650-04-C-5704 5b. GRANT NUMBER 5c. PROGRAM ELEMENT...ANSI Std. Z39-18 Microstructural evolution and tensile properties of SnAgCu mixed with Sn-Pb solder alloys Fengjiang Wang,1 Matthew O’Keefe,1,2 and

Microstructure and Mechanical Properties of Stainless Steel/Brass Joints Brazed by Sn-Electroplated Ag Brazing Filler Metals

NASA Astrophysics Data System (ADS)

Wang, Xingxing; Peng, Jin; Cui, Datian

2018-05-01

To develop a high-Sn-content AgCuZnSn brazing filler metal, the BAg50CuZn was used as the base filler metal and a Sn layer was electroplated upon it. Then, the 304 stainless steel and the H62 brass were induction-brazed with the Sn-plated brazing filler metals. The microstructures of the joints were examined with an optical microscope, a scanning electron microscope and an x-ray diffractometer. The corresponding mechanical properties were obtained with a universal tensile testing machine. The results indicated that the induction brazed joints consisted of the Ag phase, the Cu phase and the CuZn phase. When the content of Sn in the Sn-plated Ag brazing filler metal was 6.0 or 7.2 wt.%, the Cu5Zn8, the Cu41Sn11 and the Ag3Sn phases appeared in the brazed joint. The tensile strength of the joints brazed with the Sn-plated filler metal was higher compared to the joints with the base filler metal. When the content of Sn was 6.0 wt.%, the highest tensile strength of the joint reached to 395 MPa. The joint fractures presented a brittle mode, mixed with a low amount of ductile fracture, when the content of Sn exceeded 6.0 wt.%.

A dislocation density based micromechanical constitutive model for Sn-Ag-Cu solder alloys

NASA Astrophysics Data System (ADS)

Liu, Lu; Yao, Yao; Zeng, Tao; Keer, Leon M.

2017-10-01

Based on the dislocation density hardening law, a micromechanical model considering the effects of precipitates is developed for Sn-Ag-Cu solder alloys. According to the microstructure of the Sn-3.0Ag-0.5Cu thin films, intermetallic compounds (IMCs) are assumed as sphere particles embedded in the polycrystalline β-Sn matrix. The mechanical behavior of polycrystalline β-Sn matrix is determined by the elastic-plastic self-consistent method. The existence of IMCs not only impedes the motion of dislocations but also increases the overall stiffness. Thus, a dislocation density based hardening law considering non-shearable precipitates is adopted locally for single β-Sn crystal, and the Mori-Tanaka scheme is applied to describe the overall viscoplastic behavior of solder alloys. The proposed model is incorporated into finite element analysis and the corresponding numerical implementation method is presented. The model can describe the mechanical behavior of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu alloys under high strain rates at a wide range of temperatures. Furthermore, the overall Young’s modulus changes due to different contents of IMCs is predicted and compared with experimental data. Results show that the proposed model can describe both elastic and inelastic behavior of solder alloys with reasonable accuracy.

Reassessment of Atomic Mobilities in fcc Cu-Ag-Sn System Aiming at Establishment of an Atomic Mobility Database in Sn-Ag-Cu-In-Sb-Bi-Pb Solder Alloys

NASA Astrophysics Data System (ADS)

Xu, Huixia; Zhang, Lijun; Cheng, Kaiming; Chen, Weimin; Du, Yong

2017-04-01

To establish an accurate atomic mobility database in solder alloys, a reassessment of atomic mobilities in the fcc (face centered cubic) Cu-Ag-Sn system was performed as reported in the present work. The work entailed initial preparation of three fcc Cu-Sn diffusion couples, which were used to determine the composition-dependent interdiffusivities at 873 K, 923 K, and 973 K, to validate the literature data and provide new experimental data at low temperatures. Then, atomic mobilities in three boundary binaries, fcc Cu-Sn, fcc Ag-Sn, and fcc Cu-Ag, were updated based on the data for various experimental diffusivities obtained from the literature and the present work, together with the available thermodynamic database for solder alloys. Finally, based on the large number of interdiffusivities recently measured from the present authors, atomic mobilities in the fcc Cu-Ag-Sn ternary system were carefully evaluated. A comprehensive comparison between various calculated/model-predicted diffusion properties and the experimental data was used to validate the reliability of the obtained atomic mobilities in ternary fcc Cu-Ag-Sn alloys.

Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

DOE Office of Scientific and Technical Information (OSTI.GOV)

Silva, Bismarck L., E-mail: bismarck_luiz@yahoo.com.br; Garcia, Amauri; Spinelli, José E.

Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be themore » most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined. - Highlights: • Dendritic growth prevailed for the ternary Sn–Bi–Cu and Sn–Bi–Ag solder alloys. • Bi precipitates within Sn-rich dendrites were shown to be unevenly distributed. • Morphology and preferential region for the Ag{sub 3}Sn growth depend

Characterization of Al-Cu-Mg-Ag Alloy RX226-T8 Plate

NASA Technical Reports Server (NTRS)

Lach, Cynthia L.; Domack, Marcia S.

2003-01-01

Aluminum-copper-magnesium-silver (Al-Cu-Mg-Ag) alloys that were developed for thermal stability also offer attractive ambient temperature strength-toughness combinations, and therefore, can be considered for a broad range of airframe structural applications. The current study evaluated Al-Cu-Mg-Ag alloy RX226-T8 in plate gages and compared performance with sheet gage alloys of similar composition. Uniaxial tensile properties, plane strain initiation fracture toughness, and plane stress tearing resistance of RX226-T8 were examined at ambient temperature as a function of orientation and thickness location in the plate. Properties were measured near the surface and at the mid-plane of the plate. Tensile strengths were essentially isotropic, with variations in yield and ultimate tensile strengths of less than 2% as a function of orientation and through-thickness location. However, ductility varied by more than 15% with orientation. Fracture toughness was generally higher at the mid-plane and greater for the L-T orientation, although the differences were small near the surface of the plate. Metallurgical analysis indicated that the microstructure was primarily recrystallized with weak texture and was uniform through the plate with the exception of a fine-grained layer near the surface of the plate. Scanning electron microscope analysis revealed Al-Cu-Mg second phase particles which varied in composition and were primarily located on grain boundaries parallel to the rolling direction. Fractography of toughness specimens for both plate locations and orientations revealed that fracture occurred predominantly by transgranular microvoid coalescence. Introduction High-strength, low-density Al-Cu-Mg-Ag alloys were initially developed to replace conventional 2000 (Al-Cu-Mg) and 7000 (Al-Zn-Cu-Mg) series aluminum alloys for aircraft structural applications [1]. During the High Speed Civil Transport (HSCT) program, improvements in thermal stability were demonstrated for candidate

Two-Phase Eutectic Growth in Al-Cu and Al-Cu-Ag

NASA Astrophysics Data System (ADS)

Senninger, Oriane; Peters, Matthew; Voorhees, Peter W.

2018-02-01

The microstructure developed by two-phase lamellar eutectics (α ) -(θ {-Al}2{Cu}) in Al-Cu and Al-Cu-Ag alloys is analyzed. A model of two-phase eutectic growth in multicomponent alloys is used to determine the scaling law of the eutectic microstructure using the alloy thermophysical properties. The application of the model to these alloys shows that the addition of Ag to Al-Cu alloys does not significantly change the length scale of the microstructure, which is in agreement with previous experimental studies. This is explained by the combined phenomena of the decrease in interface energies with the addition of Ag and the superheating of the (α ) phase interface induced by the Ag composition profile.

The effect of silver (Ag) addition to mechanical and electrical properties of copper alloy (Cu) casting product

NASA Astrophysics Data System (ADS)

Felicia, Dian M.; Rochiem, R.; Laia, Standley M.

2018-04-01

Copper have good mechanical properties and good electrical conductivities. Therefore, copper usually used as electrical components. Silver have better electrical conductivities than copper. Female contact resistor is one of the electrical component used in circuit breaker. This study aims to analyze the effect of silver addition to hardness, strength, and electric conductivity properties of copper alloy. This study uses variation of 0; 0.035; 0.07; 0.1 wt. % Ag (silver) addition to determine the effect on mechanical properties and electrical properties of copper alloy through sand casting process. Modelling of thermal analysis and structural analysis was calculated to find the best design for the sand casting experiments. The result of Cu-Ag alloy as cast will be characterized by OES test, metallography test, Brinell hardness test, tensile test, and LCR meter test. The result of this study showed that the addition of silver increase mechanical properties of Cu-Ag. The maximum hardness value of this alloy is 83.1 HRB which is Cu-0.01 Ag and the lowest is 52.26 HRB which is pure Cu. The maximum strength value is 153.2 MPa which is Cu-0.07 Ag and the lowest is 94.6 MPa which is pure Cu. Silver addition decrease electrical properties of this alloy. The highest electric conductivity is 438.98 S/m which is pure Cu and the lowest is 52.61 S.m which is Cu-0.1 Ag.

Evaluation of mechanically alloyed Cu-based powders as filler alloy for brazing tungsten to a reduced activation ferritic-martensitic steel

NASA Astrophysics Data System (ADS)

de Prado, J.; Sánchez, M.; Ureña, A.

2017-07-01

80Cu-20Ti powders were evaluated for their use as filler alloy for high temperature brazing of tungsten to a reduced activation ferritic/martensitic steel (Eurofer), and its application for the first wall of the DEMO fusion reactor. The use of alloyed powders has not been widely considered for brazing purposes and could improve the operational brazeability of the studied system due to its narrower melting range, determined by DTA analysis, which enhances the spreading capabilities of the filler. Ti contained in the filler composition acts as an activator element, reacting and forming several interfacial layers at the Eurofer-braze, which enhances the wettability properties and chemical interaction at the brazing interface. Brazing thermal cycle also activated the diffusion phenomena, which mainly affected to the Eurofer alloying elements causing in it a softening band of approximately 400 μm of thickness. However, this softening effect did not degrade the shear strength of the brazed joints (94 ± 23 MPa), because failure during testing was always located at the tungsten-braze interface.

Length scale of the dendritic microstructure affecting tensile properties of Al-(Ag)-(Cu) alloys

NASA Astrophysics Data System (ADS)

Duarte, Roberto N.; Faria, Jonas D.; Brito, Crystopher; Veríssimo, Nathalia C.; Cheung, Noé; Garcia, Amauri

2016-12-01

The dependence of tensile properties on the length scale of the dendritic morphology of Al-Cu, Al-Ag and Al-Ag-Cu alloys is experimentally investigated. These alloys were directionally solidified (DS) under a wide range of cooling rates (Ṫ), permitting extensive microstructural scales to be examined. Experimental growth laws are proposed relating the primary dendritic arm spacing, λ1 to Ṫ and tensile properties to λ1. It is shown that the most significant effect of the scale of λ1 on the tensile properties is that of the ternary alloy, which is attributed to the more homogeneous distribution of the eutectic mixture for smaller λ1 and by the combined reinforcement roles of the intermetallics present in the ternary eutectic: Al2Cu and nonequilibrium Ag3Al.

The Effects of Adding Elements of Zinc and Magnesium on Ag-Cu Eutectic Alloy for Warming Acupuncture

PubMed Central

Park, Il Song; Kim, Keun Sik; Lee, Min Ho

2013-01-01

The warming acupuncture for hyperthermia therapy is made of STS304. However, its needle point cannot be reached to a desirable temperature due to heat loss caused by low thermal conductivity, and the quantification of stimulation condition and the effective standard establishment of warming acupuncture are required as a heat source. Accordingly, in this study, after Ag-Cu alloys with different composition ratios were casted and then mixed with additives to improve their physical and mechanical properties, the thermal conductivity and biocompatibility of the alloy specimens were evaluated for selecting suitable material. Ag-Cu binary alloys and ternary alloys added 5 wt% Zn or 2 wt% Mg were casted and then cold drawn to manufacture needles for acupuncture, and their physical properties, thermal conductivity, and biocompatibility were evaluated for their potential use in warming acupuncture. The results of this study showed that the physical and mechanical properties of the Ag-Cu alloys were improved by additives and that the thermal conductivity, machinability, and biocompatibility of the Ag-Cu alloys were improved by Mg addition. PMID:24078827

The effects of adding elements of zinc and magnesium on ag-cu eutectic alloy for warming acupuncture.

PubMed

Kim, Yu Kyoung; Park, Il Song; Kim, Keun Sik; Lee, Min Ho

2013-01-01

The warming acupuncture for hyperthermia therapy is made of STS304. However, its needle point cannot be reached to a desirable temperature due to heat loss caused by low thermal conductivity, and the quantification of stimulation condition and the effective standard establishment of warming acupuncture are required as a heat source. Accordingly, in this study, after Ag-Cu alloys with different composition ratios were casted and then mixed with additives to improve their physical and mechanical properties, the thermal conductivity and biocompatibility of the alloy specimens were evaluated for selecting suitable material. Ag-Cu binary alloys and ternary alloys added 5 wt% Zn or 2 wt% Mg were casted and then cold drawn to manufacture needles for acupuncture, and their physical properties, thermal conductivity, and biocompatibility were evaluated for their potential use in warming acupuncture. The results of this study showed that the physical and mechanical properties of the Ag-Cu alloys were improved by additives and that the thermal conductivity, machinability, and biocompatibility of the Ag-Cu alloys were improved by Mg addition.

Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

NASA Astrophysics Data System (ADS)

Kao, Szu-Tsung; Duh, Jenq-Gong

2004-12-01

The mechanical alloying (MA) process is considered an alternative approach to produce solder materials. In this study, the effect of Cu concentration in the ternary Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by MA was investigated. The (Cu,Sn) solid solution was precipitated as the Cu6Sn5 intermetallic compound (IMC), which was distributed nonuniformly through the microstructure. The Cu6Sn5 IMC, which was present in the SnAgCu solder with high Cu composition, causes the as-milled MA particle to fracture to a smaller size. Appreciable distinction on morphology of as-milled MA powders with different Cu content was revealed. When the Cu concentration was low (x=0.2), MA particle aggregated to a spherical ingot with large particle size. For higher Cu concentration (x=0.7 and x=1), the MA particle turned to flakes with smaller particle size. The distinction of the milling mechanism of Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by the MA process was discussed. An effective approach was developed to reduce the particle size of the SnAgCu solder from 1 mm down to 10-100 µm by doping the Cu6Sn5 nanoparticle during the MA process. In addition, the differential scanning calorimetry (DSC) results also ensure the compatibility to apply the solder material for the reflow process.

Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions

NASA Astrophysics Data System (ADS)

Hao, H.; Tian, J.; Shi, Y. W.; Lei, Y. P.; Xia, Z. D.

2007-07-01

In the current research, trace rare earth (RE) element Y was incorporated into a promising lead-free solder, Sn3.8Ag0.7Cu, in an effort to improve the comprehensive properties of Sn3.8Ag0.7Cu solder. The range of Y content in Sn3.8Ag0.7Cu solder alloys varied from 0 wt.% to 1.0 wt.%. As an illustration of the advantage of Y doping, the melting temperature, wettability, mechanical properties, and microstructures of Sn3.8Ag0.7CuY solder were studied. Trace Y additions had little influence on the melting behavior, but the solder showed better wettability and mechanical properties, as well as finer microstructures, than found in Y-free Sn3.8Ag0.7Cu solder. The Sn3.8Ag0.7Cu0.15Y solder alloy exhibited the best comprehensive properties compared to other solders with different Y content. Furthermore, interfacial and microstructural studies were conducted on Sn3.8Ag0.7Cu0.15Y solder alloys, and notable changes in microstructure were found compared to the Y-free alloy. The thickness of an intermetallic compound layer (IML) was decreased during soldering, and the growth of the IML was suppressed during aging. At the same time, the growth of intermetallic compounds (IMCs) inside the solder was reduced. In particular, some bigger IMC plates were replaced by fine, granular IMCs.

High resolution electron microscopy study of a high Cu variant of Weldalite (tm) 049 and a high strength Al-Cu-Ag-Mg-Zr alloy

NASA Technical Reports Server (NTRS)

Herring, R. A.; Gayle, Frank W.; Pickens, Joseph R.

1991-01-01

Weldalite (trademark) 049 is an Al-Cu-Li-Ag-Mg alloy that is strengthened in artificially aged tempers primarily by very thin plate-like precipitates lying on the set of (111) matrix planes. This precipitate might be expected to be the T(sub 1) phase, Al2CuLi, which has been observed in Al-Cu-Li alloys. However, in several ways this precipitate is similar to the omega phase which also appears as the set of (111) planes plates and is found in Al-Cu-Ag-Mg alloys. The study was undertaken to identify the set of (111) planes precipitate or precipitates in Weldalite (trademark) 049 in the T8 (stretched and artificially aged) temper, and to determine whether T(sub 1), omega, or some other phase is primarily responsible for the high strength (i.e., 700 MPa tensile strength) in this Al-Cu-Li-Ag-Mg alloy.

Containerless electromagnetic levitation melting of Cu-Fe and Ag-Ni alloys

NASA Technical Reports Server (NTRS)

Abbaschian, G. J.; Ethridge, E. C.

1983-01-01

The feasibility of producing silver or copper alloys containing finely dispersed nickel or iron particles, respectively, by utilizing containerless electromagnetic levitation casting techniques was investigated. A levitation coil was designed to successfully levitate and melt a variety of alloys including Nb-Ge, Cu-Fe, Fe-C, and Ag-Ni. Samples of 70 Cu-30 Fe and 80 Ag-20 Ni (atomic %), prepared by mechanical pressing of the constituent powders, were levitated and heated either to the solid plus liquid range of the alloys or to the fully liquid region. The samples were then solidified by passing helium gas into the bell jar or they were dropped into a quenching oil. The structure of the samples which were heated to the solid plus liquid range consists of uniform distribution of Fe or Ni particle in their respective matrices. A considerable amount of entrapped gas bubbles were contained. Upon heating for longer periods or to higher temperatures, the bubbles coalesced and burst, causing the samples to become fragmented and usually fall out of the coil.

Effects of Cu and Ag as ternary and quaternary additions on some physical properties of SnSb7 bearing alloy

NASA Astrophysics Data System (ADS)

El-Bediwi, A. B.

2004-02-01

The structure, electrical resistivity, and elastic modulus of SnSb7 and SnSb7X (X = Cu , Ag, or Cu and Ag) rapidly solidified alloys have been investigated using X-ray diffractometer, double bridge, and dynamic resonance techniques. Copper and silver additions to SnSb result in the formation of a eutectic matrix containing embedded crystals (intermetallic phases) of SnCu, SnAg, and SnSb. The hard crystals SnCu, SnAg, and SnSb increase the overall hardness and wear resistance of SnSb bearing alloys. Addition of copper and silver improves internal friction, electrical conductivity, and elastic modulus values of SnSb rapidly solidified bearing alloys. The internal friction, elastic modulus, and electrical resistivity values are relatively sensitive to the composition of the intermediate phases in the matrix. The SbSb(7)Cu(2)g(2) has better properties (lowest internal friction, cost, adequate elastic modulus, and electrical resistivity) for bearing alloys as compared to cast iron and bronzes.

Effect of thione primers on adhesive bonding between an indirect composite material and Ag-Pd-Cu-Au alloy.

PubMed

Imai, Hideyuki; Koizumi, Hiroyasu; Shimoe, Saiji; Hirata, Isao; Matsumura, Hideo; Nikawa, Hiroki

2014-01-01

The current study evaluated the effect of primers on the shear bond strength of an indirect composite material joined to a silverpalladium-copper-gold (Ag-Pd-Cu-Au) alloy (Castwell). Disk specimens were cast from the alloy and were air-abraded with alumina. Eight metal primers were applied to the alloy surface. A light-polymerized indirect composite material (Solidex) was bonded to the alloy. Shear bond strength was determined both before and after the application of thermocycling. Two groups primed with Metaltite (thione) and M. L. Primer (sulfide) showed the greatest post-thermocycling bond strength (8.8 and 6.5 MPa). The results of the X-ray photoelectron spectroscopic (XPS) analysis suggested that the thione monomer (MTU-6) in the Metaltite primer was strongly adsorbed onto the Ag-Pd-Cu-Au alloy surface even after repeated cleaning with acetone. The application of either the thione (MTU-6) or sulfide primer is effective for enhancing the bonding between a composite material and Ag-Pd-Cu-Au alloy.

Cu-Ag alloy Bitter type magnet for repeating pulsed field

DOE Office of Scientific and Technical Information (OSTI.GOV)

Motokawa, M.; Nojiri, H.; Mitsudo, S.

1996-07-01

Cu-Ag alloy is used for the repeating pulsed field magnets. It is found that fields up to 22 T or more will be available for this purpose instead of 16 T which is obtained with normal copper magnet used at present. This result is a big advantage for neutron diffraction experiments.

Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys

NASA Astrophysics Data System (ADS)

Tucker, J. P.; Chan, D. K.; Subbarayan, G.; Handwerker, C. A.

2012-03-01

During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of Sn-Pb and Sn-Ag-Cu often result from either mixed assemblies or rework. Comprehensive characterization of the mechanical behavior of these mixed solder alloys resulting in a deformationally complete constitutive description is necessary to predict failure of mixed alloy solder joints. Three alloys with 1 wt.%, 5 wt.%, and 20 wt.% Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn-37Pb components mixed with Sn-3.0Ag-0.5Cu. Creep and displacement-controlled tests were performed on specially designed assemblies at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. The observed changes in creep and tensile behavior with Pb additions were related to phase equilibria and microstructure differences observed through differential scanning calorimetric and scanning electron microscopic cross-sectional analysis. As Pb content increased, the steady-state creep strain rates increased, and primary creep decreased. Even 1 wt.% Pb addition was sufficient to induce substantially large creep strains relative to the Sn-3.0Ag-0.5Cu alloy. We describe rate-dependent constitutive models for Pb-contaminated Sn-Ag-Cu solder alloys, ranging from the traditional time-hardening creep model to the viscoplastic Anand model. We illustrate the utility of these constitutive models by examining the inelastic response of a chip-scale package (CSP) under thermomechanical loading through finite-element analysis. The models predict that, as Pb content increases, total inelastic dissipation decreases.

The Effect of Cu:Ag Atomic Ratio on the Properties of Sputtered Cu–Ag Alloy Thin Films

PubMed Central

Hsieh, Janghsing; Hung, Shunyang

2016-01-01

Cu–Ag thin films with various atomic ratios were prepared using a co-sputtering technique, followed by rapid thermal annealing at various temperatures. The films’ structural, mechanical, and electrical properties were then characterized using X-ray diffractometry (XRD), atomic force microscopy (AFM), FESEM, nano-indentation, and TEM as functions of compositions and annealing conditions. In the as-deposited condition, the structure of these films transformed from a one-phase to a dual-phase state, and the resistivity shows a twin-peak pattern, which can be explained in part by Nordheim’s Rule and the miscibility gap of Cu–Ag alloy. After being annealed, the films’ resistivity followed the mixture rule in general, mainly due to the formation of a dual-phase structure containing Ag-rich and Cu-rich phases. The surface morphology and structure also varied as compositions and annealing conditions changed. The recrystallization of these films varied depending on Ag–Cu compositions. The annealed films composed of 40 at % to 60 at % Cu had higher hardness and lower roughness than those with other compositions. Particularly, the Cu50Ag50 film had the highest hardness after being annealed. From the dissolution testing, it was found that the Cu-ion concentration was about 40 times higher than that of Ag. The galvanic effect and over-saturated state could be the cause of the accelerated Cu dissolution and the reduced dissolution of the Ag. PMID:28774033

Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys

NASA Astrophysics Data System (ADS)

Dias, Marcelino; Costa, Thiago A.; Soares, Thiago; Silva, Bismarck L.; Cheung, Noé; Spinelli, José E.; Garcia, Amauri

2018-02-01

Transient directional solidification experiments, and further optical and scanning electron microscopy analyses and tensile tests, allowed the dependence of tensile properties on the micromorphology and length scale of the dendritic/cellular matrix of ternary Sn-5.5Sb-1Ag and Sn-5.5Sb-1Cu alloys to be determined. Extensive ranges of cooling rates were obtained, which permitted specific values of cooling rate for each sample examined along the length of the casting to be attributed. Very broad microstructural length scales were revealed as well as the presence of either cells or dendrites for the Ag-containing alloy. Hereafter, microstructural spacing values such as the cellular spacing, λ c, and the primary dendritic spacing, λ 1, may be correlated with thermal solidification parameters, that is, the cooling rate and the growth rate. While, for the Cu-containing Sn-Sb alloy, the β-Sn matrix is characterized only by the presence of dendritic arrangements, the Ag-containing Sn-Sb alloy is shown to have high-velocity β-Sn cells associated with high cooling rate regions, i.e., positions closer to the bottom of the alloy casting, with the remaining positions being characterized by a complex growth of β-Sn dendrites. Minor additions of Cu and Ag increase both the yield and ultimate tensile strengths when compared with the corresponding values of the binary Sn-5.5Sb alloy, with a small reduction in ductility. This has been attributed to the homogeneous distribution of the Ag3Sn and Cu6Sn5 intermetallic particles related to smaller λ 1 characterizing the dendritic zones of the ternary Sn-Sb-(Cu,Ag) alloys. In addition, the Ag-modified Sn-Sb alloy exhibited an initial wetting angle consistent with that characterizing the binary Sn-5.5Sb alloy.

Elastic moduli of cast Ti-Au, Ti-Ag, and Ti-Cu alloys.

PubMed

Kikuchi, Masafumi; Takahashi, Masatoshi; Okuno, Osamu

2006-07-01

This study investigated the effect of alloying titanium with gold, silver, or copper on the elastic properties of the alloys. A series of binary titanium alloys was made with four concentrations of gold, silver, or copper (5, 10, 20, and 30 mass%) in an argon-arc melting furnace. The Young's moduli and Poisson's ratios of the alloy castings were determined with an ultrasonic-pulse method. The density of each alloy was previously measured by the Archimedes' principle. Results were analyzed using one-way ANOVA and the Scheffé's test. The densities of Ti-Au, Ti-Ag, and Ti-Cu alloys monotonically increased as the concentration of alloying elements increased. As the concentration of gold or silver increased to 20%, the Young's modulus significantly decreased, followed by a subsequent increase in value. As the concentration of copper increased, the Young's modulus monotonically increased. The Young's moduli of all the Ti-Cu alloys were significantly higher than that of the titanium. The density of all the experimental alloys was virtually independent of the alloy phases, while the Young's moduli and Poisson's ratios of the alloys were dependent. The addition of gold or silver slightly reduced the Young's modulus of the titanium when the alloy phase was single alpha. The increase in the Young's modulus of the Ti-Cu alloys is probably due to the precipitation of intermetallic compound Ti2Cu. Copper turned out to be a moderate stiffener that gains a Young's modulus of titanium up to 20% at the copper concentration of 30 mass%.

Microstructural evolution during aging of an Al-Cu-Li-Ag-Mg-Zr alloy

NASA Technical Reports Server (NTRS)

Kumar, K. S.; Brown, S. A.; Pickens, Joseph R.

1991-01-01

Alloys in the Al-Cu-Li Ag-Mg subsystem were developed that exhibit desirable combinations of strength and ductility. These Weldalite (trademark) alloys, are unique for Al-Cu-Li alloys in that with or without a prior cold stretching operation, they obtain excellent strength-ductility combinations upon natural and artificial aging. This is significant because it enables complex, near-net shape products such as forgings and super plastically formed parts to be heat treated to ultra-high strengths. On the other hand, commercial extrusions, rolled plates and sheets of other Al-Cu-Li alloys are typically subjected to a cold stretching operation before artificial aging to the highest strength tempers to introduce dislocations that provide low-energy nucleation sites for strengthening precipitates such as the T(sub 1) phase. The variation in yield strength (YS) with Li content in the near-peak aged condition for these Weldalite (trademark) alloys and the associated microstructures were examined, and the results are discussed.

Evaluation of the microstructure of Al-Cu-Li-Ag-Mg Weldalite (tm) alloys, part 4

NASA Technical Reports Server (NTRS)

Pickens, Joseph R.; Kumar, K. S.; Brown, S. A.; Gayle, Frank W.

1991-01-01

Weldalite (trademark) 049 is an Al-Cu-Li-Ag-Mg alloy designed to have ultrahigh strength and to serve in aerospace applications. The alloy displays significantly higher strength than competitive alloys in both naturally aged and artificially aged tempers. The strengthening phases in such tempers have been identified to, in part, explain the mechanical properties attained. In general, the alloy is strengthened by delta prime Al3Li and Guinier-Preston (GP) zones in the naturally aged tempers. In artificially aged tempers in slightly underaged conditions, strengthening is provided by several phases including GP zones, theta prime Al2Cu, S prime Al2CuMg, T(sub 1) Al2CuLi, and possibly a new phase. In the peak strength artificially aged tempers, T(sub 1) is the predominant strengthening phase.

Microstructure-property relationships in Al-Cu-Li-Ag-Mg Weldalite (tm) alloys, part 2

NASA Technical Reports Server (NTRS)

Langan, T. J.; Pickens, J. R.

1991-01-01

The microstructure and mechanical properties of the ultrahigh strength Al-Cu-Li-Ag-Mg alloy, Weldalite (tm) 049, were studied. Specifically, the microstructural features along with tensile strength, weldability, Young's modulus and fracture toughness were studied for Weldalite (tm) 049 type alloys with Li contents ranging from 1.3 to 1.9 wt. pct. The tensile properties of Weldalite 049 and Weldalite 049 reinforced with TiB2 particles fabricated using the XD (tm) process were also evaluated at cryogenic, room, and elevated temperatures. In addition, an experimental alloy, similar in composition to Weldalite 049 but without the Ag+Mg, was fabricated. The microstructure of this alloy was compared with that of Weldalite 049 in the T6 condition to assess the effect of Ag+Mg on nucleation of strengthening phases in the absence of cold work.

Microstructural Evolution of the Interface Between Pure Titanium and Low Melting Point Zr-Ti-Ni(Cu) Filler Metals

NASA Astrophysics Data System (ADS)

Lee, Dongmyoung; Sun, Juhyun; Kang, Donghan; Shin, Seungyoung; Hong, Juhwa

2014-12-01

Low melting point Zr-based filler metals with melting point depressants (MPDs) such as Cu and Ni elements are used for titanium brazing. However, the phase transition of the filler metals in the titanium joint needs to be explained, since the main element of Zr in the filler metals differs from that of the parent titanium alloys. In addition, since the MPDs easily form brittle intermetallics, that deteriorate joint properties, the phase evolution they cause needs to be studied. Zr-based filler metals having Cu content from 0 to 12 at. pct and Ni content from 12 to 24 at. pct with a melting temperature range of 1062 K to 1082 K (789 °C to 809 °C) were wetting-tested on a titanium plate to investigate the phase transformation and evolution at the interface between the titanium plate and the filler metals. In the interface, the alloys system with Zr, Zr2Ni, and (Ti,Zr)2Ni phases was easily changed to a Ti-based alloy system with Ti, Ti2Ni, and (Ti,Zr)2Ni phases, by the local melting of parent titanium. The dissolution depths of the parent metal were increased with increasing Ni content in the filler metals because Ni has a faster diffusion rate than Cu. Instead, slow diffusion of Cu into titanium substrate leads to the accumulation of Cu at the molten zone of the interface, which could form undesirable Ti x Cu y intermetallics. This study confirmed that Zr-based filler metals are compatible with the parent titanium metal with the minimum content of MPDs.

Filler metal alloy for welding cast nickel aluminide alloys

DOEpatents

Santella, Michael L.; Sikka, Vinod K.

1998-01-01

A filler metal alloy used as a filler for welding east nickel aluminide alloys contains from about 15 to about 17 wt. % chromium, from about 4 to about 5 wt. % aluminum, equal to or less than about 1.5 wt. % molybdenum, from about 1 to about 4.5 wt. % zirconium, equal to or less than about 0.01 wt. % yttrium, equal to or less than about 0.01 wt. % boron and the balance nickel. The filler metal alloy is made by melting and casting techniques such as are melting the components of the filler metal alloy and east in copper chill molds.

Optimization of TiNP/Ti Content for Si3N4/42CrMo Joints Brazed With Ag-Cu-Ti+TiNP Composite Filler

NASA Astrophysics Data System (ADS)

Wang, Tianpeng; Zhang, Jie; Liu, Chunfeng

The Si3N4 ceramic was brazed to 42CrMo steel by using TiN particles modified braze, and the proportion of TiNp reinforcement and active element Ti was optimized to improve the joint strength. The brazed joints were examined by means of SEM. and EDS investigations. Microstructural examination showed that TiN+Ti5Si3 reaction layer was adjacent to Si3N4, whereas TiC was formed in 42CrMo/filler reaction layer. The Ag-Cu-Ti brazing alloy showed intimate bonding with TiNp and Cu-Ti intermetallics precipitated in the joint. The strength tests demonstrated that the mechanical properties of joints increased and then decreased by increasing the TiNp content when a low Ti content (6wt.%) was supplied. When the Ti content (>6wt.%) was offered sufficiently, the joint strength decreased firstly and then stayed stable with increasing the TiNp content. The maximum four-point bending strength (221 MPa) was obtained when the contents of TiNp and Ti were 10vol.% and 6wt.%, respectively.

Thermo-Mechanical Response of Monolithic and NiTi Shape Memory Alloy Fiber Reinforced Sn-3.8Ag-0.7Cu Solder

DTIC Science & Technology

2005-09-01

novel adaptive Tin-Silver-Copper ( SnAgCu ) solder reinforced with NiTi shape-memory alloy (particles or fiber) developed. An experimental...to meet the demands of miniaturization and enhanced performance in severe environments, a novel adaptive Tin-Silver-Copper ( SnAgCu ) solder...4. Crack region of SnAgCu solder after TMF, from reference [1] ............. 5 Figure 5. Phase diagram of 95.5Sn-3.8Ag-0.7Cu solder, from reference

Development of brazing process for W-EUROFER joints using Cu-based fillers

NASA Astrophysics Data System (ADS)

de Prado, J.; Sánchez, M.; Ureña, A.

2016-02-01

A successful joint between W and EUROFER using high temperature brazing technique has been achieved for structural application in future fusion power plants. Cu-based powder alloy mixed with a polymeric binder has been used as filler. Microstructural analysis of the joints revealed that the joint consisted mainly of primary phases and acicular structures in a Cu matrix. Interaction between EUROFER and filler took place at the interface giving rise to several Cu-Ti-Fe rich layers. A loss of hardness at the EUROFER substrate close to the joint due to a diffusion phenomenon during brazing cycle was measured; however, the joints had an adequate shear strength value.

Localized surface plasmon behavior of Ag-Cu alloy nanoparticles stabilized by rice-starch and gelatin

DOE Office of Scientific and Technical Information (OSTI.GOV)

Singh, Manish Kumar; Mandal, R. K., E-mail: rkmandal.met@itbhu.ac.in; Manda, Premkumar

The purpose of this communication was to understand localized surface plasmon behavior of a series of Ag-Cu alloy nanoparticles capped by rice-starch and gelatin. The structures of dried powders were investigated with the help of X-ray diffraction. The analysis revealed Ag-rich and Cu-rich phases with maximum solid solubility of Cu ∼9 atom per cent; 8 atom per cent and Ag ∼ 16 atom per cent; 14 atom per cent in rice-starch and gelatin capped samples respectively. Transmission electron microscope was used for knowing the particle size as well as to supplement FCC phase formations of Ag-rich and Cu-rich solid phasesmore » arrived at based on X-ray diffraction studies. The UV-Vis spectra of sols were examined for the formation and stability of alloy nanoparticles. The temporal evolution of LSPR curves gave us to assert that the sol is stable for more than two months. Small angle X-ray scattering in the sol state was extensively utilized to understand nature of suspensions in terms of fractals. Such a study is important for having a correlation between LSPR behaviors with those of nanoparticle dispersion in aqueous media. It is believed that this work will be a contribution to the emerging field of plasmonics that include applications in the area of photophysical processes and photochemical reactions.« less

Localized surface plasmon behavior of Ag-Cu alloy nanoparticles stabilized by rice-starch and gelatin

NASA Astrophysics Data System (ADS)

Singh, Manish Kumar; Manda, Premkumar; Singh, A. K.; Mandal, R. K.

2015-10-01

The purpose of this communication was to understand localized surface plasmon behavior of a series of Ag-Cu alloy nanoparticles capped by rice-starch and gelatin. The structures of dried powders were investigated with the help of X-ray diffraction. The analysis revealed Ag-rich and Cu-rich phases with maximum solid solubility of Cu ˜9 atom per cent; 8 atom per cent and Ag ˜ 16 atom per cent; 14 atom per cent in rice-starch and gelatin capped samples respectively. Transmission electron microscope was used for knowing the particle size as well as to supplement FCC phase formations of Ag-rich and Cu-rich solid phases arrived at based on X-ray diffraction studies. The UV-Vis spectra of sols were examined for the formation and stability of alloy nanoparticles. The temporal evolution of LSPR curves gave us to assert that the sol is stable for more than two months. Small angle X-ray scattering in the sol state was extensively utilized to understand nature of suspensions in terms of fractals. Such a study is important for having a correlation between LSPR behaviors with those of nanoparticle dispersion in aqueous media. It is believed that this work will be a contribution to the emerging field of plasmonics that include applications in the area of photophysical processes and photochemical reactions.

Filler metal alloy for welding cast nickel aluminide alloys

DOEpatents

Santella, M.L.; Sikka, V.K.

1998-03-10

A filler metal alloy used as a filler for welding cast nickel aluminide alloys contains from about 15 to about 17 wt. % chromium, from about 4 to about 5 wt. % aluminum, equal to or less than about 1.5 wt. % molybdenum, from about 1 to about 4.5 wt. % zirconium, equal to or less than about 0.01 wt. % yttrium, equal to or less than about 0.01 wt. % boron and the balance nickel. The filler metal alloy is made by melting and casting techniques such as are melting the components of the filler metal alloy and cast in copper chill molds. 3 figs.

Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

NASA Astrophysics Data System (ADS)

Shnawah, Dhafer Abdul-Ameer; Said, Suhana Binti Mohd; Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum; Hoe, Teh Guan; Che, Fa Xing; Abood, Adnan Naama

2012-08-01

This work investigates the effects of 0.1 wt.% and 0.5 wt.% Al additions on bulk alloy microstructure and tensile properties as well as on the thermal behavior of Sn-1Ag-0.5Cu (SAC105) lead-free solder alloy. The addition of 0.1 wt.% Al reduces the amount of Ag3Sn intermetallic compound (IMC) particles and leads to the formation of larger ternary Sn-Ag-Al IMC particles. However, the addition of 0.5 wt.% Al suppresses the formation of Ag3Sn IMC particles and leads to a large amount of fine Al-Ag IMC particles. Moreover, both 0.1 wt.% and 0.5 wt.% Al additions suppress the formation of Cu6Sn5 IMC particles and lead to the formation of larger Al-Cu IMC particles. The 0.1 wt.% Al-added solder shows a microstructure with coarse β-Sn dendrites. However, the addition of 0.5 wt.% Al has a great effect on suppressing the undercooling and refinement of the β-Sn dendrites. In addition to coarse β-Sn dendrites, the formation of large Sn-Ag-Al and Al-Cu IMC particles significantly reduces the elastic modulus and yield strength for the SAC105 alloy containing 0.1 wt.% Al. On the other hand, the fine β-Sn dendrite and the second-phase dispersion strengthening mechanism through the formation of fine Al-Ag IMC particles significantly increases the elastic modulus and yield strength of the SAC105 alloy containing 0.5 wt.% Al. Moreover, both 0.1 wt.% and 0.5 wt.% Al additions worsen the elongation. However, the reduction in elongation is much stronger, and brittle fracture occurs instead of ductile fracture, with 0.5 wt.% Al addition. The two additions of Al increase both solidus and liquidus temperatures. With 0.5 wt.% Al addition the pasty range is significantly reduced and the differential scanning calorimetry (DSC) endotherm curve gradually shifts from a dual to a single endothermic peak.

Investigation on localized corrosion of 304 stainless steel joints brazed using Sn-plated Ag alloy filler in NaCl aqueous solution

NASA Astrophysics Data System (ADS)

Wang, Xingxing; Li, Shuai; Peng, Jin

2018-03-01

Novel AgCuZnSn filler metal with high Sn contents was prepared from BAg50CuZn filler metal by a process of electroplating and thermal diffusion, and the prepared filler metal was applied to induction brazing of 304 stainless steel. The corrosion behavior of the brazed joints was evaluated based on localized corrosion analysis, the morphology of the joints were analyzed by SEM after immersion in a 3.5 vol% NaCl aqueous solution. The results indicated that corrosion groove occurred near the interface between the stainless steel base metal and the brazing seam. A wide range of defects such as holes and cracks appeared on the surface of the base metal, while the brazing seam zone almost no corrosion defects occur. With the increase of corrosion time, the corrosion rates of both the brazing seam and the base metal first exhibited an increasing trend, followed by a decreasing trend, and the corrosion rate of the base metal was slightly greater than that of the brazing seam. The corrosion potential of the brazing seam and 304 stainless steel were -0.7758 V and -0.7863 V, respectively.

Effect of Ag Addition on the Electrochemical Performance of Cu10Al in Artificial Saliva

PubMed Central

Salgado-Salgado, R. J.; Sotelo-Mazon, O.; Rodriguez-Diaz, R. A.; Salinas-Solano, G.

2016-01-01

In this work we proposed to evaluate the corrosion resistance of four different alloys by electrochemical techniques, a binary alloy Cu10Al, and three ternary alloys Cu10Al-xAg (x = 5, 10, and 15 wt.%) to be used like biomaterials in dental application. Biomaterials proposed were tested in artificial saliva at 37°C for 48 h. In addition, pure metals Cu, Al, Ag, and Ti as reference materials were evaluated. In general the short time tests indicated that the Ag addition increases the corrosion resistance and reduces the extent of localized attack of the binary alloy. Moreover, tests for 48 hours showed that the Ag addition increases the stability of the passive layer, thereby reducing the corrosion rate of the binary alloy. SEM analysis showed that Cu10Al alloy was preferably corroded by grain boundaries, and the Ag addition modified the form of attack of the binary alloy. Cu-rich phases reacted with SCN− anions forming a film of CuSCN, and the Ag-rich phase is prone to react with SCN− anions forming AgSCN. Thus, binary and ternary alloys are susceptible to tarnish in the presence of thiocyanate ions. PMID:27660601

Effect of a prior stretch on the aging response of an Al-Cu-Li-Ag-Mg-Zr alloy

NASA Technical Reports Server (NTRS)

Kumar, K. S.; Brown, S. A.; Pickens, Joseph R.

1991-01-01

Recently, a family of Al-Cu-Li alloys containing minor amounts of Ag, Mg, and Zr and having desirable combinations of strength and toughness were developed. The Weldalite (trademark) alloys exhibit a unique characteristic in that with or without a prior stretch, they obtain significant strength-ductility combinations upon natural and artificial aging. The ultra-high strength (approximately 690 MPa yield strength) in the peak-aged tempers (T6 and T8) were primarily attributed to the extremely fine T(sub 1) (Al2CuLi) or T(sub 1)-type precipitates that occur in these alloys during artificial aging, whereas the significant natural aging response observed is attributed to strengthening from delta prime (Al3Li) and GP zones. In recent work, the aging behavior of an Al-Cu-Li-Ag-Mg alloy without a prior stretch was followed microstructurally from the T4 to the T6 condition. Commercial extrusions, rolled plates, and sheets of Al-Cu-Li alloys are typically subjected to a stretching operation before artificial aging to straighten the extrusions and, more importantly, introduce dislocations to simulate precipitation of strengthening phases such as T(sub 1) by providing relatively low-energy nucleation sites. The goals of this study are to examine the microstructure that evolves during aging of an alloy that was stretch after solution treatment and to compare the observations with those for the unstretched alloy.

Microstructure and Interfacial Reactions During Vacuum Brazing of Stainless Steel to Titanium Using Ag-28 pct Cu Alloy

NASA Astrophysics Data System (ADS)

Laik, A.; Shirzadi, A. A.; Sharma, G.; Tewari, R.; Jayakumar, T.; Dey, G. K.

2015-02-01

Microstructural evolution and interfacial reactions during vacuum brazing of grade-2 Ti and 304L-type stainless steel (SS) using eutectic alloy Ag-28 wt pct Cu were investigated. A thin Ni-depleted zone of -Fe(Cr, Ni) solid solution formed on the SS-side of the braze zone (BZ). Cu from the braze alloy, in combination with the dissolved Fe and Ti from the base materials, formed a layer of ternary compound , adjacent to Ti in the BZ. In addition, four binary intermetallic compounds, CuTi, CuTi, CuTi and CuTi formed as parallel contiguous layers in the BZ. The unreacted Ag solidified as islands within the layers of CuTi and CuTi. Formation of an amorphous phase at certain locations in the BZ could be revealed. The -Ti(Cu) layer, formed due to diffusion of Cu into Ti-based material, transformed to an -Ti + CuTi eutectoid with lamellar morphology. Tensile test showed that the brazed joints had strength of 112 MPa and failed at the BZ. The possible sequence of events that led to the final microstructure and the mode of failure of these joints were delineated.

Microstructure Evolution During Stainless Steel-Copper Vacuum Brazing with a Ag/Cu/Pd Filler Alloy: Effect of Nickel Plating

NASA Astrophysics Data System (ADS)

Choudhary, R. K.; Laik, A.; Mishra, P.

2017-03-01

Vacuum brazing of stainless steel and copper plates was done using a silver-based filler alloy. In one set of experiments, around 30-µm-thick nickel coatings were electrochemically applied on stainless steel plates before carrying out the brazing runs and its effect in making changes in the braze-zone microstructure was studied. For brazing temperature of 830 °C, scanning electron microscopy examination of the braze-zone revealed that relatively sound joints were obtained when brazing was done with nickel-coated stainless steel than with uncoated one. However, when brazing of nickel-coated stainless steel and copper plates was done at 860 °C, a wide crack appeared in the braze-zone adjacent to copper side. Energy-dispersive x-ray analysis and electron microprobe analysis confirmed that at higher temperature, the diffusion of Cu atoms from copper plate towards the braze-zone was faster than that of Ni atoms from nickel coating. Helium leak rate of the order 10-11 Pa m3/s was obtained for the crack-free joint, whereas this value was higher than 10-4 Pa m3/s for the joint having crack. The shear strength of the joint was found to decrease considerably due to the presence of crack.

Thermophysical Properties of Sn-Ag-Cu Based Pb-Free Solders

NASA Astrophysics Data System (ADS)

Kim, Sok Won; Lee, Jaeran; Jeon, Bo-Min; Jung, Eun; Lee, Sang Hyun; Kang, Kweon Ho; Lim, Kwon Taek

2009-06-01

Lead-tin (Pb-Sn) alloys are the dominant solders used for electronic packaging because of their low cost and superior properties required for interconnecting electronic components. However, increasing environmental and health concerns over the toxicity of lead, combined with global legislation to limit the use of Pb in manufactured products, have led to extensive research and development studies of lead-free solders. The Sn-Ag-Cu ternary eutectic alloy is considered to be one of the promising alternatives. Except for thermal properties, much research on several properties of Sn-Ag-Cu alloy has been performed. In this study, five Sn-xAg-0.5Cu alloys with variations of Ag content x of 1.0 mass%, 2.5 mass%, 3.0 mass%, 3.5 mass%, and 4.0 mass% were prepared, and their thermal diffusivity and specific heat were measured from room temperature to 150 °C, and the thermal conductivity was calculated using the measured thermal diffusivity, specific heat, and density values. Also, the linear thermal expansion was measured from room temperature to 170 °C. The results show that Sn-3.5Ag-0.5Cu is the best candidate because it has a maximum thermal conductivity and a low thermal expansion, which are the ideal conditions to be a proper packaging alloy for effective cooling and thermostability.

Ag-Pd-Cu alloy inserted transparent indium tin oxide electrodes for organic solar cells

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kim, Hyo-Joong; Seo, Ki-Won; Kim, Han-Ki, E-mail: imdlhkkim@khu.ac.kr

2014-09-01

The authors report on the characteristics of Ag-Pd-Cu (APC) alloy-inserted indium tin oxide (ITO) films sputtered on a glass substrate at room temperature for application as transparent anodes in organic solar cells (OSCs). The effect of the APC interlayer thickness on the electrical, optical, structural, and morphological properties of the ITO/APC/ITO multilayer were investigated and compared to those of ITO/Ag/ITO multilayer electrodes. At the optimized APC thickness of 8 nm, the ITO/APC/ITO multilayer exhibited a resistivity of 8.55 × 10{sup −5} Ω cm, an optical transmittance of 82.63%, and a figure-of-merit value of 13.54 × 10{sup −3} Ω{sup −1}, comparable to those of the ITO/Ag/ITOmore » multilayer. Unlike the ITO/Ag/ITO multilayer, agglomeration of the metal interlayer was effectively relieved with APC interlayer due to existence of Pd and Cu elements in the thin region of the APC interlayer. The OSCs fabricated on the ITO/APC/ITO multilayer showed higher power conversion efficiency than that of OSCs prepared on the ITO/Ag/ITO multilayer below 10 nm due to the flatness of the APC layer. The improved performance of the OSCs with ITO/APC/ITO multilayer electrodes indicates that the APC alloy interlayer prevents the agglomeration of the Ag-based metal interlayer and can decrease the thickness of the metal interlayer in the oxide-metal-oxide multilayer of high-performance OSCs.« less

A study of the vacancy loop formation probability in Ni-Cu and Ag-Pd alloys. [50-keV Kr sup + ions

DOE Office of Scientific and Technical Information (OSTI.GOV)

Smalinskas, K.; Chen, Gengsheng; Haworth, J.

1992-04-01

The molten-zone model of vacancy loop formation from a displacement cascade predicts that the loop formation probability should scale with the melting temperature. To investigate this possibility the vacancy loop formation probability has been determined in a series of Cu-Ni and Ag-Pd alloys. The irradiations were performed at room temperature with 50 keV Kr+ ions and the resulting damage structure was examined by using transmission electron microscopy. In the Cu-Ni alloy series, the change in loop formation probability with increasing Ni concentration was complex, and at low- and high- nickel concentrations, the defect yield did not change in the predictedmore » manner. The defect yield was higher in the Cu-rich alloys than in the Ni-rich alloys. In the Ag-Pd alloy the change in the loop formation probability followed more closely the change in melting temperature, but no simple relationship was determined.« less

Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallization

NASA Astrophysics Data System (ADS)

Kao, Szu-Tsung; Duh, Jenq-Gong

2005-08-01

Electroless Ni-P under bump metallization (UBM) has been widely used in electronic interconnections due to the good diffusion barrier between Cu and solder. In this study, the mechanical alloying (MA) process was applied to produce the SnAgCu lead-free solder pastes. Solder joints after annealing at 240°C for 15 min were employed to investigate the evolution of interfacial reaction between electroless Ni-P/Cu UBM and SnAgCu solder with various Cu concentrations ranging from 0.2 to 1.0 wt.%. After detailed quantitative analysis with an electron probe microanalyzer, the effect of Cu content on the formation of intermetallic compounds (IMCs) at SnAgCu solder/electroless Ni-P interface was evaluated. When the Cu concentration in the solder was 0.2 wt.%, only one (Ni, Cu)3Sn4 layer was observed at the solder/electroless Ni-P interface. As the Cu content increased to 0.5 wt.%, (Cu, Ni)6Sn5 formed along with (Ni, Cu)3Sn4. However, only one (Cu, Ni)6Sn5 layer was revealed, if the Cu content was up to 1 wt.%. With the aid of microstructure evolution, quantitative analysis, and elemental distribution by x-ray color mapping, the presence of the Ni-Sn-P phase and P-rich layer was evidenced.

Highly reflective Ag-Cu alloy-based ohmic contact on p-type GaN using Ru overlayer.

PubMed

Son, Jun Ho; Jung, Gwan Ho; Lee, Jong-Lam

2008-12-15

We report on a metallization scheme of high reflectance, low resistance, and smooth surface morphology ohmic contact on p-type GaN. Ag-Cu alloy/Ru contact showed low contact resistivity as low as 6.2 x 10(-6) Ohms cm(2) and high reflectance of 91% at 460 nm after annealing at 400 degrees C in air ambient. The oxidation annealing promoted the out-diffusion of Ga atoms to dissolve in an Ag-Cu layer with the formation of an Ag-Ga solid solution, lowering the contact resistivity. The Ru overlayer acts as a diffusion barrier for excessive oxygen incorporation during oxidation annealing, resulting in high reflectance, good thermal stability, and smooth surface quality of the contact.

Metallurgical characterization of experimental Ag-based soldering alloys.

PubMed

Ntasi, Argyro; Al Jabbari, Youssef S; Silikas, Nick; Al Taweel, Sara M; Zinelis, Spiros

2014-10-01

To characterize microstructure, hardness and thermal properties of experimental Ag-based soldering alloys for dental applications. Ag12Ga (AgGa) and Ag10Ga5Sn (AgGaSn) were fabricated by induction melting. Six samples were prepared for each alloy and microstructure, hardness and their melting range were determined by, scanning electron microscopy, energy dispersive X-ray (EDX) microanalysis, X-ray diffraction (XRD), Vickers hardness testing and differential scanning calorimetry (DSC). Both alloys demonstrated a gross dendritic microstructure while according to XRD results both materials consisted predominately of a Ag-rich face centered cubic phase The hardness of AgGa (61 ± 2) was statistically lower than that of AgGaSn (84 ± 2) while the alloys tested showed similar melting range of 627-762 °C for AgGa and 631-756 °C for AgGaSn. The experimental alloys tested demonstrated similar microstructures and melting ranges. Ga and Sn might be used as alternative to Cu and Zn to modify the selected properties of Ag based soldering alloys.

Increasing Ti-6Al-4V brazed joint strength equal to the base metal by Ti and Zr amorphous filler alloys

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ganjeh, E., E-mail: navidganjehie@sina.kntu.ac.ir; Sarkhosh, H.; Bajgholi, M.E.

Microstructural features developed along with mechanical properties in furnace brazing of Ti-6Al-4V alloy using STEMET 1228 (Ti-26.8Zr-13Ni-13.9Cu, wt.%) and STEMET 1406 (Zr-9.7Ti-12.4Ni-11.2Cu, wt.%) amorphous filler alloys. Brazing temperatures employed were 900-950 Degree-Sign C for the titanium-based filler and 900-990 Degree-Sign C for the zirconium-based filler alloys, respectively. The brazing time durations were 600, 1200 and 1800 s. The brazed joints were evaluated by ultrasonic test, and their microstructures and phase constitutions analyzed by metallography, scanning electron microscopy and X-ray diffraction analysis. Since microstructural evolution across the furnace brazed joints primarily depends on their alloying elements such as Cu, Ni andmore » Zr along the joint. Accordingly, existence of Zr{sub 2}Cu, Ti{sub 2}Cu and (Ti,Zr){sub 2}Ni intermetallic compounds was identified in the brazed joints. The chemical composition of segregation region in the center of brazed joints was identical to virgin filler alloy content which greatly deteriorated the shear strength of the joints. Adequate brazing time (1800 s) and/or temperature (950 Degree-Sign C for Ti-based and 990 Degree-Sign C for Zr-based) resulted in an acicular Widmanstaetten microstructure throughout the entire joint section due to eutectoid reaction. This microstructure increased the shear strength of the brazed joints up to the Ti-6Al-4V tensile strength level. Consequently, Ti-6Al-4V can be furnace brazed by Ti and Zr base foils produced excellent joint strengths. - Highlights: Black-Right-Pointing-Pointer Temperature or time was the main factors of controlling braze joint strength. Black-Right-Pointing-Pointer Developing a Widmanstaetten microstructure generates equal strength to base metal. Black-Right-Pointing-Pointer Brittle intermetallic compounds like (Ti,Zr){sub 2}Ni/Cu deteriorate shear strength. Black-Right-Pointing-Pointer Ti and Zr base filler alloys were the best choice for

Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

DOE Office of Scientific and Technical Information (OSTI.GOV)

Anderson, Iver E.; Boesenberg, Adam; Harringa, Joel

2011-09-28

Pb-free solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic have promise for widespread adoption across assembly conditions and operating environments, but enhanced microstructural control is needed. Micro-alloying with elements such as Zn was demonstrated for promoting a preferred solidification path and joint microstructure earlier in simple (Cu/Cu) solder joints studies for different cooling rates. This beneficial behavior now has been verified in reworked ball grid array (BGA) joints, using dissimilar SAC305 (Sn-3.0Ag-0.5Cu, wt.%) solder paste. After industrial assembly, BGA components joined with Sn-3.5Ag-0.74Cu-0.21Zn solder were tested in thermal cycling (-55 C/+125 C) along with baseline SAC305 BGA joints beyondmore » 3000 cycles with continuous failure monitoring. Weibull analysis of the results demonstrated that BGA components joined with SAC + Zn/SAC305 have less joint integrity than SAC305 joints, but their lifetime is sufficient for severe applications in consumer, defense, and avionics electronic product field environments. Failure analysis of the BGA joints revealed that cracking did not deviate from the typical top area (BGA component side) of each joint, in spite of different Ag3Sn blade content. Thus, SAC + Zn solder has not shown any advantage over SAC305 solder in these thermal cycling trials, but other characteristics of SAC + Zn solder may make it more attractive for use across the full range of harsh conditions of avionics or defense applications.« less

Metallurgical characterization of experimental Ag-based soldering alloys

PubMed Central

Ntasi, Argyro; Al Jabbari, Youssef S.; Silikas, Nick; Al Taweel, Sara M.; Zinelis, Spiros

2014-01-01

Aim To characterize microstructure, hardness and thermal properties of experimental Ag-based soldering alloys for dental applications. Materials and methods Ag12Ga (AgGa) and Ag10Ga5Sn (AgGaSn) were fabricated by induction melting. Six samples were prepared for each alloy and microstructure, hardness and their melting range were determined by, scanning electron microscopy, energy dispersive X-ray (EDX) microanalysis, X-ray diffraction (XRD), Vickers hardness testing and differential scanning calorimetry (DSC). Results Both alloys demonstrated a gross dendritic microstructure while according to XRD results both materials consisted predominately of a Ag-rich face centered cubic phase The hardness of AgGa (61 ± 2) was statistically lower than that of AgGaSn (84 ± 2) while the alloys tested showed similar melting range of 627–762 °C for AgGa and 631–756 °C for AgGaSn. Conclusion The experimental alloys tested demonstrated similar microstructures and melting ranges. Ga and Sn might be used as alternative to Cu and Zn to modify the selected properties of Ag based soldering alloys. PMID:25382945

Green Synthesis of Ag, Cu and AgCu Nanoparticles using Palm Leaves Extract as the Reducing and Stabilizing Agents

NASA Astrophysics Data System (ADS)

Mohamad, N. A. N.; Arham, N. A.; Junaidah, J.; Hadi, A.; Idris, S. A.

2018-05-01

This paper reports the green synthesis of Ag, Cu and AgCu nanoparticles at room temperature using palm leaves extract. The purpose of this study is to eliminate the use of chemicals in the synthesis of nanoparticles and evaluate the efficiency of the palm leaves extract as the reducing and stabilizing agents. The palm leaves extract was added to metal salt solution and continuously stirred until reaction completed. The produced nanoparticles were analyzed using atomic absorption spectroscopy (AAS), Fourier transform infrared spectroscopy (FTIR), energy dispersive X-ray spectroscopy (EDS), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The analyses revealed that palm leaves extract has efficiently reduced the silver ions, but not the copper ions. During synthesis of AgCu nanoparticles, simultaneous reduction was occurred leading to formation of alloyed nanoparticles. Biomolecules from the palm leaves extract adsorbed on the surface of nanoparticles forming a capping layer thus stabilized the nanoparticles. The produced Ag and Cu nanoparticles were predominantly spherical with the particle size of Cu nanoparticles were larger than Ag nanoparticles. The AgCu nanoparticles closely resembled the Ag nanoparticles due to high Ag content with average size of 13nm. Therefore, palm leaves extract has a potential to be a good reducing and stabilizing agents.

The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy

NASA Astrophysics Data System (ADS)

Sungkhaphaitoon, Phairote; Plookphol, Thawatchai

2018-02-01

In this study, we investigated the effects produced by the addition of antimony (Sb) to Sn-3.0Ag-0.5Cu-based solder alloys. Our focus was the alloys' microstructural, mechanical, and thermal properties. We evaluated the effects by means of scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), differential scanning calorimetry (DSC), and a universal testing machine (UTM). The results showed that a part of the Sb was dissolved in the Sn matrix phase, and the remaining one participated in the formation of intermetallic compounds (IMCs) of Ag3(Sn,Sb) and Cu6(Sn,Sb)5. In the alloy containing the highest wt pct Sb, the added component resulted in the formation of SnSb compound and small particle pinning of Ag3(Sn,Sb) along the grain boundary of the IMCs. Our tests of the Sn-3.0Ag-0.5Cu solder alloys' mechanical properties showed that the effects produced by the addition of Sb varied as a function of the wt pct Sb content. The ultimate tensile strength (UTS) increased from 29.21 to a maximum value of 40.44 MPa, but the pct elongation (pct EL) decreased from 48.0 to a minimum 25.43 pct. Principally, the alloys containing Sb had higher UTS and lower pct EL than Sb-free solder alloys due to the strengthening effects of solid solution and second-phase dispersion. Thermal analysis showed that the alloys containing Sb had a slightly higher melting point and that the addition amount ranging from 0.5 to 3.0 wt pct Sb did not significantly change the solidus and liquidus temperatures compared with the Sb-free solder alloys. Thus, the optimal concentration of Sb in the alloys was 3.0 wt pct because the microstructure and the ultimate tensile strength of the SAC305 solder alloys were improved.

Development of casting investment preventing blackening of noble metal alloys part 1. Application of developed investment for Ag-Pd-Cu-Au alloy.

PubMed

Kakuta, Kiyoshi; Nakai, Akira; Goto, Shin-ichi; Wakamatsu, Yasushi; Yara, Atushi; Miyagawa, Yukio; Ogura, Hideo

2003-03-01

The objective of this study is to develop a casting investment that prevents the blackening of the cast surface of noble metal alloys. The experimental investments were prepared using a gypsum-bonded investment in which the metallic powders such as boron (B), silicon (Si), aluminum (Al) and titanium (Ti) were added as oxidizing agents. An Ag-Pd-Cu-Au alloy was cast into the mold made of the prepared investment. The effect of the addition of each metal powder was evaluated from the color difference between the as-cast surface and the polished surface of the cast specimen. The color of the as-cast surface approached that of the polished surface with increasing B and Al content. A lower mean value in the color difference was obtained at 0.25-1.00 mass% B content. B and Al are useful as an additive in a gypsum-bonded investment to prevent the blackening of an Ag-Pd-Cu-Au alloy. The effects of Si and Ti powder addition could not be found.

The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure

NASA Astrophysics Data System (ADS)

Zribi, A.; Clark, A.; Zavalij, L.; Borgesen, P.; Cotts, E. J.

2001-09-01

The evolution of intermetallics at and near SnAgCu/Cu and SnAgCu/Ni interfaces was examined, and compared to the behavior, near PbSn/metal and Sn/metal interfaces. Two different solder compositions were considered, Sn93.6Ag4.7Cu1.7 and Sn95.5Ag3.5Cu1.0 (Sn91.8Ag5.1 Cu3.1 and Sn94.35Ag3.8Cu1.85 in atomic percent). In both cases, phase formation and growth at interfaces with Cu were very similar to those commonly observed for eutectic SnPb solder. However, the evolution of intermetallics at SnAgCu/Ni interfaces proved much more complex. The presence of the Cu in the solder dramatically altered the phase selectivity at the solder/Ni interface and affected the growth kinetics of intermetallics. As long as sufficient Cu was available, it would combine with Ni and Sn to form (Cu,Ni)6)Sn5 which grew instead of the Ni3Sn4 usually observed in PbSn/Ni and Sn/Ni diffusion couples. This growing phase would, however, eventually consume essentially all of the available Cu in the solder. Because the mechanical properties of Sn-Ag-Cu alloys, depend upon the Cu content, this consumption can be expected to alter the mechanical properties of these Pb-free solderjoints. After depletion of the Cu from the solder, further annealing then gradually transformed the (Cu,Ni)6Sn5 phase into a (Ni,Cu)3Sn4 phase.

Symmetry and novelty in the electronic and geometric structure of nanoalloys:. the case of Ag27Cu7

NASA Astrophysics Data System (ADS)

Ortigoza, M. Alcántara; Rahman, T. S.

2008-04-01

Nanoparticles of bimetallic alloys have been shown to possess composition dependent characteristics which distinguish themselves from the corresponding bulk alloys. Taking the 34-atom nanoalloy of Ag and Cu (Ag27Cu7), we show using first principles electronic structure calculations that this core-shell alloy indeed has perfect D5h symmetry and consists of only 6 non-equivalent (2 Cu and 4 Ag) atoms. Analysis of the interatomic bond lengths and detailed electronic structure further reveal that the Cu atoms play a major role in controlling the characteristics of the nanoalloy. The higher cohesive energy, together with shorter bond length for Cu, compared to Ag, conspire to produce a hierarchy in the relative strengths of the Ag - Cu, Ag - Ag, and Cu - Cu bonds and corresponding interatomic bond lengths, point to the uniqueness in the characteristics of this nanoalloy. Charge density plots of Ag27Cu7 provide further insights into the relative strengths of the various interatomic bonds.

Structural and optical properties of (Ag,Cu)(In,Ga)Se{sub 2} polycrystalline thin film alloys

DOE Office of Scientific and Technical Information (OSTI.GOV)

Boyle, J. H.; Shafarman, W. N.; Birkmire, R. W.

2014-06-14

The structural and optical properties of pentenary alloy (Ag,Cu)(In,Ga)Se{sub 2} polycrystalline thin films were characterized over the entire compositional range at a fixed (Cu + Ag)/(In + Ga) ratio. Films deposited at 550 °C on bare and molybdenum coated soda-lime glass by elemental co-evaporation in a single-stage process with constant incident fluxes exhibit single phase chalcopyrite structure, corresponding to 122 spacegroup (I-42d) over the entire compositional space. Unit cell refinement of the diffraction patterns show that increasing Ag substitution for Cu, the refined a{sub o} lattice constant, (Ag,Cu)-Se bond length, and anion displacement increase in accordance with the theoretical model proposed by Jaffe, Wei, andmore » Zunger. However, the refined c{sub o} lattice constant and (In,Ga)-Se bond length deviated from theoretical expectations for films with mid-range Ag and Ga compositions and are attributed to influences from crystallographic bond chain ordering or cation electronegativity. The optical band gap, derived from transmission and reflection measurements, widened with increasing Ag and Ga content, due to influences from anion displacement and cation electronegativity, as expected from theoretical considerations for pseudo-binary chalcopyrite compounds.« less

Micro-structure and properties of Cu-0.5 wt%Ag alloy fine wires with severe cold plastic deformation treatment

NASA Astrophysics Data System (ADS)

Shu-sen, Wang; Yuan-wang, Zhang; Da-wei, Yao

2018-04-01

In this work, the Cu-0.5 wt% Ag alloy was prepared and then sold solution treated at 760 °C for 4 h and aged at 400 °C for 4 h. The severe cold plastic deformation treatment with a maximum true strain of 11.48 was applied to obtain the Cu-0.5 wt%Ag fine wires with the diameter of 0.087 mm. Then the fine wires were given eight intermediate heat treatments at 300 °C–350 °C for 10–60 min. Properties of the fine wires with different annealing heat treatments were analyzed, results showed that after the annealing process of 350 °C, 20 min was applied to Cu-0.5 wt% Ag fine wires, their conductivity, tensile strength and elongation could reach 98.6%IACS, 367 MPa and 8%, respectively. This demonstrated that the Cu-0.5 wt% Ag processes high strength and high conductivity properties and was a promising conductive material.

Vacuum brazing of electroless Ni-P alloy-coated SiCp/Al composites using aluminum-based filler metal foil

NASA Astrophysics Data System (ADS)

Wang, Peng; Xu, Dongxia; Niu, Jitai

2016-12-01

Using rapidly cooled (Al-10Si-20Cu-0.05Ce)-1Ti (wt%) foil as filler metal, the research obtained high-performance joints of electroless Ni-P alloy-coated aluminum matrix composites with high SiC particle content (60 vol%, SiCp/Al-MMCs). The effect of brazing process on joint properties and the formation of Al-Ni and Al-Cu-Ni intermetallic compounds were investigated, respectively. Due to the presence of Ni-P alloy coating, the wettability of liquid filler metal on the composites was improved obviously and its contact angle was only 21°. The formation of Al3Ni2 and Al3(CuNi)2 intermetallic compounds indicated that well metallurgical bonding occurred along the 6063Al matrix alloy/Ni-P alloy layer/filler metal foil interfaces by mutual diffusion and dissolution. And the joint shear strength increased with increasing the brazing temperature from 838 to 843 K or prolonging the soaking time from 15 to 35 min, while it decreased a lot because of corrosion occurring in the 6063Al matrix at high brazing temperature of 848 K. Sound joints with maximum shear strength of 112.5 MPa were obtained at 843 K for soaking time of 35 min. In this research, the beneficial effect of surface metallization by Ni-P alloy deposits on improving wettability on SiCp/Al-MMCs was demonstrated, and capable welding parameters were broadened as well.

The influence of Ag+Mg additions on the nucleation of strengthening precipitates in a non-cold-worked Al-Cu-Li alloy

NASA Technical Reports Server (NTRS)

1991-01-01

Aluminum-copper-lithium alloys generally require cold work to attain their highest strengths in artificially aged tempers. These alloys are usually strengthened by a combination of the metastable delta prime (Al3Li) and theta prime (Al2Cu) phases and the equilibrium T sub 1 (Al2CuLi) phase, and where the T sub 1 phase is a more potent strengthener than the delta prime. Various investigators have shown that the high strengths obtained after artificial aging associated with cold work result from the heterogeneous precipitation of T sub 1 on matrix dislocations. The objective here is to elucidate the mechanism by which the Ag+Mg additions stimulate the precipitation of T sub 1 type precipitates without cold work. To accomplish this, the microstructure of an Al-6.3Cu-1.3Li-0.14Zr model alloy was evaluated in a T6 type temper with and without the Ag+Mg addition.

Basic principles of creating a new generation of high- temperature brazing filler alloys

NASA Astrophysics Data System (ADS)

Kalin, B. A.; Suchkov, A. N.

2016-04-01

The development of new materials is based on the formation of a structural-phase state providing the desired properties by selecting the base and the complex of alloying elements. The development of amorphous filler alloys for a high-temperature brazing has its own features that are due to the limited life cycle and the production method of brazing filler alloys. The work presents a cycle of analytical and experimental materials science investigations including justification of the composition of a new amorphous filler alloy for brazing the products from zirconium alloys at the temperature of no more than 800 °C and at the unbrazing temperature of permanent joints of more than 1200 °C. The experimental alloys have been used for manufacture of amorphous ribbons by rapid quenching, of which the certification has been made by X-ray investigations and a differential-thermal analysis. These ribbons were used to obtain permanent joints from the spacer grid cells (made from the alloy Zr-1% Nb) of fuel assemblies of the thermal nuclear reactor VVER-440. The brazed samples in the form of a pair of cells have been exposed to corrosion tests in autoclaves in superheated water at a temperature of 350 °C, a pressure of 160 MPa and duration of up to 6,000 h. They have been also exposed to destructive tests using a tensile machine. The experimental results obtained have made it possible to propose and patent a brazing filler alloy of the following composition: Zr-5.5Fe-(2.5-3.5)Be-1Nb-(5-8)Cu-2Sn-0.4Cr-(0.5-1.0)Ge. Its melting point is 780 °C and the recommended brazing temperature is 800°C.

Magnetic analysis of a melt-spun Fe-dilute Cu60Ag35Fe5 alloy

NASA Astrophysics Data System (ADS)

Kondo, Shin-ichiro; Kaneko, Kazuhiro; Morimura, Takao; Nakashima, Hiromichi; Kobayashi, Shin-Taro; Michioka, Chishiro; Yoshimura, Kazuyoshi

2015-04-01

The magnetic properties of a melt-spun Fe-dilute Cu60Ag35Fe5 alloy are examined by X-ray diffraction, magnetic measurements, and transmission electron microscopy (TEM). The X-ray diffraction patterns show that the as-spun and annealed (773 K×36 ks) samples contain Cu and Ag phases and no Fe phases; thus, most Fe atoms are dispersed as clusters. Magnetic measurements indicate that the as-spun and annealed samples exhibit superparamagnetic behavior at 300 K, whereas ferromagnetic and superparamagnetic behaviors coexist at 4.2 K. The magnetic moments of small clusters at 300 K are determined by the nonlinear least squares method as 5148 and 4671 μB for as-spun and annealed samples, respectively, whereas those at 300 K are experimentally determined as 3500 and 3200 μB. This decrease in magnetic moments may imply the formation of anti-ferromagnetic coupling by annealing. TEM observation of the melt-spun sample suggests that there are three regions with different compositions: Cu-rich, Ag-rich, and Fe-rich with no precipitation in the matrix. In addition, these regions have obscure interfaces. The magnetic clusters are attributed to the Fe-rich regions.

Combinatorial development of antibacterial Zr-Cu-Al-Ag thin film metallic glasses.

PubMed

Liu, Yanhui; Padmanabhan, Jagannath; Cheung, Bettina; Liu, Jingbei; Chen, Zheng; Scanley, B Ellen; Wesolowski, Donna; Pressley, Mariyah; Broadbridge, Christine C; Altman, Sidney; Schwarz, Udo D; Kyriakides, Themis R; Schroers, Jan

2016-05-27

Metallic alloys are normally composed of multiple constituent elements in order to achieve integration of a plurality of properties required in technological applications. However, conventional alloy development paradigm, by sequential trial-and-error approach, requires completely unrelated strategies to optimize compositions out of a vast phase space, making alloy development time consuming and labor intensive. Here, we challenge the conventional paradigm by proposing a combinatorial strategy that enables parallel screening of a multitude of alloys. Utilizing a typical metallic glass forming alloy system Zr-Cu-Al-Ag as an example, we demonstrate how glass formation and antibacterial activity, two unrelated properties, can be simultaneously characterized and the optimal composition can be efficiently identified. We found that in the Zr-Cu-Al-Ag alloy system fully glassy phase can be obtained in a wide compositional range by co-sputtering, and antibacterial activity is strongly dependent on alloy compositions. Our results indicate that antibacterial activity is sensitive to Cu and Ag while essentially remains unchanged within a wide range of Zr and Al. The proposed strategy not only facilitates development of high-performing alloys, but also provides a tool to unveil the composition dependence of properties in a highly parallel fashion, which helps the development of new materials by design.

Combinatorial development of antibacterial Zr-Cu-Al-Ag thin film metallic glasses

NASA Astrophysics Data System (ADS)

Liu, Yanhui; Padmanabhan, Jagannath; Cheung, Bettina; Liu, Jingbei; Chen, Zheng; Scanley, B. Ellen; Wesolowski, Donna; Pressley, Mariyah; Broadbridge, Christine C.; Altman, Sidney; Schwarz, Udo D.; Kyriakides, Themis R.; Schroers, Jan

2016-05-01

Metallic alloys are normally composed of multiple constituent elements in order to achieve integration of a plurality of properties required in technological applications. However, conventional alloy development paradigm, by sequential trial-and-error approach, requires completely unrelated strategies to optimize compositions out of a vast phase space, making alloy development time consuming and labor intensive. Here, we challenge the conventional paradigm by proposing a combinatorial strategy that enables parallel screening of a multitude of alloys. Utilizing a typical metallic glass forming alloy system Zr-Cu-Al-Ag as an example, we demonstrate how glass formation and antibacterial activity, two unrelated properties, can be simultaneously characterized and the optimal composition can be efficiently identified. We found that in the Zr-Cu-Al-Ag alloy system fully glassy phase can be obtained in a wide compositional range by co-sputtering, and antibacterial activity is strongly dependent on alloy compositions. Our results indicate that antibacterial activity is sensitive to Cu and Ag while essentially remains unchanged within a wide range of Zr and Al. The proposed strategy not only facilitates development of high-performing alloys, but also provides a tool to unveil the composition dependence of properties in a highly parallel fashion, which helps the development of new materials by design.

Combinatorial development of antibacterial Zr-Cu-Al-Ag thin film metallic glasses

PubMed Central

Liu, Yanhui; Padmanabhan, Jagannath; Cheung, Bettina; Liu, Jingbei; Chen, Zheng; Scanley, B. Ellen; Wesolowski, Donna; Pressley, Mariyah; Broadbridge, Christine C.; Altman, Sidney; Schwarz, Udo D.; Kyriakides, Themis R.; Schroers, Jan

2016-01-01

Metallic alloys are normally composed of multiple constituent elements in order to achieve integration of a plurality of properties required in technological applications. However, conventional alloy development paradigm, by sequential trial-and-error approach, requires completely unrelated strategies to optimize compositions out of a vast phase space, making alloy development time consuming and labor intensive. Here, we challenge the conventional paradigm by proposing a combinatorial strategy that enables parallel screening of a multitude of alloys. Utilizing a typical metallic glass forming alloy system Zr-Cu-Al-Ag as an example, we demonstrate how glass formation and antibacterial activity, two unrelated properties, can be simultaneously characterized and the optimal composition can be efficiently identified. We found that in the Zr-Cu-Al-Ag alloy system fully glassy phase can be obtained in a wide compositional range by co-sputtering, and antibacterial activity is strongly dependent on alloy compositions. Our results indicate that antibacterial activity is sensitive to Cu and Ag while essentially remains unchanged within a wide range of Zr and Al. The proposed strategy not only facilitates development of high-performing alloys, but also provides a tool to unveil the composition dependence of properties in a highly parallel fashion, which helps the development of new materials by design. PMID:27230692

Prediction of Phase Formation in Nanoscale Sn-Ag-Cu Solder Alloy

NASA Astrophysics Data System (ADS)

Wu, Min; Lv, Bailin

2016-01-01

In a dynamic nonequilibrium process, the effective heat of formation allows the heat of formation to be calculated as a function of concentrations of the reacting atoms. In this work, we used the effective heat of formation rule to predict the formation and size of compound phases in a nanoscale Sn-Ag-Cu lead-free solder. We calculated the formation enthalpy and effective formation enthalpy of compounds in the Sn-Ag, Sn-Cu, and Ag-Cu systems by using the Miedema model and effective heat of formation. Our results show that, considering the surface effect of the nanoparticle, the effective heat of formation rule successfully predicts the phase formation and sizes of Ag3Sn and Cu6Sn5 compounds, which agrees well with experimental data.

Microstructures and Properties of 40Cu/Ag(Invar) Composites Fabricated by Powder Metallurgy and Subsequent Thermo-Mechanical Treatment

NASA Astrophysics Data System (ADS)

Zhang, Xin; Huang, Yingqiu; Liu, Xiangyu; Yang, Lei; Shi, Changdong; Wu, Yucheng; Tang, Wenming

2018-03-01

Composites of 40Cu/Ag(Invar) were prepared via pressureless sintering and subsequent thermo-mechanical treatment from raw materials of electroless Ag-plated Invar alloy powder and electrolytic Cu powder. Microstructures and properties of the prepared composites were studied to evaluate the effect of the Ag layer on blocking Cu/Invar interfacial diffusion in the composites. The electroless-plated Ag layer was dense, uniform, continuous, and bonded tightly with the Invar alloy substrate. During sintering of the composites, the Ag layer effectively prevented Cu/Invar interfacial diffusion. During cold-rolling, the Ag layer was deformed uniformly with the Invar alloy particles. The composites exhibited bi-continuous network structure and considerably improved properties. After sintering at 775 °C and subsequent thermo-mechanical treatment, the 40Cu/Ag(Invar) composites showed satisfactory comprehensive properties: relative density of 99.0 pct, hardness of HV 253, thermal conductivity of 55.7 W/(m K), and coefficient of thermal expansion of 11.2 × 10-6/K.

Core-shell structure disclosed in self-assembled Cu-Ag nanoalloy particles

NASA Astrophysics Data System (ADS)

Tchaplyguine, M.; Andersson, T.; Zhang, Ch.; Björneholm, O.

2013-03-01

Core-shell segregation of copper and silver in self-assembled, free nanoparticles is established by means of photoelectron spectroscopy in a wide range of relative Cu-Ag concentrations. These conclusions are based on the analysis of the photon-energy-dependent changes of the Cu 3d and Ag 4d photoelectron spectra. The nanoparticles are formed from mixed Cu-Ag atomic vapor created by magnetron sputtering of a bimetallic sample in a gas-aggregation cluster source. Even at similar Cu and Ag fractions in the primary vapor the surface of the nanoparticles is dominated by silver. Only at low Ag concentration copper appears on the surface of nanoparticles. For the latter case, a threefold decrease in the Ag 4d spin-orbit splitting has been detected. The specific component distribution and electronic structure changes are discussed in connection with the earlier results on Cu-Ag macroscopic and surface alloys.

Physicochemical and antibacterial characterization of ionocity Ag/Cu powder nanoparticles

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nowak, A., E-mail: ana.maria.nowak@gmail.com; Silesian Center for Education and Interdisciplinary Research, 75 Pułku Piechoty 1A, 41-500 Chorzów; Szade, J.

Metal ion in bimetallic nanoparticles has shown vast potential in a variety of applications. In this paper we show the results of physical and chemical investigations of powder Ag/Cu nanoparticles obtained by chemical synthesis. Transmission electron microscopy (TEM) experiment indicated the presence of bimetallic nanoparticles in the agglomerated form. The average size of silver and copper nanoparticles is 17.1(4) nm (Ag) and 28.9(2) nm (Cu) basing on the X-ray diffraction (XRD) data. X-ray photoelectron (XPS) and Raman spectroscopies revealed the existence of metallic silver and copper as well as Cu{sub 2}O and CuO being a part of the nanoparticles. Moreover,more » UV–Vis spectroscopy showed surface alloy of Ag and Cu while Time of Flight Secondary Ion Mass Spectroscopy (ToF-SIMS) and Energy Dispersive X-ray Spectroscopy (EDX) showed heterogeneously distributed Ag structures placed on spherical Cu nanoparticles. The tests of antibacterial activity show promising killing/inhibiting growth behaviour for Gram positive and Gram negative bacteria. - Highlights: • Ag/Cu nanoparticles were obtained in the powder form. • The average size of nanoparticles is 17.1(4) nm (Ag) and 28.9(2) nm (Cu). • Ag/Cu powder nanoparticle shows promising antibacterial properties.« less

Electrodeposition and Characterization of Mn-Cu-Zn Alloys for Corrosion Protection Coating

NASA Astrophysics Data System (ADS)

Tsurtsumia, Gigla; Gogoli, David; Koiava, Nana; Kakhniashvili, Izolda; Jokhadze, Nunu; Lezhava, Tinatin; Nioradze, Nikoloz; Tatishvili, Dimitri

2017-12-01

Mn-Cu-Zn alloys were electrodeposited from sulphate bath, containing citrate or EDTA and their mixtures as complexing ligands. The influence of bath composition and deposition parameters on alloys composition, cathodic current efficiency and structural and electrochemical properties were studied. At a higher current density (≥ 37.5 A dm-2) a uniform surface deposit of Mn-Cu-Zn was obtained. Optimal pH of electrolyte (0.3 mol/dm3Mn2+ + 0.6 mol/dm3 (NH4)2SO4 +0.1 mol/dm3Zn2++0.005 mol/dm3 Cu2++ 0.05mol/dm3Na3Cit + 0.15mol/dm3 EDTA; t=300C; τ=20 min) for silvery, nonporous coating of Mn-Cu-Zn alloy was within 6.5-7.5; coating composition: 71-83% Mn, 6-7.8% Cu, 11.5-20% Zn, current efficiency up to 40%. XRD patterns revealed BCT (body centred tetragonal) γ-Mn solid phase solution (lattice constants a=2.68 Å c=3.59 Å). Corrosion measurements of deposited alloys were performed in aerated 3.5% NaCl solution. The corrosion current density (icorr) of the electrodeposited alloys on carbon steel was 10 times lower than corrosion rate of pure zinc and manganese coatings. Triple alloy coatings corrosion potential (Ecorr = -1140 mV vs. Ag/AgCl) preserved negative potential value longer (more than three months) compared to carbon steel substrate (Ecorr = -670 mV vs. Ag/AgCl). Tafel polarization curves taken on Mn-Cu-Zn alloy coating in aerated 3.5% NaCl solution did not show a typical passivation behaviour which can be explained by formation oflow solubility of adherent corrosion products on the alloy surface. Corrosion test of Mn-Cu-Zn electrocoating in chlorine environment shows that it is the best cathodic protective coating for a steel product.

Structure and properties during aging of an Al-Cu-Li-Ag-Mg alloy, Weldalite (tm) 049

NASA Technical Reports Server (NTRS)

Gayle, Frank W.; Heubaum, Frank H.; Pickens, Joseph R.

1991-01-01

An Al-Cu-Li-Ag-Mg alloy, Weldalite (trademark) 049, was recently introduced as an ultra-high strength alloy (7000 MPa yield strength in artificially aged tempers) with good weldability. In addition, the alloy exhibits an extraordinary natural aging response (440 MPa yield strength (YS) in the unstretch condition) and a high ductility reversion condition which may be useful as a cold-forming temper. In contrast to other Al-Li alloys, these properties can essentially be obtained with or without a stretch or other coldworking operation prior to aging. Preliminary studies have revealed that the T4 temper (no stretch, natural age) is strengthened by a combination of GP zones and delta prime (Al3Li). The T6 temper (no stretch, aged at 180 C to peak strength) was reported to be strengthened primarily by T(sub 1) phase (Al2CuLi) with a minor presence of a theta prime like (Al2Cu) phase. On the other hand, a similar but lower solute containing alloy was reported to contain omega, (stoichiometry unknown), theta prime, and S prime in the peak strength condition. The purpose of this study is to further elucidate the strengthening phases in Weldalite (trademark) 049 in the unstretched tempers, and to follow the development of the microstructure from the T4 temper through reversion (180 C for 5 to 45 minutes) to the T6 temper.

Ductility dip cracking susceptibility of Inconel Filler Metal 52 and Inconel Alloy 690

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kikel, J.M.; Parker, D.M.

1998-06-01

Alloy 690 and Filler Metal 52 have become the materials of choice for commercial nuclear steam generator applications in recent years. Filler Metal 52 exhibits improved resistance to weld solidification and weld-metal liquation cracking as compared to other nickel-based filler metals. However, recently published work indicates that Filler Metal 52 is susceptible to ductility dip cracking (DDC) in highly restrained applications. Susceptibility to fusion zone DDC was evaluated using the transverse varestraint test method, while heat affected zone (HAZ) DDC susceptibility was evaluated using a newly developed spot-on-spot varestraint test method. Alloy 690 and Filler Metal 52 cracking susceptibility wasmore » compared to the DDC susceptibility of Alloy 600, Filler Metal 52, and Filler Metal 625. In addition, the effect of grain size and orientation on cracking susceptibility was also included in this study. Alloy 690, Filler Metal 82, Filler Metal 52, and Filler Metal 625 were found more susceptible to fusion zone DDC than Alloy 600. Filler Metal 52 and Alloy 690 were found more susceptible to HAZ DDC when compared to wrought Alloy 600, Filler Metal 82 and Filler Metal 625. Filler Metal 52 exhibited the greatest susceptibility to HAZ DDC of all the weld metals evaluated. The base materials were found much more resistant to HAZ DDC in the wrought condition than when autogenously welded. A smaller grain size was found to offer greater resistance to DDC. For weld metal where grain size is difficult to control, a change in grain orientation was found to improve resistance to DDC.« less

Development of Ag-Pd-Au-Cu alloy for multiple dental applications. Part 1. Effects of Pd and Cu contents, and addition of Ga or Sn on physical properties and bond with ultra-low fusing ceramic.

PubMed

Goto, S; Miyagawa, Y; Ogura, H

2000-09-01

Ag-Pd-Au-Cu quaternary alloys consisting of 30-50% Ag, 20-40% Pd, 10-20% Cu and 20% Au (mother alloys) were prepared. Then 5% Sn or 5% Ga was added to the mother alloy compositions, and another two alloy systems (Sn-added alloys and Ga-added alloys) were also prepared. The bond between the prepared alloys and an ultra-low fusing ceramic as well as their physical properties such as the solidus point, liquidus point and the coefficient of thermal expansion were evaluated. The solidus point and liquidus point of the prepared alloys ranged from 802 degrees C to 1142 degrees C and from 931 degrees C to 1223 degrees C, respectively. The coefficient of thermal expansion ranged from 14.6 to 17.1 x 10(-6)/degrees C for the Sn- and Ga-added alloys. In most cases, the Pd and Cu contents significantly influenced the solidus point, liquidus point and coefficient of thermal expansion. All Sn- and Ga-added alloys showed high area fractions of retained ceramic (92.1-100%), while the mother alloy showed relatively low area fractions (82.3%) with a high standard deviation (20.5%). Based on the evaluated properties, six Sn-added alloys and four Ga-added alloys among the prepared alloys were suitable for the application of the tested ultra-low fusing ceramic.

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yang, Ming

Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientationmore » evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.« less

Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

NASA Astrophysics Data System (ADS)

Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

2017-07-01

Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (<60-75 μm) strongly impact the reliability and provoke crack initiation around the defect where the highest ISA is located. In particular, similar TC performance can be expected for defect-free joints and for those whose defects exceed the threshold distance from the lead (>60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

Filler wire for aluminum alloys and method of welding

NASA Technical Reports Server (NTRS)

Bjorkman, Jr., Gerald W. O. (Inventor); Cho, Alex (Inventor); Russell, Carolyn K. (Inventor)

2003-01-01

A weld filler wire chemistry has been developed for fusion welding 2195 aluminum-lithium. The weld filler wire chemistry is an aluminum-copper based alloy containing high additions of titanium and zirconium. The additions of titanium and zirconium reduce the crack susceptibility of aluminum alloy welds while producing good weld mechanical properties. The addition of silver further improves the weld properties of the weld filler wire. The reduced weld crack susceptibility enhances the repair weldability, including when planishing is required.

Structure and properties during aging of an ultra-high strength Al-Cu-Li-Ag-Mg alloy

NASA Technical Reports Server (NTRS)

Gayle, Frank W.; Heubaum, Frank H.; Pickens, Joseph R.

1990-01-01

The structure and properties of the strengthening phases formed during aging in an Al-Cu-Li-Ag-Mg alloy (Weldalite 049) were elulcidated, by following the development of the microstructure by means of TEM. The results of observations showed that the Weldalite 049 alloy has a series of unusual and technologically useful combinations of mechanical properties in different aging conditions, such as natural aging without prior cold work to produce high strengths, a reversion temper of lower yield strength and unusually high ductility, a room temperature reaging of the reversion temper eventually leading to the original T4 hardness, and ultrahigh-strength T6 properties.

Mechanical characterization and modeling of brazed tungsten and Cu-Cr-Zr alloy using stress relief interlayers

NASA Astrophysics Data System (ADS)

Qu, Dandan; Zhou, Zhangjian; Yum, Youngjin; Aktaa, Jarir

2014-12-01

A rapidly solidified foil-type Ti-Zr based amorphous filler with a melting temperature of 850 °C was used to braze tungsten to Cu-Cr-Zr alloy for water cooled divertors and plasma facing components application. Brazed joints of dissimilar materials suffer from a mismatch in coefficients of thermal expansion. In order to release the residual stress caused by the mismatch, brazed joints of tungsten and Cu-Cr-Zr alloy using different interlayers were studied. The shear strength tests of brazed W/Cu joints show that the average strength of the joint with a W70Cu30 composite plate interlayer reached 119.8 MPa, and the average strength of the joint with oxygen free high conductivity copper (OFHC Cu)/Mo multi-interlayers reached 140.8 MPa, while the joint without interlayer was only 16.6 MPa. Finite element method (FEM) has been performed to investigate the stress distribution and effect of stress relief interlayers. FEM results show that the maximum von Mises stress occurs in the tungsten/filler interface and that the filler suffers the peak residual stresses and becomes the weakest zone. And the use of OFHC Cu/Mo multi-interlayers can reduce the residual stress significantly, which agrees with the mechanical experiment data.

Vacuum Brazing TC4 Titanium Alloy to 304 Stainless Steel with Cu-Ti-Ni-Zr-V Amorphous Alloy Foil

NASA Astrophysics Data System (ADS)

Dong, Honggang; Yang, Zhonglin; Wang, Zengrui; Deng, Dewei; Dong, Chuang

2014-10-01

Dissimilar metal vacuum brazing between TC4 titanium alloy and 304 stainless steel was conducted with newly designed Cu-Ti-Ni-Zr-V amorphous alloy foils as filler metals. Solid joints were obtained due to excellent compatibility between the filler metal and stainless steel substrate. Partial dissolution of stainless steel substrate occurred during brazing. The shear strength of the joint brazed with Cu43.75Ti37.5Ni6.25Zr6.25V6.25 foil was 105 MPa and that with Cu37.5Ti25Ni12.5Zr12.5V12.5 was 116 MPa. All the joints fractured through the gray layer in the brazed seam, revealing brittle fracture features. Cr4Ti, Cu0.8FeTi, Fe8TiZr3 and Al2NiTi3C compounds were found in the fractured joint brazed with Cu43.75Ti37.5Ni6.25Zr6.25V6.25 foil, and Fe2Ti, TiCu, Fe8TiZr3 and NiTi0.8Zr0.3 compounds were detected in the joint brazed with Cu37.5Ti25Ni12.5Zr12.5V12.5 foil. The existence of Cr-Ti, Fe-Ti, Cu-Fe-Ti, and Fe-Ti-V intermetallic compounds in the brazed seam caused fracture of the resultant joints.

Structure of aging Al-Li-Cu-Zr-Sc-Ag alloy after severe plastic deformation and long-term storage

NASA Astrophysics Data System (ADS)

Kaigorodova, L. I.; Rasposienko, D. Yu.; Pushin, V. G.; Pilyugin, V. P.; Smirnov, S. V.

2015-11-01

Structural and phase transformations in commercial aging aluminum-lithium Al-1.2 Li-3.2 Cu-0.09 Zr-0.11 Sc-0.4 Ag-0.3 Mg alloy have been studied after severe plastic deformation by high-pressure torsion (at a pressure of 4 GPa with 1, 5, and 10 revolutions of the anvil) and natural aging (roomtemperature storage) for 1 week and 2 years. It has been found that, in this case, the process of static recrystallization is achieved in the alloy, the degree of which increases with an increasing degree of deformation and time of storage.

Adsorption heights and bonding strength of organic molecules on a Pb-Ag surface alloy

NASA Astrophysics Data System (ADS)

Stadtmüller, Benjamin; Haag, Norman; Seidel, Johannes; van Straaten, Gerben; Franke, Markus; Kumpf, Christian; Cinchetti, Mirko; Aeschlimann, Martin

2016-12-01

The understanding of the fundamental geometric and electronic properties of metal-organic hybrid interfaces is a key issue on the way to improving the performance of organic electronic and spintronic devices. Here, we studied the adsorption heights of copper-II-phthalocyanine (CuPc) and 3,4,9,10-perylene-tetracarboxylic-dianhydride (PTCDA) on a Pb1Ag2 surface alloy on Ag(111) using the normal-incidence x-ray standing waves technique. We find a significantly larger adsorption height of both molecules on the Pb-Ag surface alloy compared to the bare Ag(111) surface which is caused by the larger size of Pb. This increased adsorption height suppresses the partial chemical interaction of both molecules with Ag surface atoms. Instead, CuPc and PTCDA molecules bond only to the Pb atoms with different interaction strength ranging from a van der Waals-like interaction for CuPc to a weak chemical interaction with additional local bonds for PTCDA. The different adsorption heights for CuPc and PTCDA on Pb1Ag2 are the result of local site-specific molecule-surface bonds mediated by functional molecular groups and the different charge donating and accepting character of CuPc and PTCDA.

Ultrasonic-assisted soldering of Cu/Ti joints

NASA Astrophysics Data System (ADS)

Cui, Wei; Wang, Chunyu; Li, Yuhang; Zhong, Tongtong; Yang, Jianguo; Bao, Yefeng

2018-03-01

Cu/Ti joints are expected to be used in various applications, while reliable joining method is still to be developed. It is commonly not possible to solder Ti alloys using Sn-based solder alloys because of their poor wettability. In this study, Sn-Ag-Cu soldering filler metal was used to joining TC4 titanium alloy and pure copper using ultrasonic-assisted soldering. The influence of different temperature and different ultrasonic time on the welded joint is studied and explored. Microstructure of the joints was investigated. Shear strength of the joints reached the maximum value, i.e. 38.2MPa. Relationship between the sonication parameters and the microstructure and strength of the joints was discussed. Thus, it is verified that dissimilar metal brazing of TC4 and copper is suitable for low temperature soldering.

Properties of ternary Sn-Ag-Bi solder alloys. Part 2: Wettability and mechanical properties analyses

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vianco, P.T.; Rejent, J.A.

1999-10-01

Bismuth additions of 1% to 10% were made to the 96.5Sn-3.5Ag (wt.%) alloy in a study to develop a Sn-Ag-Bi ternary composition. Thermal properties and microstructural analyses of selected alloy compositions were reported in Part 1. Wettability and mechanical properties are described in this paper. Contact angle measurements demonstrated that Bi additions improved wetting/spreading performance on Cu; a minimum contact angle of 31 {+-} 4{degree} was observed with 4.83 wt.% Bi addition. Increasing the Bi content of the ternary alloy raised the Cu/solder/Cu solder joint shear strength to 81 MPa as determined by the ring-and-plug tests. TEM analysis of themore » 91.84Sn-3.33Ag-4.83Bi composition presented in Part 1 indicated that the strength improvement was attributed to solid-solution and precipitation strengthening effects by the Bi addition residing in the Sn-rich phase. Microhardness measurements of the Sn-Ag-Bi alloy, as a function of Bi content, reached maximum values of 30 (Knoop, 50 g) and 110 (Knoop, 5g) for Bi contents greater than approximately 4--5 wt.%.« less

Mechanical, structural and thermal properties of Ag-Cu and ZnO reinforced polylactide nanocomposite films.

PubMed

Ahmed, Jasim; Arfat, Yasir Ali; Castro-Aguirre, Edgar; Auras, Rafael

2016-05-01

Plasticized polylactic acid (PLA) based nanocomposite films were prepared by incorporating polyethylene glycol (PEG) and two selected nanoparticles (NPs) [silver-copper (Ag-Cu) alloy (<100 nm) and zinc oxide (ZnO) (<50 and <100 nm)] through solvent casting method. Incorporation of Ag-Cu alloy into the PLA/PEG matrix increased the glass transition temperature (Tg) significantly. The crystallinity of the nanocomposites (NCs) was significantly influenced by NP incorporation as evidenced from differential scanning calorimetry (DSC) and X-ray diffraction (XRD) analysis. The PLA nanocomposite reinforced with NPs exhibited much higher tensile strength than that of PLA/PEG blend. Melt rheology of NCs exhibited a shear-thinning behavior. The mechanical property drastically reduced with a loading of NPs, which is associated with degradation of PLA. SEM micrographs exhibited that both Ag-Cu alloy and ZnO NPs were dispersed well in the PLA film matrix. Copyright © 2016 Elsevier B.V. All rights reserved.

Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition

NASA Astrophysics Data System (ADS)

Kao, Szu-Tsung; Lin, Yung-Chi; Duh, Jenq-Gong

2006-03-01

Nanosized Cu6Sn5 dispersoids were incorporated into Sn and Ag powders and milled together to form Sn-3Ag-0.5Cu composite solders by a mechanical alloying process. The aim of this study was to investigate the interfacial reaction between SnAgCu composite solder and electroless Ni-P/Cu UBM after heating for 15 min. at 240°C. The growth of the IMCs formed at the composite solder/EN interface was retarded as compared to the commercial Sn3Ag0.5Cu solder joints. With the aid of the elemental distribution by x-ray color mapping in electron probe microanalysis (EPMA), it was revealed that the SnAgCu composite solder exhibited a refined structure. It is proposed that the Cu6Sn5 additives were pinned on the grain boundary of Sn after heat treatment, which thus retarded the movement of Cu toward the solder/EN interface to form interfacial compounds. In addition, wetting is an essential prerequisite for soldering to ensure good bonding between solder and substrate. It was demonstrated that the contact angles of composite solder paste was <25°, and good wettability was thus assured.

Effect of La2O3 Nanoparticles on the Brazeability, Microstructure, and Mechanical Properties of Al-11Si-20Cu Alloy

NASA Astrophysics Data System (ADS)

Sharma, Ashutosh; Roh, Myung Hwan; Jung, Jae Pil

2016-08-01

The Al-11Si-20Cu brazing alloy and its ex situ composite with the content ranging from 0.01 to 0.05 wt.% of La2O3 are produced by electromagnetic induction-cum-casting route. The brazeability of the alloy and composite samples are tested using the spreading technique according to JIS Z-3197 standard. The mechanical properties such as filler microhardness, tensile shear strength, and elongation of the brazed joints are evaluated in the as-brazed condition. It is reported that incorporation of an optimal amount of 0.05 wt.% of hard La2O3 nanoparticles in the Al-Si-Cu matrix inhibits the growth of the large CuAl2 intermetallic compounds (IMCs) and Si particles. As a consequence, the composite filler brazeability, microhardness, joint tensile shear strength, and elongation are improved significantly compared to those of monolithic Al-11Si-20Cu alloy.

RRR and thermal conductivity of Ag and Ag0.2wt%Mg alloy in Ag/Bi-2212 wires

DOE Office of Scientific and Technical Information (OSTI.GOV)

Li, Pei; Ye, L.; Jiang. J., Jiang. J.

The residual resistivity ratio (RRR) and thermal conductivity of metal matrix in metal/superconductor composite wires are important parameters for designing superconducting magnets. However, the resistivity of silver in reacted Ag/Bi-2212 wires has yet to be determined over temperature range from 4.2 K to 80 K because Bi-2212 filaments have a critical transition temperature Tc of ~ 80 K, and because it is unknown whether the RRR of Ag/Bi-2212 degrades with Cu diffusing from Bi-2212 filaments into silver sheathes at elevated temperatures and to what degree it varies with heat treatment. We measured the resistivity of stand-alone Ag and AgMg (Ag-0.2wt%Mg)more » wires as well as the resistivity of Ag and Ag- 0.2wt%Mg in the state-of-the-art Ag/Bi-2212 round wires reacted in 1 bar oxygen at 890 °C for 1, 8, 24 and 48 hours and quickly cooled to room temperature. The heat treatment was designed to reduce the critical current Ic of Bi-2212 wires to nearly zero while allowing Cu loss to fully manifest itself. We determined that pure silver exhibits a RRR of ~ 220 while the oxide-dispersion strengthened AgMg exhibits a RRR of ~ 5 in stand-alone samples. A surprising result is that the RRR of silver in the composite round wires doesn’t degrade with extended time at 890 °C for up to 48 hours. This surprising result may be explained by our observation that the Cu that diffuses into the silver tends to form Cu2O precipitates in oxidizing atmosphere, instead of forming Ag-Cu solution alloy. We also measured the thermal conductivity and the magneto-resistivity of pure Ag and Ag-0.2 wt%Mg from 4.2 K to 300 K in magnetic fields up to 14.8 T and summarized them using a Kohler plot.« less

An Electrochemical Framework to Explain Intergranular Stress Corrosion Cracking in an Al-5.4%Cu-0.5%Mg-0.5%Ag Alloy

NASA Technical Reports Server (NTRS)

Little, D. A.; Connolly, B. J.; Scully, J. R.

2001-01-01

A modified version of the Cu-depletion electrochemical framework was used to explain the metallurgical factor creating intergranular stress corrosion cracking susceptibility in an aged Al-Cu-Mg-Ag alloy, C416. This framework was also used to explain the increased resistance to intergranular stress corrosion cracking in the overaged temper. Susceptibility in the under aged and T8 condition is consistent with the grain boundary Cu-depletion mechanism. Improvements in resistance of the T8+ thermal exposure of 5000 h at 225 F (T8+) compared to the T8 condition can be explained by depletion of Cu from solid solution.

Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu- xBi Melting on Cu Substrates

NASA Astrophysics Data System (ADS)

Xu, Bingsheng; Chen, Junwei; Yuan, Zhangfu; Zang, Likun; Zhang, Lina; Wu, Yan

2016-05-01

The effects of Bi addition on the properties of Sn-3.0Ag-0.5Cu molten alloy on Cu substrates are discussed using wettability and interface microstructure analysis. The changes of the contact angles between Sn-3.0Ag-0.5Cu- xBi and Cu substrates with the spreading time are described by Dezellus model. It indicates that the spreading process is governed by the interfacial reaction during the dwelling time. The interface microstructure is observed to clarify the effects of reactions on the spreading behavior. It is found that Cu6Sn5 is formed adjacent to the solder and Cu3Sn appears over the substrate with Bi added at 613K, indicating that Bi exists between the intermetallics and the addition of Bi can hinder the diffusion of copper towards the interior of the solder. Therefore the existence of Bi decreases the agglomeration of Cu-Sn grains. The growth of intermetallics is thus limited and the shape of intermetallics transforms from scallop to zigzag consequently. However, the segregation phenomenon appears when the additive amount of Bi is more than 5.5mass %, which could lead to the occurrence of fracture and degrade the performance of Sn-3.0Ag-0.5Cu- xBi alloy. The results of the present study provide basic physical and chemical data for the application of lead-free solder in the future microgravity space environment.

The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

NASA Astrophysics Data System (ADS)

Liu, Weiping; Lee, Ning-Cheng

2007-07-01

The impact reliability of solder joints in electronic packages is critical to the lifetime of electronic products, especially those portable devices using area array packages such as ball-grid array (BGA) and chip-scale packages (CSP). Currently, SnAgCu (SAC) solders are most widely used for lead-free applications. However, BGA and CSP solder joints using SAC alloys are fragile and prone to premature interfacial failure, especially under shock loading. To further enhance impact reliability, a family of SAC alloys doped with a small amount of additives such as Mn, Ce, Ti, Bi, and Y was developed. The effects of doping elements on drop test performance, creep resistance, and microstructure of the solder joints were investigated, and the solder joints made with the modified alloys exhibited significantly higher impact reliability.

Synthesis of Ag-Cu-Pd alloy thin films by DC-magnetron sputtering: Case study on microstructures and optical properties

NASA Astrophysics Data System (ADS)

Rezaee, Sahar; Ghobadi, Nader

2018-06-01

The present study aims to investigate optical properties of Ag-Cu-Pd alloy thin films synthesized by DC-magnetron sputtering method. The thin films are deposited on the glass and silicon substrates using Argon gas and Ag-Cu-Pd target. XRD analysis confirms the successful growth of Ag, Cu, and Pd NPs with FCC crystalline structure. Moreover, UV-visible absorption spectroscopy is applied to determine optical properties of the prepared samples which are affected by changes in surface morphology. The existence of single surface plasmon resonance (SPR) peak near 350 nm proves the formation of silver nanoparticles with a slight red shift through increasing deposition time. Ineffective thickness method (ITM) and Derivation of ineffective thickness method (DITM) are applied to extract optical band gap and transition type via absorption spectrum. SEM and AFM analyses show the distribution of near-spherical nanoparticles covering the surface of thin films. Furthermore, thickness variation affects the grain size. In addition, TEM image reveals the uniform size distribution of nanoparticles with an average particle size of about 15 nm. The findings show that increasing grain size and crystallite order along with the decrease of structural defect and disorders decrease optical band gap from 3.86 eV to 2.58 eV.

Structure and photoelectrochemistry of silver-copper-indium-diselenide ((AgCu)InSe2) thin film

NASA Astrophysics Data System (ADS)

Zhang, Lin Rui; Li, Tong; Wang, Hao; Pang, Wei; Chen, Yi Chuan; Song, Xue Mei; Zhang, Yong Zhe; Yan, Hui

2018-02-01

In this work, silver (Ag) precursors with different thicknesses were sputtered on the surfaces of CuIn alloys, and (AgCu)InSe2 (ACIS) films were formed after selenization at 550 °C under nitrogen condition using a rapid thermal process furnace. The structure and electrical properties of the ACIS films were investigated. The result showed that the distribution of Ag+ ion was more uniform with increasing the thickness of Ag precursor, and the surface of the thin-film became more homogeneous and denser. When Ag/Cu ratio ≥0.249, the small grain particles disappeared. The band gap can be rationally controlled by adjusting Ag content. When (Ag + Cu)/In ratio ≥ 1.15, the surface of the ACIS thin-film mainly exhibited n-type semiconductor. Through the photoelectrochemistry measurement, it was observed that the incorporation of Ag+ ions could improve photocurrent by adjusting the band gap. With the Ag precursor thickness increased, the dark current decreased at the more negative potential.

Structure formation in Ag-X (X = Au, Cu) alloys synthesized far-from-equilibrium

NASA Astrophysics Data System (ADS)

Elofsson, V.; Almyras, G. A.; Lü, B.; Garbrecht, M.; Boyd, R. D.; Sarakinos, K.

2018-04-01

We employ sub-monolayer, pulsed Ag and Au vapor fluxes, along with deterministic growth simulations, and nanoscale probes to study structure formation in miscible Ag-Au films synthesized under far-from-equilibrium conditions. Our results show that nanoscale atomic arrangement is primarily determined by roughness build up at the film growth front, whereby larger roughness leads to increased intermixing between Ag and Au. These findings suggest a different structure formation pathway as compared to the immiscible Ag-Cu system for which the present study, in combination with previously published data, reveals that no significant roughness is developed, and the local atomic structure is predominantly determined by the tendency of Ag and Cu to phase-separate.

Reference Data for the Density, Viscosity, and Surface Tension of Liquid Al-Zn, Ag-Sn, Bi-Sn, Cu-Sn, and Sn-Zn Eutectic Alloys

NASA Astrophysics Data System (ADS)

Dobosz, Alexandra; Gancarz, Tomasz

2018-03-01

The data for the physicochemical properties viscosity, density, and surface tension obtained by different experimental techniques have been analyzed for liquid Al-Zn, Ag-Sn, Bi-Sn, Cu-Sn, and Sn-Zn eutectic alloys. All experimental data sets have been categorized and described by the year of publication, the technique used to obtain the data, the purity of the samples and their compositions, the quoted uncertainty, the number of data in the data set, the form of data, and the temperature range. The proposed standard deviations of liquid eutectic Al-Zn, Ag-Sn, Bi-Sn, Cu-Sn, and Sn-Zn alloys are 0.8%, 0.1%, 0.5%, 0.2%, and 0.1% for the density, 8.7%, 4.1%, 3.6%, 5.1%, and 4.0% for viscosity, and 1.0%, 0.5%, 0.3%, N/A, and 0.4% for surface tension, respectively, at a confidence level of 95%.

B218 Weld Filler Wire Characterization for Al-Li Alloy 2195

NASA Technical Reports Server (NTRS)

Bjorkman, Gerry; Russell, Carolyn

2000-01-01

NASA Marshall Space Flight Center, Lockheed Martin Space Systems- Michoud Operations, and McCook Metals have developed an aluminum-copper weld filler wire for fusion welding aluminum lithium alloy 2195. The aluminum-copper based weld filler wire has been identified as B218, a McCook Metals designation. B218 is the result of six years of weld filler wire development funded by NASA, Lockheed Martin, and McCook Metals. The filler wire chemistry was developed to produce enhanced 2195 weld and repair weld mechanical properties over the 4043 aluminum-silicon weld filler wire, which is currently used to weld 2195 on the Super Lightweight External Tank for the NASA Space Shuttle Program. An initial characterization was performed consisting of a repair weld evaluation using B218 and 4043 weld filler wires. The testing involved room temperature and cryogenic repair weld tensile testing along with fracture toughness testing. From the testing, B218 weld filler wire produce enhanced repair weld tensile strength, ductility, and fracture properties over 4043. B218 weld filler wire has proved to be a superior weld filler wire for welding aluminum lithium alloy 2195 over 4043.

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

NASA Astrophysics Data System (ADS)

Hammad, A. E.; El-Taher, A. M.

2014-11-01

The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

Nanoindentation on SnAgCu lead-free solder joints and analysis

NASA Astrophysics Data System (ADS)

Xu, Luhua; Pang, John H. L.

2006-12-01

The lead-free SnAgCu (SAC) solder joint on copper pad with organic solderability preservative (Cu-OSP) and electroless nickel and immersion gold (ENIG) subjected to thermal testing leads to intermetallic growth. It causes corresponding reliability concerns at the interface. Nanoindentation characterization on SnAgCu solder alloy, intermetallic compounds (IMCs), and the substrates subjected to thermal aging is reported. The modulus and hardness of thin IMC layers were measured by nanoindentation continuous stiffness measurement (CSM) from planar IMC surface. When SAC/Ni(Au) solder joints were subject to thermal aging, the Young’s modulus of the NiCuSn IMC at the SAC/ENIG specimen changed from 207 GPa to 146 GPa with different aging times up to 500 h. The hardness decreased from 10.0 GPa to 7.3 GPa. For the SAC/Cu-OSP reaction couple, the Young’s modulus of Cu6Sn5 stayed constant at 97.0 GPa and hardness about 5.7 GPa. Electron-probe microanalysis (EPMA) was used to thermal aging. The creep effect on the measured result was analyzed when measuring SnAgCu solder; it was found that the indentation penetration, and thus the hardness, is loading rate dependent. With the proposed constant P/P experiment, a constant indentation strain rate h/h and hardness could be achieved. The log-log plot of indentation strain rate versus hardness for the data from the constant P/P experiments yields a slope of 7.52. With the optimized test method and CSM Technique, the Modulus of SAC387 solder alloy and all the layers in a solder joint were investigated.

Microstructural evolution and mechanical properties of SnAgCu alloys

NASA Astrophysics Data System (ADS)

Fouassier, O.; Heintz, J.-M.; Chazelas, J.; Geffroy, P.-M.; Silvain, J.-F.

2006-08-01

Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from -50to+150°C, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations.

The Apparent Contact Angle and Wetted Area of Active Alloys on Silicon Carbide as a Function of the Temperature and the Surface Roughness: A Multivariate Approach

NASA Astrophysics Data System (ADS)

Tillmann, Wolfgang; Pfeiffer, Jan; Wojarski, Lukas

2015-08-01

Despite the broad field of applications for active filler alloys for brazing ceramics, as well as intense research work on the wetting and spreading behavior of these alloys on ceramic surfaces within the last decades, the manufactured joints still exhibit significant variations in their properties due to the high sensitivity of the alloys to changing brazing conditions. This increases the need for investigations of the wetting and spreading behavior of filler alloys with regard to the dominating influences combined with their interdependencies, instead of solely focusing on single parameter investigations. In this regard, measurements of the wetting angle and area were conducted at solidified AgCuTi and CuSnTi alloys on SiC substrates. Based on these measurements, a regression model was generated, illustrating the influence of the brazing temperature, the roughness of the faying surfaces, the furnace atmosphere, and their interdependencies on the wetting and spreading behavior of the filler alloys. It was revealed that the behavior of the melts was significantly influenced by the varied brazing parameters, as well as by their interdependencies. This result was also predicted by the developed model and showed a high accuracy.

Effect of Ag additions on the lengthening rate of Ω plates and formation of σ phase in Al-Cu-Mg alloys during thermal exposure

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhou, Yaru; Liu, Zhiyi, E-mail: liuzhiyi@csu.edu.c

Effect of Ag additions on the mechanical properties and microstructures of the peak-aged Al-Cu-Mg alloys during prolonged thermal exposure at 150 °C, was investigated by tensile testing, conventional transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM). The results showed that after exposure for 500 h, > 85% of the peak strength remained. Microstructure observations indicated that increasing the Ag content from 0.14 to 0.57% promoted the precipitation of a fine and uniform Ω phase and suppressed the formation of the θ′ phase, leading to a notable improvement of the strength properties and thermal stability of the studied alloys.more » Quantitative TEM analysis showed that the coarsening of Ω phase was predominated by plate lengthening rather than thickening, while its lengthening rate was independent of various Ag additions during exposure at 150 °C. In addition, an increase of Ag also facilitated the formation of a cubic σ phase, which was further supported by STEM results. - Highlights: •Increasing Ag improved strength properties and thermal stability of the alloys. •After exposure for 500 h, > 85% of the peak strength remained. •The lengthening rate of Ω plates remained constant as Ag increased at 150 °C. •Increasing Ag content facilitated the formation of σ phase.« less

Synthesis and thermal behavior of tin-based alloy (Sn-Ag-Cu) nanoparticles

NASA Astrophysics Data System (ADS)

Roshanghias, Ali; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

2015-03-01

The prominent melting point depression of nanoparticles has been the subject of a considerable amount of research. For their promising applications in electronics, tin-based nano-alloys such as near-eutectic Sn-Ag-Cu (SAC) alloys have been synthesized via various techniques. However, due to issues such as particle aggregation and oxidation or introduced impurities, the application of these nano-size particles has been confined or aborted. For instance, thermal investigations by DTA/DSC in a large number of studies revealed exothermic peaks in the range of 240-500 °C, i.e. above the melting point of SAC nanoparticles, with different and quite controversial explanations for this unclear phenomenon. This represents a considerable drawback for the application of nanoparticles. Correspondingly, in the current study, the thermal stability of SAC nanoparticles has been investigated via electron microscopy, XRD, FTIR, and DSC/TG analysis. It was found that the nanoparticles consist mainly of a metallic β-Sn core and an amorphous tin hydroxide shell structure. The SnO crystalline phase formation from this amorphous shell has been associated with the exothermic peaks on the first heating cycle of the nanoparticles, followed by a disproportionation reaction into metallic Sn and SnO2.The results also revealed that the surfactant and reducing agent cannot only affect the size and size distribution of the nanoparticles, they might also alter the ratio between the amorphous shell and the crystalline core in the structure of particles.The prominent melting point depression of nanoparticles has been the subject of a considerable amount of research. For their promising applications in electronics, tin-based nano-alloys such as near-eutectic Sn-Ag-Cu (SAC) alloys have been synthesized via various techniques. However, due to issues such as particle aggregation and oxidation or introduced impurities, the application of these nano-size particles has been confined or aborted. For

Effect of a prior stretch on the aging response of an Al-Cu-Li-Ag-Mg-Zr alloy

NASA Technical Reports Server (NTRS)

Kumar, K. S.; Brown, S. A.; Pickens, J. R.

1990-01-01

The effect of a prior stretching of an aluminum alloy Al-5.3Cu-1.4Li-0.4Ag-0.4Mg-0.17Zr (in wt pct) on the microstructure that develops during aging of this alloy was investigated by comparing TEM and SAD observations and hardness curves with results for the unstretched alloy. The results suggest that stretching introduces a significant number of dislocations which may act as vacanacy sinks by sweeping vacancies away and thereby decreasing the vacancy concentration available for influencing the natural aging response. In the stretched and near-peak aged condition, a fine homogeneous distribution of T1, theta-prime, and S-prime phases were observed in an alpha solid solution matrix. Upon overaging, virtually all of the theta-prime and most of the S-prime phases were found to dissolve, leaving behind a microstructure of T1 precipitates.

The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

NASA Astrophysics Data System (ADS)

Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi

2014-11-01

In this study, the performance of three microalloyed Sn-Ag-Cu solder interconnection compositions (Sn-3.1Ag-0.52Cu, Sn-3.0Ag-0.52Cu-0.24Bi, and Sn-1.1Ag-0.52Cu-0.1Ni) was compared under mechanical shock loading (JESD22-B111 standard) and cyclic thermal loading (40 ± 125°C, 42 min cycle) conditions. In the drop tests, the component boards with the low-silver nickel-containing composition (Sn-Ag-Cu-Ni) showed the highest average number of drops-to-failure, while those with the bismuth-containing alloy (Sn-Ag-Cu-Bi) showed the lowest. Results of the thermal cycling tests showed that boards with Sn-Ag-Cu-Bi interconnections performed the best, while those with Sn-Ag-Cu-Ni performed the worst. Sn-Ag-Cu was placed in the middle in both tests. In this paper, we demonstrate that solder strength is an essential reliability factor and that higher strength can be beneficial for thermal cycling reliability but detrimental to drop reliability. We discuss these findings from the perspective of the microstructures and mechanical properties of the three solder interconnection compositions and, based on a comprehensive literature review, investigate how the differences in the solder compositions influence the mechanical properties of the interconnections and discuss how the differences are reflected in the failure mechanisms under both loading conditions.

On the effect of stress on nucleation and growth of precipitates in an Al-Cu-Mg-Ag alloy

NASA Astrophysics Data System (ADS)

Skrotzki, B.; Shiflet, G. J.; Starke, E. A.

1996-11-01

A study has been made of the effect of an externally applied tensile stress on Ω and Θ' precipitate nucleation and growth in an Al-Cu-Mg-Ag alloy and a binary Al-Cu alloy which was used as a model system. Both solutionized and solutionized and aged conditions were studied. The mechanical properties have been measured and the microstructures have been characterized by transmission electron microscopy (TEM). The volume fraction and number density, as well as the precipitate size, have been experimentally determined. It was found that for as-solutionized samples aged under stress, precipitation occurs preferentially parallel to the stress axis. A threshold stress has to be exceeded before this effect can be observed. The critical stress for influencing the precipitate habit plane is between 120 and 140 MPa for Ω and between 16 and 19 MPa for Θ' for the aging temperature of 160 °C. The major effect of the applied stress is on the nucleation process. The results are discussed in terms of the role of the lattice misfit between the matrix and the precipitate nucleus.

Structure and mechanical properties of aging Al-Li-Cu-Zr-Sc-Ag alloy after severe plastic deformation by high-pressure torsion

NASA Astrophysics Data System (ADS)

Kaigorodova, L. I.; Rasposienko, D. Yu.; Pushin, V. G.; Pilyugin, V. P.; Smirnov, S. V.

2015-04-01

The structural and phase transformations have been studied in aging commercial aluminum-lithium alloy Al-1.2 Li-3.2 Cu-0.09 Zr-0.11 Sc-0.4 Ag-0.3 Mg in the as-delivered state and after severe plastic deformation by torsion for 1, 5 and 10 revolutions under a high pressure of 4 GPa. Deformation-induced nanofragmentation and dynamic recrystallization have been found to occur in the alloy. The degree of recrystallization increases with deformation. Nanofragmentation and recrystallization processes are accompanied by the deformation-induced decomposition of solid solution and changes in both the nucleation mechanism of precipitation and the phase composition of the alloy. The influence of a nanostructured nanophase state of the alloy on its mechanical properties (microhardness, plasticity, elastic modulus, and stiffness) is discussed.

Simulation of Zr content in TiZrCuNi brazing filler metal for Ti6Al4V alloy

NASA Astrophysics Data System (ADS)

Yue, Xishan; Xie, Zonghong; Jing, Yongjuan

2017-07-01

To optimize the Zr content in Ti-based filler metal, the covalent electron on the nearest atoms bond in unit cell ( n A u-v ) with Ti-based BCC structure was calculated, in which the brazing temperature was considered due to its influence on the lattice parameter. Based on EET theory (The Empirical Electron Theory for solid and molecules), n_{{A}}^{{u - v}} represents the strength of the unit cell with defined element composition and structure, which reflects the effect from solid solution strengthening on the strength of the unit cell. For Ti-Zr-15Cu-10Ni wt% filler metal, it kept constant as 0.3476 with Zr as 37.5˜45 wt% and decreased to 0.333 with Zr decreasing from 37.5 to 25 wt%. Finally, it increased up to 0.3406 with Zr as 2˜10 wt%. Thus, Ti-based filler metal with Zr content being 2˜10 wt% is suggested based on the simulation results. Moreover, the calculated covalent electron of n A u-v showed good agreement with the hardness of the joint by filler 37.5Zr and 10Zr. The composition of Ti-10Zr-15Cu-10Ni wt% was verified in this study with higher tensile strength of the brazing joint and uniform microstructure of the interface.

The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

NASA Astrophysics Data System (ADS)

Jang, Guh-Yaw; Duh, Jenq-Gong

2005-01-01

The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

Wetting and Brazing of Alumina by Sn0.3Ag0.7Cu-Ti Alloy

NASA Astrophysics Data System (ADS)

Kang, J. R.; Song, X. G.; Hu, S. P.; Liu, D.; Guo, W. J.; Fu, W.; Cao, J.

2017-12-01

The wetting behavior of Sn0.3Ag0.7Cu (wt pct) with the addition of Ti on alumina was studied at 1273 K (1000 °C) using the sessile drop method. The wettability of Sn0.3Ag0.7Cu is significantly enhanced with the addition of Ti. Ti accumulates on the interface and reacts with O, producing TiO and yields good wetting. However, wetting is inhibited in high Ti containing droplets as intense Ti-Sn reactions take place. As a result of these competing reactions, the wettability of Sn0.3Ag0.7Cu-2Ti is the best, with the lowest equilibrium contact angle 24.6 deg. Thermodynamic calculations indicate that the value of the final contact angle cos θ varies linearly with Ti fraction in the Ti-Sn reaction-free case. The influence of the Ti-Sn reaction on wetting is quantitatively characterized by the deviation from the theoretical data. The adverse impact of Ti-Sn reaction on wetting increases in intensity with the droplets containing more Ti as the reaction between Ti and Sn becomes more intense and rapid. Alumina/alumina is brazed using different Ti containing Sn0.3Ag0.7Cu-Ti brazing metals at 1273 K (1000 °C) for 25 minutes. Pores are observed in joints prepared with Sn0.3Ag0.7Cu-0.7, 3, and 4Ti because of poor wettability. The highest joints shear strength of 28.6 MPa is obtained with Sn0.3Ag0.7Cu-2Ti.

Several braze filler metals for joining an oxide-dispersion-strengthened nickel-chromium-aluminum alloy

NASA Technical Reports Server (NTRS)

Gyorgak, C. A.

1975-01-01

An evaluation was made of five braze filler metals for joining an aluminum-containing oxide dispersion-strengthened (ODS) alloy, TD-NiCrAl. All five braze filler metals evaluated are considered suitable for joining TD-NiCrAl in terms of wettability and flow. Also, the braze alloys appear to be tolerant of slight variations in brazing procedures since joints prepared by three sources using three of the braze filler metals exhibited similar brazing characteristics and essentially equivalent 1100 C stress-rupture properties in a brazed butt-joint configuration. Recommendations are provided for brazing the aluminum-containing ODS alloys.

Identification of strengthening phases in Al-Cu-Li alloy Weldalite (tm) 049

NASA Technical Reports Server (NTRS)

1991-01-01

Microstructure property relationships were determined for a family of ultrahigh strength weldable Al-Cu-Li based alloys referred to as Weldalite (tm) alloys. The highest strength variant of this family, Weldalite 049, has a high Cu/Li wt pct. ratio with a nominal composition of Al-6.3Cu-1.3Li-0.4Ag-0.4Mg-0.14Zr. Increasing the alloy's lithium content above 1.3 wt pct. resulted in a decrease in both yield and ultimate tensile strength. Strength was shown to be strongly dependent on lithium content, with a maximum in strength occurring in the range of about 1.1 to 1.4 wt pct. lithium. The strengthening phases present in Weldalite 049 (1.3Li) and an Al-6.3Cu-1.9Li-0.4Mg-0.14Zr alloy were identified using transmission electron microscopy (TEM).

Mechanical and Thermal Properties of Two Cu-Cr-Nb Alloys and NARloy-Z

NASA Technical Reports Server (NTRS)

Ellis, David L.; Michal, Gary M.

1996-01-01

A series of creep tests were conducted on Cu-8 Cr-4 Nb (Cu-8 at.% Cr-4 at.% Nb), Cu-4 Cr-2 Nb (Cu-4 at.% Cr-2 at% Nb), and NARloy-Z (Cu-3 wt.% Ag-0.5 wt.% Zr) samples to determine their creep properties. In addition, a limited number of low cycle fatigue and thermal conductivity tests were conducted. The Cu-Cr-Nb alloys showed a clear advantage in creep life and sustainable load over the currently used NARloy-Z. Increases in life at a given stress were between 100% and 250% greater for the Cu-Cr-Nb alloys depending on the stress and temperature. For a given life, the Cu-Cr-Nb alloys could support a stress between 60% and 160% greater than NARloy-Z. Low cycle fatigue lives of the Cu-8 Cr-4 Nb alloy were equivalent to NARloy-Z at room temperature. At elevated temperatures (538 C and 650 C), the fatigue lives were 50% to 200% longer than NARloy-Z samples tested at 538 C. The thermal conductivities of the Cu-Cr-Nb alloys remained high, but were lower than NARloy-Z and pure Cu. The Cu-Cr-Nb thermal conductivities were between 72% and 96% that of pure Cu with the Cu-4 Cr-2 Nb alloy having a significant advantage in thermal conductivity over Cu-8 Cr4 Nb. In comparison, stainless steels with equivalent strengths would have thermal conductivities less than 25% the thermal conductivity of pure Cu. The combined results indicate that the Cu-Cr-Nb alloys offer an attractive alternative to current high temperature Cu-based alloys such as NARloy-Z.

Ag-Cu nanoalloyed film as a high-performance cathode electrocatalytic material for zinc-air battery

NASA Astrophysics Data System (ADS)

Lei, Yimin; Chen, Fuyi; Jin, Yachao; Liu, Zongwen

2015-04-01

A novel Ag50Cu50 film electrocatalyst for oxygen reduction reaction (ORR) was prepared by pulsed laser deposition (PLD) method. The electrocatalyst actually is Ag-Cu alloyed nanoparticles embedded in amorphous Cu film, based on transmission electron microscopy (TEM) characterization. The rotating disk electrode (RDE) measurements provide evidence that the ORR proceed via a four-electron pathway on the electrocatalysts in alkaline solution. And it is much more efficient than pure Ag catalyst. The catalytic layer has maximum power density of 67 mW cm-2 and an acceptable cell voltage at 0.863 V when current densities increased up to 100 mA cm-2 in the Ag50Cu50-based primary zinc-air battery. The resulting rechargeable zinc-air battery exhibits low charge-discharge voltage polarization of 1.1 V at 20 mAcm-2 and high durability over 100 cycles in natural air.

Evolution of Microstructure in Brazed Joints of Austenitic-Martensitic Stainless Steel with Pure Silver Obtained with Ag-27Cu-5Sn Brazing Filler Material

NASA Astrophysics Data System (ADS)

Gangadharan, S.; Sivakumar, D.; Venkateswaran, T.; Kulkarni, Kaustubh

2016-12-01

Brazing of an austenitic-martensitic stainless steel (AMSS) with pure silver was carried out at 1053 K, 1073 K, and 1093 K (780 °C, 800 °C, and 820 °C) with Ag-27Cu-5Sn (wt pct) as brazing filler material (BFM). Wettability of the liquid BFM over base AMSS surface was found to be poor. Application of nickel coating to the steel was observed to enhance the wettability and to enable the formation of a good bond between BFM and the steel. The mechanism responsible for enhanced metallurgical bonding of the BFM with AMSS in the presence of nickel coating was explained based on diffusional interactions and uphill diffusion of iron, chromium and nickel observed in the brazed microstructure. Good diffusion-assisted zone was observed to form on silver side at all three temperatures. Four phases were encountered within the joint including silver solid solution, copper solid solution, Cu3Sn intermetallic and Ni-Fe solid solution. The Cu3Sn intermetallic was present in small amounts in the joints brazed at 1053 K and 1073 K (780 °C and 800 °C). The joint formed at 1093 K (820 °C) exhibited the absence of Cu3Sn, fewer defects and larger diffusion-assisted zone. Hardness of base AMSS was found to reduce during brazing due to austenite reversion and post-brazing sub-zero treatment for 2.5 hours was found suitable to recover the hardness.

Laser Weldability of High-Strength Al-Zn Alloys and Its Improvement by the Use of an Appropriate Filler Material

NASA Astrophysics Data System (ADS)

Enz, Josephin; Riekehr, Stefan; Ventzke, Volker; Huber, Norbert; Kashaev, Nikolai

2016-06-01

Heat-treatable Al-Zn alloys are promising candidates for use as structural lightweight materials in automotive and aircraft applications. This is mainly due to their high strength-to-density ratio in comparison to conventionally employed Al alloys. Laser beam welding is an efficient method for producing joints with high weld quality and has been established in the industry for many years. However, it is well known that aluminum alloys with a high Zn content or, more precisely, with a high (Zn + Mg + Cu) content are difficult to fusion weld due to the formation of porosity and hot cracks. The present study concerns the laser weldability of these hard-to-weld Al-Zn alloys. In order to improve weldability, it was first necessary to understand the reasons for weldability problems and to identify crucial influencing factors. Based on this knowledge, it was finally possible to develop an appropriate approach. For this purpose, vanadium was selected as additional filler material. Vanadium exhibits favorable thermophysical properties and, thereby, can improve the weldability of Al-Zn alloys. The effectiveness of the approach was verified by its application to several Al-Zn alloys with differing amounts of (Zn + Mg + Cu).

Effect of Heat Treatments on Microstructures and Tensile Properties of Cu-3 wt%Ag-0.5 wt%Zr Alloy

NASA Astrophysics Data System (ADS)

Chen, Gang; Wang, ChuanJie; Zhang, Ying; Yi, Cen; Zhang, Peng

2018-03-01

The microstructures and tensile properties of Cu-3 wt%Ag-0.5 wt%Zr alloy sheets under different aging treatments are investigated in this research. As one kind of precipitate, Ag nanoparticles with coherent orientation relationship with matrix precipitate. However, after the peak-age point, most of Ag nanoparticles grow into short rod shape with the interface translating to semi-coherent, which leads to the lower strength of over-aging sample. The yield strength is estimated by considering solid solute, grain boundary and precipitation strengthening mechanisms. The result shows that the Ag precipitates provide the main strengthening role. Then a constitutive equation representing the evolution of dislocation density with plastic strain is built by considering work-hardening behavior coming from shearable and non-shearable precipitates which is mainly the particles containing Zr. The flow stress contributed by shearable particle hardening is higher than that of non-shearable one. Due to the coarsening of grain boundary precipitates and low rate of damage accumulation of these non-shearable particles, the micro-cracks nucleate easily at grain boundary which leads to intergranular fracture.

Machinability of experimental Ti-Ag alloys.

PubMed

Kikuchi, Masafumi; Takahashi, Masatoshi; Okuno, Osamu

2008-03-01

This study investigated the machinability of experimental Ti-Ag alloys (5, 10, 20, and 30 mass% Ag) as a new dental titanium alloy candidate for CAD/CAM use. The alloys were slotted with a vertical milling machine and carbide square end mills under two cutting conditions. Machinability was evaluated through cutting force using a three-component force transducer fixed on the table of the milling machine. The horizontal cutting force of the Ti-Ag alloys tended to decrease as the concentration of silver increased. Values of the component of the horizontal cutting force perpendicular to the feed direction for Ti-20% Ag and Ti-30% Ag were more than 20% lower than those for titanium under both cutting conditions. Alloying with silver significantly improved the machinability of titanium in terms of cutting force under the present cutting conditions.

Phase constitution and interface structure of nano-sized Ag-Cu/AlN multilayers: Experiment and ab initio modeling

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pigozzi, Giancarlo; Janczak-Rusch, Jolanta; Passerone, Daniele

2012-10-29

Nano-sized Ag-Cu{sub 8nm}/AlN{sub 10nm} multilayers were deposited by reactive DC sputtering on {alpha}-Al{sub 2}O{sub 3}(0001) substrates. Investigation of the phase constitution and interface structure of the multilayers evidences a phase separation of the alloy sublayers into nanosized grains of Ag and Cu. The interfaces between the Ag grains and the quasi-single-crystalline AlN sublayers are semi-coherent, whereas the corresponding Cu/AlN interfaces are incoherent. The orientation relationship between Ag and AlN is constant throughout the entire multilayer stack. These observations are consistent with atomistic models of the interfaces as obtained by ab initio calculations.

Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces

NASA Astrophysics Data System (ADS)

Qi, Lihua; Huang, Jihua; Zhang, Hua; Zhao, Xingke; Wang, Haitao; Cheng, Donghai

2010-02-01

The growth behavior of reaction-formed intermetallic compounds (IMCs) at Sn3.5Ag0.5Cu/Ni and Cu interfaces under thermal-shear cycling conditions was investigated. The results show that the morphology of (Cu x Ni1- x )6Sn5 and Cu6Sn5 IMCs formed both at Sn3.5Ag0.5Cu/Ni and Cu interfaces gradually changed from scallop-like to chunk-like, and different IMC thicknesses developed with increasing thermal-shear cycling time. Furthermore, Cu6Sn5 IMC growth rate at the Sn3.5Ag0.5Cu/Cu interface was higher than that of (Cu x Ni1- x )6Sn5 IMC under thermal-shear cycling. Compared to isothermal aging, thermal-shear cycling led to only one Cu6Sn5 layer at the interface between SnAgCu solder and Cu substrate after 720 cycles. Moreover, Ag3Sn IMC was dispersed uniformly in the solder after reflow. The planar Ag3Sn formed near the interface changed remarkably and merged together to large platelets with increasing cycles. The mechanism of formation of Cu6Sn5, (Cu x Ni1- x )6Sn5 and Ag3Sn IMCs during thermal-shear cycling process was investigated.

Texturization of diamond-wire-sawn multicrystalline silicon wafer using Cu, Ag, or Ag/Cu as a metal catalyst

NASA Astrophysics Data System (ADS)

Wang, Shing-Dar; Chen, Ting-Wei

2018-06-01

In this work, Cu, Ag, or Ag/Cu was used as a metal catalyst to study the surface texturization of diamond-wire-sawn (DWS) multi-crystalline silicon (mc-Si) wafer by a metal-assisted chemical etching (MACE) method. The DWS wafer was first etched by standard HF-HNO3 acidic etching, and it was labeled as AE-DWS wafer. The effects of ratios of Cu(NO3)2:HF, AgNO3:HF, and AgNO3:Cu(NO3)2 on the morphology of AE-DWS wafer were investigated. After the process of MACE, the wafer was treated with a NaF/H2O2 solution. In this process, H2O2 etched the nanostructure, and NaF removed the oxidation layer. The Si {1 1 1} plane was revealed by etching the wafer in a mixture of 0.03 M Cu(NO3)2 and 1 M HF at 55 °C for 2.5 min. These parallel Si {1 1 1} planes replaced some parallel saw marks on the surface of AE-DWS wafers without forming a positive pyramid or an inverted pyramid structure. The main topography of the wafer is comprised of silicon nanowires grown in <1 0 0> direction when Ag or Ag/Cu was used as a metal catalyst. When silicon is etched in a mixed solution of Cu(NO3)2, AgNO3, HF and H2O2 at 55 °C with a concentration ratio of [Cu2+]/[Ag+] of 50 or at 65 °C with a concentration ratio of [Cu2+]/[Ag+] of 33, a quasi-inverted pyramid structure can be obtained. The reflectivity of the AE-DWS wafers treated with MACE is lower than that of the multiwire-slurry-sawn (MWSS) mc-Si wafers treated with traditional HF + HNO3 etching.

Microstructural behavior of iron and bismuth added Sn-1Ag-Cu solder under elevated temperature aging

NASA Astrophysics Data System (ADS)

Ali, Bakhtiar; Sabri, Mohd Faizul Mohd; Jauhari, Iswadi

2016-07-01

An extensive study was done to investigate the microstructural behavior of iron (Fe) and bismuth (Bi) added Sn-1Ag-0.5Cu (SAC105) under severe thermal aging conditions. The isothermal aging was done at 200 °C for 100 h, 200 h, and 300 h. Optical microscopy with cross-polarized light revealed that the grain size significantly reduces with Fe/Bi addition to the base alloy SAC105 and remains literally the same after thermal aging. The micrographs of field emission scanning electron microscopy (FESEM) with backscattered electron detector and their further analysis via imageJ software indicated that Fe/Bi added SAC105 showed a significant reduction in the IMCs size (Ag3Sn and Cu6Sn5), especially the Cu6Sn5 IMCs, as well as β-Sn matrix and a refinement in the microstructure, which is due to the presence of Bi in the alloys. Moreover, their microstructure remains much more stable under severe thermal aging conditions, which is because of the presence of both Fe and Bi in the alloy. The microstructural behavior suggests that Fe/Bi modified SAC105 would have much improved reliability under severe thermal environments. These modified alloys also have relatively low melting temperature and low cost.

Ag-Cu mixed phase plasmonic nanostructures fabricated by shadow nanosphere lithography and glancing angle co-deposition

NASA Astrophysics Data System (ADS)

Ingram, Whitney; Larson, Steven; Carlson, Daniel; Zhao, Yiping

2017-01-01

By combining shadow nanosphere lithography with a glancing angle co-deposition technique, mixed-phase Ag-Cu triangular nanopatterns and films were fabricated. They were prepared at different compositions with respect to Ag from 100% to 0% by changing the relative deposition ratio of each metal. Characterizations by ellipsometry, energy dispersive x-ray spectroscopy, and x-ray diffraction revealed that the thin films and nanopatterns were composed of small, well-mixed Ag and Cu nano-grains with a diameter less than 20 nm, and their optical properties could be described by an effective medium theory. All compositions of the nanopattern had the same shape, but showed tunable localized surface plasmon resonance (LSPR) properties. In general, the LSPR of the nanopatterns redshifted with decreasing composition. Such a relation could be fitted by an empirical model based on the bulk theory of alloy plasmonics. By changing the colloidal template and the material deposited, this fabrication technique can be used to produce other alloy plasmonic nanostructures with predicted LSPR wavelengths.

Ag-Cu mixed phase plasmonic nanostructures fabricated by shadow nanosphere lithography and glancing angle co-deposition.

PubMed

Ingram, Whitney; Larson, Steven; Carlson, Daniel; Zhao, Yiping

2017-01-06

By combining shadow nanosphere lithography with a glancing angle co-deposition technique, mixed-phase Ag-Cu triangular nanopatterns and films were fabricated. They were prepared at different compositions with respect to Ag from 100% to 0% by changing the relative deposition ratio of each metal. Characterizations by ellipsometry, energy dispersive x-ray spectroscopy, and x-ray diffraction revealed that the thin films and nanopatterns were composed of small, well-mixed Ag and Cu nano-grains with a diameter less than 20 nm, and their optical properties could be described by an effective medium theory. All compositions of the nanopattern had the same shape, but showed tunable localized surface plasmon resonance (LSPR) properties. In general, the LSPR of the nanopatterns redshifted with decreasing composition. Such a relation could be fitted by an empirical model based on the bulk theory of alloy plasmonics. By changing the colloidal template and the material deposited, this fabrication technique can be used to produce other alloy plasmonic nanostructures with predicted LSPR wavelengths.

Inhibitory effect of Ti-Ag alloy on artificial biofilm formation.

PubMed

Nakajo, Kazuko; Takahashi, Masatoshi; Kikuchi, Masafumi; Takada, Yukyo; Okuno, Osamu; Sasaki, Keiichi; Takahashi, Nobuhiro

2014-01-01

Titanium-silver (Ti-Ag) alloy has been improved for machinability and mechanical properties, but its anti-biofilm properties have not been elucidated yet. Thus, this study aimed to evaluate the effects of Ti-Ag alloy on biofilm formation and bacterial viability in comparison with pure Ti, pure Ag and silver-palladium (Ag-Pd) alloy. Biofilm formation on the metal plates was evaluated by growing Streptococcus mutans and Streptococcus sobrinus in the presence of metal plates. Bactericidal activity was evaluated using a film contact method. There were no significant differences in biofilm formation between pure Ti, pure Ag and Ag-Pd alloy, while biofilm amounts on Ti-20% Ag and Ti-25% Ag alloys were significantly lower (p<0.05). In addition, Ti-Ag alloys and pure Ti were not bactericidal, although pure Ag and Ag-Pd alloy killed bacteria. These results suggest that Ti-20% Ag and Ti-25% Ag alloys are suitable for dental material that suppresses biofilm formation without disturbing healthy oral microflora.

Interfacial Phenomena in Al/Al, Al/Cu, and Cu/Cu Joints Soldered Using an Al-Zn Alloy with Ag or Cu Additions

NASA Astrophysics Data System (ADS)

Pstruś, Janusz; Gancarz, Tomasz

2014-05-01

The studies of soldered joints were carried out in systems: Al/solder/Al, Al/solder/Cu, Cu/solder/Cu, where the solder was (Al-Zn)EUT, (Al-Zn)EUT with 0.5, 1.0, and 1.5 at.% of Ag and (Al-Zn)EUT with 0.5, 1.0, and 1.5 at.% of Cu addition. Brazing was performed at 500 °C for 3 min. The EDS analysis indicated that the composition of the layers starting from the Cu pad was CuZn, Cu5Zn8, and CuZn4, respectively. Wetting tests were performed at 500 °C for 3, 8, 15, and 30 min, respectively. Thickness of the layers and their kinetics of growth were measured based on the SEM micrographs. The formation of interlayers was not observed from the side of Al pads. On the contrary, dissolution of the Al substrate and migration of Al-rich particles into the bulk of the solder were observed.

Deformation response of cube-on-cube and non-coherent twin interfaces in AgCu eutectic after dynamic plastic compression

DOE Office of Scientific and Technical Information (OSTI.GOV)

Eftink, Benjamin P.; Mara, Nathan Allan; Kingstedt, Owen T.

For this research, Split-Hopkinson pressure bar dynamic compression experiments were conducted to determine the defect/interface interaction dependence on interface type, bilayer thickness and interface orientation with respect to the loading direction in the Ag-Cu eutectic system. Specifically, the deformation microstructure in alloys with either a cube-on-cube orientation relationship with {111} Ag||{111} Cu interface habit planes or a twin orientation relationship with {more » $$\\overline{3}13$$} Ag||{$$\\overline{1}12$$} Cu interface habit planes and with bilayer thicknesses of 500 nm, 1.1 µm and 2.2 µm were probed using TEM. The deformation was carried by dislocation slip and in certain conditions, deformation twinning. The twinning response was dependent on loading orientation with respect to the interface plane, bilayer thickness, and interface type. Twinning was only observed when loading at orientations away from the growth direction and decreased in prevalence with decreasing bilayer thickness. Twinning in Cu was dependent on twinning partial dislocations being transmitted from Ag, which only occurred for cube-on-cube interfaces. Lastly, dislocation slip and deformation twin transfer across the interfaces is discussed in terms of the slip transfer conditions developed for grain boundaries in FCC alloys.« less

Deformation response of cube-on-cube and non-coherent twin interfaces in AgCu eutectic after dynamic plastic compression

DOE PAGES

Eftink, Benjamin P.; Mara, Nathan Allan; Kingstedt, Owen T.; ...

2017-12-02

For this research, Split-Hopkinson pressure bar dynamic compression experiments were conducted to determine the defect/interface interaction dependence on interface type, bilayer thickness and interface orientation with respect to the loading direction in the Ag-Cu eutectic system. Specifically, the deformation microstructure in alloys with either a cube-on-cube orientation relationship with {111} Ag||{111} Cu interface habit planes or a twin orientation relationship with {more » $$\\overline{3}13$$} Ag||{$$\\overline{1}12$$} Cu interface habit planes and with bilayer thicknesses of 500 nm, 1.1 µm and 2.2 µm were probed using TEM. The deformation was carried by dislocation slip and in certain conditions, deformation twinning. The twinning response was dependent on loading orientation with respect to the interface plane, bilayer thickness, and interface type. Twinning was only observed when loading at orientations away from the growth direction and decreased in prevalence with decreasing bilayer thickness. Twinning in Cu was dependent on twinning partial dislocations being transmitted from Ag, which only occurred for cube-on-cube interfaces. Lastly, dislocation slip and deformation twin transfer across the interfaces is discussed in terms of the slip transfer conditions developed for grain boundaries in FCC alloys.« less

Aluminum Lithium Alloy 2195 Fusion Welding Improvements with New Filler Wire

NASA Technical Reports Server (NTRS)

Russell, Carolyn; Bjorkman, Gerry; McCool, Carolyn (Technical Monitor)

2000-01-01

A viewgraph presentation outlines NASA Marshall Space Flight Center, Lockheed Martin Michoud Space Systems, and McCook Metals' development an aluminum-copper weld filler wire for fusion welding 2195 aluminum lithium. The aluminum-copper based weld filler wire has been identified as B218, which is the result of six years of weld filler wire development funded by NASA, Lockheed Martin, and McCook Metals. The Super Lightweight External Tank for the NASA Space Shuttle Program consists of 2195 welded with 4043 aluminum-silicon weld filler wire. The B218 filler wire chemistry was developed to produce enhanced 2195 weld and repair weld mechanical properties. An initial characterization of the B218 weld filler wire was performed consisting of initial weld and repair weld evaluation comparing B218 and 4043. The testing involved room temperature and cryogenic tensile testing along with fracture toughness testing. B218 weld filler wire proved to produce enhanced initial and repair weld tensile and fracture properties over 4043. B218 weld filler wire has proved to be a superior weld filler wire for welding 2195 and other aluminum lithium alloys over 4043.

A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder

NASA Astrophysics Data System (ADS)

Ma, Hai-Tao; Wang, Jie; Qu, Lin; Zhao, Ning; Kunwar, A.

2013-08-01

A rapidly solidified Sn-3.5Ag eutectic alloy produced by the melt-spinning technique was used as a sample in this research to investigate the microstructure, thermal properties, solder wettability, and inhibitory effect of Ag3Sn on Cu6Sn5 intermetallic compound (IMC). In addition, an as-cast Sn-3.5Ag solder was prepared as a reference. Rapidly solidified and as-cast Sn-3.5Ag alloys of the same size were soldered at 250°C for 1 s to observe their instant melting characteristics and for 3 s with different cooling methods to study the inhibitory effect of Ag3Sn on Cu6Sn5 IMC. Experimental techniques such as scanning electron microscopy, differential scanning calorimetry, and energy-dispersive spectrometry were used to observe and analyze the results of the study. It was found that rapidly solidified Sn-3.5Ag solder has more uniform microstructure, better wettability, and higher melting rate as compared with the as-cast material; Ag3Sn nanoparticles that formed in the rapidly solidified Sn-3.5Ag solder inhibited the growth of Cu6Sn5 IMC during aging significantly much strongly than in the as-cast material because their number in the rapidly solidified Sn-3.5Ag solder was greater than in the as-cast material with the same soldering process before aging. Among the various alternative lead-free solders, this study focused on comparison between rapidly solidified and as-cast solder alloys, with the former being observed to have better properties.

Improved TIG weld joint strength in aluminum alloy 2219-T87 by filler metal substitution

NASA Technical Reports Server (NTRS)

Poorman, R. M.; Lovoy, C. V.

1972-01-01

The results of an investigation on weld joint characteristics of aluminum alloy 2219-T87 are given. Five different alloys were utilized as filler material. The mechanical properties of the joints were determined at ambient and cryogenic temperatures for weldments in the as-welded condition and also, for weldments after elevated temperature exposures. Other evaluations included hardness surveys, stress corrosion susceptibility, and to a limited extent, the internal metallurgical weld structures. The overall results indicate that M-943 filler weldments are superior in strength to weldments containing either the standard 2319 filler or fillers 2014, 2020, and a dual wire feed consisting of three parts 2319 and one part 5652. In addition, no deficiencies were evident in M-934 filler weldments with regard to ductility, joint strength after elevated temperature exposure, weld hardness, metallographic structures, or stress corrosion susceptibility.

Microstructural behavior of iron and bismuth added Sn-1Ag-Cu solder under elevated temperature aging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ali, Bakhtiar, E-mail: engrbakhtiaralikhan@gmail.com; Sabri, Mohd Faizul Mohd, E-mail: faizul@um.edu.my; Jauhari, Iswadi, E-mail: iswadi@um.edu.my

An extensive study was done to investigate the microstructural behavior of iron (Fe) and bismuth (Bi) added Sn-1Ag-0.5Cu (SAC105) under severe thermal aging conditions. The isothermal aging was done at 200 °C for 100 h, 200 h, and 300 h. Optical microscopy with cross-polarized light revealed that the grain size significantly reduces with Fe/Bi addition to the base alloy SAC105 and remains literally the same after thermal aging. The micrographs of field emission scanning electron microscopy (FESEM) with backscattered electron detector and their further analysis via imageJ software indicated that Fe/Bi added SAC105 showed a significant reduction in the IMCsmore » size (Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5}), especially the Cu{sub 6}Sn{sub 5} IMCs, as well as β-Sn matrix and a refinement in the microstructure, which is due to the presence of Bi in the alloys. Moreover, their microstructure remains much more stable under severe thermal aging conditions, which is because of the presence of both Fe and Bi in the alloy. The microstructural behavior suggests that Fe/Bi modified SAC105 would have much improved reliability under severe thermal environments. These modified alloys also have relatively low melting temperature and low cost.« less

Nanoparticles alloying in liquids: Laser-ablation-generated Ag or Pd nanoparticles and laser irradiation-induced AgPd nanoparticle alloying

NASA Astrophysics Data System (ADS)

Semaltianos, N. G.; Chassagnon, R.; Moutarlier, V.; Blondeau-Patissier, V.; Assoul, M.; Monteil, G.

2017-04-01

Laser irradiation of a mixture of single-element micro/nanomaterials may lead to their alloying and fabrication of multi-element structures. In addition to the laser induced alloying of particulates in the form of micro/nanopowders in ambient atmosphere (which forms the basis of the field of additive manufacturing technology), another interesting problem is the laser-induced alloying of a mixture of single-element nanoparticles in liquids since this process may lead to the direct fabrication of alloyed-nanoparticle colloidal solutions. In this work, bare-surface ligand-free Ag and Pd nanoparticles in solution were prepared by laser ablation of the corresponding bulk target materials, separately in water. The two solutions were mixed and the mixed solution was laser irradiated for different time durations in order to investigate the laser-induced nanoparticles alloying in liquid. Nanoparticles alloying and the formation of AgPd alloyed nanoparticles takes place with a decrease of the intensity of the surface-plasmon resonance peak of the Ag nanoparticles (at ∼405 nm) with the irradiation time while the low wavelength interband absorption peaks of either Ag or Pd nanoparticles remain unaffected by the irradiation for a time duration even as long as 30 min. The nanoalloys have lattice constants with values between those of the pure metals, which indicates that they consist of Ag and Pd in an approximately 1:1 ratio similar to the atomic composition of the starting mixed-nanoparticle solution. Formation of nanoparticle networks consisting of bimetallic alloyed nanoparticles and nanoparticles that remain as single elements (even after the end of the irradiation), joining together, are also formed. The binding energies of the 3d core electrons of both Ag and Pd nanoparticles shift to lower energies with the irradiation time, which is also a typical characteristic of AgPd alloyed nanoparticles. The mechanisms of nanoparticles alloying and network formation are also

Nanoparticles alloying in liquids: Laser-ablation-generated Ag or Pd nanoparticles and laser irradiation-induced AgPd nanoparticle alloying.

PubMed

Semaltianos, N G; Chassagnon, R; Moutarlier, V; Blondeau-Patissier, V; Assoul, M; Monteil, G

2017-04-18

Laser irradiation of a mixture of single-element micro/nanomaterials may lead to their alloying and fabrication of multi-element structures. In addition to the laser induced alloying of particulates in the form of micro/nanopowders in ambient atmosphere (which forms the basis of the field of additive manufacturing technology), another interesting problem is the laser-induced alloying of a mixture of single-element nanoparticles in liquids since this process may lead to the direct fabrication of alloyed-nanoparticle colloidal solutions. In this work, bare-surface ligand-free Ag and Pd nanoparticles in solution were prepared by laser ablation of the corresponding bulk target materials, separately in water. The two solutions were mixed and the mixed solution was laser irradiated for different time durations in order to investigate the laser-induced nanoparticles alloying in liquid. Nanoparticles alloying and the formation of AgPd alloyed nanoparticles takes place with a decrease of the intensity of the surface-plasmon resonance peak of the Ag nanoparticles (at ∼405 nm) with the irradiation time while the low wavelength interband absorption peaks of either Ag or Pd nanoparticles remain unaffected by the irradiation for a time duration even as long as 30 min. The nanoalloys have lattice constants with values between those of the pure metals, which indicates that they consist of Ag and Pd in an approximately 1:1 ratio similar to the atomic composition of the starting mixed-nanoparticle solution. Formation of nanoparticle networks consisting of bimetallic alloyed nanoparticles and nanoparticles that remain as single elements (even after the end of the irradiation), joining together, are also formed. The binding energies of the 3d core electrons of both Ag and Pd nanoparticles shift to lower energies with the irradiation time, which is also a typical characteristic of AgPd alloyed nanoparticles. The mechanisms of nanoparticles alloying and network formation are also

[Quantitative surface analysis of Pt-Co, Cu-Au and Cu-Ag alloy films by XPS and AES].

PubMed

Li, Lian-Zhong; Zhuo, Shang-Jun; Shen, Ru-Xiang; Qian, Rong; Gao, Jie

2013-11-01

In order to improve the quantitative analysis accuracy of AES, We associated XPS with AES and studied the method to reduce the error of AES quantitative analysis, selected Pt-Co, Cu-Au and Cu-Ag binary alloy thin-films as the samples, used XPS to correct AES quantitative analysis results by changing the auger sensitivity factors to make their quantitative analysis results more similar. Then we verified the accuracy of the quantitative analysis of AES when using the revised sensitivity factors by other samples with different composition ratio, and the results showed that the corrected relative sensitivity factors can reduce the error in quantitative analysis of AES to less than 10%. Peak defining is difficult in the form of the integral spectrum of AES analysis since choosing the starting point and ending point when determining the characteristic auger peak intensity area with great uncertainty, and to make analysis easier, we also processed data in the form of the differential spectrum, made quantitative analysis on the basis of peak to peak height instead of peak area, corrected the relative sensitivity factors, and verified the accuracy of quantitative analysis by the other samples with different composition ratio. The result showed that the analytical error in quantitative analysis of AES reduced to less than 9%. It showed that the accuracy of AES quantitative analysis can be highly improved by the way of associating XPS with AES to correct the auger sensitivity factors since the matrix effects are taken into account. Good consistency was presented, proving the feasibility of this method.

Hot cracking susceptibility of fillers 52 and 82 in alloy 690 welding

NASA Astrophysics Data System (ADS)

Wu, Weite; Tsai, C. H.

1999-02-01

The hot cracking susceptibility of fillers 52 and 82 in a alloy 690 weldment is analyzed by the Varestraint test. Weld characteristics, microstructure, hardness distribution, and thermal analysis of the two filler metals are also examined. The weld metal of both fillers develops an extremely dense oxide layer. A stainless steel brush cannot remove the oxide layer, and a grinder may be needed between weld passes to assure a sound weld. Differential temperature analysis (DTA) shows that filler 82 has a lower melting point and a wider melting/solidification temperature differential (Δ T). These characteristics correlate with greater hot cracking susceptibility of filler 82 than 52 in Varestraint tests. The hot cracks are intergranular and are caused by elements segregating in grain boundies.

Effect of Natural Aging and Cold Working on Microstructures and Mechanical Properties of Al-4.6Cu-0.5Mg-0.5Ag alloy

NASA Astrophysics Data System (ADS)

Chen, Yu-Te; Lee, Sheng-Long; Bor, Hui-Yun; Lin, Jing-Chie

2013-06-01

This research investigates the effects of natural aging and cold working prior to artificial aging on microstructures and mechanical properties of Al-4.6Cu-0.5Mg-0.5Ag alloy. Mechanical properties relative to microstructure variations were elucidated by the observations of the optical microscope (OM), differential scanning calorimeter (DSC), electrical conductivity meter (pct IACS), and transmission electron microscopy (TEM). The results showed that natural aging treatment has little noticeable benefit on the quantity of precipitation strengthening phases and mechanical properties, but it increases the precipitation strengthening rate at the initial stage of artificial aging. Cold working brings more lattice defects which suppress Al-Cu (GP zone) and Mg-Ag clustering, and therefore the precipitation of Ω phase decreases. Furthermore, more dislocations are formed, leading to precipitate the more heterogeneous nucleation of θ' phase. The above-mentioned precipitation phenomena and strain hardening effect are more obvious with higher degrees of cold working.

Bimetallic AgCu/Cu2O hybrid for the synergetic adsorption of iodide from solution.

PubMed

Mao, Ping; Liu, Ying; Liu, Xiaodong; Wang, Yuechan; Liang, Jie; Zhou, Qihang; Dai, Yuexuan; Jiao, Yan; Chen, Shouwen; Yang, Yi

2017-08-01

To further improve the capacity of Cu 2 O to absorb I - anions from solution, and to understand the difference between the adsorption mechanisms of Ag/Cu 2 O and Cu/Cu 2 O adsorbents, bimetallic AgCu was doped into Cu 2 O through a facile solvothermal route. Samples were characterized and employed to adsorb I - anions under different experimental conditions. The results show that the Cu content can be tuned by adding different volumes of Ag sols. After doping bimetallic AgCu, the adsorption capacity of the samples can be increased from 0.02 mmol g -1 to 0.52 mmol g -1 . Moreover, the optimal adsorption is reached within only 240 min. Meanwhile, the difference between the adsorption mechanisms of Ag/Cu 2 O and Cu/Cu 2 O adsorbents was verified, and the cooperative adsorption mechanism of the AgCu/Cu 2 O hybrid was proposed and verified. In addition, the AgCu/Cu 2 O hybrid showed excellent selectivity, e.g., its adsorption efficiencies are 85.1%, 81.9%, 85.9% and 85.7% in the presence of the Cl - , CO 3 2- , SO 4 2- and NO 3 - competitive anions, respectively. Furthermore, the AgCu/Cu 2 O hybrid can worked well in other harsh environments (e.g., acidic, alkaline and seawater environments). Therefore, this study is expected to promote the development of Cu 2 O into a highly efficient adsorbent for the removal of iodide from solution. Copyright © 2017 Elsevier Ltd. All rights reserved.

Crystallization kinetics of Mg–Cu–Yb–Ca–Ag metallic glasses

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tsarkov, Andrey A., E-mail: tsarkov@misis.ru; WPI Advanced Institute for Materials Research, Tohoku University, Katahira 2-1-1, Aoba-Ku, Sendai 980-8577; Zanaeva, Erzhena N.

The paper presents research into a Mg–Cu–Yb system based metallic glassy alloys. Metallic glasses were prepared using induction melting and further injection on a spinning copper wheel. The effect of alloying by Ag and Ca on the glass forming ability and the kinetics of crystallization of Mg–Cu–Yb system based alloys were studied. The differential scanning calorimeter and X-ray diffractometer were used to investigate the kinetics of crystallization and the phase composition of the samples. An indicator of glass forming ability, effective activation energy of crystallization, and enthalpy of mixing were calculated. An increase of the Ca and Ag content hasmore » a positive effect on the glass forming ability, the effective activation energy of crystallization, and the enthalpy of mixing. The highest indicators of the glass forming ability and the thermal stability were found for alloys that contain both alloying elements. The Ag addition suppresses precipitation of the Mg{sub 2}Cu phase during crystallization. A dual-phase glassy-nanocrystalline Mg structure was obtained in Mg{sub 65}Cu{sub 25}Yb{sub 10} and Mg{sub 59.5}Cu{sub 22.9}Yb{sub 11}Ag{sub 6.6} alloys after annealing. Bulk samples with a composite glassy-crystalline structure were obtained in Mg{sub 59.5}Cu{sub 22.9}Yb{sub 11}Ag{sub 6.6} and Mg{sub 64}Cu{sub 21}Yb{sub 9.5}Ag{sub 5.5} alloys. A thermodynamic database for the Mg–Cu–Yb–Ca–Ag system was created to compare the process of crystallization of alloys with polythermal sections of the Mg–Cu–Yb–Ca–Ag phase diagram. - Highlights: • New alloy compositions based on Mg–Cu–Yb system were developed and investigated. • Increasing content of Ag and Ca leads to improving GFA. • Bulk samples with a composite glassy-crystalline structure were obtained. • Thermodynamic database for Mg–Cu–Yb–Ca–Ag system was created.« less

Hot cracking susceptibility of fillers 52 and 82 in alloy 690 welding

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wu, W.; Tsai, C.H.

1999-02-01

The hot cracking susceptibility of fillers 52 and 82 in a alloy 690 weldment is analyzed by the Varestraint test. Weld characteristics, microstructure, hardness distribution, and thermal analysis of the two filler metals are also examined. The weld metal of both fillers develops an extremely dense oxide layer. A stainless steel brush cannot remove the oxide layer, and a grinder may be needed between weld passes to assure a sound weld. Differential temperature analysis (DTA) shows that filler 82 has a lower melting point and a wider melting/solidification temperature differential ({Delta} T). These characteristics correlate with greater hot cracking susceptibilitymore » of filler 82 than 52 in Varestraint tests. The hot cracks are intergranular and are caused by elements segregating in grain boundaries.« less

Femtosecond Laser Fabricated Ag@Au and Cu@Au Alloy Nanoparticles for Surface Enhaned Raman Spectrosocpy Based Trace Explosives Detection

NASA Astrophysics Data System (ADS)

Sree Satya Bharati, Moram; Byram, Chandu; Soma, Venugopal R.

2018-03-01

Herein we present results from our detailed studies on the fabrication of Ag@Au and Cu@Au alloy nanoparticles (NPs) using the femtosecond laser ablation in liquid technique. The NPs were obtained by ablating the pure Ag, Cu targets (bulk) in HAuCl4 (5 mM) solution. The absorption properties of the obtained NPs colloids were characterized using UV-Visible absorption spectrometer and their size, shape, and crystallinity were investigated using the XRD, FESEM and TEM techniques. The fabricated NPs were utilized for sensing of explosive molecules such as 2, 4, 6-trinitrophenol (PA), 2, 4-dinitrotoluene (DNT) and a common dye methylene blue (MB) using the surface enhanced Raman spectroscopy (SERS) technique. The detection limit in terms of weight was as low as few nano-grams in the case of nitroaromatic explosive compounds (PA, DNT) and few picograms in the case of a common dye molecule (MB). Typical enhancement factors achieved were estimated to be 104, 105 and 107, respectively, for PA, DNT, and MB. The significance of the present work lies in exploring the performance of the prepared NPs being used as SERS substrates for explosives detection using a portable Raman instrument. Such capability enables one to carry the spectrometer to the point of interest in the field and evaluate any hazardous samples within a short period of time.

Grindability of cast Ti-Cu alloys.

PubMed

Kikuchi, Masafumi; Takada, Yukyo; Kiyosue, Seigo; Yoda, Masanobu; Woldu, Margaret; Cai, Zhuo; Okuno, Osamu; Okabe, Toru

2003-07-01

The purpose of the present study was to evaluate the grindability of a series of cast Ti-Cu alloys in order to develop a titanium alloy with better grindability than commercially pure titanium (CP Ti), which is considered to be one of the most difficult metals to machine. Experimental Ti-Cu alloys (0.5, 1.0, 2.0, 5.0, and 10.0 mass% Cu) were made in an argon-arc melting furnace. Each alloy was cast into a magnesia mold using a centrifugal casting machine. Cast alloy slabs (3.5 mm x 8.5 mm x 30.5 mm), from which the hardened surface layer (250 microm) was removed, were ground using a SiC abrasive wheel on an electric handpiece at four circumferential speeds (500, 750, 1000, or 1250 m/min) at 0.98 N (100 gf). Grindability was evaluated by measuring the amount of metal volume removed after grinding for 1min. Data were compared to those for CP Ti and Ti-6Al-4V. For all speeds, Ti-10% Cu alloy exhibited the highest grindability. For the Ti-Cu alloys with a Cu content of 2% or less, the highest grindability corresponded to an intermediate speed. It was observed that the grindability increased with an increase in the Cu concentration compared to CP Ti, particularly for the 5 or 10% Cu alloys at a circumferential speed of 1000 m/min or above. By alloying with copper, the cast titanium exhibited better grindability at high speed. The continuous precipitation of Ti(2)Cu among the alpha-matrix grains made this material less ductile and facilitated more effective grinding because small broken segments more readily formed.

Determination of Anand parameters for SnAgCuCe solder

NASA Astrophysics Data System (ADS)

Zhang, Liang; Xue, Songbai; Gao, Lili; Zeng, Guang; Sheng, Zhong; Chen, Yan; Yu, Shenglin

2009-10-01

A unified viscoplastic constitutive model, Anand equations, was used to represent the inelastic deformation behavior for Sn3.8Ag0.7Cu/Sn3.8Ag0.7 Cu0.03Ce solders in surface mount technology. The Anand parameters of the constitutive equations for the SnAgCu and SnAgCuCe solders were determined from separated constitutive relations and experimental results. Non-linear least-squares fitting was selected to determine the model constants. Comparisons were then made with experimental measurements of the stress-inelastic strain curves: excellent agreement was found. The model accurately predicted the overall trend of steady-state stress-strain behavior of SnAgCu and SnAgCuCe solders for the temperature ranges from -55 to 125 °C and for the strain rate range from 1% s-1 to 0.01% s-1. It is concluded that the Anand model can be applied to represent the inelastic deformation behavior of solders at high homologous temperatures and can be recommended for finite element simulation of the stress-strain response of lead-free soldered joints. Based on the Anand model, the investigations of thermo-mechanical behavior of SnAgCu and SnAgCuCe soldered joints in fine pitch quad flat package by the finite element code have been done under thermal cyclic loading, and it is found that the reliability of the SnAgCuCe soldered joints is better than that of the SnAgCu soldered joints.

Wear resistance of CuZr-based amorphous-forming alloys against bearing steel in 3.5% NaCl solution

NASA Astrophysics Data System (ADS)

Ji, Xiulin; Wang, Hui; Bao, Yayun; Zheng, Dingcong

2017-11-01

To investigate the amorphous-crystalline microstructure on the tribocorrosion of bulk metallic glasses (BMGs), 6 mm diameter rods of Cu46-xZr47Al7Agx (x = 0, 2, 4) amorphous-forming alloys with in situ crystalline and amorphous phases were fabricated by arc-melting and Cu-mould casting. Using a pin-on-disc tribometer, the tribo-pair composed by CuZr-based amorphous-forming alloys and AISI 52100 steel were studied in 3.5% NaCl solution. With the increase of Ag content from 0 to 4 at.%, the compressive fracture strength and the average hardness decrease firstly and then increase. Moreover, 4 at.% Ag addition increases the amount of amorphous phase obviously and inhibits the formation of brittle crystalline phase, resulting in the improvement of corrosion resistance and the corrosive wear resistance. The primary wear mechanism of the BMG composites is abrasive wear accompanying with corrosive wear. The tribocorrosion mass loss of Cu42Zr47Al7Ag4 composite is 1.5 mg after 816.8 m sliding distance at 0.75 m s-1 sliding velocity under 10 N load in NaCl solution. And the volume loss evaluated from the mass loss is about 20 times lower than that of AISI 304 SS. Thus, Cu42Zr47Al7Ag4 composite may be a good candidate in the tribology application under marine environment.

Indentation Size Effect on Ag Nanoparticle-Modified Graphene/Sn-Ag-Cu Solders

NASA Astrophysics Data System (ADS)

Xu, L. Y.; Zhang, S. T.; Jing, H. Y.; Wang, L. X.; Wei, J.; Kong, X. C.; Han, Y. D.

2018-01-01

This paper presents the results for the indentation size effect (ISE) on the creep stress exponent and hardness of 0.03 wt.% Ag-modified graphene nanosheet Sn-Ag-Cu solder alloys, using constant loading/holding and multi-cycle (CMC) loading methods, respectively. At each maximum load, with increasing indentation depth, the creep exponent first decreased and then increased. At the same strain rate, the stress exponent also showed the same tendency, increasing as the indentation depth (peak load) increased and then decreased. The hardness was measured continuously with increasing indentation depth by the CMC loading method. The hardness did not exhibit a decrease as the indentation depth increased, which differs from the classical description of the ISE. After an initial decrease, the hardness then increased and finally decreased as the indentation depth increased. This study reviews the existing theories and formulations describing ISE with hardening effects. The experimental results fit well with the empirical formulation. The phenomenon of ISE accompanied by hardening effects has been explained physically via the interaction between geometrically necessary dislocations and grain boundaries.

The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

NASA Astrophysics Data System (ADS)

Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

2008-06-01

This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

Desorption of oxygen from alloyed Ag/Pt(111)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jankowski, Maciej; Wormeester, Herbert, E-mail: h.wormeester@utwente.nl; Zandvliet, Harold J. W.

2014-06-21

We have investigated the interaction of oxygen with the Ag/Pt(111) surface alloy by thermal desorption spectroscopy (TDS). The surface alloy was formed during the deposition of sub-monolayer amounts of silver on Pt(111) at 800 K and subsequent cooling to 300 K. The low-temperature phase of the surface alloy is composed of nanometer-sized silver rich stripes, embedded within platinum-rich domains, which were characterized with spot profile analysis low energy electron diffraction. The TDS measurements show that oxygen adsorption is blocked on Ag sites: the saturation coverage of oxygen decreases with increasing Ag coverage. Also, the activation energy for desorption (E{sub des})more » decreases with Ag coverage. The analysis of the desorption spectra from clean Pt(111) shows a linear decay of E{sub des} with oxygen coverage, which indicates repulsive interactions between the adsorbed oxygen atoms. In contrast, adsorption on alloyed Ag/Pt(111) leads to an attractive interaction between adsorbed oxygen atoms.« less

Al-Li-Cu-Mg-(Ag) Products for Lower Wing Skin Applications

NASA Astrophysics Data System (ADS)

Karabin, L. M.; Bray, G. H.; Rioja, R. J.; Venema, G.

Al-Li-Cu-Mg alloy products, with and without Ag additions provide substantial performance advantages over conventional 2xxx products. For lower wing applications, the combination of specific ultimate tensile strength and damage tolerance is of particular importance and this is an area in which the Al-Li alloys can excel. Since Al-Li products have historically suffered with issues surrounding high property gradients through the plate thickness and high degrees of tensile in-plane anisotropy, a great deal of attention has been paid to the thermo-mechanical processing routes used in the fabrication of the current generation of alloy products. In addition, corrosion resistance is an area that has received greater attention recently since it can impact inspection intervals. In this presentation, the microstructures and properties of two new alloy products aimed for lower wing applications, 2199-T86 and 2060-T8E86, will be reviewed and compared with non-Li 2xxx products. It is concluded that the performance improvements of Al-Li alloys/products in addition to their lower density will enable significant weight savings in modern aircraft.

Fiber Laser Welding-Brazing Characteristics of Dissimilar Metals AZ31B Mg Alloys to Copper with Mg-Based Filler

NASA Astrophysics Data System (ADS)

Zhao, Xiaoye; Tan, Caiwang; Meng, Shenghao; Chen, Bo; Song, Xiaoguo; Li, Liqun; Feng, Jicai

2018-03-01

Fiber laser welding-brazing of 1-mm-thick AZ31B Mg alloys to 1.5-mm-thick copper (T2) with Mg-based filler was performed in a lap configuration. The weld appearance, interfacial microstructure and mechanical properties were investigated with different heat inputs. The results indicated that processing windows for optimizing appropriate welding parameters were relatively narrow in this case. Visually acceptable joints with certain strength were achieved at appropriate welding parameters. The maximum tensile-shear fracture load of laser-welded-brazed Mg/Cu joint could reach 1730 N at the laser power of 1200 W, representing 64.1% joint efficiency relative to AZ31Mg base metal. The eutectic structure (α-Mg + Mg2Cu) and Mg-Cu intermetallic compound was observed at the Mg/Cu interface, and Mg-Al-Cu ternary intermetallic compound were identified between intermetallics and eutectic structure at high heat input. All the joints fractured at the Mg-Cu interface. However, the fracture mode was found to differ. For laser power of 1200 W, the surface was characterized by tearing edge, while that with poor joint strength was almost dominated by smooth surface or flat tear pattern.

Effect of phase assemblage of precursor on the fabrication process and properties of Bi2223 tape sheathed with Ag-alloy

NASA Astrophysics Data System (ADS)

Nakamura, Y.; Shioiri, T.; Kurihara, C.; Machida, T.; Inada, R.; Oota, A.

2008-09-01

The use of alloy sheath is effective to increase the strength of Ag-sheathed Bi2223 tapes. However, the Jc value of alloy sheathed tapes was not high enough since the undesired reaction to form impurity phases and the change in formation rate of Bi2223 were disturbed by the microstructure of the filaments . In this study, the effect of 2223 contents in precursor on the formation and property of Bi2223 tapes sheathed with Ag-Mg alloy was investigated. The conversion rate of Bi2223 from Bi2212 was increased by the addition of Bi2223 phase in precursor but the conversion rate in Ag-Mg alloy sheathed tapes was slower than that in the Ag-Cu alloy sheathed tapes. This reduction of conversion speed of Bi2223 may be attributed to the decrease in the growth rate of Bi2223 crystals in Ag-Mg alloy sheath. Since the tapes with small Bi2223 crystals after first sintering showed many outgrowths after final sintering, the formation of outgrowth would be caused in the case of small crystal size. The Jc value of 2.2 × 10 4 A/cm 2 was achieved in the samples using the precursor with 10 wt.% 2223. The high Jc value can be achieved by the proper control of precursor condition including the contents of Bi2223 and corresponding heat treatment pattern in Ag-Mg alloy sheathed tapes.

Observations of a Cast Cu-Cr-Zr Alloy

NASA Technical Reports Server (NTRS)

Ellis, David L.

2006-01-01

Prior work has demonstrated that Cu-Cr-Nb alloys have considerable advantages over the copper alloys currently used in regeneratively cooled rocket engine liners. Observations indicated that Zr and Nb have similar chemical properties and form very similar compounds. Glazov and Zakharov et al. reported the presence of Cr2Zr in Cu-Cr-Zr alloys with up to 3.5 wt% Cr and Zr though Zeng et al. calculated that Cr2Zr could not exist in a ternary Cu-Cr-Zr alloy. A cast Cu-6.15 wt% Cr-5.25 wt% Zr alloy was examined to determine if the microstructure developed would be similar to GRCop-84 (Cu-6.65 wt% Cr-5.85 wt% Nb). It was observed that the Cu-Cr-Zr system did not form any Cr2Zr even after a thermal exposure at 875 C for 176.5 h. Instead the alloy consisted of three phases: Cu, Cu5Zr, and Cr.

Efficient low-temperature soot combustion by bimetallic Ag-Cu/SBA-15 catalysts.

PubMed

Wen, Zhaojun; Duan, Xinping; Hu, Menglin; Cao, Yanning; Ye, Linmin; Jiang, Lilong; Yuan, Youzhu

2018-02-01

In this study, the effects of copper (Cu) additive on the catalytic performance of Ag/SBA-15 in complete soot combustion were investigated. The soot combustion performance of bimetallic Ag-Cu/SBA-15 catalysts was higher than that of monometallic Ag and Cu catalysts. The optimum catalytic performance was acquired with the 5Ag 1 -Cu 0.1 /SBA-15 catalyst, on which the soot combustion starts at T ig =225°C with a T 50 =285°C. The temperature for 50% of soot combustion was lower than that of conventional Ag-based catalysts to more than 50°C (Aneggi et al., 2009). Physicochemical characterizations of the catalysts indicated that addition of Cu into Ag could form smaller bimetallic Ag-Cu nanolloy particles, downsizing the mean particle size from 3.7nm in monometallic catalyst to 2.6nm in bimetallic Ag-Cu catalyst. Further experiments revealed that Ag and Cu species elicited synergistic effects, subsequently increasing the content of surface active oxygen species. As a result, the structure modifications of Ag by the addition of Cu strongly intensified the catalytic performance. Copyright © 2017. Published by Elsevier B.V.

Accumulation of Ag and Cu in Amanita strobiliformis and characterization of its Cu and Ag uptake transporter genes AsCTR2 and AsCTR3.

PubMed

Beneš, Vojtěch; Hložková, Kateřina; Matěnová, Michaela; Borovička, Jan; Kotrba, Pavel

2016-04-01

Macrofungi can accumulate in their sporocarps remarkably high concentrations of Cu and Ag. We have previously demonstrated that the non-essential Ag is in the ectomycorrhizal, Ag-hyperaccumulating Amanita strobiliformis sequestered by 3.4-kDa metallothioneins (MTs) produced as AsMT1a, 1b and 1c isoforms. Here, we describe two populations of wild-grown A. strobiliformis sporocarps, which showed certain correlation between the concentrations of accumulated Ag (284 ± 64 and 67 ± 15 mg kg(-1)) and Cu (76 ± 13 and 30 ± 12 mg kg(-1)), suggesting that an overlap may exist in the cell biology of Ag and Cu in this species. Metal speciation analysis revealed that the intracellular Cu in the sporocarps of both populations was, like Ag, associated with the 3.4-kDa MTs. A search of A. strobiliformis transcriptome for sequences encoding proteins of the Cu transporter (CTR) family identified four AsCTR cDNAs, which were, like AsMT1s, confirmed in both populations. The predicted AsCTR proteins showed homology to vacuolar (AsCTR1 and AsCTR4) and plasma membrane (AsCTR2 and AsCTR3) CTRs. Heterologous expression of AsCTR2, AsCTR3 and their translational fusions with green fluorescent protein (GFP) in Cu uptake-deficient S. cerevisiae indicated that both AsCTRs are functional Cu and Ag uptake transporters: recombinant genes complemented growth defects and increased Cu and Ag uptake rates in yeasts and the GFP-tagged protein localized to the cell periphery. Site directed mutagenesis revealed the importance of the conserved-among-CTRs M-X3-M motif for the AsCTR2- and AsCTR3-mediated transport of both Cu and Ag. These results provide the first evidence that fungal CTRs can recognize Ag for transport.

Creep Testing of High-Temperature Cu-8 Cr-4 Nb Alloy Completed

NASA Technical Reports Server (NTRS)

1995-01-01

A Cu-8 at.% Cr-4 at.% Nb (Cu-8 Cr-4 Nb) alloy is under development for high-temperature, high heatflux applications, such as actively cooled, hypersonic vehicle heat exchangers and rocket engine combustion chambers. Cu-8 Cr-4 Nb offers a superior combination of strength and conductivity. It has also shown exceptional low-cycle fatigue properties. Following preliminary testing to determine the best processing route, a more detailed testing program was initiated to determine the creep lives and creep rates of Cu-8 Cr-4 Nb alloy specimens produced by extrusion. Testing was conducted at the NASA Lewis Research Center with constant-load vacuum creep units. Considering expected operating temperatures and mission lives, we developed a test matrix to accurately determine the creep properties of Cu-8 Cr-4 Nb between 500 and 800 C. Six bars of Cu-8 Cr-4 Nb were extruded. From these bars, 54 creep samples were machined and tested. The figure on the left shows the steady-state, or second-stage, creep rates for the samples. Comparison data for NARloy-Z (Cu-3 wt % Ag-0.5 wt % Zr), the alloy currently used in combustion chamber liners, were not unavailable. Therefore the steady-state creep rates for Cu at similar temperatures are presented. As expected, in comparison to pure Cu, the creep rates for Cu-8 Cr-4 Nb are much lower. The lives of the samples are presented in the figure on the right. As shown, Cu-8 Cr-4 Nb at 800 C is comparable to NARloy-Z at 648 C. At equivalent temperatures, Cu-8 Cr-4 Nb enjoys a 20 to 50 percent advantage in stress for a given life and 1 to 3 orders of magnitude greater life at a given stress. The improved properties allow for design tradeoffs and improvements in new and existing heat exchangers such as the next generation of combustion chamber liners. Average creep rates for Cu-8 Cr-4 Nb and pure Cu are shown. Average creep lives for Cu-8 Cr- 4 Nb and NARloy-Z are also shown. Currently, two companies are interested in the commercial usage of the Cu

Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

NASA Astrophysics Data System (ADS)

Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

2016-07-01

Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

Synergistic effect in an Au-Ag alloy nanocatalyst: CO oxidation.

PubMed

Liu, Jun-Hong; Wang, Ai-Qin; Chi, Yu-Shan; Lin, Hong-Ping; Mou, Chung-Yuan

2005-01-13

Au-Ag alloy nanoparticles supported on mesoporous aluminosilicate have been prepared by one-pot synthesis using hexadecyltrimethylammonium bromide (CTAB) both as a stabilizing agent for nanoparticles and as a template for the formation of mesoporous structure. The formation of Au-Ag alloy nanoparticles was confirmed by X-ray diffraction (XRD), ultraviolet-visible (UV-vis) spectroscopy, and transmission electron microscopy (TEM). Although the Au-Ag alloy nanoparticles have a larger particle size than the monometallic gold particles, they exhibited exceptionally high activity in catalysis for low-temperature CO oxidation. Even at a low temperature of 250 K, the reaction rate can reach 8.7 x 10(-6) mol.g(cat.)(-1).s(-1) at an Au/Ag molar ratio of 3/1. While neither monometallic Au@MCM-41 nor Ag@MCM-41 shows activity at this temperature, the Au-Ag alloy system shows a strongly synergistic effect in high catalytic activity. In this alloy system, the size effect is no longer a critical factor, whereas Ag is believed to play a key role in the activation of oxygen.

Transparent ITO/Ag-Pd-Cu/ITO multilayer cathode use in inverted organic solar cells

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kim, Hyo-Joong; Kim, Han-Ki, E-mail: imdlhkkim@khu.ac.kr; Lee, Hyun Hwi

2015-10-15

The characteristics of transparent ITO/Ag-Pd-Cu (APC)/ITO multilayer cathodes were investigated for use in inverted organic solar cells (IOSCs). The insertion of an APC interlayer into the ITO film effectively led to crystallization of the top ITO layer, unlike that in the Ag interlayer, and resulted in a low sheet resistance of 6.55 Ohm/square and a high optical transmittance of 84.14% without post annealing. In addition, the alloying of the Pd and Cu elements into Ag prevented agglomeration and oxidization of the metal interlayer and led to more stable ITO/APC/ITO films under ambient conditions. The microstructure and interfacial structure of themore » transparent ITO/APC/ITO cathode in the IOSCs were examined in detail by synchrotron X-ray scattering and high resolution transmission electron microscopy. Furthermore, we suggested a possible mechanism to explain the lower PCE of the IOSCs with an ITO/APC/ITO cathode than that of a reference IOSC with a crystalline ITO cathode using the external quantum efficiency of the IOSCs.« less

Transparent ITO/Ag-Pd-Cu/ITO multilayer cathode use in inverted organic solar cells

NASA Astrophysics Data System (ADS)

Kim, Hyo-Joong; Lee, Hyun Hwi; Kal, Jinha; Hahn, Jungseok; Kim, Han-Ki

2015-10-01

The characteristics of transparent ITO/Ag-Pd-Cu (APC)/ITO multilayer cathodes were investigated for use in inverted organic solar cells (IOSCs). The insertion of an APC interlayer into the ITO film effectively led to crystallization of the top ITO layer, unlike that in the Ag interlayer, and resulted in a low sheet resistance of 6.55 Ohm/square and a high optical transmittance of 84.14% without post annealing. In addition, the alloying of the Pd and Cu elements into Ag prevented agglomeration and oxidization of the metal interlayer and led to more stable ITO/APC/ITO films under ambient conditions. The microstructure and interfacial structure of the transparent ITO/APC/ITO cathode in the IOSCs were examined in detail by synchrotron X-ray scattering and high resolution transmission electron microscopy. Furthermore, we suggested a possible mechanism to explain the lower PCE of the IOSCs with an ITO/APC/ITO cathode than that of a reference IOSC with a crystalline ITO cathode using the external quantum efficiency of the IOSCs.

Research and Development of High-Strength of Al-Zn-Mg-Cu Alloys

NASA Astrophysics Data System (ADS)

Vakhromov, R. O.; Antipov, V. V.; Tkachenko, E. A.

The paper is focused on high-strength alloys (UTS=600-650 MPa, specific strength (UTS/density) 220-230 kN•m/kg) which will allow one to retain aluminum's predominant position during the next 15-20 years as applied in advanced aircraft primary structures. Parameters of microstructure (dispersoids, precipitates, degree of recrystallisation, grain size) and properties of semiproducts were studied in dependence on content of base alloying elements in chemical compositions of alloys (total sum of Zn+Mg+Cu — higher than 10 % mass). Contribution of minor additions (Zr, Sc, Ag) to strengthening and creation of improved combination of service properties was investigated. Evolution of phase composition and properties was studied as a dependence of different aging treatments.

Effect of Post-Braze Heat Treatment on the Microstructure and Shear Strength of Cemented Carbide and Steel Using Ag-Based Alloy

NASA Astrophysics Data System (ADS)

Winardi, Y.; Triyono; Muhayat, N.

2018-03-01

The aim of the present study was to investigate the effect temperature of heat treatment process on the interfacial microstructure and mechanical properties of cemented carbide/carbon steel single lap joint brazed using Ag based alloy filler metal. The brazing process was carried out using torch brazing. Heat treatment process was carried out in induction furnace on the temperature of 700, 725, and 750°C, for 30 minutes. Microstructural examinations and phase analysis were performed using scanning electron microscopy (SEM) equipped with energy dispersion spectrometry (EDS). Shear strength of the joints was measured by the universal testing machine. The results of the microstructural analyses of the brazed area indicate that the increase temperature of treatment lead to the increase of solid solution phase of enrichted Cu. Based on EDS test, the carbon elements spread to all brazed area, which is disseminated by base metals. Shear strength joint is increased with temperature treatment. The highest shear strength of the brazed joint was 214,14 MPa when the heated up at 725°C.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

PubMed Central

Leong, Yee Mei; Haseeb, A.S.M.A.

2016-01-01

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

Decomposition of Ag-based soldering alloys used in space maintainers after intra-oral exposure. A retrieval analysis study.

PubMed

Soteriou, Despo; Ntasi, Argyro; Papagiannoulis, Lisa; Eliades, Theodore; Zinelis, Spiros

2014-02-01

The aim of this study was to evaluate the elemental alterations of Ag soldering alloys used in space maintainers after intra-oral exposure. Twenty devices were fabricated by using two different soldering alloys; US (Dentaurum Universal Silver Solder, n = 10) and OS (Leone Orthodontic Solder, n = 10). All devices were manufactured by the same technician. Surface morphology and elemental quantitative analysis of the soldering alloys before and after intra-oral placement in patients was determined by scanning electron microscopy and energy-dispersive X-ray microanalysis (SEM/EDX). Statistical analysis was performed by t-test, Mann Whitney tests and Pearson's correlation. For all tests a 95% confidence level was used (α = 0.05). Both soldering alloys demonstrated substantially increase in surface roughness after intra-oral aging. Statistical analysis illustrated a significant decrease in the Cu and Zn content after treatment. OS demonstrated higher Cu release than US (p < 0.05). The remaining relative concentrations of Cu and Zn after the treatment did not show any correlation (p > 0.05) with intra-oral exposure time, apart from Zn in OS (r = 0.840, p = 0.04). Both soldering alloys demonstrated a significant Cu and Zn reduction after intra-oral exposure that may raise biocompatibility concerns.

Effect of Cu content on wear resistance and mechanical behavior of Ti-Cu binary alloys

NASA Astrophysics Data System (ADS)

Yu, Feifei; Wang, Hefeng; Yuan, Guozheng; Shu, Xuefeng

2017-04-01

Arc melting with nonconsumable tungsten electrode and water-cooled copper crucible was used to fabricate Ti-Cu binary alloys with different Cu contents in an argon atmosphere. The compositions and phase structures of the fabricated alloys were investigated by glow discharge optical emission spectroscopy (GDOES) and X-ray diffraction (XRD). Nanoindentation tests through continuous stiffness measurement were then performed at room temperature to analyze the mechanical behaviors of the alloys. Results indicated that the composition of each Ti-Cu binary alloy was Ti(100- x) Cu x ( x = 43, 60, 69, and 74 at.%). The XRD analysis results showed that the alloys were composed of different phases, indicating that different Cu contents led to the variations in alloy hardness. The wear tests results revealed that elemental Cu positively affects the wear resistance properties of the Ti-Cu alloys. Nanoindentation testing results showed that the moduli of the Ti-Cu alloys were minimally changed at increasing Cu content, whereas their hardness evidently increased according to the wear test results.

Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

NASA Astrophysics Data System (ADS)

Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

2016-08-01

Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

Strain softening during tension in cold drawn Cu–Ag alloys

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chang, L.L., E-mail: lilichang@sdu.edu.cn; Wen, S.; Li, S.L.

2015-10-15

Experiments were conducted on Cu–0.1wt.%Ag alloys to evaluate the influence of producing procedures and annealing conditions on microstructure evolution and mechanical properties of Cu–Ag alloys. Optical microscopy (OM), electron back-scattered diffraction (EBSD), X-ray diffraction (XRD) and transmission electron microscopy (TEM) were used for microstructural evaluation and mechanical properties were characterized by tensile tests. The results indicated that hot-extruded Cu–Ag alloys had a typical dynamic recrystallized microstructure with equiaxed grains. Cold drawing at room temperature leaded to partial recrystallized microstructure with a mixture of coarse and fine grains. The dominate {001}<100 > cubic texture formed during hot extrusion was changed tomore » be {112}<111 > copper texture by cold drawing. Strain softening occurred during room temperature tension of cold drawn Cu–Ag alloys with an average grain size of 13–19.7 μm. - Highlights: • Strain softening occurred during tension of Cu–Ag alloys with coarse grain size. • Work hardening was observed in hot-extruded and annealed Cu–0.1wt.%Ag alloys. • Strain softening was ascribed to dynamic recovery and dynamic recrystallization.« less

Modulation of Morphology and Optical Property of Multi-Metallic PdAuAg and PdAg Alloy Nanostructures

NASA Astrophysics Data System (ADS)

Pandey, Puran; Kunwar, Sundar; Sui, Mao; Bastola, Sushil; Lee, Jihoon

2018-05-01

In this work, the evolution of PdAg and PdAuAg alloy nanostructures is demonstrated on sapphire (0001) via the solid-state dewetting of multi-metallic thin films. Various surface configurations, size, and arrangements of bi- and tri-metallic alloy nanostructures are fabricated as a function of annealing temperature, annealing duration, film thickness, and deposition arrangements such as bi-layers (Pd/Ag), tri-layers (Pd/Au/Ag), and multi-layers (Pd/Au/Ag × 5). Specifically, the tri-layers film shows the gradual evolution of over-grown NPs, voids, wiggly nanostructures, and isolated PdAuAg alloy nanoparticles (NPs) along with the increased annealing temperature. In contrast, the multi-layers film with same thickness show the enhanced dewetting rate, which results in the formation of voids at relatively lower temperature, wider spacing, and structural regularity of alloy NPs at higher temperature. The dewetting enhancement is attributed to the increased number of interfaces and reduced individual layer thickness, which aid the inter-diffusion process at the initial stage. In addition, the time evolution of the Pd150 nm/Ag80 nm bi-layer films at constant temperature show the wiggly-connected and isolated PdAg alloy NPs. The overall evolution of alloy NPs is discussed based on the solid-state dewetting mechanism in conjunction with the diffusion, inter-diffusion, alloying, sublimation, Rayleigh instability, and surface energy minimization. Depending upon their surface morphologies, the bi- and tri-metallic alloy nanostructures exhibit the dynamic reflectance spectra, which show the formation of dipolar (above 700 nm) and quadrupolar resonance peaks ( 380 nm) and wide dips in the visible region as correlated to the localized surface plasmon resonance (LSPR) effect. An absorption dip is readily shifted from 510 to 475 nm along with the decreased average size of alloy nanostructures.

Characterization and device performance of (AgCu)(InGa)Se2 absorber layers

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hanket, Gregory; Boyle, Jonathan H.; Shafarman, William N.

The study of (AgCu)(InGa)Se2 absorber layers is of interest in that Ag-chalcopyrites exhibit both wider bandgaps and lower melting points than their Cu counterparts. (AgCu)(InGa)Se2 absorber layers were deposited over the composition range 0 < Ag/(Ag+Cu) < 1 and 0.3 < Ga/(In+Ga) < 1.0 using a variety of elemental co-evaporation processes. Films were found to be singlephase over the entire composition range, in contrast to prior studies. Devices with Ga content 0.3 < Ga/(In+Ga) <0.5 tolerated Ag incorporation up to Ag/(Ag+Cu) = 0.5 without appreciable performance loss. Ag-containing films with Ga/(In+Ga) = 0.8 showed improved device characteristics over Cu-only controlmore » samples, in particular a 30-40% increase in short-circuit current. An absorber layer with composition Ag/(Ag+Cu) = 0.75 and Ga/(In+Ga) = 0.8 yielded a device with VOC = 890 mV, JSC = 20.5mA/cm2, fill factor = 71.3%, and η = 13.0%.« less

Co-Precipitation, Strength and Electrical Resistivity of Cu–26 wt % Ag–0.1 wt % Fe Alloy

PubMed Central

Li, Rui; Wang, Engang

2017-01-01

Both a Cu–26 wt % Ag (Fe-free) alloy and Cu–26 wt % Ag–0.1 wt % Fe (Fe-doping) alloy were subjected to different heat treatments. We studied the precipitation kinetics of Ag and Cu, microstructure evolution, magnetization, hardness, strength, and electrical resistivity of the two alloys. Fe addition was incapable of changing the precipitation kinetics of Ag and Cu; however, it decreased the size and spacing of rod-shaped Ag precipitates within a Cu matrix, because Fe might affect the elastic strain field and diffusion field, suppressing the nucleation of Ag precipitates. Magnetization curves showed that γ-Fe precipitates were precipitated out of the Cu matrix, along with Ag precipitates in Fe-doping alloy after heat treatments. The yield strength of the Fe-doping alloy was higher than that of the Fe-free alloy, and the maximum increment was about 41.3%. The electrical conductivity in the aged Fe-doping alloy was up to about 67% IACS (International Annealed Copper Standard). Hardness, strength, and electrical resistivity were intensively discussed, based on the microstructural characterization and solute contributions of both alloys. Our results demonstrated that an increasing fraction of nanoscale γ-Fe precipitates and decreasing spacing between Ag precipitates resulted in the increasing strength of the Fe-doping alloy. PMID:29207505

Modulation of Morphology and Optical Property of Multi-Metallic PdAuAg and PdAg Alloy Nanostructures.

PubMed

Pandey, Puran; Kunwar, Sundar; Sui, Mao; Bastola, Sushil; Lee, Jihoon

2018-05-16

In this work, the evolution of PdAg and PdAuAg alloy nanostructures is demonstrated on sapphire (0001) via the solid-state dewetting of multi-metallic thin films. Various surface configurations, size, and arrangements of bi- and tri-metallic alloy nanostructures are fabricated as a function of annealing temperature, annealing duration, film thickness, and deposition arrangements such as bi-layers (Pd/Ag), tri-layers (Pd/Au/Ag), and multi-layers (Pd/Au/Ag × 5). Specifically, the tri-layers film shows the gradual evolution of over-grown NPs, voids, wiggly nanostructures, and isolated PdAuAg alloy nanoparticles (NPs) along with the increased annealing temperature. In contrast, the multi-layers film with same thickness show the enhanced dewetting rate, which results in the formation of voids at relatively lower temperature, wider spacing, and structural regularity of alloy NPs at higher temperature. The dewetting enhancement is attributed to the increased number of interfaces and reduced individual layer thickness, which aid the inter-diffusion process at the initial stage. In addition, the time evolution of the Pd 150 nm /Ag 80 nm bi-layer films at constant temperature show the wiggly-connected and isolated PdAg alloy NPs. The overall evolution of alloy NPs is discussed based on the solid-state dewetting mechanism in conjunction with the diffusion, inter-diffusion, alloying, sublimation, Rayleigh instability, and surface energy minimization. Depending upon their surface morphologies, the bi- and tri-metallic alloy nanostructures exhibit the dynamic reflectance spectra, which show the formation of dipolar (above 700 nm) and quadrupolar resonance peaks (~ 380 nm) and wide dips in the visible region as correlated to the localized surface plasmon resonance (LSPR) effect. An absorption dip is readily shifted from ~ 510 to ~ 475 nm along with the decreased average size of alloy nanostructures.

Alternatives for joining Si wafers to strain-accommodating Cu for high-power electronics

NASA Astrophysics Data System (ADS)

Faust, Nicholas; Messler, Robert W.; Khatri, Subhash

2001-10-01

Differences in the coefficients of thermal expansion (CTE) between silicon wafers and underlying copper electrodes have led to the use of purely mechanical dry pressure contacts for primary electrical and thermal connections in high-power solid-state electronic devices. These contacts are limited by their ability to dissipate I2R heat from within the device and by their thermal fatigue life. To increase heat dissipation and effectively deal with the CTE mismatch, metallurgical bonding of the silicon to a specially-structured, strain-accommodating copper electrode has been proposed. This study was intended to seek alternative methods for and demonstrate the feasibility of bonding Si to structured Cu in high-power solid-state devices. Three different but fundamentally related fluxless approaches identified and preliminarily assessed were: (1) conventional Sn-Ag eutectic solder; (2) a new, commercially-available active solder based on the Sn-Ag eutectic; and (3) solid-liquid interdiffusion bonding using the Au-In system. Metallurgical joints were made with varying quality levels (according to nonde-structive ultrasonic C-scan mapping, SEM, and electron microprobe) using each approach. Mechanical shear testing resulted in cohesive failure within the Si or the filler alloys. The best approach, in which eutectic Sn-Ag solder in pre-alloyed foil form was employed on Si and Cu substrates metallized (from the substrate outward) with Ti, Ni and Au, exhibited joint thermal conduction 74% better than dry pressure contacts.

Structure of dental gallium alloys.

PubMed

Herø, H; Simensen, C J; Jørgensen, R B

1996-07-01

The interest in gallium alloys as a replacement for amalgam has increased in recent years due to the risk of environmental pollution from amalgam. Alloy powders with compositions close to those for alloys of amalgam are mixed with a liquid gallium alloy. The mix is condensed into a prepared cavity in much the same way as for amalgam. The aim of the present work was to study the structure of: (1) two commercial alloy powders containing mainly silver, tin and copper, and (2) the phases formed by mixing these powders with a liquid alloy of gallium, indium and tin. One of the alloy powders contained 9 wt% palladium. Cross-sections of cylindrical specimens made by these gallium mixes were investigated by scanning electron microscopy, energy dispersive spectroscopy and X-ray diffraction. Discrete grains of the following phases were found to be present in both gallium alloys: hexagonal Ag2Ga, tetragonal Cu(Pd)Ga2, cubic Ag9In4 and tetragonal beta-Sn. Indications of hexagonal or orthorhombic Ag2Sn were found in the remaining, unreacted alloy particles. In the palladium-containing alloy the X-ray reflections indicate a minor fraction of cubic Cu9Ga4 in addition to the Cu(Pd)Ga2 phase. Particles of beta-Sn are probably precipitated because Sn-Ga phases cannot be formed according to the binary phase diagram.

Compatibility between Co-Metallized PbTe Thermoelectric Legs and an Ag-Cu-In Brazing Alloy.

PubMed

Ben-Ayoun, Dana; Sadia, Yatir; Gelbstein, Yaniv

2018-01-10

In thermoelectric (TE) generators, maximizing the efficiency of conversion of direct heat to electricity requires the reduction of any thermal and electrical contact resistances between the TE legs and the metallic contacts. This requirement is especially challenging in the development of intermediate to high-temperature TE generators. PbTe-based TE materials are known to be highly efficient up to temperatures of around 500 °C; however, only a few practical TE generators based on these materials are currently commercially available. One reason for that is the insufficient bonding techniques between the TE legs and the hot-side metallic contacts. The current research is focused on the interaction between cobalt-metallized n -type 9.104 × 10 -3 mol % PbI₂-doped PbTe TE legs and the Ag 0.32 Cu 0.43 In 0.25 brazing alloy, which is free of volatile species. Clear and fine interfaces without any noticeable formation of adverse brittle intermetallic compounds were observed following prolonged thermal treatment testing. Moreover, a reasonable electrical contact resistance of ~2.25 mΩmm² was observed upon brazing at 600 °C, highlighting the potential of such contacts while developing practical PbTe-based TE generators.

Distribution of Ag in Cu-sulfides in Kupferschiefer deposit, SW Poland

NASA Astrophysics Data System (ADS)

Kozub, Gabriela A.

2014-05-01

The Cu-Ag Kupferschiefer deposit located at the Fore-Sudetic Monocline (SW Poland) is a world class deposit of stratabound type. The Cu-Ag mineralization in the deposit occurs in the Permian sedimentary rocks (Rotliegend and Zechstein) in three lithological types of ore: the dolomite, the black shale and the sandstone. Silver, next to copper, is the most important element in the Kupferschiefer deposit (Salamon 1979; Piestrzyński 2007; Pieczonka 2011). Although occurrence of the Ag-minerals such as native silver, silver amalgams, stromeyerite, jalpaite and mckinstryite, silver is mainly present in the deposit due to isomorphic substitutions in Cu-minerals such as chalcocite, bornite, tennantite, covellite and chalcopyrite. The aim of the study was to define distribution of silver in Cu-minerals and correlate occurrence of Ag-enriched Cu-sulfides with native silver and silver amalgams. Identification of minerals and textural observation were performed using field emission scanning electron microscope. Analyzes of chemical composition of Cu-sulfides were performed utilizing electron microprobe. Silver concentration in Cu sulfides ranges from 0.1 to 10.4 wt.% in chalcocite, 0.2-15.8 wt.% in bornite, 0.1-2.9 wt.% in tennantite, 0.05-0.3 wt.% in chalcopyrite and ca. 0.4 wt.% in covellite. In general, distribution of silver in Cu-minerals is irregular, as indicated by high variations of Ag concentration in each mineral. Content of Ag in Cu-sulphides, in samples where native silver and silver amalgams are not found, is lower than in samples, where native silver and silver amalgams are noted. The chemical analyzes of Ag-bearing Cu-minerals indicate decrease of Cu content in minerals with high Ag concentration. In such case, decrease of Fe content is also noted in bornite. Lack of micro-inclusions of the native silver or silver amalgams in the Cu-minerals indicates that presence of Ag is mainly related to the isomorphic substitutions. This is in agreement with previous

Corrosion characteristics of alpha-Ti and Ti2Cu composing Ti-Cu alloys.

PubMed

Takada, Yukyo; Okuno, Osamu

2005-12-01

A series of binary Ti-Cu alloys containing 5-20 mass% Cu was prepared, and the corrosion behavior of alpha-Ti and Ti2Cu composing the Ti-Cu alloys were examined based on the anodic polarization curves and released ions in 0.9% NaCl and 1% lactic acid solutions. In both solutions, the Ti-Cu alloys showed the same anodic polarization curves as titanium in the condition below 1.4 V. However, precipitation of Ti2Cu contributed to a small increase in current densitiy in the transpassive region beyond 1.4 V. The amount of Cu ions released from Ti2Cu was 0.260 and 1.003 (microg/cm2/7 days) in 0.9% NaCl and 1% lactic acid solutions respectively. Although these values were larger than those from alpha-Ti (0.0379 +/- 0.0041 and 0.0962 +/- 0.0327 (microg/cm2/7days) in NaCl and lactic acid solutions respectively), they were not greater than those from type 4 gold alloy under the same conditions.

Study of thermal stability of disordered alloy AgxCu1-x nanoparticles by molecular dynamic simulations

NASA Astrophysics Data System (ADS)

Baidyshev, V. S.; Chepkasov, I. V.; Artemova, N. D.

2018-05-01

In this paper melting processes of particles of disordered AgCu alloy in the size range of D=3-5 nm were investigated. The simulation was carried out with molecular dynamics, using the embedded atom potential. It was defined that for nanoparticles of D=3 nm, the melting process is connected with the formation of the outer layer consisting of Ag atoms as well as with the further transition of the particle into an amorphous state. The increase of the particle size to D=5 nm did not show the processes of redistributing Ag atoms on the particle surface.

Enhanced catalyst activity by decorating of Au on Ag@Cu2O nanoshell

NASA Astrophysics Data System (ADS)

Chen, Lei; Liu, Maomao; Zhao, Yue; Kou, Qiangwei; Wang, Yaxin; Liu, Yang; Zhang, Yongjun; Yang, Jinghai; Jung, Young Mee

2018-03-01

We successfully synthesized Au-decorated Ag@Cu2O heterostructures via a simple galvanic replacement method. As the Au precursor concentration increased, the density of the Au nanoparticles (NPs) on the Ag@Cu2O surface increased, which changed the catalytic activity of the Ag@Cu2O-Au structure. The combination of Au, Ag, and Cu2O exhibited excellent catalytic properties, which can further effect on the catalyst activity of the Ag@Cu2O-Au structure. In addition, the proposed Ag@Cu2O-Au nanocomposite was used to transform the organic, toxic pollutant, 4-nitrophenol (4-NP), into its nontoxic and medicinally important amino derivative via a catalytic reduction to optimize the material performance. The proposed Au-decorated Ag@Cu2O exhibited excellent catalytic activity, and the catalytic reduction time greatly decreased (5 min). Thus, three novel properties of Ag@Cu2O-Au, i.e., charge redistribution and transfer, adsorption, and catalytic reduction of organic pollutants, were ascertained for water remediation. The proposed catalytic properties have potential applications for photocatalysis and localized surface plasmon resonance (LSPR)- and peroxidase-like catalysis.

Elastocaloric effect in CuAlZn and CuAlMn shape memory alloys under compression

PubMed Central

Qian, Suxin; Wang, Yi; Pillsbury, Thomas E.; Hada, Yoshiharu; Yamaguchi, Yuki; Fujimoto, Kenjiro; Hwang, Yunho; Radermacher, Reinhard; Cui, Jun; Yuki, Yoji; Toyotake, Koutaro; Takeuchi, Ichiro

2016-01-01

This paper reports the elastocaloric effect of two Cu-based shape memory alloys: Cu68Al16Zn16 (CuAlZn) and Cu73Al15Mn12 (CuAlMn), under compression at ambient temperature. The compression tests were conducted at two different rates to approach isothermal and adiabatic conditions. Upon unloading at a strain rate of 0.1 s−1 (adiabatic condition) from 4% strain, the highest adiabatic temperature changes (ΔTad) of 4.0 K for CuAlZn and 3.9 K for CuAlMn were obtained. The maximum stress and hysteresis at each strain were compared. The stress at the maximum recoverable strain of 4.0% for CuAlMn was 120 MPa, which is 70% smaller than that of CuAlZn. A smaller hysteresis for the CuAlMn alloy was also obtained, about 70% less compared with the CuAlZn alloy. The latent heat, determined by differential scanning calorimetry, was 4.3 J g−1 for the CuAlZn alloy and 5.0 J g−1 for the CuAlMn alloy. Potential coefficients of performance (COPmat) for these two alloys were calculated based on their physical properties of measured latent heat and hysteresis, and a COPmat of approximately 13.3 for CuAlMn was obtained. This article is part of the themed issue ‘Taking the temperature of phase transitions in cool materials’. PMID:27402936

Soft Phonon Modes Leading to Ultralow Thermal Conductivity and High Thermoelectric Performance in AgCuTe.

PubMed

Roychowdhury, Subhajit; Jana, Manoj K; Pan, Jaysree; Guin, Satya N; Sanyal, Dirtha; Waghmare, Umesh V; Biswas, Kanishka

2018-04-03

Crystalline solids with intrinsically low lattice thermal conductivity (κ L ) are crucial to realizing high-performance thermoelectric (TE) materials. Herein, we show an ultralow κ L of 0.35 Wm -1  K -1 in AgCuTe, which has a remarkable TE figure-of-merit, zT of 1.6 at 670 K when alloyed with 10 mol % Se. First-principles DFT calculation reveals several soft phonon modes in its room-temperature hexagonal phase, which are also evident from low-temperature heat-capacity measurement. These phonon modes, dominated by Ag vibrations, soften further with temperature giving a dynamic cation disorder and driving the superionic transition. Intrinsic factors cause an ultralow κ L in the room-temperature hexagonal phase, while the dynamic disorder of Ag/Cu cations leads to reduced phonon frequencies and mean free paths in the high-temperature rocksalt phase. Despite the cation disorder at elevated temperatures, the crystalline conduits of the rigid anion sublattice give a high power factor. © 2018 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Effect of Ag as a surfactant on the thermal stability in Cu/Co multilayers

NASA Astrophysics Data System (ADS)

Gupta, M.; Gupta, A.; Amir, S. M.; Stahn, J.; Zegenhagen, J.

2010-02-01

In the present work we studied the effect of Ag as a surfactant in Cu/Co multilayers prepared by ion beam sputtering. Two identical samples of Cu/Co multilayers with 0.2nm Ag on a Cu buffer layer and without this Ag layer were deposited on Si substrates. It is known that Cu has a lower free energy than Co, and therefore, the Cu/Co interfaces are not symmetric. Addition of Ag alters the kinetics and thermodynamics of the growth and triggers the layer by layer growth as Ag floats on the growing front balancing the surface free energy of Cu and Co. It was found that with addition of Ag surfactant the thermal stability of Cu/Co multilayer improves.

Energetics of the formation of Cu-Ag core–shell nanoparticles

DOE PAGES

Chandross, Michael

2014-10-06

Our work presents molecular dynamics and Monte Carlo simulations aimed at developing an understanding of the formation of core–shell Cu-Ag nanoparticles. The effects of surface and interfacial energies were considered and used to form a phenomenological model that calculates the energy gained upon the formation of a core–shell structure from two previously distinct, non-interacting nanoparticles. In most cases, the core–shell structure was found to be energetically favored. Specifically, the difference in energy as a function of the radii of the individual Cu and Ag particles was examined, with the assumption that a core–shell structure forms. In general, it was foundmore » that the energetic gain from forming such a structure increased with increasing size of the initial Ag particle. This result was interpreted as a result of the reduction in surface energy. Moreover, for two separate particles, both Cu and Ag contribute to the surface energy; however, for a core–shell structure, the only contribution to the surface energy is from the Ag shell and the Cu contribution is changed to a Cu–Ag interfacial energy, which is always smaller.« less

Modified pulse laser deposition of Ag nanostructure as intermediate for low temperature Cu-Cu bonding

NASA Astrophysics Data System (ADS)

Liu, Ziyu; Cai, Jian; Wang, Qian; Liu, Lei; Zou, Guisheng

2018-07-01

To lower the Cu-Cu bonding temperature and save the time of the bonding process applied for 3D integration, the Ag nanostructure deposited by pulsed laser deposition (PLD) was designed and decorated on the Cu pads as intermediate. Influences of different PLD process parameters on the designed Ag nanostructure morphology were investigated in this work. The large nanoparticles (NP) defects, NPs coverage rate on the Cu pad, and NPs size distribution were adopted to evaluate the PLD parameters based on the NPs morphology observation and the Cu-Cu bonding quality. The medium laser power of 0.8 W, smaller distance between target and substrate, and protective container should be applied in the optimized PLD to obtain the Ag nanostructure. Then a loose 3D mesh Ag nanostructure consisted of the protrusions and grooves was formed and the morphology observation proved the nanostructure deposition mechanism was contributed to the block of nano-film nucleation and nanoparticles absorption. Finally, the relationship between the bonding temperature and pressure suitable for the Ag nanostructure had been determined based on shear strength and interface observation. The results revealed the combination of higher bonding temperature (250 °C) and lower pressure (20 MPa), or lower bonding temperature (180 °C) and higher pressure (50 MPa) can both achieve the bonding process with the short bonding time of 5 min and annealing at 200 °C for 25 min in vacuum furnace.

Microstructure and Properties of Ternary Cu-Ti-Sn Alloy

NASA Astrophysics Data System (ADS)

Wang, Xianhui; Chen, Chunyu; Guo, Tingting; Zou, Juntao; Yang, Xiaohong

2015-07-01

The effect of Sn addition and heat treatment on the microstructure and properties of Cu-3Ti and Cu-2Ti alloys was studied. The microstructure and phase constituents were characterized by an optical microscope, x-ray diffractometer, and transmission electron microscope, and the electrical conductivity and hardness were determined as well. The results show that the as-cast microstructure of Cu-Ti-Sn alloys consists of α-Cu(Ti,Sn) and primary CuSn3Ti5 intermetallic compound. CuSn3Ti5 phase has a hexagonal structure with the lattice parameters a = 0.81737 nm, b = 0.81737 nm, and c = 0.55773 nm. With the increase of aging time, the electrical conductivity progressively increases, while the hardness increases and then decreases. After aging at 450 °C for 8 h, Cu-3Ti-2Sn alloy has an electrical conductivity of 23.1 MS/m and a hardness of 134.5 HV, and the electrical conductivity and hardness of Cu-2Ti-2Sn alloy are 21.5 MS/m and 119.3 HV, respectively. An appropriate aging is beneficial for the precipitation of coherent metastable β'-Cu4Ti phase, which can strengthen Cu-3Ti-2Sn and Cu-2Ti-2Sn alloys. However, a prolonged aging time results in the decrease of hardness due to the formation of incoherent equilibrium β-Cu3Ti phase. The presence of CuSn3Ti5 phase reduces the solute Ti content in the copper matrix and, thus, gives rise to the increase of the electrical conductivity of Cu-Ti-Sn alloys.

Comparison of the early stages of condensation of Cu and Ag on Mo/100/ with Cu and Ag on W/100/

NASA Technical Reports Server (NTRS)

Soria, F.; Poppa, H.

1980-01-01

The adsorption and condensation of Cu and Ag, up to several monolayers in thickness, onto Mo(100) has been observed at pressures below 2 times 10 to the -10th torr in a study that used combined LEED, Auger, TDS (Thermal Desorption Spectroscopy), and work function measurements in a single experimental setup. The results show that Cu behaves similarly on Mo(100) and W(100) substrates, while some differences are found for Ag adsorption.

Synthesis of porous Cu from Al-Cu-Co decagonal quasicrystalline alloys

NASA Astrophysics Data System (ADS)

Kalai Vani, V.; Kwon, O. J.; Hong, S. M.; Fleury, E.

2011-07-01

The formation of a porous Cu structure from cast Al-Cu-Co decagonal quasicrystalline alloys has been studied using a selective corrosion technique. Two alkaline solutions were selected based on the electrochemical properties of the constituent elements. Selective corrosion of Al and Co was achieved by chemical immersion of the cast Al-Cu-Co alloy in both 5 M NaOH and 0.5 M Na2CO3 solutions; values for BET surface-to-weight ratio of up to 30 m2/g could be reached. Microstructural analyses indicated that the architecture of the resulting porous structures was composed of a needle-type phase, remaining from the decagonal phase, in addition to Cu and Cu-Co phases.

Fabrication of Cu-Ag core-shell bimetallic superfine powders by eco-friendly reagents and structures characterization

NASA Astrophysics Data System (ADS)

Zhao, Jun; Zhang, Dongming; Zhao, Jie

2011-09-01

Superfine bimetallic Cu-Ag core-shell powders were synthesized by reduction of copper sulfate pentahydrate and silver nitrate with eco-friendly ascorbic acid as a reducing agent and cyclodextrins as a protective agent in an aqueous system. The influence of Ag/Cu ratio on coatings was investigated. Ag was homogeneously distributed on the surface of Cu particles at a mole ratio of Ag/Cu=1. FE-SEM showed an uniformity of Ag coatings on Cu particles. Antioxidation of Cu particles was improved by increasing Ag/Cu ratio. TEM-EDX and UV-vis spectra also revealed that Cu cores were covered by Ag nanoshells on the whole. The surface composition analysis by XPS indicated that only small parts of Cu atoms in the surface were oxidized. It was noted that the hindrance of cyclodextrins chemisorbed on particles plays an important role in forming high quality and good dispersity Cu-Ag (Cu@Ag) core-shell powders.

Silver contents and Cu/Ag ratios in Martian meteorites and the implications for planetary differentiation

NASA Astrophysics Data System (ADS)

Wang, Zaicong; Becker, Harry

2017-11-01

Silver and Cu show very similar partitioning behavior in sulfide melt-silicate melt and metal-silicate systems at low and high pressure-temperature (P-T) experimental conditions, implying that mantle melting, fractional crystallization and core-mantle differentiation have at most modest (within a factor of 3) effects on Cu/Ag ratios. For this reason, it is likely that Cu/Ag ratios in mantle-derived magmatic products of planetary bodies reflect that of the mantle and, in some circumstances, also the bulk planet composition. To test this hypothesis, new Ag mass fractions and Cu/Ag ratios in different groups of Martian meteorites are presented and compared with data from chondrites and samples from the Earth's mantle. Silver contents in lherzolitic, olivine-phyric and basaltic shergottites and nakhlites range between 1.9 and 12.3 ng/g. The data display a negative trend with MgO content and correlate positively with Cu contents. In spite of displaying variable initial Ɛ143Nd values and representing a diverse spectrum of magmatic evolution and physiochemical conditions, shergottites and nakhlites display limited variations of Cu/Ag ratios (1080 ± 320, 1 s, n = 14). The relatively constant Cu/Ag suggests limited fractionation of Ag from Cu during the formation and evolution of the parent magmas, irrespectively of whether sulfide saturation was attained or not. The mean Cu/Ag ratio of Martian meteorites thus reflects that of the Martian mantle and constrains its Ag content to 1.9 ± 0.7 ng/g (1 s). Carbonaceous and enstatite chondrites display a limited range of Cu/Ag ratios of mostly 500-2400. Ordinary chondrites show a larger scatter of Cu/Ag up to 4500, which may have been caused by Ag redistribution during parent body metamorphism. The majority of chondrites have Cu/Ag ratios indistinguishable from the Martian mantle value, indicating that Martian core formation strongly depleted Cu and Ag contents, but probably did not significantly change the Cu/Ag ratio of the

Microstructure, mechanical properties, bio-corrosion properties and antibacterial properties of Ti-Ag sintered alloys.

PubMed

Chen, Mian; Zhang, Erlin; Zhang, Lan

2016-05-01

In this research, Ag element was selected as an antibacterial agent to develop an antibacterial Ti-Ag alloy by a powder metallurgy. The microstructure, phase constitution, mechanical properties, corrosion resistance and antibacterial properties of the Ti-Ag sintered alloys have been systematically studied by X-ray diffraction (XRD), scanning electron microscope (SEM), compressive test, electrochemical measurements and antibacterial test. The effects of the Ag powder size and the Ag content on the antibacterial property and mechanical property as well as the anticorrosion property have been investigated. The microstructure results have shown that Ti-Ag phase, residual pure Ag and Ti were the mainly phases in Ti-Ag(S75) sintered alloy while Ti2Ag was synthesized in Ti-Ag(S10) sintered alloy. The mechanical test indicated that Ti-Ag sintered alloy showed a much higher hardness and the compressive yield strength than cp-Ti but the mechanical properties were slightly reduced with the increase of Ag content. Electrochemical results showed that Ag powder size had a significant effect on the corrosion resistance of Ti-Ag sintered alloy. Ag content increased the corrosion resistance in a dose dependent way under a homogeneous microstructure. Antibacterial tests have demonstrated that antibacterial Ti-Ag alloy was successfully prepared. It was also shown that the Ag powder particle size and the Ag content influenced the antibacterial activity seriously. The reduction in the Ag powder size was benefit to the improvement in the antibacterial property and the Ag content has to be at least 3wt.% in order to obtain a strong and stable antibacterial activity against Staphylococcus aureus bacteria. The bacterial mechanism was thought to be related to the Ti2Ag and its distribution. Copyright © 2016 Elsevier B.V. All rights reserved.

Effect of Ag Surfactant on Cu/Co Multilayers Deposited by RF-Ion Beam Sputtering

NASA Astrophysics Data System (ADS)

Amir, S. M.; Gupta, M.; Gupta, A.; Wildes, A.

2011-07-01

In this work, the effect of Ag surfactant in RF-ion beam sputtered Cu/Co multilayers was studied. It was found that when a sub-monolayer of Ag (termed as surfactant) is deposited prior to the deposition of Cu/Co multilayers, the asymmetry in the Cu/Co or Co/Cu interfaces becomes small. Low surface free energy of Ag helps Ag atoms to float when a Cu or Co layer is getting deposited. This balances the difference between the surface free energy of Cu and Co making the interfaces in the multilayers smoother as compared to the case when no Ag surfactant was used.

Laser Brazing Characteristics of Al to Brass with Zn-Based Filler

NASA Astrophysics Data System (ADS)

Tan, Caiwang; Liu, Fuyun; Sun, Yiming; Chen, Bo; Song, Xiaoguo; Li, Liqun; Zhao, Hongyun; Feng, Jicai

2018-05-01

Laser brazing of Al to brass in lap configuration with Zn-based filler was performed in this work. The process parameters including laser power, defocused distance were found to have a significant influence on appearance, microstructure and mechanical properties. The process parameters were optimized to be laser power of 2700 W and defocusing distance of + 40 mm from brass surface. In addition, preheating exerted great influence on wetting and spreading ability of Zn filler on brass surface. The microstructure observation showed the thickness of reaction layer (CuZn phase) at the interface of the brass side would grow with the increase in laser power and the decrease in the laser defocusing distance. Moreover, preheating could increase the spreading area of the filler metal and induced the growth of the reaction layer. The highest tensile-shear load of the joint could reach 2100 N, which was 80% of that of Al alloy base metal. All the joints fractured along the CuZn reaction layer and brass interface. The fracture morphology displayed the characteristics of the cleavage fracture when without preheating before welding, while it displayed the characteristics of the quasi-cleavage fracture with preheating before welding.

Solution-Processed Ag Nanowires + PEDOT:PSS Hybrid Electrode for Cu(In,Ga)Se₂ Thin-Film Solar Cells.

PubMed

Shin, Donghyeop; Kim, Taegeon; Ahn, Byung Tae; Han, Seung Min

2015-06-24

To reduce the cost of the Cu(In,Ga)Se2 (CIGS) solar cells while maximizing the efficiency, we report the use of an Ag nanowires (NWs) + poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) ( PSS) hybrid transparent electrode, which was deposited using all-solution-processed, low-cost, scalable methods. This is the first demonstration of an Ag NWs + PSS transparent electrode applied to CIGS solar cells. The spin-coated 10-nm-thick PSS conducting polymer layer in our hybrid electrode functioned as a filler of empty space of an electrostatically sprayed Ag NW network. Coating of PSS on the Ag NW network resulted in an increase in the short-circuit current from 15.4 to 26.5 mA/cm(2), but the open-circuit voltage and shunt resistance still needed to be improved. The limited open-circuit voltage was found to be due to interfacial recombination that is due to the ineffective hole-blocking ability of the CdS film. To suppress the interfacial recombination between Ag NWs and the CdS film, a Zn(S,O,OH) film was introduced as a hole-blocking layer between the CdS film and Ag NW network. The open-circuit voltage of the cell sharply improved from 0.35 to 0.6 V, which resulted in the best cell efficiency of 11.6%.

Mechanical properties of Al-Cu alloy-SiC composites

DOE Office of Scientific and Technical Information (OSTI.GOV)

Anggara, B. S., E-mail: anggorobs1960@yahoo.com; Handoko, E.; Soegijono, B.

The synthesis of aluminum (Al) alloys, Al-Cu, from mixture 96.2 % Al and 3.8 % Cu has been prepared by melting process at a temperature of 1200°C. The adding 12.5 wt% up to 20 wt% of SiC on Al-Cu alloys samples has been investigated. The structure analyses were examined by X-Ray Diffractometer (XRD) and scanning electron microscope (SEM). Moreover, the morphology of Al-Cu alloys has been seen as structure in micrometer range. The hardness was measured by hardness Vickers method. According to the results, it can be assumed that the 15 wt% of SiC content is prefer content to getmore » better quality of back to back hardness Vickers of Al-Cu alloys.« less

Mechanical properties of Al-Cu alloy-SiC composites

NASA Astrophysics Data System (ADS)

Anggara, B. S.; Handoko, E.; Soegijono, B.

2014-09-01

The synthesis of aluminum (Al) alloys, Al-Cu, from mixture 96.2 % Al and 3.8 % Cu has been prepared by melting process at a temperature of 1200°C. The adding 12.5 wt% up to 20 wt% of SiC on Al-Cu alloys samples has been investigated. The structure analyses were examined by X-Ray Diffractometer (XRD) and scanning electron microscope (SEM). Moreover, the morphology of Al-Cu alloys has been seen as structure in micrometer range. The hardness was measured by hardness Vickers method. According to the results, it can be assumed that the 15 wt% of SiC content is prefer content to get better quality of back to back hardness Vickers of Al-Cu alloys.

Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer

PubMed Central

Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan

2017-01-01

Cu6Sn5 whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag3Sn fibers can be observed around Cu6Sn5 whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu6Sn5 whiskers can be observed, and hexagonal rod structure is the main morphology of Cu6Sn5 whiskers. A hollow structure can be observed in hexagonal Cu6Sn5 whiskers, and a screw dislocation mechanism was used to represent the Cu6Sn5 growth. Based on mechanical property testing and finite element simulation, Cu6Sn5 whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer. PMID:28772686

Copper-based alloys, crystallographic and crystallochemical parameters of alloys in binary systems Cu-Me (Me=Co, Rh, Ir, Cu, Ag, Au, Ni, Pd, Pt)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Porobova, Svetlana, E-mail: porobova.sveta@yandex.ru; Loskutov, Oleg, E-mail: lom58@mail.ru; Markova, Tat’jana, E-mail: patriot-rf@mail.ru

2016-01-15

The article presents the results of the analysis of phase equilibrium of ordered phases in binary systems based on copper Cu- Me (where Me - Co, Rh, Ir, Ag, Au, Ni, Pd, Pt) to find correlations of crystallochemical and crystallographic factors. It is established that the packing index in disordered solid solutions in binary systems based on copper is close to the value of 0.74 against the background of an insignificant deviation of atomic volumes from the Zen’s law.

Thermodynamic Optimization of the Ag-Bi-Cu-Ni Quaternary System: Part I, Binary Subsystems

NASA Astrophysics Data System (ADS)

Wang, Jian; Cui, Senlin; Rao, Weifeng

2018-07-01

A comprehensive literature review and thermodynamic optimization of the phase diagrams and thermodynamic properties of the Ag-Bi, Ag-Cu, Ag-Ni, Bi-Cu, and Bi-Ni binary systems are presented. CALculation of PHAse Diagrams (CALPHAD)-type thermodynamic optimization was carried out to reproduce all available and reliable experimental phase equilibrium and thermodynamic data. The modified quasichemical model was used to model the liquid solution. The compound energy formalism was utilized to describe the Gibbs energies of all terminal solid solutions and intermetallic compounds. A self-consistent thermodynamic database for the Ag-Bi, Ag-Cu, Ag-Ni, Bi-Cu, and Bi-Ni binary subsystems of the Ag-Bi-Cu-Ni quaternary system was developed. This database can be used as a guide for research and development of lead-free solders.

Thermodynamic Optimization of the Ag-Bi-Cu-Ni Quaternary System: Part I, Binary Subsystems

NASA Astrophysics Data System (ADS)

Wang, Jian; Cui, Senlin; Rao, Weifeng

2018-05-01

A comprehensive literature review and thermodynamic optimization of the phase diagrams and thermodynamic properties of the Ag-Bi, Ag-Cu, Ag-Ni, Bi-Cu, and Bi-Ni binary systems are presented. CALculation of PHAse Diagrams (CALPHAD)-type thermodynamic optimization was carried out to reproduce all available and reliable experimental phase equilibrium and thermodynamic data. The modified quasichemical model was used to model the liquid solution. The compound energy formalism was utilized to describe the Gibbs energies of all terminal solid solutions and intermetallic compounds. A self-consistent thermodynamic database for the Ag-Bi, Ag-Cu, Ag-Ni, Bi-Cu, and Bi-Ni binary subsystems of the Ag-Bi-Cu-Ni quaternary system was developed. This database can be used as a guide for research and development of lead-free solders.

Study of austenitic stainless steel welded with low alloy steel filler metal. [tensile and impact strength tests

NASA Technical Reports Server (NTRS)

Burns, F. A.; Dyke, R. A., Jr.

1979-01-01

The tensile and impact strength properties of 316L stainless steel plate welded with low alloy steel filler metal were determined. Tests were conducted at room temperature and -100 F on standard test specimens machined from as-welded panels of various chemical compositions. No significant differences were found as the result of variations in percentage chemical composition on the impact and tensile test results. The weldments containing lower chromium and nickel as the result of dilution of parent metal from the use of the low alloy steel filler metal corroded more severely in a marine environment. The use of a protective finish, i.e., a nitrile-based paint containing aluminum powder, prevented the corrosive attack.

Cesium iodide alloys

DOEpatents

Kim, H.E.; Moorhead, A.J.

1992-12-15

A transparent, strong CsI alloy is described having additions of monovalent iodides. Although the preferred iodide is AgI, RbI and CuI additions also contribute to an improved polycrystalline CsI alloy with outstanding multispectral infrared transmittance properties. 6 figs.

Mechanical Properties of Cu-Cr-Nb Alloys

NASA Technical Reports Server (NTRS)

Ellis, David L.

1997-01-01

The chemical compositions of the alloys are listed. The alloying levels were near the values for stochiometric Cr2Nb. A slight excess of Cr was chosen for increased hydrogen embrittlement resistance. The microstructures of all Cu-Cr-Nb alloys were very similar. Two typical transmission electron microscope (TEM) micrographs are presented. The images show the presence of large mount of Cr2Nb precipitates in a nearly pure Cu matrix. The interactions between dislocations and precipitates are currently under investigations, but as the images demonstrates, the extremely fine (less then 15 nm) Cr2Nb are the primary strengtheners for the alloy.

Kinetic trapping through coalescence and the formation of patterned Ag-Cu nanoparticles

NASA Astrophysics Data System (ADS)

Grammatikopoulos, Panagiotis; Kioseoglou, Joseph; Galea, Antony; Vernieres, Jerome; Benelmekki, Maria; Diaz, Rosa E.; Sowwan, Mukhles

2016-05-01

In recent years, due to its inherent flexibility, magnetron-sputtering has been widely used to synthesise bi-metallic nanoparticles (NPs) via subsequent inert-gas cooling and gas-phase condensation of the sputtered atomic vapour. Utilising two separate sputter targets allows for good control over composition. Simultaneously, it involves fast kinetics and non-equilibrium processes, which can trap the nascent NPs into metastable configurations. In this study, we observed such configurations in immiscible, bi-metallic Ag-Cu NPs by scanning transmission electron microscopy (S/TEM) and electron energy-loss spectroscopy (EELS), and noticed a marked difference in the shape of NPs belonging to Ag- and Cu-rich samples. We explained the formation of Janus or Ag@Cu core/shell metastable structures on the grounds of in-flight mixed NP coalescence. We utilised molecular dynamics (MD) and Monte Carlo (MC) computer simulations to demonstrate that such configurations cannot occur as a result of nanoalloy segregation. Instead, sintering at relatively low temperatures can give rise to metastable structures, which eventually can be stabilised by subsequent quenching. Furthermore, we compared the heteroepitaxial diffusivities along various surfaces of both Ag and Cu NPs, and emphasised the differences between the sintering mechanisms of Ag- and Cu-rich NP compositions: small Cu NPs deform as coherent objects on large Ag NPs, whereas small Ag NPs dissolve into large Cu NPs, with their atoms diffusing along specific directions. Taking advantage of this observation, we propose controlled NP coalescence as a method to engineer mixed NPs of a unique, patterned core@partial-shell structure, which we refer to as a ``glass-float'' (ukidama) structure.In recent years, due to its inherent flexibility, magnetron-sputtering has been widely used to synthesise bi-metallic nanoparticles (NPs) via subsequent inert-gas cooling and gas-phase condensation of the sputtered atomic vapour. Utilising two

Pb-free Sn-Ag-Cu ternary eutectic solder

DOEpatents

Anderson, Iver E.; Yost, Frederick G.; Smith, John F.; Miller, Chad M.; Terpstra, Robert L.

1996-06-18

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

Pb-free Sn-Ag-Cu ternary eutectic solder

DOEpatents

Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.

1996-06-18

A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

Ag- and Cu-doped multifunctional bioactive nanostructured TiCaPCON films

NASA Astrophysics Data System (ADS)

Shtansky, D. V.; Batenina, I. V.; Kiryukhantsev-Korneev, Ph. V.; Sheveyko, A. N.; Kuptsov, K. A.; Zhitnyak, I. Y.; Anisimova, N. Yu.; Gloushankova, N. A.

2013-11-01

A key property of multicomponent bioactive nanostructured Ti(C,N)-based films doped with Ca, P, and O (TiCaPCON) that can be improved further is their antibacterial effect that should be achieved without compromising the implant bioactivity and biocompatibility. The present work is focused on the study of structure, chemical, mechanical, tribological, and biological properties of Ag- and Cu-doped TiCaPCON films. The films with Ag (0.4-4 at.%) and Cu (13 at.%) contents were obtained by simultaneous sputtering of a TiC0.5-Ca3(PO4)2 target and either an Ag or a Cu target. The film structure was studied using X-ray diffraction, transmission and scanning electron microscopy, energy dispersive X-ray spectroscopy, glow discharge optical emission spectroscopy, and Raman-shift and IR spectroscopy. The films were characterized in terms of their hardness, elastic modulus, dynamic impact resistance, friction coefficient and wear rate (both in air and normal saline), surface wettability, electrochemical behavior and Ag or Cu ion release in normal saline. Particular attention was paid to the influence of inorganic bactericides (Ag and Cu ions) on the bactericidal activity against unicellular yeast fungus Saccharomyces cerevisiae and gram-positive bacteria Lactobacillus acidophilus, as well as on the attachment, spreading, actin cytoskeleton organization, focal adhesions, and early stages of osteoblastic cell differentiation. The obtained results show that the Ag-doped films are more suitable for the protection of metallic surfaces against bacterial infection compared with their Cu-doped counterpart. In particular, an excellent combination of mechanical, tribological, and biological properties makes Ag-doped TiCaPCON film with 1.2 at.% of Ag very attractive material for bioengineering and modification of load-bearing metal implant surfaces.

Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO3 solution

NASA Astrophysics Data System (ADS)

Sarveswaran, C.; Othman, N. K.; Ali, M. Yusuf Tura; Ani, F. Che; Samsudin, Z.

2015-09-01

Current issue in lead-free solder in term of its reliability is still under investigation. This high impact research attempts to investigate the electrochemical migration (ECM) on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy by Water Drop Test (WDT) in different concentration of HNO3 solution. The concentration of HNO3 solution used in this research was 0.05, 0.10, 0.50 and 1M. Optical Microscope (OM), Field Emission Scanning Electron Microscope (FESEM) and Energy Dispersive X-Ray Analysis (EDX) were carried out in order to analysis the ECM behavior based on the growth of dendrite formation after WDT. In general, the results demonstrated that dendrite growth is faster in higher concentration compared with low concentration of HNO3. The concentration of HNO3 solution used has a strong correlation with Mean-Time-To-Failure (MTTF). As the concentration of HNO3 increases, the MTTF value decreases. Based on the MTTF results the solder alloy in 1M HNO3 solution is most susceptible to ECM. SnO2 forms as a corrosion by-product in the samples proved by EDX analysis. The solder alloy poses a high reliability risk in microelectronic devices during operation in 1M HNO3 solution.

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

NASA Astrophysics Data System (ADS)

Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.

2016-12-01

To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

Mechanism of abnormally slow crystal growth of CuZr alloy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yan, X. Q.; Lü, Y. J., E-mail: yongjunlv@bit.edu.cn; State Key Laboratory of Silicon Materials, Zhejiang University, Hangzhou 310027

2015-10-28

Crystal growth of the glass-forming CuZr alloy is shown to be abnormally slow, which suggests a new method to identify the good glass-forming alloys. The crystal growth of elemental Cu, Pd and binary NiAl, CuZr alloys is systematically studied with the aid of molecular dynamics simulations. The temperature dependence of the growth velocity indicates the different growth mechanisms between the elemental and the alloy systems. The high-speed growth featuring the elemental metals is dominated by the non-activated collision between liquid-like atoms and interface, and the low-speed growth for NiAl and CuZr is determined by the diffusion across the interface. Wemore » find that, in contrast to Cu, Pd, and NiAl, a strong stress layering arisen from the density and the local order layering forms in front of the liquid-crystal interface of CuZr alloy, which causes a slow diffusion zone. The formation of the slow diffusion zone suppresses the interface moving, resulting in much small growth velocity of CuZr alloy. We provide a direct evidence of this explanation by applying the compressive stress normal to the interface. The compression is shown to boost the stress layering in CuZr significantly, correspondingly enhancing the slow diffusion zone, and eventually slowing down the crystal growth of CuZr alloy immediately. In contrast, the growth of Cu, Pd, and NiAl is increased by the compression because the low diffusion zones in them are never well developed.« less

Influence of Filler Alloy Composition and Process Parameters on the Intermetallic Layer Thickness in Single-Sided Cold Metal Transfer Welding of Aluminum-Steel Blanks

NASA Astrophysics Data System (ADS)

Silvayeh, Zahra; Vallant, Rudolf; Sommitsch, Christof; Götzinger, Bruno; Karner, Werner; Hartmann, Matthias

2017-11-01

Hybrid components made of aluminum alloys and high-strength steels are typically used in automotive lightweight applications. Dissimilar joining of these materials is quite challenging; however, it is mandatory in order to produce multimaterial car body structures. Since especially welding of tailored blanks is of utmost interest, single-sided Cold Metal Transfer butt welding of thin sheets of aluminum alloy EN AW 6014 T4 and galvanized dual-phase steel HCT 450 X + ZE 75/75 was experimentally investigated in this study. The influence of different filler alloy compositions and welding process parameters on the thickness of the intermetallic layer, which forms between the weld seam and the steel sheet, was studied. The microstructures of the weld seam and of the intermetallic layer were characterized using conventional optical light microscopy and scanning electron microscopy. The results reveal that increasing the heat input and decreasing the cooling intensity tend to increase the layer thickness. The silicon content of the filler alloy has the strongest influence on the thickness of the intermetallic layer, whereas the magnesium and scandium contents of the filler alloy influence the cracking tendency. The layer thickness is not uniform and shows spatial variations along the bonding interface. The thinnest intermetallic layer (mean thickness < 4 µm) is obtained using the silicon-rich filler Al-3Si-1Mn, but the layer is more than twice as thick when different low-silicon fillers are used.

Rapid direct conversion of Cu2-xSe to CuAgSe nanoplatelets via ion exchange reactions at room temperature

NASA Astrophysics Data System (ADS)

Moroz, N. A.; Olvera, A.; Willis, G. M.; Poudeu, P. F. P.

2015-05-01

The use of template nanostructures for the creation of photovoltaic and thermoelectric semiconductors is becoming a quickly expanding synthesis strategy. In this work we report a simple two-step process enabling the formation of ternary CuAgSe nanoplatelets with a great degree of control over the composition and shape. Starting with hexagonal nanoplatelets of cubic Cu2-xSe, ternary CuAgSe nanoplatelets were generated through a rapid ion exchange reaction at 300 K using AgNO3 solution. The Cu2-xSe nanoplatelet template and the final CuAgSe nanoplatelets were analyzed by electron microscopy and X-ray diffraction (XRD). It was found that both the low temperature pseudotetragonal and the high temperature cubic forms of CuAgSe phase were created while maintaining the morphology of the Cu2-xSe nanoplatelet template. Thermal and electronic transport measurements of hot-pressed pellets of the synthesized CuAgSe nanoplatelets showed a drastic reduction in the thermal conductivity and a sharp transition from n-type (S = -45 μV K-1) to p-type (S = +200 μV K-1) semiconducting behavior upon heating above the structural transition from the low temperature orthorhombic to the high temperature super-ionic cubic phase. This simple reaction process utilizing a template nanostructure matrix represents an energy efficient, cost-efficient, and versatile strategy to create interesting materials with lower defect density and superior thermoelectric performance.The use of template nanostructures for the creation of photovoltaic and thermoelectric semiconductors is becoming a quickly expanding synthesis strategy. In this work we report a simple two-step process enabling the formation of ternary CuAgSe nanoplatelets with a great degree of control over the composition and shape. Starting with hexagonal nanoplatelets of cubic Cu2-xSe, ternary CuAgSe nanoplatelets were generated through a rapid ion exchange reaction at 300 K using AgNO3 solution. The Cu2-xSe nanoplatelet template and the

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition.

PubMed

Leong, Yee Mei; Haseeb, A S M A

2016-06-28

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1-0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu₃Al₂. Cu₃Al₂ resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu₆Sn₅ intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu₆Sn₅ IMC but has no significant effect on the thickness of Cu₃Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads

NASA Astrophysics Data System (ADS)

Jain, C. C.; Wang, S. S.; Huang, K. W.; Chuang, T. H.

2009-03-01

The interfacial reactions in a Sn-20In-2.8Ag solder ball grid array (BGA) package with immersion Ag surface finish are investigated. After reflow, the Ag thin film dissolves quickly into the solder matrix, and scallop-shaped intermetallic layers, with compositions of (Cu0.98Ag0.02)6(In0.59Sn0.41)5, appear at the interfaces between Sn-20In-2.8Ag solder ball and Cu pad. No evident growth of the (Cu0.98Ag0.02)6(Sn0.59In0.41)5 intermetallic compounds was observed after prolonged aging at 100 °C. However, the growth accelerated at 150 °C, with more intermetallic scallops floating into the solder matrix. The intermetallic thickness versus the square root of reaction time ( t 1/2) shows a linear relation, indicating that the growth of intermetallic compounds is diffusion-controlled. Ball shear tests show that the strength of Sn-20In-2.8Ag solder joints after reflow is 4.4 N, which increases to 5.18 N and 5.14 N after aging at 100 and 150 °C, respectively.

Electrodeposition of CuZn Alloys from the Non-Cyanide Alkaline Baths

NASA Astrophysics Data System (ADS)

Li, Minggang; Wei, Guoying; Hu, Shuangshuang; Xu, Shuhan; Yang, Yejiong; Miao, Qinfang

2015-10-01

Effect of copper sulfate on CuZn alloys electroplating from non-cyanide baths are investigated by different electrochemical methods. Cyclic voltammetry and current transient measurements are used to characterize the CuZn alloys electroplating system in order to analyze the nucleation and growth mechanism. The reduction of Cu and CuZn alloy on sheet iron substrates shows an instantaneous nucleation process. However, the reduction of Zn on sheet iron substrates shows a progressive nucleation process. The structure and surface morphology of CuZn alloys are analyzed by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The morphology of CuZn alloys obtained with 50 g L-1 copper sulfate presents a smooth and compact deposit and the size of crystal particle is uniform.

Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys

NASA Astrophysics Data System (ADS)

Reeve, Kathlene N.; Handwerker, Carol A.

2018-01-01

The limited number of independent β-Sn grain orientations that typically form during solidification of Sn-based solders and the resulting large β-Sn grain size have major effects on overall solder performance and reliability. This study analyzes whether additions of Al to Sn-Cu and Sn-Cu-Ag alloys can be used to change the grain size, morphology, and twinning structures of atomized (as-solidified) and re-melted (reflowed) β-Sn dendrites as determined using scanning electron microscopy and electron backscatter diffraction for as-solidified and reflow cycled (20-250°C, 1-5 cycles) Sn-Cu-Al and Sn-Ag-Cu-Al drip atomized spheres (260 μm diameter). The resulting microstructures were compared to as-solidified and reflow cycled Sn-Ag-Cu spheres (450 μm diameter) as well as as-solidified Sn-Ag-Cu, Sn-Cu, and Sn-Ag microstructures from the literature. Previous literature observations reporting reductions in undercooling and β-Sn grain size with Al micro-alloying additions could not be correlated to the presence of the Cu9Al4 phase or Al solute. The as-solidified spheres displayed no change in β-Sn dendrite structure or grain size when compared to non-Al-modified alloys, and the reflow cycled spheres produced high undercoolings (22-64°C), indicating a lack of potent nucleation sites. The current findings highlighted the role of Ag in the formation of the interlaced twinning structure and demonstrated that with deliberate compositional choices, formation of the alloy's β-Sn grain structure (cyclical twinning versus interlaced twinning) could be influenced, in both the as-solidified and reflow cycled states, though still not producing the fine-grain sizes and multiple orientations desired for improved thermomechanical properties.

Properties of a new type Al/Pb-0.3%Ag alloy composite anode for zinc electrowinning

NASA Astrophysics Data System (ADS)

Yang, Hai-tao; Liu, Huan-rong; Zhang, Yong-chun; Chen, Bu-ming; Guo, Zhong-cheng; Xu, Rui-dong

2013-10-01

An Al/Pb-0.3%Ag alloy composite anode was produced via composite casting. Its electrocatalytic activity for the oxygen evolution reaction and corrosion resistance was evaluated by anodic polarization curves and accelerated corrosion test, respectively. The microscopic morphologies of the anode section and anodic oxidation layer during accelerated corrosion test were obtained by scanning electron microscopy. It is found that the composite anode (hard anodizing) displays a more compact interfacial combination and a better adhesive strength than plating tin. Compared with industrial Pb-0.3%Ag anodes, the oxygen evolution overpotentials of Al/Pb-0.3%Ag alloy (hard anodizing) and Al/Pb-0.3%Ag alloy (plating tin) at 500 A·m-2 were lower by 57 and 14 mV, respectively. Furthermore, the corrosion rates of Pb-0.3%Ag alloy, Al/Pb-0.3%Ag alloy (hard anodizing), and Al/Pb-0.3%Ag alloy (plating tin) were 13.977, 9.487, and 11.824 g·m-2·h-1, respectively, in accelerated corrosion test for 8 h at 2000 A·m-2. The anodic oxidation layer of Al/Pb-0.3%Ag alloy (hard anodizing) is more compact than Pb-0.3%Ag alloy and Al/Pb-0.3%Ag alloy (plating tin) after the test.

Cu-Au Alloys Using Monte Carlo Simulations and the BFS Method for Alloys

NASA Technical Reports Server (NTRS)

Bozzolo, Guillermo; Good, Brian; Ferrante, John

1996-01-01

Semi empirical methods have shown considerable promise in aiding in the calculation of many properties of materials. Materials used in engineering applications have defects that occur for various reasons including processing. In this work we present the first application of the BFS method for alloys to describe some aspects of microstructure due to processing for the Cu-Au system (Cu-Au, CuAu3, and Cu3Au). We use finite temperature Monte Carlo calculations, in order to show the influence of 'heat treatment' in the low-temperature phase of the alloy. Although relatively simple, it has enough features that could be used as a first test of the reliability of the technique. The main questions to be answered in this work relate to the existence of low temperature ordered structures for specific concentrations, for example, the ability to distinguish between rather similar phases for equiatomic alloys (CuAu I and CuAu II, the latter characterized by an antiphase boundary separating two identical phases).

Exploring the mechanism and kinetics of Fe-Cu-Ag trimetallic particles for p-nitrophenol reduction.

PubMed

Yuan, Yue; Yuan, Donghai; Zhang, Yunhong; Lai, Bo

2017-11-01

Preparation conditions of Fe-Cu-Ag trimetallic particles were optimized by single-factor and response surface methodology (RSM) batch experiments to obtain high-reactive Fe 0 -based materials for p-nitrophenol (PNP) removal. Under the optimal conditions (i.e., Fe 0 dosage of 34.86 g L -1 , theoretical Cu mass loading of 81.87 mg Cu/g Fe, theoretical Ag mass loading of 1.15 mg Ag/g Fe, and preparation temperature of 52.1 °C), the actual rate constant (k obs ) of PNP reduction in 5 min was 1.64 min -1 , which shows a good agreement between the model prediction (1.85 min -1 ) of RSM and the experimental data. Furthermore, the high reactivity of Fe 0 -based trimetals was mainly attributed to the plating order of transition metals (i.e., Ag and Cu). Furthermore, we propose a new theory that the pyramid trimetallic structure of Fe-Cu-Ag could improve the electron transport and create active sites with high electron density at the surface (Ag layer) that could enhance the generation of surface-bonded atomic hydrogen ([H] abs ) or the direct reduction of pollutant. Moreover, Fe-Cu-Ag trimetallic particles were characterized by SEM, EDS, and XPS, which also could confirm the proposed theory. In addition, the leached Cu 2+ (<10 μg L -1 ) and Ag + (below detection limits) in Fe-Cu-Ag system could be neglected completely, which suggests that Fe-Cu-Ag is reliable, safe, and environment friendly. Therefore, Fe-Cu-Ag trimetallic system would be promising for the removal of pollutants from industrial wastewater. Copyright © 2017 Elsevier Ltd. All rights reserved.

Photoelectrochemical Properties and Photostabilities of High Surface Area CuBi 2O 4 and Ag-Doped CuBi 2O 4 Photocathodes

DOE PAGES

Kang, Donghyeon; Hill, James C.; Park, Yiseul; ...

2016-06-09

Here, electrochemical synthesis methods were developed to produce CuBi 2O 4, a promising p-type oxide for use in solar water splitting, as high surface area electrodes with uniform coverage. These methods involved electrodepositing nanoporous Cu/Bi films with a Cu:Bi ratio of 1:2 from dimethyl sulfoxide or ethylene glycol solutions, and thermally oxidizing them to CuBi 2O 4 at 450°C in air. Ag-doped CuBi 2O 4 electrodes were also prepared by adding a trace amount of Ag+ in the plating medium and codepositing Ag with the Cu/Bi films. In the Ag-doped CuBi 2O 4, Ag+ ions substitutionally replaced Bi3+ ions andmore » increased the hole concentration in CuBi 2O 4. As a result, photocurrent enhancements for both O 2 reduction and water reduction were achieved. Furthermore, while undoped CuBi 2O 4 electrodes suffered from anodic photocorrosion during O 2 reduction due to poor hole transport, Ag-doped CuBiO 4 effectively suppressed anodic photocorrosion. The flat-band potentials of CuBi 2O 4 and Ag-doped CuBi 2O 4 electrodes prepared in this study were found to be more positive than 1.3 V vs RHE in a 0.1 M NaOH solution (pH 12.8), which make these photocathodes highly attractive for use in solar hydrogen production. The optimized CuBi 2O 4/Ag-doped CuBi 2O 4 photocathode showed a photocurrent onset for water reduction at 1.1 V vs RHE, achieving a photovoltage higher than 1 V for water reduction. The thermodynamic feasibility of photoexcited electrons in the conduction band of CuBi 2O 4 to reduce water was also confirmed by detection of H 2 during photocurrent generation. This study provides new understanding for constructing improved CuBi 2O 4 photocathodes by systematically investigating photocorrosion as well as photoelectrochemical properties of high-quality CuBi 2O 4 and Ag-doped CuBi 2O 4 photoelectrodes for photoreduction of both O 2 and water.« less

Photoelectrochemical Properties and Photostabilities of High Surface Area CuBi 2O 4 and Ag-Doped CuBi 2O 4 Photocathodes

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kang, Donghyeon; Hill, James C.; Park, Yiseul

Here, electrochemical synthesis methods were developed to produce CuBi 2O 4, a promising p-type oxide for use in solar water splitting, as high surface area electrodes with uniform coverage. These methods involved electrodepositing nanoporous Cu/Bi films with a Cu:Bi ratio of 1:2 from dimethyl sulfoxide or ethylene glycol solutions, and thermally oxidizing them to CuBi 2O 4 at 450°C in air. Ag-doped CuBi 2O 4 electrodes were also prepared by adding a trace amount of Ag+ in the plating medium and codepositing Ag with the Cu/Bi films. In the Ag-doped CuBi 2O 4, Ag+ ions substitutionally replaced Bi3+ ions andmore » increased the hole concentration in CuBi 2O 4. As a result, photocurrent enhancements for both O 2 reduction and water reduction were achieved. Furthermore, while undoped CuBi 2O 4 electrodes suffered from anodic photocorrosion during O 2 reduction due to poor hole transport, Ag-doped CuBiO 4 effectively suppressed anodic photocorrosion. The flat-band potentials of CuBi 2O 4 and Ag-doped CuBi 2O 4 electrodes prepared in this study were found to be more positive than 1.3 V vs RHE in a 0.1 M NaOH solution (pH 12.8), which make these photocathodes highly attractive for use in solar hydrogen production. The optimized CuBi 2O 4/Ag-doped CuBi 2O 4 photocathode showed a photocurrent onset for water reduction at 1.1 V vs RHE, achieving a photovoltage higher than 1 V for water reduction. The thermodynamic feasibility of photoexcited electrons in the conduction band of CuBi 2O 4 to reduce water was also confirmed by detection of H 2 during photocurrent generation. This study provides new understanding for constructing improved CuBi 2O 4 photocathodes by systematically investigating photocorrosion as well as photoelectrochemical properties of high-quality CuBi 2O 4 and Ag-doped CuBi 2O 4 photoelectrodes for photoreduction of both O 2 and water.« less

CONSTITUTIVE BEHAVIOR OF AS-QUENCHED Al-Cu-Mn ALLOY

NASA Astrophysics Data System (ADS)

Yang, Xia-Wei; Zhu, Jing-Chuan; Nong, Zhi-Sheng; Ye, Mao; Lai, Zhong-Hong; Liu, Yong

2013-07-01

The hot flow stress of as-quenched Al-Cu-Mn alloy was modeled using the constitutive equations. The as-quenched Al-Cu-Mn alloy were treated with isothermal hot compression tests in the temperature range of 350-500°C, the strain rate range of 0.001-1 s-1. The hyperbolic sine equation was found to be appropriate for flow stress modeling and prediction. Based on the hyperbolic sine equation, a constitutive equation is a relation between 0.2 pct yield stress and deformation conditions (strain rate and deformation temperature) was established. The corresponding hot deformation activation energy (Q) for as-quenched Al-Cu-Mn alloy was determined to be 251.314 kJ/mol. Parameters of constitutive equation of as-quenched Al-Cu-Mn alloy were calculated at different small strains (≤ 0.01). The calculated flow stresses from the constitutive equation are in good agreement with the experimental results. Therefore, this constitutive equation can be used as an accurate temperature-stress model to solve the problems of quench distortion of Al-Cu-Mn alloy parts.

Microhardness and In Vitro Corrosion of Heat-Treated Mg–Y–Ag Biodegradable Alloy

PubMed Central

Vlček, Marián; Lukáč, František; Kudrnová, Hana; Smola, Bohumil; Stulíková, Ivana; Luczak, Monika; Szakács, Gábor; Hort, Norbert; Willumeit-Römer, Regine

2017-01-01

Magnesium alloys are promising candidates for biodegradable medical implants which reduce the necessity of second surgery to remove the implants. Yttrium in solid solution is an attractive alloying element because it improves mechanical properties and exhibits suitable corrosion properties. Silver was shown to have an antibacterial effect and can also enhance the mechanical properties of magnesium alloys. Measurements of microhardness and electrical resistivity were used to study the response of Mg–4Y and Mg–4Y–1Ag alloys to isochronal or isothermal heat treatments. Hardening response and electrical resistivity annealing curves in these alloys were compared in order to investigate the effect of silver addition. Procedures for solid solution annealing and artificial aging of the Mg–4Y–1Ag alloy were developed. The corrosion rate of the as-cast and heat-treated Mg–4Y–1Ag alloy was measured by the mass loss method. It was found out that solid solution heat treatment, as well artificial aging to peak hardness, lead to substantial improvement in the corrosion properties of the Mg–4Y–1Ag alloy. PMID:28772414

Time Temperature-Precipitation Behavior in An Al-Cu-Li Alloy 2195

NASA Technical Reports Server (NTRS)

Chen, P. S.; Bhat, B. N.

1999-01-01

Al-Cu-Li alloy 2195, with its combination of good cryogenic properties, low density, and high modulus, has been selected by NASA to be the main structural alloy of the Super Light Weight Tank (SLWT) for the Space Shuttle. Alloy 2195 is strengthened by an aging treatment that precipitates a particular precipitate, labeled as T1(Al2CuLi). Other phases, such as GP zone, (theta)', (theta)", theta, (delta)', S' are also present in this alloy when artificially aged. Cryogenic strength and fracture toughness are critical to the -SLWT application, since the SLWT will house liquid oxygen and hydrogen. Motivation for the Time-Temperature-Precipitation (TTP) study at lower temperature (lower than 350 F) comes in part from a recent study by Chen, The study found that the cryogenic fracture toughness of alloy 2195 is greatly influenced by the phases present in the matrix and subgrain boundaries. Therefore, the understanding of TTP behavior can help develop a guideline to select appropriate heat treatment conditions for the desirable applications. The study of TTP behavior at higher temperature (400 to 1000 F) was prompted by the fact that the SLWT requires a welded construction. Heat conduction from the weld pool affects the microstructure in the heat-affected zone (HAZ), which leads to changes in the mechanical properties. Furthermore, the SLWT may need repair welding for more than one time and any additional thermal cycles will increase precipitate instability and promote phase transformation. As a result considerable changes in HAZ microstructure and mechanical properties are expected during the construction of the SLWT. Therefore, the TTP diagrams can serve to understand the thermal history of the alloy by analyzing the welded microstructure. In the case welding, the effects of thermal cycles on the microstructure and mechanical properties can be predicted with the aid of the TTP diagrams. The 2195 alloy (nominally Al + 4 pct Cu + 1 pct Li + 0.3 pct Ag + 0.3 pct Mg + 0

Minor-Cu doped soft magnetic Fe-based FeCoBCSiCu amorphous alloys with high saturation magnetization

NASA Astrophysics Data System (ADS)

Li, Yanhui; Wang, Zhenmin; Zhang, Wei

2018-05-01

The effects of Cu alloying on the amorphous-forming ability (AFA) and magnetic properties of the P-free Fe81Co5B11C2Si1 amorphous alloy were investigated. Addition of ≤ 1.0 at.% Cu enhances the AFA of the base alloy without significant deterioration of the soft magnetic properties. The Fe80.5Co5B11C2Si1Cu0.5 alloy with the largest critical thickness for amorphous formation of ˜35 μm possesses a high saturation magnetization (Bs) of ˜1.78 T, low coercivity of ˜14.6 A/m, and good bending ductility upon annealing in a wide temperature range of 513-553 K with maintaining the amorphous state. The fabrication of the new high-Fe-content Fe-Co-B-C-Si-Cu amorphous alloys by minor doping of Cu gives a guideline to developing high Bs amorphous alloys with excellent AFA.

Rapid direct conversion of Cu(2-x)Se to CuAgSe nanoplatelets via ion exchange reactions at room temperature.

PubMed

Moroz, N A; Olvera, A; Willis, G M; Poudeu, P F P

2015-06-07

The use of template nanostructures for the creation of photovoltaic and thermoelectric semiconductors is becoming a quickly expanding synthesis strategy. In this work we report a simple two-step process enabling the formation of ternary CuAgSe nanoplatelets with a great degree of control over the composition and shape. Starting with hexagonal nanoplatelets of cubic Cu2-xSe, ternary CuAgSe nanoplatelets were generated through a rapid ion exchange reaction at 300 K using AgNO3 solution. The Cu2-xSe nanoplatelet template and the final CuAgSe nanoplatelets were analyzed by electron microscopy and X-ray diffraction (XRD). It was found that both the low temperature pseudotetragonal and the high temperature cubic forms of CuAgSe phase were created while maintaining the morphology of the Cu2-xSe nanoplatelet template. Thermal and electronic transport measurements of hot-pressed pellets of the synthesized CuAgSe nanoplatelets showed a drastic reduction in the thermal conductivity and a sharp transition from n-type (S = -45 μV K(-1)) to p-type (S = +200 μV K(-1)) semiconducting behavior upon heating above the structural transition from the low temperature orthorhombic to the high temperature super-ionic cubic phase. This simple reaction process utilizing a template nanostructure matrix represents an energy efficient, cost-efficient, and versatile strategy to create interesting materials with lower defect density and superior thermoelectric performance.

Biosynthesis and stabilization of Au and Au Ag alloy nanoparticles by fungus, Fusarium semitectum

NASA Astrophysics Data System (ADS)

Dasaratrao Sawle, Balaji; Salimath, Basavaraja; Deshpande, Raghunandan; Dhondojirao Bedre, Mahesh; Krishnamurthy Prabhakar, Belawadi; Venkataraman, Abbaraju

2008-09-01

Crystallized and spherical-shaped Au and Au-Ag alloy nanoparticles have been synthesized and stabilized using a fungus, F . semitectum in an aqueous system. Aqueous solutions of chloroaurate ions for Au and chloroaurate and Ag+ ions (1 : 1 ratio) for Au-Ag alloy were treated with an extracellular filtrate of F . semitectum biomass for the formation of Au nanoparticles (AuNP) and Au-Ag alloy nanoparticles (Au-AgNP). Analysis of the feasibility of the biosynthesized nanoparticles and core-shell alloy nanoparticles from fungal strains is particularly significant. The resultant colloidal suspensions are highly stable for many weeks. The obtained Au and Au-Ag alloy nanoparticles were characterized by the surface plasmon resonance (SPR) peaks using a UV-vis spectrophotometer, and the structure, morphology and size were determined by Fourier transform infrared spectroscopy (FTIR), x-ray diffraction (XRD), and transmission electron microscopy (TEM). Possible optoelectronics and medical applications of these nanoparticles are envisaged.

Tem Observation of Precipitates in Ag-Added Al-Mg-Si Alloys

NASA Astrophysics Data System (ADS)

Nagai, Takeshi; Matsuda, Kenji; Nakamura, Junya; Kawabata, Tokimasa; Marioara, Calin; Andersen, Sigmund J.; Holmestad, Randi; Hirosawa, Shoichi; Horita, Zenji; Terada, Daisuke; Ikeno, Susumu

The influence of addition of the small amount of transition metals to Al-Mg-Si alloy had reported by many researchers. In the previous our work, β' phase in alloys Al — 1.0 mass% Mg2Si -0.5 mass% Ag (Ag-addition) and Al -1.0 mass% Mg2Si (base) were investigated by high resolution transmission electron microscopy (HRTEM) and selected area electron diffraction (SAED), in order to understand the effect of Ag. In addition, the distribution of Ag was investigated by energy filtered mapping and high annular angular dark field scanning transmission electron microscopy (HAADF-STEM). One Ag-containing atomic column was observed per β' unit cell, and the unit cell symmetry is slightly changed as compared with the Ag-free β'. In this work, the microstructure of G.P. zone and β'' phase was investigated by TEM observation, which were formed before β' phase. The deformed sample by high pressure torsion (HPT) technique before aging was also investigated to understand its effect for aging in this alloy.

Effect of nano/micro-Ag compound particles on the bio-corrosion, antibacterial properties and cell biocompatibility of Ti-Ag alloys.

PubMed

Chen, Mian; Yang, Lei; Zhang, Lan; Han, Yong; Lu, Zheng; Qin, Gaowu; Zhang, Erlin

2017-06-01

In this research, Ti-Ag alloys were prepared by powder metallurgy, casting and heat treatment method in order to investigate the effect of Ag compound particles on the bio-corrosion, the antibacterial property and the cell biocompatibility. Ti-Ag alloys with different sizes of Ag or Ag-compounds particles were successfully prepared: small amount of submicro-scale (100nm) Ti 2 Ag precipitates with solid solution state of Ag, large amount of nano-scale (20-30nm) Ti 2 Ag precipitates with small amount of solid solution state of Ag and micro-scale lamellar Ti 2 Ag phases, and complete solid solution state of Ag. The mechanical tests indicated that both nano/micro-scale Ti 2 Ag phases had a strong dispersion strengthening ability and Ag had a high solid solution strengthening ability. Electrochemical results shown the Ag content and the size of Ag particles had a limited influence on the bio-corrosion resistance although nano-scale Ti 2 Ag precipitates slightly improved corrosion resistance. It was demonstrated that the nano Ag compounds precipitates have a significant influence on the antibacterial properties of Ti-Ag alloys but no effect on the cell biocompatibility. It was thought that both Ag ions release and Ti 2 Ag precipitates contributed to the antibacterial ability, in which nano-scale and homogeneously distributed Ti 2 Ag phases would play a key role in antibacterial process. Copyright © 2017 Elsevier B.V. All rights reserved.

Effect of vertically oriented few-layer graphene on the wettability and interfacial reactions of the AgCuTi-SiO2f/SiO2 system.

PubMed

Sun, Z; Zhang, L X; Qi, J L; Zhang, Z H; Hao, T D; Feng, J C

2017-03-22

With the aim of expanding their applications, particularly when joining metals, a simple but effective method is reported whereby the surface chemical reactivity of SiO 2f /SiO 2 (SiO 2f /SiO 2 stands for silica fibre reinforced silica based composite materials and f is short for fibre) composites with vertically oriented few-layer graphene (VFG, 3-10 atomic layers of graphene vertically oriented to the substrate) can be tailored. VFG was uniformly grown on the surface of a SiO 2f /SiO 2 composite by using plasma enhanced chemical vapour deposition (PECVD). The wetting experiments were conducted by placing small pieces of AgCuTi alloy foil on SiO 2f /SiO 2 composites with and without VFG decoration. It was demonstrated that the contact angle dropped from 120° (without VFG decoration) to 50° (with VFG decoration) when the holding time was 10 min. The interfacial reaction layer in SiO 2f /SiO 2 composites with VFG decoration became continuous without any unfilled gaps compared with the composites without VFG decoration. High-resolution transmission electron microscopy (HRTEM) was employed to investigate the interaction between VFG and Ti from the AgCuTi alloy. The results showed that VFG possessed high chemical reactivity and could easily react with Ti even at room temperature. Finally, a mechanism of how VFG promoted the wetting of the SiO 2f /SiO 2 composite by the AgCuTi alloy is proposed and thoroughly discussed.

CHARACTERISTICS OF THERMOLUMINESCENCE LiF:Mg,Cu,Ag NANOPHOSPHOR.

PubMed

Yahyaabadi, A; Torkzadeh, F; Rezaei-Ochbelagh, D

2018-04-23

A nanophosphor of LiF:Mg,Cu,Ag was prepared by planetary ball milling for the first time in the laboratory. The size and shape of the nanophosphor were confirmed by XRD and SEM, which showed that it was cubic in shape and ~53 nm in size. The thermoluminescence (TL) characteristics of this nanophosphor were then investigated. It was found that the optimum annealing condition was 250°C for 10 min. The TL sensitivity of the prepared nanopowder was less than that of its micropowder counterpart and the TL glow curve structure exhibited several peaks. The LiF:Mg,Cu,Ag nanophosphor exhibited a linear response over a range of doses from 1 Gy to ~10 kGy. From this study, it appears that LiF:Mg,Cu,Ag nanophosphor is a good candidate for dosimetry because of its linearity over a range of doses, low tendency to fade, good repeatability and simple glow curve structure.

Microstructure and mechanical characteristics of gradient structured Cu and Cu alloys processed by surface mechanical attrition treatment

NASA Astrophysics Data System (ADS)

Hu, XZ; Cheng, LP; Chen, HL; Yin, Z.; Zhang, Z.; Shu, BP; Gong, YL; Zhu, XK

2017-05-01

Cu-Al-Zn alloys with different stacking fault energy (SFE) were processed by surface mechanical attrition treatment (SMAT) at cryogenic temperature (CT), mechanical properties of gradient structured Cu-Al-Zn alloys were investigated in this study. Al and Zn content in alloys, which result in the decrease of SFE, can contribute to the increase in strength. Cu-4.5wt%Al-14.3wt%Zn alloy with the lower SFE shows that the strength increased, the ductility did not decrease significantly with increasing processing time, and the strength can be improved by a thicker gradient structure (GS) layer. The better combination of strength and ductility was achieved in Cu-4.5wt%Al-14.3wt%Zn alloy with lower SFE.

Development of Cu Clad Cu-Zr Based Metallic Glass and Its Solderability

NASA Astrophysics Data System (ADS)

Terajima, Takeshi; Kimura, Hisamichi; Inoue, Akihisa

Soldering is a candidate technique for joining metallic glasses. It can be processed far below the crystallization temperatures of the various metallic glasses so that there is no possibility of crystallization. However, wettability of Cu-Zr based metallic glass by Pb free solder is poor because a strong surface oxide film interferes direct contact between them. To overcome the problem, Cu thin film clad metallic glass was developed. It was preliminary produced by casting a melt of Cu36Zr48Al8Ag8 pre-alloy into Cu mold cavity, inside which Cu thin film with 2 mm in thickness was set on the wall. Cu36Zr48Al8Ag8 metallic glass, whose surface Cu thin film was welded to, was successfully produced. From the microstructure analyses, it was found that reaction layer was formed at the interface between Cu and Cu36Zr48Al8Ag8 metallic glass, however, there was no oxide in the Cu clad layer. Solderability to the metallic glass was drastically increased. The Cu clad layer played an important role to prevent the formation of surface oxide film and consequently improved the solderability.

Antimicrobial properties of ternary eutectic aluminum alloys.

PubMed

Hahn, Claudia; Hans, Michael; Hein, Christina; Dennstedt, Anne; Mücklich, Frank; Rettberg, Petra; Hellweg, Christine Elisabeth; Leichert, Lars Ingo; Rensing, Christopher; Moeller, Ralf

2018-06-27

Several Escherichia coli deletion mutants of the Keio collection were selected for analysis to better understand which genes may play a key role in copper or silver homeostasis. Each of the selected E. coli mutants had a deletion of a single gene predicted to encode proteins for homologous recombination or contained functions directly linked to copper or silver transport or transformation. The survival of these strains on pure copper surfaces, stainless steel, and alloys of aluminum, copper and/or silver was investigated. When exposed to pure copper surfaces, E. coli ΔcueO was the most sensitive, whereas E. coli ΔcopA was the most resistant amongst the different strains tested. However, we observed a different trend in sensitivities in E. coli strains upon exposure to alloys of the system Al-Ag-Cu. While minor antimicrobial effects were detected after exposure of E. coli ΔcopA and E. coli ΔrecA to Al-Ag alloys, no effect was detected after exposure to Al-Cu alloys. The release of copper ions and cell-associated copper ion concentrations were determined for E. coli ΔcopA and the wild-type E. coli after exposure to pure copper surfaces. Altogether, compared to binary alloys, ternary eutectic alloys (Al-Ag-Cu) had the highest antimicrobial effect and thus, warrant further investigation.

46 CFR 56.75-5 - Filler metal.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 2 2010-10-01 2010-10-01 false Filler metal. 56.75-5 Section 56.75-5 Shipping COAST... Brazing § 56.75-5 Filler metal. (a) The filler metal used in brazing must be a nonferrous metal or alloy having a melting point above 1,000 °F. and below that of the metal being joined. The filler metal must...

46 CFR 56.75-5 - Filler metal.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 46 Shipping 2 2011-10-01 2011-10-01 false Filler metal. 56.75-5 Section 56.75-5 Shipping COAST... Brazing § 56.75-5 Filler metal. (a) The filler metal used in brazing must be a nonferrous metal or alloy having a melting point above 1,000 °F. and below that of the metal being joined. The filler metal must...

Crystal Structural Effect of AuCu Alloy Nanoparticles on Catalytic CO Oxidation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhan, Wangcheng; Wang, Jinglin; Wang, Haifeng

2017-06-07

Controlling the physical and chemical properties of alloy nanoparticles (NPs) is an important approach to optimize NP catalysis. Unlike other tuning knobs, such as size, shape, and composition, crystal structure has received limited attention and not been well understood for its role in catalysis. This deficiency is mainly due to the difficulty in synthesis and fine-tuning of the NPs’ crystal structure. Here, Exemplifying by AuCu alloy NPs with face centered cubic (fcc) and face centered tetragonal (fct) structure, we demonstrate a remarkable difference in phase segregation and catalytic performance depending on the crystal structure. During the thermal treatment in air,more » the Cu component in fcc-AuCu alloy NPs segregates more easily onto the alloy surface as compared to that in fct-AuCu alloy NPs. As a result, after annealing at 250 °C in air for 1 h, the fcc- and fct-AuCu alloy NPs are phase transferred into Au/CuO and AuCu/CuO core/shell structures, respectively. More importantly, this variation in heterostructures introduces a significant difference in CO adsorption on two catalysts, leading to a largely enhanced catalytic activity of AuCu/CuO NP catalyst for CO oxidation. Furthermore, the same concept can be extended to other alloy NPs, making it possible to fine-tune NP catalysis for many different chemical reactions.« less

Biocorrosion Evaluation on a Zr-Cu-Ag-Ti Metallic Glass

NASA Astrophysics Data System (ADS)

Kumar, Shresh; Anwar, Rebin; Ryu, Wookha; Park, E. S.; Vincent, S.

2018-04-01

Metallic glasses are in high demand for fabrication of variety of innovative products, in particular surgical and biomedical tools and devices owing to its excellent biocompatible properties. In the present investigation, a novel Zr39.5Cu50.5Ag4Ti6 metallic glass composition was synthesized using melt spinning technique. Potentiodynamic polarization studies were conducted to investigate bio-corrosion behaviour of Zr39.5Cu50.5Ag4Ti6 metallic glass. The test were conducted in various simulated artificial body conditions such as artificial saliva solution, phosphate-buffered saline solution, artificial blood plasma solution, and Hank’s balanced saline solution. The bio-corrosion results of metallic glass were compared with traditional biomaterials. The study aims to provide bio-compatible properties of Zr39.5Cu50.5Ag4Ti6 metallic glass.

Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate

PubMed Central

Huang, M. L.; Yang, F.

2014-01-01

The downsizing of solder balls results in larger interfacial intermetallic compound (IMC) grains and less Cu substrate consumption in lead-free soldering on Cu substrates. This size effect on the interfacial reaction is experimentally demonstrated and theoretically analyzed using Sn-3.0Ag-0.5Cu and Sn-3.5Ag solder balls. The interfacial reaction between the Sn-xAg-yCu solders and Cu substrates is a dynamic response to a combination of effects of interfacial IMC growth, Cu substrate consumption and composition variation in the interface zone. A concentration gradient controlled (CGC) kinetics model is proposed to explain the combined effects. The concentration gradient of Cu at the interface, which is a function of solder volume, initial Cu concentration and reaction time, is the root cause of the size effect. We found that a larger Cu concentration gradient results in smaller Cu6Sn5 grains and more consumption of Cu substrate. According to our model, the growth kinetics of interfacial Cu6Sn5 obeys a t1/3 law when the molten solder has approached the solution saturation, and will be slower otherwise due to the interfering dissolution mechanism. The size effect introduced in this model is supported by a good agreement between theoretical and experimental results. Finally, the scope of application of this model is discussed. PMID:25408359

High strength cast aluminum alloy development

NASA Astrophysics Data System (ADS)

Druschitz, Edward A.

The goal of this research was to understand how chemistry and processing affect the resulting microstructure and mechanical properties of high strength cast aluminum alloys. Two alloy systems were investigated including the Al-Cu-Ag and the Al-Zn-Mg-Cu systems. Processing variables included solidification under pressure (SUP) and heat treatment. This research determined the range in properties that can be achieved in BAC 100(TM) (Al-Cu micro-alloyed with Ag, Mn, Zr, and V) and generated sufficient property data for design purposes. Tensile, stress corrosion cracking, and fatigue testing were performed. CuAl2 and Al-Cu-Fe-Mn intermetallics were identified as the ductility limiting flaws. A solution treatment of 75 hours or longer was needed to dissolve most of the intermetallic CuAl 2. The Al-Cu-Fe-Mn intermetallic was unaffected by heat treatment. These results indicate that faster cooling rates, a reduction in copper concentration and a reduction in iron concentration might increase the ductility of the alloy by decreasing the size and amount of the intermetallics that form during solidification. Six experimental Al-Zn-Mg-Cu series alloys were produced. Zinc concentrations of 8 and 12wt% and Zn/Mg ratios of 1.5 to 5.5 were tested. Copper was held constant at 0.9%. Heat treating of the alloys was optimized for maximum hardness. Al-Zn-Mg-Cu samples were solution treated at 441°C (826°F) for 4 hours before ramping to 460°C (860°F) for 75 hours and then aged at 120°C (248°F) for 75 hours. X-ray diffraction showed that the age hardening precipitates in most of these alloys was the T phase (Mg32Zn 31.9Al17.1). Tensile testing of the alloys showed that the best mechanical properties were obtained in the lowest alloy condition. Chilled Al-8.2Zn-1.4Mg-0.9Cu solidified under pressure resulted in an alloy with a yield strength of 468MPa (68ksi), tensile strength of 525MPa (76ksi) and an elongation of 9%.

Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints

NASA Astrophysics Data System (ADS)

Zhou, M. B.; Ma, X.; Zhang, X. P.

2012-11-01

The microstructure of microscale solder interconnects and soldering defects have long been known to have a significant influence on the reliability of electronic packaging, and both are directly related to the solidification behavior of the undercooled solder. In this study, the undercooling behavior and solidification microstructural evolution of Sn-3.0Ag-0.5Cu solder balls with different diameters (0.76 mm, 0.50 mm, and 0.30 mm) and the joints formed by soldering these balls on Cu open pads of two diameters (0.48 mm and 0.32 mm) on a printed circuit board (PCB) substrate were characterized by differential scanning calorimetry (DSC) incorporated into the reflow process. Results show that the decrease in diameter of the solder balls leads to an obvious increase in the undercooling of the balls, while the undercooling of the solder joints shows a dependence on both the diameter of the solder balls and the diameter ratio of solder ball to Cu pad (i.e., D s/ D p), and the diameter of the solder balls has a stronger influence on the undercooling of the joints than the dimension of the Cu pad. Coarse primary intermetallic compound (IMC) solidification phases were formed in the smaller solder balls and joints. The bulk Ag3Sn IMC is the primary solidification phase in the as-reflowed solder balls. Due to the interfacial reaction and dissolution of Cu atoms into the solder matrix, the primary Ag3Sn phase can be suppressed and the bulk Cu6Sn5 IMC is the only primary solidification phase in the as-reflowed solder joints.

Melting curve of metals Cu, Ag and Au under pressure

NASA Astrophysics Data System (ADS)

Tam, Pham Dinh; Hoc, Nguyen Quang; Tinh, Bui Duc; Tan, Pham Duy

2016-01-01

In this paper, the dependence of the melting temperature of metals Cu, Ag and Au under pressure in the interval from 0 kbar to 40 kbar is studied by the statistical moment method (SMM). This dependence has the form of near linearity and the calculated slopes of melting curve are 3.9 for Cu, 5.7 for Ag and 6 for Au. These results are in good agreement with the experimental data.

Microstructures and Mechanical Properties of Cu and Cu-Zn Alloys

NASA Astrophysics Data System (ADS)

Ma, Xiaolong

Strength and ductility are two crucial mechanical properties of structural materials, which, unfortunately, are often mutually exclusive based on the conventional design of microstructures and their deformation physics. This is also true in most nanostructured (NS) metals and alloys although they exhibit record-high strength. However, the disappointingly inadequate ductility becomes the major roadblock to their practical utilities due to the threat of catastrophic failure in load-bearing applications. Therefore, simultaneous improvement of strength and ductility or a well-defined trade-off between these two properties, i.e. increasing either of them without significant loss of the other, in NS materials has garnered extensive efforts from the research community. A few strategies have been explored to handle this long-standing challenge with promise. In this dissertation work, two of those strategies, deformation twins and laminate/gradient structures are specified with particular interests in NS Cu and Cu-Zn alloys. The author believes the observation and the revealed underlying mechanism are fundamental and therefore shed lights on their universal application to other metallic material systems. Deformation twins have been frequently observed in ultra-fined grained (UFG) and NS face-centered cubic (FCC) metals and alloys, which is closely related to the better strengthening and strain hardening in mechanical performance. Previous findings even show that there exist an optimum grain size range within nano scale, where the deformation twins are of most frequency, i.e. most stable in pure FCC metals. However, such grain-size dependent twinning phenomenon is still unclear in FCC alloys. We report, for the first time in systematic experiments, the observed optimum grain sizes for deformation twins in NS Cu-Zn alloys slightly increase with increasing Zn content. Our results indicate that alloying changes the relationship between the stacking-fault and twin-fault energy

Structural and magnetic phase transitions in CeCu 6-xT x (T = Ag,Pd)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Poudel, Lekhanath N.; De la cruz, Clarina; Payzant, E. Andrew

The structural and the magnetic properties of CeCu 6-xAg x (0 ≤ x ≤ 0.85) and CeCu 6-xPd x (0 ≤ x ≤ 0.4) have been studied using neutron diffraction, resonant ultrasound spectroscopy (RUS), x-ray diffraction measurements, and first principles calculations. The structural and magnetic phase diagrams of CeCu 6-xAg x and CeCu 6-xPd x as a function of Ag/Pd composition are reported. The end member, CeCu 6, undergoes a structural phase transition from an orthorhombic ( Pnma) to a monoclinic (P2 1/c) phase at 240 K. In CeCu 6-xAg x, the structural phase transition temperature (T s) decreases linearlymore » with Ag concentration and extrapolates to zero at x S ≈ 0.1. The structural transition in CeCu 6-xPd x remains unperturbed with Pd substitution within the range of our study. The lattice constant b slightly decreases with Ag/Pd doping, whereas a and c increase with an overall increase in the unit cell volume. Both systems, CeCu 6-xAg x and CeCu 6-xPd x, exhibit a magnetic quantum critical point (QCP), at x ≈ 0.2 and x ≈ 0.05, respectively. Near the QCP, long range antiferromagnetic ordering takes place at an incommensurate wave vector (δ 1 0 δ 2), where δ 1 ~ 0.62, δ 2 ~ 0.25, x = 0.125 for CeCu 6-xPd x and δ 1 ~ 0.64, δ 2 ~ 0.3, x = 0.3 for CeCu 6-xAg x. As a result, the magnetic structure consists of an amplitude modulation of the Ce moments which are aligned along the c axis of the orthorhombic unit cell.« less

Structural and magnetic phase transitions in CeCu 6-xT x (T = Ag,Pd)

DOE PAGES

Poudel, Lekhanath N.; De la cruz, Clarina; Payzant, E. Andrew; ...

2015-12-15

The structural and the magnetic properties of CeCu 6-xAg x (0 ≤ x ≤ 0.85) and CeCu 6-xPd x (0 ≤ x ≤ 0.4) have been studied using neutron diffraction, resonant ultrasound spectroscopy (RUS), x-ray diffraction measurements, and first principles calculations. The structural and magnetic phase diagrams of CeCu 6-xAg x and CeCu 6-xPd x as a function of Ag/Pd composition are reported. The end member, CeCu 6, undergoes a structural phase transition from an orthorhombic ( Pnma) to a monoclinic (P2 1/c) phase at 240 K. In CeCu 6-xAg x, the structural phase transition temperature (T s) decreases linearlymore » with Ag concentration and extrapolates to zero at x S ≈ 0.1. The structural transition in CeCu 6-xPd x remains unperturbed with Pd substitution within the range of our study. The lattice constant b slightly decreases with Ag/Pd doping, whereas a and c increase with an overall increase in the unit cell volume. Both systems, CeCu 6-xAg x and CeCu 6-xPd x, exhibit a magnetic quantum critical point (QCP), at x ≈ 0.2 and x ≈ 0.05, respectively. Near the QCP, long range antiferromagnetic ordering takes place at an incommensurate wave vector (δ 1 0 δ 2), where δ 1 ~ 0.62, δ 2 ~ 0.25, x = 0.125 for CeCu 6-xPd x and δ 1 ~ 0.64, δ 2 ~ 0.3, x = 0.3 for CeCu 6-xAg x. As a result, the magnetic structure consists of an amplitude modulation of the Ce moments which are aligned along the c axis of the orthorhombic unit cell.« less

Effect of dopants on the TL response of the new LiF:Mg,Cu,Ag material

NASA Astrophysics Data System (ADS)

Yahyaabadi, A.; Torkzadeh, F.; Rezaei-Ochbelagh, D.; Hosseini Pooya, M.

2018-07-01

The new TL LiF:Mg,Cu,Ag material was prepared and investigated in this study. The TL intensity of LiF:Mg,Cu,Ag is strongly dependent on the concentration of dopants and the preparation procedure. Any small change in these factors can cause alterations in TL response. In this study, the influence of Cu and Ag concentrations on the response of the LiF:Mg,Cu,Ag sample was investigated and showed that the height of the low, main and high temperature peaks changes with Ag concentration. Their intensities increased with increasing Ag concentration to a maximum value and decreased with higher Ag concentration. It was also found that Cu concentration less than 0.05 mol% influences the maximum peak height and TL intensity. The optimum Cu and Ag concentrations were found to be 0.05 and 0.1 mol% at 1005 °C QT, respectively. The role of dopants in LiF:Mg,Cu,Ag material was also investigated. The results showed that presence of three dopants is important for having material with sensitivity higher than LiF:Mg,Ti. The Mg dopant plays a crucial role in the formation of the trapping center and the position of the main dosimetric peak.

Fabrication and surface enhanced Raman scattering effect of centimeter level AgCuAu composite nanowires

NASA Astrophysics Data System (ADS)

Xu, Dapeng; Zhang, Song; Yang, Wei; Chen, Jian

2017-10-01

Centimeter level AgCuAu composite nanowires were prepared by a solid-state ionics method under a direct current electric field (DCEF) using fast ionic conductor RbAg4I5 films and vacuum thermal evaporation method. The surface morphology and chemical composition of the AuAgCu composite nanowires were characterized by scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS), respectively. Raman enhancement performance of the AgCuAu composite nanowires substrates was detected by Rhodamine 6G (R6G) aqueous solutions as probe molecules. Long-range order and short-range order AgCuAu composite nanowires with the length of 1 cm were prepared. The nanowires were bamboo-shaped with high surface roughness and the diameters of nanowires ranged from 60 to 100 nm. The molar ratio of Ag:Cu:Au in composite nanowires is 15:2:1. The intrinsic Raman peaks of 10-16 mol/L R6G at 612, 773, 1125, 1182, 1307, 1361, 1418, 1506, 1545, 1575, 1597, 1650 cm-1 are all present when AgCuAu composite nanowires were used as the SERS substrates.

Twin-mediated epitaxial growth of highly lattice-mismatched Cu/Ag core-shell nanowires.

PubMed

Weng, Wei-Lun; Hsu, Chin-Yu; Lee, Jheng-Syun; Fan, Hsin-Hsin; Liao, Chien-Neng

2018-05-31

Lattice-mismatch is an important factor for the heteroepitaxial growth of core-shell nanostructures. A large lattice-mismatch usually leads to a non-coherent interface or a polycrystalline shell layer. In this study, a conformal Ag layer is coated on Cu nanowires with dense nanoscale twin boundaries through a galvanic replacement reaction. Despite a large lattice mismatch between Ag and Cu (∼12.6%), the Ag shell replicates the twinning structure in Cu nanowires and grows epitaxially on the nanotwinned Cu nanowire. A twin-mediated growth mechanism is proposed to explain the epitaxy of high lattice-mismatch bimetallic systems in which the misfit dislocations are accommodated by coherent twin boundaries.

Fusion boundary microstructure evolution in aluminum alloys

NASA Astrophysics Data System (ADS)

Kostrivas, Anastasios Dimitrios

2000-10-01

A melting technique was developed to simulate the fusion boundary of aluminum alloys using the GleebleRTM thermal simulator. Using a steel sleeve to contain the aluminum, samples were heated to incremental temperatures above the solidus temperature of a number of alloys. In alloy 2195, a 4wt%Cu-1wt%Li alloy, an equiaxed non-dendritic zone (EQZ) could be formed by heating in the temperature range from approximately 630 to 640°C. At temperatures above 640°C, solidification occurred by the normal epitaxial nucleation and growth mechanism. Fusion boundary behavior was also studied in alloys 5454-H34, 6061-T6, and 2219-T8. Additionally, experimental alloy compositions were produced by making bead on plate welds using an alloy 5454-H32 base metal and 5025 or 5087 filler metals. These filler metals contain zirconium and scandium additions, respectively, and were expected to influence nucleation and growth behavior. Both as-welded and welded/heat treated (540°C and 300°C) substrates were tested by melting simulation, resulting in dendritic and EQZ structures depending on composition and substrate condition. Orientation imaging microscopy (OIM(TM)) was employed to study the crystallographic character of the microstructures produced and to verify the mechanism responsible for EQZ formation. OIM(TM) proved that grains within the EQZ have random orientation. In all other cases, where the simulated microstructures were dendritic in nature, it was shown that epitaxy was the dominant mode of nucleation. The lack of any preferred crystallographic orientation relationship in the EQZ supports a theory proposed by Lippold et al that the EQZ is the result of heterogeneous nucleation within the weld unmixed zone. EDS analysis of the 2195 on STEM revealed particles with ternary composition consisted of Zr, Cu and Al and a tetragonal type crystallographic lattice. Microdiffraction line scans on EQZ grains in the alloy 2195 showed very good agreement between the measured Cu

Photoelectron spectroscopic and computational study of (M-CO2)- anions, M = Cu, Ag, Au

NASA Astrophysics Data System (ADS)

Zhang, Xinxing; Lim, Eunhak; Kim, Seong K.; Bowen, Kit H.

2015-11-01

In a combined photoelectron spectroscopic and computational study of (M-CO2)-, M = Au, Ag, Cu, anionic complexes, we show that (Au-CO2)- forms both the chemisorbed and physisorbed isomers, AuCO 2- and Au-(CO2), respectively; that (Ag-CO2)- forms only the physisorbed isomer, Ag-(CO2); and that (Cu-CO2)- forms only the chemisorbed isomer, CuCO 2- . The two chemisorbed complexes, AuCO 2- and CuCO 2- , are covalently bound, formate-like anions, in which their CO2 moieties are significantly reduced. These two species are examples of electron-induced CO2 activation. The two physisorbed complexes, Au-(CO2) and Ag-(CO2), are electrostatically and thus weakly bound.

Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO{sub 3} solution

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sarveswaran, C.; Othman, N. K.; Ali, M. Yusuf Tura

2015-09-25

Current issue in lead-free solder in term of its reliability is still under investigation. This high impact research attempts to investigate the electrochemical migration (ECM) on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy by Water Drop Test (WDT) in different concentration of HNO{sub 3} solution. The concentration of HNO{sub 3} solution used in this research was 0.05, 0.10, 0.50 and 1M. Optical Microscope (OM), Field Emission Scanning Electron Microscope (FESEM) and Energy Dispersive X-Ray Analysis (EDX) were carried out in order to analysis the ECM behavior based on the growth of dendrite formation after WDT. In general, the results demonstrated that dendrite growth ismore » faster in higher concentration compared with low concentration of HNO{sub 3}. The concentration of HNO{sub 3} solution used has a strong correlation with Mean-Time-To-Failure (MTTF). As the concentration of HNO{sub 3} increases, the MTTF value decreases. Based on the MTTF results the solder alloy in 1M HNO{sub 3} solution is most susceptible to ECM. SnO{sub 2} forms as a corrosion by-product in the samples proved by EDX analysis. The solder alloy poses a high reliability risk in microelectronic devices during operation in 1M HNO{sub 3} solution.« less

Effect of O2, N2 and H2 on annealing of pad printed high conductive Ag-Cu nano-alloy electrodes

NASA Astrophysics Data System (ADS)

Manjunath, G.; Anusha, P.; Salian, Ashritha; Gupta, Bikesh; Mandal, Saumen

2018-01-01

In this study, annealing of pad printed Ag-Cu based conducting ink was studied in oxidizing, inert and reducing atmosphere to verify its oxidation dependent conductivity. Ag-Cu manually was formulated adopting polyol method; where silver nitrate and copper nitrate serve as initial metal precursors. Polyvinylpyrrolidone (PVP), ethylene glycol and sodium borohydride act as a stabilizer, solvent and reducing agent respectively. The nanoalloys were with an average particle size ˜48 ± 15 nm, capped with polyvinylpyrrolidone to avoid agglomeration and stable in non-polar solvents. Formation of nanoalloy, Ag 90 wt%-Cu 10 wt%, was verified through a peak shift in UV-visible spectroscopy, found at 470 nm along with Nelson-Relay curve fitting and x-ray photoelectron spectroscopy study. The calculated lattice parameter of nanoalloy ˜4.034 Å, was in between pure silver and copper. The crystallite size was calculated using Debye-Scherrer, Williamson-Hall isotropic strain model and Halder-Wagner method. Electrode patterns were printed on a glass substrate by pad printing and were annealed under O2, N2 and H2 atmosphere to study the oxidation kinetics of copper. A maximum conductivity of -6.6 × 105 S m-1 was observed in inert atmosphere annealing as the conductivity is solely depends on the oxidation of copper; appears with uttermost Cu0 and least Cu2+ in x-ray photoelectron spectroscopy. High conductive space required between manually and dispersion ink can have a potential application as an electrode in printed electronics. Further refinement of size of the nanopaticles by polyol method could help to obtain the effect of quantum confinement.

Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu-Co dual-phase substrate

NASA Astrophysics Data System (ADS)

Li, Chao; Hu, Xiaowu; Jiang, Xiongxin; Li, Yulong

2018-07-01

In this study, interfacial reactions and microstructures of the Sn3Ag0.5Cu (SAC305)/Cu- xCo ( x = 0, 30 and 50 wt%) systems were investigated during reflowing at 290 °C and solid-state aging at 150 °C for various time. The effects of different contents of Co in substrate on interfacial reaction in SAC305/Cu- xCo system were discussed. It was found that the addition of Co into pure copper substrate to achieve alloying would effectively inhibit the growth of IMC layers. Comparison among the thickness of the intermetallic compound (IMC) in three kinds of SAC305/Cu-Co systems indicated that the IMC layer of SAC305/Cu joint was thicker than that of the other two types of solder joints. The composition of the SAC305/Cu IMC layers was Cu6Sn5 and Cu3Sn. Three kinds of reaction phases (Cu,Co)6Sn5, (Cu,Co)Sn2 and (Cu,Co)3Sn were found at the interfaces of the SAC305/Cu-30Co and SAC305/Cu-50Co joints. Remarkably the (Cu,Co)Sn2 phase was found adjacent to the Co-rich phase after soldering and eliminated after the aging treatment. While the (Cu,Co)3Sn phase accumulated increasingly adjacent to the substrate with the increased aging time. The results suggested that the Co content increased from 30 to 50 wt% in substrate lead to significant restraint of the growth of interfacial IMC. In addition, the thickness of the interfacial IMC layer was linear with the square root of the aging time during the aging process. The reaction rate between Sn atoms in solder and Cu, Co atoms in substrate was quite different, which lead to the fact that the interface of SAC305/Cu-Co is uneven on the side of substrate after reflowing and aging.

Constitutive Model for Hot Deformation of the Cu-Zr-Ce Alloy

NASA Astrophysics Data System (ADS)

Zhang, Yi; Sun, Huili; Volinsky, Alex A.; Wang, Bingjie; Tian, Baohong; Liu, Yong; Song, Kexing

2018-02-01

Hot compressive deformation behavior of the Cu-Zr-Ce alloy has been investigated according to the hot deformation tests in the 550-900 °C temperature range and 0.001-10 s-1 strain rate range. Based on the true stress-true strain curves, the flow stress behavior of the Cu-Zr-Ce alloy was investigated. Microstructure evolution was observed by optical microscopy. Based on the experimental results, a constitutive equation, which reflects the relationships between the stress, strain, strain rate and temperature, has been established. Material constants n, α, Q and ln A were calculated as functions of strain. The equation predicting the flow stress combined with these materials constants has been proposed. The predicted stress is consistent with experimental stress, indicating that developed constitutive equation can adequately predict the flow stress of the Cu-Zr-Ce alloy. Dynamic recrystallization critical strain was determined using the work hardening rate method. According to the dynamic material model, the processing maps for the Cu-Zr and Cu-Zr-Ce alloy were obtained at 0.4 and 0.5 strain. Based on the processing maps and microstructure observations, the optimal processing parameters for the two alloys were determined, and it was found that the addition of Ce can promote the hot workability of the Cu-Zr alloy.

Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn-3.5Ag-xTi active solders

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wang, Wei-Lin, E-mail: wangwl77@gmail.com; Tsai, Yi-Chia, E-mail: tij@itri.org.tw

2012-06-15

Active solders Sn-3.5Ag-xTi varied from x = 0 to 6 wt.% Ti addition were prepared by vacuum arc re-melting and the resultant phase formation and variation of microstructure with titanium concentration were analyzed using X-ray diffraction, optical microscopy and scanning electron microscopy. The Sn-3.5Ag-xTi active solders are used as metallic filler to join with anodized 6061 Al alloy for potential applications of providing a higher heat conduction path. Their joints and mechanical properties were characterized and evaluated in terms of titanium content. The mechanical property of joints was measured by shear testing. The joint strength was very dependent on themore » titanium content. Solder with a 0.5 wt.% Ti addition can successfully wet and bond to the anodized aluminum oxide layers of Al alloy and posses a shear strength of 16.28 {+-} 0.64 MPa. The maximum bonding strength reached 22.24 {+-} 0.70 MPa at a 3 wt.% Ti addition. Interfacial reaction phase and chemical composition were identified by a transmission electron microscope with energy dispersive spectrometer. Results showed that the Ti element reacts with anodized aluminum oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti phases at the joint interfaces. - Highlights: Black-Right-Pointing-Pointer Active solder joining of anodized Al alloy needs 0.5 wt.% Ti addition for Sn-3.5Ag. Black-Right-Pointing-Pointer The maximum bonding strength occurs at 3 wt.% Ti addition. Black-Right-Pointing-Pointer The Ti reacts with anodized Al oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti at joint interface.« less

Highly recyclable and ultra-rapid catalytic reduction of organic pollutants on Ag-Cu@ZnO bimetal nanocomposite synthesized via green technology

NASA Astrophysics Data System (ADS)

Gangarapu, Manjari; Sarangapany, Saran; Suja, Devipriya P.; Arava, Vijaya Bhaskara Rao

2018-04-01

In this study, synthesis of Ag-Cu alloy bimetal nanoparticles anchored on high surface and porous ZnO using a facile, greener and low-cost aqeous bark extract of Aglaia roxburghiana for highly active, ultra-rapid and stable catalyst is performed. The nanocomposite was scrupulously characterized using UV-Vis spectrophotometer, X-ray diffraction, Raman spectrophotometer, high-resolution transmission electron microscope, selected area (electron) diffraction, scanning electron microscope with energy dispersive X-ray spectroscopy, and Fourier-transform infrared spectroscopy. The catalytic activity of the green synthesized Ag-Cu bimetal nanocomposite was evaluated in the reduction of 4-nitrophenol (4-NP), methylene blue (MB) and rhodamine B (Rh B) dyes. The different types of dye exhibited very high and effective catalytic activity within few seconds. The theoretical investigations reveal that the unique synergistic effect of Ag-Cu nanoparticles and immobilization over ZnO assists in the reduction of 4-NP, MB and Rh B. Loading and leaching of metal nanoparticles were obtained using inductively coupled plasma atomic emission spectroscopy. Moreover, the stable and efficient recyclability of nanocomposite by centrifugation after completion of the reaction was demonstrated. The results lead to the design different possible bimetal on ZnO with boosting and an effective catalyst for the environmental applications.

Thermoelectric properties of CuS/Ag{sub 2}S nanocomposites synthesed by modified polyol method

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tarachand,, E-mail: tarachand@csr.res.in; Sharma, Vikash; Ganesan, V.

This is the report on successful synthesis of Ag doped CuS nanostructures by modified polyol method. The resulting samples were characterized by powder X-ray diffraction (XRD), energy dispersive X-ray (EDX), atomic force microscopy (AFM) and dynamic light scattering (DLS). Particle size of pure CuS nanoparticles (NPs) was 17 nm, 38 nm and 97 nm as determined from Scherrer formula, AFM and DLS, respectively. Introduction of Ag led to formation of CuS/Ag{sub 2}S composites. A transition at 55 K in thermopower is ascribed to structural transformation from hexagonal to orthorhombic structure. Further, their thermoelectric properties exhibit remarkable change owing to Agmore » doping in CuS nanostructures. The power factor improves with increasing Ag content. They reveal that CuS/Ag{sub 2}S nanocomposites are some of the potential candidates for generation of thermoelectricity in future.« less

Pulse laser ablation of Au, Ag, and Cu metal targets in liquid for nanoparticle production

NASA Astrophysics Data System (ADS)

Herbani, Y.; Irmaniar; Nasution, R. S.; Mujtahid, F.; Masse, S.

2018-03-01

We have fabricated metal and oxide nanoparticles using pulse laser ablation of Au, Ag, and Cu metal targets immersed in water. While laser ablation of Au and Ag targets in water produced metal nanoparticles which were stable for a month even without any dispersant, we found CuO nanoparticles for Cu target due to rapid oxidation of Cu in water resulted in its poor stability. Au, Ag, and CuO nanoparticles production were barely identified by naked eyes for their distinctive colour of red, yellow, and dark green colloidal suspensions, respectively. It was also verified using UV-Vis spectrometer that Au, Ag, and CuO colloidal nanoparticles have their respective surface plasmon resonance at 520, 400, and 620 nm. TEM observation showed that particle sizes for all the fabricated nanoparticles were in the range of 20 – 40 nm with crystalline structures.

A new Cu(GeNx) alloy film for industrial applications

NASA Astrophysics Data System (ADS)

Lin, Chon-Hsin

2014-11-01

In this study, a copper alloy [Cu(GeNx)] film is developed for industrial applications by cosputtering Cu and Ge targets on a barrierless Si substrate within a vacuum chamber sparsely filled with N2 gas. Through extensive tests conducted in this study, the alloy film shows good thermal stability and adhesion to the substrate with no noticeable interactions between the film and the substrate after annealing at 720 °C for 1 h. The new Cu(GeNx) alloy film also renders adequate wetting for solders, shows good solderability, and has a dissolution rate lower than pure Cu by at least one order of magnitude, in addition to having a comparable consumption rate to Ni. The alloy film seems suitable for industrial applications in, e.g., barrierless Si metallization, interconnect manufacture and, the replacement of the wetting and diffusion layers for flip-chip solder joints in conventional metallurgy.

Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

NASA Astrophysics Data System (ADS)

Liu, C. Y.; Li, Jian; Vandentop, G. J.; Choi, W. J.; Tu, K. N.

2001-05-01

The wetting behavior of SnAg based Pb-free solders on Cu and Cu substrates plated with Au, Pd, and Au/Pd thin films have been studied. The wetting angle and kinetics of interfacial reaction were measured. The Au-plated substrates exhibit better wetting than the Pd-plated substrates. In the case of SnAg on Pd-plated Cu, SEM observation revealed that the solder cap was surrounded by an innerring of Cu-Sn compound and an outer ring of Pd-Sn compound. This implies that the molten SnAg solder had removed the Pd and wetted the Cu directly in the equilibrium state. The effects of pre-doping Cu in the SnAg solder on wetting behavior were also investigated. We found that wettability decreases with increasing Cu content in the solder. We also observed that the SnAgCu solders have a lower Cu consumption rate than the SnAg solder.

Mid-Gap States and Normal vs Inverted Bonding in Luminescent Cu+- and Ag+-Doped CdSe Nanocrystals.

PubMed

Nelson, Heidi D; Hinterding, Stijn O M; Fainblat, Rachel; Creutz, Sidney E; Li, Xiaosong; Gamelin, Daniel R

2017-05-10

Mid-gap luminescence in copper (Cu + )-doped semiconductor nanocrystals (NCs) involves recombination of delocalized conduction-band electrons with copper-localized holes. Silver (Ag + )-doped semiconductor NCs show similar mid-gap luminescence at slightly (∼0.3 eV) higher energy, suggesting a similar luminescence mechanism, but this suggestion appears inconsistent with the large difference between Ag + and Cu + ionization energies (∼1.5 eV), which should make hole trapping by Ag + highly unfavorable. Here, Ag + -doped CdSe NCs (Ag + :CdSe) are studied using time-resolved variable-temperature photoluminescence (PL) spectroscopy, magnetic circularly polarized luminescence (MCPL) spectroscopy, and time-dependent density functional theory (TD-DFT) to address this apparent paradox. In addition to confirming that Ag + :CdSe and Cu + :CdSe NCs display similar broad PL with large Stokes shifts, we demonstrate that both also show very similar temperature-dependent PL lifetimes and magneto-luminescence. Electronic-structure calculations further predict that both dopants generate similar localized mid-gap states. Despite these strong similarities, we conclude that these materials possess significantly different electronic structures. Specifically, whereas photogenerated holes in Cu + :CdSe NCs localize primarily in Cu(3d) orbitals, formally oxidizing Cu + to Cu 2+ , in Ag + :CdSe NCs they localize primarily in 4p orbitals of the four neighboring Se 2- ligands, and Ag + is not oxidized. This difference reflects a shift from "normal" to "inverted" bonding going from Cu + to Ag + . The spectroscopic similarities are explained by the fact that, in both materials, photogenerated holes are localized primarily within covalent [MSe 4 ] dopant clusters (M = Ag + , Cu + ). These findings reconcile the similar spectroscopies of Ag + - and Cu + -doped semiconductor NCs with the vastly different ionization potentials of their Ag + and Cu + dopants.

Experiment Analysis and Modelling of Compaction Behaviour of Ag60Cu30Sn10 Mixed Metal Powders

NASA Astrophysics Data System (ADS)

Zhou, Mengcheng; Huang, Shangyu; Liu, Wei; Lei, Yu; Yan, Shiwei

2018-03-01

A novel process method combines powder compaction and sintering was employed to fabricate thin sheets of cadmium-free silver based filler metals, the compaction densification behaviour of Ag60Cu30Sn10 mixed metal powders was investigated experimentally. Based on the equivalent density method, the density-dependent Drucker-Prager Cap (DPC) model was introduced to model the powder compaction behaviour. Various experiment procedures were completed to determine the model parameters. The friction coefficients in lubricated and unlubricated die were experimentally determined. The determined material parameters were validated by experiments and numerical simulation of powder compaction process using a user subroutine (USDFLD) in ABAQUS/Standard. The good agreement between the simulated and experimental results indicates that the determined model parameters are able to describe the compaction behaviour of the multicomponent mixed metal powders, which can be further used for process optimization simulations.

Guazuma ulmifolia bark-synthesized Ag, Au and Ag/Au alloy nanoparticles: Photocatalytic potential, DNA/protein interactions, anticancer activity and toxicity against 14 species of microbial pathogens.

PubMed

Karthika, Viswanathan; Arumugam, Ayyakannu; Gopinath, Kasi; Kaleeswarran, Periyannan; Govindarajan, Marimuthu; Alharbi, Naiyf S; Kadaikunnan, Shine; Khaled, Jamal M; Benelli, Giovanni

2017-02-01

In the present study, we focused on a quick and green method to fabricate Ag, Au and Ag/Au alloy nanoparticles (NPs) using the bark extract of Guazuma ulmifolia L. Green synthesized metal NPs were characterized using different techniques, including UV-Vis spectroscopy, FT-IR, XRD, AFM and HR-TEM analyses. The production of Ag, Au and Ag/Au alloy NPs was observed monitoring color change from colorless to brown, followed by pink and dark brown, as confirmed by UV-Vis spectroscopy characteristic peaks at 436, 522 and 510nm, respectively. TEM shed light on the spherical shapes of NPs with size ranges of 10-15, 20-25 and 10-20nm. Biosynthesized NPs showed good catalytic activity reducing two organic dyes, 4-nitrophenol (4-NP) and Congo red (CR). UV-vis spectroscopy, fluorescence, circular dichroism spectroscopy and viscosity analyses were used to investigate the NP binding with calf thymus DNA. The binding constant of NPs with DNA calculated in UV-Vis absorption studies were 1.18×10 4 , 1.83×10 4 and 2.91×10 4 M -1 , respectively, indicating that NPs were able to bind DNA with variable binding affinity: Ag/Au alloy NPs>Ag NPs>Au NPs. Ag/Au alloy NPs also showed binding activity to bovine serum albumin (BSA) over the other NPs. Ag and Ag/Au alloy NPs exhibited good antimicrobial activity on 14 species of microbial pathogens. In addition, the cytotoxic effects of Ag/Au alloy NPs were studied on human cervical cancer cells (HeLa) using MTT assay. Overall, our work showed the promising potential of bark-synthesized Ag and Ag/Au alloy NPs as cheap sources to develop novel and safer photocatalytic, antimicrobial and anticancer agents. Copyright © 2017. Published by Elsevier B.V.

Biodegradable Mg-Cu alloys with enhanced osteogenesis, angiogenesis, and long-lasting antibacterial effects

PubMed Central

Liu, Chen; Fu, Xuekun; Pan, Haobo; Wan, Peng; Wang, Lei; Tan, Lili; Wang, Kehong; Zhao, Ying; Yang, Ke; Chu, Paul K.

2016-01-01

A series of biodegradable Mg-Cu alloys is designed to induce osteogenesis, stimulate angiogenesis, and provide long-lasting antibacterial performance at the same time. The Mg-Cu alloys with precipitated Mg2Cu intermetallic phases exhibit accelerated degradation in the physiological environment due to galvanic corrosion and the alkaline environment combined with Cu release endows the Mg-Cu alloys with prolonged antibacterial effects. In addition to no cytotoxicity towards HUVECs and MC3T3-E1 cells, the Mg-Cu alloys, particularly Mg-0.03Cu, enhance the cell viability, alkaline phosphatase activity, matrix mineralization, collagen secretion, osteogenesis-related gene and protein expressions of MC3T3-E1 cells, cell proliferation, migration, endothelial tubule forming, angiogenesis-related gene, and protein expressions of HUVECs compared to pure Mg. The favorable osteogenesis and angiogenesis are believed to arise from the release of bioactive Mg and Cu ions into the biological environment and the biodegradable Mg-Cu alloys with osteogenesis, angiogenesis, and long-term antibacterial ability are very promising in orthopedic applications. PMID:27271057

The interaction of Ag with Bi-Pb-Sr-Ca-Cu-O superconductor

NASA Astrophysics Data System (ADS)

Dou, S. X.; Song, K. H.; Liu, H. K.; Sorrell, C. C.; Apperley, M. H.; Gouch, A. J.; Savvides, N.; Hensley, D. W.

1989-10-01

Bi-Pb-Sr-Ca-Cu-O superconductor compounds have been doped with up to 30 wt% Ag, sintered under variable oxygen partial pressure, and characterised in terms of the electrical and crystallographic behaviour. In contrast to previous reports that claim that Ag is the only metal non-poisoning to the superconductivity of Bi-Sr-Ca-Cu-O (BSCCO), it has been found that Ag additions to Bi-Pb-Sr-Ca-Cu-O depress Tc and Jc drastically and cause a large decrease in lattice parameters when samples are treated in air or pure oxygen. However, the lattice parameters, Tc and Jc remain unaffected by Ag additions when samples are heat treated in 0.030-0.067 atm oxygen. It is clear that the Ag reacts with and destabilises the superconducting phase when the samples are treated in air or pure oxygen while, when the samples are heat treated in low oxygen partial pressures, the Ag remains as an isolated inert metal phase that improves the weak links between the grains. This discovery clearly shows the feasibility of Ag-clad superconductor wire. For Ag-clad superconductor tape of 0.1 mm 2 cross sectional area heat treated in air, Jc was measured to be 54 A/cm 2. The same specimen sintered in 0.067 atm oxygen showed that the Jc increased to 2078 A/cm 2.

Facile synthesis of hollow dendritic Ag/Pt alloy nanoparticles for enhanced methanol oxidation efficiency.

PubMed

Sui, Ning; Wang, Ke; Shan, Xinyao; Bai, Qiang; Wang, Lina; Xiao, Hailian; Liu, Manhong; Colvin, Vicki L; Yu, William W

2017-11-14

Hollow dendritic Ag/Pt alloy nanoparticles were synthesized by a double template method: Ag nanoparticles as the hard template to obtain hollow spheres by a galvanic replacement reaction between PtCl 6 2- and metallic Ag and surfactant micelles (Brij58) as the soft template to generate porous dendrites. The formation of a Ag/Pt alloy phase was confirmed by XRD and HRTEM. Elemental mapping and line scanning revealed the formation of the hollow architecture. We studied the effects of the Ag/Pt ratio, surfactant and reaction temperature on the morphology. In addition, we explored the formation process of hollow dendritic Ag/Pt nanoparticles by tracking the morphologies of the nanostructures formed at different stages. In order to improve the electrocatalytic property, we controlled the size of the nanoparticles and the thickness of the shell by adjusting the amount of the precursor. We found that these Ag/Pt alloy nanoparticles exhibited high activity (440 mA mg -1 ) and stability as an electrocatalyst for catalyzing methanol oxidation.

Controlling Magnetism via Transition Metal Exchange in the Series of Intermetallics Eu( T1, T2)5In ( T = Cu, Ag, Au)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mudring, Anja -Verena; Smetana, Volodymyr; Pecharsky, Vitalij K.

Three series of intermetallic compounds Eu( T1, T2) 5In (T = Cu, Ag, Au) have been investigated in full compositional ranges. Single crystals of all compounds have been obtained by self-flux and were analyzed by single X-ray diffraction revealing the representatives to fall into two structure types: CeCu 6 ( oP28, Pnma, a = 8.832(3)–9.121(2) Å, b = 5.306(2)–5.645(1) Å, c = 11.059(4)–11.437(3) Å, V = 518.3(3)–588.9(2) Å 3) and YbMo2Al4 ( t I14, I4/ mmm, a = 5.417(3)–5.508(1) Å, c = 7.139(2)– 7.199(2) Å, V = 276.1(2)–285.8(1) Å 3). The structural preference was found to depend on the cation/anionmore » size ratio, while the positional preference within the CeCu 6 type structure shows an apparent correlation with the anion size. Chemical compression, hence, a change in cell volume, which occurs upon anion substitution appears to be the main driving force for the change of magnetic ordering. While EuAg 5In shows antiferromagnetic behavior at low temperatures, mixing Cu and Au within the same type of structure results in considerable changes in the magnetism. The Eu(Cu,Au) 5In alloys with CeCu 6 structure show complex magnetic behaviors and strong magnetic field-induced spin-reorientation transition with the critical field of the transition being dependent on Cu/Au ratio. The alloys adopting the YbMo 2Al 4 type structure are ferromagnets exhibiting unusually high magnetic moments. The heat capacity of EuAu 2.66Cu 2.34In reveals a double-peak structure evolving with the magnetic field. Furthermore, low-temperature X-ray powder diffraction does not show a structural transition.« less

Controlling Magnetism via Transition Metal Exchange in the Series of Intermetallics Eu( T1, T2)5In ( T = Cu, Ag, Au)

DOE PAGES

Mudring, Anja -Verena; Smetana, Volodymyr; Pecharsky, Vitalij K.; ...

2017-11-24

Three series of intermetallic compounds Eu( T1, T2) 5In (T = Cu, Ag, Au) have been investigated in full compositional ranges. Single crystals of all compounds have been obtained by self-flux and were analyzed by single X-ray diffraction revealing the representatives to fall into two structure types: CeCu 6 ( oP28, Pnma, a = 8.832(3)–9.121(2) Å, b = 5.306(2)–5.645(1) Å, c = 11.059(4)–11.437(3) Å, V = 518.3(3)–588.9(2) Å 3) and YbMo2Al4 ( t I14, I4/ mmm, a = 5.417(3)–5.508(1) Å, c = 7.139(2)– 7.199(2) Å, V = 276.1(2)–285.8(1) Å 3). The structural preference was found to depend on the cation/anionmore » size ratio, while the positional preference within the CeCu 6 type structure shows an apparent correlation with the anion size. Chemical compression, hence, a change in cell volume, which occurs upon anion substitution appears to be the main driving force for the change of magnetic ordering. While EuAg 5In shows antiferromagnetic behavior at low temperatures, mixing Cu and Au within the same type of structure results in considerable changes in the magnetism. The Eu(Cu,Au) 5In alloys with CeCu 6 structure show complex magnetic behaviors and strong magnetic field-induced spin-reorientation transition with the critical field of the transition being dependent on Cu/Au ratio. The alloys adopting the YbMo 2Al 4 type structure are ferromagnets exhibiting unusually high magnetic moments. The heat capacity of EuAu 2.66Cu 2.34In reveals a double-peak structure evolving with the magnetic field. Furthermore, low-temperature X-ray powder diffraction does not show a structural transition.« less

Correlation between the resistivity and the atomic clusters in liquid Cu-Sn alloys

NASA Astrophysics Data System (ADS)

Jia, Peng; Zhang, Jinyang; Hu, Xun; Li, Cancan; Zhao, Degang; Teng, XinYing; Yang, Cheng

2018-05-01

The liquid structure of CuxSn100-x (x = 0, 10, 20, 33, 40, 50, 60, 75, 80 and 100) alloys with atom percentage were investigated with resistivity and viscosity methods. It can be found from the resistivity data that the liquid Cu75Sn25 and Cu80Sn20 alloys had a negative temperature coefficient of resistivity (TCR), and liquid Cu75Sn25 alloy had a minimum value of -9.24 μΩ cm K-1. While the rest of liquid Cu-Sn alloys had a positive TCR. The results indicated that the Cu75Sn25 atomic clusters existed in Cu-Sn alloys. In addition, the method of calculating the percentage of Cu75Sn25 atomic clusters was established on the basis of resistivity theory and the law of conservation of mass. The Cu75Sn25 alloy had a maximum volume of the atomic clusters and a highest activation energy. The results further proved the existence of Cu75Sn25 atomic clusters. Furthermore, the correlation between the liquid structure and the resistivity was established. These results provide a useful reference for the investigation of liquid structure via the sensitive physical properties to the liquid structure.

Dissimilar Joining of Stainless Steel and 5083 Aluminum Alloy Sheets by Gas Tungsten Arc Welding-Brazing Process

NASA Astrophysics Data System (ADS)

Cheepu, Muralimohan; Srinivas, B.; Abhishek, Nalluri; Ramachandraiah, T.; Karna, Sivaji; Venkateswarlu, D.; Alapati, Suresh; Che, Woo Seong

2018-03-01

The dissimilar joining using gas tungsten arc welding - brazing of 304 stainless steel to 5083 Al alloy had been conducted with the addition of Al-Cu eutectic filler metal. The interface microstructure formation between filler metal and substrates, and spreading of the filler metal were studied. The interface microstructure between filler metal and aluminum alloy characterized that the formation of pores and elongated grains with the initiation of micro cracks. The spreading of the liquid braze filler on stainless steel side packed the edges and appeared as convex shape, whereas a concave shape has been formed on aluminum side. The major compounds formed at the fusion zone interface were determined by using X-ray diffraction techniques and energy-dispersive X-ray spectroscopy analysis. The micro hardness at the weld interfaces found to be higher than the substrates owing to the presence of Fe2Al5 and CuAl2 intermetallic compounds. The maximum tensile strength of the weld joints was about 95 MPa, and the tensile fracture occurred at heat affected zone on weak material of the aluminum side and/or at stainless steel/weld seam interface along intermetallic layer. The interface formation and its effect on mechanical properties of the welds during gas tungsten arc welding-brazing has been discussed.

Evolution of the interfacial phases in Al2O3-Kovar® joints brazed using a Ag-Cu-Ti-based alloy

NASA Astrophysics Data System (ADS)

Ali, Majed; Knowles, Kevin M.; Mallinson, Phillip M.; Fernie, John A.

2017-04-01

A systematic investigation of the brazing of Al2O3 to Kovar® (Fe-29Ni-17Co wt.%) using the active braze alloy (ABA) Ag-35.25Cu-1.75Ti wt.% has been undertaken to study the chemical reactions at the interfaces of the joints. The extent to which silica-based secondary phases in the Al2O3 participate in the reactions at the ABA/Al2O3 interface has been clarified. Another aspect of this work has been to determine the influence of various brazing parameters, such as the peak temperature, Tp, and time at Tp, τ, on the resultant microstructure. As a consequence, the microstructural evolution of the joints as a function of Tp and τ is discussed in some detail. The formation of a Fe2Ti layer on the Kovar® and its growth, along with adjacent Ni3Ti particles in the ABA, dominate the microstructural developments at the ABA/Kovar® interface. The presence of Kovar® next to the ABA does not change the intrinsic chemical reactions occurring at the ABA/Al2O3 interface. However, the extent of these reactions is limited if the purity of the Al2O3 is high, and so it is necessary to have some silica-rich secondary phase in the Al2O3 to facilitate the formation of a Ti3Cu3O layer on the Al2O3. Breakdown of the Ti3Cu3O layer, together with fracture of the Fe2Ti layer and separation of this layer from the Kovar®, has been avoided by brazing at temperatures close to the liquidus temperature of the ABA for short periods of time, e.g., for Tp between 820 and 830 °C and τ between 2 and 8 min.

[delta] precipitation in an Al-Li-Cu-Mg-Zr alloy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Prasad, K.S.; Mukhopadhyay, A.K.; Gokhale, A.A.

1994-05-15

AlLi based [delta] phase has an NaTl structure (i.e., a diamond cubic) with a = 0.637nm and is an equilibrium phase in the binary Al-Li system. In heat treated binary Al-Li alloys of appropriate compositions, [delta] phase can format grain boundaries as well as within the grains. In commercially heat treated Al-Li-Cu alloys of 2090 specification, the grain boundary precipitate [delta] of the binary Al-Li system is replaced by a combination of T[sub 2](Al[sub 6]CuLi[sub 3]), R(Al[sub 5]CuLi[sub 3]) and T[sub 1](Al[sub 2]CuLi) phases. In similarly treated Al-Li-Cu-Mg alloys of 8090 specification, the copper rich T[sub 2] phase, present inmore » the form of Al[sub 6]CuLi[sub 3[minus]x]Mg[sub x], is known to be the major coarse g.b. precipitate. The presence of an Al-Li-Cu-Mg based C phase at the grain boundaries of the commercially heat treated 8090 alloys has also been documented. No detailed study has yet been carried out to verify whether the [delta] phase can be present at the grain boundaries of the commercially heat treated 8090 alloys. Given the correlations between the g.b. phase morphology, g.b. phase chemistry, and the stress corrosion cracking resistance of these alloys, it is important that the g.b. precipitates be examined and identified. In this paper results using TEM are presented to show that the [delta] phase can be present in varying amounts at the grain boundaries in an 8090 alloy when heat treated in the temperature range of 170--350 C. An examination is also made of the [delta] precipitation within the grain to establish that the T[sub 2]/[alpha]-Al interface is the dominant nucleation site for the noncoherent [delta] phase.« less

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films.

PubMed

Zhao, J T; Zhang, J Y; Hou, Z Q; Wu, K; Feng, X B; Liu, G; Sun, J

2018-05-11

In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

Growth of Pt/Cu(100): An Atomistic Modeling Comparison with the Pd/Cu(100) Surface Alloy

NASA Technical Reports Server (NTRS)

Demarco, Gustavo; Garces, Jorge E.; Bozzolo, Guillermo

2002-01-01

The Bozzolo, Ferrante, and Smith (BFS) method for alloys is applied to the study of Pt deposition on Cu(100). The formation of a Cu-Pt surface alloy is discussed within the framework of previous results for Pd/Cu(100). In spite of the fact that both Pd and Pt share the same basic behavior when deposited on Cu, it is seen that subtle differences become responsible for the differences in growth observed at higher cover-ages. In agreement with experiment, all the main features of Pt/Cu(100) and Pd/Cu(100) are obtained by means of a simple modeling scheme, and explained in terms of a few basic ingredients that emerge from the BFS analysis.

The effect of TiB2 reinforcement on the mechanical properties of an Al-Cu-Li alloy-based metal-matrix composite

NASA Technical Reports Server (NTRS)

Langan, T. J.; Pickens, J. R.

1991-01-01

Weldalite 049, an Al-base Cu-Li-Mg-Ag-Zr alloy, achieves 700 MPa tensile strengths in the near-peak-aged temper in virtue of the nucleation of a T(1)-type platelike strengthening precipitate. Attention is presently given to the possibility that the alloy's modulus could be further increased through the addition of high-modulus TiB2 particles, using the 'XD' process, due to TiB2's good wettability with liquid Al. An 8-percent modulus increase is obtained with 4 vol pct TiB2.

Novel combination of zero-valent Cu and Ag nanoparticles @ cellulose acetate nanocomposite for the reduction of 4-nitro phenol.

PubMed

Khan, Farman Ullah; Asimullah; Khan, Sher Bahadar; Kamal, Tahseen; Asiri, Abdullah M; Khan, Ihsan Ullah; Akhtar, Kalsoom

2017-09-01

A very simple and low-cost procedure has been adopted to synthesize efficient copper (Cu), silver (Ag) and copper-silver (Cu-Ag) mixed nanoparticles on the surface of pure cellulose acetate (CA) and cellulose acetate-copper oxide nanocomposite (CA-CuO). All nanoparticles loaded onto CA and CA-CuO presented excellent catalytic ability, but Cu-Ag nanoparticles loaded onto CA-CuO (Cu 0 -Ag 0 /CA-CuO) exhibited outstanding catalytic efficiency to convert 4-nitrophenol (4-NP) into 4-aminophenol (4-AP) in the presence of NaBH 4 . Additionally, the Cu 0 -Ag 0 /CA-CuO can be easily recovered by removing the sheet from the reaction media, and can be recycled several times, maintaining high catalytic ability for four cycles. Copyright © 2017 Elsevier B.V. All rights reserved.

Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint

NASA Astrophysics Data System (ADS)

Wang, Fengjiang; Zhou, Lili; Zhang, Zhijie; Wang, Jiheng; Wang, Xiaojing; Wu, Mingfang

2017-10-01

Reliability issues caused by the formation of a Bi-rich layer at the anode interface usually occurs in the Sn-58Bi eutectic solder joint during electromigration (EM). To improve the EM performance of a Sn-58Bi solder joint, Sn-3.0Ag-0.5Cu solder was introduced into it to produce SnBi-SnAgCu structural or compositional composite joints, and their EM behaviors were investigated with the current density of 1.0 × 104 A/cm2 for different stressing times. The structure of the compositional composite solder joint was obtained by the occurrence of partial or full mixing between Sn-Bi and Sn-Ag-Cu solder with a suitable soldering temperature. In the structural composite joint, melted Sn-Bi was partially mixed with Sn-Ag-Cu solder to produce a Cu/Sn-Bi/Sn-Ag-Cu/Sn-Bi/Cu structure. In the compositional composite joint, full melting and mixing between these two solders occurred to produce a Cu/Sn-Ag-Cu-Bi/Cu structure, in which the solder matrix was a homogeneous structure including Sn, Bi phases, Cu6Sn5 and Ag3Sn IMCs. After current stressing, the EM performance of Sn-Bi solder was obviously improved with the structural or the compositional composite joint. In Sn-58Bi joints, a thick Bi-rich layer was easily produced at the anode interface, and obviously increased with stressing time. However, after current stressing on the structural composite joints, the existence of s Sn-3.0Ag-0.5Cu interlayer between the two Sn-58Bi solders effectively acted as a diffusion barrier and significantly slowed the formation of the Bi-rich layer at the anode side and the IMC thicknesses at the interfaces.

Production of Oxidation-Resistant Cu-Based Nanoparticles by Wire Explosion

PubMed Central

Kawamura, Go; Alvarez, Samuel; Stewart, Ian E.; Catenacci, Matthew; Chen, Zuofeng; Ha, Yoon-Cheol

2015-01-01

The low performance or high cost of commercially available conductive inks limits the advancement of printed electronics. This article studies the explosion of metal wires in aqueous solutions as a simple, low-cost, and environmentally friendly method to prepare metallic nanoparticles consisting of Cu and Cu alloys for use in affordable, highly conductive inks. Addition of 0.2 M ascorbic acid to an aqueous explosion medium prevented the formation of Cu2O shells around Cu nanoparticles, and allowed for the printing of conductive lines directly from these nanoparticles with no post-treatment. Cu alloy nanoparticles were generated from metal wires that were alloyed as purchased, or from two wires of different metals that were twisted together. Cu nanoparticles alloyed with 1% Sn, 5% Ag, 5% Ni and 30% Ni had electrical conductivities similar to Cu but unlike Cu, remained conductive after 24 hrs at 85 °C and 85% RH. PMID:26669447

The successful incorporation of Ag into single grain, Y-Ba-Cu-O bulk superconductors

NASA Astrophysics Data System (ADS)

Congreve, Jasmin V. J.; Shi, Yunhua; Dennis, Anthony R.; Durrell, John H.; Cardwell, David A.

2018-07-01

The use of RE-Ba-Cu-O [(RE)BCO] bulk superconductors, where RE = Y, Gd, Sm, in practical applications is, at least in part, limited by their mechanical properties and brittle nature, in particular. Alloying these materials with silver, however, produces a significant improvement in strength without any detrimental impact on their superconducting properties. Unfortunately, the top seeded melt growth technique, used routinely to process bulk (RE)BCO superconductors in the form of large, single grains required for practical applications, is complex and has a large number of inter-related variables, so the addition of silver increases the complexity of the growth process even further. This can make successful growth of this system extremely challenging. Here we report measurements of the growth rate of YBCO-Ag fabricated using a new growth technique consisting of continuous cooling and isothermal hold process. The resulting data form the basis of a model that has been used to derive suitable heating profiles for the successful single grain growth of YBCO-Ag bulk superconductors of up to 26 mm in diameter. The microstructure and distribution of silver within these samples have been studied in detail. The maximum trapped field at the top surface of the bulk YBCO-Ag samples has been found to be comparable to that of standard YBCO processed without Ag. The YBCO-Ag samples also exhibit a much more uniform trapped field profile compared to that of YBCO.

Thermally promoted evolution of open-volume defects and Cu precipitates in the deformed FeCu alloys

NASA Astrophysics Data System (ADS)

Jin, Shuoxue; Cao, Xingzhong; Cheng, Guodong; Lian, Xiangyu; Zhu, Te; Zhang, Peng; Yu, Runsheng; Wang, Baoyi

2018-04-01

We have studied the effect of isothermal annealing on the evolution of the open-volume defect and the Cu precipitate in deformed Fe0.15Cu, Fe0.3Cu and Fe0.6Cu alloys. Using the coincidence Doppler broadening, positron annihilation lifetime and the S-W couples, the evolution of local electronic circumstance around the annihilation sites, open-volume defects and interaction between open-volume defects and Cu precipitates were measured as a function of the isothermal annealing temperatures. Cold rolling deformation induced an obvious increment in S parameters due to the formation of open-volume defects. Annealing not only resulted in gradual recovery of open-volume defects and Cu thermal precipitation, but also promoted the combination and interaction between defects and Cu precipitates. The interaction between open-volume defects and Cu precipitates was revealed clearly by the view point of S-W relationship. The S-W interaction for the different CumVn complexes was also calculated theoretically by MIKA-Doppler, which supports our experimental observations qualitatively. The results indicate that open-volume defects were formed first after cold rolling, followed by the Cu precipitation and recovery of open-volume defects, Cu precipitates recovered at the end. It is interesting that the trajectory of (S, W) points with increasing annealing temperature formed a similar closed "Parallelogram" shape. It is benefit for revealing the behavior of Cu thermal precipitation and their evolution in various Cu-bearing steels under thermal treatment. In addition, we also investigated the Cu content effect on the Cu precipitation in FeCu alloys, and the Cu precipitate phenomenon was enhanced in higher Cu content alloys.

Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications

NASA Astrophysics Data System (ADS)

Jiang, Hongjin

SnPb solders have long been used as interconnect materials in microelectronic packaging. Due to the health threat of lead to human beings, the use of lead-free interconnect materials is imperative. Three kinds of lead-free interconnect materials are being investigated, namely lead-free metal solders (SnAg, SnAgCu, etc.), electrically conductive adhesives (ECAs) and carbon nanotubes (CNTs). However, there are still limitations for the full utilization of these lead-free interconnect materials in the microelectronic packaging, such as higher melting point of lead-free metal solders, lower electrical conductivity of the ECAs and poor adhesion of CNTs to substrates. This thesis is devoted to the research and development of low processing temperature lead-free interconnect materials for microelectronic packaging applications with an emphasis on fundamental studies of nanoparticles synthesis, dispersion and oxidation prevention, and nanocomposites fabrication. Oxide-free tin (Sn), tin/silver (96.5Sn3.5Ag) and tin/silver/copper (96.5Sn3.0Ag0.5Cu) alloy nanoparticles with different sizes were synthesized by a low temperature chemical reduction method. Both size dependent melting point and latent heat of fusion of the synthesized nanoparticles were obtained. The nano lead-free solder pastes/composites created by dispersing the SnAg or SnAgCu alloy nanoparticles into an acidic type flux spread and wet on the cleaned copper surface at 220 to 230°C. This study demonstrated the feasibility of nano sized SnAg or SnAgCu alloy particle pastes for low processing temperature lead-free interconnect applications in microelectronic packaging.

Study of Cu-Al-Ni-Ga as high-temperature shape memory alloys

NASA Astrophysics Data System (ADS)

Zhang, Xin; Wang, Qian; Zhao, Xu; Wang, Fang; Liu, Qingsuo

2018-03-01

The effect of Ga element on the microstructure, mechanical properties and shape memory effect of Cu-13.0Al-4.0Ni- xGa (wt%) high-temperature shape memory alloy was investigated by optical microscopy, SEM, XRD and compression test. The microstructure observation results showed that the Cu-13.0Al-4.0Ni- xGa ( x = 0.5 and 1.0) alloys displayed dual-phase morphology which consisted of 18R martensite and (Al, Ga)Cu phase, and their grain size was about several hundred microns, smaller than that of Cu-13.0Al-4.0Ni alloy. The compression test results proved that the mechanical properties of Cu-13.0Al-4.0Ni- xGa alloys were improved by addition of Ga element owing to the grain refinement and solid solution strengthening, and the compressive fracture strains were 11.5% for x = 0.5 and 14.9% for x = 1.0, respectively. When the pre-strain was 8%, the shape memory effect of 4.2 and 4.6% were obtained for Cu-13.0Al-4.0Ni-0.5 Ga and Cu-13.0Al-4.0Ni-1.0 Ga alloys after being heated to 400 °C for 1 min.

Growth and structural evolution of Sn on Ag(001): Epitaxial monolayer to thick alloy film

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chakraborty, Suvankar; Menon, Krishnakumar S. R., E-mail: krishna.menon@saha.ac.in

The growth and structure of Sn on Ag(001), from submonolayer to thick film coverages at room temperature, are studied using low energy electron diffraction, x-ray photoemission spectroscopy and angle-resolved photoemission spectroscopy (ARPES) techniques. The authors observe different growth modes for submonolayer Sn coverages and for higher Sn coverages. Systematic surface structural evolution, consistent with the substitution of surface Ag atoms by Sn atoms, is observed for submonolayer Sn coverages while an ordered Ag-Sn bulk alloy film is formed for higher Sn coverages with an Ag overlayer. For monolayer coverage of Sn, a pseudomorphic growth of a Sn layer without alloyingmore » is determined. ARPES results also confirm the presence of an ordered Ag overlayer on the bulk Ag-Sn alloy film, suggesting the formation of an Ag/Ag{sub 3}Sn/Ag(001) sandwich structure at the surface for higher Sn coverages. The present results illustrate the complex interplay of atomic mobilities, surface free-energies, and alloy formation energies in determining the growth and structural properties of the system.« less

Au 329–xAg x(SR) 84 Nanomolecules: Plasmonic Alloy Faradaurate-329

DOE PAGES

Kumara, Chanaka; Zuo, Xiaobing; Cullen, David A.; ...

2015-08-10

Though significant progress has been made to improve the monodispersity of larger (>10 nm) alloy metal nanoparticles, there still exists a significant variation in nanoparticle composition, ranging from ±1000s of atoms. Here in this paper, for the first time, we report the synthesis of atomically precise (±0 metal atom variation) Au 329–xAg x(SCH 2CH 2Ph) 84 alloy nanomolecules. The composition was determined using high resolution electrospray ionization mass spectrometry. In contrast to larger (>10 nm) Au–Ag nanoparticles, the surface plasmon resonance (SPR) peak does not show a major shift, but a minor ~10 nm red-shift, upon increasing silver content. Themore » intensity of the SPR peak also varies in an intriguing manner, where a dampening is observed with medium silver incorporation, and a significant sharpening is observed upon higher Ag content. The report outlines (a) an unprecedented advance in nanoparticle mass spectrometry of high mass at atomic precision; and (b) the unexpected optical behavior of Au–Ag alloys in the region where nascent SPR emerges; specifically, in this work, the SPR-like peak does not show a major ~100 nm blue-shift with Ag alloying of Au 329 nanomolecules, as shown to be common in larger nanoparticles.« less

Microstructure, Surface Characterization, and Electrochemical Behavior of New Ti-Zr-Ta-Ag Alloy in Simulated Human Electrolyte

NASA Astrophysics Data System (ADS)

Vasilescu, Cora; Drob, Silviu Iulian; Osiceanu, Petre; Moreno, Jose Maria Calderon; Prodana, Mariana; Ionita, Daniela; Demetrescu, Ioana; Marcu, Maria; Popovici, Ion Alexandru; Vasilescu, Ecaterina

2017-01-01

A new Ti-20Zr-5Ta-2Ag alloy was elaborated and characterized regarding its microstructure, its native passive film composition and thickness, its surface wettability, its electrochemical behavior in Ringer solution of different pH values, and its ion release. The new alloy has a bi-phase, α + β, acicular, homogeneous microstructure (scanning electron microscopy (SEM)). Its native passive film (12-nm thicknesses) consists of the protective TiO2, ZrO2, and Ta2O5 oxides, Ti and Ta suboxides, and metallic Ag (X-ray photoelectron spectroscopy (XPS) data). The alloy possesses high hydrophilic properties. The main electrochemical parameters of the new alloy are superior to those of Ti as a result of the beneficial influence of Zr, Ta, and Ag alloying elements, which reinforce its native passive film. Electrochemical impedance spectroscopy (EIS) spectra in Ringer solutions for the new alloy displayed better values of impedances and phase angles, proving a more insulate passive film than that on the Ti surface. The main corrosion parameters for the new Ti-20Zr-5Ta-2Ag alloy are more favorable by about 25 to 38 times than those of Ti, confirming extremely resistant passive film. The new Ti-20Zr-5Ta-2Ag alloy releases into Ringer solution low quantities of Ti4+, Zr4+ metallic ions (inductively coupled plasma-mass spectroscopy (ICP-MS)). The Ag+ ions are released in low quantity, conferring to this alloy's low antibacterial activity. All experimental results show that the new Ti-20Zr-5Ta-2Ag alloy fulfills the requirements for biocompatibility, corrosion resistance, and antibacterial protection.

Oxidation-Reduction Resistance of Advanced Copper Alloys

NASA Technical Reports Server (NTRS)

Greenbauer-Seng, L. (Technical Monitor); Thomas-Ogbuji, L.; Humphrey, D. L.; Setlock, J. A.

2003-01-01

Resistance to oxidation and blanching is a key issue for advanced copper alloys under development for NASA's next generation of reusable launch vehicles. Candidate alloys, including dispersion-strengthened Cu-Cr-Nb, solution-strengthened Cu-Ag-Zr, and ODS Cu-Al2O3, are being evaluated for oxidation resistance by static TGA exposures in low-p(O2) and cyclic oxidation in air, and by cyclic oxidation-reduction exposures (using air for oxidation and CO/CO2 or H2/Ar for reduction) to simulate expected service environments. The test protocol and results are presented.

Quasi-Instantaneous Bacterial Inactivation on Cu-Ag Nanoparticulate 3D Catheters in the Dark and Under Light: Mechanism and Dynamics.

PubMed

Rtimi, Sami; Sanjines, Rosendo; Pulgarin, Cesar; Kiwi, John

2016-01-13

The first evidence for Cu-Ag (50%/50%) nanoparticulate hybrid coatings is presented leading to a complete and almost instantaneous bacterial inactivation in the dark (≤5 min). Dark bacterial inactivation times on Cu-Ag (50%/50%) were observed to coincide with the times required by actinic light irradiation. This provides the evidence that the bimetal Cu-Ag driven inactivation predominates over a CuO/Cu2O and Ag2O oxides inducing a semiconductor driven behavior. Cu- or Ag-coated polyurethane (PU) catheters led to bacterial inactivation needing about ∼30 min. The accelerated bacterial inactivation by Cu-Ag coated on 3D catheters sputtered was investigated in a detailed way. The release of Cu/Ag ions during bacterial inactivation was followed by inductively coupled plasma mass-spectrometry (ICP-MS) and the amount of Cu and Ag-ions released were below the cytotoxicity levels permitted by the sanitary regulations. By stereomicroscopy the amount of live/dead cells were followed during the bacterial inactivation time. By Fourier transform infrared spectroscopy (FTIR), the systematic shift of the -(CH2) band stretching of the outer lipo-polysaccharide bilayer (LPS) was followed to monitor the changes leading to cell lysis. A hydrophobic to hydrophilic transformation of the Cu-Ag PU catheter surface under light was observed within 30 min followed concomitantly to a longer back transformation to the hydrophobic initial state in the dark. Physical insight is provided for the superior performance of Cu-Ag films compared to Cu or Ag films in view of the drastic acceleration of the bacterial inactivation observed on bimetal Cu-Ag films coating PU catheters. A mechanism of bacterial inactivation is suggested that is consistent with the findings reported in this study.

LaCu 6-xAg x: A promising host of an elastic quantum critical point

DOE Office of Scientific and Technical Information (OSTI.GOV)

Poudel, Lekh; Dela Cruz, Clarina R.; Koehler, Michael R.

Structural properties of LaCu 6-xAg x have been investigated using neutron and x-ray diffraction, and resonant ultrasound spectroscopy (RUS) measurements. Diffraction measurements indicate a continuous structural transition from orthorhombic (Pnma) to monoclinic (P2₁/C) structure. RUS measurements show softening of natural frequencies at the structural transition, consistent with the elastic nature of the structural ground state. The structural transition temperatures in LaCu 6-xAg x decrease with Ag composition until the monoclinic phase is completely suppressed at x c=0.225. All of the evidence is consistent with the presence of an elastic quantum critical point in LaCu 6-xAg x.

Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study

NASA Astrophysics Data System (ADS)

Zhou, Wei; Liu, Lijuan; Li, Baoling; Wu, Ping

2009-06-01

Electromigration phenomena in a one-dimensional Cu/SnAg3.0Cu0.5/Cu joint were investigated with current stressing. The special effect of intermetallic compound (IMC) layers on the formation of serious electromigration damage induced by nonuniform current density distribution was discussed based on experimental results. Meanwhile, hillocks were observed both at the anode and near the cathode of the joint, and they were described as the result of diffusion of atoms and compressive stress released along grain boundaries to the relatively free surface. Moreover, the diffusion behavior of Cu at the cathode was analyzed with the electromigration equation, and the stability of Ag atoms in the solder during electromigration was evaluated with a first-principles method.

Design and development of novel antibacterial Ti-Ni-Cu shape memory alloys for biomedical application.

PubMed

Li, H F; Qiu, K J; Zhou, F Y; Li, L; Zheng, Y F

2016-11-29

In the case of medical implants, foreign materials are preferential sites for bacterial adhesion and microbial contamination, which can lead to the development of prosthetic infections. Commercially biomedical TiNi shape memory alloys are the most commonly used materials for permanent implants in contact with bone and dental, and the prevention of infections of TiNi biomedical shape memory alloys in clinical cases is therefore a crucial challenge for orthopaedic and dental surgeons. In the present study, copper has been chosen as the alloying element for design and development novel ternary biomedical Ti‒Ni‒Cu shape memory alloys with antibacterial properties. The effects of copper alloying element on the microstructure, mechanical properties, corrosion behaviors, cytocompatibility and antibacterial properties of biomedical Ti‒Ni‒Cu shape memory alloys have been systematically investigated. The results demonstrated that Ti‒Ni‒Cu alloys have good mechanical properties, and remain the excellent shape memory effects after adding copper alloying element. The corrosion behaviors of Ti‒Ni‒Cu alloys are better than the commercial biomedical Ti‒50.8Ni alloys. The Ti‒Ni‒Cu alloys exhibit excellent antibacterial properties while maintaining the good cytocompatibility, which would further guarantee the potential application of Ti‒Ni‒Cu alloys as future biomedical implants and devices without inducing bacterial infections.

Design and development of novel antibacterial Ti-Ni-Cu shape memory alloys for biomedical application

NASA Astrophysics Data System (ADS)

Li, H. F.; Qiu, K. J.; Zhou, F. Y.; Li, L.; Zheng, Y. F.

2016-11-01

In the case of medical implants, foreign materials are preferential sites for bacterial adhesion and microbial contamination, which can lead to the development of prosthetic infections. Commercially biomedical TiNi shape memory alloys are the most commonly used materials for permanent implants in contact with bone and dental, and the prevention of infections of TiNi biomedical shape memory alloys in clinical cases is therefore a crucial challenge for orthopaedic and dental surgeons. In the present study, copper has been chosen as the alloying element for design and development novel ternary biomedical Ti‒Ni‒Cu shape memory alloys with antibacterial properties. The effects of copper alloying element on the microstructure, mechanical properties, corrosion behaviors, cytocompatibility and antibacterial properties of biomedical Ti‒Ni‒Cu shape memory alloys have been systematically investigated. The results demonstrated that Ti‒Ni‒Cu alloys have good mechanical properties, and remain the excellent shape memory effects after adding copper alloying element. The corrosion behaviors of Ti‒Ni‒Cu alloys are better than the commercial biomedical Ti‒50.8Ni alloys. The Ti‒Ni‒Cu alloys exhibit excellent antibacterial properties while maintaining the good cytocompatibility, which would further guarantee the potential application of Ti‒Ni‒Cu alloys as future biomedical implants and devices without inducing bacterial infections.

Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

NASA Astrophysics Data System (ADS)

Zhang, Liang; Fan, Xi-ying; Guo, Yong-huan; He, Cheng-wen

2014-05-01

Microstructures and fatigue life of SnAgCu and SnAgCu bearing nano-Al particles in QFP (Quad flat package) devices were investigated, respectively. Results show that the addition of nano-Al particles into SnAgCu solder can refine the microstructures of matrix microstructure. Moreover, the nano-Al particles present in the solder matrix, act as obstacles which can create a back stress, resisting the motion of dislocations. In QFP device, it is found that the addition of nano-Al particles can increase the fatigue life by 32% compared with the SnAgCu solder joints during thermal cycling loading.

Performance of ethanol electro-oxidation on Ni-Cu alloy nanowires through composition modulation.

PubMed

Tian, Xi-Ke; Zhao, Xiao-Yu; Zhang, Li-de; Yang, Chao; Pi, Zhen-Bang; Zhang, Su-Xin

2008-05-28

To reduce the cost of the catalyst for direct ethanol fuel cells and improve its catalytic activity, highly ordered Ni-Cu alloy nanowire arrays have been fabricated successfully by differential pulse current electro-deposition into the pores of a porous anodic alumina membrane (AAMs). The energy dispersion spectrum, scanning and transmission electron microscopy were utilized to characterize the composition and morphology of the Ni-Cu alloy nanowire arrays. The results reveal that the nanowires in the array are uniform, well isolated and parallel to each other. The catalytic activity of the nanowire electrode arrays for ethanol oxidation was tested and the binary alloy nanowire array possesses good catalytic activity for the electro-oxidation of ethanol. The performance of ethanol electro-oxidation was controlled by varying the Cu content in the Ni-Cu alloy and the Ni-Cu alloy nanowire electrode shows much better stability than the pure Ni one.

Superplastic formability of Al-Cu-Li alloy Weldalite (TM) 049

NASA Technical Reports Server (NTRS)

Ma, Bao-Tong; Pickens, Joseph R.

1991-01-01

Extensive research during the past decade shows that several aluminum lithium alloys can be processed to attain a microstructure that enables superplasticity. The high tensile stress of Al-Cu-Li alloy Weldalite (TM) 049 in the T4 and T6 tempers offers tremendous potential for attaining exceptional post-SPF (superplastic formability) properties. The used SPF material is Weldalite, which was shown to induce SPF behavior in other Al-Cu-Li alloys. The superplastic behavior and resulting post-SPF mechanical properties of this alloy, which was designed to be the next major structural alloy for space applications, were evaluated. The results indicate that Weldalite alloy does indeed exhibit excellent superplasticity over a wide range of temperatures and strain rates and excellent post-SPF tensile strength at various potential service temperatures.

Effects of Aging on the Evolution of Microstructure and Mechanical Properties of an Al - Li - Cu - Mg Alloy with Ag, Zr, Mn, and Zn Additives

NASA Astrophysics Data System (ADS)

Sun, Zhong-gang; Bao, Peng-li; Ma, Chao; Chen, Jie; Guo, Xuan; Li, Hua-guan; Ling, Juan

2016-03-01

The microstructure and the post-aging hardness of an Al - Li - Cu - Mg alloy is studied by the methods of transmission electron microscopy. Tensile tests are performed. The volume fraction and the size of the particles of the δ', S and T 1 phases are shown to be dependent on the aging temperature and time. The effect of the precipitates of the δ', S and T 1 phases on the hardening of the Al - Li - Cu - Mg alloy during aging is determined.

Interfacial microstructure and shear strength of reactive air brazed oxygen transport membrane ceramic-metal alloy joints

NASA Astrophysics Data System (ADS)

FR, Wahid Muhamad; Yoon, Dang-Hyok; Raju, Kati; Kim, Seyoung; Song, Kwang-sup; Yu, Ji Haeng

2018-01-01

To fabricate a multi-layered structure for maximizing oxygen production, oxygen transport membrane (OTM) ceramics need to be joined or sealed hermetically metal supports for interfacing with the peripheral components of the system. Therefore, in this study, Ag-10 wt% CuO was evaluated as an effective filler material for the reactive air brazing of dense Ce0.9Gd0.1O2-δ-La0.7Sr0.3MnO3±δ (GDC-LSM) OTM ceramics. Thermal decomposition in air and wetting behavior of the braze filler was performed. Reactive air brazing was performed at 1050 °C for 30 min in air to join GDC-LSM with four different commercially available high temperature-resistant metal alloys, such as Crofer 22 APU, Inconel 600, Fecralloy, and AISI 310S. The microstructure and elemental distribution of the ceramic-ceramic and ceramic-metal interfaces were examined from polished cross-sections. The mechanical shear strength at room temperature for the as-brazed and isothermally aged (800 °C for 24 h) joints of all the samples was compared. The results showed that the strength of the ceramic-ceramic joints was decreased marginally by aging; however, in the case of metal-ceramic joints, different decreases in strengths were observed according to the metal alloy used, which was explained based on the formation of different oxide layers at the interfaces.

Dendritic Ag-Fe nanocrystalline alloy synthesized by pulsed electrodeposition and its characterization

NASA Astrophysics Data System (ADS)

Santhi, Kalavathy; Revathy, T. A.; Narayanan, V.; Stephen, A.

2014-10-01

Synthesis of dendrite shaped Ag-Fe alloy nanomaterial by pulsed electrodeposition route was investigated. The alloy samples were deposited at different current densities from electrolytes of different compositions to study the influence of current density and bath composition on metal contents in the alloy, which was determined by ICP-OES analysis. The XRD studies were carried out to determine the structure of these samples. Magnetic characterization at room temperature and during heating was carried out to understand their magnetic behaviour and to confirm the inferences drawn from the XRD results. The XPS spectra proved the presence of Fe and Ag in the metallic form in the alloy samples. The FESEM and TEM micrographs were taken to view the surface morphology of the nanosized particles.

Chemical manipulation of phase stability and electronic behavior in Cu 4−x Ag x Se 2

DOE Office of Scientific and Technical Information (OSTI.GOV)

Olvera, A.; Bailey, T. P.; Uher, C.

Gradual stoichiometric chemical substitution of Cu by Ag in the p-type Cu 2 Se phase enables phase segregation and incremental switching of the electronic transport to n-type behavior for large Ag/Cu ratios.

Chemical manipulation of phase stability and electronic behavior in Cu 4−x Ag x Se 2

DOE PAGES

Olvera, A.; Bailey, T. P.; Uher, C.; ...

2018-01-01

Gradual stoichiometric chemical substitution of Cu by Ag in the p-type Cu 2 Se phase enables phase segregation and incremental switching of the electronic transport to n-type behavior for large Ag/Cu ratios.

Interfacial free energy controlling glass-forming ability of Cu-Zr alloys.

PubMed

Kang, Dong-Hee; Zhang, Hao; Yoo, Hanbyeol; Lee, Hyun Hwi; Lee, Sooheyong; Lee, Geun Woo; Lou, Hongbo; Wang, Xiaodong; Cao, Qingping; Zhang, Dongxian; Jiang, Jianzhong

2014-06-04

Glass is a freezing phase of a deeply supercooled liquid. Despite its simple definition, the origin of glass forming ability (GFA) is still ambiguous, even for binary Cu-Zr alloys. Here, we directly study the stability of the supercooled Cu-Zr liquids where we find that Cu64Zr36 at a supercooled temperature shows deeper undercoolability and longer persistence than other neighbouring compositions with an equivalent driving Gibbs free energy. This observation implies that the GFA of the Cu-Zr alloys is significantly affected by crystal-liquid interfacial free energy. In particular, the crystal-liquid interfacial free energy of Cu64Zr36 in our measurement was higher than that of other neighbouring liquids and, coincidently a molecular dynamics simulation reveals a larger glass-glass interfacial energy value at this composition, which reflects more distinct configuration difference between liquid and crystal phase. The present results demonstrate that the higher crystal-liquid interfacial free energy is a prerequisite of good GFA of the Cu-Zr alloys.

Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound

PubMed Central

Han, Seung Zeon; Lim, Sung Hwan; Kim, Sangshik; Lee, Jehyun; Goto, Masahiro; Kim, Hyung Giun; Han, Byungchan; Kim, Kwang Ho

2016-01-01

The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys. PMID:27488621

Structure and Mechanical Properties of Al-Cu-Fe-X Alloys with Excellent Thermal Stability.

PubMed

Školáková, Andrea; Novák, Pavel; Mejzlíková, Lucie; Průša, Filip; Salvetr, Pavel; Vojtěch, Dalibor

2017-11-05

In this work, the structure and mechanical properties of innovative Al-Cu-Fe based alloys were studied. We focused on preparation and characterization of rapidly solidified and hot extruded Al-Cu-Fe, Al-Cu-Fe-Ni and Al-Cu-Fe-Cr alloys. The content of transition metals affects mechanical properties and structure. For this reason, microstructure, phase composition, hardness and thermal stability have been investigated in this study. The results showed exceptional thermal stability of these alloys and very good values of mechanical properties. Alloying by chromium ensured the highest thermal stability, while nickel addition refined the structure of the consolidated alloy. High thermal stability of all tested alloys was described in context with the transformation of the quasicrystalline phases to other types of intermetallics.

Structure and Mechanical Properties of Al-Cu-Fe-X Alloys with Excellent Thermal Stability

PubMed Central

Školáková, Andrea; Novák, Pavel; Mejzlíková, Lucie; Průša, Filip; Salvetr, Pavel; Vojtěch, Dalibor

2017-01-01

In this work, the structure and mechanical properties of innovative Al-Cu-Fe based alloys were studied. We focused on preparation and characterization of rapidly solidified and hot extruded Al-Cu-Fe, Al-Cu-Fe-Ni and Al-Cu-Fe-Cr alloys. The content of transition metals affects mechanical properties and structure. For this reason, microstructure, phase composition, hardness and thermal stability have been investigated in this study. The results showed exceptional thermal stability of these alloys and very good values of mechanical properties. Alloying by chromium ensured the highest thermal stability, while nickel addition refined the structure of the consolidated alloy. High thermal stability of all tested alloys was described in context with the transformation of the quasicrystalline phases to other types of intermetallics. PMID:29113096

Electrodeposition of Zn and Cu-Zn alloy from ZnO/CuO precursors in deep eutectic solvent

NASA Astrophysics Data System (ADS)

Xie, Xueliang; Zou, Xingli; Lu, Xionggang; Lu, Changyuan; Cheng, Hongwei; Xu, Qian; Zhou, Zhongfu

2016-11-01

The electrodeposition of Zn and Cu-Zn alloy has been investigated in choline chloride (ChCl)/urea (1:2 molar ratio) based deep eutectic solvent (DES). Cyclic voltammetry study demonstrates that the reduction of Zn(II) to Zn is a diffusion-controlled quasi-reversible, one-step, two electrons transfer process. Chronoamperometric investigation indicates that the electrodeposition of Zn on a Cu electrode typically involves three-dimensional instantaneous nucleation with diffusion-controlled growth process. Micro/nanostructured Zn films can be obtained by controlling the electrodeposition potential and temperature. The electrodeposited Zn crystals preferentially orient parallel to the (101) plane. The Zn films electrodeposited under more positive potentials and low temperatures exhibit improved corrosion resistance in 3 wt% NaCl solution. In addition, Cu-Zn alloy films have also been electrodeposited directly from CuO-ZnO precursors in ChCl/urea-based DES. The XRD analysis indicates that the phase composition of the electrodeposited Cu-Zn alloy depends on the electrodeposition potential.

Development and Processing Improvement of Aerospace Aluminum Alloys

NASA Technical Reports Server (NTRS)

Lisagor, W. Barry; Bales, Thomas T.

2007-01-01

This final report, in multiple presentation format, describes a comprehensive multi-tasked contract study to improve the overall property response of selected aerospace alloys, explore further a newly-developed and registered alloy, and correlate the processing, metallurgical structure, and subsequent properties achieved with particular emphasis on the crystallographic orientation texture developed. Modifications to plate processing, specifically hot rolling practices, were evaluated for Al-Li alloys 2195 and 2297, for the recently registered Al-Cu-Ag alloy, 2139, and for the Al-Zn-Mg-Cu alloy, 7050. For all of the alloys evaluated, the processing modifications resulted in significant improvements in mechanical properties. Analyses also resulted in an enhanced understanding of the correlation of processing, crystallographic texture, and mechanical properties.

Refinement of the β-Sn Grains in Ni-Doped Sn-3.0Ag-0.5Cu Solder Joints with Cu-Based and Ni-Based Substrates

NASA Astrophysics Data System (ADS)

Chou, Tzu-Ting; Chen, Wei-Yu; Fleshman, Collin Jordon; Duh, Jenq-Gong

2018-03-01

A fine-grain structure with random orientations of lead-free solder joints was successfully obtained in this study. The Sn-Ag-Cu solder alloys doped with minor Ni were reflowed with Ni-based or Cu-based substrates to fabricate the joints containing different Ni content. Adding 0.1 wt.% Ni into the solder effectively promoted the formation of fine Sn grains, and reflowing with Ni-based substrates further enhanced the effects of β-Sn grain refinement. The crystallographic characteristics and the microstructures were analyzed to identify the solidification mechanism of different types of microstructure in the joints. The phase precipitating order in the joint altered as the solder composition were modified by elemental doping and changing substrate, which significantly affected the efficiency of grain refinement and the final grain structure. The formation mechanism of fine β-Sn grains in the Ni-doped joint with a Ni-based substrate is attributable to the heterogeneous nucleation by Ni, whereas the Ni in the joint using ChouCu-based substrate is consumed to form an intermetallic compound and thus retard the effect of grain refining.

Optimization of mechanical properties, biocorrosion properties and antibacterial properties of as-cast Ti-Cu alloys.

PubMed

Zhang, Erlin; Ren, Jing; Li, Shengyi; Yang, Lei; Qin, Gaowu

2016-10-21

Ti-Cu sintered alloys have shown good antibacterial abilities. However, the sintered method (powder metallurgy) is not convenient to produce devices with a complex structure. In this paper, Ti-Cu alloys with 2.0, 3.0 and 4.0 wt.% Cu were prepared in an arc melting furnace and subjected to different heat treatments: solid solution and ageing, to explore the possibility of preparing an antibacterial Ti-Cu alloy by a casting method and to examine the effect of Cu content. Phase identification was conducted on an XRD diffraction meter, and the microstructure was observed by a metallographic microscope, a scanning electron microscope (SEM) with energy disperse spectroscopy (EDS) and transmission electron microscopy (TEM). Microhardness and the compressive property of Ti-Cu alloys were tested, and the corrosion resistance and antibacterial activity were assessed in order to investigate the effect of the Cu content. Results showed that the as-cast Ti-Cu alloys exhibited a very low antibacterial rate against Staphylococcus aureus (S. aureus). Heat treatment improved the antibacterial rate significantly, especially after a solid and ageing treatment (T6). Antibacterial rates as high as 90.33% and 92.57% were observed on Ti-3Cu alloy and Ti-4Cu alloy, respectively. The hardness, the compressive yield strength, the anticorrosion resistance and the antibacterial rate of Ti-Cu alloys increased with an increase of Cu content in all conditions. It was demonstrated that homogeneous distribution and a fine Ti 2 Cu phase played a very important role in the mechanical property, anticorrosion and antibacterial properties. Furthermore, it should be pointed out that the Cu content should be at least 3 wt.% to obtain good antibacterial properties (>90% antibacterial rate) as well as satisfactory mechanical properties.

Electrochemical alloying of immiscible Ag and Co for their structural and magnetic analyses

NASA Astrophysics Data System (ADS)

Santhi, Kalavathy; Kumarsan, Dhanapal; Vengidusamy, Naryanan; Arumainathan, Stephen

2017-07-01

Electrochemical alloying of immiscible Ag and Co was carried out at different current densities from electrolytes of two different concentrations, after optimizing the electrolytic bath and operating conditions. The samples obtained were characterized using X-ray diffraction to confirm the simultaneous deposition of Ag and Co and to determine their crystallographic structure. The atomic percentage of Ag and Co contents in the granular alloy was determined by ICP-OES analysis. The XPS spectra were observed to confirm the presence of Ag and Co in the metallic form in the granular alloy samples. The micrographs observed using scanning and transmission electron microscopes threw light on the surface morphology and the size of the particles. The magnetic nature of the samples was analyzed at room temperature by a vibration sample magnetometer. Their magnetic phase transition while heating was also studied to provide further evidence for the magnetic behaviour and the structure of the deposits.

Wetting of TiC by Al-Cu alloys and interfacial characterization.

PubMed

Contreras, A

2007-07-01

The wetting behavior and the interfacial reactions that occurred between molten Al-Cu alloys (1, 4, 8, 20, 33, and 100 wt% Cu) and solid TiC substrates were studied by the sessile drop technique in the temperature range of 800-1130 degrees C. The effect of wetting behavior on the interfacial reaction layer was studied. All the Al-Cu alloys react with TiC at the interface forming an extensive reaction layer. The interface thickness varied with the samples, and depends on the temperature, chemical composition of the alloy and the time of the test. Wetting increases with increasing concentration of copper in the Al-Cu alloy at 800 and 900 degrees C. In contrast, at higher temperature such as 1000 degrees C wetting decreases with increasing copper content. The spreading kinetics and the work of adhesion were evaluated. The high values of activation energies indicated that spreading is not a simple viscosity controlled phenomenon but is a chemical reaction process. The spreading of the aluminum drop is observed to occur according to the formation of Al4C3, CuAl2O4, CuAl2, TiCux mainly, leading to a decreases in the contact angle. As the contact angle decreases the work of adhesion increases with increasing temperature. Al-Cu/TiC assemblies showed cohesive fracture corresponding to a strong interface. However, using pure Cu the adhesion work is poor, and the percentage of cohesion work is also too low (27-34%).

Production and processing of Cu-Cr-Nb alloys

NASA Technical Reports Server (NTRS)

Ellis, David L.; Michal, Gary M.; Orth, Norman W.

1990-01-01

A new Cu-based alloy possessing high strength, high conductivity, and good stability at elevated temperatures was recently produced. This paper details the melting of the master alloys, production of rapidly solidified ribbon, and processing of the ribbon to sheet by hot pressing and hot rolling.

Indentation creep behaviors of amorphous Cu-based composite alloys

NASA Astrophysics Data System (ADS)

Song, Defeng; Ma, Xiangdong; Qian, Linfang

2018-04-01

This work reports the indentation creep behaviors of two Si2Zr3/amorphous Cu-based composite alloys utilizing nanoindentation technique. By analysis with Kelvin model, the retardation spectra of alloys at different positions, detached and attached regions to the intermetallics, were deduced. For the indentation of detached regions to Si2Zr3 intermetallics in both alloys, very similarity in creep displacement can be observed and retardation spectra show a distinct disparity in the second retardation peak. For the indentation of detached regions, the second retardation spectra also display distinct disparity. At both positions, the retardation spectra suggest that Si elements may lead to the relatively dense structure in the amorphous matrix and to form excessive Si2Zr3 intermetallics which may deteriorate the plastic deformation of current Cu-based composite alloys.

Synthesis of polymer-stabilized monometallic Cu and bimetallic Cu/Ag nanoparticles and their surface-enhanced Raman scattering properties

NASA Astrophysics Data System (ADS)

Zhang, Danhui; Liu, Xiaoheng

2013-03-01

The present study demonstrates a facile process for the production of spherical-shaped Cu and Ag nanoparticles synthesized and stabilized by hydrazine and gelatin, respectively. Advantages of the synthetic method include its production of water dispersible copper and copper/silver nanoparticles at room temperature under no inert atmosphere. The resulting nanoparticles (copper or copper/silver) are investigated by X-ray diffraction (XRD), UV-vis spectroscopy, and transmission electron microscopy (TEM). The nanometallic dispersions were characterized by surface plasmon absorbance measuring at 420 and 572 nm for Ag and Cu nanoparticles, respectively. Transmission electron microscopy showed the formation of nanoparticles in the range of ˜10 nm (silver), and ˜30 nm (copper). The results also demonstrate that the reducing order of Cu2+/Ag+ is important for the formation of the bimetallic nanoparticles. The surface-enhanced Raman scattering effects of copper and copper/silver nanoparticles were also displayed. It was found that the enhancement ability of copper/silver nanoparticles was little higher than the copper nanoparticles.

Synthesis of Two-Electron Bimetallic Cu-Ag and Cu-Au Clusters by using [Cu13 (S2 CNn Bu2 )6 (C≡CPh)4 ]+ as a Template.

PubMed

Silalahi, Rhone P Brocha; Chakrahari, Kiran Kumarvarma; Liao, Jian-Hong; Kahlal, Samia; Liu, Yu-Chiao; Chiang, Ming-Hsi; Saillard, Jean-Yves; Liu, C W

2018-03-02

Atomically precise Cu-rich bimetallic superatom clusters have been synthesized by adopting a galvanic exchange strategy. [Cu@Cu 12 (S 2 CN n Bu 2 ) 6 (C≡CPh) 4 ][CuCl 2 ] (1) was used as a template to generate compositionally uniform clusters [M@Cu 12 (S 2 CN n Bu 2 ) 6 (C≡CPh) 4 ][CuCl 2 ], where M=Ag (2), Au (3). Structures of 1, 2 and 3 were determined by single crystal X-ray diffraction and the results were supported by ESI-MS. The anatomies of clusters 1-3 are very similar, with a centred cuboctahedral cationic core that is surrounded by six di-butyldithiocarbamate (dtc) and four phenylacetylide ligands. The doped Ag and Au atoms were found to preferentially occupy the centre of the 13-atom cuboctahedral core. Experimental and theoretical analyses of the synthesized clusters revealed that both Ag and Au doping result in significant changes in cluster stability, optical characteristics and enhancement in luminescence properties. © 2018 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Wetting and Interfacial Reactivity of Zn-Coated Steel Products with Cu-Si, Cu-Sn and Al-Si Filler Metals for Laser Brazing Application

NASA Astrophysics Data System (ADS)

Koltsov, Alexey; Cretteur, Laurent

2018-03-01

The laser brazing process is successfully applied in automotive industry for joining of roofs and hatchbacks of vehicles. The bad wetting of the brazing alloy during the process can lead to the formation of random external porosities which are not allowed on visible parts. This paper describes the wettability and reactivity mechanisms at short contact time of Cu and Al matrix brazing alloys with different reactive elements (Si, Sn) on different steel products such as hot-dip galvanized steels, galvannealed steel and bare steel. Wetting experiments were carried out by the dispensed drop technique. The effects of alloying elements and brazing alloy matrix on interfacial reactivity are discussed. It was found that Cu matrix containing 3 wt.% Si is the most favorable for short time liquid/solid adhesion relatively to the other studied brazing alloy compositions. The brazing ability of different steel products is well correlated with the wettability and interfacial reactivity results.

Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates

NASA Astrophysics Data System (ADS)

Liu, C. Y.; Wei, Y. S.; Lin, E. J.; Hsu, Y. C.; Tang, Y. K.

2016-12-01

Wetting reactions of pure Sn and Sn-Ag-Cu solder balls on Au(100 Å and 1000 Å)/Pd(500 Å)/Ni substrates were investigated. The (Au, Pd)Sn4 phase formed in the initial interfacial reaction between pure Sn and Au(100 Å and 1000 Å)/Pd(500 Å)/Ni substrates. Then, the initially formed (Au, Pd)Sn4 compound layer either dissolved or spalled into the molten Sn solder with 3 s of reflowing. The exposed Ni under-layer reacted with Sn solder and formed an interfacial Ni3Sn4 compound. We did not observe spalling compound in the Sn-Ag-Cu case, either on the thin Au (100 Å) or the thick Au (1000 Å) substrates. This implies that the Cu content in the Sn-Ag-Cu solder can efficiently suppress the spalling effect and really stabilize the interfacial layer. Sn-Ag-Cu solder has a better wetting than that of the pure Sn solder, regardless of the Au thickness of the Au/Pd/Ni substrate. For both cases of pure Sn and Sn-Ag-Cu, the initial wetting (<3-s reflowing) on the thin Au (100 Å) substrate is better than that of the thick Au (1000 Å) substrate. Over 3-s reflowing, the wetting on the thicker Au layer (1000 Å) substrate becomes better than the wetting on the thinner Au layer (100 Å) substrate.

Formation of Bi2Sr2CaCu2O x /Ag multifilamentary metallic precursor powder-in-tube wires

NASA Astrophysics Data System (ADS)

Zhang, Yun; Koch, Carl C.; Schwartz, Justin

2016-12-01

Previously, a metallic precursor (MP) approach to synthesizing Bi2Sr2CaCu2O x (Bi2212), with a homogeneous mixture of Bi, Sr, Ca, Cu and Ag was produced by mechanical alloying. Here, Bi2212/Ag round multifilamentary wire is manufactured using a metallic precursor powder-in-tube (MPIT) process. The MP powders were packed into a pure Ag tube in an Ar atmosphere and then sealed. After deformation, multifilamentary round wires and rolled tapes were heat treated in flowing oxygen through three stages: oxidation, conversion and partial-melt processing (PMP). Processing-microstructure-property relationships on 20-50 mm long multifilamentary round wires and rolled tapes were studied extensively. It is shown that conventional wire deformation processes, optimized for oxide-powder-in-tube wires, are not effective for deforming MPIT wires, and that as with prior studies of MPIT Bi2Sr2Ca2Cu3O y conductors, hot extrusion is required for obtaining a multifilamentary structure with fine filaments. As a result, the Bi2212 MPIT wires reported here have low engineering critical current density. Nonetheless, by focusing on sections of wires that remain intact after deformation, it is also shown that the first heat treatment stage, the oxidation stage, plays a crucial role in chemical homogeneity, phase transformation, and microstructural evolution and three reaction pathways for MP oxidation are presented. Furthermore, it is found the Bi2212 grain alignment within an MPIT filament is significantly different from that found in OPIT filaments after PMP, indicating the formation of highly dense filaments containing Bi2212 fine grains and Ag particles before PMP aids the formation of large, c-axis textured Bi2212 filaments during PMP. These results show that, with improved wire deformation, high critical current density may be obtained via a MPIT process.